43031-0002 Molex - Farnell Element 14 - Revenir à l'accueil

 

 

Branding Farnell element14 (France)

 

Farnell Element 14 :

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Ben Heck's PlayStation 4 Teardown Trailer

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3M E26, LED Lamps - The 14 Holiday Products of Newark element14 Promotion

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Tenma Soldering Station - The 14 Holiday Products of Newark element14 Promotion

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Duratool Screwdriver Kit - The 14 Holiday Products of Newark element14 Promotion

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Cubify 3D Cube - The 14 Holiday Products of Newark element14 Promotion

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Bud Boardganizer - The 14 Holiday Products of Newark element14 Promotion

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Raspberry Pi Starter Kit - The 14 Holiday Products of Newark element14 Promotion

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Fluke 323 True-rms Clamp Meter - The 14 Holiday Products of Newark element14 Promotion

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Ben Heck Time to Meet Your Maker Trailer

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Voltage Level Translation

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Microchip - 8-bit Wireless Development Kit

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 2 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 3 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 1 of 3

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Microchip - 8-bit Wireless Development Kit

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Texas Instruments - Digital Power Solutions

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Texas Instruments - Industrial Sensor Solutions

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Texas Instruments - Wireless Pen Input Demo (Mobile World Congress)

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Texas Instruments - TMS320C66x - Industry's first 10-GHz fixed/floating point DSP

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Texas Instruments - Stellaris Robot Chronos

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Ask Ben Heck - Connect Raspberry Pi to Car Computer

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Ben's Portable Raspberry Pi Computer Trailer

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Ben's Raspberry Pi Portable Computer Trailer 2

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Ben Heck's Pocket Computer Trailer

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Ask Ben Heck - Atari Computer

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Ben's Autodesk 123D Tutorial Trailer

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Autres documentations :

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This document was generated on 01/22/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 43031-0002 Status: Active Overview: Micro-Fit 3.0™ Connectors Description: Micro-Fit 3.0™ Crimp Terminal, Male, with Gold (Au) Plated Tin/Brass Alloy Contact, 20-24 AWG, Reel Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Product Specification PS-43045 (PDF) Product Literature (PDF) Test Summary TS-43045-002 (PDF) General Product Family Crimp Terminals Series 43031 Application Power Crimp Quality Equipment Yes Overview Micro-Fit 3.0™ Connectors Packaging Alternative 43031-0008 (Loose) Product Literature Order No 987650-5984 Product Name Micro-Fit 3.0™ UPC 800754369411 Physical Gender Male Material - Metal Phosphor Bronze Material - Plating Mating Gold Material - Plating Termination Tin Net Weight 0.061/g Packaging Type Reel Plating min - Mating 0.381μm Plating min - Termination 2.540μm Termination Interface: Style Crimp or Compression Wire Insulation Diameter 1.85mm max. Wire Size AWG 20, 22, 24 Wire Size mm² N/A Material Info Reference - Drawing Numbers Product Specification PS-43045, RPS-43045-003, RPS-43045-004 Sales Drawing SD-43031-**** Test Summary TS-43045-002 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 43031Series Mates With 43030 Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Extraction Tool 0011030043 Insertion Tool for Crimp Terminal 0638120800 Hand Crimp Tool 0638190000 FineAdjust™ Applicator for Insulation OD 1.30-1.85mm - 20-24 AWG 0639004500 FineAdjust™ Applicator for 0639018800 Insulation OD 1.10-1.30mm - 20-24 AWG FineAdjust™ Applicator for Insulation OD 0.91-1.09mm - 20-24 AWG 0639018900 T2 Terminator™ for insulation OD 1.30-1.85mm - 20-24 AWG 0639104500 T2 Terminator™ for insulation OD 1.10-1.30mm - 20-24 AWG 0639118800 T2 Terminator™ for insulation OD 0.91-1.09mm - 20-24 AWG 0639118900 This document was generated on 01/22/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 04/14/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 39-28-8060 Status: Active Overview: Mini-Fit Jr.™ Power Connectors Description: Mini-Fit® Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 6 Circuits, PA Polyamide Nylon 6/6 94V-0, Tin (Sn) Plating, without Drain Holes Documents: 3D Model Packaging Specification PK-5566-003 (PDF) Drawing (PDF) Test Summary TS-5556-002 (PDF) Product Specification PS-5556-001 (PDF) RoHS Certificate of Compliance (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family PCB Headers Series 5566 Application Power, Wire-to-Board Comments The 5566 header should be used with standard Mini- Fit® female terminals. If increased amperage of up to 13A per circuit is needed, please consider using the Mini-Fit® Plus HCS family 45750 terminals with 46015 headers; . See Molex Product specification PS-5666-001 for current de-rating information. Overview Mini-Fit Jr.™ Power Connectors Product Name Mini-Fit Jr.™ UPC 800753580732 Physical Breakaway No Circuits (Loaded) 6 Circuits (maximum) 6 Color - Resin Natural Durability (mating cycles max) 30 First Mate / Last Break No Flammability 94V-0 Glow-Wire Compliant No Guide to Mating Part No Keying to Mating Part None Lock to Mating Part Yes Material - Metal Brass Material - Plating Mating Tin Material - Plating Termination Tin Material - Resin Nylon Net Weight 1.778/g Number of Rows 2 Orientation Vertical PC Tail Length 3.50mm PCB Locator Yes PCB Retention None PCB Thickness - Recommended 1.60mm Packaging Type Bag Pitch - Mating Interface 4.20mm Pitch - Termination Interface 4.20mm Polarized to Mating Part Yes Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 5566Series Mates With 5557 Mini-Fit Jr.™ Receptacle Housing Polarized to PCB Yes Shrouded Fully Stackable No Surface Mount Compatible (SMC) No Temperature Range - Operating -40°C to +105°C Termination Interface: Style Through Hole Electrical Current - Maximum per Contact 9A Voltage - Maximum 600V Solder Process Data Duration at Max. Process Temperature (seconds) 5 Lead-free Process Capability Wave Capable (TH only) Max. Cycles at Max. Process Temperature 1 Process Temperature max. C 260 Material Info Old Part Number 5566-06A-210 Reference - Drawing Numbers Packaging Specification PK-5566-003 Product Specification PS-5556-001, RPS-5557-036, RPS-5557-058 Sales Drawing SD-5566-002 Test Summary TS-5556-002 This document was generated on 04/14/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION 1. General description The UHF EPCglobal Generation 2 standard allows the commercialized provision of mass adoption of UHF RFID technology for passive smart tags and labels. Main fields of applications are supply chain management and logistics for worldwide use with special consideration of European, US and Chinese frequencies to ensure that operating distances of several meters can be realized. The G2X is a dedicated chip for passive, intelligent tags and labels supporting the EPCglobal Class 1 Generation 2 UHF RFID standard. It is especially suited for applications where operating distances of several meters and high anti-collision rates are required. The G2X is a product out of the NXP Semiconductors UCODE product family. The entire UCODE product family offers anti-collision and collision arbitration functionality. This allows a reader to simultaneously operate multiple labels / tags within its antenna field. A UCODE G2X based label/ tag requires no external power supply. Its contact-less interface generates the power supply via the antenna circuit by propagative energy transmission from the interrogator (reader), while the system clock is generated by an on-chip oscillator. Data transmitted from interrogator to label/tag is demodulated by the interface, and it also modulates the interrogator’s electromagnetic field for data transmission from label/tag to interrogator. A label/tag can be operated without the need for line of sight or battery, as long as it is connected to a dedicated antenna for the targeted frequency range. When the label/tag is within the interrogator’s operating range, the high-speed wireless interface allows data transmission in both directions. In addition to the EPC specifications the G2X offers an integrated EAS (Electronic Article Surveillance) feature and read protection of the memory content. On top of the specification of the G2XL the G2XM offers 512-bit of user memory. SL3ICS1002/1202 UCODE G2XM and G2XL Rev. 3.8 — 11 November 2013 139038 Product data sheet COMPANY PUBLIC 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 2 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 2. Features and benefits 2.1 Key features  512-bit user memory (G2XM only)  240-bit of EPC memory  64-bit tag identifier (TID) including 32-bit unique serial number  Memory read protection  EAS (Electronic Article Surveillance) command  Calibrate command  32-bit kill password to permanently disable the tag  32-bit access password to allow a transition into the secured transmission state  Broad international operating frequency: from 840 MHz to 960 MHz  Long read/write ranges due to extremely low power design  Reliable operation of multiple tags due to advanced anti-collision  Forward link: 40-160 kbit/s  Return link: 40-640 kbit/s 2.2 Key benefits  High sensitivity provides long read range  Low Q-factor for consistent performance on different materials  Improved interference suppression for reliable operation in multi-reader environment  Large input capacitance for ease of assembly and high assembly yield  Highly advanced anti-collision resulting in highest identification speed  Reliable and robust RFID technology suitable for dense reader and noisy environments 2.3 Custom commands  EAS Alarm Enables the UHF RFID tag to be used as EAS tag without the need for a backend data base.  Read Protect Protects all memory content including CRC16 from unauthorized reading.  Calibrate Activates permanent back-scatter in order to evaluate the tag-to-reader performance. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 3 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 3. Applications  Supply chain management  Item level tagging  Asset management  Container identification  Pallet and case tracking  Product authentication Outside above mentioned applications, please contact NXP Semiconductors for support. 4. Ordering information Table 1. Ordering information G2XM Type number Package Name Description Version SL3ICS1002FUG/V7AF Wafer Bumped die on sawn wafer - SL3S1002FTB1 XSON3 plastic extremely thin small outline package;3 terminals; body 1 x 1.45 x 0,5 mm SOT1122 Table 2. Ordering information G2XL Type number Package Name Description Version SL3ICS1202FUG/V7AF Wafer Bumped die on sawn wafer - SL3S1202FTB1 XSON3 plastic extremely thin small outline package;3 terminals; body 1 x 1.45 x 0,5 mm SOT1122 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 4 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 5. Block diagram The SL3ICS1002/1202 IC consists of three major blocks: - Analog RF Interface - Digital Controller - EEPROM The analog part provides stable supply voltage and demodulates data received from the reader for being processed by the digital part. Further, the modulation transistor of the analog part transmits data back to the reader. The digital section includes the state machines, processes the protocol and handles communication with the EEPROM, which contains the EPC and the user data. Fig 1. Block diagram of G2X IC 001aai335 MOD DEMOD VREG VDD data in data out R/W ANALOG RF INTERFACE PAD PAD RECT DIGITAL CONTROL ANTENNA ANTICOLLISION READ/WRITE CONTROL ACCESS CONTROL EEPROM INTERFACE CONTROL RF INTERFACE CONTROL EEPROM MEMORY SEQUENCER CHARGE PUMP 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 5 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 6. Wafer layout and pinning information 6.1 Wafer layout (1) X-scribe line width: 56.4 m (2) Y-scribe line width: 56.4 m (3) Chip step, x-length: 488.0 m (4) Chip step, y-length: 470,0 m (5) Bump to bump distance X (TP1 - RFN): 351,0 m (6) Bump to bump distance Y (RFN - RFP): 333,0 m (7) Distance bump to metal sealring X: 40,3 m (8) Distance bump to metal sealring Y: 40,3 m Bump size X x Y: 60 m x 60 m Fig 2. Wafer layout and pinning information not to scale! 001aai346 (1) (7) (2) (8) (5) (6) (4) (3) Y X TP2 TP1 RFN RFP 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 6 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 7. Package outline Fig 3. Package outline SOT1122 Outline References version European projection Issue date IEC JEDEC JEITA SOT1122 MO-252 sot1122_po Unit mm max nom min 0.50 0.04 0.55 0.425 0.30 0.25 0.22 0.35 0.30 0.27 A(1) Dimensions Notes 1. Dimension A is including plating thickness. 2. Can be visible in some manufacturing processes. SOT1122 A1 D 1.50 1.45 1.40 1.05 1.00 0.95 E e e1 0.55 0.50 0.47 0.45 0.40 0.37 b b1 L L1 09-10-09 XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm D E e1 e A1 b1 L1 L e1 0 1 2 mm scale 3 1 2 b 4× (2) 4× (2) A pin 1 indication type code terminal 1 index area 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 7 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Table 3. Pin description of SOT1122 Symbol Pin Description RFP 1 Ungrouded antenna connector RFN 2 Grounded antenna connector n.c. 3 not connected Table 4. SOT1122 Marking Type Type code (Marking) Comment SL3S1202FTB1 UL UCODE G2XL SL3S1002FTB1 UM UCODE G2XM 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 8 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 8. Mechanical specification 8.1 Wafer specification See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”. 8.1.1 Wafer • Designation: each wafer is scribed with batch number and wafer number • Diameter: 200 mm (8”) • Thickness: 150 m ± 15 m • Number of pads 4 • Pad location: non diagonal/ placed in chip corners • Distance pad to pad RFN-RFP 333.0 μm • Distance pad to pad TP1-RFN: 351.0 μm • Process: CMOS 0.14 μm • Batch size: 25 wafers • Dies per wafer: 120.000 8.1.2 Wafer backside • Material: Si • Treatment: ground and stress release • Roughness: Ra max. 0.5 m, Rt max. 5 m 8.1.3 Chip dimensions • Die size without scribe: 0.414 mm x 0.432 mm = 0.178 mm2 • Scribe line width: x-dimension:56.4 m (width is measured on top metal layer) y-dimension: 56.4 m (width is measured on top metal layer) 8.1.4 Passivation on front • Type Sandwich structure • Material: PE-Nitride (on top) • Thickness: 1.75 m total thickness of passivation 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 9 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 8.1.5 Au bump • Bump material: > 99.9% pure Au • Bump hardness: 35 – 80 HV 0.005 • Bump shear strength: > 70 MPa • Bump height: 18 m • Bump height uniformity: – within a die: ± 2 m – within a wafer: ± 3 m – wafer to wafer: ± 4 m • Bump flatness: ± 1.5 m • Bump size: – RFP, RFN 60 x 60 m – TP1, TP2 60 x 60 m – Bump size variation: ± 5 m • Under bump metallization: sputtered TiW 8.1.6 Fail die identification No inkdots are applied to the wafer. Electronic wafer mapping (SECS II format) covers the electrical test results and additionally the results of mechanical/visual inspection. See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**” 8.1.7 Map file distribution See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**” 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 10 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 9. Limiting values [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. [3] For ESD measurement, the die chip has been mounted into a CDIP20 package. Table 5. Limiting values[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134) Voltages are referenced to RFN Symbol Parameter Conditions Min Max Unit Die Tstg storage temperature range -55 +125 C Toper operating temperature -40 +85 C VESD electrostatic discharge voltage Human body model [3] - 2 kV SOT1122 Tstg storage temperature range -55 +125 C Ptot total power dissipation - 30 mW Toper operating temperature -40 +85 C VESD electrostatic discharge voltage Human body model - 2 kV 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 11 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 10. Characteristics 10.1 Wafer characteristics [1] Power to process a Query command [2] Measured with a 50  source impedance [3] At minimum operating power [4] Values measured for a 40 kHz phase reserval command under matched conditions 10.2 Package characteristics [1] Measured with network analyzer at 915 MHz; values at 0.5 dBm after peakmax of on-set of die, measured in the center of the pads. Table 6. Wafer characteristics Symbol Parameter Conditions Min Typ Max Unit Memory characteristics tRET EEPROM data retention Tamb  55 C 50 - - year NWE EEPROM write endurance Tamb  55 C 100000 - - cycle Interface characteristics Ptot total power dissipation - 30 mW foper operating frequency 840 - 960 MHz Pmin minimum operating power supply [1][2] - -15 - dBm Ci input capacitance (parallel) [3] - 0.88 - pF Q quality factor (Im (Zchip) / Re (Zchip)) [3] - 9 - - Z impedance (915 MHz) - 22 - j195 -  - modulated jammer suppression 1.0 MHz [4] - - 4 - dB - unmodulated jammer suppression 1.0 MHz [4] - - 4 - dB Table 7. Package interface characteristics Symbol Parameter Conditions Min Typ Max Unit Interface characteristics SOT1122 Ci input capacitance (parallel) [1] - 1.02 - pF Z SOT1122 impedance (915 MHz) - 18.6 - j171.2 -  139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 12 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 11. Packing information 11.1 Wafer See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**”. 11.2 SOT1122 Part orientation T1. For details please refer to http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 13 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 12. Functional description 12.1 Power transfer The interrogator provides an RF field that powers the tag, equipped with a UCODE G2X. The antenna transforms the impedance of free space to the chip input impedance in order to get the maximum possible power for the G2X on the tag. The RF field, which is oscillating on the operating frequency provided by the interrogator, is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC. The antenna that is attached to the chip may use a DC connection between the two antenna pads. Therefore the G2X also enables loop antenna design. Possible examples of supported antenna structures can be found in the reference antenna design guide. 12.2 Data transfer 12.2.1 Reader to G2X Link An interrogator transmits information to the UCODE G2X by modulating an RF signal in the 840 MHz - 960 MHz frequency range. The G2X receives both information and operating energy from this RF signal. Tags are passive, meaning that they receive all of their operating energy from the interrogator's RF waveform. An interrogator is using a fixed modulation and data rate for the duration of at least an inventory round. It communicates to the G2X by modulating an RF carrier using DSB-ASK, SSB-ASK or PR-ASK with PIE encoding. For further details refer to Section 17, Ref. 1, section 6.3.1.2. Interrogator-to-tag (R=>T) communications. 12.2.2 G2X to reader Link An interrogator receives information from the UCODE G2X by transmitting a continuous-wave RF signal to the tag; the G2X responds by modulating the reflection coefficient of its antenna, thereby generating modulated sidebands used to backscatter an information signal to the interrogator. The system is a reader talks first (RTF) system, meaning that a G2X modulates its antenna reflection coefficient with an information signal only after being directed by the interrogator. G2X backscatter is a combination of ASK and PSK modulation depending on the tuning and bias point. The backscattered data is either modulated with FM0 baseband or Miller sub carrier. For further details refer to Section 17, Ref. 1, section 6.3.1.3. tag-to-interrogator (T=>R) communications. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 14 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 12.3 Operating distances RFID tags based on the UCODE G2X silicon may achieve maximum operating distances according the following formula: (1) (2) [1] CEPT/ETSI regulations [CEPT1], [ETSI1]. [2] New CEPT/ETSI regulations. [ETSI3]. [3] FCC 47 part 15 regulation [FCC1]. [4] These read distances are maximum values for general tags and labels. Practical usable values may be lower due to damping by object materials and environmental conditions. A special tag antenna design can help achieve higher values. The typical write range is > 50% of the read range. Table 8. Symbol description Symbol Description Unit Ptag minimum required RF power for the tag W Gtag gain of the tag antenna - EIRP transmitted RF power m  wavelength m Rmax maximum achieved operating distance for a /2-dipole m  loss factor assumed to be 0.5 considering matching and package losses - R distance m Table 9. Operating distances for UCODE G2X based tags and labels in released frequency bands Frequency range Region Available power Calculated read distance single antenna [4] Unit 868.4 to 868.65 MHz (UHF) Europe [1] 0.5 W ERP 3.6 m 865.5 to 867.6 MHz (UHF) Europe [2] 2 W ERP 7.1 m 902 to 928 MHz (UHF) America [3] 4 W EIRP 7.5 m Ptag EIRP Gtag  4R ----------  2 =    Rmax EIRP  Gtag  2 42Ptag = ---------------------------------------   139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 15 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 12.4 Air interface standards The G2X is certified according EPCglobal 1.0.9 and fully supports all parts of the "Specification for RFID Air Interface EPCglobal, EPCTM Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz - 960 MHz, Version 1.1.0". EPCglobal compliance and interoperability certification 􀀚􀀖􀀑􀀒􀀒􀀑􀀒􀀓􀀗􀀑􀀑􀀑􀀑􀀑􀀑􀀖􀀔􀀘 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 16 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 13. Physical layer and signaling 13.1 Reader to G2X communication 13.1.1 Physical layer For interrogator-to-G2X link modulation refer to Section 17, Ref. 1, annex H.1 Baseband waveforms, modulated RF, and detected waveforms. 13.1.2 Modulation An interrogator sends information to one or more G2X by modulating an RF carrier using double-sideband amplitude shift keying (DSB-ASK), single-sideband amplitude shift keying (SSB-ASK) or phase-reversal amplitude shift keying (PR-ASK) using a pulse-interval encoding (PIE) format. The G2X receives the operating energy from this same modulated RF carrier. Section 17, Ref. 1: Annex H, as well as chapter 6.3.1.2.2. The G2X is capable of demodulating all three modulation types. 13.1.3 Data encoding The R=>T link is using PIE. For the definition of the therefore relevant reference time interval for interrogator-to-chip signaling (Tari) refer to Section 17, Ref. 1, chapter 6.3.1.2.3. The Tari is specified as the duration of a data-0. 13.1.4 Data rates Interrogators shall communicate using Tari values between 6.25 s and 25 s, inclusive. For interrogator compliance evaluation the preferred Tari values of 6.25 s, 12.5 s or 25 s should be used. For further details refer to Section 17, Ref. 1, chapter 6.3.1.2.4. 13.1.5 RF envelope for R=>T A specification of the relevant RF envelope parameters can be found in Section 17, Ref. 1, chapter 6.3.1.2.5. 13.1.6 Interrogator power-up/down waveform For a specification of the interrogator power-up and power-down RF envelope and waveform parameters refer to Section 17, Ref. 1, chapters 6.3.1.2.6 and 6.3.1.2.7. 13.1.7 Preamble and frame-sync An interrogator shall begin all R=>T signaling with either a preamble or a frame-sync. A preamble shall precede a Query command and denotes the start of an inventory round. For a definition and explanation of the relevant R=>T preamble and frame-sync refer to Section 17, Ref. 1, chapter 6.3.1.2.8. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 17 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 13.2 G2X to reader communication An interrogator receives information from a G2X by transmitting an unmodulated RF carrier and listening for a backscattered reply. The G2X backscatters by switching the reflection coefficient of its antenna between two states in accordance with the data being sent. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3. 13.2.1 Modulation The UCODE G2X communicates information by backscatter-modulating the amplitude and/or phase of the RF carrier. Interrogators shall be capable of demodulating either demodulation type. 13.2.2 Data encoding The encoding format, selected in response to interrogator commands, is either FM0 baseband or Miller-modulated subaltern. The interrogator commands the encoding choice 13.2.2.1 FM0 baseband FM0 inverts the baseband phase at every symbol boundary; a data-0 has an additional mid-symbol phase inversion. For details on FM0 and generator state diagram, FM0 symbols and sequences and how FM0 transmissions should be terminated refer to Section 17, Ref. 1, chapter 6.3.1.3. 13.2.2.2 FM0 Preamble T=>R FM0 signaling begin with one of two defined preambles, depending on the value of the TRext bit specified in the Query command that initiated the inventory round. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3. 13.2.2.3 Miller-modulated sub carrier Baseband Miller inverts its phase between two data-0s in sequence. Baseband Miller also places a phase inversion in the middle of a data-1 symbol. For details on Miller-modulated sub carrier, generator state diagram, sub carrier sequences and terminating sub carrier transmissions refer to Section 17, Ref. 1, chapter 6.3.1.3. 13.2.2.4 Miller sub carrier preamble T=>R sub carrier signaling begins with one of the two defined preambles. The choice depends on the value of the TRext bit specified in the Query command that initiated the inventory round. For further details refer to Section 17, Ref. 1, chapter 6.3.1.3. 13.2.3 Data rates The G2X IC supports tag to interrogator data rates and link frequencies as specified in Section 17, Ref. 1, chapter 6.3.1.3. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 18 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 13.3 Link timing For the interrogator interacting with a UCODE G2X equipped tag population exact link and response timing requirements must be fulfilled, which can be found in Section 17, Ref. 1, chapter 6.3.1.6. 13.3.1 Regeneration time The regeneration time is the time required if a G2X is to demodulate the interrogator signal, measured from the last falling edge of the last bit of the G2X response to the first falling edge of the interrogator transmission. This time is referred to as T2 and can vary between 3.0 Tpri and 20 Tpri. For a more detailed description refer to Section 17, Ref. 1, chapter 6.3.1.6. 13.3.2 Start-up time For a detailed description refer to Section 17, Ref. 1, chapter 6.3.1.3.4. 13.3.3 Persistence time An interrogator chooses one of four sessions and inventories tags within that session (denoted S0, S1, S2, and S3). The interrogator and associated UCODE G2X population operate in one and only one session for the duration of an inventory round (defined above). For each session, a corresponding inventoried flag is maintained. Sessions allow tags to keep track of their inventoried status separately for each of four possible time-interleaved inventory processes, using an independent inventoried flag for each process. Two or more interrogators can use sessions to independently inventory a common UCODE G2X chip population. A session flag indicates whether a G2X may respond to an interrogator. G2X chips maintain a separate inventoried flag for each of four sessions; each flag has symmetric A and B values. Within any given session, interrogators typically inventory tags from A to B followed by a re-inventory of tags from B back to A (or vice versa). Additionally, the G2X has implemented a selected flag, SL, which an interrogator may assert or deassert using a Select command. For a description of Inventoried flags S0 – S3 refer to Section 17, Ref. 1 chapter 6.3.2.2 and for a description of the Selected flag refer to Section 17, Ref. 1, chapter 6.3.2.3. For tag flags and respective persistence time refer to Section 17, Ref. 1, table 6.14. 13.4 Bit and byte ordering The transmission order for all R=>T and T=>R communications respects the following conventions: • within each message, the most-significant word is transmitted first, and • within each word, the most-significant bit (MSB) is transmitted first, whereas one word is composed of 16 bits. To represent memory addresses and mask lengths EBV-8 values are used. An extensible bit vector (EBV) is a data structure with an extensible data range. For a more detailed explanation refer to Section 17, Ref. 1, Annex A. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 19 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 13.5 Data integrity The G2X ignores invalid commands. In general, "invalid" means a command that (1) is incorrect given the current the G2X state, (2) is unsupported by the G2X, (3) has incorrect parameters, (4) has a CRC error, (5) specifies an incorrect session, or (6) is in any other way not recognized or not executable by the G2X. The actual definition of "invalid" is state-specific and defined, for each G2X state, in n Section 17, Ref. 1 Annex B and Annex C. All UCODE G2X backscatter error codes are summarized in Section 17, Ref. 1 Error codes, Annex I. For a detailed description of the individual backscatter error situations which are command specific please refer to the Section 17, Ref. 1 individual command description section 6.3.2.10. 13.6 CRC A CRC-16 is a cyclic-redundancy check that an interrogator uses when protecting certain R=>T commands, and the G2X uses when protecting certain backscattered T=>R sequences. To generate a CRC-16 an interrogator or the G2X first generates the CRC-16 precursor shown in Section 17, Ref. 1 Table 6.11, then take the ones-complement of the generated precursor to form the CRC-16. For a detailed description of the CRC-16 generation and handling rules refer to Section 17, Ref. 1, chapter 6.3.2.1. The CRC-5 is only used to protect the Query command (out of the mandatory command set). It is calculated out of X5 + X3 + 1. For a more detailed CRC-5 description refer to Section 17, Ref. 1, table 6.12. For exemplary schematic diagrams for CRC-5 and CRC-16 encoder/decoder refer to Section 17, Ref. 1, Annex F. For a CRC calculation example refer to Section 15.1, Table 27 and Table 28. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 20 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14. TAG selection, inventory and access This section contains all information including commands by which a reader selects, inventories, and accesses a G2X population An interrogator manages UCODE G2X equipped tag populations using three basic operations. Each of these operations comprises one or more commands. The operations are defined as follows Select: The process by which an interrogator selects a tag population for inventory and access. Interrogators may use one or more Select commands to select a particular tag population prior to inventory. Inventory: The process by which an interrogator identifies UCODE G2X equipped tags. An interrogator begins an inventory round by transmitting a Query command in one of four sessions. One or more G2X may reply. The interrogator detects a single G2X reply and requests the PC, EPC, and CRC-16 from the chip. An inventory round operates in one and only one session at a time. For an example of an interrogator inventorying and accessing a single G2X refer to Section 17, Ref. 1, Annex E. Access: The process by which an interrogator transacts with (reads from or writes to) individual G2X. An individual G2X must be uniquely identified prior to access. Access comprises multiple commands, some of which employ one-time-pad based cover-coding of the R=>T link. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 21 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.1 G2X Memory For the general memory layout according to the standard Section 17, Ref. 1, refer to Figure 6.17. The tag memory is logically subdivided into four distinct banks. In accordance to the standard Section 17, Ref. 1, section 6.3.2.1. The tag memory of the SL3ICS1002 G2XM is organized in following 4 memory sections: The logical address of all memory banks begin at zero (00h). Table 10. G2X memory sections Name Size Bank Reserved memory (32 bit ACCESS and 32 bit KILL password) 64 bit 00b EPC (excluding 16 bit CRC-16 and 16 bit PC) 240 bit 01b TID (including unique 32 bit serial number) 64 bit 10b User memory (G2XM only) 512 bit 11b Fig 4. G2X TID memory structure Serial Number Model Number Mask-Designer Identifier Class Identifier TID 0 31 0 11 0 11 0 7 3Fh 20h 1Fh 14h 13h 08h 07h 00h 0 6 0 4 1Fh 19h 18h 14h Version Number Sub Version Number 00000001h to FFFFFFFFh 006h E2h Whenever the 32 bit serial is exceeded the sub version is incremented by 1 Addresses 3Fh 00h Addresses Addresses Bits Bits LS Byte LSBit MSBit LSBit MSBit MS Byte LSBit MSBit LSBit MSBit 0000010b 00000b Sub Version Nr Version (Silicon) Nr Model Nr. Mask ID UCode EPC G2XM 00000b 0000011b 003h 006h UCode EPC G2XL 00000b 0000100b 004h 006h 002h 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 22 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.1.1 Memory map [1] This is the initial memory content when delivered by NXP Semiconductors [2] G2XL: HEX 3005 FB63 AC1F 3841 EC88 0467 G2XM: HEX 3005 FB63 AC1F 3681 EC88 0468 [3] only G2XM Table 11. Memory map Bank address Memory address Type Content Initial [1] Remark Bank 00 00h – 1Fh Reserved kill password: refer to Section 17, Ref. 1, chapter 6.3.2.1.1 all 00h unlocked memory 20h – 3Fh Reserved access password: refer to Section 17, Ref. 1, chapter 6.3.2.1.1 all 00h unlocked memory Bank 01 00h – 0Fh EPC CRC-16: refer to Section 17, Ref. 1, chapter 6.3.2.1.2 memory mapped calculated CRC 10h – 14h EPC Backscatter length: refer to Section 17, Ref. 1, chapter 6.3.2.1.2 00110b unlocked memory 15h EPC Reserved for future use: refer to Section 17, Ref. 1, chapter 6.3.2.1.2 0b unlocked memory 16h EPC Reserved for future use: refer to Section 17, Ref. 1, chapter 6.3.2.1.2 0b hardwired to 0 17h –1Fh EPC Numbering system indicator: refer to Section 17, Ref. 1, chapter 6.3.2.1.2 00h unlocked memory 20h - 10Fh EPC EPC: refer to Section 17, Ref. 1, chapter 6.3.2.1.2 [2] unlocked memory Bank 10 00h – 07h TID allocation class identifier: refer to Section 17, Ref. 1, chapter 6.3.2.1.3 1110 0010b locked memory 08h – 13h TID tag mask designer identifier: refer to Section 17, Ref. 1, chapter 6.3.2.1.3 0000 0000 0110b locked memory 14h – 1Fh TID tag model number: refer to Section 17, Ref. 1, chapter 6.3.2.1.3 TMNR locked memory 20h – 3Fh TID serial number: refer to [Section 17, Ref. 1, chapter 6.3.2.1.3 SNR locked memory Bank 11[3] 00h – 1FFh User user memory: refer to [Section 17, Ref. 1, chapter 6.3.2.1.4 undefined unlocked memory 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 23 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.1.1.1 User memory (only G2XM) The User Memory bank contains a sequential block of 512 bits (32 words of 16 bit) ranging from address 00h to 1Fh. The user memory can be accessed via Select, Read or Write command and it may be write locked, permanently write locked, unlocked or permanently unlocked. In addition reading of not only of the User Memory but of the whole memory including EPC and TID can be protected by using the custom ReadProtect command. 14.1.1.2 Special behavior of user memory address 1Fh WRITE or SELECT of user memory address 1Fh will falsely set an error flag. This will affect the subsequent READ or SELECT. The following commands will falsely set an internal error flag (without actually causing an error): 1) WRITE to user memory with WordPtr=1Fh 2) SELECT to user memory with compare mask ending at bitaddress 1FFh (e.g. Pointer=1FEh, length=1 or Pointer=1FDh, length=2 …) Note: The error flag is set independent of the chip state (also chips in the e.g. Ready state are affected). The falsely set error flag will affect the following sub sequential commands: A) READ command with WordCount=0 falsely responds with "memory overrun" error B) SELECT command with Length<>0  falsely assumes non existing memory location The behavior can be avoided with: • Turning off the RF carrier to reset the chip (This is what readers typically do!). • Using the READ command with WordCount<>0. • Sending other command prior to READ or SELECT (e.g. WRITE to address<>1Fh, ReqRN) or executing READ or SELECT two times. Remark: The WRITE operation itself is not affected by this problem i.e. data is written properly! With commercially available readers this behavior is typically not observed. 14.1.1.3 Supported EPC types The EPC types are defined in the EPC Tag Standards document from EPCglobal. These standards define completely that portion of EPC tag data that is standardized, including how that data is encoded on the EPC tag itself (i.e. the EPC Tag Encodings), as well as how it is encoded for use in the information systems layers of the EPC Systems Network (i.e. the EPC URI or Uniform Resource Identifier Encodings). The EPC Tag Encodings include a Header field followed by one or more Value Fields. The Header field indicates the length of the Values Fields and contains a numbering system identifier (NSI). The Value Fields contain a unique EPC Identifier and optional Filter Value when the latter is judged to be important to encode on the tag itself. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 24 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.2 Sessions, selected and inventoried flags Session, Selected and Inventory Flags are according the EPCglobal standard. For a description refer to Section 17, Ref. 1, section 6.3.2.3. 14.2.1 G2X States and slot counter For a description refer to Section 17, Ref. 1, section 6.3.2.4. 14.2.2 G2X State Diagram The tag state are according the EPCglobal standard please refer to: Section 17, Ref. 1, section 6.3.2.4 Tag states and slot counter. A detailed tag state diagram is shown in Section 17, Ref. 1, figure 6.19. Refer also to Section 17, Ref. 1, Annex B for the associated state-transition tables and to Section 17, Ref. 1, Annex C for the associated command-response tables. 14.3 Managing tag populations For a detailed description on how to manage an UCODE G2X tag populations refer to Section 17, Ref. 1, chapter 6.3.2.6. 14.4 Selecting tag populations For a detailed description of the UCODE G2X tag population selection process refer to Section 17, Ref. 1, section 6.3.2.7. 14.5 Inventorying tag populations For a detailed description on accessing individual tags based on the UCODE G2X refer to Section 17, Ref. 1, section 6.3.2.8. 14.6 Accessing individual tags For a detailed description on accessing individual tags based on the UCODE G2X refer to Section 17, Ref. 1, section 6.3.2.9. An example inventory and access of a single UCODE G2X tag is shown in Section 17, Ref. 1, Annex E.1. 14.7 Interrogator commands and tag replies For a detailed description refer to Section 17, Ref. 1, section 6.3.2.10. 14.7.1 Commands An overview of interrogator to tag commands is located in Section 17, Ref. 1, Table 6.16. Note that all mandatory commands are implemented on the G2X according to the standard. Additionally the optional command Access is supported by the G2X (for details refer to Section 14.11 “Optional Access Command”). Besides also custom commands are implemented on the G2X (for details refer to Section 14.12 “Custom Commands”. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 25 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.7.2 State transition tables The G2X responses to interrogator commands are defined by State Annex B transition tables in Section 17, Ref. 1. Following states are implemented on the G2X: • Ready, for a description refer to Section 17, Ref. 1, Annex B.1. • Arbitrate, for a description refer to Section 17, Ref. 1, Annex B.2. • Reply, for a description refer to Section 17, Ref. 1, Annex B.3. • Acknowledged, for a description refer to Section 17, Ref. 1, Annex B.4. • Open, for a description refer to Section 17, Ref. 1, Annex B.5. • Secured, for a description refer to Section 17, Ref. 1, Annex B.6. • Killed, for a description refer to Section 17, Ref. 1, Annex B.7. 14.7.3 Command response tables The G2X responses to interrogator commands are described in following Annex C sections of Section 17, Ref. 1: • Power-up, for a description refer to Section 17, Ref. 1, Annex C.1. • Query, for a description refer to Section 17, Ref. 1, Annex C.2. • QueryRep, for a description refer to Section 17, Ref. 1, Annex C.3. • QueryAdjust, for a description refer to Section 17, Ref. 1, Annex C.4. • ACK, for a description refer to Section 17, Ref. 1, Annex C.5. • NAK, for a description refer to Section 17, Ref. 1, Annex C.6. • Req_RN, for a description refer to Section 17, Ref. 1, Annex C.7. • Select, for a description refer to Section 17, Ref. 1, Annex C.8. • Read, for a description refer to Section 17, Ref. 1, Annex C.9. • Write, for a description refer to Section 17, Ref. 1, Annex C.10. • Kill, for a description refer to Section 17, Ref. 1, Annex C.11. • Lock, for a description refer to Section 17, Ref. 1, Annex C.12. • Access, for a description refer to Section 17, Ref. 1, Annex C.13. • T2 time-out, for a description refer to Section 17, Ref. 1, Annex C.17. • Invalid command, for a description refer to Section 17, Ref. 1, Annex C.18. 14.7.4 Example data-flow exchange For data flow-exchange examples refer to Section 17, Ref. 1, Annex K: • K.1 Overview of the data-flow exchange • K.2 Tag memory contents and lock-field values • K.3 Data-flow exchange and command sequence 14.8 Mandatory Select Commands Select commands select a particular UCODE G2X tag population based on user-defined criteria. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 26 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.8.1 Select For a detailed description of the mandatory Select command refer to Section 17, Ref. 1, section 6.3.2.10. 14.9 Mandatory Inventory Commands Inventory commands are used to run the collision arbitration protocol. 14.9.1 Query For a detailed description of the mandatory Query command refer to Section 17, Ref. 1, section 6.3.2.10. 14.9.2 QueryAdjust For a detailed description of the mandatory QueryAdjust command refer to Section 17, Ref. 1, section 6.3.2.10. 14.9.3 QueryRep For a detailed description of the mandatory QueryRep command refer to Section 17, Ref. 1, section 6.3.2.10. 14.9.4 ACK For a detailed description of the mandatory ACK command refer to Section 17, Ref. 1, section 6.3.2.10. 14.9.5 NAK For a detailed description of the mandatory NAK command refer to Section 17, Ref. 1, section 6.3.2.10. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 27 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.10 Mandatory Access Commands Access commands are used to read or write data from or to the G2X memory. For a detailed description of the mandatory Access command refer to Section 17, Ref. 1, section 6.3.2.10. 14.10.1 REQ_RN Access commands are used to read or write data from or to the G2X memory. For a detailed description of the mandatory Access command refer to Section 17, Ref. 1, section 6.3.2.10. 14.10.2 READ For a detailed description of the mandatory Req_RN command refer to Section 17, Ref. 1, section 6.3.2.10. 14.10.3 WRITE For a detailed description of the mandatory Write command refer to Section 17, Ref. 1, section 6.3.2.10. 14.10.4 KILL For a detailed description of the mandatory Kill command refer to Section 17, Ref. 1, section 6.3.2.10. 14.10.5 LOCK For a detailed description of the mandatory Lock command refer to Section 17, Ref. 1, section 6.3.2.10. 14.11 Optional Access Command 14.11.1 Access For a detailed description of the optional Access command refer to Section 17, Ref. 1, section 6.3.2.10. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 28 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.12 Custom Commands 14.12.1 ReadProtect The G2X ReadProtect custom command enables reliable read protection of the entire G2X memory. Executing ReadProtect from the Secured state will set the ReadProtect-bit to '1'. With the ReadProtect-Bit set the G2X will continue to work unaffected but fail its content. Following commands will be disabled: Read, Write, Kill, Lock, Access, ReadProtect, ChangeEAS, EAS Alarm and Calibrate. The G2X will only react upon an anticollision with Select, Query, QueryRep, QueryAdjust, ACK (no truncated reply), NAK, ReqRN but reply with zeros as EPC and CRC-16 content (except PC/password). ACK will return zeros except for the PC. The read protection can be removed by executing Reset ReadProtect. The ReadProtect-Bit will than be cleared. Devices whose access password is zero will ignore the command. A frame-sync must be prepended the command. After sending the ReadProtect command an interrogator shall transmit CW for the lesser of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect command and the backscattered reply. An interrogator may observe three possible responses after sending a ReadProtect, depending on the success or failure of the operation: • ReadProtect succeeds: After completing the ReadProtect the G2X shall backscatter the reply shown in Table 14 comprising a header (a 0-bit), the tag's handle, and a CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2X will render itself to this ReadProtect mode. If the interrogator observes this reply within 20 ms then the ReadProtect completed successfully. • The G2X encounters an error: The G2X will backscatter an error code during the CW period rather than the reply shown in the EPCglobal Spec (see Annex I for error-code definitions and for the reply format). • ReadProtect does not succeed: If the interrogator does not observe a reply within 20 ms then the ReadProtect did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2X is still in the interrogation zone, and may re-initiate the ReadProtect command. The G2X reply to the ReadProtect command will use the extended preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the Query that initiated the round. Table 12. ReadProtect command Command RN CRC-16 # of bits 16 16 16 description 11100000 00000001 handle - 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 29 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Table 13. G2X reply to a successful ReadProtect procedure Header RN CRC-16 # of bits 1 16 16 description 0 handle - Table 14. ReadProtect command-response table Starting State Condition Response Next State ready all – ready arbitrate, reply, acknowledged all – arbitrate open all - open secured valid handle & invalid access password – arbitrate valid handle & valid non zero access password Backscatter handle, when done secured invalid handle – secured killed all – killed 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 30 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.12.2 Reset ReadProtect Reset ReadProtect allows an interrogator to resets the ReadProtect-bit and re-enables reading of the G2X memory content according the EPCglobal specification. The G2X will execute Reset ReadProtect from the Open or Secured states. If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16 and a valid handle but an incorrect access password, it will not reply and transit to the Arbitrate state. If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16 and a valid handle but the ReadProtect-Bit is not set ('0'), it will not change the ReadProtect-Bit but backscatter the reply shown in Table 17. If a G2X in the Open or Secured receives a Reset ReadProtect with a valid CRC-16 but an invalid handle, or it receives a Reset ReadProtect before which the immediately preceding command was not a Req_RN, it will ignore the Reset ReadProtect and remain in its current state. A frame-sync must be prepended the Reset ReadProtect command. After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of TReply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect command and the G2X backscattered reply. An interrogator may observe three possible responses after sending a Reset ReadProtect, depending on the success or failure of the operation: • Write succeeds: After completing the Reset ReadProtect a G2X will backscatter the reply shown in Table 17 comprising a header (a 0-bit), the handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply within 20 ms then the Reset ReadProtect completed successfully. • The G2X encounters an error: The G2X will backscatter an error code during the CW period rather than the reply shown in Table 17 (see EPCglobal Spec for error-code definitions and for the reply format). • Write does not succeed: If the interrogator does not observe a reply within 20 ms then the Reset ReadProtect did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2X is still in the interrogation zone, and may reissue the Reset ReadProtect command. The G2X reply to the Reset ReadProtect command will use the extended preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2X will reply as if TRext=1 regardless of the TRext value in the Query that initiated the round. The Reset ReadProtect command is structured as following: • 16 bit command • Password: 32 bit Access-Password XOR with 2 times current RN16 • 16 bit handle • CRC-16 calculate over the first command-code bit to the last handle bit 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 31 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Table 15. Reset ReadProtect command Command Password RN CRC-16 # of bits 16 32 16 16 description 11100000 00000010 (access password)  2*RN16 handle - Table 16. G2X reply to a successful Reset ReadProtect command Header RN CRC-16 # of bits 1 16 16 description 0 handle - Table 17. Reset ReadProtect command-response table Starting State Condition Response Next State ready all – ready arbitrate, reply, acknowledged all – arbitrate open ReadProtect bit is set, valid handle & valid access password Backscatter handle, when done open ReadProtect bit is set, valid handle & invalid access password – arbitrate ReadProtect bit is set, invalid handle – open ReadProtect bit is reset – open secured ReadProtect bit is set, valid handle & valid access password Backscatter handle, when done secured ReadProtect bit is set, valid handle & invalid access password – arbitrate ReadProtect bit is set, invalid handle – secured ReadProtect bit is reset – secured killed all – killed 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 32 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.12.3 ChangeEAS A G2X equipped RFID tag can be enhanced by a stand-alone operating EAS alarm feature. With an EAS-Alarm bit set to '1' the tag will reply to an EAS_Alarm command by backscattering a 64 bit alarm code without the need of a Select or Query. The EAS is a built-in solution so no connection to a backend database is required. As it is a custom command no Select or Query is required to detect the EAS state enabling fast, reliable and offline article surveillance. ChangeEAS can be executed from the Secured state only. The command will be ignored if the Access Password is zero, the command will also be ignored with an invalid CRC-16 or an invalid handle, the G2X will than remain in the current state. The CRC-16 is calculated from the first command-code bit to the last handle bit. A frame-sync must be prepended the command. The G2X reply to a successful ChangeEAS will use the extended preamble, as appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the Query that initiated the round. After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or 20 ms, where TReply is the time between the interrogator's ChangeEAS command and the G2X backscattered reply. An interrogator may observe three possible responses after sending a ChangeEAS, depending on the success or failure of the operation • Write succeeds: After completing the ChangeEAS a G2X will backscatter the reply shown in Table 20 comprising a header (a 0-bit), the handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply within 20 ms then the ChangeEAS completed successfully. • The G2X encounters an error: The G2X will backscatter an error code during the CW period rather than the reply shown in Table 20 (see EPCglobal Spec for error-code definitions and for the reply format). • Write does not succeed: If the interrogator does not observe a reply within 20 ms then the ChangeEAS did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2X is still in the interrogator's field, and may reissue the ChangeEAS command. Upon receiving a valid ChangeEAS command a G2X will perform the commanded set/reset operation of the EAS_Alarm-Bit. If EAS-Bit is set, the EAS_Alarm command will be available after the next power up and reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be ignored. Table 18. ChangeEAS command Command ChangeEas RN CRC-16 # of bits 16 1 16 16 description 11100000 00000011 1 ... set EAS system bit 0 ... reset EAS system bit handle 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 33 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Table 19. G2X reply to a successful ChangeEAS command Header RN CRC-16 # of bits 1 16 16 description 0 handle - Table 20. ChangeEAS command-response table Starting State Condition Response Next State ready all – ready arbitrate, reply, acknowledged all – arbitrate open all – open secured valid handle Backscatter handle, when done secured invalid handle – secured killed all – killed Starting State Condition Response Next State 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 34 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.12.4 EAS_Alarm EAS_Alarm is a custom command causing the G2X to immediately backscatter an EAS-Alarmcode, when EAS ALARM bit is set without any delay caused by Select, Query and without the need for a backend database. The EAS feature of the G2X is available after enabling it by sending a ChangeEAS command described in Section 14.12.3 “ChangeEAS”. With an EAS-Alarm bit set to '1' the G2X will reply to an EAS_Alarm command by backscattering a fixed 64 bit alarm code. A G2X will reply to an EAS_Alarm command from the ready state only. If the EAS-Alarm bit is reset ('0') by sending a ChangeEAS command in the password protected Secure state the G2X will not reply to an EAS_Alarm command. The EAS_Alarm command is structured as following: • 16 bit command • 16 bit inverted command • DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec. 6.3.1.2.8 and Table 6.9. • M (cycles per symbol) sets the T=>R data rate and modulation format as shown in EPCglobal Spec. Table 6.10. • TRext chooses whether the T=>R preamble is prepended with a pilot tone as described in EPCglobal Spec. 6.3.1.3. A preamble must be prepended the EAS_Alarm command according EPCglobal Spec, 6.3.1.2.8. Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate the CRC5 over the backscattered 64 bits received to verify the received code. Table 21. EAS_Alarm command Command Inv_Command DR M TRext CRC-16 # of bits 16 16 1 2 1 16 description 11100000 00000100 00011111 11111011 0: DR=8 1: DR=64/3 00: M=1 01: M=2 10: M=4 11: M=8 0: No pilot tone 1: Use pilot tone - Table 22. G2X reply to a successful EAS_Alarm command Header EAS Code # of bits 1 64 description 0 CRC5 (MSB) 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 35 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Table 23. Eas_Alarm command-response table Starting State Condition Response Next State ready EAS-bit is set and non-zero access password Backscatter Alarm code ready arbitrate, reply, acknowledged EAS-bit is set and non-zero access password – arbitrate open EAS-bit is set and non-zero access password open secured EAS-bit is set and non-zero access password secured killed EAS-bit is set and non-zero access password – killed 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 36 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 14.12.5 Calibrate After execution of the custom Calibrate command the G2X will continuously backscatter the user memory content in an infinite loop. The G2XL will continuously backscatter zeros. This command can be used for frequency spectrum measurements. Calibrate can only be executed from the Secure state with an non-zero Access Password set otherwise the command will be ignored. The Calibrate command includes a CRC-16 calculated over the whole command, the handle and a prepended frame-sync. [1] G2XM [2] G2XL Table 24. Calibrate command Command RN16 CRC-16 # of bits 16 16 16 description 11100000 00000101 handle - Table 25. G2X reply to a successful Calibrate command Header Infinite repeat # of bits 1 512 (looped) description 0 User memory data[1] zeros[2] Table 26. Calibrate command-response table Starting State Condition Response Next State ready all – ready arbitrate, reply, acknowledged all – arbitrate secured nonzero access password Backscatter infinite _ access password is zero – secured killed all – killed 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 37 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 15. Support information 15.1 CRC Calculation EXAMPLE Old RN = 3D5Bh Table 27. Practical example of CRC calculation for a 'Req_RN' command by the reader CRC Calculated @ Reader Cmd Code for Req_RN F F F F 1 F F F E 1 F F F C 0 E F D 9 0 C F 9 3 0 8 F 0 7 0 0 E 2 F 0 1 C 5 E 1 2 8 9 9 First Byte of RN 0 5 1 3 A 0 A 2 7 4 1 4 4 E 8 1 9 9 F 1 1 3 3 E 2 1 7 7 E 5 0 E F C A 1 D F 9 4 Second Byte of RN 0 A F 0 9 1 5 E 1 2 0 B C 2 4 1 7 8 4 8 1 E 0 B 1 0 D 1 4 3 1 A 2 8 6 1 4 5 0 C -> ones complement: B A F 3 => Command-Sequence: C1 3D 5B BA F3 hex 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 38 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Table 28. Practical example of CRC calculation for a 'Req_RN' command by the reader CRC Calculated @ Tag Cmd Code for Req_RN F F F F 1 F F F E 1 F F F C 0 E F D 9 0 C F 9 3 0 8 F 0 7 0 0 E 2 F 0 1 C 5 E 1 2 8 9 9 First Byte of RN 0 5 1 3 A 0 A 2 7 4 1 4 4 E 8 1 9 9 F 1 1 3 3 E 2 1 7 7 E 5 0 E F C A 1 D F 9 4 Second Byte of RN 0 A F 0 9 1 5 E 1 2 0 B C 2 4 1 7 8 4 8 1 E 0 B 1 0 D 1 4 3 1 A 2 8 6 1 4 5 0 C First Byte of CRC 1 9 A 3 9 0 2 4 5 3 1 5 8 8 7 1 A 1 2 F 1 4 2 5 E 0 8 4 B C 1 0 9 7 8 0 1 2 F 0 Second Byte of CRC 1 3 5 C 1 1 7 B A 3 1 E 7 6 7 1 C E C E 0 8 D B D 0 0 B 5 B 1 0 6 9 7 1 1 D 0 F -> Residue OK 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 39 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 16. Abbreviations Table 29. Abbreviations Acronym Description CRC Cyclic redundancy check CW Continuos wave EEPROM Electrically Erasable Programmable Read Only Memory EPC Electronic Product Code (containing Header, Domain Manager, Object Class and Serial Number) FM0 Bi phase space modulation G2 Generation 2 HBM Human Body Model IC Integrated Circuit LSB Least Significant Byte/Bit MSB Most Significant Byte/Bit NRZ Non-Return to Zero coding RF Radio Frequency RTF Reader Talks First Tari Type A Reference Interval (ISO 18000-6) UHF Ultra High Frequency Xxb Value in binary notation xxhex Value in hexadecimal notation 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 40 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 17. References [1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0 (December 17, 2005) [2] EPCglobal: EPC Tag Data Standards [3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft) [4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference (draft) [5] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 1 – Technical characteristics and test methods [6] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive [7] [CEPT1]: CEPT REC 70-03 Annex 1 [8] [ETSI1]: ETSI EN 330 220-1, 2 [9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1: Technical characteristics and test methods. [10] [FCC1]: FCC 47 Part 15 Section 247 [11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International Standards [12] ISO/IEC 3309: Information technology – Telecommunications and information exchange between systems – High-level data link control (HDLC) procedures – Frame structure [13] ISO/IEC 15961: Information technology, Automatic identification and data capture – Radio frequency identification (RFID) for item management – Data protocol: application interface [14] ISO/IEC 15962: Information technology, Automatic identification and data capture techniques – Radio frequency identification (RFID) for item management – Data protocol: data encoding rules and logical memory functions [15] ISO/IEC 15963: Information technology — Radio frequency identification for item management — Unique identification for RF tags [16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item management — Part 1: Reference architecture and definition of parameters to be standardized [17] ISO/IEC 18000-6: Information technology automatic identification and data capture techniques — Radio frequency identification for item management air interface — Part 6: Parameters for air interface communications at 860–960 MHz [18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary – Part 3: radio-frequency identification (RFID) 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 41 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL [19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15: Radio-frequency devices, U.S. Federal Communications Commission. [20] Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BL-ID document number: 1093**1 1. ** ... document version number 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 42 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 18. Revision history Table 30. Revision history Document ID Release date Data sheet status Change notice Supersedes SL3ICS1002_1202 v.3.8 20131111 Product data sheet - SL3ICS1002_1202 v.3.7 Modifications: • Update of the delivery form (TSSOP package due to DOD removed) SL3ICS1002_1202 v.3.7 20121009 Product data sheet - 139036 Modifications: • Update of the delivery form 139036 20110310 Product data sheet 139035 Modifications: • Table 4 “TSSOP8 Marking”: added • Section 14.1.1.2 “Special behavior of user memory address 1Fh”: added 139035 20091102 Product data sheet 139034 Modifications: • Type SOT1122 added • Figure 2 “Wafer layout and pinning information”: correction of drawing 139034 20090721 Product data sheet 139033 Modifications: • Table 11 “TSSOP8 characteristics” andTable 7 “Package interface characteristics” :removed “Memory characteristics” 139033 20090605 Product data sheet - 139032 139132 Modifications: • This data sheet is a combination of data sheets SL3ICS1002 and SL3ICS1202 • New type FCS2 Aluminum, SOT1040AB2 added • Section 8.1.6 “Fail die identification”: added • Section 11 “Packing information”: edited 139032 20080716 Product data sheet 139031 Modifications: • rephrasing of Section 2 “Features and benefits” on page 2 • added “calibrate command” in Section 2 “Features and benefits” on page 2 • redesign of Figure 1 “Block diagram of G2X IC” on page 4 • merging of Fig. 2 Pinning and Fig. 3 Wafer layout - see Figure 2 “Wafer layout and pinning information” on page 5 • added type “FCS2 Polymer Strap - SOT1040AA1” in Section 4 “Ordering information”, Section 6 “Wafer layout and pinning information”, Section 7 “Package outline”, Section 8 “Mechanical specification”, Section 9 “Limiting values”, Section 10 “Characteristics” • added Section 11 “Handling information for Flip Chip Strap (FCS2, SOT1040)” on page 19 • added Section 11 “Packing information” on page 12 • added Table 8 “Symbol description” on page 14 • correction of Table 11 “Memory map” on page 22 • removed “ongoing” in 32 bit ongoing in Section 2.1 and Table 10 “G2X memory sections” 139031 20080428 Product data sheet 139030 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 43 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Modifications: • update of Table 1 “Ordering information” on page 3 • added Section 7 “Package outline” on page 6 • added Section 8.1.7 “Map file distribution” on page 9 • added Table 9 “Limiting values TSSOP8 [1][2]” on page 14 • added room temperature in Table 11 “Memory characteristics” on page 15 • added Section 10.2 “TSSOP8 characteristics” on page 17 • update of the “EPCglobal compliance and interoperability certification” in Section 12.4 “Air interface standards” on page 15 • correction of “(excluding 16 bit CRC-16 and 16 bit PC) in Table 10 “G2X memory sections” on page 21 • correction of Initials in “tag mask designer” in Table 11 “Memory map” on page 22 • removed the sentence “The ChangeEAS custom command will toggle the state of the EAS-Alarm bit located in the EEprom” in Section 14.12.3 “ChangeEAS” on page 32. • added description of ChangeEAS in Table 18 “ChangeEAS command” on page 32 139030 20071221 Product data sheet - 139011 Modifications: • change of product status • general update 139011 20070910 Objective data sheet - 139010 Modifications: • removed double section Change EAS, EAS Alarm, Chapter 12.11.7 • changed “Reader” to “Tag” 139010 20070612 Objective data sheet - - • initial version Table 30. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 44 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 19. Legal information 19.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 45 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. UCODE — is a trademark of NXP B.V. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 46 of 48 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 21. Tables Table 1. Ordering information G2XM . . . . . . . . . . . . . . . .3 Table 2. Ordering information G2XL. . . . . . . . . . . . . . . . .3 Table 3. Pin description of SOT1122 . . . . . . . . . . . . . . . .7 Table 4. SOT1122 Marking. . . . . . . . . . . . . . . . . . . . . . . .7 Table 5. Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . .10 Table 6. Wafer characteristics . . . . . . . . . . . . . . . . . . . . 11 Table 7. Package interface characteristics. . . . . . . . . . . 11 Table 8. Symbol description . . . . . . . . . . . . . . . . . . . . . .14 Table 9. Operating distances for UCODE G2X based tags and labels in released frequency bands . .14 Table 10. G2X memory sections . . . . . . . . . . . . . . . . . . .21 Table 11. Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . .22 Table 12. ReadProtect command. . . . . . . . . . . . . . . . . . .28 Table 13. G2X reply to a successful ReadProtect procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Table 14. ReadProtect command-response table . . . . . .29 Table 15. Reset ReadProtect command . . . . . . . . . . . . .31 Table 16. G2X reply to a successful Reset ReadProtect command . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Table 17. Reset ReadProtect command-response table 31 Table 18. ChangeEAS command . . . . . . . . . . . . . . . . . . 32 Table 19. G2X reply to a successful ChangeEAS command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 20. ChangeEAS command-response table . . . . . . 33 Table 21. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 34 Table 22. G2X reply to a successful EAS_Alarm command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 23. Eas_Alarm command-response table. . . . . . . 35 Table 24. Calibrate command . . . . . . . . . . . . . . . . . . . . . 36 Table 25. G2X reply to a successful Calibrate command 36 Table 26. Calibrate command-response table . . . . . . . . . 36 Table 27. Practical example of CRC calculation for a 'Req_RN' command by the reader . . . . . . . . . 37 Table 28. Practical example of CRC calculation for a 'Req_RN' command by the reader. . . . . . . . . . 38 Table 29. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 30. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 42 22. Figures Fig 1. Block diagram of G2X IC . . . . . . . . . . . . . . . . . . . .4 Fig 2. Wafer layout and pinning information . . . . . . . . . .5 Fig 3. Package outline SOT1122 . . . . . . . . . . . . . . . . . . .6 Fig 4. G2X TID memory structure . . . . . . . . . . . . . . . . .21 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.8 — 11 November 2013 139038 47 of 48 continued >> NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 Custom commands. . . . . . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Wafer layout and pinning information . . . . . . . 5 6.1 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Mechanical specification . . . . . . . . . . . . . . . . . 8 8.1 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 8 8.1.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1.2 Wafer backside . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1.3 Chip dimensions . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1.4 Passivation on front . . . . . . . . . . . . . . . . . . . . . 8 8.1.5 Au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1.6 Fail die identification . . . . . . . . . . . . . . . . . . . . 9 8.1.7 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 9 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11 10.1 Wafer characteristics . . . . . . . . . . . . . . . . . . . 11 10.2 Package characteristics . . . . . . . . . . . . . . . . . 11 11 Packing information . . . . . . . . . . . . . . . . . . . . 12 11.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11.2 SOT1122 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 Functional description . . . . . . . . . . . . . . . . . . 13 12.1 Power transfer . . . . . . . . . . . . . . . . . . . . . . . . 13 12.2 Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.2.1 Reader to G2X Link . . . . . . . . . . . . . . . . . . . . 13 12.2.2 G2X to reader Link . . . . . . . . . . . . . . . . . . . . . 13 12.3 Operating distances . . . . . . . . . . . . . . . . . . . . 14 12.4 Air interface standards . . . . . . . . . . . . . . . . . . 15 13 Physical layer and signaling. . . . . . . . . . . . . . 16 13.1 Reader to G2X communication . . . . . . . . . . . 16 13.1.1 Physical layer . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.1.2 Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.1.3 Data encoding. . . . . . . . . . . . . . . . . . . . . . . . . 16 13.1.4 Data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 13.1.5 RF envelope for R=>T . . . . . . . . . . . . . . . . . . 16 13.1.6 Interrogator power-up/down waveform. . . . . . 16 13.1.7 Preamble and frame-sync . . . . . . . . . . . . . . . 16 13.2 G2X to reader communication . . . . . . . . . . . . 17 13.2.1 Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13.2.2 Data encoding . . . . . . . . . . . . . . . . . . . . . . . . 17 13.2.2.1 FM0 baseband . . . . . . . . . . . . . . . . . . . . . . . . 17 13.2.2.2 FM0 Preamble . . . . . . . . . . . . . . . . . . . . . . . . 17 13.2.2.3 Miller-modulated sub carrier . . . . . . . . . . . . . 17 13.2.2.4 Miller sub carrier preamble . . . . . . . . . . . . . . 17 13.2.3 Data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13.3 Link timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.3.1 Regeneration time . . . . . . . . . . . . . . . . . . . . . 18 13.3.2 Start-up time. . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.3.3 Persistence time . . . . . . . . . . . . . . . . . . . . . . 18 13.4 Bit and byte ordering . . . . . . . . . . . . . . . . . . . 18 13.5 Data integrity . . . . . . . . . . . . . . . . . . . . . . . . . 19 13.6 CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 14 TAG selection, inventory and access . . . . . . 20 14.1 G2X Memory . . . . . . . . . . . . . . . . . . . . . . . . . 21 14.1.1 Memory map . . . . . . . . . . . . . . . . . . . . . . . . . 22 14.1.1.1 User memory (only G2XM) . . . . . . . . . . . . . . 23 14.1.1.2 Special behavior of user memory address 1Fh 23 14.1.1.3 Supported EPC types . . . . . . . . . . . . . . . . . . 23 14.2 Sessions, selected and inventoried flags. . . . 24 14.2.1 G2X States and slot counter . . . . . . . . . . . . . 24 14.2.2 G2X State Diagram . . . . . . . . . . . . . . . . . . . . 24 14.3 Managing tag populations . . . . . . . . . . . . . . . 24 14.4 Selecting tag populations. . . . . . . . . . . . . . . . 24 14.5 Inventorying tag populations . . . . . . . . . . . . . 24 14.6 Accessing individual tags. . . . . . . . . . . . . . . . 24 14.7 Interrogator commands and tag replies . . . . . 24 14.7.1 Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 14.7.2 State transition tables. . . . . . . . . . . . . . . . . . . 25 14.7.3 Command response tables . . . . . . . . . . . . . . 25 14.7.4 Example data-flow exchange. . . . . . . . . . . . . 25 14.8 Mandatory Select Commands . . . . . . . . . . . . 25 14.8.1 Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.9 Mandatory Inventory Commands. . . . . . . . . . 26 14.9.1 Query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.9.2 QueryAdjust . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.9.3 QueryRep. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.9.4 ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.9.5 NAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.10 Mandatory Access Commands . . . . . . . . . . . 27 14.10.1 REQ_RN . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.10.2 READ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.10.3 WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.10.4 KILL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.10.5 LOCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.11 Optional Access Command . . . . . . . . . . . . . . 27 14.11.1 Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.12 Custom Commands . . . . . . . . . . . . . . . . . . . . 28 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 November 2013 139038 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14.12.1 ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . . 28 14.12.2 Reset ReadProtect . . . . . . . . . . . . . . . . . . . . . 30 14.12.3 ChangeEAS . . . . . . . . . . . . . . . . . . . . . . . . . . 32 14.12.4 EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 34 14.12.5 Calibrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 15 Support information . . . . . . . . . . . . . . . . . . . . 37 15.1 CRC Calculation EXAMPLE . . . . . . . . . . . . . . 37 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 39 17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 42 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 44 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 44 19.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 19.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 45 20 Contact information. . . . . . . . . . . . . . . . . . . . . 45 21 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 22 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 23 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 1. General description The LPC11U3x are an ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable full-speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I2C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. The I/O Handler is a software library-supported hardware engine that can be used to add performance, connectivity and flexibility to system designs. It is available on the LPC11U37HFBD64/401. The I/O Handler can emulate serial interfaces such as UART, I2C, and I2S with no or very low additional CPU load and can off-load the CPU by performing processing-intensive functions like DMA transfers in hardware. Software libraries for multiple I/O Handler applications are available on http://www.LPCware.com. For additional documentation related to the LPC11U3x parts, see Section 15 “References”. 2. Features and benefits  System:  ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.  ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).  Non-Maskable Interrupt (NMI) input selectable from several input sources.  System tick timer.  Memory:  Up to 128 kB on-chip flash program memory with sector (4 kB) and page erase (256 byte) access.  4 kB on-chip EEPROM data memory; byte erasable and byte programmable; on-chip API support.  Up to 12 kB SRAM data memory. LPC11U3x 32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART Rev. 2.2 — 11 March 2014 Product data sheet LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 2 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller  16 kB boot ROM.  In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.  ROM-based USB drivers. Flash updates via USB supported.  ROM-based 32-bit integer division routines.  Debug options:  Standard JTAG (Joint Test Action Group) test interface for BSDL (Boundary Scan Description Language).  Serial Wire Debug.  Digital peripherals:  Up to 54 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors, repeater mode, and open-drain mode.  Up to 8 GPIO pins can be selected as edge and level sensitive interrupt sources.  Two GPIO grouped interrupt modules enable an interrupt based on a programmable pattern of input states of a group of GPIO pins.  High-current source output driver (20 mA) on one pin.  High-current sink driver (20 mA) on true open-drain pins.  Four general purpose counter/timers with a total of up to 8 capture inputs and 13 match outputs.  Programmable Windowed WatchDog Timer (WWDT) with a dedicated, internal low-power WatchDog Oscillator (WDO).  Analog peripherals:  10-bit ADC with input multiplexing among eight pins.  Serial interfaces:  USB 2.0 full-speed device controller.  USART with fractional baud rate generation, internal FIFO, a full modem control handshake interface, and support for RS-485/9-bit mode and synchronous mode. USART supports an asynchronous smart card interface (ISO 7816-3).  Two SSP controllers with FIFO and multi-protocol capabilities.  I2C-bus interface supporting the full I2C-bus specification and Fast-mode Plus with a data rate of up to 1 Mbit/s with multiple address recognition and monitor mode.  I/O Handler for hardware emulation of serial interfaces and DMA; supported through software libraries. (LPC11U37HFBD64/401 only.)  Clock generation:  Crystal Oscillator with an operating range of 1 MHz to 25 MHz (system oscillator).  12 MHz high-frequency Internal RC oscillator (IRC) that can optionally be used as a system clock.  Internal low-power, low-frequency WatchDog Oscillator (WDO) with programmable frequency output.  PLL allows CPU operation up to the maximum CPU rate with the system oscillator or the IRC as clock sources.  A second, dedicated PLL is provided for USB.  Clock output function with divider that can reflect the crystal oscillator, the main clock, the IRC, or the watchdog oscillator.  Power control: LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 3 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller  Integrated PMU (Power Management Unit) to minimize power consumption during Sleep, Deep-sleep, Power-down, and Deep power-down modes.  Power profiles residing in boot ROM provide optimized performance and minimized power consumption for any given application through one simple function call.  Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.  Processor wake-up from Deep-sleep and Power-down modes via reset, selectable GPIO pins, watchdog interrupt, or USB port activity.  Processor wake-up from Deep power-down mode using one special function pin.  Power-On Reset (POR).  Brownout detect with up to four separate thresholds for interrupt and forced reset.  Unique device serial number for identification.  Single 3.3 V power supply (1.8 V to 3.6 V).  Temperature range 40 C to +85 C.  Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packages. 3. Applications 4. Ordering information  Consumer peripherals  Handheld scanners  Medical  USB audio devices  Industrial control Table 1. Ordering information Type number Package Name Description Version LPC11U34FHN33/311 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7  7  0.85 mm n/a LPC11U34FBD48/311 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2 LPC11U34FHN33/421 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7  7  0.85 mm n/a LPC11U34FBD48/421 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2 LPC11U35FHN33/401 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7  7  0.85 mm n/a LPC11U35FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2 LPC11U35FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2 LPC11U35FHI33/501 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5  5  0.85 mm n/a LPC11U35FET48/501 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5  4.5  0.7 mm SOT1155-2 LPC11U36FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2 LPC11U36FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 4 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 4.1 Ordering options [1] For general-purpose use. [2] For I/O Handler use only. LPC11U37FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2 LPC11U37HFBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2 LPC11U37FBD64/501 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2 Table 1. Ordering information …continued Type number Package Name Description Version Table 2. Ordering options Type number Flash in kB EEPROM in kB SRAM0 in kB USB SRAM in kB SRAM1 in kB Total SRAM in kB[1] I/O Handler USART I2C-bus FM+ SSP USB device ADC channels GPIO pins LPC11U34FHN33/311 40 4 8 - - 8 no 1 1 2 1 8 26 LPC11U34FBD48/311 40 4 8 - - 8 no 1 1 2 1 8 40 LPC11U34FHN33/421 48 4 8 2 - 10 no 1 1 2 1 8 26 LPC11U34FBD48/421 48 4 8 2 - 10 no 1 1 2 1 8 40 LPC11U35FHN33/401 64 4 8 2 - 10 no 1 1 2 1 8 26 LPC11U35FBD48/401 64 4 8 2 - 10 no 1 1 2 1 8 40 LPC11U35FBD64/401 64 4 8 2 - 10 no 1 1 2 1 8 54 LPC11U35FHI33/501 64 4 8 2 2[1] 12 no 1 1 2 1 8 26 LPC11U35FET48/501 64 4 8 2 2[1] 12 no 1 1 2 1 8 40 LPC11U36FBD48/401 96 4 8 2 - 10 no 1 1 2 1 8 40 LPC11U36FBD64/401 96 4 8 2 - 10 no 1 1 2 1 8 54 LPC11U37FBD48/401 128 4 8 2 - 10 no 1 1 2 1 8 40 LPC11U37HFBD64/401 128 4 8 2 2[2] 10 yes 1 1 2 1 8 54 LPC11U37FBD64/501 128 4 8 2 2[1] 12 no 1 1 2 1 8 54 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 5 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 5. Block diagram (1) Not available on HVQFN33 packages. (2) CT16B0_CAP1, CT16B1_CAP1 available on LQFP64 packages only; CT32B0_CAP1 available on TFBGA48, LQFP48, and LQFP64 packages only; CT32B1_CAP1 available in TFBGA48/LQFP64 packages only. (3) LPC11U37HFBD64/401 only. Fig 1. Block diagram SRAM 8/10/12 kB ARM CORTEX-M0 TEST/DEBUG INTERFACE FLASH 40/48/64/96/128 kB HIGH-SPEED GPIO AHB TO APB BRIDGE CLOCK GENERATION, POWER CONTROL, SYSTEM FUNCTIONS RESET SWD, JTAG LPC11U3x slave slave master slave slave ROM 16 kB slave AHB-LITE BUS GPIO ports 0/1 I/O IOH_[20:0] HANDLER(3) CLKOUT IRC, WDO SYSTEM OSCILLATOR POR PLL0 USB PLL BOD 10-bit ADC USART/ SMARTCARD INTERFACE AD[7:0] RXD TXD CTS, RTS, DTR SCLK GPIO INTERRUPTS 32-bit COUNTER/TIMER 0 CT32B0_MAT[3:0] CT32B0_CAP[1:0](2) 32-bit COUNTER/TIMER 1 CT32B1_MAT[3:0] CT32B1_CAP[1:0](2) DCD, DSR(1), RI(1) 16-bit COUNTER/TIMER 1 WINDOWED WATCHDOG TIMER GPIO GROUP0 INTERRUPTS CT16B1_MAT[1:0] 16-bit COUNTER/TIMER 0 CT16B0_MAT[2:0] CT16B0_CAP[1:0](2) CT16B1_CAP[1:0](2) GPIO pins GPIO pins GPIO pins GPIO GROUP1 INTERRUPTS system bus SSP0 SCK0, SSEL0, MISO0, MOSI0 SSP1 SCK1, SSEL1, MISO1, MOSI1 I2C-BUS IOCON SYSTEM CONTROL PMU SCL, SDA XTALIN XTALOUT USB DEVICE CONTROLLER USB_DP USB_DM USB_VBUS USB_FTOGGLE, USB_CONNECT 002aag345 master slave EEPROM 4 kB LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 6 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 6. Pinning information 6.1 Pinning For parts LPC11U34FHN33/311, LPC11U34FHN33/421, LPC11U35FHN33/401, LPC11U35FHI33/501 Fig 2. Pin configuration (HVQFN33) 002aag809 Transparent top view PIO0_8/MISO0/CT16B0_MAT0 PIO0_20/CT16B1_CAP0 PIO0_2/SSEL0/CT16B0_CAP0 PIO0_9/MOSI0/CT16B0_MAT1 VDD SWCLK/PIO0_10/SCK0/CT16B0_MAT2 XTALOUT PIO0_22/AD6/CT16B1_MAT1/MISO1 XTALIN TDI/PIO0_11/AD0/CT32B0_MAT3 PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE TMS/PIO0_12/AD1/CT32B1_CAP0 RESET/PIO0_0 TDO/PIO0_13/AD2/CT32B1_MAT0 PIO1_19/DTR/SSEL1 TRST/PIO0_14/AD3/CT32B1_MAT1 PIO0_3/USB_VBUS PIO0_4/SCL PIO0_5/SDA PIO0_21/CT16B1_MAT0/MOSI1 USB_DM USB_DP PIO0_6/USB_CONNECT/SCK0 PIO0_7/CTS PIO0_19/TXD/CT32B0_MAT1 PIO0_18/RXD/CT32B0_MAT0 PIO0_17/RTS/CT32B0_CAP0/SCLK VDD PIO1_15/DCD/CT16B0_MAT2/SCK1 PIO0_23/AD7 PIO0_16/AD5/CT32B1_MAT3/WAKEUP SWDIO/PIO0_15/AD4/CT32B1_MAT2 8 17 7 18 6 19 5 20 4 21 3 22 2 23 1 24 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 terminal 1 index area 33 VSS LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 7 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 3. Pin configuration (TFBGA48) 002aag810 LPC11U35FET48/501 Transparent top view H G F D B E C A 1 2 3 4 5 6 7 8 ball A1 index area LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 8 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 4. Pin configuration (LQFP48) LPC11U34FBD48/311 LPC11U34FBD48/421 LPC11U35FBD48/401 LPC11U36FBD48/401 LPC11U37FBD48/401 PIO1_25/CT32B0_MAT1 PIO1_13/DTR/CT16B0_MAT0/TXD PIO1_19/DTR/SSEL1 TRST/PIO0_14/AD3/CT32B1_MAT1 RESET/PIO0_0 TDO/PIO0_13/AD2/CT32B1_MAT0 PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE TMS/PIO0_12/AD1/CT32B1_CAP0 VSS TDI/PIO0_11/AD0/CT32B0_MAT3 XTALIN PIO1_29/SCK0/CT32B0_CAP1 XTALOUT PIO0_22/AD6/CT16B1_MAT1/MISO1 VDD SWCLK/PIO0_10/SCK0/CT16B0_MAT2 PIO0_20/CT16B1_CAP0 PIO0_9/MOSI0/CT16B0_MAT1 PIO0_2/SSEL0/CT16B0_CAP0 PIO0_8/MISO0/CT16B0_MAT0 PIO1_26/CT32B0_MAT2/RXD PIO1_21/DCD/MISO1 PIO1_27/CT32B0_MAT3/TXD PIO1_31 PIO1_20/DSR/SCK1 PIO1_16/RI/CT16B0_CAP0 PIO0_3/USB_VBUS PIO0_19/TXD/CT32B0_MAT1 PIO0_4/SCL PIO0_18/RXD/CT32B0_MAT0 PIO0_5/SDA PIO0_17/RTS/CT32B0_CAP0/SCLK PIO0_21/CT16B1_MAT0/MOSI1 VDD PIO1_23/CT16B1_MAT1/SSEL1 PIO1_15/DCD/CT16B0_MAT2/SCK1 USB_DM PIO0_23/AD7 USB_DP VSS PIO1_24/CT32B0_MAT0 PIO0_16/AD5/CT32B1_MAT3/WAKEUP PIO0_6/USB_CONNECT/SCK0 SWDIO/PIO0_15/AD4/CT32B1_MAT2 PIO0_7/CTS PIO1_28/CT32B0_CAP0/SCLK PIO1_22/RI/MOSI1 PIO1_14/DSR/CT16B0_MAT1/RXD 002aag811 1 2 3 4 5 6 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 13 14 15 16 17 18 19 20 21 22 23 48 47 46 45 44 43 42 41 40 39 38 24 37 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 9 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller See Table 3 for the full pin name. Fig 5. Pin configuration (LQFP64) LPC11U35FBD64/401 LPC11U36FBD64/401 LPC11U37HFBD64/401 LPC11U37FBD64/501 PIO1_0 VDD PIO1_25 PIO1_13 PIO1_19 TRST/PIO0_14 RESET/PIO0_0 TDO/PIO0_13 PIO0_1 TMS/PIO0_12 PIO1_7 PIO1_11 VSS TDI/PIO0_11 XTALIN PIO1_29 XTALOUT PIO0_22 VDD PIO1_8 PIO0_20 SWCLK/PIO0_10 PIO1_10 PIO0_9 PIO0_2 PIO0_8 PIO1_26 PIO1_21 PIO1_27 PIO1_2 PIO1_4 VDD PIO1_1 PIO1_6 PIO1_20 PIO1_16 PIO0_3 PIO0_19 PIO0_4 PIO0_18 PIO0_5 PIO0_17 PIO0_21 PIO1_12 PIO1_17 VDD PIO1_23 PIO1_15 USB_DM PIO0_23 USB_DP PIO1_9 PIO1_24 VSS PIO1_18 PIO0_16 PIO0_6 SWDIO/PIO0_15 PIO0_7 PIO1_22 PIO1_28 PIO1_3 PIO1_5 PIO1_14 002aag812 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 10 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 6.2 Pin description Table 3 shows all pins and their assigned digital or analog functions in order of the GPIO port number. The default function after reset is listed first. All port pins have internal pull-up resistors enabled after reset except for the true open-drain pins PIO0_4 and PIO0_5. Every port pin has a corresponding IOCON register for programming the digital or analog function, the pull-up/pull-down configuration, the repeater, and the open-drain modes. The USART, counter/timer, and SSP functions are available on more than one port pin. Table 3. Pin description Symbol Pin HVQFN33 Pin TFBGA48 Pin LQFP48 Pin LQFP64 Reset state [1] Type Description RESET/PIO0_0 2 C1 3 4 [2] I; PU I RESET — External reset input with 20 ns glitch filter. A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states and processor execution to begin at address 0. This pin also serves as the debug select input. LOW level selects the JTAG boundary scan. HIGH level selects the ARM SWD debug mode. In deep power-down mode, this pin must be pulled HIGH externally. The RESET pin can be left unconnected or be used as a GPIO pin if an external RESET function is not needed and Deep power-down mode is not used. - I/O PIO0_0 — General purpose digital input/output pin. PIO0_1/CLKOUT/ CT32B0_MAT2/ USB_FTOGGLE 3 C2 4 5 [3] I; PU I/O PIO0_1 — General purpose digital input/output pin. A LOW level on this pin during reset starts the ISP command handler or the USB device enumeration. - O CLKOUT — Clockout pin. - O CT32B0_MAT2 — Match output 2 for 32-bit timer 0. - O USB_FTOGGLE — USB 1 ms Start-of-Frame signal. PIO0_2/SSEL0/ CT16B0_CAP0/IOH_0 8 F1 10 13 [3] I; PU I/O PIO0_2 — General purpose digital input/output pin. - I/O SSEL0 — Slave select for SSP0. - I CT16B0_CAP0 — Capture input 0 for 16-bit timer 0. - I/O IOH_0 — I/O Handler input/output 0. LPC11U37HFBD64/401 only. PIO0_3/USB_VBUS/ IOH_1 9 H2 14 19 [3] I; PU I/O PIO0_3 — General purpose digital input/output pin. A LOW level on this pin during reset starts the ISP command handler. A HIGH level during reset starts the USB device enumeration. - I USB_VBUS — Monitors the presence of USB bus power. - I/O IOH_1 — I/O Handler input/output 1. LPC11U37HFBD64/401 only. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 11 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller PIO0_4/SCL/IOH_2 10 G3 15 20 [4] I; IA I/O PIO0_4 — General purpose digital input/output pin (open-drain). - I/O SCL — I2C-bus clock input/output (open-drain). High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. - I/O IOH_2 — I/O Handler input/output 2. LPC11U37HFBD64/401 only. PIO0_5/SDA/IOH_3 11 H3 16 21 [4] I; IA I/O PIO0_5 — General purpose digital input/output pin (open-drain). - I/O SDA — I2C-bus data input/output (open-drain). High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. - I/O IOH_3 — I/O Handler input/output 3. LPC11U37HFBD64/401 only. PIO0_6/USB_CONNECT/ SCK0/IOH_4 15 H6 22 29 [3] I; PU I/O PIO0_6 — General purpose digital input/output pin. - O USB_CONNECT — Signal used to switch an external 1.5 k resistor under software control. Used with the SoftConnect USB feature. - I/O SCK0 — Serial clock for SSP0. - I/O IOH_4 — I/O Handler input/output 4. LPC11U37HFBD64/401 only. PIO0_7/CTS/IOH_5 16 G7 23 30 [5] I; PU I/O PIO0_7 — General purpose digital input/output pin (high-current output driver). - I CTS — Clear To Send input for USART. - I/O IOH_5 — I/O Handler input/output 5. (LPC11U37HFBD64/401 only.) PIO0_8/MISO0/ CT16B0_MAT0/R/IOH_6 17 F8 27 36 [3] I; PU I/O PIO0_8 — General purpose digital input/output pin. - I/O MISO0 — Master In Slave Out for SSP0. - O CT16B0_MAT0 — Match output 0 for 16-bit timer 0. - - Reserved. - I/O IOH_6 — I/O Handler input/output 6. (LPC11U37HFBD64/401 only.) PIO0_9/MOSI0/ CT16B0_MAT1/R/IOH_7 18 F7 28 37 [3] I; PU I/O PIO0_9 — General purpose digital input/output pin. - I/O MOSI0 — Master Out Slave In for SSP0. - O CT16B0_MAT1 — Match output 1 for 16-bit timer 0. - - Reserved. - I/O IOH_7 — I/O Handler input/output 7. (LPC11U37HFBD64/401 only.) Table 3. Pin description Symbol Pin HVQFN33 Pin TFBGA48 Pin LQFP48 Pin LQFP64 Reset state [1] Type Description LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 12 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller SWCLK/PIO0_10/SCK0/ CT16B0_MAT2 19 E7 29 38 [3] I; PU I SWCLK — Serial wire clock and test clock TCK for JTAG interface. - I/O PIO0_10 — General purpose digital input/output pin. - O SCK0 — Serial clock for SSP0. - O CT16B0_MAT2 — Match output 2 for 16-bit timer 0. TDI/PIO0_11/AD0/ CT32B0_MAT3 21 D8 32 42 [6] I; PU I TDI — Test Data In for JTAG interface. - I/O PIO0_11 — General purpose digital input/output pin. - I AD0 — A/D converter, input 0. - O CT32B0_MAT3 — Match output 3 for 32-bit timer 0. TMS/PIO0_12/AD1/ CT32B1_CAP0 22 C7 33 44 [6] I; PU I TMS — Test Mode Select for JTAG interface. - I/O PIO_12 — General purpose digital input/output pin. - I AD1 — A/D converter, input 1. - I CT32B1_CAP0 — Capture input 0 for 32-bit timer 1. TDO/PIO0_13/AD2/ CT32B1_MAT0 23 C8 34 45 [6] I; PU O TDO — Test Data Out for JTAG interface. - I/O PIO0_13 — General purpose digital input/output pin. - I AD2 — A/D converter, input 2. - O CT32B1_MAT0 — Match output 0 for 32-bit timer 1. TRST/PIO0_14/AD3/ CT32B1_MAT1 24 B7 35 46 [6] I; PU I TRST — Test Reset for JTAG interface. - I/O PIO0_14 — General purpose digital input/output pin. - I AD3 — A/D converter, input 3. - O CT32B1_MAT1 — Match output 1 for 32-bit timer 1. SWDIO/PIO0_15/AD4/ CT32B1_MAT2 25 B6 39 52 [6] I; PU I/O SWDIO — Serial wire debug input/output. - I/O PIO0_15 — General purpose digital input/output pin. - I AD4 — A/D converter, input 4. - O CT32B1_MAT2 — Match output 2 for 32-bit timer 1. PIO0_16/AD5/ CT32B1_MAT3/IOH_8/ WAKEUP 26 A6 40 53 [6] I; PU I/O PIO0_16 — General purpose digital input/output pin. - I AD5 — A/D converter, input 5. - O CT32B1_MAT3 — Match output 3 for 32-bit timer 1. - I/O IOH_8 — I/O Handler input/output 8. (LPC11U37HFBD64/401 only.) - I WAKEUP — Deep power-down mode wake-up pin with 20 ns glitch filter. Pull this pin HIGH externally before entering Deep power-down mode, then pull LOW to exit Deep power-down mode. A LOW-going pulse as short as 50 ns wakes up the part. Table 3. Pin description Symbol Pin HVQFN33 Pin TFBGA48 Pin LQFP48 Pin LQFP64 Reset state [1] Type Description LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 13 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller PIO0_17/RTS/ CT32B0_CAP0/SCLK 30 A3 45 60 [3] I; PU I/O PIO0_17 — General purpose digital input/output pin. - O RTS — Request To Send output for USART. - I CT32B0_CAP0 — Capture input 0 for 32-bit timer 0. - I/O SCLK — Serial clock input/output for USART in synchronous mode. PIO0_18/RXD/ CT32B0_MAT0 31 B3 46 61 [3] I; PU I/O PIO0_18 — General purpose digital input/output pin. - I RXD — Receiver input for USART. Used in UART ISP mode. - O CT32B0_MAT0 — Match output 0 for 32-bit timer 0. PIO0_19/TXD/ CT32B0_MAT1 32 B2 47 62 [3] I; PU I/O PIO0_19 — General purpose digital input/output pin. - O TXD — Transmitter output for USART. Used in UART ISP mode. - O CT32B0_MAT1 — Match output 1 for 32-bit timer 0. PIO0_20/CT16B1_CAP0 7 F2 9 11 [3] I; PU I/O PIO0_20 — General purpose digital input/output pin. - I CT16B1_CAP0 — Capture input 0 for 16-bit timer 1. PIO0_21/CT16B1_MAT0/ MOSI1 12 G4 17 22 [3] I; PU I/O PIO0_21 — General purpose digital input/output pin. - O CT16B1_MAT0 — Match output 0 for 16-bit timer 1. - I/O MOSI1 — Master Out Slave In for SSP1. PIO0_22/AD6/ CT16B1_MAT1/MISO1 20 E8 30 40 [6] I; PU I/O PIO0_22 — General purpose digital input/output pin. - I AD6 — A/D converter, input 6. - O CT16B1_MAT1 — Match output 1 for 16-bit timer 1. - I/O MISO1 — Master In Slave Out for SSP1. PIO0_23/AD7/IOH_9 27 A5 42 56 [6] I; PU I/O PIO0_23 — General purpose digital input/output pin. - I AD7 — A/D converter, input 7. - I/O IOH_9 — I/O Handler input/output 9. (LPC11U37HFBD64/401 only.) PIO1_0/CT32B1_MAT0/ IOH_10 - - - 1 [3] I; PU I/O PIO1_0 — General purpose digital input/output pin. - O CT32B1_MAT0 — Match output 0 for 32-bit timer 1. - I/O IOH_10 — I/O Handler input/output 10. (LPC11U37HFBD64/401 only.) PIO1_1/CT32B1_MAT1/ IOH_11 - - - 17 [3] I; PU I/O PIO1_1 — General purpose digital input/output pin. - O CT32B1_MAT1 — Match output 1 for 32-bit timer 1. - I/O IOH_11 — I/O Handler input/output 11. (LPC11U37HFBD64/401 only.) PIO1_2/CT32B1_MAT2/ IOH_12 - - - 34 [3] I; PU I/O PIO1_2 — General purpose digital input/output pin. - O CT32B1_MAT2 — Match output 2 for 32-bit timer 1. - I/O IOH_12 — I/O Handler input/output 12. (LPC11U37HFBD64/401 only.) Table 3. Pin description Symbol Pin HVQFN33 Pin TFBGA48 Pin LQFP48 Pin LQFP64 Reset state [1] Type Description LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 14 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller PIO1_3/CT32B1_MAT3/ IOH_13 - - - 50 [3] I; PU I/O PIO1_3 — General purpose digital input/output pin. - O CT32B1_MAT3 — Match output 3 for 32-bit timer 1. - I/O IOH_13 — I/O Handler input/output 13. (LPC11U37HFBD64/401 only.) PIO1_4/CT32B1_CAP0/ IOH_14 - - - 16 [3] I; PU I/O PIO1_4 — General purpose digital input/output pin. - I CT32B1_CAP0 — Capture input 0 for 32-bit timer 1. - I/O IOH_14 — I/O Handler input/output 14. (LPC11U37HFBD64/401 only.) PIO1_5/CT32B1_CAP1 /IOH_15 - H8 - 32 [3] I; PU I/O PIO1_5 — General purpose digital input/output pin. - I CT32B1_CAP1 — Capture input 1 for 32-bit timer 1. - I/O IOH_15 — I/O Handler input/output 15. (LPC11U37HFBD64/401 only.) PIO1_6/IOH_16 - - - 64 [3] I; PU I/O PIO1_6 — General purpose digital input/output pin. - I/O IOH_16 — I/O Handler input/output 16. (LPC11U37HFBD64/401 only.) PIO1_7/IOH_17 - - - 6 [3] I; PU I/O PIO1_7 — General purpose digital input/output pin. - I/O IOH_17 — I/O Handler input/output 17. (LPC11U37HFBD64/401 only.) PIO1_8/IOH_18 - - - 39 [3] I; PU I/O PIO1_8 — General purpose digital input/output pin. - I/O IOH_18 — I/O Handler input/output 18. (LPC11U37HFBD64/401 only.) PIO1_9 - - - 55 [3] I; PU I/O PIO1_9 — General purpose digital input/output pin. PIO1_10 - - - 12 [3] I; PU I/O PIO1_10 — General purpose digital input/output pin. PIO1_11 - - - 43 [3] I; PU I/O PIO1_11 — General purpose digital input/output pin. PIO1_12 - - - 59 [3] I; PU I/O PIO1_12 — General purpose digital input/output pin. PIO1_13/DTR/ CT16B0_MAT0/TXD - B8 36 47 [3] I; PU I/O PIO1_13 — General purpose digital input/output pin. - O DTR — Data Terminal Ready output for USART. - O CT16B0_MAT0 — Match output 0 for 16-bit timer 0. - O TXD — Transmitter output for USART. PIO1_14/DSR/ CT16B0_MAT1/RXD - A8 37 49 [3] I; PU I/O PIO1_14 — General purpose digital input/output pin. - I DSR — Data Set Ready input for USART. - O CT16B0_MAT1 — Match output 1 for 16-bit timer 0. - I RXD — Receiver input for USART. PIO1_15/DCD/ CT16B0_MAT2/SCK1 28 A4 43 57 [3] I; PU I/O PIO1_15 — General purpose digital input/output pin. I DCD — Data Carrier Detect input for USART. - O CT16B0_MAT2 — Match output 2 for 16-bit timer 0. - I/O SCK1 — Serial clock for SSP1. Table 3. Pin description Symbol Pin HVQFN33 Pin TFBGA48 Pin LQFP48 Pin LQFP64 Reset state [1] Type Description LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 15 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller PIO1_16/RI/ CT16B0_CAP0 - A2 48 63 [3] I; PU I/O PIO1_16 — General purpose digital input/output pin. - I RI — Ring Indicator input for USART. - I CT16B0_CAP0 — Capture input 0 for 16-bit timer 0. PIO1_17/CT16B0_CAP1/ RXD - - - 23 [3] I; PU I/O PIO1_17 — General purpose digital input/output pin. - I CT16B0_CAP1 — Capture input 1 for 16-bit timer 0. - I RXD — Receiver input for USART. PIO1_18/CT16B1_CAP1/ TXD - - - 28 [3] I; PU I/O PIO1_18 — General purpose digital input/output pin. - I CT16B1_CAP1 — Capture input 1 for 16-bit timer 1. - O TXD — Transmitter output for USART. PIO1_19/DTR/SSEL1 1 B1 2 3 [3] I; PU I/O PIO1_19 — General purpose digital input/output pin. - O DTR — Data Terminal Ready output for USART. - I/O SSEL1 — Slave select for SSP1. PIO1_20/DSR/SCK1 - H1 13 18 [3] I; PU I/O PIO1_20 — General purpose digital input/output pin. - I DSR — Data Set Ready input for USART. - I/O SCK1 — Serial clock for SSP1. PIO1_21/DCD/MISO1 - G8 26 35 [3] I; PU I/O PIO1_21 — General purpose digital input/output pin. - I DCD — Data Carrier Detect input for USART. - I/O MISO1 — Master In Slave Out for SSP1. PIO1_22/RI/MOSI1 - A7 38 51 [3] I; PU I/O PIO1_22 — General purpose digital input/output pin. - I RI — Ring Indicator input for USART. - I/O MOSI1 — Master Out Slave In for SSP1. PIO1_23/CT16B1_MAT1/ SSEL1 - H4 18 24 [3] I; PU I/O PIO1_23 — General purpose digital input/output pin. - O CT16B1_MAT1 — Match output 1 for 16-bit timer 1. - I/O SSEL1 — Slave select for SSP1. PIO1_24/CT32B0_MAT0 - G6 21 27 [3] I; PU I/O PIO1_24 — General purpose digital input/output pin. - O CT32B0_MAT0 — Match output 0 for 32-bit timer 0. PIO1_25/CT32B0_MAT1 - A1 1 2 [3] I; PU I/O PIO1_25 — General purpose digital input/output pin. - O CT32B0_MAT1 — Match output 1 for 32-bit timer 0. PIO1_26/CT32B0_MAT2/ RXD/IOH_19 - G2 11 14 [3] I; PU I/O PIO1_26 — General purpose digital input/output pin. - O CT32B0_MAT2 — Match output 2 for 32-bit timer 0. - I RXD — Receiver input for USART. - I/O IOH_19 — I/O Handler input/output 19. (LPC11U37HFBD64/401 only.) PIO1_27/CT32B0_MAT3/ TXD/IOH_20 - G1 12 15 [3] I; PU I/O PIO1_27 — General purpose digital input/output pin. - O CT32B0_MAT3 — Match output 3 for 32-bit timer 0. - O TXD — Transmitter output for USART. - I/O IOH_20 — I/O Handler input/output 20. (LPC11U37HFBD64/401 only.) Table 3. Pin description Symbol Pin HVQFN33 Pin TFBGA48 Pin LQFP48 Pin LQFP64 Reset state [1] Type Description LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 16 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller [1] Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; IA = inactive, no pull-up/down enabled; F = floating; If the pins are not used, tie floating pins to ground or power to minimize power consumption. [2] 5 V tolerant pad. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset the chip and wake up from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down mode. See Figure 32 for the reset pad configuration. [3] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 31). [4] I2C-bus pin compliant with the I2C-bus specification for I2C standard mode, I2C Fast-mode, and I2C Fast-mode Plus. The pin requires an external pull-up to provide output functionality. When power is switched off, this pin is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [5] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 31); includes high-current output driver. [6] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input. When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant (see Figure 31); includes digital input glitch filter. [7] Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). This pad is not 5 V tolerant. [8] When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). Leave XTALOUT floating. PIO1_28/CT32B0_CAP0/ SCLK - H7 24 31 [3] I; PU I/O PIO1_28 — General purpose digital input/output pin. - I CT32B0_CAP0 — Capture input 0 for 32-bit timer 0. - I/O SCLK — Serial clock input/output for USART in synchronous mode. PIO1_29/SCK0/ CT32B0_CAP1 - D7 31 41 [3] I; PU I/O PIO1_29 — General purpose digital input/output pin. - I/O SCK0 — Serial clock for SSP0. - I CT32B0_CAP1 — Capture input 1 for 32-bit timer 0. PIO1_31 - - 25 - [3] I; PU I/O PIO1_31 — General purpose digital input/output pin. USB_DM 13 G5 19 25 [7] F - USB_DM — USB bidirectional D line. USB_DP 14 H5 20 26 [7] F - USB_DP — USB bidirectional D+ line. XTALIN 4 D1 6 8 [8] - - Input to the oscillator circuit and internal clock generator circuits. Input voltage must not exceed 1.8 V. XTALOUT 5 E1 7 9 [8] - - Output from the oscillator amplifier. VDD 6; 29 B4; E2 8; 44 10; 33; 48; 58 - - Supply voltage to the internal regulator, the external rail, and the ADC. Also used as the ADC reference voltage. VSS 33 B5; D2 5; 41 7; 54 - - Ground. Table 3. Pin description Symbol Pin HVQFN33 Pin TFBGA48 Pin LQFP48 Pin LQFP64 Reset state [1] Type Description LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 17 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 7. Functional description 7.1 On-chip flash programming memory The LPC11U3x contain up to 128 kB on-chip flash program memory. The flash can be programmed using In-System Programming (ISP) or In-Application Programming (IAP) via the on-chip boot loader software. The flash memory is divided into 4 kB sectors with each sector consisting of 16 pages. Individual pages can be erased using the IAP erase page command. 7.2 EEPROM The LPC11U3x contain 4 kB of on-chip byte-erasable and byte-programmable EEPROM data memory. The EEPROM can be programmed using In-Application Programming (IAP) via the on-chip boot loader software. 7.3 SRAM The LPC11U3x contain a total of 8 kB, 10 kB, or 12 kB on-chip static RAM memory. On the LPC11U37HFBD64/401, the 2 kB SRAM1 region at location 0x2000 0000 to 0x2000 07FFF is used for the I/O Handler software library. Do not use this memory location for data or other user code. 7.4 On-chip ROM The on-chip ROM contains the boot loader and the following Application Programming Interfaces (APIs): • In-System Programming (ISP) and In-Application Programming (IAP) support for flash including IAP erase page command. • IAP support for EEPROM • USB API • Power profiles for configuring power consumption and PLL settings • 32-bit integer division routines 7.5 Memory map The LPC11U3x incorporates several distinct memory regions, shown in the following figures. Figure 6 shows the overall map of the entire address space from the user program viewpoint following reset. The interrupt vector area supports address remapping. The AHB (Advanced High-performance Bus) peripheral area is 2 MB in size and is divided to allow for up to 128 peripherals. The APB (Advanced Peripheral Bus) peripheral area is 512 kB in size and is divided to allow for up to 32 peripherals. Each peripheral of either type is allocated 16 kB of space. This addressing scheme allows simplifying the address decoding for each peripheral. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 18 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 7.6 Nested Vectored Interrupt Controller (NVIC) The Nested Vectored Interrupt Controller (NVIC) is part of the Cortex-M0. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.6.1 Features • Controls system exceptions and peripheral interrupts. • In the LPC11U3x, the NVIC supports 24 vectored interrupts. Fig 6. LPC11U3x memory map APB peripherals 0x4000 4000 0x4000 8000 0x4000 C000 0x4001 0000 0x4001 8000 0x4002 0000 0x4002 8000 0x4003 8000 0x4003 C000 0x4004 0000 0x4004 4000 0x4004 8000 0x4004 C000 0x4004 C000 0x4005 8000 0x4005 C000 0x4006 0000 0x4006 4000 0x4008 0000 0x4002 4000 0x4001 C000 0x4001 4000 0x4000 0000 WWDT 32-bit counter/timer 0 32-bit counter/timer 1 ADC USART/SMART CARD PMU I2C-bus 20 - 21 reserved 10 - 13 reserved reserved reserved 25 - 31 reserved 0 1 2 3 4 5 6 7 8 9 16 15 14 17 18 reserved reserved 0 GB 0x0000 0000 0.5 GB 4 GB 1 GB 0x1000 0000 0x1FFF 0000 0x1FFF 4000 0x2000 0000 0x5000 0000 0x5000 4000 0xFFFF FFFF reserved reserved reserved 2 kB USB RAM (LPC11U34/421 LPC11U35/401/501 LPC11U36/401/501 LPC11U37/401/501, LPC11U37H/401) reserved 0x4000 0000 0x4008 0000 0x4008 4000 APB peripherals USB GPIO 0x2000 4000 0x2000 4800 0x1000 2000 8 kB SRAM0 (LPC11U3x) LPC11U3x 0x0000 A000 40 kB on-chip flash (LPC11U34/311) 0x0000 C000 48 kB on-chip flash (LPC11U34/421) 0x0001 0000 64 kB on-chip flash (LPC11U35) 0x0001 8000 96 kB on-chip flash (LPC11U36) 0x0002 0000 128 kB on-chip flash (LPC11U37/7H) 16 kB boot ROM 0x0000 0000 0x0000 00C0 active interrupt vectors 002aag813 reserved reserved SSP0 SSP1 16-bit counter/timer 1 16-bit counter/timer 0 IOCON system control 19 GPIO interrupts 22 23 GPIO GROUP0 INT 24 GPIO GROUP1 INT flash/EEPROM controller 0xE000 0000 0xE010 0000 private peripheral bus 2 kB SRAM1 (LPC11U35/501 LPC11U37/501) I/O Handler code area for LPC11U37HFBD64/401 0x2000 0800 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 19 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller • Four programmable interrupt priority levels, with hardware priority level masking. • Software interrupt generation. 7.6.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but can have several interrupt flags. Individual interrupt flags can also represent more than one interrupt source. 7.7 IOCON block The IOCON block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Connect peripherals to the appropriate pins before activating the peripheral and before enabling any related interrupt. Activity of any enabled peripheral function that is not mapped to a related pin is treated as undefined. 7.7.1 Features • Programmable pull-up, pull-down, or repeater mode. • All GPIO pins (except PIO0_4 and PIO0_5) are pulled up to 3.3 V (VDD = 3.3 V) if their pull-up resistor is enabled. • Programmable pseudo open-drain mode. • Programmable 10 ns glitch filter on pins PIO0_22, PIO0_23, and PIO0_11 to PIO0_16. The glitch filter is turned on by default. • Programmable hysteresis. • Programmable input inverter. 7.8 General-Purpose Input/Output GPIO The GPIO registers control device pin functions that are not connected to a specific peripheral function. Pins can be dynamically configured as inputs or outputs. Multiple outputs can be set or cleared in one write operation. LPC11U3x use accelerated GPIO functions: • GPIO registers are a dedicated AHB peripheral so that the fastest possible I/O timing can be achieved. • Entire port value can be written in one instruction. Any GPIO pin providing a digital function can be programmed to generate an interrupt on a level, a rising or falling edge, or both. The GPIO block consists of three parts: 1. The GPIO ports. 2. The GPIO pin interrupt block to control eight GPIO pins selected as pin interrupts. 3. Two GPIO group interrupt blocks to control two combined interrupts from all GPIO pins. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 20 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 7.8.1 Features • GPIO pins can be configured as input or output by software. • All GPIO pins default to inputs with interrupt disabled at reset. • Pin registers allow pins to be sensed and set individually. • Up to eight GPIO pins can be selected from all GPIO pins to create an edge- or level-sensitive GPIO interrupt request. • Any pin or pins in each port can trigger a port interrupt. 7.9 USB interface The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot-plugging and dynamic configuration of the devices. The host controller initiates all transactions. The LPC11U3x USB interface consists of a full-speed device controller with on-chip PHY (PHYsical layer) for device functions. Remark: Configure the LPC11U3x in default power mode with the power profiles before using the USB (see Section 7.18.5.1). Do not use the USB with the part in performance, efficiency, or low-power mode. 7.9.1 Full-speed USB device controller The device controller enables 12 Mbit/s data exchange with a USB Host controller. It consists of a register interface, serial interface engine, and endpoint buffer memory. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. If enabled, an interrupt is generated. 7.9.1.1 Features • Dedicated USB PLL available. • Fully compliant with USB 2.0 specification (full speed). • Supports 10 physical (5 logical) endpoints including one control endpoint. • Single and double buffering supported. • Each non-control endpoint supports bulk, interrupt, or isochronous endpoint types. • Supports wake-up from Deep-sleep mode and Power-down mode on USB activity and remote wake-up. • Supports SoftConnect. 7.10 I/O Handler (LPC11U37HFBD64/401 only) The I/O Handler is a software library-supported hardware engine for emulating serial interfaces and off-loading the CPU for processing-intensive functions. The I/O Handler can emulate, among others, DMA and serial interfaces such as UART, I2C, or I2S with no or very low additional CPU load. The software libraries are available with supporting LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 21 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller application notes from NXP (see http://www.LPCware.com.) LPCXpresso, Keil, and IAR IDEs are supported. I/O Handler library code must be executed from the memory area 0x2000 0000 to 0x2000 07FF. This memory is not available for other use. For application examples, see Section 11.8 “I/O Handler software library applications”. Each I/O Handler library uses a specific subset of I/O Handler pins and in some cases other pins and peripherals such as the counter/timers. 7.11 USART The LPC11U3x contains one USART. The USART includes full modem control, support for synchronous mode, and a smart card interface. The RS-485/9-bit mode allows both software address detection and automatic address detection using 9-bit mode. The USART uses a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 7.11.1 Features • Maximum USART data bit rate of 3.125 Mbit/s. • 16 byte receive and transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Fractional divider for baud rate control, auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • Support for RS-485/9-bit mode. • Support for modem control. • Support for synchronous mode. • Includes smart card interface. 7.12 SSP serial I/O controller The SSP controllers operate on a SSP, 4-wire SSI, or Microwire bus. The controller can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bit to 16 bit of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.12.1 Features • Maximum SSP speed of 25 Mbit/s (master) or 4.17 Mbit/s (slave) (in SSP mode) • Compatible with Motorola SPI (Serial Peripheral Interface), 4-wire Texas Instruments SSI (Serial Synchronous Interface), and National Semiconductor Microwire buses • Synchronous serial communication • Master or slave operation LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 22 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller • 8-frame FIFOs for both transmit and receive • 4-bit to 16-bit frame 7.13 I2C-bus serial I/O controller The LPC11U3x contain one I2C-bus controller. The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial CLock line (SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, and more than one bus master connected to the interface can be controlled the bus. 7.13.1 Features • The I2C-interface is an I2C-bus compliant interface with open-drain pins. The I2C-bus interface supports Fast-mode Plus with bit rates up to 1 Mbit/s. • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • The I2C-bus controller supports multiple address recognition and a bus monitor mode. 7.14 10-bit ADC The LPC11U3x contains one ADC. It is a single 10-bit successive approximation ADC with eight channels. 7.14.1 Features • 10-bit successive approximation ADC. • Input multiplexing among 8 pins. • Power-down mode. • Measurement range 0 V to VDD. • 10-bit conversion time  2.44 s (up to 400 kSamples/s). • Burst conversion mode for single or multiple inputs. • Optional conversion on transition of input pin or timer match signal. • Individual result registers for each ADC channel to reduce interrupt overhead. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 23 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 7.15 General purpose external event counter/timers The LPC11U3x includes two 32-bit counter/timers and two 16-bit counter/timers. The counter/timer is designed to count cycles of the system derived clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. Each counter/timer also includes one capture input to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.15.1 Features • A 32-bit/16-bit timer/counter with a programmable 32-bit/16-bit prescaler. • Counter or timer operation. • Up to two capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event can also generate an interrupt. • Four match registers per timer that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. • The timer and prescaler can be configured to be cleared on a designated capture event. This feature permits easy pulse-width measurement by clearing the timer on the leading edge of an input pulse and capturing the timer value on the trailing edge. 7.16 System tick timer The ARM Cortex-M0 includes a system tick timer (SYSTICK) that is intended to generate a dedicated SYSTICK exception at a fixed time interval (typically 10 ms). 7.17 Windowed WatchDog Timer (WWDT) The purpose of the WWDT is to prevent an unresponsive system state. If software fails to update the watchdog within a programmable time window, the watchdog resets the microcontroller 7.17.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period. • Optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. • Optional warning interrupt can be generated at a programmable time before watchdog time-out. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 24 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller • Software enables the WWDT, but a hardware reset or a watchdog reset/interrupt is required to disable the WWDT. • Incorrect feed sequence causes reset or interrupt, if enabled. • Flag to indicate watchdog reset. • Programmable 24-bit timer with internal prescaler. • Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  224  4) in multiples of Tcy(WDCLK)  4. • The Watchdog Clock (WDCLK) source can be selected from the IRC or the dedicated watchdog oscillator (WDO). The clock source selection provides a wide range of potential timing choices of watchdog operation under different power conditions. 7.18 Clocking and power control 7.18.1 Integrated oscillators The LPC11U3x include three independent oscillators: the system oscillator, the Internal RC oscillator (IRC), and the watchdog oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Following reset, the LPC11U3x operates from the internal RC oscillator until software switches to a different clock source. The IRC allows the system to operate without any external crystal and the bootloader code to operate at a known frequency. See Figure 7 for an overview of the LPC11U3x clock generation. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 25 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 7.18.1.1 Internal RC oscillator The IRC can be used as the clock source for the WDT, and/or as the clock that drives the system PLL and then the CPU. The nominal IRC frequency is 12 MHz. Upon power-up, any chip reset, or wake-up from Deep power-down mode, the LPC11U3x use the IRC as the clock source. Software can later switch to one of the other available clock sources. Fig 7. LPC11U3x clocking generation block diagram system oscillator watchdog oscillator IRC oscillator USB PLL USBPLLCLKSEL (USB clock select) SYSTEM CLOCK DIVIDER SYSAHBCLKCTRLn (AHB clock enable) CPU, system control, PMU memories, peripheral clocks SSP0 PERIPHERAL CLOCK DIVIDER SSP0 SSP1 PERIPHERAL CLOCK DIVIDER SSP1 USART PERIPHERAL CLOCK DIVIDER UART WDT WDCLKSEL (WDT clock select) USB 48 MHz CLOCK DIVIDER USB USBUEN (USB clock update enable) watchdog oscillator IRC oscillator system oscillator CLKOUT PIN CLOCK DIVIDER CLKOUT pin CLKOUTUEN (CLKOUT update enable) 002aaf892 system clock SYSTEM PLL IRC oscillator system oscillator watchdog oscillator MAINCLKSEL (main clock select) SYSPLLCLKSEL (system PLL clock select) main clock IRC oscillator n LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 26 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 7.18.1.2 System oscillator The system oscillator can be used as the clock source for the CPU, with or without using the PLL. On the LPC11U3x, use the system oscillator to provide the clock source to USB. The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the system PLL. 7.18.1.3 Watchdog oscillator The watchdog oscillator can be used as a clock source that directly drives the CPU, the watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency is programmable between 9.4 kHz and 2.3 MHz. The frequency spread over processing and temperature is 40 % (see also Table 13). 7.18.2 System PLL and USB PLL The LPC11U3x contain a system PLL and a dedicated PLL for generating the 48 MHz USB clock. The system and USB PLLs are identical. The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO operates in the range of 156 MHz to 320 MHz. To support this frequency range, an additional divider keeps the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider can be set to divide by 2, 4, 8, or 16 to produce the output clock. The PLL output frequency must be lower than 100 MHz. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset. Software can enable the PLL later. The program must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source. The PLL settling time is 100 s. 7.18.3 Clock output The LPC11U3x feature a clock output function that routes the IRC oscillator, the system oscillator, the watchdog oscillator, or the main clock to an output pin. 7.18.4 Wake-up process The LPC11U3x begin operation by using the 12 MHz IRC oscillator as the clock source at power-up and when awakened from Deep power-down mode . This mechanism allows chip operation to resume quickly. If the application uses the main oscillator or the PLL, software must enable these components and wait for them to stabilize. Only then can the system use the PLL and main oscillator as a clock source. 7.18.5 Power control The LPC11U3x support various power control features. There are four special modes of processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate can also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This power control mechanism allows a trade-off of power versus processing speed based on application requirements. In addition, a register is provided for shutting down the clocks to individual on-chip peripherals. This register allows fine-tuning of power LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 27 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Selected peripherals have their own clock divider which provides even better power control. 7.18.5.1 Power profiles The power consumption in Active and Sleep modes can be optimized for the application through simple calls to the power profile. The power configuration routine configures the LPC11U3x for one of the following power modes: • Default mode corresponding to power configuration after reset. • CPU performance mode corresponding to optimized processing capability. • Efficiency mode corresponding to optimized balance of current consumption and CPU performance. • Low-current mode corresponding to lowest power consumption. In addition, the power profile includes routines to select the optimal PLL settings for a given system clock and PLL input clock. Remark: When using the USB, configure the LPC11U3x in Default mode. 7.18.5.2 Sleep mode When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep mode does not need any special sequence but re-enabling the clock to the ARM core. In Sleep mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Sleep mode and can generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, by memory systems and related controllers, and by internal buses. 7.18.5.3 Deep-sleep mode In Deep-sleep mode, the LPC11U3x is in Sleep-mode and all peripheral clocks and all clock sources are off except for the IRC. The IRC output is disabled unless the IRC is selected as input to the watchdog timer. In addition all analog blocks are shut down and the flash is in stand-by mode. In Deep-sleep mode, the application can keep the watchdog oscillator and the BOD circuit running for self-timed wake-up and BOD protection. The LPC11U3x can wake up from Deep-sleep mode via reset, selected GPIO pins, a watchdog timer interrupt, or an interrupt generating USB port activity. Deep-sleep mode saves power and allows for short wake-up times. 7.18.5.4 Power-down mode In Power-down mode, the LPC11U3x is in Sleep-mode and all peripheral clocks and all clock sources are off except for watchdog oscillator if selected. In addition all analog blocks and the flash are shut down. In Power-down mode, the application can keep the BOD circuit running for BOD protection. The LPC11U3x can wake up from Power-down mode via reset, selected GPIO pins, a watchdog timer interrupt, or an interrupt generating USB port activity. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 28 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Power-down mode reduces power consumption compared to Deep-sleep mode at the expense of longer wake-up times. 7.18.5.5 Deep power-down mode In Deep power-down mode, power is shut off to the entire chip except for the WAKEUP pin. The LPC11U3x can wake up from Deep power-down mode via the WAKEUP pin. The LPC11U3x can be prevented from entering Deep power-down mode by setting a lock bit in the PMU block. Locking out Deep power-down mode enables the application to keep the watchdog timer or the BOD running at all times. When entering Deep power-down mode, an external pull-up resistor is required on the WAKEUP pin to hold it HIGH. Pull the RESET pin HIGH to prevent it from floating while in Deep power-down mode. 7.18.6 System control 7.18.6.1 Reset Reset has four sources on the LPC11U3x: the RESET pin, the Watchdog reset, power-on reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip reset by any source, once the operating voltage attains a usable level, starts the IRC and initializes the flash controller. A LOW-going pulse as short as 50 ns resets the part. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the boot block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. In Deep power-down mode, an external pull-up resistor is required on the RESET pin. 7.18.6.2 Brownout detection The LPC11U3x includes up to four levels for monitoring the voltage on the VDD pin. If this voltage falls below one of the selected levels, the BOD asserts an interrupt signal to the NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the NVIC to cause a CPU interrupt. Alternatively, software can monitor the signal by reading a dedicated status register. Four threshold levels can be selected to cause a forced reset of the chip. 7.18.6.3 Code security (Code Read Protection - CRP) CRP provides different levels of security in the system so that access to the on-chip flash and use of the Serial Wire Debugger (SWD) and In-System Programming (ISP) can be restricted. Programming a specific pattern into a dedicated flash location invokes CRP. IAP commands are not affected by the CRP. In addition, ISP entry via the PIO0_1 pin can be disabled without enabling CRP. For details, see the LPC11Uxx user manual. There are three levels of Code Read Protection: LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 29 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 1. CRP1 disables access to the chip via the SWD and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors cannot be erased. 2. CRP2 disables access to the chip via the SWD and only allows full flash erase and update using a reduced set of the ISP commands. 3. Running an application with level CRP3 selected, fully disables any access to the chip via the SWD pins and the ISP. This mode effectively disables ISP override using PIO0_1 pin as well. If necessary, the application must provide a flash update mechanism using IAP calls or using a call to the reinvoke ISP command to enable flash update via the USART. In addition to the three CRP levels, sampling of pin PIO0_1 for valid user code can be disabled. For details, see the LPC11Uxx user manual. 7.18.6.4 APB interface The APB peripherals are located on one APB bus. 7.18.6.5 AHBLite The AHBLite connects the CPU bus of the ARM Cortex-M0 to the flash memory, the main static RAM, and the ROM. 7.18.6.6 External interrupt inputs All GPIO pins can be level or edge sensitive interrupt inputs. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 30 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 7.19 Emulation and debugging Debug functions are integrated into the ARM Cortex-M0. Serial wire debug functions are supported in addition to a standard JTAG boundary scan. The ARM Cortex-M0 is configured to support up to four breakpoints and two watch points. The RESET pin selects between the JTAG boundary scan (RESET = LOW) and the ARM SWD debug (RESET = HIGH). The ARM SWD debug port is disabled while the LPC11U3x is in reset. To perform boundary scan testing, follow these steps: 1. Erase any user code residing in flash. 2. Power up the part with the RESET pin pulled HIGH externally. 3. Wait for at least 250 s. 4. Pull the RESET pin LOW externally. 5. Perform boundary scan operations. 6. Once the boundary scan operations are completed, assert the TRST pin to enable the SWD debug mode, and release the RESET pin (pull HIGH). Remark: The JTAG interface cannot be used for debug purposes. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 31 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 8. Limiting values [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. c) The limiting values are stress ratings only. Operating the part at these values is not recommended, and proper operation is not guaranteed. The conditions for functional operation are specified in Table 5. [2] Maximum/minimum voltage above the maximum operating voltage (see Table 5) and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device. [3] See Table 6 for maximum operating voltage. [4] VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down. [5] Including voltage on outputs in 3-state mode. [6] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details. [7] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD supply voltage (core and external rail) [2] 0.5 +4.6 V VI input voltage 5 V tolerant digital I/O pins; VDD  1.8 V [5][2] 0.5 +5.5 V VDD = 0 V 0.5 +3.6 V 5 V tolerant open-drain pins PIO0_4 and PIO0_5 [2][4] 0.5 +5.5 VIA analog input voltage pin configured as analog input [2] [3] 0.5 4.6 V IDD supply current per supply pin - 100 mA ISS ground current per ground pin - 100 mA Ilatch I/O latch-up current (0.5VDD) < VI < (1.5VDD); Tj < 125 C - 100 mA Tstg storage temperature non-operating [6] 65 +150 C Tj(max) maximum junction temperature - 150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W VESD electrostatic discharge voltage human body model; all pins [7]- +6500 V LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 32 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 9. Static characteristics Table 5. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD supply voltage (core and external rail) [2] 1.8 3.3 3.6 V IDD supply current Active mode; VDD = 3.3 V; Tamb = 25 C; code while(1){} executed from flash; system clock = 12 MHz [3][4][5] [6][7][8] - 2 - mA system clock = 50 MHz [4][5][6] [7][8][9] - 7 - mA Sleep mode; VDD = 3.3 V; Tamb = 25 C; system clock = 12 MHz [3][4][5] [6][7][8] - 1 - mA Deep-sleep mode; VDD = 3.3 V; Tamb = 25 C [4][7]- 300 - A Power-down mode; VDD = 3.3 V; Tamb = 25 C - 2 - A Deep power-down mode; VDD = 3.3 V; Tamb = 25 C [10]- 220 - nA Standard port pins, RESET IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD; on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/down resistors disabled - 0.5 10 nA VI input voltage pin configured to provide a digital function; VDD  1.8 V [11] [12] 0 - 5.0 V VDD = 0 V 0 - 3.6 V VO output voltage output active 0 - VDD V VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.4 - V VOH HIGH-level output voltage 2.0 V  VDD  3.6 V; IOH = 4 mA VDD  0.4- - V 1.8 V  VDD < 2.0 V; IOH = 3 mA VDD  0.4- - V VOL LOW-level output voltage 2.0 V  VDD  3.6 V; IOL = 4 mA - - 0.4 V 1.8 V  VDD < 2.0 V; IOL = 3 mA - - 0.4 V IOH HIGH-level output current VOH = VDD  0.4 V; 2.0 V  VDD  3.6 V 4 - - mA 1.8 V  VDD < 2.0 V 3 - - mA LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 33 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller IOL LOW-level output current VOL = 0.4 V 2.0 V  VDD  3.6 V 4 - - mA 1.8 V  VDD < 2.0 V 3 - - mA IOHS HIGH-level short-circuit output current VOH = 0 V [13]- - 45 mA IOLS LOW-level short-circuit output current VOL = VDD [13]- - 50 mA Ipd pull-down current VI = 5 V 10 50 150 A Ipu pull-up current VI = 0 V; 2.0 V  VDD  3.6 V 15 50 85 A 1.8 V  VDD < 2.0 V 10 50 85 A VDD < VI < 5 V 0 0 0 A High-drive output pin (PIO0_7) IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD; on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/down resistors disabled - 0.5 10 nA VI input voltage pin configured to provide a digital function; VDD  1.8 V [11] [12] 0 - 5.0 V VDD = 0 V 0 - 3.6 V VO output voltage output active 0 - VDD V VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage 2.5 V  VDD  3.6 V; IOH = 20 mA VDD  0.4- - V 1.8 V  VDD < 2.5 V; IOH = 12 mA VDD  0.4- - V VOL LOW-level output voltage 2.0 V  VDD  3.6 V; IOL = 4 mA - - 0.4 V 1.8 V  VDD < 2.0 V; IOL = 3 mA - - 0.4 V IOH HIGH-level output current VOH = VDD  0.4 V; 2.5 V  VDD  3.6 V 20 - - mA 1.8 V  VDD < 2.5 V 12 - - mA IOL LOW-level output current VOL = 0.4 V 2.0 V  VDD  3.6 V 4 - - mA 1.8 V  VDD < 2.0 V 3 - - mA IOLS LOW-level short-circuit output current VOL = VDD [13]- - 50 mA Ipd pull-down current VI = 5 V 10 50 150 A Table 5. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 34 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Ipu pull-up current VI = 0 V 2.0 V  VDD  3.6 V 15 50 85 A 1.8 V  VDD < 2.0 V 10 50 85 A VDD < VI < 5 V 0 0 0 A I2C-bus pins (PIO0_4 and PIO0_5) VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.05VDD - V IOL LOW-level output current VOL = 0.4 V; I2C-bus pins configured as standard mode pins 2.0 V  VDD  3.6 V 3.5 - - mA 1.8 V  VDD < 2.0 V 3 - - IOL LOW-level output current VOL = 0.4 V; I2C-bus pins configured as Fast-mode Plus pins 2.0 V  VDD  3.6 V 20 - - mA 1.8 V  VDD < 2.0 V 16 - - ILI input leakage current VI = VDD [14]- 2 4 A VI = 5 V - 10 22 A Oscillator pins Vi(xtal) crystal input voltage 0.5 1.8 1.95 V Vo(xtal) crystal output voltage 0.5 1.8 1.95 V USB pins IOZ OFF-state output current 0 V < VI < 3.3 V [2]- - 10 A VBUS bus supply voltage [2]- - 5.25 V VDI differential input sensitivity voltage (D+)  (D) [2] 0.2 - - V VCM differential common mode voltage range includes VDI range [2] 0.8 - 2.5 V Vth(rs)se single-ended receiver switching threshold voltage [2] 0.8 - 2.0 V VOL LOW-level output voltage for low-/full-speed; RL of 1.5 k to 3.6 V [2]- - 0.18 V VOH HIGH-level output voltage driven; for low-/full-speed; RL of 15 k to GND [2] 2.8 - 3.5 V Ctrans transceiver capacitance pin to GND [2]- - 20 pF ZDRV driver output impedance for driver which is not high-speed capable with 33  series resistor; steady state drive [15][2] 36 - 44.1  Table 5. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 35 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] For USB operation 3.0 V  VDD  3.6 V. Guaranteed by design. [3] IRC enabled; system oscillator disabled; system PLL disabled. [4] IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled. [5] BOD disabled. [6] All peripherals disabled in the AHBCLKCTRL register. Peripheral clocks to USART, SSP0/1 disabled in the SYSCON block. [7] USB_DP and USB_DM pulled LOW externally. [8] Low-current mode PWR_LOW_CURRENT selected when running the set_power routine in the power profiles. [9] IRC disabled; system oscillator enabled; system PLL enabled. [10] WAKEUP pin pulled HIGH externally. An external pull-up resistor is required on the RESET pin for the Deep power-down mode. [11] Including voltage on outputs in 3-state mode. [12] 3-state outputs go into 3-state mode in Deep power-down mode. [13] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [14] To VSS. [15] Includes external resistors of 33   1 % on USB_DP and USB_DM. Pin capacitance Cio input/output capacitance pins configured for analog function - - 7.1 pF I2C-bus pins (PIO0_4 and PIO0_5) - - 2.5 pF pins configured as GPIO - - 2.8 pF Table 5. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 36 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller [1] The ADC is monotonic, there are no missing codes. [2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 8. [3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 8. [4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 8. [5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 8. [6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 8. [7] Tamb = 25 C; maximum sampling frequency fs = 400 kSamples/s and analog input capacitance Cia = 1 pF. [8] Input resistance Ri depends on the sampling frequency fs: Ri = 1 / (fs  Cia). Table 6. ADC static characteristics Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz, VDD = 2.5 V to 3.6 V. Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDD V Cia analog input capacitance - - 1 pF ED differential linearity error [1][2]- - 1 LSB EL(adj) integral non-linearity [3]- - 1.5 LSB EO offset error [4]- - 3.5 LSB EG gain error [5]- - 0.6 % ET absolute error [6]- - 4 LSB Rvsi voltage source interface resistance - - 40 k Ri input resistance [7][8]- - 2.5 M LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 37 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 8. ADC characteristics 002aaf426 1023 1022 1021 1020 1019 (2) (1) 1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024 7 6 5 4 3 2 1 0 1018 (5) (4) (3) 1 LSB (ideal) code out VDD − VSS 1024 offset error EO gain error EG offset error EO VIA (LSBideal) 1 LSB = LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 38 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 9.1 BOD static characteristics [1] Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see the LPC11Uxx user manual. 9.2 Power consumption Power measurements in Active, Sleep, and Deep-sleep modes were performed under the following conditions (see the LPC11Uxx user manual): • Configure all pins as GPIO with pull-up resistor disabled in the IOCON block. • Configure GPIO pins as outputs using the GPIOnDIR registers. • Write 0 to all GPIOnDATA registers to drive the outputs LOW. Table 7. BOD static characteristics[1] Tamb = 25 C. Symbol Parameter Conditions Min Typ Max Unit Vth threshold voltage interrupt level 1 assertion - 2.22 - V de-assertion - 2.35 - V interrupt level 2 assertion - 2.52 - V de-assertion - 2.66 - V interrupt level 3 assertion - 2.80 - V de-assertion - 2.90 - V reset level 0 assertion - 1.46 - V de-assertion - 1.63 - V reset level 1 assertion - 2.06 - V de-assertion - 2.15 - V reset level 2 assertion - 2.35 - V de-assertion - 2.43 - V reset level 3 assertion - 2.63 - V de-assertion - 2.71 - V LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 39 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Conditions: Tamb = 25 C; Active mode entered executing code while(1){} from flash; internal pull-up resistors disabled; BOD disabled; all peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled; low-current mode; USB_DP and USB_DM pulled LOW externally. (1) System oscillator and system PLL disabled; IRC enabled. (2) System oscillator and system PLL enabled; IRC disabled. Fig 9. Typical supply current versus regulator supply voltage VDD in active mode Conditions: VDD = 3.3 V; Active mode entered executing code while(1){} from flash; internal pull-up resistors disabled; BOD disabled; all peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled; low-current mode; USB_DP and USB_DM pulled LOW externally. (1) System oscillator and system PLL disabled; IRC enabled. (2) System oscillator and system PLL enabled; IRC disabled. Fig 10. Typical supply current versus temperature in Active mode VDD (V) 1.8 2.4 3.0 3.6 002aag749 3 6 9 IDD (mA) 0 12 MHz(1) 24 MHz(2) 36 MHz(2) 48 MHz(2) temperature (°C) -40 -15 10 35 60 85 002aag750 3 6 9 IDD (mA) 0 12 MHz(1) 24 MHz(2) 36 MHz(2) 48 MHz(2) LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 40 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Conditions: VDD = 3.3 V; Sleep mode entered from flash; internal pull-up resistors disabled; BOD disabled; all peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled; low-current mode; USB_DP and USB_DM pulled LOW externally. (1) System oscillator and system PLL disabled; IRC enabled. (2) System oscillator and system PLL enabled; IRC disabled. Fig 11. Typical supply current versus temperature in Sleep mode Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG register; USB_DP and USB_DM pulled LOW externally. Fig 12. Typical supply current versus temperature in Deep-sleep mode 002aag751 temperature (°C) -40 -15 10 35 60 85 1 3 2 4 IDD (mA) 0 12 MHz(1) 36 MHz(2) 48 MHz(2) 24 MHz(2) 002aag745 temperature (°C) -40 -15 10 35 60 85 355 375 365 385 IDD (μA) 345 VDD = 3.6 V VDD = 3.3 V VDD = 2.0 V VDD = 1.8 V LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 41 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 9.3 Peripheral power consumption The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both registers and no code is executed. Measured on a typical sample at Tamb = 25 C. Unless noted otherwise, the system oscillator and PLL are running in both measurements. The supply currents are shown for system clock frequencies of 12 MHz and 48 MHz. Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG register; USB_DP and USB_DM pulled LOW externally. Fig 13. Typical supply current versus temperature in Power-down mode Fig 14. Typical supply current versus temperature in Deep power-down mode 002aag746 temperature (°C) -40 -15 10 35 60 85 5 15 10 20 IDD (μA) 0 VDD = 3.6 V, 3.3 V VDD = 2.0 V VDD = 1.8 V 002aag747 temperature (°C) -40 -15 10 35 60 85 0.2 0.6 0.4 0.8 IDD (μA) 0 VDD = 3.6 V VDD = 3.3 V VDD = 2.0 V VDD = 1.8 V LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 42 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Table 8. Power consumption for individual analog and digital blocks Peripheral Typical supply current in mA Notes n/a 12 MHz 48 MHz IRC 0.27 - - System oscillator running; PLL off; independent of main clock frequency. System oscillator at 12 MHz 0.22 - - IRC running; PLL off; independent of main clock frequency. Watchdog oscillator at 500 kHz/2 0.004 - - System oscillator running; PLL off; independent of main clock frequency. BOD 0.051 - - Independent of main clock frequency. Main PLL - 0.21 - - ADC - 0.08 0.29 - CLKOUT - 0.12 0.47 Main clock divided by 4 in the CLKOUTDIV register. CT16B0 - 0.02 0.06 - CT16B1 - 0.02 0.06 - CT32B0 - 0.02 0.07 - CT32B1 - 0.02 0.06 - GPIO - 0.23 0.88 GPIO pins configured as outputs and set to LOW. Direction and pin state are maintained if the GPIO is disabled in the SYSAHBCLKCFG register. IOCONFIG - 0.03 0.10 - I2C - 0.04 0.13 - ROM - 0.04 0.15 - SPI0 - 0.12 0.45 - SPI1 - 0.12 0.45 - UART - 0.22 0.82 - WWDT - 0.02 0.06 Main clock selected as clock source for the WDT. USB - - 1.2 - LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 43 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 9.4 Electrical pin characteristics Conditions: VDD = 3.3 V; on pin PIO0_7. Fig 15. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level output current IOH. Conditions: VDD = 3.3 V; on pins PIO0_4 and PIO0_5. Fig 16. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus LOW-level output voltage VOL IOH (mA) 0 10 20 30 40 50 60 002aae990 2.8 2.4 3.2 3.6 VOH (V) 2 T = 85 °C 25 °C −40 °C VOL (V) 0 0.2 0.4 0.6 002aaf019 20 40 60 IOL (mA) 0 T = 85 °C 25 °C −40 °C LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 44 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Conditions: VDD = 3.3 V; standard port pins and PIO0_7. Fig 17. Typical LOW-level output current IOL versus LOW-level output voltage VOL Conditions: VDD = 3.3 V; standard port pins. Fig 18. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH VOL (V) 0 0.2 0.4 0.6 002aae991 5 10 15 IOL (mA) 0 T = 85 °C 25 °C −40 °C IOH (mA) 0 8 16 24 002aae992 2.8 2.4 3.2 3.6 VOH (V) 2 T = 85 °C 25 °C −40 °C LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 45 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Conditions: VDD = 3.3 V; standard port pins. Fig 19. Typical pull-up current Ipu versus input voltage VI Conditions: VDD = 3.3 V; standard port pins. Fig 20. Typical pull-down current Ipd versus input voltage VI VI (V) 0 1 2 3 4 5 002aae988 −30 −50 −10 10 Ipu (μA) −70 T = 85 °C 25 °C −40 °C VI (V) 0 1 2 3 4 5 002aae989 40 20 60 80 Ipd (μA) 0 T = 85 °C 25 °C −40 °C LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 46 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 10. Dynamic characteristics 10.1 Flash memory [1] Number of program/erase cycles. [2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes. 10.2 External clock [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. Table 9. Flash characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Nendu endurance [1] 10000 100000 - cycles tret retention time powered 10 - - years unpowered 20 - - years ter erase time sector or multiple consecutive sectors 95 100 105 ms tprog programming time [2] 0.95 1 1.05 ms Table 10. EEPROM characteristics Tamb = 40 C to +85C; VDD = 2.7 V to 3.6 V. Based on JEDEC NVM qualification. Failure rate < 10 ppm for parts as specified below. Symbol Parameter Conditions Min Typ Max Unit Nendu endurance 100000 1000000 - cycles tret retention time powered 100 200 - years unpowered 150 300 - years tprog programming time 64 bytes - 2.9 - ms Table 11. Dynamic characteristic: external clock Tamb = 40 C to +85 C; VDD over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk)  0.4 - - ns tCLCX clock LOW time Tcy(clk)  0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 47 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 10.3 Internal oscillators [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [1] Typical ratings are not guaranteed. The values listed are at nominal supply voltages. Fig 21. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) tCHCL tCLCX tCHCX Tcy(clk) tCLCH 002aaa907 Table 12. Dynamic characteristics: IRC Tamb = 40 C to +85 C; 2.7 V  VDD  3.6 V[1]. Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 11.88 12 12.12 MHz Conditions: Frequency values are typical values. 12 MHz  1 % accuracy is guaranteed for 2.7 V  VDD  3.6 V and Tamb = 40 C to +85 C. Variations between parts may cause the IRC to fall outside the 12 MHz  1 % accuracy specification for voltages below 2.7 V. Fig 22. Internal RC oscillator frequency versus temperature Table 13. Dynamic characteristics: Watchdog oscillator Symbol Parameter Conditions Min Typ[1] Max Unit fosc(int) internal oscillator frequency DIVSEL = 0x1F, FREQSEL = 0x1 in the WDTOSCCTRL register; [2][3]- 9.4 - kHz DIVSEL = 0x00, FREQSEL = 0xF in the WDTOSCCTRL register [2][3] - 2300 - kHz 002aaf403 11.95 12.05 12.15 f (MHz) 11.85 temperature (°C) −40 −15 10 35 60 85 VDD = 3.6 V 3.3 V 3.0 V 2.7 V 2.4 V 2.0 V LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 48 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller [2] The typical frequency spread over processing and temperature (Tamb = 40 C to +85 C) is 40 %. [3] See the LPC11Uxx user manual. 10.4 I/O pins [1] Applies to standard port pins and RESET pin. 10.5 I2C-bus [1] See the I2C-bus specification UM10204 for details. [2] Parameters are valid over operating temperature range unless otherwise specified. [3] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge. [4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. [5] Cb = total capacitance of one bus line in pF. [6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. Table 14. Dynamic characteristics: I/O pins[1] Tamb = 40 C to +85 C; 3.0 V  VDD  3.6 V. Symbol Parameter Conditions Min Typ Max Unit tr rise time pin configured as output 3.0 - 5.0 ns tf fall time pin configured as output 2.5 - 5.0 ns Table 15. Dynamic characteristic: I2C-bus pins[1] Tamb = 40 C to +85 C.[2] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 400 kHz Fast-mode Plus 0 1 MHz tf fall time [4][5][6][7] of both SDA and SCL signals Standard-mode - 300 ns Fast-mode 20 + 0.1  Cb 300 ns Fast-mode Plus - 120 ns tLOW LOW period of the SCL clock Standard-mode 4.7 - s Fast-mode 1.3 - s Fast-mode Plus 0.5 - s tHIGH HIGH period of the SCL clock Standard-mode 4.0 - s Fast-mode 0.6 - s Fast-mode Plus 0.26 - s tHD;DAT data hold time [3][4][8] Standard-mode 0 - s Fast-mode 0 - s Fast-mode Plus 0 - s tSU;DAT data set-up time [9][10] Standard-mode 250 - ns Fast-mode 100 - ns Fast-mode Plus 50 - ns LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 49 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller [7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for this when considering bus timing. [8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or tVD;ACK by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock. [9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the acknowledge. [10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time. Fig 23. I2C-bus pins clock timing 002aaf425 tf 70 % SDA 30 % tf 70 % 30 % S 70 % 30 % 70 % 30 % tHD;DAT SCL 1 / fSCL 70 % 30 % 70 % 30 % tVD;DAT tHIGH tLOW tSU;DAT LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 50 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 10.6 SSP interface [1] Tcy(clk) = (SSPCLKDIV  (1 + SCR)  CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the main clock frequency fmain, the SPI peripheral clock divider (SSPCLKDIV), the SPI SCR parameter (specified in the SSP0CR0 register), and the SPI CPSDVSR parameter (specified in the SPI clock prescale register). [2] Tamb = 40 C to 85 C. [3] Tcy(clk) = 12  Tcy(PCLK). [4] Tamb = 25 C; for normal voltage supply range: VDD = 3.3 V. Table 16. Dynamic characteristics of SPI pins in SPI mode Symbol Parameter Conditions Min Typ Max Unit SPI master (in SPI mode) Tcy(clk) clock cycle time full-duplex mode [1] 50 - - ns when only transmitting [1] 40 ns tDS data set-up time in SPI mode 2.4 V  VDD  3.6 V [2] 15 - - ns 2.0 V  VDD < 2.4 V [2] 20 ns 1.8 V  VDD < 2.0 V [2] 24 - - ns tDH data hold time in SPI mode [2] 0 - - ns tv(Q) data output valid time in SPI mode [2] - - 10 ns th(Q) data output hold time in SPI mode [2] 0 - - ns SPI slave (in SPI mode) Tcy(PCLK) PCLK cycle time 20 - - ns tDS data set-up time in SPI mode [3][4] 0 - - ns tDH data hold time in SPI mode [3][4] 3  Tcy(PCLK) + 4 - - ns tv(Q) data output valid time in SPI mode [3][4] - - 3  Tcy(PCLK) + 11 ns th(Q) data output hold time in SPI mode [3][4] - - 2  Tcy(PCLK) + 5 ns LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 51 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 24. SSP master timing in SPI mode SCK (CPOL = 0) MOSI MISO Tcy(clk) tDS tDH tv(Q) DATA VALID DATA VALID th(Q) SCK (CPOL = 1) DATA VALID DATA VALID MOSI MISO tDS tDH DATA VALID DATA VALID th(Q) DATA VALID DATA VALID tv(Q) CPHA = 1 CPHA = 0 002aae829 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 52 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 25. SSP slave timing in SPI mode SCK (CPOL = 0) MOSI MISO Tcy(clk) tDS tDH tv(Q) DATA VALID DATA VALID th(Q) SCK (CPOL = 1) DATA VALID DATA VALID MOSI MISO tDS tDH tv(Q) DATA VALID DATA VALID th(Q) DATA VALID DATA VALID CPHA = 1 CPHA = 0 002aae830 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 53 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 10.7 USB interface [1] Characterized but not implemented as production test. Guaranteed by design. Table 17. Dynamic characteristics: USB pins (full-speed) CL = 50 pF; Rpu = 1.5 k on D+ to VDD; 3.0 V  VDD  3.6 V. Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 8.5 - 13.8 ns tf fall time 10 % to 90 % 7.7 - 13.7 ns tFRFM differential rise and fall time matching tr / tf - - 109 % VCRS output signal crossover voltage 1.3 - 2.0 V tFEOPT source SE0 interval of EOP see Figure 26 160 - 175 ns tFDEOP source jitter for differential transition to SE0 transition see Figure 26 2 - +5 ns tJR1 receiver jitter to next transition 18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns tEOPR EOP width at receiver must accept as EOP; see Figure 26 [1] 82 - - ns Fig 26. Differential data-to-EOP transition skew and EOP width aaa-009330 TPERIOD differential data lines crossover point source EOP width: tFEOPT receiver EOP width: tEOPR crossover point extended differential data to SE0/EOP skew n TPERIOD + tFDEOP LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 54 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 11. Application information 11.1 Suggested USB interface solutions The USB device can be connected to the USB as self-powered device (see Figure 27) or bus-powered device (see Figure 28). On the LPC11U3x, the PIO0_3/USB_VBUS pin is 5 V tolerant only when VDD is applied and at operating voltage level. Therefore, if the USB_VBUS function is connected to the USB connector and the device is self-powered, the USB_VBUS pin must be protected for situations when VDD = 0 V. If VDD is always greater than 0 V while VBUS = 5 V, the USB_VBUS pin can be connected directly to the VBUS pin on the USB connector. For systems where VDD can be 0 V and VBUS is directly applied to the VBUS pin, precautions must be taken to reduce the voltage to below 3.6 V, which is the maximum allowable voltage on the USB_VBUS pin in this case. One method is to use a voltage divider to connect the USB_VBUS pin to the VBUS on the USB connector. The voltage divider ratio should be such that the USB_VBUS pin will be greater than 0.7VDD to indicate a logic HIGH while below the 3.6 V allowable maximum voltage. For the following operating conditions VBUSmax = 5.25 V VDD = 3.6 V, the voltage divider should provide a reduction of 3.6 V/5.25 V or ~0.686 V. Fig 27. USB interface on a self-powered device where USB_VBUS = 5 V LPC1xxx USB-B connector USB_DP USB_CONNECT soft-connect switch USB_DM USB_VBUS VSS VDD R1 1.5 kΩ RS = 33 Ω aaa-010178 RS = 33 Ω R2 R3 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 55 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller For a bus-powered device, the VBUS signal does not need to be connected to the USB_VBUS pin (see Figure 28). The USB_CONNECT function can additionally be connected as shown in Figure 27 to prevent the USB from timing out when there is a significant delay between power-up and handling USB traffic. Remark: When a bus-powered circuit as shown in Figure 28 is used, configure the PIO0_3/USB_VBUS pin for GPIO (PIO0_3) in the IOCON block to ensure that the USB_CONNECT signal can still be controlled by software. For details on the soft-connect feature, see the LPC11U3x user manual (Ref. 1). Remark: When a self-powered circuit is used without connecting VBUS, configure the PIO0_3/USB_VBUS pin for GPIO (PIO0_3) and provide software that can detect the host presence through some other mechanism before enabling USB_CONNECT and the soft-connect feature. Enabling the soft-connect without host presence will lead to USB compliance failure. Fig 28. USB interface on a bus-powered device LPC1xxx VDD R1 1.5 kΩ aaa-010179 USB-B connector USB_DP USB_DM VSS RS = 33 Ω RS = 33 Ω REGULATOR VBUS LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 56 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 11.2 XTAL input The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave mode, a minimum of 200 mV (RMS) is needed. In slave mode, couple the input clock signal with a capacitor of 100 pF (Figure 29), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This signal corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 30 and in Table 18 and Table 19. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (L, CL and RS represent the fundamental frequency). Capacitance CP in Figure 30 represents the parallel package capacitance and must not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal manufacturer. Fig 29. Slave mode operation of the on-chip oscillator Fig 30. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation LPC1xxx XTALIN Ci 100 pF Cg 002aae788 002aaf424 LPC1xxx XTALIN XTALOUT CX1 CX2 XTAL = CL CP RS L LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 57 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 11.3 XTAL Printed-Circuit Board (PCB) layout guidelines Follow these guidelines for PCB layout: • Connect the crystal on the PCB as close as possible to the oscillator input and output pins of the chip. • Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal use have a common ground plane. • Connect the external components to the ground plain. • To keep parasitics and the noise coupled in via the PCB as small as possible, keep loops as small as possible. • Choose smaller values of Cx1 and Cx2 if parasitics of the PCB layout increase. Table 18. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 1 MHz to 5 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 300  39 pF, 39 pF 30 pF < 300  57 pF, 57 pF 5 MHz to 10 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 200  39 pF, 39 pF 30 pF < 100  57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 60  39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80  18 pF, 18 pF Table 19. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180  18 pF, 18 pF 20 pF < 100  39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 80  39 pF, 39 pF LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 58 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 11.4 Standard I/O pad configuration Figure 31 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver • Digital input: Pull-up enabled/disabled • Digital input: Pull-down enabled/disabled • Digital input: Repeater mode enabled/disabled • Analog input Fig 31. Standard I/O pad configuration PIN VDD VDD ESD VSS ESD strong pull-up strong pull-down VDD weak pull-up weak pull-down open-drain enable output enable repeater mode enable pull-up enable pull-down enable select data inverter data output data input select glitch filter analog input select analog input 002aaf695 pin configured as digital output driver pin configured as digital input pin configured as analog input 10 ns RC GLITCH FILTER LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 59 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 11.5 Reset pad configuration 11.6 ADC effective input impedance A simplified diagram of the ADC input channels can be used to determine the effective input impedance seen from an external voltage source. See Figure 33. The effective input impedance, Rin, seen by the external voltage source, VEXT, is the parallel impedance of ((1/fs x Cia) + Rmux + Rsw) and (1/fs x Cio), and can be calculated using Equation 1 with fs = sampling frequency Cia = ADC analog input capacitance Rmux = analog mux resistance Rsw = switch resistance Cio = pin capacitance (1) Fig 32. Reset pad configuration VSS reset 002aaf274 VDD VDD VDD Rpu ESD ESD 20 ns RC GLITCH FILTER PIN Fig 33. ADC input channel Cia Rs VSS VEXT 002aah615 ADC COMPARATOR ADC Block Rin Cio Rmux Rsw Source <2 kΩ <1.3 kΩ Rin 1 fs  Cia ----------------- + Rmux + Rsw   1 fs  Cio ----------------- =    LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 60 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Under nominal operating condition VDD = 3.3 V and with the maximum sampling frequency fs = 400 kHz, the parameters assume the following values: Cia = 1 pF (max) Rmux = 2 kΩ (max) Rsw = 1.3 kΩ (max) Cio = 7.1 pF (max) The effective input impedance with these parameters is Rin = 308 kΩ. 11.7 ADC usage notes The following guidelines show how to increase the performance of the ADC in a noisy environment beyond the ADC specifications listed in Table 6: • The ADC input trace must be short and as close as possible to the LPC11U3x chip. • Shield The ADC input traces from fast switching digital signals and noisy power supply lines. • The ADC and the digital core share the same power supply. Therefore, filter the power supply line adequately. • To improve the ADC performance in a noisy environment, put the device in Sleep mode during the ADC conversion. 11.8 I/O Handler software library applications The following sections provide application examples for the I/O Handler software library. All library examples make use of the I/O Handler hardware to extend the functionality of the part through software library calls. The libraries are available on http://www.LPCware.com. 11.8.1 I/O Handler I2S The I/O Handler software library provides functions to emulate an I2S master transmit interface using the I/O Handler hardware block. The emulated I2S interface loops over a 1 kB buffer, transmitting the datawords according to the I2S protocol. Interrupts are generated every time when the first 512 bytes have been transmitted and when the last 512 bytes have been transmitted. This allows the ARM core to load the free portion of the buffer with new data, thereby enabling streaming audio. Two channels with 16-bit per channel are supported. The code size of the software library is 1 kB and code must be executed from the SRAM1 memory area reserved for the I/O Handler code. 11.8.2 I/O Handler UART The I/O Handler UART library emulates one additional full-duplex UART. The emulated UART can be configured for 7 or 8 data bits, no parity, and 1 or 2 stop bits. The baud rate is configurable up to 115200 baud. The RXD signal is available on three I/O Handler pins (IOH_6, IOH_16, IOH_20), while TXD and CTS are available on all 21 I/O Handler pins. The code size of the software library is about 1.2 kB and code must be executed from the SRAM1 memory area reserved for the I/O Handler code. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 61 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 11.8.3 I/O Handler I2C The I/O Handler I2C library allows to have an additional I2C-bus master. I2C read, I2C write and combined I2C read/write are supported. Data is automatically read from and written to user-defined buffers. The I/O Handler I2C library combined with the on-chip I2C module allows to have two distinct I2C buses, allowing to separate low-speed from high-speed devices or bridging two I2C buses. 11.8.4 I/O Handler DMA The I/O Handler DMA library offers DMA-like functionality. Four types of transfer are supported: memory to memory, memory to peripheral, peripheral to memory and peripheral to peripheral. Supported peripherals are USART, SSP0/1, ADC and GPIO. DMA transfers can be triggered by the source/target peripheral, software, counter/timer module CT16B1, or I/O Handler pin PIO1_6/IOH_16. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 62 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 12. Package outline Fig 34. Package outline HVQFN33 (5 x 5 x 0.85 mm) Outline References version European projection Issue date IEC JEDEC JEITA MO-220 hvqfn33f_po 11-10-11 11-10-17 Unit(1) mm max nom min 0.85 0.05 0.00 0.2 5.1 4.9 3.75 3.45 5.1 4.9 3.75 3.45 0.5 3.5 A1 Dimensions (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm b c 0.30 0.18 A(1) D(1) Dh E(1) Eh e e1 e2 L 3.5 v w 0.1 0.1 y 0.05 0.5 0.3 y1 0.05 0 2.5 5 mm scale 1/2 e v C A B w C terminal 1 index area A A1 c detail X y1 C y e L Eh Dh e e1 b 9 16 32 25 24 8 17 1 X D E C B A e2 terminal 1 index area 1/2 e LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 63 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 35. Package outline HVQFN33 (7 x 7 x 0.85 mm) Outline References version European projection Issue date IEC JEDEC JEITA - - - hvqfn33_po 09-03-17 09-03-23 Unit mm max nom min 1.00 0.85 0.80 0.05 0.02 0.00 0.2 7.1 7.0 6.9 4.85 4.70 4.55 7.1 7.0 6.9 0.65 4.55 0.75 0.60 0.45 0.1 A(1) Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm A1 b 0.35 0.28 0.23 c D(1) Dh E(1) Eh 4.85 4.70 4.55 e e1 e2 4.55 L v 0.1 w 0.05 y 0.08 y1 0 2.5 5 mm scale terminal 1 index area D B A E C y1 C y X detail X A1 A c b e2 e1 e e v C A B w C terminal 1 index area Dh Eh L 9 16 32 33 25 17 24 8 1 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 64 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 36. Package outline TFBGA48 (SOT1155-2) Outline References version European projection Issue date IEC JEDEC JEITA SOT1155-2 - - - sot1155-2_po 13-06-17 13-06-19 Unit mm max nom min 1.10 0.95 0.85 0.30 0.25 0.20 0.35 0.30 0.25 4.6 4.5 4.4 4.6 4.5 4.4 0.5 3.5 0.15 0.08 A Dimensions TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm SOT1155-2 A1 A2 0.80 0.70 0.65 b D E e e1 3.5 e2 v w 0.05 y y1 0.1 0 5 mm scale ball A1 index area D B A E A B C D E F H G 1 2 3 4 5 6 7 8 b e2 e1 e e 1/2 e 1/2 e ball A1 index area solder mask open area not for solder ball C y1 C y X detail X A A2 A1 Ø v C A B Ø w C LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 65 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 37. Package outline LQFP48 (SOT313-2) UNIT A max. A1 A2 A3 bp c E(1) e HE L Lp v w y Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 7.1 6.9 0.5 9.15 8.85 0.95 0.55 7 0 o 1 0.2 0.12 0.1 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT313-2 136E05 MS-026 00-01-19 03-02-25 D(1) (1) (1) 7.1 6.9 HD 9.15 8.85 Z E 0.95 0.55 D bp e E B 12 HD bp HE v M B D ZD A ZE e v M A 1 48 37 36 25 24 13 θ A1 A Lp detail X L (A 3 ) A2 X y c w M w M 0 2.5 5 mm scale pin 1 index LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 66 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 38. Package outline LQFP64 (SOT314-2) UNIT A max. A1 A2 A3 bp c E(1) e HE L Lp v w y Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 0.5 12.15 11.85 1.45 1.05 7 0 o 1 0.2 0.12 0.1 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT314-2 136E10 MS-026 00-01-19 03-02-25 D(1) (1) (1) 10.1 9.9 HD 12.15 11.85 Z E 1.45 1.05 D bp e θ E A1 A Lp detail X L (A 3 ) B 16 c HD bp HE A2 v M B D ZD A ZE e v M A X 1 64 49 48 33 32 17 y pin 1 index w M w M 0 2.5 5 mm scale LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 67 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 13. Soldering Fig 39. Reflow soldering for the HVQFN33 (5x5) package Footprint information for reflow soldering of HVQFN33 package occupied area solder paste solder land Dimensions in mm P 0.5 Issue date 002aag766 11-11-15 11-11-20 Ax Ay Bx C D 5.95 5.95 4.25 0.85 By 4.25 0.27 Gx 5.25 Gy 5.25 Hy 6.2 Hx 6.2 SLx SLy nSPx nSPy 3.75 3.75 3 3 0.30 0.60 detail X C SLy D SLx Bx Ay P nSPy nSPx see detail X Gx Hx Hy Gy By Ax LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 68 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 40. Reflow soldering for the HVQFN33 (7x7) package Footprint information for reflow soldering of HVQFN33 package occupied area 001aao134 solder land solder resist solder land plus solder paste solder paste deposit Dimensions in mm Remark: Stencil thickness: 0.125 mm e = 0.65 evia = 4.25 OwDtot = 5.10 OA PID = 7.25 PA+OA OID = 8.20 OA 0.20 SR chamfer (4×) 0.45 DM evia = 1.05 W = 0.30 CU evia = 4.25 evia = 2.40 LbE = 5.80 CU LbD = 5.80 CU PIE = 7.25 PA+OA LaE = 7.95 CU LaD = 7.95 CU OIE = 8.20 OA OwEtot = 5.10 OA EHS = 4.85 CU DHS = 4.85 CU 4.55 SR 4.55 SR B-side (A-side fully covered) number of vias: 20 Solder resist covered via 0.30 PH 0.60 SR cover 0.60 CU SEhtot = 2.70 SP SDhtot = 2.70 SP GapE = 0.70 SP SPE = 1.00 SP SPD = 1.00 SP 0.45 DM GapD = 0.70 SP LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 69 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 41. Reflow soldering for the TFBGA48 package DIMENSIONS in mm P SL SP SR Hx Hy Hx Hy SOT1155-2 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA48 package solder land solder paste deposit solder resist P P SL SP SR detail X see detail X 0.50 0.225 0.275 0.325 4.75 4.75 sot1155-2_fr LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 70 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 42. Reflow soldering for the LQFP48 package SOT313-2 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP48 package Ax Bx Gx Hy Gy Hx By Ay P1 D2 (8×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy 10.350 P2 0.560 10.350 7.350 7.350 P1 0.500 0.280 C 1.500 0.500 7.500 7.500 10.650 10.650 sot313-2_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout P2 LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 71 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Fig 43. Reflow soldering for the LQFP64 package SOT314-2 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP64 package Ax Bx Gx Hy Gy Hx By Ay P2 P1 D2 (8×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy 13.300 13.300 10.300 10.300 P1 0.500 P2 0.560 0.280 C 1.500 0.400 10.500 10.500 13.550 13.550 sot314-2_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 72 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 14. Abbreviations 15. References [1] LPC11U3x User manual UM10462: http://www.nxp.com/documents/user_manual/UM10462.pdf [2] LPC11U3x Errata sheet: http://www.nxp.com/documents/errata_sheet/ES_LPC11U3X.pdf Table 20. Abbreviations Acronym Description A/D Analog-to-Digital ADC Analog-to-Digital Converter AHB Advanced High-performance Bus APB Advanced Peripheral Bus BOD BrownOut Detection GPIO General Purpose Input/Output JTAG Joint Test Action Group PLL Phase-Locked Loop RC Resistor-Capacitor SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port TAP Test Access Port USART Universal Synchronous Asynchronous Receiver/Transmitter LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 73 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 16. Revision history Table 21. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC11U3X v.2.2 20140311 Product data sheet - LPC11U3X v.2.1 Modifications: • Use of USB_CONNECT signal explained in Section 11.1 “Suggested USB interface solutions”. • Open-drain I2C-bus and RESET pin descriptions clarified. See Table 3. LPC11U3X v.2.1 20131230 Product data sheet - LPC11U3X v.2 Modifications: Add reserved function to pins PIO0_8/MISO0/CT16B0_MAT0/R/IOH_6 and PIO0_9/MOSI0/CT16B0_MAT1/R/IOH_7. LPC11U3X v.2 20131125 Product data sheet - LPC11U3X v.1.1 Modifications: • Part LPC11U37HFBD64/401 with I/O handler added. • Additional I/O Handler pin functions added in Table 3. • Typical range of watchdog oscillator frequency changed to 9.4 kHz to 2.3 MHz.See Table 13. • Section 11.8 “I/O Handler software library applications” added. • Updated Section 11.1 “Suggested USB interface solutions” for clarity. • Condition VDD = 0 V added to Parameter VI in Table 5 for clarity. LPC11U3X v.1.1 20130924 Product data sheet - LPC11U3X v.1 Modifications: • Removed the footnote “The peak current is limited to 25 times the corresponding maximum current.” in Table 4. • Table 3: Added “5 V tolerant pad” to RESET/PIO0_0 table note. • Table 7: Removed BOD interrupt level 0. • Programmable glitch filter is enabled by default. See Section 7.7.1. • Added Section 11.6 “ADC effective input impedance”. • Table 5 “Static characteristics” added Pin capacitance section. • Updated Section 11.1 “Suggested USB interface solutions”. • Table 4 “Limiting values”: – Updated VDD min and max. – Updated VI conditions. • Table 10 “EEPROM characteristics”: – Removed fclk and ter; the user does not have control over these parameters. – Changed the tprog from 1.1 ms to 2.9 ms; the EEPROM IAP always does an erase and program, thus the total program time is ter + tprog. • Changed title of Figure 29 from “USB interface on a self-powered device” to “USB interface with soft-connect”. • Section 10.7 “USB interface” added. Parameter tEOPR1 and tEOPR2 renamed to tEOPR. LPC11U3X v.1 20120420 Product data sheet - - LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 74 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 17. Legal information 17.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 75 of 77 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.2 — 11 March 2014 76 of 77 continued >> NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Functional description . . . . . . . . . . . . . . . . . . 17 7.1 On-chip flash programming memory . . . . . . . 17 7.2 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.3 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.4 On-chip ROM . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.5 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.6 Nested Vectored Interrupt Controller (NVIC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.6.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 19 7.7 IOCON block . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.8 General-Purpose Input/Output GPIO . . . . . . . 19 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.9 USB interface . . . . . . . . . . . . . . . . . . . . . . . . 20 7.9.1 Full-speed USB device controller . . . . . . . . . . 20 7.9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.10 I/O Handler (LPC11U37HFBD64/401 only) . . . . . . . . . . . . 20 7.11 USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.12 SSP serial I/O controller . . . . . . . . . . . . . . . . . 21 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.13 I2C-bus serial I/O controller . . . . . . . . . . . . . . 22 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.14 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.15 General purpose external event counter/timers. . . . . . . . . . . . . . . . . . . . . . . . . 23 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.16 System tick timer . . . . . . . . . . . . . . . . . . . . . . 23 7.17 Windowed WatchDog Timer (WWDT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.18 Clocking and power control . . . . . . . . . . . . . . 24 7.18.1 Integrated oscillators . . . . . . . . . . . . . . . . . . . 24 7.18.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 25 7.18.1.2 System oscillator . . . . . . . . . . . . . . . . . . . . . . 26 7.18.1.3 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 26 7.18.2 System PLL and USB PLL. . . . . . . . . . . . . . . 26 7.18.3 Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.18.4 Wake-up process . . . . . . . . . . . . . . . . . . . . . . 26 7.18.5 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.18.5.1 Power profiles . . . . . . . . . . . . . . . . . . . . . . . . 27 7.18.5.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.18.5.3 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 27 7.18.5.4 Power-down mode. . . . . . . . . . . . . . . . . . . . . 27 7.18.5.5 Deep power-down mode . . . . . . . . . . . . . . . . 28 7.18.6 System control . . . . . . . . . . . . . . . . . . . . . . . . 28 7.18.6.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.18.6.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 28 7.18.6.3 Code security (Code Read Protection - CRP) . . . . . . . . . . . 28 7.18.6.4 APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.18.6.5 AHBLite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.18.6.6 External interrupt inputs . . . . . . . . . . . . . . . . . 29 7.19 Emulation and debugging . . . . . . . . . . . . . . . 30 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 31 9 Static characteristics . . . . . . . . . . . . . . . . . . . 32 9.1 BOD static characteristics . . . . . . . . . . . . . . . 38 9.2 Power consumption . . . . . . . . . . . . . . . . . . . 38 9.3 Peripheral power consumption . . . . . . . . . . . 41 9.4 Electrical pin characteristics. . . . . . . . . . . . . . 43 10 Dynamic characteristics. . . . . . . . . . . . . . . . . 46 10.1 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 46 10.2 External clock. . . . . . . . . . . . . . . . . . . . . . . . . 46 10.3 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 47 10.4 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 10.5 I2C-bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 10.6 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 50 10.7 USB interface . . . . . . . . . . . . . . . . . . . . . . . . 53 11 Application information . . . . . . . . . . . . . . . . . 54 11.1 Suggested USB interface solutions . . . . . . . . 54 11.2 XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 11.3 XTAL Printed-Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . 57 11.4 Standard I/O pad configuration . . . . . . . . . . . 58 11.5 Reset pad configuration . . . . . . . . . . . . . . . . . 59 11.6 ADC effective input impedance . . . . . . . . . . . 59 11.7 ADC usage notes. . . . . . . . . . . . . . . . . . . . . . 60 11.8 I/O Handler software library applications . . . . 60 11.8.1 I/O Handler I2S. . . . . . . . . . . . . . . . . . . . . . . . 60 11.8.2 I/O Handler UART . . . . . . . . . . . . . . . . . . . . . 60 11.8.3 I/O Handler I2C. . . . . . . . . . . . . . . . . . . . . . . . 61 11.8.4 I/O Handler DMA . . . . . . . . . . . . . . . . . . . . . . 61 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 March 2014 Document identifier: LPC11U3X Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 62 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 72 15 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 73 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 74 17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 74 17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 17.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 75 18 Contact information. . . . . . . . . . . . . . . . . . . . . 75 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1. General description The PCA9545A/45B/45C is a quad bidirectional translating switch controlled via the I2C-bus. The SCL/SDA upstream pair fans out to four downstream pairs, or channels. Any individual SCx/SDx channel or combination of channels can be selected, determined by the contents of the programmable control register. Four interrupt inputs, INT0 to INT3, one for each of the downstream pairs, are provided. One interrupt output, INT, acts as an AND of the four interrupt inputs. An active LOW reset input allows the PCA9545A/45B/45C to recover from a situation where one of the downstream I2C-buses is stuck in a LOW state. Pulling the RESET pin LOW resets the I2C-bus state machine and causes all the channels to be deselected as does the internal power-on reset function. The pass gates of the switches are constructed such that the VDD pin can be used to limit the maximum high voltage which is passed by the PCA9545A/45B/45C. This allows the use of different bus voltages on each pair, so that 1.8 V or 2.5 V or 3.3 V parts can communicate with 5 V parts without any additional protection. External pull-up resistors pull the bus up to the desired voltage level for each channel. All I/O pins are 5 V tolerant. The PCA9545A, PCA9545B and PCA9545C are identical except for the fixed portion of the slave address. 2. Features and benefits  1-of-4 bidirectional translating switches  I2C-bus interface logic; compatible with SMBus standards  4 active LOW interrupt inputs  Active LOW interrupt output  Active LOW reset input  2 address pins allowing up to 4 devices on the I2C-bus  Alternate address versions A, B and C allow up to a total of 12 devices on the bus for larger systems or to resolve address conflicts  Channel selection via I2C-bus, in any combination  Power-up with all switch channels deselected  Low Ron switches  Allows voltage level translation between 1.8 V, 2.5 V, 3.3 V and 5 V buses  No glitch on power-up  Supports hot insertion  Low standby current  Operating power supply voltage range of 2.3 V to 5.5 V PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset Rev. 9 — 5 May 2014 Product data sheet PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 2 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset  5 V tolerant Inputs  0 Hz to 400 kHz clock frequency  ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101  Latch-up protection exceeds 100 mA per JESD78  Three packages offered: SO20, TSSOP20, and HVQFN20 3. Ordering information 3.1 Ordering options Table 1. Ordering information Type number Topside marking Package Name Description Version PCA9545ABS 9545A HVQFN20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5  5  0.85 mm SOT662-1 PCA9545AD PCA9545AD SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 PCA9545APW PA9545A TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 PCA9545BPW PA9545B PCA9545CPW PA9545C Table 2. Ordering options Type number Orderable part number Package Packing method Minimum order quantity Temperature range PCA9545ABS PCA9545ABS,118 HVQFN20 Reel 13” Q1/T1 *standard mark SMD 6000 Tamb = 40 C to +85 C PCA9545AD PCA9545AD,112 SO20 Standard marking * IC’s tube - DSC bulk pack 1520 Tamb = 40 C to +85 C PCA9545AD,118 SO20 Reel 13” Q1/T1 *standard mark SMD 2000 Tamb = 40 C to +85 C PCA9545APW PCA9545APW,112 TSSOP20 Standard marking * IC’s tube - DSC bulk pack 1875 Tamb = 40 C to +85 C PCA9545APW,118 TSSOP20 Reel 13” Q1/T1 *standard mark SMD 2500 Tamb = 40 C to +85 C PCA9545BPW PCA9545BPW,118 TSSOP20 Reel 13” Q1/T1 *standard mark SMD 2500 Tamb = 40 C to +85 C PCA9545CPW PCA9545CPW,118 TSSOP20 Reel 13” Q1/T1 *standard mark SMD 2500 Tamb = 40 C to +85 C PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 3 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 4. Block diagram Fig 1. Block diagram of PCA9545A/45B/45C SWITCH CONTROL LOGIC PCA9545A/PCA9545B/PCA9545C POWER-ON RESET 002aab168 SC0 SC1 SC2 SC3 SD0 SD1 SD2 SD3 VSS VDD RESET I2C-BUS CONTROL INPUT FILTER SCL SDA A0 A1 INTERRUPT LOGIC INT0 to INT3 INT PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 4 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 5. Pinning information 5.1 Pinning Fig 2. Pin configuration for SO20 Fig 3. Pin configuration for TSSOP20 Fig 4. Pin configuration for HVQFN20 (transparent top view) PCA9545AD A0 VDD A1 SDA RESET SCL INT0 INT SD0 SC3 SC0 SD3 INT1 INT3 SD1 SC2 SC1 SD2 VSS INT2 002aab165 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 VDD SDA SCL INT SC3 SD3 INT3 SC2 SD2 INT2 A0 A1 RESET INT0 SD0 SC0 INT1 SD1 SC1 VSS PCA9545APW PCA9545BPW PCA9545CPW 002aab166 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 VDD SDA SCL INT SC3 SD3 INT3 SC2 A0 A1 RESET INT0 SD0 SC0 INT1 SD1 SC1 VSS 002aab167 PCA9545ABS Transparent top view 5 11 4 12 3 13 2 14 1 15 6 7 8 9 10 20 19 18 17 16 terminal 1 index area SD2 INT2 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 5 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 5.2 Pin description [1] HVQFN20 package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level performance, the exposed pad must be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias must be incorporated in the PCB in the thermal pad region. Table 3. Pin description Symbol Pin Description SO20, TSSOP20 HVQFN20 A0 1 19 address input 0 A1 2 20 address input 1 RESET 3 1 active LOW reset input INT0 4 2 active LOW interrupt input 0 SD0 5 3 serial data 0 SC0 6 4 serial clock 0 INT1 7 5 active LOW interrupt input 1 SD1 8 6 serial data 1 SC1 9 7 serial clock 1 VSS 10 8[1] supply ground INT2 11 9 active LOW interrupt input 2 SD2 12 10 serial data 2 SC2 13 11 serial clock 2 INT3 14 12 active LOW interrupt input 3 SD3 15 13 serial data 3 SC3 16 14 serial clock 3 INT 17 15 active LOW interrupt output SCL 18 16 serial clock line SDA 19 17 serial data line VDD 20 18 supply voltage PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 6 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 6. Functional description Refer to Figure 1 “Block diagram of PCA9545A/45B/45C”. 6.1 Device address Following a START condition, the bus master must output the address of the slave it is accessing. The address of the PCA9545A is shown in Figure 5. To conserve power, no internal pull-up resistors are incorporated on the hardware selectable address pins and they must be pulled HIGH or LOW. The last bit of the slave address defines the operation to be performed. When set to logic 1, a read is selected while a logic 0 selects a write operation. The PCA9545BPW and PCA9545CPW are alternate address versions if needed for larger systems or to resolve conflicts. The data sheet references the PCA9545A, but the PCA9545B and PCA9545C function identically except for the slave address. Fig 5. Slave address PCA9545A Fig 6. Slave address PCA9545B Fig 7. Slave address PCA9545C 002aab169 1 1 1 0 0 A1 A0 R/W fixed hardware selectable 002aab835 1 1 0 1 0 A1 A0 R/W fixed hardware selectable 002aab836 1 0 1 1 0 A1 A0 R/W fixed hardware selectable PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 7 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 6.2 Control register Following the successful acknowledgement of the slave address, the bus master sends a byte to the PCA9545A/45B/45C, which is stored in the control register. If multiple bytes are received by the PCA9545A/45B/45C, it saves the last byte received. This register can be written and read via the I2C-bus. 6.2.1 Control register definition One or several SCx/SDx downstream pair, or channel, is selected by the contents of the control register. This register is written after the PCA9545A/45B/45C has been addressed. The 4 LSBs of the control byte are used to determine which channel is to be selected. When a channel is selected, the channel will become active after a STOP condition has been placed on the I2C-bus. This ensures that all SCx/SDx lines are in a HIGH state when the channel is made active, so that no false conditions are generated at the time of connection. Remark: Several channels can be enabled at the same time. Example: B3 = 0, B2 = 1, B1 = 1, B0 = 0, means that channel 0 and channel 3 are disabled and channel 1 and channel 2 are enabled. Care should be taken not to exceed the maximum bus capacity. Fig 8. Control register 002aab170 INT 3 INT 2 INT 1 INT 0 B3 B2 B1 B0 channel selection bits (read/write) 7 6 5 4 3 2 1 0 interrupt bits (read only) channel 0 channel 1 channel 2 channel 3 INT0 INT1 INT2 INT3 Table 4. Control register: write (channel selection); read (channel status) INT3 INT2 INT1 INT0 B3 B2 B1 B0 Command X X X X X X X 0 channel 0 disabled 1 channel 0 enabled X X X X X X 0 X channel 1 disabled 1 channel 1 enabled X X X X X 0 X X channel 2 disabled 1 channel 2 enabled X X X X 0 X X X channel 3 disabled 1 channel 3 enabled 0 0 0 0 0 0 0 0 no channel selected; power-up/reset default state PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 8 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 6.2.2 Interrupt handling The PCA9545A/45B/45C provides 4 interrupt inputs, one for each channel, and one open-drain interrupt output. When an interrupt is generated by any device, it is detected by the PCA9545A/45B/45C and the interrupt output is driven LOW. The channel does not need to be active for detection of the interrupt. A bit is also set in the control register. Bit 4 through bit 7 of the control register corresponds to channel 0 through channel 3 of the PCA9545A/45B/45C, respectively. Therefore, if an interrupt is generated by any device connected to channel 1, the state of the interrupt inputs is loaded into the control register when a read is accomplished. Likewise, an interrupt on any device connected to channel 0 would cause bit 4 of the control register to be set on the read. The master can then address the PCA9545A/45B/45C and read the contents of the control register to determine which channel contains the device generating the interrupt. The master can then reconfigure the PCA9545A/45B/45C to select this channel, and locate the device generating the interrupt and clear it. It should be noted that more than one device can provide an interrupt on a channel, so it is up to the master to ensure that all devices on a channel are interrogated for an interrupt. If the interrupt function is not required, the interrupt inputs may be used as general-purpose inputs. If unused, interrupt inputs must be connected to VDD through a pull-up resistor. Remark: Several interrupts can be active at the same time. Example: INT3 = 0, INT2 = 1, INT1 = 1, INT0 = 0, means that there is no interrupt on channel 0 and channel 3, and there is interrupt on channel 1 and channel 2. 6.3 RESET input The RESET input is an active LOW signal which may be used to recover from a bus fault condition. By asserting this signal LOW for a minimum of tw(rst)L, the PCA9545A/45B/45C resets its registers and I2C-bus state machine and deselects all channels. The RESET input must be connected to VDD through a pull-up resistor. Table 5. Control register: Read — interrupt INT3 INT2 INT1 INT0 B3 B2 B1 B0 Command X X X 0 X X X X no interrupt on channel 0 1 interrupt on channel 0 X X 0 X X X X X no interrupt on channel 1 1 interrupt on channel 1 X 0 X X X X X X no interrupt on channel 2 1 interrupt on channel 2 0 X X X X X X X no interrupt on channel 3 1 interrupt on channel 3 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 9 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 6.4 Power-on reset When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9545A/45B/45C in a reset condition until VDD has reached VPOR. At this point, the reset condition is released and the PCA9545A/45B/45C registers and I2C-bus state machine are initialized to their default states (all zeroes) causing all the channels to be deselected. Thereafter, VDD must be lowered below 0.2 V for at least 5 s in order to reset the device. 6.5 Voltage translation The pass gate transistors of the PCA9545A/45B/45C are constructed such that the VDD voltage can be used to limit the maximum voltage that is passed from one I2C-bus to another. Figure 9 shows the voltage characteristics of the pass gate transistors (note that the graph was generated using the data specified in Section 11 “Static characteristics” of this data sheet). In order for the PCA9545A/45B/45C to act as a voltage translator, the Vo(sw) voltage should be equal to, or lower than the lowest bus voltage. For example, if the main bus was running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then Vo(sw) should be equal to or below 2.7 V to clamp the downstream bus voltages effectively. Looking at Figure 9, we see that Vo(sw)(max) is at 2.7 V when the PCA9545A/45B/45C supply voltage is 3.5 V or lower, so the PCA9545A/45B/45C supply voltage could be set to 3.3 V. Pull-up resistors can then be used to bring the bus voltages to their appropriate levels (see Figure 16). More Information can be found in Application Note AN262: PCA954X family of I2C/SMBus multiplexers and switches. (1) maximum (2) typical (3) minimum Fig 9. Pass gate voltage versus supply voltage VDD (V) 2.0 3.0 4.0 4.5 5.5 002aaa964 3.0 2.0 4.0 5.0 Vo(sw) (V) 1.0 2.5 3.5 5.0 (1) (2) (3) PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 10 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 7. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse, as changes in the data line at this time are interpreted as control signals (see Figure 10). 7.2 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 11). Fig 10. Bit transfer 􀁐􀁅􀁄􀀙􀀓􀀚 􀁇􀁄􀁗􀁄􀀃􀁏􀁌􀁑􀁈􀀃 􀁖􀁗􀁄􀁅􀁏􀁈􀀞􀀃 􀁇􀁄􀁗􀁄􀀃􀁙􀁄􀁏􀁌􀁇 􀁆􀁋􀁄􀁑􀁊􀁈􀀃 􀁒􀁉􀀃􀁇􀁄􀁗􀁄􀀃 􀁄􀁏􀁏􀁒􀁚􀁈􀁇 􀀶􀀧􀀤 􀀶􀀦􀀯 Fig 11. Definition of START and STOP conditions 􀁐􀁅􀁄􀀙􀀓􀀛􀀃 􀀶􀀧􀀤 􀀶􀀦􀀯 􀀳 􀀶􀀷􀀲􀀳􀀃􀁆􀁒􀁑􀁇􀁌􀁗􀁌􀁒􀁑 􀀶 􀀶􀀷􀀤􀀵􀀷􀀃􀁆􀁒􀁑􀁇􀁌􀁗􀁌􀁒􀁑 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 11 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 7.3 System configuration A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 12). 7.4 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of 8 bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. Fig 12. System configuration 􀀓􀀓􀀕􀁄􀁄􀁄􀀜􀀙􀀙 􀀰􀀤􀀶􀀷􀀨􀀵􀀃 􀀷􀀵􀀤􀀱􀀶􀀰􀀬􀀷􀀷􀀨􀀵􀀒􀀃 􀀵􀀨􀀦􀀨􀀬􀀹􀀨􀀵 􀀶􀀯􀀤􀀹􀀨􀀃 􀀵􀀨􀀦􀀨􀀬􀀹􀀨􀀵 􀀶􀀯􀀤􀀹􀀨􀀃 􀀷􀀵􀀤􀀱􀀶􀀰􀀬􀀷􀀷􀀨􀀵􀀒􀀃 􀀵􀀨􀀦􀀨􀀬􀀹􀀨􀀵 􀀰􀀤􀀶􀀷􀀨􀀵􀀃 􀀷􀀵􀀤􀀱􀀶􀀰􀀬􀀷􀀷􀀨􀀵 􀀰􀀤􀀶􀀷􀀨􀀵􀀃 􀀷􀀵􀀤􀀱􀀶􀀰􀀬􀀷􀀷􀀨􀀵􀀒􀀃 􀀵􀀨􀀦􀀨􀀬􀀹􀀨􀀵 􀀶􀀧􀀤 􀀶􀀦􀀯 􀀬􀀕􀀦􀀐􀀥􀀸􀀶􀀃 􀀰􀀸􀀯􀀷􀀬􀀳􀀯􀀨􀀻􀀨􀀵 􀀶􀀯􀀤􀀹􀀨 Fig 13. Acknowledgement on the I2C-bus 􀀓􀀓􀀕􀁄􀁄􀁄􀀜􀀛􀀚 􀀶 􀀶􀀷􀀤􀀵􀀷􀀃 􀁆􀁒􀁑􀁇􀁌􀁗􀁌􀁒􀁑 􀀔 􀀕 􀀛 􀀜 􀁆􀁏􀁒􀁆􀁎􀀃􀁓􀁘􀁏􀁖􀁈􀀃􀁉􀁒􀁕􀀃 􀁄􀁆􀁎􀁑􀁒􀁚􀁏􀁈􀁇􀁊􀁈􀁐􀁈􀁑􀁗 􀁑􀁒􀁗􀀃􀁄􀁆􀁎􀁑􀁒􀁚􀁏􀁈􀁇􀁊􀁈􀀃 􀁄􀁆􀁎􀁑􀁒􀁚􀁏􀁈􀁇􀁊􀁈 􀁇􀁄􀁗􀁄􀀃􀁒􀁘􀁗􀁓􀁘􀁗􀀃 􀁅􀁜􀀃􀁗􀁕􀁄􀁑􀁖􀁐􀁌􀁗􀁗􀁈􀁕 􀁇􀁄􀁗􀁄􀀃􀁒􀁘􀁗􀁓􀁘􀁗􀀃 􀁅􀁜􀀃􀁕􀁈􀁆􀁈􀁌􀁙􀁈􀁕 􀀶􀀦􀀯􀀃􀁉􀁕􀁒􀁐􀀃􀁐􀁄􀁖􀁗􀁈􀁕 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 12 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 7.5 Bus transactions Data is transmitted to the PCA9545A/45B/45C control register using the Write mode as shown in Figure 14. Data is read from PCA9545A/45B/45C using the Read mode as shown in Figure 15. Fig 14. Write control register Fig 15. Read control register 002aab172 S 1 1 1 0 0 A1 A0 0 A X X X X B3 B2 B1 B0 A P slave address START condition R/W acknowledge from slave acknowledge from slave control register SDA STOP condition 002aab173 S 1 1 1 0 0 A1 A0 1 A INT3 INT2 INT1 INT0 B3 B2 B1 B0 NA P slave address START condition R/W acknowledge from slave no acknowledge from master control register SDA STOP condition last byte PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 13 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 8. Application design-in information (1) If the device generating the interrupt has an open-drain output structure or can be 3-stated, a pull-up resistor is required. If the device generating the interrupt has a totem-pole output structure and cannot be 3-stated, a pull-up resistor is not required. The interrupt inputs should not be left floating. Fig 16. Typical application PCA9545A SD0 SC0 A1 A0 VSS SDA SCL RESET VDD = 2.7 V to 5.5 V VDD = 3.3 V I2C-bus/SMBus master 002aab171 SDA SCL channel 0 V = 2.7 V to 5.5 V INT INT0 see note (1) SD1 SC1 channel 1 V = 2.7 V to 5.5 V INT1 see note (1) SD2 SC2 channel 2 V = 2.7 V to 5.5 V INT2 see note (1) SD3 SC3 channel 3 V = 2.7 V to 5.5 V INT3 see note (1) PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 14 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 9. Limiting values [1] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 125 C. 10. Thermal characteristics Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V). Symbol Parameter Conditions Min Max Unit VDD supply voltage 0.5 +7.0 V VI input voltage 0.5 +7.0 V II input current - 20 mA IO output current - 25 mA IDD supply current - 100 mA ISS ground supply current - 100 mA Ptot total power dissipation - 400 mW Tj(max) maximum junction temperature [1] - 125 C Tstg storage temperature 60 +150 C Tamb ambient temperature operating 40 +85 C Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient HVQFN20 package 32 C/W SO20 package 90 C/W TSSOP20 package 146 C/W PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 15 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 11. Static characteristics [1] For operation between published voltage ranges, refer to the worst-case parameter in both ranges. [2] VDD must be lowered to 0.2 V for at least 5 s in order to reset part. Table 8. Static characteristics at VDD = 2.3 V to 3.6 V VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. See Table 9 on page 16 for VDD = 4.5 V to 5.5 V[1]. Symbol Parameter Conditions Min Typ Max Unit Supply VDD supply voltage 2.3 - 3.6 V IDD supply current Operating mode; VDD = 3.6 V; no load; VI = VDD or VSS; fSCL = 100 kHz - 10 30 A Istb standby current Standby mode; VDD = 3.6 V; no load; VI = VDD or VSS - 0.1 1 A VPOR power-on reset voltage no load; VI = VDD or VSS [2]- 1.6 2.1 V Input SCL; input/output SDA VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 6 V IOL LOW-level output current VOL = 0.4 V 3 7 - mA VOL = 0.6 V 6 10 - mA IL leakage current VI = VDD or VSS 1 - +1 A Ci input capacitance VI = VSS - 10 13 pF Select inputs A0, A1, INT0 to INT3, RESET VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 6 V ILI input leakage current pin at VDD or VSS 1 - +1 A Ci input capacitance VI = VSS - 1.6 3 pF Pass gate Ron ON-state resistance VDD = 3.6 V; VO = 0.4 V; IO = 15 mA 5 11 30  VDD = 2.3 V to 2.7 V; VO = 0.4 V; IO = 10 mA 7 16 55  Vo(sw) switch output voltage Vi(sw) = VDD = 3.3 V; Io(sw) = 100 A - 1.9 - V Vi(sw) = VDD = 3.0 V to 3.6 V; Io(sw) = 100 A 1.6 - 2.8 V Vi(sw) = VDD = 2.5 V; Io(sw) = 100 A - 1.5 - V Vi(sw) = VDD = 2.3 V to 2.7 V; Io(sw) = 100 A 1.1 - 2.0 V IL leakage current VI = VDD or VSS 1 - +1 A Cio input/output capacitance VI = VSS - 3 5 pF INT output IOL LOW-level output current VOL = 0.4 V 3 - - mA IOH HIGH-level output current - - +10 A PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 16 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset [1] For operation between published voltage ranges, refer to the worst-case parameter in both ranges. [2] VDD must be lowered to 0.2 V for at least 5 s in order to reset part. Table 9. Static characteristics at VDD = 4.5 V to 5.5 V VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. See Table 8 on page 15 for VDD = 2.3 V to 3.6 V[1]. Symbol Parameter Conditions Min Typ Max Unit Supply VDD supply voltage 4.5 - 5.5 V IDD supply current Operating mode; VDD = 5.5 V; no load; VI = VDD or VSS; fSCL = 100 kHz - 25 100 A Istb standby current Standby mode; VDD = 5.5 V; no load; VI = VDD or VSS - 0.3 1 A VPOR power-on reset voltage no load; VI = VDD or VSS [2]- 1.7 2.1 V Input SCL; input/output SDA VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 6 V IOL LOW-level output current VOL = 0.4 V 3 - - mA VOL = 0.6 V 6 - - mA IL leakage current VI = VSS 1 - +1 A Ci input capacitance VI = VSS - 10 13 pF Select inputs A0, A1, INT0 to INT3, RESET VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 6 V ILI input leakage current VI = VDD or VSS 1 - +1 A Ci input capacitance VI = VSS - 2 5 pF Pass gate Ron ON-state resistance VDD = 4.5 V to 5.5 V; VO = 0.4 V; IO = 15 mA 4 9 24  Vo(sw) switch output voltage Vi(sw) = VDD = 5.0 V; Io(sw) = 100 A - 3.6 - V Vi(sw) = VDD = 4.5 V to 5.5 V; Io(sw) = 100 A 2.6 - 4.5 V IL leakage current VI = VDD or VSS 1 - +1 A Cio input/output capacitance VI = VSS - 3 5 pF INT output IOL LOW-level output current VOL = 0.4 V 3 - - mA IOH HIGH-level output current - - +10 A PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 17 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 12. Dynamic characteristics [1] Pass gate propagation delay is calculated from the 20  typical Ron and the 15 pF load capacitance. [2] After this period, the first clock pulse is generated. [3] A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order to bridge the undefined region of the falling edge of SCL. [4] Cb = total capacitance of one bus line in pF. [5] Measurements taken with 1 k pull-up resistor and 50 pF load. Table 10. Dynamic characteristics Symbol Parameter Conditions Standard-mode I2C-bus Fast-mode I2C-bus Unit Min Max Min Max tPD propagation delay from SDA to SDx, or SCL to SCx - 0.3[1] - 0.3[1] ns fSCL SCL clock frequency 0 100 0 400 kHz tBUF bus free time between a STOP and START condition 4.7 - 1.3 - s tHD;STA hold time (repeated) START condition [2] 4.0 - 0.6 - s tLOW LOW period of the SCL clock 4.7 - 1.3 - s tHIGH HIGH period of the SCL clock 4.0 - 0.6 - s tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - s tSU;STO set-up time for STOP condition 4.0 - 0.6 - s tHD;DAT data hold time 0[3] 3.45 0[3] 0.9 s tSU;DAT data set-up time 250 - 100 - ns tr rise time of both SDA and SCL signals - 1000 20 + 0.1Cb[4] 300 ns tf fall time of both SDA and SCL signals - 300 20 + 0.1Cb[4] 300 ns Cb capacitive load for each bus line - 400 - 400 pF tSP pulse width of spikes that must be suppressed by the input filter - 50 - 50 ns tVD;DAT data valid time HIGH-to-LOW [5] - 1 - 1 s LOW-to-HIGH [5] - 0.6 - 0.6 s tVD;ACK data valid acknowledge time - 1 - 1 s INT tv(INTnN-INTN) valid time from INTn to INT signal - 4 - 4 s td(INTnN-INTN) delay time from INTn to INT inactive - 2 - 2 s tw(rej)L LOW-level rejection time INTn inputs 1 - 1 - s tw(rej)H HIGH-level rejection time INTn inputs 0.5 - 0.5 - s RESET tw(rst)L LOW-level reset time 4 - 4 - ns trst reset time SDA clear 500 - 500 - ns tREC;STA recovery time to START condition 0 - 0 - ns PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 18 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset Fig 17. Definition of timing on the I2C-bus 􀁗􀀥􀀸􀀩 􀁗􀀶􀀳 􀁗􀀫􀀧􀀞􀀶􀀷􀀤 􀀳 􀀶 􀀳 􀁗􀀯􀀲􀀺 􀁗􀁕 􀁗􀀫􀀧􀀞􀀧􀀤􀀷 􀁗􀁉 􀁗􀀫􀀬􀀪􀀫 􀁗􀀶􀀸􀀞􀀧􀀤􀀷 􀁗􀀶􀀸􀀞􀀶􀀷􀀤 􀀶􀁕 􀁗􀀫􀀧􀀞􀀶􀀷􀀤 􀁗􀀶􀀸􀀞􀀶􀀷􀀲 􀀶􀀧􀀤 􀀶􀀦􀀯 􀀓􀀓􀀕􀁄􀁄􀁄􀀜􀀛􀀙 􀀓􀀑􀀚􀀃􀃮􀀃􀀹􀀧􀀧 􀀓􀀑􀀖􀀃􀃮􀀃􀀹􀀧􀀧 􀀓􀀑􀀚􀀃􀃮􀀃􀀹􀀧􀀧 􀀓􀀑􀀖􀀃􀃮􀀃􀀹􀀧􀀧 Fig 18. Definition of RESET timing SDA SCL 002aac549 50 % 30 % 50 % 50 % tREC;STA tw(rst)L RESET START trst ACK or read cycle Rise and fall times refer to VIL and VIH. Fig 19. I2C-bus timing diagram 􀀓􀀓􀀕􀁄􀁄􀁅􀀔􀀚􀀘 􀁓􀁕􀁒􀁗􀁒􀁆􀁒􀁏 􀀶􀀷􀀤􀀵􀀷 􀁆􀁒􀁑􀁇􀁌􀁗􀁌􀁒􀁑 􀀋􀀶􀀌 􀁅􀁌􀁗􀀃􀀚 􀀰􀀶􀀥 􀀋􀀤􀀚􀀌 􀁅􀁌􀁗􀀃􀀙 􀀋􀀤􀀙􀀌 􀁅􀁌􀁗􀀃􀀓 􀀋􀀵􀀒􀀺􀀌 􀁄􀁆􀁎􀁑􀁒􀁚􀁏􀁈􀁇􀁊􀁈 􀀋􀀤􀀌 􀀶􀀷􀀲􀀳 􀁆􀁒􀁑􀁇􀁌􀁗􀁌􀁒􀁑 􀀋􀀳􀀌 􀀶􀀦􀀯 􀀶􀀧􀀤 􀁗􀀫􀀧􀀞􀀶􀀷􀀤 􀁗􀀶􀀸􀀞􀀧􀀤􀀷 􀁗􀀫􀀧􀀞􀀧􀀤􀀷 􀁗􀀥􀀸􀀩 􀁗􀁉 􀁗􀀶􀀸􀀞􀀶􀀷􀀤 􀁗􀀯􀀲􀀺 􀁗􀀫􀀬􀀪􀀫 􀁗􀀹􀀧􀀞􀀤􀀦􀀮 􀁗􀀶􀀸􀀞􀀶􀀷􀀲 􀀔􀀃􀀒􀀃􀁉􀀶􀀦􀀯 􀁗􀁕 􀁗􀀹􀀧􀀞􀀧􀀤􀀷 􀀓􀀑􀀖􀀃􀃮􀀃􀀹􀀧􀀧 􀀓􀀑􀀚􀀃􀃮􀀃􀀹􀀧􀀧 􀀓􀀑􀀖􀀃􀃮􀀃􀀹􀀧􀀧 􀀓􀀑􀀚􀀃􀃮􀀃􀀹􀀧􀀧 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 19 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 13. Test information Fig 20. Expanded view of read input port register SCL 002aab176 2 1 0 A P 70 % 30 % SDA INPUT 50 % INT tv(INTnN−INTN) td(INTnN−INTN) Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig 21. Test circuitry for switching times PULSE GENERATOR VO CL 50 pF RL 500 Ω 002aab177 RT VI VDD VDD D.U.T. PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 20 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 14. Package outline Fig 22. Package outline SOT163-1 (SO20) 􀀸􀀱􀀬􀀷􀀃 􀀤􀀃 􀁐􀁄􀁛􀀑􀀃 􀀤􀀃􀀔􀀃 􀀤􀀃􀀕􀀃 􀀤􀀃􀀖􀀃 􀁅􀀃􀁓􀀃 􀁆􀀃 􀀧􀀃􀀋􀀔􀀌􀀃 􀀨􀀃􀀋􀀔􀀌􀀃 􀁈􀀃 􀀫􀀃􀀨􀀃 􀀯􀀃 􀀯􀀃􀁓􀀃 􀀴􀀃 􀁙􀀃 􀁚􀀃 􀁜􀀃 􀀽􀀃􀀋􀀔􀀌􀀃 􀈙􀀃 􀀲􀀸􀀷􀀯􀀬􀀱􀀨􀀃 􀀃􀀵􀀨􀀩􀀨􀀵􀀨􀀱􀀦􀀨􀀶􀀃 􀀹􀀨􀀵􀀶􀀬􀀲􀀱􀀃 􀀨􀀸􀀵􀀲􀀳􀀨􀀤􀀱􀀃 􀀳􀀵􀀲􀀭􀀨􀀦􀀷􀀬􀀲􀀱􀀃 􀀬􀀶􀀶􀀸􀀨􀀃􀀧􀀤􀀷􀀨􀀃 􀀃􀀬􀀨􀀦􀀃 􀀃􀀭􀀨􀀧􀀨􀀦􀀃 􀀃􀀭􀀨􀀬􀀷􀀤􀀃 􀁐􀁐􀀃 􀁌􀁑􀁆􀁋􀁈􀁖􀀃 􀀕􀀑􀀙􀀘􀀃 􀀓􀀑􀀖􀀃 􀀓􀀑􀀔􀀃 􀀕􀀑􀀗􀀘􀀃 􀀕􀀑􀀕􀀘􀀃 􀀓􀀑􀀗􀀜􀀃 􀀓􀀑􀀖􀀙􀀃 􀀓􀀑􀀖􀀕􀀃 􀀓􀀑􀀕􀀖􀀃 􀀔􀀖􀀑􀀓􀀃 􀀔􀀕􀀑􀀙􀀃 􀀚􀀑􀀙􀀃 􀀚􀀑􀀗􀀃 􀀔􀀑􀀕􀀚􀀃 􀀔􀀓􀀑􀀙􀀘􀀃 􀀔􀀓􀀑􀀓􀀓􀀃 􀀔􀀑􀀔􀀃 􀀔􀀑􀀓􀀃 􀀓􀀑􀀜􀀃 􀀓􀀑􀀗􀀃 􀀛􀀃 􀀓􀀃 􀁒􀀃 􀁒􀀃 􀀓􀀑􀀕􀀘􀀃 􀀓􀀑􀀔􀀃 􀀧􀀬􀀰􀀨􀀱􀀶􀀬􀀲􀀱􀀶􀀃􀀋􀁌􀁑􀁆􀁋􀀃􀁇􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀃􀁄􀁕􀁈􀀃􀁇􀁈􀁕􀁌􀁙􀁈􀁇􀀃􀁉􀁕􀁒􀁐􀀃􀁗􀁋􀁈􀀃􀁒􀁕􀁌􀁊􀁌􀁑􀁄􀁏􀀃􀁐􀁐􀀃􀁇􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀌􀀃 􀀱􀁒􀁗􀁈􀀃 􀀔􀀑􀀃􀀳􀁏􀁄􀁖􀁗􀁌􀁆􀀃􀁒􀁕􀀃􀁐􀁈􀁗􀁄􀁏􀀃􀁓􀁕􀁒􀁗􀁕􀁘􀁖􀁌􀁒􀁑􀁖􀀃􀁒􀁉􀀃􀀓􀀑􀀔􀀘􀀃􀁐􀁐􀀃􀀋􀀓􀀑􀀓􀀓􀀙􀀃􀁌􀁑􀁆􀁋􀀌􀀃􀁐􀁄􀁛􀁌􀁐􀁘􀁐􀀃􀁓􀁈􀁕􀀃􀁖􀁌􀁇􀁈􀀃􀁄􀁕􀁈􀀃􀁑􀁒􀁗􀀃􀁌􀁑􀁆􀁏􀁘􀁇􀁈􀁇􀀑􀀃􀀃􀀃 􀀔􀀑􀀔􀀃 􀀓􀀑􀀗􀀃 􀀃􀀶􀀲􀀷􀀔􀀙􀀖􀀐􀀔􀀃 􀀔􀀓􀀃 􀀕􀀓􀀃 􀁚􀀃 􀀰􀀃 􀁅􀀃􀁓􀀃 􀁇􀁈􀁗􀁄􀁌􀁏􀀃􀀻􀀃 􀀽􀀃 􀁈􀀃 􀀔􀀔􀀃 􀀔􀀃 􀀧􀀃 􀁜􀀃 􀀓􀀑􀀕􀀘􀀃 􀀃􀀓􀀚􀀘􀀨􀀓􀀗􀀃 􀀃􀀰􀀶􀀐􀀓􀀔􀀖􀀃 􀁓􀁌􀁑􀀃􀀔􀀃􀁌􀁑􀁇􀁈􀁛􀀃 􀀓􀀑􀀔􀀃 􀀓􀀑􀀓􀀔􀀕􀀃 􀀓􀀑􀀓􀀓􀀗􀀃 􀀓􀀑􀀓􀀜􀀙􀀃 􀀓􀀑􀀓􀀛􀀜􀀃 􀀓􀀑􀀓􀀔􀀜􀀃 􀀓􀀑􀀓􀀔􀀗􀀃 􀀓􀀑􀀓􀀔􀀖􀀃 􀀓􀀑􀀓􀀓􀀜􀀃 􀀓􀀑􀀘􀀔􀀃 􀀓􀀑􀀗􀀜􀀃 􀀓􀀑􀀖􀀓􀀃 􀀓􀀑􀀕􀀜􀀃 􀀓􀀑􀀓􀀘􀀃 􀀔􀀑􀀗􀀃 􀀓􀀑􀀗􀀔􀀜􀀃 􀀓􀀑􀀓􀀘􀀘􀀃 􀀓􀀑􀀖􀀜􀀗􀀃 􀀓􀀑􀀓􀀗􀀖􀀃 􀀓􀀑􀀓􀀖􀀜􀀃 􀀓􀀑􀀓􀀖􀀘􀀃 􀀓􀀑􀀓􀀔􀀃 􀀓􀀑􀀓􀀔􀀙􀀃 􀀓􀀑􀀕􀀘􀀃 􀀓􀀑􀀓􀀗􀀖􀀃 􀀓􀀑􀀓􀀔􀀃 􀀓􀀑􀀓􀀓􀀗􀀃 􀀓􀀑􀀓􀀔􀀃 􀀓􀀑􀀓􀀔􀀙􀀃 􀀓􀀃 􀀘􀀃 􀀔􀀓􀀃􀁐􀁐􀀃 􀁖􀁆􀁄􀁏􀁈􀀃 􀀻􀀃 􀈙􀀃 􀀤􀀃 􀀤􀀃􀀔􀀃 􀀤􀀃􀀕􀀃 􀀫􀀃􀀨􀀃 􀀯􀀃􀁓􀀃 􀀴􀀃 􀀨􀀃 􀁆􀀃 􀀯􀀃 􀁙􀀃 􀀰􀀃 􀀤􀀃 􀀋􀀤􀀃􀀖􀀃􀀃􀀌􀀃 􀀤􀀃 􀀶􀀲􀀕􀀓􀀝􀀃􀁓􀁏􀁄􀁖􀁗􀁌􀁆􀀃􀁖􀁐􀁄􀁏􀁏􀀃􀁒􀁘􀁗􀁏􀁌􀁑􀁈􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈􀀞􀀃􀀕􀀓􀀃􀁏􀁈􀁄􀁇􀁖􀀞􀀃􀁅􀁒􀁇􀁜􀀃􀁚􀁌􀁇􀁗􀁋􀀃􀀚􀀑􀀘􀀃􀁐􀁐􀀃 􀀶􀀲􀀷􀀔􀀙􀀖􀀐􀀔􀀃 􀀜􀀜􀀐􀀔􀀕􀀐􀀕􀀚􀀃 􀀓􀀖􀀐􀀓􀀕􀀐􀀔􀀜􀀃 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 21 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset Fig 23. Package outline SOT360-1 (TSSOP20) 􀀸􀀱􀀬􀀷􀀃 􀀤􀀃􀀔􀀃 􀀤􀀃􀀕􀀃 􀀤􀀃􀀖􀀃 􀁅􀀃􀁓􀀃 􀁆􀀃 􀀧􀀃􀀋􀀔􀀌􀀃 􀀨􀀃􀀋􀀕􀀌􀀃 􀁈􀀃 􀀫􀀃􀀨􀀃 􀀯􀀃 􀀯􀀃􀁓􀀃 􀀴􀀃 􀁙􀀃 􀁚􀀃 􀁜􀀃 􀀽􀀃􀀋􀀔􀀌􀀃 􀈙􀀃 􀀲􀀸􀀷􀀯􀀬􀀱􀀨􀀃 􀀃􀀵􀀨􀀩􀀨􀀵􀀨􀀱􀀦􀀨􀀶􀀃 􀀹􀀨􀀵􀀶􀀬􀀲􀀱􀀃 􀀨􀀸􀀵􀀲􀀳􀀨􀀤􀀱􀀃 􀀳􀀵􀀲􀀭􀀨􀀦􀀷􀀬􀀲􀀱􀀃 􀀬􀀶􀀶􀀸􀀨􀀃􀀧􀀤􀀷􀀨􀀃 􀀃􀀬􀀨􀀦􀀃 􀀃􀀭􀀨􀀧􀀨􀀦􀀃 􀀃􀀭􀀨􀀬􀀷􀀤􀀃 􀁐􀁐􀀃 􀀓􀀑􀀔􀀘􀀃 􀀓􀀑􀀓􀀘􀀃 􀀓􀀑􀀜􀀘􀀃 􀀓􀀑􀀛􀀓􀀃 􀀓􀀑􀀖􀀓􀀃 􀀓􀀑􀀔􀀜􀀃 􀀓􀀑􀀕􀀃 􀀓􀀑􀀔􀀃 􀀙􀀑􀀙􀀃 􀀙􀀑􀀗􀀃 􀀗􀀑􀀘􀀃 􀀗􀀑􀀖􀀃 􀀓􀀑􀀙􀀘􀀃 􀀙􀀑􀀙􀀃 􀀙􀀑􀀕􀀃 􀀓􀀑􀀗􀀃 􀀓􀀑􀀖􀀃 􀀓􀀑􀀘􀀃 􀀓􀀑􀀕􀀃 􀀛􀀃 􀀓􀀃 􀁒􀀃 􀀔􀀃 􀀓􀀑􀀕􀀃 􀀓􀀑􀀔􀀖􀀃 􀀓􀀑􀀔􀀃 􀁒􀀃 􀀧􀀬􀀰􀀨􀀱􀀶􀀬􀀲􀀱􀀶􀀃􀀋􀁐􀁐􀀃􀁄􀁕􀁈􀀃􀁗􀁋􀁈􀀃􀁒􀁕􀁌􀁊􀁌􀁑􀁄􀁏􀀃􀁇􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀌􀀃 􀀱􀁒􀁗􀁈􀁖􀀃 􀀔􀀑􀀃􀀳􀁏􀁄􀁖􀁗􀁌􀁆􀀃􀁒􀁕􀀃􀁐􀁈􀁗􀁄􀁏􀀃􀁓􀁕􀁒􀁗􀁕􀁘􀁖􀁌􀁒􀁑􀁖􀀃􀁒􀁉􀀃􀀓􀀑􀀔􀀘􀀃􀁐􀁐􀀃􀁐􀁄􀁛􀁌􀁐􀁘􀁐􀀃􀁓􀁈􀁕􀀃􀁖􀁌􀁇􀁈􀀃􀁄􀁕􀁈􀀃􀁑􀁒􀁗􀀃􀁌􀁑􀁆􀁏􀁘􀁇􀁈􀁇􀀑􀀃 􀀕􀀑􀀃􀀳􀁏􀁄􀁖􀁗􀁌􀁆􀀃􀁌􀁑􀁗􀁈􀁕􀁏􀁈􀁄􀁇􀀃􀁓􀁕􀁒􀁗􀁕􀁘􀁖􀁌􀁒􀁑􀁖􀀃􀁒􀁉􀀃􀀓􀀑􀀕􀀘􀀃􀁐􀁐􀀃􀁐􀁄􀁛􀁌􀁐􀁘􀁐􀀃􀁓􀁈􀁕􀀃􀁖􀁌􀁇􀁈􀀃􀁄􀁕􀁈􀀃􀁑􀁒􀁗􀀃􀁌􀁑􀁆􀁏􀁘􀁇􀁈􀁇􀀑􀀃 􀀓􀀑􀀚􀀘􀀃 􀀓􀀑􀀘􀀓􀀃 􀀃􀀶􀀲􀀷􀀖􀀙􀀓􀀐􀀔􀀃 􀀃􀀰􀀲􀀐􀀔􀀘􀀖􀀃 􀀜􀀜􀀐􀀔􀀕􀀐􀀕􀀚􀀃 􀀓􀀖􀀐􀀓􀀕􀀐􀀔􀀜􀀃 􀁚􀀃 􀀰􀀃 􀁅􀀃􀁓􀀃 􀀧􀀃 􀀽􀀃 􀁈􀀃 􀀓􀀑􀀕􀀘􀀃 􀀔􀀃 􀀔􀀓􀀃 􀀕􀀓􀀃 􀀔􀀔􀀃 􀁓􀁌􀁑􀀃􀀔􀀃􀁌􀁑􀁇􀁈􀁛􀀃 􀈙􀀃 􀀤􀀃 􀀤􀀃 􀀔􀀃 􀀤􀀃􀀕􀀃 􀀯􀀃􀁓􀀃 􀀴􀀃 􀁇􀁈􀁗􀁄􀁌􀁏􀀃􀀻􀀃 􀀯􀀃 􀀋􀀤􀀃􀀖􀀃􀀃􀀌􀀃 􀀫􀀃􀀨􀀃 􀀨􀀃 􀁆􀀃 􀁙􀀃 􀀰􀀃 􀀤􀀃 􀀻􀀃 􀀤􀀃 􀁜􀀃 􀀓􀀃 􀀕􀀑􀀘􀀃 􀀘􀀃􀁐􀁐􀀃 􀁖􀁆􀁄􀁏􀁈􀀃 􀀷􀀶􀀶􀀲􀀳􀀕􀀓􀀝􀀃􀁓􀁏􀁄􀁖􀁗􀁌􀁆􀀃􀁗􀁋􀁌􀁑􀀃􀁖􀁋􀁕􀁌􀁑􀁎􀀃􀁖􀁐􀁄􀁏􀁏􀀃􀁒􀁘􀁗􀁏􀁌􀁑􀁈􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈􀀞􀀃􀀕􀀓􀀃􀁏􀁈􀁄􀁇􀁖􀀞􀀃􀁅􀁒􀁇􀁜􀀃􀁚􀁌􀁇􀁗􀁋􀀃􀀗􀀑􀀗􀀃􀁐􀁐􀀃 􀀶􀀲􀀷􀀖􀀙􀀓􀀐􀀔􀀃 􀀤􀀃 􀁐􀁄􀁛􀀑􀀃 􀀔􀀑􀀔􀀃 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 22 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset Fig 24. Package outline SOT662-1 (HVQFN20) 􀀔􀀃 􀀓􀀑􀀙􀀘􀀃 􀀸􀀱􀀬􀀷􀀃 􀀤􀀔􀀃 􀁅􀀃 􀀨􀁋􀀃 􀁈􀀃 􀁜􀀃 􀀓􀀑􀀕􀀃 􀁆􀀃 􀀲􀀸􀀷􀀯􀀬􀀱􀀨􀀃 􀀃􀀵􀀨􀀩􀀨􀀵􀀨􀀱􀀦􀀨􀀶􀀃 􀀹􀀨􀀵􀀶􀀬􀀲􀀱􀀃 􀀨􀀸􀀵􀀲􀀳􀀨􀀤􀀱􀀃 􀀳􀀵􀀲􀀭􀀨􀀦􀀷􀀬􀀲􀀱􀀃 􀀬􀀶􀀶􀀸􀀨􀀃􀀧􀀤􀀷􀀨􀀃 􀀃􀀬􀀨􀀦􀀃 􀀃􀀭􀀨􀀧􀀨􀀦􀀃 􀀃􀀭􀀨􀀬􀀷􀀤􀀃 􀁐􀁐􀀃 􀀘􀀑􀀔􀀃 􀀗􀀑􀀜􀀃 􀀧􀁋􀀃 􀀖􀀑􀀕􀀘􀀃 􀀕􀀑􀀜􀀘􀀃 􀁜􀀔􀀃 􀀘􀀑􀀔􀀃 􀀗􀀑􀀜􀀃 􀀖􀀑􀀕􀀘􀀃 􀀕􀀑􀀜􀀘􀀃 􀁈􀀔􀀃 􀀕􀀑􀀙􀀃 􀁈􀀕􀀃 􀀓􀀑􀀖􀀛􀀃 􀀕􀀑􀀙􀀃 􀀓􀀑􀀕􀀖􀀃 􀀓􀀑􀀓􀀘􀀃 􀀓􀀑􀀓􀀓􀀃 􀀓􀀑􀀓􀀘􀀃 􀀓􀀑􀀔􀀃 􀀧􀀬􀀰􀀨􀀱􀀶􀀬􀀲􀀱􀀶􀀃􀀋􀁐􀁐􀀃􀁄􀁕􀁈􀀃􀁗􀁋􀁈􀀃􀁒􀁕􀁌􀁊􀁌􀁑􀁄􀁏􀀃􀁇􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀌􀀃 􀀃􀀶􀀲􀀷􀀙􀀙􀀕􀀐􀀔􀀃 􀀐􀀃􀀐􀀃􀀐􀀃 􀀰􀀲􀀐􀀕􀀕􀀓􀀃 􀀐􀀃􀀐􀀃􀀐􀀃 􀀓􀀑􀀚􀀘􀀃 􀀓􀀑􀀘􀀓􀀃 􀀯􀀃 􀀓􀀑􀀔􀀃 􀁙􀀃 􀀓􀀑􀀓􀀘􀀃 􀁚􀀃 􀀓􀀃 􀀕􀀑􀀘􀀃 􀀘􀀃􀁐􀁐􀀃 􀁖􀁆􀁄􀁏􀁈􀀃 􀀶􀀲􀀷􀀙􀀙􀀕􀀐􀀔􀀃 􀀫􀀹􀀴􀀩􀀱􀀕􀀓􀀝􀀃􀁓􀁏􀁄􀁖􀁗􀁌􀁆􀀃􀁗􀁋􀁈􀁕􀁐􀁄􀁏􀀃􀁈􀁑􀁋􀁄􀁑􀁆􀁈􀁇􀀃􀁙􀁈􀁕􀁜􀀃􀁗􀁋􀁌􀁑􀀃􀁔􀁘􀁄􀁇􀀃􀁉􀁏􀁄􀁗􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈􀀞􀀃􀁑􀁒􀀃􀁏􀁈􀁄􀁇􀁖􀀞􀀃 􀀕􀀓􀀃􀁗􀁈􀁕􀁐􀁌􀁑􀁄􀁏􀁖􀀞􀀃􀁅􀁒􀁇􀁜􀀃􀀘􀀃􀁛􀀃􀀘􀀃􀁛􀀃􀀓􀀑􀀛􀀘􀀃􀁐􀁐􀀃 􀀤􀀋􀀔􀀌􀀃 􀁐􀁄􀁛􀀑􀀃 􀀤􀀃 􀀤􀀔􀀃 􀁆􀀃 􀁇􀁈􀁗􀁄􀁌􀁏􀀃􀀻􀀃 􀁈􀀃 􀁜􀀔􀀃 􀀦􀀃 􀁜􀀃 􀀯􀀃 􀀨􀁋􀀃 􀀧􀁋􀀃 􀁈􀀃 􀁈􀀔􀀃 􀁅􀀃 􀀙􀀃 􀀔􀀓􀀃 􀀕􀀓􀀃 􀀔􀀙􀀃 􀀔􀀘􀀃 􀀘􀀃 􀀔􀀔􀀃 􀀔􀀃 􀀻􀀃 􀀧􀀃 􀀨􀀃 􀀦􀀃 􀀥􀀃 􀀤􀀃 􀁈􀀕􀀃 􀁗􀁈􀁕􀁐􀁌􀁑􀁄􀁏􀀃􀀔􀀃 􀁌􀁑􀁇􀁈􀁛􀀃􀁄􀁕􀁈􀁄􀀃 􀁗􀁈􀁕􀁐􀁌􀁑􀁄􀁏􀀃􀀔􀀃 􀁌􀁑􀁇􀁈􀁛􀀃􀁄􀁕􀁈􀁄􀀃 􀀓􀀔􀀐􀀓􀀛􀀐􀀓􀀛􀀃 􀀓􀀕􀀐􀀔􀀓􀀐􀀕􀀕􀀃 􀀦􀀃 􀀤􀀃 􀀦􀀃 􀁙􀀃 􀀰􀀃 􀀥􀀃 􀁚􀀃 􀀰􀀃 􀀧􀀋􀀔􀀌􀀃 􀀨􀀋􀀔􀀌􀀃 􀀱􀁒􀁗􀁈􀀃 􀀔􀀑􀀃􀀳􀁏􀁄􀁖􀁗􀁌􀁆􀀃􀁒􀁕􀀃􀁐􀁈􀁗􀁄􀁏􀀃􀁓􀁕􀁒􀁗􀁕􀁘􀁖􀁌􀁒􀁑􀁖􀀃􀁒􀁉􀀃􀀓􀀑􀀓􀀚􀀘􀀃􀁐􀁐􀀃􀁐􀁄􀁛􀁌􀁐􀁘􀁐􀀃􀁓􀁈􀁕􀀃􀁖􀁌􀁇􀁈􀀃􀁄􀁕􀁈􀀃􀁑􀁒􀁗􀀃􀁌􀁑􀁆􀁏􀁘􀁇􀁈􀁇􀀑􀀃􀀃 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 23 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 15.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 24 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 25) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 11 and 12 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 25. Table 11. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 12. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 25 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. MSL: Moisture Sensitivity Level Fig 25. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 26 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 16. Soldering: PCB footprints Fig 26. PCB footprint for SOT163-1 (SO20); reflow soldering Fig 27. PCB footprint for SOT163-1 (SO20); wave soldering 􀁒􀁆􀁆􀁘􀁓􀁌􀁈􀁇􀀃􀁄􀁕􀁈􀁄 􀁖􀁒􀁗􀀔􀀙􀀖􀀐􀀔􀁂􀁉􀁕 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁏􀁄􀁑􀁇􀁖 􀁓􀁏􀁄􀁆􀁈􀁐􀁈􀁑􀁗􀀃􀁄􀁆􀁆􀁘􀁕􀁄􀁆􀁜􀀃􀂓􀀃􀀓􀀑􀀕􀀘 􀀧􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀃􀁌􀁑􀀃􀁐􀁐 􀀔􀀑􀀘􀀓 􀀓􀀑􀀙􀀓􀀃􀀋􀀕􀀓􀃮􀀌 􀀔􀀑􀀕􀀚􀀃􀀋􀀔􀀛􀃮􀀌 􀀛􀀑􀀓􀀓 􀀔􀀔􀀑􀀓􀀓 􀀔􀀖􀀑􀀗􀀓 􀀔􀀔􀀑􀀗􀀓 􀁖􀁒􀁗􀀔􀀙􀀖􀀐􀀔􀁂􀁉􀁚 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁕􀁈􀁖􀁌􀁖􀁗 􀁒􀁆􀁆􀁘􀁓􀁌􀁈􀁇􀀃􀁄􀁕􀁈􀁄 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁏􀁄􀁑􀁇􀁖 􀀧􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀃􀁌􀁑􀀃􀁐􀁐 􀁅􀁒􀁄􀁕􀁇􀀃􀁇􀁌􀁕􀁈􀁆􀁗􀁌􀁒􀁑 􀁓􀁏􀁄􀁆􀁈􀁐􀁈􀁑􀁗􀀃􀁄􀁆􀁆􀁘􀁕􀁕􀁄􀁆􀁜􀀃􀂓􀀃􀀓􀀑􀀕􀀘 􀀛􀀑􀀓􀀓 􀀔􀀖􀀑􀀗􀀓 􀀔􀀑􀀘􀀓 􀀓􀀑􀀖􀀃􀀋􀀕􀃮􀀌 􀀓􀀑􀀙􀀓􀀃􀀋􀀔􀀛􀃮􀀌 􀀔􀀑􀀕􀀓􀀃􀀋􀀕􀃮􀀌 􀀔􀀑􀀕􀀚􀀃􀀋􀀔􀀛􀃮􀀌 􀀔􀀔􀀑􀀓􀀓 􀀔􀀔􀀑􀀗􀀓 􀁈􀁑􀁏􀁄􀁕􀁊􀁈􀁇􀀃􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁏􀁄􀁑􀁇 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 27 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset Fig 28. PCB footprint for SOT360-1 (TSSOP20); reflow soldering 􀀧􀀬􀀰􀀨􀀱􀀶􀀬􀀲􀀱􀀶􀀃􀁌􀁑􀀃􀁐􀁐 􀀳􀀔 􀀤􀁜 􀀥􀁜 􀀦 􀀧􀀔 􀀧􀀕 􀀪􀁛 􀀪􀁜 􀀫􀁜 􀁖􀁒􀁗􀀖􀀙􀀓􀀐􀀔􀁂􀁉􀁕 􀀫􀁛 􀀶􀀲􀀷􀀖􀀙􀀓􀀐􀀔 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁏􀁄􀁑􀁇 􀁒􀁆􀁆􀁘􀁓􀁌􀁈􀁇􀀃􀁄􀁕􀁈􀁄 􀀩􀁒􀁒􀁗􀁓􀁕􀁌􀁑􀁗􀀃􀁌􀁑􀁉􀁒􀁕􀁐􀁄􀁗􀁌􀁒􀁑􀀃􀁉􀁒􀁕􀀃􀁕􀁈􀁉􀁏􀁒􀁚􀀃􀁖􀁒􀁏􀁇􀁈􀁕􀁌􀁑􀁊􀀃􀁒􀁉􀀃􀀷􀀶􀀶􀀲􀀳􀀕􀀓􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈 􀀪􀁜 􀀥􀁜 􀀤􀁜 􀀦 􀀫􀁜 􀀫􀁛 􀀪􀁛 􀀳􀀔 􀀪􀁈􀁑􀁈􀁕􀁌􀁆􀀃􀁉􀁒􀁒􀁗􀁓􀁕􀁌􀁑􀁗􀀃􀁓􀁄􀁗􀁗􀁈􀁕􀁑􀀃 􀀵􀁈􀁉􀁈􀁕􀀃􀁗􀁒􀀃􀁗􀁋􀁈􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈􀀃􀁒􀁘􀁗􀁏􀁌􀁑􀁈􀀃􀁇􀁕􀁄􀁚􀁌􀁑􀁊􀀃􀁉􀁒􀁕􀀃􀁄􀁆􀁗􀁘􀁄􀁏􀀃􀁏􀁄􀁜􀁒􀁘􀁗 􀀳􀀕 􀀋􀀓􀀑􀀔􀀕􀀘􀀌 􀀋􀀓􀀑􀀔􀀕􀀘􀀌 􀀧􀀕􀀃􀀋􀀗􀁛􀀌 􀀧􀀔 􀀳􀀕 􀀓􀀑􀀙􀀘􀀓 􀀓􀀑􀀚􀀘􀀓 􀀚􀀑􀀕􀀓􀀓 􀀗􀀑􀀘􀀓􀀓 􀀔􀀑􀀖􀀘􀀓 􀀓􀀑􀀗􀀓􀀓 􀀓􀀑􀀙􀀓􀀓 􀀙􀀑􀀜􀀓􀀓 􀀘􀀑􀀖􀀓􀀓 􀀚􀀑􀀖􀀓􀀓 􀀚􀀑􀀗􀀘􀀓 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 28 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset Fig 29. PCB footprint for SOT662-1 (HVQFN20); reflow soldering 􀀩􀁒􀁒􀁗􀁓􀁕􀁌􀁑􀁗􀀃􀁌􀁑􀁉􀁒􀁕􀁐􀁄􀁗􀁌􀁒􀁑􀀃􀁉􀁒􀁕􀀃􀁕􀁈􀁉􀁏􀁒􀁚􀀃􀁖􀁒􀁏􀁇􀁈􀁕􀁌􀁑􀁊􀀃􀁒􀁉􀀃􀀫􀀹􀀴􀀩􀀱􀀕􀀓􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈 􀀶􀀲􀀷􀀙􀀙􀀕􀀐􀀔 􀀧􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀃􀁌􀁑􀀃􀁐􀁐 􀀤􀁛 􀀤􀁜 􀀥􀁛 􀀥􀁜 􀀧 􀀶􀀯􀁛 􀀶􀀯􀁜 􀀶􀀳􀁛􀀃􀁗􀁒􀁗 􀀶􀀳􀁜􀀃􀁗􀁒􀁗 􀀶􀀳􀁛 􀀶􀀳􀁜 􀀪􀁛 􀀪􀁜 􀀫􀁛 􀀫􀁜 􀀙􀀑􀀓􀀓􀀓 􀀙􀀑􀀓􀀓􀀓 􀀖􀀑􀀛􀀓􀀓 􀀖􀀑􀀛􀀓􀀓 􀀳 􀀓􀀑􀀙􀀘􀀓 􀀓􀀑􀀖􀀘􀀓 􀀦 􀀔􀀑􀀔􀀓􀀓 􀀖􀀑􀀓􀀓􀀓 􀀖􀀑􀀓􀀓􀀓 􀀔􀀑􀀛􀀓􀀓 􀀔􀀑􀀛􀀓􀀓 􀀓􀀑􀀙􀀘􀀓 􀀓􀀑􀀙􀀘􀀓 􀀘􀀑􀀖􀀓􀀓 􀀘􀀑􀀖􀀓􀀓 􀀙􀀑􀀕􀀘􀀓 􀀙􀀑􀀕􀀘􀀓 􀁑􀀶􀀳􀁛 􀁑􀀶􀀳􀁜 􀀕 􀀕 􀁖􀁒􀁗􀀙􀀙􀀕􀀐􀀔􀁂􀁉􀁕 􀁒􀁆􀁆􀁘􀁓􀁌􀁈􀁇􀀃􀁄􀁕􀁈􀁄 􀀤􀁛 􀀥􀁛 􀀶􀀯􀁛 􀀪􀁛 􀀫􀁜 􀀪􀁜 􀀫􀁛 􀀶􀀯􀁜 􀀥􀁜 􀀤􀁜 􀀧 􀀳 􀀓􀀑􀀓􀀕􀀘 􀀓􀀑􀀓􀀕􀀘 􀀋􀀓􀀑􀀔􀀓􀀘􀀌 􀀶􀀳􀁛􀀃􀁗􀁒􀁗 􀀶􀀳􀁜􀀃􀁗􀁒􀁗 􀁑􀀶􀀳􀁛 􀁑􀀶􀀳􀁜 􀀶􀀳􀁛 􀀶􀀳􀁜 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁏􀁄􀁑􀁇􀀃􀁓􀁏􀁘􀁖􀀃􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁓􀁄􀁖􀁗􀁈 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁏􀁄􀁑􀁇 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁓􀁄􀁖􀁗􀁈􀀃􀁇􀁈􀁓􀁒􀁖􀁌􀁗 􀀦 􀀪􀁈􀁑􀁈􀁕􀁌􀁆􀀃􀁉􀁒􀁒􀁗􀁓􀁕􀁌􀁑􀁗􀀃􀁓􀁄􀁗􀁗􀁈􀁕􀁑􀀃 􀀵􀁈􀁉􀁈􀁕􀀃􀁗􀁒􀀃􀁗􀁋􀁈􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈􀀃􀁒􀁘􀁗􀁏􀁌􀁑􀁈􀀃􀁇􀁕􀁄􀁚􀁌􀁑􀁊􀀃􀁉􀁒􀁕􀀃􀁄􀁆􀁗􀁘􀁄􀁏􀀃􀁏􀁄􀁜􀁒􀁘􀁗 􀀬􀁖􀁖􀁘􀁈􀀃􀁇􀁄􀁗􀁈 􀀓􀀚􀀐􀀓􀀘􀀐􀀓􀀚􀀃 􀀓􀀜􀀐􀀓􀀙􀀐􀀔􀀘 PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 29 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 17. Abbreviations 18. Revision history Table 13. Abbreviations Acronym Description CDM Charged-Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model IC Integrated Circuit I2C-bus Inter-Integrated Circuit bus LSB Least Significant Bit MSB Most Significant Bit PCB Printed-Circuit Board POR Power-On Reset SMBus System Management Bus Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9545A_45B_45C v.9 20140505 Product data sheet - PCA9545A_45B_45C v.8 Modifications: • Section 6.4 “Power-on reset”, first paragraph, third sentence corrected from “Thereafter, VDD must be lowered below 0.2 V to reset the device.” to “Thereafter, VDD must be lowered below 0.2 V for at least 5 s in order to reset the device.” (this is a correction to documentation only; no change to device) • Table 8 “Static characteristics at VDD = 2.3 V to 3.6 V”: Table note [2] corrected by inserting phrase “for at least 5 s” (this is a correction to documentation only; no change to device) • Table 9 “Static characteristics at VDD = 4.5 V to 5.5 V”: Table note [2] corrected by inserting phrase “for at least 5 s” (this is a correction to documentation only; no change to device) PCA9545A_45B_45C v.8 20130514 Product data sheet - PCA9545A_45B_45C v.7 PCA9545A_45B_45C v.7 20090619 Product data sheet - PCA9545A_45B_45C v.6 PCA9545A_45B_45C v.6 20070319 Product data sheet - PCA9545A_45B_45C v.5 PCA9545A_45B_45C v.5 20061017 Product data sheet - PCA9545A v.4 PCA9545A v.4 20060925 Product data sheet - PCA9545A v.3 PCA9545A v.3 20050303 Product data sheet - PCA9545A v.2 PCA9545A v.2 20040929 Objective data sheet - PCA9545A v.1 PCA9545A v.1 20040728 Objective data sheet - - PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 30 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset 19. Legal information 19.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. 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Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PCA9545A_45B_45C All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 5 May 2014 31 of 32 NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PCA9545A/45B/45C 4-channel I2C-bus switch with interrupt logic and reset © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 May 2014 Document identifier: PCA9545A_45B_45C Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 6 6.1 Device address. . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.2.1 Control register definition . . . . . . . . . . . . . . . . . 7 6.2.2 Interrupt handling . . . . . . . . . . . . . . . . . . . . . . . 8 6.3 RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.4 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9 6.5 Voltage translation . . . . . . . . . . . . . . . . . . . . . . 9 7 Characteristics of the I2C-bus . . . . . . . . . . . . 10 7.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.2 START and STOP conditions . . . . . . . . . . . . . 10 7.3 System configuration . . . . . . . . . . . . . . . . . . . 11 7.4 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.5 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 12 8 Application design-in information . . . . . . . . . 13 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14 10 Thermal characteristics . . . . . . . . . . . . . . . . . 14 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 15 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 17 13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 19 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 15 Soldering of SMD packages . . . . . . . . . . . . . . 23 15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 23 15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 23 15.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23 15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24 16 Soldering: PCB footprints. . . . . . . . . . . . . . . . 26 17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 29 18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 29 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 30 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 30 19.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 19.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 31 20 Contact information. . . . . . . . . . . . . . . . . . . . . 31 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 1. General description The LPC3220/30/40/50 embedded microcontrollers were designed for low power, high performance applications. NXP achieved their performance goals using a 90 nanometer process to implement an ARM926EJ-S CPU core with a vector floating point co-processor and a large set of standard peripherals including USB On-The-Go. The LPC3220/30/40/50 operates at CPU frequencies of up to 266 MHz. The NXP implementation uses a ARM926EJ-S CPU core with a Harvard architecture, 5-stage pipeline, and an integral Memory Management Unit (MMU). The MMU provides the virtual memory capabilities needed to support the multi-programming demands of modern operating systems. The ARM926EJ-S also has a hardware based set of DSP instruction extensions, which includes single cycle MAC operations, and hardware based native Jazelle Java Byte-code execution. The NXP implementation has a 32 kB instruction cache and a 32 kB data cache. For low power consumption, the LPC3220/30/40/50 takes advantage of NXP’s advanced technology development to optimize intrinsic power and uses software controlled architectural enhancements to optimize application based power management. The LPC3220/30/40/50 also includes 256 kB of on-chip static RAM, a NAND flash interface, an Ethernet MAC, an LCD controller that supports STN and TFT panels, and an external bus interface that supports SDR and DDR SDRAM as well as static devices. In addition, the LPC3220/30/40/50 includes a USB 2.0 full-speed interface, seven UARTs, two I2C-bus interfaces, two SPI/SSP ports, two I2S-bus interfaces, two single output PWMs, a motor control PWM, six general purpose timers with capture inputs and compare outputs, a Secure Digital (SD) interface, and a 10-bit Analog-to-Digital Converter (ADC) with a touch screen sense option. 2. Features and benefits  ARM926EJ-S processor, running at CPU clock speeds up to 266 MHz.  Vector Floating Point (VFP) coprocessor.  32 kB instruction cache and 32 kB data cache.  Up to 256 kB of Internal SRAM (IRAM).  Selectable boot-up from various external devices: NAND flash, SPI memory, USB, UART, or static memory.  Multi-layer AHB system that provides a separate bus for each AHB master, including both an instruction and data bus for the CPU, two data busses for the DMA controller, and another bus for the USB controller, one for the LCD, and a final one for the Ethernet MAC. There are no arbitration delays in the system unless two masters attempt to access the same slave at the same time. LPC3220/30/40/50 16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface Rev. 2 — 20 October 2011 Product data sheet LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 2 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers  External memory controller for DDR and SDR SDRAM as well as for static devices.  Two NAND flash controllers: One for single-level NAND flash devices and the other for multi-level NAND flash devices.  Master Interrupt Controller (MIC) and two Slave Interrupt Controllers (SIC), supporting 74 interrupt sources.  Eight channel General Purpose DMA (GPDMA) controller on the AHB that can be used with the SD card port, the high-speed UARTs, I2S-bus interfaces, and SPI interfaces, as well as memory-to-memory transfers.  Serial interfaces:  10/100 Ethernet MAC with dedicated DMA Controller.  USB interface supporting either device, host (OHCI compliant), or On-The-Go (OTG) with an integral DMA controller and dedicated PLL to generate the required 48 MHz USB clock.  Four standard UARTs with fractional baud rate generation and 64 byte FIFOs. One of the standard UARTs supports IrDA.  Three additional high-speed UARTs intended for on-board communications that support baud rates up to 921 600 when using a 13 MHz main oscillator. All high-speed UARTs provide 64 byte FIFOs.  Two SPI controllers.  Two SSP controllers.  Two I2C-bus interfaces with standard open-drain pins. The I2C-bus interfaces support single master, slave, and multi-master I2C-bus configurations.  Two I2S-bus interfaces, each with separate input and output channels. Each channel can be operated independently on three pins, or both input and output channels can be used with only four pins and a shared clock.  Additional peripherals:  LCD controller supporting both STN and TFT panels, with dedicated DMA controller. Programmable display resolution up to 1024  768.  Secure Digital (SD) memory card interface, which conforms to the SD Memory Card Specification Version 1.01.  General Purpose (GP) input, output, and I/O pins. Includes 12 GP input pins, 24 GP output pins, and 51 GP I/O pins.  10-bit, 400 kHz Analog-to-Digital Converter (ADC) with input multiplexing from three pins. Optionally, the ADC can operate as a touch screen controller.  Real-Time Clock (RTC) with separate power pin and dedicated 32 kHz oscillator. NXP implemented the RTC in an independent on-chip power domain so it can remain active while the rest of the chip is not powered. The RTC also includes a 32-byte scratch pad memory.  32-bit general purpose high-speed timer with a 16-bit pre-scaler. This timer includes one external capture input pin and a capture connection to the RTC clock. Interrupts may be generated using three match registers.  Six enhanced timer/counters which are architecturally identical except for the peripheral base address. Two capture inputs and two match outputs are pinned out to four timers. Timer 1 brings out a third match output, timers 2 and 3 bring out all four match outputs, timer 4 has one match output, and timer 5 has no inputs or outputs.  32-bit millisecond timer driven from the RTC clock. This timer can generate interrupts using two match registers. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 3 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers  WatchDog timer clocked by the peripheral clock.  Two single-output PWM blocks.  Motor control PWM.  Keyboard scanner function allows automatic scanning of an up to 8  8 key matrix.  Up to 18 external interrupts.  Standard ARM test/debug interface for compatibility with existing tools.  Emulation Trace Buffer (ETB) with 2048  24 bit RAM allows trace via JTAG.  Stop mode saves power while allowing many peripheral functions to restart CPU activity.  On-chip crystal oscillator.  An on-chip PLL allows CPU operation up to the maximum CPU rate without the requirement for a high frequency crystal. Another PLL allows operation from the 32 kHz RTC clock rather than the external crystal.  Boundary scan for simplified board testing.  User-accessible unique serial ID number for each chip.  TFBGA296 package with a 15 mm  15 mm  0.7 mm body. 3. Applications  Consumer  Medical  Industrial  Network control LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 4 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 4. Ordering information [1] F = 40 C to +85 C temperature range. Note that Revision “A” parts with and without the /01 suffix are identical. For example, LPC3220FET296 Revision “A” is identical to LPC3220FET296/01 Revision “A”. [2] Available starting with Revision “A”. 4.1 Ordering options Table 1. Ordering information Type number[1] Package Name Description Version LPC3220FET296/01[2] TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1 LPC3230FET296/01[2] TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1 LPC3240FET296/01[2] TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1 LPC3250FET296/01[2] TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1 Table 2. Part options Type number SRAM (kB) 10/100 Ethernet LCD controller Temperature range (C) Package LPC3220FET296/01 128 0 0 40 to +85 TFBGA296 LPC3230FET296/01 256 0 1 40 to +85 TFBGA296 LPC3240FET296/01 256 1 0 40 to +85 TFBGA296 LPC3250FET296/01 256 1 1 40 to +85 TFBGA296 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 5 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 5. Block diagram Fig 1. Block diagram of LPC3220/30/40/50 ARM 9EJS D-CACHE 32 kB I-CACHE 32 kB DATA INSTRUCTION ethernet PHY interface USB transceiver interface LCD panel interface EXTERNAL MEMORY CONTROLLER ROM 16 kB SRAM 256 kB DMA USB SDRAM ETB STANDARD UART × 4 I2C × 2 TIMERS × 6 WATCHDOG TIMER DEBUG SYSTEM CONTROL HS UART × 3 KEY SCANNER 10-BIT ADC/TS UART CONTROL RTC PWM × 2 GPIO M0 M1 AHB TO APB BRIDGE AHB TO APB BRIDGE AHB TO APB BRIDGE master layer 0 1 2 3 4 5 6 slave port 0 1 7 6 5 3 2 = Master/Slave connection supported by the multilayer AHB matrix 32-bit AHB matrix APB slaves FAB slaves AHB slaves APB slaves port 3 port 4 port 0 32-bit wide external memory VFP9 ETB ETM 9 ETHERNET LCD MOTOR CONTROL PWM 002aae397 MMU D-SIDE CONTROLLER I-SIDE CONTROLLER DMA CONTROLLER ETHERNET 10/100 MAC USB OTG CONTROLLER LCD CONTROLLER MLC NAND SLC NAND SD CARD SPI × 2 I2S × 2 SSP × 2 INTERRUPT CONTROL register interfaces LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 6 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 6. Pinning information 6.1 Pinning Fig 2. Pin configuration for SOT1048-1 (TFBGA296) 002aae398 Transparent top view V U T R P N L J M K H G F E D B C A 2 4 6 8 10 12 13 14 15 17 16 18 1 3 5 7 9 11 ball A1 index area Table 3. Pin allocation table (TFBGA296) Pin Symbol Pin Symbol Pin Symbol Row A A3 I2C2_SCL A4 I2S1TX_CLK/MAT3[0] A5 I2C1_SCL A6 MS_BS/MAT2[1] A7 MS_DIO1/MAT0[1] A8 MS_DIO0/MAT0[0] A9 SPI2_DATIO/MOSI1/LCDVD[20][1] A10 SPI2_DATIN/MISO1/ LCDVD[21][1]/GPI_27 A11 GPIO_1 A12 GPIO_0 A13 GPO_21/U4_TX/LCDVD[3][1] A14 GPO_15/MCOA1/LCDFP[1] A15 GPO_7/LCDVD[2][1] A16 GPO_6/LCDVD[18][1] Row B B2 GPO_20 B3 GPO_5 B4 I2S1TX_WS/CAP3[0] B5 P0[0]/I2S1RX_CLK B6 I2C1_SDA B7 MS_SCLK/MAT2[0] B8 MS_DIO2/MAT0[2] B9 SPI1_DATIO/MOSI0/MCI2 B10 SPI2_CLK/SCK1/LCDVD[23][1] B11 GPIO_4/SSEL1/LCDVD[22][1] B12 GPO_12/MCOA2/LCDLE[1] B13 GPO_13/MCOB1/LCDDCLK[1] B14 GPO_2/MAT1[0]/LCDVD[0][1] B15 GPI_19/U4_RX B16 GPI_8/KEY_COL6/ SPI2_BUSY/ENET_RX_DV[2] B17 n.c. Row C C1 FLASH_RD C2 GPO_19 C3 GPO_0/TST_CLK1 C4 USB_ATX_INT C5 USB_SE0_VM/U5_TX C6 TST_CLK2 C7 GPI_6/HSTIM_CAP/ ENET_RXD2[2] C8 MS_DIO3/MAT0[3] C9 SPI1_CLK/SCK0 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 7 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers C10 SPI1_DATIN/MISO0/GPI_25/ MCI1 C11 GPIO_3/KEY_ROW7/ ENET_MDIO[2] C12 GPO_9/LCDVD[9][1] C13 GPO_8/LCDVD[8][1] C14 GPI_2/CAP2[0]/ ENET_RXD3[2] C15 GPI_1/SERVICE C16 GPI_0/I2S1RX_SDA C17 KEY_ROW4/ENET_TXD0[2] C18 KEY_ROW5/ENET_TXD1[2] Row D D1 FLASH_RDY D2 FLASH_ALE D3 GPO_14 D4 GPO_1 D5 USB_DAT_VP/U5_RX D6 USB_OE_TP D7 P0[1]/I2S1RX_WS D8 GPO_4 D9 GPIO_2/KEY_ROW6/ENET_MDC[2] D10 GPO_16/MCOB0/LCDENAB[1]/ LCDM[1] D11 GPO_18/MCOA0/LCDLP[1] D12 GPO_3/LCDVD[1][1] D13 GPI_7/CAP4[0]/MCABORT D14 PWM_OUT1/LCDVD[16][1] D15 PWM_OUT2/INTSTAT/LCDVD[19][1] D16 KEY_ROW3/ENET_TX_EN[2] D17 KEY_COL2/ENET_RX_ER[2] D18 KEY_COL3/ENET_CRS[2] Row E E1 FLASH_IO[3] E2 FLASH_IO[7] E3 FLASH_CE E4 I2C2_SDA E5 USB_I2C_SCL E6 USB_I2C_SDA E7 I2S1TX_SDA/MAT3[1] E8 GPO_11 E9 GPIO_5/SSEL0/MCI0 E10 GPO_22/U7_HRTS/ LCDVD[14][1] E11 GPO_10/MCOB2/LCDPWR[1] E12 GPI_9/KEY_COL7/ENET_COL[2] E13 GPI_4/SPI1_BUSY E14 KEY_ROW1/ENET_TXD2[2] E15 KEY_ROW0/ENET_TX_ER[2] E16 KEY_COL1/ENET_RX_CLK[2]/ ENET_REF_CLK[2] E17 U7_RX/CAP0[0]/ LCDVD[10][1]/GPI_23 E18 U7_TX/MAT1[1]/LCDVD[11][1] Row F F1 FLASH_IO[2] F2 FLASH_WR F3 FLASH_CLE F4 GPI_3 F5 VSS_IOC F6 VSS_IOB F7 VDD_IOC F8 VDD_IOB F9 VDD_IOD F10 VSS_IOD F11 VSS_IOD F12 VSS_IOD F13 VDD_IOD F14 KEY_ROW2/ENET_TXD3[2] F15 KEY_COL0/ENET_TX_CLK[2] F16 KEY_COL5/ENET_RXD1[2] F17 U6_IRRX/GPI_21 F18 U5_RX/GPI_20 Row G G1 EMC_DYCS1 G2 FLASH_IO[5] G3 FLASH_IO[6] G4 RESOUT G5 VSS_IOC G6 VDD_IOC G7 VDD_CORE G8 VSS_CORE G9 VDD_CORE G10 VSS_CORE G11 VDD_CORE G12 VSS_CORE G13 U7_HCTS/CAP0[1]/ LCDCLKIN[1]/GPI_22 G14 DBGEN G15 KEY_COL4/ENET_RXD0[2] G16 U6_IRTX G17 SYSCLKEN/LCDVD[15][1] G18 JTAG_TMS Row H H1 EMC_OE H2 FLASH_IO[0] H3 FLASH_IO[1] H4 FLASH_IO[4] H5 VSS_IOC H6 VDD_IOC H7 VSS_CORE H12 VSS_IOD H13 VDD_IOA H14 JTAG_TCK H15 U5_TX Table 3. Pin allocation table (TFBGA296) Pin Symbol Pin Symbol Pin Symbol LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 8 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers H16 HIGHCORE/LCDVD[17][1] H17 JTAG_NTRST H18 JTAG_RTCK Row J J1 EMC_A[20]/P1[20] J2 EMC_A[21]/P1[21] J3 EMC_A[22]/P1[22] J4 EMC_A[23]/P1[23] J5 VDD_IOC J6 VDD_EMC J7 VDD_CORE J12 VDD_CORE J13 VDD_IOA J14 U3_RX/GPI_18 J15 JTAG_TDO J16 JTAG_TDI J17 U3_TX J18 U2_HCTS/U3_CTS/GPI_16 Row K K1 EMC_A[19]/P1[19] K2 EMC_A[18]/P1[18] K3 EMC_A[16]/P1[16] K4 EMC_A[17]/P1[17] K5 VSS_EMC K6 VDD_EMC K7 VDD_EMC K12 VSS_CORE K13 VSS_IOA K14 VDD_RTC K15 U1_RX/CAP1[0]/GPI_15 K16 U1_TX K17 U2_TX/U3_DTR K18 U2_RX/U3_DSR/GPI_17 Row L L1 EMC_A[15]/P1[15] L2 EMC_CKE1 L3 EMC_A[0]/P1[0] L4 EMC_A[1]/P1[1] L5 VSS_EMC L6 VDD_EMC L7 VSS_CORE L12 VDD_COREFXD L13 VDD_RTCCORE L14 VSS_RTCCORE L15 P0[4]/I2S0RX_WS/LCDVD[6][1] L16 P0[5]/I2S0TX_SDA/LCDVD[7][1] L17 P0[6]/I2S0TX_CLK/ LCDVD[12][1] L18 P0[7]/I2S0TX_WS/LCDVD[13][1] Row M M1 EMC_A[2]/P1[2] M2 EMC_A[3]/P1[3] M3 EMC_A[4]/P1[4] M4 EMC_A[8]/P1[8] M5 VSS_EMC M6 VDD_EMC M7 VDD_CORE M8 VDD_EMC M9 VSS_CORE M10 VSS_CORE M11 VDD_CORE M12 VSS_CORE M13 VDD_COREFXD M14 RESET M15 ONSW M16 GPO_23/U2_HRTS/U3_RTS M17 P0[2]/I2S0RX_SDA/ LCDVD[4][1] M18 P0[3]/I2S0RX_CLK/LCDVD[5][1] Row N N1 EMC_A[5]/P1[5] N2 EMC_A[6]/P1[6] N3 EMC_A[7/P1[7] N4 EMC_A[12]/P1[12] N5 VSS_EMC N6 VSS_EMC N7 VDD_EMC N8 VDD_EMC N9 VDD_EMC N10 VDD_EMC N11 VDD_EMC N12 VDD_AD N13 VDD_AD N14 VDD_FUSE N15 VDD_RTCOSC N16 GPI_5/U3_DCD N17 GPI_28/U3_RI N18 GPO_17 Row P P1 EMC_A[9]/P1[9] P2 EMC_A[10]/P1[10] P3 EMC_A[11]/P1[11] P4 EMC_DQM[1] P5 EMC_DQM[3] P6 VSS_EMC Table 3. Pin allocation table (TFBGA296) Pin Symbol Pin Symbol Pin Symbol LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 9 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] LCD on LPC3230 and LPC3250 only. [2] Ethernet on LPC3240 and LPC3250 only. P7 VSS_EMC P8 VSS_EMC P9 VSS_EMC P10 VSS_EMC P11 VSS_EMC P12 EMC_BLS[3] P13 VSS_AD P14 VSS_OSC P15 VDD_PLLUSB P16 RTCX_IN P17 RTCX_OUT P18 VSS_RTCOSC Row R R1 EMC_A[13]/P1[13] R2 EMC_A[14]/P1[14] R3 EMC_DQM[0] R4 EMC_WR R5 EMC_CAS R6 EMC_DYCS0 R7 EMC_D[1] R8 EMC_D[7] R9 EMC_D[17]/EMC_DQS1 R10 EMC_D[24]/P2[5] R11 EMC_CS1 R12 EMC_BLS[2] R13 TS_XP R14 PLL397_LOOP R15 SYSX_OUT R16 VSS_PLLUSB R17 VDD_PLLHCLK R18 VSS_PLLHCLK Row T T1 EMC_DQM[2] T2 EMC_RAS T3 EMC_CLK T4 EMC_CLKIN T5 EMC_D[2] T6 EMC_D[6] T7 EMC_D[11] T8 EMC_D[14] T9 EMC_D[20]/P2[1] T10 EMC_D[23]/P2[4] T11 EMC_D[27]/P2[8] T12 EMC_CS2 T13 EMC_BLS[1] T14 ADIN1/TS_XM T15 VSS_PLL397 T16 VDD_PLL397 T17 SYSX_IN T18 VDD_OSC Row U U2 n.c. U3 EMC_CKE0 U4 EMC_D[0] U5 EMC_D[3] U6 EMC_D[9] U7 EMC_D[12] U8 EMC_D[15] U9 EMC_D[19]/P2[0] U10 EMC_D[22]/P2[3] U11 EMC_D[26]/P2[7] U12 EMC_D[30]/P2[11] U13 EMC_CS0 U14 EMC_BLS[0] U15 ADIN0/TS_YM U16 TS_YP U17 n.c. Row V V3 EMC_D[4] V4 EMC_D[5] V5 EMC_D[8] V6 EMC_D[10] V7 EMC_D[13] V8 EMC_D[16]/EMC_DQS0 V9 EMC_D[18]/EMC_CLK V10 EMC_D[21]/P2[2] V11 EMC_D[25]/P2[6] V12 EMC_D[28]/P2[9] V13 EMC_D[29]/P2[10] V14 EMC_D[31]/P2[12] V15 EMC_CS3 V16 ADIN2/TS_AUX_IN Table 3. Pin allocation table (TFBGA296) Pin Symbol Pin Symbol Pin Symbol LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 10 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 6.2 Pin description Table 4. Pin description Symbol Pin Power supply domain Type Description ADIN0/TS_YM U15 VDD_AD analog in ADC input 0/touch screen Y minus ADIN1/TS_XM T14 VDD_AD analog in ADC input 0/touch screen X minus ADIN2/TS_AUX_IN V16 VDD_AD analog in ADC input 2/touch screen AUX input DBGEN G14 VDD_IOD I: PD Device test input LOW = JTAG in-circuit debug available; normal operation. HIGH = I/O cell boundary scan test; for board assembly BSDL test. EMC_A[0]/P1[0] L3 VDD_EMC I/O EMC address bit 0 I/O Port 1 GPIO bit 0 EMC_A[1]/P1[1] L4 VDD_EMC I/O EMC address bit 1 I/O Port 1 GPIO bit 1 EMC_A[2]/P1[2] M1 VDD_EMC I/O EMC address bit 2 I/O Port 1 GPIO bit 2 EMC_A[3]/P1[3] M2 VDD_EMC I/O EMC address bit 3 I/O Port 1 GPIO bit 3 EMC_A[4]/P1[4] M3 VDD_EMC I/O EMC address bit 4 I/O Port 1 GPIO bit 4 EMC_A[5]/P1[5] N1 VDD_EMC I/O EMC address bit 5 I/O Port 1 GPIO bit 5 EMC_A[6]/P1[6] N2 VDD_EMC I/O EMC address bit 6 I/O Port 1 GPIO bit 6 EMC_A[7/P1[7] N3 VDD_EMC I/O EMC address bit 7 I/O Port 1 GPIO bit 7 EMC_A[8]/P1[8] M4 VDD_EMC I/O EMC address bit 8 I/O Port 1 GPIO bit 8 EMC_A[9]/P1[9] P1 VDD_EMC I/O EMC address bit 9 I/O Port 1 GPIO bit 9 EMC_A[10]/P1[10] P2 VDD_EMC I/O EMC address bit 10 I/O Port 1 GPIO bit 10 EMC_A[11]/P1[11] P3 VDD_EMC I/O EMC address bit 11 I/O Port 1 GPIO bit 11 EMC_A[12]/P1[12] N4 VDD_EMC I/O EMC address bit 12 I/O Port 1 GPIO bit 12 EMC_A[13]/P1[13] R1 VDD_EMC I/O EMC address bit 13 I/O Port 1 GPIO bit 13 EMC_A[14]/P1[14] R2 VDD_EMC I/O EMC address bit 14 I/O Port 1 GPIO bit 14 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 11 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers EMC_A[15]/P1[15] L1 VDD_EMC I/O EMC address bit 15 I/O Port 1 GPIO bit 15 EMC_A[16]/P1[16] K3 VDD_EMC I/O EMC address bit 16 I/O Port 1 GPIO bit 16 EMC_A[17]/P1[17] K4 VDD_EMC I/O EMC address bit 17 I/O Port 1 GPIO bit 17 EMC_A[18]/P1[18] K2 VDD_EMC I/O EMC address bit 18 I/O Port 1 GPIO bit 18 EMC_A[19]/P1[19] K1 VDD_EMC I/O EMC address bit 19 I/O Port 1 GPIO bit 19 EMC_A[20]/P1[20] J1 VDD_EMC I/O EMC address bit 20 I/O Port 1 GPIO bit 20 EMC_A[21]/P1[21] J2 VDD_EMC I/O EMC address bit 21 I/O Port 1 GPIO bit 21 EMC_A[22]/P1[22] J3 VDD_EMC I/O EMC address bit 22 I/O Port 1 GPIO bit 22 EMC_A[23]/P1[23] J4 VDD_EMC I/O EMC address bit 23 I/O Port 1 GPIO bit 23 EMC_BLS[0] U14 VDD_EMC O Static memory byte lane 0 select EMC_BLS[1] T13 VDD_EMC O Static memory byte lane 1 select EMC_BLS[2] R12 VDD_EMC O Static memory byte lane 2 select EMC_BLS[3] P12 VDD_EMC O Static memory byte lane 3 select EMC_CAS R5 VDD_EMC O SDRAM column address strobe out, active LOW EMC_CKE0 U3 VDD_EMC O Clock enable out for SDRAM bank 0 EMC_CKE1 L2 VDD_EMC O Clock enable out for SDRAM bank 1 EMC_CLK T3 VDD_EMC O SDRAM clock out EMC_CLKIN T4 VDD_EMC I SDRAM clock feedback EMC_CS0 U13 VDD_EMC O EMC static memory chip select 0 EMC_CS1 R11 VDD_EMC O EMC static memory chip select 1 EMC_CS2 T12 VDD_EMC O EMC static memory chip select 2 EMC_CS3 V15 VDD_EMC O EMC static memory chip select 3 EMC_D[0] U4 VDD_EMC I/O: BK EMC data bit 0 EMC_D[1] R7 VDD_EMC I/O: BK EMC data bit 1 EMC_D[2] T5 VDD_EMC I/O: BK EMC data bit 2 EMC_D[3] U5 VDD_EMC I/O: BK EMC data bit 3 EMC_D[4] V3 VDD_EMC I/O: BK EMC data bit 4 EMC_D[5] V4 VDD_EMC I/O: BK EMC data bit 5 EMC_D[6] T6 VDD_EMC I/O: BK EMC data bit 6 EMC_D[7] R8 VDD_EMC I/O: BK EMC data bit 7 EMC_D[8] V5 VDD_EMC I/O: BK EMC data bit 8 Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 12 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers EMC_D[9] U6 VDD_EMC I/O: BK EMC data bit 9 EMC_D[10] V6 VDD_EMC I/O: BK EMC data bit 10 EMC_D[11] T7 VDD_EMC I/O: BK EMC data bit 11 EMC_D[12] U7 VDD_EMC I/O: BK EMC data bit 12 EMC_D[13] V7 VDD_EMC I/O: BK EMC data bit 13 EMC_D[14] T8 VDD_EMC I/O: BK EMC data bit 14 EMC_D[15] U8 VDD_EMC I/O: BK EMC data bit 15 EMC_D[16]/ EMC_DQS0 V8 VDD_EMC I/O: BK EMC data bit 16 I/O: BK DDR data strobe 0 EMC_D[17]/ EMC_DQS1 R9 VDD_EMC I/O: BK EMC data bit 17 I/O: BK DDR data strobe 1 EMC_D[18]/ EMC_CLK V9 VDD_EMC I/O: P EMC data bit 18 I/O: P DDR inverted clock output EMC_D[19]/P2[0] U9 VDD_EMC I/O: P EMC data bit 19 I/O: P Port 2 GPIO bit 0 EMC_D[20]/P2[1] T9 VDD_EMC I/O: P EMC data bit 20 I/O: P Port 2 GPIO bit 1 EMC_D[21]/P2[2] V10 VDD_EMC I/O: P EMC data bit 21 I/O: P Port 2 GPIO bit 2 EMC_D[22]/P2[3] U10 VDD_EMC I/O: P EMC data bit 22 I/O: P Port 2 GPIO bit 3 EMC_D[23]/P2[4] T10 VDD_EMC I/O: P EMC data bit 23 I/O: P Port 2 GPIO bit 4 EMC_D[24]/P2[5] R10 VDD_EMC I/O: P EMC data bit 24 I/O: P Port 2 GPIO bit 5 EMC_D[25]/P2[6] V11 VDD_EMC I/O: P EMC data bit 25 I/O: P Port 2 GPIO bit 6 EMC_D[26]/P2[7] U11 VDD_EMC I/O: P EMC data bit 26 I/O: P Port 2 GPIO bit 7 EMC_D[27]/P2[8] T11 VDD_EMC I/O: P EMC data bit 27 I/O: P Port 2 GPIO bit 8 EMC_D[28]/P2[9] V12 VDD_EMC I/O: P EMC data bit 28 I/O: P Port 2 GPIO bit 9 EMC_D[29]/P2[10] V13 VDD_EMC I/O: P EMC data bit 29 I/O: P Port 2 GPIO bit 10 EMC_D[30]/P2[11] U12 VDD_EMC I/O: P EMC data bit 30 I/O: P Port 2 GPIO bit 11 EMC_D[31]/P2[12] V14 VDD_EMC I/O: P EMC data bit 31 I/O: P Port 2 GPIO bit 12 EMC_DQM[0] R3 VDD_EMC O SDRAM data mask 0 out Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 13 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers EMC_DQM[1] P4 VDD_EMC O SDRAM data mask 1 out EMC_DQM[2] T1 VDD_EMC O SDRAM data mask 2 out EMC_DQM[3] P5 VDD_EMC O SDRAM data mask 3 out EMC_DYCS0 R6 VDD_EMC O SDRAM active LOW chip select 0 EMC_DYCS1 G1 VDD_EMC O SDRAM active LOW chip select 1 EMC_OE H1 VDD_EMC O EMC static memory output enable EMC_RAS T2 VDD_EMC O SDRAM row address strobe, active LOW EMC_WR R4 VDD_EMC O EMC write strobe, active LOW FLASH_ALE D2 VDD_IOC O Flash address latch enable FLASH_CE E3 VDD_IOC O Flash chip enable FLASH_CLE F3 VDD_IOC O Flash command latch enable FLASH_IO[0] H2 VDD_IOC I/O: BK Flash data bus, bit 0 FLASH_IO[1] H3 VDD_IOC I/O: BK Flash data bus, bit 1 FLASH_IO[2] F1 VDD_IOC I/O: BK Flash data bus, bit 2 FLASH_IO[3] E1 VDD_IOC I/O: BK Flash data bus, bit 3 FLASH_IO[4] H4 VDD_IOC I/O: BK Flash data bus, bit 4 FLASH_IO[5] G2 VDD_IOC I/O: BK Flash data bus, bit 5 FLASH_IO[6] G3 VDD_IOC I/O: BK Flash data bus, bit 6 FLASH_IO[7] E2 VDD_IOC I/O: BK Flash data bus, bit 7 FLASH_RD C1 VDD_IOC O Flash read enable FLASH_RDY D1 VDD_IOC I Flash ready (from flash device) FLASH_WR F2 VDD_IOC O Flash write enable GPI_0/I2S1RX_SDA C16 VDD_IOD I General purpose input 0 I I2S1 Receive data GPI_1/SERVICE C15 VDD_IOD I General purpose input 1 I Boot select input GPI_2/CAP2[0]/ ENET_RXD3 C14 VDD_IOD I General purpose input 2 I Timer 2 capture input 0 I Ethernet receive data 3 (LPC3240 and LPC3250 only) GPI_3 F4 VDD_IOC I General purpose input 3 GPI_4/SPI1_BUSY E13 VDD_IOD I General purpose input 4 I SPI1 busy input GPI_5/U3_DCD N16 VDD_IOA I General purpose input 5 I UART 3 data carrier detect input GPI_6/ HSTIM_CAP/ ENET_RXD2 C7 VDD_IOB I: BK General purpose input 6 I: BK High-speed timer capture input I : BK Ethernet receive data 2 (LPC3240 and LPC3250 only) Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 14 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers GPI_7/CAP4[0]/ MCABORT D13 VDD_IOD I General purpose input 7 I Timer 4 capture input 0 I Motor control PWM LOW-active fast abort input GPI_8/KEY_COL6/ SPI2_BUSY/ ENET_RX_DV B16 VDD_IOD I General purpose input 8 I Keyscan column 6 input I SPI2 busy input I Ethernet receive data valid input (LPC3240 and LPC3250 only) GPI_9/KEY_COL7/ ENET_COL E12 VDD_IOD I General purpose input 9 I Keyscan column 7 input I Ethernet collision input (LPC3240 and LPC3250 only) GPI_19/U4_RX B15 VDD_IOD I General purpose input 19 I UART 4 receive GPI_28/U3_RI N17 VDD_IOA I General purpose input 28 I UART 3 ring indicator input GPIO_0 A12 VDD_IOD I/O General purpose input/output 0 GPIO_1 A11 VDD_IOD I/O General purpose input/output 1 GPIO_2/ KEY_ROW6/ ENET_MDC D9 VDD_IOD I/O General purpose input/output 2 O Keyscan row 6 output O Ethernet PHY interface clock (LPC3240 and LPC3250 only) GPIO_3/ KEY_ROW7/ ENET_MDIO C11 VDD_IOD I/O General purpose input/output 3 I/O Keyscan row 7 output I/O Ethernet PHY interface data (LPC3240 and LPC3250 only) GPIO_4/ SSEL1/ LCDVD[22] B11 VDD_IOD I/O General purpose input/output 4 I/O SSP1 Slave Select I/O LCD data bit 22 (LPC3230 and LPC3250 only) GPIO_5/ SSEL0/ MCI0 E9 VDD_IOD I/O General purpose input/output 5 I/O SSP0 Slave Select I/O Motor control channel 0 input GPO_0/ TST_CLK1 C3 VDD_IOC O General purpose output 0 O Test clock 1 out GPO_1 D4 VDD_IOC O General purpose output 1 GPO_2/ MAT1[0]/ LCDVD[0] B14 VDD_IOD O General purpose output 2 O Timer 1 match output 0 O LCD data bit 0 (LPC3230 and LPC3250 only) GPO_3/ LCDVD[1] D12 VDD_IOD O General purpose output 3 O LCD data bit 1 (LPC3230 and LPC3250 only) GPO_4 D8 VDD_IOB O General purpose output 4 Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 15 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers GPO_5 B3 VDD_IOC O General purpose output 5 GPO_6/ LCDVD[18] A16 VDD_IOD O General purpose output 6 O LCD data bit 18 (LPC3230 and LPC3250 only) GPO_7/ LCDVD[2] A15 VDD_IOD O General purpose output 7 O LCD data bit 2 (LPC3230 and LPC3250 only) GPO_8/ LCDVD[8] C13 VDD_IOD O General purpose output 8 O LCD data bit 8 (LPC3230 and LPC3250 only) GPO_9/ LCDVD[9] C12 VDD_IOD O General purpose output 9 O LCD data bit 9 (LPC3230 and LPC3250 only) GPO_10/ MCOB2/ LCDPWR E11 VDD_IOD O General purpose output 10 O Motor control PWM channel 2, output B O LCD panel power enable (LPC3230 and LPC3250 only) GPO_11 E8 VDD_IOB O General purpose output 11 GPO_12/ MCOA2/ LCDLE B12 VDD_IOD O General purpose output 12 O Motor control PWM channel 2, output A O LCD line end signal (LPC3230 and LPC3250 only) GPO_13/ MCOB1/ LCDDCLK B13 VDD_IOD O General purpose output 13 O Motor control PWM channel 1, output B O LCD clock output (LPC3230 and LPC3250 only) GPO_14 D3 VDD_IOC O General purpose output 14 GPO_15/ MCOA1/ LCDFP A14 VDD_IOD O General purpose output 15 O Motor control PWM channel 1, output A O LCD frame/sync pulse (LPC3230 and LPC3250 only) GPO_16/ MCOB0/ LCDENAB/LCDM D10 VDD_IOD O General purpose output 16 O Motor control PWM channel 0, output B O LCD STN AC bias/TFT data enable (LPC3230 and LPC3250 only) GPO_17 N18 VDD_IOA O General purpose output 17 GPO_18/ MCOA0/ LCDLP D11 VDD_IOD O General purpose output 18 O Motor control PWM channel 0, output A O LCD line sync/horizontal sync (LPC3230 and LPC3250 only) GPO_19 C2 VDD_IOC O General purpose output 19 GPO_20 B2 VDD_IOC O General purpose output 20 GPO_21/ U4_TX/ LCDVD[3] A13 VDD_IOD O General purpose output 21 O UART 4 transmit O LCD data bit 3 (LPC3230 and LPC3250 only) Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 16 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers GPO_22/ U7_HRTS/ LCDVD[14] E10 VDD_IOD O General purpose output 22 O HS UART 7 RTS out O LCD data bit 14 (LPC3230 and LPC3250 only) GPO_23/ U2_HRTS/ U3_RTS M16 VDD_IOA O General purpose output 23 O HS U ART 2 RTS out O UART 3 RTS out HIGHCORE/ LCDVD[17] H16 VDD_IOD O Core voltage control out O LCD data bit 17 (LPC3230 and LPC3250 only) I2C1_SCL A5 VDD_IOB I/O T I2C1 serial clock input/output I2C1_SDA B6 VDD_IOB I/O T I2C1 serial data input/output I2C2_SCL A3 VDD_IOC I/O T I2C2 serial clock input/output I2C2_SDA E4 VDD_IOC I/O T I2C2 serial data input/output I2S1TX_CLK/ MAT3[0] A4 VDD_IOB I/O I2S1 transmit clock O Timer 3 match output 0 I2S1TX_SDA/ MAT3[1] E7 VDD_IOB I/O I2S1 transmit data O Timer 3 match output 1 I2S1TX_WS/ CAP3[0] B4 VDD_IOB I/O I2S1 transmit word select I/O Timer 3 capture input 0 JTAG_NTRST H17 VDD_IOD I: PU JTAG1 reset input. Must be LOW during power-on reset. JTAG_RTCK H18 VDD_IOD O JTAG1 return clock out JTAG_TCK H14 VDD_IOD I JTAG1 clock input JTAG_TDI J16 VDD_IOD I: PU JTAG1 data input JTAG_TDO J15 VDD_IOD O JTAG1 data out JTAG_TMS G18 VDD_IOD I: PU TAG1 test mode select input KEY_COL0/ ENET_TX_CLK F15 VDD_IOD I Keyscan column 0 input I Ethernet transmit clock (LPC3240 and LPC3250 only) KEY_COL1/ ENET_RX_CLK/ ENET_REF_CLK E16 VDD_IOD I Keyscan column 1 input I Ethernet receive clock (MII mode, LPC3240 and LPC3250 only) I Ethernet reference clock (RMII mode, LPC3240 and LPC3250 only) KEY_COL2/ ENET_RX_ER D17 VDD_IOD I Keyscan column 2 input I Ethernet receive error input (LPC3240 and LPC3250 only) KEY_COL3/ ENET_CRS D18 VDD_IOD I Keyscan column 3 input I Ethernet carrier sense input (LPC3240 and LPC3250 only) KEY_COL4/ ENET_RXD0 G15 VDD_IOD I Keyscan column 4 input I Ethernet receive data 0 (LPC3240 and LPC3250 only) Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 17 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers KEY_COL5/ ENET_RXD1 F16 VDD_IOD I Keyscan column 5 input I Ethernet receive data 1 (LPC3240 and LPC3250 only) KEY_ROW0/ ENET_TX_ER E15 VDD_IOD I/O T Keyscan row 0 out I/O T Ethernet transmit error (LPC3240 and LPC3250 only) KEY_ROW1/ ENET_TXD2 E14 VDD_IOD I/O T Keyscan row 1 out I/O T Ethernet transmit data 2 (LPC3240 and LPC3250 only) KEY_ROW2/ ENET_TXD3 F14 VDD_IOD I/O T Keyscan row 2 out I/O T Ethernet transmit data 3 (LPC3240 and LPC3250 only) KEY_ROW3/ ENET_TX_EN D16 VDD_IOD I/O T Keyscan row 3 out I/O T Ethernet transmit enable (LPC3240 and LPC3250 only) KEY_ROW4/ ENET_TXD0 C17 VDD_IOD I/O T Keyscan row 4 out I/O T Ethernet transmit data 0 (LPC3240 and LPC3250 only) KEY_ROW5/ ENET_TXD1 C18 VDD_IOD I/O T Keyscan row 5 out I/O T Ethernet transmit data 1 (LPC3240 and LPC3250 only) MS_BS/MAT2[1] A6 VDD_IOD I/O: P MS/SD card command out O Timer 2 match output 1 MS_DIO0/MAT0[0] A8 VDD_IOD I/O: P MS/SD card data 0 O Timer 0 match output 0 MS_DIO1/ MAT0[1] A7 VDD_IOD I/O: P MS/SD card data 1 O Timer 0 match output 1 MS_DIO2/ MAT0[2] B8 VDD_IOD I/O: P MS/SD card data 2 O Timer 0 match output 2 MS_DIO3/ MAT0[3] C8 VDD_IOD I/O: P MS/SD card data 3 O Timer 0 match output 3 MS_SCLK/ MAT2[0] B7 VDD_IOD I/O MS/SD card clock output O Timer 2 match output 0 n.c. B17, U17, U2 - - not connected ONSW M15 VDD_RTC O RTC match output for external power control P0[0]/ I2S1RX_CLK B5 VDD_IOB I/O Port 0 GPIO bit 0 I/O I2S1 receive clock P0[1]/ I2S1RX_WS D7 VDD_IOB I/O Port 0 GPIO bit 1 I/O I2S1 receive word select Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 18 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers P0[2]/ I2S0RX_SDA/ LCDVD[4] M17 VDD_IOA I/O Port 0 GPIO bit 2 I/O I2S0 receive data I/O LCD data bit 4 (LPC3230 and LPC3250 only) P0[3]/ I2S0RX_CLK/ LCDVD[5] M18 VDD_IOA I/O Port 0 GPIO bit 3 I/O I2S0 receive clock I/O LCD data bit 5 (LPC3230 and LPC3250 only) P0[4]/ I2S0RX_WS/ LCDVD[6] L15 VDD_IOA I/O Port 0 GPIO bit 4 I/O I2S0 receive word select I/O LCD data bit 6 (LPC3230 and LPC3250 only) P0[5]/ I2S0TX_SDA/ LCDVD[7] L16 VDD_IOA I/O Port 0 GPIO bit 5 I/O I2S0 transmit data I/O LCD data bit 7 (LPC3230 and LPC3250 only) P0[6]/ I2S0TX_CLK/ LCDVD[12] L17 VDD_IOA I/O Port 0 GPIO bit 6 I/O I2S0 transmit clock I/O LCD data bit 12 (LPC3230 and LPC3250 only) P0[7]/ I2S0TX_WS/ LCDVD[13] L18 VDD_IOA I/O Port 0 GPIO bit 7 I/O I2S0 transmit word select I/O LCD data bit 13 (LPC3230 and LPC3250 only) PLL397_LOOP R14 VDD_PLL397 analog filter PLL397 loop filter (for external components) PWM_OUT1/ LCDVD[16] D14 VDD_IOD O PWM1 out O LCD data bit 16 (LPC3230 and LPC3250 only) PWM_OUT2/INTSTAT/ LCDVD[19] D15 VDD_IOD O PWM2 output/internal interrupt status[1] O LCD data bit 19 (LPC3230 and LPC3250 only) RESET M14 VDD_RTC I Reset input, active LOW RESOUT G4 VDD_IOC O Reset out. Reflects external and WDT reset RTCX_IN P16 VDD_RTC analog in RTC oscillator input RTCX_OUT P17 VDD_RTC analog out RTC oscillator output SPI1_CLK/ SCK0 C9 VDD_IOD O SPI1 clock out O SSP0 clock out SPI1_DATIN/ MISO0/ GPI_25/ MCI1 C10 VDD_IOD I/O SPI1 data in I/O SSP0 MISO I/O General purpose input bit 25 I Motor control channel 1 input SPI1_DATIO/ MOSI0/ MCI2 B9 VDD_IOD I/O SPI1 data out (and optional input) I/O SSP0 MOSI I Motor control channel 2 input SPI2_CLK/ SCK1/ LCDVD[23] B10 VDD_IOD I/O SPI2 clock out I/O SSP1 clock out I/O LCD data bit 23 (LPC3230 and LPC3250 only) Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 19 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers SPI2_DATIO/ MOSI1/ LCDVD[20] A9 VDD_IOD I/O SPI2 data out (and optional input) I/O SSP1 MOSI I/O LCD data bit 20 (LPC3230 and LPC3250 only) SPI2_DATIN/ MISO1/ LCDVD[21]/ GPI_27 A10 VDD_IOD I/O SPI2 data in I/O SSP1 MISO I/O LCD data 21 (LPC3230 and LPC3250 only) I/O General purpose input bit 27 SYSCLKEN/ LCDVD[15] G17 VDD_IOD I/O T Clock request out for external clock source I/O T LCD data bit 15 (LPC3230 and LPC3250 only) SYSX_IN T17 VDD_OSC analog in System clock oscillator input SYSX_OUT R15 VDD_OSC analog out System clock oscillator output TS_XP R13 VDD_AD I/O Touchscreen X output TS_YP U16 VDD_AD I/O Touchscreen Y output TST_CLK2 C6 VDD_IOB O Test clock 2 out U1_RX/CAP1[0]/ GPI_15 K15 VDD_IOA I/O HS UART 1 receive I/O Timer 1 capture input 0 I/O General purpose input bit 15 U1_TX K16 VDD_IOA O HS UART 1 transmit U2_HCTS/ U3_CTS/GPI_16 J18 VDD_IOA I/O HS UART 2 Clear to Send input I UART 3 Clear to Send I/O General purpose input bit 16 U2_RX/ U3_DSR/GPI_17 K18 VDD_IOA I/O HS UART 2 receive I/O UART 3 data set ready I/O General purpose input bit 17 U2_TX/U3_DTR K17 VDD_IOA O HS UART 2 transmit O UART 3 data terminal ready out U3_RX/ GPI_18 J14 VDD_IOD I/O UART 3 receive I/O General purpose input bit 18 U3_TX J17 VDD_IOD O UART 3 transmit U5_RX/ GPI_20 F18 VDD_IOD I/O UART 5 receive I General purpose input bit 20 U5_TX H15 VDD_IOD O UART 5 transmit U6_IRRX/ GPI_21 F17 VDD_IOD I/O UART 6 receive (with IrDA) I General purpose input bit 21 U6_IRTX G16 VDD_IOD O UART 6 transmit (with IrDA) U7_HCTS/ CAP0[1]/ LCDCLKIN/ GPI_22 G13 VDD_IOD I HS UART 7 CTS in I Timer 0 capture input 1 I LCD panel clock in (LPC3230 and LPC3250 only) I General purpose input bit 22 Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 20 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers U7_RX/ CAP0[0]/ LCDVD[10]/ GPI_23 E17 VDD_IOD I/O HS UART 7 receive I/O Timer 0 capture input 0 I/O LCD data bit 10 (LPC3230 and LPC3250 only) I/O General purpose input bit 23 U7_TX/ MAT1[1]/ LCDVD[11] E18 VDD_IOD O HS UART 7 transmit O Timer 1 match output 1 O LCD data bit 11 (LPC3230 and LPC3250 only) USB_ATX_INT C4 VDD_IOC I Interrupt from USB ATX USB_DAT_VP/ U5_RX D5 VDD_IOC I/O: P USB transmit data, D+ receive I/O: P UART 5 receive USB_I2C_SCL E5 VDD_IOC I/O T I2C clock for USB ATX interface USB_I2C_SDA E6 VDD_IOC I/O T I2C data for USB ATX interface USB_OE_TP D6 VDD_IOC I/O USB transmit enable for DAT/SE0 USB_SE0_VM/ U5_TX C5 VDD_IOC I/O: P USB single ended zero transmit, D Receive I/O: P UART 5 transmit VDD_AD N12, N13 VDD_AD power 3.3 V supply for ADC/touch screen VDD_CORE G7, G9, G11, J7, J12, M7, M11 VDD_CORE power 1.2 V or 0.9 V supply for core VDD_COREFXD L12, M13 VDD_COREFXD power Fixed 1.2 V supply for digital portion of the analog block VDD_EMC J6, K6, K7, L6, M6, M8, N7, N8, N9, N10, N11 VDD_EMC power 1.8 V or 2.5 V or 3.3 V supply for External Memory Controller (EMC) VDD_IOA H13, J13 VDD_IOA power 1.8 V or 3.3 V supply for IOA domain VDD_IOB F8 VDD_IOB power 1.8 V or 3.3 V supply for IOB domain VDD_IOC F7, G6, H6, J5 VDD_IOC power 1.8 V or 3.3 V supply for IOC domain VDD_IOD F13, F9 VDD_IOD power 1.8 V to 3.3 V supply for IOD domain VDD_OSC T18 VDD_OSC power 1.2 V supply for main oscillator Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 21 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] The PWM2_CTRL register controls this pin function (see LPC32x0 User manual). VDD_PLL397 T16 VDD_PLL397 power 1.2 V supply for 397x PLL VDD_PLLHCLK R17 VDD_PLLHCLK power 1.2 V supply for HCLK PLL VDD_PLLUSB P15 VDD_PLLUSB power 1.2 V supply for USB PLL VDD_FUSE N14 VDD_FUSE power 1.2 V supply VDD_RTC K14 VDD_RTC power 1.2 V supply for RTC I/O VDD_RTCCORE L13 VDD_RTCCORE power 1.2 V supply for RTC VDD_RTCOSC N15 VDD_RTCOSC power 1.2 V supply for RTC oscillator VSS_AD P13 - power Ground for ADC/touch screen VSS_CORE G8, G10, G12, H7, K12, L7, M9, M10, M12 - power Ground for core VSS_EMC K5, L5, M5, N5, N6, P6, P7, P8, P9, P10, P11 - power Ground for EMC VSS_IOA K13 - power Ground VDD_IOA domain VSS_IOB F6 - power Ground VDD_IOB domain VSS_IOC F5, G5, H5 - power Ground VDD_IOC domain VSS_IOD F10, F11, F12, H12 - power Ground VDD_IOD domain VSS_OSC P14 - power Ground for main oscillator VSS_PLL397 T15 - power Ground for 397x PLL VSS_PLLHCLK R18 - power Ground for HCLK PLL VSS_PLLUSB R16 - power Ground for USB PLL VSS_RTCCORE L14 - power Ground for RTC VSS_RTCOSC P18 - power Ground for RTC oscillator Table 4. Pin description …continued Symbol Pin Power supply domain Type Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 22 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] See LPC32x0 User manual for details. Table 5. Digital I/O pad types[1] Parameter Abbreviation I/O type I = input. O = output. I/O = bidirectional. I/O T = bidirectional or high impedance. Pin detail BK: pin has a bus keeper function that weakly retains the last logic level driven on an I/O pin. Bus keeper current for different I/O pin voltages: 0 V= 1 A (max) VDD_x = 1 A (max) 2/3  VDD_x = 55 A (max) 1/3  VDD_x = 60 A (max) PU: pin has a nominal 50 A internal pull-up connected. PD: pin has a nominal 50 A internal pull-down connected. P: pin has programmable input characteristics. Table 6. Supply domains Supply domain Voltage range Related supply pins Description VDD_CORE 0.9 V to 1.39 V VDD_CORE Core power domain. VDD_COREFXD 1.2 V VDD_COREFXD Fixed 1.2 V supply for digital portion of the analog block. other core domains 1.2 V VDD_PLL397, VDD_PLLHCLK, VDD_PLLUSB, VDD_FUSE, VDD_OSC 1.2 V supplies, tied to VDD_COREFXD. VDD_RTC 0.9 V to 1.39 V VDD_RTC, VDD_RTCCORE, VDD_RTCOSC RTC supply domain. Can be connected to a battery backed-up power source. VDD_AD 2.7 V to 3.6 V VDD_AD 3.3 V supply for ADC and touch screen. VDD_EMC 1.7 V to 1.95 V 2.3 V to 2.7 V 2.7 V to 3.6 V VDD_EMC External memory interface IO pins in 1.8 V range, 2.5 V range, or 3.3 V range. VDD_IOA[1] 1.7 V to 1.95 V or 2.7 V to 3.6 V VDD_IOA Peripheral supply. VDD_IOB[1] 1.7 V to 1.95 V or 2.7 V to 3.6 V VDD_IOB Peripheral supply. VDD_IOC[1] 1.7 V to 1.95 V or 2.3 V to 3.6 V VDD_IOC Peripheral supply. VDD_IOD[1] 1.7 V to 1.95 V or 2.7 V to 3.6 V VDD_IOD Peripheral supply. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 23 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] The VDD_IOA, VDD_IOB, VDD_IOC, and VDD_IOD supply domains can be operated at a voltage independent of the other domains as long as all pins connected to the same peripheral are at the same voltage level. There are two special cases for determining supply domain voltages (for details see application note AN10777): a) Ethernet configured in MII mode: VDD_IOD must be the same as VDD_IOB. b) UART 3 when used with hardware flow control or when sharing an RS-232 transceiver with another UART: VDD_IOA must be the same as VDD_IOD. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 24 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7. Functional description 7.1 CPU and subsystems 7.1.1 CPU NXP created the LPC3220/30/40/50 using an ARM926EJ-S CPU core that includes a Harvard architecture and a 5-stage pipeline. To this ARM core, NXP implemented a 32 kB instruction cache, a 32 kB data cache and a Vector Floating Point coprocessor. The ARM926EJ-S core also has an integral Memory Management Unit (MMU) to provide the virtual memory capabilities required to support the multi-programming demands of modern operating systems. The basic ARM926EJ-S core V5TE instruction set includes DSP instruction extensions for native Jazelle Java Byte-code execution in hardware. The LPC3220/30/40/50 operates at CPU frequencies up to 266 MHz. 7.1.2 Vector Floating Point (VFP) coprocessor The LPC3220/30/40/50 includes a VFP co-processor providing full support for single-precision and double-precision add, subtract, multiply, divide, and multiply-accumulate operations at CPU clock speeds. It is compliant with the IEEE 754 standard for binary Floating-Point Arithmetic. This hardware floating point capability makes the microcontroller suitable for advanced motor control and DSP applications. The VFP has 3 separate pipelines for floating-point MAC operations, divide or square root operations, and Load/Store operations. These pipelines operate in parallel and can complete execution out of order. All single-precision instructions execute in one cycle, except the divide and square root instructions. All double-precision multiply and multiply-accumulate instructions take two cycles. The VFP also provides format conversions between floating-point and integer word formats. 7.1.3 Emulation and debugging The LPC3220/30/40/50 supports emulation and debugging via a dedicated JTAG serial port. An Embedded Trace Buffer allows tracing program execution. The dedicated JTAG port allows debugging of all chip features without impact to any pins that may be used in the application. 7.1.3.1 Embedded ICE Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an Embedded ICE protocol converter. The Embedded ICE protocol converter converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM core. The ARM core has a Debug Communication Channel (DCC) function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or entering the debug state. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 25 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.1.3.2 Embedded trace buffer The Embedded Trace Module (ETM) is connected directly to the ARM core. It compresses the trace information and exports it through a narrow trace port. An internal Embedded Trace Buffer (ETB) of 2048  24 bits captures the trace information under software debugger control. Data from the ETB is recovered by the debug software through the JTAG port. The trace contains information about when the ARM core switches between states. Instruction shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. For data accesses either data or address or both can be traced. 7.2 AHB matrix The LPC3220/30/40/50 has a multi-layer AHB matrix for inter-block communication. AHB is an ARM defined high-speed bus, which is part of the ARM bus architecture. AHB is a high-bandwidth low-latency bus that supports multi-master arbitration and a bus grant/request mechanism. For systems that have only one (CPU), or two (CPU and DMA) bus masters a simple AHB works well. However, if a system requires multiple bus masters and the CPU needs access to external memory, a single AHB bus can cause a bottleneck. To increase performance, the LPC3220/30/40/50 uses an expanded AHB architecture known as Multi-layer AHB. A Multi-layer AHB replaces the request/grant and arbitration mechanism used in a simple AHB with an interconnect matrix that moves arbitration out toward the slave devices. Thus, if a CPU and a DMA controller want access to the same memory, the interconnect matrix arbitrates between the two when granting access to the memory. This advanced architecture allows simultaneous access by bus masters to different resources with an increase in arbitration complexity. In this architectural implementation, removing guaranteed central arbitration and allowing more than one bus master to be active at the same time provides better overall microcontroller performance. In the LPC3220/30/40/50, the multi-Layer AHB system has a separate bus for each of seven AHB Masters: • CPU data bus • CPU instruction bus • General purpose DMA Master 0 • General purpose DMA Master 1 • Ethernet controller • USB controller • LCD controller There are no arbitration delays unless two masters attempt to access the same slave at the same time. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 26 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.2.1 APB Many peripheral functions are accessed by on-chip APBs that are attached to the higher speed AHB. The APB performs reads and writes to peripheral registers in three peripheral clocks. 7.2.2 FAB Some peripherals are placed on a special bus called FAB that allows faster CPU access to those peripheral functions. A write access to FAB peripherals takes a single AHB clock and a read access to FAB peripherals takes two AHB clocks. 7.3 Physical memory map The physical memory map incorporates several distinct regions, as shown in Figure 3. When an application is running, the CPU interrupt vectors are re-mapped to allow them to reside in on-chip SRAM (IRAM). LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 27 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Fig 3. LPC3220/30/40/50 memory map on-chip memory 0x4000 0000 0x0000 0000 0.0 GB 768 MB 1.0 GB 4.0 GB peripherals on AHB matrix slave port 5 0x0FFF FFFF 0x2000 0000 0x3000 0000 0x2FFF FFFF 0x1FFF FFFF 0x8000 0000 0xFFFF FFFF 0x1000 0000 0x3FFF FFFF 0x4FFF FFFF 0x5000 0000 0x7FFF FFFF peripherals on AHB matrix slave port 6 peripherals on AHB matrix slave port 7 off-chip memory IROM or IRAM 0x0000 0000 to 0x03FF FFFF dummy space for DMA 0x0400 0000 to 0x07FF FFFF IRAM 0x0800 0000 to 0x0BFF FFFF IROM 0x0C00 0000 to 0x0FFF FFFF AHB peripherals 0x2000 0000 to 0x2007 FFFF AHB peripherals 0x200A 0000 to 0x200B FFFF APB peripherals 0x2008 0000 to 0x2009 FFFF RESERVED AHB peripherals 0x3000 0000 to 0x31FF FFFF RESERVED FAB peripherals 0x4000 0000 to 0x4007 FFFF APB peripherals 0x4008 0000 to 0x400F FFFF RESERVED RESERVED RESERVED RESERVED RESERVED 0x9FFF FFFF 0xA000 0000 0xBFFF FFFF 0xC000 0000 0xDFFF FFFF 0xE000 0000 0xE0FF FFFF 0xE100 0000 0xE1FF FFFF 0xE200 0000 0xE2FF FFFF 0xE300 0000 0xE3FF FFFF 0xE400 0000 2.0 GB EMC_DYCS0 EMC_DYCS1 EMC_CS0 EMC_CS1 EMC_CS2 EMC_CS3 002aae468 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 28 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.4 Internal memory 7.4.1 On-chip ROM The built-in 16 kB ROM contains a program which runs a boot procedure to load code from one of four external sources, UART 5, SSP0 (SPI mode), EMC Static CS0 memory, or NAND FLASH. After reset, execution always begins from the internal ROM. The bootstrap software first reads the SERVICE input (GPI_1). If SERVICE is LOW, the bootstrap starts a service boot and can download a program over serial link UART 5 to IRAM and transfer execution to the downloaded code. If the SERVICE pin is HIGH, the bootstrap routine jumps to normal boot. The normal boot process first tests SPI memory for boot information if present it uploads the boot code and transfers execution to the uploaded software. If the SPI is not present or no software is loaded, the bootloader will test the EMC Static CS0 memory for the presence of boot code and if present boots from static memory, If this test fails the boot loader will test external NAND flash for boot code and boot if code is present. The boot loader consumes no user memory space because it is in ROM. 7.4.2 On-chip SRAM On-chip SRAM may be used for code and/or data storage. The SRAM may be accessed as 8, 16, or 32 bit memory. The LPC3220/30/40/50 provides 256 kB of internal SRAM. 7.5 External memory interfaces The LPC3220/30/40/50 includes three external memory interfaces, NAND Flash controllers, Secure Digital Memory Controller, and an external memory controller for SDRAM, DDR SDRAM, and Static Memory devices. 7.5.1 NAND flash controllers The LPC3220/30/40/50 includes two NAND flash controllers, one for multi-level cell NAND flash devices and one for single-level cell NAND flash devices. The two NAND flash controllers use the same pins to interface to external NAND flash devices, so only one interface is active at a time. 7.5.1.1 Multi-Level Cell (MLC) NAND flash controller The MLC NAND flash controller interfaces to either multi-level or single-level NAND flash devices. An external NAND flash device is used to allow the bootloader to automatically load a portion of the application code into internal SRAM for execution following reset. The MLC NAND flash controller supports small (528 byte) and large (2114 byte) pages. Programmable NAND timing parameters allow support for a variety of NAND flash devices. A built-in Reed-Solomon encoder/decoder provides error detection and correction capability. A 528 byte data buffer reduces the need for CPU supervision during loading. The MLC NAND flash controller also provides DMA support. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 29 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.5.1.2 Single-Level Cell (SLC) NAND flash controller The SLC NAND flash controller interfaces to single-level NAND flash devices. DMA page transfers are supported, including a 20-byte DMA read and write FIFO. Hardware support for ECC (Error Checking and Correction) is included for the main data area. Software can correct a single bit error. 7.5.2 SD card controller The SD interface allows access to external SD memory cards. The SD card interface conforms to the SD Memory Card Specification Version 1.01. 7.5.2.1 Features • 1-bit and 4-bit data line interface support. • DMA is supported through the system DMA controller. • Provides all functions specific to the SD memory card. These include the clock generation unit, power management control, command and data transfer. 7.5.3 External memory controller The LPC3220/30/40/50 includes a memory controller that supports data bus SDRAM, DDR SDRAM, and static memory devices. The memory controller provides an interface between the system bus and external (off-chip) memory devices. The controller supports 16-bit and 32-bit wide SDR SDRAM devices of 64 Mbit, 128 Mbit, 128 Mbit, 256 Mbit, and 512 Mbit sizes, as well as 16-bit wide data bus DDR SDRAM devices of 64 Mbit, 128 Mbit, 128 Mbit, 256 Mbit, and 512 Mbit sizes. Two dynamic memory chip selects are supplied, supporting two groups of SDRAM: • DYCS0 in the address range 0x8000 0000 to 0x9FFF FFFF • DYCS1 in the address range 0xA000 0000 to 0xBFFF FFFF The memory controller also supports 8-bit, 16-bit, and 32-bit wide asynchronous static memory devices, including RAM, ROM, and flash, with or without asynchronous page mode. Four static memory chip selects are supplied for SRAM devices: • CS0 in the address range 0xE000 0000 to 0xE0FF FFFF • CS1 in the address range 0xE100 0000 to 0xE1FF FFFF • CS2 in the address range 0xE200 0000 to 0xE2FF FFFF • CS3 in the address range 0xE300 0000 to 0xE3FF FFFF The SDRAM controller uses three data ports to allow simultaneous requests from multiple on-chip AHB bus masters and has the following features. • Dynamic memory interface supports SDRAM, DDR-SDRAM, and low-power variants. • Read and write buffers to reduce latency and improve performance. • Static memory features include – asynchronous page mode read – programmable wait states – bus turnaround cycles – output enable and write enable delays LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 30 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers – extended wait • Power-saving modes dynamically control EMC_CKE[1:0] and EMC_CLK. • Dynamic memory self-refresh mode supported by software. • Controller supports 2 k, 4 k, and 8 k row address synchronous memory parts. That is, typical 512 MB, 256 MB, 128 MB, and 16 MB parts, with 8, 16, or 32 data bits per device. • Two reset domains enable dynamic memory contents to be preserved over a soft reset. • This controller does not support synchronous static memory devices (burst mode devices). 7.6 AHB master peripherals The LPC3220/30/40/50 implements four AHB master peripherals, which include a General Purpose Direct Memory Access (GPDMA) controller, a 10/100 Ethernet Media Access Controller (MAC), a Universal Serial Bus (USB) controller, and an LCD controller. Each of these four peripherals contain an integral DMA controller optimized to support the performance demands of the peripheral. 7.6.1 General Purpose DMA (GPDMA) controller The GPDMA controller allows peripheral-to memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For example, a bidirectional port requires one stream for transmit and one for receive. The source and destination areas can each be either a memory region or a peripheral, and can be accessed through the same AHB master, or one area by each master. The DMA controller supports the following peripheral device transfers. • Secure Digital (SD) Memory interface • High-speed UARTs • I2S0 and I2S1 ports • SPI1 and SPI2 interfaces • SSP0 and SSP1 interfaces • Memory The DMA controls eight DMA channels with hardware prioritization. The DMA controller interfaces to the system via two AHB bus masters, each with a full 32-bit data bus width. DMA operations may be set up for 8-bit, 16-bit, and 32-bit data widths, and can be either big-endian or little-endian. Incrementing or non-incrementing addressing for source and destination are supported, as well as programmable DMA burst size. Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. 7.6.2 Ethernet MAC The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 31 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU. The Ethernet DMA can access off-chip memory via the EMC, as well as the IRAM. The Ethernet block interfaces between an off-chip Ethernet PHY using the Media Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus. 7.6.2.1 Features • Ethernet standards support: – Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. – Fully compliant with IEEE standard 802.3. – Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back pressure. – Flexible transmit and receive frame options. – Virtual Local Area Network (VLAN) frame support. • Memory management: – Independent transmit and receive buffers memory mapped to SRAM. – DMA managers with scatter/gather DMA and arrays of frame descriptors. – Memory traffic optimized by buffering and pre-fetching. • Enhanced Ethernet features: – Receive filtering. – Multicast and broadcast frame support for both transmit and receive. – Optional automatic Frame Check Sequence (FCS) insertion with Circular Redundancy Check (CRC) for transmit. – Selectable automatic transmit frame padding. – Over-length frame support for both transmit and receive allows any length frames. – Promiscuous receive mode. – Automatic collision back-off and frame retransmission. – Includes power management by clock switching. Wake-on-LAN power management support allows system wake-up using the receive filters or a magic frame detection filter. • Physical interface – Attachment of external PHY chip through standard MII or RMII interface. – PHY register access is available via the MIIM interface. 7.6.3 USB interface The LPC3220/30/40/50 supports USB in either device, host, or OTG configuration. 7.6.3.1 USB device controller The USB device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of register interface, serial interface engine, endpoint buffer memory and DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate end point buffer memory. The status of a completed USB transfer or error LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 32 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers condition is indicated via status registers. An interrupt is also generated if enabled. The DMA controller when enabled transfers data between the endpoint buffer and the USB RAM. Features • Fully compliant with USB 2.0 full-speed specification. • Supports 32 physical (16 logical) endpoints. • Supports control, bulk, interrupt and isochronous endpoints. • Scalable realization of endpoints at run time. • Endpoint maximum packet size selection (up to USB maximum specification) by software at run time. • RAM message buffer size based on endpoint realization and maximum packet size. • Supports bus-powered capability with low suspend current. • Supports DMA transfer on all non-control endpoints. • One duplex DMA channel serves all endpoints. • Allows dynamic switching between CPU controlled and DMA modes. • Double buffer implementation for bulk and isochronous endpoints. 7.6.3.2 USB host controller The host controller enables data exchange with various USB devices attached to the bus. It consists of register interface, serial interface engine and DMA controller. The register interface complies to the OHCI specification. Features • OHCI compliant. • OHCI specifies the operation and interface of the USB host controller and software driver. • The host controller has four USB states visible to the software driver: – USBOperational: Process lists and generate SOF tokens. – USBReset: Forces reset signaling on the bus, SOF disabled. – USBSuspend: Monitor USB for wake-up activity. – USBResume: Forces resume signaling on the bus. • HCCA register points to interrupt and isochronous descriptors list. • ControlHeadED and BulkHeadED registers point to control and bulk descriptors list. 7.6.3.3 USB OTG controller USB OTG (On-The-Go) is a supplement to the USB 2.0 specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. Features • Fully compliant with On-The-Go supplement to the USB Specification 2.0 Revision 1.0. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 33 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers • Supports Host Negotiation Protocol (HNP) and Session Request Protocol (SRP) for dual-role devices under software control. HNP is partially implemented in hardware. • Provides programmable timers required for HNP and SRP. • Supports slave mode operation through AHB slave interface. • Supports the OTG ATX from NXP (ISP 1302) or any external CEA-2011OTG specification compliant ATX. 7.6.4 LCD controller The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024  768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode. An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the displayed data) while still supporting a large number of colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time needed to operate the display. 7.6.4.1 Features • AHB bus master interface to access frame buffer. • Setup and control via a separate AHB slave interface. • Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. • Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces. • Supports single and dual-panel color STN displays. • Supports Thin Film Transistor (TFT) color displays. • Programmable display resolution including, but not limited to: 320  200, 320  240, 640  200, 640  240, 640  480, 800  600, and 1024  768. • Hardware cursor support for single-panel displays. • 15 gray-level monochrome, 3375 color STN, and 32 k color palettized TFT support. • 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN. • 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT. • 16 bpp true-color non-palettized, for color STN and TFT. • 24 bpp true-color non-palettized, for color TFT. • Programmable timing for different display panels. • 256 entry, 16-bit palette RAM, arranged as a 128  32 bit RAM. • Frame, line, and pixel clock signals. • AC bias signal for STN, data enable signal for TFT panels. • Supports little and big-endian, and Windows CE data formats. • LCD panel clock may be generated from the peripheral clock or from a clock input pin. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 34 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.7 System functions To enhance the performance of the LPC3220/30/40/50 incorporates the following system functions, an Interrupt Controller (INTC), a watchdog timer, a millisecond timer, and several power control features. These functions are described in the following sections 7.7.1 Interrupt controller The interrupt controller is comprised of three basic interrupt controller blocks, supporting a total of 73 interrupt sources. Each interrupt source can be individually enabled/disabled and configured for high or low level triggering, or rising or falling edge triggering. Each interrupt may also be steered to either the FIQ or IRQ input of the ARM9. Raw interrupt status and masked interrupt status registers allow versatile condition evaluation. In addition to peripheral functions, each of the six general purpose input/output pins and 12 of the 22 general purpose input pins are connected directly to the interrupt controller. 7.7.2 Watchdog timer The watchdog timer block is clocked by the main peripheral clock, which clocks a 32-bit counter. A match register is compared to the Timer. When configured for watchdog functionality, a match drives the match output low. The match output is gated with an enable signal that gives the opportunity to generate two type of reset signal: one that only resets chip internally, and another that goes through a programmable pulse generator before it goes to the external pin RESOUT and to the internal chip reset. 7.7.2.1 Features • Programmable 32-bit timer. • Internally resets the device if not periodically reloaded. • Flag to indicate that a watchdog reset has occurred. • Programmable watchdog pulse output on RESOUT pin. • Can be used as a standard timer if watchdog is not used. • Pause control to stop counting when core is in debug state. 7.7.3 Millisecond timer The millisecond timer is clocked by 32 kHz RTC clock, so a prescaler is not needed to obtain a lower count rate. The millisecond timer includes three match registers that are compared to the Timer/Counter value. A match can generate an interrupt and the cause the Timer/Counter either continue to run, stop, or be reset. 7.7.3.1 Features • 32-bit Timer/Counter, running from the 32 kHz RTC clock. • Counter or Timer operation. • Three 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Pause control to stop counting when core is in debug state. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 35 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.7.4 Clocking and power control features 7.7.4.1 Clocking Clocking in the LPC3220/30/40/50 is designed to be versatile, so that system and peripheral requirements may be met, while allowing optimization of power consumption. Clocks to most functions may be turned off if not needed and some peripherals do this automatically. The LPC3220/30/40/50 supports three operational modes, two of which are specifically designed to reduce power consumption. The modes are: Run mode, Direct run mode, and Stop mode.These three operational modes give control over processing speed and power consumption. In addition, clock rates to different functional blocks may be changed by switching clock sources, changing PLL values, or altering clock divider configurations. This allows a trade-off of power versus processing speed based on application requirements. 7.7.4.2 Crystal oscillator The main oscillator is the basis for the clocks most chip functions use by default. Optionally, many functions can be clocked instead by the output of a PLL (with a fixed 397x rate multiplication) which runs from the RTC oscillator. In this mode, the main oscillator may be turned off unless the USB interface is enabled. If a SYSCLK frequency other than 13 MHz is required in the application, or if the USB block is not used, the main oscillator may be used with a frequency of between 1 MHz and 20 MHz. 7.7.4.3 PLLs The LPC3220/30/40/50 includes three PLLs: The 397x PLL allows boosting the RTC frequency to 13.008896 MHz for use as the primary system clock. The USB PLL provides the 48 MHz clock required by the USB block, and the HCLK PLL provides the basis for the CPU clock, the AHB bus clock, and the main peripheral clock. The 397x PLL multiplies the 32768 Hz RTC clock by 397 to obtain a 13.008896 MHz clock. The 397x PLL is designed for low power operation and low jitter. This PLL requires an external RC loop filter for proper operation. The HCLK PLL accepts an input clock from either the main oscillator or the output of the 397x PLL. The USB PLL only accepts an input clock from the main oscillator.The USB input clock runs through a divide-by-N pre-divider before entering the USB PLL. The input to the HCLK and USB PLLs may initially be divided down by a pre-divider value ‘N’, which may have the values 1, 2, 3, or 4. This pre-divider can allow a greater number of possibilities for the output frequency. Following the PLL input divider is the PLL multiplier. This can multiply the pre-divider output by a value ‘M’, in the range of 1 through 256. The resulting frequency must be in the range of 156 MHz to 320 MHz. The multiplier works by dividing the output of a Current Controlled Oscillator (CCO) by the value of M, then using a phase detector to compare the divided CCO output to the pre-divider output. The error value is used to adjust the CCO frequency. At the PLL output, there is a post-divider that can be used to bring the CCO frequency down to the desired PLL output frequency. The post-divider value can divide the CCO output by 1, 2, 4, 8, or 16. The post-divider can also be bypassed, allowing the PLL CCO LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 36 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers output to be used directly. The maximum PLL output frequency supported by the CPU is 266 MHz. The only output frequency supported by the USB PLL is 48 MHz, and the clock has strict requirements for nominal frequency (500 ppm) and jitter (500 ps). 7.7.4.4 Power control modes The LPC3220/30/40/50 supports three operational modes, two of which are specifically designed to reduce power consumption. The modes are: Run mode, Direct Run mode, and Stop mode. Run mode is the normal operating mode for applications that require the CPU, AHB bus, or any peripheral function other than the USB block to run faster than the main oscillator frequency. In Run mode, the CPU can run at up to 266 MHz and the AHB bus can run at up to 133 MHz. Direct Run mode allows reducing the CPU and AHB bus rates in order to save power. Direct Run mode can also be the normal operating mode for applications that do not require the CPU, AHB bus, or any peripheral function other than the USB block to run faster than the main oscillator frequency. Direct Run mode is the default mode following chip reset. Stop mode causes all CPU and AHB operation to cease, and stops clocks to peripherals other than the USB block. 7.7.4.5 Reset Reset is accomplished by an active LOW signal on the RESET input pin. A reset pulse with a minimum width of 10 main oscillator clocks after the oscillator is stable is required to guarantee a valid chip reset. At power-up, 10 milliseconds should be allowed for the oscillator to start up and stabilize after VDD reaches operational voltage. An internal reset with a minimum duration of 10 clock pulses will also be applied if the watchdog timer generates an internal device reset. The RESET pin is located in the RTC power domain. This means that the RTC power must be present for an external reset to have any effect. The RTC power domain nominally runs from 1.2 V, but the RESET pin can be driven as high as 1.95 V. 7.8 Communication peripheral interfaces In addition to the Ethernet MAC and USB interfaces there are many more serial communication peripheral interfaces available on the LPC3220/30/40/50. Here is a list of the serial communication interfaces: • Seven UARTs; four standard UARTs and three high-speed UARTs • Two SPI serial I/O controllers • Two SSP serial I/O controllers • Two I2C serial I/O controllers • Two I2S audio controllers A short functional description of each of these peripherals is provided in the following sections. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 37 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.8.1 UARTs The LPC3220/30/40/50 contains seven UARTs. Four are standard UARTs, and three are high-speed UARTs. 7.8.1.1 Standard UARTs The four standard UARTs are compatible with the INS16Cx50. These UARTs support rates up to 460800 bit/s from a 13 MHz peripheral clock. Features • Each standard UART has 64 byte Receive and Transmit FIFOs. • Receiver FIFO trigger points at 16, 32, 48, and 60 Bytes. • Transmitter FIFO trigger points at 0, 4, 8, and 16 Bytes. • Register locations conform to the “550” industry standard. • Each standard UART has a fractional rate pre-divider and an internal baud rate generator. • The standard UARTs support three clocking modes: on, off, and auto-clock. The auto-clock mode shuts off the clock to the UART when it is idle. • UART 6 includes an IrDA mode to support infrared communication. • The standard UARTs are designed to support data rates of (2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800) bit/s. • Each UART includes an internal loopback mode. 7.8.1.2 High-speed UARTs The three high-speed UARTs are designed to support rates up to 921600 bit/s from a 13 MHz peripheral clock for on-board communication in low noise conditions. This is accomplished by changing the over sampling from 16 to 14 and altering the rate generation logic. Features • Each high-speed UART has 64-byte Receive and Transmit FIFOs. • Receiver FIFO trigger points at 1, 4, 8, 16, 32, and 48 B. • Transmitter FIFO trigger points at 0, 4, and 8 B. • Each high-speed UART has an internal baud rate generator. • The high-speed UARTs are designed to support data rates of (2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600) bit/s. • The three high speed UARTs only support (8N1) 8-bit data word length, 1-stop bit, no parity, and no flow control as a the communications protocol. • Each UART includes an internal loopback mode. 7.8.2 SPI serial I/O controller The LPC3220/30/40/50 has two Serial Peripheral Interfaces (SPI). The SPI is a 3-wire serial interface that is able to interface with a large range of serial peripheral or memory devices (SPI mode 0 to 3 compatible slave devices). LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 38 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master. The SPI implementation on the LPC3220/30/40/50 does not support operation as a slave. 7.8.2.1 Features • Supports slaves compatible with SPI modes 0 to 3. • Half duplex synchronous transfers. • DMA support for data transmit and receive. • 1-bit to 16-bit word length. • Choice of LSB or MSB first data transmission. • 64  16-bit input or output FIFO. • Bit rates up to 52 Mbit/s. • Busy input function. • DMA time out interrupt to allow detection of end of reception when using DMA. • Timed interrupt to facilitate emptying the FIFO at the end of a transmission. • SPI clock and data pins may be used as general purpose pins if the SPI is not used. • Slave selects can be supported using GPO or GPIO pins 7.8.3 SSP serial I/O controller The LPC3220/30/40/50 contains two SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.8.3.1 Features • Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire buses • Synchronous serial communication • Master or slave operation • 8-frame FIFOs for both transmit and receive • 4-bit to 16-bit frame • Maximum SPI bus data bit rate of 1⁄2 (Master mode) and 1⁄2 (Slave mode) of the input clock rate • DMA transfers supported by GPDMA 7.8.4 I2C-bus serial I/O controller There are two I2C-bus interfaces in the LPC32x0 family of controllers. These I2C blocks can be configured as a master, multi-master or slave supporting up to 400 kHz. The I2C blocks also support 7 or 10 bit addressing. Each has a four word FIFO for both transmit and receive. An interrupt signal is available from each block. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 39 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers There is a separate slave transmit FIFO. The slave transmit FIFO (TXS) and its level are only available when the controller is configured as a Master/Slave device and is operating in a multi-master environment. Separate TX FIFOs are needed in a multi-master because a controller might have a message queued for transmission when an external master addresses it to be come a slave-transmitter, a second source of data is needed. Note that the I2C clock must be enabled in the I2CCLK_CTRL register before using the I2C. The I2C clock can be disabled between communications, if used as a single master I2C-bus interface, software has full control of when I2C communication is taking place on the bus. 7.8.4.1 Features • The two I2C-bus blocks are standard I2C-bus compliant interfaces that may be used in Single-master, Multi-master or Slave modes. • Programmable clock to allow adjustment of I2C-bus transfer rates. • Bidirectional data transfer. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. 7.8.5 I2S-bus audio controller The I2S-bus provides a standard communication interface for digital audio applications The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. Each I2S connection can act as a master or a slave. The master connection determines the frequency of the clock line and all other slaves are driven by this clock source. The two I2S-bus interfaces on the LPC3220/30/40/50 provides a separate transmit and receive channel, providing a total of two transmit channels and two receive channels. Each I2S channel supports monaural or stereo formatted data. 7.8.5.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • Supports standard sampling frequencies (8 kHz, 11.025 kHz, 16 kHz, 22.05 kHz, 32 kHz, 44.1 kHz, 48 kHz, 96 kHz). • Word select period can be configured in master mode (separately for I2S input and output). • Two eight-word FIFO data buffers are provided, one for transmit and one for receive. • Generates interrupt requests when buffer levels cross a programmable boundary. • Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block. • Controls include reset, stop, and mute options separately for I2S input and I2S output. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 40 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.9 Other peripherals In addition to the communication peripherals there are many general purpose peripherals available in the LPC3220/30/40/50. Here is a list of the general purpose peripherals. • GPI/O • Keyboard scanner • Touch screen controller and 10-bit Analog-to-Digital-Converter • Real-time clock • High-speed timer • Four general purpose 32-bit timer/external event counters • Two simple PWMs • One motor control PWM A short functional description of each of these peripherals is provided in the following sections. 7.9.1 General purpose parallel I/O Some device pins that are not dedicated to a specific peripheral function have been designed to be general purpose inputs, outputs, or input/outputs. Also, some pins may be configured either as a specific peripheral function or a general purpose input, output, or input/output. A total of 51 pins can potentially be used as general purpose input/outputs, 24 as general purpose outputs, and 22 as general purpose inputs. GPIO pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of GPIO and GPO outputs controlled by that register simultaneously. The value of the output register for standard GPIOs and GPO pins may be read back, as well as the current actual state of the port pins. In addition to GPIO pins on port 0, port 1, and port 2, there are 22 GPI, 24 GPO, and six GPIO pins. When the SDRAM bus is configured for 16 data bits, 13 of the remaining SDRAM data pins may be used as GPIOs. 7.9.1.1 Features • Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. • A single register selects direction for pins that support both input and output modes. • Direction control of individual bits. • For input/output pins, both the programmed output state and the actual pin state can be read. • There are a total of 12 general purpose inputs, 24 general purpose outputs, and six general purpose input/outputs. • Additionally, 13 SDRAM data lines may be used as GPIOs if a 16-bit SDRAM interface is used (rather than a 32-bit interface). LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 41 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 7.9.2 Keyboard scanner The keyboard scanner function can automatically scan a keyboard of up to 64 keys in an 8  8 matrix. In operation, the keyboard scanner’s internal state machine will normally be in an idle state, with all KEY_ROWn pins set high, waiting for a change in the column inputs to indicate that one or more keys have been pressed. When a keypress is detected, the matrix is scanned by setting one output pin high at a time and reading the column inputs. After de-bouncing, the keypad state is stored and an interrupt is generated. The keypad is then continuously scanned waiting for ‘extra key pressed’ or ‘key released’. Any new keypad state is scanned and stored into the matrix registers followed by a new interrupt request to the interrupt controller. It is possible to detect and separate up to 64 multiple keys pressed. 7.9.2.1 Features • Supports up to 64 keys in 8  8 matrix. • Programmable de-bounce period. • A key press can wake up the CPU from Stop mode. 7.9.3 Touch screen controller and 10-bit ADC The LPC3220/30/40/50 microcontrollers includes Touch Screen Controller (TSC) hardware, which automatically measures and determines the X and Y coordinates where a touch screen is pressed. In addition, the TSC can measure an analog input signal on the AUX_IN pin. Optionally, the TSC can operate as an Analog-to-Digital Converter (ADC). The ADC supports three channels and uses 10-bit successive approximation to produce results with a resolution of 10 bits in 11 clock cycles. The analog portion of the ADC has its own power supply to enhance the low noise characteristics of the converter. This voltage is only supplied internally when the core has voltage. However, the ADC block is not affected by any difference in ramp-up time for VDD_AD and VDD_CORE voltage supplies. 7.9.3.1 Features • Measurement range of 0 V to VDD_AD (nominally 3.3 V). • Low-noise ADC. • 10-bit resolution. • Three input channels. • Uses 32 kHz RTC clock or peripheral clock. 7.9.4 Real-Time Clock (RTC) and battery RAM The RTC runs at 32768 Hz using a very low power oscillator. The RTC counts seconds and can generate alarm interrupts that can wake up the device from Stop mode. The RTC clock can also clock the 397x PLL, the Millisecond Timer, the ADC, the Keyboard Scanner and the PWMs. The RTC up-counter value represents a number of seconds elapsed since second 0, which is an application determined time. The RTC counter will reach maximum value after about 136 years. The RTC down-counter is initiated with all ones. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 42 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Two 32-bit match registers are readable and writable by the processor. A match will result in an interrupt provided that the interrupt is enabled. The ONSW output pin can also be triggered by a match event and cause an external power supply to turn on all of the operating voltages, as a way to startup after power has been removed. The RTC block is implemented in a separate voltage domain. The block is supplied via a separate supply pin from a battery or other power source. The RTC block also contains 32 words (128 bytes) of very low voltage SRAM. This SRAM is able to hold its contents down to the minimum RTC operating voltage. 7.9.4.1 Features • Measures the passage of time in seconds. • 32-bit up and down seconds counters. • Ultra-low power design to support battery powered systems. • Dedicated 32 kHz oscillator. • An output pin is included to assist in waking up when the chip has had power removed to all functions except the RTC. • Two 32-bit match registers with interrupt option. • 32 words (128 bytes) of very low voltage SRAM. • The RTC and battery RAM power have an independent power domain and dedicated supply pins, which can be powered from a battery or power supply. Remark: The LPC3220/30/40/50 will run at voltages down to 0.9 V at frequencies below 14 MHz. However, the ARM core cannot access the RTC registers and battery RAM when the core supply voltage is at 0.9 V and the RTC supply is at 1.2 V. 7.9.5 Enhanced 32-bit timers/external event counters The LPC3220/30/40/50 includes six 32-bit Timer/Counters. The Timer/Counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. The Timer/Counter also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.9.5.1 Features • A 32-bit Timer/Counter with a programmable 32-bit pre-scaler. • Counter or Timer operation. • Up to four 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. • Four 32-bit match registers that allow: – continuous operation with optional interrupt generation on match – stop timer on match with optional interrupt generation – reset timer on match with optional interrupt generation • Up to four external outputs corresponding to match registers, with the following capabilities: LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 43 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers – set LOW on match – set HIGH on match – toggle on match – do nothing on match 7.9.6 High-speed timer The high-speed timer block is clocked by the main peripheral clock. The clock is first divided down in a 16-bit programmable pre-scale counter which clocks a 32-bit timer/counter. The high-speed timer includes three match registers that are compared to the timer/counter value. A match can generate an interrupt and cause the timer/counter to either continue to run, stop, or be reset. The high-speed timer also includes two capture registers that can take a snapshot of the timer/counter value when an input signal transitions. A capture event may also generate an interrupt. 7.9.6.1 Features • 32-bit timer/counter with programmable 16-bit pre-scaler. • Counter or timer operation. • Two 32-bit capture registers. • Three 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Pause control to stop counting when core is in debug state. 7.9.7 Pulse Width Modulators (PWMs) The LPC3220/30/40/50 provides two simple PWMs. They are clocked separately by either the main peripheral clock or the 32 kHz RTC clock. Both PWMs have a duty cycle programmable in 255 steps. 7.9.7.1 Features • Clocked by the main peripheral clock or the 32 kHz RTC clock. • Programmable 4-bit pre-scaler. • Duty cycle programmable in 255 steps. • Output frequency up to 50 kHz when using a 13 MHz peripheral clock. 7.9.8 Motor control pulse width modulator The Motor Control PWM (MCPWM) provides a set of features for three-phase AC and DC motor control applications in a single peripheral. The MCPWM can also be configured for use in other generalized timing, counting, capture, and compare applications. 7.9.8.1 Features • 32-bit timer • 32-bit period register LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 44 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers • 32-bit pulse-width (match) register • 10-bit dead-time register and an associated 10-bit dead-time counter • 32-bit capture register • Two PWM (match) outputs (pins MCOA0/1/2 and MCOB0/1/2) with opposite polarities • Period interrupt, pulse-width interrupt, and capture interrupt 8. Basic architecture The LPC3220/30/40/50 is a general purpose ARM926EJ-S 32-bit microprocessor with a 32 kB instruction cache and a 32 kB data cache. The microcontroller offers high performance and very low power consumption. The ARM architecture is based on RISC principles, which results in the instruction set and related decode mechanism being much simpler than equivalent micro programmed CISCs. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. The ARM926EJ-S core employs a 5-stage pipeline so processing and memory system accesses can occur continuously. At any one point in time, several operations are in progress: subsequent instruction fetch, next instruction decode, instruction execution, memory access, and write-back. The combination of architectural enhancements gives the ARM9 about 30 % better performance than an ARM7 running at the same clock rate: • Approximately 1.3 clocks per instruction for the ARM926EJ-S compared to 1.9 clocks per instruction for ARM7TDMI. • Approximately 1.1 Dhrystone MIPS/MHz for the ARM926EJ-S compared to 0.9 Dhrystone MIPS/MHz for ARM7TDMI. The ARM926EJ-S processor also employs an operational state known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb state is the use of a super-reduced instruction set. Essentially, the ARM926EJ-S processor core has two instruction sets: 1. The standard 32-bit ARM set 2. The 16-bit Thumb set The Thumb set’s smaller 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining many of ARM’s 32-bit performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates using the same 32-bit register set as ARM code. Thumb code size is up to 65 % smaller than ARM code size, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system. Additionally, the ARM926EJ-S core includes enhanced DSP instructions and multiplier, as well as an enhanced 32-bit MAC block. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 45 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 9. Limiting values [1] The following applies to Table 7: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Core, PLL, oscillator, and RTC supplies; applies to pins VDD_CORE, VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK, VDD_PLLUSB, VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC. [3] I/O pad supply; applies to domains VDD_EMC. [4] Applies to VDD_AD pins. [5] Applies to pins in the following domains VDD_IOA, VDD_IOB, VDD_IOC, and VDD_IOD. [6] Including voltage on outputs in 3-state mode. [7] Based on package heat transfer, not device power consumption. Calculated package thermal resistance (ThetaJA): 35.766 C/W (with JEDEC Test Board and 0 m/s airflow, 15 % accuracy). [8] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. [9] Charge device model per AEC-Q100-011. Table 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Notes Min Max Unit VDD(1V2) supply voltage (1.2 V) [2] 0.5 +1.4 V VDD(EMC) external memory controller supply voltage [3] 0.5 +4.6 V VDDA(3V3) analog supply voltage (3.3 V) [4] 0.5 +4.6 V VDD(IO) input/output supply voltage [5] 0.5 +4.6 V VIA analog input voltage 0.5 +4.6 V VI input voltage 1.8 V pins [6] 0.5 +2.4 V 3.3 V pins [6] 0.5 +4.6 V IDD supply current per supply pin - 100 mA ISS ground current per ground pin - 100 mA Tstg storage temperature 65 +150 C Ptot(pack) total power dissipation (per package) max. junction temp 125 C max. ambient temp 85 C [7]- 1.12 W VESD electrostatic discharge voltage HBM [8] - 2500 V CDM [9] - 1000 V LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 46 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 10. Static characteristics Table 8. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD(1V2) supply voltage (1.2 V) core supply voltage for full performance; 266 MHz (see Figure 4); VDD_CORE supply domain [2] 1.31 1.35 1.39 V core supply voltage for normal performance; 208 MHz (see Figure 4); VDD_CORE supply domain [2] 1.1 1.2 1.39 V core supply voltage for reduced power; up to 14 MHz CPU; VDD_CORE supply domain [2] 0.9 - 1.39 V RTC supply voltage; VDD_RTC supply domain [3] 0.9 - 1.39 V PLL and oscillator supply voltage [4] 1.1 1.2 1.39 V VDD(EMC) external memory controller supply voltage in 1.8 V range [5] 1.7 1.8 1.95 V in 2.5 V range [6] 2.3 2.5 2.7 V in 3.3 V range [7] 2.7 3.3 3.6 V VDD(IO) input/output supply voltage VDD_IOA, VDD_IOB, and VDD_IOD supply domain in 1.8 V range 1.7 1.8 1.95 V in 3.3 V range 2.7 3.3 3.6 V VDD_IOC supply domain in 1.8 V range 1.7 1.8 1.95 V in 3.3 V range 2.3 3.3 3.6 V VDDA(3V3) analog supply voltage (3.3 V) applies to pins in VDD_AD power domain 2.7 3.3 3.6 V LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 47 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Power consumption in Run, direct Run, and Stop modes IDD(run) Run mode supply current Tamb = 25 C; code while(1){} executed from IRAM; all peripherals enabled I-cache/D-cache, MMU enabled; CPU clock = 208 MHz; VDD_CORE = 1.2 V - 150 - mA I-cache/D-cache, MMU enabled; CPU clock = 266 MHz; VDD_CORE = 1.35 V - 218 - mA I-cache/D-cache, MMU disabled; CPU clock = 208 MHz; VDD_CORE = 1.2 V - 78 - mA I-cache/D-cache, MMU disabled; CPU clock = 266 MHz; VDD_CORE = 1.35 V - 111 - mA IDD(drun) direct Run mode supply current Tamb = 25 C; CPU clock = 13 MHz; code while(1){} executed from IRAM; all peripherals disabled I-cache/D-cache, MMU enabled; VDD_CORE = 1.2 V - 7.8 - mA I-cache/D-cache, MMU enabled; VDD_CORE = 0.9 V - 5.6 - mA I-cache/D-cache, MMU disabled; VDD_CORE = 1.2 V - 5 - mA I-cache/D-cache, MMU disabled; VDD_CORE = 0.9 V - 3.5 - mA IDD(stop) Stop mode supply current Tamb = 25 C; CPU clock stopped internally; all peripherals disabled VDD_CORE = 1.2 V - 400 - A VDD_CORE = 0.9 V - 400 - A Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 48 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers IDD(RTC) RTC supply current normal operation; VDD_RTC = VDD_RTCCORE = VDD_RTCOSC = 1.2 V; Tamb = 25 C [8]- 13 - A RTC back up operation; Rev “-” silicon [9]- 30 - A Rev “A” silicon [9]- 4 - IDD supply current for HCLK; PLL output frequency = 266 MHz; VDD_PLLHCLK = 1.2 V - 2 - mA for USB; VDD_PLLUSB = 1.2 V - 2 - mA for ADC; interrupt driven loop converting ADIN[2:0]; VDD_AD = 3.3 V -  1 - mA Input pins and I/O pins configured as input VI input voltage [10][12]0 - VDD(IO) V VIH HIGH-level input voltage 1.8 V inputs 0.7  VDD(IO) - - V 3.3 V inputs 0.7  VDD(IO) - - V VIL LOW-level input voltage 1.8 V inputs - - 0.3  VDD(IO) V 3.3 V inputs - - 0.3  VDD(IO) V Vhys hysteresis voltage 1.8 V inputs 0.1  VDD(IO) - - V 3.3 V inputs 0.1  VDD(IO) - - V IIL LOW-level input current VI = 0 V; no pull-up - - 1 A IIH HIGH-level input current VI = VDD(IO); no pull-down [10]- - 1 A Ilatch I/O latch-up current (1.5VDD(IO)) < VI < (1.5VDD(IO)) [10]- - 100 mA Ipu pull-up current 1.8 V inputs with pull-up; VI = 0 V 6 12 22 A 3.3 V inputs with pull-up; VI = 0 V 25 50 80 A Ipd pull-down current 1.8 V inputs with pull-down; VI = VDD(IO) 5 12 22 A 3.3 V inputs with pull-down; VI = VDD(IO) 25 50 85 A II input current bus keeper inputs; VI = VDD - - 1 A VI = 0.67  VDD - - 55 A VI = 0.33  VDD - - 60 A VI = 0 V - - 1 A Ci input capacitance Excluding bonding pad capacitance - - 3.3 pF Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 49 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Output pins and I/O pins configured as output VO output voltage [10][11] [12][13] 0 - VDD(IO) V VOH HIGH-level output voltage 1.8 V outputs; IOH = 1 mA [14] VDD(IO)  0.4 - - V 3.3 V outputs; IOH = 4 mA [14] VDD(IO)  0.4 - - V VOL LOW-level output voltage 1.8 V outputs; IOL = 4 mA [14]- - 0.4 V 3.3 V outputs; IOL = 4 mA [14]- - 0.4 V IOH HIGH-level output current VDD(IO) = 1.8 V; VOH = VDD(IO)  0.4 V [10][14] 3.3 - - mA VDD(IO) = 3.3 V; VOH = VDD(IO)  0.4 V 6.5 - - mA IOL LOW-level output current VDD(IO) = 1.8 V; VOL = 0.4 V [10][14] 1.5 - - mA VDD(IO) = 3.3 V; VOL = 0.4 V 3 - - mA IOZ OFF-state output current VO = 0 V; VO = VDD(IO); no pull-up/down [10]- - 1 A IOHS HIGH-level short-circuit output current VDD(IO) = 1.8 V; VOH = 0 V [15]- - 66 mA VDD(IO) = 3.3 V; VOH = 0 V - - 183 mA IOLS LOW-level short-circuit output current VDD(IO) = 1.8 V; VOL = VDD(IO) [10][15]- - 34 mA VDD(IO) = 3.3 V; VOL = VDD(IO) - - 105 mA Zo output impedance VDD(IO) = 1.8 V 40 - 60  VDD(IO) = 3.3 V 40 - 60  EMC pins VI input voltage [12]0 - VDD(EMC) V VIH HIGH-level input voltage 1.8 V inputs 0.7  VDD(EMC) - - V 3.3 V inputs 0.7  VDD(EMC) - - V VIL LOW-level input voltage 1.8 V inputs - - 0.3  VDD(EMC) V 3.3 V inputs - - 0.3  VDD(EMC) V Vhys hysteresis voltage 1.8 V inputs 0.4 - 0.6 V 3.3 V inputs 0.55 - 0.85 V IIL LOW-level input current VI = 0 V; no pull-up - - 0.3 A IIH HIGH-level input current VI = VDD(EMC); no pull-down - - 0.3 A Ilatch I/O latch-up current (1.5VDD(EMC)) < VI < (1.5VDD(EMC)) - - 100 mA Ipu pull-up current 1.8 V inputs with pull-up; VI = 0 34 62 107 A 3.3 V inputs with pull-up; VI = 0 97 169 271 A Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 50 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Ipd pull-down current 1.8 V inputs with pull-down; VI = VDD(EMC) 23 51 93 A 3.3 V inputs with pull-down; VI = VDD(EMC) 73 155 266 A Ci input capacitance Excluding bonding pad capacitance - - 2.1 pF VO output voltage [11] [12][13] 0 - VDD(EMC) V VOH HIGH-level output voltage 1.8 V outputs; IOH = 1 mA [14] VDD(EMC)  0.3 - - V 3.3 V outputs; IOH = 4 mA [14] VDD(EMC)  0.3 - - V VOL LOW-level output voltage 1.8 V outputs; IOL = 4 mA [14]- - 0.3 V 3.3 V outputs; IOL = 4 mA [14]- - 0.3 V IOH HIGH-level output current VDD(EMC) = 1.8 V; VOH = VDD(EMC)  0.4 V [14] 6 - - mA VDD(EMC) = 3.3 V; VOH = VDD(EMC)  0.4 V 6 - - mA IOL LOW-level output current VDD(EMC) = 1.8 V; VOL = 0.4 V [14]6 - - mA VDD(EMC) = 3.3 V; VOL = 0.4 V 6 - - mA IOZ OFF-state output current VO = 0 V; VO = VDD(EMC); no pull-up/down - - 0.3 A IOHS HIGH-level short-circuit output current VDD(EMC) = 1.8 V; VOH = 0 V [15]- - 49 mA VDD(EMC) = 3.3 V; VOH = 0 V - - 81 mA IOLS LOW-level short-circuit output current VDD(EMC) = 1.8 V; VOL = VDD(EMC) [14]- - 49 mA VDD(EMC) = 3.3 V; VOL = VDD(EMC) - - 86 mA Zo output impedance VDD(EMC) = 1.8 V 35 40 58  VDD(EMC) = 3.3 V 32 35 45  I2C pins VI input voltage [10] [12] 0 - 5.5 V VIH HIGH-level input voltage 1.8 V inputs 0.7  VDD(IO) - - V 3.3 V inputs 0.7  VDD(IO) - - V VIL LOW-level input voltage 1.8 V inputs - - 0.3  VDD(IO) V 3.3 V inputs - - 0.3  VDD(IO) V IIL LOW-level input current VI = 0 V; no pull-up - - 10 A IIH HIGH-level input current VI = VDD(IO); no pull-down [10]- - 10 A Ilatch I/O latch-up current (1.5VDD(IO)) < VI < (1.5VDD(IO)) [10]- - 100 mA Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 51 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Ci input capacitance Excluding bonding pad capacitance - - 1.6 pF VOL LOW-level output voltage 1.8 V outputs; IOL = 4 mA [14]- - 0.4 V 3.3 V outputs; IOL = 4 mA [14]- - 0.4 V IOL LOW-level output current VDD(IO) = 1.8 V; VOL = 0.4 V [10][14]3 - - mA VDD(IO) = 3.3 V; VOL = 0.4 V 3 - - mA IOZ OFF-state output current VO = 0 V; VO = VDD(IO); no pull-up/down [10]- - 10 A IOLS LOW-level short-circuit output current VDD(IO) = 1.8 V; VOL = VDD(IO) [10][15]- - 40 mA VDD(IO) = 3.3 V; VOL = VDD(IO) - - 40 mA ONSW pin VO output voltage [10][11] [12][13] 0 - VDD(1V2) V VOH HIGH-level output voltage 1.2 V outputs; IOH = 1 mA [14] VDD(1V2)  0.4 - - V VOL LOW-level output voltage 1.2 V outputs; IOL = 4 mA [14]- - 0.4 V IOH HIGH-level output current VOH = VDD(1V2)  0.4 V [10][14] 4 - - mA IOL LOW-level output current VOL = 0.4 V [10][14]3 - - mA IOZ OFF-state output current VO = 0 V; VO = VDD(1V2); no pull-up/down [10]- - 1.5 A IOHS HIGH-level short-circuit output current VDD(1V2) = 1.8 V; VOH = 0 V [15]- - 135 mA IOLS LOW-level short-circuit output current VOL = VDD(1V2) [10][15]- - 135 mA Zo output impedance VDD(1V2) = 1.2 V 40 - 60  Oscillator input/output pins Vi(xtal) crystal input voltage on pins RTCX_IN and SYSX_IN 0.5 - +1.3 V Vo(xtal) crystal output voltage on pins RTCX_OUT and SYSX_OUT 0.5 - +1.3 V RESET pin VI input voltage [10] [12] 0 - 1.95 V VIH HIGH-level input voltage 1.2 V inputs 0.7  VDD(1V2) - - V VIL LOW-level input voltage 1.2 V inputs - - 0.3  VDD(1V2) V IIL LOW-level input current VI = 0 V; no pull-up - - 1 A Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 52 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] Applies to VDD_CORE pins. [3] Applies to pins VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC. [4] Applies to pins VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK, and VDD_PLLUSB. [5] Applies when using 1.8 V Mobile DDR or Mobile SDR SDRAM. [6] Applies when using 2.5 V DDR memory. [7] Applies when using 3.3 V SDR SDRAM and SRAM. [8] Specifies current on combined VDD_RTCx during normal chip operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and VDD_CORE, VDD_IOx at typical voltage. [9] Specifies current on combined VDD_RTCx during backup operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and all other VDD_x at 0 V. [10] Referenced to the applicable VDD for the pin. [11] Including voltage on outputs in 3-state mode. [12] The applicable VDD voltage for the pin must be present. [13] 3-state outputs go into 3-state mode when the applicable VDD voltage for the pin is grounded. [14] Accounts for 100 mV voltage drop in all supply lines. [15] Allowed as long as the current limit does not exceed the maximum current allowed by the device. IIH HIGH-level input current VI = VDD; no pull-down [10]- - 1 A IOZ OFF-state output current VO = 0 V; VO = VDD; no pull-up/down [10]- - 1 A Ilatch I/O latch-up current (1.5VDD) < VI < (1.5VDD) [10]- - 100 mA Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 53 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 10.1 Minimum core voltage requirements Figure 4 shows the minimum core supply voltage that should be applied for a given core frequency on pin VDD_CORE to ensure stable operation of the LPC3220/30/40/50. 10.2 Power supply sequencing The LPC32x0 has no power sequencing requirements, that is, VDD(1V2), VDD(EMC), VDD(IO), and VDDA(3V3) can be switched on or off independent of each other. An internal circuit ensures that the system correctly powers up in the absence of core power. During IO power-up this circuit takes care that the system is powered in a defined mode. The same is valid for core power-down. 10.3 Power consumption per peripheral [1] All three Ethernet clocks are in enabled in the MAC_CLK_CTRL register (see LPC32x0 User manual). Fig 4. Minimum required core supply voltage for different core frequencies core frequency (MHz) 160 200 240 280 002aae872 1.0 1.2 1.4 0.8 VDD_CORE (V) Table 9. Power consumption per peripheral Tamb = 25 C; CPU clock = 208 MHz; I-cache/D-cache, MMU disabled; VDD_CORE = 1.2 V; VDD(IO) = 1.8 V; USB AHB, IRAM, and IROM clocks always on; all peripherals are at their default state at reset. Peripheral clocks are disabled except for peripheral measured. Peripheral IDD(run) / mA High-speed UART (set to 115 200 Bd (8N1)) 0.3 I2C-bus 0.3 SSP 0.6 I2S 0.5 DMA 6.3 EMC 7.3 Multi-level NAND controller 1.4 Single-level NAND controller 0.3 LCD 5.6 Ethernet MAC[1] 2.9 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 54 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 10.4 Power consumption in Run mode Power consumption is shown in Figure 5 for WinCE applications running under typical conditions from SDRAM. MMU and I-cache/D-cache are enabled. The VFP is turned on but not used. I2S-interface (channel 1), LCD, SLC NAND controller, I2C1-bus, SD card, touchscreen ADC, and UART 3 are turned on. All other peripherals are turned off. The AHB clock HCLK is identical to the core clock for frequencies up to 133 MHz, which is the maximum allowed HCLK frequency. For higher core frequencies, the HCLK PLL output must be divided by 2 to obtain an HCLK frequency lower than or equal to 133 MHz resulting in correspondingly lower power consumption by the AHB peripherals. Conditions: Tamb = 25 C; VDD_CORE = 1.2 V for core frequencies  208 MHz; VDD_CORE = 1.35 V for core frequencies > 208 MHz; VDD(IO) = 1.8 V. (1) WinCE running from SDRAM; playing wmv file at 20 frames/s, 32 kHz mono. (2) WinCE running from SDRAM; playing mp3 file at 128 kbit/s, stereo. (3) WinCE running from SDRAM; no application running. Fig 5. Core current versus core frequency for WinCE applications core frequency (MHz) 40 120 200 280 002aae762 80 40 120 160 IDD(run) (mA) 0 (1) (2) (3) HCLK = 133 MHz HCLK = 72 MHz VDD_CORE = 1.2 V VDD_CORE = 1.35 V LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 55 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 10.5 ADC static characteristics [1] Conditions: VSSA = 0 V (on pin VSS_AD); VDDA(3V3) = 3.3 V (on pin VDD_AD). [2] The ADC is monotonic; there are no missing codes. [3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 6. [4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 6. [5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 6. [6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 6. [7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 6. Table 10. ADC static characteristics VDDA(3V3) = 3.3 V; Tamb = 25C unless otherwise specified; ADC clock frequency 4.5 MHz. Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDDA(3V3) V Cia analog input capacitance - - 1 pF ED differential linearity error [1][2][3] - 0.5 1 LSB EL(adj) integral non-linearity [1][4] - 0.6 1 LSB EO offset error [1][5] - 1 3 LSB EG gain error [1][6] - 0.3 0.6 % ET absolute error [1][7] - 4 LSB Rvsi voltage source interface resistance - - 40 k LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 56 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 6. ADC characteristics 002aae434 1023 1022 1021 1020 1019 (2) (1) 1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024 7 6 5 4 3 2 1 0 1018 (5) (4) (3) 1 LSB (ideal) code out VDDA(3V3) − VSSA 1024 offset error EO gain error EG offset error EO VIA (LSBideal) 1 LSB = LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 57 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11. Dynamic characteristics 11.1 Clocking and I/O port pins [1] Parameters are valid over operating temperature range unless otherwise specified. [2] After supply voltages are stable [3] Supplied by an external crystal. 11.2 Static memory controller Table 11. Dynamic characteristics Tamb = 40 C to +85 C, unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit Reset tw(RESET)ext external RESET pulse width [2] 10 - - ms External clock fext external clock frequency [3]1 13 20 MHz Port pins tr rise time - 5 - ns tf fall time - 5 - ns Table 12. Dynamic characteristics: static external memory interface CL = 25 pF, Tamb = 20C, VDD(EMC) = 1.8 V, 2.5 V, or 3.3 V. Symbol Parameter Notes Min Typ Max Unit Common to read and write cycles TCLCL clock cycle time [1] 7.5 9.6 - ns tCSLAV CS LOW to address valid time - 0 - ns Read cycle parameters tOELAV OE LOW to address valid time [2]- 0 WAITOEN  TCLCL - ns tBLSLAV BLS LOW to address valid time [2]- 0 WAITOEN  TCLCL - ns tCSLOEL CS LOW to OE LOW time - 0 + WAITOEN  TCLCL - ns tCSLBLSL CS LOW to BLS LOW time [2] - 0 + WAITOEN  TCLCL - ns tOELOEH OE LOW to OE HIGH time [2][3]- (WAITRD WAITOEN + 1)  TCLCL - ns tBLSLBLSH BLS LOW to BLS HIGH time [2][3]- (WAITRD WAITOEN + 1)  TCLCL - ns tsu(DQ) data input/output set-up time [6]- 8.4 - ns th(DQ) data input/output hold time [6]- 0 - ns tCSHOEH CS HIGH to OE HIGH time - 0 - ns tCSHBLSH CS HIGH to BLS HIGH time - 0 - ns tOEHANV OE HIGH to address invalid time - 1  TCLCL - ns tBLSHANV BLS HIGH to address invalid time - 1  TCLCL - ns Write cycle parameters tCSLDV CS LOW to data valid time - 0 - ns tCSLWEL CS LOW to WE LOW time [4]- (WAITWEN+1) TCLCL - ns tCSLBLSL CS LOW to BLS LOW time [4]- (WAITWEN+ 1)  TCLCL - ns tWELDV WE LOW to data valid time [4]- 0 (WAITWEN + 1)  TCLCL - ns LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 58 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] TCLCL = 1/HCLK [2] Refer to the LPC32x0 User manual EMCStaticWaitOen0-3 register for the programming of WAITOEN value. [3] Refer to the LPC32x0 User manual EMCStaticWaitRd0-3 register for the programming of WAITRD value. [4] Refer to the LPC32x0 User manual EMCStaticWaitWen0-3 register for the programming of WAITWEN value. [5] Refer to the LPC32x0 User manual EMCStaticWaitWr0-3 register for the programming of WAITWR value. [6] Earliest of CS HIGH, OE HIGH, address change to data invalid. tWELWEH WE LOW to WE HIGH time [4][5]- (WAITWR WAITWEN + 1)  TCLCL - ns tBLSLBLSH BLS LOW to BLS HIGH time [4][5]- (WAITWR WAITWEN + 1)  TCLCL - ns tWEHANV WE HIGH to address invalid time - 1  TCLCL - ns tWEHDNV WE HIGH to data invalid time - 1  TCLCL - ns tBLSHANV BLS HIGH to address invalid time - 1  TCLCL - ns tBLSHDNV BLS HIGH to data invalid time - 1  TCLCL - ns Table 12. Dynamic characteristics: static external memory interface …continued CL = 25 pF, Tamb = 20C, VDD(EMC) = 1.8 V, 2.5 V, or 3.3 V. Symbol Parameter Notes Min Typ Max Unit Fig 7. External memory read access EMC_CS[3:0] EMC_A[23:0] EMC_D[31:0] EMC_OE EMC_BLS[3:0] tCSLAV tOELAV tOELOEH tCSLOEL tsu(DQ) th(DQ) tCSHOEH tOEHANV 002aae402 tBLSLAV tCSHBLSH tBLSLBLSH tCSLBLSL tBLSHANV LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 59 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Fig 8. External memory write access EMC_A[23:0] EMC_D[31:0] tCSLWEL tCSLBLSL tWELDV tCSLDV tWELWEH tWEHANV tBLSHANV tWEHDNV tBLSHDNV 002aae469 tCSLAV EMC_CS[3:0] tBLSLBLSH EMC_BLS[3:0] EMC_WR LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 60 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.3 SDR SDRAM Controller [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical values valid for EMC pads set to fast slew rate: VDD_EMC = 1.8 V, VDD_CORE = 1.2 V or slower slew rate: VDD_EMC = 3.3 V, VDD_CORE = 1.2 V (see SDRAMCLK_CTRL register in the LPC32x0 User manual). [3] All min or max values valid for EMC pads set to fast slew rate: VDD_EMC = 1.8 V, VDD_CORE = 1.2 V or slower slew rate: VDD_EMC = 3.3 V, VDD_CORE = 1.2 V. [4] foper = 1/tCK. [5] Applies to signals: EMC_DQM[3:0], EMC_DYCS[1:0], EMC_RAS, EMC_CAS, EMC_WR, EMC_CKE[1:0]. [6] CMD_DLY = COMMAND_DELAY bitfield in SDRAMCLK_CTRL[18:14] register, see External Memory Controller (EMC) chapter in LPC32x0 User manual. Table 13. EMC SDR SDRAM memory interface dynamic characteristics CL = 25 pF, Tamb = 40 C to +85 C, unless otherwise specified.[1][3] Symbol Parameter Min Typical[2] Max Unit foper operating frequency [4] 104 133 MHz tCK clock cycle time 7.5 9.6 - ns tCL CK LOW-level width - 4.8 - ns tCH CK HIGH-level width - 4.8 - ns td(V)ctrl control valid delay time [5][6] - (CMD_DLY  0.25) + 2.7 ns th(ctrl) control hold time [5][6] (CMD_DLY  0.25) + 1.2 - ns td(AV) address valid delay time [6] - (CMD_DLY  0.25) + 3.2 ns th(A) address hold time [6] (CMD_DLY  0.25) + 1.2 - ns td(QV) data output valid delay time [6] - (CMD_DLY  0.25) + 3.5 ns th(Q) data output hold time [6] (CMD_DLY  0.25) + 1.2 - ns tsu(D) data input set-up time - 0.6 - ns th(D) data input hold time - 0.9 - ns tQZ data output high-impedance time - -  tCK ns Fig 9. SDR SDRAM signal timing 002aae420 EMC_CLK output signal (O) input signal (I) td(V)ctrl, td(AV), td(QV) th(ctrl), th(Q), th(A) tsu(D) th(D) tCK tCH tCL tQZ LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 61 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.4 DDR SDRAM controller [1] All values valid for EMC pads set to fast slew rate at 1.8 V unless otherwise specified (see SDRAMCLK_CTRL register in the LPC32x0 User manual). [2] CMD_DLY = COMMAND_DELAY bitfield in SDRAMCLK_CTRL[18:14] register, see External Memory Controller (EMC) chapter in LPC32x0 User manual. [3] Applies to signals EMC_DQM[3:0], EMC_DYCS[1:0], EMC_RAS, EMC_CAS, EMC_WR, EMC_CKE[1:0]. [4] DQS_DELAY, see LPC32x0 User manual, External Memory Controller Chapter, Section 8 DDR DQS delay calibration for details on configuring this value. [5] Test conditions for measurements: Tamb = 40 C to +85 C; operating frequency range foper = 52 MHz to 133 MHz; EMC_DQM[3:0] and EMC_D[31:0] driving 2 inches of 50  characteristic impedance trace with 10 pF capacitive load; no external source series termination resistors used. EMC pads set to fast slew rate at 1.8 V or 2.5 V (see SDRAMCLK_CTRL register in the LPC32x0 User manual). Table 14. EMC DDR SDRAM memory interface dynamic characteristics[1] CL = 25 pF, Tamb = 25C, unless otherwise specified. Symbol Parameter Conditions Min Typical Max Unit foper operating frequency - 104 133 MHz tCK clock cycle time 7.5 9.6 - ns tCL CK LOW-level width - 0.5  tCK - ns tCH CK HIGH-level width - 0.5  tCK - ns td(V)ctrl control valid delay time [2][3] - (CMD_DLY  0.25) + 1.5 - ns th(ctrl) control hold time [2][3] - (CMD_DLY  0.25)  1.5 - ns td(AV) address valid delay time [2] - (CMD_DLY  0.25) + 1.5 - ns th(A) address hold time [2] - (CMD_DLY  0.25)  1.5 - ns tsu(Q) data output set-up time EMC_D[31:0] and EMC_DQM[3:0] to EMC_DQS[1:0] out [5] 0.08  tCK 0.15  tCK 0.25  tCK ns th(Q) data output hold time EMC_D[31:0] and EMC_DQM[3:0] to EMC_DQS[1:0] out [5] 0.25  tCK 0.35  tCK 0.42  tCK ns tDQSH DQS HIGH time for WRITE command - 0.5  tCK - ns tDQSL DQS LOW time for WRITE command - 0.5  tCK - ns tDQSS WRITE command to first DQS latching transition time for DQS out - tCK + 0.7 - ns tDSS DQS falling edge to CK set-up time for DQS in - 0.5  tCK - ns tDSH DQS falling edge hold time from CK for DQS in - 0.5  tCK - ns td(DQS) DQS delay time for DQS in [4] - DQS_DELAY - ns tsu(D) data input set-up time - 0.3 - ns th(D) data input hold time - 0.5 - ns LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 62 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Fig 10. DDR control timing parameters EMC_CLK EMC control and address signals 002aae436 tCK tCH tCL td(AV); td(V)ctrl th(A); th(ctl) valid Fig 11. DDR write timing parameters command EMC_D[31:0], EMC_DQM[3:0] tDQSS tDQSL tDQSH th(Q) EMC_DQS[1:0] EMC_CLK 002aae437 WRITE tsu(Q) tDSS tDSH (1) The delay of the EMC_DQS[1:0] signal is determined by the DQS_DELAY settings. See LPC32x0 User manual, External Memory Controller Chapter, section DDR DQS delay calibration for details on configuring this value. Fig 12. DDR read timing parameters EMC_CLK command EMC_D[31:0] tsu(D) EMC_DQS[1:0] 002aae438 th(D) READ delayed EMC_DQS[1:0](1) td(DQS) LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 63 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.5 USB controller [1] Parameters are valid over operating temperature range unless otherwise specified. 11.6 Secure Digital (SD) card interface [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. Table 15. Dynamic characteristics USB digital I/O pins VDD(IO) = 3.3 V; Tamb = 40 C to +85 C, unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit tTIO bus turnaround time (I/O) OE_N/INT_N to DAT/VP and SE0/VM - 7 - ns tTOI bus turnaround time (O/I) OE_N/INT_N to DAT/VP and SE0/VM - 0 - ns Fig 13. USB bus turnaround time 002aae440 USB_DAT_VP tTIO tTOI USB_OE_TP USB_SE0_VM input output input Table 16. Dynamic characteristics: SD card pin interface Tamb = 40 C to +85 C for industrial applications; VDD(IO) over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit Tcy(clk) clock cycle time on pin MS_SCLK; Data transfer mode - - 25 MHz on pin MS_SCLK; Identification mode - - 400 kHz tsu(D) data input set-up time on pins MS_BS, MS_DIO[3:0] as inputs - 2.7 - ns th(D) data input hold time on pins MS_BS, MS_DIO[3:0] as inputs - 0 - ns td(QV) data output valid delay time on pins MS_BS, MS_DIO[3:0] as outputs - 9.7 - ns th(Q) data output hold time on pins MS_BS, MS_DIO[3:0] as outputs - 7.7 - ns LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 64 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.7 MLC NAND flash memory controller [1] THCLK = 1/HCLK [2] CEAD = bitfield TCEA_DELAY[1:0] in register MLC_TIME_REG[25:24] [3] WL = bitfield WR_LOW[3:0] in register MLC_TIME_REG[3:0] [4] WH = bitfield WR_HIGH[3:0] in register MLC_TIME_REG[7:4] [5] RL = bitfield RD_LOW[3:0] in register MLC_TIME_REG[11:8] [6] RH = bitfield RD_HIGH [3:0] in register MLC_TIME_REG[15:12] [7] RHZ = bitfield NAND_TA[2:0] in register MLC_TIME_REG[18:16] [8] BD = bitfield BUSY_DELAY[4:0] in register MLC_TIME_REG[23:19] Fig 14. SD card pin interface timing 002aae441 MS_SCLK MS_DIO[3:0](O) MS_DIO[3:0] (I) td(QV) tsu(D) th(D) Tcy(clk) th(Q) MS_BS (O) MS_BS (I) Table 17. Dynamic characteristics of the MLC NAND flash memory controller Tamb = 40 C to +85 C. Symbol Parameter Min Typ Max Unit tCELREL CE LOW to RE LOW time [1][2] - THCLK  CEAD - ns tRC RE cycle time [1][5][6] - THCLK  (RL + 1) + THCLK  (RH  RL) - ns tREH RE HIGH hold time [1][5][6] - THCLK  (RH  RL) - ns tRHZ RE HIGH to output high-impedance time [1][5][7] - THCLK  (RH  RL) + THCLK  RHZ - ns tRP RE pulse width [1][5] - THCLK  (RL + 1) - ns tREHRBL RE HIGH to R/B LOW time [1][8] - THCLK  BD - ns tWB WE HIGH to R/B LOW time [1][8] - THCLK  BD - ns tWC WE cycle time [1][3][4] - THCLK  (WL + 1) + THCLK  (WH  WL) - ns tWH WE HIGH hold time [1][3][4] - THCLK  (WH  WL) - ns tWP WE pulse width [1][3] - THCLK  (WL + 1) - ns LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 65 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.8 SLC NAND flash memory controller Fig 15. MLC NAND flash controller write timing (writing to NAND flash) Fig 16. MLC NAND flash controller read timing (reading from NAND flash) tWB FLASH_IO[7:0] FLASH_WR tWP tWC FLASH_RDY (R/B) FLASH_CE D0 D1 Dn 10h tWH 002aae442 FLASH_IO[7:0] tRP tREH tRC FLASH_RD FLASH_CE tCELREL D0 D1 D2 D3 tRHZ 002aae443 Table 18. Dynamic characteristics of SLC NAND flash memory controller Tamb = 40 C to +85 C. Symbol Parameter Conditions Min Typ Max Unit tALS ALE set-up time read [1][2][4][6] - THCLK  (Rsu + Rw) - ns write - THCLK  (Wsu + Ww) - ns tALH ALE hold time read [1][7] - THCLK  Rh - ns write - THCLK  Wh - ns tAR ALE to RE delay time read [1][2][6] - THCLK  Rsu - ns write - THCLK  Wsu - ns LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 66 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers tCEA CE access time read [1][2][4][6][8] - THCLK  (Rsu + Rw) - ns write - THCLK  (Wsu + Ww) - ns tCS CE set-up time read [1][2][4][6][8] - THCLK  (Rsu + Rw) - ns write - THCLK  (Wsu + Ww) - ns tCH CE hold time read [1][3] - THCLK  Rh - ns write - THCLK  Wh - ns tCLS CLE set-up time read [1][2][4][6][8] - THCLK  (Rsu + Rw) - ns write - THCLK  (Wsu + Ww) - ns tCLH CLE hold time read [1][3] - THCLK  Rh - ns write - THCLK  Wh - ns tCLR CLE to RE delay time read [1][2][6] - THCLK  Rsu - ns write - THCLK  Wsu - ns tDH data hold time output from NAND controller; read [1][3][7] - THCLK  Rh - ns output from NAND controller; write - THCLK  Wh - ns tDS data set-up time output from NAND controller; read [1][2][4][6][8] - THCLK  (Rsu + Rw) - ns output from NAND controller; write - THCLK  (Wsu + Ww) - tIR output high-impedance to RE LOW time read [1][2][6] - THCLK  Rsu - ns write - THCLK  Wsu - ns tRC RE cycle time read [1][2] - THCLK  (Rsu + Rw + Rh) - ns tREA RE access time read [1][4] - THCLK  Rw - ns tREH RE high hold time read [1][2][3] - THCLK  (Rsu + Rh) - ns tRHOH RE HIGH to output hold time input hold for flash controller; read - 0 - - input hold for flash controller; write - 0 - - tRHZ RE HIGH to output high-impedance time read [1] - THCLK  Rh - ns tRP RE pulse width read [1][4] - THCLK  Rw - ns tRR ready to RE LOW time read [1][2][3] - THCLK  Rsu - ns tWB WE HIGH to R/B LOW time write [1][7][9] - (THCLK  Wh) + (2  THCLK  Wb) - ns tWC WE cycle time write [1][6][7][8] - THCLK  (Wsu + Ww + Wh) - ns Table 18. Dynamic characteristics of SLC NAND flash memory controller …continued Tamb = 40 C to +85 C. Symbol Parameter Conditions Min Typ Max Unit LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 67 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] THCLK = 1/HCLK [2] Rsu = bitfield R_SETUP[3:0] in register SLC_TAC[3:0] for reads [3] Rh = bitfield R_HOLD[3:0] in register SLC_TAC[7:4] for reads [4] Rw = bitfield R_WIDTH[3:0] in register SLC_TAC[11:8] for reads [5] Rb = bitfield R_RDY[3:0] in register SLC_TAC[15:12] for reads [6] Wsu = bitfield W_SETUP[3:0] in register SLC_TAC[19:16] for writes [7] Wh = bitfield W_HOLD[3:0] in register SLC_TAC[23:20] for writes [8] Ww = bitfield W_WIDTH[3:0] in register SLC_TAC[27:24] for writes [9] Wb = bitfield W_RDY[3:0] in register SLC_TAC[31:28] for writes tWH WE HIGH hold time write [1][6][7] - THCLK  (Wsu + Wh) - ns tWHR WE HIGH to RE LOW time write [1][7][9] - (THCLK  Wh) + (2  THCLK  Wb) - ns tWP WE pulse width write [1][8] - THCLK  Ww - ns tREHRBL RE HIGH to R/B LOW time write [1][3][5] - (THCLK  Rh) + (2  THCLK  Rb) - ns Table 18. Dynamic characteristics of SLC NAND flash memory controller …continued Tamb = 40 C to +85 C. Symbol Parameter Conditions Min Typ Max Unit Fig 17. MLC NAND flash memory write timing (writing to NAND flash) command tDS tDH tWB FLASH_IO[7:0] address tDS tDH tALS tALH tDS tDH tWP tWH tWC tCS tCH tCH tCLS tCLH command address data D0 D1 Dn tALS tCLH tALS tALH tWP tWP tWH tCLS tCS 002aae444 FLASH_CE FLASH_CLE FLASH_WR FLASH_ALE FLASH_RDY LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 68 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Fig 18. MLC NAND Flash memory read timing (reading from NAND flash) command tDS tDH tWB FLASH_IO[7:0] address tDS tDH tALS tALH tDS tDH tRP tREH tRC tRR tAR tCS tCH tCEA tCLR tCLS tCLH command address data tCOH tREA D0 D1 D2 D3 tRHZ tRHOH tALS tALH tCLS tCS tWP tWP tWH 002aae445 FLASH_ALE FLASH_CLE FLASH_RDY FLASH_WR FLASH_RD FLASH_CE LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 69 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.9 SPI and SSP Controller 11.9.1 SPI [1] THCLK = period time of SPI IP block input clock (HCLK) Fig 19. MLC NAND flash memory status timing tCS tCH tCEA 70 h tDS tDH status tRHOH tCLS tCLH command data tCLR tCOH tREA tIR FLASH_IO[7:0] tWHR tWP tRHZ FLASH_CLE FLASH_WR FLASH_CE FLASH_RD 002aae446 Table 19. Dynamic characteristics of SPI pins on SPI master controller Tamb = 40 C to +85 C. Symbol Parameter Min Typ Max Unit Common to SPI1 and SPI2 TSPICYC SPI cycle time [1] 2  THCLK - 256  THCLK ns SPI1 tSPIDSU SPI data set-up time - 6 - ns tSPIDH SPI data hold time - 0 - ns tSPIDV SPI enable to output data valid time - 2 - ns tSPIOH SPI output data hold time - 0 - ns SPI2 tSPIDSU SPI data set-up time - 10 - ns tSPIDH SPI data hold time - 0 - ns tSPIDV SPI enable to output data valid time - 2 - ns tSPIOH SPI output data hold time - 0 - ns LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 70 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.9.2 Timing diagrams for SPI and SSP (in SPI mode) Fig 20. SPI master timing (CPHA = 0) Fig 21. SPI master timing (CPHA = 1) 002aae457 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH DATA VALID DATA VALID tSPIOH DATA VALID DATA VALID tSPIQV SPI1/2_CLK or SCK0/1 (CPOL = 0) SPI1/2_CLK or SCK0/1 (CPOL = 1) SPI1/2_DATAIO or MOSI0/1 SPI1/2_DATAIN or MISO0/1 002aae454 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH tSPIQV DATA VALID DATA VALID tSPIOH DATA VALID DATA VALID SPI1/2_CLK or SCK0/1 (CPOL = 0) SPI1/2_CLK or SCK0/1 (CPOL = 1) SPI1/2_DATAIO or MOSI0/1 SPI1/2_DATAIN or MISO0/1 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 71 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Fig 22. SPI slave timing (CPHA = 0) Fig 23. SPI slave timing (CPHA = 1) 002aae458 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH tSPIQV DATA VALID DATA VALID tSPIOH DATA VALID DATA VALID SPI1/2_CLK or SCK0/1 (CPOL = 0) SPI1/2_CLK or SCK0/1 (CPOL = 1) SPI1/2_DATAIO or MOSI0/1 SPI1/2_DATAIN or MISO0/1 002aae459 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH tSPIQV DATA VALID DATA VALID tSPIOH DATA VALID DATA VALID SPI1/2_CLK or SCK0/1 (CPOL = 0) SPI1/2_CLK or SCK0/1 (CPOL = 1) SPI1/2_DATAIO or MOSI0/1 SPI1/2_DATAIN or MISO0/1 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 72 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 12. Package outline Fig 24. Package outline SOT1048-1 (TFBGA296) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT1048-1 MO-216 SOT1048-1 07-10-19 07-11-02 UNIT A max mm 1.2 0.4 0.3 0.80 0.65 15.1 14.9 15.1 14.9 0.8 13.6 0.15 0.08 0.1 A1 DIMENSIONS (mm are the original dimensions) TFBGA296: plastic thin fine-pitch ball grid array package; 296 balls 0 5 10 mm scale A2 b 0.5 0.4 D E e e1 e2 13.6 v w y 0.12 y1 C y1 C y X A B C D E F H K G L J M N P R T U 2 4 6 8 10 12 14 16 1 3 5 7 9 11 13 15 18 17 b e2 e1 e e 1/2 e 1/2 e ∅ v M C A B ∅ w M C ball A1 index area V B A ball A1 index area D E detail X A A2 A1 LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 73 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 13. Abbreviations Table 20. Abbreviations Acronym Description ADC Analog-to-Digital Converter AHB Advanced High-performance Bus AMBA Advanced Microcontroller Bus Architecture APB Advanced Peripheral Bus BSDL Boundary Scan Description Language CISC Complex Instruction Set Computer DDR SDRAM Double Data Rate Synchronous Dynamic Random Access Memory DMA Direct Memory Access DSP Digital Signal Processing ETM Embedded Trace Macrocell FAB Fast Access Bus FIFO First In, First Out FIQ Fast Interrupt Request GPIO General Purpose Input/Output I/O Input/Output IRQ Interrupt Request HS High-Speed IrDA Infrared Data Association JTAG Joint Test Action Group LCD Liquid Crystal Display MAC Media Access Control MIIM Media Independent Interface Management OHCI Open Host Controller Interface OTG On-The-Go PHY Physical Layer PLL Phase-Locked Loop PWM Pulse Width Modulator RAM Random Access Memory RMII Reduced Media Independent Interface SE0 Single Ended Zero SDR SDRAM Single Data Rate Synchronous Dynamic Random Access Memory SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port TFT Thin Film Transistor TTL Transistor-Transistor Logic STN Super Twisted Nematic LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 74 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers UART Universal Asynchronous Receiver/Transmitter USB Universal Serial Bus VFP Vector Floating Point processor Table 20. Abbreviations …continued Acronym Description LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 75 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 14. Revision history Table 21. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC3220_30_40_50 v.2 20111020 Product data sheet - LPC3220_30_40_50 v.1 Modifications: • Corrected pin functions for pin T14 (ADIN1/TS_XM) and pin U15 (ADIN0/TS_YM) in Table 3 and Table 4. • Power domain for pin PLL397_LOOP corrected in Table 4. • Power supply domain for pins SYSX_IN and SYSX_OUT pins corrected in Table 4. • Power supply domain for pin VDD_OSC corrected in Table 4. • Description of DEBUG pin updated in Table 4. • Added Table 6 “Supply domains”. • Changed VESD to 2500 V (HBM) and 1000 V (CDM) in Table 7. • Power consumption for HCLK, USB, and ADC added in Table 8. • Parameter IDD(RTC) updated in Table 8. • Parameter VDD(EMC) table notes updated in Table 8. • Input current for bus keeper inputs added in Table 8. • Added power consumption data (Table 8, Table 9, and Figure 5). • Static memory controller: added tsu(DQ) value in Table 12. • DDR SDRAM controller: updated tDQSS value in Table 14. • Minimum and maximum characterization data added for parameters tsu(Q) and th(Q) over temperature range 40 C to +85 C (see Table 14). • DDR SDRAM characteristics extended to maximum operating frequency foper = 133 MHz (see Table 14). • Parameters tWB, tWHR, and tREHRBL updated in Table 18. • Changed data sheet status to Product data sheet. • Parts LPC3220FET296/01, LPC3230FET296/01, LPC3240FET296/01, LPC3250FET296/01 added. LPC3220_30_40_50 v.1 20090206 Preliminary data sheet - - LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 76 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 15. Legal information 15.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 77 of 79 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 20 October 2011 78 of 79 continued >> NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 4 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Functional description . . . . . . . . . . . . . . . . . . 24 7.1 CPU and subsystems . . . . . . . . . . . . . . . . . . . 24 7.1.1 CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.1.2 Vector Floating Point (VFP) coprocessor . . . . 24 7.1.3 Emulation and debugging. . . . . . . . . . . . . . . . 24 7.1.3.1 Embedded ICE . . . . . . . . . . . . . . . . . . . . . . . . 24 7.1.3.2 Embedded trace buffer . . . . . . . . . . . . . . . . . . 25 7.2 AHB matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.2.1 APB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.2.2 FAB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.3 Physical memory map . . . . . . . . . . . . . . . . . . 26 7.4 Internal memory . . . . . . . . . . . . . . . . . . . . . . . 28 7.4.1 On-chip ROM . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.4.2 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 28 7.5 External memory interfaces . . . . . . . . . . . . . . 28 7.5.1 NAND flash controllers . . . . . . . . . . . . . . . . . . 28 7.5.1.1 Multi-Level Cell (MLC) NAND flash controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.5.1.2 Single-Level Cell (SLC) NAND flash controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.5.2 SD card controller. . . . . . . . . . . . . . . . . . . . . . 29 7.5.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.5.3 External memory controller. . . . . . . . . . . . . . . 29 7.6 AHB master peripherals . . . . . . . . . . . . . . . . . 30 7.6.1 General Purpose DMA (GPDMA) controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.6.2 Ethernet MAC . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.6.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.6.3 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.6.3.1 USB device controller . . . . . . . . . . . . . . . . . . . 31 7.6.3.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 32 7.6.3.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 32 7.6.4 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 33 7.6.4.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.7 System functions . . . . . . . . . . . . . . . . . . . . . . 34 7.7.1 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 34 7.7.2 Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 34 7.7.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.7.3 Millisecond timer . . . . . . . . . . . . . . . . . . . . . . 34 7.7.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.7.4 Clocking and power control features . . . . . . . 35 7.7.4.1 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.7.4.2 Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . . 35 7.7.4.3 PLLs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.7.4.4 Power control modes . . . . . . . . . . . . . . . . . . . 36 7.7.4.5 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.8 Communication peripheral interfaces . . . . . . 36 7.8.1 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.8.1.1 Standard UARTs. . . . . . . . . . . . . . . . . . . . . . . 37 7.8.1.2 High-speed UARTs . . . . . . . . . . . . . . . . . . . . 37 7.8.2 SPI serial I/O controller . . . . . . . . . . . . . . . . . 37 7.8.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 7.8.3 SSP serial I/O controller. . . . . . . . . . . . . . . . . 38 7.8.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 7.8.4 I2C-bus serial I/O controller . . . . . . . . . . . . . . 38 7.8.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 7.8.5 I2S-bus audio controller . . . . . . . . . . . . . . . . . 39 7.8.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 7.9 Other peripherals . . . . . . . . . . . . . . . . . . . . . . 40 7.9.1 General purpose parallel I/O . . . . . . . . . . . . . 40 7.9.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 7.9.2 Keyboard scanner . . . . . . . . . . . . . . . . . . . . . 41 7.9.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 7.9.3 Touch screen controller and 10-bit ADC . . . . 41 7.9.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 7.9.4 Real-Time Clock (RTC) and battery RAM . . . . . . . . . . . . . . . . . . . . . . 41 7.9.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.9.5 Enhanced 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 42 7.9.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.9.6 High-speed timer . . . . . . . . . . . . . . . . . . . . . . 43 7.9.6.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 7.9.7 Pulse Width Modulators (PWMs) . . . . . . . . . . 43 7.9.7.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 7.9.8 Motor control pulse width modulator . . . . . . . 43 7.9.8.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 8 Basic architecture . . . . . . . . . . . . . . . . . . . . . . 44 9 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 45 10 Static characteristics . . . . . . . . . . . . . . . . . . . 46 10.1 Minimum core voltage requirements . . . . . . . 53 10.2 Power supply sequencing . . . . . . . . . . . . . . . 53 10.3 Power consumption per peripheral . . . . . . . . 53 10.4 Power consumption in Run mode . . . . . . . . . 54 10.5 ADC static characteristics . . . . . . . . . . . . . . . 55 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 October 2011 Document identifier: LPC3220_30_40_50 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 57 11.1 Clocking and I/O port pins . . . . . . . . . . . . . . . 57 11.2 Static memory controller . . . . . . . . . . . . . . . . . 57 11.3 SDR SDRAM Controller . . . . . . . . . . . . . . . . . 60 11.4 DDR SDRAM controller . . . . . . . . . . . . . . . . . 61 11.5 USB controller . . . . . . . . . . . . . . . . . . . . . . . . 63 11.6 Secure Digital (SD) card interface . . . . . . . . . 63 11.7 MLC NAND flash memory controller. . . . . . . . 64 11.8 SLC NAND flash memory controller . . . . . . . . 65 11.9 SPI and SSP Controller . . . . . . . . . . . . . . . . . 69 11.9.1 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 11.9.2 Timing diagrams for SPI and SSP (in SPI mode) . . . . . . . . . . . . . . . . . . . . . . . . . 70 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 72 13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 73 14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 75 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 76 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 76 15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 77 16 Contact information. . . . . . . . . . . . . . . . . . . . . 77 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 1. General description The LPC81xM are an ARM Cortex-M0+ based, low-cost 32-bit MCU family operating at CPU frequencies of up to 30 MHz. The LPC81xM support up to 16 kB of flash memory and 4 kB of SRAM. The peripheral complement of the LPC81xM includes a CRC engine, one I2C-bus interface, up to three USARTs, up to two SPI interfaces, one multi-rate timer, self wake-up timer, and state-configurable timer, one comparator, function-configurable I/O ports through a switch matrix, an input pattern match engine, and up to 18 general-purpose I/O pins. 2. Features and benefits  System:  ARM Cortex-M0+ processor, running at frequencies of up to 30 MHz with single-cycle multiplier and fast single-cycle I/O port.  ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC).  System tick timer.  Serial Wire Debug (SWD) and JTAG boundary scan modes supported.  Micro Trace Buffer (MTB) supported.  Memory:  Up to 16 kB on-chip flash programming memory with 64 Byte page write and erase.  Up to 4 kB SRAM.  ROM API support:  Boot loader.  USART drivers.  I2C drivers.  Power profiles.  Flash In-Application Programming (IAP) and In-System Programming (ISP).  Digital peripherals:  High-speed GPIO interface connected to the ARM Cortex-M0+ IO bus with up to 18 General-Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors, programmable open-drain mode, input inverter, and glitch filter.  High-current source output driver (20 mA) on four pins.  High-current sink driver (20 mA) on two true open-drain pins.  GPIO interrupt generation capability with boolean pattern-matching feature on eight GPIO inputs.  Switch matrix for flexible configuration of each I/O pin function. LPC81xM 32-bit ARM Cortex-M0+ microcontroller; up to 16 kB flash and 4 kB SRAM Rev. 4.3 — 22 April 2014 Product data sheet LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 2 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller  State Configurable Timer/PWM (SCTimer/PWM) with input and output functions (including capture and match) assigned to pins through the switch matrix.  Multiple-channel multi-rate timer (MRT) for repetitive interrupt generation at up to four programmable, fixed rates.  Self Wake-up Timer (WKT) clocked from either the IRC or a low-power, low-frequency internal oscillator.  CRC engine.  Windowed Watchdog timer (WWDT).  Analog peripherals:  Comparator with internal and external voltage references with pin functions assigned or enabled through the switch matrix.  Serial interfaces:  Three USART interfaces with pin functions assigned through the switch matrix.  Two SPI controllers with pin functions assigned through the switch matrix.  One I2C-bus interface with pin functions assigned through the switch matrix.  Clock generation:  12 MHz internal RC oscillator trimmed to 1.5 % accuracy that can optionally be used as a system clock.  Crystal oscillator with an operating range of 1 MHz to 25 MHz.  Programmable watchdog oscillator with a frequency range of 9.4 kHz to 2.3 MHz.  10 kHz low-power oscillator for the WKT.  PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the system oscillator, the external clock input CLKIN, or the internal RC oscillator.  Clock output function with divider that can reflect the crystal oscillator, the main clock, the IRC, or the watchdog oscillator.  Power control:  Integrated PMU (Power Management Unit) to minimize power consumption.  Reduced power modes: Sleep mode, Deep-sleep mode, Power-down mode, and Deep power-down mode.  Wake-up from Deep-sleep and Power-down modes on activity on USART, SPI, and I2C peripherals.  Timer-controlled self wake-up from Deep power-down mode.  Power-On Reset (POR).  Brownout detect.  Unique device serial number for identification.  Single power supply.  Operating temperature range 40 °C to 105 °C except for the DIP8 package, which is available for a temperature range of 40 °C to 85 °C.  Available as DIP8, TSSOP16, SO20, TSSOP20, and XSON16 package. 3. Applications  8/16-bit applications  Lighting  Consumer  Motor control  Climate control  Fire and security applications LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 3 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 4. Ordering information 4.1 Ordering options Table 1. Ordering information Type number Package Name Description Version LPC810M021FN8 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT097-2 LPC811M001JDH16 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 LPC812M101JDH16 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 LPC812M101JD20 SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 LPC812M101JDH20 TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 LPC812M101JTB16 XSON16 plastic extremely thin small outline package; no leads; 16 terminals; body 2.5  3.2  0.5 mm SOT1341-1 Table 2. Ordering options Type number Flash/kB SRAM/kB USART I2C-bus SPI Comparator GPIO Package LPC810M021FN8 4 1 2 1 1 1 6 DIP8 LPC811M001JDH16 8 2 2 1 1 1 14 TSSOP16 LPC812M101JDH16 16 4 3 1 2 1 14 TSSOP16 LPC812M101JD20 16 4 2 1 1 1 18 SO20 LPC812M101JDH20 16 4 3 1 2 1 18 TSSOP20 LPC812M101JTB16 16 4 3 1 2 1 14 XSON16 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 4 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 5. Marking The LPC81xM devices typically have the following top-side marking: LPC81x xxxxx xxxxxxxx xxYWWxR[x] The last two letters in the last line (field ‘xR’) identify the boot code version and device revision. Field ‘Y’ states the year the device was manufactured. Field ‘WW’ states the week the device was manufactured during that year. Remark: On the TSSOP16 package, the last line includes only the date code xxYWW. Table 3. Device revision table Revision identifier (xR) Revision description ‘1A’ Initial device revision with boot code version 13.1 ‘2A’ Device revision with boot code version 13.2 ’4C’ Device revision with boot code version 13.4 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 5 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 6. Block diagram Fig 1. LPC81xM block diagram 􀀶􀀵􀀤􀀰 􀀔􀀒􀀕􀀒􀀗􀀃􀁎􀀥 􀀤􀀵􀀰 􀀦􀀲􀀵􀀷􀀨􀀻􀀐􀀰􀀓􀀎 􀀷􀀨􀀶􀀷􀀒􀀧􀀨􀀥􀀸􀀪 􀀬􀀱􀀷􀀨􀀵􀀩􀀤􀀦􀀨 􀀩􀀯􀀤􀀶􀀫 􀀗􀀒􀀛􀀒􀀔􀀙􀀃􀁎􀀥 􀀫􀀬􀀪􀀫􀀐􀀶􀀳􀀨􀀨􀀧 􀀪􀀳􀀬􀀲 􀀤􀀫􀀥􀀃􀀷􀀲􀀃􀀤􀀳􀀥 􀀥􀀵􀀬􀀧􀀪􀀨􀀃 􀀦􀀯􀀲􀀦􀀮 􀀪􀀨􀀱􀀨􀀵􀀤􀀷􀀬􀀲􀀱􀀏 􀀳􀀲􀀺􀀨􀀵􀀃􀀦􀀲􀀱􀀷􀀵􀀲􀀯􀀏 􀀶􀀼􀀶􀀷􀀨􀀰􀀃 􀀩􀀸􀀱􀀦􀀷􀀬􀀲􀀱􀀶 􀀵􀀨􀀶􀀨􀀷􀀏􀀃􀀦􀀯􀀮􀀬􀀱 􀁆􀁏􀁒􀁆􀁎􀁖􀀃􀁄􀁑􀁇􀀃 􀁆􀁒􀁑􀁗􀁕􀁒􀁏􀁖 􀀯􀀳􀀦􀀛􀀔􀁛􀀰 􀁄􀁄􀁄􀀐􀀓􀀓􀀘􀀚􀀗􀀙 􀁖􀁏􀁄􀁙􀁈 􀁖􀁏􀁄􀁙􀁈 􀁖􀁏􀁄􀁙􀁈 􀀵􀀲􀀰 􀁖􀁏􀁄􀁙􀁈 􀀦􀀵􀀦 􀁖􀁏􀁄􀁙􀁈 􀀳􀀬􀀱􀀃􀀬􀀱􀀷􀀨􀀵􀀵􀀸􀀳􀀷􀀶􀀒 􀀳􀀤􀀷􀀷􀀨􀀵􀀱􀀃􀀰􀀤􀀷􀀦􀀫 􀀤􀀫􀀥􀀐􀀯􀀬􀀷􀀨􀀃􀀃􀀥􀀸􀀶 􀀬􀀵􀀦 􀀺􀀧􀀲􀁖􀁆 􀀥􀀲􀀧 􀀳􀀲􀀵 􀀶􀀳􀀬􀀓 􀀸􀀶􀀤􀀵􀀷􀀓 􀀶􀀧􀀤 􀀶􀀦􀀯 􀀦􀀷􀀬􀀱􀁂􀀾􀀖􀀝􀀓􀁀 􀀦􀀷􀀲􀀸􀀷􀁂􀀾􀀖􀀝􀀓􀁀 􀀔􀀛􀀃􀁛􀀃 􀀳􀀬􀀲􀀓 􀀔􀀛􀀃􀁛􀀃 􀀺􀀺􀀧􀀷 􀀬􀀲􀀦􀀲􀀱 􀀳􀀰􀀸 􀀶􀀨􀀯􀀩 􀀺􀀤􀀮􀀨􀀐􀀸􀀳􀀃􀀷􀀬􀀰􀀨􀀵 􀀰􀀸􀀯􀀷􀀬􀀐􀀵􀀤􀀷􀀨􀀃􀀷􀀬􀀰􀀨􀀵 􀀶􀀳􀀬􀀔 􀀬􀀕􀀦􀀐􀀥􀀸􀀶 􀀶􀀦􀀷􀀬􀀰􀀨􀀵􀀒 􀀳􀀺􀀰 􀀶􀀺􀀬􀀷􀀦􀀫 􀀰􀀤􀀷􀀵􀀬􀀻 􀀦􀀲􀀰􀀳􀀤􀀵􀀤􀀷􀀲􀀵 􀀻􀀷􀀤􀀯􀀬􀀱 􀀻􀀷􀀤􀀯􀀲􀀸􀀷 􀀤􀀦􀀰􀀳􀁂􀀲 􀀶􀀼􀀶􀀦􀀲􀀱 􀀵􀀻􀀧􀀏􀀃􀀦􀀷􀀶 􀀷􀀻􀀧􀀏􀀃􀀵􀀷􀀶 􀀤􀀦􀀰􀀳􀁂􀀬􀀔􀀒􀀕 􀀹􀀧􀀧􀀦􀀰􀀳 􀀶􀀦􀀮􀀏􀀃􀀶􀀶􀀨􀀯 􀀰􀀬􀀶􀀲􀀏􀀃􀀰􀀲􀀶􀀬 􀀶􀀦􀀮􀀏􀀃􀀶􀀶􀀨􀀯 􀀰􀀬􀀶􀀲􀀏􀀃􀀰􀀲􀀶􀀬 􀀤􀀯􀀺􀀤􀀼􀀶􀀐􀀲􀀱􀀃􀀳􀀲􀀺􀀨􀀵􀀃􀀧􀀲􀀰􀀤􀀬􀀱 􀀻􀀷􀀤􀀯 􀀶􀀦􀀯􀀮 􀀸􀀶􀀤􀀵􀀷􀀔 􀀵􀀻􀀧􀀏􀀃􀀦􀀷􀀶 􀀷􀀻􀀧􀀏􀀃􀀵􀀷􀀶 􀀶􀀦􀀯􀀮 􀀸􀀶􀀤􀀵􀀷􀀕 􀀵􀀻􀀧􀀏􀀃􀀦􀀷􀀶 􀀷􀀻􀀧􀀏􀀃􀀵􀀷􀀶 􀀶􀀦􀀯􀀮 􀀦􀀯􀀮􀀲􀀸􀀷 􀀶􀀺􀀦􀀯􀀮􀀏􀀃􀀶􀀺􀀧 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 6 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 7. Pinning information 7.1 Pinning Fig 2. Pin configuration DIP8 package (LPC810M021JN8) 􀀵􀀨􀀶􀀨􀀷􀀒􀀳􀀬􀀲􀀓􀁂􀀘 􀀳􀀬􀀲􀀓􀁂􀀓􀀒􀀤􀀦􀀰􀀳􀁂􀀬􀀔􀀒􀀷􀀧􀀲 􀀳􀀬􀀲􀀓􀁂􀀗􀀒􀀺􀀤􀀮􀀨􀀸􀀳􀀒􀀷􀀵􀀶􀀷 􀀹􀀶􀀶 􀀶􀀺􀀦􀀯􀀮􀀒􀀳􀀬􀀲􀀓􀁂􀀖􀀒􀀷􀀦􀀮 􀀹􀀧􀀧 􀀶􀀺􀀧􀀬􀀲􀀒􀀳􀀬􀀲􀀓􀁂􀀕􀀒􀀷􀀰􀀶 􀀳􀀬􀀲􀀓􀁂􀀔􀀒􀀤􀀦􀀰􀀳􀁂􀀬􀀕􀀒􀀦􀀯􀀮􀀬􀀱􀀒􀀷􀀧􀀬 􀁄􀁄􀁄􀀐􀀓􀀓􀀘􀀚􀀗􀀚 􀀔 􀀕 􀀖 􀀗 􀀙 􀀘 􀀛 􀀚 􀀧􀀬􀀳􀀛 Fig 3. Pin configuration TSSOP16 package (LPC811M001JDH16 and LPC812M101JDH16) 􀀷􀀶􀀶􀀲􀀳􀀔􀀙 􀀳􀀬􀀲􀀓􀁂􀀔􀀖 􀀳􀀬􀀲􀀓􀁂􀀓􀀒􀀤􀀦􀀰􀀳􀁂􀀬􀀔􀀒􀀷􀀧􀀲 􀀳􀀬􀀲􀀓􀁂􀀔􀀕 􀀳􀀬􀀲􀀓􀁂􀀙􀀒􀀹􀀧􀀧􀀦􀀰􀀳 􀀵􀀨􀀶􀀨􀀷􀀒􀀳􀀬􀀲􀀓􀁂􀀘 􀀳􀀬􀀲􀀓􀁂􀀚 􀀳􀀬􀀲􀀓􀁂􀀗􀀒􀀺􀀤􀀮􀀨􀀸􀀳􀀒􀀷􀀵􀀶􀀷 􀀹􀀶􀀶 􀀶􀀺􀀦􀀯􀀮􀀒􀀳􀀬􀀲􀀓􀁂􀀖􀀒􀀷􀀦􀀮 􀀹􀀧􀀧 􀀶􀀺􀀧􀀬􀀲􀀒􀀳􀀬􀀲􀀓􀁂􀀕􀀒􀀷􀀰􀀶 􀀳􀀬􀀲􀀓􀁂􀀛􀀒􀀻􀀷􀀤􀀯􀀬􀀱 􀀳􀀬􀀲􀀓􀁂􀀔􀀔 􀀳􀀬􀀲􀀓􀁂􀀜􀀒􀀻􀀷􀀤􀀯􀀲􀀸􀀷 􀀳􀀬􀀲􀀓􀁂􀀔􀀓 􀀳􀀬􀀲􀀓􀁂􀀔􀀒􀀤􀀦􀀰􀀳􀁂􀀬􀀕􀀒􀀦􀀯􀀮􀀬􀀱􀀒􀀷􀀧􀀬 􀁄􀁄􀁄􀀐􀀓􀀓􀀖􀀚􀀓􀀚 􀀔 􀀕 􀀖 􀀗 􀀘 􀀙 􀀚 􀀛 􀀔􀀓 􀀜 􀀔􀀕 􀀔􀀔 􀀔􀀗 􀀔􀀖 􀀔􀀙 􀀔􀀘 Fig 4. Pin configuration SO20 package (LPC812M101JD20) 􀀶􀀲􀀕􀀓 􀀳􀀬􀀲􀀓􀁂􀀔􀀚 􀀳􀀬􀀲􀀓􀁂􀀔􀀗 􀀳􀀬􀀲􀀓􀁂􀀔􀀖 􀀳􀀬􀀲􀀓􀁂􀀓􀀒􀀤􀀦􀀰􀀳􀁂􀀬􀀔􀀒􀀷􀀧􀀲 􀀳􀀬􀀲􀀓􀁂􀀔􀀕 􀀳􀀬􀀲􀀓􀁂􀀙􀀒􀀹􀀧􀀧􀀦􀀰􀀳 􀀵􀀨􀀶􀀨􀀷􀀒􀀳􀀬􀀲􀀓􀁂􀀘 􀀳􀀬􀀲􀀓􀁂􀀚 􀀳􀀬􀀲􀀓􀁂􀀗􀀒􀀺􀀤􀀮􀀨􀀸􀀳􀀒􀀷􀀵􀀶􀀷 􀀹􀀶􀀶 􀀶􀀺􀀦􀀯􀀮􀀒􀀳􀀬􀀲􀀓􀁂􀀖􀀒􀀷􀀦􀀮 􀀹􀀧􀀧 􀀶􀀺􀀧􀀬􀀲􀀒􀀳􀀬􀀲􀀓􀁂􀀕􀀒􀀷􀀰􀀶 􀀳􀀬􀀲􀀓􀁂􀀛􀀒􀀻􀀷􀀤􀀯􀀬􀀱 􀀳􀀬􀀲􀀓􀁂􀀔􀀔 􀀳􀀬􀀲􀀓􀁂􀀜􀀒􀀻􀀷􀀤􀀯􀀲􀀸􀀷 􀀳􀀬􀀲􀀓􀁂􀀔􀀓 􀀳􀀬􀀲􀀓􀁂􀀔􀀒􀀤􀀦􀀰􀀳􀁂􀀕􀀒􀀦􀀯􀀮􀀬􀀱􀀒􀀷􀀧􀀬 􀀳􀀬􀀲􀀓􀁂􀀔􀀙 􀀳􀀬􀀲􀀓􀁂􀀔􀀘 􀁄􀁄􀁄􀀐􀀓􀀓􀀖􀀚􀀘􀀙 􀀔 􀀕 􀀖 􀀗 􀀘 􀀙 􀀚 􀀛 􀀜 􀀔􀀓 􀀔􀀕 􀀔􀀔 􀀔􀀗 􀀔􀀖 􀀔􀀙 􀀔􀀘 􀀔􀀛 􀀔􀀚 􀀕􀀓 􀀔􀀜 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 7 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 5. Pin configuration TSSOP20 package (LPC812M101JDH20) 􀀷􀀶􀀶􀀲􀀳􀀕􀀓 􀀳􀀬􀀲􀀓􀁂􀀔􀀚 􀀳􀀬􀀲􀀓􀁂􀀔􀀗 􀀳􀀬􀀲􀀓􀁂􀀔􀀖 􀀳􀀬􀀲􀀓􀁂􀀓􀀒􀀤􀀦􀀰􀀳􀁂􀀬􀀔􀀒􀀷􀀧􀀲 􀀳􀀬􀀲􀀓􀁂􀀔􀀕 􀀳􀀬􀀲􀀓􀁂􀀙􀀒􀀹􀀧􀀧􀀦􀀰􀀳 􀀵􀀨􀀶􀀨􀀷􀀒􀀳􀀬􀀲􀀓􀁂􀀘 􀀳􀀬􀀲􀀓􀁂􀀚 􀀳􀀬􀀲􀀓􀁂􀀗􀀒􀀺􀀤􀀮􀀨􀀸􀀳􀀒􀀷􀀵􀀶􀀷 􀀹􀀶􀀶 􀀶􀀺􀀦􀀯􀀮􀀒􀀳􀀬􀀲􀀓􀁂􀀖􀀒􀀷􀀦􀀮 􀀹􀀧􀀧 􀀶􀀺􀀧􀀬􀀲􀀒􀀳􀀬􀀲􀀓􀁂􀀕􀀒􀀷􀀰􀀶 􀀳􀀬􀀲􀀓􀁂􀀛􀀒􀀻􀀷􀀤􀀯􀀬􀀱 􀀳􀀬􀀲􀀓􀁂􀀔􀀔 􀀳􀀬􀀲􀀓􀁂􀀜􀀒􀀻􀀷􀀤􀀯􀀲􀀸􀀷 􀀳􀀬􀀲􀀓􀁂􀀔􀀓 􀀳􀀬􀀲􀀓􀁂􀀔􀀒􀀤􀀦􀀰􀀳􀁂􀀬􀀕􀀒􀀦􀀯􀀮􀀬􀀱􀀒􀀷􀀧􀀬 􀀳􀀬􀀲􀀓􀁂􀀔􀀙 􀀳􀀬􀀲􀀓􀁂􀀔􀀘 􀁄􀁄􀁄􀀐􀀓􀀓􀀖􀀚􀀚􀀘 􀀔 􀀕 􀀖 􀀗 􀀘 􀀙 􀀚 􀀛 􀀜 􀀔􀀓 􀀔􀀕 􀀔􀀔 􀀔􀀗 􀀔􀀖 􀀔􀀙 􀀔􀀘 􀀔􀀛 􀀔􀀚 􀀕􀀓 􀀔􀀜 Fig 6. Pin configuration XSON16 package (LPC812M101JTB16) terminal 1 index area XSON16 16 aaa-009570 Transparent top view 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 PIO0_13 PIO0_12 RESET/PIO0_5 PIO0_4/WAKEUP/TRST SWCLK/PIO0_3/TCK SWDIO/PIO0_2/TMS PIO0_11 PIO0_10 PIO0_0/ACMP_I1/TDO PIO0_6/VDDCMP PIO0_7 VSS VDD PIO0_8/XTALIN PIO0_9/XTALOUT PIO0_1/ACMP_I2/CLKIN/TDI LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 8 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 7.2 Pin description The pin description consists of two parts showing pin functions that are fixed to a certain package pin (see Table 4) and showing pin functions that can be assigned to any pin on the package through the switch matrix (see Table 5). The pin description table in Table 4 shows the pin functions that are fixed to specific pins on each package. These fixed-pin functions are selectable between GPIO and the comparator inputs, SWD, RESET, and the XTAL pins. By default, the GPIO function is selected except on pins PIO0_2, PIO0_3, and PIO0_5. JTAG functions are available in boundary scan mode only. Table 5 shows the the I2C, USART, SPI, and SCT pin functions, which can be assigned through the switch matrix to any pin that is not power or ground in place of the pin’s fixed functions. The following exceptions apply: For full I2C-bus compatibility, assign the I2C functions to the open-drain pins PIO0_11 and PIO0_10. Do not assign more than one output to any pin. However, more than one input can be assigned to a pin. Once any function is assigned to a pin, the pin’s GPIO functionality is disabled. Pin PIO0_4 triggers a wake-up from Deep power-down mode. If you need to wake up from Deep power-down mode via an external pin, do not assign any movable function to this pin. The JTAG functions TDO, TDI, TCK, TMS, and TRST are selected on pins PIO0_0 to PIO0_4 by hardware when the part is in boundary scan mode. Table 4. Pin description table (fixed pins) Symbol SO20/ TSSOP20 TSSOP16 XSON16 DIP8 Type Reset state [1] Description PIO0_0/ACMP_I1/ TDO 19 16 16 8 [5] I/O I; PU PIO0_0 — General purpose digital input/output port 0 pin 0. In ISP mode, this is the USART0 receive pin U0_RXD. In boundary scan mode: TDO (Test Data Out). AI - ACMP_I1 — Analog comparator input 1. PIO0_1/ACMP_I2/ CLKIN/TDI 12 9 9 5 [5] I/O I; PU PIO0_1 — General purpose digital input/output pin. In boundary scan mode: TDI (Test Data In). ISP entry pin on chip versions 1A and 2A and on the DIP8 package (see Table 6). For these chip versions and packages, a LOW level on this pin during reset starts the ISP command handler. See PIO0_12 for all other packages. AI - ACMP_I2 — Analog comparator input 2. I - CLKIN — External clock input. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 9 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller SWDIO/PIO0_2/TMS 7 6 6 4 [2] I/O I; PU SWDIO — Serial Wire Debug I/O. SWDIO is enabled by default on this pin. In boundary scan mode: TMS (Test Mode Select). I/O - PIO0_2 — General purpose digital input/output pin. SWCLK/PIO0_3/ TCK 6 5 5 3 [2] I/O I; PU SWCLK — Serial Wire Clock. SWCLK is enabled by default on this pin. In boundary scan mode: TCK (Test Clock). I/O - PIO0_3 — General purpose digital input/output pin. PIO0_4/WAKEUP/ TRST 5 4 4 2 [6] I/O I; PU PIO0_4 — General purpose digital input/output pin. In ISP mode, this is the USART0 transmit pin U0_TXD. In boundary scan mode: TRST (Test Reset). This pin triggers a wake-up from Deep power-down mode. If you need to wake up from Deep power-down mode via an external pin, do not assign any movable function to this pin. This pin should be pulled HIGH externally before entering Deep power-down mode. A LOW-going pulse as short as 50 ns causes the chip to exit Deep power-down mode and wakes up the part. RESET/PIO0_5 4 3 3 1 [4] I/O I; PU RESET — External reset input: A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. In deep power-down mode, this pin must be pulled HIGH externally. The RESET pin can be left unconnected or be used as a GPIO or for any movable function if an external RESET function is not needed and the Deep power-down mode is not used. I - PIO0_5 — General purpose digital input/output pin. PIO0_6/VDDCMP 18 15 15 - [9] I/O I; PU PIO0_6 — General purpose digital input/output pin. AI - VDDCMP — Alternate reference voltage for the analog comparator. PIO0_7 17 14 14 - [2] I/O I; PU PIO0_7 — General purpose digital input/output pin. PIO0_8/XTALIN 14 11 11 - [8] I/O I; PU PIO0_8 — General purpose digital input/output pin. I - XTALIN — Input to the oscillator circuit and internal clock generator circuits. Input voltage must not exceed 1.95 V. PIO0_9/XTALOUT 13 10 10 - [8] I/O I; PU PIO0_9 — General purpose digital input/output pin. O - XTALOUT — Output from the oscillator circuit. PIO0_10 9 8 8 - [3]I IA PIO0_10 — General purpose digital input/output pin. Assign I2C functions to this pin when true open-drain pins are needed for a signal compliant with the full I2C specification. PIO0_11 8 7 7 - [3]I IA PIO0_11 — General purpose digital input/output pin. Assign I2C functions to this pin when true open-drain pins are needed for a signal compliant with the full I2C specification. Table 4. Pin description table (fixed pins) Symbol SO20/ TSSOP20 TSSOP16 XSON16 DIP8 Type Reset state [1] Description LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 10 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller [1] Pin state at reset for default function: I = Input; AI = Analog Input; O = Output; PU = internal pull-up enabled (pins pulled up to full VDD level); IA = inactive, no pull-up/down enabled. [2] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis; includes high-current output driver. [3] True open-drain pin. I2C-bus pins compliant with the I2C-bus specification for I2C standard mode, I2C Fast-mode, and I2C Fast-mode Plus. Do not use this pad for high-speed applications such as SPI or USART. The pin requires an external pull-up to provide output functionality. When power is switched off, this pin is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. Remark: If this pin is not available on the package, prevent it from internally floating as follows: Set bits 10 and 11 in the GPIO DIR0 register to 1 to enable the output driver and write 1 to bits 10 and 11 in the GPIO CLR0 register to drive the outputs LOW internally. [4] See Figure 11 for the reset pad configuration. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset the chip and wake up from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down mode. [5] 5 V tolerant pin providing standard digital I/O functions with configurable modes, configurable hysteresis, and analog input. When configured as an analog input, the digital section of the pin is disabled, and the pin is not 5 V tolerant. [6] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis. In Deep power-down mode, pulling this pin LOW wakes up the chip. The wake-up pin function can be disabled and the pin can be used for other purposes, if the WKT low power oscillator is enabled for waking up the part from Deep power-down mode. [7] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis. [8] 5 V tolerant pin providing standard digital I/O functions with configurable modes, configurable hysteresis, and analog I/O for the system oscillator. When configured as an analog I/O, the digital section of the pin is disabled, and the pin is not 5 V tolerant. [9] The digital part of this pin is 3 V tolerant pin due to special analog functionality. Pin provides standard digital I/O functions with configurable modes, configurable hysteresis, and an analog input. When configured as an analog input, the digital section of the pin is disabled. PIO0_12 3 2 2 - [2] I/O I; PU PIO0_12 — General purpose digital input/output pin. ISP entry pin on the SO20/TSSOP20/TSSOP16/XSON16 packages starting with chip version 4C (see Table 6). A LOW level on this pin during reset starts the ISP command handler. See pin PIO0_1 for the DIP8 package and chip versions 1A and 2A. PIO0_13 2 1 1 - [2] I/O I; PU PIO0_13 — General purpose digital input/output pin. PIO0_14 20 - - - [7] I/O I; PU PIO0_14 — General purpose digital input/output pin. PIO0_15 11 - - - [7] I/O I; PU PIO0_15 — General purpose digital input/output pin. PIO0_16 10 - - - [7] I/O I; PU PIO0_16 — General purpose digital input/output pin. PIO0_17 1 - - - [7] I/O I; PU PIO0_17 — General purpose digital input/output pin. VDD 15 12 12 6 - - 3.3 V supply voltage. VSS 16 13 13 7 - - Ground. Table 4. Pin description table (fixed pins) Symbol SO20/ TSSOP20 TSSOP16 XSON16 DIP8 Type Reset state [1] Description Table 5. Movable functions (assign to pins PIO0_0 to PIO_17 through switch matrix) Function name Type Description U0_TXD O Transmitter output for USART0. U0_RXD I Receiver input for USART0. U0_RTS O Request To Send output for USART0. U0_CTS I Clear To Send input for USART0. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 11 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller U0_SCLK I/O Serial clock input/output for USART0 in synchronous mode. U1_TXD O Transmitter output for USART1. U1_RXD I Receiver input for USART1. U1_RTS O Request To Send output for USART1. U1_CTS I Clear To Send input for USART1. U1_SCLK I/O Serial clock input/output for USART1 in synchronous mode. U2_TXD O Transmitter output for USART2. U2_RXD I Receiver input for USART2. U2_RTS O Request To Send output for USART2. U2_CTS I Clear To Send input for USART2. U2_SCLK I/O Serial clock input/output for USART2 in synchronous mode. SPI0_SCK I/O Serial clock for SPI0. SPI0_MOSI I/O Master Out Slave In for SPI0. SPI0_MISO I/O Master In Slave Out for SPI0. SPI0_SSEL I/O Slave select for SPI0. SPI1_SCK I/O Serial clock for SPI1. SPI1_MOSI I/O Master Out Slave In for SPI1. SPI1_MISO I/O Master In Slave Out for SPI1. SPI1_SSEL I/O Slave select for SPI1. CTIN_0 I SCT input 0. CTIN_1 I SCT input 1. CTIN_2 I SCT input 2. CTIN_3 I SCT input 3. CTOUT_0 O SCT output 0. CTOUT_1 O SCT output 1. CTOUT_2 O SCT output 2. CTOUT_3 O SCT output 3. I2C0_SCL I/O I2C-bus clock input/output (open-drain if assigned to pin PIO0_10). High-current sink only if assigned to PIO0_10 and if I2C Fast-mode Plus is selected in the I/O configuration register. I2C0_SDA I/O I2C-bus data input/output (open-drain if assigned to pin PIO0_11). High-current sink only if assigned to pin PIO0_11 and if I2C Fast-mode Plus is selected in the I/O configuration register. ACMP_O O Analog comparator digital output. CLKOUT O Clock output. GPIO_INT_BMAT O Output of the pattern match engine. Table 5. Movable functions (assign to pins PIO0_0 to PIO_17 through switch matrix) Function name Type Description LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 12 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Table 6. Pin location in ISP mode ISP entry pin USART RXD USART TXD Marking Boot loader version Package PIO0_1 PIO0_0 PIO0_4 1A v 13.1 TSSOP20; SO20; TSSOP16; DIP8; XSON16 PIO0_1 PIO0_0 PIO0_4 2A v 13.2 TSSOP20; SO20; TSSOP16; DIP8; XSON16 PIO0_1 PIO0_0 PIO0_4 4C and later v 13.4 and later DIP8 PIO0_12 PIO0_0 PIO0_4 4C and later v 13.4 and later TSSOP20; SO20; TSSOP16; XSON16 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 13 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 8. Functional description 8.1 ARM Cortex-M0+ core The ARM Cortex-M0+ core runs at an operating frequency of up to 30 MHz using a two-stage pipeline. Integrated in the core are the NVIC and Serial Wire Debug with four breakpoints and two watchpoints. The ARM Cortex-M0+ core supports a single-cycle I/O enabled port for fast GPIO access. The core includes a single-cycle multiplier and a system tick timer. 8.2 On-chip flash program memory The LPC81xM contain up to 16 kB of on-chip flash program memory. The flash memory supports a 64 Byte page size with page write and erase. 8.3 On-chip SRAM The LPC81xM contain a total of up to 4 kB on-chip static RAM data memory. 8.4 On-chip ROM The 8 kB on-chip ROM contains the boot loader and the following Application Programming Interfaces (API): • In-System Programming (ISP) and In-Application Programming (IAP) support for flash programming • Power profiles for configuring power consumption and PLL settings • USART driver API routines • I2C-bus driver API routines 8.5 Nested Vectored Interrupt Controller (NVIC) The Nested Vectored Interrupt Controller (NVIC) is an integral part of the Cortex-M0+. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 8.5.1 Features • Controls system exceptions and peripheral interrupts. • On the LPC81xM, the NVIC supports 32 vectored interrupts including up to 8 external interrupt inputs selectable from all GPIO pins. • Four programmable interrupt priority levels with hardware priority level masking. • Software interrupt generation using the ARM exceptions SVCall and PendSV. • Relocatable interrupt vector table using vector table offset register. 8.5.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 14 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Up to eight pins, regardless of the selected function, can be programmed to generate an interrupt on a level, a rising or falling edge, or both. The interrupt generating pins can be selected from all digital or mixed digital/analog pins. The pin interrupt/pattern match block controls the edge or level detection mechanism. 8.6 System tick timer The ARM Cortex-M0+ includes a 24-bit system tick timer (SysTick) that is intended to generate a dedicated SysTick exception at a fixed time interval (typically 10 ms). 8.7 Memory map The LPC81xM incorporates several distinct memory regions. Figure 7 shows the overall map of the entire address space from the user program viewpoint following reset. The interrupt vector area supports address remapping. The ARM private peripheral bus includes the ARM core registers for controlling the NVIC, the system tick timer (SysTick), and the reduced power modes. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 15 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 8.8 I/O configuration The IOCON block controls the configuration of the I/O pins. Each digital or mixed digital/analog pin with the PIO0_n designator (except the true open-drain pins PIO0_10 and PIO0_11) in Table 4 can be configured as follows: • Enable or disable the weak internal pull-up and pull-down resistors. • Select a pseudo open-drain mode. The input cannot be pulled up above VDD. This pin is not 5 V tolerant when VDD = 0. Fig 7. LPC81xM Memory map 􀀤􀀳􀀥􀀃􀁓􀁈􀁕􀁌􀁓􀁋􀁈􀁕􀁄􀁏􀁖 􀀓􀁛􀀗􀀓􀀓􀀓􀀃􀀗􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀓􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀓􀀃􀀦􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀔􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀔􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀕􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀕􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀖􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀖􀀃􀀦􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀗􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀗􀀃􀀗􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀗􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀗􀀃􀀦􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀘􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀘􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀘􀀃􀀦􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀙􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀙􀀃􀀗􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀛􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀕􀀃􀀗􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀔􀀃􀀦􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀔􀀃􀀗􀀓􀀓􀀓 􀀺􀀺􀀧􀀷 􀀓􀁛􀀗􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀰􀀵􀀷 􀀃􀁖􀁈􀁏􀁉􀀃􀁚􀁄􀁎􀁈􀀐􀁘􀁓􀀃􀁗􀁌􀁐􀁈􀁕 􀀳􀀰􀀸 􀀖􀀔􀀃􀀐􀀃􀀕􀀛􀀃􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁄􀁑􀁄􀁏􀁒􀁊􀀃􀁆􀁒􀁐􀁓􀁄􀁕􀁄􀁗􀁒􀁕 􀀓􀁛􀀗􀀓􀀓􀀕􀀃􀀦􀀓􀀓􀀓 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀀓􀁛􀀗􀀓􀀓􀀖􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀖􀀃􀀗􀀓􀀓􀀓 􀀓 􀀔 􀀕 􀀖 􀀗 􀀘 􀀙 􀀚 􀀛 􀀜 􀀔􀀙 􀀔􀀘 􀀔􀀗 􀀔􀀚 􀀔􀀛 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀀓􀀃􀀪􀀥 􀀓􀁛􀀓􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀀑􀀘􀀃􀀪􀀥 􀀗􀀃􀀪􀀥 􀀔􀀃􀀪􀀥 􀀓􀁛􀀔􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀔􀀩􀀩􀀩􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀔􀀩􀀩􀀩􀀃􀀕􀀓􀀓􀀓 􀀓􀁛􀀕􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀘􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀘􀀓􀀓􀀓􀀃􀀗􀀓􀀓􀀓 􀀓􀁛􀀩􀀩􀀩􀀩􀀃􀀩􀀩􀀩􀀩 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀀓􀁛􀀗􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀛􀀃􀀓􀀓􀀓􀀓 􀀤􀀳􀀥􀀃􀁓􀁈􀁕􀁌􀁓􀁋􀁈􀁕􀁄􀁏􀁖 􀀓􀁛􀀘􀀓􀀓􀀓􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀤􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀤􀀓􀀓􀀓􀀃􀀗􀀓􀀓􀀓 􀀦􀀵􀀦 􀀶􀀦􀀷􀁌􀁐􀁈􀁕􀀒􀀳􀀺􀀰 􀀪􀀳􀀬􀀲 􀀓􀁛􀀤􀀓􀀓􀀓􀀃􀀛􀀓􀀓􀀓 􀁓􀁌􀁑􀀃􀁌􀁑􀁗􀁈􀁕􀁕􀁘􀁓􀁗􀁖􀀒􀁓􀁄􀁗􀁗􀁈􀁕􀁑􀀃􀁐􀁄􀁗􀁆􀁋 􀀓􀁛􀀔􀀓􀀓􀀓􀀃􀀓􀀛􀀓􀀓 􀀕􀀃􀁎􀀥􀀃􀀃􀀶􀀵􀀤􀀰􀀃􀀋􀀯􀀳􀀦􀀛􀀔􀀔􀀌 􀀓􀁛􀀔􀀓􀀓􀀓􀀃􀀓􀀗􀀓􀀓 􀀔􀀃􀁎􀀥􀀃􀀃􀀶􀀵􀀤􀀰􀀃􀀋􀀯􀀳􀀦􀀛􀀔􀀓􀀌 􀀓􀁛􀀔􀀓􀀓􀀓􀀃􀀔􀀓􀀓􀀓 􀀗􀀃􀁎􀀥􀀃􀀃􀀶􀀵􀀤􀀰􀀃􀀋􀀯􀀳􀀦􀀛􀀔􀀕􀀌 􀀓􀁛􀀔􀀗􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀔􀀗􀀓􀀓􀀃􀀓􀀗􀀓􀀓 􀀔􀀃􀁎􀀥􀀃􀀰􀀷􀀥􀀃􀁕􀁈􀁊􀁌􀁖􀁗􀁈􀁕􀁖 􀀯􀀳􀀦􀀛􀀔􀁛􀀰 􀀓􀁛􀀓􀀓􀀓􀀓􀀃􀀗􀀓􀀓􀀓 􀀔􀀙􀀃􀁎􀀥􀀃􀁒􀁑􀀐􀁆􀁋􀁌􀁓􀀃􀁉􀁏􀁄􀁖􀁋􀀃􀀋􀀯􀀳􀀦􀀛􀀔􀀕􀀌 􀀓􀁛􀀓􀀓􀀓􀀓􀀃􀀕􀀓􀀓􀀓 􀀛􀀃􀁎􀀥􀀃􀁒􀁑􀀐􀁆􀁋􀁌􀁓􀀃􀁉􀁏􀁄􀁖􀁋􀀃􀀋􀀯􀀳􀀦􀀛􀀔􀀔􀀌 􀀓􀁛􀀓􀀓􀀓􀀓􀀃􀀔􀀓􀀓􀀓 􀀗􀀃􀁎􀀥􀀃􀁒􀁑􀀐􀁆􀁋􀁌􀁓􀀃􀁉􀁏􀁄􀁖􀁋􀀃􀀋􀀯􀀳􀀦􀀛􀀔􀀓􀀌 􀀛􀀃􀁎􀀥􀀃􀁅􀁒􀁒􀁗􀀃􀀵􀀲􀀰 􀀓􀁛􀀓􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀓􀀓􀀓􀀓􀀃􀀓􀀓􀀦􀀓 􀁄􀁆􀁗􀁌􀁙􀁈􀀃􀁌􀁑􀁗􀁈􀁕􀁕􀁘􀁓􀁗􀀃􀁙􀁈􀁆􀁗􀁒􀁕􀁖 􀁄􀁄􀁄􀀐􀀓􀀓􀀘􀀚􀀗􀀛 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁉􀁏􀁄􀁖􀁋􀀃􀁆􀁒􀁑􀁗􀁕􀁒􀁏􀁏􀁈􀁕 􀀶􀀳􀀬􀀓 􀁖􀁚􀁌􀁗􀁆􀁋􀀃􀁐􀁄􀁗􀁕􀁌􀁛 􀀬􀀲􀀦􀀲􀀱 􀀶􀀼􀀶􀀦􀀲􀀱 􀀓􀁛􀀗􀀓􀀓􀀘􀀃􀀗􀀓􀀓􀀓 􀀔􀀜 􀀕􀀕 􀀕􀀖 􀀶􀀳􀀬􀀔 􀀸􀀶􀀤􀀵􀀷􀀓 􀀸􀀶􀀤􀀵􀀷􀀔 􀀓􀁛􀀗􀀓􀀓􀀙􀀃􀀛􀀓􀀓􀀓 􀀓􀁛􀀗􀀓􀀓􀀙􀀃􀀦􀀓􀀓􀀓 􀀸􀀶􀀤􀀵􀀷􀀕 􀀓􀁛􀀗􀀓􀀓􀀚􀀃􀀓􀀓􀀓􀀓 􀀕􀀗 􀀓􀁛􀀨􀀓􀀓􀀓􀀃􀀓􀀓􀀓􀀓 􀀓􀁛􀀨􀀓􀀔􀀓􀀃􀀓􀀓􀀓􀀓 􀁓􀁕􀁌􀁙􀁄􀁗􀁈􀀃􀁓􀁈􀁕􀁌􀁓􀁋􀁈􀁕􀁄􀁏􀀃􀁅􀁘􀁖 􀀕􀀓 􀀬􀀕􀀦 􀀕􀀔 􀀕􀀘 􀀕􀀙 􀀕􀀚 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀁕􀁈􀁖􀁈􀁕􀁙􀁈􀁇 􀀔􀀓 􀀔􀀔 􀀔􀀕 􀀔􀀖 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 16 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller • Program the input glitch filter with different filter constants using one of the IOCON divided clock signals (IOCONCLKCDIV, see Figure 10 “LPC81xM clock generation”). You can also bypass the glitch filter. • Invert the input signal. • Hysteresis can be enabled or disabled. • For pins PIO0_10 and PIO0_11, select the I2C-mode and output driver for standard digital operation, for I2C standard and fast modes, or for I2C Fast mode+. • On mixed digital/analog pins, enable the analog input mode. Enabling the analog mode disconnects the digital functionality. Remark: The functionality of each I/O pin is flexible and is determined entirely through the switch matrix. See Section 8.9 for details. 8.8.1 Standard I/O pad configuration Figure 8 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver with configurable open-drain output • Digital input: Weak pull-up resistor (PMOS device) enabled/disabled • Digital input: Weak pull-down resistor (NMOS device) enabled/disabled • Digital input: Repeater mode enabled/disabled • Digital input: Input glitch filter selectable on all pins • Analog input LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 17 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 8.9 Switch Matrix (SWM) The switch matrix controls the function of each digital or mixed analog/digital pin in a highly flexible way by allowing to connect many functions like the USART, SPI, SCT, and I2C functions to any pin that is not power or ground. These functions are called movable functions and are listed in Table 5. Functions that need specialized pads like the oscillator pins XTALIN and XTALOUT can be enabled or disabled through the switch matrix. These functions are called fixed-pin functions and cannot move to other pins. The fixed-pin functions are listed in Table 4. If a fixed-pin function is disabled, any other movable function can be assigned to this pin. 8.10 Fast General-Purpose parallel I/O (GPIO) Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Multiple outputs can be set or cleared in one write operation. LPC81xM use accelerated GPIO functions: • GPIO registers are located on the ARM Cortex M0+ IO bus for fastest possible single-cycle I/O timing, allowing GPIO toggling with rates of up to 15 MHz. Fig 8. Standard I/O pad configuration 􀀳􀀬􀀱 􀀹􀀧􀀧 􀀹􀀧􀀧 􀀨􀀶􀀧 􀀹􀀶􀀶 􀀨􀀶􀀧 􀁖􀁗􀁕􀁒􀁑􀁊 􀁓􀁘􀁏􀁏􀀐􀁘􀁓 􀁖􀁗􀁕􀁒􀁑􀁊 􀁓􀁘􀁏􀁏􀀐􀁇􀁒􀁚􀁑 􀀹􀀧􀀧 􀁚􀁈􀁄􀁎 􀁓􀁘􀁏􀁏􀀐􀁘􀁓 􀁚􀁈􀁄􀁎 􀁓􀁘􀁏􀁏􀀐􀁇􀁒􀁚􀁑 􀁒􀁓􀁈􀁑􀀐􀁇􀁕􀁄􀁌􀁑􀀃􀁈􀁑􀁄􀁅􀁏􀁈 􀁒􀁘􀁗􀁓􀁘􀁗􀀃􀁈􀁑􀁄􀁅􀁏􀁈 􀁕􀁈􀁓􀁈􀁄􀁗􀁈􀁕􀀃􀁐􀁒􀁇􀁈 􀁈􀁑􀁄􀁅􀁏􀁈 􀁓􀁘􀁏􀁏􀀐􀁘􀁓􀀃􀁈􀁑􀁄􀁅􀁏􀁈 􀁓􀁘􀁏􀁏􀀐􀁇􀁒􀁚􀁑􀀃􀁈􀁑􀁄􀁅􀁏􀁈 􀁖􀁈􀁏􀁈􀁆􀁗􀀃􀁇􀁄􀁗􀁄 􀁌􀁑􀁙􀁈􀁕􀁗􀁈􀁕 􀁇􀁄􀁗􀁄􀀃􀁒􀁘􀁗􀁓􀁘􀁗 􀁇􀁄􀁗􀁄􀀃􀁌􀁑􀁓􀁘􀁗 􀁖􀁈􀁏􀁈􀁆􀁗􀀃􀁊􀁏􀁌􀁗􀁆􀁋 􀁉􀁌􀁏􀁗􀁈􀁕 􀁄􀁑􀁄􀁏􀁒􀁊􀀃􀁌􀁑􀁓􀁘􀁗 􀁖􀁈􀁏􀁈􀁆􀁗􀀃􀁄􀁑􀁄􀁏􀁒􀁊􀀃􀁌􀁑􀁓􀁘􀁗 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀖􀀚􀀚 􀁓􀁌􀁑􀀃􀁆􀁒􀁑􀁉􀁌􀁊􀁘􀁕􀁈􀁇 􀁄􀁖􀀃􀁇􀁌􀁊􀁌􀁗􀁄􀁏􀀃􀁒􀁘􀁗􀁓􀁘􀁗 􀁇􀁕􀁌􀁙􀁈􀁕 􀁓􀁌􀁑􀀃􀁆􀁒􀁑􀁉􀁌􀁊􀁘􀁕􀁈􀁇 􀁄􀁖􀀃􀁇􀁌􀁊􀁌􀁗􀁄􀁏􀀃􀁌􀁑􀁓􀁘􀁗 􀁓􀁌􀁑􀀃􀁆􀁒􀁑􀁉􀁌􀁊􀁘􀁕􀁈􀁇 􀁄􀁖􀀃􀁄􀁑􀁄􀁏􀁒􀁊􀀃􀁌􀁑􀁓􀁘􀁗 􀀳􀀵􀀲􀀪􀀵􀀤􀀰􀀰􀀤􀀥􀀯􀀨 􀀪􀀯􀀬􀀷􀀦􀀫􀀃􀀩􀀬􀀯􀀷􀀨􀀵 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 18 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller • An entire port value can be written in one instruction. • Mask, set, and clear operations are supported for the entire port. All GPIO port pins are fixed-pin functions that are enabled or disabled on the pins by the switch matrix. Therefore each GPIO port pin is assigned to one specific pin and cannot be moved to another pin. Except for pins SWDIO/PIO0_2, SWCLK/PIO0_3, and RESET/PIO0_5, the switch matrix enables the GPIO port pin function by default. 8.10.1 Features • Bit level port registers allow a single instruction to set and clear any number of bits in one write operation. • Direction control of individual bits. • All I/O default to inputs with internal pull-up resistors enabled after reset - except for the I2C-bus true open-drain pins PIO0_2 and PIO0_3. • Pull-up/pull-down configuration, repeater, and open-drain modes can be programmed through the IOCON block for each GPIO pin (see Figure 8). • 8.11 Pin interrupt/pattern match engine The pin interrupt block configures up to eight pins from all digital pins for providing eight external interrupts connected to the NVIC. The pattern match engine can be used, in conjunction with software, to create complex state machines based on pin inputs. Any digital pin, independently of the function selected through the switch matrix, can be configured through the SYSCON block as input to the pin interrupt or pattern match engine. The registers that control the pin interrupt or pattern match engine are located on the IO+ bus for fast single-cycle access. 8.11.1 Features • Pin interrupts – Up to eight pins can be selected from all digital pins as edge- or level-sensitive interrupt requests. Each request creates a separate interrupt in the NVIC. – Edge-sensitive interrupt pins can interrupt on rising or falling edges or both. – Level-sensitive interrupt pins can be HIGH- or LOW-active. – Pin interrupts can wake up the LPC81xM from sleep mode, deep-sleep mode, and power-down mode. • Pin interrupt pattern match engine – Up to eight pins can be selected from all digital pins to contribute to a boolean expression. The boolean expression consists of specified levels and/or transitions on various combinations of these pins. – Each minterm (product term) comprising the specified boolean expression can generate its own, dedicated interrupt request. – Any occurrence of a pattern match can be programmed to also generate an RXEV notification to the ARM CPU. The RXEV signal can be connected to a pin. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 19 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller – The pattern match engine does not facilitate wake-up. 8.12 USART0/1/2 Remark: USART0 and USART1 are available on all LPC800 parts. USART2 is available on parts LPC812M101JDH16 and LPC812M101JDH20 only. All USART functions are movable functions and are assigned to pins through the switch matrix. 8.12.1 Features • Maximum bit rates of 1.875 Mbit/s in asynchronous mode and 10 Mbit/s in synchronous mode for USART functions connected to all digital pins except PIO0_10 and PIO0_11. • 7, 8, or 9 data bits and 1 or 2 stop bits • Synchronous mode with master or slave operation. Includes data phase selection and continuous clock option. • Multiprocessor/multidrop (9-bit) mode with software address compare. (RS-485 possible with software address detection and transceiver direction control.) • Parity generation and checking: odd, even, or none. • One transmit and one receive data buffer. • RTS/CTS for hardware signaling for automatic flow control. Software flow control can be performed using Delta CTS detect, Transmit Disable control, and any GPIO as an RTS output. • Received data and status can optionally be read from a single register • Break generation and detection. • Receive data is 2 of 3 sample "voting". Status flag set when one sample differs. • Built-in Baud Rate Generator. • A fractional rate divider is shared among all UARTs. • Interrupts available for Receiver Ready, Transmitter Ready, Receiver Idle, change in receiver break detect, Framing error, Parity error, Overrun, Underrun, Delta CTS detect, and receiver sample noise detected. • Separate data and flow control loopback modes for testing. • Supported by on-chip ROM API. 8.13 SPI0/1 Remark: SPI0 is available on all LPC800 parts. SPI1 is available on parts LPC812M101JDH16 and LPC812M101JDH20 only. All SPI functions are movable functions and are assigned to pins through the switch matrix. 8.13.1 Features • Maximum data rates of 30 Mbit/s in master mode and 25 Mbit/s in slave mode for SPI functions connected to all digital pins except PIO0_10 and PIO0_11. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 20 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller • Data frames of 1 to 16 bits supported directly. Larger frames supported by software. • Master and slave operation. • Data can be transmitted to a slave without the need to read incoming data. This can be useful while setting up an SPI memory. • Control information can optionally be written along with data. This allows very versatile operation, including “any length” frames. • One Slave Select input/output with selectable polarity and flexible usage. Remark: Texas Instruments SSI and National Microwire modes are not supported. 8.14 I2C-bus interface The I2C-bus is bidirectional for inter-IC control using only two wires: a serial clock line (SCL) and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. The I2C-bus functions are movable functions and can be assigned through the switch matrix to any pin. However, only the true open-drain PIO0_10 and PIO0_11 provide the electrical characteristics to support the full I2C-bus specification (see Ref. 1). 8.14.1 Features • Supports standard and fast mode with data rates of up to 400 kbit/s. • Independent Master, Slave, and Monitor functions. • Supports both Multi-master and Multi-master with Slave functions. • Multiple I2C slave addresses supported in hardware. • One slave address can be selectively qualified with a bit mask or an address range in order to respond to multiple I2C bus addresses. • 10-bit addressing supported with software assist. • Supports SMBus. • Supported by on-chip ROM API. • If the I2C functions are connected to the true open-drain pins (PIO0_10 and PIO0_11), the I2C supports the full I2C-bus specification: – Fail-safe operation: When the power to an I2C-bus device is switched off, the SDA and SCL pins connected to the I2C-bus are floating and do not disturb the bus. – Supports Fast-mode Plus with bit rates up to 1 Mbit/s. 8.15 State-Configurable Timer/PWM (SCTimer/PWM) The state configurable timer (SCTimer/PWM or SCT) can perform basic 16-bit and 32-bit timer/counter functions with match outputs and external and internal capture inputs. In addition, the SCTimer/PWM can employ up to two different programmable states, which can change under the control of events, to provide complex timing patterns. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 21 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller All inputs and outputs of the SCTimer/PWM are movable functions and are assigned to pins through the switch matrix. 8.15.1 Features • Two 16-bit counters or one 32-bit counter. • Counters clocked by bus clock or selected input. • Up counters or up-down counters. • State variable allows sequencing across multiple counter cycles. • The following conditions define an event: a counter match condition, an input (or output) condition, a combination of a match and/or and input/output condition in a specified state, and the count direction. • Events control outputs, interrupts, and the SCT states. – Match register 0 can be used as an automatic limit. – In bi-directional mode, events can be enabled based on the count direction. – Match events can be held until another qualifying event occurs. • Selected events can limit, halt, start, or stop a counter. • Supports: – 4 inputs – 4 outputs – 5 match/capture registers – 6 events – 2 states 8.16 Multi-Rate Timer (MRT) The Multi-Rate Timer (MRT) provides a repetitive interrupt timer with four channels. Each channel can be programmed with an independent time interval, and each channel operates independently from the other channels. 8.16.1 Features • 31-bit interrupt timer • Four channels independently counting down from individually set values • Bus stall, repeat and one-shot interrupt modes 8.17 Windowed WatchDog Timer (WWDT) The watchdog timer resets the controller if software fails to periodically service it within a programmable time window. 8.17.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period. • Optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 22 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller • Optional warning interrupt can be generated at a programmable time prior to watchdog time-out. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect feed sequence causes reset or interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 24-bit timer with internal prescaler. • Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  224  4) in multiples of Tcy(WDCLK)  4. • The Watchdog Clock (WDCLK)is generated by a the dedicated watchdog oscillator (WDOSC). 8.18 Self Wake-up Timer (WKT) The self wake-up timer is a 32-bit, loadable down-counter. Writing any non-zero value to this timer automatically enables the counter and launches a count-down sequence. When the counter is used as a wake-up timer, this write can occur just prior to entering a reduced power mode. 8.18.1 Features • 32-bit loadable down-counter. Counter starts automatically when a count value is loaded. Time-out generates an interrupt/wake up request. • The WKT resides in a separate, always-on power domain. • The WKT supports two clock sources: the low-power oscillator and the IRC. The low-power oscillator is located in the always-on power domain, so it can be used as the clock source in Deep power-down mode. • The WKT can be used for waking up the part from any reduced power mode, including Deep power-down mode, or for general-purpose timing. 8.19 Analog comparator (ACMP) The analog comparator with selectable hysteresis can compare voltage levels on external pins and internal voltages. After power-up and after switching the input channels of the comparator, the output of the voltage ladder must be allowed to settle to its stable value before it can be used as a comparator reference input. Settling times are given in Table 22. The analog comparator output is a movable function and is assigned to a pin through the switch matrix. The comparator inputs and the voltage reference are enabled or disabled on pins PIO0_0 and PIO0_1 through the switch matrix. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 23 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 8.19.1 Features • Selectable 0 mV, 10 mV ( 5 mV), and 20 mV ( 10 mV), 40 mV ( 20 mV) input hysteresis. • Two selectable external voltages (VDD or VDDCMP on pin PIO0_6); fully configurable on either positive or negative input channel. • Internal voltage reference from band gap selectable on either positive or negative input channel. • 32-stage voltage ladder with the internal reference voltage selectable on either the positive or the negative input channel. • Voltage ladder source voltage is selectable from an external pin or the main 3.3 V supply voltage rail. • Voltage ladder can be separately powered down for applications only requiring the comparator function. • Interrupt output is connected to NVIC. • Comparator level output is connected to output pin ACMP_O. • The comparator output can be routed internally to the SCT input through the switch matrix. Fig 9. Comparator block diagram 􀀕 􀀖􀀕 􀀕 􀀤􀀦􀀰􀀳􀁂􀀬􀀾􀀕􀀝􀀔􀁀 􀀹􀀧􀀧 􀀹􀀧􀀧􀀦􀀰􀀳 􀁌􀁑􀁗􀁈􀁕􀁑􀁄􀁏 􀁙􀁒􀁏􀁗􀁄􀁊􀁈 􀁕􀁈􀁉􀁈􀁕􀁈􀁑􀁆􀁈 􀁈􀁇􀁊􀁈􀀃􀁇􀁈􀁗􀁈􀁆􀁗 􀁖􀁜􀁑􀁆 􀁆􀁒􀁐􀁓􀁄􀁕􀁄􀁗􀁒􀁕 􀁏􀁈􀁙􀁈􀁏􀀃􀀤􀀦􀀰􀀳􀁂􀀲 􀁆􀁒􀁐􀁓􀁄􀁕􀁄􀁗􀁒􀁕 􀁈􀁇􀁊􀁈􀀃􀀱􀀹􀀬􀀦 􀀦􀀲􀀰􀀳􀀤􀀵􀀤􀀷􀀲􀀵􀀃􀀤􀀱􀀤􀀯􀀲􀀪􀀃􀀥􀀯􀀲􀀦􀀮 􀀦􀀲􀀰􀀳􀀤􀀵􀀤􀀷􀀲􀀵􀀃􀀧􀀬􀀪􀀬􀀷􀀤􀀯􀀃􀀥􀀯􀀲􀀦􀀮 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀘􀀓􀀛 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 24 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 8.20 Clocking and power control 8.20.1 Crystal and internal oscillators The LPC81xM include four independent oscillators: 1. The crystal oscillator (SysOsc) operating at frequencies between 1 MHz and 25 MHz. 2. The internal RC Oscillator (IRC) with a fixed frequency of 12 MHz, trimmed to 1% accuracy. 3. The internal low-power, low-frequency Oscillator with a nominal frequency of 10 kHz with 40% accuracy for use with the self wake-up timer. 4. The dedicated Watchdog Oscillator (WDOsc) with a programmable nominal frequency between 9.4 kHz and 2.3 MHz with 40% accuracy. Fig 10. LPC81xM clock generation 􀀶􀀼􀀶􀀷􀀨􀀰􀀃􀀃􀀳􀀯􀀯 􀁚􀁄􀁗􀁆􀁋􀁇􀁒􀁊􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀀬􀀵􀀦􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀀬􀀵􀀦􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀁚􀁄􀁗􀁆􀁋􀁇􀁒􀁊􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀀶􀀼􀀶􀀷􀀨􀀰 􀀲􀀶􀀦􀀬􀀯􀀯􀀤􀀷􀀲􀀵 􀀰􀀤􀀬􀀱􀀦􀀯􀀮􀀶􀀨􀀯 􀀋􀁐􀁄􀁌􀁑􀀃􀁆􀁏􀁒􀁆􀁎􀀃􀁖􀁈􀁏􀁈􀁆􀁗􀀌 􀀶􀀼􀀶􀀳􀀯􀀯􀀦􀀯􀀮􀀶􀀨􀀯 􀁖􀁜􀁖􀁗􀁈􀁐􀀃􀀳􀀯􀀯􀀃􀁆􀁏􀁒􀁆􀁎􀀃􀁖􀁈􀁏􀁈􀁆􀁗 􀀦􀀯􀀲􀀦􀀮􀀃􀀧􀀬􀀹􀀬􀀧􀀨􀀵 􀀶􀀼􀀶􀀤􀀫􀀥􀀦􀀯􀀮􀀧􀀬􀀹 􀀤􀀫􀀥􀀃􀁆􀁏􀁒􀁆􀁎􀀃􀀓 􀀋􀁆􀁒􀁕􀁈􀀏􀀃􀁖􀁜􀁖􀁗􀁈􀁐􀀞􀀃 􀁄􀁏􀁚􀁄􀁜􀁖􀀐􀁒􀁑􀀌 􀀦􀀯􀀲􀀦􀀮􀀃􀀧􀀬􀀹􀀬􀀧􀀨􀀵 􀀸􀀤􀀵􀀷􀀦􀀯􀀮􀀧􀀬􀀹 􀀸􀀶􀀤􀀵􀀷􀀓 􀀸􀀶􀀤􀀵􀀷􀀔 􀀸􀀶􀀤􀀵􀀷􀀕 􀀺􀀺􀀧􀀷 􀀬􀀵􀀦􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀀺􀀮􀀷 􀁏􀁒􀁚􀀐􀁓􀁒􀁚􀁈􀁕􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀀺􀀮􀀷 􀁚􀁄􀁗􀁆􀁋􀁇􀁒􀁊􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀀬􀀵􀀦􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀁖􀁜􀁖􀁗􀁈􀁐􀀃􀁒􀁖􀁆􀁌􀁏􀁏􀁄􀁗􀁒􀁕 􀀦􀀯􀀲􀀦􀀮􀀃􀀧􀀬􀀹􀀬􀀧􀀨􀀵 􀀦􀀯􀀮􀀲􀀸􀀷􀀧􀀬􀀹 􀀦􀀯􀀮􀀲􀀸􀀷􀀃􀁓􀁌􀁑 􀀦􀀯􀀮􀀲􀀸􀀷􀀶􀀨􀀯 􀀋􀀦􀀯􀀮􀀲􀀸􀀷􀀃􀁆􀁏􀁒􀁆􀁎􀀃􀁖􀁈􀁏􀁈􀁆􀁗􀀌 􀁐􀁄􀁌􀁑􀀃􀁆􀁏􀁒􀁆􀁎 􀁖􀁜􀁖􀁗􀁈􀁐􀀃􀁆􀁏􀁒􀁆􀁎 􀀶􀀼􀀶􀀤􀀫􀀥􀀦􀀯􀀮􀀦􀀷􀀵􀀯􀀾􀀔􀀝􀀔􀀜􀁀 􀀋􀁖􀁜􀁖􀁗􀁈􀁐􀀃􀁆􀁏􀁒􀁆􀁎􀀃􀁈􀁑􀁄􀁅􀁏􀁈􀀌 􀁐􀁈􀁐􀁒􀁕􀁌􀁈􀁖 􀁄􀁑􀁇􀀃􀁓􀁈􀁕􀁌􀁓􀁋􀁈􀁕􀁄􀁏􀁖􀀏 􀁓􀁈􀁕􀁌􀁓􀁋􀁈􀁕􀁄􀁏􀀃􀁆􀁏􀁒􀁆􀁎􀁖 􀀔􀀜 􀁄􀁄􀁄􀀐􀀓􀀓􀀘􀀚􀀗􀀜 􀀬􀀲􀀦􀀲􀀱􀀦􀀯􀀮􀀧􀀬􀀹 􀀦􀀯􀀲􀀦􀀮􀀃􀀧􀀬􀀹􀀬􀀧􀀨􀀵 􀀬􀀲􀀦􀀲􀀱􀀃 􀁊􀁏􀁌􀁗􀁆􀁋􀀃􀁉􀁌􀁏􀁗􀁈􀁕 􀀚 􀀻􀀷􀀤􀀯􀀬􀀱 􀀦􀀯􀀮􀀬􀀱 􀀻􀀷􀀤􀀯􀀲􀀸􀀷 􀀶􀀼􀀶􀀦􀀲􀀱 􀀳􀀰􀀸 􀀩􀀵􀀤􀀦􀀷􀀬􀀲􀀱􀀤􀀯􀀃􀀵􀀤􀀷􀀨 􀀪􀀨􀀱􀀨􀀵􀀤􀀷􀀲􀀵 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 25 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Each oscillator, except the low-frequency oscillator, can be used for more than one purpose as required in a particular application. Following reset, the LPC81xM will operate from the IRC until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency. See Figure 10 for an overview of the LPC81xM clock generation. 8.20.1.1 Internal RC Oscillator (IRC) The IRC may be used as the clock source for the WWDT, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1.5 % accuracy over the entire voltage and temperature range. The IRC can be used as a clock source for the CPU with or without using the PLL. The IRC frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the system PLL. Upon power-up or any chip reset, the LPC81xM use the IRC as the clock source. Software may later switch to one of the other available clock sources. 8.20.1.2 Crystal Oscillator (SysOsc) The crystal oscillator can be used as the clock source for the CPU, with or without using the PLL. The SysOsc operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the system PLL. 8.20.1.3 Internal Low-power Oscillator and Watchdog Oscillator (WDOsc) The nominal frequency of the WDOsc is programmable between 9.4 kHz and 2.3 MHz. The frequency spread over silicon process variations is  40%. The WDOsc is a dedicated oscillator for the windowed WWDT. The internal low-power 10 kHz (  40% accuracy) oscillator serves a the clock input to the WKT. This oscillator can be configured to run in all low power modes. 8.20.2 Clock input An external clock source can be supplied on the selected CLKIN pin. When selecting a clock signal for the CLKIN pin, follow the specifications for digital I/O pins in Table 9 “Static characteristics” and Table 15 “Dynamic characteristics: I/O pins[1]”. An 1.8 V external clock source can be supplied on the XTALIN pins to the system oscillator limiting the voltage of this signal ((see Section 14.2). The maximum frequency for both clock signals is 25 MHz. 8.20.3 System PLL The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 26 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source. The PLL settling time is nominally 100 s. 8.20.4 Clock output The LPC81xM features a clock output function that routes the IRC, the SysOsc, the watchdog oscillator, or the main clock to the CLKOUT function. The CLKOUT function can be connected to any digital pin through the switch matrix. 8.20.5 Wake-up process The LPC81xM begin operation at power-up by using the IRC as the clock source. This allows chip operation to resume quickly. If the SysOsc, the external clock source, or the PLL is needed by the application, software must enable these features and wait for them to stabilize before they are used as a clock source. 8.20.6 Power control The LPC81xM supports the ARM Cortex-M0 Sleep mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, a register is provided for shutting down the clocks to individual on-chip peripherals, allowing to fine-tune power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Selected peripherals have their own clock divider which provides even better power control. 8.20.6.1 Power profiles The power consumption in Active and Sleep modes can be optimized for the application through simple calls to the power profile API. The API is accessible through the on-chip ROM. The power configuration routine configures the LPC81xM for one of the following power modes: • Default mode corresponding to power configuration after reset. • CPU performance mode corresponding to optimized processing capability. • Efficiency mode corresponding to optimized balance of current consumption and CPU performance. • Low-current mode corresponding to lowest power consumption. In addition, the power profile includes routines to select the optimal PLL settings for a given system clock and PLL input clock. 8.20.6.2 Sleep mode When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep mode does not need any special sequence but re-enabling the clock to the ARM core. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 27 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller In Sleep mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Sleep mode and may generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. 8.20.6.3 Deep-sleep mode In Deep-sleep mode, the LPC81xM is in Sleep-mode and all peripheral clocks and all clock sources are off except for the IRC and watchdog oscillator or low-power oscillator if selected. The IRC output is disabled. In addition all analog blocks are shut down and the flash is in stand-by mode. In Deep-sleep mode, the application can keep the watchdog oscillator and the BOD circuit running for self-timed wake-up and BOD protection. The LPC81xM can wake up from Deep-sleep mode via a reset, digital pins selected as inputs to the pin interrupt block, a watchdog timer interrupt, or an interrupt from the USART (if the USART is configured in synchronous slave mode), the SPI, or the I2C blocks (in slave mode). Any interrupt used for waking up from Deep-sleep mode must be enabled in one of the SYSCON wake-up enable registers and the NVIC. Deep-sleep mode saves power and allows for short wake-up times. 8.20.6.4 Power-down mode In Power-down mode, the LPC81xM is in Sleep-mode and all peripheral clocks and all clock sources are off except for watchdog oscillator or low-power oscillator if selected. In addition all analog blocks and the flash are shut down. In Power-down mode, the application can keep the watchdog oscillator and the BOD circuit running for self-timed wake-up and BOD protection. The LPC81xM can wake up from Power-down mode via a reset, digital pins selected as inputs to the pin interrupt block, a watchdog timer interrupt, or an interrupt from the USART (if the USART is configured in synchronous slave mode), the SPI, or the I2C blocks (in slave mode). Any interrupt used for waking up from Power-down mode must be enabled in one of the SYSCON wake-up enable registers and the NVIC. Power-down mode reduces power consumption compared to Deep-sleep mode at the expense of longer wake-up times. 8.20.6.5 Deep power-down mode In Deep power-down mode, power is shut off to the entire chip except for the WAKEUP pin and the self wake-up timer if enabled. Four general-purpose registers are available to store information during Deep power-down mode. The LPC81xM can wake up from Deep power-down mode via the WAKEUP pin, or without an external signal by using the time-out of the self wake-up timer (see Section 8.18). The LPC81xM can be prevented from entering Deep power-down mode by setting a lock bit in the PMU block. Locking out Deep power-down mode enables the application to keep the watchdog timer or the BOD running at all times. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 28 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller When entering Deep power-down mode, an external pull-up resistor is required on the WAKEUP pin to hold it HIGH. Pull the RESET pin HIGH to prevent it from floating while in Deep power-down mode. 8.21 System control 8.21.1 Reset Reset has four sources on the LPC81xM: the RESET pin, the Watchdog reset, power-on reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip reset by any source, once the operating voltage attains a usable level, starts the IRC and initializes the flash controller. A LOW-going pulse as short as 50 ns resets the part. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the boot block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. In Deep power-down mode, an external pull-up resistor is required on the RESET pin. 8.21.2 Brownout detection The LPC81xM includes up to four levels for monitoring the voltage on the VDD pin. If this voltage falls below one of the selected levels, the BOD asserts an interrupt signal to the NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the NVIC to cause a CPU interrupt. Alternatively, software can monitor the signal by reading a dedicated status register. Four threshold levels can be selected to cause a forced reset of the chip. Fig 11. Reset pad configuration 􀀹􀀶􀀶 􀁕􀁈􀁖􀁈􀁗 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀔􀀖 􀀹􀀧􀀧 􀀹􀀧􀀧 􀀹􀀧􀀧 􀀵􀁓􀁘 􀀨􀀶􀀧 􀀨􀀶􀀧 􀀕􀀓􀀃􀁑􀁖􀀃􀀵􀀦 􀀪􀀯􀀬􀀷􀀦􀀫􀀃􀀩􀀬􀀯􀀷􀀨􀀵 􀀳􀀬􀀱 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 29 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 8.21.3 Code security (Code Read Protection - CRP) CRP provides different levels of security in the system so that access to the on-chip flash and use of the Serial Wire Debugger (SWD) and In-System Programming (ISP) can be restricted. Programming a specific pattern into a dedicated flash location invokes CRP. IAP commands are not affected by the CRP. In addition, ISP entry via the ISP entry pin can be disabled without enabling CRP. For details, see the LPC800 user manual. There are three levels of Code Read Protection: 1. CRP1 disables access to the chip via the SWD and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors cannot be erased. 2. CRP2 disables access to the chip via the SWD and only allows full flash erase and update using a reduced set of the ISP commands. 3. Running an application with level CRP3 selected, fully disables any access to the chip via the SWD pins and the ISP. This mode effectively disables ISP override using the ISP entry pin as well. If necessary, the application must provide a flash update mechanism using IAP calls or using a call to the reinvoke ISP command to enable flash update via the USART. In addition to the three CRP levels, sampling of the ISP entry pin for valid user code can be disabled. For details, see the LPC800 user manual. 8.21.4 APB interface The APB peripherals are located on one APB bus. 8.21.5 AHBLite The AHBLite connects the CPU bus of the ARM Cortex-M0+ to the flash memory, the main static RAM, the CRC, and the ROM. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 30 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 8.22 Emulation and debugging Debug functions are integrated into the ARM Cortex-M0+. Serial wire debug functions are supported in addition to a standard JTAG boundary scan. The ARM Cortex-M0+ is configured to support up to four breakpoints and two watch points. The Micro Trace Buffer is implemented on the LPC81xM. The RESET pin selects between the JTAG boundary scan (RESET = LOW) and the ARM SWD debug (RESET = HIGH). The ARM SWD debug port is disabled while the LPC81xM is in reset. The JTAG boundary scan pins are selected by hardware when the part is in boundary scan mode on pins PIO0_0 to PIO0_3 (see Table 4). To perform boundary scan testing, follow these steps: 1. Erase any user code residing in flash. 2. Power up the part with the RESET pin pulled HIGH externally. 3. Wait for at least 250 s. 4. Pull the RESET pin LOW externally. 5. Perform boundary scan operations. 6. Once the boundary scan operations are completed, assert the TRST pin to enable the SWD debug mode, and release the RESET pin (pull HIGH). Remark: The JTAG interface cannot be used for debug purposes. Fig 12. Connecting the SWD pins to a standard SWD connector 􀀵􀀨􀀶􀀨􀀷 􀀶􀀺􀀧􀀬􀀲 􀀶􀀺􀀦􀀯􀀮 􀀹􀀧􀀧 􀀯􀀳􀀦􀀛􀀓􀀓 􀀬􀀶􀀳􀀃􀁈􀁑􀁗􀁕􀁜 􀀳􀀬􀀲􀀓􀁂􀀔􀀕􀀃 􀀃􀀃 􀀹􀀷􀀵􀀨􀀩 􀀶􀀺􀀧􀀬􀀲 􀀶􀀺􀀦􀀯􀀮 􀁑􀀵􀀨􀀶􀀨􀀷 􀀪􀀱􀀧 􀁄􀁄􀁄􀀐􀀓􀀓􀀙􀀓􀀛􀀙 􀁉􀁕􀁒􀁐􀀃􀀶􀀺􀀧 􀁆􀁒􀁑􀁑􀁈􀁆􀁗􀁒􀁕 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 31 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 9. Limiting values [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. c) The limiting values are stress ratings only. Operating the part at these values is not recommended and proper operation is not guaranteed. The conditions for functional operation are specified in Table 9. [2] Maximum/minimum voltage above the maximum operating voltage (see Table 9) and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device. [3] Including voltage on outputs in tri-state mode. Does not apply to pin PIO0_6. [4] VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down. [5] VDD present or not present. [6] If the comparator is configured with the common mode input VIC = VDD, the other comparator input can be up to 0.2 V above or below VDD without affecting the hysteresis range of the comparator function. [7] It is recommended to connect an overvoltage protection diode between the analog input pin and the voltage supply pin. [8] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details. [9] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD supply voltage (core and external rail) [2] 0.5 +4.6 V VI input voltage 5 V tolerant I/O pins; VDD  1.8 V [3] 0.5 +5.5 V 5 V tolerant open-drain pins PIO0_10 and PIO0_11 [4] 0.5 +5.5 V 3 V tolerant I/O pin PIO0_6 [5] 0.5 +3.6 V VIA analog input voltage [6] [7] 0.5 4.6 V Vi(xtal) crystal input voltage [2] 0.5 +2.5 V IDD supply current per supply pin - 100 mA ISS ground current per ground pin - 100 mA Ilatch I/O latch-up current (0.5VDD) < VI < (1.5VDD); Tj < 125 C - 100 mA Tstg storage temperature non-operating [8] 65 +150 C Tj(max) maximum junction temperature - 150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W VESD electrostatic discharge voltage human body model; all pins [9] - 5500 V charged device model; TSSOP20 and SOP20 packages - 1200 V charged device model; TSSOP16 package - 1000 V charged device model; XSON16 package - 800 V LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 32 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 10. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Table 8. Thermal resistance Symbol Parameter Conditions Max/Min Unit DIP8 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air 60 ± 15 % C/W Single-layer (4.5 in  3 in); still air 81 ± 15 % C/W Rth(j-c) thermal resistance from junction to case 38 ± 15 % C/W TSSOP16 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air 133 ± 15 % C/W Single-layer (4.5 in  3 in); still air 182 ± 15 % C/W Rth(j-c) thermal resistance from junction to case 33 ± 15 % C/W TSSOP20 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air 110 ± 15 % C/W Single-layer (4.5 in  3 in); still air 153 ± 15 % C/W Rth(j-c) thermal resistance from junction to case 23 ± 15 % C/W SO20 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air 87 ± 15 % C/W Single-layer (4.5 in  3 in); still air 112 ± 15 % C/W Rth(j-c) thermal resistance from junction to case 50 ± 15 % C/W XSON16 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air 92 ± 15 % C/W Single-layer (4.5 in  3 in); still air 180 ± 15 % C/W Rth(j-c) thermal resistance from junction to case 27 ± 15 % C/W Tj = Tamb + PD  Rthj – a LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 33 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 11. Static characteristics Table 9. Static characteristics Tamb = 40 C to +105 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD supply voltage (core and external rail) 1.8 3.3 3.6 V IDD supply current Active mode; code while(1){} executed from flash; system clock = 12 MHz; default mode; VDD = 3.3 V [2][3][4][5]- 1.4 - mA system clock = 12 MHz; low-current mode; VDD = 3.3 V [2][3][4][5] [6] - 1.0 - mA system clock = 24 MHz; low-current mode; VDD = 3.3 V [2][4][5][6] [7] - 2.2 - mA system clock = 30 MHz; default mode; VDD = 3.3 V [2][4][5][8]- 3.3 - mA system clock = 30 MHz; low-current mode; VDD = 3.3 V [2][4][5][6] [8] - 3 - mA Sleep mode system clock = 12 MHz; default mode; VDD = 3.3 V [2][3][4][5]- 0.8 - mA system clock = 12 MHz; low-current mode; VDD = 3.3 V [2][3][4][5] [6] - 0.7 - mA system clock = 24 MHz; low-current mode; VDD = 3.3 V [2][4][5][6] [7] - 1.3 - mA system clock = 30 MHz; default mode; VDD = 3.3 V [2][4][5][8]- 1.8 - mA system clock = 30 MHz; low-current mode; VDD = 3.3 V [2][4][5][6] [8] - 1.7 - mA Deep-sleep mode VDD = 3.3 V, Tamb = 25 °C [2][9] - 150 300 A VDD = 3.3 V, Tamb = 105 °C [2][9] - - 400 A Power-down mode VDD = 3.3 V, Tamb = 25 °C [2][9]- 0.9 5 A VDD = 3.3 V, Tamb = 105 °C [2][9]- - 40 A Deep power-down mode; Low-power oscillator and self wakeup timer (WKT) disabled VDD = 3.3 V, Tamb = 25 °C [10] - 170 1000 nA VDD = 3.3 V, Tamb = 105 °C [10] - - 4 A Deep power-down mode; Low-power oscillator and self wakeup timer (WKT) enabled - 1 - A LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 34 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Standard port pins configured as digital pins, RESET; see Figure 13 IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD; on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/down resistors disabled - 0.5 10 nA VI input voltage VDD  1.8 V; 5 V tolerant pins except PIO0_6 [11] [12] 0 - 5.0 V VDD  1.8 V; on 3 V tolerant pin PIO0_6 0 - 3.6 VDD = 0 V 0 - 3.6 V VO output voltage output active 0 - VDD V VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.4 - V VOH HIGH-level output voltage 2.5 V  VDD  3.6 V; IOH = 4 mA VDD  0.4 - - V 1.8 V  VDD < 2.5 V; IOH = 3 mA VDD  0.4 - - V VOL LOW-level output voltage 2.5 V  VDD  3.6 V; IOL = 4 mA - - 0.4 V 1.8 V  VDD < 2.5 V; IOL = 3 mA - - 0.4 V IOH HIGH-level output current VOH = VDD  0.4 V; 2.5 V  VDD  3.6 V 4 - - mA 1.8 V  VDD < 2.5 V 3 - - mA IOL LOW-level output current VOL = 0.4 V 2.5 V  VDD  3.6 V 4 - - mA 1.8 V  VDD < 2.5 V 3 - - mA IOHS HIGH-level short-circuit output current VOH = 0 V [13] - - 45 mA IOLS LOW-level short-circuit output current VOL = VDD [13] - - 50 mA Ipd pull-down current VI = 5 V 10 50 150 A Ipu pull-up current VI = 0 V; 2.0 V  VDD  3.6 V 15 50 85 A 1.8 V  VDD < 2.0 V 10 50 85 A VDD < VI < 5 V 0 0 0 A High-drive output pins configured as digital pins (PIO0_2, PIO0_3, PIO0_7, PIO0_12, PIO0_13); see Figure 13 IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD; on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/down resistors disabled - 0.5 10 nA Table 9. Static characteristics …continued Tamb = 40 C to +105 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 35 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller VI input voltage VDD  1.8 V [11] [12] 0 - 5.0 V VDD = 0 V 0 - 3.6 V VO output voltage output active 0 - VDD V VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage 2.5 V  VDD  3.6 V; IOH = 20 mA VDD  0.4 - - V 1.8 V  VDD < 2.5 V; IOH = 12 mA VDD  0.4 - - V VOL LOW-level output voltage 2.5 V  VDD  3.6 V; IOL = 4 mA - - 0.4 V 1.8 V  VDD < 2.5 V; IOL = 3 mA - - 0.4 V IOH HIGH-level output current VOH = VDD  0.4 V; 2.5 V  VDD  3.6 V 20 - - mA 1.8 V  VDD < 2.5 V 12 - - mA IOL LOW-level output current VOL = 0.4 V 2.5 V  VDD  3.6 V 4 - - mA 1.8 V  VDD < 2.5 V 3 - - mA IOLS LOW-level short-circuit output current VOL = VDD [13] - - 50 mA Ipd pull-down current VI = 5 V [14] 10 50 150 A Ipu pull-up current VI = 0 V 2.0 V  VDD  3.6 V [14] 15 50 85 A 1.8 V  VDD < 2.0 V 10 50 85 A VDD < VI < 5 V 0 0 0 A I2C-bus pins (PIO0_10 and PIO0_11); see Figure 13 VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.05VDD - V IOL LOW-level output current VOL = 0.4 V; I2C-bus pins configured as standard mode pins 2.5 V  VDD  3.6 V 3.5 - - mA 1.8 V  VDD < 2.5 V 3 - - IOL LOW-level output current VOL = 0.4 V; I2C-bus pins configured as Fast-mode Plus pins 2.5 V  VDD  3.6 V 20 - - mA 1.8 V  VDD < 2.5 V 16 - - ILI input leakage current VI = VDD [15]- 2 4 A VI = 5 V - 10 22 A Table 9. Static characteristics …continued Tamb = 40 C to +105 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 36 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller [1] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), nominal supply voltages. [2] IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled. [3] IRC enabled; system oscillator disabled; system PLL disabled. [4] BOD disabled. [5] All peripherals disabled in the SYSAHBCLKCTRL register. Peripheral clocks to USART, CLKOUT, and IOCON disabled in system configuration block. [6] Low-current mode PWR_LOW_CURRENT selected when running the set_power routine in the power profiles. [7] IRC enabled; system oscillator disabled; system PLL enabled. [8] IRC disabled; system oscillator enabled; system PLL enabled. [9] All oscillators and analog blocks turned off in the PDSLEEPCFG register; PDSLEEPCFG = 0x0000 18FF. [10] WAKEUP pin pulled HIGH externally. [11] Including voltage on outputs in tri-state mode. [12] 3-state outputs go into tri-state mode in Deep power-down mode. [13] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [14] Pull-up and pull-down currents are measured across the weak internal pull-up/pull-down resistors. See Figure 8. [15] To VSS. Oscillator input pins (PIO0_8 and PIO0_9) Vi(xtal) crystal input voltage 0.5 1.8 1.95 V Vo(xtal) crystal output voltage 0.5 1.8 1.95 V Table 9. Static characteristics …continued Tamb = 40 C to +105 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit Fig 13. Pin input/output current measurement 􀀯􀀳􀀦􀀛􀀓􀀓 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀗􀀓 􀀎 􀀐 􀁓􀁌􀁑􀀃􀀳􀀬􀀲􀀓􀁂􀁑 􀀬􀀲􀀫 􀀬􀁓􀁘 􀀐 􀀎 􀁓􀁌􀁑􀀃􀀳􀀬􀀲􀀓􀁂􀁑 􀀬􀀲􀀯 􀀬􀁓􀁇 􀀹􀀧􀀧 􀀤 􀀤 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 37 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 11.1 Power consumption Power measurements in Active, Sleep, Deep-sleep,and Power-down modes were performed under the following conditions: • Configure all pins as GPIO with pull-up resistor disabled in the IOCON block. • Configure GPIO pins as outputs using the GPIO DIR register. • Write 1 to the GPIO CLR register to drive the outputs LOW. Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all peripherals disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL =0x1F); all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled; low-current mode. 1 MHz - 6 MHz: IRC enabled; PLL disabled. 12 MHz: IRC enabled; PLL disabled. 24 MHz: IRC enabled; PLL enabled. 30 MHz: IRC disabled; SYSOSC enabled; PLL enabled. Fig 14. Active mode: Typical supply current IDD versus supply voltage VDD 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀛􀀗 􀀔􀀑􀀛 􀀕􀀑􀀔􀀙 􀀕􀀑􀀘􀀕 􀀕􀀑􀀛􀀛 􀀖􀀑􀀕􀀗 􀀖􀀑􀀙 􀀓 􀀓􀀑􀀙 􀀔􀀑􀀕 􀀔􀀑􀀛 􀀕􀀑􀀗 􀀖 􀀹􀀧􀀧􀀃􀀋􀀹􀀌 􀀬􀀬􀀧􀀧􀀧􀀧􀀧􀀧 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀖􀀖􀀖􀀓􀀓􀀓􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀕􀀕􀀕􀀗􀀗􀀗􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀔􀀔􀀔􀀕􀀕􀀕􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀙􀀙􀀙􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀗􀀗􀀗􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀖􀀖􀀖􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀕􀀕􀀕􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀔􀀔􀀔􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 38 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Conditions: VDD = 3.3 V; active mode entered executing code while(1){} from flash; all peripherals disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled; low-current mode. 1 MHz - 6 MHz: IRC enabled; PLL disabled. 12 MHz: IRC enabled; PLL disabled. 24 MHz: IRC enabled; PLL enabled. 30 MHz: IRC disabled; SYSOSC enabled; PLL enabled. Fig 15. Active mode: Typical supply current IDD versus temperature 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀛􀀖 􀀐􀀗􀀓 􀀐􀀔􀀔 􀀔􀀛 􀀗􀀚 􀀚􀀙 􀀔􀀓􀀘 􀀓 􀀓􀀑􀀙 􀀔􀀑􀀕 􀀔􀀑􀀛 􀀕􀀑􀀗 􀀖 􀁗􀁈􀁐􀁓􀁈􀁕􀁄􀁗􀁘􀁕􀁈􀀃􀀋􀂃􀀦􀀌 􀀬􀀬􀀧􀀧􀀧􀀧􀀧􀀧 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀖􀀖􀀖􀀓􀀓􀀓􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀕􀀕􀀕􀀗􀀗􀀗􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀔􀀔􀀔􀀕􀀕􀀕􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀙􀀙􀀙􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀗􀀗􀀗􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀖􀀖􀀖􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀕􀀕􀀕􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀔􀀔􀀔􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 39 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Conditions: VDD = 3.3 V; sleep mode entered from flash; all peripherals disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled; low-current mode. 1 MHz - 6 MHz: IRC enabled; PLL disabled. 12 MHz: IRC enabled; PLL disabled. 24 MHz: IRC enabled; PLL enabled. 30 MHz: IRC disabled; SYSOSC enabled; PLL enabled. Fig 16. Sleep mode: Typical supply current IDD versus temperature for different system clock frequencies Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register (PDSLEEPCFG = 0x0000 18FF). Fig 17. Deep-sleep mode: Typical supply current IDD versus temperature for different supply voltages VDD 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀛􀀘 􀀐􀀗􀀓 􀀐􀀔􀀔 􀀔􀀛 􀀗􀀚 􀀚􀀙 􀀔􀀓􀀘 􀀓 􀀓􀀑􀀗 􀀓􀀑􀀛 􀀔􀀑􀀕 􀀔􀀑􀀙 􀀕 􀁗􀁈􀁐􀁓􀁈􀁕􀁄􀁗􀁘􀁕􀁈􀀃􀀋􀂃􀀦􀀌 􀀬􀀬􀀧􀀧􀀧􀀧􀀧􀀧 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀖􀀖􀀖􀀓􀀓􀀓􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀕􀀕􀀕􀀗􀀗􀀗􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀔􀀔􀀔􀀕􀀕􀀕􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀙􀀙􀀙􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀗􀀗􀀗􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀖􀀖􀀖􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀕􀀕􀀕􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀀔􀀔􀀔􀀃􀀃􀀃􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀙􀀗 􀀐􀀗􀀓 􀀐􀀔􀀘 􀀔􀀓 􀀖􀀘 􀀙􀀓 􀀛􀀘 􀀔􀀔􀀓 􀀔􀀓􀀓 􀀔􀀕􀀓 􀀔􀀗􀀓 􀀔􀀙􀀓 􀀔􀀛􀀓 􀀕􀀓􀀓 􀁗􀁈􀁐􀁓􀁈􀁕􀁄􀁗􀁘􀁕􀁈􀀃􀀋􀂃􀀃􀀦􀀌 􀀬􀀬􀀬􀀧􀀧􀀧􀀧􀀧􀀧 􀀋􀀋􀀋􀈝􀈝􀈝􀀤􀀤􀀤􀀌􀀌􀀌 􀀖􀀖􀀖􀀑􀀑􀀑􀀙􀀙􀀙􀀃􀀃􀀃􀀹􀀹􀀹 􀀖􀀖􀀖􀀑􀀑􀀑􀀓􀀓􀀓􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 40 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register (PDSLEEPCFG = 0x0000 18FF). Fig 18. Power-down mode: Typical supply current IDD versus temperature for different supply voltages VDD WKT not running. Fig 19. Deep power-down mode: Typical supply current IDD versus temperature for different supply voltages VDD 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀙􀀖 􀀐􀀗􀀓 􀀐􀀔􀀘 􀀔􀀓 􀀖􀀘 􀀙􀀓 􀀛􀀘 􀀔􀀔􀀓 􀀓 􀀚 􀀔􀀗 􀀕􀀔 􀀕􀀛 􀀖􀀘 􀁗􀁈􀁐􀁓􀁈􀁕􀁄􀁗􀁘􀁕􀁈􀀃􀀋􀂃􀀃􀀦􀀌 􀀬􀀬􀀬􀀧􀀧􀀧􀀧􀀧􀀧 􀀋􀀋􀀋􀈝􀈝􀈝􀀤􀀤􀀤􀀌􀀌􀀌 􀀖􀀖􀀖􀀑􀀑􀀑􀀙􀀙􀀙􀀃􀀃􀀃􀀹􀀹􀀹 􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀙􀀕 􀀐􀀗􀀓 􀀐􀀔􀀘 􀀔􀀓 􀀖􀀘 􀀙􀀓 􀀛􀀘 􀀔􀀔􀀓 􀀓 􀀓􀀑􀀘 􀀔 􀀔􀀑􀀘 􀀕 􀀕􀀑􀀘 􀀖 􀁗􀁈􀁐􀁓􀁈􀁕􀁄􀁗􀁘􀁕􀁈􀀃􀀋􀂃􀀃􀀦􀀌 􀀬􀀬􀀬􀀧􀀧􀀧􀀧􀀧􀀧 􀀋􀀋􀀋􀈝􀈝􀈝􀀤􀀤􀀤􀀌􀀌􀀌 􀀖􀀖􀀖􀀑􀀑􀀑􀀙􀀙􀀙􀀃􀀃􀀃􀀹􀀹􀀹 􀀖􀀖􀀖􀀑􀀑􀀑􀀓􀀓􀀓􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 41 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 11.2 CoreMark data Conditions: VDD = 3.3 V; Tamb = 25 C; active mode; all peripherals except one UART and the SCT disabled in the SYSAHBCLKCTRL register; system clock derived from the IRC; system oscillator disabled; internal pull-up resistors enabled; BOD disabled. Measured with Keil uVision v.4.7. Fig 20. Active mode: CoreMark power consumption IDD Conditions: VDD = 3.3 V; active mode; all peripherals except one UART and the SCT disabled in the SYSAHBCLKCTRL register; internal pull-up resistors enabled; BOD disabled. Measured with Keil uVision v.4.7. Fig 21. CoreMark score 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀛􀀙 􀀓 􀀗 􀀛 􀀔􀀕 􀀔􀀙 􀀕􀀓 􀀕􀀗 􀀓 􀀔 􀀕 􀀖 􀀗 􀀘 􀁖􀁜􀁖􀁗􀁈􀁐􀀃􀁆􀁏􀁒􀁆􀁎􀀃􀁉􀁕􀁈􀁔􀁘􀁈􀁑􀁆􀁜􀀃􀀋􀀰􀀫􀁝􀀌 􀀬􀀬􀀬􀀧􀀧􀀧􀀧􀀧􀀧 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀧􀀧􀀧􀁈􀁈􀁈􀁉􀁉􀁉􀁄􀁄􀁄􀁘􀁘􀁘􀁏􀁏􀁏􀁗􀁗􀁗 􀀦􀀦􀀦􀀳􀀳􀀳􀀸􀀸􀀸􀀒􀀒􀀒􀁈􀁈􀁈􀁉􀁉􀁉􀁉􀁉􀁉􀁌􀁌􀁌􀁆􀁆􀁆􀁌􀁌􀁌􀁈􀁈􀁈􀁑􀁑􀁑􀁆􀁆􀁆􀁜􀁜􀁜 􀀯􀀯􀀯􀁒􀁒􀁒􀁚􀁚􀁚􀀐􀀐􀀐􀁆􀁆􀁆􀁘􀁘􀁘􀁕􀁕􀁕􀁕􀁕􀁕􀁈􀁈􀁈􀁑􀁑􀁑􀁗􀁗􀁗 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀛􀀚 􀀓 􀀗 􀀛 􀀔􀀕 􀀔􀀙 􀀕􀀓 􀀕􀀗 􀀓 􀀓􀀑􀀘 􀀔 􀀔􀀑􀀘 􀀕 􀀕􀀑􀀘 􀁖􀁜􀁖􀁗􀁈􀁐􀀃􀁆􀁏􀁒􀁆􀁎􀀃􀁉􀁕􀁈􀁔􀁘􀁈􀁑􀁆􀁜􀀃􀀋􀀰􀀫􀁝􀀌 􀀋􀀋􀁐􀁐􀀤􀀤􀀌􀀌 􀀧􀀧􀀧􀁈􀁈􀁈􀁉􀁉􀁉􀁄􀁄􀁄􀁘􀁘􀁘􀁏􀁏􀁏􀁗􀁗􀁗 􀀦􀀦􀀦􀀳􀀳􀀳􀀸􀀸􀀸􀀒􀀒􀀒􀁈􀁈􀁈􀁉􀁉􀁉􀁉􀁉􀁉􀁌􀁌􀁌􀁆􀁆􀁆􀁌􀁌􀁌􀁈􀁈􀁈􀁑􀁑􀁑􀁆􀁆􀁆􀁜􀁜􀁜 􀀯􀀯􀀯􀁒􀁒􀁒􀁚􀁚􀁚􀀐􀀐􀀐􀁆􀁆􀁆􀁘􀁘􀁘􀁕􀁕􀁕􀁕􀁕􀁕􀁈􀁈􀁈􀁑􀁑􀁑􀁗􀁗􀁗 􀀦􀀰 􀀋􀀋􀁌􀁗􀁈􀁕􀁄􀁗􀁌􀁒􀁑􀁖􀀒􀁖􀀌􀀒􀀰􀀫􀁝􀀌􀀌 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 42 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 11.3 Peripheral power consumption The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both registers and no code is executed. Measured on a typical sample at Tamb = 25 C. Unless noted otherwise, the system oscillator and PLL are running in both measurements. The supply currents are shown for system clock frequencies of 12 MHz and 30 MHz. Table 10. Power consumption for individual analog and digital blocks Peripheral Typical supply current in mA Notes n/a 12 MHz 30 MHz IRC 0.21 - - System oscillator running; PLL off; independent of main clock frequency. System oscillator at 12 MHz 0.28 - - IRC running; PLL off; independent of main clock frequency. Watchdog oscillator at 500 kHz/2 0.002 - - System oscillator running; PLL off; independent of main clock frequency. BOD 0.05 - - Independent of main clock frequency. Main PLL - 0.31 - - CLKOUT - 0.06 0.09 Main clock divided by 4 in the CLKOUTDIV register. ROM - 0.08 0.19 - I2C - 0.06 0.15 - GPIO + pin interrupt/pattern match - 0.09 0.23 GPIO pins configured as outputs and set to LOW. Direction and pin state are maintained if the GPIO is disabled in the SYSAHBCLKCFG register. SWM - 0.03 0.07 - SCT - 0.17 0.42 - WKT - 0.01 0.03 - MRT - 0.09 0.21 - SPI0 - 0.05 0.13 - SPI1 - 0.06 0.14 - CRC - 0.03 0.07 - USART0 - 0.04 0.10 - USART1 - 0.04 0.11 - USART2 - 0.04 0.10 - WWDT - 0.04 0.10 Main clock selected as clock source for the WDT. IOCON - 0.03 0.08 - Comparator - 0.04 0.09 - LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 43 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 11.4 Electrical pin characteristics Conditions: VDD = 3.3 V and VDD = 1.8 V; on pins PIO0_2, PIO0_3, PIO0_7, PIO0_12, PIO0_13. Fig 22. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level output current IOH Conditions: VDD = 3.3 V and VDD = 1.8 V; on pins PIO0_10 and PIO0_11. Fig 23. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus LOW-level output voltage VOL 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀛􀀙􀀓 􀀓 􀀔􀀓 􀀕􀀓 􀀖􀀓 􀀗􀀓 􀀘􀀓 􀀙􀀓 􀀚􀀓 􀀛􀀓 􀀔􀀑􀀕 􀀔􀀑􀀙 􀀕 􀀕􀀑􀀗 􀀕􀀑􀀛 􀀖􀀑􀀕 􀀖􀀑􀀙 􀀬􀀲􀀫􀀃􀀋􀁐􀀤􀀌 􀀹􀀹􀀹􀀲􀀲􀀲􀀫􀀫􀀫 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀁙􀁙 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀁙􀁙 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀛􀀘􀀜 􀀓 􀀓􀀑􀀔 􀀓􀀑􀀕 􀀓􀀑􀀖 􀀓􀀑􀀗 􀀓􀀑􀀘 􀀓􀀑􀀙 􀀓 􀀔􀀘 􀀖􀀓 􀀗􀀘 􀀙􀀓 􀀹􀀲􀀯􀀃􀀋􀀹􀀌 􀀬􀀬􀀬􀀲􀀲􀀲􀀯􀀯􀀯 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀃􀀃􀀃􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀃􀀃􀀃􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀂃􀀢􀀢􀀦􀀦􀀦􀀒􀀒􀀒􀀃􀀃􀀃􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 44 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Conditions: VDD = 3.3 V and VDD = 1.8 V; standard port pins and high-drive pins PIO0_2, PIO0_3, PIO0_7, PIO0_12, PIO0_13. Fig 24. Typical LOW-level output current IOL versus LOW-level output voltage VOL Conditions: VDD = 3.3 V and VDD = 1.8 V; standard port pins. Fig 25. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀛􀀘􀀛 􀀓 􀀓􀀑􀀔 􀀓􀀑􀀕 􀀓􀀑􀀖 􀀓􀀑􀀗 􀀓􀀑􀀘 􀀓􀀑􀀙 􀀓 􀀖 􀀙 􀀜 􀀔􀀕 􀀔􀀘 􀀹􀀲􀀯􀀃􀀋􀀹􀀌 􀀬􀀬􀀬􀀲􀀲􀀲􀀯􀀯􀀯 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀃􀀃􀀃􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀃􀀃􀀃􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀃􀀃􀀃􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀃􀀃􀀃􀀔􀀖􀀖􀀑􀀑􀀑􀀛􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀚􀀜􀀖 􀀓 􀀖 􀀙 􀀜 􀀔􀀕 􀀔􀀘 􀀔􀀛 􀀕􀀔 􀀔􀀑􀀕 􀀔􀀑􀀙 􀀕 􀀕􀀑􀀗 􀀕􀀑􀀛 􀀖􀀑􀀕 􀀖􀀑􀀙 􀀬􀀲􀀫􀀃􀀋􀁐􀀤􀀌 􀀹􀀹􀀹􀀲􀀲􀀲􀀫􀀫􀀫 􀀋􀀋􀀋􀀹􀀹􀀹􀀌􀀌􀀌 􀀹􀀧􀀧􀀃􀀠􀀃􀀖􀀑􀀖􀀃􀀹􀀞 􀀷􀀃􀀠􀀃􀀃􀀐􀀗􀀓􀀃􀂃􀀦 􀀷􀀃􀀠􀀃􀀕􀀘􀀃􀂃􀀦 􀀷􀀃􀀠􀀃􀀛􀀘􀀃􀂃􀀦 􀀷􀀃􀀠􀀃􀀔􀀓􀀘􀀃􀂃􀀦 􀀹􀀧􀀧􀀃􀀠􀀃􀀔􀀑􀀛􀀃􀀹􀀞 􀀷􀀃􀀠􀀃􀀃􀀐􀀗􀀓􀀃􀂃􀀦 􀀷􀀃􀀠􀀃􀀕􀀘􀀃􀂃􀀦 􀀷􀀃􀀠􀀃􀀛􀀘􀀃􀂃􀀦 􀀷􀀃􀀠􀀃􀀔􀀓􀀘􀀃􀂃􀀦 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 45 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Conditions: VDD = 3.3 V and VDD = 1.8 V; standard port pins. Fig 26. Typical pull-up current Ipu versus input voltage VI Conditions: VDD = 3.3 V and VDD = 1.8 V; standard port pins. Fig 27. Typical pull-down current Ipd versus input voltage VI 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀛􀀛􀀙 􀀓 􀀔 􀀕 􀀖 􀀗 􀀘 􀀐􀀓􀀑􀀓􀀚 􀀐􀀓􀀑􀀓􀀙 􀀐􀀓􀀑􀀓􀀗 􀀐􀀓􀀑􀀓􀀖 􀀐􀀓􀀑􀀓􀀕 􀀓 􀀓􀀑􀀓􀀔 􀀹􀀬􀀃􀀋􀀹􀀌 􀀬􀀬􀀬􀁓􀁓􀁓􀁘􀁘􀁘 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀜􀀜􀀜􀀓􀀓􀀓􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀜􀀜􀀜􀀓􀀓􀀓􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦 􀀹􀀧􀀧􀀃􀀠􀀃􀀔􀀑􀀛􀀃􀀹 􀀹􀀧􀀧􀀃􀀠􀀃􀀖􀀑􀀖􀀃􀀹 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀛􀀙􀀔 􀀓 􀀔 􀀕 􀀖 􀀗 􀀘 􀀓 􀀓􀀑􀀓􀀕 􀀓􀀑􀀓􀀗 􀀓􀀑􀀓􀀙 􀀓􀀑􀀓􀀛 􀀹􀀬􀀃􀀋􀀹􀀌 􀀬􀀬􀀬􀀳􀀳􀀳􀀧􀀧􀀧 􀀋􀀋􀀋􀁐􀁐􀁐􀀤􀀤􀀤􀀌􀀌􀀌 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀐􀀐􀀐􀀗􀀗􀀗􀀓􀀓􀀓􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 􀀛􀀛􀀛􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀓􀀓􀀓􀀘􀀘􀀘􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀀃􀂡􀀀􀀀􀀦􀀦􀀦􀀒􀀒􀀒􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 46 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 12. Dynamic characteristics 12.1 Flash memory [1] Number of program/erase cycles. [2] Programming times are given for writing 64 bytes to the flash. Tamb  +85 C. Flash programming with IAP calls (see LPC800 user manual). 12.2 External clock for the oscillator in slave mode Remark: The input voltage on the XTAL1/2 pins must be  1.95 V (see Table 9). For connecting the oscillator to the XTAL pins, also see Section 14.2. [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), nominal supply voltages. Table 11. Flash characteristics Tamb = 40 C to +105 C. Based on JEDEC NVM qualification. Failure rate < 10 ppm for parts as specified below. Symbol Parameter Conditions Min Typ Max Unit Nendu endurance [1] 10000 100000 - cycles tret retention time powered 10 20 - years unpowered 20 40 - years ter erase time page or multiple consecutive pages, sector or multiple consecutive sectors 95 100 105 ms tprog programming time [2] 0.95 1 1.05 ms Table 12. Dynamic characteristic: external clock (XTALIN inputs) Tamb = 40 C to +105 C; VDD over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk)  0.4 - - ns tCLCX clock LOW time Tcy(clk)  0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns Fig 28. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) 􀁗􀀦􀀫􀀦􀀯 􀁗􀀦􀀯􀀦􀀻 􀁗􀀦􀀫􀀦􀀻 􀀷􀁆􀁜􀀋􀁆􀁏􀁎􀀌 􀁗􀀦􀀯􀀦􀀫 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀗􀀛 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 47 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 12.3 Internal oscillators [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), nominal supply voltages. [1] Typical ratings are not guaranteed. The values listed are at nominal supply voltages. [2] The typical frequency spread over processing and temperature (Tamb = 40 C to +105 C) is 40 %. [3] See the LPC81xM user manual. Table 13. Dynamic characteristics: IRC Tamb = 40 C to +105 C; 2.7 V  VDD  3.6 V[1]. Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency Tamb = 40 C to +105 C 11.82 12 12.18 MHz Conditions: Frequency values are typical values. 12 MHz  1.5 % accuracy is guaranteed for 2.7 V  VDD  3.6 V and Tamb = 40 C to +105 C. Variations between parts may cause the IRC to fall outside the 12 MHz  1.5 % accuracy specification for voltages below 2.7 V. Fig 29. Typical Internal RC oscillator frequency versus temperature Table 14. Dynamic characteristics: Watchdog oscillator Symbol Parameter Conditions Min Typ[1] Max Unit fosc(int) internal oscillator frequency DIVSEL = 0x1F, FREQSEL = 0x1 in the WDTOSCCTRL register; [2][3]- 9.4 - kHz DIVSEL = 0x00, FREQSEL = 0xF in the WDTOSCCTRL register [2][3] - 2300 - kHz 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀚􀀘 􀀐􀀗􀀓 􀀐􀀔􀀓 􀀕􀀓 􀀘􀀓 􀀛􀀓 􀀔􀀔􀀓 􀀔􀀔􀀑􀀛􀀛 􀀔􀀔􀀑􀀜􀀕 􀀔􀀔􀀑􀀜􀀙 􀀔􀀕 􀀔􀀕􀀑􀀓􀀗 􀀔􀀕􀀑􀀓􀀛 􀀔􀀕􀀑􀀔􀀕 􀁗􀁈􀁐􀁓􀁈􀁕􀁄􀁗􀁘􀁕􀁈􀀃􀀋􀂃􀀦􀀌 􀁉 􀀋􀀋􀀋􀀰􀀰􀀰􀀫􀀫􀀫􀁝􀁝􀁝􀀌􀀌􀀌 􀀖􀀖􀀖􀀑􀀑􀀑􀀙􀀙􀀙􀀃􀀃􀀃􀀹􀀹􀀹 􀀖􀀖􀀖􀀑􀀑􀀑􀀖􀀖􀀖􀀃􀀃􀀃􀀹􀀹􀀹 􀀖􀀖􀀖􀀑􀀑􀀑􀀓􀀓􀀓􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀑􀀑􀀑􀀚􀀚􀀚􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀑􀀑􀀑􀀗􀀗􀀗􀀃􀀃􀀃􀀹􀀹􀀹 􀀕􀀕􀀕􀀑􀀑􀀑􀀔􀀔􀀔􀀃􀀃􀀃􀀹􀀹􀀹 􀀔􀀔􀀔􀀑􀀑􀀑􀀛􀀛􀀛􀀃􀀃􀀃􀀹􀀹􀀹 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 48 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 12.4 I/O pins [1] Applies to standard port pins and RESET pin. 12.5 I2C-bus [1] See the I2C-bus specification UM10204 for details. [2] Parameters are valid over operating temperature range unless otherwise specified. Table 15. Dynamic characteristics: I/O pins[1] Tamb = 40 C to +105 C; 3.0 V  VDD  3.6 V. Symbol Parameter Conditions Min Typ Max Unit tr rise time pin configured as output 3.0 - 5.0 ns tf fall time pin configured as output 2.5 - 5.0 ns Table 16. Dynamic characteristic: I2C-bus pins[1] Tamb = 40 C to +105 C.[2] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 400 kHz Fast-mode Plus; on pins PIO0_10 and PIO0_11 0 1 MHz tf fall time [4][5][6][7] of both SDA and SCL signals Standard-mode - 300 ns Fast-mode 20 + 0.1  Cb 300 ns Fast-mode Plus; on pins PIO0_10 and PIO0_11 - 120 ns tLOW LOW period of the SCL clock Standard-mode 4.7 - s Fast-mode 1.3 - s Fast-mode Plus; on pins PIO0_10 and PIO0_11 0.5 - s tHIGH HIGH period of the SCL clock Standard-mode 4.0 - s Fast-mode 0.6 - s Fast-mode Plus; on pins PIO0_10 and PIO0_11 0.26 - s tHD;DAT data hold time [3][4][8] Standard-mode 0 - s Fast-mode 0 - s Fast-mode Plus; on pins PIO0_10 and PIO0_11 0 - s tSU;DAT data set-up time [9][10] Standard-mode 250 - ns Fast-mode 100 - ns Fast-mode Plus; on pins PIO0_10 and PIO0_11 50 - ns LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 49 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller [3] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge. [4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. [5] Cb = total capacitance of one bus line in pF. [6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for this when considering bus timing. [8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or tVD;ACK by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock. [9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the acknowledge. [10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time. Fig 30. I2C-bus pins clock timing 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀗􀀖 􀁗􀁉 􀀚􀀓􀀃􀀈 􀀶􀀧􀀤 􀀖􀀓􀀃􀀈 􀁗􀁉 􀀚􀀓􀀃􀀈 􀀖􀀓􀀃􀀈 􀀶 􀀚􀀓􀀃􀀈 􀀖􀀓􀀃􀀈 􀀚􀀓􀀃􀀈 􀀖􀀓􀀃􀀈 􀁗􀀫􀀧􀀞􀀧􀀤􀀷 􀀶􀀦􀀯 􀀔􀀃􀀒􀀃􀁉􀀶􀀦􀀯 􀀚􀀓􀀃􀀈 􀀖􀀓􀀃􀀈 􀀚􀀓􀀃􀀈 􀀖􀀓􀀃􀀈 􀁗􀀹􀀧􀀞􀀧􀀤􀀷 􀁗􀀫􀀬􀀪􀀫 􀁗􀀯􀀲􀀺 􀁗􀀶􀀸􀀞􀀧􀀤􀀷 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 50 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 12.6 SPI interfaces The maximum data bit rate is 30 Mbit/s in master mode and 25 Mbit/s in slave mode. Remark: SPI functions can be assigned to all digital pins. The characteristics are valid for all digital pins except the open-drain pins PIO0_10 and PIO0_11. [1] Capacitance on pin SPIn_SCK CSCK < 5 pF. [2] Tcy(clk) = DIVVAL/CCLK with CCLK = system clock frequency. DIVVAL is the SPI clock divider. See the LPC800 User manual UM10601. Table 17. SPI dynamic characteristics Tamb = 40 C to 105 C; 1.8 V  VDD  3.6 V. Simulated parameters sampled at the 50 % level of the rising or falling edge; values guaranteed by design. Symbol Parameter Conditions Min Max Unit SPI master[1] Tcy(clk) clock cycle time [2] 33 - ns tDS data set-up time 0 - ns tDH data hold time 16 - ns tv(Q) data output valid time CL = 10 pF - 0.5 ns th(Q) data output hold time CL = 10 pF 0.5 - ns SPI slave Tcy(clk) 40 ns tDS data set-up time 0 - ns tDH data hold time 16 - ns tv(Q) data output valid time CL = 10 pF - 10 ns th(Q) data output hold time CL = 10 pF 10 - ns LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 51 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Pin names SCK, MISO, and MOSI refer to pins for both SPI peripherals, SPI0 and SPI1. Fig 31. SPI master timing 􀀶􀀦􀀮􀀃􀀋􀀦􀀳􀀲􀀯􀀃􀀠􀀃􀀓􀀌 􀀰􀀲􀀶􀀬 􀀰􀀬􀀶􀀲 􀀷􀁆􀁜􀀋􀁆􀁏􀁎􀀌 􀁗􀀧􀀶 􀁗􀀧􀀫 􀁗􀁙􀀋􀀴􀀌 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀁗􀁋􀀋􀀴􀀌 􀀶􀀦􀀮􀀃􀀋􀀦􀀳􀀲􀀯􀀃􀀠􀀃􀀔􀀌 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀰􀀲􀀶􀀬 􀀰􀀬􀀶􀀲 􀁗􀀧􀀶 􀁗􀀧􀀫 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀁗􀁋􀀋􀀴􀀌 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀁗􀁙􀀋􀀴􀀌 􀀦􀀳􀀫􀀤􀀃􀀠􀀃􀀔 􀀦􀀳􀀫􀀤􀀃􀀠􀀃􀀓 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀗􀀗 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 52 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Pin names SCK, MISO, and MOSI refer to pins for both SPI peripherals, SPI0 and SPI1. Fig 32. SPI slave timing 􀀶􀀦􀀮􀀃􀀋􀀦􀀳􀀲􀀯􀀃􀀠􀀃􀀓􀀌 􀀰􀀲􀀶􀀬 􀀰􀀬􀀶􀀲 􀀷􀁆􀁜􀀋􀁆􀁏􀁎􀀌 􀁗􀀧􀀶 􀁗􀀧􀀫 􀁗􀁙􀀋􀀴􀀌 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀁗􀁋􀀋􀀴􀀌 􀀶􀀦􀀮􀀃􀀋􀀦􀀳􀀲􀀯􀀃􀀠􀀃􀀔􀀌 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀰􀀲􀀶􀀬 􀀰􀀬􀀶􀀲 􀁗􀀧􀀶 􀁗􀀧􀀫 􀁗􀁙􀀋􀀴􀀌 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀁗􀁋􀀋􀀴􀀌 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀧􀀤􀀷􀀤􀀃􀀹􀀤􀀯􀀬􀀧 􀀦􀀳􀀫􀀤􀀃􀀠􀀃􀀔 􀀦􀀳􀀫􀀤􀀃􀀠􀀃􀀓 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀗􀀘 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 53 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 12.7 USART interface The maximum USART bit rate is 1.875 Mbit/s in asynchronous mode and 10 Mbit/s in synchronous mode slave and master mode. Remark: USART functions can be assigned to all digital pins. The characteristics are valid for all digital pins except the open-drain pins PIO0_10 and PIO0_11. [1] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), VDD = 3.3 V, typical samples. [2] Tcy(clk) = U_PCLK/BRGVAL. See the LPC800 User manual UM10601. [3] Capacitance on pin Un_SCLK CSCLK < 5 pF. Table 18. USART dynamic characteristics Tamb = 40 C to 105 C; 1.8 V  VDD  3.6 V. Simulated parameters sampled at the 50 % level of the falling or rising edge; values guaranteed by design. Symbol Parameter Conditions Min Max Unit Tcy(clk) clock cycle time [2] 100 - ns USART master (in synchronous mode)[3] tsu(D) data input set-up time 44 - ns th(D) data input hold time 0 - ns tv(Q) data output valid time - -8 ns th(Q) data output hold time -8 - ns USART slave (in synchronous mode) tsu(D) data input set-up time 5 - ns th(D) data input hold time 0 - ns tv(Q) data output valid time CL = 10 pF - 40 ns th(Q) data output hold time CL = 10 pF 40 - ns Fig 33. USART timing 􀀸􀁑􀁂􀀶􀀦􀀯􀀮􀀃􀀋􀀦􀀯􀀮􀀳􀀲􀀯􀀃􀀠􀀃􀀓􀀌 􀀷􀀻􀀧 􀀵􀀻􀀧 􀀷􀁆􀁜􀀋􀁆􀁏􀁎􀀌 􀁗􀁖􀁘􀀋􀀧􀀌 􀁗􀁋􀀋􀀧􀀌 􀁗􀁙􀀋􀀴􀀌 􀀶􀀷􀀤􀀵􀀷 􀀥􀀬􀀷􀀓 􀁗􀁋􀀋􀀴􀀌 􀀸􀁑􀁂􀀶􀀦􀀯􀀮􀀃􀀋􀀦􀀯􀀮􀀳􀀲􀀯􀀃􀀠􀀃􀀔􀀌 􀀶􀀷􀀤􀀵􀀷 􀀥􀀬􀀷􀀓 􀀥􀀬􀀷􀀔 􀀥􀀬􀀷􀀔 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀓􀀓􀀔 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 54 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 13. Analog characteristics 13.1 BOD [1] Interrupt levels are selected by writing the level value to the BOD control register BODCTRL. [2] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), VDD = 3.3 V, typical samples. 13.2 Internal voltage reference [1] Characterized through simulation. [2] Characterized on a typical silicon sample. Table 19. BOD static characteristics[1] Tamb = 40 C to +105 C. Symbol Parameter Conditions Typ[2] Unit Vth threshold voltage interrupt level 1 assertion 2.3 V de-assertion 2.4 V interrupt level 2 assertion 2.6 V de-assertion 2.7 V interrupt level 3 assertion 2.8 V de-assertion 2.9 V reset level 1 assertion 2.1 V de-assertion 2.2 V reset level 2 assertion 2.4 V de-assertion 2.5 V reset level 3 assertion 2.6 V de-assertion 2.8 V Table 20. Internal voltage reference static and dynamic characteristics Symbol Parameter Conditions Min Typ Max Unit VO output voltage Tamb = 40 C to +105 C [1] 0.855 0.900 0.945 V Tamb = 70 C to 105 C [2] - 0.906 - V Tamb = 50 C [2] - 0.905 - V Tamb = 25 C [4] 0.893 0.903 0.913 V Tamb = 0 C [2] - 0.902 - V Tamb = 20 C [2] - 0.899 - V Tamb = 40 C [2] - 0.896 - V ts(pu) power-up settling time to 99% of VO [3] - 155 195 s LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 55 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller [3] Typical values are derived from nominal simulation (VDD = 3.3 V; Tamb = 27 C; nominal process models). Maximum values are derived from worst case simulation (VDD = 2.6 V; Tamb = 105 C; slow process models). [4] Maximum and minimum values are measured on samples from the corners of the process matrix lot. 13.3 Comparator VDD = 3.3 V Fig 34. Typical internal voltage reference output voltage 􀁄􀁄􀁄􀀐􀀓􀀓􀀚􀀜􀀔􀀖 􀀐􀀗􀀓 􀀐􀀔􀀘 􀀔􀀓 􀀖􀀘 􀀙􀀓 􀀛􀀘 􀀔􀀔􀀓 􀀛􀀜􀀓 􀀛􀀜􀀘 􀀜􀀓􀀓 􀀜􀀓􀀘 􀀜􀀔􀀓 􀁗􀁈􀁐􀁓􀁈􀁕􀁄􀁗􀁘􀁕􀁈􀀃􀀋􀂃􀀦􀀌 􀀹􀀹􀀹􀀲􀀲􀀲 􀀋􀀋􀀋􀁐􀁐􀁐􀀹􀀹􀀹􀀌􀀌􀀌 Table 21. Comparator characteristics VDD = 3.0 V and Tamb = 27 C unless noted otherwise. Symbol Parameter Conditions Min Typ Max Unit Static characteristics Vref(cmp) comparator reference voltage pin PIO0_6/VDDCMP configured for function VDDCMP 1.5 - 3.6 V IDD supply current - 55 - A VIC common-mode input voltage 0 - VDD V DVO output voltage variation 0 - VDD V Voffset offset voltage VIC = 0.1 V - 1.9 - mV VIC = 1.5 V - 2.1 - mV VIC = 2.8 V - 2.0 mV Dynamic characteristics tstartup start-up time nominal process - 4 - s LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 56 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller [1] CL = 10 pF; results from measurements on silicon samples over process corners and over the full temperature range Tamb = 40 C to +105 C. Typical data are for Tamb = 27 C. [2] Input hysteresis is relative to the reference input channel and is software programmable to three levels. [1] Maximum values are derived from worst case simulation (VDD = 2.6 V; Tamb = 105 C; slow process models). [2] Settling time applies to switching between comparator channels. tPD propagation delay HIGH to LOW; VDD = 3.0 V; VIC = 0.1 V; 50 mV overdrive input [1] - 109 121 ns VIC = 0.1 V; rail-to-rail input [1] - 155 164 ns VIC = 1.5 V; 50 mV overdrive input [1] - 95 105 ns VIC = 1.5 V; rail-to-rail input [1] - 101 108 ns VIC = 2.9 V; 50 mV overdrive input [1] - 122 129 ns VIC = 2.9 V; rail-to-rail input [1] - 74 82 ns tPD propagation delay LOW to HIGH; VDD = 3.0 V; VIC = 0.1 V; 50 mV overdrive input [1] - 246 260 ns VIC = 0.1 V; rail-to-rail input [1] - 57 59 ns VIC = 1.5 V; 50 mV overdrive input [1] - 218 ns VIC = 1.5 V; rail-to-rail input [1] - 146 155 ns VIC = 2.9 V; 50 mV overdrive input [1] - 184 206 ns VIC = 2.9 V; rail-to-rail input [1] - 250 286 ns Vhys hysteresis voltage positive hysteresis; VDD = 3.0 V; VIC = 1.5 V [2] - 6, 11, 21 - mV Vhys hysteresis voltage negative hysteresis; VDD = 3.0 V; VIC = 1.5 V [2][2] - 4, 9, 19 - mV Rlad ladder resistance - - 1.034 - M Table 21. Comparator characteristics …continued VDD = 3.0 V and Tamb = 27 C unless noted otherwise. Symbol Parameter Conditions Min Typ Max Unit Table 22. Comparator voltage ladder dynamic characteristics Symbol Parameter Conditions Min Typ Max Unit ts(pu) power-up settling time to 99% of voltage ladder output value [1]- - 30 s ts(sw) switching settling time to 99% of voltage ladder output value [1] [2] - - 15 s LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 57 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller [1] Measured over a polyresistor matrix lot with a 2 kHz input signal and overdrive < 100 V. [2] All peripherals except comparator and IRC turned off. Table 23. Comparator voltage ladder reference static characteristics VDD = 3.3 V; Tamb = 40 C to + 105C. Symbol Parameter Conditions Min Typ Max[1] Unit EV(O) output voltage error Internal VDD supply decimal code = 00 [2]- 0 0 % decimal code = 08 - 0 0.4 % decimal code = 16 - 0.2 0.2 % decimal code = 24 - 0.2 0.2 % decimal code = 30 - 0.1 0.1 % decimal code = 31 - 0.1 0.1 % EV(O) output voltage error External VDDCMP supply decimal code = 00 - 0 0 % decimal code = 08 - 0.1 0.5 % decimal code = 16 - 0.2 0.4 % decimal code = 24 - 0.2 0.3 % decimal code = 30 - 0.2 0.2 % decimal code = 31 - 0.1 0.1 % LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 58 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 14. Application information 14.1 Typical wake-up times [1] The wake-up time measured is the time between when a GPIO input pin is triggered to wake the device up from the low power modes and from when a GPIO output pin is set in the interrupt service routine (ISR) wake-up handler. [2] IRC enabled, all peripherals off. [3] Watchdog oscillator disabled, Brown-Out Detect (BOD) disabled. [4] Self wakeup-timer disabled. Wake-up from deep power-down causes the LPC800 to go through entire reset process. The wake-up time measured is the time between when a wake-up pin is triggered to wake the device up from the low power modes and from when a GPIO output pin is set in the reset handler. 14.2 XTAL input The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave mode, a minimum of 200 mV(RMS) is needed. In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 35), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 36 and in Table 25 and Table 26. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (the fundamental frequency is represented by L, CL and Table 24. Typical wake-up times (3.3 V, Temp = 25 °C) Power modes VDD current Wake-up time Sleep mode (12 MHz)[1][2] 0.7 mA 2.6 s Deep-sleep mode[1][3] 150 A 4 s Power-down mode[1][3] 0.9 A 50 s Deep Power-down mode[4] 170 nA 215 s Fig 35. Slave mode operation of the on-chip oscillator 􀀯􀀳􀀦􀀛􀀓􀀓 􀀻􀀷􀀤􀀯􀀬􀀱 􀀦􀁌 􀀔􀀓􀀓􀀃􀁓􀀩 􀀦􀁊 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀗􀀙 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 59 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller RS). Capacitance CP in Figure 36 represents the parallel package capacitance and should not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal manufacturer (see Table 25). Fig 36. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 25. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 1 MHz to 5 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 300  39 pF, 39 pF 30 pF < 300  57 pF, 57 pF 5 MHz to 10 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 200  39 pF, 39 pF 30 pF < 100  57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 60  39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80  18 pF, 18 pF Table 26. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180  18 pF, 18 pF 20 pF < 100  39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 80  39 pF, 39 pF 􀁄􀁄􀁄􀀐􀀓􀀓􀀗􀀙􀀗􀀚 􀀯􀀳􀀦􀀛􀀓􀀓 􀀻􀀷􀀤􀀯􀀬􀀱 􀀻􀀷􀀤􀀯􀀲􀀸􀀷 􀀦􀀻􀀔 􀀦􀀻􀀕 􀀻􀀷􀀤􀀯 􀀠 􀀦􀀯 􀀦􀀳 􀀵􀀶 􀀯 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 60 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 14.3 XTAL Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1,Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 61 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 15. Package outline Fig 37. Package outline SOT097-2 (DIP8) Outline References version European projection Issue date IEC JEDEC JEITA SOT97-2 MO-001 sot097-2_po 10-10-15 10-10-18 Unit(1) mm max nom min 4.2 0.51 0.53 0.38 1.07 0.89 0.38 0.20 6.48 6.20 9.8 9.2 2.54 7.62 A Dimensions (inch dimensions are derived from the original dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-2 A1 b 1.73 1.14 b1 b2 c D(1) E(1) e e1 L ME MH w 0.254 Z(1) 1.15 inches max nom min 0.17 0.02 3.43 A2 0.14 0.021 0.015 0.042 0.035 0.015 0.008 9.40 7.88 0.37 0.31 7.88 7.62 0.31 0.30 0.26 0.24 0.39 0.36 3.60 3.05 0.14 0.12 0.1 0.3 0.068 0.045 0.01 0.045 0 2.5 5 mm scale Z e w b1 D seating plane A2 A1 A L pin 1 index b b2 E 1 4 8 5 (e1) MH ME c - - - - - - LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 62 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 38. Package outline SOT403-1 (TSSOP16) UNIT A1 A2 A3 bp c D(1) E (2) e HE L Lp Q v w y Z (1) θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT403-1 MO-153 99-12-27 03-02-18 w M bp D Z e 0.25 1 8 16 9 θ A A1 A2 Lp Q detail X L (A 3 ) HE E c v M A X A y 0 2.5 5 mm scale TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 A max. 1.1 pin 1 index LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 63 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 39. Package outline SOT163-1 (SO20) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT163-1 10 20 w M bp detail X Z e 11 1 D y 0.25 075E04 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale X θ A A1 A2 HE Lp Q E c L v M A (A 3 ) A SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 99-12-27 03-02-19 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 64 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 40. Package outline SOT360-1 (TSSOP20) UNIT A1 A2 A3 bp c D(1) E (2) e HE L Lp Q v w y Z (1) θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M bp D Z e 0.25 1 10 20 11 pin 1 index θ A A1 A2 Lp Q detail X L (A 3 ) HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 65 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 41. Package outline SOT1341-1 (XSON16) Outline References version European projection Issue date IEC JEDEC JEITA SOT1341-1 MO-252 sot1341-1_po 12-09-05 13-02-13 Unit(1) mm max nom min 0.5 0.05 0.00 A Dimensions (mm are the original dimensions) XSON16: plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm S OT1341-1 A1 0.25 0.20 0.15 2.6 2.5 2.4 0.9 0.8 0.7 3.3 3.2 3.1 0.4 2.8 0.2 b c 0.152 0.050 D E e e1 k L 1.0 0.9 0.8 L1 v 0.1 0.05 w y 0.05 y1 0.05 0 1 2 3 mm scale Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. e1 e terminal 1 index area terminal 1 index area D B A E detail X c A A1 L1 k L - - - - - - X C b y1 C y v C A B w C 1 8 16 9 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 66 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 16. Soldering Fig 42. Reflow soldering of the TSSOP16 package DIMENSIONS in mm P1 Ay By C D1 D2 Gx Gy Hy sot403-1_fr Hx SOT403-1 solder land occupied area Footprint information for reflow soldering of TSSOP16 package Gy By Ay C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D2 (4x) D1 P2 0.650 0.750 7.200 4.500 1.350 0.400 0.600 5.600 5.300 5.800 7.450 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 67 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 43. Reflow soldering of the SO20 package occupied area sot163-1_fr solder lands placement accuracy ± 0.25 Dimensions in mm 1.50 0.60 (20×) 1.27 (18×) 8.00 11.00 13.40 11.40 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 68 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 44. Reflow soldering of the TSSOP20 package DIMENSIONS in mm P1 Ay By C D1 D2 Gx Gy Hy sot360-1_fr Hx SOT360-1 solder land occupied area Footprint information for reflow soldering of TSSOP20 package Gy By Ay C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D2 (4x) D1 P2 0.650 0.750 7.200 4.500 1.350 0.400 0.600 6.900 5.300 7.300 7.450 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 69 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Fig 45. Reflow soldering of the XSON16 package 􀀩􀁒􀁒􀁗􀁓􀁕􀁌􀁑􀁗􀀃􀁌􀁑􀁉􀁒􀁕􀁐􀁄􀁗􀁌􀁒􀁑􀀃􀁉􀁒􀁕􀀃􀁕􀁈􀁉􀁏􀁒􀁚􀀃􀁖􀁒􀁏􀁇􀁈􀁕􀁌􀁑􀁊􀀃􀁒􀁉􀀃􀀻􀀶􀀲􀀱􀀔􀀙􀀃􀁓􀁄􀁆􀁎􀁄􀁊􀁈􀀃 􀀶􀀲􀀷􀀔􀀖􀀗􀀔􀀐􀀔 􀁖􀁒􀁗􀀔􀀖􀀗􀀔􀀐􀀔􀁂􀁉􀁕 􀁒􀁆􀁆􀁘􀁓􀁌􀁈􀁇􀀃􀁄􀁕􀁈􀁄 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁓􀁄􀁖􀁗􀁈 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁕􀁈􀁖􀁌􀁖􀁗 􀁖􀁒􀁏􀁇􀁈􀁕􀀃􀁏􀁄􀁑􀁇􀁖 􀀬􀁖􀁖􀁘􀁈􀀃􀁇􀁄􀁗􀁈 􀀧􀁌􀁐􀁈􀁑􀁖􀁌􀁒􀁑􀁖􀀃􀁌􀁑􀀃􀁐􀁐 􀀔􀀗􀀐􀀓􀀕􀀐􀀕􀀛 􀀔􀀗􀀐􀀓􀀖􀀐􀀓􀀚 􀀓􀀑􀀚 􀀔􀀑􀀔􀀚 􀀔􀀑􀀓􀀚 􀀖􀀑􀀔􀀗 􀀓􀀑􀀗 􀀓􀀑􀀕􀀕 􀀓􀀑􀀔􀀛 􀀖􀀑􀀓􀀕 􀀖􀀑􀀔􀀕 􀀖􀀑􀀘 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 70 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 17. Abbreviations 18. References [1] I2C-bus specification UM10204. Table 27. Abbreviations Acronym Description AHB Advanced High-performance Bus APB Advanced Peripheral Bus BOD BrownOut Detection GPIO General-Purpose Input/Output PLL Phase-Locked Loop RC Resistor-Capacitor SPI Serial Peripheral Interface SMBus System Management Bus TEM Transverse ElectroMagnetic UART Universal Asynchronous Receiver/Transmitter LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 71 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 19. Revision history Table 28. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC81XM v.4.3 20140422 Product data sheet - LPC81XM v.4.2 Modifications: • Section 8.20.2 “Clock input” updated for clarity. • CLKIN signal removed from Table 12 “Dynamic characteristic: external clock (XTALIN inputs)”. • Name “SCT” changed to “SCTimer/PWM” for clarity. • Remove slew rate control from GPIO features for clarity. • MRT bus stall mode added. • WWDT clock source corrected in Section 8.17.1. • Pin description table updated for clarification (I2C-bus pins, WAKEUP, RESET). • Added reflow solder diagram and thermal resistance numbers for XSON16 (SOT1341-1). • Table 21: Added Vref(cmp) spec for PIO0_6/VDDCMP. LPC81XM v.4.2 20131210 Product data sheet - LPC81XM v.4.1 Modifications: Corrected vertical axis marker in Figure 21 “CoreMark score”. LPC81XM v.4.1 20131112 Product data sheet - LPC81XM v.4 Modifications: • Corrected XSON16 pin information in Figure 6 and Table 4. LPC81XM v.4 20131025 Product data sheet - LPC81XM v.3.1 Modifications: • Added Section 14.1 “Typical wake-up times”. • Added LPC812M101JTB16 and XSON16 package. LPC81XM v.3.1 20130916 Product data sheet - LPC81XM v.3 Modifications: • Correct the pin interrupt features: Pin interrupts can wake up the part from Sleep mode, Deep-sleep mode, and Power-down mode. See Section 8.11.1. • Table 9 “Static characteristics”: Updated power numbers for Deep-sleep, Power-down, and Deep power-down. • Added 30 MHz data to Figure 13 “Active mode: Typical supply current IDD versus supply voltage VDD”, Figure 14 “Active mode: Typical supply current IDD versus temperature”, and Figure 15 “Sleep mode: Typical supply current IDD versus temperature for different system clock frequencies”. LPC81XM v.3 20130729 Product data sheet - LPC81XM v.2.1 • Operating temperature range changed to 40 °C to 105 °C. • Type numbers updated to reflect the new operating temperature range. See Table 1 “Ordering information” and Table 2 “Ordering options”. • ISP entry pin moved from PIO0_1 to PIO0_12 for TSSOP, and SSOP packages. See Table 4 and Table 6. • Propagation delay values updated in Table 21 “Comparator characteristics”. • SPI characteristics updated. See Section 12.6. • IRC characteristics updated. See Section 12.3. • CoreMark data updated. See Figure 19 and Figure 20. • IRC frequency changed to 12 MHz +/- 1.5 %. See Table 13. • Data sheet status updated to Product data sheet. LPC81XM v.2.1 20130325 Preliminary data sheet - LPC81XM v.2 LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 72 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller • Editorial updates (temperature sensor removed). • CoreMark data added. See Figure 19 “Active mode: CoreMark power consumption IDD” and Figure 20 “CoreMark score”. • IDD in Deep power-down mode added for condition Low-power oscillator on/WKT wake-up enabled. See Table 10. • Table note 3 updated for Table 4 “Pin description table (fixed pins)”. • Conditions for ter and tprog updated in Table 12 “Flash characteristics”. • Section 13.3 “Internal voltage reference” added. • Typical timing data added for SPI. See Section 12.6. • Typical timing data added for USART in synchronous mode. See Section 12.7. • BOD characterization added. See Section 13.1. • IRC characterization added. See Section 12.3. • Internal voltage reference characteristics added. See Section 13.3. • Data sheet status changed to Preliminary data sheet. LPC81XM v.2 20130128 Objective data sheet - LPC81XM v.1 Modifications: • MTB memory space changed to 1 kB in Figure 6. • Electrical pin characteristics added in Table 10. • Figure 11 “Connecting the SWD pins to a standard SWD connector” added. • Peripheral power consumption added in Table 11. • Table 7 updated. • MRT implementation changed to 31-bit timer. • Power consumption data in active and sleep mode with IRC added. See Figure 13 to Figure 15. • Power consumption (parameter IDD) in active and sleep mode for low-power mode at 12 MHz corrected in Table 10. • Power consumption (parameter IDD) in active and sleep mode at 24 MHz added in Table 10. • Maximum USART speed in synchronous mode changed to 10 Mbit/s. • Section 5 “Marking” added. LPC81XM v.1 20121112 Objective data sheet - - Table 28. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 73 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 20. Legal information 20.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 20.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. 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Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 74 of 76 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 20.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V. 21. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC81XM All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.3 — 22 April 2014 75 of 76 continued >> NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Functional description . . . . . . . . . . . . . . . . . . 13 8.1 ARM Cortex-M0+ core . . . . . . . . . . . . . . . . . . 13 8.2 On-chip flash program memory . . . . . . . . . . . 13 8.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 13 8.4 On-chip ROM . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.5 Nested Vectored Interrupt Controller (NVIC) . 13 8.5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8.5.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 13 8.6 System tick timer . . . . . . . . . . . . . . . . . . . . . . 14 8.7 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.8 I/O configuration . . . . . . . . . . . . . . . . . . . . . . . 15 8.8.1 Standard I/O pad configuration . . . . . . . . . . . . 16 8.9 Switch Matrix (SWM) . . . . . . . . . . . . . . . . . . . 17 8.10 Fast General-Purpose parallel I/O (GPIO) . . . 17 8.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8.11 Pin interrupt/pattern match engine . . . . . . . . . 18 8.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8.12 USART0/1/2 . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.13 SPI0/1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.14 I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . 20 8.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.15 State-Configurable Timer/PWM (SCTimer/PWM) . . . . . . . . . . . . . . . . . . . . . . . 20 8.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8.16 Multi-Rate Timer (MRT) . . . . . . . . . . . . . . . . . 21 8.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8.17 Windowed WatchDog Timer (WWDT) . . . . . . 21 8.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8.18 Self Wake-up Timer (WKT). . . . . . . . . . . . . . . 22 8.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 8.19 Analog comparator (ACMP) . . . . . . . . . . . . . . 22 8.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 8.20 Clocking and power control . . . . . . . . . . . . . . 24 8.20.1 Crystal and internal oscillators . . . . . . . . . . . . 24 8.20.1.1 Internal RC Oscillator (IRC) . . . . . . . . . . . . . . 25 8.20.1.2 Crystal Oscillator (SysOsc) . . . . . . . . . . . . . . 25 8.20.1.3 Internal Low-power Oscillator and Watchdog Oscillator (WDOsc) . . . . . . . . . . . . . . . . . . . . 25 8.20.2 Clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 8.20.3 System PLL . . . . . . . . . . . . . . . . . . . . . . . . . . 25 8.20.4 Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.20.5 Wake-up process . . . . . . . . . . . . . . . . . . . . . . 26 8.20.6 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.20.6.1 Power profiles . . . . . . . . . . . . . . . . . . . . . . . . 26 8.20.6.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.20.6.3 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 27 8.20.6.4 Power-down mode. . . . . . . . . . . . . . . . . . . . . 27 8.20.6.5 Deep power-down mode . . . . . . . . . . . . . . . . 27 8.21 System control . . . . . . . . . . . . . . . . . . . . . . . . 28 8.21.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8.21.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 28 8.21.3 Code security (Code Read Protection - CRP) 29 8.21.4 APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.21.5 AHBLite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.22 Emulation and debugging . . . . . . . . . . . . . . . 30 9 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 31 10 Thermal characteristics . . . . . . . . . . . . . . . . . 32 11 Static characteristics . . . . . . . . . . . . . . . . . . . 33 11.1 Power consumption . . . . . . . . . . . . . . . . . . . . 37 11.2 CoreMark data . . . . . . . . . . . . . . . . . . . . . . . . 41 11.3 Peripheral power consumption . . . . . . . . . . . 42 11.4 Electrical pin characteristics. . . . . . . . . . . . . . 43 12 Dynamic characteristics. . . . . . . . . . . . . . . . . 46 12.1 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 46 12.2 External clock for the oscillator in slave mode 46 12.3 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 47 12.4 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12.5 I2C-bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12.6 SPI interfaces. . . . . . . . . . . . . . . . . . . . . . . . . 50 12.7 USART interface . . . . . . . . . . . . . . . . . . . . . . 53 13 Analog characteristics . . . . . . . . . . . . . . . . . . 54 13.1 BOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 13.2 Internal voltage reference . . . . . . . . . . . . . . . 54 13.3 Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . 55 14 Application information . . . . . . . . . . . . . . . . . 58 14.1 Typical wake-up times . . . . . . . . . . . . . . . . . . 58 14.2 XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 14.3 XTAL Printed Circuit Board (PCB) layout guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 15 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 61 NXP Semiconductors LPC81xM 32-bit ARM Cortex-M0+ microcontroller © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 April 2014 Document identifier: LPC81XM Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 70 18 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 19 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 71 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 73 20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 73 20.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 20.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 74 21 Contact information. . . . . . . . . . . . . . . . . . . . . 74 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 1. General description The LPC1769/68/67/66/65/64/63 are ARM Cortex-M3 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The ARM Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration. The LPC1768/67/66/65/64/63 operate at CPU frequencies of up to 100 MHz. The LPC1769 operates at CPU frequencies of up to 120 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching. The peripheral complement of the LPC1769/68/67/66/65/64/63 includes up to 512 kB of flash memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface, 8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers, SPI interface, 3 I2C-bus interfaces, 2-input plus 2-output I2S-bus interface, 8-channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, four general purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock (RTC) with separate battery supply, and up to 70 general purpose I/O pins. The LPC1769/68/67/66/65/64/63 are pin-compatible to the 100-pin LPC236x ARM7-based microcontroller series. 2. Features and benefits  ARM Cortex-M3 processor, running at frequencies of up to 100 MHz (LPC1768/67/66/65/64/63) or of up to 120 MHz (LPC1769). A Memory Protection Unit (MPU) supporting eight regions is included.  ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).  Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator enables high-speed 120 MHz operation with zero wait states.  In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.  On-chip SRAM includes:  32/16 kB of SRAM on the CPU with local code/data bus for high-performance CPU access. LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN Rev. 9.4 — 4 April 2014 Product data sheet LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 2 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller  Two/one 16 kB SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as for general purpose CPU instruction and data storage.  Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with SSP, I2S-bus, UART, Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers.  Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and the USB interface. This interconnect provides communication with no arbitration delays.  Split APB bus allows high throughput with few stalls between the CPU and DMA.  Serial interfaces:  Ethernet MAC with RMII interface and dedicated DMA controller. (Not available on all parts, see Table 2.)  USB 2.0 full-speed device/Host/OTG controller with dedicated DMA controller and on-chip PHY for device, Host, and OTG functions. (Not available on all parts, see Table 2.)  Four UARTs with fractional baud rate generation, internal FIFO, and DMA support. One UART has modem control I/O and RS-485/EIA-485 support, and one UART has IrDA support.  CAN 2.0B controller with two channels. (Not available on all parts, see Table 2.)  SPI controller with synchronous, serial, full duplex communication and programmable data length.  Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces can be used with the GPDMA controller.  Three enhanced I2C bus interfaces, one with an open-drain output supporting full I2C specification and Fast mode plus with data rates of 1 Mbit/s, two with standard port pins. Enhancements include multiple address recognition and monitor mode.  I2S (Inter-IC Sound) interface for digital audio input or output, with fractional rate control. The I2S-bus interface can be used with the GPDMA. The I2S-bus interface supports 3-wire and 4-wire data transmit and receive as well as master clock input/output. (Not available on all parts, see Table 2.)  Other peripherals:  70 (100 pin package) General Purpose I/O (GPIO) pins with configurable pull-up/down resistors. All GPIOs support a new, configurable open-drain operating mode. The GPIO block is accessed through the AHB multilayer bus for fast access and located in memory such that it supports Cortex-M3 bit banding and use by the General Purpose DMA Controller.  12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins, conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can be used with the GPDMA controller.  10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA support. (Not available on all parts, see Table 2)  Four general purpose timers/counters, with a total of eight capture inputs and ten compare outputs. Each timer block has an external count input. Specific timer events can be selected to generate DMA requests.  One motor control PWM with support for three-phase motor control. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 3 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller  Quadrature encoder interface that can monitor one external quadrature encoder.  One standard PWM/timer block with external count input.  RTC with a separate power domain and dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered backup registers.  WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator, the RTC oscillator, or the APB clock.  ARM Cortex-M3 system tick timer, including an external clock input option.  Repetitive interrupt timer provides programmable and repeating timed interrupts.  Each peripheral has its own clock divider for further power savings.  Standard JTAG test/debug interface for compatibility with existing tools. Serial Wire Debug and Serial Wire Trace Port options.  Emulation trace module enables non-intrusive, high-speed real-time tracing of instruction execution.  Integrated PMU (Power Management Unit) automatically adjusts internal regulators to minimize power consumption during Sleep, Deep sleep, Power-down, and Deep power-down modes.  Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.  Single 3.3 V power supply (2.4 V to 3.6 V).  Four external interrupt inputs configurable as edge/level sensitive. All pins on Port 0 and Port 2 can be used as edge sensitive interrupt sources.  Non-maskable Interrupt (NMI) input.  Clock output function that can reflect the main oscillator clock, IRC clock, RTC clock, CPU clock, and the USB clock.  The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up from any priority interrupt that can occur while the clocks are stopped in deep sleep, Power-down, and Deep power-down modes.  Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet wake-up interrupt, CAN bus activity, Port 0/2 pin interrupt, and NMI).  Brownout detect with separate threshold for interrupt and forced reset.  Power-On Reset (POR).  Crystal oscillator with an operating range of 1 MHz to 25 MHz.  4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as a system clock.  PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the main oscillator, the internal RC oscillator, or the RTC oscillator.  USB PLL for added flexibility.  Code Read Protection (CRP) with different security levels.  Unique device serial number for identification purposes.  Available as LQFP100 (14 mm  14 mm  1.4 mm), TFBGA1001 (9 mm  9 mm  0.7 mm), and WLCSP100 (5.074  5.074  0.6 mm) package. 1. LPC1768/65 only. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 4 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 3. Applications 4. Ordering information 4.1 Ordering options  eMetering  Alarm systems  Lighting  White goods  Industrial networking  Motor control Table 1. Ordering information Type number Package Name Description Version LPC1769FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC1768FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC1768FET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1 LPC1768UK WLCSP100 wafer level chip-scale package; 100 balls; 5.074  5.074  0.6 mm - LPC1767FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC1766FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC1765FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC1765FET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1 LPC1764FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC1763FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 Table 2. Ordering options Type number Flash SRAM in kB Ethernet USB CAN I2S DAC Maximum CPU operating frequency CPU AHB SRAM0 AHB SRAM1 Total LPC1769FBD100 512 kB 32 16 16 64 yes Device/Host/OTG 2 yes yes 120 MHz LPC1768FBD100 512 kB 32 16 16 64 yes Device/Host/OTG 2 yes yes 100 MHz LPC1768FET100 512 kB 32 16 16 64 yes Device/Host/OTG 2 yes yes 100 MHz LPC1768UK 512 kB 32 16 16 64 yes Device/Host/OTG 2 yes yes 100 MHz LPC1767FBD100 512 kB 32 16 16 64 yes no no yes yes 100 MHz LPC1766FBD100 256 kB 32 16 16 64 yes Device/Host/OTG 2 yes yes 100 MHz LPC1765FBD100 256 kB 32 16 16 64 no Device/Host/OTG 2 yes yes 100 MHz LPC1765FET100 256 kB 32 16 16 64 no Device/Host/OTG 2 yes yes 100 MHz LPC1764FBD100 128 kB 16 16 - 32 yes Device only 2 no no 100 MHz LPC1763FBD100 256 kB 32 16 16 64 no no no yes yes 100 MHz LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 5 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 5. Marking The LPC176x devices typically have the following top-side marking: LPC176xxxx xxxxxxx xxYYWWR[x] The last/second to last letter in the third line (field ‘R’) will identify the device revision. This data sheet covers the following revisions of the LPC176x: Field ‘YY’ states the year the device was manufactured. Field ‘WW’ states the week the device was manufactured during that year. Table 3. Device revision table Revision identifier (R) Revision description ‘-’ Initial device revision ‘A’ Second device revision ‘B’ Third device revision LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 6 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 6. Block diagram (1) Not available on all parts. See Table 2. Fig 1. Block diagram SRAM 32/64 kB ARM CORTEX-M3 TEST/DEBUG INTERFACE EMULATION TRACE MODULE FLASH ACCELERATOR FLASH 512/256/128 kB DMA CONTROLLER ETHERNET CONTROLLER WITH DMA(1) USB HOST/ DEVICE/OTG CONTROLLER WITH DMA(1) I-code bus D-code bus system bus AHB TO APB BRIDGE 0 HIGH-SPEED GPIO AHB TO APB BRIDGE 1 CLOCK GENERATION, POWER CONTROL, SYSTEM FUNCTIONS XTAL1 XTAL2 RESET clocks and controls JTAG interface debug port USB PHY SSP0 UART2/3 I2S(1) I2C2 RI TIMER TIMER2/3 EXTERNAL INTERRUPTS SYSTEM CONTROL MOTOR CONTROL PWM QUADRATURE ENCODER SSP1 UART0/1 CAN1/2(1) I2C0/1 SPI0 TIMER 0/1 WDT PWM1 12-bit ADC PIN CONNECT GPIO INTERRUPT CONTROL RTC BACKUP REGISTERS 32 kHz OSCILLATOR APB slave group 0 APB slave group 1 DAC(1) RTC POWER DOMAIN LPC1769/68/67/ 66/65/64/63 master master master 002aad944 slave slave slave slave slave ROM slave MULTILAYER AHB MATRIX P0 to P4 SDA2 SCL2 SCK0 SSEL0 MISO0 MOSI0 SCK1 SSEL1 MISO1 MOSI1 RXD2/3 TXD2/3 PHA, PHB INDEX EINT[3:0] AOUT MCOA[2:0] MCOB[2:0] MCI[2:0] MCABORT 4 × MAT2 2 × MAT3 2 × CAP2 2 × CAP3 3 × I2SRX 3 × I2STX TX_MCLK RX_MCLK RTCX1 RTCX2 VBAT PWM1[7:0] 2 × MAT0/1 2 × CAP0/1 RD1/2 TD1/2 SDA0/1 SCL0/1 AD0[7:0] SCK/SSEL MOSI/MISO 8 × UART1 RXD0/TXD0 P0, P2 PCAP1[1:0] RMII pins USB pins CLKOUT MPU = connected to DMA LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 7 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 7. Pinning information 7.1 Pinning Fig 2. Pin configuration LQFP100 package Fig 3. Pin configuration TFBGA100 package LPC176xFBD100 50 1 25 75 51 26 76 100 002aad945 002aaf723 LPC1768/65FET100 Transparent top view J G K H F E D C B A 1 2 3 4 5 6 7 8 9 10 ball A1 index area LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 8 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 4. Pin configuration WLCSP100 package Transparent top view 1 A B C D E F G H J K 2 3 4 5 6 7 8 9 10 LPC1768UK bump A1 index area aaa-009522 Table 4. Pin allocation table TFBGA100 Pin Symbol Pin Symbol Pin Symbol Pin Symbol Row A 1 TDO/SWO 2 P0[3]/RXD0/AD0[6] 3 VDD(3V3) 4 P1[4]/ENET_TX_EN 5 P1[10]/ENET_RXD1 6 P1[16]/ENET_MDC 7 VDD(REG)(3V3) 8 P0[4]/I2SRX_CLK/ RD2/CAP2[0] 9 P0[7]/I2STX_CLK/ SCK1/MAT2[1] 10 P0[9]/I2STX_SDA/ MOSI1/MAT2[3] 11 - 12 - Row B 1 TMS/SWDIO 2 RTCK 3 VSS 4 P1[1]/ENET_TXD1 5 P1[9]/ENET_RXD0 6 P1[17]/ ENET_MDIO 7 VSS 8 P0[6]/I2SRX_SDA/ SSEL1/MAT2[0] 9 P2[0]/PWM1[1]/TXD1 10 P2[1]/PWM1[2]/RXD1 11 - 12 - Row C 1 TCK/SWDCLK 2 TRST 3 TDI 4 P0[2]/TXD0/AD0[7] 5 P1[8]/ENET_CRS 6 P1[15]/ ENET_REF_CLK 7 P4[28]/RX_MCLK/ MAT2[0]/TXD3 8 P0[8]/I2STX_WS/ MISO1/MAT2[2] 9 VSS 10 VDD(3V3) 11 - 12 - Row D 1 P0[24]/AD0[1]/ I2SRX_WS/CAP3[1] 2 P0[25]/AD0[2]/ I2SRX_SDA/TXD3 3 P0[26]/AD0[3]/ AOUT/RXD3 4 n.c. 5 P1[0]/ENET_TXD0 6 P1[14]/ENET_RX_ER 7 P0[5]/I2SRX_WS/ TD2/CAP2[1] 8 P2[2]/PWM1[3]/ CTS1/TRACEDATA[3] 9 P2[4]/PWM1[5]/ DSR1/TRACEDATA[1] 10 P2[5]/PWM1[6]/ DTR1/TRACEDATA[0] 11 - 12 - Row E 1 VSSA 2 VDDA 3 VREFP 4 n.c. 5 P0[23]/AD0[0]/ I2SRX_CLK/CAP3[0] 6 P4[29]/TX_MCLK/ MAT2[1]/RXD3 7 P2[3]/PWM1[4]/ DCD1/TRACEDATA[2] 8 P2[6]/PCAP1[0]/ RI1/TRACECLK LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 9 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 9 P2[7]/RD2/RTS1 10 P2[8]/TD2/TXD2 11 - 12 - Row F 1 VREFN 2 RTCX1 3 RESET 4 P1[31]/SCK1/ AD0[5] 5 P1[21]/MCABORT/ PWM1[3]/SSEL0 6 P0[18]/DCD1/ MOSI0/MOSI 7 P2[9]/USB_CONNECT/ RXD2 8 P0[16]/RXD1/ SSEL0/SSEL 9 P0[17]/CTS1/ MISO0/MISO 10 P0[15]/TXD1/ SCK0/SCK 11 - 12 - Row G 1 RTCX2 2 VBAT 3 XTAL2 4 P0[30]/USB_D 5 P1[25]/MCOA1/ MAT1[1] 6 P1[29]/MCOB2/ PCAP1[1]/MAT0[1] 7 VSS 8 P0[21]/RI1/RD1 9 P0[20]/DTR1/SCL1 10 P0[19]/DSR1/SDA1 11 - 12 - Row H 1 P1[30]/VBUS/ AD0[4] 2 XTAL1 3 P3[25]/MAT0[0]/ PWM1[2] 4 P1[18]/USB_UP_LED/ PWM1[1]/CAP1[0] 5 P1[24]/MCI2/ PWM1[5]/MOSI0 6 VDD(REG)(3V3) 7 P0[10]/TXD2/ SDA2/MAT3[0] 8 P2[11]/EINT1/ I2STX_CLK 9 VDD(3V3) 10 P0[22]/RTS1/TD1 11 - 12 - Table 4. Pin allocation table TFBGA100 …continued Pin Symbol Pin Symbol Pin Symbol Pin Symbol LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 10 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 7.2 Pin description Row J 1 P0[28]/SCL0/ USB_SCL 2 P0[27]/SDA0/ USB_SDA 3 P0[29]/USB_D+ 4 P1[19]/MCOA0/ USB_PPWR/ CAP1[1] 5 P1[22]/MCOB0/ USB_PWRD/ MAT1[0] 6 VSS 7 P1[28]/MCOA2/ PCAP1[0]/ MAT0[0] 8 P0[1]/TD1/RXD3/SCL1 9 P2[13]/EINT3/ I2STX_SDA 10 P2[10]/EINT0/NMI 11 - 12 - Row K 1 P3[26]/STCLK/ MAT0[1]/PWM1[3] 2 VDD(3V3) 3 VSS 4 P1[20]/MCI0/ PWM1[2]/SCK0 5 P1[23]/MCI1/ PWM1[4]/MISO0 6 P1[26]/MCOB1/ PWM1[6]/CAP0[0] 7 P1[27]/CLKOUT /USB_OVRCR/ CAP0[1] 8 P0[0]/RD1/TXD3/SDA1 9 P0[11]/RXD2/ SCL2/MAT3[1] 10 P2[12]/EINT2/ I2STX_WS 11 - 12 - Table 4. Pin allocation table TFBGA100 …continued Pin Symbol Pin Symbol Pin Symbol Pin Symbol Table 5. Pin description Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 P0[0] to P0[31] I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the pin connect block. Pins 12, 13, 14, and 31 of this port are not available. P0[0]/RD1/TXD3/ SDA1 46 K8 H10 [1] I/O P0[0] — General purpose digital input/output pin. I RD1 — CAN1 receiver input. (LPC1769/68/66/65/64 only). O TXD3 — Transmitter output for UART3. I/O SDA1 — I2C1 data input/output. (This is not an I2C-bus compliant open-drain pin). P0[1]/TD1/RXD3/ SCL1 47 J8 H9 [1] I/O P0[1] — General purpose digital input/output pin. O TD1 — CAN1 transmitter output. (LPC1769/68/66/65/64 only). I RXD3 — Receiver input for UART3. I/O SCL1 — I2C1 clock input/output. (This is not an I2C-bus compliant open-drain pin). P0[2]/TXD0/AD0[7] 98 C4 B1 [2] I/O P0[2] — General purpose digital input/output pin. O TXD0 — Transmitter output for UART0. I AD0[7] — A/D converter 0, input 7. P0[3]/RXD0/AD0[6] 99 A2 C3 [2] I/O P0[3] — General purpose digital input/output pin. I RXD0 — Receiver input for UART0. I AD0[6] — A/D converter 0, input 6. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 11 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P0[4]/ I2SRX_CLK/ RD2/CAP2[0] 81 A8 G2 [1] I/O P0[4] — General purpose digital input/output pin. I/O I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). I RD2 — CAN2 receiver input. (LPC1769/68/66/65/64 only). I CAP2[0] — Capture input for Timer 2, channel 0. P0[5]/ I2SRX_WS/ TD2/CAP2[1] 80 D7 H1 [1] I/O P0[5] — General purpose digital input/output pin. I/O I2SRX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). O TD2 — CAN2 transmitter output. (LPC1769/68/66/65/64 only). I CAP2[1] — Capture input for Timer 2, channel 1. P0[6]/ I2SRX_SDA/ SSEL1/MAT2[0] 79 B8 G3 [1] I/O P0[6] — General purpose digital input/output pin. I/O I2SRX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). I/O SSEL1 — Slave Select for SSP1. O MAT2[0] — Match output for Timer 2, channel 0. P0[7]/ I2STX_CLK/ SCK1/MAT2[1] 78 A9 J1 [1] I/O P0[7] — General purpose digital input/output pin. I/O I2STX_CLK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). I/O SCK1 — Serial Clock for SSP1. O MAT2[1] — Match output for Timer 2, channel 1. P0[8]/ I2STX_WS/ MISO1/MAT2[2] 77 C8 H2 [1] I/O P0[8] — General purpose digital input/output pin. I/O I2STX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). I/O MISO1 — Master In Slave Out for SSP1. O MAT2[2] — Match output for Timer 2, channel 2. P0[9]/ I2STX_SDA/ MOSI1/MAT2[3] 76 A10 H3 [1] I/O P0[9] — General purpose digital input/output pin. I/O I2STX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). I/O MOSI1 — Master Out Slave In for SSP1. O MAT2[3] — Match output for Timer 2, channel 3. P0[10]/TXD2/ SDA2/MAT3[0] 48 H7 H8 [1] I/O P0[10] — General purpose digital input/output pin. O TXD2 — Transmitter output for UART2. I/O SDA2 — I2C2 data input/output (this is not an open-drain pin). O MAT3[0] — Match output for Timer 3, channel 0. Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 12 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P0[11]/RXD2/ SCL2/MAT3[1] 49 K9 J10 [1] I/O P0[11] — General purpose digital input/output pin. I RXD2 — Receiver input for UART2. I/O SCL2 — I2C2 clock input/output (this is not an open-drain pin). O MAT3[1] — Match output for Timer 3, channel 1. P0[15]/TXD1/ SCK0/SCK 62 F10 H6 [1] I/O P0[15] — General purpose digital input/output pin. O TXD1 — Transmitter output for UART1. I/O SCK0 — Serial clock for SSP0. I/O SCK — Serial clock for SPI. P0[16]/RXD1/ SSEL0/SSEL 63 F8 J5 [1] I/O P0[16] — General purpose digital input/output pin. I RXD1 — Receiver input for UART1. I/O SSEL0 — Slave Select for SSP0. I/O SSEL — Slave Select for SPI. P0[17]/CTS1/ MISO0/MISO 61 F9 K6 [1] I/O P0[17] — General purpose digital input/output pin. I CTS1 — Clear to Send input for UART1. I/O MISO0 — Master In Slave Out for SSP0. I/O MISO — Master In Slave Out for SPI. P0[18]/DCD1/ MOSI0/MOSI 60 F6 J6 [1] I/O P0[18] — General purpose digital input/output pin. I DCD1 — Data Carrier Detect input for UART1. I/O MOSI0 — Master Out Slave In for SSP0. I/O MOSI — Master Out Slave In for SPI. P0[19]/DSR1/ SDA1 59 G10 K7 [1] I/O P0[19] — General purpose digital input/output pin. I DSR1 — Data Set Ready input for UART1. I/O SDA1 — I2C1 data input/output (this is not an I2C-bus compliant open-drain pin). P0[20]/DTR1/SCL1 58 G9 J7 [1] I/O P0[20] — General purpose digital input/output pin. O DTR1 — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal. I/O SCL1 — I2C1 clock input/output (this is not an I2C-bus compliant open-drain pin). P0[21]/RI1/RD1 57 G8 H7 [1] I/O P0[21] — General purpose digital input/output pin. I RI1 — Ring Indicator input for UART1. I RD1 — CAN1 receiver input. (LPC1769/68/66/65/64 only). P0[22]/RTS1/TD1 56 H10 K8 [1] I/O P0[22] — General purpose digital input/output pin. O RTS1 — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal. O TD1 — CAN1 transmitter output. (LPC1769/68/66/65/64 only). Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 13 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P0[23]/AD0[0]/ I2SRX_CLK/ CAP3[0] 9 E5 D5 [2] I/O P0[23] — General purpose digital input/output pin. I AD0[0] — A/D converter 0, input 0. I/O I2SRX_CLK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). I CAP3[0] — Capture input for Timer 3, channel 0. P0[24]/AD0[1]/ I2SRX_WS/ CAP3[1] 8 D1 B4 [2] I/O P0[24] — General purpose digital input/output pin. I AD0[1] — A/D converter 0, input 1. I/O I2SRX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). I CAP3[1] — Capture input for Timer 3, channel 1. P0[25]/AD0[2]/ I2SRX_SDA/ TXD3 7 D2 A3 [2] I/O P0[25] — General purpose digital input/output pin. I AD0[2] — A/D converter 0, input 2. I/O I2SRX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). O TXD3 — Transmitter output for UART3. P0[26]/AD0[3]/ AOUT/RXD3 6 D3 C5 [3] I/O P0[26] — General purpose digital input/output pin. I AD0[3] — A/D converter 0, input 3. O AOUT — DAC output (LPC1769/68/67/66/65/63 only). I RXD3 — Receiver input for UART3. P0[27]/SDA0/ USB_SDA 25 J2 C8 [4] I/O P0[27] — General purpose digital input/output pin. Output is open-drain. I/O SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus compliance). I/O USB_SDA — USB port I2C serial data (OTG transceiver, LPC1769/68/66/65 only). P0[28]/SCL0/ USB_SCL 24 J1 B9 [4] I/O P0[28] — General purpose digital input/output pin. Output is open-drain. I/O SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus compliance). I/O USB_SCL — USB port I2C serial clock (OTG transceiver, LPC1769/68/66/65 only). P0[29]/USB_D+ 29 J3 B10 [5] I/O P0[29] — General purpose digital input/output pin. I/O USB_D+ — USB bidirectional D+ line. (LPC1769/68/66/65/64 only). P0[30]/USB_D 30 G4 C9 [5] I/O P0[30] — General purpose digital input/output pin. I/O USB_D — USB bidirectional D line. (LPC1769/68/66/65/64 only). Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 14 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P1[0] to P1[31] I/O Port 1: Port 1 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block. Pins 2, 3, 5, 6, 7, 11, 12, and 13 of this port are not available. P1[0]/ ENET_TXD0 95 D5 C1 [1] I/O P1[0] — General purpose digital input/output pin. O ENET_TXD0 — Ethernet transmit data 0. (LPC1769/68/67/66/64 only). P1[1]/ ENET_TXD1 94 B4 C2 [1] I/O P1[1] — General purpose digital input/output pin. O ENET_TXD1 — Ethernet transmit data 1. (LPC1769/68/67/66/64 only). P1[4]/ ENET_TX_EN 93 A4 D2 [1] I/O P1[4] — General purpose digital input/output pin. O ENET_TX_EN — Ethernet transmit data enable. (LPC1769/68/67/66/64 only). P1[8]/ ENET_CRS 92 C5 D1 [1] I/O P1[8] — General purpose digital input/output pin. I ENET_CRS — Ethernet carrier sense. (LPC1769/68/67/66/64 only). P1[9]/ ENET_RXD0 91 B5 D3 [1] I/O P1[9] — General purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data. (LPC1769/68/67/66/64 only). P1[10]/ ENET_RXD1 90 A5 E3 [1] I/O P1[10] — General purpose digital input/output pin. I ENET_RXD1 — Ethernet receive data. (LPC1769/68/67/66/64 only). P1[14]/ ENET_RX_ER 89 D6 E2 [1] I/O P1[14] — General purpose digital input/output pin. I ENET_RX_ER — Ethernet receive error. (LPC1769/68/67/66/64 only). P1[15]/ ENET_REF_CLK 88 C6 E1 [1] I/O P1[15] — General purpose digital input/output pin. I ENET_REF_CLK — Ethernet reference clock. (LPC1769/68/67/66/64 only). P1[16]/ ENET_MDC 87 A6 F3 [1] I/O P1[16] — General purpose digital input/output pin. O ENET_MDC — Ethernet MIIM clock (LPC1769/68/67/66/64 only). P1[17]/ ENET_MDIO 86 B6 F2 [1] I/O P1[17] — General purpose digital input/output pin. I/O ENET_MDIO — Ethernet MIIM data input and output. (LPC1769/68/67/66/64 only). Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 15 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P1[18]/ USB_UP_LED/ PWM1[1]/ CAP1[0] 32 H4 D9 [1] I/O P1[18] — General purpose digital input/output pin. O USB_UP_LED — USB GoodLink LED indicator. It is LOW when the device is configured (non-control endpoints enabled), or when the host is enabled and has detected a device on the bus. It is HIGH when the device is not configured, or when host is enabled and has not detected a device on the bus, or during global suspend. It transitions between LOW and HIGH (flashes) when the host is enabled and detects activity on the bus. (LPC1769/68/66/65/64 only). O PWM1[1] — Pulse Width Modulator 1, channel 1 output. I CAP1[0] — Capture input for Timer 1, channel 0. P1[19]/MCOA0/ USB_PPWR/ CAP1[1] 33 J4 C10 [1] I/O P1[19] — General purpose digital input/output pin. O MCOA0 — Motor control PWM channel 0, output A. O USB_PPWR — Port Power enable signal for USB port. (LPC1769/68/66/65 only). I CAP1[1] — Capture input for Timer 1, channel 1. P1[20]/MCI0/ PWM1[2]/SCK0 34 K4 E8 [1] I/O P1[20] — General purpose digital input/output pin. I MCI0 — Motor control PWM channel 0, input. Also Quadrature Encoder Interface PHA input. O PWM1[2] — Pulse Width Modulator 1, channel 2 output. I/O SCK0 — Serial clock for SSP0. P1[21]/MCABORT/ PWM1[3]/ SSEL0 35 F5 E9 [1] I/O P1[21] — General purpose digital input/output pin. O MCABORT — Motor control PWM, LOW-active fast abort. O PWM1[3] — Pulse Width Modulator 1, channel 3 output. I/O SSEL0 — Slave Select for SSP0. P1[22]/MCOB0/ USB_PWRD/ MAT1[0] 36 J5 D10 [1] I/O P1[22] — General purpose digital input/output pin. O MCOB0 — Motor control PWM channel 0, output B. I USB_PWRD — Power Status for USB port (host power switch, LPC1769/68/66/65 only). O MAT1[0] — Match output for Timer 1, channel 0. P1[23]/MCI1/ PWM1[4]/MISO0 37 K5 E7 [1] I/O P1[23] — General purpose digital input/output pin. I MCI1 — Motor control PWM channel 1, input. Also Quadrature Encoder Interface PHB input. O PWM1[4] — Pulse Width Modulator 1, channel 4 output. I/O MISO0 — Master In Slave Out for SSP0. P1[24]/MCI2/ PWM1[5]/MOSI0 38 H5 F8 [1] I/O P1[24] — General purpose digital input/output pin. I MCI2 — Motor control PWM channel 2, input. Also Quadrature Encoder Interface INDEX input. O PWM1[5] — Pulse Width Modulator 1, channel 5 output. I/O MOSI0 — Master Out Slave in for SSP0. Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 16 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P1[25]/MCOA1/ MAT1[1] 39 G5 F9 [1] I/O P1[25] — General purpose digital input/output pin. O MCOA1 — Motor control PWM channel 1, output A. O MAT1[1] — Match output for Timer 1, channel 1. P1[26]/MCOB1/ PWM1[6]/CAP0[0] 40 K6 E10 [1] I/O P1[26] — General purpose digital input/output pin. O MCOB1 — Motor control PWM channel 1, output B. O PWM1[6] — Pulse Width Modulator 1, channel 6 output. I CAP0[0] — Capture input for Timer 0, channel 0. P1[27]/CLKOUT /USB_OVRCR/ CAP0[1] 43 K7 G9 [1] I/O P1[27] — General purpose digital input/output pin. O CLKOUT — Clock output pin. I USB_OVRCR — USB port Over-Current status. (LPC1769/68/66/65 only). I CAP0[1] — Capture input for Timer 0, channel 1. P1[28]/MCOA2/ PCAP1[0]/ MAT0[0] 44 J7 G10 [1] I/O P1[28] — General purpose digital input/output pin. O MCOA2 — Motor control PWM channel 2, output A. I PCAP1[0] — Capture input for PWM1, channel 0. O MAT0[0] — Match output for Timer 0, channel 0. P1[29]/MCOB2/ PCAP1[1]/ MAT0[1] 45 G6 G8 [1] I/O P1[29] — General purpose digital input/output pin. O MCOB2 — Motor control PWM channel 2, output B. I PCAP1[1] — Capture input for PWM1, channel 1. O MAT0[1] — Match output for Timer 0, channel 1. P1[30]/VBUS/ AD0[4] 21 H1 B8 [2] I/O P1[30] — General purpose digital input/output pin. I VBUS — Monitors the presence of USB bus power. (LPC1769/68/66/65/64 only). Note: This signal must be HIGH for USB reset to occur. I AD0[4] — A/D converter 0, input 4. P1[31]/SCK1/ AD0[5] 20 F4 C7 [2] I/O P1[31] — General purpose digital input/output pin. I/O SCK1 — Serial Clock for SSP1. I AD0[5] — A/D converter 0, input 5. P2[0] to P2[31] I/O Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 2 pins depends upon the pin function selected via the pin connect block. Pins 14 through 31 of this port are not available. P2[0]/PWM1[1]/ TXD1 75 B9 K1 [1] I/O P2[0] — General purpose digital input/output pin. O PWM1[1] — Pulse Width Modulator 1, channel 1 output. O TXD1 — Transmitter output for UART1. P2[1]/PWM1[2]/ RXD1 74 B10 J2 [1] I/O P2[1] — General purpose digital input/output pin. O PWM1[2] — Pulse Width Modulator 1, channel 2 output. I RXD1 — Receiver input for UART1. Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 17 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P2[2]/PWM1[3]/ CTS1/ TRACEDATA[3] 73 D8 K2 [1] I/O P2[2] — General purpose digital input/output pin. O PWM1[3] — Pulse Width Modulator 1, channel 3 output. I CTS1 — Clear to Send input for UART1. O TRACEDATA[3] — Trace data, bit 3. P2[3]/PWM1[4]/ DCD1/ TRACEDATA[2] 70 E7 K3 [1] I/O P2[3] — General purpose digital input/output pin. O PWM1[4] — Pulse Width Modulator 1, channel 4 output. I DCD1 — Data Carrier Detect input for UART1. O TRACEDATA[2] — Trace data, bit 2. P2[4]/PWM1[5]/ DSR1/ TRACEDATA[1] 69 D9 J3 [1] I/O P2[4] — General purpose digital input/output pin. O PWM1[5] — Pulse Width Modulator 1, channel 5 output. I DSR1 — Data Set Ready input for UART1. O TRACEDATA[1] — Trace data, bit 1. P2[5]/PWM1[6]/ DTR1/ TRACEDATA[0] 68 D10 H4 [1] I/O P2[5] — General purpose digital input/output pin. O PWM1[6] — Pulse Width Modulator 1, channel 6 output. O DTR1 — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal. O TRACEDATA[0] — Trace data, bit 0. P2[6]/PCAP1[0]/ RI1/TRACECLK 67 E8 K4 [1] I/O P2[6] — General purpose digital input/output pin. I PCAP1[0] — Capture input for PWM1, channel 0. I RI1 — Ring Indicator input for UART1. O TRACECLK — Trace Clock. P2[7]/RD2/ RTS1 66 E9 J4 [1] I/O P2[7] — General purpose digital input/output pin. I RD2 — CAN2 receiver input. (LPC1769/68/66/65/64 only). O RTS1 — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal. P2[8]/TD2/ TXD2 65 E10 H5 [1] I/O P2[8] — General purpose digital input/output pin. O TD2 — CAN2 transmitter output. (LPC1769/68/66/65/64 only). O TXD2 — Transmitter output for UART2. P2[9]/ USB_CONNECT/ RXD2 64 F7 K5 [1] I/O P2[9] — General purpose digital input/output pin. O USB_CONNECT — Signal used to switch an external 1.5 k resistor under software control. Used with the SoftConnect USB feature. (LPC1769/68/66/65/64 only). I RXD2 — Receiver input for UART2. P2[10]/EINT0/NMI 53 J10 K9 [6] I/O P2[10] — General purpose digital input/output pin. A LOW level on this pin during reset starts the ISP command handler. I EINT0 — External interrupt 0 input. I NMI — Non-maskable interrupt input. Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 18 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller P2[11]/EINT1/ I2STX_CLK 52 H8 J8 [6] I/O P2[11] — General purpose digital input/output pin. I EINT1 — External interrupt 1 input. I/O I2STX_CLK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). P2[12]/EINT2/ I2STX_WS 51 K10 K10 [6] I/O P2[12] — General purpose digital input/output pin. I EINT2 — External interrupt 2 input. I/O I2STX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). P2[13]/EINT3/ I2STX_SDA 50 J9 J9 [6] I/O P2[13] — General purpose digital input/output pin. I EINT3 — External interrupt 3 input. I/O I2STX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. (LPC1769/68/67/66/65/63 only). P3[0] to P3[31] I/O Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the pin connect block. Pins 0 through 24, and 27 through 31 of this port are not available. P3[25]/MAT0[0]/ PWM1[2] 27 H3 D8 [1] I/O P3[25] — General purpose digital input/output pin. O MAT0[0] — Match output for Timer 0, channel 0. O PWM1[2] — Pulse Width Modulator 1, output 2. P3[26]/STCLK/ MAT0[1]/PWM1[3] 26 K1 A10 [1] I/O P3[26] — General purpose digital input/output pin. I STCLK — System tick timer clock input. The maximum STCLK frequency is 1/4 of the ARM processor clock frequency CCLK. O MAT0[1] — Match output for Timer 0, channel 1. O PWM1[3] — Pulse Width Modulator 1, output 3. P4[0] to P4[31] I/O Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 4 pins depends upon the pin function selected via the pin connect block. Pins 0 through 27, 30, and 31 of this port are not available. P4[28]/RX_MCLK/ MAT2[0]/TXD3 82 C7 G1 [1] I/O P4[28] — General purpose digital input/output pin. O RX_MCLK — I2S receive master clock. (LPC1769/68/67/66/65 only). O MAT2[0] — Match output for Timer 2, channel 0. O TXD3 — Transmitter output for UART3. P4[29]/TX_MCLK/ MAT2[1]/RXD3 85 E6 F1 [1] I/O P4[29] — General purpose digital input/output pin. O TX_MCLK — I2S transmit master clock. (LPC1769/68/67/66/65 only). O MAT2[1] — Match output for Timer 2, channel 1. I RXD3 — Receiver input for UART3. Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 19 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller TDO/SWO 1 A1 A1 [1][7] O TDO — Test Data out for JTAG interface. O SWO — Serial wire trace output. TDI 2 C3 C4 [1][8] I TDI — Test Data in for JTAG interface. TMS/SWDIO 3 B1 B3 [1][8] I TMS — Test Mode Select for JTAG interface. I/O SWDIO — Serial wire debug data input/output. TRST 4 C2 A2 [1][8] I TRST — Test Reset for JTAG interface. TCK/SWDCLK 5 C1 D4 [1][7] I TCK — Test Clock for JTAG interface. I SWDCLK — Serial wire clock. RTCK 100 B2 B2 [1][7] O RTCK — JTAG interface control signal. RSTOUT 14 - - - O RSTOUT — This is a 3.3 V pin. LOW on this pin indicates the microcontroller being in Reset state. RESET 17 F3 C6 [9] I External reset input: A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. XTAL1 22 H2 D7 [10][11] I Input to the oscillator circuit and internal clock generator circuits. XTAL2 23 G3 A9 [10][11] O Output from the oscillator amplifier. RTCX1 16 F2 A7 [10][11] I Input to the RTC oscillator circuit. RTCX2 18 G1 B7 [10] O Output from the RTC oscillator circuit. VSS 31, 41, 55, 72, 83, 97 B3, B7, C9, G7, J6, K3 E5, F5, F6, G5, G6, G7 [10] I ground: 0 V reference. VSSA 11 E1 B5 [10] I analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. VDD(3V3) 28, 54, 71, 96 K2, H9, C10 , A3 E4, E6, F7, G4 [10] I 3.3 V supply voltage: This is the power supply voltage for the I/O ports. VDD(REG)(3V3) 42, 84 H6, A7 F4, F0 [10] I 3.3 V voltage regulator supply voltage: This is the supply voltage for the on-chip voltage regulator only. VDDA 10 E2 A4 [10] I analog 3.3 V pad supply voltage: This should be nominally the same voltage as VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC. This pin should be tied to 3.3 V if the ADC and DAC are not used. VREFP 12 E3 A5 [10] I ADC positive reference voltage: This should be nominally the same voltage as VDDA but should be isolated to minimize noise and error. Level on this pin is used as a reference for ADC and DAC. This pin should be tied to 3.3 V if the ADC and DAC are not used. Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 20 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller [1] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. This pin is pulled up to a voltage level of 2.3 V to 2.6 V. [2] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant. This pin is pulled up to a voltage level of 2.3 V to 2.6 V. [3] 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the pad is disabled. This pin is pulled up to a voltage level of 2.3 V to 2.6 V. [4] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [5] Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). This pad is not 5 V tolerant. [6] 5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. This pin is pulled up to a voltage level of 2.3 V to 2.6 V. [7] 5 V tolerant pad with TTL levels and hysteresis. Internal pull-up and pull-down resistors disabled. [8] 5 V tolerant pad with TTL levels and hysteresis and internal pull-up resistor. [9] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis. [10] Pad provides special analog functionality. A 32 kHz crystal oscillator must be used with the RTC. [11] When the system oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTAL2 should be left floating. [12] When the RTC is not used, connect VBAT to VDD(REG)(3V3) and leave RTCX1 floating. VREFN 15 F1 A6 I ADC negative reference voltage: This should be nominally the same voltage as VSS but should be isolated to minimize noise and error. Level on this pin is used as a reference for ADC and DAC. VBAT 19 G2 A8 [10][12] I RTC pin power supply: 3.3 V on this pin supplies the power to the RTC peripheral. n.c. 13 D4, E4 B6, D6 - not connected. Table 5. Pin description …continued Symbol Pin/ball Type Description LQFP100 TFBGA100 WLCSP100 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 21 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8. Functional description 8.1 Architectural overview Remark: In the following, the notation LPC17xx refers to all parts: LPC1769/68/67/66/65/64/63. The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and the D-code bus (see Figure 1). The I-code and D-code core buses are faster than the system bus and are used similarly to TCM interfaces: one bus dedicated for instruction fetch (I-code) and one bus for data access (D-code). The use of two core buses allows for simultaneous operations if concurrent operations target different devices. The LPC17xx use a multi-layer AHB matrix to connect the ARM Cortex-M3 buses and other bus masters to peripherals in a flexible manner that optimizes performance by allowing peripherals that are on different slaves ports of the matrix to be accessed simultaneously by different bus masters. 8.2 ARM Cortex-M3 processor The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high performance and very low power consumption. The ARM Cortex-M3 offers many new features, including a Thumb-2 instruction set, low interrupt latency, hardware divide, interruptible/continuable multiple load and store instructions, automatic state save and restore for interrupts, tightly integrated interrupt controller with wake-up interrupt controller, and multiple core buses capable of simultaneous accesses. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical Reference Manual that can be found on official ARM website. 8.3 On-chip flash program memory The LPC17xx contain up to 512 kB of on-chip flash memory. A new two-port flash accelerator maximizes performance for use with the two fast AHB-Lite buses. 8.4 On-chip SRAM The LPC17xx contain a total of 64 kB on-chip static RAM memory. This includes the main 32 kB SRAM, accessible by the CPU and DMA controller on a higher-speed bus, and two additional 16 kB each SRAM blocks situated on a separate slave port on the AHB multilayer matrix. This architecture allows CPU and DMA accesses to be spread over three separate RAMs that can be accessed simultaneously. 8.5 Memory Protection Unit (MPU) The LPC17xx have a Memory Protection Unit (MPU) which can be used to improve the reliability of an embedded system by protecting critical data within the user application. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 22 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller The MPU allows separating processing tasks by disallowing access to each other's data, disabling access to memory regions, allowing memory regions to be defined as read-only and detecting unexpected memory accesses that could potentially break the system. The MPU separates the memory into distinct regions and implements protection by preventing disallowed accesses. The MPU supports up to 8 regions each of which can be divided into 8 subregions. Accesses to memory locations that are not defined in the MPU regions, or not permitted by the region setting, will cause the Memory Management Fault exception to take place. 8.6 Memory map The LPC17xx incorporates several distinct memory regions, shown in the following figures. Figure 5 shows the overall map of the entire address space from the user program viewpoint following reset. The interrupt vector area supports address remapping. The AHB peripheral area is 2 MB in size and is divided to allow for up to 128 peripherals. The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals. Each peripheral of either type is allocated 16 kB of space. This allows simplifying the address decoding for each peripheral. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 23 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller (1) Not available on all parts. See Table 2. Fig 5. LPC17xx memory map 0x5000 0000 0x5000 4000 0x5000 8000 0x5000 C000 0x5020 0000 0x5001 0000 AHB peripherals Ethernet controller(1) USB controller(1) reserved 127- 4 reserved GPDMA controller 0 1 2 3 APB0 peripherals 0x4000 4000 0x4000 8000 0x4000 C000 0x4001 0000 0x4001 8000 0x4002 0000 0x4002 8000 0x4002 C000 0x4003 4000 0x4003 0000 0x4003 8000 0x4003 C000 0x4004 0000 0x4004 4000 0x4004 8000 0x4004 C000 0x4005 C000 0x4006 0000 0x4008 0000 0x4002 4000 0x4001 C000 0x4001 4000 WDT 0x4000 0000 timer 0 timer 1 UART0 UART1 reserved reserved SPI RTC + backup registers GPIO interrupts pin connect SSP1 ADC CAN AF RAM(1) CAN AF registers(1) CAN common(1) CAN1(1) CAN2(1) 22 - 19 reserved I2C1 31 - 24 reserved 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 23 reserved reserved 32 kB local SRAM (LPC1769/8/7/6/5/3) 16 kB local SRAM (LPC1764) reserved reserved private peripheral bus 0 GB 0x0000 0000 0.5 GB 4 GB 1 GB 0x0004 0000 0x0002 0000 0x0008 0000 0x1000 4000 0x1000 0000 0x1000 8000 0x1FFF 0000 0x1FFF 2000 0x2008 0000 0x2007 C000 0x2008 4000 0x2200 0000 0x200A 0000 0x2009 C000 0x2400 0000 0x4000 0000 0x4008 0000 0x4010 0000 0x4200 0000 0x4400 0000 0x5000 0000 0x5020 0000 0xE000 0000 0xE010 0000 0xFFFF FFFF reserved reserved GPIO reserved reserved reserved reserved APB0 peripherals AHB peripherals APB1 peripherals AHB SRAM bit-band alias addressing peripheral bit-band alias addressing 16 kB AHB SRAM1 (LPC1769/8/7/6/5) 16 kB AHB SRAM0 256 kB on-chip flash (LPC1766/65/63) 128 kB on-chip flash (LPC1764) 512 kB on-chip flash (LPC1769/8/7) PWM1 8 kB boot ROM 0x0000 0000 0x0000 0400 active interrupt vectors + 256 words I-code/D-code memory space 002aad946 APB1 peripherals 0x4008 0000 0x4008 8000 0x4008 C000 0x4009 0000 0x4009 4000 0x4009 8000 0x4009 C000 0x400A 0000 0x400A 4000 0x400A 8000 0x400A C000 0x400B 0000 0x400B 4000 0x400B 8000 0x400B C000 0x400C 0000 0x400F C000 0x4010 0000 SSP0 DAC(1) timer 2 timer 3 UART2 UART3 reserved I2S(1) I2C2 1 - 0 reserved 2 3 4 5 6 7 8 9 10 reserved repetitive interrupt timer 11 12 reserved motor control PWM 30 - 16 reserved 13 14 15 31 system control QEI LPC1769/68/67/66/65/64/63 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 24 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.7 Nested Vectored Interrupt Controller (NVIC) The NVIC is an integral part of the Cortex-M3. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 8.7.1 Features • Controls system exceptions and peripheral interrupts • In the LPC17xx, the NVIC supports 33 vectored interrupts • 32 programmable interrupt priority levels, with hardware priority level masking • Relocatable vector table • Non-Maskable Interrupt (NMI) • Software interrupt generation 8.7.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any pin on Port 0 and Port 2 (total of 42 pins) regardless of the selected function, can be programmed to generate an interrupt on a rising edge, a falling edge, or both. 8.8 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. Most pins can also be configured as open-drain outputs or to have a pull-up, pull-down, or no resistor enabled. 8.9 General purpose DMA controller The GPDMA is an AMBA AHB compliant peripheral allowing selected peripherals to have DMA support. The GPDMA enables peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. The source and destination areas can each be either a memory region or a peripheral, and can be accessed through the AHB master. The GPDMA controller allows data transfers between the USB and Ethernet controllers and the various on-chip SRAM areas. The supported APB peripherals are SSP0/1, all UARTs, the I2S-bus interface, the ADC, and the DAC. Two match signals for each timer can be used to trigger DMA transfers. Remark: The Ethernet controller is available on parts LPC1769/68/67/66/64. The USB controller is available on parts LPC1769/68/66/65/64. The I2S-bus interface is available on parts LPC1769/68/67/66/65. The DAC is available on parts LPC1769/68/67/66/65/63. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 25 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.9.1 Features • Eight DMA channels. Each channel can support an unidirectional transfer. • 16 DMA request lines. • Single DMA and burst DMA request signals. Each peripheral connected to the DMA Controller can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the DMA Controller. • Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers are supported. • Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. • Hardware DMA channel priority. • AHB slave DMA programming interface. The DMA Controller is programmed by writing to the DMA control registers over the AHB slave interface. • One AHB bus master for transferring data. The interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. • Internal four-word FIFO per channel. • Supports 8, 16, and 32-bit wide transactions. • Big-endian and little-endian support. The DMA Controller defaults to little-endian mode on reset. • An interrupt to the processor can be generated on a DMA completion or when a DMA error has occurred. • Raw interrupt status. The DMA error and DMA count raw interrupt status can be read prior to masking. 8.10 Fast general purpose parallel I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC17xx use accelerated GPIO functions: • GPIO registers are accessed through the AHB multilayer bus so that the fastest possible I/O timing can be achieved. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All GPIO registers are byte and half-word addressable. • Entire port value can be written in one instruction. • Support for Cortex-M3 bit banding. • Support for use with the GPDMA controller. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 26 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Additionally, any pin on Port 0 and Port 2 (total of 42 pins) providing a digital function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous, so it may operate when clocks are not present such as during Power-down mode. Each enabled interrupt can be used to wake up the chip from Power-down mode. 8.10.1 Features • Bit level set and clear registers allow a single instruction to set or clear any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs after reset. • Pull-up/pull-down resistor configuration and open-drain configuration can be programmed through the pin connect block for each GPIO pin. 8.11 Ethernet Remark: The Ethernet controller is available on parts LPC1769/68/67/66/64. The Ethernet block supports bus clock rates of up to 100 MHz (LPC1768/67/66/64) or 120 MHz (LPC1769). See Table 2. The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU. The Ethernet block and the CPU share the ARM Cortex-M3 D-code and system bus through the AHB-multilayer matrix to access the various on-chip SRAM blocks for Ethernet data, control, and status information. The Ethernet block interfaces between an off-chip Ethernet PHY using the Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus. 8.11.1 Features • Ethernet standards support: – Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. – Fully compliant with IEEE standard 802.3. – Fully compliant with 802.3x full duplex flow control and half duplex back pressure. – Flexible transmit and receive frame options. – Virtual Local Area Network (VLAN) frame support. • Memory management: – Independent transmit and receive buffers memory mapped to shared SRAM. – DMA managers with scatter/gather DMA and arrays of frame descriptors. – Memory traffic optimized by buffering and pre-fetching. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 27 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller • Enhanced Ethernet features: – Receive filtering. – Multicast and broadcast frame support for both transmit and receive. – Optional automatic Frame Check Sequence (FCS) insertion with Cyclic Redundancy Check (CRC) for transmit. – Selectable automatic transmit frame padding. – Over-length frame support for both transmit and receive allows any length frames. – Promiscuous receive mode. – Automatic collision back-off and frame retransmission. – Includes power management by clock switching. – Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter. • Physical interface: – Attachment of external PHY chip through standard RMII interface. – PHY register access is available via the MIIM interface. 8.12 USB interface Remark: The USB controller is available as device/Host/OTG controller on parts LPC1769/68/66/65 and as device-only controller on part LPC1764. The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller. The USB interface includes a device, Host, and OTG controller with on-chip PHY for device and Host functions. The OTG switching protocol is supported through the use of an external controller. Details on typical USB interfacing solutions can be found in Section 15.1. 8.12.1 USB device controller The device controller enables 12 Mbit/s data exchange with a USB Host controller. It consists of a register interface, serial interface engine, endpoint buffer memory, and a DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. When enabled, the DMA controller transfers data between the endpoint buffer and the on-chip SRAM. 8.12.1.1 Features • Fully compliant with USB 2.0 specification (full speed). • Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM. • Supports Control, Bulk, Interrupt and Isochronous endpoints. • Scalable realization of endpoints at run time. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 28 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller • Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time. • Supports SoftConnect and GoodLink features. • While USB is in the Suspend mode, the part can enter one of the reduced power modes and wake up on USB activity. • Supports DMA transfers with all on-chip SRAM blocks on all non-control endpoints. • Allows dynamic switching between CPU-controlled slave and DMA modes. • Double buffer implementation for Bulk and Isochronous endpoints. 8.12.2 USB host controller The host controller enables full- and low-speed data exchange with USB devices attached to the bus. It consists of a register interface, a serial interface engine, and a DMA controller. The register interface complies with the OHCI specification. 8.12.2.1 Features • OHCI compliant. • One downstream port. • Supports port power switching. 8.12.3 USB OTG controller USB OTG is a supplement to the USB 2.0 specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. The OTG Controller integrates the host controller, device controller, and a master-only I2C-bus interface to implement OTG dual-role device functionality. The dedicated I2C-bus interface controls an external OTG transceiver. 8.12.3.1 Features • Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision 1.0a. • Hardware support for Host Negotiation Protocol (HNP). • Includes a programmable timer required for HNP and Session Request Protocol (SRP). • Supports any OTG transceiver compliant with the OTG Transceiver Specification (CEA-2011), Rev. 1.0. 8.13 CAN controller and acceptance filters Remark: The CAN controllers are available on parts LPC1769/68/66/65/64. See Table 2. The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low cost multiplex wiring. The CAN block is intended to support multiple CAN buses simultaneously, allowing the device to be used as a gateway, switch, or router among a number of CAN buses in industrial or automotive applications. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 29 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.13.1 Features • Two CAN controllers and buses. • Data rates to 1 Mbit/s on each bus. • 32-bit register and RAM access. • Compatible with CAN specification 2.0B, ISO 11898-1. • Global Acceptance Filter recognizes standard (11-bit) and extended-frame (29-bit) receive identifiers for all CAN buses. • Acceptance Filter can provide FullCAN-style automatic reception for selected Standard Identifiers. • FullCAN messages can generate interrupts. 8.14 12-bit ADC The LPC17xx contain a single 12-bit successive approximation ADC with eight channels and DMA support. 8.14.1 Features • 12-bit successive approximation ADC. • Input multiplexing among 8 pins. • Power-down mode. • Measurement range VREFN to VREFP. • 12-bit conversion rate: 200 kHz. • Individual channels can be selected for conversion. • Burst conversion mode for single or multiple inputs. • Optional conversion on transition of input pin or Timer Match signal. • Individual result registers for each ADC channel to reduce interrupt overhead. • DMA support. 8.15 10-bit DAC The DAC allows to generate a variable analog output. The maximum output value of the DAC is VREFP. Remark: The DAC is available on parts LPC1769/68/67/66/65/63. See Table 2. 8.15.1 Features • 10-bit DAC • Resistor string architecture • Buffered output • Power-down mode • Selectable output drive • Dedicated conversion timer • DMA support LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 30 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.16 UARTs The LPC17xx each contain four UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface and support for RS-485/9-bit mode allowing both software address detection and automatic address detection using 9-bit mode. The UARTs include a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 8.16.1 Features • Maximum UART data bit rate of 6.25 Mbit/s. • 16 B Receive and Transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). • Support for RS-485/9-bit/EIA-485 mode (UART1). • UART3 includes an IrDA mode to support infrared communication. • All UARTs have DMA support. 8.17 SPI serial I/O controller The LPC17xx contain one SPI controller. SPI is a full duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave always sends 8 bits to 16 bits of data to the master. 8.17.1 Features • Maximum SPI data bit rate of 12.5 Mbit/s • Compliant with SPI specification • Synchronous, serial, full duplex communication • Combined SPI master and slave • Maximum data bit rate of one eighth of the input clock rate • 8 bits to 16 bits per transfer 8.18 SSP serial I/O controller The LPC17xx contain two SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 31 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 8.18.1 Features • Maximum SSP speed of 50 Mbit/s (master) or 8 Mbit/s (slave) • Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National Semiconductor Microwire buses • Synchronous serial communication • Master or slave operation • 8-frame FIFOs for both transmit and receive • 4-bit to 16-bit frame • DMA transfers supported by GPDMA 8.19 I2C-bus serial I/O controllers The LPC17xx each contain three I2C-bus controllers. The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock line (SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. 8.19.1 Features • I2C0 is a standard I2C compliant bus interface with open-drain pins. I2C0 also supports Fast mode plus with bit rates up to 1 Mbit/s. • I2C1 and I2C2 use standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus). • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • All I2C-bus controllers support multiple address recognition and a bus monitor mode. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 32 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.20 I2S-bus serial I/O controllers Remark: The I2S-bus interface is available on parts LPC1769/68/67/66/65/63. See Table 2. The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S-bus connection has one master, which is always the master, and one slave. The I2S-bus interface provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 8.20.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 96 kHz (16, 22.05, 32, 44.1, 48, 96) kHz. • Support for an audio master clock. • Configurable word select period in master mode (separately for I2S-bus input and output). • Two 8-word FIFO data buffers are provided, one for transmit and one for receive. • Generates interrupt requests when buffer levels cross a programmable boundary. • Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block. • Controls include reset, stop and mute options separately for I2S-bus input and I2S-bus output. 8.21 General purpose 32-bit timers/external event counters The LPC17xx include four 32-bit timer/counters. The timer/counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts, generate timed DMA requests, or perform other actions at specified timer values, based on four match registers. Each timer/counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 8.21.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • Counter or timer operation. • Two 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 33 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. • Up to two match registers can be used to generate timed DMA requests. 8.22 Pulse width modulator The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC17xx. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is in addition to these features, and is based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the PWMMR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 8.22.1 Features • One PWM block with Counter or Timer operation (may use the peripheral clock or one of the capture inputs as the clock source). • Seven match registers allow up to 6 single edge controlled or 3 double edge controlled PWM outputs, or a mix of both types. The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 34 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go high at the beginning of each cycle unless the output is a constant low. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard 32-bit timer/counter with a programmable 32-bit prescaler if the PWM mode is not enabled. 8.23 Motor control PWM The motor control PWM is a specialized PWM supporting 3-phase motors and other combinations. Feedback inputs are provided to automatically sense rotor position and use that information to ramp speed up or down. An abort input is also provided that causes the PWM to immediately release all motor drive outputs. At the same time, the motor control PWM is highly configurable for other generalized timing, counting, capture, and compare applications. 8.24 Quadrature Encoder Interface (QEI) A quadrature encoder, also known as a 2-channel incremental encoder, converts angular displacement into two pulse signals. By monitoring both the number of pulses and the relative phase of the two signals, the user can track the position, direction of rotation, and velocity. In addition, a third channel, or index signal, can be used to reset the position counter. The quadrature encoder interface decodes the digital pulses from a quadrature encoder wheel to integrate position over time and determine direction of rotation. In addition, the QEI can capture the velocity of the encoder wheel. 8.24.1 Features • Tracks encoder position. • Increments/decrements depending on direction. • Programmable for 2 or 4 position counting. • Velocity capture using built-in timer. • Velocity compare function with “less than” interrupt. • Uses 32-bit registers for position and velocity. • Three position compare registers with interrupts. • Index counter for revolution counting. • Index compare register with interrupts. • Can combine index and position interrupts to produce an interrupt for whole and partial revolution displacement. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 35 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller • Digital filter with programmable delays for encoder input signals. • Can accept decoded signal inputs (clk and direction). • Connected to APB. 8.25 Repetitive Interrupt (RI) timer The repetitive interrupt timer provides a free-running 32-bit counter which is compared to a selectable value, generating an interrupt when a match occurs. Any bits of the timer/compare can be masked such that they do not contribute to the match detection. The repetitive interrupt timer can be used to create an interrupt that repeats at predetermined intervals. 8.25.1 Features • 32-bit counter running from PCLK. Counter can be free-running or be reset by a generated interrupt. • 32-bit compare value. • 32-bit compare mask. An interrupt is generated when the counter value equals the compare value, after masking. This allows for combinations not possible with a simple compare. 8.26 ARM Cortex-M3 system tick timer The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate a dedicated SYSTICK exception at a 10 ms interval. In the LPC17xx, this timer can be clocked from the internal AHB clock or from a device pin. 8.27 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 8.27.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 32-bit timer with internal prescaler. • Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  232  4) in multiples of Tcy(WDCLK)  4. • The Watchdog Clock (WDCLK) source can be selected from the Internal RC (IRC) oscillator, the RTC oscillator, or the APB peripheral clock. This gives a wide range of potential timing choices of Watchdog operation under different power reduction LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 36 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller conditions. It also provides the ability to run the WDT from an entirely internal source that is not dependent on an external crystal and its associated components and wiring for increased reliability. • Includes lock/safe feature. 8.28 RTC and backup registers The RTC is a set of counters for measuring time when system power is on, and optionally when it is off. The RTC on the LPC17xx is designed to have extremely low power consumption, i.e. less than 1 A. The RTC will typically run from the main chip power supply, conserving battery power while the rest of the device is powered up. When operating from a battery, the RTC will continue working down to 2.1 V. Battery power can be provided from a standard 3 V Lithium button cell. An ultra-low power 32 kHz oscillator will provide a 1 Hz clock to the time counting portion of the RTC, moving most of the power consumption out of the time counting function. The RTC includes a calibration mechanism to allow fine-tuning the count rate in a way that will provide less than 1 second per day error when operated at a constant voltage and temperature. A clock output function (see Section 8.29.4) makes measuring the oscillator rate easy and accurate. The RTC contains a small set of backup registers (20 bytes) for holding data while the main part of the LPC17xx is powered off. The RTC includes an alarm function that can wake up the LPC17xx from all reduced power modes with a time resolution of 1 s. 8.28.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Dedicated power supply pin can be connected to a battery or to the main 3.3 V. • Periodic interrupts can be generated from increments of any field of the time registers. • Backup registers (20 bytes) powered by VBAT. • RTC power supply is isolated from the rest of the chip. 8.29 Clocking and power control 8.29.1 Crystal oscillators The LPC17xx include three independent oscillators. These are the main oscillator, the IRC oscillator, and the RTC oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Any of the three clock sources can be chosen by software to drive the main PLL and ultimately the CPU. Following reset, the LPC17xx will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 37 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller See Figure 6 for an overview of the LPC17xx clock generation. 8.29.1.1 Internal RC oscillator The IRC may be used as the clock source for the WDT, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is trimmed to 1 % accuracy over the entire voltage and temperature range. Upon power-up or any chip reset, the LPC17xx use the IRC as the clock source. Software may later switch to one of the other available clock sources. 8.29.1.2 Main oscillator The main oscillator can be used as the clock source for the CPU, with or without using the PLL. The main oscillator also provides the clock source for the dedicated USB PLL. The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the main PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock frequency is referred to as CCLK elsewhere in this document. The frequencies of PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 8.29.2 for additional information. 8.29.1.3 RTC oscillator The RTC oscillator can be used as the clock source for the RTC block, the main PLL, and/or the CPU. Fig 6. LPC17xx clocking generation block diagram MAIN OSCILLATOR INTERNAL RC OSCILLATOR RTC OSCILLATOR MAIN PLL WATCHDOG TIMER REAL-TIME CLOCK CPU CLOCK DIVIDER PERIPHERAL CLOCK GENERATOR USB BLOCK ARM CORTEX-M3 ETHERNET BLOCK DMA GPIO NVIC USB CLOCK DIVIDER system clock select (CLKSRCSEL) USB clock config (USBCLKCFG) CPU clock config (CCLKCFG) pllclk CCLK/8 CCLK/6 CCLK/4 CCLK/2 CCLK pclkWDT rtclk = 1Hz usbclk (48 MHz) cclk USB PLL USB PLL enable main PLL enable 32 kHz APB peripherals LPC17xx 002aad947 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 38 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.29.2 Main PLL (PLL0) The PLL0 accepts an input clock frequency in the range of 32 kHz to 25 MHz. The input frequency is multiplied up to a high frequency, then divided down to provide the actual clock used by the CPU and/or the USB block. The PLL0 input, in the range of 32 kHz to 25 MHz, may initially be divided down by a value ‘N’, which may be in the range of 1 to 256. This input division provides a wide range of output frequencies from the same input frequency. Following the PLL0 input divider is the PLL0 multiplier. This can multiply the input divider output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to 550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a phase-frequency detector to compare the divided CCO output to the multiplier input. The error value is used to adjust the CCO frequency. The PLL0 is turned off and bypassed following a chip Reset and by entering Power-down mode. PLL0 is enabled by software only. The program must configure and activate the PLL0, wait for the PLL0 to lock, and then connect to the PLL0 as a clock source. 8.29.3 USB PLL (PLL1) The LPC17xx contain a second, dedicated USB PLL1 to provide clocking for the USB interface. The PLL1 receives its clock input from the main oscillator only and provides a fixed 48 MHz clock to the USB block only. The PLL1 is disabled and powered off on reset. If the PLL1 is left disabled, the USB clock will be supplied by the 48 MHz clock from the main PLL0. The PLL1 accepts an input clock frequency in the range of 10 MHz to 25 MHz only. The input frequency is multiplied up the range of 48 MHz for the USB clock using a Current Controlled Oscillators (CCO). It is insured that the PLL1 output has a 50 % duty cycle. 8.29.4 RTC clock output The LPC17xx feature a clock output function intended for synchronizing with external devices and for use during system development to allow checking the internal clocks CCLK, IRC clock, main crystal, RTC clock, and USB clock in the outside world. The RTC clock output allows tuning the RTC frequency without probing the pin, which would distort the results. 8.29.5 Wake-up timer The LPC17xx begin operation at power-up and when awakened from Power-down mode by using the 4 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. When the main oscillator is initially activated, the wake-up timer allows software to ensure that the main oscillator is fully functional before the processor uses it as a clock source and starts to execute instructions. This is important at power on, all types of Reset, and LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 39 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the wake-up timer. The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin code execution. When power is applied to the chip, or when some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 8.29.6 Power control The LPC17xx support a variety of power control features. There are four special modes of processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, Peripheral Power Control allows shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Each of the peripherals has its own clock divider which provides even better power control. Integrated PMU (Power Management Unit) automatically adjust internal regulators to minimize power consumption during Sleep, Deep sleep, Power-down, and Deep power-down modes. The LPC17xx also implement a separate power domain to allow turning off power to the bulk of the device while maintaining operation of the RTC and a small set of registers for storing data during any of the power-down modes. 8.29.6.1 Sleep mode When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep mode does not need any special sequence but re-enabling the clock to the ARM core. In Sleep mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Sleep mode and may generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. 8.29.6.2 Deep-sleep mode In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Deep-sleep mode and the logic levels of chip pins remain static. The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The RTC oscillator is not stopped because the RTC interrupts may be used as the wake-up source. The PLL is automatically turned off and disconnected. The CCLK and USB clock dividers automatically get reset to zero. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 40 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller The Deep-sleep mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power consumption to a very low value. Power to the flash memory is left on in Deep-sleep mode, allowing a very quick wake-up. On wake-up from Deep-sleep mode, the code execution and peripherals activities will resume after 4 cycles expire if the IRC was used before entering Deep-sleep mode. If the main external oscillator was used, the code execution will resume when 4096 cycles expire. PLL and clock dividers need to be reconfigured accordingly. 8.29.6.3 Power-down mode Power-down mode does everything that Deep-sleep mode does, but also turns off the power to the IRC oscillator and the flash memory. This saves more power but requires waiting for resumption of flash operation before execution of code or data access in the flash memory can be accomplished. On the wake-up of Power-down mode, if the IRC was used before entering Power-down mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire before the code execution can then be resumed if the code was running from SRAM. In the meantime, the flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 s flash start-up time. When it times out, access to the flash will be allowed. Users need to reconfigure the PLL and clock dividers accordingly. 8.29.6.4 Deep power-down mode The Deep power-down mode can only be entered from the RTC block. In Deep power-down mode, power is shut off to the entire chip with the exception of the RTC module and the RESET pin. The LPC17xx can wake up from Deep power-down mode via the RESET pin or an alarm match event of the RTC. 8.29.6.5 Wake-up interrupt controller The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up from any enabled priority interrupt that can occur while the clocks are stopped in Deep sleep, Power-down, and Deep power-down modes. The WIC works in connection with the Nested Vectored Interrupt Controller (NVIC). When the CPU enters Deep sleep, Power-down, or Deep power-down mode, the NVIC sends a mask of the current interrupt situation to the WIC.This mask includes all of the interrupts that are both enabled and of sufficient priority to be serviced immediately. With this information, the WIC simply notices when one of the interrupts has occurred and then it wakes up the CPU. The WIC eliminates the need to periodically wake up the CPU and poll the interrupts resulting in additional power savings. 8.29.7 Peripheral power control A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 41 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.29.8 Power domains The LPC17xx provide two independent power domains that allow the bulk of the device to have power removed while maintaining operation of the RTC and the backup Registers. On the LPC17xx, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while the VDD(REG)(3V3) pin powers the on-chip voltage regulator which in turn provides power to the CPU and most of the peripherals. Depending on the LPC17xx application, a design can use two power options to manage power consumption. The first option assumes that power consumption is not a concern and the design ties the VDD(3V3) and VDD(REG)(3V3) pins together. This approach requires only one 3.3 V power supply for both pads, the CPU, and peripherals. While this solution is simple, it does not support powering down the I/O pad ring “on the fly” while keeping the CPU and peripherals alive. The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and a dedicated 3.3 V supply for the CPU (VDD(REG)(3V3)). Having the on-chip voltage regulator powered independently from the I/O pad ring enables shutting down of the I/O pad power supply “on the fly”, while the CPU and peripherals stay active. The VBAT pin supplies power only to the RTC domain. The RTC requires a minimum of power to operate, which can be supplied by an external battery. The device core power (VDD(REG)(3V3)) is used to operate the RTC whenever VDD(REG)(3V3) is present. Therefore, there is no power drain from the RTC battery when VDD(REG)(3V3) is available. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 42 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.30 System control 8.30.1 Reset Reset has four sources on the LPC17xx: the RESET pin, the Watchdog reset, power-on reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable level, causes the RSTOUT pin to go LOW and starts the wake-up timer (see description in Section 8.29.5). The wake-up timer ensures that reset remains asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the flash controller has completed its initialization. Once reset is de-asserted, or, in case of a BOD-triggered reset, once the voltage rises above the BOD threshold, the RSTOUT pin goes HIGH. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the Boot Block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. Fig 7. Power distribution REAL-TIME CLOCK BACKUP REGISTERS REGULATOR 32 kHz OSCILLATOR RTC POWER DOMAIN MAIN POWER DOMAIN 002aad978 RTCX1 VBAT VDD(REG)(3V3) RTCX2 VDD(3V3) VSS to memories, peripherals, oscillators, PLLs to core to I/O pads ADC DAC ADC POWER DOMAIN VDDA VREFP VREFN VSSA LPC17xx ULTRA LOW-POWER REGULATOR POWER SELECTOR LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 43 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.30.2 Brownout detection The LPC17xx include 2-stage monitoring of the voltage on the VDD(REG)(3V3) pins. If this voltage falls below 2.2 V, the BOD asserts an interrupt signal to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. The second stage of low-voltage detection asserts reset to inactivate the LPC17xx when the voltage on the VDD(REG)(3V3) pins falls below 1.85 V. This reset prevents alteration of the flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the power-on reset circuitry maintains the overall reset. Both the 2.2 V and 1.85 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.2 V detection to reliably interrupt, or a regularly executed event loop to sense the condition. 8.30.3 Code security (Code Read Protection - CRP) This feature of the LPC17xx allows user to enable different levels of security in the system so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP. There are three levels of the Code Read Protection. CRP1 disables access to chip via the JTAG and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased. CRP2 disables access to chip via the JTAG and only allows full flash erase and update using a reduced set of the ISP commands. Running an application with level CRP3 selected fully disables any access to chip via the JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too. It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via UART0. 8.30.4 APB interface The APB peripherals are split into two separate APB buses in order to distribute the bus bandwidth and thereby reducing stalls caused by contention between the CPU and the GPDMA controller. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 44 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 8.30.5 AHB multilayer matrix The LPC17xx use an AHB multilayer matrix. This matrix connects the instruction (I-code) and data (D-code) CPU buses of the ARM Cortex-M3 to the flash memory, the main (32 kB) static RAM, and the Boot ROM. The GPDMA can also access all of these memories. The peripheral DMA controllers, Ethernet, and USB can access all SRAM blocks. Additionally, the matrix connects the CPU system bus and all of the DMA controllers to the various peripheral functions. 8.30.6 External interrupt inputs The LPC17xx include up to 46 edge sensitive interrupt inputs combined with up to four level sensitive external interrupt inputs as selectable pin functions. The external interrupt inputs can optionally be used to wake up the processor from Power-down mode. 8.30.7 Memory mapping control The Cortex-M3 incorporates a mechanism that allows remapping the interrupt vector table to alternate locations in the memory map. This is controlled via the Vector Table Offset Register contained in the NVIC. The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address space. The vector table must be located on a 128 word (512 byte) boundary because the NVIC on the LPC17xx is configured for 128 total interrupts. 8.31 Emulation and debugging Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire debug and trace functions are supported in addition to a standard JTAG debug and parallel trace functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four watch points. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 45 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 9. Limiting values [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. c) The limiting values are stress ratings only. Operating the part at these values is not recommended, and proper operation is not guaranteed. The conditions for functional operation are specified in Table 8. [2] Maximum/minimum voltage above the maximum operating voltage (see Table 8) and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device. [3] See Table 19 for maximum operating voltage. [4] Including voltage on outputs in 3-state mode. [5] VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down. [6] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details. [7] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(3V3) supply voltage (3.3 V) external rail [2] 0.5 +4.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) [2] 0.5 +4.6 V VDDA analog 3.3 V pad supply voltage [2] 0.5 +4.6 V Vi(VBAT) input voltage on pin VBAT for the RTC [2] 0.5 +4.6 V Vi(VREFP) input voltage on pin VREFP [2] 0.5 +4.6 V VIA analog input voltage on ADC related pins [2][3] 0.5 +5.1 V VI input voltage 5 V tolerant digital I/O pins; VDD  2.4 V [2][4] 0.5 +5.5 VI VDD = 0 V 0.5 +3.6 5 V tolerant open-drain pins PIO0_27 and PIO0_28 [2][5] 0.5 +5.5 IDD supply current per supply pin - 100 mA ISS ground current per ground pin - 100 mA Ilatch I/O latch-up current (0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 C - 100 mA Tstg storage temperature [6] 65 +150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W VESD electrostatic discharge voltage human body model; all pins [7] 4000 +4000 V LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 46 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 10. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C) • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Table 7. Thermal resistance (15 %) Symbol Parameter Conditions Max/Min Unit LQFP100 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air 38.01 C/W Single-layer (4.5 in  3 in); still air 55.09 C/W Rth(j-c) thermal resistance from junction to case 9.065 C/W TFBGA100 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in  4 in); still air 55.2 C/W Single-layer (4.5 in  3 in); still air 45.6 C/W Rth(j-c) thermal resistance from junction to case 9.5 C/W Tj = Tamb + PD  Rthj – a LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 47 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 11. Static characteristics Table 8. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit Supply pins VDD(3V3) supply voltage (3.3 V) external rail [2] 2.4 3.3 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.4 3.3 3.6 V VDDA analog 3.3 V pad supply voltage [3][4] 2.5 3.3 3.6 V Vi(VBAT) input voltage on pin VBAT [5] 2.1 3.3 3.6 V Vi(VREFP) input voltage on pin VREFP [3] 2.5 3.3 VDDA V IDD(REG)(3V3) regulator supply current (3.3 V) active mode; code while(1){} executed from flash; all peripherals disabled; PCLK = CCLK⁄8 CCLK = 12 MHz; PLL disabled [6][7]- 7 - mA CCLK = 100 MHz; PLL enabled [6][7]- 42 - mA CCLK = 100 MHz; PLL enabled (LPC1769) [6][8]- 50 - mA CCLK = 120 MHz; PLL enabled (LPC1769) [6][8]- 67 - mA sleep mode [6][9]- 2 - mA deep sleep mode [6][10]- 240 - A power-down mode [6][10]- 31 - A deep power-down mode; RTC running [11]- 630 - nA IBAT battery supply current deep power-down mode; RTC running VDD(REG)(3V3) present [12]- 530 - nA VDD(REG)(3V3) not present [13] - 1.1 - A IDD(IO) I/O supply current deep sleep mode [14][15]- 40 - nA power-down mode [14][15]- 40 - nA deep power-down mode [14]- 10 - nA LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 48 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller IDD(ADC) ADC supply current active mode; ADC powered [16][17]- 1.95 - mA ADC in Power-down mode [16][18]- <0.2 - A deep sleep mode [16]- 38 - nA power-down mode [16]- 38 - nA deep power-down mode [16]- 24 - nA II(ADC) ADC input current on pin VREFP deep sleep mode [19]- 100 - nA power-down mode [19]- 100 - nA deep power-down mode [19]- 100 - nA Standard port pins, RESET, RTCK IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD(3V3); on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD(3V3); on-chip pull-up/down resistors disabled - 0.5 10 nA VI input voltage pin configured to provide a digital function [20][21] [22] 0 - 5.0 V VO output voltage output active 0 - VDD(3V3) V VIH HIGH-level input voltage 0.7VDD(3V3)- - V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage IOH = 4 mA VDD(3V3)  0.4 - - V VOL LOW-level output voltage IOL = 4 mA - - 0.4 V IOH HIGH-level output current VOH = VDD(3V3)  0.4 V 4 - - mA IOL LOW-level output current VOL = 0.4 V 4 - - mA IOHS HIGH-level short-circuit output current VOH = 0 V [23]- - 45 mA IOLS LOW-level short-circuit output current VOL = VDD(3V3) [23]- - 50 mA Ipd pull-down current VI = 5 V 10 50 150 A Ipu pull-up current VI = 0 V 15 50 85 A VDD(3V3) < VI < 5 V 0 0 0 A Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 49 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] For USB operation 3.0 V  VDD((3V3)  3.6 V. Guaranteed by design. [3] VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used. [4] VDDA for DAC specs are from 2.7 V to 3.6 V. I2C-bus pins (P0[27] and P0[28]) VIH HIGH-level input voltage 0.7VDD(3V3)- - V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage - 0.05  VDD(3V3) - V VOL LOW-level output voltage IOLS = 3 mA - - 0.4 V ILI input leakage current VI = VDD(3V3) [24]- 2 4 A VI = 5 V - 10 22 A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 1.8 1.95 V Vo(XTAL2) output voltage on pin XTAL2 0.5 1.8 1.95 V Vi(RTCX1) input voltage on pin RTCX1 0.5 - 3.6 V Vo(RTCX2) output voltage on pin RTCX2 0.5 - 3.6 V USB pins (LPC1769/68/66/65/64 only) IOZ OFF-state output current 0 V < VI < 3.3 V [2]- - 10 A VBUS bus supply voltage [2]- - 5.25 V VDI differential input sensitivity voltage (D+)  (D) [2] 0.2 - - V VCM differential common mode voltage range includes VDI range [2] 0.8 - 2.5 V Vth(rs)se single-ended receiver switching threshold voltage [2] 0.8 - 2.0 V VOL LOW-level output voltage for low-/full-speed RL of 1.5 k to 3.6 V [2]- - 0.18 V VOH HIGH-level output voltage (driven) for low-/full-speed RL of 15 k to GND [2] 2.8 - 3.5 V Ctrans transceiver capacitance pin to GND [2]- - 20 pF ZDRV driver output impedance for driver which is not high-speed capable with 33  series resistor; steady state drive [2][25] 36 - 44.1  Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 50 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller [5] The RTC typically fails when Vi(VBAT) drops below 1.6 V. [6] VDD(REG)(3V3) = 3.3 V; Tamb = 25 C for all power consumption measurements. [7] Applies to LPC1768/67/66/65/64/63. [8] Applies to LPC1769 only. [9] IRC running at 4 MHz; main oscillator and PLL disabled; PCLK = CCLK⁄8. [10] BOD disabled. [11] On pin VDD(REG)(3V3). IBAT = 530 nA. VDD(REG)(3V3) = 3.0 V; VBAT = 3.0 V; Tamb = 25 C. [12] On pin VBAT; IDD(REG)(3V3) = 630 nA; VDD(REG)(3V3) = 3.0 V; VBAT = 3.0 V; Tamb = 25 C. [13] On pin VBAT; VBAT = 3.0 V; Tamb = 25 C. [14] All internal pull-ups disabled. All pins configured as output and driven LOW. VDD(3V3) = 3.3 V; Tamb = 25 C. [15] TCK/SWDCLK pin needs to be externally pulled LOW. [16] On pin VDDA; VDDA = 3.3 V; Tamb = 25 C. The ADC is powered if the PDN bit in the AD0CR register is set to 1 and in Power-down mode of the PDN bit is set to 0. [17] The ADC is powered if the PDN bit in the AD0CR register is set to 1. See LPC17xx user manual UM10360_1. [18] The ADC is in Power-down mode if the PDN bit in the AD0CR register is set to 0. See LPC17xx user manual UM10360_1. [19] Vi(VREFP) = 3.3 V; Tamb = 25 C. [20] Including voltage on outputs in 3-state mode. [21] VDD(3V3) supply voltages must be present. [22] 3-state outputs go into 3-state mode in Deep power-down mode. [23] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [24] To VSS. [25] Includes external resistors of 33   1 % on D+ and D. 11.1 Power consumption Conditions: BOD disabled. Fig 8. Deep-sleep mode: typical regulator supply current IDD(Reg)(3V3) versus temperature 002aaf568 temperature (°C) −40 −15 10 35 60 85 250 350 300 400 IDD(Reg)(3V3) (μA) 200 3.6 V 3.3 V 2.4 V LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 51 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Conditions: BOD disabled. Fig 9. Power-down mode: Typical regulator supply current IDD(Reg)(3V3) versus temperature Conditions: VDD(REG)(3V3) floating; RTC running. Fig 10. Deep power-down mode: Typical battery supply current IBAT versus temperature 002aaf569 40 80 120 0 temperature (°C) −40 −15 10 35 60 85 IDD(Reg)(3V3) (μA) 3.6 V 3.3 V 2.4 V 002aag119 1.0 1.4 1.8 0.6 temperature (°C) -40 -15 10 35 60 85 IBAT) (μA) Vi(VBAT) = 3.6 V 3.3 V 3.0 V 2.4 V LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 52 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Conditions: VBAT = 3.0 V; VDD(REG)(3V3) = 3.0 V; RTC running. Fig 11. Deep power-down mode: Typical regulator supply current IDD(REG)(3V3) and battery supply current IBAT versus temperature 002aag120 temperature (°C) -40 -15 10 35 60 85 0.8 1.6 0.4 1.2 2.0 0 IDD(REG)(3V3) IBAT IDD(REG)(3V3)/IBAT (μA) LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 53 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 11.2 Peripheral power consumption The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled in the PCONP register. All other blocks are disabled and no code is executed. Measured on a typical sample at Tamb = 25 C. The peripheral clock PCLK = CCLK/4. [1] The combined current of several peripherals running at the same time can be less than the sum of each individual peripheral current measured separately. Table 9. Power consumption for individual analog and digital blocks Peripheral Conditions Typical supply current in mA; CCLK = Notes 12 MHz 48 MHz 100 MHz Timer 0.03 0.11 0.23 Average current per timer UART 0.07 0.26 0.53 Average current per UART PWM 0.05 0.20 0.41 Motor control PWM 0.05 0.21 0.42 I2C 0.02 0.08 0.16 Average current per I2C SPI 0.02 0.06 0.13 SSP1 0.04 0.16 0.32 ADC PCLK = 12 MHz for CCLK = 12 MHz and 48 MHz; PCLK = 12.5 MHz for CCLK = 100 MHz 2.12 2.09 2.07 CAN PCLK = CCLK/6 0.13 0.49 1.00 Average current per CAN CAN0, CAN1, acceptance filter PCLK = CCLK/6 0.22 0.85 1.73 Both CAN blocks and acceptance filter[1] DMA PCLK = CCLK 1.33 5.10 10.36 QEI 0.05 0.20 0.41 GPIO 0.33 1.27 2.58 I2S 0.09 0.34 0.70 USB and PLL1 0.94 1.32 1.94 Ethernet Ethernet block enabled in the PCONP register; Ethernet not connected. 0.49 1.87 3.79 Ethernet connected Ethernet initialized, connected to network, and running web server example. - - 5.19 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 54 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 11.3 Electrical pin characteristics Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 12. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 13. Typical LOW-level output current IOL versus LOW-level output voltage VOL IOH (mA) 0 8 16 24 002aaf112 2.8 2.4 3.2 3.6 VOH (V) 2.0 T = 85 °C 25 °C −40 °C VOL (V) 0 0.2 0.4 0.6 002aaf111 5 10 15 IOL (mA) 0 T = 85 °C 25 °C −40 °C LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 55 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 14. Typical pull-up current Ipu versus input voltage VI Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 15. Typical pull-down current Ipd versus input voltage VI 0 1 2 3 4 5 002aaf108 −30 −50 −10 10 Ipu (μA) −70 T = 85 °C 25 °C −40 °C VI (V) 002aaf109 VI (V) 0 1 2 3 4 5 10 70 50 30 90 Ipd (μA) −10 T = 85 °C 25 °C −40 °C LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 56 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 12. Dynamic characteristics 12.1 Flash memory [1] Number of program/erase cycles. [2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes. 12.2 External clock [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. Table 10. Flash characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Nendu endurance [1] 10000 100000 - cycles tret retention time powered 10 - - years unpowered 20 - - years ter erase time sector or multiple consecutive sectors 95 100 105 ms tprog programming time [2] 0.95 1 1.05 ms Table 11. Dynamic characteristic: external clock Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk)  0.4 - - ns tCLCX clock LOW time Tcy(clk)  0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns Fig 16. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) tCHCL tCLCX tCHCX Tcy(clk) tCLCH 002aaa907 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 57 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 12.3 Internal oscillators [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 12.4 I/O pins [1] Applies to standard I/O pins. Table 12. Dynamic characteristic: internal oscillators Tamb = 40 C to +85 C; 2.7 V  VDD(REG)(3V3)  3.6 V.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz fi(RTC) RTC input frequency - - 32.768 - kHz Conditions: Frequency values are typical values. 4 MHz  1 % accuracy is guaranteed for 2.7 V  VDD(REG)(3V3)  3.6 V and Tamb = 40 C to +85 C. Variations between parts may cause the IRC to fall outside the 4 MHz  1 % accuracy specification for voltages below 2.7 V. Fig 17. Internal RC oscillator frequency versus temperature 002aaf107 temperature (°C) -40 -15 10 35 60 85 4.024 4.032 4.020 4.028 4.036 fosc(RC) (MHz) 4.016 VDD(REG)(3V3) = 3.6 V 3.3 V 3.0 V 2.7 V 2.4 V Table 13. Dynamic characteristic: I/O pins[1] Tamb = 40 C to +85 C; VDD(3V3) over specified ranges. Symbol Parameter Conditions Min Typ Max Unit tr rise time pin configured as output 3.0 - 5.0 ns tf fall time pin configured as output 2.5 - 5.0 ns LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 58 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 12.5 I2C-bus [1] See the I2C-bus specification UM10204 for details. [2] Parameters are valid over operating temperature range unless otherwise specified. [3] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. [4] Cb = total capacitance of one bus line in pF. [5] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [6] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for this when considering bus timing. [7] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge. [8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or tVD;ACK by a transition time (see the I2C-bus specification UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock. [9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the acknowledge. [10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time. Table 14. Dynamic characteristic: I2C-bus pins[1] Tamb = 40 C to +85 C.[2] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 400 kHz Fast-mode Plus 0 1 MHz tf fall time [3][4][5][6] of both SDA and SCL signals Standard-mode - 300 ns Fast-mode 20 + 0.1  Cb 300 ns Fast-mode Plus - 120 ns tLOW LOW period of the SCL clock Standard-mode 4.7 - s Fast-mode 1.3 - s Fast-mode Plus 0.5 - s tHIGH HIGH period of the SCL clock Standard-mode 4.0 - s Fast-mode 0.6 - s Fast-mode Plus 0.26 - s tHD;DAT data hold time [3][7][8] Standard-mode 0 - s Fast-mode 0 - s Fast-mode Plus 0 - s tSU;DAT data set-up time [9][10] Standard-mode 250 - ns Fast-mode 100 - ns Fast-mode Plus 50 - ns LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 59 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 12.6 I2S-bus interface Remark: The I2S-bus interface is available on parts LPC1769/68/67/66/65/63. See Table 2. [1] CCLK = 20 MHz; peripheral clock to the I2S-bus interface PCLK = CCLK⁄4; I2S clock cycle time Tcy(clk) = 1600 ns, corresponds to the SCK signal in the I2S-bus specification. Fig 18. I2C-bus pins clock timing 002aaf425 tf 70 % SDA 30 % tf 70 % 30 % S 70 % 30 % 70 % 30 % tHD;DAT SCL 1 / fSCL 70 % 30 % 70 % 30 % tVD;DAT tHIGH tLOW tSU;DAT Table 15. Dynamic characteristics: I2S-bus interface pins Tamb = 40 C to +85 C. Symbol Parameter Conditions Min Typ Max Unit common to input and output tr rise time [1] - - 35 ns tf fall time [1] - - 35 ns tWH pulse width HIGH on pins I2STX_CLK and I2SRX_CLK [1] 0.495  Tcy(clk) - - - tWL pulse width LOW on pins I2STX_CLK and I2SRX_CLK [1] - - 0.505  Tcy(clk) ns output tv(Q) data output valid time on pin I2STX_SDA [1] - - 30 ns on pin I2STX_WS [1] - - 30 ns input tsu(D) data input set-up time on pin I2SRX_SDA [1] 3.5 - - ns th(D) data input hold time on pin I2SRX_SDA [1] 4.0 - - ns LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 60 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 19. I2S-bus timing (output) Fig 20. I2S-bus timing (input) 002aad992 I2STX_CLK I2STX_SDA I2STX_WS Tcy(clk) tf tr tWH tWL tv(Q) tv(Q) 002aae159 Tcy(clk) tf tr tWH tsu(D) th(D) tsu(D) tsu(D) tWL I2SRX_CLK I2SRX_SDA I2SRX_WS LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 61 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 12.7 SSP interface [1] The peripheral clock for SSP is PCLK = CCLK = 20 MHz. Table 16. Dynamic characteristic: SSP interface Tamb = 25C; VDD(3V3) over specified ranges. Symbol Parameter Conditions Min Typ Max Unit SSP interface tsu(SPI_MISO) SPI_MISO set-up time measured in SPI Master mode; see Figure 21 [1] 30 - ns Fig 21. MISO line set-up time in SSP Master mode tsu(SPI_MISO) SCK shifting edges MOSI MISO 002aad326 sampling edges LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 62 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 12.8 USB interface Remark: The USB controller is available as a device/Host/OTG controller on parts LPC1769/68/66/65 and as device-only controller on part LPC1764. [1] Characterized but not implemented as production test. Guaranteed by design. Table 17. Dynamic characteristics: USB pins (full-speed) CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3); 3.0 V  VDD(3V3)  3.6 V. Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 8.5 - 13.8 ns tf fall time 10 % to 90 % 7.7 - 13.7 ns tFRFM differential rise and fall time matching tr / tf - - 109 % VCRS output signal crossover voltage 1.3 - 2.0 V tFEOPT source SE0 interval of EOP see Figure 22 160 - 175 ns tFDEOP source jitter for differential transition to SE0 transition see Figure 22 2 - +5 ns tJR1 receiver jitter to next transition 18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns tEOPR1 EOP width at receiver must reject as EOP; see Figure 22 [1] 40 - - ns tEOPR2 EOP width at receiver must accept as EOP; see Figure 22 [1] 82 - - ns Fig 22. Differential data-to-EOP transition skew and EOP width 002aab561 TPERIOD differential data lines crossover point source EOP width: tFEOPT receiver EOP width: tEOPR1, tEOPR2 crossover point extended differential data to SE0/EOP skew n × TPERIOD + tFDEOP LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 63 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 12.9 SPI [1] TSPICYC = (Tcy(PCLK)  n)  0.5 %, n is the SPI clock divider value (n  8); PCLK is derived from the processor clock CCLK. [2] Timing parameters are measured with respect to the 50 % edge of the clock SCK and the 10 % (90 %) edge of the data signal (MOSI or MISO). Table 18. Dynamic characteristics of SPI pins Tamb = 40 C to +85 C. Symbol Parameter Min Typ Max Unit Tcy(PCLK) PCLK cycle time 10 - - ns TSPICYC SPI cycle time [1] 79.6 - - ns tSPICLKH SPICLK HIGH time 0.485  TSPICYC - - ns tSPICLKL SPICLK LOW time - 0.515  TSPICYC ns SPI master tSPIDSU SPI data set-up time [2] 0 - - ns tSPIDH SPI data hold time [2] 2  Tcy(PCLK)  5 - - ns tSPIQV SPI data output valid time [2] 2  Tcy(PCLK) + 30 - - ns tSPIOH SPI output data hold time [2] 2  Tcy(PCLK) + 5 - - ns SPI slave tSPIDSU SPI data set-up time [2] 0 - - ns tSPIDH SPI data hold time [2] 2  Tcy(PCLK) + 5 - - ns tSPIQV SPI data output valid time [2] 2  Tcy(PCLK) + 35 - - ns tSPIOH SPI output data hold time [2] 2  Tcy(PCLK) + 15 - - ns Fig 23. SPI master timing (CPHA = 1) SCK (CPOL = 0) MOSI MISO 002aad986 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH tSPIQV DATA VALID DATA VALID tSPIOH SCK (CPOL = 1) DATA VALID DATA VALID LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 64 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 24. SPI master timing (CPHA = 0) Fig 25. SPI slave timing (CPHA = 1) SCK (CPOL = 0) MOSI MISO 002aad987 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH DATA VALID DATA VALID tSPIOH SCK (CPOL = 1) DATA VALID DATA VALID tSPIQV SCK (CPOL = 0) MOSI MISO 002aad988 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH tSPIQV DATA VALID DATA VALID tSPIOH SCK (CPOL = 1) DATA VALID DATA VALID LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 65 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 13. ADC electrical characteristics [1] VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used. [2] The ADC is monotonic, there are no missing codes. [3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 27. [4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 27. [5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 27. [6] ADCOFFS value (bits 7:4) = 2 in the ADTRM register. See LPC17xx user manual UM10360. [7] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 27. [8] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 27. [9] See Figure 28. [10] The conversion frequency corresponds to the number of samples per second. Fig 26. SPI slave timing (CPHA = 0) SCK (CPOL = 0) MOSI MISO 002aad989 TSPICYC tSPICLKH tSPICLKL tSPIDSU tSPIDH tSPIQV DATA VALID DATA VALID tSPIOH SCK (CPOL = 1) DATA VALID DATA VALID Table 19. ADC characteristics (full resolution) VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 13 MHz; 12-bit resolution.[1] Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDDA V Cia analog input capacitance - - 15 pF ED differential linearity error [2][3]- - 1 LSB EL(adj) integral non-linearity [4]- - 3 LSB EO offset error [5][6]- - 2 LSB EG gain error [7]- - 0.5 % ET absolute error [8]- - 4 LSB Rvsi voltage source interface resistance [9]- - 7.5 k fclk(ADC) ADC clock frequency - - 13 MHz fc(ADC) ADC conversion frequency [10]- - 200 kHz LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 66 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller [1] VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used. [2] The ADC is monotonic, there are no missing codes. [3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 27. [4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 27. [5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 27. [6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 27. [7] The conversion frequency corresponds to the number of samples per second. Table 20. ADC characteristics (lower resolution) Tamb = 40 C to +85 C unless otherwise specified; 12-bit ADC used as 10-bit resolution ADC.[1] Symbol Parameter Conditions Min Typ Max Unit ED differential linearity error [2][3] - 1 - LSB EL(adj) integral non-linearity [4] - 1.5 - LSB EO offset error [5] - 2 - LSB EG gain error [6] - 2 - LSB fclk(ADC) ADC clock frequency 3.0 V  VDDA  3.6 V - - 33 MHz 2.7 V  VDDA < 3.0 V - - 25 MHz fc(ADC) ADC conversion frequency 3 V  VDDA  3.6 V [7]- - 500 kHz 2.7 V  VDDA < 3.0 V [7]- - 400 kHz LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 67 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 27. 12-bit ADC characteristics 002aad948 4095 4094 4093 4092 4091 (2) (1) 1 2 3 4 5 6 7 4090 4091 4092 4093 4094 4095 4096 7 6 5 4 3 2 1 0 4090 (5) (4) (3) 1 LSB (ideal) code out VREFP − VREFN 4096 offset error EO gain error EG offset error EO VIA (LSBideal) 1 LSB = LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 68 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 14. DAC electrical characteristics Remark: The DAC is available on parts LPC1769/68/67/66/65/63. See Table 2. The values of resistor components Ri1 and Ri2 vary with temperature and input voltage and are process-dependent (see Table 21). Parasitic resistance and capacitance from the pad are not included in this figure. Fig 28. ADC interface to pins AD0[n] Table 21. ADC interface components Component Range Description Ri1 2 k to 5.2 k Switch-on resistance for channel selection switch. Varies with temperature, input voltage, and process. Ri2 100  to 600  Switch-on resistance for the comparator input switch. Varies with temperature, input voltage, and process. C1 750 fF Parasitic capacitance from the ADC block level. C2 65 fF Parasitic capacitance from the ADC block level. C3 2.2 pF Sampling capacitor. LPC17xx AD0[n] 750 fF 65 fF Cia 2.2 pF Rvsi Ri2 100 Ω - 600 Ω Ri1 2 kΩ - 5.2 kΩ VSS VEXT 002aaf197 ADC COMPARATOR BLOCK C1 C3 C2 Table 22. DAC electrical characteristics VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit ED differential linearity error - 1 - LSB EL(adj) integral non-linearity - 1.5 - LSB EO offset error - 0.6 - % EG gain error - 0.6 - % CL load capacitance - 200 - pF RL load resistance 1 - - k LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 69 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 15. Application information 15.1 Suggested USB interface solutions Remark: The USB controller is available as a device/Host/OTG controller on parts LPC1769/68/66/65 and as device-only controller on part LPC1764. If the LPC1769/68/67/66/65/64/63 VDD is always greater than 0 V while VBUS = 5 V, the VBUS pin can be connected directly to the VBUS pin on the USB connector. This applies to bus powered devices where the USB cable supplies the system power. For systems where VDD can be 0 V and VBUS is directly applied to the VBUS pin, precautions must be taken to reduce the voltage to below 3.6 V. The maximum allowable voltage on the VBUS pin is 3.6 V. One method is to use a voltage divider to connect the VBUS pin to the VBUS on the USB connector. The voltage divider ratio should be such that the VBUS pin will be greater than 0.7VDD to indicate a logic HIGH while below the 3.6 V allowable maximum voltage. Use the following operating conditions: VBUSmax = 5.25 V VDD = 3.6 V The voltage divider would need to provide a reduction of 3.6 V/5.25 V or ~0.686 V. Fig 29. USB interface on a bus-powered device LPC17xx VDD(3V3) R1 1.5 kΩ R2 USB_UP_LED 002aad940 USB-B connector USB_D+ USB_D− VBUS VSS RS = 33 Ω RS = 33 Ω LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 70 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 30. USB interface on a bus-powered device where VBUS = 5 V, VDD not present LPC17xx VDD R1 1.5 kΩ R2 R3 USB-B connector USB_D+ USB_DUSB_ VBUS VSS RS = 33 Ω RS = 33 Ω aaa-008962 R2 USB_UP_LED Fig 31. USB interface with soft-connect LPC17xx USB-B connector USB_D+ USB_CONNECT SoftConnect switch USB_D− VBUS VSS VDD(3V3) R1 1.5 kΩ RS = 33 Ω 002aad939 RS = 33 Ω USB_UP_LED LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 71 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 32. USB OTG port configuration USB_D+ USB_D− USB_SDA USB_SCL RSTOUT LPC17xx Mini-AB connector 33 Ω 33 Ω VDD VDD 002aad941 EINTn RESET_N ADR/PSW SPEED SUSPEND OE_N/INT_N SCL SDA INT_N VBUS ID DP DM ISP1302 VSS USB_UP_LED VDD Fig 33. USB host port configuration USB_UP_LED USB_D+ USB_D− USB_PWRD LPC17xx 15 kΩ 15 kΩ USB-A connector 33 Ω 33 Ω 002aad942 VDD USB_OVRCR USB_PPWR LM3526-L ENA IN 5 V FLAGA OUTA VDD D+ D− VBUS VSS LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 72 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 15.2 Crystal oscillator XTAL input and component selection The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave mode, a minimum of 200 mV(RMS) is needed. In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 35), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 36 and in Table 23 and Table 24. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (the fundamental frequency is represented by L, CL and RS). Capacitance CP in Figure 36 represents the parallel package capacitance and should not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal manufacturer. Fig 34. USB device port configuration LPC17xx USB-B connector 33 Ω 33 Ω 002aad943 USB_UP_LED USB_CONNECT VDD VDD D+ D− USB_D+ USB_D− VBUS VBUS VSS Fig 35. Slave mode operation of the on-chip oscillator LPC1xxx XTAL1 Ci 100 pF Cg 002aae835 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 73 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 15.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in Fig 36. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 23. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1/CX2 1 MHz to 5 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 300  39 pF, 39 pF 30 pF < 300  57 pF, 57 pF 5 MHz to 10 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 200  39 pF, 39 pF 30 pF < 100  57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 60  39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80  18 pF, 18 pF Table 24. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180  18 pF, 18 pF 20 pF < 100  39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 80  39 pF, 39 pF 002aaf424 LPC1xxx XTALIN XTALOUT CX1 CX2 XTAL = CL CP RS L LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 74 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout. 15.4 Standard I/O pin configuration Figure 37 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver: Open-drain mode enabled/disabled • Digital input: Pull-up enabled/disabled • Digital input: Pull-down enabled/disabled • Digital input: Repeater mode enabled/disabled • Analog input The default configuration for standard I/O pins is input with pull-up enabled. The weak MOS devices provide a drive capability equivalent to pull-up and pull-down resistors. Fig 37. Standard I/O pin configuration with analog input PIN VDD VDD ESD VSS ESD strong pull-up strong pull-down VDD weak pull-up weak pull-down open-drain enable output enable repeater mode enable pull-up enable pull-down enable data output data input analog input select analog input 002aaf272 pin configured as digital output driver pin configured as digital input pin configured as analog input LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 75 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 15.5 Reset pin configuration Fig 38. Reset pin configuration VSS reset 002aaf274 VDD VDD VDD Rpu ESD ESD 20 ns RC GLITCH FILTER PIN LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 76 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 15.6 ElectroMagnetic Compatibility (EMC) Radiated emission measurements according to the IEC61967-2 standard using the TEM-cell method are shown for part LPC1768. [1] IEC levels refer to Appendix D in the IEC61967-2 Specification. Table 25. ElectroMagnetic Compatibility (EMC) for part LPC1768 (TEM-cell method) VDD = 3.3 V; Tamb = 25 C. Parameter Frequency band System clock = Unit 12 MHz 24 MHz 48 MHz 72 MHz 100 MHz Input clock: IRC (4 MHz) maximum peak level 150 kHz to 30 MHz 7 6 4 7 7 dBV 30 MHz to 150 MHz +1 +5 +11 +16 +9 dBV 150 MHz to 1 GHz 2 +4 +11 +12 +19 dBV IEC level[1] - O O N M L - Input clock: crystal oscillator (12 MHz) maximum peak level 150 kHz to 30 MHz 5 4 4 7 8 dBV 30 MHz to 150 MHz 1 +5 +10 +15 +7 dBV 150 MHz to 1 GHz 1 +6 +11 +10 +16 dBV IEC level[1] - O O N M M - LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 77 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 16. Package outline Fig 39. Package outline SOT407-1 (LQFP100) UNIT A max. A1 A2 A3 bp c E(1) e HE L Lp v w y Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 0.5 16.25 15.75 1.15 0.85 7 0 o 1 0.2 0.08 0.08 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT407-1 136E20 MS-026 00-02-01 03-02-20 D(1) (1) (1) 14.1 13.9 HD 16.25 15.75 Z E 1.15 0.85 D bp e θ E A1 A Lp detail X L (A 3 ) B 25 c HD bp HE A2 v M B D ZD A ZE e v M A X 1 100 76 75 51 50 26 y pin 1 index w M w M 0 5 10 mm scale LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 78 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 40. Package outline SOT926-1 (TFBGA100) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT926-1 - - - - - - - - - SOT926-1 05-12-09 05-12-22 UNIT A max mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 A1 DIMENSIONS (mm are the original dimensions) TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm A2 b D E e2 7.2 e 0.8 e1 7.2 v 0.15 w 0.05 y 0.08 y1 0.1 0 2.5 5 mm scale b e2 e1 e e 1/2 e 1/2 e ∅ v M C A B ∅ w M C ball A1 index area A B C D E F H K G J 1 2 3 4 5 6 7 8 9 10 ball A1 index area B A E D C y1 C y X detail X A A1 A2 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 79 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 41. Package outline LPC1768UK (WLCSP100) Outline References version European projection Issue date IEC JEDEC JEITA wlcsp100_lpc1768uk_po Unit mm max nom min 0.65 0.60 0.55 0.27 0.24 0.21 0.35 0.32 0.29 5.104 5.074 5.044 5.104 5.074 5.044 4.5 4.5 0.15 A Dimensions (mm are the original dimensions) A1 A2 0.385 0.360 0.335 b D E 0.05 e y 0.5 e1 e2 v 0.05 w ball A1 index area X detail X C y A A2 A1 ball A1 index area LPC1768UK 11-10-19 13-11-04 WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm LPC1768UK 0 scale 3 mm D B E A 1 K J H G F E D C B A 2 3 4 5 6 7 8 9 10 e1 e b Ø v C A B Ø w C 1/2 e e2 e 1/2 e LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 80 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 17. Soldering Fig 42. Reflow soldering for the LQFP100 package SOT407-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP100 package Ax Bx Gx Hy Gy Hx By Ay P2 P1 D2 (8×) D1 (0.125) P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy sot407-1 solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 0.500 0.560 17.300 17.300 14.300 14.300 1.500 0.280 0.400 14.500 14.500 17.550 17.550 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 81 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Fig 43. Reflow soldering of the TFBGA100 package DIMENSIONS in mm P SL SP SR Hx Hy Hx Hy SOT926-1 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA100 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot926-1_fr 0.80 0.330 0.400 0.480 9.400 9.400 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 82 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 18. Abbreviations Table 26. Abbreviations Acronym Description ADC Analog-to-Digital Converter AHB Advanced High-performance Bus AMBA Advanced Microcontroller Bus Architecture APB Advanced Peripheral Bus BOD BrownOut Detection CAN Controller Area Network DAC Digital-to-Analog Converter DMA Direct Memory Access EOP End Of Packet GPIO General Purpose Input/Output IRC Internal RC IrDA Infrared Data Association JTAG Joint Test Action Group MAC Media Access Control MIIM Media Independent Interface Management OHCI Open Host Controller Interface OTG On-The-Go PHY Physical Layer PLL Phase-Locked Loop PWM Pulse Width Modulator RIT Repetitive Interrupt Timer RMII Reduced Media Independent Interface SE0 Single Ended Zero SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port TCM Tightly Coupled Memory TTL Transistor-Transistor Logic UART Universal Asynchronous Receiver/Transmitter USB Universal Serial Bus LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 83 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 19. Revision history Table 27. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC1769_68_67_66_65_64_63 v.9.4 20140404 Product data sheet - LPC1769_68_67_66_65_64 v.9.3 Modifications: • Added LPC1768UK. • Table 5 “Pin description”: Changed RX_MCLK and TX_MCLK type from INPUT to OUTPUT. LPC1769_68_67_66_65_64_63 v.9.3 20140108 Product data sheet - LPC1769_68_67_66_65_64 v.9.2 Modifications: • Table 7 “Thermal resistance (±15 %)”: – Added TFBGA100. – Added 15 % to table title. LPC1769_68_67_66_65_64_63 v.9.2 20131021 Product data sheet - LPC1769_68_67_66_65_64 v.9.1 Modifications: • Table 8 “Static characteristics”: – Added Table note 3 “VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used.” – Added Table note 4 “VDDA for DAC specs are from 2.7 V to 3.6 V.” – VDDA/VREFP spec changed from 2.7 V to 2.5 V. • Table 19 “ADC characteristics (full resolution)”: – Added Table note 1 “VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used.” – VDDA changed from 2.7 V to 2.5 V. • Table 20 “ADC characteristics (lower resolution)”: Added Table note 1 “VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used.” LPC1769_68_67_66_65_64_63 v.9.1 20130916 Product data sheet - LPC1769_68_67_66_65_64 v.9 Modifications: • Added Table 7 “Thermal resistance”. • Table 6 “Limiting values”: – Updated min/max values for VDD(3V3) and VDD(REG)(3V3). – Updated conditions for VI. – Updated table notes. • Table 8 “Static characteristics”: Added Table note 15 “TCK/SWDCLK pin needs to be externally pulled LOW.” • Updated Section 15.1 “Suggested USB interface solutions”. • Added Section 5 “Marking”. • Changed title of Figure 31 from “USB interface on a self-powered device” to “USB interface with soft-connect”. LPC1769_68_67_66_65_64_63 v.9 20120810 Product data sheet - LPC1769_68_67_66_65_64 v.8 Modifications: • Remove table note “The peak current is limited to 25 times the corresponding maximum current.” from Table 5 “Limiting values”. • Change VDD(3V3) to VDD(REG)(3V3) in Section 11.3 “Internal oscillators”. • Glitch filter constant changed to 10 ns in Table note 6 in Table 4. • Description of RESET function updated in Table 4. • Pull-up value added for GPIO pins in Table 4. • Pin configuration diagram for LQFP100 package corrected (Figure 2). LPC1769_68_67_66_65_64_63 v.8 20111114 Product data sheet - LPC1769_68_67_66_65_64 v.7 LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 84 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Modifications: • Pin description of USB_UP_LED pin updated in Table 4. • Ri1 and Ri2 labels in Figure 27 updated. • Part LPC1765FET100 added. • Table note 10 updated in Table 4. • Table note 1 updated in Table 12. • Pin description of STCLK pin updated in Table 4. • Electromagnetic compatibility data added in Section 14.6. • Section 16 added. LPC1769_68_67_66_65_64_63 v.7 20110405 Product data sheet - LPC1769_68_67_66_65_64 v.6 Modifications: • Pin description of pins P0[29] and P0[30] updated in Table note 5 of Table 4. Pins are not 5 V tolerant. • Typical value for Parameter Nendu added in Table 9. • Parameter Vhys for I2C bus pins: typical value corrected Vhys = 0.05VDD(3V3) in Table 7. • Condition 3.0 V  VDD(3V3)  3.6 V added in Table 16. • Typical values for parameters IDD(REG)(3V3) and IBAT with condition Deep power-down mode corrected in Table 7 and Table note 9, Table note 10, and Table note 11 updated. • For Deep power-down mode, Figure 9 updated and Figure 10 added. LPC1769_68_67_66_65_64_63 v.6 20100825 Product data sheet - LPC1769_68_67_66_65_64 v.5 Modifications: • Part LPC1768TFBGA added. • Section 7.30.2; BOD level corrected. • Added Section 10.2. LPC1769_68_67_66_65_64_63 v.5 20100716 Product data sheet - LPC1769_68_67_66_65_64 v.4 LPC1769_68_67_66_65_64 v.4 20100201 Product data sheet - LPC1768_67_66_65_64 v.3 LPC1768_67_66_65_64 v.3 20091119 Product data sheet - LPC1768_66_65_64 v.2 LPC1768_66_65_64 v.2 20090211 Objective data sheet - LPC1768_66_65_64 v.1 LPC1768_66_65_64 v.1 20090115 Objective data sheet - - Table 27. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 85 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 20. Legal information 20.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 20.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 20.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 86 of 88 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 20.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V. 21. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC1769_68_67_66_65_64_63 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.4 — 4 April 2014 87 of 88 continued >> NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 4 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 7 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 8 Functional description . . . . . . . . . . . . . . . . . . 21 8.1 Architectural overview . . . . . . . . . . . . . . . . . . 21 8.2 ARM Cortex-M3 processor . . . . . . . . . . . . . . . 21 8.3 On-chip flash program memory . . . . . . . . . . . 21 8.4 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 21 8.5 Memory Protection Unit (MPU). . . . . . . . . . . . 21 8.6 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 22 8.7 Nested Vectored Interrupt Controller (NVIC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 8.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 8.7.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 24 8.8 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 24 8.9 General purpose DMA controller . . . . . . . . . . 24 8.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 8.10 Fast general purpose parallel I/O . . . . . . . . . . 25 8.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.11 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.12 USB interface . . . . . . . . . . . . . . . . . . . . . . . . 27 8.12.1 USB device controller . . . . . . . . . . . . . . . . . . . 27 8.12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8.12.2 USB host controller . . . . . . . . . . . . . . . . . . . . 28 8.12.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8.12.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 28 8.12.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8.13 CAN controller and acceptance filters . . . . . . 28 8.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.14 12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.15 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.16 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8.17 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 30 8.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8.18 SSP serial I/O controller . . . . . . . . . . . . . . . . . 30 8.18.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.19 I2C-bus serial I/O controllers . . . . . . . . . . . . . 31 8.19.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.20 I2S-bus serial I/O controllers . . . . . . . . . . . . . 32 8.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 8.21 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 32 8.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 8.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 33 8.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 8.23 Motor control PWM . . . . . . . . . . . . . . . . . . . . 34 8.24 Quadrature Encoder Interface (QEI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 8.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 8.25 Repetitive Interrupt (RI) timer. . . . . . . . . . . . . 35 8.25.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8.26 ARM Cortex-M3 system tick timer . . . . . . . . . 35 8.27 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 35 8.27.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8.28 RTC and backup registers . . . . . . . . . . . . . . . 36 8.28.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.29 Clocking and power control . . . . . . . . . . . . . . 36 8.29.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 36 8.29.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 37 8.29.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 37 8.29.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 37 8.29.2 Main PLL (PLL0) . . . . . . . . . . . . . . . . . . . . . . 38 8.29.3 USB PLL (PLL1) . . . . . . . . . . . . . . . . . . . . . . 38 8.29.4 RTC clock output . . . . . . . . . . . . . . . . . . . . . . 38 8.29.5 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 38 8.29.6 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 39 8.29.6.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 39 8.29.6.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 39 8.29.6.3 Power-down mode. . . . . . . . . . . . . . . . . . . . . 40 8.29.6.4 Deep power-down mode . . . . . . . . . . . . . . . . 40 8.29.6.5 Wake-up interrupt controller . . . . . . . . . . . . . 40 8.29.7 Peripheral power control . . . . . . . . . . . . . . . . 40 8.29.8 Power domains . . . . . . . . . . . . . . . . . . . . . . . 41 8.30 System control . . . . . . . . . . . . . . . . . . . . . . . . 42 8.30.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 8.30.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 43 8.30.3 Code security (Code Read Protection - CRP) . . . . . . . . . . . 43 8.30.4 APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 43 8.30.5 AHB multilayer matrix . . . . . . . . . . . . . . . . . . 44 8.30.6 External interrupt inputs . . . . . . . . . . . . . . . . . 44 8.30.7 Memory mapping control . . . . . . . . . . . . . . . . 44 8.31 Emulation and debugging . . . . . . . . . . . . . . . 44 NXP Semiconductors LPC1769/68/67/66/65/64/63 32-bit ARM Cortex-M3 microcontroller © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 April 2014 Document identifier: LPC1769_68_67_66_65_64_63 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 45 10 Thermal characteristics . . . . . . . . . . . . . . . . . 46 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 47 11.1 Power consumption . . . . . . . . . . . . . . . . . . . . 50 11.2 Peripheral power consumption . . . . . . . . . . . . 53 11.3 Electrical pin characteristics . . . . . . . . . . . . . . 54 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 56 12.1 Flash memory. . . . . . . . . . . . . . . . . . . . . . . . . 56 12.2 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 56 12.3 Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 57 12.4 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 12.5 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 12.6 I2S-bus interface . . . . . . . . . . . . . . . . . . . . . . 59 12.7 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 61 12.8 USB interface . . . . . . . . . . . . . . . . . . . . . . . . 62 12.9 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 13 ADC electrical characteristics . . . . . . . . . . . . 65 14 DAC electrical characteristics . . . . . . . . . . . . 68 15 Application information. . . . . . . . . . . . . . . . . . 69 15.1 Suggested USB interface solutions . . . . . . . . 69 15.2 Crystal oscillator XTAL input and component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 15.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . 73 15.4 Standard I/O pin configuration . . . . . . . . . . . . 74 15.5 Reset pin configuration. . . . . . . . . . . . . . . . . . 75 15.6 ElectroMagnetic Compatibility (EMC) . . . . . . . 76 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 77 17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 18 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 82 19 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 83 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 85 20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 85 20.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 20.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 86 21 Contact information. . . . . . . . . . . . . . . . . . . . . 86 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 1. General description The PCF8574/74A provides general-purpose remote I/O expansion via the two-wire bidirectional I2C-bus (serial clock (SCL), serial data (SDA)). The devices consist of eight quasi-bidirectional ports, 100 kHz I2C-bus interface, three hardware address inputs and interrupt output operating between 2.5 V and 6 V. The quasi-bidirectional port can be independently assigned as an input to monitor interrupt status or keypads, or as an output to activate indicator devices such as LEDs. System master can read from the input port or write to the output port through a single register. The low current consumption of 2.5 A (typical, static) is great for mobile applications and the latched output ports directly drive LEDs. The PCF8574 and PCF8574A are identical, except for the different fixed portion of the slave address. The three hardware address pins allow eight of each device to be on the same I2C-bus, so there can be up to 16 of these I/O expanders PCF8574/74A together on the same I2C-bus, supporting up to 128 I/Os (for example, 128 LEDs). The active LOW open-drain interrupt output (INT) can be connected to the interrupt logic of the microcontroller and is activated when any input state differs from its corresponding input port register state. It is used to indicate to the microcontroller that an input state has changed and the device needs to be interrogated without the microcontroller continuously polling the input register via the I2C-bus. The internal Power-On Reset (POR) initializes the I/Os as inputs with a weak internal pull-up 100 A current source. 2. Features and benefits  I2C-bus to parallel port expander  100 kHz I2C-bus interface (Standard-mode I2C-bus)  Operating supply voltage 2.5 V to 6 V with non-overvoltage tolerant I/O held to VDD with 100 A current source  8-bit remote I/O pins that default to inputs at power-up  Latched outputs directly drive LEDs  Total package sink capability of 80 mA  Active LOW open-drain interrupt output  Eight programmable slave addresses using three address pins  Low standby current (2.5 A typical)  40 C to +85 C operation  ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101 PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Rev. 5 — 27 May 2013 Product data sheet PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 2 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt  Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA  Packages offered: DIP16, SO16, SSOP20 3. Applications  LED signs and displays  Servers  Key pads  Industrial control  Medical equipment  PLC  Cellular telephones  Mobile devices  Gaming machines  Instrumentation and test measurement 4. Ordering information 4.1 Ordering options Table 1. Ordering information Type number Topside mark Package Name Description Version PCF8574P PCF8574P DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 PCF8574AP PCF8574AP PCF8574T/3 PCF8574T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 PCF8574AT/3 PCF8574AT PCF8574TS/3 8574TS SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 PCF8574ATS/3 8574A Table 2. Ordering options Type number Orderable part number Package Packing method Minimum order quantity Temperature range PCF8574P PCF8574P,112 DIP16 Standard marking * IC’s tube - DSC bulk pack 1000 Tamb = 40 C to +85 C PCF8574AP PCF8574AP,112 DIP16 Standard marking * IC’s tube - DSC bulk pack 1000 Tamb = 40 C to +85 C PCF8574T/3 PCF8574T/3,512 SO16 Standard marking * tube dry pack 1920 Tamb = 40 C to +85 C PCF8574T/3,518 SO16 Reel 13” Q1/T1 *standard mark SMD dry pack 1000 Tamb = 40 C to +85 C PCF8574AT/3 PCF8574AT/3,512 SO16 Standard marking * tube dry pack 1920 Tamb = 40 C to +85 C PCF8574AT/3,518 SO16 Reel 13” Q1/T1 *standard mark SMD dry pack 1000 Tamb = 40 C to +85 C PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 3 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 5. Block diagram PCF8574TS/3 PCF8574TS/3,112 SSOP20 Standard marking * IC’s tube - DSC bulk pack 1350 Tamb = 40 C to +85 C PCF8574TS/3,118 SSOP20 Reel 13” Q1/T1 *standard mark SMD 2500 Tamb = 40 C to +85 C PCF8574ATS/3 PCF8574ATS/3,118 SSOP20 Reel 13” Q1/T1 *standard mark SMD 2500 Tamb = 40 C to +85 C Table 2. Ordering options …continued Type number Orderable part number Package Packing method Minimum order quantity Temperature range Fig 1. Block diagram Fig 2. Simplified schematic diagram of P0 to P7 002aad624 INT I2C-BUS CONTROL LP FILTER PCF8574 PCF8574A INTERRUPT LOGIC A0 A1 A2 INPUT FILTER SHIFT REGISTER SDA SCL 8 bits write pulse read pulse POWER-ON VDD RESET VSS I/O PORT P0 P1 P2 P3 P4 P5 P6 P7 002aac109 write pulse read pulse D CI S FF Q power-on reset data from Shift Register Itrt(pu) 100 μA IOH IOL VDD P0 to P7 VSS D CI S FF Q data to Shift Register to interrupt logic PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 4 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 6. Pinning information 6.1 Pinning 6.2 Pin description Fig 3. Pin configuration for DIP16 Fig 4. Pin configuration for SO16 Fig 5. Pin configuration for SSOP20 PCF8574P PCF8574AP A0 VDD A1 SDA A2 SCL P0 INT P1 P7 P2 P6 P3 P5 VSS P4 002aad625 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 A0 VDD A1 SDA A2 SCL P0 INT P1 P7 P2 P6 P3 P5 VSS P4 PCF8574T/3 PCF8574AT/3 002aad626 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 PCF8574TS/3 PCF8574ATS/3 P7 SCL P6 n.c. n.c. SDA P5 P4 A0 A1 P3 n.c. n.c. A2 P2 P0 P1 002aad627 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 VDD INT VSS Table 3. Pin description Symbol Pin Description DIP16, SO16 SSOP20 A0 1 6 address input 0 A1 2 7 address input 1 A2 3 9 address input 2 P0 4 10 quasi-bidirectional I/O 0 P1 5 11 quasi-bidirectional I/O 1 P2 6 12 quasi-bidirectional I/O 2 P3 7 14 quasi-bidirectional I/O 3 VSS 8 15 supply ground P4 9 16 quasi-bidirectional I/O 4 P5 10 17 quasi-bidirectional I/O 5 P6 11 19 quasi-bidirectional I/O 6 P7 12 20 quasi-bidirectional I/O 7 INT 13 1 interrupt output (active LOW) SCL 14 2 serial clock line SDA 15 4 serial data line VDD 16 5 supply voltage n.c. - 3, 8, 13, 18 not connected PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 5 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 7. Functional description Refer to Figure 1 “Block diagram”. 7.1 Device address Following a START condition, the bus master must send the address of the slave it is accessing and the operation it wants to perform (read or write). The address format of the PCF8574/74A is shown in Figure 6. Slave address pins A2, A1 and A0 are held HIGH or LOW to choose one of eight slave addresses. To conserve power, no internal pull-up resistors are incorporated on A2, A1 or A0, so they must be externally held HIGH or LOW. The address pins (A2, A1, A0) can connect to VDD or VSS directly or through resistors. The last bit of the first byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation (write operation is shown in Figure 6). 7.1.1 Address maps The PCF8574 and PCF8574A are functionally the same, but have a different fixed portion (A6 to A3) of the slave address. This allows eight of the PCF8574 and eight of the PCF8574A to be on the same I2C-bus without address conflict. a. PCF8574 b. PCF8574A Fig 6. PCF8574 and PCF8574A slave addresses R/W 002aad628 0 1 0 0 A2 A1 A0 hardware selectable slave address 0 fixed R/W 002aad629 0 1 1 1 A2 A1 A0 hardware selectable slave address 0 fixed Table 4. PCF8574 address map Pin connectivity Address of PCF8574 Address byte value 7-bit hexadecimal address without R/W A2 A1 A0 A6 A5 A4 A3 A2 A1 A0 R/W Write Read VSS VSS VSS 0 1 0 0 0 0 0 - 40h 41h 20h VSS VSS VDD 0 1 0 0 0 0 1 - 42h 43h 21h VSS VDD VSS 0 1 0 0 0 1 0 - 44h 45h 22h VSS VDD VDD 0 1 0 0 0 1 1 - 46h 47h 23h VDD VSS VSS 0 1 0 0 1 0 0 - 48h 49h 24h VDD VSS VDD 0 1 0 0 1 0 1 - 4Ah 4Bh 25h VDD VDD VSS 0 1 0 0 1 1 0 - 4Ch 4Dh 26h VDD VDD VDD 0 1 0 0 1 1 1 - 4Eh 4Fh 27h PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 6 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 8. I/O programming 8.1 Quasi-bidirectional I/Os A quasi-bidirectional I/O is an input or output port without using a direction control register. Whenever the master reads the register, the value returned to master depends on the actual voltage or status of the pin. At power on, all the ports are HIGH with a weak 100 A internal pull-up to VDD, but can be driven LOW by an internal transistor, or an external signal. The I/O ports are entirely independent of each other, but each I/O octal is controlled by the same read or write data byte. Advantages of the quasi-bidirectional I/O over totem pole I/O include: • Better for driving LEDs since the p-channel (transistor to VDD) is small, which saves die size and therefore cost. LED drive only requires an internal transistor to ground, while the LED is connected to VDD through a current-limiting resistor. Totem pole I/O have both n-channel and p-channel transistors, which allow solid HIGH and LOW output levels without a pull-up resistor — good for logic levels. • Simpler architecture — only a single register and the I/O can be both input and output at the same time. Totem pole I/O have a direction register that specifies the port pin direction and it is always in that configuration unless the direction is explicitly changed. • Does not require a command byte. The simplicity of one register (no need for the pointer register or, technically, the command byte) is an advantage in some embedded systems where every byte counts because of memory or bandwidth limitations. Table 5. PCF8574A address map Pin connectivity Address of PCF8574A Address byte value 7-bit hexadecimal address without R/W A2 A1 A0 A6 A5 A4 A3 A2 A1 A0 R/W Write Read VSS VSS VSS 0 1 1 1 0 0 0 - 70h 71h 38h VSS VSS VDD 0 1 1 1 0 0 1 - 72h 73h 39h VSS VDD VSS 0 1 1 1 0 1 0 - 74h 75h 3Ah VSS VDD VDD 0 1 1 1 0 1 1 - 76h 77h 3Bh VDD VSS VSS 0 1 1 1 1 0 0 - 78h 79h 3Ch VDD VSS VDD 0 1 1 1 1 0 1 - 7Ah 7Bh 3Dh VDD VDD VSS 0 1 1 1 1 1 0 - 7Ch 7Dh 3Eh VDD VDD VDD 0 1 1 1 1 1 1 - 7Eh 7Fh 3Fh PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 7 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt There is only one register to control four possibilities of the port pin: Input HIGH, input LOW, output HIGH, or output LOW. Input HIGH: The master needs to write 1 to the register to set the port as an input mode if the device is not in the default power-on condition. The master reads the register to check the input status. If the external source pulls the port pin up to VDD or drives logic 1, then the master will read the value of 1. Input LOW: The master needs to write 1 to the register to set the port to input mode if the device is not in the default power-on condition. The master reads the register to check the input status. If the external source pulls the port pin down to VSS or drives logic 0, which sinks the weak 100 A current source, then the master will read the value of 0. Output HIGH: The master writes 1 to the register. There is an additional ‘accelerator’ or strong pull-up current when the master sets the port HIGH. The additional strong pull-up is only active during the HIGH time of the acknowledge clock cycle. This accelerator current helps the port’s 100 A current source make a faster rising edge into a heavily loaded output, but only at the start of the acknowledge clock cycle to avoid bus contention if an external signal is pulling the port LOW to VSS/driving the port with logic 0 at the same time. After the half clock cycle there is only the 100 A current source to hold the port HIGH. Output LOW: The master writes 0 to the register. There is a strong current sink transistor that holds the port pin LOW. A large current may flow into the port, which could potentially damage the part if the master writes a 0 to the register and an external source is pulling the port HIGH at the same time. Fig 7. Simple quasi-bidirectional I/O 002aah683 VDD weak 100 μA current source (inactive when output LOW) output HIGH VSS output LOW accelerator P port pull-up P7 - P0 pull-down with resistor to VSS or external drive LOW input LOW pull-up with resistor to VDD or external drive HIGH input HIGH PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 8 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 8.2 Writing to the port (Output mode) The master (microcontroller) sends the START condition and slave address setting the last bit of the address byte to logic 0 for the write mode. The PCF8574/74A acknowledges and the master then sends the data byte for P7 to P0 to the port register. As the clock line goes HIGH, the 8-bit data is presented on the port lines after it has been acknowledged by the PCF8574/74A. If a LOW is written, the strong pull-down turns on and stays on. If a HIGH is written, the strong pull-up turns on for 1⁄2 of the clock cycle, then the line is held HIGH by the weak current source. The master can then send a STOP or ReSTART condition or continue sending data. The number of data bytes that can be sent successively is not limited and the previous data is overwritten every time a data byte has been sent and acknowledged. Ensure a logic 1 is written for any port that is being used as an input to ensure the strong external pull-down is turned off. Simple code WRITE mode: ...

Remark: Bold type = generated by slave device. Fig 8. Write mode (output) S A6 A5 A4 A3 A2 A1 A0 0 A slave address START condition R/W acknowledge from slave 002aah349 P7 P6 1 data 1 A acknowledge from slave SCL 1 2 3 4 5 6 7 8 9 SDA A acknowledge from slave write to port data output from port tv(Q) P5 data 2 DATA 2 VALID P4 P3 P2 P1 P0 P7 P6 P4 P3 P2 P1 P0 P5 0 tv(Q) DATA 1 VALID P5 output voltage Itrt(pu) IOH P5 pull-up output current td(rst) INT PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 9 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 8.3 Reading from a port (Input mode) The port must have been previously written to logic 1, which is the condition after power-on reset. To enter the Read mode the master (microcontroller) addresses the slave device and sets the last bit of the address byte to logic 1 (address byte read). The slave will acknowledge and then send the data byte to the master. The master will NACK and then send the STOP condition or ACK and read the input register again. The read of any pin being used as an output will indicate HIGH or LOW depending on the actual state of the pin. If the data on the input port changes faster than the master can read, this data may be lost. The DATA 2 and DATA3 are lost because these data did not meet the setup time and hold time (see Figure 9). Simple code for Read mode: ...

Remark: Bold type = generated by slave device. 8.4 Power-on reset When power is applied to VDD, an internal Power-On Reset (POR) holds the PCF8574/74A in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCF8574/74A registers and I2C-bus/SMBus state machine will initialize to their default states of all I/Os to inputs with weak current source to VDD. Thereafter VDD must be lowered below VPOR and back up to the operation voltage for power-on reset cycle. A LOW-to-HIGH transition of SDA while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the last acknowledge phase is valid (output mode). Input data is lost. Fig 9. Read mode (input) S A6 A5 A4 A3 A2 A1 A0 1 A slave address START condition R/W acknowledge from slave 002aah383 data from port A acknowledge from master SDA 1 no acknowledge from master read from port data at port data from port DATA 1 DATA 4 INT DATA 4 DATA 2 DATA 3 P STOP condition tv(INT) trst(INT) th(D) tsu(D) trst(INT) DATA 1 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 10 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 8.5 Interrupt output (INT) The PCF8574/74A provides an open-drain output (INT) which can be fed to a corresponding input of the microcontroller (see Figure 10). As soon as a port input is changed, the INT will be active (LOW) and notify the microcontroller. An interrupt is generated at any rising or falling edge of the port inputs. After time tv(Q), the signal INT is valid. The interrupt will reset to HIGH when data on the port is changed to the original setting or data is read or written by the master. In the Write mode, the interrupt may be reset (HIGH) on the rising edge of the acknowledge bit of the address byte and also on the rising edge of the write to port pulse. The interrupt will always be reset (HIGH) on the falling edge of the write to port pulse (see Figure 8). The interrupt is reset (HIGH) in the Read mode on the rising edge of the read from port pulse (see Figure 9). During the interrupt reset, any I/O change close to the read or write pulse may not generate an interrupt, or the interrupt will have a very short pulse. After the interrupt is reset, any change in I/Os will be detected and transmitted as an INT. At power-on reset all ports are in Input mode and the initial state of the ports is HIGH, therefore, for any port pin that is pulled LOW or driven LOW by external source, the interrupt output will be active (output LOW). Fig 10. Application of multiple PCF8574/74As with interrupt 002aad634 VDD MICROCONTROLLER INT PCF8574 INT PCF8574 INT device 1 device 2 PCF8574A INT device 16 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 11 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 9. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-wire communication between different ICs or modules. The two wires are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 9.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 11). 9.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 12). 9.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 13). Fig 11. Bit transfer mba607 data line stable; data valid change of data allowed SDA SCL Fig 12. Definition of START and STOP conditions mba608 SDA SCL P STOP condition S START condition PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 12 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit (see Figure 14). The acknowledge bit is an active LOW level (generated by the receiving device) that indicates to the transmitter that the data transfer was successful. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that wants to issue an acknowledge bit has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge bit related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. Fig 13. System configuration 002aaa966 MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER SDA SCL I2C-BUS MULTIPLEXER SLAVE Fig 14. Acknowledgement on the I2C-bus 002aaa987 S START condition 1 2 8 9 clock pulse for acknowledgement not acknowledge acknowledge data output by transmitter data output by receiver SCL from master PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 13 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in Figure 15, P0 and P1 are inputs, and P2 to P7 are outputs. When used in this configuration, during a write, the input (P0 and P1) must be written as HIGH so the external devices fully control the input ports. The desired HIGH or LOW logic levels may be written to the ports used as outputs (P2 to P7). If 10 A internal output HIGH is not enough current source, the port needs external pull-up resistor. During a read, the logic levels of the external devices driving the input ports (P0 and P1) and the previous written logic level to the output ports (P2 to P7) will be read. The GPIO also has an interrupt line (INT) that can be connected to the interrupt logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O informs the microprocessor that there has been a change of data on its ports without having to communicate via the I2C-bus. 10.2 How to read and write to I/O expander (example) In the application example of PCF8574 shown in Figure 15, the microcontroller wants to control the P3 switch ON and the P7 LED ON when the temperature sensor P0 changes. 1. When the system power on: Core Processor needs to issue an initial command to set P0 and P1 as inputs and P[7:2] as outputs with value 1010 00 (LED off, MP3 off, camera on, audio off, switch off and latch off). 2. Operation: When the temperature changes above the threshold, the temperature sensor signal will toggle from HIGH to LOW. The INT will be activated and notifies the ‘core processor’ that there have been changes on the input pins. Read the input register. If P0 = 0 (temperature sensor has changed), then turn on LED and turn on switch. 3. Software code: //System Power on // write to PCF8574 with data 1010 0011b to set P[7:2] outputs and P[1:0] inputs <0100 0000> <1010 0011>

//Initial setting for PCF9574 Fig 15. Bidirectional I/O expander application 002aah384 VDD temperature sensor battery status control for latch control for switch control for audio control for camera control for MP3 P0 P1 P2 P3 P4 P5 P6 P7 VDD SDA SCL INT A0 A1 A2 CORE PROCESSOR VDD PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 14 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt while (INT == 1); //Monitor the interrupt pin. If INT = 1 do nothing //When INT = 0 then read input ports <1010 0010>

//Read PCF8574 data If (P0 == 0) //Temperature sensor activated { // write to PCF8574 with data 0010 1011b to turn on LED (P7), on Switch (P3) and keep P[1:0] as input ports. <0100 0000> <0010 1011>

// Write to PCF8574 } 10.3 High current-drive load applications The GPIO has a minimum guaranteed sinking current of 10 mA per bit at 5 V. In applications requiring additional drive, two port pins may be connected together to sink up to 20 mA current. Both bits must then always be turned on or off together. Up to five pins can be connected together to drive 80 mA, which is the device recommended total limit. Each pin needs its own limiting resistor as shown in Figure 16 to prevent damage to the device should all ports not be turned on at the same time. 10.4 Migration path NXP offers newer, more capable drop-in replacements for the PCF8574/74A in newer space-saving packages. PCA9670 replaces the interrupt output of the PCA9674 with hardware reset input to retain the maximum number of addresses and the PCA9672 replaces address A2 of the PCA9674 with hardware reset input to retain the interrupt but limit the number of addresses. Fig 16. High current-drive load application 002aah385 VDD P0 P1 P2 P3 P4 P5 P6 P7 VDD SDA SCL INT A0 A1 A2 CORE PROCESSOR VDD LOAD Table 6. Migration path Type number I2C-bus frequency Voltage range Number of addresses per device Interrupt Reset Total package sink current PCF8574/74A 100 kHz 2.5 V to 6 V 8 yes no 80 mA PCA8574/74A 400 kHz 2.3 V to 5.5 V 8 yes no 200 mA PCA9674/74A 1 MHz Fm+ 2.3 V to 5.5 V 64 yes no 200 mA PCA9670 1 MHz Fm+ 2.3 V to 5.5 V 64 no yes 200 mA PCA9672 1 MHz Fm+ 2.3 V to 5.5 V 16 yes yes 200 mA PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 15 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 11. Limiting values 12. Thermal characteristics Table 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage 0.5 +7 V IDD supply current - 100 mA ISS ground supply current - 100 mA VI input voltage VSS  0.5 VDD + 0.5 V II input current - 20 mA IO output current - 25 mA Ptot total power dissipation - 400 mW P/out power dissipation per output - 100 mW Tj(max) maximum junction temperature - 125 C Tstg storage temperature 65 +150 C Tamb ambient temperature operating 40 +85 C Table 8. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient SO16 package 115 C/W SSOP20 package 136 C/W PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 16 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 13. Static characteristics [1] The power-on reset circuit resets the I2C-bus logic at VDD < VPOR and sets all I/Os to logic 1 (with current source to VDD). Table 9. Static characteristics VDD = 2.5 V to 6 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply VDD supply voltage 2.5 - 6.0 V IDD supply current operating mode; VDD = 6 V; no load; VI = VDD or VSS; fSCL = 100 kHz - 40 100 A Istb standby current standby mode; VDD = 6 V; no load; VI = VDD or VSS - 2.5 10 A VPOR power-on reset voltage VDD = 6 V; no load; VI = VDD or VSS [1]- 1.3 2.4 V Input SCL; input/output SDA VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - VDD + 0.5 V IOL LOW-level output current VOL = 0.4 V 3 - - mA IL leakage current VI = VDD or VSS 1 - +1 A Ci input capacitance VI = VSS - - 7 pF I/Os; P0 to P7 VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - VDD + 0.5 V IIHL(max) maximum allowed input current through protection diode VI  VDD or VI  VSS - - 400 A IOL LOW-level output current VOL = 1 V; VDD = 5 V 10 25 - mA IOH HIGH-level output current VOH = VSS 30 - 300 A Itrt(pu) transient boosted pull-up current HIGH during acknowledge (see Figure 8); VOH = VSS; VDD = 2.5 V - 1 - mA Ci input capacitance - - 10 pF Co output capacitance - - 10 pF Interrupt INT (see Figure 8) IOL LOW-level output current VOL = 0.4 V 1.6 - - mA IL leakage current VI = VDD or VSS 1 - +1 A Select inputs A0, A1, A2 VIL LOW-level input voltage 0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - VDD + 0.5 V ILI input leakage current pin at VDD or VSS 250 - +250 nA PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 17 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 14. Dynamic characteristics [1] All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and VIH with an input voltage swing of VSS to VDD. Table 10. Dynamic characteristics VDD = 2.5 V to 6 V; VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit I2C-bus timing[1] (see Figure 17) fSCL SCL clock frequency - - 100 kHz tBUF bus free time between a STOP and START condition 4.7 - - s tHD;STA hold time (repeated) START condition 4 - - s tSU;STA set-up time for a repeated START condition 4.7 - - s tSU;STO set-up time for STOP condition 4 - - s tHD;DAT data hold time 0 - - ns tVD;DAT data valid time - - 3.4 s tSU;DAT data set-up time 250 - - ns tLOW LOW period of the SCL clock 4.7 - - s tHIGH HIGH period of the SCL clock 4 - - s tr rise time of both SDA and SCL signals - - 1 s tf fall time of both SDA and SCL signals - - 0.3 s Port timing (see Figure 8 and Figure 9) tv(Q) data output valid time CL  100 pF - - 4 s tsu(D) data input set-up time CL  100 pF 0 - - s th(D) data input hold time CL  100 pF 4 - - s Interrupt INT timing (see Figure 9) tv(INT) valid time on pin INT from port to INT; CL  100 pF - - 4 s trst(INT) reset time on pin INT from SCL to INT; CL  100 pF - - 4 s PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 18 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Rise and fall times refer to VIL and VIH. Fig 17. I2C-bus timing diagram 002aab175 protocol START condition (S) bit 7 MSB (A7) bit 6 (A6) bit 0 (R/W) acknowledge (A) STOP condition (P) SCL SDA tHD;STA tSU;DAT tHD;DAT tBUF tf tSU;STA tLOW tHIGH tVD;ACK tSU;STO 1 / fSCL tr tVD;DAT 0.3 × VDD 0.7 × VDD 0.3 × VDD 0.7 × VDD PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 19 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 15. Package outline Fig 18. Package outline SOT38-4 (DIP16) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT38-4 95-01-14 03-02-13 MH c (e 1 ) ME A L seating plane A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. UNIT A max. 1 2 b1 (1) (1) (1) b2 c D E e M Z L H mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. e1 ME w 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 2.54 7.62 0.254 8.25 7.80 10.0 8.3 4.2 0.51 3.2 0.76 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.1 0.3 0.01 0.32 0.31 0.39 0.33 0.17 0.02 0.13 0.03 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 20 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Fig 19. Package outline SOT162-1 (SO16) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT162-1 8 16 w M bp D detail X Z e 9 1 y 0.25 075E03 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 X θ A A1 A2 HE Lp Q E c L v M A (A 3 ) A 0 5 10 mm scale SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 99-12-27 03-02-19 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 21 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Fig 20. Package outline SOT266-1 (SSOP20) UNIT A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0 1.4 1.2 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 1 0.2 6.6 6.2 0.65 0.45 0.48 0.18 10 0 o 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. 0.75 0.45 SOT266-1 MO-152 99-12-27 03-02-19 w M θ A A1 A2 bp D HE Lp Q detail X E Z e c L v M A X (A 3 ) A y 0.25 1 10 20 11 pin 1 index 0 2.5 5 mm scale SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 A max. 1.5 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 22 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 16. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 17. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 17.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 17.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 17.3 Wave soldering Key characteristics in wave soldering are: PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 23 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 17.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 21) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 11 and 12 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 21. Table 11. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 12. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 24 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 18. Soldering of through-hole mount packages 18.1 Introduction to soldering through-hole mount packages This text gives a very brief insight into wave, dip and manual soldering. Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 18.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 18.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 C and 400 C, contact may be up to 5 seconds. MSL: Moisture Sensitivity Level Fig 21. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 25 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 18.4 Package related soldering information [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. Table 13. Suitability of through-hole mount IC packages for dipping and wave soldering Package Soldering method Dipping Wave CPGA, HCPGA - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1] PMFP[2] - not suitable PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 26 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 19. Soldering: PCB footprints Fig 22. PCB footprint for SOT162-1 (SO16); reflow soldering DIMENSIONS in mm P1 Ay By D1 D2 Gy Hy 11.200 6.400 2.400 0.700 C 0.800 10.040 8.600 Gx 11.450 sot162-1_fr Hx 1.270 11.900 SOT162-1 solder land occupied area Footprint information for reflow soldering of SO16 package Gy By Ay C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D2 (4x) D1 P2 1.320 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 27 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Fig 23. PCB footprint for SOT266-1 (SSOP20); reflow soldering DIMENSIONS in mm P1 Ay By D1 D2 Gy Hy 7.200 4.500 1.350 0.400 C 0.600 6.900 5.300 Gx 7.450 sot266-1_fr Hx 0.650 7.300 SOT266-1 solder land occupied area Footprint information for reflow soldering of SSOP20 package P2 0.750 P2 Gy C Hy (0.125) By Ay (0.125) Hx Gx D2 (4x) P1 D1 PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 28 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 20. Abbreviations Table 14. Abbreviations Acronym Description CDM Charged-Device Model CMOS Complementary Metal Oxide Semiconductor I/O Input/Output I2C-bus Inter IC bus ESD ElectroStatic Discharge FF Flip-Flop GPIO General Purpose Input/Output HBM Human Body Model IC Integrated Circuit LED Light Emitting Diode LP Low-Pass PLC Programmable Logic Controller POR Power-On Reset PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 29 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 21. Revision history Table 15. Revision history Document ID Release date Data sheet status Change notice Supersedes PCF8574_PCF8574A v.5 20130527 Product data sheet - PCF8574 v.4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Electrical parameter letter-symbols and their definitions are updated to conform to NXP presentation standards. • Section 1 “General description”: updated • Section 2 “Features and benefits”: – third bullet item: appended “with non-overvoltage tolerant I/O held to VDD with 100 A current source” – added (new) fourth and seventh bullet items – added sixth bullet item: “Total package sink capability of 80 mA” – ninth bullet changed from “(10 A maximum)” to “(2.5 A typical)” – deleted (old) 11th, 12th and 13th bullet items • Added (new) eighth bullet item “Mobile devices” • Table 1 “Ordering information”: – Type number corrected from “PCF8574T” to “PCF8574/3” – Type number corrected from “PCF8574AT” to “PCF8574AT/3” – Type number corrected from “PCF8574TS” to “PCF8574TS/3” – Type number corrected from “PCF8574ATS” to “PCF8574ATS/3” • Added Section 4.1 “Ordering options” • Figure 4 “Pin configuration for SO16”: updated type numbers (appended “/3”) • Figure 5 “Pin configuration for SSOP20”: updated type numbers (appended “/3”) • Section 6.2 “Pin description”: combined DIP16, SO16 and SSOP20 pin descriptions into one table (Table 3) • Section 7 “Functional description” reorganized • Section 7.1 “Device address”, first paragraph, fourth sentence: appended “so they must be externally held HIGH or LOW” • Table 4 “PCF8574 address map” updated: added column for 7-bit hexadecimal address without R/W • Table 5 “PCF8574A address map” updated: added column for 7-bit hexadecimal address without R/W • Section 8.1 “Quasi-bidirectional I/Os”: re-written and placed before Section 8.4 “Power-on reset” • added Section 8.2 “Writing to the port (Output mode)” • added Section 8.3 “Reading from a port (Input mode)” • Figure 9 “Read mode (input)”: changed symbol “tps” to “tsu” • Section 8.4 “Power-on reset” re-written • Section 8.5 “Interrupt output (INT)” re-written • Figure 10 “Application of multiple PCF8574/74As with interrupt” updated: changed device 16 from “PCF8574” to “PCF8574A” • Section 9.3 “Acknowledge”, first paragraph, third sentence re-written. • Added Section 10 “Application design-in information” PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 30 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Modifications: (continued) • Table 7 “Limiting values”: – changed parameter description for symbol II from “DC input current” to “input current” – changed parameter description for symbol IO from “DC output current” to “output current” – changed parameter description for symbol ISS from “supply current” to “ground supply current” – changed symbol “PO” to “P/out” – added Tj(max) limits • Added Section 12 “Thermal characteristics” • Table 9 “Static characteristics”: – table title changed from “DC characteristics” to “Static characteristics” – sub-section “I/Os; P0 to P7”: changed parameter description for symbol Itrt(pu) from “transient pull-up current” to “transient boosted pull-up current” – moved sub-section “Port timing” to Table 10 “Dynamic characteristics” – sub-section “Interrupt INT”: moved sub-sub-section “Timing” to Table 10 “Dynamic characteristics” • Table 10 “Dynamic characteristics”: – sub-section “I2C-bus timing”: deleted symbol/parameter “tSW, tolerable spike width on bus” – sub-section “Port timing”: changed symbol/parameter from “tpv, output data valid time” to “tv(Q), data output valid time” – sub-section “Port timing”: changed symbol/parameter from “tsu, input data set-up time” to “tsu(D), data input set-up time” – sub-section “Port timing”: changed symbol/parameter from “th, input data hold time” to “th(D), data input hold time” – sub-section “Interrupt INT”: changed parameter description for symbol tv(INT) from “INT output valid time” to “valid time on pin INT” – sub-section “Interrupt INT”: changed parameter description for symbol trst(INT) from “INT reset delay time” to “reset time on pin INT” • Added Section 19 “Soldering: PCB footprints” PCF8574 v.4 (9397 750 10462) 20021122 Product specification - PCF8574 v.3 PCF8574 v.3 (9397 750 09911) 20020729 Product specification - PCF8574 v.2 PCF8574 v.2 (9397 750 01758) 19970402 Product specification - PCF8574_PCF8574A v.1 PCF8574_PCF8574A v.1 (9397 750 70011) 199409 Product specification - - Table 15. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 31 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt 22. Legal information 22.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 22.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 22.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 5 — 27 May 2013 32 of 33 NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 22.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 23. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 May 2013 Document identifier: PCF8574_PCF8574A Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 24. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Device address. . . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.1 Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 I/O programming . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quasi-bidirectional I/Os . . . . . . . . . . . . . . . . . . 6 8.2 Writing to the port (Output mode) . . . . . . . . . . . 8 8.3 Reading from a port (Input mode) . . . . . . . . . . 9 8.4 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.5 Interrupt output (INT) . . . . . . . . . . . . . . . . . . . 10 9 Characteristics of the I2C-bus . . . . . . . . . . . . 11 9.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.1.1 START and STOP conditions . . . . . . . . . . . . . 11 9.2 System configuration . . . . . . . . . . . . . . . . . . . 11 9.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 12 10 Application design-in information . . . . . . . . . 13 10.1 Bidirectional I/O expander applications . . . . . 13 10.2 How to read and write to I/O expander (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.3 High current-drive load applications . . . . . . . . 14 10.4 Migration path . . . . . . . . . . . . . . . . . . . . . . . . . 14 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15 12 Thermal characteristics . . . . . . . . . . . . . . . . . 15 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 16 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 17 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19 16 Handling information. . . . . . . . . . . . . . . . . . . . 22 17 Soldering of SMD packages . . . . . . . . . . . . . . 22 17.1 Introduction to soldering . . . . . . . . . . . . . . . . . 22 17.2 Wave and reflow soldering . . . . . . . . . . . . . . . 22 17.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22 17.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 18 Soldering of through-hole mount packages . 24 18.1 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 18.2 Soldering by dipping or by solder wave . . . . . 24 18.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 24 18.4 Package related soldering information. . . . . . 25 19 Soldering: PCB footprints . . . . . . . . . . . . . . . 26 20 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 28 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . 29 22 Legal information . . . . . . . . . . . . . . . . . . . . . . 31 22.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31 22.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 22.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 31 22.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 32 23 Contact information . . . . . . . . . . . . . . . . . . . . 32 24 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 1. General description The LPC408x/7x is an ARM Cortex-M4 based digital signal controller for embedded applications requiring a high level of integration and low power dissipation. The ARM Cortex-M4 is a next generation core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point processor is integrated in the core for several versions of the part. The LPC408x/7x adds a specialized flash memory accelerator to accomplish optimal performance when executing code from flash. The LPC408x/7x is targeted to operate at up to 120 MHz CPU frequency. The peripheral complement of the LPC408x/7x includes up to 512 kB of flash program memory, up to 96 kB of SRAM data memory, up to 4032 byte of EEPROM data memory, External Memory controller (EMC), LCD, Ethernet, USB Device/Host/OTG, an SPI Flash Interface (SPIFI), a General Purpose DMA controller, five UARTs, three SSP controllers, three I2C-bus interfaces, a Quadrature Encoder Interface, four general purpose timers, two general purpose PWMs with six outputs each and one motor control PWM, an ultra-low power RTC with separate battery supply and event recorder, a windowed watchdog timer, a CRC calculation engine and up to 165 general purpose I/O pins. The analog peripherals include one eight-channel 12-bit ADC, two analog comparators, and a DAC. The pinout of LPC408x/7x is intended to allow pin function compatibility with the LPC24xx/23xx as well as the LPC178x/7x families. 2. Features and benefits  Functional replacement for LPC23xx/24xx and LPC178x/7x family devices.  ARM Cortex-M4 core:  ARM Cortex-M4 processor, running at frequencies of up to 120 MHz.  ARM Cortex-M4 built-in Memory Protection Unit (MPU) supporting eight regions.  ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC).  Hardware floating-point unit (not all versions).  Non-maskable Interrupt (NMI) input. LPC408x/7x 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC; SPIFI Rev. 3 — 1 May 2014 Product data sheet LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 2 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller  JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch points.  System tick timer.  System:  Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, and General Purpose DMA controller. This interconnect provides communication with no arbitration delays unless two masters attempt to access the same slave at the same time.  Split APB bus allows for higher throughput with fewer stalls between the CPU and DMA. A single level of write buffering allows the CPU to continue without waiting for completion of APB writes if the APB was not already busy.  Embedded Trace Macrocell (ETM) module supports real-time trace.  Boundary scan for simplified board testing.  Memory:  512 kB on-chip flash program memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. The combination of an enhanced flash memory accelerator and location of the flash memory on the CPU local code/data bus provides high code performance from flash.  Up to 96 kB on-chip SRAM includes: 64 kB of main SRAM on the CPU with local code/data bus for high-performance CPU access. Two 16 kB peripheral SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for DMA memory as well as for general purpose instruction and data storage.  Up to 4032 byte on-chip EEPROM.  LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film Transistors (TFT) displays.  Dedicated DMA controller.  Selectable display resolution (up to 1024  768 pixels).  Supports up to 24-bit true-color mode.  External Memory Controller (EMC) provides support for asynchronous static memory devices such as RAM, ROM and flash, as well as dynamic memories such as single data rate SDRAM.  Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with the SSP, I2S, UART, CRC engine, Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, GPIO, and for memory-to-memory transfers.  Serial interfaces:  Quad SPI Flash Interface (SPIFI) with four lanes and up to 40 MB per second.  Ethernet MAC with MII/RMII interface and associated DMA controller. These functions reside on an independent AHB.  USB 2.0 full-speed dual port device/host/OTG controller with on-chip PHY and associated DMA controller.  Five UARTs with fractional baud rate generation, internal FIFO, DMA support, and RS-485/EIA-485 support. One UART (UART1) has full modem control I/O, and one UART (USART4) supports IrDA, synchronous mode, and a smart card mode conforming to ISO7816-3. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 3 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller  Three SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces can be used with the GPDMA controller.  Three enhanced I2C-bus interfaces, one with a true open-drain output supporting the full I2C-bus specification and Fast-mode Plus with data rates of 1 Mbit/s, two with standard port pins. Enhancements include multiple address recognition and monitor mode.  I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with the GPDMA.  CAN controller with two channels.  Digital peripherals:  SD/MMC memory card interface.  Up to 165 General Purpose I/O (GPIO) pins depending on the packaging, with configurable pull-up/down resistors, open-drain mode, and repeater mode. All GPIOs are located on an AHB bus for fast access and support Cortex-M4 bit-banding. GPIOs can be accessed by the General Purpose DMA Controller. Any pin of ports 0 and 2 can be used to generate an interrupt.  Two external interrupt inputs configurable as edge/level sensitive. All pins on port 0 and port 2 can be used as edge sensitive interrupt sources.  Four general purpose timers/counters, with a total of eight capture inputs and ten compare outputs. Each timer block has an external count input. Specific timer events can be selected to generate DMA requests.  Quadrature encoder interface that can monitor one external quadrature encoder.  Two standard PWM/timer blocks with external count input option.  One motor control PWM with support for three-phase motor control.  Real-Time Clock (RTC) with a separate power domain. The RTC is clocked by a dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered backup registers, allowing system status to be stored when the rest of the chip is powered off. Battery power can be supplied from a standard 3 V lithium button cell. The RTC will continue working when the battery voltage drops to as low as 2.1 V. An RTC interrupt can wake up the CPU from any reduced power mode.  Event Recorder that can capture the clock value when an event occurs on any of three inputs. The event identification and the time it occurred are stored in registers. The Event Recorder is located in the RTC power domain and can therefore operate as long as there is RTC power.  Windowed Watchdog Timer (WWDT). Windowed operation, dedicated internal oscillator, watchdog warning interrupt, and safety features.  CRC Engine block can calculate a CRC on supplied data using one of three standard polynomials. The CRC engine can be used in conjunction with the DMA controller to generate a CRC without CPU involvement in the data transfer.  Analog peripherals:  12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins, conversion rates up to 400 kHz, and multiple result registers. The 12-bit ADC can be used with the GPDMA controller.  10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA support.  Two analog comparators. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 4 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller  Power control:  Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.  The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up from any priority interrupt that can occur while the clocks are stopped in Deep-sleep, Power-down, and Deep power-down modes.  Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, PORT0/2 pin interrupt, and NMI).  Brownout detect with separate threshold for interrupt and forced reset.  On-chip Power-On Reset (POR).  Clock generation:  Clock output function that can reflect the main oscillator clock, IRC clock, RTC clock, CPU clock, USB clock, or the watchdog timer clock.  On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.  12 MHz Internal RC oscillator (IRC) trimmed to 1 % accuracy that can optionally be used as a system clock.  An on-chip PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the main oscillator or the internal RC oscillator.  A second, dedicated PLL may be used for USB interface in order to allow added flexibility for the Main PLL settings.  Versatile pin function selection feature allows many possibilities for using on-chip peripheral functions.  Unique device serial number for identification purposes.  Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of 40 C to 85 C.  Available as LQFP208, TFBGA208, TFBGA180, LQFP144, TFBGA80, and LQFP80 package. 3. Applications  Communications:  Point-of-sale terminals, web servers, multi-protocol bridges  Industrial/Medical:  Automation controllers, application control, robotics control, HVAC, PLC, inverters, circuit breakers, medical scanning, security monitoring, motor drive, video intercom  Consumer/Appliance:  Audio, MP3 decoders, alarm systems, displays, printers, scanners, small appliances, fitness equipment  Automotive:  After-market, car alarms, GPS/fleet monitors LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 5 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 4. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC4088 LPC4088FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1 LPC4088FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15  15  0.7 mm SOT950-1 LPC4088FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls SOT570-3 LPC4088FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1 LPC4078 LPC4078FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1 LPC4078FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15  15  0.7 mm SOT950-1 LPC4078FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls SOT570-3 LPC4078FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1 LPC4078FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1 LPC4078FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1 LPC4076 LPC4076FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls SOT570-3 LPC4076FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1 LPC4074 LPC4074FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1 LPC4074FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1 LPC4072 LPC4072FET80 TFBGA80 plastic thin fine-pitch ball grid array package; 80 balls SOT1328-1 LPC4072FBD80 LQFP80 plastic low-profile quad package; 80 leads; body 12  12  1.4 mm SOT315-1 Table 2. Ordering options Type number Flash (kB) SRAM (kB) EEPROM (B) EMC bus width (bit) LCD Ethernet USB UART QEI SD/MMC Comparator FPU Package LPC4088 LPC4088FBD208 512 96 4032 32 yes yes H/O/D 5 yes yes yes yes LQFP208 LPC4088FET208 512 96 4032 32 yes yes H/O/D 5 yes yes yes yes TFBGA208 LPC4088FET180 512 96 4032 16 yes yes H/O/D 5 yes yes yes yes TFBGA180 LPC4088FBD144 512 96 4032 8 yes yes H/O/D 5 yes yes yes yes LQFP144 LPC4078 LPC4078FBD208 512 96 4032 32 no yes H/O/D 5 yes yes yes yes LQFP208 LPC4078FET208 512 96 4032 32 no yes H/O/D 5 yes yes yes yes TFBGA208 LPC4078FET180 512 96 4032 16 no yes H/O/D 5 yes yes yes yes TFBGA180 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 6 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller LPC4078FBD144 512 96 4032 8 no yes H/O/D 5 yes yes yes yes LQFP144 LPC4078FBD100 512 96 4032 - no yes H/O/D 5 yes yes yes yes LQFP100 LPC4078FBD80 512 96 4032 - no yes H/O/D 5 yes yes yes yes LQFP80 LPC4076 LPC4076FET180 256 80 2048 16 no yes H/O/D 5 yes yes yes yes TFBGA180 LPC4076FBD144 256 80 2048 8 no yes H/O/D 5 yes yes yes yes LQFP144 LPC4074 LPC4074FBD144 128 40 2048 - no no D 4 no no no no LQFP144 LPC4074FBD80 128 40 2048 - no no D 4 no no no no LQFP80 LPC4072 LPC4072FET80 64 24 2048 - no no D 4 no no no no TFBGA80 LPC4072FBD80 64 24 2048 - no no D 4 no no no no LQFP80 Table 2. Ordering options …continued Type number Flash (kB) SRAM (kB) EEPROM (B) EMC bus width (bit) LCD Ethernet USB UART QEI SD/MMC Comparator FPU Package LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 7 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 5. Block diagram (1) Not available on all parts. Fig 1. Block diagram SRAM 96/80/ 40/24 kB ARM CORTEX-M4 TEST/DEBUG INTERFACE EMULATION TRACE MODULE FLASH ACCELERATOR FLASH 512/256/128/64 kB GPDMA CONTROLLER I-code bus D-code bus system bus AHB TO APB BRIDGE 0 HIGH-SPEED GPIO AHB TO APB BRIDGE 1 4032 B/ 2048 B EEPROM CLOCK GENERATION, POWER CONTROL, SYSTEM FUNCTIONS clocks and controls JTAG interface debug port SSP0/2 USART4(1) UART2/3 SYSTEM CONTROL 2 x ANALOG COMPARATOR(1) SSP1 UART0/1 I2C0/1 CAN 0/1 TIMER 0/1 WINDOWED WDT 12-bit ADC PWM0/1 PIN CONNECT GPIO INTERRUPT CONTROL RTC BACKUP REGISTERS EVENT RECORDER 32 kHz OSCILLATOR APB slave group 1 APB slave group 0 RTC POWER DOMAIN LPC408x/7x master ETHERNET(1) master USB DEVICE/ HOST(1)/OTG(1) master 002aag491 slave slave CRC slave SPIFI slave slave slave slave EMC(1) ROM slave slave LCD(1) slave MULTILAYER AHB MATRIX I2C2 TIMER2/3 DAC I2S QUADRATURE ENCODER(1) MOTOR CONTROL PWM MPU FPU(1) SD/MMC(1) = connected to GPDMA LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 8 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 6. Pinning information 6.1 Pinning Fig 2. Pin configuration (LQFP208) Fig 3. Pin configuration (LQFP144) Fig 4. Pin configuration (LQFP100) LPC408x/7x 156 53 104 208 157 105 1 52 002aag732 LPC408x/7x 108 37 72 144 109 73 1 36 002aag735 LPC407x 50 1 25 75 51 26 76 100 002aah638 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 9 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 5. Pin configuration (LQFP80) Fig 6. Pin configuration (TFBGA208) 40 1 20 60 41 21 61 80 002aag865 LPC408x/7x 002aag733 LPC408x/7x Transparent top view ball A1 index area U T R P N M K H L J G F E D C A B 2 4 6 8 10 12 13 14 15 17 16 1 3 5 7 9 11 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 10 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 6.2 Pin description I/O pins on the LPC408x/7x are 5 V tolerant and have input hysteresis unless otherwise indicated in the table below. Crystal pins, power pins, and reference voltage pins are not 5 V tolerant. In addition, when pins are selected to be ADC inputs, they are no longer 5 V tolerant and the input voltage must be limited to the voltage at the ADC positive reference pin (VREFP). All port pins Pn[m] are multiplexed, and the multiplexed functions appear in Table 3 in the order defined by the FUNC bits of the corresponding IOCON register up to the highest used function number. Each port pin can support up to eight multiplexed functions. IOCON register FUNC values which are reserved are noted as “R” in the pin configuration table. Fig 7. Pin configuration (TFBGA180) Fig 8. Pin configuration (TFBGA80) 002aag734 LPC408x/7x 1 2 3 4 5 6 7 8 9 10 11 12 13 14 ball A1 index area P N M L K J G E H F D C B A Transparent top view 002aah684 LPC4072FET80 Transparent top view 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K ball A1 index area xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 11 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Table 3. Pin description Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description P0[0] to P0[31] I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the pin connect block. P0[0] 94 U15 M10 66 46 37 J9 [3] I; PU I/O P0[0] — General purpose digital input/output pin. I CAN_RD1 — CAN1 receiver input. O U3_TXD — Transmitter output for UART3. I/O I2C1_SDA — I2C1 data input/output (this pin does not use a specialized I2C pad). O U0_TXD — Transmitter output for UART0. P0[1] 96 T14 N11 67 47 38 J10 [3] I; PU I/O P0[1] — General purpose digital input/output pin. O CAN_TD1 — CAN1 transmitter output. I U3_RXD — Receiver input for UART3. I/O I2C1_SCL — I2C1 clock input/output (this pin does not use a specialized I2C pad). I U0_RXD — Receiver input for UART0. P0[2] 202 C4 D5 141 98 79 A2 [3] I; PU I/O P0[2] — General purpose digital input/output pin. O U0_TXD — Transmitter output for UART0. O U3_TXD — Transmitter output for UART3. P0[3] 204 D6 A3 142 99 80 A1 [3] I; PU I/O P0[3] — General purpose digital input/output pin. I U0_RXD — Receiver input for UART0. I U3_RXD — Receiver input for UART3. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 12 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[4] 168 B12 A11 116 81 - - [3] I; PU I/O P0[4] — General purpose digital input/output pin. I/O I2S_RX_SCK — I2S Receive clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. I CAN_RD2 — CAN2 receiver input. I T2_CAP0 — Capture input for Timer 2, channel 0. - R — Function reserved. I/O CMP_ROSC — Comparator relaxation oscillator for 555 timer applications. - R — Function reserved. O LCD_VD[0] — LCD data. P0[5] 166 C12 B11 115 80 - - [3] I; PU I/O P0[5] — General purpose digital input/output pin. I/O I2S_RX_WS — I2S Receive word select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. O CAN_TD2 — CAN2 transmitter output. I T2_CAP1 — Capture input for Timer 2, channel 1. - R — Function reserved. I CMP_RESET — Comparator reset. - R — Function reserved. O LCD_VD[1] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 13 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[6] 164 D13 D11 113 79 64 A7 [3] I; PU I/O P0[6] — General purpose digital input/output pin. I/O I2S_RX_SDA — I2S Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I/O SSP1_SSEL — Slave Select for SSP1. O T2_MAT0 — Match output for Timer 2, channel 0. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I/O CMP_ROSC — Comparator relaxation oscillator for 555 timer applications. - R — Function reserved. O LCD_VD[8] — LCD data. P0[7] 162 C13 B12 112 78 63 A8 [4] I; IA I/O P0[7] — General purpose digital input/output pin. I/O I2S_TX_SCK — I2S transmit clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. I/O SSP1_SCK — Serial Clock for SSP1. O T2_MAT1 — Match output for Timer 2, channel 1. I RTC_EV0 — Event input 0 to Event Monitor/Recorder. I CMP_VREF — Comparator reference voltage. - R — Function reserved. O LCD_VD[9] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 14 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[8] 160 A15 C12 111 77 62 A10 [4] I; IA I/O P0[8] — General purpose digital input/output pin. I/O I2S_TX_WS — I2S Transmit word select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I/O SSP1_MISO — Master In Slave Out for SSP1. O T2_MAT2 — Match output for Timer 2, channel 2. I RTC_EV1 — Event input 1 to Event Monitor/Recorder. I CMP1_IN[3] — Comparator 1, input 3. - R — Function reserved. O LCD_VD[16] — LCD data. P0[9] 158 C14 A13 109 76 61 A9 [4] I; IA I/O P0[9] — General purpose digital input/output pin. I/O I2S_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. I/O SSP1_MOSI — Master Out Slave In for SSP1. O T2_MAT3 — Match output for Timer 2, channel 3. I RTC_EV2 — Event input 2 to Event Monitor/Recorder. I CMP1_IN[2] — Comparator 1, input 2. - R — Function reserved. O LCD_VD[17] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 15 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[10] 98 T15 L10 69 48 39 K9 [3] I; PU I/O P0[10] — General purpose digital input/output pin. O U2_TXD — Transmitter output for UART2. I/O I2C2_SDA — I2C2 data input/output (this pin does not use a specialized I2C pad). O T3_MAT0 — Match output for Timer 3, channel 0. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_VD[5] — LCD data. P0[11] 100 R14 P12 70 49 40 K10 [3] I; PU I/O P0[11] — General purpose digital input/output pin. I U2_RXD — Receiver input for UART2. I/O I2C2_SCL — I2C2 clock input/output (this pin does not use a specialized I2C pad). O T3_MAT1 — Match output for Timer 3, channel 1. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_VD[10] — LCD data. P0[12] 41 R1 J4 29 - - - [5] I; PU I/O P0[12] — General purpose digital input/output pin. O USB_PPWR2 — Port Power enable signal for USB port 2. I/O SSP1_MISO — Master In Slave Out for SSP1. I ADC0_IN[6] — A/D converter 0, input 6. When configured as an ADC input, the digital function of the pin must be disabled. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 16 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[13] 45 R2 J5 32 - - - [5] I; PU I/O P0[13] — General purpose digital input/output pin. O USB_UP_LED2 — USB port 2 GoodLink LED indicator. It is LOW when the device is configured (non-control endpoints enabled), or when the host is enabled and has detected a device on the bus. It is HIGH when the device is not configured, or when host is enabled and has not detected a device on the bus, or during global suspend. It transitions between LOW and HIGH (flashes) when the host is enabled and detects activity on the bus. I/O SSP1_MOSI — Master Out Slave In for SSP1. I ADC0_IN[7] — A/D converter 0, input 7. When configured as an ADC input, the digital function of the pin must be disabled. P0[14] 69 T7 M5 48 - - - [3] I; PU I/O P0[14] — General purpose digital input/output pin. O USB_HSTEN2 — Host Enabled status for USB port 2. I/O SSP1_SSEL — Slave Select for SSP1. O USB_CONNECT2 — SoftConnect control for USB port 2. Signal used to switch an external 1.5 k resistor under software control. Used with the SoftConnect USB feature. P0[15] 128 J16 H13 89 62 47 F9 [3] I; PU I/O P0[15] — General purpose digital input/output pin. O U1_TXD — Transmitter output for UART1. I/O SSP0_SCK — Serial clock for SSP0. - R — Function reserved. - R — Function reserved. I/O SPIFI_IO[2] — Data bit 0 for SPIFI. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 17 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[16] 130 J14 H14 90 63 48 F8 [3] I; PU I/O P0[16] — General purpose digital input/output pin. I U1_RXD — Receiver input for UART1. I/O SSP0_SSEL — Slave Select for SSP0. - R — Function reserved. - R — Function reserved. I/O SPIFI_IO[3] — Data bit 0 for SPIFI. P0[17] 126 K17 J12 87 61 46 F10 [3] I; PU I/O P0[17] — General purpose digital input/output pin. I U1_CTS — Clear to Send input for UART1. I/O SSP0_MISO — Master In Slave Out for SSP0. - R — Function reserved. - R — Function reserved. I/O SPIFI_IO[1] — Data bit 0 for SPIFI. P0[18] 124 K15 J13 86 60 45 G10 [3] I; PU I/O P0[18] — General purpose digital input/output pin. I U1_DCD — Data Carrier Detect input for UART1. I/O SSP0_MOSI — Master Out Slave In for SSP0. - R — Function reserved. - R — Function reserved. I/O SPIFI_IO[0] — Data bit 0 for SPIFI. P0[19] 122 L17 J10 85 59 - - [3] I; PU I/O P0[19] — General purpose digital input/output pin. I U1_DSR — Data Set Ready input for UART1. O SD_CLK — Clock output line for SD card interface. I/O I2C1_SDA — I2C1 data input/output (this pin does not use a specialized I2C pad). - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_VD[13] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 18 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[20] 120 M17 K14 83 58 - - [3] I; PU I/O P0[20] — General purpose digital input/output pin. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I/O SD_CMD — Command line for SD card interface. I/O I2C1_SCL — I2C1 clock input/output (this pin does not use a specialized I2C pad). - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_VD[14] — LCD data. P0[21] 118 M16 K11 82 57 - - [3] I; PU I/O P0[21] — General purpose digital input/output pin. I U1_RI — Ring Indicator input for UART1. O SD_PWR — Power Supply Enable for external SD card power supply. O U4_OE — RS-485/EIA-485 output enable signal for UART4. I CAN_RD1 — CAN1 receiver input. I/O U4_SCLK — USART 4 clock input or output in synchronous mode. P0[22] 116 N17 L14 80 56 44 H10 [6] I; PU I/O P0[22] — General purpose digital input/output pin. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I/O SD_DAT[0] — Data line 0 for SD card interface. O U4_TXD — Transmitter output for USART4 (input/output in smart card mode). O CAN_TD1 — CAN1 transmitter output. O SPIFI_CLK — Clock output for SPIFI. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 19 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[23] 18 H1 F5 13 9 - - [5] I; PU I/O P0[23] — General purpose digital input/output pin. I ADC0_IN[0] — A/D converter 0, input 0. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2S_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. I T3_CAP0 — Capture input for Timer 3, channel 0. P0[24] 16 G2 E1 11 8 - - [5] I; PU I/O P0[24] — General purpose digital input/output pin. I ADC0_IN[1] — A/D converter 0, input 1. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2S_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. I T3_CAP1 — Capture input for Timer 3, channel 1. P0[25] 14 F1 E4 10 7 7 D1 [5] I; PU I/O P0[25] — General purpose digital input/output pin. I ADC0_IN[2] — A/D converter 0, input 2. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2S_RX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. O U3_TXD — Transmitter output for UART3. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 20 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P0[26] 12 E1 D1 8 6 6 D2 [7] I; PU I/O P0[26] — General purpose digital input/output pin. I ADC0_IN[3] — A/D converter 0, input 3. When configured as an ADC input, the digital function of the pin must be disabled. O DAC_OUT — D/A converter output. When configured as the DAC output, the digital function of the pin must be disabled. I U3_RXD — Receiver input for UART3. P0[27] 50 T1 L3 35 25 - - [8] I I/O P0[27] — General purpose digital input/output pin. I/O I2C0_SDA — I2C0 data input/output. (This pin uses a specialized I2C pad). I/O USB_SDA1 — I2C serial data for communication with an external USB transceiver. P0[28] 48 R3 M1 34 24 - - [8] I I/O P0[28] — General purpose digital input/output pin. I/O I2C0_SCL — I2C0 clock input/output (this pin uses a specialized I2C pad. I/O USB_SCL1 — I2C serial clock for communication with an external USB transceiver. P0[29] 61 U4 K5 42 29 22 J3 [9] I I/O P0[29] — General purpose digital input/output pin. I/O USB_D+1 — USB port 1 bidirectional D+ line. I EINT0 — External interrupt 0 input. P0[30] 62 R6 N4 43 30 23 K3 [9] I I/O P0[30] — General purpose digital input/output pin. I/O USB_D1 — USB port 1 bidirectional D line. I EINT1 — External interrupt 1 input. P0[31] 51 T2 N1 36 - - - [9] I I/O P0[31] — General purpose digital input/output pin. I/O USB_D+2 — USB port 2 bidirectional D+ line. P1[0] to P1[31] I/O Port 1: Port 1 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 21 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[0] 196 A3 B5 136 95 76 A3 [3] I; PU I/O P1[0] — General purpose digital input/output pin. O ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface). - R — Function reserved. I T3_CAP1 — Capture input for Timer 3, channel 1. I/O SSP2_SCK — Serial clock for SSP2. P1[1] 194 B5 A5 135 94 75 B4 [3] I; PU I/O P1[1] — General purpose digital input/output pin. O ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface). - R — Function reserved. O T3_MAT3 — Match output for Timer 3, channel 3. I/O SSP2_MOSI — Master Out Slave In for SSP2. P1[2] 185 D9 B7 - - - - [3] I; PU I/O P1[2] — General purpose digital input/output pin. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). O SD_CLK — Clock output line for SD card interface. O PWM0[1] — Pulse Width Modulator 0, output 1. P1[3] 177 A10 A9 - - - - [3] I; PU I/O P1[3] — General purpose digital input/output pin. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I/O SD_CMD — Command line for SD card interface. O PWM0[2] — Pulse Width Modulator 0, output 2. P1[4] 192 A5 C6 133 93 74 B5 [3] I; PU I/O P1[4] — General purpose digital input/output pin. O ENET_TX_EN — Ethernet transmit data enable (RMII/MII interface). - R — Function reserved. O T3_MAT2 — Match output for Timer 3, channel 2. I/O SSP2_MISO — Master In Slave Out for SSP2. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 22 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[5] 156 A17 B13 - - - - [3] I; PU I/O P1[5] — General purpose digital input/output pin. O ENET_TX_ER — Ethernet Transmit Error (MII interface). O SD_PWR — Power Supply Enable for external SD card power supply. O PWM0[3] — Pulse Width Modulator 0, output 3. - R — Function reserved. I CMP1_IN[1] — Comparator 1, input 1. P1[6] 171 B11 B10 - - - - [3] I; PU I/O P1[6] — General purpose digital input/output pin. I ENET_TX_CLK — Ethernet Transmit Clock (MII interface). I/O SD_DAT[0] — Data line 0 for SD card interface. O PWM0[4] — Pulse Width Modulator 0, output 4. - R — Function reserved. I CMP0_IN[3] — Comparator 0, input 3. P1[7] 153 D14 C13 - - - - [3] I; PU I/O P1[7] — General purpose digital input/output pin. I ENET_COL — Ethernet Collision detect (MII interface). I/O SD_DAT[1] — Data line 1 for SD card interface. O PWM0[5] — Pulse Width Modulator 0, output 5. - R — Function reserved. I CMP1_IN[0] — Comparator 1, input 0. P1[8] 190 C7 B6 132 92 73 C5 [3] I; PU I/O P1[8] — General purpose digital input/output pin. I ENET_CRS (ENET_CRS_DV) — Ethernet Carrier Sense (MII interface) or Ethernet Carrier Sense/Data Valid (RMII interface). - R — Function reserved. O T3_MAT1 — Match output for Timer 3, channel 1. I/O SSP2_SSEL — Slave Select for SSP2. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 23 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[9] 188 A6 D7 131 91 72 A4 [3] I; PU I/O P1[9] — General purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface). - R — Function reserved. O T3_MAT0 — Match output for Timer 3, channel 0. P1[10] 186 C8 A7 129 90 71 A5 [3] I; PU I/O P1[10] — General purpose digital input/output pin. I ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface). - R — Function reserved. I T3_CAP0 — Capture input for Timer 3, channel 0. P1[11] 163 A14 A12 - - - - [3] I; PU I/O P1[11] — General purpose digital input/output pin. I ENET_RXD2 — Ethernet Receive Data 2 (MII interface). I/O SD_DAT[2] — Data line 2 for SD card interface. O PWM0[6] — Pulse Width Modulator 0, output 6. P1[12] 157 A16 A14 - - - - [3] I; PU I/O P1[12] — General purpose digital input/output pin. I ENET_RXD3 — Ethernet Receive Data (MII interface). I/O SD_DAT[3] — Data line 3 for SD card interface. I PWM0_CAP0 — Capture input for PWM0, channel 0. - R — Function reserved. O CMP1_OUT — Comparator 1, output. P1[13] 147 D16 D14 - - - - [3] I; PU I/O P1[13] — General purpose digital input/output pin. I ENET_RX_DV — Ethernet Receive Data Valid (MII interface). Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 24 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[14] 184 A7 D8 128 89 70 C6 [3] I; PU I/O P1[14] — General purpose digital input/output pin. I ENET_RX_ER — Ethernet receive error (RMII/MII interface). - R — Function reserved. I T2_CAP0 — Capture input for Timer 2, channel 0. - R — Function reserved. I CMP0_IN[0] — Comparator 0, input 0. P1[15] 182 A8 A8 126 88 69 B6 [3] I; PU I/O P1[15] — General purpose digital input/output pin. I ENET_RX_CLK (ENET_REF_CLK) — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). - R — Function reserved. I/O I2C2_SDA — I2C2 data input/output (this pin does not use a specialized I2C pad). P1[16] 180 D10 B8 125 87 - - [3] I; PU I/O P1[16] — General purpose digital input/output pin. O ENET_MDC — Ethernet MIIM clock. O I2S_TX_MCLK — I2S transmit master clock. - R — Function reserved. - R — Function reserved. I CMP0_IN[1] — Comparator 0, input 1. P1[17] 178 A9 C9 123 86 - - [3] I; PU I/O P1[17] — General purpose digital input/output pin. I/O ENET_MDIO — Ethernet MIIM data input and output. O I2S_RX_MCLK — I2S receive master clock. - R — Function reserved. - R — Function reserved. I CMP0_IN[2] — Comparator 0, input 2. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 25 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[18] 66 P7 L5 46 32 25 K4 [3] I; PU I/O P1[18] — General purpose digital input/output pin. O USB_UP_LED1 — It is LOW when the device is configured (non-control endpoints enabled), or when the host is enabled and has detected a device on the bus. It is HIGH when the device is not configured, or when host is enabled and has not detected a device on the bus, or during global suspend. It transitions between LOW and HIGH (flashes) when the host is enabled and detects activity on the bus. O PWM1[1] — Pulse Width Modulator 1, channel 1 output. I T1_CAP0 — Capture input for Timer 1, channel 0. - R — Function reserved. I/O SSP1_MISO — Master In Slave Out for SSP1. P1[19] 68 U6 P5 47 33 26 J4 [3] I; PU I/O P1[19] — General purpose digital input/output pin. O USB_TX_E1 — Transmit Enable signal for USB port 1 (OTG transceiver). O USB_PPWR1 — Port Power enable signal for USB port 1. I T1_CAP1 — Capture input for Timer 1, channel 1. O MC_0A — Motor control PWM channel 0, output A. I/O SSP1_SCK — Serial clock for SSP1. O U2_OE — RS-485/EIA-485 output enable signal for UART2. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 26 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[20] 70 U7 K6 49 34 27 J5 [3] I; PU I/O P1[20] — General purpose digital input/output pin. O USB_TX_DP1 — D+ transmit data for USB port 1 (OTG transceiver). O PWM1[2] — Pulse Width Modulator 1, channel 2 output. I QEI_PHA — Quadrature Encoder Interface PHA input. I MC_FB0 — Motor control PWM channel 0 feedback input. I/O SSP0_SCK — Serial clock for SSP0. O LCD_VD[6] — LCD data. O LCD_VD[10] — LCD data. P1[21] 72 R8 N6 50 35 - - [3] I; PU I/O P1[21] — General purpose digital input/output pin. O USB_TX_DM1 — D transmit data for USB port 1 (OTG transceiver). O PWM1[3] — Pulse Width Modulator 1, channel 3 output. I/O SSP0_SSEL — Slave Select for SSP0. I MC_ABORT — Motor control PWM, active low fast abort. - R — Function reserved. O LCD_VD[7] — LCD data. O LCD_VD[11] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 27 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[22] 74 U8 M6 51 36 28 K5 [3] I; PU I/O P1[22] — General purpose digital input/output pin. I USB_RCV1 — Differential receive data for USB port 1 (OTG transceiver). I USB_PWRD1 — Power Status for USB port 1 (host power switch). O T1_MAT0 — Match output for Timer 1, channel 0. O MC_0B — Motor control PWM channel 0, output B. I/O SSP1_MOSI — Master Out Slave In for SSP1. O LCD_VD[8] — LCD data. O LCD_VD[12] — LCD data. P1[23] 76 P9 N7 53 37 29 H5 [3] I; PU I/O P1[23] — General purpose digital input/output pin. I USB_RX_DP1 — D+ receive data for USB port 1 (OTG transceiver). O PWM1[4] — Pulse Width Modulator 1, channel 4 output. I QEI_PHB — Quadrature Encoder Interface PHB input. I MC_FB1 — Motor control PWM channel 1 feedback input. I/O SSP0_MISO — Master In Slave Out for SSP0. O LCD_VD[9] — LCD data. O LCD_VD[13] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 28 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[24] 78 T9 P7 54 38 30 J6 [3] I; PU I/O P1[24] — General purpose digital input/output pin. I USB_RX_DM1 — D receive data for USB port 1 (OTG transceiver). O PWM1[5] — Pulse Width Modulator 1, channel 5 output. I QEI_IDX — Quadrature Encoder Interface INDEX input. I MC_FB2 — Motor control PWM channel 2 feedback input. I/O SSP0_MOSI — Master Out Slave in for SSP0. O LCD_VD[10] — LCD data. O LCD_VD[14] — LCD data. P1[25] 80 T10 L7 56 39 31 K6 [3] I; PU I/O P1[25] — General purpose digital input/output pin. O USB_LS1 — Low Speed status for USB port 1 (OTG transceiver). O USB_HSTEN1 — Host Enabled status for USB port 1. O T1_MAT1 — Match output for Timer 1, channel 1. O MC_1A — Motor control PWM channel 1, output A. O CLKOUT — Selectable clock output. O LCD_VD[11] — LCD data. O LCD_VD[15] — LCD data. P1[26] 82 R10 P8 57 40 32 H6 [3] I; PU I/O P1[26] — General purpose digital input/output pin. O USB_SSPND1 — USB port 1 Bus Suspend status (OTG transceiver). O PWM1[6] — Pulse Width Modulator 1, channel 6 output. I T0_CAP0 — Capture input for Timer 0, channel 0. O MC_1B — Motor control PWM channel 1, output B. I/O SSP1_SSEL — Slave Select for SSP1. O LCD_VD[12] — LCD data. O LCD_VD[20] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 29 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[27] 88 T12 M9 61 43 - - [3] I; PU I/O P1[27] — General purpose digital input/output pin. I USB_INT1 — USB port 1 OTG transceiver interrupt (OTG transceiver). I USB_OVRCR1 — USB port 1 Over-Current status. I T0_CAP1 — Capture input for Timer 0, channel 1. O CLKOUT — Selectable clock output. - R — Function reserved. O LCD_VD[13] — LCD data. O LCD_VD[21] — LCD data. P1[28] 90 T13 P10 63 44 35 J8 [3] I; PU I/O P1[28] — General purpose digital input/output pin. I/O USB_SCL1 — USB port 1 I2C serial clock (OTG transceiver). I PWM1_CAP0 — Capture input for PWM1, channel 0. O T0_MAT0 — Match output for Timer 0, channel 0. O MC_2A — Motor control PWM channel 2, output A. I/O SSP0_SSEL — Slave Select for SSP0. O LCD_VD[14] — LCD data. O LCD_VD[22] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 30 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P1[29] 92 U14 N10 64 45 36 K8 [3] I; PU I/O P1[29] — General purpose digital input/output pin. I/O USB_SDA1 — USB port 1 I2C serial data (OTG transceiver). I PWM1_CAP1 — Capture input for PWM1, channel 1. O T0_MAT1 — Match output for Timer 0, channel 1. O MC_2B — Motor control PWM channel 2, output B. O U4_TXD — Transmitter output for USART4 (input/output in smart card mode). O LCD_VD[15] — LCD data. O LCD_VD[23] — LCD data. P1[30] 42 P2 K3 30 21 18 J2 [5] I; PU I/O P1[30] — General purpose digital input/output pin. I USB_PWRD2 — Power Status for USB port 2. I USB_VBUS — Monitors the presence of USB bus power. This signal must be HIGH for USB reset to occur. I ADC0_IN[4] — A/D converter 0, input 4. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2C0_SDA — I2C0 data input/output (this pin does not use a specialized I2C pad. O U3_OE — RS-485/EIA-485 output enable signal for UART3. P1[31] 40 P1 K2 28 20 17 H2 [5] I; PU I/O P1[31] — General purpose digital input/output pin. I USB_OVRCR2 — Over-Current status for USB port 2. I/O SSP1_SCK — Serial Clock for SSP1. I ADC0_IN[5] — A/D converter 0, input 5. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2C0_SCL — I2C0 clock input/output (this pin does not use a specialized I2C pad. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 31 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[0] to P2[31] I/O Port 2: Port 2 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block. P2[0] 154 B17 D12 107 75 60 B10 [3] I; PU I/O P2[0] — General purpose digital input/output pin. O PWM1[1] — Pulse Width Modulator 1, channel 1 output. O U1_TXD — Transmitter output for UART1. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_PWR — LCD panel power enable. P2[1] 152 E14 C14 106 74 59 B8 [3] I; PU I/O P2[1] — General purpose digital input/output pin. O PWM1[2] — Pulse Width Modulator 1, channel 2 output. I U1_RXD — Receiver input for UART1. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_LE — Line end signal. P2[2] 150 D15 E11 105 73 58 B9 [3] I; PU I/O P2[2] — General purpose digital input/output pin. O PWM1[3] — Pulse Width Modulator 1, channel 3 output. I U1_CTS — Clear to Send input for UART1. O T2_MAT3 — Match output for Timer 2, channel 3. - R — Function reserved. O TRACEDATA[3] — Trace data, bit 3. - R — Function reserved. O LCD_DCLK — LCD panel clock. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 32 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[3] 144 E16 E13 100 70 55 C10 [3] I; PU I/O P2[3] — General purpose digital input/output pin. O PWM1[4] — Pulse Width Modulator 1, channel 4 output. I U1_DCD — Data Carrier Detect input for UART1. O T2_MAT2 — Match output for Timer 2, channel 2. - R — Function reserved. O TRACEDATA[2] — Trace data, bit 2. - R — Function reserved. O LCD_FP — Frame pulse (STN). Vertical synchronization pulse (TFT). P2[4] 142 D17 E14 99 69 54 C9 [3] I; PU I/O P2[4] — General purpose digital input/output pin. O PWM1[5] — Pulse Width Modulator 1, channel 5 output. I U1_DSR — Data Set Ready input for UART1. O T2_MAT1 — Match output for Timer 2, channel 1. - R — Function reserved. O TRACEDATA[1] — Trace data, bit 1. - R — Function reserved. O LCD_ENAB_M — STN AC bias drive or TFT data enable output. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 33 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[5] 140 F16 F12 97 68 53 D10 [3] I; PU I/O P2[5] — General purpose digital input/output pin. O PWM1[6] — Pulse Width Modulator 1, channel 6 output. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. O T2_MAT0 — Match output for Timer 2, channel 0. - R — Function reserved. O TRACEDATA[0] — Trace data, bit 0. - R — Function reserved. O LCD_LP — Line synchronization pulse (STN). Horizontal synchronization pulse (TFT). P2[6] 138 E17 F13 96 67 52 E8 [3] I; PU I/O P2[6] — General purpose digital input/output pin. I PWM1_CAP0 — Capture input for PWM1, channel 0. I U1_RI — Ring Indicator input for UART1. I T2_CAP0 — Capture input for Timer 2, channel 0. O U2_OE — RS-485/EIA-485 output enable signal for UART2. O TRACECLK — Trace clock. O LCD_VD[0] — LCD data. O LCD_VD[4] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 34 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[7] 136 G16 G11 95 66 51 D9 [3] I; PU I/O P2[7] — General purpose digital input/output pin. I CAN_RD2 — CAN2 receiver input. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. - R — Function reserved. - R — Function reserved. O SPIFI_CS — Chip select output for SPIFI. O LCD_VD[1] — LCD data. O LCD_VD[5] — LCD data. P2[8] 134 H15 G14 93 65 50 E9 [3] I; PU I/O P2[8] — General purpose digital input/output pin. O CAN_TD2 — CAN2 transmitter output. O U2_TXD — Transmitter output for UART2. I U1_CTS — Clear to Send input for UART1. O ENET_MDC — Ethernet MIIM clock. - R — Function reserved. O LCD_VD[2] — LCD data. O LCD_VD[6] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 35 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[9] 132 H16 H11 92 64 49 E10 [3] I; PU I/O P2[9] — General purpose digital input/output pin. O USB_CONNECT1 — USB1 SoftConnect control. Signal used to switch an external 1.5 k resistor under the software control. Used with the SoftConnect USB feature. I U2_RXD — Receiver input for UART2. I U4_RXD — Receiver input for USART4. I/O ENET_MDIO — Ethernet MIIM data input and output. - R — Function reserved. I LCD_VD[3] — LCD data. I LCD_VD[7] — LCD data. P2[10] 110 N15 M13 76 53 41 H9 [10] I; PU I/O P2[10] — General purpose digital input/output pin. This pin includes a 10 ns input glitch filter. A LOW on this pin while RESET is LOW forces the on-chip boot loader to take over control of the part after a reset and go into ISP mode. I EINT0 — External interrupt 0 input. I NMI — Non-maskable interrupt input. P2[11] 108 T17 M12 75 52 - - [10] I; PU I/O P2[11] — General purpose digital input/output pin. This pin includes a 10 ns input glitch filter. I EINT1 — External interrupt 1 input. I/O SD_DAT[1] — Data line 1 for SD card interface. I/O I2S_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_CLKIN — LCD clock. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 36 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[12] 106 N14 N14 73 51 - - [10] I; PU I/O P2[12] — General purpose digital input/output pin. This pin includes a 10 ns input glitch filter. I EINT2 — External interrupt 2 input. I/O SD_DAT[2] — Data line 2 for SD card interface. I/O I2S_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I2S-bus specification. O LCD_VD[4] — LCD data. O LCD_VD[3] — LCD data. O LCD_VD[8] — LCD data. O LCD_VD[18] — LCD data. P2[13] 102 T16 M11 71 50 - - [10] I; PU I/O P2[13] — General purpose digital input/output pin. This pin includes a 10 ns input glitch filter. I EINT3 — External interrupt 3 input. I/O SD_DAT[3] — Data line 3 for SD card interface. I/O I2S_TX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I2S-bus specification. - R — Function reserved. O LCD_VD[5] — LCD data. O LCD_VD[9] — LCD data. O LCD_VD[19] — LCD data. P2[14] 91 R12 - - - - - [3] I; PU I/O P2[14] — General purpose digital input/output pin. O EMC_CS2 — LOW active Chip Select 2 signal. I/O I2C1_SDA — I2C1 data input/output (this pin does not use a specialized I2C pad). I T2_CAP0 — Capture input for Timer 2, channel 0. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 37 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[15] 99 P13 - - - - - [3] I; PU I/O P2[15] — General purpose digital input/output pin. O EMC_CS3 — LOW active Chip Select 3 signal. I/O I2C1_SCL — I2C1 clock input/output (this pin does not use a specialized I2C pad). I T2_CAP1 — Capture input for Timer 2, channel 1. P2[16] 87 R11 P9 - - - - [3] I; PU I/O P2[16] — General purpose digital input/output pin. O EMC_CAS — LOW active SDRAM Column Address Strobe. P2[17] 95 R13 P11 - - - - [3] I; PU I/O P2[17] — General purpose digital input/output pin. O EMC_RAS — LOW active SDRAM Row Address Strobe. P2[18] 59 U3 P3 - - - - [6] I; PU I/O P2[18] — General purpose digital input/output pin. O EMC_CLK[0] — SDRAM clock 0. P2[19] 67 R7 N5 - - - - [6] I; PU I/O P2[19] — General purpose digital input/output pin. O EMC_CLK[1] — SDRAM clock 1. P2[20] 73 T8 P6 - - - - [3] I; PU I/O P2[20] — General purpose digital input/output pin. O EMC_DYCS0 — SDRAM chip select 0. P2[21] 81 U11 N8 - - - - [3] I; PU I/O P2[21] — General purpose digital input/output pin. O EMC_DYCS1 — SDRAM chip select 1. P2[22] 85 U12 - - - - - [3] I; PU I/O P2[22] — General purpose digital input/output pin. O EMC_DYCS2 — SDRAM chip select 2. I/O SSP0_SCK — Serial clock for SSP0. I T3_CAP0 — Capture input for Timer 3, channel 0. P2[23] 64 U5 - - - - - [3] I; PU I/O P2[23] — General purpose digital input/output pin. O EMC_DYCS3 — SDRAM chip select 3. I/O SSP0_SSEL — Slave Select for SSP0. I T3_CAP1 — Capture input for Timer 3, channel 1. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 38 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[24] 53 P5 P1 - - - - [3] I; PU I/O P2[24] — General purpose digital input/output pin. O EMC_CKE0 — SDRAM clock enable 0. P2[25] 54 R4 P2 - - - - [3] I; PU I/O P2[25] — General purpose digital input/output pin. O EMC_CKE1 — SDRAM clock enable 1. P2[26] 57 T4 - - - - - [3] I; PU I/O P2[26] — General purpose digital input/output pin. O EMC_CKE2 — SDRAM clock enable 2. I/O SSP0_MISO — Master In Slave Out for SSP0. O T3_MAT0 — Match output for Timer 3, channel 0. P2[27] 47 P3 - - - - - [3] I; PU I/O P2[27] — General purpose digital input/output pin. O EMC_CKE3 — SDRAM clock enable 3. I/O SSP0_MOSI — Master Out Slave In for SSP0. O T3_MAT1 — Match output for Timer 3, channel 1. P2[28] 49 P4 M2 - - - - [3] I; PU I/O P2[28] — General purpose digital input/output pin. O EMC_DQM0 — Data mask 0 used with SDRAM and static devices. P2[29] 43 N3 L1 - - - - [3] I; PU I/O P2[29] — General purpose digital input/output pin. O EMC_DQM1 — Data mask 1 used with SDRAM and static devices. P2[30] 31 L4 - - - - - [3] I; PU I/O P2[30] — General purpose digital input/output pin. O EMC_DQM2 — Data mask 2 used with SDRAM and static devices. I/O I2C2_SDA — I2C2 data input/output (this pin does not use a specialized I2C pad). O T3_MAT2 — Match output for Timer 3, channel 2. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 39 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P2[31] 39 N2 - - - - - [3] I; PU I/O P2[31] — General purpose digital input/output pin. O EMC_DQM3 — Data mask 3 used with SDRAM and static devices. I/O I2C2_SCL — I2C2 clock input/output (this pin does not use a specialized I2C pad). O T3_MAT3 — Match output for Timer 3, channel 3. P3[0] to P3[31] I/O Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the pin connect block. P3[0] 197 B4 D6 137 - - - [3] I; PU I/O P3[0] — General purpose digital input/output pin. I/O EMC_D[0] — External memory data line 0. P3[1] 201 B3 E6 140 - - - [3] I; PU I/O P3[1] — General purpose digital input/output pin. I/O EMC_D[1] — External memory data line 1. P3[2] 207 B1 A2 144 - - - [3] I; PU I/O P3[2] — General purpose digital input/output pin. I/O EMC_D[2] — External memory data line 2. P3[3] 3 E4 G5 2 - - - [3] I; PU I/O P3[3] — General purpose digital input/output pin. I/O EMC_D[3] — External memory data line 3. P3[4] 13 F2 D3 9 - - - [3] I; PU I/O P3[4] — General purpose digital input/output pin. I/O EMC_D[4] — External memory data line 4. P3[5] 17 G1 E3 12 - - - [3] I; PU I/O P3[5] — General purpose digital input/output pin. I/O EMC_D[5] — External memory data line 5. P3[6] 23 J1 F4 16 - - - [3] I; PU I/O P3[6] — General purpose digital input/output pin. I/O EMC_D[6] — External memory data line 6. P3[7] 27 L1 G3 19 - - - [3] I; PU I/O P3[7] — General purpose digital input/output pin. I/O EMC_D[7] — External memory data line 7. P3[8] 191 D8 A6 - - - - [3] I; PU I/O P3[8] — General purpose digital input/output pin. I/O EMC_D[8] — External memory data line 8. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 40 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P3[9] 199 C5 A4 - - - - [3] I; PU I/O P3[9] — General purpose digital input/output pin. I/O EMC_D[9] — External memory data line 9. P3[10] 205 B2 B3 - - - - [3] I; PU I/O P3[10] — General purpose digital input/output pin. I/O EMC_D[10] — External memory data line 10. P3[11] 208 D5 B2 - - - - [3] I; PU I/O P3[11] — General purpose digital input/output pin. I/O EMC_D[11] — External memory data line 11. P3[12] 1 D4 A1 - - - - [3] I; PU I/O P3[12] — General purpose digital input/output pin. I/O EMC_D[12] — External memory data line 12. P3[13] 7 C1 C1 - - - - [3] I; PU I/O P3[13] — General purpose digital input/output pin. I/O EMC_D[13] — External memory data line 13. P3[14] 21 H2 F1 - - - - [3] I; PU I/O P3[14] — General purpose digital input/output pin. I/O EMC_D[14] — External memory data line 14. P3[15] 28 M1 G4 - - - - [3] I; PU I/O P3[15] — General purpose digital input/output pin. I/O EMC_D[15] — External memory data line 15. P3[16] 137 F17 - - - - - [3] I; PU I/O P3[16] — General purpose digital input/output pin. I/O EMC_D[16] — External memory data line 16. O PWM0[1] — Pulse Width Modulator 0, output 1. O U1_TXD — Transmitter output for UART1. P3[17] 143 F15 - - - - - [3] I; PU I/O P3[17] — General purpose digital input/output pin. I/O EMC_D[17] — External memory data line 17. O PWM0[2] — Pulse Width Modulator 0, output 2. I U1_RXD — Receiver input for UART1. P3[18] 151 C15 - - - - - [3] I; PU I/O P3[18] — General purpose digital input/output pin. I/O EMC_D[18] — External memory data line 18. O PWM0[3] — Pulse Width Modulator 0, output 3. I U1_CTS — Clear to Send input for UART1. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 41 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P3[19] 161 B14 - - - - - [3] I; PU I/O P3[19] — General purpose digital input/output pin. I/O EMC_D[19] — External memory data line 19. O PWM0[4] — Pulse Width Modulator 0, output 4. I U1_DCD — Data Carrier Detect input for UART1. P3[20] 167 A13 - - - - - [3] I; PU I/O P3[20] — General purpose digital input/output pin. I/O EMC_D[20] — External memory data line 20. O PWM0[5] — Pulse Width Modulator 0, output 5. I U1_DSR — Data Set Ready input for UART1. P3[21] 175 C10 - - - - - [3] I; PU I/O P3[21] — General purpose digital input/output pin. I/O EMC_D[21] — External memory data line 21. O PWM0[6] — Pulse Width Modulator 0, output 6. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. P3[22] 195 C6 - - - - - [3] I; PU I/O P3[22] — General purpose digital input/output pin. I/O EMC_D[22] — External memory data line 22. I PWM0_CAP0 — Capture input for PWM0, channel 0. I U1_RI — Ring Indicator input for UART1. P3[23] 65 T6 M4 45 - - - [3] I; PU I/O P3[23] — General purpose digital input/output pin. I/O EMC_D[23] — External memory data line 23. I PWM1_CAP0 — Capture input for PWM1, channel 0. I T0_CAP0 — Capture input for Timer 0, channel 0. P3[24] 58 R5 N3 40 - - - [3] I; PU I/O P3[24] — General purpose digital input/output pin. I/O EMC_D[24] — External memory data line 24. O PWM1[1] — Pulse Width Modulator 1, output 1. I T0_CAP1 — Capture input for Timer 0, channel 1. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 42 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P3[25] 56 U2 M3 39 27 - - [3] I; PU I/O P3[25] — General purpose digital input/output pin. I/O EMC_D[25] — External memory data line 25. O PWM1[2] — Pulse Width Modulator 1, output 2. O T0_MAT0 — Match output for Timer 0, channel 0. P3[26] 55 T3 K7 38 26 - - [3] I; PU I/O P3[26] — General purpose digital input/output pin. I/O EMC_D[26] — External memory data line 26. O PWM1[3] — Pulse Width Modulator 1, output 3. O T0_MAT1 — Match output for Timer 0, channel 1. I STCLK — System tick timer clock input. The maximum STCLK frequency is 1/4 of the ARM processor clock frequency CCLK. P3[27] 203 A1 - - - - - [3] I; PU I/O P3[27] — General purpose digital input/output pin. I/O EMC_D[27] — External memory data line 27. O PWM1[4] — Pulse Width Modulator 1, output 4. I T1_CAP0 — Capture input for Timer 1, channel 0. P3[28] 5 D2 - - - - - [3] I; PU I/O P3[28] — General purpose digital input/output pin. I/O EMC_D[28] — External memory data line 28. O PWM1[5] — Pulse Width Modulator 1, output 5. I T1_CAP1 — Capture input for Timer 1, channel 1. P3[29] 11 F3 - - - - - [3] I; PU I/O P3[29] — General purpose digital input/output pin. I/O EMC_D[29] — External memory data line 29. O PWM1[6] — Pulse Width Modulator 1, output 6. O T1_MAT0 — Match output for Timer 1, channel 0. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 43 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P3[30] 19 H3 - - - - - [3] I; PU I/O P3[30] — General purpose digital input/output pin. I/O EMC_D[30] — External memory data line 30. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. O T1_MAT1 — Match output for Timer 1, channel 1. P3[31] 25 J3 - - - - - [3] I; PU I/O P3[31] — General purpose digital input/output pin. I/O EMC_D[31] — External memory data line 31. - R — Function reserved. O T1_MAT2 — Match output for Timer 1, channel 2. P4[0] to P4[31] - I/O Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 4 pins depends upon the pin function selected via the pin connect block. P4[0] 75 U9 L6 52 - - - [3] I; PU I/O P4[0] — General purpose digital input/output pin. I/O EMC_A[0] — External memory address line 0. P4[1] 79 U10 M7 55 - - - [3] I; PU I/O P4[1] — General purpose digital input/output pin. I/O EMC_A[1] — External memory address line 1. P4[2] 83 T11 M8 58 - - - [3] I; PU I/O P4[2] — General purpose digital input/output pin. I/O EMC_A[2] — External memory address line 2. P4[3] 97 U16 K9 68 - - - [3] I; PU I/O P4[3] — General purpose digital input/output pin. I/O EMC_A[3] — External memory address line 3. P4[4] 103 R15 P13 72 - - - [3] I; PU I/O P4[4] — General purpose digital input/output pin. I/O EMC_A[4] — External memory address line 4. P4[5] 107 R16 H10 74 - - - [3] I; PU I/O P4[5] — General purpose digital input/output pin. I/O EMC_A[5] — External memory address line 5. P4[6] 113 M14 K10 78 - - - [3] I; PU I/O P4[6] — General purpose digital input/output pin. I/O EMC_A[6] — External memory address line 6. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 44 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P4[7] 121 L16 K12 84 - - - [3] I; PU I/O P4[7] — General purpose digital input/output pin. I/O EMC_A[7] — External memory address line 7. P4[8] 127 J17 J11 88 - - - [3] I; PU I/O P4[8] — General purpose digital input/output pin. I/O EMC_A[8] — External memory address line 8. P4[9] 131 H17 H12 91 - - - [3] I; PU I/O P4[9] — General purpose digital input/output pin. I/O EMC_A[9] — External memory address line 9. P4[10] 135 G17 G12 94 - - - [3] I; PU I/O P4[10] — General purpose digital input/output pin. I/O EMC_A[10] — External memory address line 10. P4[11] 145 F14 F11 101 - - - [3] I; PU I/O P4[11] — General purpose digital input/output pin. I/O EMC_A[11] — External memory address line 11. P4[12] 149 C16 F10 104 - - - [3] I; PU I/O P4[12] — General purpose digital input/output pin. I/O EMC_A[12] — External memory address line 12. P4[13] 155 B16 B14 108 - - - [3] I; PU I/O P4[13] — General purpose digital input/output pin. I/O EMC_A[13] — External memory address line 13. P4[14] 159 B15 E8 110 - - - [3] I; PU I/O P4[14] — General purpose digital input/output pin. I/O EMC_A[14] — External memory address line 14. P4[15] 173 A11 C10 120 - - - [3] I; PU I/O P4[15] — General purpose digital input/output pin. I/O EMC_A[15] — External memory address line 15. P4[16] 101 U17 N12 - - - - [3] I; PU I/O P4[16] — General purpose digital input/output pin. I/O EMC_A[16] — External memory address line 16. P4[17] 104 P14 N13 - - - - [3] I; PU I/O P4[17] — General purpose digital input/output pin. I/O EMC_A[17] — External memory address line 17. P4[18] 105 P15 P14 - - - - [3] I; PU I/O P4[18] — General purpose digital input/output pin. I/O EMC_A[18] — External memory address line 18. P4[19] 111 P16 M14 - - - - [3] I; PU I/O P4[19] — General purpose digital input/output pin. I/O EMC_A[19] — External memory address line 19. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 45 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P4[20] 109 R17 - - - - - [3] I; PU I/O P4[20] — General purpose digital input/output pin. I/O EMC_A[20] — External memory address line 20. I/O I2C2_SDA — I2C2 data input/output (this pin does not use a specialized I2C pad). I/O SSP1_SCK — Serial Clock for SSP1. P4[21] 115 M15 - - - - - [3] I; PU I/O P4[21] — General purpose digital input/output pin. I/O EMC_A[21] — External memory address line 21. I/O I2C2_SCL — I2C2 clock input/output (this pin does not use a specialized I2C pad). I/O SSP1_SSEL — Slave Select for SSP1. P4[22] 123 K14 - - - - - [3] I; PU I/O P4[22] — General purpose digital input/output pin. I/O EMC_A[22] — External memory address line 22. O U2_TXD — Transmitter output for UART2. I/O SSP1_MISO — Master In Slave Out for SSP1. P4[23] 129 J15 - - - - - [3] I; PU I/O P4[23] — General purpose digital input/output pin. I/O EMC_A[23] — External memory address line 23. I U2_RXD — Receiver input for UART2. I/O SSP1_MOSI — Master Out Slave In for SSP1. P4[24] 183 B8 C8 127 - - - [3] I; PU I/O P4[24] — General purpose digital input/output pin. O EMC_OE — LOW active Output Enable signal. P4[25] 179 B9 D9 124 - - - [3] I; PU I/O P4[25] — General purpose digital input/output pin. O EMC_WE — LOW active Write Enable signal. P4[26] 119 L15 K13 - - - - [3] I; PU I/O P4[26] — General purpose digital input/output pin. O EMC_BLS0 — LOW active Byte Lane select signal 0. P4[27] 139 G15 F14 - - - - [3] I; PU I/O P4[27] — General purpose digital input/output pin. O EMC_BLS1 — LOW active Byte Lane select signal 1. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 46 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P4[28] 170 C11 D10 118 82 65 B7 [3] I; PU I/O P4[28] — General purpose digital input/output pin. O EMC_BLS2 — LOW active Byte Lane select signal 2. O U3_TXD — Transmitter output for UART3. O T2_MAT0 — Match output for Timer 2, channel 0. - R — Function reserved. O LCD_VD[6] — LCD data. O LCD_VD[10] — LCD data. O LCD_VD[2] — LCD data. P4[29] 176 B10 B9 122 85 68 A6 [3] I; PU I/O P4[29] — General purpose digital input/output pin. O EMC_BLS3 — LOW active Byte Lane select signal 3. I U3_RXD — Receiver input for UART3. O T2_MAT1 — Match output for Timer 2, channel 1. I/O I2C2_SCL — I2C2 clock input/output (this pin does not use a specialized I2C pad). O LCD_VD[7] — LCD data. O LCD_VD[11] — LCD data. O LCD_VD[3] — LCD data. P4[30] 187 B7 C7 130 - - - [3] I; PU I/O P4[30] — General purpose digital input/output pin. O EMC_CS0 — LOW active Chip Select 0 signal. - R — Function reserved. - R — Function reserved. - R — Function reserved. O CMP0_OUT — Comparator 0, output. P4[31] 193 A4 E7 134 - - - [3] I; PU I/O P4[31] — General purpose digital input/output pin. O EMC_CS1 — LOW active Chip Select 1 signal. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 47 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P5[0] to P5[4] I/O Port 5: Port 5 is a 5-bit I/O port with individual direction controls for each bit. The operation of port 5 pins depends upon the pin function selected via the pin connect block. P5[0] 9 F4 E5 6 - - - [3] I; PU I/O P5[0] — General purpose digital input/output pin. I/O EMC_A[24] — External memory address line 24. I/O SSP2_MOSI — Master Out Slave In for SSP2. O T2_MAT2 — Match output for Timer 2, channel 2. P5[1] 30 J4 H1 21 - - G1 [3] I; PU I/O P5[1] — General purpose digital input/output pin. I/O EMC_A[25] — External memory address line 25. I/O SSP2_MISO — Master In Slave Out for SSP2. O T2_MAT3 — Match output for Timer 2, channel 3. P5[2] 117 L14 L12 81 - - - [11] I I/O P5[2] — General purpose digital input/output pin. - R — Function reserved. I/O SSP2_SCK — Serial clock for SSP2. When using this pin, the SSP2 bit rate is limited to 1 MHz. O T3_MAT2 — Match output for Timer 3, channel 2. - R — Function reserved. I/O I2C0_SDA — I2C0 data input/output (this pin uses a specialized I2C pad that supports I2C Fast Mode Plus). P5[3] 141 G14 G10 98 - - - [11] I I/O P5[3] — General purpose digital input/output pin. - R — Function reserved. I/O SSP2_SSEL — Slave select for SSP2. When using this pin, the SSP2 bit rate is limited to 1 MHz. - R — Function reserved. I U4_RXD — Receiver input for USART4. I/O I2C0_SCL — I2C0 clock input/output (this pin uses a specialized I2C pad that supports I2C Fast Mode Plus. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 48 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller P5[4] 206 C3 C4 143 100 - - [3] I; PU I/O P5[4] — General purpose digital input/output pin. O U0_OE — RS-485/EIA-485 output enable signal for UART0. - R — Function reserved. O T3_MAT3 — Match output for Timer 3, channel 3. O U4_TXD — Transmitter output for USART4 (input/output in smart card mode). JTAG_TDO (SWO) 2 D3 B1 1 1 1 B2 [3] O Test Data Out for JTAG interface. Also used as Serial wire trace output. JTAG_TDI 4 C2 C3 3 2 2 B1 [3] I Test Data In for JTAG interface. JTAG_TMS (SWDIO) 6 E3 C2 4 3 3 C2 [3] I Test Mode Select for JTAG interface. Also used as Serial wire debug data input/output. JTAG_TRST 8 D1 D4 5 4 4 C1 [3] I Test Reset for JTAG interface. JTAG_TCK (SWDCLK) 10 E2 D2 7 5 5 D3 [3] I Test Clock for JTAG interface. This clock must be slower than 1 /6 of the CPU clock (CCLK) for the JTAG interface to operate. Also used as serial wire clock. RESET 35 M2 J1 24 17 14 G3 [12] I External reset input with 20 ns glitch filter. A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. This pin also serves as the debug select input. LOW level selects the JTAG boundary scan. HIGH level selects the ARM SWD debug mode. RSTOUT 29 K3 H2 20 14 11 F1 [3] O Reset status output. A LOW output on this pin indicates that the device is in the reset state for any reason. This reflects the RESET input pin and all internal reset sources. RTC_ALARM 37 N1 H5 26 - - - [13] O RTC controlled output. This is a 1.8 V pin. It goes HIGH when a RTC alarm is generated. RTCX1 34 K2 J2 23 16 13 F2 [14] [15] I Input to the RTC 32 kHz ultra-low power oscillator circuit. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 49 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller RTCX2 36 L2 J3 25 18 15 G2 [14] [15] O Output from the RTC 32 kHz ultra-low power oscillator circuit. USB_D2 52 U1 N2 37 - - - [9] I/O USB port 2 bidirectional D line. VBAT 38 M3 K1 27 19 16 H1 I RTC power supply: 3.3 V on this pin supplies power to the RTC. VDD(REG)(3V3) 26, 86, 174 H4, P11, D11 G1, N9, E9 18, 60, 121 13, 42, 84 34, 67 K7, C7 S 3.3 V regulator supply voltage: This is the power supply for the on-chip voltage regulator that supplies internal logic. VDDA 20 G4 F2 14 10 8 E3 S Analog 3.3 V pad supply voltage: This can be connected to the same supply as VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC. Tie this pin to 3.3 V if the ADC and DAC are not used. VDD(3V3) 15, 60, 71, 89, 112, 125, 146, 165, 181, 198 G3, P6, P8, U13, P17, K16, C17, B13, C9, D7 E2, L4, K8, L11, J14, E12, E10, C5 41, 62, 77, 102, 114, 138 28, 54, 71, 96 21, 42, 56, 77 K2, H7, D8, C4 S 3.3 V supply voltage: This is the power supply voltage for I/O other than pins in the VBAT domain. VREFP 24 K1 G2 17 12 10 E1 S ADC positive reference voltage: This should be the same voltage as VDDA, but should be isolated to minimize noise and error. The voltage level on this pin is used as a reference for ADC and DAC. Tie this pin to 3.3 V if the ADC and DAC are not used. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 50 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] PU = internal pull-up enabled (for VDD(REG)(3V3) = 3.3 V, pulled up to 3.3 V); IA = inactive, no pull-up/down enabled; F = floating; floating pins, if not used, should be tied to ground or power to minimize power consumption. [2] I = Input; O = Output; G = Ground; S = Supply. [3] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis. [4] 5 V tolerant standard pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL levels and hysteresis. This pad can be powered by VBAT. [5] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and analog input. When configured as a ADC input, digital section of the pad is disabled. [6] 5 V tolerant fast pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL levels and hysteresis. [7] 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the pad is disabled. [8] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. VSS 33, 63, 77, 93, 114, 133, 148, 169, 189, 200 L3, T5, R9, P12, N16, H14, E15, A12, B6, A2 H4, P4, L9, L13, G13, D13, C11, B4 44, 65, 79, 103, 117, 139 31, 55, 72, 97 24, 43, 57, 78 H4, G8, G9, B3 G Ground: 0 V reference for digital IO pins. VSSREG 32, 84, 172 D12, K4, P10 H3, L8, A10 22, 59, 119 15, 41, 83 33, 66 J7, F3 G Ground: 0 V reference for internal logic. VSSA 22 J2 F3 15 11 9 E2 G Analog ground: 0 V power supply and reference for the ADC and DAC. This should be the same voltage as VSS, but should be isolated to minimize noise and error. XTAL1 44 M4 L2 31 22 19 J1 [14] [16] I Input to the oscillator circuit and internal clock generator circuits. XTAL2 46 N4 K4 33 23 20 K1 [14] [16] O Output from the oscillator amplifier. DNC - - - - - 12 - Do not connect. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Pin LQFP100 Pin LQFP80 Pin TFBGA80 Reset state[1] Type[2] Description xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 51 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [9] Not 5 V tolerant. Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). [10] 5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. [11] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 1 MHz specification. It requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [12] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis. [13] This pad can be powered from VBAT. [14] Pad provides special analog functionality. A 32 kHz crystal oscillator must be used with the RTC. An external clock (32 kHz) can’t be used to drive the RTCX1 pin. [15] If the RTC is not used, these pins can be left floating. [16] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTAL2 should be left floating. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 52 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7. Functional description 7.1 Architectural overview The ARM Cortex-M4 includes three AHB-Lite buses: the system bus, the I-code bus, and the D-code bus. The I-code and D-code core buses are faster than the system bus and are used similarly to Tightly Coupled Memory (TCM) interfaces: one bus dedicated for instruction fetch (I-code) and one bus for data access (D-code). The use of two core buses allows for simultaneous operations if concurrent operations target different devices. The LPC408x/7x use a multi-layer AHB matrix to connect the ARM Cortex-M4 buses and other bus masters to peripherals in a flexible manner that optimizes performance by allowing peripherals that are on different slaves ports of the matrix to be accessed simultaneously by different bus masters. 7.2 ARM Cortex-M4 processor The ARM Cortex-M4 processor is running at frequencies of up to 120 MHz. The processor executes the Thumb-2 instruction set for optimal performance and code size, including hardware division, single-cycle multiply, and bit-field manipulation. A Memory Protection Unit (MPU) supporting eight regions is included. 7.3 ARM Cortex-M4 Floating Point Unit (FPU) Remark: The FPU is available on parts LP4088/78/76. The FPU supports single-precision floating-point computation functionality in compliance with the ANSI/IEEE Standard 754-2008. The FPU provides add, subtract, multiply, divide, multiply and accumulate, and square root operations. It also performs a variety of conversions between fixed-point, floating-point, and integer data formats. 7.4 On-chip flash program memory The LPC408x/7x contain up to 512 kB of on-chip flash program memory. A new two-port flash accelerator maximizes performance for use with the two fast AHB-Lite buses. 7.5 EEPROM The LPC408x/7x contains up to 4032 byte of on-chip byte-erasable and byte-programmable EEPROM data memory. 7.6 On-chip SRAM The LPC408x/7x contain a total of up to 96 kB on-chip SRAM data memory. This includes 64 kB main SRAM, accessible by the CPU and DMA controller on a higher-speed bus, and up to two additional 16 kB peripheral SRAM blocks situated on a separate slave port on the AHB multilayer matrix. This architecture allows CPU and DMA accesses to be spread over three separate RAMs that can be accessed simultaneously. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 53 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.7 Memory Protection Unit (MPU) The LPC408x/7x have a Memory Protection Unit (MPU) which can be used to improve the reliability of an embedded system by protecting critical data within the user application. The MPU allows separating processing tasks by disallowing access to each other's data, disabling access to memory regions, allowing memory regions to be defined as read-only and detecting unexpected memory accesses that could potentially break the system. The MPU separates the memory into distinct regions and implements protection by preventing disallowed accesses. The MPU supports up to eight regions each of which can be divided into eight subregions. Accesses to memory locations that are not defined in the MPU regions, or not permitted by the region setting, will cause the Memory Management Fault exception to take place. 7.8 Memory map Table 4. LPC408x/7x memory usage and details Address range General Use Address range details and description 0x0000 0000 to 0x1FFF FFFF On-chip non-volatile memory 0x0000 0000 to 0x0007 FFFF For devices with 512 kB of flash memory. 0x0000 0000 to 0x0003 FFFF For devices with 256 kB of flash memory. 0x0000 0000 to 0x0001 FFFF For devices with 128 kB of flash memory. 0x0000 0000 to 0x0000 FFFF For devices with 64 kB of flash memory. On-chip SRAM 0x1000 0000 to 0x1000 FFFF For devices with 64 kB of main SRAM. 0x1000 0000 to 0x1000 7FFF For devices with 32 kB of main SRAM. 0x1000 0000 to 0x1000 3FFF For devices with 16 kB of main SRAM. Boot ROM 0x1FFF 0000 to 0x1FFF 1FFF 8 kB Boot ROM with flash services. 0x2000 0000 to 0x3FFF FFFF On-chip SRAM (typically used for peripheral data) 0x2000 0000 to 0x2000 1FFF Peripheral SRAM - bank 0 (first 8 kB) 0x2000 2000 to 0x2000 3FFF Peripheral SRAM - bank 0 (second 8 kB) 0x2000 4000 to 0x2000 7FFF Peripheral SRAM - bank 1 (16 kB) AHB peripherals 0x2008 0000 to 0x200B FFFF See Figure 9 for details 0x4000 0000 to 0x7FFF FFFF APB Peripherals 0x4000 0000 to 0x4007 FFFF APB0 Peripherals, up to 32 peripheral blocks of 16 kB each. 0x4008 0000 to 0x400F FFFF APB1 Peripherals, up to 32 peripheral blocks of 16 kB each. 0x8000 0000 to 0xDFFF FFFF Off-chip Memory via the External Memory Controller Four static memory chip selects: 0x8000 0000 to 0x83FF FFFF Static memory chip select 0 (up to 64 MB) 0x9000 0000 to 0x93FF FFFF Static memory chip select 1 (up to 64 MB) 0x9800 0000 to 0x9BFF FFFF Static memory chip select 2 (up to 64 MB) 0x9C00 0000 to 0x9FFF FFFF Static memory chip select 3 (up to 64 MB) Four dynamic memory chip selects: 0xA000 0000 to 0xAFFF FFFF Dynamic memory chip select 0 (up to 256 MB) 0xB000 0000 to 0xBFFF FFFF Dynamic memory chip select 1 (up to 256 MB) 0xC000 0000 to 0xCFFF FFFF Dynamic memory chip select 2 (up to 256 MB) 0xD000 0000 to 0xDFFF FFFF Dynamic memory chip select 3 (up to 256 MB) 0xE000 0000 to 0xE00F FFFF Cortex-M4 Private Peripheral Bus 0xE000 0000 to 0xE00F FFFF Cortex-M4 related functions, includes the NVIC and System Tick Timer. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 54 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller The LPC408x/7x incorporate several distinct memory regions, shown in the following figures. Figure 9 shows the overall map of the entire address space from the user program viewpoint following reset. The interrupt vector area supports address remapping. The AHB peripheral area is 2 MB in size, and is divided to allow for up to 128 peripherals. The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals. Each peripheral of either type is allocated 16 kB of space. This allows simplifying the address decoding for each peripheral. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 55 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller (1) Not available on all parts. See Table 2 and Table 4. Fig 9. LPC408x/7x memory map 0x4000 4000 0x4000 8000 0x4000 C000 0x4001 0000 0x4001 8000 0x4002 0000 0x4002 8000 0x4002 C000 0x4003 4000 0x4003 0000 0x4003 8000 0x4003 C000 0x4004 0000 0x4004 4000 0x4004 8000 0x4004 C000 0x4005 C000 0x4006 0000 0x4008 0000 0x4002 4000 0x4001 C000 0x4001 4000 0x4000 0000 APB1 peripherals 0x4008 0000 0x4008 8000 0x4008 C000 0x4009 0000 0x4009 4000 0x4009 8000 0x4009 C000 0x400A 0000 0x400A 4000 0x400A 8000 0x400A C000 0x400B 0000 0x400B 4000 0x400B 8000 0x400B C000 0x400C 0000 0x400F C000 0x4010 0000 SSP0 DAC timer 2 timer 3 UART2 UART3 USART4(1) I2C2 1 - 0 reserved 2 3 4 5 6 7 8 9 10 SSP2 I2S 11 12 reserved motor control PWM reserved 30 - 17 reserved 13 14 15 16 31 system control reserved EMC 4 x static chip select(1) EMC 4 x dynamic chip select(1) reserved private peripheral bus 0 GB 0.5 GB 4 GB 1 GB 0x1FFF 0000 0x2000 0000 0x2000 8000 0x2008 0000 0x2200 0000 0x200A 0000 0x2400 0000 0x2800 0000 0x4000 0000 0x4008 0000 0x4010 0000 0x4200 0000 0x4400 0000 0x8000 0000 0xA000 0000 0xE000 0000 0xE010 0000 0xFFFF FFFF reserved reserved reserved SPIFI data reserved reserved APB0 peripherals 0xE004 0000 AHB peripherals APB1 peripherals peripheral SRAM bit-band alias addressing peripheral bit-band alias addressing 0x2000 4000 0x2000 2000 LPC408x/7x QEI(1) SD/MMC(1) APB0 peripherals WWDT timer 0 timer 1 UART0 UART1 reserved reserved CAN AF RAM CAN common CAN1 CAN2 CAN AF registers PWM0 I2C0 RTC/event recorder + backup registers GPIO interrupts pin connect SSP1 ADC 22 - 19 reserved I2C1 31 - 24 reserved 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 23 PWM1 8 kB boot ROM 0x0000 0000 0x0000 0400 active interrupt vectors + 256 words I-code/D-code memory space 002aag736 reserved 0x1FFF 2000 0x2900 0000 reserved reserved 0x2008 0000 0x2008 4000 0x2008 8000 0x2008 C000 0x200A 0000 0x2009 C000 AHB peripherals LCD(1) USB(1) Ethernet(1) 0 GPDMA controller 1 2 3 CRC engine 0x2009 0000 4 0x2009 4000 5 GPIO 0x2009 8000 EMC registers 6 7 0x0000 0000 0x0001 0000 0x0002 0000 0x0004 0000 0x0008 0000 0x1000 0000 0x1000 4000 0x1000 8000 0x1001 0000 64 kB on- chip flash (LPC4072) 128 kB on- chip flash (LPC4074) 256 kB on-chip flash (LPC4076) 512 kB on-chip flash (LPC4078) reserved 16 kB main SRAM (LPC4072) 32 kB main SRAM (LPC4074) 64 kB main SRAM (LPC4088/78/76) 16 kB peripheral SRAM1 (LPC4088/78) 8 kB peripheral SRAM0 (LPC4074/72) 16 kB peripheral SRAM0 (LPC4088/78/76) LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 56 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.9 Nested Vectored Interrupt Controller (NVIC) The NVIC is an integral part of the Cortex-M4. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.9.1 Features • Controls system exceptions and peripheral interrupts. • On the LPC408x/7x, the NVIC supports 40 vectored interrupts. • 32 programmable interrupt priority levels, with hardware priority level masking. • Relocatable vector table. • Non-Maskable Interrupt (NMI). • Software interrupt generation. 7.9.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any pin on port 0 and port 2 regardless of the selected function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. 7.10 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupts being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. Most pins can also be configured as open-drain outputs or to have a pull-up, pull-down, or no resistor enabled. 7.11 External Memory Controller (EMC) Remark: The EMC is available for parts LPC4088/78/76. Supported memory size and type and EMC bus width vary for different packages (see Table 2). The EMC pin configuration for each part is shown in Table 5. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 57 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller The LPC408x/7x EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant peripheral. 7.11.1 Features • Dynamic memory interface support including single data rate SDRAM. • Asynchronous static memory device support including RAM, ROM, and flash, with or without asynchronous page mode. • Low transaction latency. • Read and write buffers to reduce latency and to improve performance. • 8/16/32 data and 16/20/26 address lines wide static memory support. • 16 bit and 32 bit wide chip select SDRAM memory support. • Static memory features include: – Asynchronous page mode read – Programmable Wait States – Bus turnaround delay – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control EMC_CKE and EMC_CLK outputs to SDRAMs. • Dynamic memory self-refresh mode controlled by software. • Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row address synchronous memory parts. That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per device. • Separate reset domains allow the for auto-refresh through a chip reset if desired. Note: Synchronous static memory devices (synchronous burst mode) are not supported. Table 5. External memory controller pin configuration Parts Data bus pins Address bus pins Control pins SRAM SDRAM LPC4088FBD208 LPC4088FET208 LPC4078FBD208 LPC4078FET208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC4088FET180 LPC4078FET180 LPC4076FET180 EMC_D[15:0] EMC_A[19:0] EMC_BLS[1:0], EMC_CS[1:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[1:0], EMC_CLK[1:0], EMC_CKE[1:0], EMC_DQM[1:0] LPC4088FBD144 LPC4078FBD144 LPC4076FBD144 EMC_D[7:0] EMC_A[15:0] EMC_BLS[3:2], EMC_CS[1:0], EMC_OE, EMC_WE not available LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 58 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.12 General purpose DMA controller The GPDMA is an AMBA AHB compliant peripheral allowing selected peripherals to have DMA support. The GPDMA enables peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. The source and destination areas can each be either a memory region or a peripheral and can be accessed through the AHB master. The GPDMA controller allows data transfers between the various on-chip SRAM areas and supports the SD/MMC card interface, all SSPs, the I2S, all UARTs, the A/D Converter, and the D/A Converter peripherals. DMA can also be triggered by selected timer match conditions. Memory-to-memory transfers and transfers to or from GPIO are supported. 7.12.1 Features • Eight DMA channels. Each channel can support an unidirectional transfer. • 16 DMA request lines. • Single DMA and burst DMA request signals. Each peripheral connected to the DMA Controller can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the DMA Controller. • Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers are supported. • Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. • Hardware DMA channel priority. • AHB slave DMA programming interface. The DMA Controller is programmed by writing to the DMA control registers over the AHB slave interface. • One AHB bus master for transferring data. The interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. • Internal four-word FIFO per channel. • Supports 8, 16, and 32-bit wide transactions. • Big-endian and little-endian support. The DMA Controller defaults to little-endian mode on reset. • An interrupt to the processor can be generated on a DMA completion or when a DMA error has occurred. • Raw interrupt status. The DMA error and DMA count raw interrupt status can be read prior to masking. 7.13 CRC engine The Cyclic Redundancy Check (CRC) generator with programmable polynomial settings supports several CRC standards commonly used. To save system power and bus bandwidth, the CRC engine supports DMA transfers. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 59 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.13.1 Features • Supports three common polynomials CRC-CCITT, CRC-16, and CRC-32. – CRC-CCITT: x16 + x12 + x5 + 1 – CRC-16: x16 + x15 + x2 + 1 – CRC-32: x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1 • Bit order reverse and 1’s complement programmable setting for input data and CRC sum. • Programmable seed number setting. • Supports CPU PIO or DMA back-to-back transfer. • Accept any size of data width per write: 8, 16 or 32-bit. – 8-bit write: 1-cycle operation – 16-bit write: 2-cycle operation (8-bit x 2-cycle) – 32-bit write: 4-cycle operation (8-bit x 4-cycle) 7.14 LCD controller Remark: The LCD controller is available on parts LPC4088. The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024  768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode. An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the displayed data) while still supporting a large number of colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time needed to operate the display. 7.14.1 Features • AHB master interface to access frame buffer. • Setup and control via a separate AHB slave interface. • Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. • Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces. • Supports single and dual-panel color STN displays. • Supports Thin Film Transistor (TFT) color displays. • Programmable display resolution including, but not limited to: 320  200, 320  240, 640  200, 640  240, 640  480, 800  600, and 1024  768. • Hardware cursor support for single-panel displays. • 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support. • 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN. • 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 60 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • 16 bpp true-color non-palettized, for color STN and TFT. • 24 bpp true-color non-palettized, for color TFT. • Programmable timing for different display panels. • 256 entry, 16-bit palette RAM, arranged as a 128  32-bit RAM. • Frame, line, and pixel clock signals. • AC bias signal for STN, data enable signal for TFT panels. • Supports little and big-endian, and Windows CE data formats. • LCD panel clock may be generated from the peripheral clock, or from a clock input pin. 7.15 Ethernet Remark: The Ethernet block is available on parts LPC4088/78/76. The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU. The Ethernet block and the CPU share the ARM Cortex-M4 D-code and system bus through the AHB-multilayer matrix to access the various on-chip SRAM blocks for Ethernet data, control, and status information. The Ethernet block interfaces between an off-chip Ethernet PHY using the Media Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus. 7.15.1 Features • Ethernet standards support: – Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. – Fully compliant with IEEE standard 802.3. – Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back pressure. – Flexible transmit and receive frame options. – Virtual Local Area Network (VLAN) frame support. • Memory management: – Independent transmit and receive buffers memory mapped to shared SRAM. – DMA managers with scatter/gather DMA and arrays of frame descriptors. – Memory traffic optimized by buffering and pre-fetching. • Enhanced Ethernet features: – Receive filtering. – Multicast and broadcast frame support for both transmit and receive. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 61 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller – Optional automatic Frame Check Sequence (FCS) insertion with Circular Redundancy Check (CRC) for transmit. – Selectable automatic transmit frame padding. – Over-length frame support for both transmit and receive allows any length frames. – Promiscuous receive mode. – Automatic collision back-off and frame retransmission. – Includes power management by clock switching. – Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter. • Physical interface: – Attachment of external PHY chip through standard MII or RMII interface. – PHY register access is available via the MIIM interface. 7.16 USB interface Remark: The USB Device/Host/OTG controller is available on parts LPC4088/78/76. The USB Device-only controller is available on part LPC4074/72. The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller. See Section 13.1 for details on typical USB interfacing solutions. 7.16.1 USB device controller The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, endpoint buffer memory, and a DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. When enabled, the DMA controller transfers data between the endpoint buffer and the USB RAM. 7.16.1.1 Features • Fully compliant with USB 2.0 Specification (full speed). • Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM. • Supports Control, Bulk, Interrupt and Isochronous endpoints. • Scalable realization of endpoints at run time. • Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time. • Supports SoftConnect and GoodLink features. • While USB is in the Suspend mode, the LPC408x/7x can enter one of the reduced power modes and wake up on USB activity. • Supports DMA transfers with all on-chip SRAM blocks on all non-control endpoints. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 62 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • Allows dynamic switching between CPU-controlled and DMA modes. • Double buffer implementation for Bulk and Isochronous endpoints. 7.16.2 USB host controller The host controller enables full- and low-speed data exchange with USB devices attached to the bus. It consists of register interface, serial interface engine and DMA controller. The register interface complies with the Open Host Controller Interface (OHCI) specification. 7.16.2.1 Features • OHCI compliant • Two downstream ports • Supports per-port power switching 7.16.3 USB OTG controller USB OTG is a supplement to the USB 2.0 Specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. The OTG Controller integrates the host controller, device controller, and a master-only I2C interface to implement OTG dual-role device functionality. The dedicated I2C interface controls an external OTG transceiver. 7.16.3.1 Features • Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision 1.0a. • Hardware support for Host Negotiation Protocol (HNP). • Includes a programmable timer required for HNP and Session Request Protocol (SRP). • Supports any OTG transceiver compliant with the OTG Transceiver Specification (CEA-2011), Rev. 1.0. 7.17 SD/MMC card interface Remark: The SD/MMC card interface is available on parts LPC4088/78/76. The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD memory cards. The SD card interface conforms to the SD Multimedia Card Specification Version 2.11. 7.17.1 Features • The MCI provides all functions specific to the SD/MMC memory card. These include the clock generation unit, power management control, and command and data transfer. • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 63 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • Can be used as a multimedia card bus or a secure digital memory card bus host. The SD/MMC can be connected to several multimedia cards or a single secure digital memory card. • DMA supported through the GPDMA controller. 7.18 Fast general purpose parallel I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC408x/7x use accelerated GPIO functions: • GPIO registers are accessed through the AHB multilayer bus so that the fastest possible I/O timing can be achieved. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All GPIO registers are byte and half-word addressable. • Entire port value can be written in one instruction. • Support for Cortex-M4 bit banding. • Support for use with the GPDMA controller. Additionally, any pin on Port 0 and Port 2 providing a digital function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous, so it may operate when clocks are not present such as during Power-down mode. Each enabled interrupt can be used to wake up the chip from Power-down mode. 7.18.1 Features • Bit level set and clear registers allow a single instruction to set or clear any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs after reset. • Pull-up/pull-down resistor configuration and open-drain configuration can be programmed through the pin connect block for each GPIO pin. 7.19 12-bit ADC The LPC408x/7x contain one ADC. It is a single 12-bit successive approximation ADC with eight channels and DMA support. 7.19.1 Features • 12-bit successive approximation ADC. • Input multiplexing among eight pins. • Power-down mode. • Measurement range VSS to VREFP. • 12-bit conversion rate: up to 400 kHz. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 64 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • Individual channels can be selected for conversion. • Burst conversion mode for single or multiple inputs. • Optional conversion on transition of input pin or Timer Match signal. • Individual result registers for each ADC channel to reduce interrupt overhead. • DMA support. 7.20 10-bit DAC The LPC408x/7x contain one DAC. The DAC allows to generate a variable analog output. The maximum output value of the DAC is VREFP. 7.20.1 Features • 10-bit DAC • Resistor string architecture • Buffered output • Power-down mode • Selectable output drive • Dedicated conversion timer • DMA support 7.21 Comparator Remark: The comparator is available on parts LPC4088/7876. Two embedded comparators are available to compare the voltage levels on external pins or against internal voltages. Up to four voltages on external pins and several internal reference voltages are selectable on each comparator. Additionally, two of the external inputs can be selected to drive an input common on both comparators. 7.21.1 Features • Up to five selectable external sources per comparator; fully configurable on either positive or negative comparator input channels. • 0.9 V internal band gap reference voltage selectable as either positive or negative input on each comparator. • 32-stage voltage ladder internal reference for selectable voltages on each comparator; configurable on either positive or negative comparator input. • Voltage ladder source voltage is selectable from an external pin or the 3.3 V analog voltage supply. • Voltage ladder can be separately powered down for applications only requiring the comparator function. • Relaxation oscillator circuitry output, for a 555 style timer operation. • Individual comparator outputs can be connected to I/O pins. • Separate interrupt for each comparator. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 65 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • Edge and level comparator outputs connect to two timers allowing edge counting while a level match has been asserted or measuring the time between two voltage trip points. 7.22 UART0/1/2/3 and USART4 Remark: UART0/1/2/3 are available on all parts. USART4 is available on parts LPC4088/78/76. The LPC408x/7x contain five UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface and support for RS-485/9-bit mode allowing both software address detection and automatic address detection using 9-bit mode. The UARTs include a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 7.22.1 Features • Maximum UART data bit rate of 7.5 MBit/s. • 16 B Receive and Transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Auto-baud capability. • Fractional divider for baud rate control, auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • Support for RS-485/9-bit/EIA-485 mode and multiprocessor addressing. • All UARTs have DMA support for both transmit and receive. • UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). • USART4 includes an IrDA mode to support infrared communication. • USART4 supports synchronous mode and a smart card mode conforming to ISO7816-3. 7.23 SPIFI The SPI Flash Interface allows low-cost serial flash memories to be connected to the ARM Cortex-M4 processor with little performance penalty compared to parallel flash devices with higher pin count. The entire flash content is accessible as normal memory using byte, halfword, and word accesses by the processor and/or DMA channels. SPIFI provides sufficient flexibility to be compatible with common flash devices and includes extensions to help insure compatibility with future devices. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 66 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.23.1 Features • Quad SPI Flash Interface (SPIFI) interface to external flash. • Transfer rates of up to SPIFI_CLK/2 bytes per second. • Code in the serial flash memory can be executed as if it was in the CPU’s internal memory space. This is accomplished by mapping the external flash memory directly into the CPU memory space. • Supports 1-, 2-, and 4-bit bidirectional serial protocols. • Half-duplex protocol compatible with various vendors and devices. • Supported by a driver library available from NXP Semiconductors. 7.24 SSP serial I/O controller The LPC408x/7x contain three SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.24.1 Features • Maximum SSP speed of 33 Mbit/s (master) or 10 Mbit/s (slave) • Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National Semiconductor Microwire buses • Synchronous serial communication • Master or slave operation • 8-frame FIFOs for both transmit and receive • 4-bit to 16-bit frame • DMA transfers supported by GPDMA 7.25 I2C-bus serial I/O controllers The LPC408x/7x contain three I2C-bus controllers. The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock Line (SCL) and a Serial Data Line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. 7.25.1 Features • All I2C-bus controllers can use standard GPIO pins with bit rates of up to 400 kbit/s (Fast I2C-bus). The I2C0-bus interface uses special open-drain pins with bit rates of up to 400 kbit/s. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 67 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • The I2C-bus interface supports Fast-mode Plus with bit rates up to 1 Mbit/s for I2C0 using pins P5[2] and P5[3]. • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • Both I2C-bus controllers support multiple address recognition and a bus monitor mode. 7.26 I2S-bus serial I/O controllers The LPC408x/7x contain one I2S-bus interface. The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S connection has one master, which is always the master, and one slave. The I2S interface on the LPC408x/7x provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 7.26.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1, 48) kHz. • Configurable word select period in master mode (separately for I2S input and output). • Two 8 word FIFO data buffers are provided, one for transmit and one for receive. • Generates interrupt requests when buffer levels cross a programmable boundary. • Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block. • Controls include reset, stop and mute options separately for I2S input and I2S output. 7.27 CAN controller and acceptance filters The LPC408x/7x contain one CAN controller with two channels. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 68 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low cost multiplex wiring. The CAN block is intended to support multiple CAN buses simultaneously, allowing the device to be used as a gateway, switch, or router between two of CAN buses in industrial or automotive applications. Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN Library block, but the 8-bit registers of those devices have been combined in 32-bit words to allow simultaneous access in the ARM environment. The main operational difference is that the recognition of received Identifiers, known in CAN terminology as Acceptance Filtering, has been removed from the CAN controllers and centralized in a global Acceptance Filter. 7.27.1 Features • Two CAN controllers and buses. • Data rates to 1 Mbit/s on each bus. • 32-bit register and RAM access. • Compatible with CAN specification 2.0B, ISO 11898-1. • Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN buses. • Acceptance Filter can provide FullCAN-style automatic reception for selected Standard Identifiers. • FullCAN messages can generate interrupts. 7.28 General purpose 32-bit timers/external event counters The LPC408x/7x include four 32-bit timer/counters. The timer/counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts, generate timed DMA requests, or perform other actions at specified timer values, based on four match registers. Each timer/counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.28.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • Counter or timer operation. • Two 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 69 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. • Up to two match registers can be used to generate timed DMA requests. 7.29 Pulse Width Modulator (PWM) The LPC408x/7x contain two standard PWMs. The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC408x/7x. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is in addition to these features, and is based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the PWMMR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 7.29.1 Features • LPC408x/7x has two PWM blocks with Counter or Timer operation (may use the peripheral clock or one of the capture inputs as the clock source). • Seven match registers allow up to 6 single edge controlled or 3 double edge controlled PWM outputs, or a mix of both types. The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 70 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go high at the beginning of each cycle unless the output is a constant low. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard 32-bit timer/counter with a programmable 32-bit prescaler if the PWM mode is not enabled. 7.30 Motor control PWM The LPC408x/7x contain one motor control PWM. The motor control PWM is a specialized PWM supporting 3-phase motors and other combinations. Feedback inputs are provided to automatically sense rotor position and use that information to ramp speed up or down. An abort input is also provided that causes the PWM to immediately release all motor drive outputs. At the same time, the motor control PWM is highly configurable for other generalized timing, counting, capture, and compare applications. The maximum PWM speed is determined by the PWM resolution (n) and the operating frequency f: PWM speed = f/2n (see Table 6). 7.31 Quadrature Encoder Interface (QEI) Remark: The QEI is available on parts LPC4088/78/76. A quadrature encoder, also known as a 2-channel incremental encoder, converts angular displacement into two pulse signals. By monitoring both the number of pulses and the relative phase of the two signals, the user can track the position, direction of rotation, and velocity. In addition, a third channel, or index signal, can be used to reset the position counter. The quadrature encoder interface decodes the digital pulses from a quadrature encoder wheel to integrate position over time and determine direction of rotation. In addition, the QEI can capture the velocity of the encoder wheel. 7.31.1 Features • Tracks encoder position. Table 6. PWM speed at operating frequency 120 MHz PWM resolution PWM speed 6 bit 1.875 MHz 8 bit 0.468 MHz 10 bit 0.117 MHz LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 71 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • Increments/decrements depending on direction. • Programmable for 2 or 4 position counting. • Velocity capture using built-in timer. • Velocity compare function with “less than” interrupt. • Uses 32-bit registers for position and velocity. • Three position compare registers with interrupts. • Index counter for revolution counting. • Index compare register with interrupts. • Can combine index and position interrupts to produce an interrupt for whole and partial revolution displacement. • Digital filter with programmable delays for encoder input signals. • Can accept decoded signal inputs (clk and direction). • Connected to APB. 7.32 ARM Cortex-M4 system tick timer The ARM Cortex-M4 includes a system tick timer (SYSTICK) that is intended to generate a dedicated SYSTICK exception at a 10 ms interval. In the LPC408x/7x, this timer can be clocked from the internal AHB clock or from a device pin. 7.33 Windowed WatchDog Timer (WWDT) The purpose of the watchdog is to reset the controller if software fails to periodically service it within a programmable time window. 7.33.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period. • Optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. • Optional warning interrupt can be generated at a programmable time prior to watchdog time-out. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect feed sequence causes reset or interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 24-bit timer with internal prescaler. • Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  224  4) in multiples of Tcy(WDCLK)  4. • The Watchdog Clock (WDCLK) source is a dedicated watchdog oscillator, which is always running if the watchdog timer is enabled. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 72 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.34 RTC and backup registers The RTC is a set of counters for measuring time when system power is on, and optionally when it is off. The RTC on the LPC408x/7x is designed to have extremely low power consumption, i.e. less than 1 A. The RTC will typically run from the main chip power supply conserving battery power while the rest of the device is powered up. When operating from a battery, the RTC will continue working down to 2.1 V. Battery power can be provided from a standard 3 V lithium button cell. An ultra-low power 32 kHz oscillator will provide a 1 Hz clock to the time counting portion of the RTC, moving most of the power consumption out of the time counting function. The RTC includes a calibration mechanism to allow fine-tuning the count rate in a way that will provide less than 1 second per day error when operated at a constant voltage and temperature. The RTC contains a small set of backup registers (20 bytes) for holding data while the main part of the LPC408x/7x is powered off. The RTC includes an alarm function that can wake up the LPC408x/7x from all reduced power modes with a time resolution of 1 s. 7.34.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Dedicated power supply pin can be connected to a battery or to the main 3.3 V. • Periodic interrupts can be generated from increments of any field of the time registers. • Backup registers (20 bytes) powered by VBAT. • RTC power supply is isolated from the rest of the chip. 7.35 Event monitor/recorder The event monitor/recorder allows recording of tampering events in sealed product enclosures. Sensors report any attempt to open the enclosure, or to tamper with the device in any other way. The event monitor/recorder stores records of such events when the device is powered only by the backup battery. 7.35.1 Features • Supports three digital event inputs in the VBAT power domain. • An event is defined as a level change at the digital event inputs. • For each event channel, two timestamps mark the first and the last occurrence of an event. Each channel also has a dedicated counter tracking the total number of events. Timestamp values are taken from the RTC. • Runs in VBAT power domain, independent of system power supply. The event/recorder/monitor can therefore operate in Deep power-down mode. • Very low power consumption. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 73 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller • Interrupt available if system is running. • A qualified event can be used as a wake-up trigger. • State of event interrupts accessible by software through GPIO. 7.36 Clocking and power control 7.36.1 Crystal oscillators The LPC408x/7x include four independent oscillators. These are the main oscillator, the IRC oscillator, the watchdog oscillator, and the RTC oscillator. Following reset, the LPC408x/7x will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the boot loader code to operate at a known frequency. See Figure 10 for an overview of the LPC408x/7x clock generation. Fig 10. LPC408x/7x clock generation block diagram MAIN PLL0 IRC oscillator main oscillator (osc_clk) CLKSRCSEL (system clock select) sysclk pll_clk CCLKSEL (CPU clock select) 002aag737 pll_clk ALT PLL1 CPU CLOCK DIVIDER alt_pll_clk cclk PERIPHERAL CLOCK DIVIDER pclk EMC CLOCK DIVIDER emc_clk sysclk alt_pll_clk pll_clk USBCLKSEL (USB clock select) USB CLOCK DIVIDER usb_clk sysclk LPC408x/7x LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 74 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.36.1.1 Internal RC oscillator The IRC may be used as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 % accuracy over the entire voltage and temperature range. Upon power-up or any chip reset, the LPC408x/7x use the IRC as the clock source. Software may later switch to one of the other available clock sources. 7.36.1.2 Main oscillator The main oscillator can be used as the clock source for the CPU, with or without using the PLL. The main oscillator also provides the clock source for the alternate PLL1. The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the main PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock frequency is referred to as CCLK elsewhere in this document. The frequencies of PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 7.36.2 for additional information. 7.36.1.3 RTC oscillator The RTC oscillator provides a 1 Hz clock to the RTC and a 32 kHz clock output that can be output on the CLKOUT pin in order to allow trimming the RTC oscillator without interference from a probe. 7.36.1.4 Watchdog oscillator The Watchdog Timer has a dedicated oscillator that provides a 500 kHz clock to the Watchdog Timer that is always running if the Watchdog Timer is enabled. The Watchdog oscillator clock can be output on the CLKOUT pin in order to allow observe its frequency. In order to allow Watchdog Timer operation with minimum power consumption, which can be important in reduced power modes, the Watchdog oscillator frequency is not tightly controlled. The Watchdog oscillator frequency will vary over temperature and power supply within a particular part, and may vary by processing across different parts. This variation should be taken into account when determining Watchdog reload values. Within a particular part, temperature and power supply variations can produce up to a 17 % frequency variation. Frequency variation between devices under the same operating conditions can be up to 30 %. 7.36.2 Main PLL (PLL0) and Alternate PLL (PLL1) PLL0 (also called the Main PLL) and PLL1 (also called the Alternate PLL) are functionally identical but have somewhat different input possibilities and output connections. These possibilities are shown in Figure 10. The Main PLL can receive its input from either the IRC or the main oscillator and can potentially be used to provide the clocks to nearly everything on the device. The Alternate PLL receives its input only from the main oscillator and is intended to be used as an alternate source of clocking to the USB. The USB has timing needs that may not always be filled by the Main PLL. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 75 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Both PLLs are disabled and powered off on reset. If the Alternate PLL is left disabled, the USB clock can be supplied by PLL0 if everything is set up to provide 48 MHz to the USB clock through that route. The source for each clock must be selected via the CLKSEL registers and can be further reduced by clock dividers as needed. PLL0 accepts an input clock frequency from either the IRC or the main oscillator. If only the Main PLL is used, then its output frequency must be an integer multiple of all other clocks needed in the system. PLL1 takes its input only from the main oscillator, requiring an external crystal in the range of 10 to 25 MHz. In each PLL, the Current Controlled Oscillator (CCO) operates in the range of 156 MHz to 320 MHz, so there are additional dividers to bring the output down to the desired frequencies. The minimum output divider value is 2, insuring that the output of the PLLs have a 50 % duty cycle. If the USB is used, the possibilities for the CPU clock and other clocks will be limited by the requirements that the frequency be precise and very low jitter, and that the PLL0 output must be a multiple of 48 MHz. Even multiples of 48 MHz that are within the operating range of the PLL are 192 MHz and 288 MHz. Also, only the main oscillator in conjunction with the PLL can meet the precision and jitter specifications for USB. It is due to these limitations that the Alternate PLL is provided. The alternate PLL accepts an input clock frequency from the main oscillator in the range of 10 MHz to 25 MHz only. When used as the USB clock, the input frequency is multiplied up to a multiple of 48 MHz (192 MHz or 288 MHz as described above). 7.36.3 Wake-up timer The LPC408x/7x begin operation at power-up and when awakened from Power-down mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. When the main oscillator is initially activated, the wake-up timer allows software to ensure that the main oscillator is fully functional before the processor uses it as a clock source and starts to execute instructions. This is important at power on, all types of reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the wake-up Timer. The wake-up timer monitors the crystal oscillator to check whether it is safe to begin code execution. When power is applied to the chip, or when some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 7.36.4 Power control The LPC408x/7x support a variety of power control features. There are four special modes of processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 76 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller value. This allows a trade-off of power versus processing speed based on application requirements. In addition, the peripheral power control allows shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Each of the peripherals has its own clock divider which provides even better power control. The integrated PMU (Power Management Unit) automatically adjusts internal regulators to minimize power consumption during Sleep, Deep-sleep, Power-down, and Deep power-down modes. The LPC408x/7x also implement a separate power domain to allow turning off power to the bulk of the device while maintaining operation of the RTC and a small set of registers for storing data during any of the power-down modes. 7.36.4.1 Sleep mode When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep mode does not need any special sequence other than re-enabling the clock to the ARM core. In Sleep mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Sleep mode and may generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. The DMA controller can continue to work in Sleep mode and has access to the peripheral RAMs and all peripheral registers. The flash memory and the main SRAM are not available in Sleep mode, they are disabled in order to save power. Wake-up from Sleep mode will occur whenever any enabled interrupt occurs. 7.36.4.2 Deep-sleep mode In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Deep-sleep mode and the logic levels of chip pins remain static. The output of the IRC is disabled but the IRC is not powered down to allow fast wake-up. The RTC oscillator is not stopped because the RTC interrupts may be used as the wake-up source. The PLL is automatically turned off and disconnected. The clock divider registers are automatically reset to zero. The Deep-sleep mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power consumption to a very low value. Power to the flash memory is left on in Deep-sleep mode, allowing a very quick wake-up. Wake-up from Deep-sleep mode can initiated by the NMI, External Interrupts EINT0 through EINT3, GPIO interrupts, the Ethernet Wake-on-LAN interrupt, Brownout Detect, an RTC Alarm interrupt, a USB input pin transition (USB activity interrupt), a CAN input pin transition, or a Watchdog Timer time-out, when the related interrupt is enabled. Wake-up will occur whenever any enabled interrupt occurs. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 77 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller On wake-up from Deep-sleep mode, the code execution and peripherals activities will resume after four cycles expire if the IRC was used before entering Deep-sleep mode. If the main external oscillator was used, the code execution will resume when 4096 cycles expire. PLL and clock dividers need to be reconfigured accordingly. 7.36.4.3 Power-down mode Power-down mode does everything that Deep-sleep mode does but also turns off the power to the IRC oscillator and the flash memory. This saves more power but requires waiting for resumption of flash operation before execution of code or data access in the flash memory can be accomplished. When the chip enters Power-down mode, the IRC, the main oscillator, and all clocks are stopped. The RTC remains running if it has been enabled and RTC interrupts may be used to wake up the CPU. The flash is forced into Power-down mode. The PLLs are automatically turned off and the clock selection multiplexers are set to use the system clock sysclk (the reset state). The clock divider control registers are automatically reset to zero. If the Watchdog timer is running, it will continue running in Power-down mode. On the wake-up of Power-down mode, if the IRC was used before entering Power-down mode, it will take IRC 60 s to start-up. After this four IRC cycles will expire before the code execution can then be resumed if the code was running from SRAM. In the meantime, the flash wake-up timer then counts 12 MHz IRC clock cycles to make the 100 s flash start-up time. When it times out, access to the flash will be allowed. Users need to reconfigure the PLL and clock dividers accordingly. 7.36.4.4 Deep power-down mode The Deep power-down mode can only be entered from the RTC block. In Deep power-down mode, power is shut off to the entire chip with the exception of the RTC module and the RESET pin. To optimize power conservation, the user has the additional option of turning off or retaining power to the 32 kHz oscillator. It is also possible to use external circuitry to turn off power to the on-chip regulator via the VDD(REG)(3V3) pins and/or the I/O power via the VDD(3V3) pins after entering Deep Power-down mode. Power must be restored before device operation can be restarted. The LPC408x/7x can wake up from Deep power-down mode via the RESET pin or an alarm match event of the RTC. 7.36.4.5 Wake-up Interrupt Controller (WIC) The WIC allows the CPU to automatically wake up from any enabled priority interrupt that can occur while the clocks are stopped in Deep-sleep, Power-down, and Deep power-down modes. The WIC works in connection with the Nested Vectored Interrupt Controller (NVIC). When the CPU enters Deep-sleep, Power-down, or Deep power-down mode, the NVIC sends a mask of the current interrupt situation to the WIC. This mask includes all of the interrupts that are both enabled and of sufficient priority to be serviced immediately. With this information, the WIC simply notices when one of the interrupts has occurred and then it wakes up the CPU. The WIC eliminates the need to periodically wake up the CPU and poll the interrupts resulting in additional power savings. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 78 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.36.5 Peripheral power control A power control for peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings. 7.36.6 Power domains The LPC408x/7x provide two independent power domains that allow the bulk of the device to have power removed while maintaining operation of the RTC and the backup registers. On the LPC408x/7x, I/O pads are powered by VDD(3V3), while VDD(REG)(3V3) powers the on-chip voltage regulator which in turn provides power to the CPU and most of the peripherals. Depending on the LPC408x/7x application, a design can use two power options to manage power consumption. The first option assumes that power consumption is not a concern and the design ties the VDD(3V3) and VDD(REG)(3V3) pins together. This approach requires only one 3.3 V power supply for both pads, the CPU, and peripherals. While this solution is simple, it does not support powering down the I/O pad ring “on the fly” while keeping the CPU and peripherals alive. The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and a dedicated 3.3 V supply for the CPU (VDD(REG)(3V3)). Having the on-chip voltage regulator powered independently from the I/O pad ring enables shutting down of the I/O pad power supply “on the fly” while the CPU and peripherals stay active. The VBAT pin supplies power only to the RTC domain. The RTC requires a minimum of power to operate, which can be supplied by an external battery. The device core power (VDD(REG)(3V3)) is used to operate the RTC whenever VDD(REG)(3V3) is present. There is no power drain from the RTC battery when VDD(REG)(3V3) is available and VDD(REG)(3V3) > VBAT. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 79 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.37 System control 7.37.1 Reset Reset has four sources on the LPC408x/7x: the RESET pin, the Watchdog reset, Power-On Reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable level, starts the Wake-up timer (see description in Section 7.36.3), causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the flash controller has completed its initialization. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the boot block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. Fig 11. Power distribution REAL-TIME CLOCK BACKUP REGISTERS REGULATOR 32 kHz OSCILLATOR POWER SELECTOR ULTRA-LOW POWER REGULATOR RTC POWER DOMAIN MAIN POWER DOMAIN 002aag738 RTCX1 VBAT (typical 3.0 V) VDD(REG)(3V3) (typical 3.3 V) RTCX2 VDD(3V3) VSS to memories, peripherals, oscillators, PLLs to core to I/O pads ADC DAC ADC POWER DOMAIN VDDA VREFP VSSA LPC408x/7x LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 80 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.37.2 Brownout detection The LPC408x/7x include 2-stage monitoring of the voltage on the VDD(REG)(3V3) pins. If this voltage falls below 2.2 V (typical), the BOD asserts an interrupt signal to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. The second stage of low-voltage detection asserts reset to inactivate the LPC408x/7x when the voltage on the VDD(REG)(3V3) pins falls below 1.85 V (typical). This reset prevents alteration of the flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the power-on reset circuitry maintains the overall reset. Both the 2.2 V and 1.85 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.2 V detection to reliably interrupt, or a regularly executed event loop to sense the condition. 7.37.3 Code security (Code Read Protection - CRP) This feature of the LPC408x/7x allows user to enable different levels of security in the system so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP. There are three levels of the Code Read Protection. CRP1 disables access to chip via the JTAG and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased. CRP2 disables access to chip via the JTAG and only allows full flash erase and update using a reduced set of the ISP commands. Running an application with level CRP3 selected fully disables any access to chip via the JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too. It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via UART0. 7.37.4 APB interface The APB peripherals are split into two separate APB buses in order to distribute the bus bandwidth and thereby reducing stalls caused by contention between the CPU and the GPDMA controller. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 81 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 7.37.5 AHB multilayer matrix The LPC408x/7x use an AHB multilayer matrix. This matrix connects the instruction (I-code) and data (D-code) CPU buses of the ARM Cortex-M4 to the flash memory, the main (32 kB) static RAM, and the Boot ROM. The GPDMA can also access all of these memories. Additionally, the matrix connects the CPU system bus and all of the DMA controllers to the various peripheral functions. 7.37.6 External interrupt inputs The LPC408x/7x include up to 30 edge sensitive interrupt inputs combined with one level sensitive external interrupt input as selectable pin function. The external interrupt input can optionally be used to wake up the processor from Power-down mode. 7.37.7 Memory mapping control The Cortex-M4 incorporates a mechanism that allows remapping the interrupt vector table to alternate locations in the memory map. This is controlled via the Vector Table Offset Register contained in the NVIC. The vector table may be located anywhere within the bottom 1 GB of Cortex-M4 address space. The vector table must be located on a 128 word (512 byte) boundary because the NVIC on the LPC408x/7x is configured for 128 total interrupts. 7.38 Debug control Debug and trace functions are integrated into the ARM Cortex-M4. Serial wire debug and trace functions are supported in addition to a standard JTAG debug and parallel trace functions. The ARM Cortex-M4 is configured to support up to eight breakpoints and four watch points. 8. Limiting values Table 7. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(3V3) supply voltage (3.3 V) external rail 2.4 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.4 3.6 V VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V Vi(VREFP) input voltage on pin VREFP 0.5 +4.6 V VIA analog input voltage on ADC related pins 0.5 +5.1 V VI input voltage 5 V tolerant digital I/O pins; VDD(3V3)  2.4V [2] 0.5 +5.5 V VDD(3V3)  0 V 0.5 +3.6 V other I/O pins [2][3] 0.5 VDD(3V3) + 0.5 V IDD supply current per supply pin - 100 mA ISS ground current per ground pin - 100 mA LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 82 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] Not to exceed 4.6 V. [4] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on the required shelf lifetime. Please refer to the JEDEC spec for further details. [5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Ilatch I/O latch-up current (0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 C - 100 mA Tstg storage temperature non-operating [4] 65 +150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W VESD electrostatic discharge voltage human body model; all pins [5]- 4000 V Table 7. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 83 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation Tj = Tamb + PD  Rthj – a Table 8. Thermal characteristics VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; Symbol Parameter Conditions Min Typ Max Unit Tj(max) maximum junction temperature - - 125 C Table 9. Thermal resistance (LQFP packages) Tamb = 40 C to +85 C unless otherwise specified. Thermal resistance value (C/W): ±15 % LQFP80 LQFP144 LQFP208 ja JEDEC (4.5 in  4 in) 0 m/s 41 31 27 1 m/s 35 28 25 2.5 m/s 32 26 24 Single-layer (4.5 in  3 in) 0 m/s 61 43 35 1 m/s 47 35 31 2.5 m/s 43 33 29 jc 7.8 9.2 10.5 jb 11.6 13.5 15.2 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 84 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Table 10. Thermal resistance value (TFBGA packages) Tamb = 40 C to +85 C unless otherwise specified. Thermal resistance value (C/W): ±15 % TFBGA180 TFBGA208 ja JEDEC (4.5 in  4 in) 0 m/s 47 43 1 m/s 39 37 2.5 m/s 35 33 8-layer (4.5 in  3 in) 0 m/s 39 37 1 m/s 35 33 2.5 m/s 31 30 jc 8.5 7.4 jb 13 16 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 85 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 10. Static characteristics Table 11. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit Supply pins VDD(3V3) supply voltage (3.3 V) external rail [2] 2.4 3.3 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.4 3.3 3.6 V VDDA analog 3.3 V pad supply voltage [3] 2.7 3.3 3.6 V Vi(VBAT) input voltage on pin VBAT [4] 2.1 3.0 3.6 V Vi(VREFP) input voltage on pin VREFP [3] 2.7 3.3 VDDA V IDD(REG)(3V3) regulator supply current (3.3 V) active mode; code while(1){} executed from flash; all peripherals disabled PCLK = CCLK/4 CCLK = 12 MHz; PLL disabled [5][6]- 7.5 - mA CCLK = 120 MHz; PLL enabled [5][7]- 56 - mA active mode; code while(1){} executed from flash; all peripherals enabled; PCLK = CCLK/4 CCLK = 12 MHz; PLL disabled [5][6] 14 - CCLK = 120 MHz; PLL enabled [5][7] 120 - mA Sleep mode [5][8]- 5.5 - mA Deep-sleep mode [5][9] - 550 1200 A Power-down mode [5][9] - 280 600 A IBAT battery supply current RTC running; part powered down; VDD(REG)(3V3) =0 V; Vi(VBAT) = 3.0 V; VDD(3V3) = 0 V. [10] - 1 9 A part powered; VDD(REG)(3V3) = 3.3 V; Vi(VBAT) = 3.0 V [11] <10 nA LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 86 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Standard port pins, RESET IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD(3V3); on-chip pull-down resistor disabled - 0.5 10 nA VI input voltage pin configured to provide a digital function [15][16] [17] 0 - 5.0 V VO output voltage output active 0 - VDD(3V3) V VIH HIGH-level input voltage 0.7VDD(3V3)- - V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage IOH = 4 mA VDD(3V3)  0.45 - - V VOL LOW-level output voltage IOL = 4 mA - - 0.45 V IOH HIGH-level output current VOH = VDD(3V3)  0.4 V 4 - - mA IOL LOW-level output current VOL = 0.4 V 4 - - mA IOHS HIGH-level short-circuit output current VOH = 0 V [18]- - 50 mA IOLS LOW-level short-circuit output current VOL = VDD(3V3) [18]- - 60 mA Ipd pull-down current VI = 5 V 10 50 150 A Ipu pull-up current VI = 0 V 15 50 85 A VDD(3V3) < VI < 5 V 0 0 0 A I2C-bus pins (P0[27] and P0[28]) VIH HIGH-level input voltage 0.7VDD(3V3)- - V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage - 0.05  VDD(3V3) - V VOL LOW-level output voltage IOLS = 3 mA - - 0.4 V ILI input leakage current VI = VDD(3V3) [19]- 2 4 A VI = 5 V - 10 22 A USB pins IOZ OFF-state output current 0 V < VI < 3.3 V [20]- - 10 A VBUS bus supply voltage [20]- - 5.25 V VDI differential input sensitivity voltage (D+)  (D) [20] 0.2 - - V Table 11. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 87 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] For USB operation 3.0 V  VDD((3V3)  3.6 V. Guaranteed by design. [3] VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used. [4] The RTC typically fails when Vi(VBAT) drops below 1.6 V. [5] VDD(REG)(3V3) = 3.3 V; Tamb = 25 C for all power consumption measurements. [6] Boost control bits in the PBOOST register set to 0x0 (see LPC408x/7x User manual). [7] Boost control bits in the PBOOST register set to 0x3 (see LPC408x/7x User manual). [8] IRC running at 12 MHz; main oscillator and PLL disabled; PCLK = CCLK/4. [9] BOD disabled. [10] On pin VBAT; VDD(REG)(3V3) = VDD(3V3) = VDDA = 0; Tamb = 25 C. [11] On pin VBAT; VDD(REG)(3V3) = VDD(3V3) = VDDA = 3.3 V; Tamb = 25 C. [12] All internal pull-ups disabled. All pins configured as output and driven LOW. VDD(3V3) = 3.3 V; Tamb = 25 C. [13] VDDA = 3.3 V; Tamb = 25 C. [14] Vi(VREFP) = 3.3 V; Tamb = 25 C. [15] Including voltage on outputs in 3-state mode. [16] VDD(3V3) supply voltages must be present. [17] 3-state outputs go into 3-state mode in Deep power-down mode. [18] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [19] To VSS. [20] 3.0 V  VDD(3V3)  3.6 V. VCM differential common mode voltage range includes VDI range [20] 0.8 - 2.5 V Vth(rs)se single-ended receiver switching threshold voltage [20] 0.8 - 2.0 V VOL LOW-level output voltage for low-/full-speed RL of 1.5 k to 3.6 V [20]- - 0.18 V VOH HIGH-level output voltage (driven) for low-/full-speed RL of 15 k to GND [20] 2.8 - 3.5 V Ctrans transceiver capacitance pin to GND [20]- - 20 pF Oscillator pins (see Section 13.2) Vi(XTAL1) input voltage on pin XTAL1 0.5 1.8 1.95 V Vo(XTAL2) output voltage on pin XTAL2 0.5 1.8 1.95 V Vi(RTCX1) input voltage on pin RTCX1 0.5 - 3.6 V Vo(RTCX2) output voltage on pin RTCX2 0.5 - 3.6 V Table 11. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 88 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 10.1 Power consumption Conditions: BOD disabled. Fig 12. Deep-sleep mode: Typical regulator supply current IDD(REG)(3V3) versus temperature Conditions: BOD disabled. Fig 13. Power-down mode: Typical regulator supply current IDD(REG)(3V3) versus temperature temperature (°C) -40 -15 10 35 60 85 002aah051 0.7 1.1 1.5 0.3 VDD(REG)(3V3) = 3.6 V 3.3 V 3.0 V 2.4 V IDD(REG)(3V3) (mA) temperature (°C) -40 -15 10 35 60 85 002aah052 300 600 900 0 VDD(REG)(3V3) = 3.6 V 3.3 V 3.0 V 2.4 V IDD(REG)(3V3) (μA) LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 89 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Conditions: VDD(REG)(3V3) = VDDA = VDD(3V3) = 0; VBAT = 3.0 V. Fig 14. Part powered off: Typical battery supply current (IBAT) versus temperature 002aah074 temperature (°C) -40 -15 10 35 60 85 0.8 1.6 0.4 1.2 2.0 0 IBAT (μA) LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 90 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 10.2 Peripheral power consumption The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled in the PCONP register. All other blocks are disabled and no code is executed. Measured on a typical sample at Tamb = 25 C. The peripheral clock was set to PCLK = CCLK/4 with CCLK = 12 MHz, 48 MHz, and 120 MHz. The combined current of several peripherals running at the same time can be less than the sum of each individual peripheral current measured separately. Table 12. Power consumption for individual analog and digital blocks Tamb = 25 C; VDD(REG)(3V3) = VDD(3V3) = VDDA = 3.3 V; PCLK = CCLK/4. Peripheral Conditions Typical supply current in mA 12 MHz[1] 48 MHz[1] 120 MHz[2] Timer0 0.01 0.06 0.15 Timer1 0.02 0.07 0.16 Timer2 0.02 0.07 0.17 Timer3 0.01 0.07 0.16 Timer0 + Timer1 + Timer2 + Timer3 0.07 0.28 0.67 UART0 0.05 0.19 0.45 UART1 0.06 0.24 0.56 UART2 0.05 0.2 0.47 UART3 0.06 0.23 0.56 USART4 0.07 0.27 0.66 UART0 + UART1 + UART2 + UART3 + USART4 0.29 1.13 2.74 PWM0 + PWM1 0.08 0.31 0.75 Motor control PWM 0.04 0.15 0.36 I2C0 0.01 0.03 0.08 I2C1 0.01 0.03 0.1 I2C2 0.01 0.03 0.08 I2C0 + I2C1 + I2C2 0.02 0.1 0.26 SSP0 0.03 0.1 0.26 SSP1 0.02 0.11 0.27 DAC 0.3 0.31 0.33 ADC (12 MHz clock) 1.51 1.61 1.7 Comparator 0.01 0.03 0.06 CAN1 0.11 0.44 1.08 CAN2 0.1 0.4 0.98 CAN1 + CAN2 0.15 0.59 1.44 DMA PCLK = CCLK 1.1 4.27 10.27 QEI 0.02 0.11 0.28 GPIO 0.4 1.72 4.16 LCD 0.99 3.84 9.25 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 91 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] Boost control bits in the PBOOST register set to 0x0 (see LPC178x/7x User manual UM10470). [2] Boost control bits in the PBOOST register set to 0x3 (see LPC178x/7x User manual UM10470). I2S 0.04 0.18 0.46 EMC 0.82 3.17 7.63 RTC 0.01 0.01 0.05 USB + PLL1 0.62 0.97 1.67 Ethernet PCENET bit set to 1 in the PCONP register 0.54 2.08 5.03 Table 12. Power consumption for individual analog and digital blocks …continued Tamb = 25 C; VDD(REG)(3V3) = VDD(3V3) = VDDA = 3.3 V; PCLK = CCLK/4. Peripheral Conditions Typical supply current in mA 12 MHz[1] 48 MHz[1] 120 MHz[2] LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 92 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 10.3 Electrical pin characteristics Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 15. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 16. Typical LOW-level output current IOL versus LOW-level output voltage VOL IOH (mA) 0 8 16 24 002aaf112 2.8 2.4 3.2 3.6 VOH (V) 2.0 T = 85 °C 25 °C −40 °C VOL (V) 0 0.2 0.4 0.6 002aaf111 5 10 15 IOL (mA) 0 T = 85 °C 25 °C −40 °C LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 93 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 17. Typical pull-up current Ipu versus input voltage VI Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins. Fig 18. Typical pull-down current Ipd versus input voltage VI 0 1 2 3 4 5 002aaf108 −30 −50 −10 10 Ipu (μA) −70 T = 85 °C 25 °C −40 °C VI (V) 002aaf109 VI (V) 0 1 2 3 4 5 10 70 50 30 90 Ipd (μA) −10 T = 85 °C 25 °C −40 °C LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 94 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11. Dynamic characteristics 11.1 Flash memory [1] Number of program/erase cycles. [2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes. [1] EEPROM clock frequency = 375 kHz. Programming/erase times increase with decreasing EEPROM clock frequency. Table 13. Flash characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Nendu endurance [1] 10000 100000 - cycles tret retention time powered 10 - - years unpowered 20 - - years ter erase time sector or multiple consecutive sectors 95 100 105 ms tprog programming time [2] 0.95 1 1.05 ms Table 14. EEPROM characteristics Tamb = 40 C to +85C; VDD(REG)(3V3) = 2.7 V to 3.6 V. Symbol Parameter Conditions Min Typ Max Unit fclk clock frequency 200 375 400 kHz Nendu endurance 100000 500000 - cycles tret retention time powered 10 - - years unpowered 10 - - years ter erase time 64 bytes [1]- 1.8 - ms tprog programming time 64 bytes [1]- 1.1 - ms LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 95 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.2 External memory interface Table 15. Dynamic characteristics: Static external memory interface CL = 30 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter[1] Conditions[1] Min Typ Max Unit Read cycle parameters[2] tCSLAV CS LOW to address valid time RD1 3.3 4.3 6.1 ns tCSLOEL CS LOW to OE LOW time RD2 [3] 2.4 + Tcy(clk)  WAITOEN 3.1 + Tcy(clk)  WAITOEN 4.2 + Tcy(clk)  WAITOEN ns tCSLBLSL CS LOW to BLS LOW time RD3; PB = 1 [3] 2.7 3.5 4.9 ns tOELOEH OE LOW to OE HIGH time RD4 [3] (WAITRD  WAITOEN + 1)  Tcy(clk)  2.2 (WAITRD  WAITOEN + 1)  Tcy(clk)  2.8 (WAITRD  WAITOEN + 1)  Tcy(clk)  3.8 ns tam memory access time RD5 [4][3] (WAITRD  WAITOEN + 1)  Tcy(clk)  9.6 (WAITRD  WAITOEN + 1)  Tcy(clk)  13.2 (WAITRD  WAITOEN + 1)  Tcy(clk)  20.2 ns th(D) data input hold time RD6 [5][3] 5.0 7.2 10.7 ns tCSHBLSH CS HIGH to BLS HIGH time PB = 1 2.7 3.4 4.9 ns tCSHOEH CS HIGH to OE HIGH time [3] 2.4 3.1 4.2 ns tOEHANV OE HIGH to address invalid time [3] 0.77 1.2 1.86 ns tdeact deactivation time RD7 [3] 3.3 4.3 6.1 ns Write cycle parameters[2] tCSLAV CS LOW to address valid time WR1 3.3 4.3 6.1 ns tCSLDV CS LOW to data valid time WR2 3.4 4.8 6.6 ns tCSLWEL CS LOW to WE LOW time WR3; PB =1 [3] 2.6 + Tcy(clk)  (1 + WAITWEN) 3.3 + Tcy(clk)  (1 + WAITWEN) 4.6 + Tcy(clk)  (1 + WAITWEN) ns tCSLBLSL CS LOW to BLS LOW time WR4; PB = 1 [3] 2.7 3.5 4.9 ns tWELWEH WE LOW to WE HIGH time WR5; PB =1 [3] (WAITWR  WAITWEN + 1)  Tcy(clk)  2.3 (WAITWR  WAITWEN + 1)  Tcy(clk)  2.8 (WAITWR  WAITWEN + 1)  Tcy(clk)  3.8 ns tBLSLBLSH BLS LOW to BLS HIGH time PB = 1 [3] (WAITWR  WAITWEN + 3)  Tcy(clk)  2.8 (WAITWR  WAITWEN + 3)  Tcy(clk)  3.5 (WAITWR  WAITWEN + 3)  Tcy(clk)  5.0 ns tWEHDNV WE HIGH to data invalid time WR6; PB =1 [3] 3.1 + Tcy(clk) 4.3 + Tcy(clk) 5.8 + Tcy(clk) ns tWEHEOW WE HIGH to end of write time WR7; PB = 1 [6][3] Tcy(clk)  2.6 Tcy(clk)  3.4 Tcy(clk)  4.6 ns tBLSHDNV BLS HIGH to data invalid time PB = 1 3.4 4.8 6.6 ns tWEHANV WE HIGH to address invalid time PB = 1 [3] 3.0 + Tcy(clk) 3.8 + Tcy(clk) 5.3 + Tcy(clk) ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 96 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] Parameters are shown as RDn or WDn in Figure 19 as indicated in the Conditions column. [2] Parameters specified for 40 % of VDD(3V3) for rising edges and 60 % of VDD(3V3) for falling edges. [3] Tcy(clk) = 1/EMC_CLK (see LPC408x/7x User manual). [4] Latest of address valid, EMC_CSx LOW, EMC_OE LOW, EMC_BLSx LOW (PB = 1). [5] After End Of Read (EOR): Earliest of EMC_CSx HIGH, EMC_OE HIGH, EMC_BLSx HIGH (PB = 1), address invalid. [6] End Of Write (EOW): Earliest of address invalid, EMC_CSx HIGH, EMC_BLSx HIGH (PB = 1). tdeact deactivation time WR8; PB = 0; PB = 1 [3] 3.3 4.3 6.1 ns tCSLBLSL CS LOW to BLS LOW WR9; PB = 0 [3] 2.7 + Tcy(clk)  (1 + WAITWEN) 3.5 + Tcy(clk)  (1 + WAITWEN) 4.9 + Tcy(clk)  (1 + WAITWEN) ns tBLSLBLSH BLS LOW to BLS HIGH time WR10; PB = 0 [3] (WAITWR  WAITWEN + 3)  Tcy(clk)  2.8 (WAITWR  WAITWEN + 3)  Tcy(clk) 3.5 (WAITWR  WAITWEN + 3)  Tcy(clk)  5.0 ns tBLSHEOW BLS HIGH to end of write time WR11; PB = 0 [6][3] 3.3 + Tcy(clk) 4.4 + Tcy(clk) 6.1 + Tcy(clk) ns tBLSHDNV BLS HIGH to data invalid time WR12; PB = 0 [3] 3.4 + Tcy(clk) 4.8 + Tcy(clk) 6.6 + Tcy(clk) ns Table 15. Dynamic characteristics: Static external memory interface …continued CL = 30 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter[1] Conditions[1] Min Typ Max Unit Fig 19. External static memory read/write access (PB = 0) RD1 RD5 RD2 WR2 WR9 WR12 WR10 WR11 RD5 RD5 RD6 WR8 WR1 EOR EOW RD7 RD4 EMC_Ax EMC_CSx EMC_OE EMC_BLSx EMC_WE EMC_Dx 002aag214 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 97 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 20. External static memory read/write access (PB =1) RD1 WR1 EMC_Ax WR8 WR4 WR8 EMC_CSx RD2 RD7 RD7 RD4 EMC_OE EMC_BLSx EMC_WE RD5 WR2 WR6 RD5 RD5 RD5 RD6 RD3 EOR EOW EMC_Dx WR3 WR5 WR7 002aag215 Fig 21. External static memory burst read cycle RD5 RD5 RD5 RD5 EMC_Ax EMC_CSx EMC_OE EMC_BLSx EMC_WE EMC_Dx 002aag216 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 98 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] Refers to SDRAM clock signal EMC_CLKx. [2] CLKDLY = CLKOUTnDLY, where n = 0, 1. [3] The data input set-up time has to be selected with the following margin: tsu(D) + delay time of feedback clock  SDRAM access time  board delay time  0. [4] The data input hold time has to be selected with the following margin: th(D) + SDRAM access time  board delay time  delay time of feedback clock  0. Table 16. Dynamic characteristics: Dynamic external memory interface, read strategy bits (RD bits) = 00 CL = 30 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter Min Typ Max Unit Common to read and write cycles Tcy(clk) clock cycle time [1] 12.5 - - ns td(SV) chip select valid delay time [2] (CLKDLY + 1)  0.25 + 2.8 (CLKDLY + 1)  0.25 + 3.5 (CLKDLY + 1)  0.25 + 5.1 ns th(S) chip select hold time [2] (CLKDLY + 1)  0.25  1.0 (CLKDLY + 1)  0.25  1.1 (CLKDLY + 1)  0.25  1.5 ns td(RASV) row address strobe valid delay time [2] (CLKDLY + 1)  0.25 + 2.8 (CLKDLY + 1)  0.25 + 3.6 (CLKDLY + 1)  0.25 + 5.1 ns th(RAS) row address strobe hold time [2] (CLKDLY + 1)  0.25 0.8 (CLKDLY + 1)  0.25 0.9 (CLKDLY + 1)  0.25  1.0 ns td(CASV) column address strobe valid delay time [2] (CLKDLY + 1)  0.25 + 2.7 (CLKDLY + 1)  0.25 + 3.4 (CLKDLY + 1)  0.25 + 4.9 ns th(CAS) column address strobe hold time [2] (CLKDLY + 1)  0.25  0.8 (CLKDLY + 1)  0.25  1.0 (CLKDLY + 1)  0.25  1.2 ns td(WV) write valid delay time [2] (CLKDLY + 1)  0.25 + 3.2 (CLKDLY + 1)  0.25 + 4.1 (CLKDLY + 1)  0.25 + 6.0 ns th(W) write hold time [2] (CLKDLY + 1)  0.25  0.6 (CLKDLY + 1)  0.25  0.67 (CLKDLY + 1)  0.25  0.7 ns td(AV) address valid delay time [2] (CLKDLY + 1)  0.25 + 3.4 (CLKDLY + 1)  0.25 + 4.6 (CLKDLY + 1)  0.25 + 6.8 ns th(A) address hold time [2] (CLKDLY + 1)  0.25  1.1 (CLKDLY + 1)  0.25  1.4 (CLKDLY + 1)  0.25  1.8 ns Read cycle parameters tsu(D) data input set-up time [3] (FBCLKDLY + 1)  0.25 + 4.1 (FBCLKDLY + 1)  0.25 + 2.3 (FBCLKDLY + 1)  0.25  0.9 ns th(D) data input hold time [4] (FBCLKDLY + 1)  0.25 + 4.0 (FBCLKDLY + 1)  0.25 + 4.7 (FBCLKDLY + 1)  0.25 + 5.8 ns Write cycle parameters td(QV) data output valid delay time [2] (CLKDLY + 1)  0.25 + 3.9 (CLKDLY + 1)  0.25 + 5.4 (CLKDLY + 1)  0.25 + 7.8 ns th(Q) data output hold time [2] (CLKDLY + 1)  0.25  1.1 (CLKDLY + 1)  0.25  1.2 (CLKDLY + 1)  0.25  1.4 ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 99 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] Refers to SDRAM clock signal EMC_CLKx. [2] The data input set-up time has to be selected with the following margin: tsu(D) + delay time of feedback clock  SDRAM access time  board delay time  0. [3] The data input hold time has to be selected with the following margin: th(D) + SDRAM access time - board delay time - delay time of feedback clock  0. Table 17. Dynamic characteristics: Dynamic external memory interface, read strategy bits (RD bits) = 01 CL = 30 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter Min Typ Max Unit Common to read and write cycles Tcy(clk) clock cycle time [1] 12.5 - - ns td(SV) chip select valid delay time (CMDDLY + 1)  0.25 + 4.9 (CMDDLY + 1)  0.25 + 6.7 (CMDDLY + 1)  0.25 + 10.4 ns th(S) chip select hold time (CMDDLY + 1)  0.25 + 1.2 (CMDDLY + 1)  0.25 + 2.1 (CMDDLY + 1)  0.25 + 3.8 ns td(RASV) row address strobe valid delay time (CMDDLY + 1)  0.25 + 4.9 (CMDDLY + 1)  0.25 + 6.8 (CMDDLY + 1)  0.25 + 10.4 ns th(RAS) row address strobe hold time (CMDDLY + 1)  0.25 + 1.3 (CMDDLY + 1)  0.25 + 2.3 (CMDDLY + 1)  0.25 + 4.3 ns td(CASV) column address strobe valid delay time (CMDDLY + 1)  0.25 + 4.8 (CMDDLY + 1)  0.25 + 6.7 (CMDDLY + 1)  0.25 + 10.2 ns th(CAS) column address strobe hold time (CMDDLY + 1)  0.25 + 1.2 (CMDDLY + 1)  0.25 + 2.2 (CMDDLY + 1)  0.25 + 4.1 ns td(WV) write valid delay time (CMDDLY + 1)  0.25 + 5.1 (CMDDLY + 1)  0.25 + 7.1 (CMDDLY + 1)  0.25 + 10.9 ns th(W) write hold time (CMDDLY + 1)  0.25 + 1.5 (CMDDLY + 1)  0.25 + 2.6 (CMDDLY + 1)  0.25 + 4.8 ns td(AV) address valid delay time (CMDDLY + 1)  0.25 + 5.5 (CMDDLY + 1)  0.25 + 7.7 (CMDDLY + 1)  0.25 + 11.9 ns th(A) address hold time (CMDDLY + 1)  0.25 + 1.0 (CMDDLY + 1)  0.25 + 1.8 (CMDDLY + 1)  0.25 + 3.5 ns Read cycle parameters tsu(D) data input set-up time [2] (FBCLKDLY + 1)  0.25 + 4.1 (FBCLKDLY + 1)  0.25 + 2.3 (FBCLKDLY + 1)  0.25  0.9 ns th(D) data input hold time [3] (FBCLKDLY + 1)  0.25 + 4.0 (FBCLKDLY + 1)  0.25 + 4.7 (FBCLKDLY + 1)  0.25 + 5.8 ns Write cycle parameters td(QV) data output valid delay time (CMDDLY + 1)  0.25 + 5.9 (CMDDLY + 1)  0.25 + 8.7 (CMDDLY + 1)  0.25 + 13.1 ns th(Q) data output hold time (CMDDLY + 1)  0.25 + 1.0 (CMDDLY + 1)  0.25 + 2.0 (CMDDLY + 1)  0.25 + 3.9 ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 100 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] The programmable delay blocks are controlled by the EMCDLYCTL register in the EMC register block. All delay times are incremental delays for each element starting from delay block 0. See the LPC408x/7x user manual for details. Fig 22. Dynamic external memory interface signal timing 002aah129 EMC_CLKn Tcy(clk) delay = 0 EMC_DYCSn, EMC_RAS, EMC_CAS, EMC_WE, EMC_CKEOUTn, EMC_A[22:0], EMC_DQMOUTn th(Q) tsu(D) th(D) EMC_D[31:0] write EMC_D[31:0] read td(QV) td(xV) th(x) Table 18. Dynamic characteristics: Dynamic external memory interface programmable clock delays CL = 30 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V.Values guaranteed by design. Symbol Parameter Conditions Min Max Unit td delay time Programmable delay block 0 (CMDDLY or CLKOUTnDLY bit 0 = 1) [1] 0.1 0.2 ns Programmable delay block 1 (CMDDLY or CLKOUTnDLY bit 1 = 1) [1] 0.2 0.5 ns Programmable delay block 2 (CMDDLY or CLKOUTnDLY bit 2 = 1) [1] 0.5 1.3 ns Programmable delay block 3 (CMDDLY or CLKOUTnDLY bit 3 = 1) [1] 1.2 2.9 ns Programmable delay block 4 (CMDDLY or CLKOUTnDLY bit 4 = 1) [1] 2.4 6.0 ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 101 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.3 External clock [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 11.4 Internal oscillators [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 11.5 I/O pins [1] Applies to standard port pin. For details, see the LPC408x/7x IBIS model available on the NXP website. Table 19. Dynamic characteristic: external clock (see Figure 40) Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk) 0.4 - - ns tCLCX clock LOW time Tcy(clk) 0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns Fig 23. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) tCHCL tCLCX tCHCX Tcy(clk) tCLCH 002aaa907 Table 20. Dynamic characteristic: internal oscillators Tamb = 40 C to +85 C; 2.7 V  VDD(3V3)  3.6 V.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 11.88 12 12.12 MHz fi(RTC) RTC input frequency - - 32.768 - kHz Table 21. Dynamic characteristic: I/O pins[1] Tamb = 40 C to +85 C; VDD(3V3) over specified ranges. Symbol Parameter Conditions Min Typ Max Unit tr rise time pin configured as output 3.0 - 5.0 ns tf fall time pin configured as output 2.5 - 5.0 ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 102 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.6 SSP interface [1] The minimum clock cycle time, and therefore the maximum frequency of the SSP in master mode, is limited by the pin electronics to the value given. The SSP block should not be configured to generate a clock faster than that. At and below the maximum frequency, Tcy(clk) = (SSPCLKDIV  (1 + SCR)  CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the main clock frequency fmain, the SSP peripheral clock divider (SSPCLKDIV), the SSP SCR parameter (specified in the SSP0CR0 register), and the SSP CPSDVSR parameter (specified in the SSP clock prescale register). [2] Tamb = 40 C to 85 C; VDD(3V3) = 3.0 V to 3.6 V. [3] Tcy(clk) = 12  Tcy(PCLK). The maximum clock rate in slave mode is 1/12th of the PCLK rate. [4] Tamb = 25 C; VDD(3V3) = 3.3 V. Table 22. Dynamic characteristics: SSP pins in SPI mode CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter Conditions Min Max Unit SSP master Tcy(clk) clock cycle time full-duplex mode [1] 30 - ns when only transmitting 30 - ns tDS data set-up time in SPI mode [2] 14.8 - ns tDH data hold time in SPI mode [2] 2 - ns tv(Q) data output valid time in SPI mode [2] - 6.3 ns th(Q) data output hold time in SPI mode [2] 2.4 - ns SSP slave Tcy(clk) clock cycle time [3] 100 - ns tDS data set-up time in SPI mode [3][4] 14.8 - ns tDH data hold time in SPI mode [3][4] 2 - ns tv(Q) data output valid time in SPI mode [3][4] - 6.3 ns th(Q) data output hold time in SPI mode [3][4] 2.4 - ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 103 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 24. SSP master timing in SPI mode Fig 25. SSP slave timing in SPI mode SCK (CPOL = 0) MOSI MISO Tcy(clk) tDS tDH tv(Q) DATA VALID DATA VALID th(Q) SCK (CPOL = 1) DATA VALID DATA VALID MOSI MISO tDS tDH DATA VALID DATA VALID th(Q) DATA VALID DATA VALID tv(Q) CPHA = 1 CPHA = 0 002aae829 SCK (CPOL = 0) MOSI MISO Tcy(clk) tDS tDH tv(Q) DATA VALID DATA VALID th(Q) SCK (CPOL = 1) DATA VALID DATA VALID MOSI MISO tDS tDH tv(Q) DATA VALID DATA VALID th(Q) DATA VALID DATA VALID CPHA = 1 CPHA = 0 002aae830 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 104 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.7 I2C-bus [1] See the I2C-bus specification UM10204 for details. [2] Parameters are valid over operating temperature range unless otherwise specified. [3] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge. [4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. [5] Cb = total capacitance of one bus line in pF. [6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for this when considering bus timing. [8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or tVD;ACK by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock. [9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the acknowledge. [10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time. Table 23. Dynamic characteristic: I2C-bus pins[1] Tamb = 40 C to +85 C.[2] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 400 kHz Fast-mode Plus 0 1 MHz tf fall time [4][5][6][7] of both SDA and SCL signals Standard-mode - 300 ns Fast-mode 20 + 0.1  Cb 300 ns Fast-mode Plus - 120 ns tLOW LOW period of the SCL clock Standard-mode 4.7 - s Fast-mode 1.3 - s Fast-mode Plus 0.5 - s tHIGH HIGH period of the SCL clock Standard-mode 4.0 - s Fast-mode 0.6 - s Fast-mode Plus 0.26 - s tHD;DAT data hold time [3][4][8] Standard-mode 0 - s Fast-mode 0 - s Fast-mode Plus 0 - s tSU;DAT data set-up time [9][10] Standard-mode 250 - ns Fast-mode 100 - ns Fast-mode Plus 50 - ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 105 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.8 I2S-bus interface [1] CCLK = 100 MHz; peripheral clock to the I2S-bus interface PCLK = CCLK / 4. I2S clock cycle time Tcy(clk) = 1600 ns, corresponds to the SCK signal in the I2S-bus specification. Fig 26. I2C-bus pins clock timing 002aaf425 tf 70 % SDA 30 % tf 70 % 30 % S 70 % 30 % 70 % 30 % tHD;DAT SCL 1 / fSCL 70 % 30 % 70 % 30 % tVD;DAT tHIGH tLOW tSU;DAT Table 24. Dynamic characteristics: I2S-bus interface pins CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter Conditions Min Max Unit common to input and output tr rise time [1] - 6.7 ns tf fall time [1] - 8.0 ns tWH pulse width HIGH on pins I2S_TX_SCK and I2S_RX_SCK [1] 25 - - tWL pulse width LOW on pins I2S_TX_SCK and I2S_RX_SCK [1] - 25 ns output tv(Q) data output valid time on pin I2S_TX_SDA; [1] - 6 ns input tsu(D) data input set-up time on pin I2S_RX_SDA [1] 5 - ns th(D) data input hold time on pin I2S_RX_SDA [1] 2 - ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 106 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.9 LCD Remark: The LCD controller is available on parts LPC4088. Fig 27. I2S-bus timing (transmit) Fig 28. I2S-bus timing (receive) 002aag202 I2S_TX_SCK I2S_TX_SDA I2S_TX_WS Tcy(clk) tf tr tWH tWL tv(Q) tv(Q) 002aag203 Tcy(clk) tf tr tWH tsu(D) th(D) tsu(D) tsu(D) tWL I2S_RX_SCK I2S_RX_SDA I2S_RX_WS Table 25. Dynamic characteristics: LCD CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter Conditions Min Max Unit fclk clock frequency on pin LCD_DCLK - 50 MHz td(QV) data output valid delay time - 12 ns th(Q) data output hold time 0.5 - ns LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 107 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.10 SD/MMC Remark: The SD/MMC card interface is available on parts LPC4088/78/76. The LCD panel clock is shown with the default polarity. The clock can be inverted via the IPC bit in the LCD_POL register. Typically, the LCD panel uses the falling edge of the LCD_DCLK to sample the data. Fig 29. LCD timing 002aah325 LCD_DCLK td(QV) Tcy(clk) th(Q) LCD_VD[n] Table 26. Dynamic characteristics: SD/MMC CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design. Symbol Parameter Conditions Min Max Unit fclk clock frequency on pin SD_CLK; data transfer mode - 25 MHz on pin SD_CLK; identification mode 25 MHz tsu(D) data input set-up time on pins SD_CMD, SD_DAT[3:0] as inputs 6 - ns th(D) data input hold time on pins SD_CMD, SD_DAT[3:0] as inputs 6 - ns td(QV) data output valid delay time on pins SD_CMD, SD_DAT[3:0] as outputs - 23 ns th(Q) data output hold time on pins SD_CMD, SD_DAT[3:0] as outputs 3.5 - ns Fig 30. SD/MMC timing 002aag204 SD_CLK SD_DATn (O) SD_DATn (I) td(QV) tsu(D) th(D) Tcy(clk) th(Q) SD_CMD (O) SD_CMD (I) LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 108 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 11.11 SPIFI 12. Characteristics of the analog peripherals 12.1 ADC electrical characteristics Table 27. Dynamic characteristics: SPIFI Tamb = 40 C to 85 C; 3.0 V  VDD(3V3)  3.6 V; CL = 30 pF. Values guaranteed by design. Symbol Parameter Min Max Unit Tcy(clk) clock cycle time 11.8 - ns tDS data set-up time 4.8 - ns tDH data hold time 0 - ns tv(Q) data output valid time - 8.8 ns th(Q) data output hold time 3 - ns Fig 31. SPIFI timing SPIFI_SCK SPIFI data out SPIFI data in Tcy(clk) tDS tDH tv(Q) DATA VALID DATA VALID th(Q) DATA VALID DATA VALID 002aah409 Table 28. 12-bit ADC characteristics VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDDA V 12-bit resolution; 400 kSamples/sec ED differential linearity error [2][3][4] - - 1 LSB EL(adj) integral non-linearity [2][5] - - 6 LSB EO offset error [2][6] - - 5 LSB EG gain error [2][7] - - 5 LSB ET absolute error [2][8]- - <8 LSB fclk(ADC) ADC clock frequency - - 12.4 MHz fc(ADC) ADC conversion frequency [9]- - 400 kHz LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 109 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used. [2] Conditions: VSSA = 0 V, VDDA = 3.3 V. [3] The ADC is monotonic, there are no missing codes. [4] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 32. [5] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 32. [6] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 32. [7] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 32. [8] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 32. [9] In single-conversion mode. [10] See Figure 33. [11] 8-bit resolution is achieved by ignoring the lower four bits of the ADC conversion result. Cia analog input capacitance - - 5 pF Rvsi voltage source interface resistance [10]- - 1 k 8-bit resolution[11]; 1.16 MSamples/sec ED differential linearity error [2][3][4] - 1 - LSB EL(adj) integral non-linearity [2][5] - 1 - LSB EO offset error [2][6] - 1 - LSB EG gain error [2][7] - 1 - LSB ET absolute error [2][8]- - <1.5 LSB fclk(ADC) ADC clock frequency - - 36 MHz fc(ADC) ADC conversion frequency [9]- - 1.16 MHz Cia analog input capacitance - - 5 pF Rvsi voltage source interface resistance [10]- - 1 k Table 28. 12-bit ADC characteristics …continued VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 110 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 32. 12-bit ADC characteristics 002aaf436 4095 4094 4093 4092 4091 (2) (1) 1 2 3 4 5 6 7 4090 4091 4092 4093 4094 4095 4096 7 6 5 4 3 2 1 0 4090 (5) (4) (3) 1 LSB (ideal) code out VREF P - VSS 4096 offset error EO gain error EG offset error EO VIA (LSBideal) 1 LSB = LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 111 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 12.2 DAC electrical characteristics The values of resistor components Rcmp and Rsw vary with temperature and input voltage and are process-dependent. Fig 33. ADC interface to pins ADC0_IN[n] Table 29. ADC interface components Component Range Description Rcmp 90  to 300  Switch-on resistance for the comparator input switch. Varies with temperature, input voltage, and process. Rsw 500  to 2 k Switch-on resistance for channel selection switch. Varies with temperature, input voltage, and process. C1 110 fF Parasitic capacitance from the ADC block level. C2 80 fF Parasitic capacitance from the ADC block level. C3 1.6 pF Sampling capacitor. LPC408x/7x AD0[n] 110 fF 80 fF Cia 1.6 pF Rvsi Rsw 500 Ω - 2 kΩ Rcmp 90 Ω - 300 Ω VSS VEXT 002aah275 ADC COMPARATOR BLOCK C1 C3 C2 Table 30. 10-bit DAC electrical characteristics VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit ED differential linearity error - 1 - LSB EL(adj) integral non-linearity - 1.5 - LSB EO offset error - 0.6 - % EG gain error - 0.6 - % CL load capacitance - - 200 pF RL load resistance 1 - - k LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 112 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 12.3 Comparator electrical characteristics [1] CL = 10 pF; results from measurements on silicon samples over process corners and over the full temperature range Tamb = -40 C to +85 C. [2] Input hysteresis is relative to the reference input channel and is software programmable. Table 31. Comparator characteristics VDDA= 3.0 V and Tamb = 25 C unless noted otherwise. Symbol Parameter Conditions Min Typ Max Unit Static characteristics IDD supply current - 55 - A VIC common-mode input voltage 0 - VDDA V DVO output voltage variation 0 - VDDA V Voffset offset voltage VIC = 0.1 V - 4 to +4.2 - mV VIC = 1.5 V - 2 - mV VIC = 2.8 V - 2.5 mV Dynamic characteristics tstartup start-up time nominal process - 4 - s tPD propagation delay HIGH to LOW; VDDA = 3.3 V; VIC = 0.1 V; 50 mV overdrive input [1] 122 130 142 ns VIC = 0.1 V; rail-to-rail input [1] 173 189 233 ns VIC = 1.5 V; 50 mV overdrive input [1] 101 108 119 ns VIC = 1.5 V; rail-to-rail input [1] 114 127 162 ns VIC = 2.9 V; 50 mV overdrive input [1] 123 134 143 ns VIC = 2.9 V; rail-to-rail input [1] 79 91 120 ns tPD propagation delay LOW to HIGH; VDDA = 3.3 V; VIC = 0.1 V; 50 mV overdrive input [1] 221 232 254 ns VIC = 0.1 V; rail-to-rail input [1] 59 63 68 ns VIC = 1.5 V; 50 mV overdrive input [1] 183 229 249 ns VIC = 1.5 V; rail-to-rail input [1] 147 174 213 ns VIC = 2.9 V; 50 mV overdrive input [1] 171 192 216 ns VIC = 2.9 V; rail-to-rail input [1] 235 305 450 ns Vhys hysteresis voltage positive hysteresis; VDDA = 3.0 V; VIC = 1.5 V [2] - 5, 10, 20 - mV Vhys hysteresis voltage negative hysteresis; VDDA = 3.0 V; VIC = 1.5 V [2] - 5, 10, 20 - mV Rlad ladder resistance - - 1.034 - M LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 113 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller [1] Maximum values are derived from worst case simulation (VDDA = 2.6 V; Tamb = 85 C; slow process models). [2] Settling time applies to switching between comparator and ADC channels. [1] Measured on typical silicon samples with a 2 kHz input signal and overdrive < 100 V. Power switched off to all analog peripherals except the comparator. Table 32. Comparator voltage ladder dynamic characteristics Symbol Parameter Conditions Min Typ Max Unit ts(pu) power-up settling time to 99% of voltage ladder output value [1]- - 30 s ts(sw) switching settling time to 99% of voltage ladder output value [1] [2] - - 15 s Table 33. Comparator voltage ladder reference static characteristics VDDA = 3.3 V; Tamb = -40 C to + 85C. Symbol Parameter Conditions Min Typ Max[1] Unit EV(O) output voltage error Internal VDDA supply decimal code = 00 0 0 0 % decimal code = 08 0.45 0.5 0.55 % decimal code = 16 0.99 1.1 1.21 % decimal code = 24 1.26 1.4 1.54 % decimal code = 30 1.35 1.5 1.65 % decimal code = 31 1.35 1.5 1.65 % EV(O) output voltage error External VDDCMP supply decimal code = 00 0 0 0 % decimal code = 08 0.44 0.4 0.36 % decimal code = 16 0.18 0.2 0.22 % decimal code = 24 0.45 0.5 0.55 % decimal code = 30 0.54 0.6 0.66 % decimal code = 31 0.45 0.5 0.55 % LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 114 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 13. Application information 13.1 Suggested USB interface solutions Remark: The USB controller is available as a device/Host/OTG controller on parts LPC4088 and LPC4078/76 and as device-only controller on parts LPC4074/72. Fig 34. USB interface on a self-powered device LPC40xx USB-B connector USB_D+ USB_CONNECT SoftConnect switch USB_DVBUS VSS VDD(3V3) R1 1.5 kΩ RS = 33 Ω 002aah267 RS = 33 Ω USB_UP_LED Fig 35. USB interface on a bus-powered device LPC40xx VDD(3V3) R1 1.5 kΩ R2 USB_UP_LED 002aah268 USB-B connector USB_D+ USB_DVBUS VSS RS = 33 Ω RS = 33 Ω LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 115 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 36. USB OTG port configuration: port 1 OTG dual-role device, port 2 host USB_UP_LED1 USB_D+1 USB_D-1 USB_PWRD2 USB_SDA1 USB_SCL1 RSTOUT 15 kΩ 15 kΩ LPC408x/7x USB-A connector Mini-AB connector 33 Ω 33 Ω 33 Ω 33 Ω VDD VDD VDD USB_UP_LED2 VDD USB_OVRCR2 LM3526-L ENA IN 5 V OUTA FLAGA VDD D+ DVBUS USB_PPWR2 USB_D+2 USB_D-2 002aah269 R7 R4 R5 R6 R1 R2 R3 R4 R8 USB_INT1 RESET_N ADR/PSW SPEED SUSPEND OE_N/INT_N SCL SDA INT_N VBUS ID DP DM ISP1302 VSSIO, VSSCORE VSSIO, VSSCORE LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 116 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 37. USB OTG port configuration: VP_VM mode USB_TX_DP1 USB_TX_DM1 USB_RCV1 USB_RX_DP1 USB_RX_DM1 USB_SCL1 USB_SDA1 SPEED ADR/PSW SDA SCL RESET_N INT_N VP VM SUSPEND OE_N/INT_N SE0_VM DAT_VP RCV VBUS ID DP DM LPC408x/7x ISP1302 USB MINI-AB connector 33 Ω 33 Ω 002aah270 USB_TX_E1 RSTOUT VDD VDD USB_INT1 USB_UP_LED1 VDD VSSIO, VSSCORE LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 117 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 38. USB host port configuration: port 1 and port 2 as hosts USB_UP_LED1 USB_D+1 USB_D-1 USB_PWRD1 USB_PWRD2 15 kΩ 15 kΩ 15 kΩ 15 kΩ LPC408x/7x USB-A connector USB-A connector 33 Ω 33 Ω 33 Ω 33 Ω 002aah271 VDD USB_UP_LED2 VDD USB_OVRCR1 USB_OVRCR2 USB_PPWR1 LM3526-L ENA ENB IN 5 V FLAGA OUTA OUTB FLAGB VDD VDD D+ DD+ DVBUS VBUS USB_PPWR2 USB_D+2 USB_D-2 VSSIO, VSSCORE VSSIO, VSSCORE LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 118 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 13.2 Crystal oscillator XTAL input and component selection The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave mode, a minimum of 200 mV(RMS) is needed. Fig 39. USB device port configuration: port 1 host and port 2 device USB_UP_LED1 USB_D+1 USB_D-1 USB_PWRD1 15 kΩ 15 kΩ LPC408x/7x USB-A connector USB-B connector 33 Ω 33 Ω 33 Ω 33 Ω 002aah272 VDD USB_UP_LED2 USB_CONNECT2 VDD VDD USB_OVRCR1 USB_PPWR1 LM3526-L ENA IN 5 V FLAGA OUTA VDD D+ DD+ DVBUS USB_D+2 USB_D-2 VBUS VBUS VSSIO, VSSCORE VSSIO, VSSCORE Fig 40. Slave mode operation of the on-chip oscillator LPC40xx XTAL1 Ci 100 pF Cg 002aah273 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 119 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 40), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 41 and in Table 34 and Table 35. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (the fundamental frequency is represented by L, CL and RS). Capacitance CP in Figure 41 represents the parallel package capacitance and should not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal manufacturer. Fig 41. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 34. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1/CX2 1 MHz to 5 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 300  39 pF, 39 pF 30 pF < 300  57 pF, 57 pF 5 MHz to 10 MHz 10 pF < 300  18 pF, 18 pF 20 pF < 200  39 pF, 39 pF 30 pF < 100  57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 60  39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80  18 pF, 18 pF 002aah274 LPC40xx XTALIN XTALOUT CX1 CX2 XTAL = CL CP RS L LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 120 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 13.3 XTAL Printed-Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plane. Loops must be made as small as possible in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Smaller values of Cx1 and Cx2 should be chosen according to the increase in parasitics of the PCB layout. 13.4 Standard I/O pin configuration Figure 42 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver: Open-drain mode enabled/disabled • Digital input: Pull-up enabled/disabled • Digital input: Pull-down enabled/disabled • Digital input: Repeater mode enabled/disabled • Analog input The default configuration for standard I/O pins is input with pull-up enabled. The weak MOS devices provide a drive capability equivalent to pull-up and pull-down resistors. Table 35. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180  18 pF, 18 pF 20 pF < 100  39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160  18 pF, 18 pF 20 pF < 80  39 pF, 39 pF LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 121 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 13.5 Reset pin configuration 13.6 Reset pin configuration for RTC operation Under certain circumstances, the RTC may temporarily pause and lose fractions of a second during the rising and falling edges of the RESET signal. Fig 42. Standard I/O pin configuration with analog input PIN VDD VDD ESD VSS ESD strong pull-up strong pull-down VDD weak pull-up weak pull-down open-drain enable output enable repeater mode enable pull-up enable pull-down enable data output data input analog input select analog input 002aaf272 pin configured as digital output driver pin configured as digital input pin configured as analog input Fig 43. Reset pin configuration VSS reset 002aaf274 VDD VDD VDD Rpu ESD ESD 20 ns RC GLITCH FILTER PIN LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 122 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller To eliminate the loss of time counts in the RTC due to voltage swing or ramp rate of the RESET signal, connect an RC filter between the RESET pin and the external reset input. Fig 44. Reset input with RC filter 002aag552 External RESET input 10 kΩ 0.1 μF RESET pin LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 123 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 14. Package outline Fig 45. Package outline SOT459-1 (LQFP208) UNIT A1 A2 A3 bp c E(1) e HE L Lp v w y Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 28.1 27.9 0.5 30.15 29.85 1.43 1.08 7 0 o 1 0.12 0.08 0.08 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT459-1 136E30 MS-026 00-02-06 03-02-20 D(1) 28.1 27.9 HD 30.15 29.85 Z E 1.43 1.08 D pin 1 index e bp θ E A A1 Lp detail X L (A 3 ) B 52 c HD bp HE A2 v M B D ZD A ZE e v M A X 1 208 157 156 105 104 53 y w M w M 0 5 10 mm scale LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 A max. 1.6 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 124 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 46. Package outline SOT950-1 (TFBGA208) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT950-1 - - - SOT950-1 06-06-01 06-06-14 UNIT A max mm 1.2 0.4 0.3 0.8 0.6 15.1 14.9 15.1 14.9 0.8 12.8 0.15 0.08 0.1 A1 DIMENSIONS (mm are the original dimensions) TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm 0 5 10 mm scale A2 b 0.5 0.4 D E e e1 e2 12.8 v w y 0.12 y1 C y1 C y X b ball A1 index area e2 e1 e e ∅ v M C A B ∅ w M C A B C D E F H K G L J M N P R U T 2 4 6 8 10 12 14 16 1 3 5 7 9 11 13 15 17 ball A1 index area D B A E detail X A A2 A1 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 125 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 47. Package outline SOT570-3 (TFBGA180) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT570-3 SOT570-3 08-07-09 10-04-15 UNIT mm max nom min 1.20 1.06 0.95 0.40 0.35 0.30 0.50 0.45 0.40 12.1 12.0 11.9 12.1 12.0 11.9 0.8 10.4 0.15 0.12 A DIMENSIONS (mm are the original dimensions) TFBGA180: thin fine-pitch ball grid array package; 180 balls 0 5 10 mm scale A1 A2 0.80 0.71 0.65 b D E e e1 10.4 e2 v w 0.05 y y1 0.1 ball A1 index area D B A E C y1 C y X A B C D E F H K G L J M N P 2 4 6 8 10 12 14 1 3 5 7 9 11 13 b e2 e1 e e 1/2 e 1/2 e ∅ v M C A B ∅ w M C ball A1 index area detail X A A2 A1 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 126 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 48. Package outline SOT486-1 (LQFP144) UNIT A1 A2 A3 bp c E(1) e HE L Lp v w y Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 0.5 22.15 21.85 1.4 1.1 7 0 o 1 0.2 0.08 0.08 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT486-1 136E23 MS-026 00-03-14 03-02-20 D(1) (1) (1) 20.1 19.9 HD 22.15 21.85 Z E 1.4 1.1 D 0 5 10 mm scale e bp θ E A1 A Lp detail X L (A 3 ) B c bp HE A2 HD v M B D ZD A ZE e v M A X y w M w M A max. 1.6 LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 108 109 pin 1 index 73 72 37 1 144 36 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 127 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 49. Package outline SOT407-1 (LQFP100) UNIT A max. A1 A2 A3 bp c E(1) e HE L Lp v w y Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 0.5 16.25 15.75 1.15 0.85 7 0 o 1 0.2 0.08 0.08 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT407-1 136E20 MS-026 00-02-01 03-02-20 D(1) (1) (1) 14.1 13.9 HD 16.25 15.75 Z E 1.15 0.85 D bp e θ E A1 A Lp detail X L (A 3 ) B 25 c HD bp HE A2 v M B D ZD A ZE e v M A X 1 100 76 75 51 50 26 y pin 1 index w M w M 0 5 10 mm scale LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 128 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 50. Package outline SOT315-1 (LQFP80) UNIT A max. A1 A2 A3 bp c E(1) e HE L Lp v w y Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.6 0.16 0.04 1.5 1.3 0.25 0.27 0.13 0.18 0.12 12.1 11.9 0.5 14.15 13.85 1.45 1.05 7 0 o 1 0.2 0.15 0.1 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.30 SOT315-1 136E15 MS-026 00-01-19 03-02-25 D(1) (1) (1) 12.1 11.9 HD 14.15 13.85 Z E 1.45 1.05 D bp e θ E A1 A Lp detail X L (A 3 ) B 20 c HD bp HE A2 v M B D ZD A ZE e v M A X 1 80 61 60 41 40 21 y pin 1 index w M w M 0 5 10 mm scale LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 129 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 51. Package outline SOT1328-1 (TFBGA80) Outline References version European projection Issue date IEC JEDEC JEITA SOT1328-1 sot1328-1_po 12-05-07 12-06-14 Unit mm max nom min 1.15 1.00 0.90 0.35 0.30 0.25 0.45 0.40 0.35 7.1 7.0 6.9 7.1 7.0 6.9 0.65 5.85 0.15 0.08 A Dimensions (mm are the original dimensions) TFBGA80: plastic thin fine-pitch ball grid array package; 80 balls SOT1328-1 A1 A2 0.80 0.70 0.65 b D E e e1 5.85 e2 v w 0.05 y y1 0.1 0 5 mm scale ball A1 index area ball A1 index area D B A E detail X A A1 A2 C y1 C y X e2 e 1/2 e b e1 e 1/2 e Ø v C A B Ø w C 1 2 3 4 5 6 7 8 9 10 K J H G F E D C B A LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 130 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 15. Soldering Fig 52. Reflow soldering of the LQFP208 package SOT459-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP208 package Ax Bx Gx Hy Gy Hx By Ay P2 P1 D2 (8×) D1 (0.125) P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy sot459-1_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 0.500 0.560 31.300 31.300 28.300 28.300 1.500 0.280 0.400 28.500 28.500 31.550 31.550 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 131 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 53. Reflow soldering of the TFBGA180 package DIMENSIONS in mm P SL SP SR Hx Hy Hx Hy SOT570-3 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA180 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot570-3_fr 0.80 0.400 0.400 0.550 12.575 12.575 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 132 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 54. Reflow soldering of the LQFP144 package SOT486-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP144 package Ax Bx Gx Hy Gy Hx By Ay P2 P1 D2 (8×) D1 (0.125) P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy sot486-1_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 0.500 0.560 23.300 23.300 20.300 20.300 1.500 0.280 0.400 20.500 20.500 23.550 23.550 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 133 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 55. Reflow soldering of the LQFP100 package SOT407-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP100 package Ax Bx Gx Hy Gy Hx By Ay P2 P1 D2 (8×) D1 (0.125) P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy sot407-1 solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 0.500 0.560 17.300 17.300 14.300 14.300 1.500 0.280 0.400 14.500 14.500 17.550 17.550 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 134 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 56. Reflow soldering of the LQFP80 package SOT315-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP80 package Ax Bx Gx Hy Gy Hx By Ay P2 P1 D2 (8×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy 15.300 15.300 12.300 12.300 P1 0.500 P2 0.560 0.280 C 1.500 0.400 12.500 12.500 15.550 15.550 sot315-1_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 135 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 16. Abbreviations Table 36. Abbreviations Acronym Description ADC Analog-to-Digital Converter AHB Advanced High-performance Bus AMBA Advanced Microcontroller Bus Architecture APB Advanced Peripheral Bus BOD BrownOut Detection CAN Controller Area Network DAC Digital-to-Analog Converter DMA Direct Memory Access EOP End Of Packet ETM Embedded Trace Macrocell GPIO General Purpose Input/Output GPS Global Positioning System HVAC Heating, Venting, and Air Conditioning IRC Internal RC IrDA Infrared Data Association JTAG Joint Test Action Group MAC Media Access Control MIIM Media Independent Interface Management OHCI Open Host Controller Interface OTG On-The-Go PHY Physical Layer PLC Programmable Logic Controller PLL Phase-Locked Loop PWM Pulse Width Modulator RMII Reduced Media Independent Interface SE0 Single Ended Zero SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port TCM Tightly Coupled Memory TTL Transistor-Transistor Logic UART Universal Asynchronous Receiver/Transmitter USB Universal Serial Bus LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 136 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 17. Revision history Table 37. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC408X_7X v.3 20140501 Product data sheet - LPC408X_7X v.2 • Added TFBGA80 to features list. • Added Section 11.11 “SPIFI”. • Table 3: – Added function SSP2_SCK to pin P5[2]. – Added function SSP2_SSEL to pin P5[3]. – Updated pin description of STCLK. – 5 ns glitch filter changed to 10 ns for EINTx pins. – LQFP80 pin 12 changed from P2[30] to DNC. • Table 11: Added Table note 3 “VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used.”. • Table 28: Added Table note 1 “VDDA and VREFP should be tied to VDD(3V3) if the ADC and DAC are not used.”. • Section 7.37.2 “Brownout detection”: Updated BOD interrupt and reset values. • Table 15: Added typical specs. • Table 16: – Added typical specs – Removed “All programmable delays EMCDLYCTL are bypassed” from table title. • Table 17: – Added typical specs – Removed “All programmable delays EMCDLYCTL are bypassed” from table title. • Table note 9 added in Table 28 “12-bit ADC characteristics”. LPC408X_7X v.2 20130703 Product data sheet - LPC408X_7X v.1.1 • Added LQFP100 and TFBGA80. • Table 3: – Removed overbar from NMI. – Added minimum reset pulse width of 50 ns to RESET pin. – Updated Table note 14 for RTCX pins (32 kHz crystal must be used to operate RTC). – Added boundary scan information to description for RESET pin. • Table 11: – Updated typ numbers for IDD(REG)(3V3) and IBAT. – Added max values for deep sleep, power down, and deep PD for IBAT. • Table 15, Table note 3: Changed Tcy(clk) = 1/CCLK to Tcy(clk) = 1/EMC_CLK. • Table 21: Removed reference to RESET pin from Table note 1. • Table 22: – Removed Tcy(PCLK) spec; already given by the maximum chip frequency. – Changed min clock cyle time for SSP slave from 120 to 100. – Updated Table note 1 and Table note 3. • Section 7.24.1 “Features”: Changed max speed for SSP master from 60 to 33. • Updated EMC timing specs to CL = 30 pF in Table 15, Table 16, Table 17, and Table 18. • SOT570-2 obsolete; replaced with SOT570-3. LPC408X_7X v.1.1 20121114 Product data sheet - LPC408X_7X v.1 LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 137 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Modifications: • Changed data sheet status to Product. LPC408X_7X v.1 20120917 Objective data sheet - - Table 37. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 138 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 18. Legal information 18.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 139 of 141 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP Semiconductors N.V. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 1 May 2014 140 of 141 continued >> NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 5 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 8 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Functional description . . . . . . . . . . . . . . . . . . 52 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 52 7.2 ARM Cortex-M4 processor . . . . . . . . . . . . . . . 52 7.3 ARM Cortex-M4 Floating Point Unit (FPU). . . 52 7.4 On-chip flash program memory . . . . . . . . . . . 52 7.5 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 7.6 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 52 7.7 Memory Protection Unit (MPU). . . . . . . . . . . . 53 7.8 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 53 7.9 Nested Vectored Interrupt Controller (NVIC) . 56 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 7.9.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 56 7.10 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 56 7.11 External Memory Controller (EMC). . . . . . . . . 56 7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 7.12 General purpose DMA controller . . . . . . . . . . 58 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.13 CRC engine . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.14 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 59 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.15 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.16 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 61 7.16.1 USB device controller . . . . . . . . . . . . . . . . . . . 61 7.16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 7.16.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 62 7.16.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 7.16.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 62 7.16.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 7.17 SD/MMC card interface . . . . . . . . . . . . . . . . . 62 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 7.18 Fast general purpose parallel I/O . . . . . . . . . . 63 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 7.19 12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 7.20 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 7.20.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 7.21 Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . . 64 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 7.22 UART0/1/2/3 and USART4 . . . . . . . . . . . . . . 65 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 7.23 SPIFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 7.24 SSP serial I/O controller. . . . . . . . . . . . . . . . . 66 7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 7.25 I2C-bus serial I/O controllers . . . . . . . . . . . . . 66 7.25.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 7.26 I2S-bus serial I/O controllers . . . . . . . . . . . . . 67 7.26.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 7.27 CAN controller and acceptance filters . . . . . . 67 7.27.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.28 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.28.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.29 Pulse Width Modulator (PWM). . . . . . . . . . . . 69 7.29.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 7.30 Motor control PWM . . . . . . . . . . . . . . . . . . . . 70 7.31 Quadrature Encoder Interface (QEI) . . . . . . . 70 7.31.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 7.32 ARM Cortex-M4 system tick timer . . . . . . . . . 71 7.33 Windowed WatchDog Timer (WWDT) . . . . . . 71 7.33.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 7.34 RTC and backup registers . . . . . . . . . . . . . . . 72 7.34.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 7.35 Event monitor/recorder . . . . . . . . . . . . . . . . . 72 7.35.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 7.36 Clocking and power control . . . . . . . . . . . . . . 73 7.36.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 73 7.36.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 74 7.36.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 74 7.36.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 74 7.36.1.4 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 74 7.36.2 Main PLL (PLL0) and Alternate PLL (PLL1) . 74 7.36.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 75 7.36.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 75 7.36.4.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 76 7.36.4.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 76 7.36.4.3 Power-down mode. . . . . . . . . . . . . . . . . . . . . 77 7.36.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 77 7.36.4.5 Wake-up Interrupt Controller (WIC) . . . . . . . . 77 7.36.5 Peripheral power control . . . . . . . . . . . . . . . . 78 7.36.6 Power domains . . . . . . . . . . . . . . . . . . . . . . . 78 7.37 System control . . . . . . . . . . . . . . . . . . . . . . . . 79 7.37.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.37.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 80 7.37.3 Code security (Code Read Protection - CRP) 80 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 May 2014 Document identifier: LPC408X_7X Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 7.37.4 APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.37.5 AHB multilayer matrix . . . . . . . . . . . . . . . . . . . 81 7.37.6 External interrupt inputs . . . . . . . . . . . . . . . . . 81 7.37.7 Memory mapping control . . . . . . . . . . . . . . . . 81 7.38 Debug control . . . . . . . . . . . . . . . . . . . . . . . . . 81 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 81 9 Thermal characteristics . . . . . . . . . . . . . . . . . 83 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 85 10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 88 10.2 Peripheral power consumption . . . . . . . . . . . . 90 10.3 Electrical pin characteristics . . . . . . . . . . . . . . 92 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 94 11.1 Flash memory. . . . . . . . . . . . . . . . . . . . . . . . . 94 11.2 External memory interface . . . . . . . . . . . . . . . 95 11.3 External clock . . . . . . . . . . . . . . . . . . . . . . . . 101 11.4 Internal oscillators. . . . . . . . . . . . . . . . . . . . . 101 11.5 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 11.6 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . 102 11.7 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 11.8 I2S-bus interface . . . . . . . . . . . . . . . . . . . . . . 105 11.9 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 11.10 SD/MMC. . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 11.11 SPIFI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 12 Characteristics of the analog peripherals . . 108 12.1 ADC electrical characteristics . . . . . . . . . . . . 108 12.2 DAC electrical characteristics . . . . . . . . . . . 111 12.3 Comparator electrical characteristics . . . . . . 112 13 Application information. . . . . . . . . . . . . . . . . 114 13.1 Suggested USB interface solutions . . . . . . . 114 13.2 Crystal oscillator XTAL input and component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 13.3 XTAL Printed-Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 13.4 Standard I/O pin configuration . . . . . . . . . . . 120 13.5 Reset pin configuration. . . . . . . . . . . . . . . . . 121 13.6 Reset pin configuration for RTC operation . . 121 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . 123 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . 135 17 Revision history. . . . . . . . . . . . . . . . . . . . . . . 136 18 Legal information. . . . . . . . . . . . . . . . . . . . . . 138 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 138 18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . 138 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 138 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 139 19 Contact information. . . . . . . . . . . . . . . . . . . . 139 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 1. Introduction This document describes the functionality and electrical specifications of the transceiver IC PN512. The PN512 is a highly integrated transceiver IC for contactless communication at 13.56 MHz. This transceiver IC utilizes an outstanding modulation and demodulation concept completely integrated for different kinds of contactless communication methods and protocols at 13.56 MHz. 1.1 Different available versions The PN512 is available in three versions: • PN5120A0HN1/C2 (HVQFN32), PN5120A0HN/C2 (HVQFN40) and PN5120A0ET/C2 (TFBGA64), hereafter named as version 2.0 • PN512AA0HN1/C2 (HVQFN32) and PN512AA0HN1/C2BI (HVQFN32 with Burn In), hereafter named as industrial version, fulfilling the automotive qualification stated in AEC-Q100 grade 3 from the Automotive Electronics Council, defining the critical stress test qualification for automotive integrated circuits (ICs). • PN5120A0HN1/C1(HVQFN32) and PN5120A0HN/C1 (HVQFN40), hereafter named as version 1.0 The data sheet describes the functionality for the industrial version and version 2.0. The differences of the version 1.0 to the version 2.0 are summarized in Section 21. The industrial version has only differences within the outlined characteristics and limitations. 2. General description The PN512 transceiver ICs support 4 different operating modes • Reader/Writer mode supporting ISO/IEC 14443A/MIFARE and FeliCa scheme • Reader/Writer mode supporting ISO/IEC 14443B • Card Operation mode supporting ISO/IEC 14443A/MIFARE and FeliCa scheme • NFCIP-1 mode Enabled in Reader/Writer mode for ISO/IEC 14443A/MIFARE, the PN512’s internal transmitter part is able to drive a reader/writer antenna designed to communicate with ISO/IEC 14443A/ MIFARE cards and transponders without additional active circuitry. The receiver part provides a robust and efficient implementation of a demodulation and PN512 Full NFC Forum compliant solution Rev. 4.5 — 17 December 2013 111345 Product data sheet COMPANY PUBLIC PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 2 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution decoding circuitry for signals from ISO/IEC 14443A/MIFARE compatible cards and transponders. The digital part handles the complete ISO/IEC 14443A framing and error detection (Parity & CRC). The PN512 supports MIFARE 1K or MIFARE 4K emulation products. The PN512 supports contactless communication using MIFARE higher transfer speeds up to 424 kbit/s in both directions. Enabled in Reader/Writer mode for FeliCa, the PN512 transceiver IC supports the FeliCa communication scheme. The receiver part provides a robust and efficient implementation of the demodulation and decoding circuitry for FeliCa coded signals. The digital part handles the FeliCa framing and error detection like CRC. The PN512 supports contactless communication using FeliCa Higher transfer speeds up to 424 kbit/s in both directions. The PN512 supports all layers of the ISO/IEC 14443B reader/writer communication scheme, given correct implementation of additional components, like oscillator, power supply, coil etc. and provided that standardized protocols, e.g. like ISO/IEC 14443-4 and/or ISO/IEC 14443B anticollision are correctly implemented. In Card Operation mode, the PN512 transceiver IC is able to answer to a reader/writer command either according to the FeliCa or ISO/IEC 14443A/MIFARE card interface scheme. The PN512 generates the digital load modulated signals and in addition with an external circuit the answer can be sent back to the reader/writer. A complete card functionality is only possible in combination with a secure IC using the S2C interface. Additionally, the PN512 transceiver IC offers the possibility to communicate directly to an NFCIP-1 device in the NFCIP-1 mode. The NFCIP-1 mode offers different communication mode and transfer speeds up to 424 kbit/s according to the Ecma 340 and ISO/IEC 18092 NFCIP-1 Standard. The digital part handles the complete NFCIP-1 framing and error detection. Various host controller interfaces are implemented: • 8-bit parallel interface1 • SPI interface • serial UART (similar to RS232 with voltage levels according pad voltage supply) • I2C interface. A purchaser of this NXP IC has to take care for appropriate third party patent licenses. 1. 8-bit parallel Interface only available in HVQFN40 package. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 3 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 3. Features and benefits  Highly integrated analog circuitry to demodulate and decode responses  Buffered output drivers for connecting an antenna with the minimum number of external components  Integrated RF Level detector  Integrated data mode detector  Supports ISO/IEC 14443 A/MIFARE  Supports ISO/IEC 14443 B Read/Write modes  Typical operating distance in Read/Write mode up to 50 mm depending on the antenna size and tuning  Typical operating distance in NFCIP-1 mode up to 50 mm depending on the antenna size and tuning and power supply  Typical operating distance in ISO/IEC 14443A/MIFARE card or FeliCa Card Operation mode of about 100 mm depending on the antenna size and tuning and the external field strength  Supports MIFARE 1K or MIFARE 4K emulation encryption in Reader/Writer mode  ISO/IEC 14443A higher transfer speed communication at 212 kbit/s and 424 kbit/s  Contactless communication according to the FeliCa scheme at 212 kbit/s and 424 kbit/s  Integrated RF interface for NFCIP-1 up to 424 kbit/s  S2C interface  Additional power supply to directly supply the smart card IC connected via S2C  Supported host interfaces  SPI up to 10 Mbit/s  I2C-bus interface up to 400 kBd in Fast mode, up to 3400 kBd in High-speed mode  RS232 Serial UART up to 1228.8 kBd, with voltage levels dependant on pin voltage supply  8-bit parallel interface with and without Address Latch Enable  FIFO buffer handles 64 byte send and receive  Flexible interrupt modes  Hard reset with low power function  Power-down mode per software  Programmable timer  Internal oscillator for connection to 27.12 MHz quartz crystal  2.5 V to 3.6 V power supply  CRC coprocessor  Programmable I/O pins  Internal self-test PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 4 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 4. Quick reference data [1] Supply voltages below 3 V reduce the performance in, for example, the achievable operating distance. [2] VDDA, VDDD and VDD(TVDD) must always be the same voltage. [3] VDD(PVDD) must always be the same or lower voltage than VDDD. [4] Ipd is the total current for all supplies. [5] IDD(PVDD) depends on the overall load at the digital pins. [6] IDD(TVDD) depends on VDD(TVDD) and the external circuit connected to pins TX1 and TX2. [7] During typical circuit operation, the overall current is below 100 mA. [8] Typical value using a complementary driver configuration and an antenna matched to 40  between pins TX1 and TX2 at 13.56 MHz. Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDDA analog supply voltage VDD(PVDD)  VDDA = VDDD = VDD(TVDD); VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [1][2] 2.5 - 3.6 V VDDD digital supply voltage VDD(TVDD) TVDD supply voltage VDD(PVDD) PVDD supply voltage [3] 1.6 - 3.6 V VDD(SVDD) SVDD supply voltage VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 1.6 - 3.6 V Ipd power-down current VDDA= VDDD = VDD(TVDD) = VDD(PVDD) = 3 V hard power-down; pin NRSTPD set LOW [4]- - 5 A soft power-down; RF level detector on [4]- - 10 A IDDD digital supply current pin DVDD; VDDD= 3 V - 6.5 9 mA IDDA analog supply current pin AVDD; VDDA = 3 V, CommandReg register’s RcvOff bit = 0 - 7 10 mA pin AVDD; receiver switched off; VDDA = 3 V, CommandReg register’s RcvOff bit = 1 - 3 5 mA IDD(PVDD) PVDD supply current pin PVDD [5]- - 40 mA IDD(TVDD) TVDD supply current pin TVDD; continuous wave [6][7][8]- 60 100 mA Tamb ambient temperature HVQFN32, HVQFN40, TFBGA64 30 +85 C lndustrial version: Ipd power-down current VDDA= VDDD = VDD(TVDD) = VDD(PVDD) = 3 V hard power-down; pin NRSTPD set LOW [4]- - 15 A soft power-down; RF level detector on [4]- - 30 A Tamb ambient temperature HVQFN32 40 - +90 C PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 5 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 5. Ordering information Table 2. Ordering information Type number Package Name Description Version PN5120A0HN1/C2 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminal; body 5  5  0.85 mm SOT617-1 PN5120A0HN/C2 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6  6  0.85 mm SOT618-1 PN512AA0HN1/C2 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminal; body 5  5  0.85 mm SOT617-1 PN512AA0HN1/C2BI HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminal; body 5  5  0.85 mm SOT617-1 PN5120A0HN1/C1 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminal; body 5  5  0.85 mm SOT617-1 PN5120A0HN/C1 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6  6  0.85 mm SOT618-1 PN5120A0ET/C2 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls SOT1336-1 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 6 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 6. Block diagram The analog interface handles the modulation and demodulation of the analog signals according to the Card Receiving mode, Reader/Writer mode and NFCIP-1 mode communication scheme. The RF level detector detects the presence of an external RF-field delivered by the antenna to the RX pin. The Data mode detector detects a MIFARE, FeliCa or NFCIP-1 mode in order to prepare the internal receiver to demodulate signals, which are sent to the PN512. The communication (S2C) interface provides digital signals to support communication for transfer speeds above 424 kbit/s and digital signals to communicate to a secure IC. The contactless UART manages the protocol requirements for the communication protocols in cooperation with the host. The FIFO buffer ensures fast and convenient data transfer to and from the host and the contactless UART and vice versa. Various host interfaces are implemented to meet different customer requirements. Fig 1. Simplified block diagram of the PN512 001aaj627 HOST ANTENNA FIFO BUFFER ANALOG INTERFACE CONTACTLESS UART SERIAL UART SPI I2C-BUS REGISTER BANK PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 7 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Fig 2. Detailed block diagram of the PN512 001aak602 DVDD NRSTPD IRQ MFIN MFOUT SVDD OSCIN OSCOUT VMID AUX1 AUX2 RX TVSS TX1 TX2 TVDD 16 19 20 17 10, 14 11 13 12 DVSS AVDD SDA/NSS/RX EA I2C PVDD PVSS 24 32 1 2 5 D1/ADR_5 25 D2/ADR_4 26 D3/ADR_3 27 D4/ADR_2 28 D5/ADR_1/ SCK/DTRQ 29 D6/ADR_0/ MOSI/MX 30 D7/SCL/ MISO/TX 31 AVSS 3 6 23 7 8 9 21 22 4 15 18 FIFO CONTROL MIFARE CLASSIC UNIT STATE MACHINE COMMAND REGISTER PROGRAMABLE TIMER INTERRUPT CONTROL CRC16 GENERATION AND CHECK PARALLEL/SERIAL CONVERTER SERIAL DATA SWITCH TRANSMITTER CONTROL BIT COUNTER PARITY GENERATION AND CHECK FRAME GENERATION AND CHECK BIT DECODING BIT ENCODING RANDOM NUMBER GENERATOR ANALOG TO DIGITAL CONVERTER I-CHANNEL AMPLIFIER ANALOG TEST MULTIPLEXOR AND DIGITAL TO ANALOG CONVERTER I-CHANNEL DEMODULATOR Q-CHANNEL AMPLIFIER CLOCK GENERATION, FILTERING AND DISTRIBUTION Q-CLOCK GENERATION OSCILLATOR TEMPERATURE SENSOR Q-CHANNEL DEMODULATOR AMPLITUDE RATING REFERENCE VOLTAGE 64-BYTE FIFO BUFFER CONTROL REGISTER BANK SPI, UART, I2C-BUS INTERFACE CONTROL VOLTAGE MONITOR AND POWER ON DETECT RESET CONTROL POWER-DOWN CONTROL PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 8 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 7. Pinning information 7.1 Pinning Fig 3. Pinning configuration HVQFN32 (SOT617-1) Fig 4. Pinning configuration HVQFN40 (SOT618-1) 001aan212 PN512 Transparent top view RX SIGIN SIGOUT AVSS NRSTPD AUX1 PVSS AUX2 DVSS OSCIN DVDD OSCOUT PVDD IRQ A1 ALE SVDD TVSS TX1 TVDD TX2 TVSS AVDD VMID A0 D7 D6 D5 D4 D3 D2 D1 8 17 7 18 6 19 5 20 4 21 3 22 2 23 1 24 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 terminal 1 index area 001aan213 PN512 AVSS NRSTPD SIGIN AUX1 PVSS AUX2 DVSS OSCIN DVDD OSCOUT PVDD IRQ A5 NWR A4 NRD A3 ALE A2 NCS SIGOUT SVDD TVSS TX1 TVDD TX2 TVSS AVDD VMID RX A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 10 21 9 22 8 23 7 24 6 25 5 26 4 27 3 28 2 29 1 30 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 terminal 1 index area Transparent top view PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 9 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Fig 5. Pin configuration TFBGA64 (SOT1336-1) aaa-005873 TFBGA64 Transparent top view ball A1 index area H G F E D C B A 1 2 3 4 5 6 7 8 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 10 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 7.2 Pin description Table 3. Pin description HVQFN32 Pin Symbol Type Description 1 A1 I Address Line 2 PVDD PWR Pad power supply 3 DVDD PWR Digital Power Supply 4 DVSS PWR Digital Ground 5 PVSS PWR Pad power supply ground 6 NRSTPD I Not Reset and Power Down: When LOW, internal current sinks are switched off, the oscillator is inhibited, and the input pads are disconnected from the outside world. With a positive edge on this pin the internal reset phase starts. 7 SIGIN I Communication Interface Input: accepts a digital, serial data stream 8 SIGOUT O Communication Interface Output: delivers a serial data stream 9 SVDD PWR S2C Pad Power Supply: provides power to the S2C pads 10 TVSS PWR Transmitter Ground: supplies the output stage of TX1 and TX2 11 TX1 O Transmitter 1: delivers the modulated 13.56 MHz energy carrier 12 TVDD PWR Transmitter Power Supply: supplies the output stage of TX1 and TX2 13 TX2 O Transmitter 2: delivers the modulated 13.56 MHz energy carrier 14 TVSS PWR Transmitter Ground: supplies the output stage of TX1 and TX2 15 AVDD PWR Analog Power Supply 16 VMID PWR Internal Reference Voltage: This pin delivers the internal reference voltage. 17 RX I Receiver Input 18 AVSS PWR Analog Ground 19 AUX1 O Auxiliary Outputs: These pins are used for testing. 20 AUX2 O 21 OSCIN I Crystal Oscillator Input: input to the inverting amplifier of the oscillator. This pin is also the input for an externally generated clock (fosc = 27.12 MHz). 22 OSCOUT O Crystal Oscillator Output: Output of the inverting amplifier of the oscillator. 23 IRQ O Interrupt Request: output to signal an interrupt event 24 ALE I Address Latch Enable: signal to latch AD0 to AD5 into the internal address latch when HIGH. 25 to 31 D1 to D7 I/O 8-bit Bi-directional Data Bus. Remark: An 8-bit parallel interface is not available. Remark: If the host controller selects I2C as digital host controller interface, these pins can be used to define the I2C address. Remark: For serial interfaces this pins can be used for test signals or I/Os. 32 A0 I Address Line PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 11 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Table 4. Pin description HVQFN40 Pin Symbol Type Description 1 to 4 A2 to A5 I Address Line 5 PVDD PWR Pad power supply 6 DVDD PWR Digital Power Supply 7 DVSS PWR Digital Ground 8 PVSS PWR Pad power supply ground 9 NRSTPD I Not Reset and Power Down: When LOW, internal current sinks are switched off, the oscillator is inhibited, and the input pads are disconnected from the outside world. With a positive edge on this pin the internal reset phase starts. 10 SIGIN I Communication Interface Input: accepts a digital, serial data stream 11 SIGOUT O Communication Interface Output: delivers a serial data stream 12 SVDD PWR S2C Pad Power Supply: provides power to the S2C pads 13 TVSS PWR Transmitter Ground: supplies the output stage of TX1 and TX2 14 TX1 O Transmitter 1: delivers the modulated 13.56 MHz energy carrier 15 TVDD PWR Transmitter Power Supply: supplies the output stage of TX1 and TX2 16 TX2 O Transmitter 2: delivers the modulated 13.56 MHz energy carrier 17 TVSS PWR Transmitter Ground: supplies the output stage of TX1 and TX2 18 AVDD PWR Analog Power Supply 19 VMID PWR Internal Reference Voltage: This pin delivers the internal reference voltage. 20 RX I Receiver Input 21 AVSS PWR Analog Ground 22 AUX1 O Auxiliary Outputs: These pins are used for testing. 23 AUX2 O 24 OSCIN I Crystal Oscillator Input: input to the inverting amplifier of the oscillator. This pin is also the input for an externally generated clock (fosc = 27.12 MHz). 25 OSCOUT O Crystal Oscillator Output: Output of the inverting amplifier of the oscillator. 26 IRQ O Interrupt Request: output to signal an interrupt event 27 NWR I Not Write: strobe to write data (applied on D0 to D7) into the PN512 register 28 NRD I Not Read: strobe to read data from the PN512 register (applied on D0 to D7) 29 ALE I Address Latch Enable: signal to latch AD0 to AD5 into the internal address latch when HIGH. 30 NCS I Not Chip Select: selects and activates the host controller interface of the PN512 31 to 38 D0 to D7 I/O 8-bit Bi-directional Data Bus. Remark: For serial interfaces this pins can be used for test signals or I/Os. Remark: If the host controller selects I2C as digital host controller interface, these pins can be used to define the I2C address. 39 to 40 A0 to A1 I Address Line PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 12 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Table 5. Pin description TFBGA64 Pin Symbol Type Description A1 to A5, A8, B3, B4, B8, E1 PVSS PWR Pad power supply ground A6 D4 I/O 8-bit Bi-directional Data Bus. Remark: For serial interfaces this pins can be used for test signals or I/Os. Remark: If the host controller selects I2C as digital host controller interface, these pins can be used to define the I2C address. A7 D2 I/O B1 PVDD PWR Pad power supply B2 A0 I Address Line B5 D5 I/O 8-bit Bi-directional Data Bus. Remark: For serial interfaces this pins can be used for test signals or I/Os. Remark: If the host controller selects I2C as digital host controller interface, these pins can be used to define the I2C address. B6 D3 I/O B7 D1 I/O C1 DVDD PWR Digital Power Supply C2 A1 I Address Line C3 D7 I/O 8-bit Bi-directional Data Bus. Remark: For serial interfaces this pins can be used for test signals or I/Os. Remark: If the host controller selects I2C as digital host controller interface, these pins can be used to define the I2C address. C4 D6 I/O C5 IRQ O Interrupt Request: output to signal an interrupt event C6 ALE I Address Latch Enable: signal to latch AD0 to AD5 into the internal address latch when HIGH. C7, C8, D6, D8, E6, E8, F7, G8, H8 AVSS PWR Analog Ground D1 DVSS PWR Digital Ground D2 NRSTPD I Not Reset and Power Down: When LOW, internal current sinks are switched off, the oscillator is inhibited, and the input pads are disconnected from the outside world. With a positive edge on this pin the internal reset phase starts. D3 to D5, E3 to E5, F3, F4, G1 to G6, H1, H2, H6 TVSS PWR Transmitter Ground: supplies the output stage of TX1 and TX2 D7 OSCOUT O Crystal Oscillator Output: Output of the inverting amplifier of the oscillator. E2 SIGIN I Communication Interface Input: accepts a digital, serial data stream E7 OSCIN I Crystal Oscillator Input: input to the inverting amplifier of the oscillator. This pin is also the input for an externally generated clock (fosc = 27.12MHz). F1 SVDD PWR S2C Pad Power Supply: provides power to the S2C pads F2 SIGOUT O Communication Interface Output: delivers a serial data stream F5 AUX1 O Auxiliary Outputs: These pins are used for testing. F6 AUX2 O F8 RX I Receiver Input G7 VMID PWR Internal Reference Voltage: This pin delivers the internal reference voltage. H3 TX1 O Transmitter 1: delivers the modulated 13.56 MHz energy carrier PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 13 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution H4 TVDD PWR Transmitter Power Supply: supplies the output stage of TX1 and TX2 H5 TX2 O Transmitter 2: delivers the modulated 13.56 MHz energy carrier H7 AVDD PWR Analog Power Supply Table 5. Pin description TFBGA64 Pin Symbol Type Description PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 14 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 8. Functional description The PN512 transmission module supports the Read/Write mode for ISO/IEC 14443 A/MIFARE and ISO/IEC 14443 B using various transfer speeds and modulation protocols. PN512 transceiver IC supports the following operating modes: • Reader/Writer mode supporting ISO/IEC 14443A/MIFARE and FeliCa scheme • Card Operation mode supporting ISO/IEC 14443A/MIFARE and FeliCa scheme • NFCIP-1 mode The modes support different transfer speeds and modulation schemes. The following chapters will explain the different modes in detail. Note: All indicated modulation indices and modes in this chapter are system parameters. This means that beside the IC settings a suitable antenna tuning is required to achieve the optimum performance. 8.1 ISO/IEC 14443 A/MIFARE functionality The physical level communication is shown in Figure 7. The physical parameters are described in Table 4. Fig 6. PN512 Read/Write mode 001aan218 BATTERY reader/writer contactless card MICROCONTROLLER PN512 ISO/IEC 14443 A CARD Fig 7. ISO/IEC 14443 A/MIFARE Read/Write mode communication diagram Table 6. Communication overview for ISO/IEC 14443 A/MIFARE reader/writer Communication direction Signal type Transfer speed 106 kBd 212 kBd 424 kBd Reader to card (send data from the PN512 to a card) reader side modulation 100 % ASK 100 % ASK 100 % ASK bit encoding modified Miller encoding modified Miller encoding modified Miller encoding bit length 128 (13.56 s) 64 (13.56 s) 32 (13.56 s) (1) (2) 001aan219 PN512 ISO/IEC 14443 A CARD ISO/IEC 14443 A READER PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 15 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution The PN512’s contactless UART and dedicated external host must manage the complete ISO/IEC 14443 A/MIFARE protocol. Figure 8 shows the data coding and framing according to ISO/IEC 14443 A/MIFARE. The internal CRC coprocessor calculates the CRC value based on ISO/IEC 14443 A part 3 and handles parity generation internally according to the transfer speed. Automatic parity generation can be switched off using the ManualRCVReg register’s ParityDisable bit. 8.2 ISO/IEC 14443 B functionality The PN512 reader IC fully supports international standard ISO 14443 which includes communication schemes ISO 14443 A and ISO 14443 B. Refer to the ISO 14443 reference documents Identification cards - Contactless integrated circuit cards - Proximity cards (parts 1 to 4). Remark: NXP Semiconductors does not offer a software library to enable design-in of the ISO 14443 B protocol. Card to reader (PN512 receives data from a card) card side modulation subcarrier load modulation subcarrier load modulation subcarrier load modulation subcarrier frequency 13.56 MHz/16 13.56 MHz/16 13.56 MHz/16 bit encoding Manchester encoding BPSK BPSK Table 6. Communication overview for ISO/IEC 14443 A/MIFARE reader/writer …continued Communication direction Signal type Transfer speed 106 kBd 212 kBd 424 kBd Fig 8. Data coding and framing according to ISO/IEC 14443 A 001aak585 ISO/IEC 14443 A framing at 106 kBd 8-bit data 8-bit data 8-bit data odd parity odd parity start odd start bit is 1 parity ISO/IEC 14443 A framing at 212 kBd, 424 kBd and 848 kBd 8-bit data 8-bit data 8-bit data odd parity odd parity start even parity start bit is 0 burst of 32 subcarrier clocks even parity at the end of the frame PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 16 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 8.3 FeliCa reader/writer functionality The FeliCa mode is the general reader/writer to card communication scheme according to the FeliCa specification. The following diagram describes the communication on a physical level, the communication overview describes the physical parameters. The contactless UART of PN512 and a dedicated external host controller are required to handle the complete FeliCa protocol. 8.3.1 FeliCa framing and coding To enable the FeliCa communication a 6 byte preamble (00h, 00h, 00h, 00h, 00h, 00h) and 2 bytes Sync bytes (B2h, 4Dh) are sent to synchronize the receiver. The following Len byte indicates the length of the sent data bytes plus the LEN byte itself. The CRC calculation is done according to the FeliCa definitions with the MSB first. To transmit data on the RF interface, the host controller has to send the Len- and databytes to the PN512's FIFO-buffer. The preamble and the sync bytes are generated by the PN512 automatically and must not be written to the FIFO by the host controller. The PN512 performs internally the CRC calculation and adds the result to the data frame. Example for FeliCa CRC Calculation: Fig 9. FeliCa reader/writer communication diagram Table 7. Communication overview for FeliCa reader/writer Communication direction FeliCa FeliCa Higher transfer speeds Transfer speed 212 kbit/s 424 kbit/s PN512  card Modulation on reader side 8-30 % ASK 8-30 % ASK bit coding Manchester Coding Manchester Coding Bitlength (64/13.56) s (32/13.56) s card  PN512 Loadmodulation on card side > 12 % ASK > 12 % ASK bit coding Manchester coding Manchester coding 2. PICC to PCD, > 12 % ASK loadmodulation Manchester coded, baudrate 212 to 424 kbaud 1. PCD to PICC, 8-30 % ASK Manchester coded, baudrate 212 to 424 kbaud 001aan214 PN512 FeliCa CARD (PICC) Felica READER (PCD) Table 8. FeliCa framing and coding Preamble Sync Len n-Data CRC 00h 00h 00h 00h 00h 00h B2h 4Dh Table 9. Start value for the CRC Polynomial: (00h), (00h) Preamble Sync Len 2 Data Bytes CRC 00h 00h 00h 00h 00h 00h B2h 4Dh 03h ABh CDh 90h 35h PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 17 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 8.4 NFCIP-1 mode The NFCIP-1 communication differentiates between an active and a Passive Communication mode. • Active Communication mode means both the initiator and the target are using their own RF field to transmit data. • Passive Communication mode means that the target answers to an initiator command in a load modulation scheme. The initiator is active in terms of generating the RF field. • Initiator: generates RF field at 13.56 MHz and starts the NFCIP-1 communication • Target: responds to initiator command either in a load modulation scheme in Passive Communication mode or using a self generated and self modulated RF field for Active Communication mode. In order to fully support the NFCIP-1 standard the PN512 supports the Active and Passive Communication mode at the transfer speeds 106 kbit/s, 212 kbit/s and 424 kbit/s as defined in the NFCIP-1 standard. Fig 10. NFCIP-1 mode 001aan215 BATTERY initiator: active target: passive or active MICROCONTROLLER PN512 BATTERY MICROCONTROLLER PN512 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 18 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 8.4.1 Active communication mode Active communication mode means both the initiator and the target are using their own RF field to transmit data. The contactless UART of PN512 and a dedicated host controller are required to handle the NFCIP-1 protocol. Note: Transfer Speeds above 424 kbit/s are not defined in the NFCIP-1 standard. The PN512 supports these transfer speeds only with dedicated external circuits. Fig 11. Active communication mode Table 10. Communication overview for Active communication mode Communication direction 106 kbit/s 212 kbit/s 424 kbit/s 848 kbit/s 1.69 Mbit/s, 3.39 Mbit/s Initiator  Target According to ISO/IEC 14443A 100 % ASK, Modified Miller Coded According to FeliCa, 8-30 % ASK Manchester Coded digital capability to handle Target  Initiator this communication host NFC INITIATOR powered to generate RF field 1. initiator starts communication at selected transfer speed Initial command response 2. target answers at the same transfer speed host NFC INITIATOR powered for digital processing host host NFC TARGET NFC TARGET powered for digital processing powered to generate RF field 001aan216 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 19 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 8.4.2 Passive communication mode Passive Communication mode means that the target answers to an initiator command in a load modulation scheme. The initiator is active meaning generating the RF field. The contactless UART of PN512 and a dedicated host controller are required to handle the NFCIP-1 protocol. Note: Transfer Speeds above 424 kbit/s are not defined in the NFCIP-1 standard. The PN512 supports these transfer speeds only with dedicated external circuits. Fig 12. Passive communication mode Table 11. Communication overview for Passive communication mode Communication direction 106 kbit/s 212 kbit/s 424 kbit/s 848 kbit/s 1.69 Mbit/s, 3.39 Mbit/s Initiator  Target According to ISO/IEC 14443A 100 % ASK, Modified Miller Coded According to FeliCa, 8-30 % ASK Manchester Coded digital capability to handle this communication Target  Initiator According to ISO/IEC 14443A subcarrier load modulation, Manchester Coded According to FeliCa, > 12 % ASK Manchester Coded host NFC INITIATOR powered to generate RF field 1. initiator starts communication at selected transfer speed 2. targets answers using load modulated data at the same transfer speed host NFC TARGET powered for digital processing 001aan217 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 20 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 8.4.3 NFCIP-1 framing and coding The NFCIP-1 framing and coding in Active and Passive Communication mode is defined in the NFCIP-1 standard. 8.4.4 NFCIP-1 protocol support The NFCIP-1 protocol is not completely described in this document. For detailed explanation of the protocol refer to the NFCIP-1 standard. However the datalink layer is according to the following policy: • Speed shall not be changed while continuum data exchange in a transaction. • Transaction includes initialization and anticollision methods and data exchange (in continuous way, meaning no interruption by another transaction). In order not to disturb current infrastructure based on 13.56 MHz general rules to start NFCIP-1 communication are defined in the following way. 1. Per default NFCIP-1 device is in Target mode meaning its RF field is switched off. 2. The RF level detector is active. 3. Only if application requires the NFCIP-1 device shall switch to Initiator mode. 4. Initiator shall only switch on its RF field if no external RF field is detected by RF Level detector during a time of TIDT. 5. The initiator performs initialization according to the selected mode. 8.4.5 MIFARE Card operation mode Table 12. Framing and coding overview Transfer speed Framing and Coding 106 kbit/s According to the ISO/IEC 14443A/MIFARE scheme 212 kbit/s According to the FeliCa scheme 424 kbit/s According to the FeliCa scheme Table 13. MIFARE Card operation mode Communication direction ISO/IEC 14443A/ MIFARE MIFARE Higher transfer speeds transfer speed 106 kbit/s 212 kbit/s 424 kbit/s reader/writer  PN512 Modulation on reader side 100 % ASK 100 % ASK 100 % ASK bit coding Modified Miller Modified Miller Modified Miller Bitlength (128/13.56) s (64/13.56) s (32/13.56) s PN512  reader/ writer Modulation on PN512 side subcarrier load modulation subcarrier load modulation subcarrier load modulation subcarrier frequency 13.56 MHz/16 13.56 MHz/16 13.56 MHz/16 bit coding Manchester coding BPSK BPSK PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 21 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 8.4.6 FeliCa Card operation mode 9. PN512 register SET 9.1 PN512 registers overview Table 14. FeliCa Card operation mode Communication direction FeliCa FeliCa Higher transfer speeds Transfer speed 212 kbit/s 424 kbit/s reader/writer  PN512 Modulation on reader side 8-30 % ASK 8-30 % ASK bit coding Manchester Coding Manchester Coding Bitlength (64/13.56) s (32/13.56) s PN512  reader/ writer Load modulation on PN512 side > 12 % ASK load modulation > 12 % ASK load modulation bit coding Manchester coding Manchester coding Table 15. PN512 registers overview Addr (hex) Register Name Function Page 0: Command and Status 0 PageReg Selects the register page 1 CommandReg Starts and stops command execution 2 ComlEnReg Controls bits to enable and disable the passing of Interrupt Requests 3 DivlEnReg Controls bits to enable and disable the passing of Interrupt Requests 4 ComIrqReg Contains Interrupt Request bits 5 DivIrqReg Contains Interrupt Request bits 6 ErrorReg Error bits showing the error status of the last command executed 7 Status1Reg Contains status bits for communication 8 Status2Reg Contains status bits of the receiver and transmitter 9 FIFODataReg In- and output of 64 byte FIFO-buffer A FIFOLevelReg Indicates the number of bytes stored in the FIFO B WaterLevelReg Defines the level for FIFO under- and overflow warning C ControlReg Contains miscellaneous Control Registers D BitFramingReg Adjustments for bit oriented frames E CollReg Bit position of the first bit collision detected on the RF-interface F RFU Reserved for future use Page 1: Command 0 PageReg Selects the register page 1 ModeReg Defines general modes for transmitting and receiving 2 TxModeReg Defines the data rate and framing during transmission 3 RxModeReg Defines the data rate and framing during receiving 4 TxControlReg Controls the logical behavior of the antenna driver pins TX1 and TX2 5 TxAutoReg Controls the setting of the antenna drivers PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 22 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 6 TxSelReg Selects the internal sources for the antenna driver 7 RxSelReg Selects internal receiver settings 8 RxThresholdReg Selects thresholds for the bit decoder 9 DemodReg Defines demodulator settings A FelNFC1Reg Defines the length of the valid range for the receive package B FelNFC2Reg Defines the length of the valid range for the receive package C MifNFCReg Controls the communication in ISO/IEC 14443/MIFARE and NFC target mode at 106 kbit D ManualRCVReg Allows manual fine tuning of the internal receiver E TypeBReg Configure the ISO/IEC 14443 type B F SerialSpeedReg Selects the speed of the serial UART interface Page 2: CFG 0 PageReg Selects the register page 1 CRCResultReg Shows the actual MSB and LSB values of the CRC calculation 2 3 GsNOffReg Selects the conductance of the antenna driver pins TX1 and TX2 for modulation, when the driver is switched off 4 ModWidthReg Controls the setting of the ModWidth 5 TxBitPhaseReg Adjust the TX bit phase at 106 kbit 6 RFCfgReg Configures the receiver gain and RF level 7 GsNOnReg Selects the conductance of the antenna driver pins TX1 and TX2 for modulation when the drivers are switched on 8 CWGsPReg Selects the conductance of the antenna driver pins TX1 and TX2 for modulation during times of no modulation 9 ModGsPReg Selects the conductance of the antenna driver pins TX1 and TX2 for modulation during modulation A TModeReg TPrescalerReg Defines settings for the internal timer B C TReloadReg Describes the 16-bit timer reload value D E TCounterValReg Shows the 16-bit actual timer value F Page 3: TestRegister 0 PageReg selects the register page 1 TestSel1Reg General test signal configuration 2 TestSel2Reg General test signal configuration and PRBS control 3 TestPinEnReg Enables pin output driver on 8-bit parallel bus (Note: For serial interfaces only) 4 TestPin ValueReg Defines the values for the 8-bit parallel bus when it is used as I/O bus 5 TestBusReg Shows the status of the internal testbus 6 AutoTestReg Controls the digital selftest Table 15. PN512 registers overview …continued Addr (hex) Register Name Function PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 23 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.1.1 Register bit behavior Depending on the functionality of a register, the access conditions to the register can vary. In principle bits with same behavior are grouped in common registers. In Table 16 the access conditions are described. 7 VersionReg Shows the version 8 AnalogTestReg Controls the pins AUX1 and AUX2 9 TestDAC1Reg Defines the test value for the TestDAC1 A TestDAC2Reg Defines the test value for the TestDAC2 B TestADCReg Shows the actual value of ADC I and Q C-F RFT Reserved for production tests Table 15. PN512 registers overview …continued Addr (hex) Register Name Function Table 16. Behavior of register bits and its designation Abbreviation Behavior Description r/w read and write These bits can be written and read by the -Controller. Since they are used only for control means, there content is not influenced by internal state machines, e.g. the PageSelect-Register may be written and read by the -Controller. It will also be read by internal state machines, but never changed by them. dy dynamic These bits can be written and read by the -Controller. Nevertheless, they may also be written automatically by internal state machines, e.g. the Command-Register changes its value automatically after the execution of the actual command. r read only These registers hold bits, which value is determined by internal states only, e.g. the CRCReady bit can not be written from external but shows internal states. w write only Reading these registers returns always ZERO. RFU - These registers are reserved for future use. In case of a PN512 Version version 2.0 (VersionReg = 82h) a read access to these registers returns always the value “0”. Nevertheless this is not guaranteed for future chips versions where the value is undefined. In case of a write access, it is recommended to write always the value “0”. RFT - These registers are reserved for production tests and shall not be changed. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 24 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2 Register description 9.2.1 Page 0: Command and status 9.2.1.1 PageReg Selects the register page. 9.2.1.2 CommandReg Starts and stops command execution. Table 17. PageReg register (address 00h); reset value: 00h, 0000000b 7 6 5 4 3 2 1 0 UsePage Select 0 0 0 0 0 PageSelect Access Rights r/w RFU RFU RFU RFU RFU r/w r/w Table 18. Description of PageReg bits Bit Symbol Description 7 UsePageSelect Set to logic 1, the value of PageSelect is used as register address A5 and A4. The LSB-bits of the register address are defined by the address pins or the internal address latch, respectively. Set to logic 0, the whole content of the internal address latch defines the register address. The address pins are used as described in Section 10.1 “Automatic microcontroller interface detection”. 6 to 2 - Reserved for future use. 1 to 0 PageSelect The value of PageSelect is used only if UsePageSelect is set to logic 1. In this case it specifies the register page (which is A5 and A4 of the register address). Table 19. CommandReg register (address 01h); reset value: 20h, 00100000b 7 6 5 4 3 2 1 0 0 0 RcvOff Power Down Command Access Rights RFU RFU r/w dy dy dy dy dy Table 20. Description of CommandReg bits Bit Symbol Description 7 to 6 - Reserved for future use. 5 RcvOff Set to logic 1, the analog part of the receiver is switched off. 4 PowerDown Set to logic 1, Soft Power-down mode is entered. Set to logic 0, the PN512 starts the wake up procedure. During this procedure this bit still shows a 1. A 0 indicates that the PN512 is ready for operations; see Section 16.2 “Soft power-down mode”. Note: The bit Power Down cannot be set, when the command SoftReset has been activated. 3 to 0 Command Activates a command according to the Command Code. Reading this register shows, which command is actually executed (see Section 19.3 “PN512 command overview”). PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 25 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.3 CommIEnReg Control bits to enable and disable the passing of interrupt requests. Table 21. CommIEnReg register (address 02h); reset value: 80h, 10000000b 7 6 5 4 3 2 1 0 IRqInv TxIEn RxIEn IdleIEn HiAlertIEn LoAlertIEn ErrIEn TimerIEn Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 22. Description of CommIEnReg bits Bit Symbol Description 7 IRqInv Set to logic 1, the signal on pin IRQ is inverted with respect to bit IRq in the register Status1Reg. Set to logic 0, the signal on pin IRQ is equal to bit IRq. In combination with bit IRqPushPull in register DivIEnReg, the default value of 1 ensures, that the output level on pin IRQ is 3-state. 6 TxIEn Allows the transmitter interrupt request (indicated by bit TxIRq) to be propagated to pin IRQ. 5 RxIEn Allows the receiver interrupt request (indicated by bit RxIRq) to be propagated to pin IRQ. 4 IdleIEn Allows the idle interrupt request (indicated by bit IdleIRq) to be propagated to pin IRQ. 3 HiAlertIEn Allows the high alert interrupt request (indicated by bit HiAlertIRq) to be propagated to pin IRQ. 2 LoAlertIEn Allows the low alert interrupt request (indicated by bit LoAlertIRq) to be propagated to pin IRQ. 1 ErrIEn Allows the error interrupt request (indicated by bit ErrIRq) to be propagated to pin IRQ. 0 TimerIEn Allows the timer interrupt request (indicated by bit TimerIRq) to be propagated to pin IRQ. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 26 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.4 DivIEnReg Control bits to enable and disable the passing of interrupt requests. Table 23. DivIEnReg register (address 03h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 IRQPushPull 0 0 SiginActIEn ModeIEn CRCIEn RFOnIEn RFOffIEn Access Rights r/w RFU RFU r/w r/w r/w r/w r/w Table 24. Description of DivIEnReg bits Bit Symbol Description 7 IRQPushPull Set to logic 1, the pin IRQ works as standard CMOS output pad. Set to logic 0, the pin IRQ works as open drain output pad. 6 to 5 - Reserved for future use. 4 SiginActIEn Allows the SIGIN active interrupt request to be propagated to pin IRQ. 3 ModeIEn Allows the mode interrupt request (indicated by bit ModeIRq) to be propagated to pin IRQ. 2 CRCIEn Allows the CRC interrupt request (indicated by bit CRCIRq) to be propagated to pin IRQ. 1 RfOnIEn Allows the RF field on interrupt request (indicated by bit RfOnIRq) to be propagated to pin IRQ. 0 RfOffIEn Allows the RF field off interrupt request (indicated by bit RfOffIRq) to be propagated to pin IRQ. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 27 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.5 CommIRqReg Contains Interrupt Request bits. Table 25. CommIRqReg register (address 04h); reset value: 14h, 00010100b 7 6 5 4 3 2 1 0 Set1 TxIRq RxIRq IdleIRq HiAlertIRq LoAlertIRq ErrIRq TimerIRq Access Rights w dy dy dy dy dy dy dy Table 26. Description of CommIRqReg bits All bits in the register CommIRqReg shall be cleared by software. Bit Symbol Description 7 Set1 Set to logic 1, Set1 defines that the marked bits in the register CommIRqReg are set. Set to logic 0, Set1 defines, that the marked bits in the register CommIRqReg are cleared. 6 TxIRq Set to logic 1 immediately after the last bit of the transmitted data was sent out. 5 RxIRq Set to logic 1 when the receiver detects the end of a valid datastream. If the bit RxNoErr in register RxModeReg is set to logic 1, bit RxIRq is only set to logic 1 when data bytes are available in the FIFO. 4 IdleIRq Set to logic 1, when a command terminates by itself e.g. when the CommandReg changes its value from any command to the Idle Command. If an unknown command is started, the CommandReg changes its content to the idle state and the bit IdleIRq is set. Starting the Idle Command by the -Controller does not set bit IdleIRq. 3 HiAlertIRq Set to logic 1, when bit HiAlert in register Status1Reg is set. In opposition to HiAlert, HiAlertIRq stores this event and can only be reset as indicated by bit Set1. 2 LoAlertIRq Set to logic 1, when bit LoAlert in register Status1Reg is set. In opposition to LoAlert, LoAlertIRq stores this event and can only be reset as indicated by bit Set1. 1 ErrIRq Set to logic 1 if any error bit in the Error Register is set. 0 TimerIRq Set to logic 1 when the timer decrements the TimerValue Register to zero. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 28 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.6 DivIRqReg Contains Interrupt Request bits Table 27. DivIRqReg register (address 05h); reset value: XXh, 000X00XXb 7 6 5 4 3 2 1 0 Set2 0 0 SiginActIRq ModeIRq CRCIRq RFOnIRq RFOffIRq Access Rights w RFU RFU dy dy dy dy dy Table 28. Description of DivIRqReg bits All bits in the register DivIRqReg shall be cleared by software. Bit Symbol Description 7 Set2 Set to logic 1, Set2 defines that the marked bits in the register DivIRqReg are set. Set to logic 0, Set2 defines, that the marked bits in the register DivIRqReg are cleared 6 to 5 - Reserved for future use. 4 SiginActIRq Set to logic 1, when SIGIN is active. See Section 12.6 “S2C interface support”. This interrupt is set when either a rising or falling signal edge is detected. 3 ModeIRq Set to logic 1, when the mode has been detected by the Data mode detector. Note: The Data mode detector can only be activated by the AutoColl command and is terminated automatically having detected the Communication mode. Note: The Data mode detector is automatically restarted after each RF Reset. 2 CRCIRq Set to logic 1, when the CRC command is active and all data are processed. 1 RFOnIRq Set to logic 1, when an external RF field is detected. 0 RFOffIRq Set to logic 1, when a present external RF field is switched off. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 29 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.7 ErrorReg Error bit register showing the error status of the last command executed. [1] Command execution will clear all error bits except for bit TempErr. A setting by software is impossible. Table 29. ErrorReg register (address 06h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 WrErr TempErr RFErr BufferOvfl CollErr CRCErr ParityErr ProtocolErr Access Rights r r r r r r r r Table 30. Description of ErrorReg bits Bit Symbol Description 7 WrErr Set to logic 1, when data is written into FIFO by the host controller during the AutoColl command or MFAuthent command or if data is written into FIFO by the host controller during the time between sending the last bit on the RF interface and receiving the last bit on the RF interface. 6 TempErr[1] Set to logic 1, if the internal temperature sensor detects overheating. In this case, the antenna drivers are switched off automatically. 5 RFErr Set to logic 1, if in Active Communication mode the counterpart does not switch on the RF field in time as defined in NFCIP-1 standard. Note: RFErr is only used in Active Communication mode. The bits RxFraming or the bits TxFraming has to be set to 01 to enable this functionality. 4 BufferOvfl Set to logic 1, if the host controller or a PN512’s internal state machine (e.g. receiver) tries to write data into the FIFO-bufferFIFO-buffer although the FIFO-buffer is already full. 3 CollErr Set to logic 1, if a bit-collision is detected. It is cleared automatically at receiver start-up phase. This bit is only valid during the bitwise anticollision at 106 kbit. During communication schemes at 212 and 424 kbit this bit is always set to logic 1. 2 CRCErr Set to logic 1, if bit RxCRCEn in register RxModeReg is set and the CRC calculation fails. It is cleared to 0 automatically at receiver start-up phase. 1 ParityErr Set to logic 1, if the parity check has failed. It is cleared automatically at receiver start-up phase. Only valid for ISO/IEC 14443A/MIFARE or NFCIP-1 communication at 106 kbit. 0 ProtocolErr Set to logic 1, if one out of the following cases occur: • Set to logic 1 if the SOF is incorrect. It is cleared automatically at receiver start-up phase. The bit is only valid for 106 kbit in Active and Passive Communication mode. • If bit DetectSync in register ModeReg is set to logic 1 during FeliCa communication or active communication with transfer speeds higher than 106 kbit, the bit ProtocolErr is set to logic 1 in case of a byte length violation. • During the AutoColl command, bit ProtocolErr is set to logic 1, if the bit Initiator in register ControlReg is set to logic 1. • During the MFAuthent Command, bit ProtocolErr is set to logic 1, if the number of bytes received in one data stream is incorrect. • Set to logic 1, if the Miller Decoder detects 2 pulses below the minimum time according to the ISO/IEC 14443A definitions. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 30 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.8 Status1Reg Contains status bits of the CRC, Interrupt and FIFO-buffer. Table 31. Status1Reg register (address 07h); reset value: XXh, X100X01Xb 7 6 5 4 3 2 1 0 RFFreqOK CRCOk CRCReady IRq TRunning RFOn HiAlert LoAlert Access Rights r r r r r r r r Table 32. Description of Status1Reg bits Bit Symbol Description 7 RFFreqOK Indicates if the frequency detected at the RX pin is in the range of 13.56 MHz. Set to logic 1, if the frequency at the RX pin is in the range 12 MHz < RX pin frequency < 15 MHz. Note: The value of RFFreqOK is not defined if the external RF frequency is in the range from 9 to 12 MHz or in the range from 15 to 19 MHz. 6 CRCOk Set to logic 1, if the CRC Result is zero. For data transmission and reception the bit CRCOk is undefined (use CRCErr in register ErrorReg). CRCOk indicates the status of the CRC co-processor, during calculation the value changes to ZERO, when the calculation is done correctly, the value changes to ONE. 5 CRCReady Set to logic 1, when the CRC calculation has finished. This bit is only valid for the CRC co-processor calculation using the command CalcCRC. 4 IRq This bit shows, if any interrupt source requests attention (with respect to the setting of the interrupt enable bits, see register CommIEnReg and DivIEnReg). 3 TRunning Set to logic 1, if the PN512’s timer unit is running, e.g. the timer will decrement the TCounterValReg with the next timer clock. Note: In the gated mode the bit TRunning is set to logic 1, when the timer is enabled by the register bits. This bit is not influenced by the gated signal. 2 RFOn Set to logic 1, if an external RF field is detected. This bit does not store the state of the RF field. 1 HiAlert Set to logic 1, when the number of bytes stored in the FIFO-buffer fulfills the following equation: Example: FIFOLength = 60, WaterLevel = 4  HiAlert = 1 FIFOLength = 59, WaterLevel = 4  HiAlert = 0 0 LoAlert Set to logic 1, when the number of bytes stored in the FIFO-buffer fulfills the following equation: Example: FIFOLength = 4, WaterLevel = 4  LoAlert = 1 FIFOLength = 5, WaterLevel = 4  LoAlert = 0 HiAlert = 64 – FIFOLength   WaterLevel LoAlert = FIFOLength  WaterLevel PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 31 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.9 Status2Reg Contains status bits of the Receiver, Transmitter and Data mode detector. Table 33. Status2Reg register (address 08h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TempSensClear I2CForceHS 0 TargetActivated MFCrypto1On Modem State Access Rights r/w r/w RFU dy dy r r r Table 34. Description of Status2Reg bits Bit Symbol Description 7 TempSensClear Set to logic 1, this bit clears the temperature error, if the temperature is below the alarm limit of 125 C. 6 I2CForceHS I2C input filter settings. Set to logic 1, the I2C input filter is set to the High-speed mode independent of the I2C protocol. Set to logic 0, the I2C input filter is set to the used I2C protocol. 5 - Reserved for future use. 4 TargetActivated Set to logic 1 if the Select command or if the Polling command was answered. Note: This bit can only be set during the AutoColl command in Passive Communication mode. Note: This bit is cleared automatically by switching off the external RF field. 3 MFCrypto1On This bit indicates that the MIFARE Crypto1 unit is switched on and therefore all data communication with the card is encrypted. This bit can only be set to logic 1 by a successful execution of the MFAuthent Command. This bit is only valid in Reader/Writer mode for MIFARE cards. This bit shall be cleared by software. 2 to 0 Modem State ModemState shows the state of the transmitter and receiver state machines. Value Description 000 IDLE 001 Wait for StartSend in register BitFramingReg 010 TxWait: Wait until RF field is present, if the bit TxWaitRF is set to logic 1. The minimum time for TxWait is defined by the TxWaitReg register. 011 Sending 100 RxWait: Wait until RF field is present, if the bit RxWaitRF is set to logic 1. The minimum time for RxWait is defined by the RxWaitReg register. 101 Wait for data 110 Receiving PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 32 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.10 FIFODataReg In- and output of 64 byte FIFO-buffer. 9.2.1.11 FIFOLevelReg Indicates the number of bytes stored in the FIFO. Table 35. FIFODataReg register (address 09h); reset value: XXh, XXXXXXXXb 7 6 5 4 3 2 1 0 FIFOData Access Rights dy dy dy dy dy dy dy dy Table 36. Description of FIFODataReg bits Bit Symbol Description 7 to 0 FIFOData Data input and output port for the internal 64 byte FIFO-buffer. The FIFO-buffer acts as parallel in/parallel out converter for all serial data stream in- and outputs. Table 37. FIFOLevelReg register (address 0Ah); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 FlushBuffer FIFOLevel Access Rights w r r r r r r r Table 38. Description of FIFOLevelReg bits Bit Symbol Description 7 FlushBuffer Set to logic 1, this bit clears the internal FIFO-buffer’s read- and write-pointer and the bit BufferOvfl in the register ErrReg immediately. Reading this bit will always return 0. 6 to 0 FIFOLevel Indicates the number of bytes stored in the FIFO-buffer. Writing to the FIFODataReg increments, reading decrements the FIFOLevel. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 33 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.12 WaterLevelReg Defines the level for FIFO under- and overflow warning. 9.2.1.13 ControlReg Miscellaneous control bits. Table 39. WaterLevelReg register (address 0Bh); reset value: 08h, 00001000b 7 6 5 4 3 2 1 0 0 0 WaterLevel Access Rights RFU RFU r/w r/w r/w r/w r/w r/w Table 40. Description of WaterLevelReg bits Bit Symbol Description 7 to 6 - Reserved for future use. 5 to 0 WaterLevel This register defines a warning level to indicate a FIFO-buffer over- or underflow: The bit HiAlert in Status1Reg is set to logic 1, if the remaining number of bytes in the FIFO-buffer space is equal or less than the defined number of WaterLevel bytes. The bit LoAlert in Status1Reg is set to logic 1, if equal or less than WaterLevel bytes are in the FIFO. Note: For the calculation of HiAlert and LoAlert see Table 31 Table 41. ControlReg register (address 0Ch); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TStopNow TStartNow WrNFCIDtoFIFO Initiator 0 RxLastBits Access Rights w w dy r/w RFU r r r Table 42. Description of ControlReg bits Bit Symbol Description 7 TStopNow Set to logic 1, the timer stops immediately. Reading this bit will always return 0. 6 TStartNow Set to logic 1 starts the timer immediately. Reading this bit will always return 0. 5 WrNFCIDtoFIFO Set to logic 1, the internal stored NFCID (10 bytes) is copied into the FIFO. Afterwards the bit is cleared automatically 4 Initiator Set to logic 1, the PN512 acts as initiator, otherwise it acts as target 3 - Reserved for future use. 2 to 0 RxLastBits Shows the number of valid bits in the last received byte. If zero, the whole byte is valid. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 34 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.14 BitFramingReg Adjustments for bit oriented frames. Table 43. BitFramingReg register (address 0Dh); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 StartSend RxAlign 0 TxLastBits Access Rights w r/w r/w r/w RFU r/w r/w r/w Table 44. Description of BitFramingReg bits Bit Symbol Description 7 StartSend Set to logic 1, the transmission of data starts. This bit is only valid in combination with the Transceive command. 6 to 4 RxAlign Used for reception of bit oriented frames: RxAlign defines the bit position for the first bit received to be stored in the FIFO. Further received bits are stored at the following bit positions. Example: RxAlign = 0: the LSB of the received bit is stored at bit 0, the second received bit is stored at bit position 1. RxAlign = 1: the LSB of the received bit is stored at bit 1, the second received bit is stored at bit position 2. RxAlign = 7: the LSB of the received bit is stored at bit 7, the second received bit is stored in the following byte at bit position 0. This bit shall only be used for bitwise anticollision at 106 kbit/s in Passive Communication mode. In all other modes it shall be set to logic 0. 3 - Reserved for future use. 2 to 0 TxLastBits Used for transmission of bit oriented frames: TxLastBits defines the number of bits of the last byte that shall be transmitted. A 000 indicates that all bits of the last byte shall be transmitted. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 35 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.1.15 CollReg Defines the first bit collision detected on the RF interface. Table 45. CollReg register (address 0Eh); reset value: XXh, 101XXXXXb 7 6 5 4 3 2 1 0 Values AfterColl 0 CollPos NotValid CollPos Access Rights r/w RFU r r r r r r Table 46. Description of CollReg bits Bit Symbol Description 7 ValuesAfterColl If this bit is set to logic 0, all receiving bits will be cleared after a collision. This bit shall only be used during bitwise anticollision at 106 kbit, otherwise it shall be set to logic 1. 6 - Reserved for future use. 5 CollPosNotValid Set to logic 1, if no Collision is detected or the Position of the Collision is out of the range of bits CollPos. This bit shall only be interpreted in Passive Communication mode at 106 kbit or ISO/IEC 14443A/MIFARE Reader/Writer mode. 4 to 0 CollPos These bits show the bit position of the first detected collision in a received frame, only data bits are interpreted. Example: 00h indicates a bit collision in the 32th bit 01h indicates a bit collision in the 1st bit 08h indicates a bit collision in the 8th bit These bits shall only be interpreted in Passive Communication mode at 106 kbit or ISO/IEC 14443A/MIFARE Reader/Writer mode if bit CollPosNotValid is set to logic 0. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 36 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2 Page 1: Communication 9.2.2.1 PageReg Selects the register page. Table 47. PageReg register (address 10h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 UsePage Select 0 0 0 0 0 PageSelect Access Rights r/w RFU RFU RFU RFU RFU r/w r/w Table 48. Description of PageReg bits Bit Symbol Description 7 UsePage Select Set to logic 1, the value of PageSelect is used as register address A5 and A4. The LSB-bits of the register address are defined by the address pins or the internal address latch, respectively. Set to logic 0, the whole content of the internal address latch defines the register address. The address pins are used as described in Section 10.1 “Automatic microcontroller interface detection”. 6 to 2 - Reserved for future use. 1 to 0 PageSelect The value of PageSelect is used only, if UsePageSelect is set to logic 1. In this case it specifies the register page (which is A5 and A4 of the register address). PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 37 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.2 ModeReg Defines general mode settings for transmitting and receiving. Table 49. ModeReg register (address 11h); reset value: 3Bh, 00111011b 7 6 5 4 3 2 1 0 MSBFirst Detect Sync TxWaitRF RxWaitRF PolSigin ModeDetOff CRCPreset Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 50. Description of ModeReg bits Bit Symbol Description 7 MSBFirst Set to logic 1, the CRC co-processor calculates the CRC with MSB first and the CRCResultMSB and the CRCResultLSB in the CRCResultReg register are bit reversed. Note: During RF communication this bit is ignored. 6 Detect Sync If set to logic 1, the contactless UART waits for the value F0h before the receiver is activated and F0h is added as a Sync-byte for transmission. This bit is only valid for 106 kbit during NFCIP-1 data exchange protocol. In all other modes it shall be set to logic 0. 5 TxWaitRF Set to logic 1 the transmitter in reader/writer or initiator mode for NFCIP-1 can only be started, if an RF field is generated. 4 RxWaitRF Set to logic 1, the counter for RxWait starts only if an external RF field is detected in Target mode for NFCIP-1 or in Card Communication mode. 3 PolSigin PolSigin defines the polarity of the SIGIN pin. Set to logic 1, the polarity of SIGIN pin is active high. Set to logic 0 the polarity of SIGIN pin is active low. Note: The internal envelope signal is coded active low. Note: Changing this bit will generate a SiginActIRq event. 2 ModeDetOff Set to logic 1, the internal mode detector is switched off. Note: The mode detector is only active during the AutoColl command. 1 to 0 CRCPreset Defines the preset value for the CRC co-processor for the command CalCRC. Note: During any communication, the preset values is selected automatically according to the definition in the bits RxMode and TxMode. Value Description 00 0000 01 6363 10 A671 11 FFFF PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 38 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.3 TxModeReg Defines the data rate and framing during transmission. Table 51. TxModeReg register (address 12h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TxCRCEn TxSpeed InvMod TxMix TxFraming Access Rights r/w dy dy dy r/w r/w dy dy Table 52. Description of TxModeReg bits Bit Symbol Description 7 TxCRCEn Set to logic 1, this bit enables the CRC generation during data transmission. Note: This bit shall only be set to logic 0 at 106 kbit. 6 to 4 TxSpeed Defines the bit rate while data transmission. Value Description 000 106 kbit 001 212 kbit 010 424 kbit 011 848 kbit 100 1696 kbit 101 3392 kbit 110 Reserved 111 Reserved Note: The bit coding for transfer speeds above 424 kbit is equivalent to the bit coding of Active Communication mode 424 kbit (Ecma 340). 3 InvMod Set to logic 1, the modulation for transmitting data is inverted. 2 TxMix Set to logic 1, the signal at pin SIGIN is mixed with the internal coder (see Section 12.6 “S2C interface support”). 1 to 0 TxFraming Defines the framing used for data transmission. Value Description 00 ISO/IEC 14443A/MIFARE and Passive Communication mode 106 kbit 01 Active Communication mode 10 FeliCa and Passive communication mode 212 and 424 kbit 11 ISO/IEC 14443B PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 39 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.4 RxModeReg Defines the data rate and framing during reception. Table 53. RxModeReg register (address 13h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 RxCRCEn RxSpeed RxNoErr RxMultiple RxFraming Access Rights r/w dy dy dy r/w r/w dy dy Table 54. Description of RxModeReg bits Bit Symbol Description 7 RxCRCEn Set to logic 1, this bit enables the CRC calculation during reception. Note: This bit shall only be set to logic 0 at 106 kbit. 6 to 4 RxSpeed Defines the bit rate while data transmission. The PN512’s analog part handles only transfer speeds up to 424 kbit internally, the digital UART handles the higher transfer speeds as well. Value Description 000 106 kbit 001 212 kbit 010 424 kbit 011 848 kbit 100 1696 kbit 101 3392 kbit 110 Reserved 111 Reserved Note: The bit coding for transfer speeds above 424 kbit is equivalent to the bit coding of Active Communication mode 424 kbit (Ecma 340). 3 RxNoErr If set to logic 1 a not valid received data stream (less than 4 bits received) will be ignored. The receiver will remain active. For ISO/IEC14443B also RxSOFReq logic 1 is required to ignore a non valid datastream. 2 RxMultiple Set to logic 0, the receiver is deactivated after receiving a data frame. Set to logic 1, it is possible to receive more than one data frame. Having set this bit, the receive and transceive commands will not terminate automatically. In this case the multiple receiving can only be deactivated by writing any command (except the Receive command) to the CommandReg register or by clearing the bit by the host controller. At the end of a received data stream an error byte is added to the FIFO. The error byte is a copy of the ErrorReg register. The behaviour for version 1.0 is described in Section 21 “Errata sheet” on page 109. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 40 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.5 TxControlReg Controls the logical behavior of the antenna driver pins Tx1 and Tx2. 1 to 0 RxFraming Defines the expected framing for data reception. Value Description 00 ISO/IEC 14443A/MIFARE and Passive Communication mode 106 kbit 01 Active Communication mode 10 FeliCa and Passive Communication mode 212 and 424 kbit 11 ISO/IEC 14443B Table 54. Description of RxModeReg bits Bit Symbol Description Table 55. TxControlReg register (address 14h); reset value: 80h, 10000000b 7 6 5 4 3 2 1 0 InvTx2RF On InvTx1RF On InvTx2RF Off InvTx1RF Off Tx2CW CheckRF Tx2RF En Tx1RF En Access Rights r/w r/w r/w r/w r/w w r/w r/w Table 56. Description of TxControlReg bits Bit Symbol Description 7 InvTx2RFOn Set to logic 1, the output signal at pin TX2 will be inverted, if driver TX2 is enabled. 6 InvTx1RFOn Set to logic 1, the output signal at pin TX1 will be inverted, if driver TX1 is enabled. 5 InvTx2RFOff Set to logic 1, the output signal at pin TX2 will be inverted, if driver TX2 is disabled. 4 InvTx1RFOff Set to logic 1, the output signal at pin TX1 will be inverted, if driver TX1 is disabled. 3 Tx2CW Set to logic 1, the output signal on pin TX2 will deliver continuously the un-modulated 13.56 MHz energy carrier. Set to logic 0, Tx2CW is enabled to modulate the 13.56 MHz energy carrier. 2 CheckRF Set to logic 1, Tx2RFEn and Tx1RFEn can not be set if an external RF field is detected. Only valid when using in combination with bit Tx2RFEn or Tx1RFEn 1 Tx2RFEn Set to logic 1, the output signal on pin TX2 will deliver the 13.56 MHz energy carrier modulated by the transmission data. 0 Tx1RFEn Set to logic 1, the output signal on pin TX1 will deliver the 13.56 MHz energy carrier modulated by the transmission data. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 41 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.6 TxAutoReg Controls the settings of the antenna driver. Table 57. TxAutoReg register (address 15h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 AutoRF OFF Force100 ASK Auto WakeUp 0 CAOn InitialRF On Tx2RFAut oEn Tx1RFAuto En Access Rights r/w r/w r/w RFU r/w r/w r/w r/w Table 58. Description of TxAutoReg bits Bit Symbol Description 7 AutoRFOFF Set to logic 1, all active antenna drivers are switched off after the last data bit has been transmitted as defined in the NFCIP-1. 6 Force100ASK Set to logic 1, Force100ASK forces a 100% ASK modulation independent of the setting in register ModGsPReg. 5 AutoWakeUp Set to logic 1, the PN512 in soft Power-down mode will be started by the RF level detector. 4 - Reserved for future use. 3 CAOn Set to logic 1, the collision avoidance is activated and internally the value n is set in accordance to the NFCIP-1 Standard. 2 InitialRFOn Set to logic 1, the initial RF collision avoidance is performed and the bit InitialRFOn is cleared automatically, if the RF is switched on. Note: The driver, which should be switched on, has to be enabled by bit Tx2RFAutoEn or bit Tx1RFAutoEn. 1 Tx2RFAutoEn Set to logic 1, the driver Tx2 is switched on after the external RF field is switched off according to the time TADT. If the bits InitialRFOn and Tx2RFAutoEn are set to logic 1, Tx2 is switched on if no external RF field is detected during the time TIDT. Note: The times TADT and TIDT are defined in the NFC IP-1 standard (ISO/IEC 18092). 0 Tx1RFAutoEn Set to logic 1, the driver Tx1 is switched on after the external RF field is switched off according to the time TADT. If the bit InitialRFOn and Tx1RFAutoEn are set to logic 1, Tx1 is switched on if no external RF field is detected during the time TIDT. Note: The times TADT and TIDT are defined in the NFC IP-1 standard (ISO/IEC 18092). PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 42 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.7 TxSelReg Selects the sources for the analog part. Table 59. TxSelReg register (address 16h); reset value: 10h, 00010000b 7 6 5 4 3 2 1 0 0 0 DriverSel SigOutSel Access Rights RFU RFU r/w r/w r/w r/w r/w r/w Table 60. Description of TxSelReg bits Bit Symbol Description 7 to 6 - Reserved for future use. 5 to 4 DriverSel Selects the input of driver Tx1 and Tx2. Value Description 00 Tristate Note: In soft power down the drivers are only in Tristate mode if DriverSel is set to Tristate mode. 01 Modulation signal (envelope) from the internal coder 10 Modulation signal (envelope) from SIGIN 11 HIGH Note: The HIGH level depends on the setting of InvTx1RFOn/ InvTx1RFOff and InvTx2RFOn/InvTx2RFOff. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 43 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 3 to 0 SigOutSel Selects the input for the SIGOUT Pin. Value Description 0000 Tristate 0001 Low 0010 High 0011 TestBus signal as defined by bit TestBusBitSel in register TestSel1Reg. 0100 Modulation signal (envelope) from the internal coder 0101 Serial data stream to be transmitted 0110 Output signal of the receiver circuit (card modulation signal regenerated and delayed). This signal is used as data output signal for SAM interface connection using 3 lines. Note: To have a valid signal the PN512 has to be set to the receiving mode by either the Transceive or Receive command. The bit RxMultiple can be used to keep the PN512 in receiving mode. Note: Do not use this setting in MIFARE mode. Manchester coding as data collisions will not be transmitted on the SIGOUT line. 0111 Serial data stream received. Note: Do not use this setting in MIFARE mode. Miller coding parameters as the bit length can vary. 1000-1011 FeliCa Sam modulation 1000 RX* 1001 TX 1010 Demodulator comparator output 1011 RFU Note: * To have a valid signal the PN512 has to be set to the receiving mode by either the Transceive or Receive command. The bit RxMultiple can be used to keep the PN512 in receiving mode. 1100-1111 MIFARE Sam modulation 1100 RX* with RF carrier 1101 TX with RF carrier 1110 RX with RF carrier un-filtered 1111 RX envelope un-filtered Note: *To have a valid signal the PN512 has to be set to the receiving mode by either the Transceive or Receive command. The bit RxMultiple can be used to keep the PN512 in receiving mode. Table 60. Description of TxSelReg bits …continued Bit Symbol Description PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 44 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.8 RxSelReg Selects internal receiver settings. 9.2.2.9 RxThresholdReg Selects thresholds for the bit decoder. Table 61. RxSelReg register (address 17h); reset value: 84h, 10000100b 7 6 5 4 3 2 1 0 UartSel RxWait Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 62. Description of RxSelReg bits Bit Symbol Description 7 to 6 UartSel Selects the input of the contactless UART Value Description 00 Constant Low 01 Envelope signal at SIGIN 10 Modulation signal from the internal analog part 11 Modulation signal from SIGIN pin. Only valid for transfer speeds above 424 kbit 5 to 0 RxWait After data transmission, the activation of the receiver is delayed for RxWait bit-clocks. During this ‘frame guard time’ any signal at pin RX is ignored. This parameter is ignored by the Receive command. All other commands (e.g. Transceive, Autocoll, MFAuthent) use this parameter. Depending on the mode of the PN512, the counter starts different. In Passive Communication mode the counter starts with the last modulation pulse of the transmitted data stream. In Active Communication mode the counter starts immediately after the external RF field is switched on. Table 63. RxThresholdReg register (address 18h); reset value: 84h, 10000100b 7 6 5 4 3 2 1 0 MinLevel 0 CollLevel Access Rights r/w r/w r/w r/w RFU r/w r/w r/w Table 64. Description of RxThresholdReg bits Bit Symbol Description 7 to 4 MinLevel Defines the minimum signal strength at the decoder input that shall be accepted. If the signal strength is below this level, it is not evaluated. 3 - Reserved for future use. 2 to 0 CollLevel Defines the minimum signal strength at the decoder input that has to be reached by the weaker half-bit of the Manchester-coded signal to generate a bit-collision relatively to the amplitude of the stronger half-bit. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 45 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.10 DemodReg Defines demodulator settings. Table 65. DemodReg register (address 19h); reset value: 4Dh, 01001101b 7 6 5 4 3 2 1 0 AddIQ FixIQ TPrescal Even TauRcv TauSync Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 66. Description of DemodReg bits Bit Symbol Description 7 to 6 AddIQ Defines the use of I and Q channel during reception Note: FixIQ has to be set to logic 0 to enable the following settings. Value Description 00 Select the stronger channel 01 Select the stronger and freeze the selected during communication 10 combines the I and Q channel 11 Reserved 5 FixIQ If set to logic 1 and the bits of AddIQ are set to X0, the reception is fixed to I channel. If set to logic 1 and the bits of AddIQ are set to X1, the reception is fixed to Q channel. NOTE: If SIGIN/SIGOUT is used as S2C interface FixIQ set to 1 and AddIQ set to X0 is rewired. 4 TPrescalE ven If set to logic 0 the following formula is used to calculate fTimer of the prescaler: fTimer = 13.56 MHz / (2 * TPreScaler + 1). If set to logic 1 the following formula is used to calculate fTimer of the prescaler: fTimer = 13.56 MHz / (2 * TPreScaler + 2). (Default TPrescalEven is logic 0) The behaviour for the version 1.0 is described in Section 21 “Errata sheet” on page 109. 3 to 2 TauRcv Changes the time constant of the internal during data reception. Note: If set to 00, the PLL is frozen during data reception. 1 to 0 TauSync Changes the time constant of the internal PLL during burst. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 46 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.11 FelNFC1Reg Defines the length of the FeliCa Sync bytes and the minimum length of the received packet. Table 67. FelNFC1Reg register (address 1Ah); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 FelSyncLen DataLenMin Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 68. Description of FelNFC1Reg bits Bit Symbol Description 7 to 6 FelSyncLen Defines the length of the Sync bytes. Value Sync- bytes in hex 00 B2 4D 01 00 B2 4D 10 00 00 B2 4D 11 00 00 00 B2 4D 5 to 0 DataLenMin These bits define the minimum length of the accepted packet length: DataLenMin * 4  data packet length This parameter is ignored at 106 kbit if the bit DetectSync in register ModeReg is set to logic 0. If a received data packet is shorter than the defined DataLenMin value, the data packet will be ignored. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 47 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.12 FelNFC2Reg Defines the maximum length of the received packet. Table 69. FelNFC2Reg register (address1Bh); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 WaitForSelected ShortTimeSlot DataLenMax Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 70. Description of FelNFC2Reg bits Bit Symbol Description 7 WaitForSelected Set to logic 1, the AutoColl command is only terminated automatically when: 1. A valid command has been received after performing a valid Select procedure according ISO/IEC 14443A. 2. A valid command has been received after performing a valid Polling procedure according to the FeliCa specification. Note: If this bit is set, no active communication is possible. Note: Setting this bit reduces the host controller interaction in case of a communication to another device in the same RF field during Passive Communication mode. 6 ShortTimeSlot Defines the time slot length for Passive Communication mode at 424 kbit. Set to logic 1 a short time slot is used (half of the timeslot at 212 kbit). Set to logic 0 a long timeslot is used (equal to the timeslot for 212 kbit). 5 to 0 DataLenMax These bits define the maximum length of the accepted packet length: DataLenMax * 4  data packet length Note: If set to logic 0 the maximum data length is 256 bytes. This parameter is ignored at 106 kbit if the bit DetectSync in register ModeReg is set to logic 0. If a received packet is larger than the defined DataLenMax value, the packet will be ignored. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 48 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.13 MifNFCReg Defines ISO/IEC 14443A/MIFARE/NFC specific settings in target or Card Operating mode. Table 71. MifNFCReg register (address 1Ch); reset value: 62h, 01100010b 7 6 5 4 3 2 1 0 SensMiller TauMiller MFHalted TxWait Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 72. Description of MifNFCReg bits Bit Symbol Description 7 to 5 SensMiller These bits define the sensitivity of the Miller decoder. 4 to 3 TauMiller These bits define the time constant of the Miller decoder. 2 MFHalted Set to logic 1, this bit indicates that the PN512 is set to HALT mode in Card Operation mode at 106 kbit. This bit is either set by the host controller or by the internal state machine and indicates that only the code 52h is accepted as a request command. This bit is cleared automatically by a RF reset. 1 to 0 TxWait These bits define the minimum response time between receive and transmit in number of data bits + 7 data bits. The shortest possible minimum response time is 7 data bits. (TxWait=0). The minimum response time can be increased by the number of bits defined in TxWait. The longest minimum response time is 10 data bits (TxWait = 3). If a transmission of a frame is started before the minimum response time is over, the PN512 waits before transmitting the data until the minimum response time is over. If a transmission of a frame is started after the minimum response time is over, the frame is started immediately if the data bit synchronization is correct. (adjustable with TxBitPhase). PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 49 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.14 ManualRCVReg Allows manual fine tuning of the internal receiver. Remark: For standard applications it is not recommended to change this register settings. Table 73. ManualRCVReg register (address 1Dh); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 0 FastFilt MF_SO Delay MF_SO Parity Disable LargeBW PLL Manual HPCF HPFC Access Rights RFU r/w r/w r/w r/w r/w r/w r/w Table 74. Description of ManualRCVReg bits Bit Symbol Description 7 - Reserved for future use. 6 FastFilt MF_SO If this bit is set to logic 1, the internal filter for the Miller-Delay Circuit is set to Fast mode. Note: This bit should only set to logic 1, if Millerpulses of less than 400 ns Pulse length are expected. At 106 kBaud the typical value is 3 us. 5 Delay MF_SO If this bit is set to logic 1, the Signal at SIGOUT-pin is delayed, so that in SAM mode the Signal at SIGIN must be 128/fc faster compared to the ISO/IEC 14443A, to reach the ISO/IEC 14443A restrictions on the RF-Field. Note: This delay shall only be activated for setting bits SigOutSel to (1110b) or (1111b) in register TxSelReg. 4 Parity Disable If this bit is set to logic 1, the generation of the Parity bit for transmission and the Parity-Check for receiving is switched off. The received Parity bit is handled like a data bit. 3 LargeBWPLL Set to logic 1, the bandwidth of the internal PLL used for clock recovery is extended. 2 ManualHPCF Set to logic 0, the HPCF bits are ignored and the HPCF settings are adapted automatically to the receiving mode. Set to logic 1, values of HPCF are valid. 1 to 0 HPFC Selects the High Pass Corner Frequency (HPCF) of the filter in the internal receiver chain 00 For signals with frequency spectrum down to 106 kHz. 01 For signals with frequency spectrum down to 212 kHz. 10 For signals with frequency spectrum down to 424 kHz. 11 For signals with frequency spectrum down to 848 kHz PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 50 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.2.15 TypeBReg 9.2.2.16 SerialSpeedReg Selects the speed of the serial UART interface. Table 75. TypeBReg register (address 1Eh); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 RxSOF Req RxEOF Req 0 EOFSO FWidth NoTxSOF NoTxEOF TxEGT Access Rights r/w r/w RFU r/w r/w r/w r/w r/w Table 76. Description of TypeBReg bits Bit Symbol Description 7 RxSOFReq If this bit is set to logic 1, the SOF is required. A datastream starting without SOF is ignored. If this bit is cleared, a datastream with and without SOF is accepted. The SOF will be removed and not written into the FIFO. 6 RxEOFReq If this bit is set to logic 1, the EOF is required. A datastream ending without EOF will generate a Protocol-Error. If this bit is cleared, a datastream with and without EOF is accepted. The EOF will be removed and not written into the FIFO. For the behaviour in version 1.0, see Section 21 “Errata sheet” on page 109. 5 - Reserved for future use. 4 EOFSOFWidth If this bit is set to logic 1 and EOFSOFAdjust bit is logic 0, the SOF and EOF will have the maximum length defined in ISO/IEC 14443B. If this bit is cleared and EOFSOFAdjust bit is logic 0, the SOF and EOF will have the minimum length defined in ISO/IEC 14443B. If this bit is set to 1 and the EOFSOFadjust bit is logic 1 will result in SOF low = (11etu  8 cycles)/fc SOF high = (2 etu + 8 cycles)/fc EOF low = (11 etu  8 cycles)/fc If this bit is set to 0 and the EOFSOFAdjust bit is logic 1 will result in an incorrect system behavior in respect to ISO specification. For the behaviour in version 1.0, see Section 21 “Errata sheet” on page 109. 3 NoTxSOF If this bit is set to logic 1, the generation of the SOF is suppressed. 2 NoTxEOF If this bit is set to logic 1, the generation of the EOF is suppressed. 1 to 0 TxEGT These bits define the length of the EGT. Value Description 00 0 bit 01 1 bit 10 2 bits 11 3 bits PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 51 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Table 77. SerialSpeedReg register (address 1Fh); reset value: EBh, 11101011b 7 6 5 4 3 2 1 0 BR_T0 BR_T1 Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 78. Description of SerialSpeedReg bits Bit Symbol Description 7 to 5 BR_T0 Factor BR_T0 to adjust the transfer speed, for description see Section 10.3.2 “Selectable UART transfer speeds”. 3 to 0 BR_T1 Factor BR_T1 to adjust the transfer speed, for description see Section 10.3.2 “Selectable UART transfer speeds”. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 52 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3 Page 2: Configuration 9.2.3.1 PageReg Selects the register page. 9.2.3.2 CRCResultReg Shows the actual MSB and LSB values of the CRC calculation. Note: The CRC is split into two 8-bit register. Note: Setting the bit MSBFirst in ModeReg register reverses the bit order, the byte order is not changed. Table 79. PageReg register (address 20h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 UsePageSelect 0 0 0 0 0 PageSelect Access Rights r/w RFU RFU RFU RFU RFU r/w r/w Table 80. Description of PageReg bits Bit Symbol Description 7 UsePageSelect Set to logic 1, the value of PageSelect is used as register address A5 and A4. The LSB-bits of the register address are defined by the address pins or the internal address latch, respectively. Set to logic 0, the whole content of the internal address latch defines the register address. The address pins are used as described in Section 10.1 “Automatic microcontroller interface detection”. 6 to 2 - Reserved for future use. 1 to 0 PageSelect The value of PageSelect is used only if UsePageSelect is set to logic 1. In this case, it specifies the register page (which is A5 and A4of the register address). Table 81. CRCResultReg register (address 21h); reset value: FFh, 11111111b 7 6 5 4 3 2 1 0 CRCResultMSB Access Rights r r r r r r r r Table 82. Description of CRCResultReg bits Bit Symbol Description 7 to 0 CRCResultMSB This register shows the actual value of the most significant byte of the CRCResultReg register. It is valid only if bit CRCReady in register Status1Reg is set to logic 1. Table 83. CRCResultReg register (address 22h); reset value: FFh, 11111111b 7 6 5 4 3 2 1 0 CRCResultLSB Access Rights r r r r r r r r Table 84. Description of CRCResultReg bits Bit Symbol Description 7 to 0 CRCResultLSB This register shows the actual value of the least significant byte of the CRCResult register. It is valid only if bit CRCReady in register Status1Reg is set to logic 1. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 53 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3.3 GsNOffReg Selects the conductance for the N-driver of the antenna driver pins TX1 and TX2 when the driver is switched off. Table 85. GsNOffReg register (address 23h); reset value: 88h, 10001000b 7 6 5 4 3 2 1 0 CWGsNOff ModGsNOff Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 86. Description of GsNOffReg bits Bit Symbol Description 7 to 4 CWGsNOff The value of this register defines the conductance of the output N-driver during times of no modulation. Note: The conductance value is binary weighted. Note: During soft Power-down mode the highest bit is forced to 1. Note: The value of the register is only used if the driver is switched off. Otherwise the bit value CWGsNOn of register GsNOnReg is used. Note: This value is used for LoadModulation. 3 to 0 ModGsNOff The value of this register defines the conductance of the output N-driver for the time of modulation. This may be used to regulate the modulation index. Note: The conductance value is binary weighted. Note: During soft Power-down mode the highest bit is forced to 1. Note: The value of the register is only used if the driver is switched off. Otherwise the bit value ModGsNOn of register GsNOnReg is used Note: This value is used for LoadModulation. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 54 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3.4 ModWidthReg Controls the modulation width settings. 9.2.3.5 TxBitPhaseReg Adjust the bitphase at 106 kbit during transmission. Table 87. ModWidthReg register (address 24h); reset value: 26h, 00100110b 7 6 5 4 3 2 1 0 ModWidth Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 88. Description of ModWidthReg bits Bit Symbol Description 7 to 0 ModWidth These bits define the width of the Miller modulation as initiator in Active and Passive Communication mode as multiples of the carrier frequency (ModWidth + 1/fc). The maximum value is half the bit period. Acting as a target in Passive Communication mode at 106 kbit or in Card Operating mode for ISO/IEC 14443A/MIFARE these bits are used to change the duty cycle of the subcarrier frequency. The resulting number of carrier periods are calculated according to the following formulas: LOW value: #clocksLOW = (ModWidth modulo 8) + 1. HIGH value: #clocksHIGH = 16-#clocksLOW. Table 89. TxBitPhaseReg register (address 25h); reset value: 87h, 10000111b 7 6 5 4 3 2 1 0 RcvClkChange TxBitPhase Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 90. Description of TxBitPhaseReg bits Bit Symbol Description 7 RcvClkChange Set to logic 1, the demodulator’s clock is derived by the external RF field. 6 to 0 TxBitPhase These bits are representing the number of carrier frequency clock cycles, which are added to the waiting period before transmitting data in all communication modes. TXBitPhase is used to adjust the TX bit synchronization during passive NFCIP-1 communication mode at 106 kbit and in ISO/IEC 14443A/MIFARE card mode. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 55 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3.6 RFCfgReg Configures the receiver gain and RF level detector sensitivity. Table 91. RFCfgReg register (address 26h); reset value: 48h, 01001000b 7 6 5 4 3 2 1 0 RFLevelAmp RxGain RFLevel Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 92. Description of RFCfgReg bits Bit Symbol Description 7 RFLevelAmp Set to logic 1, this bit activates the RF level detectors’ amplifier. 6 to 4 RxGain This register defines the receivers signal voltage gain factor: Value Description 000 18 dB 001 23 dB 010 18 dB 011 23 dB 100 33 dB 101 38 dB 110 43 dB 111 48 dB 3 to 0 RFLevel Defines the sensitivity of the RF level detector, for description see Section 12.3 “RF level detector”. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 56 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3.7 GsNOnReg Selects the conductance for the N-driver of the antenna driver pins TX1 and TX2 when the driver is switched on. 9.2.3.8 CWGsPReg Defines the conductance of the P-driver during times of no modulation Table 93. GsNOnReg register (address 27h); reset value: 88h, 10001000b 7 6 5 4 3 2 1 0 CWGsNOn ModGsNOn Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 94. Description of GsNOnReg bits Bit Symbol Description 7 to 4 CWGsNOn The value of this register defines the conductance of the output N-driver during times of no modulation. This may be used to regulate the output power and subsequently current consumption and operating distance. Note: The conductance value is binary weighted. Note: During soft Power-down mode the highest bit is forced to 1. Note: This value is only used if the driver TX1 or TX2 are switched on. Otherwise the value of the bits CWGsNOff of register GsNOffReg is used. 3 to 0 ModGsNOn The value of this register defines the conductance of the output N-driver for the time of modulation. This may be used to regulate the modulation index. Note: The conductance value is binary weighted. Note: During soft Power-down mode the highest bit is forced to 1. Note: This value is only used if the driver TX1 or Tx2 are switched on. Otherwise the value of the bits ModsNOff of register GsNOffReg is used. Table 95. CWGsPReg register (address 28h); reset value: 20h, 00100000b 7 6 5 4 3 2 1 0 0 0 CWGsP Access Rights RFU RFU r/w r/w r/w r/w r/w r/w Table 96. Description of CWGsPReg bits Bit Symbol Description 7 to 6 - Reserved for future use. 5 to 0 CWGsP The value of this register defines the conductance of the output P-driver. This may be used to regulate the output power and subsequently current consumption and operating distance. Note: The conductance value is binary weighted. Note: During soft Power-down mode the highest bit is forced to 1. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 57 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3.9 ModGsPReg Defines the driver P-output conductance during modulation. [1] If Force100ASK is set to logic 1, the value of ModGsP has no effect. 9.2.3.10 TMode Register, TPrescaler Register Defines settings for the timer. Note: The Prescaler value is split into two 8-bit registers Table 97. ModGsPReg register (address 29h); reset value: 20h, 00100000b 7 6 5 4 3 2 1 0 0 0 ModGsP Access Rights RFU RFU r/w r/w r/w r/w r/w r/w Table 98. Description of ModGsPReg bits Bit Symbol Description 7 to 6 - Reserved for future use. 5 to 0 ModGsP[1] The value of this register defines the conductance of the output P-driver for the time of modulation. This may be used to regulate the modulation index. Note: The conductance value is binary weighted. Note: During soft Power-down mode the highest bit is forced to 1. Table 99. TModeReg register (address 2Ah); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TAuto TGated TAutoRestart TPrescaler_Hi Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 100. Description of TModeReg bits Bit Symbol Description 7 TAuto Set to logic 1, the timer starts automatically at the end of the transmission in all communication modes at all speeds or when bit InitialRFOn is set to logic 1 and the RF field is switched on. In mode MIFARE and ISO14443-B 106kbit/s the timer stops after the 5th bit (1 startbit, 4 databits) if the bit RxMultiple in the register RxModeReg is not set. In all other modes, the timer stops after the 4th bit if the bit RxMultiple the register RxModeReg is not set. If RxMultiple is set to logic 1, the timer never stops. In this case the timer can be stopped by setting the bit TStopNow in register ControlReg to 1. Set to logic 0 indicates, that the timer is not influenced by the protocol. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 58 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 6 to 5 TGated The internal timer is running in gated mode. Note: In the gated mode, the bit TRunning is 1 when the timer is enabled by the register bits. This bit does not influence the gating signal. Value Description 00 Non gated mode 01 Gated by SIGIN 10 Gated by AUX1 11 Gated by A3 4 TAutoRestart Set to logic 1, the timer automatically restart its count-down from TReloadValue, instead of counting down to zero. Set to logic 0 the timer decrements to ZERO and the bit TimerIRq is set to logic 1. 3 to 0 TPrescaler_Hi Defines higher 4 bits for TPrescaler. The following formula is used to calculate fTimer if TPrescalEven bit in Demot Reg is set to logic 0: fTimer = 13.56 MHz/(2*TPreScaler+1). Where TPreScaler = [TPrescaler_Hi:TPrescaler_Lo] (TPrescaler value on 12 bits) (Default TPrescalEven is logic 0) The following formula is used to calculate fTimer if TPrescalEven bit in Demot Reg is set to logic 1: fTimer = 13.56 MHz/(2*TPreScaler+2). For detailed description see Section 15 “Timer unit”. For the behaviour within version 1.0, see Section 21 “Errata sheet” on page 109. Table 101. TPrescalerReg register (address 2Bh); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TPrescaler_Lo Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 102. Description of TPrescalerReg bits Bit Symbol Description 7 to 0 TPrescaler_Lo Defines lower 8 bits for TPrescaler. The following formula is used to calculate fTimer if TPrescalEven bit in Demot Reg is set to logic 0: fTimer = 13.56 MHz/(2*TPreScaler+1). Where TPreScaler = [TPrescaler_Hi:TPrescaler_Lo] (TPrescaler value on 12 bits) The following formula is used to calculate fTimer if TPrescalEven bit in Demot Reg is set to logic 1: fTimer = 13.56 MHz/(2*TPreScaler+2). Where TPreScaler = [TPrescaler_Hi:TPrescaler_Lo] (TPrescaler value on 12 bits) For detailed description see Section 15 “Timer unit”. Table 100. Description of TModeReg bits …continued Bit Symbol Description PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 59 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3.11 TReloadReg Describes the 16-bit long timer reload value. Note: The Reload value is split into two 8-bit registers. Table 103. TReloadReg (Higher bits) register (address 2Ch); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TReloadVal_Hi Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 104. Description of the higher TReloadReg bits Bit Symbol Description 7 to 0 TReloadVal_Hi Defines the higher 8 bits for the TReloadReg. With a start event the timer loads the TReloadVal. Changing this register affects the timer only at the next start event. Table 105. TReloadReg (Lower bits) register (address 2Dh); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TReloadVal_Lo Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 106. Description of lower TReloadReg bits Bit Symbol Description 7 to 0 TReloadVal_Lo Defines the lower 8 bits for the TReloadReg. With a start event the timer loads the TReloadVal. Changing this register affects the timer only at the next start event. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 60 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.3.12 TCounterValReg Contains the current value of the timer. Note: The Counter value is split into two 8-bit register. 9.2.4 Page 3: Test 9.2.4.1 PageReg Selects the register page. Table 107. TCounterValReg (Higher bits) register (address 2Eh); reset value: XXh, XXXXXXXXb 7 6 5 4 3 2 1 0 TCounterVal_Hi Access Rights r r r r r r r r Table 108. Description of the higher TCounterValReg bits Bit Symbol Description 7 to 0 TCounterVal_Hi Current value of the timer, higher 8 bits. Table 109. TCounterValReg (Lower bits) register (address 2Fh); reset value: XXh, XXXXXXXXb 7 6 5 4 3 2 1 0 TCounterVal_Lo Access Rights r r r r r r r r Table 110. Description of lower TCounterValReg bits Bit Symbol Description 7 to 0 TCounterVal_Lo Current value of the timer, lower 8 bits. Table 111. PageReg register (address 30h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 UsePageSelect 0 0 0 0 0 PageSelect Access Rights r/w RFU RFU RFU RFU RFU r/w r/w PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 61 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Table 112. Description of PageReg bits Bit Symbol Description 7 UsePageSelect Set to logic 1, the value of PageSelect is used as register address A5 and A4. The LSB-bits of the register address are defined by the address pins or the internal address latch, respectively. Set to logic 0, the whole content of the internal address latch defines the register address. The address pins are used as described in Section 10.1 “Automatic microcontroller interface detection”. 6 to 2 - Reserved for future use. 1 to 0 PageSelect The value of PageSelect is used only if UsePageSelect is set to logic 1. In this case, it specifies the register page (which is A5 and A4 of the register address). PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 62 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.4.2 TestSel1Reg General test signal configuration. 9.2.4.3 TestSel2Reg General test signal configuration and PRBS control Table 113. TestSel1Reg register (address 31h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 - - SAMClockSel SAMClkD1 TstBusBitSel Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 114. Description of TestSel1Reg bits Bit Symbol Description 7 to 6 - Reserved for future use. 5 to 4 SAMClockSel Defines the source for the 13.56 MHz SAM clock Value Description 00 GND- Sam Clock switched off 01 clock derived by the internal oscillator 10 internal UART clock 11 clock derived by the RF field 3 SAMClkD1 Set to logic 1, the SAM clock is delivered to D1. Note: Only possible if the 8bit parallel interface is not used. 2 to 0 TstBusBitSel Select the TestBus bit from the testbus to be propagated to SIGOUT. Table 115. TestSel2Reg register (address 32h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 TstBusFlip PRBS9 PRBS15 TestBusSel Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 116. Description of TestSel2Reg bits Bit Symbol Description 7 TstBusFlip If set to logic 1, the testbus is mapped to the parallel port by the following order: D4, D3, D2, D6, D5, D0, D1. See Section 20 “Testsignals”. 6 PRBS9 Starts and enables the PRBS9 sequence according ITU-TO150. Note: All relevant registers to transmit data have to be configured before entering PRBS9 mode. Note: The data transmission of the defined sequence is started by the send command. 5 PRBS15 Starts and enables the PRBS15 sequence according ITU-TO150. Note: All relevant registers to transmit data have to be configured before entering PRBS15 mode. Note: The data transmission of the defined sequence is started by the send command. 4 to 0 TestBusSel Selects the testbus. See Section 20 “Testsignals” PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 63 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.4.4 TestPinEnReg Enables the pin output driver on the 8-bit parallel bus. 9.2.4.5 TestPinValueReg Defines the values for the 7-bit parallel port when it is used as I/O. Table 117. TestPinEnReg register (address 33h); reset value: 80h, 10000000b 7 6 5 4 3 2 1 0 RS232LineEn TestPinEn Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 118. Description of TestPinEnReg bits Bit Symbol Description 7 RS232LineEn Set to logic 0, the lines MX and DTRQ for the serial UART are disabled. 6 to 0 TestPinEn Enables the pin output driver on the 8-bit parallel interface. Example: Setting bit 0 to 1 enables D0 Setting bit 5 to 1 enables D5 Note: Only valid if one of serial interfaces is used. If the SPI interface is used only D0 to D4 can be used. If the serial UART interface is used and RS232LineEn is set to logic 1 only D0 to D4 can be used. Table 119. TestPinValueReg register (address 34h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 UseIO TestPinValue Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 120. Description of TestPinValueReg bits Bit Symbol Description 7 UseIO Set to logic 1, this bit enables the I/O functionality for the 7-bit parallel port in case one of the serial interfaces is used. The input/output behavior is defined by TestPinEn in register TestPinEnReg. The value for the output behavior is defined in the bits TestPinVal. Note: If SAMClkD1 is set to logic 1, D1 can not be used as I/O. 6 to 0 TestPinValue Defines the value of the 7-bit parallel port, when it is used as I/O. Each output has to be enabled by the TestPinEn bits in register TestPinEnReg. Note: Reading the register indicates the actual status of the pins D6 - D0 if UseIO is set to logic 1. If UseIO is set to logic 0, the value of the register TestPinValueReg is read back. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 64 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.4.6 TestBusReg Shows the status of the internal testbus. 9.2.4.7 AutoTestReg Controls the digital selftest. 9.2.4.8 VersionReg Shows the version. Table 121. TestBusReg register (address 35h); reset value: XXh, XXXXXXXXb 7 6 5 4 3 2 1 0 TestBus Access Rights r r r r r r r r Table 122. Description of TestBusReg bits Bit Symbol Description 7 to 0 TestBus Shows the status of the internal testbus. The testbus is selected by the register TestSel2Reg. See Section 20 “Testsignals”. Table 123. AutoTestReg register (address 36h); reset value: 40h, 01000000b 7 6 5 4 3 2 1 0 0 AmpRcv EOFSO FAdjust - SelfTest Access Rights RFT r/w RFU RFU r/w r/w r/w r/w Table 124. Description of bits Bit Symbol Description 7 - Reserved for production tests. 6 AmpRcv If set to logic 1, the internal signal processing in the receiver chain is performed non-linear. This increases the operating distance in communication modes at 106 kbit. Note: Due to the non linearity the effect of the bits MinLevel and CollLevel in the register RxThreshholdReg are as well non linear. 5 EOFSOFAdjust If set to logic 0 and the EOFSOFwidth is set to 1 will result in the Maximum length of SOF and EOF according to ISO/IEC14443B If set to logic 0 and the EOFSOFwidth is set to 0 will result in the Minimum length of SOF and EOF according to ISO/IEC14443B If this bit is set to 1 and the EOFSOFwidth bit is logic 1 will result in SOF low = (11 etu  8 cycles)/fc SOF high = (2 etu + 8 cycles)/fc EOF low = (11 etu  8 cycles)/fc For the behaviour in version 1.0, see Section 21 “Errata sheet” on page 109. 4 - Reserved for future use. 3 to 0 SelfTest Enables the digital self test. The selftest can be started by the selftest command in the command register. The selftest is enabled by 1001. Note: For default operation the selftest has to be disabled by 0000. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 65 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Table 125. VersionReg register (address 37h); reset value: XXh, XXXXXXXXb 7 6 5 4 3 2 1 0 Version Access Rights r r r r r r r r Table 126. Description of VersionReg bits Bit Symbol Description 7 to 0 Version 80h indicates PN512 version 1.0, differences to version 2.0 are described within Section 21 “Errata sheet” on page 109. 82h indicates PN512 version 2.0, which covers also the industrial version. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 66 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.4.9 AnalogTestReg Controls the pins AUX1 and AUX2 Table 127. AnalogTestReg register (address 38h); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 AnalogSelAux1 AnalogSelAux2 Access Rights r/w r/w r/w r/w r/w r/w r/w r/w Table 128. Description of AnalogTestReg bits Bit Symbol Description 7 to 4 3 to 0 AnalogSelAux1 AnalogSelAux2 Controls the AUX pin. Note: All test signals are described in Section 20 “Testsignals”. Value Description 0000 Tristate 0001 Output of TestDAC1 (AUX1), output of TESTDAC2 (AUX2) Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 0010 Testsignal Corr1 Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 0011 Testsignal Corr2 Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 0100 Testsignal MinLevel Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 0101 Testsignal ADC channel I Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 0110 Testsignal ADC channel Q Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 0111 Testsignal ADC channel I combined with Q Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 1000 Testsignal for production test Note: Current output. The use of 1 k pull-down resistor on AUX is recommended. 1001 SAM clock (13.56 MHz) 1010 HIGH 1011 LOW 1100 TxActive At 106 kbit: HIGH during Startbit, Data bit, Parity and CRC. At 212 and 424 kbit: High during Preamble, Sync, Data and CRC. 1101 RxActive At 106 kbit: High during databit, Parity and CRC. At 212 and 424 kbit: High during data and CRC. 1110 Subcarrier detected 106 kbit: not applicable 212 and 424 kbit: High during last part of Preamble, Sync data and CRC 1111 TestBus-Bit as defined by the TstBusBitSel in register TestSel1Reg. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 67 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.4.10 TestDAC1Reg Defines the testvalues for TestDAC1. 9.2.4.11 TestDAC2Reg Defines the testvalue for TestDAC2. 9.2.4.12 TestADCReg Shows the actual value of ADC I and Q channel. Table 129. TestDAC1Reg register (address 39h); reset value: XXh, 00XXXXXXb 7 6 5 4 3 2 1 0 0 0 TestDAC1 Access Rights RFT RFU r/w r/w r/w r/w r/w r/w Table 130. Description of TestDAC1Reg bits Bit Symbol Description 7 - Reserved for production tests. 6 - Reserved for future use. 5 to 0 TestDAC1 Defines the testvalue for TestDAC1. The output of the DAC1 can be switched to AUX1 by setting AnalogSelAux1 to 0001 in register AnalogTestReg. Table 131. TestDAC2Reg register (address 3Ah); reset value: XXh, 00XXXXXXb 7 6 5 4 3 2 1 0 0 0 TestDAC2 Access Rights RFU RFU r/w r/w r/w r/w r/w r/w Table 132. Description ofTestDAC2Reg bits Bit Symbol Description 7 to 6 - Reserved for future use. 5 to 0 TestDAC2 Defines the testvalue for TestDAC2. The output of the DAC2 can be switched to AUX2 by setting AnalogSelAux2 to 0001 in register AnalogTestReg. Table 133. TestADCReg register (address 3Bh); reset value: XXh, XXXXXXXXb 7 6 5 4 3 2 1 0 ADC_I ADC_Q Access Rights Table 134. Description of TestADCReg bits Bit Symbol Description 7 to 4 ADC_I Shows the actual value of ADC I channel. 3 to 0 ADC_Q Shows the actual value of ADC Q channel. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 68 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 9.2.4.13 RFTReg 10. Digital interfaces 10.1 Automatic microcontroller interface detection The PN512 supports direct interfacing of hosts using SPI, I2C-bus or serial UART interfaces. The PN512 resets its interface and checks the current host interface type automatically after performing a power-on or hard reset. The PN512 identifies the host interface by sensing the logic levels on the control pins after the reset phase. This is done using a combination of fixed pin connections. Table 141 shows the different connection configurations. Table 135. RFTReg register (address 3Ch); reset value: FFh, 11111111b 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 Access Rights RFT RFT RFT RFT RFT RFT RFT RFT Table 136. Description of RFTReg bits Bit Symbol Description 7 to 0 - Reserved for production tests. Table 137. RFTReg register (address 3Dh, 3Fh); reset value: 00h, 00000000b 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 Access Rights RFT RFT RFT RFT RFT RFT RFT RFT Table 138. Description of RFTReg bits Bit Symbol Description 7 to 0 - Reserved for production tests. Table 139. RFTReg register (address 3Eh); reset value: 03h, 00000011b 7 6 5 4 3 2 1 0 0 0 0 0 0 0 1 1 Access Rights RFT RFT RFT RFT RFT RFT RFT RFT Table 140. Description of RFTReg bits Bit Symbol Description 7 to 0 - Reserved for production tests. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 69 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution [1] only available in HVQFN 40. Table 141. Connection protocol for detecting different interface types Pin Interface type UART (input) SPI (output) I2C-bus (I/O) SDA RX NSS SDA I2C 0 0 1 EA 0 1 EA D7 TX MISO SCL D6 MX MOSI ADR_0 D5 DTRQ SCK ADR_1 D4 - - ADR_2 D3 - - ADR_3 D2 - - ADR_4 D1 - - ADR_5 Table 142. Connection scheme for detecting the different interface types PN512 Parallel Interface Type Serial Interface Types Separated Read/Write Strobe Common Read/Write Strobe Pin Dedicated Address Bus Multiplexed Address Bus Dedicated Address Bus Multiplexed Address Bus UART SPI I2C ALE 1 ALE 1 AS RX NSS SDA A5[1] A5 0 A5 0 0 0 0 A4[1] A4 0 A4 0 0 0 0 A3[1] A3 0 A3 0 0 0 0 A2[1] A2 1 A2 1 0 0 0 A1 A1 1 A1 1 0 0 1 A0 A0 1 A0 0 0 1 EA NRD[1] NRD NRD NDS NDS 1 1 1 NWR[1] NWR NWR RD/NWR RD/NWR 1 1 1 NCS[1] NCS NCS NCS NCS NCS NCS NCS D7 D7 D7 D7 D7 TX MISO SCL D6 D6 D6 D6 D6 MX MOSI ADR_0 D5 D5 AD5 D5 AD5 DTRQ SCK ADR_1 D4 D4 AD4 D4 AD4 - - ADR_2 D3 D3 AD3 D3 AD3 - - ADR_3 D2 D2 AD2 D2 AD2 - - ADR_4 D1 D1 AD1 D1 AD1 - - ADR_5 D0 D0 AD0 D0 AD0 - - ADR_6 Remark: Overview on the pin behavior Pin behavior Input Output In/Out PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 70 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 10.2 Serial Peripheral Interface A serial peripheral interface (SPI compatible) is supported to enable high-speed communication to the host. The interface can handle data speeds up to 10 Mbit/s. When communicating with a host, the PN512 acts as a slave, receiving data from the external host for register settings, sending and receiving data relevant for RF interface communication. An interface compatible with SPI enables high-speed serial communication between the PN512 and a microcontroller. The implemented interface is in accordance with the SPI standard. The timing specification is given in Section 26.1 on page 117. The PN512 acts as a slave during SPI communication. The SPI clock signal SCK must be generated by the master. Data communication from the master to the slave uses the MOSI line. The MISO line is used to send data from the PN512 to the master. Data bytes on both MOSI and MISO lines are sent with the MSB first. Data on both MOSI and MISO lines must be stable on the rising edge of the clock and can be changed on the falling edge. Data is provided by the PN512 on the falling clock edge and is stable during the rising clock edge. 10.2.1 SPI read data Reading data using SPI requires the byte order shown in Table 143 to be used. It is possible to read out up to n-data bytes. The first byte sent defines both the mode and the address. [1] X = Do not care. Remark: The MSB must be sent first. 10.2.2 SPI write data To write data to the PN512 using SPI requires the byte order shown in Table 144. It is possible to write up to n data bytes by only sending one address byte. Fig 13. SPI connection to host 001aan220 PN512 SCK SCK MOSI MOSI MISO MISO NSS NSS Table 143. MOSI and MISO byte order Line Byte 0 Byte 1 Byte 2 To Byte n Byte n + 1 MOSI address 0 address 1 address 2 ... address n 00 MISO X[1] data 0 data 1 ... data n  1 data n PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 71 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution The first send byte defines both the mode and the address byte. [1] X = Do not care. Remark: The MSB must be sent first. 10.2.3 SPI address byte The address byte has to meet the following format. The MSB of the first byte defines the mode used. To read data from the PN512 the MSB is set to logic 1. To write data to the PN512 the MSB must be set to logic 0. Bits 6 to 1 define the address and the LSB is set to logic 0. 10.3 UART interface 10.3.1 Connection to a host Remark: Signals DTRQ and MX can be disabled by clearing TestPinEnReg register’s RS232LineEn bit. 10.3.2 Selectable UART transfer speeds The internal UART interface is compatible with an RS232 serial interface. The default transfer speed is 9.6 kBd. To change the transfer speed, the host controller must write a value for the new transfer speed to the SerialSpeedReg register. Bits BR_T0[2:0] and BR_T1[4:0] define the factors for setting the transfer speed in the SerialSpeedReg register. The BR_T0[2:0] and BR_T1[4:0] settings are described in Table 10. Examples of different transfer speeds and the relevant register settings are given in Table 11. Table 144. MOSI and MISO byte order Line Byte 0 Byte 1 Byte 2 To Byte n Byte n + 1 MOSI address 0 data 0 data 1 ... data n  1 data n MISO X[1] X[1] X[1] ... X[1] X[1] Table 145. Address byte 0 register; address MOSI 7 (MSB) 6 5 4 3 2 1 0 (LSB) 1 = read 0 = write address 0 Fig 14. UART connection to microcontrollers 001aan221 PN512 RX RX TX TX DTRQ DTRQ MX MX PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 72 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution [1] The resulting transfer speed error is less than 1.5 % for all described transfer speeds. The selectable transfer speeds shown in Table 11 are calculated according to the following equations: If BR_T0[2:0] = 0: (1) If BR_T0[2:0] > 0: (2) Remark: Transfer speeds above 1228.8 kBd are not supported. 10.3.3 UART framing Table 146. BR_T0 and BR_T1 settings BR_Tn Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 BR_T0 factor 1 1 2 4 8 16 32 64 BR_T1 range 1 to 32 33 to 64 33 to 64 33 to 64 33 to 64 33 to 64 33 to 64 33 to 64 Table 147. Selectable UART transfer speeds Transfer speed (kBd) SerialSpeedReg value Transfer speed accuracy (%)[1] Decimal Hexadecimal 7.2 250 FAh 0.25 9.6 235 EBh 0.32 14.4 218 DAh 0.25 19.2 203 CBh 0.32 38.4 171 ABh 0.32 57.6 154 9Ah 0.25 115.2 122 7Ah 0.25 128 116 74h 0.06 230.4 90 5Ah 0.25 460.8 58 3Ah 0.25 921.6 28 1Ch 1.45 1228.8 21 15h 0.32 transfer speed 27.12  106 BR_T0 + 1 = ------------------------------- transfer speed 27.12  106 BR_T1 + 33 2BR_T0 – 1 ----------------------------------- -----------------------------------           = Table 148. UART framing Bit Length Value Start 1-bit 0 Data 8 bits data Stop 1-bit 1 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 73 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Remark: The LSB for data and address bytes must be sent first. No parity bit is used during transmission. Read data: To read data using the UART interface, the flow shown in Table 149 must be used. The first byte sent defines both the mode and the address. Write data: To write data to the PN512 using the UART interface, the structure shown in Table 150 must be used. The first byte sent defines both the mode and the address. Table 149. Read data byte order Pin Byte 0 Byte 1 RX (pin 24) address - TX (pin 31) - data 0 (1) Reserved. Fig 15. UART read data timing diagram 001aak588 SA ADDRESS RX TX MX DTRQ A0 A1 A2 A3 A4 A5 (1) SO SA D0 D1 D2 D3 D4 D5 D6 D7 SO DATA R/W Table 150. Write data byte order Pin Byte 0 Byte 1 RX (pin 24) address 0 data 0 TX (pin 31) - address 0 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 74 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Remark: The data byte can be sent directly after the address byte on pin RX. Address byte: The address byte has to meet the following format: (1) Reserved. Fig 16. UART write data timing diagram 001aak589 SA ADDRESS RX TX MX DTRQ A0 A1 A2 A3 A4 A5 (1) SO SA D0 D1 D2 D3 D4 D5 D6 D7 SO SA A0 A1 A2 A3 A4 A5 (1) SO DATA ADDRESS R/W R/W PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 75 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution The MSB of the first byte sets the mode used. To read data from the PN512, the MSB is set to logic 1. To write data to the PN512 the MSB is set to logic 0. Bit 6 is reserved for future use, and bits 5 to 0 define the address; see Table 151. 10.4 I2C Bus Interface An I2C-bus (Inter-IC) interface is supported to enable a low-cost, low pin count serial bus interface to the host. The I2C-bus interface is implemented according to NXP Semiconductors’ I2C-bus interface specification, rev. 2.1, January 2000. The interface can only act in Slave mode. Therefore the PN512 does not implement clock generation or access arbitration. The PN512 can act either as a slave receiver or slave transmitter in Standard mode, Fast mode and High-speed mode. SDA is a bidirectional line connected to a positive supply voltage using a current source or a pull-up resistor. Both SDA and SCL lines are set HIGH when data is not transmitted. The PN512 has a 3-state output stage to perform the wired-AND function. Data on the I2C-bus can be transferred at data rates of up to 100 kBd in Standard mode, up to 400 kBd in Fast mode or up to 3.4 Mbit/s in High-speed mode. If the I2C-bus interface is selected, spike suppression is activated on lines SCL and SDA as defined in the I2C-bus interface specification. See Table 171 on page 117 for timing requirements. Table 151. Address byte 0 register; address MOSI 7 (MSB) 6 5 4 3 2 1 0 (LSB) 1 = read 0 = write reserved address Fig 17. I2C-bus interface 001aan222 PN512 SDA SCL I2C EA ADR_[5:0] PULL-UP NETWORK CONFIGURATION WIRING PULL-UP NETWORK MICROCONTROLLER PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 76 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 10.4.1 Data validity Data on the SDA line must be stable during the HIGH clock period. The HIGH or LOW state of the data line must only change when the clock signal on SCL is LOW. 10.4.2 START and STOP conditions To manage the data transfer on the I2C-bus, unique START (S) and STOP (P) conditions are defined. • A START condition is defined with a HIGH-to-LOW transition on the SDA line while SCL is HIGH. • A STOP condition is defined with a LOW-to-HIGH transition on the SDA line while SCL is HIGH. The I2C-bus master always generates the START and STOP conditions. The bus is busy after the START condition. The bus is free again a certain time after the STOP condition. The bus stays busy if a repeated START (Sr) is generated instead of a STOP condition. The START (S) and repeated START (Sr) conditions are functionally identical. Therefore, S is used as a generic term to represent both the START (S) and repeated START (Sr) conditions. 10.4.3 Byte format Each byte must be followed by an acknowledge bit. Data is transferred with the MSB first; see Figure 22. The number of transmitted bytes during one data transfer is unrestricted but must meet the read/write cycle format. Fig 18. Bit transfer on the I2C-bus mbc621 data line stable; data valid change of data allowed SDA SCL Fig 19. START and STOP conditions mbc622 SDA SCL P STOP condition SDA SCL S START condition PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 77 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 10.4.4 Acknowledge An acknowledge must be sent at the end of one data byte. The acknowledge-related clock pulse is generated by the master. The transmitter of data, either master or slave, releases the SDA line (HIGH) during the acknowledge clock pulse. The receiver pulls down the SDA line during the acknowledge clock pulse so that it remains stable LOW during the HIGH period of this clock pulse. The master can then generate either a STOP (P) condition to stop the transfer or a repeated START (Sr) condition to start a new transfer. A master-receiver indicates the end of data to the slave-transmitter by not generating an acknowledge on the last byte that was clocked out by the slave. The slave-transmitter releases the data line to allow the master to generate a STOP (P) or repeated START (Sr) condition. Fig 20. Acknowledge on the I2C-bus mbc602 S START condition 1 2 8 9 clock pulse for acknowledgement not acknowledge acknowledge data output by transmitter data output by receiver SCL from master Fig 21. Data transfer on the I2C-bus msc608 Sr or P SDA Sr P SCL STOP or repeated START condition S or Sr START or repeated START condition 1 2 3 - 8 9 ACK 9 ACK 1 2 7 8 MSB acknowledgement signal from slave byte complete, interrupt within slave clock line held LOW while interrupts are serviced acknowledgement signal from receiver PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 78 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 10.4.5 7-Bit addressing During the I2C-bus address procedure, the first byte after the START condition is used to determine which slave will be selected by the master. Several address numbers are reserved. During device configuration, the designer must ensure that collisions with these reserved addresses cannot occur. Check the I2C-bus specification for a complete list of reserved addresses. The I2C-bus address specification is dependent on the definition of pin EA. Immediately after releasing pin NRSTPD or after a power-on reset, the device defines the I2C-bus address according to pin EA. If pin EA is set LOW, the upper 4 bits of the device bus address are reserved by NXP Semiconductors and set to 0101b for all PN512 devices. The remaining 3 bits (ADR_0, ADR_1, ADR_2) of the slave address can be freely configured by the customer to prevent collisions with other I2C-bus devices. If pin EA is set HIGH, ADR_0 to ADR_5 can be completely specified at the external pins according to Table 141 on page 69. ADR_6 is always set to logic 0. In both modes, the external address coding is latched immediately after releasing the reset condition. Further changes at the used pins are not taken into consideration. Depending on the external wiring, the I2C-bus address pins can be used for test signal outputs. 10.4.6 Register write access To write data from the host controller using the I2C-bus to a specific register in the PN512 the following frame format must be used. • The first byte of a frame indicates the device address according to the I2C-bus rules. • The second byte indicates the register address followed by up to n-data bytes. In one frame all data bytes are written to the same register address. This enables fast FIFO buffer access. The Read/Write (R/W) bit is set to logic 0. Fig 22. First byte following the START procedure slave address 001aak591 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 R/W MSB LSB PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 79 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 10.4.7 Register read access To read out data from a specific register address in the PN512, the host controller must use the following procedure: • Firstly, a write access to the specific register address must be performed as indicated in the frame that follows • The first byte of a frame indicates the device address according to the I2C-bus rules • The second byte indicates the register address. No data bytes are added • The Read/Write bit is 0 After the write access, read access can start. The host sends the device address of the PN512. In response, the PN512 sends the content of the read access register. In one frame all data bytes can be read from the same register address. This enables fast FIFO buffer access or register polling. The Read/Write (R/W) bit is set to logic 1. Fig 23. Register read and write access 001aak592 S A 0 0 I2C-BUS SLAVE ADDRESS [A7:A0] JOINER REGISTER ADDRESS [A5:A0] write cycle 0 (W) A DATA [7:0] [0:n] [0:n] [0:n] A P S A 0 0 I2C-BUS SLAVE ADDRESS [A7:A0] JOINER REGISTER ADDRESS [A5:A0] read cycle optional, if the previous access was on the same register address 0 (W) A P P S S start condition P stop condition A acknowledge A not acknowledge W write cycle R read cycle A I2C-BUS SLAVE ADDRESS [A7:A0] sent by master sent by slave DATA [7:0] 1 (R) A DATA [7:0] A PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 80 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 10.4.8 High-speed mode In High-speed mode (HS mode), the device can transfer information at data rates of up to 3.4 Mbit/s, while remaining fully downward-compatible with Fast or Standard mode (F/S mode) for bidirectional communication in a mixed-speed bus system. 10.4.9 High-speed transfer To achieve data rates of up to 3.4 Mbit/s the following improvements have been made to I2C-bus operation. • The inputs of the device in HS mode incorporate spike suppression, a Schmitt trigger on the SDA and SCL inputs and different timing constants when compared to F/S mode • The output buffers of the device in HS mode incorporate slope control of the falling edges of the SDA and SCL signals with different fall times compared to F/S mode 10.4.10 Serial data transfer format in HS mode The HS mode serial data transfer format meets the Standard mode I2C-bus specification. HS mode can only start after all of the following conditions (all of which are in F/S mode): 1. START condition (S) 2. 8-bit master code (00001XXXb) 3. Not-acknowledge bit (A) When HS mode starts, the active master sends a repeated START condition (Sr) followed by a 7-bit slave address with a R/W bit address and receives an acknowledge bit (A) from the selected PN512. Data transfer continues in HS mode after the next repeated START (Sr), only switching back to F/S mode after a STOP condition (P). To reduce the overhead of the master code, a master links a number of HS mode transfers, separated by repeated START conditions (Sr). Fig 24. I2C-bus HS mode protocol switch F/S mode HS mode (current-source for SCL HIGH enabled) F/S mode 001aak749 A A DATA A/A (n-bytes + A) S MASTER CODE Sr SLAVE ADDRESS R/W HS mode continues Sr SLAVE ADDRESS P PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 81 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Fig 25. I2C-bus HS mode protocol frame msc618 8-bit master code 0000 1xxx A tH t1 S F/S mode HS mode If P then F/S mode If Sr (dotted lines) then HS mode 1 6 7 8 9 1 6 7 8 9 1 2 to 5 2 to 5 2 to 5 6 7 8 9 SDA high SCL high SDA high SCL high tH tFS Sr Sr P 7-bit SLA R/W A n + (8-bit data + A/A) = Master current source pull-up = Resistor pull-up PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 82 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 10.4.11 Switching between F/S mode and HS mode After reset and initialization, the PN512 is in Fast mode (which is in effect F/S mode as Fast mode is downward-compatible with Standard mode). The connected PN512 recognizes the “S 00001XXX A” sequence and switches its internal circuitry from the Fast mode setting to the HS mode setting. The following actions are taken: 1. Adapt the SDA and SCL input filters according to the spike suppression requirement in HS mode. 2. Adapt the slope control of the SDA output stages. It is possible for system configurations that do not have other I2C-bus devices involved in the communication to switch to HS mode permanently. This is implemented by setting Status2Reg register’s I2CForceHS bit to logic 1. In permanent HS mode, the master code is not required to be sent. This is not defined in the specification and must only be used when no other devices are connected on the bus. In addition, spikes on the I2C-bus lines must be avoided because of the reduced spike suppression. 10.4.12 PN512 at lower speed modes PN512 is fully downward-compatible and can be connected to an F/S mode I2C-bus system. The device stays in F/S mode and communicates at F/S mode speeds because a master code is not transmitted in this configuration. 11. 8-bit parallel interface The PN512 supports two different types of 8-bit parallel interfaces, Intel and Motorola compatible modes. 11.1 Overview of supported host controller interfaces The PN512 supports direct interfacing to various -Controllers. The following table shows the parallel interface types supported by the PN512. Table 152. Supported interface types Supported interface types Bus Separated Address and Data Bus Multiplexed Address and Data Bus Separated Read and Write Strobes (INTEL compatible) control NRD, NWR, NCS NRD, NWR, NCS, ALE address A0 … A3 [..A5*] AD0 … AD7 data D0 … D7 AD0 … AD7 Multiplexed Read and Write Strobe (Motorola compatible) control R/NW, NDS, NCS R/NW, NDS, NCS, AS address A0 … A3 [..A5*] AD0 … AD7 data D0 … D7 AD0 … AD7 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 83 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 11.2 Separated Read/Write strobe For timing requirements refer to Section 26.2 “8-bit parallel interface timing”. 11.3 Common Read/Write strobe For timing requirements refer to Section 26.2 “8-bit parallel interface timing” Fig 26. Connection to host controller with separated Read/Write strobes 001aan223 PN512 NCS A0...A3[A5*] D0...D7 A0 A1 A2 A3 A4* A5* address bus (A0...A3[A5*]) ALE NRD NWR ADDRESS DECODER data bus (D0...D7) high not data strobe (NRD) not write (NWR) address bus remark: *depending on the package type. multiplexed address/data AD0...AD7) PN512 NCS D0...D7 ALE NRD NWR ADDRESS DECODER low low high high high low address latch enable (ALE) not read strobe (NRD) not write (NWR) non multiplexed address Fig 27. Connection to host controller with common Read/Write strobes 001aan224 PN512 NCS A0...A3[A5*] D0...D7 A0 A1 A2 A3 A4* A5* address bus (A0...A3[A5*]) ALE NRD NWR ADDRESS DECODER Data bus (D0...D7) high not data strobe (NDS) read not write (RD/NWR) address bus remark: *depending on the package type. multiplexed address/data AD0...AD7) PN512 NCS D0...D7 ALE NRD NWR ADDRESS DECODER low low high high low low address strobe (AS) not data strobe (NDS) read not write (RD/NWR) non multiplexed address PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 84 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 12. Analog interface and contactless UART 12.1 General The integrated contactless UART supports the external host online with framing and error checking of the protocol requirements up to 848 kBd. An external circuit can be connected to the communication interface pins MFIN and MFOUT to modulate and demodulate the data. The contactless UART handles the protocol requirements for the communication protocols in cooperation with the host. Protocol handling generates bit and byte-oriented framing. In addition, it handles error detection such as parity and CRC, based on the various supported contactless communication protocols. Remark: The size and tuning of the antenna and the power supply voltage have an important impact on the achievable operating distance. 12.2 TX driver The signal on pins TX1 and TX2 is the 13.56 MHz energy carrier modulated by an envelope signal. It can be used to drive an antenna directly using a few passive components for matching and filtering; see Section 15 on page 96. The signal on pins TX1 and TX2 can be configured using the TxControlReg register; see Section 9.2.2.5 on page 40. The modulation index can be set by adjusting the impedance of the drivers. The impedance of the p-driver can be configured using registers CWGsPReg and ModGsPReg. The impedance of the n-driver can be configured using the GsNReg register. The modulation index also depends on the antenna design and tuning. The TxModeReg and TxSelReg registers control the data rate and framing during transmission and the antenna driver setting to support the different requirements at the different modes and transfer speeds. [1] X = Do not care. Table 153. Register and bit settings controlling the signal on pin TX1 Bit Tx1RFEn Bit Force 100ASK Bit InvTx1RFOn Bit InvTx1RFOff Envelope Pin TX1 GSPMos GSNMos Remarks 0 X[1] X[1] X[1] X[1] X[1] CWGsNOff CWGsNOff not specified if RF is switched off 1 0 0 X[1] 0 RF pMod nMod 100 % ASK: pin TX1 pulled to logic 0, independent of the InvTx1RFOff bit 1 RF pCW nCW 0 1 X[1] 0 RF pMod nMod 1 RF pCW nCW 1 1 X[1] 0 0 pMod nMod 1 RF_n pCW nCW PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 85 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution [1] X = Do not care. The following abbreviations have been used in Table 153 and Table 154: • RF: 13.56 MHz clock derived from 27.12 MHz quartz crystal oscillator divided by 2 • RF_n: inverted 13.56 MHz clock • GSPMos: conductance, configuration of the PMOS array • GSNMos: conductance, configuration of the NMOS array • pCW: PMOS conductance value for continuous wave defined by the CWGsPReg register • pMod: PMOS conductance value for modulation defined by the ModGsPReg register • nCW: NMOS conductance value for continuous wave defined by the GsNReg register’s CWGsN[3:0] bits • nMod: NMOS conductance value for modulation defined by the GsNReg register’s ModGsN[3:0] bits • X = do not care. Remark: If only one driver is switched on, the values for CWGsPReg, ModGsPReg and GsNReg registers are used for both drivers. 12.3 RF level detector The RF level detector is integrated to fulfill NFCIP1 protocol requirements (e.g. RF collision avoidance). Furthermore the RF level detector can be used to wake up the PN512 and to generate an interrupt. Table 154. Register and bit settings controlling the signal on pin TX2 Bit Tx1RFEn Bit Force 100ASK Bit Tx2CW Bit InvTx2RFOn Bit InvTx2RFOff Envelope Pin TX2 GSPMos GSNMos Remarks 0 X[1] X[1] X[1] X[1] X[1] X[1] CWGsNOff CWGsNOff not specified if RF is switched off 1 0 0 0 X[1] 0 RF pMod nMod - 1 RF pCW nCW 1 X[1] 0 RF_n pMod nMod 1 RF_n pCW nCW 1 0 X[1] X[1] RF pCW nCW conductance always CW for the Tx2CW bit 1 X[1] X[1] RF_n pCW nCW 1 0 0 X[1] 0 0 pMod nMod 100 % ASK: pin TX2 pulled to logic 0 (independent of the InvTx2RFOn/In vTx2RFOff bits) 1 RF pCW nCW 1 X[1] 0 0 pMod nMod 1 RF_n pCW nCW 1 0 X[1] X[1] RF pCW nCW 1 X[1] X[1] RF_n pCW nCW PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 86 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution The sensitivity of the RF level detector is adjustable in a 4-bit range using the bits RFLevel in register RFCfgReg. The sensitivity itself depends on the antenna configuration and tuning. Possible sensitivity levels at the RX pin are listed in the Table 154. To increase the sensitivity of the RF level detector an amplifier can be activated by setting the bit RFLevelAmp in register RFCfgReg to 1. Remark: During soft Power-down mode the RF level detector amplifier is automatically switched off to ensure that the power consumption is less than 10 A at 3 V. Remark: With typical antennas lower sensitivity levels can provoke misleading results because of intrinsic noise in the environment. Note: It is recommended to use the bit RFLevelAmp only with higher RF level settings. 12.4 Data mode detector The Data mode detector gives the possibility to detect received signals according to the ISO/IEC 14443A/MIFARE, FeliCa or NFCIP-1 schemes at the standard transfer speeds for 106 kbit, 212 kbit and 424 kbit in order to prepare the internal receiver in a fast and convenient way for further data processing. The Data mode detector can only be activated by the AutoColl command. The mode detector resets, when no external RF field is detected by the RF level detector. The Data mode detector could be switched off during the AutoColl command by setting bit ModeDetOff in register ModeReg to 1. Table 155. Setting of the bits RFlevel in register RFCfgReg (RFLevel amplifier deactivated) V~Rx [Vpp] RFLevel ~2 1111 ~1.4 1110 ~0.99 1101 ~0.69 1100 ~0.49 1011 ~0.35 1010 ~0.24 1001 ~0.17 1000 ~0.12 0111 ~0.083 0110 ~0.058 0101 ~0.041 0100 ~0.029 0011 ~0.020 0010 ~0.014 0001 ~0.010 0000 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 87 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Fig 28. Data mode detector 001aan225 HOST INTERFACES RECEIVER I/Q DEMODULATOR REGISTERS REGISTERSETTING FOR THE DETECTED MODE DATA MODE DETECTOR PN512 RX NFC @ 106 kbit/s NFC @ 212 kbit/s NFC @ 424 kbit/s PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 88 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 12.5 Serial data switch Two main blocks are implemented in the PN512. The digital block comprises the state machines, encoder/decoder logic. The analog block comprises the modulator and antenna drivers, the receiver and amplifiers. The interface between these two blocks can be configured in the way, that the interfacing signals may be routed to the pins SIGIN and SIGOUT. SIGIN is capable of processing digital NFC signals on transfer speeds above 424 kbit. The SIGOUT pin can provide a digital signal that can be used with an additional external circuit to generate transfer speeds above 424 kbit (including 106, 212 and 424 kbit). Furthermore SIGOUT and SIGIN can be used to enable the S2C interface in the card SAM mode to emulate a card functionality with the PN512 and a secure IC. A secure IC can be the SmartMX smart card controller IC. This topology allows the analog block of the PN512 to be connected to the digital block of another device. The serial signal switch is controlled by the TxSelReg and RxSelReg registers. Figure 29 shows the serial data switch for TX1 and TX2. 12.6 S2C interface support The S2C provides the possibility to directly connect a secure IC to the PN512 in order act as a contactless smart card IC via the PN512. The interfacing signals can be routed to the pins SIGIN and SIGOUT. SIGIN can receive either a digital FeliCa or digitized ISO/IEC 14443A signal sent by the secure IC. The SIGOUT pin can provide a digital signal and a clock to communicate to the secure IC. A secure IC can be the smart card IC provided by NXP Semiconductors. The PN512 has an extra supply pin (SVDD and PVSS as Ground line) for the SIGIN and SIGOUT pads. Figure 31 outlines possible ways of communications via the PN512 to the secure IC. Fig 29. Serial data switch for TX1 and TX2 001aak593 INTERNAL CODER INVERT IF InvMod = 1 DriverSel[1:0] 00 01 10 11 3-state to driver TX1 and TX2 0 = impedance = modulated 1 = impedance = CW 1 INVERT IF PolMFin = 0 MFIN envelope PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 89 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Configured in the Secure Access Mode the host controller can directly communicate to the Secure IC via SIGIN/SIGOUT. In this mode the PN512 generates the RF clock and performs the communication on the SIGOUT line. To enable the Secure Access module mode the clock has to be derived by the internal oscillator of the PN512, see bits SAMClockSel in register TestSel1Reg. Configured in Contactless Card mode the secure IC can act as contactless smart card IC via the PN512. In this mode the signal on the SIGOUT line is provided by the external RF field of the external reader/writer. To enable the Contactless Card mode the clock derived by the external RF field has to be used. The configuration of the S2C interface differs for the FeliCa and MIFARE scheme as outlined in the following chapters. Fig 30. Communication flows using the S2C interface 001aan226 CONTACTLESS UART SERIAL SIGNAL SWITCH FIFO AND STATE MACHINE SPI, I2C, SERIAL UART HOST CONTROLLER PN512 SECURE CORE IC SIGOUT SIGIN 2. contactless card mode 1. secure access module (SAM) mode PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 90 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 12.6.1 Signal shape for Felica S2C interface support The FeliCa secure IC is connected to the PN512 via the pins SIGOUT and SIGIN. The signal at SIGOUT contains the information of the 13.56 MHz clock and the digitized demodulated signal. The clock and the demodulated signal is combined by using the logical function exclusive or. To ensure that this signal is free of spikes, the demodulated signal is digitally filtered first. The time delay for that digital filtering is in the range of one bit length. The demodulated signal changes only at a positive edge of the clock. The register TxSelReg controls the setting at SIGOUT. The answer of the FeliCa SAM is transferred from SIGIN directly to the antenna driver. The modulation is done according to the register settings of the antenna drivers. The clock is switched to AUX1 or AUX2 (see AnalogSelAux). Note: A HIGH signal on AUX1 and AUX2 has the same level as AVDD. A HIGH signal at SIGOUT has the same level as SVDD. Alternatively it is possible to use pin D0 as clock output if a serial interface is used. The HIGH level at D0 is the same as PVDD. Note: The signal on the antenna is shown in principle only. In reality the waveform is sinusoidal. Fig 31. Signal shape for SIGOUT in FeliCa card SAM mode Fig 32. Signal shape for SIGIN in SAM mode 001aan227 clock signal on SIGIN signal on antenna 001aan228 clock demodulated signal signal on SIGOUT PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 91 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 12.6.2 Waveform shape for ISO/IEC 14443A and MIFARE S2C support The secure IC, e.g. the SmartMX is connected to the PN512 via the pins SIGOUT and SIGIN. The waveform shape at SIGOUT is a digital 13.56 MHz Miller coded signal with levels between PVSS and PVDD derived out of the external 13.56 MHz carrier signal in case of the Contactless Card mode or internally generated in terms of Secure Access mode. The register TxSelReg controls the setting at SIGOUT. Note: The clock settings for the Secure Access mode and the Contactless Card mode differ, refer to the description of the bits SAMClockSel in register TestSel1Reg. The signal at SIGIN is a digital Manchester coded signal according to the requirements of the ISO/IEC 14443A with the subcarrier frequency of 847.5 kHz generated by the secure IC. Fig 33. Signal shape for SIGOUT in MIFARE Card SAM mode Fig 34. Signal shape for SIGIN in MIFARE Card SAM mode 001aan229 1 0 bit value RF signal on antenna signal on SIGOUT 0 1 0 0 1 001aan230 0 1 0 1 0 0 1 bit value signal on antenna signal on SIGIN PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 92 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 12.7 Hardware support for FeliCa and NFC polling 12.7.1 Polling sequence functionality for initiator 1. Timer: The PN512 has a timer, which can be programmed in a way that it generates an interrupt at the end of each timeslot, or if required an interrupt is generated at the end of the last timeslot. 2. The receiver can be configured in a way to receive continuously. In this mode it can receive any number of packets. The receiver is ready to receive the next packet directly after the last packet has been received. This mode is active by setting the bit RxMultiple in register RxModeReg to 1 and has to be stopped by software. 3. The internal UART adds one byte to the end of every received packet, before it is transferred into the FIFO-buffer. This byte indicates if the received byte packet is correct (see register ErrReg). The first byte of each packet contains the length byte of the packet. 4. The length of one packet is 18 or 20 bytes (+ 1 byte Error-Info). The FIFO has a length of 64 bytes. This means three packets can be stored in the FIFO at the same time. If more than three packets are expected, the host controller has to empty the FIFO, before the FIFO is filled completely. In case of a FIFO-overflow data is lost (See bit BufferOvfl in register ErrorReg). 12.7.2 Polling sequence functionality for target 1. The host controller has to configure the PN512 with the correct polling response parameters for the polling command. 2. To activate the automatic polling in Target mode, the AutoColl Command has to be activated. 3. The PN512 receives the polling command send out by an initiator and answers with the polling response. The timeslot is selected automatically (The timeslot itself is randomly generated, but in the range 0 to TSN, which is defined by the Polling command). The PN512 compares the system code, stored in byte 17 and 18 of the Config Command with the system code received by the polling command of an initiator. If the system code is equal, the PN512 answers according to the configured polling response. The system code FF (hex) acts as a wildcard for the system code bytes, i.e. a target of a system code 1234 (hex) answers to the polling command with one of the following system codes 1234 (hex), 12FF (hex), FF34 (hex) or FFFF (hex). If the system code does not match no answer is sent back by the PN512. If a valid command is received by the PN512, which is not a Polling command, no answer is sent back and the command AutoColl is stopped. The received packet is stored in the FIFO. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 93 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 12.7.3 Additional hardware support for FeliCa and NFC Additionally to the polling sequence support for the Felica mode, the PN512 supports the check of the Len-byte. The received Len-byte in accordance to the registers FelNFC1Reg and FelNFC2Reg: DataLenMin in register FelNFC1Reg defines the minimum length of the accepted packet length. This register is six bit long. Each bit represents a length of four bytes. DataLenMax in register FelNFC2Reg defines the maximum length of the accepted package. This register is six bit long. Each bit represents a length of four bytes. If set to logic 1 this limit is ignored. If the length is not in the supposed range, the packet is not transferred to the FIFO and receiving is kept active. Example 1: • DataLenMin = 4 – The length shall be greater or equal 16. • DataLenMax = 5 – The length shall be smaller than 20. Valid area: 16, 17, 18, 19 Example 2: • DataLenMin = 9 – The length shall be greater or equal 36. • DataLenMax = 0 – The length shall be smaller than 256. Valid area: 36 to 255 12.7.4 CRC coprocessor The following CRC coprocessor parameters can be configured: • The CRC preset value can be either 0000h, 6363h, A671h or FFFFh depending on the ModeReg register’s CRCPreset[1:0] bits setting • The CRC polynomial for the 16-bit CRC is fixed to x16 + x12 + x5 + 1 • The CRCResultReg register indicates the result of the CRC calculation. This register is split into two 8-bit registers representing the higher and lower bytes. • The ModeReg register’s MSBFirst bit indicates that data will be loaded with the MSB first. Table 156. CRC coprocessor parameters Parameter Value CRC register length 16-bit CRC CRC algorithm algorithm according to ISO/IEC 14443 A and ITU-T CRC preset value 0000h, 6363h, A671h or FFFFh depending on the setting of the ModeReg register’s CRCPreset[1:0] bits PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 94 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 13. FIFO buffer An 8  64 bit FIFO buffer is used in the PN512. It buffers the input and output data stream between the host and the PN512’s internal state machine. This makes it possible to manage data streams up to 64 bytes long without the need to take timing constraints into account. 13.1 Accessing the FIFO buffer The FIFO buffer input and output data bus is connected to the FIFODataReg register. Writing to this register stores one byte in the FIFO buffer and increments the internal FIFO buffer write pointer. Reading from this register shows the FIFO buffer contents stored in the FIFO buffer read pointer and decrements the FIFO buffer read pointer. The distance between the write and read pointer can be obtained by reading the FIFOLevelReg register. When the microcontroller starts a command, the PN512 can, while the command is in progress, access the FIFO buffer according to that command. Only one FIFO buffer has been implemented which can be used for input and output. The microcontroller must ensure that there are not any unintentional FIFO buffer accesses. 13.2 Controlling the FIFO buffer The FIFO buffer pointers can be reset by setting FIFOLevelReg register’s FlushBuffer bit to logic 1. Consequently, the FIFOLevel[6:0] bits are all set to logic 0 and the ErrorReg register’s BufferOvfl bit is cleared. The bytes stored in the FIFO buffer are no longer accessible allowing the FIFO buffer to be filled with another 64 bytes. 13.3 FIFO buffer status information The host can get the following FIFO buffer status information: • Number of bytes stored in the FIFO buffer: FIFOLevelReg register’s FIFOLevel[6:0] • FIFO buffer almost full warning: Status1Reg register’s HiAlert bit • FIFO buffer almost empty warning: Status1Reg register’s LoAlert bit • FIFO buffer overflow warning: ErrorReg register’s BufferOvfl bit. The BufferOvfl bit can only be cleared by setting the FIFOLevelReg register’s FlushBuffer bit. The PN512 can generate an interrupt signal when: • ComIEnReg register’s LoAlertIEn bit is set to logic 1. It activates pin IRQ when Status1Reg register’s LoAlert bit changes to logic 1. • ComIEnReg register’s HiAlertIEn bit is set to logic 1. It activates pin IRQ when Status1Reg register’s HiAlert bit changes to logic 1. If the maximum number of WaterLevel bytes (as set in the WaterLevelReg register) or less are stored in the FIFO buffer, the HiAlert bit is set to logic 1. It is generated according to Equation 3: HiAlert = 64 – FIFOLength  WaterLevel (3) PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 95 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution If the number of WaterLevel bytes (as set in the WaterLevelReg register) or less are stored in the FIFO buffer, the LoAlert bit is set to logic 1. It is generated according to Equation 4: (4) 14. Interrupt request system The PN512 indicates certain events by setting the Status1Reg register’s IRq bit and, if activated, by pin IRQ. The signal on pin IRQ can be used to interrupt the host using its interrupt handling capabilities. This allows the implementation of efficient host software. 14.1 Interrupt sources overview Table 157 shows the available interrupt bits, the corresponding source and the condition for its activation. The ComIrqReg register’s TimerIRq interrupt bit indicates an interrupt set by the timer unit which is set when the timer decrements from 1 to 0. The ComIrqReg register’s TxIRq bit indicates that the transmitter has finished. If the state changes from sending data to transmitting the end of the frame pattern, the transmitter unit automatically sets the interrupt bit. The CRC coprocessor sets the DivIrqReg register’s CRCIRq bit after processing all the FIFO buffer data which is indicated by CRCReady bit = 1. The ComIrqReg register’s RxIRq bit indicates an interrupt when the end of the received data is detected. The ComIrqReg register’s IdleIRq bit is set if a command finishes and the Command[3:0] value in the CommandReg register changes to idle (see Table 158 on page 101). The ComIrqReg register’s HiAlertIRq bit is set to logic 1 when the Status1Reg register’s HiAlert bit is set to logic 1 which means that the FIFO buffer has reached the level indicated by the WaterLevel[5:0] bits. The ComIrqReg register’s LoAlertIRq bit is set to logic 1 when the Status1Reg register’s LoAlert bit is set to logic 1 which means that the FIFO buffer has reached the level indicated by the WaterLevel[5:0] bits. The ComIrqReg register’s ErrIRq bit indicates an error detected by the contactless UART during send or receive. This is indicated when any bit is set to logic 1 in register ErrorReg. LoAlert = FIFOLength  WaterLevel Table 157. Interrupt sources Interrupt flag Interrupt source Trigger action TimerIRq timer unit the timer counts from 1 to 0 TxIRq transmitter a transmitted data stream ends CRCIRq CRC coprocessor all data from the FIFO buffer has been processed RxIRq receiver a received data stream ends IdleIRq ComIrqReg register command execution finishes HiAlertIRq FIFO buffer the FIFO buffer is almost full LoAlertIRq FIFO buffer the FIFO buffer is almost empty ErrIRq contactless UART an error is detected PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 96 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 15. Timer unit A timer unit is implemented in the PN512. The external host controller may use this timer to manage timing relevant tasks. The timer unit may be used in one of the following configurations: • Time-out counter • Watch-dog counter • Stop watch • Programmable one-shot • Periodical trigger The timer unit can be used to measure the time interval between two events or to indicate that a specific event occurred after a specific time. The timer can be triggered by events which will be explained in the following, but the timer itself does not influence any internal event (e.g. A time-out during data reception does not influence the reception process automatically). Furthermore, several timer related bits are set and these bits can be used to generate an interrupt. Timer The timer has an input clock of 13.56 MHz (derived from the 27.12 MHz quartz). The timer consists of two stages: 1 prescaler and 1 counter. The prescaler is a 12-bit counter. The reload value for TPrescaler can be defined between 0 and 4095 in register TModeReg and TPrescalerReg. The reload value for the counter is defined by 16 bits in a range of 0 to 65535 in the register TReloadReg. The current value of the timer is indicated by the register TCounterValReg. If the counter reaches 0 an interrupt will be generated automatically indicated by setting the TimerIRq bit in the register CommonIRqReg. If enabled, this event can be indicated on the IRQ line. The bit TimerIRq can be set and reset by the host controller. Depending on the configuration the timer will stop at 0 or restart with the value from register TReloadReg. The status of the timer is indicated by bit TRunning in register Status1Reg. The timer can be manually started by TStartNow in register ControlReg or manually stopped by TStopNow in register ControlReg. Furthermore the timer can be activated automatically by setting the bit TAuto in the register TModeReg to fulfill dedicated protocol requirements automatically. The time delay of a timer stage is the reload value +1. The definition of total time is: t = ((TPrescaler*2+1)*TReload+1)/13.56MHz or if TPrescaleEven bit is set: t = ((TPrescaler*2+2)*TReload+1)/13.56MHz Maximum time: TPrescaler = 4095,TReloadVal = 65535 => (2*4095 +2)*65536/13.56 MHz = 39.59 s Example: PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 97 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution To indicate 25 us it is required to count 339 clock cycles. This means the value for TPrescaler has to be set to TPrescaler = 169.The timer has now an input clock of 25 us. The timer can count up to 65535 timeslots of each 25 s. For the behaviour in version 1.0, see Section 21 “Errata sheet” on page 109. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 98 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 16. Power reduction modes 16.1 Hard power-down Hard power-down is enabled when pin NRSTPD is LOW. This turns off all internal current sinks including the oscillator. All digital input buffers are separated from the input pins and clamped internally (except pin NRSTPD). The output pins are frozen at either a HIGH or LOW level. 16.2 Soft power-down mode Soft Power-down mode is entered immediately after the CommandReg register’s PowerDown bit is set to logic 1. All internal current sinks are switched off, including the oscillator buffer. However, the digital input buffers are not separated from the input pins and keep their functionality. The digital output pins do not change their state. During soft power-down, all register values, the FIFO buffer content and the configuration keep their current contents. After setting the PowerDown bit to logic 0, it takes 1024 clocks until the Soft power-down mode is exited indicated by the PowerDown bit. Setting it to logic 0 does not immediately clear it. It is cleared automatically by the PN512 when Soft power-down mode is exited. Remark: If the internal oscillator is used, you must take into account that it is supplied by pin AVDD and it will take a certain time (tosc) until the oscillator is stable and the clock cycles can be detected by the internal logic. It is recommended for the serial UART, to first send the value 55h to the PN512. The oscillator must be stable for further access to the registers. To ensure this, perform a read access to address 0 until the PN512 answers to the last read command with the register content of address 0. This indicates that the PN512 is ready. 16.3 Transmitter power-down mode The Transmitter Power-down mode switches off the internal antenna drivers thereby, turning off the RF field. Transmitter power-down mode is entered by setting either the TxControlReg register’s Tx1RFEn bit or Tx2RFEn bit to logic 0. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 99 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 17. Oscillator circuitry The clock applied to the PN512 provides a time basis for the synchronous system’s encoder and decoder. The stability of the clock frequency, therefore, is an important factor for correct operation. To obtain optimum performance, clock jitter must be reduced as much as possible. This is best achieved using the internal oscillator buffer with the recommended circuitry. If an external clock source is used, the clock signal must be applied to pin OSCIN. In this case, special care must be taken with the clock duty cycle and clock jitter and the clock quality must be verified. 18. Reset and oscillator start-up time 18.1 Reset timing requirements The reset signal is filtered by a hysteresis circuit and a spike filter before it enters the digital circuit. The spike filter rejects signals shorter than 10 ns. In order to perform a reset, the signal must be LOW for at least 100 ns. 18.2 Oscillator start-up time If the PN512 has been set to a Power-down mode or is powered by a VDDX supply, the start-up time for the PN512 depends on the oscillator used and is shown in Figure 36. The time (tstartup) is the start-up time of the crystal oscillator circuit. The crystal oscillator start-up time is defined by the crystal. The time (td) is the internal delay time of the PN512 when the clock signal is stable before the PN512 can be addressed. The delay time is calculated by: (5) The time (tosc) is the sum of td and tstartup. Fig 35. Quartz crystal connection 001aan231 PN512 27.12 MHz OSCOUT OSCIN td 1024 27 s = -------------- = 37.74 s PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 100 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 19. PN512 command set The PN512 operation is determined by a state machine capable of performing a set of commands. A command is executed by writing a command code (see Table 158) to the CommandReg register. Arguments and/or data necessary to process a command are exchanged via the FIFO buffer. 19.1 General description The PN512 operation is determined by a state machine capable of performing a set of commands. A command is executed by writing a command code (see Table 158) to the CommandReg register. Arguments and/or data necessary to process a command are exchanged via the FIFO buffer. 19.2 General behavior • Each command that needs a data bit stream (or data byte stream) as an input immediately processes any data in the FIFO buffer. An exception to this rule is the Transceive command. Using this command, transmission is started with the BitFramingReg register’s StartSend bit. • Each command that needs a certain number of arguments, starts processing only when it has received the correct number of arguments from the FIFO buffer. • The FIFO buffer is not automatically cleared when commands start. This makes it possible to write command arguments and/or the data bytes to the FIFO buffer and then start the command. • Each command can be interrupted by the host writing a new command code to the CommandReg register, for example, the Idle command. Fig 36. Oscillator start-up time 001aak596 tstartup td tosc t device activation oscillator clock stable clock ready PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 101 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 19.3 PN512 command overview 19.3.1 PN512 command descriptions 19.3.1.1 Idle Places the PN512 in Idle mode. The Idle command also terminates itself. 19.3.1.2 Config command To use the automatic MIFARE Anticollision, FeliCa Polling and NFCID3 the data used for these transactions has to be stored internally. All the following data have to be written to the FIFO in this order: SENS_RES (2 bytes); in order byte 0, byte 1 NFCID1 (3 Bytes); in order byte 0, byte 1, byte 2; the first NFCID1 byte is fixed to 08h and the check byte is calculated automatically. SEL_RES (1 Byte) polling response (2 bytes (shall be 01h, FEh) + 6 bytes NFCID2 + 8 bytes Pad + 2 bytes system code) NFCID3 (1 byte) In total 25 bytes are transferred into an internal buffer. The complete NFCID3 is 10 bytes long and consists of the 3 NFCID1 bytes, the 6 NFCID2 bytes and the one NFCID3 byte which are listed above. To read out this configuration the command Config with an empty FIFO-buffer has to be started. In this case the 25 bytes are transferred from the internal buffer to the FIFO. Table 158. Command overview Command Command code Action Idle 0000 no action, cancels current command execution Configure 0001 Configures the PN512 for FeliCa, MIFARE and NFCIP-1 communication Generate RandomID 0010 generates a 10-byte random ID number CalcCRC 0011 activates the CRC coprocessor or performs a self test Transmit 0100 transmits data from the FIFO buffer NoCmdChange 0111 no command change, can be used to modify the CommandReg register bits without affecting the command, for example, the PowerDown bit Receive 1000 activates the receiver circuits Transceive 1100 transmits data from FIFO buffer to antenna and automatically activates the receiver after transmission AutoColl 1101 Handles FeliCa polling (Card Operation mode only) and MIFARE anticollision (Card Operation mode only) MFAuthent 1110 performs the MIFARE standard authentication as a reader SoftReset 1111 resets the PN512 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 102 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution The PN512 has to be configured after each power up, before using the automatic Anticollision/Polling function (AutoColl command). During a hard power down (reset pin) this configuration remains unchanged. This command terminates automatically when finished and the active command is idle. 19.3.1.3 Generate RandomID This command generates a 10-byte random number which is initially stored in the internal buffer. This then overwrites the 10 bytes in the internal 25-byte buffer. This command automatically terminates when finished and the PN512 returns to Idle mode. 19.3.1.4 CalcCRC The FIFO buffer content is transferred to the CRC coprocessor and the CRC calculation is started. The calculation result is stored in the CRCResultReg register. The CRC calculation is not limited to a dedicated number of bytes. The calculation is not stopped when the FIFO buffer is empty during the data stream. The next byte written to the FIFO buffer is added to the calculation. The CRC preset value is controlled by the ModeReg register’s CRCPreset[1:0] bits. The value is loaded in to the CRC coprocessor when the command starts. This command must be terminated by writing a command to the CommandReg register, such as, the Idle command. If the AutoTestReg register’s SelfTest[3:0] bits are set correctly, the PN512 enters Self Test mode. Starting the CalcCRC command initiates a digital self test. The result of the self test is written to the FIFO buffer. 19.3.1.5 Transmit The FIFO buffer content is immediately transmitted after starting this command. Before transmitting the FIFO buffer content, all relevant registers must be set for data transmission. This command automatically terminates when the FIFO buffer is empty. It can be terminated by another command written to the CommandReg register. 19.3.1.6 NoCmdChange This command does not influence any running command in the CommandReg register. It can be used to manipulate any bit except the CommandReg register Command[3:0] bits, for example, the RcvOff bit or the PowerDown bit. 19.3.1.7 Receive The PN512 activates the receiver path and waits for a data stream to be received. The correct settings must be chosen before starting this command. This command automatically terminates when the data stream ends. This is indicated either by the end of frame pattern or by the length byte depending on the selected frame type and speed. Remark: If the RxModeReg register’s RxMultiple bit is set to logic 1, the Receive command will not automatically terminate. It must be terminated by starting another command in the CommandReg register. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 103 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 19.3.1.8 Transceive This command continuously repeats the transmission of data from the FIFO buffer and the reception of data from the RF field. The first action is transmit and after transmission the command is changed to receive a data stream. Each transmit process must be started by setting the BitFramingReg register’s StartSend bit to logic 1. This command must be cleared by writing any command to the CommandReg register. Remark: If the RxModeReg register’s RxMultiple bit is set to logic 1, the Transceive command never leaves the receive state because this state cannot be cancelled automatically. 19.3.1.9 AutoColl This command automatically handles the MIFARE activation and the FeliCa polling in the Card Operation mode. The bit Initiator in the register ControlReg has to be set to logic 0 for correct operation. During this command also the mode detector is active if not deactivated by setting the bit ModeDetOff in the ModeReg register. After the mode detector detects a mode, all the mode dependent registers are set according to the received data. In case of no external RF field the command resets the internal state machine and returns to the initial state but it will not be terminated. When the command terminates the transceive command gets active. During protocol processing the IRQ bits are not supported. Only the last received frame will serve the IRQ’s. The treatment of the TxCRCEn and RxCRCEn bits is different to the protocol. During ISO/IEC 14443A activation the enable bits are defined by the command AutoColl. The changes cannot be observed at the register TXModeReg and RXModeReg. After the Transceive command is active, the value of the register bit is relevant. The FIFO will also receive the two CRC check bytes of the last command even if they already checked and correct, if the state machine (Anticollision and Select routine) has to not been executed and 106 kbit is detected. During Felica activation the register bit is always relevant and is not overruled by the command settings. This command can be cleared by software by writing any other command to the CommandReg register, e.g. the idle command. Writing the same content again to the CommandReg register resets the state machine. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 104 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution NFCIP-1 106 kbps Passive Communication mode: The MIFARE anticollision is finished and the command has automatically changed to Transceive. The FIFO contains the ATR_REQ frame including the start byte F0h. The bit TargetActivated in the Status2Reg register is set to logic 1. NFCIP-1 212/424 kbps Passive Communication mode: The FeliCa polling command is finished and the command has automatically changed to Transceive. The FIFO contains the ATR_REQ. The bit TargetActivated in the Status2Reg register is set to logic 1. NFCIP-1 106/212/424 kbps Active Communication mode: This command is changing the automatically to the command Transceive. The FIFO contains the ATR REQ The bit TargetActivated in the Status2Reg register is set to logic 0. For 106 kbps only, the first byte in the FIFO indicates the start byte F0h and the CRC is added to the FIFO. Fig 37. Autocoll Command NFCIP-1 106 kB aud ISO14443-3 NPCIP-1 > 106 kB aud FELICA IDLE MODEO MODE detection RXF raming MFHalted = 1 HALT AC nAC SELECT nSELECT HLTA AC polling, polling response next frame received next frame received REQA, WUPA READY ACTIVE WUPA SELECT SELECT READY* ACTIVE* TRANSCEIVE wait for transmit next frame received J N HLTA REQA, WUPA, AC, nAC, SELECT, nSELECT, error REQA, AC, nAC, SELECT, nSELECT, HLTA REQA, WUPA, nAC, nSELECT, HLTA, error REQA, WUPA, nAC, nSELECT, HLTA, error REQA, WUPA, AC, SELECT, nSELECT, error 00 10 AC aaa-001826 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 105 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution MIFARE (Card Operation mode): The MIFARE anticollision is finished and the command has automatically changed to transceive. The FIFO contains the first command after the Select. The bit TargetActivated in the Status2Reg register is set to logic 1. Felica (Card Operation mode): The FeliCa polling command is finished and the command has automatically changed to transceive. The FIFO contains the first command followed after the Poling by the FeliCa protocol. The bit TargetActivated in the Status2Reg register is set to logic 1. 19.3.1.10 MFAuthent This command manages MIFARE authentication to enable a secure communication to any MIFARE Mini, MIFARE 1K and MIFARE 4K card. The following data is written to the FIFO buffer before the command can be activated: • Authentication command code (60h, 61h) • Block address • Sector key byte 0 • Sector key byte 1 • Sector key byte 2 • Sector key byte 3 • Sector key byte 4 • Sector key byte 5 • Card serial number byte 0 • Card serial number byte 1 • Card serial number byte 2 • Card serial number byte 3 In total 12 bytes are written to the FIFO. Remark: When the MFAuthent command is active all access to the FIFO buffer is blocked. However, if there is access to the FIFO buffer, the ErrorReg register’s WrErr bit is set. This command automatically terminates when the MIFARE card is authenticated and the Status2Reg register’s MFCrypto1On bit is set to logic 1. This command does not terminate automatically if the card does not answer, so the timer must be initialized to automatic mode. In this case, in addition to the IdleIRq bit, the TimerIRq bit can be used as the termination criteria. During authentication processing, the RxIRq bit and TxIRq bit are blocked. The Crypto1On bit is only valid after termination of the MFAuthent command, either after processing the protocol or writing Idle to the CommandReg register. If an error occurs during authentication, the ErrorReg register’s ProtocolErr bit is set to logic 1 and the Status2Reg register’s Crypto1On bit is set to logic 0. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 106 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 19.3.1.11 SoftReset This command performs a reset of the device. The configuration data of the internal buffer remains unchanged. All registers are set to the reset values. This command automatically terminates when finished. Remark: The SerialSpeedReg register is reset and therefore the serial data rate is set to 9.6 kBd. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 107 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 20. Testsignals 20.1 Selftest The PN512 has the capability to perform a digital selftest. To start the selftest the following procedure has to be performed: 1. Perform a soft reset. 2. Clear the internal buffer by writing 25 bytes of 00h and perform the Config Command. 3. Enable the Selftest by writing the value 09h to the register AutoTestReg. 4. Write 00h to the FIFO. 5. Start the Selftest with the CalcCRC Command. 6. The Selftest will be performed. 7. When the Selftest is finished, the FIFO contains the following bytes: Version 1.0 has a different Selftest answer, explained in Section 21. Correct answer for VersionReg equal to 82h: 00h, EBh, 66h, BAh, 57h, BFh, 23h, 95h, D0h, E3h, 0Dh, 3Dh, 27h, 89h, 5Ch, DEh, 9Dh, 3Bh, A7h, 00h, 21h, 5Bh, 89h, 82h, 51h, 3Ah, EBh, 02h, 0Ch, A5h, 00h, 49h, 7Ch, 84h, 4Dh, B3h, CCh, D2h, 1Bh, 81h, 5Dh, 48h, 76h, D5h, 71h, 61h, 21h, A9h, 86h, 96h, 83h, 38h, CFh, 9Dh, 5Bh, 6Dh, DCh, 15h, BAh, 3Eh, 7Dh, 95h, 3Bh, 2Fh 20.2 Testbus The testbus is implemented for production test purposes. The following configuration can be used to improve the design of a system using the PN512. The testbus allows to route internal signals to the digital interface. The testbus signals are selected by accessing TestBusSel in register TestSel2Reg. Table 159. Testsignal routing (TestSel2Reg = 07h) Pins D6 D5 D4 D3 D2 D1 D0 Testsignal sdata scoll svalid sover RCV_reset RFon, filtered Envelope Table 160. Description of Testsignals Pins Testsignal Description D6 sdata shows the actual received data stream. D5 scoll shows if in the actual bit a collision has been detected (106 kbit only) D4 svalid shows if sdata and scoll are valid D3 sover shows that the receiver has detected a stop condition (ISO/IEC 14443A/ MIFARE mode only). D2 RCV_reset shows if the receiver is reset D1 RFon, filtered shows the value of the internal RF level detector D0 Envelope shows the output of the internal coder PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 108 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 20.3 Testsignals at pin AUX Table 161. Testsignal routing (TestSel2Reg = 0Dh) Pins D6 D5 D4 D3 D2 D1 D0 Testsignal clkstable clk27/8 clk27rf/8 clkrf13rf/4 clk27 clk27rf clk13rf Table 162. Description of Testsignals Pins Testsignal Description D6 clkstable shows if the oscillator delivers a stable signal. D5 clk27/8 shows the output signal of the oscillator divided by 8 D4 clk27rf/8 shows the clk27rf signal divided by 8 D3 clkrf13/4 shows the clk13rf divided by 4. D2 clk27 shows the output signal of the oscillator D1 clk27rf shows the RF clock multiplied by 2. D0 clk13rf shows the RF clock of 13.56 MHz Table 163. Testsignal routing (TestSel2Reg = 19h) Pins D6 D5 D4 D3 D2 D1 D0 Testsignal - TRunning - - - - - Table 164. Description of Testsignals Pins Testsignal Description D6 - - D5 TRunning TRunning stops 1 clockcycle after TimerIRQ is raised D4 - - D3 - - D2 - - D1 - - D0 - - Table 165. Testsignals description SelAux Description for Aux1 / Aux2 0000 Tristate 0001 DAC: register TestDAC 1/2 0010 DAC: testsignal corr1 0011 DAC: testsignal corr2 0100 DAC: testsignal MinLevel 0101 DAC: ADC_I 0110 DAC: ADC_Q 0111 DAC: testsignal ADC_I combined with ADC_Q 1000 Testsignal for production test 1001 SAM clock 1010 High 1011 low 1100 TxActive PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 109 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Each signal can be switched to pin AUX1 or AUX2 by setting SelAux1 or SelAux2 in the register AnalogTestReg. Note: The DAC has a current output, it is recommended to use a 1 k pull-down resistance at pins AUX1/AUX2. 20.4 PRBS Enables the PRBS9 or PRBS15 sequence according to ITU-TO150. To start the transmission of the defined datastream the command send has to be activated. The preamble/Sync byte/start bit/parity bit are generated automatically depending on the selected mode. Note: All relevant register to transmit data have to be configured before entering PRBS mode according ITU-TO150. 21. Errata sheet This data sheet is describing the functionality for version 2.0 and the industrial version. This chapter lists all differences from version 1.0 to version 2.0: The value of the version in Section 9.2.4.8 is set to80h. The behaviour ‘RFU’ for the register is undefined. The answer to the Selftest (see Section 20.1) for version 1.0 (VersionReg equal to 80h): 00h, AAh, E3h, 29h, 0Ch, 10h, 29zhh, 6Bh, 76h, 8Dh, AFh, 4Bh, A2h, DAh, 76h, 99h C7h, 5Eh, 24h, 69h, D2h, BAh, FAh, BCh 3Eh, DAh, 96h, B5h, F5h, 94h, B0h, 3Ah 4Eh, C3h, 9Dh, 94h, 76h, 4Ch, EAh, 5Eh 38h, 10h, 8Fh, 2Dh, 21h, 4Bh, 52h, BFh 4Eh, C3h, 9Dh, 94h, 76h, 4Ch, EAh, 5Eh 38h, 10h, 8Fh, 2Dh, 21h, 4Bh, 52h, BFh FBh, F4h, 19h, 94h, 82h, 5Ah, 72h, 9Dh BAh, 0Dh, 1Fh, 17h, 56h, 22h, B9h, 08h Only the default setting for the prescaler (see Section 15 “Timer unit” on page 96): t = ((TPreScaler*2+1)*TReload+1)/13,56 MHz is supported. As such only the formula fTimer = 13,56 MHz/(2*PreScaler+1) is applicable for the TPrescalerHigh in Table 100 “Description of TModeReg bits” on page 57 and TPrescalerLo in Table 101 “TPrescalerReg register (address 2Bh); reset value: 00h, 00000000b” on page 58. As there is no option for the prescaler available, also the TPrescalEven is not available Section 9.2.2.10 on page 45. This bit is set to ‘RFU’. 1101 RxActive 1110 Subcarrier detected 1111 TstBusBit Table 165. Testsignals description SelAux Description for Aux1 / Aux2 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 110 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Especially when using time slot protocols, it is needed that the error flag is copied into the status information of the frame. When using the RxMultiple feature (see Section 9.2.2.4 on page 39) within version 1.0 the protocol error flag is not included in the status information for the frame. In addition the CRCOk is copied instead of the CRCErr. This can be a problem in frames without length information e.g. ISO/IEC 14443-B. The version 1.0 does not accept a Type B EOF if there is no 1 bit after the series of 0 bits, as such the configuration within Section 9.2.2.15 “TypeBReg” on page 50 bit 4 for RxEOFReq does not exist. In addition the IC only has the possibility to select the minimum or maximum timings for SOF/EOF generation defined in ISO/IEC14443B. As such the configuration possible in version 2.0 through the EOFSOFAdjust bit (see Section 9.2.4.7 “AutoTestReg” on page 64) does not exist and the configuration is limited to only setting minimum and maximum length according ISO/IEC 14443-B, see Section 9.2.2.15 “TypeBReg” on page 50, bit 4. 22. Application design-in information The figure below shows a typical circuit diagram, using a complementary antenna connection to the PN512. The antenna tuning and RF part matching is described in the application note “NFC Transmission Module Antenna and RF Design Guide”. Fig 38. Typical circuit diagram AVDD TVDD RX VMID supply TX1 TVSS TX2 DVSS DVDD DVDD PVDD SVDD AVSS IRQ NRSTPD R1 R2 L0 C0 C0 C2 C1 CRX RQ C1 RQ C2 L0 Cvmid 001aan232 27.12 MHz OSCIN OSCOUT HOST CONTROLLER interface PN512 antenna Lant PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 111 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 23. Limiting values 24. Recommended operating conditions Table 166. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDDA analog supply voltage 0.5 +4.0 V VDDD digital supply voltage 0.5 +4.0 V VDD(PVDD) PVDD supply voltage 0.5 +4.0 V VDD(TVDD) TVDD supply voltage 0.5 +4.0 V VDD(SVDD) SVDD supply voltage 0.5 +4.0 V VI input voltage all input pins except pins SIGIN and RX VSS(PVSS)  0.5 VDD(PVDD) + 0.5 V pin MFIN VSS(PVSS)  0.5 VDD(SVDD) + 0.5 V Ptot total power dissipation per package; and VDDD in shortcut mode - 200 mW Tj junction temperature - 125 C VESD electrostatic discharge voltage HBM; 1500 , 100 pF; JESD22-A114-B - 2000 V MM; 0.75 H, 200 pF; JESD22-A114-A - 200 V Charged device model; JESD22-C101-A on all pins - 200 V on all pins except SVDD in TFBGA64 package - 500 V Industrial version: VESD electrostatic discharge voltage HBM; 1500 , 100 pF; JESD22-A114-B - 2000 V MM; 0.75 H, 200 pF; JESD22-A114-A - 200 V Charged device model; AEC-Q100-011 on all pins - 200 V on all pins except SVDD - 500 V Table 167. Operating conditions Symbol Parameter Conditions Min Typ Max Unit VDDA analog supply voltage VDD(PVDD)  VDDA = VDDD = VDD(TVDD); VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [1][2] 2.5 - 3.6 V VDDD digital supply voltage VDD(PVDD)  VDDA = VDDD = VDD(TVDD); VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [1][2] 2.5 - 3.6 V VDD(TVDD) TVDD supply voltage VDD(PVDD)  VDDA = VDDD = VDD(TVDD); VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [1][2] 2.5 - 3.6 V PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 112 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution [1] Supply voltages below 3 V reduce the performance (the achievable operating distance). [2] VDDA, VDDD and VDD(TVDD) must always be the same voltage. [3] VDD(PVDD) must always be the same or lower voltage than VDDD. 25. Thermal characteristics 26. Characteristics VDD(PVDD) PVDD supply voltage VDD(PVDD)  VDDA = VDDD = VDD(TVDD); VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V [3] 1.6 - 3.6 V VDD(SVDD) SVDD supply voltage VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 1.6 - 3.6 V Tamb ambient temperature HVQFN32, HVQFN40, TFBGA64 30 - +85 C Industrial version: Tamb ambient temperature HVQFN32 40 - +90 C Table 167. Operating conditions …continued Symbol Parameter Conditions Min Typ Max Unit Table 168. Thermal characteristics Symbol Parameter Conditions Package Typ Unit Rthj-a Thermal resistance from junction to ambient In still air with exposed pad soldered on a 4 layer Jedec PCB In still air HVQFN32 40 K/W HVQFN40 35 K/W TFBGA64 K/W Table 169. Characteristics Symbol Parameter Conditions Min Typ Max Unit Input characteristics Pins A0, A1 and NRSTPD ILI input leakage current 1 - +1 A VIH HIGH-level input voltage 0.7VDD(PVDD)- - V VIL LOW-level input voltage - - 0.3VDD(PVDD) V Pin SIGIN ILI input leakage current 1 - +1 A VIH HIGH-level input voltage 0.7VDD(SVDD)- - V VIL LOW-level input voltage - - 0.3VDD(SVDD) V Pin ALE ILI input leakage current 1 - +1 A VIH HIGH-level input voltage 0.7VDD(PVDD)- - V VIL LOW-level input voltage - - 0.3VDD(PVDD) V Pin RX[1] Vi input voltage 1 - VDDA +1 V Ci input capacitance VDDA = 3 V; receiver active; VRX(p-p) = 1 V; 1.5 V (DC) offset - 10 - pF PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 113 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Ri input resistance VDDA = 3 V; receiver active; VRX(p-p) = 1 V; 1.5 V (DC) offset - 350 -  Input voltage range; see Figure 39 Vi(p-p)(min) minimum peak-to-peak input voltage Manchester encoded; VDDA = 3 V - 100 - mV Vi(p-p)(max) maximum peak-to-peak input voltage Manchester encoded; VDDA = 3 V - 4 - V Input sensitivity; see Figure 39 Vmod modulation voltage minimum Manchester encoded; VDDA = 3 V; RxGain[2:0] = 111b (48 dB) - 5 - mV Pin OSCIN ILI input leakage current 1 - +1 A VIH HIGH-level input voltage 0.7VDDA - - V VIL LOW-level input voltage - - 0.3VDDA V Ci input capacitance VDDA = 2.8 V; DC = 0.65 V; AC = 1 V (p-p) - 2 - pF Input/output characteristics pins D1, D2, D3, D4, D5, D6 and D7 ILI input leakage current 1 - +1 A VIH HIGH-level input voltage 0.7VDD(PVDD)- - V VIL LOW-level input voltage - - 0.3VDD(PVDD) V VOH HIGH-level output voltage VDD(PVDD) = 3 V; IO = 4 mA VDD(PVDD)  0.4 - VDD(PVDD) V VOL LOW-level output voltage VDD(PVDD) = 3 V; IO = 4 mA VSS(PVSS) - VSS(PVSS) + 0.4 V IOH HIGH-level output current VDD(PVDD) = 3 V - - 4 mA IOL LOW-level output current VDD(PVDD) = 3 V - - 4 mA Output characteristics Pin SIGOUT VOH HIGH-level output voltage VDD(SVDD) = 3 V; IO = 4 mA VDD(SVDD)  0.4 - VDD(SVDD) V VOL LOW-level output voltage VDD(SVDD) = 3 V; IO = 4 mA VSS(PVSS) - VSS(PVSS) + 0.4 V IOL LOW-level output current VDD(SVDD) = 3 V - - 4 mA IOH HIGH-level output current VDD(SVDD) = 3 V - - 4 mA Pin IRQ VOH HIGH-level output voltage VDD(PVDD) = 3 V; IO = 4 mA VDD(PVDD)  0.4 - VDD(PVDD) V VOL LOW-level output voltage VDD(PVDD) = 3 V; IO = 4 mA VSS(PVSS) - VSS(PVSS) + 0.4 V IOL LOW-level output current VDD(PVDD) = 3 V - - 4 mA IOH HIGH-level output current VDD(PVDD) = 3 V - - 4 mA Table 169. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 114 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Pins AUX1 and AUX2 VOH HIGH-level output voltage VDDD = 3 V; IO = 4 mA VDDD  0.4 - VDDD V VOL LOW-level output voltage VDDD = 3 V; IO = 4 mA VSS(PVSS) - VSS(PVSS) + 0.4 V IOL LOW-level output current VDDD= 3 V - - 4 mA IOH HIGH-level output current VDDD= 3 V - - 4 mA Pins TX1 and TX2 VOL LOW-level output voltage VDD(TVDD) = 3 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 0Fh - - 0.15 V VDD(TVDD) = 3 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 0Fh - - 0.4 V VDD(TVDD) = 2.5 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 0Fh - - 0.24 V VDD(TVDD) = 2.5 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 0Fh - - 0.64 V VOH HIGH-level output voltage VDD(TVDD) = 3 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 3Fh VDD(TVDD)  0.15 - - V VDD(TVDD) = 3 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 3Fh VDD(TVDD)  0.4 - - V VDD(TVDD) = 2.5 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 3Fh VDD(TVDD)  0.24 - - V VDD(TVDD) = 2.5 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 3Fh VDD(TVDD)  0.64 - - V Industrial version: VOL LOW-level output voltage VDD(TVDD) = 2.5 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 3Fh - - 0.18 V VDD(TVDD) = 2.5 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 3Fh - - 0.44 V VOH HIGH-level output voltage VDD(TVDD) = 3 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 3Fh VDD(TVDD)  0.18 - - V VDD(TVDD) = 3 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 3Fh VDD(TVDD)  0.44 - - V Output resistance for TX1/TX2, Industrial Version: ROP,01H High level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsP = 01h 123 180 261  Table 169. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 115 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution ROP,02H High level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsP = 02h 61 90 131  ROP,04H High level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsP = 04h 30 46 68  ROP,08H High level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsP = 08h 15 23 35  ROP,10H High level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsP = 10h 7.5 12 19  ROP,20H High level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsP = 20h 4.2 6 9  ROP,3FH High level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsP = 3Fh 2 3 5  RON,10H Low level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsN = 10h 30 46 68  RON,20H Low level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsN = 20h 15 23 35  RON,40H Low level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsN = 40h 7.5 12 19  RON,80H Low level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsN = 80h 4.2 6 9  RON,F0H Low level output resistance TVDD = 3 V, VTX = TVDD - 100 mV, CWGsN = F0h 2 3 5  Current consumption Ipd power-down current VDDA= VDDD = VDD(TVDD) = VDD(PVDD) = 3 V hard power-down; pin NRSTPD set LOW [2]- - 5 A soft power-down; RF level detector on [2]- - 10 A IDD(PVDD) PVDD supply current pin PVDD [3]- - 40 mA IDD(TVDD) TVDD supply current pin TVDD; continuous wave [4][5][6]- 60 100 mA IDD(SVDD) SVDD supply current pin SVDD [7]- - 4 mA IDDD digital supply current pin DVDD; VDDD= 3 V - 6.5 9 mA IDDA analog supply current pin AVDD; VDDA= 3 V, CommandReg register’s RcvOff bit = 0 - 7 10 mA pin AVDD; receiver switched off; VDDA = 3 V, CommandReg register’s RcvOff bit = 1 - 3 5 mA Industrial version: IDDD digital supply current pin DVDD; VDDD= 3 V - 6.5 9,5 mA Table 169. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 116 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution [1] The voltage on pin RX is clamped by internal diodes to pins AVSS and AVDD. [2] Ipd is the total current for all supplies. [3] IDD(PVDD) depends on the overall load at the digital pins. [4] IDD(TVDD) depends on VDD(TVDD) and the external circuit connected to pins TX1 and TX2. [5] During typical circuit operation, the overall current is below 100 mA. [6] Typical value using a complementary driver configuration and an antenna matched to 40  between pins TX1 and TX2 at 13.56 MHz. [7] IDD(SVDD) depends on the load at pin MFOUT. Ipd power-down current VDDA= VDDD = VDD(TVDD) = VDD(PVDD) = 3 V hard power-down; pin NRSTPD set LOW [2]- - 15 A soft power-down; RF level detector on [2]- - 30 A Clock frequency fclk clock frequency - 27.12 - MHz clk clock duty cycle 40 50 60 % tjit jitter time RMS - - 10 ps Crystal oscillator VOH HIGH-level output voltage pin OSCOUT - 1.1 - V VOL LOW-level output voltage pin OSCOUT - 0.2 - V Ci input capacitance pin OSCOUT - 2 - pF pin OSCIN - 2 - pF Typical input requirements fxtal crystal frequency - 27.12 - MHz ESR equivalent series resistance - - 100  CL load capacitance - 10 - pF Pxtal crystal power dissipation - 50 100 W Table 169. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 117 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 26.1 Timing characteristics Fig 39. Pin RX input voltage range 001aak012 VMID 0 V Vmod Vi(p-p)(max) Vi(p-p)(min) 13.56 MHz carrier Table 170. SPI timing characteristics Symbol Parameter Conditions Min Typ Max Unit tWL pulse width LOW line SCK 50 - - ns tWH pulse width HIGH line SCK 50 - - ns th(SCKH-D) SCK HIGH to data input hold time SCK to changing MOSI 25 - - ns tsu(D-SCKH) data input to SCK HIGH set-up time changing MOSI to SCK 25 - - ns th(SCKL-Q) SCK LOW to data output hold time SCK to changing MISO - - 25 ns t(SCKL-NSSH) SCK LOW to NSS HIGH time 0 - - ns Table 171. I2C-bus timing in Fast mode Symbol Parameter Conditions Fast mode High-speed mode Unit Min Max Min Max fSCL SCL clock frequency 0 400 0 3400 kHz tHD;STA hold time (repeated) START condition after this period, the first clock pulse is generated 600 - 160 - ns tSU;STA set-up time for a repeated START condition 600 - 160 - ns tSU;STO set-up time for STOP condition 600 - 160 - ns tLOW LOW period of the SCL clock 1300 - 160 - ns tHIGH HIGH period of the SCL clock 600 - 60 - ns tHD;DAT data hold time 0 900 0 70 ns PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 118 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution tSU;DAT data set-up time 100 - 10 - ns tr rise time SCL signal 20 300 10 40 ns tf fall time SCL signal 20 300 10 40 ns tr rise time SDA and SCL signals 20 300 10 80 ns tf fall time SDA and SCL signals 20 300 10 80 ns tBUF bus free time between a STOP and START condition 1.3 - 1.3 - s Remark: The signal NSS must be LOW to be able to send several bytes in one data stream. To send more than one data stream NSS must be set HIGH between the data streams. Fig 40. Timing diagram for SPI Fig 41. Timing for Fast and Standard mode devices on the I2C-bus Table 171. I2C-bus timing in Fast mode …continued Symbol Parameter Conditions Fast mode High-speed mode Unit Min Max Min Max 001aaj634 tSCKL tSCKH tSCKL tDXSH tSHDX tDXSH tSLDX tSLNH MOSI SCK MISO MSB MSB LSB LSB NSS 001aaj635 SDA tf SCL tLOW tf tSP tr tHD;STA tHD;DAT tHD;STA tr tHIGH tSU;DAT S Sr P S tSU;STA tSU;STO tBUF PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 119 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 26.2 8-bit parallel interface timing 26.2.1 AC symbols Each timing symbol has five characters. The first character is always 't' for time. The other characters indicate the name of a signal or the logic state of that signal (depending on position): Example: tAVLL = time for address valid to ALE low 26.2.2 AC operating specification 26.2.2.1 Bus timing for separated Read/Write strobe Table 172. AC symbols Designation Signal Designation Logic Level A address H HIGH D data L LOW W NWR or nWait Z high impedance R NRD or R/NW or nWrite X any level or data L ALE or AS V any valid signal or data C NCS N NSS S NDS or nDStrb and nAStrb, SCK Table 173. Timing specification for separated Read/Write strobe Symbol Parameter Min Max Unit tLHLL ALE pulse width 10 - ns tAVLL Multiplexed Address Bus valid to ALE low (Address Set Up Time) 5 - ns tLLAX Multiplexed Address Bus valid after ALE low (Address Hold Time) 5 - ns tLLWL ALE low to NWR, NRD low 10 - ns tCLWL NCS low to NRD, NWR low 0 - ns tWHCH NRD, NWR high to NCS high 0 - ns tRLDV NRD low to DATA valid - 35 ns tRHDZ NRD high to DATA high impedance - 10 ns tDVWH DATA valid to NWR high 5 - ns tWHDX DATA hold after NWR high (Data Hold Time) 5 - ns tWLWH NRD, NWR pulse width 40 - ns tAVWL Separated Address Bus valid to NRD, NWR low (Set Up Time) 30 - ns tWHAX Separated Address Bus valid after NWR high (Hold Time) 5 - ns tWHWL period between sequenced read/write accesses 40 - ns PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 120 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Remark: For separated address and data bus the signal ALE is not relevant and the multiplexed addresses on the data bus don’t care. For the multiplexed address and data bus the address lines A0 to A3 have to be connected as described in chapter Automatic host controller Interface Type Detection. 26.2.2.2 Bus timing for common Read/Write strobe Fig 42. Timing diagram for separated Read/Write strobe 001aan233 tLHLL tCLWL tLLWL tWHWL tWLWH tWHWL tWHDX tRHDZ tWLDV tRLDV tWHCH tWHAX tAVLL tLLAX tAVWL ALE NCS NWR NRD D0...D7 D0...D7 A0...A3 multiplexed addressbus A0...A3 SEPARATED ADDRESSBUS A0...A3 Table 174. Timing specification for common Read/Write strobe Symbol Parameter Min Max Unit tLHLL AS pulse width 10 - ns tAVLL Multiplexed Address Bus valid to AS low (Address Set Up Time) 5 - ns tLLAX Multiplexed Address Bus valid after AS low (Address Hold Time) 5 - ns tLLSL AS low to NDS low 10 - ns tCLSL NCS low to NDS low 0 - ns tSHCH NDS high to NCS high 0 - ns tSLDV,R NDS low to DATA valid (for read cycle) - 35 ns tSHDZ NDS low to DATA high impedance (read cycle) - 10 ns tDVSH DATA valid to NDS high (for write cycle) 5 - ns tSHDX DATA hold after NDS high (write cycle, Hold Time) 5 - ns tSHRX R/NW hold after NDS high 5 - ns tSLSH NDS pulse width 40 - ns tAVSL Separated Address Bus valid to NDS low (Hold Time) 30 - ns tSHAX Separated Address Bus valid after NDS high (Set Up Time) 5 - ns PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 121 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Remark: For separated address and data bus the signal ALE is not relevant and the multiplexed addresses on the data bus don’t care. For the multiplexed address and data bus the address lines A0 to A3 have to be connected as described in Automatic -Controller Interface Type Detection. Fig 43. Timing diagram for common Read/Write strobe SEPARATED ADDRESSBUS A0...A3 multiplexed addressbus A0...A3 ALE tLHLL tCLSL R/NW NDS D0...D7 D0...D7 A0...A3 NCS tSHCH tRVSL tSHRX tLLSL tSLSH tSHSL tAVLL tLLAX tSLDV, R tSLDV, W tSHDX tSHDZ tSHAX tAVSL tSHSL 001aan234 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 122 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 27. Package information The PN512 can be delivered in 3 different packages. Table 175. Package information Package Remarks HVQFN32 8-bit parallel interface not supported HVQFN40 Supports the 8-bit parallel interface TFBGA64 Ball grid array facilitating development of an PCI compliant device PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 123 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 28. Package outline Fig 44. Package outline package version (HVQFN32) 1 0.5 UNIT A1 b Eh e y 0.2 c OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.1 4.9 Dh 3.25 2.95 y1 5.1 4.9 3.25 2.95 e1 3.5 e2 3.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT617-1 - - - MO-220 - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT617-1 HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A(1) max. A A1 c detail X e y1 C y L Eh Dh e e1 b 9 16 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area terminal 1 index area 01-08-08 02-10-18 1/2 e 1/2 e C A C v M B w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 124 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Fig 45. Package outline package version (HVQFN40) Outline References version European projection Issue date IEC JEDEC JEITA SOT618-1 MO-220 sot618-1_po 02-10-22 13-11-05 Unit mm max nom min 1.00 0.05 0.2 6.1 4.25 6.1 0.4 A(1) Dimensions (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618-1 A1 b 0.30 c D(1) Dh E(1) Eh 4.10 e e1 e2 L v w 0.05 y 0.05 y1 0.1 0.85 0.02 0.21 6.0 4.10 6.0 0.80 0.00 0.18 5.9 3.95 5.9 3.95 0.3 4.25 0.5 4.5 4.5 0.5 0.1 e e 1/2 e 1/2 e y terminal 1 index area A A1 c L Eh Dh b 11 20 40 31 30 10 21 1 D E terminal 1 index area 0 2.5 5 mm scale e1 C A C v B w y1 C C e2 X detail X B A PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 125 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Fig 46. Package outline package version (TFBGA64) Outline References version European projection Issue date IEC JEDEC JEITA SOT1336-1 - - - sot1336-1_po 12-06-19 12-08-28 Unit mm max nom min 1.15 0.35 0.45 5.6 5.6 4.55 0.15 0.1 A Dimensions (mm are the original dimensions) TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls A1 A2 0.80 1.00 0.30 0.70 0.40 5.5 5.5 0.65 b D E e e1 4.55 0.90 0.25 0.65 0.35 5.4 5.4 e2 v w 0.08 y y1 0.1 SOT1336-1 C y1 C y 0 5 mm scale X A A2 A1 detail X ball A1 index area ball A1 index area A E D B e2 e A B C D E F G H 1 2 3 4 5 6 7 8 e1 e Ø v C A B Ø w C b 1/2 e 1/2 e PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 126 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 29. Abbreviations 30. Glossary Modulation index — Defined as the voltage ratio (Vmax  Vmin) / (Vmax + Vmin). Load modulation index — Defined as the voltage ratio for the card (Vmax  Vmin) / (Vmax + Vmin) measured at the card’s coil. Initiator — Generates RF field at 13.56 MHz and starts the NFCIP-1 communication. Target — Responds to command either using load modulation scheme (RF field generated by Initiator) or using modulation of self generated RF field (no RF field generated by initiator). 31. References [1] Application note — NFC Transmission Module Antenna and RF Design Guide Table 176. Abbreviations Acronym Description ADC Analog-to-Digital Converter ASK Amplitude Shift keying BPSK Binary Phase Shift Keying CRC Cyclic Redundancy Check CW Continuous Wave DAC Digital-to-Analog Converter EOF End of frame HBM Human Body Model I2C Inter-integrated Circuit LSB Least Significant Bit MISO Master In Slave Out MM Machine Model MOSI Master Out Slave In MSB Most Significant Bit NSS Not Slave Select PCB Printed-Circuit Board PLL Phase-Locked Loop PRBS Pseudo-Random Bit Sequence RX Receiver SOF Start Of Frame SPI Serial Peripheral Interface TX Transmitter UART Universal Asynchronous Receiver Transmitter PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 127 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 32. Revision history Table 177. Revision history Document ID Release date Data sheet status Change notice Supersedes PN512 v.4.5 20131217 Product data sheet - PN512 v.4.4 Modifications: • Typo corrected PN512 v.4.4 20130730 Product data sheet - PN512 v.4.3 Modifications: • Value added in Table 166 “Limiting values” • Change of descriptive title PN512 v.4.3 20130507 Product data sheet - PN512 v.4.2 Modifications: • New type PN5120A0ET/C2 added • Table 72 “Description of MifNFCReg bits”: description of TxWait updated • Table 153 “Register and bit settings controlling the signal on pin TX1” and Table 153 “Register and bit settings controlling the signal on pin TX1”: updated • Table 166 “Limiting values”: VESD values added PN512 v.4.2 20120828 Product data sheet - PN512 v.4.1 Modifications: • Table 123 “AutoTestReg register (address 36h); reset value: 40h, 01000000b”: description of bits 4 and 5 corrected PN512 v.4.1 20120821 Product data sheet - PN512 v.4.0 Modifications: • Table 124 “Description of bits”: description of bits 4 and 5 corrected PN512 v.4.0 20120712 Product data sheet - PN512 v.3.9 Modifications: • Section 33.4 “Licenses”: updated PN512 v.3.9 20120201 Product data sheet - PN512 v.3.8 Modifications: • Adding information on the different version in General description. • Adding Section 21 “Errata sheet” on page 109 for explanation of differences between 1.0 and 2.0. • Adding ordering information for version 1.0 and industrial version in Table 2 “Ordering information” on page 5 • Adding the limitations and characteristics for the industrial version, see Table 1 “Quick reference data” on page 4, Table 166 “Limiting values” on page 111, Table 1 “Quick reference data” on page 4 • Referring to the Section 21 “Errata sheet” on page 109 within the following sections: Section 9.2.2.4 “RxModeReg” on page 39, Section 9.2.2.10 “DemodReg” on page 45, Section 9.2.2.15 “TypeBReg” on page 50, Section 9.2.3.10 “TMode Register, TPrescaler Register” on page 57, Section 9.2.4.7 “AutoTestReg” on page 64, Section 9.2.4.8 “VersionReg” on page 64, Section 9.1.1 “Register bit behavior” on page 23, Section 15 “Timer unit” on page 96, Section 20 “Testsignals” on page 107; • Update of command ‘Mem’ to ‘Configure’ and ‘RFU’ to ‘Autocoll’ in Table 158 “Command overview” on page 101. • Change of ‘Mem’ to ‘Configure’ in ‘Mem’ in Section 19.3.1.2 “Config command” on page 101 • Adding Autocoll in Section 19.3.1.9 “AutoColl” on page 103 PN512 v.3.8 20111025 Product data sheet - PN512 v.3.7 Modifications: • Table 168 “Characteristics”: unit of Pxtal corrected 111310 June 2005 Objective data sheet - Modifications: • Initial version PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 128 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 33. Legal information 33.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 33.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 33.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 129 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 33.4 Licenses 33.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. MIFARE — is a trademark of NXP B.V. 34. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Purchase of NXP ICs with ISO/IEC 14443 type B functionality This NXP Semiconductors IC is ISO/IEC 14443 Type B software enabled and is licensed under Innovatron’s Contactless Card patents license for ISO/IEC 14443 B. The license includes the right to use the IC in systems and/or end-user equipment. RATP/Innovatron Technology Purchase of NXP ICs with NFC technology Purchase of an NXP Semiconductors IC that complies with one of the Near Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey an implied license under any patent right infringed by implementation of any of those standards. PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 130 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 35. Tables Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .4 Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .5 Table 3. Pin description HVQFN32 . . . . . . . . . . . . . . . .10 Table 4. Pin description HVQFN40 . . . . . . . . . . . . . . . . 11 Table 5. Pin description TFBGA64 . . . . . . . . . . . . . . . . .12 Table 6. Communication overview for ISO/IEC 14443 A/MIFARE reader/writer . . . . .14 Table 7. Communication overview for FeliCa reader/writer . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Table 8. FeliCa framing and coding . . . . . . . . . . . . . . . .16 Table 9. Start value for the CRC Polynomial: (00h), (00h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Table 10. Communication overview for Active communication mode . . . . . . . . . . . . . . . . . . . .18 Table 11. Communication overview for Passive communication mode . . . . . . . . . . . . . . . . . . . .19 Table 12. Framing and coding overview. . . . . . . . . . . . . .20 Table 13. MIFARE Card operation mode . . . . . . . . . . . . .20 Table 14. FeliCa Card operation mode . . . . . . . . . . . . . .21 Table 15. PN512 registers overview . . . . . . . . . . . . . . . .21 Table 16. Behavior of register bits and its designation. . .23 Table 17. PageReg register (address 00h); reset value: 00h, 0000000b . . . . . . . . . . . . . . . . . . . . . . . . .24 Table 18. Description of PageReg bits . . . . . . . . . . . . . . .24 Table 19. CommandReg register (address 01h); reset value: 20h, 00100000b . . . . . . . . . . . . . . . . . . .24 Table 20. Description of CommandReg bits. . . . . . . . . . .24 Table 21. CommIEnReg register (address 02h); reset value: 80h, 10000000b . . . . . . . . . . . . . . . . . . .25 Table 22. Description of CommIEnReg bits . . . . . . . . . . .25 Table 23. DivIEnReg register (address 03h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . . . . . . .26 Table 24. Description of DivIEnReg bits . . . . . . . . . . . . . .26 Table 25. CommIRqReg register (address 04h); reset value: 14h, 00010100b . . . . . . . . . . . . . . . . . . .27 Table 26. Description of CommIRqReg bits . . . . . . . . . . .27 Table 27. DivIRqReg register (address 05h); reset value: XXh, 000X00XXb . . . . . . . . . . . . . . . . . .28 Table 28. Description of DivIRqReg bits . . . . . . . . . . . . .28 Table 29. ErrorReg register (address 06h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . . . . . . .29 Table 30. Description of ErrorReg bits . . . . . . . . . . . . . . .29 Table 31. Status1Reg register (address 07h); reset value: XXh, X100X01Xb . . . . . . . . . . . . . . . . . .30 Table 32. Description of Status1Reg bits . . . . . . . . . . . . .30 Table 33. Status2Reg register (address 08h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . .31 Table 34. Description of Status2Reg bits . . . . . . . . . . . . .31 Table 35. FIFODataReg register (address 09h); reset value: XXh, XXXXXXXXb . . . . . . . . . . . . . . . . .32 Table 36. Description of FIFODataReg bits . . . . . . . . . . .32 Table 37. FIFOLevelReg register (address 0Ah); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . .32 Table 38. Description of FIFOLevelReg bits. . . . . . . . . . .32 Table 39. WaterLevelReg register (address 0Bh); reset value: 08h, 00001000b . . . . . . . . . . . . . . . . . . .33 Table 40. Description of WaterLevelReg bits. . . . . . . . . . 33 Table 41. ControlReg register (address 0Ch); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 33 Table 42. Description of ControlReg bits . . . . . . . . . . . . 33 Table 43. BitFramingReg register (address 0Dh); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 34 Table 44. Description of BitFramingReg bits . . . . . . . . . . 34 Table 45. CollReg register (address 0Eh); reset value: XXh, 101XXXXXb . . . . . . . . . . . . . . . . . 35 Table 46. Description of CollReg bits. . . . . . . . . . . . . . . . 35 Table 47. PageReg register (address 10h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 36 Table 48. Description of PageReg bits . . . . . . . . . . . . . . 36 Table 49. ModeReg register (address 11h); reset value: 3Bh, 00111011b . . . . . . . . . . . . . . . . . . . . . . . . 37 Table 50. Description of ModeReg bits . . . . . . . . . . . . . . 37 Table 51. TxModeReg register (address 12h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 38 Table 52. Description of TxModeReg bits . . . . . . . . . . . . 38 Table 53. RxModeReg register (address 13h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 39 Table 54. Description of RxModeReg bits . . . . . . . . . . . . 39 Table 55. TxControlReg register (address 14h); reset value: 80h, 10000000b . . . . . . . . . . . . . . . . . . 40 Table 56. Description of TxControlReg bits . . . . . . . . . . . 40 Table 57. TxAutoReg register (address 15h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 41 Table 58. Description of TxAutoReg bits . . . . . . . . . . . . . 41 Table 59. TxSelReg register (address 16h); reset value: 10h, 00010000b. . . . . . . . . . . . . . . . . . . . . . . . 42 Table 60. Description of TxSelReg bits . . . . . . . . . . . . . . 42 Table 61. RxSelReg register (address 17h); reset value: 84h, 10000100b. . . . . . . . . . . . . . . . . . . . . . . . 44 Table 62. Description of RxSelReg bits . . . . . . . . . . . . . . 44 Table 63. RxThresholdReg register (address 18h); reset value: 84h, 10000100b . . . . . . . . . . . . . . 44 Table 64. Description of RxThresholdReg bits . . . . . . . . 44 Table 65. DemodReg register (address 19h); reset value: 4Dh, 01001101b . . . . . . . . . . . . . . . . . . 45 Table 66. Description of DemodReg bits . . . . . . . . . . . . . 45 Table 67. FelNFC1Reg register (address 1Ah); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 46 Table 68. Description of FelNFC1Reg bits . . . . . . . . . . . 46 Table 69. FelNFC2Reg register (address1Bh); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 47 Table 70. Description of FelNFC2Reg bits . . . . . . . . . . . 47 Table 71. MifNFCReg register (address 1Ch); reset value: 62h, 01100010b. . . . . . . . . . . . . . . . . . . 48 Table 72. Description of MifNFCReg bits. . . . . . . . . . . . . 48 Table 73. ManualRCVReg register (address 1Dh); reset value: 00h, 00000000b . . . . . . . . . . . . . . 49 Table 74. Description of ManualRCVReg bits . . . . . . . . . 49 Table 75. TypeBReg register (address 1Eh); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 50 Table 76. Description of TypeBReg bits. . . . . . . . . . . . . . 50 Table 77. SerialSpeedReg register (address 1Fh); PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 131 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution reset value: EBh, 11101011b . . . . . . . . . . . . . .51 Table 78. Description of SerialSpeedReg bits . . . . . . . . .51 Table 79. PageReg register (address 20h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . . . . . . .52 Table 80. Description of PageReg bits . . . . . . . . . . . . . . .52 Table 81. CRCResultReg register (address 21h); reset value: FFh, 11111111b. . . . . . . . . . . . . . . . . . . .52 Table 82. Description of CRCResultReg bits . . . . . . . . . .52 Table 83. CRCResultReg register (address 22h); reset value: FFh, 11111111b. . . . . . . . . . . . . . . . . . . .52 Table 84. Description of CRCResultReg bits . . . . . . . . . .52 Table 85. GsNOffReg register (address 23h); reset value: 88h, 10001000b . . . . . . . . . . . . . . . . . . .53 Table 86. Description of GsNOffReg bits . . . . . . . . . . . . .53 Table 87. ModWidthReg register (address 24h); reset value: 26h, 00100110b . . . . . . . . . . . . . . . . . . .54 Table 88. Description of ModWidthReg bits . . . . . . . . . . .54 Table 89. TxBitPhaseReg register (address 25h); reset value: 87h, 10000111b . . . . . . . . . . . . . . . . . . .54 Table 90. Description of TxBitPhaseReg bits . . . . . . . . . .54 Table 91. RFCfgReg register (address 26h); reset value: 48h, 01001000b . . . . . . . . . . . . . . . . . . .55 Table 92. Description of RFCfgReg bits . . . . . . . . . . . . .55 Table 93. GsNOnReg register (address 27h); reset value: 88h, 10001000b . . . . . . . . . . . . . . . . . . .56 Table 94. Description of GsNOnReg bits . . . . . . . . . . . . .56 Table 95. CWGsPReg register (address 28h); reset value: 20h, 00100000b . . . . . . . . . . . . . . . . . . .56 Table 96. Description of CWGsPReg bits. . . . . . . . . . . . .56 Table 97. ModGsPReg register (address 29h); reset value: 20h, 00100000b . . . . . . . . . . . . . . . . . . .57 Table 98. Description of ModGsPReg bits . . . . . . . . . . . .57 Table 99. TModeReg register (address 2Ah); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . .57 Table 100. Description of TModeReg bits . . . . . . . . . . . . .57 Table 101. TPrescalerReg register (address 2Bh); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . .58 Table 102. Description of TPrescalerReg bits . . . . . . . . . .58 Table 103. TReloadReg (Higher bits) register (address 2Ch); reset value: 00h, 00000000b . . . . . . . . .59 Table 104. Description of the higher TReloadReg bits . . .59 Table 105. TReloadReg (Lower bits) register (address 2Dh); reset value: 00h, 00000000b . . . . . . . . .59 Table 106. Description of lower TReloadReg bits . . . . . . .59 Table 107. TCounterValReg (Higher bits) register (address 2Eh); reset value: XXh, XXXXXXXXb . . . . . . .60 Table 108. Description of the higher TCounterValReg bits 60 Table 109. TCounterValReg (Lower bits) register (address 2Fh); reset value: XXh, XXXXXXXXb. . . . . . . .60 Table 110. Description of lower TCounterValReg bits . . . .60 Table 111. PageReg register (address 30h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . . . . . . .60 Table 112. Description of PageReg bits. . . . . . . . . . . . . . .61 Table 113. TestSel1Reg register (address 31h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . .62 Table 114. Description of TestSel1Reg bits . . . . . . . . . . . .62 Table 115. TestSel2Reg register (address 32h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . .62 Table 116. Description of TestSel2Reg bits. . . . . . . . . . . . 62 Table 117. TestPinEnReg register (address 33h); reset value: 80h, 10000000b . . . . . . . . . . . . . . . . . . 63 Table 118. Description of TestPinEnReg bits . . . . . . . . . . 63 Table 119. TestPinValueReg register (address 34h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 63 Table 120. Description of TestPinValueReg bits . . . . . . . . 63 Table 121. TestBusReg register (address 35h); reset value: XXh, XXXXXXXXb . . . . . . . . . . . . . . . . 64 Table 122. Description of TestBusReg bits . . . . . . . . . . . . 64 Table 123. AutoTestReg register (address 36h); reset value: 40h, 01000000b . . . . . . . . . . . . . . . . . . 64 Table 124. Description of bits . . . . . . . . . . . . . . . . . . . . . . 64 Table 125. VersionReg register (address 37h); reset value: XXh, XXXXXXXXb . . . . . . . . . . . . . . . . 65 Table 126. Description of VersionReg bits . . . . . . . . . . . . 65 Table 127. AnalogTestReg register (address 38h); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 66 Table 128. Description of AnalogTestReg bits . . . . . . . . . 66 Table 129. TestDAC1Reg register (address 39h); reset value: XXh, 00XXXXXXb . . . . . . . . . . . . . . . . . 67 Table 130. Description of TestDAC1Reg bits . . . . . . . . . . 67 Table 131. TestDAC2Reg register (address 3Ah); reset value: XXh, 00XXXXXXb . . . . . . . . . . . . . . . . . 67 Table 132. Description ofTestDAC2Reg bits. . . . . . . . . . . 67 Table 133. TestADCReg register (address 3Bh); reset value: XXh, XXXXXXXXb . . . . . . . . . . . . . . . . 67 Table 134. Description of TestADCReg bits . . . . . . . . . . . 67 Table 135. RFTReg register (address 3Ch); reset value: FFh, 11111111b . . . . . . . . . . . . . . . . . . . . . . . . 68 Table 136. Description of RFTReg bits . . . . . . . . . . . . . . . 68 Table 137. RFTReg register (address 3Dh, 3Fh); reset value: 00h, 00000000b . . . . . . . . . . . . . . . . . . 68 Table 138. Description of RFTReg bits . . . . . . . . . . . . . . . 68 Table 139. RFTReg register (address 3Eh); reset value: 03h, 00000011b . . . . . . . . . . . . . . . . . . . . . . . . 68 Table 140. Description of RFTReg bits . . . . . . . . . . . . . . . 68 Table 141. Connection protocol for detecting different interface types . . . . . . . . . . . . . . . . . . . . . . . . . 69 Table 142. Connection scheme for detecting the different interface types . . . . . . . . . . . . . . . . . . . . . . . . . 69 Table 143. MOSI and MISO byte order . . . . . . . . . . . . . . 70 Table 144. MOSI and MISO byte order . . . . . . . . . . . . . . 71 Table 145. Address byte 0 register; address MOSI . . . . . 71 Table 146. BR_T0 and BR_T1 settings . . . . . . . . . . . . . . 72 Table 147. Selectable UART transfer speeds . . . . . . . . . 72 Table 148. UART framing . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 149. Read data byte order . . . . . . . . . . . . . . . . . . . 73 Table 150. Write data byte order . . . . . . . . . . . . . . . . . . . 73 Table 151. Address byte 0 register; address MOSI . . . . . 75 Table 152. Supported interface types . . . . . . . . . . . . . . . . 82 Table 153. Register and bit settings controlling the signal on pin TX1 . . . . . . . . . . . . . . . . . . . . . . 84 Table 154. Register and bit settings controlling the signal on pin TX2 . . . . . . . . . . . . . . . . . . . . . . 85 Table 155. Setting of the bits RFlevel in register RFCfgReg (RFLevel amplifier deactivated) . . . 86 Table 156. CRC coprocessor parameters . . . . . . . . . . . . 93 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 132 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution Table 157. Interrupt sources . . . . . . . . . . . . . . . . . . . . . . .95 Table 158. Command overview . . . . . . . . . . . . . . . . . . .101 Table 159. Testsignal routing (TestSel2Reg = 07h) . . . . .107 Table 160. Description of Testsignals . . . . . . . . . . . . . . .107 Table 161. Testsignal routing (TestSel2Reg = 0Dh) . . . .108 Table 162. Description of Testsignals . . . . . . . . . . . . . . .108 Table 163. Testsignal routing (TestSel2Reg = 19h) . . . . .108 Table 164. Description of Testsignals . . . . . . . . . . . . . . .108 Table 165. Testsignals description. . . . . . . . . . . . . . . . . .108 Table 166. Limiting values . . . . . . . . . . . . . . . . . . . . . . . 111 Table 167. Operating conditions . . . . . . . . . . . . . . . . . . . 111 Table 168. Thermal characteristics . . . . . . . . . . . . . . . . . 112 Table 169. Characteristics . . . . . . . . . . . . . . . . . . . . . . . 112 Table 170. SPI timing characteristics . . . . . . . . . . . . . . . 117 Table 171. I2C-bus timing in Fast mode . . . . . . . . . . . . . 117 Table 172. AC symbols . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Table 173. Timing specification for separated Read/Write strobe. . . . . . . . . . . . . . . . . . . . . . 119 Table 174. Timing specification for common Read/Write strobe. . . . . . . . . . . . . . . . . . . . . .120 Table 175. Package information . . . . . . . . . . . . . . . . . . .122 Table 176. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . .126 Table 177. Revision history . . . . . . . . . . . . . . . . . . . . . . .127 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 133 of 136 NXP Semiconductors PN512 Full NFC Forum compliant solution 36. Figures Fig 1. Simplified block diagram of the PN512 . . . . . . . . .6 Fig 2. Detailed block diagram of the PN512 . . . . . . . . . .7 Fig 3. Pinning configuration HVQFN32 (SOT617-1) . . . .8 Fig 4. Pinning configuration HVQFN40 (SOT618-1) . . . .8 Fig 5. Pin configuration TFBGA64 (SOT1336-1) . . . . . . .9 Fig 6. PN512 Read/Write mode. . . . . . . . . . . . . . . . . . .14 Fig 7. ISO/IEC 14443 A/MIFARE Read/Write mode communication diagram. . . . . . . . . . . . . . . . . . . .14 Fig 8. Data coding and framing according to ISO/IEC 14443 A . . . . . . . . . . . . . . . . . . . . . . . . .15 Fig 9. FeliCa reader/writer communication diagram . . .16 Fig 10. NFCIP-1 mode. . . . . . . . . . . . . . . . . . . . . . . . . . .17 Fig 11. Active communication mode . . . . . . . . . . . . . . . .18 Fig 12. Passive communication mode . . . . . . . . . . . . . . .19 Fig 13. SPI connection to host. . . . . . . . . . . . . . . . . . . . .70 Fig 14. UART connection to microcontrollers . . . . . . . . .71 Fig 15. UART read data timing diagram . . . . . . . . . . . . .73 Fig 16. UART write data timing diagram . . . . . . . . . . . . .74 Fig 17. I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . . . .75 Fig 18. Bit transfer on the I2C-bus . . . . . . . . . . . . . . . . . .76 Fig 19. START and STOP conditions . . . . . . . . . . . . . . .76 Fig 20. Acknowledge on the I2C-bus . . . . . . . . . . . . . . . .77 Fig 21. Data transfer on the I2C-bus . . . . . . . . . . . . . . . .77 Fig 22. First byte following the START procedure . . . . . .78 Fig 23. Register read and write access . . . . . . . . . . . . . .79 Fig 24. I2C-bus HS mode protocol switch . . . . . . . . . . . .80 Fig 25. I2C-bus HS mode protocol frame. . . . . . . . . . . . .81 Fig 26. Connection to host controller with separated Read/Write strobes . . . . . . . . . . . . . . . . . . . . . . .83 Fig 27. Connection to host controller with common Read/Write strobes . . . . . . . . . . . . . . . . . . . . . . .83 Fig 28. Data mode detector . . . . . . . . . . . . . . . . . . . . . . .87 Fig 29. Serial data switch for TX1 and TX2 . . . . . . . . . . .88 Fig 30. Communication flows using the S2C interface. . .89 Fig 31. Signal shape for SIGOUT in FeliCa card SAM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90 Fig 32. Signal shape for SIGIN in SAM mode . . . . . . . . .90 Fig 33. Signal shape for SIGOUT in MIFARE Card SAM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91 Fig 34. Signal shape for SIGIN in MIFARE Card SAM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91 Fig 35. Quartz crystal connection . . . . . . . . . . . . . . . . . .99 Fig 36. Oscillator start-up time . . . . . . . . . . . . . . . . . . . .100 Fig 37. Autocoll Command . . . . . . . . . . . . . . . . . . . . . .104 Fig 38. Typical circuit diagram . . . . . . . . . . . . . . . . . . . . 110 Fig 39. Pin RX input voltage range . . . . . . . . . . . . . . . . 116 Fig 40. Timing diagram for SPI . . . . . . . . . . . . . . . . . . . 118 Fig 41. Timing for Fast and Standard mode devices on the I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Fig 42. Timing diagram for separated Read/Write strobe. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120 Fig 43. Timing diagram for common Read/Write strobe 121 Fig 44. Package outline package version (HVQFN32) .123 Fig 45. Package outline package version (HVQFN40) .124 Fig 46. Package outline package version (TFBGA64). .125 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 134 of 136 continued >> NXP Semiconductors PN512 Full NFC Forum compliant solution 37. Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Different available versions. . . . . . . . . . . . . . . . 1 2 General description . . . . . . . . . . . . . . . . . . . . . . 1 3 Features and benefits . . . . . . . . . . . . . . . . . . . . 3 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 4 5 Ordering information. . . . . . . . . . . . . . . . . . . . . 5 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 8 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 8 Functional description . . . . . . . . . . . . . . . . . . 14 8.1 ISO/IEC 14443 A/MIFARE functionality . . . . . 14 8.2 ISO/IEC 14443 B functionality . . . . . . . . . . . . 15 8.3 FeliCa reader/writer functionality . . . . . . . . . . 16 8.3.1 FeliCa framing and coding . . . . . . . . . . . . . . . 16 8.4 NFCIP-1 mode . . . . . . . . . . . . . . . . . . . . . . . . 17 8.4.1 Active communication mode . . . . . . . . . . . . . 18 8.4.2 Passive communication mode . . . . . . . . . . . . 19 8.4.3 NFCIP-1 framing and coding . . . . . . . . . . . . . 20 8.4.4 NFCIP-1 protocol support. . . . . . . . . . . . . . . . 20 8.4.5 MIFARE Card operation mode . . . . . . . . . . . . 20 8.4.6 FeliCa Card operation mode . . . . . . . . . . . . . 21 9 PN512 register SET . . . . . . . . . . . . . . . . . . . . . 21 9.1 PN512 registers overview. . . . . . . . . . . . . . . . 21 9.1.1 Register bit behavior. . . . . . . . . . . . . . . . . . . . 23 9.2 Register description . . . . . . . . . . . . . . . . . . . . 24 9.2.1 Page 0: Command and status . . . . . . . . . . . . 24 9.2.1.1 PageReg. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 9.2.1.2 CommandReg . . . . . . . . . . . . . . . . . . . . . . . . 24 9.2.1.3 CommIEnReg . . . . . . . . . . . . . . . . . . . . . . . . . 25 9.2.1.4 DivIEnReg . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 9.2.1.5 CommIRqReg. . . . . . . . . . . . . . . . . . . . . . . . . 27 9.2.1.6 DivIRqReg . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 9.2.1.7 ErrorReg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 9.2.1.8 Status1Reg . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9.2.1.9 Status2Reg . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 9.2.1.10 FIFODataReg . . . . . . . . . . . . . . . . . . . . . . . . . 32 9.2.1.11 FIFOLevelReg . . . . . . . . . . . . . . . . . . . . . . . . 32 9.2.1.12 WaterLevelReg . . . . . . . . . . . . . . . . . . . . . . . . 33 9.2.1.13 ControlReg . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 9.2.1.14 BitFramingReg . . . . . . . . . . . . . . . . . . . . . . . . 34 9.2.1.15 CollReg. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 9.2.2 Page 1: Communication . . . . . . . . . . . . . . . . . 36 9.2.2.1 PageReg. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 9.2.2.2 ModeReg . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.2.2.3 TxModeReg . . . . . . . . . . . . . . . . . . . . . . . . . . 38 9.2.2.4 RxModeReg. . . . . . . . . . . . . . . . . . . . . . . . . . 39 9.2.2.5 TxControlReg. . . . . . . . . . . . . . . . . . . . . . . . . 40 9.2.2.6 TxAutoReg . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 9.2.2.7 TxSelReg . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 9.2.2.8 RxSelReg. . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 9.2.2.9 RxThresholdReg . . . . . . . . . . . . . . . . . . . . . . 44 9.2.2.10 DemodReg. . . . . . . . . . . . . . . . . . . . . . . . . . . 45 9.2.2.11 FelNFC1Reg . . . . . . . . . . . . . . . . . . . . . . . . . 46 9.2.2.12 FelNFC2Reg . . . . . . . . . . . . . . . . . . . . . . . . . 47 9.2.2.13 MifNFCReg . . . . . . . . . . . . . . . . . . . . . . . . . . 48 9.2.2.14 ManualRCVReg. . . . . . . . . . . . . . . . . . . . . . . 49 9.2.2.15 TypeBReg . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 9.2.2.16 SerialSpeedReg. . . . . . . . . . . . . . . . . . . . . . . 50 9.2.3 Page 2: Configuration . . . . . . . . . . . . . . . . . . 52 9.2.3.1 PageReg . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 9.2.3.2 CRCResultReg . . . . . . . . . . . . . . . . . . . . . . . 52 9.2.3.3 GsNOffReg . . . . . . . . . . . . . . . . . . . . . . . . . . 53 9.2.3.4 ModWidthReg . . . . . . . . . . . . . . . . . . . . . . . . 54 9.2.3.5 TxBitPhaseReg . . . . . . . . . . . . . . . . . . . . . . . 54 9.2.3.6 RFCfgReg . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 9.2.3.7 GsNOnReg . . . . . . . . . . . . . . . . . . . . . . . . . . 56 9.2.3.8 CWGsPReg . . . . . . . . . . . . . . . . . . . . . . . . . . 56 9.2.3.9 ModGsPReg . . . . . . . . . . . . . . . . . . . . . . . . . 57 9.2.3.10 TMode Register, TPrescaler Register . . . . . . 57 9.2.3.11 TReloadReg. . . . . . . . . . . . . . . . . . . . . . . . . . 59 9.2.3.12 TCounterValReg . . . . . . . . . . . . . . . . . . . . . . 60 9.2.4 Page 3: Test . . . . . . . . . . . . . . . . . . . . . . . . . . 60 9.2.4.1 PageReg . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 9.2.4.2 TestSel1Reg. . . . . . . . . . . . . . . . . . . . . . . . . . 62 9.2.4.3 TestSel2Reg. . . . . . . . . . . . . . . . . . . . . . . . . . 62 9.2.4.4 TestPinEnReg . . . . . . . . . . . . . . . . . . . . . . . . 63 9.2.4.5 TestPinValueReg . . . . . . . . . . . . . . . . . . . . . . 63 9.2.4.6 TestBusReg . . . . . . . . . . . . . . . . . . . . . . . . . . 64 9.2.4.7 AutoTestReg . . . . . . . . . . . . . . . . . . . . . . . . . 64 9.2.4.8 VersionReg . . . . . . . . . . . . . . . . . . . . . . . . . . 64 9.2.4.9 AnalogTestReg. . . . . . . . . . . . . . . . . . . . . . . . 66 9.2.4.10 TestDAC1Reg . . . . . . . . . . . . . . . . . . . . . . . . 67 9.2.4.11 TestDAC2Reg . . . . . . . . . . . . . . . . . . . . . . . . 67 9.2.4.12 TestADCReg . . . . . . . . . . . . . . . . . . . . . . . . . 67 9.2.4.13 RFTReg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 10 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . 68 10.1 Automatic microcontroller interface detection 68 10.2 Serial Peripheral Interface . . . . . . . . . . . . . . . 70 10.2.1 SPI read data . . . . . . . . . . . . . . . . . . . . . . . . . 70 10.2.2 SPI write data. . . . . . . . . . . . . . . . . . . . . . . . . 70 10.2.3 SPI address byte . . . . . . . . . . . . . . . . . . . . . . 71 10.3 UART interface . . . . . . . . . . . . . . . . . . . . . . . 71 10.3.1 Connection to a host . . . . . . . . . . . . . . . . . . . 71 PN512 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.5 — 17 December 2013 111345 135 of 136 continued >> NXP Semiconductors PN512 Full NFC Forum compliant solution 10.3.2 Selectable UART transfer speeds . . . . . . . . . 71 10.3.3 UART framing . . . . . . . . . . . . . . . . . . . . . . . . . 72 10.4 I2C Bus Interface . . . . . . . . . . . . . . . . . . . . . . 75 10.4.1 Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . 76 10.4.2 START and STOP conditions . . . . . . . . . . . . . 76 10.4.3 Byte format . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 10.4.4 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 77 10.4.5 7-Bit addressing . . . . . . . . . . . . . . . . . . . . . . . 78 10.4.6 Register write access . . . . . . . . . . . . . . . . . . . 78 10.4.7 Register read access . . . . . . . . . . . . . . . . . . . 79 10.4.8 High-speed mode . . . . . . . . . . . . . . . . . . . . . . 80 10.4.9 High-speed transfer . . . . . . . . . . . . . . . . . . . . 80 10.4.10 Serial data transfer format in HS mode . . . . . 80 10.4.11 Switching between F/S mode and HS mode . 82 10.4.12 PN512 at lower speed modes . . . . . . . . . . . . 82 11 8-bit parallel interface . . . . . . . . . . . . . . . . . . . 82 11.1 Overview of supported host controller interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 11.2 Separated Read/Write strobe . . . . . . . . . . . . . 83 11.3 Common Read/Write strobe . . . . . . . . . . . . . . 83 12 Analog interface and contactless UART . . . . 84 12.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 12.2 TX driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 12.3 RF level detector . . . . . . . . . . . . . . . . . . . . . . 85 12.4 Data mode detector . . . . . . . . . . . . . . . . . . . . 86 12.5 Serial data switch . . . . . . . . . . . . . . . . . . . . . . 88 12.6 S2C interface support . . . . . . . . . . . . . . . . . . . 88 12.6.1 Signal shape for Felica S2C interface support 90 12.6.2 Waveform shape for ISO/IEC 14443A and MIFARE S2C support . . . . . . . . . . . . . . . . . . . 91 12.7 Hardware support for FeliCa and NFC polling 92 12.7.1 Polling sequence functionality for initiator. . . . 92 12.7.2 Polling sequence functionality for target . . . . . 92 12.7.3 Additional hardware support for FeliCa and NFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 12.7.4 CRC coprocessor . . . . . . . . . . . . . . . . . . . . . . 93 13 FIFO buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 13.1 Accessing the FIFO buffer . . . . . . . . . . . . . . . 94 13.2 Controlling the FIFO buffer . . . . . . . . . . . . . . . 94 13.3 FIFO buffer status information . . . . . . . . . . . . 94 14 Interrupt request system. . . . . . . . . . . . . . . . . 95 14.1 Interrupt sources overview . . . . . . . . . . . . . . . 95 15 Timer unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 16 Power reduction modes . . . . . . . . . . . . . . . . . 98 16.1 Hard power-down . . . . . . . . . . . . . . . . . . . . . . 98 16.2 Soft power-down mode. . . . . . . . . . . . . . . . . . 98 16.3 Transmitter power-down mode . . . . . . . . . . . . 98 17 Oscillator circuitry . . . . . . . . . . . . . . . . . . . . . . 99 18 Reset and oscillator start-up time . . . . . . . . . 99 18.1 Reset timing requirements . . . . . . . . . . . . . . . 99 18.2 Oscillator start-up time . . . . . . . . . . . . . . . . . . 99 19 PN512 command set . . . . . . . . . . . . . . . . . . . 100 19.1 General description . . . . . . . . . . . . . . . . . . . 100 19.2 General behavior . . . . . . . . . . . . . . . . . . . . . 100 19.3 PN512 command overview . . . . . . . . . . . . . 101 19.3.1 PN512 command descriptions . . . . . . . . . . . 101 19.3.1.1 Idle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 19.3.1.2 Config command . . . . . . . . . . . . . . . . . . . . . 101 19.3.1.3 Generate RandomID . . . . . . . . . . . . . . . . . . 102 19.3.1.4 CalcCRC . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 19.3.1.5 Transmit . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 19.3.1.6 NoCmdChange . . . . . . . . . . . . . . . . . . . . . . 102 19.3.1.7 Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 19.3.1.8 Transceive . . . . . . . . . . . . . . . . . . . . . . . . . . 103 19.3.1.9 AutoColl . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 19.3.1.10 MFAuthent . . . . . . . . . . . . . . . . . . . . . . . . . . 105 19.3.1.11 SoftReset . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 20 Testsignals. . . . . . . . . . . . . . . . . . . . . . . . . . . 107 20.1 Selftest . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 20.2 Testbus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 20.3 Testsignals at pin AUX . . . . . . . . . . . . . . . . . 108 20.4 PRBS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 21 Errata sheet . . . . . . . . . . . . . . . . . . . . . . . . . . 109 22 Application design-in information. . . . . . . . . 110 23 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 111 24 Recommended operating conditions . . . . . . 111 25 Thermal characteristics . . . . . . . . . . . . . . . . . 112 26 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 112 26.1 Timing characteristics . . . . . . . . . . . . . . . . . . 117 26.2 8-bit parallel interface timing . . . . . . . . . . . . . 119 26.2.1 AC symbols . . . . . . . . . . . . . . . . . . . . . . . . . . 119 26.2.2 AC operating specification . . . . . . . . . . . . . . . 119 26.2.2.1 Bus timing for separated Read/Write strobe . 119 26.2.2.2 Bus timing for common Read/Write strobe . 120 27 Package information. . . . . . . . . . . . . . . . . . . 122 28 Package outline. . . . . . . . . . . . . . . . . . . . . . . 123 29 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . 126 30 Glossary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 31 References. . . . . . . . . . . . . . . . . . . . . . . . . . . 126 32 Revision history . . . . . . . . . . . . . . . . . . . . . . 127 33 Legal information . . . . . . . . . . . . . . . . . . . . . 128 33.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 128 33.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . 128 33.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . 128 33.4 Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 33.5 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . 129 NXP Semiconductors PN512 Full NFC Forum compliant solution © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 December 2013 111345 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 34 Contact information. . . . . . . . . . . . . . . . . . . . 129 35 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 36 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 37 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 1. General description The UHF EPCglobal Generation 2 standard allows the commercialized provision of mass adoption of UHF RFID technology for passive smart tags and labels. Main fields of applications are supply chain management and logistics for worldwide use with special consideration of European, US and Chinese frequencies to ensure that operating distances of several meters can be realized. The NXP Semiconductors UCODE product family is compliant to this EPC gen2 standard offering anti-collision and collision arbitration functionality. This allows a reader to simultaneously operate multiple labels/tags within its antenna field. The UCODE based label/ tag requires no external power supply for contactless operation. Its contactless interface generates the power supply via the antenna circuit by propagative energy transmission from the interrogator (reader), while the system clock is generated by an on-chip oscillator. Data transmitted from the interrogator to the label/tag is demodulated by the interface, and it also modulates the interrogator's electromagnetic field for data transmission from the label/tag to the interrogator. A label/tag can be then operated without the need for line of sight or battery, as long as it is connected to a dedicated antenna for the targeted frequency range. When the label/tag is within the interrogator's operating range, the high-speed wireless interface allows data transmission in both directions. With the UCODE I2C product, NXP Semiconductors introduces now the possibility to combine 2 independent UHF Interfaces (following EPC gen 2 standard) with an I2C interface. Its large memory can be then read or write via both interfaces. This I2C functionality enables the standard EPC gen 2 functionalities to be linked to an electronic device microprocessor. By linking the rich functionalities of the EPC gen 2 standards to the Electronics world, the UCODE I2C product opens a whole new range of application. The I2C interface needs to be supplied externally and supports standard and fast I2C modes. Its large memory is based on a field proven non-volatile memory technology commonly used in high quality automotive applications SL3S4011_4021 UCODE I²C Rev. 3.1 — 3 July 2013 204931 Product data sheet COMPANY PUBLIC SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 2 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 2. Features and benefits 2.1 UHF interface  Dual UHF antenna port  18 dBm READ sensitivity  11 dBm WRITE sensitivity  23 dBm READ & WRITE sensitivity with the chip powered  Compliant to EPCglobal Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for communications at 860 MHz to 960 MHz version 1.2.0  Wide RF interface temperature range: 40 °C up to +85 °C  Memory read protection  Interrupt output  RF - I2C bridge function based on SRAM memory 2.2 I2C interface  Supports Standard (100 kHz) and Fast (400 kHz) mode (see Ref. 1)  UCODE I2C can be used as standard I2C EEPROMs 2.3 Command set  All mandatory EPC Gen2 v1.2.0 commands  Optional commands: Access, Block Write (32 bit)  Custom command: ChangeConfig 2.4 Memory  3328-bit user memory  160-bit EPC memory  96-bit tag identifier (TID) including 48-bit unique serial number  32-bit KILL password to permanently disable the tag  32-bit ACCESS password to allow a transition into the secured transmission state  Data retention: 20 years at 55 °C  Write endurance: 50 kcycles at 85 °C 2.5 Package  SOT-902-3; MO-255B footprint  Outline 1.6 × 1.6 mm  Thickness  0.5 mm SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 3 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 3. Applications  Firmware downloads  Return management  Counterfeit protection and authentication  Production information  Theft protection and deterrence  Production automation  Device customization/product configuration  Offline Diagnostics 4. Ordering information [1] RFP1, RFN1 Table 1. Ordering information Type number Package Name Description Version SL3S4011FHK XQFN8 Single differential RF Front End [1]- Plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 × 1.6 × 0.5 mm SOT902-3 SL3S4021FHK XQFN8 Dual differential RF Front End - Plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 × 1.6 × 0.5 mm SOT902-3 SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 4 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 5. Block diagram Fig 1. Block diagram RFP1 DIFFERENTIAL UHF FRONTEND 1 RFN1 RFN2 DIFFERENTIAL UHF FRONTEND 2 NON VOLATILE MEMORY I2C INTERFACE ISO18000-6 DIGITAL INTERFACE ANALOG UHF antenna 2 UHF antenna 1 I2C DRIVER/SCL INT SIGNALLING DRIVER 50 ns SPIKE INPUT FILTER RFP2 SCL SDA I2C DRIVER/SDA CE OUPUT DRIVER 50 ns SPIKE INPUT FILTER VDDB VDDB POWER MANAGEMENT/ GND 001aao224 SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 5 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 6. Pinning information 6.1 Pinning 6.2 Pin description (1) Dimension A: 1.6 mm (2) Dimension B: 0.5 mm Fig 2. Pin configuration 001aao225 VDD Transparent top view side view 4 8 6 5 7 3 1 RF1N 2 RF1P SCL A B GND A RF2N SDA RF2P Table 2. Pin description Pin Symbol Description 1 RF1P active antenna 1 connector 2 RF1N antenna 1 3 SCL I2C clock / _INT 4 VDD supply 5 SDA I2C data 6 RF2N antenna 2 7 RF2P active antenna 2 connector 8 GND ground SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 6 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 7. Mechanical specification 7.1 SOT902 specification 8. Functional description 8.1 Air interface standards The UCODE I2C fully supports all mandatory parts of the "Specification for RFID Air Interface EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0". 8.2 Power transfer The interrogator provides an RF field that powers the tag, equipped with a UCODE I2C. The antenna transforms the impedance of free space to the chip input impedance in order to get the maximum possible power for the UCODE I2C on the tag. The RF field, which is oscillating on the operating frequency provided by the interrogator, is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC. For I2C operation the UCODE I2C has to be supplied externally via the VDD pin. 8.3 Data transfer air interface 8.3.1 Interrogator to tag Link An interrogator transmits information to the UCODE I2C by modulating a UHF RF signal. The UCODE I2C receives both information and operating energy from this RF signal. Tags are passive, meaning that they receive all of their operating energy from the interrogator's RF waveform. An interrogator is using a fixed modulation and data rate for the duration of at least one inventory round. The interrogator communicates to the UCODE I2C by modulating an RF carrier using DSB-ASK with PIE encoding. 8.3.2 Tag to reader Link An interrogator receives information from a UCODE I2C by transmitting an unmodulated RF carrier and listening for a backscattered reply. The UCODE I2C backscatters by switching the reflection coefficient of its antenna between two states in accordance with the data being sent. Table 3. Mechanical properties XQFN8 Package name Outline code Package size Reel format SOT902 SOT902-3 size:1.6 mm × 1.6 mm 4000 pcs thickness: 0.5 mm 7” diameter Carrier tape width 8 mm Carrier pocket pitch 4 mm SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 7 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C The UCODE I2C communicates information by backscatter-modulating the amplitude and/or phase of the RF carrier. Interrogators shall be capable of demodulating either demodulation type. The encoding format, selected in response to interrogator commands, is either FM0 baseband or Miller-modulated subaltern. 8.4 Data transfer to I2C interface The UCODE I2C memory can be read/written similar to a standard I2C serial EEPROM device. The address space is arranged in a linear manner. When performing a sequential read the address pointer is increased linearly from start of the EPC memory to the end of the user memory. At the end address of each bank the address pointer jumps automatically to the first address in the subsequent bank. In I2C write modes only even address values are accepted, due to the word wise organization of the EEPROM. Regarding arbitration between RF and I2C, see Section 11 “RF interface/I2C interface arbitration”). Write operation: • Write word • Write block (2 words) Read operation: • current address read • random address read • sequential current read • random sequential read 8.5 Supported commands The UCODE I2C supports all mandatory EPCglobal V1.2.0 commands. In addition the UCODE I2C supports the following optional commands. • Access • BlockWrite (32 bit) The UCODE I2C features the following custom commands described in more detail later: • ChangeConfig 8.6 UCODE I2C memory The UCODE I2C memory is implemented according to EPCglobal Gen2 and organized in four sections all accessible via both RF and I2C operation except the reserved memory section which only accessible via RF: SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 8 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C The logical addresses of all memory banks begin at zero (00h). In addition to the 4 memory banks one configuration word to handle the UCODE I2C specific features is available at EPC bank 01b address 200h. The configuration word is described in detail in section “UCODE I2C special features”. Table 4. UCODE I2C memory sections Name Size Bank Reserved memory (32-bit ACCESS and 32-bit KILL password) 64 bit 00b EPC (excluding 16 bit CRC-16 and 16-bit PC) 160 bit 01b Download register 16 bit 01b UCODE I2C Configuration Word 16 bit 01b TID (including unique 48 bit serial number) 96 bit 10b User Memory 3328 bit 11b xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 9 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 8.6.1 UCODE I2C overall memory map [1] SL3S4011 EPC: E200 680D 0000 0000 0000 0000 0000 0000 0000 0000 SL3S4021 EPC: E200 688D 0000 0000 0000 0000 0000 0000 0000 0000 [2] see TID paragraph Table 5. Memory map Bank address Memory address Type Content Initial value Remark RF I2C Bank 00 00h to 1Fh not accessible via i2C reserved kill password all 00h unlocked memory 20h to 3Fh not accessible via i2C reserved access password all 00h unlocked memory Bank 01 EPC 00h to 0Fh 2000h EPC CRC-16: refer to Ref. 5 memory mapped calculated CRC 10h to 1Fh 2002h EPC PC 3000h unlocked memory 20h to 2Fh 2004h EPC EPC bit [0 to 15] [1] unlocked memory ... EPC ... unlocked memory 20h to BFh 2016h EPC EPC bit [144 to 159] unlocked memory 1F0h to 1FFh 203Eh EPC download register for the bridge function 200h to 20Fh 2040h EPC Configuration word, see Section 9.2 Bank 10 TID 00h to 0Fh 4000h TID TID header n.a. locked memory 10h to 1Fh 4002h TID TID header n.a. locked memory 20h to 2Fh 4004h TID XTID_header 0000h locked memory 30h to 3Fh 4006h TID TID serial number [2] locked memory 40h to 4Fh 4008h TID TID serial number n.a. locked memory 50h to 5Fh 400Ah TID TID serial number n.a. locked memory Bank 11 User memory 000h to 00Fh 6000h UM user memory bit [0 to 15] all 00h unlocked memory 010h to 01Fh 6002h UM user memory bit [16 to 31] all 00h unlocked memory ... UM all 00h unlocked memory CF0h to CFFh 619Eh UM user memory bit [3311 to 3327] all 00h unlocked memory xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 10 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 8.6.2 UCODE I2C TID memory details Table 6. UCODE I2C TID description Model number Type First 32 bit of TID memory Class ID Mask designer ID Config Word indicator Sub version number Version (Silicon) number UCODE SL3S4011 E200680D E2h 006h 1 0000b 0001101 UCODE SL3S4021 E200688D E2h 006h 1 0001b 0001101 Fig 3. UCODE I2C TID memory structure aaa-006851 Class Identifier MS Byte MS Bit LS Bit TID Mask-Designer Identifier Model Number XTID Header Serial Number Bits 7 0 11 0 11 0 15 0 47 0 Addresses 00h 07h 13h 1Fh 5Fh Addresses 00h CFh 08h 14h 20h 2Fh 30h E2h (EAN.UCC) TID Example (UCODE I2C) 006h (NXP) 0000h Sub Version Number Version Number 000b or 001b 0001101b (UCODE I2C) Bits 0 3 0 6 0 Addresses 14h 18h 19h 1Fh 80Dh or 88Dh (UCODE I2C) LS Byte SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 11 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 9. Supported features The UCODE I2C is equipped with a number of additional features and a custom command. Nevertheless, the chip is designed in a way that standard EPCglobal READ / WRITE / ACCESS commands can be used to operate the features. The memory map in the previous section describes the Configuration Word used to control the additional features located after address 200h of the EPC memory, hence UCODE I2C features are controlled by bits located in the EPC number space. For this reason the standard READ / WRITE commands of a UHF EPCglobal compliant reader can be used to select the flags or activate/deactivate features if the memory bank is not locked. In case of locked memory banks the ChangeConfig custom command has to be used. The bits (flags) of the ConfigurationWord are selectable using the standard EPC SELECT command. 9.1 UCODE I2C special feature • Externally Supplied flag The flag will indicate the availability of an external supply. • RF active flag The flag will indicate on which RF port power is available and signal transmission ongoing. • RF Interface on/off switching For privacy reasons the two RF ports as well as the I2C interface can be switched on/off by toggling the related bits of the ConfigurationWord. The ConfigurationWord is accessible via RF and I2C interface. Although it is possible to kill the RF interface via the KILL feature of EPC gen2, a minimum of one port shall be active at all times. In the case of the dual port version, either one or both RF can be active. In the case of the single front end version, the RF port can not be deactivated. • I2C Interface on/off switching For privacy reasons the I2C port can be disabled by toggling the related bit of the Config-Word but only via RF. • RF - I2C Bridge feature The UCODE I2C can be used as an RF- I2C bridge to directly forward data from the RF interface to the I2C interface and vice versa. The UCODE I2C is equipped with a download/upload register of 16-bit data buffer located in the EPC bank. The data received via RF can be read via I2C like regular memory content. In case the buffer is empty reading the register returns NAK. This feature can be combined with the Download Indicator. – Upload Indicator flag (I2C to UHF) - address 203h in the configuration word The flag will indicate if data in the download/upload register is available. Will be automatically cleared when the download/upload register is read out via UHF. – Download Indicator flag (UHF to I2C) - address 200h in the configuration word The flag will indicate if data in the download/upload register is available. Will be automatically cleared when the download/upload register is read out via I2C. SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 12 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C • Interrupt signaling/Download Indicator The UCODE I2C features two methods of signaling: 1. Signaling via ConfigWord "Download/Upload Indicator" (200h or 203h): – The Download/Upload Indicator will go high as soon new data from the RF reader or from the I2C interface is written to the buffer register. This flag can be polled via I2C READ or using the SELECT command. Reading an empty buffer register will return NAK. – The Download/Upload Indicator will automatically return to low as soon as the data is read. 2. Interrupt Signaling via the I2C-SCL line: – If the SCL INT enabler of the ConfigWord is set (20Bh) the SCL line will be pulled low for at least 210 s in case new data was written by the reader or at least 85 s in case new data has been read by the reader (see Figure 4 “SCL interrupt signalling” and Table 7 “Interrupt signaling via the I2C-SCL line timing”). [1] This timing parameter is dependent on the chosen return link frequency. [2] At 640 kHz return link frequency. Remark: The features can even be operated (enabled/disabled) with '0' as ACCESS password. It is recommended to set an ACCESS password to avoid unauthorized manipulation of the features via the RF interface. 9.2 UCODE I2C special features control mechanism Special features of the UCODE I2C are managed using a Configuration Word (ConfigWord) located at the end of the EPC memory bank (address 200h via RF or 2040h via I2C) - see Table 8 and Table 9. Fig 4. SCL interrupt signalling Table 7. Interrupt signaling via the I2C-SCL line timing Symbol Min Typ Max Unit tSCL low_write 210 266 320 s tSCL low_read[1] 85 102[2] 7800 s aaa-005682 UHF Write DL Reg Command SCL UHF SCL Read DL Reg Command Read DL Reg Response Write DL Reg Response tSCL low_read tSCL low_write SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 13 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C The bits of the ConfigWord are selectable (using the standard EPC SELECT command) and can be read, via RF, using standard EPC READ command and via I2C. They can be modified using the ChangeConfig custom command or standard READ/WRITE commands or via the I2C interface (if allowed). [1] Indicator bits are reset at power-up but cannot be changed by command [2] Permanent bits are permanently stored bits in the memory [3] Defaults values for bit3/bit2/bit1 are 0/0/1 (see Table 14) Table 8. Configuration Word accessible located at address 200h via UHF of the EPC bank and I2C address 2040h (1 RF front end version SL3S4011) Feature Bit type via RF via I2C Address Access Address Access Download indicator indicator[1] 200h read 2040h read Externally supplied flag indicator 201h read read RF active flag indicator 202h read read Upload indicator Indicator 203h read read I2C address bit 3[3] permanent[2] 204h r/w read only I2C address bit 2[3] permanent 205h r/w read only I2C address bit 1[3] permanent 206h r/w read only I2C port on/off permanent 207h r/w read only UHF antenna port1 on locked 208h read only read only rfu 209h rfu 20Ah SCL INT enable permanent 20Bh r/w read only bit for read protect user memory permanent 20Ch r/w r/w bit for read protect EPC permanent 20Dh r/w r/w bit for read protect TID SNR (48 bits) permanent 20Eh r/w r/w PSF alarm flag permanent 20Fh r/w read only Table 9. Configuration Word accessible located at address 200h via UHF of the EPC bank and I2C address 2040h (2 RF front end version SL3S4021) Feature Bit type via RF via I2C Address Access Address Access Download indicator indicator[1] 200h read 2040h read Externally supplied flag indicator 201h read read RF active flag indicator 202h read read Upload indicator indicator 203h read read I2C address bit 3[3] permanent[2] 204h r/w read only I2C address bit 2[3] permanent 205h r/w read only I2C address bit 1[3] permanent 206h r/w read only I2C port on/off permanent 207h r/w read only UHF antenna port1 on/off permanent 208h r/w r/w UHF antenna port2 on/off permanent 209h r/w r/w rfu 20Ah SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 14 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C [1] Indicator bits are reset at power-up but cannot be changed by command [2] Permanent bits are permanently stored bits in the memory [3] Defaults values for bit3/bit2/bit1 are 0/0/1 (see Table 14) SCL INT enable permanent 20Bh r/w read only bit for read protect user memory permanent 20Ch r/w r/w bit for read protect EPC permanent 20Dh r/w r/w bit for read protect TID SNR (48 bits) permanent 20Eh r/w r/w PSF alarm flag permanent 20Fh r/w read only Table 9. Configuration Word accessible located at address 200h via UHF of the EPC bank and I2C address 2040h (2 RF front end version SL3S4021) Feature Bit type via RF via I2C Address Access Address Access SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 15 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 9.3 Change Config Command The UCODE I2C ChangeConfig custom command allows handling the special features described in the previous paragraph. As long the EPC bank is not write locked standard EPC READ/WRITE commands can be used to modify the flags. The bits to be toggled in the configuration register need to be set to '1'. E.g. sending 0000 0000 0000 0000 1001 XOR RN16 will activate the EPC Read Protect and PSF bit. Sending the very same command a second time will disable the features. The reply of the ChangeConfig will return the current register setting. The features can only be activated/deactivated in the open or secured state and with a non-zero ACCESS password. If the EPC memory bank is locked for writing, the ChangeConfig command is needed to modify the ConfigurationWord. Table 10. ChangeConfig custom command Command RFU Data RN CRC-16 No. of bits 16 8 16 16 16 Description 11100000 00000111 00000000 Toggle bits XOR RN16 handle - Table 11. ChangeConfig custom response table Starting state Condition Response Next state ready all - ready arbitrate, reply, acknowledged all - arbitrate open valid handle, Status word needs to change Backscatter unchanged StatusWord immediately open valid handle, Status word does not need to change Backscatter StatusWord immediately open secured valid handle, Status word needs to change Backscatter modified StatusWord, when done secured valid handle, Status word does not need to change Backscatter StatusWord immediately secured invalid handle - secured killed all - killed xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 16 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 9.4 UCODE I2C memory bank locking mechanism 9.4.1 Possibilities 9.4.2 Via RF The UCODE I2C memory banks can be locked following EPC Gen2 mandatory command via RF (see table Table 13). Table 12. Memory banks locking possibilities for UCODE I2C via RF and I2C I2C interface RF interface Memory bank Lock (entire bank) PermaLock (entire bank) Lock (entire bank) via Access Password PermaLock (entire bank) via Access Password 01 EPC yes yes yes yes 11 User Memory yes yes yes yes Table 13. Lock payload and usage Kill pwd Access pwd EPC memory TID memory User memory 19 18 17 16 15 14 13 12 11 10 Mask skip/write skip/write skip/write skip/write skip/write skip/write skip/write skip/write skip/write skip/write 9 8 7 6 5 4 3 2 1 0 Action pwd read/write permalock pwd read/write permalock pwd write permalock pwd write permalock pwd write permalock SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 17 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 9.4.3 Via I2C The EPC Gen2 locking bits for the memory banks are also accessible via the I2C interface for read and write operation and are located at the I2C address 803Ch. But it is not possible to read and write the access and kill password. Fig 5. I2C memory bank lock write and read access Data Byte 1 Mask field Action field Kill PWD Skip/ write Skip/ write Skip/ write Skip/ write Skip/ write Skip/ write Skip/ write Skip/ write Skip/ write Skip/ write X X X X X X X X X X X X Access PWD User memory RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU EPC memory TID memory Kill PWD n/a n/a n/a n/a permalock permalock permalock PWD write PWD write PWD write Access PWD EPC memory TID memory User memory MSB Data Byte 2 LSB MSB Data Byte 3 Data Byte 4 LSB aaa-003734 SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 18 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 10. I2C commands 10.1 UCODE I2C operation For details on I2C interface refer to Ref. 1. The UCODE I2C supports the I2C protocol. This is summarized in Figure 7. Any device that sends data on to the bus is defined to be a transmitter, and any device that reads the data to be a receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device. A data transfer can only be initiated by the bus master, which will also provide the serial clock for synchronization. The device is always a slave in all communications. 10.2 Start condition Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in the high state. A Start condition must precede any data transfer command. The UCODE I2C continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock (SCL) for a Start condition, and will not respond unless one is given. Fig 6. I2C bus protocol SCL SDA SCL 1 2 3 7 8 9 1 2 3 7 8 9 MSB ACK MSB ACK Start Condition SDA Input SDA Change Stop Condition Stop Condition Start Condition SDA SCL SDA 001aao231 SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 19 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 10.3 Stop condition Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable and driven high. A Stop condition terminates communication between the UCODE I2C and the bus master. A Read command that is followed by NoAck can be followed by a Stop condition to force the UCODE I2C into the Standby mode. A Stop condition at the end of a Write command triggers the internal Write cycle. 10.4 Acknowledge bit (ACK) The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter, whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) low to acknowledge the receipt of the eight data bits. 10.5 Data input During data input, the UCODE I2C samples Serial Data (SDA) on the rising edge of Serial Clock (SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock (SCL) is driven low. 10.6 Addressing To start communication between a bus master and the UCODE I2C slave device, the bus master must initiate a Start condition. Following this, the bus master sends the device select code. The 7-bit device select code consists of a 4-bit device identifier (value Ah) which is initialized in wafer test and cannot be changed in the user mode. Three additional bits in the configuration word are reserved to alter the device address via RF interface after initialization. This allows up to eight UCODE I2C devices to be connected to a bus master at the same time. The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations. If a match occurs on the device select code, the UCODE I2C gives an acknowledgment on Serial Data (SDA) during the 9th bit time. If the UCODE I2C does not match the device select code, it deselects itself from the bus. [1] Initial values - can be changed - See also Table 8 and Table 9. Table 14. Device select code Device type identifier Device address in configuration word 204h to 206h R/W Device select code b7 b6 b5 b4 b3 b2 b1 b0 Value 1 0 1 0 0 [1] 0 [1] 1 [1] 1/0 SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 20 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 10.7 Write Operation The byte address must be an even value due to the word wise organization of the EEPROM. Following a Start condition the bus master sends a device select code with the Read/Write bit (RW) reset to 0. The UCODE I2C acknowledges this, as shown in Figure 7 and waits for two address bytes. The UCODE I2C responds to each address byte with an acknowledge bit, and then waits for the data Byte. Each data byte in the memory has a 16-bit (two byte wide) address. The Most Significant Byte (Table 15) is sent first, followed by the Least Significant Byte (Table 15). Bits b15 to b0 form the address of the byte in memory. When the bus master generates a Stop condition immediately after the ACK bit (in the "10th bit" time slot), either at the end of a Word Write or a Page Write, the internal Write cycle is triggered. A Stop condition at any other time slot does not trigger the internal Write cycle. During the internal Write cycle, Serial Data (SDA) is disabled internally, and the UCODE I2C does not respond to any requests. Table 15. I2C addressing Most significant byte b15 b14 b13 b12 b11 b10 b9 b8 EPC address EPC/Lock EPC memory bank EPC memory word address Least significant byte b7 b6 b5 b4 b3 b2 b1 b0 EPC address EPC memory word address MSB/ LSB Fig 7. I2C write operation ACK Word Write Page Write Page Write (cont’d) ACK ACK ACK ACK Stop Start R/W Dev select Byte address Byte address Data in 1 Data in 2 ACK Stop 001aao230 ACK ACK ACK ACK Start R/W Dev select Byte address Byte address Data in 1 Data in 2 ACK Data in N SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 21 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 10.7.1 Word Write After the device select code and the address word, the bus master sends one word data. If the addressed location is Write-protected, the UCODE I2C replies with NACK, and the location is not modified. If, instead, the addressed location is not Write-protected, the UCODE I2C replies with ACK. The bus master terminates the transfer by generating a Stop condition, as shown in Figure 7. 10.7.2 Page Write The Page Write mode allows 2 words to be written in a single Write cycle, provided that they are all located in the same 'row' in the memory: that is, the most significant memory address bits (b12-b2) are the same and b1= 0 and b0 = 0. If more than two words are sent than each additional byte will cause a NACK on SDA. The bus master sends from 1 to 2 words of data, each of which is acknowledged by the UCODE I2C. The transfer is terminated by the bus master generating a Stop condition. 10.8 Read operation After the successful completion of a read operation, the UCODE I2C's internal address counter is incremented by one, to point to the next byte address. Fig 8. I2C read operation ACK ACK NO ACK Current Address Read Random Address Read Sequential Current Read Sequential Random Read ACK ACK ACK NO ACK Stop Start Start Start Stop R/W R/W R/W R/W Dev select * Byte address Dev select * Data out Dev select Data out Byte address ACK ACK ACK NO ACK NO ACK Stop Stop Start Dev select Data out 1 Data out N 001aao229 ACK ACK ACK ACK ACK Start Start R/W R/W Dev select * Byte address Byte address Dev select * Data out 1 ACK Data out N SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 22 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 10.8.1 Random Address Read A dummy Write is first performed to load the address into this address counter (as shown in Figure 8) but without sending a Stop condition. Then, the bus master sends another Start condition, and repeats the device select code, with the Read/Write bit (RW) set to 1. The UCODE I2C acknowledges this, and outputs the contents of the addressed byte. The bus master must not acknowledge the byte, and terminates the transfer with a Stop condition. 10.8.2 Current Address Read For the Current Address Read operation, following a Start condition, the bus master only sends a UCODE I2C select code with the Read/Write bit (RW) set to 1. The UCODE I2C acknowledges this, and outputs the byte addressed by the internal address counter. The counter is then incremented. The bus master terminates the transfer with a Stop condition, as shown in Figure 8, without acknowledging the Byte. 10.8.3 Sequential Read This operation can be used after a Current Address Read or a Random Address Read. The bus master does acknowledge the data byte output, and sends additional clock pulses so that the UCODE I2C continues to output the next byte in sequence. To terminate the stream of bytes, the bus master must not acknowledge the last byte, and must generate a Stop condition, as shown in Figure 8. The output data comes from consecutive addresses, with the internal address counter automatically incremented after each byte output. 10.8.4 Acknowledge in Read mode For all Read commands, the UCODE I2C waits, after each byte read, for an acknowledgment during the 9th bit time. If the bus master does not drive Serial Data (SDA) low during this time, the UCODE I2C terminates the data transfer and switches to its Standby mode. 10.8.5 EPC memory bank handling After the last memory address within one EPC memory bank, the address counter 'rolls-over' to the next EPC memory bank, and the UCODE I2C continues to output data from memory address 00h in the successive EPC memory bank. Example: EPC Bank 01  EPC Bank 10  EPC Bank 11  EPC Bank 01 SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 23 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 11. RF interface/I2C interface arbitration The UCODE I2C needs to arbitrate the EEPROM access between the RF and the I2C interface. The arbitration is implemented as following: • First come, first serve strategy - the interface which provides data by having a first valid preamble on RF envelope (begin of a command) or a start condition and a valid I2C device address on the I2C interface will be favored. • I2C access to the chip memory is possible regardless if it is in the EPC Gen2 secured state or not • During an I2C command, starting with an I2C start followed by valid I2C device address and ending with an I2C stop condition, any RF command is ignored. • During any EPC Gen2 command any I2C command is ignored 12. Limiting values [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. [3] For ESD measurement, the die chip has been mounted into a CDIP8 package. [4] For ESD measurement, the die chip has been mounted into a CDIP8 package. Table 16. Limiting values[1][2] [3][4] In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND. Symbol Parameter Conditions Min Max Unit Die Vmax maximum voltage on pin VDD, SDA, SCL, GND 0.3 3.6 V Tstg storage temperature 55 +125 C Tamb ambient temperature 40 +85 C VESD electrostatic discharge voltage Human body model; SNW-FQ-302A - 2 kV Charged device model - 500 V SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 24 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 13. Characteristics [1] Some legacy Standard-mode devices had fixed input levels of VIL = 1.5 V and VIH = 3.0 V. Refer to component data sheets. [2] Maximum VIH = VDD(max) + 0.5 V or 5.5 V, which ever is lower. See component data sheets. [3] The same resistor value to drive 3 mA at 3.0 V VDD provides the same RC time constant when using <2 V VDD with a smaller current draw. [4] Only applies to Fast Mode and Fast Mode Plus. Table 17. Characteristics Symbol Parameter Conditions Min Typ Max Unit EEPROM characteristics tret retention time Tamb  55 C 20 - - year Nendu(W) write endurance Tamb  85 C 50000 - - cycle Interface characteristics Ptot total power dissipation - - 30 mW foper operating frequency 840 - 960 MHz Pmin minimum operating power supply Read mode - 18 - dBm Write mode - 11 - dBm Read and Write mode with VDD input - 23 - dBm VDD supply voltage I2C, on VDD input 1.8 - 3.6 V VDD supply voltage rise time requirements 100 - - s IDD supply current from VDD in I2C read mode - 10 - A from VDD in I2C write mode - 40 - A Z impedance (package) 915 MHz - 12,7-j 199 -  - modulated jammer suppression  1.0 MHz - 4 - dB - unmodulated jammer suppression  1.0 MHz - 4 - dB VIL LOW-level input voltage[1] -0.5 - 0.3 VDD V VIH HIGH-level input voltage[1] 0.7 VDD - -[2] V Vhys hysteresis of Schmitt trigger inputs[4] 0.05 VDD - - V VOL1 LOW-level output voltage 1 (open-drain or open-collector) at 3 mA sink current[3]; VDD > 2 V 0 - 0.4 V VOL2 LOW-level output voltage 2[4] (open-drain or open-collector) at 2 mA sink current[3]; VDD  2 V 0 - 0.2VDD V SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 25 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 14. Package outline Fig 9. Package outline SOT902-3 Outline References version European projection Issue date IEC JEDEC JEITA SOT902-3 - - - MO-255 - - - sot902-3_po 11-08-16 11-08-18 Unit mm max nom min 0.5 0.05 0.00 1.65 1.60 1.55 1.65 1.60 1.55 0.6 0.5 0.1 0.05 A Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT902-3 A1 b 0.25 0.20 0.15 D E e e1 L 0.45 0.40 0.35 v w 0.05 y y1 0.05 0 1 2 mm scale terminal 1 index area D B A E X C y1 C y terminal 1 index area 3 L e1 e v C A B w C 2 1 5 6 7 metal area not for soldering 8 4 e1 e b A1 A detail X SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 26 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 15. Abbreviations 16. References [1] I2C-bus specification and user manual (NXP standard UM10204.pdf / Rev. 03 - 19 June 2007) [2] EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz - 960 MHz Version 1.2.0 [3] EPC Conformance Standard Version 1.0.5 [4] ESD Method SNW -FQ-302A [5] ISO/IEC 18000-1: Information technology - Radio frequency identification for item management - Part 1: Reference architecture and definition of parameters to be standardized Table 18. Abbreviations Acronym Description CRC Cyclic Redundancy Check CW Continuous Wave EEPROM Electrically Erasable Programmable Read Only Memory EPC Electronic Product Code (containing Header, Domain Manager, Object Class and Serial Number) FM0 Bhi phase space modulation HBM Human Body Model IC Integrated Circuit LSB Least Significant Byte/Bit MSB Most Significant Byte/Bit NRZ Non-Return to Zero coding RF Radio Frequency RTF Reader Talks First Tari Type A Reference Interval (ISO 18000-6) UHF Ultra High Frequency Xxb Value in binary notation XXhex Value in hexadecimal notation SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 27 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 17. Revision history Table 19. Revision history Document ID Release date Data sheet status Change notice Supersedes SL3S4011_4021 v. 3.1 20130703 Product data sheet - SL3S4011_4021 v. 3.0 Modifications: • General update SL3S4011_4021 v. 3.0 20130416 Product data sheet - SL3S4011_4021 v. 2.3 Modifications: • Data sheet status changed to Product data sheet SL3S4011_4021 v. 2.3 20130305 Preliminary data sheet - SL3S4011_4021 v. 2.2 Modifications: • General update • Security status changed into COMPANY PUBLIC SL3S4011_4021 v. 2.2 20121127 Preliminary data sheet SL3S4011_4021 v. 2.1 Modifications: • General update SL3S4011_4021 v. 2.1 20120726 Preliminary data sheet - SL3S4001FHK v. 2.0 Modifications: • General update SL3S4011_4021 v. 2.0 20120627 Preliminary data sheet - SL3S4001FHK v. 1.2 Modifications: • General update SL3S4001FHK v. 1.2 20111004 Objective data sheet - SL3S4001FHK v. 1.1 Modifications: • Table 1 “Ordering information”: updated • Figure 3 “UCODE I2C wafer layout”: values updated SL3S4001FHK v. 1.1 20110707 Objective data sheet - SL3S4001FHK v. 1.0 Modifications: • Table 3 “Mechanical properties XQFN8”: updated • Section 10.6 “Addressing”: updated SL3S4001FHK v. 1.0 20110609 Objective data sheet - - SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 28 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 18. Legal information 18.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 29 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. UCODE — is a trademark of NXP B.V. I2C-bus — logo is a trademark of NXP B.V. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 3 July 2013 204931 30 of 31 NXP Semiconductors SL3S4011_4021 UCODE I²C 20. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .3 Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5 Table 3. Mechanical properties XQFN8 . . . . . . . . . . . . . .6 Table 4. UCODE I2C memory sections . . . . . . . . . . . . . .8 Table 5. Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Table 6. UCODE I2C TID description . . . . . . . . . . . . . . .10 Table 7. Interrupt signaling via the I2C-SCL line timing .12 Table 8. Configuration Word accessible located at address 200h via UHF of the EPC bank and I2C address 2040h (1 RF front end version SL3S4011) . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 9. Configuration Word accessible located at address 200h via UHF of the EPC bank and I2C address 2040h (2 RF front end version SL3S4021) . . . . . . . . . . . . . . . . . . . . . 13 Table 10. ChangeConfig custom command. . . . . . . . . . . 15 Table 11. ChangeConfig custom response table. . . . . . . 15 Table 12. Memory banks locking possibilities for UCODE I2C via RF and I2C . . . . . . . . . . . . . . . 16 Table 13. Lock payload and usage . . . . . . . . . . . . . . . . . 16 Table 14. Device select code. . . . . . . . . . . . . . . . . . . . . . 19 Table 15. I2C addressing . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 16. Limiting values[1][2] [3][4] . . . . . . . . . . . . . . . . . . 23 Table 17. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 18. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 19. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 21. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Fig 2. Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .5 Fig 3. UCODE I2C TID memory structure . . . . . . . . . . .10 Fig 4. SCL interrupt signalling . . . . . . . . . . . . . . . . . . . .12 Fig 5. I2C memory bank lock write and read access . . .17 Fig 6. I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . .18 Fig 7. I2C write operation . . . . . . . . . . . . . . . . . . . . . . . .20 Fig 8. I2C read operation . . . . . . . . . . . . . . . . . . . . . . . .21 Fig 9. Package outline SOT902-3 . . . . . . . . . . . . . . . . .25 NXP Semiconductors SL3S4011_4021 UCODE I²C © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 July 2013 204931 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 2.1 UHF interface . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 I2C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 Command set . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.5 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Mechanical specification . . . . . . . . . . . . . . . . . 6 7.1 SOT902 specification . . . . . . . . . . . . . . . . . . . . 6 8 Functional description . . . . . . . . . . . . . . . . . . . 6 8.1 Air interface standards . . . . . . . . . . . . . . . . . . . 6 8.2 Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.3 Data transfer air interface . . . . . . . . . . . . . . . . . 6 8.3.1 Interrogator to tag Link . . . . . . . . . . . . . . . . . . . 6 8.3.2 Tag to reader Link. . . . . . . . . . . . . . . . . . . . . . . 6 8.4 Data transfer to I2C interface . . . . . . . . . . . . . . 7 8.5 Supported commands . . . . . . . . . . . . . . . . . . . 7 8.6 UCODE I2C memory. . . . . . . . . . . . . . . . . . . . . 7 8.6.1 UCODE I2C overall memory map. . . . . . . . . . . 9 8.6.2 UCODE I2C TID memory details . . . . . . . . . . 10 9 Supported features . . . . . . . . . . . . . . . . . . . . . 11 9.1 UCODE I2C special feature . . . . . . . . . . . . . . 11 9.2 UCODE I2C special features control mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 9.3 Change Config Command . . . . . . . . . . . . . . . 15 9.4 UCODE I2C memory bank locking mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.1 Possibilities . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.2 Via RF. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 9.4.3 Via I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10 I2C commands . . . . . . . . . . . . . . . . . . . . . . . . . 18 10.1 UCODE I2C operation. . . . . . . . . . . . . . . . . . . 18 10.2 Start condition. . . . . . . . . . . . . . . . . . . . . . . . . 18 10.3 Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . 19 10.4 Acknowledge bit (ACK). . . . . . . . . . . . . . . . . . 19 10.5 Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 10.6 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 10.7 Write Operation. . . . . . . . . . . . . . . . . . . . . . . . 20 10.7.1 Word Write . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10.7.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10.8 Read operation . . . . . . . . . . . . . . . . . . . . . . . 21 10.8.1 Random Address Read . . . . . . . . . . . . . . . . . 22 10.8.2 Current Address Read . . . . . . . . . . . . . . . . . . 22 10.8.3 Sequential Read . . . . . . . . . . . . . . . . . . . . . . 22 10.8.4 Acknowledge in Read mode . . . . . . . . . . . . . 22 10.8.5 EPC memory bank handling . . . . . . . . . . . . . 22 11 RF interface/I2C interface arbitration. . . . . . . 23 12 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 23 13 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24 14 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 25 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 26 16 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 27 18 Legal information . . . . . . . . . . . . . . . . . . . . . . 28 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28 18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 28 18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 29 19 Contact information . . . . . . . . . . . . . . . . . . . . 29 20 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 21 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 1. General description NXP’s UCODE G2iL series transponder ICs offer leading-edge read range and support industry-first features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, and advanced privacy-protection modes. Very high chip sensitivity (18 dBm) enables longer read ranges with simple, single-port antenna designs. When connected to a power supply, the READ as well as the WRITE range can be boosted to a sensitivity of 27 dBm. In fashion and retail the UCODE G2iL series improve read rates and provide for theft deterrence. For consumer electronics the UCODE G2iL series is suited for device configuration, activation, production control, and PCB tagging. In authentication applications the transponders can be used to protect brands and guard against counterfeiting. They can also be used to tag containers, electronic vehicles, airline baggage, and more. In addition to the EPC specifications the G2iL offers an integrated Product Status Flag (PSF) feature and read protection of the memory content. On top of the G2iL features the G2iL+ offers an integrated tag tamper alarm, RF field detection, digital switch, external supply mode, read range reduction and data transfer mode. 2. Features and benefits 2.1 Key features  UHF RFID Gen2 tag chip according EPCglobal v1.2.0 with 128 bit EPC memory  Memory read protection  Integrated Product Status Flag (PSF)  Tag tamper alarm  RF field detection  Digital switch  Data transfer mode  Real Read Range Reduction (Privacy Mode)  External supply mode where both the READ & WRITE range are boosted to -27dBm 2.1.1 Memory  128-bit of EPC memory  64-bit Tag IDentifier (TID) including 32-bit factory locked unique serial number  32-bit kill password to permanently disable the tag  32-bit access password to allow a transition into the secured state SL3S1203_1213 UCODE G2iL and G2iL+ Rev. 4.4 — 17 March 2014 178844 Product data sheet COMPANY PUBLIC SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 2 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+  Data retention: 20 years  Broad international operating frequency: from 840 MHz to 960 MHz  Long read/write ranges due to extremely low power design  Reliable operation of multiple tags due to advanced anti-collision  READ protection  WRITE Lock  Wide specified temperature range: 40 C up to +85 C 2.2 Key benefits 2.2.1 End user benefit  Prevention of unauthorized memory access through read protection  Indication of tag tampering attempt by use of the tag tamper alarm feature  Electronic device configuration and / or activation by the use of the digital switch / data transfer mode  Theft deterrence supported by the PSF feature (PSF alarm or EPC code)  Small label sizes, long read ranges due to high chip sensitivity  Product identification through unalterable extended TID range, including a 32-bit serial number  Reliable operation in dense reader and noisy environments through high interference suppression 2.2.2 Antenna design benefits  High sensitivity enables small and cost efficient antenna designs  Low Q-Value eases broad band antenna design for global usage 2.2.3 Label manufacturer benefit  Consistent performance on different materials due to low Q-factor  Ease of assembly and high assembly yields through large chip input capacitance  Fast first WRITE of the EPC memory for fast label initialization 2.3 Custom commands  PSF Alarm Built-in PSF (Product Status Flag), enables the UHF RFID tag to be used as EAS tag (Electronic Article Surveillance) tag without the need for a back-end data base.  Read Protect Protects all memory content including CRC16 from unauthorized reading.  ChangeConfig Configures the additional features of the chip like external supply mode, tamper alarm, digital switch, read range reduction or data transfer. The UCODE G2iL is equipped with a number of additional features and custom commands. Nevertheless, the chip is designed in a way standard EPCglobal READ/WRITE/ACCESS commands can be used to operate the features. No custom commands are needed to take advantage of all the features in case of unlocked EPC memory. SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 3 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 3. Applications 3.1 Markets  Fashion (Apparel and footwear)  Retail  Electronics  Fast Moving Consumer Goods  Asset management  Electronic Vehicle Identification 3.2 Applications  Supply chain management  Item level tagging  Pallet and case tracking  Container identification  Product authentication  PCB tagging  Cost efficient, low level seals  Wireless firmware download  Wireless product activation Outside above mentioned applications, please contact NXP Semiconductors for support. 4. Ordering information 5. Marking Table 1. Ordering information Type number Package Name IC type Description Version SL3S1203FUF Wafer G2iL bumped die on sawn 8” 75 m wafer not applicable SL3S1213FUF Wafer G2iL+ bumped die on sawn 8” 75 m wafer not applicable SL3S1203FUD/BG Wafer G2iL bumped die on sawn 8” 120 m wafer, 7 m Polyimide spacer not applicable SL3S1213FUD/BG Wafer G2iL+ bumped die on sawn 8” 120 m wafer, 7 m Polyimide spacer not applicable SL3S1203FTB0 XSON6 G2iL plastic extremely thin small outline package; no leads; 6 terminals; body 1  1.45  0.5 mm SOT886F1 Table 2. Marking codes Type number Marking code Comment Version SL3S1203FTB0 UN UCODE G2iL SOT886 SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 4 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 6. Block diagram The SL3S12x3 IC consists of three major blocks: - Analog Interface - Digital Control - EEPROM The analog part provides stable supply voltage and demodulates data received from the reader for being processed by the digital part. Further, the modulation transistor of the analog part transmits data back to the reader. The digital section includes the state machines, processes the protocol and handles communication with the EEPROM, which contains the EPC and the user data. Fig 1. Block diagram of G2iL IC 001aam226 MOD DEMOD VREG VDD VDD data in data out R/W ANALOG RF INTERFACE PAD PAD RECT DIGITAL CONTROL ANTENNA ANTICOLLISION READ/WRITE CONTROL ACCESS CONTROL EEPROM INTERFACE CONTROL RF INTERFACE CONTROL I/O CONTROL I/O CONTROL EEPROM MEMORY SEQUENCER CHARGE PUMP PAD OUT PAD SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 5 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 7. Pinning information 7.1 Pin description Fig 2. Pinning bare die Fig 3. Pin configuration for SOT886 001aam529 VDD OUT RFN NXP trademark RFP SL3S12x3FTB0 n.c. 001aan103 RFP RFN n.c. VDD OUT Transparent top view 2 3 1 5 4 6 Table 3. Pin description bare die Symbol Description OUT output pin RFN grounded antenna connector VDD external supply RFP ungrounded antenna connector Table 4. Pin description SOT886 Pin Symbol Description 1 RFP ungrounded antenna connector 2 n.c. not connected 3 RFN grounded antenna connector 4 OUT output pin 5 n.c. not connected 6 VDD external supply SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 6 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 8. Wafer layout 8.1 Wafer layout (1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m) (2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m) (3) Chip step, x-length: 485 m (4) Chip step, y-length: 435 m (5) Bump to bump distance X (OUT - RFN): 383 m (6) Bump to bump distance Y (RFN - RFP): 333 m (7) Distance bump to metal sealring X: 40,3 m (outer edge - top metal) (8) Distance bump to metal sealring Y: 40,3 m Bump size X x Y: 60 m x 60 m Remark: OUT and VDD are used with G2iL+ only Fig 4. G2iL wafer layout not to scale! 001aak871 (1) (7) (2) (8) (5) (6) (4) (3) Y X VDD OUT RFN RFP SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 7 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 9. Mechanical specification The UCODE G2iL/G2iL+ wafers are available in 75 m and 120 m thickness. The 75m thick wafer allows ultra thin label design but require a proper tuning of the glue dispenser during production. Because of the more robust structure of the 120m wafer, the wafer is ideal for harsh applications. The 120 m thick wafer is also enhanced with 7m Polyimide spacer allowing additional protection of the active circuit. 9.1 Wafer specification See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**”. 9.1.1 Wafer Table 5. Specifications Wafer Designation each wafer is scribed with batch number and wafer number Diameter 200 mm (8”) Thickness SL3S12x3FUF 75 m  15 m SL3S12x3FUD 120 m  15 m Number of pads 4 Pad location non diagonal/ placed in chip corners Distance pad to pad RFN-RFP 333.0 m Distance pad to pad OUT-RFN 383.0 m Process CMOS 0.14 m Batch size 25 wafers Potential good dies per wafer 139.351 Wafer backside Material Si Treatment ground and stress release Roughness Ra max. 0.5 m, Rt max. 5 m Chip dimensions Die size including scribe 0.485 mm  0.435 mm = 0.211 mm2 Scribe line width: x-dimension = 15 m y-dimension = 15 m Passivation on front Type Sandwich structure Material PE-Nitride (on top) Thickness 1.75 m total thickness of passivation Polyimide spacer 7 m  1 m (SL3S12x3FUD only) Au bump Bump material > 99.9 % pure Au SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 8 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ [1] Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer. 9.1.2 Fail die identification No inkdots are applied to the wafer. Electronic wafer mapping (SECS II format) covers the electrical test results and additionally the results of mechanical/visual inspection. See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” 9.1.3 Map file distribution See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” 10. Functional description 10.1 Air interface standards The UCODE G2iL fully supports all parts of the "Specification for RFID Air Interface EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0". 10.2 Power transfer The interrogator provides an RF field that powers the tag, equipped with a UCODE G2iL. The antenna transforms the impedance of free space to the chip input impedance in order to get the maximum possible power for the G2iL on the tag. The G2iL+ can also be supplied externally. The RF field, which is oscillating on the operating frequency provided by the interrogator, is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC. Bump hardness 35 – 80 HV 0.005 Bump shear strength > 70 MPa Bump height SL3S12x3FUF 18 m SL3S12x3FUD 25 m[1] Bump height uniformity within a die  2 m – within a wafer  3 m – wafer to wafer  4 m Bump flatness  1.5 m Bump size – RFP, RFN 60  60 m – OUT, VDD 60  60 m Bump size variation  5 m Table 5. Specifications SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 9 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ The antenna that is attached to the chip may use a DC connection between the two antenna pads. Therefore the G2iL also enables loop antenna design. Possible examples of supported antenna structures can be found in the reference antenna design guide. 10.3 Data transfer 10.3.1 Reader to tag Link An interrogator transmits information to the UCODE G2iL by modulating an UHF RF signal. The G2iL receives both information and operating energy from this RF signal. Tags are passive, meaning that they receive all of their operating energy from the interrogator's RF waveform. In order to further improve the read range the UCODE G2iL+ can be externally supplied as well so the energy to operate the chip does not need to be transmitted by the reader. An interrogator is using a fixed modulation and data rate for the duration of at least one inventory round. It communicates to the G2iL by modulating an RF carrier using DSB-ASK with PIE encoding. For further details refer to Section 16, Ref. 1. Interrogator-to-tag (R=>T) communications. 10.3.2 Tag to reader Link An interrogator receives information from a G2iL by transmitting an unmodulated RF carrier and listening for a backscattered reply. The G2iL backscatters by switching the reflection coefficient of its antenna between two states in accordance with the data being sent. For further details refer to Section 16, Ref. 1, chapter 6.3.1.3. The UCODE G2iL communicates information by backscatter-modulating the amplitude and/or phase of the RF carrier. Interrogators shall be capable of demodulating either demodulation type. The encoding format, selected in response to interrogator commands, is either FM0 baseband or Miller-modulated subcarrier. 10.4 G2iL and G2iL+ differences The UCODE G2iL is tailored for application where mainly EPC or TID number space is needed. The G2iL+ in addition provides functionality such as tag tamper alarm, external supply operation to further boost read/write range (external supply mode), a Privacy mode reducing the read range or I/O functionality (data transfer to externally connected devices) required. The following table provides an overview of G2iL, G2iL+ special features. Table 6. Overview of G2iL and G2iL+ features Features G2iL G2iL+ Read protection (bankwise) yes yes PSF (Built-in Product Status Flag) yes yes Backscatter strength reduction yes yes Real read range reduction yes yes Digital switch / Digital input - yes External supply mode - yes SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 10 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 10.5 Supported commands The G2iL supports all mandatory EPCglobal V1.2.0 commands. In addition the G2iL supports the following optional commands: • ACCESS • Block Write (32 bit) The G2iL features the following custom commands described more in detail later: • ResetReadProtect (backward compatible to G2X) • ReadProtect (backward compatible to G2X) • ChangeEAS (backward compatible to G2X) • EAS_Alarm (backward compatible to G2X) • ChangeConfig (new with G2iL) 10.6 G2iL, G2iL+ memory The G2iL, G2iL+ memory is implemented according EPCglobal Class1Gen2 and organized in three sections: The logical address of all memory banks begin at zero (00h). In addition to the three memory banks one configuration word to handle the G2iL specific features is available at EPC bank 01 address 200h. The configuration word is described in detail in Section 10.7.1 “ChangeConfig”. Memory pages (16 bit words) pre-programmed to zero will not execute an erase cycle before writing data to it. This approach accelerates initialization of the chip and enables faster programming of the memory. RF field detection - yes Data transfer - yes Tag tamper alarm - yes Table 6. Overview of G2iL and G2iL+ features …continued Features G2iL G2iL+ Table 7. G2iL memory sections Name Size Bank Reserved memory (32 bit ACCESS and 32 bit KILL password) 64 bit 00b EPC (excluding 16 bit CRC-16 and 16 bit PC) 128 bit 01b G2iL Configuration Word 16 bit 01b TID (including permalocked unique 32 bit serial number) 64 bit 10b SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 11 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 10.6.1 G2iL, G2iL+ overall memory map [1] See Figure 5 [2] Indicates the existence of a Configuration Word at the end of the EPC number [3] See also Table 12 for further details. Table 8. G2iL, G2iL+ overall memory map Bank address Memory address Type Content Initial Remark Bank 00 00h to 1Fh reserved kill password all 00h unlocked memory 20h to 3Fh reserved access password all 00h unlocked memory Bank 01 EPC 00h to 0Fh EPC CRC-16: refer to Ref. 16 memory mapped calculated CRC 10h to 14h EPC backscatter length 00110b unlocked memory 15h EPC UMI 0b unlocked memory 16h EPC XPC indicator 0b hardwired to 0 17h to 1Fh EPC numbering system indicator 00h unlocked memory 20h to 9Fh EPC EPC [1] unlocked memory Bank 01 Config Word 200h EPC tamper alarm flag 0b[3] indicator bit 201h EPC external supply flag or input signal 0b[3] indicator bit 202h EPC RFU 0b[3] locked memory 203h EPC RFU 0b[3] locked memory 204h EPC invert digital output: 0b[3] temporary bit 205h EPC transparent mode on/off 0b[3] temporary bit 206h EPC transparent mode data/raw 0b[3] temporary bit 207h EPC RFU 0b[3] locked memory 208h EPC RFU 0b[3] locked memory 209h EPC max. backscatter strength 1b[3] unlocked memory 20Ah EPC digital output 0b[3] unlocked memory 20Bh EPC read range reduction on/off 0b[3] unlocked memory 20Ch EPC RFU 0b[3] locked memory 20Dh EPC read protect EPC Bank 0b[3] unlocked memory 20Eh EPC read protect TID 0b[3] unlocked memory 20Fh EPC PSF alarm flag 0b[3] unlocked memory Bank 10 TID 00h to 07h TID allocation class identifier 1110 0010b locked memory 08h to 13h TID tag mask designer identifier 0000 0000 0110b locked memory 14h TID config word indicator 1b[2] locked memory 14h to 1Fh TID tag model number TMNR[1] locked memory 20h to 3Fh TID serial number SNR locked memory xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 12 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 10.6.2 G2iL TID memory details Fig 5. G2iL TID memory structure aaa-010217 E2006906 E2h 006h 1 0010b 0000110b Ucode G2iL+ E2006807 E2h 006h 1 0000b 0000111b E2006907 E2h 006h 1 0010b 0000111b Ucode G2iL E2006806 E2h 006h 1 0000b 0000110b First 32 bit of TID memory Class ID Mask Designer ID Config Word Indicator Sub Version Nr. Model Number Version (Silicon) Nr. Class Identifier MS Byte MS Bit LS Bit LS Byte TID MS Bit LS Bit Mask-Designer Identifier Model Number Serial Number Bits 7 0 11 0 11 0 31 0 Addresses 00h 07h 13h 1Fh 3Fh Addresses 00h 3Fh 08h 14h 20h E2h (EAN.UCC) 006h (NXP) 806h or 906h or B06h (UCODE G2iL) 00000001h to FFFFFFFFh Sub Version Number Version Number 000b or 001b or 0110b 0000110b (UCODE G2iL) Bits 0 3 0 6 0 Addresses 14h 18h 19h 1Fh E2006B06 E2h 006h 1 0110b 0000110b E2006B07 E2h 006h 1 0110b 0000111b SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 13 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 10.7 Custom commands The UCODE G2iL, G2iL+ is equipped with a number of additional features and custom commands. Nevertheless, the chip is designed in a way standard EPCglobal READ/WRITE/ACCESS commands can be used to operate the features. The memory map stated in the previous section describes the Configuration Word used to control the additional features located at address 200h of the EPC memory. For this reason the standard READ/WRITE commands of an UHF EPCglobal compliant reader can be used to select the flags or activate/deactivate features. The features can only be activated/deactivated (written) using standard EPC WRITE command as long the EPC is not locked. In case the EPC is locked either the bank needs to be unlocked to apply changes or the ChangeConfig custom command is used to change the settings. The UCODE G2iL is also equipped with the complete UCODE G2X command set for backward compatibility reasons. Nevertheless, the one ChangeConfig command of the G2iL can be used instead of the entire G2X command set. Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable selecting Config-Word enhanced transponders in mixed tag populations. 10.7.1 ChangeConfig Although G2iL is tailored for supply chain management, item level tagging and product authentication the G2iL+ version enables active interaction with products. Among the password protected features are the capability of download firmware to electronics, activate/deactivate electronics which can also be used as theft deterrence, a dedicated privacy mode by reducing the read range, integrated PSF (Product Status Flag) or Tag Tamper Alarm. The G2iL ChangeConfig custom command allows handling the special NXP Semiconductors features described in the following paragraph. Please also see the memory map in Section 10.6 “G2iL, G2iL+ memory” and “Section 10.7.2 “G2iL, G2iL+ special features control mechanism”. If the EPC memory is not write locked the standard EPC READ/WRITE command can be used to change the settings. G2iL, G2iL+ special features1 UCODE G2iL and G2iL+ common special features are: • Bank wise read protection (separate for EPC and TID) EPC bank and the serial number part of the TID can be read protected independently. When protected reading of the particular memory will return '0'. The flags of the configuration word can be selected using the standard SELECT2 command. Only read protected parts will then participate an inventory round. The G2X ReadProtect command will set both EPC and TID read protect flags. 1. The features can only be manipulated (enabled/disabled) with unlocked EPC bank, otherwise the ChangeConfig command can be used. 2. SELECT has to be applied onto the Configuration Word with pointer address 200h. Selecting bits within the Configuration Word using a pointer address not equal to 200h is not possible. SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 14 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ • Integrated PSF (Product Status Flag) The PSF is a general purpose flag that can be used as an EAS (Electronic Article Surveillance) flag, quality checked flag or similar. The G2iL offers two ways of detecting an activated PSF. In cases extremely fast detection is needed the EAS_Alarm command can be used. The UCODE G2iL will reply a 64-bit alarm code like described in section EAS_Alarm upon sending the command. As a second option the EPC SELECT2 command selecting the PSF flag of the configuration word can be used. In the following inventory round only PSF enabled chips will reply their EPC number. • Backscatter strength reduction The UCODE G2iL features two levels of backscatter strengths. Per default maximum backscatter is enabled in order to enable maximum read rates. When clearing the flag the strength can be reduced if needed. • Real Read Range Reduction 4R Some applications require the reduction of the read range to close proximity for privacy reasons. Setting the 4R flag will significantly reduce the chip sensitivity to +12 dBm. The +12 dBm have to be available at chip start up (slow increase of field strength is not applicable). For additional privacy, the read protection can be activated in the same configuration step. The related flag of the configuration word can be selected using the standard SELECT2 command so only chips with reduced read range will be part of an inventory. Remark: The attenuation will result in only a few centimeter of read range at 36 dBm EIRP! UCODE G2iL+ specific special features are:1 • Tag Tamper Alarm (G2iL+ only) The UCODE G2iL+ Tamper Alarm will flag the status of the VDD to OUT pad connection which can be designed as an predetermined breaking point (see Figure 6). The status of the pad connection (open/closed) can be read in the configuration register and/or selected using the EPC SELECT2. This feature will enable designing a wireless RFID safety seal. When breaking the connection by peeling off the label or manipulating a lock an alarm can be triggered. Fig 6. Schematic of connecting VDD and OUT pad with a predetermined breaking point to turn a standard RFID label into a wireless safety seal 001aam228 OUT VDD GND RFP SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 15 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ • RF field detection (G2iL+ only) The UCODE G2iL+ VDD pin can be also used as a RF field detector. Upon bringing the tag within an RF field, a pulse signal will be immediately sent from the VDD test pad. (for details see Ref. 21). • Digital Switch (G2iL+ only) The UCODE G2iL+ OUT pin can be used as digital switch. The state of the output pad can be switched to VDD or GND depending on the Digital OUT bit of the Configuration Word register. The state of the output is persistent in the memory even after KILL or switching off the supply. This feature will allow activating/deactivating externally connected peripherals or can be used as theft deterrence of electronics. The state of the OUT pin can also be changed temporary by toggling the 'Invert Digital Output' bit. • Data transfer Mode (G2iL+ only) In applications where not switching the output like described in "Digital Switch" but external device communication is needed the G2iL+ Data Transfer Mode can be used by setting the according bit of the Configuration Word register. When activated the air interface communication will be directly transferred to the OUT pad of the chip. Two modes of data transfer are available and can be switched using the Transparent Mode DATA/RAW bit. The default Transparent Mode DATA will remove the Frame Sync of the communication and toggle the output with every raising edge in the RF field. This will allow implementing a Manchester type of data transmission. The Transparent Mode RAW will switch the demodulated air interface communication to the OUT pad. • External Supply Indicator - Digital Input (G2iL+ only) The VDD pad of the UCODE G2iL+ can be used as a single bit digital input pin. The state of the pad is directly associated with the External Supply Indicator bit of the configuration register. Simple one bit return signaling (chip to reader) can be implemented by polling this Configuration Word register flag. RF reset is necessary for proper polling. • External Supply Mode (G2iL+ only) The UCODE G2iL+ can be supplied externally by connecting 1.85 V (Iout = 0μA) supply. When externally supplied less energy from the RF field is needed to operate the chip. This will not just enable further improved sensitivity and read ranges (up to 27 dBm) but also enable a write range that is equal to the read range. The figure schematically shows the supply connected to the UCODE G2iL+. Remark: When permanently externally supplied there will not be a power-on-reset. This will result in the following limitations: • When externally supplied session flag S0 will keep it’s state during RF-OFF phase. • When externally supplied session flag S2, S3, SL will have infinite persistence time and will behave similar to S0. • Session flag S1 will behave regular like in pure passive operation. SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 16 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ The bits to be toggled in the configuration register need to be set to '1'. E.g. sending 0000 0000 0001 0001 XOR RN16 will activate the 4R and PSF. Sending the very same command a second time will disable the features again. The reply of the ChangeConfig will return the current register setting. Fig 7. Schematic of external power supply Table 9. ChangeConfig custom command Command RFU Data RN CRC-16 No. of bits 16 8 16 16 16 Description 11100000 00000111 00000000 Toggle bits XOR RN 16 handle - Table 10. ChangeConfig custom command reply Header Status bits RN CRC-16 No. of bits 1 16 16 16 Description 0 Config-Word Handle - Table 11. ChangeConfig command-response table Starting state Condition Response Next state ready all - ready arbitrate, reply, acknowledged all - arbitrate open valid handle Status word needs to change Backscatter unchanged Config-WordConfig-Word immediately open valid handle Status word does not need to change Backscatter Config-Word immediately open secured valid handle Status word needs to change Backscatter modified Config-Word, when done secured valid handle Status word does not need to change Backscatter Config-Word immediately secured killed all - killed 001aam229 OUT VDD Vsupply GND RFP SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 17 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ The features can only be activated/deactivated using standard EPC WRITE if the EPC bank is unlocked. The permanent and temporary bits of the Configuration Word can be toggled without the need for an ACCESS password in case the ACCESS password is set to zero. In case the EPC bank is locked the lock needs to be removed before applying changes or the ChangeConfig command has to be used. 10.7.2 G2iL, G2iL+ special features control mechanism Special features of the G2iL are managed using a configuration word (Config-Word) located at address 200h in the EPC memory bank. The entire Config-Word is selectable (using the standard EPC SELECT2 command) and can be read using standard EPC READ command and modified using the standard EPC WRITE or ChangeConfig custom command in case the EPC memory is locked for writing. ChangeConfig can be executed from the OPEN and SECURED state. The chip will take all “Toggle Bits” for ’0’ if the chip is in the OPEN state or the ACCESS password is zero; therefore it will not alter any status bits, but report the current status only. The command will be ignored with an invalid CRC-16 or an invalid handle. The chip will then remain in the current state. The CRC-16 is calculated from the first command-code bit to the last handle bit. A ChangeConfig command without frame-sync and proceeding Req_RN will be ignored. The command will also be ignored if any of the RFU bits are toggled. In order to change the configuration, to activate/deactivate a feature a ’1’ has to be written to the corresponding register flag to toggle the status. E.g. sending 0x0002 to the register will activate the read protection of the TID. Sending the same command a second time will again clear the read protection of the TID. Invalid toggling on indicator or RFU bits are ignored. Executing the command with zero as payload or in the OPEN state will return the current register settings. The chip will reply to a successful ChangeConfig with an extended preamble regardless of the TRext value of the Query command. After sending a ChangeConfig an interrogator shall transmit CW for less than TReply or 20 ms, where TReply is the time between the interrogator's ChangeConfig command and the chip’s backscattered reply. An interrogator may observe three possible responses after sending a ChangeConfig, depending on the success or failure of the operation • ChangeConfigChangeConfig succeeded: The chip will backscatter the reply shown above comprising a header (a 0-bit), the current Status Word setting, the handle, and a CRC-16 calculated over the 0-bit, the status word and the handle. If the interrogator observes this reply within 20 ms then the ChangeConfig completed successfully. • The chip encounters an error: The chip will backscatter an error code during the CW period rather than the reply shown below (see EPCglobal Spec for error-code definitions and for the reply format). • ChangeConfig does not succeed: If the interrogator does not observe a reply within 20 ms then the ChangeStatus did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the chip is still in the interrogator's field, and may reissue the ChangeConfig command. The G2iL configuration word is located at address 200h of the EPC memory and is structured as following: SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 18 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ The configuration word contains three different type of bits: • Indicator bits cannot be changed by command: Tag Tamper Alarm Indicator External Supply Indicator (digital input) • Temporary bits are reset at power up: Invert Output Transparent Mode on/off Data Mode data/raw • Permanent bits: permanently stored bits in the memory Max. Backscatter Strength Digital Output Read Range Reduction Read Protect EPC Read Protect TID PSF Alarm 10.7.3 ReadProtect3 The G2iL ReadProtect custom command enables reliable read protection of the entire G2iL memory. Executing ReadProtect from the Secured state will set the ProtectEPC and ProtectTID bits of the Configuration Word to '1'. With the ReadProtect-Bit set the G2iL will continue to work unaffected but veil its protected content. The read protection can be removed by executing Reset ReadProtect. The ReadProtect-Bits will than be cleared. Devices whose access password is zero will ignore the command. A frame-sync must be pre-pended the command. After sending the ReadProtect command an interrogator shall transmit CW for the lesser of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect command and the backscattered reply. An interrogator may observe three possible responses after sending a ReadProtect, depending on the success or failure of the operation: Table 12. Address 200h to 207h Indicator bits Temporary bits Tamper indicator External supply indicator RFU RFU Invert Output Transparent mode on/off Data mode data/raw RFU 0 1 2 3 4 5 6 7 Table 13. Address 208h to 20Fh Permanent bits RFU max. backscatter strength Digital output Privacy mode RFU Protect EPC Protect TID PSF Alarm bit 8 9 10 11 12 13 14 15 3. Note: The ChangeConfig command can be used instead of “ReadProtect”, “ResetReadProtect”, “ChangeEAS”. SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 19 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ • ReadProtect succeeds: After completing the ReadProtect the G2iL shall backscatter the reply shown in Table 15 comprising a header (a 0-bit), the tag's handle, and a CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2iL will render itself to this ReadProtect mode. If the interrogator observes this reply within 20 ms then the ReadProtect completed successfully. • The G2iL encounters an error: The G2iL will backscatter an error code during the CW period rather than the reply shown in the EPCglobal Spec (see Annex I for error-code definitions and for the reply format). • ReadProtect does not succeed: If the interrogator does not observe a reply within 20 ms then the ReadProtect did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2iL is still in the interrogation zone, and may re-initiate the ReadProtect command. The G2iL reply to the ReadProtect command will use the extended preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the Query that initiated the round. 10.7.4 Reset ReadProtect3 Reset ReadProtect allows an interrogator to clear the ProtectEPC and ProtectTID bits of the Configuration Word. This will re-enable reading of the related G2iL memory content. For details on the command response please refer to Table 17 “Reset ReadProtect command”. Table 14. ReadProtect command Command RN CRC-16 # of bits 16 16 16 description 11100000 00000001 handle - Table 15. G2iL reply to a successful ReadProtect procedure Header RN CRC-16 # of bits 1 16 16 description 0 handle - Table 16. ReadProtect command-response table Starting State Condition Response Next State ready all – ready arbitrate, reply, acknowledged all – arbitrate open all - open secured valid handle & invalid access password – arbitrate valid handle & valid non zero access password Backscatter handle, when done secured invalid handle – secured killed all – killed SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 20 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of TReply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect command and the G2iL backscattered reply. A Req_RN command prior to the Reset ReadProtect is necessary to successfully execute the command. A frame-sync must be pre-pended the command. An interrogator may observe three possible responses after sending a Reset ReadProtect, depending on the success or failure of the operation: • Reset ReadProtect succeeds: After completing the Reset ReadProtect a G2iL will backscatter the reply shown in Table 18 comprising a header (a 0-bit), the handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply within 20 ms then the Reset ReadProtect completed successfully. • The G2iL encounters an error: The G2iL will backscatter an error code during the CW period rather than the reply shown in Table 18 (see EPCglobal Spec for error-code definitions and for the reply format). • Reset ReadProtect does not succeed: If the interrogator does not observe a reply within 20 ms then the Reset ReadProtect did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2iL is still in the interrogation zone, and may reissue the Reset ReadProtect command. The G2iL reply to the Reset ReadProtect command will use the extended preamble shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2iL will reply as if TRext=1 regardless of the TRext value in the Query that initiated the round. The Reset ReadProtect command is structured as following: • 16 bit command • Password: 32 bit Access-Password XOR with 2 times current RN16 Remark: To generate the 32 bit password the 16 bit RN16 is duplicated and used two times to generate the 32 bit (e.g. a RN16 of 1234 will result in 1234 1234). • 16 bit handle • CRC-16 calculate over the first command-code bit to the last handle bit Table 17. Reset ReadProtect command Command Password RN CRC-16 # of bits 16 32 16 16 description 11100000 00000010 (access password)  2*RN16 handle - Table 18. G2iL reply to a successful Reset ReadProtect command Header RN CRC-16 # of bits 1 16 16 description 0 handle - SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 21 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 10.7.5 ChangeEAS3 UCODE G2iL equipped RFID tags will also feature a stand-alone operating EAS alarm mechanism for fast and offline electronic article surveillance. The PSF bit of the Configuration Word directly relates to the EAS Alarm feature. With an PSF bit set to '1' the tag will reply to an EAS_Alarm command by backscattering a 64 bit alarm code without the need of a Select or Query. The EAS is a built-in solution so no connection to a backend database is required. In case the EAS_Alarm command is not implemented in the reader a standard EPC SELCET to the Configuration Word and Query can be used. When using standard SELECT/QUERY the EPC will be returned during inventory. ChangeEAS can be executed from the Secured state only. The command will be ignored if the Access Password is zero, the command will also be ignored with an invalid CRC-16 or an invalid handle, the G2iL will than remain in the current state. The CRC-16 is calculated from the first command-code bit to the last handle bit. A frame-sync must be pre-pended the command. The G2iL reply to a successful ChangeEAS will use the extended preamble, as appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the Query that initiated the round. After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or 20 ms, where TReply is the time between the interrogator's ChangeEAS command and the G2iL backscattered reply. An interrogator may observe three possible responses after sending a ChangeEAS, depending on the success or failure of the operation • ChangeEAS succeeds: After completing the ChangeEAS a G2iL will backscatter the reply shown in Table 21 comprising a header (a 0-bit), the handle, and a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply within 20 ms then the ChangeEAS completed successfully. • The G2iL encounters an error: The G2iL will backscatter an error code during the CW period rather than the reply shown in Table 21 (see EPCglobal Spec for error-code definitions and for the reply format). Table 19. Reset ReadProtect command-response table Starting State Condition Response Next State ready all – ready arbitrate, reply, acknowledged all – arbitrate open valid handle & valid access password Backscatter handle, when done open valid handle & invalid access password – arbitrate invalid handle – open secured valid handle & valid access password Backscatter handle, when done secured valid handle & invalid access password – arbitrate invalid handle – secured killed all – killed SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 22 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ • ChangeEAS does not succeed: If the interrogator does not observe a reply within 20 ms then the ChangeEAS did not complete successfully. The interrogator may issue a Req_RN command (containing the handle) to verify that the G2iL is still in the interrogator's field, and may reissue the ChangeEAS command. Upon receiving a valid ChangeEAS command a G2iL will perform the commanded set/reset operation of the PSF bit of the Configuration Word. If PSF bit is set, the EAS_Alarm command will be available after the next power up and reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be ignored. 10.7.6 EAS_Alarm Upon receiving an EAS_Alarm custom command the UCODE G2iL will immediately backscatter an EAS-Alarmcode in case the PSF bit of the Configuration Word is set. The alarm code is returned without any delay caused by Select, Query and without the need for a backend database. The EAS feature of the G2iL is available after enabling it by sending a ChangeEAS command described in Section 10.7.5 “ChangeEAS3” or after setting the PSF bit of the Configuration Word to ’1’. With the EAS-Alarm enabled the G2iL will reply to an EAS_Alarm command by backscattering a fixed 64 bit alarm code. A G2iL will reply to an EAS_Alarm command from the ready state only. As an alternative to the fast EAS_Alarm command a standard SELECT2 (upon the Configuration Word) and QUERY can be used. If the PSF bit is reset to '0' by sending a ChangeEAS command in the password protected Secure state or clearing the PSF bit the G2iL will not reply to an EAS_Alarm command. Table 20. ChangeEAS command Command ChangeEAS RN CRC-16 # of bits 16 1 16 16 description 11100000 00000011 1 ... set PSF bit 0 ... reset PSF bit handle Table 21. G2iL reply to a successful ChangeEAS command Header RN CRC-16 # of bits 1 16 16 description 0 handle - Table 22. ChangeEAS command-response table Starting State Condition Response Next state ready all – ready arbitrate, reply, acknowledged all – arbitrate open all – open secured valid handle backscatter handle, when done secured invalid handle – secured killed all – killed SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 23 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ The EAS_Alarm command is structured as following: • 16 bit command • 16 bit inverted command • DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec. 6.3.1.2.8 and Table 6.9. • M (cycles per symbol) sets the T=>R data rate and modulation format as shown in EPCglobal Spec. Table 6.10. • TRext chooses whether the T=>R preamble is pre-pended with a pilot tone as described in EPCglobal Spec. 6.3.1.3. A preamble must be pre-pended the EAS_Alarm command according EPCglobal Spec, 6.3.1.2.8. Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate the CRC5 over the backscattered 64 bits received to verify the received code. Table 23. EAS_Alarm command Command Inv_Command DR M TRext CRC-16 # of bits 16 16 1 2 1 16 description 11100000 00000100 00011111 11111011 0: DR = 8 1: DR = 64/3 00: M = 1 01: M = 2 10: M = 4 11: M = 8 0: no pilot tone 1: use pilot tone - Table 24. G2iL reply to a successful EAS_Alarm command Header EAS Code # of bits 1 64 description 0 CRC5 (MSB) Table 25. EAS_Alarm command-response table Starting State Condition Response Next state ready PSF bit is set PSF bit is cleard backscatter alarm code -- ready arbitrate, reply, acknowledged all – arbitrate open all – open secured all – secured killed all – killed SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 24 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 11. Limiting values [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. [3] For ESD measurement, the die chip has been mounted into a CDIP20 package. Table 26. Limiting values[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to RFN Symbol Parameter Conditions Min Max Unit Bare die and SOT886 limitations Tstg storage temperature 55 +125 C Tamb ambient temperature 40 +85 C VESD electrostatic discharge voltage Human body model [3] - 2 kV Pad limitations Vi input voltage absolute limits, VDD-OUT pad 0.5 +2.5 V Io output current absolute limits input/output current, VDD-OUT pad 0.5 +0.5 mA Pi input power maximum power dissipation, RFP pad - 100 mW SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 25 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 12. Characteristics 12.1 UCODE G2iL, G2iL+ bare die characteristics [1] Power to process a Query command. [2] Measured with a 50  source impedance. [3] At minimum operating power. [4] It has to be assured the reader (system) is capable of providing enough field strength to give +12 dBm at the chip otherwise communication with the chip will not be possible. [5] Enables tag designs to be within ETSI limits for return link data rates of e.g. 320 kHz/M4. [6] Will result in up to 10 dB higher tag backscatter power at high field strength. [7] Results in approx. 18.5 dBm tag sensitivity on a 2 dBi gain antenna. Table 27. G2iL, G2iL+ RF interface characteristics (RFN, RFP) Symbol Parameter Conditions Min Typ Max Unit fi input frequency 840 - 960 MHz Normal mode - no external supply, read range reduction OFF Pi(min) minimum input power READ sensitivity [1][2][7] - 18 - dBm Pi(min) minimum input power WRITE sensitivity, (write range/read range - ratio) - 30 - % Ci input capacitance parallel [3] - 0.77 - pF Q quality factor 915 MHz [3] - 9.7 - - Z impedance 866 MHz [3] - 25 -j237 -  915 MHz [3] - 23 -j224 -  953 MHz [3] - 21 -j216 -  External supply mode - VDD pad supplied, read range reduction OFF Pi(min) minimum input power Ext. supplied READ [1][2] - 27 - dBm Ext. supplied WRITE [2] - 27 - dBm Z impedance externally supplied, 915 MHz [3] - 7 -j230 -  Read range reduction ON - no external supply Pi(min) minimum input power 4R on READ [1][2][4] - +12 - dBm 4R on WRITE [2][4] - +12 - dBm Z impedance 4R on, 915 MHz [3] - 18 -j2 -  Modulation resistance R resistance modulation resistance, max. backscatter = off [5] - 170 -  modulation resistance, max. backscatter = on [6] - 55 -  SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 26 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ [1] Activates Digital Output (OUT pin), increases read range (external supplied). [2] Activates Digital Output (OUT pin), increases read and write range (external supplied). [3] Operating the chip outside the specified voltage range may lead to undefined behaviour. [4] Either the voltage or the current needs to be above given values to guarantee specified functionality. [5] No proper operation is guaranteed if both, voltage and current, limits are exceeded. [1] Is the sum of the allowed capacitance of the VDD and OUT pin referenced to RFN. [2] Is the maximum allowed RF input voltage coupling to the VDD/OUT pin to guarantee undisturbed chip functionality. [3] Resistance between VDD and OUT pin in checked during power up only. [4] Resistance range to achieve tamper alarm flag = 1. [5] Resistance range to achieve tamper alarm flag = 0: Table 28. VDD pin characteristics Symbol Parameter Conditions Min Typ Max Unit Minimum supply voltage/current - without assisted EEPROM WRITE [1][3][4] VDD supply voltage minimum voltage - - 1.8 V IDD supply current minimum current, Iout-^- = 0 A - - 7 A Iout = 100 A - - 110 A Minimum supply voltage/current - assisted EEPROM READ and WRITE [2][3][4] VDD supply voltage minimum voltage, Iout = 0 A - 1.8 1.85 V Iout = 100 A - - 1.95 V IDD supply current minimum current, Iout = 0 A - - 125 A Iout = 100 A - - 265 A Maximum supply voltage/current [3][5] VDD supply voltage absolute maximum voltage 2.2 - - V Ii(max) maximum input current absolute maximum current 280 - - A Table 29. G2iL, G2iL+ VDD and OUT pin characteristics Symbol Parameter Conditions Min Typ Max Unit OUT pin characteristics VOL Low-level output voltage Isink = 1 mA - - 100 mV VOH HIGH-level output voltage VDD = 1.8 V; Isource = 100 μA 1.5 - - V VDD/OUT pin characteristics CL load capacitance VDD - OUT pin max. [1] - - 5 pF Vo output voltage maximum RF peak voltage on VDD-OUT pins [2] - - 500 mV VDD/OUT pin tamper alarm characteristics [3] RL(max) maximum load resistance resistance range high [4] - - <2 M RL(min) minimum load resistance resistance range low [5] >20 - - M SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 27 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ For further reading we recommend application note “FAQ UCODE G2iL+“ (Ref. 21) describing the output characteristics more in detail. An example schematic is available in application note “UCODE G2iL+ Demo board Manual“ (Ref. 22). The documents are available at NXP Document Control or at the website www.nxp.com. [1] Tamb 25 C 12.2 UCODE G2iL SOT886 characteristics [1] Power to process a Query command. [2] Measured with a 50  source impedance. [3] At minimum operating power. Remark: For DC and memory characteristics refer to Table 28, Table 29 and Table 30. Table 30. G2iL, G2iL+ memory characteristics Symbol Parameter Conditions Min Typ Max Unit EEPROM characteristics tret retention time Tamb 55 C 20 - - year Nendu(W) write endurance 1000 10000[1] - cycle Table 31. G2iL RF interface characteristics (RFN, RFP) Symbol Parameter Conditions Min Typ Max Unit Normal mode - no external supply, read range reduction OFF Pi(min) minimum input power READ sensitivity [1][2] - 17.6 - dB m Z impedance 915 MHz [3] - 21 j199 -  Normal mode - externally supplied, read range reduction OFF Pi(min) minimum input power READ sensitivity [1][2] - 27 - dB m Z impedance 915 MHz [3] - 5.6 j204 -  SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 28 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 13. Package outline Fig 8. Package outline SOT886 Outline References version European projection Issue date IEC JEDEC JEITA SOT886 MO-252 sot886_po 04-07-22 12-01-05 Unit mm max nom min 0.5 0.04 1.50 1.45 1.40 1.05 1.00 0.95 0.35 0.30 0.27 0.40 0.35 0.32 0.6 A(1) Dimensions (mm are the original dimensions) Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 A1 b 0.25 0.20 0.17 D E e e1 0.5 L L1 terminal 1 index area D E e1 e A1 b L1 L e1 0 1 2 mm scale 1 6 2 5 3 4 6x (2) 4x (2) A SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 29 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 14. Packing information 14.1 Wafer See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**” 14.2 SOT886 Part orientation T1. For details please refer to http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf 15. Abbreviations Table 32. Abbreviations Acronym Description CRC Cyclic Redundancy Check CW Continuous Wave DSB-ASK Double Side Band-Amplitude Shift Keying DC Direct Current EAS Electronic Article Surveillance EEPROM Electrically Erasable Programmable Read Only Memory EPC Electronic Product Code (containing Header, Domain Manager, Object Class and Serial Number) FM0 Bi phase space modulation G2 Generation 2 IC Integrated Circuit PIE Pulse Interval Encoding RRRR Real Read Range Reduction PSF Product Status Flag RF Radio Frequency UHF Ultra High Frequency SECS Semi Equipment Communication Standard TID Tag IDentifier SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 30 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 16. References [1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0 (December 17, 2005) [2] EPCglobal: EPC Tag Data Standards [3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft) [4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference (draft) [5] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 1 – Technical characteristics and test methods [6] European Telecommunications Standards Institute (ETSI), EN 302 208: Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency identification equipment operating in the band 865 MHz to 868 MHz with power levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive [7] [CEPT1]: CEPT REC 70-03 Annex 1 [8] [ETSI1]: ETSI EN 330 220-1, 2 [9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1: Technical characteristics and test methods. [10] [FCC1]: FCC 47 Part 15 Section 247 [11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International Standards [12] ISO/IEC 3309: Information technology – Telecommunications and information exchange between systems – High-level data link control (HDLC) procedures – Frame structure [13] ISO/IEC 15961: Information technology, Automatic identification and data capture – Radio frequency identification (RFID) for item management – Data protocol: application interface [14] ISO/IEC 15962: Information technology, Automatic identification and data capture techniques – Radio frequency identification (RFID) for item management – Data protocol: data encoding rules and logical memory functions [15] ISO/IEC 15963: Information technology — Radio frequency identification for item management — Unique identification for RF tags [16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item management — Part 1: Reference architecture and definition of parameters to be standardized [17] ISO/IEC 18000-6: Information technology automatic identification and data capture techniques — Radio frequency identification for item management air interface — Part 6: Parameters for air interface communications at 860–960 MHz [18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary – Part 3: radio-frequency identification (RFID) SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 31 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ [19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15: Radio-frequency devices, U.S. Federal Communications Commission. [20] Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093**4 [21] Application note - FAQ UCODE G2i, BU-ID document number: AN10940 [22] Application note - UCODE G2iM+ demo board documentation, BU-ID document number: AN11237 4. ** ... document version number SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 32 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 17. Revision history Table 33. Revision history Document ID Release date Data sheet status Change notice Supersedes SL3S1203_1213 v.4.4 20140317 Product data sheet - SL3S1203_1213 v.4.3 Modifications: • Table 8 “G2iL, G2iL+ overall memory map”: Table notes updated • Figure 5 “G2iL TID memory structure”: TIDs updated SL3S1203_1213 v.4.3 20131127 Product data sheet - SL3S1203_1213 v.4.2 Modifications: • Figure 5 “G2iL TID memory structure”: updated SL3S1203_1213 v.4.2 20130701 Product data sheet - SL3S1203_1213 v.4.1 Modifications: • Update of delivery form • Update RF field detection SL3S1203_1213 v.4.1 20120917 Product data sheet - SL3S1203_1213 v.4.0 Modifications: • Update of delivery form SL3S1203_1213 v.4.0 20120227 Product data sheet - SL3S1203_1213 v.3.9 Modifications: • Figure 4 “G2iL wafer layout”: Figure notes (1) and (2) updated SL3S1203_1213 v.3.9 20120130 Product data sheet - SL3S1203_1213 v.3.8 Modifications: • Table 6 “Specifications”: “Passivation on front” updated • Section 15.2.1 “General assembly recommendations”: updated SL3S1203_1213 v.3.8 20120111 Product data sheet - SL3S1203_1213 v.3.7 Modifications: • Section 8.1 “Wafer layout”: Figure notes (1) and (2) updated SL3S1203_1213 v.3.7 20111124 Product data sheet - SL3S1203_1213 v.3.6 Modifications: • Table 11 “G2iL, G2iL+ overall memory map”: updated • Table 34 “G2iL, G2iL+ RF interface characteristics (RFN, RFP)”: updated SL3S1203_1213 v.3.6 20110803 Product data sheet - SL3S1203_1213 v.3.5 Modifications: • Real Read Range Reduction feature added to G2iL SL3S1203_1213 v.3.5 20110531 Product data sheet - SL3S1203_1213 v.3.4 Modifications: • Superfluous text removed from Table 6 SL3S1203_1213 v.3.4 20110511 Product data sheet - SL3S1203_1213 v.3.3 Modifications: • Security status changed into COMPANY PUBLIC • Delivery form of FCS2 strap added • Section 13 “Package information”, Section 15 “Handling information” and Section 16 “Packing information” added SL3S1203_1213 v.3.3 20110131 Product data sheet - SL3S1203_1213 v.3.2 Modifications: • Section 4 “Ordering information”: new types SL3S1203FUD and SL3S1213FUD added • Section 9 “Mechanical specification”: updated according to the new types • Replaced wording of “ChangeStatus” with “ChangeConfig” SL3S1203_1213 v.3.2 20101109 Product data sheet - SL3S1203_1213 v.3.1 Modifications: • Version SOT886F1 added • Section 5 “Marking”, Section 13 “Package outline” and Section 14 “Packing information” added SL3S1203_1213 v.3.1 20100922 Product data sheet - SL3S1203_1213 v.3.0 Modifications: • General Modifications SL3S1203_1213 v.3.0 20100621 Product data sheet - 178810 SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 33 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ Modifications: • General update 178810 20100304 Objective data sheet - - Table 33. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 34 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 18. Legal information 18.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 35 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. UCODE — is a trademark of NXP Semiconductors N.V. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 4.4 — 17 March 2014 178844 36 of 37 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ 20. Tables Table 1. Ordering information. . . . . . . . . . . . . . . . . . . . . .3 Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .3 Table 3. Pin description bare die . . . . . . . . . . . . . . . . . . .5 Table 4. Pin description SOT886 . . . . . . . . . . . . . . . . . . .5 Table 5. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Table 6. Overview of G2iL and G2iL+ features . . . . . . . .9 Table 7. G2iL memory sections . . . . . . . . . . . . . . . . . . .10 Table 8. G2iL, G2iL+ overall memory map. . . . . . . . . . . 11 Table 9. ChangeConfig custom command . . . . . . . . . . .16 Table 10. ChangeConfig custom command reply. . . . . . .16 Table 11. ChangeConfig command-response table . . . . .16 Table 12. Address 200h to 207h . . . . . . . . . . . . . . . . . . .18 Table 13. Address 208h to 20Fh . . . . . . . . . . . . . . . . . . .18 Table 14. ReadProtect command. . . . . . . . . . . . . . . . . . .19 Table 15. G2iL reply to a successful ReadProtect procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Table 16. ReadProtect command-response table . . . . . .19 Table 17. Reset ReadProtect command . . . . . . . . . . . . .20 Table 18. G2iL reply to a successful Reset ReadProtect command. . . . . . . . . . . . . . . . . . .20 Table 19. Reset ReadProtect command-response table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 20. ChangeEAS command . . . . . . . . . . . . . . . . . . 22 Table 21. G2iL reply to a successful ChangeEAS command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 22. ChangeEAS command-response table . . . . . . 22 Table 23. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 23 Table 24. G2iL reply to a successful EAS_Alarm c ommand. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 25. EAS_Alarm command-response table . . . . . . 23 Table 26. Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . . 24 Table 27. G2iL, G2iL+ RF interface characteristics (RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 28. VDD pin characteristics . . . . . . . . . . . . . . . . . . 26 Table 29. G2iL, G2iL+ VDD and OUT pin characteristics . . . . . . . . . . . . . . . . . . . . . . 26 Table 30. G2iL, G2iL+ memory characteristics . . . . . . . . 27 Table 31. G2iL RF interface characteristics (RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 32. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 33. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32 21. Figures Fig 1. Block diagram of G2iL IC . . . . . . . . . . . . . . . . . . .4 Fig 2. Pinning bare die. . . . . . . . . . . . . . . . . . . . . . . . . . .5 Fig 3. Pin configuration for SOT886 . . . . . . . . . . . . . . . .5 Fig 4. G2iL wafer layout. . . . . . . . . . . . . . . . . . . . . . . . . .6 Fig 5. G2iL TID memory structure . . . . . . . . . . . . . . . . .12 Fig 6. Schematic of connecting VDD and OUT pad with a predetermined breaking point to turn a standard RFID label into a wireless safety seal . .14 Fig 7. Schematic of external power supply . . . . . . . . . .16 Fig 8. Package outline SOT886. . . . . . . . . . . . . . . . . . .28 NXP Semiconductors SL3S1203_1213 UCODE G2iL and G2iL+ © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 March 2014 178844 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1.1 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2.1 End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2.2 Antenna design benefits . . . . . . . . . . . . . . . . . . 2 2.2.3 Label manufacturer benefit. . . . . . . . . . . . . . . . 2 2.3 Custom commands. . . . . . . . . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.1 Markets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5 7.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Mechanical specification . . . . . . . . . . . . . . . . . 7 9.1 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7 9.1.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9.1.2 Fail die identification . . . . . . . . . . . . . . . . . . . . 8 9.1.3 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8 10 Functional description . . . . . . . . . . . . . . . . . . . 8 10.1 Air interface standards . . . . . . . . . . . . . . . . . . . 8 10.2 Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 8 10.3 Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.3.1 Reader to tag Link . . . . . . . . . . . . . . . . . . . . . . 9 10.3.2 Tag to reader Link. . . . . . . . . . . . . . . . . . . . . . . 9 10.4 G2iL and G2iL+ differences . . . . . . . . . . . . . . . 9 10.5 Supported commands . . . . . . . . . . . . . . . . . . 10 10.6 G2iL, G2iL+ memory . . . . . . . . . . . . . . . . . . . 10 10.6.1 G2iL, G2iL+ overall memory map. . . . . . . . . . 11 10.6.2 G2iL TID memory details . . . . . . . . . . . . . . . . 12 10.7 Custom commands. . . . . . . . . . . . . . . . . . . . . 13 10.7.1 ChangeConfig. . . . . . . . . . . . . . . . . . . . . . . . . 13 G2iL, G2iL+ special features . . . . . . . . . . . . . .13 10.7.2 G2iL, G2iL+ special features control mechanism . . . . . . . . . . . . . . . . . . . . . 17 10.7.3 ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . . 18 10.7.4 Reset ReadProtect3 . . . . . . . . . . . . . . . . . . . . 19 10.7.5 ChangeEAS3 . . . . . . . . . . . . . . . . . . . . . . . . . 21 10.7.6 EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 22 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 24 12 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25 12.1 UCODE G2iL, G2iL+ bare die characteristics 25 12.2 UCODE G2iL SOT886 characteristics . . . . . . 27 13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 28 14 Packing information . . . . . . . . . . . . . . . . . . . . 29 14.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 14.2 SOT886 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29 16 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 32 18 Legal information . . . . . . . . . . . . . . . . . . . . . . 34 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 34 18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 34 18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 35 19 Contact information . . . . . . . . . . . . . . . . . . . . 35 20 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 21 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 1 | P a g e Address: Midas Components Ltd, Electra House, 32 Southtown Road, Great Yarmouth, Norfolk, England, NR31 ODU Email:sales@midascomponents.co.uk Website:www.midascomponents.co.uk Tel:+44(0)1493 602602 Fax:+44(0)1493 665111 Specification Issue 1 26/6/2012 SERIAL TFT MODULE APPLICATION NOTE 1 Compiling and transferring image files via the USB interface. Date Description of change 26/6/12 Initial creation 2 | P a g e Address: Midas Components Ltd, Electra House, 32 Southtown Road, Great Yarmouth, Norfolk, England, NR31 ODU Email:sales@midascomponents.co.uk Website:www.midascomponents.co.uk Tel:+44(0)1493 602602 Fax:+44(0)1493 665111 Overview The Midas range of serial TFT modules offer the ability to store images which are then selected for display using serial commands. This overcomes the need to transfer large amounts of data over the serial interface. The following application note describes how to prepare image files and transfer them to the display module flash memory drive via the USB interface. Requirements Midas Serial TFT display module. USB cable type A to mini B. BmpToBin application software (available from Midas). Procedure 1) Create two directories one called BMP_DATA and the other BMP_FILE . 2) Place all the bitmap files you require for your project in the BMP_FILE directory. Note that the files must be 24-bit bitmap type. Note that the size of the combined images must not be greater than 2M bytes. This is the sum of x*y*2 for each image. Ie. For the above (240*320*2)+ (240*320*2)+ (240*320*2)+ (240*320*2)+ (240*320*2)+ (240*320*2)+ (240*320*2)+ (1315*32*2)=1159360 3 | P a g e Address: Midas Components Ltd, Electra House, 32 Southtown Road, Great Yarmouth, Norfolk, England, NR31 ODU Email:sales@midascomponents.co.uk Website:www.midascomponents.co.uk Tel:+44(0)1493 602602 Fax:+44(0)1493 665111 3) Re-name each image numerically in the sequence required bearing in mind that any short animation sequences need to be in sequential order. i.e: 4) Exit this directory and place the BmpToBin application file in the parent directory i.e 5) Run the BmpToBinForM.exe application by double clicking the icon. This will then create two files within the BMP_DATA directory. 6) Plug the TFT module into your PC using a USB A to mini B cable. The module should then appear on your PC as a flash memory device. 4 | P a g e Address: Midas Components Ltd, Electra House, 32 Southtown Road, Great Yarmouth, Norfolk, England, NR31 ODU Email:sales@midascomponents.co.uk Website:www.midascomponents.co.uk Tel:+44(0)1493 602602 Fax:+44(0)1493 665111 7) Simply Copy the two files BMPDATA.BIN and TABLE.BIN created earlier to the module flash drive. These images are then available to be displayed via serial command. If there are already files on the module flash drive you may want to back them up to your PC. You can now via the serial interface view the images on the display module using commands such as: Browse Pictures, Cut a Picture, Animation, Call on PIC and Run Demo. Command Summary Commands are sent to the board via the Serial UART (TTL levels) on J1. The default serial format is 9600,N,8,1. All commands are ASCII characters followed by CR LF (0D0A hex). Function Command Format Example Busy Low time Browse Pictures ALL “ALL\n” - Draw a circle CIRCLE Xa Ya R C “CIRCLE 100 100 50 31\n” 4ms Fill in colour CLR Xa Ya Xe Ye C “CLR 0 0 100 100 31\n” 5ms Clear Screen CLS C “CLS 31\n” 28ms Cut a picture CUT Pn Xa Ya Xb Yb Xs Ys “CUT 1 30 30 0 0 100 100 \n” 20ms Draw a dot DOT Xa Ya C “DOT 100 100 31\n” 0.12ms Draw a frame with line type and chamfer FRAME Xa Ya Xe Ye Ds Do C “FRAME 10 10 200 40 2 3 31\n” 4ms Draw a line LINE Xa Ya Xe Ye C “LINE 10 10 50 50 31\n” 0.7ms Backlight on LEDON “LEDON\n” 4us Backlight off LEDOFF “LEDOFF\n” 4us Animation MOT Xa Ya Ps Pe Pt “MOT 0 0 10 14 100\n” 0.15ms Animation off MOFF “MOFF\n” 4us Call on PIC PIC Pn Xa Ya “PIC 1 30 30\n” 125ms Draw a rectangle RECT Xa Ya Xe Ye C “RECT 10 10 100 100 31\n” 5ms Get screen size * SIZE “SIZE\n” 13ms Display alphabetic string STR Xa Ya C Str “STR 0 0 31 Hello World\n” 0.8ms / char Display alphabetic string with background colour STR Xa Ya C Cb Str “STR 0 20 65535 31 Hello World\n” 30us / char Set baud rate BAUD b1 b2 “BAUD 9600 9600\n” 20ms Run demo DEMO Dt Xa Ya “DEMO 1000 0 0\n” 20ms Stop demo DMOFF “DMOFF\n” 20ms Change orientation TURN Tn “TURN 90\n” 140ms 5 | P a g e Address: Midas Components Ltd, Electra House, 32 Southtown Road, Great Yarmouth, Norfolk, England, NR31 ODU Email:sales@midascomponents.co.uk Website:www.midascomponents.co.uk Tel:+44(0)1493 602602 Fax:+44(0)1493 665111 Notes: Xa Ya :Start x y coordinates. Xe Ye :End x y coordinates. C :Colour (16 bits,RGB 565). Xb Yb :Start x y coordinates in flash image. Xs yS :Size of flash image block. Ds Do :Length of solid line / dotted line. Str :ASCII String (8x16). Pn :Picture number in flash 000-999. R :Radius in pixels. Ps :Start Picture number. Pe :End picture number. Pt :Time between pictures (step:100ms). * :Returned on RX “STY Xsize Ysize\n” b1 b2 :Baud rate (2400,4800,9600,19200,38400,56000,57600,115200) Dt :Time between pictures (step:100ms). Tn :Rotation angle (0,90) Notes: Anti-static precautions should be observed whilst handling this product. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MIDAS MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Midas disclaims all liability arising from this information and its use. Use of Midas’s products as critical components in life support systems is not authorized except with express written approval by Midas. No licenses are conveyed, implicitly or otherwise, under any Midas intellectual property rights. A Premier Farnell Company MIDAS un traitement complet du signal Bien que les algorithmes de traitement complexes rendent cela possible, ils sont en général exécutés plus vite et de manière plus économique dans un système numérique. Le monde réel ne suit pas l’évolution informatique définie par la Loi de Moore, et le désir humain d’aller toujours plus vite et à moindre coût, incite résolument à rester en analogique. En conséquence, les ingénieurs doivent continuer à relever des défis relatifs à la détection précise de signaux dans l’univers analogique et les restituer le plus fidèlement possible dans un format numérique. Alchimie analogique La conception analogique a longtemps été considérée comme un art ésotérique, exigeant une connaissance pointue et une intuition pour garantir la stabilité du système, optimiser le gain et la réponse en fréquence, traiter les problèmes de mise à la masse, gérer les impédances et leur comparaison, ainsi que minimiser les effets de bruit. Parallèlement, la pression augmente pour satisfaire aux exigences rigoureuses en matière de coût, commercialisation et capacité de production de masse. La grande majorité des ingénieurs modernes ne peut tout simplement pas s’offrir le luxe d’optimiser individuellement des circuits analogiques. Pour relever ces défis, l’alchimie analogique la plus mystérieuse a tendance désormais à se produire au niveau du silicium ; la technique de dorure est intégrée aux composants qui constituent le traitement du signal. Les produits analogiques les plus récents visent maintenant à « pré résoudre » un grand nombre des défis qui occupaient les spécialistes en technique analogique. Ils sont plus riches en fonctionnalités et moins sensibles aux variables, telles que configuration et longueurs de tracé PCB. Ils sont aussi intrinsèquement moins gourmands en énergie que leurs prédécesseurs. Ainsi, les produits de dernière génération proposés sur le marché des circuits intégrés offrent une conception interne plus simple, nécessitant moins de composants externes et supportant une gestion de l’alimentation au niveau du système. La gamme des produits Farnell En offrant l’un des portefeuilles produits, les plus étendus en technologies de traitement du signal, provenant d’innovateurs influents dans le domaine des produits analogiques de pointe, hautement performants, Farnell est idéalement placé pour aider le concepteur à identifier, sélectionner et évaluer les produits haute performance du marché actuel. Pour faciliter l’évaluation, la sélection et l’intégration de produits de traitement du signal en vue d’atteindre des objectifs de système ambitieux, Farnell a classé les principales technologies en cinq catégories, regroupées sous l’acronyme MIDAS : Mixed-signal, Interface, Data conversion, Amplification, and Sensors (ou signaux mixtes, interface, conversion de données, amplification et capteurs). La catégorie Signaux mixtes comprend des appareils comme les multiplexeurs, les commutateurs analogiques, les filtres, les potentiomètres numériques, les isolateurs, les résistances et les compensateurs. Concernant les produits d’interface, les ingénieurs ont de nombreuses options de connectivité, dont SERDES, transmetteurs LVDS et interfaces Ethernet. Ce groupe englobe également les oscillateurs, les circuits d’horloge et les PLL. La conversion de donnée est la phase du traitement du signal la plus proche du domaine numérique, comprenant diverses classes de convertisseurs N/A et A/N dont des appareils polyvalents à haut débit et de grande précision, selon les spécifications de l’application ou du système. Dans la catégorie Amplificateurs, les ingénieurs ont la possibilité de choisir parmi une gamme extrêmement étendue d’options disponibles, là aussi le choix étant en grande partie déterminé par l’application et les exigences de performance du système. Les amplificateurs proposés par les principaux fournisseurs distribués par Farnell incluent des amplificateurs audio, à détection de courant, différentiels, polyvalents, d’instrumentation, d’isolement, logarithmiques, ‘Médaille d’or’ de la conception analogique avancée Le monde actuel est très dépendant du contrôle et de la régulation d’une grande variété d’effets physiques. Par exemple pour utiliser des ressources énergétiques de manière plus efficace et pour améliorer la qualité de vie, les exemples de produits électroniques utilisés pour atteindre ces objectifs incluent les systèmes de contrôle et de mesure des gaz d’échappement, les scanners médicaux, les instruments de surveillance médicale, la télésurveillance d’état d’un équipement et les systèmes de sécurité sophistiqués. opérationnels, à gain programmable et amplis buffer vidéo, ainsi qu’une gamme étendue de comparateurs et de compresseurs/extenseurs. Enfin, concernant les capteurs appropriés, avec les accéléromètres, capteurs de courant, à effet hall, de pression, de proximité et de température, complétés des quatre autres catégories, les ingénieurs peuvent compléter leur analyse des besoins en traitement du signal pour tout système de contrôle, d’enregistrement ou de régulation. Ceux-ci peuvent élargir les possibilités d’application, allant des systèmes médicaux, automobile aux systèmes industriels, commerciaux et domestiques. En analysant le traitement du signal de cette manière, les ingénieurs peuvent rapidement identifier les éléments nécessaires pour compléter une solution et commencer l’assemblage d’une combinaison optimale. Technologie d’avant-garde, présentée en avant-première Dans le cadre de cette campagne Technology First, nous étudions quelques-unes des dernières innovations et tendances dans chacune des cinq catégories afin identifier comment les caractéristiques et les performances des composants viennent en aide aux défis de la conception analogique, en améliorant le rapport qualité/prix tout en supportant encombrement et consommation énergétique moindres. En conclusion, il est important de noter que Farnell est en mesure de fournir des composants complémentaires pour satisfaire aux exigences de la conception numérique, réaliser un système complet et hautement performant. DATA SHEET Product specification October 1998 DISCRETE SEMICONDUCTORS BYW29EX series Rectifier diodes ultrafast, rugged NXP Semiconductors Product specification Rectifier diodes BYW29EX series ultrafast, rugged GENERAL DESCRIPTION QUICK REFERENCE DATA Glass passivated epitaxial rectifier SYMBOL PARAMETER MAX. MAX. UNIT diodes in a full pack plastic envelope, featuring low forward voltage drop, BYW29EX- 150 200 ultra-fast recovery times, soft recovery VRRM Repetitive peak reverse 150 200 V characteristic and guaranteed reverse voltage surge and ESD capability. They are VF Forward voltage 0.895 0.895 V intended for use in switchedmode power IF(AV) Forward current 8 8 A supplies and high frequency circuits in trr Reverse recovery time 25 25 ns general where low conduction and IRRM Repetitive peak reverse 0.2 0.2 A switching losses are essential. current PINNING - SOD113 PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 cathode 2 anode case isolated LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT -150 -200 VRRM Repetitive peak reverse voltage - 150 200 V VRWM Crest working reverse voltage - 150 200 V VR Continuous reverse voltage - 150 200 V IF(AV) Average forward current1 square wave; d = 0.5; Ths £ 106 °C - 8 A sinusoidal; a = 1.57; Ths £ 109 °C - 7.3 A IF(RMS) RMS forward current - 11.3 A IFRM Repetitive peak forward current t = 25 μs; d = 0.5; - 16 A Ths £ 106 °C IFSM Non-repetitive peak forward t = 10 ms - 80 A current t = 8.3 ms - 88 A sinusoidal; with reapplied VRWM(max) I2t I2t for fusing t = 10 ms - 32 A2s IRRM Repetitive peak reverse current tp = 2 μs; d = 0.001 - 0.2 A IRSM Non-repetitive peak reverse tp = 100 μs - 0.2 A current Tstg Storage temperature -40 150 °C Tj Operating junction temperature - 150 °C 1 2 case k a 1 2 1 Neglecting switching and reverse current losses October 1998 1 Rev 1.200 NXP Semiconductors Product specification Rectifier diodes BYW29EX series ultrafast, rugged ESD LIMITING VALUE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VC Electrostatic discharge Human body model; - 8 kV capacitor voltage C = 250 pF; R = 1.5 kW ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 °C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Visol R.M.S. isolation voltage from f = 50-60 Hz; sinusoidal - 2500 V both terminals to external waveform; heatsink R.H. £ 65% ; clean and dustfree Cisol Capacitance from both terminals f = 1 MHz - 10 - pF to external heatsink THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Rth j-hs Thermal resistance junction to with heatsink compound - - 5.5 K/W heatsink without heatsink compound - - 7.2 K/W Rth j-a Thermal resistance junction to in free air - 55 - K/W ambient STATIC CHARACTERISTICS Tj = 25 °C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF Forward voltage IF = 8 A; Tj = 150°C - 0.80 0.895 V IF = 8 A - 0.92 1.05 V IF = 20 A - 1.1 1.3 V IR Reverse current VR = VRWM; Tj = 100 °C - 0.2 0.6 mA VR = VRWM - 2 10 μA DYNAMIC CHARACTERISTICS Tj = 25 °C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Qs Reverse recovery charge IF = 2 A; VR ³ 30 V; -dIF/dt = 20 A/μs - 4 11 nC trr1 Reverse recovery time IF = 1 A; VR ³ 30 V; - 20 25 ns -dIF/dt = 100 A/μs trr2 Reverse recovery time IF = 0.5 A to IR = 1 A; Irec = 0.25 A - 15 20 ns Vfr Forward recovery voltage IF = 1 A; dIF/dt = 10 A/μs - 1 - V October 1998 2 Rev 1.200 NXP Semiconductors Product specification Rectifier diodes BYW29EX series ultrafast, rugged Fig.1. Definition of trr1, Qs and Irrm Fig.2. Definition of Vfr Fig.3. Circuit schematic for trr2 Fig.4. Definition of trr2 Fig.5. Maximum forward dissipation PF = f(IF(AV)); square current waveform where IF(AV) =IF(RMS) x ÖD. Fig.6. Maximum forward dissipation PF = f(IF(AV)); sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). Q s 10% 100% time dI dt F I R I F I rrm t rr I = 1A R I rec = 0.25A 0A trr2 0.5A IF IR time time V F V fr V F I F 0 2 4 6 8 10 12 0 2 4 6 8 10 12 D = 1.0 0.5 0.2 0.1 BYW29 IF(AV) / A PF / W tp D = tp T T t I Ths(max) / C 150 139 128 117 106 95 84 Vo = 0.791 V Rs = 0.013 ohms shunt Current to ’scope D.U.T. Voltage Pulse Source R 0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8 a = 1.57 1.9 2.2 2.8 4 BYW29 IF(AV) / A PF / W Ths(max) / C 150 144.5 139 133.5 128 122.5 117 111.5 106 Vo = 0.791 V Rs = 0.013 Ohms October 1998 3 Rev 1.200 NXP Semiconductors Product specification Rectifier diodes BYW29EX series ultrafast, rugged Fig.7. Maximum trr at Tj = 25 °C. Fig.8. Maximum Irrm at Tj = 25 °C. Fig.9. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.10. Maximum Qs at Tj = 25 °C. Fig.11. Transient thermal impedance; Zth j-hs = f(tp). 1 10 trr / ns 1 10 100 1000 100 dIF/dt (A/us) IF=1A IF=10A 10 1.0 1.0 10 100 -dIF/dt (A/us) Qs / nC IF=10A 5A 2A 1A 100 10 1 0.1 0.01 Irrm / A 1 10 100 -dIF/dt (A/us) IF=1A IF=10A 1us 10us 100us 1ms 10ms 100ms 1s 10s 0.001 0.01 0.1 1 10 pulse width, tp (s) BYW29F/EX Transient thermal impedance, Zth j-hs (K/W) tp D = tp T T P t D 0 1 2 30 20 10 0 typ max IF / A 0.5 1.5 VF / V Tj=150 C Tj=25 C BYW29 October 1998 4 Rev 1.200 NXP Semiconductors Product specification Rectifier diodes BYW29EX series ultrafast, rugged MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.12. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10.3 max 3.2 3.0 4.6 max 2.9 max 2.8 seating plane 6.4 15.8 max 0.6 2.5 2.54 5.08 1 2 3 max. not tinned 3 0.5 2.5 0.9 0.7 0.4 M 15.8 max. 19 max. 13.5 min. Recesses (2x) 2.5 0.8 max. depth 1.0 (2x) October 1998 5 Rev 1.200 NXP Semiconductors Legal information DATA SHEET STATUS Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DEFINITIONS Product specification ⎯ The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. DISCLAIMERS Limited warranty and liability ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors Legal information NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products ⎯ Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers. © NXP B.V. 2011 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands CSM_EE-SPX303N_403N_DS_E_3_2 Broad Slot-type Photomicrosensor EE-SPX303N/403N A Wide Slot Width of 13 mm and Superior Resistance to Light Interference and Noise. • Noise resistance equivalent to photomicrosensors with built-in amplifiers. • Resistance to common noise at least 30 times that of previous models. • Resistance to inverter noise at least 10 times that of previous models. • Reverse polarity protection built in. Be sure to read Safety Precautions on page 3. For the most recent information on models that have been certified for safety standards, refer to your OMRON website. Ordering Information Sensors Accessories (Order Separately) * Refer to Accessories for details. Appearance Sensing method Sensing distance (slot width) Output type Output configuration Model Through-beam type (with slot) NPN output Dark-ON EE-SPX303N Light-ON EE-SPX403N Type Cable length Model Connector EE-1001 EE-1009 Connector with Cable 1 m EE-1006 1M EE-1010 1M 2 m EE-1006 2M EE-1010 2M Connector with Robot Cable 1 m EE-1010-R 1M 2 m EE-1010-R 2M NPN/PNP Conversion Connector 0.46 m (total length) EE-2002 Infrared light 13 mm (slot width) 2 EE-SPX303N/403N Ratings and Specifications Engineering Data (Reference Value) Sensing Position Characteristics EE-SPX303N Item Models EE-SPX303N, EE-SPX403N Sensing distance 13 mm (slot width) Sensing object Opaque: 2.2 × 0.5 mm min. Differential distance 0.05 mm max. Light source Infrared LED (pulse lighting) with a peak wavelength of 940 nm Indicator Light indicator (red) Supply voltage 12 to 24 VDC ±10%, ripple (p-p): 5% max. Current consumption 15 mA max. Control output NPN voltage output: Load power supply voltage: 12 to 24 VDC Load current: 80 mA max. OFF current: 0.5 mA max. 80 mA load current with a residual voltage of 2.0 V max. 10 mA load current with a residual voltage of 1.0 V max. Protection circuits Power supply reverse polarity protection, Output reverse polarity protection Response frequency * 100 Hz min. Ambient illumination 3,000 lx max. with incandescent light or sunlight on the surface of the receiver. Ambient temperature range Operating: −10 to +55°C Storage: −25 to +65°C Ambient humidity range Operating: 5% to 85% Storage: 5% to 95% Vibration resistance Destruction: 10 to 55 Hz, 1.5-mm double amplitude for 2 h each in X, Y, and Z directions Shock resistance Destruction: 500 m/s2 for 3 times each in X, Y, and Z directions Degree of protection IEC IP50 Connecting method Special connector (soldering not possible) Weight Approx. 4 g Material Polycarbonate * The response frequency was measured by detecting the following rotating disk. 2 mm Disk 2 mm 2 mm 0 1 2 3 4 5 6 Distance d (mm) Tr ON Tr OFF Dark-ON d 0 1 2 3 4 5 6 Distance d (mm) Tr ON Tr OFF Dark-ON d EE-SPX303N/403N 3 I/O Circuit Diagrams NPN Output Safety Precautions Refer to Warranty and Limitations of Liability. This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes. Make sure that this product is used within the rated ambient environment conditions. ● Wiring • Connection is made using a connector. Do not solder to the pins (leads). The pins (leads) are soldered to the internal board of the Sensor. Therefore, direct soldering of the pins (leads) may result in an internal disconnection causing malfunction. • When extending the cable, use an extension cable with conductors having a total cross-section area of 0.3 mm2. The total cable length must be 2 m maximum. • To use a cable length longer than 2 m, attach a capacitor with a capacitance of approximately 10 μF to the wires as shown below. The distance between the terminal and the capacitor must be within 2 m. (Use a capacitor with a dielectric strength that is at least twice the Sensor's power supply voltage.) • Make sure the total length of the power cable connected to the product is less than 10 m even if a capacitor is inserted. Model Output configuration Timing charts Output circuit EE-SPX403N Light-ON EE-SPX303N Dark-ON Incident Interrupted ON OFF ON OFF Operates Releases H L Light indicator (red) Output transistor Load 1 (relay) Load 2 lC Light indicator (red) 1.5 to 3 mA Load 1 Load 2 Main circuit OUT ∗ * Voltage output (when the sensor is connected to a transistor circuit) 12 to 24 VDC Incident Interrupted ON OFF ON OFF Operates Releases H L Light indicator (red) Output transistor Load 1 (relay) Load 2 WARNING Precautions for Correct Use OUT Extension cable A capacitance of 10 μF min. + − 12 to 24 VDC 0 V 2 m max. 4 EE-SPX303N/403N (Unit: mm) Dimensions Tolerance class IT16 applies to dimensions in this datasheet unless otherwise specified. Sensors Accessories (Order Separately) * Refer to Accessories for details. 7.4 0.3 0.7 13 10 19 3.2 26 26 2-3.7 5.08 13 19.5 2.54 1 2 3 Four, R1.6 Indicator window Sensing window (0.5 × 2.2) EE-SPX303N, EE-SPX403N Terminal Arrangement (1) + Vcc (2) OUT OUTPUT (3) − GND (0 V) Read and Understand This Catalog Please read and understand this catalog before purchasing the products. Please consult your OMRON representative if you have any questions or comments. Warranty and Limitations of Liability WARRANTY OMRON's exclusive warranty is that the products are free from defects in materials and workmanship for a period of one year (or other period if specified) from date of sale by OMRON. OMRON MAKES NO WARRANTY OR REPRESENTATION, EXPRESS OR IMPLIED, REGARDING NON-INFRINGEMENT, MERCHANTABILITY, OR FITNESS FOR PARTICULAR PURPOSE OF THE PRODUCTS. ANY BUYER OR USER ACKNOWLEDGES THAT THE BUYER OR USER ALONE HAS DETERMINED THAT THE PRODUCTS WILL SUITABLY MEET THE REQUIREMENTS OF THEIR INTENDED USE. OMRON DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED. LIMITATIONS OF LIABILITY OMRON SHALL NOT BE RESPONSIBLE FOR SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, LOSS OF PROFITS OR COMMERCIAL LOSS IN ANY WAY CONNECTED WITH THE PRODUCTS, WHETHER SUCH CLAIM IS BASED ON CONTRACT, WARRANTY, NEGLIGENCE, OR STRICT LIABILITY. In no event shall the responsibility of OMRON for any act exceed the individual price of the product on which liability is asserted. IN NO EVENT SHALL OMRON BE RESPONSIBLE FOR WARRANTY, REPAIR, OR OTHER CLAIMS REGARDING THE PRODUCTS UNLESS OMRON'S ANALYSIS CONFIRMS THAT THE PRODUCTS WERE PROPERLY HANDLED, STORED, INSTALLED, AND MAINTAINED AND NOT SUBJECT TO CONTAMINATION, ABUSE, MISUSE, OR INAPPROPRIATE MODIFICATION OR REPAIR. Application Considerations SUITABILITY FOR USE OMRON shall not be responsible for conformity with any standards, codes, or regulations that apply to the combination of products in the customer's application or use of the products. At the customer's request, OMRON will provide applicable third party certification documents identifying ratings and limitations of use that apply to the products. This information by itself is not sufficient for a complete determination of the suitability of the products in combination with the end product, machine, system, or other application or use. The following are some examples of applications for which particular attention must be given. This is not intended to be an exhaustive list of all possible uses of the products, nor is it intended to imply that the uses listed may be suitable for the products:  Outdoor use, uses involving potential chemical contamination or electrical interference, or conditions or uses not described in this catalog.  Nuclear energy control systems, combustion systems, railroad systems, aviation systems, medical equipment, amusement machines, vehicles, safety equipment, and installations subject to separate industry or government regulations.  Systems, machines, and equipment that could present a risk to life or property. Please know and observe all prohibitions of use applicable to the products. NEVER USE THE PRODUCTS FOR AN APPLICATION INVOLVING SERIOUS RISK TO LIFE OR PROPERTY WITHOUT ENSURING THAT THE SYSTEM AS AWHOLE HAS BEEN DESIGNED TO ADDRESS THE RISKS, AND THAT THE OMRON PRODUCTS ARE PROPERLY RATED AND INSTALLED FOR THE INTENDED USE WITHIN THE OVERALL EQUIPMENT OR SYSTEM. PROGRAMMABLE PRODUCTS OMRON shall not be responsible for the user's programming of a programmable product, or any consequence thereof. Disclaimers CHANGE IN SPECIFICATIONS Product specifications and accessories may be changed at any time based on improvements and other reasons. It is our practice to change model numbers when published ratings or features are changed, or when significant construction changes are made. However, some specifications of the products may be changed without any notice. When in doubt, special model numbers may be assigned to fix or establish key specifications for your application on your request. Please consult with your OMRON representative at any time to confirm actual specifications of purchased products. DIMENSIONS ANDWEIGHTS Dimensions and weights are nominal and are not to be used for manufacturing purposes, even when tolerances are shown. PERFORMANCE DATA Performance data given in this catalog is provided as a guide for the user in determining suitability and does not constitute a warranty. It may represent the result of OMRON’s test conditions, and the users must correlate it to actual application requirements. Actual performance is subject to the OMRON Warranty and Limitations of Liability. ERRORS AND OMISSIONS The information in this document has been carefully checked and is believed to be accurate; however, no responsibility is assumed for clerical, typographical, or proofreading errors, or omissions. 2012.8 In the interest of product improvement, specifications are subject to change without notice. OMRON Corporation Industrial Automation Company http://www.ia.omron.com/ (c)Copyright OMRON Corporation 2012 All Right Reserved. DATA SHEET Product data sheet Supersedes data of 1999 Apr 29 2004 Jan 22 DISCRETE SEMICONDUCTORS PMBTA13; PMBTA14 NPN Darlington transistors 2004 Jan 22 2 NXP Semiconductors Product data sheet NPN Darlington transistors PMBTA13; PMBTA14 FEATURES •High current (max. 500 mA) •Low voltage (max. 30 V) •High DC current gain (min. 10000). APPLICATIONS •High input impedance preamplifiers. DESCRIPTION NPN Darlington transistor in a SOT23 plastic package. PNP complement: PMBTA64. MARKING Note 1.* = p : Made in Hong Kong. * = t : Made in Malaysia. * = W : Made in China. PINNING TYPE NUMBER MARKING CODE(1) PMBTA13 *1M PMBTA14 *1N PIN DESCRIPTION 1 base 2 emitter 3 collector Fig.1 Simplified outline (SOT23) and symbol.handbook, halfpageMAM298132132TR2TR1Top view ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION PMBTA13 − plastic surface mounted package; 3 leads SOT23 PMBTA14 2004 Jan 22 3 NXP Semiconductors Product data sheet NPN Darlington transistors PMBTA13; PMBTA14 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). Note 1.Transistor mounted on an FR4 printed-circuit board. THERMAL CHARACTERISTICS Note 1.Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 30 V VCES collector-emitter voltage VBE = 0 − 30 V VEBO emitter-base voltage open collector − 10 V IC collector current (DC) − 500 mA ICM peak collector current − 800 mA IB base current (DC) − 200 mA Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 250 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient note 1 500 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = 30 V − 100 nA IEBO emitter cut-off current IC = 0; VEB = 10 V − 100 nA hFE DC current gain IC = 10 mA; VCE = 5 V; (see Fig.2) PMBTA13 5000 − PMBTA14 10000 − DC current gain IC = 100 mA; VCE = 5 V; (see Fig.2) PMBTA13 10000 − PMBTA14 20000 − VCEsat collector-emitter saturation voltage IC = 100 mA; IB = 0.1 mA − 1.5 V VBEon base-emitter on-state voltage IC = 100 mA; VCE = 5 V − 1.4 V fT transition frequency IC = 10 mA; VCE = 5 V; f = 100 MHz 125 − MHz 2004 Jan 22 4 NXP Semiconductors Product data sheet NPN Darlington transistors PMBTA13; PMBTA14 Fig.2 DC current gain; typical values.handbook, full pagewidth060000800002000040000MGD83710−11IC (mA)hFE10102 103VCE = 2 V. 2004 Jan 22 5 NXP Semiconductors Product data sheet NPN Darlington transistors PMBTA13; PMBTA14 PACKAGE OUTLINEUNITA1max.bpcDE e1HELpQwv REFERENCESOUTLINEVERSIONEUROPEANPROJECTIONISSUE DATE04-11-0406-03-16 IEC JEDEC JEITAmm0.10.480.380.150.093.02.81.41.20.95e1.92.52.10.550.450.10.2DIMENSIONS (mm are the original dimensions)0.450.15 SOT23TO-236ABbpDe1eAA1LpQdetail XHEEwMvMABAB012 mmscaleA1.10.9cX123Plastic surface-mounted package; 3 leadsSOT23 2004 Jan 22 6 NXP Semiconductors Product data sheet NPN Darlington transistors PMBTA13; PMBTA14 DATA SHEET STATUS Notes 1.Please consult the most recently issued document before initiating or completing a design. 2.The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENTSTATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Printed in The Netherlands R75/05/pp7 Date of release: 2004 Jan 22 Document order number: 9397 750 12507 http://www.tracopower.com Page 1 of 4 DC/DC Converters TDR 3 Series, 3 Watt Features ◆ Compact design in SMD or DIP package ◆ Wide 2:1 input voltage range ◆ Fully regulated outputs ◆ Low ripple and noise ◆ No minimum load required ◆ Temperature range –40°C to +85°C ◆ I/O isolation 1500 VDC ◆ Continuous short-circuit protection ◆ Remote On/Off control ◆ Fully RoHS compliant ◆ 3-year product warranty The TDR-3 series is a family of compact 3 W dc/dc-converters with 2:1 input voltage ranges and tightly regulated output voltages even under no load conditions. The product is available in SMD-package or in DIP-package. They work with high efficiency over the full load range and come with a remote On/Off input. The usability in temperature ranges of up to 85°C, continuous short circuit protection and excellent immunity against environmental influences make these converters very reliable. A TDR-3 converter is the ideal solution for space critical high end applications in communication equipment, instrumentation and industrial electronics. Order code DIP models Order code SMD models Input voltage range Output voltage Output current max. Efficiency typ. TDR 3-0511 TDR 3-0511SM 5.0 VDC 600 mA 79 % TDR 3-0512 TDR 3-0512SM 12 VDC 250 mA 80 % TDR 3-0513 TDR 3-0513SM 4.5 – 9.0 VDC 15 VDC 200 mA 81 % TDR 3-0522 TDR 3-0522SM (5 VDC nominal) ±12 VDC ±125 mA 80 % TDR 3-0523 TDR 3-0523SM ±15 VDC ±100 mA 81 % TDR 3-1211 TDR 3-1211SM 5.0 VDC 600 mA 81 % TDR 3-1212 TDR 3-1212SM 12 VDC 250 mA 82 % TDR 3-1213 TDR 3-1213SM 9 – 18 VDC 15 VDC 200 mA 82 % TDR 3-1222 TDR 3-1222SM (12 VDC nominal) ±12 VDC ±125 mA 82 % TDR 3-1223 TDR 3-1223SM ±15 VDC ±100 mA 83 % TDR 3-2411 TDR 3-2411SM 5.0 VDC 600 mA 81 % TDR 3-2412 TDR 3-2412SM 12 VDC 250 mA 82 % TDR 3-2413 TDR 3-2413SM 18 – 36 VDC 15 VDC 200 mA 83 % TDR 3-2422 TDR 3-2422SM (24 VDC nominal) ±12 VDC ±125 mA 83 % TDR 3-2423 TDR 3-2423SM ±15 VDC ±100 mA 83 % TDR 3-4811 TDR 3-4811SM 5.0 VDC 600 mA 81 % TDR 3-4812 TDR 3-4812SM 12 VDC 250 mA 82 % TDR 3-4813 TDR 3-4813SM 36 – 75 VDC 15 VDC 200 mA 82 % TDR 3-4822 TDR 3-4822SM (48 VDC nominal) ±12 VDC ±125 mA 83 % TDR 3-4823 TDR 3-4823SM ±15 VDC ±100 mA 83 % Models UL 60950-1 http://www.tracopower.com Page 2 of 4 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. DC/DC Converters TDR 3 Series 3 Watt Input Specifications Input current at no load (nominal input voltage) 5 Vin models: 50 mA typ. 12 Vin models: 30 mA typ. 24 Vin models: 13 mA typ. 48 Vin models: 10 mA typ. Input current at full load (nominal input voltage) 5 Vin models: 790 mA typ. 12 Vin models: 320 mA typ. 24 Vin models: 160 mA typ. 48 Vin models: 80 mA typ. Surge voltage (1 sec. max.) 5 Vin models: 15 V max. 12 Vin models: 25 V max. 24 Vin models: 50 V max. 48 Vin models: 100 V max. Input filter capacitor type (see EMC considerations page 3 for compliance to EN 55022 class A/B) ESD (electrostatic discharge) EN 61000-4-2, air ±8 kV, contact ±6 kV, perf. criteria A Radiated immunity EN 61000-4-3 10 V/m, perf. criteria A Fast transient / Surge EN 61000-4-4, ±2 kV, perf. criteria A EN 61000-4-5, ±1 kV perf. criteria A with external input capacitor e.g. Nippon chemi-con KY 220 μF, 100 V, ESR 48 mOhm Conducted immunity EN 61000-4-6, 10 Vrms, perf. criteria A Reflected ripple current 5 Vin models: 80 mAp-p typ. (measured with input filter according class A) 12 Vin models: 40 mAp-p typ. 24 Vin models: 30 mAp-p typ. 48 Vin models: 20 mAp-p typ. Output Specifications Voltage set accuracy ±1 % max Regulation – Input variation Vin min. to Vin max. 0.2 % max. – Load variation 0 – 100 % single output models: 1.0 % max. dual output models: 1.0 % max. balanced load – Load variation 10 – 90 % single output models: 0.5 % max. dual output models: 0.8 % max. balanced load – Load cross regulation 25/100 % 5.0 % max. (dual output models) Minimum load 0 % of rated max. load Temperature coefficient ±0.02 %/K Ripple and noise (20 MHz bandwidth) 30 mVp-p typ. Start up time – Power On 5 ms typ. (constant resistive load) – Remote On 5 ms typ. Transient response setting time (25 % load step change) 250 μs typ. Short circuit protection continuous, automatic recovery Capacitive load 5 VDC models: 1680 μF max. 12 VDC models: 820 μF max. 15 VDC models: 680 μF max. ±12 VDC models: ±470 μF max. ±15 VDC models: ±330 μF max. http://www.tracopower.com Page 3 of 4 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. DC/DC Converters TDR 3 Series 3 Watt EMC Consideration Recommended filter for EN 55022 class A compliance Input models C1 C3 L1 value order code datasheet 5 VDC 4.7 μF / 25 V 1812 MLCC 10 μH TCK-047 www.tracopower.com/products/tck047.pdf 12 VDC 6.8 μF / 50 V 1812 MLCC 12 μH TCK-062 www.tracopower.com/products/tck062.pdf 24 VDC 4.7 μF / 50 V 1812 MLCC 220pF / 3 kV 1808 MLCC 10 μH TCK-047 www.tracopower.com/products/tck047.pdf 48 VDC 4.7 μF / 100 V 1812 MLCC 10 μH General Specifications Temperature ranges – Operating –40°C to +85°C – Storage –55°C to +125°C – Case temperature tba. Load derating 3.3 %/K above +70°C Humidity (non condensing) 5 % to 90 % rel. H max. Thermal shock acc. MIL-STD-810F Vibration acc. MIL-STD-810F Reliability, calculated MTBF (MIL-HDBK-217F, at+25°C, ground benign) >2.4 Mio h Isolation voltage (60 sec.) – Input/Output 1500 VDC Isolation capacitance – Input/Output 50 pF max. Isolation resistance – Input/Output (500 VDC) >10 GOhm Altitude during operation tba. Safety standard (designed to meet) IEC/EN 60950-1, UL 60950-1 Safety approvals – UL/cUL www.ul.com -> certifications -> File e188913 Switching frequency 100 kHz (PWM) Remote On/Off – On: open or high impedance – Off: 2...4 mA current applied via 1KOhm resistor – Off stand by input current 2.5 mA max. TDR 3 dc/dc-converter Load L1 C1 C3 +Vin -Vin +Vout -Vout TDR 3 dc/dc-converter Load L1 C1 C2 C3 +Vin -Vin +Vout -Vout Input models C1 & C2 C3 L1 value order code (SMD type) datasheet 5 VDC 6.8 μF / 25 V 1812 MLCC 10 μH TCK-047 www.tracopower.com/products/tck047.pdf 12 VDC 4.7 μF / 50 V 1812 MLCC 12 μH TCK-062 www.tracopower.com/products/tck062.pdf 24 VDC 220pF / 3 kV 1808 MLCC 18 μH TCK-046 48 VDC 4.7 μF / 100 V 1812 MLCC 18 μH TCK-046 www.tracopower.com/products/tck046.pdf Recommended filter for EN 55022 class B compliance Page 4 of 4 Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com DC/DC Converters TDR 3 Series 3 Watt Outline Dimensions Pin Single Dual 1 –Vin (GND) –Vin (GND) 2 Remote On/Off Remote On/Off 6 NC Common 7 NC –Vout 8 +Vout +Vout 9 –Vout Common 14 +Vin (Vcc) +Vin (Vcc) Pin-Out Rev. February 22. 2013 Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) Pin pich tolerances: ±0.25 (±0.01) Pysical Specifications Casing material non-conductive plastic (UL94V-0 rated) Package weight 4.5 g (0.16 oz) Soldering profile for DIP-package models max. 265°C / 10 sec. (wave soldering) Lead-free reflow solder process for SMD-package models as per J-STD-020D.01 (to find at: www.jedec.org - free registration required) Moisture sensivity level (for SMD-package models) level 2a as per J-STD-033B.01 (to find at: www.jedec.org - free registration required) Environmental compliance – Reach www.tracopower.com/products/tdr3-reach.pdf – RoHS RoHS directive 2011/65/EU Packaging – Tube 10 pcs packing unit – Tape & Reel (only SMD models, add suffix –TR) 200 pcs packing unit 18.9 8.7 12.8 13.55 (0.74) (0.35) (0.533) (0.50) 3.8 (0.15) 0.8(0.03) 1.3(0.05) top view 14 9 8 1 2 6 7 1.8 2.54 10.16 2.54 (0.07) (0.1) (0.4) (0.1) 0.25 (0.01) 0-15° 1.8 2.54 10.16 2.54 18.9 8.7 12.8 17.2 (0.07) (0.1) (0.4) (0.74) (0.35) (0.68) (0.50) (0.1) 1.0 (0.04) 1.5 (0.06) top view 14 9 8 1 2 6 7 7.4 (0.29) 0.25 (0.01) 0-4° 1.2 (0.05) DIP-Models SMD-Models NC = not to connect Recommended Solder Pad Dimension: 18.1 (0.71) 1.8 2.54 10.16 2.54 (0.07) (0.1) (0.4) (0.1) 1.8 (0.07) 2.0 (0.08) Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 1 / 60 Features  Single output current up to 700 mA  3 watts maximum output power  High efficiency up to 82%  RoHS directive compliant  Sip package, 21.8 x 11.2 x 9.1mm (0.86 x 0.36x 0.44 inch)  4:1 wide input voltage range  Low ripple & noise  UL94-V0 case potting materials  Input to output isolation: 1500Vdc,min for 60 seconds  Continuous short circuit protection  Remote ON/OFF  International safety standard approval Options  3000Vdc isolation for 60 seconds Applications  Wireless Network  Telecom / Datacom  Industry Control System  Measurement Equipment  Semiconductor Equipment TMR 3-WI Series Application Note DC/DC Converter 4.5 to 18Vdc, 9 to 36Vdc or 18 to 75Vdc Input 3.3 to 15Vdc Single Outputs ±5Vdc to ±15Vdc Dual Outputs and 3 Watt Output Power Pending Complete TMR 3-WI datasheet can be downloaded at: http://www.tracopower.com/products/tmr3wi.pdf General Description The TMR 3WI series offer 3 watts of output power from a 21.8 x 11.2 x 9.1mm (0.86 x 0.36 x 0.44 inch) package without derating up to 71°C. The TMR 3WI series have 4:1 wide input voltage range from 4.5-18Vdc, 9-36Vdc or 18-75Vdc and features 1500Vdc of isolation test voltage, short-circuit protection. All models are particularly suited to telecommunications, industrial, mobile telecom and test equipment applications. Table of contents Absolute Maximum Rating P2 Thermal Consideration P57 Output Specification P2 Remote ON/OFF Control P57 Input Specification P3 – P4 Mechanical Data P58 General Specification P4 – P5 Recommended Pad Layout P58 Environmental Specification P5 Soldering Consideration P59 EMC Characteristic P5 Packaging Information P59 Characteristic Curves P6 – P53 Order Code P60 Test Configurations P54 Safety and Installation Instruction P60 EMI Considerations P55 – P56 MTBF and Reliability P60 Input Source Impedance P57 Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 2 / 60 3W Single & Dual Output Absolute Maximum Rating Parameter Model Min Max Unit Input Voltage Continuous Transient (100ms) TMR 3-12xxWI TMR 3-24xxWI TMR 3-48xxWI TMR 3-12xxWI TMR 3-24xxWI TMR 3-48xxWI 18 36 75 36 50 100 Vdc Operating Ambient Temperature (without derating) All -40 +71 °C Storage Temperature All -55 +125 °C Output Specification Parameter Model Min Typ Max Unit Output Voltage (Vin = Vin nom; Full Load; TA = 25°C) TMR 3-xx10WI TMR 3-xx11WI TMR 3-xx09WI TMR 3-xx12WI TMR 3-xx13WI TMR 3-xx21WI TMR 3-xx22WI TMR 3-xx23WI 3.267 4.95 8.91 11.88 14.85 ±4.95 ±11.88 ±14.85 3.3 5 9 12 15 ±5 ±12 ±15 3.333 5.05 9.09 12.12 15.15 ±5.05 ±12.12 ±15.15 Vdc Output Regulation Line (Vin min to Vin max at Full Load) Load (0% to 100% of Full Load) Load (5% to 100% of Full Load) All -0.2 -1.0 -0.5 +0.2 +1.0 +0.5 % Output Ripple & Noise Peak-to-Peak (5Hz to 20MHz Bandwidth) All 30 mV pk-pk Temperature Coefficient All -0.02 +0.02 %/°C Dynamic Load Response (Vin = Vin nom; TA = 25°C) Load step change from 75% to 100% or 100 to 75% of Full Load Setting Time (Vout < 10% peak deviation) All 250 μS Output Current TMR 3-xx10WI TMR 3-xx11WI TMR 3-xx09WI TMR 3-xx12WI TMR 3-xx13WI TMR 3-xx21WI TMR 3-xx22WI TMR 3-xx23WI 0 0 0 0 0 0 0 0 700 600 333 250 200 ±300 ±125 ±100 mA Max. Capacitive Load on the Output TMR 3-xx10WI TMR 3-xx11WI TMR 3-xx09WI TMR 3-xx12WI TMR 3-xx13WI TMR 3-xx21WI TMR 3-xx22WI TMR 3-xx23WI 3300 1680 1000 820 680 ±1000 ±470 ±330 μF Output Short Circuit Protection All Continuous, automatics recovery Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 3 / 60 3W Single & Dual Output Input Specification Parameter Model Min Typ Max Unit Operating Input Voltage TMR 3-12xxWI TMR 3-24xxWI TMR 3-48xxWI 4.5 9 18 12 24 48 18 36 75 Vdc Input Current (Maximum Value at Vin = Vin nom; Full Load) TMR 3-1210WI TMR 3-1211WI TMR 3-1209WI TMR 3-1212WI TMR 3-1213WI TMR 3-1221WI TMR 3-1222WI TMR 3-1223WI TMR 3-2410WI TMR 3-2411WI TMR 3-2409WI TMR 3-2412WI TMR 3-2413WI TMR 3-2421WI TMR 3-2422WI TMR 3-2423WI TMR 3-4810WI TMR 3-4811WI TMR 3-4809WI TMR 3-4812WI TMR 3-4813WI TMR 3-4821WI TMR 3-4822WI TMR 3-4823WI 285 338 333 329 329 329 329 329 140 165 165 160 160 167 162 162 71 82 82 81 81 84 81 81 mA Input Standby Current (Typical Value at Vin = Vin nom; No Load) TMR 3-1210WI TMR 3-1211WI TMR 3-1209WI TMR 3-1212WI TMR 3-1213WI TMR 3-1221WI TMR 3-1222WI TMR 3-1223WI TMR 3-2410WI TMR 3-2411WI TMR 3-2409WI TMR 3-2412WI TMR 3-2413WI TMR 3-2421WI TMR 3-2422WI TMR 3-2423WI TMR 3-4810WI TMR 3-4811WI TMR 3-4809WI TMR 3-4812WI TMR 3-4813WI TMR 3-4821WI TMR 3-4822WI TMR 3-4823WI 35 40 40 40 40 40 40 40 20 20 19 20 19 25 25 25 12 12 13 14 14 14 14 14 mA Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 4 / 60 3W Single & Dual Output Input Specification Parameter Model Min Typ Max Unit Input Reflected Ripple Current (See Page 54) TMR 3-12xxWI TMR 3-24xxWI TMR 3-48xxWI 25 10 8 mA pk-pk Start Up Time (Vin = Vin nom and constant resistive load) Power up Remote ON/OFF All 30 30 mS Remote ON/OFF Control (See Page 57) DC-DC ON DC-DC OFF All 2 Open 4 mA Remote Off Input Current All 2.5 mA General Specification Parameter Model Min Typ Max Unit Efficiency (See Page 60) (Vin = Vin nom; Full Load; TA = 25°C) TMR 3-1210WI TMR 3-1211WI TMR 3-1209WI TMR 3-1212WI TMR 3-1213WI TMR 3-1221WI TMR 3-1222WI TMR 3-1223WI TMR 3-2410WI TMR 3-2411WI TMR 3-2409WI TMR 3-2412WI TMR 3-2413WI TMR 3-2421WI TMR 3-2422WI TMR 3-2423WI TMR 3-4810WI TMR 3-4811WI TMR 3-4809WI TMR 3-4812WI TMR 3-4813WI TMR 3-4821WI TMR 3-4822WI TMR 3-4823WI 74 78 79 80 80 80 80 80 75 80 80 82 82 79 81 81 74 80 80 81 81 79 81 81 % Isolation Voltage (for 60 seconds) Input to Output Standard Suffix ”H” All All 1500 3000 Vdc Isolation Resistance All 109 Ω Isolation Capacitance Standard Suffix ”H” All 200 40 pF Switching Frequency All 100 KHz Weight All 4.8 g Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 5 / 60 3W Single & Dual Output General Specification Parameter Model Min Typ Max Unit MTBF (See Page 60) Bellcore TR-NWT-000332, TC = 40°C MIL-HDBK-217F All 3’963’000 1’707’000 hours Case Material Non-conductive black plastic Base Material None Potting material Silicon (UL94-V0) Dimensions 21.8 X 9.2 X 11.1 mm (0.86 X 0.36 X 0.44 Inch) Environmental Specification Thermal shock MIL-STD-810F Vibration MIL-STD-810F Relative humidity 5% to 95% RH EMC Characteristic EMI (See Page 55 & 56) EN55022 Class A Class B ESD EN61000-4-2 Air ±8KV Contact ±6KV Performance Criteria A Radiated immunity EN61000-4-3 10V/m Performance Criteria A Fast transient * EN61000-4-4 ±2KV Performance Criteria A Surge * EN61000-4-5 ±1KV Performance Criteria A Conducted immunity EN61000-4-6 10Vr.m.s Performance Criteria A * An external input filter capacitor is required if the module has to comply with EN 61000-4-4, EN 61000-4-5. The filter capacitor Tracopower suggest: Nippon Chemi-Con KY series, 100μF/100V, ESR = 110mΩ. Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 6 / 60 3W Single & Dual Output Characteristic Curves All test conditions are at 25°C. The figures are identical for TMR 3-1210WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 7 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1210WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 8 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1211WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 9 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1211WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 10 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1209WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 11 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1209WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 12 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1212WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 13 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1212WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 14 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1213WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 15 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1213WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 16 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1221WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 17 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1221WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 18 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1222WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 19 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1222WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 20 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1223WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 21 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-1223WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 22 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2410WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 23 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2410WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 24 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2411WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 25 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2411WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 26 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2409WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 27 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2409WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 28 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2412WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 29 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2412WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 30 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2413WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 31 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2413WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 32 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2421WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 33 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2421WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 34 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2422WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 35 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2422WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 36 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2423WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 37 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-2423WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 38 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4810WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 39 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4810WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 40 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4811WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 41 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4811WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 42 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4809WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 43 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4809WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 44 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4812WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 45 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4812WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 46 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4813WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 47 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4813WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 48 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4821WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 49 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4821WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 50 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4822WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 51 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4822WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 52 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4823WI Efficiency versus Output Current Power Dissipation versus Output Current Efficiency versus Input Voltage. Full Load Derating Output Current versus Ambient Temperature and Airflow Vin = Vin nom Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 53 / 60 3W Single & Dual Output Characteristic Curves (Continued) All test conditions are at 25°C. The figures are identical for TMR 3-4823WI Typical Output Ripple and Noise. Vin = Vin nom, Full Load Transient Response to Dynamic Load Change from 100% to 75% to 100% of Full Load ; Vin = Vin nom Typical Input Start-Up and Output Rise Characteristic Vin = Vin nom, Full Load Using ON/OFF Voltage Start-Up and Vout Rise Characteristic Vin = Vin nom, Full Load Conduction Emission of EN55022 Class A Vin = Vin nom, Full Load Conduction Emission of EN55022 Class B Vin = Vin nom, Full Load Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 54 / 60 3W Single & Dual Output Testing Configurations Input reflected-ripple current measurement test up Component Value Voltage Reference L 2u2H ---- SMD Inductor C 1μF 100V 1210 MLCC Peak-to-peak output ripple & noise measurement test up Output voltage and efficiency measurement test up Note: All measurements are taken at the module terminals. % 100            in in o o V I V I Efficiency Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 55 / 60 3W Single & Dual Output EMI considerations +Vin -Vin +Vout -Vout C1 L1 D/D Converter +INPUT -INPUT LOAD Suggested Schematic to comply with EN55022 Conducted Noise Class A recommended PCB Layout with Input Filter To comply with conducted noise according to EN55022 CLASS A following components are recommended: TMR 3-12xxWI Component Value Voltage Reference C1 4.7μF 25V 1210 MLCC L1 2.2μH ---- SMD Inductor, P/N: TCK-059 TMR 3-24xxWI Component Value Voltage Reference C1 2.2μF 50V 1210 MLCC L1 10μH ---- SMD Inductor, P/N: TCK-047 TMR 3-48xxWI Component Value Voltage Reference C1 2.2μF 100V 1210 MLCC L1 10μH ---- SMD Inductor, P/N: TCK-047 PDL03W SERIES Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 56 / 60 3W Single & Dual Output EMI considerations (Continued) +Vin -Vin +Vout -Vout C1 L1 D/D Converter +INPUT -INPUT LOAD Suggested Schematic to comply with EN55022 Conducted Noise Class B recommended PCB Layout with Input Filter To comply with conducted noise according to EN55022 CLASS B following components are recommended: TMR 3-12xxWI Component Value Voltage Reference C1 10μF 25V 1812 MLCC L1 2.2μH ---- SMD Inductor, P/N: TCK-059 TMR 3-24xxWI Component Value Voltage Reference C1 6.8μF 50V 1812 MLCC L1 18μH ---- SMD Inductor, P/N: TCK-046 TMR 3-48xxWI Component Value Voltage Reference C1 2.2μF 100V 1812 MLCC L1 18μH ---- SMD Inductor, P/N: TCK-046 PDL03W SERIES Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 57 / 60 3W Single & Dual Output Input Source Impedance The power module should be connected to a low impedance input source. Highly inductive source impedance can affect the stability of the power module. Input external L-C filter is recommended to minimize input reflected ripple current. The capacitor must as close as possible to the input terminals of the power module for lower impedance. Thermal Consideration The power module operates in a variety of thermal environments. However, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat is removed by conduction, convection, and radiation to the surrounding Environment. Proper cooling can be verified by measuring the point as the figure below. The temperature at this location should not exceed 100°C. When Operating, adequate cooling must be provided to maintain the test point temperature at or below 100°C. Although the maximum point Temperature of the power modules is 100°C, you can limit this Temperature to a lower value for extremely high reliability. TOP VIEW Remote ON/OFF Control The positive logic remote ON/OFF control circuit is included. Turns the module ON during a logic High on the On/Off pin and turns OFF during a logic Low. The On/Off pin is an open collector/drain logic input signal (Von/off) that referenced to GND. If not using the remote on/off feature, please open circuit between on/off pin and input pin to turn the module on. Recommended external ON/OFF Ctrl circuit and components R1 R2 1K Vcc CONTROL TTL Signal 5K1 ON/OFF PIN RIN ZD1 DC/DC Converter Logic Positive R1(K) R2(K) ZD1 Vcc = 4.5~18Vdc 0 7.5 10V, 5mA Vcc = 9~36Vdc 2.2 16 18V, 5mA Vcc = 18~75Vdc 6.8 33 36V, 5mA Measurement shown in inches and (millimeters) Temperature Measurement Point Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 58 / 60 3W Single & Dual Output Mechanical Data Pin Connection Pin Single Dual 1 -Input (GND) -Input (GND) 2 +Input (Vcc) +Input (Vcc) 3 Remote on/off Remote on/off 5 NC* / No Pin** NC* / No Pin** 6 +Output (+Vout) +Output (+Vout) 7 -Output (-Vout) Com 8 NC -Output (-Vout) Recommended Pad Layout All Dimensions in Inches (mm) Tolerance: X.XX ±0.02 (X.X ±0.5) X.XXX ±0.01 (X.XX ±0.25) Pin Pitch Tolerance: ±0.01 (±0.25) Pin Dimension Tolerance: ±0.004 (±0.1) 0.16 (4.10) 0.44 (11.2) 1 2 3 5 6 7 8 0.100(2.54) 0.86(21.80) FRONT VIEW 0.02(0.50) 0.700(17.78) .0.01(0.25) Rectangular pin 0.08(2.0) 0.36(9.10) 0.13(3.3) BOTTOM VIEW 0.02(0.50) * NC pin for standard. ** No pin for 3KV isolation. (P/N suffix ”H”) Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 59 / 60 3W Single & Dual Output Soldering Considerations Lead free wave solder profile for TMR 3WI SIP type Zone Reference Parameter Preheat zone Rise temp. speed: 3°C/ sec max. Preheat temperature: 100~130°C Actual heating Peak temperature: 250~260°C Peak time (T1+T2 time): 4~6 sec Reference Solder: Sn-Ag-Cu; Sn-Cu Hand Welding: Soldering iron: Power 90W Welding Time: 2~4 sec Temperature: 380~400°C Packaging Information 10 pc’s per TUBE Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: June 7th, 2011 / Rev.: 1.1 / Page 60 / 60 3W Single & Dual Output Order Code Note 1: Maximum value at nominal input voltage and full load of standard type. Note 2: Typical value at nominal input voltage and full load. Model Output Current Input Current Number Input Range Output Voltage Full Load Full Load(1) Eff (2) (%) TMR 3-1210WI 4.5 – 18Vdc 3.3Vdc 700mA 285mA 74 TMR 3-1211WI 4.5– 18Vdc 5.0Vdc 600mA 338mA 78 TMR 3-1209WI 4.5– 18Vdc 9.0Vdc 333mA 333mA 79 TMR 3-1212WI 4.5– 18Vdc 12.0Vdc 250mA 329mA 80 TMR 3-1213WI 4.5– 18Vdc 15.0Vdc 200mA 329mA 80 TMR 3-1221WI 4.5– 18Vdc ±5.0Vdc ±300mA 329mA 80 TMR 3-1222WI 4.5– 18Vdc ±12.0Vdc ±125mA 329mA 80 TMR 3-1223WI 4.5– 18Vdc ±15.0Vdc ±100mA 329mA 80 TMR 3-2410WI 9– 36Vdc 3.3Vdc 700mA 140mA 75 TMR 3-2411WI 9 – 36Vdc 5.0Vdc 600mA 165mA 80 TMR 3-2409WI 9 – 36Vdc 9.0Vdc 333mA 165mA 80 TMR 3-2412WI 9 – 36Vdc 12.0Vdc 250mA 160mA 82 TMR 3-2413WI 9 – 36Vdc 15.0Vdc 200mA 160mA 82 TMR 3-2421WI 9 – 36Vdc ±5.0Vdc ±300mA 167mA 79 TMR 3-2422WI 9 – 36Vdc ±12.0Vdc ±125mA 162mA 81 TMR 3-2423WI 9 – 36Vdc ±15.0Vdc ±100mA 162mA 81 TMR 3-4810WI 18 – 75Vdc 3.3Vdc 700mA 71mA 74 TMR 3-4811WI 18 – 75Vdc 5.0Vdc 600mA 82mA 80 TMR 3-4809WI 18 – 75Vdc 9.0Vdc 333mA 82mA 80 TMR 3-4812WI 18 – 75Vdc 12.0Vdc 250mA 81mA 81 TMR 3-4813WI 18 – 75Vdc 15.0Vdc 200mA 81mA 81 TMR 3-4821WI 18 – 75Vdc ±5.0Vdc ±300mA 84mA 79 TMR 3-4822WI 18 – 75Vdc ±12.0Vdc ±125mA 81mA 81 TMR 3-4823WI 18 – 75Vdc ±15.0Vdc ±100mA 81mA 81 Safety and Installation Instruction Fusing Consideration Caution: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of sophisticated power architecture. To maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a slow-blow fuse with maximum rating of 1.6A for TMR 3-12xxWI modules, 1A for TMR 3-24xxWI and TMR 3-48xxWI modules. Based on the information provided in this data sheet on Inrush energy and maximum dc input current; the same type of fuse with lower rating can be used. Refer to the fuse manufacturer’s data for further information. MTBF and Reliability The MTBF of TMR 3WI-SERIES of DC/DC converters has been calculated using Bellcore TR-NWT-000332 Case I: 50% stress, operating temperature at 40°C (Ground fixed and controlled environment). The resulting figure for MTBF is 3’963’000 hours. MIL-HDBK 217F NOTICE2 FULL LOAD, operating temperature at 25°C. The resulting figure for MTBF is 1’707’000 hours. Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 1 / 23 Features • SIP package: 21.8 x 9.2 x 11.1 mm (0.86 x 0.36 x 0.44inch) • 2:1 wide input voltage of 4.5-9, 9-18,18-36 and 36-75VDC • 2 Watts output power • Low ripple & noise • UL94-V0 case potting materials • Input to output isolation: 1000Vdc, for 1 minute • Operating temperature range: up to 75°C max without derating • Continuous short circuit protection • RoHS directive compliant • External on/off control • ISO 9001 certified manufacturing facilities • UL60950-1 Recognized E188913 Applications • test equipment • Communication equipment • Computer equipment • mobile telecom equipment TMR 2 Series Application Note DC/DC Converter 4.5 to 9Vdc, 9 to 18Vdc, 18 to 36Vdc or 36 to 75 Vdc Input 3.3 to 15Vdc Single Outputs and ±5 to ±15Vdc Dual Outputs, 2 Watt E188913 Complete TMR-2 datasheet can be downloaded at: http://www.tracopower.com/products/tmr.pdf General Description The TMR 2 series offer 2 watts of output power from a 21.8 x 9.2 x 11.1 mm package up to an operating temperature of +75°C without derating and without need of any external components. This product has a 2:1 wide input voltage range of 4.5-9Vdc, 9-18Vdc, 18-36Vdc or 36-75Vdc and features an input to output isolation of 1000Vdc, indefinite short-circuit protection. All models are particularly suited to telecommunications, industrial, mobile telecom and test equipment applications. Table of contents Block Diagram P2 EMC consideration P8 Absolute maximum rating P2 Input Source Impedance P8 Output Specifications P2 & P3 Characteristic curve P9 - P20 Input Specifications P3 & P4 Thermal Consideration P21 General Specifications P5 Part number structure P21 Remote on/off control P6 EMC Specifications P21 & P22 Output over current protection P6 Mechanical data P22 Short circuitry protection P6 Safety and installation instruction P23 Solder, clearing, and drying considerations P7 MTBF and Reliability P23 Test configurations P7 & P8 Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 2 / 23 2W, Single and Dual Output Block Diagram Absolute Maximum Rating Parameter Device Min Typ Max Unit Continuous TMR 05xx TMR 12xx TMR 24xx TMR 48xx 9 18 36 75 Vdc Vdc Vdc Vdc Input Voltage Transient (100ms) TMR 05xx TMR 12xx TMR 24xx TMR 48xx 15 36 50 100 Vdc Vdc Vdc Vdc Output power 2 W Temperature coefficient ±0.1 %/°C Output Specifications Parameter Device Min Typ Max Unit Operating Output Range TMR xx10 TMR xx11 TMR xx09 TMR xx12 TMR xx13 TMR xx21 TMR xx22 TMR xx23 3.267 4.950 8.910 11.880 14.850 ±4.950 ±11.880 ±14.850 3.300 5.000 9.000 12.000 15.000 ±5.000 ±12.000 ±15.000 3.333 5.050 9.090 12.120 15.150 ±5.050 ±12.120 ±15.150 Vdc Vdc Vdc Vdc Vdc Vdc Vdc Vdc Output Current TMR xx10 TMR xx11 TMR xx09 TMR xx12 TMR xx13 TMR xx21 TMR xx22 TMR xx23 50 40 22 17 13 ±20 ±8 ±7 500 400 222 167 134 ±200 ±83 ±67 mA mA mA mA mA mA mA mA Max. Output Capacitive Load TMR xx10 TMR xx11 TMR xx09 TMR xx12 TMR xx13 TMR xx21 TMR xx22 TMR xx23 2200 1000 470 170 110 ±470 ±100 ±47 μF μF μF μF μF μF μF μF Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 3 / 23 2W, Single and Dual Output Output Specifications (continue) Parameter Device Min Typ Max Unit Line Regulation (LL to HL at Full Load) All 0.5 % Load Regulation (10% to 100% of Full Load) TMR xx10 Other single output Dual output ±0.85 ±0.75 ±1.00 % Cross regulation (Asymmetrical load 25% to 100% of Full Load) ±5.0 Output Ripple & Noise (20MHz bandwidth) All 50 mV pk-pk Transient Response Recovery Time (25% load step change) All 500 μS Input Specifications Parameter Device Min Typ Max Unit Input Voltage Continuous TMR 05xx TMR 12xx TMR 24xx TMR 48xx 4.5 9 18 36 5.0 12.0 24.0 48.0 9 18 36 75 Vdc Vdc Vdc Vdc Input Current (Maximum Value at Vin = Vin nom; Full Load) TMR 0510 TMR 0511 TMR 0509 TMR 0512 TMR 0513 TMR 0521 TMR 0522 TMR 0523 TMR 1210 TMR 1211 TMR 1209 TMR 1212 TMR 1213 TMR 1221 TMR 1222 TMR 1223 TMR 2410 TMR 2411 TMR 2409 TMR 2412 TMR 2413 TMR 2421 TMR 2422 TMR 2423 TMR 4810 TMR 4811 TMR 4809 TMR 4812 TMR 4813 TMR 4821 TMR 4822 TMR 4823 540 615 596 588 582 645 595 598 202 234 222 219 220 242 224 226 102 115 109 109 108 117 112 110 52 60 56 55 55 62 57 57 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 4 / 23 2W, Single and Dual Output Input Specifications (continue) Parameter Device Min Typ Max Unit Input Standby Current (Typical Value at Vin = Vin nom; No Load) TMR 0510 TMR 0511 TMR 0509 TMR 0512 TMR 0513 TMR 0521 TMR 0522 TMR 0523 TMR 1210 TMR 1211 TMR 1209 TMR 1212 TMR 1213 TMR 1221 TMR 1222 TMR 1223 TMR 2410 TMR 2411 TMR 2409 TMR 2412 TMR 2413 TMR 2421 TMR 2422 TMR 2423 TMR 4810 TMR 4811 TMR 4809 TMR 4812 TMR 4813 TMR 4821 TMR 4822 TMR 4823 60 55 55 75 40 75 75 90 20 25 25 30 30 50 40 40 10 10 15 15 15 15 20 20 10 10 10 10 10 10 10 12 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 5V input (100μF) 12V input (100μF) 24V input (10μF) Input reflected ripple current (It will not damage the device if the capacitor on the input is not equipped) 48V input (10μF) 400 150 380 170 mA pk-pk mA pk-pk mA pk-pk mA pk-pk Start up time Power up (nominal Vin and constant resistive load power up) Remote ON/OFF 1 1 mS mS Remote ON/OFF Control (See Page 13) DC-DC ON DC-DC OFF All 4 Open 8 mA Remote Off Input Current All 2.5 mA Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 5 / 23 2W, Single and Dual Output General Specifications Parameter Device Min Typ Max Unit Efficiency at Vin nom and full load (Please see the testing configurations part) TMR 0510 TMR 0511 TMR 0509 TMR 0512 TMR 0513 TMR 0521 TMR 0522 TMR 0523 TMR 1210 TMR 1211 TMR 1209 TMR 1212 TMR 1213 TMR 1221 TMR 1222 TMR 1223 TMR 2410 TMR 2411 TMR 2409 TMR 2412 TMR 2413 TMR 2421 TMR 2422 TMR 2423 TMR 4810 TMR 4811 TMR 4809 TMR 4812 TMR 4813 TMR 4821 TMR 4822 TMR 4823 65 69 71 72 73 66 71 71 72 75 79 80 80 73 78 78 71 76 80 80 81 75 78 80 70 74 78 80 79 75 77 77 % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % Isolation resistance All 109 Ω Isolation Capacitance All 300 1000 pF Switching Frequency (full load to minimum load) All 100 650 KHz Weight All 4.8 g MTBF (please see the MTBF and reliability part) All 5.107×106 hours Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 6 / 23 2W, Single and Dual Output Vout Pi (Input Power) Iocp Remote On/Off Control Only one type of remote on/off control is available for TMR. The module will turn on during the ctrl pin left open or high impedance between ctrl pin and -Vin pin. The module will turn off if the control pin is applied with a current of 4~8mA. In off condition the input current is app. 1mA max. Positive Logic: Negative Logic: Output over current protection When excessive output currents occur in the system, circuit protection is required on all converters. Normally, overload current is maintained at approximately 115~175% percent of rated current. The TMR converters have a fold-back over current protection. Fold back current protection reduces the load current during over current condition. The figure below shows a typical curve. Since the over current protection is a fold-back characteristic the highest power dissipation occurs at point S. During start-up this product provides less output current, hence the output rises slower, or the power supply may not start up at all if the load current during start up is larger than the fold back current. Short Circuitry Protection Continuous, hiccup and auto-recovery mode. During short circuit, converter will shut down and will switch on again to detect if the short circuit is still present or not. The average current during this condition will be very low and the device will be safe in short circuit condition. Due to that is the TMR converters indefinite short circuit protected. ● ● +Input -Input 6mA current Source Ctrl 1KΩ DC-DC OFF +Input -Input 6mA current Source Ctrl 1KΩ DC-DC ON S (Iout, max, Pi, max) Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 7 / 23 2W, Single and Dual Output Solder, clearing, and drying considerations Soldering Flow (wave) soldering: 250°C ±10°C less than10 seconds (see below) Soldering iron: 370°C ±10°C less than 5 seconds Note: the pin of this product is Tin coated. To assure the solder-ability, modules should be kept in their original shipping containers to provide adequate protection. Also, the storage environment shall be well controlled to protect any oxidation. Cleaning process In aqueous cleaning, it is preferred to have an in-line cleaner system consisting of several cleaning stages (pre-wash, wash, rinse, final rinse, and drying). Deionize (DI) water is recommend for aqueous cleaning; the minimum resistive level is 1MΩ-cm. Tap-water quality varies per region in terms of hardness, chloride, and solid contents; therefore, the use of tap water is not recommended for aqueous cleaning. Drying The drying section of the cleaner system should be equipped with blowers capable of generating 1000cfm -1500cfm of air so that the amount of rinse water left to be dried off with heat is minimal. Handheld air guns are not recommended due the variability and consistency of the operation. Note: after post-wash, the marking (date code) of converter may fall off. These only impacts the appearance and do not affect the operation of the module. Testing Configurations Input reflected-ripple current measurement test up TMR 05xx and TMR 12xx Component Value Voltage Reference C 100μF 50V Aluminium Electrolytic Capacitor TMR 24xx and TMR 48xx Component Value Voltage Reference C 10μF 100V Aluminium Electrolytic Capacitor Peak-to-peak output ripple & noise measurement test up Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 8 / 23 2W, Single and Dual Output Testing Configurations (continue) Output voltage and efficiency measurement test up Note: All measurements are taken at the module terminals. % 100 ×        × × = in in o o V I V I Efficiency EMC considerations Suggested Schematic for EN55022 Conducted Emission Class B Limits To comply with EN55022 CLASS B conducted emissions the following components are recommended: TMR 05xx and TMR 12xx Component Value Voltage Reference C1 22 μF 25V 1812 MLCC Capacitor L1 3.3 μH 2.0A / 0.06Ω / 0504 SMD Inductor, P/N: TCK-044 TMR 24xx Component Value Voltage Reference C1 4.7 μF 50V 1812 MLCC Capacitor L1 12 μH 1.4A / 0.12Ω / 0504 SMD Inductor, P/N: TCK-062 TMR 48xx Component Value Voltage Reference C1 2.2 μF 100V 1812 MLCC Capacitor L1 27 μH 0.9A / 0.2Ω / 0504 SMD Inductor, P/N: TCK-063 Input Source Impedance The power module should be connected to a low impedance input source. Highly inductive source impedance can affect the stability of the power module. Input external L-C filter is recommended to minimize input reflected ripple current. The capacitor should be equipped as close as possible to the input terminals of the power module for lower impedance. +Vin -Vin +Vout -Vout C1 L1 D/D Converter +INPUT -INPUT LOAD Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 9 / 23 2W, Single and Dual Output Characteristic Curve Efficiency a. Efficiency with load change under different line condition at room temperature TMR 0510 15.00 25.00 35.00 45.00 55.00 65.00 75.00 50 100 150 200 250 300 350 400 450 500 lout (mA ) Efficiency (%) TMR 1213 25.00 35.00 45.00 55.00 65.00 75.00 85.00 13 27 40 54 67 80 94 107 121 134 lout (mA ) Efficiency (%) TMR 4810 20.00 30.00 40.00 50.00 60.00 70.00 80.00 50 100 150 200 250 300 350 400 450 500 lout (mA ) Efficiency (%) 9V 12V 18V 4.5V 5V 9V 36V 48V 75V Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 10 / 23 2W, Single and Dual Output TMR 1221 15.00 25.00 35.00 45.00 55.00 65.00 75.00 20 40 60 80 100 120 140 160 180 200 lout (mA ) Efficiency (%) TMR 2422 25.00 35.00 45.00 55.00 65.00 75.00 85.00 8 17 25 33 42 50 58 66 75 83 lout (mA ) Efficiency (%) TMR 4823 20.00 30.00 40.00 50.00 60.00 70.00 80.00 7 13 20 27 34 40 47 54 60 67 lout (mA ) Efficiency (%) 9V 12V 18V 18V 24V 36V 36V 48V 75V Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 11 / 23 2W, Single and Dual Output b. Efficiency at input voltage change under different load condition at room temperature TMR 0510 15.00 25.00 35.00 45.00 55.00 65.00 75.00 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 Vin (V) Efficiency (%) TMR 1213 25.00 35.00 45.00 55.00 65.00 75.00 85.00 9 10 11 12 13 14 15 16 17 18 Vin (V) Efficiency (%) TMR 4810 20.00 30.00 40.00 50.00 60.00 70.00 80.00 36V 40V 44V 48V 52V 56V 60V 64V 68V 75V Vin(V) Eff(%) 500mA 250mA 50mA 134mA 67mA 13mA 500mA 250mA 50mA Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 12 / 23 2W, Single and Dual Output TMR 1221 15.00 25.00 35.00 45.00 55.00 65.00 75.00 85.00 9 10 11 12 13 14 15 16 17 18 Vin (V) Efficiency (%) TMR 2422 25.00 35.00 45.00 55.00 65.00 75.00 85.00 18 20 22 24 26 28 30 32 34 36 Vin (V) Efficiency (%) TMR 4823 20.00 30.00 40.00 50.00 60.00 70.00 80.00 90.00 36 40 44 48 52 56 60 64 68 75 Vin (V) Efficiency (%) 200mA 100mA 20mA 83mA 42mA 8mA 67mA 34mA 7mA Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 13 / 23 2W, Single and Dual Output Power dissipation curve TMR 0510 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0.900 1.000 50 100 150 200 250 300 350 400 450 500 lout (mA ) Pd (W) TMR 1213 0.200 0.300 0.400 0.500 0.600 13 27 40 54 67 80 94 107 121 134 lout (mA ) Pd (W) TMR 4810 0.200 0.300 0.400 0.500 0.600 0.700 0.800 50 100 150 200 250 300 350 400 450 500 lout (mA ) Pd (W) 9V 5V 4.5V 18V 12V 9V 75V 48V 36V Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 14 / 23 2W, Single and Dual Output TMR 1221 0.300 0.400 0.500 0.600 0.700 0.800 0.900 20 40 60 80 100 120 140 160 180 200 lout (mA ) Pd (W) TMR 2422 0.100 0.200 0.300 0.400 0.500 0.600 0.700 8 17 25 33 42 50 58 66 75 83 lout (mA ) Pd (W) TMR 4823 0.200 0.300 0.400 0.500 0.600 0.700 0.800 7 13 20 27 34 40 47 54 60 67 lout (mA ) Pd (W) 75V 48V 36V 36V 24V 18V 18V 12V 9V Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 15 / 23 2W, Single and Dual Output Output ripple & noise TMR 0510 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Output Ripple & Noise = 26.8mV Output Ripple & Noise = 20.8mV Output Ripple & Noise = 14.8mV TMR 1213 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Output Ripple & Noise = 25.2mV Output Ripple & Noise = 14.0mV Output Ripple & Noise = 11.6mV TMR 4810 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Output Ripple & Noise = 20.0mV Output Ripple & Noise = 13.6mV Output Ripple & Noise = 10.8mV Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 16 / 23 2W, Single and Dual Output TMR 1221 Vin min, Full Load Vin nom, Full Load Vin max, Full Load +Vout = 18.8mV / – Vout = 14.4mV + Vout = 17.6mV / –Vout = 14.0mV + Vout = 17.6mV / – Vout = 15.2mV TMR 2422 Vin min, Full Load Vin nom, Full Load Vin max, Full Load + Vout = 30.8mV / – Vout = 19.2mV + Vout = 25.6mV / – Vout = 18.0mV + Vout = 18.4mV / – Vout = 12.8mV TMR 4823 Vin min, Full Load Vin nom, Full Load Vin max, Full Load + Vout = 26.8mV / – Vout = 24.4mV + Vout = 14.8mV / – Vout = 14.0mV + Vout = 12.8mV / – Vout = 10.4mV Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 17 / 23 2W, Single and Dual Output Transient Peak and Response TMR 0510 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Transient Peak 85.0mV Transient Peak 81.0mV Transient Peak 75.0mV Transient Response 332.0μS Transient Response 328.0μS Transient Response 316.0μS TMR 1213 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Transient Peak 123.0mV Transient Peak 102.0mV Transient Peak 88.0mV Transient Response 488μS Transient Response 488μS Transient Response 488μS TMR 4810 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Transient Peak 79.0mV Transient Peak 68.0mV Transient Peak 63.0mV Transient Response 316μS Transient Response 316μS Transient Response 316μS Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 18 / 23 2W, Single and Dual Output TMR 1221 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Transient Peak 270mV Transient Peak 246mV Transient Peak 240mV Transient Response 496μS Transient Response 480μS Transient Response 472μS TMR 2422 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Transient Peak 152mV Transient Peak 133mV Transient Peak 124mV Transient Response 320μS Transient Response 328μS Transient Response 320μS TMR 4823 Vin min, Full Load Vin nom, Full Load Vin max, Full Load Transient Peak 119mV Transient Peak 100mV Transient Peak 93mV Transient Response 400μS Transient Response 384μS Transient Response 392μS Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 19 / 23 2W, Single and Dual Output Start-up Time and Rise Time TMR 0510 Vin nom, Full Load Vin nom, Full Load Rise Time = 247.6μS Start-up Time = 408.0μS TMR 1213 Vin nom, Full Load Vin nom, Full Load Rise Time = 530.3μS Start-up Time = 640.0μS TMR 4810 Vin nom, Full Load Vin nom, Full Load Rise Time = 176.3μS Start-up Time = 240.0μS Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 20 / 23 2W, Single and Dual Output TMR 1221 Vin nom, Full Load Vin nom, Full Load Rise Time = 297.2μS Start-up Time = 640.0μS TMR 2422 Vin nom, Full Load Vin nom, Full Load Rise Time = 324.8uS Start-up Time = 432.0uS TMR 4823 Vin nom, Full Load Vin nom, Full Load Rise Time=1.056mS Start-up Time= 1.180mS Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 21 / 23 2W, Single and Dual Output Thermal Consideration The power module operates in a variety of thermal environments. However, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat is removed by conduction, convection, and radiation to the surrounding Environment. Proper cooling can be verified by measuring the point as shown in the figure below. The temperature at this location should not exceed 100°C. During performance, adequate cooling must be provided to maintain the test point temperature at or below 100°C. Although the maximum point Temperature of the power modules is 100°C, you can limit the case temperature to a lower value for high reliability. TOP VIEW Part Number Structure TMR 4812 EMC Specifications Contact discharge Air discharge level test voltage (KV) level test voltage (KV) 1 ±2 1 ±2 2 ±4 2 ±4 3 ±6 3 ±8 EN61000-4-2 ESD (performance criteria B) 4 ±8 4 ±15 level test field strength (V/m) 1 1 2 3 EN61000-4-3 RS (performance criteria B) 3 10 Input Voltage Range: 05xx : 4.5~9V 12xx : 9~18V 24xx : 18~36V 48xx : 36~75V Output Voltage 10 : 3.3V 11 : 5V 09 : 9V 12 : 12V 13 : 15V 21 : ±5V 22 : ±12V 23 : ±15V TEMPERATURE MEASURE POINT Measurement shown in inches and (millimeters) Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 22 / 23 2W, Single and Dual Output EMC Specifications (continue) open circuit output test voltage ±10% level power line 1 ±0.5KV 2 ±1.0KV 3 ±2.0KV EN61000-4-4 EFT (performance criteria B) 4 ±4.0KV level open circuit output test voltage ±10% 1 ±0.5KV 2 ±1.0KV 3 ±2.0KV EN61000-4-5 Surge (performance criteria B) 4 ±4.0KV level voltage level(EMF) 1 1V/rms 2 3V/rms EN61000-4-6 CS (performance criteria B) 3 10V/rms Mechanical Data .0.01 (0.32) Rectangular pin 0.08 (2.01)±0.5 0.36 0.13 (3.20) BOTTOMVIEW All Dimensions in Inches (mm) Tolerance: X.XX ±0.02 (X.X ±0.5) X.XXX ±0.01(X.XX ±0.25) Pin Pitch Tolerance ±0.02(0.5) 0.16 (4.10)±0.5 0.02 (0.50)±0.05 0.44 1 2 3 5 6 7 8 0.10(2.54) 0.86(21.80) FRONT VIEW 0.02 (0.50) 0.70(17.78) PIN CONNECTION PIN SINGLE 1 - INPUT 2 + INPUT 3 CTRL 5 NC 6 + OUTPUT 7 - OUTPUT 8 NC DUAL OUTPUT - INPUT + INPUT CTRL NC + OUTPUT COM -OUTPUT Application Note Created by Traco Electronic AG Arp. www.tracopower.com Date: October 9th, 2007 / Rev.: 1.4 / Page 23 / 23 2W, Single and Dual Output Safety and Installation Instruction Isolation consideration The TMR series features 1.0k Volt DC isolation for 60 seconds from input to output, input to case, and output to case. The input to output resistance is greater than 109 ohms. Nevertheless, if the system using the TMR converter needs to get safety agency approval, certain rules must be followed in the design of the system. In particular, all of the creepage and clearance requirements of the end-use safety requirement must be observed. These documents include UL60950-1, EN60950-1 and CSA 22.2-60950, although specific applications may have other or additional requirements. Fusing Consideration Caution: The TMR converter is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a slow-blow fuse with maximum rating of 6.3 A. Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with lower rating can be used. Minimum Load Requirement 25% (of full load) minimum load required to maintain a stable output voltage and to comply with the published specifications. The TMR Series is not getting damaged at no load or low load conditions but at loads below 25% a proper and accurate regulation of the output voltage cannot be ensured. The output voltage drops by app. 10%. MTBF and Reliability The MTBF of TMR series has been calculated according to: 1. MIL-HDBK-217F under the following conditions: Nominal Input Voltage and GB Iout = Iout max TA = +25°C The resulting figure for MTBF is 2.399× 106 hours. 2. Bell-core TR-NWT-000332 Case I: 50% stress, Operating Temperature at 40 ℃ (Ground fixed and controlled environment) The resulting figure for MTBF is 5.107× 106 hours. http://www.tracopower.com Page 1 of 13 Industrial Power Supplies TIS Series, 50–600 Watt Features ◆ Switch mode power supplies for DIN-rail mount ◆ 6 power ranges with 2, 3, 6, 12, 20 and 24 A output current (24 VDC models) ◆ Selectable 115/230 VAC input ◆ Very low ripple and noise ◆ EMI complies with EN 61000-6-3 and EN 61000-6-4 ◆ Operating temp. range –25°C to +70°C ◆ For system operation available with built-in functions: RED: Redundancy module for N+1 Systems with true current sharing SIG: Signal module with AC-powerfail, power good signal and external On/Off control UDS: DC-UPS module for uninterruptable battery backed-up power systems ◆ Worldwide safety approvals incl. class I, div. 2 location ◆ Easy snap-on mount on DIN-rails or chassis mount ◆ 3-year product warranty The switching power supplies of the TIS series have been particularly designed for applications in industrial process control systems and with machine tools. Excellent specifications and high immunity against electrical disturbances guarantee reliable power for sensitive loads in rugged industrial environments. With the help of optional function modules specific requirements for system applications can be easily realized with a standard model. With the UDS module the power supplies can be extended to a perfect DC-UPS with automatic battery- backup. This function is very often required in applications where a time delayed shutdown of a system is necessary. To monitor and control the power supply a signal module can be installed. For parallel operation with active power sharing a redundancy option is available. This flexibility makes the TIS series power supplies a cost effective solution for many industrial applications. Order Code Input Voltage Output Power Output Voltage Output Current (includes terminal plugs) nom. max. nom. max. TIS 50-112 115–240 VAC 50 W 12 VDC 3.5 A TIS 50-124 universal input 24 VDC 2.0 A TIS 75-112 115/230 VAC 12 VDC 6.0 A TIS 75-124 selectable 75 W 24 VDC 3.0 A TIS 75-148 48 VDC 1.5 A TIS 150-124 115/230 VAC 150 W 24 VDC 6.0 A TIS 150-148 selectable 48 VDC 3.0 A TIS 300-124 115/230 VAC 24 VDC 12.0 A TIS 300-148 selectable 300 W 48 VDC 6.0 A TIS 300-172 72 VDC 4.2 A TIS 500-124-115 115 VAC 500 W 24 VDC 20.0 A TIS 500-124-230 230 VAC 500 W 24 VDC 20.0 A TIS 600-124 24 VDC 24.0 A TIS 600-148 115/230 VAC 600 W 48 VDC 12.0 A TIS 600-172 selectable 72 VDC 8.5 A Models CB Scheme (LVD) UL 60950-1 UL 508 UL 1604 http://www.tracopower.com Page 2 of 13 Industrial Power Supplies TIS Series 50–600 Watt Input Specifications Input voltage range TIS 50: 93 – 264 VAC TIS 75, 150, 300, 600: 93 – 132 VAC / 187 – 264 VAC TIS 500-124-230. 187 – 264 VAC TIS 500-124-115: 93 – 132 VAC Input frequency 47 – 63 Hz Input current at full load (typ.) at 115 VAC at 230 VAC TIS 50: 0.85 A 0.50 A TIS 75: 1.3 A 0.75 A TIS 150: 2.7 A 1.6 A TIS 300: 4.9 A 2.9 A TIS 500: 6.0 A 4.3 A TIS 600: 7.0 A 5.0 A Recommended circuit breaker, TIS 50: 5.0 A characteristic C TIS 75: 5.0 A or fuse, slow blow typ TIS 150: 10.0 A TIS 300: 15.0 A TIS 500: 15.0 A TIS 600: 20.0 A Output Specifications Output voltage adj. range 12 VDC models: 12 – 14 VDC 24 VDC models: 24 – 28 VDC 48 VDC models: 48 – 52 VDC 72 VDC models: 60 – 76 VDC Regulation – Input variation 0.2 % – Load variation (10–90%) TIS 50, TIS 75, TIS 150: 1.0 % TIS 300, TIS 500, TIS 600: 0.3 % (2.0 % in parallel operation) Ripple and noise (20MHz bandwidth) <50 mV pk-pk Electronic short circuit protection current limitation at 110 % typ. (constant current, automatic restart) Over voltage protection, trigger point at 140 % typ. Vout nom. Hold-up time 115 VAC 230 VAC TIS 50 ... TIS 300: min. 25 ms min. 30 ms TIS 500: min. 20 ms min. 40 ms TIS 600: min. 15 ms min. 25 ms http://www.tracopower.com Page 3 of 13 General Specifications Temperature ranges – Operating (ambient temp.) –25°C to +70°C – Derating above 50°C (122°F) 2 %/K – Storage (non operating) –25°C to +85°C Humidity (non condensing) 95 % rel. H max. Pollution degree 2 Temperature coefficient 0.02 %/K Switching frequency 80 kHz typ. (pulse width modulation) Efficiency TIS 50 ... TIS 300: 85 % typ. TIS 500: 90 % typ. TIS 600: 90 % typ. Isolation according to IEC/EN 60950, UL 60950, UL 508 Reliability, calculated MTBF TIS 50/75: 450’000 h / 420’000 h (MIL-HDBK-217F, at +25°C, ground benign) TIS 150/300: 420’000 h / 360’000 h TIS 500/600: 340’000 h / 300’000 h Safety standards IEC/EN 60950-1 (SELV, except 72 VDC models) UL/cUL 60950-1, UL 508, UL/cUL 1604 Safety approvals – CB report for IEC 60950 www.tracopower.com/products/tis-cb.pdf – UL approvals UL/cUL 60950, File e181381 UL/cUL 508, File e210002 UL/cUL 1604, File e213613 not for TIS 50 & 500 (Class I, Div. 2, Groups A, B, C and D hazardous locations) www.ul.com -> certifications – CSA certificate (UL 60950-1, CSA 60950-1) www.tracopower.com/products/tis-csa.pdf Electromagnetic compatibility (EMC), Emissions EN 61000-6-3 / EN 61000-6-4 – Conducted RI suppression on input EN 55011 class B, EN 55022 class B, FCC part 15, level B – Radiated RI suppression EN 55011 class A, EN 55022 class A, FCC part 15, level A Electromagnetic compatibility (EMC), Immunity EN 61000-6-2 – Electrostatic discharge (ESD) IEC/EN 61000-4-2 4 kV/8 kV – Radiated RF field immunity IEC/EN 61000-4-3 10 V/m – Electrical fast transient / burst immunity IEC/EN 61000-4-4 2 kV – Surge immunity IEC/EN 61000-4-5 2 kV/4 kV – Immunity to conducted RF disturbances IEC/EN 61000-4-6 10 V – Power frequency field immunity IEC/EN 61000-4-8 30 A/m Safety class degree of electrical protection 1 (IEC 536) Case protection IP 20 (IEC 529) Environment – Vibration IEC 60068-2-6; 1 gn, 200 sweeps, each axis – Shock IEC 60068-2-27; 15 gn, 11 ms, each axis Enclosure material aluminium (chassis) / zinc plated steel (cover) Mounting (snap-on with self locking spring) for 35 mm DIN-rails as per EN 50022 Connection detachable screw terminal block (plugs included) (TIS 600: fixed screw terminal block) Industrial Power Supplies TIS Series 50–600 Watt Instruction manual can be downloaded under: www.tracopower.com/products/tis-manual.pdf All specifications valid at nominal input voltage, full load and +25 °C after warm-up time unless otherwise stated. http://www.tracopower.com Page 4 of 13 Power Supplies with Redundancy Function With this option a parallel operation of up to 5 units is possible. Decoupling diodes and current share lines allow to build true N +1 redundant systems with active current sharing for all units. This function also includes an alarm relay to signal a single unit failure. This option is available for TIS 150 W, TIS 300 W and TIS 600 W models. Please note: This option cannot be combined with other options. Industrial Power Supplies TIS Series 50–600 Watt Order Code Input Voltage Output Power Output Voltage Output Current (includes terminal plugs) max. nom. max. TIS 150-124 RED 115/230 VAC 150 W 24 VDC 6.0 A TIS 150-148 RED selectable 48 VDC 3.0 A TIS 300-124 RED 115/230 VAC 300 W 24 VDC 12 A TIS 300-148 RED selectable 48 VDC 6.0 A TIS 600-124 RED 115/230 VAC 600 W 24 VDC 24 A TIS 600-148 RED selectable 48 VDC 12 A Models I-Sense Regulator L Con1 Pin3 N 115/230VAC Con1 Pin1 AC Con1 Pin2 DC Common Unit OK Unit OK Con3 - Pin1 Bus Indicator Con2 - Pin1/2 Con2 - Pin3/4 V-Sense +Vout Current Shareline Unit OK Con3 - Pin4 Con3 - Pin3 Con3 - Pin2 -Vout 24/48VDC Specifications Rating per relay contact 60 VDC /0.36 A max. Instruction manual for RED option can be downloaded under: http://www.tracopower.com/products/tis-red_manual.pdf http://www.tracopower.com Page 5 of 13 Power Supplies with Powerfail Functions These models provide 3 functions required in many process control system applications: ◆ AC-Powerfail signal (relay contact) ◆ Power Good signal (relay contact) ◆ Remote On/Off Industrial Power Supplies TIS Series 50–600 Watt Order Code Input Voltage Output Power Output Voltage Output Current (includes terminal plugs) max. nom. max. TIS 150-124 SIG 115/230 VAC 150 W 24 VDC 6.0 A TIS 150-148 SIG selectable 48 VDC 3.0 A TIS 300-124 SIG 115/230 VAC 300 W 24 VDC 12 A TIS 300-148 SIG selectable 48 VDC 6.0 A TIS 600-124 SIG 115/230 VAC 600 W 24 VDC 24 A TIS 600-148 SIG selectable 48 VDC 12 A Models Remote ON/OFF L 115/230VAC Con1 Pin1 N Con1 Pin2 Con1 Pin3 AC DC Mains Fail Detection Mains OK Remote ON/OFF +Vout Con2 - Pin3/4 -Vout 24/48VDC Common AC-Powerfail Con3 - Pin2 Con3 - Pin7 Con3 - Pin6 Con2 - Pin1/2 Output OK Power Good Detection Power Good Common Power Good Power Good Con3 - Pin5 Con3 - Pin4 Con3 - Pin3 + - Con3 - Pin1 (Relay A) (Relay B) Specifications Power Good signal trigger point models with 24 Vout: >22.8 VDC ±0.5 V relay B closed (pin 4 – pin 3) models with 48 Vout: >45.6 VDC ±1.0 V relay B closed (pin 4 – pin 3) AC-Powerfail signal Vin <93 resp. <187 VAC relay A closed (pin 7 – pin 6) Raiting per relay contact 60 VDC /0.36 A max. Remote On/Off – On short circuit con 3 pin 1 and pin 2 – Off open circuit con 3 pin 1 and pin 2 Instruction manual for SIG option can be downloaded under: http://www.tracopower.com/products/tis-sig_manual.pdf http://www.tracopower.com Page 6 of 13 DC-UPS-System Industrial Power Supplies TIS Series 50–600 Watt In addition to the standard power supply function, these models include a professional battery management system to charge and monitor an external battery. In the event of a power failure the battery is switched automatically and without any interruption to the DC output. Once mains power is available again, the battery is switched off. The backup time is limited only by battery capacity and load. Charge current and voltage can be adjusted to values as required by battery type. Power fail and low battery alarm signals are available via two independent relay contacts. During normal operation the battery status is monitored by periodically loading the battery for a short time. If a cell resistance is high, there is a relay alarm is available. The battery is fully protected under any operational conditions. The power supply is short circuit protected even in battery backup operation but, for safety reasons, the battery should be fitted with a fast blow fuse. Battery mode can be activated by interconnecting pin 7 and 8. Complete external battery packs (3.2 Ah or 7 Ah standard) with lead batteries and circuit breaker are available (see page 8). Order Code 1) Input Voltage Output Power Output Voltage Output Current 2) max. nom. max. TIS 300-124 UDS 115/230 VAC 300 W 24 VDC 12 A selectable TIS 600-124 UDS 115/230 VAC 600 W 24 VDC 24 A selectable Models 1) Includes terminal plugs, does not include batteries 2) reduce max. output current by battery charging current http://www.tracopower.com Page 7 of 13 DC-UPS-System Industrial Power Supplies TIS Series 50–600 Watt Battery ON/OFF Con4 Pin7 L 115/230VAC Con1 Pin1 Con4 Pin8 N Con1 Pin2 Battery - Battery + Con1 Pin3 Con3 - Pin1 Con3 - Pin2 AC DC Mains Fail Detection Battery Test Battery OK Battery Low / failure Common Low Battery Con4 - Pin4 AC-Powerfail Con4 - Pin6 Con4 - Pin5 Battery Switch Logic I V Battery Charger +Vout Con2 - Pin3/4 -Vout 24VDC Common AC-Power OK AC-Powerfail Con4 - Pin3 Con4 - Pin2 Con4 - Pin1 Con2 - Pin1/2 Output OK VBat>18V Bat ON/OFF Mains Fail (Relay B) (Relay A) Specifications Charging current (factory set) TIS 300-124 UDS: 1.2 A TIS 600-124 UDS: 2.4 A Adjustment range of charging current TIS 300-124 UDS: 0.15 – 1.5 A TIS 600-124 UDS: 0.25 – 2.5 A Holding current for charged battery at voltage 27.3 VDC <50 mA Overload or short circuit during battery operation system switches off AC-Powerfail signal Vin <93 or <187 VAC relay A closed (pin 2 – pin 3) Low battery signal – Battery voltage below 22 V relay B closed (pin 5 – pin 6) – Raiting per relay contact 60 VDC /0.36 A max. During battery charge operation output current reduction by 1.4 x battery charge current Instruction manual for UDS option can be downloaded under: http://www.tracopower.com/products/tis-uds_manual.pdf http://www.tracopower.com Page 8 of 13 Battery-Pack for DC-UPS Systems The battery pack contains high quality, maintenance free lead-acid batteries with 3.2 Ah or 7.0 Ah capacity. The batteries are fixed together with a re-settable electronic fuse on a solid mounting frame. Together with power supply models TIS 300-124 UDS or TIS 600-124 UDS the battery pack provides a complete and reliable DC-UPS system. Backup time depends on load current and battery capacity. Industrial Power Supplies TIS Series 50–600 Watt Order Code Battery Voltage Battery Capacity Permissable Charge (25 °C, 20 h-rate) Current max. TIS 24-32AP 24 VDC 3.2 Ah 1.2 A TIS 24-70AP 24 VDC 7.0 Ah 2.4 A Models Specifications Max. charge voltage 27 – 27.6 VDC Temperature coefficient –36 mV/°C Temperature range – at charge operation –15°C to +50°C – at load operation –20°C to +60°C – Storage –20°C to +60°C Average lifetime on standby operation at tA =20°C 4 – 5 years (Limited Warranty on Battery) Cable length 1.0 m Cable diameter TIS 24-32 AP: 2.5 mm2 (AWG 12) TIS 24-70 AP: 4.0 mm2 (AWG 11) Weight TIS 24-32 AP: 2.9 kg (6.4 lb) TIS 24-70 AP: 4.1 kg (9.1 lb) Recommended combinations TIS 24-32 AP: TIS 300-124 UDS (power supplies) TIS 24-70 AP: TIS 600-124 UDS http://www.tracopower.com Page 9 of 13 100.0 (3.94) 75 (2.95) 37.5 (1.48) 74.0 (2.91) 56.7 (2.23) 26 (1.02) 5 (0.2) 31.5 (1.24) 10 (0.39) TIS 50-112 Input 115/230 VAC 1,2/0,7 A L N 12 VDC 3,5 A Output + – Industrial Power Supply Model DC-ON adj 114.6 (4.51) 90 (3.54) 45 (1.77) 10 (0.39) 56.7 (2.23) 86.5 (3.4) 34 (1.34) 5 (0.2) 39.5 (1.56) TIS 75-112 Input 115/230 VAC 1,7/0,9 A L N 12 VDC 6 A Output + – Industrial Power Supply Model DC-ON adj 114.6 (4.51) 10 (0.39) 157 (6.18) 56.7 (2.23) 38.5 80 (3.15) (1.52) 86.5 (3.4) 34 (1.34) 5 (0.2) 39.5 (1.56) TIS 150-124 Input 115/230 50/60Hz 3,7/1,7 A N L 24 VDC / 6 A Output + – Industrial Power Supply Model DC-ON Case Dimensions Industrial Power Supplies TIS Series 50–600 Watt TIS 50 models TIS 75 models Weight: 0.48 kg (1.06 lb) Weight: 0.80 kg (1.76 lb) TIS 150 models Weight: 0.41 kg (0.9 lb) Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) TIS PLUG-1 Connector Set for TIS 50/ 75/ 150 TIS PLUG-1-RED Connector Set for TIS 150-1xx RED Connectors ( Included in shipment) http://www.tracopower.com Page 10 of 13 114.6 (4.51) 10 (0.39) 83 (3.27) 38.5 (1.52) 130 (5.12) 83 (3.27) 207 (8.15) 91.5 (3.6) (1.36) 34.5 34 (1.34) 5 (0.2) 39.5 (1.56) TIS300-172 Input 115/230 50/60Hz 5,4/3,3 A N L 72 VDC / 4 A Output + – Industrial Power Supply Model DC-ON + – 83 (3.27) 130 (5.12) 220 (8.66) 46 (1.81) 130 (5.12) 10 (0.39) (0.2) 94 (3.7) 41.5(1.63) 5 47 (1.85) TIS 500-124-230 Input 230 VAC 50/60Hz 5,3 A N L 24 VDC / 20 A Output + – Industrial Power Supply Model DC-ON + – Case Dimensions Industrial Power Supplies TIS Series 50–600 Watt TIS 300 models Weight: 1.4 kg (3.09 lb) Weight: 1.9 kg (4.19 lb) TIS 500 models Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) TIS PLUG-3 Connector Set for TIS 300 TIS PLUG-3-RED Connector Set for TIS 300-1xx RED TIS PLUG-3-UDS Connector Set for TIS 300-1xx UDS TIS PLUG-5 Connector Set for TIS 500 Connectors ( Included in shipment) http://www.tracopower.com Page 11 of 13 6.8 (0.27) 82.8 (3.26) 177.2 (6.98) 32 (1.26) 120.2 (4.73) 82.6 (3.25) 179 (7.05) 243 (9.57) TIS 600-124 Input 115/230 VAC 50/60Hz 10,5/6,4 A N L 24 VDC / 20 A Output – + Industrial Power Supply Model – + Outline Dimensions mm (inches) Industrial Power Supplies TIS Series 50–600 Watt TIS 600 models Weight: 2.0 kg (4.41 lb) Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) TIS PLUG-6-RED Connector Set for TIS 600-1xx RED TIS PLUG-6-UDS Connector Set for TIS 600-1xx UDS Connectors ( Included in shipment) http://www.tracopower.com Page 12 of 13 Optional Mounting Systems Industrial Power Supplies TIS Series 50–600 Watt Wall mounting kit B A C 7.5 (0.30) D E 4.6 (0.18) TIS 75 MK-75 37 (1.46) 14.5 (0.57) – 134.5 (5.30) 150.5 (5.93) TIS 150 MK-150 132 (5.20) 13.5 (0.53) 105 (4.13) 134.5 (5.30) 150.5 (5.93) TIS 300 MK-300 132 (5.20) 13.5 (0.53) 105 (4.13) 134.5 (5.30) 150.5 (5.93) TIS 500 MK-500 132 (5.20) 13.5 (0.53) 105 (4.13) 134.5 (5.30) 150.5 (5.93) TIS 600 MK-600 190 (7.48) 37.5 (1.48) 115 (4.53) 197.0 (7.76) 207.0 (8.15) Models Order code A B C D E Rugged DIN-Rail mounting kit 4.2 (0.17) 25 (0.98) 50.1 (1.97) A B C countersink M4 TIS 150 RMK-150 150 (5.91) 115 (4.53) 35 (1.38) TIS 300 RMK-300 200 (7.87) 165 (6.50) 35 (1.38) TIS 500 RMK-300 200 (7.87) 165 (6.50) 35 (1.38) TIS 600 standard 180 (7.09) 165 (6.50) 15 (0.59) Models Order code A B C Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) Page 13 of 13 Outline Dimensions mm (inches) Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com Industrial Power Supplies TIS Series 50–600 Watt TIS 24-32AP Weight (incl. batteries): TIS 24-32AP 2.9 kg (6.4 lb) TIS 24-70AP TIS 24-70AP 4.1 kg (9.1 lb) A B A B 204 (8.03) 184 (7.24) 69 (2.72) Detail B Detail A 9 (0.35) 5.8 (0.23) 12 (0.47) 14 (0.55) 7 (0.28) 100 (3.94) 135 (5.14) 7 (0.28) B A 272 (10.71) 252 (9.92) B A 100 (3.94) 69 (2.72) 152 (5.98) Rev. May 17. 2013 Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) http://www.tracopower.com Industrial DC/DC-Converter TCL-DC Series, 24 to 60 Watt Features ◆ Ultra-wide input voltage range ◆ Output voltage adjustable ◆ Overload and short circuit protection ◆ Low ripple and noise ◆ I/O isolation 1500 VDC ◆ Compact, slim plastic case ◆ Reliable snap-on mount on DIN-rail ◆ Bracket for wall mount included ◆ 3-year product warranty In the TCL range of DIN-rail power supplies are 6 models for DC input voltage available. The wide input ranges of 9.5–18 VDC resp. 18–75 VDC means these models can be operated from all popular DC supply voltage systems. With tightly regulated output voltage these DC/DC converters provide a reliable power source for sensitive loads in industrial process controls, factory automation and other equipment exposed to a critical industrial environment. Further applications for these converters are isolation of a specific load or refreshing the 24 V bus voltage. Easy installation is provided with snap-on mounting on DIN-rails and detachable screw terminal block. Order Code Input Voltage Range Output Voltage Output Current max. TCL 012-124 DC 9.5 – 18.0 VDC 24 VDC 1.0 A TCL 024-105 DC 5 VDC 5.0 A TCL 024-112 DC 18 – 75 VDC 12 VDC 2.0 A TCL 024-124 DC 24 VDC 1.0 A TCL 060-112 DC TCL 060-124 DC 18 – 75 VDC 12 VDC 24 VDC 5.0 A 2.5 A Models Page 1 of 3 UL 508 CB Scheme http://www.tracopower.com Industrial DC/DC-Converter TCL-DC Series 24 to 60 Watt Input Specifications Input power at no load 1.0 Watt max. Start-up voltage/under voltage shut down TCL 012 model: 8.4 VDC / 7.6 VDC TCL 024 & TCL 060 models: 17.2 VDC / 15.7 VDC Reverse polarity protection by internal fuse Efficiency 86 % typ. Output Specifications Output voltage adj. range 5 VDC model: 5.0 – 5.25 VDC 12 VDC models: 12.0 – 15.0 VDC 24 VDC models: 24.0 – 28.0 VDC Regulation – Input variation Vin min. to Vin max. 0.5 % max – Load variation 0...100% 0.5 % max Ripple and noise (20 MHz bandwidth) <50 mV pk-pk Electronic short circuit protection current limitation at 110 % typ. (constant current, automatic recovery) Overvoltage protection, trigger point 5 VDC model: <6.5 V 12 VDC models: <24 V 24 VDC models: <42 V General Specifications Temperature ranges – Operating –25°C to +70°C max. – Storage (non operating) –25°C to +85°C Temperature derating 1.5 %/K above +50°C Humidity (non condensing) 95 % rel. H max. Temperature coefficient 0.02 %/K Switching frequency 55 – 180 kHz depending on load (frequency modulation) Isolation voltage (60 sec.) – Input/Output 1500 VDC Reliability, calculated MTBF at +25°C (according to IEC 61709) >2.5 Mio h Safety standards – Information technology equipment IEC 60950-1, EN 60950-1 (output SELV), UL Std. 60950-1 (2nd Edition) +Am1:2011, CAN/CSA-C22.2 No. 60950-1-07 +Am1:2011 – Industrial control equipment UL 508 – Electronic equipment for power installation EN 50178 – Electrical equipment for machines EN 60204 Safety approvals – CB test certificate (IEC 60950-1) www.tracopower.com/products/tcl-cb.pdf – UL approval www.ul.com -> certifications UL 508C listed, CSA C22.2 No.14 File e210002 – CSA certification UL 60950-1, CSA 60950-1-03 www.tracopower.com/products/tcl-csa.pdf – GS certification www.tracopower.com/products/tcl060dc_gs.pdf Electromagnetic compatibility (EMC), emissions EN 61000-6-3 – Conducted RI suppression on input EN 55022 class B – Radiated RI suppression EN 55022 class B Electromagnetic compatibility (EMC), immunity EN 61000-6-2 – Electrostatic discharge (ESD) EN 61000-4-2 4 kV / 8 kV – Radiated RF field immunity EN 61000-4-3 10 V/m – Electrical fast transient / burst immunity EN 61000-4-4 Level 3 – Surge immunity EN 61000-4-5 Level 3 – Immunity to conducted RF disturbances EN 61000-4-6 10 Vrms Environmental compliance – Reach www.tracopower.com/products/reach-declaration.pdf – RoHS RoHS directive 2011/65/EU Case protection IP 20 (IEC 60529) Enclosure material plastic UL 94V-0 rated Mounting DIN-rails as per EN 50022-35x15/7.5 (snap-on with self-locking spring) bracket for wall/chassis mount included Installation instructions www.tracopower.com/products/tcl-dc-inst.pdf All specifications valid at nominal input voltage, full load and +25 °C after warm-up time unless otherwise stated. Page 2 of 3 Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com Industrial DC/DC-Converter TCL-DC Series 24 to 60 Watt Rev. October 18. 2013 Page 3 of 3 27 (1.06) 2.2 (0.09) 100.0 (3.94) 75.0 (2.95) DC-ON LED Output voltage adjust INPUT 1 2 3 OUTPUT 1 2 Output Input 1 + Vout 1 Protective earth 2 – Vout 2 –Vin 3 +Vin Weight: 140g (4.9 oz) Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) Case Dimensions Wall Mounting Bracket Instead on a DIN-rail, the modules can be also mounted on a chassis or wall with help of a mounting bracket which is supplied as standard with each Converter 75.0 (2.95) 100.0 (3.94) 3.2 (0.13) 45 (1.77) DC-ON LED Output voltage adjust OUTPUT 1 1 2 2 INPUT 1 2 3 TCL 012 and TCL 024 models TCL 060 model Weight: 265 g (9.4 oz) Output Input 1 + Vout 1 Protective earth 2 – Vout 2 –Vin 3 +Vin http://www.tracopower.com DC/DC Converters TOS Series, Point-of-Load (POL) Converter Features  Small size, low profile  SMT package or SIP version  Cost-efficient open frame design  Wide input voltage ranges  Output voltages trim from 0.75 VDC to 5.5 VDC  Delivers up to 30 A with minimal derating  Ultra high efficiency to 96 %  Fast transient response  Remote On/Off control  Wide temperature range –40°C to +85°C  SMT package fully DOSA compatible  Lead free design – RoHS compliant The TOS series is a range of high performance non-isolated dc-dc converters With very high efficiency that can supply up to 30A of output current. These modules provide precisely regulated output voltages which can be set via an external resistor to a value from 0.75 VDC to 5.5 VDC. These converters work over a wide input voltage range of 2.4 to 5.5 VDC or 8.3 to 14.0 VDC.Further features include remote On/Off, under voltage lockout, over temperature and over current protection. These products have an open-frame construction with very small footprint and are available in an industry standard SIP or in a SMT package. The TOS series is fully RoHS compliant and can withstand industry standard handling, cleaning and the high temperatures of lead-free reflow solder processes. Order code SMT-version Input voltage range Output voltage range Output current max. Efficiency typ. TOS 06-05SM 6 A 94 % TOS 10-05SM 2.4 – 5.5 VDC 0.75 – 3.3 VDC** 10 A 93 % TOS 16-05SM 16 A 95 % TOS 06-12SM 6 A 89 % TOS 10-12SM 8.3 – 14.0 VDC 0.75 – 5.0 VDC 10 A 93 % TOS 16-12SM 16 A 92 % SIL-version TOS 06-05SIL 6 A 94 % TOS 10-05SIL 2.4 – 5.5 VDC 0.75 – 3.3 VDC* 10 A 93 % TOS 16-05SIL 16 A 95 % TOS 06-12SIL 6 A 89 % TOS 10-12SIL 8.3 – 14 VDC 0.75 – 5.0 VDC 10 A 93 % TOS 16-12SIL 16 A 92 % Models * 25 A output voltage higher than 2.75 VDC ** Max output voltage to be adjusted min. 0.5 VDC below impressed input voltage Page 1 of 4 Order code SMT-version Input voltage range Output voltage range Output current max. Efficiency typ. TOS 30-05SM 4.5 – 5.5 VDC 0.80 – 3.6 VDC 30 A 93 % TOS 30-12SM 6.0 – 14.0 VDC 0.80 – 3.6 VDC 30 A* 92 % SIL-version TOS 30-05SIL 4.5 – 5.5 VDC 0.80 – 5.5 VDC 30 A 93 % TOS 30-12SIL 6.0 – 14.0 VDC 0.80 – 5.5 VDC 30 A* 92 % Models Datasheet for 30A Models see: www.tracopower.com/products/tos30.pdf http://www.tracopower.com DC/DC Converters TOS Series, POL Converter Input Specifications Input current no load – Vin 5 VDC (at Vout min./Vout max.) 6 A models: 20 mA / 45 mA typ. 10 A models: 25 mA / 30 mA typ. 16 A models: 25 mA / 40 mA typ. – Vin 12 VDC (at Vout min./Vout max.) 6 A models: 17 mA / 100 mA typ. 10 A models: 40 mA / 100 mA typ. 16 A models: 40 mA / 100 mA typ. Stand by input current (at remote Off) 6 A models: 1 mA typ. 10 A / 16 A models: 2 mA typ. Max. input current – Vin 5 VDC 6 A models: 6 A 10 A models: 10 A 16 A models: 16 A – Vin 12 VDC 6 A models: 4.5 A 10 A models: 7 A 16 A models: 10 A Start up voltage / under voltage lockout 5 Vin models: 2.2 VDC / 2.0 VDC typ. 12 Vin models: 7.9 VDC / 7.8 VDC typ. Start up time (power / remote On till Vout set) 8 mS typ. Reflected ripple current – Vin 5 VDC 6 A models: 35 mA typ. (with input filter) 10 A / 16 A models: 100 mA typ. – Vin 12 VDC 6 A models: 30 mA typ. 10 A models: 20 mA typ. 16 A models: 20 mA typ. Input filter external (recommended) 2 x 150 μF low ESR polymer capacitors and 2 x 47 μF ceramic capacitors Output Specifications Voltage set accuracy ±2 % max. (see page 3 for set up) Voltage balance (dual output models) ±1 % max. Regulation – Input variation ±0.3 % max. – Load variation 0 – 100 % ±0.4 % max. Dynamic load response – 50 % load change (upper half) with external 1 μF ceramic- and 10 μF tantalum capacitors max. peak variation / response time Vin 5 VDC, 6 A models: 130 mV / 60 μS typ. Vin 12 VDC, 6 A models: 200 mV / 35 μS typ. Vin 5 VDC, 10 A models: 200 mV / 25 μS typ. Vin 12 VDC, 10 A models: 200 mV / 25 μS typ. Vin 5 VDC, 16 A models: 300 mV / 25 μS typ. Vin 12 VDC, 16 A models: 200 mV / 25 μS typ. – 50 % load change (upper half) with external 2 x 150 μF polymer capacitors Vin 5 VDC, 6 A models: 50 mV / 100 μS typ. Vin 12 VDC, 6 A models: 50 mV / 50 μS typ. Vin 5 VDC, 10 A models: 100 mV / 100 μS typ. Vin 12 VDC, 10 A models: 100 mV / 25 μS typ. Vin 5 VDC, 16 A models: 150 mV / 100 μS typ. Vin 12 VDC, 16 A models: 100 mV / 50 μS typ. Ripple and noise (20 MHz Bandwidth) 5 Vin models: 50 mV pk-pk max. 12 Vin models: 75 mV pk-pk max Temperature coefficient ±0.4 % typ. Over current protection at +200 % of Iout max. typ. Short circuit protection indefinite, automatic recovery Capacitive load – ESR <1 mOhm 1000 μF max. – ESR <10 mOhm 6 A models: 3000 μF max. 10 A / 16 A models: 5000 μF max. All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. Page 2 of 4 http://www.tracopower.com DC/DC Converters TOS Series, POL Converter General Specifications Temperature ranges – Operating –40°C to +85°C – Storage –55°C to +125°C Derating see application note Over temperature protection at +125°C typ. Humidity (non condensing) 95 % rel H max. Reliability, calculated MTBF (Bellcore TR-NWT-000332) 6 A models: >20 mio. h at +40°C 10 A / 16 A models: >14 mio. h at +40°C Switching frequency 300 kHz typ. (pulse width modulation - PWM) Remote On/Off On: 1 VDC to Vin max. or open circuit. (reference to GND) Off: 0 to 0.3 VDC Physical Specifications Weight 6 A models: 2.8 g 10 A / 16 A models: 6.0 g Soldering profile – SIL - Version max. 265°C / 10 sec. (wave soldering) – SMT - Version peak temp. 245°C for 10 sec. max., 217°C for 90 sec. max. (Convection reflow solder process is recommended) Output Voltage Adjustment Rd GND Prog Load (+Vout) Vo 5 VDC input models: Rd [Ohm] = 21070 – 5110 Vo – 0.7525 12 VDC input models: Rd [Ohm] = 10570 – 1000 Vo – 0.7525 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. Page 3 of 4 Application note: www.tracopower.com/products/tos-application.pdf Jenatschstrasse 1 · CH-8002 Zurich · Switzerland Tel. +41 43 311 45 11 · Fax +41 43 311 45 45 · info@traco.ch · www.tracopower.com DC/DC Converters TOS Series, POL Converter Outline Dimensions mm (inches) Rev. 12/12 Surface Mount (SMT-Version) Single-in-Line (SIL-Version) 10.2 (0.40) 22.9 (0.90) 3.29 (0.13) 20.32 (0.8) Vin GND Prog Vout On/Off 6 A output Models Vin GND Prog Vout On/Off 0.70 (0.028) 6.65 (0.26) 10A & 16A output models Sens No Pin 0.64 (0.025) 0.51 (0.02) 1.28 (0.05) 3.24 (0.128) 1.18 (0.046) 8.28 (0.33) 0.51 (0.02) 0.64 (0.025) 1.28 (0.05) 5 x 2.54 (5 x 0.10) 4 x 2.54 (4 x 0.10) 50.8 (2.00) 12.7 (0.50) 25.4 (1.0) Vin Vout Vout GND 2.54 (0.1) 15.24 (0.6) 17.78 (0.7) 1.5 11.4 (0.45) 2.29 20.3 (0.8) (0.09) (0.05) 1.3 1.57 8.9 (0.35) (0.82) 4.06 (0.16) 4.06 (0.16) 4.57 (0.18) 17.52 (0.69) (0.06) 8.64 (0.34) Vin GND Prog Vout On/Off 1.57 (0.82) 5.97 (0.24) Bottom View 6 A output Models 1.9 13.5 (0.53) 2.84 33.0 (1.3) (0.112) (0.05) 1.3 1.57 10.92 (0.43) (0.82) 4.83 (0.19) 4.83 (0.19) 7.54 (0.30) 29.9 (1.18) (0.075) 10.29 (0.41) Vin GND Vout Prog On/Off 1.57 (0.82) 8.28 (0.33) Bottom View 10A & 16A output models 4.83 (0.19) 4.83 (0.19) No Pin Sens Page 4 of 4 Specifications can be changed any time without notice. http://www.tracopower.com Page 1 of 6 AC/DC Power Modules TML Series, 5to 30 Watt The TML series are ultra compact AC/DC power supplies in a fully encapsulated plastic case. They feature versions with screw terminals for easy installation or with solder pins for direct PCB mounting. International safety approvals qualify this product for worldwide markets. The TML series AC/DC modules offer an interesting solution for many space critical applications in commercial and industrial electronic equipment. Features ◆ Encapsulated power Supplies ◆ PCB mount or chassis mount with screw terminals ◆ Single, dual and triple output models ◆ Universal input 85–264 VAC, 47–440 Hz ◆ EMI meets EN 55022, class B and FCC, level B ◆ Low ripple and noise ◆ Short circuit and overload protection ◆ 3-year product warranty Order Code Output Power max. Output 1 Output 2 Output 3 TML 05105 5 VDC/1000 mA TML 05112 12 VDC/416 mA TML 05115 15 VDC/333 mA TML 05124 5 Watt 24 VDC/200 mA TML 05205 5 VDC/500 mA –5 VDC/500 mA TML 05212 12 VDC/200 mA –12 VDC/200 mA TML 05215 15 VDC/160 mA –15 VDC/160 mA TML 10105 5 VDC/2000 mA TML 10112 12 VDC/833 mA TML 10115 15 VDC/666 mA TML 10124 10 Watt 24 VDC/416 mA TML 10205 5 VDC/800 mA –5 VDC/800 mA TML 10212 12 VDC/380 mA –12 VDC/380 mA TML 10215 15 VDC/300 mA –15 VDC/300 mA Models LVD UL 60950-1 http://www.tracopower.com Page 2 of 6 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. AC/DC Power Modules TML Series 5 to 30 Watt Input Specifications Input voltage ranges – AC input 85–264 VAC – DC Input TML 30 models: 100 – 370 VDC output power derating 1 %/V below 110 VDC other models: 85 – 370 VDC output power derating 0.8 %/V below 110 VDC Input frequency 47–440 Hz Input current no load 115 VAC / 230 VAC TML 5 models: 10 mA / 15 mA typ TML 10 models: 15 mA / 20 mA typ TML 15 models: 18 mA / 25 mA typ. TML 30 models: 30 mA / 55 mA typ. Input current full load 115 VAC / 230 VAC TML 5 models: 160 mA / 80 mA typ. TML 10 models: 200 mA / 120 mA typ TML 15 models: 280 mA / 165 mA typ. TML 30 models: 550 mA / 320 mA typ. External fuse (required) 1.5 A slow blow type (recommendation) Order Code Output Power Output 1 Output 2 Output 3 PCB-mounting Chassis mounting max. TML 15105 TML 15105C 5 VDC/3000 mA TML 15112 TML 15112C 12 VDC/1250 mA TML 15115 TML 15115C 15 VDC/1000 mA TML 15124 TML 15124C 24 VDC/625 mA TML 15205 TML 15205C 15 Watt 5 VDC/1500 mA –5 VDC/1500 mA TML 15212 TML 15212C 12 VDC/650 mA –12 VDC/650 mA TML 15215 TML 15215C 15 VDC/500 mA –15 VDC/500 mA TML 15512 TML 15512C 5 VDC/2000 mA 12 VDC/200 mA –12 VDC/200 mA TML 15515 TML 15515C 5 VDC/2000 mA 15 VDC/150 mA –15 VDC/150 mA TML 30103 TML 30103C 3.3 VDC/6000 mA TML 30105 TML 30105C 5 VDC/6000 mA TML 30112 TML 30112C 12 VDC/2500 mA TML 30115 TML 30115C 15 VDC/2000 mA TML 30124 TML 30124C 24 VDC/1250 mA TML 30205 TML 30205C 30 Watt 5 VDC/3000 mA –5 VDC/3000 mA TML 30212 TML 30212C 12 VDC/1300 mA –12 VDC/1300 mA TML 30215 TML 30215C 15 VDC/1000 mA –15 VDC/1000 mA TML 30252 TML 30252C *5 VDC/3000 mA *12 VDC/1250 mA TML 30512 TML 30512C * 5 VDC/3000 mA 12 VDC/630 mA –12 VDC/630 mA TML 30515 TML 30515C *5 VDC/3000 mA 15 VDC/500 mA –15 VDC/500 mA Models * Output floating http://www.tracopower.com Page 3 of 6 AC/DC Power Modules TML Series 5 to 30 Watt Output Specifications Voltage set accuracy ± 2 % Regulation – Input variation 0.3 % max. – Load variation (10–100%) single output models: 1.0 % max. dual / triple output models: 5 % max. Minimum load single output models: 5 % dual output models: 3 % (each output) triple output 15W models: 10 % (main output only) triple output 30W models: 20 % (each output) Ripple and noise (20 MHz bandwidth) – 3.3 & 5 VDC output models: <1.5 % of Vout – other models: <1.0 % of Vout Current limitation 120– 80 % fold back Short circuit protection hiccup mode, indefinite (automatic recovery) Maximum capacitive load 470–50’000 μF depending on model General Specifications Temperature ranges – Operating –25 °C to +60 °C – Power derating above 50 °C 3.75 %/°C – Storage (non operating) –40 °C to +85 °C Temperature coefficient 0.02 %/°C Efficiency 72–80 % (depending on model) Humidity (non condensing) 95 % rel max. Switching frequency 100 kHz typ. (pulse width modulation PWM) Hold-up time 40 ms min. (Vin 115...230 VAC) Isolation voltage – Input/Output 3‘000 VAC Reliability /calculated MTBF (MIL-HDBK-217F at +25°C, ground benign) >660’000 h EMI / RFI conducted EN 55022, class B, FCC part 15, level B EMC compliance – Electrostatic discharge ESD IEC / EN 61000-4-2 4 kV / 8 kV – RF field susceptibility IEC / EN 61000-4-3 3 V/m – Electrical fast transients/bursts on mainsline IEC / EN 61000-4-4 1 kV Safety class II (only 30 watt models) to IEC / EN 60536 Safety standards UL 60950-1, IEC/EN 60950-1 Safety approval cUL/UL File e188913 www.ul.com -> certifications Case material plastic resin + fiberglass (flammability to UL 94-V0) Environmental compliance – Reach www.tracopower.com/products/tml-reach.pdf – RoHS RoHS directive 2011/65/EU All specifications valid at nominal input voltage, full load and +25 °C after warm-up time unless otherwise stated. http://www.tracopower.com Page 4 of 6 AC/DC Power Modules TML Series 5 to 30 Watt Outline Dimensions TML 5 Models Pin diameter ø 1.0 mm TML 10 Models Weight: 80 g (2.8 oz) Weight: 95 g (3.4 oz) ( ) = Inches Tolerances = 0.5mm (0.02) 1 2 3 4 5 6 45.0 (1.77) 17.5 ±0.3 (0.69 ±0.012) 17.5 ±0.3 (0.69 ±0.012) 4.0 (0.16) 47.0 ±0.3 (1.85 ±0.012) 55.0 (2.17) 10 ±0.3 (0.39 ±0.012) 10 ±0.3 (0.39 ±0.012) 20.5 (0.81) 10 (0.39) Bottom view Bottom view 1 2 3 4 5 45.0 (1.77) 20.5 (0.79) 10 (0.39) 17.5 ±0.3 (0.69 ±0.012) 4.0 (0.16) 6 17.5 ±0.3 (0.69 ±0.012) 54.0 ±0.3 (2.13 ±0.012) 64.0 (2.52) 10 ±0.3 (0.39 ±0.012) 10 ±0.3 (0.39 ±0.012) Pin diameter ø 1.0 mm Pin Single Dual 1 FG FG 2 AC(N) AC(N) 3 AC(L) AC(L) 4 –V out –V out 5 NC Common 6 +V out +V out Pin-Out Pin Single Dual 1 FG FG 2 AC(N) AC(N) 3 AC(L) AC(L) 4 –V out –V out 5 NC Common 6 +V out +V out Pin-Out NC = Not to connect NC = Not to connect http://www.tracopower.com Page 5 of 6 AC/DC Power Modules TML Series 5 to 30 Watt Outline Dimensions TML 15 Models PCB mounting: TML 15-C Models Chassis mounting: Bottom view 1 2 3 8 7 6 5 4 54.0 (2.13) 20.0 ±0.3 (0.79 ±0.012) 20.0 ±0.3 (0.79 ±0.012) 6.0 (0.24) 62.0 ±0.3 (2.44 ±0.012) 74.0 (2.91) 8.5 ±0.3 (0.33 ±0.012) 8.5 ±0.3 (0.33 ±0.012) 11.5 ±0.3 (0.45 ±0.012) 11.5 ±0.3 (0.45 ±0.012) 22.0 (0.87) 10 (0.39) Top view 54.0 (2.13) 5.0 (0.20) 86.0 ±0.3 (3.39 ±0.012) 96.0 (3.78) 4 x ø3.5 (4 x ø0.14) 1 2 3 8 7 6 5 4 27.6 (1.08) 5.0 (0.20) 46.0 ±0.3 (1.81 ±0.012) Pin diameter ø 1.0 mm Weight: 120 g (4.2 oz) Weight: 150 g (5.3 oz) Pin Single Dual Triple 1 FG FG FG 2 AC(N) AC(N) AC(N) 3 AC(L) AC(L) AC(L) 4 No Pin No Pin –V out 3 5 –V out –V out Com. 2/3 6 No Pin Common +V out 2 7 +V out +V out –V out 1 8 No Pin No Pin +V out 1 Pin-Out Page 6 of 6 Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com AC/DC Power Modules TML Series 5 to 30 Watt TML 30 Models PCB mounting: 1 2 7 6 5 4 3 Bottom view 63.5 (2.50) 27.9 ±0.3 (1.10 ±0.012) 3.8 (0.15) 81.3 ±0.3 (3.20 ±0.012) 88.9 (3.50) 15.24 ±0.3 (0.60 ±0.012) 12.7 ±0.3 (0.50 ±0.012) 12.7 ±0.3 (0.50 ±0.012) 15.24 ±0.3 (0.60 ±0.012) 25.0 (0.98) 6 (0.24) 27.9 ±0.3 (1.10 ±0.012) Top view 1 2 7 6 5 4 3 31.0 (1.22) 5.5 (0.22) 64.7 (2.55) 50.0 ±0.3 (1.97 ±0.012) 6.0 (0.20) 100.0 ±0.3 (3.94 ±0.012) 112.0 (4.41) 4 x ø3.5 (4 x ø0.14) NC TML 30-C Models Chassis mounting: Pin diameter ø 1.0 mm Weight : 230 g (8.1 oz) Weight : 275 g (9.7 oz) Dimensions in[mm], () = Inches Tolerances = 0.5mm (0.02) Pin Single Dual sym. Dual asym. Triple 1 AC(N) AC(N) AC(N) AC(N) 2 AC(L) AC(L) AC(L) AC(L) 3 +V out +V out +V out 2 +V out 2 4 No Pin No Pin +V out 1 +V out 1 5 –V out Common –V out 2 Com. 2/3 6 No Pin No Pin –V out 1 –V out 1 7 NC. –V out NC. –V out 3 Pin-Out Rev. February 14. 2014 Outline Dimensions NC = Not to connecthttp://www.tracopower.com Features ◆ Shielded metal case with screw terminals ◆ Compact dimensions: 98 x 52 x 34 mm ◆ Ultra-wide 4:1 input voltage range ◆ Very high efficiency up to 87% ◆ Constant current output characteristic for battery load applications ◆ Optional with input filter to meet EN55022 class B ◆ Overtemperature protection ◆ Wide Operating temperature range: –40°C to +75°C ◆ Reverse input protection ◆ Under voltage lock-out ◆ I/O isolation 2250 VDC ◆ Easy chassis and wall mounting ◆ 3-year product warranty DC/DC Converters TEP 150WI Series, 150 Watt The TEP-150WI Series is a family of high power density dc-dc converter modules with ultra-wide 4:1 input voltage range which come in an ultra-compact metal case with screw terminal connection. Suitable for a wide range of applications, the TEP-150WI series was particularly designed with industrial applications in mind. The modules have flanges for easy chassis or wall mounting. A very high efficiency allows an operating temperature up to +50°C with natural convection cooling. Further features include adjustable output voltage with constant current characteristic for battery charger applications. Page 1 of 5 Order code* Input voltage Output voltage Output current max. Efficiency typ. TEP 150-2412WI 12 VDC 12.5 A 86 % TEP 150-2413WI 9 – 36 VDC 15 VDC 10 A 86 % TEP 150-2415WI (24 VDC nominal) 24 VDC 6.3 A 87 % TEP 150-2416WI 28 VDC 5.4 A 87 % TEP 150-2418WI 48 VDC 3.2 A 86 % TEP 150-4812WI 12 VDC 12.5 A 87 % TEP 150-4813WI 18 – 75 VDC 15 VDC 10 A 87 % TEP 150-4815WI (48 VDC nominal) 24 VDC 6.3 A 88 % TEP 150-4816WI 28 VDC 5.4 A 88 % TEP 150-4818WI 48 VDC 3.2 A 87 % TEP 150-7212WI 12 VDC 12.5 A 86 % TEP 150-7213WI 43 – 160 VDC 15 VDC 10 A 86 % TEP 150-7215WI (72 VDC nominal) 24 VDC 6.3 A 87 % TEP 150-7216WI 28 VDC 5.4 A 87 % TEP 150-7218WI 48 VDC 3.2 A 86 % Options suffix –F Modules with input filter to meet EN 55022 class B, see page 5 on demand Negative (passive = Off) remote On/Off function (standard is passive = On)range Models CB Scheme UL 60950-1 http://www.tracopower.com Input Specifications Input current (no load) 24 Vin, 12 – 24 VDC models: 80 mA typ. 24 Vin, 28 – 48 VDC models: 130 mA typ. 48 Vin, 12 – 24 VDC models: 60 mA typ. 48 Vin, 28 – 48 VDC models: 70 mA typ. 110 Vin, 12 – 24 VDC models: 30 mA typ. 110 Vin, 28 – 48 VDC models: 40 mA typ. Start-up voltage / under voltage lock-out 24 Vin models: 9 VDC / 8.2 VDC typ. 48 Vin models: 18 VDC / 16.2 VDC typ. 110 Vin models: 43 VDC / 34.5 VDC typ. Surge voltage (1sec. max.) 24 Vin models: 50 V 48 Vin models: 100 V 110 Vin models: 170 V Conducted noise (input) EN 55022 class A, FCC part 15, class A without external components. optional filter for class B – suffix F ESD (electrostatic discharge) EN 61000-4-2, air ±8 kV, contact ±6 kV, perf. criteria A Radiated immunity EN 61000-4-3, 10 V/m, perf. criteria A Fast transient / Surge (with input capacitor for models without filter module) EN 61000-4-4, ±2 kV, perf. criteria A EN 61000-4-5, ±1 kV perf. criteria A – Input capacitor: 24 VDC models: Nippon chemi-con KY 470 μF, 50 V, ESR 45 mOhm 48 VDC models: Nippon chemi-con KY 220 μF, 100 V, ESR 48 mOhm 110 VDC models: Nippon chemi-con KXJ series, 150 μF, 200V models with filter module (suffix F): no input capacitor required Conducted immunity EN 61000-4-6, 10 Vrms, perf. criteria A Reverse voltage protection parallel diode (input fuse required) Recommended input fuse (slow blow) 24 Vin models: 15 A 48 Vin models: 10 A 72 Vin models: 5 A Output Specifications Voltage set accuracy ±1 % Output voltage adjustment +20 % by external resistor (see application note) Regulation – Input variation Vin min. to Vin max. 0.2 % max. – Load variation 0 – 100 % 0.4 % max. Temperature coefficient ±0.02 %/K Minimum load not required Ripple and noise (20 MHz Bandwidth) 12 & 15 VDC models: 100 mVpk-pk max. 24 & 28 VDC models: 200 mVpk-pk max. 48 VDC models: 350 mVpk-pk max. Start up time (nominal Vin and constant resistive load) 25 ms typ. (at power On or remote On) Transient response (25 % load step change) 200 μs typ. Output current – Constant voltage (CV) up to 110 % of Iout max. – Constant current (CC) above 110 % of Iout max. Over voltage protection at 125 –140 % of Vout nom. Short circuit protection indefinite, automatic recovery Capacitive load 12 VDC models: 40‘000 μF max. 15 VDC models: 26‘000 μF max. 24 VDC models: 10‘000 μF max. 28 VDC models: 7‘600 μF max. 48 VDC models: 2‘600 μF max. DC/DC Converters TEP 150WI Series 150 Watt Page 2 of 5 http://www.tracopower.com DC/DC Converters TEP 150WI Series 150 Watt General Specifications Temperature ranges – Operating –40°C to +75°C – Case temperature +100°C max. – Storage –55°C to +125°C Thermal consideration – Mounting surface Optimize thermal coupling to heat conducting surface. Not to mount on flammable surface! – Derating and temperature test point see application note Over temperature protection at 110°C (auto restart) Vibration and thermal shock acc. MIL-STD-810F Humidity (non condensing) 95 % rel H max. Reliability, calculated MTBF (MIL-HDBK-217F, at +40°C, ground benign) >135‘000 h Isolation voltage (60 sec.) – Input/Output 2250 VDC (functional insulation) – Input/Case 1500 VDC – Output/Case 1500 VDC Isolation capacitance – Input/Output 3500 pF max. Isolation resistance – Input/Output (500 VDC) >1 GOhm min. Switching frequency 220 – 330 kHz depending on model (puls width modulation) Safety standards UL 60950-1, IEC/EN 60950-1 Safety approvals – UL/cUL 60950-1 www.ul.com -> certifications -> File e188913 – CB test certificate (IEC 60950-1) www.tracopower.com/products/tep150wi-cb.pdf (72 Vin models pending) Remote On/Off – positive logic (standard) – On: 3 to 12 VDC or open circuit – Off: 0 to 1.2 VDC or short circuit pin 5 and 3 – negative logic (option -N) – On: 0 to 1.2 VDC or short circuit pin 5 and 3 – Off: 3 to 12 VDC or open circuit – Off idle current: 3 mA Environmental compliance – Reach www.tracopower.com/products/tep150wi-reach.pdf – RoHS RoHS directive 2011/65/EU Physical Specifications Casing material metal Potting material silicon (UL 94V-0 rated) Case protection IP 50 (in accordance to IEC/EN60529) Weight 300 g (10.6 oz) All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. Page 3 of 5 Application note: www.tracopower.com/products/tep150wi-application.pdf (72 Vin models pending) http://www.tracopower.com DC/DC Converters TEP 150WI Series 150 Watt Page 4 of 5 Weight: 300g (10.6 oz) Dimensions in [mm], () = Inch Mounting slot tolerance: ±0.25 (±0.001) Case tolerances: ±0.5 (±0.02) Outline Dimensions 52.5 65.0 1.2 35.7 (2.07) (2.56) (1.6) (0.05) 59.0 (2.07) 98.0 (3.86) 56.0 (2.20) 21.0 (0.83) 4 x r2 (0.08) 1 2 3 4 5 6 7 8 9 Pin Connection pin function recommended wire 1 + Vin 14 – 16 AWG 2 + Vin 14 – 16 AWG 3 – Vin 14 – 16 AWG 4 – Vin 14 – 16 AWG 5 Remote On/Off 14 – 24 AWG 6 + Vout 14 – 16 AWG 7 – Vout 14 – 16 AWG 8 Trim 14 – 24 AWG 9 Trim 14 – 24 AWG Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com Rev. June 14. 2013 Page 5 of 5 DC/DC Converters TEP 150WI Series 150 Watt Outline Dimensions Pin Connection 52.5 65.0 1.2 35.7 (2.07) (2.56) (1.6) (0.05) 59.0 (2.07) 139.5 (5.49) 56.0 (2.20) 21.0 (0.83) 6 x r2 (0.08) 160.5 (6.32) 1 2 3 4 5 6 7 8 9 90.0 (3.54) 18.7 (0.74) Weight: 435g (15.3 oz) Dimensions in [mm], () = Inch Mounting slot tolerance: ±0.25 (±0.001) Case tolerances: ±0.5 (±0.02) pin function recommended wire 1 + Vin 14 – 16 AWG 2 + Vin 14 – 16 AWG 3 – Vin 14 – 16 AWG 4 – Vin 14 – 16 AWG 5 Remote On/Off 14 – 24 AWG 6 + Vout 14 – 16 AWG 7 – Vout 14 – 16 AWG 8 Trim 14 – 24 AWG 9 Trim 14 – 24 AWG http://www.tracopower.com Page 1 of 11 Enclosed Power Supplies TXL Series, 15– 1000 Watt Features ◆ Compact metal case with screw terminal block ◆ Dual and triple output models with isolated outputs ◆ Universal input 85–264 VAC ◆ EMI/EMC compliance with EN 61000-6-3 and EN 61000-6-1 ◆ Compliance to EN 61000-3-2 (PFC) ◆ Short circuit and overvoltage protection ◆ International safety approvals ◆ 3-year product warranty Order Code Case Type Output Power max. Output Voltage nom. Output Current max. TXL 015-3.3S 3.3 VDC 3.0 A TXL 015-05S 5 VDC 3.0 A TXL 015-12S B 15 Watt 12 VDC 1.3 A TXL 015-15S 15 VDC 1.0 A TXL 015-24S 24 VDC 0.63 A TXL 015-48S 48 VDC 0.32 A TXL 025-3.3S 3.3 VDC 6.0 A TXL 025-05S 5 VDC 5.0 A TXL 025-12S C 25 Watt 12 VDC 2.1 A TXL 025-15S 15 VDC 1.7 A TXL 025-24S 24 VDC 1.1 A TXL 025-48S 48 VDC 0.57 A TXL 035-3.3S D 3.3 VDC 9.0 A TXL 035-05S 5 VDC 7.0 A TXL 035-12S 35 Watt 12 VDC 3.0 A TXL 035-15S 15 VDC 2.4 A TXL 035-24S 24 VDC 1.5 A TXL 035-48S 48 VDC 0.8 A TXL 050-05S 5 VDC 10.0 A TXL 060-12S 50 / 60 Watt 12 VDC 5.0 A TXL 060-15S 15 VDC 4.0 A TXL 060-24S 24 VDC 2.5 A Models with Single Output The TRACOPOWER TXL series is a family of encased power supplies designed for a wide range of cost critical applications. With a low profile metal case and screw terminal block connection, they are easy to install in any equipment. There are 64 models in this range with single, dual, and triple output voltages from 3.3 VDC to 48 VDC in 12 power ranges from 15 W to 1000 W. These power supplies have universal input and comply with European EMC standards and the Low Voltage Directive (LVD). http://www.tracopower.com Page 2 of 11 Enclosed Power Supplies TXL Series 15–1000 Watt Order Code Case Type Output Power max. Output Voltage nom. Output Current max. TXL 060-3.3S 3.3 VDC 15.0 A TXL 060-05S 5 VDC 12.0 A TXL 070-12S E 60 / 70 Watt 12 VDC 6.0 A TXL 070-15S 15 VDC 4.8 A TXL 070-24S 24 VDC 3.0 A TXL 070-48S 48 VDC 1.5 A TXL 100-3.3S 3.3 VDC 23.0 A TXL 100-05S 5 VDC 20.0 A TXL 100-12S J 100 Watt 12 VDC 8.5 A TXL 100-15S 15 VDC 7.0 A TXL 100-24S 24 VDC 4.3 A TXL 100-48S 48 VDC 2.3 A TXL 150-05S 5 VDC 30.0 A TXL 150-12S L 150 Watt 12 VDC 12.5 A TXL 150-24S 24 VDC 6.3 A TXL 150-48S 48 VDC 3.2 A TXL 230-12S 12 VDC 19.2 A TXL 230-24S N 230 Watt 24 VDC 9.6 A TXL 230-48S 48 VDC 4.8 A TXL 350-24S O 350 Watt 24 VDC 14.7 A TXL 350-48S 48 VDC 7.5 A TXL 750-24S P 750 Watt 24 VDC 31.3 A TXL 750-48S 48 VDC 15.8 A TXL 1000-24S Q 1000 Watt 24 VDC 40.0 A TXL 1000-48S 48 VDC 21.0 A Models with Single Output Order Code Case Type Output Power max. * Output1 (Main Output) * Output 2 * Output 3 TXL 035-0512D +5 VDC/ 4.0 A +12 VDC/ 2.5 A TXL 035-0524D D 35 Watt +5 VDC/ 4.0 A +24 VDC/ 1.3 A TXL 035-1212D +12 VDC/ 3.0 A –12 VDC/ 1.5 A TXL 035-1515D +15 VDC/ 2.4 A –15 VDC/ 1.5 A TXL 060-0512DI 5 VDC/ 8.0 A 12 VDC/ 4.0 A TXL 060-0524DI 5 VDC/ 6.0 A 24 VDC/ 2.2 A TXL 060-0521TI E 60 Watt 5 VDC/ 8.0 A 12 VDC/ 3.5 A 5 VDC/ 1.0 A TXL 060-0522TI 5 VDC/ 7.0 A 12 VDC/ 3.5 A 12 VDC/ 1.0 A TXL 060-0533TI 5 VDC/ 7.0 A 15 VDC/ 3.0 A 15 VDC/ 1.0 A TXL 060-0534TI 5 VDC/ 6.0 A 12 VDC/ 1.5 A 24 VDC/ 1.2 A TXL 100-0512DI 5 VDC/ 12.0 A 12 VDC/ 7.0 A TXL 100-0524DI 5 VDC/ 12.0 A 24 VDC/ 3.5 A TXL 100-0521TI J 100 Watt 5 VDC/ 12.0 A 12 VDC/ 5.0 A 5 VDC/ 1.5 A TXL 100-0522TI 5 VDC/ 12.0 A 12 VDC/ 5.0 A 12 VDC/ 1.5 A TXL 100-0533TI 5 VDC/ 12.0 A 15 VDC/ 4.0 A 15 VDC/ 1.5 A TXL 100-0534TI 5 VDC/ 12.0 A 12 VDC/ 4.0 A 24 VDC/ 2.0 A Models with Multiple Output * Total power must not exceed specified max. output power http://www.tracopower.com Page 3 of 11 Enclosed Power Supplies TXL Series 15–1000 Watt Input Specifications Input voltage range – nominal 100 – 240 VAC – AC range (universal input) 85 – 264 VAC for 15 to 350 Watt model 90 – 264 VAC for 750 & 1000 Watt models – DC range 120 – 375 VDC for 15 to 350 Watt model 127 – 375 VDC for 750 & 1000 Watt models Input voltage frequency 47 – 63 Hz Input current (at full load) Vin = 115 VAC Vin = 230 VAC TXL 015/025 models: 0.50 A typ. 0.22 A typ. TXL 035 models: 0.70 A typ. 0.42 A typ. TXL 060/070 models: 1.00 A typ. 0.60 A typ. TXL 100 models: 1.65 A typ. 0.95 A typ. TXL 150 models: 2.10 A typ. 1.10 A typ. TXL 230 models: 3.20 A typ. 1.70 A typ. TXL 350 models: 3.30 A typ. 1.70 A typ. TXL 750 models: 8.0 A typ. 3.90 A typ TXL 1000 models: 11.0 A typ. 5.0 A typ. Input current (at no load) Vin = 115 VAC Vin = 230 VAC TXL 015/025 models: 10 mA typ. 17 mA typ. TXL 035 models: 50 mA typ. 55 mA typ. TXL 230/350 models: 115 mA typ. 140 mA typ. TXL 750 models: 210 mA typ. 220 mA typ. TXL 1000 models: 330 mA typ. 350 mA typ. other models: 100 mA typ. 80 mA typ. Recommended circuit breaker up to 70 Watt models: 5 A (characteristic C) or slow blow fuse up to 350 Watt models: 10 A TXL 750 & 1000 Watt models: 16 A Output Specifications Output voltage adjustment range ±10 % – 35 Watt dual output models: range Vout 1–2 – other multi output models: Vout 1 Regulation – Input variation 1 % max. – Load variation (10–100%) single output models: 2 % max. multiple output models: 4 % max. for main output 6 % max. for output 2/3 (20–100 % load) – Minimum load on main output of multiple output models: 0.3 A for TXL 035 (to provide the regulation on the auxilary outputs) 1.0 A for TXL 060 1.5 A for TXL 100 Ripple and noise (20 MHz bandwidth) 3.3 VDC output < 50 mV Output 3 (on triple output models) < 1.5 % of Vout all other output voltages < 1.0 % of Vout nom. Output current limitation 105 % – 150 % of Iout max. Overload protection mode Fold back, automatic recovery Over voltage protection (only output 1) 115 % – 140 % of Vout nom. (depending on model) Capacitive load, max. www.tracopower.com/products/txl-capload.pdf http://www.tracopower.com Page 4 of 11 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. General Specifications Temperature ranges – Operating –10°C to +70°C – Load derating above +45°C 2 %/°K (2.5 %/°K for TXL 120/230/1000) – Storage (non operating) –10°C to +75°C Temperature coefficient 0.02 %/°C Efficiency 70 – 84 % (depending on model) Humidity (non condensing) 85 % rel max. (non condensing) Switching frequency 50 kHz typ. (pulse width modulation) Hold-up time 20 ms min. Isolation voltage (60 sec.) – Input/Output 3‘000 VAC – Input/Case 1‘500 VAC – Output/Case 500 VAC – Output/Output 60–100 Watt multiple output models: 500 VAC (for all outputs of triple output models!) 35 Watt dual output models: outputs not isolated Reliability /calculated MTBF (MIL-HDBK-217F, at +25°C typ., ground benign) >250’000 h Electromagnetic compatibility – Conducted input RI suppression EN 55022, class B, FCC part 15, level B (EMC), Emissions – Harmonic current emissions IEC/EN 61000-3-2, class D (TXL 120/150/220) IEC/EN 61000-3-2, class A (others) – Flicker IEC/EN 61000-3-3 Electromagnetic compatibility – Electrostatic discharge ESD IEC/EN 61000-4-2 4 kV / 8 kV (EMC), Immunity – RF field immunity IEC/EN 61000-4-3 3 V/m – Electrical fast transients/burst immunity IEC/EN 61000-4-4 1 kV – Surge IEC/EN 61000-4-5 1 kV / 2 kV – Conducted RF IEC/EN 61000-4-6 3 V/m – Magnetic field IEC/EN 61000-4-8 3 A/m – Voltage dip IEC/EN 61000-4-11 Safety standards UL 60950-1, IEC/EN 60950-1 2nd edition Safety approvals – UL/cUL www.ul.com -> certifications -> File: e188913 – CB report TXL 015 models: www.tracopower.com/products/txl015-cb.pdf TXL 025 models: www.tracopower.com/products/txl025-cb.pdf TXL 035 models: www.tracopower.com/products/txl035-cb.pdf TXL 060/070 models: www.tracopower.com/products/txl060-cb.pdf TXL 100 models: www.tracopower.com/products/txl100-cb.pdf TXL 150 models: www.tracopower.com/products/txl150-cb.pdf TXL 230 models: www.tracopower.com/products/txl230-cb.pdf TXL 350 models: www.tracopower.com/products/txl350-cb.pdf TXL 750 models: www.tracopower.com/products/txl750-cb.pdf TXL 1000 models: www.tracopower.com/products/txl1000-cb.pdf Environmental compliance – Reach www.tracopower.com/products/txl-reach.pdf – RoHS RoHS directive 2011/65/EU Casing material TXL 025/035 nickel plated steel (chassis & cover) TXL 50/60/70/100 aluminium (chassis), nickel plated steel (cover) others aluminium (chassis & cover) Enclosed Power Supplies TXL Series 15–1000 Watt http://www.tracopower.com Page 5 of 11 Case Dimensions Enclosed Power Supplies TXL Series 15–1000 Watt 82 10 max. 99 (0.39 max.) (3.90) 55 (2.17) 23.5 (0.93) 45 (1.77) 74 (2.91) 7 (0.28) 17.5 (0.69) 35 (1. 38) (3.23) 3 1 45 6 2 2 x M3 THD (bottom) Top view 2x M3 THD Case C Case D Weight: 0.19 kg (6.7 oz) Weight: 0.3 kg (10 oz) single dual 1 AC L AC L 2 AC N AC N 3 AC FG AC FG 4 –Vout Common 5 +Vout Vout 1 6 No con. Vout 2 Connection Max mounting screw penetration: 2.0 mm (0.08) LN Vout 2x M3 THD 14 max. 79 (0.55 max.) (3.11) 55 11 (2.17) (0.43) 65 (2.56) 3 (0.12) 14.5 (0.57) 28.5 (1.12) 51 (2.0 1) 25.5 (1.0) Top view 2 x M3 THD (bottom) Case B LN Vout 2x M3 THD 14 max. 62 (0.55 max.) (2.44) 39.1 14.7 (1.54) (0.58) 11.5 (0.45) 15.1 (0.59) 28.0 (1.10) 51 (2.0 1) 25.25 (0.99) Top view 2 x M3 THD (bottom) + 39.1 (1.54) Weight: 0.13 kg (4.6 oz) http://www.tracopower.com Page 6 of 11 Enclosed Power Supplies TXL Series 15–1000 Watt Case E 10 max. 159 (0.39 max.) (6.26) 32 (1.26) 78 57 (3.07) (0.95) 118 19 (4.65 ) (0.75) 18 (0.71) 19 (0.75) 38 (1.50) 95 (3.74) 1234567 123456789 Dual & Triple output models Single output Top view 2 x M3 THD (bottom) 10 (0.39) 3 x M3 THD Case J 10 max. 198 (0.39 max.) (7.80) 9 (0.35) 80 (3.15) 120 (4.72) 4 x M3 THD (bottom) 1234567 123456789 Dual & Triple output models Single output 158 (6.22) 20 (0.79) 18 (0.71) 19 (0.75) 10 (0.39) 38 (1.50) 95 (3.74) 16.5 (0.45) Top view 3 x M3 THD Single Dual Triple 1 AC L AC L AC L 2 AC N AC N AC N 3 AC FG AC FG AC FG 4 –Vout No con. +Vout 3* 5 –Vout No con –Vout 3* 6 +Vout –Vout 1 –Vout 1 7 +Vout +Vout 1 +Vout 1 8 – –Vout 2 –Vout 2 9 – +Vout 2 +Vout 2 Connection Case Dimensions Weight: 0.7 kg (25 oz) Weight: 0.8 kg (28 oz) Single Dual Triple 1 AC L AC L AC L 2 AC N AC N AC N 3 AC FG AC FG AC FG 4 –Vout No con. +Vout 3* 5 –Vout No con –Vout 3* 6 +Vout –Vout 1 –Vout 1 7 +Vout +Vout 1 +Vout 1 8 – –Vout 2 –Vout 2 9 – +Vout 2 +Vout 2 Connection Max mounting screw penetration: 3.0 mm (0.12) * Opposite polarity for TXL 060-0534TI * Opposite polarity for TXL 100-0534TI http://www.tracopower.com Page 7 of 11 Enclosed Power Supplies TXL Series 15–1000 Watt Case Dimensions Case L 13 max. 198 (0.51 max.) (7.83) 50 (1.97 ) 99 (3.90) 10 (0.39) 28 (1.10) 79 (3.11) 10 (0.39) 168 (6.61) Vout L N ++ 49.5 (1.95) 2 x M4 thread (bottom) 65 (2.56) 63 (2.48) 117 (4.61) 56 25 (0.98) 12.5 (0.49) (2.20) 11.5 (0.45) (0.83) 21 (0.49) 12.5 176.5 (6.95) 6 x M4 THD 4 x M3 THD (bottom) Top view Weight: 0.89 kg (31 oz) 4x TXL-CMB chassis mount brackets included in shipment Max mounting screw penetration: 3.0 mm (0.12) http://www.tracopower.com Page 8 of 11 Enclosed Power Supplies TXL Series 15–1000 Watt Outline Dimensions 99 (3.9) 45 (1.77) Vout L N ++ 12 max. 198 (0.47 max.) (7.8) 117 (4.61) 56 25 (0.98) 12.5 (0.49) (2.20) 11.5 (0.45) (0.83) 21 (0.49) 12.5 176.5 (6.95) V adj. RC RS +--+ 65 (2.56) 10 (0.39) 168 (6.61) 63 (2.48) 6 x M4 THD air flow 10 (0.39) 28 (1.10) 79 (3.11) 49.5 (1.95) 2 x M4 THD (bottom) 4 x M3 THD (bottom) Top View 115 (4.53) 50 (1.97 ) 12 max. 212 (0.47 max.) (8.35) Vout L N +++ 7 (0.28) 177.5 (6.99) 87.5 (3.44) 10 (0.39) 95 (3.74) 54.5 (2.15) 29.5 (1.16) 150 (5.91) 50 (1.97) 32.5 (1.28) 4 x M4 THD 5 x M3 THD (bottom) (bottom) 29.5 (1.16) 150 ±0.8 (5.91 ±0.03) 25 ±0.8 (0.98 ±0.03) 12.5 (0.49) air flow 4 x M4 THD Weight: 1.05 kg (37 oz) Case N Case O Weight: 0.88 kg (30 oz) Max mounting screw penetration: 3.0 mm (0.12) RC Remote Control On/Off: RC+/RC–: 0–0.7 V = On 3–10 V = Off. RS Remote Sense Can be open or connected to the load under regard of polarity Connector 4x TXL-CMB chassis mount brackets included in shipment 4x TXL-CMB chassis mount brackets included in shipment http://www.tracopower.com Page 9 of 11 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. Enclosed Power Supplies TXL Series 15–1000 Watt Outline Dimensions Case P Weight: 3.5 kg (123 oz) Max mounting screw penetration: 3.0 mm (0.12) 30 20 13 39 220 16 25 210 40 6 113 6 12.5 30 240 5 40 220 15 34.5 20 8.5 5 16.5 30 16.5 275 S/N LABEL MODE L LABE L 63 125 6 (bottom) 6 (bottom) 113(bottom) 6 29(bottom) 240(bottom) 25 145 125 210 40 air flow CN3 pin consideration: Pin 1: Current sharing to interconnect up to 3 units at parallel operation Max power = units x 0.9, max deviation of voltage adjustment among units =100mV Pin 2: Power Good Signal. TTL (3mA max.): 0 – 1 VDC = DC-Off, 3.3 – 5.6 VDC = DC-OK Pin 3/4: Remote sense to be connected at load side under regard of polarity Pin 5/6: Remote control input RC1& RC2 Pin 7/8 Auxillary output 12VDC/0.1A for remote control function PSU PSU +v +v +v -v -v -v PSU +V -V LOAD RS-(PIN4) RS+(PIN3) CN3 7 5 3 1 8 6 4 2 CN3 7 5 3 1 8 6 4 2 CN3 7 5 3 1 8 6 4 2 +v +v +v -v -v -v +v +v +v -v -v -v CN3 Parallel operation: AUX RC2 GND 12V SW RC1 2K 330 AUX RC2 RC1 GND 5V SW 12V 470 2K 330 AUX RC2 GND 12V SW RC1 2K 330 Using internal 12V auxiliary output Using internal 12V auxiliary output Using external voltage Remote On/Off function: Mating connector: Housing: HRS DF11-08DS-2C Terminal: HRS DF11-EP22SCB Mating cable with 500mm flyind leeds included! TXL-CMB chassis mount bracket set (4pcs) included in shipment. For dimensions see page 11. Enclosed Power Supplies TXL Series 15–1000 Watt Page 10 of 11 Outline Dimensions Specifications can be changed any time without notice. Case Q Vadj + (10.70) CN15 LED 1 CN14 −V +V +S 5V_AUX DC_OK CS −S GND ON/OFF GND CN15 N L PE 2 4 6 8 1 3 5 7 (bottom) 271.7 3 x M4 THD 20.5 25.4 17.3 7.8 127.0 40.6 295.0 (11.61) 3 x M4 THD 239.5 34.5 18.5 90.0 68.0 air flow air flow (9.43) (1.36) (XXX) (both sides) (0.81) (3.54) (0.73) (5.00) (XXX) (0.31) (1.00) (2.68) Dimensions in [mm], () = Inch Tolerances ±0.8 (±0.03) Monting hole pich tolerances ±0.5 (±0.02) CN14 Jumper on CN14 disables the Remote Off function CN15 On/Off (pin 4 & 6): Contact closed = Power On, Contact open = Power Off CN15 –S/+S (pin 1 & 2): Remote sense to be connected at load side under regard of polarity CN15 5V Aux (pin 3 & 8): Auxiliary output 5 VDC / 0.5 A CN15 DC–OK (pin 5 & 8): TTL signal (2.2 mA max.): 0 – 1 VDC = DC–Off, 3.3 – 5.6 VDC = DC–OK CN15 CS (pin 7): Current Sharing to interconnect up to 4 units at parallel operation Max power = units x 0.9, max deviation of voltage adjustment among units =100mV Parallel operation: 8 6 4 2 7 5 3 1 8 6 4 2 7 5 3 1 8 6 4 2 7 5 3 1 -V +V -V +V -V +V LOAD CN15 PS1 CN15 PS2 CN15 PS3 CS CS CS -S +S -S +S -S +S +S -S Caution! Max mounting screw penetration: 3.0 mm (0.12) Weight: 1.9 kg (67 oz) TXL-CMB1 chassis mount bracket set (4pcs) included in shipment. For dimensions see page 11. Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com AC/DC Power Modules TXL Series 15–1000 Watt Page 11 of 11 Rev. November 15. 2013 Chassi Mount Brackets 17.5 5.6 15.0 16.8 7.5 7.5 15.0 12.5 5.0 Ø4.2 R0.5 7.5 7.5 5.0 10.0 4x7 R1.0 Note: 1. Material: S.P.C.C. 2. Thickness: 0.8mm 3. Treatment: Nickel plated 4. Unit: mm The chassi mount brackets are bypacked along with the following models: Order code: TXL-CMB contains 4pcs brackets and screws For series models: • TXL 150; Case L • TXL 230; Case N • TXL 350; Case O • TXL 750; Case P Order code: TXL-CMB1 contains 4pcs brackets and screws For series models: • TXL 1000; Case Q 5.0 4x7 R1.0 6.9 6.9 6.9 Ø4.2 7.8 12.7 4.9 13.8 15.0 2.8 11.2 5.6 8.6 25.4 http://www.tracopower.com Page 1 of 3 DC/DC Converters TEL 5 Series, 5 Watt Features ◆ Wide 2:1 input range ◆ Cost efficient SMD-design ◆ High power density ◆ High efficiency up to 86% ◆ Regulated outputs ◆ I/O isolation 1’500 VDC ◆ Indefinite short-circuit protection 24-pin DIP with industry standard pinout ◆ High reliability, MTBF >1 Mio. h ◆ Lead free design, RoHS compliant ◆ 3-year product warranty The TEL 5 Series is a range of DC/DC-converter modules with wide input range of 2:1. State of the art SMD-technology guarantees a product with very high reliability and excellent cost /performance ratio. High efficiency allows an operating temperature range of –40°C to +85°C at full load. This product series provides an economical solution for many cost critical applications in industrial and consumer electronics. Ordercode Input voltage range Output voltage Output current max. Efficiency typ. TEL 5-1210 3.3 VDC 1200 mA 77 % TEL 5-1211 9 – 18 VDC 5 VDC 1000 mA 81 % TEL 5-1212 (nominal 12 VDC) 12 VDC 500 mA 84 % TEL 5-1222 ±12 VDC ±250 mA 84 % TEL 5-1223 ±15 VDC ±200 mA 84 % TEL 5-2410 3.3 VDC 1200 mA 79 % TEL 5-2411 18 – 36 VDC 5 VDC 1000 mA 83 % TEL 5-2412 (nominal 24 VDC) 12 VDC 500 mA 86 % TEL 5-2422 ±12 VDC ±250 mA 86 % TEL 5-2423 ±15 VDC ±200 mA 86 % Models UL 60950-1 CB Scheme http://www.tracopower.com Page 2 of 3 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. Input Specifications Input current no load /full load 12 Vin models: 20 mA / 590 mA typ. 24 Vin models: 5 mA / 290 mA typ. Start-up voltage / 12 Vin models: 8.0 VDC / 8.0 VDC under voltage shut down 24 Vin models: 16.0 VDC / 16.0 VDC Surge voltage (1 sec. max.) 12 Vin models: 25 V max. 24 Vin models: 50 V max. Reverse voltage protection 1.0 A max. Output Specifications Voltage set accuracy ±1 % Regulation – Input variation Vin min. to Vin max. 0.3 % max. – Load variation 20 – 100 % single output models 1 % max dual output models balanced load 2 % max. Ripple and noise (20 MHz Bandwidth) 75 mVpk-pk max. Temperature coefficient ±0.02 %/K Output current limitation >120 % of Iout max., constant current Short circuit protection continuous (automatic recovery) Capacitive load single output models: 6800 μF max. dual output models: 1000 μF max. (each output) General Specifications Temperature ranges – Operating –40°C to +85°C – Case temperature +90°C – Storage –40°C to +125°C Derating (convection cooling) 3.3 %/K above 70°C Humidity (non condensing) 95 % rel H max. Reliability, calculated MTBF (MIL-HDBK-217F at +25°C, ground benign) >1 Mio. h Isolation voltage (60 sec.) – Input/Output 1’500 VDC Isolation capacitance – Input/Output 380 pF typ. Isolation resistance – Input/Output (500 VDC) >1‘000 M Ohm Switching frequency 300 kHz typ. Safety standards UL/cUL 60950-1, IEC/EN 60950-1 Safety approvals – CB report (SIQ) (IEC/EN 60950-1) www.tracopower.com/products/tel5-cb.pdf – CSA certification (UL 60950-1, CSA 60950-1-03) CSA File No. 226037 http://directories.csa-international.org www.tracopower.com/products/tel5-csa.pdf DC/DC Converters TEL 5 Series 5 Watt Page 3 of 3 Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com Physical Specifications Casing material non conductive plastic (UL 94V-0 rated) Weight 17 g (0.60 oz) Soldering temperature max. 265°C / 10 sec. Outline Dimensions mm (inches) 5.0 (0.2) 4.5 ±0.5 22.86 (0.9) 20.3 ±0.5 2.54 32 ±0.5 (1.25 ±0.02) 10.2 ±0.5 (0.4 ±0.02) 15.24 (0.6) 9 11 23 22 2 3 16 14 Bottom view 15.24 (0.6) 5.08 2.4 ±0.5 (0.8 ±0.02) (0.1 ±0.02) (0.18 ±0.02) (0.1) (0.2) Pin Single Dual 2 –Vin (GND) –Vin (GND) 3 –Vin (GND) –Vin (GND) 9 No pin Common 11 No con. –Vout 14 +Vout +Vout 16 –Vout Common 22 +Vin (Vcc) +Vin (Vcc) 23 +Vin (Vcc) +Vin (Vcc) Pin-Out Pin diameter ø 0.5 ±0.05 (0.02 ±0.002) Tolerances ±0.5 (±0.02) DC/DC Converters TEL 5 Series 5 Watt Rev. April 19. 2013 http://www.tracopower.com AC/DC Power Modules TMLM Series, 4 to 20 Watt The TMLM Series switching power supplies, offer highest power density in a fully encapsulated module which can be soldered directly on to PCBs. This feature makes these modules an ideal solution for all space critical applications in commercial and industrial electronic equipment. International safety approvals qualify the product for worldwide markets. SMD-technology and high efficiency guarantees a high reliability of these Power Supplies. Features ◆ AC/DC power modules for PCB mounting ◆ Highest power density ◆ Fully encapsulated plastic case ◆ Universal input 90–264 VAC, 47–440 Hz ◆ High efficiency ◆ EMI meets EN 55022, class B and FCC, level B ◆ Low ripple and noise ◆ Short circuit and overload protection ◆ 3-year product warranty Order Code Output Power max. Output 1 Output 2 Efficiency TMLM 04103 4.0 Watt 3.3 VDC / 1200 mA 68 % TMLM 04105 4.0 Watt 5.0 VDC / 800 mA 72 % TMLM 04109 4.0 Watt 9.0 VDC / 444 mA 75 % TMLM 04112 4.0 Watt 12 VDC / 333 mA 76 % TMLM 04115 4.0 Watt 15 VDC / 267 mA 76 % TMLM 04124 4.0 Watt 24 VDC / 167 mA 77 % TMLM 04253 3.5 Watt +5.0 VDC / 600 mA +3.3 VDC / 150 mA 72 % TMLM 04225 3.6 Watt +12 VDC / 250 mA +5.0 VDC / 120 mA 75 % TMLM 05103 4.1 Watt 3.3 VDC / 1250 mA 68 % TMLM 05105 5 Watt 5.0 VDC / 1000 mA 71 % TMLM 05112 5 Watt 12 VDC / 420 mA 75 % TMLM 05115 5 Watt 15 VDC / 333 mA 75 % TMLM 05124 5.5 Watt 24 VDC / 230 mA 77 % TMLM 10103 8.2 Watt 3.3 VDC / 2500 mA 74 % TMLM 10105 10 Watt 5.0 VDC / 2000 mA 79 % TMLM 10112 10 Watt 12 VDC / 833 mA 82 % TMLM 10115 10 Watt 15 VDC / 667 mA 78 % TMLM 10124 10 Watt 24 VDC / 417 mA 80 % TMLM 20103 12 Watt 3.3 VDC / 3600 mA 74 % TMLM 20105 18 Watt 5.0 VDC / 3600 mA 78 % TMLM 20112 20 Watt 12 VDC / 1660 mA 82 % TMLM 20115 20 Watt 15 VDC / 1330 mA 83 % TMLM 20124 20 Watt 24 VDC / 833 mA 83 % Models UL 60950-1 Page 1 of 4 http://www.tracopower.com AC/DC Power Modules TMLM Series 4 to 20 Watt Input Specifications Input voltage – Nominal 100 – 240 VAC – Range 90 – 264 VAC (universal input) – DC range 120 – 370 VDC Input frequency 47 – 440 Hz Input current at full load (115 VAC / 230 VAC) TMLM 04 models: 95 mA / 65 mA typ. TMLM 05 models: 110 mA / 70 mA typ. TMLM 10 models: 220 mA / 150 mA typ. TMLM 20 models: 385 mA / 250 mA typ. Inrush current (<2 ms) (115 VAC / 230 VAC) TMLM 04 models: 15 A max / 25 A max. TMLM 05 & TMLM 10 models: 10 A max / 20 A max. TMLM 20 models: 20 A max / 40 A max. External input fuse required (recommended value) 1.5 A slow blow type Output Specifications Voltage set accuracy ±2 % Regulation – Input variation 0.3 % max. (0.5% max. for TMLM 20 models, 3.0 % max for output 2) – Load variation TMLM 04; 3.3 VDC models: 1.0 % max. (0–100% load) TMLM 04 other models output 1: 0.5 % max. (0–100% load) TMLM 04 output 2: 5.0 % max. (25–100% load) TMLM 05 & TMLM 10 models: 0.5 % max. (5–100% load) TMLM 20 models: 1.0 % max. (5–100% load) Minimum load 0 % (25% for dual output models) operation at 0-load condition will not damage these power supplies, however, they may not meet all listed specifications Ripple and noise (20 MHz bandwidth) TMLM 04; 3.3 VDC models: <250 mV TMLM 04; 5.0 VDC models: <200 mV TMLM 04; other models: <100 mV TMLM 05 & TMLM 10; 3.3 & 5.0 VDC models: <130 mV TMLM 05 & TMLM 10; 12 & 15 VDC models: <210 mV TMLM 05 & TMLM 10; 24 VDC models: <280 mV TMLM 20; 3.3 & 5.0 VDC models: <200 mV TMLM 20; 12 VDC model: <240 mV TMLM 20; 15 VDC model: <300 mV TMLM 20; 24 VDC model: <480 mV Current limitation 120 – 180 % fold back Short circuit protection indefinite (automatic recovery) Overvoltage protection by Zehner diode (main output only) 120 % of Vout typ. Page 2 of 4 Max. capacitive load [μF] Model series Output: TMLM 04 TMLM 05 TMLM 10 TMLM 20 Single output models: 3.3 VDC 14‘000 13‘800 75‘000 4‘500 5.0 VDC 8‘000 6‘000 40‘000 3‘500 9.0 VDC 2‘400 - - - 12 VDC 1‘000 1‘400 8‘500 1‘800 15 VDC 700 1‘000 3‘500 1‘500 24 VDC 220 170 1‘200 1‘200 Dual output models: 5.0 VDC / 3.3 VDC 5‘600 / 4‘700 - - - 12 VDC / 5.0 VDC 330 / 4‘700 - - - http://www.tracopower.com Page 3 of 4 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. General Specifications Temperature ranges – Operating –25°C to +60°C – Storage (non operating) –40°C to +85°C Derating 3.75 %/K above +50°C TMLM 20 models: 2.5 %/K above +40°C Temperature coefficient 0.02 %/K Humidity (non condensing) 95 % rel max. Switching frequency approx. 100 kHz Hold-up time (115 VAC / 230 VAC) TMLM 20 models: 12 ms / 56 ms other models: 15 ms min. Isolation voltage (60 sec.) – Input/ Output 3‘000 VAC Leakage current TMLM 04 models: 0.25 mA max. TMLM 05 models: 0.75 mA max. TMLM 10 models: 0.25 mA max. TMLM 20 models: tba. Reliability /calculated MTBF (MIL-HDBK-217F, at +25°C, ground benign) >330’000 h TMLM 20 models: >250’000 h Electromagnetic compatibility (EMC), emissions EN 55022, class B, FCC part 15, level B Electromagnetic compatibility (EMC), immunity EN 61000-6-2: 2005 Degree of protection class II to IEC/EN 60536 Safety standards UL 60950-1, IEC/EN 60950-1 Safety approvals – UL/cUL 60950-1 www.ul.com -> certifications -> File e188913 – CB test certificate IEC 60950-1 for 4W models: www.tracopower.com/products/tmlm04-cb.pdf – CB test certificate IEC 60950-1 for other models: www.tracopower.com/products/tmlm-cb.pdf Environment – Vibration acc. IEC 60068-2-6; 3 axes, sine sweep, 10-55 Hz, 1g, 1oct/min. – Shock acc. IEC 60068-2-27 20 G (3 directions each 3 times) Environmental compliance – Reach www.tracopower.com/products/tmlm-reach.pdf – RoHS RoHS directive 2011/65/EU Casing material Plastic resin with fiberglass (UL 94V-0 rated) TMLM 04 Models: 21.5 (0.85) 36.5 (1.44) 2 x 3.75 (2 x 0.15) 3.75 (0.15) 1 2 3 4 7 6 5 27.0 (1.06) 3.0 21.0 (0.83) (0.12) 17.1 (0.67) 4.0 (0.16) Bottom view Pin-Out Weight: 26 g (0.92 oz) Pin diameter: 0.5 (0.02) (ntc = not to connect) Outline Dimensions Pin Single Dual 1 ntc ntc 2 +Vout Vout 1 3 –Vout Common 4 ntc Vout 2 5 AC (L) AC (L) 6 AC (N) AC (N) 7 ntc ntc AC/DC Power Modules TMLM Series 4 to 20 Watt Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com AC/DC Power Modules TMLM Series 4 to 20 Watt Weight: 30 g (1.06 oz) Pin diameter: 1.0 (0.04) Rev. September 27. 2013 Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) Pin pitch tolerance: ±0.3 (±0.012) Max mounting screw penetration: 3.0 mm (0.12) TMLM 10 Models: Weight: 54 g (1.91 oz) Page 4 of 4 Outline Dimensions AC 25.4 (1.00) 20.32 (0.80) 10.16 (0.40) Bottom view 2.6 (0.81) 2.54 (0.10) 45.72 (1.80) 50.8 (2.00) AC +Vout – Vout 15.16 (0.59) 8.0 (0.31) 23.5 (0.93) 8.0 (0.31) AC 27.2 (1.07) 20.32 (0.80) 10.16 (0.40) Bottom view 3.5 (0.13) 3.4 (0.13) 45.72 (1.80) 52.4 (2.06) AC +Vout – Vout M3 THD 13.65 (0.54) 4.50 (0.18) AC 27.2 (1.07) 20.32 (0.80) 10.16 (0.40) Bottom view 3.5 (0.13) 3.4 (0.13) 45.72 (1.80) 52.4 (2.06) AC +Vout – Vout 23.5 (0.93) 8 (0.31) M3 THD 13.65 (0.54) 4.50 (0.18) TMLM 20 Models: Pin diameter: 1.0 (0.04) Pin diameter: 1.0 (0.04) TMLM 05 Models: Weight: 59 g (2.08 oz) http://www.tracopower.com Features ◆ Ultra compact, low profile plastic casing ◆ Fully encapsulated (pollution/dust) ◆ Single-, dual- and triple output models ◆ 2 package versions: - Screw terminal block for chassis mount - Solder pins for direct PCB mount ◆ DIN-rail mount adaptor (optional) ◆ Universal input 85-264 VAC, 47-440 Hz ◆ Protection class ll ◆ IEC/EN/UL 60950-1 approval, CB-report ◆ Over-temperature protection ◆ Protection against short circuit and oveload ◆ 3-year product warranty The TMP & TMPM series AC/DC Power Modules is a new range of fully encapsulated power supplies in an ultra-compact casing. They feature easy chassis mounting with screw terminal block connection or direct PCB mounting with solder pins. Full compliance with International safety standards for industrial control equipment qualifies the products for worldwide markets. These power supplies offer a cost effective solution for many space critical applications in commercial and industrial electronic equipment and for polluted and dusty environment. AC/DC Power Modules TMP & TMPM Series, 4 to 60 Watt Page 1 of 9 15 to 60 Watt and multi output models see next page --> CB Scheme UL 60950-1 UL 508 Order code Output power max. Output Efficiency PCB-mount with solder pins typ. TMPM 04103 3.3 VDC / 1200 mA 70 % TMPM 04105 5.0 VDC / 800 mA 72 % TMPM 04109 9.0 VDC / 444 mA 75 % TMPM 04112 4 W 12 VDC / 333 mA 76 % TMPM 04115 15 VDC / 267 mA 76 % TMPM 04124 24 VDC / 167 mA 77 % TMP 07103 4.6 W 3.3 VDC / 1400 mA 70 % TMP 07105 5.0 VDC / 1400 mA 73 % TMP 07112 7 W 12 VDC / 583 mA 78 % TMP 07115 15 VDC / 466 mA 78 % TMP 07124 24 VDC / 291 mA 78 % TMPM 10103 8.3 W 3.3 VDC / 2500 mA 70 % TMPM 10105 5.0 VDC / 2000 mA 72 % TMPM 10112 10 W 12 VDC / 833 mA 76 % TMPM 10115 15 VDC / 667 mA 75 % TMPM 10124 24 VDC / 417 mA 72 % TMP 10103 6.6 W 3.3 VDC / 2000 mA 70 % TMP 10105 5.0 VDC / 2000 mA 73 % TMP 10112 10 W 12 VDC / 833 mA 76 % TMP 10115 15 VDC / 666 mA 76 % TMP 10124 24 VDC / 416 mA 76 % Single Output Models 4 to 10 Watt Low profile Small footprint http://www.tracopower.com AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt Page 2 of 9 Order code Output power max. Output Efficiency PCB-mount with solder pins Chassis mount, screw terminal typ. TMP 15105 TMP 15105C 5 VDC / 3000 mA 75 % TMP 15112 TMP 15112C 12 VDC / 1250 mA 79 % TMP 15115 TMP 15115C 15 W 15 VDC / 1000 mA 79 % TMP 15124 TMP 15124C 24 VDC / 625 mA 79 % TMP 15148 TMP 15148C 48 VDC / 310 mA 79 % TMP 30105 TMP 30105C 5 VDC / 6000 mA 78 % TMP 30112 TMP 30112C 12 VDC / 2500 mA 80 % TMP 30115 TMP 30115C 30 W 15 VDC / 2000 mA 80 % TMP 30124 TMP 30124C 24 VDC / 1250 mA 80 % TMP 30148 TMP 30148C 48 VDC / 625 mA 80 % TMP 60105 TMP 60105C 51 W 5.1 VDC / 10‘000 mA 79 % TMP 60112 TMP 60112C 12 VDC / 5000 mA 82 % TMP 60115 TMP 60115C 15 VDC / 4000 mA 83 % TMP 60124 TMP 60124C 60 W 24 VDC / 2500 mA 84 % TMP 60136 TMP 60136C 36 VDC / 1665 mA 84 % TMP 60148 TMP 60148C 48 VDC / 1250 mA 84 % Single Output Models 15 to 60 Watt Peak current, total power not to exceede 30 Watt: 1) 133 % 2) 150 % 3) 200 % Order code Output Output 1 Output 2 Output 3 Eff. PCB-mount Chassis mount power typ. Models with common ground TMPM 04212 +12 VDC / 166 mA –12 VDC / 166 mA 77 % TMPM 04215 4 W +15 VDC / 133 mA –15 VDC / 133 mA 77 % TMPM 04253 +5.0 VDC / 600 mA +3.3 VDC / 150 mA 72 % TMPM 04225 +12 VDC / 250 mA +5.0 VDC / 120 mA 75 % TMP 10212 10 W +12 VDC / 380 mA –12 VDC / 380 mA 77 % TMP 10215 +15 VDC / 300 mA –15 VDC / 300 mA 77 % TMP 15212 TMP 15212C 15 W +12 VDC / 650 mA –12 VDC / 650 mA 79 % TMP 15215 TMP 15215C +15 VDC / 500 mA –15 VDC / 500 mA 79 % TMP 30212 TMP 30212C 30 W +12 VDC / 1300 mA –12 VDC / 1300 mA 80 % TMP 30215 TMP 30215C +15 VDC / 1000 mA –15 VDC / 1000 mA 80 % Models with output 1 isolated from output 2/3 (floating) TMP 15252 TMP 15252C 5.0 VDC / 1500 mA 12 VDC / 625 mA 72 % TMP 15512 TMP 15512C 15 W 5.0 VDC / 2000 mA +12 VDC / 200 mA –12 VDC / 200 mA 74 % TMP 15515 TMP 15515C 5.0 VDC / 2000 mA +15 VDC / 150 mA –15 VDC / 150 mA 74 % TMP 30252 TMP 30252C 5.0 VDC / 3000 mA2) 12 VDC /1250 mA2) 76 % TMP 30512 TMP 30512C 5.0 VDC / 3000 mA2) +12 VDC / 600 mA2) –12 VDC / 600 mA2) 76 % TMP 30515 TMP 30515C 30 W 5.0 VDC / 3000 mA2) +15 VDC / 500 mA2) –15 VDC / 500 mA2) 76 % TMP 30522 TMP 30522C 5.0 VDC / 3000 mA2) +12 VDC / 1000 mA2) –12 VDC / 250 mA3) 76 % TMP 30316 TMP 30316C 3.3 VDC / 4000 mA1) +5.0 VDC / 1500 mA1) +12 VDC / 250 mA3) 71 % TMP 30317 TMP 30317C 5.0 VDC / 4500 mA1) +3.3 VDC / 1000 mA2) +12 VDC / 250 mA3) 71 % Multi Output Models 4 to 30 Watt http://www.tracopower.com AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt Page 3 of 9 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. Max. capacitive load [μF] Model series Output: TMPM 04 TMP 07 TMPM 10 TMP 10 TMP 15 TMP 30 TMP 60 Single output models: 3.3 VDC 1200 2200 2200 3900 - - - 5.0 / 5.1 VDC 800 2200 2200 3300 3900 8000 8000 9.0 VDC 440 - - - - - - 12 / 15 VDC 260 1000 1000 2200 2200 3900 3900 24 VDC 160 680 680 1000 1000 1500 1500 36 VDC - - - - - - 1000 48 VDC - - - - 680 1000 800 Dual output models: 3.3 / 5.0 VDC 4700 - - - 2000 3900 - +12 / –12 / +15 / –15 VDC 260 - - 1000 1500 1500 - Triple output models: 3.3 / 5.0 VDC - - - - 2200 2200 - +12 / –12 / +15 / –15 VDC - - - - 1500 1500 - Input Specifications Input voltage – nominal 100 – 240 VAC – AC range (universal input) 85 – 264 VAC – DC range 120 – 370 VDC Input frequency – nominal 50 / 60 Hz – range 4 – 30 W models: 47 – 440 Hz 60 W models: 47 – 63 Hz Input current at full load – 115 VAC / 230 VAC input 4 W models: 80 mA / 55 mA typ. 7 W models: 150 mA / 100 mA typ. 10 W models: 200 mA / 130 mA typ. 15 W models: 300 mA / 190 mA typ. 30 W models: 550 mA / 330 mA typ. 60 W models: 1050 mA / 670 mA typ. External input fuse required (recommended value) 4 W models: 1.0 A slow blow 7 – 15 W models: 2.0 A slow blow 30 W models: 3.5 A slow blow 60 W models: 6.3 A slow blow Output Specifications Voltage set accuracy ±2 % max. Regulation – Input variation Output 1 1 % max. – Input variation Output 2/3 3 % max. – Load variation TMPM 04103 model (0–100%): 1.5 % max. single and floating outputs (10–100%): 1 % max. (0–100% for TMPM 04 models) common ground outputs balanced load (10–100%): 2.5 % max. common ground outputs unbalanced load (20/90%): 5.0 % max. Minimum load TMPM 04 single and sym.dual models: not required TMPM 04 asym. dual models: 25% per output single and dual output models: 10 % of rated max. current triple output models main output: 10 % of rated max. current triple output models auxiliary outputs: 20 % of rated max. current operation at lower load condition will not damage these power supplies, however, they may not meet all listed specifications. Ripple and noise (20MHz bandwidth) 3.3 VDC & 5.0 VDC outputs: 1.8 % of Vout [mVp-p] other outputs: 1.0 % of Vout [mVp-p] Overload protection by current limit 105 % min. of Inom, fold back, automatic recovery (long term overload condition may cause damage to the power supply) Overvoltage protection by Zehner diode (main output only) 120 % of Vout typ. Start-up time 400 ms typ. Hold-up time 20 ms typ. http://www.tracopower.com Page 4 of 9 AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. General Specifications Temperature ranges – Operating TMPM 04 models: –25°C to +60°C (no derating) TMP 10 models: –25°C to +50°C (no derating) other models: –25°C to +70°C (with derating) – Storage (non-operating) –40°C to +85°C Power derating 3.3 %/K above +50°C to +65°C 5.0 %/K above +65°C to +70°C (no derating aproved for TMPM04 and TMP10 models) Over temperature protection at 90°C (automatic recovery at 67°C) Temperature coefficient 0.02 %/K Humidity (non-condensing) 95 % rel. H max. Switching frequency 100 kHz typ. fixed Isolation voltage (60 sec.) – Input/Output 3‘000 VAC Isolation resistance – Input/Output 100 MOhm (at 500 VDC) Altitude during operation TMP 10, TMPM 04 & 10, : 2‘000 m max. (6’560 ft) approved other models: 3‘000 m max. (9‘840 ft) approved Electromagnetic compatibility (EMC), Emissions EN 61000-6-3: 2007 EN 61204-3: 2000, class A EN 55022, level B, FCC Part 15 level B Electromagnetic compatibility (EMC), Immunity EN 61000-6-2: 2005 EN 61204-3: 2000, class A – Electrostatic discharge ESD EN 61000-4-2 8 kV / 4 kV, criteria B – RF field susceptibility EN 61000-4-3 10 V/m, criteria A – Electrical fast transient / burst immunity input EN 61000-4-4 ±2 kV, criteria B – Electrical fast transient / burst immunity output EN 61000-4-4 ±2 kV, criteria B – Surge immunity line – neutral EN 61000-4-5, ±1 kV, criteria B – Surge immunity output EN 61000-4-5 ±0.5 kV, criteria B – Immunity to conducted RF disturbances EN 61000-4-6 10 V, criteria B – Mains voltage dips and interruptions EN 61000-4-11 30 % 10 ms, criteria B 60 % 100 ms, criteria C 95 % 5000 ms, criteria C EMC test certificates www.tracopower.com/products/tmp-emc.pdf Protection class II to IEC/EN 60536 Safety standards – Information technology equipment IEC/EN 60950-1, UL 60950-1 – Industrial control equipment UL/cUL 508 (chassis mount single and symetric dual output models only) Safety approvals – CB certificate for IEC 60950-1 TMPM 04 models: www.tracopower.com/products/tmpm04-cb.pdf TMP 07 models: www.tracopower.com/products/tmp07-cb.pdf TMP 10 models: www.tracopower.com/products/tmp10-cb.pdf TMPM 10 models: www.tracopower.com/products/tmpm10-cb.pdf TMP 15 models: www.tracopower.com/products/tmp15-cb.pdf TMP 30 single output models: www.tracopower.com/products/tmp30-cb.pdf TMP 30 dual / triple output models: www.tracopower.com/products/tmp30-cb2.pdf TMP 60 models: www.tracopower.com/products/tmp60-cb.pdf – UL approvals for UL 60950-1 www.ul.com -> certifications -> File: e188913 – UL approval for UL 508 (chassis mount models only) www.ul.com -> certifications -> File: e322109 Reliability /calculated MTBF TMP 07, TMPM 04 & 10 models: >330‘000 h (MIL-HDBK-217F, at +25°C, ground benign) TMP 10 models: >300‘000 h TMP 15 models: >280‘000 h TMP 30 models: >250‘000 h TMP 60 models: >125‘000 h Casing material plastic resin + fiberglass (UL 94V-0 rated) Environmental compliance – Reach www.tracopower.com/products/tmp-reach.pdf – RoHS RoHS directive 2011/65/EU http://www.tracopower.com Page 5 of 9 AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt Outline Dimensions Pin diameter: 1.0 (0.04) TMP 07 models: TMP 10 models: Weight: 44 g (1.55 oz) Dimensions in [mm], ( ) = Inches Case tolerances: ±0.5 (±0.02) Pin pich tolerance: ±0.25 (±0.01) 19.3 0.5 6.0 5.0 (0.02) (0.24) (0.76) (0.20) 5.0 (0.20) 2 1 4 3 10.16 25.4 20.32 2.54 45.72 50.80 (0.40) (1.00) (0.80) (0.10) Bottom view (1.80) (2.00) 2.54 (0.10) Pin Single 1 AC (N) 2 AC (L) 3 +Vout 4 –Vout Pinout 2 1 5 4 3 10.16 10.16 45.0 17.78 19.0 0.5 6.0 54.0 64.0 5.0 (0.40) (0.40) (1.77) (0.70) (0.02) (0.24) (0.75) (0.20) 5.0 (0.20) Bottom view (2.13) (2.52) 4.0 (0.16) 22.5 (0.89) Pin Single Dual 1 AC (N) AC (N) 2 AC (L) AC (L) 3 –Vout Vout 2 4 ntc com.1/2 5 +Vout Vout 1 Pinout Pin diameter: 1.0 (0.04) Weight: 92 g (3.25 oz) (ntc = not to connect) TMPM 10 models: 23.5 0.7 10.0 5.0 (0.03) (0.39) (0.93) (0.20) 5.0 (0.20) 2 1 4 3 10.16 27.2 20.32 3.45 45.72 52.4 (0.40) (1.07) (0.80) (0.14) Bottom view (1.80) (2.06) 3.35 (0.13) Pin Single 1 AC (N) 2 AC (L) 3 +Vout 4 –Vout Pinout Pin diameter: 1.0 (0.04) Weight: 54 g (1.90 oz) 7.50 (0.30) Bottom view 14.00 (0.55) 2x3.75 (2x0.15) 3.75 (0.15) 36.5 (1.44) 27.0 (1.06) 3.00 21.00 (0.83) (0.12) 7.50 (0.30) 25.25 (0.99) 17.1 (0.67) 4.0 (0.16) 1 2 3 4 5 6 7 TMPM 04 models: Pin diameter: 0.5 (0.02) Weight: 26 g (0.92 oz) Pin Single Dual 1 ntc 2 ntc 3 +Vout Vout 1 4 –Vout com.1/2 5 ntc Vout 2 6 AC (N) 7 AC (L) Pinout (ntc = not to connect) http://www.tracopower.com Page 6 of 9 AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt Outline Dimensions TMP 15 models for PCB mount: TMP 15 models for chassis mount: Dimensions in [mm], ( ) = Inches Case tolerances: ±0.5 (±0.02) Pin pich tolerance: ±0.25 (±0.01) Mounting hole tolerance: ±0.25 (±0.02) 2 1 6 5 4 11.43 54.0 20.32 62.0 74.0 (0.45) (2.13) (0.80) Bottom view (2.44) (2.91) 3 8.89 (0.35) 7 27.0 (1.06) 11.43 (0.45) 8.89 (0.35) 2 x M4 THD 19.9 (0.78) 19.9 (0.78) 40.0 (1.57) 6.0 (0.24) 19.3 0.5 6.0 5.0 (0.02) (0.24) (0.76) (0.20) 5.0 (0.20) Pin Single Dual sym. Dual asym. Triple 1 AC (N) 2 AC (L) 3 no pin Vout 3 4 –Vout Vout 2 –Vout 2 com.2/3 5 no pin com.1/2 +Vout 2 Vout 2 6 +Vout Vout 1 –Vout 1 –Vout 1 7 no pin +Vout 1 +Vout 1 Pin-Out 3 4 5 6 7 1 2 Top view 86.0 96.0 (3.39) (3.78) 5.0 (0.20) 54.0 (2.13) 4.0 (0.16) 46.0 (1.81) 10.0 76.0 (2.99) (0.39) 23.3 (0.92) 5.0 (0.20 11.8 (0.46) 4 x ø3.5 Pin Single Dual sym. Dual asym. Triple 1 AC (N) 2 AC (L) 3 ntc Vout 3 4 –Vout Vout 2 –Vout 2 com.2/3 5 ntc com.1/2 +Vout 2 Vout 2 6 +Vout Vout 1 –Vout 1 –Vout 1 7 ntc +Vout 1 +Vout 1 Connection (ntc = not to connect) Pin diameter: 1.0 (0.04) Weight: 114 g (4.02 oz) Weight: 162 g (5.71 oz) Max Screw penetration: 5.5 (0.21) http://www.tracopower.com Page 7 of 9 AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt Outline Dimensions TMP 30 models for PCB mount: 2 1 6 5 4 63.5 31.75 81.3 88.9 (2.50) (1.25) Bottom view (3.20) (3.50) 7 3 27.94 (1.10) 12.70 (0.50) 15.24 (0.60) 2 x M4 THD 27.5 (1.08) 3.8 (0.15) 5.0 (0.20) 27.65 (1.09) 12.70 (0.50) 15.24 (0.60) 27.94 (1.10) 21.5 0.5 6.0 5.0 (0.02) (0.24) (0.85) (0.20) 5.0 (0.20) Pin Single Dual sym. Dual asym. Triple 1 AC (N) 2 AC (L) 3 +Vout Vout 1 +Vout 2 Vout 2 4 no pin / ntc +Vout 1 +Vout 1 5 –Vout com.1/2 –Vout 2 com 2/3 6 no pin / ntc –Vout 1 –Vout 1 7 ntc Vout 2 ntc Vout 3 Pinout / Connection (ntc = not to connect) Dimensions in [mm], ( ) = Inches Case tolerances: ±0.5 (±0.02) Pin pich tolerance: ±0.25 (±0.01) Mounting hole tolerance: ±0.25 (±0.02) Pin diameter: 1.0 (0.04) Weight: 177 g (6.24 oz) TMP 30 models for chassis mount: Weight: 191 g (6.74 oz) 3 4 5 6 7 1 2 Top view 100.0 112.0 (3.94) (4.41) 6.0 (0.24) 63.8 (2.51) 6.9 (0.27) 50.0 (1.97) 4 x ø3.5 10.0 92.0 (3.62) (0.39) 25.6 (1.01) 5.0 (0.20) 11.8 (0.46) Max Screw penetration: 5.5 (0.21) http://www.tracopower.com Page 8 of 9 AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt Outline Dimensions TMP 60 models for chassis mount: (ntc = not to connect) Dimensions in [mm], ( ) = Inches Case tolerances: ±0.5 (±0.02) Mounting hole tolerance: ±0.25 (±0.02) Weight: 357 g (12.95 oz) Pin Single 1 AC (N) 2 AC (L) 3 ntc 4 +Vout 5 ntc 6 –Vout 7 ntc Connection 3 4 5 6 7 1 2 Top view 100.0 112.0 (3.94) (4.41) 6.0 (0.24) 67.8 (2.67) 8.9 (0.35) 50.0 (1.97) 4 x ø3.5 10.0 92.0 (3.62) (0.39) 38.0 (1.50) 5.0 (0.20) 11.8 (0.46) TMP 60 models for PCB mount: 2 1 6 4 67.5 33.75 81.3 89.0 (2.66) (1.33) Bottom view (3.20) (3.50) 7 3 27.94 (1.10) 12.70 (0.50) 15.24 (0.60) 2 x M4 THD 27.5 (1.08) 3.85 (0.15) 5.55 (0.219) 27.05 (1.065) 12.70 (0.50) 15.24 (0.60) 27.94 (1.10) 34.0 0.5 6.0 5.0 (0.02) (0.24) (1.34) (0.20) 5.0 (0.20) Weight: 345 g (12.17 oz) Pin diameter: 2.0 (0.08) Pin Single 1 AC (N) 2 AC (L) 3 no pin 4 +Vout 6 –Vout 7 no pin Pinout Max Screw penetration: 5.5 (0.21) Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com Page 9 of 9 AC/DC Power Modules TMP & TMPM Series 4 to 60 Watt DIN-Rail Mounting Kit Order code For models TMP-MK1 TMP 15xxxC TMP-MK2 TMP 30xxxC & TMP 60xxxC DIN-Rail Mounting Kit Adapter for mounting on DIN-rails as per EN 50022-35 (snap-on mounting) Specifications can be changed any time without notice. Kit contains interface plate, DIN-rail clip and necessary screws. Rev. June 19. 2013 http://www.farnell.com/datasheets/1749862.pdf http://www.tracopower.com Page 1 of 3 DC/DC Converters TMR 2 Series, 2 Watt Features ◆ Wide 2:1 input voltage range ◆ Compact SIP-8 package ◆ Small footprint ◆ Full SMD design ◆ Temperature range –40° to +85°C ◆ High efficiency ◆ Excellent load and line regulation ◆ Indefinite short-circuit protection ◆ I/O isolation 1000VDC ◆ Remote On/Off control ◆ Fully RoHS compliant ◆ 3-year product warranty Ordercode Input voltage range Output voltage Output current max. Efficiency typ. TMR 0510 3.3 VDC 500 mA 76 % TMR 0511 5 VDC 400 mA 80 % TMR 0512 4.5 – 9.0 VDC 12 VDC 165 mA 81 % TMR 0521 (5 VDC nominal) ±5 VDC ±200 mA 79 % TMR 0522 ±12 VDC ±85 mA 82 % TMR 0523 ±15 VDC ±65 mA 81 % TMR 1210 3.3 VDC 500 mA 77 % TMR 1211 5 VDC 400 mA 81 % TMR 1212 9 – 18 VDC 12 VDC 165 mA 83 % TMR 1221 (12 VDC nominal) ±5 VDC ±200 mA 81 % TMR 1222 ±12 VDC ±85 mA 83 % TMR 1223 ±15 VDC ±65 mA 84 % TMR 2410 3.3 VDC 500 mA 78 % TMR 2411 5 VDC 400 mA 81 % TMR 2412 18 – 36 VDC 12 VDC 165 mA 83 % TMR 2421 (24 VDC nominal) ±5 VDC ±200 mA 80 % TMR 2422 ±12 VDC ±85 mA 83 % TMR 2423 ±15 VDC ±65 mA 82 % TMR 4810 3.3 VDC 500 mA 76 % TMR 4811 5 VDC 400 mA 78 % TMR 4812 36 – 75 VDC 12 VDC 165 mA 83 % TMR 4821 (48 VDC nominal) ±5 VDC ±200 mA 80 % TMR 4822 ±12 VDC ±85 mA 81 % TMR 4823 ±15 VDC ±65 mA 81 % Models The TMR-2 series is a family of isolated 2W dc-dc converter modules with regulated output, featuring wide 2:1 input voltage ranges. The product comes in a compact SIP-8 plastic package with small footprint occupying only 2.0 cm2 (0.3 square in.) of board space. An excellent efficiency allows –40° to +85°C operation temperatures. Further features include remote On/Off control and continuous short circuit protection. The ultra-compact dimensions of these converters make them an ideal solution for many space critical applications in communication equipment, instrumentation and industrial electronics. UL 60950-1 http://www.tracopower.com Page 2 of 3 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. DC/DC Converters TMR 2 Series 2 Watt Input Specifications Input current at full load (nominal input) 5 Vin models: 645 mA max. 12 Vin models: 242 mA max. 24 Vin models: 117 mA max. 48 Vin models: 62 mA max. Surge voltage (100 msec. max.) 5 Vin models: 15 V max. 12 Vin models: 36 V max. 24 Vin models: 50 V max. 48 Vin models: 100 V max. Input voltage variation (dv/dt) 5 V/ms, max. (complies to ETS 300 132 part. 4.4) Input Filter capacitor type Start up time 5 ms typ. (at nominal input and resistive load) ESD (electrostatic discharge) EN 61000-4-2, air ±8 kV, contact ±6 kV, perf. criteria A Radiated immunity EN 61000-4-3, 10 V/m, perf. criteria A Fast transient / surge (with external input capacitor) EN 61000-4-4, ±2 kV, perf. criteria A EN 61000-4-5, ±1 kV perf. criteria A – external input capacitor Nippon chemi-con KY 220 μF, 100 V, ESR 48 mOhm Conducted immunity EN 61000-4-6, 10 Vrms, perf. criteria A Output Specifications Voltage set accuracy ±1 % Regulation – Input variation Vin min. to Vin max. 0.2 % max. – No load to full load single output models: ±1.0 % max. dual output models: ±1.0 % max. – Load variation 10 – 90 % single output models: ±0.5 % max. dual output models: ±0.8 % max. dual output models asymetric load: 5.0 % max. (25% / 100%) Minimum load 0 % Ripple and noise (20 MHz Bandwidth) 50 mVpk-pk max. Temperature coefficient ±0.02 %/°C Transient response (25% load step change) 500 μs typ. Short circuit protection continuous, automatic recovery Capacitive load 3.3 VDC / 5 VDC output models: 2’200 μF max. / 1’000 μF max. 12 VDC / ±5 VDC output models: 170 μF max. / ±470 μF max. ±12 VDC / ±15 VDC output models: 100 μF max. / ±47 μF max. General Specifications Temperature ranges – Operating –40°C to +85°C (non derating) – Storage –55°C to +125°C Derating (convection cooling) 2 %/K above 75°C Humidity (non condensing) 95 % rel. H max. Reliability, calculated MTBF (Telcordia SR-332, 50% stress, Ta=40°C) 5.1 Mio. h Isolation voltage (60 sec.) – Input/Output 1’600 VDC Isolation capacitance – Input/Output 200 pF max. Isolation resistance – Input/Output (500 VDC) >1‘000 MOhm Switching frequency 100 to 650 kHz (PFM) Page 3 of 3 Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com DC/DC Converters TMR 2 Series 2 Watt Outline Dimensions mm (inches) Bottom view 3.2 (0.13) 0.5 (0.02) 0.25 (0.01) 2.54 2.0 ±0.5 2.54 21.8 5.08 2.54 0.5 (0.02) 11.1 (0.44) (0.08 (0.1) (0.1) (0.1) ±0.025) (0.2) 4.0 2.54 (0.1) 2.54 (0.1) (0.86) (0.16) 9.2 (0.36) 1 2 3 5 6 7 8 Pin Single Dual 1 –Vin (GND) –Vin (GND) 2 +Vin (Vcc) +Vin (Vcc) 3 Remote On/Off Remote On/Off 5 No function No function 6 +Vout +Vout 7 –Vout Common 8 No function –Vout Pin-Out Rev. August 09/13 Dimensions in [mm], () = Inch Pin pitch tolerances: ±0.25 (±0.01) Tolerances: ±0.5 (±0.02) General Specifications Remote On/Off – On: open or high impedance – Off: 2...4 mA input current applied via 1KW resistor – Off stand by input current max. 2.5 mA Safety standards UL/cUL 60950-1, IEC/EN 60950-1 Safety approvals – UL/cUL www.ul.com -> certifications -> File e188913 Thermal shock, mechanical shock & vibration MIL-STD-810F – Test conditions www.tracopower.com/products/mil810.pdf Environmental compliance – Reach www.tracopower.com/products/tmr2-reach.pdf – RoHS RoHS Directive 2011/65/EU Altitude – operation < 40’000ft (12’000m) – non operation < 50’000ft (15’000m) – test report www.tracopower.com/products/tmr-altitude.pdf Physical Specifications Casing material non-conductive plastic Potting material epoxy (UL 94V-0-rated) Weight 4.8 g (0.17oz) Physical Specifications Application note: www.tracopower.com/products/tmr2-application.pdf http://www.tracopower.com Page 1 of 4 DC/DC Converters TMR 1 & TMR 1SM Series, 1 Watt Order code SIP-package Order code SMD-package Input voltage range Output voltage Output current max. Efficiency SIP typ. Efficiency SMD typ. TMR 1-0511 TMR 1-0511SM 5.0 VDC 200 mA 76 % 78 % TMR 1-0512 TMR 1-0512SM 12 VDC 83 mA 77 % 79 % TMR 1-0513 TMR 1-0513SM 4.5 – 9.0 VDC 15 VDC 67 mA 79 % 81 % TMR 1-0515 (5 VDC nominal) 24 VDC 42 mA 76 % TMR 1-0522 TMR 1-0522SM ±12 VDC ±42 mA 77 % 79 % TMR 1-0523 TMR 1-0523SM ±15 VDC ±33 mA 78 % 80 % TMR 1-1211 TMR 1-1211SM 5.0 VDC 200 mA 77 % 79 % TMR 1-1212 TMR 1-1212SM 12 VDC 83 mA 77 % 79 % TMR 1-1213 TMR 1-1213SM 9.0 – 18 VDC 15 VDC 67 mA 80 % 82 % TMR 1-1215 (12 VDC nominal) 24 VDC 42 mA 77 % TMR 1-1222 TMR 1-1222SM ±12 VDC ±42 mA 79 % 81 % TMR 1-1223 TMR 1-1223SM ±15 VDC ±33 mA 78 % 80 % TMR 1-2411 TMR 1-2411SM 5.0 VDC 200 mA 77 % 79 % TMR 1-2412 TMR 1-2412SM 12 VDC 83 mA 80 % 82 % TMR 1-2413 TMR 1-2413SM 18 – 36 VDC 15 VDC 67 mA 80 % 82 % TMR 1-2415 (24 VDC nominal) 24 VDC 42 mA 77 % TMR 1-2422 TMR 1-2422SM ±12 VDC ±42 mA 80 % 82 % TMR 1-2423 TMR 1-2423SM ±15 VDC ±33 mA 80 % 82 % TMR 1-4811 TMR 1-4811SM 5.0 VDC 200 mA 77 % 79 % TMR 1-4812 TMR 1-4812SM 12 VDC 83 mA 78 % 80 % TMR 1-4813 TMR 1-4813SM 36 – 75 VDC 15 VDC 67 mA 78 % 80 % TMR 1-4815 (48 VDC nominal) 24 VDC 42 mA 76 % TMR 1-4822 TMR 1-4822SM ±12 VDC ±42 mA 79 % 81 % TMR 1-4823 TMR 1-4823SM ±15 VDC ±33 mA 79 % 81 % Models Features ◆ Wide 2:1 input voltage range ◆ Compact SIP-6 or SMD package ◆ Fully regulated outputs ◆ Cost optimised design ◆ No minimum load required ◆ Continuous short circuit protection ◆ Temperature range –40°C to +85°C ◆ I/O isolation 1500 VDC ◆ Remote On/Off control (SMD) ◆ 3-year product warranty The TMR-1 and TMR 1SM series are families of isolated 1 W dc-dc converter modules with regulated output, featuring wide 2:1 input voltage ranges. These products come in a compact SIP-6 or SMD package with small footprint occupying only 1.2 cm2 (0.2 square inch) of board space. An excellent efficiency allows –40°C to +85°C operation temperature. Further features include remote On/Off control (SMD-Version) and continuous short circuit protection. The compact dimensions and cost optimised design make this converters an ideal solution for applications in communication equipment, instrumentation and industrial electronics. CB Scheme http://www.tracopower.com Page 2 of 4 All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated. DC/DC Converters TMR 1 & TRM 1SM 1 Watt Input Specifications Input current at no load (nominal input voltage) 5.0 V models: 40 mA typ. 12 V models: 20 mA typ. 24 V models: 10 mA typ. 48 V models: 7 mA typ. Surge voltage (1 sec. max.) 5.0 V models: 15 V max. 12 V models: 25 V max. 24 V models: 50 V max. 48 V models: 100 V max. Start-up voltage / under voltage lockout 5.0 V models: 4.5 VDC / 4 VDC or lower 12 V models: 9 VDC / 8.5 VDC or lower 24 V models: 18 VDC / 17 VDC or lower 48 V models: 36 VDC / 34 VDC or lower long term operation at undervoltage will damage the converter! Conducted noise (input) EN 55022 level A, FCC part 15, level A with external capacitor. see EMC consideration Recommended input fuse (slow blow) 5 V models: 500 mA 12 V models: 250 mA 24 V models: 120 mA 48 V models: 60 mA Output Specifications Voltage set accuracy ±1 % max. Regulation – Input variation Vin min. to Vin max. 0.2 % max. – No load to full load Single & Dual output models: ±1.0 % max. – Load variation 10 – 90% Single output models: ±0.5 % max. Dual output models (balanced load): ±0.8 % max. Minimum load no minimum load required Temperature coefficient 0.02 %/K Ripple and noise (20 MHz bandwidth) SMD models: 30 mVp-p max. SIP models: 50 mVp-p max. Transient response setting time (25% load step change) 250 μs typ. (PFM) Current limitation >120 % of Iout max. Short circuit protection continuous, automatic recovery Capacitive load 5 VDC models: 1‘680 μF max. 12 VDC models: 820 μF max. 15 VDC models: 680 μF max. 24 VDC models: 470 μF max. ±12 VDC models: 470 μF max. (each output) ±15 VDC models: 330 μF max. (each output) General Specifications Temperature ranges – Operating SIP models: –40°C to +85°C with no derating SMD models: –40°C to +82°C with derating – Case temperature +105°C (SIP) / +95°C (SMD) max. – Storage –55°C to +125°C Load derating SMD models: 7.2 %/K above +75°C Humidity (non condensing) 95 % rel. H max. Reliability, calculated MTBF (MIL-HDBK-217F, at +25°C, ground benign) >2.8 Mio h Page 3 of 4 DC/DC Converters TMR 1 & TRM 1SM 1 Watt General Specifications Isolation voltage (60 sec.) – Input/Output 1’500 VDC Isolation capacitance – Input/Output 50 pF max. Isolation resistance – Input/Output (500 VDC) >1 GOhm Switching frequency 220 kHz (PFM) Safety standards UL 60950-1, IEC/EN 60950-1 IEC 60950-1:2005 (2nd Edition); Am 1:2009 EN 60950-1:2006+A11:2009+A1:2010+A12:2011 Safety approvals – CB test certificate (IEC 60950-1) www.tracopower.com/products/tmr1-cb.pdf Remote On/Off – On: < 0.6 VDC or open circuit (SMD models only) – Off: 2.7 to 15 VDC (ref. to –Vin) – Off standby current: 2.5 mA max. – Off control input current: 1 mA max. Physical Specifications Casing material non-conductive plastic (UL94V-0 rated) Potting material epoxy, (UL 94V-0 rated) Weight 3.1 g (0.11oz) (SIP)/3.3 g (0.12oz) (SMD) Soldering profile for SIP-package models max. 265°C / 10 sec. (wave soldering) Lead-free reflow solder process for SMD-package models as per J-STD-020D.01 (to find at: www.jedec.org - free registration required) Moisture sensivity level (for SMD-package models) level 2a as per J-STD-033B.01 (to find at: www.jedec.org - free registration required) Environmental compliance – Reach www.tracopower.com/products/reach-declaration.pdf – RoHS RoHS directive 2011/65/EU EMC Consideration +Vin -Vin +Vout -Vout C1 C2 L1 Load +Vin -Vin +Vout -Vout C1 C2 L1 Load Com. Load Single output models Input models C1 C2 L1 5 VDC 4.7μF /50V, 1210 X7R 4.7μH / 1.2 A, SR0302 12 VDC 4.7μF /50V, 1210 X7R 4.7μH / 1.2 A, SR0302 24 VDC SIP 4.7μF /50V, 1210 X7R 18μH / 0.58 A, SR0302 24 VDC SMD 4.7μF /50V, 1210 X7R 220pF /2 kV, 1808 X7R 12μH / 0.75 A, SR0302 48 VDC SIP 4.7μF /100V 1210 X7R 18μH / 0.58A, SR0302 48 VDC SMD 2.2μF / 00V 1210 X7R 18μH / 0.58A, SR0302 Dual output models Filter suggestion for to comply with EN55022 class A conducted noise emission Outline Dimensions mm (inches) Page 4 of 4 Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at www.tracopower.com www.tracopower.com Rev. August 30. 2013 DC/DC Converters TMR 1 & TRM 1SM 1 Watt Pin single output dual output 1 –Vin (GND) –Vin (GND) 2 +Vin (Vcc) +Vin (Vcc) 4 +Vout +Vout 5 No Pin Common 6 –Vout –Vout Pinout Bottom view 1 2 5 6 2.5 2.54 0.5 2.3 ±0.4 2.54 17.0 (0.67) 5.08 (0.2) 2.54 0.5 (0.02) 11.0 (0.4) 3.2 (0.13) (0.02) 0.5 (0.02) (0.09 (0.1) (0.1) (0.1) ±0.02) 7.62 (0.30) (0.10) (0.02) 4 0.5 0.25 (0.01) Dimensions in [mm], () = Inch Tolerances: ±0.5 (±0.02) Pin pitch tolerances: ±0.25 (±0.01) SIP-Package SMD-Package 1 6 7 14 9 8 2 13.7 [0.54] 17.2 [0.68] 8.45 [0.33] 8.7 [0.34] 0.25 [0.01] 1.00 [0.04] 18.9 [0.74] 12.7 [0.5] [0.1] 1.8 [0.1] 2.54 0~4 S SEATING PLANE 0.15 S 1.1 [0.04] 15.0 [0.6] Pin single output dual output 1 –Vin (GND) –Vin (GND) 2 Remote On/Off Remote On/Off 6 ntc Common 7 ntc –Vout 8 +Vout +Vout 9 –Vout Common 14 +Vin +Vin Pinout ntc = not to connect to electrical circuit SOURIAU Contacts and tooling For series UTP,UTS,UTG,UTO,MBG Contacts 13 Amps Diam 1.6mm Manu. Part No. Stock N° Gender mm² Crimping Tools RM20M12K 273‐2951 Male 0.32‐0.52 RC20M12K 273‐2917 Female 0.32‐0.52 RM16M23K 273‐2945 Male 0.52‐1.50 RC16M23K 273‐2901 Female 0.52‐1.50 Y16RCM RM14M30K 687‐6367 Male 1.5‐2.5 RC14M30K 687‐6370 Female 1.5‐2.5 SM16ML1TK6 437‐3762 Male 0.80‐1.50 Y14MTV SC16ML1TK6 437‐3778 Female 0.80‐1.50 RM16SE0K 510‐1079 Male 0.52‐1.50 Solder RC16SE4K 510‐1085 Female 0.52‐1.50 Contacts 5 Amps Diam 1.00 mm Manu. Part No. Stock N° mm² Crimping Tools Gender SM24WL3S26 687‐6392 Male 0.13‐0.25 SC24WL3S26 687‐6383 Female 0.13‐0.25 SM20WL3S26 540‐410 Male 0.35‐0.50 Y14MTV SC20WL3S25 540‐422 Female 0.35‐0.50 RM18W3K 191‐046 Male 0.50‐1.00 MH860 + 86‐5 RC18W3K 190‐908 Female 0.50‐1.00 Tooling Manu. Part No. Stock N° Description Y16RCM 481‐008 Crimp Tool Y14MTV 480‐998 Crimp Tool MH860 314‐8408 Crimp Tool 86‐5 314‐8414 Positioner for MH860 RX2025GE1 481‐046 Extraction tool RX20D44 233‐2731 Extraction tool 851 Series MIL-DTL-26482 Connectors 3 851 Sommaire / Contents • Sommaire / Contents............................................................... • Etendue de la gamme / Product Overview...................... • Présentation / Presentation.................................................... • Description / Description........................................................ • Tableau comparatif références SOURIAU et normes équivalentes / Cross reference list...................................... • Caractéristiques techniques / Technical characteristics. • Contacts / Contacts ................................................................ • Références / Ordering information...................................... • Arrangements / Contact layouts.......................................... • Positionnements / Orientations............................................. • Encombrements Connecteurs Etanches / Dimensions Environmental Connectors..................................................... • Encombrements Connecteurs Hermétiques / Dimensions Hermetic Connectors............................................................. • Encombrements Connecteurs pour connexions enroulées et à picots droits / Dimensions Wire-wrap and PC tail Connectors....................................................................................... • Perçage cloison / Panel cut-out............................................ 3 3 4-5 6 7-8 9 10 11-13 14-15 16 17-38 39-40 40-41 41 • Accessoires / Accessories..................................................... • Bouchons / Caps....................................................................... • Références des raccords / Backshell ordering information................................................................................... • Outillages / Tools....................................................................... • Notice de câblage / Wiring instructions............................ • Sertissage / Crimping............................................................... • Schémas d’implantations pour circuits imprimés / Coordinates for PC tail............................................................. • Prise largable push-pull / Push-pull lanyard release plug................................................................................................ • Connecteurs filtres 8F51 / 8F51 filter connector........... • Connecteurs spécifiques & accessoires SNC / Specific products & SNC accessories.................................................. • Traversée de cloison 851 RJ45 / 851 RJ45 feedthru.. • Traversée de cloison 851 USB / 851 USB feedtrhu..... • 8XE / 8XE.................................................................................... • Protection sans cadmium / Cadmium free plating......... 42 44-45 46-47 48-50 51 52-54 55-59 60-61 62 63 65-68 69-72 73-76 77 851 page 4-63 851 RJ45 Feedthru page 65-68 851 USB Feedthru page 69-72 8XE page 73-76 Etendue de la gamme / Product Overview 4 851 Présentation • Versions étanches et hermétiques • Large choix de raccords et accessoires • Protection cadmiée vert olive, oxydée anodique noire, nickelée ou zinc nickel • Contacts à souder, à sertir, à picot droit ou pour enroulement de fils • Contacts spéciaux thermocouples • La version 851 avec contacts à souder est qualifiée QPL (USA) • La gamme 851 est aussi commercialisée par un réseau de distributeurs. Les connecteurs circulaires 851 Souriau, initialement conçus pour la connexion des circuits électriques en aéronautique et armement, ont aujourd’hui conquis les domaines diversifiés de l’électricité et de l’électronique industrielles (Mesure, Instrumentation, Transport, Machine, Outil, Productique…). Ils correspondent aux normes et spécifications internationales et nationales en vigueur MIL-DTL-26482G série 1, NFC 93422, HE 301B, VG 95328, liste GAM/T1. Les connecteurs fixes (embases) et mobiles (fiches), mâles ou femelles, se verrouillent entre eux par un système mécanique endurant du type à baïonnette à 3 rampes hélicoïdales. Cinq clavettes de guidage longitudinal et cinq positionnements angulaires possibles de l’isolant assurent le détrompage entre connecteurs. Les mécaniques sont en alliage d’aluminium traité et protégé pour la version 851 étanche, et en acier protégé pour la version 851 hermétique. Les isolants sont en élastomère de la classe +125°C pour la version étanche et en verre pour la version hermétique. Les contacts sont dorés ou étamés sur sous-couche nickel. Nous proposons, afin de faciliter le câblage, des contacts à souder et à picot taille 20 (y compris version hermétique) avec protection dorure sur la partie avant et étamage sur la partie arrière. 5 851 Presentation • Sealed and hermetic types • Wide choice of body styles and back fittings • Olive green, black anodised, nickel or zinc nickel plated • Solder, crimp, PC-tail and wire-wrap versions • Thermocouple crimp contacts available • The 851 version with solder contacts is on US QPL • 851 connectors are also widely available from distributors. Souriau 851 circular connectors were originally conceived to ensure reliable electrical connections in aircraft but their lightweight compact size and general characteristics have contributed to successful adoption in numerous civil and military aviation applications and also in the fields of professional and general electronics (machine tools, automation, measuring equipment…). 851 connectors conform to the following international standards, MIL-DTL-26482G series 1, NFC 93422, HE 301B, VG 95328, GAM/T1 list. 851 connectors feature a positive bayonet coupling mechanism which ensures reliable mechanical and electrical connection between mating halves. A helical locking ring on the plug couples with three dowel pegs on the receptacle ensuring rapid locking. Orientation and location is ensured by a system of five raised keys on the plugs which couple with corresponding slots on the receptacles. Connectors with different angular positioning of the insulator relative to the shell can be provided to prevent mating of adjacent connectors with the same contact arrangements. The connector shells are manufactured from aluminium alloy. The insulators are moulded from elastomer and are bonded into the shells. Grommets are also made from elastomer and are supplied with appropriate accessories in the solder version, but are integral with the insulator for the crimp version. Copper alloy contacts have gold or tin over nickel plating. Hermetic receptacles with gold plated solder contacts are made from steel shells with nickel plating (01H) or yellow cadmium plating (02H and 07H). The contacts are permanently fused into a glass insulator providing a high level of sealing. To facilitate cabling we offer solder and straight spill contacts size 20 (including hermetic versions) with a gold plated active part and tin plated terminations. 6 851 Description Connecteurs assemblés avec contacts à sertir à clips Connectors with clip retained crimp contacts Connecteurs assemblés (embase avec contacts à picots ou avec contacts pour connexions enroulés) Connectors assemblies (receptacle with PC tail or wire-wrap terminals) Connecteurs assemblés avec contacts à souder Connectors assemblies with solder contacts 1 • Isolant arrière (passe-fils) 2 • Contact femelle à sertir 3 • Isolant femelle 4 • Isolant mâle 5 • Contact mâle à sertir 6 • Raccord simple 7 • Corps de fiche 8 • Embase 1 • Rear insulator (grommet) 2 • Female crimp contact 3 • Female insulator 4 • Male insulator 5 • Male crimp contact 6 • Backnut 7 • Plug body 8 • Receptacle 1 • Contact femelle à souder 2 • Contact mâle à souder 3 • Isolant femelle 4 • Isolant mâle 5 • Isolant arrière (passe-fils) 6 • Embase à collerette carrée 7 • Raccord simple 8 • Corps de fiche 9 • Ecrou de fixation 10 • Embase à fixation par écrou 11 • Raccord simple (pour embase à fixation par écrou) 1 • Female solder contact 2 • Male solder contact 3 • Female insulator 4 • Male insulator 5 • Rear insulator (grommet) 6 • Square flange receptacle 7 • Backnut 8 • Plug body 9 • Fixing nut 10 • Jam nut receptacle 11 • Backnut (for jam nut receptacle) 1 • Contact mâle ou femelle à souder ou à sertir 2 • Contact mâle ou femelle à picots droits 3 • Contact mâle ou femelle pour connexions enroulées 4 • Isolant mâle ou femelle 5 • Isolant arrière (passe-fils) 6 • Corps de fiche 7 • Raccord simple 8 • Isolant mâle ou femelle 9 • Embase sans possibilité de raccord 1 • Male or female crimp or solder contact 2 • Male or female PC tail contact 3 • Male or female wire-wrap contact 4 • Male or female insulator 5 • Rear insulator (grommet) 6 • Plug body 7 • Backnut 8 • Male or female insulator 9 • Receptacle not suitable for backshells 7 851 * Non QPL - Not QPL 22.1631 Connecteurs avec raccords / Connectors with backshells SOURIAU NCF 93422 (modèle HE 301B) MIL-DTL-26482G série 1 VG 95328 851 00 R .. .. .. 50 .. HE 301 B 00 R .. .. .. 1A * MS 3120 E .. .. .. VG 95328 A .. .. .. 851 00 RC .. .. .. 50 .. HE 301 B 00 RC .. .. .. 1A * MS 3120 F .. .. .. VG 95328 B .. .. .. 851 00 RP .. .. .. 50 .. HE 301 B 00 RP .. .. .. 1A * MS 3120 P .. .. .. 851 00 RG .. .. .. 50 .. VG 95328 R .. .. .. 851 00 RA .. .. .. 50 .. HE 301 B 00 RA .. .. .. 1A 851 01 R .. .. .. 50 .. HE 301 B 01 R .. .. .. 1A * MS 3121 E .. .. .. 851 01 RC .. .. .. 50 .. HE 301 B 01 RC .. .. .. 1A * MS 3121 F .. .. .. 851 01 RP .. .. .. 50 .. HE 301 B 01 RP .. .. .. 1A * MS 3121 P .. .. .. 851 01 RA .. .. .. 50 .. HE 301 B 01 RA .. .. .. 1A 851 02 R .. .. .. 50 .. HE 301 B 02 R .. .. .. 1A * MS 3122 E .. .. .. VG 95328 C .. .. .. 851 06 R .. .. .. 50 .. HE 301 B 06 R .. .. .. 1A * MS 3126 E .. .. .. 851 06 RC .. .. .. 50 .. HE 301 B 06 RC .. .. .. 1A * MS 3126 F .. .. .. VG 95328 K .. .. .. 851 06 RP .. .. .. 50 .. HE 301 B 06 RP .. .. .. 1A * MS 3126 P .. .. .. 851 06 RT .. .. .. 50 .. VG 95328 J .. .. .. 851 06 RA .. .. .. 50 .. HE 301 B 06 RA .. .. .. 1A 851 36 RG .. .. .. 50 .. VG 95328 M .. .. .. 851 36 RA .. .. .. 50 .. 851 07 R .. .. .. 50 .. HE 301 B 07 R .. .. .. 1A * MS 3124 E .. .. .. VG 95328 D .. .. .. 851 07 RC .. .. .. 50 .. HE 301 B 07 RC .. .. .. 1A * MS 3124 F .. .. .. VG 95328 E .. .. .. 851 07 RP .. .. .. 50 .. HE 301 B 07 RP .. .. .. 1A * MS 3124 P .. .. .. 851 07 RT .. .. .. 50 .. VG 95328 S .. .. .. 851 07 RG .. .. .. 50 .. VG 95328 T .. .. .. 851 76 RU .. .. .. 50 .. 851 08 RC .. .. .. 50 .. HE 301 B 08 RC .. .. .. 1A 851 08 RP .. .. .. 50 .. HE 301 B 08 RP .. .. .. 1A Tableau comparatif / Cross refence list Version 851 avec contacts à sertir (protection vert olive) 851 Version with crimp contacts (olive green cadmium plating) Autres protections / Other plating Protections Plating SOURIAU NFC 93422 Version à souder (modèle HE 301B) Solder version Version à sertir Crimp version Anodique noire Black anodised 851 .. .. .. .. 5029 851 .. .. .. .. .. 50031 HE 301B .. .. .. .. .. 4A Nickelé Nickel 851 .. .. .. .. 5044 851 .. .. .. .. .. 5044 HE 301B .. .. .. .. .. 5A 8 851 Connecteurs avec raccords / Connectors with backshells SOURIAU NCF 93422 (modèle HE 301B) MIL-DTL-26482G série 1 VG 95328 851 00 E .. .. .. 50 .. HE 301 B 00 E .. .. .. 1A MS 3110 E .. .. .. 851 00 EC .. .. .. 50 .. HE 301 B 00 EC .. .. .. 1A MS 3110 F .. .. .. 851 00 AC .. .. .. 50 .. HE 301 B 00 AC .. .. .. 1A 851 00 P .. .. .. 50 .. HE 301 B 00 P .. .. .. 1A MS 3110 P .. .. .. 851 00 A .. .. .. 50 .. HE 301 B 00 A .. .. .. 1A 851 00 J .. .. .. 50 .. HE 301 B 00 J .. .. .. 1A 851 00 JC .. .. .. 50 .. MS 3110 J .. .. .. 851 01 E .. .. .. 50 .. HE 301 B 01 E .. .. .. 1A MS 3111 E .. .. .. 851 01 EC .. .. .. 50 .. HE 301 B 01 EC .. .. .. 1A MS 3111 F .. .. .. 851 01 AC .. .. .. 50 .. HE 301 B 01 AC .. .. .. 1A 851 01 P .. .. .. 50 .. HE 301 B 01 P .. .. .. 1A MS 3111 P .. .. .. 851 01 A .. .. .. 50 .. HE 301 B 01 A .. .. .. 1A 851 01 J .. .. .. 50 .. HE 301 B 01 J .. .. .. 1A 851 01 JC .. .. .. 50 .. MS 3111 J .. .. .. 851 02 E .. .. .. 50 .. HE 301 B 02 E .. .. .. 1A MS 3112 E .. .. .. VG 95328 H .. .. .. 851 06 E .. .. .. 50 .. HE 301 B 06 E .. .. .. 1A MS 3116 E .. .. .. 851 06 EC .. .. .. 50 .. HE 301 B 06 EC .. .. .. 1A MS 3116 F .. .. .. 851 06 AC .. .. .. 50 .. HE 301 B 06 AC .. .. .. 1A 851 06 P .. .. .. 50 .. HE 301 B 06 P .. .. .. 1A MS 3116 P .. .. .. 851 06 A .. .. .. 50 .. HE 301 B 06 A .. .. .. 1A 851 06 J .. .. .. 50 .. HE 301 B 06 J .. .. .. 1A 851 06 JC .. .. .. 50 .. MS 3116 J .. .. .. 851 08 EC .. .. .. 50 .. HE 301 B 08 EC .. .. .. 1A 851 08 P .. .. .. 50 .. HE 301 B 08 P .. .. .. 1A 851 07 E .. .. .. 50 .. HE 301 B 07 E .. .. .. 1A MS 3114 E .. .. .. 851 07 EC .. .. .. 50 .. HE 301 B 07 EC .. .. .. 1A MS 3114 F .. .. .. 851 07 AC .. .. .. 50 .. HE 301 B 07 AC .. .. .. 1A 851 07 P .. .. .. 50 .. HE 301 B 07 P .. .. .. 1A MS 3114 P .. .. .. 851 07 A .. .. .. 50 .. HE 301 B 07 A .. .. .. 1A Tableau comparatif / Cross refence list Version 851 avec contacts à souder (protection vert olive) 851 Version with solder contacts (olive green cadmium plating) Version 851 hermétique / 851 Hermetic version SOURIAU NFC 93422 (modèle HE 301B) MIL-DTL-26482G série 1 VG 95328 851 02 H .. .. P.50 HE 301 B 02 H .. .. P.3A 851 07 H .. .. P.50 HE 301 B 07 H .. .. P.3A * MS 3114 H .. .. .. P. VG 95328 F .. .. .. 851 I H .. .. P.50 HE 301 B 1 H .. .. P.3A * MS 3113 H .. .. .. P. VG 95328 G .. .. . * Non QPL - Not QPL 9 851 Caractéristiques techniques / Technical characteristics Tension de tenue • A pression normale : connecteurs accouplés et non accouplés - 1500 Veff entre contacts taille 20 (service 1) - 2300 Veff entre contacts taille 16 (service 2) - 1500 Veff entre contacts panachés de taille 16 et de taille 20 (service 1) • A basse pression 10 mbar : connecteurs accouplés et non accouplés - 200 Veff entre contacts taille 20 (service 1) - 300 Veff entre contacts taille 16 (service 2) Résistance d’isolement ≥ 5000 MΩ sous 500 Vcc Intensité admissible par contact Taille 20 = 7,5 A / Taille 16 = 13 A Résistance de contact • Version étanche : Taille 20 ≤ 4 mΩ / Taille 16 ≤ 3 mΩ • Version hermétique : Taille 20 ≤ 30 mΩ / Taille 16 ≤ 14 mΩ Blindage 70 dB à 5 MHz / 40 dB à 100 MHz Tension de claquage mini Breakdown voltage (mini) Electriques Boîtier • Version étanche : alliage d’aluminium - Protection : - cadmié vert olive - oxydation anodique noire - cadmium incolore - nickelé satiné brillant - zinc cobalt (vert olive) - zinc nickel • Version hermétique : acier - Protection : - cadmié jaune irisé - nickelé Isolant • Partie avant : élastomère néoprène (dureté 85 shore) • Partie arrière (passe-fils) : élastomère néoprène (dureté 40 shore) Contact • A sertir : montable et démontable par l’arrière de l’isolant et retenu par clips métalliques, à souder et à picot non démontable, à connexion enroulée démontable et non démontable • Matière : alliage cuivreux • Protection : or ou or sur parties actives et étain/plomb sur parties raccordement • Effort mini de rétention des contacts dans l’isolant • Endurance mécanique : 500 cycles complets (verrouillage et déverrouillage) Vibration Selon NFC 20-616 Mécaniques Shell • Environmental version : aluminium alloy - Plating : - olive green cadmium - black anodised - white cadmium - satin finish bright nickel - zinc cobalt (olive green) - zinc nickel • Hermetic version : steel - Plating : - iridescent yellow cadmium - nickel Isolant • Front section : neoprene elastomer (85 shore) • Rear section : neoprene elastomer (40 shore) Contact • Crimp : inserted and removed from rear of insulator retained by metallic clips, solder Mechanical Taille des contacts A sertir à clip A souder A picot A wrapper 20 (Ø1mm) ≥ 68 N ≥ 68 N 16 (Ø1.6mm) ≥ 113 N ≥ 113 N Contact size Crimp Solder PC tail Wire wrap 20 (Ø1mm) ≥ 68 N ≥ 68 N 16 (Ø1.6mm) ≥ 113 N ≥ 113 N Working temperature -55°C to +125°C Sealing • Crimp contact version, 1 bar differential pressure, leakage ≤ 8 cm3/hr • Solder contact version, 2 bar differential pressure, leakage ≤ 16 cm3/hr Hermiticity • 1 bar differential pressure, leakage ≤ 2.8 mm3/hr Chemical resistance : to MIL-DTL-26482G series 1 and NFC 93422 - HE 301 B code A Resistance to salt spray • 48 hours at environmental temperature Damp heat : 21 days Climatic • Mechanical endurance : 500 cycles (full mating-unmating) Vibration To NFC 20-616 Dielectric withstanding voltage • At standard pressure : mated and unmated connectors - 1500 Vrms between size 20 contacts (service 1) - 2300 Vrms between size 16 contacts (service 2) - 1500 Vrms between mixed size 20 and 16 contacts (service 1) • At reduced pressure 10 mbar : connectors mated and unmated - 200 Vrms between size 20 contacts (service1) - 300 Vrms between size 16 contacts (service2) Insulation resistance ≥ 5000 MΩ under 500 Vcc Current rating per contact Size 20 = 7.5 A / Size 16 = 13 A Contact resistance • Environmental version : Size 20 ≤ 4 mΩ / Size 16 ≤ 3 mΩ • Hermetic version : Size 20 ≤ 30 mΩ / Size 16 ≤ 14 mΩ Shielding 70 dB to 5 MHz / 40 dB to 100 MHz Température d’utilisation -55°C à +125°C Etanchéité • Version contact à sertir sous pression différentielle de 1 bar, fuite ≤ 8 cm3/heure • Version contact à souder sous pression différentielle de 2 bars, fuite ≤ 16 cm3/heure Herméticité • Sous pression différentielle de 1 bar, fuite ≤ 2,8 mm3/heure Tenue aux agents chimiques : suivant norme MIL-DTL-26482G série 1 et NFC 93422 - HE 301 B code A Résistance au brouillard salin • 48 heures, à température ambiante Chaleur humide : 21 jours Climatiques and PC tail, non removable, wire-wrap removable or not removable • Material : copper alloy • Plating : gold overall or gold plated active zone and tin/lead plated termination • Min retention force of contacts in insulator Electrical 10 851 Contacts à sertir / Crimp contacts Type de contact / Contact type Taille de contact Contact size Références Part numbers Câble admissible Cable acceptance Ø extérieur sur gaine Ø over insulation Section (mm²) Jauge Gauge AWG min. max. standards standard mâle male pour arrangements 8-2, 8-3, 8-4 & 12-14 for layouts 8-2, 8-3, 8-4 & 12-14 20 8500-9573* 0.21 à/to 0.93 24 à/to 18 1.20 2.11 femelle female 8500-9213 900* mâle male autre arrangement for further contact layout 8500-697 femelle female 8500-1758A 900 mâle male 16 8500-1300 0.93 à/to 1.91 18 à/to 14 1.60 2.80 femelle female 8500-9331 900 embout réducteur reducing sleeve 20 8500-781 B1 0.06 à/to 0.21 30 à/to 24 16 8500-1985 B1 0.60 20 thermocouple thermocouple chromel mâle male 20 8500-809 A 0.21 à/to 0.93 24 à/to 18 1.20 2.11 alumel 8500-812 A chromel femelle female 8500-2054 900 alumel 8500-2055 900 chromel mâle male 16 8500-1053 0.93 à/to 1.91 18 à/to 14 1.60 2.80 alumel 8500-1058 chromel femelle female 8500-1054 900 alumel 8500-1059 900 Contacts Contacts pour connexions enroulées / Wire-wrap contacts Type de contact Contact type Taille de contact Contact size Références Part numbers Diagonales Diagonals Jauge Gauge (AWG) Nombre d’enroulements Number of wraps mâle male 20 8500-4220 MQ 0.78 0.85 26 28 30 3 femelle female 8500-9351 900 0.78 0.85 26 28 30 3 mâle male 16 8500-4304 LY 1.55 1.70 20 22 24 26 3 femelle female 8500-4305 900 1.55 1.70 20 22 24 26 3 * Ne pas utiliser avec embout réducteur / Not to be used with reducing sleeve 11 851 Racine / Basic series Version à souder / Solder version Version à sertir / Crimp version 851 851 00 00 E R 8 8 3A 3A P P - - 50 50 - - - - - - Type de boîtier / Shell type à souder à sertir solder crimp 00 00 01 01 02E 02R 07 07 07A 06 06 08 08 36 36 76 76 Type de raccord / Backshell type Voir tableau page 12 - See table page 12 Taille de boîtier / Shell size 8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 Arrangements / Contact layouts Voir tableau page 14/15 - See table page 14/15 Type de contact / Contact type P = mâle/male - S = femelle/female Positionnement / Orientation Normal (n’apparaît pas dans la référence) w, x, y, z - voir tableau page 16 Normal (not included in part number) w, x, y, z - see table page 16 Indice obligatoire / Obligatory suffix B 50 51 52 54 Spécification / Specification sans spécification: protection cadmiée vert olive / without specification: olive green cadmium plating 29 031 44 38 42 66 Q7 R3 G4 Références / Ordering Information Connecteurs étanches / Environmental connectors embase à collerette carrée avec possibilité de raccord square flange receptacle accepting backshells prolongateur / cable connecting receptacle embase à collerette carrée sans possibilité de raccord square flange receptacle not accepting backshells embase à fixation par écrou avec possibilité de raccord jam nut receptacle accepting backshells embase à fixation par écrou sans possibilité de raccord jam nut receptacle not accepting backshells fiche droite sans bague de blindage plug for use with straight backshells fiche avec raccord coudé sans bague de blindage plug for use with 90° backshells fiche droite avec bague de blindage screened plug for use with straight backshells fiche droite avec bague de blindage et doigt de verrouillage screened plug with lock finger version à sertir sans clip avec arrangements 8-2 / 8-3 / 8-4 / 12-14 crimped version without clip which used layouts 8-2 / 8-3 / 8-4 / 12-14 contacts à sertir: dorés, toutes tailles / crimp contacts: gold plated, all sizes contacts à souder: taille 20, contacts dorés en partie active + étamés en partie arrière sauf arrangements 8-2, 8-3, 8-4 &12-14; taille 16, contacts dorés; mixte taille 20 & 16, contacts dorés / Solder contacts: size 20, contacts with gold plated active zone + tin plated termination area except layouts 8-2, 8-3, 8-4 &12-14; size 16, gold plated contacts all over; Mix size 20 & 16, gold plated contacts all over contacts à souder taille 20: dorés / solder contacts gold plated size 20 protection zinc cobalt vert olive (contacts: idem spécif.50) / zinc cobalt olive green plated (contacts idem specif.50) protection zinc nickel noir (contacts: idem spécif.50) / black zinc nickel plating (contacts idem specif.50) protection oxydation anodique noire (version à souder) / black anodised (solder version) protection oxydation anodique noire (version à sertir) / black anodised (crimp version) protection nickelée / nickel plating protection nickelée / nickel plating protection cadmiée vert olive / olive green cadmium plating version à sertir: livrée sans raccord, ni bague conique /crimp version: delivered without backshell, nor conical ring version à souder: idem version à sertir + sans grommet / solder version: idem crimp version + no grommet protection cadmiée vert olive, 500 heures brouillard salin - versions à sertir et à souder / olive green cadmium plating, salt spray 500 hr - crimp and solder versions protection cadmiée vert olive, 500 heures brouillard salin - versions à picots / olive green cadmium plating, salt spray 500 hr - PC tail version version à sertir: protection nickelée, livrée sans raccord, ni bague conique / crimp version: nickel plating, delivered without backshell, nor conical ring version à souder: idem version à sertir + sans grommet / solder version: idem crimp version + no grommet ]Pour raccord à reprise de tresse T* & RT* Backshell for screen termination, type T* & RT* 12 851 Types de raccord / Backshell types - Embases sans possibilité de raccord - 02E/02R/07A - voir page 25 - Receptacle not accepting backshells - 02E/02R/07A - see page 25 à souder solder à sertir crimp à souder solder à sertir crimp 00 01 07 06 08 36 76 00 01 07 06 08 36 76 E R raccord simple backnut 17 26 22 31 - - - 17 26 22 31 - - - EC RC raccord droit à serre-câbles straight cable clamp 17 26 22 31 - - - 17 26 22 31 - - - EC RC raccord coudé à serre-câbles 90° cable clamp - - - - 35 - - - - - - 35 - - AC raccord droit à serre-câbles sans passe-fils straight cable clamp without grommet 17 26 22 31 - - - - - - - - - - P RP raccord droit pour potting straight backshell for potting 18 27 23 32 - - - 18 27 23 32 - - - P RP raccord coudé pour potting 90° backshell for potting - - - - 35 - - - - - - 35 - - A RA raccord droit intermédiaire straight adaptor 18 27 - 32 - 36 - 18 27 - 32 - 36 - T RT raccord droit pour gaine thermorétractable straight backshell for heatshrink sleeving 19 28 23 33 - - - 19 28 23 33 - - - M RM raccord droit démontable pour gaine thermorétractable straight removable backshell for heatshrink sleeving 19 28 - 33 - - - 19 28 - 33 - - - *T *RT raccord droit démontable pour reprise de tresse et gaine thermorétractable straight removable backshell for screen termination and heatshrink sleeving Pour spécif. 38 & 42 / for specif. 38 & 42 20 29 24 - - 36 - 20 29 24 - - 36 - G RG raccord droit démontable pour reprise de tresse et gaine thermorétractable straight removable backshell for screen termination and heatshrink sleeving 20 29 24 - - 37 - 20 29 24 - - 37 - J raccord droit à presse-étoupe straight backshell with sealing gland 21 30 - 34 - - - - - - - - - - JC raccord droit à presse-étoupe et serrecâbles straight backshell with sealing gland and cable clamp 21 30 - 34 - - - - - - - - - - U RU raccord droit court pour reprise de tresse et gaine thermorétractable short backshell for screen termination and heatshrink sleeving - - - - - - 38 - - - - - - 38 Z RZ raccord droit intermédiaire pour adaptation de raccord au pas électrique straight adaptor for electrical pich access - - - 37 - - - - - - 37 - - - 13 851 Références / Ordering Information Connecteurs hermétiques / Hermetic connectors Racine / Basic series 851 02H 8 3A P - 50 - - Type de boîtier / Shell type 02H 07H IH Taille de boîtier / Shell size 8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 Arrangements / Contact layouts Voir tableau page 14/15 - See table page 14/15 Type de contact / Contact type P = mâle uniquement / male only Positionnement / Orientation normal (n’apparaît pas dans la référence) w, x, y, z - voir tableau page 16 normal (not included in part number) w, x, y, z - see table page 16 Indice obligatoire / Obligatory suffix 50 Spécification / Specification sans spécification: 02H et 07H, protection cadmiée jaune / without specification: 02H and 07H, yellow cadmium plating sans spécification: IH, protection nickelée / IH, nickel 44 02H et 07H, protection nickelée / 02H and 07H, nickel Connecteurs à picots & connexions enroulées / PC tail & wire-wrap connectors Racine / Basic series 851 02E 8 3A P - 50 16 Type de boîtier / Shell type 02E 07A Taille de boîtier / Shell size 8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 Arrangements / Contact layouts Voir tableau page 14/15 - See table page 14/15 Type de contact / Contact type P = mâle/male - S = femelle/female Positionnement / Orientation normal (n’apparaît pas dans la référence) w, x, y, z - voir tableau page 16 normal (not included in part number) w, x, y, z - see table page 16 Indice obligatoire / Obligatory suffix 50 51 52 54 Spécification obligatoire / Obligatory specification à picot droit à picot droit pour connexion enroulée PC tail à picot droit wire-wrap embase à collerette carrée / square flange receptacle embase à fixation par écrou / jam nut receptacle embase à collerette ronde fixation par brasage / solder fixing receptacle Contacts #20 et # 16: dorés Gold plating for size 20 and size 16 embase à collerette carrée sans possibilité de raccord square flange receptacle not accepting backshell embase à fixation par écrou sans possibilité de raccord jam nut receptacle not accepting backshell contacts à picots: taille 20, contacts dorés en partie active + étamés en partie arrière sauf arrangements 8-2, 8-3, 8-4 & 12-14; Taille 16, contacts dorés; Mixte taille 20 & 16, contacts dorés / PC tail contacts: size 20, contacts with gold plated active zone + tin plated termination area except 8-2, 8-3, 8-4 & 12-14 layouts; Size 16, gold plated contacts all over; Mix size 20 & 16, gold plated contacts all over contacts à picots taille 20: dorés / gold plating for PC tail contacts size 20 protection zinc cobalt vert olive (contacts: idem spécif.50) / zinc cobalt olive green plated (contacts idem specif.50) protection zinc nickel noir (contacts: idem spécif.50) / black zinc nickel plating (contacts idem specif.50) 16: corps cadmié vert olive 45: corps nickelé 34: contacts démontables, corps cadmié vert olive (voir tableau page 10) 34A: contacts non démontables, corps cadmié vert olive 16: olive green cadmium plated body 45: nickel plating 34: non-banded contacts, olive green cadmium plated shell (see table, page 10) 34A: banded contacts, olive green cadmium plated - Ø 1 mm contact, Ø 0.6 mm terminal / Ø 1.6 mm contact, Ø 1 mm terminal - Ø 1 mm contact, Ø 0.6 mm terminal / Ø 1.6 mm contact, Ø 1 mm terminal - contact Ø 1 mm, picot de Ø 0.6 mm / contact Ø 1.6 mm, picot de Ø 1 mm - contact Ø 1 mm, picot de Ø 0.6 mm / contact Ø 1.6 mm, picot de Ø 1 mm 14 851 Arrangements / Contact layouts Vue de face avant isolant mâle / Viewed from front face of male insulator 2 2 Ø 1 (#20) 3 3 Ø 1 (#20) 3A/98 3 Ø 1 (#20) 4 4 Ø 1 (#20) 33 3 Ø 1 (#20) 6 6 Ø 1 (#20) 7 7 Ø 1 (#20) 98 6 Ø 1 (#20) 12 3 3 Ø 1.6 (#16) 8 8 Ø 1 (#20) 10 10 Ø 1 (#20) 14 14 Ø 1 (#20) 2 2 Ø 1.6 (#16) 14 12 8 Ø 1 (#20) 4 Ø 1.6 (#16) 15 14 Ø 1 (#20) 1 Ø 1.6 (#16) 18 18 Ø 1 (#20) 19 19 Ø 1 (#20) 5 5 Ø 1.6 (#16) 16 8 8 Ø 1.6 (#16) 23 22 Ø 1 (#20) 1 Ø 1.6 (#16) 26 26 Ø 1 (#20) 18 11 11 Ø 1.6 (#16) 32 32 Ø 1 (#20) 30 29 Ø 1 (#20) 1 Ø 1.6 (#16) ■ ▲ ♦ ○ ■▲ ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ● ♦ ○ □ ♦ ○ ■ ▲ ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ● ♦ ○ □ ♦ ■ ▲ ● ♦ ○ □▲ ♦ ■ ▲ ● ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ♦ ○ ■ ▲ ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ♦ ○ ■ ▲ ● ♦ ○ ■ + ▲ ♦ ○ 8 10 15 851 20 16 16 Ø 1.6 (#16) 39 37 Ø 1 (#20) 2 Ø 1.6 (#1.6) 41 41 Ø 1 (#20) 24 24 Ø 1 (#20) 25 25 Ø 1 (#20) 22 36 36 Ø 1 (#20) 55 55 Ø 1 (#20) 32 32 Ø 1 (#20) 34 34 Ø 1 (#20) 21 21 Ø 1.6 (#16) 24 61 61 Ø 1 (#20) 27 27 Ø 1 (#20) Arrangements contacts à souder (QPL) / Solder contact layouts (QPL) Arrangements contacts à souder / Solder contact layouts Arrangements contacts à souder sans possibilité de passe-fils / Solder contact layouts without grommet Arrangements contacts à sertir / Crimp contact layouts Arrangements version hermétique / Hermetic version contact layouts Arrangements contacts à picots / PC tail contact layouts Arrangements contacts pour connexions enroulées / Wire-wrap contact layouts ■ □ + ▲ ● ♦ ○ ■ ▲ ♦ ○ ■ ▲ ♦ ○ □ + ▲ ♦ ○ ■ + ▲ ♦ ○ ■ ▲ ♦ ○ ■ ▲ ● ♦ ■ ▲ ♦ ○ ■ + ▲ ♦ ○ ■ ▲ ♦ ○ □ ▲ ♦ ○ ■ ▲ ● ♦ ○ ■ ▲ ● ♦ ○ Autres arrangements, nous consulter / Other layouts, please consult us 16 851 Positionnements / Orientations Isolant tournant à l’intérieur du corps métallique Insulator rotated inside metal body Vue face avant isolant mâle (corps d’embase ou corps de fiche) Viewed from front face of male insulator (receptacle or plug) boîtiers shells arrangements layouts angles en degrés / angle in degrees NFC 93422 HE 301B MIL-DTL-26482G serie 1 service1 1500 Veff 1500 Vrms service 2 2300 Veff W X Y Z 2300 Vrms souder solder sertir crimp souder solder sertir crimp 8 2 58 122 - - • X 3 60 210 - - • X 3A (98)* 60 210 - - • • X 4 45 - - - • X 33 90 - - - • • • X 10 6 90 - - - • • • • X 7* 90 - - - X 98 90 180 240 270 • • X 12 3 - - 180 - • • • • X 8 90 112 203 292 • • X 10 60 155 270 295 • • • • X 2 - - - - X 14* 45 • X 14 5 40 92 184 273 • • • • X 12 43 90 - - • • • • X 15 17 110 155 234 • • • • X 18 15 90 180 270 • • X 19 30 165 315 - • • • • X 16 8 54 152 180 331 • • • • X 23 158 270 - - • • • • X 26 60 - 275 338 • • • • X 18 11 62 119 241 340 • • • • X 32 85 138 222 265 • • • • X 30 180 193 285 350 • • X 20 16 238 318 333 347 • • • • X 39 63 144 252 333 • • • • X 41 45 126 225 - • • • • X 24 70 145 215 290 • • X 25 72 144 216 288 X 27 72 144 216 288 • • X 22 21 16 135 175 349 • • • • X 36 72 144 216 288 • X 55 30 142 226 314 • • • • X 32 72 145 215 288 • X 34 62 142 218 298 • X 24 61 90 180 270 324 • • • • X * Arrangement 8-98 : positionnements W et X non normalisés / 8-98 layout, W and X non standard ortientations Arrangements 10-7 & 12-14 : positionnement W non normalisé / 10-7 & 12-14 layouts, W non standard orientation 17 851 Embase à collerette carrée avec raccord simple Square flange receptacle with backnut Encombrements / Dimensions Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max contacts à souder J solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 00 E 8.. . 50.. 851 00 R 8.. . 50.. 32.70 32.00 12.03 11.70 1.32 13.50 15.09 20.99 3.13 10 851 00 E 10.. . 50.. 851 00 R 10.. . 50.. 32.70 32.00 15.01 11.70 1.32 16.70 18.26 24.19 3.13 12 851 00 E 12.. . 50.. 851 00 R 12.. . 50.. 32.70 32.00 19.07 11.70 1.32 19.90 20.62 26.54 3.13 14 851 00 E 14.. . 50.. 851 00 R 14.. . 50.. 32.70 32.00 22.25 11.70 1.32 23.40 23.00 28.89 3.13 16 851 00 E 16.. . 50.. 851 00 R 16.. . 50.. 32.70 32.00 25.42 11.70 1.32 26.60 24.61 31.29 3.13 18 851 00 E 18.. . 50.. 851 00 R 18.. . 50.. 32.70 32.00 28.60 11.70 1.32 29.50 26.97 33.69 3.13 20 851 00 E 20.. . 50.. 851 00 R 20.. . 50.. 34.50 33.40 31.77 14.35 2.15 32.70 29.36 36.89 3.13 22 851 00 E 22.. . 50.. 851 00 R 22.. . 50.. 34.50 33.40 34.95 14.35 2.15 36.00 31.75 39.99 3.13 24 851 00 E 24.. . 50.. 851 00 R 24.. . 50.. 34.50 33.40 38.12 15.20 2.15 39.10 34.92 43.15 3.81 00 E HE 301 B 00 E MS 3110 E 00 R HE 301 B 00 R MS 3120 E VG 95328 A PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Embase à collerette carrée avec raccord droit à serre-câbles Square flange receptacle with straight cable clamp Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max contacts à souder G J solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 00 8.. . 50.. 851 00 RC 8.. . 50 .. 48.00 47.30 12.03 11.70 1.32 19.90 15.09 20.99 3.50 3.13 10 851 00 10.. . 50.. 851 00 RC 10.. . 50.. 48.00 47.30 15.01 11.70 1.32 21.50 18.26 24.19 5.00 3.13 12 851 00 12.. . 50.. 851 00 RC 12.. . 50.. 48.00 47.30 19.07 11.70 1.32 25.00 20.62 26.54 8.20 3.13 14 851 00 14.. . 50.. 851 00 RC 14.. . 50.. 48.00 47.30 22.25 11.70 1.32 27.80 23.00 28.89 10.00 3.13 16 851 00 16.. . 50.. 851 00 RC 16.. . 50.. 51.00 50.50 25.42 11.70 1.32 29.40 24.61 31.29 13.00 3.13 18 851 00 18.. . 50.. 851 00 RC 18.. . 50.. 51.00 50.50 28.60 11.70 1.32 35.30 26.97 33.69 16.00 3.13 20 851 00 20.. . 50.. 851 00 RC 20.. . 50.. 53.00 51.50 31.77 14.35 2.15 35.30 29.36 36.89 16.00 3.13 22 851 00 22.. . 50.. 851 00 RC 22.. . 50.. 53.00 51.50 34.95 14.35 2.15 41.10 31.75 39.99 19.30 3.13 24 851 00 24.. . 50.. 851 00 RC 24.. . 50.. 53.00 51.50 38.12 15.20 2.15 42.40 34.92 43.15 20.60 3.81 00 EC HE 301 B 00 EC MS 3110 F 00 AC HE 301 B 00 AC 00 RC HE 301 B 00 RC MS 3120 F VG 95328 B PS PS PS PS PS PS PS PS PS EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC PS PS PS PS PS PS PS PS PS Note : toutes les dimensions sont en mm / all dimensions are in mm 18 851 Embase à collerette carrée avec raccord droit pour potting Square flange receptacle with straight backshell for potting 00 P HE 301 B 00 P MS 3110 P 00 RP HE 301 B 00 RP MS 3120 P Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G max contacts à souder J solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 00 P 8.. . 50.. 851 00 RP 8.. . 50 .. 36.20 41.70 12.03 11.70 1.32 15.34 15.09 20.99 10.46 3.13 10 851 00 P 10.. . 50.. 851 00 RP 10.. . 50.. 36.20 41.70 15.01 11.70 1.32 17.70 18.26 24.19 13.55 3.13 12 851 00 P 12.. . 50.. 851 00 RP 12.. . 50.. 36.20 41.70 19.07 11.70 1.32 21.69 20.62 26.54 13.96 3.13 14 851 00 P 14.. . 50.. 851 00 RP 14.. . 50.. 36.20 41.70 22.25 11.70 1.32 23.90 23.00 28.89 17.42 3.13 16 851 00 P 16.. . 50.. 851 00 RP 16.. . 50.. 36.20 41.70 25.42 11.70 1.32 27.00 24.61 31.29 20.56 3.13 18 851 00 P 18.. . 50.. 851 00 RP 18.. . 50.. 36.91 44.46 28.60 11.70 1.32 30.50 26.97 33.69 23.66 3.13 20 851 00 P 20.. . 50.. 851 00 RP 20.. . 50.. 43.80 50.93 31.77 14.35 2.15 33.65 29.36 36.89 23.92 3.13 22 851 00 P 22.. . 50.. 851 00 RP 22.. . 50.. 43.80 50.93 34.95 14.35 2.15 37.10 31.75 39.99 25.52 3.13 24 851 00 P 24.. . 50.. 851 00 RP 24.. . 50.. 43.80 51.40 38.12 15.20 2.15 40.00 34.92 43.15 32.00 3.81 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Embase à collerette carrée avec raccord droit intermédiaire Square flange receptacle with straight adaptor 00 A HE 301 B 00 A 00 RA HE 301 B 00 RA Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G max J K filetage threading UNEF 2A contacts à souder solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 00 A 8.. . 50.. 851 00 RA 8.. . 50 .. 41.00 12.03 11.70 1.32 14.50 15.09 20.99 9.10 3.13 1/2 18 10 851 00 A 10.. . 50.. 851 00 RA 10.. . 50.. 41.00 15.01 11.70 1.32 18.70 18.26 24.19 12.08 3.13 5/8 24 12 851 00 A 12.. . 50.. 851 00 RA 12.. . 50.. 41.00 19.07 11.70 1.32 21.70 20.62 26.54 15.25 3.13 3/4 20 14 851 00 A 14.. . 50.. 851 00 RA 14.. . 50.. 41.00 22.25 11.70 1.32 25.10 23.00 28.89 18.15 3.13 7/8 20 16 851 00 A 16.. . 50.. 851 00 RA 16.. . 50.. 41.00 25.42 11.70 1.32 28.13 24.61 31.29 21.32 3.13 1-20 18 851 00 A 18.. . 50.. 851 00 RA 18.. . 50.. 41.00 28.60 11.70 1.32 31.38 26.97 33.69 24.32 3.13 1-3/16 18 20 851 00 A 20.. . 50.. 851 00 RA 20.. . 50.. 44.00 31.77 14.35 2.15 34.30 29.36 36.89 26.73 3.13 1-3/16 18 22 851 00 A 22.. . 50.. 851 00 RA 22.. . 50.. 44.00 34.95 14.35 2.15 37.60 31.75 39.99 30.67 3.13 1-7/16 18 24 851 00 A 24.. . 50.. 851 00 RA 24.. . 50.. 44.00 38.12 15.20 2.15 40.70 34.92 43.15 33.08 3.81 1-7/16 18 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Note : toutes les dimensions sont en mm / all dimensions are in mm 19 851 Embase à collerette carrée avec raccord pour gaine thermorétractable Square flange receptacle with straight backshell for heatshrink sleeving 00 T 00 RT PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Embase à collerette carrée avec raccord droit démontable pour gaine thermorétractable Square flange receptacle with removable straight backshell for heatshrink sleeving PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G max J M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp souder solder sertir crimp 8 851 00 T 8.. . 50.. 851 00 RT 8.. . 50 .. 36.70 36.00 12.03 11.70 1.32 15.35 15.09 20.99 7.20 6.70 3.13 3.70 10 851 00 T 10.. . 50.. 851 00 RT 10.. . 50.. 36.70 36.00 15.01 11.70 1.32 18.15 18.26 24.19 10.20 9.40 3.13 3.70 12 851 00 T 12.. . 50.. 851 00 RT 12.. . 50.. 36.70 36.00 19.07 11.70 1.32 23.45 20.62 26.54 13.20 11.95 3.13 3.70 14 851 00 T 14.. . 50.. 851 00 RT 14.. . 50.. 36.70 36.00 22.25 11.70 1.32 24.25 23.00 28.89 16.10 15.15 3.13 3.70 16 851 00 T 16.. . 50.. 851 00 RT 16.. . 50.. 39.00 38.30 25.42 11.70 1.32 29.55 24.61 31.29 19.25 18.05 3.13 3.70 18 851 00 T 18.. . 50.. 851 00 RT 18.. . 50.. 39.00 38.30 28.60 11.70 1.32 31.75 26.97 33.69 21.30 19.95 3.13 3.70 20 851 00 T 20.. . 50.. 851 00 RT 20.. . 50.. 45.30 44.20 31.77 14.35 2.15 35.85 29.36 36.89 24.40 23.05 3.13 3.70 22 851 00 T 22.. . 50.. 851 00 RT 22.. . 50.. 45.30 44.20 34.95 14.35 2.15 38.20 31.75 39.99 27.50 25.55 3.13 3.70 24 851 00 T 24.. . 50.. 851 00 RT 24.. . 50.. 44.00 42.60 38.12 15.20 2.15 41.30 34.92 43.15 30.60 28.65 3.81 3.70 00 M 00 RM Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G max J M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 00 M 8.. . 50.. 851 00 RM 8.. . 50 .. 50.00 12.03 11.70 1.32 13.55 15.09 20.99 7.05 3.13 3.50 10 851 00 M 10.. . 50.. 851 00 RM 10.. . 50.. 50.00 15.01 11.70 1.32 15.35 18.26 24.19 9.90 3.13 3.50 12 851 00 M 12.. . 50.. 851 00 RM 12.. . 50.. 50.00 19.07 11.70 1.32 19.48 20.62 26.54 12.60 3.13 3.50 14 851 00 M 14.. . 50.. 851 00 RM 14.. . 50.. 50.00 22.25 11.70 1.32 21.30 23.00 28.89 15.90 3.13 3.50 16 851 00 M 16.. . 50.. 851 00 RM 16.. . 50.. 50.00 25.42 11.70 1.32 24.50 24.61 31.29 18.95 3.13 3.50 18 851 00 M 18.. . 50.. 851 00 RM 18.. . 50.. 50.00 28.60 11.70 1.32 26.45 26.97 33.69 20.90 3.13 3.50 20 851 00 M 20.. . 50.. 851 00 RM 20.. . 50.. 53.30 31.77 14.35 2.15 30.73 29.36 36.89 23.70 3.13 3.50 22 851 00 M 22.. . 50.. 851 00 RM 22.. . 50.. 53.30 34.95 14.35 2.15 34.24 31.75 39.99 26.60 3.13 3.50 24 851 00 M 24.. . 50.. 851 00 RM 24.. . 50.. 53.30 38.12 15.20 2.15 36.47 34.92 43.15 29.30 3.81 3.50 PS PS PS PS PS PS PS PS PS Note : toutes les dimensions sont en mm / all dimensions are in mm 20 851 Embase à collerette carrée avec raccord droit démontable pour reprise de tresse et gaine thermorétractable (spécifications 38 & 42) / Square flange receptacle with removable backshell for screen termination and heatshrink sleeving (38 & 42 suffix) 00 T 00 RT Embase à collerette carrée avec raccord droit démontable pour reprise de tresse et gaine thermorétractable / Square flange receptacle with removable straight backshell for screen termination and heatshrink sleeving 00 G 00 RG VG 95328 R Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G max J M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 00 G 8.. .50.. 851 00 RG 8.. .50 .. 54.00 12.03 11.70 1.32 16.30 15.09 20.99 7.45 3.13 3.60 10 851 00 G 10.. .50.. 851 00 RG 10.. .50.. 54.00 15.01 11.70 1.32 18.30 18.26 24.19 10.30 3.13 3.60 12 851 00 G 12.. .50.. 851 00 RG 12.. .50.. 54.00 19.07 11.70 1.32 22.30 20.62 26.54 13.20 3.13 3.60 14 851 00 G 14.. .50.. 851 00 RG 14.. .50.. 54.00 22.25 11.70 1.32 25.30 23.00 28.89 16.50 3.13 3.60 16 851 00 G 16.. .50.. 851 00 RG 16.. .50.. 54.00 25.42 11.70 1.32 28.30 24.61 31.29 19.35 3.13 3.60 18 851 00 G 18.. .50.. 851 00 RG 18.. .50.. 54.00 28.60 11.70 1.32 32.30 26.97 33.69 21.60 3.13 3.60 20 851 00 G 20.. .50.. 851 00 RG 20.. .50.. 59.30 31.77 14.35 2.15 34.30 29.36 36.89 24.80 3.13 3.60 22 851 00 G 22.. .50.. 851 00 RG 22.. .50.. 59.30 34.95 14.35 2.15 38.30 31.75 39.99 27.90 3.13 3.60 24 851 00 G 24.. .50.. 851 00 RG 24.. .50.. 59.30 38.12 15.20 2.15 41.30 34.92 43.15 31.00 3.81 3.60 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G max J M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 00 T 8.. . 50 851 00 RT 8.. . 50 51.60 12.03 11.70 1.32 18.25 15.09 20.99 7.45 3.13 3.70 10 851 00 T 10.. . 50 851 00 RT 10.. . 50 51.60 15.01 11.70 1.32 20.25 18.26 24.19 9.00 3.13 3.70 12 851 00 T 12.. . 50 851 00 RT 12.. . 50 51.60 19.07 11.70 1.32 24.75 20.62 26.54 13.30 3.13 3.70 14 851 00 T 14.. . 50 851 00 RT 14.. . 50 51.60 22.25 11.70 1.32 27.75 23.00 28.89 16.50 3.13 3.70 16 851 00 T 16.. . 50 851 00 RT 16.. . 50 51.60 25.42 11.70 1.32 30.05 24.61 31.29 18.50 3.13 3.70 18 851 00 T 18.. . 50 851 00 RT 18.. . 50 52.00 28.60 11.70 1.32 34.15 26.97 33.69 21.90 3.13 3.70 20 851 00 T 20.. . 50 851 00 RT 20.. . 50 55.10 31.77 14.35 2.15 37.25 29.36 36.89 25.10 3.13 3.70 22 851 00 T 22.. . 50 851 00 RT 22.. . 50 55.10 34.95 14.35 2.15 40.45 31.75 39.99 28.20 3.13 3.70 24 851 00 T 24.. . 50 851 00 RT 24.. . 50 55.10 38.12 15.20 2.15 43.65 34.92 43.15 31.40 3.81 3.70 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 Note : toutes les dimensions sont en mm / all dimensions are in mm 21 851 Embase à collerette carrée avec raccord droit presse-étoupe Square flange receptacle with straight sealing gland backshell 00 J HE 301 B 00J Embase à collerette carrée avec raccord droit à presse-étoupe et serre-câbles Square flange receptacle with straight sealing gland and cable clamp PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G contacts à souder J solder contacts contacts à sertir crimp contacts souder solder sertir crimp min max 8 851 00 J 8.. . 50.. - 47.60 - 12.03 11.70 1.32 14.40 15.09 20.99 5.02 5.84 3.13 10 851 00 J 10.. . 50.. - 47.60 - 15.01 11.70 1.32 17.60 18.26 24.19 5.94 6.76 3.13 12 851 00 J 12.. . 50.. - 48.70 - 19.07 11.70 1.32 21.10 20.62 26.54 9.34 10.16 3.13 14 851 00 J 14.. . 50.. - 53.50 - 22.25 11.70 1.32 24.40 23.00 28.89 11.32 12.14 3.13 16 851 00 J 16.. . 50.. - 59.00 - 25.42 11.70 1.32 27.60 24.61 31.29 14.73 15.55 3.13 18 851 00 J 18.. . 50.. - 65.00 - 28.60 11.70 1.32 30.80 26.97 33.69 16.00 16.82 3.13 20 851 00 J 20.. . 50.. - 79.10 - 31.77 14.35 2.15 34.10 29.36 36.89 16.89 17.70 3.13 22 851 00 J 22.. . 50.. - 80.00 - 34.95 14.35 2.15 37.30 31.75 39.99 17.78 18.60 3.13 24 851 00 J 24.. . 50.. - 90.00 - 38.12 15.20 2.15 40.50 34.92 43.15 20.34 21.16 3.81 PS PS PS PS PS PS PS PS PS 00 JC MS 3110 J Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max G contacts à souder J solder contacts contacts à sertir crimp contacts souder solder sertir crimp min max 8 851 00 JC 8.. .50.. - 57.68 - 12.03 11.70 1.32 19.90 15.09 20.99 5.02 5.84 3.13 10 851 00 JC 10.. .50.. - 57.68 - 15.01 11.70 1.32 21.50 18.26 24.19 5.94 6.76 3.13 12 851 00 JC 12.. .50.. - 61.24 - 19.07 11.70 1.32 25.00 20.62 26.54 9.34 10.16 3.13 14 851 00 JC 14.. .50.. - 66.01 - 22.25 11.70 1.32 27.80 23.00 28.89 11.32 12.14 3.13 16 851 00 JC 16.. .50.. - 74.75 - 25.42 11.70 1.32 29.40 24.61 31.29 14.73 15.55 3.13 18 851 00 JC 18.. .50.. - 80.57 - 28.60 11.70 1.32 35.30 26.97 33.69 16.00 16.82 3.13 20 851 00 JC 20.. .50.. - 91.69 - 31.77 14.35 2.15 35.30 29.36 36.89 16.89 17.70 3.13 22 851 00 JC 22.. .50.. - 95.66 - 34.95 14.35 2.15 41.10 31.75 39.99 17.78 18.60 3.13 24 851 00 JC 24.. .50.. - 101.22 - 38.12 15.20 2.15 42.40 34.92 43.15 20.34 21.16 3.81 Note : toutes les dimensions sont en mm / all dimensions are in mm 22 851 Embase à fixation par écrou avec raccord simple Jam nut receptacle with backnut 07 E HE 301 B 07 E MS 3114 E 07 R HE 301 B 07 R MS 3124 E VG 95328 D Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max P max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 07 E 8.. . 50.. 851 07 R 8.. . 50 .. 34.10 33.50 12.03 17.90 2.64 18.50 26.94 19.29 23.94 10 851 07 E 10.. . 50.. 851 07 R 10.. . 50.. 34.10 33.50 15.01 17.90 2.64 21.70 30.14 22.38 26.94 12 851 07 E 12.. . 50.. 851 07 R 12.. . 50.. 34.10 33.50 19.07 17.90 2.64 24.90 34.94 27.13 31.74 14 851 07 E 14.. . 50.. 851 07 R 14.. . 50.. 34.10 33.50 22.25 17.90 2.64 28.10 38.04 30.33 34.94 16 851 07 E 16.. . 50.. 851 07 R 16.. . 50.. 34.10 33.50 25.42 17.90 2.64 31.20 41.24 33.48 38.24 18 851 07 E 18.. . 50.. 851 07 R 18.. . 50.. 34.10 33.50 28.60 17.90 2.64 34.40 44.44 36.68 41.34 20 851 07 E 20.. . 50.. 851 07 R 20.. . 50.. 39.30 37.90 31.77 22.45 3.44 38.30 49.14 39.83 46.04 22 851 07 E 22.. . 50.. 851 07 R 22.. . 50.. 39.30 37.90 34.95 22.45 3.44 41.50 52.24 43.03 49.24 24 851 07 E 24.. . 50.. 851 07 R 24.. . 50.. 39.30 37.90 38.12 22.30 3.44 44.70 55.54 46.18 52.74 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G P max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 07 8.. . 50.. 851 07 RC 8.. . 50 .. 49.31 49.10 12.03 17.90 2.64 19.90 26.94 3.50 19.29 23.94 10 851 07 10.. . 50.. 851 07 RC 10.. . 50.. 49.31 49.10 15.01 17.90 2.64 21.50 30.14 5.00 22.38 26.94 12 851 07 12.. . 50.. 851 07 RC 12.. . 50.. 49.17 49.10 19.07 17.90 2.64 25.00 34.94 8.20 27.13 31.74 14 851 07 14.. . 50.. 851 07 RC 14.. . 50.. 49.17 49.10 22.25 17.90 2.64 27.80 38.04 10.00 30.33 34.94 16 851 07 16.. . 50.. 851 07 RC 16.. . 50.. 52.34 52.20 25.42 17.90 2.64 29.40 41.24 13.00 33.48 38.24 18 851 07 18.. . 50.. 851 07 RC 18.. . 50.. 53.22 53.10 28.60 17.90 2.64 35.30 44.44 16.00 36.68 41.34 20 851 07 20.. . 50.. 851 07 RC 20.. . 50.. 58.10 58.00 31.77 22.45 3.44 35.30 49.14 16.00 39.83 46.04 22 851 07 22.. . 50.. 851 07 RC 22.. . 50.. 58.10 58.00 34.95 22.45 3.44 41.10 52.24 19.30 43.03 49.24 24 851 07 24.. . 50.. 851 07 RC 24.. . 50.. 58.10 58.00 38.12 23.30 3.44 42.40 55.54 20.60 46.18 52.74 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 07 EC HE 301 B 07 EC MS 3114 F 07 AC HE 301 B 07 AC 07 RC HE 301 B 07 RC MS 3124 F VG 95328 E EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC Note : toutes les dimensions sont en mm / all dimensions are in mm Embase à fixation par écrou avec raccord droit à serre-câbles Jam nut receptacle with straight cable clamp 23 851 Embase à fixation par écrou avec raccord droit pour potting Jam nut receptacle with straight backshell for potting Embase à fixation par écrou avec raccord droit pour gaine thermorétractable Jam nut receptacle with straight backshell for heatshrink sleeving PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 07 T 07 RT VG 95328 S 07 P HE 301 B 07 P MS 3114 P 07 RP HE 301 B 07 RP MS 3124 P Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max P max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 07 P 8.. . 50.. 851 07 RP 8.. . 50 .. 34.30 39.80 12.03 17.90 2.64 15.34 26.94 10.46 19.29 23.94 10 851 07 P 10.. . 50.. 851 07 RP 10.. . 50.. 34.30 39.80 15.01 17.90 2.64 17.70 30.14 13.55 22.38 26.94 12 851 07 P 12.. . 50.. 851 07 RP 12.. . 50.. 34.30 39.80 19.07 17.90 2.64 21.69 34.94 13.96 27.13 31.74 14 851 07 P 14.. . 50.. 851 07 RP 14.. . 50.. 34.30 39.80 22.25 17.90 2.64 23.90 38.04 17.42 30.33 34.94 16 851 07 P 16.. . 50.. 851 07 RP 16.. . 50.. 34.30 39.80 25.42 17.90 2.64 27.00 41.24 20.56 33.48 38.24 18 851 07 P 18.. . 50.. 851 07 RP 18.. . 50.. 34.10 41.80 28.60 17.90 2.64 30.50 44.44 23.66 36.68 41.34 20 851 07 P 20.. . 50.. 851 07 RP 20.. . 50.. 42.25 49.92 31.77 22.45 3.44 33.65 49.14 23.92 39.83 46.04 22 851 07 P 22.. . 50.. 851 07 RP 22.. . 50.. 42.25 49.92 34.95 22.45 3.44 37.10 52.24 25.52 43.03 49.24 24 851 07 P 24.. . 50.. 851 07 RP 24.. . 50.. 43.26 51.30 38.12 23.30 3.44 40.00 55.54 32.00 46.18 52.74 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max M max P max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp souder solder sertir crimp 8 851 07 T 8.. . 50.. 851 07 RT 8.. . 50 .. 42.60 41.50 12.03 17.90 2.64 15.35 26.94 7.20 6.70 3.70 19.29 23.94 10 851 07 T 10.. . 50.. 851 07 RT 10.. . 50.. 42.60 41.50 15.01 17.90 2.64 18.15 30.14 10.20 9.40 3.70 22.38 26.94 12 851 07 T 12.. . 50.. 851 07 RT 12.. . 50.. 42.60 41.50 19.07 17.90 2.64 23.45 34.94 13.20 11.95 3.70 27.13 31.74 14 851 07 T 14.. . 50.. 851 07 RT 14.. . 50.. 42.60 41.50 22.25 17.90 2.64 24.25 38.04 16.10 15.15 3.70 30.33 34.94 16 851 07 T 16.. . 50.. 851 07 RT 16.. . 50.. 44.40 43.80 25.42 17.90 2.64 29.55 41.24 19.25 18.05 3.70 33.48 38.24 18 851 07 T 18.. . 50.. 851 07 RT 18.. . 50.. 44.40 43.80 28.60 17.90 2.64 31.75 44.44 21.30 19.95 3.70 36.68 41.24 20 851 07 T 20.. . 50.. 851 07 RT 20.. . 50.. 50.90 49.80 31.77 22.45 3.44 35.85 49.14 24.40 23.05 3.70 39.83 46.04 22 851 07 T 22.. . 50.. 851 07 RT 22.. . 50.. 50.90 49.80 34.95 22.45 3.44 38.20 52.24 27.50 25.55 3.70 43.03 49.24 24 851 07 T 24.. . 50.. 851 07 RT 24.. . 50.. 49.90 48.50 38.12 23.30 3.44 41.30 55.54 30.60 28.65 3.70 46.18 52.74 Note : toutes les dimensions sont en mm / all dimensions are in mm 24 851 07 T 07 RT PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Embase à fixation par écrou avec raccord droit démontable pour reprise de tresse et gaine thermorétractable (spécifications 38 & 42) / Jam nut receptacle with removable straight backshell for screen termination and heatshrink sleeving (38 & 42 suffix) Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max M max P max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 07 T 8.. . 50 851 07 RT 8.. . 50 60.00 12.03 17.90 2.64 18.25 26.94 7.45 3.70 19.29 23.94 10 851 07 T 10.. . 50 851 07 RT 10.. . 50 60.00 15.01 17.90 2.64 20.25 30.14 9.00 3.70 22.38 26.94 12 851 07 T 12.. . 50 851 07 RT 12.. . 50 60.00 19.07 17.90 2.64 24.75 34.94 13.30 3.70 27.13 31.74 14 851 07 T 14.. . 50 851 07 RT 14.. . 50 60.00 22.25 17.90 2.64 27.75 38.04 16.50 3.70 30.33 34.94 16 851 07 T 16.. . 50 851 07 RT 16.. . 50 60.00 25.42 17.90 2.64 30.05 41.24 18.50 3.70 33.48 38.24 18 851 07 T 18.. . 50 851 07 RT 18.. . 50 60.40 28.60 17.90 2.64 34.15 44.44 21.90 3.70 36.68 41.34 20 851 07 T 20.. . 50 851 07 RT 20.. . 50 63.40 31.77 22.45 3.44 37.25 49.14 25.10 3.70 39.83 46.04 22 851 07 T 22.. . 50 851 07 RT 22.. . 50 63.40 34.95 22.45 3.44 40.45 52.24 28.20 3.70 43.03 49.24 24 851 07 T 24.. . 50 851 07 RT 24.. . 50 63.40 38.12 23.30 3.44 43.65 55.54 31.40 3.70 46.18 52.74 Embase à fixation par écrou avec raccord droit démontable pour reprise de tresse et gaine thermorétractable / Jam nut receptacle with removable straight backshell for screen termination and heatshrink sleeving 07 G 07 RG VG 95328 T 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max M max P max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 07 G 8.. . 50 851 07 RG 8.. . 50 62.20 12.03 17.90 2.64 16.30 26.94 7.45 3.60 19.29 23.94 10 851 07 G 10.. . 50 851 07 RG 10.. . 50 62.20 15.01 17.90 2.64 18.30 30.14 10.30 3.60 22.38 26.94 12 851 07 G 12.. . 50 851 07 RG 12.. . 50 62.20 19.07 17.90 2.64 22.30 34.94 13.20 3.60 27.13 31.74 14 851 07 G 14.. . 50 851 07 RG 14.. . 50 62.40 22.25 17.90 2.64 25.30 38.04 16.50 3.60 30.33 34.94 16 851 07 G 16.. . 50 851 07 RG 16.. . 50 62.40 25.42 17.90 2.64 28.30 41.24 19.35 3.60 33.48 38.24 18 851 07 G 18.. . 50 851 07 RG 18.. . 50 62.40 28.60 17.90 2.64 32.30 44.44 21.60 3.60 36.68 41.34 20 851 07 G 20.. . 50 851 07 RG 20.. . 50 67.50 31.77 22.45 3.44 34.30 49.14 24.80 3.60 39.83 46.04 22 851 07 G 22.. . 50 851 07 RG 22.. . 50 67.50 34.95 22.45 3.44 38.30 52.24 27.90 3.60 43.03 49.24 24 851 07 G 24.. . 50 851 07 RG 24.. . 50 67.50 38.12 23.30 3.44 41.30 55.54 31.00 3.60 46.18 52.74 Note : toutes les dimensions sont en mm / all dimensions are in mm 25 851 Embase à collerette carrée sans possibilité de raccord Square flange receptacle not accepting backshell Embase à fixation par écrou sans possibilité de raccord Jam nut receptacle not accepting backshell PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 07 A HE 301 B 07 A 02 E HE 301 B 02 E MS 3112 E VG 95328 H 02 R HE 301 B 02 R MS 3122 E VG 95328 C PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max E F max contacts à souder J solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 02 E 8.. . 50.. 851 02 R 8.. . 50 .. 25.18 32.35 12.03 11.70 1.32 10.84 15.09 20.99 3.13 10 851 02 E 10.. . 50.. 851 02 R 10.. . 50.. 25.10 32.35 15.01 11.70 1.32 13.99 18.26 24.19 3.13 12 851 02 E 12.. . 50.. 851 02 R 12.. . 50.. 25.10 32.35 19.07 11.70 1.32 17.37 20.62 26.54 3.13 14 851 02 E 14.. . 50.. 851 02 R 14.. . 50.. 25.10 32.35 22.25 11.70 1.32 20.57 23.00 28.89 3.13 16 851 02 E 16.. . 50.. 851 02 R 16.. . 50.. 25.10 32.35 25.42 11.70 1.32 23.72 24.61 31.29 3.13 18 851 02 E 18.. . 50.. 851 02 R 18.. . 50.. 25.10 32.35 28.60 11.70 1.32 26.69 26.97 33.69 3.13 20 851 02 E 20.. . 50.. 851 02 R 20.. . 50.. 26.67 33.95 31.77 14.35 2.15 29.89 29.36 36.89 3.13 22 851 02 E 22.. . 50.. 851 02 R 22.. . 50.. 26.67 33.95 34.95 14.35 2.15 33.04 31.75 39.99 3.13 24 851 02 E 24.. . 50.. 851 02 R 24.. . 50.. 26.67 33.95 38.12 15.20 2.15 36.24 34.92 43.15 3.81 Taille de boîtier Shell size Références / Part numbers L max A B max C max F max P max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 07 A 8.. . 50.. - 25.18 - 12.03 17.90 2.64 26.94 19.29 23.94 10 851 07 A 10.. . 50.. - 25.10 - 15.01 17.90 2.64 30.14 22.38 26.94 12 851 07 A 12.. . 50.. - 25.10 - 19.07 17.90 2.64 34.94 27.13 31.74 14 851 07 A 14.. . 50.. - 25.10 - 22.25 17.90 2.64 38.04 30.33 34.94 16 851 07 A 16.. . 50.. - 25.10 - 25.42 17.90 2.64 41.24 33.48 38.24 18 851 07 A 18.. . 50.. - 25.10 - 28.60 17.90 2.64 44.44 36.68 41.34 20 851 07 A 20.. . 50.. - 26.67 - 31.77 22.45 3.44 49.14 39.83 46.04 22 851 07 A 22.. . 50.. - 26.67 - 34.95 22.45 3.44 52.24 43.03 49.24 24 851 07 A 24.. . 50.. - 26.67 - 38.12 23.30 3.44 55.54 46.18 52.74 Note : toutes les dimensions sont en mm / all dimensions are in mm 26 851 Prolongateur avec raccord simple Cable connecting receptacle with backnut 01 E HE 301 B 01 E MS 3111 E 01 R HE 301 B 01 R MS 3121 E PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Prolongateur avec raccord droit à serre-câbles Cable connecting receptacle with straight cable clamp PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 01 EC HE 301 B 01 EC MS 3111 F 01 AC HE 301 B 01 AC 01 RC HE 301 B 01 RC MS 3121 F EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 01 E 8.. . 50.. 851 01 R 8.. . 50.. 32.70 32.00 12.03 10.60 2.10 13.50 24.24 20.99 10 851 01 E 10.. . 50.. 851 01 R 10.. . 50.. 32.70 32.00 15.01 10.60 2.10 16.70 27.44 24.19 12 851 01 E 12.. . 50.. 851 01 R 12.. . 50.. 32.70 32.00 19.07 10.60 2.10 19.90 29.79 26.54 14 851 01 E 14.. . 50.. 851 01 R 14.. . 50.. 32.70 32.00 22.25 10.60 2.10 23.40 32.10 28.89 16 851 01 E 16.. . 50.. 851 01 R 16.. . 50.. 32.70 32.00 25.42 10.60 2.10 26.60 34.59 31.29 18 851 01 E 18.. . 50.. 851 01 R 18.. . 50.. 32.70 32.00 28.60 10.60 2.10 29.50 36.94 33.69 20 851 01 E 20.. . 50.. 851 01 R 20.. . 50.. 34.50 33.40 31.77 13.85 2.65 32.70 40.14 36.89 22 851 01 E 22.. . 50.. 851 01 R 22.. . 50.. 34.50 33.40 34.95 13.85 2.65 36.00 43.24 40.00 24 851 01 E 24.. . 50.. 851 01 R 24.. . 50.. 34.50 33.40 38.12 14.70 2.65 39.10 46.44 43.29 Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 01 8.. . 50.. 851 01 RC 8.. . 50 .. 48.00 47.30 12.03 10.60 2.10 19.90 24.24 3.50 20.99 10 851 01 10.. . 50.. 851 01 RC 10.. . 50.. 48.00 47.30 15.01 10.60 2.10 21.50 27.44 5.00 24.19 12 851 01 12.. . 50.. 851 01 RC 12.. . 50.. 48.00 47.30 19.07 10.60 2.10 25.00 29.79 8.20 26.54 14 851 01 14.. . 50.. 851 01 RC 14.. . 50.. 48.00 47.30 22.25 10.60 2.10 27.80 32.10 10.00 28.89 16 851 01 16.. . 50.. 851 01 RC 16.. . 50.. 51.00 50.50 25.42 10.60 2.10 29.40 34.59 13.00 31.29 18 851 01 18.. . 50.. 851 01 RC 18.. . 50.. 51.00 50.50 28.60 10.60 2.10 35.30 36.94 16.00 33.69 20 851 01 20.. . 50.. 851 01 RC 20.. . 50.. 53.00 51.50 31.77 13.85 2.65 35.30 40.14 16.00 36.89 22 851 01 22.. . 50.. 851 01 RC 22.. . 50.. 53.00 51.50 34.95 13.85 2.65 41.10 43.24 19.30 40.00 24 851 01 24.. . 50.. 851 01 RC 24.. . 50.. 53.00 51.50 38.12 14.70 2.65 42.40 46.44 20.60 43.29 Note : toutes les dimensions sont en mm / all dimensions are in mm 27 851 Prolongateur avec raccord droit pour potting Cable connecting receptacle with straight backshell for potting Prolongateur avec raccord droit intermédiaire Cable connecting receptacle with straight adaptor PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 01 A HE 301 B 01 A 01 RA HE 301 B 01 RA 01 P HE 301 B 01 P MS 3111 P 01 RP HE 301 B 01 RP MS 3121 P PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 01 P 8.. . 50.. 851 01 RP 8.. . 50 .. 36.20 41.70 12.03 10.60 2.10 15.34 24.24 10.46 20.99 10 851 01 P 10.. . 50.. 851 01 RP 10.. . 50.. 36.20 41.70 15.01 10.60 2.10 17.70 27.44 13.55 24.19 12 851 01 P 12.. . 50.. 851 01 RP 12.. . 50.. 36.20 41.70 19.07 10.60 2.10 21.69 29.79 13.96 26.54 14 851 01 P 14.. . 50.. 851 01 RP 14.. . 50.. 36.20 41.70 22.25 10.60 2.10 23.90 32.10 17.42 28.89 16 851 01 P 16.. . 50.. 851 01 RP 16.. . 50.. 36.20 41.70 25.42 10.60 2.10 27.00 34.59 20.56 31.29 18 851 01 P 18.. . 50.. 851 01 RP 18.. . 50.. 36.91 44.46 28.60 10.60 2.10 30.50 36.94 23.66 33.69 20 851 01 P 20.. . 50.. 851 01 RP 20.. . 50.. 43.80 50.93 31.77 13.85 2.65 33.65 40.15 23.92 36.89 22 851 01 P 22.. . 50.. 851 01 RP 22.. . 50.. 43.80 50.93 34.95 13.85 2.65 37.10 42.24 25.52 40.00 24 851 01 P 24.. . 50.. 851 01 RP 24.. . 50.. 43.80 50.93 38.12 14.70 2.65 40.00 46.44 32.00 43.29 Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max K filetage threading UNEF 2A P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 01 A 8.. . 50.. 851 01 RA 8.. . 50 .. 41.00 12.03 10.60 2.10 14.50 24.24 9.10 1/2 28 20.99 10 851 01 A 10.. . 50.. 851 01 RA 10.. . 50.. 41.00 15.01 10.60 2.10 18.70 27.44 12.08 5/8 24 24.19 12 851 01 A 12.. . 50.. 851 01 RA 12.. . 50.. 41.00 19.07 10.60 2.10 21.70 29.79 15.25 3/4 20 26.54 14 851 01 A 14.. . 50.. 851 01 RA 14.. . 50.. 41.00 22.25 10.60 2.10 25.10 32.10 18.15 7/8 20 28.89 16 851 01 A 16.. . 50.. 851 01 RA 16.. . 50.. 41.00 25.42 10.60 2.10 28.13 34.59 21.32 1-20 31.29 18 851 01 A 18.. . 50.. 851 01 RA 18.. . 50.. 41.00 28.60 10.60 2.10 31.38 36.94 24.32 1-3/16 18 33.69 20 851 01 A 20.. . 50.. 851 01 RA 20.. . 50.. 44.00 31.77 13.85 2.65 34.30 40.15 26.73 1-3/16 18 36.89 22 851 01 A 22.. . 50.. 851 01 RA 22.. . 50.. 44.00 34.95 13.85 2.65 37.60 42.24 30.67 1-7/16 18 40.00 24 851 01 A 24.. . 50.. 851 01 RA 24.. . 50.. 44.00 38.12 14.70 2.65 40.70 46.44 33.08 1-7/16 18 43.29 PS PS PS PS PS PS PS PS PS Note : toutes les dimensions sont en mm / all dimensions are in mm 28 851 Prolongateur avec raccord droit pour gaine thermorétractable Cable connecting receptacle with straight backshell for heatshrink sleeving 01 T 01 RT PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Prolongateur avec raccord droit démontable pour gaine thermorétractable Cable connecting receptacle with removable straight backshell for heatshrink sleeving PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max P max M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp souder solder sertir crimp 8 851 01 T 8.. .50.. 851 01 RT 8.. .50.. 36.70 36.00 12.03 10.60 2.10 15.35 24.24 7.20 6.70 20.99 3.70 10 851 01 T 10.. .50.. 851 01 RT 10.. .50.. 36.70 36.00 15.01 10.60 2.10 18.15 27.44 10.20 9.40 24.19 3.70 12 851 01 T 12.. .50.. 851 01 RT 12.. .50.. 36.70 36.00 19.07 10.60 2.10 23.45 29.70 13.20 11.95 26.54 3.70 14 851 01 T 14.. .50.. 851 01 RT 14.. .50.. 36.70 36.00 22.25 10.60 2.10 24.25 32.10 16.10 15.15 28.89 3.70 16 851 01 T 16.. .50.. 851 01 RT 16.. .50.. 39.00 38.30 25.42 10.60 2.10 29.55 34.59 19.25 18.05 31.29 3.70 18 851 01 T 18.. .50.. 851 01 RT 18.. .50.. 39.00 38.30 28.60 10.60 2.10 31.75 36.94 21.30 19.95 33.69 3.70 20 851 01 T 20.. .50.. 851 01 RT 20.. .50.. 45.30 44.20 31.77 13.85 2.65 35.85 40.15 24.40 23.05 36.89 3.70 22 851 01 T 22.. .50.. 851 01 RT 22.. .50.. 45.30 44.20 34.95 13.85 2.65 38.20 42.24 27.50 25.55 40.00 3.70 24 851 01 T 24.. .50.. 851 01 RT 24.. .50.. 44.00 42.60 38.12 14.70 2.65 41.30 46.44 30.60 28.65 43.29 3.70 01 M 01 RM Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max P max M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 01 M 8.. .50.. 851 01 RM 8.. .50 .. 50.00 12.03 10.60 2.10 13.55 24.24 7.05 20.99 3.50 10 851 01 M 10.. .50.. 851 01 RM 10.. .50.. 50.00 15.01 10.60 2.10 15.35 27.44 9.90 24.19 3.50 12 851 01 M 12.. .50.. 851 01 RM 12.. .50.. 50.00 19.07 10.60 2.10 19.48 29.79 12.60 26.54 3.50 14 851 01 M 14.. .50.. 851 01 RM 14.. .50.. 50.00 22.25 10.60 2.10 21.30 32.10 15.90 28.89 3.50 16 851 01 M 16.. .50.. 851 01 RM 16.. .50.. 50.00 25.42 10.60 2.10 24.50 34.59 18.95 31.29 3.50 18 851 01 M 18.. .50.. 851 01 RM 18.. .50.. 50.00 28.60 10.60 2.10 26.45 36.94 20.90 33.69 3.50 20 851 01 M 20.. .50.. 851 01 RM 20.. .50.. 53.30 31.77 13.85 2.65 30.75 40.15 23.70 36.89 3.50 22 851 01 M 22.. .50.. 851 01 RM 22.. .50.. 53.30 34.95 13.85 2.65 34.24 42.24 26.60 40.00 3.50 24 851 01 M 24.. .50.. 851 01 RM 24.. .50.. 53.30 38.12 14.70 2.65 36.47 46.44 29.30 43.29 3.50 Note : toutes les dimensions sont en mm / all dimensions are in mm 29 851 Prolongateur avec raccord droit démontable pour reprise de tresse et gaine thermorétractable / Cable connecting receptacle with removable straight backshell for screen termination and heatshrink sleeving PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 01 G 01 RG 01 T 01 RT PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max M max P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 01 G 8.. . 50.. 851 01 RG 8.. . 50 .. 54.00 12.03 10.60 2.10 16.30 24.24 7.45 3.60 20.99 10 851 01 G 10.. . 50.. 851 01 RG 10.. . 50.. 54.00 15.01 10.60 2.10 18.30 27.44 10.30 3.60 24.19 12 851 01 G 12.. . 50.. 851 01 RG 12.. . 50.. 54.00 19.07 10.60 2.10 22.30 29.79 13.20 3.60 26.54 14 851 01 G 14.. . 50.. 851 01 RG 14.. . 50.. 54.00 22.25 10.60 2.10 25.30 32.10 16.50 3.60 28.89 16 851 01 G 16.. . 50.. 851 01 RG 16.. . 50.. 54.00 25.42 10.60 2.10 28.30 34.59 19.35 3.60 31.29 18 851 01 G 18.. . 50.. 851 01 RG 18.. . 50.. 54.00 28.60 10.60 2.10 32.30 36.94 21.60 3.60 33.69 20 851 01 G 20.. . 50.. 851 01 RG 20.. . 50.. 59.30 31.77 13.85 2.65 34.30 40.15 24.80 3.60 36.89 22 851 01 G 22.. . 50.. 851 01 RG 22.. . 50.. 59.30 34.95 13.85 2.65 38.30 42.24 27.90 3.60 40.00 24 851 01 G 24.. . 50.. 851 01 RG 24.. . 50.. 59.30 38.12 14.70 2.65 41.30 46.44 31.00 3.60 43.29 PS PS PS PS PS PS PS PS PS Prolongateur avec raccord droit démontable pour reprise de tresse et gaine thermorétractable (spécifications 38 & 42) / Cable connecting receptacle with removable straight backshell for screen termination and heatshrink sleeving (38 & 42 suffix) Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G max M max P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 01 T 8.. .50 851 01 RT 8.. .50 51.60 12.03 10.60 2.10 18.25 24.24 7.45 3.70 20.99 10 851 01 T 10.. .50 851 01 RT 10.. .50 51.60 15.01 10.60 2.10 20.25 27.44 9.00 3.70 24.19 12 851 01 T 12.. .50 851 01 RT 12.. .50 51.60 19.07 10.60 2.10 24.75 29.79 13.30 3.70 26.54 14 851 01 T 14.. .50 851 01 RT 14.. .50 51.60 22.25 10.60 2.10 27.75 32.10 16.50 3.70 28.89 16 851 01 T 16.. .50 851 01 RT 16.. .50 51.60 25.42 10.60 2.10 30.05 34.59 18.50 3.70 31.29 18 851 01 T 18.. .50 851 01 RT 18.. .50 52.00 28.60 10.60 2.10 34.15 36.94 21.90 3.70 33.69 20 851 01 T 20.. .50 851 01 RT 20.. .50 55.10 31.77 13.85 2.65 37.25 40.15 25.10 3.70 36.89 22 851 01 T 22.. .50 851 01 RT 22.. .50 55.10 34.95 13.85 2.65 40.45 42.24 28.20 3.70 40.00 24 851 01 T 24.. .50 851 01 RT 24.. .50 55.10 38.12 14.70 2.65 43.65 46.44 31.40 3.70 43.29 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 Note : toutes les dimensions sont en mm / all dimensions are in mm 30 851 Prolongateur avec raccord droit à presse-étoupe Cable connecting receptacle with straight sealing gland backshell 01 J HE 301 B 01 J PS PS PS PS PS PS PS PS PS Prolongateur avec raccord droit à presse-étoupe et serre-câbles Cable connecting receptacle with straight sealing gland and cable clamp backshell PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp min max 8 851 01 J 8.. . 50.. - 47.60 - 12.03 10.60 2.10 14.40 24.24 5.02 5.84 20.99 10 851 01 J 10.. . 50.. - 47.60 - 15.01 10.60 2.10 17.60 27.44 5.94 6.76 24.19 12 851 01 J 12.. . 50.. - 48.70 - 19.07 10.60 2.10 21.10 29.79 9.34 10.16 26.54 14 851 01 J 14.. . 50.. - 53.50 - 22.25 10.60 2.10 24.40 32.10 11.32 12.14 28.89 16 851 01 J 16.. . 50.. - 59.00 - 25.42 10.60 2.10 27.60 34.59 14.73 15.55 31.29 18 851 01 J 18.. . 50.. - 65.00 - 28.60 10.60 2.10 30.80 36.94 16.00 16.82 33.69 20 851 01 J 20.. . 50.. - 79.10 - 31.77 13.85 2.65 34.10 40.15 16.89 17.71 36.89 22 851 01 J 22.. . 50.. - 80.00 - 34.95 13.85 2.65 37.30 42.24 17.78 18.60 40.00 24 851 01 J 24.. . 50.. - 90.00 - 38.12 14.70 2.65 40.50 46.44 20.34 21.16 43.29 01 JC MS 3111 J Taille de boîtier Shell size Références / Part numbers L max A B max C max D max F max G P contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp min max 8 851 01 JC 8.. .50.. - 57.68 - 12.03 10.60 2.10 19.90 24.24 5.02 5.84 20.99 10 851 01 JC 10.. .50.. - 57.68 - 15.01 10.60 2.10 21.50 27.44 5.94 6.76 24.19 12 851 01 JC 12.. .50.. - 61.24 - 19.07 10.60 2.10 25.00 29.79 9.34 10.16 26.54 14 851 01 JC 14.. .50.. - 66.01 - 22.25 10.60 2.10 27.80 32.10 11.32 12.14 28.89 16 851 01 JC 16.. .50.. - 74.75 - 25.42 10.60 2.10 29.40 34.59 14.73 15.50 31.29 18 851 01 JC 18.. .50.. - 80.57 - 28.60 10.60 2.10 35.30 36.94 16.00 16.82 33.69 20 851 01 JC 20.. .50.. - 91.69 - 31.77 13.85 2.65 35.30 40.15 16.89 17.71 36.89 22 851 01 JC 22.. .50.. - 95.66 - 34.95 13.85 2.65 41.10 42.24 17.78 18.60 40.00 24 851 01 JC 24.. .50.. - 101.22 - 38.12 14.70 2.65 42.40 46.44 20.34 21.16 43.29 Note : toutes les dimensions sont en mm / all dimensions are in mm 31 851 Fiche avec raccord simple Plug with backnut Fiche avec raccord droit à serre-câbles Plug with straight cable clamp PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 06 EC HE 301 B 06 EC MS 3116 F 06 AC HE 301 B 06 AC 06 RC HE 301 B 06 RC MS 3126 F VG 95328 K 06 E HE 301 B 06 E MS 3116 E 06 R HE 301 B 06 R MS 3126 E PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max D contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 06 E 8 .. . 50.. 851 06 R 8 .. . 50 .. 32.54 32.00 19.05 13.50 10 851 06 E 10 .. . 50.. 851 06 R 10 .. . 50.. 32.54 32.00 21.80 16.70 12 851 06 E 12 .. . 50.. 851 06 R 12 .. . 50.. 32.54 32.00 26.15 19.90 14 851 06 E 14 .. . 50.. 851 06 R 14 .. . 50.. 32.54 32.00 29.35 23.40 16 851 06 E 16 .. . 50.. 851 06 R 16 .. . 50.. 32.54 32.00 32.50 26.60 18 851 06 E 18 .. . 50.. 851 06 R 18 .. . 50.. 32.54 32.00 35.30 29.60 20 851 06 E 20 .. . 50.. 851 06 R 20 .. . 50.. 33.30 32.10 38.85 32.70 22 851 06 E 22 .. . 50.. 851 06 R 22 .. . 50.. 33.30 32.10 42.05 36.00 24 851 06 E 24 .. . 50.. 851 06 R 24 .. . 50.. 33.30 32.10 45.10 39.10 PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max D max contacts à souder G solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 06 8 .. . 50.. 851 06 RC 8 .. . 50 .. 48.00 47.30 19.05 19.90 3.50 10 851 06 10 .. . 50.. 851 06 RC 10 .. . 50.. 48.00 47.30 21.80 21.50 5.00 12 851 06 12 .. . 50.. 851 06 RC 12 .. . 50.. 48.00 47.30 26.15 25.00 8.20 14 851 06 14 .. . 50.. 851 06 RC 14 .. . 50.. 48.00 47.30 29.35 27.80 10.00 16 851 06 16 .. . 50.. 851 06 RC 16 .. . 50.. 51.00 50.50 32.50 29.40 13.00 18 851 06 18 .. . 50.. 851 06 RC 18 .. . 50.. 51.00 50.50 35.30 35.30 16.00 20 851 06 20 .. . 50.. 851 06 RC 20 .. . 50.. 52.00 50.20 38.85 35.30 16.00 22 851 06 22 .. . 50.. 851 06 RC 22 .. . 50.. 52.00 50.20 42.05 41.10 19.30 24 851 06 24 .. . 50.. 851 06 RC 24 .. . 50.. 52.00 50.20 45.10 42.40 20.60 EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC EC AC Note : toutes les dimensions sont en mm / all dimensions are in mm 32 851 Fiche avec raccord droit pour potting Plug with straight backshell for potting PS PS PS PS PS PS PS PS PS Fiche avec raccord droit intermédiaire Plug with straight adaptor PS PS PS PS PS PS PS PS PS 06 P HE 301 B 06 P MS 3116 P 06 RP HE 301 B 06 RP MS 3126 P Taille de boîtier Shell size Références / Part numbers L max A max D max contacts à souder G solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 06 P 8 .. . 50.. 851 06 RP 8 .. . 50 .. 36.20 42.10 19.05 15.34 10.46 10 851 06 P 10 .. . 50.. 851 06 RP 10 .. . 50.. 36.20 42.10 21.80 17.70 13.55 12 851 06 P 12 .. . 50.. 851 06 RP 12 .. . 50.. 36.20 42.10 26.15 21.69 13.96 14 851 06 P 14 .. . 50.. 851 06 RP 14 .. . 50.. 36.20 42.10 29.35 23.90 17.42 16 851 06 P 16 .. . 50.. 851 06 RP 16 .. . 50.. 36.20 42.10 32.50 27.00 20.56 18 851 06 P 18 .. . 50.. 851 06 RP 18 .. . 50.. 37.70 45.40 35.30 30.50 23.66 20 851 06 P 20 .. . 50.. 851 06 RP 20 .. . 50.. 42.40 50.00 38.85 33.65 23.92 22 851 06 P 22 .. . 50.. 851 06 RP 22 .. . 50.. 42.40 50.00 42.05 37.10 25.52 24 851 06 P 24 .. . 50.. 851 06 RP 24 .. . 50.. 42.85 50.00 45.10 40.00 32.00 PS PS PS PS PS PS PS PS PS 06 A HE 301 B 06 A 06 RA HE 301 B 06 RA Taille de boîtier Shell size Références / Part numbers L max A max D max G max F filetage threading UNEF 2A contacts à souder solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 06 A 8 .. . 50.. 851 06 RA 8 .. . 50 .. 41.00 41.00 19.05 14.50 9.10 1/2 28 10 851 06 A 10 .. . 50.. 851 06 RA 10 .. . 50.. 41.00 41.00 21.80 18.70 12.08 5/8 24 12 851 06 A 12 .. . 50.. 851 06 RA 12 .. . 50.. 41.00 41.00 26.15 21.70 15.25 3/4 20 14 851 06 A 14 .. . 50.. 851 06 RA 14 .. . 50.. 41.00 41.00 29.35 25.10 18.15 7/8 20 16 851 06 A 16 .. . 50.. 851 06 RA 16 .. . 50.. 41.00 41.00 32.50 28.13 21.32 1-20 18 851 06 A 18 .. . 50.. 851 06 RA 18 .. . 50.. 41.00 41.00 35.30 31.38 24.32 1-3/16 18 20 851 06 A 20 .. . 50.. 851 06 RA 20 .. . 50.. 44.00 43.30 38.85 34.30 26.73 1-3/16 18 22 851 06 A 22 .. . 50.. 851 06 RA 22 .. . 50.. 44.00 43.30 42.05 37.60 30.67 1-7/16 18 24 851 06 A 24 .. . 50.. 851 06 RA 24 .. . 50.. 44.00 43.50 45.10 40.70 33.08 1-7/16 18 PS PS PS PS PS PS PS PS PS Note : toutes les dimensions sont en mm / all dimensions are in mm 33 851 Fiche avec raccord droit pour gaine thermorétractable Plug with straight backshell for heatshrink sleeving Fiche avec raccord droit démontable pour gaine thermorétractable Plug with removable straight backshell for heatshrink sleeving PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS 06 M 06 RM 06 T 06 RT VG 95328 J PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max D max G max M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp souder solder sertir crimp 8 851 06 T 8.. . 50.. 851 06 RT 8.. . 50 .. 36.70 36.00 19.05 15.35 7.20 6.70 3.70 10 851 06 T 10.. . 50.. 851 06 RT 10.. . 50.. 36.70 36.00 21.80 18.15 10.20 9.40 3.70 12 851 06 T 12.. . 50.. 851 06 RT 12.. . 50.. 36.70 36.00 26.15 23.45 13.20 11.95 3.70 14 851 06 T 14.. . 50.. 851 06 RT 14.. . 50.. 36.70 36.00 29.35 24.25 16.10 15.15 3.70 16 851 06 T 16.. . 50.. 851 06 RT 16.. . 50.. 39.00 38.30 32.50 29.55 19.25 18.05 3.70 18 851 06 T 18.. . 50.. 851 06 RT 18.. . 50.. 39.00 38.30 35.30 31.75 21.30 19.95 3.70 20 851 06 T 20.. . 50.. 851 06 RT 20.. . 50.. 44.00 42.90 38.85 35.85 24.40 23.05 3.70 22 851 06 T 22.. . 50.. 851 06 RT 22.. . 50.. 44.00 42.90 42.05 38.20 27.50 25.55 3.70 24 851 06 T 24.. . 50.. 851 06 RT 24.. . 50.. 42.70 41.60 45.10 41.30 30.60 28.65 3.70 Taille de boîtier Shell size Références / Part numbers L max A max D max G max M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 06 M 8 .. . 50.. 851 06 RM 8 .. . 50 .. 50.00 19.05 13.55 7.05 3.50 10 851 06 M 10 .. . 50.. 851 06 RM 10 .. . 50.. 50.00 21.80 15.35 9.90 3.50 12 851 06 M 12 .. . 50.. 851 06 RM 12 .. . 50.. 50.00 26.15 19.48 12.60 3.50 14 851 06 M 14 .. . 50.. 851 06 RM 14 .. . 50.. 50.00 29.35 21.30 15.90 3.50 16 851 06 M 16 .. . 50.. 851 06 RM 16 .. . 50.. 50.00 32.50 24.50 18.95 3.50 18 851 06 M 18 .. . 50.. 851 06 RM 18 .. . 50.. 50.00 35.30 26.45 20.90 3.50 20 851 06 M 20 .. . 50.. 851 06 RM 20 .. . 50.. 52.00 38.85 30.73 23.70 3.50 22 851 06 M 22 .. . 50.. 851 06 RM 22 .. . 50.. 52.00 42.05 34.24 26.60 3.50 24 851 06 M 24 .. . 50.. 851 06 RM 24 .. . 50.. 52.00 45.10 36.47 29.30 3.50 Note : toutes les dimensions sont en mm / all dimensions are in mm 34 851 Fiche avec raccord droit à presse-étoupe Plug with straight sealing gland backshell PS PS PS PS PS PS PS PS PS Fiche avec raccord droit à presse-étoupe et serre-câbles Plug with straight sealing gland and cable clamp backshells PS PS PS PS PS PS PS PS PS 06 J HE 301 B 06 J 06 JC MS 3116 J Taille de boîtier Shell size Références / Part numbers L max A max D max G max contacts à souder solder contacts contacts à sertir crimp contacts souder solder sertir crimp min max 8 851 06 J 8 .. . 50.. - 47.60 - 19.05 14.40 5.02 5.84 10 851 06 J 10 .. . 50.. - 47.60 - 21.80 17.60 5.94 6.76 12 851 06 J 12 .. . 50.. - 49.20 - 26.15 21.10 9.34 10.16 14 851 06 J 14 .. . 50.. - 54.00 - 29.35 24.40 11.32 12.14 16 851 06 J 16 .. . 50.. - 59.60 - 32.50 27.60 14.73 15.55 18 851 06 J 18 .. . 50.. - 65.60 - 35.30 30.80 16.00 16.80 20 851 06 J 20 .. . 50.. - 78.00 - 38.85 34.10 16.89 17.71 22 851 06 J 22 .. . 50.. - 79.50 - 42.05 37.30 17.78 18.60 24 851 06 J 24 .. . 50.. - 90.00 - 45.10 40.50 20.34 21.16 Taille de boîtier Shell size Références / Part numbers L max A max D max G max contacts à souder solder contacts contacts à sertir crimp contacts souder solder sertir crimp min max 8 851 06 JC 8 .. . 50.. - 57.68 - 19.05 19.90 5.02 5.84 10 851 06 JC 10 .. . 50.. - 57.68 - 21.80 21.50 5.94 6.76 12 851 06 JC 12 .. . 50.. - 61.24 - 26.15 25.00 9.34 10.16 14 851 06 JC 14 .. . 50.. - 66.01 - 29.35 27.80 11.32 12.14 16 851 06 JC 16 .. . 50.. - 74.75 - 32.50 29.40 14.73 15.50 18 851 06 JC 18 .. . 50.. - 80.57 - 35.30 35.30 16.00 16.82 20 851 06 JC 20 .. . 50.. - 91.69 - 38.85 35.30 16.89 17.71 22 851 06 JC 22 .. . 50.. - 95.66 - 42.05 41.10 17.78 18.60 24 851 06 JC 24 .. . 50.. - 101.22 - 45.10 42.40 20.34 21.16 Note : toutes les dimensions sont en mm / all dimensions are in mm 35 851 Fiche avec raccord coudé à serre-câbles Plug with elbow cable clamp backshell PS PS PS PS PS PS PS PS PS 08 EC HE 301 B 08 EC 08 RC HE 301 B 08 RC PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max D max G R contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 08 EC 8 .. . 50.. 851 08 RC 8 .. . 50.. 50.10 19.05 19.70 3.50 16.00 10 851 08 EC 10 .. . 50.. 851 08 RC 10 .. . 50.. 52.60 21.80 21.20 5.00 18.00 12 851 08 EC 12 .. . 50.. 851 08 RC 12 .. . 50.. 54.90 26.15 24.20 8.20 19.50 14 851 08 EC 14 .. . 50.. 851 08 RC 14 .. . 50.. 58.50 29.35 27.50 10.00 22.00 16 851 08 EC 16 .. . 50.. 851 08 RC 16 .. . 50.. 60.80 32.50 29.10 13.00 23.50 18 851 08 EC 18 .. . 50.. 851 08 RC 18 .. . 50.. 65.00 35.30 35.70 16.00 25.00 20 851 08 EC 20 .. . 50.. 851 08 RC 20 .. . 50.. 69.10 38.85 35.70 16.00 26.50 22 851 08 EC 22 .. . 50.. 851 08 RC 22 .. . 50.. 71.00 42.05 39.70 19.30 28.00 24 851 08 EC 24 .. . 50.. 851 08 EC 24 .. . 50.. 75.50 45.10 43.50 20.60 31.00 Fiche avec raccord coudé pour potting Plug with elbow backshell for potting PS PS PS PS PS PS PS PS PS 08 P HE 301 B 08 P 08 RP HE 301 B 08 RP PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max G max R max S contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 08 P 8 .. . 50.. 851 08 RP 8 .. . 50.. 40.70 19.05 8.10 11.70 11.30 10 851 08 P 10 .. . 50.. 851 08 RP 10 .. . 50.. 44.90 21.80 11.30 14.35 14.50 12 851 08 P 12 .. . 50.. 851 08 RP 12 .. . 50.. 46.90 26.15 13.30 15.90 17.70 14 851 08 P 14 .. . 50.. 851 08 RP 14 .. . 50.. 49.20 29.35 16.10 16.30 20.10 16 851 08 P 16 .. . 50.. 851 08 RP 16 .. . 50.. 50.60 32.50 16.90 19.30 22.80 18 851 08 P 18 .. . 50.. 851 08 RP 18 .. . 50.. 51.80 35.30 18.10 20.60 25.60 20 851 08 P 20 .. . 50.. 851 08 RP 20 .. . 50.. 53.70 38.85 19.70 21.90 28.80 22 851 08 P 22 .. . 50.. 851 08 RP 22 .. . 50.. 54.80 42.05 20.80 23.50 31.60 24 851 08 P 24 .. . 50.. 851 08 RP 24 .. . 50.. 58.20 45.10 24.20 30.15 35.20 Note : toutes les dimensions sont en mm / all dimensions are in mm 36 851 Fiche avec bracelet de blindage et raccord intermédiaire Screened plug with straight adaptor PS PS PS PS PS PS PS PS PS 36 A 36 RA VG 95328 N PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max D max G max F filetage threading UNEF 2A contacts à souder solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 36 A 8 .. . 50.. 851 36 RA 8 .. . 50.. 41.00 19.05 14.50 9.10 1/2 28 10 851 36 A 10 .. . 50.. 851 36 RA 10 .. . 50.. 41.00 21.80 18.70 12.08 5/8 24 12 851 36 A 12 .. . 50.. 851 36 RA 12 .. . 50.. 41.00 26.15 21.70 15.25 3/4 20 14 851 36 A 14 .. . 50.. 851 36 RA 14 .. . 50.. 41.00 29.35 25.10 18.15 7/8 20 16 851 36 A 16 .. . 50.. 851 36 RA 16 .. . 50.. 41.00 32.50 28.13 21.32 1-20 18 851 36 A 18 .. . 50.. 851 36 RA 18 .. . 50.. 41.00 35.30 31.38 24.32 1-3/16 18 20 851 36 A 20 .. . 50.. 851 36 RA 20 .. . 50.. 43.30 38.85 34.30 26.73 1-3/16 18 22 851 36 A 22 .. . 50.. 851 36 RA 22 .. . 50.. 43.30 42.05 37.60 30.67 1-7/16 18 24 851 36 A 24 .. . 50.. 851 36 RA 24 .. . 50.. 43.50 45.10 40.70 33.08 1-7/16 18 Note : toutes les dimensions sont en mm / all dimensions are in mm PS PS PS PS PS PS PS PS PS 36 T 36 RT PS PS PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max D max G max M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 36 T 8 .. . 50.. 851 36 RT 8 .. . 50.. 51.60 19.05 18.25 7.45 3.70 10 851 36 T 10 .. . 50.. 851 36 RT 10 .. . 50.. 51.60 21.80 20.25 9.00 3.70 12 851 36 T 12 .. . 50.. 851 36 RT 12 .. . 50.. 51.60 26.15 24.75 13.30 3.70 14 851 36 T 14 .. . 50.. 851 36 RT 14 .. . 50.. 51.60 29.35 27.75 16.50 3.70 16 851 36 T 16 .. . 50.. 851 36 RT 16 .. . 50.. 51.60 32.50 30.05 18.50 3.70 18 851 36 T 18 .. . 50.. 851 36 RT 18 .. . 50.. 52.00 35.30 34.15 21.90 3.70 20 851 36 T 20 .. . 50.. 851 36 RT 20 .. . 50.. 53.90 38.85 37.25 25.10 3.70 22 851 36 T 22 .. . 50.. 851 36 RT 22 .. . 50.. 53.90 42.05 40.45 28.20 3.70 24 851 36 T 24 .. . 50.. 851 36 RT 24 .. . 50.. 53.90 45.10 43.65 31.40 3.70 Fiche avec bague de blindage et raccord droit démontable pour reprise de tresse et gaine thermorétractable (spécifications 38 & 42)/ Screened plug with removable straight backshell for screen termination and heatshrink sleeving (38 & 42 suffix) 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 38 42 37 851 Fiche avec bague de blindage et raccord droit démontable pour reprise de tresse et gaine thermorétractable / Screened plug with removable straight backshell for screen termination and heatshrink sleeving 36 G 36 RG VG 95328 M Taille de boîtier Shell size Références / Part numbers L max A max D max G max M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 851 36 G 8 .. . 50.. 851 36 RG 8 .. . 50.. 54.00 19.05 16.30 7.45 3.60 10 851 36 G10 .. . 50.. 851 36 RG 10 .. . 50.. 54.00 21.80 18.30 10.30 3.60 12 851 36 G 12 .. . 50.. 851 36 RG 12 .. . 50.. 54.00 26.15 22.30 13.20 3.60 14 851 36 G 14 .. . 50.. 851 36 RG 14 .. . 50.. 54.00 29.35 25.30 16.50 3.60 16 851 36 G 16 .. . 50.. 851 36 RG 16 .. . 50.. 54.00 32.50 28.30 19.35 3.60 18 851 36 G 18 .. . 50.. 851 36 RG 18 .. . 50.. 54.00 35.30 32.30 21.60 3.60 20 851 36 G 20 .. . 50.. 851 36 RG 20 .. . 50.. 58.00 38.85 34.30 24.80 3.60 22 851 36 G 22 .. . 50.. 851 36 RG 22 .. . 50.. 58.00 42.05 38.30 27.90 3.60 24 851 36 G 24 .. . 50.. 851 36 RG 24 .. . 50.. 58.00 45.10 41.30 31.00 3.60 PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS PS Note : toutes les dimensions sont en mm / all dimensions are in mm PS PS PS PS PS PS PS 06 Z 06 RZ PS PS PS PS PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max B max C max D filetage threading PE contacts à souder solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 10 12 851 06 Z 12 .. . 50.. 851 06 RZ 12 .. . 50.. 43.00 26.15 9.10 24.80 11 14 851 06 Z14 .. . 50.. 851 06 RZ 14 .. . 50.. 45.00 29.35 11.00 28.80 16 16 851 06 Z 16 .. . 50.. 851 06 RZ 16 .. . 50.. 45.00 32.50 11.00 30.80 16 18 851 06 Z 18 .. . 50.. 851 06 RZ 18 .. . 50.. 46.00 35.30 12.00 40.80 21 20 851 06 Z 20 .. . 50.. 851 06 RZ 20 .. . 50.. 46.50 38.85 12.00 40.80 21 22 851 06 Z 22 .. . 50.. 851 06 RZ 22 .. . 50.. 46.50 42.05 12.00 40.80 21 24 851 06 Z24 .. . 50.. 851 06 RZ 24 .. . 50.. 65.50 45.10 31.40 45.00 29 Fiche avec raccord pour adaptation d’accessoires au pas électrique Plug with straight adaptor for electrical pitch access Le manchon intermédiaire spécial de type Z qui équipe la fiche à sertir 851 06 RZ est adapté aux accessoires de câblages. - Raccord à griffes et presse-étoupe - Raccord pour gaine polyflex - Raccord pour tuyau C.N.O.M.O. The Z type special adaptor which equips crimp plug 851 06 RZ fits following accessories. - Packing gland collet backshell - Backshell for polyflex sleeving - Backshell for C.N.O.M.O. tube 38 851 Fiche avec bague de blindage et doigt de verrouillage, avec raccord droit court à reprise de tresse et gaine thermorétractable / Screened plug with lock finger and short backshell for screen termination and heatshrink sleeving PS PS PS 76 U 76 RU PS PS PS Taille de boîtier Shell size Références / Part numbers L max A max D max H max G max E max M contacts à souder max solder contacts contacts à sertir crimp contacts souder solder sertir crimp 8 10 12 851 76 U 12.. . 50.. 851 76 R U 12.. .50.. 35.60 25.00 22.50 32.00 13.20 19.50 3.70 14 851 76 U 14.. . 50.. 851 76 R U 14.. .50.. 35.60 29.00 25.50 32.00 16.10 21.00 3.70 16 851 76 U 16.. . 50.. 851 76 R U 16.. .50.. 35.60 32.00 28.50 32.00 19.25 22.50 3.70 18 20 22 24 Note : toutes les dimensions sont en mm / all dimensions are in mm 39 851 Embase à fixation par écrou Jam nut receptacle PS PS PS PS PS PS PS PS PS 07 H HE 301 B 07 H MS 3114 H VG 95328 F Taille de boîtier Shell size Références / Part numbers A C max D max G L max M max P 8 851 07 H 8 .. . 50.. 12.03 24.07 27.37 14.26 20.53 17.93 13.33 10 851 07 H 10 .. . 50.. 15.01 27.22 30.57 17.43 20.53 17.93 16.51 12 851 07 H 12 .. . 50.. 19.07 32.00 35.32 22.19 20.53 17.93 20.63 14 851 07 H 14 .. . 50.. 22.25 35.17 38.50 25.36 20.53 17.93 23.78 16 851 07 H 16 .. . 50.. 25.42 38.35 41.67 28.54 20.53 17.93 26.93 18 851 07 H 18 .. . 50.. 28.60 41.52 44.85 31.71 20.53 17.93 30.10 20 851 07 H 20 .. . 50.. 31.77 46.27 49.62 34.89 26.10 22.70 33.28 22 851 07 H 22 .. . 50.. 34.95 49.47 52.77 38.06 26.10 22.70 36.45 24 851 07 H 24 .. . 50.. 38.12 52.62 55.97 41.24 26.93 23.54 39.63 Connecteurs hermétiques / Hermetic connectors Embase à collerette carrée Square flange receptacle PS PS PS PS PS PS PS PS PS 02 H HE 301 B 02 H Taille de boîtier Shell size Références / Part numbers A C max D max E F G H max J M max N max 8 851 02 H 8 .. . 50.. 12.03 21.42 27.09 15.09 13.84 14.27 6.97 3.13 11.24 1.67 10 851 02 H 10 .. . 50.. 15.01 24.62 31.87 18.26 13.84 17.06 6.97 3.13 11.24 1.67 12 851 02 H 12 .. . 50.. 19.07 26.98 35.04 20.62 13.84 19.85 6.97 3.13 11.24 1.67 14 851 02 H 14 .. . 50.. 22.25 29.36 38.22 23.00 13.84 23.00 6.97 3.13 11.24 1.67 16 851 02 H 16 .. . 50.. 25.42 31.73 41.39 24.61 13.84 26.18 6.97 3.13 11.24 1.67 18 851 02 H 18 .. . 50.. 28.60 34.12 44.57 26.97 13.84 29.36 6.97 3.13 11.24 1.67 20 851 02 H 20 .. . 50.. 31.77 37.20 47.74 29.36 15.42 31.74 6.99 3.13 12.00 2.48 22 851 02 H 22 .. . 50.. 34.95 40.47 50.92 31.75 16.23 34.92 6.99 3.13 12.00 2.48 24 851 02 H 24 .. . 50.. 38.12 43.66 55.69 34.92 17.04 38.10 6.19 3.81 12.81 2.48 Note : toutes les dimensions sont en mm / all dimensions are in mm 40 851 Connecteurs pour connexions enroulées et à picots droits Wire-wrap and PC tail connectors Embase à collerette ronde, fixation par brasage Solder fixing receptacle PS PS PS PS PS PS PS PS PS IH HE 301 B 1H MS 3113 H VG 95328 G Taille de boîtier Shell size Références / Part numbers A D max H max F G max M max N max 8 851 IH 8 .. . 50.. 12.03 16.40 8.19 13.84 14.27 10.69 0.76 10 851 IH 10 .. . 50.. 15.01 19.40 8.19 13.84 17.06 10.69 0.76 12 851 IH 12 .. . 50.. 19.07 21.80 8.19 13.84 19.83 10.69 0.76 14 851 IH 14 .. . 50.. 22.25 25.00 8.19 13.84 23.00 10.69 0.76 16 851 IH 16 .. . 50.. 25.42 28.10 8.19 13.84 26.18 10.69 0.76 18 851 IH 18 .. . 50.. 28.60 31.30 8.19 13.84 29.36 10.69 0.76 20 851 IH 20 .. . 50.. 31.77 33.70 8.16 15.42 31.74 12.32 0.76 22 851 IH 22 .. . 50.. 34.95 36.90 8.16 16.23 34.92 12.32 0.76 24 851 IH 24 .. . 50.. 38.12 40.10 7.36 17.04 38.10 13.12 0.76 Embase à collerette carrée type 02E Square flange receptacle type 02E PS PS PS PS PS PS PS PS PS Version pour connexions enroulées (WW) Wire-wrap version Version à picots droits PC tail version Taille de boîtier Shell size Références / Part numbers A B max C max Ø D max E F max H +1.63 0 J L max T +1.25 0 version WW WW version version à picots PC tail version 8 851 02 E 8.. .50.. 851 02 E 8.. .50.. 12.03 11.70 1.32 10.84 15.09 20.99 12.42 3.13 20.50 9.46 10 851 02 E 10.. .50.. 851 02 E 10.. .50.. 15.01 11.70 1.32 13.99 18.26 24.19 12.42 3.13 20.50 9.46 12 851 02 E 12.. .50.. 851 02 E 12.. .50.. 19.07 11.70 1.32 17.37 20.62 26.54 12.42 3.13 20.50 9.46 14 851 02 E 14.. .50.. 851 02 E 14.. .50.. 22.25 11.70 1.32 20.57 23.00 28.89 12.42 3.13 20.50 9.46 16 851 02 E 16.. .50.. 851 02 E 16.. .50.. 25.42 11.70 1.32 23.62 24.61 31.29 12.42 3.13 20.50 9.46 18 851 02 E 18.. .50.. 851 02 E 18.. .50.. 28.60 11.70 1.32 26.69 26.97 33.69 12.42 3.13 20.50 9.46 20 851 02 E 20.. .50.. 851 02 E 20.. .50.. 31.77 14.35 2.15 29.89 29.36 36.89 10.69 3.13 23.80 7.76 22 851 02 E 22.. .50.. 851 02 E 22.. .50.. 34.95 14.35 2.15 33.04 31.75 39.99 10.69 3.13 23.80 7.76 24 851 02 E 24.. .50.. 851 02 E 24.. .50.. 38.12 15.20 2.15 36.24 34.92 43.15 10.69 3.81 23.80 7.76 PS PS PS PS PS PS PS PS PS 16 40 16 40 16 40 16 40 16 40 16 40 16 40 16 40 16 40 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A Note : toutes les dimensions sont en mm / all dimensions are in mm 41 851 Perçage cloison Panel cut-out Taille de boîtier Shell size A±0.1 B±0.1 C±0.1 E±0.15 J±0.15 N P±0.1 X min max min 8 15.55 14.60 14.70 15.10 3.15 1.57 3.17 13.75 2.90 10 18.80 17.75 17.50 18.26 3.15 1.57 3.17 16.95 2.90 12 22.15 22.50 20.20 20.62 3.15 1.57 3.17 21.50 2.90 14 25.30 25.70 23.40 23.00 3.15 1.57 3.17 24.20 2.90 16 28.45 28.85 26.60 24.60 3.15 1.57 3.17 27.35 2.90 18 31.65 32.05 29.80 26.97 3.15 1.57 3.17 30.55 2.90 20 34.80 35.20 32.10 29.36 3.15 1.57 6.35 33.70 5.50 22 38.00 38.40 35.30 31.75 3.15 1.57 6.35 36.90 5.50 24 41.20 41.55 38.40 34.92 3.73 1.57 6.35 40.05 5.50 Embase à fixation par écrou type 07A Jam nut receptacle type 07A PS PS PS PS PS PS PS PS PS Version pour connexions enroulées (WW) Wire-wrap version Version à picots droits PC tail version Taille de boîtier Shell size Références / Part numbers A B max C max F max H +1.63 0 L max P max S max T +1.25 0 version WW WW version version à picots PC tail version 8 851 07 A 8.. .50.. 851 07 A 8.. .50.. 12.03 17.90 2.64 26.94 12.42 20.64 19.29 23.94 9.46 10 851 07 A 10.. .50.. 851 07 A 10.. .50.. 15.01 17.90 2.64 30.14 12.42 20.64 22.38 26.95 9.46 12 851 07 A 12.. .50.. 851 07 A 12.. .50.. 19.07 17.90 2.64 34.94 12.42 20.64 27.13 31.74 9.46 14 851 07 A 14.. .50.. 851 07 A 14.. .50.. 22.25 17.90 2.64 38.04 12.42 20.64 30.33 34.94 9.46 16 851 07 A 16.. .50.. 851 07 A 16.. .50.. 25.42 17.90 2.64 41.26 12.42 20.64 33.48 38.24 9.46 18 851 07 A 18.. .50.. 851 07 A 18.. .50.. 28.60 17.90 2.64 44.44 12.42 20.64 36.68 41.34 9.46 20 851 07 A 20.. .50.. 851 07 A 20.. .50.. 31.77 22.45 3.44 49.14 8.64 25.99 39.83 46.04 8.49 22 851 07 A 22.. .50.. 851 07 A 22.. .50.. 34.95 22.45 3.44 52.24 8.64 25.99 43.03 49.24 8.49 24 851 07 A 24.. .50.. 851 07 A 24.. .50.. 38.12 23.30 3.44 55.54 7.79 26.84 46.18 52.74 7.79 PS PS PS PS PS PS PS PS PS 16 40 16 40 16 40 16 40 16 40 16 40 16 40 16 40 16 40 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A 34 34A Embase à collerette carrée Square flange receptacle Embase à fixation par écrou Jam nut receptacle Embase à collerette ronde Solder fixing receptacle Note : toutes les dimensions sont en mm / all dimensions are in mm 42 851 Embase de repos Dummy receptacle Accessoires / Accessories Taille de boîtier Shell size Références Part numbers A C max E J M max N max 8 8500-18 12.03 20.99 15.09 3.13 11.70 1.32 10 8500-19 15.01 24.19 18.26 3.13 11.70 1.32 12 8500-20 19.07 26.54 20.62 3.13 11.70 1.32 14 8500-21 22.25 28.89 23.00 3.13 11.70 1.32 16 8500-26 25.42 31.29 24.61 3.13 11.70 1.32 18 8500-22 28.60 33.69 26.97 3.13 11.70 1.32 20 8500-23 31.77 36.89 29.36 3.13 14.35 2.15 22 8500-24 34.95 39.99 31.75 3.13 14.35 2.15 24 8500-25 38.12 43.15 34.92 3.81 15.20 2.15 Bouchons de protection plastique pour embase & fiche Plastic protective caps for receptacle and plug Taille de boîtier Shell size Bouchons pour embase Caps for receptacles Bouchons pour fiches Caps for plugs 8 8500-5585 A 8500-5594 10 8500-5586 A 8500-5595 12 8500-5587 A 8500-5596 14 8500-5588 A 8500-5597 16 8500-5589 A 8500-5598 18 8500-5590 A 8500-5599 20 8500-5591 A 8500-5600 22 8500-5592 A 8500-5601 24 8500-5593 A 8500-5602 Joint de cloison Gaskets Taille de boîtier Shell size Joints pour embase à collerette carrée / Gaskets for square flange receptacle Joints pour embase à fixation par écrou / Gaskets for jam nut receptacle néoprène fairprène néoprène vitton 8 8500-275 8500-4164 3330102 3330675 10 8500-276 8500-4165 3330103 3330670 12 8500-277 8500-4166 3330104 3330671 14 8500-278 8500-4167 3330105 3330672 16 8500-283 8500-4168 3330106 3331048 18 8500-279 8500-4169 3330107 3331049 20 8500-280 8500-4170 3330108 3331050 22 8500-281 8500-4171 3330109 3331051 24 8500-282 8500-4172 3330110 3331052 Note : toutes les dimensions sont en mm / all dimensions are in mm 43 Notes / Notes 44 851 Type de bouchon Cap type Bouchons pour embase / Receptacle cap Bouchons pour fiche / Plug cap Cadmiage vert olive Olive green cadmium Cadmium incolore White cadmium Oxydation noir Blak anodised Nickelage Nickel Cadmiage vert olive Olive green cadmium Cadmium incolore White cadmium Oxydation noir Blak anodised Nickelage Nickel Bouchon avec chaînette métallique et oeillet de fixation Cap with chain and ring D 02 D 29 D 44 D D 02 D 29 D 44 D Bouchon avec cordonnet nylon et oeillet de fixation Cap with nylon cord and ring B 02 B 29 B 44 B B 02 B 29 B 44 B Bouchon avec cordonnet nylon et rondelle de fixation (boîtier 10, 12, 14, 16 & 18) Cap with nylon cord and washer (shell 10, 12 , 14, 16 & 18) - - - - E - - - Bouchon avec cordonnet nylon et rondelle de fixation Cap with nylon cord and washer H - - 44 H - - - - Bouchon avec chaînette métallique et rondelle de fixation Cap with chain and washer J - - - - - - - Bouchon 500 H brouillard salin Cap 500hr salt spray JQ7 - - - - - - - Bouchon sans cordonnet Cap without chain M - - - M - - - Bouchons / Caps Références / Ordering Information Racine / Basic series 8500 05 - - - Type de boîtier / Shell size Référence pour embase / Part numbers for receptacle Référence pour fiche / Part numbers for plug 8 02 10 10 03 11 12 04 12 14 05 13 16 27 28 18 06 14 20 07 15 22 08 16 24 09 17 Spécifications / Specifications pour type de bouchon & protection, voir tableau ci-dessous / for cap & plating, see table below Types et protections / Type and plating Bouchons pour fiches Caps for plugs Taille de boîtier Shell size Ø A max B max C+6 0 D+2 0 E Ø F 8 16.80 19.84 132 128 - - 10 19.80 19.84 132 128 132 14.00 12 23.90 19.84 148 140 148 17.60 14 27.00 19.84 148 140 148 20.80 16 30.20 19.84 148 140 148 25.60 18 33.40 19.84 148 140 148 28.70 20 36.50 21.44 168 153 - - 22 39.80 21.44 168 153 - - 24 42.90 22.22 168 153 - - « - » nous contacter / consult us D B & M E Note : toutes les dimensions sont en mm / all dimensions are in mm 45 851 Bouchons pour embases Caps for receptacles D J & JQ7 B & M H Taille de boîtier Shell size Ø A max B max C+6 0 D+2 0 J max H+2 0 K+6 0 8 19.00 21.44 84 77 14.80 80 84 10 21.80 21.44 84 77 17.90 80 84 12 26.10 21.44 100 89 22.70 90 100 14 29.30 21.44 100 89 25.90 90 100 16 32.50 21.44 100 89 29.00 90 100 18 35.30 21.44 100 89 32.20 90 100 20 38.80 21.44 116 102 35.40 110 116 22 42.00 21.44 116 102 38.60 110 116 24 45.10 22.22 116 102 41.70 110 116 Note : toutes les dimensions sont en mm / all dimensions are in mm 46 851 Références des raccords / Backshell ordering information Pour les types de protection voir références page 11 / For plating types see part numbers page 11 24 8500-5890 LP 8500-5890 110 8500-5890 202 8500-2477 900 8500-2477 902 8500-2477 903 8500-1567 LP 8500-474 8500-690 8500-456 LP - - 8500-4029 LP 8500-4029 110 - 8500-4053 900 - - 8500-8982 900 - 8500-8982 903 851 T 24-38 851 T 24-42 8500-5881 8500-5908 LP 22 8500-5889 LP 8500-5889 110 8500-5889 202 8500-2476 900 8500-2476 902 8500-2476 903 8500-1566 LP 8500-473 8500-689 8500-3186 LP - - 8500-4028 LP 8500-4028 110 - 8500-4052 900 - - 8500-8981 900 - 8500-8981 903 851 T 22-38 851 T 22-42 8500-5880 8500-5907 LP 20 8500-5888 LP 8500-5888 110 8500-5888 202 8500-2475 900 8500-2475 902 8500-2475 903 8500-1565 LP 8500-472 8500-688 8500-3185 LP - - 8500-4027 LP 8500-4027 110 - 8500-4051 900 - - 8500-8980 900 - 8500-8980 903 851 T 20-38 851 T 20-42 8500-5879 8500-5906 LP 18 8500-5887 LP 8500-5887 110 8500-5887 202 8500-2474 900 8500-2474 902 8500-2474 903 8500-1564 LP 8500-471 8500-687 8500-453 LP - - 8500-4026 LP 8500-4026 110 - 8500-4050 900 - - 8500-8979 900 - 8500-8979 903 851 T 18-38 851 T 18-42 8500-5878 8500-5905 LP 16 8500-5886 LP 8500-5886 110 8500-5886 202 8500-2473 900 8500-2473 902 8500-2473 903 8500-1563 LP 8500-470 8500-686 8500-452 LP - - 8500-4025 LP 8500-4025 110 - 8500-4049 900 - - 8501-0190 900 - 8501-0190 903 851 T 16-38 851 T 16-42 8500-5877 8500-5904 LP 14 8500-5885 LP 8500-5885 110 8500-5885 202 8500-2472 900 8500-2472 902 8500-2472 903 8500-1562 LP 8500-469 8500-685 8500-451 LP - - 8500-4024 LP 8500-4024 110 - 8500-4048 900 - - 8500-8978 900 - 8500-8978 903 851 T 14-38 851 T 14-42 8500-5876 8500-5903 LP 12 8500-5884 LP 8500-5884 110 8500-5884 202 8500-2471 900 8500-2471 902 8500-2471 903 8500-1561 LP 8500-468 8500-684 8500-450 LP - - 8500-4023 LP 8500-4023 110 - 8500-4047 900 - - 8501-0189 900 - 8501-0189 903 851 T 12-38 851 T 12-42 8500-5875 8500-5902 LP 10 8500-5883 LP 8500-5883 110 8500-5883 202 8500-2470 900 8500-2470 902 8500-2470 903 8500-1560 LP 8500-467 8500-683 8500-449 LP - - 8500-4022 LP 8500-4022 110 - 8500-4046 900 - - 8500-8977 900 - 8500-8977 903 851 T 10-38 851 T 10-42 8500-5874 8500-5901 LP 8 8500-5882 LP 8500-5882 110 8500-5882 202 8500-2469 900 8500-2469 902 8500-2469 903 8500-1559 LP 8500-466 8500-682 8500-448 LP - - 8500-4021 LP 8500-4021 110 - 8500-4045 900 - - 8501-0188 900 - 8501-0188 903 851 T 08-38 851 T 08-42 8500-5873 8500-5900 LP taille de boîtier shell size protection plating - 29 ou/or 031 44 - 29 ou/or 031 44 - - - 29 ou/or 031 44 - 29 ou/or 031 44 - 29 ou/or 031 44 - 29 ou/or 031 44 38 42 - E/R /RC écrou nut P/RP P RP A/RA T/RT M/RM G/RG T/RT specification 38 & 42 presseétoupe sealing gland écrou nut désignation designation raccord simple backnut raccord droit à serre-câbles straight cable clamp raccord droit pour potting straight backshell for potting raccord droit intermédiaire straight adaptor raccord droit pour gaine thermorétractable straight backshell for heatshrink sleeving raccord droit démontable pour gaine thermorétractable removable straight backshell for heatshrink sleeving raccord droit démontable pour reprise de tresse et gaine thermorétractable removable straight backshell for screen termination and heatshrink sleeving raccord droit démontable pour reprise de tresse et gaine thermorétractable removable straight backshell for screen termination and heatshrink sleeving J raccord droit à presse-étoupe straight sealing gland backshell EC AC Raccords droits / Straight backshells Potting 47 851 Références des raccords / Backshell ordering information Pour les types de protection voir références page 11 / For plating types see part numbers page 11 Raccords droits / Straight backshells 24 8500-5881 8500-5997 900 - - - 8500-8191A LP - - 22 8500-5880 8500-5996 900 - - - 8500-8190 LP - - 20 8500-5879 8500-5995 900 - - - 8500-8189 LP - - 18 8500-5878 8500-5994 900 - - - 8500-8188 LP - - 16 8500-5877 8500-5993 900 8500-8476 900 - - 8500-8187 LP - - 14 8500-5876 8500-5992 900 8500-8475 900 - - 8500-8186 LP - - 12 8500-5875 8500-5991 900 8500-8474 900 - - 8500-8185 LP - - 10 8500-5874 8500-5990 900 - - - - - - 8 8500-5873 8500-5989 900 - - - - - - taille de boîtier shell size protection plating - 29 ou/or 031 44 - 29 ou/or 031 44 presseétoupe sealing gland écrou nut U/RU Z/RZ désignation designation JC raccord droit court pour reprise de tresse et gaine thermorétractable short backshell for screen termination and heatshrink sleeving raccord pour adaptation d’accessoire au pas électrique straight adaptor for electrical pitch access raccord droit à presse-étoupe et serrecâbles straight sealing gland and cable clamp backshell Raccords droits pour embase 07 / Straight backshells for receptacle 07 8500-381 LP 8500-381 110 8500-381 202 8500-1797 900 - - 8500-474 8500-690 8500-4784 LP 8500-4784 110 - 8500-380 LP 8500-380 110 8500-380 202 8500-1796 900 - - 8500-473 8500-689 8500-4783 LP 8500-4783 110 - 8500-379 LP 8500-379 110 8500-379 202 8500-1795 900 - - 8500-472 8500-688 8500-4782 LP 8500-4782 110 - 8500-378 LP 8500-378 110 8500-378 202 8500-1794 900 - - 8500-471 8500-687 8500-4781 LP 8500-4781 110 - 8500-377 LP 8500-377 110 8500-377 202 8500-1793 900 - - 8500-470 8500-686 8500-4780 LP 8500-4780 110 - 8500-376 LP 8500-376 110 8500-376 202 8500-1792 900 - - 8500-469 8500-685 8500-4779 LP 8500-4779 110 - 8500-375 LP 8500-375 110 8500-375 202 8500-1791 900 - - 8500-468 8500-684 8500-4778 LP 8500-4778 110 - 8500-374 LP 8500-374 110 8500-374 202 8500-1790 900 - - 8500-467 8500-683 8500-4777 LP 8500-4777 110 - 8500-8347 LP 8500-8347 110 8500-8347 202 8500-8351 900 - - 8500-466 8500-682 8500-4776 LP 8500-4776 110 - - 29 ou/or 031 44 - 29 ou/or 031 44 - 29 ou/or 031 44 E/R /RC P RP T/RT raccord simple backnut raccord droit à serre-câbles straight cable clamp raccord droit pour potting straight backshell for potting raccord droit pour gaine thermorétractable straight backshell for heatshrink sleeving EC AC Raccords coudés / Elbow backshells 8500-799 900 8500-799 902 - 8500-3225 900 8500-3225 902 - 8500-3224 900 8500-3224 902 - 8500-796 900 8500-796 902 - 8500-795 900 8500-795 902 - 8500-794 900 8500-794 902 - 8500-793 900 8500-793 902 - 8500-792 900 8500-792 902 - 8500-791 900 8500-791 902 - - 29 ou/or 031 44 EC/RC raccord coudé à serre-câbles elbow cable clamp backshell 48 851 Outillages / Tools Outillage de sertissage Crimping pliers Tailles de contacts Contact sizes Section de câbles / Wire sizes Références / Part numbers mm² AWG pince à sertir / crimping tool positionneur / locator 20 0.93 0.60 0.38 0.21 18 20 22 24 8476-01 (M 22520/2-01) 8365 (M 22520/1-01) 8476-02 (M 22520/2-02) 8365-02 (M 22520/1-02) 16 1.91 1.34 0.93 14 16 18 8365 (M 22520/1-01) 8365-02 (M 22520/1-02) ] ] Outillage d’insertion et d’extraction Insertion and extraction tools Type de contacts Contact types Tailles de contacts Contact sizes Références / Part numbers outil d’insertion / insertion tools outil d’extraction / extraction tools à sertir crimp 20 8500-29B* 8500-36A 16 8500-39 8500-38A pour connexion enroulée for wire-wrap 20 8500-31 8500-31 16 8500-39 ou/or 8500-37 8500-37 Tube de rechange pour outil / Square tube for tool : • 8500-36A : ref. 8500-1163 • 8500-38A : ref. 8500-1486 021 * Sauf arrangements 8-2, 8-3, 8-4, 12-14 : outil 8500-93B * Except 8-2, 8-3, 8-4, 12-14 contact layouts : insertion tool 8500-93B Obturateurs Filler plugs Tailles de contacts Contact sizes Références / part numbers Couleur / Colour Profil / Profile 20 8500-4144 gris / grey 16 8500-479 bleu / blue 20 8500-4144 A (MS 3187 A 20) rouge / red 16 8500-4267 (MS 3187-16) bleu / blue 49 851 Outils de sertissage Crimping pliers 8476-01 (M 22520/2-01) avec / with 8476-02 (M 22520/2-02) 8365 (M 22520/1-01) avec / with 8365-02 (M 22520/1-02) Outils de d’insertion Insertion tools 8500-39 8500-29B 50 851 Outils d’extraction Extraction tools 8500-36 A (Contact à sertir #20 / Crimp contact #20) 8500-38 A (Contact à sertir #16 / Crimp contact #16) 8500-31 (pour connexion enroulée #20 / for wire-wrap #20) 8500-37 (pour connexion enroulée #16 / for wire-wrap #16) Accessoires Accessories 8498-04 Clé à sangle pour serrage des accessoires arrière Strap backshell tightening spanner 8500-30 Support de serrage Tightening support 51 851 Notice de câblage / Wiring instructions Préparation des câbles / cable preparation Contacts à sertir Crimp contacts Dénudage Stripping • Apporter le plus grand soin à cette opération. Utiliser une pince à dénuder appropriée à la section du câble et en parfait état. • Afin de conserver toutes les caractéristiques d’étanchéité du connecteur et permettre un câblage rationnel, les fils doivent avoir les dimensions ci-dessous : • Taux de remplissage conseillé : - 050 % Ø maxi - 050 % Ø mini - 100 % Ø moyen • Contacts de taille 20 pour les câbles de : - Ø sur gaine ≤ à 2 mm, dénuder sur une longueur de 4,5 mm - Ø sur gaine > à 2 mm, dénuder sur une longueur de 7 mm. • Contacts de taille 16, dénuder le câble sur 6 mm. Raccordement câblescontacts • Enfiler le câble dans le fût du contact et s’assurer que les brins du câble sont apparents dans le trou de visite. Utilisation de l’embout réducteur • Contacts de taille 20, si le câble a une section inférieure à 0,21 mm2, il est indispensable d’intercaler un embout réducteur : réf. 8500-781. • Contacts de taille 16, embout réducteur : réf. 8500-1985, si le câble a une section égale à 0,60 mm2. contact / contact embout / sleeve câble / cable • This operation should be carried out with great care. Use stripping pliers which are in good condition and which are designed for use with the size of wire being stripped. • In order to maintain the connector’s excellent sealing characteristics and, at the same time, meet the highest cabling standards the wires should have the following external sheath dimensions : • Recommended loading : - 050 % with max. diam. wires - 050 % with min. diam. wires - 100 % with medium size wires. • Size 20 contacts for cables : - when Ø over insulation ≤ 2 mm strip to a 4.5 mm length - when Ø over insulation > 2 mm strip to a 7‑mm length. • Size 16 contacts, strip the cable to a length of 6 mm. Cable-contact assembly • Insert the wire into the crimp barrel and ensure that it has penetrated correctly by checking that it may be seen through the lateral hole in the barrel. Reducing sleeve • If a wire with a cross sectional area of less than 0.21 mm2 is used with a size 20 contact, it will be necessary to use a reducing sleeve : ref. 8500-781. • Wires of cross sectional area of 0.6 mm2 may be used with size 16 contacts by using a reducing sleeve, ref. 8500-1985. Taille des contacts Ø sur gaine min. max. 20 16 1.20 1.60 2.11 2.80 Contacts size Ø over sheath min. max. 20 16 1.20 1.60 2.11 2.80 52 851 Sertissage des contacts / Contact crimping • Avec pince à sertir MS 22520/1-01 référence Souriau 8365 et tourelle MS 22520/1-02 8365-02: - position «rouge» pour contact taille 20 - position «bleue» pour contact taille 16. • Avec pince à sertir MS 22520/2-01 référence Souriau 8476-01 et positionneur MS 22520/2-02 8476- 02 : - contact taille 20 uniquement. Nota : ne pas utiliser avec embout réducteur. Les pinces doivent être utilisées côté poinçons. • Presser sur les poignées de la pince jusqu’au déclic final, relâcher ; la pince doit s’ouvrir d’elle-même. • Introduire l’ensemble fil et contact, ou fil embout réducteur et contact entre les 4 poinçons jusqu’à venir en butée dans le positionneur. • Presser à fond jusqu’au déclic final, la pince doit s’ouvrir une fois le sertissage effectué. • Extraire fil et contact serti et contrôler l’aspect du sertissage. • With crimping pliers MS 22520/1-01 Souriau part number 8365 and turret MS 22520/1-02 8365-02 : - «red» position for size 20 contacts - «blue» position for size 16 contacts. • With crimping pliers MS 22520/2-01 Souriau part number 8476-01 and locator MS 22520/2-02 8476-02 : - for size 20 contacts only. Note : not be used with reducing sleeve. Squeeze pliers firmly until a click is heard, the pliers should spring open when the ratched mechanism is released. • Hold indentor side up-insert the wire-contact assembly or mire-reducing sleeve-contact assembly between the four indentors, ensuring that the contact bottoms in the locator. • Fully close the jaws, once the contact is crimped the pliers must spring open remove wire + crimped contact, check crimp aspect. 8365 8476-01 53 851 Insertion des contacts / Crimp contact insertion Avant les opérations suivantes, démonter et enfiler sur les câbles l’accessoire arrière du connecteur. Outils d’insertion • Contacts taille 20* : pince 8500-29B • Contacts taille 16 : outil 8500-39. Utilisation des outils d’insertion Engager manuellement le contact dans l’alvéole de l’isolant. • Contacts de taille 20 : prendre le fil entre les 2 becs de la pince en butée sur l’arrière de la jupe du contact. • Contacts de taille 16 : mettre la partie sertie du contact dans le bec de l’outil, l’extrémité de celui-ci venant en butée sur la collerette principale du contact. Introduire chaque contact dans le logement de l’isolant en poussant dans l’axe jusqu’à l’accrochage du contact dans le clip. Obturateurs Lorsque certains contacts ne sont pas câblés, afin de conserver les caractéristiques d’étanchéité, il est indispensable de prévoir un obturateur à l’arrière du contact : le contact doit être monté dans son alvéole avant l’obturateur. * Sauf arrangements 8-2, 8-3, 8-4, 12-14 : outil 8500-93B First disassemble and slide connector rear accessory over cables. Insertion tools • Size 20 contacts* : pliers 8500-29B • Size 16 contacts : tool 8500-39. Use of insertion tools Manually insert the contact into the desired insert cavity. • Size 20 contacts : insert the wire between the pliers jaws, the tip of the jaws butting the contact shoulder. • Size 16 contacts : introduce the contact crimped section in the tool jaws, the tip of the tool butting against the contact main flange. Introduce contacts one by one in insert cavities pushing straight in until the contact snaps into position and the clip ensures contact retention. Filler plugs Where certain contacts are unwired and where it is necessary to fully maintain the connector’s sealing characteristics, a filler plug must be used. Note that the contact must be inserted before the filler plug. * Except 8-2, 8-3, 8-4, 12-14 contact layouts : tool 8500-93B contact / contact fil / wire outil / tool Mise en place du contact dans l’outil Contact position in the tool sens du montage direction of filler plug insertion 54 851 Extraction des contacts à sertir / Crimp contact extraction Outils d’extraction Tous les contacts pour isolants à clips sont démontables à l’aide d’un outil semi-automatique : • contacts taille 20 : outil référence 8500-36A • contacts taille 16 : outil référence 8500-38A. Avant les opérations suivantes, démonter et faire glisser sur les câbles l’accessoire arrière du conducteur. • Ne pas agir sur le poussoir de l’outil. • Introduire par l’avant du connecteur (côté accouplement) le tube de l’outil sur le contact mâle ou femelle jusqu’au 1er repère pour les contacts mâles et au 2ème repère pour les contacts femelles. • Cette opération doit être effectuée délicatement, dans l’axe du contact à l’aide d’un léger mouvement rotatif. • Extraire le contact en actionnant le poussoir, retirer l’outil avec précaution et tirer sur le fil pour dégager l’ensemble fil-contact. Nota : les outils possèdent un système à ressort réglable (par le bouton moleté arrière), permettant ainsi le décrochage automatique du contact. Extraction tools All contacts for use in insulators with clips are extracted using a semi-automatic tool : • size 20 contacts : tool type 8500-36A • size 16 contacts : tool type 8500-38A. First dissassemble and slide connector rear accessory over cables. • Do not operate the tool slide button. • Bring the tool tip over the male or female contact to be removed from connector front (mating face) as far as the first mark for male contacts and the second mark for female contacts. • This operation, should be carried out delicately in a direction parallel to the contact centre line with a light turning action. • Extract contact pushing the slide button fully forward, carefully remove tool and pull wire to release the wire-contact assembly. Note : tools have an adjustable spring system (rear knurled knob) also for automatic contact disengagement. 1er repère first mark 2ème repère second mark 55 851 Schémas d’implantations pour circuits imprimés / Co-ordinates for PC tail contacts Isolant mâle, vue face arrière (côté soudure) Terminations viewed from male rear face (soldering side) Ø trous de perçage 0,90 mm min. (# 20) + trous de perçage 1,3 mm min. (# 16) tolérance de positionnement des trous sur carte Hole size : 0.90 mm min. (# 20) + Hole sizes : 1.3 mm min. (# 16) hole position tolerance. O Ø 0.10 14-5 12-3 12-8 12-10 14-12 14-15 14-18 10-6 10-7 10-98 12-2 8-2 8-4 8-3 8-3A/8-98 8-33 12-14 56 851 16-8 16-23 16-26 18-11 14-19 18-30 18-32 57 851 20-16 20-24 20-25 20-27 20-39 20-41 58 851 22-21 22-32 22-34 22-36 22-55 59 851 24-61 60 851 Prise largable push-pull / Push-pull locking plug Caractéristiques générales • Verrouillage : en poussant sur la bague • Déverrouillage : par traction sur la tirette de largage • Montage : sur toutes les embases 851 • Arrangements et contacts à sertir et à souder : (voir pages 10 et 14/15) • Autres caractéristiques : (voir page 9) Racine / Basic series version à sertir - crimp version 856 version à souder - solder version 856 06 06 R E • • • • • • • • P P • • 50 50 • • • • Type de boîtier / Shell type 06 08 Type de raccord / Backshell type R/E RC/EC RA/A RP/P RT/T RM/M *RT/*T RC/EC Taille de boîtier / Shell size 8 - 10 - 12 - 14 - 16 - 18 - 20 - 22 - 24 Arrangements / Contact layouts Voir tableau des arrangements page 14/15 - See table page 14/15 Type de contact/ Contact type P = mâle / male - S = femelle / female Positionnement / Orientation Normal (n’apparaît pas dans la référence) w, x, y, z - voir tableau page 16 Normal (not included in part number) w, x, y, z - see table page 16 Indice obligatoire / Obligatory suffix Spécification / Specification 07 08 09 General characteristics • Locking : by pushing on the coupling nut • Unlocking : by pulling a lanyard • Mounted : on all 851 receptacles • Layouts and crimp solder contacts : (see pages 10 and 14/15) • Other characteristics : (see page 9) Références / Ordering information fiche droite - plug for use with straight backshell fiche coudée - plug for use with 90° backshell raccord simple / backnut raccord droit à serre-câbles / straight cable clamp raccord droit intermédiaire / straight adaptor raccord droit pour potting / straight backshell for potting raccord droit pour gaine thermorétractable / straight backshell for heatshrink sleeving raccord droit démontable pour gaine thermorétractable straight removable backshell for heatshrink sleeving spécification 38 ou/or 42: raccord droit démontable pour reprise de tresse et gaine thermorétractable / straight removable backshell for screen termination and heatshrink sleeving raccord coudé à serre-câbles / 90° cable clamp protection cadmié vert olive (version à souder) olive-green cadmium plating (solder version) protection cadmié vert olive (version à sertir) olive green cadmium plating (crimp version) protection cadmié blanc (version à sertir et à souder) white cadmium plating (crimp and solder version) 61 851 Taille de boîtier Shell size Dimensions 8 10 12 14 16 18 20 22 24 A 19.50 22.80 27.30 30.80 34.00 37.00 41.00 44.50 49.20 B 24.95 28.25 32.55 36.05 39.05 42.05 45.80 49.20 53.45 06 R E 32.00 32.00 32.00 32.00 32.00 32.00 31.80 31.80 31.80 06 RC E 47.30 47.30 47.30 47.30 50.50 50.50 49.90 49.90 49.90 06 RP E 42.10 42.10 42.10 42.10 42.10 45.40 49.80 49.80 49.80 06 RA E 41.00 41.00 41.00 41.00 41.00 41.00 43.00 43.00 43.20 06 RM E 50.00 50.00 50.00 50.00 50.00 50.00 51.70 51.70 51.70 06 RT spécifications 38 ou/or 42 E 50.00 50.00 50.00 50.00 50.00 50.00 51.70 51.70 51.70 08RC E 50.10 52.60 54.90 58.50 60.80 65.00 68.80 71.20 76.20 D max 16.00 18.00 19.50 22.00 23.50 25.00 26.50 28.00 31.00 Nota : Encombrements des raccords, se reporter aux dimensions des pages précédentes Note : For backshells dimensioning, refer to values given in preceding pages Note : toutes les dimensions sont en mm / all dimensions are in mm 62 851 Connecteurs filtres 8F51 / 8F51 filter connectors Généralités Ces connecteurs sont dérivés des spécifications standards MIL-DTL-26482 G série 1 - NFC 93422 (HE 301 B) - VG 95328. Ils sont interchangeables en fixation et intermariables avec les connecteurs standards. Différents types de filtres peuvent équiper ces connecteurs et permettent ainsi de supprimer les interférences RFI/EMI dans différentes gammes de fréquences. L’utilisation de ces connecteurs à filtres performants incorporés offre les avantages suivants : • Filtrage efficace des parasites à l’entrée ou à la sortie d’un équipement électronique, • Ecran de blindage du coffret conservé, • Encombrement et coût plus réduit par rapport à l’utilisation de filtres individuels câblés à l’arrière du connecteur, • Choix de 4 types de contacts standards - merci de nous consulter pour tout autre valeur de capacitance et type de filtre, • Possibilité de mixage de filtres dans le même arrangement : contacts filtrés, non filtrés et liés à la masse. La version adaptateur, également disponible, permet d’équiper simplement les systèmes existants non filtrés. Caractéristiques électriques • Intensité max. par contact 7.5 A (#20); 13 A (#16) • Tension max. de service 200 Vdc / 120 Vac • Types de filtre standard C, Pi • Valeur de capacitance typ. de 500 pF à 200 nF • Performance filtre Jusqu’à -60dB / -80dB Consulter pour ce produit notre département CONNECTEURS FILTRES. General information These connectors are derived from standard specifications MIL-DTL-26482 G series 1 - NFC 93422 (HE 301 B) - VG 95328. They are intermountable and intermateable with standard connectors. Different types of filters may be fitted in these connectors to eliminate RFI/EMI in different frequency ranges. Using built-in High Performance EMI filters offers the following advantages : • Efficient filtering on interferences at electronic equipment input or output, • Case screen-shielding efficiency is maintained, • Cost and volume saving as compared with the use of discrete filters wired down the line, • 4 types of standard filters are available - Please consult us for other capacitance and filter types, • Combinations of mixed filter in the same layout: filtered, non-filtered and grounded contacts available. An adaptor version is also a simple technique to equip existing systems which do not incorporate filters. Electrical characteristics • Max. current rating per contact 7.5 A (#20); 13 A (#16) • Max. operating voltage 200 Vdc / 120 Vac • Standard filter types C, Pi • Capacitance range typically 500 pF - 200 nF • Filter performance up to -60dB / -80dB For this product, consult our FILTER CONNECTOR department. 63 851 Connecteurs spécifiques et accessoires de connexion SNC SNC specific connectors and connection accessories Désignations Designations Références Part numbers • Traversée de cloison à collerette carrée, broches, douilles Boîtiers 8 à 24 : arrangements 8.03 / 10.06 / 12.10 / 14.19 / 16.26 / 18.32 / 20.41 / 22.55 / 24.61 Positionnements : N & W Protections : 085 cadmiage vert / 112 oxydation anodique noire brillante • Square flange through bulkhead, pins, sockets Shell sizes 8 to 24 : layouts 8.03 / 10.06 / 12.10 / 14.19 / 16.26 / 18.32 / 20.41 / 22.55 / 24.61 Insert rotations : N & W Plating : 085 green cadmium / 112 black anodized EC 52 B • Raccord coudé à serre-câbles à encombrement réduit, pour fiche 08RC Boîtiers 12, 14, 16, 18 et 22 • Short profile 90° backshell with cable clamp for 08 RC plug Shell sizes 12, 14, 16, 18 and 22 SN 556 • Connecteur fiche et embase Boîtier 24 équipé de 3 contacts # 16 - 7 contacts # 20 - 1 contact coaxial 50 Ω (pour câble KX 15) • Plug and receptacle connector Shell size 24 : contact layout = 3 contacts # 16, 7 contacts # 20, 1 coaxial contact 50 Ω (for KX15 cable) SN 775 P SN 775 S • Fiche shunt • Shunt plug SN 901 • Raccord droit en deux parties avec presse-étoupe et brides de serrage Boîtiers 8, 10 et 16 • Straight two-piece backshell with sealing gland and cable strap Shell sizes 8, 10 and 16 SN 946 • Fiche équipée d’une bague de verrouillage à oreilles Boîtiers 20, 22 et 24 • Plug with flanged coupling nut Shell sizes 20, 22 and 24 SN 1167 • Prolongateur de test, broches, douilles Boîtiers 8 à 24, arrangements avec contacts de # 20 • Cable connecting test connector, pins, sockets Shell sizes 8 to 24, arrangements with size contacts # 20 SN 1206 • Bague à oreilles avec vis pointeau adaptable sur fiche 851 Boîtiers 8 à 24 • Ring with lugs with cone-pointed grub screws fitting 851 plug Shell sizes 8 to 24 SN 1277 • Raccord coudé fermé avec cheminée pour reprise de tresse par magnétostriction Boîtiers 8 à 24 • Elbow backshell with closing sleeve for shield termination by magnaforming Shell sizes 8 to 24 SN 1533 • Embase type 07A à picots droits, démontage par l’avant Arrangements : 14.19 (N) / 16.26 (N) / 18.32 (N, X) / 20.41 (N, W, X, Y) / 22.55 (N, W, X, Y, Z) / 24.61 (N) Protection : cadmiage passivé vert • Jam nut receptacle with front release straight PC tails Layouts : 14.19 (N) / 16.26 (N) / 18.32 (N, X) / 20.41 (N, W, X, Y) / 22.55 (N, W, X, Y, Z) / 24.61 (N) Plating : passivated green cadmium SN 0378 Autres arrangements, nous consulter / Other layouts, please consult us 64 Notes / Notes 65 851 RJ45 Présentation / Presentation Le connecteur SOURIAU 851 RJ45 est une solution renforcée pour les applications de téléchargement / chargement de données en environnements sévères. Disponible en taille 18, ce connecteur existe en divers types de boîtiers et avec différentes terminaisons: Fiche avec cordon RJ45, traversée de cloison ou à souder pour les embases à collerette carrée et à fixation par écrou. Les principaux avantages de ce produit : • Une solution Ethernet cat5e - 10 Base T, 100 Base TX, ou 1000 Base T • Excellente résistance aux impacts & aux chocs - Boîtier renforcé • Connexion facile, fiable & sécurisée • Idéal pour les applications intérieures / extérieures - niveau d’étanchéité IP67 SOURIAU 851 RJ45 connector is a ruggedized solution for downloading / uploading data applications in harsh environments. Available in shell size 18, this connector offers multiple configurations and terminations: Cable pig tail for plug, feed through and solder out for both square flange and jam nut receptacle. Main advantages of this product : • A cat5e Ethernet solution - 10 Base T, 100 Base TX, or 1000 Base T capable • High impact & shock resistance - Ruggedized housing • Easy, reliable & secure mating • Suitable for Indoor / Outdoor applications - IP67 sealing level 66 851 RJ45 Mécaniques Matières • Boîtier Alliage d’aluminium • Insert Thermoplastique • Contacts Alliage cuivre Protection • Boîtier Cadmié vert olive Oxydation anodique noire Nickelé • Contacts Or Mécanique • Selon MIL-DTL-26482, 500 manoeuvres Mechanical Material • Shell Aluminium alloy • Insert Thermoplastic • Contacts Copper alloy Plating • Shell Olive drab cadmium Black anodized Nickel • Contacts Gold Mechanical • per MIL-DTL-26482, 500 mating cycles Electriques 10 BaseT, 100 Base TX et 1000 BaseT Cat 5e selon TIA/EIA 568A/B Electrical 10 BaseT, 100 Base TX and 1000 BaseT Cat 5e per TIA/EIA 568A/B Climatiques • Etanchéité IP67 avec un bouchon • Température -40°C à +85°C • Résistance aux fluides : selon MIL-DTL-26482 avec un bouchon Climatic • Sealing IP67 with protective cap • Temperature -40°C to +85°C • Fluid resistance : per MIL-DTL-26482 with protective cap Caractéristiques techniques / Technical characteristics Références / Ordering information Racine / Basic series 851 Ruggedized Receptacle connectors 00 00 8 J C S N OD - - - Type de boîtier / Shell type 00 01 07 06 Type de raccord / Backshell type 00 RC RT Taille de boîtier / Shell size 8 Insert / Insert J Arrangements / Layouts F S CP Style de contact / Contact style SP Orientation / Polarization N Normal W, X, Y, Z autre orientations / other polarizations Protection / Plating OD 031 44 Spécification / Specification Nous consulter pour une configuration personnalisée / Consult factory for custom configuration Embase à collerette carrée (acceptant un raccord) Square flange receptacle (accepting backshell) Prolongateur / Cable connecting receptacle Embase à fixation par écrou / Jam nut receptacle Fiche (acceptant un raccord) / Plug (accepting backshell) Pas de raccord / no backshell Serre câbles droit / Straight cable clamp Raccord droit pour gaine thermorétractable / Straight backshell for heat shrink tubing RJ45 (size 18) RJ45 Traversée de cloison / Feedthrough A souder / Solder Embase avec cordon RJ45 / Pig tail receptacle Fiche avec cordon RJ45 / Pig tail plug Embase / Receptacle Fiche / Plug Protection vert olive cadmiée / Olive drab cadmium Oxydation anodique noire / Black anodized Nickelé / Nicke 67 851 RJ45 Embase RJ45 à collerette carrée à souder Square flange RJ45 feedthrough solder out Shell type ‘A’ ‘B’ Aluminium 22.98 1.32 Encombrements / Dimensions Embase RJ45 à collerette carrée Square flange RJ45 feedthrough Shell type ‘A’ ‘B’ Aluminium 30.91 1.32 Embase RJ45 à fixation par écrou Jam nut RJ45 feedthrough Shell type ‘A’ ‘B’ Aluminium 23.39 2.64 PIN I □ 27.0 44.1 ‘A’ ‘B’ PIN I □ 32.3 PIN I 44.1 ‘A’ ‘B’ PIN I ø 44.2 PIN I □ 27.0 10.7 ‘A’ ‘B’ 30.8 ø 1.4 □ 32.3 Note : toutes les dimensions sont en mm / all dimensions are in mm Fiche avec cordon RJ45 Cable plug RJ45 Shell type ‘A’ Aluminium 304.8 PIN I 76.0±6 ‘A’ 52.4 PIN I 25.4±6.3 Master key Livrée en standard avec un câble de dimension ‘A’ / Come with a cable - dimension ‘A’ - in standard. 68 851 RJ45 Embase à collerette carrée avec cordon RJ45 Square flange RJ45 feedthrough Pig tail Embase à fixation par écrou avec cordon RJ45 Jam nut RJ45 feedthrough Pig tail Shell type ‘A’ ‘B’ ‘C’ Aluminium 30.91 1.32 304.8±25.4 Shell type ‘A’ ‘B’ ‘C’ Aluminium 23.39 2.64 304.8±25.4 PIN I 25.4 ‘A’ ‘B’ End ‘B’ PIN I ‘C’* 25.4 End ‘A’ PIN I 25.4 ‘A’ ‘B’ End ‘B’ PIN I ‘C’* 25.4 End ‘A’ Note : toutes les dimensions sont en mm / all dimensions are in mm * Longueur du câble mesurée à partir de l’avant de la collerette / Cable length is measured from the front face of the flange. Embase RJ45 à fixation par écrou à souder Jam nut RJ45 feedthrough solder out Shell type ‘A’ ‘B’ Aluminium 15.27 2.64 PIN I 10.7 ‘A’ ‘B’ 24.6 ø 44.2 ø 1.4 Livrée en standard avec un câble de dimension ‘C’ Come with a cable - dimension ‘C’ - in standard. Livrée en standard avec un câble de dimension ‘C’ Come with a cable - dimension ‘C’ - in standard. Perçage de cloison Panel cut-out Embase à collerette carrée Square flange receptacle Embase à fixation par écrou Jam nut receptacle Epaisseur maximum du panneau : 4.75 mm Maximum panel thickness : 4.75 mm Epaisseur maximum du panneau : 0.41mm min / 3.18 mm max Maximum panel thickness : 0.41 mm min / 3.18 mm max ø 30.5 □ 27.9 4 x 2.5 Rear mounting ø 32.1 30.55 69 851 USB Présentation / Presentation Le connecteur SOURIAU 851 USB est une solution renforcée pour les applications de téléchargement / chargement de données en environnements sévères. Disponible en taille 16, ce connecteur existe en divers types de boîtiers et avec différentes terminaisons: Fiche avec cordon USB, traversée de cloison ou à souder pour les embases à collerette carrée et à fixation par écrou. Les principaux avantages de ce produit : • Excellente résistance aux impacts & aux chocs - Boîtier renforcé • Connexion facile, fiable & sécurisée • Idéal pour les applications intérieures / extérieures - niveau d’étanchéité IP67 SOURIAU 851 USB connector is a ruggedized solution for downloading / uploading data applications in harsh environments. Available in shell size 16, this connector offers multiple configurations and terminations: Cable pig tail for plug, feed through and solder out for both square flange and jam nut receptacle. Main advantages of this product : • High impact & shock resistance - Ruggedized housing • Easy, reliable & secure mating • Suitable for Indoor / Outdoor applications - IP67 sealing level 70 851 USB Mécaniques Matières • Boîtier Alliage d’aluminium • Insert Thermoplastique • Contacts Alliage cuivre Protection • Boîtier Cadmié vert olive Oxydation anodique noire Nickelé • Contacts Or Mécanique • Selon MIL-C-26484, 500 manoeuvres Mechanical Material • Shell Aluminium alloy • Insert Thermoplastic • Contacts Copper alloy Plating • Shell Olive drab cadmium Black anodized Nickel • Contacts Gold Mechanical • per MIL-C-26484, 500 mating cycles Electriques 10 BaseT, 100 Base TX Cat 5e selon TIA/EIA 568A/B Electrical 10 BaseT, 100 Base TX Cat 5e per TIA/EIA 568A/B Climatiques • Etanchéité IP67 avec bouchon • Température de -40°C à +85°C • Résistance aux fluides : selon MIL-C-26484 avec bouchon Climatic • Sealing IP67 with protective cap • Temperature range : -40°C to +85°C • Fluid resistance : per MIL-C-26484 with protective cap Caractéristiques techniques / Technical characteristics Références / Ordering information Racine / Basic series 851 Ruggedized Receptacle connectors 00 00 6 A C S N OD - - - Type de boîtier / Shell type 00 01 07 06 Type de raccord / Backshell type 00 RC RT Taille de boîtier / Shell size 6 Insert / Insert A B Arrangements / Layouts F S CP Style de contact / Contacts style SP Orientation / Polarization N Normal W, X, Y, Z autres orientations / other polarizations Protection / Plating OD 031 44 Spécification / Specification Nous consulter pour une configuration personnalisée / Consult factory for custom configuration Embase à collerette carrée (acceptant un raccord) Square flange receptacle (accepting backshell) Prolongateur / Cable connecting receptacle Embase à fixation par écrou / Jam nut receptacle Fiche (acceptant un raccord) / Plug (accepting backshell) Pas de raccord / no backshell Serre câbles droit / Straight cable clamp Raccord droit pour gaine thermorétractable / Straight backshell for heat shrink tubing USB (size 16) USB Type A USB Type B Traversée de cloison / Feedthrough A souder / Solder Embase avec cordon USB / Pig tail receptacle Fiche avec cordon USB / Pig tail plug Embase / Receptacle Fiche / Plug Protection vert olive cadmiée / Olive drab cadmium Oxydation anodique noire / Black anodized Nickelé / Nickel 71 851 USB Embase USB à collerette carrée à souder Square flange USB feedthrough solder out Shell type ‘A’ ‘B’ Aluminium 15.16 1.32 Encombrements / Dimensions Embase USB à collerette carrée Square flange USB feedthrough Shell type ‘A’ ‘B’ Aluminium 24.82 1.32 Embase USB à fixation par écrou Jam nut USB feedthrough Shell type ‘A’ ‘B’ Aluminium 17.30 2.64 PIN I □ 24.6 37.8 ‘A’ ‘B’ □ 30.9 PIN I PIN I 37.8 ‘A’ ‘B’ ø 41.0 PIN I PIN I □ 30.9 10.7 ‘A’ ‘B’ 24.5 ø 1.6 □ 24.6 Note : toutes les dimensions sont en mm / all dimensions are in mm Fiche avec cordon USB USB cable plug Shell type ‘A’ Aluminium 304.8 PIN I 12.7±6.35 ‘A’ 38.2 50.8 Master key La fiche USB standard est livrée avec un câble de dimesion ‘A’. Standard USB plug come with a cable - dimension ‘A’. 65.5 USB-A plug USB-A receptacle 72 851 USB Embase USB à fixation par écrou à souder Jam nut USB feedthrough solder out Shell type ‘A’ ‘B’ Aluminium 7.65 2.64 PIN I ø 41.0 ‘A’ ‘B’ 18.3 10.7 Embase à collerette carrée avec cordon USB Square flange USB feedthrough Pig tail Embase à fixation par écrou avec cordon USB Jam nut USB feedthrough Pig tail Shell type ‘A’ ‘B’ ‘C’ Aluminium 24.82 1.32 304.8±25.4 Shell type ‘A’ ‘B’ ‘C’ Aluminium 17.30 2.64 304.8±25.4 PIN I 25.4 ‘A’ ‘B’ PIN I ‘C’* 25.4 □ 30.9 □ 24.6 PIN I 25.4 ‘A’ ‘B’ PIN I ‘C’* 25.4 ø 41.0 Note : toutes les dimensions sont en mm / all dimensions are in mm *Longueur du câble mesurée à partir de l’avant de la collerette / Cable length is measured from the front face of the flange. Perçage de cloison Panel cut-out Embase à collerette carrée Square flange receptacle Embase à fixation par écrou Jam nut receptacle Epaisseur maximum du panneau / Maximum panel thickness : - Montage par l’avant / Front mounting: 3.20 mm - Montage par l’arrière / Rear mounting : 2.49 mm Epaisseur maximum du panneau : 3.20 mm Maximum panel thickness : 2.49 mm ø 28.45 ø 4 x 3.15 □ 24.6 Panel mounting ø 32.1 □ 30.4 Livrée en standard avec un câble de dimension ‘C’ Come with a cable - dimension ‘C’ - in standard. Livrée en standard avec un câble de dimension ‘C’ Come with a cable - dimension ‘C’ - in standard. 73 8XE Présentation / Presentation SOURIAU overmolded 851 connector utilises high impact glass filled plastic offering a great impact & shock resistance as well as an ergonomic shape of the coupling ring. Suitable backshell in same plastic material allows IP68 sealing level. • High impact & shock resistance (drop & crush resistance • Easy, reliable & secure mating • Excellent sealing performance : IP68 (120 hours under 15 m water ) /IP69K • High salt spray resistance • Enhanced cable sealing • Intermateable & interchangeable with MIL-DTL-26482 • Design flexibility Le connecteur 851 surmoulé SOURIAU est en plastique, chargé verre, haute performance offrant une excellente résistance aux impacts & chocs ainsi qu’une forme ergonomique de la bague de verrouillage. Le raccord, utilisant la même matière plastique permet d’obtenir un niveau d’étanchéité IP68. • Excellente résistance aux impacts & aux chocs (aux chutes & à l’écrasement) • Connexion facile, fiable & sécurisée • Excellentes performances d’étanchéité IP68 (120 heures sous 15 m d’eau) / IP69K • Excellente résistance au brouillard salin • Excellente étanchéité sur le câble • Intermariable & interchangeable avec les connecteurs MIL-DTL-26482 • Flexibilité de configuration 74 8XE Mécaniques • Endurance • Boîtier • Insert • Contacts • Enveloppe extérieure Plastique chargé verre haute résistance • Joint bague de verrouillage Teflon sur silicone Mechanical • Durability • Shell • Insert • Contacts • Housing • Coupling ring seal Electriques • Résistance d’isolement 5000 MΩ • Tension de tenue 2300 V • Résistance contact 3 MΩ • Intensité admissible par contact Taille16 : 13 A / Taille 20 : 7.5 A Electrical • Insulation resistance 5000 MΩ • Dielectric withstanding voltage 2300 V • Contact resistance 3 MΩ • Current rating per contact Size 16: 13 A / Size 20: 7.5 A Climatiques • Température d’utilisation -55°C à +125°C • Etanchéité Interface IP68 (jusqu’à 120 heures sous 15 mètres d’eau) • Résistance aux produits chimiques selon MIL-DTL-26482 Série 1 Climatic • Working temperature -55°C to +125°C • Sealing Interfacial IP68 (up to 120 hours under 15 meters of water) • Resistance to chemicals in accordance with MIL-DTL-26482 Series 1 Acceptance câbles • Câble Gauge 14 max. • Diamètre gaine extérieure: Toutes tailles jusqu’à 11.17 mm Cable acceptance • Primaries wire Gauge 14 max. • Outer jacket all popular sizes up to 11.17 mm 500 manoeuvres min. Alliage d’aluminium - anodisé dur Elastomer néoprène Alliage de cuivre - protection or 500 mating min. Aluminium alloy - hard anodized Neoprene elastomer Copper alloy with gold plating High impact glass filled plastic Teflon over silicone Références / Ordering information Racine / Basic series 8XE Connecteur pour environnment EXTREME / connector for EXTREME environment 06 - 16 8 P - BL V8 - - - Type de boîtier / Connector type 01 Prolongateur / Cable connecting receptacle 06 Fiche / Plug Type de contact / Contact type Pas de digit / No digit à souder / to solder R à sertir / to crimp Taille de boîtier / Shell size 10, 12, 14, 16, 20, 22 Arrangements / Layouts Voir page suivante / See next page Sexe du contact / Contact gender P Mâle / male S Femelle / female Orientations / Insert orientations Pas de digit / No digit Normal (n’apparaît pas dans lé référence) / Standard (not included in part number) W, X, Y, Z autres orientations / other orientations Couleur / Color Pas de digit / No digit Gris / Mink (standard) BL Bleu / Blue YE Jaune / Yellow RE Rouge / Red Autres couleurs disponibles / Others available Specification / Design variation V8 Boîtier renforcé en taille 16 & 20 / ruggedized shells in size 16 & 20 AA Boîtier inox renforcé en taille 16 & 20 (Ø câble 8 mm) / ruggedized stainless steel shells in size 16 & 20 (cable Ø 8 mm) Diamètre du câble / Cable diameter Personnalisation possible / Custom available Caractéristiques techniques / Technical characteristics 75 8XE 10 6 6 Ø 1 (#20) 7 7 Ø 1 (#20) 98 6 Ø 1 (#20) 12 3 3 Ø 1.6 (#16) 8 8 Ø 1 (#20) 10 10 Ø 1 (#20) 14 14 Ø 1 (#20) 2 2 Ø 1.6 (#16) 12 8 Ø 1 (#20) 4 Ø 1.6 (#16) 15 14 Ø 1 (#20) 1 Ø 1.6 (#16) 18 18 Ø 1 (#20) 19 19 Ø 1 (#20) 5 5 Ø 1.6 (#16) 16 8 8 Ø 1.6 (#16) 23 22 Ø 1 (#20) 1 Ø 1.6 (#16) 26 26 Ø 1 (#20) 16 16 Ø 1.6 (#16) 39 37 Ø 1 (#20) 2 Ø 1.6 (#1.6) 41 41 Ø 1 (#20) 24 24 Ø 1 (#20) 25 25 Ø 1 (#20) 36 36 Ø 1 (#20) 55 55 Ø 1 (#20) 32 32 Ø 1 (#20) 34 34 Ø 1 (#20) 21 21 Ø 1.6 (#16) 27 27 Ø 1 (#20) 14 20 Arrangements / Contact layouts Vue de face avant isolant mâle / Viewed from front face of male insulator 22 76 8XE Note : toutes les dimensions sont en mm / all dimensions are in mm Encombrements / Dimensions Fiche / Plug Shell sizes Ø A B C 10 24.9 51.2 104.5 12 27.9 51.2 103.7 14 33.0 57.6 110.8 16 36.2 63.9 122.2 20 43.7 108.4 197.1 22 48.8 91.4 184.1 16 specif.V8 41.9 83.4 172 20 specif. V8 47 91.4 184.2 Orientations Viewed from front face of male insulator (receptacle or plug) Shell sizes Layouts Angle in degrees W X Y Z 10 6 90 - - - 7* 90 - - - 98 90 180 240 270 12 3 - - 180 - 8 90 112 203 292 10 60 155 270 295 2 - - - - 14* 45 14 5 40 92 184 273 12 43 90 - - 15 17 110 155 234 18 15 90 180 270 19 30 165 315 - 16 8 54 152 180 331 23 158 270 - - 26 60 - 275 338 20 16 238 318 333 347 39 63 144 252 333 41 45 126 225 - 24 70 145 215 290 25 72 144 216 288 27 72 144 216 288 22 21 16 135 175 349 36 72 144 216 288 55 30 142 226 314 32 72 145 215 288 34 62 142 218 298 Normal W X Y * 10-7 & 12-14 layouts, W non standard orientation C B Ø A Z 77 851 Protection non cadmiée Cadmium free plating SOURIAU propose des connecteurs 851 avec une protection noire non cadmiée. Cette protection zinc-nickel a été développée pour répondre aux nouvelles exigences en matière de respect de l’environnement (directive Européenne 76/769 EEC). Raison : • Réduire le niveau de pollution par métaux lourds produit par le cadmium • Réduire les risques de santé engendrés par les produits cadmiés. Caractéristiques : • Mécaniques - boîtiers : aluminium - protection : zinc-nickel • Electriques - continuité électrique des boîtiers : ≤ 2,5 mΩ • Climatiques - tenue au brouillard salin : 500 heures Références : Exemples* : • Version à souder 851 00 E 8-3A P.54 protection zinc-nickel • Version à sertir 851 00 R 8-3A P.54 protection zinc-nickel * Voir système de référence - page 11 (version à souder et à sertir) - page 13 (version à picots et connexions enroulées) Cette protection est disponible pour les boîtiers de type : - 00: embase à collerette carrée avec possibilité de raccord - 02: embase à collerette carrée sans possibilité de raccord - 07: embase à fixation par écrou avec possibilité de raccord - 07A: embase à fixation par écrou sans possibilité de raccord - 01: prolongateur - 06: fiche droite sans bague de blindage - 36: fiche droite avec bague de blindage Raccords, nous consulter. SOURIAU propose a 851 connector with cadmium free plating black. This zinc-nickel plating has been introduced in accordance with European Herth and Safety requirements (European directive 76/769 EEC). Reason : • Reduction in level of heavy metal pollutants produced by cadmium. • Reduction in health associated with the corrosive by products of cadmium. Characteristics : • Mechanical - shell : aluminium alloy - plating : zinc-nickel • Electrical - shell continuity : ≤ 2.5 mΩ • Climatic - salt spray : 500 hours Part numbers : Examples* : • Solder version 851 00 E 8-3A P.54 zinc-nickel plating • Crimp version 851 00 R 8-3A P.54 zinc-nickel plating * See part numbers system - page 11 (solder and crimp version) - page 13 (straight PC tails and wire-wrap versions) This plating is available for shell type : - 00: square flange receptacle accepting backshells - 02: square flange receptacle not accepting backshells - 07: jam nut receptacle accepting backshells - 07A: jam nut receptacle not accepting backshells - 01: cable connecting receptacle - 06: plug for use without straight backshell - 36: screened plug for use with straight backshells Backshells, please consult us. 78 Notes / Notes IND851CA03ENFRW © SOURIAU - April 2009 - All information in this document presents only general particulars and shall not form part of any contract. All rights reserved to SOURIAU for changes without prior notification or public announcement. Any duplication is prohibited, unless approved in writing. www.souriau.com www.souriau-industrial.com contactindustry@souriau.com 21 UT0 Metal circular connector Description “UT0” industrial circular connectors are a range of multiway connectors available in 8 shell sizes and 8 insert arrangements all intermateable, interchangeable and intermountable with the TRIM TRIO “UTG” and “UTP industrial connector families. “UT0” is equipped with identical shells from military connectors complying to MIL-C-26482 spec. Strong and rugged built to resist every environmental and mechanical requirement for indoor and outdoor applications. Amongst several characteristics, “UT0” offers possibilities on: Shielding, High levels on sealing and salt spray. UT0 is also the perfect solution to connect cat5e Ethernet applications in combination with other signals, using the same TRIM TRIO contacts (consult factory for more info). Features and benefits (see p2) • Suitable for shielding applications • Available in 8 shell sizes and 8 insert arrangements. • Available in plug and receptacle versions for both male and female contacts. • Different insert orientations possible. • Plastic inserts with flammability rating: UL94-V0. • 2 levels of water protection: Dynamic IP67 and IP68 both versions are IP69K • 2 levels of salt spray: 48h and 96h Higher salt spray resistance (200/500h) upon request • Cat5e Ethernet compatible. Can be combined with other signals offering the advantage to use same contacts (consult factory). • UL recognition in process. • Metal bayonet ring: - Metal wave spring loaded - Locks with audible positive “click” - Assures 500 matings and unmatings • RoHS compliant Performance characteristics Operating temp: -40°C to +105°C Insulation resistance: 5000 MΩ min. Test potential: 2000 VAC Durability: 500 matings and unmatings. Vibration Per MIL-STD202 resistance: method 204 Thermal shock: Per MIL-STD202 method 207 Corrosion: Salt spray per MIL-STD 202 method 101 48h (standard version) 96h (black anodised coupling ring) Higher salt spray resistance (200/500h) upon request Shielding effectiveness: 95 dB at 1 Mhz Degree of water protection per DIN 40050: Dynamic IP67 / IP68 / IP69K in mated condition and in combination with sealed back shell. How to order H or H6 – – – – H –– PS 12 12 14 14 06 UT0 UT0 Body variation: 0 : Wall mounting receptacle 6 : Cable plug 7 : Jam nut receptacle for rear panel mounting Shell size: Insert arrangement: Type of contacts: P : Pin contacts S : Socket contacts Insert polarisation: No letter : Standard version W, X, Y, Z: Different orientations (consult factory) Application: H : Standard version, water protected IP 67 & IP 69K H6 : Water protected IP 68 & IP 69K (only needed for wall mounting & jam nut receptacles) Design variation: No letter : Standard version Others : Special versions Plating: No letter : Standard is nickel plating (48h salt spray) 01: Black anodised jam nut (96h salt spray) 02: Black anodised coupling ring (96h salt spray) new Construction Shells: Zinc alloy Backshells and cable glands: Brass Coupling ring: Aluminium alloy Coupling spring: Spring stainless steel Insert: Glass-filled thermoplast UL94-V0 RoHS compliant Contact accommodation • “UT0” connectors accept TRIM TRIO size 16 crimp-type removable snap-lock contacts (see contacts section) • Contacts to be ordered seperately. Dynamic IP68 / IP69K High salt spray resistance RoHS compliant 2 New UT0 - UT0W series New UT0 – UT0W series: • The exclusive new product range in the TRIM TRIO broadline. • Aesthetic and top class performances UT0 – UT0W series major technical features & benefits For detailed information on UT0 and UT0W series offering see pages 21 to 31 • Full metal bayonet connector – Enabling 500 mating-unmating without wear out – Secure locking device: audible “click” when mating • In accordance with following standards – UT0 is Ethernet Cat5e compatible (consult factory) – UTO-UTOW ranges are upgradeable to highspeed solutions • RoHS compliant – Cadmium and lead free materials are used • High salt spray resistance* – Can be used in severe environment * Exists in 48 and 96 hours salt spray version * Higher salt spray resistance (e.g. 200 or 500 hours) upon request • Dynamic IP68* Connector will remain IP68 even when: – Pulling on the cable – Bending the cable * With appropriate back shell * Exists also in IP67 version • Dynamic IP69K* Connector withstands high pressure water cleaning. * With appropriate back shell New UT0-UT0W series 22 UT0 Cable plug for pin contacts (UT06- - - -PH) Part number Shell Ø A ±0.2 B max. Ø C ±0.15 Ø D ±0.15 E ±0.25 size UT06104PH 10 21.80 10.2 20.00 UT06128PH 12 26.10 13.4 23.60 UT061412PH 14 29.30 16.7 26.80 23.25 UT061619PH 16 32.45 33.00 19.7 30.00 UT061823PH 18 35.25 21.7 33.30 UT062028PH 20 38.80 24.9 36.55 UT062235PH 22 42.00 28.1 39.50 25.20 UT062448PH 24 45.05 31.2 42.60 Cable plug for socket contacts (UT06- - - -SH) Part number Shell Ø A ±0.2 B max. Ø C ±0.15 Ø D ±0.15 E ±0.25 size UT06104SH 10 21.80 10.2 20.00 UT06128SH 12 26.10 13.4 23.60 UT061412SH 14 29.30 33.00 16.7 26.80 23.25 UT061619SH 16 32.45 19.7 30.00 UT061823SH 18 35.25 21.7 33.30 UT062028SH 20 38.80 24.9 36.55 UT062235SH 22 42.00 27.30 28.1 39.50 25.20 UT062448SH 24 45.05 31.2 42.60 Part numbers are suitable for both IP67 and IP68 water protection For 96h salt spray version add ”02” behind “H” e.g. UT061412PH02 (only bayonet ring will be black anodised) Part numbers are suitable for both IP67 and IP68 water protection For 96h salt spray version add ”02” behind “H” e.g. UT061412SH02 (only bayonet ring will be black anodised) new E ± 0,25 E ± 0,25 Dynamic IP68 / IP69K High salt spray resistance RoHS compliant 23 UT0 Wall mounting receptacle for pin contacts (UT00----PH/PH6) Wall mounting receptacle for socket contacts (UT00----SH/SH6) Part number IP67 IP68 Shell size A max. B ± 0.3 C ± 0.2 Ø D ± 0.15 E ± 0.25 F ± 0.25 Ø G ± 0.1 Ø H ± 0.1 Ø J ± 0.1 UT00104PH UT00104PH6 10 33.23 1.6 11.35 15.0 18.3 23.8 3.2 17.3 14.2 UT00128PH UT00128PH6 12 19.0 20.6 26.2 21.8 18.4 UT001412PH UT001412PH6 14 22.2 23.0 28.6 25.0 21.5 UT001619PH UT001619PH6 16 25.3 24.6 31.0 28.1 24.6 UT001823PH UT001823PH6 18 28.5 26.9 33.3 31.3 27.8 UT002028PH UT002028PH6 20 34.75 2.4 14.55 31.7 29.4 36.5 34.5 30.9 UT002235PH UT002235PH6 22 34.9 31.8 39.7 37.7 34.1 UT002448PH UT002448PH6 24 15.35 38.0 34.9 42.9 3.9 40.9 37.3 Part numbers are suitable for both 48h and 96h salt spray. A square sealing has to be ordered separately to guarantee a sealing with equipment. Refer to “Circular accessories” section (UTFD--). Part numbers are suitable for both 48h and 96h salt spray. A square sealing has to be ordered separately to guarantee a sealing with equipment. Refer to “Circular accessories” section (UTFD--). Part number IP67 IP68 Shell size A max. B ± 0.3 C ± 0.2 Ø D ± 0.15 E ± 0.25 F ± 0.25 Ø G ± 0.1 Ø H ± 0.1 Ø J ± 0.1 UT00104SH UT00104SH6 10 25.20 1.6 11.35 15.0 18.3 23.8 3.2 17.3 14.2 UT00128SH UT00128SH6 12 19.0 20.6 26.2 21.8 18.4 UT001412SH UT001412SH6 14 22.2 23.0 28.6 25.0 21.5 UT001619SH UT001619SH6 16 25.3 24.6 31.0 28.1 24.6 UT001823SH UT001823SH6 18 28.5 26.9 33.3 31.3 27.8 UT002028SH UT002028SH6 20 29.00 2.4 14.55 31.7 29.4 36.5 34.5 30.9 UT002235SH UT002235SH6 22 34.9 31.8 39.7 37.7 34.1 UT002448SH UT002448SH6 24 15.35 38.0 34.9 42.9 3.9 40.9 37.3 new B ± 0,3 B ± 0,3 Ø G ± 0,1 Dynamic IP68 / IP69K High salt spray resistance RoHS compliant 24 UT0 Jam nut receptacle for pin contacts (UT07----PH/PH6) - suitable for rear panel mounting Jam nut receptacle for socket contacts (UT07---SH/SH6) - suitable for rear panel mounting Part number IP67 IP68 Shell size Ø A ± 0.15 B ± 0.2 D Max. F Max. G ± 0.25 H ± 0.3 K ± 0.25 L ± 0.2 Ø M ± 0.2 UT07104PH UT07104PH6 10 14.9 19.30 33.90 3.2 27.0 22.2 16.6 17.0 17.7 UT07128PH UT07128PH6 12 19.0 31.8 27.0 20.8 21.2 22.5 UT071412PH UT071412PH6 14 22.2 34.9 30.2 23.9 24.3 25.7 UT071619PH UT071619PH6 16 25.3 38.1 33.3 27.1 27.5 28.7 UT071823PH UT071823PH6 18 28.5 41.3 36.5 30.3 30.6 32.0 UT072028PH UT072028PH6 20 31.7 24.70 39.00 6.4 46.1 39.7 33.4 33.8 35.2 UT072235PH UT072235PH6 22 34.9 49.2 42.9 36.6 37.0 38.4 UT072448PH UT072448PH6 24 38.0 25.50 40.50 53.4 46.0 39.8 40.1 41.5 For 96h salt spray version add ”01” at the end of the part number e.g. UT071412PH601 (only jam nut will be black anodised) For 96h salt spray version add ”01” at the end of the part number e.g. UT071412PH601 (only jam nut will be black anodised) Part number IP67 IP68 Shell size Ø A ± 0.15 B ± 0.2 D Max. F Max. G ± 0.25 H ± 0.3 K ± 0.25 L ± 0.2 Ø M ± 0.2 UT07104SH UT07104SH6 10 14.9 19.30 33.00 3.2 27.0 22.2 16.6 17.0 17.7 UT07128SH UT07128SH6 12 19.0 31.8 27.0 20.8 21.2 22.5 UT071412SH UT071412SH6 14 22.2 34.9 30.2 23.9 24.3 25.7 UT071619SH UT071619SH6 16 25.3 38.1 33.3 27.1 27.5 28.7 UT071823SH UT071823SH6 18 28.5 41.3 36.5 30.3 30.6 32.0 UT072028SH UT072028SH6 20 31.7 24.70 39.00 6.4 46.1 39.7 33.4 33.8 35.2 UT072235SH UT072235SH6 22 34.9 49.2 42.9 36.6 37.0 38.4 UT072448SH UT072448SH6 24 38.0 25.50 40.50 53.4 46.0 39.8 40.1 41.5 new Dynamic IP68 / IP69K High salt spray resistance RoHS compliant connectors on request on request on request 41 Circular accessories Plastic cable clamp with strain relief (UTG--AC) Part number Shell Cable range Ø A ± 0.4 L ± 0.5 size Ø UTG10AC 10 3.0 - 8.70 21.0 40.0 UTG12AC 12 3.0 - 12.8 24.0 40.0 UTG14AC 14 4.0 - 13.8 27.0 46.0 UTG16AC 16 5.0 - 17.0 30.2 46.0 UTG18AC 18 5.0 - 19.0 33.3 50.0 UTG20AC 20 5.0 - 21.0 36.5 55.0 UTG22AC 22 5.0 - 23.0 39.7 60.0 UTG24AC 24 8.0 - 27.0 42.9 65.0 Plastic cable clamp with strain relief nut for waterprotected (IP65) applications (UTG--PG) Part number Shell Sealing* L ± 1 A ± 0.5 size outer dia x inner dia’s UTG10PG 10 13.5 x 5 x 8 54 21.0 UTG12PG 12 16 x 7 x 10.5 x 13 x 16 57 24.0 UTG14PG 14 18.5 x 7 x 105 x 13 x 16 62 27.0 UTG16PG 16 20.5 x 8 x 10.5 x 13 x 16 68 30.2 UTG18PG 18 20.5 x 8 x 10.5 x 13 x 16 71 33.3 UTG20PG 20 26 x 11 x 15 x 18 x 22 82 36.5 UTG22PG 22 26 x 11 x 15 x 18 x 22 88 39.7 UTG24PG 24 35 x 19 x 23 x 27 x 31 103 42.9 *In order to accommodate different cable dia’s, the sealing exisits of different layers which can be pulled out easily. Cable clamp has a PG style cable gland. For threading specifications see last page of this section “Circular accessories” For threading specifications see last page of this section “Circular accessories” Suitable for UTP-UTG Suitable for UTP-UTG 42 Circular accessories Plastic cable clamp with strain relief nut for waterprotected (IP65) applications (UTG--ST) Part number Shell Cable range Dia. A ± 0.5 L ± 1 size UTG10ST 10 2 - 6 21.0 64 UTG12ST 12 3 - 7 24.0 64 UTG14ST 14 6 - 9 27.0 69 UTG16ST 16 7 - 12 30.2 72 UTG18ST 18 33.3 76 UTG20ST 20 9 - 16 36.5 80 UTG22ST 22 39.7 86 UTG24ST 24 13 - 20 42.9 91 Metal cable clamp with strain relief (UT0--AC) Cable clamp has a PG style cable gland. For threading specifications see last page of this section “Circular Part number Shell size Max cable dia. Excl. sealing Ø A±0.2 B maxi C maxi UT010AC 10 5.0 16.3 21.6 31.0 UT012AC 12 8.2 19.4 25.0 31.5 UT014AC 14 10.0 22.5 27.4 34.0 UT016AC 16 13.0 25.8 29.4 34.0 UT018AC 18 16.0 29.2 35.2 31.4 UT020AC 20 16.0 32.5 35.2 32.0 UT022AC 22 19.3 35.7 41.1 31.0 UT024AC 24 20.6 38.8 42.4 31.0 For threading specifications see last page of this section “Circular accessories” Suitable for UTP-UTG Suitable for UT0-UT0W 43 Circular accessories Short cable clamp with strain relief nut for waterprotected applications (IP68). (UT0--JCS) Long cable clamp with strain relief nut for waterprotected applications (IP68). (UT0--JC) Part number Shell size Clamping range (Ø en mm) min / max L± 1 Short Thread A version Long version Short version Long version UT010JCS UT010JC 10 03 / 06 48.5 60.5 9/16 – 24 UNEF Class 2A UT012JCS UT012JC 12 06 / 10 49.5 61.5 11/16 – 24 UNEF Class 2A UT014JCS UT014JC 14 06 / 10 53.5 67.5 13/16 – 20 UNEF Class 2A UT016JCS UT016JC 16 9.5 / 14 62.5 73.5 15/16 – 20 UNEF Class 2A UT018JCS UT018JC 18 9.5 / 14 65.5 76.0 1’’ 1/16 – 18 UNEF Class 2A UT020JCS UT020JC 20 11.5 / 18 70.5 84.0 1’’ 3/16 – 18 UNEF Class 2A UT022JCS UT022JC 22 11.5 / 18 76.5 88.0 1’’ 5/16 – 18 UNEF Class 2A UT024JCS UT024JC 24 11.5 / 18 82.0 92.0 1’’ 7/16 – 18 UNEF Class 2A Short cable clamp with large strain relief nut for waterprotected applications (IP68). (UT0--JCSL) Long cable clamp with large strain relief nut for waterprotected applications (IP68). (UT0--JCL) Part number Shell size Clamping range (Ø en mm) min / max L± 1 Short Thread A version Long version Short version Long version UT010JCSL UT010JCL 10 05 / 08 49.5 61.5 9/16 – 24 UNEF Class 2A UT012JCSL UT012JCL 12 08 / 12 49.5 62.5 11/16 – 24 UNEF Class 2A UT014JCSL UT014JCL 14 08 / 12 54.5 68.5 13/16 – 20 UNEF Class 2A UT016JCSL UT016JCL 16 11.5 / 18 68.5 79.5 15/16 – 20 UNEF Class 2A UT018JCSL UT018JCL 18 11.5 / 18 71.5 82.0 1’’ 1/16 – 18 UNEF Class 2A UT020JCSL UT020JCL 20 15 / 24 77.5 91.0 1’’ 3/16 – 18 UNEF Class 2A UT022JCSL UT022JCL 22 15 / 24 83.5 95.0 1’’ 5/16 – 18 UNEF Class 2A UT024JCSL UT024JCL 24 15 / 24 89.0 99.0 1’’ 7/16 – 18 UNEF Class 2A Cable clamp has a Metric style cable gland. For threading specifications see last page of this section “Circular accessories” Cable clamp has a Metric style cable gland. For threading specifications see last page of this section “Circular accessories” Suitable for UT0-UT0W Suitable for UT0-UT0W 44 Circular accessories Short shielded cable clamp with strain relief nut for waterprotected applications (IP68). (UT0S----JCS) Long shielded cable clamp with strain relief nut for waterprotected applications (IP68). (UT0S----JC) Part number Shell size Clamping range (Ø en mm) min / max L± 1 Short Thread A version Long version Short version Long version UT0S10JCS UT0S10JC 10 04 / 6.5 58.5 70.5 9/16 – 24 UNEF Class 2A UT0S12JCS UT0S12JC 12 07 / 10.5 61.5 74.5 11/16 – 24 UNEF Class 2A UT0S14JCS UT0S14JC 14 07 / 10.5 66.5 80.5 13/16 – 20 UNEF Class 2A UT0S16JCS UT0S16JC 16 10 / 14.5 72.5 83.5 15/16 – 20 UNEF Class 2A UT0S18JCS UT0S18JC 18 10 / 14.5 75.5 86.0 1’’ 1/16 – 18 UNEF Class 2A UT0S20JCS UT0S20JC 20 13.5 / 18 84.5 97.5 1’’ 3/16 – 18 UNEF Class 2A UT0S22JCS UT0S22JC 22 13.5 / 18 90.0 101.5 1’’ 5/16 – 18 UNEF Class 2A UT0S24JCS UT0S24JC 24 13.5 / 18 95.5 105.5 1’’ 7/16 – 18 UNEF Class 2A Short shielded cable clamp with large strain relief nut for waterprotected applications (IP68). (UT0S----JCSL) Long shielded cable clamp with large strain relief nut for waterprotected applications (IP68). (UT0S----JCL) Part number Shell size Clamping range (Ø en mm) min / max L± 1 Short Thread A version Long version Short version Long version UT0S10JCSL UT0S10JCL 10 05 / 8.5 59.5 71.5 9/16 – 24 UNEF Class 2A UT0S12JCSL UT0S12JCL 12 08 / 12.5 61.5 74.5 11/16 – 24 UNEF Class 2A UT0S14JCSL UT0S14JCL 14 08 / 12.5 66.5 80.5 13/16 – 20 UNEF Class 2A UT0S16JCSL UT0S16JCL 16 13.5 / 18 82.5 93.5 15/16 – 20 UNEF Class 2A UT0S18JCSL UT0S18JCL 18 13.5 / 18 85.5 96.0 1’’ 1/16 – 18 UNEF Class 2A UT0S20JCSL UT0S20JCL 20 17 / 24 93.0 106.5 1’’ 3/16 – 18 UNEF Class 2A UT0S22JCSL UT0S22JCL 22 17 / 24 99.0 110.5 1’’ 5/16 – 18 UNEF Class 2A UT0S24JCSL UT0S24JCL 24 17 / 24 104.5 114.5 1’’ 7/16 – 18 UNEF Class 2A Cable clamp has a Metric style cable gland. For threading specifications see last page of this section “Circular accessories” Cable clamp has a Metric style cable gland. For threading specifications see last page of this section “Circular accessories” Suitable for UT0-UT0W Suitable for UT0-UT0W 45 Circular accessories Metal right angle cable clamp with strain relief nut (UTG--LPGN / UTO--LPGN) Part number Part number Shell A max B max Cable range For UTP / UTG For UT0 / UT0W size UTG10LPGN UT010LPGN 10 48.0 30.0 13.5 x 5 x 8 UTG12LPGN UT012LPGN 12 50.0 33.5 16 x 7 x 10.5 x 13 UTG14LPGN UT014LPGN 14 52.0 36.5 18.5 x 7 x 10.5 x 13 x 16 UTG16LPGN UT016LPGN 16 55.0 39.5 20.5 x 8 x 10.5 x 13 x 16 UTG18LPGN UT018LPGN 18 60.0 46.0 20.5 x 8 x 10.5 x 13 x 16 UTG20LPGN UT020LPGN 20 58.0 47.0 26 x 11 x 15 x 18 x 22 UTG22LPGN UT022LPGN 22 58.0 48.5 26 x 11 x 15 x 18 x 22 UTG24LPGN UT024LPGN 24 67.0 54.5 35 x 19 x 23 x 27 x 31 Cable clamp has a PG style cable gland. For threading specifications see last page of this section “Circular accessories” Metal shrink boot adaptor (UTG--AD) for UTP and UTG Part number Shell size Ø A±0.2 B UTG10AD 10 21.0 UTG12AD 12 24.0 19.2 UTG14AD 14 27.0 UTG16AD 16 30.0 21.5 UTG18AD 18 33.3 UTG20AD 20 36.5 22.8 UTG22AD 22 39.7 UTG24AD 24 42.9 21.9 Standard plating is anodised black. For tin plating add “T” at the end of the part number e.g. UTG12ADT For threading specifications see last page of this section “Circular accessories” 46 Circular accessories Environmental dustcap for plugs (UTG6--DCG) Part number Shell size A max. B UTG610DCG 10 20.0 UTG612DCG 12 24.0 UTG614DCG 14 27.5 20.8 UTG616DCG 16 30.5 UTG618DCG 18 33.5 UTG620DCG 20 36.5 UTG622DCG 22 40.0 22.5 UTG624DCG 24 43.0 For dustcap without chain skip “G” e.g. UTG612DC Metal shrink boot adaptor for UTO and UTOW Part number Shell size Ø A±0.2 B For threading specifications see last page of this section “Circular accessories” UT010AD 10 21 UT012AD 12 24 24.7 UT014AD 14 27 UT016AD 16 30 UT018AD 18 33.3 UT020AD 20 36.5 27 UT022AD 22 39.7 UT024AD 24 42.9 Suitable for UTP-UTG-UT0-UT0W 47 Circular accessories Plastic environmental dustcap for receptacles (UTP--DCG) Part number Shell size Ø A ±0.2 B max. UTP10DCG 10 26.7 19.3 UTP12DCG 12 31.4 20.0 UTP14DCG 14 34.5 UTP16DCG 16 37.8 20.2 UTP18DCG 18 40.8 UTP20DCG 20 43.9 UTP22DCG 22 47.0 21.8 UTP24DCG 24 50.1 For dustcap without chain skip “G” e.g. UTP12DC For jam dustcap consult factory Metal environmental dustcap for receptacles (UT0--DCG) Part number Shell size A max. UT010DCG 10 20.8 UT012DCG 12 24.9 UT014DCG 14 28.1 UT016DCG 16 31.3 UT018DCG 18 34.4 UT020DCG 20 37.6 UT022DCG 22 40.8 UT024DCG 24 43.9 For dustcap without chain skip “G” e.g. UTG12DC For jam dustcap consult factory Suitable for UTP-UTG-UT0-UT0W Suitable for UTP-UTG-UT0-UT0W 48 Sealing for wall mounting receptacle (UTFD1-B) Part number Shell size Ø F ±0.1 R ±0.25 S ±0.25 Ø V UTFD12B 10 15.9 18.3 23.8 UTFD13B 12 19.0 20.6 26.2 UTFD14B 14 22.2 23.0 28.6 UTFD15B 16 25.4 24.6 31.0 3.3 UTFD16B 18 28.6 27.0 33.3 UTFD17B 20 31.8 29.4 36.5 UTFD18B 22 34.9 31.8 39.7 UTFD19B 24 38.1 34.9 42.9 4.0 Cable gland threadings used on cable clamps Shell size Thread size on connectors PG threading Metric threading 10 9/16 - 24 UNEF PG9 M16 x 1.5 12 11/16 - 24 UNEF PG11 M20 x 1.5 14 13/16 - 20 UNEF PG13.5 M20 x 1.5 16 15/16 - 20 UNEF PG16 M25 x 1.5 18 1-1/16 - 18 UNEF PG16 M25 x 1.5 20 1-3/16 - 18 UNEF PG21 M32 x 1.5 22 1-5/16 - 18 UNEF PG21 M32 x 1.5 24 1-7/16 - 18 UNEF PG29 M32 x 1.5 Circular accessories Adaptors for flexible cable protection systems (conduits) Adaptors for flexible cable protections systems that fit to the TRIM TRIO circular connectors are available from cable protection systems manufacturers (e.g. PMA). 2 solutions are offered: • UNEF Adaptors that fit directly onto the connectors (left picture) • METRIC Adaptors that fit onto the metal cable clamp tubes as indicated on pages 43 and 44 (right picture) These types of adaptors offer extra protection to single wire applications (electrical, coax, Fibre optic … etc.) Note: the adaptors are not available from Souriau. They must be ordered directly from the manufacturers Suitable for UTP-UTG-UT0-UT0W 0,8 ± 0,2 Clipper Industrial Plastic Connectors 2 Clipper Industrial Plastic Connectors Connectors and interconnect systems for harsh environments The company designs, manufactures and markets high performance interconnect solutions for severe environments from industrial broadline and universal ranges to complex system with integrated functions: filtering, high speed data transmission, hermetic seal, separation mechanism, remote handling, underwater mating, … The dedicated end markets for SOURIAU’s products are aeronautical, defense-space and industrial. Industrial Railway Geophysics Manufacturing environment Instrumentation Automation & process Civil & military aircraft Helicopter Weapon delivery system Avionics Military marine Communications Satellites Launcher & missile Aeronautical Equipment & system SOURIAU was established in 1917 and has been created by successive acquisitions of the industrial, aeronautical, defense and space activities of SOURIAU, JUPITER and BURNDY. The Group’s products are engineered and manufactured in the USA and Dominican Republic, Europe and Morocco, Japan and India, and sold by a worldwide sales and marketing organization, and in addition to SOURIAU’s offices, a large network of licensed distributors and agents. SOURIAU complies with most of national and international Quality Assurance Standards, production unit with ISO 14001. 3 Clipper Industrial Plastic Connectors Description/Features/Presentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Square flange receptacle and in-line receptacle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Plug and backnut . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Electrical thread backshell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Stamped and formed contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Machined contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 IP68 configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 IP67 configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Mated and unmated connectors (with backshells) overall dimensions . . . . . . . . . . . . . . . . . . . . . . . 16 Dimensions (receptacle and plug) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Manual crimping tool. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Automatic crimping tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Panel mounting/panel cut-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Wiring instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Assembly instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 General technical information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Contents Clipper Industrial Plastic Connectors 4 Presentation CLIPPER is a plastic low cost range of industrial connectors, UL & CSA approved. Complementing SOURIAU product range CLIPPER offers : • a high sealing level : - IP67 for the sealed plug (with o’ring and mating seal) - IP68 for the enhanced sealed plug (with o’ring and a special mating seal). This version allows a permanent waterproof level when immersed at depths down to 30 meters. • a retention plate system allowing insertion/extraction of the contacts without the need for tooling, • facilities to use trade backshells with the electrical thread adaptor (PG). CLIPPER range is composed of : • 4 sizes of shell in molded black thermoplastic material (size 1/2/3/4). • 7 contact layouts (4/9/14/18/26/31/40 contacts). • #20, #16 contacts, machined or stamped and formed, crimp, solder or PC tail termination. • An adaptor with electrical PG thread for PG backshells. • Backnut with grommet facilities. Locked, the retention plate holds the contacts firmly in position Unlocked, the retention plate allows the insertion/extraction of contacts without tooling Locked plate Unlocked plate Description Retention plate principle Features Mechanical • Monobloc shell and insulator in thermoplastic material self-extinguishing to UL 94 V0. • 180° screw coupling with positive audible safety latch. • Scoop proof. • Copper alloy contacts, machined or stamped and formed • plating : gold on active part over nickel. • Mechanical endurance : - connector : 250 cycles mating / unmating, - retention plate : 50 cycles mating / unmating. • Retention force : - # 20 → 70 N - # 16 → 90 N. • Vibration : - frequency range : 10-2000 Hz, 20 g - 10 cycles in accordance with CEI 68-2-6 Electrical • Withstand voltage : 1500 Vrms min or in accordance with DIN 57110b. • Contact resistance < 10 mW. • Current rating per contact : - machined contacts : # 20 (7 Amps), # 16 (13 Amps) - stamped and formed contacts : # 20 (5 Amps), # 16 (10 Amps). Environmental • Sealing : - up to IP68 • Working temperature : -40°C to +125°C. (-40°F to +257°F) • Resistance to salt spray : - 48 h min - > 1000 h (sealed mated connectors). • Resistance to fluids : - oil, - petrol, fuel, - lubricants - other fluids : consult us. Clipper Industrial Plastic Connectors 5 CL1M1100 CL1R1100 CL1R1101 CL1R1102 CL1R2102 CL1R3102 CL1R4202 CL1R2101 CL1R3101 CL1R4201 CL1M1101 CL1M1102 CL1C1100 CL1C1101 CL1C1201 CL1C2101 CL1C2201 CL1C3101 CL1C3201 CL1C4101 CL1C1200 CL1C2100 CL1C2200 CL1C3100 CL1C3200 CL1C4100 CL1C4200 CL1M1202 CL1M2102 CL1M2202 CL1M3102 CL1M3202 CL1M4102 CL1M4202 CL1M1201 CL1M2101 CL1M2201 CL1M3101 CL1M3201 CL1M4101 CL1M4201 CL1R2100 CL1R3100 CL1R4200 CL1M1200 CL1M2100 CL1M2200 CL1M3100 CL1M3200 CL1M4100 CL1M4200 Receptacle types without contacts Contacts layouts Unsealed receptacle (without o’ring) for male contacts for female contacts for male contacts for female contacts for male contacts for female contacts unsealed for male contacts sealed for male contacts Sealed receptacle (with o’ring) for use with backshell Sealed receptacle (with o’ring and panel gasket) In-line receptacle Shell sizes 1 2 3 4 4 cts # 16 9 cts # 20 9 cts # 16 14 cts # 20 18 cts # 16 31 cts # 20 26 cts # 16 40 cts # 16 Available Style Square flange receptacle and in-line receptacle Part number CL1C4201 Clipper Industrial Plastic Connectors 6 Part number Grommet Thrust ring O ring CL1P1100 CL1F1100 CL1F1200 CL1F1101 (IP67) CL1F1103 (IP68) CL1F1201 (IP67) CL1F1203 (IP68) CL111101 CL111201 CL112101 CL113101 CL113201 CL114101 CL114201 CL1F2101 (IP67) CL1F2103 (IP68) CL1F2201 (IP67) CL1F2203 (IP68) CL1F3101 (IP67) CL1F3103 (IP68) CL1F3201 (IP67) CL1F3203 (IP68) CL1F4101 (IP67) CL1F4103 (IP68) CL1F4201 (IP67) CL1F4203 (IP68) CL1P1101 CL111102 CL111000 CL112000 CL113000 CL111202 CL112102 CL113102 CL113202 CL114102 CL114202 CL1P2101 CL1P3101 CL1P4201 CL1F2100 CL1F2200 CL1F3100 CL1F3200 CL1F4100 CL1F4200 CL1P2100 CL1P3100 CL1P4200 Plug types without contacts Contact layouts Unsealed plug (without o’ring and mating seal) for male contacts for female contacts for male contacts for female contacts for male contacts for female contacts for male and female contacts Sealed plug (with o’ring and mating seal) Sealed backnut Unsealed backnut Shell sizes 1 2 3 4 4 cts # 16 9 cts # 20 9 cts # 16 14 cts # 20 18 cts # 16 31 cts # 20 26 cts # 16 40 cts # 16 Plug and backnut CL114000 Unsealed (IP40) Clipper Industrial Plastic Connectors 7 Note : Electrical thread backshells are always supplied complete with the adaptor. Part numbers Description 1 2 3 4 (PG 13,5) (PG 16) (PG 21) (PG 36) (PG 36) Straight backshell for flexible CL101040 CL102040 CL103040 CL124040 CL104040 conduit systems Straight cable CL101030 CL102030 CL103030 CL124030 - clamp Sealed Part numbers Description 1 2 3 4 (PG 13,5) (PG 16) (PG 21) (PG 36) (PG 36) Elbow backshell with sealing CL101051 CL102051 CL103051 CL124051 - gland Straight backshell for flexible CL101041 CL102041 CL103041 CL124041 CL104041 conduit systems Antidecoupling sealing CL101021 CL102021 CL103021 CL124021 CL104021 gland backshell Electrical thread backshells (PG) Clipper Industrial Plastic Connectors Shell Part number 1 CL141001 2 CL142001 3 CL143001 4 CL144001 Dim. (inches) / Shell sizes A B C D E 1 .84 .96 1.52 .13 1.15 2 .97 1.10 1.56 .13 1.21 3 1.12 1.20 1.69 .15 1.40 4 1.44 1.55 1.95 .15 1.87 90° sealed adaptors for receptacles Shell 1 to 4 * with panel gasket Shell Part numbers Sealed* 1 CL131001 2 CL132001 3 CL133001 4 CL134001 IP67 Dust cap for receptacle 90° adaptors for receptacles Accessories 8 90° adaptors for receptacles Panel gasket (for square flange receptacle) Shell sizes 1 2 3 4 Part numbers CL191001 CL192001 CL193001 CL194001 Clipper Industrial Plastic Connectors 9 Assembly male 2 mm to 3 mm (0.08" to 0.12") female 16 0.7 to 1.5 mm2 male female CF16PC10RF CF16SC10RF CF16PC18RF CF16SC18RF Bulk Reel 5,000 pcs. male 1.2 mm to 2.1 mm (0.05" to 0.08") female female 20 0.35 to 0.6 mm2 male CF10PC10RF CF10SC10RF CF10PC18RF CF10SC18RF Bulk Reel 5,000 pcs. Filler plug # 16 Part number : 8500 479 CL (for un-used contact cavities) Polarization Contact Part number : CP16SW9700 (instruction for polarizing connector - see page 23) Filler plug # 20 Part number : 8500 4144 (for un-used contact cavities) 18 to 16 22 to 20 CM16PT10LY CM10PT10LY 16 20 male male Bulk Print Circuit (PC) Tail Machined Contact Admissible section mm2 AWG Ø mm over insulation (inches) Part numbers Size Crimp Contact with strain relief Packaging Plating RF : gold flash on active part for standard version (For other platings, consult FCI) Stamped and formed contacts Clipper Industrial Plastic Connectors 10 CM16PC10MQ CM16PC20MQ* CM16SC10MQ CM16SC20MQ* CM16PS10MQ CM16SS10MQ Part numbers CM16PC10MQ CM16SC10MQ CM16PS10MQ CM16SS10MQ CM10PS10MQ male female male female Plating MQ : 0.4μ mm gold on active part (.016μ inches) * Up to 1.91 mm2 Packaging male female male CM16PC20MQ female CM16SC20MQ male CM10PC20MQ female CM10SC20MQ Bulk solder 8501 9641 8501 9642 CL 16 20 male male Bulk Extended ground contact-crimp (Length + .039 inch = +1 mm) 0.08" to 0.12" 18 to 14 0.05" to 0.08" 24 to 18 2 mm to 3 mm 16 (0.08" to 0.12") 0.93 to 1.91 mm2 16 2 to 3 mm (0.08" to 0.12") 20 0.21 to 0.60 mm2 1.2 to 2.1 mm (0.05" to 0.08") 30 to 24 0.06 to 0.21 mm2 20 Contact types Size Ø mm over insulation (inches) Admissible section mm2 male female CM10PC10MQ CM10SC10MQ 20 1.2 mm to 2.1 mm (0.05" to 0.08") 18 to 14 AWG 0.21 to 0.93 mm2 crimp male female CM16PC00MQ CM16SC00MQ 16 2 mm to 3 mm (0.08" to 0.12") 0.93 to 2.60 mm2 crimp solder crimp CM10SS10MQ 14* Max 24 to 18 18 Max 18 to 13 Machined contacts Clipper Industrial Plastic Connectors 11 IP68 Configuration (temporary water tightness down to 100 feet) IP68 Configuration Clipper Industrial Plastic Connectors Part numbers CL1C2201 CL1C4201 CL1C4101 CL1C3201 CL1C3101 CL1C2101 CL1C1201 CL1C1101 CL101021 (pg 13.5) CL1F1103 CL1F1203 CL1F2103 CL1F2203 CL1F3103 CL1F3203 CL1F4103 CL1F4203 CL1M1102 CL1M1202 CL1M2102 CL1M2202 CL1M3102 CL1M3202 CL1M4102 CL1M4202 for male contacts Sealed receptacle (with o’ring and panel gasket) for female contacts Sealed plug (with o’ring and mating seal) Anti-decoupling sealing gland backshell CL102021 (pg 16) CL103021 (pg 21) CL124021 (pg 29) Shell types (without contacts) and Backshell type Contacts layouts Shell sizes 1 2 3 4 4 cts # 16 9 cts # 20 9 cts # 16 14 cts # 20 18 cts # 16 31 cts # 20 26 cts # 16 40 cts # 16 for male contacts o’ring Sealed In-line receptacle IP68 Configuration CL104021 (pg 36) 12 IP67 Configuration (temporary water tightness) Clipper Industrial Plastic Connectors IP67 Configuration 13 Clipper Industrial Plastic Connectors Part numbers CL1F2201 CL1F4101 CL1F3201 CL1F3101 CL1F2101 CL1F1201 CL1F1101 CL1C1101 CL1C1201 CL1C2101 CL1C2201 CL1C3101 CL1C3201 CL1C4101 CL1M1102 CL1M1202 CL1M2102 CL1M2202 CL1M3102 CL1M3202 CL1M4102 Sealed receptacle (with o’ring and panel gasket) for male contacts Sealed plug (with o’ring and mating seal) o’ring Sealed In-line receptacle CL1M1102 CL1R1102 CL1P1101 CL1P2101 CL1P3101 CL1P4201 CL1R2102 CL1R3102 CL1R4202 CL1F4201 CL1M2102 CL1M3102 CL1M4202 Shell types without contacts Contact layouts for male contacts for female contacts Shell sizes 1 2 3 4 4 cts # 16 9 cts # 20 9 cts # 16 14 cts # 20 18 cts # 16 31 cts # 20 26 cts # 16 40 cts # 16 for male contacts for female contacts IP67 Configuration CL1C4201 14 Part numbers Clipper Industrial Plastic Connectors Grommet Thrust ring O ring CL111102 CL111101 CL111201 CL112101 CL113101 CL113201 CL114101 CL114201 CL101051 (pg 13.5) CL101041 (pg 13.5) CL101021 (pg 13.5) CL102021 (pg 16) CL103021 (pg 21) CL124021 (pg 29) CL124051 (pg 29) CL124041 (pg 29) CL111202 CL112102 CL113102 CL113202 CL114102 CL114202 CL102051 (pg 16) CL102041 (pg 16) CL103051 (pg 21) CL103041 (pg 21) CL104041 (pg 36) Backshell types Contact layouts for male contacts for female contacts Elbow backshell with sealing gland Straight backshell for flexible conduit systems Anti-decoupling sealing gland backshell Sealed backnut Shell sizes 1 2 3 4 4 cts # 16 9 cts # 20 9 cts # 16 14 cts # 20 18 cts # 16 31 cts # 20 26 cts # 16 40 cts # 16 IP67 Configuration CL104021 (pg 36) 15 Clipper Industrial Plastic Connectors LD LV A B ADAPTOR BACKNUT C STRAIGHT CABLE CLAMP D J STRAIGHT BACKSHELL FOR CONDUIT SYSTEM F SEALING GLAND BACKSHELL WITH ANTI-DECOUPLING SYSTEM G ELBOW BACKSHELL WITH SEALING GLAND KL R N Q * For other needs, consult FCI. Dimensions 1 2 3 4 (PG 29)(PG 36) LDA 2.01 2.09 2.09 2.17 2.17 LVA 2.29 2.33 2.33 2.41 2.41 LDB 1.81 1.85 1.85 - 1.85 LVB 2.09 2.09 2.09 - 2.09 LDC 2.68 2.85 3.03 3.41 - LVC 2.97 3.09 3.27 3.60 - LDD 3.41 3.50 3.62 3.70 4.25 LVD 3.70 3.74 3.86 3.94 4.47 LDF 3.15 3.27 3.35 3.74 4.02 LVF 3.43 3.50 3.58 3.98 4.25 LDG 3.31 3.46 3.77 4.29 - LVG 3.58 3.70 4.01 4.52 - R Max. 2.24 2.34 2.87 3.58 - Dim. (inches) Shell Cable acceptance* 1 2 3 4 (PG 29) (PG 36) J .24/.55 .24/.63 .31/.83 .39/ - 1.10 Conduit L .67 .67 .91 1.14 1.42 Pmaflex K Max .63 .63 .85 1.08 1.42 N .24/47 .39/.55 .51/.71 .71/.98 .87/ 1.26 Q .24/.47 .39/.55 .51/.71 .71/.98 - Dim. (inches) Shell Mated and unmated connectors with backshells Overall dimensions in inches 16 Clipper Industrial Plastic Connectors 17 Square flange receptacle Plug Dimensions in inches 1 2 3 4 A .8 .8 .8 .8 B 1.15 1.28 1.46 1.92 C .81 .94 1.12 1.57 D 1.52 1.56 1.56 1.56 Dim. (inches) Shell sizes 1 2 3 4 A 1.67 1.67 1.67 1.67 B .83 .96 1.14 1.59 C .71 .71 .71 .71 D .16 .16 .16 .16 E .81 .94 1.12 1.57 F 1.17 1.23 1.42 1.89 G min. .83 .96 1.11 1.43 Max. .92 .98 1.17 1.57 H .13 .13 .15 .15 Dim. (inches) Shell sizes Clipper Industrial Plastic Connectors • Squeeze the plier handles until a final click sounds, release, the pliers should open by themselves. • Fully insert the contact into the locator (corresponding gauge), the contact crimping lugs should be directed upwards, according to the drawing. • Put the stripped wire in the crimping part until it comes in contact with the stopper plate. Make sure that no strands stick out of the crimping part. • Squeeze the plier handles until a final click sounds, release, the pliers should open by themselves. • Check the overall aspect of the crimping. • Push the cable into the contact barrel and make sure the cable strands stick out of the inspection hole. • The pliers must be used on the jaws side. • Squeeze the plier handles until a final click sounds, release, the pliers should open by themselves. • Insert both wire and contact (or wire, reducing sleeve and contact) between the 4 jaws until stopped by the locator. • Fully squeeze until a final click sounds, the pliers should open once the crimping is performed • Extract the wire and crimped contact, then check the overall aspect of the crimping. Stamped and Formed Contacts (#16 and #20) Y16SCMCL3 Machined Crimping Contacts (#16 and #20) 8365 with locator 8365-02 Manual Crimping Tool 18 Crimping Mechanism (left side miniapplicators) Clipper Industrial Plastic Connectors UTM2 Automatic crimping tool for Clipper Description Electromechanical high speed semi automatic press is designed for mass production and is realized totally in assembled steel parts. Voltage: 115VAC - 60 Hz Power.: 700 Watts Weight: 300 lbs. (including one crimp mechanism) Dimensions: 939.8x533.4x711.2 mm (37.0"x21.0"x28.0") Contacts AWG Contact P/N Crimp Mech. P/N 16 16-18 CF16 PS 18RF CM30-R CF16 SC 18RF 20 20-22 CF10 PS 18RF CM31-R CF10 SC 18RF Press and crimping mechanism are rental. Please contact Customer Service. Automatic crimping tool 19 Clipper Industrial Plastic Connectors 20 Panel mounting There are two types of mounting possible: through the front or through the back of the panel. Panel cut-out • For a sealed mounting, the seal gasket shall be used, making sure the surface is in good condition. • Observe the drilling hole diameters indicated below. • Use the recommended screws : M3 (all shells) or # 4.40 (shells 1 and 2) # 6.32 (shells 3 and 4) • Respect the coupling torques indicated M3 (all shells) : 0.70 N.m Max Rear Mounting .157" max (4 mm max) Front Mounting .157" max (4 mm max) Panel mounting / Panel cut-out 1 2 3 4 H .85 .98 1.22 1.61 I .84 .97 1.13 1.44 J .13 .13 .15 .15 Dim. (inches) Shell sizes Wire Stripping Length • With machined crimping contacts • With stamped and formed crimping contacts Clipper Industrial Plastic Connectors 21 Jacketed Cable Stripping Length Make a 90° cut at the cable end. carefully make an incision in order to remove the cable protection on a length LD as described. Caution : This operation should be realized without deterioration of wires insulation. Then, follow the normal stripping instructions : - single wire with machined crimping contacts, - single wire with stamped and formed crimping contacts Stripping Instructions Use the upmost care with stripping operation : • Use stripping pliers appropriate for the cable gauge and which are in perfect condition. • In order to obtain a correct crimping and to maintain all of the connector sealing characteristics, the wires must have the dimensions described below. l Shell size 1 2 3 4 layouts Indifferent 26 40 LD mm 60 65 65 80 100 (inch) (2.36’) (2.56’) (2.56’) (3.15") (3.94") Contact size I = Wire stripping lenght layouts 6 mm (.236") #20 Ø over insulation > 2 mm 􀃖 l = 5 (> .08" 􀃖 l = .20") Ø over insulation > 2 mm 􀃖 l = 7 (> .08" 􀃖 l = .27") Contact diameter I = Wire stripping lenght #16 4 mm (.157") #20 4 mm (.157") Wiring Instruction Clipper Industrial Plastic Connectors 22 Instruction For Assembly Insertion and extraction of contacts Single wires Contact insertion and extraction is performed without a tool thanks to te retainer plate system. Insertion 1) With the thumb and index finger, squeeze the retainer plate flaps and pull backwards : the plate is then in the unlocked position. 2) Fully insert the wired contact in the cavity. 3) Repeat the same procedure for the other contacts. 4) Once again squeeze the retainer plate flaps and push forwards: the plate is then locked and retains the contacts (90 N of retention force for contacts of 1.6 mm dia.) 5) The plate can only be pushed backed if the contacts are correctly engaged (backup security) Extraction 1) With the thumb and index finger, squeeze the retainer plate flaps and pull backwards : the plate is then in the unlocked position. 2) Pull the contact wire: the the contact comes out of the cavity. 3) Repeat the same procedure for the other contacts. Special case of jacketed cables 1) Locate the first contact and the corresponding cavity. 2) The wire should described a buckle as describe below. 3) Unlock the retainer plate as described above. 4) Fully insert the wired contact in the cavity. 5) Respect the same procedure for the other contacts 6) Once again squeeze the retainer plate flaps and push forwards : the plate is then locked Special case of jacketed cables 7) Manually fully screw the adaptor and the backshell on the connector. Caution : In the sealed version don’t forget the O-ring. 8) Push forwards the cable of 10 mm in the backshell. 9) Fully screw on the backshell with a wrench while keeping the adaptor with another wrench. Note : The plate can only be pushed back if the contacts are correctly engaged (backup- security) Adaptor and PG electrical thread backshells The CLIPPER connector must be equipped with an adaptor in order to use a PG electrical thread backshell (e.g.: cable clamp or sealing gland, or flexible conduits system backshells, etc.) 1) Manually, fully screw the adaptor on the connector, the hexagonal nut towards the rear. 2) In the sealed version, cover the O-ring. 3) Manually, fully screw the PG thread backshell of your choice. Note: In the case of an elbow backshell, it is possible to adjust the position according to the angle desired. 1) Position the O-ring at the bottom of the backnut. 2) Run the backnut around the cable. 3) Unlock the retainer plate. 4) Position the grommet in the thrust ring, resting against the retainer plate. 5) Insert the contacts through the grommet and the retainer plate. 6) Lock the retainer plate. 7) Screw the backshell. Instruction For Assembly Clipper Industrial Plastic Connectors 23 When the insert is partially filled with contacts, place polarization contact into selected hole location in the FEMALE INSERT and push in until seated. • Polarization contacts are used to provide keying capabilities for the CLIPPER series. • Polarization contacts are used in the socket-cavities of standard plugs and reverse receptacles. In order to lock the couple of chosen connectors, you have to let free the cavity in front of the polarization contact. To avoid the connection with other connectors, you have to insert a contact in the cavity in front of the polarization contact. Heat shrink boot Shrink sleeve as follows : 1) Use heat gun with an air deflector nozzle. 2) Adjust air deflector opening to accommodate tubing size. Turn switch ON. Wait until full heat output is reached. 3) Position the air deflector over section of tubing to be shrunk. Start at pre-shrunk section and work towards open end. 4) When tubing begins to shrink, move gun so that air is distributed in a band around the tubing circumference causing it to shrink evenly around the cable. 5) Move nozzle to adjacent section and shrink in the same manner. Repeat process on section at a time until entire length is shrunk. Avoid excessive heat. Direct heat away from connector assembly to prevent damage. Instruction for polarizing connector mounting CP16SW9700 Grommet Backshell Assembly Clipper Industrial Plastic Connectors EXAMPLE : IP66-5 means: - Total protection against dust - Proof against temporary flooding - Proof against impact strength of 2 Joule Degree of protection in accordance with CEI 529, DIN 40050, NF EN 60529 General technical information 24 Clipper Industrial Plastic Connectors Conversion Table (mm) (inches) 8.2 0.32308 8.4 0.33096 8.6 0.33884 8.8 0.34672 9.0 0.35460 9.2 0.36248 9.4 0.37036 9.6 0.37824 9.8 0.38612 10.0 0.39400 10.5 0.41370 11.0 0.43340 11.5 0.45310 12.0 0.47280 12.5 0.49250 13.0 0.51220 13.5 0.53190 14.0 0.55160 14.5 0.57130 15.0 0.59100 15.5 0.61070 16.0 0.63040 16.5 0.65010 17.0 0.66980 17.5 0.68950 18.0 0.70920 18.5 0.72890 19.0 0.74860 19.5 0.76830 20.0 0.78800 20.5 0.80770 21.0 0.82740 21.5 0.84710 22.0 0.86680 22.5 0.88650 23.0 0.90620 23.5 0.92590 24.0 0.94560 24.5 0.96530 25.0 0.98500 25.5 1.00470 26.0 1.02440 26.5 1.04410 27.0 1.06380 27.5 1.08350 28.0 1.10320 28.5 1.12290 29.0 1.14260 29.5 1.16230 30.0 1.18200 30.5 1.20170 31.0 1.22140 31.5 1.24110 32.0 1.26080 32.5 1.28050 33.0 1.30020 33.5 1.31990 34.0 1.33960 34.5 1.35930 35.0 1.37900 35.5 1.39870 36.0 1.41840 36.5 1.43810 37.0 1.45780 37.5 1.47750 (°C) (°F) - 70 - 94 - 65 - 85 - 55 - 67 - 50 - 58 - 40 - 40 0 32 37 98.6 80 176 125 257 150 302 170 338 200 392 250 482 (1) 6145DJ - Câbles multipaires (armés, paires blindées) 250 MZH. (2) 6145DJ - Câbles multipaires (armés, paires non blindées) 250 MZH. (mm) (inches) 0.1 0.00394 0.2 0.00788 0.3 0.01182 0.4 0.01576 0.5 0.01970 0.6 0.02364 0.7 0.02758 0.8 0.03152 0.9 0.03546 1.0 0.03940 1.1 0.04334 1.2 0.04728 1.3 0.05122 1.4 0.05516 1.5 0.05910 1.6 0.06304 1.7 0.06698 1.8 0.07092 1.9 0.07486 2.0 0.07880 2.1 0.08274 2.2 0.08668 2.3 0.09062 2.4 0.09456 2.5 0.09850 2.6 0.10244 2.7 0.10638 2.8 0.11032 2.9 0.11426 3.0 0.11820 3.1 0.12214 3.2 0.12608 3.3 0.13002 3.4 0.13396 3.5 0.13790 3.6 0.14184 3.7 0.14578 3.8 0.14972 3.9 0.15366 4.0 0.15760 4.1 0.16154 4.2 0.16548 4.3 0.16942 4.4 0.17336 4.5 0.17730 4.6 0.18124 4.7 0.18518 4.8 0.18912 4.9 0.19306 5.0 0.19700 5.2 0.20488 5.4 0.21276 5.6 0.22064 5.8 0.22852 6.0 0.23640 6.2 0.24428 6.4 0.25216 6.6 0.26004 6.8 0.26792 7.0 0.27580 7.2 0.28368 7.4 0.29156 7.6 0.29944 7.8 0.30732 8.0 0.31520 (mm) (inches) 38.0 1.49720 38.5 1.51690 39.0 1.53660 39.5 1.55630 40.0 1.57600 40.5 1.59570 41.0 1.61540 41.5 1.63510 42.0 1.65480 42.5 1.67450 43.0 1.69420 43.5 1.71390 44.0 1.73360 44.5 1.75330 45.0 1.77300 45.5 1.79270 46.0 1.81240 46.5 1.83210 47.0 1.85180 47.5 1.87150 48.0 1.89120 48.5 1.91090 49.0 1.93060 49.5 1.95030 50.0 1.97000 51.0 2.00940 52.0 2.04880 53.0 2.08820 54.0 2.12760 55.0 2.16700 56.0 2.20640 57.0 2.24580 58.0 2.28520 59.0 2.32460 60.0 2.36400 61.0 2.40340 62.0 2.44280 63.0 2.48220 64.0 2.52160 65.0 2.56100 66.0 2.60040 67.0 2.63980 68.0 2.67920 69.0 2.71860 70.0 2.75800 71.0 2.79740 72.0 2.83680 73.0 2.87620 74.0 2.91560 75.0 2.95500 80.0 3.15200 85.0 3.34900 90.0 3.54600 100.0 3.94000 200.0 7.88000 400.0 15.76000 600.0 23.64000 800.0 31.52000 1000.0 39.40000 1200.0 47.28000 1600.0 63.04000 2000.0 78.80000 3200.0 126.08000 bar psi mmHg (torr) 10 145.0 7600 5 72.5 3800 2 29.0 1520 1 14.5 760 0.5 7.2 380 0.1 1.4 76 mbar psi torr (mmHg) 10 145.0 7600 5 72.5 3800 2 29.0 1520 1 14.5 760 0.5 7.2 380 0.1 1.4 76 25 Clipper Industrial Plastic Connectors 26 Notes Clipper Industrial Plastic Connectors 27 Notes www.souriau.com FSOURIAUCLIPPERJANVIER2007E © Copyright SOURIAU - Réalisation En Toute Transparence. UTS Series Dynamic IP68/69K • UV Resistant • UL/IEC Compliant © 2011 – SOURIAU 3 How to read our catalogue ........................................ 06 UTS range overview ..................................................... 07 General technical characteristics ............................. 10 Cable assembly ............................................................... 14 2 contacts ....................................................................... 20 2 + ground contacts ................................................... 28 3 contacts ........................................................................ 36 3 + ground contacts .................................................... 52 4 contacts ........................................................................ 60 5 contacts ........................................................................ 72 6 contacts ........................................................................ 76 6 + ground contacts .................................................... 88 7 contacts ........................................................................ 92 8 contacts ........................................................................ 96 10 contacts ..................................................................... 104 12 contacts ...................................................................... 108 14 contacts ...................................................................... 116 15 contacts ...................................................................... 120 18 contacts ..................................................................... 124 19 contacts ..................................................................... 128 23 contacts ..................................................................... 132 32 contacts ..................................................................... 136 Contents UTS Series Overview Mechanics Description ...................................................................... 142 Contact plating selector guide .................................. 143 Contact selector guide ................................................ 144 Packaging ........................................................................ 144 Crimp contacts ............................................................... 145 #16 coaxial contacts ................................................... 147 PCB contacts .................................................................. 148 Fibre optic contacts ...................................................... 149 Contacts Tooling .............................................................................. 154 Assembly instruction .................................................... 156 Dimensions overmoulded harnesses ..................... 162 Extraction tools .............................................................. 162 Rated current & working voltage .............................. 163 UV resistance ................................................................. 164 UL94 + UL1977 ............................................................ 165 IEC 61984 with IP code explanation ...................... 168 What is NEMA rating ? ................................................ 170 Ethernet for the layman ............................................... 171 Technical information #16 coaxial contacts - cabling notices .................. 176 Glossary of terms .......................................................... 183 Discrimination/Keying methods ............................... 184 Part number Index.......................................................... 185 Appendices Appendices Technical information Contacts Mechanics Overview UTS Series © 2011 – SOURIAU 5 Overview UTS Series How to read our catalog .............................................................................................................. 06 UTS range overview ...................................................................................................................... 07 General technical characteristics .............................................................................................. 10 6 © 2011 – SOURIAU UTS Series Overview SOURIAU is pleased to announce the arrival of a brand new catalog containing some signifi cant improvements to simplify the connector selection process and provide easy access to key information. In this version you can see all layouts at a glance, download 2D drawings and 3D models. Then, when your choice is made, you can click on the part number and buy online. Step 3 Step 2 Easy access to supporting material such as prints and CAD models. In just two pages you can gather together details of all accessories, contacts, tools etc required for your application. Interactive zones. Clearer understanding of the range. Step 1 © 2011 – SOURIAU 7 UTS range overview The UTS series is a plastic connector range but rugged enough to withstand industrial applications. The philosophy of the UTS series is built around three key elements: Dynamic IP68/69K UV Resistant UL/IEC Compliant In most applications, our connectors are exposed to extreme climatic conditions; it was therefore key for us to select the materials best able to cope with the targeted environment. Part of our product qualifi cation process involved subjecting connectors to a simulated fi ve years of exposure to various elements including Temperature, UV and Humidity. The results were positive in that there were no visible signs of weakness, such as cracking or crazing. The outmost priority for any electrical installation is to protect personnel from any shock hazard. In North America, Underwriters Laboratories insisted that connector manufacturers, depending of the application, respect their standards. The UTS series had thus been qualifi ed and is certifi ed by this organisation. In Europe and in Asia, IEC standards are better known and trusted by end users. Like its American equivalent, the IEC refers to safety rules. The UTS series was obviously designed to respect these rules. UTS series is rated at IP68/69K… even in dynamic conditions. This means that it remain sealed even when used continuously underwater or cleaned using a high pressure hose and cable is moving. This extreme level of performance is achievable with jacketed cable or discrete wires. If this same level of performance is required even when connectors are not mated, we have UTS Hi Seal; a product designed to remain watertight if an environmental cap is not fi tted or if the equipment is likely to get wet when cables have been disconnected. Screw termination version UTS series is a wide range... Based on multiple power & signal connectors and offers everything from box mounted receptacles and cable mounted plugs to cable mounted in-line and PCB mounted receptacles. Almost all ways to accommodate wires exist: Crimp, Solder, Screw termination. UTS Series Overview The bayonet coupling system makes it simple to use. With only a 1/3 twist of the coupling ring, connectors are mated with an audible and sensitive “click”. Overview 8 © 2011 – SOURIAU Just screw the wires to the connector ! No special tools required, use a standard screwdriver UTS screw termination UTS range UTS discrete wire sealing See page 9 Sealed: IP68/69K UV resistant UL/IEC compliant Corrosion-proof Plastic housing UTS Series Plug Corrosion-proof Plastic housing UTS Hi seal Sealed Unmated Sealed unmated: IP68/69K MIL-C-26482 compatible UV resistant UL/IEC compliant Screw termination contact Solder contact Crimp contact • machined • stamped and formed • coaxial • fibre optics UTS Series Overview © 2011 – SOURIAU 9 overview Metal hold down clips - to lock the connector easily on the PCB and to release stress on solder joints - suitable for soldering in a metalised hole Pre-assembled PCB contacts - machined or stamped versions available - different solder tails lengths possible - different plating options Low profi le housing to limit space between panel and PCB Stand-offs to allow cleaning after soldering UTS PCB contacts Receptacle No fi ller plug needed Grommet Containment ring Backnut or Easy handling backshell UTS discrete wire sealing Double Sealing UTS Series Overview Overview 10 © 2011 – SOURIAU General technical Mechanical • Durability: 250 matings & unmatings per MIL-C-26482 • Vibration resistance (all UTS versions except UTS Screw termination contacts): Sinusoidal vibrations per CEI 60512-4 - from 10 to 2000 Hz • Thermal shock: 5 cycles 30 min. from -40°C to 105°C per MIL-STD1344 method 1003 Environmental • Operating temperature: from -40°C to +105°C 40/100/21 per NFF 61-030 • Flammability rating: UL94-V0 (all UTS except the Hi seal) - see page 165 UL94-HB (UTS Hi seal only) - see page 165 I2F3 according to NFF 16101 and NFF 16102 • Salt spray: 500 hours • UV resistant: No mechanical degradation or important variation of colour after 5 years of exposure in natural environment (equivalence exposure to sun and moisture as per ISO4892) • Sealing: - UTS Standard: IP68/IP69K (mated) - UTS Hi seal: IP68/IP69K (mated and unmated) - UTS Discrete wire sealing: IP67/69K (up to IP68 with easy handling backshell) - UTS Screw termination contacts: IP68/IP69K Note: IPx8: 10m underwater during 1 week • Fluid resistance: - Gasoil - Mineral oil - Acid bath - Basic bath 1 2 3 4 5 1 3 UTS Series Overview © 2011 – SOURIAU 11 characteristics Material • Body connector + Backshell: Thermoplastic • Insert: - UTS Standard, UTS Discrete wire sealing, UTS Screw termination contacts: Thermoplastic - UTS Hi seal handsolder & UTS Hi seal with PC tails contacts: Elastomer • Contacts: See page 140 • Nut: Metal • Halogen free • RoHS compliant & conform to the Chinese standard SJ/T1166-2006 (Chinese RoHS equivalent) • In accordance with: - UL 1977: Certifi cat ECBT2 File number: E169916 - CSA C22.2 n°182.3: Certifi cat ECBT8 File number: E169916 Electrical • See each layout page 1 2 4 5 UTS Series Overview Overview UTS Series © 2011 – SOURIAU 13 UTS Series Mechanics Cable assembly ................................................................................................. 14 2 contacts 8E2/8D2: 7A 32V ............................................................................................. 20 12E2/12D2: 16A 150V ............................................................................................ 24 2 contacts + ground 103: 16A 300V ............................................................................................ 28 142G1: 40A 300V ............................................................................................ 32 3 contacts 8E3/8D3: 7A 32V ............................................................................................. 36 8E3A/8E98 8D3A/8D98: 7A 50V ............................................................................................. 40 8E33/8D3.: 7A 50V ............................................................................................. 44 12E3/12D3: 16A 150V ............................................................................................ 48 3 contacts + ground 124 - 12E4/12D4: 16A 300V ............................................................................................ 52 183G1: 32A 300V ............................................................................................ 56 4 contacts 8E4/8D4: 7A 32V ............................................................................................. 60 102W2: 25A 150V ............................................................................................ 64 104: 13A 150V ............................................................................................ 68 5 contacts 14E5/14D5: 16A 150V ............................................................................................ 72 6 contacts 103W3: 5A 32V ............................................................................................. 76 106 - 10E6/10D6: 7A 32V ............................................................................................. 80 10E98/10D98: 7A 50V ............................................................................................. 84 6 contacts + ground 147 - 14E7: 16A 300V ............................................................................................ 88 7 contacts 10E7/10D7: 7A 50V ............................................................................................. 92 8 contacts 128: 10A 80V ............................................................................................. 96 12E8/12D8: 6A 32V ............................................................................................. 100 10 contacts 1210 - 12E10/12D10: 6A 50V ............................................................................................. 104 12 contacts 1412: 10A 63V ............................................................................................. 108 14E12/14D12: 4A 50V ............................................................................................. 112 14 contacts 12E14/12D14: 5A 32V ............................................................................................. 116 15 contacts 14E15/14D15: 4A 50V ............................................................................................. 120 18 contacts 14E18/14D18: 5A 50V ............................................................................................. 124 19 contacts 1419 - 14E19/14D19: 5A 32V ............................................................................................. 128 23 contacts 1823: 9A 63V ............................................................................................. 132 32 contacts 1832: 4A 32V ............................................................................................. 136 14 © 2011 – SOURIAU OUTDOOR (black outer jacket) INDOOR Cable assembly Souriau provides connectors in various applications for more than 90 years in the most extreme environment. Being conscious about the diffi culty to fi nd a quick and a reliable harness manufacturer, we decided years ago to start in house cable assembly production. It allows customers to reduce the number of suppliers, and to take advantage of the "best in class" quality of the Souriau group. Overmoulding is a process that further enhances the sealing properties of the UTS range, especially over many years of use. Overmoulding provides the opportunity to change the cable exit from straight through 90 degrees and avoid any stress on the cable terminated to the connector. Also, as the wires are encapsulated inside the moulding, a barrier is created which prevents from any liquid from entering the equipment through the connector if the cable jacket is breached. UV resistance Ambient temperature PVC PUR PTFE FEP SILICON TPE 70°C Static installation Static installation Static installation Static installation Static installation Static or dynamic installation Wet Cleaner, Immerged chlorine 90°C 180°C 205°C 260°C Chemical agression How to choose the outer jacket material UTS Series Mechanics © 2011 – SOURIAU 15 Overmolding description Discrete connector Overmoulded connector Compound Thermoplastic insert O ring Overmolding adapter PVC or PUR overmolding ...water ingress unhampered, leading to damage. ...prevents water ingress via capillary action. If cable jacket is breached... If cable jacket is breached...   UTS Series Mechanics Mechanics 16 © 2011 – SOURIAU UTS Series Mechanics Harnesses Overmoulded harnesses, straight ending Connector type Number of ways Voltage Current UL Current IEC Harmonised cable part number* Part number (length: 1m.) Male Female UTS standard 2+PE 600 V 44 A 40 A HO5 VV - F 3Gg10 HAUTS0V142G1PST100 HAUTS0V142G1SST100 2+PE 500 V 10 A 16 A HO5 VV - F 3x1.5 HAUTS0V103PST100 HAUTS0V103SST100 3+PE 500 V 10 A 16 A HO5 VV - F 3G1.5 HAUTS0V103PEPST100 HAUTS0V103PESST100 3+PE 250 V 24 A 32 A HO5 VV - F 40G0.5 HAUTS0V183G1PST100 HAUTS0V183G1SST100 3+PE 500 V 10 A 16 A HO5 VV - F 4G1.5 HAUTS0V124PEPST100 HAUTS0V124PESST100 4 500 V 10 A 13 A HO5 VV - F 4x1.5 HAUTS0V104PST100 HAUTS0V104SST100 3 500 V 10 A 5 A HO5 VV - F 7G0.5 HAUTS0V103W3PST100 HAUTS0V103W3SST100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V106PST100 HAUTS0V106SST100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V147PEPST100 HAUTS0V147PESST100 8 500 V 10 A 10 A HO5 VV - F 8x1.5 HAUTS0V128PST100 HAUTS0V128SST100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V1210PST100 HAUTS0V1210SST100 12 500 V 10 A 10 A HO5 VV - F 12x1.5 HAUTS0V1412PST100 HAUTS0V1412SST100 19 250 V 5 A 5 A HO5 VV - F 21G0.5 HAUTS0V1419PST100 HAUTS0V1419SST100 23 500 V 10 A 9 A HO5 VV - F 25G1.5 HAUTS0V1823PST100 HAUTS0V1823SST100 32 250 V 5 A 4 A HO5 VV - F 40G0.5 HAUTS0V1832PST100 HAUTS0V1832SST100 UTS Hi seal 2 250 V 7 A 7 A H05 VV - F 2x0.5 HAUTS0V8E2PST100 HAUTS0V8E2SST100 2 650 V 13 A 16 A HO5 VV - F 2x1.5 HAUTS0V12E2PST100 HAUTS0V12E2SST100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3PST100 HAUTS0V8E3SST100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3APST100 HAUTS0V8E3ASST100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E33PST100 HAUTS0V8E33SST100 3 650 V 13 A 16 A HO5 VV - F 3x1.5 HAUTS0V12E3PST100 HAUTS0V12E3SST100 4 250 V 7 A 7 A HO5 VV - F 4x0.5 HAUTS0V8E4PST100 HAUTS0V8E4SST100 5 650 V 12 A 16 A HO5 VV - F 4G1.5 HAUTS0V14E5PST100 HAUTS0V14E5SST100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E6PST100 HAUTS0V10E6SST100 6 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E98PST100 HAUTS0V10E98SST100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V14E7PEPST100 HAUTS0V14E7PESST100 7 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E7PST100 HAUTS0V10E7SST100 8 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E8PST100 HAUTS0V12E8SST100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E10PST100 HAUTS0V12E10SST100 12 250 V 5 A 4 A HO5 VV - F 12G0.5 HAUTS0V14E12PST100 HAUTS0V14E12SST100 14 250 V 5 A 5 A HO5 VV - F 14G0.5 HAUTS0V12E14PST100 HAUTS0V12E14SST100 15 650 V 12 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E15PST100 HAUTS0V14E15SST100 18 250 V 4 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E18PST100 HAUTS0V14E18SST100 19 250 V 4 A 5 A HO5 VV - F 40G0.5 HAUTS0V14E19PST100 HAUTS0V14E19SST100 * see page 18 3 m & 5 m version available on demand Eg: 3m HAUTS0V...300 5m HAUTS0V...500 © 2011 – SOURIAU 17 UTS Series Mechanics Harnesses Overmoulded harnesses, right angle ending Connector type Number of ways Voltage Current UL Current IEC Harmonised cable part number* Part number (length: 1m.) Male Female UTS standard 2+PE 600 V 44 A 40 A HO5 VV - F 3Gg10 HAUTS0V142G1PRA100 HAUTS0V142G1SRA100 2+PE 500 V 10 A 16 A HO5 VV - F 3x1.5 HAUTS0V103PRA100 HAUTS0V103SRA100 3+PE 500 V 10 A 16 A HO5 VV - F 3G1.5 HAUTS0V183G1PRA100 HAUTS0V183G1SRA100 3+PE 250 V 24 A 32 A HO5 VV - F 40G0.5 HAUTS0V183G1PRA100 HAUTS0V183G1SRA100 3+PE 500 V 10 A 16 A HO5 VV - F 4G1.5 HAUTS0V124PEPRA100 HAUTS0V124PESRA100 4 500 V 10 A 13 A HO5 VV - F 4x1.5 HAUTS0V104PRA100 HAUTS0V104SRA100 3 500 V 10 A 5 A HO5 VV - F 7G0.5 HAUTS0V103W3PRA100 HAUTS0V103W3SRA100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V106PRA100 HAUTS0V106SRA100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V147PEPRA100 HAUTS0V147PESRA100 8 500 V 10 A 10 A HO5 VV - F 8x1.5 HAUTS0V128PRA100 HAUTS0V128SRA100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V1210PRA100 HAUTS0V1210SRA100 12 500 V 10 A 10 A HO5 VV - F 12x1.5 HAUTS0V1412PRA100 HAUTS0V1412SRA100 19 250 V 5 A 5 A HO5 VV - F 21G0.5 HAUTS0V1419PRA100 HAUTS0V1419SRA100 23 500 V 10 A 9 A HO5 VV - F 25G1.5 HAUTS0V1823PRA100 HAUTS0V1823SRA100 32 250 V 5 A 4 A HO5 VV - F 40G0.5 HAUTS0V1832PRA100 HAUTS0V1832SRA100 UTS Hi seal 2 250 V 7 A 7 A H05 VV - F 2x0.5 HAUTS0V8E2PRA100 HAUTS0V8E2SRA100 2 650 V 13 A 16 A HO5 VV - F 2x1.5 HAUTS0V12E2PRA100 HAUTS0V12E2SRA100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3PRA100 HAUTS0V8E3SRA100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3APRA100 HAUTS0V8E3ASRA100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E33PRA100 HAUTS0V8E33SRA100 3 650 V 13 A 16 A HO5 VV - F 3x1.5 HAUTS0V12E3PRA100 HAUTS0V12E3SRA100 4 250 V 7 A 7 A HO5 VV - F 4x0.5 HAUTS0V8E4PRA100 HAUTS0V8E4SRA100 5 650 V 12 A 16 A HO5 VV - F 4G1.5 HAUTS0V14E5PRA100 HAUTS0V14E5SRA100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E6PRA100 HAUTS0V10E6SRA100 6 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E98PRA100 HAUTS0V10E98SRA100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V14E7PEPRA100 HAUTS0V14E7PESRA100 7 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E7PRA100 HAUTS0V10E7SRA100 8 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E8PRA100 HAUTS0V12E8SRA100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E10PRA100 HAUTS0V12E10SRA100 12 250 V 5 A 4 A HO5 VV - F 12G0.5 HAUTS0V14E12PRA100 HAUTS0V14E12SRA100 14 250 V 5 A 5 A HO5 VV - F 14G0.5 HAUTS0V12E14PRA100 HAUTS0V12E14SRA100 15 650 V 12 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E15PRA100 HAUTS0V14E15SRA100 18 250 V 4 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E18PRA100 HAUTS0V14E18SRA100 19 250 V 4 A 5 A HO5 VV - F 40G0.5 HAUTS0V14E19PRA100 HAUTS0V14E19SRA100 * see page 18 3 m & 5 m version available on demand Eg: 3m HAUTS0V...300 5m HAUTS0V...500 Mechanics 18 © 2011 – SOURIAU UTS Series Mechanics Standardization of European cable - DIN VDE 0281/DIN VDE 0282/DIN VDE 0292 1. Basic type 2. Working voltage 3. Insulating 4. Sheathcladding material 5. Special features 6. Conductor types 7. Number of conductors 8. Protective conductor 9. Conductor crosssectional H: Harmonized Type 03: 300/300 V. V: PVC V: PVC H: Ribbon cable, separable U: Single wire X: Without protective conductor Area specifi ed in mm2 A: National Type 05: 300/500 V. R: Rubber R: Rubber H2: Ribbon cable non-separable R: Multi-wire G: With protective conductor 07: 450/750 V. S: Silicone Rubber N: Cloroprene Rubber K: Fine wire (permanently installed) J: Glass-fi lament braiding F: Fine wire (fl exible) T: Textile braiding H: Super fi ne wire Y: Tinsel strand 1 2 3 4 5 6 7 8 9 Harmonized wire coding system Example: Harmonized type, 300/500V, PVC insulating, PVC sheath- cladding, Fine wire, 3x1.5 cross-sectional: H05VVF3x1.5 Cable information Range of temperature: Occasional fl exing: -5°C up to +70°C Fixed installation: -40°C up to +80°C Rated voltage: U0/U: 300/500 V Wire section : Arrangement with #16 contact: wire section 1.5 mm² Arrangement with #20 contact: wire section 0.5 mm² Harmonized reference: H05 VVF XX © 2011 – SOURIAU 19 UTS Series Mechanics Standardization of American cable Nomenclature Key Defi nitions of Cable Types S: Service Grade (also means extra hard service when not followed by J, V, or P) J: Hard Service V: Vacuum cleaner cord (also light duty cable) P: Parallel cord (also known as zip cord) – Always light duty E: Thermoplastic Elastomer (UL/NEC designation ONLY) O: Oil Resistant* T: Thermoplastic W: Outdoor-includes sunlight resistant jacket and wet location rated conductors (formerly "W-A") H: Heater cable VW-1: Flame retardant FT2: Flame retardant SVT: Thermoplastic insulated vacuum cleaner cord, with or without 3rd conductor for grounding purposes; 300V. (PVC) SJT: Junior hard service, thermoplastic insulated conductors and jacket. 300V. (PVC) SJTW: Same as SJT except outdoor rated. (PVC) SJTO: Same as SJT but oil resistant outer jacket. (PVC) SJTOW: Same as SJTO except outdoor rated. (PVC) ST: Hard service cord with all thermoplastic construction, 600V. (PVC) STW: Same as ST except outdoor rated. (PVC) STO: Same as ST but with oil resistant outer jacket. (PVC) STOW: Same as STO except outdoor rated. (PVC) Mechanics 20 © 2011 – SOURIAU OR OR WITH Layout Specifi cations UTS Series 8E2/8D2 Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E2P UTS08E2S Plug Without (Fig.6) UTS68E2P UTS68E2S Cable gland (Fig.7) UTS6JC8E2P UTS6JC8E2S Jam nut receptacle Without (Fig.3) UTS78E2P UTS78E2S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D2P UTS08D2S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D2P32 UTS78D2S32 Jam nut receptacle with stand off and withouthold down clip Without (Fig.4) UTS78D2P UTS78D2S Sealed unmated © 2011 – SOURIAU 21 Dimensions Note: all dimensions are in mm UTS Series 8E2/8D2 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 7.5 7.8 Fig. 1 Fig. 2 Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Plug - UTS6 25.3 54 Fig. 7 Fig. 6 Ø22.5 Mated connector length 61.1 66.6 UTS7 UTS0 Drilling pattern 1.5 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.5 Panel cut out 15.3 15.3 Ø3.3 Square fl ange receptacle - UTS0 Jam nut receptacle - UTS7 13.7 14.6 Front mounting Ø12.5 Rear mounting Ø14.5 Mechanics 2 contacts 7A/32V per IEC 61984 22 © 2011 – SOURIAU Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 32V 1.5kV 3 UTS 8E2/8D2 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR UTS Series 8E2/8D2 Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket Current use Limited use Not recommended use © 2011 – SOURIAU 23 UTS Series 8E2/8D2 Mechanics 24 © 2011 – SOURIAU OR WITH OR Layout UTS Series 12E2/12D2 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS012E2P UTS012E2S Plug Without (Fig.6) UTS612E2P UTS612E2S Cable gland (Fig.7) UTS6JC12E2P UTS6JC12E2S Jam nut receptacle Without (Fig.3) UTS712E2P UTS712E2S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS012D2P UTS012D2S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS712D2P32 UTS712D2S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS712D2P UTS712D2S Sealed unmated © 2011 – SOURIAU 25 UTS Series 12E2/12D2 Dimensions Note: all dimensions are in mm 2 contacts 16A/150V per IEC 61984 Square fl ange receptacle - UTS0 Front view 11.7 11.7 26.4 Ø19 Ø19 20.8 2.4 2.4 Ø3.2 7.5 7.5 7.8 Fig. 1 Fig. 2 Plug - UTS6 Mated connector length 25.3 66.7 75.3 81.7 Fig. 7 Fig. 6 Ø30.1 UTS7 UTS0 Panel cut out Drilling pattern 20.8 15.3 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 2.3 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.3 1.4 Square fl ange receptacle - UTS0 22° Front mounting Ø18.3 Rear mounting Ø22.3 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 18 18 Ø19 Ø19 Ø19 3.5 3.5 3.5 3 3 3 4.2 Fig. 3 Fig. 4 Fig. 5 Mechanics 26 © 2011 – SOURIAU Metal terminal UTS Series 12E2/12D2 Accessories Metal terminal 0 20 40 60 80 100 120 0 10 20 30 Current (A) Ambient Operating Temperature (°C) Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Electrical characteristics UL 13A 650V UL94 HB CSA 13A 650V UL94 HB IEC 16A 150V 2.5kV 3 UTS 12E2/12D2 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use © 2011 – SOURIAU 27 UTS Series 12E2/12D2 Mechanics 28 © 2011 – SOURIAU OR OR WITH Layout UTS Series 103 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 31 Free hanging receptacle Cable gland (Fig.1) UTS1JC103P UTS1JC103S Plug Without (Fig.2) UTS6103P UTS6103S Cable gland (Fig.3) UTS6JC103P UTS6JC103S PCB contacts supply separately see page 31 Jam nut receptacle Without (Fig.4) UTS7103P UTS7103S © 2011 – SOURIAU 29 UTS Series 103 Dimensions Note: all dimensions are in mm 2 + ground 16A/300V per IEC 61984 Free hanging - UTS1 70 Ø15.1 Fig. 1 Mated connector length - UTS7 77.3 Jam nut receptacle - UTS7 Fig. 4 18.3 12.3 27.2 22.5 Ø15.1 3.5 Panel cut out Drilling pattern Jam nut receptacle - UTS7 16.7 17.9 2.6 2.6 1.5 3 Plug - UTS6 Female Male Fig. 2 Fig. 3 33 63.2 25.3 Ø26.2 Ø26.2 Mechanics 30 © 2011 – SOURIAU UTS Series 103 Accessories and tooling Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J (1): example of plating, for other plating see UTS catalog page 143 Jam nut sealing caps Metal terminal Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Part number UTS610DCG Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG G for Green Y for Yellow R for Red Handle Tool kit Part number TOOLKIT Part number SHANDLES © 2011 – SOURIAU 31 Contacts UTS Series 103 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 16A 300V 4kV 3 Temperature elevation: 50°C Electrical characteristics UTS 103 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 2 + ground 16A/300V per IEC 61984 32 © 2011 – SOURIAU OR WITH OR OR UTS Series 142G1 Specifi cations Layout Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supplied separately see page 35 Square fl ange receptacle Without (Fig. 1) UTS0142G1P Free hanging receptacle Cable gland (Fig. 6) UTS1JC142G1P UTS1JC142G1S Plug Without (Fig. 3) UTS6142G1P UTS6142G1S Cable gland (Fig. 4) UTS6JC142G1P UTS6JC142G1S Jam nut receptacle Without (Fig. 2) UTS7142G1P UTS7142G1S NPT threaded receptacle Without (Fig. 5) UTS7142G1SNPT © 2011 – SOURIAU 33 UTS Series 142G1 NPT threaded receptacle - UTS7 Dimensions Note: all dimensions are in mm Plug - UTS6 Female Male Fig. 3 Fig. 4 33 70 25.3 Ø31.5 Ø35.1 Square fl ange receptacle - UTS0 Free hanging - UTS1 70 Ø31.5 Fig. 6 Jam nut receptacle - UTS7 Fig. 2 18 1.6 35.1 30.4 Ø22.3 3.5 Panel cut out Jam nut receptacle - UTS7 24.15 25.55 Drilling pattern 3.6 3.6 2.1 4.2 Fig. 5 25.4 25.4 35.3 Ø22.3 23.1 NPT - 1/2˝ 11.7 Ø19 2.4 7.5 Fig. 1 20.8 26.4 Ø3.2 Fig. 1 Front view Mechanics 2 + ground 40A/300V per IEC 61984 34 © 2011 – SOURIAU UTS Series 142G1 Accessories and tooling Jam nut sealing caps Metal terminal Part number UTS14DCG Part number UTS14DCGR Hand tool Part number M317 Positioner + locator setting Part number VGE10078A Extraction tool Part number 51060210936 Plug sealing cap Part number UTS614DCG Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red © 2011 – SOURIAU 35 UL 44A 600V UL94 V-0 CSA 30A 600V UL94 V-0 IEC 40A 300V 4kV 3 Electrical characteristics UTS 142G1 derating curves Current use Limited use Not recommended use UTS Series 142G1 Test conditions Contact used: Machined contacts Wires used: 8.37mm² 0 20 40 60 80 100 120 0 10 15 20 25 30 35 40 45 50 Current (A) Ambient Operating Temperature (°C) 5 Contacts #8 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 16 82913601A(1) 82913600A(1) - 6.5 14 82913603A(1) 82913602A(1) - 12 82913605A(1) 82913604A(1) - 10 82913607A(1) 82913606A(1) - 8 82913609A(1) 82913608A(1) - (1): Example of plating, for other plating see page 143 Mechanics 2 + ground 40A/300V per IEC 61984 36 © 2011 – SOURIAU OR WITH OR UTS Series 8E3/8D3 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E3P UTS08E3S Plug Without (Fig.6) UTS68E3P UTS68E3S Cable gland (Fig.7) UTS6JC8E3P UTS6JC8E3S Jam nut receptacle Without (Fig.3) UTS78E3P UTS78E3S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D3P UTS08D3S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D3P32 UTS78D3S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D3P UTS78D3S Layout Sealed unmated © 2011 – SOURIAU 37 UTS Series 8E3/8D3 Dimensions Note: all dimensions are in mm 3 contacts 7A/32V per IEC 61984 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Plug - UTS6 25.3 54 Fig. 7 Fig. 6 Ø22.5 Mated connector length 61.1 66.6 UTS7 UTS0 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.6 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.6 1.9 0.9 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Mechanics 38 © 2011 – SOURIAU UTS 8E3/8D3 derating curves UTS Series 8E3/8D3 Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 32V 1.5kV 3 Current use Limited use Not recommended use © 2011 – SOURIAU 39 UTS Series 8E3/8D3 Mechanics 40 © 2011 – SOURIAU OR WITH OR UTS Series 8E3A/8E98 - 8D3A/8D98 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E3AP UTS08E3AS UTS08E98P UTS08E98S Plug Without (Fig.6) UTS68E3AP UTS68E3AS UTS68E98P UTS68E98S Cable gland (Fig.7) UTS6JC8E3AP UTS6JC8E3AS UTS6JC8E98P UTS6JC8E98S Jam nut receptacle Without (Fig.3) UTS78E3AP UTS78E3AS UTS78E98P UTS78E98S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D3AP UTS08D3AS UTS08D98P UTS08D98S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D3AP32 UTS78D3AS32 UTS78D98P32 UTS78D98S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D3AP UTS78D3AS UTS78D98P UTS78D98S Layout Sealed unmated © 2011 – SOURIAU 41 UTS Series 8E3A/8E98 - 8D3A/8D98 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3 18 Ø12 3.5 3 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.6 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.6 1.9 0.9 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Plug - UTS6 Mated connector length 25.3 54 Fig. 7 Fig. 6 Ø22.5 66.6 UTS7 UTS0 61.1 Mechanics 3 contacts 7A/50V per IEC 61984 42 © 2011 – SOURIAU UTS Series 8E3A/8E98 - 8D3A/8D98 UTS 8E3A/98 - 8D3A/98 derating curves Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 Test conditions Contact used: Machined contacts Wires used: 0.518mm² © 2011 – SOURIAU 43 UTS Series 8E3A/8E98 - 8D3A/8D98 Mechanics 44 © 2011 – SOURIAU OR WITH OR UTS Series 8E33/8D33 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E33P UTS08E33S Plug Without (Fig.6) UTS68E33P UTS68E33S Cable gland (Fig.7) UTS6JC8E33P UTS6JC8E33S Jam nut receptacle Without (Fig.3) UTS78E33P UTS78E33S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D33P UTS08D33S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D33P32 UTS78D33S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D33P UTS78D33S Layout Sealed unmated © 2011 – SOURIAU 45 UTS Series 8E33/8D33 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Plug - UTS6 Mated connector length 25.3 54 61.1 66.6 Fig. 7 UTS7 Fig. 6 Ø22.5 UTS0 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.6 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.6 1.9 0.9 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Mechanics 3 contacts 7A/50V per IEC 61984 46 © 2011 – SOURIAU UTS Series 8E33/8D33 UTS 8E33/8D33 de-rating curves Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 © 2011 – SOURIAU 47 UTS Series 8E33/8D33 Mechanics 48 © 2011 – SOURIAU UTS Series 12E3/12D3 OR WITH Specifi cations OR Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E3P UTS012E3S Plug Without (Fig.1) UTS612E3P UTS612E3S Cable gland (Fig.2) UTS6JC12E3P UTS6JC12E3S Jam nut receptacle Without (Fig.3) UTS712E3P UTS712E3S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D3P UTS012D3S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS712D3P32 UTS712D3S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS712D3P UTS712D3S Layout Sealed unmated © 2011 – SOURIAU 49 UTS Series 12E3/12D3 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19 3.5 3 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø19 3.5 3 18 Ø19 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 66.7 Ø30.1 Ø30.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19 2.4 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 2.3 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.3 2.8 1.4 Square fl ange receptacle - UTS0 22° Front mounting Ø18.3 Rear mounting Ø22.3 7 Mechanics 3 contacts 16A/150V per IEC 61984 50 © 2011 – SOURIAU UTS Series 12E3/12D3 Metal terminal Accessories Metal terminal Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Electrical characteristics UL 13A 650V UL94 HB CSA 13A 650V UL94 HB IEC 16A 150V 2.5kV 3 UTS 12E3/12D3 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 10 30 Current (A) Ambient Operating Temperature (°C) 20 © 2011 – SOURIAU 51 UTS Series 12E3/12D3 Mechanics 52 © 2011 – SOURIAU OR OR WITH OR UTS Series 124 - 12E4/12D4 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 55 Square fl ange receptacle Without (Fig.1) UTS0124P Jam nut receptacle Without (Fig.5) UTS7124P UTS7124S Free hanging receptacle Cable gland (Fig.13) UTS1JC124P UTS1JC124S Plug Without (Fig.11) UTS6124P UTS6124S Cable gland (Fig.12) UTS6JC124P UTS6JC124S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.3) UTS012E4P UTS012E4S Jam nut receptacle Without (Fig.10) UTS712E4P UTS712E4S Plug Without (Fig.11) UTS612E4P UTS612E4S Plug Cable gland (Fig.12) UTS6JC12E4P UTS6JC12E4S Screw contacts loaded Jam nut receptacle Without (Fig.7 & 8) UTS7124PSCR UTS7124SSCR Plug Without (Fig.11) UTS6124PSCR UTS6124SSCR Cable gland (Fig.12) UTS6JC124PSCR UTS6JC124SSCR Free hanging receptacle Cable gland (Fig.13) UTS1JC124PSCR PCB contacts supply separately see page 55 Square fl ange receptacle Without (Fig.4) UTS0124P Jam nut receptacle Without (Fig.6) UTS7124P UTS7124S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS012D4P UTS012D4S Jam nut receptacle with stand off and without hold down clip Without (Fig.9) UTS712D4P UTS712D4S Jam nut receptacle with stand off and with hold down clips Without (Fig.9) UTS712D4P32 UTS712D4S32 Layout Sealed unmated © 2011 – SOURIAU 53 UTS Series 124 - 12E4/12D4 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Hold down clip Male Female Fig. 6 Fig. 8 Fig. 10 Front view Fig. 5 Fig. 7 Fig. 9 31.9 18 18 18 27.2 Ø19 Ø19 Ø19 3.5 3.5 3.5 2.4 2.4 4.2 3 Square fl ange receptacle - UTS0 11.7 11.7 11.7 Ø19 Ø19 Ø19 20.8 26.4 2.4 2.4 4 2.4 7.5 9.1 7.5 Ø3.2 Fig. 3 Fig. 4 Front view Fig. 2 Fig. 1 7.5 7.8 Free hanging - UTS1 / Plug - UTS6 Mated connector length 25.3 74 66.7 Fig. 13 Fig. 11 Fig. 12 Ø30.1 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Front mounting Ø18.3 Ø3.3 Rear mounting Ø22.3 Jam nut receptacle - UTS7 21.4 22.7 3.1 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 3.1 3.1 3.1 Square fl ange receptacle - UTS0 22° Mechanics 3 + ground 16A/300V per IEC 61984 54 © 2011 – SOURIAU Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red UTS Series 124 - 12E4/12D4 Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Color coding rings Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 55 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 16A 300V 4kV 3 Temperature elevation: 50°C UTS Series 124 - 12E4/12D4 0 20 40 60 80 100 120 0 10 30 Current (A) Ambient Operating Temperature (°C) 20 18 15 13 28 25 23 8 5 3 Contacts Electrical characteristics UTS 124 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 3 + ground 16A/300V per IEC 61984 56 © 2011 – SOURIAU WITH Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 59 NPT threaded receptacle Without (Fig.1) UTS7183G1SNPT Plug Without (Fig.2) UTS6183G1P Plug Cable gland (Fig.3) UTS6JC183G1P Layout UTS Series 183G1 © 2011 – SOURIAU 57 Dimensions UTS Series 183G1 Note: all dimensions are in mm NPT threaded receptacle - UTS7 17.3 14.5 31.8 NPT - 3/4˝ Ø28.6 Ø19.6 Fig. 1 Plug - UTS6 Fig. 2 Fig. 3 37.5 81.3 Ø42 Ø42 Mated connector length - UTS6JC 90.5 Drilling pattern 5.1 5.1 5.1 5.1 Mechanics 3 + ground 32A/300V per IEC 61984 58 © 2011 – SOURIAU Accessories and tooling Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red UTS Series 183G1 Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Hand tool Part number M317 Positioner + locator setting Part number VGE10078A Extraction tool Part number 51060210936 Part numbers Receptacle cap Plug cap 85005590A 85005599 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Plug sealing cap Part number UTS614DCG © 2011 – SOURIAU 59 UL 23A 600V UL94 V-0 CSA 23A 600V UL94 V-0 IEC 32A 300V 4kV 3 Electrical characteristics UTS 183G1 derating curves Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 8.37mm² UTS Series 183G1 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 Current (A) Ambient Operating Temperature (°C) Contacts #8 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 16 82913601A(1) 82913600A(1) - 6.5 14 82913603A(1) 82913602A(1) - 12 82913605A(1) 82913604A(1) - 10 82913607A(1) 82913606A(1) - 8 82913609A(1) 82913608A(1) - (1): Example of plating, for other plating see page 143 Mechanics 3 + ground 32A/300V per IEC 61984 60 © 2011 – SOURIAU OR OR WITH UTS Series 8E4/8D4 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E4P UTS08E4S Plug Without (Fig.6) UTS68E4P UTS68E4S Cable gland (Fig.7) UTS6JC8E4P UTS6JC8E4S Jam nut receptacle Without (Fig.3) UTS78E4P UTS78E4S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D4P UTS08D4S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D4P32 UTS78D4S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D4P UTS78D4S Layout Sealed unmated © 2011 – SOURIAU 61 UTS Series 8E4/8D4 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Plug - UTS6 Mated connector length 25.3 54 Fig. 7 Fig. 6 Ø22.5 61.1 66.6 UTS7 UTS0 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.4 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.4 1.4 1.4 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Mechanics 4 contacts 7A/32V per IEC 61984 62 © 2011 – SOURIAU UTS Series 8E4/8D4 UTS 8E4/8D4 derating curves Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 32V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 16 18 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 63 UTS Series 8E4/8D4 Mechanics 64 © 2011 – SOURIAU WITH UTS Series 102W2 (2x#12 + 2x#20) Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 67 Free hanging receptacle Cable gland (Fig.1) UTS1JC102W2P UTS1JC102W2S Plug Without (Fig.2) UTS6102W2P UTS6102W2S Plug Cable gland (Fig.3) UTS6JC102W2P UTS6JC102W2S Jam nut receptacle Without (Fig.4) UTS7102W2P UTS7102W2S Layout © 2011 – SOURIAU 65 UTS Series 102W2 (2x#12 + 2x#20) Dimensions Note: all dimensions are in mm Free hanging - UTS1 70 Ø15.1 Fig. 1 Plug - UTS6 Fig. 2 Male Fig. 2 Female Fig. 3 33 63.2 Ø26.2 Ø26.2 Ø26.2 25.3 Panel cut out Drilling pattern Jam nut receptacle - UTS7 16.7 17.9 3 3 3 3 Jam nut receptacle - UTS7 Mated connector length - UTS7 Fig. 4 18.3 27.2 22.5 Ø15.1 3.5 2.4 77.3 Mechanics 4 contacts 25A/150V per IEC 61984 66 © 2011 – SOURIAU UTS Series 102W2 (2x#12 + 2x#20) Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Part number UTS610DCG Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Accessories and tooling Crimp tooling #20 Crimp tooling #12 Part number TOOLKIT Part number extraction tool 51060210924 (1): example of plating, for other plating see UTS catalog page 148 (2): contact reeled (3): loose contact Part number SHANDLES Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Part number positioner + locator setting VGE10078A Part number hand tool M317 © 2011 – SOURIAU 67 UTS Series 102W2 (2x#12 + 2x#20) Contacts #20 Contact type AWG Part number Max insulator Ø Male Female Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) 1.58 22-20 RM20W3K(1) RC20W3K(1) 1.58 20-18 RM18W3K(1) RC18W3K(1) 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) 0.89-1.58 26-24 SM24W3S26(2) SC24W3S25(2) 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) 1.17-2.08 22-20 SM20W3S26(2) SC20W3S25(2) 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 1) E l f l ti f th l ti #12 Crimp Machined 22 82911457NA 82911456A 4.9 20 82911459NA 82911458A 18 82911461NA 82911460A 16 82911463NA 82911462A 14 82911465NA 82911464A 12 82911467NA 82911466A UL 20A 500V UL94 V-0 CSA 18A 500V UL94 V-0 IEC 25A 150V 2.5kV 3 Temperature elevation: 50°C Electrical characteristics UTS 102W2 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 Current (A) Ambient Operating Temperature (°C) Mechanics 4 contacts 25A/150V per IEC 61984 68 © 2011 – SOURIAU OR OR OR WITH OR UTS Series 104 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contact supply separately see next page 71 Square fl ange receptacle Without (Fig.1) UTS0104P UTS0104S Free hanging receptacle Cable gland and grommet (Fig.2) UTS1GJC104P Free hanging receptacle Nut and grommet (Fig.3) UTS1GN104P Free hanging receptacle Cable gland (Fig.2) UTS1JC104P UTS1JC104S Plug Without (Fig.4) UTS6104P UTS6104S Plug Cable gland and grommet (Fig.5) UTS6GJC104S Plug Nut and grommet (Fig.6) UTS6GN104S Plug Cable gland (Fig.5) UTS6JC104P UTS6JC104S Jam nut receptacle Without (Fig.7) UTS7104P UTS7104S Jam nut receptacle Cable gland and grommet (Fig.9) UTS7GJC104P Jam nut receptacle Nut and grommet (Fig.8) UTS7GN104P Layout © 2011 – SOURIAU 69 UTS Series 104 Dimensions Note: all dimensions are in mm Square fl ange receptacle - UTS0 Free hanging - UTS1 11.5 70 40.9 Ø15.1 Ø15.1 20.8 24 2.4 10.5 Ø3.2 Fig. 1 Front view Fig. 3 Fig. 2 Plug - UTS6 Female Male Fig. 4 Fig. 5 Fig. 6 33 63.2 32.5 25.3 Ø26.2 Ø26.2 Ø26.2 Panel cut out Drilling pattern 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 3 3 3 3 Front mounting Ø15.2 Rear mounting Ø17.9 Square fl ange receptacle - UTS0 Jam nut receptacle - UTS7 Mated connector length Fig. 7 Fig. 9 Fig. 8 18.3 18.3 41 70.7 Ø15.1 Ø15.1 3.5 3.5 2.4 70.9 77.3 UTS7 UTS0 Mechanics 4 contacts 13A/150V per IEC 61984 70 © 2011 – SOURIAU UTS Series 104 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Square fl ange sealing cap Part number UTS610DCG Part number UTS10DCGE Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 71 UTS Series 104 Contacts UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 13A 150V 2.5kV 3 Electrical characteristics UTS 104 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 4 contacts 13A/150V per IEC 61984 72 © 2011 – SOURIAU OR WITH OR UTS Series 14E5/14D5 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E5P UTS014E5S Plug Without (Fig.1) UTS614E5P UTS614E5S Cable gland (Fig.2) UTS6JC14E5P UTS6JC14E5S Jam nut receptacle Without (Fig.3) UTS714E5P UTS714E5S PCB contacts loaded Square fl ange receptacle Without (Fig.6) UTS014D5P UTS014D5S Jam nut receptacle with hold down clips Without (Fig.4) UTS714D5P32 UTS714D5S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D5P UTS714D5S Layout Sealed unmated © 2011 – SOURIAU 73 UTS Series 14E5/14D5 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Mated connector length 75 82 Square fl ange receptacle - UTS0 Fig. 6 11.3 Ø22.3 2.3 7.5 7.8 23.2 28.8 Ø3.2 Front view UTS7 UTS0 Panel cut out Drilling pattern 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 4 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.3 3.7 0.6 2.5 22° Front mounting Ø21.5 Rear mounting Ø25.1 Square fl ange receptacle - UTS0 Mechanics 5 contacts 16A/150V per IEC 61984 74 © 2011 – SOURIAU UTS Series 14E5/14D5 UTS 14E5/14D5 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 12A 650V UL94 HB CSA 12A 650V UL94 HB IEC 16A 150V 2.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 1.31mm² 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 16 18 Current (A) Ambient Operating Temperature (°C) Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red © 2011 – SOURIAU 75 UTS Series 14E5/14D5 Mechanics 76 © 2011 – SOURIAU UTS Series 103W3 (3x#16 + 3x#20) Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 79 Free hanging receptacle Cable gland (Fig.1) UTS1JC103W3P UTS1JC103W3S Plug Without (Fig.2) UTS6103W3P UTS6103W3S Plug Cable gland (Fig.3) UTS6JC103W3P UTS6JC103W3S Jam nut receptacle Without (Fig.4) UTS7103W3P UTS7103W3S PCB contacts supply separately see page 79 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS7103W3P UTS7103W3S OR WITH OR Layout © 2011 – SOURIAU 77 UTS Series 103W3 (3x#16 + 3x#20) Dimensions Note: all dimensions are in mm Plug - UTS6 Fig. 2 Male Fig. 2 Female Fig. 3 33 63.2 Ø26.2 Ø26.2 Ø26.2 25.3 Jam nut receptacle - UTS7 Mated connector length - UTS7 Fig. 4 18.3 27.2 22.5 Ø15.1 3.5 2.4 77.3 Panel cut out Drilling pattern 3 2.5 2.5 0.7 0.8 Jam nut receptacle - UTS7 16.7 17.9 Free hanging - UTS1 70 Ø15.1 Fig. 1 Mechanics 6 contacts 5A/32V per IEC 61984 78 © 2011 – SOURIAU UTS Series 103W3 (3x#16 + 3x#20) Accessories and tooling Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Square fl ange sealing cap Part number UTS610DCG Part number UTS10DCGE Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RCM RM/RC 20W3K(1) S20RCM RM/RC 18W3K(1) S20RCM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contac © 2011 – SOURIAU 79 UTS Series 103W3 (3x#16 + 3x#20) UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 5A 32V 1.5kV 3 Temperature elevation: 50°C Electrical characteristics UTS 103W3 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) Contacts 120 (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - plating L SM20ML1 #20 Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 Stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3S26(2) SC24W3S25(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3S26(2) SC20W3S25(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - Mechanics 6 contacts 5A/32V per IEC 61984 80 © 2011 – SOURIAU UTS Series 106 - 10E6/10D6 Specifi cations OR OR WITH OR Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 83 Free hanging receptacle Cable gland (Fig.1) UTS1JC106P UTS1JC106S Plug Without (Fig.2) UTS6106P UTS6106S Plug Cable gland (Fig.3) UTS6JC106P UTS6JC106S Jam nut receptacle Without (Fig.4) UTS7106P UTS7106S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.9) UTS010E6P UTS010E6S Plug Without (Fig.2) UTS610E6P UTS610E6S Cable gland (Fig.3) UTS6JC10E6P UTS6JC10E6S Jam nut receptacle Without (Fig.5) UTS710E6P UTS710E6S PCB contacts supply separately see page 83 Jam nut receptacle Without (Fig.4) UTS7106P UTS7106S PCB contacts loaded Square fl ange receptacle Without (Fig.8) UTS010D6P UTS010D6S Jam nut receptacle with stand off and with hold down clips Without (Fig.6) UTS710D6P32 UTS710D6S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.7) UTS710D6P UTS710D6S Layout Sealed unmated © 2011 – SOURIAU 81 UTS Series 106 - 10E6/10D6 Dimensions Note: all dimensions are in mm 6 contacts 7A/32V per IEC 61984 Free hanging - UTS1 70 Ø15.1 Fig. 1 Plug - UTS6 Female Male Fig. 2 Fig. 3 33 63.2 Ø26.2 Ø26.2 25.3 Jam nut receptacle - UTS7 Front view 22.5 27.2 18.3 Ø15.1 3.5 3 12.3 Fig. 5 Fig. 6 Fig. 7 Fig. 4 4.2 18.3 Ø15.1 3.5 3 18.3 Ø15.1 3.5 3 Panel cut out Drilling pattern 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 2.8 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 3.3 1.6 Square fl ange receptacle - UTS0 Front mounting Ø15.2 Rear mounting Ø17.9 Square fl ange receptacle - UTS0 Fig. 9 Fig. 8 11.7 Ø15.1 2.3 16.2 20.8 24 Ø3.2 Front view Mated connector length 70.9 77.3 UTS7 UTS0 7.5 Mechanics 82 © 2011 – SOURIAU UTS Series 106 - 10E6/10D6 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Square fl ange sealing cap Part number UTS610DCG Part number UTS10DCGE Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 83 UTS Series 106 - 10E6/10D6 Contacts #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 IEC 7A 32V 1.5kV 3 Electrical characteristics UTS 106 - 10E6/10D6 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) UTS 106 UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 UTS 10E6/10D6 UL 6A 250V UL94 HB CSA 6A 250V UL94 HB Mechanics 6 contacts 7A/32V per IEC 61984 84 © 2011 – SOURIAU OR WITH OR Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS010E98P UTS010E98S Plug Without (Fig.1) UTS610E98P UTS610E98S Cable gland (Fig.2) UTS6JC10E98P UTS6JC10E98S Jam nut receptacle Without (Fig.3) UTS710E98P UTS710E98S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS010D98P UTS010D98S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS710D98P32 UTS710D98S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS710D98P UTS710D98S Layout UTS Series 10E98/10D98 Sealed unmated © 2011 – SOURIAU 85 Dimensions Note: all dimensions are in mm UTS Series 10E98/10D98 Plug - UTS6 Fig. 1 Fig. 2 70 Ø26.2 Ø26.2 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 18.3 Ø15.1 2.3 16.2 20.8 24 Ø3.2 Front view 70.9 77.3 UTS7 UTS0 Drilling pattern 3.3 1.6 Ø13.5 Ø22 Ø17.7 Ø4 2.8 3.3 Panel cut out 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 Square fl ange receptacle - UTS0 Front mounting Ø15.2 Rear mounting Ø17.9 Jam nut receptacle - UTS7 Front view 22.4 27.2 18.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18.3 Ø15.1 3.5 3 18.3 Ø15.1 3.5 3 Ø15.1 7.5 30° Ø3.1 68° 22° Mechanics 6 contacts 7A/50V per IEC 61984 86 © 2011 – SOURIAU UTS Series 10E98/10D98 UTS 10E98/10D98 derating curves Jam nut sealing caps Plug protective cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS610DCG Part number UTS10DCGE Metal terminal Part number UTS10DCG Part number UTS10DCGR Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket UL 6A 250V UL94 HB CSA 6A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 87 UTS Series 10E98/10D98 Mechanics 88 © 2011 – SOURIAU OR OR WITH OR OR OR UTS Series 147 - 14E7/14D7 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 91 Square fl ange receptacle Without (Fig.2) UTS0147P Free hanging receptacle Cable gland and grommet (Fig.3) UTS1GJC147P Free hanging receptacle Nut and grommet (Fig.4) UTS1GN147P Free hanging receptacle Cable gland (Fig.3) UTS1JC147P UTS1JC147S Plug Without (Fig.5) UTS6147P UTS6147S Plug Cable gland and grommet (Fig.6) UTS6GJC147S Plug Nut and grommet (Fig.7) UTS6GN147S Plug Cable gland (Fig.6) UTS6JC147P UTS6JC147S Jam nut receptacle Without (Fig.8) UTS7147P UTS7147S Jam nut receptacle Cable gland and grommet (Fig.10) UTS7GJC147P Jam nut receptacle Nut and grommet (Fig.9) UTS7GN147P Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.2) UTS014E7P UTS014E7S Plug Cable gland (Fig.6) UTS6JC14E7P UTS6JC14E7S Jam nut receptacle Without (Fig.11) UTS714E7P UTS714E7S PCB contacts loaded Square fl ange receptacle Without (Fig.1) UTS014D7P UTS014D7S Jam nut receptacle with stand off and hold down clips Without (Fig.11) UTS714D7P32 UTS714D7S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.11) UTS714D7P UTS714D7S Jam nut receptacle With stand off and hold down clip (Fig.11) UTS7147PSEK9 Screw contacts loaded Jam nut receptacle Without (Fig.8) UTS7147PSCR UTS7147SSCR Free hanging receptacle Cable gland (Fig.3) UTS1JC147PSCR Plug Cable gland (Fig.6) UTS6JC147PSCR UTS6JC147SSCR Layout Sealed unmated © 2011 – SOURIAU 89 UTS Series 147 - 14E7/14D7 Dimensions Note: all dimensions are in mm Plug - UTS6 Female Male Fig. 5 Fig. 6 Fig. 7 33 70 32 23.5 Ø35.1 Ø35.1 Ø35.1 Jam nut receptacle - UTS7 Fig. 11 Fig. 10 Fig. 8 Fig. 9 18 18 49 70.7 Ø31.8 Ø22.3 3.5 3.5 1.6 4.2 3 Mated connector length 75 82 UTS7 UTS0 Drilling pattern 6.4 3.2 Ø13.5 Ø22 Ø17.7 Ø4 Ø3.1 5.2 Panel cut out 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Square fl ange receptacle - UTS0 Free hanging - UTS1 11.3 Ø22.3 23.2 28.8 2.3 29.1 22 Ø3.2 Fig. 2 Front view Fig. 1 78.5 43 Ø22.3 Fig. 4 Fig. 3 Mechanics 6 + ground 16A/300V per IEC 61984 90 © 2011 – SOURIAU UTS Series 147 - 14E7/14D7 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Plug sealing cap Square fl ange sealing cap Part number UTS614DCG Part number UTS14DCGE Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 91 Contacts #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 UTS Series 147 - 14E7/14D7 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 16A 300V 4kV 3 Temperature elevation: 50°C Electrical characteristics UTS 147 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 5 3 8 10 20 18 15 13 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 6 + ground 16A/300V per IEC 61984 Mechanics 92 © 2011 – SOURIAU OR WITH OR UTS Series 10E7/10D7 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS010E7P UTS010E7S Plug Without (Fig.1) UTS610E7P UTS610E7S Cable gland (Fig.2) UTS6JC10E7P UTS6JC10E7S Jam nut receptacle Without (Fig.3) UTS710E7P UTS710E7S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS010D7P UTS010D7S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS710D7P32 UTS710D7S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS710D7P UTS710D7S Layout Sealed unmated © 2011 – SOURIAU 93 UTS Series 10E7/10D7 Dimensions Note: all dimensions are in mm Plug - UTS6 Fig. 1 Fig. 2 70 Ø26.2 Ø26.2 25.3 Jam nut receptacle - UTS7 Front view 22.4 27.2 18.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18.3 Ø15.1 3.5 3 18.3 Ø15.1 3.5 3 Ø15.1 Square fl ange receptacle - UTS0 Fig. 6 Fig. 7 11.7 Ø15.1 2.3 16.2 7.5 20.8 24 Ø3.2 Front view Mated connector length 70.9 77.3 UTS7 UTS0 Drilling pattern 2.8 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 3.3 1.6 Panel cut out 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 Square fl ange receptacle - UTS0 Front mounting Ø15.2 Rear mounting Ø17.9 Mechanics 7 contacts 7A/50V per IEC 61984 94 © 2011 – SOURIAU UTS Series 10E7/10D7 UTS 10E7/10D7 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS610DCG Part number UTS10DCGE Metal terminal Part number UTS10DCG Part number UTS10DCGR Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket UL 6A 250V UL94 HB CSA 6A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 6 10 Current (A) Ambient Operating Temperature (°C) 12 14 2 4 8 © 2011 – SOURIAU 95 UTS Series 10E7/10D7 Mechanics 96 © 2011 – SOURIAU OR OR OR OR WITH OR UTS Series 128 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 99 Square fl ange receptacle Without (Fig.1) UTS0128P UTS0128S Free hanging receptacle Cable gland and grommet (Fig.2) UTS1GJC128P Free hanging receptacle Nut and grommet (Fig.3) UTS1GN128P Free hanging receptacle Cable gland (Fig.2) UTS1JC128P UTS1JC128S Plug Without (Fig.4) UTS6128P UTS6128S Plug Cable gland and grommet (Fig.5) UTS6GJC128S Plug Nut and grommet (Fig.6) UTS6GN128S Plug Cable gland (Fig.5) UTS6JC128P UTS6JC128S Jam nut receptacle Without (Fig.8) UTS7128P UTS7128S Jam nut receptacle Cable gland and grommet (Fig.10) UTS7GJC128P Jam nut receptacle Nut and grommet (Fig.9) UTS7GN128P PCB contacts loaded Jam nut receptacle With stand off and hold down clip (Fig.11) UTS7128PSEK9 Layout © 2011 – SOURIAU 97 UTS Series 128 Dimensions Note: all dimensions are in mm Square fl ange receptacle - UTS0 Free hanging - UTS1 11.7 Ø19.1 20.8 26.4 2.3 10.5 18.1 Ø3.2 Fig. 1 Front view 74.5 40.9 Ø19.1 Fig. 3 Fig. 2 Plug - UTS6 Female Male Fig. 4 Fig. 5 Fig. 6 33 65.7 33 25.3 Ø30.1 Ø30.1 Ø30.1 Drilling pattern 4.4 3.4 2 4.5 4 2.8 0.9 Panel cut out 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 Square fl ange receptacle - UTS0 Front mounting Ø18.3 Rear mounting Ø22.3 Mated connector length 75.3 81.7 UTS7 UTS0 Jam nut receptacle - UTS7 Fig. 11 Fig. 10 Fig. 8 Fig. 9 18 18 49.1 74.5 Ø19.1 Ø19.1 3.5 3.5 1.6 4.2 3 Mechanics 8 contacts 10A/80V per IEC 61984 98 © 2011 – SOURIAU UTS Series 128 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Color coding rings Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 99 UTS Series 128 Contacts UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 10A 80V 1.5kV 3 Electrical characteristics UTS 128 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 8 contacts 10A/80V per IEC 61984 100 © 2011 – SOURIAU OR WITH OR UTS Series 12E8/12D8 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E8P UTS012E8S Plug Without (Fig.1) UTS612E8P UTS612E8S Cable gland (Fig.2) UTS6JC12E8P UTS6JC12E8S Jam nut receptacle Without (Fig.3) UTS712E8P UTS712E8S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D8P UTS012D8S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS712D8P32 UTS712D8S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS712D8P UTS712D8S Layout Sealed unmated © 2011 – SOURIAU 101 UTS Series 12E8/12D8 Dimensions Note: all dimensions are in mm Plug - UTS6 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø19 3.5 3 18 Ø19 3.5 3.1 Fig. 1 Fig. 2 66.7 Ø30.1 Ø30.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19 2.4 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 Square fl ange receptacle - UTS0 Front mounting Ø18.3 Rear mounting Ø22.3 4.3 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 3 1.6 3 4.3 1.1 3.9 22° Mechanics 8 contacts 6A/32V per IEC 61984 102 © 2011 – SOURIAU UTS Series 12E8/12D8 UTS 12E8/12D8 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS612DCG Part number UTS12DCGE Metal terminal Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB IEC 6A 32V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 103 UTS Series 12E8/12D8 Mechanics 104 © 2011 – SOURIAU OR OR WITH OR UTS Series 1210 - 12E10/12D10 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page107 Free hanging receptacle Cable gland (Fig.1) UTS1JC1210P UTS1JC1210S Plug Without (Fig.2) UTS61210P UTS61210S Plug Cable gland (Fig.3) UTS6JC1210P UTS6JC1210S Jam nut receptacle Without (Fig.4) UTS71210P UTS71210S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E10P UTS012E10S Plug Without (Fig.2) UTS612E10P UTS612E10S Cable gland (Fig.3) UTS6JC12E10P UTS6JC12E10S Jam nut receptacle Without (Fig.5) UTS712E10P UTS712E10S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D10P UTS012D10S Jam nut receptacle with stand off and with hold down clips Without (Fig.6) UTS712D10P32 UTS712D10S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.7) UTS712D10P UTS712D10S Layout Sealed unmated © 2011 – SOURIAU 105 UTS Series 1210 - 12E10/12D10 Dimensions Note: all dimensions are in mm Free hanging - UTS1 Plug - UTS6 74 Ø19.1 Fig. 1 Female Male Fig. 2 Fig. 3 33 66.7 Ø30.1 Ø30.1 25.3 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19.1 3.5 3 12.3 Fig. 5 Fig. 6 Fig. 7 Fig. 4 4.2 18 Ø19.1 3.5 3 18 Ø19.1 3.5 3.1 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19.1 2.3 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 3.3 1.6 Ø22 Ø30.5 Ø26.2 22° 30° 68° 10 Ø3.1 4.9 3 Square fl ange receptacle - UTS0 Front mounting Ø18.3 Rear mounting Ø22.3 Mechanics 10 contacts 6A/50V per IEC 61984 106 © 2011 – SOURIAU UTS Series 1210 - 12E10/12D10 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Color coding rings Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 107 UTS Series 1210 - 12E10/12D10 Contacts IEC 6A 50V 1.5kV 3 Electrical characteristics UTS 1210 - 12E10/12D10 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use UTS 1210 UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 UTS 12E10/12D10 UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB 0 20 40 60 80 100 0 2 4 6 8 10 12 Current (A) Ambient Operating Temperature (°C) 120 #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 10 contacts 6A/50V per IEC 61984 108 © 2011 – SOURIAU OR OR OR OR WITH OR Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 111 Square fl ange receptacle Without (Fig.1) UTS01412P UTS01412S Free hanging receptacle Cable gland and grommet (Fig.2) UTS1GJC1412P Free hanging receptacle Nut and grommet (Fig.3) UTS1GN1412P Free hanging receptacle Cable gland (Fig.2) UTS1JC1412P UTS1JC1412S Plug Without (Fig.4) UTS61412P UTS61412S Plug Cable gland and grommet (Fig.5) UTS6GJC1412S Plug Nut and grommet (Fig.6) UTS6GN1412S Plug Cable gland (Fig.5) UTS6JC1412P UTS6JC1412S Jam nut receptacle Without (Fig.7) UTS71412P UTS71412S Jam nut receptacle Cable gland and grommet (Fig.9) UTS7GJC1412P Jam nut receptacle Nut and grommet (Fig.8) UTS7GN1412P PCB contacts supply separately see page 111 Square fl ange receptacle Without (Fig.1) UTS01412P UTS01412S Jam nut receptacle Without (Fig.7) UTS71412P UTS71412S Layout UTS Series 1412 © 2011 – SOURIAU 109 Dimensions Note: all dimensions are in mm UTS Series 1412 Plug - UTS6 Female Male Fig. 4 Fig. 5 Fig. 6 33 70 32 25.3 Ø31.5 Ø31.5 Ø31.5 Jam nut receptacle - UTS7 Mated connector length Fig. 7 Fig. 9 Fig. 8 18 18 49 70.7 Ø22.3 Ø22.3 3.5 3.5 1.6 75 82 UTS7 UTS0 Panel cut out Drilling pattern 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 2.2 0.7 3.8 5.8 5.1 2 1.4 1 2.2 4.5 5.9 1 0.3 2.9 5.5 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Square fl ange receptacle - UTS0 Free hanging - UTS1 78.5 43 Ø22.3 Fig. 3 11.3 Fig. 2 Ø22.3 23.2 28.8 2.3 10.5 21.9 Ø3.2 Fig. 1 Front view Female Male Mechanics 12 contacts 10A/63V per IEC 61984 110 © 2011 – SOURIAU UTS Series 1412 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Plug sealing cap Square fl ange sealing cap Part number UTS614DCG Part number UTS14DCGE Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 111 UTS Series 1412 Contacts UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 10A 63V 1.5kV 3 Electrical characteristics UTS 1412 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 12 contacts 10A/63V per IEC 61984 112 © 2011 – SOURIAU OR OR WITH OR UTS Series 14E12/14D12 (4x#16 + 8x#20) Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E12P UTS014E12S Plug Without (Fig.1) UTS614E12P UTS614E12S Cable gland (Fig.2) UTS6JC14E12P UTS6JC14E12S Jam nut receptacle Without (Fig.3) UTS714E12P UTS714E12S PCB contacts loaded Square fl ange receptacle Without (Fig.6) UTS014D12P UTS014D12S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS714D12P32 UTS714D12S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D12P UTS714D12S Layout Sealed unmated © 2011 – SOURIAU 113 UTS Series 14E12/14D12 (4x#16 + 8x#20) Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Square fl ange receptacle - UTS0 Mated connector length 11.3 Ø22.3 2.3 7.5 7.8 23.2 28.8 Ø3.2 Fig. 6 Front view 75 82 UTS7 UTS0 23.2 Panel cut out 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Drilling pattern 4.5 4.1 Ø22 Ø30.5 Ø26.2 Ø30.5 30° 68° 10 Ø3.1 1.6 4.5 2.3 6.7 22° 1 Mechanics 12 contacts 4A/50V per IEC 61984 114 © 2011 – SOURIAU UTS Series 14E12/14D12 (4x#16 + 8x#20) UTS 14E12/14D12 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB IEC 4A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 115 UTS Series 14E12/14D12 (4x#16 + 8x#20) Mechanics 116 © 2011 – SOURIAU OR WITH OR UTS Series 12E14/12D14 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E14P UTS012E14S Plug Without (Fig.1) UTS612E14P UTS612E14S Cable gland (Fig.2) UTS6JC12E14P UTS6JC12E14S Jam nut receptacle Without (Fig.3) UTS712E14P UTS712E14S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D14P UTS012D14S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS712D14P32 UTS712D14S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS712D14P UTS712D14S Layout Sealed unmated © 2011 – SOURIAU 117 UTS Series 12E14/12D14 Dimensions Note: all dimensions are in mm 14 contacts 5A/32V per IEC 61984 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø19 3.5 3 18 Ø19 3.5 3.1 Plug - UTS6 Fig. 1 Fig. 2 66.7 Ø30.1 Ø30.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19 2.4 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 4.4 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.7 2 4.7 3.8 1.8 1.4 Square fl ange receptacle - UTS0 22° Front mounting Ø18.3 Rear mounting Ø22.3 Mechanics 118 © 2011 – SOURIAU UTS Series 12E14/12D14 UTS 12E14/12D14 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS612DCG Part number UTS12DCGE Metal terminal Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB IEC 5A 32V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 119 UTS Series 12E14/12D14 Mechanics 120 © 2011 – SOURIAU OR WITH OR UTS Series 14E15/14D15 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E15P UTS014E15S Plug Without (Fig.1) UTS614E15P UTS614E15S Cable gland (Fig.2) UTS6JC14E15P UTS6JC14E15S Jam nut receptacle Without (Fig.3) UTS714E15P UTS714E15S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS014D15P UTS014D15S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS714D15P32 UTS714D15S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D15P UTS714D15S Layout Sealed unmated © 2011 – SOURIAU 121 UTS Series 14E15/14D15 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.3 Ø22.3 2.3 7.5 23.2 28.8 Ø3.2 Front view 7.8 75 82 UTS7 UTS0 Panel cut out Drilling pattern 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 30° 68° 22° 3.2 5.5 2.5 2.7 6.1 5.1 5.3 6.2 2.8 0.3 5.7 1.9 1 3.5 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Mechanics 15 contacts 4A/50V per IEC 61984 122 © 2011 – SOURIAU UTS Series 14E15/14D15 UTS 14E15/14D15 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 12A 650V UL94 HB CSA 12A 650V UL94 HB IEC 4A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 1.31mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 Current (A) Ambient Operating Temperature (°C) 0 5 3 8 10 20 18 15 13 23 25 28 30 © 2011 – SOURIAU 123 UTS Series 14E15/14D15 Mechanics 124 © 2011 – SOURIAU OR WITH OR UTS Series 14E18/14D18 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E18P UTS014E18S Plug Without (Fig.1) UTS614E18P UTS614E18S Cable gland (Fig.2) UTS6JC14E18P UTS6JC14E18S Jam nut receptacle Without (Fig.3) UTS714E18P UTS714E18S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS014D18P UTS014D18S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS714D18P32 UTS714D18S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D18P UTS714D18S Layout Sealed unmated © 2011 – SOURIAU 125 UTS Series 14E18/14D18 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.3 Ø22.3 2.3 7.5 23.2 28.8 Ø3.2 Front view 7.8 75 82 UTS7 UTS0 Panel cut out Drilling pattern Jam nut receptacle - UTS7 24.5 25.9 23.2 23.2 Ø3.3 1.6 3.3 6.1 Ø22 Ø26.2 Ø30.5 22° 30° 68° 10 Ø3.1 4.9 2.8 5.7 6.4 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Mechanics 18 contacts 5A/50V per IEC 61984 126 © 2011 – SOURIAU UTS Series 14E18/14D18 UTS 14E18/14D18 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 4A 250V UL94 HB CSA 4A 250V UL94 HB IEC 5A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 Current (A) Ambient Operating Temperature (°C) 0 6 4 2 8 10 © 2011 – SOURIAU 127 UTS Series 14E18/14D18 Mechanics 128 © 2011 – SOURIAU OR OR WITH OR UTS Series 1419 - 14E19/14D19 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 131 Free hanging receptacle Cable gland (Fig.1) UTS1JC1419P UTS1JC1419S Plug Without (Fig.2) UTS61419P UTS61419S Plug Cable gland (Fig.3) UTS6JC1419P UTS6JC1419S Jam nut receptacle Without (Fig.4) UTS71419P UTS71419S PCB contacts supply separately see page 131 Jam nut receptacle Without (Fig.4) UTS71419P UTS71419S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.8) UTS014E19P UTS014E19S Plug Without (Fig.2) UTS614E19P UTS614E19S Cable gland (Fig.3) UTS6JC14E19P UTS6JC14E19S Jam nut receptacle Without (Fig.5) UTS714E19P UTS714E19S PCB contacts loaded Square fl ange receptacle Without (Fig.9) UTS014D19P UTS014D19S Jam nut receptacle with stand off and with hold down clips Without (Fig.6) UTS714D19P32 UTS714D19S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.7) UTS714D19P UTS714D19S Layout Sealed unmated Square fl ange receptacle © 2011 – SOURIAU 129 UTS Series 1419 - 14E19/14D19 Dimensions Note: all dimensions are in mm Square fl ange receptacle - UTS0 Mated connector length Fig. 8 Fig. 9 11.3 Ø22.3 2.3 7.5 78 23.2 28.8 Ø3.2 Front view 75 82 UTS7 UTS0 Free hanging - UTS1 Plug - UTS6 78.5 Ø22.3 Fig. 1 Female Male Fig. 2 Fig. 3 33 70 Ø35.1 Ø35.1 25.3 Jam nut receptacle - UTS7 Front view 30.4 35.1 18 3.5 3 12.3 Fig. 5 Fig. 6 Fig. 7 Fig. 4 4.2 18 Ø22.3 3.5 3 18 Ø22.3 Ø22.3 3.5 3 Panel cut out Drilling pattern Jam nut receptacle - UTS7 24.5 25.9 23.2 23.2 Ø3.3 1.6 4.9 Ø22 Ø26.2 Ø30.5 30° 68° 10 Ø3.1 3.3 6.6 2.8 5.7 Square fl ange receptacle - UTS0 22° Front mounting Ø21.5 Rear mounting Ø25.1 Mechanics 19 contacts 5A/32V per IEC 61984 130 © 2011 – SOURIAU UTS Series 1419 - 14E19/14D19 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Plug sealing cap Square fl ange sealing cap Part number UTS614DCG Part number UTS14DCGE Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 131 UTS Series 1419 - 14E19/14D19 Contacts IEC 5A 32V 1.5kV 3 Electrical characteristics UTS 1419 - 14E19/14D19 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use UTS 1419 UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 UTS 14E19/14D19 UL 4A 250V UL94 HB CSA 4A 250V UL94 HB 0 20 40 60 80 100 0 2 4 6 8 10 12 Current (A) Ambient Operating Temperature (°C) 120 #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 19 contacts 5A/32V per IEC 61984 132 © 2011 – SOURIAU OR OR OR WITH UTS Series 1823 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 135 Square fl ange receptacle Without (Fig.1) UTS01823P UTS01823S Free hanging receptacle Cable gland (Fig.2) UTS1JC1823P UTS1JC1823S Plug Without (Fig.3) UTS61823P UTS61823S Plug Cable gland (Fig.4) UTS6JC1823P UTS6JC1823S Jam nut receptacle Without (Fig.5) UTS71823P UTS71823S PCB contacts supply separately see page 135 Square fl ange receptacle Without (Fig.1) UTS01823P UTS01823S Jam nut receptacle Without (Fig.5) UTS71823P UTS71823S Layout 134 © 2011 – SOURIAU UTS Series 1823 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS18DCG Part number UTS18DCGR Plug sealing cap Square fl ange sealing cap Part number UTS618DCG Part number UTS18DCGE Part numbers Receptacle cap Plug cap 8500-5590A 8500-5599 Plastic protective cap Part numbers / neoprene UTFD16B Gasket Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 135 UTS Series 1823 Contacts 120 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 9A 63V 1.5kV 3 Electrical characteristics UTS 1823 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 23 contacts 9A/63V per IEC 61984 136 © 2011 – SOURIAU OR WITH OR UTS Series 1832 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contact supply separately see page 139 Free hanging receptacle Cable gland (Fig.1) UTS1JC1832P UTS1JC1832S Plug Without (Fig.2) UTS61832P UTS61832S Plug Cable gland (Fig.3) UTS6JC1832P UTS6JC1832S Jam nut receptacle Without (Fig.4) UTS71832P UTS71832S PCB contacts supply separately see page 139 Jam nut receptacle Without (Fig.4) UTS71832P UTS71832S Layout 138 © 2011 – SOURIAU UTS Series 1832 Metal terminal Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS18DCG Part number UTS18DCGR Plug sealing cap Square fl ange sealing cap Part number UTS618DCG Part number UTS18DCGE Part numbers Receptacle cap Plug cap 8500-5590A 8500-5599 Plastic protective cap Part numbers / neoprene UTFD16B Gasket Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 139 UTS Series 1832 Contacts UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 IEC 4A 32V 1.5kV 3 Electrical characteristics UTS 1832 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 2 4 6 8 10 Current (A) Ambient Operating Temperature (°C) 120 #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 32 contacts 4A/32V per IEC 61984 UTS Series © 2011 – SOURIAU 141 Contacts UTS Series Description ....................................................................................................................................... 142 Contact plating selector guide ................................................................................................... 143 Contact selector guide ................................................................................................................. 144 Packaging ......................................................................................................................................... 144 Crimp contacts ................................................................................................................................ 145 #16 coaxial contacts .................................................................................................................... 147 PCB contacts ................................................................................................................................... 148 Fibre optic contacts ....................................................................................................................... 149 142 © 2011 – SOURIAU UTS Series Contacts Contacts Description The UTS series is delivered with (solder and PCB versions) or without contact (crimp version). When contacts are not loaded, this series offers the unique possibility to use the same contact in any layout as long as it receives the same active part size. Thus it is possible to buy only one contact reference and equip all connectors even if housings are different. The main benefit is the standardisation which means reduction of inventory cost. Bearing in mind that any additional tool or complicated assembly process should be avoided, our contacts are based on a snap-in principle which avoid the use of an insertion tool. Crimp contacts are available in different versions: In addition, UTS series can obviously be equipped with solder contacts, PCB contacts, screw termination. • machined • stamped & formed • coaxial • fiber optic © 2011 – SOURIAU 143 UTS Series Contacts Contact plating selector guide As soon as you know what contact size you need, you next have to decide on which type to use. Souriau proposes mainly two different types of electrical contacts: - Machined - Stamped & formed Machined contacts are generally chosen for low quantities purpose as well as a better solution for power applications. Stamped & formed contacts offer the ability to be crimped automatically which makes them more suitable for high volume production applications. Then comes the question: What plating should I choose ? Hereunder is a graph with criteria to guide you: NB: do not mix different plating (e.g. tin plated pin contact with gold plated socket contact). 250 100 0.4μm of gold min Gold fl ash Silver Tin 5mA 5mV Contact size #20 #12 #16 #8 Vibration Number of cycles Current / Voltage Contacts 144 © 2011 – SOURIAU UTS Series Contacts Electrical characteristics: contact resistance #20 Ø1mm Machined < 6m Stamped & formed < 15m #16 Ø1.6mm Machined < 3m Stamped & formed < 6m #12 Ø2.4mm Machined < 5m #8 Ø3.6mm Machined < 5m Available platings (contact supply separately) A 2μ Ni + 2μ Ag J Gold fl ash over 2μ Ni K Min 0.4μ gold over 2μ Ni S31 Active part: Gold fl ash over Ni Crimp area: Nickel S18 Active part: 0.75μ gold min over 2μ Ni Crimp area: 1.3μ tin over Ni Other: Nickel S25 S26 Active part: 0.75μ Au over Ni Crimp area: fl ash Au over Ni T T: 2μm Ni mini all over + 3 to 5 μm Sn all over TK6 2-5μ Sn pre-plated Conscious of the wide variety of applications, contact packaging has been considered for small series (bulk packaging) and high volume production (reeled contacts): Size contacts #20 & #16 • 100 pieces bulk packing (stamped & formed contacts) Electrical characteristics: contact resistance #20 Ø1mm Machined < 4m #16 Ø1.6mm Machined < 3m Available platings (contact preloaded) Min 0.4μ gold over 2μ Ni Contact preloaded Contact supply separately • 50 pieces bulk packing (machined contacts) • 25 pieces bulk packing (stamped & formed contacts) • 1000 pieces bulk packing (machined contacts) • 5000 pieces reeled (machined contacts) • 3000 pieces reeled (stamped & formed contacts) Size contacts #12 & #8 Contact selector guide Packaging © 2011 – SOURIAU 145 UTS Series Contacts Crimp contacts (1) contact reeled (2) loose contact Exemple: RM24W3K - Size #20, Machined, AWG24 wire. Contact size Type Wire size Part number Max wire Ø Max insulator Ø Plating AWG mm² Male Female available #20 Ø1 mm Machined 26-24 0.13-0.20 RM24W3K RC24W3K 1.58 max K Stamped & Formed 26-24 0.13-0.25 SM24W3-(1) SC24W3-(1) 0.89-1.58 TK6 S25 (female) SM24WL3-(2) SC24WL3-(2) S26 (male) Machined 22-20 0.32-0.52 RM20W3K RC20W3K 1.58 max K Stamped & Formed 22-20 0.35-0.5 SM20W3-(1) SC20W3-(1) 1.17-2.08 TK6 S25 (female) SM20WL3-(2) SC20WL3-(2) S26 (male) Machined 20-18 0.50-0.93 RM18W3K RC18W3K 2.10 max K #16 Ø1.6 mm Machined 30-28 0.05-0.08 RM28M1- RC28M1- 0.55 1.1 K, J, T Machined 26-24 0.13-0.2 RM24M9- RC24M9- 0.8 1.6 K, J, T Stamped & Formed 26-24 0.13-0.25 SM24M1-(1) SM24ML1-(2) SC24M1-(1) SC24ML1-(2) 0.89-1.28 Insulation grip S31, S18, TK6 Machined 22-20 0.32-0.52 RM20M13- RC20M13- 1.18 1.8 K, J, T RM20M12- RC20M12- 2.2 Stamped & Formed 22-20 0.35-0.5 SM20M1-(1) SM20ML1-(2) SC20M1-(1) SC20ML1-(2) 1.17-2.08 Insulation grip S31, S18, TK6 Machined 20-16 0.52-1.5 RM16M23- RC16M23- 1.8 3.2 K, J, T Stamped & Formed 18-16 0.8-1.5 SM16M1-(1) SM16ML1-(2) SC16M1-(1) SC16ML1-(2) 3.0 No insulation grip S31, S18, TK6 Stamped & Formed 18-16 0.8-1.5 SM16M11-(1) SM16ML11-(2) SC16M11-(1) SC16ML11-(2) 2.0-3.0 Insulation grip S31, S18, TK6 Machined 16-14 1.5-2.5 RM14M50- RC14M50- 2.05 3.2 K, J, T Machined 16-14 1.5-2.5 RM14M30- RC14M30- 2.28 3.2 K, J, T Stamped & Formed 14 2.0-2.5 SM14M1-(1) SM14ML1-(2) SC14M1-(1) SC14ML1-(2) 3.2 No insulation grip S31, S18, TK6 #12 Ø2.4 mm Machined 22 0.13-0.4 82911457NA 82911456A - 4.9 A, K 20 0.5 82911459NA 82911458A 18 0.75-1.0 82911461NA 82911460A 16 1.5 82911463NA 82911462A 14 2.5 82911465NA 82911464A 12 4 82911467NA 82911466A #8 Ø3.6 mm Machined 16 1.5 82913601A 82913600A - 6.5 A 14 2.5 82913603A 82913602A 12 4 82913605A 82913604A 10 6.0 82913607A 82913606A 8 10.0 82913609A 82913608A Standard version Contacts 146 © 2011 – SOURIAU Contact 1 Contact 2 Standard male contact Standard female contact Longer male contact Standard male contact Standard female contact FMLB Shorter female contact LMFB UTS Series Contacts Crimp contacts Exemple: RM16M3GE1K - Size #16, Machined, Longer male, AWG16 wire.     First Mate Last Break contacts should be chosen only if the cavity is not marked with the earth symbol. For cavities marked with the earth symbol, standard contacts will fulfi ll the same role as a fi rst mate, last break contact used in a standard cavity. Ground symbol How to make FMLB / LMFB connection First Mate Last Break contacts Contact size Type Wire size Part number Max wire Ø Max insulator Ø Color band Plating available AWG mm² Male Female Front Rear #16 Ø1.6 mm Longer male contact (+1mm) Machined 30-28 0.05-0.08 RM28M1GE1□ - 0.55 1.1 - Red □ = K, J or T 26-24 0.13-0.2 RM24M9GE1□ 0.8 1.6 Red Red 22-20 0.32-0.52 RM20M13GE1□ 1.18 1.8 Black Red RM20M12GE1□ 2.2 Blue Red 20-16 0.52-1.5 RM16M23GE1□ 1.8 3.2 - Red 16-14 1.5-2.5 RM14M50GE1□ 2.05 - - Red 16-14 1.5-2.5 RM14M30GE1□ 2.28 - - Red #16 Ø1.6 mm Shorter female contact (-0.7mm) Machined 30-28 0.05-0.08 - RC28M1GE7□ 0.55 1.1 - Blue □ = K, J or T 26-24 0.13-0.2 RC24M9GE7□ 0.8 1.6 Red Blue 22-20 0.32-0.52 RC20M13GE7□ 1.18 1.8 Black Blue RC20M12GE7□ 2.2 Blue Blue 20-16 0.52-1.5 RC16M23GE7□ 1.8 3.2 - Blue 16-14 1.5-2.5 RC14M50GE7□ 2.05 - - Blue 16-14 1.5-2.5 RC14M30GE7□ 2.28 - - Blue ont Re © 2011 – SOURIAU 147 UTS Series Contacts #16 coaxial contacts We provide 2 types of coaxial contacts suitable for 50 or 75, coaxial cable or twisted pair cable. Monocrimp coaxial contact • The monocrimp one-piece coaxial contacts offer high reliability plus the economic advantage of a 95% reduction in installation time over conventional assembly methods. • This economy is achieved by simultaneously crimping both the inner conductor and outer braid or drain wire. Multipiece crimp coaxial contact • The inner conductor and outer braid is crimped individually. • The thermoplastic insulating bushing in the outer body is designed to accept and permanently retain the inner contact. • An outer ferrule is used to connect the braid to the outer contact and provide cable support to ensure against bending and vibration. Suitable for Coaxial cable or Twisted cable • For jacket diameter from 1.78 to 3.05mm Inner conductor up to 2.44mm diameter • For jacket diameter from 0.64 to 1.45mm Inner conductor from AWG30 to AWG24 Contacts for coaxial cable summary Contact type Contact range Contact part number with cable combination Cabling notice Male contact Female contact Multipiece RMDXK10D28 RCDXK1D28 See page 176 See pages 180 & 181 Monocrimp RMDX60xxD28 RCDX60xxD28 See page 182 Contacts for twisted pairs cable summary Contact type Contact range Contact part number with cable combination Cabling notice Male contact Female contact Multipiece RMDXK10D28 + YORK090 RCDXK1D28 + YORK090 See page 177 See page 178 Monocrimp RMDX60xxD28 RCDX60xxD28 See page 179 Coaxial contact range Contacts 148 © 2011 – SOURIAU PCB contacts PCB contacts PCB soldering UTS range can be carried out with a wave soldering process, but not refl ow soldering process. All high temperature processes are prohibited. Nominal length (G) Dimension of dipsolder contacts out of connector (contacts to be ordered separately). Contact size Type Part number Plating Male Female #20 Ø1mm Short version RMW50A7K RCW50A7K K Long version RMW5016K RCW5016K #16 Ø1.6mm Short version RM20M12E8□ RC20M12E8□ □=K or T Long version RM20M12E83□ RC20M12E83□ RC20M12E84□ Exemple: RM50A7K - Size #20, Short version, male. UTS Series Contacts G * Plating indication: see plating table Connector size Pin contact Socket contact RM20M12E8*□ RM20M12E83*□ RC20M12E8*□ RC20M12E83*□ RC20M12E84*□ 10 4 9.1 3.3 8.5 12.1 12 4 9.1 3.3 8.5 12.1 14 4 9.1 3.3 8.5 12.1 16 4 9.1 3.3 8.5 12.1 Connector size Pin contact Socket contact RM20M 12E8*□ RM20M 12E83*□ RMW 50A7K RMW 5016K RC20M 12E8*□ RC20M 12E83*□ RCW 50A7K RCW 5016K 10 4.1 9.2 9.51 10.41 4.65 8.5 2.4 3.04 12 4 9.2 9.51 10.41 3.3 8.5 2.4 3.04 14 4 9.2 9.51 10.41 3.3 8.5 2.4 3.04 16 4 9.2 9.51 10.41 3.3 8.5 2.4 3.04 UTS0 UTS7 © 2011 – SOURIAU 149 Fibre optic contacts Size 16 Fibre optic contacts for TRIM TRIO® connectors Size 16 Fibre optic contacts are optical contacts designed for the integration of optical links in all TRIM TRIO® cable connectors. The Fibre optic contacts are designed to accommodate: • Plastic Optical Fibre (POF) 1 mm core and 2.2 mm jacket • Plastic Clad Fibre (PCF) 230μm core and 2.2 mm jacket Typical features and benefits are: • Socket contact is spring loaded to avoid any air gap between the two optical faces. • Low insertion loss is provided by high precision pieces. • Single jumpers, multiway harness and active device housings can be supplied regarding customer requirement. Performance • Fibre type: ................................................................................................................................POF • Wave length: ........................................................................................................................650 nm • Optical insertion loss (typ.): ..........................................................................................2 dB max. • Jacketed external diameter: ............................................................................................2.2mm • Temperature range: ....................................................................................................-25°C to +70°C • Cable retention: ..................................................................................................................... 49N • Mating cycles without cleaning: .........................................................................................50 • Max. mating cycles: ...............................................................................................................500 Construction • Contact body: Copper alloy Connector accommodation Any TRIM TRIO® size 16 contact can be used in any contact position in any connector in the TRIM TRIO® size 16 interconnection system : UTP, UTS, UTG, UTO. UTS Series Contacts Description Technical characteristics Contacts 150 © 2011 – SOURIAU Fibre optic contacts UTS Series Contacts POF Contact (Plastic Optical Fibre) Ordering information Part numbers Descriptions 80WD0005 Stripping tool 80WD0025 Automatic stripping tool for Ø 0.5 mm, 0.6 mm, 0.7 mm & 3.8 mm 80WM0006 Ruler 80WP0005 Polishing plate 80WP0013 Non slip base (to hold the polishing plate) 80WP0014 Polishing disk (grain size 9μm) 80WP0018 Polishing tool 80WP0019 Polishing disk (grain size 30μm) 80WS0002 Crimping plier STANDARD TOOLING KIT - P/N 80MS0004 The standard tooling kit is made of the part numbers below that can be ordered separately as well. Part numbers Descriptions 80WG0010 Needle 80WG0015 Capsule 80WG0016 Syringe 80WN0005 Dry air spray 80WN0006 Optical paper 80WN0012 Dropping bottle 80WN0008 Wiping solvent SPECIFIC TOOLING LIST - can be ordered only separately POF Contacts (Plastic Optical Fibre) Male contact ................................................RMPOF1000 Female contact ......................................... RCPOF1000B © 2011 – SOURIAU 151 UTS Series Contacts Contacts UTS Series © 2011 – SOURIAU 153 Technical information UTS Series Tooling ............................................................................................................................................... 154 Assembly intruction ....................................................................................................................... 156 Dimensions overmoulded harnesses ...................................................................................... 162 Extraction tools ............................................................................................................................... 162 Rated current & working voltage ............................................................................................... 163 UV resistance .................................................................................................................................. 164 UL94 + UL1977 ............................................................................................................................. 165 IEC 61984 & IP codes explained ............................................................................................. 168 What is NEMA rating ? ................................................................................................................. 170 Ethernet for the layman ................................................................................................................ 171 154 © 2011 – SOURIAU UTS Series Technical information Souriau has been working in partnership with Mecal for a good number of years. With sales offi ces located in all major industrial regions of the world, the combined strengths of both organisations has resulted in a truly global solution to all your production tooling needs. Mecal sales network: Mecal is leader in manufacturing tooling for crimping terminals over a stripped wire. Established in 1976, Mecal has become one of the world's leading companies dedicated to the design and manufacture of semi automatic production tools for strip fed, open barrel crimp terminals, serving the Automotive, Telecom and Datacomm industry. The extreme environment interconnect specialist “from deep sea to deep space”. Souriau designs manufactures and markets high performance interconnect solutions for severe environments dedicated to the aerospace, defence, light and heavy industry markets. Mini Applicator Stripper Presses Tooling www.mecal.net/eng/retevendita.php Automatic crimping tools © 2011 – SOURIAU 155 UTS Series Technical information Contact size Part number Head Handles #20 1mm RM/RC 24W3 - S20RCM SHANDLES RM/RC 20W3 - RM/RC 18W3 - SM 24W3S-(1) SC 24W3S-(1) S20SCM20 SM 24WL3S-(2) SC 24WL3S-(2) SM/SC 20W3S-(1) SM/SC 20WL3S-(2) #16 1.6mm RM/RC 28M1- S16RCM20 RM/RC 24M9- RM/RC 20M13- RM/RC 20M12- RM/RC 16M23- S16RCM16 RM/RC 14M50- S16RCM1450 RM/RC 14M30- S16RCM14 SM/SC 24M1- SM/SC 24ML1- S16SCM20 SM/SC 20M1- SM/SC 20ML1- SM/SC 16M1- SM/SC 16ML1- S16SCML1 SM/SC 14M1- SM/SC 14ML1- SM/SC 16M11- SM/SC 16ML11- S16SCML11 Specifi c contacts Contact size Part number Tool with separate locator Extraction tools Hand tool Positioner + locator setting #12 2.4mm 8291 1457N- / 8291 1456- M317 VGE10077A 1-2 5106020924 8291 1459N- / 8291 1458- 2 8291 1461N- / 8291 1460- 2 8291 1463N- / 8291 1462- 3 8291 1465N- / 8291 1464- 3 8291 1467N- / 8291 1466- 4 #8 3.6mm 8291 3601A / 8291 3600A M317 VGE10078A 3 51060210936 8291 3603A / 8291 3602A 3 8291 3605A / 8291 3604A 4 8291 3607A / 8291 3606A 5 8291 3609A / 8291 3608A 6/7 Contact size Part number Hand tools (SHANDLES) head Tool with separate locator Extraction tools Hand tool Positioner + locator setting #16 Ø 1.6mm Longer RM contact RM28M1GE1- S16RCM20 RX2025GE1 RM24M9GE1- RM20M13GE1- RM16M23 GE1- S16RCM16 MH860 MH86186 6/8 RM14M50 GE1- S16RCM1450 M317 UH25 3 RM14M30 GE1- S16RCM14 #16 Ø 1.6mm Shorter RC contact RC28M1GE7- S16RCM20 MH860 MH86164G 4/6 RC24M9GE7- 5/6 RC20M13GE7- RC20M12GE7- 5/7 RC16M23GE7- S16RCM16 6/8 RC14M50GE7- S16RCM1450 M317 UH25 3 RC14M30GE7- S16RCM14 Standard contacts Coaxial contacts See cabling notice chapter Appendices, pages 178 to 182. (1) contact reeled (2) loose contact Note: endurance of SHANDLES tool = 5 000 cycles. 51060210924 51060210936 SHANDLES Crimptooling table Technical information 156 © 2011 – SOURIAU Assembly instruction Part number Stripping length L Male Female (mm) Machined contact #16 RM28M1- / RM24M9- RM20M13- / RM20M12- RC28M1- / RC24M9- RC20M13- / RC20M12- 4.8 RM16M23- / RM14M50- RM14M30- RC16M23- / RC14M50- RC14M30- 7.1 #20 RM24W3- / RM20W3- RM18W3- RC24W3- / RC20W3- RC18W3- 4.8 Stamped & formed #16 SM24M1- / SM24ML1- SM20M1- / SM20ML1 SC24M1- / SC24ML1- SC20M1- / SC20ML1- 4 SM16M11- / SM16ML11- SC16M11- / SC16ML11- 4.65 SM16M1- / SM16ML1- SC16M1- / SC16ML1- 6.35 SM14M1- / SM14ML1- SC16M11- / SC16ML11- 6.35 Screw contacts Power contacts #12 8291 1457- / 8291 1459- / 8291 1461- / 8291 1463- / 8291 1465- / 8291 1467- 8291 1456- / 8291 1458- / 8291 1460- /8291 1462- / 8291 1464- / 8291 1466 - 7 to 8 Power contacts #8 8291 3601- / 8291 3603- / 8291 3605- 8291 3607- / 8291 3609- 8291 3600- / 8291 3602- / 8291 3604- / 8291 3606- / 8291 3608- 6.5 to 7.5 Contact delivered with connector 5.8 Part number Stripping length L Male Female (mm) Machined contact #16 & #20 5 L L L L Without insulation support With insulation support L UTS Series Technical information Wire stripping crimp version Wire stripping solder version © 2011 – SOURIAU 157 One of the key factors which affects the performance of a connector, is the way contacts are terminated. Crimped connections are nowadays seen as the best solution to ensure quality throughout the lifetime of the product. Here are some reasons why we recommend this method of termination for UTS connectors: Advantages (Extract from the IEC 60352-2): - Effi cient processing of connections at each production level - Processing by fully-automatic or semi- automatic crimping machines, or with hand operated tools - No cold-soldered joints - No degradation of the spring characteristic of female contacts by the soldering temperature - No health risk from heavy metal and fl ux steam - Preservation of conductor fl exibility behind the crimped connection - No burnt, discolored and overheated wire insulation - Good connections with reproducible electrical and mechanical performances - Easy production control. To ensure that the crimp tooling is performing according tooriginal specifi cations, it is important to carry out regular checks. A common way to check the performance of tooling is with a simple pull test, ideally using a dedicated electric pull tester. Minimum recommended full forces are indicated in the tables below: Active contact part Contact type Die location on heads Wire section range Section (mm²) Tensile straight test (mini) Height (Mm) H (±0.075) Width (Mm) W (±0.075) Head's P/N Machined contacts size 20 RM/RC 24W3* 26/24 AWG 26 0.12 min 15 N 0.95 1.27 S20RCM AWG 24 0.25 max 32 N RM/RC 20W3* 22/20 AWG 22 0.32 min 40 N 1.26 1.78 AWG 20 0.50 max 60 N RM/RC 18W3* 20/18 AWG 20 0.50 max 60 N 1.35 1.86 AWG 18 0.82 max 90 N S & F contacts size 20 SM/SC 24WL3TK6* 26/24 AWG 26 0.12 min 15 N 0.80 1.49 S20SCM20 AWG 24 0.25 max 32 N SM/SC 20WL3TK6* 22/20 AWG 22 0.32 min 40 N 1.01 1.53 AWG 20 0.50 max 60 N Machined contacts size 16 RM/RC 28M1K* 30/28 AWG 30 0.05 min 11 N 1.14 1.41 S16RCM20 AWG 28 0.08 max 11 N RM/RC 24M9K* 26/24 AWG 26 0.12 min 15 N 1.15 1.41 AWG 24 0.25 max 32 N RM/RC 20M13K* 22/20 AWG 22 0.32 min 40 N 1.26 1.76 AWG 20 0.50 max 60 N RM/RC 20M12K* AWG 22 0.32 min 40 N AWG 20 0.50 max 60 N RM/RC 16M23K* 20 AWG 20 0.50 max 60 N 1.66 2.18 18 AWG 18 0.82 max 90 N 1.80 2.28 S16RCM16 16 AWG 16 1.50 max 150 N 1.96 2.43 RM/RC 14M30K* 16 AWG 16 1.50 min 150 N 2.10 2.68 S16RCM14 14 AWG 14 2.50 min 230 N 2.30 2.78 RM/RC 14M50K* 16 AWG 16 1.50 min 150 N 2.09 2.59 S16RCM1450 14 AWG 14 2.50 max 230 N 2.26 2.71 S & F contacts size 16 SM/SC 24ML1TK6* 26/24 AWG 26 0.12 min 15 N 0.84 1.50 S16SCM20 AWG 24 0.25 max 32 N SM/SC 20ML1TK6* 22/20 AWG 22 0.32 min 40 N 1.02 1.54 AWG 20 0.50 max 60 N SM/SC 16ML11TK6* 18 AWG 18 0.82 min 90 N 1.32 2.09 S16SCML11 16 AWG 16 1.50 max 150 N 1.36 2.10 SM/SC 16ML1TK6* 18 AWG 18 0.82 min 90 N 1.49 2.02 16 AWG 16 1.50 max 150 N 1.7 2.05 S16SCML1 SM/SC14ML1TK6* 14 AWG 14 2.50 max 230 N 1.79 2.58 (1): example of plating, for other plating see page 143 W W H H Machined contact Stamped & Formed contact UTS Series Technical information Crimping Technical information 158 © 2011 – SOURIAU • Strip wires, crimp or solder contacts • Insert contacts into connector cavities (insert manually or use tool RTM205 crimp contacts only) • Place receptacle in the panel cut-out, with optional gasket • Secure receptacle with screws (not supplied) Gasket (optional) Gasket (optional) Front mounting : Crimp version Rear mounting : Crimp version Optional coding ring Optional coding ring Panel thickness: 2.5mm max Panel Receptacle fl ange Receptacle fl ange 3mm max 3mm max Pa Gasket (optional) Optional coding ring Optional coding ring Front mounting : Solder version Rear mounting : Solder version Gasket (optional) UTS Series Technical information UTS 0 assembly (mounting suggestion) © 2011 – SOURIAU 159 Shell size Nut tightening torque (Nm) Ø Wire 10 1 from 1.7 mm to 3.0 mm 12 1.5 14 1.5 Nut Grommet + Compression ring Optional coding ring • Slide accessories on the cable (make sure to keep compression ring on the grommet) • Strip wires and crimp contacts • Insert fi rst contact into the grommet (fi rst contact in cavity A, use male contact to pierce the grommet, no tool is required), then insert the contact in the connector cavity A (insert manually or use tool RTM205) • Place the grommet and compression ring on the insulator • Insert the other contacts • Tighten nut (recommended torque: see note) Shell size Jam nut torque (Nm) Tool tightening Ø Wire Standard version Discrete wire sealing 8 1.5 19.05 3.2 mm max. from 1.7 mm to 3.0 mm 10 3 22.25 12 4 27.15 14 5 30.19 18 5 36.5 • Strip wires, crimp or solder contacts • Insert contacts into connector cavities (insert manually or use tool RTM205 crimp contacts only) • Seat o-ring, place receptacle in the panel cut-out • Tighten jam nut O-ring O-ring Jam nut Jam nut Panel thickness: 3.2mm max Panel thickness: 3.2mm max Optional coding ring Optional coding ring Crimp version Solder version Finally UTS Series Technical information UTS 7 assembly (mounting suggestion) UTS 6 GN / UTS 7 GN assembly Technical information 160 © 2011 – SOURIAU • Slide accessories on the cable • Strip external cable jacket • Strip wires and crimp contacts • Insert contacts into connector cavities (insert manually or use tool RTM205) • Tight adapter with plug, choose right seal (waste the other seal), tight nut with adapter (recommended torque values to be applied according to the table - right) • Caution: only one of both delivered gasket should be used ! Shell size Recommended jacket strip length (mm) Adapter tightening torque (Nm) Nut tightening torque (Nm) Ø Cable range Standard seal Ø Cable range Reducing seal Ø Wire Male Female 10 21 29 1.5 2 2.5/8.0 1.5/5.0 3.2 mm max. 12 25 33 2 2.5 5.0/12.0 3.0/9.0 14 29 36 3 2.5 7.0/14.0 5.0/12.0 18 37 45 4 3.5 9.0/18.0 7.0/16.0 Coding ring Nut Adapter + mounted gasket Make sure the seal is positioned as shown. • Slide accessories on the cable • Strip external cable jacket • Strip wires and solder contacts • Tight adapter with plug, choose right seal (waste the other seal), tight nut with adapter (recommended torque values to be applied according to the table - right) • Caution: only one of both delivered gasket should be used ! Shell size Recommended jacket strip length (mm) Adapter tightening torque (Nm) Nut tightening torque (Nm) Ø Cable range Standard seal Ø Cable range Reducing seal Ø Wire Male 8 17 1 0.75 2.5/6.5 1.5/5.0 3.2 mm max. 10 21 1.5 2 2.5/8.0 1.5/5.0 12 25 2 2.5 5.0/12.0 3.0/9.0 14 29 3 2.5 7.0/14.0 5.0/12.0 Make sure the seal is positioned as shown.   Assembly instruction Coding ring Nut Adapter + mounted gasket UTS Series Technical information UTS 1 JC / UTS 6 JC assembly: Crimp version UTS 6 JC assembly: Solder version © 2011 – SOURIAU 161 Shell size UTS0 + UTS6 EN JC & CJC UTS0 + UTS6 EN GN UTS7 + UTS6 EN JC & CJC UTS7 + UTS6 EN GN A max B max C max D max 8 61.1 - 66.6 - 10 73.2 39.6 77.3 43.7 12 77.6 39.4 81.7 43.5 14 83.5 40 87.6 44.1 18 93.1 - 97.2 - UTS0 + UTS6 A B UTS7 + UTS6 C D • Slide accessories on the cable (make sure to keep compression ring on the grommet) • Strip external cable jacket • Strip wires and crimp contacts • Insert fi rst contact into the grommet (fi rst contact in cavity A, the contact pierces the grommet, no tool is required), then insert the contact in the connector cavity A (insert manually or use tool RTM205) • Place the grommet and compression ring on the insulator • Insert the other contacts • Tight adapter with plug, choose right seal (waste the other seal), tight nut with adapter (recommended torque values to be applied according to the table - right). Nut Adapter + mounted gasket Grommet + Compression ring Optional coding ring Shell size Recommended jacket strip length (mm) Adapter tightening torque (Nm) Nut tightening torque (Nm) Ø Cable range Standard seal Ø Cable range Reducing seal Ø Wire Male Female 10 21 29 1.5 2 2.5/8.0 1.5/5.0 from 1.7 mm to 3.0 mm 12 25 33 2 2.5 5.0/12.0 3.0/9.0 14 29 36 3 2.5 7.0/14.0 5.0/12.0 UTS Series Technical information UTS 1 GJC / UTS 6 GJC assembly Mated connector length Note: all dimensions are in mm Technical information 162 © 2011 – SOURIAU Extraction: Place the tool into the cavity from front face of the connector, push on the handle, then remove the contact.. Special case with the tool RX2025GE1: A - When setting up in the cell, keep fi rmly the tool by the hexagonal metallic part and insert tool in cavity. B - Push the tool by the handle to extract the contact. UTS Series Technical information 51060210924 51060210936 RX2025GE1 Contact size Extractor #20 RX20D44 #16 RX2025GE1 #12 51060210924 #8 51060210936 L L1 Shell size UTS0 UTS7 L max L1 max L2 max L3 max L max L1 max L2 max L3 max 8 42.8 36.8 80.7 57.2 46.8 36.8 85.8 57.2 10 55.8 50.3 98.6 92 60.5 50.3 102.7 92 12 57.1 51.4 99.3 93.7 61.4 51.4 106.4 93.7 14 62.5 56.3 100.3 94.6 67.6 56.3 104.8 94.6 L2 L3 Dimensions overmoulded harnesses Extraction tools Extraction tools instruction for size 16 RX20D44 © 2011 – SOURIAU 163 Rated current & working voltage The current carrying capacity of a connector is limited by the thermal properties of materials used in it's construction. The amount of current that can be handled depends on the size of cable used, the ambient temperature and the heat that is generated inside the connector. Part 3 of the IEC 60512 standard determines through a derating curve, the maximum current permissible, which varies from one layout to another (Fig.1 & Fig.2). Wire size plays an important role as well, since they help to dissipate heat and avoid overheating (Fig.1 & Fig.3). Please note that the curve should be adjusted when dealing with potential hot spots, which can occur as a result of unequal loading of current across a number of contacts. As a general rule, it is best to avoid locating power handling contacts in the middle of the connector; try to locate them towards the edge where heat can be dissipated more effectively. Eventually you should fi nd a level which represents the permissible operating range: The rated current is defi ned as uninterrupted continuous current that a connector can take when all contacts are energized simultaneously without exceeding the maximum limit of temperature. The earth contact is never loaded. 0 20 40 60 80 100 120 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) Fig.1: UTS 12-4 – 1.5mm² wires 0 20 40 60 80 100 120 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) Fig.2: UTS 12-8 – 1.5mm² wires Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) Fig.3: UTS 12-4 – 2.5mm² wires 33 35 UTS Series Technical information Current carrying capacity Technical information 164 © 2011 – SOURIAU Solar radiation affects all materials, but plastics can be susceptible to extreme degradation over time. The choice of materials for the UTS series was therefore a critical consideration. All over the world we are not exposed to the same amount of energy given by the sun. The chart shown here clearly illustrates this. So we performed test according to the ISO 4892-2 and simulated 5 years exposure to outdoor environments (temperature, humidity, etc...) After this period there was no signifi cant colour variation, no crazing, no cracking and no major variation of mechanical properties. Yearly mean of daily irradiation in UV (280-400 nm) on horizontal plane (J/cm²) (1990-2004) 90° 60° 30° 0° - 30° - 90° - 60° - 180° - 150° - 120° - 90° - 60° - 30° 0° 30° 60° 90° 120° 150° 180° J/cm² 0 10 20 30 50 60 70 80 90 100 110 120 130 150 160 170 180 190 40 140 UTS Series Technical information UV resistance © 2011 – SOURIAU 165 There are two main standards for industrial connectors: UL94 & UL1977 UL94 This standard is dedicated to plastics fl ammability. It characterises how the material burns in various orientation and thicknesses. The UTS series has been rated at V-0 & HB. Procedure: A specimen is supported in a vertical or horizontal position and a fl ame is applied to the bottom of the specimen. The fl ame is applied for ten seconds and then removed until fl aming stops, at which time the fl ame is reapplied for another ten seconds and then removed. Two sets of fi ve specimens are tested. The two sets are conditioned under different conditions. V-0 Vertical burning: • Specimens must not burn with fl aming combustion for more than 10 seconds after either test fl ame application. • Total fl aming combustion time must not exceed 50 seconds for each set of 5 specimens. • Specimens must not burn with fl aming or glowing combustion up to the specimen holding clamp. • Specimens must not drip fl aming particles that ignite the cotton. • No specimen can have glowing combustion remain for longer than 30 seconds after removal of the test fl ame. ~~ 5’’ 12’’ 45° Cotton Material Underwriter Laboratories HB Horizontal burning: • A material classed HB shall not have a burning rate exceeding 40 mm per minute over a 75 mm span for specimens having a thickness of 3.0 to 13 mm. • A material classed HB shall not have a burning rate exceeding 75 mm per minute over a 75 mm span for specimens having a thickness less than 3.0 mm. • A material classed HB shall cease to burn before the 100 mm reference mark. 45° 45° Material 100±1mm 25±1mm 10±1mm Wire gauze Wire gauze UTS Series Technical information Technical information 166 © 2011 – SOURIAU Underwriter Laboratories UL1977 There are several standards which deal with plug and receptacle. Each of them is only for a small area of applications. It could be telecommunication, Etc. The UL 1977 covers single and multipole connectors intended for factory assembly. Requirements apply to devices in taking into account intensity and voltage. There a categories as follows: Type 0 Type 1A Tybe 1B Type 2 Type 3 Type 4 0 0 8.3 A 31 A 200 A 1000 A 600 V 30 V (42 V peak) According to above table, the level of performance that has to be reached could be different. Most of them are explained in the following page. Assembly: Connector has to be keyed to prevent any mismating that can damage the machine or hurt the user. In the same way, plugs and sockets have to be equipped to protect persons against contact with live parts. Finally the identifi ed grounding contact shall be located so that the corresponding electrical continuity has to be completed before any other contact. Insulating materials: Material uses for electrical insulation, as a minimum, have to comply with the characteristics shown below: • Minimum ratings for polymeric materials Type Flame rating Relative thermal index (RTI) Electrical/mechanical w/o impact */** 0 - 50/50 1A HB 50/50 1B HB 50/50 2 HB 50/50 3 HB 50/50 4 HB 50/50 * The RTI of the material shall not be lower than the temperature measured during the Temperature Test. ** For a thickness less than that for which a value has been established, the RTI of the minimum thickness with an established value shall be used. UTS Series Technical information © 2011 – SOURIAU 167 Underwriter Laboratories UL1977 Spacing: For a 250V max connector, distance through air or over material shall be 1.2mm whereas from 250V to 600V connector the spacing is 3.2 minimum. These distances have to be taken between uninsulated live parts as shown in the matrix below: An alternative way to determine voltage rating is with the Dielectric-Withstand test. If during one minute there is no arc-over or breakdown the rated voltage is given as given below: a) 500 volts for a type 1B device b) 1000 volts plus twice rated voltage for types 1A, 2, 3 and 4 devices. • Applicability of spacing requirements Type Uninsulated live part - uninsulated live part of opposite polarity Uninsulated live part - uninsulated grounded metal part Uninsulated live part - exposed dead metal part 0 No No No 1A Yes Yes Yes 1B Yes Yes No 2 Yes Yes Yes 3 Yes Yes Yes 4 Yes Yes Yes Marking: A device shall be legibly marked with the manufacturer's trade name, trade mark, or other descriptive marking by which the organisation responsible for the product may be identifi ed. (Exception: If the device is too small, or where the legibility would be diffi cult to attain, the manufacturer’s name, trademark, or other descriptive marking may appear on the smallest unit container or carton) The following shall be marked on the device or on the smallest unit container or carton or on a stuffer sheet in the smallest unit container or carton: a) The catalogue number or an equivalent designation b) The electrical rating in both volts and amperes, if assigned c) Whether ac or dc, if restricted d) Flammability class, if identifi ed Example - Marking for the arrangement 10-3: 10A 500V UL94 V-0 UTS Series Technical information Technical information 168 © 2011 – SOURIAU The norm is dedicated to connectors with rated voltage above 50V and up to 1000V and rated currents up to 125A per contact. But depending of your application connectors should be compliant with another standard. This has to be double checked with the customer. There are lot of constructional requirements and performances specifi ed in that standard. Most of them are illustrated in greater details hereafter. Provisions for earthing: The UTS connector is intended to be used on Class II systems. Even if the purpose of our connector is not to interrupt current, we often see a need to add a protective earth contact. Then this one shall be a “First mate, last break” style. Critically, among all of the normal assumptions we make in designing a connector, this contact has to be considered as a live part and must be protected against electric shock by double or reinforced insulation. IP Code: IP is a coding system defi ned by the IEC 60529 to indicate the degrees of protection provided by an enclosure. The aim of this is to give information regarding the accessibility of live parts against ingress of water and other foreign bodies. 1st digit Degree of protection 2nd digit Degree of protection 0 No protection against accidental contact. No protection against solid foreign bodies. 0 No protection against water. 1 Protection against contacts with any large area by hand and against large solid foreign bodies with a diameter bigger than 50 mm. 1 Drip-proof. Protection against vertical water drips. 2 Protection against contacts with the fi ngers. Protection against solid foreign bodies with a diameter bigger than 12 mm. 2 Drip-proof. Protection against water drips up to a 15° angle. 3 Protection against tools, wires or similar objects with a diameter bigger than 2.5 mm. Protection against small solid bodies with a diameter bigger than 2.5 mm. 3 Spray-proof. Protection against diagonal water drips up to a 60° angle. 4 As 3 however diameter is bigger than 1 mm. 4 Splash-proof. Protection against splashed water from all directions. 5 Full protection against contacts. Protection against interior injurious dust deposits. 5 Hose-proof. Protection against water (out of a nozzle) from all directions. 6 Total protection against contacts. Protection against penetration of dust. 6 Protection against temporary fl ooding. 7 Protection against temporary immersions. 8 Protection against water pressure. Pressure to be specifi ed by supplier. 9K High pressure hose-proof. Protection against high pressure water (out of a nozzle) from all directions. IP 6 8 First digit (foreign bodies protection) Second digit (water protection) Code letters (international Protection) UTS offers high sealing performance IP68 / 69K… Even in dynamic situations. In addition to the IEC 60529 we conjointly use the DIN 40050 part 9 which are dedicated to road vehicles. The main differences are: • First digit: 5 replaced by 5K, 6 by 6K. In the DIN the tested equipment is not depressurized as it is in the IEC. • Second digit: 5K and 6K has been added and are equivalent respectively to 5 and 6 but with higher pressure. 9K which represents the High pressure cleaning. IEC 61984 ed.2.0 “Copyright © 2008 IEC Geneva, Switzerland.www.iec.ch" IEC 60664-1 ed.2.0 “Copyright © 2007 IEC Geneva, Switzerland.www.iec.ch” UTS Series Technical information IEC 61984 © 2011 – SOURIAU 169 Overvoltage UTS connectors are qualifi ed to be used on systems rated at Overvoltage category III Per the IEC 60664-1 (formely VDE 0110) each category is linked to the end application and where the device will be implemented: • Category IV (primary overcurrent protection equipment): Origin of the installation • Category III (Any fi xed installation with a permanent connection) Fixed installation and equipment and for cases where the reliability and the availability is subject to special requirements • Category II (Domestic applicances): Energy consuming equipment to be supplied from the fi xed installation • Category I (Protected electronic circuit): For connection to circuit in which measures are taken to limit transient overvoltage. Pollution degree Per the IEC 60664-1 (formerly VDE 0110) the environment affects the performance of the insulation. Particles can build a bridge between two metal parts. As a rule dust mixed with water can be conductive and more generally speaking metal dust is conductive. Finally, the standard defi nes 4 levels of pollution: • Degree 1 (Air conditioned dry room): No pollution or only dry, non conductive pollution occurs. The pollution has no infl uence. • Degree 2 (Personal computer in a residential area): Only non conductive pollution occurs except that occasionally a temporary conductivity caused by condensation is to be expected. • Degree 3 (Machine tools): Conductive pollution occurs or dry non-conductive pollution occurs which becomes conductive due to condensation which is to be expected. • Degree 4 (Equipments on roof, locomotives): Continuous conductivity occurs due to conductive dust, rain or other wet conditions. Finally, the harsher the environment is, the longer clearance and creepage distances should be. Nonetheless, according the IEC 61984, enclosure rated at IP54 or higher can be dimensioned for a lower pollution degree. This applies to mated connectors disengaged for test and maintenance. Marking The marking should give enough details to the user to know what the main characteristics are and without going deep in technical documentation. Below examples identify the suitability of the connector: • Example 1: Marking of a connector with rated current 16A, rated voltage 400V, rated impulse voltage 6kV and pollution degree 3, 2 and 1 for use in any system, preferably unearthed or delta-earthed systems: 16A 400V 6kV 3 • Example 2: Marking of a connector with rated current 16A, rated insulation voltages line-to-earth 250V, line-to-line 400V, rated impulse voltage 4kV and pollution degree 3, 2 and 1 for use in earthed systems: 1166AA 225500VV 440000VV 44kkVV 33 16A 400V 6kV 3 UTS Series Technical information IEC 61984 Technical information 170 © 2011 – SOURIAU Enclosure rating IP20 IP22 IP55 IP64 IP65 IP66 IP67 Type 1 • Type 3 • Type 3R • Type 3S • Type 4 • Type 4X • Type 6 • Type 12 • Type 13 • • indicates compliance 6 IP67 Enclosures constructed for either indoor or outdoor use to provide a degree of protection to personnel against incidental contact with the enclosed equipment, falling dirt, hosedirected water, the entry of water during occasional temporary submersion at a limited depth and damage from external ice formation. 6P IP67 Enclosures constructed for either indoor or outdoor use to provide a degree of protection to personnel against incidental contact with the enclosed equipment, falling dirt, hose-directed water, the entry of water during prolonged submersion at a limited depth and damage from external ice formation. Type 6 rating can be either Type 6 or Type 6P - please see below: • NEMA ratings vs IP ratings Whereas IP ratings only consider protection against ingress of foreign bodies - first digit - and ingress of water (second digit), NEMA ratings consider these but also verify protection from external ice, corrosive materials, oil immersion, etc. The correlation between NEMA & IP being limited only to dust and water, we can state that a NEMA type is equivalent to an IP rating but it is not possible to say the contrary. Below a list of some NEMA standards: UTS Series Technical information What is NEMA rating ? © 2011 – SOURIAU 171 Ethernet Basics Ethernet is a widely used communications protocol that is used to transmit data packets (datagrams) between network devices. Imagine a highway in a large metropolitan area six lanes wide at rush hour. The vehicles on the highway need rules to follow so that they get to their destination without crashing into each other. In an Ethernet network link, there could be 100 million bits of information transmitted in one second. In the Ethernet standard, there exist rules to govern packet structure, transmission requirements, error correction, communication with end equipment, etc. Examining the differences between 100Mhz, 100 Base TX, Cat5e; what does it all mean? When discussing connectors and Ethernet, there are a few key details to be aware of: • 100Mhz is a measurement of Frequency for the signal - Comparable to the Speed Limit of a highway • 100BaseTX (or Fast Ethernet) is an Ethernet link standard and identifi es available link bandwidth The bandwidth is measured in units of MBits/S (megabits per second) - Comparable to the number of cars that pass a point in one second • Cat5e is an EIA/TIA standard for performance and physical characteristics for cables and connectors - Comparable to performance specifi cations of the car and highway In connectors and cables, Fast Ethernet uses 2 pairs, one for transmit, one for receive. This, way data traffi c can fl ow in both directions simultaneously. In order to explain basic Ethernet theory, we can use a functional comparison to a busy city with highways, buildings, and cars. To illustrate this, the table below provides correlation between the different components/pieces/links that encompass Ethernet network connectivity, and the larger scale infrastructure of a metropolitan city. • City: The network itself • Buildings: End equipment, PC, server, etc. • Roads: Ethernet cabling • Cars: Data packets, datagrams, bits, bytes, etc. • Tolls: Firewalls • Bridges: Connectors • Traffi c laws: Protocol/communication specifi cations UTS Series Technical information Ethernet for the layman Technical information 172 © 2011 – SOURIAU Souriau offering: UTS Hi seal size 8, 4 contacts 1 (Pair 1) ‹ A 2 (Pair 1) ‹ C 3 (Pair 2) ‹ B 4 (Pair 2) ‹ D UTS size 10, 6 contacts 1 (Pair 1) ‹ A 2 (Pair 1) ‹ B 3 (Pair 2) ‹ E 4 (Pair 2) ‹ D UTS size 12, 10 contacts 1 (Pair 1) ‹ C 2 (Pair 1) ‹ B 3 (Pair 2) ‹ G 4 (Pair 2) ‹ H Standard solutions. 8E4/8D4 4 Ø 1 (#20) 106/10E6/10D6 6 Ø 1 (#20) 1210/12E10/12D10 10 Ø 1 (#20) What about using coax contacts ? Ethernet twisted pairs carry a symmetrical (balanced) signal. Once terminated into a coax contact, the inner core will be protected by a shield - but not the outer contact. Because of EMI issues, the signal will no longer be balanced. Conclusion - it does not work and is not recommended. Conclusion To carry 100Mb/s data signal, 100BaseTX or Fast Ethernet recommends the use of Cat5e connectors as well as Cat5e cable with the support of a 100MHz signal. Nevertheless, a 100Mb/s signal can be transmitted in certain conditions (short distance, only one connector, lower frequency but a different code) thru many other connection materials - not necessarily Cat5e rated. What about using Quadrax contacts ? The Quadrax contact is used in railway applications because of the use of quad cable. In this specifi c market, the standard Ethernet twisted pairs wires cannot be offered, they are too thin and often solid (not stranded). In the rest of industry, UTP (Unshielded Twisted Pairs) cables are widely used. The Quadrax contact is not designed to terminate them. And thus, are not advised for industrial applications. Shielding continuity done in cavity C&F. Note: Shielding can be replaced by DC power. UTS Series Technical information Ethernet for the layman © 2011 – SOURIAU 173 UTS Series Technical information Technical information UTS Series © 2011 – SOURIAU 175 Appendices UTS Series #16 coaxial contacts - cabling notices ................................................................................... 176 Glossary of terms ........................................................................................................................... 183 Discrimination/Keying methods ................................................................................................ 184 Part number Index ......................................................................................................................... 185 176 © 2011 – SOURIAU UTS Series Appendices #16 coaxial contacts Cable type Impedance Contact type Ø over jacket Ø over dielectric Inner cond size Ø outer braid Male contact kit for coaxial cable Female contact kit for coaxial cable inch mm inch mm Ext. Ø mm inch mm RG161/U 75 Multi piece 0.09 2.29 0.057 1.45 RMDXK10D28 RCDXK1D28 RG179A/U 75 0.105 2.67 0.063 1.6 0.3 0.084 2.13 max RG179B/U 75 0.105 2.67 0.063 1.6 0.3 0.084 2.13 max RG187/U 75 0.11 2.79 max 0.06 1.52 0.3 RG188/U 50 0.11 2.79 max 0.06 1.52 0.51 0.078 1.98 max RG174/U 50 0.11 2.92 0.06 1.52 0.48 0.088 2.24 max AMPHENOL 21-598 50 0.105 2.67 0.06 1.52 0.48 RG196/U 50 0.08 2.03 max 0.034 0.086 0.3 RG178A/U 50 0.075 1.91 0.034 0.86 0.3 0.054 1.37 max RG/188A/U 50 Mono crimp 0.110 2.79 0.06 1.52 0.51 0.078 1.98 max RMDX6036D28 RCDX6036D28 KX21TVT (europe) RG178 B/U 50 0.075 1.91 0.034 0.86 0.3 0.054 1.37 max RMDX6034D28 RCDX6034D28 RG178 / BU 50 0.075 1.91 0.034 0.86 0.3 0.054 1.37 max RMDX6050D28 RCDX6016D28 RG174/U 50 0.115 2.92 0.06 1.52 0.48 0.088 2.24 max RMDX6032D28 RCDX6032D28 RG188A/U 50 0.11 2.79 0.06 1.52 0.51 0.078 1.98 max RMDX6036D28 RCDX6036D28 RG316/U 50 0.107 2.72 0.6 1.52 0.51 0.078 2.05 max RMDX6036D28 RCDX6036D28 raychem 5024A3111 50 0.12 3.05 0.083 2.11 0.64 0.097 2.46 RMDX6052D28 RCDX6052D28 raychem 5026e1614 50 0.083 2.11 0.05 1.27 0.48 0.067 1.7 RMDX6036D28 RCDX6036D28 surprenant pn 8134 - Multi piece 0.1 2.54 0.058 1.47 0.3 RMDXK10D28 RCDXK1D28 PRD PN 247ASC1123- 001 - Mono crimp 0.103 2.62 0.06 1.52 0.51 0.078 1.98 RMDX6018D28 RCDX6018D28 PRD PN 247AS-C1251 - 0.092 2.34 0.05 1.27 0.64 0.067 1.7 RMDX6018D28 RCDX6018D28 JUDD C15013010902 - 0.087 2.13 0.05 1.27 0.48 0.066 1.67 RMDX6036D28 RCDX6036D28 CDC PIN22939200 - 0.09 2.29 0.048 1.22 0.3 0.064 1.63 RMDX6046D28 RCDX6016D28 CDC PIN22939200 - 0.09 2.29 0.048 1.22 0.3 0.064 1.63 RMDX6050D28 RCDX6016D28 CDC PIN245670000 - 0.104 2.64 0.067 1.7 0.3 0.083 2.11 RMDX6050D28 RCDX6016D28 ampex - 0.114 2.9 0.075 1.91 0.38 0.09 1.29 RMDX6032D28 RCDX6032D28 TI PN 920580 - 0.7 1.78 0.038 0.96 0.48 0.054 1.37 RMDX6024D28 RCDX6024D28 Honeywell PN 58000062 - 0.12 3.05 0.077 1.96 0.41 solid 0.096 2.44 RMDX6026D28 RCDX6026D28 - - 0.104 2.64 0.067 1.7 0.3 2.11 RMDX6050D28 - - - 0.09 2.29 0.048 1.22 0.3 1.63 RMDX6050D28 - - - 0.114 2.9 0.075 1.91 0.38 1.29 RMDX6032D28 RCDX6032D28 - - 0.07 1.78 0.038 0.96 0.48 1.37 RMDX6024D28 RCDX6024D28 - - 0.12 3.05 0.077 1.96 0.41 2.44 RMDX6026D28 RCDX6026D28 Coaxial cable - Contact monocrimp and multipiece © 2011 – SOURIAU 177 UTS Series Appendices Cable type Contact type Inner AWG cond Ø over jacket (single wire) Inner cond size Ø outer braid Male contact kit for coaxial cable Female contact kit for coaxial cable inch mm Stranded defi nition Ext. Ø mm inch mm 2#24 stranded mil w 16878 type B Multi piece 24 0.049 1.24 max 7/.008 - - RMDXK10D28 RCDXK1D28 2 #24 solid mil-w-76 type LW 24 0.047 1.12 max 1/.0201 - - RMDXK10D28 RCDXK1D28 2 #26 stranded mil w 76 type LW or mil w16878 type b&e 26 0.043 1.09 max 7/.0063 0.16 - - RMDXK10D28 RCDXK1D28 2 #28 solid mil-w-81822/3 28 0.028 0.71 max - - RMDXK10D28 RCDXK1D28 TWISTED PAIR 1/.201 SOLID MIL w 76 TYPE lw or MIL W 16878 26 0.044 1.12 max 1/.0201 0.511 - - RMDXK10D28 RCDXK1D28 twisted pair solid mil w 81822/3 28 0.028 0.71 max 1/.0126 0.32 - - RMDXK10D28 RCDXK1D28 #28 7/.0036 per Hitachi spec ec-711 (13-2820) Mono crimp - 0.046 1.17 7/.0036 - - - RMDX6031D28 + YORX090 RCDX6031D28 + YORX090 20218201 - 0.028 0.71 - - - - RMDX6031D28 + YORX090 RCDX6031D28 + YORX090 #30 solid - 0.025 0.64 - - - - RMDX6015D28 + YORX090 RCDX6015D28 + YORX090 #26 7/.0063 26 0.028 0.71 7/.063 0.16 - - RMDX6031D28 + YORX090 RCDX6031D28 + YORX090 #26 19/.004 26 0.049 1.24 19/.004 - - - RMDX6019D28 + YORX090 RCDX6019D28 + YORX090 #24 7/.008 24 0.049 1.24 7/.008 - - - RMDX6019D28 + YORX090 RCDX6019D28 + YORX090 #24 19/.005 24 0.057 1.45 19/.005 - - - RMDX6019D28 + YORX090 RCDX6019D28 + YORX090 - 26 - 1.25 - - - 19x0.1 RMDX6019D28 + YORX090 RCDX6019D28 + YORX090 - 24 - 1.25 - - - 7x0.2 RMDX6019D28 + YORX090 RCDX6019D28 + YORX090 - 24 - 1.45 - - - 19x0.13 RMDX6019D28 + YORX090 RCDX6019D28 + YORX090 - 26 - 0.7 - - - 7x0.16 RMDX6031D28 + YORX090 RCDX6031D28 + YORX090 Twisted cable - Contact monocrimp and multipiece Appendices 178 © 2011 – SOURIAU Twisted pair cable multipiece contact cabling UTS Series Appendices #16 coaxial contacts Cable reference Contact type Male contact Female contact Crimp tool Die set Stop bushing Cable strip length Inner conductor crimp Braid crimp A B C g dim t dim g dim t dim 2#24 stranded mil w 16878 type B Multi piece RMDXK10D28 RCDXK1D28 M10S1J - - See assembly notice 2 #24 solid mil-w-76 type LW 2 #26 stranded mil w 76 type LW or mil w16878 type B & E 2 #28 solid mil-w-81822/3 twisted pair 1/.201 solid mil w 76 type LW or mil w 16878 twisted pair solid mil w 81822/3 Male contact Outer male contact RMDX60-2 Inner socket RFD26L-1 Outer hyring YOC074 Inner supporting sleeve RMDXB-055-3 Twisted pair adapter YORK-090 Conductor "Y" Conductor "Z" Strip lengths of cable 7.95±0.41 15.54±0.41 7.95±0.41 Inner supporting Outer hyring sleeve Twisted pair adapter Locking louver typical Grounding louver typical Step 1: Step 2: Step 3: 7.54 0.25±0.05 5.94±0.41 7.54±0.41 15.54±0.41 7.95±0.41 When using solid wire fl atten conductor "X" and "Z" using N24FL-1 die as shown Female contact Step 1: Step 2: Step 3: Outer hyring Supporting sleeve Twisted pair adapter Conductor "W" Conductor "X" Strip lengths of cable 6.35±0.41 13.49±0.41 7.95±0.41 Outer female contact RCDX60-2 Inner pin RMD26L-1 Outer hyring YOC074 Inner supporting sleeve RCDXB-055-1 Twisted pair adapter YORK-090 Note : all dimensions are in mm © 2011 – SOURIAU 179 Twisted pair cable monocrimp contact cabling UTS Series Appendices Cable reference Contact type Male contact Female contact Crimp tool Die set Stop bushing Cable strip length Inner conductor crimp Braid crimp A B C g dim t dim g dim t dim #28 7/.0036 per Hitachi spec ec-711 (13-2820) Mono crimp RMDX6031D28 + YORX090 RCDX6031D28 + YORX090 M10S1J S80 SL105 4.7 6.1 4.32 1.30 to 1.12 1.4 to 1.22 2.97 to 2.84 3.07 to 2.9 20218204 S80 SL105 3.94 6.1 3.16 1.30 to 1.17 1.4 to 1.22 2.97 to 2.84 3.07 to 2.79 #30 solid S83 SL105 4.7 6.1 4.06 1.22 to 1.12 1.35 to 1.22 2.97 to 2.84 3.12 to 2.95 #26 7/.0063 S80 SL105 4.7 6.1 4.06 1.30 to 1.17 1.4 to 1.22 2.97 to 2.84 3.07 to 2.9 #26 19/.004 M10SG8 ASSY'Y TOOL DIE SET STOP BUSHING M10S1J TOOL 4.7 6.1 4.06 1.22 to 1.17 1.35 to 1.22 2.84 to 2.79 3.12 to 2.97 #24 7/.008 4.7 6.1 4.06 1.22 to 1.17 1.35 to 1.22 2.84 to 2.79 3.12 to 2.97 #24 19/.005 4.7 6.1 4.06 1.22 to 1.17 1.35 to 1.22 2.84 to 2.79 3.12 to 2.97 AWG26 (19x0.1) M10SG8 crimping kit 4.7 6 4 AWG24 (7x0.2) AWG24 (19x0.13) AWG26 (7x0.16) S80 SL150 G G Braid crimp (G) to be measured with die set fully closed Inner conductor crimp (G) to be measured with die set fully closed RCDX60 Female coax contact RMDX60 Male coax contact See cable strip lengths Cable strip length A B C 16 min. • Select appropriate monocrimp coax twisted pair contact and cable combination. • Select appropriate crimp tooling (hand tool, S-die set, stop bushing). • Strip the twisted pair cable to the designated wire strip lengths. • Insert the stripped cable into the contact. One cable is to be inserted into the inside diameter of hyring, and pushed forwaerd into the inner contact. The second cable is to be inserted between the outside diameter of hyring and the inside diameter of the outer contact body. • Crimp the contact. Note : all dimensions are in mm Appendices 180 © 2011 – SOURIAU Multipiece male contact with coax cable UTS Series Appendices Multipiece kit details RMDXK10D28 includes RMDX602D28 Outer contact RFD26L1D28 Inner contact YOC074 Outer hyring RMDXB0553 Inner supporting sleeve Cable stip length A B C Dielectric diameter Contact assembly with dielectric diameter over 1.4mm - without inner supporting sleeve Outer male contact RMDX60-2 Inner socket RFD26L-1 Outer hyring YOC074 Strip lengths of cable 15.88±0.41 4.37±0.41 7.95±0.41 Step 1: - Assemble outer hyring onto cable - Assemble inner socket to inner conductor and crimp Step 2: - Insert the assembly into the outer male contact until the inner socket snaps into place - The cable braid (shield) should now cover the barrel of the outer male contact as shown Step 3: - Slide outer hyring forward against spring and crimp in place as shown Locking louver typical Grounding louver typical Contact assembly with dielectric diameter under 1.4mm - with inner supporting sleeve Outer male contact RMDX60-2 Inner socket RFD26L-1 Outer hyring YOC074 Strip lengths of cable 17.53±0.41 7.54±0.41 Inner supporting 9.12±0.41 sleeve RMDXB-055-3 Step 1: - Assemble outer hyring onto cable - Assemble supporting sleeve over dielectric and under braid - Assemble inner socket to inner conductor, push back against sleeve and crimp Supporting sleeve Outer hyring Step 2: - Insert the assembly into the outer male contact until the inner socket snaps into place - The cable braid (shield) should now cover the barrel of the outer male contact as shown Step 3: - Slide outer hyring forward against spring and crimp in place as shown Locking louver typical Grounding louver typical Note : all dimensions are in mm #16 coaxial contacts Cable reference Contact Hyring complementary compoments Outer contact crimp tool Inner contact crimp tool Crimp tool M10S1J Crimp tool M10S1J Cable strip length Die set Stop bushing Die set Stop bushing A B C RG161U Male: RMDXK10D28 YOC074 S221 SL471 S23D2 SL46D2 4.37 7.95 15.88 RG179 4.37 7.95 15.88 RG187U 4.37 7.95 15.88 RG188/U S26D2 4.37 7.95 15.88 RG174/U 4.37 7.95 15.88 RG178A/U YOC074 + RMDXB0553 S23D2 7.54 9.12 17.53 RG196U 7.54 9.12 17.53 AMPHENOL 21-598 YOC074 - 4.37 7.95 15.88 surprenant pn 8134 - 4.37 7.95 15.88 © 2011 – SOURIAU 181 Multipiece female contact with coax cable UTS Series Appendices Contact assembly with dielectric diameter over 1.4mm - without inner supporting sleeve Outer female contact RCDX60-2 Inner pin RMD26L-1 Outer hyring YOC074 Strip lengths of cable 11.13±0.41 4.37±0.41 Step 1: - Assemble outer hyring onto cable - Assemble inner pin to inner conductor and crimp Step 2: - Insert the assembly into the outer female contact until the inner pin snaps into place - The cable braid (shield) should now cover the barrel of the outer female contact as shown Step 3: - Slide outer hyring forward against spring and crimp in place as shown Contact assembly with dielectric diameter under 1.4mm - with inner supporting sleeve Outer female contact RCDX60-2028 Inner pin RMD26L-1 Outer hyring YOC074 Strip lengths of cable 11.13±0.41 6.35±0.41 Supporting sleeve RCDXB-055-1 Supporting Outer hyring sleeve Step 1: - Assemble outer hyring onto cable - Assemble supporting sleeve over dielectric and under braid - Assemble inner pin to inner conductor, push back against sleeve and crimp Step 2: - Insert the assembly into the outer female contact until the inner pin snaps into place - The cable braid (shield) should now cover the barrel of the outer female contact as shown Step 3: - Slide outer hyring forward against spring and crimp in place as shown RCDXK1D28 includes RCDX602D28 Outer contact RMD26L1D28 Inner contact YOC074 Outer hyring RCDXB0553 Inner supporting sleeve Multipiece kit details Cable stip length A B C Dielectric diameter Cable reference Contact Hyring complementary compoments Outer contact crimp tool Inner contact crimp tool Crimp tool M10S1J Crimp tool M10S1J Cable strip length Die set Stop bushing Die set Stop bushing A B C RG161U Female: RCDXK1D28 YOC074 S221 SL471 S23D2 SL46D2 4.37 - 11.13 RG179 4.37 11.13 RG187U 4.37 11.13 RG188/U S26D2 4.37 11.13 RG174/U 4.37 11.13 RG178A/U YOC074 + RMDXB0553 S23D2 6.35 11.13 RG196U 6.35 11.13 AMPHENOL 21-598 YOC074 - 4.37 11.13 surprenant pn 8134 - 4.37 11.13 Note : all dimensions are in mm Appendices 182 © 2011 – SOURIAU Coax cable with monocrimp contact cabling UTS Series Appendices RCDX60 Female coax contact RMDX60 Male coax contact See cable strip lengths Cable strip length A B C • Select appropriate cable and contact combination. • Select appropriate crimp tooling (hand tool, S-die set, stop bushing). • Strip coax cable to the designated wire strip lengths. • Insert the stripped coax into the rear of the contact. • Crimp the contact. #16 coaxial contacts Cable reference Male contact Female contact Crimp tool Die set Stop bushing Cable strip length Inner conductor crimp Braid crimp A B C g dim t dim g dim t dim CDC PIN22939200 RMDX6046D28 RCDX6016D28 M10S1J S80 SL105 4.19 5.97 8.51 1.30/1.17 1.40/1.22 2.77/2.64 3.02/2.84 CDC PIN22939200 RMDX6046D28 RCDX6016D28 S87 SL105 5.08 6.35 8.89 1.30/1.17 1.40/1.22 2.77/2.64 3.02/2.84 CDC PIN245670000 RMDX6050D28 RCDX6016D28 S80 SL105 5.08 6.35 8.89 1.30/1.17 1.40/1.22 2.97/2.84 3.12/2.95 KX21TVT (europe) RG178 B/U RMDX6034D28 RCDX6034D28 S82 SL105 5.08 6.35 8.89 1.30/1.17 1.32/1.17 2.84/2.74 3.07/2.9 RG178 / BU RMDX6050D28 RCDX6016D28 S87 SL105 5.08 6.35 8.89 1.30/1.17 1.40/1.22 2.77/2.64 3.02/2.84 ampex RMDX6032D28 RCDX6032D28 S80 SL105 5.08 6.35 11.68 1.30/1.17 1.40/1.22 2.97/2.84 3.12/2.95 TI PN 920580 RMDX6024D28 RCDX6024D28 S82 SL105 5.08 6.35 8.89 1.35/1.19 1.42/1.27 2.87/2.74 3.07/2.9 RG174/U RMDX6032D28 RCDX6032D28 S80 SL105 5.08 6.35 11.68 1.30/1.17 1.40/1.22 2.97/2.84 3.12/2.95 Honeywell PN 58000062 RMDX6026D28 RCDX6026D28 S82 SL105 5.08 6.35 8.89 1.35/1.19 1.42/1.27 2.87/2.74 3.07/2.9 RG188A/U RMDX6036D28 RCDX6036D28 S80 SL105 5.08 6.35 11.68 1.30/1.17 1.40/1.22 2.97/2.84 3.12/2.95 RG316/U RMDX6036D28 RCDX6036D28 S80 SL105 5.08 6.35 11.68 1.30/1.17 1.40/1.22 2.97/2.84 3.12/2.95 PRD PN 247AS-C1123-001 RMDX6018D28 RCDX6018D28 M10SG8 ASSY'Y TOOL DIE SET STOP BUSHING M10S1J TOOL 5.08 6.35 8.89 1.22/1.17 1.35/1.22 2.92/2.79 3.12/2.97 PRD PN 247AS-C1251 RMDX6018D28 RCDX6018D28 5.08 6.35 8.89 1.22/1.17 1.35/1.22 2.92/2.79 3.12/2.97 raychem 5024A3111 RMDX6052D28 RCDX6052D28 S88 SL105 5.08 6.35 11.68 1.37/1.27 1.45/1.32 2.92/2.79 raychem 5026e1614 RMDX6036D28 RCDX6036D28 M10SG8 ASSY'Y TOOL DIE SET STOP BUSHING M10S1J TOOL 5.08 6.35 8.89 1.22/1.17 1.35/1.22 2.92/2.79 3.12/2.97 JUDD C15013010902 RMDX6036D28 RCDX6036D28 5.08 6.35 8.89 1.22/1.17 1.35/1.22 2.92/2.79 3.12/2.97 inner cond. #30, braid diam 2.64 RMDX6050D28 - S80 SL105 5.1 6.35 8.9 - - - - inner cond. #30, braid diam 2.29 RMDX6050D28 - S87 SL105 4.2 6.35 8.5 - - - - inner cond. #28, braid diam 2.9 RMDX6032D28 RCDX6032D28 S80 SL105 5.1 6.35 11.7 - - - - inner cond. #26, braid diam 1.78 RMDX6024D28 RCDX6024D28 S82 SL105 5.1 6.35 8.9 - - - - inner cond. #26, braid diam 3.05 RMDX6026D28 RCDX6026D28 S82 SL105 5.1 6.35 8.9 - - - - Note : all dimensions are in mm © 2011 – SOURIAU 183 Glossary of terms UTS Series Appendices • Clearance Per the IEC 60664-1 it is the shortest distance between two conductive parts even over the air. • Creepage distance Per the IEC 60664-1 it represents the shortest distance along the surface of the insulating material between two conductive parts. • Working voltage Per the IEC 60664-1 it is the highest r.m.s. value of A.C. or D.C. voltage across any particular insulation which can occur when the equipment is supplied at rated voltage. • Rated impulse voltage Impulse withstands voltage value assigned by the manufacturer to the equipment or to a part of it characterizing the specifi ed withstand capability of its insulation against transient overvoltage. • Working current It is the maximum continuous and not interrupted current able to be carried by all contacts without exceeding the maximum temperature of the insulating material. • Transient voltage Extract from the IEC 60664-1: Short duration overvoltage of a few millisecond or less, oscillatory or non-oscillatory, usually highly damped. • CTI (Comparative Tracking Index) The CTI value is commonly used to characterize the electrical breakdown properties of an insulating material. It allows users to know the tendency to create creepage paths. This value represents the maximum voltage after 50 drops of ammonium chloride solution without any breakdown. • RTI (Relative temperature Index): Extract from ULs website: “Maximum service temperature for a material, where a class of critical property will not be unacceptably compromised through chemical thermal degradation, over the reasonable life of an electrical product, relative to a reference material having a confi rmed, acceptable corresponding performance defi ned RTI. - RTI Elec: Electrical RTI, associated with critical electrical insulating properties. - RTI Mech Imp: Mechanical Impact RTI, associated with critical impact resistance, resilience and fl exibility properties. - RTI Mech Str: Mechanical Strength (Mechanical without Impact) RTI, associated with critical mechanical strength where impact resistance, resilience and fl exibility are not essential” Air gap Creepage distance Appendices 184 © 2011 – SOURIAU Discrimination/Keying methods UTS Series Appendices N (Normal) Note: Insert rotated in body (viewed from front face of male insert) In applications where similar connectors are used next to each other, mismatching can be a reason for disturbances, system failure or even danger to operating personnel. To eliminate mismatching, all TRIM TRIO® connectors can be equipped with discrimination keys, which offer unlimited possibilities for an error avoiding interconnection system. The other way around is to rotate the insert into the shell. Connectors with rotated inserts can be ordered by adding the suffix W, X, Y or Z to the standard part number. e.g. UTS6JC104S (N key)  UTS6JC104SW (W key) Other keys Shell size Layout Discrimination keys degrees W X Y Z 8 8E2 58° 122° 8E3 8E3A 60° 210° 8E4 45° 8E33 90° 10 102W2 103 104 106 10E6 10E7 90° 10E98 90° 180° 240° 270° 12 12E2 12E3 180° 124 128 12E8 90° 112° 203° 292° 1210 12E10 60° 155° 270° 295° 12E14 45° 14 14E5 40° 92° 184° 273° 142G1 147 1412 60° 14E12 43° 90° 14E15 17° 110° 155° 234° 14E18 15° 90° 180° 270° 1419 30° 165° 315° 14E19 30° 165° 315° 18 18E11 62° 119° 241° 340° 1823 158° 270° 18E30 180° 193° 285° 350° 1832 18E32 85° 138° 222° 265° © 2011 – SOURIAU 185 UTS Series Appendices Part number Index Mechanics UTS0104P................... P. 68 UTS0104S................... P. 68 UTS010D6P.................. P. 68 UTS010D6S.................. P. 68 UTS010D7P.................. P. 68 UTS010D7S.................. P. 68 UTS010D98P................. P. 84 UTS010D98S................. P. 84 UTS010E6P.................. P. 80 UTS010E6S.................. P. 80 UTS010E7P.................. P. 92 UTS010E7S.................. P. 92 UTS010E98P................. P. 84 UTS010E98S................. P. 84 UTS0124P................... P. 52 UTS0128P................... P. 96 UTS0128S................... P. 96 UTS012D10P................. P. 104 UTS012D10S................. P. 104 UTS012D14P................. P. 116 UTS012D14S................. P. 116 UTS012D2P.................. P. 24 UTS012D2S.................. P. 24 UTS012D3P.................. P. 48 UTS012D3S.................. P. 48 UTS012D4P.................. P. 68 UTS012D4S.................. P. 68 UTS012D8P.................. P. 100 UTS012D8S.................. P. 100 UTS012E10P................. P. 104 UTS012E10S................. P. 104 UTS012E14P................. P. 116 UTS012E14S................. P. 116 UTS012E2P.................. P. 24 UTS012E2S.................. P. 24 UTS012E3P.................. P. 48 UTS012E3S.................. P. 48 UTS012E4P.................. P. 52 UTS012E4S.................. P. 52 UTS012E8P.................. P. 100 UTS012E8S.................. P. 100 UTS01412P.................. P. 108 UTS01412S.................. P. 108 UTS0147P................... P. 88 UTS014D12P................. P. 112 UTS014D12S................. P. 112 UTS014D15P................. P. 120 UTS014D15S................. P. 120 UTS014D18P................. P. 124 UTS014D18S................. P. 124 UTS014D5P.................. P. 120 UTS014D5S.................. P. 120 UTS014E12P................. P. 112 UTS014E12S................. P. 112 UTS014E15P................. P. 120 UTS014E15S................. P. 120 UTS014E18P................. P. 124 UTS014E18S................. P. 124 UTS014E19P................. P. 128 UTS014E19S................. P. 128 UTS014E5P.................. P. 120 UTS014E5S.................. P. 120 UTS014E7P.................. P. 88 UTS014E7S.................. P. 88 UTS01823P.................. P. 132 UTS01823S.................. P. 132 UTS08D2P................... P. 20 UTS08D2P................... P. 20 UTS08D2S................... P. 20 UTS08D2S................... P. 20 UTS08D33P.................. P. 44 UTS08D33P.................. P. 44 UTS08D33S.................. P. 44 UTS08D33S.................. P. 44 UTS08D3AP.................. P. 36 UTS08D3AS.................. P. 36 UTS08D3P................... P. 36 UTS08D3P................... P. 36 UTS08D3S................... P. 36 UTS08D3S................... P. 36 UTS08D4P................... P. 60 UTS08D4P................... P. 60 UTS08D4S................... P. 60 UTS08D4S................... P. 60 UTS08D98P.................. P. 40 UTS08D98S.................. P. 40 UTS08E2P................... P. 20 UTS08E2S................... P. 20 UTS08E33P.................. P. 44 UTS08E33S.................. P. 44 UTS08E3AP.................. P. 40 UTS08E3AS.................. P. 40 UTS08E3P................... P. 36 UTS08E3S................... P. 36 UTS08E4P................... P. 60 UTS08E4S................... P. 60 UTS08E98P.................. P. 40 UTS08E98S.................. P. 40 UTS1GJC104P................ P. 68 UTS1GJC128P................ P. 96 UTS1GJC1412P............... P. 108 UTS1GJC147P................ P. 88 UTS1GN104P................. P. 68 UTS1GN128P................. P. 96 UTS1GN1412P................ P. 108 UTS1GN147P................. P. 88 UTS1JC102W2P............... P. 64 UTS1JC102W2S............... P. 64 UTS1JC103P................. P. 40 UTS1JC103S................. P. 40 UTS1JC103W3P............... P. 40 UTS1JC103W3S............... P. 40 UTS1JC104P................. P. 68 UTS1JC104S................. P. 68 UTS1JC106P................. P. 80 UTS1JC106S................. P. 80 UTS1JC1210P................ P. 104 UTS1JC1210S................ P. 104 UTS1JC124P................. P. 52 UTS1JC124PSCR.............. P. 52 UTS1JC124S................. P. 52 UTS1JC128P................. P. 96 UTS1JC128S................. P. 96 UTS1JC1412P................ P. 108 UTS1JC1412S................ P. 108 UTS1JC1419P................ P. 128 UTS1JC1419S................ P. 128 UTS1JC142G1P............... P. 32 UTS1JC142G1S............... P. 32 UTS1JC147P................. P. 88 UTS1JC147PSCR.............. P. 88 UTS1JC147S................. P. 88 UTS1JC1823P................ P. 132 UTS1JC1823S................ P. 132 UTS1JC1832P................ P. 136 UTS1JC1832S................ P. 136 UTS6102W2P................. P. 64 UTS6102W2S................. P. 64 UTS6103P................... P. 40 UTS6103S................... P. 40 UTS6103W3P................. P. 40 UTS6103W3S................. P. 40 UTS6104P................... P. 68 UTS6104S................... P. 68 UTS6106P................... P. 80 UTS6106S................... P. 80 UTS610E6P.................. P. 80 UTS610E6S.................. P. 80 UTS610E7P.................. P. 92 UTS610E7S.................. P. 92 UTS610E98P................. P. 84 UTS610E98S................. P. 84 Appendices 186 © 2011 – SOURIAU UTS Series Appendices UTS61210P.................. P. 104 UTS61210S.................. P. 104 UTS6124P................... P. 52 UTS6124S................... P. 52 UTS6128P................... P. 96 UTS6128S................... P. 96 UTS612E10P................. P. 104 UTS612E10S................. P. 104 UTS612E14P................. P. 116 UTS612E14S................. P. 116 UTS612E2P.................. P. 24 UTS612E2S.................. P. 24 UTS612E3P.................. P. 48 UTS612E3S.................. P. 48 UTS612E4P.................. P. 52 UTS612E4S.................. P. 52 UTS612E8P.................. P. 100 UTS612E8S.................. P. 100 UTS61412P.................. P. 108 UTS61412S.................. P. 108 UTS61419P.................. P. 128 UTS61419S.................. P. 128 UTS6142G1P................. P. 32 UTS6142G1S................. P. 32 UTS6147P................... P. 88 UTS6147S................... P. 88 UTS614E12P................. P. 112 UTS614E12S................. P. 112 UTS614E15P................. P. 120 UTS614E15S................. P. 120 UTS614E18P................. P. 124 UTS614E18S................. P. 124 UTS614E19P................. P. 128 UTS614E19S................. P. 128 UTS614E5P.................. P. 72 UTS614E5S.................. P. 72 UTS61823P.................. P. 132 UTS61823S.................. P. 132 UTS61832P.................. P. 136 UTS61832S.................. P. 136 UTS6183G1P................. P. 56 UTS68E2P................... P. 20 UTS68E2S................... P. 20 UTS68E33P.................. P. 44 UTS68E33S.................. P. 44 UTS68E3AP.................. P. 40 UTS68E3AS.................. P. 40 UTS68E3P................... P. 36 UTS68E3S................... P. 36 UTS68E4P................... P. 60 UTS68E4S................... P. 60 UTS68E98P.................. P. 40 UTS68E98S.................. P. 40 UTS6GJC104S................ P. 68 UTS6GJC128S................ P. 96 UTS6GJC1412S............... P. 108 UTS6GJC147S................ P. 88 UTS6GN104S................. P. 68 UTS6GN128S................. P. 96 UTS6GN1412S................ P. 108 UTS6GN147S................. P. 88 UTS6JC102W2P............... P. 64 UTS6JC102W2S............... P. 64 UTS6JC103P................. P. 40 UTS6JC103S................. P. 40 UTS6JC103W3P............... P. 40 UTS6JC103W3S............... P. 40 UTS6JC104P................. P. 68 UTS6JC104S................. P. 68 UTS6JC106P................. P. 80 UTS6JC106S................. P. 80 UTS6JC10E6P................ P. 80 UTS6JC10E6S................ P. 80 UTS6JC10E7P................ P. 92 UTS6JC10E7S................ P. 92 UTS6JC10E98P............... P. 84 UTS6JC10E98S............... P. 84 UTS6JC1210P................ P. 104 UTS6JC1210S................ P. 104 UTS6JC124P................. P. 52 UTS6JC124PSCR.............. P. 52 UTS6JC124S................. P. 52 UTS6JC124SSCR.............. P. 52 UTS6JC128P................. P. 96 UTS6JC128S................. P. 96 UTS6JC12E10P............... P. 104 UTS6JC12E10S............... P. 104 UTS6JC12E14P............... P. 116 UTS6JC12E14S............... P. 116 UTS6JC12E2P................ P. 24 UTS6JC12E2S................ P. 24 UTS6JC12E3P................ P. 48 UTS6JC12E3S................ P. 48 UTS6JC12E4P................ P. 52 UTS6JC12E4S................ P. 52 UTS6JC12E8P................ P. 100 UTS6JC12E8S................ P. 100 UTS6JC1412P................ P. 108 UTS6JC1412S................ P. 108 UTS6JC1419P................ P. 128 UTS6JC1419S................ P. 128 UTS6JC142G1P............... P. 32 UTS6JC142G1S............... P. 32 UTS6JC147P................. P. 88 UTS6JC147PSCR.............. P. 88 UTS6JC147S................. P. 88 UTS6JC147SSCR.............. P. 88 UTS6JC14E12P............... P. 112 UTS6JC14E12S............... P. 112 UTS6JC14E15P............... P. 120 UTS6JC14E15S............... P. 120 UTS6JC14E18P............... P. 124 UTS6JC14E18S............... P. 124 UTS6JC14E19P............... P. 128 UTS6JC14E19S............... P. 128 UTS6JC14E5P................ P. 72 UTS6JC14E5S................ P. 72 UTS6JC14E7P................ P. 88 UTS6JC14E7S................ P. 88 UTS6JC1823P................ P. 132 UTS6JC1823S................ P. 132 UTS6JC1832P................ P. 136 UTS6JC1832S................ P. 136 UTS6JC183G1P............... P. 56 UTS6JC8E2P................. P. 20 UTS6JC8E2S................. P. 20 UTS6JC8E33P................ P. 44 UTS6JC8E33S................ P. 44 UTS6JC8E3AP................ P. 40 UTS6JC8E3AS................ P. 40 UTS6JC8E3P................. P. 36 UTS6JC8E3S................. P. 36 UTS6JC8E4P................. P. 60 UTS6JC8E4S................. P. 60 UTS6JC8E98P................ P. 40 UTS6JC8E98S................ P. 40 UTS7102W2P................. P. 64 UTS7102W2S................. P. 64 UTS7103P................... P. 40 UTS7103S................... P. 40 UTS7103W3P................. P. 40 UTS7103W3S................. P. 40 UTS7104P................... P. 68 UTS7104S................... P. 68 UTS7106P................... P. 80 UTS7106S................... P. 80 UTS710D6P.................. P. 80 UTS710D6P32................ P. 80 UTS710D6S.................. P. 80 UTS710D6S32................ P. 80 UTS710D7P.................. P. 92 UTS710D7P32................ P. 92 UTS710D7S.................. P. 92 © 2011 – SOURIAU 187 UTS Series Appendices UTS710D7S32................ P. 92 UTS710D98P................. P. 84 UTS710D98P32............... P. 84 UTS710D98S................. P. 84 UTS710D98S32............... P. 84 UTS710E6P.................. P. 80 UTS710E6S.................. P. 80 UTS710E7P.................. P. 92 UTS710E7S.................. P. 92 UTS710E98P................. P. 84 UTS710E98S................. P. 84 UTS71210P.................. P. 104 UTS71210S.................. P. 104 UTS7124P................... P. 52 UTS7124PSCR................ P. 52 UTS7124S................... P. 52 UTS7124SSCR................ P. 52 UTS7128P................... P. 96 UTS7128PSEK9............... P. 96 UTS7128S................... P. 96 UTS712CCRG................. P. 26 UTS712CCRR................. P. 26 UTS712CCRY................. P. 26 UTS712D10P................. P. 104 UTS712D10P32............... P. 104 UTS712D10S................. P. 104 UTS712D10S32............... P. 104 UTS712D14P................. P. 116 UTS712D14P32............... P. 116 UTS712D14S................. P. 116 UTS712D14S32............... P. 116 UTS712D2P.................. P. 24 UTS712D2P32................ P. 24 UTS712D2S.................. P. 24 UTS712D2S32................ P. 24 UTS712D3P.................. P. 48 UTS712D3P32................ P. 48 UTS712D3S.................. P. 48 UTS712D3S32................ P. 48 UTS712D4P.................. P. 52 UTS712D4P32................ P. 52 UTS712D4S.................. P. 52 UTS712D4S32................ P. 52 UTS712D8P.................. P. 100 UTS712D8P32................ P. 100 UTS712D8S.................. P. 100 UTS712D8S32................ P. 100 UTS712E10P................. P. 104 UTS712E10S................. P. 104 UTS712E14P................. P. 116 UTS712E14S................. P. 116 UTS712E2P.................. P. 24 UTS712E2S.................. P. 24 UTS712E3P.................. P. 48 UTS712E3S.................. P. 48 UTS712E4P.................. P. 52 UTS712E4S.................. P. 52 UTS712E8P.................. P. 100 UTS712E8S.................. P. 100 UTS71412P.................. P. 108 UTS71412S.................. P. 108 UTS71419P.................. P. 128 UTS71419S.................. P. 128 UTS7142G1P................. P. 32 UTS7142G1S................. P. 32 UTS7142G1SNPT.............. P. 32 UTS7147P................... P. 88 UTS7147PSCR................ P. 88 UTS7147PSEK9............... P. 88 UTS7147S................... P. 88 UTS7147SSCR................ P. 88 UTS714D12P................. P. 112 UTS714D12P32............... P. 112 UTS714D12S................. P. 112 UTS714D12S32............... P. 112 UTS714D15P................. P. 120 UTS714D15P32............... P. 120 UTS714D15S................. P. 120 UTS714D15S32............... P. 120 UTS714D18P................. P. 124 UTS714D18P32............... P. 124 UTS714D18S................. P. 124 UTS714D18S32............... P. 124 UTS714D19P................. P. 128 UTS714D19P32............... P. 128 UTS714D19S................. P. 128 UTS714D19S32............... P. 128 UTS714D5P.................. P. 120 UTS714D5P32................ P. 120 UTS714D5S.................. P. 120 UTS714D5S32................ P. 120 UTS714E12P................. P. 112 UTS714E12S................. P. 112 UTS714E15P................. P. 120 UTS714E15S................. P. 120 UTS714E18P................. P. 124 UTS714E18S................. P. 124 UTS714E19P................. P. 128 UTS714E19S................. P. 128 UTS714E5P.................. P. 72 UTS714E5S.................. P. 72 UTS714E7P.................. P. 88 UTS714E7S.................. P. 88 UTS71823P.................. P. 132 UTS71823S.................. P. 132 UTS71832P.................. P. 136 UTS71832S.................. P. 136 UTS7183G1SNPT.............. P. 56 UTS78D2P................... P. 20 UTS78D2P32................. P. 20 UTS78D2S................... P. 20 UTS78D2S32................. P. 20 UTS78D33P.................. P. 44 UTS78D33P32................ P. 44 UTS78D33S.................. P. 44 UTS78D33S32................ P. 44 UTS78D3AP.................. P. 40 UTS78D3AP32................ P. 40 UTS78D3AS.................. P. 40 UTS78D3AS32................ P. 40 UTS78D3P................... P. 36 UTS78D3P32................. P. 36 UTS78D3S................... P. 36 UTS78D3S32................. P. 36 UTS78D4P................... P. 60 UTS78D4P32................. P. 60 UTS78D4S................... P. 60 UTS78D4S32................. P. 60 UTS78D98P.................. P. 40 UTS78D98P32................ P. 40 UTS78D98S.................. P. 40 UTS78D98S32................ P. 40 UTS78E2P................... P. 20 UTS78E2S................... P. 20 UTS78E33P.................. P. 44 UTS78E33S.................. P. 44 UTS78E3AP.................. P. 40 UTS78E3AS.................. P. 40 UTS78E3P................... P. 36 UTS78E3S................... P. 36 UTS78E4P................... P. 60 UTS78E4S................... P. 60 UTS78E98P.................. P. 40 UTS78E98S.................. P. 40 UTS7GJC104P................ P. 68 UTS7GJC128P................ P. 96 UTS7GJC1412P............... P. 108 UTS7GJC147P................ P. 88 UTS7GN104P................. P. 68 UTS7GN128P................. P. 96 UTS7GN1412P................ P. 108 UTS7GN147P................. P. 88 Appendices 188 © 2011 – SOURIAU UTS Series Appendices Accessories 85005585A.................. P. 22 85005586A.................. P. 30 85005587A.................. P. 26 85005588A.................. P. 34 85005590A.................. P. 134 85005594................... P. 22 85005595................... P. 30 85005596................... P. 26 85005597................... P. 34 85005599................... P. 134 UT610CCRG.................. P. 30 UT610CCRR.................. P. 30 UT610CCRY.................. P. 30 UT612CCRG.................. P. 26 UT612CCRR.................. P. 26 UT612CCRY.................. P. 26 UT614CCRG.................. P. 34 UT614CCRR.................. P. 34 UT614CCRY.................. P. 34 UTFD11B.................... P. 22 UTFD12B.................... P. 30 UTFD13B.................... P. 26 UTFD14B.................... P. 34 UTFD16B.................... P. 134 UTS10DCG................... P. 30 UTS10DCGE.................. P. 30 UTS10DCGR.................. P. 30 UTS12DCG................... P. 26 UTS12DCGE.................. P. 26 UTS12DCGR.................. P. 26 UTS14DCG................... P. 34 UTS14DCGE.................. P. 34 UTS14DCGR.................. P. 34 UTS18DCG................... P. 134 UTS18DCGE.................. P. 134 UTS18DCGR.................. P. 134 UTS610DCG.................. P. 30 UTS612DCG.................. P. 26 UTS614DCG.................. P. 34 UTS618DCG.................. P. 134 UTS68C..................... P. 22 UTS710CCRG................. P. 30 UTS710CCRR................. P. 30 UTS710CCRY................. P. 30 UTS712CCRG................. P. 26 UTS712CCRR................. P. 26 UTS712CCRY................. P. 26 UTS714CCRG................. P. 34 UTS714CCRR................. P. 34 UTS714CCRY................. P. 34 UTS8DCG.................... P. 22 UTS8DCGE................... P. 22 UTS8DCGR................... P. 22 Contacts 82911456K.................. P. 145 82911457NK................. P. 145 82911458K.................. P. 145 82911459NK................. P. 145 82911460K.................. P. 145 82911461NK................. P. 145 82911462K.................. P. 145 82911463NK................. P. 145 82911464K.................. P. 145 82911465NK................. P. 145 82911466K.................. P. 145 82911467NK................. P. 145 82913600A.................. P. 145 82913601A.................. P. 145 82913602A.................. P. 145 82913603A.................. P. 145 82913604A.................. P. 145 82913605A.................. P. 145 82913606A.................. P. 145 82913607A.................. P. 145 82913608A.................. P. 145 82913609A.................. P. 145 RC14M30GE7K................ P. 146 RC14M30K................... P. 145 RC14M50GE7K................ P. 146 RC14M50K................... P. 145 RC16M23GE7K................ P. 146 RC16M23K................... P. 145 RC18W3K.................... P. 145 RC20M12E83K................ P. 148 RC20M12E84K................ P. 145 RC20M12E8K................. P. 145 RC20M12GE7K................ P. 146 RC20M12K................... P. 145 RC20M13GE7K................ P. 146 RC20M13K................... P. 145 RC20W3K.................... P. 145 RC24M9GE7K................. P. 146 RC24M9K.................... P. 145 RC24W3K.................... P. 145 RC28M1GE7K................. P. 146 RC28M1K.................... P. 145 RCDX6016D28................ P. 182 RCDX6019D28................ P. 182 RCDX6024D28................ P. 182 RCDX6026D28................ P. 182 RCDX602D28................. P. 181 RCDX6032D28................ P. 182 RCDX6036D28................ P. 182 RCDX6052D28................ P. 182 RCDXK1D28.................. P. 181 RCPOF1000B................. P. 150 RCW5016K................... P. 145 RCW50A7K................... P. 148 RM14M30GE1K................ P. 146 RM14M30K................... P. 145 RM14M50GE1K................ P. 146 RM14M50K................... P. 148 RM16M23GE1K................ P. 146 RM16M23K................... P. 145 RM18W3K.................... P. 145 RM20M12E83K................ P. 145 RM20M12E8K................. P. 145 RM20M12GE1k................ P. 146 RM20M12K................... P. 145 RM20M13GE1k................ P. 146 RM20M13K................... P. 145 RM20W3K.................... P. 145 RM24M9GE1k................. P. 146 RM24M9K.................... P. 145 RM24W3K.................... P. 145 RM28M1GE1k................. P. 146 RM28M1K.................... P. 145 RMDX6019D28................ P. 177 RMDX6024D28................ P. 176 RMDX6026D28................ P. 176 RMDX602D28................. P. 182 RMDX6031D28................ P. 179 RMDX6032D28................ P. 182 RMDX6036D28................ P. 182 RMDX6050D28................ P. 182 RMDXK10D28................. P. 178 RMPOF1000.................. P. 150 RMW5016K................... P. 148 RMW50A7K................... P. 148 SC14M1TK6.................. P. 145 SC14ML1TK6................. P. 145 SC16M11TK6................. P. 145 SC16M1TK6.................. P. 145 SC16ML11TK6................ P. 145 SC16ML1TK6................. P. 145 SC20M1TK6.................. P. 145 SC20ML1TK6................. P. 145 SC20W3TK6.................. P. 145 SC20WL3TK6................. P. 145 © 2011 – SOURIAU 189 UTS Series Appendices SC24M1TK6.................. P. 145 SC24ML1TK6................. P. 145 SC24W3TK6.................. P. 145 SC24WL3TK6................. P. 145 SM14M1TK6.................. P. 145 SM14ML1TK6................. P. 145 SM16M11TK6................. P. 145 SM16M1TK6.................. P. 145 SM16ML11TK6................ P. 145 SM16ML1TK6................. P. 145 SM20M1TK6.................. P. 145 SM20ML1TK6................. P. 145 SM20W3TK6.................. P. 145 SM20WL3TK6................. P. 145 SM24M1TK6.................. P. 145 SM24ML1TK6................. P. 145 SM24W3TK6.................. P. 145 SM24WL3TK6................. P. 145 Tooling 51060210924................ P. 155 51060210936................ P. 155 M10S1J..................... P. 178 M10SG8..................... P. 179 M317....................... P. 155 MH860...................... P. 155 MH86164G................... P. 155 MH86186.................... P. 155 RX2025GE1.................. P. 155 RX20D44.................... P.162 S16RCM14................... P. 155 S16RCM1450................. P. 155 S16RCM16................... P. 155 S16SCM20................... P. 155 S16SCML1................... P. 155 S16SCML11.................. P. 155 S20RCM..................... P. 155 S16SCM20................... P. 155 S20SCM20................... P. 155 S221....................... P. 180 S23D2...................... P. 180 S80........................ P. 179 S82........................ P. 182 S83........................ P. 179 S87........................ P. 182 S88........................ P. 182 SHANDLES................... P. 155 SL105...................... P. 179 sl46D2..................... P. 180 sl471...................... P. 180 UH25....................... P. 155 VGE10077A.................. P. 155 VGE10078A.................. P. 155 Appendices INDUTSCA07EN © Copyright SOURIAU June 2011 - All information in this document presents only general particulars and shall not form part of any contract. All rights reserved to SOURIAU for changes without prior notifi cation or public announcement. Any duplication is prohibited, unless approved in writing. www.souriau.com www.souriau-industrial.com contactindustry@souriau.com Tiva™ C Series TM4C1294 Connected LaunchPad Evaluation Kit EK-TM4C1294XL User's Guide Literature Number: SPMU365A March 2014–Revised March 2014 Contents 1 Board Overview ................................................................................................................... 4 1.1 Kit Contents................................................................................................................... 5 1.2 Using the Connected LaunchPad ......................................................................................... 5 1.3 Features....................................................................................................................... 5 1.4 BoosterPacks................................................................................................................. 6 1.5 Energīa........................................................................................................................ 6 1.6 Specifications................................................................................................................. 6 2 Hardware Description ........................................................................................................... 7 2.1 Functional Description ...................................................................................................... 7 2.1.1 Microcontroller....................................................................................................... 7 2.1.2 Ethernet Connectivity............................................................................................... 8 2.1.3 USB Connectivity ................................................................................................... 8 2.1.4 Motion Control....................................................................................................... 8 2.1.5 User Switches and LED's.......................................................................................... 8 2.1.6 BoosterPacks and Headers ....................................................................................... 9 2.2 Power Management........................................................................................................ 17 2.2.1 Power Supplies .................................................................................................... 17 2.2.2 Low Power Modes ................................................................................................ 18 2.2.3 Clocking ............................................................................................................ 18 2.2.4 Reset................................................................................................................ 18 2.3 Debug Interface............................................................................................................. 18 2.3.1 In-Circuit Debug Interface (ICDI) ................................................................................ 18 2.3.2 External Debugger ................................................................................................ 19 2.3.3 Virtual COM Port .................................................................................................. 19 3 Software Development ........................................................................................................ 20 3.1 Software Description....................................................................................................... 20 3.2 Source Code ................................................................................................................ 20 3.3 Tool Options ................................................................................................................ 20 3.4 Programming the Connected LaunchPad............................................................................... 21 4 References, PCB Layout, and Bill of Materials ....................................................................... 22 4.1 References .................................................................................................................. 22 4.2 Component Locations ..................................................................................................... 23 4.3 Bill of Materials ............................................................................................................. 24 5 Schematic ......................................................................................................................... 26 6 Revision History................................................................................................................. 27 2 Contents SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com List of Figures 1-1. Tiva C Series Connected LaunchPad Evaluation Board ............................................................... 4 2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram ........................................................ 7 2-2. Default Jumper Locations ................................................................................................. 17 4-1. Connected LaunchPad Dimensions and Component Locations ..................................................... 23 List of Tables 1-1. EK-TM4C1294XL Specifications........................................................................................... 6 2-1. BoosterPack 1 GPIO and Signal Muxing ................................................................................. 9 2-2. BoosterPack 2 GPIO and Signal Muxing ............................................................................... 11 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing .......................................... 13 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing ......................................... 15 4-1. Connected LaunchPad Bill of Materials ................................................................................. 24 6-1. Revision History ............................................................................................................ 27 SPMU365A–March 2014–Revised March 2014 List of Figures 3 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 1 SPMU365A–March 2014–Revised March 2014 Board Overview The Tiva™ C Series TM4C1294 Connected LaunchPad Evaluation Board (EK-TM4C1294XL) is a low-cost evaluation platform for ARM® Cortex™-M4F-based microcontrollers. The Connected LaunchPad design highlights the TM4C1294NCPDT microcontroller with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation and a multitude of simultaneous serial connectivity. The Connected LaunchPad also features two user switches, four user LEDs, dedicated reset and wake switches, a breadboard expansion option and two independent BoosterPack XL expansion connectors. The pre-programmed quickstart application on the Connected LaunchPad also enables remote monitoring and control of the evaluation board from an internet browser anywhere in the world. The web interface is provided by 3rd party, Exosite. Each Connected LaunchPad is enabled on the Exosite platform allowing users to create and customize their own Internet-of-Things applications. Figure 1-1 shows a photo of the Connected LaunchPad with key features highlighted. Figure 1-1. Tiva C Series Connected LaunchPad Evaluation Board Tiva is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4 Board Overview SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Kit Contents 1.1 Kit Contents The Connected LaunchPad Evaluation Kit contains the following items: • Tiva™ C Series TM4C1294 Evaluation Board (EK-TM4C1294XL) • Retractable Ethernet cable • USB Micro-B plug to USB-A plug cable • README First document 1.2 Using the Connected LaunchPad The recommended steps for using the Connected LaunchPad Evaluation Kit are: 1. Follow the README First document included in the kit. The README First helps you get the Connected LaunchPad up and running in minutes. Within just a few minutes you can be controlling and monitoring the Connected LaunchPad through the internet using Exosite and the pre-programmed quickstart application. 2. Experiment with BoosterPacks. This evaluation kit conforms to the latest revision of the BoosterPack pinout standard. It has two independent BoosterPack connections to enable a multitude of expansion opportunities. 3. Take the first step towards developing your own applications. The Connected LaunchPad is supported by TivaWare for C Series. After installing TivaWare, look in the installation directory for examples\boards\ek-tm4c1294xl. You can find pre-configured example applications for this board as well as for this board with selected BoosterPacks. Alternately, use Energīa for a wiring frameworkbased cross-platform, fast-prototyping environment that works with this and other TI LaunchPads. See Chapter 3 of this document for more details about software development. TivaWare can be downloaded from the TI website at http://www.ti.com/tool/sw-tm4c. Energīa can be found at http://energia.nu. 4. Customize and integrate the hardware to suit your end application. This evaluation kit can be used as a reference for building your own custom circuits based on Tiva C microcontrollers or as a foundation for expansion with your custom BoosterPack or other circuit. This manual can serve as a starting point for this endeavor. 5. Get Trained. You can also download hours of written and video training materials on this and related LaunchPads. Visit the Tiva C Series LaunchPad Workshop Wiki for more information. 6. More Resources. See the TI MCU LaunchPad web page for more information and available BoosterPacks. (http://www.ti.com/tiva-c-launchpad) 1.3 Features Your Connected LaunchPad includes the following features: • Tiva TM4C1294NCPDTI microcontroller • Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY Motion Control PWM • USB 2.0 Micro A/B connector • 4 user LEDs • 2 user buttons • 1 independent hibernate wake switch • 1 independent microcontroller reset switch • Jumper for selecting power source: – ICDI USB – USB Device – BoosterPack • Preloaded Internet-of-Things Exosite quickstart application • I/O brought to board edge for breadboard expansion • Two independent BoosterPack XL standard connectors featuring stackable headers to maximize expansion through BoosterPack ecosystem SPMU365A–March 2014–Revised March 2014 Board Overview 5 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated BoosterPacks www.ti.com – For a complete list of BoosterPacks, see the TI MCU LaunchPad web page: http://www.ti.com/launchpad 1.4 BoosterPacks The Connected LaunchPad provides an easy and inexpensive way to develop applications with the TM4C1294NCPDTI microcontroller. BoosterPacks are add-on boards that follow a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the peripherals and potential applications that you can easily explore with the Connected LaunchPad. You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas Instruments even helps you promote your BoosterPack to other members of the community. TI offers a variety of avenues for you to reach potential customers with your solutions. 1.5 Energīa Energīa is an open-source electronics prototyping platform started in January of 2012 with the goal of bringing the Wiring and Arduino framework to the TI LaunchPad community. Energīa includes an integrated development environment (IDE) that is based on Processing. Together with Energīa, LaunchPads can be used to develop interactive objects, taking inputs from a variety of switches or sensors, and controlling a variety of lights, motors, and other physical outputs. LaunchPad projects can be stand-alone (only run on the target board, i.e. your LaunchPad), or they can communicate with software running on your computer (Host PC). Energīa projects are highly portable between supported LaunchPad platforms. Projects written for your Connected LaunchPad can be run on other LaunchPads with little or no modifications. More information is available at http://energia.nu. 1.6 Specifications Table 1-1 summarizes the specifications for the Connected LaunchPad. Table 1-1. EK-TM4C1294XL Specifications Parameter Value 4.75 VDC to 5.25 VDC from one of the following sources: • Debug USB U22 (ICDI) USB Micro-B cable connected to PC or other compatible power source. • Target USB (U7) USB Micro-B cable connected to PC or other compatible power Board Supply Voltage source. • BoosterPack 1 (X8-4) • BoosterPack 2 (X6-4) • Breadboard expansion header (X11-2 or X11-97). See schematic symbol JP1 for power input selection. Dimensions 4.9 in x 2.2 in x .425 in (12.45 cm x 5.59 cm x 10.8 mm) (L x W x H) • 5 VDC to BoosterPacks, current limited by TPS2052B. Nominal rating 1 Amp. Board input power supply limitations may also apply. Break-out Power Output • 3.3 VDC to BoosterPacks, limited by output of TPS73733 LDO. This 3.3-V plane is shared with on-board components. Total output power limit of TPS73733 is 1 Amp. RoHS Status Compliant 6 Board Overview SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 2 SPMU365A–March 2014–Revised March 2014 Hardware Description The Connected LaunchPad includes a TM4C1294NCPDTI microcontroller with an integrated 10/100 Ethernet MAC and PHY. This advanced ARM® Cortex™ M4F MCU has a wide range of peripherals that are made available to users via the on-board accessories and the BoosterPack connectors. This chapter explains how those peripherals operate and interface to the microcontroller. Figure 2-1 provides a high-level block diagram of the Connected LaunchPad. Figure 2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram 2.1 Functional Description 2.1.1 Microcontroller The TM4C1294NCPDTI is a 32-bit ARM Cortex-M4F based microcontroller with 1024-kB Flash memory, 256-kB SRAM, 6-kB EEPROM, and 120 MHz operation; integrated 10/100 Ethernet MAC and PHY; integrated USB 2.0 connectivity with external high-speed USB 3.0 PHY capability; a hibernation module, a multitude of serial connectivity and motion control PWM; as well as a wide range of other peripherals. See the TM4C1294NCPDTI microcontroller data sheet for more complete details. Most of the microcontroller’s signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder pads. An internal multiplexor allows different peripheral functions to be assigned to each of these GPIO pads. When adding external circuitry, consider the additional load on the evaluation board power rails. The TM4C1294NCPDTI microcontroller is factory-programmed with a quickstart demo program. The quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the quickstart application has been replaced with a user program. The quickstart application automatically connects to http://ti.exosite.com when an internet connection is provided through the RJ45 Ethernet jack on the evaluation board. SPMU365A–March 2014–Revised March 2014 Hardware Description 7 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Functional Description www.ti.com 2.1.2 Ethernet Connectivity The Connected LaunchPad is designed to connect directly to an Ethernet network using RJ45 style connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for both the uIP and LwIP TCP/IP protocol stacks. The embedded Ethernet on this device can be programmed to act as an HTTP server, client or both. The design and integration of the circuit and microcontroller also enable users to synchronize events over the network using the IEEE1588 precision time protocol. When configured for Ethernet operation, it is recommended that the user configure LED D3 and D4 to be controlled by the Ethernet MAC to indicate connection and transmit/receive status. 2.1.3 USB Connectivity The Connected LaunchPad is designed to be USB 2.0 ready. A TPS2052B load switch is connected to and controlled by the microcontroller USB peripheral, which manages power to the USB micro A/B connector when functioning in a USB host. When functioning as a USB device, the entire Connected LaunchPad can be powered directly from the USB micro A/B connector. Use JP1 to select the desired power source. USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB external PHY control and data signals are provided on the breadboard expansion header X11. 2.1.4 Motion Control The Connected LaunchPad includes the Tiva C Series Motion Control PWM technology, featuring a PWM module capable of generating eight PWM outputs. The PWM module provides a great deal of flexibility and can generate simple PWM signals – for example, those required by a simple charge pump – as well as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter bridge. A quadrature encoder interface (QEI) is also available to provide motion control feedback. See the BoosterPacks and Headers section of this document for details about the availability of these signals on the BoosterPack interfaces. 2.1.5 User Switches and LED's Two user switches are provided for input and control of the TM4C1294NCPDTI software. The switches are connected to GPIO pins PJ0 and PJ1. A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset signal to the BoosterPack and Breadboard headers. The wake switch is one way to bring the device out of hibernate mode. Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller. A power LED is also provided to indicate that 3.3 volt power is present on the board. 8 Hardware Description SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Functional Description 2.1.6 BoosterPacks and Headers 2.1.6.1 BoosterPack 1 The Connected LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack 1, located around the ICDI portion of the board, is fully compliant with the BoosterPack standard with the single exception of GPIO pin PA6 (X8-16), which does not provide analog capability. PA6 is located near the bottom of the inner left BoosterPack XL header. I2C is provided in both the original BoosterPack standard configuration as well as the updated standard location. Use of I2C on the bottom left of the BoosterPack connections per the updated standard is highly encouraged whenever possible. Motion control advanced PWM connections are provided on the inner right connector for motion control applications. Table 2-1 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available on each pin. The TM4C1294NCPDTI GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’ and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins. Table 2-1. BoosterPack 1 GPIO and Signal Muxing Standard MCU Digital Function (GPIOPCTL Bit Encoding) Header Pin Function GPIO Pin Analog 1 2 3 5 6 7 8 11 13 14 15 A1 1 +3.3 volts 3.3V A1 2 Analog PE4 123 AIN9 U1RI - - - - - - - - - SSI1XDAT0 A1 3 UART RX PC4 25 C1- U7Rx - - - - - - - - - EPI0S7 A1 4 UART TX PC5 24 C1+ U7Tx - - - - RTCCLK - - - - EPI0S6 A1 5 GPIO PC6 23 C0+ U5Rx - - - - - - - - - EPI0S5 A1 6 Analog PE5 124 AIN8 - - - - - - - - - - SSIXDAT1 A1 7 SPI CLK PD3 4 AIN12 - I2C8SDA T1CCP1 - - - - - - - SSI2CLk A1 8 GPIO PC7 22 C0- U5Tx - - - - - - - - - EPI0S4 A1 9 I2C SCL PB2 91 - - I2C0SCL T5CCP0 - - - - - - USB0STP EPI0S27 A1 10 I2C SDA PB3 92 - - I2C0SDA T5CCP1 - - - - - - USB0CLK EPI0S28 B1 1 +5 volts 5V B1 2 ground GND B1 3 Analog PE0 15 AIN3 U1RTS - - - - - - - - - - B1 4 Analog PE1 14 AIN2 U1DSR - - - - - - - - - - B1 5 Analog PE2 13 AIN1 U1DCD - - - - - - - - - - B1 6 Analog PE3 12 AIN0 U1DTR - - - - - - - - - - B1 7 Analog PD7 128 AIN4 U2CTS - T4CCP1 USB0PFLT - - NMI - - - SSI2XDAT2 B1 8 Analog PA6 40 - U2Rx I2C6SCL T3CCP0 USB0EPEN - - - - SSI0XDAT2 - EPI0S8 B1 9 A out PM4 74 TMPR3 U0CTS - T4CCP0 - - - - - - - - B1 10 A out PM5 73 TMPR2 U0DCD - T4CCP1 - - - - - - - - SPMU365A–March 2014–Revised March 2014 Hardware Description 9 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Functional Description www.ti.com Table 2-1. BoosterPack 1 GPIO and Signal Muxing (continued) Standard MCU Digital Function (GPIOPCTL Bit Encoding) Header Pin Function GPIO Pin Analog 1 2 3 5 6 7 8 11 13 14 15 C1 1 PWM PF1 43 - - - - EN0LED2 M0PWM1 - - - - SSI3XDAT0 TRD1 C1 2 PWM PF2 44 - - - - - M0PWM2 - - - - SSI3Fss TRD0 C1 3 PWM PF3 45 - - - - - M0PWM3 - - - - SSI3Clk TRCLK C1 4 PWM PG0 49 - - I2C1SCL - EN0PPS M0PWM4 - - - - - EPI0S11 C1 5 Capture PL4 85 - - - T0CCP0 - - - - - - USB0D4 EPI0S26 C1 6 Capture PL5 86 - - - T0CCP1 - - - - - - USB0D5 EPI0S33 C1 7 GPIO PL0 81 - - I2C2SDA - - M0FAULT3 - - - - USB0D0 EPI0S16 C1 8 GPIO PL1 82 - - I2C2SCL - - PhA0 - - - - USB0D1 EPI0S17 C1 9 GPIO PL2 83 - - - - C0o PhB0 - - - - USB0D2 EPI0S18 C1 10 GPIO PL3 84 - - - - C1o IDX0 - - - - USB0D3 EPI0S19 D1 1 ground GND D1 2 PWM PM3 75 - - - T3CCP1 - - - - - - - EPI0S12 D1 3 GPIO PH2 31 - U0DCD - - - - - - - - - EPI0S2 D1 4 GPIO PH3 32 - U0DSR - - - - - - - - - EPI0S3 D1 5 reset RESET D1 6 SPI MOSI PD1 2 AIN14 - I2C7SDA T0CCP1 C1o - - - - - - SSI2XDAT0 D1 7 SPI MISO PD0 1 AIN15 - I2C7SCL T0CCP0 C0o - - - - - - SSI2XDAT1 D1 8 GPIO PN2 109 - U1DCD U2RTS - - - - - - - - EPI0S29 D1 9 GPIO PN3 110 - U1DSR U2CTS - - - - - - - - EPI0S30 D1 10 GPIO PP2 103 - U0DTR - - - - - - - - USB0NXT EPI0S29 10 Hardware Description SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Functional Description 2.1.6.2 BoosterPack 2 The second BoosterPack XL interface is located near the middle of the board. This interface is fully compliant with the BoosterPack standard, and adds features not covered by the BoosterPack standard that enable operation with additional BoosterPacks. An additional analog signal is provided on the outer left header (X6-9). This signal can be used to monitor the touch panel on the popular Kentec EB-LM4F120-L35 BoosterPack. Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can be optionally routed to the BoosterPack 2 interface. The location of these signals is consistent with the CAN interface on the Tiva C Series TM4C123G LaunchPad and the Stellaris LM4F120 LaunchPad. In the default configuration, UART0 is used for the ICDI virtual UART and CAN is not present on the BoosterPack headers. In this configuration, the ROM serial bootloader can be used over the ICDI virtual UART. When the jumpers are configured for CAN on the BoosterPack, then UART4 must be used for the ICDI virtual UART. To comply with both the original and the new BoosterPack standard, I2C is provided on both sides of the BoosterPack connection. Use of I2C on the bottom left of the BoosterPack connection is highly encouraged where possible, to be in compliance with the new BoosterPack standard. To provide I2C capability on the right side of the connector, per the original standard, two zero-ohm resistors (R19 and R20) are used to combine the SPI and I2C signals. These signals are not shared with any other pins on the LaunchPad and therefore removal of these zero-ohm resistors should not be required. Software should be certain that unused GPIO signals are configured as inputs. Table 2-2 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available at each pin. The TM4C1294NCPDT GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’ and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins. Table 2-2. BoosterPack 2 GPIO and Signal Muxing Standard MCU Digital Function (FPIOPCTL Bit Encoding) Header Pin Function GPIO Pin Analog 1 2 3 5 6 7 8 11 13 14 15 A2 1 3.3V A2 2 Analog PD2 3 AIN13 - I2C8SCL T1CCP0 C2o - - - - - - SSI2Fss A2 3 UART RX PP0 118 C2+ U6Rx - - - - - - - - - SSI3XDAT2 A2 4 UART TX PP1 119 C2- U6Tx - - - - - - - - - SSI3XDAT3 GPIO PD4 125 AIN7 U2Rx - T3CCP0 - - - - - - - SSI1XDAT2 A2 5 (See JP4) PA0 33 - U0Rx I2C9SCL T0CCP0 - - CANORx - - - - - Analog PD5 126 AIN6 U2Tx - T3CCP1 - - - - - - - SSI1XDAT3 A2 6 (See JP5) PA1 34 - U0Tx I2C9SDA T0CCP1 - - CAN0Tx - - - - - A2 7 SPI CLK PQ0 5 - - - - - - - - - - SSI3Clk EPI0S20 A2 8 GPIO PP4 105 - U3RTS U0DSR - - - - - - - USB0D7 - A2 9 I2C SCL PN5 112 - U1RI U3CTS I2C2SCL - - - - - - - EPIO0S35 A2 10 I2C SDA PN4 111 - U1DTR U3RTS I2C2SDA - - - - - - - EPIO0S34 B2 1 5V B2 2 GND B2 3 Analog PB4 121 AIN10 U0CTS I2C5SCL - - - - - - - - SSI1Fss SPMU365A–March 2014–Revised March 2014 Hardware Description 11 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Functional Description www.ti.com Table 2-2. BoosterPack 2 GPIO and Signal Muxing (continued) Standard MCU Digital Function (FPIOPCTL Bit Encoding) Header Pin Function GPIO Pin Analog 1 2 3 5 6 7 8 11 13 14 15 B2 4 Analog PB5 120 AIN11 U0RTS I2C5SDA - - - - - - - - SSI1Clk B2 5 Analog PK0 18 AIN16 U4Rx - - - - - - - - - EPI0S0 B2 6 Analog PK1 19 AIN17 U4Tx - - - - - - - - - EPI0S1 B2 7 Analog PK2 20 AIN18 U4RTS - - - - - - - - - EPI0S2 B2 8 Analog PK3 21 AIN19 u4CTS - - - - - - - - - EPI0S3 B2 9 A out PA4 37 - U3Rx I2C7SCL T2CCP0 - - - - - - - SSI0XDAT0 B2 10 A out PA5 38 - U3Tx I2C7SDA T2CCP1 - - - - - - - SSI0XDAT1 C2 1 PWM PG1 50 - - I2C1SDA - - M0PWM5 - - - - - EPI0S10 C2 2 PWM PK4 63 - - I2C3SCL - EN0LED0 M0PWM6 - - - - - EPI0S32 C2 3 PWM PK5 62 - - I2C3SDA - EN0LED2 M0PWM7 - - - - - EPI0S31 C2 4 PWM PM0 78 - - - T2CCP0 - - - - - - - EPI0S15 C2 5 Capture PM1 77 - - - T2CCP1 - - - - - - - EPI0S14 C2 6 Capture PM2 76 - - - T3CCP0 - - - - - - - EPI0S13 C2 7 GPIO PH0 29 - U0RTS - - - - - - - - - EPI0S0 C2 8 GPIO PH1 30 - U0CTS - - - - - - - - - EPI0S1 C2 9 GPIO PK6 61 - - I2C4SCL - EN0LED1 M0FAULT1 - - - - - EPI0S25 C2 10 GPIO PK7 60 - U0RI I2C4SDA - RTCCLK M0FAULT2 - - - - - EPI0S24 D2 1 GND D2 2 PWM PM7 71 TMPR0 U0RI - T5CCP1 - - - - - - - - D2 3 GPIO PP5 106 - U3CTS I2C2SDL - - - - - - - USB0D6 - D2 4 GPIO PA7 41 - U2Tx I2C6SDA T3CCP1 USB0PFLT - - - USB0EPEN SSI0XDAT3 - EPI0S9 D2 5 RESET SPI MOSI PQ2 11 - - - - - - - - - - SSI3XDAT0 EPI0S22 D2 6 I2C PA3 36 - U4Tx I2C8SDA T1CCP1 - - - - - - - SSI0Fss SPI MISO PQ3 27 - - - - - - - - - - SSI3XDAT1 EPI0S23 D2 7 I2C PA2 35 - U4Rx I2C8SCL T1CCP0 - - - - - - - SSI0Clk D2 8 GPIO PP3 104 - U1CTS U0DCD - - - - - - - USB0DIR EPI0S30 D2 9 GPIO PQ1 6 - - - - - - - - - - SSI3Fss EPI0S21 D2 10 GPIO PM6 72 TMPR1 U0DSR - T5CCP0 - - - - - - - - 12 Hardware Description SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Functional Description 2.1.6.3 Breadboard Connection The breadboard adapter section of the board is a set of 98 holes on a 0.1 inch grid. Properly combined with a pair of right angle headers, the entire Connected LaunchPad can be plugged directly into a standard 300 mil (0.3 inch) wide solder-less breadboard. The right angle headers and breadboard are not provided with this kit. Suggested part numbers are Samtec TSW-149-09-L-S-RE and TSW-149-08-L-S-RA right angle pin headers and Twin industries TW-E40-1020 solder-less breadboard. Samtec TSW-149-09-F-S-RE and TSW-149-09-F-S-RA may be substituted. A detailed explanation of how to install the headers is available on the TI LaunchPad Wiki or at http://users.ece.utexas.edu/~valvano/EE345L/Labs/Fall2011/LM3S1968soldering.pdf. Nearly all microcontroller signals are made available at the breadboard adapter holes (X11). These signals are grouped by function where possible. For example, all EPI signals are grouped on one side of the connector. Many of the analog signals are grouped near VREF, and UART, SSI and I2C signals are grouped by peripheral to make expansion and customization simpler. Table 2-3 and Table 2-4 show the GPIO pin and signal muxing for the X11 breadboard adapter pads. Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing MCU Digital Function (GPIOPCTL Bit Encoding) Pin Port PIN Analog 1 2 3 5 6 7 8 11 13 14 15 1 3V3 3 GND 5 PB4 121 AIN10 U0CTS I2C5SCL - - - - - - - - SSI1Fss 7 PB5 120 AIN11 U0RTS I2C5SDA - - - - - - - - SSI1Clk 9 PH0 29 - U0RTS - - - - - - - - - EPI0S0 11 PH1 30 - U0CTS - - - - - - - - - EPI0S1 13 PH2 31 - U0DCD - - - - - - - - - EPI0S2 15 PH3 32 - U0DSR - - - - - - - - - EPI0S3 17 PC7 22 C0- U5Tx - - - - - - - - - EPI0S4 19 PC6 23 C0+ U5Rx - - - - - - - - - EPI0S5 21 PC5 24 C1+ U7Tx - - - - RTCCLK - - - - EPI0S6 23 PC4 25 C1- U7Rx - - - - - - - - - EPI0S7 25 PA6 40 - U2Rx I2C6SCL T3CCP0 USB0EPEN - - - - SSI0XDAT2 - EPI0S8 27 PA7 41 - U2Tx I2C6SDA T3CCP1 USB0PFLT - - - USB0EPEN SSI0XDAT3 - EPI0S9 29 PG1 50 - - I2C1SDA - - M0PWM5 - - - - - EPI0S10 31 PG0 49 - - I2C1SCL - EN0PPS M0PWM4 - - - - - EPI0S11 33 PM3 75 - - - T3CCP1 - - - - - - - EPI0S12 35 GND 37 PM2 76 - - - T3CCP0 - - - - - - - EPI0S13 39 PM1 77 - - - T2CCP1 - - - - - - - EPI0S14 41 PM0 78 - - - T2CCP0 - - - - - - - EPI0S15 SPMU365A–March 2014–Revised March 2014 Hardware Description 13 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Functional Description www.ti.com Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing (continued) MCU Digital Function (GPIOPCTL Bit Encoding) Pin Port PIN Analog 1 2 3 5 6 7 8 11 13 14 15 43 PL0 81 - - I2C2SDA - - M0FAULT3 - - - - USB0D0 EPI0S16 45 PL1 82 - - I2C2SCL - - PhA0 - - - - USB0D1 EPI0S17 47 PL2 83 - - - - C0o PhB0 - - - - USB0D2 EPI0S18 49 PL3 84 - - - - C1o IDX0 - - - - USB0D3 EPI0S19 51 PQ0 5 - - - - - - - - - - SSI3Clk EPI0S20 53 PQ1 6 - - - - - - - - - - SSI3Fss EPI0S21 55 PQ2 11 - - - - - - - - - - SSI3XDAT0 EPI0S22 57 PQ3 27 - - - - - - - - - - SSI3XDAT1 EPI0S23 59 PK7 60 - U0RI I2C4SDA - - - - - - EPI0S24 61 GND 63 PK6 61 - - I2C4SCL - EN0LED1 M0FAULT1 - - - - - EPI0S25 65 PL4 85 - - - T0CCP0 - - - - - - USB0D4 EPI0S26 67 PB2 91 - - I2C0SCL T5CCP0 - - - - - - USB0STP EPI0S27 69 PB3 92 - - I2C0SDA T5CCP1 - - - - - - USB0CLK EPI0S28 71 PP2 103 - U0DTR - - - - - - - - USB0NXT EPI0S29 73 PP3 104 - U1CTS U0DCD - - - RTCCLK - - - USB0DIR EPI0S30 75 PK5 62 - - I2C3SDA - EN0LED2 M0PWM7 - - - - - EPI0S31 77 PK4 63 - - I2C3SCL - EN0LED0 M0PWM6 - - - - - EPI0S32 79 PL5 86 - - - T0CCP1 - - - - - - USB0D5 EPI0S33 81 PN4 111 - U1DTR U3RTS I2C2SDA - - - - - - - EPI0S34 83 PN5 112 - U1RI U3CTS I2C2SCL - - - - - - - EPI0S35 85 PN0 107 - U1RTS - - - - - - - - - - 87 PN1 108 - U1CTS - - - - - - - - - - 89 PN2 109 - U1DCD U2RTS - - - - - - - - EPI0S29 91 PN3 110 - U1DSR U2CTS - - - - - - - - EPI0S30 93 PQ4 102 - U1Rx - - - - - DIVSCLK - - - - 95 WAKE 97 5V 14 Hardware Description SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Functional Description Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing MCU Digital Function (GPIOPCTL Bit Encoding) Pin Port PIN Analog 1 2 3 5 6 7 8 11 13 14 15 2 5V 4 GND 6 PA2 35 - U4Rx I2C8SCL T1CCP0 - - - - - - - SSI0Clk 8 PA3 36 - U4Tx I2C8SDA T1CCP1 - - - - - - - SSI0Fss 10 PA4 37 - U3Rx I2C7SCL T2CCP0 - - - - - - - SSI0XDAT0 12 PA5 38 - U3Tx I2C7SDA T2CCP1 - - - - - - - SSI0XDAT1 14 PE0 15 AIN3 U1RTS - - - - - - - - - - 16 PE1 14 AIN2 U1DSR - - - - - - - - - - 18 PE2 13 AIN1 U1DCD - - - - - - - - - - 20 PE3 12 AIN0 U1DTR - - - - - - - - - - 22 PE4 123 AIN9 U1RI - - - - - - - - - SSI1XDAT0 24 PE5 124 AIN8 - - - - - - - - - - SSI1XDAT1 26 PK0 18 AIN16 U4Rx - - - - - - - - - EPI0S0 28 PK1 19 AIN17 U4Tx - - - - - - - - - EPI0S1 30 PK2 20 AIN18 U4RTS - - - - - - - - - EPI0S2 32 PK3 21 AIN19 U4CTS - - - - - - - - - EPI0S3 34 VREF 36 GND 38 PD5 126 AIN6 U2Tx - T3CCP1 - - - - - - - SSI1XDAT3 40 PD4 125 AIN7 U2Rx - T3CCP0 - - - - - - - SSI1XDAT2 42 PD7 128 AIN4 U2CTS - T4CCP1 USB0PFLT - - NMI - - - SSI1XDAT2 44 PD6 127 AIN5 U2RTS - T4CCP0 USB0EPEN - - - - - - SSI1XDAT3 46 PD3 4 AIN12 - I2C8SDA T1CCP1 - - - - - - - SSI2Clk 48 PD1 2 AIN14 - I2C7SDA T0CCP1 C1o - - - - - - SSI1XDAT0 50 PD0 1 AIN15 - I2C7SCL T0CCP0 C0o - - - - - - SSI1XDAT1 52 PD2 3 AIN13 - I2C8SCL T1CCP0 C2o - - - - - - SSI2Fss 54 PP0 118 C2+ U6Rx - - - - - - - - - SSI1XDAT2 56 PP1 119 C2- U6Tx - - - - - - - - - SSI1XDAT3 58 PB0 95 USB0ID U1Rx I2C5SCL T4CCP0 - - CAN1Rx - - - - - 60 PB1 96 USB0VBUS U1Tx I2C5SDA T4CCP1 - - CAN1Tx - - - - - 62 GND 64 PF4 46 - - - - EN0LED1 M0FAULT0 - - - - SSI3XDAT2 TRD3 66 PF0 42 - - - - EN0LED0 M0PWM0 - - - - SSI3XDAT1 TRD2 SPMU365A–March 2014–Revised March 2014 Hardware Description 15 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Functional Description www.ti.com Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued) MCU Digital Function (GPIOPCTL Bit Encoding) Pin Port PIN Analog 1 2 3 5 6 7 8 11 13 14 15 68 PF1 43 - - - - EN0LED2 M0PWM1 - - - - SSI3XDAT0 TRD1 70 PF2 44 - - - - - M0PWM2 - - - - SSI3Fss TRD0 72 PF3 45 - - - - - M0PWM3 - - - - SSI3Clk TRCLK 74 PA0 33 - U0Rx I2C9SCL T0CCP0 - - CAN0Rx - - - - - 76 PA1 34 - U0Tx I2C9SDA T0CCP1 - - CAN0Tx - - - - - 78 PP4 105 - U3RTS U0DSR - - - - - - - USB0D7 - 80 PP5 106 - U3CTS I2C2SCL - - - - - - - USB0D6 - 82 PJ0 116 - U3Rx - - - - - - - - - 84 PJ1 117 - U3Tx - - - - - - - - - - 86 PM7 71 TMPR0 U0RI - T5CCP1 - - - - - - - - 88 PM6 72 TMPR1 U0DSR - T5CCP0 - - - - - - - - 90 PM5 73 TMPR2 U0DCD - T4CCP1 - - - - - - - - 92 PM4 74 TMPR3 U0CTS - T4CCP0 - - - - - - - - 94 RESET 96 GND 98 3V3 16 Hardware Description SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Power Management 2.1.6.4 Other Headers and Jumpers JP1 is provided to select the power input source for the Connected LaunchPad. The top position is for BoosterPack power; this position also disconnects both USB voltages from the board’s primary 5-volt input. In the top position, the TPS2052B does not limit current so additional care should be exercised. The middle position draws power from the USB connector on the left side of the board near the Ethernet jack. The bottom position is the default, in which power is drawn from the ICDI (Debug) USB connection. JP2 separates the MCU 3.3-volt power domain from the rest of the 3.3-volt power on the board allowing an ammeter to be used to obtain more accurate measurements of microcontroller power consumption. JP3 isolates the output of the TPS73733 LDO from the board’s 3.3-V power domain. JP4 and JP5 are used to configure CAN signals to the BoosterPack 2 interface. In the default horizontal configuration, CAN is not present on the BoosterPack. UART 4 goes to the BoosterPack and UART 0 goes to the ICDI virtual serial port to provide ROM serial bootloader capability. In the vertical CAN-enabled configuration, UART 4 goes to the ICDI virtual serial port and CAN signals are available on the BoosterPack. The ROM serial bootloader is not available to the ICDI virtual serial port while the jumpers are in the CAN position. Figure 2-2 shows the default configuration and relative location of the jumpers on the board. Figure 2-2. Default Jumper Locations 2.2 Power Management 2.2.1 Power Supplies The Connected LaunchPad can be powered from three different input options: • On-board ICDI USB cable (Debug, Default) • Target USB cable • BoosterPack or Breadboard adapter connection The JP1 power-select jumper is used to select one of the power sources. In addition, the JP3 power jumper can be used to isolate the 3.3-volt output of the TPS73733 from the board’s 3.3-volt rail. A TPS2052B load switch is used to regulate and control power to the Target USB connector when the microcontroller is acting in USB host mode. This load switch also limits current to the BoosterPack and Breadboard adapter headers when the JP1 jumper is in the ICDI position. SPMU365A–March 2014–Revised March 2014 Hardware Description 17 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Power Management www.ti.com 2.2.2 Low Power Modes The Connected LaunchPad demonstrates several low power microcontroller modes. In run mode, the microcontroller can be clocked from several sources such as the internal precision oscillator or an external crystal oscillator. Either of these sources can then optionally drive an internal PLL to increase the effective frequency of the system up to 120 MHz. In this way, the run mode clock speed can be used to manage run mode current consumption. The microcontroller also provides sleep and deep sleep modes and internal voltage adjustments to the flash and SRAM to further refine power consumption when the processor is not in use but peripherals must remain active. Each peripheral can be individually clock gated in these modes so that current consumption by unused peripherals is minimized. A wide variety of conditions from internal and external sources can trigger a return to run mode. The lowest power setting of the microcontroller is hibernation, which requires a small amount of supporting external circuitry available on the Connected LaunchPad. The Connected LaunchPad can achieve microcontroller current consumption modes under 2 micro-Amps using hibernate VDD3ON mode. Hibernation with VDD3ON mode is not supported on this board. The Connected LaunchPad can be woken from hibernate by several triggers including the dedicated wake button, the reset button, an internal RTC timer and a subset of the device GPIO pins. The hibernation module provides a small area of internal SRAM that can preserve data through a hibernate cycle. 2.2.3 Clocking The Connected LaunchPad uses a 25 MHz crystal (Y1) to drive the main TM4C1294NCPDTI internal clock circuit. Most software examples use the internal PLL to multiply this clock to higher frequencies up to 120 MHz for core and peripheral timing. The 25-MHz crystal is required when using the integrated Ethernet MAC and PHY. The Hibernation module is clocked from an external 32.768-KHz crystal (Y3). 2.2.4 Reset The RESET signal to the TM4C1294NCPDTI microcontroller connects to the RESET switch, BoosterPack connectors, Breadboard adapter and to the ICDI circuit for a debugger-controller reset. External reset is asserted (active low) under the following conditions: • Power-on reset (filtered by and R-C network) • RESET switch is held down. • By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be supported by all debuggers) • By an external circuit attached to the BoosterPack or Breadboard connectors. 2.3 Debug Interface 2.3.1 In-Circuit Debug Interface (ICDI) The Connected LaunchPad comes with an on-board ICDI. The ICDI allows for the programming and debugging of the TM4C1294NCPDTI using LM Flash Programmer and/or any of the supported tool chains. Note that ICDI only supports JTAG debugging at this time. It is possible to use other JTAG emulators instead of the on board ICDI, by connecting to U6. When the ICDI detects an external debug adapter connection on the JTAG connector U6 and disables the ICDI outputs to allow the external debug adapter to drive the debug circuit. For more information, see Section 2.3.2. Debug out of the ICDI is possible by removing resistors R6, R7, R8, R10, R11, R15, R16 and R40 from the Connected LaunchPad and use the ICDI to drive JTAG signals out on U6 for the purpose of programming or debugging other boards. To restore the connection to the on-board TM4C1294NCPDTI microcontroller, install jumpers from the odd to even pins of X1 or re-install the resistors. Removal of R40 disables the detection of an attached external debugger. R40 must be installed to use an external debug adapter to program or debug the Connected LaunchPad. 18 Hardware Description SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Debug Interface 2.3.2 External Debugger The connector U6 is provided for the attachment of an external debug adapter such as the IAR J-Link or Keil ULINK. This connector follows the ARM standard 10-pin JTAG pinout. This interface can use either JTAG or SWD if supported by the external debug adapter. 2.3.3 Virtual COM Port When plugged into a USB host, the ICDI enumerates as both a debugger and a virtual COM port. JP4 and JP5 control the selection of which UART from the TM4C1294NCPDTI is connected to the virtual COM port. In the default configuration, UART0 maps to the virtual COM port of the ICDI. In the CAN jumper configuration, UART4 maps to the virtual COM port of the ICDI. SPMU365A–March 2014–Revised March 2014 Hardware Description 19 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 3 SPMU365A–March 2014–Revised March 2014 Software Development This chapter provides general information on software development as well as instructions for flash memory programming. 3.1 Software Description The TivaWare software provides drivers for all of the peripheral devices supplied in the design. The Tiva C Series Peripheral Driver Library is used to operate the on-chip peripherals as part of TivaWare. TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These applications demonstrate the capabilities of the TM4C1294NCPDTI microcontroller, as well as provide a starting point for the development of the final application for use on the Connected LaunchPad evaluation board. Example applications are also provided for the Connected LaunchPad when paired with selected BoosterPacks. 3.2 Source Code The complete source code including the source code installation instructions are provided at http://www.ti.com/tool/sw-tm4c. The source code and binary files are installed in the TivaWare software tree. 3.3 Tool Options The source code installation includes directories containing projects, makefiles, and binaries for the following tool-chains: • Keil ARM RealView® Microcontroller Development System • IAR Embedded Workbench for ARM • Sourcery Codebench • Generic GNU C Compiler • Texas Instruments' Code Composer Studio™ IDE Download evaluation versions of these tools from the Tools & Software section of www.ti.com/tiva. Due to code size restrictions, the evaluation tools may not build all example programs. A full license is necessary to re-build or debug all examples. For detailed information on using the tools, see the documentation included in the tool chain installation or visit the website of the tools supplier. 20 Software Development SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Programming the Connected LaunchPad 3.4 Programming the Connected LaunchPad The Connected LaunchPad software package includes pre-built binaries for each of the example applications. If you installed the TivaWare™ software to the default installation path of C:\ti\TivaWare_C_Series_, you can find the example applications in C:\ti\TivaWare_C_Series- \examples\boards\ek-tm4c129xl. The on-board ICDI is used with the LM Flash Programmer tool to program applications on the Connected LaunchPad. Follow these steps to program example applications into the Connected LaunchPad evaulation board using the ICDI: 1. Install LM Flash Programmer on a PC running Microsoft Windows. 2. Place JP1 into the ICDI position on the Connected LaunchPad. 3. Connect the USB-A cable plug in to an available USB port on the PC and plug the Micro-B plug to the Debug USB port (U22) on the Connected LaunchPad. 4. Verify that LED D0 at the top of the board is illuminated. 5. Install Windows ICDI and Virtual COM Port drivers if prompted. Installation instructions can be found at http://www.ti.com/lit/pdf/spmu287. 6. Run the LM Flash Programmer application on the PC. 7. In the Configuration tap, use the Quick Set control to select “TM4C1294XL LaunchPad”. 8. Move to the Program tab and click the Browse button. Navigate to the example applications directory (the default location is C:\ti\TivaWare_C_Series_\examples\boards\ek-tm4c1294xl\) 9. Each example application has its own directory. Navigate to the example directory that you want to load and then into the sub-directory for one of the supported tool chains which contains the binary (*.bin) file. Select the binary file and click Open. 10. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check Reset MCU After Program. The example program starts execution once the verify process is complete. SPMU365A–March 2014–Revised March 2014 Software Development 21 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 4 SPMU365A–March 2014–Revised March 2014 References, PCB Layout, and Bill of Materials 4.1 References In addition to this document the following references are available for download at www.ti.com. • TivaWare for C Series (http://www.ti.com/tool/sw-tm4c) • TivaWare Peripheral Driver Library Users' Guide (literature number SPMU298) • EK-TM4C1294XL Getting Started Guide (literature number SPMZ858) • LM Flash Programmer Tool (http://www.ti.com/lmflashprogrammer) • TPS73733 Low-Dropout Regulator with Reverse Current Protection (http://www.ti.com/product/tps79733) • Texas Instruments Code Composer Studio website (http://www.ti.com/ccs) • Tiva C Series TM4C1294NCPDT Microcontroller Data Sheet (http://www.ti.com/lit/gpn/tm4c1294ncpdt) • Build Your Own BoosterPack information regarding the BoosterPack standard (http://www.ti.com/byob) • ICDI Driver Installation Guide (literature number SPMU287) Additional Support: • Keil RealView MDK-ARM (http://www.keil.com/arm/mdk.asp) • IAR Embedded Workbench for ARM (http://iar.com/ewarm/) • Sourcery CodeBench development tools (http://www.mentor.com/embedded-software/sourcerytools/ sourcery-codebench/overview) • Exosite (http://ti.exosite.com) 22 References, PCB Layout, and Bill of Materials SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Component Locations 4.2 Component Locations Figure 4-1 is a dimensioned drawing of the Connected LaunchPad. This figure shows the location of selected features of the board as well as the component locations. Figure 4-1. Connected LaunchPad Dimensions and Component Locations SPMU365A–March 2014–Revised March 2014 References, PCB Layout, and Bill of Materials 23 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Bill of Materials www.ti.com 4.3 Bill of Materials Table 4-1 is the Connected LaunchPad bill of materials list. Table 4-1. Connected LaunchPad Bill of Materials Item Ref Qty Description Mfg Part Number 1 C1 1 Capacitor, 1000pF, 2kV, Kemet C1210C102MGRACTU 20%, X7R, 1210 C3, C4, C5, C10, C11, C12, C13, C16, C17, C18, C19, Capacitor, 0.1uF 16V, 2 C21, C22, C23, C24, C25, 26 10%,0402 X7R Taiyo Yuden EMK105B7104KV-F C26, C27, C28, C29, C30, C40, C41, C42, C43, C46 3 C31 1 Capacitor, 4700pF, 2kV, AVX 1812GC472KAT1A 10%,X7R, 1812 4 C32, C33 2 Capacitor, 3300pF, 50V, TDK C1608X7R1H332K 10%, X7R, 0603 5 C6, C14 2 Capacitor, 1uF , X5R, 10V, Johanson 100R07X105KV4T Low ESR, 0402 Dielectrics Inc 6 C7, C15, C20 3 Capacitor, 2.2uF, 16V, Murata GRM188R61C225KE15D 10%, 0603, X5R 7 C8, C9, C44, 6 Capacitor, 12pF, 50V, Murata GRM1555C1H120JZ01D C45, C47, C48 5%, 0402, COG 8 D0, D1, D2, D3, D4 5 Green LED 0603 Everlight 19-217/G7C-AL1M2B/3T J1, J2, J3, Jumper, 0.100, Gold, 3M 969102-0000-DA 9 J4, J5, J6, J7 7 Black, Open Kobiconn 151-8000-E Header, 2x3, 0.100, T-Hole, 10 JP1 1 Vertical Unshrouded, FCI 67996-206HLF 0.230 Mate, gold Header, 1x2, 0.100, T-Hole, 3M 961102-6404-AR 11 JP2, JP3 2 Vertical Unshrouded, 0.220 FCI 68001-102HLF Mate Anyone 1x2-head Header, 2x2, 0.100, T-Hole, FCI 67997-104HLF 12 JP4, JP5 2 Vertical Unshrouded, 0.230 Mate 4UCON 00998 13 R1, R2, R3, R4, 8 Resistor, 10k ohm, 1/10W, Yageo RC0402FR-0710KL R5, R29, R35, R44 5%, 0402 Thick Film 14 R17, R26, R36 3 100k 5% 0402 resistor smd Rohm MCR01MRTJ104 15 R18, R51 2 Resistor 0402 100 ohm 5% Rohm MCR1MRTJ101 16 R23, R21, R22, R24 4 Resistor 49.9 ohm 0402. 1 % Rohm MCR01MRTF49R9 17 R25 1 Resistor 4.87k 1% 0402 smd Rohm MCR01MRTF4871 18 R28 1 Resistor, 5.6k ohm, Panasonic ERJ-2GEJ562X 1/10W, 5%, 0402 19 R32, R43, R45, R46 4 resistor 75 ohm 0402 5% Rohm MCR01MRTJ750 20 R34, R52 2 Resistor, 1M OH, Panasonic ERJ-3GEYJ105V 1/10W, 5% 0603 SMD 21 R38 1 Resistor, 51 ohm, Panasonic ERJ-2GEJ510X 1/10W, 5%, 0402 22 R42 1 Resistor, 1M Ohm, Rohm MCR01MRTF1004 1/10W, 5%, 0402 23 R47 1 RES 1M OHM 5% 1206 TF Panasonic ERJ-8GEYJ105V 24 R49, R50 2 Resistor, 2.0k ohm, Panasonic ERJ-3GEYJ202V 1/10W, 5%, 0402 R6, R7, R8, R10, R11, Resistor, 0 ohm, 25 R15, R16, R19, R20, R39, 12 1/10W, 5%, 0402 Panasonic ERJ-2GE0R00X R40, R41 26 R9, R27, R30, R31, R33 5 Resistor, 330 ohm, Yageo RC0402FR-07330RL 1/10W, 5%, 0402 24 References, PCB Layout, and Bill of Materials SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated www.ti.com Bill of Materials Table 4-1. Connected LaunchPad Bill of Materials (continued) Item Ref Qty Description Mfg Part Number 27 RESET, USR_SW1, 4 Switch, Tact 6mm SMT, Omron B3S-1000 USR_SW2, WAKE 160gf Tiva, MCU TM4C1294NCPDT Texas Instruments TM4C1294NCPDT 28 U1 1 128 QFP with Ethernet MAC + PHY Texas Instruments XM4C1294NCPDT 29 U10 1 Transformer, ethernet, 1 to 1. Pulse Electronics HX1198FNL SOIC 16 30 U13 1 Diode, 8 chan, +/-15KV, ESD Semtech SLVU2.8-4.TBT Protection Array, SO-8 31 U14 1 Connector, RJ45 NO MAG, TE Connectivity 1-406541-5 shielded THRU HOLE 32 U2, U3 2 IC 4CH ESD SOLUTION Texas Instruments TPD4S012DRYR W/CLAMP 6SON 33 U20 1 Stellaris TIVA MCU Texas Instruments TM4C123GH6PMI TM4C123GH6PMI 34 U22 1 USB Micro B receptacle FCI 10118194-0001LF right angle with guides 35 U4 1 Fault protected power switch, Texas Instruments TPS2052BDRBR dual channel, 8-SON 36 U5 1 3.3V LDO TI TPS73733DRV Texas Instruments TPS73733DRV fixed out 5V in Samtec SHF-105-01-S-D-SM 37 U6 1 Header 2x5, 0.050, SM, Vertical Shrouded Don Connex C44-10BSA1-G Electronics USB Micro AB receptacle. 38 U7 1 Right angle with through Hirose ZX62D-AB-5P8 guides Samtec SSW-110-23-S-D 39 X6, X7, X8, X9 4 Header, 2x10, T-Hole Vertical unshrouded stacking Major League SSHQ-110-D-08-F-LF Electronics 40 Y1 1 Crystal 25 MHz 3.2 x 2.5 mm NDK nx3225ga-25.000m-std-crg-2 41 Y2 1 Crystal 16 MHz 3.2 x 2.5 mm NDK NX3225GA-16.000M-STD-CRG-2 4 pin 42 Y3 1 Crystal, 32.768 KHz Radial Citizen Finetech CMR200T-32.768KDZY-UT Can Miyota PCB Do Not Populate List (Shown for information only) 43 C2 1 Capacitor, 0.1uF 16V, Taiyo Yuden EMK105B7104KV-F 10%, 0402 X7R Screw, #4 x 0.625" Pan 44 H1, H4, H6 3 Head, Sheet Metal, McMaster 90077A112 Phillips/Slotted (for fan) 45 R12, R13, R14 3 Resistor, 5.6k ohm, Panasonic ERJ-2GEJ562X 1/10W, 5%, 0402 46 R48 1 Resistor 0402 1% 52.3k Rohm TRR01MZPF5232 TP1, TP2, TP3, TP4, TP5, 47 TP6, TP7, TP8, TP9, 17 Terminal, Test Point Miniature Keystone 5000 TP10, TP11, TP12, TP13, Loop, Red, T-Hole TP14, TP15, TP16, TP17 Header, 2x7, 0.100, T-Hole, 48 X1 1 Vertical, Unshrouded, 0.230 FCI 67997-114HLF Mate Valvano style bread board 49 X11A 1 connect. Right Angle Samtec TSW-149-09-F-S-RE extended, 1 x 49 0.100 pitch. 50 X11B 1 valvano style breadboard Samtec TSW-149-08-F-S-RA header. SPMU365A–March 2014–Revised March 2014 References, PCB Layout, and Bill of Materials 25 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Chapter 5 SPMU365A–March 2014–Revised March 2014 Schematic This section contains the complete schematics for the Tiva C Series TM4C1294 Connected LaunchPad. • Microcontroller, USB, Buttons, and LED's • BoosterPack connectors • Breadboard connector • Ethernet and Ethernet LED's • Power • In-Circuit Debug Interface 26 Schematic SPMU365A–March 2014–Revised March 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated GND 330 GND GND SWITCH_TACTILE SWITCH_TACTILE GND 330 GND TPD4S012_DRY_6 GND GND 100 1M 3300pF TP4 TP5 TP6 TP7 D1 R33 USR_SW1 USR_SW2 D2 R27 D+ 1 D- 2 GND 4 ID 3 N.C. 5 VBUS 6 U2 R18 DM P2 DP P3 GND P5 ID P4 VBUS P1 TP14 TP15 TP16 TP17 PA0 P$33 PA1 P$34 PA2 P$35 PA3 P$36 PA4 P$37 PA5 P$38 PA6 P$40 PA7 P$41 PB0 P$95 PB1 P$96 PB2 P$91 PB3 P$92 PB4 P$121 PB5 P$120 PC0 P$100 PC1 P$99 PC2 P$98 PC3 P$97 PC4 P$25 PC5 P$24 PC6 P$23 PC7 P$22 PD0 P$1 PD1 P$2 PD2 P$3 PD3 P$4 PD4 P$125 PD5 P$126 PD6 P$127 PD7 P$128 PE0 P$15 PE1 P$14 PE2 P$13 PE3 P$12 PE4 P$123 PE5 P$124 PF0 P$42 PF1 P$43 PF2 P$44 PF3 P$45 PF4 P$46 PG0 P$49 PG1 P$50 PH0 P$29 PH1 P$30 PH2 P$31 PH3 P$32 PJ0 P$116 PJ1 P$117 PK0 P$18 PK1 P$19 PK2 P$20 PK3 P$21 PK4 P$63 PK5 P$62 PK6 P$61 PK7 P$60 PL0 P$81 PL1 P$82 PL2 P$83 PL3 P$84 PL4 P$85 PL5 P$86 PL6 P$94 PL7 P$93 PM0 P$78 PM1 P$77 PM2 P$76 PM3 P$75 PM4 P$74 PM5 P$73 PM6 P$72 PM7 P$71 PN0 P$107 PN1 P$108 PN2 P$109 PN3 P$110 PN4 P$111 PN5 P$112 PP0 P$118 PP1 P$119 PP2 P$103 PP3 P$104 PP4 P$105 PP5 P$106 PQ0 P$5 PQ1 P$6 PQ2 P$11 PQ3 P$27 PQ4 P$102 R52 C32 GPIO PA0 PA1 PA2 PA3 PA5 PA6 PA7 PA4 PB0 PB0/3.2C TARGET_VBUS/3.2C TARGET_VBUS/3.2C TARGET_VBUS/3.2C PB2 PB3 PB4 PB5 PC4 PC5 PC6 PC7 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PF0 PF1 PF2 PF3 PF4 PE0 PE1 PE2 PE3 PE4 PE5 PG0 PG1 PH0 PH1 PH2 PJ0 PH3 PJ0/3.2D PJ1 PJ1/3.2D PK0 PK1 PK2 PK3 PK4 PK5 PK6 PK7 PL0 PL1 PL2 PL3 PL4 PL5 USBD_P USBD_P USBD_P USBD_N USBD_N USBD_N PM0 PM1 PM2 PM3 PM4 PM5 PM6 PM7 PP0 PP1 PP2 PP3 PP4 PP5 PN0 PN0/3.4D PN1 PN1/3.4D PN2 PN3 PN4 PN5 PQ0 PQ1 PQ2 PQ3 PQ4 TARGET_TCK/SWCLK/6.1A TARGET_TMS/SWDIO/6.1A TARGET_TDI/6.1E TARGET_TDO/SWO/6.1E TARGET_ID TARGET_ID A B C D E A B C D E 1 2 3 4 5 6 U7G$1 U1G$1 TM4C1294NCPDT See PF0 and PF4 for additional LED's used for Ethernet or user application NOTE: TPD4S012 all protection circuits are identical. Connections chosen for simple routing. convienence test points for ground TSW-110-02-S-D TSW-110-02-S-D TSW-110-02-S-D TSW-110-02-S-D 0 0 +3V3 +3V3 +5V +5V 0.1uF 0.1uF 0.1uF 0.1uF GND GND GND GND X6-1 X6-2 X6-3 X6-4 X6-5 X6-6 X6-7 X6-8 X6-9 X6-10 X6-11 X6-12 X6-13 X6-14 X6-15 X6-16 X6-17 X6-18 X6-19 X6-20 X7-1 X7-2 X7-3 X7-4 X7-5 X7-6 X7-7 X7-8 X7-9 X7-10 X7-11 X7-12 X7-13 X7-14 X7-15 X7-17 X7-16 X7-19 X7-18 X7-20 X8-1 X8-2 X8-3 X8-4 X8-5 X8-6 X8-7 X8-8 X8-9 X8-10 X8-11 X8-12 X8-13 X8-14 X8-15 X8-16 X8-17 X8-18 X8-19 X8-20 X9-1 X9-2 X9-3 X9-4 X9-5 X9-6 X9-7 X9-8 X9-9 X9-10 X9-11 X9-13 X9-12 X9-15 X9-14 X9-17 X9-16 X9-19 X9-18 X9-20 R19 R20 JP4 1 2 3 4 JP5 1 2 3 4 C23 C24 C25 C26 PB2 PB3 PL0 PP2 PH2 GND/1.6B GND/1.6B GND/1.6B GND/1.6B TARGET_RESET/3.2D TARGET_RESET/3.2D PA0/3.2C BP2_A2.5 BP2_A2.5 TARGET_RXD/6.1D TARGET_TXD/6.1D PA1/3.2C BP2_A2.6 BP2_A2.6 PE4 PE5 PC5 PC4 PM3 PM4 PM5 PL4 PD5/1.4B PC6 PD3 PC7 PE0 PE1 PE2 PE3 PD4/1.4B PD7 PF1 PF2 PF3 PG0 PL5 PL1 PL2 PL3 PH3 PD1 PD0 PN2 PN3 PD2 PP0 PP1 PQ0 PP4 PN5 PN4 PB4 PB5 PK0 PK1 PK2 PK3 PA4 PA5 PG1 PK4 PK5 PM0 PM1 PM2 PH0 PH1 PK6 PK7 PM7 PA7 PA3 PA2 PQ3 PQ2 PP3 PQ1 PM6 PP5 PA6 BoosterPack 2 Interface BoosterPack 1 Interface A B C D E A B C D E 1 2 3 4 5 6 JP4 and JP5 CAN and ICDI UART Selection: Populate Jumpers from 1-2 and 3-4 for Default Mode This enables ROM UART boot loader. UART 0 to ICDI Populate from 1-3 and 2-4 for controller area network on the boosterpack. UART2 is then availabe to ICDI. R19 and R20 can be populated to enable I2C on Right side of BP2 interface. This is for legacy support and the Sensor Hub BoosterPack. I2C and SSI are available on the corresponding BoosterPack 1 interface pins without modification to the board. PA6 and PA7 are also used by the onboard radio. Configure the radio to tri-state these GPIO before using them on the boosterpack interface. TSW-149-02-S-D +3V3 +3V3 +5V +5V 0.1uF 0.1uF 0.1uF 0.1uF GND GND GND GND X11-2 X11-1 X11-4 X11-3 X11-6 X11-5 X11-8 X11-7 X11-10 X11-9 X11-12 X11-11 X11-14 X11-13 X11-16 X11-15 X11-18 X11-17 X11-20 X11-19 X11-22 X11-21 X11-24 X11-23 X11-26 X11-25 X11-28 X11-27 X11-30 X11-29 X11-32 X11-31 X11-34 X11-33 X11-36 X11-35 X11-38 X11-37 X11-40 X11-39 X11-42 X11-41 X11-44 X11-43 X11-46 X11-45 X11-48 X11-47 X11-50 X11-49 X11-52 X11-51 X11-54 X11-53 X11-56 X11-55 X11-58 X11-57 X11-60 X11-59 X11-62 X11-61 X11-64 X11-63 X11-66 X11-65 X11-68 X11-67 X11-70 X11-69 X11-72 X11-71 X11-74 X11-73 X11-76 X11-75 X11-78 X11-77 X11-80 X11-79 X11-82 X11-81 X11-84 X11-83 X11-86 X11-85 X11-88 X11-87 X11-90 X11-89 X11-92 X11-91 X11-94 X11-93 X11-96 X11-95 X11-98 X11-97 C28 C27 C29 C30 VREF+/5.5B TARGET_RESET/2.4D GND/2.3C GND/2.3C GND/4.1A GND/2.3C GND/4.1A PB4 PB5 PH0 PH1 PH2 PH3 PC7 PC6 PC5 PC4 PA6 PA7 PG1 PM3 PM2 PM1 PM0 PL0 PL2 PL3 PQ0 PQ1 PK7 PK6 PL4 PB2 PB3 PP2 PP3 PK5 PK4 PL5 PN4 PN5 PG0 PL1 PQ2 PQ3 PN0 PN1 PN2 PN3 PQ4 WAKE/5.5A PA2 PA3 PA4 PA5 PE0 PE1 PE2 PE3 PE4 PE5 PK0 PK1 PK2 PK3 PD5 PD4 PD7 PD6 PD3 PD1 PD0 PD2 PP0 PP1 PB0 TARGET_VBUS/1.6B PF4 PF0 PF1 PF2 PF3 PA0 PA1 PP4 PP5 PJ0 PJ1 PM7 PM6 PM5 PM4 A B C D E A B C D E 1 2 3 4 5 6 NOTE: PB0 and PB1 are used in some configurations with 5V signals especially in USB Host or OTG mode. Be aware the 5V may be present on these pins depending on system jumper configuration These pins are only 5V tolerant when configured for USB mode applications. This is the breadboard connection header. Samtec TSW-149-08-F-S-RA and TSW-149-09-F-S-RE can be used together to create a breadboard connector see the Users Manual for more information. 49.9 49.9 49.4 49.9 330 GND 330 GND 0.1uF 0.1uF GND GND 0.1uF 0.1uF 75 75 GND GND 75 75 GND 4700pF 1M 1000pF R21 R22 R23 R24 D4 R30 D3 R31 C17 C16 C22 C18 P$1 P$1 P$2 P$2 P$3 P$3 P$6 P$6 P$7 P$7 P$8 P$8 P$9 P$9 P$10 P$10 P$11 P$11 P$14 P$14 P$15 P$15 P$16 P$16 P$1 1 P$2 2 P$3 3 P$4 4 P$5 5 P$6 6 P$7 7 P$8 8 R32 R43 CHASSIS 9 CHASSIS 10 RX+ 3 RX- 6 TERM1A 4 TERM1B 5 TERM2A 7 TERM2B 8 TX+ 1 TX- 2 R45 R46 C31 R47 C1 EN0RXI_N/5.3B EN0RXI_P/5.3B EN0TXO_N/5.3B EN0TXO_P/5.3B PF4/3.2C PF0/3.2C MCU_3V3/5.2A A B C D E A B C D E 1 2 3 4 5 6 U10 U13 U14 For Ethernet example Applications: LED4 is default configured as Ethernet Link OK LED3 is default configured as Ethernet TX/RX activity User may re-configure these pins / LED's for any application usage. Place pull up resistors and C16-C17 near TM4C MCU. Place C18 and C22 near pin 2 and pin 7 of U$10 U10 May be populated with either HX1188FNL or HX1198FNL. HX1198FNL preferred for best Ethernet performance. +3V3 +5V GND 0.1uF 2.2uF 0.1uF GND 330 GND 100k 4.87k 1% GND GND 0.1uF 1.0uF 2.2uF 0.1uF 0.1uF 0.1uF 0.1uF GND 0 0 GND 1M SWITCH_TACTILE 12pF 12pF 10k 0.1uF 12pF 12pF SWITCH_TACTILE GND MOUNT-HOLE3.2 MOUNT-HOLE3.2 GND GND GND GND GND TPS2052B_DRB_8 +5V 10k 100k GND 51 0.1uF GND +3V3 100k TPS73733_DRV_6 OMIT 2k MOUNT-HOLE3.2 100 CRYATL_32K_SMD C19 C20 C21 D0 R9 R17 TP3 R25 C4 C14 C15 C40 C41 C42 C43 TP9 TP10 TP11 TP12 R39 TP13 R41 R42 RESET C44 C45 NC2 P$2 NC4 P$4 OSC0 P$1 OSC1 P$3 R44 C46 C47 C48 WAKE H4 H6 *EN1 3 *EN2 4 *OC1 8 *OC2 5 EPAD 9 GND 1 IN 2 OUT1 7 OUT2 6 VIA V VIA V_2 VIA V_3 VIA V_4 VIA V_5 VIA V_6 U4 JP1 1 2 3 4 5 6 JP2 1 2 JP3 1 2 R35 R36 TP8 R38 C3 R26 EN 4 EPAD 7 GND 3 IN 6 NC 5 NR/FB 2 OUT 1 VIA V VIA V_2 U5 R48 R49 H1 R51 HIB P$65 RESET P$70 WAKE P$64 EN0RXIN P$53 EN0RXIP P$54 EN0TXON P$56 EN0TXOP P$57 GND P$17 GND P$48 GND P$55 GND P$58 GND P$80 GND P$114 GNDA P$10 OSC0 P$88 OSC1 P$89 RBIAS P$59 VBAT P$68 VDD P$7 VDD P$16 VDD P$26 VDD P$28 VDD P$39 VDD P$47 VDD P$51 VDD P$52 VDD P$69 VDD P$79 VDD P$90 VDD P$101 VDD P$113 VDD P$122 VDDA P$8 VDDC P$87 VDDC P$115 VREFA+ P$9 XOSC0 P$66 XOSC1 P$67 P$1 P$1 P$2 P$2 Y3 TARGET_VBUS/3.2C TARGET_VBUS/3.2C DEBUG_VBUS/6.4A EN0RXI_N EN0RXI_P EN0TXO_N EN0TXO_P RBIAS WAKE/3.3D MCU_3V3/6.2A MCU_3V3/4.1A VBUS VBUS VBUS PQ4/3.4D PD6/3.2B TARGET_RESET/3.2D A B C D E A B C D E 1 2 3 4 5 6 Y1 25Mhz U1G$2 Power Control Jumper: 1) To power from Debug install jumper on pins 5 - 6 2) To power from Target USB install jumper on pins 3 - 4 3) To power from BoosterPack 5V install jumper on pins 1 - 2 This is also the off position if BoosterPack does not supply power When powered from BoosterPack TPS2052B does not provide current limit protection. When powered by BoosterPack, USB host mode does not supply power to connected devices Primary 3.3V regulator Disconnect JP3 to power device from 3V3 BoosterPack JP2 can be used to measure MCU current consumption with a multi-meter. TPS2052B provides current limit for main 5V power. Also provides power switching for USB host/OTG modes For Host/OTG: PD6 configured as USB0EPEN peripheral function. PQ4 configure as individual pin interrupt. Indicates power fault on the USB bus. USB0PFLT peipheral pin not available due to pin mux and use on BoosterPacks. USB Host mode does not supply power to devices when powered from a BoosterPack For Applications that do not use USB: Configure PD6 as input with internal pull-down enabled. Turns off power to TARGET_VBUS R38 and C3 Used to meet VBAT rise time requirements R41 may be removed and precision reference applied to TP13 OMIT TSW-107-02-S-D OMIT +3V3 10k 0.1uF OMIT 0.1uF 1.0uF 12pF 12pF 0.1uF 0.1uF 0.1uF 0.1uF +3V3 +3V3 2.2uF 5.6k OMIT 5.6k OMIT 5.6k OMIT 10k 10k 10k 10k +3V3 0 0 0 0 0 0 0 GND GND GND GND GND GND GND GND GND GND GND GND 0 +3V3 TPD4S012_DRY_6 5.6k 10k GND 2k GND 1M 3300pF GND TRST 9 GND 3 NC 5 RESET 10 RTCK 7 TCK 4 TDI 8 TDO 6 TMS 2 VTREF 1 U21 X1-2 X1-1 X1-4 X1-3 X1-6 X1-5 X1-8 X1-7 X1-10 X1-9 X1-12 X1-11 X1-14 X1-13 R3 C2 C5 C6 C8 C9 C10 C11 C12 C13 NC2 P$2 NC4 P$4 OSC0 P$1 OSC1 P$3 C7 R12 R13 R14 R1 R2 R4 R5 TP2 TP1 R6 R7 R8 R10 R11 R15 R16 EXTDBG P3 RESET P10 GND P5 GND1 P9 P$7 P7 TCK P4 TDI P8 TDO P6 TMS P2 VTARGET P1 R40 HIB P$33 RESET P$38 WAKE P$32 GND0 P$12 GND1 P$27 GND2 P$39 GND3 P$55 GNDA P$3 GNDX P$35 OSC0 P$40 OSC1 P$41 PA0 P$17 PA1 P$18 PA2 P$19 PA3 P$20 PA4 P$21 PA5 P$22 PA6 P$23 PA7 P$24 PB0 P$45 PB1 P$46 PB2 P$47 PB3 P$48 PB4 P$58 PB5 P$57 PB6 P$1 PB7 P$4 PC0/TCK P$52 PC1/TMS P$51 PC2/TDI P$50 PC3/TDO P$49 PC4 P$16 PC5 P$15 PC6 P$14 PC7 P$13 PD0 P$61 PD1 P$62 PD2 P$63 PD3 P$64 PD4 P$43 PD5 P$44 PD6 P$53 PD7 P$10 PE0 P$9 PE1 P$8 PE2 P$7 PE3 P$6 PE4 P$59 PE5 P$60 PF0 P$28 PF1 P$29 PF2 P$30 PF3 P$31 PF4 P$5 VBAT P$37 VDD0 P$11 VDD1 P$26 VDD2 P$42 VDD3 P$54 VDDA P$2 VDDC0 P$25 VDDC1 P$56 XOSC0 P$34 XOSC1 P$36 DM P2 DP P3 GND P5 ID P4 VBUS P1 D+ 1 D- 2 GND 4 ID 3 N.C. 5 VBUS 6 U3 R28 R29 R50 R34 C33 ICDI_TDI ICDI_TMS ICDI_TMS ICDI_TCK ICDI_TCK ICDI_TDO ICDI_TDO ICDI_RESET ICDI_RESET VCP_RXD VCP_RXD VCP_RXD VCP_TXD VCP_TXD VCP_TXD DEBUG_PC1/TMS/SWDIO DEBUG_PC1/TMS/SWDIO DEBUG_PC1/TMS/SWDIO DEBUG_PC1/TMS/SWDIO DEBUG_PC1/TMS/SWDIO DEBUG_PC3/TDO/SWO DEBUG_PC3/TDO/SWO DEBUG_PC3/TDO/SWO DEBUG_PC3/TDO/SWO DEBUG_PC3/TDO/SWO DEBUG_PC2/TDI DEBUG_PC2/TDI DEBUG_PC2/TDI DEBUG_PC2/TDI DEBUG_RESET_OUT DEBUG_RESET_OUT DEBUG_RESET_OUT DEBUG_RESET_OUT EXTERNAL_DEBUG EXTERNAL_DEBUG ICDI_VDDC VERSION_1 VERSION_1 VERSION_2 VERSION_2 VERSION_0 VERSION_0 DEBUG_ACTIVE ICDI_USBD_N ICDI_USBD_N ICDI_USBD_P TARGET_TXD/2.5D ICDI_USBD_P TARGET_TXD/2.5D TARGET_RXD/2.5D TARGET_RXD/2.5D TARGET_TCK/SWCLK/1.2A TARGET_TCK/SWCLK/1.2A TARGET_TCK/SWCLK/1.2A TARGET_TMS/SWDIO/1.2B TARGET_TMS/SWDIO/1.2B TARGET_TMS/SWDIO/1.2B TARGET_TDI/1.2B TARGET_TDI/1.2B TARGET_TDO/SWO/1.2B TARGET_TDO/SWO/1.2B TARGET_RESET/5.2A TARGET_RESET/5.2A DEBUG_VBUS/5.1B DEBUG_VBUS/5.1B DEBUG_VBUS/5.1B DEBUG_PC0/TCK/SWCLK DEBUG_PC0/TCK/SWCLK DEBUG_PC0/TCK/SWCLK DEBUG_PC0/TCK/SWCLK DEBUG_PC0/TCK/SWCLK MCU_3V3/5.6B A B C D E A B C D E 1 2 3 4 5 6 Y2 16M U6 JTAG_ARM_10PIN U20 TM4C123GH6PMI TM4C123xH6PMI U22G$1 PE4 ETM_ENn Leave Open use GPIO Internal weak pullup. PE5 LS_PRESENTn Leave Open use GPIO internal weak pullup VERSION RESISTOR TABLE: *use internal GPIO weak pullups. ALL OMITTED: Legacy mode. (Stellaris ICDI) ALL POPULATED: Everything enabled Version 0 populated: UART CTS/RTS and Analog inputs JTAG PULL-UPS Jumpers to bridge from ICDI to Target portion of LaunchPad EXTERNAL_DEBUG pull low to use external debugger to debug the target. Causes ICDI chip to tri-state the JTAG lines Use this for JTAG IN from external debugger. See X1 jumpers for information about debug out to an external target. R40 must be removed for debug out. R40 must be instaled for debug in. X1 omitted by default To debug out from ICDI to off board MCU remove 0 ohm jumper resistors. To go back from debug out to debugging the target MCU install X1 and place jumpers on all pins. Chapter 6 SPMU365A–March 2014–Revised March 2014 Revision History This history highlights the changes made to the SPMU365 user's guide to make it an SPMU365A revision. Table 6-1. Revision History SEE ADDITIONS/MODIFICATIONS/DELETIONS Table 2-3, X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing: • Updated/Changed Pin 1 from "5V" to "3V3" • Updated/Changed Pin 25 from "PC4" to "PA6" Section 2.1.6.3 • Updated/Changed Pin 27 from "PA6" to "PA7" Breadboard Connection • Updated/Changed Pin 29 from "PA7" to "PG1" • Updated/Changed Pin 61 from "EPI0S12" to "GND" Table 2-4, X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing: • Updated/Changed Pin 2 from "3V3" to "5V" SPMU365A–March 2014–Revised March 2014 Revision History 27 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated UTS Series Dynamic IP68/69K • UV Resistant • UL/IEC Compliant © 2011 – SOURIAU 3 How to read our catalogue ........................................ 06 UTS range overview ..................................................... 07 General technical characteristics ............................. 10 Cable assembly ............................................................... 14 2 contacts ....................................................................... 20 2 + ground contacts ................................................... 28 3 contacts ........................................................................ 36 3 + ground contacts .................................................... 52 4 contacts ........................................................................ 60 5 contacts ........................................................................ 72 6 contacts ........................................................................ 76 6 + ground contacts .................................................... 88 7 contacts ........................................................................ 92 8 contacts ........................................................................ 96 10 contacts ..................................................................... 104 12 contacts ...................................................................... 108 14 contacts ...................................................................... 116 15 contacts ...................................................................... 120 18 contacts ..................................................................... 124 19 contacts ..................................................................... 128 23 contacts ..................................................................... 132 32 contacts ..................................................................... 136 Contents UTS Series Overview Mechanics Description ...................................................................... 142 Contact plating selector guide .................................. 143 Contact selector guide ................................................ 144 Packaging ........................................................................ 144 Crimp contacts ............................................................... 145 #16 coaxial contacts ................................................... 147 PCB contacts .................................................................. 148 Fibre optic contacts ...................................................... 149 Contacts Tooling .............................................................................. 154 Assembly instruction .................................................... 156 Dimensions overmoulded harnesses ..................... 162 Extraction tools .............................................................. 162 Rated current & working voltage .............................. 163 UV resistance ................................................................. 164 UL94 + UL1977 ............................................................ 165 IEC 61984 with IP code explanation ...................... 168 What is NEMA rating ? ................................................ 170 Ethernet for the layman ............................................... 171 Technical information #16 coaxial contacts - cabling notices .................. 176 Glossary of terms .......................................................... 183 Discrimination/Keying methods ............................... 184 Part number Index.......................................................... 185 Appendices Appendices Technical information Contacts Mechanics Overview UTS Series © 2011 – SOURIAU 5 Overview UTS Series How to read our catalog .............................................................................................................. 06 UTS range overview ...................................................................................................................... 07 General technical characteristics .............................................................................................. 10 6 © 2011 – SOURIAU UTS Series Overview SOURIAU is pleased to announce the arrival of a brand new catalog containing some signifi cant improvements to simplify the connector selection process and provide easy access to key information. In this version you can see all layouts at a glance, download 2D drawings and 3D models. Then, when your choice is made, you can click on the part number and buy online. Step 3 Step 2 Easy access to supporting material such as prints and CAD models. In just two pages you can gather together details of all accessories, contacts, tools etc required for your application. Interactive zones. Clearer understanding of the range. Step 1 © 2011 – SOURIAU 7 UTS range overview The UTS series is a plastic connector range but rugged enough to withstand industrial applications. The philosophy of the UTS series is built around three key elements: Dynamic IP68/69K UV Resistant UL/IEC Compliant In most applications, our connectors are exposed to extreme climatic conditions; it was therefore key for us to select the materials best able to cope with the targeted environment. Part of our product qualifi cation process involved subjecting connectors to a simulated fi ve years of exposure to various elements including Temperature, UV and Humidity. The results were positive in that there were no visible signs of weakness, such as cracking or crazing. The outmost priority for any electrical installation is to protect personnel from any shock hazard. In North America, Underwriters Laboratories insisted that connector manufacturers, depending of the application, respect their standards. The UTS series had thus been qualifi ed and is certifi ed by this organisation. In Europe and in Asia, IEC standards are better known and trusted by end users. Like its American equivalent, the IEC refers to safety rules. The UTS series was obviously designed to respect these rules. UTS series is rated at IP68/69K… even in dynamic conditions. This means that it remain sealed even when used continuously underwater or cleaned using a high pressure hose and cable is moving. This extreme level of performance is achievable with jacketed cable or discrete wires. If this same level of performance is required even when connectors are not mated, we have UTS Hi Seal; a product designed to remain watertight if an environmental cap is not fi tted or if the equipment is likely to get wet when cables have been disconnected. Screw termination version UTS series is a wide range... Based on multiple power & signal connectors and offers everything from box mounted receptacles and cable mounted plugs to cable mounted in-line and PCB mounted receptacles. Almost all ways to accommodate wires exist: Crimp, Solder, Screw termination. UTS Series Overview The bayonet coupling system makes it simple to use. With only a 1/3 twist of the coupling ring, connectors are mated with an audible and sensitive “click”. Overview 8 © 2011 – SOURIAU Just screw the wires to the connector ! No special tools required, use a standard screwdriver UTS screw termination UTS range UTS discrete wire sealing See page 9 Sealed: IP68/69K UV resistant UL/IEC compliant Corrosion-proof Plastic housing UTS Series Plug Corrosion-proof Plastic housing UTS Hi seal Sealed Unmated Sealed unmated: IP68/69K MIL-C-26482 compatible UV resistant UL/IEC compliant Screw termination contact Solder contact Crimp contact • machined • stamped and formed • coaxial • fibre optics UTS Series Overview © 2011 – SOURIAU 9 overview Metal hold down clips - to lock the connector easily on the PCB and to release stress on solder joints - suitable for soldering in a metalised hole Pre-assembled PCB contacts - machined or stamped versions available - different solder tails lengths possible - different plating options Low profi le housing to limit space between panel and PCB Stand-offs to allow cleaning after soldering UTS PCB contacts Receptacle No fi ller plug needed Grommet Containment ring Backnut or Easy handling backshell UTS discrete wire sealing Double Sealing UTS Series Overview Overview 10 © 2011 – SOURIAU General technical Mechanical • Durability: 250 matings & unmatings per MIL-C-26482 • Vibration resistance (all UTS versions except UTS Screw termination contacts): Sinusoidal vibrations per CEI 60512-4 - from 10 to 2000 Hz • Thermal shock: 5 cycles 30 min. from -40°C to 105°C per MIL-STD1344 method 1003 Environmental • Operating temperature: from -40°C to +105°C 40/100/21 per NFF 61-030 • Flammability rating: UL94-V0 (all UTS except the Hi seal) - see page 165 UL94-HB (UTS Hi seal only) - see page 165 I2F3 according to NFF 16101 and NFF 16102 • Salt spray: 500 hours • UV resistant: No mechanical degradation or important variation of colour after 5 years of exposure in natural environment (equivalence exposure to sun and moisture as per ISO4892) • Sealing: - UTS Standard: IP68/IP69K (mated) - UTS Hi seal: IP68/IP69K (mated and unmated) - UTS Discrete wire sealing: IP67/69K (up to IP68 with easy handling backshell) - UTS Screw termination contacts: IP68/IP69K Note: IPx8: 10m underwater during 1 week • Fluid resistance: - Gasoil - Mineral oil - Acid bath - Basic bath 1 2 3 4 5 1 3 UTS Series Overview © 2011 – SOURIAU 11 characteristics Material • Body connector + Backshell: Thermoplastic • Insert: - UTS Standard, UTS Discrete wire sealing, UTS Screw termination contacts: Thermoplastic - UTS Hi seal handsolder & UTS Hi seal with PC tails contacts: Elastomer • Contacts: See page 140 • Nut: Metal • Halogen free • RoHS compliant & conform to the Chinese standard SJ/T1166-2006 (Chinese RoHS equivalent) • In accordance with: - UL 1977: Certifi cat ECBT2 File number: E169916 - CSA C22.2 n°182.3: Certifi cat ECBT8 File number: E169916 Electrical • See each layout page 1 2 4 5 UTS Series Overview Overview UTS Series © 2011 – SOURIAU 13 UTS Series Mechanics Cable assembly ................................................................................................. 14 2 contacts 8E2/8D2: 7A 32V ............................................................................................. 20 12E2/12D2: 16A 150V ............................................................................................ 24 2 contacts + ground 103: 16A 300V ............................................................................................ 28 142G1: 40A 300V ............................................................................................ 32 3 contacts 8E3/8D3: 7A 32V ............................................................................................. 36 8E3A/8E98 8D3A/8D98: 7A 50V ............................................................................................. 40 8E33/8D3.: 7A 50V ............................................................................................. 44 12E3/12D3: 16A 150V ............................................................................................ 48 3 contacts + ground 124 - 12E4/12D4: 16A 300V ............................................................................................ 52 183G1: 32A 300V ............................................................................................ 56 4 contacts 8E4/8D4: 7A 32V ............................................................................................. 60 102W2: 25A 150V ............................................................................................ 64 104: 13A 150V ............................................................................................ 68 5 contacts 14E5/14D5: 16A 150V ............................................................................................ 72 6 contacts 103W3: 5A 32V ............................................................................................. 76 106 - 10E6/10D6: 7A 32V ............................................................................................. 80 10E98/10D98: 7A 50V ............................................................................................. 84 6 contacts + ground 147 - 14E7: 16A 300V ............................................................................................ 88 7 contacts 10E7/10D7: 7A 50V ............................................................................................. 92 8 contacts 128: 10A 80V ............................................................................................. 96 12E8/12D8: 6A 32V ............................................................................................. 100 10 contacts 1210 - 12E10/12D10: 6A 50V ............................................................................................. 104 12 contacts 1412: 10A 63V ............................................................................................. 108 14E12/14D12: 4A 50V ............................................................................................. 112 14 contacts 12E14/12D14: 5A 32V ............................................................................................. 116 15 contacts 14E15/14D15: 4A 50V ............................................................................................. 120 18 contacts 14E18/14D18: 5A 50V ............................................................................................. 124 19 contacts 1419 - 14E19/14D19: 5A 32V ............................................................................................. 128 23 contacts 1823: 9A 63V ............................................................................................. 132 32 contacts 1832: 4A 32V ............................................................................................. 136 14 © 2011 – SOURIAU OUTDOOR (black outer jacket) INDOOR Cable assembly Souriau provides connectors in various applications for more than 90 years in the most extreme environment. Being conscious about the diffi culty to fi nd a quick and a reliable harness manufacturer, we decided years ago to start in house cable assembly production. It allows customers to reduce the number of suppliers, and to take advantage of the "best in class" quality of the Souriau group. Overmoulding is a process that further enhances the sealing properties of the UTS range, especially over many years of use. Overmoulding provides the opportunity to change the cable exit from straight through 90 degrees and avoid any stress on the cable terminated to the connector. Also, as the wires are encapsulated inside the moulding, a barrier is created which prevents from any liquid from entering the equipment through the connector if the cable jacket is breached. UV resistance Ambient temperature PVC PUR PTFE FEP SILICON TPE 70°C Static installation Static installation Static installation Static installation Static installation Static or dynamic installation Wet Cleaner, Immerged chlorine 90°C 180°C 205°C 260°C Chemical agression How to choose the outer jacket material UTS Series Mechanics © 2011 – SOURIAU 15 Overmolding description Discrete connector Overmoulded connector Compound Thermoplastic insert O ring Overmolding adapter PVC or PUR overmolding ...water ingress unhampered, leading to damage. ...prevents water ingress via capillary action. If cable jacket is breached... If cable jacket is breached...   UTS Series Mechanics Mechanics 16 © 2011 – SOURIAU UTS Series Mechanics Harnesses Overmoulded harnesses, straight ending Connector type Number of ways Voltage Current UL Current IEC Harmonised cable part number* Part number (length: 1m.) Male Female UTS standard 2+PE 600 V 44 A 40 A HO5 VV - F 3Gg10 HAUTS0V142G1PST100 HAUTS0V142G1SST100 2+PE 500 V 10 A 16 A HO5 VV - F 3x1.5 HAUTS0V103PST100 HAUTS0V103SST100 3+PE 500 V 10 A 16 A HO5 VV - F 3G1.5 HAUTS0V103PEPST100 HAUTS0V103PESST100 3+PE 250 V 24 A 32 A HO5 VV - F 40G0.5 HAUTS0V183G1PST100 HAUTS0V183G1SST100 3+PE 500 V 10 A 16 A HO5 VV - F 4G1.5 HAUTS0V124PEPST100 HAUTS0V124PESST100 4 500 V 10 A 13 A HO5 VV - F 4x1.5 HAUTS0V104PST100 HAUTS0V104SST100 3 500 V 10 A 5 A HO5 VV - F 7G0.5 HAUTS0V103W3PST100 HAUTS0V103W3SST100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V106PST100 HAUTS0V106SST100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V147PEPST100 HAUTS0V147PESST100 8 500 V 10 A 10 A HO5 VV - F 8x1.5 HAUTS0V128PST100 HAUTS0V128SST100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V1210PST100 HAUTS0V1210SST100 12 500 V 10 A 10 A HO5 VV - F 12x1.5 HAUTS0V1412PST100 HAUTS0V1412SST100 19 250 V 5 A 5 A HO5 VV - F 21G0.5 HAUTS0V1419PST100 HAUTS0V1419SST100 23 500 V 10 A 9 A HO5 VV - F 25G1.5 HAUTS0V1823PST100 HAUTS0V1823SST100 32 250 V 5 A 4 A HO5 VV - F 40G0.5 HAUTS0V1832PST100 HAUTS0V1832SST100 UTS Hi seal 2 250 V 7 A 7 A H05 VV - F 2x0.5 HAUTS0V8E2PST100 HAUTS0V8E2SST100 2 650 V 13 A 16 A HO5 VV - F 2x1.5 HAUTS0V12E2PST100 HAUTS0V12E2SST100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3PST100 HAUTS0V8E3SST100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3APST100 HAUTS0V8E3ASST100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E33PST100 HAUTS0V8E33SST100 3 650 V 13 A 16 A HO5 VV - F 3x1.5 HAUTS0V12E3PST100 HAUTS0V12E3SST100 4 250 V 7 A 7 A HO5 VV - F 4x0.5 HAUTS0V8E4PST100 HAUTS0V8E4SST100 5 650 V 12 A 16 A HO5 VV - F 4G1.5 HAUTS0V14E5PST100 HAUTS0V14E5SST100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E6PST100 HAUTS0V10E6SST100 6 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E98PST100 HAUTS0V10E98SST100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V14E7PEPST100 HAUTS0V14E7PESST100 7 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E7PST100 HAUTS0V10E7SST100 8 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E8PST100 HAUTS0V12E8SST100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E10PST100 HAUTS0V12E10SST100 12 250 V 5 A 4 A HO5 VV - F 12G0.5 HAUTS0V14E12PST100 HAUTS0V14E12SST100 14 250 V 5 A 5 A HO5 VV - F 14G0.5 HAUTS0V12E14PST100 HAUTS0V12E14SST100 15 650 V 12 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E15PST100 HAUTS0V14E15SST100 18 250 V 4 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E18PST100 HAUTS0V14E18SST100 19 250 V 4 A 5 A HO5 VV - F 40G0.5 HAUTS0V14E19PST100 HAUTS0V14E19SST100 * see page 18 3 m & 5 m version available on demand Eg: 3m HAUTS0V...300 5m HAUTS0V...500 © 2011 – SOURIAU 17 UTS Series Mechanics Harnesses Overmoulded harnesses, right angle ending Connector type Number of ways Voltage Current UL Current IEC Harmonised cable part number* Part number (length: 1m.) Male Female UTS standard 2+PE 600 V 44 A 40 A HO5 VV - F 3Gg10 HAUTS0V142G1PRA100 HAUTS0V142G1SRA100 2+PE 500 V 10 A 16 A HO5 VV - F 3x1.5 HAUTS0V103PRA100 HAUTS0V103SRA100 3+PE 500 V 10 A 16 A HO5 VV - F 3G1.5 HAUTS0V183G1PRA100 HAUTS0V183G1SRA100 3+PE 250 V 24 A 32 A HO5 VV - F 40G0.5 HAUTS0V183G1PRA100 HAUTS0V183G1SRA100 3+PE 500 V 10 A 16 A HO5 VV - F 4G1.5 HAUTS0V124PEPRA100 HAUTS0V124PESRA100 4 500 V 10 A 13 A HO5 VV - F 4x1.5 HAUTS0V104PRA100 HAUTS0V104SRA100 3 500 V 10 A 5 A HO5 VV - F 7G0.5 HAUTS0V103W3PRA100 HAUTS0V103W3SRA100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V106PRA100 HAUTS0V106SRA100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V147PEPRA100 HAUTS0V147PESRA100 8 500 V 10 A 10 A HO5 VV - F 8x1.5 HAUTS0V128PRA100 HAUTS0V128SRA100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V1210PRA100 HAUTS0V1210SRA100 12 500 V 10 A 10 A HO5 VV - F 12x1.5 HAUTS0V1412PRA100 HAUTS0V1412SRA100 19 250 V 5 A 5 A HO5 VV - F 21G0.5 HAUTS0V1419PRA100 HAUTS0V1419SRA100 23 500 V 10 A 9 A HO5 VV - F 25G1.5 HAUTS0V1823PRA100 HAUTS0V1823SRA100 32 250 V 5 A 4 A HO5 VV - F 40G0.5 HAUTS0V1832PRA100 HAUTS0V1832SRA100 UTS Hi seal 2 250 V 7 A 7 A H05 VV - F 2x0.5 HAUTS0V8E2PRA100 HAUTS0V8E2SRA100 2 650 V 13 A 16 A HO5 VV - F 2x1.5 HAUTS0V12E2PRA100 HAUTS0V12E2SRA100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3PRA100 HAUTS0V8E3SRA100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E3APRA100 HAUTS0V8E3ASRA100 3 250 V 7 A 7 A HO5 VV - F 3x0.5 HAUTS0V8E33PRA100 HAUTS0V8E33SRA100 3 650 V 13 A 16 A HO5 VV - F 3x1.5 HAUTS0V12E3PRA100 HAUTS0V12E3SRA100 4 250 V 7 A 7 A HO5 VV - F 4x0.5 HAUTS0V8E4PRA100 HAUTS0V8E4SRA100 5 650 V 12 A 16 A HO5 VV - F 4G1.5 HAUTS0V14E5PRA100 HAUTS0V14E5SRA100 6 250 V 5 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E6PRA100 HAUTS0V10E6SRA100 6 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E98PRA100 HAUTS0V10E98SRA100 6+PE 500 V 10 A 16 A HO5 VV - F 7G1.5 HAUTS0V14E7PEPRA100 HAUTS0V14E7PESRA100 7 250 V 6 A 7 A HO5 VV - F 7x0.5 HAUTS0V10E7PRA100 HAUTS0V10E7SRA100 8 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E8PRA100 HAUTS0V12E8SRA100 10 250 V 5 A 6 A HO5 VV - F 10G0.5 HAUTS0V12E10PRA100 HAUTS0V12E10SRA100 12 250 V 5 A 4 A HO5 VV - F 12G0.5 HAUTS0V14E12PRA100 HAUTS0V14E12SRA100 14 250 V 5 A 5 A HO5 VV - F 14G0.5 HAUTS0V12E14PRA100 HAUTS0V12E14SRA100 15 650 V 12 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E15PRA100 HAUTS0V14E15SRA100 18 250 V 4 A 4 A HO5 VV - F 18G0.5 HAUTS0V14E18PRA100 HAUTS0V14E18SRA100 19 250 V 4 A 5 A HO5 VV - F 40G0.5 HAUTS0V14E19PRA100 HAUTS0V14E19SRA100 * see page 18 3 m & 5 m version available on demand Eg: 3m HAUTS0V...300 5m HAUTS0V...500 Mechanics 18 © 2011 – SOURIAU UTS Series Mechanics Standardization of European cable - DIN VDE 0281/DIN VDE 0282/DIN VDE 0292 1. Basic type 2. Working voltage 3. Insulating 4. Sheathcladding material 5. Special features 6. Conductor types 7. Number of conductors 8. Protective conductor 9. Conductor crosssectional H: Harmonized Type 03: 300/300 V. V: PVC V: PVC H: Ribbon cable, separable U: Single wire X: Without protective conductor Area specifi ed in mm2 A: National Type 05: 300/500 V. R: Rubber R: Rubber H2: Ribbon cable non-separable R: Multi-wire G: With protective conductor 07: 450/750 V. S: Silicone Rubber N: Cloroprene Rubber K: Fine wire (permanently installed) J: Glass-fi lament braiding F: Fine wire (fl exible) T: Textile braiding H: Super fi ne wire Y: Tinsel strand 1 2 3 4 5 6 7 8 9 Harmonized wire coding system Example: Harmonized type, 300/500V, PVC insulating, PVC sheath- cladding, Fine wire, 3x1.5 cross-sectional: H05VVF3x1.5 Cable information Range of temperature: Occasional fl exing: -5°C up to +70°C Fixed installation: -40°C up to +80°C Rated voltage: U0/U: 300/500 V Wire section : Arrangement with #16 contact: wire section 1.5 mm² Arrangement with #20 contact: wire section 0.5 mm² Harmonized reference: H05 VVF XX © 2011 – SOURIAU 19 UTS Series Mechanics Standardization of American cable Nomenclature Key Defi nitions of Cable Types S: Service Grade (also means extra hard service when not followed by J, V, or P) J: Hard Service V: Vacuum cleaner cord (also light duty cable) P: Parallel cord (also known as zip cord) – Always light duty E: Thermoplastic Elastomer (UL/NEC designation ONLY) O: Oil Resistant* T: Thermoplastic W: Outdoor-includes sunlight resistant jacket and wet location rated conductors (formerly "W-A") H: Heater cable VW-1: Flame retardant FT2: Flame retardant SVT: Thermoplastic insulated vacuum cleaner cord, with or without 3rd conductor for grounding purposes; 300V. (PVC) SJT: Junior hard service, thermoplastic insulated conductors and jacket. 300V. (PVC) SJTW: Same as SJT except outdoor rated. (PVC) SJTO: Same as SJT but oil resistant outer jacket. (PVC) SJTOW: Same as SJTO except outdoor rated. (PVC) ST: Hard service cord with all thermoplastic construction, 600V. (PVC) STW: Same as ST except outdoor rated. (PVC) STO: Same as ST but with oil resistant outer jacket. (PVC) STOW: Same as STO except outdoor rated. (PVC) Mechanics 20 © 2011 – SOURIAU OR OR WITH Layout Specifi cations UTS Series 8E2/8D2 Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E2P UTS08E2S Plug Without (Fig.6) UTS68E2P UTS68E2S Cable gland (Fig.7) UTS6JC8E2P UTS6JC8E2S Jam nut receptacle Without (Fig.3) UTS78E2P UTS78E2S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D2P UTS08D2S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D2P32 UTS78D2S32 Jam nut receptacle with stand off and withouthold down clip Without (Fig.4) UTS78D2P UTS78D2S Sealed unmated © 2011 – SOURIAU 21 Dimensions Note: all dimensions are in mm UTS Series 8E2/8D2 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 7.5 7.8 Fig. 1 Fig. 2 Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Plug - UTS6 25.3 54 Fig. 7 Fig. 6 Ø22.5 Mated connector length 61.1 66.6 UTS7 UTS0 Drilling pattern 1.5 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.5 Panel cut out 15.3 15.3 Ø3.3 Square fl ange receptacle - UTS0 Jam nut receptacle - UTS7 13.7 14.6 Front mounting Ø12.5 Rear mounting Ø14.5 Mechanics 2 contacts 7A/32V per IEC 61984 22 © 2011 – SOURIAU Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 32V 1.5kV 3 UTS 8E2/8D2 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR UTS Series 8E2/8D2 Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket Current use Limited use Not recommended use © 2011 – SOURIAU 23 UTS Series 8E2/8D2 Mechanics 24 © 2011 – SOURIAU OR WITH OR Layout UTS Series 12E2/12D2 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS012E2P UTS012E2S Plug Without (Fig.6) UTS612E2P UTS612E2S Cable gland (Fig.7) UTS6JC12E2P UTS6JC12E2S Jam nut receptacle Without (Fig.3) UTS712E2P UTS712E2S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS012D2P UTS012D2S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS712D2P32 UTS712D2S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS712D2P UTS712D2S Sealed unmated © 2011 – SOURIAU 25 UTS Series 12E2/12D2 Dimensions Note: all dimensions are in mm 2 contacts 16A/150V per IEC 61984 Square fl ange receptacle - UTS0 Front view 11.7 11.7 26.4 Ø19 Ø19 20.8 2.4 2.4 Ø3.2 7.5 7.5 7.8 Fig. 1 Fig. 2 Plug - UTS6 Mated connector length 25.3 66.7 75.3 81.7 Fig. 7 Fig. 6 Ø30.1 UTS7 UTS0 Panel cut out Drilling pattern 20.8 15.3 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 2.3 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.3 1.4 Square fl ange receptacle - UTS0 22° Front mounting Ø18.3 Rear mounting Ø22.3 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 18 18 Ø19 Ø19 Ø19 3.5 3.5 3.5 3 3 3 4.2 Fig. 3 Fig. 4 Fig. 5 Mechanics 26 © 2011 – SOURIAU Metal terminal UTS Series 12E2/12D2 Accessories Metal terminal 0 20 40 60 80 100 120 0 10 20 30 Current (A) Ambient Operating Temperature (°C) Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Electrical characteristics UL 13A 650V UL94 HB CSA 13A 650V UL94 HB IEC 16A 150V 2.5kV 3 UTS 12E2/12D2 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use © 2011 – SOURIAU 27 UTS Series 12E2/12D2 Mechanics 28 © 2011 – SOURIAU OR OR WITH Layout UTS Series 103 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 31 Free hanging receptacle Cable gland (Fig.1) UTS1JC103P UTS1JC103S Plug Without (Fig.2) UTS6103P UTS6103S Cable gland (Fig.3) UTS6JC103P UTS6JC103S PCB contacts supply separately see page 31 Jam nut receptacle Without (Fig.4) UTS7103P UTS7103S © 2011 – SOURIAU 29 UTS Series 103 Dimensions Note: all dimensions are in mm 2 + ground 16A/300V per IEC 61984 Free hanging - UTS1 70 Ø15.1 Fig. 1 Mated connector length - UTS7 77.3 Jam nut receptacle - UTS7 Fig. 4 18.3 12.3 27.2 22.5 Ø15.1 3.5 Panel cut out Drilling pattern Jam nut receptacle - UTS7 16.7 17.9 2.6 2.6 1.5 3 Plug - UTS6 Female Male Fig. 2 Fig. 3 33 63.2 25.3 Ø26.2 Ø26.2 Mechanics 30 © 2011 – SOURIAU UTS Series 103 Accessories and tooling Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J (1): example of plating, for other plating see UTS catalog page 143 Jam nut sealing caps Metal terminal Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Part number UTS610DCG Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG G for Green Y for Yellow R for Red Handle Tool kit Part number TOOLKIT Part number SHANDLES © 2011 – SOURIAU 31 Contacts UTS Series 103 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 16A 300V 4kV 3 Temperature elevation: 50°C Electrical characteristics UTS 103 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 2 + ground 16A/300V per IEC 61984 32 © 2011 – SOURIAU OR WITH OR UTS Series 142G1 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 35 Free hanging receptacle Cable gland (Fig.1) UTS1JC142G1P UTS1JC142G1S Plug Without (Fig.3) UTS6142G1P UTS6142G1S Cable gland (Fig.4) UTS6JC142G1P UTS6JC142G1S Jam nut receptacle Without (Fig.2) UTS7142G1P UTS7142G1S NPT threaded receptacle Without (Fig.5) UTS7142G1SNPT Layout © 2011 – SOURIAU 33 UTS Series 142G1 Dimensions Note: all dimensions are in mm Plug - UTS6 Female Male Fig. 3 Fig. 4 33 70 25.3 Ø31.5 Ø35.1 Free hanging - UTS1 70 Ø31.5 Fig. 1 Jam nut receptacle - UTS7 Fig. 2 18 1.6 35.1 30.4 Ø22.3 3.5 Panel cut out Jam nut receptacle - UTS7 24.5 25.9 Drilling pattern 3.6 3.6 2.1 4.2 NPT threaded receptacle - UTS7 Fig. 5 35.3 25.4 25.4 Ø22.3 23.1 Mechanics 2 + ground 40A/300V per IEC 61984 34 © 2011 – SOURIAU UTS Series 142G1 Accessories and tooling Jam nut sealing caps Metal terminal Part number UTS14DCG Part number UTS14DCGR Hand tool Part number M317 Positioner + locator setting Part number VGE10078A Extraction tool Part number 51060210936 Plug sealing cap Part number UTS614DCG Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red © 2011 – SOURIAU 35 UL 44A 600V UL94 V-0 CSA 30A 600V UL94 V-0 IEC 40A 300V 4kV 3 Electrical characteristics UTS 142G1 derating curves Current use Limited use Not recommended use UTS Series 142G1 Test conditions Contact used: Machined contacts Wires used: 8.37mm² 0 20 40 60 80 100 120 0 10 15 20 25 30 35 40 45 50 Current (A) Ambient Operating Temperature (°C) 5 Contacts #8 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 16 82913601A(1) 82913600A(1) - 6.5 14 82913603A(1) 82913602A(1) - 12 82913605A(1) 82913604A(1) - 10 82913607A(1) 82913606A(1) - 8 82913609A(1) 82913608A(1) - (1): Example of plating, for other plating see page 143 Mechanics 2 + ground 40A/300V per IEC 61984 36 © 2011 – SOURIAU OR WITH OR UTS Series 8E3/8D3 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E3P UTS08E3S Plug Without (Fig.6) UTS68E3P UTS68E3S Cable gland (Fig.7) UTS6JC8E3P UTS6JC8E3S Jam nut receptacle Without (Fig.3) UTS78E3P UTS78E3S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D3P UTS08D3S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D3P32 UTS78D3S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D3P UTS78D3S Layout Sealed unmated © 2011 – SOURIAU 37 UTS Series 8E3/8D3 Dimensions Note: all dimensions are in mm 3 contacts 7A/32V per IEC 61984 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Plug - UTS6 25.3 54 Fig. 7 Fig. 6 Ø22.5 Mated connector length 61.1 66.6 UTS7 UTS0 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.6 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.6 1.9 0.9 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Mechanics 38 © 2011 – SOURIAU UTS 8E3/8D3 derating curves UTS Series 8E3/8D3 Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 32V 1.5kV 3 Current use Limited use Not recommended use © 2011 – SOURIAU 39 UTS Series 8E3/8D3 Mechanics 40 © 2011 – SOURIAU OR WITH OR UTS Series 8E3A/8E98 - 8D3A/8D98 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E3AP UTS08E3AS UTS08E98P UTS08E98S Plug Without (Fig.6) UTS68E3AP UTS68E3AS UTS68E98P UTS68E98S Cable gland (Fig.7) UTS6JC8E3AP UTS6JC8E3AS UTS6JC8E98P UTS6JC8E98S Jam nut receptacle Without (Fig.3) UTS78E3AP UTS78E3AS UTS78E98P UTS78E98S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D3AP UTS08D3AS UTS08D98P UTS08D98S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D3AP32 UTS78D3AS32 UTS78D98P32 UTS78D98S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D3AP UTS78D3AS UTS78D98P UTS78D98S Layout Sealed unmated © 2011 – SOURIAU 41 UTS Series 8E3A/8E98 - 8D3A/8D98 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3 18 Ø12 3.5 3 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.6 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.6 1.9 0.9 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Plug - UTS6 Mated connector length 25.3 54 Fig. 7 Fig. 6 Ø22.5 66.6 UTS7 UTS0 61.1 Mechanics 3 contacts 7A/50V per IEC 61984 42 © 2011 – SOURIAU UTS Series 8E3A/8E98 - 8D3A/8D98 UTS 8E3A/98 - 8D3A/98 derating curves Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 Test conditions Contact used: Machined contacts Wires used: 0.518mm² © 2011 – SOURIAU 43 UTS Series 8E3A/8E98 - 8D3A/8D98 Mechanics 44 © 2011 – SOURIAU OR WITH OR UTS Series 8E33/8D33 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E33P UTS08E33S Plug Without (Fig.6) UTS68E33P UTS68E33S Cable gland (Fig.7) UTS6JC8E33P UTS6JC8E33S Jam nut receptacle Without (Fig.3) UTS78E33P UTS78E33S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D33P UTS08D33S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D33P32 UTS78D33S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D33P UTS78D33S Layout Sealed unmated © 2011 – SOURIAU 45 UTS Series 8E33/8D33 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Plug - UTS6 Mated connector length 25.3 54 61.1 66.6 Fig. 7 UTS7 Fig. 6 Ø22.5 UTS0 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.6 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.6 1.9 0.9 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Mechanics 3 contacts 7A/50V per IEC 61984 46 © 2011 – SOURIAU UTS Series 8E33/8D33 UTS 8E33/8D33 de-rating curves Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 6 10 18 Current (A) Ambient Operating Temperature (°C) 12 14 16 2 4 8 © 2011 – SOURIAU 47 UTS Series 8E33/8D33 Mechanics 48 © 2011 – SOURIAU UTS Series 12E3/12D3 OR WITH Specifi cations OR Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E3P UTS012E3S Plug Without (Fig.1) UTS612E3P UTS612E3S Cable gland (Fig.2) UTS6JC12E3P UTS6JC12E3S Jam nut receptacle Without (Fig.3) UTS712E3P UTS712E3S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D3P UTS012D3S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS712D3P32 UTS712D3S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS712D3P UTS712D3S Layout Sealed unmated © 2011 – SOURIAU 49 UTS Series 12E3/12D3 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19 3.5 3 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø19 3.5 3 18 Ø19 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 66.7 Ø30.1 Ø30.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19 2.4 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 2.3 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.3 2.8 1.4 Square fl ange receptacle - UTS0 22° Front mounting Ø18.3 Rear mounting Ø22.3 7 Mechanics 3 contacts 16A/150V per IEC 61984 50 © 2011 – SOURIAU UTS Series 12E3/12D3 Metal terminal Accessories Metal terminal Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Electrical characteristics UL 13A 650V UL94 HB CSA 13A 650V UL94 HB IEC 16A 150V 2.5kV 3 UTS 12E3/12D3 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 10 30 Current (A) Ambient Operating Temperature (°C) 20 © 2011 – SOURIAU 51 UTS Series 12E3/12D3 Mechanics 52 © 2011 – SOURIAU OR OR WITH OR UTS Series 124 - 12E4/12D4 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 55 Square fl ange receptacle Without (Fig.1) UTS0124P Jam nut receptacle Without (Fig.5) UTS7124P UTS7124S Free hanging receptacle Cable gland (Fig.13) UTS1JC124P UTS1JC124S Plug Without (Fig.11) UTS6124P UTS6124S Cable gland (Fig.12) UTS6JC124P UTS6JC124S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.3) UTS012E4P UTS012E4S Jam nut receptacle Without (Fig.10) UTS712E4P UTS712E4S Plug Without (Fig.11) UTS612E4P UTS612E4S Plug Cable gland (Fig.12) UTS6JC12E4P UTS6JC12E4S Screw contacts loaded Jam nut receptacle Without (Fig.7 & 8) UTS7124PSCR UTS7124SSCR Plug Without (Fig.11) UTS6124PSCR UTS6124SSCR Cable gland (Fig.12) UTS6JC124PSCR UTS6JC124SSCR Free hanging receptacle Cable gland (Fig.13) UTS1JC124PSCR PCB contacts supply separately see page 55 Square fl ange receptacle Without (Fig.4) UTS0124P Jam nut receptacle Without (Fig.6) UTS7124P UTS7124S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS012D4P UTS012D4S Jam nut receptacle with stand off and without hold down clip Without (Fig.9) UTS712D4P UTS712D4S Jam nut receptacle with stand off and with hold down clips Without (Fig.9) UTS712D4P32 UTS712D4S32 Layout Sealed unmated © 2011 – SOURIAU 53 UTS Series 124 - 12E4/12D4 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Hold down clip Male Female Fig. 6 Fig. 8 Fig. 10 Front view Fig. 5 Fig. 7 Fig. 9 31.9 18 18 18 27.2 Ø19 Ø19 Ø19 3.5 3.5 3.5 2.4 2.4 4.2 3 Square fl ange receptacle - UTS0 11.7 11.7 11.7 Ø19 Ø19 Ø19 20.8 26.4 2.4 2.4 4 2.4 7.5 9.1 7.5 Ø3.2 Fig. 3 Fig. 4 Front view Fig. 2 Fig. 1 7.5 7.8 Free hanging - UTS1 / Plug - UTS6 Mated connector length 25.3 74 66.7 Fig. 13 Fig. 11 Fig. 12 Ø30.1 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Front mounting Ø18.3 Ø3.3 Rear mounting Ø22.3 Jam nut receptacle - UTS7 21.4 22.7 3.1 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 3.1 3.1 3.1 Square fl ange receptacle - UTS0 22° Mechanics 3 + ground 16A/300V per IEC 61984 54 © 2011 – SOURIAU Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red UTS Series 124 - 12E4/12D4 Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Color coding rings Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 55 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 16A 300V 4kV 3 Temperature elevation: 50°C UTS Series 124 - 12E4/12D4 0 20 40 60 80 100 120 0 10 30 Current (A) Ambient Operating Temperature (°C) 20 18 15 13 28 25 23 8 5 3 Contacts Electrical characteristics UTS 124 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 3 + ground 16A/300V per IEC 61984 56 © 2011 – SOURIAU WITH Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 59 NPT threaded receptacle Without (Fig.1) UTS7183G1SNPT Plug Without (Fig.2) UTS6183G1P Plug Cable gland (Fig.3) UTS6JC183G1P Layout UTS Series 183G1 © 2011 – SOURIAU 57 Dimensions UTS Series 183G1 Note: all dimensions are in mm NPT threaded receptacle - UTS7 17.3 14.5 31.8 NPT - 3/4˝ Ø28.6 Ø19.6 Fig. 1 Plug - UTS6 Fig. 2 Fig. 3 37.5 81.3 Ø42 Ø42 Mated connector length - UTS6JC 90.5 Drilling pattern 5.1 5.1 5.1 5.1 Mechanics 3 + ground 32A/300V per IEC 61984 58 © 2011 – SOURIAU Accessories and tooling Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red UTS Series 183G1 Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Hand tool Part number M317 Positioner + locator setting Part number VGE10078A Extraction tool Part number 51060210936 Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Plug sealing cap Part number UTS614DCG © 2011 – SOURIAU 59 UL 23A 600V UL94 V-0 CSA 23A 600V UL94 V-0 IEC 32A 300V 4kV 3 Electrical characteristics UTS 183G1 derating curves Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 8.37mm² UTS Series 183G1 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 Current (A) Ambient Operating Temperature (°C) Contacts #8 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 16 82913601A(1) 82913600A(1) - 6.5 14 82913603A(1) 82913602A(1) - 12 82913605A(1) 82913604A(1) - 10 82913607A(1) 82913606A(1) - 8 82913609A(1) 82913608A(1) - (1): Example of plating, for other plating see page 143 Mechanics 3 + ground 32A/300V per IEC 61984 60 © 2011 – SOURIAU OR OR WITH UTS Series 8E4/8D4 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.1) UTS08E4P UTS08E4S Plug Without (Fig.6) UTS68E4P UTS68E4S Cable gland (Fig.7) UTS6JC8E4P UTS6JC8E4S Jam nut receptacle Without (Fig.3) UTS78E4P UTS78E4S PCB contacts loaded Square fl ange receptacle Without (Fig.2) UTS08D4P UTS08D4S Jam nut receptacle with stand off and with hold down clips Without (Fig.5) UTS78D4P32 UTS78D4S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS78D4P UTS78D4S Layout Sealed unmated © 2011 – SOURIAU 61 UTS Series 8E4/8D4 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 24.2 24.2 18 Ø12 3.5 3.4 Fig. 3 Fig. 4 Fig. 5 18 4.2 Ø12 3.5 3.4 18 Ø12 3.5 3.4 Square fl ange receptacle - UTS0 Front view 11.7 11.7 20.7 Ø12 Ø12 15.3 2.4 2.4 Ø3.2 7.5 Fig. 1 Fig. 2 7.5 7.8 Plug - UTS6 Mated connector length 25.3 54 Fig. 7 Fig. 6 Ø22.5 61.1 66.6 UTS7 UTS0 Panel cut out Drilling pattern 15.3 15.3 Ø3.3 Jam nut receptacle - UTS7 13.7 14.6 1.4 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 1.4 1.4 1.4 Square fl ange receptacle - UTS0 Front mounting Ø12.5 Rear mounting Ø14.5 Mechanics 4 contacts 7A/32V per IEC 61984 62 © 2011 – SOURIAU UTS Series 8E4/8D4 UTS 8E4/8D4 derating curves Jam nut sealing caps Square fl ange sealing cap Plug protective cap Accessories Electrical characteristics Metal terminal IP40 Part number UTS8DCGE Part number UTS68C Metal terminal Part number UTS8DCG Part number UTS8DCGR Part numbers Receptacle cap Plug cap 85005585A 85005594 Plastic protective cap Part numbers / neoprene UTFD11B Gasket UL 7A 250V UL94 HB CSA 7A 250V UL94 HB IEC 7A 32V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 16 18 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 63 UTS Series 8E4/8D4 Mechanics 64 © 2011 – SOURIAU WITH UTS Series 102W2 (2x#12 + 2x#20) Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 67 Free hanging receptacle Cable gland (Fig.1) UTS1JC102W2P UTS1JC102W2S Plug Without (Fig.2) UTS6102W2P UTS6102W2S Plug Cable gland (Fig.3) UTS6JC102W2P UTS6JC102W2S Jam nut receptacle Without (Fig.4) UTS7102W2P UTS7102W2S Layout © 2011 – SOURIAU 65 UTS Series 102W2 (2x#12 + 2x#20) Dimensions Note: all dimensions are in mm Free hanging - UTS1 70 Ø15.1 Fig. 1 Plug - UTS6 Fig. 2 Male Fig. 2 Female Fig. 3 33 63.2 Ø26.2 Ø26.2 Ø26.2 25.3 Panel cut out Drilling pattern Jam nut receptacle - UTS7 16.7 17.9 3 3 3 3 Jam nut receptacle - UTS7 Mated connector length - UTS7 Fig. 4 18.3 27.2 22.5 Ø15.1 3.5 2.4 77.3 Mechanics 4 contacts 25A/150V per IEC 61984 66 © 2011 – SOURIAU UTS Series 102W2 (2x#12 + 2x#20) Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Part number UTS610DCG Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Accessories and tooling Crimp tooling #20 Crimp tooling #12 Part number TOOLKIT Part number extraction tool 51060210924 (1): example of plating, for other plating see UTS catalog page 148 (2): contact reeled (3): loose contact Part number SHANDLES Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Part number positioner + locator setting VGE10078A Part number hand tool M317 © 2011 – SOURIAU 67 UTS Series 102W2 (2x#12 + 2x#20) Contacts #20 Contact type AWG Part number Max insulator Ø Male Female Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) 1.58 22-20 RM20W3K(1) RC20W3K(1) 1.58 20-18 RM18W3K(1) RC18W3K(1) 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) 0.89-1.58 26-24 SM24W3S26(2) SC24W3S25(2) 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) 1.17-2.08 22-20 SM20W3S26(2) SC20W3S25(2) 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 1) E l f l ti f th l ti #12 Crimp Machined 22 82911457NA 82911456A 4.9 20 82911459NA 82911458A 18 82911461NA 82911460A 16 82911463NA 82911462A 14 82911465NA 82911464A 12 82911467NA 82911466A UL 20A 500V UL94 V-0 CSA 18A 500V UL94 V-0 IEC 25A 150V 2.5kV 3 Temperature elevation: 50°C Electrical characteristics UTS 102W2 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 Current (A) Ambient Operating Temperature (°C) Mechanics 4 contacts 25A/150V per IEC 61984 68 © 2011 – SOURIAU OR OR OR WITH OR UTS Series 104 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contact supply separately see next page 71 Square fl ange receptacle Without (Fig.1) UTS0104P UTS0104S Free hanging receptacle Cable gland and grommet (Fig.2) UTS1GJC104P Free hanging receptacle Nut and grommet (Fig.3) UTS1GN104P Free hanging receptacle Cable gland (Fig.2) UTS1JC104P UTS1JC104S Plug Without (Fig.4) UTS6104P UTS6104S Plug Cable gland and grommet (Fig.5) UTS6GJC104S Plug Nut and grommet (Fig.6) UTS6GN104S Plug Cable gland (Fig.5) UTS6JC104P UTS6JC104S Jam nut receptacle Without (Fig.7) UTS7104P UTS7104S Jam nut receptacle Cable gland and grommet (Fig.9) UTS7GJC104P Jam nut receptacle Nut and grommet (Fig.8) UTS7GN104P Layout © 2011 – SOURIAU 69 UTS Series 104 Dimensions Note: all dimensions are in mm Square fl ange receptacle - UTS0 Free hanging - UTS1 11.5 70 40.9 Ø15.1 Ø15.1 20.8 24 2.4 10.5 Ø3.2 Fig. 1 Front view Fig. 3 Fig. 2 Plug - UTS6 Female Male Fig. 4 Fig. 5 Fig. 6 33 63.2 32.5 25.3 Ø26.2 Ø26.2 Ø26.2 Panel cut out Drilling pattern 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 3 3 3 3 Front mounting Ø15.2 Rear mounting Ø17.9 Square fl ange receptacle - UTS0 Jam nut receptacle - UTS7 Mated connector length Fig. 7 Fig. 9 Fig. 8 18.3 18.3 41 70.7 Ø15.1 Ø15.1 3.5 3.5 2.4 70.9 77.3 UTS7 UTS0 Mechanics 4 contacts 13A/150V per IEC 61984 70 © 2011 – SOURIAU UTS Series 104 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Square fl ange sealing cap Part number UTS610DCG Part number UTS10DCGE Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 71 UTS Series 104 Contacts UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 13A 150V 2.5kV 3 Electrical characteristics UTS 104 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 4 contacts 13A/150V per IEC 61984 72 © 2011 – SOURIAU OR WITH OR UTS Series 14E5/14D5 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E5P UTS014E5S Plug Without (Fig.1) UTS614E5P UTS614E5S Cable gland (Fig.2) UTS6JC14E5P UTS6JC14E5S Jam nut receptacle Without (Fig.3) UTS714E5P UTS714E5S PCB contacts loaded Square fl ange receptacle Without (Fig.6) UTS014D5P UTS014D5S Jam nut receptacle with hold down clips Without (Fig.4) UTS714D5P32 UTS714D5S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D5P UTS714D5S Layout Sealed unmated © 2011 – SOURIAU 73 UTS Series 14E5/14D5 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Mated connector length 75 82 Square fl ange receptacle - UTS0 Fig. 6 11.3 Ø22.3 2.3 7.5 7.8 23.2 28.8 Ø3.2 Front view UTS7 UTS0 Panel cut out Drilling pattern 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 4 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.3 3.7 0.6 2.5 22° Front mounting Ø21.5 Rear mounting Ø25.1 Square fl ange receptacle - UTS0 Mechanics 5 contacts 16A/150V per IEC 61984 74 © 2011 – SOURIAU UTS Series 14E5/14D5 UTS 14E5/14D5 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 12A 650V UL94 HB CSA 12A 650V UL94 HB IEC 16A 150V 2.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 1.31mm² 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 16 18 Current (A) Ambient Operating Temperature (°C) Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red © 2011 – SOURIAU 75 UTS Series 14E5/14D5 Mechanics 76 © 2011 – SOURIAU UTS Series 103W3 (3x#16 + 3x#20) Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 79 Free hanging receptacle Cable gland (Fig.1) UTS1JC103W3P UTS1JC103W3S Plug Without (Fig.2) UTS6103W3P UTS6103W3S Plug Cable gland (Fig.3) UTS6JC103W3P UTS6JC103W3S Jam nut receptacle Without (Fig.4) UTS7103W3P UTS7103W3S PCB contacts supply separately see page 79 Jam nut receptacle with stand off and without hold down clip Without (Fig.4) UTS7103W3P UTS7103W3S OR WITH OR Layout © 2011 – SOURIAU 77 UTS Series 103W3 (3x#16 + 3x#20) Dimensions Note: all dimensions are in mm Plug - UTS6 Fig. 2 Male Fig. 2 Female Fig. 3 33 63.2 Ø26.2 Ø26.2 Ø26.2 25.3 Jam nut receptacle - UTS7 Mated connector length - UTS7 Fig. 4 18.3 27.2 22.5 Ø15.1 3.5 2.4 77.3 Panel cut out Drilling pattern 3 2.5 2.5 0.7 0.8 Jam nut receptacle - UTS7 16.7 17.9 Free hanging - UTS1 70 Ø15.1 Fig. 1 Mechanics 6 contacts 5A/32V per IEC 61984 78 © 2011 – SOURIAU UTS Series 103W3 (3x#16 + 3x#20) Accessories and tooling Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Square fl ange sealing cap Part number UTS610DCG Part number UTS10DCGE Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RCM RM/RC 20W3K(1) S20RCM RM/RC 18W3K(1) S20RCM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contac © 2011 – SOURIAU 79 UTS Series 103W3 (3x#16 + 3x#20) UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 5A 32V 1.5kV 3 Temperature elevation: 50°C Electrical characteristics UTS 103W3 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) Contacts 120 (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - plating L SM20ML1 #20 Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 Stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3S26(2) SC24W3S25(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3S26(2) SC20W3S25(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - Mechanics 6 contacts 5A/32V per IEC 61984 80 © 2011 – SOURIAU UTS Series 106 - 10E6/10D6 Specifi cations OR OR WITH OR Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 83 Free hanging receptacle Cable gland (Fig.1) UTS1JC106P UTS1JC106S Plug Without (Fig.2) UTS6106P UTS6106S Plug Cable gland (Fig.3) UTS6JC106P UTS6JC106S Jam nut receptacle Without (Fig.4) UTS7106P UTS7106S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.9) UTS010E6P UTS010E6S Plug Without (Fig.2) UTS610E6P UTS610E6S Cable gland (Fig.3) UTS6JC10E6P UTS6JC10E6S Jam nut receptacle Without (Fig.5) UTS710E6P UTS710E6S PCB contacts supply separately see page 83 Jam nut receptacle Without (Fig.4) UTS7106P UTS7106S PCB contacts loaded Square fl ange receptacle Without (Fig.8) UTS010D6P UTS010D6S Jam nut receptacle with stand off and with hold down clips Without (Fig.6) UTS710D6P32 UTS710D6S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.7) UTS710D6P UTS710D6S Layout Sealed unmated © 2011 – SOURIAU 81 UTS Series 106 - 10E6/10D6 Dimensions Note: all dimensions are in mm 6 contacts 7A/32V per IEC 61984 Free hanging - UTS1 70 Ø15.1 Fig. 1 Plug - UTS6 Female Male Fig. 2 Fig. 3 33 63.2 Ø26.2 Ø26.2 25.3 Jam nut receptacle - UTS7 Front view 22.5 27.2 18.3 Ø15.1 3.5 3 12.3 Fig. 5 Fig. 6 Fig. 7 Fig. 4 4.2 18.3 Ø15.1 3.5 3 18.3 Ø15.1 3.5 3 Panel cut out Drilling pattern 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 2.8 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 3.3 1.6 Square fl ange receptacle - UTS0 Front mounting Ø15.2 Rear mounting Ø17.9 Square fl ange receptacle - UTS0 Fig. 9 Fig. 8 11.7 Ø15.1 2.3 16.2 20.8 24 Ø3.2 Front view Mated connector length 70.9 77.3 UTS7 UTS0 7.5 Mechanics 82 © 2011 – SOURIAU UTS Series 106 - 10E6/10D6 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS10DCG Part number UTS10DCGR Plug sealing cap Square fl ange sealing cap Part number UTS610DCG Part number UTS10DCGE Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket Color coding rings Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 83 UTS Series 106 - 10E6/10D6 Contacts #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 IEC 7A 32V 1.5kV 3 Electrical characteristics UTS 106 - 10E6/10D6 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) UTS 106 UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 UTS 10E6/10D6 UL 6A 250V UL94 HB CSA 6A 250V UL94 HB Mechanics 6 contacts 7A/32V per IEC 61984 84 © 2011 – SOURIAU OR WITH OR Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS010E98P UTS010E98S Plug Without (Fig.1) UTS610E98P UTS610E98S Cable gland (Fig.2) UTS6JC10E98P UTS6JC10E98S Jam nut receptacle Without (Fig.3) UTS710E98P UTS710E98S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS010D98P UTS010D98S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS710D98P32 UTS710D98S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS710D98P UTS710D98S Layout UTS Series 10E98/10D98 Sealed unmated © 2011 – SOURIAU 85 Dimensions Note: all dimensions are in mm UTS Series 10E98/10D98 Plug - UTS6 Fig. 1 Fig. 2 70 Ø26.2 Ø26.2 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 18.3 Ø15.1 2.3 16.2 20.8 24 Ø3.2 Front view 70.9 77.3 UTS7 UTS0 Drilling pattern 3.3 1.6 Ø13.5 Ø22 Ø17.7 Ø4 2.8 3.3 Panel cut out 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 Square fl ange receptacle - UTS0 Front mounting Ø15.2 Rear mounting Ø17.9 Jam nut receptacle - UTS7 Front view 22.4 27.2 18.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18.3 Ø15.1 3.5 3 18.3 Ø15.1 3.5 3 Ø15.1 7.5 30° Ø3.1 68° 22° Mechanics 6 contacts 7A/50V per IEC 61984 86 © 2011 – SOURIAU UTS Series 10E98/10D98 UTS 10E98/10D98 derating curves Jam nut sealing caps Plug protective cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS610DCG Part number UTS10DCGE Metal terminal Part number UTS10DCG Part number UTS10DCGR Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket UL 6A 250V UL94 HB CSA 6A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 87 UTS Series 10E98/10D98 Mechanics 88 © 2011 – SOURIAU OR OR WITH OR OR OR UTS Series 147 - 14E7/14D7 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 91 Square fl ange receptacle Without (Fig.2) UTS0147P Free hanging receptacle Cable gland and grommet (Fig.3) UTS1GJC147P Free hanging receptacle Nut and grommet (Fig.4) UTS1GN147P Free hanging receptacle Cable gland (Fig.3) UTS1JC147P UTS1JC147S Plug Without (Fig.5) UTS6147P UTS6147S Plug Cable gland and grommet (Fig.6) UTS6GJC147S Plug Nut and grommet (Fig.7) UTS6GN147S Plug Cable gland (Fig.6) UTS6JC147P UTS6JC147S Jam nut receptacle Without (Fig.8) UTS7147P UTS7147S Jam nut receptacle Cable gland and grommet (Fig.10) UTS7GJC147P Jam nut receptacle Nut and grommet (Fig.9) UTS7GN147P Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.2) UTS014E7P UTS014E7S Plug Cable gland (Fig.6) UTS6JC14E7P UTS6JC14E7S Jam nut receptacle Without (Fig.11) UTS714E7P UTS714E7S PCB contacts loaded Square fl ange receptacle Without (Fig.1) UTS014D7P UTS014D7S Jam nut receptacle with stand off and hold down clips Without (Fig.11) UTS714D7P32 UTS714D7S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.11) UTS714D7P UTS714D7S Jam nut receptacle With stand off and hold down clip (Fig.11) UTS7147PSEK9 Screw contacts loaded Jam nut receptacle Without (Fig.8) UTS7147PSCR UTS7147SSCR Free hanging receptacle Cable gland (Fig.3) UTS1JC147PSCR Plug Cable gland (Fig.6) UTS6JC147PSCR UTS6JC147SSCR Layout Sealed unmated © 2011 – SOURIAU 89 UTS Series 147 - 14E7/14D7 Dimensions Note: all dimensions are in mm Plug - UTS6 Female Male Fig. 5 Fig. 6 Fig. 7 33 70 32 23.5 Ø35.1 Ø35.1 Ø35.1 Jam nut receptacle - UTS7 Fig. 11 Fig. 10 Fig. 8 Fig. 9 18 18 49 70.7 Ø31.8 Ø22.3 3.5 3.5 1.6 4.2 3 Mated connector length 75 82 UTS7 UTS0 Drilling pattern 6.4 3.2 Ø13.5 Ø22 Ø17.7 Ø4 Ø3.1 5.2 Panel cut out 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Square fl ange receptacle - UTS0 Free hanging - UTS1 11.3 Ø22.3 23.2 28.8 2.3 29.1 22 Ø3.2 Fig. 2 Front view Fig. 1 78.5 43 Ø22.3 Fig. 4 Fig. 3 Mechanics 6 + ground 16A/300V per IEC 61984 90 © 2011 – SOURIAU UTS Series 147 - 14E7/14D7 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Plug sealing cap Square fl ange sealing cap Part number UTS614DCG Part number UTS14DCGE Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 91 Contacts #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 UTS Series 147 - 14E7/14D7 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 16A 300V 4kV 3 Temperature elevation: 50°C Electrical characteristics UTS 147 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 120 0 5 3 8 10 20 18 15 13 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 6 + ground 16A/300V per IEC 61984 Mechanics 92 © 2011 – SOURIAU OR WITH OR UTS Series 10E7/10D7 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS010E7P UTS010E7S Plug Without (Fig.1) UTS610E7P UTS610E7S Cable gland (Fig.2) UTS6JC10E7P UTS6JC10E7S Jam nut receptacle Without (Fig.3) UTS710E7P UTS710E7S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS010D7P UTS010D7S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS710D7P32 UTS710D7S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS710D7P UTS710D7S Layout Sealed unmated © 2011 – SOURIAU 93 UTS Series 10E7/10D7 Dimensions Note: all dimensions are in mm Plug - UTS6 Fig. 1 Fig. 2 70 Ø26.2 Ø26.2 25.3 Jam nut receptacle - UTS7 Front view 22.4 27.2 18.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18.3 Ø15.1 3.5 3 18.3 Ø15.1 3.5 3 Ø15.1 Square fl ange receptacle - UTS0 Fig. 6 Fig. 7 11.7 Ø15.1 2.3 16.2 7.5 20.8 24 Ø3.2 Front view Mated connector length 70.9 77.3 UTS7 UTS0 Drilling pattern 2.8 Ø13.5 Ø22 Ø17.7 15° 15° Ø4 Ø3.1 3.3 1.6 Panel cut out 18.5 18.5 Ø3.3 Jam nut receptacle - UTS7 16.7 17.9 Square fl ange receptacle - UTS0 Front mounting Ø15.2 Rear mounting Ø17.9 Mechanics 7 contacts 7A/50V per IEC 61984 94 © 2011 – SOURIAU UTS Series 10E7/10D7 UTS 10E7/10D7 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS610DCG Part number UTS10DCGE Metal terminal Part number UTS10DCG Part number UTS10DCGR Part numbers Receptacle cap Plug cap 85005586A 85005595 Plastic protective cap Part numbers / neoprene UTFD12B Gasket UL 6A 250V UL94 HB CSA 6A 250V UL94 HB IEC 7A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS710CCRR UTS610CCRR UTS710CCRY UTS610CCRY UTS710CCRG UTS610CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 6 10 Current (A) Ambient Operating Temperature (°C) 12 14 2 4 8 © 2011 – SOURIAU 95 UTS Series 10E7/10D7 Mechanics 96 © 2011 – SOURIAU OR OR OR OR WITH OR UTS Series 128 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 99 Square fl ange receptacle Without (Fig.1) UTS0128P UTS0128S Free hanging receptacle Cable gland and grommet (Fig.2) UTS1GJC128P Free hanging receptacle Nut and grommet (Fig.3) UTS1GN128P Free hanging receptacle Cable gland (Fig.2) UTS1JC128P UTS1JC128S Plug Without (Fig.4) UTS6128P UTS6128S Plug Cable gland and grommet (Fig.5) UTS6GJC128S Plug Nut and grommet (Fig.6) UTS6GN128S Plug Cable gland (Fig.5) UTS6JC128P UTS6JC128S Jam nut receptacle Without (Fig.8) UTS7128P UTS7128S Jam nut receptacle Cable gland and grommet (Fig.10) UTS7GJC128P Jam nut receptacle Nut and grommet (Fig.9) UTS7GN128P PCB contacts loaded Jam nut receptacle With stand off and hold down clip (Fig.11) UTS7128PSEK9 Layout © 2011 – SOURIAU 97 UTS Series 128 Dimensions Note: all dimensions are in mm Square fl ange receptacle - UTS0 Free hanging - UTS1 11.7 Ø19.1 20.8 26.4 2.3 10.5 18.1 Ø3.2 Fig. 1 Front view 74.5 40.9 Ø19.1 Fig. 3 Fig. 2 Plug - UTS6 Female Male Fig. 4 Fig. 5 Fig. 6 33 65.7 33 25.3 Ø30.1 Ø30.1 Ø30.1 Drilling pattern 4.4 3.4 2 4.5 4 2.8 0.9 Panel cut out 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 Square fl ange receptacle - UTS0 Front mounting Ø18.3 Rear mounting Ø22.3 Mated connector length 75.3 81.7 UTS7 UTS0 Jam nut receptacle - UTS7 Fig. 11 Fig. 10 Fig. 8 Fig. 9 18 18 49.1 74.5 Ø19.1 Ø19.1 3.5 3.5 1.6 4.2 3 Mechanics 8 contacts 10A/80V per IEC 61984 98 © 2011 – SOURIAU UTS Series 128 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Color coding rings Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 99 UTS Series 128 Contacts UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 10A 80V 1.5kV 3 Electrical characteristics UTS 128 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 8 contacts 10A/80V per IEC 61984 100 © 2011 – SOURIAU OR WITH OR UTS Series 12E8/12D8 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E8P UTS012E8S Plug Without (Fig.1) UTS612E8P UTS612E8S Cable gland (Fig.2) UTS6JC12E8P UTS6JC12E8S Jam nut receptacle Without (Fig.3) UTS712E8P UTS712E8S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D8P UTS012D8S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS712D8P32 UTS712D8S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS712D8P UTS712D8S Layout Sealed unmated © 2011 – SOURIAU 101 UTS Series 12E8/12D8 Dimensions Note: all dimensions are in mm Plug - UTS6 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø19 3.5 3 18 Ø19 3.5 3.1 Fig. 1 Fig. 2 66.7 Ø30.1 Ø30.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19 2.4 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 Square fl ange receptacle - UTS0 Front mounting Ø18.3 Rear mounting Ø22.3 4.3 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 3 1.6 3 4.3 1.1 3.9 22° Mechanics 8 contacts 6A/32V per IEC 61984 102 © 2011 – SOURIAU UTS Series 12E8/12D8 UTS 12E8/12D8 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS612DCG Part number UTS12DCGE Metal terminal Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB IEC 6A 32V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 103 UTS Series 12E8/12D8 Mechanics 104 © 2011 – SOURIAU OR OR WITH OR UTS Series 1210 - 12E10/12D10 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page107 Free hanging receptacle Cable gland (Fig.1) UTS1JC1210P UTS1JC1210S Plug Without (Fig.2) UTS61210P UTS61210S Plug Cable gland (Fig.3) UTS6JC1210P UTS6JC1210S Jam nut receptacle Without (Fig.4) UTS71210P UTS71210S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E10P UTS012E10S Plug Without (Fig.2) UTS612E10P UTS612E10S Cable gland (Fig.3) UTS6JC12E10P UTS6JC12E10S Jam nut receptacle Without (Fig.5) UTS712E10P UTS712E10S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D10P UTS012D10S Jam nut receptacle with stand off and with hold down clips Without (Fig.6) UTS712D10P32 UTS712D10S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.7) UTS712D10P UTS712D10S Layout Sealed unmated © 2011 – SOURIAU 105 UTS Series 1210 - 12E10/12D10 Dimensions Note: all dimensions are in mm Free hanging - UTS1 Plug - UTS6 74 Ø19.1 Fig. 1 Female Male Fig. 2 Fig. 3 33 66.7 Ø30.1 Ø30.1 25.3 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19.1 3.5 3 12.3 Fig. 5 Fig. 6 Fig. 7 Fig. 4 4.2 18 Ø19.1 3.5 3 18 Ø19.1 3.5 3.1 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19.1 2.3 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 3.3 1.6 Ø22 Ø30.5 Ø26.2 22° 30° 68° 10 Ø3.1 4.9 3 Square fl ange receptacle - UTS0 Front mounting Ø18.3 Rear mounting Ø22.3 Mechanics 10 contacts 6A/50V per IEC 61984 106 © 2011 – SOURIAU UTS Series 1210 - 12E10/12D10 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS12DCG Part number UTS12DCGR Plug sealing cap Square fl ange sealing cap Part number UTS612DCG Part number UTS12DCGE Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket Color coding rings Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 107 UTS Series 1210 - 12E10/12D10 Contacts IEC 6A 50V 1.5kV 3 Electrical characteristics UTS 1210 - 12E10/12D10 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use UTS 1210 UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 UTS 12E10/12D10 UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB 0 20 40 60 80 100 0 2 4 6 8 10 12 Current (A) Ambient Operating Temperature (°C) 120 #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 10 contacts 6A/50V per IEC 61984 108 © 2011 – SOURIAU OR OR OR OR WITH OR Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 111 Square fl ange receptacle Without (Fig.1) UTS01412P UTS01412S Free hanging receptacle Cable gland and grommet (Fig.2) UTS1GJC1412P Free hanging receptacle Nut and grommet (Fig.3) UTS1GN1412P Free hanging receptacle Cable gland (Fig.2) UTS1JC1412P UTS1JC1412S Plug Without (Fig.4) UTS61412P UTS61412S Plug Cable gland and grommet (Fig.5) UTS6GJC1412S Plug Nut and grommet (Fig.6) UTS6GN1412S Plug Cable gland (Fig.5) UTS6JC1412P UTS6JC1412S Jam nut receptacle Without (Fig.7) UTS71412P UTS71412S Jam nut receptacle Cable gland and grommet (Fig.9) UTS7GJC1412P Jam nut receptacle Nut and grommet (Fig.8) UTS7GN1412P PCB contacts supply separately see page 111 Square fl ange receptacle Without (Fig.1) UTS01412P UTS01412S Jam nut receptacle Without (Fig.7) UTS71412P UTS71412S Layout UTS Series 1412 © 2011 – SOURIAU 109 Dimensions Note: all dimensions are in mm UTS Series 1412 Plug - UTS6 Female Male Fig. 4 Fig. 5 Fig. 6 33 70 32 25.3 Ø31.5 Ø31.5 Ø31.5 Jam nut receptacle - UTS7 Mated connector length Fig. 7 Fig. 9 Fig. 8 18 18 49 70.7 Ø22.3 Ø22.3 3.5 3.5 1.6 75 82 UTS7 UTS0 Panel cut out Drilling pattern 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 2.2 0.7 3.8 5.8 5.1 2 1.4 1 2.2 4.5 5.9 1 0.3 2.9 5.5 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Square fl ange receptacle - UTS0 Free hanging - UTS1 78.5 43 Ø22.3 Fig. 3 11.3 Fig. 2 Ø22.3 23.2 28.8 2.3 10.5 21.9 Ø3.2 Fig. 1 Front view Female Male Mechanics 12 contacts 10A/63V per IEC 61984 110 © 2011 – SOURIAU UTS Series 1412 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Plug sealing cap Square fl ange sealing cap Part number UTS614DCG Part number UTS14DCGE Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 111 UTS Series 1412 Contacts UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 10A 63V 1.5kV 3 Electrical characteristics UTS 1412 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 12 contacts 10A/63V per IEC 61984 112 © 2011 – SOURIAU OR OR WITH OR UTS Series 14E12/14D12 (4x#16 + 8x#20) Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E12P UTS014E12S Plug Without (Fig.1) UTS614E12P UTS614E12S Cable gland (Fig.2) UTS6JC14E12P UTS6JC14E12S Jam nut receptacle Without (Fig.3) UTS714E12P UTS714E12S PCB contacts loaded Square fl ange receptacle Without (Fig.6) UTS014D12P UTS014D12S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS714D12P32 UTS714D12S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D12P UTS714D12S Layout Sealed unmated © 2011 – SOURIAU 113 UTS Series 14E12/14D12 (4x#16 + 8x#20) Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Square fl ange receptacle - UTS0 Mated connector length 11.3 Ø22.3 2.3 7.5 7.8 23.2 28.8 Ø3.2 Fig. 6 Front view 75 82 UTS7 UTS0 23.2 Panel cut out 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Drilling pattern 4.5 4.1 Ø22 Ø30.5 Ø26.2 Ø30.5 30° 68° 10 Ø3.1 1.6 4.5 2.3 6.7 22° 1 Mechanics 12 contacts 4A/50V per IEC 61984 114 © 2011 – SOURIAU UTS Series 14E12/14D12 (4x#16 + 8x#20) UTS 14E12/14D12 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB IEC 4A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 12 14 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 115 UTS Series 14E12/14D12 (4x#16 + 8x#20) Mechanics 116 © 2011 – SOURIAU OR WITH OR UTS Series 12E14/12D14 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS012E14P UTS012E14S Plug Without (Fig.1) UTS612E14P UTS612E14S Cable gland (Fig.2) UTS6JC12E14P UTS6JC12E14S Jam nut receptacle Without (Fig.3) UTS712E14P UTS712E14S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS012D14P UTS012D14S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS712D14P32 UTS712D14S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS712D14P UTS712D14S Layout Sealed unmated © 2011 – SOURIAU 117 UTS Series 12E14/12D14 Dimensions Note: all dimensions are in mm 14 contacts 5A/32V per IEC 61984 Jam nut receptacle - UTS7 Front view 27.2 31.9 18 Ø19 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø19 3.5 3 18 Ø19 3.5 3.1 Plug - UTS6 Fig. 1 Fig. 2 66.7 Ø30.1 Ø30.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.7 Ø19 2.4 7.5 7.8 20.8 26.4 Ø3.2 Front view 75.3 81.7 UTS7 UTS0 Panel cut out Drilling pattern 20.8 20.8 Ø3.3 Jam nut receptacle - UTS7 21.4 22.7 4.4 Ø22 Ø30.5 Ø26.2 30° 68° 10 Ø3.1 2.7 2 4.7 3.8 1.8 1.4 Square fl ange receptacle - UTS0 22° Front mounting Ø18.3 Rear mounting Ø22.3 Mechanics 118 © 2011 – SOURIAU UTS Series 12E14/12D14 UTS 12E14/12D14 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS612DCG Part number UTS12DCGE Metal terminal Part number UTS12DCG Part number UTS12DCGR Part numbers Receptacle cap Plug cap 85005587A 85005596 Plastic protective cap Part numbers / neoprene UTFD13B Gasket UL 4.5A 250V UL94 HB CSA 4.5A 250V UL94 HB IEC 5A 32V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS712CCRR UTS612CCRR UTS712CCRY UTS612CCRY UTS712CCRG UTS612CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 0 4 2 6 8 10 Current (A) Ambient Operating Temperature (°C) © 2011 – SOURIAU 119 UTS Series 12E14/12D14 Mechanics 120 © 2011 – SOURIAU OR WITH OR UTS Series 14E15/14D15 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E15P UTS014E15S Plug Without (Fig.1) UTS614E15P UTS614E15S Cable gland (Fig.2) UTS6JC14E15P UTS6JC14E15S Jam nut receptacle Without (Fig.3) UTS714E15P UTS714E15S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS014D15P UTS014D15S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS714D15P32 UTS714D15S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D15P UTS714D15S Layout Sealed unmated © 2011 – SOURIAU 121 UTS Series 14E15/14D15 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.3 Ø22.3 2.3 7.5 23.2 28.8 Ø3.2 Front view 7.8 75 82 UTS7 UTS0 Panel cut out Drilling pattern 23.2 23.2 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 30° 68° 22° 3.2 5.5 2.5 2.7 6.1 5.1 5.3 6.2 2.8 0.3 5.7 1.9 1 3.5 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Mechanics 15 contacts 4A/50V per IEC 61984 122 © 2011 – SOURIAU UTS Series 14E15/14D15 UTS 14E15/14D15 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 12A 650V UL94 HB CSA 12A 650V UL94 HB IEC 4A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 1.31mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 Current (A) Ambient Operating Temperature (°C) 0 5 3 8 10 20 18 15 13 23 25 28 30 © 2011 – SOURIAU 123 UTS Series 14E15/14D15 Mechanics 124 © 2011 – SOURIAU OR WITH OR UTS Series 14E18/14D18 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.6) UTS014E18P UTS014E18S Plug Without (Fig.1) UTS614E18P UTS614E18S Cable gland (Fig.2) UTS6JC14E18P UTS6JC14E18S Jam nut receptacle Without (Fig.3) UTS714E18P UTS714E18S PCB contacts loaded Square fl ange receptacle Without (Fig.7) UTS014D18P UTS014D18S Jam nut receptacle with stand off and with hold down clips Without (Fig.4) UTS714D18P32 UTS714D18S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.5) UTS714D18P UTS714D18S Layout Sealed unmated © 2011 – SOURIAU 125 UTS Series 14E18/14D18 Dimensions Note: all dimensions are in mm Jam nut receptacle - UTS7 Front view 30.4 35.1 18 Ø22.3 3.5 3 Fig. 3 Fig. 4 Fig. 5 4.2 18 Ø22.3 3.5 3 18 Ø22.3 3.5 3 Plug - UTS6 Fig. 1 Fig. 2 70 Ø35.1 Ø35.1 25.3 Square fl ange receptacle - UTS0 Mated connector length Fig. 6 Fig. 7 11.3 Ø22.3 2.3 7.5 23.2 28.8 Ø3.2 Front view 7.8 75 82 UTS7 UTS0 Panel cut out Drilling pattern Jam nut receptacle - UTS7 24.5 25.9 23.2 23.2 Ø3.3 1.6 3.3 6.1 Ø22 Ø26.2 Ø30.5 22° 30° 68° 10 Ø3.1 4.9 2.8 5.7 6.4 Square fl ange receptacle - UTS0 Front mounting Ø21.5 Rear mounting Ø25.1 Mechanics 18 contacts 5A/50V per IEC 61984 126 © 2011 – SOURIAU UTS Series 14E18/14D18 UTS 14E18/14D18 derating curves Jam nut sealing caps Plug sealing cap Square fl ange sealing cap Accessories Electrical characteristics Metal terminal Part number UTS614DCG Part number UTS14DCGE Metal terminal Part number UTS14DCG Part number UTS14DCGR Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket UL 4A 250V UL94 HB CSA 4A 250V UL94 HB IEC 5A 50V 1.5kV 3 Current use Limited use Not recommended use Test conditions Contact used: Machined contacts Wires used: 0.518mm² Color coding rings * Add G for Green, Y for Yellow, R for Red Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG G for Green Y for Yellow R for Red 0 20 40 60 80 100 120 Current (A) Ambient Operating Temperature (°C) 0 6 4 2 8 10 © 2011 – SOURIAU 127 UTS Series 14E18/14D18 Mechanics 128 © 2011 – SOURIAU OR OR WITH OR UTS Series 1419 - 14E19/14D19 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 131 Free hanging receptacle Cable gland (Fig.1) UTS1JC1419P UTS1JC1419S Plug Without (Fig.2) UTS61419P UTS61419S Plug Cable gland (Fig.3) UTS6JC1419P UTS6JC1419S Jam nut receptacle Without (Fig.4) UTS71419P UTS71419S PCB contacts supply separately see page 131 Jam nut receptacle Without (Fig.4) UTS71419P UTS71419S Handsolder electrical contacts loaded Square fl ange receptacle Without (Fig.8) UTS014E19P UTS014E19S Plug Without (Fig.2) UTS614E19P UTS614E19S Cable gland (Fig.3) UTS6JC14E19P UTS6JC14E19S Jam nut receptacle Without (Fig.5) UTS714E19P UTS714E19S PCB contacts loaded Square fl ange receptacle Without (Fig.9) UTS014D19P UTS014D19S Jam nut receptacle with stand off and with hold down clips Without (Fig.6) UTS714D19P32 UTS714D19S32 Jam nut receptacle with stand off and without hold down clip Without (Fig.7) UTS714D19P UTS714D19S Layout Sealed unmated Square fl ange receptacle © 2011 – SOURIAU 129 UTS Series 1419 - 14E19/14D19 Dimensions Note: all dimensions are in mm Square fl ange receptacle - UTS0 Mated connector length Fig. 8 Fig. 9 11.3 Ø22.3 2.3 7.5 78 23.2 28.8 Ø3.2 Front view 75 82 UTS7 UTS0 Free hanging - UTS1 Plug - UTS6 78.5 Ø22.3 Fig. 1 Female Male Fig. 2 Fig. 3 33 70 Ø35.1 Ø35.1 25.3 Jam nut receptacle - UTS7 Front view 30.4 35.1 18 3.5 3 12.3 Fig. 5 Fig. 6 Fig. 7 Fig. 4 4.2 18 Ø22.3 3.5 3 18 Ø22.3 Ø22.3 3.5 3 Panel cut out Drilling pattern Jam nut receptacle - UTS7 24.5 25.9 23.2 23.2 Ø3.3 1.6 4.9 Ø22 Ø26.2 Ø30.5 30° 68° 10 Ø3.1 3.3 6.6 2.8 5.7 Square fl ange receptacle - UTS0 22° Front mounting Ø21.5 Rear mounting Ø25.1 Mechanics 19 contacts 5A/32V per IEC 61984 130 © 2011 – SOURIAU UTS Series 1419 - 14E19/14D19 Metal terminal * Add G for Green, Y for Yellow, R for Red G for Green Y for Yellow R for Red Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS14DCG Part number UTS14DCGR Plug sealing cap Square fl ange sealing cap Part number UTS614DCG Part number UTS14DCGE Part numbers Receptacle cap Plug cap 85005588A 85005597 Plastic protective cap Part numbers / neoprene UTFD14B Gasket Color coding rings Part numbers Receptacles Plugs UTS714CCRR UTS614CCRR UTS714CCRY UTS614CCRY UTS714CCRG UTS614CCRG Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 131 UTS Series 1419 - 14E19/14D19 Contacts IEC 5A 32V 1.5kV 3 Electrical characteristics UTS 1419 - 14E19/14D19 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use UTS 1419 UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 UTS 14E19/14D19 UL 4A 250V UL94 HB CSA 4A 250V UL94 HB 0 20 40 60 80 100 0 2 4 6 8 10 12 Current (A) Ambient Operating Temperature (°C) 120 #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 19 contacts 5A/32V per IEC 61984 132 © 2011 – SOURIAU OR OR OR WITH UTS Series 1823 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contacts supply separately see page 135 Square fl ange receptacle Without (Fig.1) UTS01823P UTS01823S Free hanging receptacle Cable gland (Fig.2) UTS1JC1823P UTS1JC1823S Plug Without (Fig.3) UTS61823P UTS61823S Plug Cable gland (Fig.4) UTS6JC1823P UTS6JC1823S Jam nut receptacle Without (Fig.5) UTS71823P UTS71823S PCB contacts supply separately see page 135 Square fl ange receptacle Without (Fig.1) UTS01823P UTS01823S Jam nut receptacle Without (Fig.5) UTS71823P UTS71823S Layout © 2011 – SOURIAU 133 UTS Series 1823 Dimensions Note: all dimensions are in mm Plug - UTS6 Female Male Fig. 3 Fig. 4 33 81.3 25.3 Ø42 Ø42 Square fl ange receptacle - UTS0 Free hanging - UTS1 89 Ø28.6 Fig. 2 11.3 Ø28.6 27.1 33.5 2.5 10.3 18.9 Ø3.2 Fig. 1 Front view Female Male Jam nut receptacle - UTS7 Mated connector length Front view 41.5 36.9 Fig. 5 18 12.3 Ø28.6 3.5 84.1 90.8 UTS7 UTS0 Panel cut out 27.1 27.1 Ø3.3 Jam nut receptacle - UTS7 24.5 25.9 Drilling pattern 3.5 5 8.3 3.7 6.7 3.4 4.8 1.9 8.6 7.7 5.4 Square fl ange receptacle - UTS0 Front mounting Ø27.9 Rear mounting Ø31.9 Mechanics 23 contacts 9A/63V per IEC 61984 134 © 2011 – SOURIAU UTS Series 1823 Accessories and tooling (1): example of plating, for other plating see UTS catalog page 143 Metal terminal Crimp tooling Contacts Contact size Part number of head RM/RC 28M1K(1) Standard contacts #16 Ø 1.6mm S16RCM20 RM/RC 24M9K(1) S16RCM20 RM/RC 20M13K(1) S16RCM20 RM/RC 20M12K(1) S16RCM20 RM/RC 16M23K(1) S16RCM16 RM/RC 14M50K(1) S16RCM1450 RM/RC 14M30K(1) S16RCM14 SM/SC 24ML1TK6(1) S16SCM20 SM/SC 20ML1TK6(1) S16SCM20 SM/SC 16ML1TK6(1) S16SCML1 SM/SC 14ML1TK6(1) S16SCML1 SM/SC 16ML11TK6(1) S16SCML11 RMDXK10D28K Coaxial contacts M10S-1J RCDXK1D28K M10S-1J RM/RC DX60xxD28K M10S-1J RM/RC DXK10D28 + york090 M10S-1J RM/RC DX60xxD28 M10S-1J Jam nut sealing caps Part number UTS18DCG Part number UTS18DCGR Plug sealing cap Square fl ange sealing cap Part number UTS618DCG Part number UTS18DCGE Part numbers Receptacle cap Plug cap 8500-5590A 8500-5599 Plastic protective cap Part numbers / neoprene UTFD16B Gasket Handle Tool kit Part number TOOLKIT Part number SHANDLES Metal terminal © 2011 – SOURIAU 135 UTS Series 1823 Contacts 120 UL 10A 500V UL94 V-0 CSA 7A 500V UL94 V-0 IEC 9A 63V 1.5kV 3 Electrical characteristics UTS 1823 derating curves Test conditions Contact used: Machined contacts Wires used: 1.31mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 3 5 8 10 13 15 18 20 23 25 28 30 Current (A) Ambient Operating Temperature (°C) 120 #16 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 30-28 RM28M1K(1) RC28M1K(1) 0.55 1.1 26-24 RM24M9K(1) RC24M9K(1) 0.8 1.6 22-20 RM20M13K(1) RC20M13K(1) 1.18 1.8 22-20 RM20M12K(1) RC20M12K(1) 1.18 2.2 20-16 RM16M23K(1) RC16M23K(1) 1.8 3.2 16-14 RM14M50K(1) RC14M50K(1) 2.05 3.2 16-14 RM14M30K(1) RC14M30K(1) 2.28 3.2 Stamped & formed reeled contacts 26-24 SM24M1TK6(1)(2) SC24M1TK6(1)(2) 0.89-1.28 - 22-20 SM20M1TK6(1)(2) SC20M1TK6(1)(2) 1.17-2.08 - 18-16 SM16M1TK6(1)(2) SC16M1TK6(1)(2) 3.0 - 18-16 SM16M11TK6(1)(2) SC16M11TK6(1)(2) 2.0-3.0 - 14 SM14M1TK6(1)(2) SC14M1TK6(1)(2) 3.2 - PCB Machined (3) - RM20M12E8K(1) RC20M12E84K(1) - - Coaxial Cable Multipiece - RMDXK10D28 RCDXK1D28 - - Cable Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Twisted pair Multipiece - RMDXK10D28 + york090 RCDXK1D28 + york090 - - Twisted pair Monocrimp - RMDX60xxD28 RCDX60xxD28 - - Fiber optic POF contacts Plastic optical fi bre - RMPOF1000 RCPOF1000B - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 23 contacts 9A/63V per IEC 61984 136 © 2011 – SOURIAU OR WITH OR UTS Series 1832 Specifi cations Contact type Connector type Backshell Part number Male insert Female insert Crimp contact supply separately see page 139 Free hanging receptacle Cable gland (Fig.1) UTS1JC1832P UTS1JC1832S Plug Without (Fig.2) UTS61832P UTS61832S Plug Cable gland (Fig.3) UTS6JC1832P UTS6JC1832S Jam nut receptacle Without (Fig.4) UTS71832P UTS71832S PCB contacts supply separately see page 139 Jam nut receptacle Without (Fig.4) UTS71832P UTS71832S Layout © 2011 – SOURIAU 137 UTS Series 1832 Dimensions Note: all dimensions are in mm Plug - UTS6 Female Male Fig. 2 Fig. 3 33 81.3 25.3 Ø42 Ø42 Free hanging - UTS1 89 Ø28.6 Fig. 1 Jam nut receptacle - UTS7 Mated connector length - UTS7 90.8 Front view 41.5 36.9 18 12.3 Ø28.6 3.5 Fig. 4 Panel cut out Drilling pattern Jam nut receptacle - UTS7 24.5 25.9 1.6 4.4 5.7 8.1 2.4 3.1 5.3 3.3 6.1 9.7 4.8 7.2 8.7 0.8 2.4 3.8 5.6 9.1 4.9 5.8 2.4 5.5 7.7 8.9 4 6.7 8.5 Mechanics 32 contacts 4A/32V per IEC 61984 138 © 2011 – SOURIAU UTS Series 1832 Metal terminal Crimp tooling Contacts Contact size Part number of head RM/RC 24W3K(1) Standard contacts #20 Ø 1mm S20RM RM/RC 20W3K(1) S20RM RM/RC 18W3K(1) S20RM SM/SC 24W3S(2) S20SCM20 SM/SC 24WL3S(3) S20SCM20 SM/SC 20W3S(2) S20SCM20 SM/SC 20WL3S(3) S20SCM20 Jam nut sealing caps Part number UTS18DCG Part number UTS18DCGR Plug sealing cap Square fl ange sealing cap Part number UTS618DCG Part number UTS18DCGE Part numbers Receptacle cap Plug cap 8500-5590A 8500-5599 Plastic protective cap Part numbers / neoprene UTFD16B Gasket Handle Tool kit Part number TOOLKIT Part number SHANDLES (1): example of plating, for other plating see UTS catalog page 143 (2): contact reeled (3): loose contact Accessories and tooling Metal terminal © 2011 – SOURIAU 139 UTS Series 1832 Contacts UL 5A 250V UL94 V-0 CSA 4A 250V UL94 V-0 IEC 4A 32V 1.5kV 3 Electrical characteristics UTS 1832 derating curves Test conditions Contact used: Machined contacts Wires used: 0.518mm² Current use Limited use Not recommended use 0 20 40 60 80 100 0 2 4 6 8 10 Current (A) Ambient Operating Temperature (°C) 120 #20 Contact type AWG Part number Max wire Ø Max Male Female insulator Ø Crimp Machined 26-24 RM24W3K(1) RC24W3K(1) - 1.58 22-20 RM20W3K(1) RC20W3K(1) - 1.58 20-18 RM18W3K(1) RC18W3K(1) - 2.1 stamped & formed reeled contacts 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 26-24 SM24W3TK6(2) SC24W3TK6(2) - 0.89-1.58 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 22-20 SM20W3TK6(2) SC20W3TK6(2) - 1.17-2.08 PCB Machined (3) - RMW5016K RCW5016K - - (1): Example of plating, for other plating see page 143 (2): Loose piece contact available if putting L. Example: SM20ML1-TK6 (3): For dimensions see page 148 Mechanics 32 contacts 4A/32V per IEC 61984 UTS Series © 2011 – SOURIAU 141 Contacts UTS Series Description ....................................................................................................................................... 142 Contact plating selector guide ................................................................................................... 143 Contact selector guide ................................................................................................................. 144 Packaging ......................................................................................................................................... 144 Crimp contacts ................................................................................................................................ 145 #16 coaxial contacts .................................................................................................................... 147 PCB contacts ................................................................................................................................... 148 Fibre optic contacts ....................................................................................................................... 149 142 © 2011 – SOURIAU UTS Series Contacts Contacts Description The UTS series is delivered with (solder and PCB versions) or without contact (crimp version). When contacts are not loaded, this series offers the unique possibility to use the same contact in any layout as long as it receives the same active part size. Thus it is possible to buy only one contact reference and equip all connectors even if housings are different. The main benefit is the standardisation which means reduction of inventory cost. Bearing in mind that any additional tool or complicated assembly process should be avoided, our contacts are based on a snap-in principle which avoid the use of an insertion tool. Crimp contacts are available in different versions: In addition, UTS series can obviously be equipped with solder contacts, PCB contacts, screw termination. • machined • stamped & formed • coaxial • fiber optic © 2011 – SOURIAU 143 UTS Series Contacts Contact plating selector guide As soon as you know what contact size you need, you next have to decide on which type to use. Souriau proposes mainly two different types of electrical contacts: - Machined - Stamped & formed Machined contacts are generally chosen for low quantities purpose as well as a better solution for power applications. Stamped & formed contacts offer the ability to be crimped automatically which makes them more suitable for high volume production applications. Then comes the question: What plating should I choose ? Hereunder is a graph with criteria to guide you: NB: do not mix different plating (e.g. tin plated pin contact with gold plated socket contact). 250 100 0.4μm of gold min Gold fl ash Silver Tin 5mA 5mV Contact size #20 #12 #16 #8 Vibration Number of cycles Current / Voltage Contacts 144 © 2011 – SOURIAU UTS Series Contacts Electrical characteristics: contact resistance #20 Ø1mm Machined < 6m Stamped & formed < 15m #16 Ø1.6mm Machined < 3m Stamped & formed < 6m #12 Ø2.4mm Machined < 5m #8 Ø3.6mm Machined < 5m Available platings (contact supply separately) A 2μ Ni + 2μ Ag J Gold fl ash over 2μ Ni K Min 0.4μ gold over 2μ Ni S31 Active part: Gold fl ash over Ni Crimp area: Nickel S18 Active part: 0.75μ gold min over 2μ Ni Crimp area: 1.3μ tin over Ni Other: Nickel S25 S26 Active part: 0.75μ Au over Ni Crimp area: fl ash Au over Ni TK6 2-5μ Sn pre-plated Conscious of the wide variety of applications, contact packaging has been considered for small series (bulk packaging) and high volume production (reeled contacts): Size contacts #20 & #16 • 100 pieces bulk packing (stamped & formed contacts) Electrical characteristics: contact resistance #20 Ø1mm Machined < 4m #16 Ø1.6mm Machined < 3m Available platings (contact preloaded) Min 0.4μ gold over 2μ Ni Contact preloaded Contact supply separately • 50 pieces bulk packing (machined contacts) • 25 pieces bulk packing (stamped & formed contacts) • 1000 pieces bulk packing (machined contacts) • 5000 pieces reeled (machined contacts) • 3000 pieces reeled (stamped & formed contacts) Size contacts #12 & #8 Contact selector guide Packaging © 2011 – SOURIAU 145 UTS Series Contacts Crimp contacts (1) contact reeled (2) loose contact Exemple: RM24W3K - Size #20, Machined, AWG24 wire. Contact size Type Wire size Part number Max wire Ø Max insulator Ø Plating AWG mm² Male Female available #20 Ø1 mm Machined 26-24 0.13-0.20 RM24W3K RC24W3K 1.58 max K Stamped & Formed 26-24 0.13-0.25 SM24W3-(1) SC24W3-(1) 0.89-1.58 TK6 S25 (female) SM24WL3-(2) SC24WL3-(2) S26 (male) Machined 22-20 0.32-0.52 RM20W3K RC20W3K 1.58 max K Stamped & Formed 22-20 0.35-0.5 SM20W3-(1) SC20W3-(1) 1.17-2.08 TK6 S25 (female) SM20WL3-(2) SC20WL3-(2) S26 (male) Machined 20-18 0.50-0.93 RM18W3K RC18W3K 2.10 max K #16 Ø1.6 mm Machined 30-28 0.05-0.08 RM28M1- RC28M1- 0.55 1.1 K, J Machined 26-24 0.13-0.2 RM24M9- RC24M9- 0.8 1.6 K, J Stamped & Formed 26-24 0.13-0.25 SM24M1-(1) SM24ML1-(2) SC24M1-(1) SC24ML1-(2) 0.89-1.28 Insulation grip S31, S18, TK6 Machined 22-20 0.32-0.52 RM20M13- RC20M13- 1.18 1.8 K, J RM20M12- RC20M12- 2.2 Stamped & Formed 22-20 0.35-0.5 SM20M1-(1) SM20ML1-(2) SC20M1-(1) SC20ML1-(2) 1.17-2.08 Insulation grip S31, S18, TK6 Machined 20-16 0.52-1.5 RM16M23- RC16M23- 1.8 3.2 K, J Stamped & Formed 18-16 0.8-1.5 SM16M1-(1) SM16ML1-(2) SC16M1-(1) SC16ML1-(2) 3.0 No insulation grip S31, S18, TK6 Stamped & Formed 18-16 0.8-1.5 SM16M11-(1) SM16ML11-(2) SC16M11-(1) SC16ML11-(2) 2.0-3.0 Insulation grip S31, S18, TK6 Machined 16-14 1.5-2.5 RM14M50- RC14M50- 2.05 3.2 K, J Machined 16-14 1.5-2.5 RM14M30- RC14M30- 2.28 3.2 K, J Stamped & Formed 14 2.0-2.5 SM14M1-(1) SM14ML1-(2) SC14M1-(1) SC14ML1-(2) 3.2 No insulation grip S31, S18, TK6 #12 Ø2.4 mm Machined 22 0.13-0.4 82911457NA 82911456A - 4.9 A, K 20 0.5 82911459NA 82911458A 18 0.75-1.0 82911461NA 82911460A 16 1.5 82911463NA 82911462A 14 2.5 82911465NA 82911464A 12 4 82911467NA 82911466A #8 Ø3.6 mm Machined 16 1.5 82913601A 82913600A - 6.5 A 14 2.5 82913603A 82913602A 12 4 82913605A 82913604A 10 6.0 82913607A 82913606A 8 10.0 82913609A 82913608A Standard version Contacts 146 © 2011 – SOURIAU Contact 1 Contact 2 Standard male contact Standard female contact Longer male contact Standard male contact Standard female contact FMLB Shorter female contact LMFB UTS Series Contacts Crimp contacts Exemple: RM16M3GE1K - Size #16, Machined, Longer male, AWG16 wire.     First Mate Last Break contacts should be chosen only if the cavity is not marked with the earth symbol. For cavities marked with the earth symbol, standard contacts will fulfi ll the same role as a fi rst mate, last break contact used in a standard cavity. Ground symbol How to make FMLB / LMFB connection First Mate Last Break contacts Contact size Type Wire size Part number Max wire Ø Max insulator Ø Color band Plating available AWG mm² Male Female Front Rear #16 Ø1.6 mm Longer male contact (+1mm) Machined 30-28 0.05-0.08 RM28M1GE1□ - 0.55 1.1 - Red □ = K, J 26-24 0.13-0.2 RM24M9GE1□ 0.8 1.6 Red Red 22-20 0.32-0.52 RM20M13GE1□ 1.18 1.8 Black Red RM20M12GE1□ 2.2 Blue Red 20-16 0.52-1.5 RM16M23GE1□ 1.8 3.2 - Red 16-14 1.5-2.5 RM14M50GE1□ 2.05 - - Red 16-14 1.5-2.5 RM14M30GE1□ 2.28 - - Red #16 Ø1.6 mm Shorter female contact (-0.7mm) Machined 30-28 0.05-0.08 - RC28M1GE7□ 0.55 1.1 - Blue □ = K, J 26-24 0.13-0.2 RC24M9GE7□ 0.8 1.6 Red Blue 22-20 0.32-0.52 RC20M13GE7□ 1.18 1.8 Black Blue RC20M12GE7□ 2.2 Blue Blue 20-16 0.52-1.5 RC16M23GE7□ 1.8 3.2 - Blue 16-14 1.5-2.5 RC14M50GE7□ 2.05 - - Blue 16-14 1.5-2.5 RC14M30GE7□ 2.28 - - Blue ont Re © 2011 – SOURIAU 147 UTS Series Contacts #16 coaxial contacts We provide 2 types of coaxial contacts suitable for 50 or 75, coaxial cable or twisted pair cable. Monocrimp coaxial contact • The monocrimp one-piece coaxial contacts offer high reliability plus the economic advantage of a 95% reduction in installation time over conventional assembly methods. • This economy is achieved by simultaneously crimping both the inner conductor and outer braid or drain wire. Multipiece crimp coaxial contact • The inner conductor and outer braid is crimped individually. • The thermoplastic insulating bushing in the outer body is designed to accept and permanently retain the inner contact. • An outer ferrule is used to connect the braid to the outer contact and provide cable support to ensure against bending and vibration. Suitable for Coaxial cable or Twisted cable • For jacket diameter from 1.78 to 3.05mm Inner conductor up to 2.44mm diameter • For jacket diameter from 0.64 to 1.45mm Inner conductor from AWG30 to AWG24 Contacts for coaxial cable summary Contact type Contact range Contact part number with cable combination Cabling notice Male contact Female contact Multipiece RMDXK10D28 RCDXK1D28 See page 176 See pages 180 & 181 Monocrimp RMDX60xxD28 RCDX60xxD28 See page 182 Contacts for twisted pairs cable summary Contact type Contact range Contact part number with cable combination Cabling notice Male contact Female contact Multipiece RMDXK10D28 + YORK090 RCDXK1D28 + YORK090 See page 177 See page 178 Monocrimp RMDX60xxD28 RCDX60xxD28 See page 179 Coaxial contact range Contacts 148 © 2011 – SOURIAU PCB contacts PCB contacts PCB soldering UTS range can be carried out with a wave soldering process, but not refl ow soldering process. All high temperature processes are prohibited. Nominal length (G) Dimension of dipsolder contacts out of connector (contacts to be ordered separately). Contact size Type Part number Plating Male Female #20 Ø1mm Short version RMW50A7K RCW50A7K K Long version RMW5016K RCW5016K #16 Ø1.6mm Short version RM20M12E8K RC20M12E8K K Long version RM20M12E83K RC20M12E83K RC20M12E84K Exemple: RM50A7K - Size #20, Short version, male. UTS Series Contacts G * Plating indication: see plating table Connector size Pin contact Socket contact RM20M12E8*□ RM20M12E83*□ RC20M12E8*□ RC20M12E83*□ RC20M12E84*□ 10 4 9.1 3.3 8.5 12.1 12 4 9.1 3.3 8.5 12.1 14 4 9.1 3.3 8.5 12.1 16 4 9.1 3.3 8.5 12.1 Connector size Pin contact Socket contact RM20M 12E8*□ RM20M 12E83*□ RMW 50A7K RMW 5016K RC20M 12E8*□ RC20M 12E83*□ RCW 50A7K RCW 5016K 10 4.1 9.2 9.51 10.41 4.65 8.5 2.4 3.04 12 4 9.2 9.51 10.41 3.3 8.5 2.4 3.04 14 4 9.2 9.51 10.41 3.3 8.5 2.4 3.04 16 4 9.2 9.51 10.41 3.3 8.5 2.4 3.04 UTS0 UTS7 © 2011 – SOURIAU 149 Fibre optic contacts Size 16 Fibre optic contacts for TRIM TRIO® connectors Size 16 Fibre optic contacts are optical contacts designed for the integration of optical links in all TRIM TRIO® cable connectors. The Fibre optic contacts are designed to accommodate: • Plastic Optical Fibre (POF) 1 mm core and 2.2 mm jacket • Plastic Clad Fibre (PCF) 230μm core and 2.2 mm jacket Typical features and benefits are: • Socket contact is spring loaded to avoid any air gap between the two optical faces. • Low insertion loss is provided by high precision pieces. • Single jumpers, multiway harness and active device housings can be supplied regarding customer requirement. Performance • Fibre type: ................................................................................................................................POF • Wave length: ........................................................................................................................650 nm • Optical insertion loss (typ.): ..........................................................................................2 dB max. • Jacketed external diameter: ............................................................................................2.2mm • Temperature range: ....................................................................................................-25°C to +70°C • Cable retention: ..................................................................................................................... 49N • Mating cycles without cleaning: .........................................................................................50 • Max. mating cycles: ...............................................................................................................500 Construction • Contact body: Copper alloy Connector accommodation Any TRIM TRIO® size 16 contact can be used in any contact position in any connector in the TRIM TRIO® size 16 interconnection system : UTP, UTS, UTG, UTO. UTS Series Contacts Description Technical characteristics Contacts 150 © 2011 – SOURIAU Fibre optic contacts UTS Series Contacts POF Contact (Plastic Optical Fibre) Ordering information Part numbers Descriptions 80WD0005 Stripping tool 80WD0025 Automatic stripping tool for Ø 0.5 mm, 0.6 mm, 0.7 mm & 3.8 mm 80WM0006 Ruler 80WP0005 Polishing plate 80WP0013 Non slip base (to hold the polishing plate) 80WP0014 Polishing disk (grain size 9μm) 80WP0018 Polishing tool 80WP0019 Polishing disk (grain size 30μm) 80WS0002 Crimping plier STANDARD TOOLING KIT - P/N 80MS0004 The standard tooling kit is made of the part numbers below that can be ordered separately as well. Part numbers Descriptions 80WG0010 Needle 80WG0015 Capsule 80WG0016 Syringe 80WN0005 Dry air spray 80WN0006 Optical paper 80WN0012 Dropping bottle 80WN0008 Wiping solvent SPECIFIC TOOLING LIST - can be ordered only separately POF Contacts (Plastic Optical Fibre) Male contact ................................................RMPOF1000 Female contact ......................................... RCPOF1000B © 2011 – SOURIAU 151 UTS Series Contacts Contacts UTS Series © 2011 – SOURIAU 153 Technical information UTS Series Tooling ............................................................................................................................................... 154 Assembly intruction ....................................................................................................................... 156 Dimensions overmoulded harnesses ...................................................................................... 162 Extraction tools ............................................................................................................................... 162 Rated current & working voltage ............................................................................................... 163 UV resistance .................................................................................................................................. 164 UL94 + UL1977 ............................................................................................................................. 165 IEC 61984 & IP codes explained ............................................................................................. 168 What is NEMA rating ? ................................................................................................................. 170 Ethernet for the layman ................................................................................................................ 171 154 © 2011 – SOURIAU UTS Series Technical information Souriau has been working in partnership with Mecal for a good number of years. With sales offi ces located in all major industrial regions of the world, the combined strengths of both organisations has resulted in a truly global solution to all your production tooling needs. Mecal sales network: Mecal is leader in manufacturing tooling for crimping terminals over a stripped wire. Established in 1976, Mecal has become one of the world's leading companies dedicated to the design and manufacture of semi automatic production tools for strip fed, open barrel crimp terminals, serving the Automotive, Telecom and Datacomm industry. The extreme environment interconnect specialist “from deep sea to deep space”. Souriau designs manufactures and markets high performance interconnect solutions for severe environments dedicated to the aerospace, defence, light and heavy industry markets. Mini Applicator Stripper Presses Tooling www.mecal.net/eng/retevendita.php Automatic crimping tools © 2011 – SOURIAU 155 UTS Series Technical information Contact size Part number Head Handles #20 1mm RM/RC 24W3 - S20RCM SHANDLES RM/RC 20W3 - RM/RC 18W3 - SM 24W3S-(1) SC 24W3S-(1) S20SCM20 SM 24WL3S-(2) SC 24WL3S-(2) SM/SC 20W3S-(1) SM/SC 20WL3S-(2) #16 1.6mm RM/RC 28M1- S16RCM20 RM/RC 24M9- RM/RC 20M13- RM/RC 20M12- RM/RC 16M23- S16RCM16 RM/RC 14M50- S16RCM1450 RM/RC 14M30- S16RCM14 SM/SC 24M1- SM/SC 24ML1- S16SCM20 SM/SC 20M1- SM/SC 20ML1- SM/SC 16M1- SM/SC 16ML1- S16SCML1 SM/SC 14M1- SM/SC 14ML1- SM/SC 16M11- SM/SC 16ML11- S16SCML11 Specifi c contacts Contact size Part number Tool with separate locator Extraction tools Hand tool Positioner + locator setting #12 2.4mm 8291 1457N- / 8291 1456- M317 VGE10077A 1-2 5106020924 8291 1459N- / 8291 1458- 2 8291 1461N- / 8291 1460- 2 8291 1463N- / 8291 1462- 3 8291 1465N- / 8291 1464- 3 8291 1467N- / 8291 1466- 4 #8 3.6mm 8291 3601A / 8291 3600A M317 VGE10078A 3 51060210936 8291 3603A / 8291 3602A 3 8291 3605A / 8291 3604A 4 8291 3607A / 8291 3606A 5 8291 3609A / 8291 3608A 6/7 Contact size Part number Hand tools (SHANDLES) head Tool with separate locator Extraction tools Hand tool Positioner + locator setting #16 Ø 1.6mm Longer RM contact RM28M1GE1- S16RCM20 RX2025GE1 RM24M9GE1- RM20M13GE1- RM16M23 GE1- S16RCM16 MH860 MH86186 6/8 RM14M50 GE1- S16RCM1450 M317 UH25 3 RM14M30 GE1- S16RCM14 #16 Ø 1.6mm Shorter RC contact RC28M1GE7- S16RCM20 MH860 MH86164G 4/6 RC24M9GE7- 5/6 RC20M13GE7- RC20M12GE7- 5/7 RC16M23GE7- S16RCM16 6/8 RC14M50GE7- S16RCM1450 M317 UH25 3 RC14M30GE7- S16RCM14 Standard contacts Coaxial contacts See cabling notice chapter Appendices, pages 178 to 182. (1) contact reeled (2) loose contact Note: endurance of SHANDLES tool = 5 000 cycles. 51060210924 51060210936 SHANDLES Crimptooling table Technical information 156 © 2011 – SOURIAU Assembly instruction Part number Stripping length L Male Female (mm) Machined contact #16 RM28M1- / RM24M9- RM20M13- / RM20M12- RC28M1- / RC24M9- RC20M13- / RC20M12- 4.8 RM16M23- / RM14M50- RM14M30- RC16M23- / RC14M50- RC14M30- 7.1 #20 RM24W3- / RM20W3- RM18W3- RC24W3- / RC20W3- RC18W3- 4.8 Stamped & formed #16 SM24M1- / SM24ML1- SM20M1- / SM20ML1 SC24M1- / SC24ML1- SC20M1- / SC20ML1- 4 SM16M11- / SM16ML11- SC16M11- / SC16ML11- 4.65 SM16M1- / SM16ML1- SC16M1- / SC16ML1- 6.35 SM14M1- / SM14ML1- SC16M11- / SC16ML11- 6.35 Screw contacts Power contacts #12 8291 1457- / 8291 1459- / 8291 1461- / 8291 1463- / 8291 1465- / 8291 1467- 8291 1456- / 8291 1458- / 8291 1460- /8291 1462- / 8291 1464- / 8291 1466 - 7 to 8 Power contacts #8 8291 3601- / 8291 3603- / 8291 3605- 8291 3607- / 8291 3609- 8291 3600- / 8291 3602- / 8291 3604- / 8291 3606- / 8291 3608- 6.5 to 7.5 Contact delivered with connector 5.8 Part number Stripping length L Male Female (mm) Machined contact #16 & #20 5 L L L L Without insulation support With insulation support L UTS Series Technical information Wire stripping crimp version Wire stripping solder version © 2011 – SOURIAU 157 One of the key factors which affects the performance of a connector, is the way contacts are terminated. Crimped connections are nowadays seen as the best solution to ensure quality throughout the lifetime of the product. Here are some reasons why we recommend this method of termination for UTS connectors: Advantages (Extract from the IEC 60352-2): - Effi cient processing of connections at each production level - Processing by fully-automatic or semi- automatic crimping machines, or with hand operated tools - No cold-soldered joints - No degradation of the spring characteristic of female contacts by the soldering temperature - No health risk from heavy metal and fl ux steam - Preservation of conductor fl exibility behind the crimped connection - No burnt, discolored and overheated wire insulation - Good connections with reproducible electrical and mechanical performances - Easy production control. To ensure that the crimp tooling is performing according tooriginal specifi cations, it is important to carry out regular checks. A common way to check the performance of tooling is with a simple pull test, ideally using a dedicated electric pull tester. Minimum recommended full forces are indicated in the tables below: Active contact part Contact type Die location on heads Wire section range Section (mm²) Tensile straight test (mini) Height (Mm) H (±0.075) Width (Mm) W (±0.075) Head's P/N Machined contacts size 20 RM/RC 24W3* 26/24 AWG 26 0.12 min 15 N 0.95 1.27 S20RCM AWG 24 0.25 max 32 N RM/RC 20W3* 22/20 AWG 22 0.32 min 40 N 1.26 1.78 AWG 20 0.50 max 60 N RM/RC 18W3* 20/18 AWG 20 0.50 max 60 N 1.35 1.86 AWG 18 0.82 max 90 N S & F contacts size 20 SM/SC 24WL3TK6* 26/24 AWG 26 0.12 min 15 N 0.80 1.49 S20SCM20 AWG 24 0.25 max 32 N SM/SC 20WL3TK6* 22/20 AWG 22 0.32 min 40 N 1.01 1.53 AWG 20 0.50 max 60 N Machined contacts size 16 RM/RC 28M1K* 30/28 AWG 30 0.05 min 11 N 1.14 1.41 S16RCM20 AWG 28 0.08 max 11 N RM/RC 24M9K* 26/24 AWG 26 0.12 min 15 N 1.15 1.41 AWG 24 0.25 max 32 N RM/RC 20M13K* 22/20 AWG 22 0.32 min 40 N 1.26 1.76 AWG 20 0.50 max 60 N RM/RC 20M12K* AWG 22 0.32 min 40 N AWG 20 0.50 max 60 N RM/RC 16M23K* 20 AWG 20 0.50 max 60 N 1.66 2.18 18 AWG 18 0.82 max 90 N 1.80 2.28 S16RCM16 16 AWG 16 1.50 max 150 N 1.96 2.43 RM/RC 14M30K* 16 AWG 16 1.50 min 150 N 2.10 2.68 S16RCM14 14 AWG 14 2.50 min 230 N 2.30 2.78 RM/RC 14M50K* 16 AWG 16 1.50 min 150 N 2.09 2.59 S16RCM1450 14 AWG 14 2.50 max 230 N 2.26 2.71 S & F contacts size 16 SM/SC 24ML1TK6* 26/24 AWG 26 0.12 min 15 N 0.84 1.50 S16SCM20 AWG 24 0.25 max 32 N SM/SC 20ML1TK6* 22/20 AWG 22 0.32 min 40 N 1.02 1.54 AWG 20 0.50 max 60 N SM/SC 16ML11TK6* 18 AWG 18 0.82 min 90 N 1.32 2.09 S16SCML11 16 AWG 16 1.50 max 150 N 1.36 2.10 SM/SC 16ML1TK6* 18 AWG 18 0.82 min 90 N 1.49 2.02 16 AWG 16 1.50 max 150 N 1.7 2.05 S16SCML1 SM/SC14ML1TK6* 14 AWG 14 2.50 max 230 N 1.79 2.58 (1): example of plating, for other plating see page 143 W W H H Machined contact Stamped & Formed contact UTS Series Technical information Crimping Technical information 158 © 2011 – SOURIAU • Strip wires, crimp or solder contacts • Insert contacts into connector cavities (insert manually or use tool RTM205 crimp contacts only) • Place receptacle in the panel cut-out, with optional gasket • Secure receptacle with screws (not supplied) Gasket (optional) Gasket (optional) Front mounting : Crimp version Rear mounting : Crimp version Optional coding ring Optional coding ring Panel thickness: 2.5mm max Panel Receptacl