High Speed USB 2.0 Switch with ESD Protection and Low - PDF - Farnell Element 14

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Branding Farnell element14 (France)

 

Farnell Element 14 :

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Everything You Need To Know About Arduino

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Tutorial 01 for Arduino: Getting Acquainted with Arduino

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The Cube® 3D Printer

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What's easier- DIY Dentistry or our new our website features?

 

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Ben Heck's Getting Started with the BeagleBone Black Trailer

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Ben Heck's Home-Brew Solder Reflow Oven 2.0 Trailer

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Get Started with Pi Episode 3 - Online with Raspberry Pi

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Discover Simulink Promo -- Exclusive element14 Webinar

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Ben Heck's TV Proximity Sensor Trailer

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Ben Heck's PlayStation 4 Teardown Trailer

See the trailer for the next exciting episode of The Ben Heck show. Check back on Friday to be among the first to see the exclusive full show on element…

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Get Started with Pi Episode 4 - Your First Raspberry Pi Project

Connect your Raspberry Pi to a breadboard, download some code and create a push-button audio play project.

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Ben Heck Anti-Pickpocket Wallet Trailer

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Molex Earphones - The 14 Holiday Products of Newark element14 Promotion

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Tripp Lite Surge Protector - The 14 Holiday Products of Newark element14 Promotion

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Microchip ChipKIT Pi - The 14 Holiday Products of Newark element14 Promotion

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Beagle Bone Black - The 14 Holiday Products of Newark element14 Promotion

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3M E26, LED Lamps - The 14 Holiday Products of Newark element14 Promotion

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3M Colored Duct Tape - The 14 Holiday Products of Newark element14 Promotion

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Tenma Soldering Station - The 14 Holiday Products of Newark element14 Promotion

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Duratool Screwdriver Kit - The 14 Holiday Products of Newark element14 Promotion

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Cubify 3D Cube - The 14 Holiday Products of Newark element14 Promotion

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Bud Boardganizer - The 14 Holiday Products of Newark element14 Promotion

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Raspberry Pi Starter Kit - The 14 Holiday Products of Newark element14 Promotion

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Fluke 323 True-rms Clamp Meter - The 14 Holiday Products of Newark element14 Promotion

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Dymo RHINO 6000 Label Printer - The 14 Holiday Products of Newark element14 Promotion

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3M LED Advanced Lights A-19 - The 14 Holiday Products of Newark element14 Promotion

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Innovative LPS Resistor Features Very High Power Dissipation

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Charge Injection Evaluation Board for DG508B Multiplexer Demo

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Ben Heck The Great Glue Gun Trailer Part 2

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Introducing element14 TV

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Ben Heck Time to Meet Your Maker Trailer

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Détecteur de composants

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Recherche intégrée

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Ben Builds an Accessibility Guitar Trailer Part 1

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Ben Builds an Accessibility Guitar - Part 2 Trailer

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PiFace Control and Display Introduction

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Flashmob Farnell

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Express Yourself in 3D with Cube 3D Printers from Newark element14

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Farnell YouTube Channel Move

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Farnell: Design with the best

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French Farnell Quest

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Altera - 3 Ways to Quickly Adapt to Changing Ethernet Protocols

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Cy-Net3 Network Module

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MC AT - Professional and Precision Series Thin Film Chip Resistors

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Solderless LED Connector

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PSA-T Series Spectrum Analyser: PSA1301T/ PSA2701T

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3-axis Universal Motion Controller For Stepper Motor Drivers: TMC429

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Voltage Level Translation

Puce électronique / Microchip :

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Microchip - 8-bit Wireless Development Kit

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 2 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 3 of 3

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Microchip - Introduction to mTouch Capacitive Touch Sensing Part 1 of 3

Sans fil - Wireless :

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Microchip - 8-bit Wireless Development Kit

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Wireless Power Solutions - Wurth Electronics, Texas Instruments, CadSoft and element14

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Analog Devices - Remote Water Quality Monitoring via a Low Power, Wireless Network

Texas instrument :

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Texas Instruments - Automotive LED Headlights

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Texas Instruments - Digital Power Solutions

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Texas Instruments - Industrial Sensor Solutions

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Texas Instruments - Wireless Pen Input Demo (Mobile World Congress)

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Texas Instruments - Industrial Automation System Components

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Texas Instruments - TMS320C66x - Industry's first 10-GHz fixed/floating point DSP

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Texas Instruments - TMS320C66x KeyStone Multicore Architecture

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Texas Instruments - Industrial Interfaces

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Texas Instruments - Concerto™ MCUs - Connectivity without compromise

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Texas Instruments - Stellaris Robot Chronos

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Texas Instruments - DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit

Ordinateurs :

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Ask Ben Heck - Connect Raspberry Pi to Car Computer

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Ben's Portable Raspberry Pi Computer Trailer

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Ben's Raspberry Pi Portable Computer Trailer 2

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Ben Heck's Pocket Computer Trailer

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Ask Ben Heck - Atari Computer

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Ask Ben Heck - Using Computer Monitors for External Displays

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Raspberry Pi Partnership with BBC Computer Literacy Project - Answers from co-founder Eben Upton

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Installing RaspBMC on your Raspberry Pi with the Farnell element14 Accessory kit

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Raspberry Pi Served - Joey Hudy

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Happy Birthday Raspberry Pi

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Raspberry Pi board B product overview

Logiciels :

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Ask Ben Heck - Best Opensource or Free CAD Software

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Tektronix FPGAView™ software makes debugging of FPGAs faster than ever!

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Ask Ben Heck - Best Open-Source Schematic Capture and PCB Layout Software

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Introduction to Cadsoft EAGLE PCB Design Software in Chinese

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Altera - Developing Software for Embedded Systems on FPGAs

Tutoriels :

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Ben Heck The Great Glue Gun Trailer Part 1

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the knode tutorial - element14

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Ben's Autodesk 123D Tutorial Trailer

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Ben's CadSoft EAGLE Tutorial Trailer

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Ben Heck's Soldering Tutorial Trailer

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Ben Heck's AVR Dev Board tutorial

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Ben Heck's Pinball Tutorial Trailer

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Ben Heck's Interface Tutorial Trailer

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First Stage with Python and PiFace Digital

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Cypress - Getting Started with PSoC® 3 - Part 2

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Energy Harvesting Challenge

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New Features of CadSoft EAGLE v6

Documents PDF :

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[TXT] Farnell-CLASS 1-or-2..> 22-Jul-2014 12:30  4.7M  
[TXT] Farnell-CLRC632-NXP-..> 20-Dec-2014 10:22  2.6M  
[TXT] Farnell-CRC-HANDCLEA..> 07-Jul-2014 19:46  1.2M  
[TXT] Farnell-CS5532-34-BS..> 01-Apr-2014 07:39  3.5M  
[TXT] Farnell-Cannon-ZD-PD..> 11-Mar-2014 08:13  2.8M  
[TXT] Farnell-Ceramic-tran..> 14-Jun-2014 18:19  3.4M  
[TXT] Farnell-Circuit-Impr..> 25-Jul-2014 12:22  3.1M  
[TXT] Farnell-Circuit-Note..> 26-Mar-2014 18:00  2.8M  
[TXT] Farnell-Circuit-Note..> 26-Mar-2014 18:00  2.8M  
[TXT] Farnell-Cles-electro..> 21-Mar-2014 08:13  3.9M  
[TXT] Farnell-Clipper-Seri..> 08-Jul-2014 18:48  2.8M  
[TXT] Farnell-Compensating..> 09-Sep-2014 08:16  2.6M  
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[TXT] Farnell-Conception-d..> 11-Mar-2014 07:49  2.4M  
[TXT] Farnell-Connectors-N..> 14-Jun-2014 18:12  2.1M  
[TXT] Farnell-Construction..> 14-Jun-2014 18:25  2.5M  
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[TXT] Farnell-Crucial-Ball..> 20-Dec-2014 16:48  8.0M  
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[TXT] Farnell-Cube-3D-Prin..> 18-Jul-2014 17:02  2.5M  
[TXT] Farnell-Current-Tran..> 26-Mar-2014 17:58  2.7M  
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[TXT] Farnell-DAC8143-Data..> 18-Jul-2014 16:59  1.5M  
[TXT] Farnell-DC-DC-Conver..> 15-Jul-2014 16:48  781K  
[TXT] Farnell-DC-Fan-type-..> 14-Jun-2014 09:48  2.5M  
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[TXT] Farnell-DG411-DG412-..> 07-Jul-2014 19:47  1.0M  
[TXT] Farnell-DP83846A-DsP..> 18-Jul-2014 16:55  1.5M  
[TXT] Farnell-DS3231-DS-PD..> 18-Jul-2014 16:57  2.5M  
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[TXT] Farnell-Davum-TMC-PD..> 14-Jun-2014 18:27  2.4M  
[TXT] Farnell-De-la-puissa..> 29-Mar-2014 11:10  3.3M  
[TXT] Farnell-Decapant-KF-..> 07-Jul-2014 19:45  1.2M  
[TXT] Farnell-Directive-re..> 25-Mar-2014 08:16  3.0M  
[TXT] Farnell-Documentatio..> 14-Jun-2014 18:26  2.5M  
[TXT] Farnell-Download-dat..> 16-Jul-2014 09:02  2.2M  
[TXT] Farnell-Download-dat..> 13-Jun-2014 18:40  1.8M  
[TXT] Farnell-Drawing-Octo..> 09-Jul-2015 11:13  2.4M  
[TXT] Farnell-Dremel-Exper..> 22-Jul-2014 12:34  1.6M  
[TXT] Farnell-Dual-MOSFET-..> 28-Jul-2014 17:41  2.8M  
[TXT] Farnell-ECO-Series-T..> 20-Mar-2014 08:14  2.5M  
[TXT] Farnell-EE-SPX303N-4..> 15-Jul-2014 17:06  969K  
[TXT] Farnell-ELMA-PDF.htm    29-Mar-2014 11:13  3.3M  
[TXT] Farnell-EMC1182-PDF.htm 25-Mar-2014 08:17  3.0M  
[TXT] Farnell-EPCOS-173438..> 04-Jul-2014 10:43  3.3M  
[TXT] Farnell-EPCOS-Sample..> 11-Mar-2014 07:53  2.2M  
[TXT] Farnell-ES1F-ES1J-fi..> 06-Jul-2014 10:04  867K  
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[TXT] Farnell-ESM6045DV-ST..> 13-Oct-2014 07:06  850K  
[TXT] Farnell-ESMT-M52D323..> 20-Dec-2014 16:50  7.6M  
[TXT] Farnell-Ed.081002-DA..> 19-Mar-2014 18:02  2.5M  
[TXT] Farnell-Encodeur-USB..> 08-Jul-2014 18:56  2.0M  
[TXT] Farnell-Evaluating-t..> 22-Jul-2014 12:28  4.9M  
[TXT] Farnell-Everything-Y..> 11-Oct-2014 12:05  1.5M  
[TXT] Farnell-Excalibur-Hi..> 28-Jul-2014 17:10  2.4M  
[TXT] Farnell-Excalibur-Hi..> 28-Jul-2014 17:10  2.4M  
[TXT] Farnell-Explorer-16-..> 29-Jul-2014 10:31  1.3M  
[TXT] Farnell-F28069-Picco..> 14-Jun-2014 18:14  2.0M  
[TXT] Farnell-F42202-PDF.htm  19-Mar-2014 18:00  2.5M  
[TXT] Farnell-FAN6756-Fair..> 06-Jul-2014 10:04  850K  
[TXT] Farnell-FDC2512-Fair..> 06-Jul-2014 10:03  886K  
[TXT] Farnell-FDS-ITW-Spra..> 14-Jun-2014 18:22  3.3M  
[TXT] Farnell-FDV301N-Digi..> 06-Jul-2014 10:03  886K  
[TXT] Farnell-FICHE-DE-DON..> 10-Mar-2014 16:17  1.6M  
[TXT] Farnell-FSDM0565RB-F..> 09-Jul-2015 11:23  1.2M  
[TXT] Farnell-Fairchild-2N..> 09-Jul-2015 11:20  1.8M  
[TXT] Farnell-Fairchild-FD..> 09-Jul-2015 11:21  1.7M  
[TXT] Farnell-Fast-Charge-..> 28-Jul-2014 17:12  6.4M  
[TXT] Farnell-Fastrack-Sup..> 23-Jun-2014 10:25  3.3M  
[TXT] Farnell-Ferric-Chlor..> 29-Mar-2014 11:14  2.8M  
[TXT] Farnell-Fiche-de-don..> 14-Jun-2014 09:47  2.5M  
[TXT] Farnell-Fiche-de-don..> 14-Jun-2014 18:26  2.5M  
[TXT] Farnell-Fluke-1730-E..> 14-Jun-2014 18:23  2.5M  
[TXT] Farnell-Fluke-Ti400-..> 20-Dec-2014 16:48  8.0M  
[TXT] Farnell-Full-Datashe..> 15-Jul-2014 17:08  951K  
[TXT] Farnell-Full-Datashe..> 15-Jul-2014 16:47  803K  
[TXT] Farnell-GALVA-A-FROI..> 26-Mar-2014 17:56  2.7M  
[TXT] Farnell-GALVA-MAT-Re..> 26-Mar-2014 17:57  2.7M  
[TXT] Farnell-GN-RELAYS-AG..> 20-Mar-2014 08:11  2.6M  
[TXT] Farnell-Gertboard-Us..> 29-Jul-2014 10:30  1.4M  
[TXT] Farnell-HC49-4H-Crys..> 14-Jun-2014 18:20  3.3M  
[TXT] Farnell-HEF4052B-NXP..> 09-Jul-2015 11:18  2.0M  
[TXT] Farnell-HFE1600-Data..> 14-Jun-2014 18:22  3.3M  
[TXT] Farnell-HI-70300-Sol..> 14-Jun-2014 18:27  2.4M  
[TXT] Farnell-HIP4081A-Int..> 07-Jul-2014 19:47  1.0M  
[TXT] Farnell-HUNTSMAN-Adv..> 10-Mar-2014 16:17  1.7M  
[TXT] Farnell-Haute-vitess..> 20-Dec-2014 18:50  2.4M  
[TXT] Farnell-Hex-Inverter..> 29-Jul-2014 10:31  875K  
[TXT] Farnell-High-precisi..> 08-Jul-2014 18:51  2.3M  
[TXT] Farnell-ICM7228-Inte..> 07-Jul-2014 19:46  1.1M  
[TXT] Farnell-IP4251_52_53..> 20-Dec-2014 09:51  1.6M  
[TXT] Farnell-IP4252CZ16-8..> 13-Jun-2014 18:41  1.7M  
[TXT] Farnell-ISL6251-ISL6..> 07-Jul-2014 19:47  1.1M  
[TXT] Farnell-Instructions..> 19-Mar-2014 18:01  2.5M  
[TXT] Farnell-Jeu-multi-la..> 25-Jul-2014 12:23  3.0M  
[TXT] Farnell-KA3525A-SMPS..> 09-Jul-2015 11:23  1.2M  
[TXT] Farnell-KSZ8851SNL-S..> 23-Jun-2014 10:28  2.1M  
[TXT] Farnell-Keyboard-Mou..> 22-Jul-2014 12:27  5.9M  
[TXT] Farnell-L-efficacite..> 11-Mar-2014 07:52  2.3M  
[TXT] Farnell-L78-Positive..> 13-Oct-2014 07:04  1.8M  
[TXT] Farnell-L78-STMicroe..> 11-Oct-2014 15:49  1.6M  
[TXT] Farnell-L78S-STMicro..> 22-Jul-2014 12:32  1.6M  
[TXT] Farnell-L293B-STMicr..> 11-Oct-2014 15:49  1.7M  
[TXT] Farnell-L293d-Texas-..> 08-Jul-2014 18:53  2.2M  
[TXT] Farnell-L4978-STMicr..> 13-Oct-2014 07:07  783K  
[TXT] Farnell-L6384E-STMic..> 13-Oct-2014 07:02  1.9M  
[TXT] Farnell-L6562-STMicr..> 13-Oct-2014 07:07  754K  
[TXT] Farnell-LCW-CQ7P.CC-..> 25-Mar-2014 08:19  3.2M  
[TXT] Farnell-LD-WSECO16-P..> 25-Jul-2014 12:22  3.1M  
[TXT] Farnell-LF351-STMicr..> 11-Oct-2014 15:49  1.7M  
[TXT] Farnell-LM3S6952-Mic..> 22-Jul-2014 12:27  5.9M  
[TXT] Farnell-LM19-Texas-I..> 18-Jul-2014 17:00  1.2M  
[TXT] Farnell-LM139-LM239-..> 13-Oct-2014 07:07  771K  
[TXT] Farnell-LM158-LM258-..> 11-Oct-2014 15:49  1.6M  
[TXT] Farnell-LM217-LM317-..> 13-Oct-2014 07:04  1.7M  
[TXT] Farnell-LM324-Texas-..> 29-Jul-2014 10:32  1.5M  
[TXT] Farnell-LM350-STMicr..> 13-Oct-2014 07:03  1.8M  
[TXT] Farnell-LM386-Low-Vo..> 29-Jul-2014 10:32  1.5M  
[TXT] Farnell-LM555-Timer-..> 08-Jul-2014 18:53  2.2M  
[TXT] Farnell-LM2904-LM290..> 13-Oct-2014 07:04  1.7M  
[TXT] Farnell-LM7805-Fairc..> 09-Sep-2014 08:13  2.7M  
[TXT] Farnell-LME49725-Pow..> 14-Jun-2014 09:49  2.5M  
[TXT] Farnell-LMH6518-Texa..> 18-Jul-2014 16:59  1.3M  
[TXT] Farnell-LMP91051-Use..> 29-Jul-2014 10:30  1.4M  
[TXT] Farnell-LMT88-2.4V-1..> 28-Jul-2014 17:42  2.8M  
[TXT] Farnell-LOCTITE-542-..> 25-Mar-2014 08:15  3.0M  
[TXT] Farnell-LOCTITE-3463..> 25-Mar-2014 08:19  3.0M  
[TXT] Farnell-LPC11U3x-32-..> 16-Jul-2014 09:01  2.4M  
[TXT] Farnell-LPC81xM-32-b..> 16-Jul-2014 09:02  2.0M  
[TXT] Farnell-LPC81xM-NXP-..> 20-Dec-2014 10:26  1.2M  
[TXT] Farnell-LPC178x-7x-N..> 20-Dec-2014 10:21  1.6M  
[TXT] Farnell-LPC408x-7x 3..> 16-Jul-2014 09:03  1.6M  
[TXT] Farnell-LPC1769-68-6..> 16-Jul-2014 09:02  1.9M  
[TXT] Farnell-LPC1769-68-6..> 20-Dec-2014 10:06  2.2M  
[TXT] Farnell-LPC2141-42-4..> 09-Jul-2015 11:23  1.5M  
[TXT] Farnell-LPC2364-65-6..> 09-Jul-2015 11:23  1.4M  
[TXT] Farnell-LPC2468-NXP-..> 09-Jul-2015 11:23  1.6M  
[TXT] Farnell-LPC3220-30-4..> 16-Jul-2014 09:02  2.2M  
[TXT] Farnell-LPC4350-30-2..> 20-Dec-2014 10:21  1.4M  
[TXT] Farnell-LQ-RELAYS-AL..> 06-Jul-2014 10:02  924K  
[TXT] Farnell-LT1961-Linea..> 18-Jul-2014 16:58  1.6M  
[TXT] Farnell-LT3757-Linea..> 18-Jul-2014 16:58  1.6M  
[TXT] Farnell-LT6233-Linea..> 18-Jul-2014 16:56  1.3M  
[TXT] Farnell-LUMINARY-MIC..> 22-Jul-2014 12:31  3.6M  
[TXT] Farnell-LUXEON-Guide..> 11-Mar-2014 07:52  2.3M  
[TXT] Farnell-Leaded-Trans..> 23-Jun-2014 10:26  3.2M  
[TXT] Farnell-Les-derniers..> 11-Mar-2014 07:50  2.3M  
[TXT] Farnell-Loctite3455-..> 25-Mar-2014 08:16  3.0M  
[TXT] Farnell-Low-Noise-24..> 06-Jul-2014 10:05  1.0M  
[TXT] Farnell-Low-cost-Enc..> 13-Jun-2014 18:42  1.7M  
[TXT] Farnell-Lubrifiant-a..> 26-Mar-2014 18:00  2.7M  
[TXT] Farnell-M68000-PDF.htm  09-Jul-2015 11:22  1.7M  
[TXT] Farnell-MAX200-MAX20..> 09-Jul-2015 11:16  2.2M  
[TXT] Farnell-MAX202E-MAX2..> 09-Jul-2015 11:15  2.2M  
[TXT] Farnell-MAX232-MAX23..> 08-Jul-2014 18:52  2.3M  
[TXT] Farnell-MAX481-MAX48..> 09-Jul-2015 11:16  2.1M  
[TXT] Farnell-MAX756-MAX75..> 09-Jul-2015 11:16  2.2M  
[TXT] Farnell-MAX1365-MAX1..> 18-Jul-2014 16:56  1.4M  
[TXT] Farnell-MAX3221-Rev-..> 08-Sep-2014 07:28  1.8M  
[TXT] Farnell-MAX3222-MAX3..> 09-Jul-2015 11:16  2.1M  
[TXT] Farnell-MAX4661-MAX4..> 09-Sep-2014 08:10  2.8M  
[TXT] Farnell-MB85RS128B-F..> 20-Dec-2014 09:38  1.1M  
[TXT] Farnell-MC3510-PDF.htm  25-Mar-2014 08:17  3.0M  
[TXT] Farnell-MC21605-PDF.htm 15-Jan-2016 11:02  2.8M  
[TXT] Farnell-MC34063ABD-T..> 13-Oct-2014 07:06  844K  
[TXT] Farnell-MCF532x-7x-E..> 29-Mar-2014 11:14  2.8M  
[TXT] Farnell-MCOC1-Farnel..> 16-Jul-2014 09:04  1.0M  
[TXT] Farnell-MCP3421-Micr..> 18-Jul-2014 17:00  1.2M  
[TXT] Farnell-MIC809-MIC81..> 09-Jul-2015 11:13  2.4M  
[TXT] Farnell-MICREL-KSZ88..> 11-Mar-2014 07:54  2.2M  
[TXT] Farnell-MICROCHIP-PI..> 19-Mar-2014 18:02  2.5M  
[TXT] Farnell-MICROCHIP-PI..> 25-Jul-2014 12:34  6.7M  
[TXT] Farnell-MIDAS-un-tra..> 15-Jul-2014 17:05  1.0M  
[TXT] Farnell-MMBZxVCL-MMB..> 20-Dec-2014 09:53  1.6M  
[TXT] Farnell-MOLEX-39-00-..> 10-Mar-2014 17:19  1.9M  
[TXT] Farnell-MOLEX-43020-..> 10-Mar-2014 17:21  1.9M  
[TXT] Farnell-MOLEX-43160-..> 10-Mar-2014 17:21  1.9M  
[TXT] Farnell-MOLEX-87439-..> 10-Mar-2014 17:21  1.9M  
[TXT] Farnell-MPXV7002-Rev..> 20-Mar-2014 17:33  2.8M  
[TXT] Farnell-MSP-EXP430F5..> 29-Jul-2014 10:31  1.2M  
[TXT] Farnell-MSP430-Hardw..> 29-Jul-2014 10:36  1.1M  
[TXT] Farnell-MSP430F15x-M..> 08-Sep-2014 07:32  1.3M  
[TXT] Farnell-MTX-3250-MTX..> 18-Jul-2014 17:01  2.5M  
[TXT] Farnell-MTX-Compact-..> 18-Jul-2014 17:01  2.5M  
[TXT] Farnell-MULTICOMP-Ra..> 22-Jul-2014 12:57  5.9M  
[TXT] Farnell-MX670-MX675-..> 14-Jun-2014 09:46  2.5M  
[TXT] Farnell-Maxim-MAX322..> 09-Jul-2015 11:17  2.1M  
[TXT] Farnell-Microchip-MC..> 13-Jun-2014 18:27  1.8M  
[TXT] Farnell-Microship-PI..> 11-Mar-2014 07:53  2.2M  
[TXT] Farnell-Midas-Active..> 14-Jun-2014 18:17  3.4M  
[TXT] Farnell-Midas-MCCOG4..> 14-Jun-2014 18:11  2.1M  
[TXT] Farnell-Mini-Fit-Jr-..> 18-Jul-2014 17:03  2.5M  
[TXT] Farnell-Miniature-Ci..> 26-Mar-2014 17:55  2.8M  
[TXT] Farnell-Mistral-PDF.htm 14-Jun-2014 18:12  2.1M  
[TXT] Farnell-Molex-83421-..> 14-Jun-2014 18:17  3.4M  
[TXT] Farnell-Molex-COMMER..> 14-Jun-2014 18:16  3.4M  
[TXT] Farnell-Molex-Crimp-..> 10-Mar-2014 16:27  1.7M  
[TXT] Farnell-Multi-Functi..> 20-Mar-2014 17:38  3.0M  
[TXT] Farnell-NA555-NE555-..> 08-Jul-2014 18:53  2.2M  
[TXT] Farnell-NA555-NE555-..> 08-Sep-2014 07:51  1.5M  
[TXT] Farnell-NE556-SA556-..> 11-Oct-2014 15:48  1.7M  
[TXT] Farnell-NE5532-Texas..> 29-Jul-2014 10:32  1.5M  
[TXT] Farnell-NT3H1101-NT3..> 20-Dec-2014 10:06  2.3M  
[TXT] Farnell-NTE_SEMICOND..> 11-Mar-2014 07:52  2.3M  
[TXT] Farnell-NVE-datashee..> 28-Jul-2014 17:12  6.5M  
[TXT] Farnell-NXP-74VHC126..> 10-Mar-2014 16:17  1.6M  
[TXT] Farnell-NXP-BT136-60..> 11-Mar-2014 07:52  2.3M  
[TXT] Farnell-NXP-PBSS9110..> 10-Mar-2014 17:21  1.9M  
[TXT] Farnell-NXP-PCA9555 ..> 11-Mar-2014 07:54  2.2M  
[TXT] Farnell-NXP-PMBFJ620..> 10-Mar-2014 16:16  1.7M  
[TXT] Farnell-NXP-PSMN1R7-..> 10-Mar-2014 16:17  1.6M  
[TXT] Farnell-NXP-PSMN7R0-..> 10-Mar-2014 17:19  2.1M  
[TXT] Farnell-NXP-TEA1703T..> 11-Mar-2014 08:15  2.8M  
[TXT] Farnell-NaPiOn-Panas..> 06-Jul-2014 10:02  911K  
[TXT] Farnell-Nilfi-sk-E-..> 14-Jun-2014 09:47  2.5M  
[TXT] Farnell-Novembre-201..> 20-Mar-2014 17:38  3.3M  
[TXT] Farnell-OMRON-INDUST..> 25-Jul-2014 12:31  6.9M  
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[TXT] Farnell-OMRON-Master..> 10-Mar-2014 16:26  1.8M  
[TXT] Farnell-OPA627-Texas..> 09-Sep-2014 08:08  2.8M  
[TXT] Farnell-OSLON-SSL-Ce..> 19-Mar-2014 18:03  2.1M  
[TXT] Farnell-OXPCIE958-FB..> 13-Jun-2014 18:40  1.8M  
[TXT] Farnell-Octal-D-type..> 03-Jun-2015 18:10  2.5M  
[TXT] Farnell-Octal-Genera..> 28-Jul-2014 17:42  2.8M  
[TXT] Farnell-PADO-semi-au..> 04-Jul-2014 10:41  3.7M  
[TXT] Farnell-PBSS5160T-60..> 19-Mar-2014 18:03  2.1M  
[TXT] Farnell-PBSS5320X-NX..> 20-Dec-2014 09:47  1.6M  
[TXT] Farnell-PCF8574-PCF8..> 16-Jul-2014 09:03  1.7M  
[TXT] Farnell-PDTA143X-ser..> 20-Mar-2014 08:12  2.6M  
[TXT] Farnell-PDTB123TT-NX..> 20-Dec-2014 09:39  1.0M  
[TXT] Farnell-PESD5V0F1BL-..> 20-Dec-2014 09:39  1.1M  
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[TXT] Farnell-PESD9X5.0L-P..> 13-Jun-2014 18:43  1.6M  
[TXT] Farnell-PIC12F529T39..> 20-Dec-2014 09:39  1.0M  
[TXT] Farnell-PIC12F609-61..> 04-Jul-2014 10:41  3.7M  
[TXT] Farnell-PIC18F1220-1..> 20-Dec-2014 16:53  7.5M  
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 2011 - 2014 Microchip Technology Inc. DS00001725B-page 1 Features • High Speed USB Mux for multiplexing the USB lanes between different functions - Switch the USB connector between two different functions - Up to 1GHz Bandwidth • USB Port ESD Protection (DP/DM) - ±15kV (air discharge) - ±15kV (contact discharge) - IEC 61000-4-2 level 4 ESD protection without external devices • flexPWRTM Technology - 30nA Active/Standby Current - Extremely low power design ideal for battery powered applications • Control inputs accommodate 1.8V to 5V inputs • DP/DM tolerate up to 5.5V • Industrial Operating Temperature -40°C to +85°C • 10 pin, QFN, RoHS compliant package; (1.3mm x 1.8mm x 0.55mm height, 0.4mm pitch) • 10 pin, QFN, RoHS compliant package; (1.6mm x 2.1mm x 0.55mm height, 0.5mm pitch) Block Diagram OE_N S DP DM ESD Protection HS USB Switch DM_2 DP_2 USB Connector USB 2.0 PHY, Processor, or Accessory Processor GND DM_1 DP_1 USB 2.0 PHY, Processor, or Accessory DP DM DP DM USB3740B VDD VDD ESD Protection USB3740B High Speed USB 2.0 Switch with ESD Protection and Low Standby Current USB3740B DS00001725B-page 2  2011 - 2014 Microchip Technology Inc. TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.  2011 - 2014 Microchip Technology Inc. DS00001725B-page 3 USB3740B Table of Contents 1.0 General Description ........................................................................................................................................................................ 4 2.0 Pin Layout ....................................................................................................................................................................................... 5 3.0 Electrical Specifications .................................................................................................................................................................. 6 4.0 General Operation .......................................................................................................................................................................... 7 5.0 Application Notes ............................................................................................................................................................................ 8 6.0 Package Outlines ............................................................................................................................................................................ 9 The Microchip Web Site ...................................................................................................................................................................... 12 Customer Change Notification Service ............................................................................................................................................... 12 Customer Support ............................................................................................................................................................................... 12 Product Identification System ............................................................................................................................................................. 13 USB3740B DS00001725B-page 4  2011 - 2014 Microchip Technology Inc. 1.0 GENERAL DESCRIPTION The USB3740B is a USB 2.0 compliant High Speed switch that provides robust ESD protection to the interface in an extremely small package. Outstanding ESD robustness eliminates the need for external ESD protection devices to save eBOM cost and PCB area. The high bandwidth capabilities of the USB3740B enable extremely low high frequency loss and an exceptionally clean USB 2.0 High Speed eye diagram. 1.1 Reference Document Universal Serial Bus Specification, Revision 2.0 FIGURE 1-1: USB3740B USB 2.0 HIGH SPEED EYE DIAGRAM Input to Switch Output of Switch  2011 - 2014 Microchip Technology Inc. DS00001725B-page 5 USB3740B 2.0 PIN LAYOUT 2.1 Pin Diagram The USB3740B is available in both a 0.4mm pitch QFN (1.3mm x 1.8mm) and 0.5mm pitch QFN (1.55mm x 2.05mm) package. 2.2 Ball/Pin Definitions The following table details the ball/pin definitions for the package diagram above. FIGURE 2-1: USB3740B PACKAGE DIAGRAM Pin Name Type/ Direction Description 10 DP Analog USB Mux Output 9 DM Analog 2 DP_1 Analog USB Mux Input 1 1 DM_1 Analog 6 DP_2 Analog USB Mux Input 2 7 DM_2 Analog 8 GND Analog Ground 5 VDD Analog Power 4 S Digital Input Switch control. Refer to Table 4-1. 3 OE_N Digital Input Active low switch Output Enable. Refer to Table 4-1. DP_2 S OE_N DP VDD GND DM_2 3 4 5 6 7 10 9 8 2 1 DM DP_1 DM_1 USB3740B DS00001725B-page 6  2011 - 2014 Microchip Technology Inc. 3.0 ELECTRICAL SPECIFICATIONS 3.1 Absolute Maximum Ratings Stresses beyond the Absolute Maximum Ratings may damage the USB3740B. 3.2 Electrical Specifications TABLE 3-1: ABSOLUTE MAXIMUM RATINGS Description Rating Unit VDD Voltage to GND -0.3 to 6.0 V Any other pin to GND -0.3 to VDD+0.5 V Operating Temperature Range -40 to +85 C Storage Temperature Range -55 to +150 C ESD Rating HBM (JESD 22) 8,000 V HBM (Pin to Ground) 8,000 V IEC-61000-4-2 15,000 (Air) 15,000 (Contact) V TABLE 3-2: ELECTRICAL SPECIFICATIONS Characteristic Symbol MIN TYP MAX Units Conditions VDD = 5.0V, TA = -40C to 85C, all typical values at TA = 25C unless otherwise noted. VDD Recommended Operating Conditions Input Voltage VDD 3.0 5.5 V Active/Standby IDD 30 175 nA USB Mux Characteristics USB Mux On Resistance RON_USB 1 2 5 ohm 0V < Vin < 3.3V 1 2 2.5 0V < Vin < 0.4V USB Mux Off Leakage IOFF_USB 100 200 nA 0V < Vin < 3.3V On Capacitance CON_USB 5 7 pF VDD = 3V Off Capacitance COFF_USB 3 4 pF VDD = 3V Off Isolation -30 -32 -40 dB RL = 50 ohm, F = 250MHz Crosstalk -30 -45 -60 dB RL = 50 ohm, F = 250MHz Bandwidth (-3dB) BW 950 1000 1100 MHz RL = 50 ohm, CL = 0pF 850 950 980 RL = 50 ohm, CL = 5pF 530 560 600 RL = 50 ohm, CL = 10pF Control Signal Characteristics Input Logic High Threshold VIN_H 1.4 V Input Logic Low Threshold VIN_L 0.4 V  2011 - 2014 Microchip Technology Inc. DS00001725B-page 7 USB3740B 4.0 GENERAL OPERATION The USB3740B is a high bandwidth switch suitable for many applications, including High Speed USB. The mux allows high speed signals to pass through and still meet HS USB signaling requirements. The USB3740B will protect the system from ESD stress events on all DP and DM pins. The USB3740B provides ESD protection to the IEC-61000 ESD specification. The USB mux is designed to pass High Speed USB signals to the USB connector, and allows for two USB inputs to be multiplexed into one USB output. The USB Mux is designed to pass USB signals from 0 to VDD. It is not designed to pass signals that go above VDD or below ground. The USB3740B switches are controlled by the digital signals OE_N and S, as shown in Table 4-1. TABLE 4-1: USB3740B SWITCH STATES DEFINITION OE_N S Switch State 1 X STANDBY: • Both switch paths disconnected. • Lowest power state 0 0 DP = DP1, DM = DM1: 0 1 DP = DP2, DM = DM2: USB3740B DS00001725B-page 8  2011 - 2014 Microchip Technology Inc. 5.0 APPLICATION NOTES 5.1 ESD Performance The USB3740B is protected from ESD strikes. By eliminating the requirement for external ESD protection devices, board space is conserved, and the board manufacturer is enabled to reduce cost. The advanced ESD structures integrated into the USB3740B protect the device whether or not it is powered up. 5.1.1 HUMAN BODY MODEL (HBM) PERFORMANCE HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and manufacturing, and is done without power applied to the IC. To pass the test, the device must have no change in operation or performance due to the event. The USB3740B HBM performance is detailed in Table 3-1. 5.1.2 EN/IEC 61000-4-2 PERFORMANCE The EN/IEC 61000-4-2 ESD specification is an international standard that addresses system-level immunity to ESD strikes while the end equipment is operational. In contrast, the HBM ESD tests are performed at the device level with the device powered down. Microchip contracts with Independent laboratories to test the USB3740B to EN/IEC 61000-4-2 in a working system. Reports are available upon request. Please contact your Microchip representative, and request information on 3rd party ESD test results. The reports show that systems designed with the USB3740B can safely provide the ESD performance shown in Table 3-1 without additional board level protection. In addition to defining the ESD tests, EN/IEC 61000-4-2 also categorizes the impact to equipment operation when the strike occurs (ESD Result Classification). The USB3740B maintains an ESD Result Classification 1 or 2 when subjected to an EN/IEC 61000-4-2 (level 4) ESD strike. Both air discharge and contact discharge test techniques for applying stress conditions are defined by the EN/IEC 61000-4-2 ESD document. 5.1.2.1 Air Discharge To perform this test, a charged electrode is moved close to the system being tested until a spark is generated. This test is difficult to reproduce because the discharge is influenced by such factors as humidity, the speed of approach of the electrode, and construction of the test equipment. 5.1.2.2 Contact Discharge The uncharged electrode first contacts the USB connector to prepare this test, and then the probe tip is energized. This yields more repeatable results, and is the preferred test method. The independent test laboratories contracted by Microchip provide test results for both types of discharge methods.  2011 - 2014 Microchip Technology Inc. DS00001725B-page 9 USB3740B 6.0 PACKAGE OUTLINES Note: For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging. FIGURE 6-1: 10 PIN, 1.3MM X 1.8MM QFN PACKAGE OUTLINE USB3740B DS00001725B-page 10  2011 - 2014 Microchip Technology Inc. FIGURE 6-2: 10 PIN, 1.6MM X 2.1MM QFN PACKAGE OUTLINE  2011 - 2014 Microchip Technology Inc. DS00001725B-page 11 USB3740B APPENDIX A: DATA SHEET REVISION HISTORY TABLE A-1: REVISION HISTORY Revision Section/Figure/Entry Correction DS00001725B (08-21-14) Document is converted to Microchip template; Product Identification System page replaces Ordering Information. DS00001725A replaces the previous SMSC version, Rev. 1.2 Title changed from “High Speed Switch for Mobile and Portable Applications” to “High Speed USB 2.0 Switch with ESD Protection and Low Standby Current” Rev. 1.2 (07-30-12) Table 3-1, “Absolute Maximum Ratings,” on page 6 Corrected “Any other pin to GND” row’s rating to “- 0.3 to VDD+0.5V” Rev. 1.1 (12-15-11) Section 2.2, "Ball/Pin Definitions" In Section 2.2, changed the description of Pin #8 as follows: “Ground” Rev. 1.0 (08-03-11) Data Sheet Release USB3740B DS00001725B-page 12  2011 - 2014 Microchip Technology Inc. THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support  2011 - 2014 Microchip Technology Inc. DS00001725B-page 13 USB3740B PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XXX Device Package Device: USB3740B Package: AI2 = 10-pin QFN (1.3mm x 1.8mm) AI9 = 10-pin QFN (1.6mm x 2.1mm) Tape and Reel Option: Blank = Tray packaging TR = Tape and Reel Examples: a) USB3740B-AI2-TR 10-pin QFN RoHS Compliant package (1.3mm x 1.8mm) Tape & Reel b) USB3740B-AI9-TR 10-pin QFN RoHS Compliant package (1.6mm x 2.1mm) Tape & Reel [X](1) Tape and Reel Option - Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. Reel size is 4,000. - DS00001725B-page 14  2011 - 2014 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2011 - 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 9781632765369 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS00001725B-page 15  2011 - 2014 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Worldwide Sales and Service 03/25/14 © 2006 Microchip Technology Inc. DS70046E dsPIC30F Family Reference Manual High-Performance Digital Signal Controllers DS70046E-page ii © 2006 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 70046E-page iii PAGE M SECTION 1. INTRODUCTION 1-1 Introduction ...................................................................................................................................................... 1-2 Manual Objective ............................................................................................................................................. 1-2 Device Structure ............................................................................................................................................... 1-3 Development Support ...................................................................................................................................... 1-4 Style and Symbol Conventions ........................................................................................................................ 1-4 Related Documents ..........................................................................................................................................1-6 Revision History ............................................................................................................................................... 1-7 SECTION 2. CPU 2-1 Introduction ...................................................................................................................................................... 2-2 Programmer’s Model ........................................................................................................................................ 2-4 Software Stack Pointer .....................................................................................................................................2-8 CPU Register Descriptions ............................................................................................................................. 2-11 Arithmetic Logic Unit (ALU) ............................................................................................................................ 2-17 DSP Engine .................................................................................................................................................... 2-18 Divide Support ................................................................................................................................................ 2-27 Instruction Flow Types ...................................................................................................................................2-27 Loop Constructs ............................................................................................................................................. 2-30 Address Register Dependencies .................................................................................................................... 2-35 Register Maps ................................................................................................................................................ 2-38 Related Application Notes ..............................................................................................................................2-40 Revision History ............................................................................................................................................. 2-41 SECTION 3. DATA MEMORY 3-1 Introduction ...................................................................................................................................................... 3-2 Data Space Address Generator Units (AGUs) ................................................................................................. 3-5 Modulo Addressing ..........................................................................................................................................3-7 Bit-Reversed Addressing ............................................................................................................................... 3-14 Control Register Descriptions ......................................................................................................................... 3-18 Related Application Notes ..............................................................................................................................3-23 Revision History ............................................................................................................................................. 3-24 SECTION 4. PROGRAM MEMORY 4-1 Program Memory Address Map ....................................................................................................................... 4-2 Program Counter .............................................................................................................................................. 4-4 Data Access from Program Memory ................................................................................................................ 4-4 Program Space Visibility from Data Space ...................................................................................................... 4-8 Program Memory Writes ................................................................................................................................ 4-10 PSV Code Examples ...................................................................................................................................... 4-11 Related Application Notes ..............................................................................................................................4-12 Revision History ............................................................................................................................................. 4-13 Table of Contents 70046E-page iv © 2006 Microchip Technology Inc. PAGE M SECTION 5. FLASH AND EEPROM PROGRAMMING 5-1 Introduction ...................................................................................................................................................... 5-2 Table Instruction Operation .............................................................................................................................. 5-2 Control Registers ............................................................................................................................................. 5-5 Run-Time Self-Programming (RTSP) .............................................................................................................5-10 Data EEPROM Programming ........................................................................................................................ 5-15 Design Tips .................................................................................................................................................... 5-21 Related Application Notes ..............................................................................................................................5-22 Revision History ............................................................................................................................................. 5-23 SECTION 6. RESET INTERRUPTS 6-1 Introduction ...................................................................................................................................................... 6-2 Non-Maskable Traps ........................................................................................................................................ 6-6 Interrupt Processing Timing ........................................................................................................................... 6-11 Interrupt Control and Status Registers ........................................................................................................... 6-14 Interrupt Setup Procedures ............................................................................................................................ 6-42 Design Tips .................................................................................................................................................... 6-44 Related Application Notes ..............................................................................................................................6-45 Revision History ............................................................................................................................................. 6-46 SECTION 7. OSCILLATOR 7-1 Introduction ...................................................................................................................................................... 7-2 Device Clocking and MIPS ............................................................................................................................... 7-5 Oscillator Configuration .................................................................................................................................... 7-6 Oscillator Control Registers – OSCCON and OSCTUN .................................................................................7-13 Primary Oscillator ........................................................................................................................................... 7-20 Crystal Oscillators/Ceramic Resonators ......................................................................................................... 7-22 Determining Best Values for Crystals, Clock Mode, C1, C2 and Rs .............................................................. 7-24 External Clock Input ....................................................................................................................................... 7-25 External RC Oscillator .................................................................................................................................... 7-26 Phase Locked Loop (PLL) ..............................................................................................................................7-30 Low-Power 32 kHz Crystal Oscillator .............................................................................................................7-31 Oscillator Start-up Timer (OST) ...................................................................................................................... 7-31 Internal Fast RC Oscillator (FRC) .................................................................................................................. 7-31 Internal Low-Power RC (LPRC) Oscillator ..................................................................................................... 7-32 Fail-Safe Clock Monitor (FSCM) .................................................................................................................... 7-32 Programmable Oscillator Postscaler .............................................................................................................. 7-33 Clock Switching Operation ............................................................................................................................. 7-34 Design Tips .................................................................................................................................................... 7-38 Related Application Notes ..............................................................................................................................7-39 Revision History ............................................................................................................................................. 7-40 Table of Contents © 2006 Microchip Technology Inc. 70046E-page v PAGE M SECTION 8. RESET 8-1 Introduction ...................................................................................................................................................... 8-2 Clock Source Selection at Reset ...................................................................................................................... 8-5 POR: Power-on Reset ...................................................................................................................................... 8-5 External Reset (EXTR) .....................................................................................................................................8-7 Software RESET Instruction (SWR) ................................................................................................................. 8-7 Watchdog Time-out Reset (WDTR) ................................................................................................................. 8-7 Brown-out Reset (BOR) ................................................................................................................................... 8-8 Using the RCON Status Bits .......................................................................................................................... 8-10 Device Reset Times ....................................................................................................................................... 8-11 Device Start-up Time Lines ............................................................................................................................ 8-13 Special Function Register Reset States ......................................................................................................... 8-16 Design Tips .................................................................................................................................................... 8-17 Related Application Notes ..............................................................................................................................8-18 Revision History ............................................................................................................................................. 8-19 SECTION 9. LOW VOLTAGE DETECT (LVD) 9-1 Introduction ...................................................................................................................................................... 9-2 LVD Operation ................................................................................................................................................. 9-5 Design Tips ...................................................................................................................................................... 9-6 Related Application Notes ................................................................................................................................9-7 Revision History ............................................................................................................................................... 9-8 SECTION 10. WATCHDOG TIMER AND POWER SAVING MODES 10-1 Introduction .................................................................................................................................................... 10-2 Power Saving Modes ..................................................................................................................................... 10-2 Sleep Mode .................................................................................................................................................... 10-2 Idle Mode ....................................................................................................................................................... 10-4 Interrupts Coincident with Power Save Instructions .......................................................................................10-5 Watchdog Timer ............................................................................................................................................. 10-6 Peripheral Module Disable (PMD) Registers ..................................................................................................10-9 Design Tips .................................................................................................................................................. 10-10 Related Application Notes ............................................................................................................................ 10-11 Revision History ........................................................................................................................................... 10-12 SECTION 11. I/O PORTS 11-1 Introduction .................................................................................................................................................... 11-2 I/O Port Control Registers ..............................................................................................................................11-3 Peripheral Multiplexing ...................................................................................................................................11-4 Port Descriptions ............................................................................................................................................ 11-6 Change Notification (CN) Pins ....................................................................................................................... 11-7 CN Operation in Sleep and Idle Modes .......................................................................................................... 11-8 Related Application Notes ............................................................................................................................ 11-11 Revision History ........................................................................................................................................... 11-12 Table of Contents 70046E-page vi © 2006 Microchip Technology Inc. PAGE M SECTION 12. TIMERS 12-1 Introduction .................................................................................................................................................... 12-2 Timer Variants ................................................................................................................................................ 12-3 Control Registers ........................................................................................................................................... 12-6 Modes of Operation ........................................................................................................................................12-9 Timer Prescalers .......................................................................................................................................... 12-14 Timer Interrupts ............................................................................................................................................ 12-14 Reading and Writing 16-bit Timer Module Registers .................................................................................... 12-15 Low Power 32 kHz Crystal Oscillator Input .................................................................................................. 12-15 32-bit Timer Configuration ............................................................................................................................ 12-16 32-bit Timer Modes of Operation ................................................................................................................. 12-18 Reading and Writing into 32-bit Timers ........................................................................................................ 12-21 Timer Operation in Power Saving States ..................................................................................................... 12-21 Peripherals Using Timer Modules ................................................................................................................ 12-22 Design Tips .................................................................................................................................................. 12-24 Related Application Notes ............................................................................................................................ 12-25 Revision History ........................................................................................................................................... 12-26 SECTION 13. INPUT CAPTURE 13-1 Introduction .................................................................................................................................................... 13-2 Input Capture Registers ................................................................................................................................. 13-3 Timer Selection ..............................................................................................................................................13-4 Input Capture Event Modes ........................................................................................................................... 13-4 Capture Buffer Operation ............................................................................................................................... 13-8 Input Capture Interrupts ................................................................................................................................. 13-9 UART Autobaud Support ............................................................................................................................... 13-9 Input Capture Operation in Power Saving States ........................................................................................ 13-10 I/O Pin Control .............................................................................................................................................. 13-10 Special Function Registers Associated with the Input Capture Module ....................................................... 13-11 Design Tips .................................................................................................................................................. 13-12 Related Application Notes ............................................................................................................................ 13-13 Revision History ........................................................................................................................................... 13-14 SECTION 14. OUTPUT COMPARE 14-1 Introduction .................................................................................................................................................... 14-2 Output Compare Registers ............................................................................................................................ 14-3 Modes of Operation ........................................................................................................................................14-4 Output Compare Operation in Power Saving States .................................................................................... 14-23 I/O Pin Control .............................................................................................................................................. 14-23 Design Tips .................................................................................................................................................. 14-26 Related Application Notes ............................................................................................................................ 14-27 Revision History ........................................................................................................................................... 14-28 Table of Contents © 2006 Microchip Technology Inc. 70046E-page vii PAGE M SECTION 15. MOTOR CONTROL PWM 15-1 Introduction .................................................................................................................................................... 15-2 Control Registers ........................................................................................................................................... 15-4 PWM Time Base .......................................................................................................................................... 15-16 PWM Duty Cycle Comparison Units ............................................................................................................. 15-20 Complementary PWM Output Mode ............................................................................................................ 15-26 Dead Time Control ....................................................................................................................................... 15-27 Independent PWM Output Mode .................................................................................................................. 15-30 PWM Output Override .................................................................................................................................. 15-31 PWM Output and Polarity Control ................................................................................................................ 15-34 PWM Fault Pins ........................................................................................................................................... 15-34 PWM Update Lockout .................................................................................................................................. 15-37 PWM Special Event Trigger ......................................................................................................................... 15-38 Operation in Device Power Saving Modes ................................................................................................... 15-38 Special Features for Device Emulation ........................................................................................................ 15-39 Related Application Notes ............................................................................................................................ 15-42 Revision History ........................................................................................................................................... 15-43 SECTION 16. QUADRATURE ENCODER INTERFACE (QEI) 16-1 Module Introduction ........................................................................................................................................16-2 Control and Status Registers ......................................................................................................................... 16-4 Programmable Digital Noise Filters ................................................................................................................ 16-9 Quadrature Decoder .................................................................................................................................... 16-10 16-bit Up/Down Position Counter ................................................................................................................. 16-12 Using QEI as an Alternate 16-bit Timer/Counter .......................................................................................... 16-16 Quadrature Encoder Interface Interrupts ..................................................................................................... 16-17 I/O Pin Control .............................................................................................................................................. 16-18 QEI Operation During Power Saving Modes ................................................................................................ 16-19 Effects of a Reset ......................................................................................................................................... 16-19 Design Tips .................................................................................................................................................. 16-21 Related Application Notes ............................................................................................................................ 16-22 Revision History ........................................................................................................................................... 16-23 Table of Contents 70046E-page viii © 2006 Microchip Technology Inc. PAGE M SECTION 17. 10-BIT A/D CONVERTER 17-1 Introduction .................................................................................................................................................... 17-2 Control Registers ........................................................................................................................................... 17-4 A/D Result Buffer ........................................................................................................................................... 17-4 A/D Terminology and Conversion Sequence ............................................................................................... 17-11 A/D Module Configuration ............................................................................................................................ 17-13 Selecting the Voltage Reference Source ..................................................................................................... 17-13 Selecting the A/D Conversion Clock ............................................................................................................ 17-13 Selecting Analog Inputs for Sampling .......................................................................................................... 17-14 Enabling the Module .................................................................................................................................... 17-16 Specifying the Sample/Conversion Sequence ............................................................................................. 17-16 How to Start Sampling ................................................................................................................................. 17-17 How to Stop Sampling and Start Conversions ............................................................................................. 17-18 Controlling Sample/Conversion Operation ................................................................................................... 17-29 Specifying How Conversion Results are Written Into the Buffer .................................................................. 17-30 Conversion Sequence Examples ................................................................................................................. 17-31 A/D Sampling Requirements ........................................................................................................................ 17-45 Reading the A/D Result Buffer ..................................................................................................................... 17-46 Transfer Function ......................................................................................................................................... 17-47 A/D Accuracy/Error ...................................................................................................................................... 17-47 Connection Considerations .......................................................................................................................... 17-47 Initialization .................................................................................................................................................. 17-48 A/D Conversion Speeds ............................................................................................................................... 17-49 Operation During Sleep and Idle Modes ...................................................................................................... 17-55 Effects of a Reset ......................................................................................................................................... 17-55 Special Function Registers Associated with the 10-bit A/D Converter ......................................................... 17-56 Design Tips .................................................................................................................................................. 17-57 Related Application Notes ............................................................................................................................ 17-58 Revision History ........................................................................................................................................... 17-59 Table of Contents © 2006 Microchip Technology Inc. 70046E-page ix PAGE M SECTION 18. 12-BIT A/D CONVERTER 18-1 Introduction .................................................................................................................................................... 18-2 Control Registers ........................................................................................................................................... 18-4 A/D Result Buffer ........................................................................................................................................... 18-4 A/D Terminology and Conversion Sequence ............................................................................................... 18-10 A/D Module Configuration ............................................................................................................................ 18-11 Selecting the Voltage Reference Source ..................................................................................................... 18-11 Selecting the A/D Conversion Clock ............................................................................................................ 18-12 Selecting Analog Inputs for Sampling .......................................................................................................... 18-12 Enabling the Module .................................................................................................................................... 18-14 How to Start Sampling ................................................................................................................................. 18-14 How to Stop Sampling and Start Conversions ............................................................................................. 18-14 Controlling Sample/Conversion Operation ................................................................................................... 18-19 Specifying How Conversion Results are Written into the Buffer .................................................................. 18-19 Conversion Sequence Examples ................................................................................................................. 18-21 A/D Sampling Requirements ........................................................................................................................ 18-26 Reading the A/D Result Buffer ..................................................................................................................... 18-27 Transfer Function ......................................................................................................................................... 18-28 A/D Accuracy/Error ...................................................................................................................................... 18-28 Connection Considerations .......................................................................................................................... 18-28 Initialization .................................................................................................................................................. 18-29 A/D Conversion Speeds ............................................................................................................................... 18-30 Operation During Sleep and Idle Modes ...................................................................................................... 18-33 Effects of a Reset ......................................................................................................................................... 18-33 Special Function Registers Associated with the 12-bit A/D Converter ......................................................... 18-34 Design Tips .................................................................................................................................................. 18-35 Related Application Notes ............................................................................................................................ 18-36 Revision History ........................................................................................................................................... 18-37 SECTION 19. UART 19-1 Introduction .................................................................................................................................................... 19-2 Control Registers ........................................................................................................................................... 19-3 UART Baud Rate Generator (BRG) ............................................................................................................... 19-8 UART Configuration ..................................................................................................................................... 19-10 UART Transmitter ........................................................................................................................................ 19-11 UART Receiver ............................................................................................................................................ 19-14 Using the UART for 9-bit Communication .................................................................................................... 19-18 Receiving Break Characters ........................................................................................................................ 19-19 Initialization .................................................................................................................................................. 19-20 Other Features of the UART ........................................................................................................................ 19-21 UART Operation During CPU Sleep and Idle Modes ................................................................................... 19-21 Registers Associated with UART Module ..................................................................................................... 19-22 Design Tips .................................................................................................................................................. 19-23 Related Application Notes ............................................................................................................................ 19-24 Revision History ........................................................................................................................................... 19-25 Table of Contents 70046E-page x © 2006 Microchip Technology Inc. PAGE M SECTION 20. SERIAL PERIPHERAL INTERFACE (SPI™) 20-1 Introduction .................................................................................................................................................... 20-2 Status and Control Registers ......................................................................................................................... 20-4 Modes of Operation ........................................................................................................................................20-7 SPI Master Mode Clock Frequency .............................................................................................................. 20-19 Operation in Power Save Modes ................................................................................................................. 20-20 Special Function Registers Associated with SPI Modules ........................................................................... 20-22 Related Application Notes ............................................................................................................................ 20-23 Revision History ........................................................................................................................................... 20-24 SECTION 21. INTER-INTEGRATED CIRCUIT™ (I2C™) 21-1 Overview ........................................................................................................................................................ 21-2 I 2C Bus Characteristics .................................................................................................................................. 21-4 Control and Status Registers ......................................................................................................................... 21-7 Enabling I2C Operation ................................................................................................................................ 21-13 Communicating as a Master in a Single Master Environment ...................................................................... 21-15 Communicating as a Master in a Multi-Master Environment ........................................................................ 21-29 Communicating as a Slave .......................................................................................................................... 21-32 Connection Considerations for I2C Bus ....................................................................................................... 21-47 Module Operation During PWRSAV Instruction ........................................................................................... 21-49 Effects of a Reset ......................................................................................................................................... 21-49 Design Tips .................................................................................................................................................. 21-50 Related Application Notes ............................................................................................................................ 21-51 Revision History ........................................................................................................................................... 21-52 SECTION 22. DATA CONVERTER INTERFACE (DCI) 22-1 Introduction .................................................................................................................................................... 22-2 Control Register Descriptions ......................................................................................................................... 22-2 Codec Interface Basics and Terminology ....................................................................................................... 22-8 DCI Operation .............................................................................................................................................. 22-10 Using the DCI Module .................................................................................................................................. 22-17 Operation in Power Saving Modes ............................................................................................................... 22-28 Registers Associated with DCI ..................................................................................................................... 22-28 Design Tips .................................................................................................................................................. 22-30 Related Application Notes ............................................................................................................................ 22-31 Revision History ........................................................................................................................................... 22-32 Table of Contents © 2006 Microchip Technology Inc. 70046E-page xi PAGE M SECTION 23. CAN MODULE 23-1 Introduction .................................................................................................................................................... 23-2 Control Registers for the CAN Module ........................................................................................................... 23-2 CAN Module Features .................................................................................................................................. 23-28 CAN Module Implementation ....................................................................................................................... 23-29 CAN Module Operation Modes .................................................................................................................... 23-36 Message Reception ..................................................................................................................................... 23-39 Transmission ................................................................................................................................................ 23-49 Error Detection ............................................................................................................................................. 23-58 CAN Baud Rate ............................................................................................................................................ 23-60 Interrupts ...................................................................................................................................................... 23-64 CAN Capture ................................................................................................................................................ 23-65 CAN Module I/O ........................................................................................................................................... 23-65 Operation in CPU Power Saving Modes ...................................................................................................... 23-66 CAN Protocol Overview ............................................................................................................................... 23-68 Related Application Notes ............................................................................................................................ 23-72 Revision History ........................................................................................................................................... 23-73 SECTION 24. DEVICE CONFIGURATION 24-1 Introduction .................................................................................................................................................... 24-2 Device Configuration Registers ...................................................................................................................... 24-2 Configuration Bit Descriptions ........................................................................................................................ 24-6 Device Identification Registers ....................................................................................................................... 24-7 Related Application Notes ..............................................................................................................................24-8 Revision History ............................................................................................................................................. 24-9 SECTION 25. DEVELOPMENT TOOL SUPPORT 25-1 Introduction .................................................................................................................................................... 25-2 Microchip Hardware and Language Tools ...................................................................................................... 25-2 Third Party Hardware/Software Tools and Application Libraries ................................................................... 25-6 dsPIC30F Hardware Development Boards .................................................................................................. 25-11 Related Application Notes ............................................................................................................................ 25-15 Revision History ........................................................................................................................................... 25-16 SECTION 26. APPENDIX 26-1 Table of Contents 70046E-page xii © 2006 Microchip Technology Inc. PAGE M NOTES: Table of Contents © 2004 Microchip Technology Inc. DS70048C-page 1-1 Introduction 1 Section 1. Introduction HIGHLIGHTS This section of the manual contains the following topics: 1.1 Introduction .................................................................................................................... 1-2 1.2 Manual Objective ........................................................................................................... 1-2 1.3 Device Structure............................................................................................................. 1-3 1.4 Development Support ....................................................................................................1-4 1.5 Style and Symbol Conventions ...................................................................................... 1-4 1.6 Related Documents ....................................................................................................... 1-6 1.7 Revision History ............................................................................................................. 1-7 dsPIC30F Family Reference Manual DS70048C-page 1-2 © 2004 Microchip Technology Inc. 1.1 Introduction Microchip is a leading provider of microcontrollers and analog semiconductors. The company’s focus is on products that meet the needs of the embedded control market. We are a leading supplier of: • 8-bit general purpose microcontrollers (PICmicro® MCUs) • dsPIC30F 16-bit microcontrollers • Speciality and standard non-volatile memory devices • Security devices (KEELOQ®) • Application specific standard products Please request a Microchip Product Line Card for a listing of all the interesting products that we have to offer. This literature can be obtained from your local sales office, or downloaded from the Microchip web site (www.microchip.com). 1.2 Manual Objective PICmicro and dsPIC30F devices are grouped by the size of their Instruction Word and Data Path. The current device families are: 1. Base-Line: 12-bit Instruction Word length, 8-bit Data Path 2. Mid-Range: 14-bit Instruction Word length, 8-bit Data Path 3. High-End: 16-bit Instruction Word length, 8-bit Data Path 4. Enhanced: 16-bit Instruction Word length, 8-bit Data Path 5. dsPIC30F: 24-bit Instruction Word length, 16-bit Data Path This manual describes the dsPIC30F 16-bit MCU family of devices. This manual explains the operation of the dsPIC30F MCU family architecture and peripheral modules, but does not cover the specifics of each device. The user should refer to the data sheet for device specific information. The information that can be found in the data sheet includes: • Device memory map • Device pinout and packaging details • Device electrical specifications • List of peripherals included on the device Code examples are given throughout this manual. These examples sometimes need to be written as device specific as opposed to family generic, though they are valid for most other devices. Some modifications may be required for devices with variations in register file mappings. © 2004 Microchip Technology Inc. DS70048C-page 1-3 Section 1. Introduction Introduction 1 1.3 Device Structure Each part of the dsPIC30F device can be placed into one of three groups: 1. CPU Core 2. System Integration 3. Peripherals 1.3.1 CPU Core The CPU core pertains to the basic features that are required to make the device operate. The sections of the manual related to the CPU core include: 1. CPU 2. Data Memory 3. Program Memory 4. DSP Engine 5. Interrupts 1.3.2 System Integration System integration functions help to: • Decrease system cost • Increase system reliability • Increase design flexibility The following sections of the manual discuss dsPIC30F system integration functions: 1. Oscillator 2. Reset 3. Low Voltage Detect 4. Watchdog Timer and Power Saving Modes 5. Flash and EEPROM Programming 6. Device Configuration 1.3.3 Peripherals The dsPIC30F has many peripherals that allow the device to be interfaced to the external world. The peripherals discussed in this manual include: 1. I/O Ports 2. Timers 3. Input Capture Module 4. Output Compare Module 5. Quadrature Encoder Interface (QEI) 6. 10-bit A/D Converter 7. 12-bit A/D Converter 8. UART Module 9. SPITM Module 10. I2CTM Module 11. Data Converter Interface (DCI) Module 12. CAN Module 1.3.4 Memory Technology At the time of this writing, all dsPIC30F devices use Flash program memory technology. The Flash program memory can be electrically erased or programmed. dsPIC30F Family Reference Manual DS70048C-page 1-4 © 2004 Microchip Technology Inc. 1.4 Development Support Microchip offers a wide range of development tools that allow users to efficiently develop and debug application code. Microchip’s development tools can be broken down into four categories: 1. Code generation 2. Hardware/Software debug 3. Device programmer 4. Product evaluation boards A full description of each of Microchip’s development tools is discussed in Section 25. “Development Tool Support”. As new tools are developed, the latest product briefs and user guides can be obtained from the Microchip web site (www.microchip.com) or from your local Microchip Sales Office. Microchip offers other reference tools to speed the development cycle. These include: • Application Notes • Reference Designs • Microchip web site • Local Sales Offices with Field Application Support • Corporate Support Line The Microchip web site lists other sites that may be useful references. 1.5 Style and Symbol Conventions Throughout this document, certain style and font format conventions are used. Most format conventions imply a distinction should be made for the emphasized text. The MCU industry has many symbols and non-conventional word definitions/abbreviations. Table 1-1 provides a description for many of the conventions contained in this document. Located at the rear of this document, a glossary provides additional word and abbreviation definitions used throughout this manual. © 2004 Microchip Technology Inc. DS70048C-page 1-5 Section 1. Introduction Introduction 1 1.5.1 Document Conventions Table 1-1 defines some of the symbols and terms used throughout this manual. Table 1-1: Document Conventions Symbol or Term Description set To force a bit/register to a value of logic ‘1’. clear To force a bit/register to a value of logic ‘0’. Reset 1) To force a register/bit to its default state. 2) A condition in which the device places itself after a device Reset occurs. Some bits will be forced to ‘0’ (such as interrupt enable bits), while others will be forced to ‘1’ (such as the I/O data direction bits). 0xnn or nnh Designates the number ‘nn’ in the hexadecimal number system. These conventions are used in the code examples. For example, 0x13F or 13Fh. B‘bbbbbbbb’ Designates the number ‘bbbbbbbb’ in the binary number system. This convention is used in the text and in figures and tables. For example, B‘10100000’. R-M-W Read-Modify-Write. This is when a register or port is read, then the value is modified, and that value is then written back to the register or port. This action can occur from a single instruction (such as bit set, BSET), or a sequence of instructions. : (colon) Used to specify a range or the concatenation of registers/bits/pins. One example is TMR3:TMR2, which is the concatenation of two 16-bit registers to form a 32-bit timer value. Concatenation order (left-right) usually specifies a positional relationship (MSb to LSb, higher to lower). < > Specifies bit(s) locations in a particular register. One example is PTCON (or PTMOD<1:0>), which specifies the register and associated bits or bit positions. MSb, MSbit, LSb, LSbit Indicates the Least Significant or Most Significant bit in a field. MSByte, MSWord, LSByte, LSWord Indicates the Least/Most Significant Byte or Word in a field of bits. Courier Font Used for code examples, binary numbers and for instruction mnemonics in the text. Times Font Used for equations and variables. Times, Bold Font, Italics Used in explanatory text for items called out from a graphic/ equation/example. Note A Note presents information that we wish to re-emphasize, either to help you avoid a common pitfall, or make you aware of operating differences between some device family members. A Note is always in a shaded box (as below), unless used in a table, where it is at the bottom of the table (as in this table). Note: This is a Note in a shaded note box. dsPIC30F Family Reference Manual DS70048C-page 1-6 © 2004 Microchip Technology Inc. 1.5.2 Electrical Specifications Throughout this manual, there will be references to electrical specifications and their parameter numbers. Table 1-2 shows the parameter numbering convention for dsPIC30F devices. A parameter number represents a unique set of characteristics and conditions that is consistent between every data sheet, though the actual parameter value may vary from device to device. This manual describes a family of devices and therefore, does not specify the parameter values. The user should refer to the “Electrical Specifications” section of the device data sheet for the actual parameter values for that device. Table 1-2: Electrical Specification Parameter Numbering Convention 1.6 Related Documents Microchip, as well as other sources, offers additional documentation which can aid in your development with dsPIC30F MCUs. These lists contain the most common documentation, but other documents may also be available. Please check the Microchip web site (www.microchip.com) for the latest published technical documentation. 1.6.1 Microchip Documentation The following dsPIC30F documentation is available from Microchip at the time of this writing. Many of these documents provide application specific information that gives actual examples of using, programming and designing with dsPIC30F MCUs. 1. dsPIC30F Programmer’s Reference Manual (DS70030) The dsPIC30F Programmer’s Reference Manual provides information about the dsPIC30F programmer’s model and instruction set. A description of each instruction and syntax examples are provided in this document. 2. dsPIC30F Family Overview (DS70043) This document provides a summary of the available dsPIC30F family variants, including device pinouts, memory sizes and available peripherals. 3. dsPIC30F Data Sheets (DS70082 and DS70083) The data sheets contain device specific information, such as pinout and packaging details, electrical specifications and memory maps. 1.6.2 Third Party Documentation There are several documents available from third party sources around the world. Microchip does not review these documents for technical accuracy. However, they may be a helpful source for understanding the operation of Microchip dsPIC30F devices. Please refer to the Microchip web site for third party documentation related to the dsPIC30F. Parameter Number Format Comment DXXX DC Specification AXXX DC Specification for Analog Peripherals XXX Timing (AC) Specification PDXXX Device Programming DC Specification PXXX Device Programming Timing (AC) Specification Legend: XXX represents a number. © 2004 Microchip Technology Inc. DS70048C-page 1-7 Section 1. Introduction Introduction 1 1.7 Revision History Revision A This is the initial released revision of this document. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. dsPIC30F Family Reference Manual DS70048C-page 1-8 © 2004 Microchip Technology Inc. NOTES: © 2004 Microchip Technology Inc. DS70049C-page 2-1 CPU 2 Section 2. CPU HIGHLIGHTS This section of the manual contains the following topics: 2.1 Introduction .................................................................................................................... 2-2 2.2 Programmer’s Model...................................................................................................... 2-4 2.3 Software Stack Pointer................................................................................................... 2-8 2.4 CPU Register Descriptions .......................................................................................... 2-11 2.5 Arithmetic Logic Unit (ALU).......................................................................................... 2-17 2.6 DSP Engine ................................................................................................................. 2-18 2.7 Divide Support .............................................................................................................2-27 2.8 Instruction Flow Types ................................................................................................. 2-27 2.9 Loop Constructs........................................................................................................... 2-30 2.10 Address Register Dependencies .................................................................................2-35 2.11 Register Maps.............................................................................................................. 2-38 2.12 Related Application Notes............................................................................................2-40 2.13 Revision History ...........................................................................................................2-41 dsPIC30F Family Reference Manual DS70049C-page 2-2 © 2004 Microchip Technology Inc. 2.1 Introduction The dsPIC30F CPU module has a 16-bit (data) modified Harvard architecture with an enhanced instruction set, including significant support for DSP. The CPU has a 24-bit instruction word, with a variable length opcode field. The program counter (PC) is 24-bits wide and addresses up to 4M x 24 bits of user program memory space. A single cycle instruction pre-fetch mechanism is used to help maintain throughput and provides predictable execution. All instructions execute in a single cycle, with the exception of instructions that change the program flow, the double-word move (MOV.D) instruction and the table instructions. Overhead free program loop constructs are supported using the DO and REPEAT instructions, both of which are interruptible at any point. The dsPIC30F devices have sixteen 16-bit working registers in the programmer’s model. Each of the working registers can act as a data, address, or address offset register. The 16th working register (W15) operates as a software stack pointer for interrupts and calls. The dsPIC30F instruction set has two classes of instructions: the MCU class of instructions and the DSP class of instructions. These two instruction classes are seamlessly integrated into the architecture and execute from a single execution unit. The instruction set includes many Addressing modes and was designed for optimum C compiler efficiency. The data space can be addressed as 32K words or 64 Kbytes and is split into two blocks, referred to as X and Y data memory. Each memory block has its own independent Address Generation Unit (AGU). The MCU class of instructions operate solely through the X memory AGU, which accesses the entire memory map as one linear data space. Certain DSP instructions operate through the X and Y AGUs to support dual operand reads, which splits the data address space into two parts. The X and Y data space boundary is device specific. The upper 32 Kbytes of the data space memory map can optionally be mapped into program space at any 16K program word boundary defined by the 8-bit Program Space Visibility Page (PSVPAG) register. The program to data space mapping feature lets any instruction access program space as if it were data space. Furthermore, RAM may be connected to the program memory bus on devices with an external bus and used to extend the internal data RAM. Overhead free circular buffers (modulo addressing) are supported in both X and Y address spaces. The modulo addressing removes the software boundary checking overhead for DSP algorithms. Furthermore, the X AGU circular addressing can be used with any of the MCU class of instructions. The X AGU also supports bit-reverse addressing to greatly simplify input or output data reordering for radix-2 FFT algorithms. The CPU supports Inherent (no operand), Relative, Literal, Memory Direct, Register Direct and Register Indirect Addressing modes. Each instruction is associated with a predefined Addressing mode group depending upon its functional requirements. As many as 6 Addressing modes are supported for each instruction. For most instructions, the dsPIC30F is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, 3 operand instructions can be supported, allowing A+B=C operations to be executed in a single cycle. The DSP engine features a high speed, 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bi-directional barrel shifter. The barrel shifter is capable of shifting a 40-bit value up to 15 bits right, or up to 16 bits left, in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC instruction and other associated instructions can concurrently fetch two data operands from memory while multiplying two W registers. This requires that the data space be split for these instructions and linear for all others. This is achieved in a transparent and flexible manner through dedicating certain working registers to each address space. The dsPIC30F has a vectored exception scheme with up to 8 sources of non-maskable traps and 54 interrupt sources. Each interrupt source can be assigned to one of seven priority levels. A block diagram of the CPU is shown in Figure 2-1. © 2004 Microchip Technology Inc. DS70049C-page 2-3 Section 2. CPU CPU 2 Figure 2-1: dsPIC30F CPU Core Block Diagram Power-up Timer Oscillator Start-up Timer POR/BOR Reset Watchdog Timer Instruction Decode & Control OSC1/CLKI MCLR VDD, VSS Low Voltage Detect UART1, CAN2 Timing Generation CAN1, 16 PCH PCL 16 Program Counter 16-bit ALU 24 24 24 24 X Data Bus IR I 2C™ DCI PCU 10-bit or Timers Input Capture Module Output Compare Module 16 16 16 16 x 16 W Reg Array Divide Support Engine DSP ROM Latch 16 Y Data Bus EA MUX X RAGU X WAGU Y AGU AVDD, AVSS SPI2 UART2 16 16 16 16 16 16 16 16 16 8 Interrupt Controller PSV & Table Data Access Control Block Stack Control Logic Loop Control Logic Data Latch Data Latch Y Data (4 Kbytes) RAM X Data (4 Kbytes) RAM Address Latch Address Latch Control Signals to Various Blocks 16 SPI1, Address Latch Program Memory (144 Kbytes) Data Latch Data EEPROM (4 Kbytes) I/O Ports 16 16 16 X Address Bus Y Address Bus 16 Literal Data 12-bit ADC dsPIC30F Family Reference Manual DS70049C-page 2-4 © 2004 Microchip Technology Inc. 2.2 Programmer’s Model The programmer’s model for the dsPIC30F is shown in Figure 2-2. All registers in the programmer’s model are memory mapped and can be manipulated directly by instructions. A description of each register is provided in Table 2-1. In addition to the registers contained in the programmer’s model, the dsPIC30F contains control registers for modulo addressing, bit-reversed addressing and interrupts. These registers are described in subsequent sections of this document. All registers associated with the programmer’s model are memory mapped, as shown in Table 2-8 on page 2-38. Table 2-1: Programmer’s Model Register Descriptions Register(s) Name Description W0 through W15 Working register array ACCA, ACCB 40-bit DSP Accumulators PC 23-bit Program Counter SR ALU and DSP Engine Status register SPLIM Stack Pointer Limit Value register TBLPAG Table Memory Page Address register PSVPAG Program Space Visibility Page Address register RCOUNT REPEAT Loop Count register DCOUNT DO Loop Count register DOSTART DO Loop Start Address register DOEND DO Loop End Address register CORCON Contains DSP Engine and DO Loop control bits © 2004 Microchip Technology Inc. DS70049C-page 2-5 Section 2. CPU CPU 2 Figure 2-2: Programmer’s Model N OV SZ C TBLPAG 22 0 7 0 15 0 Program Counter Data Table Page Address Status Register Working/Address Registers DSP Operand Registers W0 (WREG) W1 W2 W3 W4 W5 W6 W7 W8 W9 W10 W11 W12 W13 Frame Pointer/W14 Stack Ptr/W15 DSP Address Registers 39 31 0 DSP Accumulators PSVPAG 7 0 Program Space Visibility RA 0 OA OB SA SB RCOUNT 15 0 REPEAT Loop Counter DCOUNT 15 0 DO Loop Counter DOSTART 22 0 DO Loop Start Address DOEND DO Loop End Address IPL<2:0> SPLIM Stack Pointer Limit 15 22 0 SRL PUSH.S and POP.S Shadows 0 0 OAB SAB Page Address DA DC CORCON 15 0 Core Control Register ACCAU ACCAH ACCAL ACCBU ACCBH ACCBL ACCA ACCB SRH 0 0 Note: DCOUNT, DOSTART and DOEND have one level of shadow registers (not shown) for nested DO loops. dsPIC30F Family Reference Manual DS70049C-page 2-6 © 2004 Microchip Technology Inc. 2.2.1 Working Register Array The 16 working (W) registers can function as data, address or address offset registers. The function of a W register is determined by the Addressing mode of the instruction that accesses it. The dsPIC30F instruction set can be divided into two instruction types: register and file register instructions. Register instructions can use each W register as a data value or an address offset value. For example: MOV W0,W1 ; move contents of W0 to W1 MOV W0,[W1] ; move W0 to address contained in W1 ADD W0,[W4],W5 ; add contents of W0 to contents pointed ; to by W4. Place result in W5. 2.2.1.1 W0 and File Register Instructions W0 is a special working register because it is the only working register that can be used in file register instructions. File register instructions operate on a specific memory address contained in the instruction opcode and W0. W1-W15 cannot be specified as a target register in file register instructions. The file register instructions provide backward compatibility with existing PICmicro® devices which have only one W register. The label ‘WREG’ is used in the assembler syntax to denote W0 in a file register instruction. For example: MOV WREG,0x0100 ; move contents of W0 to address 0x0100 ADD 0x0100,WREG ; add W0 to address 0x0100, store in W0 2.2.1.2 W Register Memory Mapping Since the W registers are memory mapped, it is possible to access a W register in a file register instruction as shown below: MOV 0x0004, W10 ; equivalent to MOV W2, W10 where 0x0004 is the address in memory of W2. Further, it is also possible to execute an instruction that will attempt to use a W register as both an address pointer and operand destination. For example: MOV W1,[W2++] where: W1 = 0x1234 W2 = 0x0004 ;[W2] addresses W2 In the example above, the contents of W2 are 0x0004. Since W2 is used as an address pointer, it points to location 0x0004 in memory. W2 is also mapped to this address in memory. Even though this is an unlikely event, it is impossible to detect until run-time. The dsPIC30F ensures that the data write will dominate, resulting in W2 = 0x1234 in the example above. 2.2.1.3 W Registers and Byte Mode Instructions Byte instructions which target the W register array only affect the Least Significant Byte of the target register. Since the working registers are memory mapped, the Least and Most Significant Bytes can be manipulated through byte wide data memory space accesses. 2.2.2 Shadow Registers Many of the registers in the programmer’s model have an associated shadow register as shown in Figure 2-2. None of the shadow registers are accessible directly. There are two types of shadow registers: those utilized by the PUSH.S and POP.S instructions and those utilized by the DO instruction. Note: For a complete description of Addressing modes and instruction syntax, please refer to the dsPIC30F Programmer’s Reference Manual (DS70032). © 2004 Microchip Technology Inc. DS70049C-page 2-7 Section 2. CPU CPU 2 2.2.2.1 PUSH.S and POP.S Shadow Registers The PUSH.S and POP.S instructions are useful for fast context save/restore during a function call or Interrupt Service Routine (ISR). The PUSH.S instruction will transfer the following register values into their respective shadow registers: • W0...W3 • SR (N, OV, Z , C, DC bits only) The POP.S instruction will restore the values from the shadow registers into these register locations. A code example using the PUSH.S and POP.S instructions is shown below: MyFunction: PUSH.S ; Save W registers, MCU status MOV #0x03,W0 ; load a literal value into W0 ADD RAM100 ; add W0 to contents of RAM100 BTSC SR,#Z ; is the result 0? BSET Flags,#IsZero ; Yes, set a flag POP.S ; Restore W regs, MCU status RETURN The PUSH.S instruction will overwrite the contents previously saved in the shadow registers. The shadow registers are only one level in depth, so care must be taken if the shadow registers are to be used for multiple software tasks. The user must ensure that any task using the shadow registers will not be interrupted by a higher priority task that also uses the shadow registers. If the higher priority task is allowed to interrupt the lower priority task, the contents of the shadow registers saved in the lower priority task will be overwritten by the higher priority task. 2.2.2.2 DO Loop Shadow Registers The following registers are automatically saved in shadow registers when a DO instruction is executed: • DOSTART • DOEND • DCOUNT The DO shadow registers are one level in depth, permitting two loops to be automatically nested. Refer to Section 2.9.2.2 “DO Loop Nesting” for further details. 2.2.3 Uninitialized W Register Reset The W register array (with the exception of W15) is cleared during all Resets and is considered uninitialized until written to. An attempt to use an uninitialized register as an address pointer will reset the device. A word write must be performed to initialize a W register. A byte write will not affect the initialization detection logic. dsPIC30F Family Reference Manual DS70049C-page 2-8 © 2004 Microchip Technology Inc. 2.3 Software Stack Pointer W15 serves as a dedicated software stack pointer and is automatically modified by exception processing, subroutine calls and returns. However, W15 can be referenced by any instruction in the same manner as all other W registers. This simplifies reading, writing and manipulating the stack pointer (e.g., creating stack frames). W15 is initialized to 0x0800 during all Resets. This address ensures that the stack pointer (SP) will point to valid RAM in all dsPIC30F devices and permits stack availability for non-maskable trap exceptions, which may occur before the SP is initialized by the user software. The user may reprogram the SP during initialization to any location within data space. The stack pointer always points to the first available free word and fills the software stack working from lower towards higher addresses. It pre-decrements for a stack pop (read) and post-increments for a stack push (writes), as shown in Figure 2-3. When the PC is pushed onto the stack, PC<15:0> is pushed onto the first available stack word, then PC<22:16> is pushed into the second available stack location. For a PC push during any CALL instruction, the MSByte of the PC is zero-extended before the push as shown in Figure 2-3. During exception processing, the MSByte of the PC is concatenated with the lower 8 bits of the CPU status register, SR. This allows the contents of SRL to be preserved automatically during interrupt processing. Figure 2-3: Stack Operation for a CALL Instruction Note: In order to protect against misaligned stack accesses, W15<0> is fixed to ‘0’ by the hardware. PC<15:0> PC<22:16> 15 0 W15 (before CALL) W15 (after CALL) Stack Grows Towards Higher Address B‘000000000’ CALL SUBR © 2004 Microchip Technology Inc. DS70049C-page 2-9 Section 2. CPU CPU 2 2.3.1 Software Stack Examples The software stack is manipulated using the PUSH and POP instructions. The PUSH and POP instructions are the equivalent of a MOV instruction with W15 used as the destination pointer. For example, the contents of W0 can be pushed onto the stack by: PUSH W0 This syntax is equivalent to: MOV W0,[W15++] The contents of the top-of-stack can be returned to W0 by: POP W0 This syntax is equivalent to: MOV [--W15],W0 Figure 2-4 through Figure 2-7 show examples of how the software stack is used. Figure 2-4 shows the software stack at device initialization. W15 has been initialized to 0x0800. Furthermore, this example assumes the values 0x5A5A and 0x3636 have been written to W0 and W1, respectively. The stack is pushed for the first time in Figure 2-5 and the value contained in W0 is copied to the stack. W15 is automatically updated to point to the next available stack location (0x0802). In Figure 2-6, the contents of W1 are pushed onto the stack. In Figure 2-7, the stack is popped and the top-of-stack value (previously pushed from W1) is written to W3. Figure 2-4: Stack Pointer at Device Reset Figure 2-5: Stack Pointer After the First PUSH Instruction Figure 2-6: Stack Pointer After the Second PUSH Instruction 0x0000 0xFFFE W15 0x0800 W15 = 0x0800 W0 = 0x5A5A W1 = 0x3636 0x0000 0xFFFE 0x5A5A W15 = 0x0802 W0 = 0x5A5A W1 = 0x3636 0x0800 PUSH W0 W15 0x0802 0x0000 0xFFFE 0x5A5A 0x3636 W15 = 0x0804 W0 = 0x5A5A W1 = 0x3636 0x0800 PUSH W1 0x0802 W15 0x0804 dsPIC30F Family Reference Manual DS70049C-page 2-10 © 2004 Microchip Technology Inc. Figure 2-7: Stack Pointer After a POP Instruction 2.3.2 W14 Software Stack Frame Pointer A frame is a user defined section of memory in the stack that is used by a single subroutine. W14 is a special working register because it can be used as a stack frame pointer with the LNK (link) and ULNK (unlink) instructions. W14 can be used in a normal working register by instructions when it is not used as a frame pointer. Refer to the “dsPIC30F Programmer’s Reference Manual” (DS70030) for software examples that use W14 as a stack frame pointer. 2.3.3 Stack Pointer Overflow There is a stack limit register (SPLIM) associated with the stack pointer that is reset to 0x0000. SPLIM is a 16-bit register, but SPLIM<0> is fixed to ‘0’ because all stack operations must be word aligned. The stack overflow check will not be enabled until a word write to SPLIM occurs, after which time it can only be disabled by a device Reset. All effective addresses generated using W15 as a source or destination are compared against the value in SPLIM. If the contents of the Stack Pointer (W15) are greater than the contents of the SPLIM register by 2 and a push operation is performed, a Stack Error Trap will not occur. The Stack Error Trap will occur on a subsequent push operation. Thus, for example, if it is desirable to cause a Stack Error Trap when the stack grows beyond address 0x2000 in RAM, initialize the SPLIM with the value, 0x1FFE. If stack overflow checking has been enabled, a stack error trap will also occur if the W15 effective address calculation wraps over the end of data space (0xFFFF). Refer to Section 6. “Reset Interrupts” for more information on the stack error trap. 2.3.4 Stack Pointer Underflow The stack is initialized to 0x0800 during Reset. A stack error trap will be initiated should the stack pointer address ever be less than 0x0800. 0x0000 0xFFFE 0x05A5A 0x03636 0x3636 → W3 W15 = 0x0802 POP W3 0x0802 0x0800 W15 Note: A Stack Error Trap may be caused by any instruction that uses the contents of the W15 register to generate an effective address (EA). Thus, if the contents of W15 are greater than the contents of the SPLIM register by 2, and a CALL instruction is executed, or if an interrupt occurs, a Stack Error Trap will be generated. Note: A write to the Stack Pointer Limit register, SPLIM, should not be followed by an indirect read operation using W15. Note: Locations in data space between 0x0000 and 0x07FF are, in general, reserved for core and peripheral special function registers. © 2004 Microchip Technology Inc. DS70049C-page 2-11 Section 2. CPU CPU 2 2.4 CPU Register Descriptions 2.4.1 SR: CPU Status Register The dsPIC30F CPU has a 16-bit status register (SR), the LSByte of which is referred to as the lower status register (SRL). The upper byte of SR is referred to as SRH. A detailed description of SR is shown in Register 2-1. SRL contains all the MCU ALU operation status flags, plus the CPU interrupt priority status bits, IPL<2:0> and the REPEAT loop active status bit, RA (SR<4>). During exception processing, SRL is concatenated with the MSByte of the PC to form a complete word value, which is then stacked. SRH contains the DSP Adder/Subtractor status bits, the DO loop active bit, DA (SR<9>) and the Digit Carry bit, DC (SR<8>). The SR bits are readable/writable with the following exceptions: 1. The DA bit (SR<8>): DA is a read only bit. 2. The RA bit (SR<4>): RA is a read only bit. 3. The OA, OB (SR<15:14>) and OAB (SR<11>) bits: These bits are read only and can only be modified by the DSP engine hardware. 4. The SA, SB (SR<13:12>) and SAB (SR<10>) bits: These are read and clear only and can only be set by the DSP engine hardware. Once set, they remain set until cleared by the user, irrespective of the results from any subsequent DSP operations. 2.4.2 CORCON: Core Control Register The CORCON register contains bits that control the operation of the DSP multiplier and DO loop hardware. The CORCON register also contains the IPL3 status bit, which is concatenated with IPL<2:0> (SR<7:5>), to form the CPU Interrupt Priority Level. Note: Clearing the SAB bit will also clear both the SA and SB bits. Note: A description of the SR bits affected by each instruction is provided in the dsPIC30F Programmer’s Reference Manual (DS70030). dsPIC30F Family Reference Manual DS70049C-page 2-12 © 2004 Microchip Technology Inc. Register 2-1: SR: CPU Status Register Upper Byte: R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0 OA OB SA SB OAB SAB DA DC bit 15 bit 8 Lower Byte: (SRL) R/W-0(2) R/W-0(2) R/W-0(2) R-0 R/W-0 R/W-0 R/W-0 R/W-0 IPL<2:0> RA N OV Z C bit 7 bit 0 bit 15 OA: Accumulator A Overflow Status bit 1 = Accumulator A overflowed 0 = Accumulator A has not overflowed bit 14 OB: Accumulator B Overflow Status bit 1 = Accumulator B overflowed 0 = Accumulator B has not overflowed bit 13 SA: Accumulator A Saturation ‘Sticky’ Status bit 1 = Accumulator A is saturated or has been saturated at some time 0 = Accumulator A is not saturated Note: This bit may be read or cleared (not set). bit 12 SB: Accumulator B Saturation ‘Sticky’ Status bit 1 = Accumulator B is saturated or has been saturated at some time 0 = Accumulator B is not saturated Note: This bit may be read or cleared (not set). bit 11 OAB: OA || OB Combined Accumulator Overflow Status bit 1 = Accumulators A or B have overflowed 0 = Neither Accumulators A or B have overflowed bit 10 SAB: SA || SB Combined Accumulator ‘Sticky’ Status bit 1 = Accumulators A or B are saturated or have been saturated at some time in the past 0 = Neither Accumulator A or B are saturated Note: This bit may be read or cleared (not set). Clearing this bit will clear SA and SB. bit 9 DA: DO Loop Active bit 1 = DO loop in progress 0 = DO loop not in progress bit 8 DC: MCU ALU Half Carry/Borrow bit 1 = A carry-out from the 4th low order bit (for byte-sized data) or 8th low order bit (for word-sized data) of the result occurred 0 = No carry-out from the 4th low order bit (for byte-sized data) or 8th low order bit (for word-sized data) of the result occurred © 2004 Microchip Technology Inc. DS70049C-page 2-13 Section 2. CPU CPU 2 Register 2-1: SR: CPU Status Register (Continued) bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(1) 111 = CPU Interrupt Priority Level is 7 (15). User interrupts disabled. 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) Note 1: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. 2: The IPL<2:0> status bits are read only when NSTDIS = 1 (INTCON1<15>). bit 4 RA: REPEAT Loop Active bit 1 = REPEAT loop in progress 0 = REPEAT loop not in progress bit 3 N: MCU ALU Negative bit 1 = Result was negative 0 = Result was non-negative (zero or positive) bit 2 OV: MCU ALU Overflow bit This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the magnitude which causes the sign bit to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred bit 1 Z: MCU ALU Zero bit 1 = An operation which effects the Z bit has set it at some time in the past 0 = The most recent operation which effects the Z bit has cleared it (i.e., a non-zero result) bit 0 C: MCU ALU Carry/Borrow bit 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ C = Clear only bit S = Set only bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70049C-page 2-14 © 2004 Microchip Technology Inc. Register 2-2: CORCON: Core Control Register Upper Byte: U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0 — — — US EDT DL<2:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF bit 7 bit 0 bit 15-13 Unimplemented: Read as '0’ bit 12 US: DSP Multiply Unsigned/Signed Control bit 1 = DSP engine multiplies are unsigned 0 = DSP engine multiplies are signed bit 11 EDT: Early DO Loop Termination Control bit 1 = Terminate executing DO loop at end of current loop iteration 0 = No effect Note: This bit will always read as ‘0’. bit 10-8 DL<2:0>: DO Loop Nesting Level Status bits 111 = 7 DO loops active • • 001 = 1 DO loop active 000 = 0 DO loops active bit 7 SATA: AccA Saturation Enable bit 1 = Accumulator A saturation enabled 0 = Accumulator A saturation disabled bit 6 SATB: AccB Saturation Enable bit 1 = Accumulator B saturation enabled 0 = Accumulator B saturation disabled bit 5 SATDW: Data Space Write from DSP Engine Saturation Enable bit 1 = Data space write saturation enabled 0 = Data space write saturation disabled bit 4 ACCSAT: Accumulator Saturation Mode Select bit 1 = 9.31 saturation (super saturation) 0 = 1.31 saturation (normal saturation) bit 3 IPL3: CPU Interrupt Priority Level Status bit 3 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less Note: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level. © 2004 Microchip Technology Inc. DS70049C-page 2-15 Section 2. CPU CPU 2 Register 2-2: CORCON: Core Control Register (Continued) bit 2 PSV: Program Space Visibility in Data Space Enable bit 1 = Program space visible in data space 0 = Program space not visible in data space bit 1 RND: Rounding Mode Select bit 1 = Biased (conventional) rounding enabled 0 = Unbiased (convergent) rounding enabled bit 0 IF: Integer or Fractional Multiplier Mode Select bit 1 = Integer mode enabled for DSP multiply ops 0 = Fractional mode enabled for DSP multiply ops Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ C = Bit can be cleared -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70049C-page 2-16 © 2004 Microchip Technology Inc. 2.4.3 Other dsPIC30F CPU Control Registers The registers listed below are associated with the dsPIC30F CPU core, but are described in further detail in other sections of this manual. 2.4.3.1 TBLPAG: Table Page Register The TBLPAG register is used to hold the upper 8 bits of a program memory address during table read and write operations. Table instructions are used to transfer data between program memory space and data memory space. Refer to Section 4. “Program Memory” for further details. 2.4.3.2 PSVPAG: Program Space Visibility Page Register Program space visibility allows the user to map a 32-Kbyte section of the program memory space into the upper 32 Kbytes of data address space. This feature allows transparent access of constant data through dsPIC30F instructions that operate on data memory. The PSVPAG register selects the 32 Kbyte region of program memory space that is mapped to the data address space. Refer to Section 4. “Program Memory” for more information on the PSVPAG register. 2.4.3.3 MODCON: Modulo Control Register The MODCON register is used to enable and configure modulo addressing (circular buffers). Refer to Section 3. “Data Memory” for further details on modulo addressing. 2.4.3.4 XMODSRT, XMODEND: X Modulo Start and End Address Registers The XMODSRT and XMODEND registers hold the start and end addresses for modulo (circular) buffers implemented in the X data memory address space. Refer to Section 3. “Data Memory” for further details on modulo addressing. 2.4.3.5 YMODSRT, YMODEND: Y Modulo Start and End Address Registers The YMODSRT and YMODEND registers hold the start and end addresses for modulo (circular) buffers implemented in the Y data memory address space. Refer to Section 3. “Data Memory” for further details on modulo addressing. 2.4.3.6 XBREV: X Modulo Bit-Reverse Register The XBREV register is used to set the buffer size used for bit-reversed addressing. Refer to Section 3. “Data Memory” for further details on bit-reversed addressing. 2.4.3.7 DISICNT: Disable Interrupts Count Register The DISICNT register is used by the DISI instruction to disable interrupts of priority 1-6 for a specified number of cycles. See Section 6. “Reset Interrupts” for further information. © 2004 Microchip Technology Inc. DS70049C-page 2-17 Section 2. CPU CPU 2 2.5 Arithmetic Logic Unit (ALU) The dsPIC30F ALU is 16-bits wide and is capable of addition, subtraction, single bit shifts and logic operations. Unless otherwise mentioned, arithmetic operations are 2’s complement in nature. Depending on the operation, the ALU may affect the values of the Carry (C), Zero (Z), Negative (N), Overflow (OV) and Digit Carry (DC) status bits in the SR register. The C and DC status bits operate as a Borrow and Digit Borrow bits, respectively, for subtraction operations. The ALU can perform 8-bit or 16-bit operations, depending on the mode of the instruction that is used. Data for the ALU operation can come from the W register array or data memory depending on the Addressing mode of the instruction. Likewise, output data from the ALU can be written to the W register array or a data memory location. Refer to the dsPIC30F Programmer’s Reference Manual (DS70030) for information on the SR bits affected by each instruction, Addressing modes and 8-bit/16-bit Instruction modes. 2.5.1 Byte to Word Conversion The dsPIC30F has two instructions that are helpful when mixing 8-bit and 16-bit ALU operations. The sign-extend (SE) instruction takes a byte value in a W register or data memory and creates a sign-extended word value that is stored in a W register. The zero-extend (ZE) instruction clears the 8 MSbs of a word value in a W register or data memory and places the result in a destination W register. Note 1: Byte operations use the 16-bit ALU and can produce results in excess of 8 bits. However, to maintain backward compatibility with PICmicro devices, the ALU result from all byte operations is written back as a byte (i.e., MSByte not modified), and the SR register is updated based only upon the state of the LSByte of the result. 2: All register instructions performed in Byte mode only affect the LSByte of the W registers. The MSByte of any W register can be modified by using file register instructions that access the memory mapped contents of the W registers. dsPIC30F Family Reference Manual DS70049C-page 2-18 © 2004 Microchip Technology Inc. 2.6 DSP Engine The DSP engine is a block of hardware which is fed data from the W register array but contains its own specialized result registers. The DSP engine is driven from the same instruction decoder that directs the MCU ALU. In addition, all operand effective addresses (EAs) are generated in the W register array. Concurrent operation with MCU instruction flow is not possible, though both the MCU ALU and DSP engine resources may be shared by all instructions in the instruction set. The DSP engine consists of the following components: • high speed 17-bit x 17-bit multiplier • barrel shifter • 40-bit adder/subtractor • two target accumulator registers • rounding logic with Selectable modes • saturation logic with Selectable modes Data input to the DSP engine is derived from one of the following sources: 1. Directly from the W array (registers W4, W5, W6 or W7) for dual source operand DSP instructions. Data values for the W4, W5, W6 and W7 registers are pre-fetched via the X and Y memory data buses. 2. From the X memory data bus for all other DSP instructions. Data output from the DSP engine is written to one of the following destinations: 1. The target accumulator, as defined by the DSP instruction being executed. 2. The X memory data bus to any location in the data memory address space. The DSP engine has the capability to perform inherent accumulator to accumulator operations which require no additional data. The MCU shift and multiply instructions use the DSP engine hardware to obtain their results. The X memory data bus is used for data reads and writes in these operations. A block diagram of the DSP engine is shown in Figure 2-8. Note: For detailed code examples and instruction syntax related to this section, refer to the dsPIC30F Programmer’s Reference Manual (DS70030). © 2004 Microchip Technology Inc. DS70049C-page 2-19 Section 2. CPU CPU 2 Figure 2-8: DSP Engine Block Diagram Zero Backfill Sign-Extend Barrel Shifter 40-bit Accumulator A 40-bit Accumulator B Round Logic X Data Bus To/From W Array Adder Saturate Negate 32 32 32 16 16 16 16 40 40 40 40 Y Data Bus 40 16 40 Multiplier/Scaler 17-bit x 17-bit 16-bit to 17-bit Conversion Saturation Logic dsPIC30F Family Reference Manual DS70049C-page 2-20 © 2004 Microchip Technology Inc. 2.6.1 Data Accumulators There are two 40-bit data accumulators, ACCA and ACCB, that are the result registers for the DSP instructions listed in Table 2-3. Each accumulator is memory mapped to three registers, where ‘x’ denotes the particular accumulator: • ACCxL: ACCx<15:0> • ACCxH: ACCx<31:16> • ACCxU: ACCx<39:32> For fractional operations that use the accumulators, the radix point is located to the right of bit 31. The range of fractional values that be stored in each accumulator is -256.0 to (256.0 – 2-31). For integer operations that use the accumulators, the radix point is located to the right of bit 0. The range of integer values that can be stored in each accumulator is -549,755,813,888 to 549,755,813,887. 2.6.2 Multiplier The dsPIC30F features a 17-bit x 17-bit multiplier which is shared by both the MCU ALU and the DSP engine. The multiplier is capable of signed or unsigned operation and can support either 1.31 fractional (Q.31) or 32-bit integer results. The multiplier takes in 16-bit input data and converts the data to 17-bits. Signed operands to the multiplier are sign-extended. Unsigned input operands are zero-extended. The 17-bit conversion logic is transparent to the user and allows the multiplier to support mixed sign and unsigned/unsigned multiplication. The IF control bit (CORCON<0>) determines integer/fractional operation for the instructions listed in Table 2-3. The IF bit does not affect MCU multiply instructions listed in Table 2-4, which are always integer operations. The multiplier scales the result one bit to the left for fractional operation. The LSbit of the result is always cleared. The multiplier defaults to Fractional mode for DSP operations at a device Reset. The representation of data in hardware for each of these modes is as follows: • Integer data is inherently represented as a signed two’s complement value, where the MSbit is defined as a sign bit. Generally speaking, the range of an N-bit two’s complement integer is -2N-1 to 2N-1 – 1. • Fractional data is represented as a two’s complement fraction where the MSbit is defined as a sign bit and the radix point is implied to lie just after the sign bit (Q.X format). The range of an N-bit two’s complement fraction with this implied radix point is -1.0 to (1 – 21-N). Figure 2-9 and Figure 2-10 illustrate how the multiplier hardware interprets data in Integer and Fractional modes. The range of data in both Integer and Fractional modes is listed in Table 2-2. © 2004 Microchip Technology Inc. DS70049C-page 2-21 Section 2. CPU CPU 2 Figure 2-9: Integer and Fractional Representation of 0x4001 Figure 2-10: Integer and Fractional Representation of 0xC002 Different Representations of 0x4001 Integer: -215 214 213 212 . . . . 0x4001 = 214 + 20 = 16385 1.15 Fractional: 2-15 0 2-1 2-2 2-3 -2 . . . 0 20 0x4001 = 2-1 + 2-15 = 0.500030518 Implied Radix Point . 1 0000000000000 1 0 1 0000000000000 1 Different Representations of 0xC002 Integer: -215 214 213 212 . . . . 0xC002 = -215 + 214 + 20 = -32768 + 16384 + 2 = -16382 1.15 Fractional: 2-15 . 2-1 2-2 2-3 -2 . . . 0 20 0xC002 = -20 + 2-1 + 2-14 = -1 + 0.5 + 0.000061035 = -0.499938965 Implied Radix Point 1 1 0000000000001 0 1 1 0000000000001 0 dsPIC30F Family Reference Manual DS70049C-page 2-22 © 2004 Microchip Technology Inc. Table 2-2: dsPIC30F Data Ranges 2.6.2.1 DSP Multiply Instructions The DSP instructions that utilize the multiplier are summarized in Table 2-3. Table 2-3: DSP Instructions that Utilize the Multiplier The US control bit (CORCON<12>) determines whether DSP multiply instructions are signed (default) or unsigned. The US bit does not influence the MCU multiply instructions which have specific instructions for signed or unsigned operation. If the US bit is set, the input operands for instructions shown in Table 2-3 are considered as unsigned values which are always zero-extended into the 17th bit of the multiplier value. 2.6.2.2 MCU Multiply Instructions The same multiplier is used to support the MCU multiply instructions, which include integer 16-bit signed, unsigned and mixed sign multiplies as shown in Table 2-4. All multiplications performed by the MUL instruction produce integer results. The MUL instruction may be directed to use byte or word sized operands. Byte input operands will produce a 16-bit result and word input operands will produce a 32-bit result to the specified register(s) in the W array. Table 2-4: MCU Instructions that Utilize the Multiplier Register Size Integer Range Fraction Range Fraction Resolution 16-bit -32768 to 32767 -1.0 to (1.0 – 2-15) (Q.15 Format) 3.052 x 10-5 32-bit -2,147,483,648 to 2,147,483,647 -1.0 to (1.0 – 2-31) (Q.31 Format) 4.657 x 10-10 40-bit -549,755,813,888 to 549,755,813,887 -256.0 to (256.0 – 2-31) (Q.31 Format with 8 Guard bits) 4.657 x 10-10 DSP Instruction Description Algebraic Equivalent MAC Multiply and Add to Accumulator OR Square and Add to Accumulator a = a + b*c a = a + b2 MSC Multiply and Subtract from Accumulator a = a – b*c MPY Multiply a = b*c MPY.N Multiply and Negate Result a = -b*c ED Partial Euclidean Distance a = (b – c)2 EDAC Add Partial Euclidean Distance to the Accumulator a = a + (b – c)2 Note: DSP instructions using the multiplier can operate in Fractional (1.15) or Integer modes. MCU Instruction Description MUL/MUL.UU Multiply two unsigned integers MUL.SS Multiply two signed integers MUL.SU/MUL.US Multiply a signed integer with an unsigned integer Note 1: MCU instructions using the multiplier operate only in Integer mode. 2: Result of an MCU multiply is 32-bits long and is stored in a pair of W registers. © 2004 Microchip Technology Inc. DS70049C-page 2-23 Section 2. CPU CPU 2 2.6.3 Data Accumulator Adder/Subtractor The data accumulators have a 40-bit adder/subtractor with automatic sign extension logic for the multiplier result (if signed). It can select one of two accumulators (A or B) as its pre-accumulation source and post-accumulation destination. For the ADD (accumulator) and LAC instructions, the data to be accumulated or loaded can optionally be scaled via the barrel shifter prior to accumulation. The 40-bit adder/subtractor may optionally negate one of its operand inputs to change the sign of the result (without changing the operands). The negate is used during multiply and subtract (MSC), or multiply and negate (MPY.N) operations. The 40-bit adder/subtractor has an additional saturation block which controls accumulator data saturation, if enabled. 2.6.3.1 Accumulator Status Bits Six Status register bits have been provided to support saturation and overflow. They are located in the CPU Status register, SR, and are listed below: Table 2-5: Accumulator Overflow and Saturation Status Bits The OA and OB bits are read only and are modified each time data passes through the accumulator add/subtract logic. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). This type of overflow is not catastrophic; the guard bits preserve the accumulator data. The OAB status bit is the logically ORed value of OA and OB. The OA and OB bits, when set, can optionally generate an arithmetic error trap. The trap is enabled by setting the corresponding overflow trap flag enable bit OVATE:OVBTE (INTCON1<10:9>). The trap event allows the user to take immediate corrective action, if desired. The SA and SB bits can be set each time data passes through the accumulator saturation logic. Once set, these bits remain set until cleared by the user. The SAB status bit indicates the logically ORed value of SA and SB. The SA and SB bits will be cleared when SAB is cleared. When set, these bits indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, the SA and SB bits indicate that a catastrophic overflow has occurred (the sign of the accumulator has been destroyed). If the COVTE (INTCON1<8>) bit is set, SA and SB bits will generate an arithmetic error trap when saturation is disabled. Status Bit Location Description OA SR<15> Accumulator A overflowed into guard bits (ACCA<39:32>) OB SR<14> Accumulator B overflowed into guard bits(ACCB<39:32>) SA SR<13> ACCA saturated (bit 31 overflow and saturation) or ACCA overflowed into guard bits and saturated (bit 39 overflow and saturation) SB SR<12> ACCB saturated (bit 31 overflow and saturation) or ACCB overflowed into guard bits and saturated (bit 39 overflow and saturation) OAB SR<11> OA logically ORed with OB SAB SR<10> SA logically ORed with SB. Clearing SAB will also clear SA and SB. Note: See Section 6. “Reset Interrupts” for further information on arithmetic warning traps. Note: The user must remember that SA, SB and SAB status bits can have different meanings depending on whether accumulator saturation is enabled. The Accumulator Saturation mode is controlled via the CORCON register. dsPIC30F Family Reference Manual DS70049C-page 2-24 © 2004 Microchip Technology Inc. 2.6.3.2 Saturation and Overflow Modes The device supports three Saturation and Overflow modes. 1. Accumulator 39-bit Saturation: In this mode, the saturation logic loads the maximally positive 9.31 value (0x7FFFFFFFFF), or maximally negative 9.31 value (0x8000000000), into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. This Saturation mode is useful for extending the dynamic range of the accumulator. To configure for this mode of saturation, the ACCSAT(CORCON<4>) bit must be set. Additionally, the SATA and/or SATB (CORCON<7 and/or 6>) bits must be set to enable accumulator saturation. 2. Accumulator 31-bit Saturation: In this mode, the saturation logic loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0xFF80000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. When this Saturation mode is in effect, the guard bits 32 through 39 are not used, except for sign-extension of the accumulator value. Consequently, the OA, OB or OAB bits in SR will never be set. To configure for this mode of overflow and saturation, the ACCSAT (CORCON<4>) bit must be cleared. Additionally, the SATA and/or SATB (CORCON<7 and/or 6>) bits must be set to enable accumulator saturation. 3. Accumulator Catastrophic Overflow: If the SATA and/or SATB (CORCON<7 and/or 6>) bits are not set, then no saturation operation is performed on the accumulator and the accumulator is allowed to overflow all the way up to bit 39 (destroying its sign). If the COVTE bit (INTCON1<8>) is set, a catastrophic overflow will initiate an arithmetic error trap. Note that accumulator saturation and overflow detection can only result from the execution of a DSP instruction that modifies one of the two accumulators via the 40-bit DSP ALU. Saturation and overflow detection will not take place when the accumulators are accessed as memory mapped registers via MCU class instructions. Furthermore, the accumulator status bits shown in Table 2-5 will not be modified. However, the MCU status bits (Z, N, C, OV, DC) will be modified depending on the MCU instruction that accesses the accumulator. 2.6.3.3 Data Space Write Saturation In addition to adder/subtractor saturation, writes to data space can be saturated without affecting the contents of the source accumulator. This feature allows data to be limited while not sacrificing the dynamic range of the accumulator during intermediate calculation stages. Data space write saturation is enabled by setting the SATDW control bit (CORCON<5>). Data space write saturation is enabled by default at a device Reset. The data space write saturation feature works with the SAC and SAC.R instructions. The value held in the accumulator is never modified when these instructions are executed. The hardware takes the following steps to obtain the saturated write result: 1. The read data is scaled based upon the arithmetic shift value specified in the instruction. 2. The scaled data is rounded (SAC.R only). 3. The scaled/rounded value is saturated to a 16-bit result based on the value of the guard bits. For data values greater than 0x007FFF, the data written to memory is saturated to the maximum positive 1.15 value, 0x7FFF. For input data less than 0xFF8000, data written to memory is saturated to the maximum negative 1.15 value, 0x8000. Note: See Section 6. “Reset Interrupts” for further information on arithmetic error traps. © 2004 Microchip Technology Inc. DS70049C-page 2-25 Section 2. CPU CPU 2 2.6.3.4 Accumulator ‘Write Back’ The MAC and MSC instructions can optionally write a rounded version of the accumulator that is not the target of the current operation into data space memory. The write is performed across the X-bus into combined X and Y address space. This accumulator write back feature is beneficial in certain FFT and LMS algorithms. The following Addressing modes are supported by the accumulator write back hardware: 1. W13, register direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fractional result. 2. [W13]+=2, register indirect with post-increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2. 2.6.4 Round Logic The round logic can perform a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND (CORCON<1>) bit. It generates a 16-bit, 1.15 data value, which is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored. The two Rounding modes are shown in Figure 2-11. Conventional rounding takes bit 15 of the accumulator, zero-extends it and adds it to the MSWord excluding the guard or overflow bits (bits 16 through 31). If the LSWord of the accumulator is between 0x8000 and 0xFFFF (0x8000 included), the MSWord is incremented. If the LSWord of the accumulator is between 0x0000 and 0x7FFF, the MSWord is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value will tend to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding except when the LSWord equals 0x8000. If this is the case, the LSbit of the MSWord (bit 16 of the accumulator) is examined. If it is ‘1’, the MSWord is incremented. If it is ‘0’, the MSWord is not modified. Assuming that bit 16 is effectively random in nature, this scheme will remove any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X-bus (subject to data saturation, see Section 2.6.3.3 “Data Space Write Saturation”). Note that for the MAC class of instructions, the accumulator write back data path is always subject to rounding. Figure 2-11: Conventional and Convergent Rounding Modes 16 15 0 16 15 0 16 15 0 16 15 0 1XXX XXXX XXXX XXXX 1000 0000 0000 0000 0XXX XXXX XXXX XXXX 1000 0000 0000 0000 1 0 Conventional (Biased) Convergent (Unbiased) Round Up (add 1 to MSWord) when: Round Down (add nothing) when: Round Up (add 1 to MSWord) when: 1. LSWord = 0x8000 and bit 16 = 1 2. LSWord > 0x8000 LSWord >= 0x8000 LSWord < 0x8000 Round Down (add nothing) when: 1. LSWord = 0x8000 and bit 16 = 0 2. LSWord < 0x8000 MSWord MSWord MSWord MSWord dsPIC30F Family Reference Manual DS70049C-page 2-26 © 2004 Microchip Technology Inc. 2.6.5 Barrel Shifter The barrel shifter is capable of performing up to a 16-bit arithmetic right shift, or up to a 16-bit left shift, in a single cycle. The barrel shifter can be used by DSP instructions or MCU instructions for multi-bit shifts. The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation: • A positive value will shift the operand right • A negative value will shift the operand left • A value of ‘0’ will not modify the operand The barrel shifter is 40-bits wide to accommodate the width of the accumulators. A 40-bit output result is provided for DSP shift operations, and a 16-bit result for MCU shift operations. A summary of instructions that use the barrel shifter is provided below in Table 2-6. Table 2-6: Instructions that Utilize the DSP Engine Barrel Shifter 2.6.6 DSP Engine Mode Selection The various operational characteristics of the DSP engine discussed in previous sub-sections can be selected through the CPU Core Configuration register (CORCON). These are listed below: • Fractional or integer multiply operation. • Conventional or convergent rounding. • Automatic saturation on/off for ACCA. • Automatic saturation on/off for ACCB. • Automatic saturation on/off for writes to data memory. • Accumulator Saturation mode selection. 2.6.7 DSP Engine Trap Events The various arithmetic error traps that can be generated for handling exceptions in the DSP engine are selected through the Interrupt Control register (INTCON1). These are listed below: • Trap on ACCA overflow enable, using OVATE (INTCON1<10>). • Trap on ACCB overflow enable, using OVBTE (INTCON1<9>). • Trap on catastrophic ACCA and/or ACCB overflow enable, using COVTE (INTCON1<8>). An arithmetic error trap will also be generated when the user attempts to shift a value beyond the maximum allowable range (+/- 16 bits) using the SFTAC instruction. This trap source cannot be disabled. The execution of the instruction will complete, but the results of the shift will not be written to the target accumulator. For further information on bits in the INTCON1 register and arithmetic error traps, please refer to Section 6. “Reset Interrupts”. Instruction Description ASR Arithmetic multi-bit right shift of data memory location LSR Logical multi-bit right shift of data memory location SL Multi-bit shift left of data memory location SAC Store DSP accumulator with optional shift SFTAC Shift DSP accumulator © 2004 Microchip Technology Inc. DS70049C-page 2-27 Section 2. CPU CPU 2 2.7 Divide Support The dsPIC30F supports the following types of division operations: • DIVF: 16/16 signed fractional divide • DIV.SD: 32/16 signed divide • DIV.UD: 32/16 unsigned divide • DIV.SW: 16/16 signed divide • DIV.UW: 16/16 unsigned divide The quotient for all divide instructions is placed in W0, and the remainder in W1. The 16-bit divisor can be located in any W register. A 16-bit dividend can be located in any W register and a 32-bit dividend must be located in an adjacent pair of W registers. All divide instructions are iterative operations and must be executed 18 times within a REPEAT loop. The user is responsible for programming the REPEAT instruction. A complete divide operation takes 19 instruction cycles to execute. The divide flow is interruptible, just like any other REPEAT loop. All data is restored into the respective data registers after each iteration of the loop, so the user will be responsible for saving the appropriate W registers in the ISR. Although they are important to the divide hardware, the intermediate values in the W registers have no meaning to the user. The divide instructions must be executed 18 times in a REPEAT loop to produce a meaningful result. Refer to the “dsPIC30F Programmer’s Reference Manual” (DS70030) for more information and programming examples for the divide instructions. 2.8 Instruction Flow Types Most instructions in the dsPIC30F architecture occupy a single word of program memory and execute in a single cycle. An instruction pre-fetch mechanism facilitates single cycle (1 TCY) execution. However, some instructions take 2 or 3 instruction cycles to execute. Consequently, there are seven different types of instruction flow in the dsPIC® architecture. These are described below: 1. 1 Instruction Word, 1 Instruction Cycle: These instructions will take one instruction cycle to execute as shown in Figure 2-12. Most instructions are 1-word, 1-cycle instructions. Figure 2-12: Instruction Flow – 1-Word, 1-Cycle 2. 1 Instruction Word, 2 Instruction Cycles: In these instructions, there is no pre-fetch flush. The only instructions of this type are the MOV.D instructions (load and store double-word). Two cycles are required to complete these instructions, as shown in Figure 2-13. Figure 2-13: Instruction Flow – 1-Word, 2-Cycle (MOV.D Operation) TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOV #0x55AA,W0 Fetch 1 Execute 1 2. MOV W0,PORTA Fetch 2 Execute 2 3. MOV W0,PORTB Fetch 3 Execute 3 TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOV #0x1234,W0 Fetch 1 Execute 1 2. MOV.D [W0++],W1 Fetch 2 Execute 2 R/W Cycle 1 3. MOV #0x00AA,W1 Fetch 3 Execute 2 R/W Cycle2 No Fetch Execute 3 4. MOV #0x00CC,W0 Fetch 4 Execute 4 dsPIC30F Family Reference Manual DS70049C-page 2-28 © 2004 Microchip Technology Inc. 3. 1 Instruction Word, 2 or 3 Instruction Cycle Program Flow Changes: These instructions include relative call and branch instructions, and skip instructions. When an instruction changes the PC (other than to increment it), the program memory pre-fetch data must be discarded. This makes the instruction take two effective cycles to execute, as shown in Figure 2-14. Figure 2-14: Instruction Flow – 1-Word, 2-Cycle (Program Flow Change) Three cycles will be taken when a two-word instruction is skipped. In this case, the program memory pre-fetch data is discarded and the second word of the two-word instruction is fetched. The second word of the instruction will be executed as a NOP, as shown in Figure 2-15. Figure 2-15: Instruction Flow – 1-Word, 3-Cycle (2-Word Instruction Skipped) 4. 1 Instruction Word, 3 Instruction Cycles (RETFIE, RETURN, RETLW): The RETFIE, RETURN and RETLW instructions, that are used to return from a subroutine call or an Interrupt Service Routine, take 3 instruction cycles to execute, as shown in Figure 2-16. Figure 2-16: Instruction Flow – 1-Word, 3-Cycle (RETURN, RETFIE, RETLW) TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOV.B #0x55,W0 Fetch 1 Execute 1 2. BTSC PORTA,#3 Fetch 2 Execute 2 Skip Taken 3. ADD.B PORTA (executed as FNOP) Fetch 3 Forced NOP 4. BRA SUB_1 Fetch 4 Execute 4 5. ADD.B PORTB (executed as FNOP) Fetch 5 Forced NOP 6. SUB_1: Instruction @ address SUB_1 Fetch SUB_1 TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. BTSC SR,#Z Fetch 1 Execute 1, Skip Taken 2. GOTO LABEL Fetch 2 Forced NOP (GOTO 2nd word) Fetch 2nd word of GOTO 2nd word executed as a NOP 3. BCLR PORTB,#3 Fetch 3 Execute 3 4. MOV W0,W1 Fetch 4 Execute 4 TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOV #0x55AA,W0 Fetch 1 Execute 1 2. RETURN Fetch 2 Execute 2 3. (instruction in old program flow) Fetch 3 Execute 2 4. MOV W0, W3 (instruction in new program flow) No Fetch Execute 2 5. MOV W3, W5 Fetch 4 Execute 4 Fetch 5 © 2004 Microchip Technology Inc. DS70049C-page 2-29 Section 2. CPU CPU 2 5. Table Read/Write Instructions: These instructions will suspend fetching to insert a read or write cycle to the program memory. The instruction fetched while executing the table operation is saved for 1 cycle and executed in the cycle immediately after the table operation as shown in Figure 2-17. Figure 2-17: Instruction Pipeline Flow – Table Operations 6. 2 Instruction Words, 2 Instruction Cycles: In these instructions, the fetch after the instruction contains data. This results in a 2-cycle instruction as shown in Figure 2-18. The second word of a two-word instruction is encoded so that it will be executed as a NOP, should it be fetched by the CPU without first fetching the first word of the instruction. This is important when a two-word instruction is skipped by a skip instruction (see Figure 2-15). Figure 2-18: Instruction Pipeline Flow – 2-Word, 2-Cycle 7. Address Register Dependencies: These are instructions that are subjected to a stall due to a data address dependency between the X-data space read and write operations. An additional cycle is inserted to resolve the resource conflict as discussed in Section 2.10 “Address Register Dependencies”. Figure 2-19: Instruction Pipeline Flow – 1-Word, 1-Cycle (With Instruction Stall) TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOV #0x1234,W0 Fetch 1 Execute 1 2. TBLRDL.w [W0++],W1 Fetch 2 Execute 2 3. MOV #0x00AA,W1 Fetch 3 PM Data Read Cycle Bus Read Execute 3 4. MOV #0x00CC,W0 Fetch 4 Execute 4 TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOV #0xAA55,W0 Fetch 1 Execute 1 2. GOTO LABEL Fetch 2L Update PC Fetch 2H Forced NOP 3. LABEL: MOV W0,W2 Fetch 3 Execute 3 4. BSET PORTA, #3 Fetch 4 Execute 4 TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOV W0,W1 Fetch 1 Execute 1 2. MOV [W1],[W4] Fetch 2 Execute 1 Stall Execute 2 3. MOV W2,W1 Fetch 3 Execute 3 dsPIC30F Family Reference Manual DS70049C-page 2-30 © 2004 Microchip Technology Inc. 2.9 Loop Constructs The dsPIC30F supports both REPEAT and DO instruction constructs to provide unconditional automatic program loop control. The REPEAT instruction is used to implement a single instruction program loop. The DO instruction is used to implement a multiple instruction program loop. Both instructions use control bits within the CPU Status register, SR, to temporarily modify CPU operation. 2.9.1 Repeat Loop Construct The REPEAT instruction causes the instruction that follows it to be repeated a number of times. A literal value contained in the instruction or a value in one of the W registers can be used to specify the repeat count value. The W register option enables the loop count to be a software variable. An instruction in a REPEAT loop will be executed at least once. The number of iterations for a repeat loop will be the 14-bit literal value + 1, or Wn + 1. The syntax for the two forms of the REPEAT instruction is given below: REPEAT #lit14 ; RCOUNT <-- lit14 (Valid target Instruction) or REPEAT Wn ; RCOUNT <-- Wn (Valid target Instruction) 2.9.1.1 Repeat Operation The loop count for Repeat operations is held in the 14-bit RCOUNT register, which is memory mapped. RCOUNT is initialized by the REPEAT instruction. The REPEAT instruction sets the Repeat Active, or RA (SR<4>) status bit to ‘1’, if the RCOUNT is a non-zero value. RA is a read only bit and cannot be modified through software. For repeat loop count values greater than ‘0’, the PC is not incremented. Further PC increments are inhibited until RCOUNT = 0. See Figure 2-20 for an instruction flow example of a Repeat loop. For a loop count value equal to ‘0’, REPEAT has the effect of a NOP and the RA (SR<4>) bit is not set. The Repeat loop is essentially disabled before it begins, allowing the target instruction to execute only once while pre-fetching the subsequent instruction (i.e., normal execution flow). Figure 2-20: REPEAT Instruction Pipeline Flow Note: The instruction immediately following the REPEAT instruction (i.e., the target instruction) is always executed at least one time. It is always executed one time more than the value specified in the 14-bit literal or the W register operand. TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1.REPEAT #0x2 Fetch 1 Execute 1 2.MAC W4*W5,A,[W8]+=2,W4 Fetch 2 Execute 2 No Fetch Execute 2 No Fetch Execute 2 3.BSET PORTA,#3 Fetch 3 Execute 3 PC (at end of instruction) PC PC+2 PC+2 PC+2 PC+4 PC+6 RCOUNT (at end of instruction) X210 0 0 RA (at end of instruction) 0110 0 0 © 2004 Microchip Technology Inc. DS70049C-page 2-31 Section 2. CPU CPU 2 2.9.1.2 Interrupting a REPEAT Loop A REPEAT instruction loop may be interrupted at any time. The RA state is preserved on the stack during exception processing to allow the user to execute further REPEAT loops from within (any number) of nested interrupts. After SRL is stacked, the RA status bit is cleared to restore normal execution flow within the ISR. Returning into a Repeat loop from an ISR using RETFIE requires no special handling. Interrupts will pre-fetch the repeated instruction during the third cycle of the RETFIE. The stacked RA bit will be restored when the SRL register is popped and, if set, the interrupted Repeat loop will be resumed. 2.9.1.2.1 Early Termination of a Repeat Loop An interrupted Repeat loop can be terminated earlier than normal in the ISR by clearing the RCOUNT register in software. 2.9.1.3 Restrictions on the REPEAT Instruction Any instruction can immediately follow a REPEAT except for the following: 1. Program Flow Control instructions (any branch, compare and skip, subroutine calls, returns, etc.). 2. Another REPEAT or DO instruction. 3. DISI, ULNK, LNK, PWRSAV, RESET. 4. MOV.D instruction. Note: If a Repeat loop has been interrupted and an ISR is being processed, the user must stack the RCOUNT (Repeat Count register) prior to executing another REPEAT instruction within an ISR. Note: If Repeat was used within an ISR, the user must unstack RCOUNT prior to executing RETFIE. Note: Should the repeated instruction (target instruction in the Repeat loop) be accessing data from PS using PSV, the first time it is executed after a return from an exception will require 2 instruction cycles. Similar to the first iteration of a loop, timing limitations will not allow the first instruction to access data residing in PS in a single instruction cycle. Note: There are some instructions and/or Instruction Addressing modes that can be executed within a Repeat loop, but make little sense when repeated. dsPIC30F Family Reference Manual DS70049C-page 2-32 © 2004 Microchip Technology Inc. 2.9.2 DO Loop Construct The DO instruction can execute a group of instructions that follow it a specified number of times without software overhead. The set of instructions up to and including the end address will be repeated. The repeat count value for the DO instruction can be specified by a 14-bit literal or by the contents of a W register declared within the instruction. The syntax for the two forms of the DO instruction is given below: DO #lit14,LOOP_END ; DCOUNT <-- lit14 Instruction1 Instruction2 : : LOOP_END: Instruction n DO Wn,LOOP_END ; DCOUNT <-- Wn<13:0> Instruction1 Instruction2 : : LOOP_END: Instruction n The following features are provided in the DO loop construct: • A W register can be used to specify the loop count. This allows the loop count to be defined at run-time. • The instruction execution order need not be sequential (i.e., there can be branches, subroutine calls, etc.). • The loop end address does not have to be greater than the start address. 2.9.2.1 DO Loop Registers and Operation The number of iterations executed by a DO loop will be the (14-bit literal value +1) or the (Wn value + 1). If a W register is used to specify the number of iterations, the two MSbits of the W register are not used to specify the loop count. The operation of a DO loop is similar to the ‘do-while’ construct in the C programming language because the instructions in the loop will always be executed at least once. The dsPIC30F has three registers associated with DO loops: DOSTART, DOEND and DCOUNT. These registers are memory mapped and automatically loaded by the hardware when the DO instruction is executed. DOSTART holds the starting address of the DO loop while DOEND holds the end address of the DO loop. The DCOUNT register holds the number of iterations to be executed by the loop. DOSTART and DOEND are 22-bit registers that hold the PC value. The MSbits and LSbits of these registers is fixed to ‘0’. Refer to Figure 2-2 for further details. The LSbit is not stored in these registers because PC<0> is always forced to ‘0’. The DA status bit (SR<9>) indicates that a single DO loop (or nested DO loops) is active. The DA bit is set when a DO instruction is executed and enables a PC address comparison with the DOEND register on each subsequent instruction cycle. When PC matches the value in DOEND, DCOUNT is decremented. If the DCOUNT register is not zero, the PC is loaded with the address contained in the DOSTART register to start another iteration of the DO loop. The DO loop will terminate when DCOUNT = 0. If there are no other nested DO loops in progress, then the DA bit will also be cleared. Note: The group of instructions in a DO loop construct is always executed at least one time. The DO loop is always executed one time more than the value specified in the literal or W register operand. © 2004 Microchip Technology Inc. DS70049C-page 2-33 Section 2. CPU CPU 2 2.9.2.2 DO Loop Nesting The DOSTART, DOEND and DCOUNT registers each have a shadow register associated with them, such that the DO loop hardware supports one level of automatic nesting. The DOSTART, DOEND and DCOUNT registers are user accessible and they may be manually saved to permit additional nesting, where required. The DO Level bits, DL<2:0> (CORCON<10:8>) indicate the nesting level of the DO loop currently being executed. When the first DO instruction is executed, DL<2:0> is set to B‘001’ to indicate that one level of DO loop is underway. The DA (SR<9>) is also set. When another DO instruction is executed within the first DO loop, the DOSTART, DOEND and DCOUNT registers are transferred into the shadow registers, prior to being updated with the new loop values. The DL<2:0> bits are set to B‘010’ indicating that a second, nested DO loop is in progress. The DA (SR<9>) bit also remains set. If no more than one level of DO loop nesting is required in the application, no special attention is required. Should the user require more than one level of DO loop nesting, this may be achieved through manually saving the DOSTART, DOEND and DCOUNT registers prior to executing the next DO instruction. These registers should be saved whenever DL<2:0> is B’010’ or greater. The DOSTART, DOEND and DCOUNT registers will automatically be restored from their shadow registers when a DO loop terminates and DL<2:0> = B’010’. 2.9.2.3 Interrupting a DO Loop DO loops may be interrupted at any time. If another DO loop is to be executed during the ISR, the user must check the DL<2:0> status bits and save the DOSTART, DOEND and DCOUNT registers as required. No special handling is required if the user can ensure that only one level of DO loop will ever be executed in: • both background and any one ISR handler (if interrupt nesting is enabled) or • both background and any ISR (if interrupt nesting is disabled) Alternatively, up to two (nested) DO loops may be executed in either background or within any • one ISR handler (if interrupt nesting is enabled) or • in any ISR (if interrupt nesting is disabled) It is assumed that no DO loops are used within any trap handlers. Returning to a DO loop from an ISR, using the RETFIE instruction, requires no special handling. 2.9.2.4 Early Termination of the DO loop There are two ways to terminate a DO loop, earlier than normal: 1. The EDT (CORCON<11>) bit provides a means for the user to terminate a DO loop before it completes all loops. Writing a ‘1’ to the EDT bit will force the loop to complete the iteration underway and then terminate. If EDT is set during the penultimate or last instruction of the loop, one more iteration of the loop will occur. EDT will always read as a ‘0’; clearing it has no effect. After the EDT bit is set, the user can optionally branch out of the DO loop. 2. Alternatively, the code may branch out of the loop at any point except from the last instruction, which cannot be a flow control instruction. Although the DA bit enables the DO loop hardware, it will have no effect unless the address of the penultimate instruction is encountered during an instruction pre-fetch. This is not a recommended method for terminating a DO loop. Note: The DL<2:0> (CORCON<10:8>) bits are combined (logically OR-ed) to form the DA (SR<9>) bit. If nested DO loops are being executed, the DA bit is cleared only when the loop count associated with the outer most loop expires. Note: Exiting a DO loop without using EDT is not recommended because the hardware will continue to check for DOEND addresses. dsPIC30F Family Reference Manual DS70049C-page 2-34 © 2004 Microchip Technology Inc. 2.9.2.5 DO Loop Restrictions DO loops have the following restrictions imposed: • choice of last instruction in the loop • the loop length (offset from the first instruction) • reading of the DOEND register All DO loops must contain at least 2 instructions because the loop termination tests are performed in the penultimate instruction. REPEAT should be used for single instruction loops. The special function register, DOEND, cannot be read by user software in the instruction that immediately follows either a DO instruction, or a file register write operation to the DOEND SFR. The instruction that is executed two instructions before the last instruction in a DO loop should not modify any of the following: • CPU priority level governed by the IPL (SR<7:5>) bits • Peripheral Interrupt Enable bits governed by the IEC0, IEC1 and IEC2 registers • Peripheral Interrupt Priority bits governed by the IPC0 through IPC11 registers If the restrictions above are not followed, the DO loop may execute incorrectly. 2.9.2.5.1 Last Instruction Restrictions There are restrictions on the last instruction executed in a DO loop. The last instruction in a DO loop should not be: 1. Flow control instruction (for e.g., any branch, compare and skip, GOTO, CALL, RCALL, TRAP). 2. RETURN, RETFIE and RETLW will work correctly as the last instruction of a DO loop, but the user must be responsible for returning into the loop to complete it. 3. Another REPEAT or DO instruction. 4. Target instruction within a REPEAT loop. This restriction implies that the penultimate instruction also cannot be a REPEAT. 5. Any instruction that occupies two words in program space. 6. DISI instruction 2.9.2.5.2 Loop Length Restrictions Loop length is defined as the signed offset of the last instruction from the first instruction in the DO loop. The loop length when added to the address of the first instruction in the loop forms the address of the last instruction of the loop.There are some loop length values that should be avoided. 1. Loop Length = -2 Execution will start at the first instruction in the loop (i.e., at [PC]) and will continue until the loop end address (in this case [PC – 4]) is pre-fetched. As this is the first word of the DO instruction, it will execute the DO instruction again, re-initializing the DCOUNT and pre-fetching [PC]. This will continue forever as long as the loop end address [PC – 4] is pre-fetched. This value of n has the potential of creating an infinite loop (subject to a Watchdog Timer Reset). end_loop: DO #33, end_loop ;DO is a two-word instruction NOP ;2nd word of DO executes as a NOP ADD W2,W3,W4 ;First instruction in DO loop([PC]) © 2004 Microchip Technology Inc. DS70049C-page 2-35 Section 2. CPU CPU 2 2. Loop Length = -1 Execution will start at the first instruction in the loop (i.e., at [PC]) and will continue until the loop end address ([PC – 2]) is pre-fetched. Since the loop end address is the second word of the DO instruction, it will execute as a NOP but will still pre-fetch [PC]. The loop will then execute again. This will continue as long as the loop end address [PC – 2] is pre-fetched and the loop does not terminate. Should the value in the DCOUNT register reach zero and on a subsequent decrement generate a borrow, the loop will terminate. However, in such a case the initial instruction outside the loop will once again be the first loop instruction. DO #33, end_loop ;DO is a two-word instruction end_loop: NOP ;2nd word of DO executes as a NOP ADD W2,W3,W4 ;First instruction in DO loop([PC]) 3. Loop Length = 0 Execution will start at the first instruction in the loop (i.e., at [PC]) and will continue until the loop end address ([PC]) is pre-fetched. If the loop is to continue, this pre-fetch will cause the DO loop hardware to load the DOEND address ([PC]) into the PC for the next fetch (which will be [PC] again). After the first true iteration of the loop, the first instruction in the loop will be executed repeatedly until the loop count underflows and the loop terminates. When this occurs, the initial instruction outside the loop will be the instruction after [PC]. DO #33, end_loop ;DO is a two-word instruction NOP ;2nd word of DO executes as a NOP end_loop: ADD W2,W3,W4 ;First instruction in DO loop([PC]) 2.10 Address Register Dependencies The dsPIC30F architecture supports a data space read (source) and a data space write (destination) for most MCU class instructions. The effective address (EA) calculation by the AGU and subsequent data space read or write, each take a period of 1 instruction cycle to complete. This timing causes the data space read and write operations for each instruction to partially overlap, as shown in Figure 2-21. Because of this overlap, a ‘Read-After-Write’ (RAW) data dependency can occur across instruction boundaries. RAW data dependencies are detected and handled at run-time by the dsPIC30F CPU. Figure 2-21: Data Space Access Timing ADD MOV [W7] [W10] [W9]++ X-Space Address W7 W10 W8 W9 ADD W0, [W7], [W10] MOV [W8], [W9]++ X-Space RAGU [W8] Instruction Register Contents X-Space WAGU 1 Instruction Cycle (TCY) TCY0 TCY1 TCY2 dsPIC30F Family Reference Manual DS70049C-page 2-36 © 2004 Microchip Technology Inc. 2.10.1 Read-After-Write Dependency Rules If the W register is used as a write operation destination in the current instruction and the W register being read in the pre-fetched instruction are the same, the following rules will apply: 1. If the destination write (current instruction) does not modify the contents of Wn, no stalls will occur. or 2. If the source read (pre-fetched instruction) does not calculate an EA using Wn, no stalls will occur. During each instruction cycle, the dsPIC30F hardware automatically checks to see if a RAW data dependency is about to occur. If the conditions specified above are not satisfied, the CPU will automatically add a one instruction cycle delay before executing the pre-fetched instruction. The instruction stall provides enough time for the destination W register write to take place before the next (pre-fetched) instruction has to use the written data. Table 2-7: Read-After-Write Dependency Summary 2.10.2 Instruction Stall Cycles An instruction stall is essentially a one instruction cycle wait period appended in front of the read phase of an instruction, in order to allow the prior write to complete before the next read operation. For the purposes of interrupt latency, it should be noted that the stall cycle is associated with the instruction following the instruction where it was detected (i.e., stall cycles always precede instruction execution cycles). Destination Addressing Mode using Wn Source Addressing Mode using Wn Status Examples (Wn = W2) Direct Direct Allowed ADD.w W0, W1, W2 MOV.w W2, W3 Direct Indirect Stall ADD.w W0, W1, W2 MOV.w [W2], W3 Direct Indirect with modification Stall ADD.w W0, W1, W2 MOV.w [W2++], W3 Indirect Direct Allowed ADD.w W0, W1, [W2] MOV.w W2, W3 Indirect Indirect Allowed ADD.w W0, W1, [W2] MOV.w [W2], W3 Indirect Indirect with modification Allowed ADD.w W0, W1, [W2] MOV.w [W2++], W3 Indirect with modification Direct Allowed ADD.w W0, W1, [W2++] MOV.w W2, W3 Indirect Indirect Stall ADD.w W0, W1, [W2] MOV.w [W2], W3 ; W2=0x0004 (mapped W2) Indirect Indirect with modification Stall ADD.w W0, W1, [W2] MOV.w [W2++], W3 ; W2=0x0004 (mapped W2) Indirect with modification Indirect Stall ADD.w W0, W1, [W2++] MOV.w [W2], W3 Indirect with modification Indirect with modification Stall ADD.w W0, W1, [W2++] MOV.w [W2++], W3 © 2004 Microchip Technology Inc. DS70049C-page 2-37 Section 2. CPU CPU 2 If a RAW data dependency is detected, the dsPIC30F will begin an instruction stall. During an instruction stall, the following events occur: 1. The write operation underway (for the previous instruction) is allowed to complete as normal. 2. Data space is not addressed until after the instruction stall. 3. PC increment is inhibited until after the instruction stall. 4. Further instruction fetches are inhibited until after the instruction stall. 2.10.2.1 Instruction Stall Cycles and Interrupts When an interrupt event coincides with two adjacent instructions that will cause an instruction stall, one of two possible outcomes could occur: 1. The interrupt could be coincident with the first instruction. In this situation, the first instruction will be allowed to complete and the second instruction will be executed after the ISR completes. In this case, the stall cycle is eliminated from the second instruction because the exception process provides time for the first instruction to complete the write phase. 2. The interrupt could be coincident with the second instruction. In this situation, the second instruction and the appended stall cycle will be allowed to execute prior to the ISR. In this case, the stall cycle associated with the second instruction executes normally. However, the stall cycle will be effectively absorbed into the exception process timing. The exception process proceeds as if an ordinary two-cycle instruction was interrupted. 2.10.2.2 Instruction Stall Cycles and Flow Change Instructions The CALL and RCALL instructions write to the stack using W15 and may, therefore, force an instruction stall prior to the next instruction, if the source read of the next instruction uses W15. The RETFIE and RETURN instructions can never force an instruction stall prior to the next instruction because they only perform read operations. However, the user should note that the RETLW instruction could force a stall, because it writes to a W register during the last cycle. The GOTO and branch instructions can never force an instruction stall because they do not perform write operations. 2.10.2.3 Instruction Stalls and DO and REPEAT Loops Other than the addition of instruction stall cycles, RAW data dependencies will not affect the operation of either DO or REPEAT loops. The pre-fetched instruction within a REPEAT loop does not change until the loop is complete or an exception occurs. Although register dependency checks occur across instruction boundaries, the dsPIC30F effectively compares the source and destination of the same instruction during a REPEAT loop. The last instruction of a DO loop either pre-fetches the instruction at the loop start address or the next instruction (outside the loop). The instruction stall decision will be based on the last instruction in the loop and the contents of the pre-fetched instruction. 2.10.2.4 Instruction Stalls and Program Space Visibility (PSV) When program space (PS) is mapped to data space by enabling the PSV (CORCON<2>) bit, and the X space EA falls within the visible program space window, the read or write cycle is redirected to the address in program space. Accessing data from program space takes up to 3 instruction cycles. Instructions operating in PSV address space are subject to RAW data dependencies and consequent instruction stalls, just like any other instruction. Consider the following code segment: ADD W0,[W1],[W2++] ; PSV = 1, W1=0x8000, PSVPAG=0xAA MOV [W2],[W3] This sequence of instructions would take 5 instruction cycles to execute. 2 instruction cycles are added to perform the PSV access via W1. Furthermore, an instruction stall cycle is inserted to resolve the RAW data dependency caused by W2. dsPIC30F Family Reference Manual DS70049C-page 2-38 © 2004 Microchip Technology Inc. 2.11 Register Maps A summary of the registers associated with the dsPIC30F CPU core is provided in Table 2-8. Table 2-8: dsPIC30F Core Register Map Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State W0 0000 W0 (WREG) 0000 0000 0000 0000 W1 0002 W1 0000 0000 0000 0000 W2 0004 W2 0000 0000 0000 0000 W3 0006 W3 0000 0000 0000 0000 W4 0008 W4 0000 0000 0000 0000 W5 000A W5 0000 0000 0000 0000 W6 000C W6 0000 0000 0000 0000 W7 000E W7 0000 0000 0000 0000 W8 0010 W8 0000 0000 0000 0000 W9 0012 W9 0000 0000 0000 0000 W10 0014 W10 0000 0000 0000 0000 W11 0016 W11 0000 0000 0000 0000 W12 0018 W12 0000 0000 0000 0000 W13 001A W13 0000 0000 0000 0000 W14 001C W14 0000 0000 0000 0000 W15 001E W15 0000 0000 0000 0000 SPLIM 0020 SPLIM 0000 0000 0000 0000 ACCAL 0022 ACCAL 0000 0000 0000 0000 ACCAH 0024 ACCAH 0000 0000 0000 0000 ACCAU 0026 Sign-extension of ACCA<39> ACCAU 0000 0000 0000 0000 ACCBL 0028 ACCBL 0000 0000 0000 0000 ACCBH 002A ACCBH 0000 0000 0000 0000 ACCBU 002C Sign-extension of ACCB<39> ACCBU 0000 0000 0000 0000 PCL 002E PCL 0000 0000 0000 0000 PCH 0030 — — — — — — — — — PCH 0 0000 0000 0000 0000 TBLPAG 0032 — — — — — — — — TBLPAG 0000 0000 0000 0000 PSVPAG 0034 — — — — — — — — PSVPAG 0000 0000 0000 0000 RCOUNT 0036 RCOUNT xxxx xxxx xxxx xxxx DCOUNT 0038 DCOUNT xxxx xxxx xxxx xxxx DOSTARTL 003A DOSTARTL 0 xxxx xxxx xxxx xxx0 DOSTARTH 003C — — — — — — — — — — DOSTARTH 0000 0000 00xx xxxx DOENDL 003E DOENDL 0 xxxx xxxx xxxx xxx0 DOENDH 0040 — — — — — — — — — — DOENDH 0000 0000 00xx xxxx SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000 © 2004 Microchip Technology Inc. DS70049C-page 2-39 Section 2. CPU CPU 2 CORCON 0044 — — — US EDT DL2 DL<1:0> SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000 MODCON 0046 XMODEN YMODEN — — BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000 XMODSRT 0048 XMODSRT<15:0> 0 xxxx xxxx xxxx xxx0 XMODEND 004A XMODEND<15:0> 1 xxxx xxxx xxxx xxx1 YMODSRT 004C YMODSRT<15:0> 0 xxxx xxxx xxxx xxx0 YMODEND 004E YMODEND<15:0> 1 xxxx xxxx xxxx xxx1 XBREV 0050 BREN XBREV<14:0> xxxx xxxx xxxx xxxx DISICNT 0052 — — DISICNT<13:0> 0000 0000 0000 0000 Reserved 0054 - 007E — — — — — — — — — — — — — — — — 0000 0000 0000 0000 Legend: x = uninitiated Note: Refer to the device data sheet for specific Core Register Map details. Table 2-8: dsPIC30F Core Register Map (Continued) Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State dsPIC30F Family Reference Manual DS70049C-page 2-40 © 2004 Microchip Technology Inc. 2.12 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the dsPIC30F CPU module are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2004 Microchip Technology Inc. DS70049C-page 2-41 Section 2. CPU CPU 2 2.13 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates additional technical content for the dsPIC30F CPU module. Revision C This revision incorporates all known errata at the time of this document update. dsPIC30F Family Reference Manual DS70049C-page 2-42 © 2004 Microchip Technology Inc. NOTES: © 2004 Microchip Technology Inc. DS70050C-page 3-1 Data Memory 3 Section 3. Data Memory HIGHLIGHTS This section of the manual contains the following topics: 3.1 Introduction .................................................................................................................... 3-2 3.2 Data Space Address Generator Units (AGUs)............................................................... 3-5 3.3 Modulo Addressing ........................................................................................................ 3-7 3.4 Bit-Reversed Addressing ............................................................................................. 3-14 3.5 Control Register Descriptions ...................................................................................... 3-18 3.6 Related Application Notes............................................................................................3-23 3.7 Revision History ........................................................................................................... 3-24 dsPIC30F Family Reference Manual DS70050C-page 3-2 © 2004 Microchip Technology Inc. 3.1 Introduction The dsPIC30F data width is 16-bits. All internal registers and data space memory are organized as 16-bits wide. The dsPIC30F features two data spaces. The data spaces can be accessed separately (for some DSP instructions) or together as one 64-Kbyte linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. An example data space memory map is shown in Figure 3-1. Data memory addresses between 0x0000 and 0x07FF are reserved for the device special function registers (SFRs). The SFRs include control and status bits for the CPU and peripherals on the device. The RAM begins at address 0x0800 and is split into two blocks, X and Y data space. For data writes, the X and Y data spaces are always accessed as a single, linear data space. For data reads, the X and Y memory spaces can be accessed independently or as a single, linear space. Data reads for MCU class instructions always access the the X and Y data spaces as a single combined data space. Dual source operand DSP instructions, such as the MAC instruction, access the X and Y data spaces separately to support simultaneous reads for the two source operands. MCU instructions can use any W register as an address pointer for a data read or write operation. During data reads, the DSP class of instructions isolates the Y address space from the total data space. W10 and W11 are used as address pointers for reads from the Y data space. The remaining data space is referred to as X space, but could more accurately be described as “X minus Y” space. W8 and W9 are used as address pointers for data reads from the X data space in DSP class instructions. Figure 3-2 shows how the data memory map functions for both MCU class and DSP class instructions. Note that it is the W register number and type of instruction that determines how address space is accessed for data reads. In particular, MCU instructions treat the X and Y memory as a single combined data space. The MCU instructions can use any W register as an address pointer for reads and writes. The DSP instructions that can simultaneously pre-fetch two data operands, split the data memory into two spaces. Specific W registers must be used for read address pointers in this case. Some DSP instructions have the ability to store the accumulator that is not targeted by the instruction to data memory. This function is called “accumulator write back”. W13 must be used as an address pointer to the combined data memory space for accumulator write back operations. For DSP class instructions, W8 and W9 should point to implemented X memory space for all memory reads. If W8 or W9 points to Y memory space, zeros will be returned. If W8 or W9 points to an unimplemented memory address, an address error trap will be generated. For DSP class instructions, W10 and W11 should point to implemented Y memory space for all memory reads. If W10 or W11 points to implemented X memory space, all zeros will be returned. If W10 or W11 points to an unimplemented memory address, an address error trap will be generated. For additional information on address error traps, refer to Section 6. “Reset Interrupts”. Note: The data memory map and the partition between the X and Y data spaces is device specific. Refer to the specific dsPIC30F device data sheet for further details. © 2004 Microchip Technology Inc. DS70050C-page 3-3 Section 3. Data Memory Data Memory 3 Figure 3-1: Example Data Memory Map Note 1: The partition between the X and Y data spaces is device specific. Refer to the appropriate device data sheet for further details. The data space boundaries indicated here are used for example purposes only. 2: Near data memory can be accessed directly via file register instructions that encode a 13-bit address into the opcode. At a minimum, the near data memory region overlaps all of the SFR space and a portion of X memory space. All of X memory space and some or all of Y memory space may be included in the near data memory region, depending on the device variant. 3: All data memory can be accessed indirectly via W registers or directly using the MOV instruction. 4: Upper half of data memory map can be mapped into a segment of program memory space for program space visibility. 0x0000 0x07FE 0x17FE LSByte 16-bits Address MSByte LSByte MSByte Address 0x0001 0x07FF 0x17FF 0xFFFF X Data RAM 0x8001 0x8000 Provides Program Space Visibility Unimplemented 0x27FF 0x27FE 0x2801 0x2800 0x0801 0x0800 0x1801 0x1800 Near Data Memory 0x1FFF SFR Space X Data RAM Y Data RAM dsPIC30F Family Reference Manual DS70050C-page 3-4 © 2004 Microchip Technology Inc. Figure 3-2: Data Spaces for MCU and DSP Instructions 3.1.1 Near Data Memory An 8-Kbyte address space, referred to as near data memory, is reserved in the data memory space between 0x0000 and 0x1FFF. Near data memory is directly addressable via a 13-bit absolute address field within all file register instructions. The memory regions included in the near data region will depend on the amount of data memory implemented for each dsPIC30F device variant. At a minimum, the near data region will include all of the SFRs and some of the X data memory. For devices that have smaller amounts of data memory, the near data region may include all of X memory space and possibly some or all of Y memory space. Refer to Figure 3-1 for more details. (Y SPACE) X SPACE UNUSED X SPACE X SPACE UNUSED UNUSED MCU Class Instructions (Read/Write) Dual Source Operand DSP Instructions (Read) Indirect EA from W10, W11 Indirect EA from W8, W9 Note: Data writes for DSP instructions consider the entire data memory as one combined space. DSP instructions that perform an accumulator write back use W13 as an address pointer for writes to the combined data spaces. DSP Instructions (Write) Y SPACE Note: The entire 64K data space can be addressed directly using the MOV instruction. Refer to the dsPIC30F Programmer’s Reference Manual (DS70030) for further details. © 2004 Microchip Technology Inc. DS70050C-page 3-5 Section 3. Data Memory Data Memory 3 3.2 Data Space Address Generator Units (AGUs) The dsPIC30F contains an X AGU and a Y AGU for generating data memory addresses. Both X and Y AGUs can generate any effective address (EA) within a 64-Kbyte range. However, EAs that are outside the physical memory provided will return all zeros for data reads and data writes to those locations will have no effect. Furthermore, an address error trap will be generated. For more information on address error traps, refer to Section 6. “Reset Interrupts”. 3.2.1 X Address Generator Unit The X AGU is used by all instructions and supports all Addressing modes. The X AGU consists of a read AGU (X RAGU) and a write AGU (X WAGU), which operate independently on separate read and write buses during different phases of the instruction cycle. The X read data bus is the return data path for all instructions that view data space as combined X and Y address space. It is also the X address space data path for the dual operand read instructions (DSP instruction class). The X write data bus is the only write path to the combined X and Y data space for all instructions. The X RAGU starts its effective address calculation during the prior instruction cycle, using information derived from the just pre-fetched instruction. The X RAGU EA is presented to the address bus at the beginning of the instruction cycle. The X WAGU starts its effective address calculation at the beginning of the instruction cycle. The EA is presented to the address bus during the write phase of the instruction. Both the X RAGU and the X WAGU support modulo addressing. Bit-reversed addressing is supported by the X WAGU only. 3.2.2 Y Address Generator Unit The Y data memory space has one AGU that supports data reads from the Y data memory space. The Y memory bus is never used for data writes. The function of the Y AGU and Y memory bus is to support concurrent data reads for DSP class instructions. The Y AGU timing is identical to that of the X RAGU, in that its effective address calculation starts prior to the instruction cycle, using information derived from the pre-fetched instruction. The EA is presented to the address bus at the beginning of the instruction cycle. The Y AGU supports Modulo Addressing and Post-modification Addressing modes for the DSP class of instructions that use it. Note: The Y AGU does not support data writes. All data writes occur via the X WAGU to the combined X and Y data spaces. The Y AGU is only used during data reads for dual source operand DSP instructions. dsPIC30F Family Reference Manual DS70050C-page 3-6 © 2004 Microchip Technology Inc. Figure 3-3: Data Space Access Timing 3.2.3 Address Generator Units and DSP Class Instructions The Y AGU and Y memory data path are used in concert with the X RAGU by the DSP class of instructions to provide two concurrent data read paths. For example, the MAC instruction can simultaneously pre-fetch two operands to be used in the next multiplication. The DSP class of instructions dedicates two W register pointers, W8 and W9, to always operate through the X RAGU and address X data space independently from Y data space, plus two W register pointers, W10 and W11, to always operate through the Y AGU and address Y data space independently from X data space. Any data write performed by a DSP class instruction will take place in the combined X and Y data space and the write will occur across the X-bus. Consequently, the write can be to any address irrespective of where the EA is directed. The Y AGU only supports Post-modification Addressing modes associated with the DSP class of instructions. For more information on Addressing modes, please refer to the dsPIC30F Programmer’s Reference Manual. The Y AGU also supports modulo addressing for automated circular buffers. All other (MCU) class instructions can access the Y data address space through the X AGU when it is regarded as part of the composite linear space. IR X RAGU X WAGU X Data Read [W7] ADD MOV Y Address MAC SUB [W7] [W8]+=2 [--W9] ALU OP ALU OP [W10] [W9++] [W13] [W6++] Stall Check [W10]+=2 Stall Check X Address Y AGU [W7] W10 W9 W8 W13 W9-2 W6 [W8] [W9-2] X Data Write [W10] [W9] [W13] W10 Y Data (Read) [W10] ADD.W W0, [W7], [W10] MOV.W W10, [W9++] MAC W4*W5, A, W4, [W8]+=2, W5, [W10]+=2, [W13]+=2 SUB.W W4, [--W9], [W6++] During Stall Check TCY Q3 © 2004 Microchip Technology Inc. DS70050C-page 3-7 Section 3. Data Memory Data Memory 3 3.2.4 Data Alignment The ISA supports both word and byte operations for all MCU instructions that access data through the X memory AGU. The LSb of a 16-bit data address is ignored for word operations. Word data is aligned in the little-endian format with the LSByte at the even address (LSB = 0) and the MSByte at the odd address (LSB = 1). For byte operations, the LSB of the data address is used to select the byte that is accessed. The addressed byte is placed on the lower 8 bits of the internal data bus. All effective address calculations are automatically adjusted depending on whether a byte or a word access is performed. For example, an address will be incremented by 2 for a word operation that post-increments the address pointer. Figure 3-4: Data Alignment 3.3 Modulo Addressing Modulo, or circular addressing provides an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code as is typical in many DSP algorithms. Any W register, except W15, can be selected as the pointer to the modulo buffer. The modulo hardware performs boundary checks on the address held in the selected W register and automatically adjusts the pointer value at the buffer boundaries, when required. dsPIC30F modulo addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into Program space) and Y data spaces. The modulo data buffer length can be any size up to 32K words. The modulo buffer logic supports buffers using word or byte sized data. However, the modulo logic only performs address boundary checks at word address boundaries, so the length of a byte modulo buffer must be even. In addition, byte-sized modulo buffers cannot be implemented using the Y AGU because byte access is not supported via the Y memory data bus. Note: All word accesses must be aligned to an even address (LSB = 0). Misaligned word data fetches are not supported, so care must be taken when mixing byte and word operations or translating from existing PICmicro code. Should a misaligned word read or write be attempted, an address error trap will occur. A misaligned read operation will complete, but a misaligned write will not take place. The trap will then be taken, allowing the system to examine the machine state prior to execution of the address Fault. 15 8 7 0 0001 0003 0005 0000 0002 0004 Byte 1 Byte 3 Byte 5 MSByte LSByte Word 0 Word 1 0006 0008 Long Word<15:0> 000A Long Word<31:16> 000C Byte 0 Byte 2 Byte 4 dsPIC30F Family Reference Manual DS70050C-page 3-8 © 2004 Microchip Technology Inc. 3.3.1 Modulo Start and End Address Selection Four address registers are available for specifying the modulo buffer start and end addresses: • XMODSRT: X AGU Modulo Start Address Register • XMODEND: X AGU Modulo End Address Register • YMODSRT: Y AGU Modulo Start Address Register • YMODEND: Y AGU Modulo End Address Register The start address for a modulo buffer must be located at an even byte address boundary. The LSB of the XMODSRT and YMODSRT registers is fixed at ‘0’ to ensure the correct modulo start address. The end address for a modulo buffer must be located at an odd byte address boundary. The LSB of the XMODEND and YMODEND registers is fixed to ‘1’ to ensure the correct modulo end address. The start and end address selected for each modulo buffer have certain restrictions, depending on whether an incrementing or decrementing buffer is to be implemented. For an incrementing buffer, a W register pointer is incremented through the buffer address range. When the end address of the incrementing buffer is reached, the W register pointer is reset to point to the start of the buffer. For a decrementing buffer, a W register pointer is decremented through the buffer address range. When the start address of a decrementing buffer is reached, the W register pointer is reset to point to the end of the buffer. 3.3.1.1 Modulo Start Address The data buffer start address is arbitrary, but must be at a ‘zero’ power of two boundary for incrementing modulo buffers. The modulo start address can be any value for decrementing modulo buffers and is calculated using the chosen buffer end address and buffer length. For example, if the buffer length for an incrementing buffer is chosen to be 50 words (100 bytes), then the buffer start byte address must contain 7 Least Significant zeros. Valid start addresses may, therefore, be 0xNN00 and 0xNN80, where ‘N’ is any hexadecimal value. 3.3.1.2 Modulo End Address The data buffer end address is arbitrary but must be at a ‘ones’ boundary for decrementing buffers. The modulo end address can be any value for an incrementing buffer and is calculated using the chosen buffer start address and buffer length. For example, if the buffer size (modulus value) is chosen to be 50 words (100 bytes), then the buffer end byte address for decrementing modulo buffer must contain 7 Least Significant ones. Valid end addresses may, therefore, be 0xNNFF and 0xNN7F, where ‘x’ is any hexadecimal value. Note: The user must decide whether an incrementing or decrementing modulo buffer is required for the application. There are certain address restrictions that depend on whether an incrementing or decrementing modulo buffer is to be implemented. Note: If the required modulo buffer length is an even power of 2, modulo start and end addresses can be chosen that satisfy the requirements for incrementing and decrementing buffers. © 2004 Microchip Technology Inc. DS70050C-page 3-9 Section 3. Data Memory Data Memory 3 3.3.1.3 Modulo Address Calculation The end address for an incrementing modulo buffer must be calculated from the chosen start address and the chosen buffer length in bytes. Equation 3-1 may be used to calculate the end address. Equation 3-1: Modulo End Address for Incrementing Buffer The start address for a decrementing modulo buffer is calculated from the chosen end address and the buffer length, as shown in Equation 3-2. Equation 3-2: Modulo Start Address for Decrementing Buffer 3.3.1.4 Data Dependencies Associated with Modulo Addressing SFRs A write operation to the Modulo Addressing Control register, MODCON, should not be immediately followed by an indirect read operation using any W register. The code segment shown in Example 3-1 will thus lead to unexpected results. Example 3-1: Incorrect MODCON Initialization To work around this problem of initialization, use any Addressing mode other than indirect reads in the instruction that immediately follows the initialization of MODCON. A simple work around to the problem is achieved by adding a NOP after initializing MODCON, as shown in Example 3-2. Example 3-2: Correct MODCON Initialization End Address = Start Address + Buffer Length – 1 Start Address = End Address – Buffer Length + 1 Note 1: Using a POP instruction to pop the contents of the top-of-stack (TOS) location into MODCON, also constitutes a write to MODCON. The instruction immediately following a write to MODCON cannot be any instruction performing an indirect read operation. 2: The user should note that some instructions perform an indirect read operation, implicitly. These are: POP, RETURN, RETFIE, RETLW and ULNK. MOV #0x8FF4, w0 ;Initialize MODCON MOV w0, MODCON MOV [w1], w2 ;Incorrect EA generated here MOV #0x8FF4, w0 ;Initialize MODCON MOV w0, MODCON NOP ;See Note below MOV [w1], w2 ;Correct EA generated here dsPIC30F Family Reference Manual DS70050C-page 3-10 © 2004 Microchip Technology Inc. An additional condition exists for indirect read operations performed immediately after writing to the modulo address SFRs: • XMODSRT • XMODEND • YMODSRT • YMODEND If modulo addressing has already been enabled in MODCON, then a write to the X (or Y) modulo address SFRs should not be immediately followed by an indirect read, using the W register designated for modulo buffer access from X-data space (or Y-data space). The code segment in Example 3-3 shows how initializing the modulo SFRs associated with the X-data space, could lead to unexpected results. A similar example can be made for initialization in Y-data space. Example 3-3: Incorrect Modulo Addressing Setup To work around this issue, insert a NOP, or perform any operation other than an indirect read that uses the W register designated for modulo buffer access, after initializing the modulo address SFRs. This is demonstrated in Example 3-4. Another alternative would be to enable modulo addressing in MODCON after initializing the modulo start and end address SFRs. Example 3-4: Correct Modulo Addressing Setup MOV #0x8FF4, w0 ;Modulo addressing enabled MOV w0, MODCON ;in X-data space using w4 ;for buffer access MOV #0x1200, w4 ;XMODSRT is initialized MOV w4, XMODSRT MOV #0x12FF, w0 ;XMODEND is initialized MOV w0, XMODEND MOV [w4++], w5 ;Incorrect EA generated MOV #0x8FF4, w0 ;Modulo addressing enabled MOV w0, MODCON ;in X-data space using w4 ;for buffer access MOV #0x1200, w4 ;XMODSRT is initialized MOV w4, XMODSRT MOV #0x12FF, w0 ;XMODEND is initialized MOV w0, XMODEND NOP ;See Note below MOV [w4++], w5 ;Correct EA generated here Note: Alternatively, execute other instructions that do not perform indirect read operations, using the W register designated for modulo buffer access. © 2004 Microchip Technology Inc. DS70050C-page 3-11 Section 3. Data Memory Data Memory 3 3.3.2 W Address Register Selection The X address space pointer W register (XWM) to which modulo addressing is to be applied, is stored in MODCON<3:0> (see Register 3-1). The XMODSRT, XMODEND, and the XWM register selection are shared between the X RAGU and X WAGU. Modulo addressing is enabled for X data space when XWM is set to any value other than 15 and the XMODEN bit is set (MODCON<15>). W15 cannot be used as the pointer for modulo addressing because it is the dedicated software stack pointer. The Y address space pointer W register (YWM) to which modulo addressing is to be applied, is stored in MODCON<7:4> (see Register 3-2). Modulo addressing is enabled for Y data space when YWM is set to any value other than 15 and the YMODEN bit is set (MODCON<14>). 3.3.3 Modulo Addressing Applicability Modulo addressing can be applied to the effective address (EA) calculation associated with the selected W register. It is important to realize that the address boundary tests look for addresses equal to or greater than the upper address boundary for incrementing buffers and equal to or less than the lower address boundary for decrementing buffers. Address changes may, therefore, jump over boundaries and still be adjusted correctly. Remember that the automatic adjustment of the W register pointer by the modulo hardware is uni-directional. That is, the W register pointer may not be adjusted correctly by the modulo hardware when the W register pointer for an incrementing buffer is decremented and vice versa. The exception to this rule is when the buffer length is an even power of 2 and the start and end addresses can be chosen to meet the -boundary requirements for both incrementing and decrementing modulo buffers. A new EA can exceed the modulo buffer boundary by up to the length of the buffer and still be successfully corrected. This is important to remember when the Register Indexed ([Wb + Wn]) and Literal Offset ([Wn + lit10]) Addressing modes are used. The user should remember that the Register Indexed and Literal Offset Addressing modes do not change the value held in the W register. Only the indirect with Pre- and Post-modification Addressing modes ([Wn++], [Wn--], [++Wn], [--Wn]) will modify the W register address value. Note: A write to the MODCON register should not be followed by an instruction that performs an indirect read operation using a W register. Unexpected results may occur. Some instructions perform an implicit indirect read. These are:POP, RETURN, RETFIE, RETLW and ULNK. dsPIC30F Family Reference Manual DS70050C-page 3-12 © 2004 Microchip Technology Inc. 3.3.4 Modulo Addressing Initialization for Incrementing Modulo Buffer The following steps describe the setup procedure for an incrementing circular buffer. The steps are similar whether the X AGU or Y AGU is used. 1. Determine the buffer length in 16-bit data words. Multiply this value by 2 to get the length of the buffer in bytes. 2. Select a buffer starting address that is located at a binary ‘zeros’ boundary based on the desired length of the buffer. Remember that the buffer length in words must be multiplied by 2 to obtain the byte address range. For example, a buffer with a length of 100 words (200 bytes) could use 0xXX00 as the starting address. 3. Calculate the buffer end address using the buffer length chosen in Step 1 and the buffer start address chosen in Step 2. The buffer end address is calculated using Equation 3-1. 4. Load the XMODSRT (YMODSRT) register with the buffer start address chosen in Step 2. 5. Load the XMODEND (YMODEND) register with the buffer end address calculated in Step 3. 6. Write to the XWM<3:0> (YWM<3:0>) bits in the MODCON register to select the W register that will be used to access the circular buffer. 7. Set the XMODEN (YMODEN) bit in the MODCON register to enable the circular buffer. 8. Load the selected W register with address that points to the buffer. 9. The W register address will be adjusted automatically at the end of the buffer when an indirect access with pre/post increment is performed (see Figure 3-5). Figure 3-5: Incrementing Buffer Modulo Addressing Operation Example 0x1100 0x1163 Start Addr = 0x1100 End Addr = 0x1163 Length = 50 Words Byte Address MOV #0x1100,W0 MOV W0,XMODSRT ;set modulo start address MOV #0x1163,W0 MOV W0,XMODEND ;set modulo end address MOV #0x8001,W0 MOV W0,MODCON ;enable W1, X AGU for modulo MOV #0x0000,W0 ;W0 holds buffer fill value MOV #0x1100,W1 ;point W1 to buffer DO #49,FILL ;fill the 50 buffer locations FILL: MOV W0,[W1++] ;fill the next location ;W1 = 0x1100 when DO loop completes © 2004 Microchip Technology Inc. DS70050C-page 3-13 Section 3. Data Memory Data Memory 3 3.3.5 Modulo Addressing Initialization for Decrementing Modulo Buffer The following steps describe the setup procedure for a decrementing circular buffer. The steps are similar whether the X AGU or Y AGU is used. 1. Determine the buffer length in 16-bit data words. Multiply this value by 2 to get the length of the buffer in bytes. 2. Select a buffer end address that is located at a binary ‘ones’ boundary, based on the desired length of the buffer. Remember that the buffer length in words must be multiplied by 2 to obtain the byte address range. For example, a buffer with a length of 128 words (256 bytes) could use 0xXXFF as the end address. 3. Calculate the buffer start address using the buffer length chosen in Step 1 and the end address chosen in Step 2. The buffer start address is calculated using Equation 3-2. 4. Load the XMODSRT (YMODSRT) register with the buffer start address chosen in Step 3. 5. Load the XMODEND (YMODEND) register with the buffer end address chosen in Step 2. 6. Write to the XWM<3:0> (YWM<3:0>) bits in the MODCON register to select the W register that will be used to access the circular buffer. 7. Set the XMODEN (YMODEN) bit in the MODCON register to enable the circular buffer. 8. Load the selected W register with address that points to the buffer. 9. The W register address will be adjusted automatically at the end of the buffer when an indirect access with pre/post-decrement is performed (see Figure 3-6). Figure 3-6: Decrementing Buffer Modulo Addressing Operation Example 0x11E0 0x11FF Start Addr = 0x11E0 End Addr = 0x11FF Length = 16 Words Byte Address MOV #0x11E0,W0 MOV W0,XMODSRT ;set modulo start address MOV #0x11FF,W0 MOV W0,XMODEND ;set modulo end address MOV #0x8001,W0 MOV W0,MODCON ;enable W1, X AGU for modulo MOV #0x000F,W0 ;W0 holds buffer fill value MOV #0x11FE,W1 ;point W1 to buffer DO #15,FILL ;fill the 16 buffer locations MOV W0,[W1--] ;fill the next location FILL: DEC W0,W0 ;decrement the fill value ; W1 = 0x11FE when DO loop completes dsPIC30F Family Reference Manual DS70050C-page 3-14 © 2004 Microchip Technology Inc. 3.4 Bit-Reversed Addressing 3.4.1 Introduction to Bit-Reversed Addressing Bit-reversed addressing simplifies data re-ordering for radix-2 FFT algorithms. It is supported through the X WAGU only. Bit-reversed addressing is accomplished by effectively creating a ‘mirror image’ of an address pointer by swapping the bit locations around the center point of the binary value, as shown in Figure 3-7. An example bit-reversed sequence for a 4-bit address field is shown in Table 3-1. Figure 3-7: Bit-Reversed Address Example Table 3-1: Bit-Reversed Address Sequence (16-Entry) b3 b2 b1 b0 b0 b1 b2 b3 Bit locations swapped left-to-right around center of binary value. Bit-Reversed Result Normal Address Bit-Reversed Address A3 A2 A1 A0 decimal A3 A2 A1 A0 decimal 0000 0 0000 0 0001 1 1000 8 0010 2 0100 4 0 0 1 1 3 1 1 0 0 12 0100 4 0010 2 0 1 0 1 5 1 0 1 0 10 0110 6 0110 6 0 1 1 1 7 1 1 1 0 14 1000 8 0001 1 1001 9 1001 9 1 0 1 0 10 0 1 0 1 5 1 0 1 1 11 1 1 0 1 13 1 1 0 0 12 0 0 1 1 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 © 2004 Microchip Technology Inc. DS70050C-page 3-15 Section 3. Data Memory Data Memory 3 3.4.2 Bit-Reversed Addressing Operation Bit-reversed addressing is only supported by the X WAGU and is controlled by the MODCON and XBREV special function registers. Bit-reversed addressing is invoked as follows: 1. Bit-reversed addressing is assigned to one of the W registers using the BWM control bits (MODCON<11:8>). 2. Bit-reversed addressing is enabled by setting the BREN control bit (XBREV<15>). 3. The X AGU bit-reverse modifier is set via the XB control bits (XBREV<14:0>). When enabled, the bit-reversed addressing hardware will generate bit-reversed addresses, only when the register indirect with Pre- or Post-increment Addressing modes are used ([Wn++], [++Wn]). Furthermore, bit-reverse addresses are only generated for Word mode instructions. It will not function for all other Addressing modes or Byte mode instructions (normal addresses will be generated). 3.4.2.1 Modulo Addressing and Bit-Reversed Addressing Modulo addressing and bit-reversed addressing can be enabled simultaneously using the same W register, but bit-reversed addressing operation will always take precedence for data writes when enabled. As an example, the following setup conditions would assign the same W register to modulo and bit-reversed addressing: • X modulo addressing is enabled (XMODEN = 1) • Bit-reverse addressing is enabled (BREN = 1) • W1 assigned to modulo addressing (XWM<3:0> = 0001) • W1 assigned to bit-reversed addressing (BWM<3:0> = 0001) For data reads that use W1 as the pointer, modulo address boundary checking will occur. For data writes using W1 as the destination pointer, the bit-reverse hardware will correct W1 for data re-ordering. 3.4.2.2 Data Dependencies Associated with XBREV If bit-reversed addressing has already been enabled by setting the BREN (XBREV<15>) bit, then a write to the XBREV register should not be followed by an indirect read operation using the W register, designated as the bit reversed address pointer. Note: A write to the MODCON register should not be followed by an instruction that performs an indirect read operation using a W register. Unexpected results may occur. Some instructions perform an implicit indirect read. These are: POP, RETURN, RETFIE, RETLW and ULNK. dsPIC30F Family Reference Manual DS70050C-page 3-16 © 2004 Microchip Technology Inc. 3.4.3 Bit-Reverse Modifier Value The value loaded into the XBREV register is a constant that indirectly defines the size of the bit-reversed data buffer. The XB modifier values used with common bit-reversed buffers are summarized in Table 3-2. Table 3-2: Bit-Reversed Address Modifier Values The bit-reverse hardware modifies the W register address by performing a ‘reverse-carry’ addition of the W contents and the XB modifier constant. A reverse-carry addition is performed by adding the bits from left-to-right instead of right-to-left. If a carry-out occurs in a bit location, the carry out bit is added to the next bit location to the right. Example 3-5 demonstrates the reverse-carry addition and subsequent W register values using 0x0008 as the XB modifier value. Note that the XB modifier is shifted one bit location to the left to generate word address values. Buffer Size (Words) XB Bit-Reversed Address Modifier Value 32768 0x4000 16384 0x2000 8192 0x1000 4096 0x0800 2048 0x0400 1024 0x0200 512 0x0100 256 0x0080 128 0x0040 64 0x0020 32 0x0010 16 0x0008 8 0x0004 4 0x0002 2 0x0001 Note: Only the the bit-reversed modifier values shown will produce valid bit-reversed address sequences. © 2004 Microchip Technology Inc. DS70050C-page 3-17 Section 3. Data Memory Data Memory 3 Example 3-5: XB Address Calculation When XB<14:0> = 0x0008, the bit-reversed buffer size will be 16 words. Bits 1-4 of the W register will be subject to bit-reversed address correction, but bits 5-15 (outside the pivot point) will not be modified by the bit-reverse hardware. Bit 0 is not modified because the bit-reverse hardware only operates on word addresses. The XB modifier controls the ‘pivot point’ for the bit-reverse address modification. Bits outside of the pivot point will not be subject to bit-reversed address corrections. Figure 3-8: Bit-Reversed Address Modification for 16-Word Buffer 0000 0000 0000 0000 Wn points to word 0 +1 0000 Wn = Wn + XB 0000 0000 0001 0000 Wn points to word 8 +1 0000 Wn = Wn + XB 0000 0000 0000 1000 Wn points to word 4 +1 0000 Wn = Wn + XB 0000 0000 0001 1000 Wn points to word 12 +1 0000 Wn = Wn + XB 0000 0000 0000 0100 Wn points to word 2 +1 0000 Wn = Wn + XB 0000 0000 0001 0100 Wn points to word 10 Bit-Reversed Result 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 XB<14:0> = 0x0008 Bits 1-4 of address Pivot Point are modified. dsPIC30F Family Reference Manual DS70050C-page 3-18 © 2004 Microchip Technology Inc. 3.4.4 Bit-Reversed Addressing Code Example The following code example reads a series of 16 data words and writes the data to a new location in bit-reversed order. W0 is the read address pointer and W1 is the write address pointer subject to bit-reverse modification. ; Set XB for 16-word buffer, enable bit reverse addressing MOV #0x8008,W0 MOV W0,XBREV ; Setup MODCON to use W1 for bit reverse addressing MOV #0x01FF,W0 MOV W0,MODCON ; W0 points to input data buffer MOV #Input_Buf,W0 ; W1 points to bit reversed data MOV #Bit_Rev_Buf,W1 ; Re-order the data from Input_Buf into Bit_Rev_Buf REPEAT #15 MOV [W0++],[W1++] 3.5 Control Register Descriptions The following registers are used to control modulo and bit-reversed addressing: • MODCON: Modulo Addressing Control Register • XMODSRT: X AGU Modulo Start Address Register • XMODEND: X AGU Modulo End Address Register • YMODSRT: Y AGU Modulo Start Address Register • YMODEND: Y AGU Modulo End Address Register • XBREV: X AGU Bit-Reverse Addressing Control Register A detailed description of each register is provided on subsequent pages. © 2004 Microchip Technology Inc. DS70050C-page 3-19 Section 3. Data Memory Data Memory 3 Register 3-1: MODCON: Modulo and Bit-Reversed Addressing Control Register Upper Byte: R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 XMODEN YMODEN — — BWM<3:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 YWM<3:0> XWM<3:0> bit 7 bit 0 bit 15 XMODEN: X RAGU and X WAGU Modulus Addressing Enable bit 1 = X AGU modulus addressing enabled 0 = X AGU modulus addressing disabled bit 14 YMODEN: Y AGU Modulus Addressing Enable bit 1 = Y AGU modulus addressing enabled 0 = Y AGU modulus addressing disabled bit 13-12 Unimplemented: Read as ‘0’ bit 11-8 BWM<3:0>: X WAGU Register Select for Bit-Reversed Addressing bits 1111 = Bit-reversed addressing disabled 1110 = W14 selected for bit-reversed addressing 1101 = W13 selected for bit-reversed addressing • • 0000 = W0 selected for bit-reversed addressing bit 7-4 YWM<3:0>: Y AGU W Register Select for Modulo Addressing bits 1111 = Modulo addressing disabled 1010 = W10 selected for modulo addressing 1011 = W11 selected for modulo addressing Note: All other settings of the YWM<3:0> control bits are reserved and should not be used. bit 3-0 XWM<3:0>: X RAGU and X WAGU W Register Select for Modulo Addressing bits 1111 = Modulo addressing disabled 1110 = W14 selected for modulo addressing • • 0000 = W0 selected for modulo addressing Note: A write to the MODCON register should not be followed by an instruction that performs an indirect read operation using a W register. Unexpected results may occur. Some instructions perform an implicit indirect read. These are: POP, RETURN, RETFIE, RETLW and ULNK. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70050C-page 3-20 © 2004 Microchip Technology Inc. Register 3-2: XMODSRT: X AGU Modulo Addressing Start Register Register 3-3: XMODEND: X AGU Modulo Addressing End Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 XS<15:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 XS<7:1> 0 bit 7 bit 0 bit 15-1 XS<15:1>: X RAGU and X WAGU Modulo Addressing Start Address bits bit 0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 XE<15:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 XE<7:1> 1 bit 7 bit 0 bit 15-1 XE<15:1>: X RAGU and X WAGU Modulo Addressing End Address bits bit 0 Unimplemented: Read as ‘1’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70050C-page 3-21 Section 3. Data Memory Data Memory 3 Register 3-4: YMODSRT: Y AGU Modulo Addressing Start Register Register 3-5: YMODEND: Y AGU Modulo Addressing End Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 YS<15:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 YS<7:1> 0 bit 7 bit 0 bit 15-1 YS<15:1>: Y AGU Modulo Addressing Start Address bits bit 0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 YE<15:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 YE<7:1> 1 bit 7 bit 0 bit 15-1 YE<15:1>: Y AGU Modulo Addressing End Address bits bit 0 Unimplemented: Read as ‘1’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70050C-page 3-22 © 2004 Microchip Technology Inc. Register 3-6: XBREV: X Write AGU Bit-Reversal Addressing Control Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BREN XB<14:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 XB<7:0> bit 7 bit 0 bit 15 BREN: Bit-Reversed Addressing (X AGU) Enable bit 1 = Bit-reversed addressing enabled 0 = Bit-reversed addressing disabled bit 14-0 XB<14:0>: X AGU Bit-Reversed Modifier bits 0x4000 = 32768 word buffer 0x2000 = 16384 word buffer 0x1000 = 8192 word buffer 0x0800 = 4096 word buffer 0x0400 = 2048 word buffer 0x0200 = 1024 word buffer 0x0100 = 512 word buffer 0x0080 = 256 word buffer 0x0040 = 128 word buffer 0x0020 = 64 word buffer 0x0010 = 32 word buffer 0x0008 = 16 word buffer 0x0004 = 8 word buffer 0x0002 = 4 word buffer 0x0001 = 2 word buffer Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70050C-page 3-23 Section 3. Data Memory Data Memory 3 3.6 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Data Memory module are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70050C-page 3-24 © 2004 Microchip Technology Inc. 3.7 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates additional technical content for the dsPIC30F Data Memory module. Revision C This revision incorporates all known errata at the time of this document update. © 2005 Microchip Technology Inc. DS70051D-page 4-1 P r o g r a m Memory 4 Section 4. Program Memory HIGHLIGHTS This section of the manual contains the following topics: 4.1 Program Memory Address Map..................................................................................... 4-2 4.2 Program Counter ........................................................................................................... 4-4 4.3 Data Access from Program Memory.............................................................................. 4-4 4.4 Program Space Visibility from Data Space .................................................................... 4-8 4.5 Program Memory Writes .............................................................................................. 4-10 4.6 PSV Code Examples ................................................................................................... 4-11 4.7 Related Application Notes............................................................................................4-12 4.8 Revision History ........................................................................................................... 4-13 dsPIC30F Family Reference Manual DS70051D-page 4-2 © 2005 Microchip Technology Inc. 4.1 Program Memory Address Map The dsPIC30F devices have a 4M x 24-bit program memory address space, shown in Figure 4-1. There are three available methods for accessing program space. 1. Via the 23-bit PC. 2. Via table read (TBLRD) and table write (TBLWT) instructions. 3. By mapping a 32-Kbyte segment of program memory into the data memory address space. The program memory map is divided into the user program space and the user configuration space. The user program space contains the Reset vector, interrupt vector tables, program memory and data EEPROM memory. The user configuration space contains non-volatile configuration bits for setting device options and the device ID locations. © 2005 Microchip Technology Inc. DS70051D-page 4-3 Section 4. Program Memory P r o g r a m Memory 4 Figure 4-1: Example Program Space Memory Map Note: The address boundaries for user Flash program memory and data EEPROM memory will depend on the dsPIC30F device variant that is selected. Refer to the appropriate device data sheet for further details. Reset - Target Address User Memory Space 000000 00007E Level 15 Trap Vector 000002 000080 Device Configuration User Flash Program Memory 018000 017FFE Configuration Memory Space Data EEPROM Level 14 Trap Vector Level 13 Trap Vector Level 12 Trap Vector Level 11 Trap Vector Level 10 Trap Vector Level 9 Trap Vector Level 8 Trap Vector Interrupt 0 Vector Interrupt 1 Vector Interrupt 52 Vector Interrupt 53 Vector (48K Instructions) (4 Kbytes) 800000 F80000 Registers F8000E F80010 DEVID (2) FEFFFE FF0000 FFFFFE Reserved F7FFFE Reserved 7FF000 7FEFFE (Read 0’s) 8005FE 800600 UNITID 000014 Interrupt Vector Table 8005BE 8005C0 Reset - GOTO Instruction 000004 Reserved 7FFFFE Reserved 000100 0000FE 000084 Reserved Level 15 Trap Vector Level 14 Trap Vector Level 13 Trap Vector Level 12 Trap Vector Level 11 Trap Vector Level 10 Trap Vector Level 9 Trap Vector Level 8 Trap Vector Interrupt 0 Vector Interrupt 1 Vector Interrupt 52 Vector Interrupt 53 Vector 000082 Alternate Interrupt Vector Table dsPIC30F Family Reference Manual DS70051D-page 4-4 © 2005 Microchip Technology Inc. 4.2 Program Counter The PC increments by 2 with the LSb set to ‘0’ to provide compatibility with data space addressing. Sequential instruction words are addressed in the 4M program memory space by PC<22:1>. Each instruction word is 24-bits wide. The LSb of the program memory address (PC<0>) is reserved as a byte select bit for program memory accesses from data space that use Program Space Visibility or table instructions. For instruction fetches via the PC, the byte select bit is not required. Therefore, PC<0> is always set to ‘0’. An instruction fetch example is shown in Figure 4-2. Note that incrementing PC<22:1> by one is equivalent to adding 2 to PC<22:0>. Figure 4-2: Instruction Fetch Example 4.3 Data Access from Program Memory There are two methods by which data can be transferred between the program memory and data memory spaces: via special table instructions, or through the remapping of a 32-Kbyte program space page into the upper half of data space. The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the LSWord of any address within program space without going through data space, which is preferable for some applications. The TBLRDH and TBLWTH instructions are the only method whereby the upper 8-bits of a program word can be accessed as data. 22 0 Program Counter 0 0x000000 0x7FFFFE 24-bits Instruction Instruction 23 +1(1) Note 1: Increment of PC<22:1> is equivalent to PC<22:0>+2. 24 23 User Space Latch © 2005 Microchip Technology Inc. DS70051D-page 4-5 Section 4. Program Memory P r o g r a m Memory 4 4.3.1 Table Instruction Summary A set of table instructions is provided to move byte or word-sized data between program space and data space. The table read instructions are used to read from the program memory space into data memory space. The table write instructions allow data memory to be written to the program memory space. The four available table instructions are listed below: • TBLRDL: Table Read Low • TBLWTL: Table Write Low • TBLRDH: Table Read High • TBLWTH: Table Write High For table instructions, program memory can be regarded as two 16-bit word wide address spaces residing side by side, each with the same address range as shown in Figure 4-3. This allows program space to be accessed as byte or aligned word addressable, 16-bit wide, 64-Kbyte pages (i.e., same as data space). TBLRDL and TBLWTL access the LS Data Word of the program memory, and TBLRDH and TBLWTH access the upper word. As program memory is only 24-bits wide, the upper byte from this latter space does not exist, though it is addressable. It is, therefore, termed the ‘phantom’ byte. Figure 4-3: High and Low Address Regions for Table Operations Note: Detailed code examples using table instructions can be found in Section 5. “Flash and EEPROM Programming”. 16 8 0 PC Address 0x000100 0x000102 0x000104 0x000106 23 00000000 00000000 00000000 00000000 Program Memory ‘Phantom’ Byte (Read as ‘0’) ‘HIGH’ Table Address Range ‘LOW’ Table Address Range dsPIC30F Family Reference Manual DS70051D-page 4-6 © 2005 Microchip Technology Inc. 4.3.2 Table Address Generation For all table instructions, a W register address value is concatenated with the 8-bit Data Table Page register, TBLPAG, to form a 23-bit effective program space address plus a byte select bit, as shown in Figure 4-4. As there are 15 bits of program space address provided from the W register, the data table page size in program memory is, therefore, 32K words. Figure 4-4: Address Generation for Table Operations 4.3.3 Program Memory Low Word Access The TBLRDL and TBLWTL instructions are used to access the lower 16 bits of program memory data. The LSb of the W register address is ignored for word-wide table accesses. For byte-wide accesses, the LSb of the W register address determines which byte is read. Figure 4-5 demonstrates the program memory data regions accessed by the TBLRDL and TBLWTL instructions. Figure 4-5: Program Data Table Access (LSWord) TBLPAG 8 bits from TBLPAG EA EA<0> Selects Byte 24-bit EA TBLPAG<7> Selects User/Configuration Space 7 0 15 0 16 bits from Wn 16 8 0 PC Address 0x000100 0x000102 0x000104 0x000106 23 00000000 00000000 00000000 00000000 Program Memory ‘Phantom’ Byte (Read as ‘0’) TBLRDL.W TBLRDL.B (Wn<0> = 1) TBLRDL.B (Wn<0> = 0) © 2005 Microchip Technology Inc. DS70051D-page 4-7 Section 4. Program Memory P r o g r a m Memory 4 4.3.4 Program Memory High Word Access The TBLRDH and TBLWTH instructions are used to access the upper 8 bits of the program memory data. These instructions also support Word or Byte Access modes for orthogonality, but the high byte of the program memory data will always return ‘0’, as shown in Figure 4-6. Figure 4-6: Program Data Table Access (MS Byte) 4.3.5 Data Storage in Program Memory It is assumed that for most applications, the high byte (P<23:16>) will not be used for data, making the program memory appear 16-bits wide for data storage. It is recommended that the upper byte of program data be programmed either as a NOP, or as an illegal opcode value, to protect the device from accidental execution of stored data. The TBLRDH and TBLWTH instructions are primarily provided for array program/verification purposes and for those applications that require compressed data storage. 16 8 0 PC Address 0x000100 0x000102 0x000104 0x000106 23 00000000 00000000 00000000 00000000 Program Memory ‘Phantom’ Byte (Read as ‘0’) TBLRDH.W TBLRDH.B (Wn<0> = 1) TBLRDH.B (Wn<0> = 0) dsPIC30F Family Reference Manual DS70051D-page 4-8 © 2005 Microchip Technology Inc. 4.4 Program Space Visibility from Data Space The upper 32 Kbytes of the dsPIC30F data memory address space may optionally be mapped into any 16K word program space page. This mode of operation is called Program Space Visibility (PSV) and provides transparent access of stored constant data from X data space without the need to use special instructions (i.e., TBLRD, TBLWT instructions). 4.4.1 PSV Configuration Program Space Visibility is enabled by setting the PSV bit (CORCON<2>). A description of the CORCON register can be found in Section 2. “CPU”. When PSV is enabled, each data space address in the upper half of the data memory map will map directly into a program address (see Figure 4-7). The PSV window allows access to the lower 16 bits of the 24-bit program word. The upper 8 bits of the program memory data should be programmed to force an illegal instruction, or a NOP, to maintain machine robustness. Note that table instructions provide the only method of reading the upper 8 bits of each program memory word. Figure 4-8 shows how the PSV address is generated. The 15 LSbs of the PSV address are provided by the W register that contains the effective address. The MSb of the W register is not used to form the address. Instead, the MSb specifies whether to perform a PSV access from program space or a normal access from data memory space. If a W register effective address of 0x8000 or greater is used, the data access will occur from program memory space when PSV is enabled. All accesses will occur from data memory when the W register effective address is less than 0x8000. The remaining address bits are provided by the PSVPAG register (PSVPAG<7:0>), as shown in Figure 4-8. The PSVPAG bits are concatenated with the 15 LSbs of the W register, holding the effective address to form a 23-bit program memory address. PSV can only be used to access values in program memory space. Table instructions must be used to access values in the user configuration space. The LSb of the W register value is used as a byte select bit, which allows instructions using PSV to operate in Byte or Word mode. 4.4.2 PSV Mapping with X and Y Data Spaces The Y data space is located outside of the upper half of data space for most dsPIC30F variants, such that the PSV area will map into X data space. The X and Y mapping will have an effect on how PSV is used in algorithms. As an example, the PSV mapping can be used to store coefficient data for Finite Impulse Response (FIR) filter algorithms. The FIR filter multiplies each value of a data buffer containing historical filter input data with elements of a data buffer that contains constant filter coefficients. The FIR algorithm is executed using the MAC instruction within a REPEAT loop. Each iteration of the MAC instruction pre-fetches one historical input value and one coefficient value to be multiplied in the next iteration. One of the pre-fetched values must be located in X data memory space and the other must be located in Y data memory space. To satisfy the PSV mapping requirements for the FIR filter algorithm, the user must locate the historical input data in the Y memory space and the filter coefficients in X memory space. © 2005 Microchip Technology Inc. DS70051D-page 4-9 Section 4. Program Memory P r o g r a m Memory 4 Figure 4-7: Program Space Visibility Operation Figure 4-8: Program Space Visibility Address Generation 23 15 0 PSVPAG EA<15> = 1 Data Space Program Space 8 15 23 0x0000 0x8000 0xFFFF 0x01 0x008000 Data Read Upper 8 bits of Program Memory Data cannot be read using Program Space Visibility. 0x000100 0x017FFF 23 bits 1 PSVPAG Reg 8 bits Wn 15 bits Select 23-bit EA Wn<0> is Byte Select dsPIC30F Family Reference Manual DS70051D-page 4-10 © 2005 Microchip Technology Inc. 4.4.3 PSV Timing Instructions that use PSV will require two extra instruction cycles to complete execution, except the following instructions that require only one extra cycle to complete execution: - The MAC class of instructions with data pre-fetch operands - All MOV instructions including the MOV.D instruction The additional instruction cycles are used to fetch the PSV data on the program memory bus. 4.4.3.1 Using PSV in a Repeat Loop Instructions that use PSV within a REPEAT loop eliminate the extra instruction cycle(s) required for the data access from program memory, hence incurring no overhead in execution time. However, the following iterations of the REPEAT loop will incur an overhead of two instruction cycles to complete execution: - The first iteration - The last iteration - Instruction execution prior to exiting the loop due to an interrupt - Instruction execution upon re-entering the loop after an interrupt is serviced 4.4.3.2 PSV and Instruction Stalls Refer to Section 2. “CPU” for more information about instruction stalls using PSV. 4.5 Program Memory Writes The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are two methods by which the user can program this memory: 1. Run-Time Self Programming (RTSP) 2. In-Circuit Serial Programming™ (ICSP™) RTSP is accomplished using TBLWT instructions. ICSP is accomplished using the SPI interface and integral bootloader software. Refer to Section 5. “Flash and EEPROM Programming” for further details about RTSP. ICSP specifications can be downloaded from the Microchip Technology web site (www.microchip.com). © 2005 Microchip Technology Inc. DS70051D-page 4-11 Section 4. Program Memory P r o g r a m Memory 4 4.6 PSV Code Examples 4.6.1 PSV Code Example in C: // PSV code example in C // When defined as below the const string uses the PSV feature of dsPIC const unsigned char hello[] = {"Hello World:\r\n"}; unsigned char *TXPtr; // Transmit pointer int main(void) { // Initialize the UART1 U1MODE = 0x8000; U1STA = 0x0000; U1BRG = ((FCY/16)/BAUD) - 1; // set baud rate = BAUD TXPtr = &hello[0]; // point to first char in string U1STAbits.UTXEN = 1; // Initiate transmission while (1) { while (*TXPtr) // while valid char in string ... if (!U1STAbits.UTXBF) // and buffer not full ... U1TXREG = *TXPtr++; // transmit string via UART DelayNmSec(500); // delay for 500 mS TXPtr = &hello[0]; // re-initialize pointer to first char } } // end main 4.6.2 PSV code Example in Assembly: .equ CORCONL, CORCON .section .const, "r" hello: .ascii "Hello World:\n\r\0" .global __reset ;Declare the label for the start of code .text ;Start of Code section __reset: clr U1STA mov #0x8000,W0 ; enable UART module mov W0,U1MODE mov #BR,W0 ; set baudrate using formula value mov W0, U1BRG ; / bset U1STA,#UTXEN ; initiate transmission Again: rcall Delay500mSec ; delay for 500 mS mov #psvpage(hello),w0 mov w0, PSVPAG bset.b CORCONL,#PSV mov #psvoffset(hello),w0 TxSend: mov.b [w0++], w1 ; get char in string cp w1,#0 ; if Null bra Z,Again ; then re-initialize BufferTest: btsc U1STA,#UTXBF ; see if buffer full bra BufferTest ; wait till empty mov w1,U1TXREG ; load value in TX buffer bra TxSend ; repeat for next char. dsPIC30F Family Reference Manual DS70051D-page 4-12 © 2005 Microchip Technology Inc. 4.7 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Program Memory module are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70051D-page 4-13 Section 4. Program Memory P r o g r a m Memory 4 4.8 Revision History Revision A This is the initial released revision of this document. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C This revision incorporates all known errata at the time of this document update. Revision D Section 4.6 “PSV Code Examples”, has been added. dsPIC30F Family Reference Manual DS70051D-page 4-14 © 2005 Microchip Technology Inc. NOTES: © 2005 Microchip Technology Inc. DS70052D-page 5-1 Fla s h a n d E E P R O M Programming 5 Section 5. Flash and EEPROM Programming HIGHLIGHTS This section of the manual contains the following topics: 5.1 Introduction .................................................................................................................... 5-2 5.2 Table Instruction Operation............................................................................................ 5-2 5.3 Control Registers ........................................................................................................... 5-5 5.4 Run-Time Self-Programming (RTSP) .......................................................................... 5-10 5.5 Data EEPROM Programming ...................................................................................... 5-15 5.6 Design Tips .................................................................................................................. 5-21 5.7 Related Application Notes............................................................................................5-22 5.8 Revision History ........................................................................................................... 5-23 dsPIC30F Family Reference Manual DS70052D-page 5-2 © 2005 Microchip Technology Inc. 5.1 Introduction This section describes programming techniques for Flash program memory and data EEPROM memory. The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are two methods by which the user can program this memory: 1. Run-Time Self Programming (RTSP) 2. In-Circuit Serial Programming™ (ICSP™) RTSP is performed by the user’s software. ICSP is performed using a serial data connection to the device and allows much faster programming times than RTSP. RTSP techniques are described in this chapter. The ICSP protocol is described in the dsPIC30F Programming Specification document, which may be downloaded from the Microchip web site. The data EEPROM is mapped into the program memory space. The EEPROM is organized as 16-bit wide memory and the memory size can be up to 2K words (4 Kbytes). The amount of EEPROM is device dependent. Refer to the device data sheet for further information. The programming techniques used for the data EEPROM are similar to those used for Flash program memory RTSP. The key difference between Flash and data EEPROM programming operations is the amount of data that can be programmed or erased during each program/erase cycle. 5.2 Table Instruction Operation The table instructions provide one method of transferring data between the program memory space and the data memory space of dsPIC30F devices. A summary of the table instructions is provided here since they are used during programming of the Flash program memory and data EEPROM. There are four basic table instructions: • TBLRDL: Table Read Low • TBLRDH: Table Read High • TBLWTL: Table Write Low • TBLWTH: Table Write High The TBLRDL and the TBLWTL instructions are used to read and write to bits <15:0> of program memory space. TBLRDL and TBLWTL can access program memory in Word or Byte mode. The TBLRDH and TBLWTH instructions are used to read or write to bits <23:16> of program memory space. TBLRDH and TBLWTH can access program memory in Word or Byte mode. Since the program memory is only 24-bits wide, the TBLRDH and TBLWTH instructions have the ability to address an upper byte of program memory that does not exist. This byte is called the ‘phantom byte’. Any read of the phantom byte will return 0x00 and a write to the phantom byte has no effect. Always remember that the 24-bit program memory can be regarded as two side-by-side 16-bit spaces, with each space sharing the same address range. Therefore, the TBLRDL and TBLWTL instructions access the ‘low’ program memory space (PM<15:0>). The TBLRDH and TBLWTH instructions access the ‘high’ program memory space (PM<31:16>). Any reads or writes to PM<31:24> will access the phantom (unimplemented) byte. When any of the table instructions are used in Byte mode, the LSb of the table address will be used as the byte select bit. The LSb determines which byte in the high or low program memory space is accessed. Figure 5-1 shows how the program memory is addressed using the table instructions. A 24-bit program memory address is formed using bits <7:0> of the TBLPAG register and the effective address (EA) from a W register, specified in the table instruction. The 24-bit program counter is shown in Figure 5-1 for reference. The upper 23 bits of the EA are used to select the program memory location. For the Byte mode table instructions, the LSb of the W register EA is used to pick which byte of the 16-bit program memory word is addressed. A ‘1’ selects bits <15:8>, a ‘0’ selects bits <7:0>. The LSb of the W register EA is ignored for a table instruction in Word mode. In addition to the program memory address, the table instruction also specifies a W register (or a W register pointer to a memory location) that is the source of the program memory data to be written, or the destination for a program memory read. For a table write operation in Byte mode, bits <15:8> of the source working register are ignored. © 2005 Microchip Technology Inc. DS70052D-page 5-3 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 Figure 5-1: Addressing for Table Instructions 5.2.1 Using Table Read Instructions Table reads require two steps. First, an address pointer is setup using the TBLPAG register and one of the W registers. Then, the program memory contents at the address location may be read. 5.2.1.1 Read Word Mode The following code example shows how to read a word of program memory using the table instructions in Word mode: ; Setup the address pointer to program space MOV #tblpage(PROG_ADDR),W0 ; get table page value MOV W0,TBLPAG ; load TBLPAG register MOV #tbloffset(PROG_ADDR),W0 ; load address LS word ; Read the program memory location TBLRDH [W0],W3 ; Read high byte to W3 TBLRDL [W0],W4 ; Read low word to W4 5.2.1.2 Read Byte Mode ; Setup the address pointer to program space MOV #tblpage(PROG_ADDR),W0 ; get table page value MOV W0,TBLPAG ; load TBLPAG register MOV #tbloffset(PROG_ADDR),W0 ; load address LS word ; Read the program memory location TBLRDH.B [W0],W3 ; Read high byte to W3 TBLRDL.B [W0++],W4 ; Read low byte to W4 TBLRDL.B [W0++],W5 ; Read middle byte to W5 In the code example above, the post-increment operator on the read of the low byte causes the address in the working register to increment by one. This sets EA<0> to a ‘1’ for access to the middle byte in the third write instruction. The last post-increment sets W0 back to an even address, pointing to the next program memory location. TBLPAG 8 bits from TBLPAG EA EA<0> Selects Byte 24-bit EA TBLPAG<7> Selects User/Configuration Space 7 0 15 0 16 bits from Wn Note: The tblpage() and tbloffset() directives are provided by the Microchip assembler for the dsPIC30F. These directives select the appropriate TBLPAG and W register values for the table instruction from a program memory address value. Refer to the MPLAB ASM 30, MPLAB LINK30 and Utilities User’s Guide (DS51317) for further details. dsPIC30F Family Reference Manual DS70052D-page 5-4 © 2005 Microchip Technology Inc. 5.2.2 Using Table Write Instructions The effect of a table write instruction will depend on the type of memory technology that is present in the device program memory address space. The program memory address space could contain volatile or non-volatile program memory, non-volatile data memory, and an External Bus Interface (EBI). If a table write instruction occurs within the EBI address region, for example, the write data will be placed onto the EBI data lines. 5.2.2.1 Table Write Holding Latches Table write instructions do not write directly to the non-volatile program and data memory. Instead, the table write instructions load holding latches that store the write data. The holding latches are not memory mapped and can only be accessed using table write instructions. When all of the holding latches have been loaded, the actual memory programming operation is started by executing a special sequence of instructions. The number of holding latches will determine the maximum memory block size that can be programmed and may vary depending on the type of non-volatile memory and the device variant. For example, the number of holding latches could be different for program memory, data EEPROM memory and Device Configuration registers for a given device. In general, the program memory is segmented into rows and panels. Each panel will have its own set of table write holding latches. This allows multiple memory panels to be programmed at once, reducing the overall programming time for the device. For each memory panel, there are generally enough holding latches to program one row of memory at a time. The memory logic automatically decides which set of write latches to load based on the address value used in the table write instruction. Please refer to the specific device data sheet for further details. 5.2.2.2 Write Word Mode The following sequence can be used to write a single program memory latch location in Word mode: ; Setup the address pointer to program space MOV #tblpage(PROG_ADDR),W0 ; get table page value MOV W0,TBLPAG ; load TBLPAG register MOV #tbloffset(PROG_ADDR),W0 ; load address LS word ; Load write data into W registers MOV #PROG_LOW_WORD,W2 MOV #PROG_HI_BYTE,W3 ; Perform the table writes to load the latch TBLWTL W2,[W0] TBLWTH W3,[W0++] In this example, the contents of the upper byte of W3 does not matter because this data will be written to the phantom byte location. W0 is post-incremented by 2, after the second TBLWTH instruction, to prepare for the write to the next program memory location. © 2005 Microchip Technology Inc. DS70052D-page 5-5 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.2.2.3 Write Byte Mode To write a single program memory latch location in Byte mode, the following code sequence can be used: ; Setup the address pointer to program space MOV #tblpage(PROG_ADDR),W0 ; get table page value MOV W0,TBLPAG ; load TBLPAG register MOV #tbloffset(PROG_ADDR),W0 ; load address LS word ; Load data into working registers MOV #LOW_BYTE,W2 MOV #MID_BYTE,W3 MOV #HIGH_BYTE,W4 ; Write data to the latch TBLWTH.B W4,[W0] ; write high byte TBLWTL.B W2,[W0++] ; write low byte TBLWTL.B W3,[W0++] ; write middle byte In the code example above, the post-increment operator on the write to the low byte causes the address in W0 to increment by one. This sets EA<0> = 1 for access to the middle byte in the third write instruction. The last post-increment sets W0 back to an even address pointing to the next program memory location. 5.3 Control Registers Flash and data EEPROM programming operations are controlled using the following Non-Volatile Memory (NVM) control registers: • NVMCON: Non-Volatile Memory Control Register • NVMKEY: Non-Volatile Memory Key Register • NVMADR: Non-Volatile Memory Address Register 5.3.1 NVMCON Register The NVMCON register is the primary control register for Flash and EEPROM program/erase operations. This register selects Flash or EEPROM memory, whether an erase or program operation will be performed, and is used to start the program or erase cycle. The NVMCON register is shown in Register 5-1. The lower byte of NVMCOM configures the type of NVM operation that will be performed. For convenience, a summary of NVMCON setup values for various program and erase operations is given in Table 5-1. Table 5-1: NVMCON Register Values NVMCON Register Values for RTSP Program and Erase Operations Memory Type Operation Data Size NVMCON Value Flash PM Erase 1 row (32 instr. words) 0x4041 Program 1 row (32 instr. words) 0x4001 Data EEPROM Erase 1 data word 0x4044 16 data words 0x4045 Entire EEPROM 0x4046 Program 1 data word 0x4004 16 data words 0x4005 Configuration Register Write(1) 1 config. register 0x4008 Note 1: The Device Configuration registers, except for FG5, may be written to a new value without performing an erase cycle. dsPIC30F Family Reference Manual DS70052D-page 5-6 © 2005 Microchip Technology Inc. 5.3.2 NVM Address Register There are two NVM Address Registers - NVMADRU and NVMADR. These two registers when concatenated form the 24-bit effective address (EA) of the selected row or word for programming operations. The NVMADRU register is used to hold the upper 8 bits of the EA, while the NVMADR register is used to hold the lower 16 bits of the EA. The register pair, NVMADRU:NVMADR, capture the EA<23:0> of the last table-write instruction that has been executed and select the row of Flash or EEPROM memory to write/erase. Figure 5-2 shows how the program memory EA is formed for programming and erase operations. Although the NVMADRU and NVMADR registers are automatically loaded by the table-write instructions, the user can also directly modify their contents before the programming operation begins. A write to these registers will be required prior to an erase operation, because no table-write instructions are required for any erase operation. Figure 5-2: NVM Addressing with TBLPAG and NVM Address Registers 5.3.3 NVMKEY Register NVMKEY is a write only register that is used to prevent accidental writes/erasures of Flash or EEPROM memory. To start a programming or an erase sequence, the following steps must be taken in the exact order shown: 1. Write 0x55 to NVMKEY. 2. Write 0xAA to NVMKEY. 3. Execute two NOP instructions. After this sequence, a write will be allowed to the NVMCON register for one instruction cycle. In most cases, the user will simply need to set the WR bit in the NVMCON register to start the program or erase cycle. Interrupts should be disabled during the unlock sequence. The code example below shows how the unlock sequence is performed: PUSH SR ; Disable interrupts, if enabled MOV #0x00E0,W0 IOR SR MOV #0x55,W0 MOV #0xAA,W0 MOV W0,NVMKEY MOV W0,NVMKEY ; NOP not required BSET NVMCON,#WR ; Start the program/erase cycle NOP NOP POP SR ; Re-enable interrupts Refer to Section 5.4.2 “Flash Programming Operations” for further programming examples. 24-bit PM address TBLPAG Reg 8 bits 16 bits Using NVMADR Addressing NVMADR Register NVMADR register loaded with contents of W register EA used during last table-write instruction. W Register EA EA<0> is Byte Select TBLPAG<7> selects User or Configuration Space NVMADRU Register TBLPAG register during last table-write instruction NVMADRU register loaded with contents of © 2005 Microchip Technology Inc. DS70052D-page 5-7 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 Register 5-1: NVMCON: Non-Volatile Memory Control Register Upper Byte: R/S-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 WR WREN WRERR — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PROGOP<7:0> bit 7 bit 0 bit 15 WR: Write (Program or Erase) Control bit 1 = Initiates a data EEPROM or program Flash erase or write cycle (the WR bit can be set but not cleared in software) 0 = Write cycle is complete bit 14 WREN: Write (Erase or Program) Enable bit 1 = Enable an erase or program operation 0 = No operation allowed (Device clears this bit on completion of the write/erase operation) bit 13 WRERR: Flash Error Flag bit 1 = A write operation is prematurely terminated (any MCLR or WDT Reset during programming operation) 0 = The write operation completed successfully bit 12-8 Reserved: User code should write ‘0’s to these locations bit 7-0 PROGOP<7:0>: Programming Operation Command Byte bits Erase Operations: 0x41 = Erase 1 row (32 instruction words) of program Flash 0x44 = Erase 1 data word from data EEPROM 0x45 = Erase 1 row (16 data words) from data EEPROM 0x46 = Erase entire data EEPROM Programming Operations: 0x01 = Program 1 row (32 instruction words) into Flash program memory 0x04 = Program 1 data word into data EEPROM 0x05 = Program 1 row (16 data words) into data EEPROM 0x08 = Program 1 data word into device configuration register Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Settable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70052D-page 5-8 © 2005 Microchip Technology Inc. Register 5-2: NVMADR: Non-Volatile Memory Address Register Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x NVMADR<15:8> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x NVMADR<7:0> bit 7 bit 0 bit 15-0 NVMADR<15:0>: NV Memory Write Address bits Selects the location to program or erase in program or data Flash memory. This register may be read or written by user. This register will contain the address of EA<15:0> of the last table write instruction executed, until written by the user. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70052D-page 5-9 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 Register 5-3: NVMADRU: Non-Volatile Memory Upper Address Register Register 5-4: NVMKEY: Non-Volatile Memory Key Register Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x NVMADRU<7:0> bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7-0 NVMADRU<7:0>: NV Memory Upper Write Address bits Selects the upper 8 bits of the location to program or erase in program or data Flash memory. This register may be read or written by the user. This register will contain the value of the TBLPAG register when the last table write instruction executed, until written by the user. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0 NVMKEY<7:0> bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7-0 NVMKEY<7:0>: Key Register (Write Only) bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70052D-page 5-10 © 2005 Microchip Technology Inc. 5.4 Run-Time Self-Programming (RTSP) RTSP allows the user code to modify Flash program memory contents. RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions, and the NVM Control registers. With RTSP, the user may erase program memory, 32 instructions (96 bytes) at a time and can write program memory data, 32 instructions (96 bytes) at a time. 5.4.1 RTSP Operation The dsPIC30F Flash program memory is organized into rows and panels. Each row consists of 32 instructions or 96 bytes. The panel size may vary depending on the dsPIC30F device variant. Refer to the device data sheet for further information. Typically, each panel consists of 128 rows, or 4K x 24 instructions. RTSP allows the user to erase one row (32 instructions) at a time and to program 32 instructions at one time. Each panel of program memory contains write latches that hold 32 instructions of programming data. These latches are not memory mapped. The only way for the user to access the write latches is through the use of table write instructions. Prior to the actual programming operation, the write data must be loaded into the panel write latches with table write instructions. The data to be programmed into the panel is typically loaded in sequential order into the write latches: instruction 0, instruction 1, etc. The instruction words loaded must always be from an ‘even’ group of four address boundaries (e.g., loading of instructions 3, 4, 5, 6 is not allowed). Another way of stating this requirement is that the starting program memory address of the four instructions must have the 3 LSb’s equal to ‘0’. All 32 write latches must be written during a programming operation to ensure that any old data held in the latches is overwritten. The basic sequence for RTSP programming is to setup a table pointer, then do a series of TBLWT instructions to load the write latches. Programming is performed by setting special bits in the NVMCON register. 32 TBLWTL and 32 TBLWTH instructions are required to load the four instructions. If multiple, discontinuous regions of program memory need to be programmed, the table pointer should be changed for each region and the next set of write latches written. All of the table write operations to the Flash program memory take 2 instruction cycles each, because only the table latches are written. The actual programming operation is initiated using the NVMCON register. 5.4.2 Flash Programming Operations A program/erase operation is necessary for programming or erasing the internal Flash program memory in RTSP mode. The program or erase operation is automatically timed by the device and is nominally 2 msec in duration. Setting the WR bit (NVMCON<15>) starts the operation and the WR bit is automatically cleared when the operation is finished. The CPU stalls (waits) until the programming operation is finished. The CPU will not execute any instruction or respond to interrupts during this time. If any interrupts do occur during the programming cycle, then they will remain pending until the cycle completes. © 2005 Microchip Technology Inc. DS70052D-page 5-11 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.4.2.1 Flash Program Memory Programming Algorithm The user can erase and program Flash Program Memory by rows (32 instruction words). The general process is as follows: 1. Read one row of program Flash (32 instruction words) and store into data RAM as a data “image”. The RAM image must be read from an even 32-word program memory address boundary. 2. Update the RAM data image with the new program memory data. 3. Erase program Flash row. • Setup NVMCON register to erase 1 row of Flash program memory. • Write address of row to be erased into NVMADRU and NVMADR registers. • Disable interrupts. • Write the key sequence to NVMKEY to enable the erase. • Set the WR bit. This will begin erase cycle. • CPU will stall for the duration of the erase cycle. • The WR bit is cleared when erase cycle ends. • Re-enable interrupts. 4. Write 32 instruction words of data from RAM into the Flash program memory write latches. 5. Program 32 instruction words into program Flash. • Setup NVMCON to program one row of Flash program memory. • Disable interrupts. • Write the key sequence to NVMKEY to enable the program cycle. • Set the WR bit. This will begin the program cycle. • CPU will stall for duration of the program cycle. • The WR bit is cleared by the hardware when program cycle ends. • Re-enable interrupts. 6. Repeat steps 1 through 6, as needed, to program the desired amount of Flash program memory Note: The user should remember that the minimum amount of program memory that can be modified using RTSP is 32 instruction word locations. Therefore, it is important that an image of these locations be stored in general purpose RAM before an erase cycle is initiated. An erase cycle must be performed on any previously written locations before any programming is done. dsPIC30F Family Reference Manual DS70052D-page 5-12 © 2005 Microchip Technology Inc. 5.4.2.2 Erasing a Row of Program Memory The following is a code sequence that can be used to erase a row (32 instructions) of program memory. The NVMCON register is configured to erase one row of program memory. The NVMADRU and NVMADR registers are loaded with the address of the row to be erased. The program memory must be erased at ‘even’ row boundaries. Therefore, the 6 LSbits of the value written to the NVMADR register have no effect when a row is erased. The erase operation is initiated by writing a special unlock, or key sequence to the NVMKEY register before setting the WR control bit (NVMCON<15>). The unlock sequence needs to be executed in the exact order shown without interruption. Therefore, interrupts should be disabled prior to writing the sequence. Two NOP instructions should be inserted in the code at the point where the CPU will resume operation. Finally, interrupts can be enabled (if required). ; Setup NVMCON to erase one row of Flash program memory MOV #0x4041,W0 MOV W0,NVMCON ; Setup address pointer to row to be ERASED MOV #tblpage(PROG_ADDR),W0 MOV W0,NVMADRU MOV #tbloffset(PROG_ADDR),W0 MOV W0,NVMADR ; Disable interrupts, if enabled PUSH SR MOV #0x00E0,W0 IOR SR ; Write the KEY sequence MOV #0x55,W0 MOV W0, NVMKEY MOV #0xAA, W0 MOV W0, NVMKEY ; Start the erase operation BSET NVMCON,#WR ; Insert two NOPs after the erase cycle (required) NOP NOP ; Re-enable interrupts, if needed POP SR Note: When erasing a row of program memory, the user writes the upper 8 bits of the erase address directly to the NVMADRU and NVMADR registers. Together, the contents of the NVMADRU and NVMADR registers form the complete address of the program memory row to be erased. The NVMADRU and NVMADR registers specify the address for all Flash erase and program operations. However, these two registers do not have to be directly written by the user for Flash program operations. This is because the table write instructions used to write the program memory data automatically transfers the TBLPAG register contents and the table write address into the NVMADRU and NVMADR registers. The above code example could be modified to perform a ‘dummy’ table write operation to capture the program memory erase address. © 2005 Microchip Technology Inc. DS70052D-page 5-13 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.4.2.3 Loading Write Latches The following is a sequence of instructions that can be used to load the 768-bits of write latches (32 instruction words). 32 TBLWTL and 32 TBLWTH instructions are needed to load the write latches selected by the table pointer. The TBLPAG register is loaded with the 8 MSbits of the program memory address. The user does not need to write the NVMADRU:NVMADR register-pair for a Flash programming operation. The 24-bits of the program memory address are automatically captured into the NVMADRU:NVMADR register-pair when each table write instruction is executed. The program memory must be programmed at an ‘even’ 32 instruction word address boundary. In effect, the 6 LSbits of the value captured in the NVMADR register are not used during the programming operation. The row of 32 instruction words do not necessarily have to be written in sequential order. The 6 LSbits of the table write address determine which of the latches will be written. However, all 32 instruction words should be written for each programming cycle to overwrite old data. ; Set up a pointer to the first program memory location to be written. MOV #tblpage(PROG_ADDR),W0 MOV W0,TBLPAG MOV #tbloffset(PROG_ADDR),W0 ; Perform the TBLWT instructions to write the latches ; W0 is incremented in the TBLWTH instruction to point to the ; next instruction location. MOV #LOW_WORD_0,W2 MOV #HIGH_BYTE_0,W3 TBLWTL W2,[W0] TBLWTH W3,[W0++] ; 1st_program_word MOV #LOW_WORD_1,W2 MOV #HIGH_BYTE_1,W3 TBLWTL W2,[W0] TBLWTH W3,[W0++] ; 2nd_program_word MOV #LOW_WORD_2,W2 MOV #HIGH_BYTE_2,W3 TBLWTL W2, [W0] TBLWTH W3, [W0++] ; 3rd_program_word MOV #LOW_WORD_3,W2 MOV #HIGH_BYTE_3,W3 TBLWTL W2,[W0] TBLWTH W3,[W0++] ; 4th_program_word ........ ........ MOV #LOW_WORD_31,W2 MOV #HIGH_BYTE_31,W3 TBLWTL W2,[W0] TBLWTH W3,[W0++] ; 32nd_program_word Note: The following code example is the ‘Load_Write_Latch’ code referred to in subsequent examples. dsPIC30F Family Reference Manual DS70052D-page 5-14 © 2005 Microchip Technology Inc. 5.4.2.4 Single Row Programming Example An example of single row programming code is: ; Setup NVMCON to write 1 row of program memory MOV #0x4001,W0 MOV W0,NVMCON ; Load the 32 program memory write latches CALL Load_Write_Latch(1) ; Disable interrupts, if enabled PUSH SR MOV #0x00E0,W0 IOR SR ; Write the KEY sequence MOV #0x55,W0 MOV W0,NVMKEY MOV #0xAA,W0 MOV W0,NVMKEY ; Start the programming sequence BSET NVMCON,#WR ; Insert two NOPs after programming NOP NOP ; Re-enable interrupts, if required POP SR Note 1: See Section 5.4.2.3 “Loading Write Latches” 5.4.3 Writing to Device Configuration Registers RTSP may be used to write to the Device Configuration registers. RTSP allows each Configuration register, except the FG5, to be individually rewritten without first performing an erase cycle. Caution must be exercised when writing the Configuration registers since they control critical device operating parameters, such as the system clock source, PLL multiplication ratio and WDT enable. The procedure for programming a Device Configuration register is similar to the procedure for Flash program memory, except that only TBLWTL instructions are required. This is because the upper 8 bits are unused in each Device Configuration register. Furthermore, bit 23 of the table write address must be set to access the Configuration registers. Refer to Section 24. “Device Configuration” and the device data sheet for a full description of the Device Configuration registers. 5.4.3.1 Configuration Register Write Algorithm 1. Write the new configuration value to the table write latch using a TBLWTL instruction. 2. Configure NVMCON for a Configuration register write (NVMCON = 0x4008). 3. Disable interrupts, if enabled. 4. Write the key sequence to NVMKEY. 5. Start the write sequence by setting WR (NVMCON<15>). 6. CPU execution will resume when the write is finished. 7. Re-enable interrupts, if needed. © 2005 Microchip Technology Inc. DS70052D-page 5-15 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.4.3.2 Configuration Register Write Code Example The following code sequence can be used to modify a Device Configuration register: ; Set up a pointer to the location to be written. MOV #tblpage(CONFIG_ADDR),W0 MOV W0,TBLPAG MOV #tbloffset(CONFIG_ADDR),W0 ; Get the new data to write to the configuration register MOV #ConfigValue,W1 ; Perform the table write to load the write latch TBLWTL W1,[W0] ; Configure NVMCON for a configuration register write MOV #0x4008,W0 MOV W0,NVMCON ; Disable interrupts, if enabled PUSH SR MOV #0x00E0,W0 IOR SR ; Write the KEY sequence MOV #0x55,W0 MOV W0,NVMKEY MOV #0xAA,W0 MOV W0,NVMKEY ; Start the programming sequence BSET NVMCON,#WR ; Insert two NOPs after programming NOP NOP ; Re-enable interrupts, if required POP SR 5.5 Data EEPROM Programming The EEPROM block is accessed using table read and write operations similar to the program memory. The TBLWTH and TBLRDH instructions are not required for EEPROM operations since the memory is only 16-bits wide. The program and erase procedures for the data EEPROM are similar to those used for the Flash program memory, except they are optimized for fast data access. The following programming operations can be performed on the data EEPROM: • Erase one word • Erase one row (16 words) • Erase entire data EEPROM • Program one word • Program one row (16 words) The data EEPROM is readable and writable during normal operation (full VDD operating range). Unlike the Flash program memory, normal program execution is not stopped during an EEPROM program or erase operation. EEPROM erase and program operations are performed using the NVMCON and NVMKEY registers. The programming software is responsible for waiting for the operation to complete. The software may detect when the EEPROM erase or programming operation is complete by one of three methods: • Poll the WR bit (NVMCON<15>) in software. The WR bit will be cleared when the operation is complete. • Poll the NVMIF bit (IFS0<12>) in software. The NVMIF bit will be set when the operation is complete. • Enable NVM interrupts. The CPU will be interrupted when the operation is complete. Further programming operations can be handled in the ISR. Note: Unexpected results will be obtained should the user attempt to read the EEPROM while a programming or erase operation is underway. dsPIC30F Family Reference Manual DS70052D-page 5-16 © 2005 Microchip Technology Inc. 5.5.1 EEPROM Single Word Programming Algorithm 1. Erase one EEPROM word. • Setup NVMCON register to erase one EEPROM word. • Write address of word to be erased into NVMADRU, NVMADR registers. • Clear NVMIF status bit and enable NVM interrupt (optional). • Write the key sequence to NVMKEY. • Set the WR bit. This will begin erase cycle. • Either poll the WR bit or wait for the NVM interrupt. 2. Write data word into data EEPROM write latch. 3. Program the data word into the EEPROM. • Setup the NVMCON register to program one EEPROM word. • Clear NVMIF status bit and enable NVM interrupt (optional). • Write the key sequence to NVMKEY. • Set the WR bit. This will begin the program cycle. • Either poll the WR bit or wait for the NVM interrupt. 5.5.2 EEPROM Row Programming Algorithm If multiple words need to be programmed into the EEPROM, it is quicker to erase and program 16 words (1 row) at a time. The process to program 16 words of EEPROM is: 1. Read one row of data EEPROM (16 words) and store into data RAM as a data “image”. The section of EEPROM to be modified must fall on an even 16-word address boundary. 2. Update the data image with the new data. 3. Erase the EEPROM row. • Setup the NVMCON register to erase one row of EEPROM. • Write starting address of row to be erased into NUMADRU and NVMADR registers. • Clear NVMIF status bit and enable NVM interrupt (optional). • Write the key sequence to NVMKEY. • Set the WR bit. This will begin the erase cycle. • Either poll the WR bit or wait for the NVM interrupt. 4. Write the 16 data words into the data EEPROM write latches. 5. Program a row into data EEPROM. • Setup the NVMCON register to program one row of EEPROM. • Clear NVMIF status bit and enable NVM interrupt (optional). • Write the key sequence to NVMKEY. • Set the WR bit. This will begin the program cycle. • Either poll the WR bit or wait for the NVM interrupt. © 2005 Microchip Technology Inc. DS70052D-page 5-17 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.5.3 Erasing One Word of Data EEPROM Memory The NVMADRU and NVMADR registers must be loaded with the data EEPROM address to be erased. Since one word of the EEPROM is accessed, the LSB of the NVMADR has no effect on the erase operation. The NVMCON register must be configured to erase one word of EEPROM memory. Setting the WR control bit (NVMCON<15>) initiates the erase. A special unlock or key sequence should be written to the NVMKEY register before setting the WR control bit. The unlock sequence needs to be executed in the exact order shown without interruption. Therefore, interrupts should be disabled prior to writing the sequence. ; Set up a pointer to the EEPROM location to be erased. MOV #tblpage(EE_ADDR),W0 MOV W0,NVMADRU MOV #tbloffset(EE_ADDR),W0 MOV W0,NVMADR ; Setup NVMCON to erase one word of data EEPROM MOV #0x4044,W0 MOV W0,NVMCON ; Disable interrupts while the KEY sequence is written PUSH SR MOV #0x00E0,W0 IOR SR ; Write the KEY sequence MOV #0x55,W0 MOV W0,NVMKEY MOV #0xAA,W0 MOV W0,NVMKEY ; Start the erase cycle BSET NVMCON,#WR ; Re-enable interrupts POP SR dsPIC30F Family Reference Manual DS70052D-page 5-18 © 2005 Microchip Technology Inc. 5.5.4 Writing One Word of Data EEPROM Memory Assuming the user has erased the EEPROM location to be programmed, use a table write instruction to write one write latch. The TBLPAG register is loaded with the 8 MSBs of the EEPROM address. The 16 LSBs of the EEPROM address are automatically captured into the NVMADR register when the table write is executed. The LSB of the NVMADR register has no effect on the programming operation. The NVMCON register is configured to program one word of data EEPROM. Setting the WR control bit (NVMCON<15>) initiates the programming operation. A special unlock or key sequence should be written to the NVMKEY register before setting the WR control bit. The unlock sequence needs to be executed in the exact order shown without interruption. Therefore, interrupts should be disabled prior to writing the sequence. ; Setup a pointer to data EEPROM MOV #tblpage(EE_ADDR),W0 MOV W0,TBLPAG MOV #tbloffset(EE_ADDR),W0 ; Write data value to holding latch MOV EE_DATA,W1 TBLWTL W1,[ W0] ; NVMADR captures write address from the TBLWTL instruction. ; Setup NVMCON for programming one word to data EEPROM MOV #0x4004,W0 MOV W0,NVMCON ; Disable interrupts while the KEY sequence is written PUSH SR MOV #0x00E0,W0 IOR SR ; Write the key sequence MOV #0x55,W0 MOV W0,NVMKEY MOV #0xAA,W0 MOV W0,NVMKEY ; Start the write cycle BSET NVMCON,#WR ;Re-enable interrupts, if needed POP SR © 2005 Microchip Technology Inc. DS70052D-page 5-19 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.5.5 Erasing One Row of Data EEPROM The NVMCON register is configured to erase one row of EEPROM memory. The NVMADRU and NVMADR registers must point to the row to be erased. The data EEPROM must be erased at even address boundaries. Therefore, the 5 LSBs of the NVMADR register will have no effect on the row that is erased. Setting the WR control bit (NVMCON<15>) initiates the erase. A special unlock or key sequence should be written to the NVMKEY register before setting the WR control bit. The unlock sequence needs to be executed in the exact order shown without interruption. Therefore, interrupts should be disabled prior to writing the sequence. ; Set up a pointer to the EEPROM row to be erased. MOV #tblpage(EE_ADDR),W0 MOV W0,NVMADRU MOV #tbloffset(EE_ADDR),W0 MOV W0,NVMADR ; Setup NVMCON to erase one row of EEPROM MOV #0x4045,W0 MOV W0,NVMCON ; Disable interrupts while the KEY sequence is written PUSH SR MOV #0x00E0,W0 IOR SR ; Write the KEY Sequence MOV #0x55,W0 MOV W0,NVMKEY MOV #0xAA,W0 MOV W0,NVMKEY ; Start the erase operation BSET NVMCON,#WR ;Re-enable interrupts, if needed POP SR dsPIC30F Family Reference Manual DS70052D-page 5-20 © 2005 Microchip Technology Inc. 5.5.6 Write One Row of Data EEPROM Memory To write a row of data EEPROM, all sixteen write latches must be written before the programming sequence is initiated. The TBLPAG register is loaded with the 8 MSbs of the EEPROM address. The 16 LSbs of the EEPROM address are automatically captured into the NVMADR register when each table write is executed. Data EEPROM row programming must occur at even address boundaries, so the 5 LSbs of the NVMADR register have no effect on the row that is programmed. Setting the WR control bit (NVMCON<15>) initiates the programming operation. A special unlock or key sequence should be written to the NVMKEY register before setting the WR control bit. The unlock sequence needs to be executed in the exact order shown without interruption. Therefore, interrupts should be disabled prior to writing the sequence. ; Set up a pointer to the EEPROM row to be programmed. MOV #tblpage(EE_ADDR),W0 MOV W0,TBLPAG MOV #tbloffset(EE_ADDR),W0 ; Write the data to the programming latches. MOV data_ptr,W1 ; Use W1 as pointer to the data. TBLWTL [W1++],[W0++] ; Write 1st data word TBLWTL [W1++],[W0++] ; Write 2nd data word TBLWTL [W1++],[W0++] ; Write 3rd data word TBLWTL [W1++],[W0++] ; Write 4th data word TBLWTL [W1++],[W0++] ; Write 5th data word TBLWTL [W1++],[W0++] ; Write 6th data word TBLWTL [W1++],[W0++] ; Write 7th data word TBLWTL [W1++],[W0++] ; Write 8th data word TBLWTL [W1++],[W0++] ; Write 9th data word TBLWTL [W1++],[W0++] ; Write 10th data word TBLWTL [W1++],[W0++] ; Write 11th data word TBLWTL [W1++],[W0++] ; Write 12th data word TBLWTL [W1++],[W0++] ; Write 13th data word TBLWTL [W1++],[W0++] ; Write 14th data word TBLWTL [W1++],[W0++] ; Write 15th data word TBLWTL [W1++],[W0++] ; Write 16th data word ; The NVMADR captures last table access address. ; Setup NVMCON to write one row of EEPROM MOV #0x4005,W0 MOV W0,NVMCON ; Disable interrupts while the KEY sequence is written PUSH SR MOV #0x00E0,W0 IOR SR ; Write the KEY sequence MOV #0x55,W0 MOV W0,NVMKEY MOV #0xAA,W0 MOV W0,NVMKEY ; Start the programming operation BSET NVMCON,#WR ;Re-enable interrupts, if needed POP SR Note: Sixteen table write instructions have been used in this code segment to provide clarity in the example. The code segment could be simplified by using a single table write instruction in a REPEAT loop. © 2005 Microchip Technology Inc. DS70052D-page 5-21 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.5.7 Reading the Data EEPROM Memory A TBLRD instruction reads a word at the current program word address. This example uses W0 as a pointer to data Flash. The result is placed into register W4. ; Setup pointer to EEPROM memory MOV #tblpage(EE_ADDR),W0 MOV W0,TBLPAG MOV #tbloffset(EE_ADDR),W0 ; Read the EEPROM data TBLRDL [W0],W4 5.6 Design Tips Question 1: I cannot get the device to program or erase properly. My code appears to be correct. What could be the cause? Answer: Interrupts should be disabled when a program or erase cycle is initiated to ensure that the key sequence executes without interruption. Interrupts can be disabled by raising the current CPU priority to level 7. The code examples in this chapter disable interrupts by saving the current SR register value on the stack, then ORing the value 0x00E0 with SR to force IPL<2:0> = 111. If no priority level 7 interrupts are enabled, then the DISI instruction provides another method to temporarily disable interrupts, while the key sequence is executed. Question 2: What is an easy way to read data EEPROM without using table instructions? Answer: The data EEPROM is mapped into the program memory space. PSV can be used to map the EEPROM region into data memory space. See Section 4. “Program Memory” for further information about PSV. Note: Program Space Visibility (PSV) can also be used to read locations in the program memory address space. See Section 4. “Program Memory” for further information about PSV. dsPIC30F Family Reference Manual DS70052D-page 5-22 © 2005 Microchip Technology Inc. 5.7 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Flash and EEPROM Programming module are: Title Application Note # Using the dsPIC30F for Sensorless BLDC Control AN901 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70052D-page 5-23 Section 5. Flash and EEPROM Programming Fla s h a n d E E P R O M Programming 5 5.8 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates technical content changes for the dsPIC30F Flash and EEPROM Programming module. Revision C This revision incorporates all known errata at the time of this document update. Revision D This revision incorporates technical content changes for the dsPIC30F Flash and EEPROM Programming module. dsPIC30F Family Reference Manual DS70052D-page 5-24 © 2005 Microchip Technology Inc. NOTES: © 2004 Microchip Technology Inc. DS70053C-page 6-1 Interrupts 6 Section 6. Reset Interrupts HIGHLIGHTS This section of the manual contains the following topics: 6.1 Introduction .................................................................................................................... 6-2 6.2 Non-Maskable Traps...................................................................................................... 6-6 6.3 Interrupt Processing Timing ......................................................................................... 6-11 6.4 Interrupt Control and Status Registers......................................................................... 6-14 6.5 Interrupt Setup Procedures.......................................................................................... 6-42 6.6 Design Tips .................................................................................................................. 6-44 6.7 Related Application Notes............................................................................................6-45 6.8 Revision History ........................................................................................................... 6-46 dsPIC30F Family Reference Manual DS70053C-page 6-2 © 2004 Microchip Technology Inc. 6.1 Introduction The dsPIC30F interrupt controller module reduces the numerous peripheral interrupt request signals to a single interrupt request signal to the dsPIC30F CPU and has the following features: • Up to 8 processor exceptions and software traps • 7 user selectable priority levels • Interrupt Vector Table (IVT) with up to 62 vectors • A unique vector for each interrupt or exception source • Fixed priority within a specified user priority level • Alternate Interrupt Vector Table (AIVT) for debug support • Fixed interrupt entry and return latencies 6.1.1 Interrupt Vector Table The Interrupt Vector Table (IVT) is shown in Figure 6-1. The IVT resides in program memory, starting at location 0x000004. The IVT contains 62 vectors consisting of 8 non-maskable trap vectors plus up to 54 sources of interrupt. In general, each interrupt source has its own vector. Each interrupt vector contains a 24-bit wide address. The value programmed into each interrupt vector location is the starting address of the associated Interrupt Service Routine (ISR). 6.1.2 Alternate Vector Table The Alternate Interrupt Vector Table (AIVT) is located after the IVT as shown in Figure 6-1. Access to the AIVT is provided by the ALTIVT control bit (INTCON2<15>). If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run-time. If the AIVT is not needed, the AIVT should be programmed with the same addresses used in the IVT. 6.1.3 Reset Sequence A device Reset is not a true exception because the interrupt controller is not involved in the Reset process. The dsPIC30F device clears its registers in response to a Reset which forces the PC to zero. The processor then begins program execution at location 0x000000. The user programs a GOTO instruction at the Reset address which redirects program execution to the appropriate start-up routine. Note: Any unimplemented or unused vector locations in the IVT and AIVT should be programmed with the address of a default interrupt handler routine that contains a RESET instruction. © 2004 Microchip Technology Inc. DS70053C-page 6-3 Section 6. Interrupts Interrupts 6 Figure 6-1: Interrupt Vector Table Table 6-1: Trap Vector Details Decreasing Natural Order Priority 0x000000 0x000014 Reserved Address Error Trap Vector Stack Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 Arithmetic Error Trap Vector Oscillator Fail Trap Vector Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 IVT AIVT 0x000080 0x00007E 0x0000FE Reserved Reserved Address Error Trap Vector Stack Error Trap Vector Reserved Reserved Arithmetic Error Trap Vector Oscillator Fail Trap Vector 0x000094 Reset – GOTO Instruction Reset – GOTO Address 0x000002 Reserved 0x000082 0x000084 0x000004 See Table 6-2 Vector details. for Interrupt Vector Number IVT Address AIVT Address Trap Source 0 0x000004 0x000084 Reserved 1 0x000006 0x000086 Oscillator Failure 2 0x000008 0x000088 Address Error 3 0x00000A 0x00008A Stack Error 4 0x00000C 0x00008C Arithmetic Error 5 0x00000E 0x00008E Reserved 6 0x000010 0x000090 Reserved 7 0x000012 0x000092 Reserved dsPIC30F Family Reference Manual DS70053C-page 6-4 © 2004 Microchip Technology Inc. Table 6-2: Interrupt Vector Details Vector Number IVT Address AIVT Address Interrupt Source 8 0x000014 0x000094 INT0 – External Interrupt 0 9 0x000016 0x000096 IC1 – Input Compare 1 10 0x000018 0x000098 OC1 – Output Compare 1 11 0x00001A 0x00009A T1 – Timer 1 12 0x00001C 0x00009C IC2 – Input Capture 2 13 0x00001E 0x00009E OC2 – Output Compare 2 14 0x000020 0x0000A0 T2 – Timer 2 15 0x000022 0x0000A2 T3 – Timer 3 16 0x000024 0x0000A4 SPI1 17 0x000026 0x0000A6 U1RX – UART1 Receiver 18 0x000028 0x0000A8 U1TX – UART1 Transmitter 19 0x00002A 0x0000AA ADC – ADC Convert Done 20 0x00002C 0x0000AC NVM – NVM Write Complete 21 0x00002E 0x0000AE I 2C Slave Operation – Message Detect 22 0x000030 0x0000B0 I 2C Master Operation – Message Event Complete 23 0x000032 0x0000B2 Change Notice Interrupt 24 0x000034 0x0000B4 INT1 – External Interrupt 1 25 0x000036 0x0000B6 IC7 – Input Capture 7 26 0x000038 0x0000B8 IC8 – Input Capture 8 27 0x00003A 0x0000BA OC3 – Output Compare 3 28 0x00003C 0x0000BC OC4 – Output Compare 4 29 0x00003E 0x0000BE T4 – Timer 4 30 0x000040 0x0000C0 T5 – Timer 5 31 0x000042 0x0000C2 INT2 – External Interrupt 2 32 0x000044 0x0000C4 U2RX – UART2 Receiver 33 0x000046 0x0000C6 U2TX – UART2 Transmitter 34 0x000048 0x0000C8 SPI2 35 0x00004A 0x0000CA CAN1 36 0x00004C 0x0000CC IC3 – Input Capture 3 37 0x00004E 0x0000CE IC4 – Input Capture 4 38 0x000050 0x0000D0 IC5 – Input Capture 5 39 0x000052 0x0000D2 IC6 – Input Capture 6 40 0x000054 0x0000D4 OC5 – Output Compare 5 41 0x000056 0x0000D6 OC6 – Output Compare 6 42 0x000058 0x0000D8 OC7 – Output Compare 7 43 0x00005A 0x0000DA OC8 – Output Compare 8 44 0x00005C 0x0000DC INT3 – External Interrupt 3 45 0x00005E 0x0000DE INT4 – External Interrupt 4 46 0x000060 0x0000E0 CAN2 47 0x000062 0x0000E2 PWM – PWM Period Match 48 0x000064 0x0000E4 QEI – Position Counter Compare 49 0x000066 0x0000E6 DCI – Codec Transfer Done 50 0x000068 0x0000E8 LVD – Low Voltage Detect 51 0x00006A 0x0000EA FLTA – MCPWM Fault A 52 0x00006C 0x0000EC FLTB – MCPWM Fault B 53-61 0x00006E-0x00007E 0x00006E-0x00007E Reserved © 2004 Microchip Technology Inc. DS70053C-page 6-5 Section 6. Interrupts Interrupts 6 6.1.4 CPU Priority Status The CPU can operate at one of sixteen priority levels, 0-15. An interrupt or trap source must have a priority level greater than the current CPU priority in order to initiate an exception process. Peripheral and external interrupt sources can be programmed for level 0-7, while CPU priority levels 8-15 are reserved for trap sources. A trap is a non-maskable interrupt source intended to detect hardware and software problems (see Section 6.2 ”Non-Maskable Traps”). The priority level for each trap source is fixed and only one trap is assigned to a priority level. Note that an interrupt source programmed to priority level 0 is effectively disabled, since it can never be greater than the CPU priority. The current CPU priority level is indicated by the following four status bits: • IPL<2:0> status bits located in SR<7:5> • IPL3 status bit located in CORCON<3> The IPL<2:0> status bits are readable and writable, so the user may modify these bits to disable all sources of interrupts below a given priority level. If IPL<2:0> = 3, for example, the CPU would not be interrupted by any source with a programmed priority level of 0, 1, 2 or 3. Trap events have higher priority than any user interrupt source. When the IPL3 bit is set, a trap event is in progress. The IPL3 bit can be cleared, but not set by the user. In some applications, it may be desirable to clear the IPL3 bit when a trap has occurred and branch to an instruction other than the instruction after the one that originally caused the trap to occur. All user interrupt sources can be disabled by setting IPL<2:0> = 111. 6.1.5 Interrupt Priority Each peripheral interrupt source can be assigned to one of seven priority levels. The user assignable interrupt priority control bits for each individual interrupt are located in the Least Significant 3 bits of each nibble within the IPCx register(s). Bit 3 of each nibble is not used and is read as a ‘0’. These bits define the priority level assigned to a particular interrupt. The usable priority levels start at ‘1’ as the lowest priority and level 7 as the highest priority. If the IPC bits associated with an interrupt source are all cleared, then the interrupt source is effectively disabled. Since more than one interrupt request source may be assigned to a specific priority level, a means is provided to resolve priority conflicts within a given user assigned level. Each source of interrupt has a natural order priority based on its location in the IVT. Table 6-2 shows the location of each interrupt source in the IVT. The lower numbered interrupt vectors have higher natural priority, while the higher numbered vectors have lower natural priority. The overall priority level for any pending source of interrupt is determined first by the user assigned priority of that source in the IPCx register, then by the natural order priority within the IVT. Natural order priority is used only to resolve conflicts between simultaneous pending interrupts with the same user assigned priority level. Once the priority conflict is resolved and the exception process begins, the CPU can only be interrupted by a source with higher user assigned priority. Interrupts with the same user assigned priority but a higher natural order priority, that become pending after the exception process begins, will remain pending until the current exception process completes. The ability for the user to assign each interrupt source to one of seven priority levels means that the user can give an interrupt with a low natural order priority a very high overall priority level. For example: the PLVD (Programmable Low Voltage Detect) can be given a priority of 7 and the INT0 (External Interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. Note: The IPL<2:0> bits become read only bits when interrupt nesting is disabled. See Section 6.2.4.2 ”Interrupt Nesting” for more information. Note: The peripherals and sources of interrupt available in the IVT will vary depending on the specific dsPIC30F device. The sources of interrupt shown in this document represent a comprehensive listing of all interrupt sources found on dsPIC30F devices. Refer to the specific device data sheet for further details. dsPIC30F Family Reference Manual DS70053C-page 6-6 © 2004 Microchip Technology Inc. 6.2 Non-Maskable Traps Traps can be considered as non-maskable, nestable interrupts which adhere to a fixed priority structure. Traps are intended to provide the user a means to correct erroneous operation during debug and when operating within the application. If the user does not intend to take corrective action in the event of a trap error condition, these vectors must be loaded with the address of a software routine that will reset the device. Otherwise, the trap vector is programmed with the address of a service routine that will correct the trap condition. The dsPIC30F has four implemented sources of non-maskable traps: • Oscillator Failure Trap • Stack Error Trap • Address Error Trap • Arithmetic Error Trap Note that many of these trap conditions can only be detected when they happen. Consequently, the instruction that caused the trap is allowed to complete before exception processing begins. Therefore, the user may have to correct the action of the instruction that caused the trap. Each trap source has a fixed priority as defined by its position in the IVT. An oscillator failure trap has the highest priority, while an arithmetic error trap has the lowest priority (see Figure 6-1). In addition, trap sources are classified into two distinct categories: ‘Hard’ traps and ‘Soft’ traps. 6.2.1 Soft Traps The arithmetic error trap (priority level 11) and stack error trap (priority level 12) are categorized as ‘soft’ trap sources. Soft traps can be treated like non-maskable sources of interrupt that adhere to the priority assigned by their position in the IVT. Soft traps are processed like interrupts and require 2 cycles to be sampled and Acknowledged prior to exception processing. Therefore, additional instructions may be executed before a soft trap is Acknowledged. 6.2.1.1 Stack Error Trap (Soft Trap, Level 12) The stack is initialized to 0x0800 during Reset. A stack error trap will be generated should the stack pointer address ever be less than 0x0800. There is a Stack Limit register (SPLIM) associated with the stack pointer that is uninitialized at Reset. The stack overflow check is not enabled until a word write to SPLIM occurs. All Effective Addresses (EA) generated using W15 as a source or destination pointer are compared against the value in SPLIM. Should the EA be greater than the contents of the SPLIM register, then a stack error trap is generated. In addition, a stack error trap will be generated should the EA calculation wrap over the end of data space (0xFFFF). A stack error can be detected in software by polling the STKERR status bit (INTCON1<2>). To avoid re-entering the Trap Service Routine, the STKERR status flag must be cleared in software prior to returning from the trap with a RETFIE instruction. © 2004 Microchip Technology Inc. DS70053C-page 6-7 Section 6. Interrupts Interrupts 6 6.2.1.2 Arithmetic Error Trap (Soft Trap, Level 11) Any of the following events will cause an arithmetic error trap to be generated: • Accumulator A Overflow • Accumulator B Overflow • Catastrophic Accumulator Overflow • Divide by Zero • Shift Accumulator (SFTAC) operation exceeding +/-16 bits There are three enable bits in the INTCON1 register that enable the three types of accumulator overflow traps. The OVATE control bit (INTCON1<10>) is used to enable traps for an Accumulator A overflow event. The OVBTE control bit (INTCON1<9>) is used to enable traps for an Accumulator B overflow event. The COVTE control bit (INTCON1<8>) is used to enable traps for a catastrophic overflow of either accumulator. An Accumulator A or Accumulator B overflow event is defined as a carry-out from bit 31. Note that no accumulator overflow can occur if the 31-bit Saturation mode is enabled for the accumulator. A catastrophic accumulator overflow is defined as a carry-out from bit 39 of either accumulator. No catastrophic overflow can occur if accumulator saturation (31-bit or 39-bit) is enabled. Divide-by-zero traps cannot be disabled. The divide-by-zero check is performed during the first iteration of the REPEAT loop that executes the divide instruction. Accumulator shift traps cannot be disabled. The SFTAC instruction can be used to shift the accumulator by a literal value or a value in one of the W registers. If the shift value exceeds +/-16 bits, an arithmetic trap will be generated. The SFTAC instruction will execute, but the results of the shift will not be written to the target accumulator. An arithmetic error trap can be detected in software by polling the MATHERR status bit (INTCON1<4>). To avoid re-entering the Trap Service Routine, the MATHERR status flag must be cleared in software prior to returning from the trap with a RETFIE instruction. Before the MATHERR status bit can be cleared, all conditions that caused the trap to occur must also be cleared. If the trap was due to an accumulator overflow, the OA and OB status bits (SR<15:14>) must be cleared. The OA and OB status bits are read only, so the user software must perform a dummy operation on the overflowed accumulator (such as adding ‘0’) that will cause the hardware to clear the OA or OB status bit. 6.2.2 Hard Traps Hard traps include exceptions of priority level 13 through level 15, inclusive. The address error (level 13) and oscillator error (level 14) traps fall into this category. Like soft traps, hard traps can also be viewed as non-maskable sources of interrupt. The difference between hard traps and soft traps is that hard traps force the CPU to stop code execution after the instruction causing the trap has completed. Normal program execution flow will not resume until after the trap has been Acknowledged and processed. 6.2.2.1 Trap Priority and Hard Trap Conflicts If a higher priority trap occurs while any lower priority trap is in progress, processing of the lower priority trap will be suspended and the higher priority trap will be Acknowledged and processed. The lower priority trap will remain pending until processing of the higher priority trap completes. Each hard trap that occurs must be Acknowledged before code execution of any type may continue. If a lower priority hard trap occurs while a higher priority trap is pending, Acknowledged, or is being processed, a hard trap conflict will occur. The conflict occurs because the lower priority trap cannot be Acknowledged until processing for the higher priority trap completes. The device is automatically reset in a hard trap conflict condition. The TRAPR status bit (RCON<15> ) is set when the Reset occurs, so that the condition may be detected in software. dsPIC30F Family Reference Manual DS70053C-page 6-8 © 2004 Microchip Technology Inc. 6.2.2.2 Oscillator Failure Trap (Hard Trap, Level 14) An oscillator failure trap event will be generated for any of the following reasons: • The Fail-Safe Clock Monitor (FSCM) is enabled and has detected a loss of the system clock source. • A loss of PLL lock has been detected during normal operation using the PLL. • The FSCM is enabled and the PLL fails to achieve lock at a Power-On Reset (POR). An oscillator failure trap event can be detected in software by polling the OSCFAIL status bit (INTCON1<1>), or the CF status bit (OSCCON<3>). To avoid re-entering the Trap Service Routine, the OSCFAIL status flag must be cleared in software prior to returning from the trap with a RETFIE instruction. Refer to Section 7. “Oscillator” and Section 24. “Device Configuration” for more information about the FSCM. 6.2.2.3 Address Error Trap (Hard Trap, Level 13) The following paragraphs describe operating scenarios that would cause an address error trap to be generated: 1. A misaligned data word fetch is attempted. This condition occurs when an instruction performs a word access with the LSb of the effective address set to ‘1’. The dsPIC30F CPU requires all word accesses to be aligned to an even address boundary. 2. A bit manipulation instruction using the Indirect Addressing mode with the LSb of the effective address set to ‘1’. 3. A data fetch from unimplemented data address space is attempted. 4. Execution of a “BRA #literal” instruction or a “GOTO #literal” instruction, where literal is an unimplemented program memory address. 5. Executing instructions after modifying the PC to point to unimplemented program memory addresses. The PC may be modified by loading a value into the stack and executing a RETURN instruction. Data space writes will be inhibited whenever an address error trap occurs, so that data is not destroyed. An address error can be detected in software by polling the ADDRERR status bit (INTCON1<3>). To avoid re-entering the Trap Service Routine, the ADDRERR status flag must be cleared in software prior to returning from the trap with a RETFIE instruction. 6.2.3 Disable Interrupts Instruction The DISI (disable interrupts) instruction has the ability to disable interrupts for up to 16384 instruction cycles. This instruction is useful when time critical code segments must be executed. The DISI instruction only disables interrupts with priority levels 1-6. Priority level 7 interrupts and all trap events still have the ability to interrupt the CPU when the DISI instruction is active. The DISI instruction works in conjunction with the DISICNT register. When the DISICNT register is non-zero, priority level 1-6 interrupts are disabled. The DISICNT register is decremented on each subsequent instruction cycle. When the DISICNT register counts down to ‘0’, priority level 1-6 interrupts will be re-enabled. The value specified in the DISI instruction includes all cycles due to PSV accesses, instruction stalls, etc. The DISICNT register is readable and writable. The user can terminate the effect of a previous DISI instruction early by clearing the DISICNT register. The amount of time that interrupts are disabled can also be increased by writing to or adding to DISICNT. Note: In the MAC class of instructions, the data space is split into X and Y spaces. In these instructions, unimplemented X space includes all of Y space, and unimplemented Y space includes all of X space. © 2004 Microchip Technology Inc. DS70053C-page 6-9 Section 6. Interrupts Interrupts 6 Note that if the DISICNT register is zero, interrupts cannot be disabled by simply writing a non-zero value to the register. Interrupts must first be disabled by using the DISI instruction. Once the DISI instruction has executed and DISICNT holds a non-zero value, the interrupt disable time can be extended by modifying the contents of DISICNT. The DISI status bit (INTCON2<14>) is set whenever interrupts are disabled as a result of the DISI instruction. 6.2.4 Interrupt Operation All interrupt event flags are sampled during each instruction cycle. A pending Interrupt Request (IRQ) is indicated by the flag bit being equal to a ‘1’ in an IFSx register. The IRQ will cause an interrupt to occur if the corresponding bit in the Interrupt Enable (IECx) registers is set. For the rest of the instruction cycle in which the IRQ is sampled, the priorities of all pending interrupt requests are evaluated. No instruction will be aborted when the CPU responds to the IRQ. The instruction that was in progress when the IRQ is sampled will be completed before the ISR is executed. If there is a pending IRQ with a user assigned priority level greater than the current processor priority level, indicated by the IPL<2:0> status bits (SR<7:5>), an interrupt will be presented to the processor. The processor then saves the following information on the software stack: • the current PC value • the low byte of the Processor Status register (SRL) • the IPL3 status bit (CORCON<3>) These three values that are saved on the stack allow the return PC address value, MCU status bits, and the current processor priority level to be automatically saved. After the above information is saved on the stack, the CPU writes the priority level of the pending interrupt into the IPL<2:0> bit locations. This action will disable all interrupts of less than, or equal priority, until the Interrupt Service Routine (ISR) is terminated using the RETFIE instruction. Figure 6-2: Stack Operation for Interrupt Event 6.2.4.1 Return from Interrupt The RETFIE (Return from Interrupt) instruction will unstack the PC return address, IPL3 status bit, and SRL register to return the processor to the state and priority level prior to the interrupt sequence. Note: Software modification of the DISICNT register is not recommended. Note: The DISI instruction can be used to quickly disable all user interrupt sources if no source is assigned to CPU priority level 7. PC<15:0> PC<22:16> 15 0 W15 (before IRQ) W15 (after IRQ) Stack Grows Towards Higher Address SR<7:0> This stack location used to store the IPL3 status bit (CORCON<3>). dsPIC30F Family Reference Manual DS70053C-page 6-10 © 2004 Microchip Technology Inc. 6.2.4.2 Interrupt Nesting Interrupts, by default, are nestable. Any ISR that is in progress may be interrupted by another source of interrupt with a higher user assigned priority level. Interrupt nesting may be optionally disabled by setting the NSTDIS control bit (INTCON1<15>). When the NSTDIS control bit is set, all interrupts in progress will force the CPU priority to level 7 by setting IPL<2:0> = 111. This action will effectively mask all other sources of interrupt until a RETFIE instruction is executed. When interrupt nesting is disabled, the user assigned interrupt priority levels will have no effect, except to resolve conflicts between simultaneous pending interrupts. The IPL<2:0> bits become read only when interrupt nesting is disabled. This prevents the user software from setting IPL<2:0> to a lower value, which would effectively re-enable interrupt nesting. 6.2.5 Wake-up from Sleep and Idle Any source of interrupt that is individually enabled, using its corresponding control bit in the IECx registers, can wake-up the processor from Sleep or Idle mode. When the interrupt status flag for a source is set and the interrupt source is enabled via the corresponding bit in the IEC Control registers, a wake-up signal is sent to the dsPIC30F CPU. When the device wakes from Sleep or Idle mode, one of two actions may occur: 1. If the interrupt priority level for that source is greater than the current CPU priority level, then the processor will process the interrupt and branch to the ISR for the interrupt source. 2. If the user assigned interrupt priority level for the source is less than or equal the current CPU priority level, then the processor will simply continue execution, starting with the instruction immediately following the PWRSAV instruction that previously put the CPU in Sleep or Idle mode. 6.2.6 A/D Converter External Conversion Request The INT0 external interrupt request pin is shared with the A/D converter as an external conversion request signal. The INT0 interrupt source has programmable edge polarity, which is also available to the A/D converter external conversion request feature. 6.2.7 External Interrupt Support The dsPIC30F supports up to 5 external interrupt pin sources (INT0-INT4). Each external interrupt pin has edge detection circuitry to detect the interrupt event. The INTCON2 register has five control bits (INT0EP-INT4EP) that select the polarity of the edge detection circuitry. Each external interrupt pin may be programmed to interrupt the CPU on a rising edge or falling edge event. See Register 6-4 for further details. Note: User interrupt sources that are assigned to CPU priority level 0 cannot wake the CPU from Sleep or Idle mode, because the interrupt source is effectively disabled. To use an interrupt as a wake-up source, the CPU priority level for the interrupt must be assigned to CPU priority level 1 or greater. © 2004 Microchip Technology Inc. DS70053C-page 6-11 Section 6. Interrupts Interrupts 6 6.3 Interrupt Processing Timing 6.3.1 Interrupt Latency for One-Cycle Instructions Figure 6-3 shows the sequence of events when a peripheral interrupt is asserted during a one-cycle instruction. The interrupt process takes four instruction cycles. Each cycle is numbered in the Figure for reference. The interrupt flag status bit is set during the instruction cycle after the peripheral interrupt occurs. The current instruction completes during this instruction cycle. In the second instruction cycle after the interrupt event, the contents of the PC and SRL registers are saved into a temporary buffer register. The second cycle of the interrupt process is executed as a NOP to maintain consistency with the sequence taken during a two-cycle instruction (see Section 6.3.2 ”Interrupt Latency for Two-Cycle Instructions”). In the third cycle, the PC is loaded with the vector table address for the interrupt source and the starting address of the ISR is fetched. In the fourth cycle, the PC is loaded with the ISR address. The fourth cycle is executed as a NOP while the first instruction in the ISR is fetched. Figure 6-3: Interrupt Timing During a One-Cycle Instruction 4 4 4 6 6 6 INST(PC-2) INST(PC) FNOP FNOP ISR INST Executed Interrupt Flag PUSH Low 16 bits of PC PUSH SRL and High 8 bits of PC 4 6 ISR + 2 ISR + 4 CPU Priority Fetch PC PC PC+2 2000 (ISR) 2002 2004 2006 Vector Save PC in Status bit Vector# Peripheral interrupt event occurs at or before midpoint TCY 1 2 3 4 temporary buffer. of this cycle. (from temporary buffer). (from temporary buffer). dsPIC30F Family Reference Manual DS70053C-page 6-12 © 2004 Microchip Technology Inc. 6.3.2 Interrupt Latency for Two-Cycle Instructions The interrupt latency during a two-cycle instruction is the same as during a one-cycle instruction. The first and second cycle of the interrupt process allow the two-cycle instruction to complete execution. The timing diagram in Figure 6-5 shows the case when the peripheral interrupt event occurs in the instruction cycle prior to execution of the two-cycle instruction. Figure 6-5 shows the timing when a peripheral interrupt is coincident with the first cycle of a two-cycle instruction. In this case, the interrupt process completes as for a one-cycle instruction (see Section 6.3.1 ”Interrupt Latency for One-Cycle Instructions”). Figure 6-4: Interrupt Timing During a Two-Cycle Instruction Figure 6-5: Interrupt Timing, Interrupt Occurs During 1st Cycle of a 2-Cycle Instruction 4 4 4 6 6 6 INST(PC-2) INST(PC) INST(PC) FNOP ISR INST Executed Interrupt Flag PUSH Low 16 bits of PC PUSH SRL and High 8 bits of PC 4 6 ISR + 2 ISR + 4 CPU Priority Fetch PC PC PC+2 2000 (ISR) 2002 2004 2006 Vector Save PC in Status bit Vector# Peripheral interrupt event occurs at or before TCY 1 2 3 4 1st cycle 2nd cycle temporary buffer. midpoint of this cycle. (from temporary buffer). (from temporary buffer). 4 4 4 6 6 6 INST(PC) INST(PC) FNOP ISR INST Executed Interrupt Flag PUSH Low 16 bits of PC PUSH SRL and High 8 bits of PC 4 6 ISR + 2 ISR + 4 CPU Priority Fetch PC PC PC + 2 2000 (ISR) 2002 2004 2006 Vector Save PC in Status bit Vector# Peripheral interrupt event occurs at or before TCY 1 2 3 4 1st cycle 2nd cycle temporary buffer. FNOP midpoint of this cycle. (from temporary buffer). (from temporary buffer). © 2004 Microchip Technology Inc. DS70053C-page 6-13 Section 6. Interrupts Interrupts 6 6.3.3 Returning from Interrupt The “Return from Interrupt” instruction, RETFIE, exits an interrupt or trap routine. During the first cycle of a RETFIE instruction, the upper bits of the PC and the SRL register are popped from the stack. The lower 16 bits of the stacked PC value are popped from the stack during the second cycle. The third instruction cycle is used to fetch the instruction addressed by the updated program counter. This cycle executes as a NOP. Figure 6-6: Return from Interrupt Timing 6.3.4 Special Conditions for Interrupt Latency The dsPIC30F allows the current instruction to complete when a peripheral interrupt source becomes pending. The interrupt latency is the same for both one and two-cycle instructions. However, there are certain conditions that can increase interrupt latency by one cycle, depending on when the interrupt occurs. The user should avoid these conditions if a fixed latency is critical to the application. These conditions are as follows: • A MOV.D instruction is executed that uses PSV to access a value in program memory space. • An instruction stall cycle is appended to any two-cycle instruction. • An instruction stall cycle is appended to any one-cycle instruction that performs a PSV access. • A bit test and skip instruction (BTSC, BTSS) uses PSV to access a value in the program memory space. 6 6 4 4 4 4 CPU Priority INST RETFIE RETFIE PC Executed ISR last FNOP 6 PC + 2 PC + 4 POP Low 16 bits of PC to RAM Stack. POP SRL and High 8 bits of PC. PC ISR ISR + 2 PC PC + 2 PC + 4 PC + 6 2nd cycle TCY instruction dsPIC30F Family Reference Manual DS70053C-page 6-14 © 2004 Microchip Technology Inc. 6.4 Interrupt Control and Status Registers The following registers are associated with the interrupt controller: • INTCON1, INTCON2 Registers Global interrupt control functions are derived from these two registers. INTCON1 contains the Interrupt Nesting Disable (NSTDIS) bit, as well as the control and status flags for the processor trap sources. The INTCON2 register controls the external interrupt request signal behavior and the use of the alternate vector table. • IFSx: Interrupt Flag Status Registers All interrupt request flags are maintained in the IFSx registers, where ‘x’ denotes the register number. Each source of interrupt has a Status bit, which is set by the respective peripherals or external signal and is cleared via software. • IECx: Interrupt Enable Control Registers All Interrupt Enable Control bits are maintained in the IECx registers, where ‘x’ denotes the register number. These control bits are used to individually enable interrupts from the peripherals or external signals. • IPCx: Interrupt Priority Control Registers Each user interrupt source can be assigned to one of eight priority levels. The IPC registers are used to set the interrupt priority level for each source of interrupt. • SR: CPU Status Register The SR is not specifically part of the interrupt controller hardware, but it contains the IPL<2:0> Status bits (SR<7:5>) that indicate the current CPU priority level. The user may change the current CPU priority level by writing to the IPL bits. • CORCON: Core Control Register The CORCON is not specifically part of the interrupt controller hardware, but it contains the IPL3 Status bit which indicates the current CPU priority level. IPL3 is a Read Only bit so that trap events cannot be masked by the user software. Each register is described in detail on the following pages. 6.4.1 Assignment of Interrupts to Control Registers The interrupt sources are assigned to the IFSx, IECx and IPCx registers in the same sequence that they are listed in Table 6-2. For example, the INT0 (External Interrupt 0) is shown as having vector number and a natural order priority of ‘0’. Thus, the INT0IF Status bit is found in IFS0<0>. The INT0 interrupt uses bit 0 of the IEC0 register as its Enable bit and the IPC0<2:0> bits assign the interrupt priority level for the INT0 interrupt. Note: The total number and type of interrupt sources will depend on the device variant. Refer to the specific device data sheet for further details. © 2004 Microchip Technology Inc. DS70053C-page 6-15 Section 6. Interrupts Interrupts 6 Register 6-1: SR: Status Register (In CPU) Register 6-2: CORCON: Core Control Register Upper Byte: R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R-0 R-0 OA OB SA SB OAB SAB DA DC bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 IPL<2:0> RA N OV Z C bit 7 bit 0 bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits 111 = CPU interrupt priority level is 7 (15). User interrupts disabled. 110 = CPU interrupt priority level is 6 (14) 101 = CPU interrupt priority level is 5 (13) 100 = CPU interrupt priority level is 4 (12) 011 = CPU interrupt priority level is 3 (11) 010 = CPU interrupt priority level is 2 (10) 001 = CPU interrupt priority level is 1 (9) 000 = CPU interrupt priority level is 0 (8) Note 1: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU interrupt priority level. The value in parentheses indicates the IPL if IPL<3> = 1. 2: The IPL<2:0> status bits are read only when NSTDIS = 1 (INTCON1<15>). Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ C = Bit can be cleared -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-0 R-0 — — — US EDT DL<1:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R/W-0 R/W-0 R/W-0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF bit 7 bit 0 bit 3 IPL3: CPU Interrupt Priority Level Status bit 3 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less Note 1: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ C = Bit can be cleared -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-16 © 2004 Microchip Technology Inc. Register 6-3: INTCON1: Interrupt Control Register 1 Upper Byte: R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 NSTDIS — — — — OVATE OVBTE COVTE bit 15 bit 8 Lower Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 — — — MATHERR ADDRERR STKERR OSCFAIL — bit 7 bit 0 bit 15 NSTDIS: Interrupt Nesting Disable bit 1 = Interrupt nesting is disabled 0 = Interrupt nesting is enabled bit 14-11 Unimplemented: Read as ‘0’ bit 10 OVATE: Accumulator A Overflow Trap Enable bit 1 = Trap overflow of Accumulator A 0 = Trap disabled bit 9 OVBTE: Accumulator B Overflow Trap Enable bit 1 = Trap overflow of Accumulator B 0 = Trap disabled bit 8 COVTE: Catastrophic Overflow Trap Enable bit 1 = Trap on catastrophic overflow of Accumulator A or B enabled 0 = Trap disabled bit 7-5 Unimplemented: Read as ‘0’ bit 4 MATHERR: Arithmetic Error Status bit 1 = Overflow trap has occurred 0 = Overflow trap has not occurred bit 3 ADDRERR: Address Error Trap Status bit 1 = Address error trap has occurred 0 = Address error trap has not occurred bit 2 STKERR: Stack Error Trap Status bit 1 = Stack error trap has occurred 0 = Stack error trap has not occurred bit 1 OSCFAIL: Oscillator Failure Trap Status bit 1 = Oscillator failure trap has occurred 0 = Oscillator failure trap has not occurred bit 0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70053C-page 6-17 Section 6. Interrupts Interrupts 6 Register 6-4: INTCON2: Interrupt Control Register 2 Upper Byte: R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0 ALTIVT DISI — — — — — — bit 15 bit 8 Lower Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — INT4EP INT3EP INT2EP INT1EP INT0EP bit 7 bit 0 bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit 1 = Use alternate vector table 0 = Use standard (default) vector table bit 14 DISI: DISI Instruction Status bit 1 = DISI instruction is active 0 = DISI is not active bit 13-5 Unimplemented: Read as ‘0’ bit 4 INT4EP: External Interrupt #4 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 3 INT3EP: External Interrupt #3 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 2 INT2EP: External Interrupt #2 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 1 INT1EP: External Interrupt #1 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 0 INT0EP: External Interrupt #0 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-18 © 2004 Microchip Technology Inc. Register 6-5: IFS0: Interrupt Flag Status Register 0 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF bit 7 bit 0 bit 15 CNIF: Input Change Notification Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 14 MI2CIF: I2C Bus Collision Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 13 SI2CIF: I2C Transfer Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 NVMIF: Non-Volatile Memory Write Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 ADIF: A/D Conversion Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 U1TXIF: UART1 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 U1RXIF: UART1 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 SPI1IF: SPI1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 T3IF: Timer3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 T2IF: Timer2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 T1IF: Timer1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred © 2004 Microchip Technology Inc. DS70053C-page 6-19 Section 6. Interrupts Interrupts 6 Register 6-5: IFS0: Interrupt Flag Status Register 0 (Continued) bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 INT0IF: External Interrupt 0 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-20 © 2004 Microchip Technology Inc. Register 6-6: IFS1: Interrupt Flag Status Register 1 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF bit 7 bit 0 bit 15 IC6IF: Input Capture Channel 6 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 14 IC5IF: Input Capture Channel 5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 13 IC4IF: Input Capture Channel 4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 IC3IF: Input Capture Channel 3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 C1IF: CAN1 (Combined) Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 SPI2IF: SPI2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 U2TXIF: UART2 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 U2RXIF: UART2 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 INT2IF: External Interrupt 2 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 T5IF: Timer5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 T4IF: Timer4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 OC4IF: Output Compare Channel 4 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 OC3IF: Output Compare Channel 3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred © 2004 Microchip Technology Inc. DS70053C-page 6-21 Section 6. Interrupts Interrupts 6 Register 6-6: IFS1: Interrupt Flag Status Register 1 (Continued) bit 1 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 INT1IF: External Interrupt 1 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-22 © 2004 Microchip Technology Inc. Register 6-7: IFS2: Interrupt Flag Status Register 2 Upper Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — FLTBIF FLTAIF LVDIF DCIIF QEIIF bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWMIF C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12 FLTBIF: Fault B Input Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 FLTAIF: Fault A Input Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 LVDIF: Programmable Low Voltage Detect Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 DCIIF: Data Converter Interface Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 QEIIF: Quadrature Encoder Interface Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 PWMIF: Motor Control Pulse Width Modulation Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 C2IF: CAN2 (Combined) Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 INT4IF: External Interrupt 4 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 INT3IF: External Interrupt 3 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 OC8IF: Output Compare Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 OC7IF: Output Compare Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred © 2004 Microchip Technology Inc. DS70053C-page 6-23 Section 6. Interrupts Interrupts 6 Register 6-7: IFS2: Interrupt Flag Status Register 2 (Continued) bit 1 OC6IF: Output Compare Channel 6 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 OC5IF: Output Compare Channel 5 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-24 © 2004 Microchip Technology Inc. Register 6-8: IEC0: Interrupt Enable Control Register 0 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE bit 7 bit 0 bit 15 CNIE: Input Change Notification Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 14 MI2CIE: I2C Bus Collision Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 13 SI2CIE: I2C Transfer Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 NVMIE: Non-Volatile Memory Write Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 ADIE: A/D Conversion Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 U1TXIE: UART1 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 U1RXIE: UART1 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 SPI1IE: SPI1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 T3IE: Timer3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 T2IE: Timer2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 OC2IE: Output Compare Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 IC2IE: Input Capture Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 T1IE: Timer1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled © 2004 Microchip Technology Inc. DS70053C-page 6-25 Section 6. Interrupts Interrupts 6 Register 6-8: IEC0: Interrupt Enable Control Register 0 (Continued) bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 INT0IE: External Interrupt 0 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-26 © 2004 Microchip Technology Inc. Register 6-9: IEC1: Interrupt Enable Control Register 1 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE bit 7 bit 0 bit 15 IC6IE: Input Capture Channel 6 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 14 IC5IE: Input Capture Channel 5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 13 IC4IE: Input Capture Channel 4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 IC3IE: Input Capture Channel 3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 C1IE: CAN1 (Combined) Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 SPI2IE: SPI2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 U2TXIE: UART2 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 U2RXIE: UART2 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 INT2IE: External Interrupt 2 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 T5IE: Timer5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 T4IE: Timer4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 OC4IE: Output Compare Channel 4 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 OC3IE: Output Compare Channel 3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 IC8IE: Input Capture Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled © 2004 Microchip Technology Inc. DS70053C-page 6-27 Section 6. Interrupts Interrupts 6 Register 6-9: IEC1: Interrupt Enable Control Register 1 (Continued) bit 1 IC7IE: Input Capture Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 INT1IE: External Interrupt 1 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-28 © 2004 Microchip Technology Inc. Register 6-10: IEC2: Interrupt Enable Control Register 2 Upper Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — FLTBIE FLTAIE LVDIE DCIIE QEIIE bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWMIE C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12 FLTBIE: Fault B Input Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 FLTAIE: Fault A Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 LVDIE: Programmable Low Voltage Detect Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 DCIIE: Data Converter Interface Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 QEIIE: Quadrature Encoder Interface Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 PWMIE: Motor Control Pulse Width Modulation Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 C2IE: CAN2 (Combined) Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 INT4IE: External Interrupt 4 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 INT3IE: External Interrupt 3 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 OC8IE: Output Compare Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 OC7IE: Output Compare Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled © 2004 Microchip Technology Inc. DS70053C-page 6-29 Section 6. Interrupts Interrupts 6 Register 6-10: IEC2: Interrupt Enable Control Register 2 (Continued) bit 1 OC6IE: Output Compare Channel 6 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 OC5IE: Output Compare Channel 5 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-30 © 2004 Microchip Technology Inc. Register 6-11: IPC0: Interrupt Priority Control Register 0 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T1IP<2:0> — OC1IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC1IP<2:0> — INT0IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70053C-page 6-31 Section 6. Interrupts Interrupts 6 Register 6-12: IPC1: Interrupt Priority Control Register 1 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T3IP<2:0> — T2IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC2IP<2:0> — IC2IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 T3IP<2:0>: Timer3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 T2IP<2:0>: Timer2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-32 © 2004 Microchip Technology Inc. Register 6-13: IPC2: Interrupt Priority Control Register 2 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — ADIP<2:0> — U1TXIP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U1RXIP<2:0> — SPI1IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 ADIP<2:0>: A/D Conversion Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 U1TXIP<0>: UART1 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 SPI1IP<2:0>: SPI1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70053C-page 6-33 Section 6. Interrupts Interrupts 6 Register 6-14: IPC3: Interrupt Priority Control Register 3 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — CNIP<2:0> — MI2CIP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — SI2CIP<2:0> — NVMIP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 CNIP<2:0>: Input Change Notification Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 MI2CIP<2:0>: I2C Bus Collision Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 SI2CIP<2:0>: I2C Transfer Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 NVMIP<2:0>: Non-Volatile Memory Write Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-34 © 2004 Microchip Technology Inc. Register 6-15: IPC4: Interrupt Priority Control Register 4 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC3IP<2:0> — IC8IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC7IP<2:0> — INT1IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 OC3IP<2:0>: Output Compare Channel 3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70053C-page 6-35 Section 6. Interrupts Interrupts 6 Register 6-16: IPC5: Interrupt Priority Control Register 5 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — INT2IP<2:0> — T5IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — T4IP<2:0> — OC4IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 INT2IP<2:0>: External Interrupt 2 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 T5IP<2:0>: Timer5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 T4IP<2:0>: Timer4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 OC4IP<2:0>: Output Compare Channel 4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-36 © 2004 Microchip Technology Inc. Register 6-17: IPC6: Interrupt Priority Control Register 6 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — C1IP<2:0> — SPI2IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — U2TXIP<2:0> — U2RXIP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 C1IP<2:0>: CAN1 (Combined) Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 SPI2IP<2:0>: SPI2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 U2TXIP<2:0>: UART2 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 U2RXIP<2:0>: UART2 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70053C-page 6-37 Section 6. Interrupts Interrupts 6 Register 6-18: IPC7: Interrupt Priority Control Register 7 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC6IP<2:0> — IC5IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — IC4IP<2:0> — IC3IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 IC6IP<2:0>: Input Capture Channel 6 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 IC5IP<2:0>: Input Capture Channel 5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 IC4IP<2:0>: Input Capture Channel 4 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 IC3IP<2:0>: Input Capture Channel 3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-38 © 2004 Microchip Technology Inc. Register 6-19: IPC8: Interrupt Priority Control Register 8 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC8IP<2:0> — OC7IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — OC6IP<2:0> — OC5IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 OC8IP<2:0>: Output Compare Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 OC7IP<2:0>: Output Compare Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 OC6IP<2:0>: Output Compare Channel 6 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 OC5IP<2:0>: Output Compare Channel 5 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70053C-page 6-39 Section 6. Interrupts Interrupts 6 Register 6-20: IPC9: Interrupt Priority Control Register 9 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — PWMIP<2:0> — C2IP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — INT4IP<2:0> — INT3IP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 PWMIP<2:0>: Motor Control Pulse Width Modulation Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 C2IP<2:0>: CAN2 (Combined) Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 INT4IP<2:0>: External Interrupt 4 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 INT3IP<2:0>: External Interrupt 3 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-40 © 2004 Microchip Technology Inc. Register 6-21: IPC10: Interrupt Priority Control Register 10 Upper Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — FLTAIP<2:0> — LVDIP<2:0> bit 15 bit 8 Lower Byte: U-0 R/W-1 R/W-0 R/W-0 U-0 R/W-1 R/W-0 R/W-0 — DCIIP<2:0> — QEIIP<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 FLTAIP<2:0>: Fault A Input Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as ‘0’ bit 10-8 LVDIP<2:0>: Programmable Low Voltage Detect Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as ‘0’ bit 6-4 DCIIP<2:0>: Data Converter Interface Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 QEIIP<2:0>: Quadrature Encoder Interface Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70053C-page 6-41 Section 6. Interrupts Interrupts 6 Register 6-22: IPC11: Interrupt Priority Control Register 11 Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R/W-0 — — — — — FLTBIP<2:0> bit 7 bit 0 bit 15-3 Unimplemented: Read as ‘0’ bit 2-0 FLTBIP<2:0>: Fault B Input Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) • • • 001 = Interrupt is priority 1 000 = Interrupt source is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70053C-page 6-42 © 2004 Microchip Technology Inc. 6.5 Interrupt Setup Procedures 6.5.1 Initialization The following steps describe how to configure a source of interrupt: 1. Set the NSTDIS Control bit (INTCON1<15>) if nested interrupts are not desired. 2. Select the user assigned priority level for the interrupt source by writing the control bits in the appropriate IPCx Control register. The priority level will depend on the specific application and type of interrupt source. If multiple priority levels are not desired, the IPCx register control bits for all enabled interrupt sources may be programmed to the same non-zero value. 3. Clear the interrupt flag status bit associated with the peripheral in the associated IFSx Status register. 4. Enable the interrupt source by setting the interrupt enable control bit associated with the source in the appropriate IECx Control register. 6.5.2 Interrupt Service Routine The method that is used to declare an ISR and initialize the IVT with the correct vector address will depend on the programming language (i.e., C or assembler) and the language development tool suite that is used to develop the application. In general, the user must clear the interrupt flag in the appropriate IFSx register for the source of interrupt that the ISR handles. Otherwise, the ISR will be re-entered immediately after exiting the routine. If the ISR is coded in assembly language, it must be terminated using a RETFIE instruction to unstack the saved PC value, SRL value, and old CPU priority level. 6.5.3 Trap Service Routine A Trap Service Routine (TSR) is coded like an ISR, except that the appropriate trap status flag in the INTCON1 register must be cleared to avoid re-entry into the TSR. 6.5.4 Interrupt Disable All user interrupts can be disabled using the following procedure: 1. Push the current SR value onto the software stack using the PUSH instruction. 2. Force the CPU to priority level 7 by inclusive ORing the value 0xE0 with SRL. To enable user interrupts, the POP instruction may be used to restore the previous SR value. Note that only user interrupts with a priority level of 7 or less can be disabled. Trap sources (level 8-level 15) cannot be disabled. The DISI instruction provides a convenient way to disable interrupts of priority levels 1-6, for a fixed period of time. Level 7 interrupt sources are not disabled by the DISI instruction. Note: At a device Reset, the IPC registers are initialized, such that all user interrupt sources are assigned to priority level 4. Section 6. Interrupts Interrupts 6 © 2004 Microchip Technology Inc. DS70053C-page 6-43 Table 6-3: Special Function Registers Associated with Interrupt Controller SFR Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL — 0000 0000 0000 0000 INTCON2 0082 ALTIVT — — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000 IFT0IF 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0 0000 0000 0000 0000 IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000 IFS2 0088 — — — FLTBIF FLTAIF LVDIF DCIIF QEIIF PWMIF C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000 IEC2 0090 — — — FLTBIE FLTAIE LVDIE DCIIE QEIIE PWMIE C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000 IPC0 0094 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100 IPC1 0096 — T31P<2:0> — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> 0100 0100 0100 0100 IPC2 0098 — ADIP<2:0> — U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100 IPC3 009A — CNIP<2:0> — MI2CIP<2:0> — SI2CIP<2:0> — NVMIP<2:0> 0100 0100 0100 0100 IPC4 009C — OC3IP<2:0> — IC8IP<2:0> — IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100 IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> — OC4IP<2:0> 0100 0100 0100 0100 IPC6 00A0 — C1IP<2:0> — SPI2IP<2:0> — U2TXIP<2:0> — U2RXIP<2:0> 0100 0100 0100 0100 IPC7 00A2 — IC6IP<2:0> — IC5IP<2:0> — IC4IP<2:0> — IC3IP<2:0> 0100 0100 0100 0100 IPC8 00A4 — OC8IP<2:0> — OC7IP<2:0> — OC6IP<2:0> — OC5IP<2:0> 0100 0100 0100 0100 IPC9 00A6 — PWMIP<2:0> — C2IP<2:0> — INT41IP<2:0> — INT3IP<2:0> 0100 0100 0100 0100 IPC10 00A8 — FLTAIP<2:0> — LVDIP<2:0> — DCIIP<2:0> — QEIIP<2:0> 0100 0100 0100 0100 IPC11 00AA — — — — — — — — — — — — — FLTBIP<2:0> 0000 0000 0000 0100 Note: All interrupt sources and their associated control bits may not be available on a particular device. Refer to the device data sheet for details. dsPIC30F Family Reference Manual DS70053C-page 6-44 © 2004 Microchip Technology Inc. 6.6 Design Tips Question 1: What happens when two sources of interrupt become pending at the same time and have the same user assigned priority level? Answer: The interrupt source with the highest natural order priority will take precedence. The natural order priority is determined by the Interrupt Vector Table (IVT) address for that source. Interrupt sources with a smaller IVT address have a higher natural order priority. Question 2: Can the DISI instruction be used to disable all sources of interrupt and traps? Answer: The DISI instruction does not disable traps or priority level 7 interrupt sources. However, the DISI instruction can be used as a convenient way to disable all interrupt sources if no priority level 7 interrupt sources are enabled in the user’s application. © 2004 Microchip Technology Inc. DS70053C-page 6-45 Section 6. Interrupts Interrupts 6 6.7 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Interrupts module are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70053C-page 6-46 © 2004 Microchip Technology Inc. 6.8 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates additional technical content for the dsPIC30F Interrupts module. Revision C This revision incorporates all known errata at the time of this document update. © 2005 Microchip Technology Inc. DS70054D-page 7-1 Oscillator 7 Section 7. Oscillator HIGHLIGHTS This section of the manual contains the following topics: 7.1 Introduction .................................................................................................................... 7-2 7.2 Device Clocking and MIPS ............................................................................................ 7-5 7.3 Oscillator Configuration.................................................................................................. 7-6 7.4 Oscillator Control Registers – OSCCON and OSCTUN .............................................. 7-13 7.5 Primary Oscillator......................................................................................................... 7-20 7.6 Crystal Oscillators/Ceramic Resonators ......................................................................7-22 7.7 Determining Best Values for Crystals, Clock Mode, C1, C2 and Rs............................ 7-24 7.8 External Clock Input..................................................................................................... 7-25 7.9 External RC Oscillator..................................................................................................7-26 7.10 Phase Locked Loop (PLL) ........................................................................................... 7-30 7.11 Low-Power 32 kHz Crystal Oscillator........................................................................... 7-31 7.12 Oscillator Start-up Timer (OST).................................................................................... 7-31 7.13 Internal Fast RC Oscillator (FRC)................................................................................ 7-31 7.14 Internal Low-Power RC (LPRC) Oscillator................................................................... 7-32 7.15 Fail-Safe Clock Monitor (FSCM) .................................................................................. 7-32 7.16 Programmable Oscillator Postscaler............................................................................ 7-33 7.17 Clock Switching Operation........................................................................................... 7-34 7.18 Design Tips .................................................................................................................. 7-38 7.19 Related Application Notes............................................................................................7-39 7.20 Revision History ........................................................................................................... 7-40 dsPIC30F Family Reference Manual DS70054D-page 7-2 © 2005 Microchip Technology Inc. 7.1 Introduction This section describes the operation of the oscillator system for dsPIC30F devices in the General Purpose, Sensor and Motor Control families. The oscillator system has the following modules and features: • Various external and internal oscillator options as clock sources • An on-chip PLL to boost internal operating frequency • Clock switching between various clock sources • Programmable clock postscaler for system power savings • A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures • Device clocking controlled by Special Function Registers as well as nonvolatile Configuration bits A simplified diagram of the oscillator system is shown in Figure 7-1. 7.1.1 Oscillator System Features Summary dsPIC30F devices in the General Purpose, Sensor and Motor Control families feature one of three versions of the oscillator system – VERSION 1, VERSION 2 and VERSION 3. The features of the three versions of the oscillator system are summarized in Table 7-1. . Note: Refer to the device data sheet to determine the version of the oscillator system featured on the dsPIC30F device you are using. Table 7-1: Device-Specific Oscillator System Feature Summary Oscillator System dsPIC30F Device Feature Summary VERSION 1 30F6010, 30F6011, 30F6012, 30F6013, 30F6014 Oscillator Sources: • Primary oscillator with Multiple Clock modes – XT, EC, HS • Secondary oscillator (Low-Power 32 kHz Crystal oscillator) • FRC oscillator: Fast Internal RC (7.37 MHz) • LPRC oscillator: Low-Power Internal RC (512 kHz) PLL Clock Multiplier: • 4 MHz-10 MHz input frequency range • 4x Multiplier mode (FOUT = 16 MHz-40 MHz) • 8x Multiplier mode (FOUT = 32 MHz-80 MHz) • 16x Multiplier mode (FOUT = 64 MHz-120 MHz) • PLL VCO lock indication plus ‘out of lock’ trap option • PLL input provided by the following sources: - XT or EC Primary oscillator Clock Scaling Options: Generic postscaler for device clock (divide by 4, 16, 64) Fail-Safe Clock Monitor (FSCM): Detects clock failure and switches over to internal FRC oscillator VERSION 2 30F2010, 30F4011, 30F4012, 30F5011, 30F5013 Oscillator System VERSION 2 adds the following capabilities to VERSION 1: • Internal FRC oscillator may also be provided as an input to the PLL to allow fast execution while eliminating the need for an external clock source (This feature is applicable to all devices other than the 30F2010) • User tuning capability added for the Internal FRC oscillator © 2005 Microchip Technology Inc. DS70054D-page 7-3 Section 7. Oscillator Oscillator 7 VERSION 3 30F2011, 30F2012, 30F3010, 30F3011, 30F3012, 30F3013, 30F3014, 30F4013, 30F5015, 30F5016, 30F6010A, 30F6011A, 30F6012A, 30F6013A, 30F6014A, 30F6015 Oscillator System VERSION 3 adds the following capabilities to VERSION 2: • HS oscillator may also be provided as an input to the PLL to allow greater choices of crystal frequency Table 7-1: Device-Specific Oscillator System Feature Summary Oscillator System dsPIC30F Device Feature Summary dsPIC30F Family Reference Manual DS70054D-page 7-4 © 2005 Microchip Technology Inc. Figure 7-1: Oscillator System Block Diagram Primary OSC1 OSC2 SOSCO SOSCI Oscillator Secondary Clock and Control Block Switching x4, x8, x16 PLL Primary Oscillator Stability Detector Stability Detector Secondary Oscillator Programmable Clock Divider Oscillator Start-up Timer Fail-Safe Clock Monitor (FSCM) Internal Fast RC Oscillator (FRC) Internal Low Power RC Oscillator (LPRC) PWRSAV Instruction Wake-up Request Oscillator Configuration bits Oscillator Trap to Timer1 LPRC FRC Secondary Osc POR Primary Osc PLL Oscillator 32 kHz FOSC(1) (2) Note 1: The system clock output, FOSC, is divided by 4 to get the instruction cycle clock. 2: Devices that feature VERSION 2 or VERSION 3 of the Oscillator System allow the internal FRC oscillator to be connected to the PLL. © 2005 Microchip Technology Inc. DS70054D-page 7-5 Section 7. Oscillator Oscillator 7 7.2 Device Clocking and MIPS Referring to Figure 7-1, the system clock source can be provided by one of four sources. These sources are the Primary oscillator, Secondary oscillator, Internal Fast RC (FRC) oscillator or the Low-Power RC (LPRC) oscillator. The Primary oscillator source has the option of using the internal PLL. The frequency of the selected clock source can optionally be reduced by the programmable postscaler (clock divider). The output from the programmable postscaler becomes the system clock source, FOSC. The system clock source is divided by four to produce the internal instruction cycle clock, FCY. In this document, the instruction cycle clock is also denoted by FOSC/4. The timing diagram in Figure 7-2 shows the relationship between the system clock source and instruction execution. The internal instruction cycle clock, FCY, can be provided on the OSC2 I/O pin for some Operating modes of the Primary oscillator (see Section 7.3 “Oscillator Configuration”). Figure 7-2: Clock/Instruction Cycle Timing Equation 7-1: MIPS and Source Oscillator Frequency Relationship FOSC PC FCY PC PC + 2 PC + 4 Fetch INST (PC) Execute INST (PC - 2) Fetch INST (PC + 2) Execute INST (PC) Fetch INST (PC + 4) Execute INST (PC + 2) TCY FCY = SOURCE OSCILLATOR FREQUENCY * PLL MULTIPLIER PROGRAMMABLE POSTSCALER * 4 ( ) FOSC 4 = dsPIC30F Family Reference Manual DS70054D-page 7-6 © 2005 Microchip Technology Inc. 7.3 Oscillator Configuration The oscillator source (and Operating mode) that is used at a device Power-on Reset event is selected using nonvolatile Configuration bits. The oscillator Configuration bits are located in the FOSC Configuration register. The FOS bits in the FOSC nonvolatile Configuration register select the oscillator source that is used at a Power-on Reset. The Primary oscillator is the default (unprogrammed) selection. The Secondary oscillator, or one of the internal oscillators, may be chosen by programming these bit locations. The FPR bits in the FOSC nonvolatile Configuration register select the Operating mode of the Primary oscillator. dsPIC30F devices in the General Purpose, Sensor and Motor Control families may feature one of three versions of the Oscillator system. The definition of the FOSC nonvolatile Configuration register varies between these versions, as described in the sub-sections below. 7.3.1 Oscillator System VERSION 1 Configuration For devices that feature the Oscillator system VERSION 1, the FOSC nonvolatile Configuration register is shown in Register 7-1. The operating modes for the FPR bits may be selected as shown in Table 7-2. 7.3.2 Oscillator System VERSION 2 Configuration For devices that feature the Oscillator system VERSION 2, the FOSC nonvolatile Configuration register is shown in Register 7-2. The operating modes for the FPR bits may be selected as shown in Table 7-3. 7.3.3 Oscillator System VERSION 3 Configuration For devices that feature the Oscillator system VERSION 3, the FOSC nonvolatile Configuration register is shown in Register 7-3. The operating modes for the FPR bits may be selected as shown in Table 7-4. 7.3.4 Clock Switching Mode Configuration Bits The FCKSM<1:0> Configuration bits (FOSC<15:14>) are used to enable/disable device clock switching and the Fail-Safe Clock Monitor (FSCM). When these bits are unprogrammed (default), clock switching and the FSCM are disabled. These bits carry the same definition and functionality across all versions of the Oscillator system. © 2005 Microchip Technology Inc. DS70054D-page 7-7 Section 7. Oscillator Oscillator 7 Register 7-1: FOSC: Oscillator Configuration Register for Oscillator System VERSION 1 Upper Byte: U U U U UUU U — — — — — — — — bit 23 bit 16 Middle Byte: R/P R/P U U U U R/P R/P FCKSM<1:0> — — — — FOS<1:0> bit 15 bit 8 Lower Byte: U U U U R/P R/P R/P R/P — — — — FPR<3:0> bit 7 bit 0 bit 23-16 Unimplemented: Read as ‘0’ bit 15-14 FCKSM<1:0>: Clock Switching Mode Selection Fuses bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled bit 13-10 Unimplemented: Read as ‘0’ bit 9-8 FOS<1:0>: Oscillator Source Selection on POR bits 11 = Primary Oscillator (Primary Oscillator mode selected by FPR<3:0>) 10 = Internal Low-Power RC Oscillator 01 = Internal Fast RC Oscillator 00 = Low-Power 32 kHz Oscillator (Timer1 oscillator) bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 FPR<3:0>: Oscillator Selection within Primary Group bits, See Table 7-2 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit dsPIC30F Family Reference Manual DS70054D-page 7-8 © 2005 Microchip Technology Inc. Table 7-2: Oscillator System VERSION 1: Configuration Bit Values for Clock Selection Oscillator Mode Oscillator Source FOS<1:0> FPR<3:0> OSC2 Pin Function EC w/ PLL 16x Primary 1 11111 I/O (Note 4) EC w/ PLL 8x Primary 1 11110 I/O EC w/ PLL 4x Primary 1 11101 I/O ECIO Primary 1 11100 I/O EC Primary 1 11011 FOSC/4 Reserved Primary 1 11010 n/a ERC Primary 1 11001 FOSC/4 ERCIO Primary 1 11000 I/O XT w/ PLL 16x Primary 1 10111 (Note 3) XT w/ PLL 8x Primary 1 10110 (Note 3) XT w/ PLL 4x Primary 1 10101 (Note 3) XT Primary 1 10100 (Note 3) HS Primary 1 1001x (Note 3) XTL Primary 1 1000x (Note 3) LP Secondary 0 0 ———— (Notes 1, 2) FRC Internal 0 1 ———— (Notes 1, 2) LPRC Internal 1 0 ———— (Notes 1, 2) Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0> Configuration bits). 2: Note that OSC1 pin cannot be used as an I/O pin, even if the Secondary oscillator or an internal clock source is selected at all times. 3: In these Oscillator modes, a crystal is connected between the OSC1 and OSC2 pins. 4: This is the default Oscillator mode for an unprogrammed (erased) device. An unprogrammed Configuration bit has a value of ‘1’. 5: XTL – XTL Crystal Oscillator mode (200 kHz-4 MHz crystal) 6: XT – XT Crystal Oscillator mode (4 MHz-10 MHz crystal) 7: HS – HS Crystal Oscillator mode (10 MHz-25 MHz crystal) © 2005 Microchip Technology Inc. DS70054D-page 7-9 Section 7. Oscillator Oscillator 7 Register 7-2: FOSC: Oscillator Configuration Register for Oscillator System VERSION 2 Upper Byte: U U U U UUU U — — — — — — — — bit 23 bit 16 Middle Byte: R/P R/P U U U U R/P R/P FCKSM<1:0> — — — — FOS<1:0> bit 15 bit 8 Lower Byte: U U U U R/P R/P R/P R/P — — — — FPR<3:0> bit 7 bit 0 bit 23-16 Unimplemented: Read as ‘0’ bit 15-14 FCKSM<1:0>: Clock Switching Mode Selection Fuses bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled bit 13-10 Unimplemented: Read as ‘0’ bit 9-8 FOS<1:0>: Oscillator Source Selection on POR bits 11 = Primary Oscillator (Primary Oscillator mode selected by FPR<3:0>) 10 = Internal Low-Power RC Oscillator 01 = Internal Fast RC Oscillator 00 = Low-Power 32 kHz Oscillator (Timer1 oscillator) bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 FPR<3:0>: Oscillator Mode Selection within Primary Group bits, See Table 7-3 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit dsPIC30F Family Reference Manual DS70054D-page 7-10 © 2005 Microchip Technology Inc. Table 7-3: Oscillator System VERSION 2: Configuration Bit Values for Clock Selection: Oscillator Mode Oscillator Source FOS<1:0> FPR<3:0> OSC2 Pin Function EC Primary 1 11011 CLKO ECIO Primary 1 11100 I/O EC w/PLL 4x Primary 1 11101 I/O EC w/PLL 8x Primary 1 11110 I/O EC w/PLL 16x Primary 1 11111 I/O (Note 4) ERC Primary 1 11001 CLKO ERCIO Primary 1 11000 I/O XT Primary 1 10100 (Note 3) XT w/PLL 4x Primary 1 10101 (Note 3) XT w/PLL 8x Primary 1 10110 (Note 3) XT w/PLL 16x Primary 1 10111 (Note 3) XTL Primary 1 10000 (Note 3) HS Primary 1 10010 (Note 3) FRC w/PLL 4x Primary 1 10001 I/O FRC w/PLL 8x Primary 1 11010 I/O FRC w/PLL 16x Primary 1 10011 I/O LP Secondary 0 0 ———— (Notes 1, 2) FRC Internal FRC 0 1 ———— (Notes 1, 2) LPRC Internal LPRC 1 0 ———— (Notes 1, 2) Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>). 2: Note that OSC1 pin cannot be used as an I/O pin, even if the secondary oscillator or an internal clock source is selected at all times. 3: In these Oscillator modes, a crystal is connected between the OSC1 and OSC2 pins. 4: This is the default Oscillator mode for an unprogrammed (erased) device. An unprogrammed Configuration bit has a value of ‘1’. 5: XTL – XTL Crystal Oscillator mode (200 kHz-4 MHz crystal) 6: XT – XT Crystal Oscillator mode (4 MHz-10 MHz crystal) 7: HS – HS Crystal Oscillator mode (10 MHz-25 MHz crystal) © 2005 Microchip Technology Inc. DS70054D-page 7-11 Section 7. Oscillator Oscillator 7 Register 7-3: FOSC: Oscillator Configuration Register for Oscillator System VERSION 3 Upper Byte: U U U U UUU U — — — — — — — — bit 23 bit 16 Middle Byte: R/P R/P U U U R/P R/P R/P FCKSM<1:0> — — — FOS<2:0> bit 15 bit 8 Lower Byte: U U U R/P R/P R/P R/P R/P — — — FPR<4:0> bit 7 bit 0 bit 23-16 Unimplemented: Read as ‘0’ bit 15-14 FCKSM<1:0>: Clock Switching and Monitor Selection Configuration bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled bit 13-10 Unimplemented: Read as ‘0’ bit 9-8 FOS<2:0>: Oscillator Group Selection on POR bit 111 = PLL Oscillator; PLL source selected by FPR<4:0> bits 011 = EXT: External Oscillator; OSC1/OSC2 pins; External Oscillator configuration selected by FPR<4:0> bits 010 = LPRC: Internal Low-Power RC 001 = FRC: Internal Fast RC 000 = LPOSC: Low-Power Crystal Oscillator; SOSCI/SOSCO pins bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 FPR<4:0>: Oscillator Selection within Primary Group bits, See Table 7-4. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ dsPIC30F Family Reference Manual DS70054D-page 7-12 © 2005 Microchip Technology Inc. Table 7-4: Oscillator System VERSION 3: Configuration Bit Values for Clock Selection Oscillator Mode Oscillator Source FOS<2:0> FPR<4:0> OSC2 Pin Function ECIO w/ PLL 4x PLL 1 1 101101 I/O ECIO w/ PLL 8x PLL 1 1 101110 I/O ECIO w/ PLL 16x PLL 1 1 101111 I/O FRC w/ PLL 4x PLL 1 1 100001 I/O FRC w/ PLL 8x PLL 1 1 101010 I/O FRC w/ PLL 16x PLL 1 1 100011 I/O XT w/ PLL 4x PLL 1 1 100101 (Note 3) XT w/ PLL 8x PLL 1 1 100110 (Note 3) XT w/ PLL 16x PLL 1 1 100111 (Note 3) HS2 w/ PLL 4x PLL 1 1 110001 (Note 3) HS2 w/ PLL 8x PLL 1 1 110010 (Note 3) HS2 w/ PLL 16x PLL 1 1 110011 (Note 3) HS3 w/ PLL 4x PLL 1 1 110101 (Note 3) HS3 w/ PLL 8x PLL 1 1 110110 (Note 3) HS3 w/ PLL 16x PLL 1 1 110111 (Note 3) ECIO External 0 1 101100 I/O XT External 0 1 100100 (Note 3) HS External 0 1 100010 (Note 3) EC External 0 1 101011 CLKOUT ERC External 0 1 101001 CLKOUT ERCIO External 0 1 101000 I/O XTL External 0 1 100000 (Note 3) LP Secondary 0 0 0xxxxx (Note 1, 2) FRC Internal FRC 0 0 1xxxxx (Note 1, 2) LPRC Internal LPRC 0 1 0xxxxx (Note 1, 2) Note 1: OSC2 pin function is determined by (FPR<4:0>). 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. 3: In these Oscillator modes, a crystal is connected between the OSC1 and OSC2 pins. 4: XTL – XTL Crystal Oscillator mode (200 kHz-4 MHz crystal) 5: XT – XT Crystal Oscillator mode (4 MHz-10 MHz crystal) 6: HS – HS Crystal Oscillator mode (10 MHz-25 MHz crystal) © 2005 Microchip Technology Inc. DS70054D-page 7-13 Section 7. Oscillator Oscillator 7 7.4 Oscillator Control Registers – OSCCON and OSCTUN Run-time control and status of the Oscillator system is provided to the user via Special Function Registers. Table 7-5 summarizes the run-time control features provided in VERSION 1, VERSION 2 and VERSION 3 of the Oscillator System. Refer to the device data sheet to determine the version of the oscillator system featured on the dsPIC30F device you are using. The OSCCON Control register provides control of clock switching and clock source status information. The COSC Status bits in OSCCON are read-only bits that indicate the oscillator source that the device is operating from. The COSC bits are set to the FOS Configuration bit values at a Power-on Reset and will change to indicate the new oscillator source at the end of a clock switch operation. The NOSC Status bits in OSCCON are control bits that select the new clock source for a clock switch operation. The NOSC bits are set to the FOS Configuration bit values at a Power-on Reset or Brown-out Reset and are modified by the user software during a clock switch operation. The POST<1:0> control bits (OSCCON<8:7>) control the system clock divide ratio. The LOCK Status bit (OSCCON<5>) is read-only and indicates the status of the PLL circuit. The CF Status bit (OSCCON<3>) is a readable/writable Status bit that indicates a clock failure. The LPOSCEN control bit (OSCCON<1>) is used to enable or disable the 32 kHz Low-Power Crystal oscillator. The OSWEN control bit (OSCCON<0>) is used to initiate a clock switch operation. The OSWEN bit is cleared automatically after a successful clock switch. The TUN<3:0> bits allow the user to tune the internal FRC oscillator to frequencies higher and lower than the nominal value of 7.37 MHz. 7.4.1 Protection Against Accidental Writes to OSCCON A write to the OSCCON register is intentionally made difficult, because it controls clock switching and clock scaling. To write to the OSCCON low byte, the following code sequence must be executed without any other instructions in between: Byte Write 0x46 to OSCCONL Byte Write 0x57 to OSCCONL After this sequence, a byte write to OSCCONL is allowed for one instruction cycle. Write the desired value or use a bit manipulation instruction. To write to the OSCCON high byte, the following instructions must be executed without any other instructions in between: Byte Write 0x78 to OSCCONH Byte Write 0x9A to OSCCONH After this sequence, a byte write is allowed to OSCCONH for one instruction cycle. Write the desired value or use a bit manipulation instruction. Table 7-5: Oscillator Control SFRs Oscillator System Oscillator Control SFRs Feature Summary VERSION 1 Control via OSCCON SFR. Refer to Register 7-4. VERSION 2 Control via OSCCON SFR. User may tune the FRC oscillator via TUN<3:0> bits in OSCCON. Refer to Register 7-5. VERSION 3 Control via OSCCON and OSCTUN SFRs. User may tune the FRC oscillator via TUN<3:0> bits in OSCTUN. Refer to Register 7-6 and Register 7-7. Note: The OSCCON register is write-protected because it controls the device clock switching mechanism. See Section 7.4.1 “Protection Against Accidental Writes to OSCCON” for instructions on writing to OSCCON. dsPIC30F Family Reference Manual DS70054D-page 7-14 © 2005 Microchip Technology Inc. Register 7-4: OSCCON: Oscillator Control Register – Oscillator System VERSION 1 Upper Byte: U-0 U-0 R-y R-y U-0 U-0 R/W-y R/W-y — — COSC<1:0> — — NOSC<1:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R-0 U-0 R/W-0 U-0 R/W-0 R/W-0 POST<1:0> LOCK — CF — LPOSCEN OSWEN bit 7 bit 0 bit 15-14 Unimplemented: Read as ‘0’ bit 13-12 COSC<1:0>: Current Oscillator Source Status bits 11 = Primary oscillator 10 = Internal LPRC oscillator 01 = Internal FRC oscillator 00 = Low-Power 32 kHz Crystal oscillator (Timer1) bit 11-10 Unimplemented: Read as ‘0’ bit 9-8 NOSC<1:0>: New Oscillator Group Selection bits 11 = Primary oscillator 10 = Internal LPRC oscillator 01 = Internal FRC oscillator 00 = Low-Power 32 kHz Crystal oscillator (Timer1) bit 7-6 POST<1:0>: Oscillator Postscaler Selection bits 11 = Oscillator postscaler divides clock by 64 10 = Oscillator postscaler divides clock by 16 01 = Oscillator postscaler divides clock by 4 00 = Oscillator postscaler does not alter clock bit 5 LOCK: PLL Lock Status bit 1 = Indicates that PLL is in lock 0 = Indicates that PLL is out of lock (or disabled) Reset on POR or BOR Reset when a valid clock switching sequence is initiated Set when PLL lock is achieved after a PLL start Reset when lock is lost Read zero when PLL is not selected as a system clock bit 4 Unimplemented: Read as ‘0’ bit 3 CF: Clock Fail Status bit 1 = FSCM has detected a clock failure 0 = FSCM has not detected a clock failure Reset on POR or BOR Reset when a valid clock switching sequence is initiated Set when clock fail detected bit 2 Unimplemented: Read as ‘0’ bit 1 LPOSCEN: 32 kHz LP Oscillator Enable bit 1 = LP oscillator is enabled 0 = LP oscillator is disabled Reset on POR or BOR bit 0 OSWEN: Oscillator Switch Enable bit 1 = Request oscillator switch to selection specified by NOSC<1:0> bits 0 = Oscillator switch is complete Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown y = Value set from Configuration bits on POR or BOR © 2005 Microchip Technology Inc. DS70054D-page 7-15 Section 7. Oscillator Oscillator 7 Register 7-5: OSCCON: Oscillator Control Register – Oscillator System VERSION 2 Upper Byte: R/W-0 R/W-0 R-y R-y R/W-0 R/W-0 R/W-y R/W-y TUN3 TUN2 COSC<1:0> TUN1 TUN0 NOSC<1:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R-0 U-0 R/W-0 U-0 R/W-0 R/W-0 POST<1:0> LOCK — CF — LPOSCEN OSWEN bit 7 bit 0 bit 15-14 TUN<3:2>: Upper 2 bits of the TUN bit-field. Refer to the description of TUN<1:0> (OSCCON<11:10>) bits for details. bit 13-12 COSC<1:0>: Current Oscillator Source Status bits 11 = Primary oscillator 10 = Internal LPRC oscillator 01 = Internal FRC oscillator 00 = Low-Power 32 kHz Crystal oscillator (Timer1) bit 11-10 TUN<1:0>: Lower 2 bits of the TUN bit-field. The four bit field specified by TUN<3:0> allows the user to tune the Internal Fast RC oscillator which has a nominal frequency of 7.37 MHz. For example, the user may be able to tune the frequency of the FRC oscillator within a range of +/- 12% (or 960 kHz) in steps of 1.5% around the factory-calibrated frequency setting, as follows: TUN<3:0> = 0111 provides the highest frequency ...... TUN<3:0> = 0000 provides the factory-calibrated frequency ...... TUN<3:0> = 1000 provides the lowest frequency Note: Refer to the device-specific data sheet for the exact tuning range and tuning step size for the FRC oscillator on your device. bit 9-8 NOSC<1:0>: New Oscillator Group Selection bits 11 = Primary oscillator 10 = Internal LPRC oscillator 01 = Internal FRC oscillator 00 = Low-Power 32 kHz Crystal oscillator (Timer1) bit 7-6 POST<1:0>: Oscillator Postscaler Selection bits 11 = Oscillator postscaler divides clock by 64 10 = Oscillator postscaler divides clock by 16 01 = Oscillator postscaler divides clock by 4 00 = Oscillator postscaler does not alter clock bit 5 LOCK: PLL Lock Status bit 1 = Indicates that PLL is in lock 0 = Indicates that PLL is out of lock (or disabled) Reset on POR or BOR Reset when a valid clock switching sequence is initiated Set when PLL lock is achieved after a PLL start Reset when lock is lost Read zero when PLL is not selected as a system clock bit 4 Unimplemented: Read as ‘0’ bit 3 CF: Clock Fail Status bit 1 = FSCM has detected a clock failure 0 = FSCM has not detected a clock failure Reset on POR or BOR Reset when a valid clock switching sequence is initiated Set when clock fail detected bit 2 Unimplemented: Read as ‘0’ dsPIC30F Family Reference Manual DS70054D-page 7-16 © 2005 Microchip Technology Inc. OSCCON: Oscillator Control Register – Oscillator System VERSION 2 (Continued) bit 1 LPOSCEN: 32 kHz LP Oscillator Enable bit 1 = LP oscillator is enabled 0 = LP oscillator is disabled Reset on POR or BOR bit 0 OSWEN: Oscillator Switch Enable bit 1 = Request oscillator switch to selection specified by NOSC<1:0> bits 0 = Oscillator switch is complete Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown y = Value set from Configuration bits on POR or BOR © 2005 Microchip Technology Inc. DS70054D-page 7-17 Section 7. Oscillator Oscillator 7 Register 7-6: OSCCON: Oscillator Control Register – Oscillator System VERSION 3 Upper Byte: U-0 R-y R-y R-y U-0 R/W-y R/W-y R/W-y — COSC<2:0> — NOSC<2:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R-0 U-0 R/W-0 U-0 R/W-0 R/W-0 POST<1:0> LOCK — CF — LPOSCEN OSWEN bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-12 COSC<2:0>: Current Oscillator Group Selection bits (Read-Only) 111 = PLL Oscillator; PLL source selected by FPR<4:0> bits 011 = External Oscillator; OSC1/OSC2 pins; External Oscillator configuration selected by FPR<4:0> bits 010 = LPRC internal low-power RC 001 = FRC internal fast RC 000 = LP crystal oscillator; SOSCI/SOSCO pins Set to FOS<2:0> values on POR or BOR Loaded with NOSC<2:0> at the completion of a successful clock switch Set to FRC value when FSCM detects a failure and switches clock to FRC bit 11 Unimplemented: Read as ‘0’ bit 10-8 NOSC<2:0>: New Oscillator Group Selection bits 111 = PLL Oscillator; PLL source selected by FPR<4:0> bits 011 = External Oscillator; OSC1/OSC2 pins; External Oscillator configuration selected by FPR<4:0> bits 010 = LPRC internal low-power RC 001 = FRC internal fast RC 000 = LP crystal oscillator; SOSCI/SOSCO pins Set to FOS<2:0> values on POR or BOR bit 7-6 POST<1:0>: Oscillator Postscaler Selection bits 11 = Oscillator postscaler divides clock by 64 10 = Oscillator postscaler divides clock by 16 01 = Oscillator postscaler divides clock by 4 00 = Oscillator postscaler does not alter clock bit 5 LOCK: PLL Lock Status bit (Read-Only) 1 = Indicates that PLL is in lock 0 = Indicates that PLL is out of lock (or disabled) Reset on POR or BOR Reset when a valid clock switching sequence is initiated Set when PLL lock is achieved after a PLL start Reset when lock is lost Read zero when PLL is not selected as a system clock bit 4 Unimplemented: Read as ‘0’ dsPIC30F Family Reference Manual DS70054D-page 7-18 © 2005 Microchip Technology Inc. OSCCON: Oscillator Control Register – Oscillator System VERSION 3 (Continued) bit 3 CF: Clock Fail Detect bit (Read/Clearable by application) 1 = FSCM has detected clock failure 0 = FSCM has NOT detected clock failure Reset on POR or BOR Reset when a valid clock switching sequence is initiated Set when clock fail detected bit 2 Unimplemented: Read as ‘0’ bit 1 LPOSCEN: 32 kHz Secondary (LP) Oscillator Enable bit 1 = Secondary Oscillator is enabled 0 = Secondary Oscillator is disabled Reset on POR or BOR bit 0 OSWEN: Oscillator Switch Enable bit 1 = Request Oscillator switch to selection specified by NOSCG<2:0> bits 0 = Oscillator switch is complete Reset on POR or BOR Reset after a successful clock switch Reset after a redundant clock switch (i.e., a clock switch operation is requested to the current oscillator) Reset after FSCM switches the oscillator to (Group 1) FRC Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown y = Value set from Configuration bits on POR © 2005 Microchip Technology Inc. DS70054D-page 7-19 Section 7. Oscillator Oscillator 7 Register 7-7: OSCTUN: FRC Oscillator Tuning Register – Oscillator System VERSION 3 Only Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — — TUN<3:0> bit 7 bit 0 bit 15-4 Unimplemented: Read as ‘0’ bit 3-0 TUN<3:0>: The four bit field specified by TUN<3:0> allows the user to tune the Internal Fast RC oscillator which has a nominal frequency of 7.37 MHz. TUN<3:0> = 0111 provides the highest frequency ...... TUN<3:0> = 0000 provides the factory-calibrated frequency ...... TUN<3:0> = 1000 provides the lowest frequency Note 1: Refer to the device-specific data sheet for the exact tuning range and tuning step size for the FRC oscillator on your device. 2: Certain devices may have more than four TUN bits. Refer to the device-specific data sheet to identify the number of TUN bits available to the user for tuning the FRC oscillator. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown y = Value set from Configuration bits on POR dsPIC30F Family Reference Manual DS70054D-page 7-20 © 2005 Microchip Technology Inc. 7.5 Primary Oscillator The Primary oscillator is available on the OSC1 and OSC2 pins of the dsPIC30F device family. The Primary oscillator has a wide variety of operation modes summarized in Table 7-6. In general, the Primary oscillator can be configured for an external clock input, external RC network, or an external crystal. Further details of the Primary Oscillator Operating modes are described in subsequent sections. The FPR bits in the FOSC nonvolatile Configuration register select the Operating mode of the Primary oscillator. Table 7-6: Primary Oscillator Operating Modes Oscillator Mode(4) Description XTL 200 kHz-4 MHz crystal on OSC1:OSC2. XT 4 MHz-10 MHz crystal on OSC1:OSC2. XT w/ PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled. XT w/ PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled. XT w/ PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1). LP 32 kHz crystal on SOSCO:SOSCI(2). HS 10 MHz-25 MHz crystal. HS/2 w/PLL 4x 10 MHz -25 MHz crystal, divide by 2, 4x PLL enabled. HS/2 w/ PLL 8x 10 MHz-25MHz crystal, divide by 2, 8x PLL enabled. HS/2 w/ PLL 16x 10 MHz-25MHz crystal, divide by 2, 16x PLL enabled(1). HS/3 w/PLL 4x 10 MHz-25 MHz crystal, divide by 3, 4x PLL enabled. HS/3 w/ PLL 8x 10 MHz-25MHz crystal, divide by 3, 8x PLL enabled. HS/3 w/ PLL 16x 10 MHz-25MHz crystal, divide by 3, 16x PLL enabled(1). EC External clock input (0-40 MHz). ECIO External clock input (0-40 MHz), OSC2 pin is I/O. EC w/ PLL 4x External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled(1). EC w/ PLL 8x External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled(1). EC w/ PLL 16x External clock input (4-10 MHz), OSC2 pin is I/O, 16x PLL enabled(1). ERC External RC oscillator, OSC2 pin is FOSC/4 output(3). ERCIO External RC oscillator, OSC2 pin is I/O(3). FRC 7.37 MHz internal Fast RC oscillator. FRC w/ PLL 4x 7.37 MHz Internal Fast RC oscillator, 4x PLL enabled. FRC w/ PLL 8x 7.37 MHz Internal Fast RC oscillator, 8x PLL enabled. FRC w/ PLL 16x 7.37 MHz Internal Fast RC oscillator, 16x PLL enabled. LPRC 512 kHz internal Fast RC oscillator. Note 1: dsPIC30F maximum operating frequency of 120 MHz must be met. 2: LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1. 3: Requires external R and C. Frequency operation up to 4 MHz. 4: This table lists a cumulative set of operating modes featured in Oscillator system VERSION 1, VERSION 2 and VERSION 3. © 2005 Microchip Technology Inc. DS70054D-page 7-21 Section 7. Oscillator Oscillator 7 7.5.1 Oscillator Mode Selection Guidelines The main difference between the XT, XTL and HS modes is the gain of the internal inverter of the oscillator circuit, which allows the different frequency ranges. In general, use the oscillator option with the lowest possible gain that still meets specifications. This will result in lower dynamic currents (IDD). The frequency range of each Oscillator mode is the recommended frequency cutoff, but the selection of a different Gain mode is acceptable as long as a thorough validation is performed (voltage, temperature and component variations, such as resistor, capacitor and internal oscillator circuitry). The oscillator feedback circuit is disabled in all EC and ECIO modes. The OSC1 pin is a high impedance input and can be driven by a CMOS driver. The ERC and ERCIO modes provide the least expensive solution for device oscillation (only an external resistor and capacitor is required). These modes also provide the most variation in the oscillation frequency. If the Primary oscillator is configured for an external clock input or an external RC network, the OSC2 pin is not required to support the oscillator function. For these modes, the OSC2 pin can be used as an additional device I/O pin or a clock output pin. When the OSC2 pin is used as a clock output pin, the output frequency is FOSC/4. The XTL mode is a Low Power/Low Frequency mode. This mode of the oscillator consumes the least amount of power of the three Crystal modes. The XT mode is a Medium Power/Medium Frequency mode and HS mode provides the highest oscillator frequencies with a crystal. The EC and XT modes that use the PLL circuit provide the highest device operating frequencies. The oscillator circuit will consume the most current in these modes because the PLL is enabled to multiply the frequency of the oscillator. dsPIC30F Family Reference Manual DS70054D-page 7-22 © 2005 Microchip Technology Inc. 7.6 Crystal Oscillators/Ceramic Resonators In XT, XTL and HS modes, a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation (Figure 7-3). The dsPIC30F oscillator design requires the use of a parallel cut crystal. Using a series cut crystal may give a frequency out of the crystal manufacturer’s specifications. Figure 7-3: Crystal or Ceramic Resonator Operation (XT, XT or HS Oscillator Mode) 7.6.1 Oscillator/Resonator Start-up As the device voltage increases from VSS, the oscillator will start its oscillations.The time required for the oscillator to start oscillating depends on many factors. These include: • Crystal/resonator frequency • Capacitor values used (C1 and C2 in Figure 7-3) • Device VDD rise time • System temperature • Series resistor value and type if used (Rs in Figure 7-3) • Oscillator mode selection of device (selects the gain of the internal oscillator inverter) • Crystal quality • Oscillator circuit layout • System noise Figure 7-4 shows a plot of a typical oscillator/resonator start-up. Figure 7-4: Example Oscillator/Resonator Start-up Characteristics C1(3) C2(3) XTAL OSC2 RS(1) OSC1 RF(2) Sleep To Internal Logic dsPIC30FXXXX Note 1: A series resistor, Rs, may be required for AT strip cut crystals. 2: The internal feedback resistor, RF, is typically in the range of 2 to 10 MΩ. 3: See Section 7.7 “Determining Best Values for Crystals, Clock Mode, C1, C2 and Rs”. Voltage Crystal Start-up Time Time Device VDD Maximum VDD of System 0V VIL VIH © 2005 Microchip Technology Inc. DS70054D-page 7-23 Section 7. Oscillator Oscillator 7 7.6.2 Tuning the Oscillator Circuit Since Microchip devices have wide operating ranges (frequency, voltage and temperature; depending on the part and version ordered) and external components (crystals, capacitors,...) of varying quality and manufacture, validation of operation needs to be performed to ensure that the component selection will comply with the requirements of the application. There are many factors that go into the selection and arrangement of these external components. These factors include: • amplifier gain • desired frequency • resonant frequency(s) of the crystal • temperature of operation • supply voltage range • start-up time • stability • crystal life • power consumption • simplification of the circuit • use of standard components • component count 7.6.3 Oscillator Start-up from Sleep Mode The most difficult time for the oscillator to start-up is when waking up from Sleep mode. This is because the load capacitors have both partially charged to some quiescent value, and phase differential at wake-up is minimal. Thus, more time is required to achieve stable oscillation. Remember also that low voltage, high temperatures and the Lower Frequency Clock modes also impose limitations on loop gain, which in turn affects start-up. Each of the following factors increases the start-up time: • a low frequency design (with a Low Gain Clock mode) • a quiet environment (such as a battery operated device) • operating in a shielded box (away from the noisy RF area) • low voltage • high temperature • wake-up from Sleep mode Noise actually helps lower the oscillator start-up time since it provides a “kick start” to the oscillator. Prior to entering Sleep mode, the application may switch to the Internal FRC(+PLL) oscillator in order to reduce the time taken by the device to wake-up from Sleep. dsPIC30F Family Reference Manual DS70054D-page 7-24 © 2005 Microchip Technology Inc. 7.7 Determining Best Values for Crystals, Clock Mode, C1, C2 and RS The best method for selecting components is to apply a little knowledge and a lot of trial, measurement and testing. Crystals are usually selected by their parallel resonant frequency only, however, other parameters may be important to your design, such as temperature or frequency tolerance. Application Note AN588 “PICmicro® Microcontroller Oscillator Design Guide” is an excellent reference to learn more about crystal operation and their ordering information. The dsPIC30F internal oscillator circuit is a parallel oscillator circuit, which requires that a parallel resonant crystal be selected. The load capacitance is usually specified in the 22 pF to 33 pF range. The crystal will oscillate closest to the desired frequency with a load capacitance in this range. It may be necessary to alter these values, as described later, in order to achieve other benefits. The Clock mode is primarily chosen based on the desired frequency of the crystal oscillator. The main difference between the XT, XTL and HS Oscillator modes is the gain of the internal inverter of the oscillator circuit, which allows the different frequency ranges. In general, use the oscillator option with the lowest possible gain that still meets specifications. This will result in lower dynamic currents (IDD). The frequency range of each Oscillator mode is the recommended frequency cutoff, but the selection of a different Gain mode is acceptable, as long as a thorough validation is performed (voltage, temperature and component variations, such as resistor, capacitor and internal oscillator circuitry). C1 and C2 (see Figure 7-3) should also be initially selected based on the load capacitance as suggested by the crystal manufacturer and the tables supplied in the device data sheet. The values given in the device data sheet can only be used as a starting point since the crystal manufacturer, supply voltage, and other factors already mentioned may cause your circuit to differ from the one used in the factory characterization process. Ideally, the capacitance is chosen so that it will oscillate at the highest temperature and the lowest VDD that the circuit will be expected to perform under. High temperature and low VDD both have a limiting effect on the loop gain, such that if the circuit functions at these extremes, the designer can be more assured of proper operation at other temperatures and supply voltage combinations. The output sine wave should not be clipped in the highest gain environment (highest VDD and lowest temperature) and the sine output amplitude should be large enough in the lowest gain environment (lowest VDD and highest temperature) to cover the logic input requirements of the clock as listed in the device data sheet. A method for improving start-up is to use a value of C2 greater than C1. This causes a greater phase shift across the crystal at power-up, which speeds oscillator start-up. Besides loading the crystal for proper frequency response, these capacitors can have the effect of lowering loop gain if their value is increased. C2 can be selected to affect the overall gain of the circuit. A higher C2 can lower the gain if the crystal is being over driven (also, see discussion on Rs). Capacitance values that are too high can store and dump too much current through the crystal, so C1 and C2 should not become excessively large. Unfortunately, measuring the wattage through a crystal is difficult, but if you do not stray too far from the suggested values you should not have to be concerned with this. A series resistor, Rs, is added to the circuit if, after all other external components are selected to satisfaction, the crystal is still being overdriven. This can be determined by looking at the OSC2 pin, which is the driven pin, with an oscilloscope. Connecting the probe to the OSC1 pin will load the pin too much and negatively affect performance. Remember that a scope probe adds its own capacitance to the circuit, so this may have to be accounted for in your design (i.e., if the circuit worked best with a C2 of 22 pF and scope probe was 10 pF, a 33 pF capacitor may actually be called for). The output signal should not be clipping or flattened. Overdriving the crystal can also lead to the circuit jumping to a higher harmonic level or even crystal damage. © 2005 Microchip Technology Inc. DS70054D-page 7-25 Section 7. Oscillator Oscillator 7 The OSC2 signal should be a clean sine wave that easily spans the input minimum and maximum of the clock input pin (4V to 5V peak-to-peak for a 5V VDD is usually good). An easy way to set this is to again test the circuit at the minimum temperature and maximum VDD that the design will be expected to perform in, then look at the output. This should be the maximum amplitude of the clock output. If there is clipping or the sine wave is distorted near VDD and VSS, increasing load capacitors may cause too much current to flow through the crystal or push the value too far from the manufacturer’s load specification. To adjust the crystal current, add a trimmer potentiometer between the crystal inverter output pin and C2 and adjust it until the sine wave is clean. The crystal will experience the highest drive currents at the low temperature and high VDD extremes. The trimmer potentiometer should be adjusted at these limits to prevent overdriving. A series resistor, Rs, of the closest standard value can now be inserted in place of the trimpot. If Rs is too high, perhaps more than 20 kOhms, the input will be too isolated from the output, making the clock more susceptible to noise. If you find a value this high is needed to prevent overdriving the crystal, try increasing C2 to compensate or changing the Oscillator Operating mode. Try to get a combination where Rs is around 10k or less and load capacitance is not too far from the manufacturer specification. 7.8 External Clock Input Two of the Primary Oscillator modes use an external clock. These modes are EC and ECIO. In the EC mode (Figure 7-5), the OSC1 pin can be driven by CMOS drivers. In this mode, the OSC1 pin is high-impedance and the OSC2 pin is the clock output (FOSC/4). This output clock is useful for testing or synchronization purposes. Figure 7-5: External Clock Input Operation (EC Oscillator Configuration) In the ECIO mode (Figure 7-6), the OSC1 pin can be driven by CMOS drivers. In this mode, the OSC1 pin is high-impedance and the OSC2 pin becomes a general purpose I/O pin. The feedback device between OSC1 and OSC2 is turned off to save current. Figure 7-6: External Clock Input Operation (ECIO Oscillator Configuration) OSC1 FOSC/4 OSC2 Clock from Ext. System dsPIC30F OSC1 I/O I/O (OSC2) Clock from Ext. System dsPIC30F dsPIC30F Family Reference Manual DS70054D-page 7-26 © 2005 Microchip Technology Inc. 7.9 External RC Oscillator For timing insensitive applications, the ERC and ERCIO modes of the Primary oscillator offer additional cost savings. The RC oscillator frequency is a function of the: • Supply voltage • External resistor (REXT) values • External capacitor (CEXT) values • Operating temperature In addition to this, the oscillator frequency will vary from unit-to-unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external REXT and CEXT components used. Figure 7-7 shows how the RC combination is connected. For REXT values below 2.2 kΩ, oscillator operation may become unstable or stop completely. For very high REXT values (e.g., 1 MΩ), the oscillator becomes sensitive to noise, humidity and leakage. Thus, it is recommended that a REXT value between 3 kΩ and 100 kΩ is used. Figure 7-7: ERC Oscillator Mode Although the oscillator will operate with no external capacitor (CEXT = 0 pF), a value above 20 pF should be used for noise and stability reasons. With no or a small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance and package lead frame capacitance. The oscillator frequency, divided by 4, is available on the OSC2/CLKO pin, and can be used for test purposes or to synchronize other logic. Note: An external clock source should not be connected to the OSC1 pin when the oscillator is configured for ERC or ERCIO modes. OSC2 CEXT VDD REXT VSS dsPIC30F OSC1 FOSC/4 Internal Clock © 2005 Microchip Technology Inc. DS70054D-page 7-27 Section 7. Oscillator Oscillator 7 7.9.1 External RC Oscillator with I/O Enabled The ERCIO Oscillator mode functions in the exact same manner as the ERC Oscillator mode. The only difference is that the OSC2 pin is configured as an I/O pin. As in the RC mode, the user needs to take into account any variation of the clock frequency due to tolerance of external REXT and CEXT components used, process variation, voltage and temperature. Figure 7-8 shows how the RC with the I/O pin combination is connected. Figure 7-8: ERCIO Oscillator Mode 7.9.2 External RC Start-up There is no start-up delay associated with the RC oscillator. Oscillation will begin when VDD is applied. 7.9.3 RC Operating Frequency The following graphs show the external RC oscillator frequency as a function of device voltage for a selection of RC component values. I/O (OSC2) CEXT REXT VSS OSC1 Internal Clock VDD dsPIC30F Note: The user should verify that VDD is within specifications before the device begins to execute code. Note: The following graphs should be used only as approximate guidelines for RC component selection. The actual frequency will vary based on the system temperature and device. Please refer to the specific device data sheet for further RC oscillator characteristic data. dsPIC30F Family Reference Manual DS70054D-page 7-28 © 2005 Microchip Technology Inc. Figure 7-9: Typical External RC Oscillator Frequency vs. VDD, CEXT = 20 pF Figure 7-10: Typical External RC Oscillator Frequency vs. VDD, CEXT = 100 pF 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (MHz) REXT = 10k REXT = 100k Operation above 4 MHz is not recommended. 0.0 1.0 2.0 3.0 4.0 5.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (MHz) REXT = 5.1k REXT = 10k REXT = 100k Operation above 4 MHz is not recommended. © 2005 Microchip Technology Inc. DS70054D-page 7-29 Section 7. Oscillator Oscillator 7 Figure 7-11: Typical External RC Oscillator Frequency vs. VDD, CEXT = 300 pF 0 50 100 150 200 250 300 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (kHz) REXT = 3.3k REXT = 5.1k REXT = 10k REXT = 100k dsPIC30F Family Reference Manual DS70054D-page 7-30 © 2005 Microchip Technology Inc. 7.10 Phase Locked Loop (PLL) The PLL can be enabled for x4, x8 or x16 Operation modes using the FPR<3:0> oscillator Configuration bits. The input and output frequency ranges for each Operating mode are summarized in Table 7-7. Table 7-7: PLL Frequency Range 7.10.1 PLL Lock Status The PLL circuit is able to detect when the PLL enters a phase locked state. It can also detect when the PLL loses lock. The time delay for the PLL to achieve lock is designated as TLOCK. The TLOCK value is nominally 20 μs. Refer to the “Electrical Specifications” in the specific device data sheet for further information. The LOCK bit is a read-only Status bit (OSCCON<5>) that reflects the LOCK status of the PLL. The LOCK bit is cleared at a Power-on Reset. 7.10.1.1 Loss of PLL Lock During Clock Switching When the PLL is selected as a destination clock source in a clock switch operation (including a Power-on Reset), the LOCK bit is cleared. The LOCK bit is set after phase lock has been achieved. If the PLL fails to achieve lock, then the clock switching circuit will NOT switch to the PLL output for system clock; instead, it will continue to run with the old clock source. 7.10.1.2 Loss of PLL Lock During a Power-on Reset If the PLL fails to achieve lock at a Power-on Reset (POR) and the Fail-Safe Clock Monitor (FSCM) is enabled, the FRC oscillator will become the device clock source and a clock failure trap will occur. 7.10.1.3 Loss of PLL Lock During Normal Device Operation If the PLL loses lock during normal operation for at least 4 input clock cycles, then the LOCK bit is cleared, indicating a loss of PLL lock. Furthermore, a clock failure trap will be generated. In this situation, the processor continues to run using the PLL clock source. The user can switch to another clock source in the Trap Service Routine, if desired. Note: Some PLL output frequency ranges can be achieved that exceed the maximum operating frequency of the dsPIC30F device. Refer to the “Electrical Specifications” in the specific device data sheet for further details. FIN PLL Multiplier FOUT 4 MHz-10 MHz x4 16 MHz-40 MHz 4 MHz-10 MHz x8 32 MHz-80 MHz 4 MHz-7.5 MHz x16 64 MHz-120 MHz Note: Refer to Section 6. “Reset Interrupts” for further details about oscillator failure traps. Note: A loss of PLL lock during normal device operation will generate a clock failure trap, but the system clock source will not be changed. The FSCM does not need to be enabled to detect the loss of lock. © 2005 Microchip Technology Inc. DS70054D-page 7-31 Section 7. Oscillator Oscillator 7 7.11 Low-Power 32 kHz Crystal Oscillator The LP or Secondary oscillator is designed specifically for low power operation with a 32 kHz crystal. The LP oscillator is located on the SOSCO and SOSCI device pins and serves as a secondary crystal clock source for low power operation. The LP oscillator can also drive Timer1 for a real-time clock application. 7.11.1 LP Oscillator Enable The following control bits affect the operation of the LP oscillator: 1. The COSC<1:0> bits in the OSCCON register (OSCCON<13:12>). 2. The LPOSCEN bit in the OSCCON register (OSCCON<1>). When the LP Oscillator is enabled, the SOSCO and SOSCI I/O pins are controlled by the oscillator and cannot be used for other I/O functions. 7.11.1.1 LP Oscillator Continuous Operation The LP oscillator will always be enabled if the LPOSCEN control bit (OSCCON<1>) is set. There are two reasons to leave the LP oscillator running. First, keeping the LP oscillator ON at all times allows a fast switch to the 32 kHz system clock for lower power operation. Returning to the faster main oscillator will still require an oscillator start-up time if it is a crystal type source (see Section 7.12 “Oscillator Start-up Timer (OST)”). Second, the oscillator should remain ON at all times when using Timer1 as a real-time clock. 7.11.1.2 LP Oscillator Intermittent Operation When the LPOSCEN control bit (OSCCON<1>) is cleared, the LP oscillator will only operate when it is selected as the current device clock source (COSC<1:0> = 00). The LP oscillator will be disabled if it is the current device clock source and the device enters Sleep mode. 7.11.2 LP Oscillator Operation with Timer1 The LP oscillator can be used as a clock source for Timer1 in a real-time clock application. Refer to Section 12. “Timers” for further details. 7.12 Oscillator Start-up Timer (OST) In order to ensure that a crystal oscillator (or ceramic resonator) has started and stabilized, an Oscillator Start-up Timer is provided. It is a simple 10-bit counter that counts 1024 TOSC cycles before releasing the oscillator clock to the rest of the system. The time-out period is designated as TOST. The amplitude of the oscillator signal must reach the VIL and VIH thresholds for the oscillator pins before the OST can begin to count cycles (see Figure 7-4). The TOST time is involved every time the oscillator has to restart (i.e., on POR, BOR and wake-up from Sleep mode). The Oscillator Start-up Timer is applied to the LP oscillator and the XT, XTL and HS modes for the Primary oscillator. 7.13 Internal Fast RC Oscillator (FRC) The FRC oscillator is a fast (7.37 MHz nominal) internal RC oscillator. This oscillator is intended to provide a range of device operating speeds without the use of an external crystal, ceramic resonator or RC network. Devices featuring the Oscillator system VERSIONs 2 or 3 may optionally provide the FRC oscillator as an input frequency to the PLL. dsPIC30F Family Reference Manual DS70054D-page 7-32 © 2005 Microchip Technology Inc. 7.14 Internal Low-Power RC (LPRC) Oscillator The LPRC oscillator is a component of the Watchdog Timer (WDT) and oscillates at a nominal frequency of 512 kHz. The LPRC oscillator is the clock source for the Power-up Timer (PWRT) circuit, WDT and clock monitor circuits. It may also be used to provide a low frequency clock source option for applications where power consumption is critical, and timing accuracy is not required. 7.14.1 Enabling the LPRC Oscillator The LPRC oscillator is always enabled at a Power-on Reset because it is the clock source for the PWRT. After the PWRT expires, the LPRC oscillator will remain ON if one of the following is TRUE: • The Fail-Safe Clock Monitor is enabled. • The WDT is enabled. • The LPRC oscillator is selected as the system clock (COSC<1:0> = 10). If none of the above conditions is true, the LPRC will shut-off after the PWRT expires. 7.15 Fail-Safe Clock Monitor (FSCM) The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by programming the FCKSM bits (Clock Switch and Monitor bits) in the FOSC Device Configuration register. Refer to 7.3 “Oscillator Configuration” for further details. If the FSCM function is enabled, the LPRC internal oscillator will run at all times (except during Sleep mode). In the event of an oscillator failure, the FSCM will generate a clock failure trap and will switch the system clock to the FRC oscillator. The user will then have the option to either attempt to restart the oscillator or execute a controlled shutdown. The FSCM module will take the following actions when switching to the FRC oscillator: 1. The COSC<1:0> bits are loaded with ‘01’. 2. The CF bit is set to indicate the clock failure. 3. The OSWEN control bit is cleared to cancel any pending clock switches. 7.15.1 FSCM Delay On a POR, BOR or wake-up event from Sleep mode, a nominal 100 μs delay (TFSCM) may be inserted before the FSCM begins to monitor the system clock source. The purpose of the FSCM delay is to provide time for the oscillator and/or PLL to stabilize when the Power-up Timer (PWRT) is not utilized. The FSCM delay will be generated after the internal System Reset signal, SYSRST, has been released. Refer to Section 8. “Reset” for FSCM delay timing information. The FSCM delay, TFSCM, is applied when the FSCM is enabled and any of the following device clock sources is selected as the system clock: • EC+PLL • XT+PLL • XT • HS • HS/2 or HS/3 + PLL • XTL • LP Note: The oscillation frequency of the LPRC oscillator will vary depending on the device voltage and operating temperature. Refer to the “Electrical Specifications” in the specific device data sheet for further details. Note: For more information about the oscillator failure trap, please refer to Section 6. “Reset Interrupts”. Note: Please refer to the “Electrical Specifications” section of the device data sheet for TFSCM specification values. © 2005 Microchip Technology Inc. DS70054D-page 7-33 Section 7. Oscillator Oscillator 7 7.15.2 FSCM and Slow Oscillator Start-up If the chosen device oscillator has a slow start-up time coming out of POR, BOR or Sleep mode, it is possible that the FSCM delay will expire before the oscillator has started. In this case, the FSCM will initiate a clock failure trap. As this happens, the COSC<1:0> bits (OSCCON<13:12>) are loaded with the FRC oscillator selection. This will effectively shut-off the original oscillator that was trying to start. The user can detect this situation and initiate a clock switch back to the desired oscillator in the Trap Service Routine. 7.15.3 FSCM and WDT In the event of a clock failure, the WDT is unaffected and continues to run on the LPRC clock. 7.16 Programmable Oscillator Postscaler The postscaler allows the user to save power by lowering the frequency of the clock which feeds the CPU and the peripherals. Postscale values can be changed at any time via the POST<1:0> control bits (OSCCON<7:6>). To ensure a clean clock transition, there is some delay before a clock change occurs. The clock postscaler does not change the clock selection multiplexer until a falling edge on the divide-by-64 output occurs. In effect, the switching delay could be up to 64 system clock cycles depending on when the POST<1:0> control bits are written. Figure 7-13 shows the postscaler operation for three different postscaler changes. Figure 7-12: Programmable Oscillator Postscaler Counter div. by 4 div. by 16 div. by 64 System POST1 POST0 00 01 10 11 Clock Input Postscaled System Clock (from Clock Switch and Control Logic) Note: The system clock input can be any available source. dsPIC30F Family Reference Manual DS70054D-page 7-34 © 2005 Microchip Technology Inc. Figure 7-13: Postscaler Update Timing 7.17 Clock Switching Operation The selection of clock sources available for clock switching during device operation are as follows: • Primary oscillator on OSC1/OSC2 pins • Low-Power 32 kHz Crystal (Secondary) oscillator on SOSCO/SOSCI pins • Internal Fast RC (FRC) oscillator • Internal Low-Power RC (LPRC) oscillator 7.17.1 Clock Switching Enable To enable clock switching, the FCKSM1 Configuration bit in the FOSC Configuration register must be programmed to a ‘0’. (Refer to 7.3 “Oscillator Configuration” for further details.) If the FCKSM1 Configuration bit is a ‘1’ (unprogrammed), then the clock switching function is disabled. The Fail-Safe Clock Monitor function is also disabled. This is the default setting. The NOSC control bits in OSCCON do not control the clock selection when clock switching is disabled. However, the COSC bits in OSCCON will reflect the clock source selected by the FPR and FOS Configuration bits in the FOSC Configuration register. The OSWEN control bit (OSCCON<0>) has no effect when clock switching is disabled. It is held at ‘0’ at all times. Divide by 4 Divide by 16 Divide by 64 POST<1:0> 01 10 11 00 Postscaled System Clock System 1:4 1:16 1:1 1:64 Clock Note: This diagram demonstrates the clock postscaler function only. The divide ratios shown in the timing diagram are not correct. Note: The Primary oscillator has multiple operating modes (EC, RC, XT, FRC etc.). The Operating mode of the Primary oscillator is determined by the FPR Configuration bits in the FOSC device Configuration register. (Refer to 7.3 “Oscillator Configuration” for further details.) © 2005 Microchip Technology Inc. DS70054D-page 7-35 Section 7. Oscillator Oscillator 7 7.17.2 Oscillator Switching Sequence The following steps are taken by the hardware and software to change the device clock source. (The steps shown below use the OSCCON register definition for the Oscillator system VERSION 1. For a description of the OSCCON register for the Oscillator system VERSION 2 and VERSION 3, refer to 7.4 “Oscillator Control Registers – OSCCON and OSCTUN”): 1. Read the COSC<1:0> Status bits (OSCCON<13:12>), if desired, to determine current oscillator source. 2. Perform the unlock sequence to allow a write to the OSCCON register high byte. 3. Write the appropriate value to the NOSC<1:0> control bits (OSCCON<9:8>) for the new oscillator source. 4. Perform the unlock sequence to allow a write to the OSCCON register low byte. 5. Set the OSWEN bit (OSCCON<0>). This will INITIATE the oscillator switch. 6. The clock switching hardware compares the COSC<1:0> Status bits with the new value of the NOSC<1:0> control bits. If they are the same, then the clock switch is a redundant operation. In this case, the OSWEN bit is cleared automatically and the clock switch is aborted. 7. If a valid clock switch has been initiated, the LOCK (OSCCON<5>) and the CF (OSCCON<3>) Status bits are cleared. 8. The new oscillator is turned on by the hardware if it is not currently running. If a crystal oscillator must be turned on, the hardware will wait until the OST expires. If the new source is using the PLL, then the hardware waits until a PLL lock is detected (LOCK = 1). 9. The hardware waits for 10 clock cycles from the new clock source and then performs the clock switch. 10. The hardware clears the OSWEN bit to indicate a successful clock transition. In addition, the NOSC<1:0> bit values are transferred to the COSC<1:0> Status bits. 11. The clock switch is completed. The old clock source will be turned off at this time, with the following exceptions: • The LPRC oscillator will stay on if the WDT or FSCM is enabled. • The LP oscillator will stay on if LPOSCEN = 1 (OSCCON<1>). Figure 7-14: Clock Transition Timing Diagram Note: The processor will continue to execute code throughout the clock switching sequence. Timing sensitive code should not be executed during this time. Old Clock Source New Clock Source System Clock Both Oscillators Active OSWEN 1 2 3 4 5 6 7 8 9 10 New Source Enabled New Source Stable Old Source Disabled Note: The system clock can be any selected source – Primary, Secondary, FRC or LPRC. dsPIC30F Family Reference Manual DS70054D-page 7-36 © 2005 Microchip Technology Inc. 7.17.3 Clock Switching Tips • If the destination clock source is a crystal oscillator, the clock switch time will be dominated by the oscillator start-up time. • If the new clock source does not start, or is not present, then the clock switching hardware will simply wait for the 10 synchronization cycles to occur. The user can detect this situation because the OSWEN bit (OSCCON<0>) remains set indefinitely. • If the new clock source uses the PLL, a clock switch will not occur until lock has been achieved. The user can detect a loss of PLL lock because the LOCK bit will be cleared and the OSWEN bit is set. • The user may wish to consider the settings of the POST<1:0> control bits (OSCCON<7:6>) when executing a clock switch. Switching to a low frequency clock source, such as the LP oscillator with a postscaler ratio greater than 1:1, will result in very slow device operation. 7.17.4 Aborting a Clock Switch In the event the clock switch did not complete, the clock switch logic can be reset by clearing the OSWEN bit. Clearing the OSWEN bit (OSCCON<0>) will: 1. Abandon the clock switch 2. Stop and reset the OST, if applicable 3. Stop the PLL, if applicable A clock switch procedure can be aborted at any time. 7.17.5 Entering Sleep Mode During a Clock Switch If the device enters Sleep mode during a clock switch operation, the clock switch operation is aborted. The processor keeps the old clock selection and the OSWEN bit is cleared. The PWRSAV instruction is then executed normally. 7.17.6 Recommended Code Sequence for Clock Switching The following steps should be taken to change the oscillator source: • Disable interrupts during the OSCCON register unlock and write sequence. • Execute unlock sequence for OSCCON high byte. • Write new oscillator source to NOSC control bits. • Execute unlock sequence for OSCCON low byte. • Set OSWEN bit. • Continue to execute code that is not clock sensitive (optional). • Invoke an appropriate amount of software delay (cycle counting) to allow for oscillator and/or PLL start-up. • Check to see if OSWEN is ‘0’. If it is, we are DONE SUCCESSFULLY. • If OSWEN is still set, then check LOCK bit to determine cause of failure. Note: The application should not attempt to switch to a clock of frequency lower than 100 kHz when the Fail-Safe Clock Monitor is enabled. If such clock switching is performed, the device may generate an oscillator fail trap and switch to the Fast RC oscillator. © 2005 Microchip Technology Inc. DS70054D-page 7-37 Section 7. Oscillator Oscillator 7 7.17.7 Clock Switch Code Examples 7.17.7.1 Starting a Clock Switch The following code sequence shows how to unlock the OSCCON register and begin a clock switch operation: ;Place the new oscillator selection in W0 ;OSCCONH (high byte) Unlock Sequence MOV #OSCCONH, w1 MOV #0x78, w2 MOV #0x9A, w3 MOV.B w2, [w1] MOV.B w3, [w1] ;Set new oscillator selection MOV.B WREG, OSCCONH ;OSCCONL (low byte) unlock sequence MOV #OSCCONL, w1 MOV.B #0x01, w0 MOV #0x46, w2 MOV #0x57, w3 MOV.B w2, [w1] MOV.B w3, [w1] ;Start oscillator switch operation MOV.b w0, [w1] 7.17.7.2 Aborting a Clock Switch The following code sequence would be used to ABORT an unsuccessful clock switch: MOV OSCCON,W0 ; Read OSCCON into W0 BCLR W0, #OSWEN ; Clear bit 0 in W0 MOV #OSCCON,W1 ; pointer to OSCCON MOV.B #0x46,W2 ; first unlock code MOV.B #0x57,W3 ; second unlock code MOV.B W2, [W1] ; write first unlock code MOV.B W3, [W1] ; write second unlock code MOV.B W0, [W1] ; ABORT the switch dsPIC30F Family Reference Manual DS70054D-page 7-38 © 2005 Microchip Technology Inc. 7.18 Design Tips Question 1: When looking at the OSC2 pin after power-up with an oscilloscope, there is no clock. What can cause this? Answer: 1. Entering Sleep mode with no source for wake-up (such as, WDT, MCLR, or an interrupt). Verify that the code does not put the device to Sleep without providing for wake-up. If it is possible, try waking it up with a low pulse on MCLR. Powering up with MCLR held low will also give the crystal oscillator more time to start-up, but the Program Counter will not advance until the MCLR pin is high. 2. The wrong Clock mode is selected for the desired frequency. For a blank device, the default oscillator is EC + 16x PLL. Most parts come with the clock selected in the Default mode, which will not start oscillation with a crystal or resonator. Verify that the Clock mode has been programmed correctly. 3. The proper power-up sequence has not been followed. If a CMOS part is powered through an I/O pin prior to power-up, bad things can happen (latch-up, improper start-up, etc.). It is also possible for brown-out conditions, noisy power lines at start-up, and slow VDD rise times to cause problems. Try powering up the device with nothing connected to the I/O, and power-up with a known, good, fast rise, power supply. Refer to the power-up information in the device data sheet for considerations on brown-out and power-up sequences. 4. The C1 and C2 capacitors attached to the crystal have not been connected properly or are not the correct values. Make sure all connections are correct. The device data sheet values for these components will usually get the oscillator running; however, they just might not be the optimal values for your design. Question 2: The device starts, but runs at a frequency much higher than the resonant frequency of the crystal. Answer: The gain is too high for this oscillator circuit. Refer to Section 7.6 “Crystal Oscillators/Ceramic Resonators” to aid in the selection of C2 (may need to be higher), Rs (may be needed) and Clock mode (wrong mode may be selected). This is especially possible for low frequency crystals, like the common 32.768 kHz. Question 3: The design runs fine, but the frequency is slightly off. What can be done to adjust this? Answer: Changing the value of C1 has some effect on the oscillator frequency. If a SERIES resonant crystal is used, it will resonate at a different frequency than a PARALLEL resonant crystal of the same frequency call-out. Ensure that you are using a PARALLEL resonant crystal. Question 4: The board works fine, then suddenly quits or loses time. Answer: Other than the obvious software checks that should be done to investigate losing time, it is possible that the amplitude of the oscillator output is not high enough to reliably trigger the oscillator input. Look at the C1 and C2 values and ensure that the device Configuration bits are correct for the desired oscillator mode. Question 5: If I put an oscilloscope probe on an oscillator pin, I don’t see what I expect. Why? Answer: Remember that an oscilloscope probe has capacitance. Connecting the probe to the oscillator circuitry will modify the oscillator characteristics. Consider using a low capacitance (active) probe. © 2005 Microchip Technology Inc. DS70054D-page 7-39 Section 7. Oscillator Oscillator 7 7.19 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Oscillator module are: Title Application Note # PICmicro® Microcontroller Oscillator Design Guide AN588 Low Power Design using PICmicro® Microcontrollers AN606 Crystal Oscillator Basics and Crystal Selection for rfPIC® and PICmicro® Devices AN826 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70054D-page 7-40 © 2005 Microchip Technology Inc. 7.20 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates technical content changes for the dsPIC30F Oscillator module. Revision C This revision incorporates all known errata at the time of this document update. Revision D This revision incorporates details on the three versions (VERSION 1, VERSION 2 and VERSION 3) of the Oscillator system implemented in dsPIC30F devices in the General Purpose, Sensor and Motor Control families. © 2004 Microchip Technology Inc. DS70055C-page 8-1 Reset 8 Section 8. Reset HIGHLIGHTS This section of the manual contains the following topics: 8.1 Introduction .................................................................................................................... 8-2 8.2 Clock Source Selection at Reset ...................................................................................8-5 8.3 POR: Power-on Reset ................................................................................................... 8-5 8.4 External Reset (EXTR) .................................................................................................. 8-7 8.5 Software Reset Instruction (SWR)................................................................................. 8-7 8.6 Watchdog Time-out Reset (WDTR) ............................................................................... 8-7 8.7 Brown-out Reset (BOR)................................................................................................. 8-8 8.8 Using the RCON Status Bits ........................................................................................ 8-10 8.9 Device Reset Times..................................................................................................... 8-11 8.10 Device Start-up Time Lines.......................................................................................... 8-13 8.11 Special Function Register Reset States....................................................................... 8-16 8.12 Design Tips .................................................................................................................. 8-17 8.13 Related Application Notes............................................................................................8-18 8.14 Revision History ........................................................................................................... 8-19 dsPIC30F Family Reference Manual DS70055C-page 8-2 © 2004 Microchip Technology Inc. 8.1 Introduction The Reset module combines all Reset sources and controls the device Master Reset Signal, SYSRST. The following is a list of device Reset sources: • POR: Power-on Reset • EXTR: Pin Reset (MCLR) • SWR: RESET Instruction • WDTR: Watchdog Timer Reset • BOR: Brown-out Reset • TRAPR: Trap Conflict Reset • IOPR: Illegal Opcode Reset • UWR: Uninitialized W Register Reset A simplified block diagram of the Reset module is shown in Figure 8-1. Any active source of Reset will make the SYSRST signal active. Many registers associated with the CPU and peripherals are forced to a known “Reset state”. Most registers are unaffected by a Reset; their status is unknown on POR and unchanged by all other Resets. All types of device Reset will set a corresponding status bit in the RCON register to indicate the type of Reset (see Register 8-1). A POR will clear all bits except for the POR and BOR bits (RCON<2:1>), which are set. The user may set or clear any bit at any time during code execution. The RCON bits only serve as status bits. Setting a particular Reset status bit in software will not cause a device Reset to occur. The RCON register also has other bits associated with the Low Voltage Detect module, Watchdog Timer, and device power saving states. The function of these bits is discussed in other sections of this manual. Figure 8-1: Reset System Block Diagram Note: Refer to the specific peripheral or CPU section of this manual for register Reset states. MCLR VDD VDD Rise Detect POR Sleep or Idle Brown-out Reset BOREN RESET Instruction WDT Module Glitch Filter BOR Trap Conflict Illegal Opcode Uninitialized W Register SYSRST © 2004 Microchip Technology Inc. DS70055C-page 8-3 Section 8. Reset Reset 8 Register 8-1: RCON: Reset Control Register Upper Byte: R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 TRAPR IOPUWR BGST LVDEN LVDL<3:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR bit 7 bit 0 bit 15 TRAPR: Trap Reset Flag bit 1 = A Trap Conflict Reset has occurred 0 = A Trap Conflict Reset has not occurred bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit 1 = An illegal opcode detection, an illegal Address mode, or uninitialized W register used as an address pointer caused a Reset 0 = An illegal opcode or uninitialized W Reset has not occurred bit 13 BGST: Bandgap Stable bit 1 = The bandgap has stabilized 0 = Bandgap is not stable and LVD interrupts should be disabled bit 12 LVDEN: Low Voltage Detect Power Enable bit 1 = Enables LVD, powers up LVD circuit 0 = Disables LVD, powers down LVD circuit bit 11-8 LVDL<3:0>: Low Voltage Detection Limit bits Refer to Section 9. “Low Voltage Detect (LVD)” for further details. bit 7 EXTR: External Reset (MCLR) Pin bit 1 = A Master Clear (pin) Reset has occurred 0 = A Master Clear (pin) Reset has not occurred bit 6 SWR: Software RESET (Instruction) Flag bit 1 = A RESET instruction has been executed 0 = A RESET instruction has not been executed bit 5 SWDTEN: Software Enable/Disable of WDT bit 1 = WDT is turned on 0 = WDT is turned off Note: If FWDTEN fuse bit is ‘1’ (unprogrammed), the WDT is ALWAYS ENABLED, regardless of the SWDTEN bit setting. bit 4 WDTO: Watchdog Timer Time-out Flag bit 1 = WDT Time-out has occurred 0 = WDT Time-out has not occurred bit 3 SLEEP: Wake From Sleep Flag bit 1 = Device has been in Sleep mode 0 = Device has not been in Sleep mode bit 2 IDLE: Wake-up From Idle Flag bit 1 = Device was in Idle mode 0 = Device was not in Idle mode dsPIC30F Family Reference Manual DS70055C-page 8-4 © 2004 Microchip Technology Inc. Register 8-1: RCON: Reset Control Register (Continued) bit 1 BOR: Brown-out Reset Flag bit 1 = A Brown-out Reset has occurred. Note that BOR is also set after Power-on Reset. 0 = A Brown-out Reset has not occurred bit 0 POR: Power-on Reset Flag bit 1 = A Power-up Reset has occurred 0 = A Power-up Reset has not occurred Note: All of the Reset status bits may be set or cleared in software. Setting one of these bits in software does not cause a device Reset. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70055C-page 8-5 Section 8. Reset Reset 8 8.2 Clock Source Selection at Reset If clock switching is enabled, the system clock source at device Reset is chosen as shown in Table 8-1. If clock switching is disabled, the system clock source is always selected according to the oscillator configuration fuses. Refer to Section 7. “Oscillator” for further details. Table 8-1: Oscillator Selection vs. Type of Reset (Clock Switching Enabled) 8.3 POR: Power-on Reset There are two threshold voltages associated with a Power-on Reset (POR). The first voltage is the device threshold voltage, VPOR. The device threshold voltage is the voltage at which the device logic circuits become operable. The second voltage associated with a POR event is the POR circuit threshold voltage which is nominally 1.85V. A power-on event will generate an internal Power-on Reset pulse when a VDD rise is detected. The Reset pulse will be generated at VPOR. The device supply voltage characteristics must meet specified starting voltage and rise rate requirements to generate the POR pulse. In particular, VDD must fall below VPOR before a new POR is initiated. For more information on the VPOR and the VDD rise rate specifications, please refer to the “Electrical Specifications” section of the device data sheet. The POR pulse will reset a POR timer and place the device in the Reset state. The POR also selects the device clock source identified by the oscillator configuration bits. After the Power-on Reset pulse is generated, the POR circuit inserts a small delay, TPOR, which is nominally 10 μs and ensures that internal device bias circuits are stable. Furthermore, a user selected Power-up Time-out (TPWRT) may be applied. The TPWRT parameter is based on device configuration bits and can be 0 ms (no delay), 4 ms, 16 ms or 64 ms. The total delay time at device power-up is TPOR + TPWRT. When these delays have expired, SYSRST will be released on the next leading edge of the instruction cycle clock, and the PC will jump to the Reset vector. The timing for the SYSRST signal is shown in Figure 8-2. A Power-on Reset is initialized when VDD falls below a threshold voltage, VT. The POR delay time is inserted when VDD crosses the POR circuit threshold voltage. Finally, the PWRT delay time, TPWRT, is inserted before SYSRST is released. The power-on event will set the POR and BOR status bits (RCON<1:0>). Reset Type Clock Source Selected Based On POR Oscillator Configuration Fuses BOR Oscillator Configuration Fuses EXTR COSC Control bits (OSCCON<13:12>) WDTR COSC Control bits (OSCCON<13:12>) SWR COSC Control bits (OSCCON<13:12>) dsPIC30F Family Reference Manual DS70055C-page 8-6 © 2004 Microchip Technology Inc. Figure 8-2: POR Module Timing Diagram for Rising VDD TPOR VDD POR Circuit Time Time VPOR POR Circuit Threshold Voltage SYSRST Time TPWRT Internal Power-on Reset pulse occurs at VPOR and begins POR delay time, TPOR. POR circuit is initialized at VPOR. System Reset is released after Power-up Timer expires. (0 ms, 4 ms, 16 ms or 64 ms) Note: When the device exits the Reset condition (begins normal operation), the device operating parameters (voltage, frequency, temperature, etc.) must be within their operating ranges, otherwise the device will not function correctly. The user must ensure that the delay between the time power is first applied and the time SYSRST becomes inactive is long enough to get all operating parameters within specification. © 2004 Microchip Technology Inc. DS70055C-page 8-7 Section 8. Reset Reset 8 8.3.1 Using the POR Circuit To take advantage of the POR circuit, just tie the MCLR pin directly to VDD. This will eliminate external RC components usually needed to create a Power-on Reset delay. A minimum rise time for VDD is required. Refer to the “Electrical Specifications” section in the specific device data sheet for further details. Depending on the application, a resistor may be required between the MCLR pin and VDD. This resistor can be used to decouple the MCLR pin from a noisy power supply rail. The resistor will also be necessary if the device programming voltage, VPP, needs to be placed on the MCLR pin while the device is installed in the application circuit. VPP is 13 volts for most devices. Figure 8-3 shows a possible POR circuit for a slow power supply ramp up. The external Power-on Reset circuit is only required if the device would exit Reset before the device VDD is in the valid operating range. The diode, D, helps discharge the capacitor quickly when VDD powers down. Figure 8-3: External Power-on Reset Circuit (For Slow VDD Rise Time) 8.3.2 Power-up Timer (PWRT) The PWRT provides an optional time delay (TPWRT) before SYSRST is released at a device POR or BOR (Brown-out Reset). The PWRT time delay is provided in addition to the POR delay time (TPOR). The PWRT time delay may be 0 ms, 4 ms, 16 ms or 64 ms nominal (see Figure 8-2). The PWRT delay time is selected using the FPWRT<1:0> configuration fuses in the FBORPOR Device Configuration register. Refer to Section 24. “Device Configuration” for further details. 8.4 External Reset (EXTR) Whenever the MCLR pin is driven low, the device will asynchronously assert SYSRST, provided the input pulse on MCLR is longer than a certain minimum width. (Refer to the “Electrical Specifications” in the specific device data sheet for further details.) When the MCLR pin is released, SYSRST will be released on the next instruction clock cycle, and the Reset vector fetch will commence. The processor will maintain the existing clock source that was in use before the EXTR occurred. The EXTR status bit (RCON<7>) will be set to indicate the MCLR Reset. 8.5 Software RESET Instruction (SWR) Whenever the RESET instruction is executed, the device will assert SYSRST, placing the device in a special Reset state. This Reset state will not re-initialize the clock. The clock source in effect prior to the RESET instruction will remain. SYSRST will be released at the next instruction cycle, and the Reset vector fetch will commence. 8.6 Watchdog Time-out Reset (WDTR) Whenever a Watchdog time-out occurs, the device will asynchronously assert SYSRST. The clock source will remain unchanged. Note that a WDT time-out during Sleep or Idle mode will wake-up the processor, but NOT reset the processor. For more information, refer to Section 10. “Watchdog Timer and Power Saving Modes”. Note 1: The value of R should be low enough so that the voltage drop across it does not violate the VIH specification of the MCLR pin. 2: R1 will limit any current flowing into MCLR from external capacitor C in the event of MCLR/VPP pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). R1 MCLR dsPIC30F D R C VDD VDD dsPIC30F Family Reference Manual DS70055C-page 8-8 © 2004 Microchip Technology Inc. 8.7 Brown-out Reset (BOR) The BOR (Brown-out Reset) module is based on an internal voltage reference circuit. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (i.e., missing waveform portions of the AC cycles due to bad power transmission lines), or voltage sags due to excessive current draw when a large load is energized. The BOR module allows selection of one of the following voltage trip points: • VBOR = 2.0V • VBOR = 2.7V • VBOR = 4.2V • VBOR = 4.5V On a BOR, the device will select the system clock source based on the device configuration bit values (FPR<3:0>, FOS<1:0>). The PWRT time-out (TPWRT), if enabled, will be applied before SYSRST is released. If a crystal oscillator source is selected, the Brown-out Reset will invoke the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If a system clock source is derived from the PLL, then the clock will be held until the LOCK bit (OSCCON<5>) is set. The BOR status bit (RCON<1>) will be set to indicate that a BOR has occurred. The BOR circuit, if enabled, will continue to operate while in Sleep or Idle modes and will reset the device should VDD fall below the BOR threshold voltage. Refer to the “Electrical Specifications” section of the appropriate device data sheet for the BOR electrical specifications. Typical brown-out scenarios are shown in Figure 8-4. As shown, a PWRT delay (if enabled) will be initiated each time VDD rises above the VBOR trip point. Figure 8-4: Brown-out Situations Note: The BOR voltage trip points indicated here are nominal values provided for design guidance only. Refer to the “Electrical Specifications” in the specific device data sheet for BOR voltage limit specifications. VDD SYSRST VBOR VDD SYSRST VBOR VDD SYSRST VBOR TPWRT TPWRT TPWRT VDD dips before PWRT expires © 2004 Microchip Technology Inc. DS70055C-page 8-9 Section 8. Reset Reset 8 8.7.1 BOR Configuration The BOR module is enabled/disabled and configured via device configuration fuses. The BOR module is enabled by default and may be disabled (to reduce power consumption) by programming the BOREN device configuration fuse to a ‘0’ (FBORPOR<7>). The BOREN configuration fuse is located in the FBORPOR Device Configuration register. The BOR voltage trip point (VBOR) is selected using the BORV<1:0> configuration fuses (FBOR<5:4>). Refer to Section 24. “Device Configuration” for further details. 8.7.2 Current Consumption for BOR Operation The BOR circuit relies on an internal voltage reference circuit that is shared with other peripheral devices, such as the Low Voltage Detect module. The internal voltage reference will be active whenever one of its associated peripherals is enabled. For this reason, the user may not observe the expected change in current consumption when the BOR is disabled. 8.7.3 Illegal Opcode Reset A device Reset will be generated if the device attempts to execute an illegal opcode value that was fetched from program memory. The Illegal Opcode Reset function can prevent the device from executing program memory sections that are used to store constant data. To take advantage of the Illegal Opcode Reset, use only the lower 16 bits of each program memory section to store the data values. The upper 8 bits should be programmed with 0x3F, which is an illegal opcode value. If a device Reset occurs as a result of an illegal opcode value, the IOPUWR status bit (RCON<14>) will be set. 8.7.4 Uninitialized W Register Reset The W register array (with the exception of W15) is cleared during all Resets and is considered uninitialized until written to. An attempt to use an uninitialized register as an address pointer will reset the device. Furthermore, the IOPUWR status bit (RCON<14>) will be set. 8.7.5 Trap Conflict Reset A device Reset will occur whenever multiple hard trap sources become pending at the same time. The TRAPR status bit (RCON<15>) will be set. Refer to Section 6. “Reset Interrupts” for more information on Trap Conflict Resets. dsPIC30F Family Reference Manual DS70055C-page 8-10 © 2004 Microchip Technology Inc. 8.8 Using the RCON Status Bits The user can read the RCON register after any device Reset to determine the cause of the Reset. Table 8-2 provides a summary of the Reset flag bit operation. Table 8-2: Reset Flag Bit Operation Note: The status bits in the RCON register should be cleared after they are read so that the next RCON register value after a device Reset will be meaningful. Flag Bit Set by: Cleared by: TRAPR (RCON<15>) Trap conflict event POR IOPWR (RCON<14>) Illegal opcode or uninitialized W register access POR EXTR (RCON<7>) MCLR Reset POR SWR (RCON<6>) RESET instruction POR WDTO (RCON<4>) WDT time-out PWRSAV instruction, POR SLEEP (RCON<3>) PWRSAV #SLEEP instruction POR IDLE (RCON<2>) PWRSAV #IDLE instruction POR BOR (RCON<1>) POR, BOR POR (RCON<0>) POR Note: All RESET flag bits may be set or cleared by the user software. © 2004 Microchip Technology Inc. DS70055C-page 8-11 Section 8. Reset Reset 8 8.9 Device Reset Times The Reset times for various types of device Reset are summarized in Table 8-3. Note that the system Reset signal, SYSRST, is released after the POR delay time and PWRT delay times expire. The time that the device actually begins to execute code will also depend on the system oscillator delays, which include the Oscillator Start-up Timer (OST) and the PLL lock time. The OST and PLL lock times occur in parallel with the applicable SYSRST delay times. The FSCM delay determines the time at which the FSCM begins to monitor the system clock source after the SYSRST signal is released. Table 8-3: Reset Delay Times for Various Device Resets Reset Type Clock Source SYSRST Delay System Clock Delay FSCM Delay Notes POR EC, EXTRC, FRC, LPRC TPOR + TPWRT — — 1, 2 EC + PLL TPOR + TPWRT TLOCK TFSCM 1, 2, 4, 5 XT, HS, XTL, LP TPOR + TPWRT TOST TFSCM 1, 2, 3, 5 XT + PLL TPOR + TPWRT TOST + TLOCK TFSCM 1, 2, 3, 4, 5 BOR EC, EXTRC, FRC, LPRC TPWRT — — 2 EC + PLL TPWRT TLOCK TFSCM 1, 2, 4, 5 XT, HS, XTL, LP TPWRT TOST TFSCM 1, 2, 3, 5 XT + PLL TPWRT TOST + TLOCK TFSCM 1, 2, 3, 4, 5 MCLR Any Clock — — — WDT Any Clock — — — Software Any clock — — — Illegal Opcode Any Clock — — — Uninitialized W Any Clock — — — Trap Conflict Any Clock — — — Note 1: TPOR = Power-on Reset delay (10 μs nominal). 2: TPWRT = Additional “power-up” delay as determined by the FPWRT<1:0> configuration bits. This delay is 0 ms, 4 ms, 16 ms or 64 ms nominal. 3: TOST = Oscillator Start-up Timer. A 10-bit counter counts 1024 oscillator periods before releasing the oscillator clock to the system. 4: TLOCK = PLL lock time (20 μs nominal). 5: TFSCM = Fail-Safe Clock Monitor delay (100 μs nominal). dsPIC30F Family Reference Manual DS70055C-page 8-12 © 2004 Microchip Technology Inc. 8.9.1 POR and Long Oscillator Start-up Times The oscillator start-up circuitry and its associated delay timers is not linked to the device Reset delays that occur at power-up. Some crystal circuits (especially low frequency crystals) will have a relatively long start-up time. Therefore, one or more of the following conditions is possible after SYSRST is released: • The oscillator circuit has not begun to oscillate. • The oscillator start-up timer has NOT expired (if a crystal oscillator is used). • The PLL has not achieved a LOCK (if PLL is used). The device will not begin to execute code until a valid clock source has been released to the system. Therefore, the oscillator and PLL start-up delays must be considered when the Reset delay time must be known. 8.9.2 Fail-Safe Clock Monitor (FSCM) and Device Resets If the FSCM is enabled, it will begin to monitor the system clock source when SYSRST is released. If a valid clock source is not available at this time, the device will automatically switch to the FRC oscillator and the user can switch to the desired crystal oscillator in the Trap Service Routine. 8.9.2.1 FSCM Delay for Crystal and PLL Clock Sources When the system clock source is provided by a crystal oscillator and/or the PLL, a small delay, TFSCM, will automatically be inserted after the POR and PWRT delay times. The FSCM will not begin to monitor the system clock source until this delay expires. The FSCM delay time is nominally 100 μs and provides additional time for the oscillator and/or PLL to stabilize. In most cases, the FSCM delay will prevent an oscillator failure trap at a device Reset when the PWRT is disabled. © 2004 Microchip Technology Inc. DS70055C-page 8-13 Section 8. Reset Reset 8 8.10 Device Start-up Time Lines Figure 8-5 through Figure 8-8 show graphical time lines of the delays associated with device Reset for several operating scenarios. Figure 8-5 shows the delay time line when a crystal oscillator and PLL are used as the system clock and the PWRT is disabled. The internal Power-on Reset pulse occurs at the VPOR threshold. A small POR delay occurs after the internal Reset pulse. (The POR delay is always inserted before device operation begins.) The FSCM, if enabled, begins to monitor the system clock for activity when the FSCM delay expires. Figure 8-5 shows that the oscillator and PLL delays expire before the Fail-Safe Clock Monitor (FSCM) is enabled. However, it is possible that these delays may not expire until after FSCM is enabled. In this case, the FSCM would detect a clock failure and a clock failure trap will be generated. If the FSCM delay does not provide adequate time for the oscillator and PLL to stabilize, the PWRT could be enabled to allow more delay time before device operation begins and the FSCM starts to monitor the system clock. Figure 8-5: Device Reset Delay, Crystal + PLL Clock Source, PWRT Disabled POR Circuit Threshold Voltage SYSRST Oscillator Internal Power-on Reset Pulse TPOR TFSCM TOST TLOCK VDD Oscillator released to system, device operation POR System Reset released. Note 1: Delay times shown are not drawn to scale. 2: FSCM, if enabled, monitors system clock at expiration of TPOR + TFSCM. 3: TLOCK not inserted when PLL is disabled. FSCM FSCM enabled. begins. OSC Delay System OSC dsPIC30F Family Reference Manual DS70055C-page 8-14 © 2004 Microchip Technology Inc. The Reset time line shown in Figure 8-6 is similar to that shown in Figure 8-5, except that the PWRT has been enabled to increase the amount of delay time before SYSRST is released. The FSCM, if enabled, will begin to monitor the system clock after TFSCM expires. Note that the additional PWRT delay time added to TFSCM provides ample time for the system clock source to stabilize in most cases. Figure 8-6: Device Reset Delay, Crystal + PLL Clock Source, PWRT Enabled POR Circuit Threshold Voltage SYSRST Internal Power-on Reset Pulse TPOR TPWRT TOST TLOCK VDD Oscillator released to system. POR Note 1: Delay times shown are not drawn to scale. 2: FSCM, if enabled, monitors system clock at expiration of TPOR + TPWRT + TFSCM. 3: TLOCK not inserted when PLL is is disabled. TFSCM short compared to TPWRT. FSCM Device operation begins. OSC Delay TFSCM © 2004 Microchip Technology Inc. DS70055C-page 8-15 Section 8. Reset Reset 8 The Reset time line in Figure 8-7 shows an example when an EC + PLL clock source is used as the system clock and the PWRT is enabled. This example is similar to the one shown in Figure 8-6, except that the oscillator start-up timer delay, TOST, does not occur. Figure 8-7: Device Reset Delay, EC + PLL Clock, PWRT Enabled POR Circuit Threshold Voltage SYSRST Internal Power-on Reset Pulse TPOR TPWRT TLOCK VDD POR Note 1: Delay times shown are not drawn to scale. 2: FSCM, if enabled, monitors system clock at expiration of TPOR + TPWRT + TFSCM. 3: TLOCK not inserted when PLL is is disabled. TFSCM short compared to TPWRT. FSCM Device operation begins. OSC Delay TFSCM Oscillator released to system. dsPIC30F Family Reference Manual DS70055C-page 8-16 © 2004 Microchip Technology Inc. The Reset time line shown in Figure 8-8 shows an example where an EC without PLL, or RC system clock source is selected and the PWRT is disabled. Note that this configuration provides minimal Reset delays. The POR delay is the only delay time that occurs before device operation begins. No FSCM delay will occur if the FSCM is enabled, because the system clock source is not derived from a crystal oscillator or the PLL. Figure 8-8: Device Reset Delay, EC or RC Clock, PWRT Disabled 8.11 Special Function Register Reset States Most of the special function registers (SFRs) associated with the dsPIC30F CPU and peripherals are reset to a particular value at a device Reset. The SFRs are grouped by their peripheral or CPU function and their Reset values are specified in each section of this manual. The Reset value for each SFR does not depend on the type of Reset, with the exception of two registers. The Reset value for the Reset Control register, RCON, will depend on the type of device Reset. The Reset value for the Oscillator Control register, OSCCON, will depend on the type of Reset and the programmed values of the oscillator configuration bits in the FOSC Device Configuration register (see Table 8-1). POR Circuit Threshold Voltage SYSRST Internal Power-on Reset Pulse TPOR VDD Oscillator released to system. POR System Reset released. Note 1: Delay times shown are not drawn to scale. 2: If enabled, FSCM will begin to monitor system clock at expiration of TPOR. FSCM OSC Delay © 2004 Microchip Technology Inc. DS70055C-page 8-17 Section 8. Reset Reset 8 8.12 Design Tips Question 1: How do I use the RCON register? Answer: The initialization code after a Reset should examine RCON and confirm the source of the Reset. In certain applications, this information can be used to take appropriate action to correct the problem that caused the Reset to occur. All Reset status bits in the RCON register should be cleared after reading them to ensure the RCON value will provide meaningful results after the next device Reset. Question 2: How should I use BOR in a battery operated application? Answer: The BOR feature is not designed to operate as a low battery detect, and should be disabled in battery operated systems (to save current). The Low Voltage Detect peripheral can be used to detect when the battery has reached its end of life voltage. Question 3: The BOR module does not have the programmable trip points that my application needs. How can I work around this? Answer: There are some applications where the device’s programmable BOR trip point levels may still not be at the desired level for the application. Figure 8-9 shows a possible circuit for external brown-out protection, using the MCP100 system supervisor. Figure 8-9: External Brown-out Protection Using the MCP100 Question 4: I initialized a W register with a 16-bit address, but the device appears to reset when I attempt to use the register as an address. Answer: Because all data addresses are 16 bit values, the uninitialized W register logic only recognizes that a register has been initialized correctly if it was subjected to a word load. Two byte moves to a W register, even if successive, will not work, resulting in a device Reset if the W register is used as an address pointer in an operation. VSS RST MCP100 VDD dsPIC30F VDD MCLR dsPIC30F Family Reference Manual DS70055C-page 8-18 © 2004 Microchip Technology Inc. 8.13 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Reset module are: Title Application Note # Power-up Trouble Shooting AN607 Power-up Considerations AN522 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2004 Microchip Technology Inc. DS70055C-page 8-19 Section 8. Reset Reset 8 8.14 Revision History Revision A This is the initial released revision of this document. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. dsPIC30F Family Reference Manual DS70055C-page 8-20 © 2004 Microchip Technology Inc. NOTES: © 2004 Microchip Technology Inc. DS70056C-page 9-1 L o w Volta g e Detect (LVD) 9 Section 9. Low Voltage Detect (LVD) HIGHLIGHTS This section of the manual contains the following topics: 9.1 Introduction .................................................................................................................... 9-2 9.2 LVD Operation ...............................................................................................................9-5 9.3 Design Tips .................................................................................................................... 9-6 9.4 Related Application Notes..............................................................................................9-7 9.5 Revision History ............................................................................................................. 9-8 dsPIC30F Family Reference Manual DS70056C-page 9-2 © 2004 Microchip Technology Inc. 9.1 Introduction The LVD module is applicable to battery operated applications. As the battery drains its energy, the battery voltage slowly drops. The battery source impedance also increases as it loses energy. The LVD module is used to detect when the battery voltage (and therefore, the VDD of the device) drops below a threshold, which is considered near the end of battery life for the application. This allows the application to gracefully shutdown its operation. The LVD module uses an internal reference voltage for comparison. The threshold voltage, VLVD, is programmable during run-time. Figure 9-1 shows a possible application battery voltage curve. Over time, the device voltage decreases. When the device voltage equals voltage VLVD, the LVD logic generates an interrupt. This occurs at time TA. The application software then has until the device voltage is no longer in valid operating range to shutdown the system. Voltage point VB is the minimum valid operating voltage specification. This gives a time TB. The total time for shutdown is TB – TA. Figure 9-1: Typical Low Voltage Detect Application Time Voltage VLVD VMIN TA VLVD = LVD trip point VMIN = Minimum valid device operating voltage Legend: TB © 2004 Microchip Technology Inc. DS70056C-page 9-3 Section 9. Low Voltage Detect L o w Volta g e Detect (LVD) 9 Figure 9-2 shows the block diagram for the LVD module. A comparator uses an internally generated reference voltage as the set point. When the selected tap output of the device voltage is lower than the reference voltage, the LVDIF bit (IFS2<10>) is set. Each node in the resistor divider represents a “trip point” voltage. This voltage is software programmable to any one of 16 values. Figure 9-2: Low Voltage Detect (LVD) Block Diagram 9.1.1 LVD Control Bits The LVD module control bits are located in the RCON register. The LVDEN bit (RCON<12>) enables the Low Voltage Detect module. The LVD module is enabled when LVDEN = 1. If power consumption is important, the LVDEN bit can be cleared for maximum power savings. 9.1.1.1 LVD Trip Point Selection The LVDL<3:0> bits (RCON<11:8>) will choose the LVD trip point. There are 15 trip point options that may be selected from the internal voltage divider connected to VDD. If none of the trip point options are suitable for the application, there is one option that allows the LVD sample voltage to be applied externally on the LVDIN pin. (Refer to the specific device data sheet for the pin location.) The nominal trip point voltage for the external LVD input is 1.24 volts. The LVD external input option requires that the user select values for an external voltage divider circuit that will generate a LVD interrupt at the desired VDD. 9.1.2 Internal Voltage Reference The LVD uses an internal bandgap voltage reference circuit that requires a nominal amount of time to stabilize. Refer to the “Electrical Specifications” in the specific device data sheet for details. The BGST status bit (RCON<13>) indicates when the bandgap voltage reference has stabilized. The user should poll the BGST status bit in software after the LVD module is enabled. At the end of the stabilization time, the LVDIF bit (IFS2<10>) should be cleared. Refer to the LVD module setup procedure in Section 9.2 “LVD Operation”. The bandgap voltage reference circuit can also be used by other peripherals on the device so it may already be active (and stabilized) prior to enabling the LVD module. VDD LVDIF 16 to 1 MUX LVDEN Internally Generated Reference Voltage LVDIN LVDL<3:0> External LVD Input pin 4 dsPIC30F Family Reference Manual DS70056C-page 9-4 © 2004 Microchip Technology Inc. Register 9-1: RCON: Reset Control Register Upper Byte: R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 TRAPR IOPUWR BGST LVDEN LVDL<3:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR bit 7 bit 0 bit 13 BGST: Bandgap Stable bit 1 = The bandgap has stabilized 0 = Bandgap is not stable and LVD interrupts should be disabled bit 12 LVDEN: Low Voltage Detect Power Enable bit 1 = Enables LVD, powers up LVD circuit 0 = Disables LVD, powers down LVD circuit bit 11-8 LVDL<3:0>: Low Voltage Detection Limit bits 1111 = Input to LVD is the LVDIN pin (1.24V threshold, nominal) 1110 = 4.6V 1101 = 4.3V 1100 = 4.1V 1011 = 3.9V 1010 = 3.7V 1001 = 3.6V 1000 = 3.4V 0111 = 3.1V 0110 = 2.9V 0101 = 2.8V (default value at Reset) 0100 = 2.6V 0011 = 2.5V 0010 = 2.3V 0001 = 2.1V 0000 = 1.9V Note: The voltage threshold values shown here are provided for design guidance only. Refer to the “Electrical Specifications” in the device data sheet for further details. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: See Section 8. “Reset” for a description of other bits in the RCON register. © 2004 Microchip Technology Inc. DS70056C-page 9-5 Section 9. Low Voltage Detect L o w Volta g e Detect (LVD) 9 9.2 LVD Operation The LVD module adds robustness to the application because the device can monitor the state of the device voltage. When the device voltage enters a voltage window near the lower limit of the valid operating voltage range, the device can save values to ensure a “clean” shutdown. Depending on the power source for the device, the supply voltage may decrease relatively slowly. This means that the LVD module does not need to be constantly operating. To decrease the current requirements, the LVD circuitry only needs to be enabled for short periods where the voltage is checked. After doing the check, the LVD module may be disabled. 9.2.1 LVD Initialization Steps The following steps are required to setup the LVD module: 1. If the external LVD input pin is used (LVDIN), ensure that all other peripherals multiplexed on the pin are disabled and the pin is configured as an input by setting the appropriate bit in the TRISx registers. 2. Write the desired value to the LVDL control bits (RCON<11:8>), which selects the desired LVD threshold voltage. 3. Ensure that LVD interrupts are disabled by clearing the LVDIE bit (IEC2<10>). 4. Enable the LVD module by setting the LVDEN bit (RCON<12>). 5. Wait for the internal voltage reference to become stable by polling the BGST status bit (RCON<13>), if required (see Section 9.1.2 “Internal Voltage Reference”). 6. Ensure that the LVDIF bit (IFS2<10>) is cleared before interrupts are enabled. If LVDIF is set, the device VDD may be below the chosen LVD threshold voltage. 7. Set LVD interrupts to the desired CPU priority level by writing the LVDIP<2:0> control bits (IPC10<10:8>). 8. Enable LVD interrupts by setting the LVDIE control bit. Once the VDD has fallen below the programmed LVD threshold, the LVDIF bit will remain set. When the LVD module has interrupted the CPU, one of two actions may be taken in the ISR: 1. Clear the LVDIE control bit to disable further LVD module interrupts and take the appropriate shutdown procedures. or 2. Decrease the LVD voltage threshold using the LVDL control bits and clear the LDVIF status bit. This technique can be used to track a gradually decreasing battery voltage. 9.2.2 Current Consumption for LVD Operation The LVD circuit relies on an internal voltage reference circuit that is shared with other peripheral devices, such as the Brown-out Reset (BOR) module. The internal voltage reference will be active whenever one of its associated peripherals is enabled. For this reason, the user may not observe the expected change in current consumption when the LVD module is disabled. 9.2.3 Operation in Sleep and Idle Mode When enabled, the LVD circuitry continues to operate during Sleep or Idle modes. If the device voltage crosses the trip point, the LVDIF bit will be set. The criteria for exiting from Sleep or Idle modes are as follows: • If the LVDIE bit (IEC2<10>) is set, the device will wake from Sleep or Idle mode. • If the assigned priority for the LVD interrupt is less than or equal to the current CPU priority, the device will wake-up and continue code execution from the instruction following the PWRSAV instruction that initiated the Sleep or Idle mode. • If the assigned priority level for the LVD interrupt is greater than the current CPU priority, the device will wake-up and the CPU exception process will begin. Code execution will continue from the first instruction of the LVD ISR. Note: The system design should ensure that the application software is given adequate time to save values before the device exits the valid operating range, or is forced into a Brown-out Reset. dsPIC30F Family Reference Manual DS70056C-page 9-6 © 2004 Microchip Technology Inc. 9.3 Design Tips Question 1: The LVD circuitry seems to be generating random interrupts? Answer: Ensure that the internal voltage reference is stable before enabling the LVD interrupt. This is done by polling the BGST status bit (RCON<13>) after the LVD module is enabled. After this time delay, the LVDIF bit should be cleared and then, the LVDIE bit may be set. Question 2: How can I reduce the current consumption of the module? Answer: Low Voltage Detect is used to monitor the device voltage. The power source is normally a battery that ramps down slowly. This means that the LVD circuity can be disabled for most of the time, and only enabled occasionally to do the device voltage check. Question 3: Should I enable the BOR circuit for a battery powered application? Answer: The BOR circuit is intended to protect the device from improper operation due to power supply fluctuations caused by the AC line voltage. The BOR is typically not required for battery applications and can be disabled for lower current consumption. © 2004 Microchip Technology Inc. DS70056C-page 9-7 Section 9. Low Voltage Detect L o w Volta g e Detect (LVD) 9 9.4 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Low Voltage Detect module are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70056C-page 9-8 © 2004 Microchip Technology Inc. 9.5 Revision History Revision A This is the initial released revision of this document. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. © 2005 Microchip Technology Inc. DS70057D-page 10-1 W D T a n d P o w er Saving Modes 10 Section 10. Watchdog Timer and Power Saving Modes HIGHLIGHTS This section of the manual contains the following topics: 10.1 Introduction .................................................................................................................. 10-2 10.2 Power Saving Modes ................................................................................................... 10-2 10.3 Sleep Mode.................................................................................................................. 10-2 10.4 Idle Mode ..................................................................................................................... 10-4 10.5 Interrupts Coincident with Power Save Instructions.....................................................10-5 10.6 Watchdog Timer........................................................................................................... 10-6 10.7 Peripheral Module Disable (PMD) Registers ............................................................... 10-9 10.8 Design Tips ................................................................................................................ 10-10 10.9 Related Application Notes.......................................................................................... 10-11 10.10 Revision History ......................................................................................................... 10-12 dsPIC30F Family Reference Manual DS70057D-page 10-2 © 2005 Microchip Technology Inc. 10.1 Introduction This section addresses the Watchdog Timer (WDT) and Power Saving modes of the dsPIC30F device family. The dsPIC DSC devices have two reduced Power modes that can be entered through execution of the PWRSAV instruction: • Sleep Mode: The CPU, system clock source, and any peripherals that operate on the system clock source are disabled. This is the lowest Power mode for the device. • Idle Mode: The CPU is disabled, but the system clock source continues to operate. Peripherals continue to operate, but can optionally be disabled. The WDT, when enabled, operates from the internal LPRC clock source and can be used to detect system software malfunctions by resetting the device if the WDT has not been cleared in software. Various WDT time-out periods can be selected using the WDT postscaler. The WDT can also be used to wake the device from Sleep or Idle mode. 10.2 Power Saving Modes The dsPIC30F device family has two special Power Saving modes, Sleep mode and Idle mode, that can be entered through the execution of a special PWRSAV instruction. The assembly syntax of the PWRSAV instruction is as follows: PWRSAV #SLEEP_MODE ; Put the device into SLEEP mode PWRSAV #IDLE_MODE ; Put the device into IDLE mode The Power Saving modes can be exited as a result of an enabled interrupt, WDT time-out, or a device Reset. When the device exits one of these two Operating modes, it is said to ‘wake-up’. The characteristics of the Power Saving modes are described in subsequent sections. 10.3 Sleep Mode The characteristics of Sleep mode are as follows: • The system clock source is shutdown. If an on-chip oscillator is used, it is turned off. • The device current consumption will be at a minimum provided that no I/O pin is sourcing current. • The Fail-Safe Clock Monitor (FSCM) does not operate during Sleep mode since the system clock source is disabled. • The LPRC clock will continue to run in Sleep mode if the WDT is enabled. • The Low Voltage Detect circuit, if enabled, remains operative during Sleep mode. • The BOR circuit, if enabled, remains operative during Sleep mode. • The WDT, if enabled, is automatically cleared prior to entering Sleep mode. • Some peripherals may continue to operate in Sleep mode. These peripherals include I/O pins that detect a change in the input signal, or peripherals that use an external clock input. Any peripheral that is operating on the system clock source will be disabled in Sleep mode. The processor will exit, or ‘wake-up’, from Sleep on one of the following events: • On any interrupt source that is individually enabled • On any form of device Reset • On a WDT time-out 10.3.1 Clock Selection on Wake-up from Sleep The processor will restart the same clock source that was active when Sleep mode was entered. Note: SLEEP_MODE and IDLE_MODE are constants defined in the assembler include file for the selected device. © 2005 Microchip Technology Inc. DS70057D-page 10-3 Section 10. WDT and Power Saving Modes W D T a n d P o w er Saving Modes 10 10.3.2 Delay on Wake-up from Sleep The power-up and oscillator start-up delays associated with waking up from Sleep mode are shown in Table 10-1. In all cases, the POR delay time (TPOR = 10 μs nominal) is applied to allow internal device circuits to stabilize before the internal system Reset signal, SYSRST, is released. Table 10-1: Delay Times for Exit from Sleep Mode 10.3.3 Wake-up from Sleep Mode with Crystal Oscillator or PLL If the system clock source is derived from a crystal oscillator and/or the PLL, then the Oscillator Start-up Timer (OST) and/or PLL lock times must be applied before the system clock source is made available to the device. As an exception to this rule, no oscillator delays are necessary if the system clock source is the LP oscillator and it was running while in Sleep mode. Note that in spite of various delays applied, the crystal oscillator (and PLL) may not be up and running at the end of the POR delay. 10.3.4 FSCM Delay and Sleep Mode If the following conditions are true, a nominal 100 μs delay (TFSCM) will be applied after the POR delay expires when waking from Sleep mode: • The oscillator was shutdown while in Sleep mode. • The system clock is derived from a crystal oscillator source and/or the PLL. The FSCM delay provides time for the OST to expire and the PLL to stabilize before device execution resumes in most cases. If the FSCM is enabled, it will begin to monitor the system clock source after the FSCM delay expires. 10.3.5 Slow Oscillator Start-up The OST and PLL lock times may not have expired when the power-up delays have expired. If the FSCM is enabled, then the device will detect this condition as a clock failure and a clock fail trap will occur. The device will switch to the FRC oscillator and the user can re-enable the crystal oscillator source in the clock failure Trap Service Routine. If FSCM is NOT enabled, then the device will simply not start executing code until the clock is stable. From the user’s perspective, the device will appear to be in Sleep until the oscillator clock has started. Clock Source SYSRST Delay Oscillator Delay FSCM Delay Notes EC, EXTRC TPOR — — 1 EC + PLL TPOR TLOCK TFSCM 1, 3, 4 XT + PLL TPOR TOST + TLOCK TFSCM 1, 2, 3, 4 XT, HS, XTL TPOR TOST TFSCM 1, 2, 4 LP (OFF during Sleep) TPOR TOST TFSCM 1, 2, 4 LP (ON during Sleep) TPOR — — 1 FRC, LPRC TPOR — — 1 Note 1: TPOR = Power-on Reset delay (10 μs nominal). 2: TOST = Oscillator Start-up Timer. A 10-bit counter counts 1024 oscillator periods before releasing the oscillator clock to the system. 3: TLOCK = PLL lock time (20 μs nominal). 4: TFSCM = Fail-Safe Clock Monitor delay (100 μs nominal). Note: Please refer to the “Electrical Specifications” section of the dsPIC30F device data sheet for TPOR, TFSCM and TLOCK specification values. dsPIC30F Family Reference Manual DS70057D-page 10-4 © 2005 Microchip Technology Inc. 10.3.6 Wake-up from Sleep on Interrupt User interrupt sources that are assigned to CPU priority level 0 cannot wake the CPU from Sleep mode, because the interrupt source is effectively disabled. To use an interrupt as a wake-up source, the CPU priority level for the interrupt must be assigned to CPU priority level 1 or greater. Any source of interrupt that is individually enabled, using its corresponding IE control bit in the IECx registers, can wake-up the processor from Sleep mode. When the device wakes from Sleep mode, one of two actions may occur: • If the assigned priority for the interrupt is less than or equal to the current CPU priority, the device will wake-up and continue code execution from the instruction following the PWRSAV instruction that initiated Sleep mode. • If the assigned priority level for the interrupt source is greater than the current CPU priority, the device will wake-up and the CPU exception process will begin. Code execution will continue from the first instruction of the ISR. The Sleep status bit (RCON<3>) is set upon wake-up. 10.3.7 Wake-up from Sleep on Reset All sources of device Reset will wake the processor from Sleep mode. Any source of Reset (other than a POR) that wakes the processor will set the Sleep status bit (RCON<3>) to indicate that the device was previously in Sleep mode. On a Power-on Reset, the Sleep bit is cleared. 10.3.8 Wake-up from Sleep on Watchdog Time-out If the Watchdog Timer (WDT) is enabled and expires while the device is in Sleep mode, the processor will wake-up. The Sleep and WDTO status bits (RCON<3>, RCON<4>) are both set to indicate that the device resumed operation due to the WDT expiration. Note that this event does not reset the device. Operation continues from the instruction following the PWRSAV instruction that initiated Sleep mode. 10.4 Idle Mode User interrupt sources that are assigned to CPU priority level 0 cannot wake the CPU from Idle mode, because the interrupt source is effectively disabled. To use an interrupt as a wake-up source, the CPU priority level for the interrupt must be assigned to CPU priority level 1 or greater. When the device enters Idle mode, the following events occur: • The CPU will stop executing instructions. • The WDT is automatically cleared. • The system clock source will remain active and peripheral modules, by default, will continue to operate normally from the system clock source. Peripherals can optionally be shutdown in Idle mode using their ‘stop-in-idle’ control bit. (See peripheral descriptions for further details.) • If the WDT or FSCM is enabled, the LPRC will also remain active. The processor will wake from Idle mode on the following events: • On any interrupt that is individually enabled. • On any source of device Reset. • On a WDT time-out. Upon wake-up from Idle, the clock is re-applied to the CPU and instruction execution begins immediately starting with the instruction following the PWRSAV instruction, or the first instruction in the ISR. © 2005 Microchip Technology Inc. DS70057D-page 10-5 Section 10. WDT and Power Saving Modes W D T a n d P o w er Saving Modes 10 10.4.1 Wake-up from Idle on Interrupt Any source of interrupt that is individually enabled using the corresponding IE control bit in the IECx register and exceeds the current CPU priority level, will be able to wake-up the processor from Idle mode. When the device wakes from Idle mode, one of two options may occur: • If the assigned priority for the interrupt is less than or equal to the current CPU priority, the device will wake-up and continue code execution from the instruction following the PWRSAV instruction that initiated Idle mode. • If the assigned priority level for the interrupt source is greater than the current CPU priority, the device will wake-up and the CPU exception process will begin. Code execution will continue from the first instruction of the ISR. The Idle status bit (RCON<2>) is set upon wake-up. 10.4.2 Wake-up from Idle on Reset Any Reset, other than a POR, will wake the CPU from Idle mode. On any device Reset, except a POR, the Idle status bit is set (RCON<2>) to indicate that the device was previously in Idle mode. In a Power-on Reset, the Idle bit is cleared. 10.4.3 Wake-up from Idle on WDT Time-out If the WDT is enabled, then the processor will wake from Idle mode on a WDT time-out and continue code execution with the instruction following the PWRSAV instruction that initiated Idle mode. Note that the WDT time-out does not reset the device in this case. The WDTO and Idle status bits (RCON<4>, RCON<2>) will both be set. 10.4.4 Time Delays on Wake from Idle Mode Unlike a wake-up from Sleep mode, there are no time delays associated with wake-up from Idle mode. The system clock is running during Idle mode, therefore, no start-up times are required at wake-up. 10.5 Interrupts Coincident with Power Save Instructions Any interrupt that coincides with the execution of a PWRSAV instruction will be held off until entry into Sleep or Idle mode has completed. The device will then wake-up from Sleep or Idle mode. dsPIC30F Family Reference Manual DS70057D-page 10-6 © 2005 Microchip Technology Inc. 10.6 Watchdog Timer The primary function of the Watchdog Timer (WDT) is to reset the processor in the event of a software malfunction. The WDT is a free running timer, which runs on the internal LPRC oscillator requiring no external components. Therefore, the WDT timer will continue to operate even if the system clock source (e.g., the crystal oscillator) fails. A block diagram of the WDT is shown in Figure 10-1. Figure 10-1: WDT Block Diagram 10.6.1 Enabling and Disabling the WDT The WDT is enabled or disabled by the FWDTEN device configuration bit in the FWDT Device Configuration register. The FWDT Configuration register values are written during device programming. When the FWDTEN configuration bit is set, the WDT is enabled. This is the default value for an erased device. Refer to Section 24. “Device Configuration” for further details on the FWDT Device Configuration register. 10.6.1.1 Software Controlled WDT If the FWDTEN device configuration bit is set, then the WDT is always enabled. However, the WDT can be optionally controlled in the user software when the FWDTEN configuration bit has been programmed to ‘0’. The WDT is enabled in software by setting the SWDTEN control bit (RCON<5>). The SWDTEN control bit is cleared on any device Reset. The software WDT option allows the user to enable the WDT for critical code segments and disable the WDT during non-critical segments for maximum power savings. LPRC WDT Overflow Wake-up Reset WDT 8-bit Watchdog Timer 512 kHz 4 Programmable Prescaler A 1:1, 1:8, 1:64, 1:512 Programmable Prescaler B 1:1, 1:2, 1:3, … 1:15, 1:16 FWC = 128 kHz Enable WDT FWPSB3 FWPSB2 FWPSB1 FWPSB0 FWPSA1 FWPSA0 SWDTEN FWDTEN 2 4 from Sleep Reset All Device Resets Sleep or Idle State LPRC CLRWDT Instr. PWRSAV Instr. Control Oscillator © 2005 Microchip Technology Inc. DS70057D-page 10-7 Section 10. WDT and Power Saving Modes W D T a n d P o w er Saving Modes 10 10.6.2 WDT Operation If enabled, the WDT will increment until it overflows or “times out”. A WDT time-out will force a device Reset, except during Sleep or Idle modes. To prevent a WDT Time-out Reset, the user must periodically clear the Watchdog Timer using the CLRWDT instruction. The CLRWDT instruction also clears the WDT prescalers. If the WDT times out during Sleep or Idle modes, the device will wake-up and continue code execution from where the PWRSAV instruction was executed. In either case, the WDTO bit (RCON<4>) will be set to indicate that the device Reset or wake-up event was due to a WDT time-out. If the WDT wakes the CPU from Sleep or Idle mode, the Sleep status bit (RCON<3>), or Idle status bit (RCON<2>) will also be set to indicate that the device was previously in a Power Saving mode. 10.6.3 WDT Timer Period Selection The WDT clock source is the internal LPRC oscillator, which has a nominal frequency of 512 kHz. The LPRC clock is further divided by 4 to provide a 128 kHz clock to the WDT. The counter for the WDT is 8-bits wide, so the nominal time-out period for the WDT (TWDT) is 2 milliseconds. 10.6.3.1 WDT Prescalers The WDT has two clock prescalers, Prescaler A and Prescaler B, to allow a wide variety of time-out periods. Prescaler A can be configured for 1:1, 1:8, 1:64 or 1:512 divide ratios. Prescaler B can be configured for any divide ratio from 1:1 through 1:16. Time-out periods that range between 2 ms and 16 seconds (nominal) can be achieved using the prescalers. The prescaler settings are selected using the FWPSA<1:0> (Prescaler A) and FWPSB<3:0> (Prescaler B) configuration bits in the FWDT Device Configuration register. The FWPSA<1:0> and FWPSB<3:0> values are written during device programming. For more information on the WDT prescaler configuration bits, please refer to Section 24. “Device Configuration”. The time-out period of the WDT is calculated as follows: Equation 10-1: WDT Time-out Period Note: The WDT time-out period is directly related to the frequency of the LPRC oscillator. The frequency of the LPRC oscillator will vary as a function of device operating voltage and temperature. Please refer to the specific dsPIC30F device data sheet for LPRC clock frequency specifications. WDT Period = 2 ms • Prescale A • Prescale B dsPIC30F Family Reference Manual DS70057D-page 10-8 © 2005 Microchip Technology Inc. Table 10-2 shows time-out periods for various prescaler selections: Table 10-2: WDT Time-out Period vs. Prescale A and Prescale B Settings 10.6.4 Resetting the Watchdog Timer The WDT and all its prescalers are reset: • On ANY device Reset • When a PWRSAV instruction is executed (i.e., Sleep or Idle mode is entered) • By a CLRWDT instruction during normal execution 10.6.5 Operation of WDT in Sleep and Idle Modes If the WDT is enabled, it will continue to run during Sleep or Idle modes. When the WDT time-out occurs, the device will wake the device and code execution will continue from where the PWRSAV instruction was executed. The WDT is useful for low power system designs, because it can be used to periodically wake the device from Sleep mode to check system status and provide action if necessary. Note that the SWDTEN bit is very useful in this respect. If the WDT is disabled during normal operation (FWDTEN = 0), then the SWDTEN bit (RCON<5>) can be used to turn on the WDT just before entering Sleep mode. Prescaler B Value Prescaler A Value 1 8 64 512 1 2 16 128 1024 2 4 32 256 2048 3 6 48 384 3072 4 8 64 512 4096 5 10 80 640 5120 6 12 96 768 6144 7 14 112 896 7168 8 16 128 1024 8192 9 18 144 1152 9216 10 20 160 1280 10240 11 22 176 1408 11264 12 24 192 1536 12288 13 26 208 1664 13312 14 28 224 1792 14336 15 30 240 1920 15360 16 32 256 2048 16384 Note: All time values are in milliseconds. © 2005 Microchip Technology Inc. DS70057D-page 10-9 Section 10. WDT and Power Saving Modes W D T a n d P o w er Saving Modes 10 10.7 Peripheral Module Disable (PMD) Registers The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a peripheral is disabled via the appropriate PMD control bit, the peripheral is in a minimum power consumption state. The control and status registers associated with the peripheral will also be disabled so writes to those registers will have no effect and read values will be invalid. A peripheral module will only be enabled if both the associated bit in the the PMD register is cleared and the peripheral is supported by the specific dsPIC variant. If the peripheral is present in the device, it is enabled in the PMD register by default. Please check individual device data sheet for specific operational details of the PMD register. Note: If a PMD bit is set, the corresponding module is disabled after a delay of 1 instruction cycle. Similarly, if a PMD bit is cleared, the corresponding module is enabled after a delay of 1 instruction cycle (assuming the module control registers are already configured to enable module operation). dsPIC30F Family Reference Manual DS70057D-page 10-10 © 2005 Microchip Technology Inc. 10.8 Design Tips Question 1: The device resets even though I have inserted a CLRWDT instruction in my main software loop. Answer: Make sure that the software loop that contains the CLRWDT instruction meets the minimum specification of the WDT (not the typical value). Also, make sure that interrupt processing time has been accounted for. Question 2: What should my software do before entering Sleep or Idle mode? Answer: Make sure that the sources intended to wake the device have their IE bits set. In addition, make sure that the particular source of interrupt has the ability to wake the device. Some sources do not function when the device is in Sleep mode. If the device is to be placed in Idle mode, make sure that the ‘stop-in-idle’ control bit for each device peripheral is properly set. These control bits determine whether the peripheral will continue operation in Idle mode. See the individual peripheral sections of this manual for further details. Question 3: How do I tell which peripheral woke the device from Sleep or Idle mode? Answer: You can poll the IF bits for each enabled interrupt source to determine the source of wake-up. © 2005 Microchip Technology Inc. DS70057D-page 10-11 Section 10. WDT and Power Saving Modes W D T a n d P o w er Saving Modes 10 10.9 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Watchdog Timer and Power Saving Modes are: Title Application Note # Low Power Design using PICmicro® Microcontrollers AN606 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70057D-page 10-12 © 2005 Microchip Technology Inc. 10.10 Revision History Revision A This is the initial released revision of this document. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C This revision incorporates all known errata at the time of this document update. Revision D Section 10.7, Peripheral Module Disable (PMD) Registers, has been added. © 2005 Microchip Technology Inc. DS70057D-page 10-13 Section 10. WDT and Power Saving Modes W D T a n d P o w er Saving Modes 10 NOTES: © 2005 Microchip Technology Inc. DS70058D-page 11-1 I/O Ports 11 Section 11. I/O Ports HIGHLIGHTS This section of the manual contains the following topics: 11.1 Introduction .................................................................................................................. 11-2 11.2 I/O Port Control Registers............................................................................................ 11-3 11.3 Peripheral Multiplexing................................................................................................. 11-4 11.4 Port Descriptions.......................................................................................................... 11-6 11.5 Change Notification (CN) Pins ..................................................................................... 11-7 11.6 CN Operation in Sleep and Idle Modes ....................................................................... 11-8 11.7 Related Application Notes...........................................................................................11-11 11.8 Revision History ......................................................................................................... 11-12 © 2005 Microchip Technology Inc. DS70058D-page 11-2 Section 11. I/O Ports I/O Ports 11 11.1 Introduction This section provides information on the I/O ports for the dsPIC30F family of devices. All of the device pins (except VDD, VSS, MCLR, and OSC1/CLKI) are shared between the peripherals and the general purpose I/O ports. The general purpose I/O ports allow the dsPIC30F to monitor and control other devices. Most I/O pins are multiplexed with alternate function(s). The multiplexing will depend on the peripheral features on the device variant. In general, when a peripheral is functioning, that pin may not be used as a general purpose I/O pin. Figure 11-1 shows a block diagram of a typical I/O port. This block diagram does not take into account peripheral functions that may be multiplexed onto the I/O pin. Figure 11-1: Dedicated Port Structure Block Diagram D Q CK WR LAT TRIS Latch I/O pin WR PORT Data Bus D Q CK Data Latch Read LAT Read Port Read TRIS WR TRIS I/O Cell Dedicated Port Module dsPIC30F Family Reference Manual DS70058D-page 11-3 © 2005 Microchip Technology Inc. 11.2 I/O Port Control Registers All I/O ports have three registers directly associated with the operation of the port, where ‘x’ is a letter that denotes the particular I/O port: • TRISx: Data Direction register • PORTx: I/O Port register • LATx: I/O Latch register Each I/O pin on the device has an associated bit in the TRIS, PORT and LAT registers. 11.2.1 TRIS Registers The TRISx register control bits determine whether each pin associated with the I/O port is an input or an output. If the TRIS bit for an I/O pin is a ‘1’, then the pin is an input. If the TRIS bit for an I/O pin is a ‘0’, then the pin is configured for an output. An easy way to remember is that a ‘1’ looks like an I (input) and a ‘0’ looks like an O (output). All port pins are defined as inputs after a Reset. 11.2.2 PORT Registers Data on an I/O pin is accessed via a PORTx register. A read of the PORTx register reads the value of the I/O pin, while a write to the PORTx register writes the value to the port data latch. Many instructions, such as BSET and BCLR instructions, are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified, and then written to the port data latch. Care should be taken when read-modify-write commands are used on the PORTx registers and when some I/O pins associated with the port are configured as inputs. If an I/O pin configured as an input is changed to an output at some later time, an unexpected value may be output on the I/O pin. This effect occurs because the read-modify-write instruction reads the instantaneous value on the input pin and loads that value into the port data latch. 11.2.3 LAT Registers The LATx register associated with an I/O pin eliminates the problems that could occur with read-modify-write instructions. A read of the LATx register returns the values held in the port output latches, instead of the values on the I/O pins. A read-modify-write operation on the LAT register, associated with an I/O port, avoids the possibility of writing the input pin values into the port latches. A write to the LATx register has the same effect as a write to the PORTx register. The differences between the PORT and LAT registers can be summarized as follows: • A write to the PORTx register writes the data value to the port latch. • A write to the LATx register writes the data value to the port latch. • A read of the PORTx register reads the data value on the I/O pin. • A read of the LATx register reads the data value held in the port latch. Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers, and the port pin, will read as zeros. Note: The total number of ports and available I/O pins will depend on the device variant. In a given device, all of the bits in a port control register may not be implemented. Refer to the specific device data sheet for further details. © 2005 Microchip Technology Inc. DS70058D-page 11-4 Section 11. I/O Ports I/O Ports 11 11.3 Peripheral Multiplexing When a peripheral is enabled the associated pin output drivers are typically module controlled while a few are user settable. The I/O pin may be read through the input data path, but the output driver for the I/O port bit is generally disabled. An I/O port that shares a pin with another peripheral is always subservient to the peripheral. The peripheral’s output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral, or the associated port, has ownership of the output data and control signals of the I/O pin. Figure 11-2 shows how ports are shared with other peripherals, and the associated I/O pin to which they are connected. Figure 11-2: Shared Port Structure Block Diagram 11.3.1 I/O Multiplexing with Multiple Peripherals For some dsPIC30F devices, especially those with a small number of I/O pins, multiple peripheral functions may be multiplexed on each I/O pin. Figure 11-2 shows an example of two peripherals multiplexed to the same I/O pin. The name of the I/O pin defines the priority of each function associated with the pin. The conceptual I/O pin, shown in Figure 11-2, has two multiplexed peripherals, ‘Peripheral A’ and ‘Peripheral B’ and is named “PERA/PERB/PIO”. The I/O pin name is chosen so that the user can easily tell the priority of the functions assigned to the pin. For the example shown in Figure 11-2, Peripheral A has the highest priority for control of the pin. If Peripheral A and Peripheral B are enabled at the same time, Peripheral A will take control of the I/O pins. Note: In order to use PORTB pins for digital I/O, the corresponding bits in the ADPCFG register must be set to ‘1’, even if the A/D module is turned off. D Q CK TRIS Latch Data Bus D Q CK Data Latch Read LAT Read Port Read TRIS WR TRIS PIO Module WR LAT WR Port 0 Peripheral A o.e. 1 0 1 Peripheral A Enable Peripheral B Enable Peripheral B o.e. 0 Peripheral A Data 1 0 Peripheral B Data 1 Peripheral A Input R Peripheral B Input R PERA/PERB/PIO Peripheral Multiplexers I/O pin dsPIC30F Family Reference Manual DS70058D-page 11-5 © 2005 Microchip Technology Inc. 11.3.1.1 Software Input Pin Control Some of the functions assigned to an I/O pin may be input functions that do not take control of the pin output driver. An example of one such peripheral is the Input Capture module. If the I/O pin associated with the Input Capture is configured as an output, using the appropriate TRIS control bit, the user can manually affect the state of the Input Capture pin through its corresponding PORT register. This behavior can be useful in some situations, especially for testing purposes, when no external signal is connected to the input pin. Referring to Figure 11-2, the organization of the peripheral multiplexers will determine if the peripheral input pin can be manipulated in software using the PORT register. The conceptual peripherals shown in this figure disconnect the PORT data from the I/O pin when the peripheral function is enabled. In general, the following peripherals allow their input pins to be controlled manually through the PORT registers: • External Interrupt pins • Timer Clock Input pins • Input Capture pins • PWM Fault pins Most serial communication peripherals, when enabled, take full control of the I/O pin, so that the input pins associated with the peripheral cannot be affected through the corresponding PORT registers. These peripherals include the following: • SPITM • I2CTM • DCI • UART • CAN 11.3.1.2 Pin Control Summary When a peripheral is enabled the associated pin output drivers are typically module controlled while a few are user settable. The term "Module Control" means that the associated port pin output driver is disabled and the pin can only be controlled and accessed by the peripheral. The term "User Settable" means that the associated peripheral port pin output driver is user configurable via the associated TRISx SFR. The TRISx register must be set properly for the peripheral to function properly. For "User Settable" peripheral pins, the actual port pin state can always be read via the PORTx SFR. An Input Capture peripheral makes a good example of a User Settable peripheral. The user must write the associated TRIS register to configure the Input Capture pin as an input. Since the I/O pin circuitry is still active when the Input Capture is enabled, a 'trick' can be used to manually produce capture events using software. The Input Capture pin is configured as an output using the associated TRIS register. Then, the software can write values to the corresponding LAT register drive to internally control the Input Capture pin and force capture events. As another example an INTx pin can be configured as an output and then by writing to the associated LATx bit an INTx interrupt, if enabled, can be generated. The UART is an example of a Module Control peripheral. When the UART is enabled, the PORT and TRIS registers have no effect and cannot be used to read or write the RX and TX pins. Most communication peripheral functions available on the dsPIC are Module Control peripherals. For example, the SPI module can be configured for Master mode in which only the SDO pin is required. In this scenario the SDI pin can be configured as a general purpose output pin by clearing (setting to a logic "0") the associated TRISx bit. Table 11-1 presents a summary of the dsPIC peripherals and associated Pin Output Control and Port pin read status. © 2005 Microchip Technology Inc. DS70058D-page 11-6 Section 11. I/O Ports I/O Ports 11 11.4 Port Descriptions Refer to the device data sheet for a description of the available I/O ports and peripheral multiplexing details. Table 11-1: Port Pin Control Summary Table Peripheral Module “Enabled State” Peripheral Pins TRISx - Pin Output Control PORTx - Pin Read SPI™ (x = 1 or 2) SDOx , User Settable , Module Control Yes SDIx User Settable Yes SCKx Module Control Yes SSx , User Settable , Module Control Yes UART (x = 1 or 2) UxRX Module Control Yes UxTX , User Settable , Module Control Yes I 2C™ SCL Module Control Yes SDA Module Control Yes Input Change Notice CN0 - CN23 User Settable Yes Input Capture IC1 - IC8 User Settable Yes Output Compare OC1 - OC8 Module Control Yes Data Converter Interface COFS Module Control Yes CSCK Module Control Yes CSDI Module Control Yes CSDO Module Control Yes Motor Control PWM PWMx Module Control Yes FLTA/B User Settable Yes QEI QEA Module Control (QEI mode) User Settable (16-bit Timer mode) Yes QEB Module Control (QEI mode) User Settable (16-bit Timer mode) Yes INDX Module Control (QEIM<2:0> = 100 or 110) User Settable in all other modes Yes CAN (x = 1 or 2) CxRX Module Control Yes CxTX Module Control Yes INTx INT0 - INT5 User Settable Yes dsPIC30F Family Reference Manual DS70058D-page 11-7 © 2005 Microchip Technology Inc. 11.5 Change Notification (CN) Pins The Change Notification (CN) pins provide dsPIC30F devices the ability to generate interrupt requests to the processor in response to a change of state on selected input pins. Up to 24 input pins may be selected (enabled) for generating CN interrupts. The total number of available CN inputs is dependent on the selected dsPIC30F device. Refer to the device data sheet for further details. Figure 11-3 shows the basic function of the CN hardware. Figure 11-3: Input Change Notification Block Diagram 11.5.1 CN Control Registers There are four control registers associated with the CN module. The CNEN1 and CNEN2 registers contain the CNxIE control bits, where ‘x’ denotes the number of the CN input pin. The CNxIE bit must be set for a CN input pin to interrupt the CPU. The CNPU1 and CNPU2 registers contain the CNxPUE control bits. Each CN pin has a weak pull-up device connected to the pin, which can be enabled or disabled using the CNxPUE control bits. The weak pull-up devices act as a current source that is connected to the pin and eliminate the need for external resistors when push button or keypad devices are connected. Refer to the “Electrical Specifications” section of the device data sheet for CN pull-up device current specifications. CN D Q C D Q C CN0IE (CNEN1<0>) CN0 pin CN0PUE (CNPU1<0>) CN0 Change CN1 Change CN23 Change Interrupt CN1-CN23 Details Not Shown © 2005 Microchip Technology Inc. DS70058D-page 11-8 Section 11. I/O Ports I/O Ports 11 11.5.2 CN Configuration and Operation The CN pins are configured as follows: 1. Ensure that the CN pin is configured as a digital input by setting the associated bit in the TRISx register. 2. Enable interrupts for the selected CN pins by setting the appropriate bits in the CNEN1 and CNEN2 registers. 3. Turn on the weak pull-up devices (if desired) for the selected CN pins by setting the appropriate bits in the CNPU1 and CNPU2 registers. 4. Clear the CNIF (IFS0<15>) interrupt flag. 5. Select the desired interrupt priority for CN interrupts using the CNIP<2:0> control bits (IPC3<14:12>). 6. Enable CN interrupts using the CNIE (IEC0<15>) control bit. When a CN interrupt occurs, the user should read the PORT register associated with the CN pin(s). This will clear the mismatch condition and setup the CN logic to detect the next pin change. The current PORT value can be compared to the PORT read value obtained at the last CN interrupt to determine the pin that changed. The CN pins have a minimum input pulse width specification. Refer to the “Electrical Specifications” section of the device data sheet for further details. 11.6 CN Operation in Sleep and Idle Modes The CN module continues to operate during Sleep or Idle modes. If one of the enabled CN pins changes states, the CNIF (IFS0<15>) status bit will be set. If the CNIE bit (IEC0<15>) is set, the device will wake from Sleep or Idle mode and resume operation. If the assigned priority level of the CN interrupt is equal to or less than the current CPU priority level, device execution will continue from the instruction immediately following the SLEEP or IDLE instruction. If the assigned priority level of the CN interrupt is greater than the current CPU priority level, device execution will continue from the CN interrupt vector address. dsPIC30F Family Reference Manual DS70058D-page 11-9 © 2005 Microchip Technology Inc. Register 11-1: CNEN1: Input Change Notification Interrupt Enable Register1 Register 11-2: CNEN2: Input Change Notification Interrupt Enable Register2 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE bit 7 bit 0 bit 15-0 CNxIE: Input Change Notification Interrupt Enable bits 1 = Enable interrupt on input change 0 = Disable interrupt on input change Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7-0 CNxIE: Input Change Notification Interrupt Enable bits 1 = Enable interrupt on input change 0 = Disable interrupt on input change Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70058D-page 11-10 Section 11. I/O Ports I/O Ports 11 Register 11-3: CNPU1: Input Change Notification Pull-up Enable Register1 Register 11-4: CNPU2: Input Change Notification Pull-up Enable Register2 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE bit 7 bit 0 bit 15-0 CNxPUE: Input Change Notification Pull-up Enable bits 1 = Enable pull-up on input change 0 = Disable pull-up on input change Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7-0 CNxPUE: Input Change Notification Pull-up Enable bits 1 = Enable pull-up on input change 0 = Disable pull-up on input change Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70058D-page 11-11 © 2005 Microchip Technology Inc. 11.7 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the I/O Ports module are: Title Application Note # Implementing Wake-up on Key Stroke AN552 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70058D-page 11-12 Section 11. I/O Ports I/O Ports 11 11.8 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates additional technical content for the dsPIC30F I/O Ports module. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. Revision D Section 11.3.1.2 “Pin Control Summary” was added to this revision. © 2005 Microchip Technology Inc. DS70059D-page 12-1 Timers 12 Section 12. Timers HIGHLIGHTS This section of the manual contains the following major topics: 12.1 Introduction .................................................................................................................. 12-2 12.2 Timer Variants .............................................................................................................. 12-3 12.3 Control Registers ......................................................................................................... 12-6 12.4 Modes of Operation ..................................................................................................... 12-9 12.5 Timer Prescalers........................................................................................................ 12-14 12.6 Timer Interrupts.......................................................................................................... 12-14 12.7 Reading and Writing 16-bit Timer Module Registers ................................................. 12-15 12.8 Low Power 32 kHz Crystal Oscillator Input................................................................ 12-15 12.9 32-bit Timer Configuration.......................................................................................... 12-16 12.10 32-bit Timer Modes of Operation ............................................................................... 12-18 12.11 Reading and Writing into 32-bit Timers...................................................................... 12-21 12.12 Timer Operation in Power Saving States ................................................................... 12-21 12.13 Peripherals Using Timer Modules.............................................................................. 12-22 12.14 Design Tips ................................................................................................................ 12-24 12.15 Related Application Notes.......................................................................................... 12-25 12.16 Revision History ......................................................................................................... 12-26 © 2005 Microchip Technology Inc. DS70059D-page 12-2 Section 12. Timers Timers 12 12.1 Introduction Depending on the specific variant, the dsPIC30F device family offers several 16-bit timers. These timers are designated as Timer1, Timer2, Timer3, ..., etc. Each timer module is a 16-bit timer/counter consisting of the following readable/writable registers: • TMRx: 16-bit timer count register • PRx: 16-bit period register associated with the timer • TxCON: 16-bit control register associated with the timer Each timer module also has the associated bits for interrupt control: • Interrupt Enable Control bit (TxIE) • Interrupt Flag Status bit (TxIF) • Interrupt Priority Control bits (TxIP<2:0>) With certain exceptions, all of the 16-bit timers have the same functional circuitry. The 16-bit timers are classified into three types to account for their functional differences: • Type A time base • Type B time base • Type C time base Some 16-bit timers can be combined to form a 32-bit timer. This section does not describe the dedicated timers that are associated with peripheral devices. For example, this includes the time bases associated with the Motor Control PWM module and the Quadrature Encoder Interface (QEI) module. dsPIC30F Family Reference Manual DS70059D-page 12-3 © 2005 Microchip Technology Inc. 12.2 Timer Variants All 16-bit timers available on the dsPIC30F devices are functionally identical with certain exceptions. The 16-bit timers are classified into three functional types; Type A timers, Type B timers and Type C timers. 12.2.1 Type A Timer At least one Type A timer is available on most dsPIC30F devices. For most dsPIC30F devices, Timer1 is a Type A timer. A Type A timer has the following unique features over other types: • can be operated from the device Low Power 32 kHz Oscillator • can be operated in an Asynchronous mode from an external clock source In particular, the unique features of a Type A timer allow it to be used for Real-Time Clock (RTC) applications. A block diagram of the Type A timer is shown in Figure 12-1. Figure 12-1: Type A Timer Block Diagram Note: Please refer to the device data sheet for the available timers and the type of each. TON Sync SOSCI SOSCO PRx TxIF Equal Comparator x 16 TMRx Reset Note 1: Refer to Section 7. “Oscillator” for information on enabling the LP Oscillator. LPOSCEN Event Flag (Note 1) 1 0 TSYNC Q Q D CK TGATE TCKPS<1:0> Prescaler 1, 8, 64, 256 2 TGATE TCY 1 0 TCS 1 X 0 1 TGATE 0 0 Gate Sync © 2005 Microchip Technology Inc. DS70059D-page 12-4 Section 12. Timers Timers 12 12.2.2 Type B Timer Timer2 and Timer4, if present, are Type B timers on most dsPIC30F devices. A Type B timer has the following unique features over other types of timers: • A Type B timer can be concatenated with a Type C timer to form a 32-bit timer. The TxCON register for a Type B timer has the T32 control bits to enable the 32-bit timer function. • The clock synchronization for a Type B timer is performed after the prescale logic. A block diagram of the Type B timer is shown in Figure 12-2. Figure 12-2: Type B Timer Block Diagram TON Sync PRx TxIF Equal Comparator x 16 TMRx Reset Event Flag Q Q D CK TGATE TCKPS<1:0> Prescaler 1, 8, 64, 256 2 TGATE TCY 1 0 TCS 1 X 0 1 TGATE 0 0 Gate TxCKI Sync dsPIC30F Family Reference Manual DS70059D-page 12-5 © 2005 Microchip Technology Inc. 12.2.3 Type C Timer Timer3 and Timer5 are Type C timers on most dsPIC30F devices. A Type C timer has the following unique features over other types of timers: • A Type C timer can be concatenated with a Type B timer to form a 32-bit timer. • On a given device, at least one Type C timer has the ability to trigger an A/D conversion. A block diagram of the Type C timer is shown in Figure 12-3. Figure 12-3: Type C Timer Block Diagram TON PRx TxIF Equal Comparator x 16 TMRx Reset Event Flag Q Q D CK TGATE TCKPS<1:0> Prescaler 1, 8, 64, 256 2 TGATE TCY 1 0 TCS 1 X 0 1 TGATE 0 0 TxCK ADC Event Note: In certain variants of the dsPIC30F family, the TxCK pin may not be available. Refer to the device data sheet for the I/O pin details. In such cases, the timer must use the system clock (FOSC/4) as its input clock, unless it is configured for 32-bit operation. Sync Trigger © 2005 Microchip Technology Inc. DS70059D-page 12-6 Section 12. Timers Timers 12 12.3 Control Registers Register 12-1: TxCON: Type A Time Base Register Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 Lower Byte: U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 — TGATE TCKPS<1:0> — TSYNC TCS — bit 7 bit 0 bit 15 TON: Timer On Control bit 1 = Starts the timer 0 = Stops the timer bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue timer operation when device enters Idle mode 0 = Continue timer operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer Gated Time Accumulation Enable bit 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled (TCS must be set to ‘0’ when TGATE = 1. Reads as ‘0’ if TCS = 1) bit 5-4 TCKPS<1:0>: Timer Input Clock Prescale Select bits 11 = 1:256 prescale value 10 = 1:64 prescale value 01 = 1:8 prescale value 00 = 1:1 prescale value bit 3 Unimplemented: Read as ‘0’ bit 2 TSYNC: Timer External Clock Input Synchronization Select bit When TCS = 1: 1 = Synchronize external clock input 0 = Do not synchronize external clock input When TCS = 0: This bit is ignored. Read as ‘0’. Timer1 uses the internal clock when TCS = 0. bit 1 TCS: Timer Clock Source Select bit 1 = External clock from pin TxCK 0 = Internal clock (FOSC/4) bit 0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70059D-page 12-7 © 2005 Microchip Technology Inc. Register 12-2: TxCON: Type B Time Base Register Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 Lower Byte: U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0 — TGATE TCKPS<1:0> T32 — TCS — bit 7 bit 0 bit 15 TON: Timer On bit When T32 = 1 (in 32-bit Timer mode): 1 = Starts 32-bit TMRx:TMRy timer pair 0 = Stops 32-bit TMRx:TMRy timer pair When T32 = 0 (in 16-bit Timer mode): 1 = Starts 16-bit timer 0 = Stops 16-bit timer bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue timer operation when device enters Idle mode 0 = Continue timer operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer Gated Time Accumulation Enable bit 1 = Timer gated time accumulation enabled 0 = Timer gated time accumulation disabled (TCS must be set to logic ‘0’ when TGATE = 1) bit 5-4 TCKPS<1:0>: Timer Input Clock Prescale Select bits 11 = 1:256 prescale value 10 = 1:64 prescale value 01 = 1:8 prescale value 00 = 1:1 prescale value bit 3 T32: 32-bit Timer Mode Select bits 1 = TMRx and TMRy form a 32-bit timer 0 = TMRx and TMRy form separate 16-bit timer bit 2 Unimplemented: Read as ‘0’ bit 1 TCS: Timer Clock Source Select bit 1 = External clock from pin TxCK 0 = Internal clock (FOSC/4) bit 0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70059D-page 12-8 Section 12. Timers Timers 12 Register 12-3: TxCON: Type C Time Base Register Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON — TSIDL — — — — — bit 15 bit 8 Lower Byte: U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 — TGATE TCKPS<1:0> — — TCS — bit 7 bit 0 bit 15 TON: Timer On bit 1 = Starts 16-bit TMRx 0 = Stops 16-bit TMRx bit 14 Unimplemented: Read as ‘0’ bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 TGATE: Timer Gated Time Accumulation Enable bit 1 = Timer gated time accumulation enabled 0 = Timer gated time accumulation disabled (Read as ‘0’ if TCS = 1) (TCS must be set to logic ‘0’ when TGATE = 1) bit 5-4 TCKPS<1:0>: Timer Input Clock Prescale Select bits 11 = 1:256 prescale value 10 = 1:64 prescale value 01 = 1:8 prescale value 00 = 1:1 prescale value bit 3-2 Unimplemented: Read as ‘0’ bit 1 TCS: Timer Clock Source Select bit 1 = External clock from pin TxCK 0 = Internal clock (FOSC/4) bit 0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70059D-page 12-9 © 2005 Microchip Technology Inc. 12.4 Modes of Operation Each timer module can operate in one of the following modes: • As a synchronous timer • As a synchronous counter • As a gated timer • As an asynchronous counter (Type A time base only) The Timer modes are determined by the following bits: • TCS (TxCON<1>): Timer Clock Source Control bit • TSYNC (T1CON<2>): Timer Synchronization Control bit (Type A time base only) • TGATE (TxCON<6>): Timer Gate Control bit Each timer module is enabled or disabled using the TON Control bit (TxCON <15>). 12.4.1 Timer Mode All types of timers have the ability to operate in Timer mode. In Timer mode, the input clock to the timer is provided from the internal system clock (FOSC/4). When enabled, the timer increments once per instruction cycle for a 1:1 prescaler setting. The Timer mode is selected by clearing the TCS control bit (TxCON<1>). The Synchronous mode control bit, TSYNC (T1CON<2>), has no effect, since the system clock source is used to generate the timer clock. Example 12-1: Initialization Code for 16-bit Timer Using System Clock Note: Only Type A time bases support the External Asynchronous Clock mode. ; The following code example will enable Timer1 interrupts, ; load the Timer1 Period register and start Timer1. ; When a Timer1 period match interrupt occurs, the interrupt ; service routine must clear the Timer1 interrupt status flag ; in software. CLR T1CON ; Stops the Timer1 and reset control reg. CLR TMR1 ; Clear contents of the timer register MOV #0xFFFF, w0 ; Load the Period register MOV w0, PR1 ; with the value 0xFFFF BSET IPC0, #T1IP0 ; Setup Timer1 interrupt for BCLR IPC0, #T1IP1 ; desired priority level BCLR IPC0, #T1IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T1IF ; Clear the Timer1 interrupt status flag BSET IEC0, #T1IE ; Enable Timer1 interrupts BSET T1CON, #TON ; Start Timer1 with prescaler settings ; at 1:1 and clock source set to ; the internal instruction cycle ; Example code for Timer1 ISR __T1Interrupt: BCLR IFS0, #T1IF ; Reset Timer1 interrupt flag ; User code goes here. RETFIE ; Return from ISR © 2005 Microchip Technology Inc. DS70059D-page 12-10 Section 12. Timers Timers 12 12.4.2 Synchronous Counter Mode Using External Clock Input When the TCS control bit (TxCON<1>) is set, the clock source for the timer is provided externally and the selected timer increments on every rising edge of clock input on the TxCK pin. External clock synchronization must be enabled for a Type A time base. This is accomplished by setting the TSYNC control bit (TxCON<2>). For Type B and Type C time bases, the external clock input is always synchronized to the system instruction cycle clock, TCY. When the timer is operated in the Synchronized Counter mode, there are minimum requirements for the external clock high time and low time. The synchronization of the external clock source with the device instruction clock is accomplished by sampling the external clock signal at two different times within an instruction cycle. A timer operating from a synchronized external clock source will not operate in Sleep mode, since the synchronization circuit is shut-off during Sleep mode. Example 12-2: Initialization Code for 16-bit Synchronous Counter Mode Using an External Clock Input Note: The external input clock must meet certain minimum high time and low time requirements when Timerx is used in the Synchronous Counter mode. Refer to the device data sheet “Electrical Specifications” section for further details. ; The following code example will enable Timer1 interrupts, load the ; Timer1 Period register and start Timer1 using an external clock ; and a 1:8 prescaler setting. ; When a Timer1 period match interrupt occurs, the interrupt service ; routine must clear the Timer1 interrupt status flag in software. CLR T1CON ; Stops the Timer1 and reset control reg. CLR TMR1 ; Clear contents of the timer register MOV #0x8CFF, w0 ; Load the Period register MOV w0, PR1 ; with the value 0x8CFF BSET IPC0, #T1IP0 ; Setup Timer1 interrupt for BCLR IPC0, #T1IP1 ; desired priority level BCLR IPC0, #T1IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T1IF ; Clear the Timer1 interrupt status flag BSET IEC0, #T1IE ; Enable Timer1 interrupts MOV #0x8016, W0 ; Start Timer1 with prescaler settings at ; 1:8 and clock source set to the external MOV w0, T1CON ; clock in the synchronous mode ; Example code for Timer1 ISR __T1Interrupt: BCLR IFS0, #T1IF ; Reset Timer1 interrupt flag ; User code goes here. RETFIE ; Return from ISR dsPIC30F Family Reference Manual DS70059D-page 12-11 © 2005 Microchip Technology Inc. 12.4.3 Type A Timer Asynchronous Counter Mode Using External Clock Input A Type A time base has the ability to operate in an Asynchronous Counting mode, using an external clock source connected to the TxCK pin. When the TSYNC control bit (TxCON<2>) is cleared, the external clock input is not synchronized with the device system clock source. The time base continues to increment asynchronously to the internal device clock. The asynchronous operation time base is beneficial for the following applications: • The time base can operate during Sleep mode and can generate an interrupt on period register match that will wake-up the processor. • The time base can be clocked from the low power 32 kHz oscillator for real-time clock applications Please see Section 12.12.1 “Timer Operation in Sleep Mode” for more details.. Example 12-3: Initialization Code for 16-bit Asynchronous Counter Mode Using an External Clock Input Note 1: Only Type A time bases support the Asynchronous Counter mode. 2: The external input clock must meet certain minimum high time and low time requirements when Timerx is used in the Asynchronous Counter mode. Refer to the device data sheet “Electrical Specifications” section for further details. 3: Unexpected results may occur when reading Timer1, in asynchronous mode. ; The following code example will enable Timer1 interrupts, load the ; Timer1 Period register and start Timer1 using an asynchronous ; external clock and a 1:8 prescaler setting. ; When a Timer1 period match interrupt occurs, the interrupt service ; routine must clear the Timer1 interrupt status flag in software. CLR T1CON ; Stops the Timer1 and reset control reg. CLR TMR1 ; Clear contents of the timer register MOV #0x7FFF, w0 ; Load the Period register MOV w0, PR1 ; with the value 0x7FFF BSET IPC0, #T1IP0 ; Setup Timer1 interrupt for BCLR IPC0, #T1IP1 ; desired priority level BCLR IPC0, #T1IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T1IF ; Clear the Timer1 interrupt status flag BSET IEC0, #T1IE ; Enable Timer1 interrupts MOV #0x8012, w0 ; Start Timer1 with prescaler settings at ; 1:8 and clock source set to the external MOV w0, T1CON ; clock in the asynchronous mode ; Example code for Timer1 ISR __T1Interrupt: BCLR IFS0, #T1IF ; Reset Timer1 interrupt flag ; User code goes here. RETFIE ; Return from ISR © 2005 Microchip Technology Inc. DS70059D-page 12-12 Section 12. Timers Timers 12 12.4.4 Timer Operation with Fast External Clock Source In some applications, it may be desirable to use one of the timers to count clock edges from a relatively high frequency external clock source. In these situations, Type A and Type B time bases are the most suitable choices for counting the external clock source, because the clock synchronization logic for these timers is located after the timer prescaler (see Figure 12-1 and Figure 12-2). This allows a higher external clock frequency to be used that will not violate the minimum high and low times required by the prescaler. When a timer prescaler ratio other than 1:1 is selected for a Type A or Type B time base, the minimum high and low times for the external clock input are reduced by the chosen prescaler ratio. A Type A time base is unique because it can be operated in an Asynchronous Clock mode, eliminating any prescaler timing requirements. Note that in all cases, there are minimum high and low times for the external clock signal that cannot be exceeded. These minimum times are required to satisfy the I/O pin timing requirements. Please refer to the device data sheet for the external clock timing specifications associated with the time bases. 12.4.5 Gated Time Accumulation Mode The Gated Time Accumulation mode allows the internal timer register to increment based upon the duration of the high time applied to the TxCK pin. In the Gated Time Accumulation mode, the timer clock source is derived from the internal system clock. When the TxCK pin state is high, the timer register will count up until a period match has occurred, or the TxCK pin state is changed to a low state. A pin state transition from high to low will set the TxIF interrupt flag. Depending on when the edge occurs, the interrupt flag is asserted 1 or 2 instruction cycles after the falling edge of the signal on the TxCK pin. The TGATE control bit (TxCON<6>) must be set to enable the Gated Time Accumulation mode. The timer must be enabled, TON (TxCON<15>) = 1, and the timer clock source set to the internal clock, TCS (TxCON<1>) = 0. The gate operation starts on a rising edge of the signal applied to the TxCK pin and terminates on the falling edge of the signal applied to the TxCK pin. The respective timer will increment while the external gate signal is high. The falling edge of the gate signal terminates the count operation, but does not reset the timer. The user must reset the timer if it is desired to start from zero on the next rising edge gate input. The falling edge of the gate signal generates an interrupt. The resolution of the timer count is directly related to the timer clock period. For a timer prescaler of 1:1, the timer clock period is one instruction cycle. For a timer prescaler of 1:256, the timer clock period is 256 times the instruction cycle. The timer clock resolution can be associated to the pulse width of the gate signal. Refer to the “Electrical Specifications” section in the device data sheet for further details on the gate width pulse requirements. Note: The timer will not interrupt the CPU when a timer period match occurs in Gate Time Accumulation mode. dsPIC30F Family Reference Manual DS70059D-page 12-13 © 2005 Microchip Technology Inc. Figure 12-4: Gated Timer Mode Operation Example 12-4: Initialization Code for 16-bit Gated Time Accumulation Mode TxIF TMRx 0001 0002 1 Instruction Cycle (TCY) 0003 0004 TxCK pin 0000 0005 TxIF bit cleared by user in software. ; The following code example will enable Timer2 interrupts, load the ; Timer2 Period register and start Timer2 using an internal clock ; and an external gate signal. On the falling edge of the gate ; signal a Timer2 interrupt occurs. The interrupt service ; routine must clear the Timer2 interrupt status flag in software . CLR T2CON ; Stops the Timer2 and reset control reg. CLR TMR2 ; Clear contents of the timer register MOV #0xFFFF, w0 ; Load the Period register with MOV w0, PR2 ; the value 0xFFFF BSET IPC1, #T2IP0 ; Setup Timer2 interrupt for BCLR IPC1, #T2IP1 ; desired priority level BCLR IPC1, #T2IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T2IF ; Clear the Timer2 interrupt status flag BSET IEC0, #T2IE ; Enable Timer2 interrupts BSET T2CON, #TGATE ; Set up Timer2 for operation in Gated ; Time Accumulation mode BSET T2CON, #TON ; Start Timer2 ; Example code for Timer2 ISR __T2Interrupt: BCLR IFS0, #T2IF ; Reset Timer2 interrupt flag ; User code goes here. RETFIE ; Return from ISR © 2005 Microchip Technology Inc. DS70059D-page 12-14 Section 12. Timers Timers 12 12.5 Timer Prescalers The input clock (FOSC/4 or external clock) to all 16-bit timers has prescale options of 1:1, 1:8, 1:64 and 1:256. The clock prescaler is selected using the TCKPS<1:0> control bits (TxCON<5:4>). The prescaler counter is cleared when any of the following occurs: • A write to the TMRx register • Clearing TON (TxCON<15>) to ‘0’ • Any device Reset 12.6 Timer Interrupts A 16-bit timer has the ability to generate an interrupt on a period match or falling edge of the external gate signal, depending on the Operating mode. The TxIF bit is set when one of the following conditions is true: • The timer count matches the respective period register and the timer module is not operating in Gated Time Accumulation mode. • The falling edge of the “gate” signal is detected when the timer is operating in Gated Time Accumulation mode. The TxIF bit must be cleared in software. A timer is enabled as a source of interrupt via the respective timer interrupt enable bit, TxIE. Furthermore, the interrupt priority level bits (TxIP<2:0>) must be written with a non-zero value in order for the timer to be a source of interrupt. Refer to Section 6. “Reset Interrupts” for further details. Figure 12-5: Interrupt Timing for Timer Period Match Note: The TMRx register is not cleared when TxCON is written. Note: A special case occurs when the period register is loaded with 0x0000 and the timer is enabled. No timer interrupts will be generated for this configuration. TxIF TMR2 47FD 47FE 47FF 4800 0000 0003 0005 0004 1 Instruction Cycle (TCY) PR2 4800 0002 TMR2 Resets Here 0001 Cleared by User dsPIC30F Family Reference Manual DS70059D-page 12-15 © 2005 Microchip Technology Inc. 12.7 Reading and Writing 16-bit Timer Module Registers • All timer module SFRs can be written to as a byte (8-bits) or as a word (16-bits). • All timer module SFRs can only be read as a word (16-bits). 12.7.1 Writing to the 16-bit Timers The timer and its respective period register can be written to while the module is operating. The user should be aware of the following when byte writes are performed: • If the timer is incrementing and the low byte of the timer is written to, the upper byte of the timer is not affected. If 0xFF is written into the low byte of the timer, the next timer count clock after this write will cause the low byte to rollover to 0x00 and generate a carry into the high byte of the timer. • If the timer is incrementing and the high byte of the timer is written to, the low byte of the timer is not affected. If the low byte of the timer contains 0xFF when the write occurs, the next timer count clock will generate a carry from the timer low byte and this carry will cause the upper byte of the timer to increment. When the TMRx register is written to (word or byte) via an instruction, the TMRx register increment is masked and does not occur during that instruction cycle. Writes to a timer with an asynchronous clock source should be avoided in a real-timekeeping application. See Section 12.4.1 “Timer Mode” for more details. 12.7.2 Reading from the 16-bit Timers All reads of the timers and their associated SFRs must be word reads (16-bits). A byte read will have no effect (‘0’ will be returned). The timer and respective period register can be read while the module is operating. A read of the TMRx register does not prevent the timer from incrementing during the same instruction cycle. 12.8 Low Power 32 kHz Crystal Oscillator Input In each device variant, the Low Power 32 kHz Crystal Oscillator is available to a Type A timer module for Real-Time Clock (RTC) applications. • The LP Oscillator becomes the clock source for the timer when the LP Oscillator is enabled and the timer is configured to use the external clock source. • The LP Oscillator is enabled by setting the LPOSCEN control bit in the OSCCON register. • The 32 kHz crystal is connected to the SOSCO/SOSCI device pins. Refer to Section 7. “Oscillator” for further details. © 2005 Microchip Technology Inc. DS70059D-page 12-16 Section 12. Timers Timers 12 12.9 32-bit Timer Configuration A 32-bit timer module can be formed by combining a Type B and a Type C 16-bit timer module. The Type C time base becomes the MSWord of the combined timer and the Type B time base is the LSWord. When configured for 32-bit operation, the control bits for the Type B time base control the operation of the 32-bit timer. The control bits in the TxCON register for the Type C time base have no effect. For interrupt control, the combined 32-bit timer uses the interrupt enable, interrupt flag and interrupt priority control bits of the Type C time base. The interrupt control and status bits for the Type B time base are not used during 32-bit timer operation. The following configuration settings assume Timer3 is a Type C time base and Timer2 is a Type B time base: • TON (T2CON<15>) = 1. • T32 (T2CON<3>) = 1. • TCKPS<1:0> (T2CON<5:4>) are used to set the Prescaler mode for Timer2 (Type B time base). • The TMR3:TMR2 register pair contains the 32-bit value of the timer module; the TMR3 (Type C time base) register is the Most Significant Word, while the TMR2 (Type B time base) register is the Least Significant Word of the 32-bit timer value. • The PR3:PR2 register pair contains the 32-bit period value that is used for comparison with the TMR3:TMR2 timer value. • T3IE (IEC0<7>) is used to enable the 32-bit timer interrupt for this configuration. • T3IF (IFS0<7>) is used as a status flag for the timer interrupt. • T3IP<2:0> (IPC1<14:12>) sets the interrupt priority level for the 32-bit timer. • T3CON<15:0> are “don’t care” bits. A block diagram representation of the 32-bit timer module using Timer2 and Timer3 as an example is shown in Figure 12-6. Note: Refer to the device data sheet for information on the specific Type B and Type C time bases that can be combined. dsPIC30F Family Reference Manual DS70059D-page 12-17 © 2005 Microchip Technology Inc. Figure 12-6: Type B-Type C Timer Pair Block Diagram (32-bit Timer) TMR3 TMR2 T3IF Equal Comparator x 32 PR3 PR2 Reset MSWord LSWord Event Flag Note 1: This block diagram assumes Timer3 is a Type C time base, Timer2 is a Type B time base. 2: Timer configuration bit, T32 (T2CON<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All control bits are respective to the T2CON register. Data Bus<15:0> TMR3HLD Read TMR2 Write TMR2 16 16 16 Q Q D CK TGATE (T2CON<6>) (T2CON<6>) TGATE 0 1 TON TCKPS<1:0> Prescaler 1, 8, 64, 256 2 TCY TCS 1 X 0 1 TGATE 0 0 Gate T2CKI Sync ADC Event Trigger Sync © 2005 Microchip Technology Inc. DS70059D-page 12-18 Section 12. Timers Timers 12 12.10 32-bit Timer Modes of Operation 12.10.1 Timer Mode Example 12-5 shows how to configure a 32-bit timer in Timer mode. This example assumes Timer2 is a Type B time base and Timer3 is a Type C time base. For 32-bit timer operation, the T32 control bit must be set in the T2CON register (Type B time base). When Timer2 and Timer3 are configured for a 32-bit timer, the T3CON control bits are ignored. Only the T2CON control bits are required for setup and control. The Timer2 clock and gate input is utilized for the 32-bit timer module, but an interrupt is generated with the T3IF flag. Timer2 is the LSWord and Timer3 is the MSWord of the 32-bit timer. TMR3 is incremented by an overflow (carry-out) from TMR2. The 32-bit timer increments up to a match value preloaded into the combined 32-bit period register formed by PR2 and PR3, then rolls over and continues. For a maximum 32-bit timer count, load PR3:PR2 with a value of 0xFFFFFFFF. An interrupt is generated on a period match, if enabled. Example 12-5: Initialization Code for 32-bit Timer Using Instruction Cycle as Input Clock ; The following code example will enable Timer3 interrupts, load the ; Timer3:Timer2 Period Register and start the 32-bit timer module ; consisting of Timer3 and Timer2. ; When a 32-bit period match interrupt occurs, the user must clear ; the Timer3 interrupt status flag in software. CLR T2CON ; Stops any 16/32-bit Timer2 operation CLR T3CON ; Stops any 16-bit Timer3 operation CLR TMR3 ; Clear contents of the Timer3 timer register CLR TMR2 ; Clear contents of the Timer2 timer register MOV #0xFFFF, w0 ; Load the Period Register 3 MOV w0, PR3 ; with the value 0xFFFF MOV w0, PR2 ; Load the Period Register2 with value 0xFFFF BSET IPC1, #T3IP0 ; Setup Timer3 interrupt for BCLR IPC1, #T3IP1 ; desired priority level BCLR IPC1, #T3IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T3IF ; Clear the Timer3 interrupt status flag BSET IEC0, #T3IE ; Enable Timer3 interrupts BSET T2CON, #T32 ; Enable 32-bit Timer operation BSET T2CON, #TON ; Start 32-bit timer with prescaler ; settings at 1:1 and clock source set to ; the internal instruction cycle ; Example code for Timer3 ISR __T3Interrupt: BCLR IFS0, #T3IF ; Reset Timer3 interrupt flag ; User code goes here. RETFIE ; Return from ISR dsPIC30F Family Reference Manual DS70059D-page 12-19 © 2005 Microchip Technology Inc. 12.10.2 Synchronous Counter Mode The 32-bit timer operates similarly to a 16-bit timer in Synchronous Counter mode. Example 12-6 shows how to configure a 32-bit timer in Synchronous Counter mode. This example assumes Timer2 is a Type B time base and Timer3 is a Type C time base. Example 12-6: Initialization Code for 32-bit Synchronous Counter Mode Using an External Clock Input ; The following code example will enable Timer2 interrupts, load ; the Timer3:Timer2 Period register and start the 32-bit timer ; module consisting of Timer3 and Timer2. ; When a 32-bit period match interrupt occurs, the user must clear ; the Timer3 interrupt status flag in the software. CLR T2CON ; Stops any 16/32-bit Timer2 operation CLR T3CON ; Stops any 16-bit Timer3 operation CLR TMR3 ; Clear contents of the Timer3 timer register CLR TMR2 ; Clear contents of the Timer2 timer register MOV #0xFFFF, w0 ; Load the Period Register3 MOV w0, PR3 ; with the value 0xFFFF MOV w0, PR2 ; Load the Period Register2 with value 0xFFFF BSET IPC1, #T3IP0 ; Setup Timer3 interrupt for BCLR IPC1, #T3IP1 ; desired priority level BCLR IPC1, #T3IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T3IF ; Clear the Timer3 interrupt status flag BSET IEC0, #T3IE ; Enable Timer3 interrupts MOV #0x801A, w0 ; Enable 32-bit Timer operation and start MOV w0, T2CON ; 32-bit timer with prescaler settings at ; 1:8 and clock source set to external clock ; Example code for Timer3 ISR __T3Interrupt: BCLR IFS0, #T3IF ; Reset Timer3 interrupt flag ; User code goes here. RETFIE ; Return from ISR © 2005 Microchip Technology Inc. DS70059D-page 12-20 Section 12. Timers Timers 12 12.10.3 Asynchronous Counter Mode Type B and Type C time bases do not support the Asynchronous External Clock mode. Therefore, no 32-bit Asynchronous Counter mode is supported. 12.10.4 Gated Time Accumulation Mode The 32-bit timer operates similarly to a 16-bit timer in Gated Time Accumulation mode. Example 12-7 shows how to configure a 32-bit timer in Gated Time Accumulation mode. This example assumes Timer2 is a Type B time base and Timer3 is a Type C time base. Example 12-7: Initialization Code for 32-bit Gated Time Accumulation Mode ; The following code example will enable Timer2 interrupts, load the ; Timer3:Timer2 Period register and start the 32-bit timer module ; consisting of Timer3 and Timer2. When a 32-bit period match occurs ; the timer will simply roll over and continue counting. ; However, when at the falling edge of the Gate signal on T2CK ; an interrupt is generated, if enabled. The user must clear the ; Timer3 interrupt status flag in the software. CLR T2CON ; Stops any 16/32-bit Timer2 operation CLR T3CON ; Stops any 16-bit Timer3 operation CLR TMR3 ; Clear contents of the Timer3 register CLR TMR2 ; Clear contents of the Timer2 register MOV #0xFFFF, w0 ; Load the Period Register3 MOV w0, PR3 ; with the value 0xFFFF MOV w0, PR2 ; Load the Period Register2 with value 0xFFFF BSET IPC1, #T3IP0 ; Setup Timer3 interrupt for BCLR IPC1, #T3IP1 ; desired priority level BCLR IPC1, #T3IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T3IF ; Clear the Timer3 interrupt status flag BSET IEC0, #T3IE ; Enable Timer3 interrupts MOV #0x804C, w0 ; Enable 32-bit Timer operation and MOV w0, T2CON ; Start 32-bit timer in gated time ; accumulation mode. ; Example code for Timer3 ISR __T3Interrupt: BCLR IFS0, #T3IF ; Reset Timer3 interrupt flag ; User code goes here. RETFIE ; Return from ISR dsPIC30F Family Reference Manual DS70059D-page 12-21 © 2005 Microchip Technology Inc. 12.11 Reading and Writing into 32-bit Timers In order for 32-bit read/write operations to be synchronized between the LSWord and MSWord of the 32-bit timer, additional control logic and holding registers are utilized (see Figure 12-6). Each Type C time base has a register called TMRxHLD, that is used when reading or writing the timer register pair. The TMRxHLD registers are only used when their respective timers are configured for 32-bit operation. Assuming TMR3:TMR2 form a 32-bit timer pair; the user should first read the LSWord of the timer value from the TMR2 register. The read of the LSWord will automatically transfer the contents of TMR3 into the TMR3HLD register. The user can then read TMR3HLD to get the MSWord of the timer value. This is shown in the example below: Example 12-8: Reading from a 32-bit Timer To write a value to the TMR3:TMR2 register pair, the user should first write the MSWord to the TMR3HLD register. When the LSWord of the timer value is written to TMR2, the contents of TMR3HLD will automatically be transferred to the TMR3 register. 12.12 Timer Operation in Power Saving States 12.12.1 Timer Operation in Sleep Mode When the device enters Sleep mode, the system clock is disabled. If the timer module is running from the internal clock source (FOSC/4), it will also be disabled. A Type A timer is different from the other timer modules because it can operate asynchronously from an external clock source. Because of this distinction, the Type A time base module can continue to operate during Sleep mode. To operate in Sleep mode, Type A time base must be configured as follows: • The Timer1 module is enabled, TON = 1 (T1CON<15>) and • The Timer1 clock source is selected as external, TCS = 1 (T1CON<1> = 1) and • The TSYNC bit (T1CON<2>) is set to logic ‘0’ (Asynchronous Counter mode enabled). When all of the above conditions are met, Timer1 will continue to count and detect period matches when the device is in Sleep mode. When a match between the timer and the period register occurs, the TxIF bit will be set and an interrupt can be generated to optionally wake the device from Sleep. Refer to Section 10. “Watchdog Timer and Power Saving Modes” for further details. When executing the SLEEP instruction in asynchronous mode using a 32.768 kHz real time oscillator to keep track of real time in seconds, it is important to insure the crystal connected to the inputs is operating. This can be done by checking for a non-zero value in TMR1 and then executing the SLEEP instruction. Failure to do so may result in a normal sleep execution with no wake-up from sleep due to timer time out. Example Code: mov.b #0x46,w1 ; follow write sequence … mov.b #0x57,w2 ; for OSCCONL writes. mov #OSCCONL,w3 mov.b w1,[w3] mov.b w2,[w3] bset OSCCONL,#LPOSCEN ;enable 32Khz external xtal clr TMR1 ; set up TMR1 for … mov #0x7FFF,W0 ;interrupts every 1.0 Sec mov W0,PR1 ; The following code segment reads the 32-bit timer formed by the ; Timer3-Timer2 pair into the registers W1(MS Word) and W0(LS Word). MOV TMR2, W0 ;Transfer the LSW into W1 MOV TMR3HLD, W1 ;Transfer the MSW from the holding register to W0 Note: Asynchronous counter operation is only supported for the Timer1 module. © 2005 Microchip Technology Inc. DS70059D-page 12-22 Section 12. Timers Timers 12 bclr IFS0,#T1IF ; clr interrupt flag mov #0x8002,W0 ; External clock, 1:1; start TMR1 mov W0,T1CON bset IEC0,#T1IE ; enable interrupt TestLPOperation: mov TMR1,W0 ; check for non-zero value in TMR1 cp W0,#0 bra Z,TestLPOperation ; if zero then recheck pwrsav #0 ; non-zero then execute sleep 12.12.2 Timer Operation in Idle Mode When the device enters Idle mode, the system clock sources remain functional and the CPU stops executing code. The timer modules can optionally continue to operate in Idle mode. The TSIDL bit (TxCON<13>) selects if the timer module will stop in Idle mode, or continue to operate normally. If TSIDL = 0, the module will continue operation in Idle mode. If TSIDL = 1, the module will stop in Idle mode. 12.13 Peripherals Using Timer Modules 12.13.1 Time Base for Input Capture/Output Compare The Input Capture and Output Compare peripherals can select one of two timer modules as their time base. Refer to Section 13. “Input Capture”, Section 14. “Output Compare”, and the device data sheet for further details. 12.13.2 A/D Special Event Trigger On each device variant, one Type C time base has the capability to generate a special A/D conversion trigger signal on a period match, in both 16 and 32-bit modes. The timer module provides a conversion start signal to the A/D sampling logic. • If T32 = 0, when a match occurs between the 16-bit timer register (TMRx) and the respective 16-bit period register (PRx), the A/D special event trigger signal is generated. • If T32 = 1, when a match occurs between the 32-bit timer (TMRx:TMRy) and the 32-bit respective combined period register (PRx:PRy), the A/D special event trigger signal is generated. The special event trigger signal is always generated by the timer. The trigger source must be selected in the A/D converter control registers. Refer to Section 17. “10-bit A/D Converter”, Section 18. “12-bit A/D Converter”, and the device data sheet for additional information. 12.13.3 Timer as an External Interrupt Pin The external clock input pin for each timer can be used as an additional interrupt pin. To provide the interrupt, the timer period register, PRx, is written with a non-zero value and the TMRx register is initialized to a value of 1 less than the value written to the period register. The timer must be configured for a 1:1 clock prescaler. An interrupt will be generated when the next rising edge of the external clock signal is detected. 12.13.4 I/O Pin Control When a timer module is enabled and configured for external clock or gate operation, the user must ensure the I/O pin direction is configured for an input. Enabling the timer module does not configure the pin direction. dsPIC30F Family Reference Manual DS70059D-page 12-23 © 2005 Microchip Technology Inc. Table 12-1: Special Function Registers Associated with Timer Modules Name SFR Address Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on All Resets TMR1 0100 Timer1 Register 0000 0000 0000 0000 PR1 0102 Timer1 Period Register 1111 1111 1111 1111 T1CON 0104 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — TSYNC TCS — 0000 0000 0000 0000 TMR2 0106 Timer2 Register 0000 0000 0000 0000 TMR3HLD 0108 Timer3 Holding Register (used in 32-bit mode only) 0000 0000 0000 0000 TMR3 010A Timer3 Register 0000 0000 0000 0000 PR2 010C Timer2 Period Register 1111 1111 1111 1111 PR3 010E Timer3 Period Register 1111 1111 1111 1111 T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 0000 0000 0000 T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000 TMR4 0114 Timer4 Register 0000 0000 0000 0000 TMR5HLD 0116 Timer5 Holding Register (used in 32-bit mode only) 0000 0000 0000 0000 TMR5 0118 Timer5 Register 0000 0000 0000 0000 PR4 011A Timer4 Period Register 1111 1111 1111 1111 PR5 011C Timer5 Period Register 1111 1111 1111 1111 T4CON 011E TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 0000 0000 0000 T5CON 0120 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000 IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT01F 0000 0000 0000 0000 IFS1 0086 IC61F IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE IC2IE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000 IPC0 0094 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> INT0IP<2:0> 0100 0100 0100 0100 IPC1 0096 — T3IP<2:0> — T2IP<2:0> — OC2IP<2:0> IC2IP<2:0> 0100 0100 0100 0100 IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> OC4IP<2:0> 0100 0100 0100 0100 Note: Please refer to the device data sheet for specific memory map details. © 2005 Microchip Technology Inc. DS70059D-page 12-24 Section 12. Timers Timers 12 12.14 Design Tips Question 1: Can a timer module be used to wake the device from Sleep mode? Answer: Yes, but only Timer1 has the ability to wake the device from Sleep mode. This is because Timer1 allows the TMR1 register to increment from an external, unsynchronized clock source. When the TMR1 register is equal to the PR1 register, the device will wake from Sleep mode, if Timer1 interrupts have been enabled using the T1IE control bit. Refer to Section 12.12.1 “Timer Operation in Sleep Mode” for further details. 12.14.1 Example Application An example application is shown in Figure 12-7, where Timer1 (Type A time base) is driven from an external 32.768 kHz oscillator. The external 32.768 kHz oscillator is typically used in applications where real-time needs to be kept, but it is also desirable to have the lowest possible power consumption. The Timer1 oscillator allows the device to be placed in Sleep while the timer continues to increment. When Timer1 overflows, the interrupt wakes up the device so that the appropriate registers can be updated. Figure 12-7: Timer1 Application In this example, a 32.768 kHz crystal is used as the time base for the Real-Time Clock. If the clock needs to be updated at 1 second intervals, then the period register, PR1, must be loaded with a value to allow the Timer1 to PR1 match at the desired rate. In the case of a 1 second Timer1 match event, the PR1 register should be loaded with a value of 0x8000. Note: The TMR1 register should never be written for correct real-time clock functionality, since the Timer1 clock source is asynchronous to the system clock. Writes to the TMR1 register may corrupt the real-time counter value, resulting in inaccurate timekeeping. 8 4 Current Sink TMR1 VSS dsPIC30FXXX VDD 32.768 kHz Backup Battery Power-Down Detect SOSCO SOSCI OSC1 S1 S2 S3 S4 CN0 CN1 CN2 CN3 dsPIC30F Family Reference Manual DS70059D-page 12-25 © 2005 Microchip Technology Inc. 12.15 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Timers module are: Title Application Note # Using Timer1 in Asynchronous Clock Mode AN580 Yet Another Clock Featuring the PIC16C924 AN649 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70059D-page 12-26 Section 12. Timers Timers 12 12.16 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates technical content changes for the dsPIC30F Timers module. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. Revision D Added example code in Section 12.12.1 “Timer Operation in Sleep Mode”. dsPIC30F Family Reference Manual DS70059D-page 12-27 © 2005 Microchip Technology Inc. © 2004 Microchip Technology Inc. DS70060C-page 13-1 Input Capture 13 Section 13. Input Capture HIGHLIGHTS This section of the manual contains the following major topics: 13.1 Introduction .................................................................................................................. 13-2 13.2 Input Capture Registers ............................................................................................... 13-3 13.3 Timer Selection ............................................................................................................ 13-4 13.4 Input Capture Event Modes ......................................................................................... 13-4 13.5 Capture Buffer Operation............................................................................................. 13-8 13.6 Input Capture Interrupts ............................................................................................... 13-9 13.7 UART Autobaud Support ............................................................................................. 13-9 13.8 Input Capture Operation in Power Saving States ...................................................... 13-10 13.9 I/O Pin Control ........................................................................................................... 13-10 13.10 Special Function Registers Associated with the Input Capture Module..................... 13-11 13.11 Design Tips ................................................................................................................ 13-12 13.12 Related Application Notes.......................................................................................... 13-13 13.13 Revision History ......................................................................................................... 13-14 dsPIC30F Family Reference Manual DS70060C-page 13-2 © 2004 Microchip Technology Inc. 13.1 Introduction This section describes the Input Capture module and its associated Operational modes. The Input Capture module is used to capture a timer value from one of two selectable time bases, upon an event on an input pin. The Input Capture features are quite useful in applications requiring frequency (Time Period) and pulse measurement. Figure 13-1 depicts a simplified block diagram of the Input Capture module. Refer to the specific device data sheet for further information on the number of channels available in a particular device. All Input Capture channels are functionally identical. In this section, an ‘x’ in the pin name or register name denotes the specific Input Capture channel. The Input Capture module has multiple Operating modes, which are selected via the ICxCON register. The Operating modes include: • Capture timer value on every falling edge of input applied at the ICx pin • Capture timer value on every rising edge of input applied at the ICx pin • Capture timer value on every fourth rising edge of input applied at the ICx pin • Capture timer value on every 16th rising edge of input applied at the ICx pin • Capture timer value on every rising and every falling edge of input applied at the ICx pin The Input Capture module has a four-level FIFO buffer. The number of capture events required to generate a CPU interrupt can be selected by the user. Figure 13-1: Input Capture Block Diagram ICxBUF ICx pin ICM<2:0>(ICxCON<2:0>) Mode Select 3 1 0 Set Flag ICxIF (in IFSn Register) TMRy TMRz Edge Detection Logic 16 16 FIFO R/W Logic ICxI<1:0> ICBNE, ICOV(ICxCON<4:3>) ICxCON Interrupt Logic System Bus From 16-bit Timers ICTMR (ICxCON<7>) FIFO Prescaler Counter (1, 4, 16) and Clock Synchronizer Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel. © 2004 Microchip Technology Inc. DS70060C-page 13-3 Section 13. Input Capture Input Capture 13 13.2 Input Capture Registers Each capture channel available on the dsPIC30F devices has the following registers, where ‘x’ denotes the number of the capture channel: • ICxCON: Input Capture Control Register • ICxBUF: Input Capture Buffer Register Register 13-1: ICxCON: Input Capture x Control Register Upper Byte: U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — ICSIDL — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R-0, HC R-0, HC R/W-0 R/W-0 R/W-0 ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> bit 7 bit 0 bit 15-14 Unimplemented: Read as ‘0’ bit 13 ICSIDL: Input Capture Module Stop in Idle Control bit 1 = Input capture module will halt in CPU Idle mode 0 = Input capture module will continue to operate in CPU Idle mode bit 12-8 Unimplemented: Read as ‘0’ bit 7 ICTMR: Input Capture Timer Select bits 1 = TMR2 contents are captured on capture event 0 = TMR3 contents are captured on capture event Note: Timer selections may vary. Refer to the device data sheet for details. bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits 11 = Interrupt on every fourth capture event 10 = Interrupt on every third capture event 01 = Interrupt on every second capture event 00 = Interrupt on every capture event bit 4 ICOV: Input Capture Overflow Status Flag (Read Only) bit 1 = Input capture overflow occurred 0 = No input capture overflow occurred bit 3 ICBNE: Input Capture Buffer Empty Status (Read Only) bit 1 = Input capture buffer is not empty, at least one more capture value can be read 0 = Input capture buffer is empty bit 2-0 ICM<2:0>: Input Capture Mode Select bits 111 = Input Capture functions as interrupt pin only, when device is in Sleep or Idle mode (Rising edge detect only, all other control bits are not applicable.) 110 = Unused (module disabled) 101 = Capture mode, every 16th rising edge 100 = Capture mode, every 4th rising edge 011 = Capture mode, every rising edge 010 = Capture mode, every falling edge 001 = Capture mode, every edge (rising and falling) (ICI<1:0> does not control interrupt generation for this mode.) 000 = Input capture module turned off Legend: HC = Cleared in Hardware HS = Set in Hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70060C-page 13-4 © 2004 Microchip Technology Inc. 13.3 Timer Selection Each dsPIC30F device may have one or more input capture channels. Each channel can select between one of two 16-bit timers for the time base. Refer to the device data sheet for the specific timers that can be selected. Selection of the timer resource is accomplished through the ICTMR control bit (ICxCON<7>). The timers can be setup using the internal clock source (FOSC/4), or using a synchronized external clock source applied at the TxCK pin. 13.4 Input Capture Event Modes The input capture module captures the 16-bit value of the selected time base register when an event occurs at the ICx pin. The events that can be captured are listed below in three categories: 1. Simple Capture Event modes • Capture timer value on every falling edge of input at ICx pin • Capture timer value on every rising edge of input at ICx pin 2. Capture timer value on every edge (rising and falling) 3. Prescaler Capture Event modes • Capture timer value on every 4th rising edge of input at ICx pin • Capture timer value on every 16th rising edge of input at ICx pin These Input Capture modes are configured by setting the appropriate Input Capture mode bits, ICM<2:0> (ICxCON<2:0>). 13.4.1 Simple Capture Events The capture module can capture a timer count value (TMR2 or TMR3) based on the selected edge (rising or falling defined by mode) of the input applied to the ICx pin. These modes are specified by setting the ICM<2:0> (ICxCON<2:0>) bits to ‘010’ or ‘011’, respectively. In these modes, the prescaler counter is not used. See Figure 13-3 and Figure 13-2 for simplified timing diagrams of a simple capture event. The input capture logic detects and synchronizes the rising or falling edge of the capture pin signal on the internal phase clocks. If the rising/falling edge has occurred, the capture module logic will write the current time base value to the capture buffer and signal the interrupt generation logic. When the number of elapsed capture events matches the number specified by the ICI<1:0> control bits, the respective capture channel interrupt status flag, ICxIF, is asserted 2 instruction cycles after the capture buffer write event. If the capture time base increments every instruction cycle, the captured count value will be the value that was present 1 or 2 instruction cycles past the time of the event on the ICx pin. This time delay is a function of the actual ICx edge event related to the instruction cycle clock and delay associated with the input capture logic. If the input clock to the capture time base is prescaled, then the delay in the captured value can be eliminated. See Figure 13-3 and Figure 13-2 for details. The input capture pin has minimum high time and low time specifications. Refer to the “Electrical Specifications” section of the device data sheet for further details. © 2004 Microchip Technology Inc. DS70060C-page 13-5 Section 13. Input Capture Input Capture 13 Figure 13-2: Simple Capture Event Timing Diagram, Time Base Prescaler = 1:1 Figure 13-3: Simple Capture Event Timing Diagram, Time Base Prescaler = 1:4 Capture Data TMR2 n-3 n-2 n-1 n n+1 n+2 n+3 n+4 n+1 ICx pin n+5 Note 1: A capture signal edge that occurs in this region will result in a capture buffer entry value of 1 or 2 timer counts from the capture signal edge. See Note 1 TCY ICxIF Set Capture Data TMRy n-1 n n+1 n ICx pin ICxIF Set TCY dsPIC30F Family Reference Manual DS70060C-page 13-6 © 2004 Microchip Technology Inc. 13.4.2 Prescaler Capture Events The capture module has two Prescaled Capture modes. The Prescale modes are selected by setting the ICM<2:0> (ICxCON<2:0>) bits to ‘100’ or ‘101’, respectively. In these modes, the capture module counts four or sixteen rising edge pin events before a capture event occurs. The capture prescaler counter is incremented on every valid rising edge applied to the capture pin. The rising edge applied to the pin effectively serves as a clock to a counter. When the prescaler counter equals four or sixteen counts (depending on the mode selected), the counter will output a “valid” capture event signal, which is then synchronized to the instruction cycle clock. This synchronized capture event signal will trigger a capture buffer write event and signal the interrupt generation logic. The respective capture channel interrupt status flag, ICxIF, is asserted 2 instruction cycles after the capture buffer write event. If the capture time base increments every instruction cycle, the captured count value will be the value that was present 1 or 2 instruction cycles past the time of the synchronized capture event. The input capture pin has minimum high time and low time specifications. Refer to the “Electrical Specifications” section of the device data sheet for further details. Switching from one prescale setting to another may generate an interrupt. Also, the prescaler counter will not be cleared, therefore, the first capture may be from a non-zero prescaler. Example 13-1 shows the recommended method for switching between capture prescale settings. The prescaler counter is cleared when: • The capture channel is turned off (i.e., ICM<2:0> = ‘000’). • Any device Reset. The prescaler counter is not cleared when: • The user switches from one active Capture mode to another. © 2004 Microchip Technology Inc. DS70060C-page 13-7 Section 13. Input Capture Input Capture 13 Example 13-1: Prescaled Capture Code Example ; The following code example will set the Input Capture 1 module ; for interrupts on every second capture event, capture on every ; fourth rising edge and select Timer 2 as the time-base. This ; code example clears ICxCON to avoid unexpected interrupts. BSET IPC0, #IC1IP0 ; Setup Input Capture 1 interrupt for BCLR IPC0, #IC1IP1 ; desired priority level BCLR IPC0, #IC1IP2 ; (this example assigns level 1 priority) BCLR IFS0, #IC1IF ; Clear the IC1 interrupt status flag BSET IEC0, #IC1IE ; Enable IC1 interrupts CLR IC1CON ; Turn off Input Capture 1 Module. MOV #0x00A2, w0 ; Load the working register with the new MOV w0, IC1CON ; prescaler mode and write to IC1CON MOV #IC1BUF, w0 ; Create capture data fetch pointer MOV #TEMP_BUFF, w1 ; Create data storage pointer ; Assumes TEMP_BUFF is already defined ; The following code shows how to read the capture buffer when ; an interrupt is generated. W0 contains the capture buffer address. ; Example code for Input Capture 1 ISR: __IC1Interrupt: BCLR IFS0, #IC1IF ; Reset respective interrupt flag MOV [w0++], [w1++] ; Read and save off first capture entry MOV [w0], [w1] ; Read and save off second capture entry ; Remaining user code here RETFIE ; Return from ISR Note: It is recommended that the user turn off the capture module (i.e., clear ICM<2:0> (ICxCON<2:0>)) before switching to a new mode. If the user switches to a new Capture mode, the prescaler counter is not cleared. Therefore, it is possible that the first capture event and its associated interrupt is generated due to a non-zero prescaler counter (at the time of switching modes). dsPIC30F Family Reference Manual DS70060C-page 13-8 © 2004 Microchip Technology Inc. 13.4.3 Edge Detection Mode The capture module can capture a time base count value on every rising and falling edge of the input signal applied to the ICx pin. The Edge Detection mode is selected by setting the ICM<2:0> (ICxCON<2:0>) bits to ‘001’. In this mode, the capture prescaler counter is not used. See Figure 13-4 for a simplified timing diagram. When the input capture module is configured for Edge Detection mode, the module will: • Set the input capture interrupt flag (ICxIF) on every edge, rising and falling. • The Interrupt-on-Capture mode bits, ICI<1:0> (ICxCON<6:5>), are not used in this mode. Every capture event will generate an interrupt. • No capture overflow, ICOV (ICxCON<4>), bit is generated. As with the simple Capture Event mode, the input capture logic detects and synchronizes the rising and falling edge of the capture pin signal on the internal phase clocks. If the rising or falling edge has occurred, the capture module logic will write the current timer count to the capture buffer and signal the interrupt generation logic. The respective capture channel interrupt status flag, ICxIF, is asserted 2 instruction cycles after the capture buffer write event. The captured timer count value will be 1 or 2 TCY (instruction cycles) past the time of the occurrence of the edge at the ICx pin (see Figure 13-4). Figure 13-4: Edge Detection Mode Timing Diagram 13.5 Capture Buffer Operation Each capture channel has an associated four-deep FIFO buffer. The ICxBUF register is the buffer register visible to the user, as it is memory mapped. When the input capture module is reset, ICM<2:0> = 000 (ICxCON<2:0>), the input capture logic will: • Clear the overflow condition flag (i.e., clear ICxOV (ICxCON<4>) to ‘0’). • Reset the capture buffer to the empty state (i.e., clears ICBNE (ICxCON<3>) to ‘0’). Reading the FIFO buffer under the following conditions will lead to indeterminate results: • In the event the input capture module is first disabled and at some later time re-enabled. • In the event a FIFO read is performed when the buffer is empty. • After a device Reset. There are two status flags which provide status on the FIFO buffer: • ICBNE (ICxCON<3>): Input Capture Buffer Not Empty • ICOV (ICxCON<4>): Input Capture Overflow Capture Data TMRy n-3 n-2 n-1 n n+1 n+2 n+3 n+4 n+6 n ICx pin n+5 TCY n+4 ICxIF Set ICxIF Set © 2004 Microchip Technology Inc. DS70060C-page 13-9 Section 13. Input Capture Input Capture 13 13.5.1 Input Capture Buffer Not Empty (ICBNE) The ICBNE read only Status bit (ICxCON<3>) will be set on the first input capture event and remain set until all capture events have been read from the capture buffer. For example, if three capture events have occurred, then three reads of the capture buffer are required before the ICBNE (ICxCON<3>) flag will be cleared. If four capture events, then four reads are required to clear the ICBNE (ICxCON<3>) flag. Each read of the capture buffer will allow the remaining word(s) to move to the next available top location. Since the ICBNE reflects the capture buffer state, the ICBNE Status bit will be cleared in the event of any device Reset. 13.5.2 Input Capture Overflow (ICOV) The ICOV read only Status bit (ICxCON<4>) will be set when the capture buffer overflows. In the event that buffer is full with four capture events and a fifth capture event occurs prior to a read of the buffer, an overrun condition will occur, the ICOV (ICxCON<4>) bit will be set to a logic ‘1’ and the respective capture event interrupt will not be generated. In addition, the fifth capture event is not recorded and all subsequent capture events will not alter the current buffer contents. To clear the overrun condition, the capture buffer must be read four times. Upon the fourth read, the ICOV (ICxCON<4>) status flag will be cleared and the capture channel will resume normal operation. Clearing of the overflow condition can be accomplished in the following ways: • Set ICM<2:0> (ICxCON<2:0>) = 000 • Read capture buffer until ICBNE (ICxCON<3>) = 0 • Any device Reset 13.5.2.1 ICOV and Interrupt Only Mode The input capture module can also be configured to function as an external interrupt pin. For this mode, the ICI<1:0> (ICxCON<6:5>) bits must be set to ‘00’. Interrupts will be generated independently of buffer reads. 13.6 Input Capture Interrupts The input capture module has the ability to generate an interrupt based upon a selected number of capture events. A capture event is defined as a write of a time base value into the capture buffer. This setting is configured by the control bits ICI<1:0> (ICxCON<6:5>). Except for the case when ICI<1:0> = ‘00’, no interrupts will be generated until a buffer overflow condition is removed (see Section 13.5.2 “Input Capture Overflow (ICOV)”). When the capture buffer has been emptied, either by a Reset condition or a read operation, the interrupt count is reset. This allows for the resynchronization of the interrupt count to the FIFO entry status. 13.6.1 Interrupt Control Bits Each input capture channel has interrupt flag Status bits (ICxIF), interrupt enable bits (ICxIE) and interrupt priority control bits (ICxIP<2:0>). Refer to Section 6. “Reset Interrupts” for further information on peripheral interrupts. 13.7 UART Autobaud Support The input capture module can be used by the UART module when the UART is configured for the Autobaud mode of operation, ABAUD = 1 (UxMODE<5>). When the ABAUD control bit is set, the UART RX pin will be internally connected to the assigned input capture module input. The I/O pin associated with the capture module will be disconnected. The baud rate can be determined by measuring the width of the Start bit when a NULL character is received. Note that the capture module must be configured for the Edge Detection mode (capture on every rising and falling edge) to take advantage of the autobaud feature. The input capture module assignment for each UART will depend on the dsPIC30F device variant that is selected. Refer to the device data sheet for further details on the autobaud support. dsPIC30F Family Reference Manual DS70060C-page 13-10 © 2004 Microchip Technology Inc. 13.8 Input Capture Operation in Power Saving States 13.8.1 Input Capture Operation in Sleep Mode When the device enters Sleep mode, the system clock is disabled. In Sleep mode, the input capture module can only function as an external interrupt source. This mode is enabled by setting control bits ICM<2:0> = ‘111’. In this mode, a rising edge on the capture pin will generate device wake-up from Sleep condition. If the respective module interrupt bit is enabled and the module priority is of the required priority, an interrupt will be generated. In the event the capture module has been configured for a mode other than ICM<2:0> = ‘111’ and the dsPIC30F does enter the Sleep mode, no external pin stimulus, rising or falling, will generate a wake-up condition from Sleep. 13.8.2 Input Capture Operation in Idle Mode When the device enters Idle mode, the system clock sources remain functional and the CPU stops executing code. The ICSIDL bit (ICxCON<13>) selects if the module will stop in Idle mode, or continue to operate in Idle mode. If ICSIDL = 0 (ICxCON<13>), the module will continue operation in Idle mode. Full functionality of the input capture module is provided for, including the 4:1 and 16:1 capture prescale settings, defined by control bits ICM<2:0> (ICxCON<2:0>). These modes require that the selected timer is enabled during Idle mode as well. If the Input Capture mode is configured for ICM<2:0> = ‘111’, the input capture pin will serve only as an external interrupt pin. In this mode, a rising edge on the capture pin will generate device wake-up from Idle mode. A capture time base does not have to be enabled. If the respective module interrupt enable bit is set and the user assigned priority is greater than the current CPU priority level, an interrupt will be generated. If ICSIDL = 1 (ICxCON<13>), the module will stop in Idle mode. The module will perform the same functions when stopped in Idle mode as for Sleep mode (see Section 13.8.1 “Input Capture Operation in Sleep Mode”). 13.8.3 Device Wake-up on Sleep/Idle An input capture event can generate a device wake-up or interrupt, if enabled, if the device is in Idle or Sleep mode. Independent of the timer being enabled, the input capture module will wake-up from Sleep or Idle mode when a capture event occurs, if the following are true: • Input Capture mode bits, ICM<2:0> = ‘111’ (ICxCON<2:0>) and • The interrupt enable bit (ICxIE) is asserted. This same wake-up feature will interrupt the CPU if: • The respective interrupt is enabled (ICxIE = 1) and is of the required priority. This wake-up feature is quite useful for adding extra external pin interrupts. The following conditions are true when the input capture module is used in this mode: • The capture prescaler counter is not utilized while in this mode. • The ICI<1:0>(ICxCON<6:5>) bits are not applicable. 13.9 I/O Pin Control When the capture module is enabled, the user must ensure the I/O pin direction is configured for an input by setting the associated TRIS bit. The pin direction is not set when the capture module is enabled. Furthermore, all other peripherals multiplexed with the input pin must be disabled. S e c t i o n 1 3 . I n p u t C a p t u r e Input Capture 13 © 2004 Microchip Technology Inc. DS70060C-page 13-11 13.10 Special Function Registers Associated with the Input Capture Module Table 13-1: Example Memory Map for Input Capture Modules SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0F 0000 0000 0000 0000 IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE IR12 ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IEC1 008E IC6IE EI30 IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000 IPC0 0094 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100 IPC1 0096 — T31P<2:0> — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> 0100 0100 0100 0100 IPC4 009C — OC3IP<2:0> — IC8IP<2:0> — IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100 IPC7 00A2 — IC6IP<2:0> — IC5IP<2:0> — IC4IP<2:0> — IC3IP<2:0> 0100 0100 0100 0100 IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu IC1CON 0142 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu IC2CON 0146 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 IC3BUF 0148 Input 3 Capture Register uuuu uuuu uuuu uuuu IC3CON 014A — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 IC4BUF 014C Input 4 Capture Register uuuu uuuu uuuu uuuu IC4CON 014E — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 IC5BUF 0150 Input 5 Capture Register uuuu uuuu uuuu uuuu IC5CON 0152 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 IC6BUF 0154 Input 6 Capture Register uuuu uuuu uuuu uuuu IC6CON 0156 — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 IC7BUF 0158 Input 7 Capture Register uuuu uuuu uuuu uuuu IC7CON 015A — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 IC8BUF 015C Input 8 Capture Register uuuu uuuu uuuu uuuu IC8CON 015E — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 Legend: u = uninitialized Note: Refer to the device data sheet for specific memory map details. dsPIC30F Family Reference Manual DS70060C-page 13-12 © 2004 Microchip Technology Inc. 13.11 Design Tips Question 1: Can the Input Capture module be used to wake the device from Sleep mode? Answer: Yes. When the Input Capture module is configured to ICM<2:0> = ‘111’ and the respective channel interrupt enable bit is asserted, ICxIE = 1, a rising edge on the capture pin will wake-up the device from Sleep (see Section 13.8 “Input Capture Operation in Power Saving States”). © 2004 Microchip Technology Inc. DS70060C-page 13-13 Section 13. Input Capture Input Capture 13 13.12 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Input Capture module are: Title Application Note # Using the CCP Module(s) AN594 Implementing Ultrasonic Ranging AN597 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70060C-page 13-14 © 2004 Microchip Technology Inc. 13.13 Revision History Revision A This is the initial released revision of this document. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. © 2004 Microchip Technology Inc. DS70061C-page 14-1 O utp ut Compare 14 Section 14. Output Compare HIGHLIGHTS This section of the manual contains the following major topics: 14.1 Introduction .................................................................................................................. 14-2 14.2 Output Compare Registers .......................................................................................... 14-3 14.3 Modes of Operation ..................................................................................................... 14-4 14.4 Output Compare Operation in Power Saving States.................................................. 14-23 14.5 I/O Pin Control ........................................................................................................... 14-23 14.6 Design Tips ................................................................................................................ 14-26 14.7 Related Application Notes.......................................................................................... 14-27 14.8 Revision History ......................................................................................................... 14-28 dsPIC30F Family Reference Manual DS70061C-page 14-2 © 2004 Microchip Technology Inc. 14.1 Introduction The Output Compare module has the ability to compare the value of a selected time base with the value of one or two compare registers (depending on the Operation mode selected). Furthermore, it has the ability to generate a single output pulse, or a train of output pulses, on a compare match event. Like most dsPIC peripherals, it also has the ability to generate interrupts-on- compare match events. The dsPIC30F device may have up to eight output compare channels, designated OC1, OC2, OC3, etc. Refer to the specific device data sheet for the number of channels available in a particular device. All output compare channels are functionally identical. In this section, an ‘x’ in the pin, register or bit name denotes the specific output compare channel. Each output compare channel can use one of two selectable time bases. The time base is selected using the OCTSEL bit (OCxCON<3>). Please refer to the device data sheet for the specific timers that can be used with each output compare channel number. Figure 14-1: Output Compare Module Block Diagram OCxR(1) Comparator Output Logic S Q R OCM<2:0> Output Enable OCx(1) Set Flag bit OCxIF(1) OCxRS(1) Mode Select 3 Note 1: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channels 1 through 8. 2: OCFA pin controls OC1-OC4 channels. OCFB pin controls OC5-OC8 channels. 3: Each output compare channel can use one of two selectable time bases. Refer to the device data sheet for the time bases associated with the module. 0 1 OCTSEL 0 1 16 16 OCFA or OCFB (see Note 2) TMR register inputs from time bases (see Note 3). Period match signals from time bases (see Note 3). © 2004 Microchip Technology Inc. DS70061C-page 14-3 Section 14. Output Compare O utp ut Compare 14 14.2 Output Compare Registers Each output compare channel has the following registers: • OCxCON: the control register for the channel • OCxR: a data register for the output compare channel • OCxRS: a secondary data register for the output compare channel The control registers for the 8 compare channels are named OC1CON through OC8CON. All 8 control registers have identical bit definitions. They are represented by a common register definition below. The ‘x’ in OCxCON represents the output compare channel number. Register 14-1: OCxCON: Output Compare x Control Register Upper Byte: U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 — — OCSIDL — — — — — bit 15 bit 8 Lower Byte: U-0 U-0 U-0 R-0, HC R/W-0 R/W-0 R/W-0 R/W-0 — — — OCFLT OCTSEL OCM<2:0> bit 7 bit 0 bit 15-14 Unimplemented: Read as ‘0’ bit 13 OCSIDL: Stop Output Compare in Idle Mode Control bit 1 = Output compare x will halt in CPU Idle mode 0 = Output compare x will continue to operate in CPU Idle mode bit 12-5 Unimplemented: Read as ‘0’ bit 4 OCFLT: PWM Fault Condition Status bit 1 = PWM Fault condition has occurred (cleared in HW only) 0 = No PWM Fault condition has occurred (This bit is only used when OCM<2:0> = 111.) bit 3 OCTSEL: Output Compare Timer Select bit 1 = Timer3 is the clock source for compare x 0 = Timer2 is the clock source for compare x Note: Refer to the device data sheet for specific time bases available to the output compare module. bit 2-0 OCM<2:0>: Output Compare Mode Select bits 111 = PWM mode on OCx, Fault pin enabled 110 = PWM mode on OCx, Fault pin disabled 101 = Initialize OCx pin low, generate continuous output pulses on OCx pin 100 = Initialize OCx pin low, generate single output pulse on OCx pin 011 = Compare event toggles OCx pin 010 = Initialize OCx pin high, compare event forces OCx pin low 001 = Initialize OCx pin low, compare event forces OCx pin high 000 = Output compare channel is disabled Legend: HC = Cleared in Hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70061C-page 14-4 © 2004 Microchip Technology Inc. 14.3 Modes of Operation Each output compare module has the following modes of operation: • Single Compare Match mode • Dual Compare Match mode generating - Single Output Pulse - Continuous Output Pulses • Simple Pulse Width Modulation mode - with Fault Protection Input - without Fault Protection Input 14.3.1 Single Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) are set to ‘001’, ‘010’ or ‘011’, the selected output compare channel is configured for one of three Single Output Compare Match modes. In the Single Compare mode, the OCxR register is loaded with a value and is compared to the selected incrementing timer register, TMRy. On a compare match event, one of the following events will take place: • Compare forces OCx pin high, initial state of pin is low. Interrupt is generated on the single compare match event. • Compare forces OCx pin low, initial state of pin is high. Interrupt is generated on the single compare match event. • Compare toggles OCx pin. Toggle event is continuous and an interrupt is generated for each toggle event. Note 1: It is recommended that the user turn off the output compare module (i.e., clear OCM<2:0> (OCxCON<2:0>)) before switching to a new mode. 2: In this section, a reference to any SFRs associated with the selected timer source is indicated by a ‘y’ suffix. For example, PRy is the Period register for the selected timer source, while TyCON is the Timer Control register for the selected timer source. © 2004 Microchip Technology Inc. DS70061C-page 14-5 Section 14. Output Compare O utp ut Compare 14 14.3.1.1 Compare Mode Output Driven High To configure the output compare module for this mode, set control bits OCM<2:0> = ‘001’. The compare time base should also be enabled. Once this Compare mode has been enabled, the output pin, OCx, will be initially driven low and remain low until a match occurs between the TMRy and OCxR registers. Referring to Figure 14-2, there are some key timing events to note: • The OCx pin is driven high one instruction clock after the compare match occurs between the compare time base and the OCxR register. The OCx pin will remain high until a mode change has been made, or the module is disabled. • The compare time base will count up to the value contained in the associated period register and then reset to 0x0000 on the next instruction clock. • The respective channel interrupt flag, OCxIF, is asserted 2 instruction clocks after the OCx pin is driven high. Figure 14-2: Single Compare Mode: Set OCx High on Compare Match Event OCxIF TMRy 3000 3001 3002 3003 3004 4000 0001 0000 Cleared by User 1 Instruction Clock Period 2 TCY 4000 3002 PRy OCxR 3FFF OCx pin TMRy Resets Here Note: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. dsPIC30F Family Reference Manual DS70061C-page 14-6 © 2004 Microchip Technology Inc. 14.3.1.2 Compare Mode Output Driven Low To configure the output compare module for this mode, set control bits OCM<2:0> = ‘010’. The compare time base must also be enabled. Once this Compare mode has been enabled, the output pin, OCx, will be initially driven high and remain high until a match occurs between the Timer and OCxR registers. Referring to Figure 14-3, there are some key timing events to note: • The OCx pin is driven low one instruction clock after the compare match occurs between the compare time base and the OCxR register. The OCx pin will remain low until a mode change has been made, or the module is disabled. • The compare time base will count up to the value contained in the associated period register and then reset to 0x0000 on the next instruction clock. • The respective channel interrupt flag, OCxIF, is asserted 2 instruction clocks after OCx pin is driven low. Figure 14-3: Single Compare Mode: Force OCx Low on Compare Match Event OCxIF TMRy 47FE 47FF 4800 4801 4802 4C00 0001 0000 Cleared by User 1 Instruction Clock Period 2 TCY 4C00 4800 PRy OCxR 4BFF OCx pin TMRy Resets Here Note: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. © 2004 Microchip Technology Inc. DS70061C-page 14-7 Section 14. Output Compare O utp ut Compare 14 14.3.1.3 Single Compare Mode Toggle Output To configure the output compare module for this mode, set control bits OCM<2:0> = ‘011’. In addition, Timer 2 or Timer 3 must be selected and enabled. Once this Compare mode has been enabled, the output pin, OCx, will be initially driven low and then toggle on each and every subsequent match event between the Timer and OCxR registers. Referring to Figure 14-4 and Figure 14-5, there are some key timing events to note: • The OCx pin is toggled one instruction clock after the compare match occurs between the compare time base and the OCxR register. The OCx pin will remain at this new state until the next toggle event, or until a mode change has been made, or the module is disabled. • The compare time base will count up to the contents in the period register and then reset to 0x0000 on the next instruction clock. • The respective channel interrupt flag, OCxIF, is asserted 2 instruction clocks after the OCx pin is toggled. Figure 14-4: Single Compare Mode: Toggle Output on Compare Match Event (PR2 > OCxR) Figure 14-5: Single Compare Mode: Toggle Output on Compare Match Event (PR2 = OCxR) Note: The internal OCx pin output logic is set to a logic ‘0’ on a device Reset. However, the operational OCx pin state for the Toggle mode can be set by the user software. Example 14-1 shows a code example for defining the desired initial OCx pin state in the Toggle mode of operation. OCxIF TMRy 0500 0501 0502 0600 0500 1 Instruction Clock Period 0600 0500 PRy OCxR 0001 OCx pin TMRy Resets Here 0000 0501 0502 Cleared by User 2 TCY Note: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. OCxIF TMR2 0500 0000 0001 0500 0500 Cleared by User 1 Instruction Clock Period 2 TCY 0500 0500 PR2 OCxR 0001 OCx pin TMRy Resets Here 0000 0000 0001 Cleared by User 2 TCY 2 TCY TMRy Resets Here Note: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. dsPIC30F Family Reference Manual DS70061C-page 14-8 © 2004 Microchip Technology Inc. Example 14-1: Compare Mode Toggle Mode Pin State Setup Example 14-2 shows example code for the configuration and interrupt service of the Single Compare mode toggle event. Example 14-2: Compare Mode Toggle Setup and Interrupt Servicing ; The following code example illustrates how to define the initial ; OC1 pin state for the output compare toggle mode of operation. ; Toggle mode with initial OC1 pin state set low MOV 0x0001, w0 ; load setup value into w0 MOV w0, OC1CON ; enable module for OC1 pin low, toggle high BSET OC1CON, #1 ; set module to toggle mode with initial pin ; state low ; Toggle mode with initial OC1 pin state set high MOV 0x0002, w0 ; load setup value into w0 MOV w0, OC1CON ; enable module for OC1 pin high, toggle low BSET OC1CON, #0 ; set module to toggle mode with initial pin ; state high ; The following code example will set the Output Compare 1 module ; for interrupts on the toggle event and select Timer 2 as the clock ; source for the compare time-base. It is assumed in that Timer 2 ; and Period Register 2 are properly configured. Timer 2 will ; be enabled here. CLR OC1CON ; Turn off Output Compare 1 Module. MOV #0x0003, w0 ; Load the working register with the new MOV w0, OC1CON ; compare mode and write to OC1CON MOV #0x0500, w0 ; Initialize Compare Register 1 MOV w0, OC1R ; with 0x0500 BSET IPC0, #OC1IP0 ; Setup Output Compare 1 interrupt for BCLR IPC0, #OC1IP1 ; desired priority level BCLR IPC0, #OC1IP2 ; (this example assigns level 1 priority) BCLR IFS0, #OC1IF ; Clear Output Compare 1 interrupt flag BSET IEC0, #OC1IE ; Enable Output Compare 1 interrupts BSET T2CON, #TON ; Start Timer2 with assumed settings ; Example code for Output Compare 1 ISR: __OC1Interrupt: BCLR IFS0, #OC1IF ; Reset respective interrupt flag ; Remaining user code here RETFIE ; Return from ISR © 2004 Microchip Technology Inc. DS70061C-page 14-9 Section 14. Output Compare O utp ut Compare 14 14.3.2 Dual Compare Match Mode When control bits OCM<2:0> = ‘100’ or ‘101’ (OCxCON<2:0>), the selected output compare channel is configured for one of two Dual Compare Match modes which are: • Single Output Pulse mode • Continuous Output Pulse mode In the Dual Compare mode, the module uses both the OCxR and OCxRS registers for the compare match events. The OCxR register is compared against the incrementing timer count, TMRy, and the leading (rising) edge of the pulse is generated at the OCx pin, on a compare match event. The OCxRS register is then compared to the same incrementing timer count, TMRy, and the trailing (falling) edge of the pulse is generated at the OCx pin, on a compare match event. 14.3.2.1 Dual Compare Mode: Single Output Pulse To configure the Output Compare module for the Single Output Pulse mode, set control bits OCM<2:0> = ‘100’. In addition, the compare time base must be selected and enabled. Once this mode has been enabled, the output pin, OCx, will be driven low and remain low until a match occurs between the time base and OCxR registers. Referring to Figure 14-6 and Figure 14-7, there are some key timing events to note: • The OCx pin is driven high one instruction clock after the compare match occurs between the compare time base and OCxR register. The OCx pin will remain high until the next match event occurs between the time base and the OCxRS register. At this time, the pin will be driven low. The OCx pin will remain low until a mode change has been made, or the module is disabled. • The compare time base will count up to the value contained in the associated period register and then reset to 0x0000 on the next instruction clock. • If the time base period register contents are less than the OCxRS register contents, then no falling edge of the pulse is generated. The OCx pin will remain high until OCxRS <= PRy, or a mode change or Reset condition has occurred. • The respective channel interrupt flag, OCxIF, is asserted 2 instruction clocks after the OCx pin is driven low (falling edge of single pulse). Figure 14-6 depicts the General Dual Compare mode generating a single output pulse. Figure 14-7 depicts another timing example where OCxRS > PRy. In this example, no falling edge of the pulse is generated since the compare time base resets before counting up to 0x4100. dsPIC30F Family Reference Manual DS70061C-page 14-10 © 2004 Microchip Technology Inc. Figure 14-6: Dual Compare Mode Figure 14-7: Dual Compare Mode: Single Output Pulse (OCxRS > PR2) OCxIF TMRy 3000 3001 3002 3003 3004 4000 0000 Cleared by User Note 1: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. 2: OCxR = Compare Register, OCxRS = Secondary Compare Register. 1 Instruction Clock Period 2 TCY 4000 3000 PRy OCxR 3006 OCx pin TMRy Resets Here OCxRS 3003 3005 OCxIF TMRy 3000 3001 3002 3003 3004 4000 0000 1 Instruction Clock Period 4000 3000 PRy OCxR 3006 OCx pin TMRy Resets Here OCxRS 4100 3005 Note 1: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. 2: OCxR = Compare Register, OCxRS = Secondary Compare Register. Compare Interrupt does not occur © 2004 Microchip Technology Inc. DS70061C-page 14-11 Section 14. Output Compare O utp ut Compare 14 14.3.2.2 Setup for Single Output Pulse Generation When control bits OCM<2:0> (OCxCON<2:0>) are set to ‘100’, the selected output compare channel initializes the OCx pin to the low state and generates a single output pulse. To generate a single output pulse, the following steps are required (these steps assume timer source is initially turned off, but this is not a requirement for the module operation): 1. Determine the instruction clock cycle time. Take into account the frequency of the external clock to the timer source (if one is used) and the timer prescaler settings. 2. Calculate time to the rising edge of the output pulse relative to the TMRy start value (0x0000). 3. Calculate the time to the falling edge of the pulse based on the desired pulse width and the time to the rising edge of the pulse. 4. Write the values computed in steps 2 and 3 above into the compare register, OCxR, and the secondary compare register, OCxRS, respectively. 5. Set timer period register, PRy, to value equal to or greater than value in OCxRS, the secondary compare register. 6. Set OCM<2:0> = ‘100’ and the OCTSEL (OCxCON<3>) bit to the desired timer source. The OCx pin state will now be driven low. 7. Set the TON (TyCON<15>) bit to ‘1’, which enables the compare time base to count. 8. Upon the first match between TMRy and OCxR, the OCx pin will be driven high. 9. When the incrementing timer, TMRy, matches the secondary compare register, OCxRS, the second and trailing edge (high-to-low) of the pulse is driven onto the OCx pin. No additional pulses are driven onto the OCx pin and it remains at low. As a result of the second compare match event, the OCxIF interrupt flag bit set, which will result in an interrupt if it is enabled, by setting the OCxIE bit. For further information on peripheral interrupts, refer to Section 6. “Reset Interrupts”. 10. To initiate another single pulse output, change the timer and compare register settings, if needed, and then issue a write to set OCM<2:0> (OCxCON<2:0>) bits to ‘100’. Disabling and re-enabling of the timer and clearing the TMRy register are not required, but may be advantageous for defining a pulse from a known event time boundary. The output compare module does not have to be disabled after the falling edge of the output pulse. Another pulse can be initiated by rewriting the value of the OCxCON register. dsPIC30F Family Reference Manual DS70061C-page 14-12 © 2004 Microchip Technology Inc. Example 14-3 shows example code for configuration of the single output pulse event. Example 14-3: Single Output Pulse Setup and Interrupt Servicing ; The following code example will set the Output Compare 1 module ; for interrupts on the single pulse event and select Timer 2 ; as the clock source for the compare time base. It is assumed ; that Timer 2 and Period Register 2 are properly initialized. ; Timer 2 will be enabled here. CLR OC1CON ; Turn off Output Compare 1 Module. MOV #0x0004, w0 ; Load the working register with the new MOV W0, OC1CON ; compare mode and write to OC1CON MOV #0x3000, w0 ; Initialize Compare Register 1 MOV W0, OC1R ; with 0x3000 MOV #0x3003, w0 ; Initialize Secondary Compare Register 1 MOV W0, OC1RS ; with 0x3003 BSET IPC0, #OC1IP0 ; Setup Output Compare 1 interrupt for BCLR IPC0, #OC1IP1 ; desired priority level BCLR IPC0, #OC1IP2 ; (this example assigns level 1 priority) BCLR IFS0, #OC1IF ; Clear Output Compare 1 interrupt flag BSET IEC0, #OC1IE ; Enable Output Compare 1 interrupts BSET T2CON, #TON ; Start Timer2 with assumed settings ; Example code for Output Compare 1 ISR: __OC1Interrupt: BCLR IFS0, #OC1IF ; Reset respective interrupt flag ; Remaining user code here RETFIE ; Return from ISR © 2004 Microchip Technology Inc. DS70061C-page 14-13 Section 14. Output Compare O utp ut Compare 14 14.3.2.3 Special Cases for Dual Compare Mode Generating a Single Output Pulse Depending on the relationship of the OCxR, OCxRS and PRy values, the output compare module has a few unique conditions which should be understood. These special conditions are specified in Table 14-1, along with the resulting behavior of the module. Table 14-1: Special Cases for Dual Compare Mode Generating a Single Output Pulse SFR Logical Relationship Special Conditions Operation Output at OCx PRy >= OCxRS and OCxRS > OCxR OCxR = 0 Initialize TMRy = 0 In the first iteration of the TMRy counting from 0x0000 up to PRy, the OCx pin remains low, no pulse is generated. After the TMRy resets to zero (on period match), the OCx pin goes high due to match with OCxR. Upon the next TMRy to OCxRS match, the OCx pin goes low and remains there. The OCxIF bit will be set as a result of the second compare. There are two alternative initial conditions to consider: a] Initialize TMRy = 0 and set OCxR >= 1 b] Initialize TMRy = PRy (PRy > 0) and set OCxR = 0 Pulse will be delayed by the value in the PRy register depending on setup PRy >= OCxR and OCxR >= OCxRS OCxR >= 1 and PRy >= 1 TMRy counts up to OCxR and on a compare match event (i.e., TMRy = OCxR), the OCx pin is driven to a high state. TMRy then continues to count and eventually resets on period match (i.e., PRy =TMRy). The timer then restarts from 0x0000 and counts up to OCxRS, and on a compare match event (i.e., TMRy = OCxRS), the OCx pin is driven to a low state. The OCxIF bit will be set as a result of the second compare. Pulse OCxRS > PRy and PRy >= OCxR None Only the rising edge will be generated at the OCx pin. The OCxIF will not be set. Rising edge/ transition to high OCxR = OCxRS = PRy = 0x0000 None An output pulse delayed 2 instruction clock periods upon the match of the timer and period register is generated at the OCx pin. The OCxIF bit will be set as a result of the second compare. Delayed pulse OCxR > PRy None Unsupported mode, timer resets prior to match condition. Remains low Note 1: In all the cases considered herein, the TMRy register is assumed to be initialized to 0x0000. 2: OCxR = Compare Register, OCxRS = Secondary Compare Register, TMRy = Timery Count, PRy = Timery Period Register. dsPIC30F Family Reference Manual DS70061C-page 14-14 © 2004 Microchip Technology Inc. 14.3.2.4 Dual Compare Mode: Continuous Output Pulses To configure the output compare module for this mode, set control bits OCM<2:0> = ‘101’. In addition, the compare time base must be selected and enabled. Once this mode has been enabled, the output pin, OCx, will be driven low and remain low until a match occurs between the compare time base and OCxR register. Referring to Figure 14-8 and Figure 14.3.2.5, there are some key timing events to note: • The OCx pin is driven high one instruction clock after the compare match occurs between the compare time base and OCxR register. The OCx pin will remain high until the next match event occurs between the time base and the OCxRS register, at which time the pin will be driven low. This pulse generation sequence of a low-to-high and high-to-low edge will repeat on the OCx pin without further user intervention. • Continuous pulses will be generated on the OCx pin until a mode change is made, or the module is disabled. • The compare time base will count up to the value contained in the associated period register and then reset to 0x0000 on the next instruction clock. • If the compare time base period register value is less than the OCxRS register value, then no falling edge is generated. The OCx pin will remain high until OCxRS <= PR2, a mode change is made, or the device is reset. • The respective channel interrupt flag, OCxIF, is asserted 2 instruction clocks after the OCx pin is driven low (falling edge of single pulse). Figure 14-8 depicts the General Dual Compare mode generating a continuous output pulse. Figure 14.3.2.5 depicts another timing example where OCxRS > PRy. In this example, no falling edge of the pulse is generated, since the time base will reset before counting up to the contents of OCxRS. Figure 14-8: Dual Compare Mode: Continuous Output Pulse (PR2 = OCxRS) OCxIF TMRy 3000 3001 3002 3003 0000 3002 3003 Cleared by User 1 Instruction Clock Period 2 TCY 3003 3000 PRy OCxR 3000 OCx pin OCxRS 3003 3001 0000 3000 2 TCY TMRy Resets Here TMRy Resets Here Note 1: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. 2: OCxR = Compare Register, OCxRS = Secondary Compare Register. © 2004 Microchip Technology Inc. DS70061C-page 14-15 Section 14. Output Compare O utp ut Compare 14 Figure 14-9: Dual Compare Mode: Continuous Output Pulse (PR2 = OCxRS) 14.3.2.5 Setup for Continuous Output Pulse Generation When control bits OCxM<2:0> (OCxCON<2:0>) are set to ‘101’, the selected output compare channel initializes the OCx pin to the low state and generates output pulses on each and every compare match event. For the user to configure the module for the generation of a continuous stream of output pulses, the following steps are required (these steps assume timer source is initially turned off, but this is not a requirement for the module operation): 1. Determine the instruction clock cycle time. Take into account the frequency of the external clock to the timer source (if one is used) and the timer prescaler settings. 2. Calculate time to the rising edge of the output pulse relative to the TMRy start value (0x0000). 3. Calculate the time to the falling edge of the pulse, based on the desired pulse width and the time to the rising edge of the pulse. 4. Write the values computed in step 2 and 3 above into the compare register, OCxR, and the secondary compare register, OCxRS, respectively. 5. Set timer period register, PRy, to value equal to or greater than value in OCxRS, the secondary compare register. 6. Set OCM<2:0> = ‘101’ and the OCTSEL (OCxCON<3>) bit to the desired timer source. The OCx pin state will now be driven low. 7. Enable the compare time base by setting the TON (TyCON<15>) bit to ‘1’. 8. Upon the first match between TMRy and OCxR, the OCx pin will be driven high. 9. When the compare time base, TMRy, matches the secondary compare register, OCxRS, the second and trailing edge (high-to-low) of the pulse is driven onto the OCx pin. 10. As a result of the second compare match event, the OCxIF interrupt flag bit set. 11. When the compare time base and the value in its respective period register match, the TMRy register resets to 0x0000 and resumes counting. 12. Steps 8 through 11 are repeated and a continuous stream of pulses is generated, indefinitely. The OCxIF flag is set on each OCxRS-TMRy compare match event. OCxIF TMRy 3000 3001 3002 3003 0000 3002 3003 1 Instruction Clock Period 3003 3000 PRy OCxR 3000 OCx pin OCxRS 3003 3001 0000 3000 TMRy Resets Here TMRy Resets Here Note 1: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. 2: OCxR = Compare Register, OCxRS = Secondary Compare Register. Compare Interrupt does not Occur dsPIC30F Family Reference Manual DS70061C-page 14-16 © 2004 Microchip Technology Inc. Example 14-4 shows example code for configuration of the continuous output pulse event. Example 14-4: Continuous Output Pulse Setup and Interrupt Servicing ; The following code example will set the Output Compare 1 module ; for interrupts on the continuous pulse event and select Timer 2 ; as the clock source for the compare time-base. It is assumed ; that Timer 2 and Period Register 2 are properly configured. ; Timer 2 will be enabled here. CLR OC1CON ; Turn off Output Compare 1 Module. MOV #0x0005, W0 ; Load the working register with the new MOV W0, OC1CON ; compare mode and write to OC1CON MOV #0x3000, W0 ; Initialize Compare Register 1 MOV W0, OC1R ; with 0x3000 MOV #0x3003, W0 ; Initialize Secondary Compare Register 1 MOV W0, OC1RS ; with 0x3003 BSET IPC0, #OC1IP0 ; Setup Output Compare 1 interrupt for BCLR IPC0, #OC1IP1 ; desired priority level BCLR IPC0, #OC1IP2 ; (this example assigns level 1 priority) BCLR IFS0, #OC1IF ; Clear Output Compare 1 interrupt flag BSET IEC0, #OC1IE ; Enable Output Compare 1 interrupts BSET T2CON, #TON ; Start Timer2 with assumed settings ; Example code for Output Compare 1 ISR: __OC1Interrupt: BCLR IFS0, #OC1IF ; Reset respective interrupt flag ; Remaining user code here RETFIE ; Return from ISR © 2004 Microchip Technology Inc. DS70061C-page 14-17 Section 14. Output Compare O utp ut Compare 14 14.3.2.6 Special Cases for Dual Compare Mode Generating Continuous Output Pulses Depending on the relationship of the OCxR, OCxRS and PRy values, the output compare module may not provide the expected results. These special cases are specified in Table 14-2, along with the resulting behavior of the module. Table 14-2: Special Cases for Dual Compare Mode Generating Continuous Output Pulses SFR Logical Relationship Special Conditions Operation Output at OCx PRy >= OCxRS and OCxRS > OCxR OCxR = 0 Initialize TMRy = 0 In the first iteration of the TMRy counting from 0x0000 up to PRy, the OCx pin remains low, no pulse is generated. After the TMRy resets to zero (on period match), the OCx pin goes high. Upon the next TMRy to OCxRS match, the OCx pin goes low. If OCxR = 0 and PRy = OCxRS, the pin will remain low for one clock cycle, then be driven high until the next TMRy to OCxRS match. The OCxIF bit will be set as a result of the second compare. There are two alternative initial conditions to consider: a] Initialize TMRy = 0 and set OCxR >= 1 b] Initialize TMRy = PRy (PRy > 0) and set OCxR = 0 Continuous pulses with the first pulse delayed by the value in the PRy register, depending on setup. PRy >= OCxR and OCxR >= OCxRS OCxR >= 1 and PRy >= 1 TMRy counts up to OCxR and on a compare match event (i.e., TMRy = OCxR), the OCx pin is driven to a high state. TMRy then continues to count and eventually resets on period match (i.e., PRy =TMRy). The timer then restarts from 0x0000 and counts up to OCxRS, and on a compare match event (i.e., TMRy = OCxR), the OCx pin is driven to a low state. The OCxIF bit will be set as a result of the second compare. Continuous pulses OCxRS > PRy and PRy >= OCxR None Only one transition will be generated at the OCx pin until the OCxRS register contents have been changed to a value less than or equal to the period register contents (PRy). OCxIF is not set until then. Rising edge/ transition to high OCxR = OCxRS = PRy = 0x0000 None Continuous output pulses are generated at the OCx pin. The first pulse is delayed 2 instruction clock periods upon the match of the timer and period register. The OCxIF bit will be set as a result of the second compare. First pulse is delayed. Continuous pulses are generated. OCxR > PRy None Unsupported mode, Timer resets prior to match condition. Remains low Note 1: In all the cases considered herein, the TMRy register is assumed to be initialized to 0x0000. 2: OCxR = Compare Register, OCxRS = Secondary Compare Register, TMRy = Timery Count, PRy = Timery Period Register. dsPIC30F Family Reference Manual DS70061C-page 14-18 © 2004 Microchip Technology Inc. 14.3.3 Pulse Width Modulation Mode When control bits OCM<2:0> (OCxCON<2:0>) are set to ‘110’ or ‘111’, the selected output compare channel is configured for the PWM (Pulse Width Modulation) mode of operation. The following two PWM modes are available: • PWM without Fault Protection Input • PWM with Fault Protection Input The OCFA or OCFB Fault input pin is utilized for the second PWM mode. In this mode, an asynchronous logic level ‘0’ on the OCFx pin will cause the selected PWM channel to be shutdown. (Described in Section 14.3.3.1, “PWM with Fault Protection Input Pin”.) In PWM mode, the OCxR register is a read only slave duty cycle register and OCxRS is a buffer register that is written by the user to update the PWM duty cycle. On every timer to period register match event (end of PWM period), the duty cycle register, OCxR, is loaded with the contents of OCxRS. The TyIF interrupt flag is asserted at each PWM period boundary. The following steps should be taken when configuring the output compare module for PWM operation: 1. Set the PWM period by writing to the selected timer period register (PRy). 2. Set the PWM duty cycle by writing to the OCxRS register. 3. Write the OxCR register with the initial duty cycle. 4. Enable interrupts, if required, for the timer and output compare modules. The output compare interrupt is required for PWM Fault pin utilization. 5. Configure the output compare module for one of two PWM Operation modes by writing to the Output Compare mode bits OCM<2:0> (OCxCON<2:0>). 6. Set the TMRy prescale value and enable the time base by setting TON (TxCON<15>) = 1. An example PWM output waveform is shown in Figure 14-10. Figure 14-10: PWM Output Waveform Note: The OCxR register should be initialized before the Output Compare module is first enabled. The OCxR register becomes a read only duty cycle register when the module is operated in the PWM modes. The value held in OCxR will become the PWM duty cycle for the first PWM period. The contents of the duty cycle buffer register, OCxRS, will not be transferred into OCxR until a time base period match occurs. Period = (PRy + 1) Duty Cycle = (OCxRS ) Timery is cleared and new duty cycle value is loaded from OCxRS into OCxR. Timer value equals value in the OCxR register, OCx Pin is driven low. Timer overflow, value from OCxRS is loaded into OCxR, OCx pin driven high. 1 2 3 2 3 1 TyIF interrupt flag is asserted. © 2004 Microchip Technology Inc. DS70061C-page 14-19 Section 14. Output Compare O utp ut Compare 14 14.3.3.1 PWM with Fault Protection Input Pin When the Output Compare mode bits, OCM<2:0> (OCxCON<2:0>), are set to ‘111’, the selected output compare channel is configured for the PWM mode of operation. All functions described in Section 14.3.3, “Pulse Width Modulation Mode” apply, with the addition of input Fault protection. Fault protection is provided via the OCFA and OCFB pins. The OCFA pin is associated with the output compare channels 1 through 4, while the OCFB pin is associated with the output compare channels 5 through 8. If a logic ‘0’ is detected on the OCFA/OCFB pin, the selected PWM output pin(s) are placed in the high impedance state. The user may elect to provide a pull-down or pull-up resistor on the PWM pin to provide for a desired state if a Fault condition occurs. The shutdown of the PWM output is immediate and is not tied to the device clock source. This state will remain until: • The external Fault condition has been removed and • The PWM mode is re-enabled by writing to the appropriate mode bits, OCM<2:0> (OCxCON<2:0>). As a result of the Fault condition, the respective interrupt flag, OCxIF bit, is asserted and an interrupt will be generated, if enabled. Upon detection of the Fault condition, the OCFLT bit (OCx-CON<4>) is asserted high (logic ‘1’). This bit is a read only bit and will only be cleared once the external Fault condition has been removed and the PWM mode is re-enabled, by writing to the appropriate mode bits, OCM<2:0> (OCxCON<2:0>). 14.3.3.2 PWM Period The PWM period is specified by writing to PRy, the Timery period register. The PWM period can be calculated using the following formula: Equation 14-1: Calculating the PWM Period Note: The external Fault pins, if enabled for use, will continue to control the OCx output pins, while the device is in Sleep or Idle mode. PWM Period = [(PRy) + 1] • TCY • (TMRy Prescale Value) PWM Frequency = 1/[PWM Period] Note: A PRy value of N will produce a PWM period of N + 1 time base count cycles. For example: a value of 7 written into the PRy register will yield a period consisting of 8 time base cycles. dsPIC30F Family Reference Manual DS70061C-page 14-20 © 2004 Microchip Technology Inc. 14.3.3.3 PWM Duty Cycle The PWM duty cycle is specified by writing to the OCxRS register. The OCxRS register can be written to at any time, but the duty cycle value is not latched into OCxR until a match between PRy and TMRy occurs (i.e., the period is complete). This provides a double buffer for the PWM duty cycle and is essential for glitchless PWM operation. In the PWM mode, OCxR is a read only register. Some important boundary parameters of the PWM duty cycle include: • If the duty cycle register, OCxR, is loaded with 0x0000, the OCx pin will remain low (0% duty cycle). • If OCxR is greater than PRy (timer period register), the pin will remain high (100% duty cycle). • If OCxR is equal to PRy, the OCx pin will be low for one time base count value and high for all other count values. See Figure 14-11 for PWM mode timing details. Table 14-3 and Table 14-4 show example PWM frequencies and resolutions for a device operating at 10 and 30 MIPs, respectively. Equation 14-2: Calculation for Maximum PWM Resolution Example 14-5: PWM Period and Duty Cycle Calculation ( ) Maximum PWM Resolution (bits) = FOSC FPWM log10 log10(2) bits Desired PWM frequency is 52.08 kHz, FOSC = 10 MHz with x4 PLL (40 MHz device clock rate) (TCY = 4/FOSC)) Timer 2 prescale setting: 1:1 1/52.08 kHz = (PR2+1) • TCY • (Timer 2 prescale value) 19.20 μs = (PR2+1) • 0.1 μs • (1) PR2 = 191 Find the maximum resolution of the duty cycle that can be used with a 48 kHz frequency and a 40 MHz device clock rate. 1/52.08 kHz = 2PWM RESOLUTION • 1/40 MHz • 1 19.20 μs =2PWM RESOLUTION • 25 ns • 1 768 = 2PWM RESOLUTION log10(768) = (PWM Resolution) • log10(2) PWM Resolution= 9.5 bits © 2004 Microchip Technology Inc. DS70061C-page 14-21 Section 14. Output Compare O utp ut Compare 14 Figure 14-11: PWM Output Timing Table 14-3: Example PWM Frequencies and Resolutions at 10 MIPs (FOSC = 40 MHz) Table 14-4: Example PWM Frequencies and Resolutions at 30 MIPs (FOSC = 120 MHz) PWM Frequency 19 Hz 153 Hz 305 Hz 2.44 kHz 9.77 kHz 78.1 kHz 313 kHz Timer Prescaler Ratio 8 1 1 1 1 1 1 Period Register Value 0xFFFF 0xFFFF 0x7FFF 0x0FFF 0x03FF 0x007F 0x001F Resolution (bits) 16 16 15 12 10 7 5 PWM Frequency 57 Hz 458 Hz 916 Hz 7.32 kHz 29.3 kHz 234 kHz 938 kHz Timer Prescaler Ratio 8 1 1 1 1 1 1 Period Register Value 0xFFFF 0xFFFF 0x7FFF 0x0FFF 0x03FF 0x007F 0x001F Resolution (bits) 16 16 15 12 10 7 5 TMR3 0005 0000 0001 0002 0003 0001 0002 1 Instruction Clock Period 0005 0002 PR3 OCxR 0005 OCx pin OCxRS 0002 0004 0000 0003 0004 0005 0001 New Value Written to OCxRS 0001 New Duty Cycle Loaded Here Note 1: An ‘x’ represents the output compare channel number. A ‘y’ represents the time base number. 2: OCxR = Compare Register, OCxRS = Secondary Compare Register. TyIF is Set OCxR = OCxRS TyIF is Set OCxR = OCxRS dsPIC30F Family Reference Manual DS70061C-page 14-22 © 2004 Microchip Technology Inc. Example 14-6 shows configuration and interrupt service code for the PWM mode of operation. Example 14-6: PWM Mode Pulse Setup and Interrupt Servicing ; The following code example will set the Output Compare 1 module ; for PWM mode w/o FAULT pin enabled, a 50% duty cycle and a ; PWM frequency of 52.08 kHz at Fosc = 40 MHz. Timer2 is selected as ; the clock for the PWM time base and Timer2 interrupts ; are enabled. CLR OC1CON ; Turn off Output Compare 1 Module. MOV #0x0060, w0 ; Initialize Duty Cycle to 0x0060 MOV w0, OC1RS ; Write duty cycle buffer register MOV w0, OC1R ; Write OC1R to initial duty cycle value MOV #0x0006, w0 ; Load the working register with the new MOV w0, OC1CON ; compare mode and write to OC1CON MOV #0x00BF w0 ; Initialize PR2 with 0x00BF MOV w0, PR2 ; BSET IPC0, #T2IP0 ; Setup Timer 2 interrupt for BCLR IPC0, #T2IP1 ; desired priority level BCLR IPC0, #T2IP2 ; (this example assigns level 1 priority) BCLR IFS0, #T21IF ; Clear Timer 2 interrupt flag BSET IEC0, #T21IE ; Enable Timer 2 interrupts BSET T2CON, #TON ; Start Timer2 with assumed settings ; Example code for Timer 2 ISR: __T2Interrupt: BCLR IFS0, #T21IF ; Reset respective interrupt flag ; Remaining user code here RETFIE ; Return from ISR © 2004 Microchip Technology Inc. DS70061C-page 14-23 Section 14. Output Compare O utp ut Compare 14 14.4 Output Compare Operation in Power Saving States 14.4.1 Output Compare Operation in Sleep Mode When the device enters Sleep mode, the system clock is disabled. During Sleep, the output compare channel will drive the pin to the same active state as driven prior to entering Sleep. The module will then halt at this state. For example, if the pin was high and the CPU entered the Sleep state, the pin will stay high. Likewise, if the pin was low and the CPU entered the Sleep state, the pin will stay low. In both cases when the part wakes up, the output compare module will resume operation. 14.4.2 Output Compare Operation in Idle Mode When the device enters Idle mode, the system clock sources remain functional and the CPU stops executing code. The OCSIDL bit (OCxCON<13>) selects if the capture module will stop in Idle mode or continue operation in Idle mode. • If OCSIDL = 1, the module will discontinue operation in Idle mode. The module will perform the same procedures when stopped in Idle mode (OCxSIDL = 1) as it does for Sleep mode. • If OCSIDL = 0, the module will continue operation in Idle only if the selected time base is set to operate in Idle mode. The output compare channel(s) will operate during the CPU Idle mode if the OCSIDL bit is a logic ‘0’. Furthermore, the time base must be enabled with the respective TxSIDL bit set to a logic ‘0’. 14.5 I/O Pin Control When the output compare module is enabled, the I/O pin direction is controlled by the compare module. The compare module returns the I/O pin control back to the appropriate pin LAT and TRIS control bits when it is disabled. When the PWM with Fault Protection Input mode is enabled, the OCFx Fault pin must be configured for an input by setting the respective TRIS SFR bit. Enabling this special PWM mode does not configure the OCFx Fault pin as an input. Table 14-5: Pins Associated with Output Compare Modules 1- 8 Note: The external Fault pins, if enabled for use, will continue to control the associated OCx output pins while the device is in Sleep or Idle mode. Pin Name Pin Type Buffer Type Description OC1 O — Output Compare/PWM Channel 1 OC2 O — Output Compare/PWM Channel 2 OC3 O — Output Compare/PWM Channel 3 OC4 O — Output Compare/PWM Channel 4 OC5 O — Output Compare/PWM Channel 5 OC6 O — Output Compare/PWM Channel 6 OC7 O — Output Compare/PWM Channel 7 OC8 O — Output Compare/PWM Channel 8 OCFA I ST PWM Fault Protection A Input (For Channels 1-4) OCFB I ST PWM Fault Protection B Input (For Channels 5 -8) Legend: ST = Schmitt Trigger input with CMOS levels, I = Input, O = Output dsPIC30F Family Reference Manual DS70061C-page 14-24 © 2004 Microchip Technology Inc. Table 14-6: Example Register Map Associated with Output Compare Module SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TMR2 0106 Timer2 Register 0000 0000 0000 0000 TMR3 010A Timer3 Register 0000 0000 0000 0000 PR2 010C Period Register 2 1111 1111 1111 1111 PR3 010E Period Register 3 1111 1111 1111 1111 T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 0000 0000 0000 T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000 OC1RS 0180 Output Compare 1 Secondary Register uuuu uuuu uuuu uuuu OC1R 0182 Output Compare 1 Register uuuu uuuu uuuu uuuu OC1CON 0184 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC2RS 0186 Output Compare 2 Secondary Register uuuu uuuu uuuu uuuu OC2R 0188 Output Compare 2 Register uuuu uuuu uuuu uuuu OC2CON 018A — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC3RS 018C Output Compare 3 Secondary Register uuuu uuuu uuuu uuuu OC3R 018E Output Compare 3 Register uuuu uuuu uuuu uuuu OC3CON 0190 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC4RS 0192 Output Compare 4 Secondary Register uuuu uuuu uuuu uuuu OC4R 0194 Output Compare 4 Register uuuu uuuu uuuu uuuu OC4CON 0196 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC5RS 0198 Output Compare 5 Secondary Register uuuu uuuu uuuu uuuu OC5R 019A Output Compare 5 Register uuuu uuuu uuuu uuuu OC5CON 019C — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC6RS 019E Output Compare 6 Secondary Register uuuu uuuu uuuu uuuu OC6R 01A0 Output Compare 6 Register uuuu uuuu uuuu uuuu OC6CON 01A2 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC7RS 01A4 Output Compare 7 Secondary Register uuuu uuuu uuuu uuuu OC7R 01A6 Output Compare 7 Register uuuu uuuu uuuu uuuu OC7CON 01A8 — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 OC8RS 01AA Output Compare 8 Secondary Register uuuu uuuu uuuu uuuu OC8R 01AC Output Compare 8 Register uuuu uuuu uuuu uuuu OC8CON 01AE — — OCSIDL — — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000 IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0 0000 0000 0000 0000 Legend: u = uninitialized Note: The register map will depend on the number of output compare modules on the device. Please refer to the device data sheet for details. Section 14. Output Compare Output Compare 14 © 2004 Microchip Technology Inc. DS70061C-page 14-25 IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000 IFS2 0088 — — — FLTBIF FLTAIF LVDIF DCIIF QEIIF PWMIF C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000 IEC2 0090 — — — FLTBIE FLTAIE LVDIE DCIIE QEIIE PWMIE C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000 IPC0 0094 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100 IPC1 0096 — T3IP<2:0> — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> 0100 0100 0100 0100 IPC4 009C — OC3IP<2:0> — IC8IP<2:0> — IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100 IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> — OC4IP<2:0> 0100 0100 0100 0100 IPC8 00A4 — OC8IP<2:0> — OC7IP<2:0> — OC6IP<2:0> — OC5IP<2:0> 0100 0100 0100 0100 Table 14-6: Example Register Map Associated with Output Compare Module (Continued) SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State Legend: u = uninitialized Note: The register map will depend on the number of output compare modules on the device. Please refer to the device data sheet for details. dsPIC30F Family Reference Manual DS70061C-page 14-26 © 2004 Microchip Technology Inc. 14.6 Design Tips Question 1: The Output Compare pin stops functioning even when the OCSIDL bit is not set. Why? Answer: This is most likely to occur when the TSIDL bit (TxCON<13>) of the associated timer source is set. Therefore, it is the timer that actually goes into Idle mode when the PWRSAV instruction is executed. Question 2: Can I use the Output Compare modules with the selected time base configured for 32-bit mode? Answer: No. The T32 bit (TxCON<3>) should be cleared when the timer is used with an output compare module. © 2004 Microchip Technology Inc. DS70061C-page 14-27 Section 14. Output Compare O utp ut Compare 14 14.7 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Output Compare module are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70061C-page 14-28 © 2004 Microchip Technology Inc. 14.8 Revision History Revision A This is the initial released revision of this document. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. © 2005 Microchip Technology Inc. DS70062D-page 15-1 M oto r C o ntr ol PWM 15 Section 15. Motor Control PWM HIGHLIGHTS This section of the manual contains the following topics: 15.1 Introduction .................................................................................................................. 15-2 15.2 Control Registers ......................................................................................................... 15-4 15.3 PWM Time Base ........................................................................................................ 15-16 15.4 PWM Duty Cycle Comparison Units .......................................................................... 15-20 15.5 Complementary PWM Output Mode .......................................................................... 15-26 15.6 Dead Time Control..................................................................................................... 15-27 15.7 Independent PWM Output Mode ............................................................................... 15-30 15.8 PWM Output Override................................................................................................ 15-31 15.9 PWM Output and Polarity Control.............................................................................. 15-34 15.10 PWM Fault Pins ......................................................................................................... 15-34 15.11 PWM Update Lockout ................................................................................................ 15-37 15.12 PWM Special Event Trigger....................................................................................... 15-38 15.13 Operation in Device Power Saving Modes ................................................................ 15-38 15.14 Special Features for Device Emulation...................................................................... 15-39 15.15 Related Application Notes.......................................................................................... 15-42 15.16 Revision History ......................................................................................................... 15-43 dsPIC30F Family Reference Manual DS70062D-page 15-2 © 2005 Microchip Technology Inc. 15.1 Introduction The motor control PWM (MCPWM) module simplifies the task of generating multiple, synchronized pulse width modulated outputs. In particular, the following power and motion control applications are supported: • Three-Phase AC Induction Motor • Switched Reluctance (SR) Motor • Brushless DC (BLDC) Motor • Uninterruptable Power Supply (UPS) The PWM module has the following features: • Dedicated time base supports TCY/2 PWM edge resolution • Two output pins for each PWM generator • Complementary or independent operation for each output pin pair • Hardware dead time generators for complementary mode • Output pin polarity programmed by device configuration bits • Multiple output modes: - Edge aligned mode - Center aligned mode - Center aligned mode with double updates - Single event mode • Manual override register for PWM output pins • Duty cycle updates are configurable to be immediate or synchronized to the PWM • Hardware fault input pins with programmable function • Special Event Trigger for synchronizing A/D conversions • Each output pin associated with the PWM can be individually enabled 15.1.1 MCPWM Module Variants There are two versions of the MCPWM module depending on the dsPIC30F device that is selected. There is an 8-output module that is typically found on devices that have 64 or more pins. A 6-output MCPWM module is also available and is typically found on smaller devices that have less than 64 pins. A given dsPIC30F device may have more than one MCPWM module. Please refer to the specific device data sheet for further details. Table 15-1: Feature Summary: 6-Output MCPWM vs. 8-Output MCPWM The 6-output MCPWM module is useful for single or 3-phase power application, while the 8 MCPWM can support 4-phase motor applications. Table 15-1 provides a feature summary for 6- and 8-output MCPWM modules. Both modules can support multiple single phase loads. The 8-output MCPWM also provides increased flexibility in an application because it supports two fault pins and two programmable dead times. These features are discussed in greater detail in subsequent sections. A simplified block diagram of the MCPWM module is shown in Figure 15-1. Feature 6-Output MCPWM Module 8-Output MCPWM Module I/O Pins 6 8 PWM Generators 3 4 Fault Input Pins 1 2 Dead Time Generators 1 2 © 2005 Microchip Technology Inc. DS70062D-page 15-3 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Figure 15-1: MCPWM Block Diagram PWM1 duty cycle register PDC1 PWMCON1 PTPER PWMCON2 PTMR period register PTMR Comparator Comparator Channel 1 Generator and SEVTCMP Comparator Special Event Trigger for A/D converter FLTBCON OVDCON PWM enable and mode SFRs PWM manual control PWM Generator #2 PWM Generator #3 PWM Generator #1 DTCON1 Dead time control SFRs Special Event Postscaler FLTA PWM4L PWM4H PWM3L PWM3H PWM2L PWM2H PWM Generator #4 FLTB Note 1: Details of PWM Generator #2, #3 and #4 not shown for clarity. 2: Logic within dashed lines not present on 6-output MCPWM module. 16-bit data bus PWM1L PWM1H DTCON2 FLTACON Fault pin control SFRs Dead Time Override Logic Channel 2 Generator and Dead Time Override Logic Channel 3 Generator and Dead Time Override Logic Channel 4 Generator and Dead Time Override Logic PTCON PWM time base control dsPIC30F Family Reference Manual DS70062D-page 15-4 © 2005 Microchip Technology Inc. 15.2 Control Registers The following registers control the operation of the MCPWM module: • PTCON: PWM Time Base Control register • PTMR: PWM Time Base register • PTPER: PWM Time Base Period register • SEVTCMP: PWM Special Event Compare register • PWMCON1: PWM Control register #1 • PWMCON2: PWM Control register #2 • DTCON1: Dead Time Control register #1 • DTCON2: Dead Time Control register #2 • FLTACON: Fault A Control register • FLTBCON: Fault B Control register • PDC1: PWM Duty Cycle register #1 • PDC2: PWM Duty Cycle register #2 • PDC3: PWM Duty Cycle register #3 • PDC4: PWM Duty Cycle register #4 In addition, there are three device configuration bits associated with the MCPWM module to set up the initial Reset states and polarity of the I/O pins. These configuration bits are located in the FBORPOR device configuration register. Please refer to Section 24. “Device Configuration” for further details. © 2005 Microchip Technology Inc. DS70062D-page 15-5 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Register 15-1: PTCON: PWM Time Base Control Register Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 PTEN — PTSIDL — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> bit 7 bit 0 bit 15 PTEN: PWM Time Base Timer Enable bit 1 = PWM time base is ON 0 = PWM time base is OFF bit 14 Unimplemented: Read as ‘0’ bit 13 PTSIDL: PWM Time Base Stop in Idle Mode bit 1 = PWM time base halts in CPU Idle mode 0 = PWM time base runs in CPU Idle mode bit 12-8 Unimplemented: Read as ‘0’ bit 7-4 PTOPS<3:0>: PWM Time Base Output Postscale Select bits 1111 = 1:16 Postscale • • 0001 = 1:2 Postscale 0000 = 1:1 Postscale bit 3-2 PTCKPS<1:0>: PWM Time Base Input Clock Prescale Select bits 11 = PWM time base input clock period is 64 TCY (1:64 prescale) 10 = PWM time base input clock period is 16 TCY (1:16 prescale) 01 = PWM time base input clock period is 4 TCY (1:4 prescale) 00 = PWM time base input clock period is TCY (1:1 prescale) bit 1-0 PTMOD<1:0>: PWM Time Base Mode Select bits 11 = PWM time base operates in a continuous up/down mode with interrupts for double PWM updates 10 = PWM time base operates in a continuous up/down counting mode 01 = PWM time base operates in single event mode 00 = PWM time base operates in a free running mode Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70062D-page 15-6 © 2005 Microchip Technology Inc. Register 15-2: PTMR: PWM Time Base Register Register 15-3: PTPER: PWM Time Base Period Register Upper Byte: R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PTDIR PTMR <14:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PTMR <7:0> bit 7 bit 0 bit 15 PTDIR: PWM Time Base Count Direction Status bit (Read Only) 1 = PWM time base is counting down 0 = PWM time base is counting up bit 14-0 PTMR <14:0>: PWM Timebase Register Count Value Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — PTPER <14:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PTPER <7:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14-0 PTPER<14:0>: PWM Time Base Period Value bits Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70062D-page 15-7 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Register 15-4: SEVTCMP: Special Event Compare Register Register 15-5: PWMCON1: PWM Control Register 1 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SEVTDIR SEVTCMP <14:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SEVTCMP <7:0> bit 7 bit 0 bit 15 SEVTDIR: Special Event Trigger Time Base Direction bit(1) 1 = A special event trigger will occur when the PWM time base is counting downwards. 0 = A special event trigger will occur when the PWM time base is counting upwards. bit 14-0 SEVTCMP <14:0>: Special Event Compare Value bit(2) Note 1: SEVTDIR is compared with PTDIR (PTMR<15>) to generate the special event trigger. 2: SEVTCMP<14:0> is compared with PTMR<14:0> to generate the special event trigger. Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — — PMOD4 PMOD3 PMOD2 PMOD1 bit 15 bit 8 Lower Byte: R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 PEN4H PEN3H PEN2H PEN1H PEN4L PEN3L PEN2L PEN1L bit 7 bit 0 bit 15-12 Unimplemented: Read as ‘0’ bit 11-8 PMOD4:PMOD1: PWM I/O Pair Mode bits 1 = PWM I/O pin pair is in the independent output mode 0 = PWM I/O pin pair is in the complementary output mode bit 7-4 PEN4H-PEN1H: PWMxH I/O Enable bits(1) 1 = PWMxH pin is enabled for PWM output 0 = PWMxH pin disabled. I/O pin becomes general purpose I/O bit 3-0 PEN4L-PEN1L: PWMxL I/O Enable bits(1) 1 = PWMxL pin is enabled for PWM output 0 = PWMxL pin disabled. I/O pin becomes general purpose I/O Note 1: Reset condition of the PENxH and PENxL bits depend on the value of the PWM/PIN device configuration bit in the FBORPOR Device Configuration Register. Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70062D-page 15-8 © 2005 Microchip Technology Inc. Register 15-6: PWMCON2: PWM Control Register 2 Upper Byte: U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — — SEVOPS<3:0> bit 15 bit 8 Lower Byte: U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — IUE OSYNC UDIS bit 7 bit 0 bit 15-12 Unimplemented: Read as ‘0’ bit 11-8 SEVOPS<3:0>: PWM Special Event Trigger Output Postscale Select bits 1111 = 1:16 Postscale • • 0001 = 1:2 Postscale 0000 = 1:1 Postscale bit 7-2 Unimplemented: Read as ‘0’ bit 2 IUE: Immediate Update Enable bit(1) 1 = Updates to the active PDC registers are immediate 0 = Updates to the active PDC registers are synchronized to the PWM time base bit 1 OSYNC: Output Override Synchronization bit 1 = Output overrides via the OVDCON register are synchronized to the PWM time base 0 = Output overrides via the OVDCON register occur on next TCY boundary bit 0 UDIS: PWM Update Disable bit 1 = Updates from duty cycle and period buffer registers are disabled 0 = Updates from duty cycle and period buffer registers are enabled Note 1: IUE bit is not implemented on the dsPIC30F6010 device. Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70062D-page 15-9 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Register 15-7: DTCON1: Dead Time Control Register 1 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DTBPS<1:0> DTB<5:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DTAPS<1:0> DTA<5:0> bit 7 bit 0 bit 15-14 DTBPS<1:0>: Dead Time Unit B Prescale Select bits 11 = Clock period for Dead Time Unit B is 8 TCY 10 = Clock period for Dead Time Unit B is 4 TCY 01 = Clock period for Dead Time Unit B is 2 TCY 00 = Clock period for Dead Time Unit B is TCY bit 13-8 DTB<5:0>: Unsigned 6-bit Dead Time Value bits for Dead Time Unit B bit 7-6 DTAPS<1:0>: Dead Time Unit A Prescale Select bits 11 = Clock period for Dead Time Unit A is 8 TCY 10 = Clock period for Dead Time Unit A is 4 TCY 01 = Clock period for Dead Time Unit A is 2 TCY 00 = Clock period for Dead Time Unit A is TCY bit 5-0 DTA<5:0>: Unsigned 6-bit Dead Time Value bits for Dead Time Unit A Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70062D-page 15-10 © 2005 Microchip Technology Inc. Register 15-8: DTCON2: Dead Time Control Register 2 Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DTS4A DTS4I DTS3A DTS3I DTS2A DTS2I DTS1A DTS1I bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7 DTS4A: Dead Time Select bit for PWM4 Signal Going Active 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A bit 6 DTS4I: Dead Time Select bit for PWM4 Signal Going Inactive 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A bit 5 DTS3A: Dead Time Select bit for PWM3 Signal Going Active 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A bit 4 DTS3I: Dead Time Select bit for PWM3 Signal Going Inactive 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A bit 3 DTS2A: Dead Time Select bit for PWM2 Signal Going Active 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A bit 2 DTS2I: Dead Time Select bit for PWM2 Signal Going Inactive 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A bit 1 DTS1A: Dead Time Select bit for PWM1 Signal Going Active 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A bit 0 DTS1I: Dead Time Select bit for PWM1 Signal Going Inactive 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70062D-page 15-11 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Register 15-9: FLTACON: Fault A Control Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 FAOV4H FAOV4L FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L bit 15 bit 8 Lower Byte: R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 FLTAM — — — FAEN4 FAEN3 FAEN2 FAEN1 bit 7 bit 0 bit 15-8 FAOV4H-FAOV1L: Fault Input A PWM Override Value bits 1 = The PWM output pin is driven ACTIVE on an external fault input event 0 = The PWM output pin is driven INACTIVE on an external fault input event bit 7 FLTAM: Fault A Mode bit 1 = The Fault A input pin functions in the cycle-by-cycle mode 0 = The Fault A input pin latches all control pins to the programmed states in FLTACON<15:8> bit 6-4 Unimplemented: Read as ‘0’ bit 3 FAEN4: Fault Input A Enable bit 1 = PWM4H/PWM4L pin pair is controlled by Fault Input A 0 = PWM4H/PWM4L pin pair is not controlled by Fault Input A bit 2 FAEN3: Fault Input A Enable bit 1 = PWM3H/PWM3L pin pair is controlled by Fault Input A 0 = PWM3H/PWM3L pin pair is not controlled by Fault Input A bit 1 FAEN2: Fault Input A Enable bit 1 = PWM2H/PWM2L pin pair is controlled by Fault Input A 0 = PWM2H/PWM2L pin pair is not controlled by Fault Input A bit 0 FAEN1: Fault Input A Enable bit 1 = PWM1H/PWM1L pin pair is controlled by Fault Input A 0 = PWM1H/PWM1L pin pair is not controlled by Fault Input A Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70062D-page 15-12 © 2005 Microchip Technology Inc. Register 15-10: FLTBCON: Fault B Control Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 FBOV4H FBOV4L FBOV3H FBOV3L FBOV2H FBOV2L FBOV1H FBOV1L bit 15 bit 8 Lower Byte: R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 FLTBM — — — FBEN4 FBEN3 FBEN2 FBEN1 bit 7 bit 0 bit 15-8 FBOV4H:FBOV1L: Fault Input B PWM Override Value bits 1 = The PWM output pin is driven ACTIVE on an external fault input event 0 = The PWM output pin is driven INACTIVE on an external fault input event bit 7 FLTBM: Fault B Mode bit 1 = The Fault B input pin functions in the cycle-by-cycle mode 0 = The Fault B input pin latches all control pins to the programmed states in FLTBCON<15:8> bit 6-4 Unimplemented: Read as ‘0’ bit 3 FAEN4: Fault Input B Enable bit(1) 1 = PWM4H/PWM4L pin pair is controlled by Fault Input B 0 = PWM4H/PWM4L pin pair is not controlled by Fault Input B bit 2 FAEN3: Fault Input B Enable bit(1) 1 = PWM3H/PWM3L pin pair is controlled by Fault Input B 0 = PWM3H/PWM3L pin pair is not controlled by Fault Input B bit 1 FAEN2: Fault Input B Enable bit(1) 1 = PWM2H/PWM2L pin pair is controlled by Fault Input B 0 = PWM2H/PWM2L pin pair is not controlled by Fault Input B bit 0 FAEN1: Fault Input B Enable bit(1) 1 = PWM1H/PWM1L pin pair is controlled by Fault Input B 0 = PWM1H/PWM1L pin pair is not controlled by Fault Input B Note 1: Fault pin A has priority over Fault pin B, if enabled. Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70062D-page 15-13 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Register 15-11: OVDCON: Override Control Register Register 15-12: PDC1: PWM Duty Cycle Register 1 Upper Byte: R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 POVD4H POVD4L POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 POUT4H POUT4L POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L bit 7 bit 0 bit 15-8 POVD4H-POVD1L: PWM Output Override bits 1 = Output on PWMxx I/O pin is controlled by the PWM generator 0 = Output on PWMxx I/O pin is controlled by the value in the corresponding POUTxx bit bit 7-0 POUT4H-POUT1L: PWM Manual Output bits 1 = PWMxx I/O pin is driven ACTIVE when the corresponding POVDxx bit is cleared 0 = PWMxx I/O pin is driven INACTIVE when the corresponding POVDxx bit is cleared Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #1 bits 15-8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #1 bits 7-0 bit 7 bit 0 bit 15-0 PDC1<15:0>: PWM Duty Cycle #1 Value bits Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70062D-page 15-14 © 2005 Microchip Technology Inc. Register 15-13: PDC2: PWM Duty Cycle Register 2 Register 15-14: PDC3: PWM Duty Cycle Register 3 Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #2 bits 15-8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #2 bits 7-0 bit 7 bit 0 bit 15-0 PDC2<15:0>: PWM Duty Cycle #2 Value bits Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #3 bits 15-8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #3 bits 7-0 bit 7 bit 0 bit 15-0 PDC3<15:0>: PWM Duty Cycle #3 Value bits Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70062D-page 15-15 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Register 15-15: PDC4: PWM Duty Cycle Register 4 Register 15-16: FBORPOR: BOR AND POR Device Configuration Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #4 bits 15-8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PWM Duty Cycle #4 bits 7-0 bit 7 bit 0 bit 15-0 PDC4<15:0>: PWM Duty Cycle #4 Value bits Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 23 bit 16 Middle Byte: U-0 U-0 U-0 U-0 U-0 R/P R/P R/P — — — — — PWMPIN HPOL LPOL bit 15 bit 8 Lower Byte: R/P U-0 R/P R/P U-0 U-0 R/P R/P BOREN — BORV<1:0> — — FPWRT<1:0> bit 7 bit 0 bit 10 PWMPIN: MPWM Drivers Initialization bit 1 = Pin state at reset controlled by I/O Port (PWMCON1<7:0> = 0x00) 0 = Pin state at reset controlled by module (PWMCON1<7:0> = 0xFF) bit 9 HPOL: MCPWM High Side Drivers (PWMxH) Polarity bit 1 = Output signal on PWMxH pins has active high polarity 0 = Output signal on PWMxH pins has active low polarity bit 8 LPOL: MCPWM Low Side Drivers (PWMxL) Polarity bit 1 = Output signal on PWMxL pins has active high polarity 0 = Output signal on PWMxL pins has active low polarity Note: See Section 24. “Device Configuration” for information about other configuration bits on this register. Legend: R = Readable bit W = Writable bit U = Unimplemented, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown P = Programmable configuration bit dsPIC30F Family Reference Manual DS70062D-page 15-16 © 2005 Microchip Technology Inc. 15.3 PWM Time Base The PWM time base is provided by a 15-bit timer with a prescaler and postscaler (see Figure 15-2). The 15 bits of the time base are accessible via the PTMR register. PTMR<15> is a read-only status bit, PTDIR, that indicates the present count direction of the PWM time base. If the PTDIR status bit is cleared, PTMR is counting upwards. If PTDIR is set, PTMR is counting downwards. The time base is enabled/disabled by setting/clearing the PTEN bit (PTCON<15>). PTMR is not cleared when the PTEN bit is cleared in software. Figure 15-2: PWM Time Base Block Diagram The PWM time base can be configured for four different modes of operation: 1. Free Running mode 2. Single Event mode 3. Continuous Up/Down Count mode 4. Continuous Up/Down Count mode with interrupts for double-updates. PTMR Register Time Base period register Comparator PTPER Zero detect Zero match Period match PTMOD1 Up/Down Timer reset TCY Prescaler 1:1, 1:4, 1:16, 1:64 Timer Direction Control Clock Control Period load Duty Cycle PTMOD1 Period match Zero match PTMR clock Interrupt Control PTMOD1 Period match Zero match PTMOD0 Postscaler 1:1-1:16 PTMOD0 PTEN PTIF Update disable (UDIS) PTDIR (PTMR<15>) Gated Gated Period load Load Update Immediate Enable (IUE) © 2005 Microchip Technology Inc. DS70062D-page 15-17 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 These four modes are selected by the PTMOD<1:0> control bits (PTCON<1:0>). 15.3.1 Free Running Mode In the Free Running mode, the time base will count upwards until the value in the PTPER register is matched. The PTMR register is reset on the following input clock edge and the time base will continue counting upwards as long as the PTEN bit remains set. 15.3.2 Single-Event Mode In the Single Event Counting mode, the PWM time base will begin counting upwards when the PTEN bit is set. When the PTMR value matches the PTPER register, the PTMR register will be reset on the following input clock edge and the PTEN bit will be cleared by the hardware to halt the time base. 15.3.3 Up/Down Counting Modes For the Continuous Up/Down Counting modes, the PWM time base will count upwards until the value in the PTPER register is matched. The timer will begin counting downwards on the following input clock edge and continue counting down until it reaches ‘0’. The PTDIR bit PTMR<15> is read-only and indicates the counting direction. The PTDIR bit is set when the timer counts downwards. 15.3.4 PWM Time Base Prescaler The input clock to PTMR, (TCY) has prescaler options of 1:1, 1:4, 1:16 or 1:64 selected by control bits PTCKPS<1:0> (PTCON<3:2>). The prescaler counter is cleared when any of the following occurs: • A write to the PTMR register • A write to the PTCON register • Any device reset The PTMR register is not cleared when PTCON is written. 15.3.5 PWM Time Base Postscaler The match output of PTMR can optionally be post-scaled through a 4-bit postscaler (which gives a 1:1 to 1:16 scaling inclusive) to generate an interrupt. The postscaler is useful when the PWM duty cycle does not need to be updated every PWM cycle. The postscaler counter is cleared when any of the following occurs: • A write to the PTMR register • A write to the PTCON register • Any device reset The PTMR register is not cleared when PTCON is written. Note: The mode of the PWM time base determines the type of PWM signal that is generated by the module. (See Section 15.4.2, Section 15.4.3 and Section 15.4.4 for more details.) dsPIC30F Family Reference Manual DS70062D-page 15-18 © 2005 Microchip Technology Inc. 15.3.6 PWM Time Base Interrupts The interrupt signals generated by the PWM time base depend on the mode selection bits, PTMOD<1:0> (PTCON<1:0>), and the time base postscaler bits, PTOPS<3:0> (PTCON<7:4>). • Free Running Mode When the PWM time base is in the Free Running mode (PTMOD<1:0> = 00), an interrupt is generated when the PTMR register is reset to ‘0’, due to a match with the PTPER register. The postscaler selection bits may be used in this mode of the timer to reduce the frequency of the interrupt events. • Single Event Mode When the PWM time base is in the Single Event mode (PTMOD<1:0> = 01), an interrupt is generated when the PTMR register is reset to ‘0’ due to a match with the PTPER register. The PTEN bit (PTCON<15>) is also cleared at this time to inhibit further PTMR increments. The postscaler selection bits have no effect in this mode of the timer. • Up/Down Counting Mode In the Up/Down Counting mode (PTMOD<1:0> = 10), an interrupt event is generated each time the value of the PTMR register becomes zero and the PWM time base begins to count upwards. The postscaler selection bits may be used in this mode of the timer to reduce the frequency of the interrupt events. • Up/Down Counting Mode with Double Updates In the Double Update mode (PTMOD<1:0> = 11), an interrupt event is generated each time the PTMR register is equal to zero and each time a period match occurs. The postscaler selection bits have no effect in this mode of the timer. The Double Update mode allows the control loop bandwidth to be doubled because the PWM duty cycles can be updated twice per period. Every rising and falling edge of the PWM signal can be controlled using the double update mode. 15.3.7 PWM Period The PTPER register sets the counting period for PTMR. The user must write a 15-bit value to PTPER<14:0>. When the value in PTMR<14:0> matches the value in PTPER<14:0>, the time base will either reset to ‘0’ or reverse the count direction on the next clock input edge. The action taken depends on the operating mode of the time base. The time base period is double buffered to allow on-the-fly period changes of the PWM signal without glitches. The PTPER register serves as a buffer register to the actual time base period register, which is not accessible by the user. The PTPER register contents are loaded into the actual time base period register at the following times: • Free Running and Single Event modes: when the PTMR register is reset to zero after a match with the PTPER register. • Up/Down Counting modes: When the PTMR register is zero. The value held in the PTPER register is automatically loaded into the time base period register when the PWM time base is disabled (PTEN = 0). Figure 15-3 and Figure 15-4 indicate the times when the contents of the PTPER register are loaded into the time base period register. © 2005 Microchip Technology Inc. DS70062D-page 15-19 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Figure 15-3: PWM Period Buffer Updates in Free Running Count Mode The PWM period can be determined from the following formula: Equation 15-1: PWM Period Calculation for Free Running Count Mode (PTMOD = 10 or 11) Figure 15-4: PWM Period Buffer Updates in Up/Down Counting Modes Old PTPER value New PTPER value Period value loaded from PTPER buffer register New value written to PTPER buffer PTMR Value PTPER = FPWM • (PTMR Prescaler) FCY - 1 FCY = 20 MHz FPWM = 20,000 Hz PTMR Prescaler = 1:1 PTPER = 20,000 • 1 20,000,000 - 1 = 1000 -1 = 999 Example: Old PTPER value New PTPER value New value written to PTPER buffer PTMR Value Period value loaded from PTPER Buffer register dsPIC30F Family Reference Manual DS70062D-page 15-20 © 2005 Microchip Technology Inc. Equation 15-2: PWM Period Calculation in Up/Down Counting Modes (PTMOD = 00 or 01) 15.4 PWM Duty Cycle Comparison Units The MCPWM module has four PWM generators. There are four 16-bit special function registers used to specify duty cycle values for the PWM generators: • PDC1 • PDC2 • PDC3 • PDC4 In subsequent discussions, PDCx refers to any of the four PWM duty cycle registers. 15.4.1 PWM Duty Cycle Resolution The maximum resolution (in bits) for a given device oscillator and PWM frequency can be determined from the following formula: Equation 15-3: PWM Resolution The PWM resolutions and frequencies are shown in Table 15-2 for a selection of execution speeds and PTPER values. The PWM frequencies in Table 15-2 are for edge-aligned (Free Running PTMR) PWM mode. For center aligned modes (Up/Down PTMR mode), the PWM frequencies will be 1/2 the values as indicated in Table 15-3. PTPER = FPWM • (PTMR Prescaler) • 2 FCY - 1 FCY = 20 MHz FPWM = 20,000 Hz PTMR Prescaler = 1:1 PTPER = 20,000 • 1 • 2 20,000,000 - 1 = 500 -1 = 499 Example: Table 15-2: Example PWM Frequencies and Resolutions, 1:1 Prescaler, Edge Aligned PWM TCY (FCY) PTPER Value PDCx Value for 100% PWM Resolution PWM Frequency 33 ns (30 MHz) 0x7FFF 0xFFFF 16 bits 915 Hz 33 ns (30 MHz) 0x3FF 0x7FF 11 bits 29.3 kHz 50 ns (20 MHz) 0x7FFF 0xFFFF 16 bits 610 Hz 50 ns (20 MHz) 0x1FF 0x3FF 10 bits 39.1 kHz 100 ns (10 MHz) 0x7FFF 0xFFFF 16 bits 305 Hz 100 ns (10 MHz) 0xFF 0x1FF 9 bits 39.1 kHz 200 ns (5 MHz) 0x7FFF 0xFFFF 16 bits 153 Hz 200 ns (5 MHz) 0x7F 0xFF 8 bits 39.1 kHz Resolution 2TPWM TCY ------------------ ⎝ ⎠ ⎛ ⎞ log log( ) 2 = -------------------------------- © 2005 Microchip Technology Inc. DS70062D-page 15-21 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 The MCPWM module has the ability to produce PWM signal edges with TCY/2 resolution. PTMR increments every TCY with a 1:1 prescaler. To achieve TCY/2 edge resolution, PDCx<15:1> is compared to PTMR<14:0> to determine a duty cycle match. PDCx<0> determines whether the PWM signal edge will occur at the TCY or the TCY/2 boundary. When a 1:4, 1:16 or a 1:64 prescaler is used with the PWM time base, PDCx<0> is compared to the MSbit of the prescaler counter clock to determine when the PWM edge should occur. PTMR and PDCx resolutions are depicted in Figure 15-5. It is shown that PTMR resolution is TCY and PDCx resolution is TCY/2 for 1:1 prescaler selection. Figure 15-5: PTMR and PDCx Resolution Timing Diagram. Free Running Mode and 1:1 Prescaler Selection Table 15-3: Example PWM Frequencies and Resolutions, 1:1 Prescaler, Center Aligned PWM TCY (FCY) PTPER Value PDCx Value for 100% PWM Resolution PWM Frequency 33 ns (30 MHz) 0x7FFF 0xFFFF 16 bits 458 Hz 33 ns (30 MHz) 0x3FFF 0x7FFF 15 bits 916 Hz 50 ns (20 MHz) 0x7FFF 0xFFFF 16 bits 305 Hz 50 ns (20 MHz) 0x1FFF 0x3FFF 14 bits 1.22 kHz 100 ns (10 MHz) 0x7FFF 0xFFFF 16 bits 153 Hz 100 ns (10 MHz) 0xFFF 0x1FFF 13 bits 1.22 kHz 200 ns (5 MHz) 0x7FFF 0xFFFF 16 bits 76.3 Hz 200 ns (5 MHz) 0x7FF 0xFFF 12 bits 1.22 kHz PTMR TCY TCY TCY/2 PDCx = 14 PDCx = 15 PTPER = 10 dsPIC30F Family Reference Manual DS70062D-page 15-22 © 2005 Microchip Technology Inc. Figure 15-6: Duty Cycle Comparison Logic 15.4.2 Edge Aligned PWM Edge aligned PWM signals are produced by the module when the PWM time base is operating in the Free Running mode. The output signal for a given PWM channel has a period specified by the value loaded in PTPER and a duty cycle specified by the appropriate PDCx register (see Figure 15-7). Assuming a non-zero duty cycle and no immediate updates are enabled (IUE = 0), the outputs of all enabled PWM generators will be driven active at the beginning of the PWM period (PTMR = 0). Each PWM output will be driven inactive when the value of PTMR matches the duty cycle value of the PWM generator. If the value in the PDCx register is zero, then the output on the corresponding PWM pin will be inactive for the entire PWM period. In addition, the output on the PWM pin will be active for the entire PWM period if the value in the PDCx register is greater than the value held in the PTPER register. If immediate updates are enabled (IUE = 1), the new duty cycle value will be loaded at the time the new value is written to any active PDC register. Figure 15-7: Edge-Aligned PWM PTMR N21 TCY 15-bit comparison PDCx Edge Logic PWM Edge Event 14 0 N-bit Prescaler 15 15 1 0 15 1-Bit Comparison Note: PDCx<0> is compared to the FOSC/2 signal when the prescaler is 1:1. Period Duty Cycle 0 PTPER New duty cycle loaded from PDCx PWM1H PWM2H PDC1 PDC2 PTMR value © 2005 Microchip Technology Inc. DS70062D-page 15-23 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 15.4.3 Single Event PWM Operation The PWM module will produce single pulse outputs when the PWM time base is configured for the single event mode (PTMOD<1:0> = 01). This mode of operation is useful for driving certain types of electronically commutated motors. In particular, this mode is useful for high-speed SR motor operation. Only edge-aligned outputs may be produced in the Single Event mode. In Single Event mode, the PWM I/O pin(s) are driven to the active state when the PTEN bit is set. When a match with a duty cycle register occurs, the PWM I/O pin is driven to the inactive state. When a match with the PTPER register occurs, the PTMR register is cleared, all active PWM I/O pins are driven to the inactive state, the PTEN bit is cleared, and an interrupt is generated. Operation of the PWM module will stop until the PTEN is set again in software. Figure 15-8: Single Event PWM Operation PDC1 PTPER PTEN bit set by software PTEN bit cleared by hardware PWMIF PWMIF cleared in software PDC2 PWM2H PWM1H PTEN dsPIC30F Family Reference Manual DS70062D-page 15-24 © 2005 Microchip Technology Inc. 15.4.4 Center Aligned PWM Center aligned PWM signals are produced by the module when the PWM time base is configured in one of the two Up/Down Counting modes (PTMOD<1:0> = 1x). The PWM compare output is driven to the active state when the value of the Duty Cycle register matches the value of PTMR and the PWM time base is counting downwards (PTDIR = 1). The PWM compare output will be driven to the inactive state when the PWM time base is counting upwards (PTDIR = 0) and the value in the PTMR register matches the duty cycle value. If the value in a particular Duty Cycle register is zero, then the output on the corresponding PWM pin will be inactive for the entire PWM period. In addition, the output on the PWM pin will be active for the entire PWM period if the value in the Duty Cycle register is greater than the value held in the PTPER register. Figure 15-9: Center Aligned PWM 15.4.5 Duty Cycle Register Buffering The four PWM duty cycle registers, PDC1-PDC4, are buffered to allow glitchless updates of the PWM outputs. For each generator, there is the PDCx register (buffer register) that is accessible by the user and the non-memory mapped Duty Cycle register that holds the actual compare value. The PWM duty cycle is updated with the value in the PDCx register at specific times in the PWM period to avoid glitches in the PWM output signal. When the PWM time base is operating in the Free Running or Single Event modes (PTMOD<1:0> = 0x), the PWM duty cycle is updated whenever a match with the PTPER register occurs and PTMR is reset to ‘0’. When the PWM time base is operating in the Up/Down Counting mode (PTMOD<1:0> = 10), duty cycles are updated when the value of the PTMR register is zero and the PWM time base begins to count upwards. Figure 15-10 indicates the times when the duty cycle updates occur for this mode of the PWM time base. When the PWM time base is in the Up/Down Counting mode with double updates (PTMOD<1:0> = 11), duty cycles are updated when the value of the PTMR register is zero and when the value of the PTMR register matches the value in the PTPER register. Figure 15-11 indicates the times when the duty cycle updates occur for this mode of the PWM time base. PTPER PTMR Value Period Period/2 0 PDC1 PDC2 PWM1H PWM2H PDCx Value Note: Any write to the PDCx registers will immediately update the duty cycle when the PWM time base is disabled (PTEN = 0). This allows a duty cycle change to take effect before PWM signal generation is enabled. © 2005 Microchip Technology Inc. DS70062D-page 15-25 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Figure 15-10: Duty Cycle Update Times in Up/Down Count Mode Figure 15-11: Duty Cycle Update Times in Up/Down Count Mode with Double Updates 15.4.6 PWM Duty Cycle Immediate Updates When the Immediate Update Enable bit is set (IUE = 1), any write to the duty cycle registers will update the new duty cycle value immediately. This feature gives the option to the user to allow immediate updates of the active PWM duty cycle registers instead of waiting for the end of the current time base period. System stability is improved in closed loop servo applications by reducing the delay between system observation and the issuance of system corrective commands when immediate updates are enabled (IUE = 1). If the PWM output is active at the time the new duty cycle is written and the new duty cycle is less than the current time base value, the PWM pulse width will be shortened. If the PWM output is active at the time the new duty cycle is written and the new duty cycle is greater than the current time base value, the PWM pulse width will be lengthened. If the PWM output is inactive at the time the new duty cycle is written and the new duty cycle is greater than the current time base value, the PWM output will become active immediately and will remain active for the new written duty cycle value. Figure 15-12 indicates the times when the duty cycle updates occur when immediate updates are enabled (IUE = 1).. PTMR Value PWM output Duty cycle value loaded from PDCx register, CPU interrupted New value written to PDCx register PTIF PTMR Value PWM output Duty cycle value loaded from PDCx register, CPU interrupted New values written to PDCx register Note: The IUE bit is not implemented on the dsPIC30F6010 device. dsPIC30F Family Reference Manual DS70062D-page 15-26 © 2005 Microchip Technology Inc. Figure 15-12: Duty Cycle Update Times When Immediate Updates Are Enabled (IUE = 1) 15.5 Complementary PWM Output Mode The Complementary Output mode is used to drive inverter loads similar to the one shown in Figure 15-13. This inverter topology is typical for ACIM and BLDC applications. In the Complementary Output mode, a pair of PWM outputs cannot be active simultaneously. Each PWM channel and output pin pair is internally configured as shown in Figure 15-14. A dead time may be optionally inserted during device switching where both outputs are inactive for a short period (Refer to Section 15.6 “Dead Time Control”). Figure 15-13: Typical Load for Complementary PWM Outputs The Complementary mode is selected for each PWM I/O pin pair by clearing the appropriate PMODx bit in PWMCON1. The PWM I/O pins are set to complementary mode by default upon a device reset. Figure 15-14: PWM Channel Block Diagram, Complementary Mode 50% 90% 10% 90% Latest Duty Cycle Value Written PWM Output PTMR Value to PDCx New Values Written to PDCx Register +V 1H 1L 3 Phase Load 2H 2L 3H 3L Dead Time Generator PWM Generator PWMxH PWMxL Override and Fault Logic © 2005 Microchip Technology Inc. DS70062D-page 15-27 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 15.6 Dead Time Control Dead time generation is automatically enabled when any of the PWM I/O pin pairs are operating in the Complementary Output mode. Because the power output devices cannot switch instantaneously, some amount of time must be provided between the turn-off event of one PWM output in a complementary pair and the turn-on event of the other transistor. The 6-output PWM module has one programmable dead time. The 8-output PWM module allows two different dead times to be programmed. These two dead times may be used in one of two methods described below to increase user flexibility: • The PWM output signals can be optimized for different turn-off times in the high-side and low-side transistors. The first dead time is inserted between the turn-off event of the lower transistor of the complementary pair and the turn-on event of the upper transistor. The second dead time is inserted between the turn-off event of the upper transistor and the turn-on event of the lower transistor. • The two dead times can be assigned to individual PWM I/O pin pairs. This operating mode allows the PWM module to drive different transistor/load combinations with each complementary PWM I/O pin pair. 15.6.1 Dead Time Generators Each complementary output pair for the PWM module has a 6-bit down counter that is used to produce the dead time insertion. As shown in Figure 15-15, each dead time unit has a rising and falling edge detector connected to the duty cycle comparison output. One of the two possible dead times is loaded into the timer on the detected PWM edge event. Depending on whether the edge is rising or falling, one of the transitions on the complementary outputs is delayed until the timer counts down to zero. A timing diagram indicating the dead time insertion for one pair of PWM outputs is shown in Figure 15-16. The use of two different dead times for the rising and falling edge events has been exaggerated in the figure for clarity. Figure 15-15: Dead Time Unit Block Diagram for One Output Pin Pair Low-Side PWM signal to output pin High-side PWM signal to output pin Zero Compare Clock Control 6-Bit Down Counter PWM TCY Dead Time A Dead Time B Dead Time Select Logic Prescaler Generator Input Note: Logic in dashed lines not present on 6-output PWM module. dsPIC30F Family Reference Manual DS70062D-page 15-28 © 2005 Microchip Technology Inc. Figure 15-16: Dead Time Insertion Diagram PWM Generator PWMxH PWMxL Time selected by DTSxA bit (A or B) Time selected by DTSxI bit (A or B) PWMxH PWMxL Dead time = 0 Non-zero dead time © 2005 Microchip Technology Inc. DS70062D-page 15-29 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 15.6.2 Dead Time Assignment The DTCON2 register contains control bits that allow the two programmable dead times to be assigned to each of the complementary outputs. There are two dead time assignment control bits for each of the complementary outputs. For example, the DTS1A and DTS1I control bits select the dead times to be used for the PWM1H/PWM1L complementary output pair. The pair of dead time selection control bits are referred to as the ‘dead-time-select-active’ and ‘dead-time-select-inactive’ control bits, respectively. The function of each bit in a pair is as follows: • The DTSxA control bit selects the dead time that is to be inserted before the high-side output is driven active. • The DTSxI control bit selects the dead time that is to be inserted before the low-side PWM active is driven active. Table 15-4 summarizes the function of each dead time selection control bit. Table 15-4: Dead Time Selection Bits 15.6.3 Dead Time Ranges Dead time A and dead time B are set by selecting an input clock prescaler value and a 6-bit unsigned dead time count value. Four input clock prescaler selections have been provided to allow a suitable range of dead times based on the device operating frequency. The clock prescaler option may be selected independently for each of the two dead time values. The dead time clock prescaler values are selected using the DTAPS<1:0> and DTBPS<1:0> control bits in the DTCON1 SFR. The following clock prescaler options may be selected for each of the dead time values: • TCY • 2 TCY • 4 TCY • 8 TCY Equation 15-4: Dead Time Calculation Note: The dead time assignment logic is only applicable to dsPIC variants that contain the 8-output PWM module. The 6-output PWM module uses dead time A only. Bit Function DTS1A Selects PWM1H/PWM1L dead time inserted before PWM1H is driven active. DTS1I Selects PWM1H/PWM1L dead time inserted before PWM1L is driven active. DTS2A Selects PWM1H/PWM1L dead time inserted before PWM2H is driven active. DTS2I Selects PWM1H/PWM1L dead time inserted before PWM2L is driven active. DTS3A Selects PWM1H/PWM1L dead time inserted before PWM3H is driven active. DTS3I Selects PWM1H/PWM1L dead time inserted before PWM3L is driven active. DTS4A Selects PWM1H/PWM1L dead time inserted before PWM4H is driven active. DTS4I Selects PWM1H/PWM1L dead time inserted before PWM4L is driven active. Dead Time Prescale Value • TCY Note: DT (Dead Time) is the DTA<5:0> or DTB<5:0> register value. DT = dsPIC30F Family Reference Manual DS70062D-page 15-30 © 2005 Microchip Technology Inc. Table 15-5 shows example dead time ranges as a function of the input clock prescaler selected and the device operating frequency. Table 15-5: Example Dead Time Ranges 15.6.4 Dead Time Distortion For small PWM duty cycles, the ratio of dead time to the active PWM time may become large. At the extreme case, when the duty cycle is less than or equal to the programmed duty cycle, no PWM pulse will be generated. In these cases, the inserted dead time will introduce distortion into waveforms produced by the PWM module. The user can ensure that dead time distortion is minimized by keeping the PWM duty cycle at least three times larger than the dead time. Dead time distortion can also be corrected by other techniques, such as closed loop current control. A similar effect occurs for duty cycles near 100%. The maximum duty cycle used in the application should be chosen such that the minimum inactive time of the PWM signal is at least three times larger than the dead time. 15.7 Independent PWM Output Mode An Independent PWM Output mode is useful for driving loads such as the one shown in Figure 15-17. A particular PWM output pair is in the Independent Output mode when the corresponding PMOD bit in the PWMCON1 register is set. The dead time generators are disabled in the Independent mode and there are no restrictions on the state of the pins for a given output pin pair. Figure 15-17: Asymmetric Inverter Figure 15-18: PWM Block Diagram for One Output Pin Pair, Independent Mode TCY (FCY) Prescaler Selection Resolution Dead Time Range 33 ns (30 MHz) 4 TCY 130 ns 130 ns -9 µs 50 ns (20 MHz) 4 TCY 200 ns 200 ns -12 µs 100 ns (10 MHz) 2 TCY 200 ns 200 ns -12 µs 100 ns (10 MHz) 1 TCY 100 ns 100 ns - 6 µs +V 1H 1L PWM Generator PWMxH PWMxL Override and Fault Logic © 2005 Microchip Technology Inc. DS70062D-page 15-31 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 15.8 PWM Output Override The PWM output override bits allow the user to manually drive the PWM I/O pins to specified logic states independent of the duty cycle comparison units. The PWM override bits are useful when controlling various types of electrically commutated motors. All control bits associated with the PWM output override function are contained in the OVDCON register. The upper half of the OVDCON register contains 8 bits, POVDxx, that determine which PWM I/O pins will be overridden. The lower half of the OVDCON register contains 8 bits, POUTxx, that determine the state of the PWM I/O pin when it is overridden via the POVDxx bit. The POVD bits are active-low control bits. When the POVD bits are set, the corresponding POUTxx bit will have no effect on the PWM output. When one of the POVD bits is cleared, the output on the corresponding PWM I/O pin will be determined by the state of the POUT bit. When a POUT bit is set, the PWM pin will be driven to its active state. When the POUT bit is cleared, the PWM pin will be driven to its inactive state. 15.8.1 Override Control for Complementary Output Mode The PWM module will not allow certain overrides when a pair of PWM I/O pins are operating in the Complementary mode. (PMODx = 0) The module will not allow both pins in the output pair to become active simultaneously. The high-side pin in each output pair will always take priority. 15.8.2 Override Synchronization If the OSYNC bit is set (PWMCON2<1>), all output overrides performed via the OVDCON register will be synchronized to the PWM time base. Synchronous output overrides will occur at the following times: • Edge aligned mode, when PTMR is zero. • Center aligned modes, when PTMR is zero, or • When the value of PTMR matches PTPER. The override synchronization function, when enabled, can be used to avoid unwanted narrow pulses on the PWM output pins. 15.8.3 Output Override Examples Figure 15-19 shows an example of a waveform that might be generated using the PWM output override feature. The Figure shows a six-step commutation sequence for a BLDC motor. The motor is driven through a 3-phase inverter as shown in Figure 15-13. When the appropriate rotor position is detected, the PWM outputs are switched to the next commutation state in the sequence. In this example, the PWM outputs are driven to specific logic states. The OVDCON register values used to generate the signals in Figure 15-19 are given in Table 15-6. The PWM duty cycle registers may be used in conjunction with the OVDCON register. The duty cycle registers controls the current delivered to the load and the OVDCON register controls the commutation. Such an example is shown in Figure 15-20. The OVDCON register values used to generate the signals in Figure 15-20 are given in Table 15-7. Note: Dead time insertion is still performed when PWM channels are overridden manually. dsPIC30F Family Reference Manual DS70062D-page 15-32 © 2005 Microchip Technology Inc. Table 15-6: PWM Output Override Example #1 Figure 15-19: PWM Output Override Example #1 Table 15-7: PWM Output Override Example #2 State OVDCON<15:8> OVDCON<7:0> 1 00000000b 00100100b 2 00000000b 00100001b 3 00000000b 00001001b 4 00000000b 00011000b 5 00000000b 00010010b 6 00000000b 00000110b State OVDCON<15:8> OVDCON<7:0> 1 11000011b 00000000b 2 11110000b 00000000b 3 00111100b 00000000b 4 00001111b 00000000b PWM3H PWM3L PWM2H PWM2L PWM1H PWM1L 12345 6 STATE Note: Switching times between states 1-6 are controlled by user software. The state switch is controlled by writing a new value to OVDCON. © 2005 Microchip Technology Inc. DS70062D-page 15-33 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Figure 15-20: PWM Output Override Example #2 PWM4H PWM4L PWM3H PWM3L PWM2H PWM2L 123 4 PWM1H PWM1L STATE Note: Switching times between states 1-4 are controlled by user software. The state switch is controlled by writing a new value to OVDCON. The PWM outputs are operated in the independent mode for this example. dsPIC30F Family Reference Manual DS70062D-page 15-34 © 2005 Microchip Technology Inc. 15.9 PWM Output and Polarity Control The PENxx control bits in PWMCON1 enable each PWM output pin for use by the module. When a pin is enabled for PWM output, the PORT and TRIS registers controlling the pin are disabled. In addition to the PENxx control bits, there are three device configuration bits in the FBORPOR device configuration register that provide PWM output pin control. • HPOL configuration bit • LPOL configuration bit • PWMPIN configuration bit These three configuration bits work in conjunction with the PWM enable bits (PENxx) located in PWMCON1. The configuration bits ensure that the PWM pins are in the correct states after a device reset occurs. 15.9.1 Output Polarity Control The polarity of the PWM I/O pins is set during device programming via the HPOL and LPOL configuration bits in the FBORPOR Device Configuration register. The HPOL configuration bit sets the output polarity for the high-side PWM outputs PWM1H-PWM4H. The LPOL configuration bit sets the output polarity for the low-side PWM outputs PWM1L-PWM 4L. If the polarity configuration bit is programmed to a ‘1’, the corresponding PWM I/O pins will have active-high output polarity. If the polarity configuration bit is programmed to a ‘0’, then the corresponding PWM pins will have active-low polarity. 15.9.2 PWM Output Pin Reset States The PWMPIN configuration bit determines the behavior of the PWM output pins on a device reset and can be used to eliminate external pull-up/pull-down resistors connected to the devices controlled by the PWM module. If the PWMPIN configuration bit is programmed to a ‘1’, the PENxx control bits will be cleared on a device reset. Consequently, all PWM outputs will be tri-stated and controlled by the corresponding PORT and TRIS registers. If the PWMPIN configuration bit is programmed to a ‘0’, the PENxx control bits will be set on a device reset. All PWM pins will be enabled for PWM output at the device reset and will be at their inactive states as defined by the HPOL and LPOL configuration bits. 15.10 PWM Fault Pins There are two Fault pins, FLTA and FLTB, associated with the PWM module. When asserted, these pins can optionally drive each of the PWM I/O pins to a defined state. This action takes place without software intervention so fault events can be managed quickly. The Fault pins may have other multiplexed functions depending on the dsPIC device variant. When used as a fault input, each Fault pin is readable via its corresponding PORT register. The FLTA and FLTB pins function as active low inputs so that it is easy to wire-OR many sources to the same input through an external pull-up resistor. When not used with the PWM module, these pins may be used as general purpose I/O or another multiplexed function. Each Fault pin has its own interrupt vector, Interrupt Flag bit, Interrupt Enable bit and Interrupt Priority bits associated with it. The function of the FLTA pin is controlled by the FLTACON register and the function of the FLTB pin is controlled by the FLTBCON register. 15.10.1 Fault Pin Enable Bits The FLTACON and FLTBCON registers each have 4 control bits, FxEN1-FxEN4, that determine whether a particular pair of PWM I/O pins is to be controlled by the fault input pin. To enable a specific PWM I/O pin pair for fault overrides, the corresponding bit should be set in the FLTACON or FLTBCON register. If all enable bits are cleared in the FLTACON or FLTBCON registers, then that fault input pin has no effect on the PWM module and no fault interrupts will be produced. © 2005 Microchip Technology Inc. DS70062D-page 15-35 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 15.10.2 Fault States The FLTACON and FLTBCON special function registers each have 8 bits that determine the state of each PWM I/O pin when the fault input pin becomes active. When these bits are cleared, the PWM I/O pin will be driven to the inactive state. If the bit is set, the PWM I/O pin will be driven to the active state. The active and inactive states are referenced to the polarity defined for each PWM I/O pin (set by HPOL and LPOL device configuration bits). A special case exists when a PWM module I/O pair is in the Complementary mode and both pins are programmed to be active on a fault condition. The high-side pin will always have priority in the Complementary mode so that both I/O pins cannot be driven active simultaneously. 15.10.3 Fault Input Modes Each of the fault input pins has two modes of operation: • Latched Mode: When the fault pin is driven low, the PWM outputs will go to the states defined in the FLTxCON register. The PWM outputs will remain in this state until the fault pin is driven high AND the corresponding interrupt flag (FLTxIF) has been cleared in software. When both of these actions have occurred, the PWM outputs will return to normal operation at the beginning of the next PWM period or half-period boundary regardless of the Immediate Update Enable bit value (IUE). If the interrupt flag is cleared before the fault condition ends, the PWM module will wait until the fault pin is no longer asserted to restore the outputs. • Cycle-by-Cycle Mode: When the fault input pin is driven low, the PWM outputs will remain in the defined fault states for as long as the fault pin is held low. After the fault pin is driven high, the PWM outputs will return to normal operation at the beginning of the following PWM period (or half-period boundary in center aligned modes) even when immediate updates are enabled. The operating mode for each fault input pin is selected using the FLTAM and FLTBM control bits (FLTACON<7> and FLTBCON<7>). 15.10.3.1 Entry Into a Fault Condition When a fault pin is enabled and driven low, the PWM pins are immediately driven to their programmed fault states regardless of the values in the PDCx and OVDCON registers. The fault action has priority over all other PWM control registers. 15.10.3.2 Exit From a Fault Condition A fault condition must be cleared by the external circuitry driving the fault input pin high and clearing the fault interrupt flag (Latched mode only). After the fault pin condition has been cleared, the PWM module will restore the PWM output signals on the next PWM period or half-period boundary. For edge aligned PWM generation, the PWM outputs will be restored when PTMR = 0. For center aligned PWM generation, the PWM outputs will be restored when PTMR = 0 or PTMR = PTPER, whichever event occurs first. An exception to these rules will occur when the PWM time base is disabled (PTEN = 0). If the PWM time base is disabled, the PWM module will restore the PWM output signals immediately after the fault condition has been cleared. dsPIC30F Family Reference Manual DS70062D-page 15-36 © 2005 Microchip Technology Inc. 15.10.4 Fault Pin Priority If both fault input pins have been assigned to control a particular pair of PWM pins, the fault states programmed for the FLTA input pin will take priority over the FLTB input pin. One of two actions will take place when the Fault A condition has been cleared. If the FLTB input is still asserted, the PWM outputs will return to the states programmed in the FLTBCON register on the next period or half-period boundary. If the FLTB input is not asserted, the PWM outputs will return to normal operation on the next period or half-period boundary. 15.10.5 Fault Pin Software Control Each of the fault pins can be controlled manually in software. Since each fault input is shared with a PORT I/O pin, the PORT pin can be configured as an output by clearing the corresponding TRIS bit. When the PORT bit for the pin is cleared, the fault input will be activated. 15.10.6 Fault Timing Examples Figure 15-21: Example Fault Timing, Cycle-by-Cycle Mode Note: When the FLTA pin is programmed for Latched mode, the PWM outputs will not return to the Fault B states or normal operation until the Fault A interrupt flag has been cleared and the FLTA pin is de-asserted. Note: The user should exercise caution when controlling the fault inputs in software. If the TRIS bit for the fault pin is cleared, then the fault input cannot be driven externally. PWM PTMR FLTA FLTA PWM Fault state Case 2: Case 1: Fault state FLTA PWM Case 3: duty cycle = 50% duty cycle = 50% duty cycle = 100% Fault state PWM Period Note: Arrows indicate the time when normal PWM operation is restored. © 2005 Microchip Technology Inc. DS70062D-page 15-37 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 Figure 15-22: Example Fault Timing, Latched Mode Figure 15-23: Example Fault Timing, Cycle-by-Cycle Mode, Priority Operation 15.11 PWM Update Lockout In some applications, it is important that all duty cycle and period registers be written before the new values take effect. The update disable feature allows the user to specify when new duty cycle and period values can be used by the module. The PWM update lockout feature is enabled by setting the UDIS control bit (PWMCON2<0>). The UDIS bit affects all duty cycle registers, PDC1-PDC4, and the PWM time base period buffer, PTPER. To perform an update lockout, the user should perform the following steps: • Set the UDIS bit. • Write all duty cycle registers and PTPER, if applicable. • Clear the UDIS bit to re-enable updates. PWMxx PTMR FLTA Fault state Duty cycle = 50% Fault condition ends Interrupt flag cleared in software Return to normal operation FLTAIF PWM PTMR FLTA Fault state B Duty cycle = 50% Return to normal operation FLTB Fault state B Fault state A Return to fault state B Note: Immediate updates must be disabled (IUE = 0) in order to use the PWM update lockout feature. dsPIC30F Family Reference Manual DS70062D-page 15-38 © 2005 Microchip Technology Inc. 15.12 PWM Special Event Trigger The PWM module has a special event trigger that allows A/D conversions to be synchronized to the PWM time base. The A/D sampling and conversion time may be programmed to occur at any point within the PWM period. The special event trigger allows the user to minimize the delay between the time when A/D conversion results are acquired and the time when the duty cycle value is updated. The PWM special event trigger has one SFR, SEVTCMP, and four postscaler control bits (SEVOPS<3:0>) to control its operation. The PTMR value for which a special event trigger should occur is loaded into the SEVTCMP register. When the PWM time base is in an Up/Down Counting mode, an additional control bit is required to specify the counting phase for the special event trigger. The count phase is selected using the SEVTDIR control bit in the MSb of SEVTCMP. If the SEVTDIR bit is cleared, the special event trigger will occur on the upward counting cycle of the PWM time base. If the SEVTDIR bit is set, the special event trigger will occur on the downward count cycle of the PWM time base. The SEVTDIR control bit has no effect unless the PWM time base is configured for an Up/Down Counting mode. 15.12.1 Special Event Trigger Enable The PWM module will always produce the special event trigger signal. This signal may optionally be used by the A/D module. Refer to Section Section 17. “10-bit A/D Converter” for more information on using the special event trigger. 15.12.2 Special Event Trigger Postscaler The PWM special event trigger has a postscaler that allows a 1:1 to 1:16 postcale ratio. The postscaler is useful when synchronized A/D conversions do not need to be performed during every PWM cycle. The postscaler is configured by writing the SEVOPS<3:0> control bits in the PWMCON2 SFR. The special event output postscaler is cleared on the following events: • Any write to the SEVTCMP register. • Any device reset. 15.13 Operation in Device Power Saving Modes 15.13.1 PWM Operation in Sleep mode When the device enters Sleep mode, the system clock is disabled. Since the clock for the PWM time base is derived from the system clock source (TCY), it will also be disabled. All enabled PWM output pins will be frozen in the output states that were in effect prior to entering Sleep. If the PWM module is used to control a load in a power application, it is the user’s responsibility to put the PWM module outputs into a ‘safe’ state prior to executing the PWRSAV instruction. Depending on the application, the load may begin to consume excessive current when the PWM outputs are frozen in a particular output state. For example, the OVDCON register can be used to manually turn off the PWM output pins as shown in the code example below. ; This code example drives all PWM pins to the inactive state ; before executing the PWRSAV instruction. CLR OVDCON ; Force all PWM outputs inactive PWRSAV #0 ; Put the device in SLEEP mode SETM.B OVDCONH ; Set POVD bits when device wakes. The Fault A and Fault B input pins, if enabled to control the PWM pins via the FLTxCON registers, will continue to function normally when the device is in Sleep mode. If one of the fault pins is driven low while the device is in Sleep, the PWM outputs will be driven to the programmed fault states in the FLTxCON register. © 2005 Microchip Technology Inc. DS70062D-page 15-39 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 The fault input pins also have the ability to wake the CPU from Sleep mode. If the fault interrupt enable bit is set (FLTxIE = 1), then the device will wake from Sleep when the fault pin is driven low. If the fault pin interrupt priority is greater than the current CPU priority, then program execution will start at the fault pin interrupt vector location upon wake-up. Otherwise, execution will continue from the next instruction following the PWRSAV instruction. 15.13.2 PWM Operation in Idle Mode When the device enters Idle mode, the system clock sources remain functional and the CPU stops executing code. The PWM module can optionally continue to operate in Idle mode.The PTSIDL bit (PTCON<13>) selects if the PWM module will stop in Idle mode or continue to operate normally. If PTSIDL = 0, the module will operate normally when the device enters Idle mode. The PWM time base interrupt, if enabled, can be used to wake the device from Idle. If the PWM time base interrupt enable bit is set (PTIE = 1), then the device will wake from Idle when the PWM time base interrupt is generated. If the PWM time base interrupt priority is greater than the current CPU priority, then program execution will start at the PWM interrupt vector location upon wake-up. Otherwise, execution will continue from the next instruction following the PWRSAV instruction. If PTSIDL = 1, the module will stop in Idle mode. If the PWM module is programmed to stop in Idle mode, the operation of the PWM outputs and fault input pins will be the same as the operation in Sleep mode. (See discussion in Section 15.13.1 “PWM Operation in Sleep mode”.) 15.14 Special Features for Device Emulation The PWM module has a special feature to support the debugging environment. All enabled PWM pins can be optionally tri-stated when the hardware emulator or debugger device is halted to examine memory contents. The user should install pull-up or pull-down resistors to ensure the PWM outputs are driven to the correct state when device execution is halted. The function of the PWM output pins at a device Reset and the output pin polarity is determined by three device configuration bits (see Section 15.9 “PWM Output and Polarity Control”). The hardware debugger or emulation tool provides a method to change the values of these configuration bits. Please refer to the tool’s user’s manual for more information. d s P I C 3 0 F F a m i l y R e f e r e n c e M a n u a l D S 7 0 0 6 2 D - p a g e 1 5 - 4 0 © 2 0 0 5 M i c r o c h i p T e c h n o l o g y I n c . Table 15-8: Registers Associated with the 8-Output PWM Module Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Reset INTCON1 0080 NSTDIS — — — — — — — — — — — — — — — 0000 0000 0000 0000 INTCON2 0082 ALTIVT — — — — — — — — — — — — — — — 0000 0000 0000 0000 IFS2 0088 — — — FLTBIF FLTAIF — — — PWMIF — — — — — — — 0000 0000 0000 0000 IEC2 0090 — — — FLTBIE FLTAIE — — — PWMIE — — — — — — — 0000 0000 0000 0000 IPC9 00A6 — PWMIP<2:0> — — — — — — — — — — — — 0100 0100 0100 0100 IPC10 00A8 — FLTAIP<2:0> — — — — — — — — — — — — 0100 0100 0100 0100 IPC11 00AA — — — — — — — — — — — — — FLTBIP<2:> 0000 0000 0000 0000 PTCON 01C0 PTEN — PTSIDL — — — — — PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> 0000 0000 0000 0000 PTMR 01C2 PTDIR PWM Time Base register 0000 0000 0000 0000 PTPER 01C4 — PWM Time Base Period register 0111 1111 1111 1111 SEVTCMP 01C6 SEVTDIR PWM Special Event Compare register 0000 0000 0000 0000 PWMCON1 01C8 — — — — PMOD4 PMOD3 PMOD2 PMOD1 PEN4H PEN3H PEN2H PEN1H PEN4L PEN3L PEN2L PEN1L 0000 0000 0000 0000 PWMCON2 01CA — — — — SEVOPS<3:0> — — — — — IUE OSYNC UDIS 0000 0000 0000 0000 DTCON1 01CC DTBPS<1:0> Dead Time B Value register DTAPS<1:0> Dead Time A Value register 0000 0000 0000 0000 DTCON2 01CE — — — — — — — — DTS4A DTS4I DTS3A DTS3I DTS2A DTS2I DTS1A DTS1I 0000 0000 0000 0000 FLTACON 01D0 FAOV4H FAOV4L FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM — — — FAEN4 FAEN3 FAEN2 FAEN1 0000 00-0 0000 0000 FLTBCON 01D2 FBOV4H FBOV4L FBOV3H FBOV3L FBOV2H FBOV2L FBOV1H FBOV1L FLTBM — — — FBEN4 FBEN3 FBEN2 FBEN1 0000 0000 0000 0000 OVDCON 01D4 POVD4H POVD4L POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L POUT4H POUT4L POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 00-0 0000 PDC1 01D6 PWM Duty Cycle #1 register 0000 0000 0000 0000 PDC2 01D8 PWM Duty Cycle #2 register 0000 0000 0000 0000 PDC3 01DA PWM Duty Cycle #3 register 0000 0000 0000 0000 PDC4 01DC PWM Duty Cycle #4 register 0000 0000 0000 0000 Note 1: Reset state of PENxx control bits depends on the state of the PWMPIN device configuration bit. 2: Shaded register and bit locations not implemented for the 6-output MCPWM module. 3: The IUE bit is not implemented on the dsPIC30F6010 device. © 2005 Microchip Technology Inc. DS70062D-page 15-41 Section 15. Motor Control PWM Motor Control PWM 15 Table 15-9: Registers Associated with the 6-Output PWM Module Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Reset INTCON1 0080 NSTDIS — — — — — — — — — — — — — — — 0000 0000 0000 0000 INTCON2 0082 ALTIVT — — — — — — — — — — — — — — — 0000 0000 0000 0000 IFS2 0088 — — — — FLATIF — — — PWMIF — — — — — — — 0000 0000 0000 0000 IEC2 0090 — — — — FLTAIE — — — PWMIE — — — — — — — 0000 0000 0000 0000 IPC9 00A6 — PWMIP<2:0> — — — — — — — — — — — — 0100 0100 0100 0100 IPC10 00A8 — FLTAIP<2:0> — — — — — — — — — — — — 0100 0100 0100 0100 PTCON 01C0 PTEN — PTSIDL — — — — — PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> 0000 0000 0000 0000 PTMR 01C2 PTDIR PWM Time Base register 0000 0000 0000 0000 PTPER 01C4 — PWM Time Base Period register 0111 1111 1111 1111 SEVTCMP 01C6 SEVTDIR PWM Special Event Compare register 0000 0000 0000 0000 PWMCON1 01C8 — — — — — PMOD3 PMOD2 PMOD1 — PEN3H PEN2H PEN1H — PEN3L PEN2L PEN1L 0000 0000 0000 0000 PWMCON2 01CA — — — — — — — — — — IUE OSYNC UDIS 0000 0000 0000 0000 DTCON1 01CC — — — — — — — — DTAPS<1:0> Dead Time A Value register 0000 0000 0000 0000 Reserved 01CE — — — — — — — — — — — — — — — — — FLTACON 01D0 — — FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM — — — FAEN4 FAEN3 FAEN2 FAEN1 0000 00-0 0000 0000 Reserved 01D2 — — — — — — — — — — — — — — — — — OVDCON 01D4 — — POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L — — POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 00-0 0000 PDC1 01D6 PWM Duty Cycle #1 register 0000 0000 0000 0000 PDC2 01D8 PWM Duty Cycle #2 register 0000 0000 0000 0000 PDC3 01DA PWM Duty Cycle #3 register 0000 0000 0000 0000 Note 1: Reset state of PENxx control bits depends on the state of the PWMPIN device configuration bit. 2: Shaded register and bit locations not implemented for the 6-output MCPWM module. 3: The IUE bit is not implemented on the dsPIC30F6010 device. dsPIC30F Family Reference Manual DS70062D-page 15-42 © 2005 Microchip Technology Inc. 15.15 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent, and could be used with modification and possible limitations. The current application notes related to the MCPWM module are: Title Application Note # PIC18CXXX/PIC16CXXX Servomotor AN696 Using the dsPIC30F for Sensorless BLDC Control AN901 Using the dsPIC30F for Vector Control of an ACIM AN908 Sensored BLDC Motor Control Using dsPIC30F2010 AN957 An Introduction to AC Induction Motor Control Using the dsPIC30F MCU AN984 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70062D-page 15-43 Section 15. Motor Control PWM M oto r C o ntr ol PWM 15 15.16 Revision History Revision A This is the initial released revision of this document. Revision B This revision provides expanded information for the dsPIC30F MCPWM module. Revision C This revision incorporates all known errata at the time of this document update. Revision D This revision includes the Immediate Update Enable Capability (IUE) bit. dsPIC30F Family Reference Manual DS70062D-page 15-44 © 2005 Microchip Technology Inc. NOTES: © 2004 Microchip Technology Inc. DS70063C-page 16-1 Q u a drature E n c o d er Interface (QEI) 16 Section 16. Quadrature Encoder Interface (QEI) HIGHLIGHTS This section of the manual contains the following major topics: 16.1 Module Introduction ..................................................................................................... 16-2 16.2 Control and Status Registers .......................................................................................16-4 16.3 Programmable Digital Noise Filters ............................................................................. 16-9 16.4 Quadrature Decoder .................................................................................................. 16-10 16.5 16-bit Up/Down Position Counter............................................................................... 16-12 16.6 Using QEI as an Alternate 16-bit Timer/Counter........................................................ 16-16 16.7 Quadrature Encoder Interface Interrupts ................................................................... 16-17 16.8 I/O Pin Control ........................................................................................................... 16-18 16.9 QEI Operation During Power Saving Modes ............................................................. 16-19 16.10 Effects of a Reset....................................................................................................... 16-19 16.11 Design Tips ................................................................................................................ 16-21 16.12 Related Application Notes.......................................................................................... 16-22 16.13 Revision History ......................................................................................................... 16-23 dsPIC30F Family Reference Manual DS70063C-page 16-2 © 2004 Microchip Technology Inc. 16.1 Module Introduction 16.1.1 Features Overview Quadrature encoders (a.k.a. Incremental encoders or Optical encoders) are used in position and speed detection of rotating motion systems. Quadrature encoders enable closed loop control of many motor control applications, such as Switched Reluctance (SR) motor and AC Induction Motor (ACIM). A typical incremental encoder includes a slotted wheel attached to the shaft of the motor and an emitter/detector module sensing the slots in the wheel. Typically, three outputs, termed: Phase A, Phase B and INDEX, provide information that can be decoded to provide information on the movement of the motor shaft including distance and direction. The two channels, Phase A (QEA) and Phase B (QEB), have a unique relationship. If Phase A leads Phase B, then the direction (of the motor) is deemed positive or forward. If Phase A lags Phase B then the direction (of the motor) is deemed negative or reverse. A third channel, termed index pulse, occurs once per revolution and is used as a reference to establish an absolute position. See Figure 16-1 for a relative timing diagram of these three signals. The quadrature signals produced by the encoder can have four unique states. These states are indicated for one count cycle in Figure 16-1. Note that the order of the states are reversed when the direction of travel is changed. A Quadrature Decoder captures the phase signals and index pulse and converts the information into a numeric count of the position pulses. Generally, the count will increment when the shaft is rotating one direction and decrement when the shaft is rotating in the other direction. Figure 16-1: Quadrature Encoder Interface Signals QEA QEB INDX QEA QEB INDX 1 Cycle 01 00 10 11 11 10 00 01 Forward Travel Reverse Travel © 2004 Microchip Technology Inc. DS70063C-page 16-3 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 The Quadrature Encoder Interface (QEI) module provides an interface to incremental encoders. The QEI consists of quadrature decoder logic to interpret the Phase A and Phase B signals and an up/down counter to accumulate the count. Digital glitch filters on the inputs condition the input signal. Figure 16-2 depicts a simplified block diagram of the QEI Module. The QEI module includes: • Three input pins for two phase signals and index pulse • Programmable digital noise filters on inputs • Quadrature decoder providing counter pulses and count direction • 16-bit up/down position counter • Count direction status • X2 and X4 count resolution • 2 modes of position counter reset • General Purpose16-bit timer/counter mode • Interrupts generated by QEI or counter events Figure 16-2: Quadrature Encoder Interface Module Simplified Block Diagram Quadrature Decoder Logic UPDN 16-Bit Up/Down QEB Counter Digital QEA Filter CLOCK DIR Clock Divider TCY INDX Digital Filter Digital Filter Comparator/ Max Count Register (MAXCNT) Reset EQUAL Zero Detect (POSCNT) dsPIC30F Family Reference Manual DS70063C-page 16-4 © 2004 Microchip Technology Inc. 16.2 Control and Status Registers The QEI module has four user-accessible registers. The registers are accessible in either byte or word mode. The registers are shown in Figure 16-3 and listed below: • Control/Status Register (QEICON) – This register allows control of the QEI operation and status flags indicating the module state. • Digital Filter Control Register (DFLTCON) – This register allows control of the digital input filter operation. • Position Count Register (POSCNT) – This location allows reading and writing of the 16-bit position counter. • Maximum Count Register (MAXCNT) – The MAXCNT register holds a value that will be compared to the POSCNT counter in some operations. Figure 16-3: QEI Programmer’s Model Register 16-1 and Register 16-3 define the QEI module control and digital filter control registers, QEICON and DFLTCON. Note: The POSCNT register allows byte accesses, however, reading the register in byte mode may result in partially updated values in subsequent reads. Either use word mode reads/writes or ensure that the counter is not counting during byte operations. Bit 15 Bit 0 POSCNT (16 bits) Bit 15 Bit 0 MAXCNT (16 bits) Bit 7 Bit 0 DFLTCON (8 bits) Bit 15 Bit 0 QEICON (16 bits) © 2004 Microchip Technology Inc. DS70063C-page 16-5 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 Register 16-1: QEICON: QEI Control Register Upper Byte: R/W-0 U-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 CNTERR — QEISIDL INDEX UPDN QEIM<2:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SWPAB PCDOUT TQGATE TQCKPS<1:0> POSRES TQCS UDSRC bit 7 bit 0 bit 15 CNTERR: Count Error Status Flag bit 1 = Position count error has occurred 0 = No position count error has occurred (CNTERR flag only applies when QEIM<2:0> = ‘110’ or ‘100’) bit 14 Unimplemented: Read as ‘0’ bit 13 QEISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 INDEX: Index Pin State Status bit (Read Only) 1 = Index pin is High 0 = Index pin is Low bit 11 UPDN: Position Counter Direction Status bit 1 = Position Counter Direction is positive (+) 0 = Position Counter Direction is negative (-) (Read only bit when QEIM<2:0> = ‘1XX’) (Read/Write bit when QEIM<2:0> = ‘001’) bit 10-8 QEIM<2:0>: Quadrature Encoder Interface Mode Select bits 111 = Quadrature Encoder Interface enabled (x4 mode) with position counter reset by match (MAXCNT) 110 = Quadrature Encoder Interface enabled (x4 mode) with Index Pulse reset of position counter 101 = Quadrature Encoder Interface enabled (x2 mode) with position counter reset by match (MAXCNT) 100 = Quadrature Encoder Interface enabled (x2 mode) with Index Pulse reset of position counter 011 = Unused (Module disabled) 010 = Unused (Module disabled) 001 = Starts 16-bit Timer 000 = Quadrature Encoder Interface/Timer off bit 7 SWPAB: Phase A and Phase B Input Swap Select bit 1 = Phase A and Phase B inputs swapped 0 = Phase A and Phase B inputs not swapped bit 6 PCDOUT: Position Counter Direction State Output Enable bit 1 = Position Counter Direction Status Output Enable (QEI logic controls state of I/O pin) 0 = Position Counter Direction Status Output Disabled (Normal I/O pin operation) bit 5 TQGATE: Timer Gated Time Accumulation Enable bit 1 = Timer gated time accumulation enabled 0 = Timer gated time accumulation disabled bit 4-3 TQCKPS<1:0>: Timer Input Clock Prescale Select bits 11 = 1:256 prescale value 10 = 1:64 prescale value 01 = 1:8 prescale value 00 = 1:1 prescale value (Prescaler utilized for 16-bit timer mode only) dsPIC30F Family Reference Manual DS70063C-page 16-6 © 2004 Microchip Technology Inc. Register 16-1: QEICON: QEI Control Register (Continued) bit 2 POSRES: Position Counter Reset Enable bit 1 = Index Pulse resets Position Counter 0 = Index Pulse does not reset Position Counter (Bit only applies when QEIM<2:0> = 100 or 110) bit 1 TQCS: Timer Clock Source Select bit 1 = External clock from pin QEA (on the rising edge) 0 = Internal clock (TCY) bit 0 UDSRC: Position Counter Direction Selection Control bit 1 = QEB pin State Defines Position Counter Direction 0 = Control/Status bit, UPDN (QEICON<11>), Defines Timer Counter (POSCNT) direction Note: When configured for QEI mode, control bit is a ‘don’t care’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70063C-page 16-7 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 Register 16-2: DFLTCON: Digital Filter Control Register (dsPIC30F6010 Only) Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 — — — — — — — CEID bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 QEOUT QECK<2:0> INDOUT INDCK<2:0> bit 7 bit 0 bit 15-9 Unimplemented: Read as ‘0’ bit 8 CEID: Count Error Interrupt Disable bit 1 = Interrupts due to position count errors disabled 0 = Interrupts due to position count errors enabled bit 7 QEOUT: QEA/QEB Digital Filter Output Enable bit 1 = Digital filter outputs enabled 0 = Digital filter outputs disabled (Normal pin operation) bit 6-4 QECK<2:0>: QEA/QEB Digital Filter Clock Divide Select bits 111 = 1:256 Clock Divide 110 = 1:128 Clock Divide 101 = 1:64 Clock Divide 100 = 1:32 Clock Divide 011 = 1:16 Clock Divide 010 = 1:4 Clock Divide 001 = 1:2 Clock Divide 000 = 1:1 Clock Divide bit 3 INDOUT: Index Channel Digital Filter Output Enable bit 1 = Digital filter output is enabled 0 = Digital filter output is disabled (Normal pin operation) bit 2-0 INDCK<2:0>: Index Channel Digital Filter Clock Divide Select bits 111 = 1:256 Clock Divide 110 = 1:128 Clock Divide 101 = 1:64 Clock Divide 100 = 1:32 Clock Divide 011 = 1:16 Clock Divide 010 = 1:4 Clock Divide 001 = 1:2 Clock Divide 000 = 1:1 Clock Divide Note: The available control bits in the DFLTCON Register may vary depending on the dsPIC30F device that is used. Refer to Register 16-2 and Register 16-3 for details. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70063C-page 16-8 © 2004 Microchip Technology Inc. Register 16-3: DFLTCON: Digital Filter Control Register (All dsPIC30F devices except dsPIC30F6010) Upper Half: U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 — — — — — IMV<1:0> CEID bit 15 bit 8 Lower Half: R/W-0 R/W-0 U-0 U-0 U-0 U-0 QEOUT QECK<2:0> — — — — bit 7 bit 0 bit 15-11 Unimplemented: Read as ‘0’ bit 10-9 IMV<1:0>: Index Match Value – These bits allow the user to specify the state of the QEA and QEB input pins during an Index pulse when the POSCNT register is to be reset. In 4X Quadrature Count Mode: IMV1= Required State of Phase B input signal for match on index pulse IMV0= Required State of Phase A input signal for match on index pulse In 2X Quadrature Count Mode: IMV1= Selects Phase input signal for Index state match (0 = Phase A, 1 = Phase B) IMV0= Required State of the selected Phase input signal for match on index pulse bit 8 CEID: Count Error Interrupt Disable 1 = Interrupts due to count errors are disabled 0 = Interrupts due to count errors are enabled bit 7 QEOUT: QEA/QEB/INDX pin Digital Filter Output Enable 1 = Digital filter outputs enabled 0 = Digital filter outputs disabled (normal pin operation) bit 6-4 QECK<2:0>: QEA/QEB/INDX Digital Filter Clock Divide Select Bits 111 = 1:256 Clock Divide 110 = 1:128 Clock Divide 101 = 1:64 Clock Divide 100 = 1:32 Clock Divide 011 = 1:16 Clock Divide 010 = 1:4 Clock Divide 001 = 1:2 Clock Divide 000 = 1:1 Clock Divide bit 3-0 Unimplemented: Read as ‘0’ Note: The available control bits in the DFLTCON Register may vary depending on the dsPIC30F device that is used. Refer to Register 16-2 and Register 16-3 for details. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown y = Value set from configuration bits on POR or BOR © 2004 Microchip Technology Inc. DS70063C-page 16-9 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.3 Programmable Digital Noise Filters The digital noise filter section is responsible for rejecting noise on the incoming index and quadrature signals. Schmitt trigger inputs and a three-clock cycle delay filter combine to reject low level noise and large, short duration noise spikes that typically occur in noise-prone applications such as a motor system applications. The filter ensures that the filtered output signals are not permitted to change until a stable value has been registered for three consecutive filter cycles. The rate of the filter clocks determines the low passband of the filter. A slower filter clock results in a passband rejecting lower frequencies than a faster filter clock. The filter clock is the device FCY clock divided by a programmable divisor. Setting the QEOUT bit (DFLTCON<7>) enables the filter for channels QEA and QEB. The QECK<2:0> bits (DFLTCON<6:4>) specify the filter clock divisor used for channels QEA and QEB. Setting the INDOUT bit (DFLTCON<3>) enables the filter for the index channel. The INDCK<2:0> bits (DFLTCON<2:0>) specify the filter clock divisor used for the index channel. At reset, the filters for all channels are disabled. Some devices do not have separate control bits for the QEx input digital filters and the INDX input digital filter. For these devices, the QEOUT and QECK<2:0> control bits set the digital filter characteristics for both the QEA/QEB and INDX pins. See Register 16-2 and Register 16-3 for more information. Figure 16-4 depicts a simplified block diagram for the digital noise filter. Figure 16-4: Simplified Digital Noise Filter Block Diagram Figure 16-5: Signal Propagation Through Filter, 1:1 Filter Clock Divide QEn D Q TCY J Q K QEn D Q D Q D Q Filtered Clock Divider Circuit TCY Non-filtered 0 1 CK 3 CK CK CK CK CK CK CK pin Filter QEOUT QECK<2:0> Output Note: ‘n’ denotes the phase input, A or B. TCY QEn Pin QEn Filter dsPIC30F Family Reference Manual DS70063C-page 16-10 © 2004 Microchip Technology Inc. 16.4 Quadrature Decoder Position measurement modes are selected when QEIM2 = 1 (QEICON<10>). When QEIM1 = 1 (QEICON<9>), the ‘x4’ measurement mode is selected and the QEI logic clocks the position counter on both edges of the Phase A and Phase B input signals. The ‘x4’ measurement mode provides for finer resolution data (more position counts) to determine the encoder position. Figure 16-6: Quadrature Decoder Signals in 4X Mode When QEIM1 = 0, the ‘x2’ measurement mode is selected and the QEI logic only looks at the rising and falling edge of the Phase A input for the position counter increment rate. Every rising and falling edge of the Phase A signal causes the position counter to increment or decrement. The Phase B signal is still utilized for the determination of the counter direction, exactly like the x4 measurement mode. Figure 16-7: Quadrature Decoder Signals in 2X Mode +1 +1 +1 +1 +1 +1 +1 +1 +1 +1 -1 -1 -1 -1 -1 -1 -1 -1 QEA QEB count_clock POSCNT UPDN -1 +1 +1 +1 +1 +1 -1 -1 -1 QEA QEB count_clock POSCNT UPDN -1 © 2004 Microchip Technology Inc. DS70063C-page 16-11 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.4.1 Explanation of Lead/Lag Test The lead/lag test is performed by the quadrature decoder logic to determine the phase relationship of the QEA and QEB signals and hence whether to increment or decrement the POSCNT register. The Table 16-1 clarifies the lead/lag test. Table 16-1: Lead/Lag Test Description 16.4.2 Count Direction Status As mentioned in the previous section, the QEI logic generates an UPDN signal based upon the Phase A and Phase B time relationship. The UPDN signal may be output on an I/O pin. Setting the PCDOUT bit (QEICON<6>) and clearing the appropriate TRIS bit associated with the pin will cause the UPDN signal to drive the output pin. In addition to the output pin, the state of this internal UPDN signal is supplied to a SFR bit QEICON<11> as a Read-Only bit, notated as UPDN. 16.4.3 Encoder Count Direction The direction of quadrature counting is determined by the SWPAB bit (QEICON<7>). If the SWPAB = 0, the Phase A input is fed to the A input of the quadrature counter and the Phase B input is fed to the B input of the quadrature counter. Therefore as the Phase A signal leads the Phase B signal, the quadrature counter is incremented on each edge. This (A signal leads the B signal) is defined as the forward direction of motion. Setting the SWPAB bit, (QEICON<7>), to a logic 1 causes the Phase A input to be fed to the B input of the quadrature counter and the Phase B signal to be fed to the A input of the quadrature counter. Therefore, if the Phase A signal leads the Phase B signal at the dsPIC30F device pins, the Phase A input to the quadrature counter will now lag the Phase B input. This is recognized as rotation in the reverse direction and the counter will be decremented on each quadrature pulse. Present Transition Previous Transition Condition Action QEB↓ QEA leads QEB channel Set UPDN Increment POSCNT QEA↑ QEB↑ QEA lags QEB channel Clear UPDN Decrement POSCNT QEA↓ Direction Change Toggle UPDN Increment or Decrement POSCNT QEB↓ QEA lags QEB channel Clear UPDN Decrement POSCNT QEA↓ QEB↑ QEA leads QEB channel Set UPDN Increment POSCNT QEA↑ Direction Change Toggle UPDN Increment or Decrement POSCNT QEA↓ QEA lags QEB channel Clear UPDN Decrement POSCNT QEB↑ QEA↑ QEA leads QEB channel Set UPDN Increment POSCNT QEB↓ Direction Change Toggle UPDN Increment or Decrement POSCNT QEA↓ QEA leads QEB channel Set UPDN Increment POSCNT QEB↓ QEA↑ QEA lags QEB channel Clear UPDN Decrement POSCNT QEB↑ Direction Change Toggle UPDN Increment or Decrement POSCNT dsPIC30F Family Reference Manual DS70063C-page 16-12 © 2004 Microchip Technology Inc. 16.4.4 Quadrature Rate The RPM of the position control system will vary. The RPMs along with the quadrature encoder line count determine the frequency of the QEA and QEB input signals. The quadrature encoder signals can be decoded such that a count pulse is generated for every quadrature signal edge. This allows an angular position measurement resolution of up to 4 times the encoder line count. For example: a 6,000 RPM motor utilizing a 4096 line encoder yields a quadrature count rate of: ((6000/60) * (4096*4)) = 1.6384 MHz. Likewise, a 10,000 RPM motor utilizing a 8,192 line encoder yields a quadrature count rate of: ((10000/60) * (8192*4)) = 5.46 MHz. The QEI allows a quadrature frequency of up to FCY/3. For example, if FCY = 30 MHz, the QEA and QEB signals may have a maximum frequency of 10 MHz. Refer to the “Electrical Specifications” section of the device data sheet for further details. 16.5 16-bit Up/Down Position Counter The 16-bit Up/Down Counter counts up or down on every count pulse which is generated by the quadrature decoder logic. The counter then acts as an integrator, whose count value is proportional to position. The direction of the count is determined by the quadrature decoder. The user software may examine the contents of the count by reading the POSCNT register. The user software may also write to the POSCNT register to initialize a count. Changing the QEIM bits does not affect the position counter register contents. 16.5.1 Using the Position Counter The system may utilize position counter data in one of several methods. In some systems, the position count is accumulated consistently and taken as an absolute value representing the total position of the system. For a typical example, assume that a quadrature encoder is affixed to a motor controlling the print head in a printer. In operation, the system is initialized by moving the print head to the maximum left position and resetting the POSCNT register. As the print head moves to the right, the quadrature encoder will begin to accumulate counts in the POSCNT register. As the print head moves to the left, the accumulated count will decrease. As the print head reaches the right most position, the maximum position count should be reached. If the maximum count is less than 216, the QEI module can encode the entire range of motion. If, however, the maximum count is more than 216, the additional count precision must be captured by the user software. Generally, to accomplish this, the module is set into a mode where it resets the counter at match of a maximum count. QEIM0 = 1 enables modes where the MAXCNT register is used to reset the position counter. When the counter reaches a pre-determined maximum count while incrementing or reaches zero while decrementing, the count is reset and an interrupt is generated to allow the user software to increment or decrement a software counter containing the most significant bits of the position count. The maximum count can be 0xFFFF, to enable a full range of the QEI counter and software counter or some smaller value of significance, such as the number of counts for one encoder revolution. In other systems, the position count may be cyclic. The position count is only used to reference the position of the wheel within number of rotations determined by the index pulse. For example, a tool platform moved by a screw rod uses a quadrature encoder attached to the screw rod. In operation, the screw may require 5.5 rotations to achieve the desired position. The user software will detect 5 index pulses to count the full rotations and use the position count to measure the remaining half rotation. In this method, the index pulse resets the position counter to initialize the counter at each rotation and generates an interrupt for each rotation. QEIM0 = 0 enables these modes. © 2004 Microchip Technology Inc. DS70063C-page 16-13 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.5.2 Using MAXCNT to Reset the Position Counter When the QEIM0 bit is ‘1’, the position counter will reset on a match of the position count with predetermined high and low values. The index pulse reset mechanism is not utilized. For this mode the position counter reset mechanism operates as follows: (See Figure 16-8 for related timing details). - If the encoder is traveling in the forward direction e.g., QEA leads QEB, and the value in the POSCNT register matches the value in the MAXCNT register, POSCNT will reset to zero on the next occurring quadrature pulse edge that increments POSCNT. An interrupt event is generated on this rollover event. - If the encoder is travelling in the reverse direction e.g., QEB leads QEA, and the value in the POSCNT register counts down to ‘0’, the POSCNT is loaded with the value in the MAXCNT register on the next occurring quadrature pulse edge that decrements POSCNT. An interrupt event is generated on this underflow event. When using MAXCNT as a position limit, remember the position counter will count at either 2X or 4X of the encoder counts. For standard rotary encoders, the appropriate value to write to MAXCNT would be 4N – 1 for 4x position mode and 2N – 1 for 2x position mode, where N is the number of counts per revolution of the encoder. For absolute position information where the range of the system exceeds 216, it is also appropriate to load a value of 0xFFFF into the MAXCNT register. The module will generate an interrupt on rollover or underflow of the position counter. Figure 16-8: Rollover/Rollunder Reset-Up/Down Position Counter 0001 0002 0003 0004 0005 0006 0000 0001 0002 0003 0001 0000 0006 0005 0004 0003 0002 0001 0006 POSCNT = MAXCNT POSCNT set to 0000 POSCNT = 0000 POSCNT set to MAXCNT Generate QEI Interrupt Generate QEI Interrupt 0002 QEA QEB count_clock POSCNT UPDN MAXCNT dsPIC30F Family Reference Manual DS70063C-page 16-14 © 2004 Microchip Technology Inc. 16.5.3 Using Index to Reset Position Counter When QEIM<0> = 0, the index pulse is utilized for resetting the position counter. For this mode the position counter reset mechanism operates as follows: (See Figure 16-9 for related timing details). • The position count is reset each time an index pulse is received on the INDEX pin. • If the encoder is travelling in the forward direction e.g., QEA leads QEB, POSCNT is reset to ‘0’. • If the encoder is travelling in the reverse direction e.g., QEB leads QEA, the value in the MAXCNT register is loaded into POSCNT. Figure 16-9: Reset by Index Mode-Up/Down Position Counter 16.5.3.1 Index Pulse Detection Criteria Incremental encoders from different manufacturers use differing timing for the index pulse. The index pulse may be aligned to any of the 4 quadrature states and may have a pulse width of either a full cycle (4 quadrature states), a half cycle (2 quadrature states) or a quarter cycle (1 quadrature state). Index pulses of a full cycle width or a half cycle width are normally termed ‘ungated’ and index pulses of a quarter cycle width are normally termed ‘gated’. Regardless of the type of index pulse provided, the QEI maintains symmetry of the count as the wheel reverses direction. This means the index pulse must reset the position counter at the same relative quadrature state transition as the wheel rotates in the forward or reverse direction. For example, in Figure 16-9, the first index pulse is recognized and resets POSCNT as the quadrature state changes from 4 to 1 as highlighted in the diagram. The QEI latches the state of this transition. Any subsequent index pulse detection will use that state transition for the reset. As the wheel reverses, the index pulse again occurs, however the reset of the position counter cannot occur until the quadrature state changes from 1 to 4, again highlighted in the diagram. POSCNT 00E3 QEA QEB UPDN count_clock 00E4 00E5 00E6 0000 0001 0002 0003 0004 0005 0003 0002 0001 0000 00E6 00E5 00E4 00E0 POSCNT set to 0000 Recognize Index POSCNT set to MAXCNT Generate QEI Interrupt Generate QEI Interrupt 0004 00E3 00E2 00E1 Recognize Index Wheel Reverses INDX 1 2 3 4 1 2 3 4 1 2 2 1 4 3 2 1 4 3 2 1 4 3 2 Quadrature State Note: The QEI index logic ensures that the POSCNT register is always adjusted at the same position relative to the index pulse, regardless of the direction of travel. © 2004 Microchip Technology Inc. DS70063C-page 16-15 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.5.3.2 IMV Control Bits The IMV<2:0> control bits are available on some dsPIC devices that have the QEI module. (See Register 16-3). These control bits allow the user to select the state of the QEA and QEB signals for which an index pulse reset will occur. Devices that do not have these control bits will select the QEA and QEB states automatically during the first occurrence of an index pulse. 16.5.3.3 Index Pulse Status The INDEX bit (QEICON<12>) provides status of the logic state on the index pin. This status bit is very useful in position control systems during the “homing” sequence, where the system searches for a reference position. The index bit indicates the status of the index pin after being processed by the digital filter, if it is enabled. 16.5.3.4 Using the Index Pin and MAXCNT for Error Checking When the counter operates in reset on index pulse mode, the QEI will also detect POSCNT register boundary conditions. This may be used to detect system errors in the incremental encoder system. For example, assume a wheel encoder has 100 lines. When utilized in x4 measurement mode and reset on the index pulse, the counter should count from 0 to 399 (0x018E) and reset. If the POSCNT register ever achieves the values of 0xFFFF or 0x0190, some sort of system error has occurred. The contents of the POSCNT register is compared with MAXCNT + 1, if counting up, and with 0xFFFF, if counting down. If the QEI detects one of these values, a position count error condition is generated by setting the CNTERR bit (QEICON<15>) and optionally generating a QEI interrupt. If the CEID control bit (DFLTCON<8>) is cleared (default), then a QEI interrupt will be generated when a position count error is detected. If the CEID control bit is set, then an interrupt will not occur. The position counter continues to count encoder edges after detecting a position count error. No interrupt is generated for subsequent position count error events until CNTERR is cleared by the user. 16.5.3.5 Position Counter Reset Enable The position counter reset enable bit, POSRES (QEICON<2>) enables reset of the position counter when the index pulse is detected. This bit only applies when the QEI module is configured for modes, QEIM<2:0> = ‘100’ or ‘110’. If the POSRES bit is set to a logic ‘1’ then the position counter is reset when the index pulse is detected as described in this section. If the POSRES bit is set to a logic ‘0’, then the position counter is not reset when the index pulse is detected. The position counter will continue counting up or down and be reset on the rollover or underflow condition. The QEI continues to generate interrupts on the detection of the index pulse. dsPIC30F Family Reference Manual DS70063C-page 16-16 © 2004 Microchip Technology Inc. 16.6 Using QEI as an Alternate 16-bit Timer/Counter When the QEI module is configured QEIM<2:0> = 001, the QEI function is disabled and the QEI module is configured as a 16-bit timer/counter. The setup and control for the auxiliary timer is accomplished through the QEICON register. The QEI timer functions similar to the other dsPIC30F timers. Refer to Section 12. “Timers” for a general discussion of timers. When configured as a timer, the POSCNT register serves as a timer register similar to the TMRn registers of the GP timers. The MAXCNT register serves as a period register similar to the PRn registers of the GP timers. When a timer/period register match occurs, the QEIF flag asserts. Figure 16-10: QEI as Timer/Counter Block Diagram Note: Changing operational modes, i.e., from QEI to Timer or Timer to QEI will not affect the Timer/Position Count Register contents. 16-bit Up/Down Counter Comparator/Zero Detect Max Count Register Programmable Digital Filter QEA Programmable Digital Filter QEB (POSCNT) (MAXCNT) QEIF Event Flag Reset Equal 1 0 TQCKPS 2 1, 8, 64, 256 Prescaler Q D Q CK Synchronize TQGATE Det 0 0 UDSRC UPDN 1 0 TQGATE 0 1 1 0TQCS TQGATE 1 1 Gated TCY TCY © 2004 Microchip Technology Inc. DS70063C-page 16-17 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.6.1 Up/Down Timer Operation The QEI timer can increment or decrement. This is a unique feature over most other timers. When the timer is configured to count up, the timer (POSCNT) will increment until the count matches the period register (MAXCNT). The timer resets to zero and restarts incrementing. When the timer is configured to count down, the timer (POSCNT) will decrement until the count matches the period register (MAXCNT). The timer resets to zero and restarts decrementing. When the timer is configured to count down some general operation guidelines must be followed for correct operation. 1. The MAXCNT register will serve as the period match register but because the counter is decrementing, the desired match value is 2 count. For example, to count 0x1000 clocks, the period register must be loaded with 0xF000. 2. On a match condition, the timer resets to zero. Either an I/O pin or a SFR control bit specify the count direction control. Control bit UDSRC (QEICON<0>) determines what controls the timer count direction state. When UDSRC = 1, the timer count direction is controlled from the QEB pin. If the QEB pin is ’1’, the count direction will be incrementing. If the QEB pin is ‘0’, the count direction will be decrementing. When UDSRC = 0, the timer count direction is controlled from the UPDN bit (QEICON<11>). When UPDN = 1, the timer increments. When UPDN = 0, the timer decrements. 16.6.2 Timer External Clock The TQCS bit (QEICON<1>) selects internal or external clock. The QEI timer can use the QEA pin as an external clock input when TQCS is set. The QEI timer does not support the external asynchronous counter mode. If using an external clock source the clock will automatically be synchronized to the internal instruction cycle (TCY). 16.6.3 Timer Gate Operation The QEA pin functions as a timer gate when the TQGATE bit (QEICON<5>) is set and TQCS is cleared. In the event TQCS and TQGATE are concurrently set, the timer does not increment and does not generate an interrupt. 16.7 Quadrature Encoder Interface Interrupts Depending on the mode of the QEI, the QEI will generate interrupts for the following events: • When operating in reset on match mode, QEIM<2:0> = ‘111’ and ‘101’, an interrupt occurs on position counter rollover/underflow. • When operating in reset on index mode, QEIM<2:0> = ‘110’ and ‘100’, an interrupt occurs on detection of index pulse and optionally when CNTERR bit is set. • When operating as a Timer/Counter, QEIM<2:0> = ‘001’, an interrupt occurs on a period match event or a timer gate falling edge event when TQGATE = 1. When a QEI interrupt event occurs, the QEIIF bit (IFS2<8>) is asserted and an interrupt will be generated if enabled. The QEIIF bit must be cleared in software. Enabling the QEI interrupt is accomplished via the respective enable bit, QEIIE (IEC2<8>). dsPIC30F Family Reference Manual DS70063C-page 16-18 © 2004 Microchip Technology Inc. 16.8 I/O Pin Control Enabling the QEI module causes the associated I/O pins to come under the control of the QEI and prevents lower priority I/O functions such as Ports from affecting the I/O pin. Depending on the mode specified by QEIM<2:0> and other control bits, the I/O pins may assume differing functions, as shown in Table 16-2 and Table 16-3. Table 16-2: Quadrature Encoder Module Pinout I/O Descriptions Table 16-3: Module I/O Mode Functions Pin Name Pin Type Buffer Type Description QEA I I I ST ST ST Quadrature Encoder Phase A Input, or Auxiliary Timer External Clock Input, or Auxiliary Timer External gate Input QEB I I ST ST Quadrature Encoder Phase B Input, or Auxiliary Timer Up/Down select input INDX I ST Quadrature Encoder Index Pulse Input UPDN O Position Up/Down Counter Direction Status, QEI mode Legend: I = Input, O = Output, ST = Schmitt Trigger QEIM<2:0> PCDOUT UDSRC TQGATE TQCS QEA pin QEB pin INDX pin UPDN pin 000,010,011 Module Off N/A N/A N/A N/A 001 Timer Mode N/A 000 100 Input (UPDN) 010 Input (TQGATE) Port not disabled 110 Input (TQGATE) Port not disabled Input (UPDN) 0 N/A 1 Input (TQCKI) Port not disabled 1 N/A 1 Input (TQCKI) Port not disabled Input (UPDN) 101,111 QEI Reset by count 0 N/A N/A N/A Input (QEA) Input (QEB) 1 N/A N/A N/A Input (QEA) Input (QEB) Output (UPDN) 100,110 QEI Reset by Index 0 N/A N/A N/A Input (QEA) Input (QEB) Input (INDX) 1 N/A N/A N/A Input (QEA) Input (QEB) Input (INDX) Output (UPDN) Note: Empty slot indicates pin not used by QEI in this configuration,pin controlled by I/O port logic. © 2004 Microchip Technology Inc. DS70063C-page 16-19 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.9 QEI Operation During Power Saving Modes 16.9.1 When the Device Enters Sleep When the device enters Sleep mode, the QEI will cease all operations. POSCNT will stop at the current value. The QEI will not respond to active signals on the QEA, QEB, INDX or UPDN pins. The QEICON register will remain unchanged. If the QEI is configured as a timer/counter, QEIM<2:0> = ‘001’, and the clock is provided externally, TQCS = 1, the module will also cease operation during Sleep mode. When the module wakes up, the quadrature decoder will accept the next transition on the QEA or QEB signals and compare that transition to the last transition before Sleep to determine the next action. 16.9.2 When the Device Enters Idle The module will enter a power saving state in Idle mode depending on the QEISIDL bit (QEICON<13>). If QEICSIDL = 1, then the module will enter the power saving mode, similar to actions while entering Sleep mode. If QEICSIDL = 0, then the module will not enter a power saving mode. The module will continue to operate normally while the device is in Idle mode. 16.10 Effects of a Reset Reset forces module registers to their initial reset state. See Register 16-1 for all initialization and reset conditions for QEI module related registers. The quadrature decoder and the POSCNT counter are reset to an initial state. d s P I C 3 0 F F a m i l y R e f e r e n c e M a n u a l D S 7 0 0 6 3 C - p a g e 1 6 - 2 0 © 2 0 0 4 M i c r o c h i p T e c h n o l o g y I n c . Table 16-4: Special Function Registers Associated with QEI Name Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on ALL Reset QEICON CNTERR Unused QEISIDL INDX UPDN QEIM2 QEIM1 QEIM0 SWPAB PCDOUT TQGATE TQCKPS1 TQCKPS0 POSRES TQCS UDSRC 0000 0000 0000 0000 DFLTCON — — — — — — — — QEOUT QECK2 QECK1 QECK0 INDOUT INDCK2 INDCK1 INDCK0 ---- ---- ---- ---- POSCNT Position Count Register 0000 0000 0000 0000 MAXCNT Maximum Count Register 1111 1111 1111 1111 ADPCFG PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000 INTCON1 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL — 0000 0000 0000 0000 INTCON2 ALTIVT — — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000 IFS2 — — — FLTBIF FLTAIF LVDIF DCIIF QEIIF PWMIF C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000 IEC2 — — — FLTBIE FLTAIE LVDIE DCIIE QEIIE PWMIE C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000 IPC10 — FLTAIP<2:0> — LVDIP<2:0> — DCIIP<2:0> — QEIIP<2:0> 0100 0100 0100 0100 Note: The available control bits in the DFLTCON Register may vary depending on the dsPIC30F device that is used. Refer to Register 16-2 and Register 16-3 for details. Note: On many devices, the QEI pins are multiplexed with analog input pins. You will need to ensure that the QEI pins are configured as digital pins using the ADPCFG control register. © 2004 Microchip Technology Inc. DS70063C-page 16-21 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.11 Design Tips Question 1: I have initialized the QEI, but the POSCNT Register does not seem to change when quadrature signals are applied to the QEA/QEB pins. Answer: On many devices, the QEI pins are multiplexed with analog input pins. You will need to ensure that the QEI pins are configured as digital pins using the ADPCFG control register. Question 2: How fast may my quadrature signals be? Answer: The answer depends on the setting of the filter parameters for the quadrature signals. QEI requires that quadrature signals frequency must be less than FCY/3 when no filter is used and Filter Frequency/6 when a filter is used. Question: 3 My encoder has a 90° Index Pulse and the count does not reset properly. Answer: Depending on how the count clock is generated and which quadrature state transition is used for the index pulse, a 1/4 cycle index pulse may not be recognized before the required transition. To fix this, use a filter on the quadrature clocks which has a higher filter prescaler than that of the index pulse. This has the effect of delaying the quadrature clocks somewhat, allowing for proper detection of the index pulse. Figure 16-11: Reset by Index Mode (90° Index Pulse) – Up/Down Position Counter POSCNT QEA Filter QEB Filter UPDN count_clock 00E4 00E2 Recognize Index POSCNT set to MAXCNT Generate QEI Interrupt Wheel Reverses INDX 2 3 4 1 2 3 4 1 2 2 1 4 3 2 1 4 3 2 1 4 3 2 Quadrature State 0000 0001 0002 0003 0002 0001 0000 00E4 00E3 Recognize Index POSCNT set to 0000 Generate QEI Interrupt dsPIC30F Family Reference Manual DS70063C-page 16-22 © 2004 Microchip Technology Inc. 16.12 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Quadrature Encoder Interface (QEI) module are: Title Application Note # Servo Control of a DC-Brush Motor AN532 PIC18CXXX/PIC16CXXX DC Servomotor AN696 Using the dsPIC30F for Vector Control of an ACIM AN908 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2004 Microchip Technology Inc. DS70063C-page 16-23 Section 16. Quadrature Encoder Interface (QEI) Q u a drature E n c o d er Interface (QEI) 16 16.13 Revision History Revision A This is the initial released revision of this document. Revision B This revision provides expanded information for the dsPIC30F Quadrature Encoder Interface (QEI) module. Revision C This revision incorporates all known errata at the time of this document update. dsPIC30F Family Reference Manual DS70063C-page 16-24 © 2004 Microchip Technology Inc. NOTES: © 2005 Microchip Technology Inc. DS70064D-page 17-1 10-bit A/D Converter 17 Section 17. 10-bit A/D Converter HIGHLIGHTS This section of the manual contains the following major topics: 17.1 Introduction .................................................................................................................. 17-2 17.2 Control Registers ......................................................................................................... 17-4 17.3 A/D Result Buffer ......................................................................................................... 17-4 17.4 A/D Terminology and Conversion Sequence ............................................................. 17-11 17.5 A/D Module Configuration.......................................................................................... 17-13 17.6 Selecting the Voltage Reference Source ................................................................... 17-13 17.7 Selecting the A/D Conversion Clock .......................................................................... 17-13 17.8 Selecting Analog Inputs for Sampling ........................................................................ 17-14 17.9 Enabling the Module .................................................................................................. 17-16 17.10 Specifying the Sample/Conversion Sequence........................................................... 17-16 17.11 How to Start Sampling ............................................................................................... 17-17 17.12 How to Stop Sampling and Start Conversions ........................................................... 17-18 17.13 Controlling Sample/Conversion Operation................................................................. 17-29 17.14 Specifying How Conversion Results are Written Into the Buffer................................ 17-30 17.15 Conversion Sequence Examples............................................................................... 17-31 17.16 A/D Sampling Requirements...................................................................................... 17-45 17.17 Reading the A/D Result Buffer................................................................................... 17-46 17.18 Transfer Function....................................................................................................... 17-47 17.19 A/D Accuracy/Error .................................................................................................... 17-47 17.20 Connection Considerations........................................................................................ 17-47 17.21 Initialization ................................................................................................................ 17-48 17.22 A/D Conversion Speeds............................................................................................. 17-49 17.23 Operation During Sleep and Idle Modes.................................................................... 17-55 17.24 Effects of a Reset....................................................................................................... 17-55 17.25 Special Function Registers Associated with the 10-bit A/D Converter ...................... 17-56 17.26 Design Tips ................................................................................................................ 17-57 17.27 Related Application Notes.......................................................................................... 17-58 17.28 Revision History ......................................................................................................... 17-59 dsPIC30F Family Reference Manual DS70064D-page 17-2 © 2005 Microchip Technology Inc. 17.1 Introduction The dsPIC30F 10-bit A/D converter has the following key features: • Successive Approximation (SAR) conversion • Up to 1 Msps conversion speed • Up to 16 analog input pins • External voltage reference input pins • Four unipolar differential S/H amplifiers • Simultaneous sampling of up to four analog input pins • Automatic Channel Scan mode • Selectable conversion trigger source • 16 word conversion result buffer • Selectable Buffer Fill modes • Four result alignment options • Operation during CPU Sleep and Idle modes A block diagram of the 10-bit A/D is shown in Figure 17-1. The 10-bit A/D converter can have up to 16 analog input pins, designated AN0-AN15. In addition, there are two analog input pins for external voltage reference connections. These voltage reference inputs may be shared with other analog input pins. The actual number of analog input pins and external voltage reference input configuration will depend on the specific dsPIC30F device. Refer to the device data sheet for further details. The analog inputs are connected via multiplexers to four S/H amplifiers, designated CH0-CH3. One, two, or four of the S/H amplifiers may be enabled for acquiring input data. The analog input multiplexers can be switched between two sets of analog inputs during conversions. Unipolar differential conversions are possible on all channels using certain input pins (see Figure 17-1). An Analog Input Scan mode may be enabled for the CH0 S/H amplifier. A Control register specifies which analog input channels will be included in the scanning sequence. The 10-bit A/D is connected to a 16-word result buffer. Each 10-bit result is converted to one of four 16-bit output formats when it is read from the buffer. © 2005 Microchip Technology Inc. DS70064D-page 17-3 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 Figure 17-1: 10-Bit High-Speed A/D Block Diagram S/H + - 10-bit Result Conversion Logic VREF+ AVSS AVDD ADC Data Format 16-word, 10-bit Dual Port RAM Bus Interface AN12 0000 0101 0111 1001 1101 1110 1111 1100 0001 0010 0011 0100 0110 1000 1010 1011 AN13 AN14 AN15 AN8 AN9 AN10 AN11 AN2 AN4 AN7 AN0 AN3 AN1 AN5 CH1 CH2 CH3 CH0 AN5 AN2 AN11 AN8 VREFAN4 AN1 AN10 AN7 VREFAN3 AN0 AN9 AN6 VREFAN1 VREFVREFSample/Sequence Sample Control CH1,CH2, CH3,CH0 Input MUX Control Input Switches S/H + - S/H + - S/H + - AN6 Note: VREF+, VREF- inputs may be shared with other analog inputs. See device data sheet for details. dsPIC30F Family Reference Manual DS70064D-page 17-4 © 2005 Microchip Technology Inc. 17.2 Control Registers The A/D module has six Control and Status registers. These registers are: • ADCON1: A/D Control Register 1 • ADCON2: A/D Control Register 2 • ADCON3: A/D Control Register 3 • ADCHS: A/D Input Channel Select Register • ADPCFG: A/D Port Configuration Register • ADCSSL: A/D Input Scan Selection Register The ADCON1, ADCON2 and ADCON3 registers control the operation of the A/D module. The ADCHS register selects the input pins to be connected to the S/H amplifiers. The ADPCFG register configures the analog input pins as analog inputs or as digital I/O. The ADCSSL register selects inputs to be sequentially scanned. 17.3 A/D Result Buffer The module contains a 16-word dual port RAM, called ADCBUF, to buffer the A/D results. The 16 buffer locations are referred to as ADCBUF0, ADCBUF1, ADCBUF2, ...., ADCBUFE, ADCBUFF. Note: The A/D result buffer is a read only buffer. © 2005 Microchip Technology Inc. DS70064D-page 17-5 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 Register 17-1: ADCON1: A/D Control Register 1 Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 ADON — ADSIDL — — — FORM<1:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 HC, HS R/C-0 HC, HS SSRC<2:0> — SIMSAM ASAM SAMP DONE bit 7 bit 0 bit 15 ADON: A/D Operating Mode bit 1 = A/D converter module is operating 0 = A/D converter is off bit 14 Unimplemented: Read as ‘0’ bit 13 ADSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-10 Unimplemented: Read as ‘0’ bit 9-8 FORM<1:0>: Data Output Format bits 11 = Signed Fractional (DOUT = sddd dddd dd00 0000) 10 = Fractional (DOUT = dddd dddd dd00 0000) 01 = Signed Integer (DOUT = ssss sssd dddd dddd) 00 = Integer (DOUT = 0000 00dd dddd dddd) bit 7-5 SSRC<2:0>: Conversion Trigger Source Select bits 111 = Internal counter ends sampling and starts conversion (auto convert) 110 = Reserved 101 = Reserved 100 = Reserved 011 = Motor Control PWM interval ends sampling and starts conversion 010 = GP Timer3 compare ends sampling and starts conversion 001 = Active transition on INT0 pin ends sampling and starts conversion 000 = Clearing SAMP bit ends sampling and starts conversion bit 4 Unimplemented: Read as ‘0’ bit 3 SIMSAM: Simultaneous Sample Select bit (only applicable when CHPS = 01 or 1x) 1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS = 1x) or Samples CH0 and CH1 simultaneously (when CHPS = 01) 0 = Samples multiple channels individually in sequence bit 2 ASAM: A/D Sample Auto-Start bit 1 = Sampling begins immediately after last conversion completes. SAMP bit is auto set 0 = Sampling begins when SAMP bit set dsPIC30F Family Reference Manual DS70064D-page 17-6 © 2005 Microchip Technology Inc. Register 17-1: ADCON1: A/D Control Register 1 (Continued) bit 1 SAMP: A/D Sample Enable bit 1 = At least one A/D sample/hold amplifier is sampling 0 = A/D sample/hold amplifiers are holding When ASAM = 0, writing ‘1’ to this bit will start sampling When SSRC = 000, writing ‘0’ to this bit will end sampling and start conversion bit 0 DONE: A/D Conversion Status bit (Rev. B silicon or later) 1 = A/D conversion is done 0 = A/D conversion is NOT done Cleared by software or start of a new conversion Clearing this bit will not effect any operation in progress Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ HC = Hardware clear HS = Hardware set C = Clearable by software -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70064D-page 17-7 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 Register 17-2: ADCON2: A/D Control Register 2 Upper Byte: R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 VCFG<2:0> reserved — CSCNA CHPS<1:0> bit 15 bit 8 Lower Byte: R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BUFS — SMPI<3:0> BUFM ALTS bit 7 bit 0 bit 15-13 VCFG<2:0>: Voltage Reference Configuration bits bit 12 Reserved: User should write ‘0’ to this location bit 11 Unimplemented: Read as ‘0’ bit 10 CSCNA: Scan Input Selections for CH0+ S/H Input for MUX A Input Multiplexer Setting bit 1 = Scan inputs 0 = Do not scan inputs bit 9-8 CHPS<1:0>: Selects Channels Utilized bits 1x = Converts CH0, CH1, CH2 and CH3 01 = Converts CH0 and CH1 00 = Converts CH0 When SIMSAM bit (ADCON1<3>) = 0 multiple channels sampled sequentially When SMSAM bit (ADCON1<3>) = 1 multiple channels sampled as in CHPS<1:0> bit 7 BUFS: Buffer Fill Status bit Only valid when BUFM = 1 (ADRES split into 2 x 8-word buffers). 1 = A/D is currently filling buffer 0x8-0xF, user should access data in 0x0-0x7 0 = A/D is currently filling buffer 0x0-0x7, user should access data in 0x8-0xF bit 6 Unimplemented: Read as ‘0’ bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits 1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence 1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence ..... 0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence 0000 = Interrupts at the completion of conversion for each sample/convert sequence bit 1 BUFM: Buffer Mode Select bit 1 = Buffer configured as two 8-word buffers ADCBUF(15...8), ADCBUF(7...0) 0 = Buffer configured as one 16-word buffer ADCBUF(15...0.) bit 0 ALTS: Alternate Input Sample Mode Select bit 1 = Uses MUX A input multiplexer settings for first sample, then alternate between MUX B and MUX A input multiplexer settings for all subsequent samples 0 = Always use MUX A input multiplexer settings Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown A/D VREFH A/D VREFL 000 AVDD AVSS 001 External VREF+ pin AVSS 010 AVDD External VREF- pin 011 External VREF+ pin External VREF- pin 1XX AVDD AVSS dsPIC30F Family Reference Manual DS70064D-page 17-8 © 2005 Microchip Technology Inc. Register 17-3: ADCON3: A/D Control Register 3 Upper Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — SAMC<4:0> bit 15 bit 8 Lower Byte: R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADRC — ADCS<5:0> bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 SAMC<4:0>: Auto-Sample Time bits 11111 = 31 TAD ····· 00001 = 1 TAD 00000 = 0 TAD (only allowed if performing sequential conversions using more than one S/H amplifier) bit 7 ADRC: A/D Conversion Clock Source bit 1 = A/D internal RC clock 0 = Clock derived from system clock bit 6 Unimplemented: Read as ‘0’ bit 5-0 ADCS<5:0>: A/D Conversion Clock Select bits 111111 = TCY/2 • (ADCS<5:0> + 1) = 32 • TCY ······ 000001 = TCY/2 • (ADCS<5:0> + 1) = TCY 000000 = TCY/2 • (ADCS<5:0> + 1) = TCY/2 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70064D-page 17-9 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 Register 17-4: ADCHS: A/D Input Select Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH123NB<1:0> CH123SB CH0NB CH0SB<3:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH123NA<1:0> CH123SA CH0NA CH0SA<3:0> bit 7 bit 0 bit 15-14 CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for MUX B Multiplexer Setting bits Same definition as bits 6-7 (Note) bit 13 CH123SB: Channel 1, 2, 3 Positive Input Select for MUX B Multiplexer Setting bit Same definition as bit 5 (Note) bit 12 CH0NB: Channel 0 Negative Input Select for MUX B Multiplexer Setting bit Same definition as bit 4 (Note) bit 11-8 CH0SB<3:0>: Channel 0 Positive Input Select for MUX B Multiplexer Setting bits Same definition as bits 3-0 (Note) bit 7-6 CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for MUX A Multiplexer Setting bits 11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 0x = CH1, CH2, CH3 negative input is VREFbit 5 CH123SA: Channel 1, 2, 3 Positive Input Select for MUX A Multiplexer Setting bit 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 bit 4 CH0NA: Channel 0 Negative Input Select for MUX A Multiplexer Setting bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREFbit 3-0 CH0SA<3:0>: Channel 0 Positive Input Select for MUX A Multiplexer Setting bits 1111 = Channel 0 positive input is AN15 1110 = Channel 0 positive input is AN14 1101 = Channel 0 positive input is AN13 || || || 0001 = Channel 0 positive input is AN1 0000 = Channel 0 positive input is AN0 Note: The analog input multiplexer supports two input setting configurations, denoted MUX A and MUX B. ADCHS<15:8> determine the settings for MUX B, and ADCHS<7:0> determine the settings for MUX A. Both sets of control bits function identically. Note: The ADCHS register description and functionality will vary depending on the number of A/D inputs available on the selected device. Please refer to the specific device data sheet for additional details on this register. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70064D-page 17-10 © 2005 Microchip Technology Inc. Register 17-5: ADPCFG: A/D Port Configuration Register Register 17-6: ADCSSL: A/D Input Scan Select Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 bit 15-0 PCFG<15:0>: Analog Input Pin Configuration Control bits 1 = Analog input pin in Digital mode, port read input enabled, A/D input multiplexer input connected to AVSS 0 = Analog input pin in Analog mode, port read input disabled, A/D samples pin voltage Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 bit 7 bit 0 bit 15-0 CSSL<15:0>: A/D Input Pin Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70064D-page 17-11 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.4 A/D Terminology and Conversion Sequence Figure 17-2 shows a basic conversion sequence and the terms that are used. A sampling of the analog input pin voltage is performed by sample and hold S/H amplifiers. The S/H amplifiers are also called S/H channels. The 10-bit A/D converter has four total S/H channels, designated CH0-CH3. The S/H channels are connected to the analog input pins via the analog input multiplexer. The analog input multiplexer is controlled by the ADCHS register. There are two sets of multiplexer control bits in the ADCHS register that function identically. These two sets of control bits allow two different analog input multiplexer configurations to be programmed, which are called MUX A and MUX B. The A/D converter can optionally switch between the MUX A and MUX B configurations between conversions. The A/D converter can also optionally scan through a series of analog inputs. Sample time is the time that the A/D module’s S/H amplifier is connected to the analog input pin. The sample time may be started manually by setting the SAMP bit (ADCON1<1>) or started automatically by the A/D converter hardware. The sample time is ended manually by clearing the SAMP control bit in the user software or automatically by a conversion trigger source. Conversion time is the time required for the A/D converter to convert the voltage held by the S/H amplifier. The A/D is disconnected from the analog input pin at the end of the sample time. The A/D converter requires one A/D clock cycle (TAD) to convert each bit of the result plus one additional clock cycle. A total of 12 TAD cycles are required to perform the complete conversion. When the conversion time is complete, the result is loaded into one of 16 A/D Result registers (ADCBUF0...ADCBUFF), the S/H can be reconnected to the input pin, and a CPU interrupt may be generated. The sum of the sample time and the A/D conversion time provides the total conversion time. There is a minimum sample time to ensure that the S/H amplifier will give the desired accuracy for the A/D conversion (see Section 17.16 “A/D Sampling Requirements”). Furthermore, there are multiple input clock options for the A/D converter. The user must select an input clock option that does not violate the minimum TAD specification. Figure 17-2: A/D Sample/Conversion Sequence The 10-bit A/D converter allows many options for specifying the sample/convert sequence. The sample/convert sequence can be very simple, such as the one shown in Figure 17-3. The example in Figure 17-3 uses only one S/H amplifier. A more elaborate sample/convert sequence performs multiple conversions using more than one S/H amplifier. The 10-bit A/D converter can use two S/H amplifiers to perform two conversions in a sample/convert sequence or four S/H amplifiers with four conversions. The number of S/H amplifiers, or channels per sample, used in the sample/convert sequence is determined by the CHPS control bits. Sample Time A/D Conversion Time A/D Total Conversion Time S/H amplifier is connected to the analog input pin for sampling. S/H amplifier is disconnected from input and holds signal lever. A/D conversion is started by the conversion trigger source. A/D conversion complete, result is loaded into A/D result buffer. Optionally generate interrupt. dsPIC30F Family Reference Manual DS70064D-page 17-12 © 2005 Microchip Technology Inc. A sample/convert sequence that uses multiple S/H channels can be simultaneously sampled or sequentially sampled, as controlled by the SIMSAM bit (ADCON1<3>). Simultaneously sampling multiple signals ensures that the snapshot of the analog inputs occurs at precisely the same time for all inputs. Sequential sampling takes a snapshot of each analog input just before conversion starts on that input, and the sampling of multiple inputs is not correlated. Figure 17-3: Simultaneous and Sequential Sampling The start time for sampling can be controlled in software by setting the SAMP control bit. The start of the sampling time can also be controlled automatically by the hardware. When the A/D converter operates in the Auto-Sample mode, the S/H amplifier(s) is reconnected to the analog input pin at the end of the conversion in the sample/convert sequence. The auto-sample function is controlled by the ASAM control bit (ADCON1<2>). The conversion trigger source ends the sampling time and begins an A/D conversion or a sample/convert sequence. The conversion trigger source is selected by the SSRC control bits. The conversion trigger can be taken from a variety of hardware sources, or can be controlled manually in software by clearing the SAMP control bit. One of the conversion trigger sources is an auto-conversion. The time between auto-conversions is set by a counter and the A/D clock. The Auto-Sample mode and auto-conversion trigger can be used together to provide endless automatic conversions without software intervention. An interrupt may be generated at the end of each sample/convert sequence or multiple sample/convert sequences as determined by the value of the SMPI control bits ADCON2<5:2>. The number of sample/convert sequences between interrupts can vary between 1 and 16. The user should note that the A/D conversion buffer holds 16 results when the SMPI value is selected. The total number of conversion results between interrupts is the product of the channels per sample and the SMPI value. The total number of conversions between interrupts should not exceed the buffer length. AN0 AN1 AN2 AN3 Simultaneous Sampling Sequential Sampling © 2005 Microchip Technology Inc. DS70064D-page 17-13 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.5 A/D Module Configuration The following steps should be followed for performing an A/D conversion: 1. Configure the A/D module • Select port pins as analog inputs ADPCFG<15:0> • Select voltage reference source to match expected range on analog inputs ADCON2<15:13> • Select the analog conversion clock to match desired data rate with processor clock ADCON3<5:0> • Determine how many S/H channels will be used ADCON2<9:8> and ADPCFG<15:0> • Determine how sampling will occur ADCON1<3> and ADCSSL<15:0> • Determine how inputs will be allocated to S/H channels ADCHS<15:0> • Select the appropriate sample/conversion sequence ADCON1<7:0> and ADCON3<12:8> • Select how conversion results are presented in the buffer ADCON1<9:8> • Select interrupt rate ADCON2<5:9> • Turn on A/D module ADCON1<15> 2. Configure A/D interrupt (if required) • Clear ADIF bit • Select A/D interrupt priority The options for each configuration step are described in the subsequent sections. 17.6 Selecting the Voltage Reference Source The voltage references for A/D conversions are selected using the VCFG<2:0> control bits (ADCON2<15:13>). The upper voltage reference (VREFH) and the lower voltage reference (VREFL) may be the internal AVDD and AVSS voltage rails or the VREF+ and VREF- input pins. The external voltage reference pins may be shared with the AN0 and AN1 inputs on low pin count devices. The A/D converter can still perform conversions on these pins when they are shared with the VREF+ and VREF- input pins. The voltages applied to the external reference pins must meet certain specifications. Refer to the “Electrical Specifications” section of the device data sheet for further details. 17.7 Selecting the A/D Conversion Clock The A/D converter has a maximum rate at which conversions may be completed. An analog module clock, TAD, controls the conversion timing. The A/D conversion requires 12 clock periods (12 TAD). The A/D clock is derived from the device instruction clock or internal RC clock source. The period of the A/D conversion clock is software selected using a 6-bit counter. There are 64 possible options for TAD, specified by the ADCS<5:0> bits (ADCON3<5:0>). Equation 17-1 gives the TAD value as a function of the ADCS control bits and the device instruction cycle clock period, TCY. Equation 17-1: A/D Conversion Clock Period For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of 83.33 nsec (see Section 17.22 “A/D Conversion Speeds” for further details). Note: External VREF+ amd VREF- must be selected for conversion rates above 500 ksps. See Section 17.22 “A/D Conversion Speeds” for further details. TAD = TCY(ADCS + 1) 2 ADCS = 2TAD TCY – 1 dsPIC30F Family Reference Manual DS70064D-page 17-14 © 2005 Microchip Technology Inc. The A/D converter has a dedicated internal RC clock source that can be used to perform conversions. The internal RC clock source should be used when A/D conversions are performed while the dsPIC30F is in Sleep mode. The internal RC oscillator is selected by setting the ADRC bit (ADCON3<7>). When the ADRC bit is set, the ADCS<5:0> bits have no effect on the A/D operation. 17.8 Selecting Analog Inputs for Sampling All Sample-and-Hold Amplifiers have analog multiplexers (see Figure 17-1) on both their non-inverting and inverting inputs to select which analog input(s) are sampled. Once the sample/convert sequence is specified, the ADCHS bits determine which analog inputs are selected for each sample. Additionally, the selected inputs may vary on an alternating sample basis or may vary on a repeated sequence of samples. The same analog input can be connected to two or more sample and hold channels to improve conversion rates. 17.8.1 Configuring Analog Port Pins The ADPCFG register specifies the input condition of device pins used as analog inputs. A pin is configured as analog input when the corresponding PCFGn bit (ADPCFG) is clear. The ADPCFG register is clear at Reset, causing the A/D input pins to be configured for analog input by default at Reset. When configured for analog input, the associated port I/O digital input buffer is disabled so it does not consume current. The ADPCFG register and the TRISB register control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set, specifying port input. If the I/O pin associated with an A/D input is configured as an output, TRIS bit is cleared and the ports digital output level (VOH or VOL) will be converted. After a device Reset, all TRIS bits are set. A pin is configured as digital I/O when the corresponding PCFGn bit (ADPCFG) is set. In this configuration, the input to the analog multiplexer is connected to AVSS. 17.8.2 Channel 0 Input Selection Channel 0 is the most flexible of the 4 S/H channels in terms of selecting analog inputs. The user may select any of the up to 16 analog inputs as the input to the positive input of the channel. The CH0SA<3:0> bits (ADCHS<3:0>) normally select the analog input for the positive input of channel 0. The user may select either VREF- or AN1 as the negative input of the channel. The CH0NA bit (ADCHS<4>) normally selects the analog input for the negative input of channel 0. Note: Different devices will have different numbers of analog inputs. Verify the analog input availability against the device data sheet. Note 1: When reading the A/D Port register, any pin configured as an analog input reads as a ‘0’. 2: Analog levels on any pin that is defined as a digital input (including the AN15:AN0 pins) may cause the input buffer to consume current that is out of the device’s specification. © 2005 Microchip Technology Inc. DS70064D-page 17-15 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.8.2.1 Specifying Alternating Channel 0 Input Selections The ALTS bit (ADCON2<0>) causes the module to alternate between two sets of inputs that are selected during successive samples. The inputs specified by CH0SA<3:0>, CH0NA, CHXSA and CHXNA<1:0> are collectively called the MUX A inputs. The inputs specified by CH0SB<3:0>, CH0NB, CHXSB and CHXNB<1:0> are collectively called the MUX B inputs. When the ALTS bit is ‘1’ , the module will alternate between the MUX A inputs on one sample and the MUX B inputs on the subsequent sample. For channel 0, if the ALTS bit is ‘0’, only the inputs specified by CH0SA<3:0> and CH0NA are selected for sampling. If the ALTS bit is ‘1’, on the first sample/convert sequence for channel 0, the inputs specified by CH0SA<3:0> and CH0NA are selected for sampling. On the next sample convert sequence for channel 0, the inputs specified by CH0SB<3:0> and CH0NB are selected for sampling. This pattern will repeat for subsequent sample conversion sequences. Note that if multiple channels (CHPS = 01 or 1x) and simultaneous sampling (SIMSAM = 1) are specified, alternating inputs will change every sample because all channels are sampled on every sample time. If multiple channels (CHPS = 01 or 1x) and sequential sampling (SIMSAM = 0) are specified, alternating inputs will change only on each sample of a particular channel. 17.8.2.2 Scanning Through Several Inputs with Channel 0 Channel 0 has the ability to scan through a selected vector of inputs. The CSCNA bit (ADCON2<10>) enables the CH0 channel inputs to be scanned across a selected number of analog inputs. When CSCNA is set, the CH0SA<3:0> bits are ignored. The ADCSSL register specifies the inputs to be scanned. Each bit in the ADCSSL register corresponds to an analog input. Bit 0 corresponds to AN0, bit 1 corresponds to AN1 and so on. If a particular bit in the ADCSSL register is ‘1’, the corresponding input is part of the scan sequence. The inputs are always scanned from lower to higher numbered inputs, starting at the first selected channel after each interrupt occurs. The ADCSSL bits only specify the input of the positive input of the channel. The CH0NA bit still selects the input of the negative input of the channel during scanning. If the ALTS bit is ‘1’, the scanning only applies to the MUX A input selection. The MUX B input selection, as specified by the CH0SB<3:0>, will still select the alternating channel 0 input. When the input selections are programmed in this manner, the channel 0 input will alternate between a set of scanning inputs specified by the ADCSSL register and a fixed input specified by the CH0SB bits. Note: If the number of scanned inputs selected is greater than the number of samples taken per interrupt, the higher numbered inputs will not be sampled. dsPIC30F Family Reference Manual DS70064D-page 17-16 © 2005 Microchip Technology Inc. 17.8.3 Channel 1, 2 and 3 Input Selection Channel 1, 2 and 3 can sample a subset of the analog input pins. Channel 1, 2 and 3 may select one of two groups of 3 inputs. The CHXSA bit (ADCHS<5>) selects the source for the positive inputs of channel 1, 2 and 3. Clearing CHXSA selects AN0, AN1 and AN2 as the analog source to the positive inputs of channel 1, 2 and 3, respectively. Setting CHXSA selects AN3, AN4 and AN5 as the analog source. The CHXNA<1:0> bits (ADCHS<7:6>) select the source for the negative inputs of channel 1, 2 and 3. Programming CHXNA = 0x, selects VREF- as the analog source for the negative inputs of channel 1, 2 and 3. Programming CHXNA = 10 selects AN6, AN7 and AN8 as the analog source to the negative inputs of channel 1, 2 and 3 respectively. Programming CHXNA = 11 selects AN9, AN10 and AN11 as the analog source. 17.8.3.1 Selecting Multiple Channels for a Single Analog Input The analog input multiplexer can be configured so that the same input pin is connected to two or more sample and hold channels. The A/D converts the value held on one S/H channel, while the second S/H channel acquires a new input sample. 17.8.3.2 Specifying Alternating Channel 1, 2 and 3 Input Selections As with the channel 0 inputs, the ALTS bit (ADCON2<0>) causes the module to alternate between two sets of inputs that are selected during successive samples for channel 1,2 and 3. The MUX A inputs specified by CHXSA and CHXNA<1:0> always select the input when ALTS = 0. The MUX A inputs alternate with the MUX B inputs specified by CHXSB and CHXNB<1:0> when ALTS = 1. 17.9 Enabling the Module When the ADON bit (ADCON1<15>) is ‘1’, the module is in Active mode and is fully powered and functional. When ADON is ‘0’, the module is disabled. The digital and analog portions of the circuit are turned off for maximum current savings. In order to return to the Active mode from the Off mode, the user must wait for the analog stages to stabilize. For the stabilization time, refer to the Electrical Characteristics section of the device data sheet. 17.10 Specifying the Sample/Conversion Sequence The 10-bit A/D module has 4 sample/hold amplifiers and one A/D converter. The module may perform 1, 2 or 4 input samples and A/D conversions per sample/convert sequence. 17.10.1 Number of Sample/Hold Channels The CHPS<1:0> control bits (ADCON2<9:8>) are used to select how many S/H amplifers are used by the A/D module during sample/conversion sequences. The following three options may be selected: • CH0 only • CH0 and CH1 • CH0, CH1, CH2, CH3 The CHPS control bits work in conjunction with the SIMSAM (simultaneous sample) control bit (ADCON1<3>). Note: The SSRC<2:0>, SIMSAM, ASAM, CHPS<1:0>, SMPI<3:0>, BUFM and ALTS bits, as well as the ADCON3 and ADCSSL registers, should not be written to while ADON = 1. This would lead to indeterminate results. © 2005 Microchip Technology Inc. DS70064D-page 17-17 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.10.2 Simultaneous Sampling Enable Some applications may require that multiple signals are sampled at the exact same time instance. The SIMSAM control bit (ADCON1<3>) works in conjunction with the CHPS control bits and controls the sample/convert sequence for multiple channels as shown in Table 17-1. The SIMSAM control bit has no effect on the module operation if CHPS<1:0> = 00. If more than one S/H amplifier is enabled by the CHPS control bits and the SIMSAM bit is ‘0’, the two or four selected channels are sampled and converted sequentially with two or four sampling periods. If the SIMSAM bit is ‘1’, two or four selected channels are sampled simultaneously with one sampling period. The channels are then converted sequentially. Table 17-1: Sample/Conversion Control Options 17.11 How to Start Sampling 17.11.1 Manual Setting the SAMP bit (ADCON1<1>) causes the A/D to begin sampling. One of several options can be used to end sampling and complete the conversions. Sampling will not resume until the SAMP bit is once again set. For an example, see Figure 17-4. 17.11.2 Automatic Setting the ASAM bit (ADCON1<2>) causes the A/D to automatically begin sampling a channel whenever a conversion is not active on that channel. One of several options can be used to end sampling and complete the conversions. If the SIMSAM bit specifies sequential sampling, sampling on a channel resumes after the conversion of that channel completes. If the SIMSAM bit specifies simultaneous sampling, sampling on a channel resumes after the conversion of all channels completes. For an example, see Figure 17-5. CHPS<1:0> SIMSAM Sample/Conversion Sequence # of Sample/ Convert Cycles to Complete Example 00 x Sample CH0, Convert CH0 1 Figure 17-4, Figure 17-5, Figure 17-6, Figure 17-7, Figure 17-10, Figure 17-11, Figure 17-14, Figure 17-15 01 0 Sample CH0, Convert CH0 Sample CH1, Convert CH1 2 1x 0 Sample CH0, Convert CH0 Sample CH1, Convert CH1 Sample CH2, Convert CH2 Sample CH3, Convert CH3 4 Figure 17-9, Figure 17-13, Figure 17-20 01 1 Sample CH0, CH1 simultaneously Convert CH0 Convert CH1 1 Figure 17-18 1x 1 Sample CH0, CH1, CH2, CH3 simultaneously Convert CH0 Convert CH1 Convert CH2 Convert CH3 1 Figure 17-8 Figure 17-12, Figure 17-16, Figure 17-17, Figure 17-9, dsPIC30F Family Reference Manual DS70064D-page 17-18 © 2005 Microchip Technology Inc. 17.12 How to Stop Sampling and Start Conversions The conversion trigger source will terminate sampling and start a selected sequence of conversions. The SSRC<2:0> bits (ADCON1<7:5>) select the source of the conversion trigger. 17.12.1 Manual When SSRC<2:0> = 000, the conversion trigger is under software control. Clearing the SAMP bit (ADCON1<1>) starts the conversion sequence. Figure 17-4 is an example where setting the SAMP bit initiates sampling and clearing the SAMP bit terminates sampling and starts conversion. The user software must time the setting and clearing of the SAMP bit to ensure adequate sampling time of the input signal. See Example 17-1 for code example. Figure 17-4: Converting 1 Channel, Manual Sample Start, Manual Conversion Start Example 17-1: Converting 1 Channel, Manual Sample Start, Manual Conversion Start Code Note: The available conversion trigger sources may vary depending on the dsPIC30F device variant. Please refer to the specific device data sheet for the available conversion trigger sources. Note: The SSRC selection bits should not be changed when the A/D module is enabled. If the user wishes to change the conversion trigger source, the A/D module should be disabled first by clearing the ADON bit (ADCON1<15>). ADCLK SAMP ADCBUF0 TSAMP TCONV Instruction Execution BSET ADCON1,SAMP BCLR ADCON1,SAMP DONE ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x0000; // SAMP bit = 0 ends sampling ... // and starts converting ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input .. // in this example RB2/AN2 is the input ADCSSL = 0; ADCON3 = 0x0002; // Manual Sample, Tad = internal 2 Tcy ADCON2 = 0; ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCON1bits.SAMP = 1; // start sampling ... DelayNmSec(100); // for 100 mS ADCON1bits.SAMP = 0; // start Converting while (!ADCON1bits.DONE); // conversion done? ADCValue = ADCBUF0; // yes then get ADC value } // repeat © 2005 Microchip Technology Inc. DS70064D-page 17-19 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 Figure 17-5 is an example where setting the ASAM bit initiates automatic sampling and clearing the SAMP bit terminates sampling and starts conversion. After the conversion completes, the module will automatically return to a sampling state. The SAMP bit is automatically set at the start of the sample interval. The user software must time the clearing of the SAMP bit to ensure adequate sampling time of the input signal, understanding that the time between clearing of the SAMP bit includes the conversion time as well as the sampling time. See Example 17-2 for code example. Figure 17-5: Converting 1 Channel, Automatic Sample Start, Manual Conversion Start Example 17-2: Converting 1 Channel, Automatic Sample Start, Manual Conversion Start Code ADCLK SAMP ADCBUF0 TSAMP TCONV BCLR ADCON1,SAMP Instruction Execution TCONV BSET ADCON1,ASAM BCLR ADCON1,SAMP TSAMP TAD0 TAD0 DONE ADPCFG = 0xFF7F; // all PORTB = Digital but RB7 = analog ADCON1 = 0x0004; // ASAM bit = 1 implies sampling .. // starts immediately after last // conversion is done ADCHS = 0x0007; // Connect RB7/AN7 as CH0 input .. // in this example RB7/AN7 is the input ADCSSL = 0; ADCON3 = 0x0002; // Sample time manual, Tad = internal 2 Tcy ADCON2 = 0; ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { DelayNmSec(100); // sample for 100 mS ADCON1bits.SAMP = 0; // start Converting while (!ADCON1bits.DONE); // conversion done? ADCValue = ADCBUF0; // yes then get ADC value } // repeat dsPIC30F Family Reference Manual DS70064D-page 17-20 © 2005 Microchip Technology Inc. 17.12.2 Clocked Conversion Trigger When SSRC<2:0> = 111, the conversion trigger is under A/D clock control. The SAMC bits (ADCON3<12:8>) select the number of TAD clock cycles between the start of sampling and the start of conversion. This trigger option provides the fastest conversion rates on multiple channels. After the start of sampling, the module will count a number of TAD clocks specified by the SAMC bits. Equation 17-2: Clocked Conversion Trigger Time When using only 1 S/H channel or simultaneous sampling, SAMC must always be programmed for at least one clock cycle. When using multiple S/H channels with sequential sampling, programming SAMC for zero clock cycles will result in the fastest possible conversion rate. See Example 17-3 for code example. Figure 17-6: Converting 1 Channel, Manual Sample Start, TAD Based Conversion Start Example 17-3: Converting 1 Channel, Manual Sample Start, TAD Based Conversion Start Code TSMP = SAMC<4:0>*TAD ADCLK SAMP ADCBUF0 TSAMP TCONV Instruction Execution BSET ADCON1,SAMP DONE = 16 TAD ADPCFG = 0xEFFF; // all PORTB = Digital; RB12 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x000C; // Connect RB12/AN12 as CH0 input .. // in this example RB12/AN12 is the input ADCSSL = 0; ADCON3 = 0x1F02; // Sample time = 31Tad, Tad = internal 2 Tcy ADCON2 = 0; ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCON1bits.SAMP = 1; // start sampling then ... // after 31Tad go to conversion while (!ADCON1bits.DONE); // conversion done? ADCValue = ADCBUF0; // yes then get ADC value } // repeat // repeat © 2005 Microchip Technology Inc. DS70064D-page 17-21 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.12.2.1 Free Running Sample Conversion Sequence As shown in Figure 17-7, using the Auto-Convert Conversion Trigger mode (SSRC = 111) in combination with the Auto-Sample Start mode (ASAM = 1), allows the A/D module to schedule sample/conversion sequences with no intervention by the user or other device resources. This “Clocked” mode allows continuous data collection after module initialization. See Example 17-4 for code example. Figure 17-7: Converting 1 Channel, Auto-Sample Start, TAD Based Conversion Start Example 17-4: Converting 1 Channel, Auto-Sample Start, TAD Based Conversion Start Code Note: This A/D configuration must be enabled for the conversion rate of 750 ksps (see Section 17.22 “A/D Conversion Speeds” for details) ADCLK SAMP ADCBUF1 TSAMP TCONV DONE = 16 TAD TSAMP TCONV = 16 TAD ADCBUF0 Instruction Execution BSET ADCON1,ASAM ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input .. // in this example RB2/AN2 is the input ADCSSL = 0; ADCON3 = 0x0F00; // Sample time = 15Tad, Tad = internal Tcy/2 ADCON2 = 0x0004; // Interrupt after every 2 samples ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCValue = 0; // clear value ADC16Ptr = &ADCBUF0; // initialize ADCBUF pointer IFS0bits.ADIF = 0; // clear ADC interrupt flag ADCON1bits.ASAM = 1; // auto start sampling // for 31Tad then go to conversion while (!IFS0bits.ADIF); // conversion done? ADCON1bits.ASAM = 0; // yes then stop sample/convert for (count = 0; count < 2; count++) // average the 2 ADC value ADCValue = ADCValue + *ADC16Ptr++; ADCValue = ADCValue >> 1; } // repeat dsPIC30F Family Reference Manual DS70064D-page 17-22 © 2005 Microchip Technology Inc. 17.12.2.2 Multiple Channels with Simultaneous Sampling As shown in Figure 17-8 when using simultaneous sampling, the SAMC value specifies the sampling time. In the example, SAMC specifies a sample time of 3 TAD. Because automatic sample start is active, sampling will start on all channels after the last conversion ends and will continue for 3 A/D clocks. See Example 17-5 for code example. Figure 17-8: Converting 4 Channels, Auto-Sample Start, TAD Conversion Start, Simultaneous Sampling Example 17-5: Converting 4 Channels, Auto-Sample Start, TAD Conversion Start, Simultaneous Sampling Code TCONV TCONV TCONV TCONV ADCLK ch1_samp ch2_samp ch3_samp ch0_samp ADCBUF0 ADCBUF1 ADCBUF2 ADCBUF3 TCONV TCONV DONE SAMP TSAMP ADPCFG = 0xFF78; // RB0,RB1,RB2 & RB7 = analog ADCON1 = 0x00EC; // SIMSAM bit = 1 implies ... // simultaneous sampling // ASAM = 1 for auto sample after convert // SSRC = 111 for 3Tad sample time ADCHS = 0x0007; // Connect AN7 as CH0 input ADCSSL = 0; ADCON3 = 0x0302; // Auto Sampling 3 Tad, Tad = internal 2 Tcy ADCON2 = 0x030C; // CHPS = 1x implies simultaneous ... // sample CH0 to CH3 // SMPI = 0011 for interrupt after 4 converts ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADC16Ptr = &ADCBUF0; // initialize ADCBUF pointer OutDataPtr = &OutData[0]; // point to first TXbuffer value IFS0bits.ADIF = 0; // clear interrupt while (IFS0bits.ADIF); // conversion done? for (count = 0; count < 4; count++) // save the ADC values { ADCValue = *ADC16Ptr++; LoadADC(ADCValue); } } // repeat © 2005 Microchip Technology Inc. DS70064D-page 17-23 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.12.2.3 Multiple Channels with Sequential Sampling As shown in Figure 17-9 when using sequential sampling, the sample time precedes each conversion time. In the example, 3 TAD clocks are added for sample time for each channel. Figure 17-9: Converting 4 Channels, Auto-Sample Start, TAD Conversion Start, Sequential Sampling 17.12.2.4 Sample Time Considerations Using Clocked Conversion Trigger and Automatic Sampling Different sample/conversion sequences provide different available sampling times for the S/H channel to acquire the analog signal. The user must ensure the sampling time exceeds the sampling requirements, as outlined in Section 17.16 “A/D Sampling Requirements”. Assuming that the module is set for automatic sampling and using a clocked conversion trigger, the sampling interval is determined by the sample interval specified by the SAMC bits. If the SIMSAM bit specifies simultaneous sampling or only one channel is active, the sampling time is the period specified by the SAMC bit. Equation 17-3: Available Sampling Time, Simultaneous Sampling If the SIMSAM bit specifies sequential sampling, the total interval used to convert all channels is the number of channels times the sampling time and conversion time. The sampling time for an individual channel is the total interval minus the conversion time for that channel. Equation 17-4: Available Sampling Time, Simultaneous Sampling Note: This A/D configuration must be enabled for the configuration rates of 1 Msps and 600 ksps (see Section 17.22 “A/D Conversion Speeds” for further details). TCONV ADCLK ch1_samp ch2_samp ch3_samp ch0_samp ADRES(0) ADRES(1) ADRES(2) ADRES(3) TCONV TCONV TCONV TCONV SAMP TSAMP TSAMP DONE = 0 TSEQ = Channels per Sample (CH/S) * ((SAMC<4:0> * TAD) + Conversion Time (TCONV)) TSMP = (TSEQ – TCONV) Note 1: CH/S specified by CHPS<1:0> bits. 2: TSEQ is the total time for the sample/convert sequence. TSMP = SAMC<4:0> * TAD dsPIC30F Family Reference Manual DS70064D-page 17-24 © 2005 Microchip Technology Inc. 17.12.3 Event Trigger Conversion Start It is often desirable to synchronize the end of sampling and the start of conversion with some other time event. The A/D module may use one of three sources as a conversion trigger. 17.12.3.1 External INT Pin Trigger When SSRC<2:0> = 001, the A/D conversion is triggered by an active transition on the INT0 pin. The INT0 pin may be programmed for either a rising edge input or a falling edge input. 17.12.3.2 GP Timer Compare Trigger The A/D is configured in this Trigger mode by setting SSRC<2:0> = 010. When a match occurs between the 32-bit timer TMR3/TMR2 and the 32-bit Combined Period register PR3/PR2, a special ADC trigger event signal is generated by Timer3. This feature does not exist for the TMR5/TMR4 timer pair. Refer to Section 12. “Timers” for more details. 17.12.3.3 Motor Control PWM Trigger The PWM module has an event trigger that allows A/D conversions to be synchronized to the PWM time base. When SSRC<2:0> = 011, the A/D sampling and conversion times occur at any user programmable point within the PWM period. The special event trigger allows the user to minimize the delay between the time when A/D conversion results are acquired and the time when the duty cycle value is updated. Refer to Section 15. “Motor Control PWM” for more details. 17.12.3.4 Synchronizing A/D Operations to Internal or External Events Using the modes where an external event trigger pulse ends sampling and starts conversion (SSRC = 001, 10, 011) may be used in combination with auto-sampling (ASAM = 1) to cause the A/D to synchronize the sample conversion events to the trigger pulse source. For example, in Figure 17-11 where SSRC = 010 and ASAM = 1, the A/D will always end sampling and start conversions synchronously with the timer compare trigger event. The A/D will have a sample conversion rate that corresponds to the timer comparison event rate. See Example 17-6 for code example. Figure 17-10: Converting 1 Channel, Manual Sample Start, Conversion Trigger Based Conversion Start Conversion ADCLK SAMP ADCBUF0 TSAMP TCONV Instruction Execution BSET ADCON1,SAMP Trigger © 2005 Microchip Technology Inc. DS70064D-page 17-25 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 Figure 17-11: Converting 1 Channel, Auto-Sample Start, Conversion Trigger Based Conversion Start Example 17-6: Converting 1 Channel, Auto-Sample Start, Conversion Trigger Based Conversion Start Code ADCLK SAMP ADCBUF0 TSAMP TCONV BSET ADCON1,ASAM Instruction Execution TSAMP TCONV ADCBUF1 DONE Conversion Trigger ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 analog ADCON1 = 0x0040; // SSRC bit = 010 implies GP TMR3 // compare ends sampling and starts // converting. ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input .. // in this example RB2/AN2 is the input ADCSSL = 0; ADCON3 = 0x0000; // Sample time is TMR3, Tad = internal Tcy/2 ADCON2 = 0x0004; // Interrupt after 2 conversions // set TMR3 to time out every 125 mSecs TMR3 = 0x0000; PR3 = 0x3FFF; T3CON = 0x8010; ADCON1bits.ADON = 1; // turn ADC ON ADCON1bits.ASAM = 1; // start auto sampling every 125 mSecs while (1) // repeat continuously { while (!IFS0bits.ADIF); // conversion done? ADCValue = ADCBUF0; // yes then get first ADC value IFS0bits.ADIF = 0; // clear ADIF } // repeat dsPIC30F Family Reference Manual DS70064D-page 17-26 © 2005 Microchip Technology Inc. 17.12.3.5 Multiple Channels with Simultaneous Sampling As shown in Figure 17-12 when using simultaneous sampling, the sampling will start on all channels after setting the ASAM bit or when the last conversion ends. Sampling will stop and conversions will start when the conversion trigger occurs. Figure 17-12: Converting 4 Channels, Auto-Sample Start, Trigger Conversion Start, Simultaneous Sampling TCONV TCONV TCONV TCONV ADCLK ch1_samp ch2_samp ch3_samp ch0_samp ADCBUF0 ADCBUF1 ADCBUF2 ADCBUF3 DONE TSAMP SAMP TSAMP TSEQ Conversion Trigger Cleared in software © 2005 Microchip Technology Inc. DS70064D-page 17-27 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.12.3.6 Multiple Channels with Sequential Sampling As shown in Figure 17-13 when using sequential sampling, sampling for a particular channel will stop just prior to converting that channel and will resume after the conversion has stopped. Figure 17-13: Converting 4 Channels, Auto-Sample Start, Trigger Conversion Start, Sequential Sampling TCONV TCONV TCONV TCONV ADCLK ch1_samp ch2_samp ch3_samp ch0_samp ADCBUF0 ADCBUF1 ADCBUF2 ADCBUF3 DONE TSAMP TSAMP TSAMP TSAMP SAMP TSAMP TSEQ Conversion Trigger Cleared in software dsPIC30F Family Reference Manual DS70064D-page 17-28 © 2005 Microchip Technology Inc. 17.12.3.7 Sample Time Considerations for Automatic Sampling/Conversion Sequences Different sample/conversion sequences provide different available sampling times for the S/H channel to acquire the analog signal. The user must ensure the sampling time exceeds the sampling requirements, as outlined in Section 17.16 “A/D Sampling Requirements”. Assuming that the module is set for automatic sampling and an external trigger pulse is used as the conversion trigger, the sampling interval is a portion of the trigger pulse interval. If the SIMSAM bit specifies simultaneous sampling, the sampling time is the trigger pulse period less the time required to complete the specified conversions. Equation 17-5: Available Sampling Time, Simultaneous Sampling If the SIMSAM bit specifies sequential sampling, the sampling time is the trigger pulse period less the time required to complete only one conversion. Equation 17-6: Available Sampling Time, Sequential Sampling TSMP = Trigger Pulse Interval (TSEQ) – Channels per Sample (CH/S) * Conversion Time (TCONV) TSMP = TSEQ – (CH/S * TCONV) Note 1: CH/S specified by CHPS<1:0> bits. 2: TSEQ is the trigger pulse interval time. TSMP = Trigger Pulse Interval (TSEQ) – Conversion Time (TCONV) TSMP = TSEQ – TCONV Note: TSEQ is the trigger pulse interval time. © 2005 Microchip Technology Inc. DS70064D-page 17-29 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.13 Controlling Sample/Conversion Operation The application software may poll the SAMP and DONE bits to keep track of the A/D operations or the module can interrupt the CPU when conversions are complete. The application software may also abort A/D operations if necessary. 17.13.1 Monitoring Sample/Conversion Status The SAMP (ADCON1<1>) and DONE (ADCON1<0>) bits indicate the sampling state and the conversion state of the A/D, respectively. Generally, when the SAMP bit clears, indicating end of sampling, the DONE bit is automatically set, indicating end of conversion. If both SAMP and DONE are ‘0’, the A/D is in an inactive state. In some Operational modes, the SAMP bit may also invoke and terminate sampling. 17.13.2 Generating an A/D Interrupt The SMPI<3:0> bits control the generation of interrupts. The interrupt will occur some number of sample/conversion sequences after starting sampling and re-occur on each equivalent number of samples. Note that the interrupts are specified in terms of samples and not in terms of conversions or data samples in the buffer memory. When the SIMSAM bit specifies sequential sampling, regardless of the number of channels specified by the CHPS bits, the module samples once for each conversion and data sample in the buffer. Therefore, the value specified by the SMPI bits will correspond to the number of data samples in the buffer, up to the maximum of 16. When the SIMSAM bit specifies simultaneous sampling, the number of data samples in the buffer is related to the CHPS bits. Algorithmically, the channels/sample times the number of samples will result in the number of data sample entries in the buffer. To avoid loss of data in the buffer due to overruns, the SMPI bits must be set to the desired buffer size divided by the channels per sample. Disabling the A/D interrupt is not done with the SMPI bits. To disable the interrupt, clear the ADIE analog module interrupt enable bit. 17.13.3 Aborting Sampling Clearing the SAMP bit while in Manual Sampling mode will terminate sampling, but may also start a conversion if SSRC = 000. Clearing the ASAM bit while in Automatic Sampling mode will not terminate an on going sample/convert sequence, however, sampling will not automatically resume after subsequent conversions. 17.13.4 Aborting a Conversion Clearing the ADON bit during a conversion will abort the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. That is, the corresponding ADCBUF buffer location will continue to contain the value of the last completed conversion (or the last value written to the buffer). dsPIC30F Family Reference Manual DS70064D-page 17-30 © 2005 Microchip Technology Inc. 17.14 Specifying How Conversion Results are Written Into the Buffer As conversions are completed, the module writes the results of the conversions into the A/D result buffer. This buffer is a RAM array of sixteen 10-bit words. The buffer is accessed through 16 address locations within the SFR space named ADCBUF0...ADCBUFF. User software may attempt to read each A/D conversion result as it is generated, however, this would consume too much CPU time. Generally, to simplify the code, the module will fill the buffer with results and then generate an interrupt when the buffer is filled. 17.14.1 Number of Conversions per Interrupt The SMPI<3:0> bits (ADCON2<5:2>) will select how many A/D conversions will take place before the CPU is interrupted. This can vary from 1 sample per interrupt to 16 samples per interrupt. The A/D converter module always starts writing its conversion results at the beginning of the buffer, after each interrupt. For example, if SMPI<3:0> = 0000, the conversion results will always be written to ADCBUF0. In this example, no other buffer locations would be used. 17.14.2 Restrictions Due to Buffer Size The user cannot program a combination of CHPS and SMPI bits that specifies more than 16 conversions per interrupt when the BUFM bit (ADCON2<1>) is ‘0’, or 8 conversions per interrupt when the BUFM bit (ADCON2<1>) is ‘0’. The BUFM bit function is described below. 17.14.3 Buffer Fill Mode When the BUFM bit (ADCON2<1>) is ‘1’, the 16-word results buffer (ADRES) will be split into two 8-word groups. The 8-word buffers will alternately receive the conversion results after each interrupt event. The initial 8-word buffer used after BUFM is set will be located at the lower addresses of ADCBUF. When BUFM is ‘0’, the complete 16-word buffer is used for all conversion sequences. The decision to use the BUFM feature will depend upon how much time is available to move the buffer contents after the interrupt, as determined by the application. If the processor can quickly unload a full buffer within the time it takes to sample and convert one channel, the BUFM bit can be ‘0’ and up to 16 conversions may be done per interrupt. The processor will have one sample and conversion time before the first buffer location is overwritten. If the processor cannot unload the buffer within the sample and conversion time, the BUFM bit should be ‘1’. For example, if SMPI<3:0> = 0111, then eight conversions will be loaded into 1/2 of the buffer, following which an interrupt will occur. The next eight conversions will be loaded into the other 1/2 of the buffer. The processor will therefore have the entire time between interrupts to move the eight conversions out of the buffer. 17.14.4 Buffer Fill Status When the conversion result buffer is split using the BUFM control bit, the BUFS status bit (ADCON2<7>) indicates the half of the buffer that the A/D converter is currently filling. If BUFS = 0, then the A/D converter is filling ADCBUF0-ADCBUF7 and the user software should read conversion values from ADCBUF8-ADCBUFF. If BUFS = 1, the situation is reversed and the user software should read conversion values from ADCBUF0-ADCBUF7. © 2005 Microchip Technology Inc. DS70064D-page 17-31 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.15 Conversion Sequence Examples The following configuration examples show the A/D operation in different sampling and buffering configurations. In each example, setting the ASAM bit starts automatic sampling. A conversion trigger ends sampling and starts conversion. 17.15.1 Example: Sampling and Converting a Single Channel Multiple Times Figure 17-11 and Table 17-2 illustrate a basic configuration of the A/D. In this case, one A/D input, AN0, will be sampled by one sample and hold channel, CH0, and converted. The results are stored in the ADCBUF buffer. This process repeats 16 times until the buffer is full and then the module generates an interrupt. The entire process will then repeat. The CHPS bits specify that only sample/hold CH0 is active. With ALTS clear, only the MUX A inputs are active. The CH0SA bits and CH0NA bit are specified (AN0-VREF-) as the input to the sample/hold channel. All other input selection bits are not used. Figure 17-14: Converting One Channel 16 Times/Interrupt ADCLK SAMP ADCBUF0 TSAMP TCONV BSET ADCON1,ASAM Instruction Execution ADCBUF1 DONE ADCBUFE ADCBUFF Input to CH0 AN0 TSAMP TCONV AN0 TSAMP TCONV AN0 TSAMP TCONV AN0 ADIF ASAM Conversion Trigger dsPIC30F Family Reference Manual DS70064D-page 17-32 © 2005 Microchip Technology Inc. Table 17-2: Converting One Channel 16 Times/Interrupt CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: AN0 -> CH0 SMPI<2:0> = 1111 Convert CH0, Write Buffer 0x0 Interrupt on 16th sample Sample MUX A Inputs: AN0 -> CH0 CHPS<1:0> = 00 Convert CH0, Write Buffer 0x1 Sample Channel CH0 Sample MUX A Inputs: AN0 -> CH0 SIMSAM = n/a Convert CH0, Write Buffer 0x2 Not applicable for single channel sample Sample MUX A Inputs: AN0 -> CH0 BUFM = 0 Convert CH0, Write Buffer 0x3 Single 16-word result buffer Sample MUX A Inputs: AN0 -> CH0 ALTS = 0 Convert CH0, Write Buffer 0x4 Always use MUX A input select Sample MUX A Inputs: AN0 -> CH0 MUX A Input Select Convert CH0, Write Buffer 0x5 CH0SA<3:0> = 0000 Sample MUX A Inputs: AN0 -> CH0 Select AN0 for CH0+ input Convert CH0, Write Buffer 0x6 CH0NA = 0 Sample MUX A Inputs: AN0 -> CH0 Select VREF- for CH0- input Convert CH0, Write Buffer 0x7 CSCNA = 0 Sample MUX A Inputs: AN0 -> CH0 No input scan Convert CH0, Write Buffer 0x8 CSSL<15:0> = n/a Sample MUX A Inputs: AN0 -> CH0 Scan input select unused Convert CH0, Write Buffer 0x9 CH123SA = n/a Sample MUX A Inputs: AN0 -> CH0 Channel CH1, CH2, CH3 + input unused Convert CH0, Write Buffer 0xA CH123NA<1:0> = n/a Sample MUX A Inputs: AN0 -> CH0 Channel CH1, CH2, CH3 – input unused Convert CH0, Write Buffer 0xB MUX B Input Select Sample MUX A Inputs: AN0 -> CH0 CH0SB<3:0> = n/a Convert CH0, Write Buffer 0xC Channel CH0+ input unused Sample MUX A Inputs: AN0 -> CH0 CH0NB = n/a Convert CH0, Write Buffer 0xD Channel CH0- input unused Sample MUX A Inputs: AN0 -> CH0 CH123SB = n/a Convert CH0, Write Buffer 0xE Channel CH1, CH2, CH3 + input unused Sample MUX A Inputs: AN0 -> CH0 CH123NB<1:0> = n/a Convert CH0, Write Buffer 0xF Channel CH1, CH2, CH3 – input unused Interrupt Repeat Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 AN0 sample 1 AN0 sample 17 ADCBUF1 AN0 sample 2 AN0 sample 18 ADCBUF2 AN0 sample 3 AN0 sample 19 ADCBUF3 AN0 sample 4 AN0 sample 20 ADCBUF4 AN0 sample 5 AN0 sample 21 ADCBUF5 AN0 sample 6 AN0 sample 22 ADCBUF6 AN0 sample 7 AN0 sample 23 ADCBUF7 AN0 sample 8 AN0 sample 24 ••• ADCBUF8 AN0 sample 9 AN0 sample 25 ADCBUF9 AN0 sample 10 AN0 sample 26 ADCBUFA AN0 sample 11 AN0 sample 27 ADCBUFB AN0 sample 12 AN0 sample 28 ADCBUFC AN0 sample 13 AN0 sample 29 ADCBUFD AN0 sample 14 AN0 sample 30 ADCBUFE AN0 sample 15 AN0 sample 31 ADCBUFF AN0 sample 16 AN0 sample 32 © 2005 Microchip Technology Inc. DS70064D-page 17-33 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.15.2 Example: A/D Conversions While Scanning Through All Analog Inputs Figure 17-15 and Table 17-3 illustrate a very typical setup where all available analog input channels are sampled by one sample and hold channel, CH0, and converted. The set CSCNA bit specifies scanning of the A/D inputs to the CH0 positive input. Other conditions are similar to Subsection 17.15.1. Initially, the AN0 input is sampled by CH0 and converted. The result is stored in the ADCBUF buffer. Then the AN1 input is sampled and converted. This process of scanning the inputs repeats 16 times until the buffer is full and then the module generates an interrupt. The entire process will then repeat. Figure 17-15: Scanning Through 16 Inputs/Interrupt ADCLK SAMP ADCBUF0 TSAMP TCONV BSET ADCON1,#ASAM Instruction Execution ADCBUF1 DONE ADCBUFE ADCBUFF Input to CH0 AN0 TSAMP TCONV AN1 TSAMP TCONV AN14 TSAMP TCONV AN15 ADIF ASAM Conversion Trigger dsPIC30F Family Reference Manual DS70064D-page 17-34 © 2005 Microchip Technology Inc. Table 17-3: Scanning Through 16 Inputs/Interrupt CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: AN0 -> CH0 SMPI<2:0> = 1111 Convert CH0, Write Buffer 0x0 Interrupt on 16th sample Sample MUX A Inputs: AN1 -> CH0 CHPS<1:0> = 00 Convert CH0, Write Buffer 0x1 Sample Channel CH0 Sample MUX A Inputs: AN2 -> CH0 SIMSAM = n/a Convert CH0, Write Buffer 0x2 Not applicable for single channel sample Sample MUX A Inputs: AN3 -> CH0 BUFM = 0 Convert CH0, Write Buffer 0x3 Single 16-word result buffer Sample MUX A Inputs: AN4 -> CH0 ALTS = 0 Convert CH0, Write Buffer 0x4 Always use MUX A input select Sample MUX A Inputs: AN5 -> CH0 MUX A Input Select Convert CH0, Write Buffer 0x5 CH0SA<3:0> = n/a Sample MUX A Inputs: AN6 -> CH0 Override by CSCNA Convert CH0, Write Buffer 0x6 CH0NA = 0 Sample MUX A Inputs: AN7 -> CH0 Select VREF- for CH0- input Convert CH0, Write Buffer 0x7 CSCNA = 1 Sample MUX A Inputs: AN8 -> CH0 Scan CH0+ Inputs Convert CH0, Write Buffer 0x8 CSSL<15:0> = 1111 1111 1111 1111 Sample MUX A Inputs: AN9 -> CH0 Scan input select unused Convert CH0, Write Buffer 0x9 CH123SA = n/a Sample MUX A Inputs: AN10 -> CH0 Channel CH1, CH2, CH3 + input unused Convert CH0, Write Buffer 0xA CH123NA<1:0> = n/a Sample MUX A Inputs: AN11 -> CH0 Channel CH1, CH2, CH3 – input unused Convert CH0, Write Buffer 0xB MUX B Input Select Sample MUX A Inputs: AN12 -> CH0 CH0SB<3:0> = n/a Convert CH0, Write Buffer 0xC Channel CH0+ input unused Sample MUX A Inputs: AN13 -> CH0 CH0NB = n/a Convert CH0, Write Buffer 0xD Channel CH0- input unused Sample MUX A Inputs: AN14 -> CH0 CH123SB = n/a Convert CH0, Write Buffer 0xE Channel CH1, CH2, CH3 + input unused Sample MUX A Inputs: AN15 -> CH0 CH123NB<1:0> = n/a Convert CH0, Write Buffer 0xF Channel CH1, CH2, CH3 – input unused Interrupt Repeat Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 AN0 sample 1 AN0 sample 17 ADCBUF1 AN1 sample 2 AN1 sample 18 ADCBUF2 AN2 sample 3 AN2 sample 19 ADCBUF3 AN3 sample 4 AN3 sample 20 ADCBUF4 AN4 sample 5 AN4 sample 21 ADCBUF5 AN5 sample 6 AN5 sample 22 ADCBUF6 AN6 sample 7 AN6 sample 23 ADCBUF7 AN7 sample 8 AN7 sample 24 ••• ADCBUF8 AN8 sample 9 AN8 sample 25 ADCBUF9 AN9 sample 10 AN9 sample 26 ADCBUFA AN10 sample 11 AN10 sample 27 ADCBUFB AN11 sample 12 AN11 sample 28 ADCBUFC AN12 sample 13 AN12 sample 29 ADCBUFD AN13 sample 14 AN13 sample 30 ADCBUFE AN14 sample 15 AN14 sample 31 ADCBUFF AN15 sample 16 AN15 sample 32 © 2005 Microchip Technology Inc. DS70064D-page 17-35 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.15.3 Example: Sampling Three Inputs Frequently While Scanning Four Other Inputs Figure 17-16 and Table 17-4 shows how the A/D converter could be configured to sample three inputs frequently using sample/hold channels CH1, CH2 and CH3; while four other inputs are sampled less frequently by scanning them using sample/hold channel CH0. In this case, only MUX A inputs are used, and all 4 channels are sampled simultaneously. Four different inputs (AN4, AN5, AN6, AN7) are scanned in CH0, whereas AN0, AN1 and AN2 are the fixed inputs for CH1, CH2 and CH3, respectively. Thus, in every set of 16 samples, AN0, AN1 and AN2 would be sampled 4 times, while AN4, AN5, AN6 and AN7 would be sampled only once each. Figure 17-16: Converting Three Inputs, Four Times and Four Inputs, One Time/Interrupt ADCLK SAMP DONE Input to CH0 AN4 TSAMP ADIF TCONVTCONVTCONVTCONV AN0 AN1 AN2 Input to CH1 Input to CH2 Input to CH3 ADCBUFD ADCBUFE ADCBUFF AN5 TSAMP AN0 AN1 AN2 AN7 TSAMP AN0 AN1 AN2 ASAM AN4 AN0 AN1 AN2 ADCBUF0 ADCBUF1 ADCBUF2 ADCBUF3 ADCBUFC AN6 AN0 AN1 AN2 Conversion Trigger TCONVTCONVTCONVTCONV TCONVTCONVTCONVTCONV dsPIC30F Family Reference Manual DS70064D-page 17-36 © 2005 Microchip Technology Inc. Table 17-4: Converting Three Inputs, Four Times and Four Inputs, One Time/Interrupt CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: SMPI<3:0> = 0011 AN4 -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 Interrupt on 16th sample Convert CH0, Write Buffer 0x0 CHPS<1:0> = 1x Convert CH1, Write Buffer 0x1 Sample Channels CH0, CH1, CH2, CH3 Convert CH2, Write Buffer 0x2 SIMSAM = 1 Convert CH3, Write Buffer 0x3 Sample all channels simultaneously Sample MUX A Inputs: BUFM = 0 AN5 -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 Single 16-word result buffer Convert CH0, Write Buffer 0x4 ALTS = 0 Convert CH1, Write Buffer 0x5 Always use MUX A input select Convert CH2, Write Buffer 0x6 MUX A Input Select Convert CH3, Write Buffer 0x7 CH0SA<3:0> = n/a Sample MUX A Inputs: Override by CSCNA AN6 -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 CH0NA = 0 Convert CH0, Write Buffer 0x8 Select VREF- for CH0- input Convert CH1, Write Buffer 0x9 CSCNA = 1 Convert CH2, Write Buffer 0xA Scan CH0+ Inputs Convert CH3, Write Buffer 0xB CSSL<15:0> = 0000 0000 1111 0000 Sample MUX A Inputs: Scan AN4, AN5, AN6, AN7 AN7 -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 CH123SA = 0 Convert CH0, Write Buffer 0xC CH1+ = AN0, CH2+ = AN1, CH3+ = AN2 Convert CH1, Write Buffer 0xD CH123NA<1:0> = 0x Convert CH2, Write Buffer 0xE CH1-, CH2-, CH3- = VREF- Convert CH3, Write Buffer 0xF MUX B Input Select Interrupt CH0SB<3:0> = n/a Repeat Channel CH0+ input unused CH0NB = n/a Channel CH0- input unused CH123SB = n/a Channel CH1, CH2, CH3 + input unused CH123NB<1:0> = n/a Channel CH1, CH2, CH3 – input unused Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 AN4 sample 1 AN4 sample 5 ADCBUF1 AN0 sample 1 AN0 sample 5 ADCBUF2 AN1 sample 1 AN1 sample 5 ADCBUF3 AN2 sample 1 AN2 sample 5 ADCBUF4 AN5 sample 2 AN5 sample 6 ADCBUF5 AN0 sample 2 AN0 sample 6 ADCBUF6 AN1 sample 2 AN1 sample 6 ADCBUF7 AN2 sample 2 AN2 sample 6 ••• ADCBUF8 AN6 sample 3 AN6 sample 7 ADCBUF9 AN0 sample 3 AN0 sample 7 ADCBUFA AN1 sample 3 AN1 sample 7 ADCBUFB AN2 sample 3 AN2 sample 7 ADCBUFC AN7 sample 4 AN7 sample 8 ADCBUFD AN0 sample 4 AN0 sample 8 ADCBUFE AN1 sample 4 AN1 sample 8 ADCBUFF AN2 sample 4 AN2 sample 8 © 2005 Microchip Technology Inc. DS70064D-page 17-37 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.15.4 Example: Using Dual 8-Word Buffers Figure 17-17 and Table 17-5 demonstrate using dual 8-word buffers and alternating the buffer fill. Setting the BUFM bit enables dual 8-word buffers. The BUFM setting does not affect other operational parameters. First, the conversion sequence starts filling the buffer at ADCBUF0 (buffer location 0x0). After the first interrupt occurs, the buffer begins to fill at ADCBUF8 (buffer location 0x8). The BUFS status bit is set and cleared alternately after each interrupt. In this example, all four channels are sampled simultaneously, and an interrupt occurs after every sample. Figure 17-17: Converting Four Inputs, One Time/Interrupt Using Dual 8-Word Buffers ADCLK SAMP ADCBUF0 BSET ADCON1,#ASAM Instruction Execution ADCBUF1 ADCBUF2 ADCBUF3 Input to CH0 AN3 TSAMP ADIF AN0 AN1 AN2 Input to CH1 Input to CH2 Input to CH3 ADCBUF8 ADCBUF9 ADCBUFA ADCBUFB AN3 TSAMP AN0 AN1 AN2 AN3 TSAMP AN0 AN1 AN2 BCLR IFS0,#ADIF BCLR IFS0,#ADIF BUFS Conversion Trigger TCONVTCONVTCONVTCONV TCONVTCONVTCONVTCONV TCONVTCONVTCONVTCONV dsPIC30F Family Reference Manual DS70064D-page 17-38 © 2005 Microchip Technology Inc. Table 17-5: Converting Four Inputs, One Time/Interrupt Using Dual 8-Word Buffers CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: SMPI<2:0> = 0000 AN3 -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 Interrupt on each sample Convert CH0, Write Buffer 0x0 CHPS<1:0> = 1x Convert CH1, Write Buffer 0x1 Sample Channels CH1, CH2, CH3, CH0 Convert CH2, Write Buffer 0x2 SIMSAM = 1 Convert CH3, Write Buffer 0x3 Sample all channels simultaneously Interrupt; Change Buffer BUFM = 1 Sample MUX A Inputs: Dual 8-word result buffers AN3 -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 ALTS = 0 Convert CH0, Write Buffer 0x8 Always use MUX A input select Convert CH1, Write Buffer 0x9 MUX A Input Select Convert CH2, Write Buffer 0xA CH0SA<3:0> = 0011 Convert CH3, Write Buffer 0xB Select AN3 for CH0+ input Interrupt; Change Buffer CH0NA = 0 Repeat Select VREF- for CH0- input CSCNA = 0 No input scan CSSL<15:0> = n/a Scan input select unused CH123SA = 0 CH1+ = AN0, CH2+ = AN1, CH3+ = AN2 CH123NA<1:0> = 0x CH1-, CH2-, CH3- = VREFMUX B Input Select CH0SB<3:0> = n/a Channel CH0+ input unused CH0NB = n/a Channel CH0- input unused CH123SB = n/a Channel CH1, CH2, CH3 + input unused CH123NB<1:0> = n/a Channel CH1, CH2, CH3 – input unused Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 AN3 sample 1 ADCBUF1 AN0 sample 1 ADCBUF2 AN1 sample 1 ADCBUF3 AN2 sample 1 ADCBUF4 ADCBUF5 ADCBUF6 ADCBUF7 ••• ADCBUF8 AN3 sample 2 ADCBUF9 AN0 sample 2 ADCBUFA AN1 sample 2 ADCBUFB AN2 sample 2 ADCBUFC ADCBUFD ADCBUFE ADCBUFF © 2005 Microchip Technology Inc. DS70064D-page 17-39 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.15.5 Example: Using Alternating MUX A, MUX B Input Selections Figure 17-18 and Table 17-6 demonstrate alternate sampling of the inputs assigned to MUX A and MUX B. In this example, 2 channels are enabled to sample simultaneously. Setting the ALTS bit enables alternating input selections. The first sample uses the MUX A inputs specified by the CH0SA, CH0NA, CHXSA and CHXNA bits. The next sample uses the MUX B inputs specified by the CH0SB, CH0NB, CHXSB and CHXNB bits. In this example, one of the MUX B input specifications uses 2 analog inputs as a differential source to the sample/hold, sampling (AN3-AN9). This example also demonstrates use of the dual 8-word buffers. An interrupt occurs after every 4th sample, resulting in filling 8-words into the buffer on each interrupt. Note that using 4 sample/hold channels without alternating input selections results in the same number of conversions as this example, using 2 channels with alternating input selections. However, because the CH1, CH2 and CH3 channels are more limited in the selectivity of the analog inputs, this example method provides more flexibility of input selection than using 4 channels. Figure 17-18: Converting Two Sets of Two Inputs Using Alternating Input Selections ADCLK SAMP ADCBUF0 ADCBUF1 DONE ADCBUF2 ADCBUF3 Input to AN1 TSAMP ADIF TCONVTCONV AN0 Input to ADCBUF4 ADCBUF5 ADCBUF6 ADCBUF7 AN15 TSAMP TCONVTCONV AN3-AN9 ASAM BUFS AN1 TSAMP TCONVTCONV AN0 AN15 TSAMP TCONVTCONV AN3-AN9 ADCBUF8 ADCBUF9 ADCBUFA ADCBUFB TCONVTCONV TSAMP AN15 AN3-AN9 Cleared by Software CH0 CH1 Conversion Trigger Cleared in software dsPIC30F Family Reference Manual DS70064D-page 17-40 © 2005 Microchip Technology Inc. Table 17-6: Converting Two Sets of Two Inputs Using Alternating Input Selections CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: AN1 -> CH0, AN0 -> CH1 SMPI<2:0> = 0011 Convert CH0, Write Buffer 0x0 Interrupt on 4th sample Convert CH1, Write Buffer 0x1 CHPS<1:0> = 01 Sample MUX B Inputs: AN15 -> CH0, (AN3-AN9) -> CH1 Sample Channels CH0, CH1 Convert CH0, Write Buffer 0x2 SIMSAM = 1 Convert CH1, Write Buffer 0x3 Sample all channels simultaneously Sample MUX A Inputs: AN1 -> CH0, AN0 -> CH1 BUFM = 1 Convert CH0, Write Buffer 0x4 Dual 8-word result buffers Convert CH1, Write Buffer 0x5 ALTS = 1 Sample MUX B Inputs: AN15 -> CH0, (AN3-AN9) -> CH1 Alternate MUX A/B input select Convert CH0, Write Buffer 0x6 MUX A Input Select Convert CH1, Write Buffer 0x7 CH0SA<3:0> = 0001 Interrupt; Change Buffer Select AN1 for CH0+ input Sample MUX A Inputs: AN1 -> CH0, AN0 -> CH1 CH0NA = 0 Convert CH0, Write Buffer 0x8 Select VREF- for CH0- input Convert CH1, Write Buffer 0x9 CSCNA = 0 Sample MUX B Inputs: AN15 -> CH0, (AN3-AN9) -> CH1 No input scan Convert CH0, Write Buffer 0xA CSSL<15:0> = n/a Convert CH1, Write Buffer 0xB Scan input select unused Sample MUX A Inputs: AN1 -> CH0, AN0 -> CH1 CH123SA = 0 Convert CH0, Write Buffer 0xC CH1+ = AN0, CH2+ = AN1, CH3+ = AN2 Convert CH1, Write Buffer 0xD CH123NA<1:0> = 0x Sample MUX B Inputs: AN15 -> CH0, (AN3-AN9) -> CH1 CH1-, CH2-, CH3- = VREF- Convert CH0, Write Buffer 0xE MUX B Input Select Convert CH1, Write Buffer 0xF CH0SB<3:0> = 1111 Interrupt; Change Buffer Select AN15 for CH0+ input Repeat CH0NB = 0 Select VREF- for CH0- input CH123SB = 1 CH1+ = AN3, CH2+ = AN4, CH3+ = AN5 CH123NB<1:0> = 11 CH1- = AN9, CH2- = AN10, CH3- = AN11 Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 AN1 sample 1 ADCBUF1 AN0 sample 1 ADCBUF2 AN15 sample 2 ADCBUF3 (AN3-AN9) sample 2 ADCBUF4 AN1 sample 3 ADCBUF5 AN0 sample 3 ADCBUF6 AN15 sample 4 ADCBUF7 (AN3-AN9) sample 4 ••• ADCBUF8 AN1 sample 5 ADCBUF9 AN0 sample 5 ADCBUFA AN15 sample 6 ADCBUFB (AN3-AN9) sample 6 ADCBUFC AN1 sample 7 ADCBUFD AN0 sample 7 ADCBUFE AN15 sample 8 ADCBUFF (AN3-AN9) sample 8 © 2005 Microchip Technology Inc. DS70064D-page 17-41 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.15.6 Example: Sampling Eight Inputs Using Simultaneous Sampling Subsection 17.15.6 and Subsection 17.15.7 demonstrate identical setups with the exception that Subsection 17.15.6 uses simultaneous sampling with SIMSAM = 1 and Subsection 17.15.7 uses sequential sampling with SIMSAM = 0. Both examples use alternating inputs and specify differential inputs to the sample/hold. Figure 17-19 and Table 17-7 demonstrate simultaneous sampling. When converting more than one channel and selecting simultaneous sampling, the module will sample all channels, then perform the required conversions in sequence. In this example, with ASAM set, sampling will begin after the conversions complete. Figure 17-19: Sampling Eight Inputs Using Simultaneous Sampling ADCLK SAMP DONE Input to CH0 AN13-AN1 TSAMP ADIF AN0 AN1 AN2 Input to CH1 Input to CH2 Input to CH3 ADCBUFD ADCBUFE ADCBUFF AN14 TSAMP AN3-AN6 AN4-AN7 AN5-AN8 AN14 TSAMP AN3-AN6 AN4-AN7 AN5-AN8 ASAM AN13-AN1 AN0 AN1 AN2 ADCBUF0 ADCBUF1 ADCBUF2 ADCBUF3 ADCBUFC Conversion Trigger TCONVTCONVTCONVTCONV TCONVTCONVTCONVTCONV TCONVTCONVTCONVTCONV dsPIC30F Family Reference Manual DS70064D-page 17-42 © 2005 Microchip Technology Inc. Table 17-7: Sampling Eight Inputs Using Simultaneous Sampling CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: SMPI<2:0> = 0011 (AN13-AN1) -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 Interrupt on 4th sample Convert CH0, Write Buffer 0x0 CHPS<1:0> = 1x Convert CH1, Write Buffer 0x1 Sample Channels CH0, CH1, CH2, CH3 Convert CH2, Write Buffer 0x2 SIMSAM = 1 Convert CH3, Write Buffer 0x3 Sample all channels simultaneously Sample MUX B Inputs: BUFM = 0 AN14 -> CH0, Single 16-word result buffer (AN3-AN6) -> CH1, (AN4-AN7) -> CH2, (AN5-AN8) -> CH3 ALTS = 1 Convert CH0, Write Buffer 0x4 Alternate MUX A/MUX B input select Convert CH1, Write Buffer 0x5 MUX A Input Select Convert CH2, Write Buffer 0x6 CH0SA<3:0> = 1101 Convert CH3, Write Buffer 0x7 Select AN13 for CH0+ input Sample MUX A Inputs: CH0NA = 1 (AN13-AN1) -> CH0, AN0 -> CH1, AN1 -> CH2, AN2 -> CH3 Select AN1 for CH0- input Convert CH0, Write Buffer 0x8 CSCNA = 0 Convert CH1, Write Buffer 0x9 No input scan Convert CH2, Write Buffer 0xA CSSL<15:0> = n/a Convert CH3, Write Buffer 0xB Scan input select unused Sample MUX B Inputs: CH123SA = 0 AN14 -> CH0, CH1+ = AN0, CH2+ = AN1, CH3+ = AN2 (AN3-AN6) -> CH1, (AN4-AN7) -> CH2, (AN5-AN8) -> CH3 CH123NA<1:0> = 0x Convert CH0, Write Buffer 0xC CH1-, CH2-, CH3- = VREF- Convert CH1, Write Buffer 0xD MUX B Input Select Convert CH2, Write Buffer 0xE CH0SB<3:0> = 1110 Convert CH3, Write Buffer 0xF Select AN14 for CH0+ input Interrupt CH0NB = 0 Repeat Select VREF- for CH0- input CH123SB = 1 CH1+ = AN3, CH2+ = AN4, CH3+ = AN5 CH123NB<1:0> = 10 CH1- = AN6, CH2- = AN7, CH3- = AN8 Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 (AN13-AN1) sample 1 (AN13-AN1) sample 5 ADCBUF1 AN0 sample 1 AN0 sample 5 ADCBUF2 AN1 sample 1 AN1 sample 5 ADCBUF3 AN2 sample 1 AN2 sample 5 ADCBUF4 AN14 sample 2 AN14 sample 6 ADCBUF5 (AN3-AN6) sample 2 (AN3-AN6) sample 6 ADCBUF6 (AN4-AN7) sample 2 (AN4-AN7) sample 6 ADCBUF7 (AN5-AN8) sample 2 (AN5-AN8) sample 6 ••• ADCBUF8 (AN13-AN1) sample 3 (AN13-AN1) sample 7 ADCBUF9 AN0 sample 3 AN0 sample 7 ADCBUFA AN1 sample 3 AN1 sample 7 ADCBUFB AN2 sample 3 AN2 sample 7 ADCBUFC AN14 sample 4 AN14 sample 8 ADCBUFD (AN3-AN6) sample 4 (AN3-AN6) sample 8 ADCBUFE (AN4-AN7) sample 4 (AN4-AN7) sample 8 ADCBUFF (AN5-AN8) sample 4 (AN5-AN8) sample 8 © 2005 Microchip Technology Inc. DS70064D-page 17-43 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.15.7 Example: Sampling Eight Inputs Using Sequential Sampling Figure 17-20 and Table 17-8 demonstrate sequential sampling. When converting more than one channel and selecting sequential sampling, the module will start sampling a channel at the earliest opportunity, then perform the required conversions in sequence. In this example, with ASAM set, sampling of a channel will begin after the conversion of that channel completes. When ASAM is clear, sampling will not resume after conversion completion but will occur when setting the SAMP bit. When utilizing more than one channel, sequential sampling provides more sampling time since a channel may be sampled while conversion occurs on another. Figure 17-20: Sampling Eight Inputs Using Sequential Sampling ADCLK SAMP DONE Input to CH0 AN13-AN1 TSAMP ADIF AN0 AN1 AN2 Input to CH1 Input to CH2 Input to CH3 ADCBUFD ADCBUFE ADCBUFF AN14 TSAMP AN4-AN7 AN5-AN8 AN14 TSAMP AN3-AN6 AN4-AN7 AN5-AN8 ASAM AN1 AN2 ADCBUF0 ADCBUF1 ADCBUF2 ADCBUF3 ADCBUFC AN13-AN1 AN0 AN2 Conversion Trigger TCONVTCONVTCONVTCONV TCONVTCONVTCONVTCONV TCONVTCONVTCONVTCONV AN3-AN6 AN1 AN13-AN1 AN0 dsPIC30F Family Reference Manual DS70064D-page 17-44 © 2005 Microchip Technology Inc. Table 17-8: Sampling Eight Inputs Using Sequential Sampling CONTROL BITS OPERATION SEQUENCE Sequence Select Sample: (AN13-AN1) -> CH0 SMPI<2:0> = 1111 Convert CH0, Write Buffer 0x0 Interrupt on 16th sample Sample: AN0 -> CH1 CHPS<1:0> = 1x Convert CH1, Write Buffer 0x1 Sample Channels CH0, CH1, CH2, CH3 Sample: AN1 -> CH2 SIMSAM = 0 Convert CH2, Write Buffer 0x2 Sample all channels sequentially Sample: AN2 -> CH3 BUFM = 0 Convert CH3, Write Buffer 0x3 Single 16-word result buffer Sample: AN14 -> CH0 ALTS = 1 Convert CH0, Write Buffer 0x4 Alternate MUX A/B input select Sample: (AN3-AN6) -> CH1 MUX A Input Select Convert CH1, Write Buffer 0x5 CH0SA<3:0> = 0110 Sample: (AN4-AN7) -> CH2 Select AN6 for CH0+ input Convert CH2, Write Buffer 0x6 CH0NA = 0 Sample: (AN5-AN8) -> CH3 Select VREF- for CH0- input Convert CH3, Write Buffer 0x7 CSCNA = 0 Sample: (AN13-AN1) -> CH0 No input scan Convert CH0, Write Buffer 0x8 CSSL<15:0> = n/a Sample: AN0 -> CH1 Scan input select unused Convert CH1, Write Buffer 0x9 CH123SA = 0 Sample: AN1 -> CH2 CH1+ = AN0, CH2+ = AN1, CH3+ = AN2 Convert CH2, Write Buffer 0xA CH123NA<1:0> = 0x Sample: AN2 -> CH3 CH1-, CH2-, CH3- = VREF- Convert CH3, Write Buffer 0xB MUX B Input Select Sample: AN14 -> CH0 CH0SB<3:0> = 0111 Convert CH0, Write Buffer 0xC Select AN7 for CH0+ input Sample: (AN3-AN6) -> CH1 CH0NB = 0 Convert CH1, Write Buffer 0xD Select VREF- for CH0- input Sample: (AN4-AN7) -> CH2 CH123SB = 1 Convert CH2, Write Buffer 0xE CH1+ = AN3, CH2+ = AN4, CH3+ = AN5 Sample: (AN5-AN8) -> CH3 CH123NB<1:0> = 0x Convert CH3, Write Buffer 0xF CH1-, CH2-, CH3- = VREF- Interrupt Repeat Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 (AN13-AN1) sample 1 (AN13-AN1) sample 17 ADCBUF1 AN0 sample 2 AN0 sample 18 ADCBUF2 AN1 sample 3 AN1 sample 19 ADCBUF3 AN2 sample 4 AN2 sample 20 ADCBUF4 AN14 sample 5 AN14 sample 21 ADCBUF5 (AN3-AN6) sample 6 (AN3-AN6) sample 22 ADCBUF6 (AN4-AN7) sample 7 (AN4-AN7) sample 23 ADCBUF7 (AN5-AN8) sample 8 (AN5-AN8) sample 24 ••• ADCBUF8 (AN13-AN1) sample 9 (AN13-AN1) sample 25 ADCBUF9 AN0 sample 10 AN0 sample 26 ADCBUFA AN1 sample 11 AN1 sample 27 ADCBUFB AN2 sample 12 AN2 sample 28 ADCBUFC AN14 sample 13 AN14 sample 29 ADCBUFD (AN3-AN6) sample 14 (AN3-AN6) sample 30 ADCBUFE (AN4-AN7) sample 15 (AN4-AN7) sample 31 ADCBUFF (AN5-AN8) sample 16 (AN5-AN8) sample 32 © 2005 Microchip Technology Inc. DS70064D-page 17-45 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.16 A/D Sampling Requirements The analog input model of the 10-bit A/D converter is shown in Figure 17-21. The total sampling time for the A/D is a function of the internal amplifier settling time and the holding capacitor charge time. For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the voltage level on the analog input pin. The analog output source impedance (RS), the interconnect impedance (RIC), and the internal sampling switch (RSS) impedance combine to directly affect the time required to charge the capacitor CHOLD. The combined impedance must therefore be small enough to fully charge the holding capacitor within the chosen sample time. To minimize the effects of pin leakage currents on the accuracy of the A/D converter, the maximum recommended source impedance, RS, is 5 kΩ for the conversion rates of up to 500 ksps and a maximum of 500Ω for conversion rates of up to 1 Msps. After the analog input channel is selected (changed), this sampling function must be completed prior to starting the conversion. The internal holding capacitor will be in a discharged state prior to each sample operation. At least 1 TAD time period should be allowed between conversions for the sample time. For more details, see the device electrical specifications. Figure 17-21: 10-bit A/D Converter Analog Input Model VA CPIN Rs ANx VT = 0.6V VT = 0.6V I leakage RIC ≤ 250Ω Sampling Switch RSS CHOLD = DAC capacitance VSS VDD ± 500 nA = 4.4 pF Legend: CPIN VT I leakage RIC RSS CHOLD = input capacitance = threshold voltage = leakage current at the pin due to = interconnect resistance = sampling switch resistance = sample/hold capacitance (from DAC) various junctions Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 5 kΩ. RSS ≤ 3 kΩ dsPIC30F Family Reference Manual DS70064D-page 17-46 © 2005 Microchip Technology Inc. 17.17 Reading the A/D Result Buffer The RAM is 10-bits wide, but the data is automatically formatted to one of four selectable formats when a read from the buffer is performed. The FORM<1:0> bits (ADCON1<9:8>) select the format. The formatting hardware provides a 16-bit result on the data bus for all of the data formats. Figure 17-22 shows the data output formats that can be selected using the FORM<1:0> control bits. Figure 17-22: A/D Output Data Formats Figure 17-23: Numerical Equivalents of Various Result Codes RAM Contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Read to Bus: Integer 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Signed Integer d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Fractional (1.15) d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 0 0 Signed Fractional (1.15) d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 0 0 VIN/VREF 10-bit Output Code 16-bit Integer Format 16-bit Signed Integer Format 16-bit Fractional Format 16-bit Signed Fractional Format 1023/1024 11 1111 1111 0000 0011 1111 1111 = 1023 0000 0001 1111 1111 = 511 1111 1111 1100 0000 = 0.999 0111 1111 1100 0000 = 0.499 1022/1024 11 1111 1110 0000 0011 1111 1110 = 1022 0000 0001 1111 1110 = 5 10 1111 1111 1000 0000 = 0.998 0111 1111 1000 0000 = 0.498 ••• 513/1024 10 0000 0001 0000 0010 0000 0001 = 513 0000 0000 0000 0001 = 1 1000 0000 0100 0000 = 0.501 0 000 0000 0100 0000 = 0.001 512/1024 10 0000 0000 0000 0010 0000 0000 = 512 0000 0000 0000 0000 = 0 1000 0000 0000 0000 = 0.500 0000 0000 0000 0000 = 0.000 511/1024 01 1111 1111 0000 0001 1111 1111 = 511 1111 1111 1111 1111 = -1 0111 1111 1100 0000 = .499 1111 1111 1100 0000 = -0.001 ••• 1/1024 00 0000 0001 0000 0000 0000 0001 = 1 1111 1110 0000 0001 = -511 0000 0000 0100 0000 = 0.001 1000 0000 0100 0000 = -0.499 0/1024 00 0000 0000 0000 0000 0000 0000 = 0 1111 1110 0000 0000 = -512 0000 0000 0000 0000 = 0.000 1000 0000 0000 0000 = -0.500 © 2005 Microchip Technology Inc. DS70064D-page 17-47 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.18 Transfer Function The ideal transfer function of the A/D converter is shown in Figure 17-24. The difference of the input voltages, (VINH – VINL), is compared to the reference, (VREFH – VREFL). • The first code transition occurs when the input voltage is (VREFH – VREFL/2048) or 0.5 LSb. • The 00 0000 0001 code is centered at (VREFH – VREFL/1024) or 1.0 LSb. • The 10 0000 0000 code is centered at (512*(VREFH – VREFL)/1024). • An input voltage less than (1*(VREFH – VREFL)/2048) converts as 00 0000 0000. • An input greater than (2045*(VREFH – VREFL)/2048) converts as 11 1111 1111. Figure 17-24: A/D Transfer Function 17.19 A/D Accuracy/Error Refer to Section 17.27 “Related Application Notes”for a list of documents that discuss A/D accuracy. 17.20 Connection Considerations Since the analog inputs employ ESD protection, they have diodes to VDD and VSS. This requires that the analog input must be between VDD and VSS. If the input voltage exceeds this range by greater than 0.3V (either direction), one of the diodes becomes forward biased and it may damage the device if the input current specification is exceeded. An external RC filter is sometimes added for anti-aliasing of the input signal. The R component should be selected to ensure that the sampling time requirements are satisfied. Any external components connected (via high-impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. 10 0000 0010 (= 514) 10 0000 0011 (= 515) 01 1111 1101 (= 509) 01 1111 1110 (= 510) 01 1111 1111 (= 511) 11 1111 1110 (= 1022) 11 1111 1111 (= 1023) 00 0000 0000 (= 0) 00 0000 0001 (= 1) Output Code 10 0000 0000 (= 512) (VINH – VINL) VREFL VREFH – VREFL 1024 VREFH VREFL + 10 0000 0001 (= 513) 512*(VREFH – VREFL) 1024 VREFL + 1023*(VREFH – VREFL) 1024 VREFL + dsPIC30F Family Reference Manual DS70064D-page 17-48 © 2005 Microchip Technology Inc. 17.21 Initialization Example 17-7 shows a simple initialization code example for the A/D module. In this particular configuration, all 16 analog input pins, AN0-AN15, are set up as analog inputs. Operation in Idle mode is disabled output data is in unsigned fractional format, and AVDD and AVSS are used for VREFH and VREFL. The start of sampling, as well as start of conversion (conversion trigger), are performed manually in software. The CH0 S/H amplifier is used for conversions. Scanning of inputs is disabled, and an interrupt occurs after every sample/convert sequence (1 conversion result). The A/D conversion clock is TCY/2. Since sampling is started manually by setting the SAMP bit (ADCON1<1>) after each conversion is complete, the auto-sample time bits, SAMC<4:0> (ADCON3<12:8>), are ignored. Moreover, since the start of conversion (i.e., end of sampling) is also triggered manually, the SAMP bit needs to be cleared each time a new sample needs to be converted. Example 17-7: A/D Initialization Code Example CLR ADPCFG ; Configure A/D port, ; all input pins are analog MOV #0x2208,W0 MOV W0,ADCON1 ; Configure sample clock source ; and conversion trigger mode. ; Unsigned Fractional format, ; Manual conversion trigger, ; Manual start of sampling, ; Simultaneous sampling, ; No operation in IDLE mode. CLR ADCON2 ; Configure A/D voltage reference ; and buffer fill modes. ; VREF from AVDD and AVSS, ; Inputs are not scanned, ; 1 S/H channel used, ; Interrupt every sample CLR ADCON3 ; Configure A/D conversion clock CLR ADCHS ; Configure input channels, ; CH0+ input is AN0. ; CHO- input is VREFL (AVss) CLR ADCSSL ; No inputs are scanned. BCLR IFS0,#ADIF ; Clear A/D conversion interrupt ; Configure A/D interrupt priority bits (ADIP<2:0>) here, if ; required. (default priority level is 4) BSET IEC0,#ADIE ; Enable A/D conversion interrupt BSET ADCON1,#ADON ; Turn on A/D BSET ADCON1,#SAMP ; Start sampling the input CALL DELAY ; Ensure the correct sampling time has ; elapsed before starting conversion. BCLR ADCON1,#SAMP ; End A/D Sampling and start Conversion : ; The DONE bit is set by hardware when : ; the convert sequence is finished : ; The ADIF bit will be set. © 2005 Microchip Technology Inc. DS70064D-page 17-49 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.22 A/D Conversion Speeds The dsPIC30F 10-bit A/D converter specifications permit a maximum 1 Msps sampling rate. The table below summarizes the conversion speeds for the dsPIC30F 10-bit A/D converter and the required operating conditions. Table 17-9: 10-bit Conversion Rate Parameters dsPIC30F 10-bit A/D Converter Conversion Rates A/D Speed TAD Minimum Sampling Time Min Rs Max VDD Temperature A/D Channels Configuration Up to 1 MSps(1) 83.33 ns 12 TAD 500 Ω 4.5V to 5.5V -40°C to +85°C Up to 750 ksps(1) 95.24 ns 2 TAD 500 Ω 4.5V to 5.5V -40°C to +85°C Up to 600 ksps(1) 138.89 ns 12 TAD 500 Ω 3.0V to 5.5V -40°C to +125°C Up to 500 ksps 153.85 ns 1 TAD 5.0 kΩ 4.5V to 5.5V -40°C to +125°C Up to 300 ksps 256.41 ns 1 TAD 5.0 kΩ 3.0V to 5.5V -40°C to +125°C Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 17-25 for recommended circuit. VREF- VREF+ ADC ANx S/H S/H CH1, CH2 or CH3 CH0 VREF- VREF+ ADC ANx S/H CHX VREF- VREF+ ADC ANx S/H S/H CH1, CH2 or CH3 CH0 VREF- VREF+ ADC ANx S/H CHX ANx or VREFor AVSS or AVDD VREF- VREF+ ADC ANx S/H CHX ANx or VREFor AVSS or AVDD dsPIC30F Family Reference Manual DS70064D-page 17-50 © 2005 Microchip Technology Inc. The following figure depicts the recommended circuit for the conversion rates above 500 ksps. The dsPIC30F6010 is shown as an example. Figure 17-25: A/D Converter Voltage Reference Schematic The configuration procedures below give the required setup values for the conversion speeds above 500 ksps. 17.22.1 1 Msps Configuration Guideline The configuration for 1 Msps operation is dependent on whether a single input pin is to be sampled or whether multiple pins will be sampled. 17.22.1.1 Single Analog Input For conversions at 1 Msps for a single analog input, at least two sample and hold channels must be enabled. The analog input multiplexer must be configured so that the same input pin is connected to both sample and hold channels. The A/D converts the value held on one S/H channel, while the second S/H channel acquires a new input sample. 747372 VDD VSS 69 68 67 66 65 64 63 62 61 20 2 3 4 5 6 7 8 9 10 VSS VDD 13 14 15 16 50 49 VDD 47 46 45 44 21 41 V 34 35 36 37 38 39 40 REFVREF+ AVDD AVSS 27 28 29 30 VSS VDD 33 17 18 19 75 1 57 56 55 54 53 52 VSS 60 59 58 43 42 79 78 77 76 22 80 dsPIC30F6010 VDD VDD VDD VDD VDD VDD VDD R2 10 C2 0.1 μF C1 0.01 μF R1 10 C8 1 μF VDD C7 0.1 μF VDD C6 0.01 μF VDD C5 1 μF VDD C4 0.1 μF VDD C3 0.01 μF © 2005 Microchip Technology Inc. DS70064D-page 17-51 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.22.1.2 Multiple Analog Inputs The A/D converter can also be used to sample multiple analog inputs using multiple sample and hold channels. In this case, the total 1 Msps conversion rate is divided among the different input signals. For example, four inputs can be sampled at a rate of 250 ksps for each signal or two inputs could be sampled at a rate of 500 ksps for each signal. Sequential sampling must be used in this configuration to allow adequate sampling time on each input. 17.22.1.3 1 Msps Configuration Procedure The following configuration items are required to achieve a 1 Msps conversion rate. • Comply with conditions provided in Table 17-9. • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 17-26. • Set SSRC<2:0> = 111 in the ADCON1 register to enable the auto convert option. • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register. • Enable sequential sampling by clearing the SIMSAM bit in the ADCON1 register. • Enable at least two sample and hold channels by writing the CHPS<1:0> control bits in the ADCON2 register. • Configure at least 2 conversions between interrupts, since at least two sample and hold channels, by writing the SMPI<3:0> control bits in the ADCON2 register. • Configure the A/D clock period to be: by writing to the ADCS<5:0> control bits in the ADCON3 register. • Configure the sampling time to be 2 TAD by writing: SAMC<4:0> = 00010. • Select at least two channels per analog input pin by writing to the ADCHS register. The following figure shows the timing diagram of the A/D converting one input pin using two sample and holds. The TAD selection, in conjunction with the guidelines described above, allows a conversion speed of 1 Msps. See Example 17-8 for code example. Figure 17-26: Converting 1 Input Pin Using Two Channels at 1Msps, Auto-Sample Start, 12 TAD Sampling Time 1 12 x 1,000,000 = 83.33 ns TCONV ADCLK ch0_samp ch1_samp ADRES(0) DONE TSAMP TCONV TCONV TCONV SAMP = 0 dsPIC30F Family Reference Manual DS70064D-page 17-52 © 2005 Microchip Technology Inc. Example 17-8: Converting 2 Channels, Auto-Sample Start, TAD Conversion Start, Sequential Sampling Code 17.22.2 750 ksps Configuration Guideline The following configuration items are required to achieve a 750 ksps conversion rate. This configuration assumes that a single analog input is to be sampled. • Comply with conditions provided in Table 17-9. • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 17-27. • Set SSRC<2:0> = 111 in the ADCON1 register to enable the auto convert option. • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register. • Enable one sample and hold channel by setting CHPS<1:0> = 00 in the ADCON2 register. • Write the SMPI<3:0> control bits in the ADCON2 register for the desired number of conversions between interrupts. • Configure the A/D clock period to be: by writing to the ADCS<5:0> control bits in the ADCON3 register. • Configure the sampling time to be 2 TAD by writing: SAMC<4:0> = 00010. The following figure shows the timing diagram of the A/D running at 750 ksps. The TAD selection, in conjunctin with the guidelines described above, allows a conversion speed of 750 ksps. See Example 17-9 for code example. ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input and also connect RB2/AN2 // to positive CH1 input. // in this example RB2/AN2 is the input to two channels. ADCSSL = 0; ADCON3 = 0x0C04; // Sample time = 12Tad = 83.33 ns @ MIPS // which will give 1 / (12 * 83.33 ns) = 1 Msps ADCON2 = 0x6104; // Select external VREF+ and VREF- pins, convert CH0 and // CH1, Interrupt after every 2 samples ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { IFS0bits.ADIF = 0; // clear interrupt while (IFS0bits.ADIF); // conversion done? ADCValue = ADCBUF0; // save the ADC values } // repeat 1 (12 + 2) x 750,000 = 95.24 ns © 2005 Microchip Technology Inc. DS70064D-page 17-53 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 Figure 17-27: Converting 1 Channel at 750 ksps, Auto-Sample Start, 2 TAD Sampling Time Example 17-9: Converting 1 Channel at 750 ksps, Auto-Sample Start, 2 TAD Sampling Time Code Example 17.22.3 600 ksps Configuration Guideline The configuration for 600 ksps operation is dependent on whether a single input pin is to be sampled or whether multiple pins will be sampled. 17.22.3.1 Single Analog Input When performing conversions at 600 ksps for a single analog input, at least two sample and hold channels must be enabled. The analog input multiplexer must be configured so that the same input pin is connected to both sample and hold channels. The A/D converts the value held on one S/H channel, while the second S/H channel acquires a new input sample. TCONV = 12 TAD TCONV = 12 TAD TSAMP = 2 TAD TSAMP = 2 TAD ADCLK SAMP DONE ADCBUF0 ADCBUF1 Instruction Execution BSET ADCON1, ASM ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input // in this example RB2/AN2 is the input ADCSSL = 0; ADCON3 = 0x0203; // Sample time = 2Tad, Tad = 95.24 ns @ 21 MIPS // which will give 1 / (14 * 95.24 ns) = 750 ksps ADCON2 = 0x6004; // Select external VREF+ and VREF- pins // Interrupt after every 2 samples ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCValue = 0; // clear value ADC16Ptr = &ADCBUF0; // initialize ADCBUF pointer IFS0bits.ADIF = 0; // clear ADC interrupt flag ADCON1bits.ASAM = 1; // auto start sampling // for 31Tad then go to conversion while (!IFS0bits.ADIF); // conversion done? ADCON1bits.ASAM = 0; // yes then stop sample/convert for (count = 0; count <2; count++) // average the 2 ADC value ADCValue = ADCValue + *ADC16Ptr++; ADCValue = ADCValue >> 1; } // repeat dsPIC30F Family Reference Manual DS70064D-page 17-54 © 2005 Microchip Technology Inc. 17.22.3.2 Multiple Analog Inputs The A/D converter can also be used to sample multiple analog inputs using multiple sample and hold channels. In this case, the total 600 ksps conversion rate is divided among the different input signals. For example, four inputs can be sampled at a rate of 150 ksps for each signal or two inputs could be sampled at a rate of 300 ksps for each signal. Sequential sampling must be used in this configuration to allow adequate sampling time on each input. 17.22.3.3 600 ksps Configuration Items The following configuration items are required to achieve a 600 ksps conversion rate. • Comply with conditions provided in Table 17-9. • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 17-10. • Set SSRC<2:0> = 111 in the ADCON1 register to enable the auto convert option. • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register. • Enable sequential sampling by clearing the SIMSAM bit in the ADCON1 register. • Enable at least two sample and hold channels by writing the CHPS<1:0> control bits in the ADCON2 register. • Configure at least 2 conversions between interrupts, since at least two sample and hold channels, by writing the SMPI<3:0> control bits in the ADCON2 register. • Configure the A/D clock period to be: by writing to the ADCS<5:0> control bits in the ADCON3 register. • Configure the sampling time to be 2 TAD by writing: SAMC<4:0> = 00010. • Select at least two channels per analog input pin by writing to the ADCHS register. The timing diagram for the 600 ksps extended rate is the same as for the 1 Msps shown in Figure 17-10. See Example 17-10 for code example for 600 ksps A/D operation. Example 17-10: Converting 2 Channels, Auto-Sample Start, TAD Conversion Start, Sequential Samplling Code 1 12 x 600,000 = 138.89 ns ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input and also connect RB2/AN2 // to positive CH1 input. // in this example RB2/AN2 is the input to two channels. ADCSSL = 0; ADCON3 = 0x0C04; // Sample time = 12Tad = 138.89 ns @ 18 MIPS // which will give 1 / (12 * 138.89 ns) = 600 ksps ADCON2 = 0x6104; // Select external VREF+ and VREF- pins, convert CH0 and // CH1, Interrupt after every 2 samples ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { IFS0bits.ADIF = 0; // clear interrupt while (IFS0bits.ADIF); // conversion done? ADCValue = ADCBUF0; // save the ADC values } // repeat © 2005 Microchip Technology Inc. DS70064D-page 17-55 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.23 Operation During Sleep and Idle Modes Sleep and Idle modes are useful for minimizing conversion noise because the digital activity of the CPU, buses and other peripherals is minimized. 17.23.1 CPU Sleep Mode without RC A/D Clock When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a conversion, the conversion is aborted unless the A/D is clocked from its internal RC clock generator. The converter will not resume a partially completed conversion on exiting from Sleep mode. Register contents are not affected by the device entering or leaving Sleep mode. 17.23.2 CPU Sleep Mode with RC A/D Clock The A/D module can operate during Sleep mode if the A/D clock source is set to the internal A/D RC oscillator (ADRC = 1). This eliminates digital switching noise from the conversion. When the conversion is completed, the DONE bit will be set and the result loaded into the A/D result buffer, ADCBUF. If the A/D interrupt is enabled (ADIE = 1), the device will wake-up from Sleep when the A/D interrupt occurs. Program execution will resume at the A/D Interrupt Service Routine if the A/D interrupt is greater than the current CPU priority. Otherwise, execution will continue from the instruction after the PWRSAV instruction that placed the device in Sleep mode. If the A/D interrupt is not enabled, the A/D module will then be turned off, although the ADON bit will remain set. To minimize the effects of digital noise on the A/D module operation, the user should select a conversion trigger source that ensures the A/D conversion will take place in Sleep mode. The automatic conversion trigger option can be used for sampling and conversion in Sleep (SSRC<2:0> = 111). To use the automatic conversion option, the ADON bit should be set in the instruction prior to the PWRSAV instruction. 17.23.3 A/D Operation During CPU Idle Mode For the A/D, the ADSIDL bit (ADCON1<13>) selects if the module will stop on Idle or continue on Idle. If ADSIDL = 0, the module will continue normal operation when the device enters Idle mode. If the A/D interrupt is enabled (ADIE = 1), the device will wake up from Idle mode when the A/D interrupt occurs. Program execution will resume at the A/D Interrupt Service Routine if the A/D interrupt is greater than the current CPU priority. Otherwise, execution will continue from the instruction after the PWRSAV instruction that placed the device in Idle mode. If ADSIDL = 1, the module will stop in Idle. If the device enters Idle mode in the middle of a conversion, the conversion is aborted. The converter will not resume a partially completed conversion on exiting from Idle mode. 17.24 Effects of a Reset A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off, and any conversion in progress is aborted. All pins that are multiplexed with analog inputs will be configured as analog inputs. The corresponding TRIS bits will be set. The values in the ADCBUF registers are not initialized during a Power-on Reset. ADCBUF0...ADCBUFF will contain unknown data. Note: For the A/D module to operate in Sleep, the A/D clock source must be set to RC (ADRC = 1). dsPIC30F Family Reference Manual DS70064D-page 17-56 © 2005 Microchip Technology Inc. 17.25 Special Function Registers Associated with the 10-bit A/D Converter The following table lists dsPIC30F 10-bit A/D Converter Special Function registers, including their addresses and formats. All unimplemented registers and/or bits within a register read as zeros. Table 17-10: ADC Register Map File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset States INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL — 0000 0000 0000 0000 INTCON2 0082 ALTIVT — — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000 IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IPC2 0098 — ADIP<2:0> — U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100 ADCBUF0 0280 ADC Data Buffer 0 uuuu uuuu uuuu uuuu ADCBUF1 0282 ADC Data Buffer 1 uuuu uuuu uuuu uuuu ADCBUF2 0284 ADC Data Buffer 2 uuuu uuuu uuuu uuuu ADCBUF3 0286 ADC Data Buffer 3 uuuu uuuu uuuu uuuu ADCBUF4 0288 ADC Data Buffer 4 uuuu uuuu uuuu uuuu ADCBUF5 028A ADC Data Buffer 5 uuuu uuuu uuuu uuuu ADCBUF6 028C ADC Data Buffer 6 uuuu uuuu uuuu uuuu ADCBUF7 028E ADC Data Buffer 7 uuuu uuuu uuuu uuuu ADCBUF8 0290 ADC Data Buffer 8 uuuu uuuu uuuu uuuu ADCBUF9 0292 ADC Data Buffer 9 uuuu uuuu uuuu uuuu ADCBUFA 0294 ADC Data Buffer 10 uuuu uuuu uuuu uuuu ADCBUFB 0296 ADC Data Buffer 11 uuuu uuuu uuuu uuuu ADCBUFC 0298 ADC Data Buffer 12 uuuu uuuu uuuu uuuu ADCBUFD 029A ADC Data Buffer 13 uuuu uuuu uuuu uuuu ADCBUFE 029C ADC Data Buffer 14 uuuu uuuu uuuu uuuu ADCBUFF 029E ADC Data Buffer 15 uuuu uuuu uuuu uuuu ADCON1 02A0 ADON ADFRZ ADSIDL — — — FORM[1:0] SSRC[2:0] — SIMSAM ASAM SAMP CONV 0000 0000 0000 0000 ADCON2 02A2 VCFG[2:0] OFFCAL — CSCNA CHPS[1:0] BUFS — SMPI[3:0] BUFM ALTS 0000 0000 0000 0000 ADCON3 02A4 — — — SAMC[4:0] ADRC — ADCS[5:0] 0000 0000 0000 0000 ADCHS 02A6 CHXNB[1:0] CHXSB CH0NB CH0SB[3:0] CHXNA[1:0] CHXSA CH0NA CH0SA[3:0] 0000 0000 0000 0000 ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000 ADCSSL 02AA ADC Input Scan Select Register 0000 0000 0000 0000 Legend: u = unknown Note: All interrupt sources and their associated control bits may not be available on a particular device. Refer to the device data sheet for details. © 2005 Microchip Technology Inc. DS70064D-page 17-57 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.26 Design Tips Question 1: How can I optimize the system performance of the A/D converter? Answer: 1. Make sure you are meeting all of the timing specifications. If you are turning the module off and on, there is a minimum delay you must wait before taking a sample. If you are changing input channels, there is a minimum delay you must wait for this as well and finally, there is TAD, which is the time selected for each bit conversion. This is selected in ADCON3 and should be within a certain range as specified in the Electrical Characteristics. If TAD is too short, the result may not be fully converted before the conversion is terminated, and if TAD is made too long, the voltage on the sampling capacitor can decay before the conversion is complete. These timing specifications are provided in the “Electrical Specifications” section of the device data sheets. 2. Often the source impedance of the analog signal is high (greater than 10 kΩ), so the current drawn from the source to charge the sample capacitor can affect accuracy. If the input signal does not change too quickly, try putting a 0.1 μF capacitor on the analog input. This capacitor will charge to the analog voltage being sampled and supply the instantaneous current needed to charge the 4.4 pF internal holding capacitor. 3. Put the device into Sleep mode before the start of the A/D conversion. The RC clock source selection is required for conversions in Sleep mode. This technique increases accuracy because digital noise from the CPU and other peripherals is minimized. Question 2: Do you know of a good reference on A/D’s? Answer: A good reference for understanding A/D conversions is the “Analog-Digital Conversion Handbook” third edition, published by Prentice Hall (ISBN 0-13-03-2848-0). Question 3: My combination of channels/sample and samples/interrupt is greater than the size of the buffer. What will happen to the buffer? Answer: This configuration is not recommended. The buffer will contain unknown results. dsPIC30F Family Reference Manual DS70064D-page 17-58 © 2005 Microchip Technology Inc. 17.27 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the 10-bit A/D Converter module are: Title Application Note # Using the Analog-to-Digital (A/D) Converter AN546 Four Channel Digital Voltmeter with Display and Keyboard AN557 Understanding A/D Converter Performance Specifications AN693 Using the dsPIC30F for Sensorless BLDC Control AN901 Using the dsPIC30F for Vector Control of an ACIM AN908 Sensored BLDC Motor Control Using the dsPIC30F2010 AN957 An Introduction to AC Induction Motor Control Using the dsPIC30F MCU AN984 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70064D-page 17-59 Section 17. 10-bit A/D Converter 10-bit A/D Converter 17 17.28 Revision History Revision A This is the initial released revision of this document. Revision B To reflect editorial and technical content revisions for the dsPIC30F 10-bit A/D Converter module. Revision C This revision incorporates all known errata at the time of this document update. Revision D This revision includes the extended conversion rate guidelines. dsPIC30F Family Reference Manual DS70064D-page 17-60 © 2005 Microchip Technology Inc. NOTES: © 2005 Microchip Technology Inc. DS70065D-page 18-1 12-bit A/D Converter 18 Section 18. 12-bit A/D Converter HIGHLIGHTS This section of the manual contains the following major topics: 18.1 Introduction .................................................................................................................. 18-2 18.2 Control Registers ......................................................................................................... 18-4 18.3 A/D Result Buffer ......................................................................................................... 18-4 18.4 A/D Terminology and Conversion Sequence ............................................................. 18-10 18.5 A/D Module Configuration.......................................................................................... 18-11 18.6 Selecting the Voltage Reference Source ................................................................... 18-11 18.7 Selecting the A/D Conversion Clock .......................................................................... 18-12 18.8 Selecting Analog Inputs for Sampling ........................................................................ 18-12 18.9 Enabling the Module .................................................................................................. 18-14 18.10 How to Start Sampling ............................................................................................... 18-14 18.11 How to Stop Sampling and Start Conversions ........................................................... 18-14 18.12 Controlling Sample/Conversion Operation................................................................. 18-19 18.13 Specifying How Conversion Results are Written into the Buffer ................................ 18-19 18.14 Conversion Sequence Examples............................................................................... 18-21 18.15 A/D Sampling Requirements...................................................................................... 18-26 18.16 Reading the A/D Result Buffer................................................................................... 18-27 18.17 Transfer Function....................................................................................................... 18-28 18.18 A/D Accuracy/Error .................................................................................................... 18-28 18.19 Connection Considerations........................................................................................ 18-28 18.20 Initialization ................................................................................................................ 18-29 18.21 A/D Conversion Speeds............................................................................................. 18-30 18.22 Operation During Sleep and Idle Modes.................................................................... 18-33 18.23 Effects of a Reset....................................................................................................... 18-33 18.24 Special Function Registers Associated with the 12-bit A/D Converter ...................... 18-34 18.25 Design Tips ................................................................................................................ 18-35 18.26 Related Application Notes.......................................................................................... 18-36 18.27 Revision History ......................................................................................................... 18-37 dsPIC30F Family Reference Manual DS70065D-page 18-2 © 2005 Microchip Technology Inc. 18.1 Introduction The dsPIC30F 12-bit A/D converter has the following key features: • Successive Approximation Register (SAR) conversion • Up to 200 ksps conversion speed • Up to 16 analog input pins • External voltage reference input pins • Unipolar differential S/H amplifier • Automatic Channel Scan mode • Selectable conversion trigger source • 16-word conversion result buffer • Selectable Buffer Fill modes • Four result alignment options • Operation during CPU Sleep and Idle modes A block diagram of the 12-bit A/D is shown in Figure 18-1. The 12-bit A/D converter can have up to 16 analog input pins, designated AN0-AN15. In addition, there are two analog input pins for external voltage reference connections. These voltage reference inputs may be shared with other analog input pins. The actual number of analog input pins and external voltage reference input configuration will depend on the specific dsPIC30F device. Refer to the dsPIC30F device data sheets (DS70082 and DS70083) for further details. The analog inputs are connected via multiplexers to the S/H amplifier, designated CH0. The analog input multiplexer can be switched between two sets of analog inputs during conversions. Unipolar differential conversions are possible using certain input pins (see Figure 18-1). An Analog Input Scan mode may be enabled for the CH0 S/H amplifier. A Control register specifies which analog input channels will be included in the scanning sequence. The 12-bit A/D is connected to a 16-word result buffer. Each 12-bit result is converted to one of four 16-bit output formats when it is read from the buffer. © 2005 Microchip Technology Inc. DS70065D-page 18-3 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 Figure 18-1: 12-bit High Speed A/D Block Diagram Comparator 12-bit SAR Conversion Logic VREF+ DAC Data 16-word, 12-bit Dual Port RAM Bus Interface AN12 0000 0101 0111 1001 1101 1110 1111 1100 0001 0010 0011 0100 0110 1000 1010 1011 AN13 AN14 AN15 AN8 AN9 AN10 AN11 AN4 AN5 AN6 AN7 AN0 AN1 AN2 AN3 CH0 AN1 VREFVREFSample/Sequence Control Sample Input MUX Control Input Switches S/H AVSS AVDD Format dsPIC30F Family Reference Manual DS70065D-page 18-4 © 2005 Microchip Technology Inc. 18.2 Control Registers The A/D module has six Control and Status registers. These registers are: • ADCON1: A/D Control Register 1 • ADCON2: A/D Control Register 2 • ADCON3: A/D Control Register 3 • ADCHS: A/D Input Channel Select Register • ADPCFG: A/D Port Configuration Register • ADCSSL: A/D Input Scan Selection Register The ADCON1, ADCON2 and ADCON3 registers control the operation of the A/D module. The ADCHS register selects the input pins to be connected to the S/H amplifiers. The ADPCFG register configures the analog input pins as analog inputs or as digital I/O. The ADCSSL register selects inputs to be sequentially scanned. 18.3 A/D Result Buffer The module contains a 16-word dual port RAM, called ADCBUF, to buffer the A/D results. The 16 buffer locations are referred to as ADCBUF0, ADCBUF1, ADCBUF2, ..., ADCBUFE, ADCBUFF. Note: The A/D result buffer is a read only buffer. © 2005 Microchip Technology Inc. DS70065D-page 18-5 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 Register 18-1: ADCON1: A/D Control Register 1 Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 ADON — ADSIDL — — — FORM<1:0> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 HC, HS R/C-0 HC, HS SSRC<2:0> — — ASAM SAMP DONE bit 7 bit 0 bit 15 ADON: A/D Operating Mode bit 1 = A/D converter module is operating 0 = A/D converter is off bit 14 Unimplemented: Read as ‘0’ bit 13 ADSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-10 Unimplemented: Read as ‘0’ bit 9-8 FORM<1:0>: Data Output Format bits 11 = Signed fractional (DOUT = sddd dddd dddd 0000) 10 = Fractional (DOUT = dddd dddd dddd 0000) 01 = Signed integer (DOUT = ssss sddd dddd dddd) 00 = Integer (DOUT = 0000 dddd dddd dddd) bit 7-5 SSRC<2:0>: Conversion Trigger Source Select bits 111 = Internal counter ends sampling and starts conversion (auto convert) 110 = Reserved 101 = Reserved 100 = Reserved 011 = Motor Control PWM interval ends sampling and starts conversion 010 = General purpose Timer3 compare ends sampling and starts conversion 001 = Active transition on INT0 pin ends sampling and starts conversion 000 = Clearing SAMP bit ends sampling and starts conversion bit 4-3 Unimplemented: Read as ‘0’ bit 2 ASAM: A/D Sample Auto-Start bit 1 = Sampling begins immediately after last conversion completes. SAMP bit is auto set. 0 = Sampling begins when SAMP bit set bit 1 SAMP: A/D Sample Enable bit 1 = At least one A/D sample/hold amplifier is sampling 0 = A/D sample/hold amplifiers are holding When ASAM = 0, writing ‘1’ to this bit will start sampling. When SSRC = 000, writing ‘0’ to this bit will end sampling and start conversion. bit 0 DONE: A/D Conversion Status bit 1 = A/D conversion is done 0 = A/D conversion is not done Clearing this bit will not effect any operation in progress. Cleared by software or start of a new conversion. Legend: R = Readable bit W = Writable bit C = Clearable by software HC = Hardware clear HS = Hardware set U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70065D-page 18-6 © 2005 Microchip Technology Inc. Register 18-2: ADCON2: A/D Control Register 2 Upper Byte: R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 VCFG<2:0> — — CSCNA — — bit 15 bit 8 Lower Byte: R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BUFS — SMPI<3:0> BUFM ALTS bit 7 bit 0 bit 15-13 VCFG<2:0>: Voltage Reference Configuration bits bit 12 Reserved: User should write ‘0’ to this location bit 11 Unimplemented: Read as ‘0’ bit 10 CSCNA: Scan Input Selections for CH0+ S/H Input for MUX A Input Multiplexer Setting bit 1 = Scan inputs 0 = Do not scan inputs bit 9-8 Unimplemented: Read as ‘0’ bit 7 BUFS: Buffer Fill Status bit Only valid when BUFM = 1 (ADRES split into 2 x 8-word buffers) 1 = A/D is currently filling buffer 0x8-0xF, user should access data in 0x0-0x7 0 = A/D is currently filling buffer 0x0-0x7, user should access data in 0x8-0xF bit 6 Unimplemented: Read as ‘0’ bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits 1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence 1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence ..... 0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence 0000 = Interrupts at the completion of conversion for each sample/convert sequence bit 1 BUFM: Buffer Mode Select bit 1 = Buffer configured as two 8-word buffers ADCBUF(15...8), ADCBUF(7...0) 0 = Buffer configured as one 16-word buffer ADCBUF(15...0) bit 0 ALTS: Alternate Input Sample Mode Select bit 1 = Uses MUX A input multiplexer settings for first sample, then alternate between MUX B and MUX A input multiplexer settings for all subsequent samples 0 = Always use MUX A input multiplexer settings Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown A/D VREFH A/D VREFL 000 AVDD AVSS 001 External VREF+ pin AVSS 010 AVDD External VREF- pin 011 External VREF+ pin External VREF- pin 1xx AVDD AVSS © 2005 Microchip Technology Inc. DS70065D-page 18-7 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 Register 18-3: ADCON3: A/D Control Register 3 Upper Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — SAMC<4:0> bit 15 bit 8 Lower Byte: R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADRC — ADCS<5:0> bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12-8 SAMC<4:0>: Auto Sample Time bits 11111 = 31 TAD ····· 00001 = 1 TAD 00000 = 0 TAD bit 7 ADRC: A/D Conversion Clock Source bit 1 = A/D internal RC clock 0 = Clock derived from system clock bit 6 Unimplemented: Read as ‘0’ bit 5-0 ADCS<5:0>: A/D Conversion Clock Select bits 111111 = TCY/2 • (ADCS<5:0> + 1) = 32 • TCY ······ 000001 = TCY/2 • (ADCS<5:0> + 1) = TCY 000000 = TCY/2 • (ADCS<5:0> + 1) = TCY/2 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70065D-page 18-8 © 2005 Microchip Technology Inc. Register 18-4: ADCHS: A/D Input Select Register Upper Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — CH0NB CH0SB<3:0> bit 15 bit 8 Lower Byte: U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — CH0NA CH0SA<3:0> bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12 CH0NB: Channel 0 Negative Input Select for MUX B Multiplexer Setting bit Same definition as bit <4> (see Note). bit 11-8 CH0SB<3:0>: Channel 0 Positive Input Select for MUX B Multiplexer Setting bit Same definition as bits <3:0> (see Note). bit 7-5 Unimplemented: Read as ‘0’ bit 4 CH0NA: Channel 0 Negative Input Select for MUX A Multiplexer Setting bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREFbit 3-0 CH0SA<3:0>: Channel 0 Positive Input Select for MUX A Multiplexer Setting bit 1111 = Channel 0 positive input is AN15 1110 = Channel 0 positive input is AN14 1101 = Channel 0 positive input is AN13 ····· 0001 = Channel 0 positive input is AN1 0000 = Channel 0 positive input is AN0 Note: The analog input multiplexer supports two input setting configurations, denoted MUX A and MUX B. ADCHS<15:8> determines the settings for MUX B, and ADCHS<7:0> determines the settings for MUX A. Both sets of control bits function identically. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70065D-page 18-9 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 Register 18-5: ADPCFG: A/D Port Configuration Register Register 18-6: ADCSSL: A/D Input Scan Select Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 bit 15-0 PCFG<15:0>: Analog Input Pin Configuration Control bits 1 = Analog input pin in Digital mode, port read input enabled, A/D input multiplexer input connected to AVSS 0 = Analog input pin in Analog mode, port read input disabled, A/D samples pin voltage Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 bit 7 bit 0 bit 15-0 CSSL<15:0>: A/D Input Pin Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70065D-page 18-10 © 2005 Microchip Technology Inc. 18.4 A/D Terminology and Conversion Sequence Figure 18-2 shows a basic conversion sequence and the terms that are used. A sampling of the analog input pin voltage is performed by sample and hold S/H amplifiers. The S/H amplifiers are also called S/H channels. The 12-bit A/D converter has one S/H channel, designated CH0. The S/H channel is connected to the analog input pins via the analog input multiplexer. The analog input multiplexer is controlled by the ADCHS register. There are two sets of multiplexer control bits in the ADCHS register that function identically. These two sets of control bits allow two different analog input multiplexer configurations to be programmed, which are called MUX A and MUX B. The A/D converter can optionally switch between the MUX A and MUX B configurations between conversions. The A/D converter can also optionally scan through a series of analog inputs. Sample time is the time that the A/D module’s S/H amplifier is connected to the analog input pin. The sample time may be started manually by setting the SAMP bit (ADCON1<1>) or started automatically by the A/D converter hardware. The sample time is ended manually by clearing the SAMP control bit in the user software or automatically by a conversion trigger source. Conversion time is the time required for the A/D converter to convert the voltage held by the S/H amplifier. The A/D is disconnected from the analog input pin at the end of the sample time. The A/D converter requires one A/D clock cycle (TAD) to convert each bit of the result plus one additional clock cycle. A total of 14 TAD cycles are required to perform the complete conversion. When the conversion time is complete, the result is loaded into one of 16 A/D result registers (ADCBUF0...ADCBUFF), the S/H can be reconnected to the input pin, and a CPU interrupt may be generated. The sum of the sample time and the A/D conversion time provides the total conversion time. There is a minimum sample time to ensure that the S/H amplifier will give the desired accuracy for the A/D conversion (see Section 18.15 “A/D Sampling Requirements”). Furthermore, there are multiple input clock options for the A/D converter. The user must select an input clock option that does not violate the minimum TAD specification. Figure 18-2: A/D Sample/Conversion Sequence Sample Time A/D Conversion Time A/D Total Conversion Time S/H amplifier is connected to the analog input pin for sampling. S/H amplifier is disconnected from input and holds signal lever. A/D conversion is started by the conversion trigger source. A/D conversion complete, result is loaded into A/D result buffer. Optionally generate interrupt. © 2005 Microchip Technology Inc. DS70065D-page 18-11 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 The start time for sampling can be controlled in software by setting the SAMP control bit. The start of the sampling time can also be controlled automatically by the hardware. When the A/D converter operates in the Auto Sample mode, the S/H amplifier(s) is reconnected to the analog input pin at the end of the conversion in the sample/convert sequence. The auto sample function is controlled by the ASAM control bit. The conversion trigger source ends the sampling time and begins an A/D conversion or a sample/convert sequence. The conversion trigger source is selected by the SSRC control bits. The conversion trigger can be taken from a variety of hardware sources or can be controlled manually in software by clearing the SAMP control bit. One of the conversion trigger sources is an auto conversion. The time between auto conversions is set by a counter and the A/D clock. The Auto Sample mode and auto conversion trigger can be used together to provide endless automatic conversions without software intervention. An interrupt may be generated at the end of each sample/convert sequence or multiple sample/convert sequences, as determined by the value of the SMPI control bits. The number of sample/convert sequences between interrupts can vary between 1 and 16. 18.5 A/D Module Configuration The following steps should be followed for performing an A/D conversion: 1. Configure the A/D module • Select voltage reference source to match expected range on analog inputs • Select the analog conversion clock to match desired data rate with processor clock • Determine how sampling will occur • Determine how inputs will be allocated to the S/H channel • Select how conversion results are presented in the buffer • Select interrupt rate • Turn on A/D module 2. Configure A/D interrupt (if required) • Clear ADIF bit • Select A/D interrupt priority The options for each configuration step are described in the subsequent sections. 18.6 Selecting the Voltage Reference Source The voltage references for A/D conversions are selected using the VCFG<2:0> control bits (ADCON2<15:13>). The upper voltage reference (VREFH) and the lower voltage reference (VREFL) may be the internal AVDD and AVSS voltage rails or the VREF+ and VREF- input pins. The external voltage reference pins may be shared with the AN0 and AN1 inputs on low pin count devices. The A/D converter can still perform conversions on these pins when they are shared with the VREF+ and VREF- input pins. The voltages applied to the external reference pins must meet certain specifications. Refer to the “Electrical Specifications” section of the device data sheet for further details.. Note: The SSRC<2:0>, SIMSAM, ASAM, CHPS<1:0>, SMPI<3:0>, BUFM and ALTS bits, as well as the ADCON3 and ADCSSL registers, should not be written to while ADON = 1. This would lead to indeterminate results. Note: External VREF+ and VREF- pins must be selected for the conversion rates above 100 ksps. See Section 18.21 “A/D Conversion Speeds” for further details. dsPIC30F Family Reference Manual DS70065D-page 18-12 © 2005 Microchip Technology Inc. 18.7 Selecting the A/D Conversion Clock The A/D converter has a maximum rate at which conversions may be completed. An analog module clock, TAD, controls the conversion timing. The A/D conversion requires 14 clock periods (14 TAD). The A/D clock is derived from the device instruction clock. The period of the A/D conversion clock is software selected using a six-bit counter. There are 64 possible options for TAD, specified by the ADCS<5:0> bits (ADCON3<5:0>). Equation 18-1 gives the TAD value as a function of the ADCS control bits and the device instruction cycle clock period, TCY. Equation 18-1: A/D Conversion Clock Period For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of 333.33 nsec (see Section 18.21 “A/D Conversion Speeds” for further details). The A/D converter has a dedicated internal RC clock source that can be used to perform conversions. The internal RC clock source should be used when A/D conversions are performed while the dsPIC30F is in Sleep mode. The internal RC oscillator is selected by setting the ADRC bit (ADCON3<7>). When the ADRC bit is set, the ADCS<5:0> bits have no effect on the A/D operation. 18.8 Selecting Analog Inputs for Sampling The Sample-and-Hold Amplifier has analog multiplexers (see Figure 18-1) on both its non-inverting and inverting inputs, to select which analog input(s) are sampled. Once the sample/convert sequence is specified, the ADCHS bits determine which analog inputs are selected for each sample. Additionally, the selected inputs may vary on an alternating sample basis, or may vary on a repeated sequence of samples. 18.8.1 Configuring Analog Port Pins The ADPCFG register specifies the input condition of device pins used as analog inputs. A pin is configured as analog input when the corresponding PCFGn bit (ADPCFG) is clear. The ADPCFG register is clear at Reset, causing the A/D input pins to be configured for analog input by default at Reset. When configured for analog input, the associated port I/O digital input buffer is disabled so it does not consume current. The ADPCFG register and the TRISB register control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set, specifying port input. If the I/O pin associated with an A/D input is configured as an output, TRIS bit is cleared, the pin is in Analog mode (ADPCFG = 0) and the port digital output level (VOH or VOL) will be converted. After a device Reset, all TRIS bits are set. A pin is configured as digital I/O when the corresponding PCFGn bit (ADPCFG) is set. In this configuration, the input to the analog multiplexer is connected to AVSS. TAD = TCY(ADCS + 1) 2 ADCS = 2TAD TCY – 1 Note: Different devices will have different numbers of analog inputs. Verify the analog input availability against the device data sheet. Note 1: When reading a port register, any pin configured as an analog input reads as a ‘0’. 2: Analog levels on any pin that is defined as a digital input (including the AN15:AN0 pins) may cause the input buffer to consume current that is out of the device’s specification. © 2005 Microchip Technology Inc. DS70065D-page 18-13 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.8.2 Channel 0 Input Selection The user may select any one of the up to 16 analog inputs to connect to the positive input of the channel. The CH0SA<3:0> bits (ADCHS<3:0>) normally select the analog input for the positive input of channel 0. The user may select either VREF- or AN1 as the negative input of the channel. The CH0NA bit (ADCHS<4>) normally selects the analog input for the negative input of channel 0. 18.8.2.1 Specifying Alternating Channel 0 Input Selections The ALTS bit (ADCON2<0>) causes the module to alternate between two sets of inputs that are selected during successive samples. The inputs specified by CH0SA<3:0>, CH0NA, CHXSA and CHXNA<1:0> are collectively called the MUX A inputs. The inputs specified by CH0SB<3:0>, CH0NB, CHXSB and CHXNB<1:0> are collectively called the MUX B inputs. When the ALTS bit is ‘1’, the module will alternate between the MUX A inputs on one sample and the MUX B inputs on the subsequent sample. For channel 0, if the ALTS bit is ‘0’, only the inputs specified by CH0SA<3:0> and CH0NA are selected for sampling. If the ALTS bit is ‘1’ on the first sample/convert sequence for channel 0, the inputs specified by CH0SA<3:0> and CH0NA are selected for sampling. On the next sample convert sequence for channel 0, the inputs specified by CH0SB<3:0> and CH0NB are selected for sampling. This pattern will repeat for subsequent sample conversion sequences. 18.8.2.2 Scanning Through Several Inputs Channel 0 has the ability to scan through a selected vector of inputs. The CSCNA bit (ADCON2<10>) enables the CH0 channel inputs to be scanned across a selected number of analog inputs. When CSCNA is set, the CH0SA<3:0> bits are ignored. The ADCSSL register specifies the inputs to be scanned. Each bit in the ADCSSL register corresponds to an analog input. Bit 0 corresponds to AN0, bit 1 corresponds to AN1 and so on. If a particular bit in the ADCSSL register is ‘1’, the corresponding input is part of the scan sequence. The inputs are always scanned from lower to higher numbered inputs, starting at the first selected channel after each interrupt occurs. The ADCSSL bits only specify the input of the positive input of the channel. The CH0NA bit still selects the input of the negative input of the channel during scanning. If the ALTS bit is ‘1’, the scanning only applies to the MUX A input selection. The MUX B input selection, as specified by the CH0SB<3:0>, will still select the alternating input. When the input selections are programmed in this manner, the input will alternate between a set of scanning inputs specified by the ADCSSL register and a fixed input specified by the CH0SB bits. Note: If the number of scanned inputs selected is greater than the number of samples taken per interrupt, the higher numbered inputs will not be sampled. dsPIC30F Family Reference Manual DS70065D-page 18-14 © 2005 Microchip Technology Inc. 18.9 Enabling the Module When the ADON bit (ADCON1<15>) is ‘1’, the module is in Active mode and is fully powered and functional. When ADON is ‘0’, the module is disabled. The digital and analog portions of the circuit are turned off for maximum current savings. In order to return to the Active mode from the Off mode, the user must wait for the analog stages to stabilize. For the stabilization time, refer to the “Electrical Characteristics” section of the device data sheet. 18.10 How to Start Sampling 18.10.1 Manual Setting the SAMP bit (ADCON1<1>) causes the A/D to begin sampling. One of several options can be used to end sampling and complete the conversions. Sampling will not resume until the SAMP bit is once again set. For an example, see Figure 18-3. 18.10.2 Automatic Setting the ASAM bit (ADCON1<2>) causes the A/D to automatically begin sampling a channel whenever a conversion is not active on that channel. One of several options can be used to end sampling and complete the conversions. Sampling on a channel resumes after the conversion of that channel completes. For an example, see Figure 18-4. 18.11 How to Stop Sampling and Start Conversions The conversion trigger source will terminate sampling and start a selected sequence of conversions. The SSRC<2:0> bits (ADCON1<7:5>) select the source of the conversion trigger. 18.11.1 Manual When SSRC<2:0> = 000, the conversion trigger is under software control. Clearing the SAMP bit (ADCON1<1>) starts the conversion sequence. Figure 18-3 is an example where setting the SAMP bit initiates sampling and clearing the SAMP bit, terminates sampling and starts conversion. The user software must time the setting and clearing of the SAMP bit to ensure adequate sampling time of the input signal. Figure 18-3: Converting 1 Channel, Manual Sample Start, Manual Conversion Start Note: The available conversion trigger sources may vary depending on the dsPIC30F device variant. Please refer to the specific device data sheet for the available conversion trigger sources. Note: The SSRC selection bits should not be changed when the A/D module is enabled. If the user wishes to change the conversion trigger source, the A/D module should be disabled first by clearing the ADON bit (ADCON1<15>). ADCLK SAMP ADCBUF0 TSAMP TCONV Instruction Execution BSET ADCON1,SAMP BCLR ADCON1,SAMP DONE © 2005 Microchip Technology Inc. DS70065D-page 18-15 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 Example 18-1: Converting 1 Channel, Manual Sample Start, Manual Conversion Start Code Example Figure 18-4 is an example where setting the ASAM bit initiates automatic sampling and clearing the SAMP bit, terminates sampling and starts conversion. After the conversion completes, the module will automatically return to a sampling state. The SAMP bit is automatically set at the start of the sample interval. The user software must time the clearing of the SAMP bit to ensure adequate sampling time of the input signal, understanding that the time between clearing of the SAMP bit includes the conversion time, as well as the sampling time. Figure 18-4: Converting 1 Channel, Automatic Sample Start, Manual Conversion Start ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x0000; // SAMP bit = 0 ends sampling ... // and starts converting ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input .. // in this example RB2/AN2 is the input ADCSSL = 0; ADCON3 = 0x0002; // Manual Sample, Tad = internal 2 Tcy ADCON2 = 0; ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCON1bits.SAMP = 1; // start sampling ... DelayNmSec(100); // for 100 mS ADCON1bits.SAMP = 0; // start Converting while (!ADCON1bits.DONE); // conversion done? ADCValue = ADCBUF0; // yes then get ADC value } // repeat ADCLK SAMP ADCBUF0 TSAMP TCONV BCLR ADCON1,SAMP Instruction Execution TCONV BSET ADCON1,ASAM BCF ADCON1,SAMP TSAMP TAD0 TAD0 dsPIC30F Family Reference Manual DS70065D-page 18-16 © 2005 Microchip Technology Inc. 18.11.2 Clocked Conversion Trigger When SSRC<2:0> = 111, the conversion trigger is under A/D clock control. The SAMC bits (ADCON3<12:8>) select the number of TAD clock cycles between the start of sampling and the start of conversion. After the start of sampling, the module will count a number of TAD clocks specified by the SAMC bits. Equation 18-2: Clocked Conversion Trigger Time SAMC must always be programmed for at least 1 clock cycle to ensure sampling requirements are met. Figure 18-5 shows how to use the clocked conversion trigger with the sampling started by the user software. Figure 18-5: Converting 1 Channel, Manual Sample Start, TAD Based Conversion Start Example 18-2: Converting 1 Channel, Manual Sample Start, TAD Based Conversion Start Code Example TSMP = SAMC<4:0>*TAD ADPCFG = 0xEFFF; // all PORTB = Digital; RB12 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x000C; // Connect RB12/AN12 as CH0 input .. // in this example RB12/AN12 is the input ADCSSL = 0; ADCON3 = 0x1F02; // Sample time = 31Tad, Tad = internal 2 Tcy ADCON2 = 0; ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCON1bits.SAMP = 1; // start sampling then ... // after 31Tad go to conversion while (!ADCON1bits.DONE);// conversion done? ADCValue = ADCBUF0; // yes then get ADC value } // repeat// repeat ADCLK SAMP ADCBUF0 TSAMP TCONV Instruction Execution BSET ADCON1,SAMP DONE © 2005 Microchip Technology Inc. DS70065D-page 18-17 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.11.2.1 Free Running Sample Conversion Sequence As shown in Figure 18-6, using the Auto-Convert Conversion Trigger mode (SSRC = 111) in combination with the Auto-Sample Start mode (ASAM = 1) allows the A/D module to schedule sample/conversion sequences with no intervention by the user or other device resources. This “Clocked” mode allows continuous data collection after module initialization.. Figure 18-6: Converting 1 Channel, Auto-Sample Start, TAD Based Conversion Start 18.11.2.2 Sample Time Considerations Using Clocked Conversion Trigger and Automatic Sampling The user must ensure the sampling time exceeds the sampling requirements as outlined in Section 18.15 “A/D Sampling Requirements”. Assuming that the module is set for automatic sampling and using a clocked conversion trigger, the sampling interval is specified by the SAMC bits. 18.11.3 Event Trigger Conversion Start It is often desirable to synchronize the end of sampling and the start of conversion with some other time event. The A/D module may use one of three sources as a conversion trigger event. 18.11.3.1 External INT Pin Trigger When SSRC<2:0> = 001, the A/D conversion is triggered by an active transition on the INT0 pin. The INT0 pin may be programmed for either a rising edge input or a falling edge input. 18.11.3.2 General Purpose Timer Compare Trigger The A/D is configured in this Trigger mode by setting SSRC<2:0> = 010. When a match occurs between the 32-bit timer TMR3/TMR2 and the 32-bit Combined Period register PR3/PR2, a special ADC trigger event signal is generated by Timer3. This feature does not exist for the TMR5/TMR4 timer pair. Refer to Section 12. “Timers” for more details. 18.11.3.3 Motor Control PWM Trigger The PWM module has an event trigger that allows A/D conversions to be synchronized to the PWM time base. When SSRC<2:0> = 011, the A/D sampling and conversion times occur at any user programmable point within the PWM period. The special event trigger allows the user to minimize the delay between the time when A/D conversion results are acquired and the time when the duty cycle value is updated. Refer to Section 15. “Motor Control PWM” for more details. Note: This A/D configuration must be enabled for the conversion rate of 200 ksps (see Section 18.21 “A/D Conversion Speeds” for details). ADCLK SAMP ADCBUF1 TSAMP TCONV DONE TSAMP TCONV ADCBUF0 Instruction Execution BSET ADCON1,ASAM Reset by software dsPIC30F Family Reference Manual DS70065D-page 18-18 © 2005 Microchip Technology Inc. 18.11.3.4 Synchronizing A/D Operations to Internal or External Events The modes where an external event trigger pulse ends sampling and starts conversion (SSRC = 001, 010, 011) may be used in combination with auto sampling (ASAM = 1) to cause the A/D to synchronize the sample conversion events to the trigger pulse source. For example, in Figure 18-8 where SSRC = 010 and ASAM = 1, the A/D will always end sampling and start conversions synchronously with the timer compare trigger event. The A/D will have a sample conversion rate that corresponds to the timer comparison event rate. Figure 18-7: Manual Sample Start, Conversion Trigger Based Conversion Start Figure 18-8: Auto-Sample Start, Conversion Trigger Based Conversion Start 18.11.3.5 Sample Time Considerations for Automatic Sampling/Conversion Sequences Different sample/conversion sequences provide different available sampling times for the S/H channel to acquire the analog signal. The user must ensure the sampling time exceeds the sampling requirements, as outlined in Section 18.15 “A/D Sampling Requirements”. Assuming that the module is set for automatic sampling and an external trigger pulse is used as the conversion trigger, the sampling interval is a portion of the trigger pulse interval. The sampling time is the trigger pulse period, less the time required to complete the conversion. Equation 18-3: Available Sampling Time, Sequential Sampling Conversion Trigger ADCLK SAMP ADCBUF0 TSAMP TCONV Instruction Execution BSET ADCON1,SAMP Conversion Trigger ADCLK SAMP ADCBUF0 TSAMP TCONV BSET ADCON1,ASAM Instruction Execution TSAMP TCONV ADCBUF1 DONE Reset by software TSMP = Trigger Pulse Interval (TSEQ) – Conversion Time (TCONV) TSMP = TSEQ – TCONV Note: TSEQ is the trigger pulse interval time. © 2005 Microchip Technology Inc. DS70065D-page 18-19 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.12 Controlling Sample/Conversion Operation The application software may poll the SAMP and CONV bits to keep track of the A/D operations, or the module can interrupt the CPU when conversions are complete. The application software may also abort A/D operations if necessary. 18.12.1 Monitoring Sample/Conversion Status The SAMP (ADCON1<1>) and CONV (ADCON1<0>) bits indicate the sampling state and the conversion state of the A/D, respectively. Generally, when the SAMP bit clears indicating end of sampling, the CONV bit is automatically set indicating start of conversion. If both SAMP and CONV are ‘0’, the A/D is in an inactive state. In some operational modes, the SAMP bit may also invoke and terminate sampling and the CONV bit may terminate conversion. 18.12.2 Generating an A/D Interrupt The SMPI<3:0> bits control the generation of interrupts. The interrupt will occur some number of sample/conversion sequences after starting sampling and re-occur on each equivalent number of samples. The value specified by the SMPI bits will correspond to the number of data samples in the buffer, up to the maximum of 16. Disabling the A/D interrupt is not done with the SMPI bits. To disable the interrupt, clear the ADIE analog module interrupt enable bit. 18.12.3 Aborting Sampling Clearing the SAMP bit while in Manual Sampling mode will terminate sampling, but may also start a conversion if SSRC = 000. Clearing the ASAM bit while in Automatic Sampling mode will not terminate an on going sample/convert sequence, however, sampling will not automatically resume after a subsequent conversion. 18.12.4 Aborting a Conversion Clearing the ADON bit during a conversion will abort the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. That is, the corresponding ADCBUF buffer location will continue to contain the value of the last completed conversion (or the last value written to the buffer). 18.13 Specifying How Conversion Results are Written into the Buffer As conversions are completed, the module writes the results of the conversions into the A/D result buffer. This buffer is a RAM array of sixteen 12-bit words. The buffer is accessed through 16 address locations within the SFR space, named ADCBUF0...ADCBUFF. User software may attempt to read each A/D conversion result as it is generated, however, this might consume too much CPU time. Generally, to simplify the code, the module will fill the buffer with results and then generate an interrupt when the buffer is filled. dsPIC30F Family Reference Manual DS70065D-page 18-20 © 2005 Microchip Technology Inc. 18.13.1 Number of Conversions per Interrupt The SMPI<3:0> bits (ADCON2<5:2>) will select how many A/D conversions will take place before the CPU is interrupted. This can vary from 1 sample per interrupt to 16 samples per interrupt. The A/D converter module always starts writing its conversion results at the beginning of the buffer, after each interrupt. For example, if SMPI<3:0> = 0000, the conversion results will always be written to ADCBUF0. In this example, no other buffer locations would be used. 18.13.2 Restrictions Due to Buffer Size The user cannot program the SMPI bits to a value that specifies more than 8 conversions per interrupt when the BUFM bit (ADCON2<1>) is ‘1’. The BUFM bit function is described below. 18.13.3 Buffer Fill Mode When the BUFM bit (ADCON2<1>) is ‘1’, the 16-word results buffer (ADRES) will be split into two 8-word groups. The 8-word buffers will alternately receive the conversion results after each interrupt event. The initial 8-word buffer used after BUFM is set will be located at the lower addresses of ADCBUF. When BUFM is ‘0’, the complete 16-word buffer is used for all conversion sequences. The decision to use the BUFM feature will depend upon how much time is available to move the buffer contents after the interrupt, as determined by the application. If the processor can quickly unload a full buffer within the time it takes to sample and convert one channel, the BUFM bit can be ‘0’ and up to 16 conversions may be done per interrupt. The processor will have one sample and conversion time before the first buffer location is overwritten. If the processor cannot unload the buffer within the sample and conversion time, the BUFM bit should be ‘1’. For example, if SMPI<3:0> = 0111, then eight conversions will be loaded into 1/2 of the buffer, following which an interrupt will occur. The next eight conversions will be loaded into the other 1/2 of the buffer. The processor will, therefore, have the entire time between interrupts to move the eight conversions out of the buffer. 18.13.4 Buffer Fill Status When the conversion result buffer is split using the BUFM control bit, the BUFS status bit (ADCON2<7>) indicates the half of the buffer that the A/D converter is currently filling. If BUFS = 0, then the A/D converter is filling ADCBUF0-ADCBUF7 and the user software should read conversion values from ADCBUF8-ADCBUFF. If BUFS = 1, the situation is reversed, and the user software should read conversion values from ADCBUF0-ADCBUF7. © 2005 Microchip Technology Inc. DS70065D-page 18-21 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.14 Conversion Sequence Examples The following configuration examples show the A/D operation in different sampling and buffering configurations. In each example, setting the ASAM bit starts automatic sampling. A conversion trigger ends sampling and starts conversion. 18.14.1 Example: Sampling and Converting a Single Channel Multiple Times Figure 18-9 and Table 18-1 illustrate a basic configuration of the A/D. In this case, one A/D input, AN0, will be sampled and converted. The results are stored in the ADCBUF buffer. This process repeats 16 times until the buffer is full and then the module generates an interrupt. The entire process will then repeat. With ALTS clear, only the MUX A inputs are active. The CH0SA bits and CH0NA bit are specified (AN0-VREF-) as the input to the sample/hold channel. All other input selection bits are not used. Figure 18-9: Converting One Channel 16 Times/Interrupt Conversion ADCLK SAMP ADCBUF0 TSAMP TCONV BSET ADCON1,ASAM Instruction Execution ADCBUF1 DONE ADCBUFE ADCBUFF Input to CH0 AN0 TSAMP TCONV AN0 TSAMP TCONV AN0 TSAMP TCONV AN0 ADIF ASAM Trigger dsPIC30F Family Reference Manual DS70065D-page 18-22 © 2005 Microchip Technology Inc. Example 18-3: Sampling and Converting a Single Channel Multiple Times Code Example ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input .. // in this example RB2/AN2 is the input ADCSSL = 0; ADCON3 = 0x0F00; // Sample time = 15Tad, Tad = internal Tcy/2 ADCON2 = 0x003C; // Interrupt after every 16 samples ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCValue = 0; // clear value ADC16Ptr = &ADCBUF0; // initialize ADCBUF pointer IFS0bits.ADIF = 0; // clear ADC interrupt flag ADCON1bits.ASAM = 1; // auto start sampling // for 31Tad then go to conversion while (!IFS0bits.ADIF); // conversion done? ADCON1bits.ASAM = 0; // yes then stop sample/convert for (count = 0; count < 16; count++) // average the 16 ADC value ADCValue = ADCValue + *ADC16Ptr++; ADCValue = ADCValue >> 4; } // repeat © 2005 Microchip Technology Inc. DS70065D-page 18-23 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 Table 18-1: Converting One Channel 16 Times/Interrupt CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: AN0 -> CH0 SMPI<2:0> = 1111 Convert CH0, Write Buffer 0x0 Interrupt on 16th sample Sample MUX A Inputs: AN0 -> CH0 BUFM = 0 Convert CH0, Write Buffer 0x1 Single 16-word result buffer Sample MUX A Inputs: AN0 -> CH0 ALTS = 0 Convert CH0, Write Buffer 0x2 Always use MUX A input select Sample MUX A Inputs: AN0 -> CH0 MUX A Input Select Convert CH0, Write Buffer 0x3 CH0SA<3:0> = 0000 Sample MUX A Inputs: AN0 -> CH0 Select AN0 for CH0+ input Convert CH0, Write Buffer 0x4 CH0NA = 0 Sample MUX A Inputs: AN0 -> CH0 Select VREF- for CH0- input Convert CH0, Write Buffer 0x5 CSCNA = 0 Sample MUX A Inputs: AN0 -> CH0 No input scan Convert CH0, Write Buffer 0x6 CSSL<15:0> = n/a Sample MUX A Inputs: AN0 -> CH0 Scan input select unused Convert CH0, Write Buffer 0x7 MUX B Input Select Sample MUX A Inputs: AN0 -> CH0 CH0SB<3:0> = n/a Convert CH0, Write Buffer 0x8 Channel CH0+ input unused Sample MUX A Inputs: AN0 -> CH0 CH0NB = n/a Convert CH0, Write Buffer 0x9 Channel CH0- input unused Sample MUX A Inputs: AN0 -> CH0 Convert CH0, Write Buffer 0xA Sample MUX A Inputs: AN0 -> CH0 Convert CH0, Write Buffer 0xB Sample MUX A Inputs: AN0 -> CH0 Convert CH0, Write Buffer 0xC Sample MUX A Inputs: AN0 -> CH0 Convert CH0, Write Buffer 0xD Sample MUX A Inputs: AN0 -> CH0 Convert CH0, Write Buffer 0xE Sample MUX A Inputs: AN0 -> CH0 Convert CH0, Write Buffer 0xF Interrupt Repeat Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 AN0 sample 1 AN0 sample 17 ADCBUF1 AN0 sample 2 AN0 sample 18 ADCBUF2 AN0 sample 3 AN0 sample 19 ADCBUF3 AN0 sample 4 AN0 sample 20 ADCBUF4 AN0 sample 5 AN0 sample 21 ADCBUF5 AN0 sample 6 AN0 sample 22 ADCBUF6 AN0 sample 7 AN0 sample 23 ADCBUF7 AN0 sample 8 AN0 sample 24 ••• ADCBUF8 AN0 sample 9 AN0 sample 25 ADCBUF9 AN0 sample 10 AN0 sample 26 ADCBUFA AN0 sample 11 AN0 sample 27 ADCBUFB AN0 sample 12 AN0 sample 28 ADCBUFC AN0 sample 13 AN0 sample 29 ADCBUFD AN0 sample 14 AN0 sample 30 ADCBUFE AN0 sample 15 AN0 sample 31 ADCBUFF AN0 sample 16 AN0 sample 32 dsPIC30F Family Reference Manual DS70065D-page 18-24 © 2005 Microchip Technology Inc. 18.14.2 Example: A/D Conversions While Scanning Through All Analog Inputs Figure 18-10 and Table 18-2 illustrate a typical setup, where all available analog input channels are sampled and converted. The set CSCNA bit specifies scanning of the A/D inputs to the CH0 positive input. Other conditions are similar to Subsection 18.14.1. Initially, the AN0 input is sampled by CH0 and converted. The result is stored in the ADCBUF buffer. Then the AN1 input is sampled and converted. This process of scanning the inputs repeats 16 times until the buffer is full and then the module generates an interrupt. The entire process will then repeat. Figure 18-10: Scanning Through 16 Inputs/Interrupt Conversion ADCLK SAMP ADCBUF0 TSAMP TCONV BSET ADCON1,#ASAM Instruction Execution ADCBUF1 DONE ADCBUFE ADCBUFF Input to CH0 AN0 TSAMP TCONV AN1 TSAMP TCONV AN14 TSAMP TCONV AN15 ADIF ASAM Trigger © 2005 Microchip Technology Inc. DS70065D-page 18-25 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 Table 18-2: Scanning Through 16 Inputs/Interrupt CONTROL BITS OPERATION SEQUENCE Sequence Select Sample MUX A Inputs: AN0 -> CH0 SMPI<2:0> = 1111 Convert CH0, Write Buffer 0x0 Interrupt on 16th sample Sample MUX A Inputs: AN1 -> CH0 BUFM = 0 Convert CH0, Write Buffer 0x1 Single 16-word result buffer Sample MUX A Inputs: AN2 -> CH0 ALTS = 0 Convert CH0, Write Buffer 0x2 Always use MUX A input select Sample MUX A Inputs: AN3 -> CH0 MUX A Input Select Convert CH0, Write Buffer 0x3 CH0SA<3:0> = n/a Sample MUX A Inputs: AN4 -> CH0 Override by CSCNA Convert CH0, Write Buffer 0x4 CH0NA = 0 Sample MUX A Inputs: AN5 -> CH0 Select VREF- for CH0- input Convert CH0, Write Buffer 0x5 CSCNA = 1 Sample MUX A Inputs: AN6 -> CH0 Scan CH0+ Inputs Convert CH0, Write Buffer 0x6 CSSL<15:0> = 1111 1111 1111 1111 Sample MUX A Inputs: AN7 -> CH0 Scan all inputs Convert CH0, Write Buffer 0x7 MUX B Input Select Sample MUX A Inputs: AN8 -> CH0 CH0SB<3:0> = n/a Convert CH0, Write Buffer 0x8 Channel CH0+ input unused Sample MUX A Inputs: AN9 -> CH0 CH0NB = n/a Convert CH0, Write Buffer 0x9 Channel CH0- input unused Sample MUX A Inputs: AN10 -> CH0 Convert CH0, Write Buffer 0xA Sample MUX A Inputs: AN11 -> CH0 Convert CH0, Write Buffer 0xB Sample MUX A Inputs: AN12 -> CH0 Convert CH0, Write Buffer 0xC Sample MUX A Inputs: AN13 -> CH0 Convert CH0, Write Buffer 0xD Sample MUX A Inputs: AN14 -> CH0 Convert CH0, Write Buffer 0xE Sample MUX A Inputs: AN15 -> CH0 Convert CH0, Write Buffer 0xF Interrupt Repeat Buffer Address Buffer @ 1st Interrupt Buffer @ 2nd Interrupt ADCBUF0 AN0 sample 1 AN0 sample 17 ADCBUF1 AN1 sample 2 AN1 sample 18 ADCBUF2 AN2 sample 3 AN2 sample 19 ADCBUF3 AN3 sample 4 AN3 sample 20 ADCBUF4 AN4 sample 5 AN4 sample 21 ADCBUF5 AN5 sample 6 AN5 sample 22 ADCBUF6 AN6 sample 7 AN6 sample 23 ADCBUF7 AN7 sample 8 AN7 sample 24 ••• ADCBUF8 AN8 sample 9 AN8 sample 25 ADCBUF9 AN9 sample 10 AN9 sample 26 ADCBUFA AN10 sample 11 AN10 sample 27 ADCBUFB AN11 sample 12 AN11 sample 28 ADCBUFC AN12 sample 13 AN12 sample 29 ADCBUFD AN13 sample 14 AN13 sample 30 ADCBUFE AN14 sample 15 AN14 sample 31 ADCBUFF AN15 sample 16 AN15 sample 32 dsPIC30F Family Reference Manual DS70065D-page 18-26 © 2005 Microchip Technology Inc. 18.14.3 Example: Using Dual 8-Word Buffers Refer to Subsection 17.15.4 in Section 17. “10-bit A/D Converter” for an example that uses dual buffers. 18.14.4 Example: Using Alternating MUX A, MUX B Input Selections See Subsection 17.15.5 in Section 17. “10-bit A/D Converter” for an example that uses the MUX A and MUX B input selections. 18.15 A/D Sampling Requirements The analog input model of the 12-bit A/D converter is shown in Figure 18-11. The total sampling time for the A/D is a function of the internal amplifier settling time and the holding capacitor charge time. For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the voltage level on the analog input pin. The source impedance (RS), the interconnect impedance (RIC), and the internal sampling switch (RSS) impedance combine to directly affect the time required to charge the capacitor CHOLD. The combined impedance of the analog sources must therefore be small enough to fully charge the holding capacitor within the chosen sample time. To minimize the effects of pin leakage currents on the accuracy of the A/D converter, the maximum recommended source impedance, RS, is 2.5 kΩ. After the analog input channel is selected (changed), this sampling function must be completed prior to starting the conversion. The internal holding capacitor will be in a discharged state prior to each sample operation. At least 1 TAD time period should be allowed between conversions for the sample time. For more details, see the device electrical specifications. Figure 18-11: 12-bit A/D Converter Analog Input Model VA CPIN Rs ANx VT = 0.6V VT = 0.6V I leakage RIC ≤ 250Ω Sampling Switch RSS CHOLD = DAC capacitance VSS VDD ± 500 nA = 18 pF Legend: CPIN VT I leakage RIC RSS CHOLD = input capacitance = threshold voltage = leakage current at the pin due to = interconnect resistance = sampling switch resistance = sample/hold capacitance (from DAC) various junctions Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 2.5 kΩ. RSS ≤ 3 kΩ © 2005 Microchip Technology Inc. DS70065D-page 18-27 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.16 Reading the A/D Result Buffer The RAM is 12-bits wide, but the data is automatically formatted to one of four selectable formats when a read from the buffer is performed. The FORM<1:0> bits (ADCON1<9:8>) select the format. The formatting hardware provides a 16-bit result on the data bus for all of the data formats. Figure 18-12 shows the data output formats that can be selected using the FORM<1:0> control bits. Figure 18-12: A/D Output Data Formats Table 18-3: Numerical Equivalents of Various Result Codes RAM Contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Read to Bus: Integer 0 0 0 0 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Signed Integer d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 Signed Fractional (1.15) d11 d10 d09 d08 d07 d04 d03 d02 d01 d00 d01 d00 0 0 0 0 VIN/VREF 12-bit Output Code 16-bit Unsigned Integer Format 16-bit Signed Integer Format 16-bit Unsigned Fractional Format 16-bit Signed Fractional Format 4095/4096 1111 1111 1111 0000 1111 1111 1111 = 4095 0000 0111 1111 1111 = 2047 1111 1111 1111 0000 = 0.9998 0111 1111 1111 0000 = 0.9995 4094/4096 1111 1111 1110 0000 1111 1111 1110 = 4094 0000 0111 1111 1110 = 2046 1111 1111 1110 0000 = 0.9995 0111 1111 1110 0000 = 0.9990 • • • 2049/4096 1000 0000 0001 0000 1000 0000 0001 = 2049 0000 0000 0000 0001 = 1 1000 0000 0001 0000 = 0.5002 0000 0000 0001 0000 = 0.0005 2048/4096 1000 0000 0000 0000 1000 0000 0000 = 2048 0000 0000 0000 0000 = 0 1000 0000 0000 0000 = 0.500 0000 0000 0000 0000 = 0.000 2047/4096 0111 1111 1111 0000 0111 1111 1111 = 2047 1111 1111 1111 1111 = -1 0111 1111 1111 0000 = 0.4998 1111 1111 1111 0000 = -0.0005 • • • 1/4096 0000 0000 0001 0000 0000 0000 0001 = 1 1111 1000 0000 0001 = -2047 0000 0000 0001 0000 = 0.0002 1000 0000 0001 0000 = -0.9995 0/4096 0000 0000 0000 0000 0000 0000 0000 = 0 1111 1000 0000 0000 = -2048 0000 0000 0000 0000 = 0.000 1000 0000 0000 0000 = -1.000 dsPIC30F Family Reference Manual DS70065D-page 18-28 © 2005 Microchip Technology Inc. 18.17 Transfer Function The ideal transfer function of the A/D converter is shown in Figure 18-13. The difference of the input voltages (VINH – VINL) is compared to the reference (VREFH – VREFL). • The first code transition occurs when the input voltage is (VREFH – VREFL/8192) or 0.5 LSb. • The 00 0000 0001 code is centered at (VREFH – VREFL/4096) or 1.0 LSb. • The 10 0000 0000 code is centered at (2048*(VREFH – VREFL)/4096). • An input voltage less than (1*(VREFH – VREFL)/8192) converts as 00 0000 0000. • An input greater than (8192*(VREFH – VREFL)/8192) converts as 11 1111 1111. Figure 18-13: A/D Transfer Function 18.18 A/D Accuracy/Error Refer to Section 18.26 “Related Application Notes” for a list of documents that discuss A/D accuracy. 18.19 Connection Considerations Since the analog inputs employ ESD protection, they have diodes to VDD and VSS. This requires that the analog input must be between VDD and VSS. If the input voltage exceeds this range by greater than 0.3V (either direction), one of the diodes becomes forward biased and it may damage the device if the input current specification is exceeded. An external RC filter is sometimes added for anti-aliasing of the input signal. The R component should be selected to ensure that the sampling time requirements are satisfied. Any external components connected (via high-impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. 1000 0000 0001 (= 2049) 1000 0000 0010 (= 2050) 1000 0000 0011 (= 2051) 0111 1111 1101 (= 2045) 0111 1111 1110 (= 2046) 0111 1111 1111 (= 2047) 1111 1111 1110 (= 4094) 1111 1111 1111 (= 4095) 0000 0000 0000 (= 0) 0000 0000 0001 (= 1) Output Code 1000 0000 0000 (= 2048) (VINH – VINL) VREFL VREFH – VREFL 4096 2048*(VREFH – VREFL) 4096 VREFH VREFL + VREFL + © 2005 Microchip Technology Inc. DS70065D-page 18-29 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.20 Initialization Example 18-4 shows a simple initialization code example for the A/D module. In this particular configuration, all 16 analog input pins, AN0-AN15, are set up as analog inputs. Operation in Idle mode is disabled, output data is in unsigned fractional format, and AVDD and AVSS are used for VREFH and VREFL. The start of sampling, as well as the start of conversion (conversion trigger), are performed manually in software. Scanning of inputs is disabled and an interrupt occurs after every sample/convert sequence (1 conversion result). The A/D conversion clock is TCY/2; AN0 is converted. Since sampling is started manually by setting the SAMP bit (ADCON1<1>) after each conversion is complete, the auto-sample time bits, SAMC<4:0> (ADCON3<12:8>), are ignored. Moreover, since the start of conversion (i.e., end of sampling) is also triggered manually, the SAMP bit needs to be cleared each time a new sample needs to be converted. Example 18-4: A/D Initialization Code Example CLR ADPCFG ; Configure A/D port, ; all input pins are analog MOV #0x2200,W0 MOV W0,ADCON1 ; Configure sample clock source ; and conversion trigger mode. ; Unsigned Fractional format, ; Manual conversion trigger, ; Manual start of sampling, ; No operation in IDLE mode. CLR ADCON2 ; Configure A/D voltage reference ; and buffer fill modes. ; VREF from AVDD and AVSS, ; Inputs are not scanned, ; Interrupt every sample CLR ADCON3 ; Configure A/D conversion clock CLR ADCHS ; Configure input channels, ; CH0+ input is AN0. ; CHO- input is VREFL (AVss) CLR ADCSSL ; No inputs are scanned. BCLR IFS0,#ADIF ; Clear A/D conversion interrupt flag ; Configure A/D interrupt priority bits (ADIP<2:0>) here, if ; required. (default priority level is 4) BSET IEC0,#ADIE ; Enable A/D conversion interrupt BSET ADCON1,#ADON ; Turn on A/D BSET ADCON1,#SAMP ; Start sampling the input CALL DELAY ; Ensure the correct sampling time has ; elapsed before starting conversion. BCLR ADCON1,#SAMP ; End A/D Sampling and start Conversion : ; The DONE bit is set by hardware when conversion sequence is complete. : ; The ADIF bit will be set. dsPIC30F Family Reference Manual DS70065D-page 18-30 © 2005 Microchip Technology Inc. 18.21 A/D Conversion Speeds The dsPIC30F 12-bit A/D converter specifications permit a maximum of 200 ksps sampling rate. The table below summarizes the conversion speeds for the dsPIC30F 12-bit A/D converter and the required operating conditions. TABLE 18-4: 12-BIT A/D CONVERTER EXTENDED CONVERSION RATES dsPIC30F 10-bit A/D Converter Conversion Rates A/D Speed TAD Minimum Sampling Time Min Rs Max VDD Temperature A/D Channels Configuration Up to 200 ksps(1) 333.33 ns 1 TAD 2.5 kΩ 4.5V to 5.5V -40°C to +85°C Up to 100 ksps 666.67 ns 1 TAD 2.5 kΩ 3.0V to 5.5V -40°C to +125°C Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 18-14 for recommended circuit. VREF- VREF+ ADC ANx S/H CHX VREF- VREF+ ADC ANx S/H CHX ANx or VREFor AVSS or AVDD © 2005 Microchip Technology Inc. DS70065D-page 18-31 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 The following figure depicts the recommended circuit for the conversion rates above 100 ksps. The dsPIC30F6014 is shown as an example. Figure 18-14: A/D Converter Voltage Reference Schematic The configuration procedures below give the required setup values for the conversion speeds above 100 ksps. 18.21.1 200 ksps Configuration Guideline The following configuration items are required to achieve a 200 ksps conversion rate. • Comply with conditions provided in Table 18-4. • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 18-14. • Set SSRC<2.0> = 111 in the ADCON1 register to enable the auto convert option. • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register. • Write the SMPI<3.0> control bits in the ADCON2 register for the desired number of conversions between interrupts. • Configure the A/D clock period to be: by writing to the ADCS<5:0> control bits in the ADCON3 register. • Configure the sampling time to be 1 TAD by writing: SAMC<4:0> = 00001. 747372 VDD VSS 69 68 67 66 65 64 63 62 61 20 2 3 4 5 6 7 8 9 10 VSS VDD 13 14 15 16 50 49 VDD 47 46 45 44 21 41 V 34 35 36 37 38 39 40 REFVREF+ AVDD AVSS 27 28 29 30 VSS VDD 33 17 18 19 75 1 57 56 55 54 53 52 VSS 60 59 58 43 42 79 78 77 76 22 80 dsPIC30F6014 VDD VDD VDD VDD VDD VDD VDD R2 10 C2 0.1 μF C1 0.01 μF R1 10 C8 1 μF VDD C7 0.1 μF VDD C6 0.01 μF VDD C5 1 μF VDD C4 0.1 μF VDD C3 0.01 μF 1 (14 + 1) x 200,000 = 333.33 ns dsPIC30F Family Reference Manual DS70065D-page 18-32 © 2005 Microchip Technology Inc. The following figure shows the timing diagram of the A/D running at 200 ksps. The TAD selection in conjunction with the guidelines described above allows a conversion speed of 200 ksps. See Example 18-1 for code example. Figure 18-15: Converting 1 Channel at 200 ksps, Auto-Sample Start, 1 TAD Sampling Time Example 18-1: Converting at 200 ksps, Auto-Sample Start, 1 TAD Sampling Time Code Example TCONV = 14 TAD TSAMP = 1 TAD TSAMP = 1 TAD ADCLK SAMP DONE ADCBUF0 ADCBUF1 Instruction Execution BSET ADCON1, ASAM TCONV = 14 TAD ADPCFG = 0xFFFB; // all PORTB = Digital; RB2 = analog ADCON1 = 0x00E0; // SSRC bit = 111 implies internal // counter ends sampling and starts // converting. ADCHS = 0x0002; // Connect RB2/AN2 as CH0 input // in this example RB2/AN2 is the input ADCSSL = 0; ADCON3 = 0x0113; // Sample time = 1Tad, Tad = 333.33 ns @ 30 MIPS // which will give 1 / (15 * 333.33 ns) = 200 ksps ADCON2 = 0x6004; // Select external VREF+ and VREF- pins // Interrupt after every 2 samples ADCON1bits.ADON = 1; // turn ADC ON while (1) // repeat continuously { ADCValue = 0; // clear value ADC16Ptr = &ADCBUF0; // initialize ADCBUF pointer IFS0bits.ADIF = 0; // clear ADC interrupt flag ADCON1bits.ASAM = 1; // auto start sampling // for 31Tad then go to conversion while (!IFS0bits.ADIF); // conversion done? ADCON1bits.ASAM = 0; // yes then stop sample/convert for (count = 0; count <2; count++)// average the 2 ADC value ADCValue = ADCValue + *ADC16Ptr++; ADCValue = ADCValue >> 1; } // repeat © 2005 Microchip Technology Inc. DS70065D-page 18-33 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.22 Operation During Sleep and Idle Modes Sleep and Idle modes are useful for minimizing conversion noise because the digital activity of the CPU, buses and other peripherals is minimized. 18.22.1 CPU Sleep Mode Without RC A/D Clock When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a conversion, the conversion is aborted unless the A/D is clocked from its internal RC clock generator. The converter will not resume a partially completed conversion on exiting from Sleep mode. Register contents are not affected by the device entering or leaving Sleep mode. 18.22.2 CPU Sleep Mode With RC A/D Clock The A/D module can operate during Sleep mode if the A/D clock source is set to the internal A/D RC oscillator (ADRC = 1). This eliminates digital switching noise from the conversion. When the conversion is completed, the CONV bit will be cleared and the result loaded into the A/D result buffer, ADCBUF. If the A/D interrupt is enabled (ADIE = 1), the device will wake-up from Sleep when the A/D interrupt occurs. Program execution will resume at the A/D Interrupt Service Routine if the A/D interrupt is greater than the current CPU priority. Otherwise, execution will continue from the instruction after the PWRSAV instruction, that placed the device in Sleep mode. If the A/D interrupt is not enabled, the A/D module will then be turned off, although the ADON bit will remain set. To minimize the effects of digital noise on the A/D module operation, the user should select a conversion trigger source that ensures the A/D conversion will take place in Sleep mode. The automatic conversion trigger option can be used for sampling and conversion in Sleep (SSRC<2:0> = 111). To use the automatic conversion option, the ADON bit should be set in the instruction prior to the PWRSAV instruction. 18.22.3 A/D Operation During CPU Idle Mode For the A/D, the ADSIDL bit (ADCON1<13>) selects if the module will stop on Idle or continue on Idle. If ADSIDL = 0, the module will continue normal operation when the device enters Idle mode. If the A/D interrupt is enabled (ADIE = 1), the device will wake-up from Idle mode when the A/D interrupt occurs. Program execution will resume at the A/D Interrupt Service Routine if the A/D interrupt is greater than the current CPU priority. Otherwise, execution will continue from the instruction after the PWRSAV instruction that placed the device in Idle mode. If ADSIDL = 1, the module will stop in Idle. If the device enters Idle mode in the middle of a conversion, the conversion is aborted. The converter will not resume a partially completed conversion on exiting from Idle mode. 18.23 Effects of a Reset A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off, and any conversion in progress is aborted. All pins that are multiplexed with analog inputs will be configured as analog inputs. The corresponding TRIS bits will be set. The values in the ADCBUF registers are not initialized during a Power-on Reset. ADCBUF0...ADCBUFF will contain unknown data. Note: For the A/D module to operate in Sleep, the A/D clock source must be set to RC (ADRC = 1). dsPIC30F Family Reference Manual DS70065D-page 18-34 © 2005 Microchip Technology Inc. 18.24 Special Function Registers Associated with the 12-bit A/D Converter The following table lists dsPIC30F 12-bit A/D Converter Special Function Registers, including their addresses and formats. All unimplemented registers and/or bits within a register read as zeros. Table 18-4: ADC Register Map File Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset States INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL — 0000 0000 0000 0000 INTCON2 0082 ALTIVT — — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000 IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IPC2 0098 — ADIP<2:0> — U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100 ADCBUF0 0280 ADC Data Buffer 0 uuuu uuuu uuuu uuuu ADCBUF1 0282 ADC Data Buffer 1 uuuu uuuu uuuu uuuu ADCBUF2 0284 ADC Data Buffer 2 uuuu uuuu uuuu uuuu ADCBUF3 0286 ADC Data Buffer 3 uuuu uuuu uuuu uuuu ADCBUF4 0288 ADC Data Buffer 4 uuuu uuuu uuuu uuuu ADCBUF5 028A ADC Data Buffer 5 uuuu uuuu uuuu uuuu ADCBUF6 028C ADC Data Buffer 6 uuuu uuuu uuuu uuuu ADCBUF7 028E ADC Data Buffer 7 uuuu uuuu uuuu uuuu ADCBUF8 0290 ADC Data Buffer 8 uuuu uuuu uuuu uuuu ADCBUF9 0292 ADC Data Buffer 9 uuuu uuuu uuuu uuuu ADCBUFA 0294 ADC Data Buffer 10 uuuu uuuu uuuu uuuu ADCBUFB 0296 ADC Data Buffer 11 uuuu uuuu uuuu uuuu ADCBUFC 0298 ADC Data Buffer 12 uuuu uuuu uuuu uuuu ADCBUFD 029A ADC Data Buffer 13 uuuu uuuu uuuu uuuu ADCBUFE 029C ADC Data Buffer 14 uuuu uuuu uuuu uuuu ADCBUFF 029E ADC Data Buffer 15 uuuu uuuu uuuu uuuu ADCON1 02A0 ADON — ADSIDL — — — FORM[1:0] SSRC[2:0] — — ASAM SAMP CONV 0000 0000 0000 0000 ADCON2 02A2 VCFG[2:0] — — CSCNA — — BUFS — SMPI[3:0] BUFM ALTS 0000 0000 0000 0000 ADCON3 02A4 — — — SAMC[4:0] ADRC — ADCS[5:0] 0000 0000 0000 0000 ADCHS 02A6 — — — CH0NB CH0SB[3:0] — — — CH0NA CH0SA[3:0] 0000 0000 0000 0000 ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000 ADCSSL 02AA ADC Input Scan Select Register 0000 0000 0000 0000 Legend: u = unknown Note: All interrupt sources and their associated control bits may not be available on a particular device. Refer to the device data sheet for details. © 2005 Microchip Technology Inc. DS70065D-page 18-35 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.25 Design Tips Question 1: How can I optimize the system performance of the A/D converter? Answer: 1. Make sure you are meeting all of the timing specifications. If you are turning the module off and on, there is a minimum delay you must wait before taking a sample. If you are changing input channels, there is a minimum delay you must wait for this as well, and finally, there is TAD, which is the time selected for each bit conversion. This is selected in ADCON3 and should be within a certain range, as specified in the Electrical Characteristics. If TAD is too short, the result may not be fully converted before the conversion is terminated, and if TAD is made too long, the voltage on the sampling capacitor can decay before the conversion is complete. These timing specifications are provided in the “Electrical Specifications” section of the device data sheets. 2. Often, the source impedance of the analog signal is high (greater than 10 kΩ), so the current drawn from the source by leakage, and to charge the sample capacitor, can affect accuracy. If the input signal does not change too quickly, try putting a 0.1 μF capacitor on the analog input. This capacitor will charge to the analog voltage being sampled and supply the instantaneous current needed to charge the 18 pF internal holding capacitor. 3. Put the device into Sleep mode before the start of the A/D conversion. The RC clock source selection is required for conversions in Sleep mode. This technique increases accuracy, because digital noise from the CPU and other peripherals is minimized. Question 2: Do you know of a good reference on A/D’s? Answer: A good reference for understanding A/D conversions is the “Analog-Digital Conversion Handbook” third edition, published by Prentice Hall (ISBN 0-13-03-2848-0). Question 3: My combination of channels/sample and samples/interrupt is greater than the size of the buffer. What will happen to the buffer? Answer: This configuration is not recommended. The buffer will contain unknown results. dsPIC30F Family Reference Manual DS70065D-page 18-36 © 2005 Microchip Technology Inc. 18.26 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the 12-bit A/D Converter module are: Title Application Note # Using the Analog-to-Digital (A/D) Converter AN546 Four Channel Digital Voltmeter with Display and Keyboard AN557 Understanding A/D Converter Performance Specifications AN693 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70065D-page 18-37 Section 18. 12-bit A/D Converter 12-bit A/D Converter 18 18.27 Revision History Revision A This is the initial released revision of this document. Revision B To reflect editorial and technical content revisions for the dsPIC30F 12-bit A/D Converter module. Revision C This revision incorporates all known errata at the time of this document update. Revision D This revision includes the extended conversion rate guidelines. dsPIC30F Family Reference Manual DS70065D-page 18-38 © 2005 Microchip Technology Inc. NOTES: © 2004 Microchip Technology Inc. DS70066C-page 19-1 UART 19 Section 19. UART HIGHLIGHTS This section of the manual contains the following major topics: 19.1 Introduction .................................................................................................................. 19-2 19.2 Control Registers ......................................................................................................... 19-3 19.3 UART Baud Rate Generator (BRG)............................................................................. 19-8 19.4 UART Configuration................................................................................................... 19-10 19.5 UART Transmitter ...................................................................................................... 19-11 19.6 UART Receiver .......................................................................................................... 19-14 19.7 Using the UART for 9-bit Communication.................................................................. 19-18 19.8 Receiving Break Characters ...................................................................................... 19-19 19.9 Initialization ................................................................................................................ 19-20 19.10 Other Features of the UART ...................................................................................... 19-21 19.11 UART Operation During CPU Sleep and Idle Modes ................................................ 19-21 19.12 Registers Associated with UART Module .................................................................. 19-22 19.13 Design Tips ................................................................................................................ 19-23 19.14 Related Application Notes.......................................................................................... 19-24 19.15 Revision History ......................................................................................................... 19-25 dsPIC30F Family Reference Manual DS70066C-page 19-2 © 2004 Microchip Technology Inc. 19.1 Introduction The Universal Asynchronous Receiver Transmitter (UART) module is one of the serial I/O modules available in the dsPIC30F device family. The UART is a full-duplex asynchronous system that can communicate with peripheral devices, such as personal computers, RS-232 and RS-485 interfaces. The primary features of the UART module are: • Full-duplex 8- or 9-bit data transmission through the UxTX and UxRX pins • Even, Odd or No Parity options (for 8-bit data) • One or two Stop bits • Fully integrated Baud Rate Generator with 16-bit prescaler • Baud rates ranging from 29 bps to 1.875 Mbps at FCY = 30 MHz • 4-deep First-In-First-Out (FIFO) transmit data buffer • 4-deep FIFO receive data buffer • Parity, Framing and Buffer Overrun error detection • Support for 9-bit mode with Address Detect (9th bit = 1) • Transmit and Receive Interrupts • Loopback mode for diagnostic support A simplified block diagram of the UART is shown in Figure 19-1. The UART module consists of the key important hardware elements: • Baud Rate Generator • Asynchronous Transmitter • Asynchronous Receiver Figure 19-1: UART Simplified Block Diagram Note: Each dsPIC30F device variant may have one or more UART modules. An ‘x’ used in the names of pins, control/status bits and registers denotes the particular module. Refer to the specific device data sheets for more details. Baud Rate Generator UART Receiver UART Transmitter UxRX UxTX © 2004 Microchip Technology Inc. DS70066C-page 19-3 Section 19. UART UART 19 19.2 Control Registers Register 19-1: UXMODE: UARTX Mode Register Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 UARTEN — USIDL — reserved ALTIO reserved reserved bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 WAKE LPBACK ABAUD — — PDSEL<1:0> STSEL bit 7 bit 0 bit 15 UARTEN: UART Enable bit 1 = UART is enabled. UART pins are controlled by UART as defined by UEN<1:0> and UTXEN control bits. 0 = UART is disabled. UART pins are controlled by corresponding PORT, LAT, and TRIS bits. bit 14 Unimplemented: Read as ‘0’ bit 13 USIDL: Stop in Idle Mode bit 1 = Discontinue operation when device enters Idle mode 0 = Continue operation in Idle mode bit 12 Unimplemented: Read as ‘0’ bit 11 Reserved: Write ‘0’ to this location bit 10 ALTIO: UART Alternate I/O Selection bit 1 = UART communicates using UxATX and UxARX I/O pins 0 = UART communicates using UxTX and UxRX I/O pins Note: The alternate UART I/O pins are not available on all devices. See device data sheet for details. bit 9-8 Reserved: Write ‘0’ to these locations bit 7 WAKE: Enable Wake-up on Start bit Detect During Sleep Mode bit 1 = Wake-up enabled 0 = Wake-up disabled bit 6 LPBACK: UART Loopback Mode Select bit 1 = Enable Loopback mode 0 = Loopback mode is disabled bit 5 ABAUD: Auto Baud Enable bit 1 = Input to Capture module from UxRX pin 0 = Input to Capture module from ICx pin bit 4-3 Unimplemented: Read as ‘0’ bit 2-1 PDSEL<1:0>: Parity and Data Selection bits 11 = 9-bit data, no parity 10 = 8-bit data, odd parity 01 = 8-bit data, even parity 00 = 8-bit data, no parity bit 0 STSEL: Stop Selection bit 1 = 2 Stop bits 0 = 1 Stop bit Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70066C-page 19-4 © 2004 Microchip Technology Inc. Register 19-2: UXSTA: UARTX Status and Control Register Upper Byte: R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 R-0 R-1 UTXISEL — — — UTXBRK UTXEN UTXBF TRMT bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0 URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA bit 7 bit 0 bit 15 UTXISEL: Transmission Interrupt Mode Selection bit 1 = Interrupt when a character is transferred to the Transmit Shift register and as result, the transmit buffer becomes empty 0 = Interrupt when a character is transferred to the Transmit Shift register (this implies that there is at least one character open in the transmit buffer) bit 14-12 Unimplemented: Read as ‘0’ bit 11 UTXBRK: Transmit Break bit 1 = UxTX pin is driven low, regardless of transmitter state 0 = UxTX pin operates normally bit 10 UTXEN: Transmit Enable bit 1 = UART transmitter enabled, UxTX pin controlled by UART (if UARTEN = 1) 0 = UART transmitter disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled by PORT. bit 9 UTXBF: Transmit Buffer Full Status bit (Read Only) 1 = Transmit buffer is full 0 = Transmit buffer is not full, at least one more data word can be written bit 8 TRMT: Transmit Shift Register is Empty bit (Read Only) 1 = Transmit shift register is empty and transmit buffer is empty (the last transmission has completed) 0 = Transmit shift register is not empty, a transmission is in progress or queued in the transmit buffer bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bit 11 =Interrupt flag bit is set when Receive Buffer is full (i.e., has 4 data characters) 10 =Interrupt flag bit is set when Receive Buffer is 3/4 full (i.e., has 3 data characters) 0x =Interrupt flag bit is set when a character is received bit 5 ADDEN: Address Character Detect (bit 8 of received data = 1) 1 = Address Detect mode enabled. If 9-bit mode is not selected, this control bit has no effect. 0 = Address Detect mode disabled bit 4 RIDLE: Receiver Idle bit (Read Only) 1 = Receiver is Idle 0 = Data is being received bit 3 PERR: Parity Error Status bit (Read Only) 1 = Parity error has been detected for the current character 0 = Parity error has not been detected bit 2 FERR: Framing Error Status bit (Read Only) 1 = Framing Error has been detected for the current character 0 = Framing Error has not been detected © 2004 Microchip Technology Inc. DS70066C-page 19-5 Section 19. UART UART 19 Register 19-2: UXSTA: UARTX Status and Control Register (Continued) bit 1 OERR: Receive Buffer Overrun Error Status bit (Read/Clear Only) 1 = Receive buffer has overflowed 0 = Receive buffer has not overflowed bit 0 URXDA: Receive Buffer Data Available bit (Read Only) 1 = Receive buffer has data, at least one more character can be read 0 = Receive buffer is empty Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ C = Bit can be cleared -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70066C-page 19-6 © 2004 Microchip Technology Inc. Register 19-3: UXRXREG: UARTX Receive Register Register 19-4: UXTXREG: UARTX Transmit Register (Write Only) Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 R-0 — — — — — — — URX8 bit 15 bit 8 Lower Byte: R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 URX<7:0> bit 7 bit 0 bit 15-9 Unimplemented: Read as ‘0’ bit 8 URX8: Data bit 8 of the Received Character (in 9-bit mode) bit 7-0 URX<7:0>: Data bits 7-0 of the Received Character Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 W-x — — — — — — — UTX8 bit 15 bit 8 Lower Byte: W-x W-x W-x W-x W-x W-x W-x W-x UTX<7:0> bit 7 bit 0 bit 15-9 Unimplemented: Read as ‘0’ bit 8 UTX8: Data bit 8 of the Character to be Transmitted (in 9-bit mode) bit 7-0 UTX<7:0>: Data bits 7-0 of the Character to be Transmitted Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70066C-page 19-7 Section 19. UART UART 19 Register 19-5: UXBRG: UARTX Baud Rate Register Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BRG<15:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BRG<7:0> bit 7 bit 0 bit 15-0 BRG<15:0>: Baud Rate Divisor bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70066C-page 19-8 © 2004 Microchip Technology Inc. 19.3 UART Baud Rate Generator (BRG) The UART module includes a dedicated 16-bit baud rate generator. The UxBRG register controls the period of a free running 16-bit timer. Equation 19-1 shows the formula for computation of the baud rate. Equation 19-1: UART Baud Rate Example 19-1 shows the calculation of the baud rate error for the following conditions: • FCY = 4 MHz • Desired Baud Rate = 9600 Example 19-1: Baud Rate Error Calculation The maximum baud rate possible is FCY / 16 (for UxBRG = 0), and the minimum baud rate possible is FCY / (16 * 65536). Writing a new value to the UxBRG register causes the BRG timer to be reset (cleared). This ensures the BRG does not wait for a timer overflow before generating the new baud rate. Note: FCY denotes the instruction cycle clock frequency. Baud Rate = FCY 16 • (UxBRG + 1) FCY 16 • Baud Rate UxBRG = – 1 Desired Baud Rate = FCY/(16 (UxBRG + 1)) Solving for UxBRG value: UxBRG = ( (FCY/Desired Baud Rate)/16) – 1 UxBRG = ((4000000/9600)/16) – 1 UxBRG = [25.042] = 25 Calculated Baud Rate = 4000000/(16 (25 + 1)) = 9615 Error = (Calculated Baud Rate – Desired Baud Rate) Desired Baud Rate = (9615 – 9600)/9600 = 0.16% © 2004 Microchip Technology Inc. DS70066C-page 19-9 Section 19. UART UART 19 19.3.1 Baud Rate Tables UART baud rates are provided in Table 19-1 for common device instruction cycle frequencies (FCY). The minimum and maximum baud rates for each frequency are also shown. Table 19-1: UART Baud Rates BAUD RATE (Kbps) FCY = 30 MHz BRG value (decimal) 25 MHz BRG value (decimal) 20 MHz BRG value (decimal) 16 MHz BRG value (decimal) KBAUD % ERROR KBAUD % ERROR KBAUD % ERROR KBAUD % ERROR 0.3 0.3 0.0 6249 0.3 +0.01 5207 0.3 0.0 4166 0.3 +0.01 3332 1.2 1.1996 0.0 1562 1.2001 +0.01 1301 1.1996 0.0 1041 1.2005 +0.04 832 2.4 2.4008 0.0 780 2.4002 +0.01 650 2.3992 0.0 520 2.3981 -0.08 416 9.6 9.6154 +0.2 194 9.5859 -0.15 162 9.6154 +0.2 129 9.6154 +0.16 103 19.2 19.1327 -0.4 97 19.2901 0.47 80 19.2308 +0.2 64 19.2308 +0.16 51 38.4 38.2653 -0.4 48 38.1098 -0.76 40 37.8788 -1.4 32 38.4615 +0.16 25 56 56.8182 +1.5 32 55.8036 -0.35 27 56.8182 +1.5 21 55.5556 -0.79 17 115 117.1875 +1.9 15 111.6071 -2.95 13 113.6364 -1.2 10 111.1111 -3.38 8 250 250 0.0 4 250 0.0 3 500 500 0.0 1 MIN. 0.0286 0.0 65535 0.0238 0.0 65535 0.019 0.0 65535 0.015 0.0 65535 MAX. 1875 0.0 0 1562.5 0.0 0 1250 0.0 0 1000 0.0 0 BAUD RATE (Kbps) FCY = 12 MHz BRG value (decimal) 10 MHz BRG value (decimal) 8 MHz BRG value (decimal) 7.68 MHz BRG value (decimal) KBAUD % ERROR KBAUD % ERROR KBAUD % ERROR KBAUD % ERROR 0.3 0.3 0.0 2499 0.3 0.0 2082 0.2999 -0.02 1666 0.3 0.0 1599 1.2 1.2 0.0 624 1.1996 0.0 520 1.199 -0.08 416 1.2 0.0 399 2.4 2.3962 -0.2 312 2.4038 +0.2 259 2.4038 +0.16 207 2.4 0.0 199 9.6 9.6154 -0.2 77 9.6154 +0.2 64 9.6154 +0.16 51 9.6 0.0 49 19.2 19.2308 +0.2 38 18.9394 -1.4 32 19.2308 +0.16 25 19.2 0.0 24 38.4 37.5 +0.2 19 39.0625 +1.7 15 38.4615 +0.16 12 56 57.6923 -2.3 12 56.8182 +1.5 10 55.5556 -0.79 8 115 6 250 250 0.0 2 250 0.0 1 500 500 0.0 0 MIN. 0.011 0.0 65535 0.010 0.0 65535 0.008 0.0 65535 0.007 0.0 65535 MAX. 750 0.0 0 625 0.0 0 500 0.0 0 480 0.0 0 BAUD RATE (Kbps) FCY = 5 MHz BRG value (decimal) 4 MHz BRG value (decimal) 3.072 MHz BRG value (decimal) 1.8432 MHz BRG value (decimal) KBAUD % ERROR KBAUD % ERROR KBAUD % ERROR KBAUD % ERROR 0.3 0.2999 0.0 1041 0.3001 0.0 832 0.3 0.0 639 0.3 0.0 383 1.2 1.2019 +0.2 259 1.2019 +0.2 207 1.2 0.0 159 1.2 0.0 95 2.4 2.4038 +0.2 129 2.4038 +0.2 103 2.4 0.0 79 2.4 0.0 47 9.6 9.4697 -1.4 32 9.6154 +0.2 25 9.6 0.0 19 9.6 0.0 11 19.2 19.5313 +1.7 15 19.2308 +0.2 12 19.2 0.0 9 19.2 0.0 5 38.4 39.0625 +1.7 7 38.4 0.0 4 38.4 0.0 2 56 115 250 500 MIN. 0.005 0.0 65535 0.004 0.0 65535 0.003 0.0 65535 0.002 0.0 65535 MAX. 312.5 0.0 0 250 0.0 0 192 0.0 0 115.2 0.0 0 dsPIC30F Family Reference Manual DS70066C-page 19-10 © 2004 Microchip Technology Inc. 19.4 UART Configuration The UART uses standard non-return-to-zero (NRZ) format (one Start bit, eight or nine data bits, and one or two Stop bits). Parity is supported by the hardware, and may be configured by the user as even, odd or no parity. The most common data format is 8 bits, no parity and one Stop bit (denoted as 8, N, 1), which is the default (POR) setting. The number of data bits and Stop bits, and the parity, are specified in the PDSEL<1:0> (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. An on-chip dedicated 16-bit baud rate generator can be used to derive standard baud rate frequencies from the oscillator. The UART transmits and receives the LSb first. The UART’s transmitter and receiver are functionally independent, but use the same data format and baud rate. 19.4.1 Enabling the UART The UART module is enabled by setting the UARTEN (UxMODE<15>) bit and UTXEN (UxSTA<10>) bit. Once enabled, the UxTX and UxRX pins are configured as an output and an input, respectively, overriding the TRIS and PORT register bit settings for the corresponding I/O port pins. The UxTX pin is at logic ‘1’ when no transmission is taking place. 19.4.2 Disabling the UART The UART module is disabled by clearing the UARTEN (UxMODE<15>) bit. This is the default state after any Reset. If the UART is disabled, all UART pins operate as port pins under the control of their corresponding PORT and TRIS bits. Disabling the UART module resets the buffers to empty states. Any data characters in the buffers are lost, and the baud rate counter is reset. All error and status flags associated with the UART module are reset when the module is disabled. The URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and UTXBF bits are cleared, whereas RIDLE and TRMT are set. Other control bits, including ADDEN, URXISEL<1:0>, UTXISEL, as well as the UxMODE and UxBRG registers, are not affected. Clearing the UARTEN bit while the UART is active will abort all pending transmissions and receptions and reset the module as defined above. Re-enabling the UART will restart the UART in the same configuration. 19.4.3 Alternate UART I/O Pins Some dsPIC30F devices have an alternate set of UART transmit and receive pins that can be used for communications. The alternate UART pins are useful when the primary UART pins are shared by other peripherals. The alternate I/O pins are enabled by setting the ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX and UxARX pins (alternate transmit and alternate receive pins, respectively) are used by the UART module, instead of the UxTX and UxRX pins. If ALTIO = 0, the UxTX and UxRX pins are used by the UART module. Note: The UTXEN bit should not be set until the UARTEN bit has been set. Otherwise, UART transmissions will not be enabled. © 2004 Microchip Technology Inc. DS70066C-page 19-11 Section 19. UART UART 19 19.5 UART Transmitter The UART transmitter block diagram is shown in Figure 19-2. The heart of the transmitter is the Transmit Shift register (UxTSR). The Shift register obtains its data from the transmit FIFO buffer, UxTXREG. The UxTXREG register is loaded with data in software. The UxTSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the UxTSR is loaded with new data from the UxTXREG register (if available). Figure 19-2: UART Transmitter Block Diagram Transmission is enabled by setting the UTXEN enable bit (UxSTA<10>). The actual transmission will not occur until the UxTXREG register has been loaded with data and the Baud Rate Generator (UxBRG) has produced a shift clock (Figure 19-2). The transmission can also be started by first loading the UxTXREG register and then setting the UTXEN enable bit. Normally when transmission is first started, the UxTSR register is empty, so a transfer to the UxTXREG register will result in an immediate transfer to UxTSR. Clearing the UTXEN bit during a transmission will cause the transmission to be aborted and will reset the transmitter. As a result, the UxTX pin will revert to a high-impedance state. In order to select 9-bit transmission, the PDSEL<1:0> bits (UxMODE<2:1>) should be set to ‘11’ and the ninth bit should be written to the UTX9 bit (UxTXREG<8>). A word write should be performed to UxTXREG so that all nine bits are written at the same time. Note: The UxTSR register is not mapped in data memory, so it is not available to the user. Word Write only Word UTX8 UxTXREG Low Byte Load TSR Transmit Control – Control TSR – Control Buffer – Generate Flags – Generate Interrupt UxTXIF Data ‘0’ (Start) ‘1’ (Stop) Parity Parity Generator Transmit Shift Register (UxTSR) 16 Divider Control Signals 16X Baud Clock from Baud Rate Generator Internal Data Bus UTXBRK UxTX Note: ‘x’ denotes the UART number. UxTX UxMODE UxSTA 16 or Byte Write Transmit FIFO 15 9 8 7 0 Note: There is no parity in the case of 9-bit data transmission. dsPIC30F Family Reference Manual DS70066C-page 19-12 © 2004 Microchip Technology Inc. 19.5.1 Transmit Buffer (UxTXB) Each UART has a 4-deep, 9-bit wide FIFO transmit data buffer. The UxTXREG register provides user access to the next available buffer location. The user may write up to 4 words in the buffer. Once the UxTXREG contents are transferred to the UxTSR register, the current buffer location becomes available for new data to be written and the next buffer location is sourced to the UxTSR register. The UTXBF (UxSTA<9>) status bit is set whenever the buffer is full. If a user attempts to write to a full buffer, the new data will not be accepted into the FIFO. The FIFO is reset during any device Reset, but is not affected when the device enters a Power Saving mode or wakes up from a Power Saving mode. 19.5.2 Transmit Interrupt The transmit interrupt flag (UxTXIF) is located in the corresponding interrupt flag status (IFS) register. The UTXISEL control bit (UxSTA<15>) determines when the UART will generate a transmit interrupt. 1. If UTXISEL = 0, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR). This implies that the transmit buffer has at least one empty word. Since an interrupt is generated after the transfer of each individual word, this mode is useful if interrupts can be handled frequently (i.e., the ISR is completed before the transmission of the next word). 2. If UTXISEL = 1, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR) and the transmit buffer is empty. Since an interrupt is generated only after all 4 words have been transmitted, this ‘Block Transmit’ mode is useful if the user’s code cannot handle interrupts quickly enough (i.e., the ISR is completed before the transmission of the next word). The UxTXIF bit will be set when the module is first enabled. The user should clear the UxTXIF bit in the ISR. Switching between the two Interrupt modes during operation is possible. While the UxTXIF flag bit indicates the status of the UxTXREG register, the TRMT bit (UxSTA<8>) shows the status of the UxTSR register. The TRMT status bit is a read only bit, which is set when the UxTSR register is empty. No interrupt logic is tied to this bit, so the user has to poll this bit in order to determine if the UxTSR register is empty. Note: When the UTXEN bit is set, the UxTXIF flag bit will also be set if UTXISEL = 0, since the transmit buffer is not yet full (can move transmit data to the UxTXREG register). © 2004 Microchip Technology Inc. DS70066C-page 19-13 Section 19. UART UART 19 19.5.3 Setup for UART Transmit Steps to follow when setting up a transmission: 1. Initialize the UxBRG register for the appropriate baud rate (Section 19.3 “UART Baud Rate Generator (BRG)”). 2. Set the number of data bits, number of Stop bits, and parity selection by writing to the PDSEL<1:0> (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. 3. If transmit interrupts are desired, set the UxTXIE control bit in the corresponding Interrupt Enable Control register (IEC). Specify the interrupt priority for the transmit interrupt using the UxTXIP<2:0> control bits in the corresponding Interrupt Priority Control register (IPC). Also, select the Transmit Interrupt mode by writing the UTXISEL (UxSTA<15>) bit. 4. Enable the UART module by setting the UARTEN (UxMODE<15>) bit. 5. Enable the transmission by setting the UTXEN (UxSTA<10>) bit, which will also set the UxTXIF bit. The UxTXIF bit should be cleared in the software routine that services the UART transmit interrupt. The operation of the UxTXIF bit is controlled by the UTXISEL control bit. 6. Load data to the UxTXREG register (starts transmission). If 9-bit transmission has been selected, load a word. If 8-bit transmission is used, load a byte. Data can be loaded into the buffer until the UxTXBF status bit (UxSTA<9>) is set. Figure 19-3: Transmission (8-bit or 9-bit Data) Figure 19-4: Transmission (Back to Back) Note: The UTXEN bit should not be set until the UARTEN bit has been set. Otherwise, UART transmissions will not be enabled. Character 1 Stop Bit Character 1 to Transmit Shift Reg. Start Bit Bit 0 Bit 1 Bit 7/8 Write to UxTXREG Character 1 BCLK/16 (Shift Clock) UxTX UxTXIF TRMT bit UxTXIF Cleared by User Transmit Shift Reg. Write to UxTXREG BCLK/16 (Shift Clock) UxTX UxTXIF TRMT bit Character 1 Character 2 Character 1 to Character 2 to Start Bit Stop Bit Start Bit Transmit Shift Reg. Character 1 Character 2 Bit 0 Bit 1 Bit 7/8 Bit 0 Note: This timing diagram shows two consecutive transmissions. (UTXISEL = 0) UxTXIF (UTXISEL = 1) UxTXIF Cleared by User in Software dsPIC30F Family Reference Manual DS70066C-page 19-14 © 2004 Microchip Technology Inc. 19.5.4 Transmission of Break Characters Setting the UTXBRK bit (UxSTA<11>) will force the UxTX line to ‘0’. UTXBRK overrides any other transmitter activity. The user should wait for the transmitter to be Idle (TRMT = 1) before setting UTXBRK. To send a break character, the UTXBRK bit must be set by software and remain set for a minimum of 13 baud clocks. The baud clock periods are timed in software. The UTXBRK bit is then cleared by software to generate the Stop bit. The user must wait at least one or two baud clocks to ensure a valid Stop bit(s) before loading the UTXBUF again or renewing transmitter activity. 19.6 UART Receiver The receiver block diagram is shown in Figure 19-5. The heart of the receiver is the Receive (Serial) Shift register (UxRSR). The data is received on the UxRX pin and is sent to the data recovery block. The data recovery block operates at 16 times the baud rate, whereas the main receive serial shifter operates at the baud rate. After sampling the UxRX pin for the Stop bit, the received data in UxRSR is transferred to the receive FIFO (if it is empty). The data on the UxRX pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the UxRX pin. Figure 19-5 shows the sampling scheme. 19.6.1 Receive Buffer (UxRXB) The UART receiver has a 4-deep, 9-bit wide FIFO receive data buffer. UxRXREG is a memory mapped register that provides access to the output of the FIFO. It is possible for 4 words of data to be received and transferred to the FIFO and a fifth word to begin shifting to the UxRSR register before a buffer overrun occurs. 19.6.2 Receiver Error Handling If the FIFO is full (four characters) and a fifth character is fully received into the UxRSR register, the overrun error bit, OERR (UxSTA<1>), will be set. The word in UxRSR will be kept, but further transfers to the receive FIFO are inhibited as long as the OERR bit is set. The user must clear the OERR bit in software to allow further data to be received. If it is desired to keep the data received prior to the overrun, the user should first read all five characters, then clear the OERR bit. If the five characters can be discarded, the user can simply clear the OERR bit. This effectively resets the receive FIFO and all prior received data is lost. The framing error bit, FERR (UxSTA<2>), is set if a Stop bit is detected as a logic low level. The parity error bit, PERR (UxSTA<3>), is set if a parity error has been detected in the data word at the top of the buffer (i.e., the current word). For example, a parity error would occur if the parity is set to be even, but the total number of ones in the data has been detected to be odd. The PERR bit is irrelevant in the 9-bit mode. The FERR and PERR bits are buffered along with the corresponding word and should be read before reading the data word. Note: Sending a break character does not generate a transmitter interrupt. Note: The UxRSR register is not mapped in data memory, so it is not available to the user. Note: The data in the receive FIFO should be read prior to clearing the OERR bit. The FIFO is reset when OERR is cleared, which causes all data in the buffer to be lost. © 2004 Microchip Technology Inc. DS70066C-page 19-15 Section 19. UART UART 19 19.6.3 Receive Interrupt The UART receive interrupt flag (UxRXIF) is located in the corresponding Interrupt Flag Status (IFS) register. The URXISEL<1:0> (UxSTA<7:6>) control bits determine when the UART receiver generates an interrupt. a) If URXISEL<1:0> = 00 or 01, an interrupt is generated each time a data word is transferred from the Receive Shift register (UxRSR) to the receive buffer. There may be one or more characters in the receive buffer. b) If URXISEL<1:0> = 10, an interrupt is generated when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer and as a result, the receive buffer contains 3 or 4 characters. c) If URXISEL<1:0> = 11, an interrupt is generated when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer and as a result, the receive buffer contains 4 characters (i.e., becomes full). Switching between the three Interrupt modes during operation is possible. While the URXDA and UxRXIF flag bits indicate the status of the UxRXREG register, the RIDLE bit (UxSTA<4>) shows the status of the UxRSR register. The RIDLE status bit is a read only bit, which is set when the receiver is Idle (i.e., the UxRSR register is empty). No interrupt logic is tied to this bit, so the user has to poll this bit in order to determine if the UxRSR is Idle. The URXDA bit (UxSTA<0>) indicates whether the receive buffer has data or whether the buffer is empty. This bit is set as long as there is at least one character to be read from the receive buffer. URXDA is a read only bit. Figure 19-5 shows a block diagram of the UART receiver. dsPIC30F Family Reference Manual DS70066C-page 19-16 © 2004 Microchip Technology Inc. Figure 19-5: UART Receiver Block Diagram URX8 UxRXREG Low Byte Load RSR UxMODE Receive Buffer Control – Generate Flags – Generate Interrupt UxRXIF UxRX · START bit Detect Receive Shift Register 16 Divider Control Signals 16X Baud Clock from Baud Rate Generator UxSTA – Shift Data Characters to Buffer 9 (UxRSR) PERR FERR · Parity Check · Stop bit Detect · Shift Clock Generation · Wake Logic Internal Data Bus 16 1 0 LPBACK From UxTX 15 9 8 7 0 Word Read Only Word or Byte Read © 2004 Microchip Technology Inc. DS70066C-page 19-17 Section 19. UART UART 19 19.6.4 Setup for UART Reception Steps to follow when setting up a Reception: 1. Initialize the UxBRG register for the appropriate baud rate (Section 19.3 “UART Baud Rate Generator (BRG)”). 2. Set the number of data bits, number of Stop bits and parity selection by writing to the PDSEL<1:0> (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. 3. If interrupts are desired, then set the UxRXIE bit in the corresponding Interrupt Enable Control register (IEC). Specify the interrupt priority for the interrupt using the UxRXIP<2:0> control bits in the corresponding Interrupt Priority Control register (IPC). Also, select the Receive Interrupt mode by writing to the URXISEL<1:0> (UxSTA<7:6>) bits. 4. Enable the UART module by setting the UARTEN (UxMODE<15>) bit. 5. Receive interrupts will depend on the URXISEL<1:0> control bit settings. If receive interrupts are not enabled, the user can poll the URXDA bit. The UxRXIF bit should be cleared in the software routine that services the UART receive interrupt. 6. Read data from the receive buffer. If 9-bit transmission has been selected, read a word. Otherwise, read a byte. The URXDA status bit (UxSTA<0>) will be set whenever data is available in the buffer. Figure 19-6: UART Reception Figure 19-7: UART Reception with Receive Overrun Start bit bit0 bit1 bit7 bit0 Stop bit Start bit bit7 Stop bit UxRX RIDLE bit Character 1 to UxRXREG Character 2 to UxRXREG Note: This timing diagram shows 2 characters received on the UxRX input. UxRXIF (URXISEL = 0x) Start bit bit0 bit1 bit7/8 bit0 Stop bit7/8 bit Start bit Start bit7/8 Stop bit bit UxRX OERR bit RIDLE bit Character 1,2,3,4 stored in Receive Character 5 held in UxRSR Stop bit Character 1 Characters 2,3,4,5 Character 6 FIFO OERR Cleared by User Note: This diagram shows 6 characters received without the user reading the input buffer. The 5th character received is held in the receive shift register. An overrun error occurs at the start of the 6th character. dsPIC30F Family Reference Manual DS70066C-page 19-18 © 2004 Microchip Technology Inc. 19.7 Using the UART for 9-bit Communication A typical multi-processor communication protocol will differentiate between data bytes and address/control bytes. A common scheme is to use a 9th data bit to identify whether a data byte is address or data information. If the 9th bit is set, the data is processed as address or control information. If the 9th bit is cleared, the received data word is processed as data associated with the previous address/control byte. The protocol operates as follows: • The master device transmits a data word with the 9th bit set. The data word contains the address of a slave device. • All slave devices in the communication chain receive the address word and check the slave address value. • The slave device that was addressed will receive and process subsequent data bytes sent by the master device. All other slave devices will discard subsequent data bytes until a new address word (9th bit set) is received. 19.7.1 ADDEN Control Bit The UART receiver has an Address Detect mode which allows it to ignore data words with the 9th bit cleared. This reduces the interrupt overhead, since data words with the 9th bit cleared are not buffered. This feature is enabled by setting the ADDEN bit (UxSTA<5>). The UART must be configured for 9-bit data to use the Address Detect mode. The ADDEN bit has no effect when the receiver is configured in 8-bit Data mode. 19.7.2 Setup for 9-bit Transmit The setup procedure for 9-bit transmission is identical to the 8-bit Transmit modes, except that PDSEL<1:0> (UxMODE<2:1) should be set to ‘11’ (see Section 19.5.3 “Setup for UART Transmit”). Word writes should be performed to the UxTXREG register (starts transmission). © 2004 Microchip Technology Inc. DS70066C-page 19-19 Section 19. UART UART 19 19.7.3 Setup for 9-bit Reception Using Address Detect Mode The setup procedure for 9-bit reception is similar to the 8-bit Receive modes, except that PDSEL<1:0> (UxMODE<2:1) should be set to ‘11’ (see Section 19.6.4 “Setup for UART Reception”). The Receive Interrupt mode should be configured by writing to the URXISEL<1:0> (UxSTA<7:6>) bits. The procedure for using the Address Detect mode is as follows: 1. Set the ADDEN (UxSTA<5>) bit to enable address detect. Ensure that the URXISEL control bits are configured to generate an interrupt after each received word. 2. Check each 8-bit address by reading the UxRXREG register, to determine if the device is being addressed. 3. If this device has not been addressed, then discard the received word. 4. If this device has been addressed, clear the ADDEN bit to allow subsequent data bytes to be read into the receive buffer and interrupt the CPU. If a long data packet is expected, then the Receive Interrupt mode could be changed to buffer more than one data byte between interrupts. 5. When the last data byte has been received, set the ADDEN bit so that only address bytes will be received. Also, ensure that the URXISEL control bits are configured to generate an interrupt after each received word. Figure 19-8: Reception with Address Detect (ADDEN = 1) 19.8 Receiving Break Characters The receiver will count and expect a certain number of bit times based on the values programmed in the PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. If the break is longer than 13 bit times, the reception is considered complete after the number of bit times specified by PDSEL and STSEL. The URXDA bit is set, FERR is set, zeros are loaded into the receive FIFO, interrupts are generated if appropriate and the RIDLE bit is set. When the module receives a break signal and the receiver has detected the Start bit, the data bits and the invalid Stop bit (which sets the FERR), the receiver must wait for a valid Stop bit before looking for the next Start bit. It cannot assume that the break condition on the line is the next Start bit. Break is regarded as a character containing all ‘0’s with the FERR bit set. The break character is loaded into the buffer. No further reception can occur until a Stop bit is received. Note that RIDLE goes high when the Stop bit has been received. Note: If the Address Detect mode is enabled (ADDEN = 1), the URXISEL<1:0> control bits should be configured so that an interrupt will be generated after every received word. Each received data word must be checked in software for an address match immediately after reception. Start bit bit0 bit1 bit8 bit0 Stop bit Start bit bit8 Stop bit UxRX (pin) Read Rcv Buffer Reg UxRXREG UxRXIF (Interrupt Flag) Word 1 UxRXREG Bit 8 = 0, Data Byte Bit 8 = 1, Address Byte Transfer to Receive FIFO Note: This timing diagram shows a data byte followed by an address byte. The data byte is not read into the UxRXREG (receive buffer) because ADDEN = 1 and bit 8 = 0. dsPIC30F Family Reference Manual DS70066C-page 19-20 © 2004 Microchip Technology Inc. 19.9 Initialization Example 19-2 is an initialization routine for the Transmitter/Receiver in 8-bit mode. Example 19-3 shows an initialization of the Addressable UART in 9-bit Address Detect mode. In both examples, the value to load into the UxBRG register is dependent on the desired baud rate and the device frequency. Example 19-2: 8-bit Transmit/Receive (UART1) Example 19-3: 8-bit Transmit/Receive (UART1), Address Detect Enabled Note: The UTXEN bit should not be set until the UARTEN bit has been set. Otherwise, UART transmissions will not be enabled. MOV #baudrate,W0 ; Set Baudrate MOV W0,U1BRG BSET IPC2,#U1TXIP2 ; Set UART TX interrupt priority BCLR IPC2,#U1TXIP1 ; BCLR IPC2,#U1TXIP0 ; BSET IPC2,#U1RXIP2 ; Set UART RX interrupt priority BCLR IPC2,#U1RXIP1 ; BCLR IPC2,#U1RXIP0 ; CLR U1STA MOV #0x8800,W0 ; Enable UART for 8-bit data, ; no parity, 1 STOP bit, ; no wakeup MOV W0,U1MODE BSET U1STA,#UTXEN ; Enable transmit BSET IEC0,#U1TXIE ; Enable transmit interrupts BSET IEC0,#U1RXIE ; Enable receive interrupts MOV #baudrate,W0 ; Set Baudrate MOV W0,U1BRG BSET IPC2,#U1TXIP2 ; Set UART TX interrupt priority BCLR IPC2,#U1TXIP1 ; BCLR IPC2,#U1TXIP0 ; BSET IPC2,#U1RXIP2 ; Set UART RX interrupt priority BCLR IPC2,#U1RXIP1 ; BCLR IPC2,#U1RXIP0 ; BSET U1STA,#ADDEN ; Enable address detect MOV #0x8883,W0 ; UART1 enabled for 9-bit data, ; no parity, 1 STOP bit, ; wakeup enabled MOV W0,U1MODE BSET U1STA,#UTXEN ; Enable transmit BSET IEC0,#U1TXIE ; Enable transmit interrupts BSET IEC0,#U1RXIE ; Enable receive interrupts © 2004 Microchip Technology Inc. DS70066C-page 19-21 Section 19. UART UART 19 19.10 Other Features of the UART 19.10.1 UART in Loopback Mode Setting the LPBACK bit enables this special mode, in which the UxTX output is internally connected to the UxRX input. When configured for the Loopback mode, the UxRX pin is disconnected from the internal UART receive logic. However, the UxTX pin still functions normally. To select this mode: 1. Configure UART for the desired mode of operation. 2. Set LPBACK = 1 to enable Loopback mode. 3. Enable transmission as defined in Section 19.5 “UART Transmitter”. The Loopback mode is dependent on the UEN<1:0> bits, as shown in Table 19-2. Table 19-2: Loopback Mode Pin Function 19.10.2 Auto Baud Support To allow the system to determine baud rates of the received characters, the UxRX input can be internally connected to a selected input capture channel. When the ABAUD bit (UxMODE<5>) is set, the UxRX pin is internally connected to the input capture channel. The ICx pin is disconnected from the input capture channel. The input capture channel used for auto baud support is device specific. Please refer to the device data sheet for further details. This mode is only valid when the UART is enabled (UARTEN = 1) and the Loopback mode is disabled (LPBACK = 0). Also, the user must program the capture module to detect the falling and rising edges of the Start bit. 19.11 UART Operation During CPU Sleep and Idle Modes The UART does not function in Sleep mode. If entry into Sleep mode occurs while a transmission is in progress, then the transmission is aborted and the UxTX pin is driven to logic ‘1’. Similarly, if entry into Sleep mode occurs while a reception is in progress, then the reception is aborted. The UART can be used to optionally wake the dsPIC device from Sleep mode on the detection of a Start bit. If the WAKE bit (UxSTA<7>) is set, the device is in Sleep mode, and the UART receive interrupt is enabled (UxRXIE = 1), then a falling edge on the UxRX pin will generate a receive interrupt. The Receive Interrupt Select mode bit (URXISEL) has no effect for this function. The UARTEN bit must be set in order to generate a wake-up interrupt. The USIDL bit (UxMODE<13>) selects if the module will stop operation when the device enters Idle mode, or whether the module will continue normal operation in Idle mode. If USIDL = 0, the module will continue normal operation during Idle mode. If USIDL = 1, the module will stop in Idle mode. Any transmission or reception in progress will be aborted. UEN<1:0> Pin Function, LPBACK = 1 00 UxRX input connected to UxTX; UxTX pin functions; UxRX pin ignored; UxCTS/UxRTS unused 01 UxRX input connected to UxTX; UxTX pin functions; UxRX pin ignored; UxRTS pin functions, UxCTS unused 10 UxRX input connected to UxTX; UxTX pin functions; UxRX pin ignored; UxRTS pin functions, UxCTS input connected to UxRTS; UxCTS pin ignored 11 UxRX input connected to UxTX; UxTX pin functions; UxRX pin ignored; BCLK pin functions; UxCTS/UxRTS unused dsPIC30F Family Reference Manual DS70066C-page 19-22 © 2004 Microchip Technology Inc. 19.12 Registers Associated with UART Module Table 19-3: Registers Associated with UART1 SFR Name Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State U1MODE UARTEN — USIDL — reserved ALTIO reserved reserved WAKE LPBACK ABAUD — — PDSEL<1:0> STSEL 0000 0000 0000 0000 U1STA UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL<1:0> ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000 U1TXREG — — — — — — — UTX8 Transmit Register 0000 0000 0000 0000 U1RXREG — — — — — — — URX8 Receive Register 0000 0000 0000 0000 U1BRG Baud Rate Generator Prescaler 0000 0000 0000 0000 IFS0 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0 0000 0000 0000 0000 IEC0 CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IPC2 — ADIP<2:0> — U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100 Note: The registers associated with UART1 are shown for reference. See the device data sheet for the registers associated with other UART modules. © 2004 Microchip Technology Inc. DS70066C-page 19-23 Section 19. UART UART 19 19.13 Design Tips Question 1: The data I transmit with the UART does not get received correctly. What could cause this? Answer: The most common reason for reception errors is that an incorrect value has been calculated for the UART baud rate generator. Ensure the value written to the UxBRG register is correct. Question 2: I am getting framing errors even though the signal on the UART receive pin looks correct. What are the possible causes? Answer: Ensure the following control bits have been setup correctly: • UxBRG: UART Baud Rate register • PDSEL<1:0>: Parity and Data Size Selection bits • STSEL: Stop bit Selection dsPIC30F Family Reference Manual DS70066C-page 19-24 © 2004 Microchip Technology Inc. 19.14 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the UART module are: Title Application Note # Serial Port Utilities Implementing Table Read and Table Write AN547 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2004 Microchip Technology Inc. DS70066C-page 19-25 Section 19. UART UART 19 19.15 Revision History Revision A This is the initial released revision of this document. Revision B Revision B has been expanded to include a full description of the dsPIC30F UART module. Revision C This revision incorporates all known errata at the time of this document update. dsPIC30F Family Reference Manual DS70066C-page 19-26 © 2004 Microchip Technology Inc. NOTES: © 2004 Microchip Technology Inc. DS70067C-page 20-1 S erial P erip h eral Interface (SPI) 20 Section 20. Serial Peripheral Interface (SPI™) HIGHLIGHTS This section of the manual contains the following major topics: 20.1 Introduction .................................................................................................................. 20-2 20.2 Status and Control Registers .......................................................................................20-4 20.3 Modes of Operation ..................................................................................................... 20-7 20.4 SPI Master Mode Clock Frequency ........................................................................... 20-19 20.5 Operation in Power Save Modes ............................................................................... 20-20 20.6 Special Function Registers Associated with SPI Modules......................................... 20-22 20.7 Related Application Notes.......................................................................................... 20-23 20.8 Revision History ......................................................................................................... 20-24 dsPIC30F Family Reference Manual DS70067C-page 20-2 © 2004 Microchip Technology Inc. 20.1 Introduction The Serial Peripheral Interface (SPI) module is a synchronous serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be Serial EEPROMs, shift registers, display drivers, A/D converters, etc. The SPI module is compatible with Motorola's SPI and SIOP interfaces. Depending on the variant, the dsPIC30F family offers one or two SPI modules on a single device. SPI1 and SPI2 are functionally identical. The SPI2 module is available in many of the higher pin count packages (64-pin and higher), while the SPI1 module is available on all devices. The SPI serial port consists of the following Special Function Registers (SFR): • SPIxBUF: Address in SFR space that is used to buffer data to be transmitted and data that is received. This address is shared by the SPIxTXB and SPIxRXB registers. • SPIxCON: A control register that configures the module for various modes of operation. • SPIxSTAT: A status register that indicates various status conditions. In addition, there is a 16-bit shift register, SPIxSR, that is not memory mapped. It is used for shifting data in and out of the SPI port. The memory mapped SFR, SPIxBUF, is the SPI Data Receive/Transmit register. Internally, the SPIxBUF register actually comprises of two separate registers - SPIxTXB and SPIxRXB. The Receive Buffer register, SPIxRXB, and the Transmit Buffer register, SPIxTXB, are two unidirectional 16-bit registers. These registers share the SFR address named SPIxBUF. If a user writes data to be transmitted to the SPIxBUF address, internally the data gets written to the SPIxTXB register. Similarly, when the user reads the received data from SPIxBUF, internally the data is read from the SPIxRXB register. This double-buffering of transmit and receive operations allows continuous data transfers in the background. Transmission and reception occur simultaneously. The SPI serial interface consists of the following four pins: • SDIx: serial data input • SDOx: serial data output • SCKx: shift clock input or output • SSx: active low slave select or frame synchronization I/O pulse Note: In this section, the SPI modules are referred together as SPIx or separately as SPI1 and SPI2. Special Function registers will follow a similar notation. For example, SPIxCON refers to the control register for the SPI1 or SPI2 module. Note: The user cannot write to the SPIxTXB register or read from the SPIxRXB register directly. All reads and writes are performed on the SPIxBUF register. Note: The SPI module can be configured to operate using 3 or 4 pins. In the 3-pin mode, the SSx pin is not used. © 2004 Microchip Technology Inc. DS70067C-page 20-3 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 Figure 20-1: SPI Module Block Diagram Internal Data Bus SDIx SDOx SSx SCKx SPIxSR bit0 Shift Control Edge Select FCY Primary 1, 4, 16, 64 Enable Master Clock Prescaler Secondary Prescaler 1:1 → 1:8 Slave Select Sync Control Clock Control Transmit SPIxRXB Receive and Frame Note: The SPIxTXB and SPIxRXB registers are memory mapped to the SPIxBUF register. Registers share address SPIxBUF SPIxTXB SPIxBUF dsPIC30F Family Reference Manual DS70067C-page 20-4 © 2004 Microchip Technology Inc. 20.2 Status and Control Registers Register 20-2: SPIxSTAT: SPI Status and Control Register Upper Byte: R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 SPIEN — SPISIDL — — — — — bit 15 bit 8 Lower Byte: U-0 R/W-0 HS U-0 U-0 U-0 U-0 R-0 R-0 — SPIROV — — — — SPITBF SPIRBF bit 7 bit 0 bit 15 SPIEN: SPI Enable bit 1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins 0 = Disables module bit 14 Unimplemented: Read as ‘0’ bit 13 SPISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as ‘0’ bit 6 SPIROV: Receive Overflow Flag bit 1 = A new byte/word is completely received and discarded. The user software has not read the previous data in the SPIxBUF register. 0 = No overflow has occurred bit 5-2 Unimplemented: Read as ‘0’ bit 1 SPITBF: SPI Transmit Buffer Full Status bit 1 = Transmit not yet started, SPIxTXB is full 0 = Transmit started, SPIxTXB is empty Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB. Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR. bit 0 SPIRBF: SPI Receive Buffer Full Status bit 1 = Receive complete, SPIxRXB is full 0 = Receive is not complete, SPIxRXB is empty Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB. Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ HC = Cleared by Hardware HS = Set by Hardware -n = Value at Reset ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70067C-page 20-5 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 Register 20-2: SPIXCON: SPIx Control Register Upper Byte: U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SSEN CKP MSTEN SPRE<2:0> PPRE<1:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14 FRMEN: Framed SPI Support bit 1 = Framed SPI support enabled 0 = Framed SPI support disabled bit 13 SPIFSD: Frame Sync Pulse Direction Control on SSx pin bit 1 = Frame sync pulse input (slave) 0 = Frame sync pulse output (master) bit 12 Unimplemented: Read as ‘0’ bit 11 DISSDO: Disable SDOx pin bit 1 = SDOx pin is not used by module. Pin is controlled by associated port register. 0 = SDOx pin is controlled by the module bit 10 MODE16: Word/Byte Communication Select bit 1 = Communication is word-wide (16 bits) 0 = Communication is byte-wide (8 bits) bit 9 SMP: SPI Data Input Sample Phase bit Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time Slave mode: SMP must be cleared when SPI is used in Slave mode. bit 8 CKE: SPI Clock Edge Select bit 1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6) 0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6) Note: The CKE bit is not used in the Framed SPI modes. The user should program this bit to ‘0’ for the Framed SPI modes (FRMEN = 1). bit 7 SSEN: Slave Select Enable (Slave mode) bit 1 = SS pin used for Slave mode 0 = SS pin not used by module. Pin controlled by port function. bit 6 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level; active state is a low level 0 = Idle state for clock is a low level; active state is a high level bit 5 MSTEN: Master Mode Enable bit 1 = Master mode 0 = Slave mode dsPIC30F Family Reference Manual DS70067C-page 20-6 © 2004 Microchip Technology Inc. Register 20-2: SPIXCON: SPIx Control Register (Continued) bit 4-2 SPRE<2:0>: Secondary Prescale (Master Mode) bits (Supported settings: 1:1, 2:1 through 8:1, all inclusive) 111 = Secondary prescale 1:1 110 = Secondary prescale 2:1 ... 000 = Secondary prescale 8:1 bit 1-0 PPRE<1:0>: Primary Prescale (Master Mode) bits 11 = Primary prescale 1:1 10 = Primary prescale 4:1 01 = Primary prescale 16:1 00 = Primary prescale 64:1 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70067C-page 20-7 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 20.3 Modes of Operation The SPI module has flexible Operating modes which are discussed in the following subsections: • 8-bit and 16-bit Data Transmission/Reception • Master and Slave Modes • Framed SPI Modes 20.3.1 8-bit vs. 16-bit Operation A control bit, MODE16 (SPIxCON<10>), allows the module to communicate in either 8-bit or 16-bit modes. The functionality will be the same for each mode except the number of bits that are received and transmitted. Additionally, the following should be noted in this context: • The module is reset when the value of the MODE16 (SPIxCON<10>) bit is changed. Consequently, the bit should not be changed during normal operation. • Data is transmitted out of bit 7 of the SPIxSR for 8-bit operation while it is transmitted and out of bit 15 of the SPIxSR for 16-bit operation. In both modes, data is shifted into bit ‘0’ of the SPIxSR. • 8 clock pulses at the SCKx pin are required to shift in/out data in 8-bit mode, while 16 clock pulses are required in the 16-bit mode. 20.3.2 Master and Slave Modes Figure 20-2: SPI Master/Slave Connection Serial Receive Buffer (SPIxRXB) Shift Register (SPIxSR) MSbit LSbit SDIx SDOx PROCESSOR 2 [SPI Slave] SCKx SSx Serial Transmit Buffer (SPIxTXB) Serial Receive Buffer (SPIxRXB) Shift Register (SPIxSR) MSbit LSbit SDOx SDIx PROCESSOR 1 [SPI Master] Serial Clock . (SSEN(SPIxCON<7>) = 1 and MSTEN(SPIxCON<5> = 0)) Note 1: Using the SSx pin in Slave mode of operation is optional. 2: User must write transmit data to/read received data from SPIxBUF. The SPIxTXB and SPIxRXB registers are memory mapped to SPIxBUF. SSx SCKx Serial Transmit Buffer (SPIxTXB) (MSTEN(SPIxCON<5> = 1)) SPI Buffer (SPIxBUF) SPI Buffer (SPIxBUF) dsPIC30F Family Reference Manual DS70067C-page 20-8 © 2004 Microchip Technology Inc. 20.3.2.1 Master Mode The following steps should be taken to set up the SPI module for the Master mode of operation: 1. If using interrupts: • Clear the SPIxIF bit in the respective IFSn register. • Set the SPIxIE bit in the respective IECn register. • Write the SPIxIP bits in the respective IPCn register. 2. Write the desired settings to the SPIxCON register with MSTEN (SPIxCON<5>) = 1. 3. Clear the SPIROV bit (SPIxSTAT<6>). 4. Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). 5. Write the data to be transmitted to the SPIxBUF register. Transmission (and Reception) will start as soon as data is written to the SPIxBUF register. In Master mode, the system clock is prescaled and then used as the serial clock. The prescaling is based on the settings in the PPRE<1:0> (SPIxCON<1:0>) and SPRE<1:0> (SPIxCON<4:2>) bits. The serial clock is output via the SCKx pin to slave devices. Clock pulses are only generated when there is data to be transmitted. For further information, refer to Section 20.4 “SPI Master Mode Clock Frequency”. The CKP and CKE bits determine on which edge of the clock, data transmission occurs. Both data to be transmitted and data that is received are respectively written into or read from the SPIxBUF register. The following describes the SPI module operation in Master mode: 1. Once the module is set up for Master mode of operation and enabled, data to be transmitted is written to the SPIxBUF register. The SPITBF (SPIxSTAT<1>) bit is set. 2. The contents of SPIxTXB are moved to the shift register, SPIxSR, and the SPITBF bit is cleared by the module. 3. A series of 8/16 clock pulses shifts out 8/16 bits of transmit data from the SPIxSR to the SDOx pin and simultaneously shifts in the data at the SDIx pin into the SPIxSR. 4. When the transfer is complete, the following events will occur: • The interrupt flag bit, SPIxIF, is set. SPI interrupts can be enabled by setting the interrupt enable bit SPIxIE. The SPIxIF flag is not cleared automatically by the hardware. • Also, when the ongoing transmit and receive operation is completed, the contents of the SPIxSR are moved to the SPIxRXB register. • The SPIRBF (SPIxSTAT<0>) bit is set by the module, indicating that the receive buffer is full. Once the SPIxBUF register is read by the user code, the hardware clears the SPIRBF bit. 5. If the SPIRBF bit is set (receive buffer is full) when the SPI module needs to transfer data from SPIxSR to SPIxRXB, the module will set the SPIROV (SPIxSTAT<6>) bit, indicating an overflow condition. 6. Data to be transmitted can be written to SPIxBUF by the user software at any time as long as the SPITBF (SPIxSTAT<1>) bit is clear. The write can occur while SPIxSR is shifting out the previously written data, allowing continuous transmission. Note: The SPIxSR register cannot be written into directly by the user. All writes to the SPIxSR register are performed through the SPIxBUF register. © 2004 Microchip Technology Inc. DS70067C-page 20-9 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 Figure 20-3: SPI Master Mode Operation SCKx (CKP = 0 SCKx (CKP = 1 SCKx (CKP = 0 SCKx (CKP = 1 4 Clock modes Input Sample Input Sample SDIx bit7 bit0 SDOx bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 bit7 bit0 SDIx SPIxIF (SMP = 1) (SMP = 0) (SMP = 1) CKE = 1) CKE = 0) CKE = 0) CKE = 0) (SMP = 0) User writes to SPIxBUF SDOx bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 (CKE = 0) (CKE = 1) 1 instruction cycle latency to set SPIxIF flag bit Note 1: Four SPI Clock modes shown to demonstrate CKP (SPIxCON<6>) and CKE (SPIxCON<8>) bit functionality only. Only one of the four modes can be chosen for operation. 2: SDI and input sample shown for two different values of the SMP (SPIxCON<9>) bit, for demonstration purposes only. Only one of the two configurations of the SMP bit can be chosen during operation. 3: If there are no pending transmissions, SPIxTXB is transferred to SPIxSR as soon as the user writes to SPIxBUF. 4: Operation for 8-bit mode shown. The 16-bit mode is similar. SPIxSR moved into SPIxRXB User reads SPIxBUF (clock output at the SCKx pin in Master mode) (SPIxSTAT<0>) SPITBF SPIxTXB to SPIxSR User writes new data during transmission SPIRBF Two modes available for SMP control bit (see Note 4) dsPIC30F Family Reference Manual DS70067C-page 20-10 © 2004 Microchip Technology Inc. 20.3.2.2 Slave Mode The following steps should be taken to set up the SPI module for the Slave mode of operation: 1. Clear the SPIxBUF register. 2. If using interrupts: • Clear the SPIxIF bit in the respective IFSn register. • Set the SPIxIE bit in the respective IECn register. • Write the SPIxIP bits in the respective IPCn register. 3. Write the desired settings to the SPIxCON register with MSTEN (SPIxCON<5>) = 0. 4. Clear the SMP bit. 5. If the CKE bit is set, then the SSEN bit must be set, thus enabling the SSx pin. 6. Clear the SPIROV bit (SPIxSTAT<6>) and, 7. Enable SPI operation by setting the SPIEN bit (SPIxSTAT<15>). In Slave mode, data is transmitted and received as the external clock pulses appear on the SCKx pin. The CKP (SPIxCON<6>) and CKE (SPIxCON<8>) bits determine on which edge of the clock data transmission occurs. Both data to be transmitted and data that is received are respectively written into or read from the SPIxBUF register. The rest of the operation of the module is identical to that in the Master mode. A few additional features provided in the Slave mode are: Slave Select Synchronization: The SSx pin allows a Synchronous Slave mode. If the SSEN (SPIxCON<7>) bit is set, transmission and reception is enabled in Slave mode only if the SSx pin is driven to a low state. The port output or other peripheral outputs must not be driven in order to allow the SSx pin to function as an input. If the SSEN bit is set and the SSx pin is driven high, the SDOx pin is no longer driven and will tri-state even if the module is in the middle of a transmission. An aborted transmission will be retried the next time the SSx pin is driven low using the data held in the SPIxTXB register. If the SSEN bit is not set, the SSx pin does not affect the module operation in Slave mode. SPITBF Status Flag Operation: The function of the SPITBF (SPIxSTAT<1>) bit is different in the Slave mode of operation. The following describes the function of the SPITBF for various settings of the Slave mode of operation: 1. If SSEN (SPIxCON<7>) is cleared, the SPITBF is set when the SPIxBUF is loaded by the user code. It is cleared when the module transfers SPIxTXB to SPIxSR. This is similar to the SPITBF bit function in Master mode. 2. If SSEN (SPIxCON<7>) is set, the SPITBF is set when the SPIxBUF is loaded by the user code. However, it is cleared only when the SPIx module completes data transmission. A transmission will be aborted when the SSx pin goes high and may be retried at a later time. Each data word is held in SPIxTXB until all bits are transmitted to the receiver. Note: To meet module timing requirements, the SSx pin must be enabled in Slave mode when CKE = 1. (Refer to Figure 20-6 for details.) © 2004 Microchip Technology Inc. DS70067C-page 20-11 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 Figure 20-4: SPI Slave Mode Operation: Slave Select Pin Disabled SCKx Input (CKP = 1 SCKx Input (CKP = 0 Input Sample SDIx Input bit7 bit0 SDOx bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 SPIxIF (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) User writes to SPIxBUF SPISR to SPIxRXB SPITBF SPIRBF Output Note 1: Two SPI Clock modes shown only to demonstrate CKP (SPIxCON<6>) and CKE (SPIxCON<8>) bit functionality. Any combination of CKP and CKE bits can be chosen for module operation. 2: If there are no pending transmissions or a transmission in progress, SPIxBUF is transferred to SPIxSR as soon as the user writes to SPIxBUF. 3: Operation for 8-bit mode shown. The 16-bit mode is similar. 1 instruction cycle latency to set SPIxIF flag bit dsPIC30F Family Reference Manual DS70067C-page 20-12 © 2004 Microchip Technology Inc. Figure 20-5: SPI Slave Mode Operation with Slave Select Pin Enabled SCKx (CKP = 1 SCKx (CKP = 0 Input Sample SDIx bit7 bit0 SDOx bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 SPIxIF (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) User writes SPIxBUF SPIxSR to SPIxBUF SSx Note 1: When the SSEN (SPIxCON<7>) bit is set to ‘1’, the SSx pin must be driven low so as to enable transmission and reception in Slave mode. 2: Transmit data is held in SPIxTXB and SPITBF remains set until all bits are transmitted. 3: Operation for 8-bit mode shown. The 16-bit mode is similar. User reads SPIxBUF SPIRBF 1 instruction cycle latency SPITBF SPIxBUF to SPIxSR to © 2004 Microchip Technology Inc. DS70067C-page 20-13 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 Figure 20-6: SPI Mode Timing (Slave Mode w/CKE = 1) SCK Input (CKP = 1 SCK Input (CKP = 0 Input Sample SDI Input bit7 bit0 SDO bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 SPIxIF (SMP = 0) CKE = 1) CKE = 1) (SMP = 0) Write to SPIxBUF SPISR to SPIRXB SSx (see Note 1) SPITBF SPIxRBF Output Note 1: The SSx pin must be used for Slave mode operation when CKE = 1. 2: When the SSEN (SPIxCON<7>) bit is set to ‘1’, the SSx pin must be driven low so as to enable transmission and reception in Slave mode. 3: Transmit data is held in SPIxTXB and SPITBF remains set until all bits are transmitted. 4: Operation for 8-bit mode shown. The 16-bit mode is similar. dsPIC30F Family Reference Manual DS70067C-page 20-14 © 2004 Microchip Technology Inc. 20.3.3 SPI Error Handling When a new data word has been shifted into SPIxSR and the previous contents of SPIxRXB have not been read by the user software, the SPIROV bit (SPIxSTAT<6>) will be set. The module will not transfer the received data from SPIxSR to SPIxRXB. Further data reception is disabled until the SPIROV bit is cleared. The SPIROV bit is not cleared automatically by the module and must be cleared by the user software. 20.3.4 SPI Receive Only Operation Setting the control bit, DISSDO (SPIxCON<11>), disables transmission at the SDOx pin. This allows the SPIx module to be configured for a Receive Only mode of operation. The SDOx pin will be controlled by the respective port function if the DISSDO bit is set. The DISSDO function is applicable to all SPI Operating modes. 20.3.5 Framed SPI Modes The module supports a very basic framed SPI protocol while operating in either Master or Slave modes. The following features are provided in the SPI module to support Framed SPI modes: • The control bit, FRMEN (SPIxCON<14>), enables Framed SPI modes and causes the SSx pin to be used as a frame synchronization pulse input or output pin. The state of the SSEN (SPIxCON<7>) is ignored. • The control bit, SPIFSD (SPIxCON<13>), determines whether the SSx pin is an input or an output (i.e., whether the module receives or generates the frame synchronization pulse). • The frame synchronization pulse is an active high pulse for a single SPI clock cycle. The following two framed SPI modes are supported by the SPI module: • Frame Master Mode: The SPI module generates the frame synchronization pulse and provides this pulse to other devices at the SSx pin. • Frame Slave Mode: The SPI module uses a frame synchronization pulse received at the SSx pin. The Framed SPI modes are supported in conjunction with the Master and Slave modes. Thus, the following four framed SPI configurations are available to the user: • SPI Master Mode and Frame Master Mode • SPI Master Mode and Frame Slave Mode • SPI Slave Mode and Frame Master Mode • SPI Slave Mode and Frame Slave Mode These four modes determine whether or not the SPIx module generates the serial clock and the frame synchronization pulse. © 2004 Microchip Technology Inc. DS70067C-page 20-15 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 Figure 20-7: SPI Master, Frame Master Connection Diagram 20.3.5.1 SCKx in Framed SPI Modes When FRMEN (SPIxCON<14>) = 1 and MSTEN (SPIxCON<5>) = 1, the SCKx pin becomes an output and the SPI clock at SCKx becomes a free running clock. When FRMEN = 1 and MSTEN = 0, the SCKx pin becomes an input. The source clock provided to the SCKx pin is assumed to be a free running clock. The polarity of the clock is selected by the CKP (SPIxCON<6>) bit. The CKE (SPIxCON<8>) bit is not used for the Framed SPI modes and should be programmed to ‘0’ by the user software. When CKP = 0, the frame sync pulse output and the SDOx data output change on the rising edge of the clock pulses at the SCKx pin. Input data is sampled at the SDIx input pin on the falling edge of the serial clock. When CKP = 1, the frame sync pulse output and the SDOx data output change on the falling edge of the clock pulses at the SCKx pin. Input data is sampled at the SDIx input pin on the rising edge of the serial clock. Serial Receive Buffer (SPIxRXB) Shift Register (SPIxSR) MSbit LSbit SDOx SDIx dsPIC30F [SPI Master, Frame Master] Serial Receive Buffer (SPIxRXB) Shift Register (SPIxSR) MSbit LSbit SDIx SDOx PROCESSOR 2 Serial Clock Note 1: In Framed SPI modes, the SSx pin is used to transmit/receive the frame synchronization pulse. 2: Framed SPI modes require the use of all four pins (i.e., using the SSx pin is not optional). 3: The SPIxTXB and SPIxRXB registers are memory mapped to the SPIxBUF register. SCKx SSx SSx SCKx Serial Transmit Buffer (SPIxTXB) Serial Transmit Buffer (SPIxTXB) Frame Sync. Pulse SPI Buffer (SPIxBUF) SPI Buffer (SPIxBUF) dsPIC30F Family Reference Manual DS70067C-page 20-16 © 2004 Microchip Technology Inc. 20.3.5.2 SPIx Buffers in Framed SPI Modes When SPIFSD (SPIxCON<13>) = 0, the SPIx module is in the Frame Master mode of operation. In this mode, the frame sync pulse is initiated by the module when the user software writes the transmit data to SPIxBUF location (thus writing the SPIxTXB register with transmit data). At the end of the frame sync pulse, the SPIxTXB is transferred to the SPIxSR and data transmission/reception begins. When SPIFSD (SPIxCON<13>) = 1, the module is in Frame Slave mode. In this mode, the frame sync pulse is generated by an external source. When the module samples the frame sync pulse, it will transfer the contents of the SPIxTXB register to the SPIxSR and data transmission/ reception begins. The user must make sure that the correct data is loaded into the SPIxBUF for transmission before the frame sync pulse is received. 20.3.5.3 SPI Master Mode and Frame Master Mode This Framed SPI mode is enabled by setting the MSTEN (SPIxCON<5>) and FRMEN (SPIxCON<14>) bits to ‘1’ and the SPIFSD (SPIxCON<13>) bit to ‘0’. In this mode, the serial clock will be output continuously at the SCKx pin, regardless of whether the module is transmitting. When the SPIxBUF is written, the SSx pin will be driven high on the next transmit edge of the SCKx clock. The SSx pin will be high for one SCKx clock cycle. The module will start transmitting data on the next transmit edge of the SCKx, as shown in Figure 20-8. A connection diagram indicating signal directions for this Operating mode is shown in Figure 20-7. Figure 20-8: SPI Master, Frame Master Note: Receiving a frame sync pulse will start a transmission, regardless of whether data was written to SPIxBUF. If no write was performed, the old contents of SPIxTXB will be transmitted. SCKx SSx SDOx (CKP = 0) Bit 15 Bit 14 Bit 13 Bit 12 SDIx Bit 15 Bit 14 Bit 13 Bit 12 Write to SPIxBUF Receive Samples at SDIx Pulse generated at SSx SCKx (CKP = 1) © 2004 Microchip Technology Inc. DS70067C-page 20-17 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 20.3.5.4 SPI Master Mode and Frame Slave Mode This Framed SPI mode is enabled by setting the MSTEN, FRMEN and the SPIFSD bits to ‘1’. The SSx pin is an input, and it is sampled on the sample edge of the SPI clock. When it is sampled high, data will be transmitted on the subsequent transmit edge of the SPI clock, as shown in Figure 20-9. The interrupt flag, SPIxIF, is set when the transmission is complete. The user must make sure that the correct data is loaded into the SPIxBUF for transmission before the signal is received at the SSx pin. A connection diagram indicating signal directions for this Operating mode is shown in Figure 20-10. Figure 20-9: SPI Master, Frame Slave Figure 20-10: SPI Master, Frame Slave Connection Diagram SCK FSYNC SDO (CKP = 0) Bit 15 Bit 14 Bit 13 Bit 12 SDI Sample SSx pin for frame sync. pulse Receive Samples at SDIx Bit 15 Bit 14 Bit 13 Bit 12 Write to SPIxBUF SCKx (CKP = 1) SDOx SDIx dsPIC30F Serial Clock Note 1: In Framed SPI modes, the SSx pin is used to transmit/receive the frame synchronization pulse. 2: Framed SPI modes require the use of all four pins (i.e., Using the SSx pin is not optional). SSx SCKx Frame Sync. Pulse SDIx SDOx PROCESSOR 2 SSx SCKx [SPI Master, Frame Slave] dsPIC30F Family Reference Manual DS70067C-page 20-18 © 2004 Microchip Technology Inc. 20.3.5.5 SPI Slave Mode and Frame Master Mode This framed SPI mode is enabled by setting the MSTEN (SPIxCON<5>) bit to ‘0’, the FRMEN (SPIxCON<14>) bit to ‘1’ and the SPIFSD (SPIxCON<13>) bit to ‘0’. The input SPI clock will be continuous in Slave mode. The SSx pin will be an output when the SPIFSD bit is low. Therefore, when the SPIBUF is written, the module will drive the SSx pin high on the next transmit edge of the SPI clock. The SSx pin will be driven high for one SPI clock cycle. Data will start transmitting on the next SPI clock transmit edge. A connection diagram indicating signal directions for this Operating mode is shown in Figure 20-11. Figure 20-11: SPI Slave, Frame Master Connection Diagram 20.3.5.6 SPI Slave Mode and Frame Slave Mode This Framed SPI mode is enabled by setting the MSTEN (SPIxCON<5>) bit to ‘0’, the FRMEN bit (SPIxCON<14>) to ‘1’ and the SPIFSD (SPIxCON<13>) bit to ‘1’. Therefore, both the SCKx and SSx pins will be inputs. The SSx pin will be sampled on the sample edge of the SPI clock. When SSx is sampled high, data will be transmitted on the next transmit edge of SCKx. A connection diagram indicating signal directions for this Operating mode is shown in Figure 20-12. Figure 20-12: SPI Slave, Frame Slave Connection Diagram SDOx SDIx dsPIC30F Serial Clock Note 1: In Framed SPI modes, the SSx pin is used to transmit/receive the frame synchronization pulse. 2: Framed SPI modes require the use of all four pins (i.e., Using the SSx pin is not optional). SSx SCKx Frame Sync. Pulse SDIx SDOx PROCESSOR 2 SSx SCKx [SPI Slave, Frame Slave] SDOx SDIx dsPIC30F Serial Clock Note 1: In Framed SPI modes, the SSx pin is used to transmit/receive the frame synchronization pulse. 2: Framed SPI modes require the use of all four pins (i.e., Using the SSx pin is not optional). SSx SCKx Frame Sync. Pulse SDIx SDOx PROCESSOR 2 SSx SCKx [SPI Master, Frame Slave] © 2004 Microchip Technology Inc. DS70067C-page 20-19 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 20.4 SPI Master Mode Clock Frequency In the Master mode, the clock provided to the SPI module is the instruction cycle (TCY). This clock will then be prescaled by the primary prescaler (specified by PPRE<1:0> (SPIxCON<1:0>)), and the secondary prescaler (specified by SPRE<2:0> (SPIxCON<4:2>)). The prescaled instruction clock becomes the serial clock and is provided to external devices via the SCKx pin. Equation 20-1 can be used to calculate the SCKx clock frequency as a function of the primary and secondary prescaler settings. Equation 20-1: Some sample SPI clock frequencies (in kHz) are shown in the table below: Table 20-1: Sample SCKx Frequencies Note: Note that the SCKx signal clock is not free running for normal SPI modes. It will only run for 8 or 16 pulses when the SPIxBUF is loaded with data. It will however, be continuous for Framed modes. Primary Prescaler * Secondary Prescaler FCY FSCK = FCY = 30 MHz Secondary Prescaler Settings 1:1 2:1 4:1 6:1 8:1 Primary Prescaler Settings 1:1 30000 15000 7500 5000 3750 4:1 7500 3750 1875 1250 938 16:1 1875 938 469 313 234 64:1 469 234 117 78 59 FCY = 5 MHz Primary Prescaler Settings 1:1 5000 2500 1250 833 625 4:1 1250 625 313 208 156 16:1 313 156 78 52 39 64:1 78 39 20 13 10 Note: SCKx frequencies shown in kHz. Note: Not all clock rates are supported. For further information, refer to the SPI timing specifications in the specific device data sheet. dsPIC30F Family Reference Manual DS70067C-page 20-20 © 2004 Microchip Technology Inc. 20.5 Operation in Power Save Modes The dsPIC30FXXXX family of devices has three Power modes: • Operational mode: The core and peripherals are running. • Power Save modes: These are invoked by the execution of the PWRSAV instruction. There are two Power Save modes supported in the dsPIC30F family of devices. These are specified in the PWRSAV instruction via a parameter. The two modes are: - Sleep mode: Device clock source and entire device is shut down. This is achieved by the following instruction. ;include device p30fxxxx.inc file PWRSAV #SLEEP_MODE - Idle mode: Device clock is operational, CPU and selected peripherals are shut down. ;include device p30fxxxx.inc file PWRSAV #IDLE_MODE 20.5.1 Sleep Mode When the device enters Sleep mode, the system clock is disabled. 20.5.1.1 Master Mode Operation The following are a consequence of entering Sleep mode when the SPIx module is configured for master operation: • The baud rate generator in the SPIx module stops and is reset. • If the SPIx module enters Sleep mode in the middle of a transmission/reception, then the transmission/reception is aborted. Since there is no automatic way to prevent an entry into Sleep mode if a transmission or reception is pending, the user software must synchronize entry into Sleep with SPI module operation to avoid aborted transmissions. • The transmitter and receiver will stop in Sleep. The transmitter or receiver does not continue with a partially completed transmission at wake-up. 20.5.1.2 Slave Mode Operation Since the clock pulses at SCKx are externally provided for Slave mode, the module will continue to function in Sleep mode. It will complete any transactions during the transition into Sleep. On completion of a transaction, the SPIRBF flag is set. Consequently, the SPIxIF bit will be set. If SPI interrupts are enabled (SPIxIE = 1), the device will wake from Sleep. If the SPI interrupt priority level is greater than the present CPU priority level, code execution will resume at the SPIx interrupt vector location. Otherwise, code execution will continue with the instruction following the PWRSAV instruction that previously invoked Sleep mode. The module is not reset on entering Sleep mode if it is operating as a slave device. Register contents are not affected when the SPIx module is going into or coming out of Sleep mode. 20.5.2 Idle Mode When the device enters Idle mode, the system clock sources remain functional. The SPISIDL bit (SPIxSTAT<13>) selects whether the module will stop or continue functioning on Idle. • If SPISIDL = 1, the SPI module will stop communication on entering Idle mode. It will operate in the same manner as it does in Sleep mode. • If SPISID = 0 (default selection), the module will continue operation in Idle mode. © 2004 Microchip Technology Inc. DS70067C-page 20-21 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 Table 20-2: Pins Associated with the SPI Modules Pin Name Pin Type Buffer Type Description SCK1 I/O CMOS SPI1 module Clock Input or Output SCK2 I/O CMOS SPI2 module Clock Input or Output SDI1 I CMOS SPI1 module Data Receive pin SDI2 I CMOS SPI2 module Data Receive pin SDO1 O CMOS SPI1 module Data Transmit pin SDO2 O CMOS SPI2 module Data Transmit pin SS1 I/O CMOS SPI1 module Slave Select Control pin 1) Used to enable transmit/receive in Slave mode, if SSEN (SPI1CON<7>) has been set to ‘1’ 2) Used as Frame Sync I/O Pulse when FRMEN and SPIFSD (SPI1CON<14:13>) are set to ‘11’ or ‘10’. SS2 I/O CMOS SPI2 module Slave Select Control pin 1) Used to enable transmit/receive in Slave mode, if SSEN (SPI2CON<7>) has been set to ‘1’ 2) Used as Frame Sync I/O Pulse when FRMEN and SPIFSD (SPI2CON<14:13>) are set to ‘11’ or ‘10’. Legend: CMOS = CMOS compatible input or output, ST = Schmitt Trigger input with CMOS levels, I = Input, O = Output dsPIC30F Family Reference Manual DS70067C-page 20-22 © 2004 Microchip Technology Inc. 20.6 Special Function Registers Associated with SPI Modules Table 20-3: SPI1 Register Map Table 20-4: SPI2 Register Map Table 20-5: SPI Module Related Interrupt Registers SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State SPI1STAT 0220 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000 SPI1CON 0222 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000 SPI1BUF 0224 Transmit and Receive Buffer Address shared by SPI1TXB and SPI1RXB registers 0000 0000 0000 0000 SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State SPI2STAT 0226 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000 SPI2CON 0228 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000 SPI2BUF 022A Transmit and Receive Buffer Address shared by SPI2TXB and SPI2RXB registers 0000 0000 0000 0000 SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — SWTRAP OVRFLOW ADDRERR STKERR — 0000 0000 0000 0000 INTCON2 0082 ALTIVT DISI — — — — LEV8F — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000 IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0 0000 0000 0000 0000 IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000 IPC2 0098 — ADIP<2:0> — U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100 IPC6 00A0 — C1IP<2:0> — SPI2IP<2:0> — U2TXIP<2:0> — U2RXIP<2:0> 0100 0100 0100 0100 © 2004 Microchip Technology Inc. DS70067C-page 20-23 Section 20. Serial Peripheral Interface (SPI) S erial P erip h eral Interface (SPI) 20 20.7 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Serial Peripheral Interface (SPI) module are: Title Application Note # Interfacing Microchip’s MCP41XXX/MCP42XXX Digital Potentiometers to a PICmicro® Microcontroller AN746 Interfacing Microchip’s MCP3201 Analog-to-Digital Converter to the PICmicro® Microcontroller AN719 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70067C-page 20-24 © 2004 Microchip Technology Inc. 20.8 Revision History Revision A This is the initial released revision of this document. Revision B This revision reflects editorial and technical content changes for the dsPIC30F Serial Peripheral Interface (SPI) module. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. © 2005 Microchip Technology Inc. DS70068D-page 21-1 Inter-Inte grate d Circuit (I 2C) 21 Section 21. Inter-Integrated Circuit™ (I2 C™) HIGHLIGHTS This section of the manual contains the following major topics: 21.1 Overview...................................................................................................................... 21-2 21.2 I2C Bus Characteristics................................................................................................ 21-4 21.3 Control and Status Registers .......................................................................................21-7 21.4 Enabling I2C Operation.............................................................................................. 21-13 21.5 Communicating as a Master in a Single Master Environment ................................... 21-15 21.6 Communicating as a Master in a Multi-Master Environment ..................................... 21-29 21.7 Communicating as a Slave ........................................................................................ 21-32 21.8 Connection Considerations for I2C Bus ..................................................................... 21-47 21.9 Module Operation During PWRSAV Instruction......................................................... 21-49 21.10 Effects of a Reset....................................................................................................... 21-49 21.11 Design Tips ................................................................................................................ 21-50 21.12 Related Application Notes.......................................................................................... 21-51 21.13 Revision History ......................................................................................................... 21-52 dsPIC30F Family Reference Manual DS70068D-page 21-2 © 2005 Microchip Technology Inc. 21.1 Overview The Inter-Integrated Circuit (I2C) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, display drivers, A/D converters, etc. The I2C module can operate in any of the following I2C systems: • Where the dsPIC30F acts as a Slave Device • Where the dsPIC30F acts as a Master Device in a Single Master System (Slave may also be active) • Where the dsPIC30F acts as a Master/Slave Device in a Multi-Master System (Bus collision detection and arbitration available) The I2C module contains independent I2C master logic and I2C slave logic, each generating interrupts based on their events. In multi-master systems, the software is simply partitioned into master controller and slave controller. When the I2C master logic is active, the slave logic remains active also, detecting the state of the bus and potentially receiving messages from itself in a single master system or from other masters in a multi-master system. No messages are lost during multi-master bus arbitration. In a multi-master system, bus collision conflicts with other masters in the system are detected and the module provides a method to terminate then restart the message. The I2C module contains a baud rate generator. The I2C baud rate generator does not consume other timer resources in the device. 21.1.1 Module Features • Independent Master and Slave logic • Multi-Master support. No messages lost in arbitration. • Detects 7-bit and 10-bit device addresses • Detects general call addresses as defined in the I2C protocol • Bus Repeater mode. Accept all messages as a slave regardless of the address. • Automatic SCL clock stretching provides delays for the processor to respond to a slave data request. • Supports 100 kHz and 400 kHz bus specifications. Figure 21-1 shows the I2C module block diagram. © 2005 Microchip Technology Inc. DS70068D-page 21-3 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 Figure 21-1: I2C™ Block Diagram I2CRSR I2CRCV Internal Data Bus SCL SDA Shift Match Detect I2CADD Start and Stop bit Detect Clock Address_Match Clock Stretching I2CTRN Shift LSB Clock Write Read BRG Down Counter I2CBRG Reload Control TCY/2 Start and Stop bit Generate Write Read Acknowledge Generation Collision Detect Write Read Write Read I2CCON Write I2CSTAT Read Control Logic Read LSB dsPIC30F Family Reference Manual DS70068D-page 21-4 © 2005 Microchip Technology Inc. 21.2 I2C Bus Characteristics The I2C bus is a two-wire serial interface. Figure 21-2 is a schematic of a typical I2C connection between the dsPIC30F device and a 24LC256 I2C serial EEPROM. The I2C interface employs a comprehensive protocol to ensure reliable transmission and reception of data. When communicating, one device is the “master” which initiates transfer on the bus and generates the clock signals to permit that transfer, while the other device(s) acts as the “slave” responding to the transfer. The clock line, “SCL”, is output from the master and input to the slave, although occasionally the slave drives the SCL line. The data line, “SDA”, may be output and input from both the master and slave. Because the SDA and SCL lines are bidirectional, the output stages of the devices driving the SDA and SCL lines must have an open drain in order to perform the wired-AND function of the bus. External pull-up resistors are used to ensure a high level when no device is pulling the line down. In the I2C interface protocol, each device has an address. When a master wishes to initiate a data transfer, it first transmits the address of the device that it wishes to “talk” to. All devices “listen” to see if this is their address. Within this address, bit ‘0’ specifies if the master wishes to read from or write to the slave device. The master and slave are always in opposite modes (transmitter/receiver) of operation during a data transfer. That is, they can be thought of as operating in either of these two relations: • Master-transmitter and Slave-receiver • Slave-transmitter and Master-receiver In both cases, the master originates the SCL clock signal. Figure 21-2: Typical I2C™ Interconnection Block Diagram MCLR VDD VSS OSC2 OSC1 SCL SDA dsPIC30F 4.7 μF XTAL 0.1 μF VDD VSS SDA SCL VDD A0 A1 A2 WP VDD VDD VDD 5 kΩ 24LC256 © 2005 Microchip Technology Inc. DS70068D-page 21-5 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.2.1 Bus Protocol The following I2C bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the SCL clock line is HIGH. Changes in the data line while the SCL clock line is HIGH will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 21-3). 21.2.1.1 Start Data Transfer (S) After a bus Idle state, a HIGH-to-LOW transition of the SDA line while the clock (SCL) is HIGH determines a Start condition. All data transfers must be preceded by a Start condition. 21.2.1.2 Stop Data Transfer (P) A LOW-to-HIGH transition of the SDA line while the clock (SCL) is HIGH determines a Stop condition. All data transfers must end with a Stop condition. 21.2.1.3 Repeated Start (R) After a WAIT state, a HIGH-to-LOW transition of the SDA line while the clock (SCL) is HIGH determines a Repeated Start condition. Repeated Starts allow a master to change bus direction without relinquishing control of the bus. 21.2.1.4 Data Valid (D) The state of the SDA line represents valid data when, after a Start condition, the SDA line is stable for the duration of the HIGH period of the clock signal. There is one bit of data per SCL clock. 21.2.1.5 Acknowledge (A) or Not-Acknowledge (N) All data byte transmissions must be Acknowledged (ACK) or Not Acknowledged (NACK) by the receiver. The receiver will pull the SDA line low for an ACK or release the SDA line for a NACK. The Acknowledge is a one-bit period, using one SCL clock. 21.2.1.6 WAIT/Data Invalid (Q) The data on the line must be changed during the LOW period of the clock signal. Devices may also stretch the clock low time, by asserting a low on SCL line, causing a WAIT on the bus. 21.2.1.7 Bus Idle (I) Both data and clock lines remain HIGH at those times after a Stop condition and before a Start condition. Figure 21-3: I2C™ Bus Protocol States Address Valid Data Allowed to Change Stop Condition Start Condition SCL SDA (I) (S) (D) (A) or (N) (P) (I) Data or (Q) ACK/NACK Valid NACK ACK dsPIC30F Family Reference Manual DS70068D-page 21-6 © 2005 Microchip Technology Inc. 21.2.2 Message Protocol A typical I2C message is shown in Figure 21-4. In this example, the message will read a specified byte from a 24LC256 I2C serial EEPROM. The dsPIC30F device will act as the master and the 24LC256 device will act as the slave. Figure 21-4 indicates the data as driven by the master device and the data as driven by the slave device, remembering that the combined SDA line is a wired-AND of the master and slave data. The master device controls and sequences the protocol. The slave device will only drive the bus at specifically determined times. Figure 21-4: A Typical I2C™ Message: Read of Serial EEPROM (Random Address Mode) 21.2.2.1 Start Message Each message is initiated with a “Start” condition and terminated with a “Stop” condition. The number of the data bytes transferred between the Start and Stop conditions is determined by the master device. As defined by the system protocol, the bytes of the message may have special meaning such as “device address byte” or “data byte”. 21.2.2.2 Address Slave In the figure, the first byte is the device address byte that must be the first part of any I2C message. It contains a device address and a R/W bit. Refer to “Section 26. Appendix” for additional information on Address Byte formats. Note that R/W = 0 for this first address byte, indicating that the master will be a transmitter and the slave will be a receiver. 21.2.2.3 Slave Acknowledge The receiving device is obliged to generate an Acknowledge signal, “ACK”, after the reception of each byte. The master device must generate an extra SCL clock, which is associated with this Acknowledge bit. 21.2.2.4 Master Transmit The next 2 bytes, sent by the master to the slave, are data bytes containing the location of the requested EEPROM data byte. The slave must Acknowledge each of the data bytes. 21.2.2.5 Repeated Start At this point, the slave EEPROM has the address information necessary to return the requested data byte to the master. However, the R/W bit from the first device address byte specified master transmission and slave reception. The bus must be turned in the other direction for the slave to send data to the master. To do this function without ending the message, the master sends a “Repeated Start”. The Repeated Start is followed with a device address byte containing the same device address as before and with the R/W = 1 to indicate slave transmission and master reception. X Bus Master SDA A C K N A C A C K A C K A C K S T O P S T A R T Address Byte EE ADDR High Byte EE ADDR Low Byte Address Byte Data Byte S T A R T S 1010 AAA 0 210 R 1010 AAA 1 210 P K Slave SDA Activity N A A A A E R R / W R / W Output Output I D L E I D L E © 2005 Microchip Technology Inc. DS70068D-page 21-7 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.2.2.6 Slave Reply Now the slave transmits the data byte driving the SDA line, while the master continues to originate clocks but releases its SDA drive. 21.2.2.7 Master Acknowledge During reads, a master must terminate data requests to the slave by NOT Acknowledging (generate a “NACK”) on the last byte of the message. 21.2.2.8 Stop Message The master sends Stop to terminate the message and return the bus to an Idle state. 21.3 Control and Status Registers The I2C module has six user-accessible registers for I2C operation. The registers are accessible in either Byte or Word mode. The registers are shown in Figure 21-5 and listed below: • Control Register (I2CCON): This register allows control of the I2C operation. • Status Register (I2CSTAT): This register contains status flags indicating the module state during I2C operation. • Receive Buffer Register (I2CRCV): This is the buffer register from which data bytes can be read. The I2CRCV register is a read only register. • Transmit Register (I2CTRN): This is the transmit register; bytes are written to this register during a transmit operation. The I2CTRN register is a read/write register. • Address Register (I2CADD): The I2CADD register holds the slave device address. • Baud Rate Generator Reload Register (I2CBRG): Holds the baud rate generator reload value for the I2C module baud rate generator. Figure 21-5: I2C™ Programmer’s Model Bit 7 Bit 0 I2CRCV (8 bits) Bit 7 Bit 0 I2CTRN (8 bits) Bit 8 Bit 0 I2CBRG (9 bits) Bit 15 Bit 0 I2CCON (16 bits) Bit 15 Bit 0 I2CSTAT (16 bits) Bit 9 Bit 0 I2CADD (10 bits) dsPIC30F Family Reference Manual DS70068D-page 21-8 © 2005 Microchip Technology Inc. Register 21-1 and Register 21-2 define the I2C module Control and Status registers, I2CCON and I2CSTAT. The I2CTRN is the register to which transmit data is written. This register is used when the module operates as a master transmitting data to the slave or as a slave sending reply data to the master. As the message progresses, the I2CTRN register shifts out the individual bits. Because of this, the I2CTRN may not be written to unless the bus is Idle. The I2CTRN may be reloaded while the current data is transmitting. Data being received by either the master or the slave is shifted into a non-accessible Shift register called I2CRSR. When a complete byte is received, the byte transfers to the I2CRCV register. In receive operations, the I2CRSR and I2CRCV create a double-buffered receiver. This allows reception of the next byte to begin before reading the current byte of received data. If the module receives another complete byte before the software reads the previous byte from the I2CRCV register, a receiver overflow occurs and sets the I2COV (I2CCON<6>). The byte in the I2CRSR is lost. The I2CADD register holds the slave device address. In 10-bit mode, all bits are relevant. In 7-bit addressing mode, only I2CADD<6:0> are relevant. The A10M (I2CCON<10>) specifies the expected mode of the slave address. © 2005 Microchip Technology Inc. DS70068D-page 21-9 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 Register 21-1: I2CCON: I2C™ Control Register Upper Byte: R/W-0 U-0 R/W-0 R/W-1 HC R/W-0 R/W-0 R/W-0 R/W-0 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 bit 15 I2CEN: I2C Enable bit 1 = Enables the I2C module and configures the SDA and SCL pins as serial port pins 0 = Disables I2C module. All I2C pins are controlled by port functions. bit 14 Unimplemented: Read as ‘0’ bit 13 I2CSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters an Idle mode 0 = Continue module operation in Idle mode bit 12 SCLREL: SCL Release Control bit (when operating as I2C Slave) 1 = Release SCL clock 0 = Hold SCL clock low (clock stretch) If STREN = 1: Bit is R/W (i.e., software may write ‘0’ to initiate stretch and write ‘1’ to release clock) Hardware clear at beginning of slave transmission. Hardware clear at end of slave reception. If STREN = 0: Bit is R/S (i.e., software may only write ‘1’ to release clock) Hardware clear at beginning of slave transmission. bit 11 IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit 1 = Enable IPMI Support mode. All addresses Acknowledged. 0 = IPMI mode not enabled bit 10 A10M: 10-bit Slave Address bit 1 = I2CADD is a 10-bit slave address 0 = I2CADD is a 7-bit slave address bit 9 DISSLW: Disable Slew Rate Control bit 1 = Slew rate control disabled 0 = Slew rate control enabled bit 8 SMEN: SMBus Input Levels bit 1 = Enable I/O pin thresholds compliant with SMBus specification 0 = Disable SMBus input thresholds bit 7 GCEN: General Call Enable bit (when operating as I2C slave) 1 = Enable interrupt when a general call address is received in the I2CRSR (module is enabled for reception) 0 = General call address disabled bit 6 STREN: SCL Clock Stretch Enable bit (when operating as I2C slave) Used in conjunction with SCLREL bit. 1 = Enable software or receive clock stretching 0 = Disable software or receive clock stretching bit 5 ACKDT: Acknowledge Data bit (When operating as I2C Master. Applicable during master receive.) Value that will be transmitted when the software initiates an Acknowledge sequence. 1 = Send NACK during acknowledge 0 = Send ACK during acknowledge dsPIC30F Family Reference Manual DS70068D-page 21-10 © 2005 Microchip Technology Inc. Register 21-1: I2CCON: I2C™ Control Register (Continued) bit 4 ACKEN: Acknowledge Sequence Enable bit (When operating as I2C master. Applicable during master receive.) 1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit Hardware clear at end of master Acknowledge sequence. 0 = Acknowledge sequence not in progress bit 3 RCEN: Receive Enable bit (when operating as I2C master) 1 = Enables Receive mode for I2C Hardware clear at end eighth bit of master receive data byte. 0 = Receive sequence not in progress bit 2 PEN: Stop Condition Enable bit (when operating as I2C master) 1 = Initiate Stop condition on SDA and SCL pins Hardware clear at end of master Stop sequence. 0 = Stop condition not in progress bit 1 RSEN: Repeated Start Condition Enabled bit (when operating as I2C master) 1 = Initiate Repeated Start condition on SDA and SCL pins Hardware clear at end of master Repeated Start sequence. 0 = Repeated Start condition not in progress bit 0 SEN: Start Condition Enabled bit (when operating as I2C master) 1 = Initiate Start condition on SDA and SCL pins Hardware clear at end of master Start sequence. 0 = Start condition not in progress Legend: R = Readable C = Clearable bit U = Unimplemented bit, read as ‘0’ W = Writable HS = Set by Hardware S = Settable bit HC = Cleared by Hardware ‘0’ = Bit cleared at POR x = Bit is unknown at POR ‘1’ = Bit is set at POR © 2005 Microchip Technology Inc. DS70068D-page 21-11 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 Register 21-2: I2CSTAT: I2C™ Status Register Upper Byte: R-0 HS, HC R-0 HS, HC U-0 U-0 U-0 R/C-0 HS R-0 HS, HC R-0 HS, HC ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 bit 15 bit 8 Lower Byte: R/C-0 HS R/W-0 HS R-0 HS, HC R/C-0 HS, HC R/C-0 HS, HC R-0 HS, HC R-0 HS, HC R-0 HS, HC IWCOL I2COV D_A P S R_W RBF TBF bit 7 bit 0 bit 15 ACKSTAT: Acknowledge Status bit (When operating as I2C master. Applicable to master transmit operation.) 1 = NACK received from slave 0 = ACK received from slave Hardware set or clear at end of slave Acknowledge. bit 14 TRSTAT: Transmit Status bit (When operating as I2C master. Applicable to master transmit operation.) 1 = Master transmit is in progress (8 bits + ACK) 0 = Master transmit is not in progress Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge. bit 13-11 Unimplemented: Read as ‘0’ bit 10 BCL: Master Bus Collision Detect bit 1 = A bus collision has been detected during a master operation 0 = No collision Hardware set at detection of bus collision. bit 9 GCSTAT: General Call Status bit 1 = General call address was received 0 = General call address was not received Hardware set when address matches general call address. Hardware clear at Stop detection. bit 8 ADD10: 10-bit Address Status bit 1 = 10-bit address was matched 0 = 10-bit address was not matched Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection. bit 7 IWCOL: Write Collision Detect bit 1 = An attempt to write the I2CTRN register failed because the I2C module is busy 0 = No collision Hardware set at occurrence of write to I2CTRN while busy (cleared by software). bit 6 I2COV: Receive Overflow Flag bit 1 = A byte was received while the I2CRCV register is still holding the previous byte 0 = No overflow Hardware set at attempt to transfer I2CRSR to I2CRCV (cleared by software). bit 5 D_A: Data/Address bit (when operating as I2C slave) 1 = Indicates that the last byte received was data 0 = Indicates that the last byte received was device address Hardware clear at device address match. Hardware set by write to I2CTRN or by reception of slave byte. dsPIC30F Family Reference Manual DS70068D-page 21-12 © 2005 Microchip Technology Inc. Register 21-2: I2CSTAT: I2C™ Status Register (Continued) bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 3 S: Start bit 1 = Indicates that a Start (or Repeated Start) bit has been detected last 0 = Start bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 2 R_W: Read/Write bit Information (when operating as I2C slave) 1 = Read - indicates data transfer is output from slave 0 = Write - indicates data transfer is input to slave Hardware set or clear after reception of I2C device address byte. bit 1 RBF: Receive Buffer Full Status bit 1 = Receive complete, I2CRCV is full 0 = Receive not complete, I2CRCV is empty Hardware set when I2CRCV written with received byte. Hardware clear when software reads I2CRCV. bit 0 TBF: Transmit Buffer Full Status bit 1 = Transmit in progress, I2CTRN is full 0 = Transmit complete, I2CTRN is empty Hardware set when software writes I2CTRN. Hardware clear at completion of data transmission. Legend: R = Readable W = Writable C = Clearable bit HC = Cleared by Hardware HS = Set by Hardware U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set at POR ‘0’ = Bit cleared at POR x = Bit is unknown at POR © 2005 Microchip Technology Inc. DS70068D-page 21-13 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.4 Enabling I2C Operation The module is enabled by setting the I2CEN (I2CCON<15>) bit. The I2C module fully implements all master and slave functions. When the module is enabled, the master and slave functions are active simultaneously and will respond according to the software or the bus events. When initially enabled, the module will release SDA and SCL pins, putting the bus into the Idle state. The master functions will remain in the Idle state unless software sets a control bit to initiate a master event. The slave functions will begin to monitor the bus. If the slave logic detects a Start event and a valid address on the bus, the slave logic will begin a slave transaction. 21.4.1 Enabling I2C I/O Two pins are used for bus operation. These are the SCL pin, which is the clock, and the SDA pin, which is the data. When the module is enabled, assuming no other module with higher priority has control, the module will assume control of the SDA and SCL pins. The module software need not be concerned with the state of the port I/O of the pins, the module overrides the port state and direction. At initialization, the pins are tri-state (released). 21.4.2 I2C Interrupts The I2C module generates two interrupts. One interrupt is assigned to master events and the other interrupt is assigned to slave events. These interrupts will set a corresponding interrupt flag bit and will interrupt the software process if the corresponding interrupt enable bit is set and the corresponding interrupt priority is high enough. The master interrupt is called MI2CIF and is activated on completion of a master message event. The following events generate the MI2CIF interrupt. • Start condition • Stop condition • Data transfer byte transmitted/received • Acknowledge transmit • Repeated Start • Detection of a bus collision event The slave interrupt is called SI2CIF and is activated on detection of a message directed to the slave. • Detection of a valid device address (including general call) • Request to transmit data • Reception of data dsPIC30F Family Reference Manual DS70068D-page 21-14 © 2005 Microchip Technology Inc. 21.4.3 Setting Baud Rate when Operating as a Bus Master When operating as an I2C master, the module must generate the system SCL clock. Generally, I 2C system clocks are specified to be either 100 kHz, 400 kHz or 1 MHz. The system clock rate is specified as the minimum SCL low time plus the minimum SCL high time. In most cases, that is defined by 2 TBRG intervals. The reload value for the baud rate generator is the I2CBRG register, as shown in Figure 21-6. When the baud rate generator is loaded with this value, the generator counts down to ‘0’ and stops until another reload has taken place. The generator count is decremented twice per instruction cycle (TCY). The baud rate generator is reloaded automatically on baud rate restart. For example, if clock synchronization is taking place, the baud rate generator will be reloaded when the SCL pin is sampled high. To compute the baud rate generator reload value, use the following equation. Equation 21-1: Table 21-1: I2C™ Clock Rates Figure 21-6: Baud Rate Generator Block Diagram Note: I2CBRG value of 0x0 is not supported. I2CBRG = FCY FCY FSCL 1,111,111 ( ) – – 1 Required System FSCL FCY I2CBRG Decimal I2CBRG HEX Actual FSCL 100 kHz 30 MHz 272 0x110 100 kHz 100 kHz 20 MHz 181 0x0B5 100 kHz 100 kHz 1 MHz 8 0x008 101 kHz 400 kHz 10 MHz 15 0x00F 400 kHz 400 kHz 5 MHz 7 0x007 400 kHz 400 kHz 1 MHz 1 0x001 345 kHz** 1 MHz* 11 MHz 1 0x001 1 MHz* 1 MHz 1 MHz 0 0x000 (invalid) 1 MHz *FCY = 11 MHz is the minimum input clock frequency to have FSCL = 1 MHz. ** This is closest value to 400 kHz for this value of FCY. CLK Down Counter 2 TCY I2CBRG<8:0> SCL Reload Control Reload © 2005 Microchip Technology Inc. DS70068D-page 21-15 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.5 Communicating as a Master in a Single Master Environment Typical operation of the I2C module in a system is using the I2C to communicate with an I2C peripheral, such as an I2C serial memory. In an I2C system, the master controls the sequence of all data communication on the bus. In this example, the dsPIC30F and its I2C module have the role of the single master in the system. As the single master, it is responsible for generating the SCL clock and controlling the message protocol. In the I2C module, the module controls individual portions of the I2C message protocol, however, sequencing of the components of the protocol to construct a complete message is a software task. For example, a typical operation in a single master environment may be to read a byte from an I 2C serial EEPROM. This example message is depicted in Figure 21-7. To accomplish this message, the software will sequence through the following steps. 1. Assert a Start condition on SDA and SCL. 2. Send the I2C device address byte to the slave with a write indication. 3. Wait for and verify an Acknowledge from the slave. 4. Send the serial memory address high byte to the slave. 5. Wait for and verify an Acknowledge from the slave. 6. Send the serial memory address low byte to the slave. 7. Wait for and verify an Acknowledge from the slave. 8. Assert a Repeated Start condition on SDA and SCL. 9. Send the device address byte to the slave with a read indication. 10. Wait for and verify an Acknowledge from the slave. 11. Enable master reception to receive serial memory data. 12. Generate an ACK or NACK condition at the end of a received byte of data. 13. Generate a Stop condition on SDA and SCL. Figure 21-7: A Typical I2C™ Message: Read Of Serial EEPROM (Random Address Mode) The I2C module supports Master mode communication with the inclusion of Start and Stop generators, data byte transmission, data byte reception, Acknowledge generator and a baud rate generator. Generally, the software will write to a control register to start a particular step, then wait for an interrupt or poll status to wait for completion. Subsequent sub-sections detail each of these operations Bus Master SDA A C K N A C A C K A C K A C K S T O P S T A R T Address Byte EE ADDR High Byte EE ADDR Low Byte Address Byte Data Byte S T A R T S 1010 AAA 0 210 R 1010 AAA 1 210 P K Slave SDA Activity N A A A A E R R / W R / W Output Output I D L E I D L E dsPIC30F Family Reference Manual DS70068D-page 21-16 © 2005 Microchip Technology Inc. 21.5.1 Generating Start Bus Event To initiate a Start event, the software sets the Start enable bit, SEN (I2CCON<0>). Prior to setting the Start bit, the software can check the P (I2CSTAT<4>) status bit to ensure that the bus is in an Idle state. Figure 21-8 shows the timing of the Start condition. • Slave logic detects the Start condition, sets the S bit (I2CSTAT<3>) and clears the P bit (I2CSTAT<4>). • SEN bit is automatically cleared at completion of the Start condition. • MI2CIF interrupt generated at completion of the Start condition. • After Start condition, SDA line and SCL line are left low (Q state). 21.5.1.1 IWCOL Status Flag If the software writes the I2CTRN when a Start sequence is in progress, then IWCOL is set and the contents of the transmit buffer are ignored. Figure 21-8: Master Start Timing Diagram Note: Because queueing of events is not allowed, writing to the lower 5 bits of I2CCON is disabled until the Start condition is complete. SCL (Master) SDA (Master) S SEN MI2CIF Interrupt TBRG 1 2 3 4 1 - Writing SEN = 1 initiates a master Start event. TBRG Baud generator starts. 2 - Baud generator times out. Master module drives SDA low. Baud generator restarts. 3 - Slave module detects Start, sets S = 1, P = 0. 4 - Baud generator times out. Master module drives SCL low, generates interrupt and clears SEN. I 2C™ Bus State (I) (S) (Q) P © 2005 Microchip Technology Inc. DS70068D-page 21-17 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.5.2 Sending Data to a Slave Device Transmission of a data byte, a 7-bit device address byte or the second byte of a 10-bit address, is accomplished by simply writing the appropriate value to the I2CTRN register. Loading this register will start the following process: • The software loads the I2CTRN with the data byte to transmit. • Writing I2CTRN sets the buffer full flag bit, TBF (I2CSTAT<0>). • The data byte is shifted out the SDA pin until all 8 bits are transmitted. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL. • On the ninth SCL clock, the module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit (I2CCON<15>). • The module generates the MI2CIF interrupt at the end of the ninth SCL clock cycle. Note that the module does not generate or validate the data bytes. The contents and usage of the byte is dependant on the state of the message protocol maintained by the software. 21.5.2.1 Sending a 7-bit Address to the Slave Sending a 7-bit device address involves sending 1 byte to the slave. A 7-bit address byte must contain the 7 bits of I2C device address and a R/W bit that defines if the message will be a write to the slave (master transmission and slave receiver) or a read from the slave (slave transmission and master receiver). 21.5.2.2 Sending a 10-bit Address to the Slave Sending a 10-bit device address involves sending 2 bytes to the slave. The first byte contains 5 bits of I2C device address reserved for 10-bit Addressing modes and 2 bits of the 10-bit address. Because the next byte, which contains the remaining 8 bits of the 10-bit address must be received by the slave, the R/W bit in the first byte must be ‘0’, indicating master transmission and slave reception. If the message data is also directed toward the slave, the master can continue sending the data. However, if the master expects a reply from the slave, a Repeated Start sequence with the R/W bit at ‘1’ will change the R/W state of the message to a read of the slave. 21.5.2.3 Receiving Acknowledge from the Slave On the falling edge of the eighth SCL clock, the TBF bit is cleared and the master will de-assert the SDA pin allowing the slave to respond with an Acknowledge. The master will then generate a ninth SCL clock. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurs, or if data was received properly. A slave sends an Acknowledge when it has recognized its device address (including a general call), or when the slave has properly received its data. The status of ACK is written into the Acknowledge status bit, ACKSTAT (I2CSTAT<15>), on the falling edge of the ninth SCL clock. After the ninth SCL clock, the module generates the MI2CIF interrupt and enters an Idle state until the next data byte is loaded into I2CTRN. 21.5.2.4 ACKSTAT Status Flag The ACKSTAT bit (I2CCON<15>) is cleared when the slave has sent an Acknowledge (ACK = 0), and is set when the slave does not Acknowledge (ACK = 1). dsPIC30F Family Reference Manual DS70068D-page 21-18 © 2005 Microchip Technology Inc. 21.5.2.5 TBF Status Flag When transmitting, the TBF bit (I2CSTAT<0>) is set when the CPU writes to I2CTRN and is cleared when all 8 bits are shifted out. 21.5.2.6 IWCOL Status Flag If the software writes the I2CTRN when a transmit is already in progress (i.e., the module is still shifting out a data byte), then IWCOL is set and the contents of the buffer are ignored. IWCOL must be cleared in software. Figure 21-9: Master Transmission Timing Diagram Note: Because queueing of events is not allowed, writing to the lower 5 bits of I2CCON is disabled until the transmit condition is complete. D7 D6 D5 D4 D3 D2 D1 D0 SCL (Master) SCL (Slave) SDA (Master) SDA (Slave) TBF I2CTRN MI2CIF Interrupt TBRG TBRG 1 2 3 4 5 6 7 8 1 - Writing the I2CTRN register will start a master transmission event. TBF bit is set. 2 - Baud generator starts. The MSB of the I2CTRN drives SDA. SCL remains low. TRSTAT bit is set. 3 - Baud generator times out. SCL released. Baud generator restarts. 4 - Baud generator times out. SCL driven low. After SCL detected low, next bit of I2CTRN drives SDA. 5 - While SCL is low, the slave can also pull SCL low to initiate a WAIT (clock stretch). 6 - Master has already released SCL, and slave can release to end WAIT. Baud generator restarts. 7 - At falling edge of 8th SCL clock, master releases SDA. TBF bit is cleared. Slave drives ACK/NACK. 8 - At falling edge of 9th SCL clock, master generates interrupt. SCL remains low until next event. Slave releases SDA. TRSTAT bit is clear. I 2C™ Bus State (Q) (D) (Q) (D) (Q) (A) (Q) TRSTAT ACKSTAT © 2005 Microchip Technology Inc. DS70068D-page 21-19 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.5.3 Receiving Data from a Slave Device Setting the receive enable bit, RCEN (I2CCON<3>), enables the master to receive data from a slave device. The master logic begins to generate clocks and before each falling edge of the SCL, SDA line is sampled and data is shifted into the I2CRSR. After the falling edge of the eighth SCL clock: • The RCEN bit is automatically cleared. • The contents of the I2CRSR transfer into the I2CRCV. • The RBF flag bit is set. • The module generates the MI2CIF interrupt. When the CPU reads the buffer, the RBF flag bit is automatically cleared. The software can process the data and then do an Acknowledge sequence. 21.5.3.1 RBF Status Flag When receiving data, the RBF bit is set when an device address or data byte is loaded into I2CRCV from I2CRSR. It is cleared when software reads the I2CRCV register. 21.5.3.2 I2COV Status Flag If another byte is received in the I2CRSR while the RBF bit remains set and the previous byte remains in the I2CRCV register, the I2COV bit is set and the data in the I2CRSR is lost. Leaving I2COV set does not inhibit further reception. If RBF is cleared by reading the I2CRCV, and the I2CRSR receives another byte, that byte will be transferred to the I2CRCV. 21.5.3.3 IWCOL Status Flag If the software writes the I2CTRN when a receive is already in progress (i.e., I2CRSR is still shifting in a data byte), then the IWCOL bit is set and the contents of the buffer are ignored. Note: The lower 5 bits of I2CCON must be ‘0’ before attempting to set the RCEN bit. This ensures the master logic is inactive. Note: Since queueing of events is not allowed, writing to the lower 5 bits of I2CCON is disabled until the data reception condition is complete. dsPIC30F Family Reference Manual DS70068D-page 21-20 © 2005 Microchip Technology Inc. Figure 21-10: Master Reception Timing Diagram D7 D6 D5 D4 D3 D2 D1 D0 SCL (Master) SCL (Slave) SDA (Slave) SDA (Master) RBF I2C™ Bus State MI2CIF Interrupt TBRG 2 3 4 5 6 2 - Writing the RCEN bit will start a master reception event. The baud generator starts. SCL remains low. 3 - Baud generator times out. Master attempts to release SCL. 4 - When slave releases SCL, baud generator restarts. 5 - Baud generator times out. MSB of response shifted to I2CRSR. SCL driven low for next baud interval. 6 - At falling edge of 8th SCL clock, I2CRSR transferred to I2CRCV. Module clears RCEN bit. TBRG RCEN (Q) (D) (Q) (Q) (Q) (D) I2CRCV RBF bit is set. Master generates interrupt. (Q) 1 1 - Typically, the slave can pull SCL low (clock stretch) to request a wait to prepare data response. The slave will drive MSB of data response on SDA when ready. © 2005 Microchip Technology Inc. DS70068D-page 21-21 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.5.4 Acknowledge Generation Setting the Acknowledge sequence enable bit, ACKEN (I2CCON<4>), enables generation of a master Acknowledge sequence. Figure 21-11 shows an ACK sequence and Figure 21-12 shows a NACK sequence. The Acknowledge data bit, ACKDT (I2CCON<5>), specifies ACK or NACK. After two baud periods: • The ACKEN bit is automatically cleared. • The module generates the MI2CIF interrupt. 21.5.4.1 IWCOL Status Flag If the software writes the I2CTRN when an Acknowledge sequence is in progress, then IWCOL is set and the contents of the buffer are ignored. Figure 21-11: Master Acknowledge (ACK) Timing Diagram Figure 21-12: Master Not Acknowledge (NACK) Timing Diagram Note: The lower 5 bits of I2CCON must be ‘0’ (master logic inactive) before attempting to set the ACKEN bit. Note: Because queueing of events is not allowed, writing to the lower 5 bits of I2CCON is disabled until the Acknowledge condition is complete. SCL (Master) SDA (Master) ACKEN MI2CIF Interrupt TBRG 1 2 3 Writing ACKEN = 1 initiates a master Acknowledge event. 1 TBRG - Writing ACKDT = 0 specifies sending an ACK. 2 - When SCL detected low, module drives SDA low. 3 - Baud generator times out. Module releases SCL. 4 - Baud generator times out. I 2C™ Bus State (Q) (A) (Q) 4 Baud generator restarts. Baud generator starts. SCL remains low. Module drives SCL low then releases SDA. Module clears ACKEN. Master generates interrupt. (Q) ACKDT = 0 SCL (Master) SDA (Master) ACKEN MI2CIF Interrupt TBRG 1 2 3 Writing ACKEN = 1 initiates a master Acknowledge event. 1 TBRG - Writing ACKDT = 1 specifies sending an NACK. 2 - When SCL detected low, module releases SDA. 3 - Baud generator times out. Module releases SCL. 4 - Baud generator times out. I 2C™ Bus State (A) (Q) (I) 4 Baud generator restarts. Baud generator starts. Module drives SCL low then releases SDA. Module clears ACKEN. Master generates interrupt. ACKDT = 1 dsPIC30F Family Reference Manual DS70068D-page 21-22 © 2005 Microchip Technology Inc. 21.5.5 Generating Stop Bus Event Setting the Stop sequence enable bit, PEN (I2CCON<2>), enables generation of a master Stop sequence. When the PEN bit is set, the master generates the Stop sequence as shown in Figure 21-13. • The slave detects the Stop condition, sets the P bit (I2CSTAT<4>) and clears the S bit (I2CSTAT<3>). • The PEN bit is automatically cleared. • The module generates the MI2CIF interrupt. 21.5.5.1 IWCOL Status Flag If the software writes the I2CTRN when a Stop sequence is in progress, then the IWCOL bit is set and the contents of the buffer are ignored. Figure 21-13: Master Stop Timing Diagram Note: The lower 5 bits of I2CCON must be ‘0’ (master logic inactive) before attempting to set the PEN bit. Note: Because queueing of events is not allowed, writing to the lower 5 bits of I2CCON is disabled until the Stop condition is complete. SCL (Master) SDA (Master) S PEN MI2CIF Interrupt TBRG 1 2 3 5 1 - Writing PEN = 1 initiates a master Stop event. TBRG Baud generator starts. Module drives SDA low. 2 - Baud generator times out. Module releases SCL. Baud generator restarts. 3 - Baud generator times out. Module releases SDA. 4 - Slave logic detects Stop. Module sets P = 1, S = 0. I 2C™ Bus State (P) (I) P TBRG (Q) 4 Baud generator restarts. 5 - The baud generator times out. Module clears PEN. Master generates interrupt. (Q) © 2005 Microchip Technology Inc. DS70068D-page 21-23 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.5.6 Generating Repeated Start Bus Event Setting the Repeated Start sequence enable bit, RSEN (I2CCON<1>), enables generation of a master Repeated Start sequence (see Figure 21-14). To generate a Repeated Start condition, software sets the RSEN bit (I2CCON<1>). The module asserts the SCL pin low. When the module samples the SCL pin low, the module releases the SDA pin for one baud rate generator count (TBRG). When the baud rate generator times out, if the module samples SDA high, the module de-asserts the SCL pin. When the module samples SCL pin high, the baud rate generator reloads and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin low for one TBRG while SCL is high. The following is the Repeated Start sequence: • The slave detects the Start condition, sets the S bit (I2CSTAT<3>) and clears the P bit (I2CSTAT<4>). • The RSEN bit is automatically cleared. • The module generates the MI2CIF interrupt. 21.5.6.1 IWCOL Status Flag If the software writes the I2CTRN when a Repeated Start sequence is in progress, then IWCOL is set and the contents of the buffer are ignored. Figure 21-14: Master Repeated Start Timing Diagram Note: The lower 5 bits of I2CCON must be ‘0’ (master logic inactive) before attempting to set the RSEN bit. Note: Because queueing of events is not allowed, writing of the lower 5 bits of I2CCON is disabled until the Repeated Start condition is complete. SCL (Master) SDA (Master) S RSEN MI2CIF Interrupt TBRG 1 2 3 5 1 - Writing RSEN = 1 initiates a master Repeated Start event. TBRG Baud generator starts. Module drives SCL low and 2 - Baud generator times out. Module releases SCL. Baud generator restarts. 3 - Baud generator times out. Module drives SDA low. 4 - Slave logic detects Start. Module sets S = 1, P = 0. I 2C™ Bus State (S) (Q) P TBRG (Q) 4 Baud generator restarts. 5 - The baud generator times out. Module drives SCL low. Module clears RSEN. Master generates interrupt. (Q) releases SDA. dsPIC30F Family Reference Manual DS70068D-page 21-24 © 2005 Microchip Technology Inc. 21.5.7 Building Complete Master Messages As described at the beginning of Section 21.5, the software is responsible for constructing messages with the correct message protocol. The module controls individual portions of the I2C message protocol, however, sequencing of the components of the protocol to construct a complete message is a software task. The software can use polling or interrupt methods while using the module. The examples shown use interrupts. The software can use the SEN, RSEN, PEN, RCEN and ACKEN bits (Least Significant 5 bits of the I2CCON register) and the TRSTAT bit as a “state” flag when progressing through a message. For example, Table 21-2 shows some example state numbers associated with bus states. Table 21-2: Master Message Protocol States The software will begin a message by issuing a Start command. The software will record the state number corresponding to Start. As each event completes and generates an interrupt, the interrupt handler may check the state number. So, for a Start state, the interrupt handler will confirm execution of the Start sequence and then start a master transmission event to send the I2C device address, changing the state number to correspond to master transmission. On the next interrupt, the interrupt handler will again check the state, determining that a master transmission just completed. The interrupt handler will confirm successful transmission of the data, then move on to the next event, depending on the contents of the message. In this manner, on each interrupt, the interrupt handler will progress through the message protocol until the complete message is sent. Figure 21-15 provides a more detailed examination of the same message sequence of Figure 21-7. Figure 21-16 shows some simple examples of messages using 7-bit addressing format. Figure 21-17 shows an example of a 10-bit address format message sending data to a slave. Figure 21-18 shows an example of a 10-bit address format message receiving data from a slave. Example State Number I2CCON<4:0> TRSTAT (I2CSTAT<14>) State 0 00000 0 Bus Idle or WAIT 1 00001 n/a Sending Start Event 2 00000 1 Master Transmitting 3 00010 n/a Sending Repeated Start Event 4 00100 n/a Sending Stop Event 5 01000 n/a Master Reception 6 10000 n/a Master Acknowledgement Note: Example state numbers for reference only. User software may assign as desired. © 2005 Microchip Technology Inc. DS70068D-page 21-25 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 Figure 21-15: Master Message (Typical I2C™ Message: Read of Serial EEPROM) T 1 - Setting the SEN bit starts a Start event. ACKEN ACKDT SEN SCL SDA SCL SDA I2CTRN TBF I2CRCV RBF MI2CIF ACKSTAT 1 2 3 4 5 6 7 8 A1A0 9 A PEN RCEN 1 2 3 4 5 6 7 8 A11 A10 A9 A8 1 2 3 4 5 6 7 8 9 W 1 1 RSEN 1 2 3 4 5 6 7 8 9 1 3 2 9 A 1 2 3 4 5 6 7 8 D3D2D1D0 D7D6D5D4 9 N A A 4 5 7 8 9 2 - Writing the I2CTRN register starts a master transmission. The data is the serial 3 - Writing the I2CTRN register starts a master transmission. The data is the first 4 - 5 - Writing the I2CTRN register starts a master transmission. The data is a resend of 6 - Setting the RCEN bit starts a master reception. On interrupt, the software reads 7 9 - Setting the ACKEN bit starts an Acknowledge event. ACKDT = 1 to send NACK. - Setting the PEN bit starts a master Stop event. EE device address byte, with R/W clear indicating a write. byte of the EE data address. the serial EE device address byte, but with R/W bit set indicating a read. the I2CRCV register, which clears the RBF flag. 0 0 A2 A7A6A5A4 A2A1A0 A1A0 R 1 1 0 0 A2 0 0 0 0 6 - Writing the I2CTRN register starts a master transmission. The data is the second byte of the EE data address. 8 - Setting the RSEN bit starts a Repeated Start event. (Master) (Master) (Slave) (Slave) A3 MI2CIF cleared by user software. dsPIC30F Family Reference Manual DS70068D-page 21-26 © 2005 Microchip Technology Inc. Figure 21-16: Master Message (7-bit Address: Transmission And Reception) 1 - Setting the SEN bit starts a Start event. ACKEN ACKDT SEN SCL SDA SCL SDA I2CTRN TBF I2CRCV RBF MI2CIF ACKSTAT 1 2 3 4 5 6 7 8 A1A0 9 A PEN RCEN 1 2 3 4 5 6 7 8 D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 W RSEN 1 3 2 9 1 2 3 4 5 6 7 8 D3D2D1D0 D7D6D5D4 9 N A 4 5 6 9 7 8 2 - Writing the I2CTRN register starts a master transmission. The data is the 3 - Writing the I2CTRN register starts a master transmission. The data is the 4 - Setting the PEN bit starts a master Stop event. 5 - Setting the SEN bit starts a Start event. 6 - Writing the I2CTRN register starts a master transmission. The data is the 7 - Setting the RCEN bit starts a master reception. 8 - Setting the ACKEN bit starts an Acknowledge event. ACKDT = 1 to send NACK. - Setting the PEN bit starts a master Stop event. address byte with R/W bit clear. message byte. A6A5A4A3A2 A A1A0 R A6A5A4A3A2 address byte with R/W bit set. 9 (Master) (Master) (Slave) (Slave) MI2CIF cleared by user software. © 2005 Microchip Technology Inc. DS70068D-page 21-27 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 Figure 21-17: Master Message (10-bit Transmission) T 1 - Setting the SEN bit starts a Start event. ACKEN ACKDT SEN SCL SDA SCL SDA I2CTRN TBF I2CRCV RBF MI2CIF ACKSTAT 1 2 3 4 5 6 7 8 A9A8 9 A PEN RCEN 1 2 3 4 5 6 7 8 D3D2D1D0 D7D6D5D4 A7A6A5A4A3A2A1A0 1 2 3 4 5 6 7 8 9 W 0 1 1 1 1 RSEN 1 2 3 4 5 6 7 8 9 1 3 2 9 A 1 2 3 4 5 6 7 8 9 A A 4 5 6 7 2 - Writing the I2CTRN register starts a master transmission. The data is the first 3 - Writing the I2CTRN register starts a master transmission. The data is the second 4 - Writing the I2CTRN register starts a master transmission. The data is the first - Setting the PEN bit starts a master Stop event. byte of the address. byte of the address. byte of the message data. D3D2D1D0 D7D6D5D4 D3D2D1D0 D7D6D5D4 A 5 - Writing the I2CTRN register starts a master transmission. The data is the second byte of the message data. 6 - Writing the I2CTRN register starts a master transmission. The data is the third byte of the message data. 7 (Master) (Master) (Slave) (Slave) MI2CIF cleared by user software. dsPIC30F Family Reference Manual DS70068D-page 21-28 © 2005 Microchip Technology Inc. Figure 21-18: Master Message (10-bit Reception) 1 - Setting the SEN bit starts a Start event. ACKEN ACKDT SEN SCL SDA SCL SDA I2CTRN TBF I2CRCV RBF MI2CIF ACKSTAT 1 2 3 4 5 6 7 8 A9A8 9 A PEN RCEN 1 2 3 4 5 6 7 8 D3D2D1D0 D7D6D5D4 A7A6A5A4A3A2A1A0 1 2 3 4 5 6 7 8 9 W 0 1 1 1 1 RSEN A9A8 0 1 1 1 1 R 1 2 3 4 5 6 7 8 9 1 3 2 9 A 1 2 3 4 5 6 7 8 D3D2D1D0 D7D6D5D4 9 N A A 4 5 6 7 8 9 10 2 - Writing the I2CTRN register starts a master transmission. The data is the first 3 - Writing the I2CTRN register starts a master transmission. The data is the second 4 - Setting the RSEN bit starts a master REStart event. 5 - Writing the I2CTRN register starts a master transmission. The data is a resend 6 - Setting the RCEN bit starts a master reception. On interrupt, the software reads 7 - Setting the ACKEN bit starts an Acknowledge event. ACKDT = 0 to send ACK. 8 - Setting the RCEN bit starts a master reception. 9 - Setting the ACKEN bit starts an Acknowledge event. ACKDT = 1 to send NACK. - Setting the PEN bit starts a master Stop event. byte of the address with the R/W bit cleared. byte of the address. of the first byte with the R/W bit set. the I2CRCV register, which clears the RBF flag. 10 (Slave) (Slave) (Master) (Master) MI2CIF cleared in user software. © 2005 Microchip Technology Inc. DS70068D-page 21-29 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.6 Communicating as a Master in a Multi-Master Environment The I2C protocol allows for more than one master to be attached to a system bus. Remembering that a master can initiate message transactions and generate clocks for the bus, the protocol has methods to account for situations where more than one master is attempting to control the bus. Clock synchronization ensures that multiple nodes can synchronize their SCL clocks to result in one common clock on the SCL line. Bus arbitration ensures that if more than one node attempts a message transaction, one and only one node will be successful in completing the message. The other nodes will lose bus arbitration and be left with a bus collision. 21.6.1 Multi-Master Operation The master module has no special settings to enable multi-master operation. The module performs clock synchronization and bus arbitration at all times. If the module is used in a single master environment, clock synchronization will only occur between the master and slaves and bus arbitration will not occur. 21.6.2 Master Clock Synchronization In a multi-master system, different masters may have different baud rates. Clock synchronization will ensure that when these masters are attempting to arbitrate the bus, their clocks will be coordinated. Clock synchronization occurs when the master de-asserts the SCL pin (SCL intended to float high). When the SCL pin is released, the baud rate generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the baud rate generator is reloaded with the contents of I2CBRG<8:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device, as shown in Figure 21-19. Figure 21-19: Baud Rate Generator Timing with Clock Synchronization SCL (Slave) 1 - The baud counter decrements twice per TCY. On rollover, the master SCL will transition. 1 000 003 002 001 000 003 SCL (Master) Baud Counter 000 003 002 001 SDA (Master) 3 4 6 2 - The slave has pulled SCL low to initiate a wait. 3 - At what would be the master baud counter rollover, detecting SCL low holds counter. 4 - Logic samples SCL once per TCY. Logic detects SCL high. 2 5 - The baud counter rollover occurs on next cycle. 5 6 - On next rollover, the master SCL will transition. TBRG TBRG TCY dsPIC30F Family Reference Manual DS70068D-page 21-30 © 2005 Microchip Technology Inc. 21.6.3 Bus Arbitration and Bus Collision Bus arbitration supports multi-master system operation. The wired-and nature of the SDA line permits arbitration. Arbitration takes place when the first master outputs a ‘1’ on SDA by letting SDA float high and, simultaneously, the second master outputs a ‘0’ on SDA by pulling SDA low. The SDA signal will go low. In this case, the second master has won bus arbitration. The first master has lost bus arbitration and thus has a bus collision. For the first master, the expected data on SDA is a ‘1’ yet the data sampled on SDA is a ‘0’. This is the definition of a bus collision. The first master will set the bus collision bit, BCL (I2CSTAT<10>), and generate a master interrupt. The master module will reset the I2C port to its Idle state. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed by the master module, with the result placed in the BCL bit. The states where arbitration can be lost are: • A Start condition • A Repeated Start condition • Address, Data or Acknowledge bit • A Stop condition 21.6.4 Detecting Bus Collisions and Resending Messages When a bus collision occurs, the module sets the BCL bit and generates a master interrupt. If bus collision occurs during a byte transmission, the transmission is halted, the TBF flag is cleared and the SDA and SCL pins are de-asserted. If bus collision occurs during a Start, Repeated Start, Stop or Acknowledge condition, the condition is aborted, the respective control bits in the I2CCON register are cleared and the SDA and SCL lines are de-asserted. The software is expecting an interrupt at the completion of the master event. The software can check the BCL bit to determine if the master event completed successfully or if a collision occurred. If a collision occurs, the software must abort sending the rest of the pending message and prepare to resend the entire message sequence beginning with Start condition, after the bus returns to an Idle state. The software can monitor the S and P bits to wait for an Idle bus. When the software services the master Interrupt Service Routine and the I2C bus is free, the software can resume communication by asserting a Start condition. © 2005 Microchip Technology Inc. DS70068D-page 21-31 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.6.5 Bus Collision During a Start Condition Before issuing a Start command, the software should verify an Idle state of the bus using the S and P status bits. Two masters may attempt to initiate a message at a similar point in time. Typically, the masters will synchronize clocks and continue arbitration into the message until one loses arbitration. However, certain conditions can cause a bus collision to occur during a Start. In this case, the master that loses arbitration during the Start bit generates a bus collision interrupt. 21.6.6 Bus Collision During a Repeated Start Condition Should two masters not collide throughout an address byte, a bus collision may occur when one master attempts to assert a Repeated Start while another transmits data. In this case, the master generating the Repeated Start will lose arbitration and generate a bus collision interrupt. 21.6.7 Bus Collision During Message Bit Transmission The most typical case of data collision occurs while the master is attempting to transmit the device address byte, a data byte or an Acknowledge bit. If the software is properly checking the bus state, it is unlikely that a bus collision will occur on a Start condition. However, because another master can at a very similar time, check the bus and initiate its own Start condition, it is likely that SDA arbitration will occur and synchronize the starts of two masters. In this condition, both masters will begin and continue to transmit their messages until one master loses arbitration on a message bit. Remember that SCL clock synchronization will keep the two masters synchronized until one loses arbitration. Figure 21-20 shows an example of message bit arbitration. Figure 21-20: Bus Collision During Message Bit Transmission 21.6.8 Bus Collision During a Stop Condition If the master software loses track of the state of the I2C bus, there are conditions which cause a bus collision during a Stop condition. In this case, the master generating the Stop condition will lose arbitration and generate a bus collision interrupt. SCL (Master) SDA (Master) TBF TBRG 1 2 3 1 - Master transmits bit value of ‘1’ in next SCL clock. TBRG Module releases SDA. 2 - Another master on bus transmits bit value of ‘0’ in next SCL clock. Another master pulls SDA low. 3 - Baud generator times out. Module attempts to verify I 2C™ Bus State BCL (D) SCL (Bus) SDA (Bus) SDA high. Bus collision detected. Module releases SDA, SCL. Module sets BCL bit and clears TBF bit. Master generates interrupt. (Q) (Q) (D) (Q) MI2CIF Interrupt dsPIC30F Family Reference Manual DS70068D-page 21-32 © 2005 Microchip Technology Inc. 21.7 Communicating as a Slave In some systems, particularly where multiple processors communicate with each other, the dsPIC30F device may communicate as a slave (see Figure 21-21). When the module is enabled, the slave module is active. The slave may not initiate a message, it can only respond to a message sequence initiated by a master. The master requests a response from a particular slave as defined by the device address byte in the I2C protocol. The slave module replies to the master at the appropriate times as defined by the protocol. As with the master module, sequencing the components of the protocol for the reply is a software task. However, the slave module detects when the device address matches the address specified by the software for that slave. Figure 21-21: A Typical Slave I2C™ Message: Multiprocessor Command/Status After a Start condition, the slave module will receive and check the device address. The slave may specify either a 7-bit address or a 10-bit address. When a device address is matched, the module will generate an interrupt to notify the software that its device is selected. Based on the R/W bit sent by the master, the slave will either receive or transmit data. If the slave is to receive data, the slave module automatically generates the Acknowledge (ACK), loads the I2CRCV register with the received value currently in the I2CRSR register and notifies the software through an interrupt. If the slave is to transmit data, the software must load the I2CTRN register. 21.7.1 Sampling Receive Data All incoming bits are sampled with the rising edge of the clock (SCL) line. 21.7.2 Detecting Start and Stop Conditions The slave module will detect Start and Stop conditions on the bus and indicate that status on the S bit (I2CSTAT<3>) and P bit (I2CSTAT<4>). The Start (S) and Stop (P) bits are cleared when a Reset occurs or when the module is disabled. After detection of a Start or Repeated Start event, the S bit is set and the P bit is cleared. After detection of a Stop event, the P bit is set and the S bit is clear. 21.7.3 Detecting the Address Once the module has been enabled, the slave module waits for a Start condition to occur. After a Start, depending on the A10M bit (I2CCON<10>), the slave will attempt to detect a 7-bit or 10-bit address. The slave module will compare 1 received byte for a 7-bit address or 2 received bytes for a 10-bit address. A 7-bit address also contains a R/W bit that specifies the direction of data transfer after the address. If R/W = 0, a write is specified and the slave will receive data from the master. If R/W = 1, a read is specified and the slave will send data to the master. The 10-bit address contains a R/W bit, however by definition, it is always R/W = 0 because the slave must receive the second byte of the 10-bit address. Bus Master SDA A C K N A C A C K A C K A C K S T O P S T A R T First Address Second Address Command Data Address Byte Status Data S T A R T S AAA 0 210 R 1111 A A 1 9 8 P K Slave SDA Activity N A A A A R E R R / W R / W Output Output A 3 A 4 A 5 A 6 A 7 A 8 A 9 1 1 1 1 0 0 Byte Byte Byte Byte 10-bit Address © 2005 Microchip Technology Inc. DS70068D-page 21-33 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 Table 21-3: Slave Addresses Suppported by the I2C™ Module: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields. 21.7.3.1 7-bit Address and Slave Write Following the Start condition, the module shifts 8 bits into the I2CRSR register (see Figure 21-22). The value of register I2CRSR<7:1> is compared to the value of the I2CADD<6:0> register. The device address is compared on the falling edge of the eighth clock (SCL). If the addresses match, the following events occur: 1. An ACK is generated. 2. The D_A and R_W bits are cleared. 3. The module generates the SI2CIF interrupt on the falling edge of the ninth SCL clock. 4. The module will wait for the master to send data. Figure 21-22: Slave Write 7-bit Address Detection Timing Diagram 0x00 General call address or start byte 0x01-0x03 Reserved 0x04-0x77 Valid 7-bit addresses 0x78-0x7b Valid 10-bit addresses (lower 7 bits) 0x7c-0x7f Reserved SCL (Master) SDA (Master) SDA (Slave) SI2CIF Interrupt 1 2 3 4 1 - Detecting Start bit enables I 2C™ Bus State (S) (D) (D) (D) (Q) (A) A6 A3 A2 A1 A0 A5 A4 R/W D_A ADD10 SCLREL R_W address detection. 2 - R/W = 0 bit indicates that slave receives data bytes. 3 - Address match of first byte clears D_A bit. Slave generates ACK. 4 - R_W bit cleared. Slave generates interrupt. 5 5 - Bus waiting. Slave ready to receive data. =0 dsPIC30F Family Reference Manual DS70068D-page 21-34 © 2005 Microchip Technology Inc. 21.7.3.2 7-bit Address and Slave Read When a slave read is specified by having R/W = 1 in a 7-bit address byte, the process of detecting the device address is similar to that for a slave write (see Figure 21-23). If the addresses match, the following events occur: 1. An ACK is generated. 2. The D_A bit is cleared and the R_W bit is set. 3. The module generates the SI2CIF interrupt on the falling edge of the ninth SCL clock. Since the slave module is expected to reply with data at this point, it is necessary to suspend the operation of the I2C bus to allow the software to prepare a response. This is done automatically when the module clears the SCLREL bit. With SCLREL low, the slave module will pull down the SCL clock line, causing a wait on the I2C bus. The slave module and the I2C bus will remain in this state until the software writes the I2CTRN register with the response data and sets the SCLREL bit. Figure 21-23: Slave Read 7-bit Address Detection Timing Diagram Note: SCLREL will automatically clear after detection of a slave read address regardless of the state of the STREN bit. SCL (Master) SDA (Master) SDA (Slave) SI2CIF Interrupt 1 2 3 4 I 1 - Detecting Start bit enables 2C™ Bus State (S) (D) (D) (D) (Q) (A) A6 A3 A2 A1 A0 A5 A4 R/W D_A ADD10 SCLREL R_W address detection. 2 - R/W = 1 bit indicates that slave sends data bytes. 3 - Address match of first byte clears D_A bit. Slave generates ACK. 4 - R_W bit set. Slave generates interrupt. SCLREL cleared. 5 5 - Bus waiting. Slave prepares to send data. =1 SCL (Slave) Slave pulls SCL low while SCLREL = 0. © 2005 Microchip Technology Inc. DS70068D-page 21-35 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.7.3.3 10-bit Address In 10-bit Address mode, the slave must receive two device address bytes (see Figure 21-24). The five Most Significant bits (MSbs) of the first address byte specify a 10-bit address. The R/W bit of the address must specify a write, causing the slave device to receive the second address byte. For a 10-bit address the first byte would equal ‘11110 A9 A8 0’, where A9 and A8 are the two MSbs of the address. Following the Start condition, the module shifts 8 bits into the I2CRSR register. The value of register I2CRSR<2:1> is compared to the value of the I2CADD<9:8> register. The value of I2CRSR<7:3> is compared to ‘11110’. The device address is compared on the falling edge of the eighth clock (SCL). If the addresses match, the following events occur: 1. An ACK is generated. 2. The D_A and R_W bits are cleared. 3. The module generates the SI2CIF interrupt on the falling edge of the ninth SCL clock. The module does generate an interrupt after the reception of the first byte of a 10-bit address, however this interrupt is of little use. The module will continue to receive the second byte into I2CRSR. This time, I2CRSR<7:0> is compared to I2CADD<7:0>. If the addresses match, the following events occur: 1. An ACK is generated. 2. The ADD10 bit is set. 3. The module generates the SI2CIF interrupt on the falling edge of the ninth SCL clock. 4. The module will wait for the master to send data or initiate a Repeated Start condition. Figure 21-24: 10-bit Address Detection Timing Diagram Note: Following a Repeated Start condition in 10-bit mode, the slave module only matches the first 7-bit address, ‘11110 A9 A8 0’. SCL (Master) SDA (Master) SDA (Slave) SI2CIF Interrupt 1 2 3 4 5 1 - Detecting Start bit enables address detection. 2 - Address match of first byte clears D_A bit and causes slave logic to generate ACK. 3 - Reception of first byte clears R_W bit. Slave logic generates interrupt. 4 - Address match of first and second byte sets ADD10 and causes slave logic to generate ACK. 5 - Reception of second byte completes 10-bit address. Slave logic generates interrupt. I 2C™ Bus State (S) (D) (D) (D) (A) (Q) 1 1 0 A9 A8 1 1 R/W D_A ADD10 SCLREL =0 A7 A4 A3 A2 A1 A0 A6 A5 R_W (D) (D) (D) (A) 6 5 - Bus waiting. Slave ready to receive data. dsPIC30F Family Reference Manual DS70068D-page 21-36 © 2005 Microchip Technology Inc. 21.7.3.4 General Call Operation The addressing procedure for the I2C bus is such that the first byte after a Start condition usually determines which slave device the master is addressing. The exception is the general call address, which can address all devices. When this address is used, all enabled devices should respond with an Acknowledge. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R/W = 0. The general call is always a slave write operation. The general call address is recognized when the general call enable bit, GCEN (I2CCON<7>), is set (see Figure 21-25). Following a Start bit detect, 8 bits are shifted into the I2CRSR and the address is compared against the I2CADD, and is also compared to the general call address. If the general call address matches, the following events occur: 1. An ACK is generated. 2. Slave module will set the GCSTAT bit (I2CSTAT<9>). 3. The D_A and R_W bits are cleared. 4. The module generates the SI2CIF interrupt on the falling edge of the ninth SCL clock. 5. The I2CRSR is transferred to the I2CRCV and the RBF flag bit is set (during the eighth bit). 6. The module will wait for the master to send data. When the interrupt is serviced, the cause for the interrupt can be checked by reading the contents of the GCSTAT bit to determine if the device address was device specific or a general call address. Note that general call addresses are 7-bit addresses. If A10M bit is set, configuring the slave module for 10-bit addresses and GCEN is set, the slave module continues to detect the 7-bit general call address. Figure 21-25: General Call Address Detection Timing Diagram (GCEN = 1) SCL (Master) SDA (Master) SDA (Slave) SI2CIF Interrupt 1 2 3 4 1 - Detecting Start bit enables I 2C™ Bus State (S) (D) (D) (D) (Q) (A) 0 0000 0 0 R/W D_A I2CRCV RBF R_W address detection. 2 - All ‘0’s and R/W = 0 bit indicates general call. 3 - Address match clears D_A bit and sets GCSTAT. 4 - R_W bit cleared. Slave generates interrupt. 5 5 - Bus waiting. Slave ready to receive data. =0 CGSTAT Slave generates ACK. Address loaded into I2CRCV. © 2005 Microchip Technology Inc. DS70068D-page 21-37 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.7.3.5 Receiving All Addresses (IPMI Operation) Some I2C system protocols require a slave to act upon all messages on the bus. For example, the IPMI (Intelligent Peripheral Management Interface) bus uses I2C nodes as message repeaters in a distributed network. To allow a node to repeat all messages, the slave module must accept all messages, regardless of the device address. Setting the IPMIEN bit (I2CCON<11>) enables this mode (see Figure 21-26). Regardless of the state of the I2CADD register and the A10M and GCEN bits, all addresses will be accepted. Figure 21-26: IPMI Address Detection Timing Diagram (IPMIEN = 1) 21.7.3.6 When an Address is Invalid If a 7-bit address does not match the contents of I2CADD<6:0>, the slave module will return to an Idle state and ignore all bus activity until after the Stop condition. If the first byte of a 10-bit address does not match the contents of I2CADD<9:8>, the slave module will return to an Idle state and ignore all bus activity until after the Stop condition. If the first byte of a 10-bit address matches the contents of I2CADD<9:8>, however, the second byte of the 10-bit address does not match I2CADD<7:0>, the slave module will return to an Idle state and ignore all bus activity until after the Stop condition. 21.7.4 Receiving Data from a Master Device When the R/W bit of the device address byte is zero and an address match occurs, the R_W bit (I2CSTAT<2>) is cleared. The slave module enters a state waiting for data sent by the master. After the device address byte, the contents of the data byte are defined by the system protocol and are only received by the slave module. The slave module shifts 8 bits into the I2CRSR register. On the falling edge of the eighth clock (SCL), the following events occur: 1. The module begins to generate an ACK or NACK. 2. The RBF bit is set to indicate received data. 3. The I2CRSR byte is transferred to the I2CRCV register for access by the software. 4. The D_A bit is set. 5. A slave interrupt is generated. Software may check the status of the I2CSTAT register to determine the cause of the event and then clear the SI2CIF flag. 6. The module will wait for the next data byte. SCL (Master) SDA (Master) SDA (Slave) SI2CIF Interrupt 1 2 3 1 - Detecting Start bit enables I 2C™ Bus State (S) (D) (D) (D) (Q) (A) R/W D_A I2CRCV RBF R_W address detection. 2 - Regardless of contents of byte address is matched. Address match clears D_A bit. 3 - R_W bit set/clear. Slave generates interrupt. 4 4 - Bus waiting. Slave generates ACK. Address loaded into I2CRCV. dsPIC30F Family Reference Manual DS70068D-page 21-38 © 2005 Microchip Technology Inc. 21.7.4.1 Acknowledge Generation Normally, the slave module will Acknowledge all received bytes by sending an ACK on the ninth SCL clock. If the receive buffer is overrun, the slave module does not generate this ACK. Overrun is indicated if either (or both): 1. The buffer full bit, RBF (I2CSTAT<1>), was set before the transfer was received. 2. The overflow bit, I2COV (I2CSTAT<6>), was set before the transfer was received. Table 21-4 shows what happens when a data transfer byte is received, given the status of the RBF and I2COV bits. If the RBF bit is already set when the slave module attempts to transfer to the I2CRCV, the transfer does not occur but the interrupt is generated and the I2COV bit is set. If both the RBF and I2COV bits are set, the slave module acts similarly. The shaded cells show the condition where software did not properly clear the overflow condition. Reading the I2CRCV clears the RBF bit. The I2COV is cleared by writing to a ‘0’ through software. Table 21-4: Data Transfer Received Byte Actions 21.7.4.2 WAIT States During Slave Receptions When the slave module receives a data byte, the master can potentially begin sending the next byte immediately. This allows the software controlling the slave module 9 SCL clock periods to process the previously received byte. If this is not enough time, the slave software may want to generate a bus WAIT period. The STREN bit (I2CCON<6>) enables a bus WAIT to occur on slave receptions. When STREN = 1 at the falling edge of the 9th SCL clock of a received byte, the slave module clears the SCLREL bit. Clearing the SCLREL bit causes the slave module to pull the SCL line low, initiating a WAIT. The SCL clock of the master and slave will synchronize, as shown in Section 21.6.2 “Master Clock Synchronization”. When the software is ready to resume reception, the software sets SCLREL. This causes the slave module to release the SCL line and the master resumes clocking. Status Bits as Data Byte Received Transfer I2CRSR → I2CRCV Generate ACK Generate SI2CIF Interrupt (Interrupt occurs if enabled) Set RBF Set I2COV RBF I2COV 0 0 Yes Yes Yes Yes No change 1 0 No No Yes No change Yes 1 1 No No Yes No change Yes 0 1 Yes No Yes Yes No change Note: Shaded cells show state where the software did not properly clear the overflow condition. © 2005 Microchip Technology Inc. DS70068D-page 21-39 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.7.4.3 Example Messages of Slave Reception Receiving a slave message is a rather automatic process. The software handling the slave protocol uses the slave interrupt to synchronize to the events. When the slave detects the valid address, the associated interrupt will notify the software to expect a message. On receive data, as each data byte transfers to the I2CRCV register, an interrupt notifies the software to unload the buffer. Figure 21-27 shows a simple receive message. Being a 7-bit address message, only one interrupt occurs for the address bytes. Then, interrupts occur for each of four data bytes. At an interrupt, the software may monitor the RBF, D_A and R_W bits to determine the condition of the byte received. Figure 21-28 shows a similar message using a 10-bit address. In this case, two bytes are required for the address. Figure 21-29 shows a case where the software does not respond to the received byte and the buffer overruns. On reception of the second byte, the module will automatically NACK the master transmission. Generally, this causes the master to resend the previous byte. The I2COV bit indicates that the buffer has overrun. The I2CRCV buffer retains the contents of the first byte. On reception of the third byte, the buffer is still full and again the module will NACK the master. After this, the software finally reads the buffer. Reading the buffer will clear the RBF bit, however the I2COV bit remains set. The software must clear the I2COV bit. The next received byte will be moved to the I2CRCV buffer and the module will respond with a ACK. Figure 21-30 highlights clock stretching while receiving data. Note in the previous examples, STREN = 0 which disables clock stretching on receive messages. In this example, the software sets STREN to enable clock stretching. When STREN = 1, the module will automatically clock stretch after each received data byte, allowing the software more time to move the data from the buffer. Note that if RBF = 1 at the falling edge of the 9th clock, the module will automatically clear the SCLREL bit and pull the SCL bus line low. As shown with the second received data byte, if the software can read the buffer and clear the RBF before the falling edge of the 9th clock, the clock stretching will not occur. The software can also suspend the bus at any time. By clearing the SCLREL bit, the module will pull the SCL line low after it detects the bus SCL low. The SCL line will remain low, suspending transactions on the bus until the SCLREL bit is set. © 2 0 0 5 M i c r o c h i p T e c h n o l o g y I n c . D S 7 0 0 6 8 D - p a g e 2 1 - 4 0 S e c t i o n 2 1 . I n t e r - I n t e g r a t e d C i r c u i t ( I 2 C ) Inter-Integrated Circuit (I2C) 21 Figure 21-27: Slave Message (Write Data to Slave: 7-bit Address; Address Matches; A10M = 0; GCEN = 0; IPMIEN = 0) T 1 - Slave recognizes Start event, S and P bits set/clear accordingly. SCL (Master) SDA (Master) SCL (Slave) SDA (Slave) I2CRCV RBF STREN SI2CIF 1 2 3 4 5 6 7 8 A1A0 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 W 1 3 2 A 4 3 3 3 5 2 - Slave receives address byte. Address matches. Slave Acknowledges 3 - Next received byte is message data. Byte moved to I2CRCV register, sets RBF. 4 - Software reads I2CRCV register. RBF bit clears. 5 - Slave recognizes Stop event, S and P bits set/clear accordingly. Address byte is moved to I2CRCV register and must be read by user software to prevent buffer overflow. Slave generates interrupt. Slave Acknowledges reception. A6A5A4A3A2 S P I2COV R_W D_A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A SCLREL 4 4 4 SI2CIF cleared by user software. and generates interrupt. dsPIC30F Family Reference Manual DS70068D-page 21-41 © 2005 Microchip Technology Inc. Figure 21-28: Slave Message (Write Data to Slave: 10-bit Address; Address Matches; A10M=1; GCEN=0; IPMIEN=0) T 1 - Slave recognizes Start event, S and P bits set/clear accordingly. SCL (Master) SDA (Master) SCL (Slave) SDA (Slave) I2CRCV RBF STREN SI2CIF 1 2 3 4 5 6 7 8 A9A8 9 A A7A6A5A4A3A2A1A0 1 2 3 4 5 6 7 8 9 W 1 3 2 A 4 4 4 6 2 - Slave receives address byte. High order address matches. 3 - Slave receives address byte. Low order address matches. 4 - Next received byte is message data. Byte moved to I2CRCV register, sets RBF. 5 - Software reads I2CRCV register. RBF bit clears. 6 - Slave recognizes Stop event, S and P bits set/clear accordingly. Slave Acknowledges and generates interrupt. Address byte not Slave Acknowledges and generates interrupt. S P I2COV R_W D_A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A SCLREL 5 5 5 1 1 1 1 0 Slave Acknowledges and generates interrupt. Address byte not moved to I2CRCV register. moved to I2CRCV register. SI2CIF cleared by user software. dsPIC30F Family Reference Manual DS70068D-page 21-42 © 2005 Microchip Technology Inc. Figure 21-29: Slave Message (Write Data to Slave: 7-bit Address; Buffer Overrun; A10M = 0; GCEN = 0; IPMIEN = 0) T SCL (Master) SDA (Master) SCL (Slave) SDA (Slave) I2CRCV RBF STREN SI2CIF 1 2 3 4 5 6 7 8 A1A0 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 W 2 1 A 3 4 2 1 - Slave receives address byte. Address matches. Slave generates interrupt. 2 - Next received byte is message data. Byte moved to I2CRCV register, sets RBF. 6 - Software reads I2CRCV register. RBF bit clears. 7 - Software clears I2COV bit. Address byte not moved to I2CRCV register. Slave generates interrupt. Slave Acknowledges reception. A6A5A4A3A2 S P I2COV R_W D_A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 N D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 SCLREL 5 5 3 - Next byte received before I2CRCV read by software. I2CRCV register unchanged. I2COV overflow bit set. Slave generates interrupt. Slave sends NACK for reception. N A 6 4 - Next byte also received before I2CRCV read by software. Slave sends NACK for reception. I2CRCV register unchanged. Slave generates interrupt. SI2CIF cleared by user software. © 2005 Microchip Technology Inc. DS70068D-page 21-43 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 Figure 21-30: Slave Message (Write Data to Slave: 7-bit Address; Clock Stretching Enabled; A10M = 0; GCEN = 0; IPMIEN = 0) T 1 - Software sets the STREN bit to enable clock stretching. SCL (Master) SDA (Master) SCL (Slave) SDA (Slave) I2CTRN TBF I2CRCV RBF STREN SI2CIF 1 2 3 4 5 6 7 8 A1A0 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 W 3 2 A 5 3 8 3 2 - Slave receives address byte. 3 - Next received byte is message data. Byte moved to I2CRCV register, sets RBF. 6 - Software sets SCLREL bit to release clock. 7 - Slave does not clear SCLREL because RBF = 0 at this time. A6A5A4A3A2 S P I2COV R_W D_A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A D7D6D5 D3D2D1D0 1 2 3 4 5 6 7 8 9 A SCLREL 5 9 5 D4 4 6 7 1 4 - Because RBF = 1 at 9th clock, automatic clock stretch begins. Slave clears SCLREL bit. Slave pulls SCL line low to stretch clock. 5 - Software reads I2CRCV register. RBF bit clears. 8 - Software may clear SCLREL to cause a clock hold. Module must detect SCL low 9 - Software may set SCLREL to release a clock hold. before asserting SCL low. dsPIC30F Family Reference Manual DS70068D-page 21-44 © 2005 Microchip Technology Inc. 21.7.5 Sending Data to a Master Device When the R/W bit of the incoming device address byte is one and an address match occurs, the R_W bit (I2CSTAT<2>) is set. At this point, the master device is expecting the slave to respond by sending a byte of data. The contents of the byte are defined by the system protocol and are only transmitted by the slave module. When the interrupt from the address detection occurs, the software can write a byte to the I2CTRN register to start the data transmission. The slave module sets the TBF bit. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time. When all eight bits have been shifted out, the TBF bit will be cleared. The slave module detects the Acknowledge from the master-receiver on the rising edge of the ninth SCL clock. If the SDA line is low indicating an Acknowledge (ACK), the master is expecting more data and the message is not complete. The module generates a slave interrupt to signal more data is requested. A slave interrupt is generated on the falling edge of the ninth SCL clock. Software must check the status of the I2CSTAT register and clear the SI2CIF flag. If the SDA line is high, indicating a Not Acknowledge (NACK), then the data transfer is complete. The slave module resets and does not generate an interrupt. The slave module will wait for detection of the next Start bit. 21.7.5.1 WAIT States During Slave Transmissions During a slave transmission message, the master expects return data immediately after detection of the valid address with R/W = 1. Because of this, the slave module will automatically generate a bus WAIT whenever the slave returns data. The automatic WAIT occurs at the falling edge of the 9th SCL clock of a valid device address byte or transmitted byte Acknowledged by the master, indicating expectation of more transmit data. The slave module clears the SCLREL bit. Clearing the SCLREL bit causes the slave module to pull the SCL line low, initiating a WAIT. The SCL clock of the master and slave will synchronize as shown in Section 21.6.2 “Master Clock Synchronization”. When the software loads the I2CTRN and is ready to resume transmission, the software sets SCLREL. This causes the slave module to release the SCL line and the master resumes clocking. 21.7.5.2 Example Messages of Slave Transmission Slave transmissions for 7-bit address messages are shown in Figure 21-31. When the address matches and the R/W bit of the address indicates a slave transmission, the module will automatically initiate clock stretching by clearing the SCLREL bit and generate an interrupt to indicate a response byte is required. The software will write the response byte into the I2CTRN register. As the transmission completes, the master will respond with an Acknowledge. If the master replies with an ACK, the master expects more data and the module will again clear the SCLREL bit and generate another interrupt. If the master responds with a NACK, no more data is required and the module will not stretch the clock nor generate an interrupt. Slave transmissions for 10-bit address messages require the slave to first recognize a 10-bit address. Because the master must send two bytes for the address, the R/W bit in the first byte of the address specifies a write. To change the message to a read, the master will send a Repeated Start and repeat the first byte of the address with the R/W bit specifying a read. At this point, the slave transmission begins as shown in Figure 21-32. © 2 0 0 5 M i c r o c h i p T e c h n o l o g y I n c . D S 7 0 0 6 8 D - p a g e 2 1 - 4 5 S e c t i o n 2 1 . I n t e r - I n t e g r a t e d C i r c u i t ( I 2 C ) Inter-Integrated Circuit (I2C) 21 Figure 21-31: Slave Message (Read Data from Slave: 7-bit Address) T 1 - Slave recognizes Start event, S and P bits set/clear accordingly. SCL (Master) SDA (Master) SCL (Slave) SDA (Slave) I2CTRN TBF I2CRCV RBF STREN SI2CIF 1 2 3 4 5 6 7 8 A1A0 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 R 1 4 2 A 5 3 5 3 8 2 - Slave receives address byte. Address matches. Slave generates interrupt. 3 - Software writes I2CTRN with response data. TBF = 1 indicates that buffer is full. 6 - At end of 9th clock, if master sent ACK, module clears SCLREL to suspend clock. 8 - Slave recognizes Stop event, S and P bits set/clear accordingly. Address byte not moved to I2CRCV register. R_W = 1 to indicate read from slave. Writing I2CTRN sets D_A, indicating data byte. A6A5A4A3A2 S P I2COV R_W D_A SCLREL 4 4 D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 N 3 6 6 5 7 SCLREL = 0 to suspend master clock. 4 - Software sets SCLREL to release clock hold. Master resumes clocking and slave transmits data byte. 5 - After last bit, module clears TBF bit indicating buffer is available for next byte. Slave generates interrupt. 7 - At end of 9th clock, if master sent NACK, no more data expected. Module does not suspend clock and will generate an interrupt. dsPIC30F Family Reference Manual DS70068D-page 21-46 © 2005 Microchip Technology Inc. Figure 21-32: Slave Message (Read Data from Slave: 10-bit Address) T 1 - Slave recognizes Start event, S and P bits set/clear accordingly. SCL (Master) SDA (Master) SCL (Slave) SDA (Slave) I2CTRN TBF I2CRCV RBF STREN SI2CIF 1 2 3 4 5 6 7 8 9 A 1 4 2 7 8 2 - Slave receives first address byte. Write indicated. Slave Acknowledges and 6 - Software writes I2CTRN with response data. 8 - At end of 9th clock, if master sent ACK, module clears SCLREL to suspend clock. - Slave recognizes Stop event, S and P bits set/clear accordingly. S P ADD10 R_W D_A SCLREL 5 6 D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 N 3 6 9 7 7 - Software sets SCLREL to release clock hold. Master resumes clocking and slave transmits data byte. Slave generates interrupt. 9 - At end of 9th clock, if master sent NACK, no more data expected. Module does not suspend clock or generate interrupt. A7A6A5A4A3A2A1A0 1 2 3 4 5 6 7 8 9 A A9A8 W 1 1 1 1 0 1 2 3 4 5 6 7 8 9 A A9A8 1 1 1 1 0 D7D6D5D4D3D2D1D0 1 2 3 4 5 6 7 8 9 A 3 - Slave receives address byte. Address matches. Slave Acknowledges and 10 10 4 - Master sends a Repeated Start to redirect the message. 5 - Slave receives resend of first address byte. Read indicated. Slave suspends clock. R generates interrupt. generates interrupt. © 2005 Microchip Technology Inc. DS70068D-page 21-47 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.8 Connection Considerations for I2C Bus By definition of the I2C bus being a wired AND bus connection, pull-up resistors on the bus are required, shown as RP in Figure 21-33. Series resistors, shown as RS are optional and used to improve ESD susceptibility. The values of resistors RP and RS depend on the following parameters: • Supply voltage • Bus capacitance • Number of connected devices (input current + leakage current) Because the device must be able to pull the bus low against RP, current drawn by RP must be greater than the I/O pin minimum sink current IOL of 3 mA at VOL(MAX) = 0.4V for the device output stage. For example, with a supply voltage of VDD = 5V +10%: RP(MIN) = (VDD(MAX) – VOL(MAX)) / IOL = (5.5-0.4) / 3 mA = 1.7 kΩ In a 400 kHz system, a minimum rise time specification of 300 nsec exists and in a 100 kHz system, the specification is 1000 nsec. Because RP must pull the bus up against the total capacitance CB with a maximum rise time of 300 nsec to 0.7 VDD, the maximum resistance for RP must be less than: RP(MAX) = -tR / CB * ln(1 – (VIL(MAX) – VDD(MAX)) = -300 nsec / (100pf * ln(1-0.7)) = 2.5 kΩ The maximum value for RS is determined by the desired noise margin for the low level. RS cannot drop enough voltage to make the device VOL plus voltage across RS more than the maximum VIL. Rs(MAX) = (VIL(MAX) – VOL(MIN)) / IOL(MAX) = (0.3 VDD-0.4) / 3 mA = 366Ω The SCL clock input must have a minimum high and low time for proper operation. The high and low times of the I2C specification as well as the requirements of the I2C module, are shown in the “Electrical Specifications” section in the specific device data sheet. Figure 21-33: Sample Device Configuration for I2C™ Bus RP RP VDD + 10% SDA SCL Device CB = 10 - 400 pF RS RS Note: I 2C devices with input levels related to VDD must have one common supply line to which the pull-up resistor is also connected. dsPIC30F Family Reference Manual DS70068D-page 21-48 © 2005 Microchip Technology Inc. 21.8.1 Integrated Signal Conditioning The SCL and SDA pins have an input glitch filter. The I2C bus requires this filter in both the 100 kHz and 400 kHz systems. When operating on a 400 kHz bus, the I2C specification requires a slew rate control of the device pin output. This slew rate control is integrated into the device. If the DISSLW bit (I2CCON<9>) is cleared, the slew rate control is active. For other bus speeds, the I2C specification does not require slew rate control and DISSLW should be set. Some system implementations of I2C busses require different input levels for VIL(MAX) and VIH(MIN). In a normal I2C system: VIL(MAX) = lesser of 1.5V and 0.3 VDD VIH(MIN) = greater of 3.0V and 0.7 VDD In an SMBus (System Management Bus) system: VIL(MAX) = 0.2 VDD VIH(MIN) = 0.8 VDD The SMEN bit (I2CCON<8>) controls the input levels. SMEN is set to change the input levels to SMBus specifications. © 2005 Microchip Technology Inc. DS70068D-page 21-49 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.9 Module Operation During PWRSAV Instruction 21.9.1 When the Device Enters Sleep Mode When the device executes a PWRSAV 0 instruction, the device enters Sleep mode. When the device enters Sleep mode, the master and slave module abort any pending message activity and reset the state of the modules. Any transmission/reception that is in progress will not continue when the device wakes from Sleep. After the device returns to Operational mode, the master module will be in an Idle state waiting for a message command and the slave module will be waiting for a Start condition. During Sleep, the IWCOL, I2COV and BCL bits are cleared. Additionally, because the master functions are aborted, the SEN, RSEN, PEN, RCEN, ACKEN and TRSTAT bits are cleared. TBF and RBF are cleared and the buffers are available at wake-up. There is no automatic method to prevent Sleep entry if a transmission or reception is active or pending. The software must synchronize Sleep entry with I2C operation to avoid aborted messages. During Sleep, the slave module will not monitor the I2C bus. Thus, it is not possible to generate a wake-up event based on the I2C bus using the I2C module. Other interrupt inputs, such as the interrupt-on-change inputs can be used to detect message traffic on a I2C bus and cause a device wake-up. 21.9.2 When the Device Enters Idle Mode When the device executes a PWRSAV 1 instruction, the device enters Idle mode. The module will enter a power saving state in Idle mode depending on the I2CSIDL bit (I2CCON<13>). If I2CSIDL = 1, the module will enter the Power Saving mode similarly to actions while entering Sleep mode. If I2CSIDL = 0, the module will not enter a Power Saving mode. The module will continue to operate normally. 21.10 Effects of a Reset A Reset disables the I2C module and terminates any active or pending message activity. See the register definitions of I2CCON and I2CSTAT for the Reset conditions of those registers. Note: In this discussion, ‘Idle’ refers to the CPU power saving state. The lower-case ‘idle’ refers to the time when the I2C module is not transferring data on the bus. dsPIC30F Family Reference Manual DS70068D-page 21-50 © 2005 Microchip Technology Inc. 21.11 Design Tips Question 1: I’m operating as a bus master and transmitting data, however, slave and receive interrupts are also occurring. Answer: The master and slave circuits are independent. The slave module will receive events from the bus sent by the master. Question 2: I’m operating as a slave and I write data to the I2CTRN register, but the data did not transmit. Answer: The slave enters an automatic wait when preparing to transmit. Ensure that you set the SCLREL bit to release the I2C clock. Question 3: How do I tell what state the master module is in? Answer: Looking at the condition of SEN, RSEN, PEN, RCEN, ACKEN and TRSTAT bits will indicate the state of the master module. If all bits are ‘0’, the module is Idle. Question 4: Operating as a slave, I receive a byte while STREN = 0. What should the software do if it cannot process the byte before the next one is received? Answer: Because STREN was ‘0’, the module did not generate an automatic WAIT on the received byte. However, the software may, at any time during the message, set STREN then clear SCLREL. This will cause a WAIT on the next opportunity to synchronize the SCL clock. Question 5: My I2C system is a multi-master system. When I attempt to send a message, it is being corrupted. Answer: In a multi-master system, other masters may cause bus collisions. In the Interrupt Service Routine for the master, check the BCL bit to ensure that the operation completed without a collision. If a collision is detected, the message must be resent from the beginning. Question 6: My I2C system is a multi-master system. How can I tell when it is OK to begin a message? Answer: Look at the S and P bits. If S = 0 and P = 0 the bus is Idle. If S = 0 and P = 1, the bus is Idle. Question 7: I tried to send a Start condition on the bus, then transmit a byte by writing to the I2CTRN register. The byte did not get transmitted. Why? Answer: You must wait for each event on the I2C bus to complete before starting the next one. In this case, you should poll the SEN bit to determine when the Start event completed, or wait for the master I2C interrupt before data is written to I2CTRN. © 2005 Microchip Technology Inc. DS70068D-page 21-51 Section 21. Inter-Integrated Circuit (I2C) Inter-Inte grate d Circuit (I 2C) 21 21.12 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Inter-Integrated Circuit (I2C) module are: Title Application Note # Use of the SSP Module in the I 2C™ Multi-Master Environment AN578 Using the PICmicro® SSP for Slave I2C™ Communication AN734 Using the PICmicro® MSSP Module for Master I2C™ Communications AN735 An I2C™ Network Protocol for Environmental Monitoring AN736 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70068D-page 21-52 © 2005 Microchip Technology Inc. 21.13 Revision History Revision A This is the initial released revision of this document. Revision B This revision has been expanded to contain a full description of the dsPIC30F Inter-Integrated Circuit (I2C) module. Revision C This revision incorporates all known errata at the time of this document update. © 2004 Microchip Technology Inc. DS70069C-page 22-1 D ata C o n v erter Interface (DCI) 22 Section 22. Data Converter Interface (DCI) HIGHLIGHTS This section of the manual contains the following topics: 22.1 Introduction .................................................................................................................. 22-2 22.2 Control Register Descriptions ...................................................................................... 22-2 22.3 Codec Interface Basics and Terminology..................................................................... 22-8 22.4 DCI Operation............................................................................................................ 22-10 22.5 Using the DCI Module................................................................................................ 22-17 22.6 Operation in Power Saving Modes ............................................................................ 22-28 22.7 Registers Associated with DCI................................................................................... 22-28 22.8 Design Tips ................................................................................................................ 22-30 22.9 Related Application Notes.......................................................................................... 22-31 22.10 Revision History ......................................................................................................... 22-32 dsPIC30F Family Reference Manual DS70069C-page 22-2 © 2004 Microchip Technology Inc. 22.1 Introduction The dsPIC Data Converter Interface (DCI) module allows simple interfacing of devices, such as audio coder/decoders (codecs), A/D converters, and D/A converters. The following interfaces are supported: • Framed Synchronous Serial Transfer (Single or Multi-Channel) • Inter-IC Sound (I2S) Interface • AC-Link Compliant mode Many codecs intended for use in audio applications support sampling rates between 8 kHz and 48 kHz and use one of the interface protocols listed above. The DCI automatically handles the interface timing associated with these codecs. No overhead from the CPU is required until the requested amount of data has been transmitted and/or received by the DCI. Up to four data words may be transferred between CPU interrupts. The data word length for the DCI is programmable up to 16 bits to match the data size of the dsPIC30F CPU. However, many codecs have data word sizes greater than 16 bits. Long data word lengths can be supported by the DCI. The DCI is configured to transmit/receive the long word in multiple 16-bit time slots. This operation is transparent to the user and the long data word is stored in consecutive register locations. The DCI can support up to 16 time slots in a data frame, for a maximum frame size of 256 bits. There are control bits for each time slot in the data frame that determine whether the DCI will transmit/receive during the time slot. 22.2 Control Register Descriptions The DCI has five Control registers and one Status register, which are listed below: • DCICON1: DCI module enable and mode bits. • DCICON2: DCI module word length, data frame length, and buffer setup. • DCICON3: DCI module bit clock generator setup. • DCISTAT: DCI module status information. • RSCON: Active frame time slot control for data reception. • TSCON: Active frame time slot control for data transmit. In addition to these Control and Status registers, there are four Transmit registers, TXBUF0....TXBUF3, and four Receive registers, RXBUF0....RXBUF3. © 2004 Microchip Technology Inc. DS70069C-page 22-3 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 Register 22-1: DCICON1 Upper Byte: R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 DCIEN — DCISIDL — DLOOP CSCKD CSCKE COFSD bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R/W-0 UNFM CSDOM DJST — — — COFSM<1:0> bit 7 bit 0 bit 15 DCIEN: DCI Module Enable bit 1 = Module is enabled 0 = Module is disabled bit 14 Reserved: Read as ‘0’ bit 13 DCISIDL: DCI Stop in Idle Control bit 1 = Module will halt in CPU Idle mode 0 = Module will continue to operate in CPU Idle mode bit 12 Reserved: Read as ‘0’ bit 11 DLOOP: Digital Loopback Mode Control bit 1 = Digital Loopback mode is enabled. CSDI and CSDO pins internally connected. 0 = Digital Loopback mode is disabled bit 10 CSCKD: Sample Clock Direction Control bit 1 = CSCK pin is an input when DCI module is enabled 0 = CSCK pin is an output when DCI module is enabled bit 9 CSCKE: Sample Clock Edge Control bit 1 = Data changes on serial clock falling edge, sampled on serial clock rising edge 0 = Data changes on serial clock rising edge, sampled on serial clock falling edge bit 8 COFSD: Frame Synchronization Direction Control bit 1 = COFS pin is an input when DCI module is enabled 0 = COFS pin is an output when DCI module is enabled bit 7 UNFM: Underflow Mode bit 1 = Transmit last value written to the Transmit registers on a transmit underflow 0 = Transmit ‘0’s on a transmit underflow bit 6 CSDOM: Serial Data Output Mode bit 1 = CSDO pin will be tri-stated during disabled transmit time slots 0 = CSDO pin drives ‘0’s during disabled transmit time slots bit 5 DJST: DCI Data Justification Control bit 1 = Data transmission/reception is begun during the same serial clock cycle as the frame synchronization pulse 0 = Data transmission/reception is begun one serial clock cycle after frame synchronization pulse bit 4-2 Reserved: Read as ‘0’ bit 1-0 COFSM<1:0>: Frame Sync Mode bits 11 = 20-bit AC-Link mode 10 = 16-bit AC-Link mode 01 = I2S Frame Sync mode 00 = Multi-Channel Frame Sync mode Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70069C-page 22-4 © 2004 Microchip Technology Inc. Register 22-2: DCICON2 Upper Byte: U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0 R/W-0 — — — — BLEN<1:0> — COFSG3 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 COFSG<2:0> — WS<3:0> bit 7 bit 0 bit 15-12 Reserved: Read as ‘0’ bit 11-10 BLEN<1:0>: Buffer Length control bits 11 = Four data words will be buffered between interrupts 10 = Three data words will be buffered between interrupts 01 = Two data words will be buffered between interrupts 00 = One data word will be buffered between interrupts bit 9 Reserved: Read as ‘0’ bit 8-5 COFSG<3:0>: Frame Sync Generator control bits 1111 = Data frame has 16 words || 0010 = Data frame has 3 words 0001 = Data frame has 2 words 0000 = Data frame has 1 word bit 4 Reserved: Read as ‘0’ bit 3-0 WS<3:0>: DCI Data Word Size bits 1111 = Data word size is 16 bits || 0100 = Data word size is 5 bits 0011 = Data word size is 4 bits 0010 = Invalid Selection. Do not use. Unexpected results may occur. 0001 = Invalid Selection. Do not use. Unexpected results may occur. 0000 = Invalid Selection. Do not use. Unexpected results may occur. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70069C-page 22-5 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 Register 22-3: DCICON3 Upper Byte: U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — — BCG<11:8> bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BCG<7:0> bit 7 bit 0 bit 15-12 Reserved: Read as ‘0’. bit 11-0 BCG<11:0>: DCI Bit Clock Generator Control bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70069C-page 22-6 © 2004 Microchip Technology Inc. Register 22-4: DCISTAT Upper Byte: U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0 — — — — SLOT<3:0> bit 15 bit 8 Lower Byte: U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0 — — — — ROV RFUL TUNF TMPTY bit 7 bit 0 bit 15-12 Reserved: Read as ‘0’ bit 11-8 SLOT<3:0>: DCI Slot Status bits 1111 = Slot #15 is currently active || 0010 = Slot #2 is currently active 0001 = Slot #1 is currently active 0000 = Slot #0 is currently active bit 7-4 Reserved: Read as ‘0’ bit 3 ROV: Receive Overflow Status bit 1 = A receive overflow has occurred for at least one receive register 0 = A receive overflow has not occurred bit 2 RFUL: Receive Buffer Full Status bit 1 = New data is available in the receive registers 0 = The receive registers have old data bit 1 TUNF: Transmit Buffer Underflow Status bit 1 = A transmit underflow has occurred for at least one transmit register 0 = A transmit underflow has not occurred bit 0 TMPTY: Transmit Buffer Empty Status bit 1 = The Transmit registers are empty 0 = The Transmit registers are not empty Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2004 Microchip Technology Inc. DS70069C-page 22-7 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 Register 22-5: RSCON Register 22-6: TSCON Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 bit 7 bit 0 bit 11 RSE<15:0>: Receive Slot Enable bits 1 = CSDI data is received during the individual time slot n 0 = CSDI data is ignored during the individual time slot n Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 bit 7 bit 0 bit 11 TSE<15:0>: Transmit Slot Enable Control bits 1 = Transmit buffer contents are sent during the individual time slot n 0 = CSDO pin is tri-stated or driven to logic ‘0’ during the individual time slot, depending on the state of the CSDOM bit Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70069C-page 22-8 © 2004 Microchip Technology Inc. 22.3 Codec Interface Basics and Terminology The interface protocols supported by the DCI require the use of a Frame Synchronization (FS) signal to initiate a data transfer between two devices. In most cases, the rising edge of FS starts a new data transfer. In any codec application there is, at a minimum, a controller and a codec device. Either device may produce FS. The device that generates FS is the master device. Conceptually, the master device does not have to be the transmitting or receiving device. Various connection examples are shown in Figure 22-1. The frequency of the FS signal is usually the system sampling rate, fs. Figure 22-1: Codec CONNECTION EXAMPLES Note: The details given in this section are not specific to the DCI module. This discussion is intended to provide the user some background and terminology related to the digital serial interface protocols found in most codec devices. Codec SCK FS SDI Controller SDO CSCK COFS CSDO CSDI Codec SCK FS SDI SDO Codec is Master dsPIC® (Controller) CSCK COFS CSDO CSDI Codec SCK FS SDI SDO Controller is Master CSCK COFS CSDO CSDI A/D #1 Daisy-Chained Configuration A/D #2 FSO FS SCK SDO FSO FS SCK SDO CSCK COFS CSDI to Other Devices Codec SCK FS SDI SDO Codec Generates SCK CSCK COFS CSDO CSDI (See Note) External Controller is Master Note: Codec oscillator circuit generates SCK signal. dsPIC® (Controller) dsPIC® (Controller) dsPIC® (Controller) dsPIC® (Controller) © 2004 Microchip Technology Inc. DS70069C-page 22-9 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 All interfaces have a serial transfer clock, SCK. The SCK signal may be generated by any of the connected devices or can be provided externally. In some systems, SCK is also referred to as the bit clock. For codecs that offer high signal fidelity, it is common for the SCK signal to be derived from the crystal oscillator on the codec device. The protocol defines the edge of SCK on which data is sampled. The master device generates the FS signal with respect to SCK. The period of the FS signal delineates one data frame. This period is the same as the data sample period. The number of SCK cycles that occur during the data frame will depend on the type of codec that is selected. The ratio of the SCK frequency to the system sample rate is expressed as a ratio of n, where n is the number of SCK periods per data frame. One advantage of using a framed interface protocol is that multiple data words can be transferred during each sample period, or data frame. Each division of the data frame is referred to as a time slot. The time slots can be used for multiple codec data channels and/or control information. Furthermore, multiple devices can be multiplexed on the same serial data pins. Each slave device is programmed to place its data on the serial data connection during the proper time slot. The output of each slave device is tri-stated at all other times to permit other devices to use the serial bus. Some devices allow the FS signal to be daisy-chained via Frame Synchronization Output (FSO) pins. A typical daisy-chained configuration is shown in Figure 22-1. When the transfer from the first slave device has completed, a FS pulse is sent to the second device in the chain via its FSO pin. This process continues until the last device in the chain has sent its data. The controller (master) device should be programmed for a data frame size that accommodates all of the data words that will be transferred. The timing for a typical data transfer is shown in Figure 22-2. Most protocols begin the data transfer one SCK cycle after the FS signal is detected. This example uses a 16 fs clock and transfers four 4-bit data words per frame. Figure 22-2: FRAMED DATA TRANSFER EXAMPLE The timing for a typical data transfer with daisy-chained devices is shown in Figure 22-3. This example uses a 16 fs SCK frequency and transfers two 8-bit data words per frame. After the FS pulse is detected, the first device in the chain transfers the first 8-bit data word and generates the FSO signal at the end of the transfer. The FSO signal begins the transfer of the second data word from the second device in the chain. Figure 22-3: DAISY-CHAINED DATA TRANSFER EXAMPLE SCK FS SDI or SDO Time Slot 0 Time Slot 1 Data Frame Period (1/fs) FSO SCK FS SDI or SDO Time Slot 0 Time Slot 1 Time Slot 2 Time Slot 3 Data Frame Period (1/fs) dsPIC30F Family Reference Manual DS70069C-page 22-10 © 2004 Microchip Technology Inc. The FS pulse has a minimum active time of one SCK period so the slave device can detect the start of the data frame. The duty cycle of the FS pulse may vary depending on the specific protocol that is used to mark certain boundaries in the data frame. For example, the I2S protocol uses a FS signal that has a 50% duty cycle. The I2S protocol is optimized for the transfer of two data channels (left and right channel audio information). The edges of the FS signal mark the boundaries of the left and right channel data words. The AC-Link protocol uses a FS signal that is high for 16 SCK periods and low for 240 SCK periods. The edges of the AC-Link FS signal mark the boundaries of control information and data in the frame. 22.4 DCI Operation A simplified block diagram of the module is shown in Figure 22-4. The module consists of a Transmit/Receive Shift register that is connected to a small range of memory buffers via a buffer control unit. This arrangement allows the DCI to support various codec serial protocols. The DCI Shift register is 16-bits wide. Data is transmitted and received by the DCI MSbit first. Figure 22-4: DCI Module Block Diagram Note: Refer to Section 26. “Appendix” of this manual for additional information on codec communication protocols. Clock Generator CSCK Frame Generator TCY COFS 16-bit Data Bus DCI Shift Register CSDI Buffer Control WS<3:0> COFSG<3:0> COFSM<1:0> COFSD CSCKD CSDO 15 0 Receive Registers w/ Buffer Transmit Registers w/ Buffer BCG<11:0> Synchronization © 2004 Microchip Technology Inc. DS70069C-page 22-11 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.4.1 DCI Pins There are four I/O pins associated with the DCI. The DCI, when enabled, controls the data direction of each of the four pins. 22.4.1.1 CSCK Pin The CSCK pin provides the serial clock connection for the DCI. The CSCK pin may be configured as an input or output using the CSCKD control bit, DCICON1<10>. When the CSCK pin is configured as an output (CSCKD = 0), the serial clock is derived from the dsPIC30F system clock source and supplied to external devices by the DCI. When the CSCK pin is configured as an input (CSCKD = 1), the serial clock must be provided by an external device. 22.4.1.2 CSDO Pin The Serial Data Output (CSDO) pin is configured as an output only pin when the module is enabled. The CSDO pin drives the serial bus whenever data is to be transmitted. The CSDO pin can be tri-stated or driven to ‘0’ during serial clock periods when data is not transmitted, depending on the state of the CSDOM control bit (DCICON1<6>). The tri-state option allows other devices to be multiplexed onto the CSDO connection. 22.4.1.3 CSDI Pin The serial data input (CSDI) pin is configured as an input only pin when the module is enabled. 22.4.1.4 COFS Pin The frame synchronization (COFS) pin is used to synchronize data transfers that occur on the CSDO and CSDI pins. The COFS pin may be configured as an input or an output. The data direction for the COFS pin is determined by the COFSD control bit (DCICON1<8>). When the COFSD bit is cleared, the COFS pin is an output. The DCI module will generate frame synchronization pulses to initiate a data transfer. The DCI is the master device for this configuration. When the COFSD bit is set, the COFS pin becomes an input. Incoming synchronization signals to the module will initiate data transfers. The DCI is a slave device when the COFSD control bit is set. 22.4.2 Module Enable The DCI module is enabled or disabled by setting/clearing the DCIEN control bit (DCICON1<15>). Clearing the DCIEN control bit has the effect of resetting the module. In particular, all counters associated with serial clock generation, frame sync, and the buffer control logic are reset (see Section 22.5.1.1 “DCI Start-up and Data Buffering” and Section 22.5.1.2 “DCI Disable” for additional information). When enabled, the DCI controls the data direction for the CSCK, CSDI, CSDO and COFS I/O pins associated with the module. The PORT, LAT, and TRIS register values for these I/O pins are overridden by the DCI module when the DCIEN bit is set. It is also possible to override the CSCK pin separately when the bit clock generator is enabled. This permits the bit clock generator to be operated without enabling the rest of the DCI module. dsPIC30F Family Reference Manual DS70069C-page 22-12 © 2004 Microchip Technology Inc. 22.4.3 Bit Clock Generator The DCI module has a dedicated 12-bit time base that produces the bit clock. The bit clock rate (period) is set by writing a non-zero 12-bit value to the BCG<11:0> control bits (DCICON3<11:0>). When the BCG<11:0> bits are set to zero, the bit clock will be disabled. When the CSCK pin is controlled by the DCI module, the corresponding PORT, LAT and TRIS Control register values for the CSCK pin will be overridden and the data direction for the CSCK pin will be controlled by the CSCKD control bit (DCICON1<10>). If the serial clock for the DCI is to be provided by an external device, the BCG<11:0> bits should be set to ‘0’ and the CSCKD bit set to ‘1’. If the serial clock is to be generated by the DCI module, the BCG<11:0> control bits should be set to a non-zero value (see Equation 22-1) and the CSCKD control bit should be set to zero. The formula for the bit clock frequency is given in Equation 22-1. Equation 22-1: DCI Bit Clock Generator Value The required bit clock frequency will be determined by the system sampling rate and frame size. Typical bit clock frequencies range from 16x to 512x the converter sample rate, depending on the data converter and the communication protocol that is used. 22.4.4 Sample Clock Edge Selection The CSCKE control bit (DCICON1<9>) determines the sampling edge for the serial clock signal. If the CSCKE bit is cleared (default), data will be sampled on the falling edge of the CSCK signal. The AC-Link protocols and most multi-channel formats require that data be sampled on the falling edge of the CSCK signal. If the CSCKE bit is set, data will be sampled on the rising edge of CSCK. The I2S protocol requires that data be sampled on the rising edge of the serial clock signal. 22.4.5 Frame Sync Mode Control Bits The type of interface protocol supported by the DCI is selected using the COFSM<1:0> control bits (DCICON1<1:0>). The following Operating modes can be selected: • Multi-channel Mode • I2S Mode • AC-Link Mode (16-bit) • AC-Link Mode (20-bit) Specific information for each of the protocols is provided in subsequent sections. 22.4.6 Word-Size Selection Bits The WS<3:0> word-size selection bits (DCICON2<3:0>) determine the number of bits in each DCI data word. Any data length from 4 to 16 bits may be selected. Note: The CSCK I/O pin will be controlled by the DCI module if the DCIEN bit is set OR the bit clock generator is enabled by writing a non-zero value to BCG<11:0>. This allows the bit clock generator to be operated independently of the DCI module. BCG<11:0> = fCY 2 fCSCK – 1 Note: The BCG<11:0> bits have no effect on the operation of the DCI module when the CSCK signal is provided externally (CSCKD = 1). Note: The WS control bits are used only in the multi-channel and I2S modes. These bits have no effect in AC-Link mode since the data slot sizes are fixed by the protocol. © 2004 Microchip Technology Inc. DS70069C-page 22-13 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.4.7 Frame Synchronization Generator The Frame Sync Generator (FSG) is a 4-bit counter that sets the frame length in data words. The period for the FSG is set by writing the COFSG<3:0> control bits (DCICON2<8:5>). The FSG period (in serial clock cycles) is determined by the following formula: Equation 22-2: Frame Length, In CSCK Cycles Frame lengths up to 16 data words may be selected. The frame length in serial clock periods will vary up to a maximum of 256 depending on the word size that is selected. 22.4.8 Transmit and Receive Registers The DCI has four Transmit registers, TXBUF0...TXBUF3, and four Receive registers, RXBUF0..RXBUF3. All of the Transmit and Receive registers are memory mapped. 22.4.8.1 Buffer Data Alignment Data values are always stored left-justified in the DCI registers, since audio PCM data is represented as a signed 2’s complement fractional number. If the programmed DCI word size is less than 16 bits, the unused LSbs in the Receive registers are set to ‘0’ by the module. Also, the unused LSbs in the Transmit register are ignored by the module. 22.4.8.2 Transmit and Receive Buffers The Transmit and Receive registers each have a set of buffers that are not accessible by the user. Effectively, each transmit and receive buffer location is double-buffered. The DCI transmits data from the transmit buffers and writes received data to the receive buffers. The buffers allow the user to read and write the RXBUF and TXBUF registers, while the DCI uses data from the buffers. 22.4.9 DCI Buffer Control Unit The DCI module contains a buffer control unit that transfers data between the buffer memory and the Serial Shift register. The buffer control unit also transfers data between the buffer memory and the TXBUF and RXBUF registers. The buffer control unit allows the DCI to queue the transmission and reception of multiple data words without CPU overhead. The DCI generates an interrupt each time a transfer between the buffer memory and the TXBUF and RXBUF registers takes place. The number of data words buffered between interrupts is determined by the BLEN<1:0> control bits (DCICON2<11:10>). The size of the transmit and receive buffering may be varied from 1 to 4 data words using the BLEN<1:0> bits. Each time a data transfer takes place between the DCI Shift register and the buffer memory, the DCI buffer control unit is incremented to point to the next buffer location. If the number of transmitted or received data words is equal to the BLEN value + 1, the following will occur: • The buffer control unit is reset to point to the first buffer location • The received data held in the buffer is transferred to the RXBUF registers • The data in the TXBUF registers is transferred to the buffer • A CPU interrupt is generated The DCI buffer control unit will also reset the buffer pointer to the first buffer location each time a frame boundary is reached. This action ensures alignment between the buffer locations and the enabled time slots in the data frame. The DCI buffer control unit always accesses the same relative location in the Transmit and Receive buffers. If the DCI is transmitting data from TXBUF3, for example, then any data received during that time slot will be written to RXBUF3. FrameLength = (WS<3:0> + 1) • (COFSG<3:0> + 1) Note: The COFSG control bits will have no effect in AC-Link mode, since the frame length is set to 256 serial clock periods by the protocol. dsPIC30F Family Reference Manual DS70069C-page 22-14 © 2004 Microchip Technology Inc. Figure 22-5: DCI Buffer Control Unit 22.4.10 Transmit Slot Enable Bits The TSCON SFR has control bits that are used to enable up to 16 time slots for transmission. These control bits are the TSE<15:0> bits. The size of each time slot is determined by the WS<3:0> word size selection bits and can vary up to 16 bits. If a transmit time slot is enabled via one of the TSE bits (TSEx = 1), the contents of the current transmit buffer location will be loaded into the CSDO Shift register and the DCI buffer control unit will increment to point to the next buffer location. Not all TSE control bits will have an effect on the module operation if the selected frame size has less than 16 data slots. The Most Significant TSE control bits are not used. For example, if COFSG<3:0> = 0111 (8 data slots per frame), TSE8 through TSE15 will have no effect on the DCI operation. 22.4.10.1 CSDO Mode Control During disabled transmit time slots, the CSDO pin can drive ‘0’s or can be tri-stated, depending on the state of the CSDOM bit (DCICON1<6>). A given transmit time slot is disabled if its corresponding TSEx bit is cleared in the TSCON register. If the CSDOM bit is cleared (default), the CSDO pin will drive ‘0’s onto the CSDO pin during disabled time slot periods. This mode is used when there are only two devices (1 master and 1 slave) attached to the serial bus. If the CSDOM bit is set, the CSDO pin will be tri-stated during unused time slot periods. This mode allows multiple dsPIC30F devices to share the same CSDO line in a multiplexed application. Each device on the CSDO line is configured so that it will only transmit data during specific time slots. No two devices should transmit data during the same time slot. Transmit Registers Transmit Buffer Buffer Transfer Signal Receive Registers Receive Buffer BLEN Buffer Control Receive Buffer Select Transmit Buffer Select DCI RXBUF0 RXBUF1 RXBUF2 RXBUF3 TXBUF0 TXBUF1 TXBUF2 TXBUF3 4 4 2 4 4 Shift Register © 2004 Microchip Technology Inc. DS70069C-page 22-15 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.4.11 Receive Slot Enable Bits The RSCON SFR contains control bits (RSE<15:0>) that are used to enable up to 16 time slots for reception. The size of each receive time slot is determined by the WS<3:0> control bits and can vary from 4 to 16 bits. If a receive time slot is enabled via one of the RSE bits (RSEx = 1), the Shift register contents will be written to the current DCI receive buffer location and the buffer control logic will advance to the next available buffer location. Data is not packed in the receive memory buffer locations if the selected word size is less than 16 bits. Each received slot data word is stored in a seperate 16-bit buffer location. Data is always stored in a left-justified format in the receive memory buffer. 22.4.12 TSCON and RSCON Operation with Buffer Control Unit The slot enable bits in the TSCON and RSCON registers function independently, with the exception of the buffer control logic. For each time slot in a data frame, the buffer location is advanced if either the TSEx or the RSEx bit is set for the current time slot. That is, the buffer control unit synchronizes the Transmit and Receive buffering so that the Transmit and Receive buffer location will always be the same for each time slot in the data frame. If the TSEx bit and the RSEx bit are both set for every time slot that is used in the data frame, the DCI will Transmit and Receive equal amounts of data . In some applications, the number of data words transmitted during a frame may not equal the number of words received. As an example, assume that the DCI is configured for a 2-word data frame, TSCON = 0x0001 and RSCON = 0x0003. This configuration would allow the DCI to transmit one data word per frame and receive two data words per frame. Since two data words are received for each data word that is transmitted, the user would write every other transmit buffer location. Specifically, only TXBUF0 and TXBUF2 would be used to transmit data. Figure 22-6: DCI Buffer Operation: TSCON = 0x0001, RSCON = 0x0003, BLEN<1:0> = 11b 22.4.13 Receive Status Bits There are two receive status bits, RFUL and ROV. The receive status bits only indicate status for register locations that are enabled for use by the module. This is a function of the BLEN<1:0> control bits. If the buffer length is set to less than four words, the unused buffer locations will not affect the receive status bits. The RFUL status bit (DCISTAT<2>) is read only and indicates that new data is available in the Receive registers. The RFUL bit is cleared automatically when all RXBUF registers in use have been read by the user software. The ROV status bit (DCISTAT<3>) is read only and indicates that a receive overflow has occurred for at least one of the Receive register locations. A receive overflow occurs when the RXBUF register location is not read by the user software before new data is transferred from the buffer memory. When a receive overflow occurs, the old contents of the register are overwritten. The ROV status bit is cleared automatically when the register that caused the overflow is read. Transmit Registers TXBUF0 TXBUF1 TXBUF2 TXBUF3 Receive Registers RXBUF0 RXBUF1 RXBUF2 RXBUF3 Note: User writes to TXBUF0 and TXBUF2. TXBUF1 and TXBUF3 not used by transmit logic. Data Word #1 Data Word #2 Data Word #1 Data Word #2 Data Word #3 Data Word #4 dsPIC30F Family Reference Manual DS70069C-page 22-16 © 2004 Microchip Technology Inc. 22.4.14 Transmit Status Bits There are two transmit status bits, TMPTY and TUNF. The transmit status bits only indicate status for register locations that are used by the module. If the buffer length is set to less than four words, for example, the unused register locations will not affect the transmit status bits. The TMPTY bit (DCISTAT<0>) is read only and is set when the contents of the active TXBUF registers are transferred to the Transmit Buffer registers. The TMPTY bit may be polled in software to determine when the Transmit registers may be written. The TMPTY bit is cleared automatically by the hardware when a write to any of the TXBUF registers in use occurs. The TUNF bit (DCISTAT<1>) is read only and indicates that a transmit underflow has occurred for at least one of the Transmit registers that is in use. The TUNF bit is set when the TXBUF register contents are transferred to the transmit buffer memory and the user did not write all of the TXBUF registers in use since the last buffer transfer. The TUNF status bit is cleared automatically when the TXBUF register that underflowed is written by the user software. 22.4.15 SLOT Status Bits The SLOT<3:0> status bits (DCISTAT<11:7>) indicate the current active time slot in the data frame and are useful when more than four words per data frame need to be transferred. The user may poll these status bits in software when a DCI interrupt occurs to determine what time slot data was last received and which time slot data should be loaded into the TXBUF registers. 22.4.16 Digital Loopback Mode Digital Loopback mode is enabled by setting the DLOOP control bit (DCICON1<11>). When the DLOOP bit is set, the module internally connects the CSDO signal to CSDI. The actual data input on the CSDI pin will be ignored in Digital Loopback mode. 22.4.17 Underflow Mode Control Bit When a transmit underflow occurs, one of two actions may occur depending on the state of the UNFM control bit (DCICON1<7>). If the UNFM bit is cleared (default), the module will transmit ‘0’s on the CSDO pin during the active time slot for the buffer location. In this Operating mode, the codec device attached to the DCI module will simply be fed digital ‘silence’. If the UNFM control bit is set, the module will transmit the last data written to the buffer location. This Operating mode permits the user to send a continuous data value to the codec device without consuming software overhead. 22.4.18 Data Justification Control In most applications, the data transfer begins one serial clock cycle after the FS signal is sampled active. This is the DCI module default. An alternate data alignment can be selected by setting the DJST control bit (DCICON2<5>). When DJST = 1, data transfers will begin during the same serial clock cycle as the FS signal. 22.4.19 DCI Module Interrupts The frequency of DCI module interrupts is dependent on the number of active time slots (TSCON and RSCON registers), length of the data frame (WS and COFSG control bits), and the BLEN control bits. An interrupt is generated at the following times: • When the buffer length has been reached • When a frame boundary is reached A buffer memory transfer takes place each time the above events occur. A buffer memory transfer is defined as the time when the previously written TXBUF values are transferred to the transmit buffer memory and new received values in the receive buffer memory are transferred into the RXBUF registers. © 2004 Microchip Technology Inc. DS70069C-page 22-17 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.5 Using the DCI Module This section explains how to configure and use the DCI with specific kinds of data converters. 22.5.1 How to Transmit and Receive Data Using the DCI Buffers, Status Bits and Interrupts The DCI can buffer up to four data words between CPU interrupts depending on the setting of the BLEN control bits. The buffered data can be transmitted and received in a single data frame, or across multiple data frames, depending on the TSCON and RSCON register settings. For example, assume BLEN<1:0> = 00b ( buffer one data word per interrupt) and TSCON = RSCON = 0x0001. This particular configuration represents the most basic setup and would cause the DCI to transmit/receive one data word at the beginning of every data frame. The CPU would be interrupted after every data word transmitted/received since BLEN<1:0> = 00b. For a second configuration example, assume BLEN<1:0> = 11b (buffer four data words per interrupt) and TSCON = RSCON = 0x0001. This configuration would cause the DCI to transmit/receive one data word at the beginning of every data frame, but a CPU interrupt would be generated after four data words were transmitted/received. This configuration would be useful for block processing, where multiple data samples are processed at once. For a third configuration example, assume BLEN<1:0> = 11b (buffer four data words per interrupt) and TSCON = RSCON = 0x000F. This configuration would cause the DCI to transmit/receive four data words at the beginning of every data frame. A CPU interrupt would be generated every data frame in this case because the DCI was setup to buffer four data words in a data frame. This configuration represents a typical multi-channel buffering setup. The DCI can also be configured to buffer more than four data words per frame. For example, assume BLEN<1:0> = 11b (buffer four data words per interrupt) and TSCON = RSCON = 0x00FF. In this configuration, the DCI will transmit/receive 8 data words per data frame. An interrupt will be generated twice per data frame. To determine which portion of the data is in the Transmit/Receive registers at each interrupt, the user will need to check the SLOT status bits (DCISTAT <11:7>) in the Interrupt Service Routine to determine the current data frame position. The Transmit and Receive registers are double-buffered, so the DCI module can work on one set of Transmit and Receive data while the user software is manipulating the other set of data. Because of the double-buffers, it will take three interrupt periods to receive the data, process that data, and transmit the processed data. For each DCI interrupt, the CPU will process a data word that was received during a prior interrupt period and generate a data word that will be transmitted during the next interrupt period. The buffering and data processing time of the dsPIC device will insert a two-interrupt period delay into the processed data. This data delay is negligible, in most cases. The DCI status flags and CPU interrupt indicate that a buffer transfer has taken place and that it is time for the CPU to process more data. In a typical application, the following steps will occur each time the DCI data is processed: 1. The RXBUF registers are read by the user software. The RFUL status bit (DCISTAT<2>) will have been set by the module to indicate the Receive registers contain new data. The RFUL bit is cleared automatically after all the active Receive registers have been read. 2. The user software will process the received data. 3. The processed data is written to the TXBUF registers. The TMPTY status bit (DCISTAT<0>) will have been previously set to indicate that the Transmit registers are ready for more data to be written. For applications that are configured to Transmit and Receive data (TSCON and RSCON are non-zero), the RFUL and TMPTY status bits can be polled in user software to determine when a DCI buffer transfer takes place. If the DCI is only used to transmit data (RSCON = 0), then the TMPTY bit can be polled to indicate a buffer transfer. If the DCI is configured to only receive data (TSCON = 0), then the RFUL bit can be polled to indicate a buffer transfer. The DCIIF status bit (IFS2<9>) is set each time a DCI buffer transfer takes place and generates a CPU interrupt, if enabled. The DCIIF status bit is generated by the logical ORing of the RFUL and TMPTY status bits. dsPIC30F Family Reference Manual DS70069C-page 22-18 © 2004 Microchip Technology Inc. 22.5.1.1 DCI Start-up and Data Buffering Data transfers are begun by setting the DCIEN control bit (DCICON1<15>). Prior to this, the DCI Control registers should have been initialized for the desired operating mode. (See Section 22.5.4 “Multi-Channel Operation”, Section 22.5.5 “I2S Operation”, and Section 22.5.6 “AC-Link Operation”) A timing diagram for DCI startup is shown in Figure 22-7. In this example, the DCI is configured for an 8-bit data word (WS<3:0> = 0111b) and an 8-bit data frame (COFSG<3:0> = 0000b). The Multi-Channel mode (COFSM<1:0> = 00b) is used. The steps required to transmit and receive data are described below. 1. The TXBUF registers should be pre-loaded with the first data to be transmitted before the module is enabled. If the transmit data will be based on data received from the codec, then the user can simply clear the TXBUF registers. This will transmit digital ‘silence’ until data is first received into the RXBUF registers from the codec. 2. Enable the DCI module by setting the DCIEN bit (DCICON1<15>). If the DCI is the master device, the data in the TXBUF registers will be transferred to the transmit buffers and transmission of the first data frame will commence. Otherwise, the TXBUF data will be held in the transmit buffers until a frame sync signal is received from the master device. 3. The TMPTY bit will be set immediately after the module is enabled and a DCI interrupt will be generated, if enabled. At this time, the module is ready for the TXBUF registers to be reloaded with data to be transferred on the second data frame. No data has been received by the module at this time, so the TXBUF registers should be cleared again if the transmitted data is calculated from the received data. The DCIIF status bit should be cleared by the user in software if interrupts are enabled. 4. After the first data frame is transferred, the TMPTY bit will set, the RFUL status bit will be set, and a DCI interrupt will occur, if enabled. This is the first data word received from the device connected to the DCI. 5. The user reads the Receive register(s), automatically clearing the RFUL status bit. The user software processes the received data at this time. 6. The Transmit register(s) is written with data to be transmitted during the next data frame. The TMPTY status bit is cleared automatically when the write occurs. The write data may be calculated from data that was received at the prior interrupt. 7. The next DCI interrupt occurs and the cycle repeats. Figure 22-7: DCI Start-up and Data Buffering Example 7 CSCK Data RFUL 6543210 7 6543210 7 6 TMPTY DCIEN COFS RXBUF RX Word 1 TXBUF TX Word 1 TX Word 2 TX Word 3 1 2 3 4 5 6 DCIIF 7 Word 1 Word 2 Cleared by User © 2004 Microchip Technology Inc. DS70069C-page 22-19 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.5.1.2 DCI Disable The DCI module is disabled by clearing the DCIEN control bit (DCICON1<15>). When the DCIEN bit is cleared, the module will finish the current data frame transfer that is in progress. An interrupt will be generated if the transmit/receive buffers need to be written/read before the end of the frame. The DCIEN bit must be cleared at least 3 CSCK cycles before the end of the frame disables the module at that frame. If not, the module will disable on the next frame. The DCI will not generate any further frame sync pulses after the DCIEN bit is cleared, nor will it respond to an incoming frame sync pulse. When the frame sync generator has reached the final time slot in the data frame, all state machines associated with the DCI will be reset to their Idle state and control of the I/O pins associated with the module will be released. The user may poll the SLOT<3:0> status bits (DCISTAT<11:7>) after the DCIEN bit is cleared to determine when the module is Idle. The DCI is Idle when SLOT<3:0> = 0000b and DCIEN = 0. When the module enters the Idle state, any data in the Receive Shadow registers will be transferred to the RXBUF registers, and the RFUL and ROV status bits will be affected accordingly. Figure 22-8: DCI Timing, Module Disable 3 CSCK Data 2 1 0 3 210 3 210 3 2 1 0 DCIEN COFS 3 2 1 0 SLOT 0011 0000 0001 0010 0011 0000 RFUL WS = 0011b COFSG = 0011b FS pulse not generated. Receive buffer contents transferred to RXBUF. dsPIC30F Family Reference Manual DS70069C-page 22-20 © 2004 Microchip Technology Inc. 22.5.2 Master vs. Slave Operation The DCI can be configured for master or slave operation. The master device generates the frame sync signal to initiate a data transfer. The Operating mode (master or slave) is selected by the COFSD control bit (DCICON1<8>). When the DCI module is operating as a master device (COFSD = 0), the COFSM mode bits determine the type of frame sync pulse that is generated by the frame sync generator logic. A new frame synchronization signal is generated when the frame sync generator resets and is output on the COFS pin. When the DCI module is operating as a frame sync slave (COFSD = 1), data transfers are controlled by the device attached to the DCI module. The COFSM control bits control how the DCI module responds to incoming FS signals. In the Multi-Channel mode, a new data frame transfer will begin one serial clock cycle after the COFS pin is sampled high. The pulse on the COFS pin resets the frame sync generator logic. In the I2S mode, a new data word will be transferred one serial clock cycle after a low-to-high or a high-to-low transition is sampled on the COFS pin. A rising or falling edge on the COFS pin resets the frame sync generator logic. In the AC-Link mode, the tag slot and subsequent data slots for the next frame will be transferred one serial clock cycle after the COFS pin is sampled high. The COFSG and WS bits must be configured to provide the expected frame length when the module is operating in the Slave mode. Once a valid frame sync pulse has been sampled by the module on the COFS pin, an entire data frame transfer will take place. The module will not respond to further frame sync pulses until the current data frame transfer has fully completed. 22.5.3 Data Packing for Long Data Word Support Many codecs have data word lengths in excess of 16 bits. The DCI natively supports word lengths up to 16 bits, but longer word lengths can be supported by enabling multiple Transmit and Receive slots and packing data into multiple transmit and receive buffer locations. For example, assume that a particular codec transmits/receives 24-bit data words. This data could be transmitted and received by setting BLEN<1:0> = 01b (two data words per interrupt) and setting TSCON = RSCON = 0x0003. This will enable transmission and reception during the first two time slots of the data frame. The 16 MSbs of the transmit data are written to TXBUF0. The 8 LSbs of the transmit data are written left-justified to TXBUF1 as shown in Figure 22-9. The 8 LSbs of TXBUF1 can be written to ‘0’. The 24-bit data received from the codec will be loaded into RXBUF0 and RXBUF1 with the same format as the transmit data. Any combination of word size and enabled time slots may be used to transmit and receive long data words in multiple Transmit and Receive registers. For example, the 24 bit data word example shown in Figure 22-9 could be transmitted/received in three consecutive registers by setting WS<3:0> = 0111 (word size = 8 bits), BLEN<1:0> = 10 (buffer three words between interrupts), and TSCON = RSCON = 0x0007 (transmit/receive during the first three time slots of the data frame). Each Transmit and Receive register would contain 8 bits of the data word. Figure 22-9: Data Packing Example for Long Data Words Transmit Registers TXBUF0 TXBUF1 TXBUF2 TXBUF3 Data Word bits 24:8 bits 7:0 0 0000000 TSCON = RSCON = 0x0003 BLEN<1:0> = 01b © 2004 Microchip Technology Inc. DS70069C-page 22-21 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.5.4 Multi-Channel Operation The Multi-Channel mode (COFSM<1:0> = 00) is used for codecs that require a frame sync pulse that is driven high for one serial clock period to initiate a data transfer. One or more data words can be transferred in the data frame. The number of clock cycles between successive frame sync pulses will depend on the device connected to the DCI module. A timing diagram for the frame sync signal in Multi-Channel mode is shown in Figure 22-10. A timing example, indicating a four-word data transfer is also shown in Figure 22-2. Figure 22-10: Frame Sync Timing, Multi-Channel Mode 22.5.4.1 Multi-Channel Setup Details The steps required to configure the DCI for a codec using the Multi-Channel mode are provided in this section. This Operating mode can be used for codecs with one or more data channels. The setup is similar regardless of the number of channels. For this setup example, a hypothetical codec will be considered. The single channel codec used for this setup example will use a 256 fs serial clock frequency with a 16-bit data word transmitted at the beginning of each frame. The steps required for setup and operation are described below. 1. Determine the sample rate and data word size required by the codec. An 8 kHz sampling rate is assumed for this example. 2. Determine the serial transfer clock frequency required by the codec. Most codecs require a serial clock signal that is some multiple of the sampling frequency. The example codec requires a frequency that is 256 fs, or 1.024 MHz. Therefore, a frame sync pulse must be generated every 256 serial clock cycles to start a data transfer. 3. The DCI must be configured for the serial transfer clock. If the CSCK signal will be generated by the DCI, clear the CSCKD control bit (DCICON1<10>) and write a value to DCICON3 that will produce the correct clock frequency (See Section 22.4.3 “Bit Clock Generator”). If the CSCK signal is generated by the codec or other external source, set the CSCKD control bit and clear the DCICON3 register. 4. Clear the COFSM<1:0> control bits (DCICON1<1:0>) to set the frame synchronization signal to Multi-Channel mode. 5. If the DCI will generate the frame sync signal (master), then clear the COFSD control bit (DCICON1<8>). If the DCI will receive the frame sync signal (slave), then set the COFSD control bit. 6. Clear the CSCKE control bit (DCICON1<9>) to sample incoming data on the falling edge of CSCK. This is the typical configuration for most codecs. Refer to the codec data sheet to ensure the correct sampling edge is used. 7. Write the WS<3:0> control bits (DCICON2<3:0>) for the desired data word size. The example codec requires WS<3:0> = 1111b for a 16-bit data word size. CSCK Data COFS MSB LSB Frame Synch Sampled Here First Data Bit Sampled Here dsPIC30F Family Reference Manual DS70069C-page 22-22 © 2004 Microchip Technology Inc. 8. Write the COFSG<3:0> control bits (DCICON2<8:5>) for the desired number of data words per frame. The WS and COFSG control bits will determine the length of the data frame in CSCK cycles (see Section 22.4.7 “Frame Synchronization Generator”) COFSG<3:0> = 1111b is used for this codec to provide the 256-bit data frame required by the example codec. 9. Set the Output mode for the CSDO pin using the CSDOM control bit (DCICON1<6>). If a single device is attached to the DCI, CSDOM can be cleared. This will force the CSDO pin to ‘0’ during unused data time slots. You may need to set CSDOM if multiple devices are attached to the CSDO pin. 10. Write the TSCON and RSCON registers to determine which data time slots in the frame are to be transmitted and received, respectively. For this single channel codec, use TSCON = RSCON = 0x0001 to enable transmission and reception during the first 16-bit time slot of the data frame. 11. Set the BLEN control bits (DCICON2<11:10>) to buffer the desired amount of data words. For the single channel codec, BLEN = 00 will provide an interrupt at each data frame. A higher value of BLEN could be used for this codec to buffer multiple samples between interrupts. 12. If interrupts are to be used, clear the DCIIF status bit (IFS2<9>) and set the DCIIE control bit (IEC2<9>). 13. Begin operation as described in Section 22.5.1.1 “DCI Start-up and Data Buffering”. 22.5.5 I2S Operation The I2S Operating mode is used for codecs that require a frame sync signal that has a 50% duty cycle. The period of the I2S frame sync signal in serial clock cycles is determined by the word size of the codec that is connected to the DCI module. The start of a new word boundary is marked by a high-to-low or a low-to-high transition edge on the COFS pin as shown in Figure 22-11. I2S codecs are generally stereo or two-channel devices, with one data word transferred during the low time of the frame sync signal and the other data word transmitted during the high time. Figure 22-11: I2S Interface Frame Sync Timing The DCI module is configured for I2S mode by writing a value of 01h to the COFSM<1:0> control bits in the DCICON1 SFR. When operating in the I2S mode, the DCI module will generate frame synchronization signals with a 50% duty cycle. Each edge of the frame synchronization signal marks the boundary of a new data word transfer. Refer to the Appendix of this manual for more information about the I2S protocol. The user must also select the frame length and data word size using the COFSG and WS control bits in the DCICON2 SFR. Note: A 5-bit transfer is shown here for illustration purposes. The I2S protocol does not specify word length, this will be system dependent. MSB LSB MSB LSB CSCK Data COFS Frame Synch Edge Sampled First Data Bit Sampled © 2004 Microchip Technology Inc. DS70069C-page 22-23 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.5.5.1 I2S Setup Details The steps required to configure the DCI for an I2S codec are provided in this section. For this setup example, a hypothetical I2S codec will be considered. The I2S codec in this setup example will use a 64 fs serial clock frequency, with two 16 bit data words during the data frame. Therefore, the frame length will be 64 CSCK cycles, with the COFS signal high for 32 cycles and low for 32 cycles. The first data word will be transmitted one CSCK cycle after the falling edge of COFS, and the second data word will be transmitted one CSCK cycle after the rising edge of COFS as shown in Figure 22-11. 1. Determine the sample rate used by the codec to determine the CSCK frequency. It is assumed in this example that fs is 48 kHz. 2. Determine the serial transfer clock frequency required by the codec. The example codec requires a frequency that is 64 fs, or 3.072 MHz. 3. The DCI must be configured for the serial transfer clock. If the CSCK signal will be generated by the DCI, clear the CSCKD control bit (DCICON1<10>) and write a value to DCICON3 that will produce the correct clock frequency (see Section 22.4.3 “Bit Clock Generator”). If the CSCK signal is generated by the codec or other external source, set the CSCKD control bit and clear the DCICON3 register. 4. Next, set COFSM<1:0> = 01b to set the frame synchronization signal to I2S mode. 5. If the DCI will generate the frame sync signal (master), then clear the COFSD control bit (DCICON1<8>). If the DCI will receive the frame sync signal (slave), then set the COFSD control bit. 6. Set the CSCKE control bit (DCICON1<9>) to sample incoming data on the rising edge of CSCK. This is the typical configuration for most I2S codecs. 7. Write the WS<3:0> control bits (DCICON2<3:0>) for the desired data word size. For the example codec, use WS<3:0> = 1111b for a 16-bit data word size. 8. Write the COFSG<3:0> control bits (DCICON2<8:5) for the desired number of data words per frame. The WS and COFSG control bits will determine the length of the data frame in CSCK cycles (see Section 22.4.7 “Frame Synchronization Generator”). For this example codec, set COFSG<3:0> = 0001b. 9. Set the Output mode for the CSDO pin using the CSDOM control bit (DCICON1<6>). If a single device is attached to the DCI, CSDOM can be cleared. You may need to set CSDOM if multiple devices are attached to the CSDO pin. 10. Write the TSCON and RSCON registers to determine which data time slots in the frame are to be transmitted and received, respectively. For this codec, set TSCON = 0x0001 and RSCON = 0x0001 to enable transmission and reception during the first 16-bit time slot of the 32-bit data frame. Adjacent time slots can be enabled to buffer data words longer than 16 bits. 11. Set the BLEN<1:0> control bits (DCICON2<11:10>) to buffer the desired amount of data words. For a two-channel I2S codec, BLEN<1:0> = 01b will generate an interrupt after transferring two data words. 12. If interrupts are to be used, clear the DCIIF status bit (IFS2<9>) and set the DCIIE control bit (IEC2<9>). 13. Begin operation as described in Section 22.5.1.1 “DCI Start-up and Data Buffering”. In the I2S Master mode, the COFS pin will be driven high after the module is enabled and begin transmitting the data loaded in TXBUF0. Note: In the I2S mode, the COFSG bits are set to the length of 1/2 of the data frame. For this example codec, set COFSG<3:0> = 0001b (two data words per frame) to produce a 32-bit frame. This will produce an I2S data frame that is 64 bits in length. dsPIC30F Family Reference Manual DS70069C-page 22-24 © 2004 Microchip Technology Inc. 22.5.5.2 How to Determine the I2S Channel Alignment Most I2S codecs support two channels of data and the level of the frame sync signal indicates the channel that is transferred during that half of the data frame. The COFS pin can be polled in software using its associated Port register to determine the present level on the pin in the DCI Interrupt Service Routine. This will indicate which data is in the Receive register and which data should be written to the Transmit registers for transfer on the next frame. 22.5.5.3 I2S Data Justification As per the I2S specification, a data word transfer will by default begin one serial clock cycle following a transition of the frame sync signal. An ‘MSb left-justified’ option can be selected using the DJST control bit (DCICON1<5>). If DJST = 1, the I2S data transfers will be MSb left justified. The MSb of the data word will be presented on the CSDO pin during the same serial clock cycle as the rising or falling edge of the FS signal. After the data word has been transmitted, the state of the CSDO pin is dictated by the CSDOM (DCICON1<6>) bit. The left-justified data option allows two stereo codecs to be connected to the same serial bus. Many I2S compatible devices have configuration options for left-justified or right-justified data. The word size selection bits are set to twice the codec word length and data is read/written to the DCI memory in a packed format. The connection details for a dual I2S codec system are shown in Figure 22-12. Timing diagrams for I2S mode are shown in Figure 22-13. For reference, these diagrams assume an 8-bit word size (WS<3:0> = 0111b). Two data words per frame would be required to achieve a 16-bit sub-frame (COFSG<3:0> = 0001b). The 3rd timing diagram in Figure 22-13 uses packed data to read/write from two codecs. For this example, the DCI module is configured for a 16-bit data word (WS<3:0> = 1111b). Two packed 8-bit words are written to each 16-bit location in the DCI memory buffer. Figure 22-12: Dual I2S Codec Interface dsPIC® Codec #1 SCK FS SDO SCK WS SDI Codec #2 SCK WS SDI Device I 2C™/SPI™ I 2C™/SPI™ © 2004 Microchip Technology Inc. DS70069C-page 22-25 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 Figure 22-13: I2S Data Justification Options 22.5.6 AC-Link Operation This section describes how to use the DCI in the AC-Link modes. The AC-Link modes are used to communicate with AC-’97 compliant codec devices. 22.5.6.1 AC-Link Data Frame The AC-Link data frame is 256 bits subdivided into one 16-bit control slot, followed by twelve 20-bit data slots. The AC-’97 codec usually provides the serial transfer clock signal which is derived from a crystal oscillator as shown in Figure 22-14. The controller receives the serial clock and generates the frame sync signal. The default data frame rate is 48 kHz. The frame sync signal used for AC-Link systems is high for 16 CSCK periods at the beginning of the data frame and low for 240 CSCK periods. The data transfer begins one CSCK period after the rising edge of the frame sync signal as shown in Figure 22-16. Data is sampled by the receiving device on the falling edge of CSCK. The control and data time slots in the AC-Link have defined uses in the protocol as shown in Figure 22-15. Refer to the Appendix of this manual or the Intel® AC ‘97 Codec Specification, Rev 2.2 for a complete definition of the AC-Link protocol. 765 432 1 0 765 432 1 0 Channel #1 Transfer Channel #2 Transfer CSCK COFS Data 765 432 1 0 765 432 1 0 Channel #1 Transfer Channel #2 Transfer CSCK COFS Data 765 432 1 0 765 432 1 0 Channel #1 Transfer, Word 1 CSCK COFS Data 765 432 1 0 765 432 1 0 1. Standard I2S Data Alignment 2. Left-Justified Data Alignment 3. Left-Justified Data Alignment with Packed Data Channel #1 Transfer, Word 2 Channel #2 Transfer, Word 1 Channel #2 Transfer, Word 2 dsPIC30F Family Reference Manual DS70069C-page 22-26 © 2004 Microchip Technology Inc. Figure 22-14: AC-Link Signal Connections Figure 22-15: AC-Link Data Frame Figure 22-16: Frame Sync Timing, AC-Link Start of Frame The DCI module has two Operating modes for the AC-Link protocol to accommodate the 20-bit data time slots. These Operating modes are selected by the COFSM<1:0> control bits (DCICON1<1:0>). The first AC-Link mode is called ‘16-bit AC-Link mode’ and is selected by setting COFSM<1:0> = 10b. The second AC-Link mode is called ‘20-bit AC-Link mode’ and is selected by setting COFSM<1:0> = 11b. dsPIC® (AC ‘97 Controller) AC ‘97 Codec 24.576 MHz BIT_CLK SYNC SDATA_OUT SDATA_IN /RESET CSCK COFS CSDO CSDI I/O Tag Frame Command Address Command Data Slot 3 Left PCM Data Slot 4 Right PCM Data Slot 10 Line 2 DAC Slot 11 Handset DAC Slot 12 Codec I/O Control Tag Frame Status Address Status Data Slot 3 Left PCM Data Slot 4 Right PCM Data Slot 10 Line 2 ADC Slot 11 Handset ADC Slot 12 Codec I/O Status 16 20 20 20 20 20 20 20 256 SYNC SDATA_OUT SDATA_IN Tag MSb CSCK Data COFS Tag bit 14 S12 LSb S12 bit 1 S12 bit 2 Tag bit 13 Frame Synch Edge Sampled First bit of Data Frame Sampled © 2004 Microchip Technology Inc. DS70069C-page 22-27 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.5.6.2 16-bit AC-Link Mode In the 16-bit AC-Link mode, transmit and receive data word lengths are restricted to 16 bits to fit the DCI Transmit and Receive registers. Note that this restriction only affects the 20-bit data time slots of the AC-Link protocol. For received time slots, the incoming data will be truncated to 16 bits. For outgoing time slots, the 4 LSbs of the data word are set to ‘0’ by the module. This Operating mode simplifies the AC-Link data frame by treating every time slot as a 16-bit time slot. The frame sync generator maintains alignment to the time slot boundaries. 22.5.6.3 20-bit AC-Link Mode The 20-bit AC-Link mode allows all bits in the data time slots to be transmitted and received, but does not maintain data alignment to the specific time slot boundaries defined in the AC-Link protocol. The 20-bit AC-Link mode functions similarly to the Multi-Channel mode of the DCI module, except for the duty cycle of the frame synchronization signal that is produced. The AC-Link frame synchronization signal should remain high for 16 clock cycles and should be low for the following 240 cycles. The 20-bit mode treats each 256-bit AC-Link frame as sixteen 16-bit time slots. In the 20-bit AC-Link mode, the module operates as if COFSG<3:0> = 1111b and WS<3:0> = 1111b. The data alignment for 20-bit data slots is not maintained in this Operating mode. For example, an entire 256-bit AC-Link data frame can be transmitted and received in a packed fashion by setting all bits in the TSCON and RSCON registers. Since the total available buffer length is 64 bits, it would take 4 consecutive interrupts to transfer the AC-Link frame. The application software must keep track of the current AC-Link frame segment by monitoring the SLOT<3:0> status bits (DCISTAT<11:7>). 22.5.6.4 AC-Link Setup Details The module is enabled for AC-Link mode by writing 10h or 11h to the COFSM<1:0> control bits in the DCICON1 SFR. The word size selection bits (WS<3:0>) and the frame synchronization generator bits (COFSG<3:0>) have no effect for the 16 and 20-bit AC-Link modes since the frame and word sizes are set by the protocol. Most AC ‘97 codecs generate the clock signal that controls data transfers. Therefore, the CSCKD control bit is set in software. The COFSD control bit is cleared because the DCI will generate the FS signal from the incoming clock signal. The CSCKE bit is cleared so that data is sampled on the rising edge. The user must decide which time slots in the AC-Link data frame are to be buffered and set the TSE and RSE control bits accordingly. At a minimum, it will be necessary to buffer the transmit and receive TAG slots, so the TSCON<0> and RSCON<1> control bits should be set in software. 1. The DCI must be configured to accept the serial transfer clock from the AC ’97 codec. Set the CSCKD control bit and clear the DCICON3 register. 2. Next, set the COFSM<1:0> control bits (DCICON1<1:0>) to 10b or 11b to set the desired AC-Link Frame Synchronization mode. 3. Clear the COFSD control bit (DCICON1<8>), so the DCI will output the frame sync signal. 4. Clear the CSCKE control bit (DCICON1<9>) to sample incoming data on the falling edge of CSCK. Note: Only the TSCON<12:0> control bits and the RSCON<12:0> control bits will have an effect in the 16-bit AC-Link mode, since an AC-Link frame has 13 time slots. Note: The word size selection bits (WS<3:0>) and the frame synchronization generator bits (COFSG<3:0>) have no effect for the 16- and 20-bit AC-Link modes, since the frame and word sizes are set by the protocol. dsPIC30F Family Reference Manual DS70069C-page 22-28 © 2004 Microchip Technology Inc. 5. Clear the CSDOM control bit (DCICON1<6>). 6. Write the TSCON and RSCON registers to determine which data time slots in the frame are to be transmitted and received, respectively. This will depend on which data time slots in the AC-Link protocol will be used. At a minimum, communication on slot #0 (Tag Slot) is required. Refer to the discussion in Section 22.5.6.2 “16-bit AC-Link Mode”, Section 22.5.6.3 “20-bit AC-Link Mode” and Section 26. “Appendix” of this manual for additional information. 7. Set the BLEN control bits (DCICON2<11:10>) to buffer the desired amount of data words. For the single channel codec, BLEN = 00 will provide an interrupt at each data frame. A higher value of BLEN could be used for this codec to buffer multiple samples between interrupts. 8. If interrupts are to be used, clear the DCIIF status bit (IFS2<9>) and set the DCIIE control bit (IEC2<9>). 9. Begin operation as described in Section 22.5.1.1 “DCI Start-up and Data Buffering”. 22.6 Operation in Power Saving Modes 22.6.1 CPU Idle Mode The DCI module may optionally continue to operate while the CPU is in Idle mode. The DCISIDL control bit (DCICON1<13>) determines whether the DCI module will operate when the CPU is in Idle mode. If the DCISIDL control bit is cleared (default), the module will continue to operate normally in Idle mode. If the DCISIDL bit is set, the module will halt when the CPU enters Idle mode. 22.6.2 Sleep Mode The DCI will not operate while the device is in Sleep mode if the CSCK signal is derived from the device instruction clock, TCY. However, the DCI module has the ability to operate while in Sleep mode and wake the CPU when the CSCK signal is supplied by an external device (CSCKD = 1). The DCI interrupt enable bit, DCIIE, must be set to allow a wake-up event from Sleep mode. When the DCI interrupt flag, DCIIF is set, the device will wake from Sleep mode. If the DCI interrupt priority level is greater than the current CPU priority, program execution will resume from the DCI ISR. Otherwise, execution will resume with the instruction following the PWRSAV instruction that previously entered Sleep mode. 22.7 Registers Associated with DCI Table 22-1 lists the registers associated with the DCI module. Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 © 2004 Microchip Technology Inc. DS70069C-page 22-29 Table 22-1: DCI Register Map Name Address Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on all Resets IFS2 0088 — — — FLTBIF FLTAIF LVDIF DCIIF QEIIF PWMIF C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000 IEC2 0090 — — — FLTBIE FLTAIE LVDIE DCIIE QEIIE PWMIE C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000 IPC10 00A8 — FLTAIP<2:0> — LVDIP<2:0> — DCIIP<2:0> — QEIIP<2:0> 0100 0100 0100 0100 DCICON1 240 DCIEN — DCISIDL — DLOOP CSCKD CSCKE COFSD UNFM SDOM DJST — — — COFSM<1:0> 000- -000 000- --00 DCICON2 242 — — — — BLEN<1:0> — COFSG<3:0> — WS<3:0> ---- 00-0 000- 0000 DCICON3 244 — — — — BCG<11:0> ---- 0000 0000 0000 DCISTAT 246 — — — — SLOT<3:0> — — — — ROV RFUL TUNF TMPTY ---- 0000 ---0 0000 TSCON 248 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 0000 0000 0000 0000 RSCON 24C RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 0000 0000 0000 0000 RXBUF0 250 Receive #0 Data Register uuuu uuuu uuuu uuuu RXBUF1 252 Receive #1 Data Register uuuu uuuu uuuu uuuu RXBUF2 254 Receive #2 Data Register uuuu uuuu uuuu uuuu RXBUF3 256 Receive #3 Data Register uuuu uuuu uuuu uuuu TXBUF0 258 Transmit #0 Data Register 0000 0000 0000 0000 TXBUF1 25A Transmit #1 Data Register 0000 0000 0000 0000 TXBUF2 25C Transmit #2 Data Register 0000 0000 0000 0000 TXBUF3 25E Transmit #3 Data Register 0000 0000 0000 0000 Legend: r = Reserved, x = Unknown, u = Unchanged. Note: Grayed locations indicate reserved space in SFR map for future module expansion. Read reserved locations as ‘0’s. dsPIC30F Family Reference Manual DS70069C-page 22-30 © 2004 Microchip Technology Inc. 22.8 Design Tips Question 1: Can the DCI support data word lengths greater than 16-bits? Answer: Yes. A long data word can be transmitted and received using multiple Transmit and Receive registers. See Section 22.5.3 “Data Packing for Long Data Word Support” for details. © 2004 Microchip Technology Inc. DS70069C-page 22-31 Section 22. Data Converter Interface (DCI) D ata C o n v erter Interface (DCI) 22 22.9 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Data Converter Interface (DCI) module are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70069C-page 22-32 © 2004 Microchip Technology Inc. 22.10 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates additional technical content and changes for the dsPIC30F Data Converter Interface (DCI) module. Revision C This revision incorporates all known errata at the time of this document update. © 2005 Microchip Technology Inc. DS70070C-page 23-1 CAN Module 23 Section 23. CAN Module HIGHLIGHTS This section of the manual contains the following major topics: 23.1 Introduction .................................................................................................................. 23-2 23.2 Control Registers for the CAN Module......................................................................... 23-2 23.3 CAN Module Features ............................................................................................... 23-28 23.4 CAN Module Implementation ..................................................................................... 23-29 23.5 CAN Module Operation Modes .................................................................................. 23-36 23.6 Message Reception ................................................................................................... 23-39 23.7 Transmission.............................................................................................................. 23-49 23.8 Error Detection........................................................................................................... 23-58 23.9 CAN Baud Rate ......................................................................................................... 23-60 23.10 Interrupts.................................................................................................................... 23-64 23.11 CAN Capture.............................................................................................................. 23-65 23.12 CAN Module I/O......................................................................................................... 23-65 23.13 Operation in CPU Power Saving Modes.................................................................... 23-66 23.14 CAN Protocol Overview ............................................................................................. 23-68 23.15 Related Application Notes.......................................................................................... 23-72 23.16 Revision History ......................................................................................................... 23-73 dsPIC30F Family Reference Manual DS70070C-page 23-2 © 2005 Microchip Technology Inc. 23.1 Introduction The Controller Area Network (CAN) module is a serial interface useful for communicating with other peripherals or microcontroller devices. This interface/protocol was designed to allow communications within noisy environments. Figure 23-1 shows an example CAN bus network. Figure 23-1: Example CAN Bus Network 23.2 Control Registers for the CAN Module There are many registers associated with the CAN module. Descriptions of these registers are grouped into sections. These sections are: • Control and Status Registers • Transmit Buffer Registers • Receive Buffer Registers • Baud Rate Control Registers • Interrupt Status and Control Registers MCP2510 SPI™ Interface CAN bus dsPIC30F with CAN Microchip PICmicro with integrated CAN MCP2551 Transceiver MCP2551 Transceiver MCP2551 Transceiver MCP2551 Transceiver MCP2551 Transceiver dsPIC30F with integrated CAN dsPIC30F with integrated CAN PICmicro® Microcontroller Note 1: ‘i’ in the register identifier denotes the specific CAN module (CAN1 or CAN2). 2: ‘n’ in the register identifier denotes the buffer, filter or mask number. 3: ‘m’ in the register identifier denotes the word number within a particular CAN data field. © 2005 Microchip Technology Inc. DS70070C-page 23-3 Section 23. CAN CAN Module 23 23.2.1 CAN Control and Status Registers Register 23-1: CiCTRL: CAN Module Control and Status Register Upper Byte: R/W-x U-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0 CANCAP — CSIDL ABAT CANCKS REQOP<2:0> bit 15 bit 8 Lower Byte: R-1 R-0 R-0 U-0 R-0 R-0 R-0 U-0 OPMODE<2:0> — ICODE<2:0> — bit 7 bit 0 bit 15 CANCAP: CAN Message Receive Capture Enable bit 1 = Enable CAN capture 0 = Disable CAN capture Note: CANCAP is always writable, regardless of CAN module Operating mode. bit 14 Unimplemented: Read as ‘0’ bit 13 CSIDL: Stop in Idle Mode bit 1 = Discontinue CAN module operation when device enters Idle mode 0 = Continue CAN module operation in Idle mode bit 12 ABAT: Abort All Pending Transmissions bit 1 = Abort pending transmissions in all Transmit Buffers 0 = No effect Note: Module will clear this bit when all transmissions aborted. bit 11 CANCKS: CAN Master Clock Select bit 1 = FCAN clock is FCY 0 = FCAN clock is 4 FCY bit 10-8 REQOP<2:0>: Request Operation Mode bits 111 = Set Listen All Messages mode 110 = Reserved 101 = Reserved 100 = Set Configuration mode 011 = Set Listen Only mode 010 = Set Loopback mode 001 = Set Disable mode 000 = Set Normal Operation mode bit 7-5 OPMODE<2:0>: Operation Mode bits Note: These bits indicate the current Operating mode of the CAN module. See description for REQOP bits (CiCTRL<10:8>). bit 4 Unimplemented: Read as ‘0’ dsPIC30F Family Reference Manual DS70070C-page 23-4 © 2005 Microchip Technology Inc. Register 23-1: CiCTRL: CAN Module Control and Status Register (Continued) bit 3-1 ICODE<2:0>: Interrupt Flag Code bits 111 = Wake-up interrupt 110 = RXB0 interrupt 101 = RXB1 interrupt 100 = TXB0 interrupt 011 = TXB1 interrupt 010 = TXB2 interrupt 001 = Error interrupt 000 = No interrupt bit 0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-5 Section 23. CAN CAN Module 23 23.2.2 CAN Transmit Buffer Registers This subsection describes the CAN Transmit Buffer Register and the associated Transmit Buffer Control Registers. Register 23-2: CiTXnCON: Transmit Buffer Status and Control Register Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: U-0 R-0 R-0 R-0 R/W-0 U-0 R/W-0 R/W-0 — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> bit 7 bit 0 bit 15-7 Unimplemented: Read as '0' bit 6 TXABT: Message Aborted bit 1 = Message was aborted 0 = Message has not been aborted Note: This bit is cleared when TXREQ is set. bit 5 TXLARB: Message Lost Arbitration bit 1 = Message lost arbitration while being sent 0 = Message did not lose arbitration while being sent Note: This bit is cleared when TXREQ is set. bit 4 TXERR: Error Detected During Transmission bit 1 = A bus error occurred while the message was being sent 0 = A bus error did not occur while the message was being sent Note: This bit is cleared when TXREQ is set. bit 3 TXREQ: Message Send Request bit 1 = Request message transmission 0 = Abort message transmission if TXREQ already set, otherwise no effect Note: The bit will automatically clear when the message is successfully sent. bit 2 Unimplemented: Read as ‘0’ bit 1-0 TXPRI<1:0>: Message Transmission Priority bits 11 = Highest message priority 10 = High intermediate message priority 01 = Low intermediate message Priority 00 = Lowest message priority Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-6 © 2005 Microchip Technology Inc. Register 23-3: CiTXnSID: Transmit Buffer n Standard Identifier Register 23-4: CiTXnEID: Transmit Buffer n Extended Identifier Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x U-0 U-0 U-0 SID<10:6> — — — bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SID<5:0> SRR TXIDE bit 7 bit 0 bit 15-11 SID<10:6>: Standard Identifier bits bit 10-8 Unimplemented: Read as ‘0’ bit 7-2 SID<6:0>: Standard Identifier bits bit 1 SRR: Substitute Remote Request Control bit 1 = Message will request a remote transmission 0 = Normal message. bit 0 TXIDE: Extended Identifier bit 1 = Message will transmit extended identifier 0 = Message will transmit standard identifier Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-x R/W-x R/W-x R/W-x U-0 U-0 U-0 U-0 EID<17:14> — — — — bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<13:6> bit 7 bit 0 bit 15-12 EID<17:14>: Extended Identifier bits 17-14 bit 11-8 Unimplemented: Read as ‘0’ bit 7-0 EID<13:6>: Extended Identifier bits 13-6 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-7 Section 23. CAN CAN Module 23 Register 23-5: CiTXnDLC: Transmit Buffer n Data Length Control Register 23-6: CiTXnBm: Transmit Buffer n Data Field Word m Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<5:0> TXRTR TXRB1 bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x U-0 U-0 U-0 TXRB0 DLC<3:0> — — — bit 7 bit 0 bit 15-10 EID<5:0>: Extended Identifier bits 5-0 bit 9 TXRTR: Remote Transmission Request bit 1 = Message will request a remote transmission 0 = Normal message bit 8-7 TXRB<1:0>: Reserved Bits Note: User must set these bits to ‘0’ according to CAN protocol. bit 6-3 DLC<3:0>: Data Length Code bits bit 2-0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = bit is cleared x = Bit is unknown Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x CTXB<15:8> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x CTXB<7:0> bit 7 bit 0 bit 15-0 CTXB<15:0>: Data Field Buffer Word bits (2 bytes) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-8 © 2005 Microchip Technology Inc. 23.2.3 CAN Receive Buffer Registers This subsection shows the Receive buffer registers with their associated control registers. Register 23-7: CiRX0CON: Receive Buffer 0 Status and Control Register Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/C-0 U-0 U-0 U-0 R-0 R/W-0 R/W-0 R-0 RXFUL — — — RXRTRRO DBEN JTOFF FILHIT0 bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7 RXFUL: Receive Full Status bit 1 = Receive buffer contains a valid received message 0 = Receive buffer is open to receive a new message Note: This bit is set by the CAN module and should be cleared by software after the buffer is read. bit 6-4 Unimplemented: Read as ‘0’ bit 3 RXRTRRO: Received Remote Transfer Request bit (read only) 1 = Remote Transfer Request was received 0 = Remote Transfer Request not received Note: This bit reflects the status of the last message loaded into Receive Buffer 0. bit 2 DBEN: Receive Buffer 0 Double Buffer Enable bit 1 = Receive Buffer 0 overflow will write to Receive Buffer 1 0 = No Receive Buffer 0 overflow to Receive Buffer 1 bit 1 JTOFF: Jump Table Offset bit (read only copy of DBEN) 1 = Allows Jump Table offset between 6 and 7 0 = Allows Jump Table offset between 0 and 1 bit 0 FILHIT0: Indicates Which Acceptance Filter Enabled the Message Reception bit 1 = Acceptance Filter 1 (RXF1) 0 = Acceptance Filter 0 (RXF0) Note: This bit reflects the status of the last message loaded into Receive Buffer 0. Legend: R = Readable bit W = Writable bit C = Bit can be cleared U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-9 Section 23. CAN CAN Module 23 Register 23-8: CiRX1CON: Receive Buffer 1 Status and Control Register Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/C-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0 RXFUL — — — RXRTRRO FILHIT<2:0> bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7 RXFUL: Receive Full Status bit 1 = Receive buffer contains a valid received message 0 = Receive buffer is open to receive a new message Note: This bit is set by the CAN module and should be cleared by software after the buffer is read. bit 6-4 Unimplemented: Read as ‘0’ bit 3 RXRTRRO: Received Remote Transfer Request bit (read only) 1 = Remote transfer request was received 0 = Remote transfer request not received Note: This bit reflects the status of the last message loaded into Receive Buffer 1. bit 2-0 FILHIT<2:0>: Indicates Which Acceptance Filter Enabled the Message Reception bits 101 = Acceptance filter 5 (RXF5) 100 = Acceptance filter 4 (RXF4) 011 = Acceptance filter 3 (RXF3) 010 = Acceptance filter 2 (RXF2) 001 = Acceptance filter 1 (RXF1) (Only possible when DBEN bit is set) 000 = Acceptance filter 0 (RXF0) (Only possible when DBEN bit is set) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-10 © 2005 Microchip Technology Inc. Register 23-9: CiRXnSID: Receive Buffer n Standard Identifier Register 23-10: CiRXnEID: Receive Buffer n Extended Identifier Upper Byte: U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — SID<10:6> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SID<5:0> SRR RXIDE bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12-2 SID<10:0>: Standard Identifier bits bit 1 SRR: Substitute Remote Request bit (Only when RXIDE = 1) 1 = Remote transfer request occured 0 = No remote transfer request occured bit 0 RXIDE: Extended Identifier Flag bit 1 = Received message is an extended data frame, SID<10:0> are EID<28:18> 0 = Received message is a standard data frame Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x — — — — EID<17:14> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<13:6> bit 7 bit 0 bit 15-12 Unimplemented: Read as ‘0’ bit 11-0 EID<17:6>: Extended Identifier bits 17-6 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-11 Section 23. CAN CAN Module 23 Register 23-11: CiRXnBm: Receive Buffer n Data Field Word m Register 23-12: CiRXnDLC: Receive Buffer n Data Length Control Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x CRXB<15:8> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x CRXB<7:0> bit 7 bit 0 bit 15-0 CRXB<15:0>: Data Field Buffer Word bits (2 bytes) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<5:0> RXRTR RB1 bit 15 bit 8 Lower Byte: U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — RB0 DLC<3:0> bit 7 bit 0 bit 15-10 EID<5:0>: Extended Identifier bits bit 9 RXRTR: Receive Remote Transmission Request bit 1 = Remote transfer request 0 = No remote transfer request Note: This bit reflects the status of the RTR bit in the last received message. bit 8 RB1: Reserved bit 1 Reserved by CAN Spec and read as ‘0’ bit 4 RB0: Reserved bit 0 Reserved by CAN Spec and read as ‘0’ bit 3-0 DLC<3:0>: Data Length Code bits (Contents of Receive Buffer) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-12 © 2005 Microchip Technology Inc. 23.2.4 Message Acceptance Filters This subsection describes the Message Acceptance filters. Register 23-13: CiRXFnSID: Acceptance Filter n Standard Identifier Register 23-14: CiRXFnEIDH: Acceptance Filter n Extended Identifier High Upper Byte: U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — SID<10:6> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x U-0 R/W-x SID<5:0> — EXIDE bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12-2 SID<10:0>: Standard Identifier bits bit 1 Unimplemented: Read as ‘0’ bit 0 EXIDE: Extended Identifier Enable bits If MIDE = 1, then 1 = Enable filter for extended identifier 0 = Enable filter for standard identifier If MIDE = 0, then EXIDE is don’t care Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x — — — — EID<17:14> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<13:6> bit 7 bit 0 bit 15-12 Unimplemented: Read as ‘0’ bit 11-0 EID<17:6>: Extended Identifier bits 17-6 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-13 Section 23. CAN CAN Module 23 Register 23-15: CiRXFnEIDL: Acceptance Filter n Extended Identifier Low Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x U-0 U-0 EID<5:0> — — bit 15 bit 8 Lower Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 bit 15-10 EID<5:0>: Extended Identifier bits bit 9-0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-14 © 2005 Microchip Technology Inc. 23.2.5 Acceptance Filter Mask Registers Register 23-16: CiRXMnSID: Acceptance Filter Mask n Standard Identifier Register 23-17: CiRXMnEIDH: Acceptance Filter Mask n Extended Identifier High Upper Byte: U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — SID<10:6> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x U-0 R/W-x SID<5:0> — MIDE bit 7 bit 0 bit 15-13 Unimplemented: Read as ‘0’ bit 12-2 SID<10:0>: Standard Identifier Mask bits 1 = Include bit in the filter comparison 0 = Don’t include bit in the filter comparison bit 1 Unimplemented: Read as ‘0’ bit 0 MIDE: Identifier Mode Selection bit 1 = Match only message types (standard or extended address) as determined by EXIDE bit in filter 0 = Match either standard or extended address message if the filters match Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Upper Byte: U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x — — — — EID<17:14> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EID<13:6> bit 7 bit 0 bit 15-12 Unimplemented: Read as ‘0’ bit 11-0 EID<17:6>: Extended Identifier Mask bits 17-6 1 = Include bit in the filter comparison 0 = Don’t include bit in the filter comparison Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-15 Section 23. CAN CAN Module 23 Register 23-18: CiRXMnEIDL: Acceptance Filter Mask n Extended Identifier Low Upper Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x U-0 U-0 EID<5:0> — — bit 15 bit 8 Lower Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 bit 15-10 EID<5:0>: Extended Identifier bits bit 9-0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-16 © 2005 Microchip Technology Inc. 23.2.6 CAN Baud Rate Registers This subsection describes the CAN baud rate registers. Register 23-19: CiCFG1: Baud Rate Configuration Register 1 Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SJW<1:0> BRP<5:0> bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7-6 SJW<1:0>: Synchronized Jump Width bits 11 = Synchronized jump width time is 4 x TQ 10 = Synchronized jump width time is 3 x TQ 01 = Synchronized jump width time is 2 x TQ 00 = Synchronized jump width time is 1 x TQ bit 5-0 BRP<5:0>: Baud Rate Prescaler bits 11 1111 = TQ = 2 x (BRP + 1)/FCAN = 128/FCAN 11 1110 = TQ = 2 x (BRP + 1)/FCAN = 126/FCAN . . . 00 0001 = TQ = 2 x (BRP + 1)/FCAN = 4/FCAN 00 0000 = TQ = 2 x (BRP + 1)/FCAN = 2/FCAN Note: FCAN is FCY or 4 FCY, depending on the CANCKS bit setting. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-17 Section 23. CAN CAN Module 23 Register 23-20: CiCFG2: Baud Rate Configuration Register 2 Upper Byte: U-0 R/W-x U-0 U-0 U-0 R/W-x R/W-x R/W-x — WAKFIL — — — SEG2PH<2:0> bit 15 bit 8 Lower Byte: R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x SEG2PHT S SAM SEG1PH<2:0> PRSEG<2:0> bit 7 bit 0 bit 15 Unimplemented: Read as ‘0’ bit 14 WAKFIL: Select CAN bus Line Filter for Wake-up bit 1 = Use CAN bus line filter for wake-up 0 = CAN bus line filter is not used for wake-up bit 13-11 Unimplemented: Read as ‘0’ bit 10-8 SEG2PH<2:0>: Phase Buffer Segment 2 bits 111 = length is 8 x TQ . . 000 = length is 1 x TQ bit 7 SEG2PHTS: Phase Segment 2 Time Select bit 1 = Freely programmable 0 = Maximum of SEG1PH or information processing time (3 TQ’s), whichever is greater bit 6 SAM: Sample of the CAN bus Line bit 1 = Bus line is sampled three times at the sample point 0 = Bus line is sampled once at the sample point bit 5-3 SEG1PH<2:0>: Phase Buffer Segment 1 bits 111 = length is 8 x TQ . . 000 = length is 1 x TQ bit 2-0 PRSEG<2:0>: Propagation Time Segment bits 111 = length is 8 x TQ . . 000 = length is 1 x TQ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-18 © 2005 Microchip Technology Inc. 23.2.7 CAN Module Error Count Register This subsection describes the CAN Module Transmission/Reception Error Count register. The various error status flags are present in the CAN Interrupt Flag Register. Register 23-21: CiEC: Transmit/Receive Error Count Upper Byte: R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 TERRCNT<7:0> bit 15 bit 8 Lower Byte: R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 RERRCNT<7:0> bit 7 bit 0 bit 15-8 TERRCNT<7:0>: Transmit Error Count bits bit 7-0 RERRCNT<7:0>: Receive Error Count bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2005 Microchip Technology Inc. DS70070C-page 23-19 Section 23. CAN CAN Module 23 23.2.8 CAN Interrupt Registers This subsection documents the CAN Registers which are associated with interrupts. Register 23-22: CiINTE: Interrupt Enable Register Upper Byte: U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — — — bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1IE RX0IE bit 7 bit 0 bit 15-8 Unimplemented: Read as ‘0’ bit 7 IVRIE: Invalid Message Received Interrupt Enable bit 1 = Enabled 0 = Disabled bit 6 WAKIE: Bus Wake Up Activity Interrupt Enable bit 1 = Enabled 0 = Disabled bit 5 ERRIE: Error Interrupt Enable bit 1 = Enabled 0 = Disabled bit 4 TX2IE: Transmit Buffer 2 Interrupt Enable bit 1 = Enabled 0 = Disabled bit 3 TX1IE: Transmit Buffer 1 Interrupt Enable bit 1 = Enabled 0 = Disabled bit 2 TX0IE: Transmit Buffer 0 Interrupt Enable bit 1 = Enabled 0 = Disabled bit 1 RX1IE: Receive Buffer 1 Interrupt Enable bit 1 = Enabled 0 = Disabled bit 0 RX0IE: Receive Buffer 0 Interrupt Enable bit 1 = Enabled 0 = Disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-20 © 2005 Microchip Technology Inc. Register 23-23: CiINTF: Interrupt Flag Register Upper Byte: R/C-0 R/C-0 R-0 R-0 R-0 R-0 R-0 R-0 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN bit 15 bit 8 Lower Byte: R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF bit 7 bit 0 bit 15 RX0OVR: Receive Buffer 0 Overflowed bit 1 = Receive buffer 0 overflowed 0 = Receive buffer 0 not overflowed bit 14 RX1OVR: Receive Buffer 1 Overflowed bit 1 = Receive buffer 1 overflowed 0 = Receive buffer 1 not overflowed bit 13 TXBO: Transmitter in Error State, Bus Off bit 1 = Transmitter in error state, bus off 0 = Transmitter not in error state, bus off bit 12 TXEP: Transmitter in Error State, Bus Passive bit 1 = Transmitter in error state, bus passive 0 = Transmitter not in error state, bus passive bit 11 RXEP: Receiver in Error State, Bus Passive bit 1 = Receiver in error state, bus passive 0 = Receiver not in error state, bus passive bit 10 TXWAR: Transmitter in Error State, Warning bit 1 = Transmitter in error state, warning 0 = Transmitter not in error state, warning bit 9 RXWAR: Receiver in Error State, Warning bit 1 = Receiver in error state, warning 0 = Receiver not in error state, warning bit 8 EWARN: Transmitter or Receiver is in Error State, Warning bit 1 = Transmitter or receiver is in error state, warning 0 = Transmitter and receiver are not in error state bit 7 IVRIF: Invalid Message Received Interrupt Flag bit 1 = Some type of error occurred during reception of the last message 0 = Receive error has not occurred bit 6 WAKIF: bus Wake-up Activity Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 ERRIF: Error Interrupt Flag bit (multiple sources in CiINTF<15:8> register) 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 TX2IF: Transmit Buffer 2 Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 TX1IF: Transmit Buffer 1 Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred © 2005 Microchip Technology Inc. DS70070C-page 23-21 Section 23. CAN CAN Module 23 Register 23-23: CiINTF: Interrupt Flag Register (Continued) bit 2 TX0IF: Transmit Buffer 0 Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 1 RX1IF: Receive Buffer 1 Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 RX0IF: Receive Buffer 0 Interrupt Flag bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Legend: R = Readable bit W = Writable bit C = Bit can be cleared U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown dsPIC30F Family Reference Manual DS70070C-page 23-22 © 2003 Microchip Technology Inc. Table 23-1: CAN1 Register Map File Name ADR Bit Reset 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 C1RXF0SID 300 — — — SID<10:6> SID<5:0> — EXIDE xxxx C1RXF0EIDH 302 — — — — EID<17:14> EID<13:6> xxxx C1RXF0EIDL 304 EID<5:0> — — — — — — — — — — xxxx unused 306 — — — — — — — — — — — — — — — — xxxx C1RXF1SID 308 — — — SID<10:6> SID<5:0> — EXIDE xxxx C1RXF1EIDH 30A — — — — EID<17:14> EID<13:6> xxxx C1RXF1EIDL 30C EID<5:0> — — — — — — — — — — xxxx unused 30E — — — — — — — — — — — — — — — — xxxx C1RXF2SID 310 — — — SID<10:6> SID<5:0> — EXIDE xxxx C1RXF2EIDH 312 — — — — EID<17:14> EID<13:6> xxxx C1RXF2EIDL 314 EID<5:0> — — — — — — — — — — xxxx unused 316 — — — — — — — — — — — — — — — — xxxx C1RXF3SID 318 — — — SID<10:6> SID<5:0> — EXIDE xxxx C1RXF3EIDH 31A — — — — EID<17:14> EID<13:6> xxxx C1RXF3EIDL 31C EID<5:0> — — — — — — — — — — xxxx unused 31E — — — — — — — — — — — — — — — — xxxx C1RXF4SID 320 — — — SID<10:6> SID<5:0> — EXIDE xxxx C1RXF4EIDH 322 — — — — EID<17:14> EID<13:6> xxxx C1RXF4EIDL 324 EID<5:0> — — — — — — — — — — xxxx unused 326 — — — — — — — — — — — — — — — — xxxx C1RXF5SID 328 — — — SID<10:6> SID<5:0> — EXIDE xxxx C1RXF5EIDH 32A — — — — EID<17:14> EID<13:6> xxxx C1RXF5EIDL 32C EID<5:0> — — — — — — — — — — xxxx unused 32E — — — — — — — — — — — — — — — — xxxx C1RXM0SID 330 — — — SID<10:6> SID<5:0> — MIDE xxxx C1RXM0EIDH 332 — — — — EID<17:14> EID<13:6> xxxx C1RXM0EIDL 334 EID<5:0> — — — — — — — — — — xxxx unused 336 — — — — — — — — — — — — — — — — xxxx C1RXM1SID 338 — — — SID<10:6> SID<5:0> — MIDE xxxx C1RXM1EIDH 33A — — — — EID<17:14> EID<13:6> xxxx C1RXM1EIDL 33C EID<5:0> — — — — — — — — — — xxxx unused 33E — — — — — — — — — — — — — — — — xxxx © 2003 Microchip Technology Inc. DS70070C-page 23-23 Section 23. CAN CAN Module 23 C1TX2SID 340 SID<10:6> — — — SID<5:0> SRR TX IDE xxxx C1TX2EID 342 EID<17:14> — — — — EID<13:6> xxxx C1TX2DLC 342 EID<5:0> TX RTR TX RB1 TX RB0 DLC<3:0> — — — xxxx C1TX2B1 346 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 xxxx C1TX2B2 348 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 xxxx C1TX2B3 34A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 xxxx C1TX2B4 34C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 xxxx C1TX2CON 34E — — — — — — — — — TX ABT TX LARB TX ERR TX REQ — TXPRI[1:0] 0000 C1TX1SID 350 SID<10:6> — — — SID<5:0> SRR TX IDE xxxx C1TX1EID 352 EID<17:14> — — — — EID<13:6> xxxx C1TX1DLC 352 EID<5:0> TX RTR TX RB1 TX RB0 DLC<3:0> — — — xxxx C1TX1B1 356 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 xxxx C1TX1B2 358 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 xxxx C1TX1B3 35A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 xxxx C1TX1B4 35C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 xxxx C1TX1CON 35E — — — — — — — — — TX ABT TX LARB TX ERR TX REQ — TXPRI[1:0] 0000 C1TX0SID 360 SID<10:6> — — — SID<5:0> SRR TX IDE xxxx C1TX0EID 362 EID<17:14> — — — — EID<13:6> xxxx C1TX0DLC 362 EID<5:0> TX RTR TX RB1 TX RB0 DLC<3:0> — — — xxxx C1TX0B1 366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 xxxx C1TX0B2 368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 xxxx C1TX0B3 36A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 xxxx C1TX0B4 36C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 xxxx C1TX0CON 36E — — — — — — — — — TX ABT TX LARB TX ERR TX REQ — TXPRI[1:0] 0000 Table 23-1: CAN1 Register Map (Continued) File Name ADR Bit Reset 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 dsPIC30F Family Reference Manual DS70070C-page 23-24 © 2003 Microchip Technology Inc. C1RX1SID 370 — — — SID<10:6> SID<5:0> SRR RX IDE xxxx C1RX1EID 372 — — — — EID<17:14> EID<13:6> xxxx C1RX1DLC 374 EID<0:5> RX RTR RX RB1 — — — RX RB0 DLC[3:0] xxxx C1RX1B1 376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 xxxx C1RX1B2 378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 xxxx C1RX1B3 37A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 xxxx C1RX1B4 37C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 xxxx C1RX1CON 37E — — — — — — — — RX FUL — — RX ERR RX RTR R0 FILHIT[2:0] 0000 C1RX1SID 380 — — — SID<10:6> SID<5:0> SRR RX IDE xxxx C1RX1EID 382 — — — — EID<17:14> EID<13:6> xxxx C1RX1DLC 384 EID<0:5> RX RTR RX RB1 — — — RX RB0 DLC[3:0] xxxx C1RX0B1 386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 xxxx C1RX0B2 388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 xxxx C1RX0B3 38A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 xxxx C1RX0B4 38C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 xxxx C1RX0CON 38E — — — — — — — — RX FUL — — RX ERR RX RTR R0 RXB0 DBEN JTOFF FIL HIT 0 0000 C1CTRL 390 CAN CAP — C SIDL ABAT CAN CKS REQOP[2:0] OPMODE[2:0] — ICODE[2:0] — 0480 C1CFG1 392 — — — — — — — — SJW[1:0]S BRP[5:0] 0000 C1CFG2 394 — WAK FIL — — — SEG2PH[2:0] SEG2 PHTS SAM SEG1PH[2:0] PRSEG[2:0] 0000 C1INTF 396 RXB0 OVR RXB1 OVR TXBO TXBP RXBP TX WARN RX WARN E WARN IVR IF WAK IF ERR IF TXB2 IF TXB1 IF TXB0 IF RXB1 IF RXB0 IF 0000 C1INTE 398 — — — — — — — — IVR IE WAK IE ERR IE TXB2 IE TXB1 IE TXB0 IE RXB1 IE RXB0 IE 0000 C1EC 39A Transmit Error Counter Receive Error Counter 0000 Reserved 39C 3FE — — — — — — — — — — — — — — — — xxxx Legend: x = Unknown Table 23-1: CAN1 Register Map (Continued) File Name ADR Bit Reset 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 © 2003 Microchip Technology Inc. DS70070C-page 23-25 Section 23. CAN CAN Module 23 Table 23-2: CAN2 Register Map File Name ADR Bit Reset 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 C2RXF0SID 3C0 — — — SID<10:6> SID<5:0> — EXIDE xxxx C2RXF0EIDH 3C2 — — — — EID<17:14> EID<13:6> xxxx C2RXF0EIDL 3C4 EID<5:0> — — — — — — — — — — xxxx unused 3C6 — — — — — — — — — — — — — — — — xxxx C2RXF1SID 3C8 — — — SID<10:6> SID<5:0> — EXIDE xxxx C2RXF1EIDH 3CA — — — — EID<17:14> EID<13:6> xxxx C2RXF1EIDL 3CC EID<5:0> — — — — — — — — — — xxxx unused 3CE — — — — — — — — — — — — — — — — xxxx C2RXF2SID 3D0 — — — SID<10:6> SID<5:0> — EXIDE xxxx C2RXF2EIDH 3D2 — — — — EID<17:14> EID<13:6> xxxx C2RXF2EIDL 3D4 EID<5:0> — — — — — — — — — — xxxx unused 3D6 — — — — — — — — — — — — — — — — xxxx C2RXF3SIDH 3D8 — — — SID<10:6> SID<5:0> — EXIDE xxxx C2RXF3EID 3DA — — — — EID<17:14> EID<13:6> xxxx C2RXF3EIDL 3DC EID<5:0> — — — — — — — — — — xxxx unused 3DE — — — — — — — — — — — — — — — — xxxx C2RXF4SID 3E0 — — — SID<10:6> SID<5:0> — EXIDE xxxx C2RXF4EIDH 3E2 — — — — EID<17:14> EID<13:6> xxxx C2RXF4EIDL 3E4 EID<5:0> — — — — — — — — — — xxxx unused 3E6 — — — — — — — — — — — — — — — — xxxx C2RXF5SID 3E8 — — — SID<10:6> SID<5:0> — EXIDE xxxx C2RXF5EIDH 3EA — — — — EID<17:14> EID<13:6> xxxx C2RXF5EIDL 3EC EID<5:0> — — — — — — — — — — xxxx unused 3EE — — — — — — — — — — — — — — — — xxxx C2RXM0SID 3F0 — — — SID<10:6> SID<5:0> — MIDE xxxx C2RXM0EIDH 3F2 — — — — EID<17:14> EID<13:6> xxxx C2RXM0EIDL 3F4 EID<5:0> — — — — — — — — — — xxxx unused 3F6 — — — — — — — — — — — — — — — — xxxx C2RXM1SID 3F8 — — — SID<10:6> SID<5:0> — MIDE xxxx C2RXM1EIDH 3FA — — — — EID<17:14> EID<13:6> xxxx C2RXM1EIDL 3FC EID<5:0> — — — — — — — — — — xxxx unused 3FE — — — — — — — — — — — — — — — — xxxx dsPIC30F Family Reference Manual DS70070C-page 23-26 © 2003 Microchip Technology Inc. C2TX2SID 400 SID<10:6> — — — SID<5:0> SRR TX IDE xxxx C2TX2EID 402 EID<17:14> — — — — EID<13:6> xxxx C2TX2DLC 404 EID<5:0> TX RTR TX RB1 TX RB0 DLC<3:0> — — — xxxx C2TX2B1 406 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 xxxx C2TX2B2 408 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 xxxx C2TX2B3 40A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 xxxx C2TX2B4 40C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 xxxx C2TX2CON 40E — — — — — — — — — TX ABT TX LARB TX ERR TX REQ — TXPRI[1:0] 0000 C2TX1SID 410 SID<10:6> — — — SID<5:0> SRR TX IDE xxxx C2TX1EID 412 EID<17:14> — — — — EID<13:6> xxxx C2TX1DLC 414 EID<5:0> TX RTR TX RB1 TX RB0 DLC<3:0> — — — xxxx C2TX1B1 416 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 xxxx C2TX1B2 418 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 xxxx C2TX1B3 41A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 xxxx C2TX1B4 41C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 xxxx C2TX1CON 41E — — — — — — — — — TX ABT TX LARB TX ERR TX REQ — TXPRI[1:0] 0000 C2TX0SID 420 SID<10:6> — — — SID<5:0> SRR TX IDE xxxx C2TX0EID 422 EID<17:14> — — — — EID<13:6> xxxx C2TX0DLC 424 EID<5:0> TX RTR TX RB1 TX RB0 DLC<3:0> — — — xxxx C2TX0B1 426 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 xxxx C2TX0B2 428 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 xxxx C2TX0B3 42A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 xxxx C2TX0B4 42C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 xxxx C2TX0CON 42E — — — — — — — — — TX ABT TX LARB TX ERR TX REQ — TXPRI[1:0] 0000 Table 23-2: CAN2 Register Map (Continued) File Name ADR Bit Reset 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 © 2003 Microchip Technology Inc. DS70070C-page 23-27 Section 23. CAN CAN Module 23 C2RX1SID 430 — — — SID<10:6> SID<5:0> SRR RX IDE xxxx C2RX1EID 432 — — — — EID<17:14> EID<13:6> xxxx C2RX1DLC 434 EID<0:5> RX RTR RX RB1 — — — RX RB0 DLC[3:0] xxxx C2RX1B1 436 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 xxxx C2RX1B2 438 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 xxxx C2RX1B3 43A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 xxxx C2RX1B4 43C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 xxxx C2RX1CON 43E — — — — — — — — RX FUL — — RX ERR RX RTR R0 FILHIT[2:0] 0000 C2RX1SID 440 — — — SID<10:6> SID<5:0> SRR RX IDE xxxx C2RX1EID 442 — — — — EID<17:14> EID<13:6> xxxx C2RX1DLC 444 EID<0:5> RX RTR RX RB1 — — — RX RB0 DLC[3:0] xxxx C2RX0B1 446 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 xxxx C2RX0B2 448 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 xxxx C2RX0B3 44A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 xxxx C2RX0B4 44C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 xxxx C2RX0CON 44E — — — — — — — — RX FUL — — RX ERR RX RTR R0 RXB0 DBEN JTOFF FIL HIT 0 0000 C2CTRL 450 CAN CAP — C SIDL ABAT CAN CKS REQOP[2:0] OPMODE[2:0] — ICODE[2:0] — 0480 C2CFG1 452 — — — — — — — — SJW[1:0]S BRP[5:0] 0000 C2CFG2 454 — WAK FIL — — — SEG2PH[2:0] SEG2 PHTS SAM SEG1PH[2:0] PRSEG[2:0] 0000 C2INTF 456 RXB0 OVR RXB1 OVR TXBO TXBP RXBP TX WARN RX WARN E WARN IVR IF WAK IF ERR IF TXB2 IF TXB1 IF TXB0 IF RXB1 IF RXB0 IF 0000 C2INTE 458 — — — — — — — — IVR IE WAK IE ERR IE TXB2 IE TXB1 IE TXB0 IE RXB1 IE RXB0 IE 0000 C2EC 45A Transmit Error Counter Receive Error Counter 0000 Reserved 45C 4FE — — — — — — — — — — — — — — — — xxxx Legend: x = Unknown Table 23-2: CAN2 Register Map (Continued) File Name ADR Bit Reset 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 dsPIC30F Family Reference Manual DS70070C-page 23-28 © 2005 Microchip Technology Inc. 23.3 CAN Module Features The CAN module is a communication controller implementing the CAN 2.0A/B protocol as defined in the BOSCH specification. The module will support CAN 1.2, CAN 2.0A, CAN 2.0B Passive and CAN 2.0B Active versions of the protocol. The module implementation is a Full CAN system. The module features are as follows: • Implementation of the CAN protocol CAN 1.2, CAN 2.0A and CAN 2.0B • Standard and extended data frames • Data length from 0-8 bytes • Programmable bit rate up to 1 Mbit/sec • Support for remote data frames • Double buffered receiver with two prioritized received message storage buffers • Six full (standard/extended identifier) acceptance filters, 2 associated with the high priority receive buffer, and 4 associated with the low priority receive buffer • Two full acceptance filter masks, one each associated with the high and low priority receive buffers • Three Transmit Buffers with application specified prioritization and abort capability • Programmable wake-up functionality with integrated low-pass filter • Programmable Loopback mode supports self-test operation • Signaling via interrupt capabilities for all CAN receiver and transmitter error states • Programmable clock source • Programmable link to input capture module for time-stamping and network synchronization • Low power Sleep mode © 2005 Microchip Technology Inc. DS70070C-page 23-29 Section 23. CAN CAN Module 23 23.4 CAN Module Implementation The CAN bus module consists of a Protocol Engine and message buffering and control. The Protocol Engine can best be understood by defining the types of data frames to be transmitted and received by the module. These blocks are shown in Figure 23-2. Figure 23-2: CAN Buffers and Protocol Engine Block Diagram Acceptance Filter RXF2 R X B 1 A c c e p t A c c e p t Identifier Data Field Data Field Identifier Acceptance Mask RXM1 Acceptance Filter RXF3 Acceptance Filter RXF4 Acceptance Filter RXF5 Acceptance Mask RXM0 Acceptance Filter RXF0 Acceptance Filter RXF1 R X B 0 MSGREQ TXB2 TXABT TXLARB TXERR MTXBUFF MESSAGE Message Queue Control Transmit Byte Sequencer MSGREQ TXB1 MSGREQ TXABT TXLARB TXERR MTXBUFF MESSAGE TXB0 TXABT TXLARB TXERR MTXBUFF MESSAGE Transmit Shift Receive Shift Receive Error Transmit Error Protocol RERRCNT TERRCNT ErrPas BusOff Finite State Machine Counter Counter Transmit Logic Bit Timing Logic CxTX CxRX Bit Timing Generator PROTOCOL ENGINE BUFFERS CRC Generator CRC Check Note: x = 1 or 2 Message Assembly Buffer dsPIC30F Family Reference Manual DS70070C-page 23-30 © 2005 Microchip Technology Inc. 23.4.1 CAN Message Formats The CAN protocol engine handles all functions for receiving and transmitting messages on the CAN bus. Messages are transmitted by first loading the appropriate data registers. Status and errors can be checked by reading the appropriate registers. Any message detected on the CAN bus is checked for errors and then matched against filters to see if it should be received and stored in one of the two receive registers. The CAN Module supports the following frame types: • Standard Data Frame • Extended Data Frame • Remote Frame • Error Frame • Interframe Space 23.4.1.1 Standard Data Frame A standard data frame is generated by a node when the node wishes to transmit data. The standard CAN data frame is shown in Figure 23-3. In common with all other frames, the frame begins with a Start-Of-Frame bit (SOF - dominant state) for hard synchronization of all nodes. The SOF is followed by the Arbitration field consisting of 12 bits, the 11-bit identifier (reflecting the contents and priority of the message) and the RTR bit (Remote Transmission Request bit). The RTR bit is used to distinguish a data frame (RTR - dominant) from a remote frame. The next field is the Control field, consisting of 6 bits. The first bit of this field is called the Identifier Extension (IDE) bit and is at dominant state to specify that the frame is a standard frame. The following bit is reserved by the CAN protocol, RB0, and defined as a dominant bit. The remaining 4 bits of the Control field are the Data Length Code (DLC) and specify the number of bytes of data contained in the message. The data being sent follows in the Data field which is of the length defined by the DLC above (0-8 bytes). The Cyclic Redundancy Check (CRC) field follows and is used to detect possible transmission errors. The CRC field consists of a 15-bit CRC sequence and a delimiter bit. The message is completed by the End-Of-Frame (EOF) field, which consists of seven recessive bits with no bit-stuffing. The final field is the Acknowledge field. During the ACK Slot bit the transmitting node sends out a recessive bit. Any node that has received an error free frame acknowledges the correct reception of the frame by sending back a dominant bit (regardless of whether the node is configured to accept that specific message or not). The recessive Acknowledge Delimiter completes the Acknowledge Slot and may not be overwritten by a dominant bit, except when an error frame occurs. 23.4.1.2 Extended Data Frame In the extended CAN data frame, shown in Figure 23-4, the Start-Of-Frame bit (SOF) is followed by the Arbitration Field consisting of 38 bits. The first 11 bits are the 11 Most Significant bits of the 29-bit identifier (“Base-lD”). These 11 bits are followed by the Substitute Remote Request bit (SRR), which is transmitted as recessive. The SRR is followed by the lDE bit which is recessive to denote that the frame is an extended CAN frame. It should be noted from this, that if arbitration remains unresolved after transmission of the first 11 bits of the identifier, and one of the nodes involved in arbitration is sending a standard CAN frame (11-bit identifier), then the standard CAN frame will win arbitration due to the assertion of a dominant lDE bit. Also, the SRR bit in an extended CAN frame must be recessive to allow the assertion of a dominant RTR bit by a node that is sending a standard CAN remote frame. The SRR and lDE bits are followed by the remaining 18 bits of the identifier (“lD-Extension”) and a dominant Remote Transmission Request bit. © 2005 Microchip Technology Inc. DS70070C-page 23-31 Section 23. CAN CAN Module 23 To enable standard and extended frames to be sent across a shared network, it is necessary to split the 29-bit extended message identifier into 11-bit (Most Significant) and 18-bit (Least Significant) sections. This split ensures that the Identifier Extension bit (lDE) can remain at the same bit position in both standard and extended frames. The next field is the Control field, consisting of 6 bits. The first 2 bits of this field are reserved and are at dominant state. The remaining 4 bits of the Control field are the Data Length Code (DLC) and specify the number of data bytes. The remaining portion of the frame (Data field, CRC field, Acknowledge field, End-Of-Frame and intermission) is constructed in the same way as for a standard data frame. 23.4.1.3 Remote Frame A data transmission is usually performed on an autonomous basis with the data source node (e.g., a sensor sending out a data frame). It is possible however for a destination node to request the data from the source. For this purpose, the destination node sends a “remote frame” with an identifier that matches the identifier of the required data frame. The appropriate data source node will then send a data frame as a response to this remote request. There are two differences between a remote frame and a data frame, shown in Figure 23-5. First, the RTR bit is at the recessive state and second there is no Data field. In the very unlikely event of a data frame and a remote frame with the same identifier being transmitted at the same time, the data frame wins arbitration due to the dominant RTR bit following the identifier. In this way, the node that transmitted the remote frame receives the desired data immediately. 23.4.1.4 The Error Frame An error frame is generated by any node that detects a bus error. An error frame, shown in Figure 23-6, consists of 2 fields, an error flag field followed by an Error Delimiter field. The Error Delimiter consists of 8 recessive bits and allows the bus nodes to restart bus communications cleanly after an error. There are two forms of error flag fields. The form of the error flag field depends on the error status of the node that detects the error. If an error-active node detects a bus error then the node interrupts transmission of the current message by generating an active error flag. The active error flag is composed of six consecutive dominant bits. This bit sequence actively violates the bit-stuffing rule. All other stations recognize the resulting bit-stuffing error and in turn generate error frames themselves, called Error Echo Flags. The error flag field therefore consists of between six and twelve consecutive dominant bits (generated by one or more nodes). The Error Delimiter field completes the error frame. After completion of the error frame, bus activity retains to normal and the interrupted node attempts to resend the aborted message. If an error passive node detects a bus error then the node transmits an Error Passive flag followed, again, by the Error Delimiter field. The Error Passive flag consists of six consecutive recessive bits. From this it follows that, unless the bus error is detected by the transmitting node or other error active receiver that is actually transmitting, the transmission of an error frame by an error passive node will not affect any other node on the network. If the bus master node generates an error passive flag then this may cause other nodes to generate error frames due to the resulting bit-stuffing violation. After transmission of an error frame, an error passive node must wait for 6 consecutive recessive bits on the bus before attempting to rejoin bus communications. 23.4.1.5 The Interframe Space Interframe Space separates a proceeding frame (of whatever type) from a following data or remote frame. lnterframe Space is composed of at least 3 recessive bits, called the intermission. This is provided to allow nodes time for internal processing of the message by receiving nodes before the start of the next message frame. After the intermission, the bus line remains in the recessive state (bus idle) until the next transmission starts. If the transmitting node is in the error passive state, an additional 8 recessive bit times will be inserted in the Interframe Space before any other message is transmitted by that node. This time period is called the Suspend Transmit field. The Suspend Transmit field allows additional delay time for other transmitting nodes to take control of the bus. dsPIC30F Family Reference Manual DS70070C-page 23-32 © 2005 Microchip Technology Inc. Figure 23-3: Standard Data Frame 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 Start-Of-Frame Data Frame (number of bits = 44 + 8 N) 12 Arbitration Field ID 10 11 ID3 ID0 Identifier Message Filtering Stored in Buffers RTR IDE RB0 DLC3 DLC0 6 4 Control Field Data Length Code Reserved Bits 8 N (≤ N ≤ 8) Data Field 8 8 Stored in Transmit/Receive Buffers Bit-Stuffing 16 CRC Field 15 CRC 7 End-OfFrame CRC Del Acknowledgment ACK Del 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 © 2005 Microchip Technology Inc. DS70070C-page 23-33 Section 23. CAN CAN Module 23 Figure 23-4: Extended Data Format 1 1 1 1 1 0 bus Idle Start-Of-Frame Data Frame or Remote Frame 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 Start-Of-Frame Arbitration Field 32 11 ID10 ID3 ID0 IDE Identifier Message Filtering Stored in Buffers SRR EID17 EID0 RTR RB1 RB0 DLC3 18 DLC0 6 Control Field 4 Reserved bitsData Length CodeStored in Transmit/Receive Buffers 8 8 Extended Data Frame (number of bits = 64 + 8 N) 8 N (N ≤ 8) Data Field 1 1 1 1 1 1 1 1 16 CRC Field 15 CRC CRC Del Acknowledgment ACK Del End-OfFrame 7 Bit-Stuffing 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 Extended Identifier 1 dsPIC30F Family Reference Manual DS70070C-page 23-34 © 2005 Microchip Technology Inc. Figure 23-5: Remote Data Frame Identifier Message Filtering Stored in Buffers Data Length Code Reserved Bits Bit-Stuffing 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 0 1 0 0 1 1 1 1 1 1 1 1 1 Start-Of-Frame Remote Frame (number of bits = 44) 12 Arbitration Field ID 10 11 ID0 RTR IDE RB0 DLC3 DLC0 6 4 Control Field 16 CRC Field 15 CRC 7 End-OfFrame CRC Del Acknowledgment ACK Del 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 © 2005 Microchip Technology Inc. DS70070C-page 23-35 Section 23. CAN CAN Module 23 Figure 23-6: Error Frame 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 0 0 0 0 Start-Of-Frame Interrupted Data Frame 12 Arbitration Field ID 10 11 ID3 ID0 Identifier Message Filtering RTR IDE RB0 DLC3 DLC0 6 4 Control Field Data Length Code Reserved Bits 8N (≤ N ≤ 8) Data Field 8 8 Bit-Stuffing 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Star-Of-Frame Data Frame or Remote Frame 3 8 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 Data Frame or Remote Frame Error Frame 6 Error Flag ≤ 6 Echo Error Flag 8 Error Delimiter Inter-Frame Space dsPIC30F Family Reference Manual DS70070C-page 23-36 © 2005 Microchip Technology Inc. 23.5 CAN Module Operation Modes The CAN Module can operate in one of several Operation modes selected by the user. These modes include: • Normal Operation mode • Disable mode • Loopback mode • Listen Only mode • Configuration mode • Listen to All Messages mode Modes are requested by setting the REQOP<2:0> bits (CiCTRL<10:8>). Entry into a mode is acknowledged by monitoring the OPMODE<2:0> bits (CiCTRL<7:5>). The module does not change the mode and the OPMODE bits until a change in mode is acceptable, generally during bus idle time which is defined as at least 11 consecutive recessive bits. 23.5.1 Normal Operation Mode Normal Operating mode is selected when REQOP<2:0> = ‘000’. In this mode, the module is activated, the I/O pins will assume the CAN bus functions. The module will transmit and receive CAN bus messages as described in subsequent sections. 23.5.2 Disable Mode In Disable mode, the module will not transmit or receive. The module has the ability to set the WAKIF bit due to bus activity, however any pending interrupts will remain and the error counters will retain their value. If the REQOP<2:0> bits (CiCTRL<10:8>) = ‘001’, the module will enter the Module Disable mode. This mode is similar to disabling other peripheral modules by turning off the module enables. This causes the module internal clock to stop unless the module is active (i.e., receiving or transmitting a message). If the module is active, the module will wait for 11 recessive bits on the CAN bus, detect that condition as an idle bus, then accept the module disable command. When the OPMODE<2:0> bits (CiCTRL<7:5>) = ‘001’, this indicates that the module successfully entered Module Disable mode (see Figure 23-7). The WAKIF interrupt is the only module interrupt that is still active in the Module Disable mode. If the WAKIE bit (CiINTE<6>) is set, the processor will receive an interrupt whenever the CAN bus detects a dominant state, as occurs with a Start-Of-Frame (SOF). The I/O pins will revert to normal I/O function when the module is in the Module Disable mode. Note: Typically, if the CAN module is allowed to transmit in a particular mode of operation and a transmission is requested immediately after the CAN module has been placed in that mode of operation, the module waits for 11 consecutive recessive bits on the bus before starting transmission. If the user switches to Disable Mode within this 11-bit period, then this transmission is aborted and the corresponding TXABT bit is set and TXREQ bit is cleared. © 2005 Microchip Technology Inc. DS70070C-page 23-37 Section 23. CAN CAN Module 23 Figure 23-7: Entering and Exiting Module Disable Mode 23.5.3 Loopback Mode If the Loopback mode is activated, the module will connect the internal transmit signal to the internal receive signal at the module boundary. The transmit and receive pins revert to their PORT I/O function. The transmitter will receive an acknowledge for its sent messages. Special hardware will generate an acknowledge for the transmitter. 23.5.4 Listen Only Mode Listen Only mode and Loopback modes are special cases of Normal Operation mode to allow system debug. If the Listen Only mode is activated, the module on the CAN bus is passive. The transmitter buffers revert to the PORT I/O function. The receive pins remain as inputs to the CAN module. For the receiver, no error flags or Acknowledge signals are sent. The error counters are deactivated in this state. The Listen Only mode can be used for detecting the baud rate on the CAN bus. To use this, it is necessary that there are at least two further nodes that communicate with each other. The baud rate can be detected empirically by testing different values. This mode is also useful as a bus monitor without influencing the data traffic. 1 2 4 5 - Processor writes REQOP<2:0> while module receiving/transmitting message. Module continues with CAN message. - Module detects 11 recessive bits. Module acknowledges Disable mode and sets OPMODE<2:0> bits. Module disables. - Processor writes REQOP<2:0> during CAN bus activity. Module waits for 11 recessive bits before accepting activate. - Module detects 11 recessive bits. Module acknowledges Normal mode and sets OPMODE<2:0> bits. Module activates. OSC1 CAN bus CAN Module Disabled 3 001 000 001 000 000 000 - CAN bus message will set WAKIF bit. If WAKIE = ’1’, processor will vector to the interrupt address. CAN message ignored. WAKIF WAKIE 1 2 3 4 5 OPMODE<2:0> REQOP<2:0> dsPIC30F Family Reference Manual DS70070C-page 23-38 © 2005 Microchip Technology Inc. 23.5.5 Configuration Mode In the Configuration mode, the module will not transmit or receive. The error counters are cleared and the interrupt flags remain unchanged. The programmer will have access to configuration registers that are access restricted in other modes. After a device Reset the CAN module is in the Configuration mode (OPMODE<2:0> = ‘100’). The error counters are cleared and all registers contain the Reset values. It should be ensured that the initialization is performed before REQOP<2> bit is cleared. The CAN module has to be initialized before its activation. This is only possible if the module is in the Configuration mode. The Configuration mode is requested by setting the REQOP<2> bit. Only when the Status bit OPMODE<2> has a high level, the initialization can be performed. Afterwards the configuration registers and the acceptance mask registers and the acceptance filter registers can be written. The module is activated by clearing the control bits REQOP<2:0>. The module will protect the user from accidentally violating the CAN protocol through programming errors. All registers which control the configuration of the module can not be modified while the module is on-line. The CAN module will not be allowed to enter the Configuration mode while a transmission is taking place. The Configuration mode serves as a lock to protect the following registers. • All Module Control Registers • Baud Rate and Interrupt Configuration Registers • Bus Timing Registers • Identifier Acceptance Filter Registers • Identifier Acceptance Mask Registers 23.5.6 Listen All Messages Mode Listen All Messages mode is a special case of Normal Operation mode to allow system debug. If the Listen All Messages mode is activated, the module on the CAN bus is passive. The transmitter buffers revert to the PORT I/O function. The receive pins remain inputs. For the receiver, no error flags or Acknowledge signals are sent. The error counters are deactivated in this state. The filters are disabled. Receive Buffer 0 will receive any message transferred on the bus. This mode is useful to record all bus traffic as a bus monitor without influencing the data traffic. © 2005 Microchip Technology Inc. DS70070C-page 23-39 Section 23. CAN CAN Module 23 23.6 Message Reception This subsection describes CAN module message reception. 23.6.1 Receive Buffers The CAN bus module has 3 receive buffers. However, one of the receive buffers is always committed to monitoring the bus for incoming messages. This buffer is called the message assembly buffer, MAB. So there are 2 receive buffers visible, RXB0 and RXB1, that can essentially instantaneously receive a complete message from the protocol engine. The CPU can be operating on one while the other is available for reception or holding a previously received message. The MAB holds the destuffed bit stream from the bus line to allow parallel access to the whole data or remote frame for the acceptance match test and the parallel transfer of the frame to the receive buffers. The MAB will assemble all messages received. These messages will be transferred to the RXBn buffers only if the acceptance filter criterion are met. When a message is received, the RXnIF flag (CiINTF<0> or CiINRF<1>) will be set. This bit can only be set by the module when a message is received. The bit is cleared by the CPU when it has completed processing the message in the buffer. This bit provides a positive lockout to ensure that the CPU has finished with the message buffer. If the RXnIE bit (CiINTE<0> or CiINTE<1>) is set , an interrupt will be generated when a message is received. There are 2 programmable acceptance filter masks associated with the receive buffers, one for each buffer. When the message is received, the FILHIT bits (CiRX0CON<0> for Receive Buffer 0 and CiRX1CON<2:0> for Receive Buffer 1) indicate the acceptance criterion for the message. The number of the acceptance filter that enabled the reception will be indicated as well as a Status bit that indicates that the received message is a remote transfer request. Note: In the case of Receive Buffer 0, a limited number of Acceptance Filters can be used to enable a reception. A single bit, FILHIT0 (CiRX0CON<0>) determines which of the 2 filters, RXF0 or RXF1, enabled the message reception. dsPIC30F Family Reference Manual DS70070C-page 23-40 © 2005 Microchip Technology Inc. 23.6.1.1 Receive Buffer Priority To provide flexibility, there are several acceptance filters corresponding to each receive buffer. There is also an implied priority to the receive buffers. RXB0 is the higher priority buffer and has 2 message acceptance filters associated with it. RXB1 is the lower priority buffer and has 4 acceptance filters associated with it. The lower number of possible acceptance filters makes the match on RXB0 more restrictive and implies the higher priority associated with that buffer. Additionally, if the RXB0 contains a valid message, and another valid message is received, the RXB0 can be setup such that it will not overrun and the new message for RXB0 will be placed into RXB1. Figure 23-8 shows a block diagram of the receive buffer, while Figure 23-9 shows a flow chart for a receive operation. Figure 23-8: The Receive Buffers Acceptance Mask RXM1 Acceptance Filter RXF2 Acceptance Filter RXF3 Acceptance Filter RXF4 Acceptance Filter RXF5 R X B 1 R X B 0 Acceptance Mask RXM0 Acceptance Filter RXF0 Acceptance Filter RXF1 A c c e p A t c c e p t Identifier Data Field Data Field Message Identifier Assembly Buffer © 2005 Microchip Technology Inc. DS70070C-page 23-41 Section 23. CAN CAN Module 23 Figure 23-9: Receive Flowchart START Detect Start of Message ? Valid Message Received ? Generate Error Message Identifier meets a filter criteria ? Is RXFUL = 0 ? Go to Start Move message into RXB0 Set RXFUL = 1 Set FILHIT<2:0> Is RXFUL = 0 ? Move message into RXB1 Set RXFUL = 1 Yes, meets criteria for RXB0 Yes, meets criteria for RXB1 No Generate Interrupt Yes Yes No No Yes Yes No No Yes Yes Frame The RXFUL bit determines if the receive register is empty and able to accept a new message. No Yes No Generate Overrun Error: Begin Loading Message into Message Assembly Buffer (MAB) was met Is RXnIE = 1 ? Does RXnIE = 1 ? Is DBEN = 1 ? The DBEN bit determines if RXB0 can roll over into RXB1 if it is full. Set RX0OVR Generate Overrun Error: Set RX1OVR Does ERRIE=1 ? No Go to Start Yes Set FILHIT<0> No according to which filter criteria was met Set ICODE<3:0> according to which receive buffer the message was loaded into according to which filter criteria dsPIC30F Family Reference Manual DS70070C-page 23-42 © 2005 Microchip Technology Inc. 23.6.2 Message Acceptance Filters The message acceptance filters and masks are used to determine if a message in the message assembly buffer should be loaded into either of the receive buffers. Once a valid message has been received into the Message Assembly Buffer (MAB), the identifier fields of the message are compared to the filter values. If there is a match, that message will be loaded into the appropriate receive buffer. The filter masks are used to determine which bits in the identifiers are examined with the filters. A truthtable is shown in Table 23-3 that indicates how each bit in the identifier is compared to the masks and filters to determine if the message should be loaded into a receive buffer. The mask bit essentially determines which bits to apply the filter to. If any mask bit is set to a zero, then that bit will automatically be accepted regardless of the filter bit. Table 23-3: Filter/Mask Truth Table 23.6.2.1 Identifier Mode Selection The EXIDE control bits (CiRXFnSID<0>) and the MIDE control bits (CiRXMnSID<0>) enable an acceptance filter for standard or extended identifiers. The acceptance filters look at incoming messages for the RXIDE bit to determine how to compare the identifiers. If the RXIDE bit is clear, the message is a standard frame. If the RXIDE bit is set, the message is an extended frame. If the MIDE control bit for the filter is set, then the identifier type for the filter is determined by the EXIDE control bit for the filter. If the EXIDE control bit is cleared, then the filter will accept standard identifiers. If the EXIDE bit is set, then the filter will accept extended identifiers. Most CAN systems will use only standard identifiers or only extended identifiers. If the MIDE control bit for the filter is cleared, the filter will accept both standard and extended identifiers if a match occurs with the filter bits. This mode can be used in CAN systems that support both standard and extended identifiers on the same bus. 23.6.2.2 FILHIT Status Bits As shown in the Receive Buffers Block Diagram, Figure 23-8, RXF0 and RXF1 filters with the RXM0 mask are associated with RXB0. The filters RXF2, RXF3, RXF4 and RXF5 and the mask RXM1 are associated with RXB1. When a filter matches and a message is loaded into the receive buffer, the number of the filter that enabled the message reception is indicated in the CiRXnCON register via the FILHIT bits. The CiRX0CON register contains one FILHIT Status bit to indicate whether the RXF0 or the RXF1 filter enabled the message reception. The CiRX1CON register contains the FILHIT<2:0> bits. They are coded as shown in Table 23-4. Mask Bit n Filter Bit n Message Identifier bit Accept or Reject bit n 0x x Accept 10 0 Accept 10 1 Reject 11 0 Reject 11 1 Accept Legend: x = don’t care © 2005 Microchip Technology Inc. DS70070C-page 23-43 Section 23. CAN CAN Module 23 Table 23-4: Acceptance Filter The DBEN bit (CiRX0CON<2>) allows the FILHIT bits to distinguish a hit on filter RXF0 and RXF1 in either RXB0 or overrun into RXB1. 111 = Acceptance Filter 1 (RXF1) 110 = Acceptance Filter 0 (RXF0) 001 = Acceptance Filter 1 (RXF1) 000 = Acceptance Filter 0 (RXF0) If the DBEN bit is clear, there are 6 codes corresponding to the 6 filters. If the DBEN bit is set, there are 6 codes corresponding to the 6 filters plus 2 additional codes corresponding to RXF0 and RXF1 filters overrun to RXB1. If more than 1 acceptance filter matches, the FILHIT bits will encode the lowest binary value of the filters that matched. In other words, if filter 2 and filter 4 match, FILHIT will code the value for 2. This essentially prioritizes the acceptance filters with lower numbers having priority. Figure 23-10 shows a block diagram of the message acceptance filters. Figure 23-10: Message Acceptance Filter FILHIT<2:0> Acceptance Filter Comment 000(1) RXF0 Only if DBEN = 1 001(1) RXF1 Only if DBEN = 1 010 RXF2 — 011 RXF3 — 100 RXF4 — 101 RXF5 — Note 1: Is only valid if the DBEN bit is set. Acceptance Filter Register Acceptance Mask Register RxRqst Message Assembly Buffer RXFn0 RXFn1 RXFnn RXMn0 RXMn1 RXMnn Identifier dsPIC30F Family Reference Manual DS70070C-page 23-44 © 2005 Microchip Technology Inc. 23.6.3 Receiver Overrun An overrun condition occurs when the Message Assembly Buffer (MAB) has assembled a valid received message, the message is accepted through the acceptance filters, and when the receive buffer associated with the filter has not been designated as clear of the previous message. The overrun error flag, RXnOVR (CiINTF<15> or CiINTF<14>) and the ERRIF bit (CiINTF<5>) will be set and the message in the MAB will be discarded. While in the overrun situation, the module will stay synchronized with the CAN bus and is able to transmit messages, but it will discard all incoming messages destined for the overflowed buffer. If the DBEN bit is clear, RXB1 and RXB0 operate independently. When this is the case, a message intended for RXB0 will not be diverted into RXB1 if RXB0 contains an unread message and the RX0OVR bit will be set. If the DBEN bit is set, the overrun for RXB0 is handled differently. If a valid message is received for RXB0 and RXFUL = 1 (CiRX0CON<7>) indicating that RXB0 is full, and RXFUL = 0 (CiRX1CON<7>) indicating that RXB1 is empty, the message for RXB0 will be loaded into RXB1. An overrun error will not be generated for RXB0. If a valid message is received for RXB0 and RXFUL = 1, and RXFUL = 1 indicating that both RXB0 and RXB1 are full, the message will be lost and an overrun will be indicated for RXB1. If the DBEN bit is clear, there are six codes corresponding to the six filters. If the DBEN bit is set, there are six codes corresponding to the six filters plus two additional codes corresponding to RXF0 and RXF1 filters overrun to RXB1. These codes are given in Table 23-5. Table 23-5: Buffer Reception and Overflow Truth Table Message Matches Filter 0 or 1 Message Matches Filter 2,3,4,5 RXFUL0 Bit RXFUL1 Bit DBEN Bit Action Results 0 0 X XX None No message received 0 1 X 0X MAB → RXB1 Message for RXB1, RXB1 available 0 1 X 1X MAB discarded RX1OVR = 1 Message for RXB1, RXB1 full 1 0 0 XX MAB → RXB0 Message for RXB0, RXB0 available 1 0 1 X0 MAB discarded RX0OVR = 1 Message for RXB0, RXB0 full, DBEN not enabled 1 0 1 01 MAB → RXB1 Message for RXB0, RXB0 full, DBEN enabled, RXB1 available 1 0 1 11 MAB discarded RX1OVR = 1 Message for RXB0, RXB0 full, DBEN enabled, RXB1 full 1 1 0 XX MAB → RXB0 Message for RXB0 and RXB1, RXB0 available 1 1 1 X0 MAB discarded RX0OVR = 1 Message for RXB0 and RXB1, RXB0 full, DBEN not enabled 0 0 X XX None No message received 0 1 X 0X MAB → RXB1 Message for RXB1, RXB1 available Legend: X = Don’t care © 2005 Microchip Technology Inc. DS70070C-page 23-45 Section 23. CAN CAN Module 23 23.6.4 Effects of a Reset Upon any Reset the CAN module has to be initialized. All registers are set according to the Reset values. The content of a received message is lost. The initialization is discussed in Section 23.5.5 “Configuration Mode”. 23.6.5 Receive Errors The CAN module will detect the following receive errors: • Cyclic Redundancy Check (CRC) Error • Bit Stuffing Error • Invalid message receive error These receive errors do not generate an interrupt. However, the receive error counter is incremented by one in case one of these errors occur. The RXWAR bit (CiINTF<9>) indicates that the Receive Error Counter has reached the CPU warning limit of 96 and an interrupt is generated. 23.6.5.1 Cyclic Redundancy Check (CRC) Error With the Cyclic Redundancy Check, the transmitter calculates special check bits for the bit sequence from the start of a frame until the end of the data field. This CRC sequence is transmitted in the CRC Field. The receiving node also calculates the CRC sequence using the same formula and performs a comparison to the received sequence. If a mismatch is detected, a CRC error has occurred and an Error Frame is generated. The message is repeated. The receive error interrupt counter is incremented by one. An Interrupt will only be generated if the error counter passes a threshold value. 23.6.5.2 Bit Stuffing Error If, between the Start -Of-Frame and the CRC Delimiter, 6 consecutive bits with the same polarity are detected, the bit-stuffing rule has been violated. A bit-stuffing error occurs and an error frame is generated. The message is repeated. No interrupt will be generated upon this event. 23.6.5.3 Invalid Message Received Error If any type of error occurs during reception of a message, an error will be indicated by the IVRIF bit (CiINTF<7>). This bit can be used (optionally with an interrupt) for autobaud detection with the device in Listen Only mode. This error is not an indicator that any action needs to be taken, but it does indicate that an error has occurred on the CAN bus. 23.6.5.4 Rules for Modifying the Receive Error Counter The Receive Error Counter is modified according to the following rules: • When the receiver detects an error, the Receive Error Counter is incremented by 1, except when the detected error was a bit error during the transmission of an active error flag. • When the receiver detects a “dominant” bit as the first bit after sending an error flag, the Receive Error Counter will be incremented by 8. • If a receiver detects a bit error while sending an active error flag, the Receive Error Counter is incremented by 8. • Any node tolerates up to 7 consecutive “dominant” bits after sending an active error flag or passive error flag. After detecting the 14th consecutive “dominant” bit (in case of an Active error flag) or after detecting the 8th consecutive “dominant” bit following a passive error flag, and after each sequence of eight additional consecutive “dominant” bits, every transmitter increases its Transmission Error Counter and every receiver increases its Receive Error Counter by 8. • After a successful reception of a message (reception without error up to the ACK slot and the successful sending of the ACK bit), the Receive Error Counter is decreased by one, if the Receive Error Counter was between 1 and 127. If the Receive Error Counter was ‘0’, it will stay ‘0’. If the Receive Error Counter was greater than 127, it will change to a value between 119 and 127. dsPIC30F Family Reference Manual DS70070C-page 23-46 © 2005 Microchip Technology Inc. 23.6.6 Receive Interrupts Several Interrupts are linked to the message reception. The receive interrupts can be broken up into two separate groups: • Receive Error Interrupts • Receive interrupts 23.6.6.1 Receive Interrupt A message has been successfully received and loaded into one of the receive buffers. This interrupt is activated immediately after receiving the End-Of-Frame (EOF) field. Reading the RXnIF flag will indicate which receive buffer caused the interrupt. Figure 23-11 depicts when the receive buffer interrupt flag RXnIF will be set. 23.6.6.2 Wake-up Interrupt The Wake-up interrupt sequences are described in Section 23.13.1 “Operation in Sleep Mode”. © 2005 Microchip Technology Inc. DS70070C-page 23-47 Section 23. CAN CAN Module 23 Figure 23-11: Receive Buffer Interrupt Flag SOF ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 RTR IDE RB0 DLC3 DLC2 STUFF DLC1 DLC0 CRC14 CRC13 CRC12 CRC11 CRC10 CRC9 CRC8 CRC7 CRC6 CRC5 CRC4 CRC3 CRC2 CRC1 CRC0 CRCDEL ACK SIST BIT ACK DELIMITER EOF EOF EOF EOF EOF EOF EOF ID0 Receive Buffer Interrupt Flag Data CAN bit Timing CAN bit Names dsPIC30F Family Reference Manual DS70070C-page 23-48 © 2005 Microchip Technology Inc. 23.6.6.3 Receive Error Interrupts A receive error interrupt will be indicated by the ERRIF bit (CiINTF<5>). This bit shows that an error condition occurred. The source of the error can be determined by checking the bits in the CAN Interrupt Status Register CiINTF. The bits in this register are related to receive and transmit errors. The following subsequences will show which flags are linked to the receive errors. 23.6.6.3.1 Invalid Message Received Interrupt If any type of error occurred during reception of the last message, an error will be indicated by the IVRIF bit (CiINTF<7>). The specific error that occurred is unknown. This bit can be used (optionally with an interrupt) for autobaud detection with the device in Listen Only mode. This error is not an indicator that any action needs to be taken, but an indicator that an error has occurred on the CAN bus. 23.6.6.3.2 Receiver Overrun Interrupt The RXnOVR bit (CiINTF<15>, CiINTF<14>) indicates that an overrun condition occurred for the receive buffer. An overrun condition occurs when the Message Assembly Buffer (MAB) has assembled a valid received message, the message is accepted through the acceptance filters, however, the receive buffer associated with the filter is not clear of the previous message. The overflow error interrupt will be set and the message is discarded. While in the overrun situation, the module will stay synchronized with the CAN bus and is able to transmit and receive messages. 23.6.6.4 Receiver Warning Interrupt The RXWAR bit (CiINTF<8>) indicates that the Receive Error Counter has reached the CPU warning limit of 96. When RXWAR transitions from a ‘0’ to a ‘1’, it will cause the Error Interrupt Flag ERRIF to become set. This bit cannot be manually cleared, as it should remain an indicator that the Receive Error Counter has reached the CPU warning limit of 96. The RXWAR bit will become clear automatically if the Receive Error Counter becomes less than or equal to 95. The ERRIF bit can be manually cleared allowing the interrupt service routine to be exited without affecting the RXWAR bit. 23.6.6.5 Receiver Error Passive The RXEP bit (CiINTF<11>) indicates that the Receive Error Counter has exceeded the Error Passive limit of 127 and the module has gone to Error Passive state. When the RXEP bit transitions from a ‘0’ to a ‘1’, it will cause the error interrupt flag to become set. The RXEP bit cannot be manually cleared, as it should remain an indicator that the bus is in Error State Passive. The RXEP bit will become clear automatically if the Receive Error Counter becomes less than or equal to 127. The ERRIF bit can be manually cleared allowing the interrupt service routine to be exited without affecting the RXEP bit. © 2005 Microchip Technology Inc. DS70070C-page 23-49 Section 23. CAN CAN Module 23 23.7 Transmission This subsection describes how the CAN module is used to transmit CAN messages. 23.7.1 Real Time Communication and Transmit Message Buffering For an application to effectively transmit messages in real-time, the CAN nodes must be able to dominate and hold the bus, assuming that nodes messages are of a high enough priority to win arbitration on the bus. If a node only has 1 transmission buffer, it must transmit a message, then release the bus while the CPU reloads the buffer. If a node has two transmission buffers, one buffer could be transmitting while the second buffer is being reloaded. However, the CPU would need to maintain tight tracking of the bus activity to ensure that the second buffer is reloaded before the first message completes. Typical applications require three transmit message buffers. With three buffers, one buffer can be transmitting, the second buffer can be ready to transmit as soon as the first is complete, and the third can be reloaded by the CPU. This eases the burden of the software to maintain synchronization with the bus (see Figure 23-12). Additionally, the three buffers allow some degree of prioritizing of the outgoing messages. For example, the application software may have a message enqueued in the second buffer while it is working on the third buffer. The application may require that the message going into the third buffer is of higher importance than the one already enqueued. If only 2 buffers are available, the enqueued message would have to be deleted and replaced with the third. The process of deleting the message may mean losing control of the bus. With 3 buffers, both the second and the third message can be enqueued, and the module can be instructed that the third message is higher priority than the second. The third message will be the next one sent followed by the second. 23.7.2 Transmit Message Buffers The CAN module has three Transmit Buffers. Each of the three buffers occupies 14 bytes of data. Eight of the bytes are the maximum 8 bytes of the transmitted message. Five bytes hold the standard and extended identifiers and other message arbitration information. The last byte is a control byte associated with each message. The information in this byte determines the conditions under which the message will be transmitted and indicates status of the transmission of the message. The TXnIF bit (CiINTF<2>, CiINTF<3> or CiINTF<4>) will be set and the TXREQ bit (CiTXnCON<3>) will be clear, indicating that the message buffer has completed a transmission. The CPU will then load the message buffer with the contents of the message to be sent. At a minimum, the standard identifier register CiTXnSID must be loaded. If data bytes are present in the message, the TXBnDm registers are loaded. If the message is to use extended identifiers, the CiTXnEID register and the EID<5:0> bits (CiTXnDLC<15:10>) are loaded and the TXIDE bit is set (CiTXnSID<0>). Prior to sending the message, the user must initialize the TXnIE bit (CiINTE<2>, CiINTE<3> or CiINTE<4>) to enable or disable an interrupt when the message is sent. The user must also initialize the transmit priority. Figure 23-12 shows a block diagram of the Transmit Buffers. dsPIC30F Family Reference Manual DS70070C-page 23-50 © 2005 Microchip Technology Inc. Figure 23-12: Transmit Buffers 23.7.3 Transmit Message Priority Transmit priority is a prioritization within each node of the pending transmittable messages. Prior to sending the SOF (Start-Of-Frame), the priorities of all buffers ready for transmission are compared. The Transmit Buffer with the highest priority will be sent first. For example, if Transmit Buffer 0 has a higher priority setting than Transmit Buffer 1, Buffer 0 will be sent first. If two buffers have the same priority setting, the buffer with the highest address will be sent. For example, if Transmit Buffer 1 has the same priority setting as Transmit Buffer 0, Buffer 1 will be sent first. There are 4 levels of transmit priority. If TXPRI<1:0> (CiTXnCON<1:0>) for a particular message buffer is set to ‘11’, that buffer has the highest priority. If TXPRI<1:0> for a particular message buffer is set to ‘10’ or ‘01’, that buffer has an intermediate priority. If TXPRI<1:0> for a particular message buffer is ‘00’, that buffer has the lowest priority. 23.7.4 Message Transmission To initiate transmitting the message, the TXREQ bit (CiTXnCON<3>) must be set. The CAN bus module resolves any timing conflicts between setting of the TXREQ bit and the SOF time, ensuring that if the priority was changed, it is resolved correctly before SOF. When TXREQ is set the TXABT (CiTXnCON<6>), TXLARB (CiTXnCON<5>) and TXERR (CiTXnCON<4>) flag bits will be cleared by the module. Setting TXREQ bit does not actually start a message transmission, it flags a message buffer as enqueued for transmission. Transmission will start when the module detects an available bus for SOF. The module will then begin transmission on the message which has been determined to have the highest priority. If the transmission completes successfully on the first try, the TXREQ bit will clear and an interrupt will be generated if the TXnIE bit (CiINTE<2>, CiINTE<3>, CiINTE<4>) is set. If the message fails to transmit, other condition flags will be set and the TXREQ bit will remain set indicating that the message is still pending for transmission. If the message tried to transmit but encountered an error condition, the TXERR bit (CiTXnCON<4>) will be set. In this case, the error condition can also cause an interrupt. If the message tried to transmit but lost arbitration, the TXLARB bit (CiTXnCON<5>) will be set. In this case, no interrupt is available to signal the loss of arbitration. TXREQ TXB0 TXABT TXLARB TXERR TXPRI MESSAGE Message Queue Control Transmit Byte Sequencer TXREQ TXB1 TXABT TXLARB TXERR TXPRI MESSAGE TXREQ TXB2 TXABT TXLARB TXERR TXPRI MESSAGE © 2005 Microchip Technology Inc. DS70070C-page 23-51 Section 23. CAN CAN Module 23 23.7.5 Transmit Message Aborting The system can abort a message by clearing the TXREQ bit associated with each message buffer. Setting the ABAT bit (CiCTRL<12>) will request an abort of all pending messages (see Figure 23-14). A queued message is aborted by clearing the TXREQ bit. Aborting a queued message is illustrated in Figure 23-13. If the message has not yet started transmission, or if the message started but is interrupted by loss of arbitration or an error; the abort will be processed. The abort is indicated when the module sets the TXABT bit (CiTXnCON<6>), and the TXnIF flag is not set. If the message has started to transmit, it will attempt to transmit the current message fully (see Figure 23-15). If the current message is transmitted fully, and is not lost to arbitration or an error, the TXABT bit will not be set, because the message was transmitted successfully. Likewise, if a message is being transmitted during an abort request, and the message is lost to arbitration (see Figure 23-16) or an error, the message will not be re-transmitted, and the TXABT bit will be set, indicating that the message was successfully aborted. Figure 23-13: Abort Queued Message 1 2 - Processor sets TXREQ while module receiving/transmitting message. Module continues with CAN message. - Processor clears TXREQ while module looking for 11 recessive bits. CAN bus 3 TXREQ - Another module takes the available transmit slot. CiTX TXnIF TXABT Module aborts pending transmission, sets TXABT bit in 2 clocks. 1 2 3 dsPIC30F Family Reference Manual DS70070C-page 23-52 © 2005 Microchip Technology Inc. Figure 23-14: Abort All Messages Figure 23-15: Failed Abort During Transmission 1 2 - Processor sets TXREQ while module receiving/transmitting message. Module continues with CAN message. - Processor sets ABAT while module looking for 11 recessive bits. Module clears TXREQ bits. CAN bus 3 TXREQ - Another module takes the available transmit slot. CiTX TXnIF TXABT ABAT Module aborts pending transmission, sets TXABT bit. 1 2 3 1 2 - Processor sets TXREQ while module receiving/transmitting message. Module continues with CAN message. - Module detects 11 recessive bits. Module begins transmission of queued message. CAN bus TXREQ - Processor clears TXREQ requesting message abort. Abort cannot be acknowledged. CiTX TXnIF TXABT 3 4 - At successful completion of transmission, TXREQ bit remains clear and TXnIF bit set. TXABT remains clear. 1 2 3 4 © 2005 Microchip Technology Inc. DS70070C-page 23-53 Section 23. CAN CAN Module 23 Figure 23-16: Loss of Arbitration During Transmission 1 2 4 5 - Processor sets TXREQ while module inactive. TXLARB bit cleared. - Module in inactive state. Module begins transmission of queued message. - Module waits for 11 recessive bits before re-trying transmission of queued message. - At successful completion of transmission, TXREQ bit cleared and TXnIF bit set. CAN bus 3 TXREQ - Message loses arbitration. Module releases bus and sets TXLARB bit. CiTX TXnIF TXLARB 1 2 3 4 5 dsPIC30F Family Reference Manual DS70070C-page 23-54 © 2005 Microchip Technology Inc. Figure 23-17: Transmit Flowchart START Is CAN bus available to start transmission No Examine TXPRI<1:0> to Are any TXREQ ? bits = 1 The message transmission sequence begins when the device determines that the TXREQ for any of the Transmit registers has been set. Clear: TXABT, TXLARB and TXERR Yes ? Does TXREQ = 0 ABAT = 1 Clearing the TXREQ bit while it is set, or setting the ABAT bit before the message has started transmission will abort the message. No Begin transmission (SOF) Abort Transmission: Was message transmitted successfully? No Yes Set TXREQ = 0 Is TXnIE = 1? Generate Interrupt Yes Yes Set TXABT = 1 Set Set TXERR = 1 Yes No Determine Highest Priority Message No ? Does TXLARB = 1? The TXnIE bit determines if an interrupt should be generated when a message is successfully transmitted. END Does TXREQ = 0 or TXABT =1 ? Yes No TXBUFE = 1 Yes A message can also be aborted if a message error or lost arbitration condition occurred during transmission. Arbitration lost during transmission © 2005 Microchip Technology Inc. DS70070C-page 23-55 Section 23. CAN CAN Module 23 23.7.6 Transmit Boundary Conditions The module handles transmit commands which are not necessarily synchronized to the CAN bus message framing time. 23.7.6.1 Clearing TXREQ bit as a Message Starts The TXREQ bit can be cleared just when a message is starting transmission, with the intent of aborting the message. If the message is not being transmitted, the TXABT bit will be set, indicating that the Abort was successfully processed. When the user clears the TXREQ bit and the TXABT bit is not set two cycles later, the message has already begun transmission. If the message is being transmitted, the abort is not immediately processed, at some point later, the TXnIF interrupt flag or the TXABT bit is set. If transmission has begun the message will only be aborted if either an error or a loss of arbitration occurs. 23.7.6.2 Setting TXABT bit as a Message Starts Setting the ABAT bit will abort all pending Transmit Buffers and has the function of clearing all of the TXREQ bits for all buffers. The boundary conditions are the same as clearing the TXREQ bit. 23.7.6.3 Clearing TXREQ bit as a Message Completes The TXREQ bit can be cleared when a message is just about to successfully complete transmission. Even if the TXREQ bit is cleared by the Data bus a short time before it will be cleared by the successful transmission of the message, the TXnIF flag will still be set due to the successful transmission. 23.7.6.4 Setting TXABT bit as a Message Completes The boundary conditions are the same as clearing the TXREQ bit. 23.7.6.5 Clearing TXREQ bit as a Message Loses Transmission The TXREQ bit can be cleared when a message is just about to be lost to arbitration or an error. If the TXREQ signal falls before the loss of arbitration signal or error signal, the result will be like clearing TXREQ during transmission. When the arbitration is lost or the error is set, the TXABT bit will be set, as it will see that an error has occurred while transmitting, and that the TXREQ bit was not set. If the TXREQ bit falls after the arbitration signal has entered the block, the result will be like clearing TXREQ during an inactive transmit time. The TXABT bit will be set. 23.7.6.6 Setting TXABT bit as a Message Loses Transmission The boundary conditions are the same as clearing the TXREQ bit. 23.7.7 Effects of a Reset Upon any Reset the CAN module has to be initialized. All registers are set according to the reset values. The content of a transmitted message is lost. The initialization is discussed in Section 23.5.5 “Configuration Mode”. dsPIC30F Family Reference Manual DS70070C-page 23-56 © 2005 Microchip Technology Inc. 23.7.8 Transmission Errors The CAN module will detect the following transmission errors: • Acknowledge Error • Form Error • Bit Error These transmission errors will not necessarily generate an interrupt but are indicated by the transmission error counter. However, each of these errors will cause the transmission error counter to be incremented by one. Once the value of the error counter exceeds the value of 96, the ERRIF (CiINTF<5>) and the TXWAR bit (CiINTF<10>) are set. Once the value of the error counter exceeds the value of 96 an interrupt is generated and the TXWAR bit in the error flag register is set. A transmission error example is illustrated in Figure 23-18. Figure 23-18: Error During Transmission 23.7.8.1 Acknowledge Error In the Acknowledge field of a message, the transmitter checks if the Acknowledge Slot (which it has sent out as a recessive bit) contains a dominant bit. If not, no other node has received the frame correctly. An acknowledge error has occurred and the message has to be repeated. No error frame is generated. 23.7.8.2 Form Error lf a transmitter detects a dominant bit in one of the four segments including End-Of-Frame, lnterframe Space, Acknowledge Delimiter or CRC Delimiter; then a form error has occurred and an error frame is generated. The message is repeated. 23.7.8.3 Bit Error A bit error occurs if a transmitter sends a dominant bit and detects a recessive bit. In the case where the transmitter sends a recessive bit and a dominant bit is detected during the Arbitration field and the Acknowledge Slot, no bit error is generated because normal arbitration is occurring. 1 2 4 5 - Processor sets TXREQ while module inactive. TXERR bit is cleared. - Module in inactive state. Module begins transmission of queued message. - Module waits for 11 recessive bits before re-trying transmission of queued message. - At successful completion of transmission, TXREQ bit cleared and TXnIF bit set. CAN bus 3 TXREQ - Module detects error during transmission, releases bus and sets TXERR bit. CiTX TXnIF TXERR 1 2 3 4 5 © 2005 Microchip Technology Inc. DS70070C-page 23-57 Section 23. CAN CAN Module 23 23.7.8.4 Rules for Modifying the Transmit Error Counter The Transmit Error Counter is modified according to the following rules: • When the transmitter sends an error flag the Transmit Error Counter is increased by 8 with the following exceptions. In these two exceptions, the Transmit Error Counter is not changed. - If the transmitter is “error passive” and detects an acknowledgment error because of not detecting a “dominant” ACK, and does not detect a “dominant” bit while sending a passive error flag. - If the transmitter sends an error flag because of a bit-stuffing error occurred during arbitration whereby the Stuffbit is located before the RTR bit, and should have been “recessive”, and has been sent as “recessive” but monitored as “dominant”. • If a transmitter detects a bit error while sending an active error flag the Transmit Error Counter is increased by 8. • Any Node tolerates up to 7 consecutive “dominant” bits after sending an active error flag or passive error flag. After detecting the 14th consecutive “dominant” bit (in case of an active error flag) or after detecting the 8th consecutive “dominant” following a passive error flag, and after each sequence of eight additional consecutive “dominant” bits, every transmitter increases its Transmission Error Counter and every receiver increases its Receive Error Counter by 8. • After the successful transmission of a message (getting an acknowledge and no error until End-Of-Frame is finished) the Transmit Error Counter is decreased by one unless it was already 0. 23.7.9 Transmission Interrupts There are several interrupts linked to the message transmission. The transmission interrupts can be broken up into two groups: • Transmission interrupts • Transmission error interrupts 23.7.9.1 Transmit Interrupt At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message for transmission. Reading the TXnIF flags in the CiINTF register will indicate which transmit buffer is available and caused the interrupt. dsPIC30F Family Reference Manual DS70070C-page 23-58 © 2005 Microchip Technology Inc. 23.7.9.2 Transmission Error Interrupts A transmission error interrupt will be indicated by the ERRIF flag. This flag shows that an error condition occurred. The source of the error can be determined by checking the error flags in the CAN Interrupt Status register CiINTF. The flags in this register are related to receive and transmit errors. The TXWAR bit (CiINTF<10>) indicates that the Transmit Error Counter has reached the CPU warning limit of 96. When this bit transitions from a ‘0’ to a ‘1’, it will cause the error interrupt flag to become set. The TXWAR bit cannot be manually cleared, as it should remain as an indicator that the Transmit Error Counter has reached the CPU warning limit of 96. The TXWAR bit will become clear automatically if the Transmit Error Counter becomes less than or equal to 95. The ERRIF flag can be manually cleared allowing the interrupt service routine to be exited without affecting the TXWAR bit. The TXEP bit (CiINTF<12>) indicates that the Transmit Error Counter has exceeded the Error Passive limit of 127 and the module has gone to Error Passive state. When this bit transitions froma ‘0’ to a ‘1’, it will cause the error interrupt flag to become set. The TXEP bit cannot be manually cleared, as it should remain as an indicator that the bus is in Error Passive state. The TXEP bit will become clear automatically if the Transmit Error Counter becomes less than or equal to 127. The ERRIF flag can be manually cleared allowing the interrupt service routine to be exited without affecting the TXEP bit. The TXBO bit (CiINTF<13>) indicates that the Transmit Error Counter has exceeded 255 and the module has gone to bus off state. When this bit transitions from a ‘0’ to a ‘1’, it will cause the error interrupt flag to become set. The TXBO bit cannot be manually cleared, as it should remain as an indicator that the bus is off. The ERRIF flag can be manually cleared allowing the interrupt service routine to be exited without affecting the TXBO bit. 23.8 Error Detection The CAN protocol provides sophisticated error detection mechanisms. The following errors can be detected. These errors are either receive or transmit errors. Receive errors are: • Cyclic Redundancy Check (CRC) Error (see Section 23.6.5.1 “Cyclic Redundancy Check (CRC) Error”) • Bit Stuffing Bit Error (see Section 23.6.5.2 “Bit Stuffing Error”) • lnvalid Message Received Error (see Section 23.6.5.3 “Invalid Message Received Error”) The transmit errors are: • Acknowledge Error (see Section 23.7.8.1 “Acknowledge Error”) • Form Error (see Section 23.7.8.2 “Form Error”) • Bit Error (see Section 23.7.8.3 “Bit Error”) 23.8.1 Error States Detected errors are made public to all other nodes via error frames. The transmission of the erroneous message is aborted and the frame is repeated as soon as possible. Furthermore, each CAN node is in one of the three error states “error active”, “error passive” or “bus off” according to the value of the internal error counters. The error active state is the usual state where the bus node can transmit messages and active error frames (made of dominant bits) without any restrictions. In the error passive state, messages and passive error frames (made of recessive bits) may be transmitted. The bus off state makes it temporarily impossible for the station to participate in the bus communication. During this state, messages can neither be received nor transmitted. © 2005 Microchip Technology Inc. DS70070C-page 23-59 Section 23. CAN CAN Module 23 23.8.2 Error Modes and Error Counters The CAN controller contains the two error counters Receive Error Counter (RERRCNT) and Transmit Error Counter (TERRCNT). The values of both counters can be read by the CPU from the Error Count Register CiEC. These counters are incremented or decremented according to the CAN bus specification. The CAN controller is error active if both error counters are below the error passive limit of 128. It is error passive if at least one of the error counters equals or exceeds 128. It goes bus off if the Transmit Error Counter equals or exceeds the bus off limit of 256. The device remains in this state, until the bus off recovery sequence is finished, which is 128 consecutive 11 recessive bit times. Additionally, there is a error state warning flag bit, EWARN (CiINTF<8>), which is set if at least one of the error counters equals or exceeds the error warning limit of 96. EWARN is reset if both error counters are less than the error warning limit. Figure 23-19: Error Modes 23.8.3 Error Flag Register The values in the error flag register indicate which error(s) caused the error interrupt flag. The RXnOVR error flags (CiINTF<15> and CiINTF<14>) have a different function than the other error flag bits in this register. The RXnOVR bits must be cleared in order to clear the ERRIF interrupt flag. The other error flag bits in this register will cause the ERRIF interrupt flag to become set as the value of the Transmit and Receive Error Counters crosses a specific threshold. Clearing the ERRIF interrupt flag in these cases will allow the interrupt service routine to be exited without recursive interrupt occurring. It may be desirable to disable specific interrupts after they have occurred once to stop the device from interrupting repeatedly as the Error Counter moves up and down in the vicinity of a threshold value. Bus Off Error Active Error Passive RERRCNT > 127 or TERRCNT > 127 RERRCNT < 127 or TERRCNT < 127 TERRCNT > 255 128 occurrences of 11 consecutive “recessive” bits Reset dsPIC30F Family Reference Manual DS70070C-page 23-60 © 2005 Microchip Technology Inc. 23.9 CAN Baud Rate All nodes on any particular CAN bus must have the same nominal bit rate. The CAN bus uses NRZ coding which does not encode a clock. Therefore the receivers independent clock must be recovered by the receiving nodes and synchronized to the transmitters clock. In order to set the baud rate the following bits have to be initialized: • Synchronization Jump Width (see Section Section 23.9.6.2 “Re-synchronization”) • Baud Rate Prescaler (see Section Section 23.9.2 “Prescaler Setting”) • Phase Segments (see Section Section 23.9.4 “Phase Segments”) • Length Determination of Phase Segment 2 (see Section Section 23.9.4 “Phase Segments”) • Sample Point (see Section Section 23.9.5 “Sample Point”) • Propagation Segment Bits (see Section Section 23.9.3 “Propagation Segment”) 23.9.1 Bit Timing As oscillators and transmission time may vary from node to node, the receiver must have some type of PLL synchronized to data transmission edges to synchronize and maintain the receiver clock. Since the data is NRZ coded, it is necessary to include bit-stuffing to ensure that an edge occurs at least every 6 bit times, to maintain the Digital Phase Lock Loop (DPLL) synchronization. Bus timing functions executed within the bit time frame, such as synchronization to the local oscillator, network transmission delay compensation, and sample point positioning, are defined by the programmable bit timing logic of the DPLL. All controllers on the CAN bus must have the same baud rate and bit length. However, different controllers are not required to have the same master oscillator clock. At different clock frequencies of the individual controllers, the baud rate has to be adjusted by adjusting the number of time quanta in each segment. The nominal bit time can be thought of as being divided into separate non-overlapping time segments. These segments are shown in Figure 23-20. • Synchronization segment (Sync Seg) • Propagation time segment (Prop Seg) • Phase buffer segment 1 (Phase1 Seg) • Phase buffer segment 2 (Phase2 Seg) The time segments and also the nominal bit time are made up of integer units of time called time quanta or TQ. By definition, the nominal bit time has a minimum of 8 TQ and a maximum of 25 TQ. Also, by definition the minimum nominal bit time is 1 μsec, corresponding to a maximum 1 MHz bit rate. Figure 23-20: CAN Bit Timing Input Signal Sync Prop Segment Phase Segment 1 Phase Segment 2 Sync Sample Point TQ © 2005 Microchip Technology Inc. DS70070C-page 23-61 Section 23. CAN CAN Module 23 23.9.2 Prescaler Setting There is a programmable prescaler, with integral values ranging from 1 to 64, in addition to a fixed divide-by-2 for clock generation. The Time Quanta (TQ) is a fixed unit of time derived from the input clock frequency, FCAN. Time quanta is defined as shown in Equation 23-1. Equation 23-1: Time Quanta for Clock Generation Example 23-1: Bit Rate Calculation Example Example 23-2: Baud Rate Prescaler Calculation Example The frequencies of the oscillators in the different nodes must be coordinated in order to provide a system-wide specified time quantum. This means that all oscillators must have a TOSC that is a integral divisor of TQ. Note: FCAN must not exceed 30 MHz. If CANCKS = 0, then FCY must not exceed 7.5 MHz. Where BRP is the binary value of BRP <5:0> FCAN is FCY or 4 FCY depending on CANCKS bit TQ = 2 (BRP<5:0> + 1) FCAN If 4FCY = 32 MHz, BRP<5:0> = 0x01 and CANCKS = 0, then: If Nominal Bit Time = 8 TQ then: Nominal Bit Rate Mbps 1 8 125 –9 = ⁄ ( ) × ×10 TQ = 2 • (BRP + 1) • TCY = 2 X 2 X (1/32X106 ) = 125ns 4 CAN Baud Rate = 125 kHz FCY = 5 MHz, CANCKS = 1 1. Select number of TQ clocks per bit time (e.g., K=16). 3. Calculate BRP<5:0>: BRP = ( ) 2TQ ⁄ TCY –1 2 500 –9 ( ) ×10 1 5 6 ⁄ ( ) ×10 = 1 ------------------------------- – = 4 2. Calculate TQ from baud rate: TQ 1 ⁄ ( ) BaudRate K = ------------------------------------- 1 125 3 ⁄ ×10 16 = = --------------------------- 500ns TQ = 2 • (BRP + 1) • TCAN dsPIC30F Family Reference Manual DS70070C-page 23-62 © 2005 Microchip Technology Inc. 23.9.3 Propagation Segment This part of the bit time is used to compensate physical delay times within the network. These delay times consist of the signal propagation time on the bus line and the internal delay time of the nodes. The delay is calculated as the round trip from transmitter to receiver as twice the signal's propagation time on the bus line, the input comparator delay, and the output driver delay. The Propagation Segment can be programmed from 1 TQ to 8 TQ by setting the PRSEG<2:0> bits (CiCFG2<2:0>). 23.9.4 Phase Segments The phase segments are used to optimally locate the sampling of the received bit within the transmitted bit time. The sampling point is between Phase1 Segment and Phase2 Segment. These segments are lengthened or shortened by re-synchronization. The end of the Phase1 Segment determines the sampling point within a bit period. The segment is programmable from 1 TQ to 8 TQ. Phase2 Segment provides delay to the next transmitted data transition. The segment is programmable from 1 TQ to 8 TQ or it may be defined to be equal to the greater of Phase1 Segment or the Information Processing Time (3 TQ’s). The phase segment 1 is initialized by setting bits SEG1PH<2:0> (CiCFG2<5:3>), and phase segment 2 is initialized by setting SEG2PH<2:0> (CiCFG2<10:8>). 23.9.5 Sample Point The sample point is the point of time at which the bus level is read and interpreted as the value of that respective bit. The location is at the end of phase segment 1. If the bit timing is slow and contains many TQ, it is possible to specify multiple sampling of the bus line at the sample point. The level determined by the CAN bus then corresponds to the result from the majority decision of three values. The majority samples are taken at the sample point and twice before with a distance of TQ/2. The CAN module allows to chose between sampling three times at the same point or once at the same point. This is done by setting or clearing the SAM bit (CiCFG2<6>). 23.9.6 Synchronization To compensate for phase shifts between the oscillator frequencies of the different bus stations, each CAN controller must be able to synchronize to the relevant signal edge of the incoming signal. When an edge in the transmitted data is detected, the logic will compare the location of the edge to the expected time (Synchronous Segment). The circuit will then adjust the values of Phase1 Segment and Phase2 Segment. There are 2 mechanisms used to synchronize. 23.9.6.1 Hard Synchronization Hard Synchronization is only done whenever there is a “recessive” to “dominant” edge during bus Idle, indicating the start of a message. After hard synchronization, the bit time counters are restarted with Synchronous Segment. Hard synchronization forces the edge which has caused the hard synchronization to lie within the synchronization segment of the restarted bit time. Due to the rules of synchronization, if a hard synchronization is done, there will not be a re-synchronization within that bit time. © 2005 Microchip Technology Inc. DS70070C-page 23-63 Section 23. CAN CAN Module 23 23.9.6.2 Re-synchronization As a result of re-synchronization phase segment 1 may be lengthened or phase segment 2 may be shortened. The amount of lengthening or shortening of the phase buffer segment, specified by the SJW<1:0> bits (CiCFG1<7:6>), has an upper bound given by the re-synchronization jump width bits. The value of the synchronization jump width will be added to phase segment 1 or subtracted from phase segment 2. The re-synchronization jump width is programmable between 1 TQ and 4 TQ. Clocking information will only be derived from transitions of recessive to dominant bus states. The property that only a fixed maximum number of successive bits have the same value ensures resynchronizing a bus unit to the bit stream during a frame (e.g., bit-stuffing). The phase error of an edge is given by the position of the edge relative to Synchronous Segment, measured in Time Quanta. The phase error is defined in magnitude of TQ as follows: • e = 0 if the edge lies within the Synchronous Segment. • e > 0 if the edge lies before the Sample Point. • e < 0 if the edge lies after the Sample Point of the previous bit. If the magnitude of the phase error is less than or equal to the programmed value of the re-synchronization jump width, the effect of a re-synchronization is the same as that of a hard synchronization. If the magnitude of the phase error is larger than the re-synchronization jump width, and if the phase error is positive, then phase segment 1 is lengthened by an amount equal to the re-synchronization jump width. If the magnitude of the phase error is larger than the re-synchronization jump width, and if the phase error is negative, then phase segment 2 is shortened by an amount equal to the re-synchronization jump width. Figure 23-21: Lengthening a Bit Period Figure 23-22: Shortening a Bit Period Input Signal Sync Propagation Segment Phase Segment 1 Phase Segment 2 ≤ sjw Sample Nominal Actual Bit Point Bit Length Length TQ Input Signal Sync Propagation Segment Phase Segment 1 Phase Segment 2 ≤ sjw Sample Actual Nominal Bit Length TQ Point Bit Length dsPIC30F Family Reference Manual DS70070C-page 23-64 © 2005 Microchip Technology Inc. 23.9.7 Programming Time Segments Some requirements for programming of the time segments are as follows: • Propagation Segment + Phase1 Segment > = Phase2 Segment • Phase2 Segment > Synchronous Jump Width Typically, the sampling of the bit should take place at about 60-70% through the bit time, depending on the system parameters. Example 23-2 has a 16 TQ bit time. If we choose Synchronous Segment = 1 TQ and Propagation Segment = 2 TQ, setting Phase Segment 1 = 7 TQ would place the sample point at 10 TQ (62% of the bit time) after the initial transition. This would leave 6 TQ for phase segment 2. Since phase segment 2 is 6, according to the rules, the SJWS<1:0> bits could be set to the maximum of 4 TQ. However, normally a large synchronization jump width is only necessary when the clock generation of the different nodes is inaccurate or unstable, such as using ceramic resonators. So a synchronization jump width of 1 is typically enough. 23.10 Interrupts The module has several sources of interrupts. Each of these interrupts can be individually enabled or disabled. A CiINTF register contains interrupt flags. A CiINTE register controls the enabling of the 8 main interrupts. A special set of read only bits in the CiCTRL register (ICODE<2:0>) can be used in combination with a jump table for efficient handling of interrupts. All interrupts have one source, with the exception of the error interrupt. Any of the error interrupt sources can set the error interrupt flag. The source of the error interrupt can be determined by reading the CiINTF register. The interrupts can be broken up into two categories: receive and transmit interrupts. The receive related interrupts are: • Receive interrupt • Wake-up interrupt • Receiver Overrun interrupt • Receiver Warning interrupt • Receiver Error Passive interrupt The Transmit related interrupts are: • Transmit interrupt • Transmitter Warning interrupt • Transmitter Error Passive interrupt • Bus Off interrupt 23.10.1 Interrupt Acknowledge Interrupts are directly associated with one or more status flags in CiINTF register. Interrupts are pending as long as one of the corresponding flags is set. The flags in the registers must be reset within the interrupt handler in order to handshake the interrupt. A flag can not be cleared if the respective condition still prevails, with the exception being interrupts that are caused by a certain value being reached in one of the error counter registers. © 2005 Microchip Technology Inc. DS70070C-page 23-65 Section 23. CAN CAN Module 23 23.10.2 The ICODE Bits The ICODE<2:0> bits (CiCTRL<3:1>) are a set of read only bits designed for efficient handling of interrupts via a jump table. The ICODE<2:0> bits can only display one interrupt at a time because the interrupt bits are multiplexed into this register. Therefore, the pending interrupt with the highest priority and enabled interrupt is reflected in the ICODE<2:0> bits. Once the highest priority interrupt flag has been cleared, the next highest priority interrupt code is reflected in the ICODE<2:0> bits. An interrupt code for a corresponding interrupt can only be displayed if both its interrupt flag and interrupt enable are set. Table 23-6 describes the operation of the ICODE<2:0> bits. Table 23-6: ICODE Bits Decode Table 23.11 CAN Capture The CAN module will generate a signal that can be sent to a timer capture input whenever a valid frame has been accepted. This is useful for time-stamping and network synchronization. Because the CAN specification defines a frame to be valid if no errors occurred before the EOF field has been transmitted successfully, the timer signal will be generated right after the EOF. A pulse of one bit time is generated. Time-stamping is enabled by the TSTAMP control bit (CiCTRL<15>). The IC2 capture input is used for time-stamping. 23.12 CAN Module I/O The CAN bus module communicates on up to 2 I/O pins. There is 1 transmit pin and 1 receive pin. These pins are multiplexed with normal digital I/O functions of the device. When the module is in the Configuration mode, Module Disable mode or Loopback mode, the I/O pins revert to the PORT I/O function. When the module is active, the CiTX pin (i = 1 or 2) is always dedicated to the CAN output function. The TRIS bits associated with the transmit pins are overridden by the CAN bus modes. The module receives the CAN input on the CiRX input pin. ICODE<2:0> Boolean Expression 000 ERR•WAK•TX0•TX1•TX2•RX0•RX1 001 ERR 100 ERR•TX0 011 ERR•TX0•TX1 010 ERR•TX0•TX1•TX2 110 ERR•TX0•TX1•TX2•RX0 101 ERR•TX0•TX1•TX2•RX0•RX1 111 ERR•TX0•TX1•TX2•RX0•RX1•WAK Legend: ERR = ERRIF • ERRIE TX0 = TX0IF • TX0IE TX1 = TX1IF • TX1IE TX2 = TX2IF • TX2IE RX0 = RX0IF • RX0IE RX1 = RX1IF • RX1IE WAK = WAKIF • WAKIE Note: If the CAN capture is enabled, the IC2 pin becomes unusable as a general input capture pin. In this mode, the IC2 channel derives its input signal from the C1RX or C2RX pin instead of the IC2 pin. dsPIC30F Family Reference Manual DS70070C-page 23-66 © 2005 Microchip Technology Inc. 23.13 Operation in CPU Power Saving Modes 23.13.1 Operation in Sleep Mode Sleep mode is entered by executing a PWRSAV #0 instruction. This will stop the crystal oscillator and shut down all system clocks. The user should ensure that the module is not active when the CPU goes into Sleep mode. The pins will revert into normal I/O function, dependent on the value in the TRIS register. Because the CAN bus is not disruptable, the user must never execute a PWRSAV #0 instruction while the module is in an Operating mode. The module must first be switched to Disable mode by setting REQOP<2:0> =001 (CiCTRL<10:8>). When OPMODE<2:0> = 001 (CiCTRL<7:5>), indicating that Disable mode is achieved, then the Sleep instruction may be used. Figure 23-23 depicts how the CAN module will behave when the CPU enters Sleep mode and how the module wakes up on bus activity. When the CPU exits Sleep mode due to activity on the CAN bus, the WAKIF flag (CiINTF<6>) is set. The module will monitor the CiRX line for activity while the device is in Sleep mode. If the device is in Sleep mode and the WAKIE wake-up interrupt enable is set, the module will generate an interrupt, waking the CPU. Due to the delays in starting up the oscillator and CPU, the message activity that caused the wake-up will be lost. If the module is in CPU Sleep mode and the WAKIE is not set, no interrupt will be generated and the CPU and the CAN module will continue to sleep. If the CAN module is in Disable mode, the module will wake-up and, depending on the condition of the WAKIE bit, may generate an interrupt. It is expected that the module will correctly receive the message that caused the wake-up from Sleep mode. The module can be programmed to apply a low-pass filter function to the CiRX input line while the module or the CPU is in Sleep mode. This feature can be used to protect the module from wake-up due to short glitches on the CAN bus lines. Such glitches can result from electromagnetic inference within noisy environments. The WAKFIL bit (CiCFG2<14>) enables or disables the filter. © 2005 Microchip Technology Inc. DS70070C-page 23-67 Section 23. CAN CAN Module 23 Figure 23-23: Processor Sleep and CAN bus Wake-up Interrupt 23.13.2 CAN Module Operation during CPU Idle Mode On executing a CPU Idle (PWRSAV #1) instruction, the operation of the CAN module is determined by the state of the CSIDL bit (CiCTRL<13>). If CSIDL = 0, the module will continue operation on assertion of Idle mode. The CAN module can wake the device from Idle mode if the CAN module interrupt is enabled. If CSIDL = 1, the module will discontinue operation in Idle mode. The same rules and conditions for entry to and wake from Sleep mode apply. Refer to Section 23.13.1 “Operation in Sleep Mode” for further details. TOST Processor in SLEEP 2 3 4 5 - Processor executes SLEEP (PWRSAV #0) instruction. - SOF of message wakes up processor. Oscillator start time begins. CAN message lost. WAKIF bit set. - Processor completes oscillator start time. Processor resumes program or interrupt, based on GIE bits. accepting CAN bus activity. CAN message lost. - Module detects 11 recessive bits. Module will begin to receive messages and transmit any pending messages. OSC1 CAN bus CAN Module Disabled 001 000 001 000 000 000 Sleep WAKIF WAKIE 1 - Processor requests and receives Module Disable mode. Wake-up interrupt enabled. Processor requests Normal Operating mode. Module waits for 11 recessive bits before 1 2 3 4 5 REQOP<2:0> OPMODE<2:0> dsPIC30F Family Reference Manual DS70070C-page 23-68 © 2005 Microchip Technology Inc. 23.14 CAN Protocol Overview The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of robustness. The CAN Protocol is fully defined by Robert Bosch GmbH, in the CAN Specification V2.0B from 1991. Its domain of application ranges from high speed networks to low cost multiplex wiring. Automotive electronics (i.e., engine control units, sensors, anti-skid-systems, etc.) are connected using CAN with bit rates up to 1 Mbit/sec. The CAN Network allows a cost effective replacement of wiring harnesses in the automobile. The robustness of the bus in noisy environments and the ability to detect and recover from fault conditions makes the bus suitable for industrial control applications such as DeviceNet, SDS and other fieldbus protocols. CAN is an asynchronous serial bus system with one logical bus line. It has an open, linear bus structure with equal bus nodes. A CAN bus consists of two or more nodes. The number of nodes on the bus may be changed dynamically without disturbing the communication of other nodes. This allows easy connection and disconnection of bus nodes (e.g., for addition of system function, error recovery or bus monitoring). The bus logic corresponds to a “wired-AND” mechanism, “recessive” bits (mostly, but not necessarily equivalent to the logic level ‘1’) are overwritten by “dominant” bits (mostly logic level ‘0’). As long as no bus node is sending a dominant bit, the bus line is in the recessive state, but a dominant bit from any bus node generates the dominant bus state. Therefore, for the CAN bus line, a medium must be chosen that is able to transmit the two possible bit states (dominant and recessive). One of the most common and cheapest ways is to use a twisted wire pair. The bus lines are then called “CANH” and “CANL”, and may be connected directly to the nodes, or via a connector. There's no standard defined by CAN regarding connector requirements. The twisted wire pair is terminated by terminating resistors at each end of the bus line. The maximum bus speed is 1 Mbit, which can be achieved with a bus length of up to 40 meters. For bus lengths longer than 40 meters, the bus speed must be reduced (a 1000 m bus can be realized with a 40 Kbit bus speed). For bus lengths above 1000 meters, special drivers should be used. At least 20 nodes may be connected without additional equipment. Due to the differential nature of transmission, CAN is not inherently susceptible to radiated electromagnetic energy because both bus lines are affected in the same way, which leaves the differential signal unaffected. The bus lines may also be shielded to reduce the radiated electromagnetic emission from the bus itself, especially at high baud rates. The binary data is coded corresponding to the NRZ code (Non-Return-to-Zero; low level = dominant state; high level = recessive state). To ensure clock synchronization of all bus nodes, bit-stuffing is used. This means that during the transmission of a message, a maximum of five consecutive bits may have the same polarity. Whenever five consecutive bits of the same polarity have been transmitted, the transmitter will insert one additional bit of the opposite polarity into the bit stream before transmitting further bits. The receiver also checks the number of bits with the same polarity and removes the stuff bits from the bit stream (destuffing). In the CAN protocol, it is not bus nodes that are addressed. The address information is contained in the messages that are transmitted. This is done via an identifier (part of each message) which identifies the message content (e.g., engine speed, oil temperature etc.). This identifier also indicates the priority of the message. The lower the binary value of the identifier, the higher the priority of the message. For bus arbitration, Carrier Sense Multiple Access/Collision Detection (CSMA/CD) with Non-Destructive Arbitration (NDA) is used. If bus node A wants to transmit a message across the network, it first checks that the bus is in the Idle state (“Carrier Sense”), (i.e., no node is currently transmitting). If this is the case (and no other node wishes to start a transmission at the same moment), node A becomes the bus master and sends its message. All other nodes switch to Receive mode during the first transmitted bit (Start-Of-Frame bit). After correct reception of the message (which is Acknowledged by each node), each bus node checks the message identifier and stores the message, if required. Otherwise, the message is discarded. © 2005 Microchip Technology Inc. DS70070C-page 23-69 Section 23. CAN CAN Module 23 If two or more bus nodes start their transmission at the same time (“Multiple Access”), collision of the messages is avoided by bitwise arbitration (“Collision Detection/Non-Destructive Arbitration” together with the “Wired-AND” mechanism, “dominant” bits override “recessive” bits). Each node sends the bits of its message identifier (MSb first) and monitors the bus level. A node that sends a recessive identifier bit but reads back a dominant one loses bus arbitration and switches to Receive mode. This condition occurs when the message identifier of a competing node has a lower binary value (dominant state = logic 0) and therefore, the competing node is sending a message with a higher priority. In this way, the bus node with the highest priority message wins arbitration without losing time by having to repeat the message. All other nodes automatically try to repeat their transmission once the bus returns to the Idle state. It is not permitted for different nodes to send messages with the same identifier, as arbitration could fail, leading to collisions and errors later in the message. The original CAN specifications (Versions 1.0, 1.2 and 2.0A) defined the message identifier as having a length of 11 bits giving a possible 2048 message identifiers. The specification has since been updated (to version 2.0B) to remove this limitation. CAN specification Version 2.0B allows message identifier lengths of 11 and/or 29 bits to be used (an identifier length of 29 bits allows over 536 million message identifiers). Version 2.0B CAN is also referred to as “Extended CAN”; and Versions 1.0, 1.2 and 2.0A) are referred to as “Standard CAN”. 23.14.1 Standard CAN vs. Extended CAN Those data frames and remote frames, which only contain the 11-bit identifier, are called standard frames according to CAN specification V2.0A. With these frames, 2048 different messages can be identified (identifiers 0-2047). However, the 16 messages with the lowest priority (2032-2047) are reserved. Extended frames according to CAN specification V2.0B have a 29-bit identifier. As already mentioned, this 29-bit identifier is made up of the 11-bit identifier (“Standard lD”) and the 18-bit Extended identifier (“Extended ID”). CAN modules specified by CAN V2.0A are only able to transmit and receive standard frames according to the Standard CAN protocol. Messages using the 29-bit identifier cause errors. If a device is specified by CAN V2.0B, there is one more distinction. Modules named “Part B Passive” can only transmit and receive standard frames but tolerate extended frames without generating error frames. “Part B Active” devices are able to transmit and receive both standard and extended frames. 23.14.2 ISO Model The lSO/OSl Reference Model is used to define the layers of protocol of a communication system as shown in Figure 23-24. At the highest end, the applications need to communicate between each other. At the lowest end, some physical medium is used to provide electrical signaling. The higher levels of the protocol are run by software. Within the CAN bus specification, there is no definition of the type of message, or the contents, or meaning of the messages transferred. These definitions are made in systems such as Volcano, the Volvo automotive CAN specification J1939, the U.S. heavy truck multiplex wiring specification; and Allen-Bradley DeviceNet and Honeywell SDS, industrial protocols. The CAN bus module definition encompasses two levels of the overall protocol: • The Data Link Layer - The Logical Link Control (LLC) sub layer - The Medium Access Control (MAC) sub layer • The Physical Layer - The Physical Signaling (PLS) sub layer dsPIC30F Family Reference Manual DS70070C-page 23-70 © 2005 Microchip Technology Inc. The LLC sub layer is concerned with Message Filtering, Overload Notification and Error Recovery Management. The scope of the LLC sub layer is: • To provide services for data transfer and for remote data request. • To decide which messages received by the LLC sub layer are actually to be accepted. • To provide means for error recovery management and overload notifications. The MAC sub layer represents the kernel of the CAN protocol. The MAC sub layer defines the transfer protocol, (i.e., controlling the Framing, Performing Arbitration, Error Checking, Error Signalling and Fault Confinement). It presents messages received from the LLC sub layer and accepts messages to be transmitted to the LLC sub layer. Within the MAC sub layer is where it’s decided whether the bus is free for starting a new transmission, or whether a reception is just starting. The MAC sub layer is supervised by a management entity called Fault Confinement which is a self-checking mechanism for distinguishing short disturbances from permanent failures. Also, some general features of the bit timing are regarded as part of the MAC sub layer. The physical layer defines the actual transfer of the bits between the different nodes with respect to all electrical properties. The PLS sub layer defines how signals are actually transmitted and therefore deals with the description of Bit Timing, Bit Encoding and Synchronization. The lower levels of the protocol are implemented in driver/receiver chips and the actual interface such as twisted pair wiring or optical fiber, etc. Within one network, the physical layer has to be the same for all nodes. The driver/receiver characteristics of the physical layer are not defined in the CAN specification so as to allow transmission medium and signal level implementations to be optimized for their application. The most common example of the physical transmission medium is defined in Road Vehicles ISO11898, a multiplex wiring specification. © 2005 Microchip Technology Inc. DS70070C-page 23-71 Section 23. CAN CAN Module 23 Figure 23-24: CAN Bus in ISO/OSI Reference Model OSI REFERENCE LAYERS Presentation Transport Data Link Layer LLC (Logical Link Control) Acceptance Filtering Overload Notification Recovery Management MAC (Medium Access Control) Data Encapsulation/Decapsulation Frame Coding (stuffing, destuffing) Medium Access Management Error Detection Error Signalling Acknowledgment Serialization/Deserialization Physical Layer PLS (Physical Signalling) Bit Encoding/Decoding Bit Timing Synchronization PMA (Physical Medium Attachment) Driver/Receiver Characteristics MDI (Medium Dependent Interface) Connectors Fault Confinement Bus Failure Management Supervisor Shaded Regions Implemented by the CAN Module Has to be Implemented in dsPIC30F Firmware Session Network Application CAN Transceiver Chip Connector dsPIC30F Family Reference Manual DS70070C-page 23-72 © 2005 Microchip Technology Inc. 23.15 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the CAN module are: Title Application Note # An Introduction to the CAN Protocol AN713 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc. DS70070C-page 23-73 Section 23. CAN CAN Module 23 23.16 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates additional technical content for the dsPIC30F CAN module. Revision C This revision incorporates all known errata at the time of this document update. dsPIC30F Family Reference Manual DS70070C-page 23-74 © 2005 Microchip Technology Inc. NOTES: © 2005 Microchip Technology Inc. DS70071D-page 24-1 D e vic e Configuration 24 Section 24. Device Configuration HIGHLIGHTS This section of the manual contains the following topics: 24.1 Introduction .................................................................................................................. 24-2 24.2 Device Configuration Registers ................................................................................... 24-2 24.3 Configuration Bit Descriptions...................................................................................... 24-6 24.4 Device Identification Registers..................................................................................... 24-7 24.5 Related Application Notes............................................................................................24-8 24.6 Revision History ...........................................................................................................24-9 dsPIC30F Family Reference Manual DS70071D-page 24-2 © 2005 Microchip Technology Inc. 24.1 Introduction The device Configuration registers allow each user to customize certain aspects of the device to fit the needs of the application. Device Configuration registers are nonvolatile memory locations in the program memory map that hold settings for the dsPIC device during power-down. The Configuration registers hold global setup information for the device, such as the oscillator source, Watchdog Timer mode and code protection settings. The device Configuration registers are mapped in program memory locations, starting at address 0xF80000 and are accessible during normal device operation. This region is also referred to as “configuration space”. The Configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’) to select various device configurations. 24.2 Device Configuration Registers Each device Configuration register is a 24-bit register, but only the lower 16 bits of each register are used to hold configuration data. There are four device Configuration registers available to the user: • FOSC (0xF80000): Oscillator Configuration Register (Note 2) • FWDT (0xF80002): Watchdog Timer Configuration Register • FBORPOR (0xF80004): BOR and POR Configuration Register • FGS (0xF8000A): General Code Segment Configuration Register The device Configuration registers can be programmed using Run-Time Self-Programming (RTSP), In-Circuit Serial Programming™ (ICSP™), or by a device programmer. Note 1: Not all device Configuration bits shown in the subsequent Configuration register descriptions may be available on a specific device. Refer to the device data sheet for more information. 2: dsPIC30F devices in the General Purpose, Sensor and Motor Control families feature one of three versions of the Oscillator system – Version 1, Version 2 and Version 3. For information on the Configuration bits of the FOSC device Configuration register available in each of these versions, please refer to Section 7. "Oscillator”. © 2005 Microchip Technology Inc.. DS70071D-page 24-3 Section 24. Device Configuration D e vic e Configuration 24 Register 24-1: FWDT: Watchdog Timer Configuration Register Upper Byte: U U U U UUU U — — — — — — — — bit 23 bit 16 Middle Byte: R/P U U U U U U U FWDTEN — — — — — — — bit 15 bit 8 Lower Byte: U U R/P R/P R/P R/P R/P R/P FWPSA<1:0> FWPSB<3:0> bit 7 bit 0 bit 23-16 Unimplemented: Read as ‘0’ bit 15 FWDTEN: Watchdog Enable Configuration bit 1 = Watchdog Enabled (LPRC oscillator cannot be disabled. Clearing the SWDTEN bit in the RCON register. Will have no effect.) 0 = Watchdog Disabled (LPRC oscillator can be disabled by clearing the SWDTEN bit in the RCON register.) bit 14-6 Unimplemented: Read as ‘0’ bit 5-4: FWPSA<1:0>: Prescale Value Selection for Watchdog Timer Prescaler A bits 11 = 1:512 10 = 1:64 01 = 1:8 00 = 1:1 bit 3-0 FWPSB<3:0>: Prescale Value Selection for Watchdog Timer Prescaler B bits 1111 = 1:16 1110 = 1:15 • • • 0001 = 1:2 0000 = 1:1 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit dsPIC30F Family Reference Manual DS70071D-page 24-4 © 2005 Microchip Technology Inc. Register 24-2: FBORPOR: BOR and POR Configuration Register Upper Byte: U U U U UUU U — — — — — — — — bit 23 bit 16 Middle Byte: R/P U U U U R/P R/P R/P MCLREN — — — — PWMPIN HPOL LPOL bit 15 bit 8 Lower Byte: R/P U R/P R/P U U R/P R/P BOREN — BORV<1:0> — — FPWRT<1:0> bit 7 bit 0 bit 23-16 Unimplemented: Read as ‘0’ bit 15 MCLREN: MCLR Pin Function Enable bit 1 = Pin function is MCLR (default case) 0 = Pin is disabled bit 14-11 Unimplemented: Read as ‘0’ bit 10 PWMPIN: Motor Control PWM Module Pin Mode bit 1 = PWM module pins controlled by PORT register at device Reset (tri-stated) 0 = PWM module pins controlled by PWM module at device Reset (configured as output pins) bit 9 HPOL: Motor Control PWM Module High Side Polarity bit 1 = PWM module high-side output pins have active-high output polarity 0 = PWM module high-side output pins have active-low output polarity bit 8 LPOL: Motor Control PWM Module Low Side Polarity bit 1 = PWM module low-side output pins have active-high output polarity 0 = PWM module low-side output pins have active-low output polarity bit 7 BOREN: PBOR Enable bit 1 = PBOR Enabled 0 = PBOR Disabled bit 6 Unimplemented: Read as ‘0’ bit 5-4 BORV<1:0>: Brown-out Voltage Select bits 11 = 2.0V 10 = 2.7V 01 = 4.2V 00 = 4.5V bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 FPWRT<1:0>: Power-on Reset Timer Value Selection bits 11 = PWRT = 64 ms 10 = PWRT = 16 ms 01 = PWRT = 4 ms 00 = Power-up timer disabled Note: PWMPIN, HPOL, and LPOL Configuration bits are only available on devices that feature a Motor Control PWM module. Legend: R = Readable bit P = Programmable bit U = Unimplemented bit © 2005 Microchip Technology Inc.. DS70071D-page 24-5 Section 24. Device Configuration D e vic e Configuration 24 Register 24-3: FGS: General Code Segment Configuration Register Upper Byte: U U U U UUU U — — — — — — — — bit 23 bit 16 Middle Byte: U U U U UUU U — — — — — — — — bit 15 bit 8 Lower Byte: U U U U UUP P — — — — — — GCP GWRP bit 7 bit 0 bit 23-2 Unimplemented: Read as ‘0’ bit 1 GCP: General Code Segment Code-Protect bit 1 = User program memory is not code-protected 0 = User program memory is code-protected bit 0 GWRP: General Code Segment Write-Protect bit 1 = User program memory is not write-protected 0 = User program memory is write-protected Note: The BCP and GWRP Configuration bits can only be programmed to a ‘0’. Legend: R = Readable bit P = Programmable bit U = Unimplemented bit dsPIC30F Family Reference Manual DS70071D-page 24-6 © 2005 Microchip Technology Inc. 24.3 Configuration Bit Descriptions This section provides specific functional information on each of the device Configuration bits. 24.3.1 Oscillator Configuration Bits dsPIC30F devices in the General Purpose, Sensor and Motor Control families feature one of three versions of the Oscillator system – Version 1, Version 2 and Version 3. For information on the Configuration bits of the FOSC device Configuration register available in each of these versions, please refer to Section 7. "Oscillator”. 24.3.2 BOR and POR Configuration Bits The BOR and POR Configuration bits found in the FBORPOR Configuration register are used to set the Brown-out Reset voltage for the device, enable the Brown-out Reset circuit, and set the Power-up Timer delay time. For more information on these Configuration bits, please refer to Section 8. "Reset”. 24.3.3 Motor Control PWM Module Configuration Bits The motor control PWM module Configuration bits are located in the FBORPOR Configuration register and are present only on devices that have the PWM module. The Configuration bits associated with the PWM module have two functions: 1. Select the state of the PWM pins at a device Reset (high-Z or output). 2. Select the active signal polarity for the PWM pins. The polarity for the high side and low side PWM pins may be selected independently. For more information on these Configuration bits, please refer to Section 15. "Motor Control PWM”. 24.3.4 General Code Segment Configuration Bits The general code segment Configuration bits in the FGS Configuration register are used to code-protect or write-protect the user program memory space. The general code segment includes all user program memory with the exception of the interrupt vector table space (0x000000-0x0000FE). If the general code segment is code-protected by programming the GCP Configuration bit (FGS<1>) to a ‘0’, the device program memory cannot be read from the device using In-Circuit Serial Programming (ICSP), or the device programmer. Additionally, further code cannot be programmed into the device without first erasing the entire general code segment. When the general segment is code-protected, user code can still access the program memory data via table read instructions, or Program Space Visibility (PSV) accesses from data space. If the GWRP (FGS<0>) Configuration bit is programmed, all writes to the user program memory space are disabled. 24.3.4.1 General Code Segment Configuration Bit Group The GCP and GWRP Configuration bits in the FGS Configuration register must be programmed/erased as a group. If one or both of the Configuration bits is programmed to a ‘0’, a full chip erase must be performed to change the state of either bit. Note: If the code protection Configuration fuse group (FGS) bits have been programmed, an erase of the entire code-protected device is only possible at voltages, VDD >= 4.5 volts. © 2005 Microchip Technology Inc.. DS70071D-page 24-7 Section 24. Device Configuration D e vic e Configuration 24 24.4 Device Identification Registers The dsPIC30F devices have two sets of registers located in configuration space that provide identification information. 24.4.1 Device ID (DEVID) Registers The configuration memory space locations 0xFF0000 and 0xFF0002 are used to store a read-only Device ID number that is set when the device is manufactured. This number identifies the dsPIC30F device type and the silicon revision. The Device ID registers can be read by the user using table read instructions. 24.4.2 Unit ID Field The Unit ID field is located at configuration memory space locations 0x800600 through 0x80063E. This field consists of 32 program memory locations and can be programmed at the Microchip factory with unique device information. This field cannot be written or erased by the user, but can be read using table read instructions. Please contact Microchip technical support or your local Microchip representative for further details. dsPIC30F Family Reference Manual DS70071D-page 24-8 © 2005 Microchip Technology Inc. 24.5 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Device Configuration module are: Title Application Note # Using the dsPIC30F for Sensorless BLDC Control AN901 Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. © 2005 Microchip Technology Inc.. DS70071D-page 24-9 Section 24. Device Configuration D e vic e Configuration 24 24.6 Revision History Revision A This is the initial released revision of this document. Revision B This revision incorporates technical content changes for the dsPIC30F Device Configuration module. Revision C This revision incorporates all known errata at the time of this document update. Revision D Descriptions of three versions of the Oscillator Control module have been added. The definition of the FOSC Configuration register was moved to DS70054. dsPIC30F Family Reference Manual DS70071D-page 24-10 © 2005 Microchip Technology Inc. © 2004 Microchip Technology Inc. DS70072C-page 25-1 D e v elo p m e nt Tool Support 25 Section 25. Development Tool Support HIGHLIGHTS This section of the manual contains the following topics: 25.1 Introduction .................................................................................................................. 25-2 25.2 Microchip Hardware and Language Tools.................................................................... 25-2 25.3 Third Party Hardware/Software Tools and Application Libraries.................................. 25-6 25.4 dsPIC30F Hardware Development Boards................................................................ 25-11 25.5 Related Application Notes.......................................................................................... 25-15 25.6 Revision History ......................................................................................................... 25-16 dsPIC30F Family Reference Manual DS70072C-page 25-2 © 2004 Microchip Technology Inc. 25.1 Introduction Microchip will offer a comprehensive package of development tools and libraries to support the dsPIC architecture. In addition, the company is partnering with many third party tool manufacturers for additional dsPIC device support. 25.2 Microchip Hardware and Language Tools The Microchip tools proposed include: • MPLAB® Integrated Development Environment (IDE) • dsPIC Language Suite, including MPLAB C30 C Compiler, Assembler, Linker and Librarian • MPLAB SIM Software Simulator • MPLAB ICE 4000 In-Circuit Emulator • MPLAB ICD 2 In-Circuit Debugger • PRO MATE® II Universal Device Programmer • PICSTART® Plus Development Programmer 25.2.1 MPLAB 6.XX Integrated Development Environment Software The MPLAB Integrated Development Environment (IDE) is available at no cost. MPLAB IDE software is a desktop development environment with tool sets for developing and debugging a microcontroller design application. MPLAB IDE allows quick changes between different development and debugging activities. Designed for use with the Windows® operating environment, it is a powerful, affordable, run-time development tool. It is also the common user interface for Microchip's development systems tools, including MPLAB Editor, MPLAB ASM30 Assembler, MPLAB SIM software simulator, MPLAB LIB30 Library, MPLAB LINK30 Linker, MPLAB ICE 4000 In-Circuit Emulators, PRO MATE II programmer and In-Circuit Debugger (ICD 2). The MPLAB IDE gives users the flexibility to edit, compile and emulate, all from a single user interface. Engineers can design and develop code for the dsPIC devices in the same design environment that they have used for PICmicro® microcontrollers. The MPLAB IDE is a 32-bit Windows-based application. It provides many advanced features for the engineer in a modern, easy-to-use interface. MPLAB IDE integrates: • Full featured, color coded text editor • Easy-to-use project manager with visual display • Source level debugging • Enhanced source level debugging for ‘C’ - (Structures, automatic variables, etc.) • Customizable toolbar and key mapping • Dynamic status bar that displays processor condition at a glance • Context sensitive, interactive on-line help • Integrated MPLAB SIM instruction simulator • User interface for PRO MATE II and PICSTART Plus device programmers (sold separately) • User interface for MPLAB ICE 4000 In-Circuit Emulator (sold separately) • User interface for MPLAB ICD 2 In-Circuit Debugger (sold separately) Note: Some development tools described in this section are not available at the time of this writing, however they are currently under development. Some of the product details may change. Please check the Microchip web site or your local Microchip sales office for the most current information and the availability of each product. Note: This product is currently available on Microchip’s web site, www.microchip.com. © 2004 Microchip Technology Inc. DS70072C-page 25-3 Section 25. Development Tool Support D e v elo p m e nt Tool Support 25 The MPLAB IDE allows the engineer to: • Edit source files in either assembly or ‘C’ • One-touch compile and download to dsPIC program memory on emulator or simulator. All project information is updated. • Debug using: - Source files - Machine code - Mixed mode source and machine code The ability to use the MPLAB IDE with multiple development and debugging targets allows users to easily switch from the cost effective simulator to a full featured emulator with minimal retraining. 25.2.2 dsPIC Language Suite The Microchip Technology MPLAB C30 C compiler is a complete, easy-to-use language product. It allows dsPIC applications codes to be written in high level C language and then be fully converted into machine-object code for programming of the microcontroller. It simplifies development of code by removing code obstacles and allowing the designer to focus on program flow and not on program elements. Several options for compiling are available so the user can select those that will maximize the efficiency of the code characteristics. It is a fully ANSI compliant product with standard libraries for the dsPIC family of microcontrollers. It uses the many advanced features of the dsPIC devices to provide very efficient assembly code generation. MPLAB C30 also provides extensions that will allow for excellent support of the hardware, such as interrupts and peripherals. It is fully integrated with the MPLAB IDE for high level, source debugging. Some features include: • 16-bit native data types • Efficient use of register-based, 3-operand instructions • Complex Addressing modes • Efficient multi-bit shift operations • Efficient signed/unsigned comparisons MPLAB C30 comes complete with its own assembler, linker and librarian. These allow the user to write mixed mode C and assembly programs and link the resulting object files into a single executable file. The compiler is sold separately. The assembler, linker and librarian is available for free with MPLAB IDE. 25.2.3 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC-hosted environment by simulating the dsPIC device on an instruction level. On any given instruction, the data areas are able to be examined or modified. The execution is able to be performed in Single Step, Execute Until Break or Trace mode.(1) The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C30 compiler and assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent multi-project software development tool. Note: This product is currently available on Microchip’s web site, www.microchip.com. The Assembler, Linker and Librarian are included with MPLAB IDE. Contact your local Microchip sales office for availability of the MPLAB C30 C compiler. Note: This product is included with MPLAB IDE. Note 1: Some features, including peripheral support, have not been implemented at the time of this writing. Please check Microchip’s web site or your local Microchip sales office for the most current information. dsPIC30F Family Reference Manual DS70072C-page 25-4 © 2004 Microchip Technology Inc. 25.2.4 MPLAB ICE 4000 In-Circuit Emulator The MPLAB ICE 4000 In-Circuit Emulator will provide the product development engineer with a complete hardware design tool for the dsPIC devices. Software control of the emulator will be provided by MPLAB IDE. The MPLAB ICE 4000 will be a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules will allow the system to be easily reconfigured for emulation of different processors. The MPLAB ICE 4000 will support the extended, high-end PICmicro microcontrollers, the PIC18CXXX and PIC18FXXX devices, as well as the dsPIC Family of digital signal controllers. The modular architecture of the MPLAB ICE 4000 in-circuit emulator will allow expansion to support new devices. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system, with advanced features that are generally found on more expensive development tools. Features will include: • Full speed emulation, up to 50 MHz bus speed or 200 MHz external clock speed • Low voltage emulation down to 1.8 volts • Configured with 2 Mb program emulation memory; additional modular memory up to 16 Mb • 64K x 136-bit wide Trace Memory • Unlimited software breakpoints • Complex break, trace and trigger logic • Multi-level trigger up to 4 levels • Filter trigger functions to trace specific event • 16-bit Pass counter for triggering on sequential events • 16-bit Delay counter • 48-bit time-stamp • Stopwatch feature • Time between events • Statistical performance analysis • Code coverage analysis • USB and parallel printer port PC connection Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. © 2004 Microchip Technology Inc. DS70072C-page 25-5 Section 25. Development Tool Support D e v elo p m e nt Tool Support 25 25.2.5 MPLAB ICD 2 In-Circuit Debugger Microchip's In-Circuit Debugger, MPLAB ICD, will be a powerful, low cost, run-time development tool. This tool is based on the PICmicro® and dsPIC Flash devices. The MPLAB ICD 2 will utilize the in-circuit debugging capability built into the various devices. This feature, along with Microchip's In-Circuit Serial Programming™ protocol (ICSP™), will offer cost effective, in-circuit debugging from the graphical user interface of MPLAB IDE. This will enable a designer to develop and debug source code by watching variables, single-stepping and setting break points. Running at full speed enables testing hardware in real-time. Some of its features will include: • Full speed operation to the range of the device • Serial or USB PC connector • Serial interface externally powered • USB powered from PC interface • Low noise power (VPP and VDD) for use with analog and other noise sensitive applications • Operation down to 2.0V • Can be used as an ICD or inexpensive serial programmer • Modular application connector as MPLAB ICD • Limited number of breakpoints • “Smart watch” variable windows • Some chip resources required (RAM, program memory and 2 pins) 25.2.6 PRO MATE II Universal Device Programmer The PRO MATE II universal device programmer will be a full-featured programmer capable of operating in Stand-alone mode, as well as PC-hosted mode. The PRO MATE II device programmer will have programmable VDD and VPP supplies, which will allow it to verify programmed memory at VDDMIN and VDDMAX for maximum reliability when programming requires this capability. It will have an LCD display for instructions and error messages and keys to enter commands. Interchangeable optional socket modules will support all package types. In Stand-alone mode, the PRO MATE II device programmer will be able to read, verify or program PICmicro and dsPIC30F devices. It will also be able to set code protection in this mode. PRO MATE II features will include: • Runs under MPLAB IDE • Field upgradable firmware • DOS Command Line interface for production • Host, Safe and “Stand-alone” operation • Automatic downloading of object file • SQTPSM serialization adds an unique serial number to each device programmed • In-Circuit Serial Programming Kit (sold separately) • Interchangeable socket modules supporting all package options (sold separately) Note: This product is available, but does not provide support for dsPIC30F devices at this time. Please refer to the Microchip web site for information about product upgrades. Note: This product is available, but does not provide support for dsPIC30F devices at this time. Please refer to the Microchip web site for information about product upgrades. dsPIC30F Family Reference Manual DS70072C-page 25-6 © 2004 Microchip Technology Inc. 25.3 Third Party Hardware/Software Tools and Application Libraries Microchip is partnering with key third party tool manufacturers for the development of quality hardware and software tools in support of the dsPIC30F Product Family. Microchip plans to offer this initial set of tools and libraries, which will enable customers to rapidly develop their dsPIC30F based application(s). Microchip will expand this current list to provide our customers with additional value added services, (i.e., repository of skilled/certified technical applications contacts, reference designs, hardware and software developers). Please refer to the Microchip web site (www.microchip.com) for the most current information about third party support for the dsPIC30F Device Family. The dsPIC30F software tools and libraries will include: • Third Party C compilers • Floating Point and Double Precision Math Library • DSP Algorithm Library • Digital Filter Design Software Utility • Peripheral Driver Library • CAN Library • Real-Time Operating Systems (RTOS) • OSEK Operating Systems • TCP/IP Protocol Stacks • V.22/V.22bis and V.32 ITU Specifications The dsPIC30F hardware development board tools include: • General Purpose Development Board • Motor Control Development System • Connectivity Development Board 25.3.1 Third Party C Compilers In addition to the Microchip MPLAB C30 C Compiler, the dsPIC30F will be supported by ANSI C compilers developed by IAR, HI-TECH and Custom Computer Services (CCS). The compilers will allow dsPIC application code to be written in high level C language, and then be fully converted into machine object code for programming of the microcontroller. Each compiler tool will provide several options for compiling, so the user can select those that will maximize the efficiency of the generated code characteristics. The multiple C compiler solutions will have different price targets and features, enabling the customer to select the compiler best suited for their application requirements. Note: These products are currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. Note: These products are currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of these products. © 2004 Microchip Technology Inc. DS70072C-page 25-7 Section 25. Development Tool Support D e v elo p m e nt Tool Support 25 25.3.2 Math Library The Math Library will support several standard C functions, including, but not limited to: • sin(), cos(), tan() • asin(), acos(), atan(), • log(), log10() • sqrt(), power() • ceil(), floor() • fmod(), frexp() The math function routines will be developed and optimized in dsPIC30F assembly language and will be callable from both assembly and C language. Floating point and double precision versions of each function shall be provided. The Microchip MPLAB C30 and IAR C compilers will be supported. 25.3.3 DSP Algorithm Library The DSP library will support multiple filtering, convolution, vector and matrix functions. Some of the functions will include, but will not be limited to: • Cascaded Infinite Impulse Response (IIR) Filters • Correlation • Convolution • Finite Impulse Response (FIR) Filters • Windowing Functions • FFTs • LMS Filter • Vector Addition and Subtraction • Vector Dot Product • Vector Power • Matrix Addition and Subtraction • Matrix Multiplication Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. dsPIC30F Family Reference Manual DS70072C-page 25-8 © 2004 Microchip Technology Inc. 25.3.4 DSP Filter Design Software Utility Microchip will offer a digital filter design software tool which will enable the user to develop optimized assembly code for Low-pass, High-pass, Band-pass and Band-stop IIR and FIR filters, including 16-bit fractional data size filter coefficients from a graphical user interface. The application developer will enter the required filter frequency specifications and the software tool develops the filter code and coefficients. Ideal filter frequency response and time domain plots are generated for analysis. FIR filter lengths up to 513 taps and IIR filter lengths up to 10 cascaded sections will be supported. All IIR and FIR routines are generated in assembly language and will be callable from both assembly and C language. The Microchip MPLAB C30 C compiler will be supported. 25.3.5 Peripheral Driver Library Microchip will offer a peripheral driver library that will support the setup and control of dsPIC30F hardware peripherals, including, but not limited to: • Analog-to-Digital Converter • Motor Control PWM • Quadrature Encoder Interface • UART • SPI™ • Data Converter Interface • I2C™ • General Purpose Timers • Input Capture • Output Compare/Simple PWM Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. © 2004 Microchip Technology Inc. DS70072C-page 25-9 Section 25. Development Tool Support D e v elo p m e nt Tool Support 25 25.3.6 CAN Library Microchip will offer a CAN driver library, which will support the dsPIC30F CAN peripheral. Some of the CAN functions which will be supported are: • Initialize CAN Module • Set CAN Operational Mode • Set CAN Baud Rate • Set CAN Masks • Set CAN Filters • Send CAN Message • Receive CAN Message • Abort CAN Sequence • Get CAN TX Error Count • Get CAN RX Error Count 25.3.7 Real-Time Operating System (RTOS) Real-Time Operating System (RTOS) solutions for the dsPIC30F Product Family will be provided. These RTOS solutions will provide the necessary function calls and operating system routines to write efficient C and/or assembly code for multi-tasking applications. In addition, RTOS solutions will be provided that address those applications in which program and more importantly, data memory resources, are limited. Configurable and optimized kernels will be available to support various RTOS application requirements. The RTOS solutions will range from a fully-true, preemptive and multi-tasking scheduler to a cooperative type scheduler, both of which will be designed to optimally run on the dsPIC30F devices. Depending on the RTOS implementation, some of the function calls provided in the system kernel will be: • Control Tasks • Send And Receive Messages • Handle Events • Control Resources • Control Semaphores • Regulate Timing in a Variety of Ways • Provide Memory Management • Handle Interrupts and Swap Tasks Most functions will be written in ANSI C, with the exception of time critical functions, which will be optimized in assembly, thereby reducing execution time for maximum code efficiency. The ANSI C and assembly routines will be supported by the Microchip MPLAB C30 C compiler. Electronic documentation will accompany the RTOS, enabling the user to efficiently understand and implement the RTOS in their application. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. dsPIC30F Family Reference Manual DS70072C-page 25-10 © 2004 Microchip Technology Inc. 25.3.8 OSEK Operating Systems Operating Systems for the vehicle software standard OSEK/VDX will be developed for support of the dsPIC30F product family. The functionality of OSEK, “Offene Systeme und deren Schnittstellen für die Elektronik im Kraftfahrzeug” (Open systems and the corresponding interfaces for automotive electronics), is harmonized with VDX “Vehicle Distributed eXecutive” yielding OSEK/VDX. Structured and modular RTOS software implementations based on standardized interfaces and protocols will be provided. Structured and modular implementations will provide for portability and extendability for distributed control units for vehicles. Various OSEK COM modules will be provided, such as: • OSEK/COM Standard API • OSEK/COM Communication API • OSEK/COM Network API • OSEK/COM Standard Protocols • OSEK/COM Device Driver Interface Microchip will also provide Internal and External CAN driver support. The physical layer will be integrated into the communication controller’s hardware and will not be covered by the OSEK specifications. Most module functions will be developed in ANSI C, with the exception of time critical functions and peripheral utilization, which will be optimized in assembly, thereby reducing execution time for maximum code efficiency. The Microchip MPLAB C30 C compiler will be supported. 25.3.9 TCP/IP Protocol Stack Microchip will offer various Transmission Control Protocol/Internet Protocol (TCP/IP) Stack Layer solutions for Internet connectivity solutions implemented on the dsPIC30F product family. Both reduced and full stack implementations will be provided, which will allow the user to select the optimum TCP/IP stack solution for their application. Application protocol layers, such as FTP, TFTP and SMTP, Transport and Internet layers, such as TCP, UDP, ICMP and IP, and Network Access layers, such as PPP, SLIP, ARP and DHCP, will be provided. Various configurations, such as a minimal UDP/IP stack will be available for limited connectivity requirements. Most stack protocol functions will be developed and optimized in Microchip’s MPLAB C30 C language. Assembly language coding may be developed for specific dsPIC30F hardware peripherals and Ethernet drivers to optimize code size and execution time. These assembly language specific routines will be assembly and C callable. Electronic documentation will accompany the TCP/IP protocol stack, enabling the user to efficiently understand and implement the protocol stack in their application. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. © 2004 Microchip Technology Inc. DS70072C-page 25-11 Section 25. Development Tool Support D e v elo p m e nt Tool Support 25 25.3.10 V.22/V.22bis and V.32 Specification Microchip will offer ITU compliant V.22/V.22bis (1200/2400 bps) and V.32 (non-trellis coding at 9600 bps) modem specifications to support a range of “connected” applications. Applications which will benefit from these modem specifications will be numerous and will fall into many applications, some of which are listed here: • Internet enabled home security systems • Internet connected power, gas and water meters • Internet connected vending machines • Smart Appliances • Industrial monitoring • POS Terminals • Set Top Boxes • Drop Boxes • Fire Panels Most ITU specification modules will be developed and optimized in Microchip’s MPLAB C30 C language. Assembly language coding may be developed for specific dsPIC30F hardware peripherals, along with key transmitter and receiver filtering routines to optimize code size and execution time. These assembly language specific routines will be assembly and C callable. Electronic documentation will accompany the modem library, enabling the user to efficiently understand and implement the library functions. 25.4 dsPIC30F Hardware Development Boards Microchip will initially provide three hardware development boards, which will provide the application developer with a tool in which to quickly prototype and validate key design requirements. Each board will feature key dsPIC30F peripherals and support Microchip’s MPLAB In-Circuit Debugger (ICD 2) tool for cost effective debugging and programming of the dsPIC30F device. The three initial boards to be provided are: • General Purpose Development Board • Motor Control Development System • Connectivity Development Board Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. Note: These products are currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of these products. dsPIC30F Family Reference Manual DS70072C-page 25-12 © 2004 Microchip Technology Inc. 25.4.1 General Purpose Development Board The dsPIC30F general purpose development board will provide the application designer with a low cost development tool in which to become familiar with the dsPIC30F 16-bit architecture, high performance peripherals and powerful instruction set. The development board will serve as an ideal prototyping tool in which to quickly develop and validate key design requirements. Some key features and attributes of the general purpose development board will be: • Supports various dsPIC30F packages • CAN communication channel • RS-232 and RS-485 communication channels • Codec interface with line in/out jacks • In-Circuit Debugger interface • MPLAB ICE 4000 emulation support • Microchip temperature sensor • Microchip Op Amp circuit, supporting user input signals • Microchip Digital-to-Analog Converter • 2x16 LCD • General purpose prototyping area • Various LEDS, switches and potentiometers The general purpose development board will be shipped with a 9V power supply, RS-232 I/O cable, preprogrammed dsPIC30F device, example software and appropriate documentation to enable the user to exercise the development board demonstration programs. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. © 2004 Microchip Technology Inc. DS70072C-page 25-13 Section 25. Development Tool Support D e v elo p m e nt Tool Support 25 25.4.2 Motor Control Development System The dsPIC30F motor control development system will initially provide the application developer with three main components for quick prototyping and validation of BLDC, PMAC and ACIM applications. The three main components will be: • dsPIC30F Motor Control Main Board • 3-phase Low Voltage Power Module • 3-phase High Voltage Power Module The main control board will support the dsPIC30F6010 device, various peripheral interfaces, and a custom interface header system that will allow different motor power modules to be connected. The control board also will have connectors for mechanical position sensors, such as incremental rotary encoders and hall effect sensors, and a breadboard area for custom circuits. The main control board will receive its power from a standard plug-in transformer. The low voltage power module will be optimized for 3-phase motor applications that will require a DC bus voltage less than 60 volts and will deliver up to 400W power output. The 3-phase low voltage power module is intended to power BLDC and PMAC motors. The high voltage power module will be optimized for 3-phase motor applications that require DC bus voltages up to 400 volts and up to 1 kW power output. The high voltage module will have an active power factor correction circuit that will be controlled by the dsPIC30F device. This power module is intended for AC induction motor and power inverter applications. Both power modules will have automatic Fault protection and electrical isolation from the control interface. Both power module boards will provide preconditioned voltage and current signals to the main control board. All position feedback devices that will be isolated from the motor control circuitry, such as incremental encoders, hall-effect sensors or tachometer sensors, will be directly connected to the main control board. Both modules will be equipped with motor braking circuits. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. dsPIC30F Family Reference Manual DS70072C-page 25-14 © 2004 Microchip Technology Inc. 25.4.3 Connectivity Development Board The dsPIC30F connectivity development board will provide the application developer a basic platform for developing and evaluating various connectivity solutions, implementing TCP/IP protocol layers combined with V.22/V.22bis and V.32 (non-trellis coding) ITU specifications, across PSTN or Ethernet communication channels. Some key features and attributes of the connectivity development board will be: • Supports the dsPIC30F6014 device • Media Access Control (MAC) and PHY interface • PSTN interface with DAA/AFE • RS-232 and RS-485 communication channels • In-Circuit Debugger interface • MPLAB ICE 4000 emulation support • Microchip temperature sensor • Microchip Digital-to-Analog Converter • 2x16 LCD • General purpose prototyping area • Various LEDs, switches and potentiometers The connectivity development board will be shipped with a 9V power supply, RS-232 I/O cable and preprogrammed dsPIC30F devices with example connectivity software and appropriate documentation to enable the user to exercise the development board connectivity demo program. Note: This product is currently under development at the time of this writing. Some of the product details may change. Please refer to the Microchip web site or your local Microchip sales office for the most current information and the availability of this product. © 2004 Microchip Technology Inc. DS70072C-page 25-15 Section 25. Development Tool Support D e v elo p m e nt Tool Support 25 25.5 Related Application Notes This section lists application notes that are related to this section of the manual. These application notes may not be written specifically for the dsPIC30F Product Family, but the concepts are pertinent and could be used with modification and possible limitations. The current application notes related to the Development Tool Support are: Title Application Note # No related application notes at this time. Note: Please visit the Microchip web site (www.microchip.com) for additional Application Notes and code examples for the dsPIC30F Family of devices. dsPIC30F Family Reference Manual DS70072C-page 25-16 © 2004 Microchip Technology Inc. 25.6 Revision History Revision A This is the initial released revision of the dsPIC30F Development Tool Support description. Revision B There were no technical content or editorial revisions to this section of the manual, however, this section was updated to reflect Revision B throughout the manual. Revision C There were no technical content revisions to this section of the manual, however, this section was updated to reflect Revision C throughout the manual. © 2004 Microchip Technology Inc. DS70074C-page 26-1 Appendix 26 Section 26. Appendix HIGHLIGHTS This section of the manual contains the following topics: Appendix A: I2C™ Overview..................................................................................................26-2 Appendix B: CAN Overview ................................................................................................. 26-12 Appendix C: Codec Protocol Overview................................................................................ 26-25 I 2C is a trademark of Philips Corporation. dsPIC30F Family Reference Manual DS70074C-page 26-2 © 2004 Microchip Technology Inc. APPENDIX A: I2C™ OVERVIEW This appendix provides an overview of the Inter-Integrated Circuit (I2C™) bus, with Subsection A.2 “Addressing I2C Devices” discussing the operation of the SSP modules in I2C mode. The I2C bus is a two-wire serial interface. The original specification, or standard mode, is for data transfers of up to 100 Kbps. An enhanced specification, or fast mode (400 Kbps), is supported. Standard and Fast mode devices will operate when attached to the same bus, if the bus operates at the speed of the slower device. The I2C interface employs a comprehensive protocol to ensure reliable transmission and reception of data. When transmitting data, one device is the “master”, which initiates transfer on the bus and generates the clock signals to permit that transfer, while the other device(s) acts as the “slave.” All portions of the slave protocol are implemented in the SSP module’s hardware, except general call support, while portions of the master protocol need to be addressed in the PIC16CXX software. The MSSP module supports the full implementation of the I2C master protocol, the general call address and data transfers up to 1 Mbps. The 1 Mbps data transfers are supported by some of Microchip’s Serial EEPROMs. Table A-1 defines some of the I2C bus terminology. In the I2C interface protocol, each device has an address. When a master wishes to initiate a data transfer, it first transmits the address of the device that it wishes to “talk” to. All devices “listen” to see if this is their address. Within this address, a bit specifies if the master wishes to read-from/write-to the slave device. The master and slave are always in opposite modes (transmitter/receiver) of operation during a data transfer. That is, they can be thought of as operating in either of these two relations: • Master-transmitter and Slave-receiver • Slave-transmitter and Master-receiver In both cases, the master generates the clock signal. The output stages of the clock (SCL) and data (SDA) lines must have an open-drain or open-collector in order to perform the wired-AND function of the bus. External pull-up resistors are used to ensure a high level when no device is pulling the line down. The number of devices that may be attached to the I2C bus is limited only by the maximum bus loading specification of 400 pF and addressing capability. © 2004 Microchip Technology Inc. DS70074C-page 26-3 Section 26. Appendix Appendix 26 A.1 Initiating and Terminating Data Transfer During times of no data transfer (idle time), both the clock line (SCL) and the data line (SDA) are pulled high through the external pull-up resistors. The Start and Stop conditions determine the start and stop of data transmission. The Start condition is defined as a high-to-low transition of the SDA when the SCL is high. The Stop condition is defined as a low-to-high transition of the SDA when the SCL is high. Figure A-1 shows the Start and Stop conditions. The master generates these conditions for starting and terminating data transfer. Due to the definition of the Start and Stop conditions, when data is being transmitted, the SDA line can only change state when the SCL line is low. Figure A-1: Start and Stop Conditions Table A-1: I2C Bus Terminology SDA SCL S P Start Condition Change of Data Allowed Change of Data Allowed Stop Condition Term Description Transmitter The device that sends the data to the bus. Receiver The device that receives the data from the bus. Master The device which initiates the transfer, generates the clock and terminates the transfer. Slave The device addressed by a master. Multi-master More than one master device in a system. These masters can attempt to control the bus at the same time without corrupting the message. Arbitration Procedure that ensures that only one of the master devices will control the bus. This ensures that the transfer data does not get corrupted. Synchronization Procedure where the clock signals of two or more devices are synchronized. dsPIC30F Family Reference Manual DS70074C-page 26-4 © 2004 Microchip Technology Inc. A.2 Addressing I2C Devices There are two address formats. The simplest is the 7-bit address format with a R/W bit (Figure A-2). The more complex is the 10-bit address with a R/W bit (Figure A-3). For 10-bit address format, two bytes must be transmitted. The first five bits specify this to be a 10-bit address format. The 1st transmitted byte has 5 bits which specify a 10-bit address, the two MSbs of the address, and the R/W bit. The second byte is the remaining 8 bits of the address. Figure A-2: 7-bit Address Format Figure A-3: I2C 10-bit Address Format S R/W ACK Sent by Slave Slave Address S R/W Read/Write pulse MSb LSb Start Condition ACK Acknowledge S 1 1 1 1 0 A9 A8 R/W ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK Sent By Slave = 0 for write S R/W ACK - Start Condition - Read/Write Pulse - Acknowledge © 2004 Microchip Technology Inc. DS70074C-page 26-5 Section 26. Appendix Appendix 26 A.3 Transfer Acknowledge All data must be transmitted per byte, with no limit to the number of bytes transmitted per data transfer. After each byte, the slave-receiver generates an Acknowledge bit (ACK) (Figure A-4). When a slave-receiver doesn’t acknowledge the slave address or received data, the master must abort the transfer. The slave must leave SDA high so that the master can generate the Stop condition (Figure A-1). Figure A-4: Slave-Receiver Acknowledge If the master is receiving the data (master-receiver), it generates an Acknowledge signal for each received byte of data, except for the last byte. To signal the end of data to the slave-transmitter, the master does not generate an acknowledge (not acknowledge). The slave then releases the SDA line so the master can generate the Stop condition. The master can also generate the Stop condition during the Acknowledge pulse for valid termination of data transfer. If the slave needs to delay the transmission of the next byte, holding the SCL line low will force the master into a wait state. Data transfer continues when the slave releases the SCL line. This allows the slave to move the received data or fetch the data it needs to transfer before allowing the clock to start. This wait state technique can also be implemented at the bit level, Figure A-5. Figure A-5: Data Transfer Wait State S Data Output by Transmitter Data Output by Receiver SCL from Master Clock Pulse for Acknowledgment not acknowledge acknowledge 1 2 8 9 Start Condition 1 2 7 8 9 123 • 89 P SDA SCL S Start Condition Address R/W ACK Wait State Data ACK MSb Acknowledgment Signal from Receiver Acknowledgment Signal from Receiver Byte Complete Interrupt with Receiver Clock Line Held Low while Interrupts are Serviced Stop Condition dsPIC30F Family Reference Manual DS70074C-page 26-6 © 2004 Microchip Technology Inc. Figure A-6 and Figure A-7 illustrate master-transmitter and master-receiver data transfer sequences. Figure A-6: Master-Transmitter Sequence Figure A-7: Master-Receiver Sequence For 7-bit address: S Slave Address (Code + A9:A8) S R/W A1 Slave Address (A7:A0) A2 Data A Data P A master transmitter addresses a slave receiver with a 10-bit address. A/A Slave Address R/W A Data A Data A/A P '0' (write) data transferred (n bytes - acknowledge) A master transmitter addresses a slave receiver with a 7-bit address. The transfer direction is not changed. From master to slave From slave to master A = acknowledge (SDA low) A = not acknowledge (SDA high) S = Start Condition P = Stop Condition (write) For 10-bit address: For 7-bit address: S Slave Address (Code + A9:A8) S R/W A1 Slave Address (A7:A0) A2 A master transmitter addresses a slave receiver with a 10-bit address. Slave Address R/W A Data A Data A P '1' (read) data transferred (n bytes - acknowledge) A master reads a slave immediately after the first byte. From master to slave From slave to master A = acknowledge (SDA low) A = not acknowledge (SDA high) S = Start Condition P = Stop Condition (write) For 10-bit address: Slave Address (Code + A9:A8) Sr R/W A3 A Data A P Data (read) © 2004 Microchip Technology Inc. DS70074C-page 26-7 Section 26. Appendix Appendix 26 When a master does not wish to relinquish the bus (which occurs by generating a Stop condition), a repeated Start condition (Sr) must be generated. This condition is identical to the Start condition (SDA goes high-to-low, while SCL is high), but occurs after a data transfer Acknowledge pulse (not the bus-free state). This allows a master to send “commands” to the slave and then receive the requested information or to address a different slave device. This sequence is illustrated in Figure A-8. Figure A-8: Combined Format Combined format: S Combined format - A master addresses a slave with a 10-bit address, then transmits Slave Address R/W A Data A/A Sr P (read) Sr = repeated Transfer direction of data and acknowledgment bits depends on R/W bits. From master to slave From slave to master A = acknowledge (SDA low) A = not acknowledge (SDA high) S = Start Condition P = Stop Condition Slave Address (Code + A9:A8) Sr R/W A (write) data to this slave and reads data from this slave. Slave Address (A7:A0) Data Sr Slave Address (Code + A9:A8) A A Data A/A R/W A Data A A Data P (read) Slave Address R/W A Data A/A Start Condition (write) Direction of transfer may change at this point (read or write) (n bytes + acknowledge) dsPIC30F Family Reference Manual DS70074C-page 26-8 © 2004 Microchip Technology Inc. A.4 Multi-master The I2C protocol allows a system to have more than one master. This is called a multi-master system. When two or more masters try to transfer data at the same time, arbitration and synchronization occur. A.4.1 Arbitration Arbitration takes place on the SDA line, while the SCL line is high. The master which transmits a high when the other master transmits a low, loses arbitration (Figure A-9) and turns off its data output stage. A master which lost arbitration can generate clock pulses until the end of the data byte where it lost arbitration. When the master devices are addressing the same device, arbitration continues into the data. Figure A-9: Multi-Master Arbitration (Two Masters) Masters that also incorporate the slave function, and have lost arbitration must immediately switch over to Slave-receiver mode. This is because the winning master-transmitter may be addressing it. Arbitration is not allowed between: • A repeated Start condition • A Stop condition and a data bit • A repeated Start condition and a Stop condition Care needs to be taken to ensure that these conditions do not occur. Transmitter 1 Loses Arbitration DATA 1 SDA DATA 1 DATA 2 SDA SCL © 2004 Microchip Technology Inc. DS70074C-page 26-9 Section 26. Appendix Appendix 26 A.4.2 Clock Synchronization Clock synchronization occurs after the devices have started arbitration. This is performed using a wired-AND connection to the SCL line. A high-to-low transition on the SCL line causes the concerned devices to start counting off their low period. Once a device clock has gone low, it will hold the SCL line low until its SCL high state is reached. The low-to-high transition of this clock may not change the state of the SCL line if another device clock is still within its low period. The SCL line is held low by the device with the longest low period. Devices with shorter low periods enter a high wait-state until the SCL line comes high. When the SCL line comes high, all devices start counting off their high periods. The first device to complete its high period will pull the SCL line low. The SCL line high time is determined by the device with the shortest high period, Figure A-10. Figure A-10: Clock Synchronization CLK 1 CLK 2 SCL Wait State Start Counting High Period Counter Reset dsPIC30F Family Reference Manual DS70074C-page 26-10 © 2004 Microchip Technology Inc. Table A-2 and Table A-3 show the specifications of a compliant I2C bus. The column titled, Parameter No., is provided to ease the user’s correlation to the corresponding parameter in the device data sheet. Figure A-11 and Figure A-12 show these times on the appropriate waveforms. Figure A-11: I2C Bus Start/Stop Bits Timing Specification Table A-2: I2C Bus Start/Stop Bits Timing Specification Figure A-12: I2C Bus Data Timing Specification Parameter No. Sym Characteristic Min Typ Max Units Conditions 90 TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for repeated Setup time 400 kHz mode 600 — — Start condition 91 THD:STA Start condition 100 kHz mode 4000 — — ns After this period the first clock Hold time 400 kHz mode 600 — — pulse is generated 92 TSU:STO Stop condition 100 kHz mode 4700 — — ns Setup time 400 kHz mode 600 — — 93 THD:STO Stop condition 100 kHz mode 4000 — — ns Hold time 400 kHz mode 600 — — 91 93 SCL SDA Start Condition Stop Condition 90 92 90 91 92 100 101 103 106 107 109 109 110 102 SCL SDA In SDA Out MSb © 2004 Microchip Technology Inc. DS70074C-page 26-11 Section 26. Appendix Appendix 26 Table A-3: I2C Bus Data Timing Specification Parameter No. Sym Characteristic Min Max Units Conditions 100 THIGH Clock high time 100 kHz mode 4.0 — μs 400 kHz mode 0.6 — μs 101 TLOW Clock low time 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs 102 TR SDA and SCL rise time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from 10 to 400 pF 103 TF SDA and SCL fall time 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from 10 to 400 pF 90 TSU:STA Start condition setup time 100 kHz mode 4.7 — μs Only relevant for repeated 400 kHz mode 0.6 — μs Start condition 91 THD:STA Start condition hold time 100 kHz mode 4.0 — μs After this period the first 400 kHz mode 0.6 — μs clock pulse is generated 106 THD:DAT Data input hold time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 μs 107 TSU:DAT Data input setup time 100 kHz mode 250 — ns Note 2 400 kHz mode 100 — ns 92 TSU:STO Stop condition setup time 100 kHz mode 4.7 — μs 400 kHz mode 0.6 — μs 109 TAA Output valid from clock 100 kHz mode — 3500 ns Note 1 400 kHz mode — 1000 ns 110 TBUF Bus free time 100 kHz mode 4.7 — μs Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — μs D102 Cb Bus capacitive loading — 400 pF Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A Fast mode I2C-bus device can be used in a Standard mode I2C-bus system, but the requirement TSU;DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, TR max.+TSU; DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification) before the SCL line is released. dsPIC30F Family Reference Manual DS70074C-page 26-12 © 2004 Microchip Technology Inc. APPENDIX B: CAN OVERVIEW This appendix provides an overview of the Controller Area Network (CAN) bus. The CAN Section of this reference manual discusses the implementation of the CAN protocol for that hardware module. B.1 CAN Bus Background The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high speed networks to low cost multiplex wiring. In automotive electronics, engine control units, sensors, anti-skid-systems, etc., are connected using CAN with bit rates up to 1 Mbit/sec. The silicon cost is also low enough to be cost effective at replacing wiring harnesses in the automobile. The robustness of the bus in noisy environments and the ability to detect and recover from fault conditions makes the bus suitable for industrial control applications such as DeviceNet, SDS and other field bus protocols. CAN is an asynchronous serial bus system with one logical bus line. It has an open, linear bus structure with equal bus nodes. A CAN bus consists of two or more nodes. The number of nodes on the bus may be changed dynamically without disturbing the communication of other nodes. This allows easy connection and disconnection of bus nodes (e.g., for addition of system function, error recovery or bus monitoring). The bus logic corresponds to a “wired-AND” mechanism, “recessive” bits (mostly, but not necessarily equivalent to the logic level “1”) are overwritten by “dominant” bits (mostly logic level “0”). As long as no bus node is sending a dominant bit, the bus line is in the recessive state, but a dominant bit from any bus node generates the dominant bus state. Therefore, for the CAN bus line, a medium must be chosen that is able to transmit the two possible bit states (dominant and recessive). One of the most common and cheapest ways is to use a twisted wire pair. The bus lines are then called “CANH” and “CANL”, and may be connected directly to the nodes or via a connector. There's no standard defined by CAN regarding the connector to be used. The twisted wire pair is terminated by terminating resistors at each end of the bus line. The maximum bus speed is 1 Mbit, which can be achieved with a bus length of up to 40 meters. For bus lengths longer than 40 meters, the bus speed must be reduced (a 1000 m bus can be realized with a 40 Kbit bus speed). For a bus length above 1000 meters, special drivers should be used. At least 20 nodes may be connected without additional equipment. Due to the differential nature of transmission, CAN is insensitive to EMI because both bus lines are affected in the same way which leaves the differential signal unaffected. The bus lines can also be shielded to reduce the electromagnetic emission of the bus itself, especially at high baud rates. The binary data is coded corresponding to the NRZ code (Non-Return-to-Zero; low level = dominant state; high level = recessive state). To ensure exact synchronization of all bus nodes, bit stuffing is used. This means that during the transmission of a message a maximum of five consecutive bits may have the same polarity. Whenever five consecutive bits of the same polarity have been transmitted, the transmitter will insert one additional bit of the opposite polarity into the bit stream before transmitting further bits. The receiver also checks the number of bits with the same polarity and removes the stuff bits from the bit stream (-destuffing). In the CAN protocol it is not bus nodes that are addressed, but the address information is contained in the messages that are transmitted. This is done via an identifier (part of each message) which identifies the message content (e.g., engine speed, oil temperature etc.). The identifier additionally indicates the priority of the message. The lower the binary value of the identifier, the higher the priority of the message. © 2004 Microchip Technology Inc. DS70074C-page 26-13 Section 26. Appendix Appendix 26 For bus arbitration, CSMA/CD with NDA is used (Carrier Sense Multiple Access/Collision Detection with Non-Destructive Arbitration). If bus node A wants to transmit a message across the network, it first checks that the bus is in the Idle state (“Carrier Sense“) (i.e., no node is currently transmitting). If this is the case (and no other node wishes to start a transmission at the same moment), node A becomes the bus master and sends its message. All other nodes switch to Receive mode during the first transmitted bit (Start-Of-Frame bit). After correct reception of the message (which is acknowledged by each node), each bus node checks the message identifier and stores the message, if required. Otherwise, the message is discarded. If two or more bus nodes start their transmission at the same time (“Multiple Access”), collision of the messages is avoided by bitwise arbitration (“Collision Detection/Non-Destructive Arbitration“ together with the “Wired-AND” mechanism, “dominant“ bits override “recessive” bits). Each node sends the bits of its message identifier (MSB first) and monitors the bus level. A node that sends a recessive identifier bit but reads back a dominant one loses bus arbitration and switches to Receive mode. This condition occurs when the message identifier of a competing node has a lower binary value (dominant state = logic 0) and therefore, the competing node is sending a message with a higher priority. In this way, the bus node with the highest priority message wins arbitration without losing time by having to repeat the message. All other nodes automatically try to repeat their transmission once the bus returns to the Idle state. It is not permitted for different nodes to send messages with the same identifier as arbitration could fail leading to collisions and errors. The original CAN specifications (versions 1.0, 1.2 and 2.0A) defined the message identifier as having a length of 11 bits giving a possible 2048 message identifiers. The specification has since been updated (to version 2.0B) to remove this possible limitation. CAN specification, version 2.0B, allows message identifier lengths of 11 and/or 29 bits to be used (an identifier length of 29 bits allows over 536 Million message identifiers). Version 2.0B CAN is also referred to as “Extended CAN“ and versions 1.0, 1.2 and 2.0A are referred to as “Standard CAN”. B.2 Different CAN Implementations B.2.1 Standard CAN, Extended CAN Those data frames and remote frames, which only contain the 11-bit identifier, are called standard frames according to CAN specification V2.0A. With these frames, 2048 different messages can be identified (identifiers 0-2047). However, the 16 messages with the lowest priority (2032-2047) are reserved. Extended frames, according to CAN specification V2.0B, have a 29-bit identifier. As already mentioned, this 29-bit identifier is made up of the 11-bit identifier (“Base lD”) and the 18-bit Extended identifier (“ID Extension”). CAN modules specified by CAN V2.0A are only able to transmit and receive standard frames according to the Standard CAN protocol. Messages using the 29-bit identifier cause errors. If a device is specified by CAN V2.0B, there is one more distinction. Modules named “Part B Passive” can only transmit and receive standard frames, but tolerate extended frames without generating error frames. “Part B Active” devices are able to transmit and receive both standard and extended frames. B.3 Basic CAN, Full CAN There is one more CAN characteristic concerning the interface between the CAN module and the host CPU, dividing CAN chips into “Basic CAN” and “Full CAN” devices. This has nothing to do with the used protocol though (Standard or Extended CAN), which makes it possible to use both Basic and Full CAN devices in the same network. In the Basic CAN devices, only basic functions of the protocol are implemented in hardware, (e.g., the generation and the check of the bit steam). The decision, if a received message has to be stored or not (acceptance filtering), and the whole message management, has to be done by software (i.e., by the host CPU). Mostly the CAN chip only provides one transmit buffer and one or two receive buffers. So the host CPU load is quite high using Basic CAN modules, therefore these devices should only be used at low baud rates and low bus loads with only a few different messages. The advantages of Basic CAN are the small chip size leading to low costs of these devices. dsPIC30F Family Reference Manual DS70074C-page 26-14 © 2004 Microchip Technology Inc. Full CAN devices do the whole bus protocol in hardware, including the acceptance filtering and the message management. They contain several so called message objects which handle the identifier, the data, the direction (receive or transmit) and the information Standard CAN/Extended CAN. During the initialization of the device, the host CPU defines which messages are to be sent and which are to be received. The host CPU is informed by interrupt if the identifier of a received message matches with one of the programmed (receive-) message objects. In this way. the CPU load is reduced. Using Full CAN devices, high baud rates and high bus loads with many messages can be handled. These chips are more expensive than the Basic CAN devices, though. Many Full CAN chips provide a “Basic-CAN Feature”. One of their messages objects can be programmed in a way that every message is stored there that does not match with one of the other message objects. This can be very helpful in a number of applications. B.4 ISO Model The lSO/OSl Reference Model is used to define the layers of protocol of a communication system, as shown in Figure B-1. At the highest end, the applications need to communicate between each other. At the lowest end, some physical medium is used to provide electrical signaling. The higher levels of the protocol are run by software. Typically, only the application layer is implemented. Within the CAN bus specification, there is no definition of the type of message or the contents or meaning of the messages transferred. These definitions are made in systems such as Volcano, the Volvo automotive CAN specification; J1939, the U.S. heavy truck multiplex wiring spec; and Allen-Bradly DeviceNet and Honeywell SDS, examples of industrial protocols. The CAN bus module definition encompasses two levels of the overall protocol. • The Data Link Layer - The Logical Link Control (LLC) sub-layer - The Medium Access Control (MAC) sub-layer • - The Physical Layer - The Physical Signaling (PLS) sub-layer The LLC sub layer is concerned with Message Filtering, Overload Notification and Error Recovery Management. The scope of the LLC sub-layer is: • To provide services for data transfer and for remote data request • To decide which messages received by the LLC sub layer are actually to be accepted • To provide means for error recovery management and overload notifications The MAC sub-layer represents the kernel of the CAN protocol. The MAC sub-layer defines the transfer protocol (i.e., controlling the Framing, Performing Arbitration, Error Checking, Error Signalling and Fault Confinement). It presents messages received from the LLC sub-layer and accepts messages to be transmitted to the LLC sub-layer. Within the MAC sub-layer, it is decided whether the bus is free for starting a new transmission or whether a reception is just starting. The MAC sub-layer is supervised by a management entity called Fault Confinement, which is a self-checking mechanism for distinguishing short disturbances from permanent failures. Also, some general features of the bit timing are regarded as part of the MAC sub-layer. The physical layer defines the actual transfer of the bits between the different nodes with respect to all electrical properties. The PLS sub-layer defines how signals are actually transmitted and therefore deals with the description of Bit Timing, Bit Encoding and Synchronization. The lower levels of the protocol are implemented in driver/receiver chips and the actual interface, such as twisted pair wiring or optical fiber etc. Within one network, the physical layer has to be the same for all nodes. The Driver/Receiver Characteristics of the Physical Layer are not defined so as to allow transmission medium and signal level implementations to be optimized for their application. The most common example is defined in the ISO11898 Road Vehicles Multiplex Wiring specification. © 2004 Microchip Technology Inc. DS70074C-page 26-15 Section 26. Appendix Appendix 26 Figure B-1: CAN Bus in ISO/OSI Reference Model OSI REFERENCE LAYERS Application Presentation Session Transport Network Data Link Layer LLC (Logical Link Control) Acceptance Filtering Overload Notification Recovery Management MAC (Medium Access Control) Data Encapsulation/Decapsulation Frame Coding (stuffing, destuffing) Medium Access Management Error Detection Error Signalling Acknowledgment Serialization/Deserialization PLS (Physical Signalling) Bit Encoding/Decoding Bit Timing Synchronization PMA (Physical Medium Attachment) Driver/Receiver Characteristics MDI (Medium Dependent Interface) Connectors Fault confinement (MAC-LME) Bus Failure management (PLS-LME) Supervisor SHADED REGIONS DEFINED BY CAN BUS SPECIFICATION Physical Layer dsPIC30F Family Reference Manual DS70074C-page 26-16 © 2004 Microchip Technology Inc. B.5 CAN Bus Features CAN has the following properties: • Prioritization of messages • Latency times ensured • Configuration flexibility • Multi-cast reception with time synchronization • System wide data consistency • Multi-master • Error detection and signaling • Automatic retransmission of corrupted messages • Distinction between temporary errors and permanent failures of nodes and autonomous switching off of defect nodes 1. Messages – information on the bus is sent in fixed format messages of different but limited length. When the bus is free any connected unit may start to transmit a new message. 2. Information Routing – In CAN systems, a CAN node does not make use of any information about the system configuration (e.g., station addresses). 3. System Flexibility – Nodes can be added to the CAN network without requiring any change in the software or hardware of any node and application layer. 4. Message Routing – The content of a message is named by an ldentifier. The ldentifier does not indicate the destination of the message, but describes the meaning of the data, so that all nodes in the network are able to decide by Message Filtering whether the data is to be acted upon by them or not. 5. Multicast – As a consequence of the concept of Message Filtering, any number of nodes can receive and simultaneously act upon the same message. 6. Data Consistency – Within a CAN network, it is ensured that a message is simultaneously accepted either by all nodes or by no node. Thus, data consistency of a system is achieved by the concepts of multicast and by error handling. 7. Bit Rate – The speed of CAN may be different in different systems. However, in a given system, the bit-rate is uniform and fixed. 8. Prioritization – The ldentifier defines a static message priority during bus access. 9. Remote Data Request – By sending a remote frame, a node requiring data may request another node to send the corresponding data frame. The date frame and the corresponding remote frame are named by the same ldentifier. 10. Multimaster – When the bus is free, any unit may start to transmit a message. The unit with the message of higher priority to be transmitted gains bus access. 11. Arbitration – Whenever the bus is free, any unit may start to transmit a message. If 2 or more units start transmitting messages at the same time, the bus access conflict is resolved by bitwise arbitration using the ldentifier. The mechanism of arbitration ensures that neither information nor time is lost. If a data frame and a remote frame with the same ldentifier are initiated at the same time, the data frame prevails over the remote frame. During arbitration, every transmitter compares the level of the bit transmitted with the level that is monitored on the bus. If these levels are equal, the unit may continue to send. When a ’recessive’ level is sent and a ’dominant’ level is monitored, the unit has lost arbitration and must withdraw without sending one more bit. 12. Safety – In order to achieve the highest safety of data transfer, powerful measures for error detection, signaling and self-checking are implemented in every CAN node. 13. Error Detection – For detecting errors the following measures have been taken: • Monitoring (transmitters compare the bit levels to be transmitted with the bit levels detected on the bus) • Cyclic Redundancy Check • Bit Stuffing • Message Frame Check © 2004 Microchip Technology Inc. DS70074C-page 26-17 Section 26. Appendix Appendix 26 The error detection mechanisms have the following properties: • all global errors are detected • all local errors at transmitters are detected • up to 5 randomly distributed errors in a message are detected • burst errors of length less than 15 in a message are detected • errors of any odd number in a message are detected 14. Error Signalling and Recovery Time – Corrupted messages are flagged by any node detecting an error. Such messages are aborted and will be retransmitted automatically. The recovery time from detecting an error until the start of the next message is at most 31 bit times, if there is no further error. 15. Fault Confinement – CAN nodes are able to distinguish short disturbances from permanent failures. Defective nodes are switched off. 16. Connections – The CAN serial communication link is a bus to which a number of units may be connected. This number has no theoretical limit. Practically the total number of units will be limited by delay times and/or electrical loads on the bus line. 17. Single Channel – The bus consists of a single channel that carries bits. From this data resynchronization, information can be derived. The way in which this channel is implemented is not fixed in this specification (i.e., single wire (plus ground), two differential wires, optical fires, etc). 18. Bus values – The bus can have one of two complementary logical values; ‘dominant’ or ‘recessive’. During simultaneous transmission of ‘dominant’ and ‘recessive’ bits, the resulting bus value will be ‘dominant’. For example, in case of a wired-AND implementation of the bus, the ‘dominant’ level would be represented by a logical ‘0’ and the ‘recessive’ level by a logical ‘1’. Physical states (e.g., electrical voltage, light) that represent the logical levels are not given in the specification. 19. Acknowledgment – All receivers check the consistency of the message being received and will acknowledge a consistent message and flag an inconsistent message. 20. Sleep Mode; Wake-up – To reduce the system's power consumption, a CAN device may be set into Sleep mode without any internal activity and with disconnected bus drivers. The Sleep mode is finished with a wake-up by any bus activity or by internal conditions of the system. On wake-up, the internal activity is restarted, although the MAC sub-layer will be waiting for the system's oscillator to stabilize and it will then wait until it has synchronized itself to the bus activity (by checking for eleven consecutive ‘recessive’ bits), before the bus drivers are set to “on-bus” again. dsPIC30F Family Reference Manual DS70074C-page 26-18 © 2004 Microchip Technology Inc. B.6 Frame Types B.6.1 Standard Data Frame A data frame is generated by a node when the node wishes to transmit data. The Standard CAN Data Frame is shown in Figure B-2. In common with all other frames, the frame begins with a Start-Of-Frame bit (SOF – dominant state) for hard synchronization of all nodes. The SOF is followed by the Arbitration field consisting of 12 bits, the 11-bit ldentifier (reflecting the contents and priority of the message) and the RTR bit (Remote Transmission Request bit). The RTR bit is used to distinguish a data frame (RTR – dominant) from a remote frame. The next field is the Control field, consisting of 6 bits. The first bit of this field is called the lDE bit (Identifier Extension) and is at dominant state to specify that the frame is a standard frame. The following bit is reserved, RB0, and defined as a dominant bit. The remaining 4 bits of the Control field are the Data Length Code (DLC) and specify the number of bytes of data contained in the message. The data being sent follows in the Data field, which is of the length defined by the DLC above (1-8 bytes). The Cyclic Redundancy field (CRC) follows and is used to detect possible transmission errors. The CRC field consists of a 15-bit CRC sequence, completed by the recessive CRC Delimiter bit. The final field is the Acknowledge field. During the ACK Slot bit, the transmitting node sends out a recessive bit. Any node that has received an error free frame acknowledges the correct reception of the frame by sending back a dominant bit (regardless of whether the node is configured to accept that specific message or not). From this, it can be seen that CAN belongs to the “in-bit-response” group of protocols. The recessive Acknowledge Delimiter completes the Acknowledge slot and may not be overwritten by a dominant bit. B.7 Extended Data Frame In the Extended CAN Data frame, shown in Figure B-3, the Start-Of-Frame bit (SOF) is followed by the Arbitration field consisting of 38 bits. The first 11 bits are the 11 most significant bits of the 29-bit identifier (“Base-lD”). These 11 bits are followed by the Substitute Remote Request bit, SRR, which is transmitted as recessive. The SRR is followed by the lDE bit, which is recessive to denote that the frame is an extended CAN frame. It should be noted from this, that if arbitration remains unresolved after transmission of the first 11 bits of the identifier, and one of the nodes involved in arbitration is sending a standard CAN frame (11-bit identifier), then the standard CAN frame will win arbitration due to the assertion of a dominant lDE bit. Also, the SRR bit in an extended CAN frame must be recessive to allow the assertion of a dominant RTR bit by a node that is sending a standard CAN remote frame. The SRR and lDE bits are followed by the remaining 18 bits of the identifier (“lD-Extension”) and the Remote Transmission Request bit. To enable standard and extended frames to be sent across a shared network, it is necessary to split the 29-bit extended message identifier into 11-bit (most significant) and 18-bit (least significant) sections. This split ensures that the Identifier Extension bit (lDE) can remain at the same bit position in both standard and extended frames. The next field is the Control field, consisting of 6 bits. The first 2 bits of this field are reserved and are at dominant state. The remaining 4 bits of the Control field are the Data Length Code (DLC) and specify the number of data bytes. The remaining portion of the frame (Data field, CRC field, Acknowledge field, End-Of-Frame and lntermission) is constructed in the same way as for a standard data frame. © 2004 Microchip Technology Inc. DS70074C-page 26-19 Section 26. Appendix Appendix 26 B.8 Remote Frame Normally data transmission is performed on an autonomous basis with the data source node (e.g., a sensor sending out a data frame). It is possible, however, for a destination node to request the data from the source. For this purpose, the destination node sends a “remote frame” with an identifier that matches the identifier of the required data frame. The appropriate data source node will then send a data frame as a response to this remote request. There are 2 differences between a remote frame and a data frame, shown in Figure B-4. First, the RTR bit is at the recessive state and second, there is no data field. In the very unlikely event of a data frame and a remote frame with the same identifier being transmitted at the same time, the data frame wins arbitration due to the dominant RTR bit following the identifier. In this way, the node that transmitted the remote frame receives the desired data immediately. B.9 Error Frame An error frame is generated by any node that detects a bus error. An error frame, shown in Figure B-5, consists of 2 fields, an error flag field followed by an error delimiter field. The error delimiter consists of 8 recessive bits and allows the bus nodes to restart bus communications cleanly after an error. There are two forms of error flag fields. The form of the error flag field depends an the error status of the node that detects the error. If an error-active node detects a bus error then the node interrupts transmission of the current message by generating an active error flag. The active error flag is composed of six consecutive dominant bits. This bit sequence actively violates the bit stuffing rule. All other stations recognize the resulting bit stuffing error and in turn generate error frames themselves, called error echo flags. The error flag field therefore consists of between six and twelve consecutive dominant bits (generated by one or more nodes). The error delimiter field completes the error frame. After completion of the error frame, bus activity returns to normal and the interrupted node attempts to resend the aborted message. If an error passive node detects a bus error, then the node transmits an error passive flag followed again by the error delimiter field. The error passive flag consists of six consecutive recessive bits, and therefore the error frame for an error passive node consists of 14 recessive bits. From this, it follows that, unless the bus error is detected by the bus master node that is actually transmitting, the transmission of an error frame by an error passive node will not affect any other node on the network. If the bus master node generates an error passive flag, then this may cause other nodes to generate error frames due to the resulting bit stuffing violation. After transmission of an error frame, an error passive node must wait for 6 consecutive recessive bits on the bus before attempting to rejoin bus communications. B.10 Interframe Space lnterframe space separates a proceeding frame (of whatever type) from a following data or remote frame. lnterframe space is composed of at least 3 recessive bits, called the intermission. This is provided to allow nodes time for internal processing before the start of the next message frame. After the intermission, the bus line remains in the recessive state (Bus idle) until the next transmission starts. dsPIC30F Family Reference Manual DS70074C-page 26-20 © 2004 Microchip Technology Inc. Figure B-2: Standard Data Frame 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 Start-Of-Frame Data Frame (number of bits = 44 + 8N) 12 Arbitration Field ID 10 11 ID3 ID0 Identifier Message Filtering Stored in Buffers RTR IDE RB0 DLC3 DLC0 6 4 Control Field Data Length Code Reserved Bits 8N (≤ N ≤ 8) Data Field 8 8 Stored in Transmit/Receive Buffers Bit Stuffing 16 CRC Field 15 CRC 7 End-OfFrame CRC Del Acknowledgment ACK Del 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 © 2004 Microchip Technology Inc. DS70074C-page 26-21 Section 26. Appendix Appendix 26 Figure B-3: Extended Data Format 1 1 1 1 1 0 bus Idle Start-Of-Frame Data Frame or Remote Frame 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 Start-Of-FrameArbitration Field 32 11 ID10 ID3 ID0 IDE Identifier Message Filtering Stored in Buffers SRR EID17 EID0 RTR RB1 RB0 DLC3 18 DLC0 6 Control Field 4 Reserved bitsData Length Code Stored in Transmit/Receive Buffers 8 8 Data Frame (number of bits = 64 + 8N) 8N (≤ N ≤ 8) Data Field 1 1 1 1 1 1 1 1 16 CRC Field 15 CRC CRC Del Acknowledgment ACK Del End-OfFrame 7 Bit Stuffing 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 Extended Identifier dsPIC30F Family Reference Manual DS70074C-page 26-22 © 2004 Microchip Technology Inc. Figure B-4: Remote Data Frame Identifier Message Filtering Stored in Buffers Data Length Code Reserved Bits Bit Stuffing 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 0 1 0 0 1 1 1 1 1 1 1 1 1 Start-Of-Frame Remote Frame (number of bits = 44) 12 Arbitration Field ID 10 11 ID0 RTR IDE RB0 DLC3 DLC0 6 4 Control Field 16 CRC Field 15 CRC 7 End-OfFrame CRC Del Acknowledgment ACK Del 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 © 2004 Microchip Technology Inc. DS70074C-page 26-23 Section 26. Appendix Appendix 26 Figure B-5: Error Frame 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 0 0 0 0 Start-Of-Frame Interrupted Data Frame 12 Arbitration Field ID 10 11 ID3 ID0 Identifier Message Filtering RTR IDE RB0 DLC3 DLC0 6 4 Control Field Data Length Code Reserved Bits 8N (≤ N ≤ 8) Data Field 8 8 Bit Stuffing 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 INT Suspend Transmit bus Idle Any Frame Inter-Frame Space Start-Of-Frame Data Frame or Remote Frame 3 8 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 Data Frame or Remote Frame Error Frame 6 Error Flag ≤ 6 Echo Error Flag 8 Error Delimiter Inter-Frame Space 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 90 dsPIC30F Family Reference Manual DS70074C-page 26-24 © 2004 Microchip Technology Inc. B.11 Referenced Documents Title Document Road Vehicles; Interchange of Digital Information, Controller Area Network ISO11898 Bosch CAN Specification Version 2.0 © 2004 Microchip Technology Inc. DS70074C-page 26-25 Section 26. Appendix Appendix 26 APPENDIX C: CODEC PROTOCOL OVERVIEW This appendix summarizes audio coder/decoder (codec) protocols for Inter-IC Sound (I2S) and AC-Link Compliant mode interfaces. Many codecs intended for use in audio applications support sampling rates between 8 kHz and 48 kHz and typically use one of the interface protocols previously mentioned. The Data Converter Interface (DCI) module automatically handles the interface timing associated with these codecs. No overhead from the CPU is required until the requested amount of data has been transmitted and/or received by the DCI. Up to four data words may be transferred between CPU interrupts. C.1 I2S Protocol Description Inter-IC Sound (I2S) is a simple, three-wire bus interface used for the transfer of digital audio data between the following devices: • DSP processors • A/D and D/A converters • Digital input/output interfaces This Appendix information is intended to supplement the I2S Protocol Specification®, which is published by Philips, Inc. The I2S bus is a time division multiplexed and transfers two channels of data. These two data channels are typically the left and right channels of a digital audio stream. The I2S bus has the following connection pins: • SCK: The I2S serial clock line • SDx: The I2S serial data line (input or output) • WS: The I2S word select line A timing diagram for a data transfer is shown in Figure C-2. Serial data is transmitted on the I2S bus in two’s complement format with the MSb transmitted first. The MSb must be transferred first because the protocol allows different transmitter and receiver data word lengths. If a receiver is sent more bits than in can accept for a data word, the LSbits are ignored. If a receiver is sent fewer bits than its native word length, it must set the remaining LSbits to zero internally. The WS line indicates the data channel that is being transmitted. The following standard is used: • WS = 0: Channel 1 or left audio channel • WS = 1: Channel 2 or right audio channel The WS line is sampled by the receiver on the rising edge of SCK and the MSb of the next data word is transmitted one SCK period after WS changes. The one period delay after WS changes provides the receiver time to store the previously transmitted word and prepare for the next word. Serial data sent by the transmitter is placed on the bus on the falling edge of SCK and is latched by the receiver on the rising edge of SCK. Any device may act as the system master in an I2S system. The system master generates the SCK and WS signals. Typically, the transmitter is the system master, but the receiver or a third device may perform this function. Figure C-1 shows possible I2S bus configurations. Although it is not indicated in Figure C-1, the two connected devices may have both a data transmit and a data receive connection. dsPIC30F Family Reference Manual DS70074C-page 26-26 © 2004 Microchip Technology Inc. Figure C-1: I2S Bus Connections Figure C-2: I2S Interface Timing Diagram C.2 AC ‘97 Protocol The Audio Codec ‘97 (AC ‘97) specification defines a standard architecture and digital interface protocol for audio codecs used in PC platforms. The digital interface protocol for an AC ‘97 compliant codec is called AC-Link and is the focus of this discussion. The specific requirements and features of the AC ‘97 controller device are not described here. This Appendix information is intended to supplement the AC ‘97 Component Specification document, which is published by Intel, Corp. C.3 AC-Link Signal Descriptions All AC-Link signals are derived from the AC ‘97 master clock source. The recommended clock source is a 24.576 MHz crystal connected to the AC ‘97 codec to minimize clock jitter. The 24.576 MHz clock may also be provided by the AC ‘97 controller or by an external source. All AC-Link signal names are referenced to the AC ‘97 controller, not the AC ‘97 codec. The controller is the device that generates the SYNC signal to initiate data transfers. Each signal is described in subsequent sections. SCK WS SD SCK WS SD I 2S Receiver SCK WS SD Transmitter master Receiver master Separate controller as master I 2S Transmitter I 2S Controller I 2S Transmitter I2S Receiver I 2 I S Receiver 2S Transmitter Note: A 5 bit transfer is shown here for illustration purposes. The I2S protocol does not specify word length – this is system dependent. MSB LSB MSB LSB SCK SD WS © 2004 Microchip Technology Inc. DS70074C-page 26-27 Section 26. Appendix Appendix 26 C.3.1 Bit Clock (BIT_CLK) A 12.288 MHz BIT_CLK signal is provided by the master AC ’97 codec in a system. The BIT_CLK signal is an input to the AC ‘97 controller and up to three slave AC ‘97 codec devices in the system. All data on the AC-Link transitions on the rising edge of BIT_CLK and is sampled by the receiving device on the falling edge of BIT_CLK. C.3.2 Serial Data Output (SDO) SDO is a time division multiplexed data stream sent to the AC ‘97 codec C.3.3 Serial Data Input (SDI) SDI is the time division multiplexed data stream from the AC ‘97 codec. C.3.4 SYNC SYNC is a 48 kHz fixed rate sample synchronization signal that is supplied from the AC ‘97 controller to the AC ‘97 codec. The SYNC signal is derived by dividing the BIT_CLK signal by 256. The SYNC signal is high for 16 BIT_CLK periods and is low for 240 BIT_CLK periods. The SYNC signal only changes on the rising edge of BIT_CLK and its period defines the boundaries of one audio data frame. C.3.5 Reset The RESET signal is an input to each AC ‘97 codec in the system and resets the codec hardware. C.4 AC-Link Protocol C.4.1 AC-Link Serial Interface Protocol The AC-Link serial data stream uses a time division multiplexed (TDM) scheme with a 256-bit data frame. Each data frame is subdivided into 13 time slots, numbered Slot #0 – Slot #12. Slot #0 is a special time slot that contains 16 bits. The remaining 12 slots are 20-bits wide. An example of an AC-Link frame is shown in Figure C-4. The frame begins with a rising edge of the SYNC signal which is coincident with the rising edge of BIT_CLK. The AC ‘97 codec samples the assertion of SYNC on the falling edge of BIT_CLK that immediately follows. This falling edge marks the time when both the codec and controller are aware of the start of a new frame. On the next rising edge of BIT_CLK, the codec asserts the MSb of SDATA_IN and the codec asserts the first edge of SDATA_OUT. This sequence ensures that data transitions and subsequent sample points for both incoming and outgoing data streams are time aligned. Slot #0, Slot #1 and Slot #2 have special use for status and control in the AC-Link protocol. The remaining time slots are assigned to certain types of digital audio data. The data assignment for Slot #3 – Slot #12 is dependent on the AC ‘97 codec that is selected, so the slot usage is summarized briefly here. For more details on slot usage, refer to the AC ‘97 Component Specification. dsPIC30F Family Reference Manual DS70074C-page 26-28 © 2004 Microchip Technology Inc. C.4.2 Slot #0, TAG Frame Slot #0 is commonly called the ‘tag frame’. The tag frame has a bit location for each data time slot in the AC-Link protocol. These bits are used to specify which time slots in a frame are valid for use by the controller. A “1” in a given bit position of Slot #0 indicates that the corresponding time slot within the current audio frame has been assigned to a data stream, and contains valid data. If a slot is “tagged” invalid, it is the responsibility of the source of the data, (AC ‘97 codec for the input stream, AC ’97 controller for the output stream), to stuff all bit positions with 0s during the slot’s active time. There are also special bits in the tag frame. The MSb of the tag frame for SDATA_OUT is a ‘Frame Valid’ Status bit. The Frame Valid bit serves as a global indicator to the codec that at least one time slot in the frame has valid data. If the entire frame is tagged invalid, the codec can ignore all subsequent slots in the frame. This feature is used to implement sample rates other than 48 kHz. The two LSbs of the SDATA_OUT tag frame indicate the codec address. Up to four AC ‘97 codecs may be connected in a system. If only one codec is used in a system, these bits remain 0’s. The MSb of the SDATA_IN is used as a ‘Codec Ready’ Status bit. If this bit location is a ‘0’, then the codec is powered down and/or not ready for normal operation. If the ‘Codec Ready’ bit is set, it is the responsibility of the controller to query the status registers in the codec to see which subsections are operable. C.4.3 Slot #1 (Command Address) and Slot #2 (Command Data) Slot #1 and Slot #2 also have special uses in the AC-Link protocol. These time slots are used for address and data values when reading or writing the AC ‘97 codec control registers. These time slots must be tagged as valid in Slot #0 in order to read and write the control registers. The AC ‘97 Component Specification allows for sixty-four (64) 16-bit control registers in the codec. Seven address bits are provided in the AC-Link protocol, but only even-numbered addresses are used. The odd numbered address values are reserved. Slot #1 and Slot #2 for the SDATA_OUT line are called the Command Address and Command Data, respectively. The Command Address slot on the SDATA_OUT line is used to specify the codec register address and to specify whether the register access will be a read or a write. The Command Data slot on SDATA_OUT contains the 16-bit value that will be written to one of the codec control registers. If a read of the codec registers is being performed, the Command Data bits are set to ‘0’s. Slot #1 and Slot #2 for the SDATA_IN line are called the Status Address and Status Data slots, respectively. The Status Address time slot echos the register address that was previously sent to the codec. If this value is ‘0’, an invalid address was previously sent to the codec. The Status Address time slot also has ten Slot Request bits. The Slot Request bits can be manipulated by the codec for applications with variable sample rates. The Status Data time slot returns 16-bit data read from the codec control/status registers. C.4.4 Slot #3 (PCM Left Channel) Slot #3 in the SDATA_OUT signal is used for the composite digital audio left playback stream. For soundcard applications, this is typically the combined .WAV audio and MIDI synthesizer output. Slot #3 in the SDATA_IN signal is the left channel record data taken from the AC ‘97 codec input mixer. C.4.5 Slot #4 (PCM Right Channel) Slot #4 in the SDATA_OUT signal is used for the composite digital audio right playback stream. For soundcard applications, this is typically the combined .WAV audio and MIDI synthesizer output. Slot #4 in the SDATA_IN signal is the right channel record data taken from the AC ‘97 codec input mixer. © 2004 Microchip Technology Inc. DS70074C-page 26-29 Section 26. Appendix Appendix 26 C.4.6 Slot #5 (Modem Line 1) Slot #5 in the SDATA_OUT signal is used for modem DAC data. The default resolution for modem compatible AC ‘97 codecs is 16 bits. As in all time slots, the unused bits in the slot are set to ‘0’. Slot #5 in the SDATA_IN signal is used for the modem ADC data. C.4.7 Slot #6 Slot #6 in the SDATA_OUT signal is used for PCM Center Channel DAC data in 4 or 6-channel sound configurations. Slot #6 in the SDATA_IN signal is used for dedicated microphone record data. The data in this slot allows echo cancellation algorithms to be used for speakerphone applications. C.4.8 Slot #7 Slot #7 in the SDATA_OUT signal is used for PCM Left Channel DAC data in 4 or 6-channel sound configurations. Slot #7 in the SDATA_IN signal is reserved for future use in the AC ‘97 Component Specification. C.4.9 Slot #8 Slot #8 in the SDATA_OUT signal is used for PCM Right Channel DAC data in 4 or 6-channel sound configurations. Slot #8 in the SDATA_IN signal is reserved for future use in the AC ‘97 Component Specification. C.4.10 Slot #9 Slot #9 in the SDATA_OUT signal is used for PCM LFE DAC data in 6-channel sound configurations. Slot #9 in the SDATA_IN signal is reserved for future use in the AC ‘97 Component Specification. C.4.11 Slot #10 (Modem Line 2) Slot #10 is used for the modem line 2 ADC and DAC data in modem compatible devices. C.4.12 Slot #11 (Modem Handset) Slot #11 is used for the modem handset ADC and DAC data in modem compatible devices. C.4.13 Slot #12 (GPIO Control/Status) The bits in Slot #12 are used for reading and writing GPIO pins in the AC ‘97 codec. The GPIO pins are provided for modem control functions on modem compatible devices. Figure C-3: AC-Link Signal Connections AC ‘97 Controller AC ‘97 Codec 24.576 MHz BIT_CLK SYNC SDATA_OUT SDATA_IN /RESET dsPIC30F Family Reference Manual DS70074C-page 26-30 © 2004 Microchip Technology Inc. Figure C-4: AC-Link Data Frame Figure C-5: SDATA_IN Bit Locations for SLOT#0, SLOT#1, SLOT#2 Tag Frame Command Address Command Data Slot3 Left PCM Data Slot 4 Right PCM Data Slot 10 Line 2 DAC Slot 11 Handset DAC Slot 12 Codec I/O Control Tag Frame Status Address Status Data Slot3 Left PCM Data Slot 4 Right PCM Data Slot 10 Line 2 ADC Slot 11 Handset ADC Slot 12 Codec I/O Status 16 20 20 20 20 20 20 20 256 SDATA_OUT SDATA_IN SYNC SLOT#0: TAG Slot SLOT#1: Control Address Echo And SLOTREQ Bits Codec Ready Slot 1 Valid Slot 2 Valid Slot 3 Valid Slot 4 Valid Slot 5 Valid Slot 6 Valid Slot 7 Valid Slot 9 Valid Slot 10 Valid Slot 11 Valid Slot 12 Valid Slot 8 Valid ___ ___ ___ bit 15 bit 0 Resvd 0 Slot 3 Slot 8 Slot 9 Slot 10 Slot 4 Slot 5 Slot 6 Slot 7 bit 19 bit 18 bit 12 bit 0 Control Register Index Echo (Set to 0siftaggedinvalidbyAC'97codec.) Slot 11Slot 12 Reserved (set to 0) bits 11-2: On demand data request flags – 0 = send data, 1 = do NOTsend data bit 11 bit 2 bit 0 bit 19 Control Register 16-bit Read Data (Set to 0siftaggedinvalidbyAC'97codec.) Reserved (set to 0) bit 4 SLOT#2: Codec Control Register Read Data © 2004 Microchip Technology Inc. DS70074C-page 26-31 Section 26. Appendix Appendix 26 Figure C-6: SDATA_OUT Bit Locations for SLOT#0, SLOT#1, SLOT#2 SLOT#0: TAG Slot SLOT#1: Command Address SLOT#2: Command Data Valid Frame Slot 1 Valid Slot 2 Valid Slot 3 Valid Slot 4 Valid Slot 5 Valid Slot 6 Valid Slot 7 Valid Slot 9 Valid Slot 10 Valid Slot 11 Valid Slot 12 Valid Slot 8 Valid ___ Codec ID Codec ID bit 15 bit 0 R/W bit bit 0 bit 19 bit 18 bit 12 Control Register Index Reserved (set to 0) bit 11 bit 0 bit 19 Control Register 16-bit Write Data (Set to 0sifcurrentlyperformingareadoperation.)' Reserved (set to 0) bit 4 dsPIC30F Family Reference Manual DS70074C-page 26-32 © 2004 Microchip Technology Inc. NOTES: © 2006 Microchip Technology Inc. DS70046E-page 1 dsPIC30F Family Reference Manual Index A A/D Accuracy/Error ............................................17-47, 18-28 ADCON0 Register...........................................17-4, 18-4 Configuring Analog Port Pins......................17-14, 18-12 Edge Detection Mode ..............................................13-8 Effects of a Reset........................................16-19, 17-55 Effects of a Reset (12-bit) ......................................18-33 Enabling the Module ..............................................17-16 Enabling the Module (12-bit)..................................18-14 How to Start Sampling ...........................................17-17 How to Stop Sampling and Start Conversions.......17-18 Reading the A/D Result Buffer...............................17-46 Sampling Requirements..............................17-45, 18-26 Transfer Function........................................17-47, 18-28 Transfer Function (12-bit) ......................................18-28 A/D Accuracy/Error ........................................................17-47 A/D Accuracy/Error (12-bit)............................................18-28 A/D Conversion Speeds......................................17-49, 18-30 A/D Converter External Conversion Request ..................6-10 A/D Module Configuration..............................................17-13 A/D Module Configuration (12-bit) .................................18-11 A/D Sampling Requirements (12-bit) .............................18-26 A/D Special Event Trigger..............................................12-22 A/D Terminology and Conversion Sequence.................17-11 A/D Terminology and Conversion Sequence (12-bit) ....18-10 Accumulator ‘Write Back’ .................................................2-25 ACK................................................................................21-38 Acknowledge Pulse........................................................21-38 Address Generator Units and DSP Class Instructions.......3-6 Address Register Dependencies .....................................2-35 AKS................................................................................21-17 Alternate Vector Table .......................................................6-2 Arithmetic Logic Unit (ALU)..............................................2-17 B Barrel Shifter ....................................................................2-26 Baud Rate Generator (BRG)......................................................19-8 Tables ......................................................................19-9 BF .......................................................................21-18, 21-19 Bit-Reversed Addressing .................................................3-14 and Modulo Addressing ...........................................3-15 Code Example .........................................................3-18 Intro..........................................................................3-14 Modifier Value ..........................................................3-16 Operation .................................................................3-15 Block Diagrams Dedicated Port Structure..........................................11-2 DSP Engine .............................................................2-19 dsPIC30F CPU Core..................................................2-3 External Power-on Reset Circuit (For Slow VDD Rise Time) .........................................................8-7 Input Capture ...........................................................13-2 Input Change Notification.........................................11-7 Low Voltage Detect (LVD) .........................................9-3 Oscillator System.......................................................7-4 Output Compare Module..........................................14-2 Reset System.............................................................8-2 Shared Port Structure ..............................................11-4 Type A Timer ...........................................................12-3 Type B - Type C Timer Pair (32-bit Timer).............12-17 Type B Timer ...........................................................12-4 Type C Timer ...........................................................12-5 UART .......................................................................19-2 UART Receiver ......................................................19-16 UART Transmitter.................................................. 19-11 WDT ........................................................................ 10-6 Brown-out Reset (BOR)..................................................... 8-8 Configuration ............................................................. 8-9 Current Consumption for Operation .......................... 8-9 Byte to Word Conversion................................................. 2-17 C CAN Buffer Reception and Overflow Truth Table .......... 23-44 Message Acceptance Filters ................................. 23-12 CAN Library ..................................................................... 25-9 Capture Buffer Operation................................................. 13-8 Clock Switching Aborting ................................................................... 7-36 Enable ..................................................................... 7-34 Entering Sleep Mode During ................................... 7-36 Operation................................................................. 7-34 Recommended Code Sequence ............................. 7-36 Tips.......................................................................... 7-36 CN Change Notification Pins ......................................... 11-7 Configuration and Operation ................................... 11-8 Control Registers..................................................... 11-7 Operation in Sleep and Idle Modes ......................... 11-8 Code Examples Clock Switching ....................................................... 7-37 Compare Mode Toggle Mode Pin State Setup........ 14-8 Compare Mode Toggle Setup and Interrupt Servicing.......................................................... 14-8 Configuration Register Write ................................... 5-15 Continuous Output Pulse Setup and Interrupt Servicing........................................................ 14-16 Initialization Code for 16-bit Asynchronous Counter Mode Using an External Clock Input ............. 12-11 Initialization Code for 16-bit Gated Time Accumulation Mode ............................................................. 12-13 Initialization Code for 16-bit Synchronous Counter Mode Using an External Clock Input ....................... 12-10 Initialization Code for 16-bit Timer Using System Clock................................................... 12-9 Initialization Code for 32-bit Gated Time Accumulation Mode....................................... 12-20 Initialization Code for 32-bit Synchronous Counter Mode Using an External Clock Input ....................... 12-19 Initialization Code for 32-bit Timer Using Instruction Cycle as Input Clock...................................... 12-18 Prescaled Capture................................................... 13-7 PWM Mode Pulse Setup and Interrupt Servicing........................................................ 14-22 Reading from a 32-bit Timer.................................. 12-21 Single Output Pulse Setup and Interrupt Servicing........................................................ 14-12 Single Row Programming........................................ 5-14 8-bit Transmit/Receive (UART1) ........................... 19-20 9-bit Transmit/Receive (UART1), Address Detect Enabled ......................................................... 19-20 CODEC Interface Basics and Terminology ..................... 22-8 Complementary PWM Output Mode.............................. 15-26 Configuration Bit Descriptions ......................................... 24-6 BOR and POR ......................................................... 24-6 General Code Segment........................................... 24-6 Motor Control PWM Module .................................... 24-6 Oscillator.................................................................. 24-6 Connection Considerations............................................ 17-47 Connectivity Development Board .................................. 25-14 Control Register Descriptions.......................................... 3-18 Index DS70046E-page 2 © 2006 Microchip Technology Inc. Control Registers .......................................... 12-6, 17-4, 18-4 Assignment of Interrupts ..........................................6-14 Controlling Sample/Conversion Operation.....................17-29 Controlling Sample/Conversion Operation (12-bit) ........18-19 Conversion Sequence Examples...................................17-31 Conversion Sequence Examples (12-bit).......................18-21 CPU Register Maps..........................................................2-38 Related Application Notes........................................2-40 Revision History .......................................................2-41 CPU Clocking Scheme.......................................................7-5 CPU Priority Status ............................................................6-5 CPU Register Descriptions ..............................................2-11 Crystal Oscillators, Ceramic Resonators .........................7-22 D Data Accumulator Status Bits................................................................2-23 Data Accumulator Adder/Subtractor ................................2-23 Data Accumulators...........................................................2-20 Data Alignment...................................................................3-7 Data EEPROM Programming ..........................................5-15 Erasing One Row.....................................................5-19 Erasing One Word ...................................................5-17 Reading Memory......................................................5-21 Row Algorithm..........................................................5-16 Single Word Algorithm .............................................5-16 Write One Row.........................................................5-20 Writing One Word ....................................................5-18 Data Memory Map ............................................................................3-3 Near ...........................................................................3-4 Data Space Address Generator Units (AGUs).............................................3-5 X Address Generator Unit..........................................3-5 Y Address Generator Unit..........................................3-5 Data Space Write Saturation............................................2-24 DCI Buffer Control Unit .................................................22-13 Control Register Descriptions ..................................22-2 Operation ...............................................................22-10 Using the Module ...................................................22-17 Dead Time Control .........................................................15-27 Determining Best Values for Crystals, Clock Mode, C1, C2, and Rs ........................................................7-24 Device Configuration Register Descriptions...............................................24-2 Device Identification Registers.........................................24-7 Device ID (DEVID) ...................................................24-7 Unit ID Field .............................................................24-7 Device Reset Times.........................................................8-11 Device Start-up Time Lines..............................................8-13 Device Wake-up on Sleep/Idle.......................................13-10 Disable Interrupts Instruction .............................................6-8 Divide Support..................................................................2-27 DSP Algorithm Library......................................................25-7 DSP Engine......................................................................2-18 DSP Engine Mode Selection............................................2-26 DSP Engine Trap Events .................................................2-26 DSP Filter Design Software Utility....................................25-8 dsPIC Language Suite .....................................................25-3 dsPIC30F Hardware Development Boards....................25-11 E Equations Calculating the PWM Period.................................. 14-19 Calculation for Maximum PWM Resolution ........... 14-20 Modulo End Address for Incrementing Buffer............ 3-9 Modulo Start Address for Decrementing Buffer......... 3-9 WDT Time-out Period.............................................. 10-7 External Clock Input......................................................... 7-25 External Interrupt Support................................................ 6-10 External RC Oscillator ..................................................... 7-26 Operating Frequency............................................... 7-27 Start-up.................................................................... 7-27 with I/O Enabled ...................................................... 7-27 External Reset (EXTR) ...................................................... 8-7 F Fail-Safe Clock Monitor (FSCM)...................................... 7-32 and Slow Oscillator Start-up .................................... 7-33 and WDT ................................................................. 7-33 Delay ....................................................................... 7-32 Flash and Data EEPROM Programming Control Registers....................................................... 5-5 NVMADR ........................................................... 5-6 NVMCON........................................................... 5-5 NVMKEY ........................................................... 5-6 Flash Program Memory Erasing a Row ......................................................... 5-12 Loading Write Latches............................................. 5-13 Programming Algorithm........................................... 5-11 FSCM and Device Resets................................................... 8-12 Delay for Crystal and PLL Clock Sources................ 8-12 G General Purpose Development Board........................... 25-12 H Hard Traps......................................................................... 6-7 Address Error (Level 13)............................................ 6-8 Oscillator Failure (Level 14)....................................... 6-8 Priority and Conflicts.................................................. 6-7 Stack Error (Level 12)................................................ 6-6 How to Start Sampling (12-bit)....................................... 18-14 How to Start Sampling and Start Conversions (12-bit) .............................................. 18-14 I I/O Multiplexing with Multiple Peripherals ........................ 11-4 I/O Pin Control ..............................12-22, 13-10, 14-23, 16-18 I/O Port Control Registers................................................ 11-3 I/O Ports Related Application Notes ..................................... 11-11 Revision History..................................................... 11-12 Idle Mode ......................................................................... 10-4 Time Delays on Wake-up from ................................ 10-5 Wake-up from on Interrupt....................................... 10-5 Wake-up from on Reset........................................... 10-5 Wake-up from on WDT Time-out............................. 10-5 Independent PWM Output Mode ................................... 15-30 Initialization .................................................................... 17-48 Initialization (12-bit)........................................................ 18-29 © 2006 Microchip Technology Inc. DS70046E-page 3 dsPIC30F Family Reference Manual Index Input Capture Associated Special Function Registers..................13-11 Buffer Not Empty (ICBNE) .......................................13-9 Design Tips............................................................13-12 Interrupts..................................................................13-9 Control Bits ......................................................13-9 Operation in Power Saving States .........................13-10 Overflow (ICOV).......................................................13-9 Related Application Notes......................................13-13 Input Capture Event Modes .............................................13-4 Input Capture Registers ...................................................13-3 Instruction Flow Types .....................................................2-27 Instruction Stall Cycles.....................................................2-36 Internal Fast RC Oscillator (FRC) ....................................7-31 Internal Low Power RC (LPRC) Oscillator .......................7-32 Enabling ...................................................................7-32 Internal Voltage Reference ................................................9-3 Interrupt Control and Status Registers.............................6-14 CORCON .................................................................6-14 IECx .........................................................................6-14 IFSx..........................................................................6-14 INTCON1, INTCON2 ...............................................6-14 IPCx .........................................................................6-14 SR ............................................................................6-14 Interrupt Controller Associated Special Function Registers....................6-43 Interrupt Latency One-Cycle Instructions.............................................6-11 Two-Cycle Instructions.............................................6-12 Interrupt Operation.............................................................6-9 Nesting.....................................................................6-10 Return From Interrupt ................................................6-9 Interrupt Priority .................................................................6-5 Interrupt Processing Timing .............................................6-11 Interrupt Setup Procedures..............................................6-42 Initialization ..............................................................6-42 Interrupt Disable.......................................................6-42 Interrupt Service Routine .........................................6-42 Trap Service Routine ...............................................6-42 Interrupt Vector Table ........................................................6-2 Interrupts Design Tips..............................................................6-44 Related Application Notes........................................6-45 Revision History.......................................................6-46 Interrupts Coincident with Power Save Instructions.........10-5 Introduction Revision History.........................................................1-7 IWCOL ...........................................................................21-22 I 2C Acknowledge Generation.......................................21-21 Building Complete Master Messages ....................21-24 Bus Arbitration and Bus Collision...........................21-30 Bus Collision During a Repeated Start Condition........................................................21-31 Bus Collision During a Start Condition...................21-31 Bus Collision During a Stop Condition ...................21-31 Bus Collision During Message Bit Transmission .................................................21-31 Bus Connection Considerations.............................21-47 Communicating as a Master in a Multi-Master Environment...................................................21-29 Communicating as a Slave ....................................21-32 Detecting Bus Collisions and Resending Messages ......................................................21-30 Detecting Start and Stop Conditions......................21-32 Detecting the Address............................................21-32 Enabling I/O ...........................................................21-13 Enabling Operation................................................ 21-13 Generating Repeated Start Bus Event .................. 21-23 Generating Start Bus Event................................... 21-16 Generating Stop Bus Event ................................... 21-22 Initiating and Terminating Data Transfer ................. 26-3 Interrupts ............................................................... 21-13 Master Message Protocol States........................... 21-24 Module Operation during PWRSAV Instruction..... 21-49 Receiving Data from a Master Device ................... 21-37 Receiving Data from a Slave Device ..................... 21-19 Sending Data to a Master Device.......................... 21-44 Sending Data to a Slave Device............................ 21-17 Start ......................................................................... 26-3 Stop ......................................................................... 26-3 I 2C Module Multi-master Mode................................................. 21-29 Register Map ......................................................... 21-33 10-bit Address Mode ............................................. 21-35 L LAT (I/O Latch) Registers................................................ 11-3 Loop Constructs .............................................................. 2-30 DO ........................................................................... 2-32 REPEAT .................................................................. 2-30 Low Power 32 kHz Crystal Oscillator............................... 7-31 Low Power 32 kHz Crystal Oscillator Input.................... 12-15 LP Oscillator Continuous Operation.............................................. 7-31 Enable ..................................................................... 7-31 Intermittent Operation.............................................. 7-31 Operation with Timer1 ............................................. 7-31 LVD Control Bits ................................................................ 9-3 Current Consumption for Operation .......................... 9-5 Design Tips................................................................ 9-6 Initialization Steps...................................................... 9-5 Operation................................................................... 9-5 Operation During Sleep and Idle Mode ..................... 9-5 Related Application Notes ......................................... 9-7 Trip Point Selection ................................................... 9-3 M Math Library..................................................................... 25-7 Microchip Hardware and Language Tools....................... 25-2 Modes of Operation ......................................................... 14-4 Compare Mode Output Driven High ........................ 14-5 Compare Mode Output Driven Low ......................... 14-6 Compare Mode Toggle Output ................................ 14-7 Dual Compare Match............................................... 14-9 Dual Compare, Continuous Output Pulses............ 14-14 Dual Compare, Generating Continuous Output Pulses Special Cases (table) .................................... 14-17 Dual Compare, Single Output Pulse........................ 14-9 Special Cases (table) .................................... 14-13 Single Compare Match ............................................ 14-4 Modulo Addressing............................................................ 3-7 Applicability.............................................................. 3-11 Calculation................................................................. 3-9 Initialization for Decrementing Buffer....................... 3-13 Initialization for Incrementing Modulo Buffer ........... 3-12 Start and End Address Selection............................... 3-8 W Address Register Selection................................... 3-9 Index DS70046E-page 4 © 2006 Microchip Technology Inc. Modulo Start and End Address Selection XMODEND Register ..................................................3-8 XMODSRT Register...................................................3-8 YMODEND Register ..................................................3-8 YMODSRT Register...................................................3-8 Motor Control Development Board.................................25-13 MPLAB ICD 2 In-Circuit Debugger...................................25-5 MPLAB ICE 4000 In-Circuit Emulator ..............................25-4 MPLAB SIM Software Simulator ......................................25-3 MPLAB 6.XX Integrated Development Environment Software...................................................................25-2 Multi-Master Mode .........................................................21-29 Multiplier...........................................................................2-20 Multiply Instructions..........................................................2-22 N Non-Maskable Traps..........................................................6-6 Address Error.............................................................6-6 Arithmetic Error ..........................................................6-6 Oscillator Failure ........................................................6-6 Stack Error .................................................................6-6 O Oscillator Configuration..............................................................7-6 Clock Switching Mode Configuration Bits ..........7-6 Design Tips ..............................................................7-38 Related Application Notes........................................7-39 Resonator Start-up...................................................7-22 Revision History .......................................................7-40 System Features Summary .......................................7-2 Oscillator Control Register (OSCCON) ............................7-13 Oscillator Mode Selection Guidelines ..............................7-21 Oscillator Start-up From Sleep Mode...............................7-23 Oscillator Start-up Timer (OST) .......................................7-31 Oscillator Switching Sequence.........................................7-35 OSEK Operating Systems..............................................25-10 Other dsPIC30F CPU Control Registers..........................2-16 DISICNT...................................................................2-16 MODCON.................................................................2-16 PSVPAG ..................................................................2-16 TBLPAG...................................................................2-16 XBREV.....................................................................2-16 XMODSRT, XMODEND...........................................2-16 YMODSRT, YMODEND...........................................2-16 Output Compare Associated Register Map .......................................14-24 Design Tips ............................................................14-26 Related Application Notes......................................14-27 Revision History .....................................................14-28 Output Compare Operating in Power Saving States......14-23 Output Compare Operation in Power Saving States Idle Mode ...............................................................14-23 Sleep Mode............................................................14-23 Output Compare Registers ..............................................14-3 P Peripheral Driver Library ..................................................25-8 Peripheral Module Disable (PMD) Registers ...................10-9 Peripheral Multiplexing.....................................................11-4 Peripherals Using Timer Modules ..................................12-22 Phase Locked Loop (PLL)................................................7-30 Frequency Range ....................................................7-30 Lock Status ..............................................................7-30 Loss of Lock During a Power-on Reset ...................7-30 Loss of Lock During Clock Switching.......................7-30 Loss of Lock During Normal Device Operation........ 7-30 POR and Long Oscillator Start-up Times ........................ 8-12 Port (I/O Port) Registers .................................................. 11-3 Power Saving Modes....................................................... 10-2 Power-on Reset (POR)...................................................... 8-5 Using ......................................................................... 8-7 Power-up Timer (PWRT) ................................................... 8-7 Prescaler Capture Events................................................ 13-6 Primary Oscillator ............................................................ 7-20 PRO MATE II Universal Device Programmer .................. 25-5 Program Memory Address Map ............................................................. 4-2 Counter...................................................................... 4-4 Data Access From ..................................................... 4-4 Data Storage ............................................................. 4-7 High Word Access ..................................................... 4-7 Low Word Access...................................................... 4-6 Program Space Visibility from Data Space................ 4-8 Related Application Notes ....................................... 4-12 Table Address Generation......................................... 4-6 Table Instruction Summary........................................ 4-5 Writes .............................................................4-10, 4-11 Programmable Digital Noise Filters ................................. 16-9 Programmable Oscillator Postscaler ............................... 7-33 Programmer’s Model ..................................................2-3, 2-4 Register Description .................................................. 2-4 Protection Against Accidental Writes to OSCCON .......... 7-13 PSV Configuration ............................................................. 4-8 PSV Mapping with X and Y Data Spaces.................. 4-8 Timing...................................................................... 4-10 Instruction Stalls .............................................. 4-10 Using PSV in a Repeat Loop........................... 4-10 Pulse Width Modulation Mode ....................................... 14-18 Duty Cycle ............................................................. 14-20 Period .................................................................... 14-19 With Fault Protection Input Pin .............................. 14-19 PWM Duty Cycle Comparison Units .............................. 15-20 PWM Fault Pins ............................................................. 15-34 PWM Output and Polarity Control.................................. 15-34 PWM Output Override ................................................... 15-31 PWM Special Event Trigger........................................... 15-38 PWM Time Base............................................................ 15-16 PWM Update Lockout.................................................... 15-37 Q QEI Operation During Power Saving Modes ................. 16-19 Quadrature Decoder ...................................................... 16-10 Quadrature Encoder Interface Interrupts ....................... 16-17 R R/W Bit..................................................................21-35, 26-4 Read-After-Write Dependency Rules .............................. 2-36 Reading A/D Result Buffer (12-bit) ................................ 18-27 Reading and Writing into 32-bit Timers ......................... 12-21 Reading and Writing 16-bit Timer Module Registers ............................................................... 12-15 Real-Time Operating System (RTOS) ............................. 25-9 © 2006 Microchip Technology Inc. DS70046E-page 5 dsPIC30F Family Reference Manual Index Registers A/D Input Scan Select (ADCSSL - 12-bit)................18-9 A/D Input Scan Select (ADCSSL)..........................17-10 ADCHS (A/D Input Select) Register................17-9, 18-8 ADCHS A/D Input Select .........................................17-9 ADCHS A/D Input Select (12-bit) .............................18-8 ADCON1 (A/D Control) Register1........17-5, 18-5, 21-11 ADCON1 A/D Control 1 ..................................17-5, 17-6 ADCON1 A/D Control 1 (12-bit) ...............................18-5 ADCON2 (A/D Control) Register2...................17-7, 18-6 ADCON2 A/D Control 2 ...........................................17-7 ADCON2 A/D Control 2 (12-bit) ...............................18-6 ADCON3 (A/D Control) Register3...................17-8, 18-7 ADCON3 A/D Control 3 ...........................................17-8 ADCON3 A/D Control 3 (12-bit) ...............................18-7 ADPCFG (A/D Port Configuration) Register ................................................17-10, 18-9 ADPCFG A/D Port Configuration ...........................17-10 ADPCFG A/D Port Configuration (12-bit).................18-9 CiCFG1 (Baud Rate Configuration Register).........23-16 CiCFG2 (Baud Rate Configuration Register 2)......23-17 CiCTRL (CAN Module Control and Status Register) ..........................................................23-3 CiEC (Transmit/Receive Error Count)....................23-18 CiINTE (Interrupt Enable Register)........................23-19 CiINTF (Interrupt Flag Register) ............................23-20 CiRXFnEIDH (Acceptance Filter n Extended Identifier High) ...............................................23-12 CiRXFnEIDL (Acceptance Filter n Extended Identifier Low) ................................................23-13 CiRXMnEIDH (Acceptance Filter Mask n Extended Identifier High) ...............................................23-14 CiRXMnEIDL (Acceptance Filter Mask n Extended Identifier Low) ................................................23-15 CiRXMnSID (Acceptance Filter Mask n Standard Identifier)........................................................23-14 CiRXnBm (Receive Buffer n Data Field Word m) .........................................................23-11 CiRXnDLC (Receive Buffer n Data Length Control) ..........................................................23-11 CiRXnEID (Receive Buffer n Extended Identifier)........................................................23-10 CiRXnSID (Receive Buffer n Standard Identifier)........................................................23-10 CiRX0CON (Receive Buffer 0 Status and Control Register) ..........................................................23-8 CiRX1CON (Receive Buffer 1 Status and Control Register) ..........................................................23-9 CiRX1FnSID (Acceptance Filter n Standard Identifier)........................................................23-12 CiTXnBm (Transmit Buffer n Data Field Word m) ...........................................................23-7 CiTXnCON (Transmit Buffer Status and Control Register) ..........................................................23-5 CiTXnDLC (Transmit Buffer n Data Length Control) ............................................................23-7 CiTXnEID (Transmit Buffer n Extended Identifier)............23-6 CiTXnSID (Transmit Buffer n Standard Identifier)..........................................................23-6 CNEN1 (Input Change Notification Interrupt Enable 1) .........................................................11-9 CNEN2 (Input Change Notification Interrupt Enable 2) .........................................................11-9 CNPU1 (Input Change Notification Pull-up Enable 1) .......................................................11-10 CNPU2 (Input Change Notification Pull-up Enable 2) ....................................................... 11-10 Control and Status................................................... 16-4 Control Registers..................................................... 15-4 CORCON (Core Control)................................ 2-14, 6-15 DCICON1 ................................................................ 22-3 DCICON2 ................................................................ 22-4 DCICON3 ................................................................ 22-5 DCISTAT ................................................................. 22-6 DFLTCON Digital Filter Control ...................... 16-7, 16-8 DTCON1 Dead Time Control 1................................ 15-9 DTCON2 Dead Time Control 2.............................. 15-10 FBORPOR (BOR and POR Configuration Register).......................................................... 24-4 FBORPOR BOR and POR Device Configuration ................................................. 15-15 FGS (General Code Segment Configuration Register).......................................................... 24-5 FLTACON Fault A Control..................................... 15-11 FLTBCON Fault B Control..................................... 15-12 FOSC (Oscillator Configuration Register)............................................7-7, 7-9, 7-11 FWDT (Watchdog Timer Configuration Register).......................................................... 24-3 ICxCON (Input Capture x Control)........................... 13-3 IEC0 (Interrupt Enable Control 0)............................ 6-24 IEC1 (Interrupt Enable Control 1)............................ 6-26 IEC2 (Interrupt Enable Control 2)................... 6-28, 6-29 IFS0 (Interrupt Flag Status 0).................................. 6-18 IFS1 (Interrupt Flag Status 1).................................. 6-20 IFS2 (Interrupt Flag Status 2)......................... 6-22, 6-23 INTCON1 (Interrupt Control 1) ................................ 6-16 INTCON2 (Interrupt Control 2) ................................ 6-17 IPC0 (Interrupt Priority Control 0)............................ 6-30 IPC1 (Interrupt Priority Control 1)............................ 6-31 IPC10 (Interrupt Priority Control 10) ........................ 6-40 IPC11 (Interrupt Priority Control 11) ........................ 6-41 IPC2 (Interrupt Priority Control 2)............................ 6-32 IPC3 (Interrupt Priority Control 3)............................ 6-33 IPC4 (Interrupt Priority Control 4)............................ 6-34 IPC5 (Interrupt Priority Control 5)............................ 6-35 IPC6 (Interrupt Priority Control 6)............................ 6-36 IPC7 (Interrupt Priority Control 7)............................ 6-37 IPC8 (Interrupt Priority Control 8)............................ 6-38 IPC9 (Interrupt Priority Control 9)............................ 6-39 I2CSTAT (I2C Status) Register..........21-9, 21-10, 21-11 MODCON (Modulo and Bit-Reversed Addressing Control)............................................................ 3-19 NVMADR (Non-Volatile Memory Address)................ 5-8 NVMADRU (Non-Volatile Memory Address) ............. 5-9 NVMCON (Non-Volatile Memory Control) ................. 5-7 NVMKEY (Non-Volatile Memory Key) ....................... 5-9 OCxCON (Output Compare x Control) .................... 14-3 OVDCON Override Control ................................... 15-13 PDC1 PWM Duty Cycle 1...................................... 15-13 PDC2 PWM Duty Cycle 2...................................... 15-14 PDC3 PWM Duty Cycle 3...................................... 15-14 PDC4 PWM Duty Cycle 4...................................... 15-15 PTCON PWM Time Base Control ........................... 15-5 PTMR PWM Time Base .......................................... 15-6 PTPER PWM Time Base Period ............................. 15-6 PWMCON1 PWM Control 1 .................................... 15-7 PWMCON2 PWM Control 2 .................................... 15-8 QEI Special Function............................................. 16-20 QEICON QEI Control...................................... 16-5, 16-6 RCON (Reset Control)........................................ 8-3, 9-4 RSCON.................................................................... 22-7 Index DS70046E-page 6 © 2006 Microchip Technology Inc. SEVTCMP Special Event Compare.........................15-7 SR (CPU Status)......................................................2-12 SR (Status in CPU) ..................................................6-15 TSCON ....................................................................22-7 TxCON (Timer Control for Type A Time Base) ........12-6 TxCON (Timer Control for Type B Time Base) ........12-7 TxCON (Timer Control for Type C Time Base)........12-8 UxBRG (UARTx Baud Rate)....................................19-7 UxMODE (UARTx Mode).........................................19-3 UxRXREG (UARTx Receive)...................................19-6 UxSTA (UARTx Status and Control)........................19-4 UxTXREG (UARTx Transmit - Write Only) ..............19-6 XBREV (X Write AGU Bit-Reversal Addressing Control) ............................................................3-22 XMODEND (X AGU Modulo Addressing End).........3-20 XMODSRT (X AGU Modulo Addressing Start) ........3-20 YMODEND (Y AGU Modulo Addressing End).........3-21 YMODSRT (Y AGU Modulo Addressing Start) ........3-21 10-bit A/D Converter Special Function...................17-56 12-bit A/D Converter Special Function...................18-34 6-Output PWM Module ..........................................15-41 8-Output PWM Module ..........................................15-40 Reset Design Tips ..............................................................8-17 Illegal Opcode ............................................................8-9 Trap Conflict...............................................................8-9 Uninitialized W Register.............................................8-9 Reset Sequence.................................................................6-2 Returning From Interrupt..................................................6-13 Round Logic.....................................................................2-25 Run-Time Self Programming (RTSP)...............................5-10 FLASH Operations...................................................5-10 Operation .................................................................5-10 S Saturation and Overflow Modes.......................................2-24 Selecting A/D Conversion Clock ....................................17-13 Selecting Analog Inputs for Sampling ............................17-14 Selecting Analog Inputs for Sampling (12-bit)................18-12 Selecting the A/D Conversion Clock (12-bit)..................18-12 Selecting the Voltage Reference Source .......................17-13 Selecting the Voltage Reference Source (12-bit)...........18-11 Setup for Continuous Output Pulse Generation.............14-15 Shadow Registers..............................................................2-6 DO Loop.....................................................................2-7 PUSH.S and POP.S...................................................2-7 Simple Capture Events ....................................................13-4 Sleep and Idle Modes Operation....................................17-55 Sleep and Idle Modes Operation (12-bit) .......................18-33 Sleep Mode ......................................................................10-2 and FSCM Delay......................................................10-3 Clock Selection on Wake-up from............................10-2 Delay on Wake-up from ...........................................10-3 Delay Times for Exit.................................................10-3 Wake-up from on Interrupt .......................................10-4 Wake-up from on Reset ...........................................10-4 Wake-up from on Watchdog Time-out .....................10-4 Wake-up from with Crystal Oscillator or PLL ...........10-3 Slow Oscillator Start-up....................................................10-3 Soft Traps...........................................................................6-6 Arithmetic Error (Level 11) .........................................6-7 Software Reset Instruction (SWR) .....................................8-7 Software Stack Examples ...................................................................2-9 Pointer........................................................................2-8 Pointer Overflow ......................................................2-10 Pointer Underflow ....................................................2-10 W14 Stack Frame Pointer........................................ 2-10 Special Conditions for Interrupt Latency.......................... 6-13 Special Features for Device Emulation.......................... 15-39 Special Function Register Reset States .......................... 8-16 Specifying How Conversion Results are Written Into Buffer ..................................................................... 17-30 Specifying How Conversion Results are Written into Buffer (12-bit)......................................................... 18-19 SSPOV .......................................................................... 21-19 T Table Instruction Operation ............................................... 5-2 TCP/IP Protocol Stack ................................................... 25-10 Third Party C Compilers .................................................. 25-6 Third Party Hardware/Software Tools and Application Libraries................................................................... 25-6 Time-base for Input Capture/Output Compare .............. 12-22 Timer as an External Interrupt Pin ................................. 12-22 Timer Interrupts ............................................................. 12-14 Timer Modes of Operation ............................................... 12-9 Synchronous Counter Using External Clock Input............................................................... 12-10 Timer Mode.............................................................. 12-9 Type A Timer Asynchronous Counter Mode Using External Clock Input ...................................... 12-11 32-bit Timer............................................................ 12-18 Timer Modules Associated Special Function Registers ................. 12-23 Timer Operation in Power Saving States....................... 12-21 Timer Operation Modes Gated Time Accumulation ..................................... 12-12 with Fast External Clock Source............................ 12-12 Timer Prescalers............................................................ 12-14 Timer Selection................................................................ 13-4 Timer Variants ................................................................. 12-3 Timers Design Tips............................................................ 12-24 Related Application Notes ..................................... 12-25 Revision History..................................................... 12-26 Timing Diagrams Brown-out Situations.................................................. 8-8 Clock Transition....................................................... 7-35 Clock/Instruction Cycle .............................................. 7-5 Data Space Access ..........................................2-35, 3-6 Dead Time ............................................................. 15-28 Device Reset Delay, Crystal + PLL Clock Source, PWRT Disabled ............................................... 8-13 Device Reset Delay, Crystal + PLL Clock Source, PWRT Enabled................................................ 8-14 Device Reset Delay, EC + PLL Clock, PWRT Enabled ........................................................... 8-15 Device Reset Delay, EC or RC Clock, PWRT Disabled........................................................... 8-16 Dual Compare Mode.............................................. 14-10 Dual Compare Mode (Continuous Output Pulse, PR2 = OCxRS) ................................... 14-14, 14-15 Dual Compare Mode (Single Output Pulse, OCxRS > PR2) .............................................. 14-10 Edge Detection Mode .............................................. 13-8 Gated Timer Mode Operation................................ 12-13 Interrupt Timing During a Two-Cycle Instruction ..... 6-12 Interrupt Timing for Timer Period Match................ 12-14 Interrupt Timing, Interrupt Occurs During 1st Cycle of a Two-Cycle Instruction ............................... 6-12 POR Module for Rising VDD ...................................... 8-6 Postscaler Update ................................................... 7-34 PWM Output ............................................... 14-18, 14-21 © 2006 Microchip Technology Inc. DS70046E-page 7 dsPIC30F Family Reference Manual Index Reception with Address Detect (ADDEN = 1)........19-19 Return From Interrupt ..............................................6-13 Simple Capture Event, Time-base Prescaler = 1:1.................................................13-5 Simple Capture Event, Time-base Prescaler = 1:4.................................................13-5 Single Compare Mode (Force OCx Low on Compare Match Event)....................................................14-6 Single Compare Mode (Set OCx High on Compare Match Event)....................................................14-5 Single Compare Mode (Toggle Output on Compare Match Event, PR2 = OCxR).............................14-7 Single Compare Mode (Toggle Output on Compare Match Event, PR2 > OCxR).............................14-7 SPI Mode Timing (No SS Control) ..............20-12, 20-13 Transmission (Back to Back) .................................19-13 Transmission (8-bit or 9-bit Data) ..........................19-13 UART Reception ....................................................19-17 UART Reception with Receive Overrun.................19-17 TRIS (Data Direction) Registers ......................................11-3 Tuning the Oscillator Circuit.............................................7-23 Type A Timer ...................................................................12-3 Type B Timer ...................................................................12-4 Type C Timer ...................................................................12-5 U UART ADDEN Control Bit.................................................19-18 Alternate I/O Pins...................................................19-10 Associated Registers .............................................19-22 Baud Rate Generator...............................................19-8 Configuration..........................................................19-10 Control Registers .....................................................19-3 Design Tips............................................................19-23 Disabling ................................................................19-10 Enabling .................................................................19-10 Other Features.......................................................19-21 Auto Baud Support ........................................19-21 Loopback Mode .............................................19-21 Operation During CPU Sleep and Idle Modes ..............................................19-21 Receiver.................................................................19-14 Buffer (UxRXB) ..............................................19-14 Error Handling................................................19-14 Interrupt .........................................................19-15 Setup for Reception .......................................19-17 Related Application Notes......................................19-24 Setup for 9-bit Transmit .........................................19-18 Transmitter.............................................................19-11 Buffer (UxTXB) ..............................................19-12 Interrupt .........................................................19-12 Setup .............................................................19-13 Transmission of Break Characters ................19-14 Using for 9-bit Communication...............................19-18 UART Autobaud Support .................................................13-9 Uninitialized W Register Reset ..........................................2-7 USART Initialization ............................................................19-20 Introduction ..............................................................19-2 Receiving Break Characters ..................................19-19 Revision History.....................................................19-25 Setup for 9-bit Reception Using Address Detect Mode..............................................................19-19 Using QEI as Alternate 16-bit Timer/Counter ................16-16 Using Table Read Instructions...........................................5-3 Byte Mode..................................................................5-3 Word Mode ................................................................5-3 Using Table Write Instructions........................................... 5-4 Byte Mode ................................................................. 5-5 Holding Latches......................................................... 5-4 Word Mode ................................................................ 5-4 Using the RCON Status Bits............................................ 8-10 V V.22/V.22bis and V.32 Specification.............................. 25-11 W Wake-up from Sleep and Idle .......................................... 6-10 Watchdog Time-out Reset (WDTR)................................... 8-7 Watchdog Timer .............................................................. 10-6 Enabling and Disabling............................................ 10-6 Operation................................................................. 10-7 Operation in Sleep and Idle Modes ......................... 10-8 Period Selection ...................................................... 10-7 Prescalers................................................................ 10-7 Resetting ................................................................. 10-8 Software Controlled ................................................. 10-6 WCOL......................................................21-18, 21-19, 21-21 WDT and Power Saving Modes Design Tips............................................................ 10-10 Related Application Notes ..................................... 10-11 Revision History..................................................... 10-12 Working Register Array...................................................... 2-6 W Register Memory Mapping .................................... 2-6 W Registers and Byte Mode Instructions .................. 2-6 W0 and File Register Instructions.............................. 2-6 Writing to Device Configuration Registers....................... 5-14 Write Algorithm ........................................................ 5-14 Z 10-bit Address Mode...................................................... 21-35 12-Bit A/D ADCHS........................................................... 17-4, 18-4 ADPCFG......................................................... 17-4, 18-4 12-bit A/D Operation During CPU Idle Mode............... 17-55, 18-33 Operation During CPU Sleep Mode ........... 17-55, 18-33 16-bit Up/Down Position Counter .................................. 16-12 32-bit Timer Configuration ............................................. 12-16 DS70046E © 2006 Microchip Technology Inc. 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Preliminary DS41652A-page 1 PIC16F527 Processor Features: • Interrupt Capability • PIC16F527 Operating Speed: - DC – 20 MHz Crystal oscillator - DC – 200 ns Instruction cycle • Flash Program Memory: - 1024 x 12 user execution memory - 64 x 8 self-writable data memory - 10K minimum erase/write cycles • General Purpose Registers (SRAM): - 68 x 8 for PIC16F527 • Only 36 Single-Word Instructions to Learn: - Added RETURN and RETFIE instructions - Added MOVLB instruction • All Instructions are Single-Cycle except for Program Branches which are Two-Cycle • Four-Level Deep Hardware Stack • Direct, Indirect and Relative Addressing modes for Data and Instructions Peripheral Features: • Device Features: - 1 Input-only pin - 17 I/Os - Individual direction control - High-current source/sink • 8-Bit Real-Time Clock/Counter (TMR0) with 8-Bit Programmable Prescaler • In-Circuit Serial Programming™ (ICSP™) via Two External Pin Connections • Analog Comparator (CMP): - Two analog comparators - Absolute and programmable references • Analog-to-Digital Converter (ADC): - 8-bit resolution - 8 external input channels - 1 internal channel to convert comparator - 0.6V reference input • Operational Amplifiers (op amps): - 2 operational amplifiers - Fully-accessible visibility Microcontroller Features: • Brown-out Reset (BOR) • Power-on Reset (POR) • Device Reset Timer (DRT) • Watchdog Timer (WDT) with a Dedicated RC Oscillator • Programmable Code Protection (CP) • Power-Saving Sleep mode with Wake-up on Change Feature • Selectable Oscillator Options: - INTOSC: Precision 4 or 8 MHz internal oscillator - EXTRC: Low-cost external RC oscillator - LP: Power-saving, low-frequency crystal - XT: Standard crystal/resonator - HS: High-speed crystal/resonator - EC: High-speed external clock • Variety of Packaging Options: - 20-Lead PDIP, SOIC, SSOP, QFN CMOS Technology: • Low-Power, High-Speed CMOS Flash Technology • Fully-Static Design • Wide Operating Voltage and Temperature Range: - Industrial: 2.0V to 5.5V - Extended: 2.0V to 5.5V • Operating Current: - 170 uA @ 2V, 4 MHz, typical – 15 uA @ 2V, 32 kHz, typical • Standby Current: - 100 nA @ 2V, typical 20-Pin, 8-Bit Flash Microcontroller PIC16F527 DS41652A-page 2 Preliminary  2012 Microchip Technology Inc. FIGURE 1: 20-PIN PDIP, SOIC, SSOP DIAGRAM FOR PIC16F527 FIGURE 2: 20-PIN QFN DIAGRAM FOR PIC16F527 Device Program Memory Data Memory I/O Comparators Timers 8-bit 8-bit A/D Channels Op Amps Flash (words) SRAM (bytes) Flash (bytes) PIC16F527 1024 68 64 18 2 1 8 2 20-pin PDIP, SSOP, SOIC VDD RA5 RA4 RA3/MCLR/VPP RC5 RC4 RC3 RC6 RC7 RB7 VSS RA0/ICSPDAT RA1/ICSPCLK RA2 RC0 RC1 RC2 RB4 RB5 RB6 PIC16F527 1 2 3 4 5 6 7 14 15 16 17 18 19 20 8 9 10 11 12 13 20-pin QFN RA3/MCLR/VPP RC5 RC4 RC3 RC6 RA4 RA5 VDD VSS RA0/ICSPDAT PIC16F527 1 2 3 4 5 6 7 14 15 20 19 18 17 16 8 9 1011 12 13 RA1/ICSPCLK RA2 RC0 RC1 RC2 RC7 RB7 RB6 RB5 RB4  2012 Microchip Technology Inc. Preliminary DS41652A-page 3 PIC16F527 TABLE 1: 20-PIN ALLOCATION TABLE I/O 20-PIn PDIP/SOIC/SSOP 20-Pin QFN Analog Oscillator Comparator Reference Timers Op Amp Clock Reference ICSP™ Basic Pull-up Interrupt-on-Change RA0 19 16 AN0 — C1IN+ — — — — ICSPDAT — YY RA1 18 15 AN1 — C1IN- CVREF — — — ICSPCLK — Y Y RA2 17 14 AN2 — C1OUT — T0CKI — — — — — — RA3 4 1 — — — — — — — — MCLR VPP Y Y RA4 3 20 AN3 OSC2 — — — — CLKOUT — — Y Y RA5 2 19 — OSC1 — — — — CLKIN — — — — RB4 13 10 — — — — — OP2- — — — — — RB5 12 9 — — — — — OP2+ — — — — — RB6 11 8 — — — — — — — — — — — RB7 10 7 — — — — — — — — — — — RC0 16 13 AN4 — C2IN+ — — — — — — — — RC1 15 12 AN5 — C2IN- — — — — — — — — RC2 14 11 AN6 — — — — OP2 — — — — — RC3 7 4 AN7 — — — — OP1 — — — — — RC4 6 3 — — C2OUT — — — — — — — — RC5 5 2 — — — — — — — — — — — RC6 8 5 — — — — — OP1- — — — — — RC7 9 6 — — — — — OP1+ — — — — — VDD 1 18 — — — — — — — — — — — VSS 20 17 — — — — — — — — — — — PIC16F527 DS41652A-page 4 Preliminary  2012 Microchip Technology Inc. Table of Contents 1.0 General Description..................................................................................................................................................................... 5 2.0 PIC16F527 Device Varieties .................................................................................... .................................................................. 7 3.0 Architectural Overview ................................................................................................................................................................ 9 4.0 Memory Organization ................................................................................................................................................................ 15 5.0 Flash Data Memory Control ...................................................................................................................................................... 25 6.0 I/O Port ...................................................................................................................................................................................... 29 7.0 Timer0 Module and TMR0 Register .......................................................................................................................................... 35 8.0 Special Features of the CPU..................................................................................................................................................... 41 9.0 Analog-to-Digital (A/D) Converter.............................................................................................................................................. 59 10.0 Comparator(s) ........................................................................................................................................................................... 63 11.0 Comparator Voltage Reference Module.................................................................................................................................... 69 12.0 Operational Amplifier (OPA) Module ......................................................................................................................................... 71 13.0 Instruction Set Summary ........................................................................................................................................................... 73 14.0 Development Support................................................................................................................................................................ 81 15.0 Electrical Characteristics ........................................................................................................................................................... 85 16.0 DC and AC Characteristics Graphs and Charts ........................................................................................................................ 99 17.0 Packaging Information............................................................................................................................................................. 101 Index .................................................................................................................................................................................................. 113 The Microchip Web Site .................................................................................................................................................................... 115 Customer Change Notification Service ............................................................................................................................................. 115 Customer Support............................................................................................................................................................................. 115 Reader Response ............................................................................................................................................................................. 116 Product Identification System............................................................................................................................................................ 117 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.  2012 Microchip Technology Inc. Preliminary DS41652A-page 5 PIC16F527 1.0 GENERAL DESCRIPTION The PIC16F527 device from Microchip Technology is a low-cost, high-performance, 8-bit, fully-static, Flashbased CMOS microcontroller. It employs a RISC architecture with only 36 single-word/single-cycle instructions. All instructions are single cycle except for program branches, which take two cycles. The PIC16F527 device delivers performance an order of magnitude higher than its competitors in the same price category. The 12-bit wide instructions are highly symmetrical, resulting in a typical 2:1 code compression over other 8-bit microcontrollers in its class. The easy-to-use and easy to remember instruction set reduces development time significantly. The PIC16F527 product is equipped with special features that reduce system cost and power requirements. The Power-on Reset (POR) and Device Reset Timer (DRT) eliminate the need for external Reset circuitry. There are several oscillator configurations to choose from, including INTRC Internal Oscillator mode and the power-saving LP (Low-Power) Oscillator mode. Power-Saving Sleep mode, Watchdog Timer and code protection features improve system cost, power and reliability. The PIC16F527 device is available in the cost-effective Flash programmable version, which is suitable for production in any volume. The customer can take full advantage of Microchip’s price leadership in Flash programmable microcontrollers, while benefiting from the Flash programmable flexibility. The PIC16F527 product is supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a ‘C’ compiler, a low-cost development programmer and a full-featured programmer. All the tools are supported on IBM® PC and compatible machines. 1.1 Applications The PIC16F527 device fits in applications ranging from personal care appliances and security systems to lowpower remote transmitters/receivers. The Flash technology makes customizing application programs (transmitter codes, appliance settings, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make these microcontrollers perfect for applications with space limitations. Low cost, low power, high performance, ease of use and I/O flexibility make the PIC16F527 device very versatile, even in areas where no microcontroller use has been considered before (e.g., timer functions, logic and PLDs in larger systems and coprocessor applications). TABLE 1-1: FEATURES AND MEMORY OF PIC16F527 PIC16F527 Clock Maximum Frequency of Operation (MHz) 20 Memory Flash Program Memory 1024 SRAM Data Memory (bytes) 68 Flash Data Memory (bytes) 64 Peripherals Timer Module(s) TMR0 Wake-up from Sleep on Pin Change Yes Features I/O Pins 17 Input Pins 1 Internal Pull-ups Yes In-Circuit Serial ProgrammingTM Yes Number of Instructions 36 Packages 20-pin PDIP, SOIC, SSOP, QFN The PIC16F527 device has Power-on Reset, selectable Watchdog Timer, selectable code-protect, high I/O current capability and precision internal oscillator. The PIC16F527 device uses serial programming with the ICSPDAT data pin and the ICSPCLK clock pin. PIC16F527 DS41652A-page 6 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 7 PIC16F527 2.0 PIC16F527 DEVICE VARIETIES A variety of packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC16F527 Product Identification System at the back of this data sheet to specify the correct part number. 2.1 Quick Turn Programming (QTP) Devices Microchip offers a QTP programming service for factory production orders. This service is made available for users who choose not to program medium-to-high quantity units and whose code patterns have stabilized. The devices are identical to the Flash devices but with all Flash locations and fuse options already programmed by the factory. Certain code and prototype verification procedures do apply before production shipments are available. Please contact your local Microchip Technology sales office for more details. 2.2 Serialized Quick Turn ProgrammingSM (SQTPSM) Devices Microchip offers a unique programming service, where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. Serial programming allows each device to have a unique number, which can serve as an entry code, password or ID number. PIC16F527 DS41652A-page 8 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 9 PIC16F527 3.0 ARCHITECTURAL OVERVIEW The high performance of the PIC16F527 device can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC16F527 device uses a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architectures where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12 bits wide, making it possible to have all single-word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions execute in a single cycle (200 ns @ 20 MHz, 1 s @ 4 MHz) except for program branches. Table 3-1 below lists memory supported by the PIC16F527 device. TABLE 3-1: PIC16F527 MEMORY The PIC16F527 device can directly or indirectly address its register files and data memory. All Special Function Registers (SFR), including the PC, are mapped in the data memory. The PIC16F527 device has a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation, on any register, using any Addressing mode. This symmetrical nature and lack of “special optimal situations” make programming with the PIC16F527 device simple, yet efficient. In addition, the learning curve is reduced significantly. The PIC16F527 device contains an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is eight bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two’s complement in nature. In two-operand instructions, one operand is typically the W (working) register. The other operand is either a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC) and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. A simplified block diagram is shown in Figure 3-2, with the corresponding device pins described in Table 3-2. Device Program Memory Data Memory Flash (words) SRAM (bytes) Flash (bytes) PIC16F527 1024 68 64 PIC16F527 DS41652A-page 10 Preliminary  2012 Microchip Technology Inc. FIGURE 3-1: PIC16F527 BLOCK DIAGRAM Flash Program Memory 11 Data Bus 8 12 Program Bus Instruction reg Program Counter RAM File Registers Direct Addr 0-4 RAM Addr 9 Addr MUX Indirect Addr FSR reg STATUS reg MUX ALU W reg Device Reset Power-on Reset Watchdog Timer Instruction Decode & Control Timing Generation OSC1/CLKIN OSC2/CLKOUT MCLR VDD, VSS Timer0 PORTA 8 8 RA4/OSC2/CLKOUT RA3/MCLR/VPP RA2 RA1/ICSPCLK RA0/ICSPDAT 0-7 3 RA5/OSC1/CLKIN STACK1 STACK2 68 Internal RC Clock 1K x 12 bytes Timer PORTC RC4 RC3 RC2 RC1 RC0 RC5 Comparator 2 C1IN+ C1INC1OUT C2IN+ C2INC2OUT AN5 AN6 AN7 VREF 8-bit ADC CVREF CVREF CVREF Self-write 64x8 VREF Comparator 1 STACK3 STACK4 Brown-out Reset PORTB RB7 RB6 RB5 RB4 RC7 RC6 T0CKI OPAMP1 & OPAMP2 OP2- OP2 OP1+ OP1- OP1 OP2+ AN0 AN1 AN2 AN3 AN4 Direct Addr BSR 3 5-7  2012 Microchip Technology Inc. Preliminary DS41652A-page 11 PIC16F527 TABLE 3-2: PIC16F527 PINOUT DESCRIPTION Name Function Input Type Output Type Description RA0/AN0/C1IN+/ICSPDAT RA0 TTL CMOS Bidirectional I/O pin. It can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. ICSPDAT ST CMOS ICSP™ mode Schmitt Trigger. C1IN+ AN — Comparator 1 input. AN0 AN — ADC channel input. RA1/AN1/C1IN-/CVREF/ ICSPCLK RA1 TTL CMOS Bidirectional I/O pin. It can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. ICSPCLK ST — ICSP™ mode Schmitt Trigger. C1IN- AN — Comparator 1 input. CVREF — AN Programmable Voltage Reference output. AN1 AN — ADC channel input. RA2/AN2/C1OUT/T0CKI RA2 TTL CMOS Bidirectional I/O port. C1OUT — CMOS Comparator 1 output. AN2 AN — ADC channel input. T0CKI ST — Timer0 Schmitt Trigger input pin. RA3/MCLR/VPP RA3 TTL — Standard TTL input with weak pull-up. MCLR ST — Master Clear (Reset). When configured as MCLR, this pin is an active-low Reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation or the device will enter Programming mode. Weak pull-up is always on if configured as MCLR. VPP HV — Test mode high-voltage pin. RA4/AN3/OSC2/CLKOUT RA4 TTL CMOS Bidirectional I/O pin. It can be software programmed for internal weak pull-up and wake-up from Sleep on pin change. OSC2 — XTAL Oscillator crystal output. Connections to crystal or resonator in Crystal Oscillator mode (XT, HS and LP modes only, PORTB in other modes). CLKOUT — CMOS EXTRC/INTRC CLKOUT pin (FOSC/4). AN3 AN — ADC channel input. RA5/OSC1/CLKIN RA5 TTL CMOS Bidirectional I/O port. OSC1 XTAL — XTAL oscillator input pin. CLKIN ST — EXTRC Schmitt Trigger input. RB4/OP2- RB4 TTL CMOS Bidirectional I/O port. OP2- AN — Op amp 2 inverting input. RB5/OP2+ RB5 TTL CMOS Bidirectional I/O port. OP2+ AN — Op amp 2 non-inverting input. RB6 RB6 TTL CMOS Bidirectional I/O port. RB7 RB7 TTL CMOS Bidirectional I/O port. RC0/AN4/C2IN+ RC0 ST CMOS Bidirectional I/O port. AN4 AN — ADC channel input. C2IN+ AN — Comparator 2 input. Legend: I = Input, O = Output, I/O = Input/Output, P = Power, — = Not Used, TTL = TTL input, ST = Schmitt Trigger input, HV = High Voltage, AN = Analog Voltage PIC16F527 DS41652A-page 12 Preliminary  2012 Microchip Technology Inc. RC1/AN5/C2IN- RC1 ST CMOS Bidirectional I/O port. AN5 AN — ADC channel input. C2IN- AN — Comparator 2 input. RC2/AN6/OP2 RC2 ST CMOS Bidirectional I/O port. AN6 AN — ADC channel input. OP2 — AN Op amp 2 output. RC3/AN7/OP1 RC3 ST CMOS Bidirectional I/O port. AN7 AN — ADC channel input. OP1 — AN Op amp 1 output. RC4/C2OUT RC4 ST CMOS Bidirectional I/O port. C2OUT — CMOS Comparator 2 output. RC5 RC5 ST CMOS Bidirectional I/O port. RC6/OP1- RC6 ST CMOS Bidirectional I/O port. OP1- AN — Op amp 1 inverting input. RC7/OP1+ RC7 ST CMOS Bidirectional I/O port. OP1+ AN — Op amp 1 non-inverting input. VDD VDD — P Positive supply for logic and I/O pins. VSS VSS — P Ground reference for logic and I/O pins. TABLE 3-2: PIC16F527 PINOUT DESCRIPTION Name Function Input Type Output Type Description Legend: I = Input, O = Output, I/O = Input/Output, P = Power, — = Not Used, TTL = TTL input, ST = Schmitt Trigger input, HV = High Voltage, AN = Analog Voltage  2012 Microchip Technology Inc. Preliminary DS41652A-page 13 PIC16F527 3.1 Clocking Scheme/Instruction Cycle The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks, namely Q1, Q2, Q3 and Q4. Internally, the PC is incremented every Q1 and the instruction is fetched from program memory and latched into the instruction register in Q4. It is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2 and Example 3-1. 3.2 Instruction Flow/Pipelining An instruction cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle, while decode and execute take another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the PC to change (e.g., GOTO or an interrupt), then two cycles are required to complete the instruction (Example 3-1). A fetch cycle begins with the PC incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 3-2: CLOCK/INSTRUCTION CYCLE EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Q3 Q4 PC PC PC + 1 PC + 2 Fetch INST (PC) Execute INST (PC – 1) Fetch INST (PC + 1) Execute INST (PC) Fetch INST (PC + 2) Execute INST (PC + 1) Internal Phase Clock All instructions are single cycle, except for any program branches. These take two cycles, since the fetch instruction is “flushed” from the pipeline, while the new instruction is being fetched and then executed. 1. MOVLW 03H Fetch 1 Execute 1 2. MOVWF PORTB Fetch 2 Execute 2 3. CALL SUB_1 Fetch 3 Execute 3 4. BSF PORTB, BIT1 Fetch 4 Flush Fetch SUB_1 Execute SUB_1 PIC16F527 DS41652A-page 14 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 15 PIC16F527 4.0 MEMORY ORGANIZATION The PIC16F527 memories are organized into program memory and data memory (SRAM).The self-writable portion of the program memory called self-writable Flash data memory is located at addresses 400h-43Fh. All program mode commands that work on the normal Flash memory, work on the Flash data memory. This includes bulk erase, row/column/cycling toggles, Load and Read data commands (Refer to Section 5.0 “Flash Data Memory Control” for more details). For devices with more than 512 bytes of program memory, a paging scheme is used. Program memory pages are accessed using one STATUS register bit. For the PIC16F527, with data memory register files of more than 32 registers, a banking scheme is used. Data memory banks are accessed using the File Select Register (FSR). 4.1 Program Memory Organization for PIC16F527 The PIC16F527 device has an 11-bit Program Counter (PC) capable of addressing a 2K x 12 program memory space. Program memory is partitioned into user memory, data memory and configuration memory spaces. The user memory space is the on-chip user program memory. As shown in Figure 4-1, it extends from 0x000 to 0x3FF and partitions into pages, including an Interrupt vector at address 0x004 and a Reset vector at address 0x3FF. The data memory space is the self-writable Flash data memory block and is located at addresses PC = 400h- 43Fh. All program mode commands that work on the normal Flash memory, work on the Flash data memory block. This includes bulk erase, Load and Read data commands. The configuration memory space extends from 0x440 to 0x7FF. Locations from 0x448 through 0x49F are reserved. The user ID locations extend from 0x440 through 0x443. The Backup OSCCAL locations extend from 0x444 through 0x447. The Configuration Word is physically located at 0x7FF. Refer to “PIC16F527 Memory Programming Specification” (DS41640) for more details. FIGURE 4-1: MEMORY MAP 005h 1FFh Reset Vector On-chip User Program Memory (Page 0) 200h 3FFh 3FEh User ID Locations Reserved Configuration Word 400h 443h 444h 7FEh 7FFh 43Fh 440h Unimplemented On-chip User Program Memory (Page 1) Data Memory Self-writable 448h 49Fh Backup OSCCAL Locations 447h 4A0h Configuration Memory Space Space User Memory Space Flash Data Memory Interrupt Vector 000h 004h PIC16F527 DS41652A-page 16 Preliminary  2012 Microchip Technology Inc. 4.2 Data Memory (SRAM and FSRs) Data memory is composed of registers or bytes of SRAM. Therefore, data memory for a device is specified by its register file. The register file is divided into two functional groups: Special Function Registers (SFR) and General Purpose Registers (GPR). The Special Function Registers are registers used by the CPU and peripheral functions for controlling desired operations of the PIC16F527. See Section 4.3 “STATUS Register” for details. The PIC16F527 register file is composed of 16 Special Function Registers and 67 General Purpose Registers. 4.2.1 GENERAL PURPOSE REGISTER FILE The General Purpose Register file is accessed directly or indirectly. See Section 4.8 “Direct and Indirect Addressing”. 4.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral functions to control the operation of the device (Section 4.3 “STATUS Register”). The Special Function Registers can be classified into two sets. The Special Function Registers associated with the “core” functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature. FIGURE 4-2: PIC16F527 REGISTER FILE MAP File Address 00h 01h 02h 03h 04h 05h 06h 07h 1Fh INDF(1) TMR0 PCL STATUS FSR OSCCAL PORTA 10h Bank 0 Bank 1 Bank 2 Bank 3 3Fh 30h 20h 5Fh 50h 40h 7Fh 70h 60h General Purpose Registers General Purpose Registers General Purpose Registers General Purpose Registers General Purpose Registers PORTB 08h Note 1: Not a physical register. See Section 4.8 “Direct and Indirect Addressing”. BSR<1:0> 00 01 10 11 2Fh 4Fh 6Fh PORTC INTCON0 09h 0Ah 0Bh ADRES ADCON0 0Ch 0Fh INDF(1) EECON PCL STATUS FSR EEDATA EEADR CM2CON0 INTCON0 ANSEL VRCON INDF(1) TMR0 PCL STATUS FSR OSCCAL PORTA PORTB ADRES ADCON0 INDF(1) IW PCL STATUS FSR INTCON1 ISTATUS ANSEL OPACON PORTC IBSR INTCON0 INTCON0 CM1CON0 IFSR Addresses map back to addresses in Bank 0. 2Ch 4Ch 6Ch  2012 Microchip Technology Inc. Preliminary DS41652A-page 17 PIC16F527 TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR/BOR Value on all other Resets Bank 0 N/A W(2) Working Register (W) xxxx xxxx xxxx xxxx N/A TRIS I/O Control Registers (TRISA, TRISB, TRISC) 1111 1111 1111 1111 N/A OPTION Contains control bits to configure Timer0 and Timer0/WDT prescaler 1111 1111 1111 1111 N/A BSR(2) — — — — — BSR2 BSR1 BSR0 ---- -000 ---- -0uu 00h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu 01h TMR0 Timer0 module Register xxxx xxxx uuuu uuuu 02h PCL(1) Low-order eight bits of PC 1111 1111 1111 1111 03h STATUS(2) Reserved Reserved PA0 TO PD Z DC C -001 1xxx -00q qqqq 04h FSR(2) — Indirect data memory address pointer 0xxx xxxx 0uuu uuuu 05h OSCCAL CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — 1111 111- uuuu uuu- 06h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --uu uuuu 07h PORTB RB7 RB6 RB5 RB4 — — — — xxxx ---- uuuu ---- 08h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu 09h ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 1111 1100 1111 1100 0Ah ADRES ADC Conversion Result xxxx xxxx uuuu uuuu 0Bh INTCON0 ADIF CWIF T0IF RAIF — — — GIE 0000 ---0 0000 ---0 Bank 1 N/A W(2) Working Register (W) xxxx xxxx xxxx xxxx N/A TRIS I/O Control Registers (TRISA, TRISB, TRISC) 1111 1111 1111 1111 N/A OPTION Contains control bits to configure Timer0 and Timer0/WDT prescaler 1111 1111 1111 1111 N/A BSR(2) — — — — — BSR2 BSR1 BSR0 ---- -000 ---- -0uu 20h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu 21h EECON — — — FREE WRERR WREN WR RD ---0 0000 ---0 0000 22h PCL(1) Low-order eight bits of PC 1111 1111 1111 1111 23h STATUS(2) Reserved Reserved PA0 TO PD Z DC C -001 1xxx -00q qqqq 24h FSR(2) — Indirect data memory address pointer 0xxx xxxx 0uuu uuuu 25h EEDATA Self Read/Write Data xxxx xxxx uuuu uuuu 26h EEADR — — Self Read/Write Address --xx xxxx --uu uuuu 27h CM1CON0 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU 1111 1111 quuu uuuu 28h CM2CON0 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU 1111 1111 quuu uuuu 29h VRCON VREN VROE VRR — VR3 VR2 VR1 VR0 001- 1111 uuu- uuuu 2Ah ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111 2Bh INTCON0 ADIF CWIF T0IF RAIF — — — GIE 0000 ---0 0000 ---0 Legend: x = unknown, u = unchanged, – = unimplemented, read as '0' (if applicable), q = value depends on condition. Shaded cells = unimplemented or unused Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.6 “Program Counter” for an explanation of how to access these bits. 2: Registers are implemented as two physical registers. When executing from within an ISR, a secondary register is used at the same logical location. Both registers are persistent. See Section 8.11 “Interrupts”. 3: These registers show the contents of the registers in the other context: ISR or main line code. See Section 8.11 “Interrupts”. PIC16F527 DS41652A-page 18 Preliminary  2012 Microchip Technology Inc. Bank 2 N/A W(2) Working Register (W) xxxx xxxx xxxx xxxx N/A TRIS I/O Control Registers (TRISA, TRISB, TRISC) 1111 1111 1111 1111 N/A OPTION Contains control bits to configure Timer0 and Timer0/WDT prescaler 1111 1111 1111 1111 N/A BSR(2) — — — — — BSR2 BSR1 BSR0 ---- -000 ---- -0uu 40h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu 41h TMR0 Timer0 module Register xxxx xxxx uuuu uuuu 42h PCL(1) Low-order eight bits of PC 1111 1111 1111 1111 43h STATUS(2) Reserved Reserved PA0 TO PD Z DC C -001 1xxx -00q qqqq 44h FSR(2) — Indirect data memory address pointer 0xxx xxxx 0uuu uuuu 45h OSCCAL CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — 1111 111- uuuu uuu- 46h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --uu uuuu 47h PORTB RB7 RB6 RB5 RB4 — — — — xxxx ---- uuuu ---- 48h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu 49h ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 1111 1100 1111 1100 4Ah ADRES ADC Conversion Result xxxx xxxx uuuu uuuu 4Bh INTCON0 ADIF CWIF T0IF RAIF — — — GIE 0000 ---0 0000 ---0 Bank 3 N/A W(2) Working Register (W) xxxx xxxx xxxx xxxx N/A TRIS I/O Control Registers (TRISA, TRISB, TRISC) 1111 1111 1111 1111 N/A OPTION Contains control bits to configure Timer0 and Timer0/WDT prescaler 1111 1111 1111 1111 N/A BSR(2) — — — — — BSR2 BSR1 BSR0 ---- -000 ---- -0uu 60h INDF Uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu 61h IW(3) Interrupt Working Register. (Addressed also as W register when within ISR) xxxx xxxx xxxx xxxx 62h PCL(1) Low-order eight bits of PC 1111 1111 1111 1111 63h STATUS(2) Reserved Reserved PA0 TO PD Z DC C -001 1xxx -00q qqqq 64h FSR(2) — Indirect data memory address pointer 0xxx xxxx 0uuu uuuu 65h INTCON1 ADIE CWIE T0IE RAIE — — — WUR 0000 ---0 0000 ---0 66h ISTATUS(3) Reserved Reserved PA0 TO PD Z DC C -xxx xxxx -00q qqqq 67h IFSR(3) — Indirect data memory address pointer 0xxx xxxx 0uuu uuuu 68h IBSR(3) — — — — — BSR2 BSR1 BSR0 ---- -0xx ---- -0uu 69h OPACON — — — — — — OPA2ON OPA1ON ---- --00 ---- --00 6Bh INTCON0 ADIF CWIF T0IF RAIF — — — GIE 0000 ---0 0000 ---0 TABLE 4-1: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR/BOR Value on all other Resets Legend: x = unknown, u = unchanged, – = unimplemented, read as '0' (if applicable), q = value depends on condition. Shaded cells = unimplemented or unused Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.6 “Program Counter” for an explanation of how to access these bits. 2: Registers are implemented as two physical registers. When executing from within an ISR, a secondary register is used at the same logical location. Both registers are persistent. See Section 8.11 “Interrupts”. 3: These registers show the contents of the registers in the other context: ISR or main line code. See Section 8.11 “Interrupts”.  2012 Microchip Technology Inc. Preliminary DS41652A-page 19 PIC16F527 4.3 STATUS Register This register contains the arithmetic status of the ALU, the Reset status and the page preselect bit. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS, will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). Therefore, it is recommended that only BCF, BSF and MOVWF instructions be used to alter the STATUS register. These instructions do not affect the Z, DC or C bits from the STATUS register. For other instructions which do affect Status bits, see Section 13.0 “Instruction Set Summary”. REGISTER 4-1: STATUS: STATUS REGISTER R-0 R-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x Reserved Reserved PA0 TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Reserved: Read as ‘0’ bit 5 PA0: Program Page Preselect bit 1 = Page 1 (000h-1FFh) 0 = Page 0 (200h-3FFh) bit 4 TO: Time-Out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF: 1 = A carry from the 4th low-order bit of the result occurred 0 = A carry from the 4th low-order bit of the result did not occur SUBWF: 1 = A borrow from the 4th low-order bit of the result did not occur 0 = A borrow from the 4th low-order bit of the result occurred bit 0 C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF: SUBWF: RRF or RLF: 1 = A carry occurred 1 = A borrow did not occur; Load bit with LSb or MSb, respectively 0 = A carry did not occur 0 = A borrow occurred PIC16F527 DS41652A-page 20 Preliminary  2012 Microchip Technology Inc. 4.4 OPTION Register The OPTION register is a 8-bit wide, write-only register, which contains various control bits to configure the Timer0/WDT prescaler and Timer0. By executing the OPTION instruction, the contents of the W register will be transferred to the OPTION register. A Reset sets the OPTION <7:0> bits. Note: If TRIS bit is set to ‘0’, the wake-up on change and pull-up functions are disabled for that pin (i.e., note that TRIS overrides Option control of RAPU and RAWU). REGISTER 4-2: OPTION: OPTION REGISTER W-1 W-1 W-1 W-1 W-1 W-1 W-1 W-1 RAWU(2) RAPU T0CS(1) T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RAWU: Enable PORTA Interrupt Flag on Pin Change bit(2) 1 = Disabled 0 = Enabled bit 6 RAPU: Enable PORTA Weak Pull-Ups bit 1 = Disabled 0 = Enabled bit 5 T0CS: Timer0 Clock Source Select bit(1) 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 bit 2-0 PS<2:0>: Prescaler Rate Select bits Note 1: If the T0CS bit is set to ‘1’, it will override the TRIS function on the T0CKI pin. 2: The RAWU bit of the OPTION register must be set to enable the RAIF function in the INTCON0 register. 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 Bit Value Timer0 Rate WDT Rate  2012 Microchip Technology Inc. Preliminary DS41652A-page 21 PIC16F527 4.5 OSCCAL Register The Oscillator Calibration (OSCCAL) register is used to calibrate the 8 MHz internal oscillator macro. It contains seven bits of calibration that uses a two’s complement scheme for controlling the oscillator speed. See Register 4-3 for details. REGISTER 4-3: OSCCAL: OSCILLATOR CALIBRATION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 U-0 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-1 CAL<6:0>: Oscillator Calibration bits 0111111 = Maximum frequency • • • 0000001 0000000 = Center frequency 1111111 • • • 1000000 = Minimum frequency bit 0 Unimplemented: Read as ‘0’ PIC16F527 DS41652A-page 22 Preliminary  2012 Microchip Technology Inc. 4.6 Program Counter As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. For a GOTO instruction, bits <8:0> of the PC are provided by the GOTO instruction word. The Program Counter (PCL) is mapped to PC<7:0>. Bit 5 of the STATUS register provides page information to bit 9 of the PC (Figure 4-3). For a CALL instruction, or any instruction where the PCL is the destination, bits <7:0> of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-3). Instructions where the PCL is the destination, or modify PCL instructions, include MOVWF PCL, ADDWF PCL and BSF PCL,5. FIGURE 4-3: LOADING OF PC BRANCH INSTRUCTIONS 4.6.1 EFFECTS OF RESET The PC is set upon a Reset, which means that the PC addresses the last location in the last page (i.e., the oscillator calibration instruction). After executing MOVLW XX, the PC will roll over to location 00h and begin executing user code. The STATUS register page preselect bits are cleared upon a Reset, which means that page 0 is pre-selected. Therefore, upon a Reset, a GOTO instruction will automatically cause the program to jump to page 0 until the value of the page bits is altered. 4.7 Stack The PIC16F527 device has a 4-deep, 12-bit wide hardware PUSH/POP stack. A CALL instruction or an interrupt will PUSH the current PC value, incremented by one, into Stack Level 1. If there was a previous value in the Stack 1 location, it will be pushed into the Stack 2 location. This process will be continued throughout the remaining stack locations populated with values. If more than four sequential CALLs are executed, only the most recent four return addresses are stored. A RETLW, RETURN or RETFIE instruction will POP the contents of Stack Level 1 into the PC. If there was a previous value in the Stack 2 location, it will be copied into the Stack Level 1 location. This process will be continued throughout the remaining stack locations populated with values. If more than four sequential RETLWs are executed, the stack will be filled with the address previously stored in Stack Level 4. Note that the W register will be loaded with the literal value specified in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory. Note: Because bit 8 of the PC is cleared in the CALL instruction or any modify PCL instruction, all subroutine calls or computed jumps are limited to the first 256 locations of any program memory page (512 words long). PA0 Status PC 8 7 0 PCL 10 9 Instruction Word 7 0 GOTO Instruction CALL or Modify PCL Instruction PA0 Status PC 8 7 0 PCL 10 9 Instruction Word 7 0 Reset to ‘0’ Note 1: There are no Status bits to indicate Stack Overflows or Stack Underflow conditions. 2: There are no instruction mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETFIE and RETLW instructions.  2012 Microchip Technology Inc. Preliminary DS41652A-page 23 PIC16F527 4.8 Direct and Indirect Addressing 4.8.1 DIRECT DATA ADDRESSING: BSR REGISTER Traditional data memory addressing is performed in the Direct Addressing mode. In Direct Addressing, the Bank Select Register bits BSR<1:0>, in the new BSR register, are used to select the data memory bank. The address location within that bank comes directly from the opcode being executed. BSR<1:0> are the bank select bits and are used to select the bank to be addressed (00 = Bank 0, 01 = Bank 1, 10 = Bank 2, 11 = Bank 3). A new instruction supports the addition of the BSR register, called the MOVLB instruction. See Section 13.0 “Instruction Set Summary” for more information. 4.8.2 INDIRECT DATA ADDRESSING: INDF AND FSR REGISTERS The INDF Register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR Register (FSR is a pointer). This is indirect addressing. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF Register indirectly results in a no-operation (although Status bits may be affected). The FSR is an 8-bit wide register. It is used in conjunction with the INDF Register to indirectly address the data memory area. The FSR<6:0> bits are used to select data memory addresses 00h to 1Fh. FSR<7> is unimplemented and read as ‘0’. A simple program to clear RAM locations 10h-1Fh using indirect addressing is shown in Example 4-1. EXAMPLE 4-1: HOW TO CLEAR RAM USING INDIRECT ADDRESSING MOVLW 0x10 ;initialize pointer MOVWF FSR ;to RAM NEXT CLRF INDF ;clear INDF ;register INCF FSR,F ;inc pointer BTFSC FSR,4 ;all done? GOTO NEXT ;NO, clear next CONTINUE : ;YES, continue : PIC16F527 DS41652A-page 24 Preliminary  2012 Microchip Technology Inc. FIGURE 4-4: DIRECT/INDIRECT ADDRESSING Note 1:For register map detail see Section 4.3 “STATUS Register”. bank select location select bank select location select Direct Addressing Indirect Addressing Data Memory(1) 0Bh 0Ch 6 5 4 0 (FSR) 00 01 11 10 00h 0Fh 2Fh 4Fh 6Fh (opcode) 1 0 4 0 (BSR) 3 2 1 3 2 1 10h Bank 0 Bank 1 Bank 2 Bank 3 1Fh 3Fh 5Fh 7Fh Addresses map back to addresses in Bank 0.  2012 Microchip Technology Inc. Preliminary DS41652A-page 25 PIC16F527 5.0 FLASH DATA MEMORY CONTROL The Flash data memory is readable and writable during normal operation (full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers (SFRs). 5.1 Reading Flash Data Memory To read a Flash data memory location the user must: • Write the EEADR register • Set the RD bit of the EECON register The value written to the EEADR register determines which Flash data memory location is read. Setting the RD bit of the EECON register initiates the read. Data from the Flash data memory read is available in the EEDATA register immediately. The EEDATA register will hold this value until another read is initiated or it is modified by a write operation. Program execution is suspended while the read cycle is in progress. Execution will continue with the instruction following the one that sets the WR bit. See Example 1 for sample code. EXAMPLE 1: READING FROM FLASH DATA MEMORY 5.2 Writing and Erasing Flash Data Memory Flash data memory is erased one row at a time and written one byte at a time. The 64-byte array is made up of eight rows. A row contains eight sequential bytes. Row boundaries exist every eight bytes. Generally, the procedure to write a byte of data to Flash data memory is: 1. Identify the row containing the address where the byte will be written. 2. If there is other information in that row that must be saved, copy those bytes from Flash data memory to RAM. 3. Perform a row erase of the row of interest. 4. Write the new byte of data and any saved bytes back to the appropriate addresses in Flash data memory. To prevent accidental corruption of the Flash data memory, an unlock sequence is required to initiate a write or erase cycle. This sequence requires that the bit set instructions used to configure the EECON register happen exactly as shown in Example 2 and Example 3, depending on the operation requested. 5.2.1 ERASING FLASH DATA MEMORY A row must be manually erased before writing new data. The following sequence must be performed for a single row erase. 1. Load EEADR with an address in the row to be erased. 2. Set the FREE bit to enable the erase. 3. Set the WREN bit to enable write access to the array. 4. Set the WR bit to initiate the erase cycle. If the WREN bit is not set in the instruction cycle after the FREE bit is set, the FREE bit will be cleared in hardware. If the WR bit is not set in the instruction cycle after the WREN bit is set, the WREN bit will be cleared in hardware. Sample code that follows this procedure is included in Example 2. Program execution is suspended while the erase cycle is in progress. Execution will continue with the instruction following the one that sets the WR bit. EXAMPLE 2: ERASING A FLASH DATA MEMORY ROW Note: Only a BSF command will work to enable the Flash data memory read documented in Example 1. No other sequence of commands will work, no exceptions. BANKSEL EEADR ; MOVF DATA_EE_ADDR, W ; MOVWF EEADR ;Data Memory ;Address to read BANKSEL EECON1 ; BSF EECON, RD ;EE Read MOVF EEDATA, W ;W = EEDATA Note 1: The FREE bit may be set by any command normally used by the core. However, the WREN and WR bits can only be set using a series of BSF commands, as documented in Example 1. No other sequence of commands will work, no exceptions. 2: Bits <5:3> of the EEADR register indicate which row is to be erased. BANKSEL EEADR MOVLW EE_ADR_ERASE ; LOAD ADDRESS OF ROW TO ; ERASE MOVWF EEADR ; BSF EECON,FREE ; SELECT ERASE BSF EECON,WREN ; ENABLE WRITES BSF EECON,WR ; INITITATE ERASE PIC16F527 DS41652A-page 26 Preliminary  2012 Microchip Technology Inc. 5.2.2 WRITING TO FLASH DATA MEMORY Once a cell is erased, new data can be written. Program execution is suspended during the write cycle. The following sequence must be performed for a single byte write. 1. Load EEADR with the address. 2. Load EEDATA with the data to write. 3. Set the WREN bit to enable write access to the array. 4. Set the WR bit to initiate the erase cycle. If the WR bit is not set in the instruction cycle after the WREN bit is set, the WREN bit will be cleared in hardware. Sample code that follows this procedure is included in Example 3. EXAMPLE 3: WRITING A FLASH DATA MEMORY ROW 5.3 Write Verify Depending on the application, good programming practice may dictate that data written to the Flash data memory be verified. Example 4 is an example of a write verify. EXAMPLE 4: WRITE VERIFY OF FLASH DATA MEMORY Note 1: Only a series of BSF commands will work to enable the memory write sequence documented in Example 2. No other sequence of commands will work, no exceptions. 2: For reads, erases and writes to the Flash data memory, there is no need to insert a NOP into the user code as is done on midrange devices. The instruction immediately following the “BSF EECON,WR/RD” will be fetched and executed properly. BANKSEL EEADR MOVLW EE_ADR_WRITE ; LOAD ADDRESS MOVWF EEADR ; MOVLW EE_DATA_TO_WRITE ; LOAD DATA MOVWF EEDATA ; INTO EEDATA REGISTER BSF EECON,WREN ; ENABLE WRITES BSF EECON,WR ; INITITATE ERASE MOVF EEDATA, W ;EEDATA has not changed ;from previous write BSF EECON, RD ;Read the value written XORWF EEDATA, W ; BTFSS STATUS, Z ;Is data the same GOTO WRITE_ERR ;No, handle error ;Yes, continue  2012 Microchip Technology Inc. Preliminary DS41652A-page 27 PIC16F527 5.4 Register Definitions — Memory Control REGISTER 5-1: EEDATA: FLASH DATA REGISTER REGISTER 5-2: EEADR: FLASH ADDRESS REGISTER R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x EEDATA7 EEDATA6 EEDATA5 EEDATA4 EEDATA3 EEDATA2 EEDATA1 EEDATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 EEDATA<7:0>: Eight bits of data to be read from/written to data Flash U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’. bit 5-0 EEADR<5:0>: Six bits of data to be read from/written to data Flash PIC16F527 DS41652A-page 28 Preliminary  2012 Microchip Technology Inc. REGISTER 5-3: EECON: FLASH CONTROL REGISTER 5.5 Code Protection Code protection does not prevent the CPU from performing read or write operations on the Flash data memory. Refer to the code protection chapter for more information. U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — FREE WRERR WREN WR RD bit 7 bit 0 Legend: S = Bit can only be set R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’. bit 4 FREE: Flash Data Memory Row Erase Enable Bit 1 = Program memory row being pointed to by EEADR will be erased on the next write cycle. No write will be performed. This bit is cleared at the completion of the erase operation. 0 = Perform write only bit 3 WRERR: Write Error Flag bit 1 = A write operation terminated prematurely (by device Reset) 0 = Write operation completed successfully bit 2 WREN: Write Enable bit 1 = Allows write cycle to Flash data memory 0 = Inhibits write cycle to Flash data memory bit 1 WR: Write Control bit 1 = Initiate a erase or write cycle 0 = Write/Erase cycle is complete bit 0 RD: Read Control bit 1 = Initiate a read of Flash data memory 0 = Do not read Flash data memory  2012 Microchip Technology Inc. Preliminary DS41652A-page 29 PIC16F527 6.0 I/O PORT As with any other register, the I/O register(s) can be written and read under program control. However, read instructions (e.g., MOVF PORTB,W) always read the I/O pins independent of the pin’s Input/Output modes. On Reset, all I/O ports are defined as input (inputs are at highimpedance) since the I/O control registers are all set. 6.1 PORTA PORTA is a 6-bit I/O register. Only the low-order six bits are used (RA<5:0>). Bits 7 and 6 are unimplemented and read as ‘0’s. Please note that RA3 is an input-only pin. The Configuration Word can set several I/Os to alternate functions. When acting as alternate functions, the pins will read as ‘0’ during a port read. Pins RA0, RA1, RA3 and RA4 can be configured with weak pull-ups and also for wake-up on change. The wake-up on change and weak pull-up functions are not pin selectable. If RA3/MCLR is configured as MCLR, weak pull-up is always on and wake-up on change for this pin is not enabled. 6.2 PORTB PORTB is a 4-bit I/O register. Only the high-order four bits are used (RB<7:4>). Bits 0 through 3 are unimplemented and read as ‘0’s. 6.3 PORTC PORTC is a 8-bit I/O register. 6.4 TRIS Register The Output Driver Control register is loaded with the contents of the W register by executing the TRIS instruction. A ‘1’ from a TRIS register bit puts the corresponding output driver in a High-Impedance mode. A ‘0’ puts the contents of the output data latch on the selected pins, enabling the output buffer. The exceptions are RA3, which is input-only and the T0CKI pin, which may be controlled by the OPTION register (see Register 4-2). TRIS registers are “write-only”. Active bits in these registers are set (output drivers disabled) upon Reset. PIC16F527 DS41652A-page 30 Preliminary  2012 Microchip Technology Inc. 6.5 I/O Interfacing The equivalent circuit for an I/O port pin is shown in Figure 6-1. All port pins, except the MCLR pin which is input-only, may be used for both input and output operations. For input operations, these ports are non-latching. Any input must be present until read by an input instruction (e.g., MOVF PORTB, W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit in TRIS must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin (except MCLR) can be programmed individually as input or output. FIGURE 6-1: BLOCK DIAGRAM OF I/O PIN (Example shown of RA2 with Weak Pull-up and Wake-up on change) Data Bus D Q CK Q D Q CK Q WR Port TRIS ‘f’ Data TRIS RD Port W Reg Latch Latch Reset Note 1: I/O pins have protection diodes to VDD and VSS. 2: Pin enabled as analog for ADC or comparator. D CK Q Pin Change RxPU ADC pin Ebl COMP pin Ebl ADC COMP I/O Pin(1) (2) (2)  2012 Microchip Technology Inc. Preliminary DS41652A-page 31 PIC16F527 6.6 Register Definitions — PORT Control REGISTER 6-1: PORTA: PORTA REGISTER TABLE 6-1: PORTA PINS ORDER OF PRECEDENCE TABLE 6-2: WEAK PULL-UP ENABLED PINS REGISTER 6-2: PORTB: PORTB REGISTER TABLE 6-3: PORTB PINS ORDER OF PRECEDENCE U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — RA5 RA4 RA3 RA2 RA1 RA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RA<5:0>: PORTA I/O Pin bits 1 = Port pin is >VIH min. 0 = Port pin is : PORTB I/O Pin bits 1 = Port pin is >VIH min. 0 = Port pin is : PORTC I/O Pin bits 1 = Port pin is >VIH min. 0 = Port pin is : ADC Analog Input Pin Select(1), (2) 0 = Analog function on selected ANx pin is disabled 1 = ANx configured as an analog input Note 1: When the ANSx bits are set, the channels selected will automatically be forced into Analog mode, regardless of the pin function previously defined. The only exception to this is the comparator, where the analog input to the comparator and the ADC will be active at the same time. It is the user’s responsibility to ensure that the ADC loading on the comparator input does not affect their application. 2: The ANS<7:0> bits are active regardless of the condition of ADON. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-On Reset Value on MCLR and WDT Reset N/A TRIS(1) I/O Control Registers (TRISA, TRISB, TRISC)(1) 1111 1111 1111 1111 06h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --uu uuuu 07h PORTB RB7 RB6 RB5 RB4 — — — — xxxx ---- uuuu ---- 27h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu Legend: x = unknown, u = unchanged, — = unimplemented, read as ‘0’, Shaded cells = unimplemented, read as ‘0’ Note 1: TRISA3 is read-only ‘1’, and cannot be set as output.  2012 Microchip Technology Inc. Preliminary DS41652A-page 33 PIC16F527 6.7 I/O Programming Considerations 6.7.1 BIDIRECTIONAL I/O PORTS Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and rewrite the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit 5 of PORTB will cause all eight bits of PORTB to be read into the CPU, bit 5 to be set and the PORTB value to be written to the output latches. If another bit of PORTB is used as a bidirectional I/O pin (say bit 0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the Input mode, no problem occurs. However, if bit 0 is switched into Output mode later on, the content of the data latch may now be unknown. Example 6-1 shows the effect of two sequential Read-Modify-Write instructions (e.g., BCF, BSF, etc.) on an I/O port. A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin (“wired OR”, “wired AND”). The resulting high output currents may damage the chip. EXAMPLE 6-1: READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT(e.g. PIC16F527) 6.7.2 SUCCESSIVE OPERATIONS ON I/O PORTS The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 6-2). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction causes that file to be read into the CPU. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port. FIGURE 6-2: SUCCESSIVE I/O OPERATION ;Initial PORTB Settings ;PORTB<5:3> Inputs ;PORTB<2:0> Outputs ; ; PORTB latch PORTB pins ; -------------------- BCF PORTB, 5 ;--01 -ppp--11 pppp BCF PORTB, 4 ;--10 -ppp--11 pppp MOVLW 007h ; TRIS PORTB ;--10 -ppp--11 pppp ; Note 1: The user may have expected the pin values to be ‘--00 pppp’. The 2nd BCF caused RB5 to be latched as the pin value (High). PC PC + 1 PC + 2 PC + 3 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Instruction Fetched RB<5:0> MOVWF PORTB NOP Port pin sampled here MOVF PORTB, W NOP Instruction Executed MOVWF PORTB (Write to PORTB) MOVF PORTB,W NOP This example shows a write to PORTB followed by a read from PORTB. Data setup time = (0.25 TCY – TPD) where: TCY = instruction cycle. TPD = propagation delay Therefore, at higher clock frequencies, a write followed by a read may be problematic. (Read PORTB) Port pin written here PIC16F527 DS41652A-page 34 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 35 PIC16F527 7.0 TIMER0 MODULE AND TMR0 REGISTER The Timer0 module has the following features: • 8-bit timer/counter register, TMR0 • Readable and writable • 8-bit software programmable prescaler • Internal or external clock select: - Edge select for external clock Figure 7-1 is a simplified block diagram of the Timer0 module. Timer mode is selected by clearing the T0CS bit of the OPTION register. In Timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two cycles (Figure 7-2 and Figure 7-3). The user can work around this by writing an adjusted value to the TMR0 register. There are two types of Counter mode. The first Counter mode uses the T0CKI pin to increment Timer0. It is selected by setting the T0CS bit of the OPTION register, setting the C1T0CS bit of the CM1CON0 register and setting the C1OUTEN bit of the CM1CON0 register. In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The T0SE bit of the OPTION register determines the source edge. Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 7.1 “Using Timer0 with an External Clock”. The second Counter mode uses the output of the comparator to increment Timer0. It can be entered in by setting the T0CS bit of the OPTION register, and clearing the C1T0CS bit of the CM1CON0 register (C1OUTEN [CM1CON0<6>] does not affect this mode of operation). This enables an internal connection between the comparator and the Timer0. The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit, PSA of the OPTION register. Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4,..., 1:256 are selectable. Section 7.2 “Prescaler” details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 7-1. FIGURE 7-1: TIMER0 BLOCK DIAGRAM Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register. 2: The prescaler is shared with the Watchdog Timer. 3: The C1T0CS bit is in the CM1CON0 register. T0CKI T0SE(1) 0 1 1 0 pin T0CS(1) FOSC/4 Programmable Prescaler(2) Sync with Internal Clocks TMR0 Reg PSOUT (2 cycle delay) PSOUT Data Bus 8 PSA(1) PS2(1), PS1(1), PS0(1) 3 Sync 0 1 Comparator Output C1T0CS(3) PIC16F527 DS41652A-page 36 Preliminary  2012 Microchip Technology Inc. FIGURE 7-2: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE FIGURE 7-3: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2 TABLE 7-1: REGISTERS ASSOCIATED WITH TIMER0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page TMR0 Timer0 module Register — CM1CON0 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU 66 CM2CON0 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU 67 OPTION RAWU RAPU T0CS T0SE PSA PS2 PS1 PS0 20 TRIS(1) I/O Control Registers (TRISA, TRISB, TRISC) — Legend: Shaded cells are not used by Timer0. – = unimplemented, x = unknown, u = unchanged. Note 1: The TRIS of the T0CKI pin is overridden when T0CS = 1. PC – 1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Instruction Fetch Timer0 PC PC + 1 PC + 2 PC + 3 PC + 4 PC + 6 T0 T0 + 1 T0 + 2 NT0 NT0 + 1 NT0 + 2 MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W Write TMR0 executed Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 + 1 Read TMR0 reads NT0 + 2 Instruction Executed PC + 5 PC (Program Counter) PC – 1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Instruction Fetch Timer0 PC PC + 1 PC + 2 PC + 3 PC + 4 PC + 6 T0 T0 + 1 NT0 NT0 + 1 MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W Write TMR0 executed Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 + 1 Read TMR0 reads NT0 + 2 Instruction Executed PC + 5 PC (Program Counter)  2012 Microchip Technology Inc. Preliminary DS41652A-page 37 PIC16F527 7.1 Using Timer0 with an External Clock When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 7.1.1 EXTERNAL CLOCK SYNCHRONIZATION When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 7-4). Therefore, it is necessary for T0CKI to be high for at least 2 TOSC (and a small RC delay of 2 Tt0H) and low for at least 2 TOSC (and a small RC delay of 2 Tt0H). Refer to the electrical specification of the desired device. When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler, so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4 TOSC (and a small RC delay of 4 Tt0H) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of Tt0H. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. 7.1.2 TIMER0 INCREMENT DELAY Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 7-4 shows the delay from the external clock edge to the timer incrementing. FIGURE 7-4: TIMER0 TIMING WITH EXTERNAL CLOCK Increment Timer0 (Q4) External Clock Input or Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Timer0 T0 T0 + 1 T0 + 2 Small pulse misses sampling External Clock/Prescaler Output After Sampling (3) Prescaler Output (2) (1) Note 1: Delay from clock input change to Timer0 increment is 3 TOSC to 7 TOSC. (Duration of Q = TOSC). Therefore, the error in measuring the interval between two edges on Timer0 input = ±4 TOSC max. 2: External clock if no prescaler selected; prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs. PIC16F527 DS41652A-page 38 Preliminary  2012 Microchip Technology Inc. 7.2 Prescaler An 8-bit counter is available as a prescaler for the Timer0 module or as a postscaler for the Watchdog Timer (WDT), respectively (see Section 8.7 “Watchdog Timer (WDT)”). For simplicity, this counter is being referred to as “prescaler” throughout this data sheet. The PSA and PS<2:0> bits of the OPTION register determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF TMR0, MOVWF TMR0, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a Reset, the prescaler contains all ‘0’s. 7.2.1 SWITCHING PRESCALER ASSIGNMENT The prescaler assignment is fully under software control (i.e., it can be changed “on-the-fly” during program execution). To avoid an unintended device Reset, the following instruction sequence (Example 7-1) must be executed when changing the prescaler assignment from Timer0 to the WDT. EXAMPLE 7-1: CHANGING PRESCALER (TIMER0 WDT) To change the prescaler from the WDT to the Timer0 module, use the sequence shown in Example 7-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler. EXAMPLE 7-2: CHANGING PRESCALER (WDT TIMER0) Note: The prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT and vice versa. CLRWDT ;Clear WDT CLRF TMR0 ;Clear TMR0 & Prescaler MOVLW b'00xx1111' CLRWDT ;PS<2:0> are 000 or 001 MOVLW b'00xx1xxx' ;Set Postscaler to OPTION ;desired WDT rate CLRWDT ;Clear WDT and ;prescaler MOVLW b'xxxx0xxx' ;Select TMR0, new ;prescale value and ;clock source OPTION  2012 Microchip Technology Inc. Preliminary DS41652A-page 39 PIC16F527 FIGURE 7-5: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER TCY (= FOSC/4) Sync 2 Cycles TMR0 Reg 8-bit Prescaler 8-to-1 MUX M MUX Watchdog Timer PSA(1) 0 1 0 1 WDT Time-out PS<2:0>(1) 8 PSA(1) WDT Enable bit 0 1 0 1 Data Bus 8 PSA(1) T0CS(1) M U X M U X U X T0SE(1) Note 1: T0CS, T0SE, PSA, PS<2:0> are bits in the OPTION register. T0CKI Pin 0 1 C1TOCS Comparator Output PIC16F527 DS41652A-page 40 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 41 PIC16F527 8.0 SPECIAL FEATURES OF THE CPU What sets a microcontroller apart from other processors are special circuits that deal with the needs of real-time applications. The PIC16F527 microcontrollers have a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide powersaving operating modes and offer code protection. These features are: • Oscillator Selection • Reset: - Power-on Reset (POR) - Brown-out Reset (BOR) - Device Reset Timer (DRT) - Wake-up from Sleep on Pin Change • Watchdog Timer (WDT) • Sleep • Code Protection • ID Locations • In-Circuit Serial Programming™ • Clock Out The device has a Watchdog Timer, which can be shut off only through Configuration bit WDTE. The Watchdog Timer runs off of its own RC oscillator for added reliability. There is also a Device Reset Timer (DRT), intended to keep the chip in Reset until the crystal oscillator is stable. The DRT can be enabled with the DRTEN Configuration bit. For the HS, XT or LP oscillator options, the 18 ms (nominal) delay is always provided by the Device Reset Timer and the DRTEN bit is ignored. When using the EC clock, INTRC or EXTRC oscillator options, there is a standard delay of 10 us on power-up, which can be extended to 18 ms with the use of the DRT timer. With the DRT timer on-chip, most applications require no additional external Reset circuitry. The Sleep mode is designed to offer a very low current Power-Down mode. The user can wake-up from Sleep through a change on input pin or through a Watchdog Timer time-out. Several oscillator options are also made available to allow the part to fit the application, including an internal 4/8 MHz oscillator. The EXTRC oscillator option saves system cost while the LP crystal option saves power. A set of Configuration bits are used to select various options. 8.1 Configuration Bits The PIC16F527 Configuration Words consist of 12 bits, although some bits may be unimplemented and read as ‘1’. Configuration bits can be programmed to select various device configurations. As an example, three bits are for the selection of the oscillator type; one bit is the Watchdog Timer enable bit, one bit is the MCLR enable bit and one bit is for code protection (Register 8-1). PIC16F527 DS41652A-page 42 Preliminary  2012 Microchip Technology Inc. 8.2 Register Definitions — Configuration Word REGISTER 8-1: CONFIG: CONFIGURATION WORD REGISTER U-1 U-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — DRTEN BOREN CPSW IOSCFS MCLRE CP WDTE FOSC2 FOSC1 FOSC0 bit 11 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 11-10 Unimplemented: Read as ‘1’ bit 9 DRTEN: Device Reset Timer Enable bit 1 = DRT Enabled (18 ms) 0 = DRT Disabled bit 8 BOREN: Brown-out Reset Enable bit 1 = BOR Enabled 0 = BOR Disabled bit 7 CPSW: Code Protection bit – Self Writable Memory 1 = Code protection off 0 = Code protection on bit 6 IOSCFS: Internal Oscillator Frequency Select bit 1 = 8 MHz INTOSC speed 0 = 4 MHz INTOSC speed bit 5 MCLRE: Master Clear Enable bit 1 = RA3/MCLR pin functions as MCLR 0 = RA3/MCLR pin functions as RA3, MCLR tied internally to VDD bit 4 CP: Code Protection bit – User Program Memory 1 = Code protection off 0 = Code protection on bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 FOSC<2:0>: Oscillator Selection bits 000 = LP oscillator and automatic 18 ms DRT (DRTEN fuse ignored) 001 = XT oscillator and automatic 18 ms DRT (DRTEN fuse ignored) 010 = HS oscillator and automatic 18 ms DRT (DRTEN fuse ignored) 011 = EC oscillator with RA4 function on RA4/OSC2/CLKOUT and 10 us start-up time(2,3) 100 = INTRC with RA4 function on RA4/OSC2/CLKOUT and 10 us start-up time(2,3) 101 = INTRC with CLKOUT function on RA4/OSC2/CLKOUT and 10 us start-up time(2,3) 110 = EXTRC with RA4 function on RA4/OSC2/CLKOUT and 10 us start-up time(2,3) 111 = EXTRC with CLKOUT function on RA4/OSC2/CLKOUT and 10 us start-up time(2,3) Note 1: Refer to the “PIC16F527 Memory Programming Specification”, DS41640 to determine how to access the Configuration Word. 2: DRT length and start-up time are functions of the Clock mode selection. It is the responsibility of the application designer to ensure the use of either will result in acceptable operation. Refer to Section 15.0 “Electrical Characteristics” for VDD rise time and stability requirements for this mode of operation. 3: The optional DRTEN fuse can be used to extend the start-up time to 18 ms.  2012 Microchip Technology Inc. Preliminary DS41652A-page 43 PIC16F527 8.3 Oscillator Configurations 8.3.1 OSCILLATOR TYPES The PIC16F527 device can be operated in up to six different oscillator modes. The user can program up to three Configuration bits (FOSC<2:0>). To select one of these modes: • LP: Low-Power Crystal • XT: Crystal/Resonator • HS: High-Speed Crystal/Resonator • INTRC: Internal 4/8 MHz Oscillator • EXTRC: External Resistor/Capacitor • EC: External High-Speed Clock Input 8.3.2 CRYSTAL OSCILLATOR/CERAMIC RESONATORS In HS, XT or LP modes, a crystal or ceramic resonator is connected to the OSC1/CLKIN and OSC2/CLKOUT pins to establish oscillation (Figure 8-1). The PIC16F527 oscillator designs require the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in HS, XT or LP modes, the device can have an external clock source drive the OSC1/CLKIN pin (Figure 8-2). In this mode, the output drive levels on the OSC2 pin are very weak. If the part is used in this fashion, then this pin should be left open and unloaded. Also when using this mode, the external clock should observe the frequency limits for the Clock mode chosen (HS, XT or LP). FIGURE 8-1: CRYSTAL OPERATION (OR CERAMIC RESONATOR) (HS, XT OR LP OSC CONFIGURATION) FIGURE 8-2: EXTERNAL CLOCK INPUT OPERATION (HS, XT, LP OR EC OSC CONFIGURATION) TABLE 8-1: CAPACITOR SELECTION FOR CERAMIC RESONATORS Note 1: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. 2: The user should verify that the device oscillator starts and performs as expected. Adjusting the loading capacitor values and/or the Oscillator mode may be required. Osc Type Resonator Freq. Cap. Range C1 Cap. Range C2 XT 4.0 MHz 30 pF 30 pF HS 16 MHz 10-47 pF 10-47 pF Note 1: These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. Note 1: See Capacitor Selection tables for recommended values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF approx. value = 10 M. C1(1) C2(1) XTAL OSC2 OSC1 RF(3) Sleep To internal logic RS(2) PIC® Device Clock From ext. system PIC® Device OSC2/CLKOUT OSC1/CLKIN OSC2/CLKOUT(1) EC, HS, XT, LP Note 1: Available in EC mode only. PIC16F527 DS41652A-page 44 Preliminary  2012 Microchip Technology Inc. TABLE 8-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR(2) 8.3.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT Either a prepackaged oscillator or a simple oscillator circuit with TTL gates can be used as an external crystal oscillator circuit. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used: one with parallel resonance, or one with series resonance. Figure 8-3 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometers bias the 74AS04 in the linear region. This circuit could be used for external oscillator designs. FIGURE 8-3: EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT Figure 8-4 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180- degree phase shift in a series resonant oscillator circuit. The 330  resistors provide the negative feedback to bias the inverters in their linear region. FIGURE 8-4: EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT 8.3.4 EXTERNAL RC OSCILLATOR For timing insensitive applications, the RC device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit-to-unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 8-5 shows how the R/C combination is connected to the PIC16F527 device. For REXT values below 3.0 k, the oscillator operation may become unstable, or stop completely. For very high REXT values (e.g., 1 M), the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping REXT between 5.0 k and 100 k. Although the oscillator will operate with no external capacitor (CEXT = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no external capacitance or with values below 20 pF, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. Section 15.0 “Electrical Characteristics” shows RC frequency variation from part-to-part due to normal process variation. The variation is larger for larger values of R (since leakage current variation will affect RC frequency more for large R) and for smaller values of C (since variation of input capacitance will affect RC frequency more). Osc Type Resonator Freq. Cap. Range C1 Cap. Range C2 LP 32 kHz(1) 15 pF 15 pF XT 200 kHz 1 MHz 4 MHz 47-68 pF 15 pF 15 pF 47-68 pF 15 pF 15 pF HS 20 MHz 15-47 pF 15-47 pF Note 1: For VDD > 4.5V, C1 = C2  30 pF is recommended. 2: These values are for design guidance only. Rs may be required to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. 20 pF +5V 20 pF 10k 4.7k 10k 74AS04 XTAL 10k 74AS04 CLKIN To Other Devices PIC® Device 330 74AS04 74AS04 PIC® Device CLKIN To Other Devices XTAL 330 74AS04 0.1 mF  2012 Microchip Technology Inc. Preliminary DS41652A-page 45 PIC16F527 Also, see the Electrical Specifications section for variation of oscillator frequency due to VDD for given REXT/CEXT values, as well as frequency variation due to operating temperature for given R, C and VDD values. FIGURE 8-5: EXTERNAL RC OSCILLATOR MODE 8.3.5 INTERNAL 4/8 MHz RC OSCILLATOR The internal RC oscillator provides a fixed 4/8 MHz (nominal) system clock at VDD = 5V and 25°C, (see Section 15.0 “Electrical Characteristics” for information on variation over voltage and temperature). In addition, a calibration instruction is programmed into the last address of memory, which contains the calibration value for the internal RC oscillator. This location is always non-code protected, regardless of the codeprotect settings. This value is programmed as a MOVLW XX instruction where XX is the calibration value, and is placed at the Reset vector. This will load the W register with the calibration value upon Reset and the PC will then roll over to the users program at address 0x000. The user then has the option of writing the value to the OSCCAL Register or ignoring it. OSCCAL, when written to with the calibration value, will “trim” the internal oscillator to remove process variation from the oscillator frequency. For the PIC16F527 device, only bits <7:1> of OSCCAL are used for calibration. See Register 4-3 for more information. VDD REXT CEXT VSS OSC1 Internal clock N FOSC/4 OSC2/CLKOUT PIC® Device Note: Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part so it can be reprogrammed correctly later. Note: The bit 0 of the OSCCAL register is unimplemented and should be written as ‘0’ when modifying OSCCAL for compatibility with future devices. PIC16F527 DS41652A-page 46 Preliminary  2012 Microchip Technology Inc. 8.4 Reset The device differentiates between various kinds of Reset: • Power-on Reset (POR) • Brown-out Reset (BOR) • MCLR Reset during normal operation • MCLR Reset during Sleep • WDT Time-out Reset during normal operation • WDT Time-out Reset during Sleep • Wake-up from Sleep on pin change Some registers are not reset in any way, they are unknown on POR/BOR and unchanged in any other Reset. Most other registers are reset to “Reset state” on Power-on Reset (POR)/Brown-out Reset (BOR), MCLR, WDT or Wake-up on pin change Reset during normal operation. They are not affected by a WDT Reset during Sleep or MCLR Reset during Sleep, since these Resets are viewed as resumption of normal operation. The exceptions to this are the TO and PD bits. They are set or cleared differently in different Reset situations. These bits are used in software to determine the nature of Reset. See Table 4-1 for a full description of Reset states of all registers. TABLE 8-3: RESET CONDITION FOR SPECIAL REGISTERS STATUS Addr: 03h Power-on Reset (POR) or Brown-out Reset (BOR) 0001 1xxx MCLR Reset during normal operation 000u uuuu MCLR Reset during Sleep 0001 0uuu WDT Reset during Sleep 0000 0uuu WDT Reset normal operation 0000 uuuu Wake-up from Sleep on pin change 1001 0uuu Wake-up from Sleep on comparator change 0101 0uuu Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’.  2012 Microchip Technology Inc. Preliminary DS41652A-page 47 PIC16F527 8.4.1 MCLR ENABLE This Configuration bit, when set to a ‘1’, enables the external MCLR Reset function. When cleared to ‘0’, the MCLR function is tied to the internal VDD and the pin is assigned to be an input-only pin function. See Figure 8-6. FIGURE 8-6: MCLR SELECT 8.5 Power-on Reset (POR) The PIC16F527 device incorporates an on-chip Poweron Reset (POR) circuitry, which provides an internal chip Reset for most power-up situations. The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the internal POR, program the MCLR/VPP pin as MCLR and tie through a resistor to VDD, or program the pin as an input pin. An internal weak pull-up resistor is implemented using a transistor (refer to Table 15-7 for the pull-up resistor ranges). This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified. See Section 15.0 “Electrical Characteristics” for details. When the device starts normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature,...) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating parameters are met. A simplified block diagram of the on-chip Power-on Reset circuit is shown in Figure 8-7. The Power-on Reset circuit and the Device Reset Timer (see Section 8.6 “Device Reset Timer (DRT)”) circuit are closely related. On power-up, the Reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, it will reset the Reset latch and thus end the on-chip Reset signal. A power-up example where MCLR is held low is shown in Figure 8-8. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of Reset TDRT msec after MCLR goes high. In Figure 8-9, the on-chip Power-on Reset feature is being used (MCLR and VDD are tied together or the pin is programmed to be an input pin). The VDD is stable before the start-up timer times out and there is no problem in getting a proper Reset. However, Figure 8-10 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses that MCLR is high and when MCLR and VDD actually reach their full value, is too long. In this situation, when the start-up timer times out, VDD has not reached the VDD (min) value and the chip may not function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 8-9). For additional information, refer to Application Notes AN522, “Power-Up Considerations” (DS00522) and AN607, “Power-up Trouble Shooting” (DS00607). MCLR/VPP MCLRE Internal MCLR RAPU Note: When the device starts normal operation (exit the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. PIC16F527 DS41652A-page 48 Preliminary  2012 Microchip Technology Inc. FIGURE 8-7: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT FIGURE 8-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW) FIGURE 8-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME S Q R Q VDD MCLR/VPP Power-up Detect POR (Power-on Reset) WDT Reset CHIP Reset MCLRE Wake-up on pin Change Reset Start-up Timer (10 us WDT Time-out Pin Change Sleep MCLR Reset or 18 ms) Comparator Change Wake-up on Comparator Change VDD MCLR Internal POR DRT Time-out Internal Reset TDRT VDD MCLR Internal POR DRT Time-out Internal Reset TDRT  2012 Microchip Technology Inc. Preliminary DS41652A-page 49 PIC16F527 FIGURE 8-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME VDD MCLR Internal POR DRT Time-out Internal Reset TDRT V1 Note: When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In this example, the chip will reset properly if, and only if, V1  VDD min. PIC16F527 DS41652A-page 50 Preliminary  2012 Microchip Technology Inc. 8.6 Device Reset Timer (DRT) On the PIC16F527 device, the DRT runs any time the device is powered up. DRT runs from Reset and varies based on oscillator selection and Reset type (see Table 8-4). The DRT operates on an internal RC oscillator. The processor is kept in Reset as long as the DRT is active. The DRT delay allows VDD to rise above VDD min. and for the oscillator to stabilize. Oscillator circuits based on crystals or ceramic resonators require a certain time after power-up to establish a stable oscillation. The on-chip DRT keeps the device in a Reset condition after MCLR has reached a logic high (VIH MCLR) level. Programming MCLR/VPP as MCLR and using an external RC network connected to the MCLR input is not required in most cases. This allows savings in cost-sensitive and/or space restricted applications, as well as allowing the use of that pin as a general purpose input. The Device Reset Time delays will vary from chip-tochip due to VDD, temperature and process variation. See AC parameters for details. The DRT will also be triggered upon a Watchdog Timer time-out from Sleep. This is particularly important for applications using the WDT to wake from Sleep mode automatically. Reset sources are POR, MCLR, WDT time-out and wake-up on pin or comparator change. See Section 8.10.2 “Wake-up from Sleep”, Notes 1, 2 and 3. 8.7 Watchdog Timer (WDT) The Watchdog Timer (WDT) is a free running on-chip RC oscillator, which does not require any external components. This RC oscillator is separate from the external RC oscillator of the OSC1/CLKIN pin and the internal 4/8 MHz oscillator. This means that the WDT will run even if the main processor clock has been stopped, for example, by execution of a SLEEP instruction. During normal operation or Sleep, a WDT Reset or wake-up Reset, generates a device Reset. The TO bit of the STATUS register will be cleared upon a Watchdog Timer Reset. The WDT can be permanently disabled by programming the configuration WDTE as a ‘0’ (see Section 8.1 “Configuration Bits”). Refer to the PIC16F527 Programming Specifications to determine how to access the Configuration Word. TABLE 8-4: TYPICAL DRT PERIODS 8.7.1 WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the OPTION register. Thus, a time-out period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-to-part process variations (see DC specs). Under worst-case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. 8.7.2 WDT PROGRAMMING CONSIDERATIONS The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device Reset. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum Sleep time before a WDT wake-up Reset. Oscillator Configuration POR Reset Subsequent Resets HS, XT, LP 18 ms 18 ms EC 10 us 10 s INTOSC, EXTRC 10 us 10 s  2012 Microchip Technology Inc. Preliminary DS41652A-page 51 PIC16F527 FIGURE 8-11: WATCHDOG TIMER BLOCK DIAGRAM TABLE 8-5: REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER 8.8 Time-out Sequence (TO) and Power-down (PD) Reset Status The TO and PD bits in the STATUS register can be tested to determine if a Reset condition has been caused by a power-up condition, a MCLR or Watchdog Timer (WDT) Reset. TABLE 8-6: TO/PD STATUS AFTER RESET Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page OPTION RAWU RAPU T0SC T0SE PSA PS2 PS1 PS0 20 Legend: Shaded boxes = Not used by Watchdog Timer. (Figure 7-1) Postscaler Note 1: PSA, PS<2:0> are bits in the OPTION register. WDT Time-out Watchdog Time From Timer0 Clock Source WDT Enable Configuration Bit PSA Postscaler 8-to-1 MUX PS<2:0>(1) To Timer0 (Figure 7-4) 0 1 M U X 0 1 PSA MUX (1) TO PD Reset Caused By 0 0 WDT wake-up from Sleep 0 u WDT time-out (not from Sleep) 1 0 MCLR wake-up from Sleep 1 1 Power-up or Brown-out Reset u u MCLR not during Sleep Legend: u = unchanged Note 1: The TO and PD bits maintain their status (u) until a Reset occurs. A low pulse on the MCLR input does not change the TO and PD Status bits. PIC16F527 DS41652A-page 52 Preliminary  2012 Microchip Technology Inc. 8.9 Brown-out Reset (BOR) A brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a brown-out. The Brown-out Reset feature is enabled by the BOREN Configuration bit. If VDD falls below VBOR for greater than parameter (TBOR) (see Figure 8-12), the brown-out situation will reset the device. This will occur regardless of VDD slew rate. A Reset is not insured to occur if VDD falls below VBOR for less than parameter (TBOR). On any Reset (Power-on, Brown-out Reset, Watchdog Timer, etc.), the chip will remain in Reset until VDD rises above VBOR (see Figure 8-12). If enabled, the Device Reset Timer will now be invoked, and will keep the chip in Reset an additional 18 ms. If VDD drops below VBOR while the Device Reset Timer is running, the chip will go back into a Brown-out Reset and the Device Reset Timer will be re-initialized. Once VDD rises above VBOR, the Device Reset Timer will execute a 18 ms Reset. FIGURE 8-12: BROWN-OUT RESET TIMING AND CHARACTERISTICS FIGURE 8-13: BROWN-OUT SITUATIONS Note: The Device Reset Timer is enabled by the DRTEN bit in the Configuration Word register. VBOR VDD (Device in Brown-out Reset) (Device not in Brown-out Reset) 32 37 Reset (due to BOR) VBOR + VHYST 18 ms VBOR VDD Internal Reset VBOR VDD Internal Reset 18 ms < 18 ms 18 ms VBOR VDD Internal Reset (DRTEN = 1) (DRTEN = 1) (DRTEN = 1)  2012 Microchip Technology Inc. Preliminary DS41652A-page 53 PIC16F527 8.10 Power-down Mode (Sleep) A device may be powered down (Sleep) and later powered up (wake-up from Sleep). 8.10.1 SLEEP The Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit of the STATUS register is set, the PD bit of the STATUS register is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low or high-impedance). For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the MCLR/VPP pin must be at a logic high level if MCLR is enabled. 8.10.2 WAKE-UP FROM SLEEP The device can wake-up from Sleep through one of the following events: 1. An external Reset input on RB3/MCLR/VPP pin, when configured as MCLR. 2. A Watchdog Timer Time-out Reset (if WDT was enabled). 3. From an interrupt source, see Section 8.11 “Interrupts” for more information. On waking from Sleep, the processor will continue to execute the instruction immediately following the SLEEP instruction. If the WUR bit is also set, upon waking from Sleep, the device will reset. If the GIE bit is also set, upon waking from Sleep, the processor will branch to the interrupt vector. Please see Section 8.11 “Interrupts” for more information. The TO and PD bits can be used to determine the cause of the device Reset. The TO bit is cleared if a WDT time-out occurred and subsequently caused a wake-up. The PD bit, which is set on power-up, is cleared when SLEEP is invoked. . The WDT is cleared when the device wakes from Sleep, regardless of the wake-up source. Note: A Reset generated by a WDT time-out does not drive the MCLR pin low. Note: Caution: Right before entering Sleep, read the input pins. When in Sleep, wakeup occurs when the values at the pins change from the state they were in at the last reading. If a wake-up on change occurs and the pins are not read before re-entering Sleep, a wake-up will occur immediately even if no pins change while in Sleep mode. Note: Caution: Right before entering Sleep, read the comparator Configuration register(s) CM1CON0 and CM2CON0. When in Sleep, wake-up occurs when the comparator output bit C1OUT and C2OUT change from the state they were in at the last reading. If a wake-up on comparator change occurs and the pins are not read before re-entering Sleep, a wakeup will occur immediately, even if no pins change while in Sleep mode. PIC16F527 DS41652A-page 54 Preliminary  2012 Microchip Technology Inc. 8.11 Interrupts The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. These following interrupt sources are available on the PIC16F527 device: • Timer0 Overflow • ADC Completion • Comparator Output Change • Interrupt-on-change pin Refer to the corresponding chapters for details. 8.12 Operation Interrupts are disabled upon any device Reset. They are enabled by setting the following bits: • GIE bit of the INTCON register • Interrupt Enable bit(s) for the specific interrupt event(s) The enable bits for specific interrupts can be found in the INTCON1 register. An interrupt is recorded for a specific interrupt via flag bits found in the INTCON0 register. The ADC Conversion flag and the Timer0 Overflow flags will be set regardless of the status of the GIE and individual interrupt enable bits. The Comparator and Interrupt-on-change flags must be enabled for use. One or both of the comparator outputs can be enabled to affect the interrupt flag by setting the C1WU bit in the CM1CON0 register and the C2WU bit in the CM2CON0 register. The Interrupt-onchange flag is enabled by setting the RAWU bit in the OPTION register. The following events happen when an interrupt event occurs while the GIE bit is set: • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • Several registers are automatically switched to a secondary set of registers to store critical data. (See Section 8.13 “Automatic Context Switching”) • PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. 8.13 Automatic Context Switching While the device is executing from the ISR, a secondary set of W, STATUS, FSR and BSR registers are used by the CPU. These registers are still addressed at the same location, but hold persistent, independent values for use inside the ISR. This allows the contents of the primary set of registers to be unaffected by interrupts in the main line execution. The contents of the secondary set of context registers are visible in the SFR map as the IW, ISTATUS, IFSR and IBSR registers. When executing code from within the ISR, these registers will read back the main line context, and vice versa. The RETFIE instruction exits the ISR by popping the previous address from the stack, switching back to the original set of critical registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. 8.14 Interrupts during Sleep Any of the interrupt sources can be used to wake from Sleep. To wake from Sleep, the peripheral must be operating without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to the Section 8.10 “Power-down Mode (Sleep)” for more details. TABLE 8-7: INTERRUPT PRIORITIES Note 1: Individual interrupt flag bits may be set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. Vector or In Sleep GIE WUR Wake-up and Vector Wake-up Reset Wake-up Inline Watchdog Wake-up Inline Watchdog Wake-up Reset 1 X X X X 1 1 1 1 1 1 0 0 0 0  2012 Microchip Technology Inc. Preliminary DS41652A-page 55 PIC16F527 8.15 Register Definitions — Interrupt Control REGISTER 8-2: INTCON0 REGISTER R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 ADIF CWIF T0IF RAIF — — — GIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADIF: A/D Converter Interrupt Flag bit 1 = A/D conversion complete (must be cleared by software) 0 = A/D conversion has not completed or has not been started bit 6 CWIF: Comparator 1 or 2 Interrupt Flag bit 1 = Comparator interrupt-on-change has occurred(1) 0 = No change in Comparator 1 or 2 output bit 5 T0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared by software) 0 = TMR0 register did not overflow bit 4 RAIF: Port A Interrupt-on-change Flag bit 1 = Wake-up or interrupt has occurred (cleared in software)(2) 0 = Wake-up or interrupt has not occurred bit 3-1 Unimplemented: Read as ‘0’ bit 0 GIE: Global Interrupt Enable bit 1 = Interrupt sets PC to address 0x004 (Vector to ISR) 0 = Interrupt causes wake-up and inline code execution Note 1: This bit only functions when the C1WU or C2WU bits are set (see Register 10-1 and Register 10-2). 2: The RAWU bit of the OPTION register must be set to enable this function (see Register 4-2). PIC16F527 DS41652A-page 56 Preliminary  2012 Microchip Technology Inc. REGISTER 8-3: INTCON1 REGISTER R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 ADIE CWIE T0IE RAIE — — — WUR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADIE: A/D Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 6 CWIE: Comparator 1 and 2 Interrupt Enable bit 1 = Enables the Comparator 1 and 2 Interrupt 0 = Disables the Comparator 1 and 2 Interrupt bit 5 T0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 RAIE: Port A on Pin Change Interrupt Enable bit 1 = Interrupt-on-change pin enabled 0 = Interrupt-on-change pin disabled bit 3-1 Unimplemented: Read as ‘0’ bit 0 WUR: Wake-up Reset Enable bit 1 = Interrupt source causes device Reset on wake-up 0 = Interrupt source wakes up device from Sleep (Vector to ISR or inline execution)  2012 Microchip Technology Inc. Preliminary DS41652A-page 57 PIC16F527 8.16 Program Verification/Code Protection If the code protection bit has not been programmed, the on-chip program memory can be read out for verification purposes. The first 64 locations and the last location (OSCCAL) can be read, regardless of the code protection bit setting. 8.17 ID Locations Four memory locations are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution, but are readable and writable during Program/Verify. Use only the lower four bits of the ID locations and always program the upper eight bits as ‘0’s. 8.18 In-Circuit Serial Programming™ The PIC16F527 microcontroller can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware, or a custom firmware, to be programmed. The devices are placed into a Program/Verify mode by holding the ICSPCLK and ICSPDAT pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). ICSPCLK becomes the programming clock and ICSPDAT becomes the programming data. Both ICSPCLK and ICSPDAT are Schmitt Trigger inputs in this mode. After Reset, a 6-bit command is then supplied to the device. Depending on the command, 14 bits of program data are then supplied to or from the device, depending if the command was a load or a read. For complete details of serial programming, please refer to the PIC16F527 Programming Specifications. A typical In-Circuit Serial Programming connection is shown in Figure 8-14. FIGURE 8-14: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION External Connector Signals To Normal Connections To Normal Connections VDD VSS MCLR/VPP ICSPCLK ICSPDAT +5V 0V VPP CLK Data VDD PIC® Device PIC16F527 DS41652A-page 58 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 59 PIC16F527 9.0 ANALOG-TO-DIGITAL (A/D) CONVERTER The A/D Converter allows conversion of an analog signal into an 8-bit digital signal. 9.1 Clock Divisors The ADC has four clock source settings ADCS<1:0>. There are three divisor values 16, 8 and 4. The fourth setting is INTOSC with a divisor of four. These settings will allow a proper conversion when using an external oscillator at speeds from 20 MHz to 350 kHz. Using an external oscillator at a frequency below 350 kHz requires the ADC oscillator setting to be INTOSC/4 (ADCS<1:0> = 11) for valid ADC results. The ADC requires 13 TAD periods to complete a conversion. The divisor values do not affect the number of TAD periods required to perform a conversion. The divisor values determine the length of the TAD period. When the ADCS<1:0> bits are changed while an ADC conversion is in process, the new ADC clock source will not be selected until the next conversion is started. This clock source selection will be lost when the device enters Sleep. 9.1.1 VOLTAGE REFERENCE There is no external voltage reference for the ADC. The ADC reference voltage will always be VDD. 9.1.2 ANALOG MODE SELECTION The ANS<7:0> bits are used to configure pins for analog input. Upon any Reset, ANS<7:0> defaults to 11. This configures pins AN0, AN1 and AN2 as analog inputs. Pins configured as analog inputs are not available for digital output. Users should not change the ANS bits while a conversion is in process. ANS bits are active regardless of the condition of ADON. 9.1.3 ADC CHANNEL SELECTION The CHS bits are used to select the analog channel to be sampled by the ADC. The CHS<3:0> bits can be changed at any time without adversely effecting a conversion. To acquire an analog signal the CHS<3:0> selection must match one of the pin(s) selected by the ANS<7:0> bits. When the ADC is on (ADON = 1) and a channel is selected that is also being used by the comparator, then both the comparator and the ADC will see the analog voltage on the pin. When the CHS<3:0> bits are changed during an ADC conversion, the new channel will not be selected until the current conversion is completed. This allows the current conversion to complete with valid results. All channel selection information will be lost when the device enters Sleep. TABLE 9-1: CHANNEL SELECT (ADCS) BITS AFTER AN EVENT 9.1.4 THE GO/DONE BIT The GO/DONE bit is used to determine the status of a conversion, to start a conversion and to manually halt a conversion in process. Setting the GO/DONE bit starts a conversion. When the conversion is complete, the ADC module clears the GO/DONE bit and sets the ADIF bit in the INTCON register. A conversion can be terminated by manually clearing the GO/DONE bit while a conversion is in process. Manual termination of a conversion may result in a partially converted result in ADRES. The GO/DONE bit is cleared when the device enters Sleep, stopping the current conversion. The ADC does not have a dedicated oscillator, it runs off of the instruction clock. Therefore, no conversion can occur in Sleep. The GO/DONE bit cannot be set when ADON is clear. Note: The ADC clock is derived from the instruction clock. The ADCS divisors are then applied to create the ADC clock Note: It is the users responsibility to ensure that use of the ADC and comparator simultaneously on the same pin, does not adversely affect the signal being monitored or adversely effect device operation. Event ADCS<1:0> MCLR 11 Conversion completed CS<1:0> Conversion terminated CS<1:0> Power-on 11 Wake from Sleep 11 PIC16F527 DS41652A-page 60 Preliminary  2012 Microchip Technology Inc. 9.1.5 SLEEP This ADC does not have a dedicated ADC clock, and therefore, no conversion in Sleep is possible. If a conversion is underway and a Sleep command is executed, the GO/DONE and ADON bit will be cleared. This will stop any conversion in process and powerdown the ADC module to conserve power. Due to the nature of the conversion process, the ADRES may contain a partial conversion. At least one bit must have been converted prior to Sleep to have partial conversion data in ADRES. The ADCS and CHS bits are reset to their default condition; ANS<7:0> = 1s and CHS<3:0> = 1s. • For accurate conversions, TAD must meet the following: • 500 ns < TAD < 50 s • TAD = 1/(FOSC/divisor) Shaded areas indicate TAD out of range for accurate conversions. If analog input is desired at these frequencies, use INTOSC/8 for the ADC clock source. TABLE 9-2: TAD FOR ADCS SETTINGS WITH VARIOUS OSCILLATORS TABLE 9-3: EFFECTS OF SLEEP ON ADCON0 Source ADCS <1:0> Divisor 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz 500 kHz 350 kHz 200 kHz 100 kHz 32 kHz INTOSC 11 4 — — .5 s 1 s — — — — — — FOSC 10 4 .2 s .25 s .5 s 1 s 4 s 8 s 11 s 20 s 40 s 125 s FOSC 01 8 .4 s .5 s 1 s 2 s 8 s 16 s 23 s 40 s 80 s 250 s FOSC 00 16 .8 s 1 s 2 s 4 s 16 s 32 s 46 s 80 s 160 s 500 s ANS<7:0> ADCS1 ADCS0 CHS<3:0> GO/DONE ADON Entering Sleep Unchanged 11 1 0 0 Wake or Reset 1 11 1 0 0  2012 Microchip Technology Inc. Preliminary DS41652A-page 61 PIC16F527 9.1.6 ANALOG CONVERSION RESULT REGISTER The ADRES register contains the results of the last conversion. These results are present during the sampling period of the next analog conversion process. After the sampling period is over, ADRES is cleared (= 0). A ‘leading one’ is then right shifted into the ADRES to serve as an internal conversion complete bit. As each bit weight, starting with the MSB, is converted, the leading one is shifted right and the converted bit is stuffed into ADRES. After a total of nine right shifts of the ‘leading one’ have taken place, the conversion is complete; the ‘leading one’ has been shifted out and the GO/DONE bit is cleared. If the GO/DONE bit is cleared in software during a conversion, the conversion stops and the ADIF bit will not be set to a ‘1’. The data in ADRES is the partial conversion result. This data is valid for the bit weights that have been converted. The position of the ‘leading one’ determines the number of bits that have been converted. The bits that were not converted before the GO/DONE was cleared are unrecoverable. REGISTER 9-1: ADCON0: A/D CONTROL REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 ADCS<1:0>: ADC Conversion Clock Select bits 00 =FOSC/16 01 =FOSC/8 10 =FOSC/4 11 = INTOSC/4 bit 5-2 CHS<3:0>: ADC Channel Select Bits(1) 0000 = Channel 0 (RA0/AN0) 0001 = Channel 1 (RA1/AN1) 0010 = Channel 2 (RA2/AN2) 0011 = Channel 3 (RA4/AN3) 0100 = Channel 4 (RC0/AN4) 0101 = Channel 5 (RC1/AN5) 0110 = Channel 6 (RC2/AN6) 0111 = Channel 7 (RC3/AN7) 1xxx = Reserved 1111 = 0.6V reference from INTOSC bit 1 GO/DONE: ADC Conversion Status Bit(2) 1 = ADC conversion in progress. Setting this bit starts an ADC conversion cycle. This bit is automatically cleared by hardware when the ADC is done converting. 0 = ADC conversion completed/not in progress. Manually clearing this bit while a conversion is in process terminates the current conversion. bit 0 ADON: ADC Enable bit 1 = ADC module is operating 0 = ADC module is shut-off and consumes no power Note 1: CHS<3:0> bits default to 1 after any Reset. 2: If the ADON bit is clear, the GO/DONE bit cannot be set. PIC16F527 DS41652A-page 62 Preliminary  2012 Microchip Technology Inc. EXAMPLE 9-1: PERFORMING AN ANALOG-TO-DIGITAL CONVERSION EXAMPLE 9-2: CHANNEL SELECTION CHANGE DURING CONVERSION REGISTER 9-2: ADRES: A/D CONVERSION RESULTS REGISTER R/W-X R/W-X R/W-X R/W-X R/W-X R/W-X R/W-X R/W-X ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 ADRES<7:0>: ADC Result Register bits ;Sample code operates out of BANK0 MOVLW 0xF1 ;configure A/D MOVWF ADCON0 BSF ADCON0, 1 ;start conversion loop0 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop0 MOVF ADRES, W ;read result MOVWF result0 ;save result BSF ADCON0, 2 ;setup for read of ;channel 1 BSF ADCON0, 1 ;start conversion loop1 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop1 MOVF ADRES, W ;read result MOVWF result1 ;save result BSF ADCON0, 3 ;setup for read of BCF ADCON0, 2 ;channel 2 BSF ADCON0, 1 ;start conversion loop2 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop2 MOVF ADRES, W ;read result MOVWF result2 ;save result MOVLW 0xF1 ;configure A/D MOVWF ADCON0 BSF ADCON0, 1 ;start conversion BSF ADCON0, 2 ;setup for read of ;channel 1 loop0 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop0 MOVF ADRES, W ;read result MOVWF result0 ;save result BSF ADCON0, 1 ;start conversion BSF ADCON0, 3 ;setup for read of BCF ADCON0, 2 ;channel 2 loop1 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop1 MOVF ADRES, W ;read result MOVWF result1 ;save result BSF ADCON0, 1 ;start conversion loop2 BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop2 MOVF ADRES, W ;read result MOVWF result2 ;save result CLRF ADCON0 ;optional: returns ;pins to Digital mode and turns off ;the ADC module  2012 Microchip Technology Inc. Preliminary DS41652A-page 63 PIC16F527 10.0 COMPARATOR(S) This device contains two comparators and a comparator voltage reference. FIGURE 10-1: COMPARATORS BLOCK DIAGRAM + - C1IN+ C1INVREF (0.6V) C1ON C1POL C1T0CS RA2/C1OUT C1OUTEN C1OUT (Register) T0CKI Pin T0CKI Q D S READ CM1CON0 C1WU C1PREF C1NREF + - C2IN+ C2INC2ON C2POL C2PREF1 C2NREF CVREF C2PREF2 RC4/C2OUT C2OUTEN C2OUT (Register) Q D S CWIF READ CM2CON0 C2WU 1 0 1 0 1 0 1 0 1 0 1 0 PIC16F527 DS41652A-page 64 Preliminary  2012 Microchip Technology Inc. 10.1 Comparator Operation A single comparator is shown in Figure 10-2 along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. The shaded area of the output of the comparator in Figure 10-2 represent the uncertainty due to input offsets and response time. See Table 15-2 for Common Mode Voltage. FIGURE 10-2: SINGLE COMPARATOR 10.2 Comparator Reference An internal reference signal may be used depending on the comparator operating mode. The analog signal that is present at VIN- is compared to the signal at VIN+, and the digital output of the comparator is adjusted accordingly (Figure 10-2). Please see Section 11.0 “Comparator Voltage Reference Module” for internal reference specifications. 10.3 Comparator Response Time Response time is the minimum time after selecting a new reference voltage or input source before the comparator output is to have a valid level. If the comparator inputs are changed, a delay must be used to allow the comparator to settle to its new state. Please see Table 15-6 for comparator response time specifications. 10.4 Comparator Output The comparator output is read through the CxOUT bit in the CM1CON0 or CM2CON0 register. This bit is read-only. The comparator output may also be used externally, see Section 10.1 “Comparator Operation”. 10.5 Comparator Wake-up Flag The Comparator Wake-up Flag bit, CWIF, in the INTCON0 register, is set whenever all of the following conditions are met: • C1WU = 0 (CM1CON0<0>) or C2WU = 0 (CM2CON0<0>) • CM1CON0 or CM2CON0 has been read to latch the last known state of the C1OUT and C2OUT bit (MOVF CM1CON0, W) • The output of a comparator has changed state The wake-up flag may be cleared in software or by another device Reset. 10.6 Comparator Operation During Sleep When the comparator is enabled it is active. To minimize power consumption while in Sleep mode, turn off the comparator before entering Sleep. 10.7 Effects of Reset A Power-on Reset (POR) forces the CMxCON0 register to its Reset state. This forces the Comparator input pins to analog Reset mode. Device current is minimized when analog inputs are present at Reset time. 10.8 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 10-3. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. – VIN+ + VINResult Result VINVIN+ Note: Analog levels on any pin that is defined as a digital input may cause the input buffer to consume more current than is specified.  2012 Microchip Technology Inc. Preliminary DS41652A-page 65 PIC16F527 FIGURE 10-3: ANALOG INPUT MODE VA RS < 10 K AIN CPIN 5 pF VDD VT = 0.6V VT = 0.6V RIC ILEAKAGE ±500 nA VSS Legend: CPIN = Input Capacitance VT = Threshold Voltage ILEAKAGE = Leakage Current at the Pin RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage PIC16F527 DS41652A-page 66 Preliminary  2012 Microchip Technology Inc. 10.9 Register Definitions — Comparator Control REGISTER 10-1: CM1CON0: COMPARATOR C1 CONTROL REGISTER R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 C1OUT: Comparator Output bit 1 = VIN+ > VIN- 0 = VIN+ < VINbit 6 C1OUTEN: Comparator Output Enable bit(1), (2) 1 = Output of comparator is NOT placed on the C1OUT pin 0 = Output of comparator is placed in the C1OUT pin bit 5 C1POL: Comparator Output Polarity bit(2) 1 = Output of comparator is not inverted 0 = Output of comparator is inverted bit 4 C1T0CS: Comparator TMR0 Clock Source bit(2) 1 = TMR0 clock source selected by T0CS control bit 0 = Comparator output used as TMR0 clock source bit 3 C1ON: Comparator Enable bit 1 = Comparator is on 0 = Comparator is off bit 2 C1NREF: Comparator Negative Reference Select bit(2) 1 = C1IN- pin 0 = 0.6V VREF bit 1 C1PREF: Comparator Positive Reference Select bit(2) 1 = C1IN+ pin 0 = C1IN- pin bit 0 C1WU: Comparator Wake-up On Change Enable bit(2) 1 = Wake-up On Comparator Change is disabled 0 = Wake-up On Comparator Change is enabled Note 1: Overrides TRIS control of RA2. 2: When comparator is turned on, these control bits assert themselves. Otherwise, the other registers have precedence. 3: The C1WU bit must be set to enable the CWIF function. See the INTCON0 register (Register 8-2) for more information.  2012 Microchip Technology Inc. Preliminary DS41652A-page 67 PIC16F527 REGISTER 10-2: CM2CON0: COMPARATOR C2 CONTROL REGISTER TABLE 10-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 C2OUT: Comparator Output bit 1 = VIN+ > VIN- 0 = VIN+ < VINbit 6 C2OUTEN: Comparator Output Enable bit(1), (2) 1 = Output of comparator is NOT placed on the C2OUT pin 0 = Output of comparator is placed in the C2OUT pin bit 5 C2POL: Comparator Output Polarity bit(2) 1 = Output of comparator not inverted 0 = Output of comparator inverted bit 4 C2PREF2: Comparator Positive Reference Select bit(2) 1 = C1IN+ pin 0 = C2IN- pin bit 3 C2ON: Comparator Enable bit 1 = Comparator is on 0 = Comparator is off bit 2 C2NREF: Comparator Negative Reference Select bit(2) 1 = C2IN- pin 0 = CVREF bit 1 C2PREF1: Comparator Positive Reference Select bit(2) 1 = C2IN+ pin 0 = C2PREF2 controls analog input selection bit 0 C2WU: Comparator Wake-up on Change Enable bit(2) 1 = Wake-up on Comparator change is disabled 0 = Wake-up on Comparator change is enabled. Note 1: Overrides TRIS control of RC4. 2: When comparator is turned on, these control bits assert themselves. Otherwise, the other registers have precedence. 3: The C2WU bit must be set to enable the CWIF function. See the INTCON0 register (Register 8-2) for more information. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page STATUS — — PA0 TO PD Z DC C 19 CM1CON0 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU 66 CM2CON0 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU 67 TRIS I/O Control Register (TRISA, TRISB, TRISC) — Legend: x = Unknown, u = Unchanged, – = Unimplemented, read as ‘0’, q = Depends on condition. PIC16F527 DS41652A-page 68 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 69 PIC16F527 11.0 COMPARATOR VOLTAGE REFERENCE MODULE The Comparator Voltage Reference module also allows the selection of an internally generated voltage reference for one of the C2 comparator inputs. The VRCON register (Register 11-1) controls the voltage reference module shown in Figure 11-1. 11.1 Configuring The Voltage Reference The voltage reference can output 32 voltage levels; 16 in a high range and 16 in a low range. Equation 11-1 determines the output voltages: EQUATION 11-1: 11.2 Voltage Reference Accuracy/Error The full range of VSS to VDD cannot be realized due to construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 11-1) keep CVREF from approaching VSS or VDD. The exception is when the module is disabled by clearing the VREN bit of the VRCON register. When disabled, the reference voltage is VSS when VR<3:0> is ‘0000’ and the VRR bit of the VRCON register is set. This allows the comparator to detect a zero-crossing and not consume the CVREF module current. The voltage reference is VDD derived and, therefore, the CVREF output changes with fluctuations in VDD. The tested absolute accuracy of the comparator voltage reference can be found in Section 15.0 “Electrical Characteristics”. VRR = 1 (low range): VRR = 0 (high range): CVREF = (VDD/4) + (VR<3:0> x VDD/32) CVREF = (VR<3:0>/24) x VDD REGISTER 11-1: VRCON: VOLTAGE REFERENCE CONTROL REGISTER R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 VREN VROE VRR — VR3 VR2 VR1 VR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 VREN: CVREF Enable bit 1 = CVREF is powered on 0 = CVREF is powered down, no current is drawn bit 6 VROE: CVREF Output Enable bit(1) 1 = CVREF output is enabled 0 = CVREF output is disabled bit 5 VRR: CVREF Range Selection bit 1 = Low range 0 = High range bit 4 Unimplemented: Read as ‘0’ bit 3-0 VR<3:0> CVREF Value Selection bits When VRR = 1: CVREF= (VR<3:0>/24)*VDD When VRR = 0: CVREF= VDD/4+(VR<3:0>/32)*VDD Note 1: When this bit is set, the TRIS for the CVREF pin is overridden and the analog voltage is placed on the CVREF pin. PIC16F527 DS41652A-page 70 Preliminary  2012 Microchip Technology Inc. FIGURE 11-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM TABLE 11-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page VRCON VREN VROE VRR — VR3 VR2 VR1 VR0 69 CM1CON0 C1OUT C1OUTEN C1POL C1T0CS C1ON C1NREF C1PREF C1WU 66 CM2CON0 C2OUT C2OUTEN C2POL C2PREF2 C2ON C2NREF C2PREF1 C2WU 67 Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’, q = value depends on condition. VDD 8R R R VREN 16-1 Analog MUX CVREF to Comparator 2 Input VR<3:0> VREN VR<3:0> = 0000 VRR 8R VRR R R 16 Stages RA1/CVREF VROE  2012 Microchip Technology Inc. Preliminary DS41652A-page 71 PIC16F527 12.0 OPERATIONAL AMPLIFIER (OPA) MODULE The OPA module has the following features: • Two independent Operational Amplifiers • External connections to all ports • 3 MHz Gain Bandwidth Product (GBWP) 12.1 OPACON Register The OPA module is enabled by setting the OPAxON bit of the OPACON Register. When enabled, OPAxON forces the output driver of OP1 for OPA1, and OP2 for OPA2, into tri-state to prevent contention between the driver and the OPA output. FIGURE 12-1: OPA MODULE BLOCK DIAGRAM Note: When OPA1 or OPA2 is enabled, the OP1 pin or OP2 pin, respectively, is driven by the op amp output, not by the PORTC driver. Refer to Table 15-4 for the electrical specifications for the op amp output drive capability. OPA1 OPACON To ADC and Comparator MUXs OP1+ OP1- OP1 OPA2 OPACON OP2+ OP2- OP2 PIC16F527 DS41652A-page 72 Preliminary  2012 Microchip Technology Inc. REGISTER 12-1: OPACON: OP AMP CONTROL REGISTER 12.2 Effects of a Reset A device Reset forces all registers to their Reset state. This disables both op amps. 12.3 OPA Module Performance Common AC and DC performance specifications for the OPA module: • Common Mode Voltage Range • Leakage Current • Input Offset Voltage • Open Loop Gain • Gain Bandwidth Product (GBWP) Common mode voltage range is the specified voltage range for the OPA+ and OPA- inputs, for which the OPA module will perform to within its specifications. The OPA module is designed to operate with input voltages between 0 and VDD-1.5V. Behavior for common mode voltages greater than VDD-1.5V, or below 0V, are beyond the normal operating range. Leakage current is a measure of the small source or sink currents on the OPA+ and OPA- inputs. To minimize the effect of leakage currents, the effective impedances connected to the OPA+ and OPA- inputs should be kept as small as possible and equal. Input offset voltage is a measure of the voltage difference between the OPA+ and OPA- inputs in a closed loop circuit with the OPA in its linear region. The offset voltage will appear as a DC offset in the output equal to the input offset voltage, multiplied by the gain of the circuit. The input offset voltage is also affected by the common mode voltage. Open loop gain is the ratio of the output voltage to the differential input voltage, (OPA+) - (OPA-). The gain is greatest at DC and falls off with frequency. Gain Bandwidth Product or GBWP is the frequency at which the open loop gain falls off to 0 dB. 12.4 Effects of Sleep When enabled, the op amps continue to operate and consume current while the processor is in Sleep mode. TABLE 12-1: REGISTERS ASSOCIATED WITH THE OPA MODULE U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 — — — — — — OPA2ON OPA1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as ‘0’ bit 1 OPA2ON: Op Amp Enable bit 1 = Op amp 2 is enabled 0 = Op amp 2 is disabled bit 0 OPA1ON: Op Amp Enable bit 1 = Op amp 1 is enabled 0 = Op amp 1 is disabled Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 32 OPACON — — — — — — OPA2ON OPA1ON 72 TRIS I/O Control Registers (TRISA, TRISB, TRISC) — Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used for the OPA module.  2012 Microchip Technology Inc. Preliminary DS41652A-page 73 PIC16F527 13.0 INSTRUCTION SET SUMMARY The PIC16 instruction set is highly orthogonal and is comprised of three basic categories. • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 12-bit word divided into an opcode, which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 13-1, while the various opcode fields are summarized in Table 13-1. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator which selects the number of the bit affected by the operation, while ‘f’ represents the number of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8 or 9-bit constant or literal value. TABLE 13-1: OPCODE FIELD DESCRIPTIONS All instructions are executed within a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Figure 13-1 shows the three general formats that the instructions can have. All examples in the figure use the following format to represent a hexadecimal number: 0xhhh where ‘h’ signifies a hexadecimal digit. FIGURE 13-1: GENERAL FORMAT FOR INSTRUCTIONS Field Description f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0 (store result in W) d = 1 (store result in file register ‘f’) Default is d = 1 label Label name TOS Top-of-Stack PC Program Counter WDT Watchdog Timer counter TO Time-out bit PD Power-down bit dest Destination, either the W register or the specified register file location [ ] Options ( ) Contents Æ Assigned to < > Register bit field Œ In the set of italics User defined term (font is courier) Byte-oriented file register operations 11 6 5 4 0 d = 0 for destination W OPCODE d f (FILE #) d = 1 for destination f f = 5-bit file register address Bit-oriented file register operations 11 8 7 5 4 0 OPCODE b (BIT #) f (FILE #) b = 3-bit bit address f = 5-bit file register address Literal and control operations (except GOTO) 11 8 7 0 OPCODE k (literal) k = 8-bit immediate value Literal and control operations – GOTO instruction 11 9 8 0 OPCODE k (literal) k = 9-bit immediate value PIC16F527 DS41652A-page 74 Preliminary  2012 Microchip Technology Inc. TABLE 13-2: INSTRUCTION SET SUMMARY Mnemonic, Operands Description Cycles 12-Bit Opcode Status Affected Notes MSb LSb ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f — f, d f, d f, d f, d f, d f, d f, d f — f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate left f through Carry Rotate right f through Carry Subtract W from f Swap f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 0001 0001 0000 0000 0010 0000 0010 0010 0011 0001 0010 0000 0000 0011 0011 0000 0011 0001 11df 01df 011f 0100 01df 11df 11df 10df 11df 00df 00df 001f 0000 01df 00df 10df 10df 10df ffff ffff ffff 0000 ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff C, DC, Z Z Z Z Z Z None Z None Z Z None None C C C, DC, Z None Z 1, 2, 4 2, 4 4 2, 4 2, 4 2, 4 2, 4 2, 4 2, 4 1, 4 2, 4 2, 4 1, 2, 4 2, 4 2, 4 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1(2) 1(2) 0100 0101 0110 0111 bbbf bbbf bbbf bbbf ffff ffff ffff ffff None None None None 2, 4 2, 4 LITERAL AND CONTROL OPERATIONS ANDLW CALL CLRWDT GOTO IORLW MOVLB MOVLW OPTION RETFIE RETLW RETURN SLEEP TRIS XORLW k k — k k k k — — k — — f k AND literal with W Call Subroutine Clear Watchdog Timer Unconditional branch Inclusive OR literal with W Move Literal to BSR Register Move literal to W Load OPTION register Return from Interrupt Return, place literal in W Return, maintain W Go into Standby mode Load TRIS register Exclusive OR literal to W 1 2 1 2 1 1 1 1 2 2 2 1 1 1 1110 1001 0000 101k 1101 0000 1100 0000 0000 1000 0000 0000 0000 1111 kkkk kkkk 0000 kkkk kkkk 0001 kkkk 0000 0001 kkkk 0001 0000 0000 kkkk kkkk kkkk 0100 kkkk kkkk 0kkk kkkk 0010 1111 kkkk 1110 0011 0fff kkkk Z None TO, PD None Z None None None None None None TO, PD None Z 1 3 Note 1: The 9th bit of the program counter will be forced to a ‘0’ by any instruction that writes to the PC except for GOTO. See Section 4.6 “Program Counter”. 2: When an I/O register is modified as a function of itself (e.g. MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 3: The instruction TRIS f, where f = 6, causes the contents of the W register to be written to the tri-state latches of PORTA. A ‘1’ forces the pin to a high-impedance state and disables the output buffers. 4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0).  2012 Microchip Technology Inc. Preliminary DS41652A-page 75 PIC16F527 ADDWF Add W and f Syntax: [ label ] ADDWF f,d Operands: 0  f  31 d 01 Operation: (W) + (f)  (dest) Status Affected: C, DC, Z Description: Add the contents of the W register and register ‘f’. If ‘d’ is’0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ANDLW AND literal with W Syntax: [ label ] ANDLW k Operands: 0  k  255 Operation: (W).AND. (k)  (W) Status Affected: Z Description: The contents of the W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. ANDWF AND W with f Syntax: [ label ] ANDWF f,d Operands: 0  f  31 d [0,1] Operation: (W) .AND. (f)  (dest) Status Affected: Z Description: The contents of the W register are AND’ed with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. BCF Bit Clear f Syntax: [ label ] BCF f,b Operands: 0  f  31 0  b  7 Operation: 0  (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [ label ] BSF f,b Operands: 0  f  31 0  b  7 Operation: 1  (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. BTFSC Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0  f  31 0  b  7 Operation: skip if (f) = 0 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next instruction is skipped. If bit ‘b’ is ‘0’, then the next instruction fetched during the current instruction execution is discarded, and a NOP is executed instead, making this a two-cycle instruction. PIC16F527 DS41652A-page 76 Preliminary  2012 Microchip Technology Inc. BTFSS Bit Test f, Skip if Set Syntax: [ label ] BTFSS f,b Operands: 0  f  31 0  b < 7 Operation: skip if (f) = 1 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next instruction is skipped. If bit ‘b’ is ‘1’, then the next instruction fetched during the current instruction execution, is discarded and a NOP is executed instead, making this a two-cycle instruction. CALL Subroutine Call Syntax: [ label ] CALL k Operands: 0  k  255 Operation: (PC) + 1 Top-of-Stack; k  PC<7:0>; (STATUS<6:5>)  PC<10:9>; 0  PC<8> Status Affected: None Description: Subroutine call. First, return address (PC + 1) is PUSHed onto the stack. The eight-bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is a two-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF f Operands: 0  f  31 Operation: 00h  (f); 1  Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h  (W); 1  Z Status Affected: Z Description: The W register is cleared. Zero bit (Z) is set. CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h  WDT; 0  WDT prescaler (if assigned); 1  TO; 1  PD Status Affected: TO, PD Description: The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set. COMF Complement f Syntax: [ label ] COMF f,d Operands: 0  f  31 d  [0,1] Operation: (f)  (dest) Status Affected: Z Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’.  2012 Microchip Technology Inc. Preliminary DS41652A-page 77 PIC16F527 DECF Decrement f Syntax: [ label ] DECF f,d Operands: 0  f  31 d  [0,1] Operation: (f) – 1  (dest) Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECFSZ Decrement f, Skip if 0 Syntax: [ label ] DECFSZ f,d Operands: 0  f  31 d  [0,1] Operation: (f) – 1  d; skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a two-cycle instruction. GOTO Unconditional Branch Syntax: [ label ] GOTO k Operands: 0  k  511 Operation: k  PC<8:0>; STATUS<6:5>  PC<10:9> Status Affected: None Description: GOTO is an unconditional branch. The 9-bit immediate value is loaded into PC bits <8:0>. The upper bits of PC are loaded from STATUS<6:5>. GOTO is a twocycle instruction. INCF Increment f Syntax: [ label ] INCF f,d Operands: 0  f  31 d  [0,1] Operation: (f) + 1  (dest) Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. INCFSZ Increment f, Skip if 0 Syntax: [ label ] INCFSZ f,d Operands: 0  f  31 d  [0,1] Operation: (f) + 1  (dest), skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, then the next instruction, which is already fetched, is discarded and a NOP is executed instead making it a two-cycle instruction. IORLW Inclusive OR literal with W Syntax: [ label ] IORLW k Operands: 0  k  255 Operation: (W) .OR. (k)  (W) Status Affected: Z Description: The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. PIC16F527 DS41652A-page 78 Preliminary  2012 Microchip Technology Inc. IORWF Inclusive OR W with f Syntax: [ label ] IORWF f,d Operands: 0  f  31 d  [0,1] Operation: (W).OR. (f)  (dest) Status Affected: Z Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. MOVF Move f Syntax: [ label ] MOVF f,d Operands: 0  f  31 d  [0,1] Operation: (f)  (dest) Status Affected: Z Description: The contents of register ‘f’ are moved to destination ‘d’. If ‘d’ is ‘0’, destination is the W register. If ‘d’ is ‘1’, the destination is file register ‘f’. ‘d’ = 1 is useful as a test of a file register, since status flag Z is affected. MOVLB Move Literal to BSR Syntax: [ label ] MOVLB k Operands: 0  k  7 Operation: k  (BSR) Status Affected: None Description: The three-bit literal ‘k’ is loaded into the BSR register. MOVLW Move Literal to W Syntax: [ label ] MOVLW k Operands: 0  k  255 Operation: k  (W) Status Affected: None Description: The eight-bit literal ‘k’ is loaded into the W register. The “don’t cares” will assembled as ‘0’s. MOVWF Move W to f Syntax: [ label ] MOVWF f Operands: 0  f  31 Operation: (W)  (f) Status Affected: None Description: Move data from the W register to register ‘f’. NOP No Operation Syntax: [ label ] NOP Operands: None Operation: No operation Status Affected: None Description: No operation. OPTION Load OPTION Register Syntax: [ label ] OPTION Operands: None Operation: (W)  OPTION Status Affected: None Description: The content of the W register is loaded into the OPTION register. RETFIE Return From Interrupt Syntax: [ label ] RETFIE Operands: None Operation: TOS  PC 1 GIE Status Affected: None Description: The program counter is loaded from the top of the stack (the return address). GIE bit of INTCON0 is set. This is a two-cycle instruction.  2012 Microchip Technology Inc. Preliminary DS41652A-page 79 PIC16F527 RETLW Return with Literal in W Syntax: [ label ] RETLW k Operands: 0  k  255 Operation: k  (W); TOS  PC Status Affected: None Description: The W register is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. RETURN Return Syntax: [ label ] RETURN Operands: None Operation: TOS  PC Status Affected: None Description: The program counter is loaded from the top of the stack (the return address). This is a twocycle instruction. RLF Rotate Left f through Carry Syntax: [ label ] RLF f,d Operands: 0  f  31 d  [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C register ‘f’ RRF Rotate Right f through Carry Syntax: [ label ] RRF f,d Operands: 0  f  31 d  [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. SLEEP Enter SLEEP Mode Syntax: [label ] SLEEP Operands: None Operation: 00h  WDT; 0  WDT prescaler; 1  TO; 0  PD Status Affected: TO, PD, RBWUF Description: Time-out Status bit (TO) is set. The Power-down Status bit (PD) is cleared. RBWUF is unaffected. The WDT and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. See Section 8.10 “Power-down Mode (Sleep)” on Sleep for more details. SUBWF Subtract W from f Syntax: [label ] SUBWF f,d Operands: 0 f 31 d  [0,1] Operation: (f) – (W) dest) Status Affected: C, DC, Z Description: Subtract (2’s complement method) the W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C register ‘f’ PIC16F527 DS41652A-page 80 Preliminary  2012 Microchip Technology Inc. SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0  f  31 d  [0,1] Operation: (f<3:0>)  (dest<7:4>); (f<7:4>)  (dest<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. TRIS Load TRIS Register Syntax: [ label ] TRIS f Operands: f = 6 Operation: (W)  TRIS register f Status Affected: None Description: TRIS register ‘f’ (f = 6, 7 or 8) is loaded with the contents of the W register XORLW Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. XORWF Exclusive OR W with f Syntax: [ label ] XORWF f,d Operands: 0  f  31 d  [0,1] Operation: (W) .XOR. (f) dest) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’.  2012 Microchip Technology Inc. Preliminary DS41652A-page 81 PIC16F527 14.0 DEVELOPMENT SUPPORT The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C® for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 14.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. PIC16F527 DS41652A-page 82 Preliminary  2012 Microchip Technology Inc. 14.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 14.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 14.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 14.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 14.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire device instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility  2012 Microchip Technology Inc. Preliminary DS41652A-page 83 PIC16F527 14.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 14.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 14.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 14.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. PIC16F527 DS41652A-page 84 Preliminary  2012 Microchip Technology Inc. 14.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 14.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. 14.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.  2012 Microchip Technology Inc. Preliminary DS41652A-page 85 PIC16F527 15.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Ambient temperature under bias..........................................................................................................-40°C to +125°C Storage temperature ............................................................................................................................-65°C to +150°C Voltage on VDD with respect to VSS ...............................................................................................................0 to +6.5V Voltage on MCLR with respect to VSS..........................................................................................................0 to +13.5V Voltage on all other pins with respect to VSS ............................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ..................................................................................................................................700 mW Max. current out of VSS pin ................................................................................................................................200 mA Max. current into VDD pin...................................................................................................................................150 mA Input clamp current, IIK (VI < 0 or VI > VDD)20 mA Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA Max. output current sunk by any I/O pin ..............................................................................................................25 mA Max. output current sourced by any I/O pin .........................................................................................................25 mA Max. output current sourced by I/O port ..............................................................................................................75 mA Max. output current sunk by I/O port ...................................................................................................................75 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOL x IOL) †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIC16F527 DS41652A-page 86 Preliminary  2012 Microchip Technology Inc. FIGURE 15-1: PIC16F527 VOLTAGE-FREQUENCY GRAPH, -40C  TA  +125C FIGURE 15-2: MAXIMUM OSCILLATOR FREQUENCY TABLE 6.0 2.5 4.0 3.0 0 3.5 4.5 5.0 5.5 4 10 Frequency (MHz) VDD 20 (Volts) 25 2.0 8 0 200 kHz 4 MHz 20 MHz Frequency HS INTOSC XT LP Oscillator Mode EC XTRC 8 MHz  2012 Microchip Technology Inc. Preliminary DS41652A-page 87 PIC16F527 15.1 DC Characteristics: PIC16F527 (Industrial) DC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +85C (industrial) Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions D001 VDD Supply Voltage 2.0 — 5.5 V See Figure 15-1 D002 VDR RAM Data Retention Voltage(2) — 1.5* — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset — Vss — V See Section 8.5 “Power-on Reset (POR)” for details D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.05* — — V/ms See Section 8.5 “Power-on Reset (POR)” for details D005 IDDP Supply Current During Prog/Erase — 250* — A D010 IDD Supply Current(3, 4, 6) — — 175 400 — — A A FOSC = 4 MHz, VDD = 2.0V FOSC = 4 MHz, VDD = 5.0V — — 250 0.75 — — A mA FOSC = 8 MHz, VDD = 2.0V FOSC = 8 MHz, VDD = 5.0V — 1.4 — mA FOSC = 20 MHz, VDD = 5.0V — — 11 38 — — A A FOSC = 32 kHz, VDD = 2.0V FOSC = 32 kHz, VDD = 5.0V D020 IPD Power-down Current(5) — — 0.1 0.35 — — A A VDD = 2.0V VDD = 5.0V D022 IWDT WDT Current(5) — — 1.0 7.0 — — A A VDD = 2.0V VDD = 5.0V D023 ICMP Comparator Current(5) — — 15 60 — — A A VDD = 2.0V (per comparator) VDD = 5.0V (per comparator) D022 ICVREF CVREF Current(5) — — 30 75 — — A A VDD = 2.0V (high range) VDD = 5.0V (high range) D023 IFVR Internal 0.6V Fixed Voltage Reference Current(5) — — 100 175 — — A A VDD = 2.0V (reference and 1 comparator enabled) VDD = 5.0V (reference and 1 comparator enabled) D024 IAD1* A/D Conversion Current — 120 — A 2.0V, conversion in progress — 200 — A 5.0V, conversion in progress D025 IAD2 A/D Conversion Current — 0.20 — A 2.0V, no conversion in progress — 0.36 — A 5.0V, no conversion in progress D026 IBOR BOR Current — 5 — A 3.0V — 6— A 5.0V * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. 4: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. 5: For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep. 6: For EXTRC mode, does not include current through REXT. The current through the resistor can be estimated by the formula: I = VDD/2REXT (mA) with REXT in k. PIC16F527 DS41652A-page 88 Preliminary  2012 Microchip Technology Inc. 15.2 DC Characteristics: PIC16F527 (Extended) DC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +125C (extended) Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions D001 VDD Supply Voltage 2.0 — 5.5 V See Figure 15-1 D002 VDR RAM Data Retention Voltage(2) — 1.5* — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure Power-on Reset — Vss — V See Section 8.5 “Power-on Reset (POR)” for details D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.05* — — V/ms See Section 8.5 “Power-on Reset (POR)” for details D005 IDDP Supply Current During Prog/Erase — 250* — A D010 IDD Supply Current(3,4,6) — — 175 400 — — A A FOSC = 4 MHz, VDD = 2.0V FOSC = 4 MHz, VDD = 5.0V — — 250 0.75 — — A mA FOSC = 8 MHz, VDD = 2.0V FOSC = 8 MHz, VDD = 5.0V — 1.4 — mA FOSC = 20 MHz, VDD = 5.0V — — 11 38 — — A A FOSC = 32 kHz, VDD = 2.0V FOSC = 32 kHz, VDD = 5.0V D020 IPD Power-down Current(5) — — 0.1 0.35 — — A A VDD = 2.0V VDD = 5.0V D022 IWDT WDT Current(5) — — 1.0 7.0 — — A A VDD = 2.0V VDD = 5.0V D023 ICMP Comparator Current(5) — — 15 60 — — A A VDD = 2.0V (per comparator) VDD = 5.0V (per comparator) D022 ICVREF CVREF Current(5) — — 30 75 — — A A VDD = 2.0V (high range) VDD = 5.0V (high range) D023 IFVR Internal 0.6V Fixed Voltage Reference Current(5) — — 100 175 — — A A VDD = 2.0V (reference and 1 comparator enabled) VDD = 5.0V (reference and 1 comparator enabled) D024 IAD1* A/D Conversion Current — 120 — A 2.0V, conversion in progress — 200 — A 5.0V, conversion in progress D025 IAD2 A/D Conversion Current — 0.20 — A 2.0V, no conversion in progress — 0.36 — A 5.0V, no conversion in progress D026 IBOR BOR Current — 5 — A 3.0V —6— A 5.0V * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. 4: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. 5: For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep. 6: For EXTRC mode, does not include current through REXT. The current through the resistor can be estimated by the formula: I = VDD/2REXT (mA) with REXT in k.  2012 Microchip Technology Inc. Preliminary DS41652A-page 89 PIC16F527 TABLE 15-1: DC CHARACTERISTICS: PIC16F527 (Industrial, Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating temperature -40°C  TA  +85°C (industrial) -40°C  TA  +125°C (extended) Operating voltage VDD range as described in DC spec. Param No. Sym. Characteristic Min. Typ.† Max. Units Conditions VIL Input Low Voltage I/O ports D030 with TTL buffer Vss — 0.8 V For all 4.5  VDD 5.5V D030A Vss — 0.15 VDD V Otherwise D031 with Schmitt Trigger buffer Vss — 0.15 VDD V D032 MCLR, T0CKI Vss — 0.15 VDD V D033 OSC1 (EXTRC mode), EC(1) Vss — 0.15 VDD V D033 OSC1 (HS mode) Vss — 0.3 VDD V D033 OSC1 (XT and LP modes) Vss — 0.3 V VIH Input High Voltage I/O ports — D040 with TTL buffer 2.0 — VDD V 4.5  VDD 5.5V D040A 0.25 VDD + 0.8V — VDD V Otherwise D041 with Schmitt Trigger buffer 0.85 VDD — VDD V For entire VDD range D042 MCLR, T0CKI 0.85 VDD — VDD V D042A OSC1 (EXTRC mode), EC(1) 0.85 VDD — VDD V D042A OSC1 (HS mode) 0.7 VDD — VDD V D043 OSC1 (XT and LP modes) 1.6 — VDD V D070 IPUR PORTB Weak pull-up current(4) 50 250 400 A VDD = 5V, VPIN = VSS IIL Input Leakage Current(2,5) D060 I/O ports — — ±1 A Vss VPIN VDD, Pin at high-impedance D061 RB3/MCLR(3) — ±0.7 ±5 A Vss VPIN VDD D063 OSC1 — — ±5 A Vss VPIN VDD, XT, HS and LP osc configuration VOL Output Low Voltage D080 I/O ports/CLKOUT — — 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40C to +85C D080A — — 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C VOH Output High Voltage D090 I/O ports/CLKOUT VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C D090A VDD – 0.7 — — V IOH = -2.5 mA, VDD = 4.5V, -40C to +125C Capacitive Loading Specs on Output Pins D100 COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1. D101 CIO All I/O pins and OSC2 — — 50 pF Flash Data Memory D120 ED Byte endurance 100K 1M — E/W -40C  TA  +85C D120A ED Byte endurance 10K 100K — E/W +85C  TA  +125C D121 VDRW VDD for read/write VMIN — 5.5 V † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16F527 be driven with external clock in RC mode. 2: Negative current is defined as coming out of the pin. 3: This spec. applies to RB3/MCLR configured as RB3 with pull-up disabled. 4: This spec. applies to all weak pull-up devices, including the weak pull-up found on RB3/MCLR. The current value listed will be the same whether or not the pin is configured as RB3 with pull-up enabled or as MCLR. 5: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage may be measured at different input voltages. PIC16F527 DS41652A-page 90 Preliminary  2012 Microchip Technology Inc. TABLE 15-2: COMPARATOR SPECIFICATIONS TABLE 15-3: COMPARATOR VOLTAGE REFERENCE (VREF) SPECIFICATIONS Comparator Specifications Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C to 125°C Characteristics Sym. Min. Typ. Max. Units Comments Internal Voltage Reference VIVRF 0.50 0.60 0.70 V Input offset voltage VOS —  5.0 — mV Input common mode voltage* VCM 0 —VDD – 1.5 V CMRR* CMRR 55 — — db Response Time(1)* TRT — 150 — ns Comparator Mode Change to Output Valid* TMC2COV — — 10 s * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD – 1.5)/2 while the other input transitions from VSS to VDD – 1.5V. Sym. Characteristics Min. Typ. Max. Units Comments CVRES Resolution — — VDD/24* VDD/32 — — LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Absolute Accuracy(2) — — — — ±1/2* ±1/2* LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Unit Resistor Value (R) — — 2K* —  Settling Time(1) — — 10* s * These parameters are characterized but not tested. Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from 0000 to 1111. 2: Do not use reference externally when VDD < 2.7V. Under this condition, reference should only be used with comparator Voltage Common mode observed.  2012 Microchip Technology Inc. Preliminary DS41652A-page 91 PIC16F527 TABLE 15-4: OPERATIONAL AMPLIFIER (OPA) MODULE DC SPECIFICATIONS TABLE 15-5: OPERATIONAL AMPLIFIER (OPA) MODULE AC SPECIFICATIONS OPA DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) VCM = 0V, VOUT = VDD/2, VDD = 5.0V, VSS = 0V, CL = 50 pF, RL = 100k Operating temperature -40°C  TA  +125°C Param No. Sym. Characteristics Min. Typ. Max. Units Comments OPA01 VOS Input Offset Voltage — 5 — mV OPA02* OPA03* IB IOS Input current and impedance Input bias current Input offset bias current — — 2* 1* — — nA pA OPA04* OPA05* VCM CMR Common Mode Common mode input range Common mode rejection VSS 65 — 70 VDD – 1.5 — V dB VDD = 5.0V VCM = VDD/2, Freq. = DC OPA06A* OPA06B* AOL AOL Open Loop Gain DC Open loop gain DC Open loop gain — — 90 60 — — dB dB No load Standard load OPA07* OPA08* Vout Isc Output Output voltage swing Output short circuit current VSS+100 — — 25 VDD – 100 28 mV mA To VDD/2 (20 k connected to VDD, 20 k + 20 pF to Vss) OPA10* PSR Power Supply Power supply rejection 80 — — dB * These parameters are characterized but not tested. OPA AC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) VCM = 0V, VOUT = VDD/2, VDD = 5.0V, VSS = 0V, CL = 50 pF, RL = 100k Operating temperature -40°C  TA  +125°C Param No. Symbol Characteristics Min. Typ. Max. Units Comments OPA11* GBWP Gain bandwidth product — 3 — MHz OPA12* TON Turn on time — 10 15 s OPA13* M Phase margin — 60 — deg OPA14* SR Slew rate 2 — — V/s * These parameters are characterized but not tested. PIC16F527 DS41652A-page 92 Preliminary  2012 Microchip Technology Inc. TABLE 15-6: A/D CONVERTER CHARACTERISTICS TABLE 15-7: PULL-UP RESISTOR RANGES A/D Converter Specifications Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param No. Sym. Characteristic Min. Typ.† Max. Units Conditions A01 NR Resolution — — 8 bit A03 EINL Integral Error — — 1.5 LSb VDD = 5.0V A04 EDNL Differential Error — — -1< EDNL 1.7 LSb No missing codes to eight bits VDD = 5.0V A06 EOFF Offset Error — — 1.5 LSb VDD = 5.0V A07 EGN Gain Error -0.7 — +2.2 LSb VDD = 5.0V A10 — Monotonicity — guaranteed(1) — —VSS  VAIN  VDD A25 VAIN Analog Input Voltage VSS — VDD V A30 ZAIN Recommended Impedance of Analog Voltage Source — — 10 K * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. VDD (Volts) Temperature (C) Min. Typ. Max. Units RA0/RA1/RA4 2.0 -40 73K 105K 186K  25 73K 113K 187K  85 82K 123K 190K  125 86K 132k 190K  5.5 -40 15K 21K 33K  25 15K 22K 34K  85 19K 26k 35K  125 23K 29K 35K  RA3 2.0 -40 63K 81K 96K  25 77K 93K 116K  85 82K 96k 116K  125 86K 100K 119K  5.5 -40 16K 20k 22K  25 16K 21K 23K  85 24K 25k 28K  125 26K 27K 29K   2012 Microchip Technology Inc. Preliminary DS41652A-page 93 PIC16F527 15.3 Timing Parameter Symbology and Load Conditions The timing parameter symbols have been created following one of the following formats: FIGURE 15-3: LOAD CONDITIONS FIGURE 15-4: EXTERNAL CLOCK TIMING 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase subscripts (pp) and their meanings: pp 2 to mc MCLR ck CLKOUT osc Oscillator cy Cycle time os OSC1 drt Device Reset Timer t0 T0CKI io I/O port wdt Watchdog Timer Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (high-impedance) V Valid L Low Z High-impedance CL VSS Pin Legend: CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1 OSC1 Q4 Q1 Q2 Q3 Q4 Q1 1 33 4 4 2 PIC16F527 DS41652A-page 94 Preliminary  2012 Microchip Technology Inc. TABLE 15-8: EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +85C (industrial), -40C  TA  +125C (extended) Operating Voltage VDD range is described in Section 15.1 “DC Characteristics: PIC16F527 (Industrial)” Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions 1A FOSC External CLKIN Frequency(2) DC — 4 MHz XT Oscillator mode DC — 20 MHz HS/EC Oscillator mode DC — 200 kHz LP Oscillator mode Oscillator Frequency(2) — — 4 MHz EXTRC Oscillator mode 0.1 — 4 MHz XT Oscillator mode 4 — 20 MHz HS/EC Oscillator mode — — 200 kHz LP Oscillator mode 1 TOSC External CLKIN Period(2) 250 — — ns XT Oscillator mode 50 — — ns HS/EC Oscillator mode 5— — s LP Oscillator mode Oscillator Period(2) 250 — — ns EXTRC Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 250 ns HS/EC Oscillator mode 5— — s LP Oscillator mode 2 TCY Instruction Cycle Time 200 4/FOSC — ns 3 TosL, TosH Clock in (OSC1) Low or High Time 50* — — ns XT Oscillator 2* — — s LP Oscillator 10* — — ns HS/EC Oscillator 4 TosR, TosF Clock in (OSC1) Rise or Fall Time — — 25* ns XT Oscillator — — 50* ns LP Oscillator — — 15* ns HS/EC Oscillator * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.  2012 Microchip Technology Inc. Preliminary DS41652A-page 95 PIC16F527 TABLE 15-9: CALIBRATED INTERNAL RC FREQUENCIES FIGURE 15-5: I/O TIMING AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +85C (industrial), -40C  TA  +125C (extended) Operating Voltage VDD range is described in Section 15.1 “DC Characteristics: PIC16F527 (Industrial)” Param No. Sym. Characteristic Freq. Tolerance Min. Typ.† Max. Units Conditions F10 FOSC Internal Calibrated INTOSC Frequency(1) 1% 7.92 8.00 8.08 MHz 3.5V, +25C 2% 7.84 8.00 8.16 MHz 2.5V VDD  5.5V 0C  TA  +85C 5% 7.60 8.00 8.40 MHz 2.0V VDD  5.5V -40C  TA  +85C (Ind.) -40C  TA  +125C (Ext.) * These parameters are characterized but not tested. † Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 uF and 0.01 uF values in parallel are recommended. OSC1 I/O Pin (input) I/O Pin (output) Q4 Q1 Q2 Q3 17 20, 21 18 Old Value New Value 19 Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT. PIC16F527 DS41652A-page 96 Preliminary  2012 Microchip Technology Inc. TABLE 15-10: TIMING REQUIREMENTS FIGURE 15-6: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER TIMING AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +85C (industrial) -40C  TA  +125C (extended) Operating Voltage VDD range is described in Section 15.1 “DC Characteristics: PIC16F527 (Industrial)” Param No. Sym. Characteristic Min. Typ.(1) Max. Units 17 TOSH2IOV OSC1 (Q1 cycle) to Port Out Valid(2), (3) — — 100* ns 18 TOSH2IOI OSC1 (Q2 cycle) to Port Input Invalid (I/O in hold time)(2) 50 — — ns 19 TIOV2OSH Port Input Valid to OSC1 (I/O in setup time) 20 — — ns 20 TIOR Port Output Rise Time(3) — 10 50** ns 21 TIOF Port Output Fall Time(3) — 10 58** ns * These parameters are characterized but not tested. ** These parameters are design targets and are not tested. Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in EXTRC mode. 3: See Figure 15-3 for loading conditions. VDD MCLR Internal POR DRT Time-out(2) Internal Reset Watchdog Timer Reset 32 31 34 I/O pin(1) 32 32 34 30 Note 1: I/O pins must be taken out of High-Impedance mode by enabling the output drivers in software. 2: Runs in MCLR or WDT Reset only in XT, LP and HS modes.  2012 Microchip Technology Inc. Preliminary DS41652A-page 97 PIC16F527 TABLE 15-11: RESET, WATCHDOG TIMER AND DEVICE RESET TIMER FIGURE 15-7: TIMER0 CLOCK TIMINGS TABLE 15-12: TIMER0 CLOCK REQUIREMENT AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +85C (industrial) -40C  TA  +125C (extended) Operating Voltage VDD range is described in Section 15.1 “DC Characteristics: PIC16F527 (Industrial)” Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions 30 TMCL MCLR Pulse Width (low) 2000* — — ns VDD = 5.0V 31 TWDT Watchdog Timer Time-out Period (no prescaler) 9* 9* 18* 18* 30* 40* ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 32 TDRT Device Reset Timer Period Standard 9* 9* 18* 18* 30* 40* ms ms VDD = 5.0V (Industrial) VDD = 5.0V (Extended) 34 TIOZ I/O High-impedance from MCLR low — — 2000* ns * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +85C (industrial) -40C  TA  +125C (extended) Operating Voltage VDD range is described in Section 15.1 “DC Characteristics: PIC16F527 (Industrial)” Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions 40 Tt0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20* — — ns With Prescaler 10* — — ns 41 Tt0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20* — — ns With Prescaler 10* — — ns 42 Tt0P T0CKI Period 20 or TCY + 40* N — — ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256) * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. T0CKI 40 41 42 PIC16F527 DS41652A-page 98 Preliminary  2012 Microchip Technology Inc. TABLE 15-13: FLASH DATA MEMORY WRITE/ERASE TIME AC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature -40C  TA  +85C (industrial) -40C  TA  +125C (extended) Operating Voltage VDD range is described in Section 15.1 “DC Characteristics: PIC16F527 (Industrial)” Param No. Sym. Characteristic Min. Typ.(1) Max. Units Conditions 43 TDW Flash Data Memory Write Cycle Time 2 3.5 5 ms 44 TDE Flash Data Memory Erase Cycle Time 2 3.5 5 ms * These parameters are characterized but not tested. Note 1: Data in the Typical (“Typ”) column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.  2012 Microchip Technology Inc. Preliminary DS41652A-page 99 PIC16F527 16.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS Graphs and tables are not available at this time. PIC16F527 DS41652A-page 100 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 101 PIC16F527 17.0 PACKAGING INFORMATION 17.1 Package Marking Information * Standard PICmicro® device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 20-Lead PDIP (300 mil) Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN PIC16F527 1220123 -E/P e3 20-Lead SOIC (7.50 mm) Example -E/SO e3 1220123 PIC16F527 PIC16F527 DS41652A-page 102 Preliminary  2012 Microchip Technology Inc. Package Marking Information (Continued) * Standard PICmicro® device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 20-Lead QFN (4x4x0.9 mm) Example PIN 1 PIN 1 PIC16 E/ML 220123 20-Lead SSOP (5.30 mm) Example PIC16F527 1220123 -E/SS e3 F527 e3  2012 Microchip Technology Inc. Preliminary DS41652A-page 103 PIC16F527                   !" #$% &"'  ()"&'"!&) &#*&& &#    + % &,  &!& - '!! #.#&"#'#% ! &"!!#% ! &"!!! &$#/ !#  '!  #&   .0 1,2 1 !'!& $ & "!**&"&& !  3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4  6&! 7,8. '!9'&! 7 7: ; 7"')%! 7  & 1,  & &    < <  ## 4 4!!   -  1 !& &     < < "#&"#=#& . - - - ## 4 =#& .   > :  9 & > - ?  & &   9  -  9 #4!!  >   6 9 #=#& )  ?  9*9 #=#& )  >  :  *  + 1 < < - N NOTE 1 E1 D 123 A A1 A2 L e b1 b E c eB     * , 1 PIC16F527 DS41652A-page 104 Preliminary  2012 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012 Microchip Technology Inc. Preliminary DS41652A-page 105 PIC16F527 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging PIC16F527 DS41652A-page 106 Preliminary  2012 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012 Microchip Technology Inc. Preliminary DS41652A-page 107 PIC16F527    !"#  $     %&    $      !" #$% &"'  ()"&'"!&) &#*&& &#    '!! #.#&"#'#% ! &"!!#% ! &"!!! &$#'' !# - '!  #&   .0 1,2 1 !'!& $ & "!**&"&& ! .32 %'!("!" *&"&& (%%' & " !!  3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4  6&! 99.. 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Preliminary DS41652A-page 113 PIC16F527 INDEX A A/D Converter Characteristics ........................................... 92 ALU ....................................................................................... 9 Assembler MPASM Assembler..................................................... 82 B Block Diagram On-Chip Reset Circuit ................................................. 48 Timer0......................................................................... 35 TMR0/WDT Prescaler................................................. 39 Watchdog Timer.......................................................... 51 Block Diagrams OPA Module................................................................ 71 C Carry ..................................................................................... 9 Clock Divisors ..................................................................... 59 Clocking Scheme ................................................................ 13 Code Protection ............................................................ 41, 54 Comparator ......................................................................... 64 CONFIG1 Register.............................................................. 42 Configuration Bits................................................................ 41 Customer Change Notification Service ............................. 115 Customer Notification Service........................................... 115 Customer Support............................................................. 115 D Data Memory (SRAM and FSRs) Register File Map.................................................. 16, 19 DC and AC Characteristics ................................................. 99 Graphs and Tables ..................................................... 99 Development Support ......................................................... 81 Digit Carry ............................................................................. 9 E Effects of Reset OPA module................................................................ 72 Errata .................................................................................... 4 External Clock Timing ......................................................... 93 F Flash Data Memory Control ................................................ 25 FSR..................................................................................... 23 Fuses. See Configuration Bits H HI-TECH C for Various Device Families ............................. 82 I I/O Interfacing ............................................................... 30, 32 I/O Port................................................................................ 29 I/O Programming Considerations........................................ 33 ID Locations .................................................................. 41, 57 INDF.................................................................................... 23 Indirect Data Addressing..................................................... 23 Instruction Cycle ................................................................. 13 Instruction Flow/Pipelining .................................................. 13 Instruction Set Summary..................................................... 74 Internet Address................................................................ 115 L Loading of PC ..................................................................... 22 M Memory Organization ......................................................... 15 Memory Map............................................................... 15 PIC16F527 ................................................................. 15 Program Memory (PIC16F527) .................................. 15 Microchip Internet Web Site.............................................. 115 MPLAB ASM30 Assembler, Linker, Librarian..................... 82 MPLAB C Compilers for Various Device Families.............. 82 MPLAB Integrated Development Environment Software.... 81 MPLAB PM3 Device Programmer ...................................... 84 MPLAB REAL ICE In-Circuit Emulator System .................. 83 MPLINK Object Linker/MPLIB Object Librarian.................. 82 O OPA2CON Register............................................................ 72 Operational Amplifier (OPA) Module Associated Registers.................................................. 72 OPTION Register................................................................ 20 OSC selection..................................................................... 41 OSCCAL Register............................................................... 21 Oscillator Configurations..................................................... 43 Oscillator Types EC............................................................................... 43 EXTRC ....................................................................... 43 HS............................................................................... 43 INTRC......................................................................... 43 LP ............................................................................... 43 XT ............................................................................... 43 P PIC16F527 Device Varieties................................................. 7 POR Device Reset Timer (DRT) ................................... 41, 50 PD............................................................................... 51 Power-on Reset (POR)............................................... 41 TO............................................................................... 51 PORTA ............................................................................... 29 PORTB ............................................................................... 29 PORTC ............................................................................... 29 Power-down Mode.............................................................. 53 Prescaler ............................................................................ 38 Program Counter ................................................................ 22 Q Q cycles.............................................................................. 13 R RC Oscillator....................................................................... 44 Reader Response............................................................. 116 Read-Modify-Write.............................................................. 33 Registers CONFIG1 (Configuration Word Register 1)................ 42 Op Amp 2 Control Register (OPA2CON) ................... 72 Special Function ......................................................... 16 Reset .................................................................................. 41 Revision History................................................................ 111 S Sleep ............................................................................ 41, 53 Software Simulator (MPLAB SIM) ...................................... 83 Special Features of the CPU .............................................. 41 Special Function Registers........................................... 16, 19 Stack................................................................................... 22 STATUS ............................................................................. 19 PIC16F527 DS41652A-page 114 Preliminary  2012 Microchip Technology Inc. STATUS Register................................................................ 19 STATUS register................................................................. 51 Status Register................................................................ 9, 19 T Timer0 Timer0......................................................................... 35 Timer0 (TMR0) Module............................................... 35 TMR0 with External Clock........................................... 37 Timing Diagrams Brown-out Reset Situations ........................................ 52 Timing Parameter Symbology and Load Conditions...........93 TRIS Register......................................................................29 W Wake-up from Sleep ........................................................... 53 Watchdog Timer (WDT) ................................................ 41, 50 Period..........................................................................50 Programming Considerations ..................................... 50 WWW Address.................................................................. 115 WWW, On-Line Support........................................................ 4 Z Zero bit.................................................................................. 9  2012 Microchip Technology Inc. Preliminary DS41652A-page 115 PIC16F527 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support PIC16F527 DS41652A-page 116 Preliminary  2012 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC16F527 DS41652A 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document?  2012 Microchip Technology Inc. Preliminary DS41652A-page 117 PIC16F527 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Temperature Package Pattern Range Device Device: PIC16F527 Temperature Range: I = -40C to +85C (Industrial) E = -40C to +125C (Extended) Package: P = Plastic (PDIP)(2) SO = 20L Small Outline, 7.50 mm (SOIC)(1,2) SS = Shrink Small Outline (SSOP)(1,2) ML = 20-Lead 4x4 (QFN)(1,2) Pattern: Special Requirements Examples: a) PIC16F527-E/P 301 = Extended Temp., PDIP package, QTP pattern #301 b) PIC16F527-I/SO = Industrial Temp., SOIC package c) PIC16F527T-E/SS = Extended Temp., SSOP package, Tape and Reel d) PIC16F527T-I/ML = Industrial Temp., QFN Package, Tape and Reel Note 1: T = in tape and reel SOIC, SSOP and QFN packages only 2: Pb-free. PIC16F527 DS41652A-page 118 Preliminary  2012 Microchip Technology Inc. NOTES:  2012 Microchip Technology Inc. Preliminary DS41652A-page 119 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-527-2 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS41652A-page 120 Preliminary  2012 Microchip Technology Inc. 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DS00905A-page 1 AN905 INTRODUCTION Brushed DC motors are widely used in applications ranging from toys to push-button adjustable car seats. Brushed DC (BDC) motors are inexpensive, easy to drive, and are readily available in all sizes and shapes. This application note will discuss how a BDC motor works, how to drive a BDC motor, and how a drive circuit can be interfaced to a PIC® microcontroller. PRINCIPLES OF OPERATION The construction of a simple BDC motor is shown in Figure 1. All BDC motors are made of the same basic components: a stator, rotor, brushes and a commutator. The following paragraphs will explain each component in greater detail. Stator The stator generates a stationary magnetic field that surrounds the rotor. This field is generated by either permanent magnets or electromagnetic windings. The different types of BDC motors are distinguished by the construction of the stator or the way the electromagnetic windings are connected to the power source. (See Types of Stepping Motors for the different BDC motor types). Rotor The rotor, also called the armature, is made up of one or more windings. When these windings are energized they produce a magnetic field. The magnetic poles of this rotor field will be attracted to the opposite poles generated by the stator, causing the rotor to turn. As the motor turns, the windings are constantly being energized in a different sequence so that the magnetic poles generated by the rotor do not overrun the poles generated in the stator. This switching of the field in the rotor windings is called commutation. FIGURE 1: SIMPLE TWO-POLE BRUSHED DC MOTOR Author: Reston Condit Microchip Technology Inc. N Brushes Commutator Armature Field Magnet NORTH SOUTH Axle or Coil Brushed DC Motor Fundamentals AN905 DS00905A-page 2  2004 Microchip Technology Inc. Brushes and Commutator Unlike other electric motor types (i.e., brushless DC, AC induction), BDC motors do not require a controller to switch current in the motor windings. Instead, the commutation of the windings of a BDC motor is done mechanically. A segmented copper sleeve, called a commutator, resides on the axle of a BDC motor. As the motor turns, carbon brushes slide over the commutator, coming in contact with different segments of the commutator. The segments are attached to different rotor windings, therefore, a dynamic magnetic field is generated inside the motor when a voltage is applied across the brushes of the motor. It is important to note that the brushes and commutator are the parts of a BDC motor that are most prone to wear because they are sliding past each other. TYPES OF STEPPING MOTORS As mentioned earlier, the way the stationary magnetic field is produced in the stator differentiates the various types of BDC motors. This section will discuss the different types of BDC motors and the advantages/ disadvantages of each. Permanent Magnet Permanent Magnet Brushed DC (PMDC) motors are the most common BDC motors found in the world. These motors use permanent magnets to produce the stator field. PMDC motors are generally used in applications involving fractional horsepower because it is more cost effective to use permanent magnets than wound stators. The drawback of PMDC motors is that the magnets lose their magnetic properties over time. Some PMDC motors have windings built into them to prevent this from happening. The performance curve (voltage vs. speed), is very linear for PMDC motors. Current draw also varies linearly with torque. These motors respond to changes in voltage very quickly because the stator field is always constant. FIGURE 2: PERMANENT MAGNET DC MOTORS Shunt-Wound Shunt-wound Brushed DC (SHWDC) motors have the field coil in parallel (shunt) with the armature. The current in the field coil and the armature are independent of one another. As a result, these motors have excellent speed control. SHWDC motors are typically used applications that require five or more horsepower. Loss of magnetism is not an issue in SHWDC motors so they are generally more robust than PMDC motors. FIGURE 3: SHUNT-WOUND DC MOTORS Series-Wound Series-wound Brushed DC (SWDC) motors have the field coil in series with the armature. These motors are ideally suited for high-torque applications because the current in both the stator and armature increases under load. A drawback to SWDC motors is that they do not have precise speed control like PMDC and SHWDC motors have. FIGURE 4: SERIES-WOUND DC MOTORS Armature Brush Permanent Magnet Poles DC Voltage Supply Armature Brush Shunt Field DC Voltage Supply Armature Brush Series Field DC Voltage Supply  2004 Microchip Technology Inc. DS00905A-page 3 AN905 Compound-Wound Compound Wound (CWDC) motors are a combination of shunt-wound and series-wound motors. As shown in Figure 5, CWDC motors employ both a series and a shunt field. The performance of a CWDC motor is a combination of SWDC and SHWDC motors. CWDC motors have higher torque than a SHWDC motor while offering better speed control than SWDC motor. FIGURE 5: COMPOUND-WOUND DC MOTORS BASIC DRIVE CIRCUITS Drive circuits are used in applications where a controller of some kind is being used and speed control is required. The purpose of a drive circuit is to give the controller a way to vary the current in the windings of the BDC motor. The drive circuits discussed in this section allow the controller to pulse width modulate the voltage supplied to a BDC motor. In terms of power consumption, this method of speed control is a far more efficient way to vary the speed of a BDC motor compared to traditional analog control methods. Traditional analog control required the addition of an inefficient variable resistance in series with the motor. BDC motors are driven in a variety of ways. In some cases the motor only needs to spin in one direction. Figure 6 and Figure 7 show circuits for driving a BDC motor in one direction. The first is a low-side drive and the second is a high-side drive. The advantage to using the low-side drive is that a FET driver is not typically needed. A FET driver is used to: 1. bring the TTL signal driving a MOSFET to the potential level of the supply voltage, 2. provide enough current to drive the MOSFET(1), 3. and provide level shifting in half-bridge applications. Note that in each circuit there is a diode across the motor. This diode is there to prevent Back Electromagnetic Flux (BEMF) voltage from harming the MOSFET. BEMF is generated when the motor is spinning. When the MOSFET is turned off, the winding in the motor is still charged at this point and will produce reverse current flow. D1 must be rated appropriately so that it will dissipate this current. FIGURE 6: LOW-SIDE BDC MOTOR DRIVE CIRCUIT FIGURE 7: HIGH-SIDE BDC MOTOR DRIVE CIRCUIT Resistors R1 and R2 in Figure 6 and Figure 7 are important to the operation of each circuit. R1 protects the microcontroller from current spikes while R2 ensures that Q1 is turned off when the input pin is tristated. Note 1: The second point typically does not apply to most PICmicro® microcontroller applications because PIC microcontroller I/O pins can source 20 mA. Armature Brush Shunt Field DC Voltage Supply Series Field VCC BDC D1 Motor R1 R2 To Controller VCC VCC BDC D1 Motor R1 R2 To Controller AN905 DS00905A-page 4  2004 Microchip Technology Inc. Bidirectional control of a BDC motor requires a circuit called an H-bridge. The H-bridge, named for it's schematic appearance, is able to move current in either direction through the motor winding. To understand this, the H-bridge must be broken into its two sides, or half-bridges. Referring to Figure 8, Q1 and Q2 make up one half-bridge while Q3 and Q4 make up the other half-bridge. Each of these half-bridges is able to switch one side of the BDC motor to the potential of the supply voltage or ground. When Q1 is turned on and Q2 is off, for instance, the left side of the motor will be at the potential of the supply voltage. Turning on Q4 and leaving Q3 off will ground the opposite side of the motor. The arrow labeled IFWD shows the resulting current flow for this configuration. Note the diodes across each of the MOSFETs (D1-D4). These diodes protect the MOSFETs from current spikes generated by BEMF when the MOSFETs are switched off. These diodes are only needed if the internal MOSFET diodes are not sufficient for dissipating the BEMF current. The capacitors (C1-C4) are optional. The value of these capacitors is generally in the 10 pF range. The purpose of these capacitors is to reduce the RF radiation that is produced by the arching of the commutators. FIGURE 8: BIDIRECTION BDC MOTOR DRIVE (H-BRIDGE) CIRCUIT The different drive modes for and H-bridge circuit are shown in Table 1. In Forward mode and Reverse mode one side of the bridge is held at ground potential and the other side at VSUPPLY. In Figure 8 the IFWD and IRVS arrows illustrate the current paths during the Forward and Reverse modes of operation. In Coast mode, the ends of the motor winding are left floating and the motor coasts to a stop. Brake mode is used to rapidly stop the BDC motor. In Brake mode, the ends of the motor are grounded. The motor behaves as a generator when it is rotating. Shorting the leads of the motor acts as a load of infinite magnitude bringing the motor to a rapid halt. The IBRK arrow illustrates this. There is one very important consideration that must be taken into account when designing an H-bridge circuit. All MOSFETs must be biased to off when the inputs to the circuit are unpredictable (like when the microcontroller is starting up). This will ensure that the MOSFETs on each half-bridge of the H-bridge will never be turned on at the same time. Turning MOSFETs on that are located on the same half-bridge will cause a short across the power supply, ultimately damaging the MOSFETs and rendering the circuit inoperable. Pull-down resistors at each of the MOSFET driver inputs will accomplish this functionality (for the configuration shown in Figure 8). R1 R2 Q1 Q2 C1 C2 C3 C4 Q3 Q4 Motor BDC VSUPPLY R3 R4 CTRL1 CTRL2 CTRL3 CTRL4 D3 D4 D1 D2 IRVS IBRK IFWD TABLE 1: H-BRIDGE MODES OF OPERATION Q1 (CTRL1) Q2 (CTRL2) Q3 (CTRL3) Q4 (CTRL4) Forward on off off on Reverse off on on off Coast off off off off Brake off on off on  2004 Microchip Technology Inc. DS00905A-page 5 AN905 SPEED CONTROL The speed of a BDC motor is proportional to the voltage applied to the motor. When using digital control, a pulse-width modulated (PWM) signal is used to generate an average voltage. The motor winding acts as a low pass filter so a PWM waveform of sufficient frequency will generate a stable current in the motor winding. The relation between average voltage, the supply voltage, and duty cycle is given by: EQUATION 1: Speed and duty cycle are proportional to one another. For example, if a BDC motor is rated to turn at 15000 RPM at 12V, the motor will (ideally) turn at 7500 RPM when a 50% duty cycle waveform is applied across the motor. The frequency of the PWM waveform is an important consideration. Too low a frequency will result in a noisy motor at low speeds and sluggish response to changes in duty cycle. Too high a frequency lessens the efficiency of the system due to switching losses in the switching devices. A good rule of thumb is to modulate the input waveform at a frequency in the range of 4 kHz to 20 kHz. This range is high enough that audible motor noise is attenuated and the switching losses present in the MOSFETs (or BJTs) are negligible. Generally, it is a good idea to experiment with the PWM frequency for a given motor to find a satisfactory frequency. So how can a PIC microcontroller be used to generate the PWM waveform required to control the speed of a BDC motor? One way would be to toggle an output pin by writing assembly or C code dedicated to driving that pin(1). Another way is to select a PIC microcontroller with a hardware PWM module. The modules available from Microchip for this purpose are the CCP an ECCP modules. Many of the PIC microcontrollers have CCP and ECCP modules. Refer to the product selector guide to find the devices having these features. The CCP module (short for Capture Compare and PWM) is capable of outputting a 10-bit resolution PWM waveform on a single I/O pin. 10-bit resolution means that 210, or 1024, possible duty cycle values ranging from 0% to 100% are achievable by the module. The advantage to using this module is that it automatically generates a PWM signal on an I/O pin which frees up processor time for doing other things. The CCP module only requires that the developer configure the parameters of the module. Configuring the module includes setting the frequency and duty cycle registers. The ECCP module (short for Enhanced Capture Compare and PWM) provides the same functionality as the CCP module with the added capability of driving a full or half-bridge circuit. The ECCP module also has auto-shutdown capability and programmable dead band delay. FEEDBACK MECHANISMS Though the speed of a BDC motor is generally proportional to duty cycle, no motor is ideal. Heat, commutator wear and load all affect the speed of a motor. In systems where precise speed control is required, it is a good idea to include some sort of feedback mechanism in the system. Speed feedback is implemented in one of two ways. The first involves the use of a speed sensor of some kind. The second uses the BEMF voltage generated by the motor. Sensored Feedback There are a variety of sensors used for speed feedback. The most common are optical encoders and hall effect sensors. Optical encoders are made up of several components. A slotted wheel is mounted to the shaft at the non-driving end of the motor. An infrared LED provides a light source on one side of the wheel and a photo transistor detects light on the other side of the wheel (see Figure 9). Light passing through the slots in the wheel will turn the photo transistor on. As the shaft turns, the photo transistor turns on and off with the passing of the slots in the wheel. The frequency at which the transistor toggles is an indication of motor speed. In the case of positioning applications, an optical encoder will also provide feedback as to the position of the motor. Note 1: Microchip Application Note AN847 FIGURE 9: OPTICAL ENCODER provides an assembly code routine for pulse-width modulating an I/O pin in firmware. VAVERAGE = D × VSUPPLY Note: Microchip Application Note AN893 gives a detailed explanation of configuring the ECCP module for driving a BDC motor. The application note also includes firmware and drive circuit examples. Photo Transistor IR LED slotted wheel Front View Side View AN905 DS00905A-page 6  2004 Microchip Technology Inc. Hall effect sensors are also used to provide speed feedback. Like optical encoders, hall effect sensors require a rotary element attached to the motor and a stationary component. The rotary element is a wheel with one or more magnets positioned on its outer rim. A stationary sensor detects the magnet when in passes and generates a TTL pulse. Figure 10 shows the basic components of a hall effect sensor. FIGURE 10: HALL EFFECT SENSOR Back Electro Magnetic Flux (BEMF) Another form of velocity feedback for a BDC motor is BEMF voltage measurement. BEMF voltage and speed are proportional to one another. Figure 11 shows the locations where BEMF voltage is measured on a bidirectional drive circuit. A voltage divider is used to drop the BEMF voltage into the 0-5V range so that it can be read by an analog-to-digital converter. The BEMF voltage is measured between PWM pulses when one side of the motor is floating and the other is grounded. At this instance in time the motor is acting like a generator and produces a BEMF voltage proportional to speed. FIGURE 11: BACK EMF VOLTAGE MEASUREMENT magnet wheel magnet hall effect sensor Front View Side View R1 R2 Q1 Q2 C1 C2 C3 C4 Q3 Q4 Motor BDC VSUPPLY R3 R4 CTRL1 CTRL2 BEMF BEMF CTRL3 CTRL4  2004 Microchip Technology Inc. DS00905A-page 7 AN905 All BDC motors behave slightly differently because of differences in efficiency and materials. Experimentation is the best way to determine the BEMF voltage for a given motor speed. A piece of reflect tape on the shaft of the motor will allow a digital tachometer to measure the RPM of the motor. Measuring the BEMF voltage while reading the digital tachometer will give a correlation between motor speed and BEMF voltage. CONCLUSION Brushed DC motors are very simple to use and control, which makes them a short design-in item. PIC microcontrollers, especially those with CCP or ECCP modules are ideally suited for driving BDC motors. REFERENCES AN893 Low-Cost Bidirectional Brushed DC Motor Control Using the PIC16F684. AN847 RC Model Aircraft Motor Control. www.howstuffworks.com www.engin.umich.edu/labs/csdl/me350/motors/dc/ index.html Note: Microchip Application Note AN893 provides firmware and circuit examples for reading the BEMF voltage using a PIC16F684. AN905 DS00905A-page 8  2004 Microchip Technology Inc. NOTES:  2004 Microchip Technology Inc. DS00905A-page 9 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart and rfPIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS00905A-page 10  2004 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. 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Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE Austria Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 France Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 01/26/04 WORLDWIDE SALES AND SERVICE © 2011 Microchip Technology Inc. Preliminary DS01417A-page 1 AN1417 INTRODUCTION To overcome the limitations of InfraRed (IR) remote control technology, ZigBee® RF4CE specification was first published in May 2009. It quickly became the dominant core technology that drives development of next generation remote control applications. ZigBee RF4CE technology uses IEEE 802.15.4 as its PHYsical (PHY) and Medium Access Control (MAC) layers, and builds network layer on top of them. As one of the first companies that supports a complete ZigBee RF4CE development platform, Microchip Technology provides the most competitive RF4CE solution in the market with eXtreme Low-Power (XLP) microcontrollers, IEEE 802.15.4 compliant RF transceiver, and ZigBee certified RF4CE protocol stack with the smallest memory footprint in the industry. For more details on Microchip RF4CE solution and other related information, refer to: http://www.microchip.com/rf4ce The fact that ZigBee RF4CE remote controls work on globally available 2.4 GHz Industrial, Scientific and Medical (ISM) band is one of its advantages for easy deployment. On the other hand, ZigBee RF4CE also generates some speculations of unwanted interference between RF4CE and other technologies that work on the same ISM frequency band, Bluetooth® and Wi-Fi®. It is of less concern for Bluetooth as it is a frequency hopping narrow band technology that only introduces short and temporary signal at any frequency. However, Wi-Fi introduces consistent wide band signal potentially with high power up to 20 dBm - 30 dBm (depending on geography) at the same frequency that IEEE 802.15.4 radio operates. A systematic research on the impact of Wi-Fi interference over Microchip ZigBee RF4CE solution may be helpful to ease the worry from potential user of RF4CE technology. In this application note, we first introduce the mechanisms to share frequency, which are designed in MAC layers of both IEEE 802.15.4 (RF4CE) and IEEE 802.11 (Wi-Fi) specifications. Then, additional efforts of RF4CE network layer to choose proper channels and ensure message delivery have been discussed. Finally, the application note details the worst case scenario and perform tests to evaluate performance of Microchip ZigBee RF4CE solution under strong Wi-Fi interference. Detailed test setups, test procedures and test results are also documented in this application note. For Microchip customers, the test firmware can be provided to help reproducing the test results under same condition. For more details, please contact your nearest Microchip sales office. DESIGNED TO SHARE MAC Layers – Listen Before Talk Both IEEE 802.15.4 – the lower layer of ZigBee RF4CE and IEEE 802.11 – the lower layer of Wi-Fi, are designed to share the frequency with other signals by executing Carrier Sense Multiple Access with Collision Avoidance (CSMA/CA) mechanism in MAC layer. In general, CSMA/CA mechanism is to listen before talk. For IEEE 802.15.4 compliant transceivers working on non-beacon mode, that the ZigBee RF4CE specification follows, majority of the transmitting packets other than acknowledgement frame follow the CSMA/CA procedure. The following procedure summarizes the CSMA/CA in IEEE 802.15.4 specification: 1. Randomly back-off between 0 to (2BE - 1) time unit. Back-off Exponential (BE) start with MAC constant macMinBE. Each back-off time unit is 20 symbols or 320 μs. 2. Perform Clear Channel Assessment (CCA) for 128 μs. If medium is idle, CSMA/CA succeeds. 3. If medium is busy, and BE is less than MAC constant aMaxBE, increase BE by one. 4. If the loop counter Number of Back-off (NB) exceeds MAC constant macMaxCSMABackoffs, exit CSMA/CA with status failure. 5. If maximum CSMA back-off time is not exceeded, increase NB by one, and then perform step 1. Author: Yifeng Yang Microchip Technology Inc. Microchip ZigBee® RF4CE Performance under Wi-Fi® Interference AN1417 DS01417A-page 2 Preliminary © 2011 Microchip Technology Inc. When CCA is performed, there are three CCA modes: • CCA mode 1 – Energy Detection (ED) • CCA mode 2 – Carrier Sense (CS) • CCA mode 3 – Combination of above two Of the three modes, mode 1 is the most valuable for IEEE 802.15.4 transceiver to co-exist with IEEE 802.11 signals. IEEE 802.15.4 transceivers are not able to detect IEEE 802.11 signals in carrier sense mode due to differences in modulation. Therefore, CCA mode 2 and mode 3 might not detect medium busy, even if strong IEEE 802.11 signal exists. Setting CCA mode 1 in IEEE 802.15.4 transceiver enables it to detect higher energy in the medium when IEEE 802.11 transceivers are transmitting, and therefore avoid direct packet collision and share the frequency. Figure 1 illustrates the IEEE 802.15.4 CSMA/CA procedure. Although few differences exist in details, IEEE 802.11 transceivers use similar way in random back-off and to listen before talk. Both IEEE 802.15.4 and IEEE 802.11 have been designed in the beginning to co-exist and co-operate at the same frequency. Both protocols are built to tolerate interference at operating channel, and avoid transmission when such interferences are detected. When both protocols are polite and hold their own conversations while peers are still talking, packet collision and congestion can be greatly reduced. FIGURE 1: CSMA/CA FLOW CHART (SOURCE: IEEE 802.15.4 SPECIFICATION) © 2011 Microchip Technology Inc. Preliminary DS01417A-page 3 AN1417 Failure Recovery This application note has so far discussed how the two protocols prevent confliction and share the same medium and same frequency. In addition, a fault tolerant system not only prevents possible confliction, but also recovers after such an unlikely confliction occurs. For both IEEE 802.15.4 and IEEE 802.11 protocols, the recovery is handled by the acknowledgement/retransmission procedure. Typically, an acknowledgement frame is used to confirm the reception of unicasting messages. A MAC layer sequence number is used to identify individual packet and acknowledgement frame duplicates the MAC sequence number to pinpoint the unicast message to be confirmed. However, if no desired acknowledgement packet is received by the transmitting side after a predefined time period threshold, retransmission of identical packet will be performed. Such transmission and waiting for acknowledgement can be repeated a few times until a confirmation acknowledgement is received, or the process runs out of retry limits. Besides CSMA/CA, to actively prevent packet collision among IEEE 802.15.4 and IEEE 802.11 communications, acknowledgment mechanism ensures packet delivery of unicast frame, the majority of both IEEE 802.15.4 and IEEE 802.11 traffic. In rare case, CSMA/CA mechanism does not prevent a packet collision, no acknowledgement will be generated and received. The mechanism of retransmission will be invoked and will retry the complete transmission process. The retransmission process significantly increases the chances of message delivery of IEEE 802.15.4 packets under strong interference of IEEE 802.11 signals. Both CSMA/CA and acknowledgment/retransmission are the mechanisms implemented in the MAC layer. When user tries to send a message, CSMA/CA and acknowledgment/retransmission will be executed in the MAC layer, without additional effort from the application layer. With the mechanisms building in both IEEE 802.15.4 and IEEE 802.11 MAC layers, both protocols are designed to be working together to share the same frequency. ZigBee RF4CE LAYER Both IEEE 802.15.4 and IEEE 802.11 are designed to act politely and share the frequency with other protocols. Both preventive and recovery steps have been implemented in the MAC layers of both protocols so that they avoid confliction at first and then are able to recover if confliction occurs in the worst case. ZigBee RF4CE protocol, built on top of IEEE 802.15.4 specification, has already inherited all benefits in the MAC layer to co-exist with Wi-Fi (IEEE 802.11) signal. Further, ZigBee RF4CE protocol walks additional distance to implement more features to be able to share the frequency with Wi-Fi (IEEE 802.11) protocol. Channel Selection The first step to avoid Wi-Fi interference is to avoid overlapping the RF4CE signal against that of Wi-Fi. IEEE 802.15.4 has defined 16 channels in 2.4 GHz ISM band. Each channel is 2 MHz wide with 5 MHz channel spacing between channels. Figure 2 illustrates IEEE 802.15.4 2.4 GHz ISM band channel definition. FIGURE 2: IEEE 802.15.4 2.4 GHz ISM BAND CHANNEL DEFINITION AN1417 DS01417A-page 4 Preliminary © 2011 Microchip Technology Inc. IEEE 802.11 specification defines 14 channels in 2.4 GHz ISM band. The availability of those 14 channels depends on local government regulations. Each channel has typical bandwidth of 22 MHz. However, center frequency of each channel is only 5 MHz apart. It is obvious that one Wi-Fi channel is overlapping with multiple channels. To ensure coexistence of Wi-Fi signals between channels, it is required to have at least 25 MHz between center frequencies of operating channels. Combining the above information, United States and Europe have both recommended the Wi-Fi channel settings. Consequently, different Wi-Fi channel settings create different overlaps over IEEE 802.15.4 channels, as illustrated in Figure 3 and Figure 4. FIGURE 3: OVERLAPPING OF IEEE 802.11 AND IEEE 802.15.4 CHANNELS IN UNITED STATES FIGURE 4: OVERLAPPING OF IEEE 802.11 AND IEEE 802.15.4 CHANNELS IN EUROPE © 2011 Microchip Technology Inc. Preliminary DS01417A-page 5 AN1417 As per Figure 3 and Figure 4, not all IEEE 802.15.4 channels overlap with IEEE 802.11 channels in the same way. Further, different IEEE 802.15.4 channels overlap with IEEE 802.11 channels in different regions. For those IEEE 802.15.4 channels that are not overlapping with IEEE 802.11 channels, it is obvious that there is less interference. ZigBee RF4CE specification selects three IEEE 802.15.4 channels, channel 15, 20 and 25, to be used in communication. As displayed in Figure 3 and Figure 4, these channels are least affected by the Wi-Fi interference both in U.S. and Europe. By selecting channels which are least overlapping with Wi-Fi channels in the U.S. and Europe, ZigBee RF4CE specification deliberately avoids direct interference with Wi-Fi. When ZigBee RF4CE target devices perform cold start, all three channels will be scanned and the least noisy channel will be located and is used to start the Wireless Personal Area Network (WPAN). In addition to ensure all three available channels have least potential to overlap an operating Wi-Fi channel, the energy scan procedure during ZigBee RF4CE target cold start ensures that ZigBee RF4CE WPAN operate as far from an operating Wi-Fi channel as possible to avoid the confliction. Furthermore, during ZigBee RF4CE normal operating, additional functionalities have been defined in ZigBee RF4CE specification to ensure the WPAN working in the channel with least amount of interference: • ZigBee RF4CE target device can perform frequency agility periodically to move the WPAN to a channel with less interference • ZigBee RF4CE controller device can merge multiple ZigBee RF4CE target devices into one single channel that has less interference In summary, all the mechanisms that are specified above are to assist ZigBee RF4CE WPAN operating on the channel that has least interference with Wi-Fi signal. The collections of mechanisms that ZigBee RF4CE specification defines include: • Allow ZigBee RF4CE WPAN operating on only three IEEE 802.15.4 channels (channel 15, 20 and 25) that have least potential to overlap Wi-Fi channels in the U.S. and Europe • When starting a ZigBee RF4CE WPAN, within available three channels, choose one with least noise by energy scanning all three channels • When operating a ZigBee RF4CE WPAN, a ZigBee RF4CE target device can perform frequency agility and move the WPAN to one of the three channels that has less interference • When operating in multiple ZigBee RF4CE WPANs, a ZigBee RF4CE controller device can merge multiple WPAN to a single channel that has least interference Failure Recovery Similar to MAC layer described in previous section, ZigBee RF4CE network layer also defines preventive steps to avoid confliction, such as multiple steps of optimal channel selection process. ZigBee RF4CE network layer also implements failure recovery mechanism to ensure that the message can still be delivered even when preventive steps fail. In the worst case that ZigBee RF4CE channel overlaps with Wi-Fi channel, further both CSMA/CA and acknowledgement/retransmission mechanism fail to deliver the message after multiple attempts, ZigBee RF4CE protocol defines multi-channel transmission to recover from the failure. ZigBee RF4CE protocol defines a few different ways to transmit packets, including single-channel transmission and multichannel transmission. Single-channel transmission depends on IEEE 802.15.4 MAC layer to send messages. On the other hand, as one of the many purposes of multi-channel transmission, failure recovery for ZigBee RF4CE communication has been defined and implemented. The first step of multi-channel transmission uses the identical process as MAC layer transmission. If MAC layer transmission succeeds, no further operation is necessary. If the first step fails in multi-channel transmission, the second step for multi-channel transmission will try to transmit the packet within all three ZigBee RF4CE supported channels continuously up to one second, until either it receives the desired acknowledgement, or one second is complete. In the second step of transmission, no CSMA/CA is performed; therefore, the packet is guaranteed to be sent under any situation. ZigBee RF4CE specification requires that transmission without the CSMA/CA mechanism must be completed in all of the three channels within 16.8 ms, so that up to 60 attempts can be transmitted on any possible channel until a desired acknowledgment is received. Due to innovative stack structure and code efficiency, Microchip RF4CE stack is capable of completing the transmission in all of the three supported channels within 12 ms to 13 ms. As a result, up to 77 attempts, 28% more than required by ZigBee RF4CE specification, can be performed within one second to further increase the chance of delivery even under extreme interferences. AN1417 DS01417A-page 6 Preliminary © 2011 Microchip Technology Inc. PERFORMANCE TEST As discussed in the previous sections, both IEEE 802.15.4 and IEEE 802.11 MAC layers are designed to be able to co-exist in the same frequency by preventive measures, listening before talk and failure recovery mechanisms of acknowledgement/retransmission. In addition to MAC layer, ZigBee RF4CE protocol implements its own preventive measure to limit operating channels to those with least interference with Wi-Fi channels. ZigBee RF4CE protocol also defines multi-channel transmission as backup plan in the case that MAC layer transmission and ZigBee RF4CE channel selection fails to generate favorable results. With all the mechanisms have been designed and implemented, ZigBee RF4CE solution is supposed to be very robust and fault tolerant in the practical environment settings with Wi-Fi interferences. In this section, we put Microchip ZigBee RF4CE solution up to the test against the worst case severe Wi-Fi interference and check its capability of delivering messages as well as how fast the message can be delivered. The testing environments, setups, procedures and results are documented in detail, so the testing results can be reproduced and verified. After reading the mechanisms for ZigBee RF4CE and Wi-Fi to co-exist by design and implementation, hope that the real world testing results are able to give RF4CE users the full confidence to use Microchip ZigBee RF4CE platform in their practical applications. Test Environment TEST LOCATION ZigBee RF4CE performance tests with Wi-Fi interference are performed under strictly controlled environment. All tests are performed in an RF shielded chamber. Covered by multi-layer of copper net, the RF shielded chamber is designed to block all of the RF signals exchange between inside and outside of the room; therefore making the RF environment inside of the RF shielded chamber in a controlled known state. When the door of shield chamber is latched and there is no RF activity inside, nearly zero signals are detected with spectrum analyzer. Figure 5 illustrates the Microchip RF shielded chambers. TEST EQUIPMENT ZigBee RF4CE protocol defines two kind of devices in the network, target and controller. In this test, two Microchip PIC18 Explorer demonstration boards (DM183032) with MRF24J40 PICtail™ RF daughter card (AC164134-1) are used to simulate both the target and controller. As illustrated in Figure 6, the MRF24J40 PICtail RF daughter card is plugged into the PIC18 Explorer demonstration board, and is ready to perform test. FIGURE 5: MICROCHIP RF SHIELDED TESTING CHAMBER Microchip RF Shielded Test Chamber Details of Shield in RF Shielded Chamber Door Latch of RF Shielded Chamber © 2011 Microchip Technology Inc. Preliminary DS01417A-page 7 AN1417 FIGURE 6: MICROCHIP ZigBee® RF4CE TEST PLATFORM: PIC18 EXPLORER DEMO BOARD (DM183032) WITH MRF24J40 PICtail™ RF DAUGHTER CARD (AC164134-1) Both the ZigBee RF4CE target and controller are programmed with the Microchip ZigBee RF4CE stack. The controller is programmed to transmit 1000 different unicast RF4CE packets to the target, once tests are initiated. The payload of 1000 RF4CE packets is standard High-Definition Multimedia Interface (HDMI) control codes defined in HDMI v1.3a specification. The control code in the payload increases one for each consecutive packet and restarts from zero once the biggest control code 0x76 is reached. The HDMI control code that is transmitted will be shown on LEDs D1 to D7 on the controller board. Similarly, once received, the HDMI control code will also be shown on LEDs D1 to D7 on the target board. The LED patterns on the controller and target boards, therefore, should be matching. When measuring transmission latency, the straightforward way is the direct measurement of timing from transmitting a packet from the sender until the packet is received by the receiver. This can be usually done by an oscilloscope with at least two channels. One channel is used to monitor the transmission side when operation is started; the other channel is used to monitor the receiving side once packet is received. The difference in timing is the transmission latency. This is the Duo-measurement method that involves two separate measurements in two channels, and is considered to be accurate. However, this measurement must be performed manually as there is no good way to record, process and analyze the data automatically. A different approach is to measure the transmission latency from the transmission side by timing the difference between starting to send a message and receiving the acknowledgement. The timing difference can be recorded and later processed by the MCU. The transmission latencies can then be recorded and analyzed for thousands of packets easily. Because there is only one measurement in single channel, we call this method as Single-measurement method. Due to the time period from acknowledgment frame transmission and MCU process time, it is likely that the transmission latency values from this method are 0.5 ms to 1 ms higher than the actual latency. For automated testing, the Single-measurement method is highly preferred. A comparison between the Duomeasurement method and the Single-measurement method has been performed on Tektronix MDO4104-6 Mixed Domain Oscilloscope, and the results are illustrated in Figure 7. AN1417 DS01417A-page 8 Preliminary © 2011 Microchip Technology Inc. FIGURE 7: TRANSMISSION LATENCY DIFFERENCE BETWEEN TWO MEASUREMENT METHODS Tektronix MDO4104-6 Mixed Domain Oscilloscope offers measurements from both analogue and radio frequencies. As illustrated in Figure 7, the orange waveform at the bottom is the IEEE 802.15.4 signal transmitted in channel 20. The top section has signals from two analogue channels, indicating the timing of transmission and receiving. Channel 1 is connected to an I/O pin on the transmission side programmed to go high when a transmission is started, and go low when an acknowledgement has been received. This pin is controlled by the application layer. Channel 2 is connected to the interrupt pin on the receive side. The yellow line is channel 1 from the transmission side. When transmission started from the application layer, the input jumps to high. When transmission finishes at the application layer, the input line falls back to low. The timing measured here is using the Singlemeasurement method that has been described earlier. The transmission timing is accurately labeled by marker ‘a’ and marker ‘b’. The total latency for this transmission from the Single-measurement method is 4.460 ms from the oscilloscope. MCU measured the latency to be 4.468 ms, very close to what the oscilloscope reported. On the other hand, the blue line is channel 2 from the radio interrupt pin of the receiving side. When receiver side receives the message, an interrupt is generated from the radio to the MCU. The actual transmission latency should be the timing from marker ‘a’ to where the interrupt line drops to low, as the Duomeasurement method has been described earlier. By the Duo-measurement method, we measure that the actual latency from this transmission is 3.79 ms. The difference of 0.67 ms between the Duo-measurement method and the Single-measurement method varies very little between different transmissions as the sole delays – acknowledgment delay (no CSMA/CA) and MCU processing delay, are both close to constants between different transmissions. © 2011 Microchip Technology Inc. Preliminary DS01417A-page 9 AN1417 In this application note, the Single-measurement method is used to perform automated testing over transmission delays of thousands of packets. The latency got from the MCU is 0.67 μs ± 0.3 μs longer than the actual latency. As the unmodified latency data from MCU timestamp is used in test result analysis and report, the user can expect that the latency value in the practical application may be slightly better than the test results. In this application note, the transmission status on the controller is verified by receiving desired acknowledgement packet. The MAC sequence number varies for each transmission packet, so acknowledgement frame can identify the unicast packet to be acknowledged and there is no ambiguity in transmission status. The transmission status of each packet will be recorded and the total successful transmission will be reported after test is finished. In addition, the latency of the transmission is also recorded. The latency is calculated at application layer. The first time stamp is recorded before calling the function to transmit a packet, and the second time stamp is recorded after the function returns, which means transmission finished. The difference between two time stamps is the transmission latency. Furthermore, if the transmission status is successful, then the latency value is valid. Then the latency value is put into one of the following 11 latency brackets for further data analysis as detailed in Table 1. TABLE 1: ZigBee® RF4CE LATENCY TEST RESULT BRACKETS After 1000 RF4CE packets finish transmission, the test results will be printed out on the hyper terminal through the RS232 serial interface. As described before, the test results include number of successful transmission and latency distribution among the 11 brackets. As illustrated in Figure 3 and Figure 4, of the three supported ZigBee RF4CE channels, the maximum interference between IEEE 802.15.4 and IEEE 802.11 signal in both U.S. and European region is at IEEE 802.15.4 channel 20. For this application note, both ZigBee RF4CE target and controller are programmed to operate on channel 20 and Wi-Fi interference is introduced at IEEE 802.11 channel 7. WI-FI INTERFERENCE The Wi-Fi interference source is chosen to be IEEE 802.11n streaming traffic in the format of User Datagram Protocol (UDP). Usually, Wi-Fi traffic for web browsing and/or e-mail reading have relatively low data throughput requirements, therefore do not generate as much interference with ZigBee RF4CE communication. More severe Wi-Fi interference is typically generated by streaming audio and/or video wirelessly through the Wi-Fi network. Table 2 lists the bit-rates of various streaming audio/video sources. TABLE 2: BIT RATE OF VARIOUS STREAMING SOURCE In this test, two UDP streaming bit rates are selected to represent different streaming scenario. The lower bit rate of 6 Mbps is typically found in streaming TV programs, DVD videos and on-line video source such as YouTube. On the other hand, higher bit rate of 15 Mbps may be seen in streaming HDTV programs or typical Blu-ray videos. <10 ms 10 ms to 20 ms 20 ms to 30 ms 30 ms to 40 ms 40 ms to 50 ms 50 ms to 60 ms 60 ms to 70 ms 70 ms to 80 ms 80 ms to 90 ms 90 ms to 100 ms >100 ms STREAMING SOURCES BIT RATE MP3 192 Kbps Video Conference 128 Kbps to 384 Kbps YouTube Video 0.25 Mbps to 1 Mbps (Standard Definition up to 480P) 2 Mbps to 5 Mbps (High Definition up to 1080P) Netflix HD 2.6 Mbps to 3.8 Mbps DVD (MPEG2) 4 Mbps to 5 Mbps (Typical), 10 Mbps (Max) HDTV (MPEG-4 AVC Encoding) 8 Mbps to 15 Mbps (Typical) Blu-ray 10 Mbps to 25 Mbps (Typical), 40 Mbps (Max) AN1417 DS01417A-page 10 Preliminary © 2011 Microchip Technology Inc. To generate UDP traffic of desired bit rate, a wireless router/Access Point (AP) and a wireless node is necessary to transmit and receive. In addition, two computers need to connect to the two wireless devices to control them. In this test, we use Linksys E1200 Wireless-N router from Cisco Systems, Inc as the IEEE 802.11n AP. The Linksys router is connected to a laptop computer by Ethernet cable, so that the laptop can have the full control over the AP. Through the Ethernet interface and HyperText Transfer Protocol (HTTP) based browser Graphics User Interface (GUI), the Linksys router is configured to be IEEE 802.11n only mode with frequency bandwidth of 40 MHz at channel 7 to maximize the interference with IEEE 802.15.4 channel 20, which is set for the ZigBee RF4CE communication. On the other side of wireless communication, we use MacBook Pro laptop from Apple Inc. with IEEE 802.11n compatible wireless adaptor. MacBook Pro laptop is configured to join the Linksys AP in IEEE 802.11n mode before the tests. Open source network testing tool iPerf (http:// en.wikipedia.org/wiki/Iperf) is used to generate desired network traffic between the two wireless nodes. The iPerf tools are installed on both the MacBook Pro and Windows-based laptop that is connected to the Linksys AP with Ethernet cable. The Linksys AP with laptop serves as iPerf server, which is started with the command line from DOS command console, as shown in Equation 1. EQUATION 1: The server side command line above means to start a UDP server at port 2000. The port number is adjustable for custom setup. On the other hand, the MacBook Pro serves as iPerf client, which is started with the command line from the terminal, shown in Equation 2. EQUATION 2: The client side iPerf command line means to start the UDP client at port 2000 and connect to the server at IP address 192.168.1.126 with streaming bit rate 6 Mbps, report status every 5 seconds and streaming lasts 600 seconds. The server IP address 192.168.1.126 varies in different setup of Linksys AP. The server IP address can be obtained by type “ipconfig” command from the DOS command console from server side. The port number is adjustable for custom setup, but it has to match the same port number from the server side. When testing with 15 Mbps bit rate, the command line option “-b 6M” must be changed to “-b 15M”. TEST MONITOR When the testing is in progress, there are two separate ways to monitor the test. Microchip Wireless Development Studio (WDS) with ZENA™ Wireless Adaptor is used to monitor the IEEE 802.15.4 traffic. WDS is Java-based software tool developed by Microchip to configure MiWi™ Development Environment as well as sniffing the network traffic. Working with Microchip ZENA Wireless Adaptor (2.4 GHz MRF24J40) as hardware sniffer, WDS can catch and save the IEEE 802.15.4 packets. Using the sniffing functionality of WDS, timings of transmission/ acknowledgement and retransmissions can be analyzed later. Figure 8 illustrates the WDS and ZENA USB adaptor. iPerf -s -u -p 2000 iPerf -c 192.168.1.126 -u -p 2000 -b 6M -i 5 -t 600 © 2011 Microchip Technology Inc. Preliminary DS01417A-page 11 AN1417 FIGURE 8: MICROCHIP WIRELESS DEVELOPMENT STUDIO AND ZENA™ WIRELESS ADAPTOR Microchip Wireless Development Studio Microchip Wireless ZENA™ Wireless Adaptor AN1417 DS01417A-page 12 Preliminary © 2011 Microchip Technology Inc. Spectrum monitor is another way to verify the following essential test environment: • Intense IEEE 802.11 traffic at configured frequency • IEEE 802.15.4 traffic at configured frequency • Channels of IEEE 802.15.4 and IEEE 802.11 overlap and interference is likely to occur. In this application, Wi-Spy 2.4 x 2.4 GHz spectrum sniffer and Channelizer 4 software (http:// www.metageek.net/) are used to perform spectrum monitoring. Wi-Spy and Channelizer 4 monitors the spectrum utilization when tests are going on and ensure that the ZigBee RF4CE communication and WiFi interference are performing according to prior configurations. Figure 9 illustrates the testing spectrum with signal identification labels, where the IEEE 802.15.4 channel 20 overlaps with IEEE 802.11n channel 7. As orange/red color of IEEE 802.11 signal indicates, there is high output power intense Wi-Fi traffic when Microchip ZigBee RF4CE latency tests are performed. FIGURE 9: 2.4 GHz SPECTRUM IN TEST WITH SIGNAL IDENTIFICATION LABEL © 2011 Microchip Technology Inc. Preliminary DS01417A-page 13 AN1417 TEST SETUP To simulate Wi-Fi signals with IEEE 802.15.4 communications under different conditions, four different scenarios are set up to perform the tests. The two Wi-Fi nodes are located 4 meters apart, streaming UDP data in the bit rate of either 6 Mbps or 15 Mbps. The ZigBee RF4CE target and controller devices are either put 20 cm away from the Wi-Fi node, or at center location between the two Wi-Fi nodes. The different scenarios are illustrated in Figure 10. FIGURE 10: TESTING SETUP SCENARIO Linksys E1200 UDP Streaming IEEE 802.11n MacBook PRO RF4CE Controller iPerf Server (RX) iPerf Client (TX) RF4CE 802.15.4 RF4CE Target Setup 1 Linksys E1200 UDP Streaming IEEE 802.11n MacBook PRO RF4CE Controller iPerf Server (RX) iPerf Client (TX) RF4CE 802.15.4 RF4CE Target Setup 2 Linksys E1200 MacBook PRO RF4CE Controller iPerf Server (RX) iPerf Client (TX) RF4CE Target Setup 3 Linksys E1200 MacBook PRO RF4CE Controller iPerf Server (RX) iPerf Client (TX) RF4CE Target Setup 4 Setup Number Hardware Setups UDP Streaming IEEE 802.11n RF4CE 802.15.4 UDP Streaming IEEE 802.11n RF4CE 802.15.4 AN1417 DS01417A-page 14 Preliminary © 2011 Microchip Technology Inc. Test Results As described in the previous sections, the firmware on ZigBee RF4CE controller is programmed to send 1000 RF4CE packets. After the test is finished, the following two test results are reported: • The total number of successful transmission, verified by desired acknowledgement frame • The transmission latency distribution for packets transmitted successfully The first set of test result, total number of successful transmission, is easy to report. Of more than 25000 packets that are sent under various conditions in our tests, not a single packet transmission failure is observed. The 100% RF4CE packet delivery rate proves that ZigBee RF4CE protocol specification is very robust and Microchip ZigBee RF4CE implementation is exceptionally reliable. When there is no interference with other sources in the Microchip RF shielded chamber, the transmission latency is consistently 100% less than 10 ms. When testing is performed under moderate Wi-Fi interferences, such as office environment in Microchip Chandler office, more than 99% of RF4CE packets are verified to be delivered within 10 ms and 100% within 20 ms. However, transmission latency under strong Wi-Fi interference has wider distribution. In this application note, tests are performed three times under each test configuration and report the test results in the tables Table 3, Table 4, Table 5 and Table 6. Even though there are variations between different runs of the same test configuration, general trend of latency distributions is still clearly visible. TABLE 3: RF4CE TRANSMISSION LATENCY DISTRIBUTIONS UNDER TEST SETUP 1 TABLE 4: RF4CE TRANSMISSION LATENCY DISTRIBUTIONS UNDER TEST SETUP 2 Latency (ms) Packets Received (%) Wi-Fi® Interference: 6 Mbps Wi-Fi Interference: 15 Mbps <10 94.2 89.6 99.1 81.3 78.4 89.4 <20 99.5 98.2 99.9 96.1 96 98.1 <30 99.8 98.7 99.9 97.2 96.9 98.4 <40 99.9 99.4 99.9 99.2 98.5 99.8 <50 99.9 99.8 100 99.9 99.8 99.9 <60 100 100 100 100 100 100 <70 100 100 100 100 100 100 <80 100 100 100 100 100 100 <90 100 100 100 100 100 100 <100 100 100 100 100 100 100 >100 100 100 100 100 100 100 Latency (ms) Packets Received (%) Wi-Fi® Interference: 6 Mbps Wi-Fi Interference: 15 Mbps <10 87.1 86.5 84.1 83.1 77.1 90 <20 98.5 98.3 96.9 97.6 95.4 99.1 <30 99.1 99 98.2 97.9 96.2 99.4 <40 99.4 99.7 99.6 99.7 98.2 99.8 <50 99.6 99.8 99.8 100 98.9 99.8 <60 100 100 100 100 99.5 100 <70 100 100 100 100 100 100 <80 100 100 100 100 100 100 <90 100 100 100 100 100 100 <100 100 100 100 100 100 100 >100 100 100 100 100 100 100 © 2011 Microchip Technology Inc. Preliminary DS01417A-page 15 AN1417 TABLE 5: RF4CE TRANSMISSION LATENCY DISTRIBUTIONS UNDER TEST SETUP 3 TABLE 6: RF4CE TRANSMISSION LATENCY DISTRIBUTIONS UNDER TEST SETUP 4 Latency (ms) Packets Received (%) Wi-Fi® Interference: 6 Mbps Wi-Fi Interference: 15 Mbps <10 95.8 98.7 93.8 82.2 88.1 83.6 <20 99.7 99.9 99.4 97 97.4 97.9 <30 99.8 99.9 99.6 97.6 98.4 98.3 <40 100 100 99.9 99.5 99.5 99.3 <50 100 100 100 99.6 99.7 99.9 <60 100 100 100 100 99.9 100 <70 100 100 100 100 100 100 <80 100 100 100 100 100 100 <90 100 100 100 100 100 100 <100 100 100 100 100 100 100 >100 100 100 100 100 100 100 Latency (ms) Packets Received (%) Wi-Fi® Interference: 6 Mbps Wi-Fi Interference: 15 Mbps <10 86.6 86 88.4 76.4 75 80.3 <20 98.4 97.4 98.3 94.5 94.8 96.5 <30 99.3 98.6 98.9 95.4 95.7 97.4 <40 99.9 99.6 99.4 98.2 98.8 98.9 <50 99.9 99.9 99.6 99.3 99.7 99.7 <60 100 100 99.9 99.8 100 99.8 <70 100 100 100 100 100 100 <80 100 100 100 100 100 100 <90 100 100 100 100 100 100 <100 100 100 100 100 100 100 >100 100 100 100 100 100 100 AN1417 DS01417A-page 16 Preliminary © 2011 Microchip Technology Inc. TEST RESULT ANALYSIS As numerous researches have shown, typical human response time is about 100 ms to 200 ms. Any transmission latency shorter than 100 ms for a remote control application will not have noticeable difference to user experience. In our tests of heavy interference when Wi-Fi is streaming data, we find that very close to 100% of all RF4CE packets are delivered successfully within 50 ms and in the worst case 100% packets are delivered within 70 ms. For a classic remote control application to replace IR based technology, Microchip’s ZigBee RF4CE solution provides exceptionally reliable communication with no control lag in the user experience even under the most severe Wi-Fi interference. For certain non-traditional remote control application, such as wireless game controller, low latency of less than 20 ms is preferred. Our latency distribution test results show that more than 99% of RF4CE packets can be delivered within 10 ms and 100% within 20 ms under normal conditions. Very good gaming experience should be ensured under such conditions. Under intense Wi-Fi interferences, around 95% RF4CE packets are still delivered within 20 ms in the worst scenario. Such latency results from Microchip ZigBee RF4CE solution should still provide acceptable gaming experiences to the user. As shown in the test results, there are some variations between different runs of the identical test configuration. Those variations may due to the random CSMA/CA back-offs in both IEEE 802.15.4 and IEEE 802.11 transceivers, and different timing of streaming UDP data. By duplicating the same test environments and setups in this application note, users should be able to reproduce the tests and expect similar results. The test firmware is available by contacting your nearest Microchip sales representatives. Microchip sales offices are listed at the end of this application note. CONCLUSION IEEE 802.15.4 and IEEE 802.11 specifications implement both preventive and failure recovery mechanisms in the MAC layer to share the frequency. Similarly, ZigBee RF4CE protocol, building on top of IEEE 802.15.4 MAC, further extends the preventive and failure-recovery capabilities in the network layer to share the same frequency. By design, ZigBee RF4CE and Wi-Fi are able to share the same frequency in 2.4 GHz ISM band. In this application note, Microchip’s ZigBee RF4CE solution has been put to the test with Wi-Fi signals under various setups. As the testing result indicates, even under strong Wi-Fi signals, Microchip ZigBee RF4CE solution still provides robust and reliable communication with low transmission latency. Microchip RF4CE solution provides not only unnoticeable control lag to traditional IR replacement remote control, but also good experience to those applications that are sensitive to transmission latency. © 2011 Microchip Technology Inc. Preliminary DS01417A-page 17 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-905-2 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS01417A-page 18 Preliminary © 2011 Microchip Technology Inc. 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DS00001739A-page 1 AN1739 INTRODUCTION The purpose of this document is to highlight the importance of batteries and the efficient power transfer at light loads in battery-powered applications. This application note will cover topics from battery considerations and how to get more run time, to presenting a boost converter solution that fulfills many industry requirements. The solution provided by Microchip focuses around the MCP16251/2 devices, which are compact, high-efficiency, fixed-frequency, synchronous step-up DC-DC converters. Along with the other boost devices from Microchip, MCP1640B/C/D and MCP1623/4, they form the low-voltage boost converter family that provides an easy-to-use power supply solution for applications powered by either one-cell, two-cell or three-cell alkaline, NiCd, NiMH and one-cell Li-Ion or Li-Polymer batteries. PRIMARY BATTERY CONSIDERATIONS The Microchip family of boost converters enables designers to utilize a single 1.5V primary battery as a power source in applications that require higher operating voltages. Primary batteries are cost-effective and widely available throughout the world, can support a variety of drain rates and are available in a variety of sizes and chemistries. There are a number of factors designers should keep in mind when choosing a battery solution for their project. Primary batteries typically have much greater shelf life stability than rechargeable chemistries. Most alkaline batteries have a shelf life of up to 10 years, while Energizer® Ultimate Lithium batteries have a shelf life of up to 20 years. The low quiescent current of the MCP16251/2 devices allows designers to create single-cell power solutions that can potentially last multiple years on a single battery. Designers should avoid deeply discharging alkaline batteries because it will increase the possibility of leakage. Even though a battery boost circuit might be able to operate at input voltages as low as 0.35V, discharging batteries below 0.8V is not advised. Below 0.8V on the battery, parasitic drains should be kept as low as possible and preferably removed entirely. Operating temperature may impact device performance differently depending on the battery chemistry that is used, and cold environments in particular may reduce run time. A typical alkaline cell will operate from -18°C to +55°C. If an application operates at temperatures below zero, an alkaline battery will provide greatly reduced performance or the device may not work at all. Designers should consider alternate options, such as Energizer Ultimate Lithium batteries, which have a wider operating temperature range of -40°C to +60°C. Author: Mihai Tanase - Microchip Technology Inc.; Craig Huddleston - Energizer Holding Inc. Improving Battery Run Time with Microchip’s 4 µA Quiescent Current MCP16251/2 Boost Regulator AN1739 DS00001739A-page 2  2014 Microchip Technology Inc. THE MICROCHIP FAMILY OF BOOST REGULATORS Microchip’s boost converter family was designed to start from a low input voltage and operate down to 0.35V. The family of boost devices has a set of features that makes them an efficient solution for applications that require a minimum number of components and is supplied from one-cell, two-cell, three-cell alkaline, NiMH, NiCd or single-cell Li-Ion batteries. TABLE 1: BOOST REGULATOR FEATURES Feature Description Low quiescent current This feature is very important for battery-powered applications as it increases the run time. Pulse Width Modulation (PWM)/Pulse Frequency Modulation (PFM) mode operation Along with the very low quiescent current, this ensures high efficiency for the entire load range. Integrated synchronous switch Typical boost converters cannot disconnect the output from the input because of the boost diode; replacing this with a PMOS switch increases the overall efficiency and allows the user to disconnect the output from the input. Internal compensation The error amplifier and the associated compensation network are integrated in the device, ensuring a stable response to either load or line variations and reducing the number of external components. Low noise anti-ring control The Microchip boost devices use a low noise anti-ring switch that dampens the oscillation typically observed at the switch node of a boost converter when operating in Discontinuous Inductor Current mode and therefore reduces the high frequency radiated noise. Peak Current mode control This ensures a fast response to any perturbations in the output current or the input voltage. Soft start The start-up procedure is divided into three steps: 1. The output is connected to the input through the PMOS switch. During this time, the output capacitor is charged with a current limited to approximately 100 mA. 2. After charging the output capacitor to the input voltage, the device starts switching. The device runs open-loop with a fixed duty cycle until the feedback voltage reaches approx 0.8V. During this time, the boost switch current is limited to 50% of its nominal value to avoid high peak currents at the battery, or output overshoots during start-up. Once the VFB voltage reaches 0.8V, normal closed-loop PWM operation is initiated. 3. Once the device has entered closed-loop operation, an internal capacitor is charged with a very weak current source, which in turn serves as the reference voltage for the converter. This provides a robust start-up, without any overshoot on the output voltage.  2014 Microchip Technology Inc. DS00001739A-page 3 AN1739 A small overview of the characteristics for the Microchip family of boost devices is provided in Table 2. LONGER BATTERY RUN TIME AND HIGH EFFICIENCY OVER THE ENTIRE LOAD RANGE One of the advantages of the MCP16251/2 compared to the other boost family members is the low quiescent current (4 µA compared to 19 µA). Along with the PFM mode, the higher PWM-to-PFM threshold and the high-value feedback resistors, this has resulted in a converter that greatly increases the run time of battery-powered applications at low load. In PFM mode, the device switches and increases the output voltage up to an upper threshold limit, where a comparator is triggered. This induces a sleep mode behavior in which the device draws only 4 µA from the output of the converter. Once the device has stopped switching, the output voltage starts to decrease until it reaches the lower threshold limit, which causes the converter to start switching and bring the output voltage back up. When choosing the feedback resistor, a compromise should be made between no load input current and the noise that the application can tolerate. Higher value resistors will decrease the no load input current (Figure 1) but will increase the noise that is introduced in the system and may cause instability issues. FIGURE 1: No Load Input Current (VIN = 1.5V, VOUT = 3.3V). Compared to the MCP1640B/C/D and the MCP1623/4, the MCP16251 has a smaller no load input current (Figure 2), which in turn provides a higher efficiency across the entire load range (Figure 3). FIGURE 2: No Load Input Current. TABLE 2: THE MICROCHIP FAMILY OF BOOST DEVICES Parameter MCP1623/4 MCP16251/2 MCP1640/B/C/D Mode PWM only or PWM/PFM PWM/PFM PWM only or PWM/PFM Start-Up Voltage 0.65V 0.82V 0.65V Input Voltage 0.35V – 5.5V 0.35V – 5.5V 0.35V – 5.5V Peak Switch Current 425 mA 650 mA 850 mA Quiescent Current 19 µA 4 µA 19 µA VOUT Accuracy ±7.4% ±3% ±3% Switching Frequency 370 – 630 kHz 425 – 575 kHz 425 – 575 kHz Shutdown True Load Disconnect Input to Output Bypass or True Load Disconnect Input to Output Bypass or True Load Disconnect Packages 6-lead SOT-23 6-lead SOT-23 6-lead SOT-23 8-lead 2x3 DFN 8-lead 2x3 TDFN 8-lead 2x3 DFN Key Attributes Lowest Cost Lowest Quiescent Current Highest Performance 0 100 200 300 400 • Full-Bridge PWM, Forward mode • Full-Bridge PWM, Reverse mode To select an Enhanced PWM mode, the P1M bits of the CCP1CON register must be set appropriately. The PWM outputs are multiplexed with I/O pins and are designated P1A, P1B, P1C and P1D. The polarity of the PWM pins is configurable and is selected by setting the CCP1M bits in the CCP1CON register appropriately. Table 14-1 shows the pin assignments for each Enhanced PWM mode. Figure 14-3 shows an example of a simplified block diagram of the Enhanced PWM module. FIGURE 14-3: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE TABLE 14-2: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES Note: To prevent the generation of an incomplete waveform when the PWM is first enabled, the ECCP module waits until the start of a new PWM period before generating a PWM signal. CCPR1L CCPR1H (Slave) Comparator TMR2 Comparator PR2 (1) R Q S Duty Cycle Registers DC1B<1:0> Clear Timer2, toggle PWM pin and latch duty cycle Note 1: The 8-bit timer TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time base. TRIS CCP1/P1A TRIS P1B TRIS P1C TRIS P1D Output Controller P1M<1:0> 2 CCP1M<3:0> 4 PWM1CON CCP1/P1A P1B P1C P1D Note 1: The TRIS register value for each PWM output must be configured appropriately. 2: Any pin not used by an Enhanced PWM mode is available for alternate pin functions. ECCP Mode P1M<1:0> CCP1/P1A P1B P1C P1D Single 00 Yes(1) Yes(1) Yes(1) Yes(1) Half-Bridge 10 Yes Yes No No Full-Bridge, Forward 01 Yes Yes Yes Yes Full-Bridge, Reverse 11 Yes Yes Yes Yes Note 1: Outputs are enabled by pulse steering in Single mode. See Register 14-4. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 118 Preliminary © 2009 Microchip Technology Inc. FIGURE 14-4: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE) 0 Period 00 10 01 11 Signal PR2+1 P1M<1:0> P1A Modulated P1A Modulated P1B Modulated P1A Active P1B Inactive P1C Inactive P1D Modulated P1A Inactive P1B Modulated P1C Active P1D Inactive Pulse Width (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay(1) Delay(1) Relationships: • Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value) • Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value) • Delay = 4 * TOSC * (PWM1CON<6:0>) Note 1: Dead-band delay is programmed using the PWM1CON register (Section 14.4.6 “Programmable Dead-Band Delay mode”). © 2009 Microchip Technology Inc. Preliminary DS41350C-page 119 PIC18F1XK50/PIC18LF1XK50 FIGURE 14-5: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE) 0 Period 00 10 01 11 Signal PR2+1 P1M<1:0> P1A Modulated P1A Modulated P1B Modulated P1A Active P1B Inactive P1C Inactive P1D Modulated P1A Inactive P1B Modulated P1C Active P1D Inactive Pulse Width (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay(1) Delay(1) Relationships: • Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value) • Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value) • Delay = 4 * TOSC * (PWM1CON<6:0>) Note 1: Dead-band delay is programmed using the PWM1CON register (Section 14.4.6 “Programmable Dead-Band Delay mode”). PIC18F1XK50/PIC18LF1XK50 DS41350C-page 120 Preliminary © 2009 Microchip Technology Inc. 14.4.1 HALF-BRIDGE MODE In Half-Bridge mode, two pins are used as outputs to drive push-pull loads. The PWM output signal is output on the CCP1/P1A pin, while the complementary PWM output signal is output on the P1B pin (see Figure 14-6). This mode can be used for Half-Bridge applications, as shown in Figure 14-7, or for Full-Bridge applications, where four power switches are being modulated with two PWM signals. In Half-Bridge mode, the programmable dead-band delay can be used to prevent shoot-through current in Half-Bridge power devices. The value of the PDC<6:0> bits of the PWM1CON register sets the number of instruction cycles before the output is driven active. If the value is greater than the duty cycle, the corresponding output remains inactive during the entire cycle. See Section 14.4.6 “Programmable Dead-Band Delay mode” for more details of the dead-band delay operations. Since the P1A and P1B outputs are multiplexed with the PORT data latches, the associated TRIS bits must be cleared to configure P1A and P1B as outputs. FIGURE 14-6: EXAMPLE OF HALF-BRIDGE PWM OUTPUT FIGURE 14-7: EXAMPLE OF HALF-BRIDGE APPLICATIONS Period Pulse Width td td (1) P1A(2) P1B(2) td = Dead-Band Delay Period (1) (1) Note 1: At this time, the TMR2 register is equal to the PR2 register. 2: Output signals are shown as active-high. P1A P1B FET Driver FET Driver Load + - + - FET Driver FET Driver V+ Load FET Driver FET Driver P1A P1B Standard Half-Bridge Circuit (“Push-Pull”) Half-Bridge Output Driving a Full-Bridge Circuit © 2009 Microchip Technology Inc. Preliminary DS41350C-page 121 PIC18F1XK50/PIC18LF1XK50 14.4.2 FULL-BRIDGE MODE In Full-Bridge mode, all four pins are used as outputs. An example of Full-Bridge application is shown in Figure 14-8. In the Forward mode, pin CCP1/P1A is driven to its active state, pin P1D is modulated, while P1B and P1C will be driven to their inactive state as shown in Figure 14-9. In the Reverse mode, P1C is driven to its active state, pin P1B is modulated, while P1A and P1D will be driven to their inactive state as shown Figure 14-9. P1A, P1B, P1C and P1D outputs are multiplexed with the PORT data latches. The associated TRIS bits must be cleared to configure the P1A, P1B, P1C and P1D pins as outputs. FIGURE 14-8: EXAMPLE OF FULL-BRIDGE APPLICATION P1A P1C FET Driver FET Driver V+ V- Load FET Driver FET Driver P1B P1D QA QB QD QC PIC18F1XK50/PIC18LF1XK50 DS41350C-page 122 Preliminary © 2009 Microchip Technology Inc. FIGURE 14-9: EXAMPLE OF FULL-BRIDGE PWM OUTPUT Period Pulse Width P1A(2) P1B(2) P1C(2) P1D(2) Forward Mode (1) Period Pulse Width P1A(2) P1C(2) P1D(2) P1B(2) Reverse Mode (1) (1) (1) Note 1: At this time, the TMR2 register is equal to the PR2 register. 2: Output signal is shown as active-high. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 123 PIC18F1XK50/PIC18LF1XK50 14.4.2.1 Direction Change in Full-Bridge Mode In the Full-Bridge mode, the P1M1 bit in the CCP1CON register allows users to control the forward/reverse direction. When the application firmware changes this direction control bit, the module will change to the new direction on the next PWM cycle. A direction change is initiated in software by changing the P1M1 bit of the CCP1CON register. The following sequence occurs prior to the end of the current PWM period: • The modulated outputs (P1B and P1D) are placed in their inactive state. • The associated unmodulated outputs (P1A and P1C) are switched to drive in the opposite direction. • PWM modulation resumes at the beginning of the next period. See Figure 14-10 for an illustration of this sequence. The Full-Bridge mode does not provide dead-band delay. As one output is modulated at a time, dead-band delay is generally not required. There is a situation where dead-band delay is required. This situation occurs when both of the following conditions are true: 1. The direction of the PWM output changes when the duty cycle of the output is at or near 100%. 2. The turn off time of the power switch, including the power device and driver circuit, is greater than the turn on time. Figure 14-11 shows an example of the PWM direction changing from forward to reverse, at a near 100% duty cycle. In this example, at time t1, the output P1A and P1D become inactive, while output P1C becomes active. Since the turn off time of the power devices is longer than the turn on time, a shoot-through current will flow through power devices QC and QD (see Figure 14-8) for the duration of ‘t’. The same phenomenon will occur to power devices QA and QB for PWM direction change from reverse to forward. If changing PWM direction at high duty cycle is required for an application, two possible solutions for eliminating the shoot-through current are: 1. Reduce PWM duty cycle for one PWM period before changing directions. 2. Use switch drivers that can drive the switches off faster than they can drive them on. Other options to prevent shoot-through current may exist. FIGURE 14-10: EXAMPLE OF PWM DIRECTION CHANGE Pulse Width Period(1) Signal Note 1: The direction bit P1M1 of the CCP1CON register is written any time during the PWM cycle. 2: When changing directions, the P1A and P1C signals switch before the end of the current PWM cycle. The modulated P1B and P1D signals are inactive at this time. The length of this time is (1/FOSC) • TMR2 prescale value. Period (2) P1A (Active-High) P1B (Active-High) P1C (Active-High) P1D (Active-High) Pulse Width PIC18F1XK50/PIC18LF1XK50 DS41350C-page 124 Preliminary © 2009 Microchip Technology Inc. FIGURE 14-11: EXAMPLE OF PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE 14.4.3 START-UP CONSIDERATIONS When any PWM mode is used, the application hardware must use the proper external pull-up and/or pull-down resistors on the PWM output pins. The CCP1M<1:0> bits of the CCP1CON register allow the user to choose whether the PWM output signals are active-high or active-low for each pair of PWM output pins (P1A/P1C and P1B/P1D). The PWM output polarities must be selected before the PWM pin output drivers are enabled. Changing the polarity configuration while the PWM pin output drivers are enable is not recommended since it may result in damage to the application circuits. The P1A, P1B, P1C and P1D output latches may not be in the proper states when the PWM module is initialized. Enabling the PWM pin output drivers at the same time as the Enhanced PWM modes may cause damage to the application circuit. The Enhanced PWM modes must be enabled in the proper Output mode and complete a full PWM cycle before enabling the PWM pin output drivers. The completion of a full PWM cycle is indicated by the TMR2IF bit of the PIR1 register being set as the second PWM period begins. Forward Period Reverse Period P1A TON TOFF T = TOFF – TON P1B P1C P1D External Switch D Potential Shoot-Through Current Note 1: All signals are shown as active-high. 2: TON is the turn on delay of power switch QC and its driver. 3: TOFF is the turn off delay of power switch QD and its driver. External Switch C t1 PW PW Note: When the microcontroller is released from Reset, all of the I/O pins are in the high-impedance state. The external circuits must keep the power switch devices in the Off state until the microcontroller drives the I/O pins with the proper signal levels or activates the PWM output(s). © 2009 Microchip Technology Inc. Preliminary DS41350C-page 125 PIC18F1XK50/PIC18LF1XK50 14.4.4 ENHANCED PWM AUTO-SHUTDOWN MODE The PWM mode supports an Auto-Shutdown mode that will disable the PWM outputs when an external shutdown event occurs. Auto-Shutdown mode places the PWM output pins into a predetermined state. This mode is used to help prevent the PWM from damaging the application. The auto-shutdown sources are selected using the ECCPAS<2:0> bits of the ECCPAS register. A shutdown event may be generated by: • A logic ‘0’ on the INT0 pin • Comparator C1 • Comparator C2 • Setting the ECCPASE bit in firmware A shutdown condition is indicated by the ECCPASE (Auto-Shutdown Event Status) bit of the ECCPAS register. If the bit is a ‘0’, the PWM pins are operating normally. If the bit is a ‘1’, the PWM outputs are in the shutdown state. When a shutdown event occurs, two things happen: The ECCPASE bit is set to ‘1’. The ECCPASE will remain set until cleared in firmware or an auto-restart occurs (see Section 14.4.5 “Auto-Restart Mode”). The enabled PWM pins are asynchronously placed in their shutdown states. The PWM output pins are grouped into pairs [P1A/P1C] and [P1B/P1D]. The state of each pin pair is determined by the PSSAC and PSSBD bits of the ECCPAS register. Each pin pair may be placed into one of three states: • Drive logic ‘1’ • Drive logic ‘0’ • Tri-state (high-impedance) REGISTER 14-2: ECCP1AS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; ECCP outputs are in shutdown state 0 = ECCP outputs are operating bit 6-4 ECCPAS<2:0>: ECCP Auto-shutdown Source Select bits 000 = Auto-Shutdown is disabled 001 = Comparator C1OUT output is high 010 = Comparator C2OUT output is high 011 = Either Comparator C1OUT or C2OUT is high 100 =VIL on INT0 pin 101 =VIL on INT0 pin or Comparator C1OUT output is high 110 =VIL on INT0 pin or Comparator C2OUT output is high 111 =VIL on INT0 pin or Comparator C1OUT or Comparator C2OUT is high bit 3-2 PSSACn: Pins P1A and P1C Shutdown State Control bits 00 = Drive pins P1A and P1C to ‘0’ 01 = Drive pins P1A and P1C to ‘1’ 1x = Pins P1A and P1C tri-state bit 1-0 PSSBDn: Pins P1B and P1D Shutdown State Control bits 00 = Drive pins P1B and P1D to ‘0’ 01 = Drive pins P1B and P1D to ‘1’ 1x = Pins P1B and P1D tri-state PIC18F1XK50/PIC18LF1XK50 DS41350C-page 126 Preliminary © 2009 Microchip Technology Inc. FIGURE 14-12: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PRSEN = 0) 14.4.5 AUTO-RESTART MODE The Enhanced PWM can be configured to automatically restart the PWM signal once the auto-shutdown condition has been removed. Auto-restart is enabled by setting the PRSEN bit in the PWM1CON register. If auto-restart is enabled, the ECCPASE bit will remain set as long as the auto-shutdown condition is active. When the auto-shutdown condition is removed, the ECCPASE bit will be cleared via hardware and normal operation will resume. FIGURE 14-13: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1) Note 1: The auto-shutdown condition is a level-based signal, not an edge-based signal. As long as the level is present, the auto-shutdown will persist. 2: Writing to the ECCPASE bit is disabled while an auto-shutdown condition persists. 3: Once the auto-shutdown condition has been removed and the PWM restarted (either through firmware or auto-restart) the PWM signal will always restart at the beginning of the next PWM period. Shutdown PWM ECCPASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Resumes Normal PWM Start of PWM Period ECCPASE Cleared by Firmware PWM Period Shutdown PWM ECCPASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Resumes Normal PWM Start of PWM Period PWM Period © 2009 Microchip Technology Inc. Preliminary DS41350C-page 127 PIC18F1XK50/PIC18LF1XK50 14.4.6 PROGRAMMABLE DEAD-BAND DELAY MODE In Half-Bridge applications where all power switches are modulated at the PWM frequency, the power switches normally require more time to turn off than to turn on. If both the upper and lower power switches are switched at the same time (one turned on, and the other turned off), both switches may be on for a short period of time until one switch completely turns off. During this brief interval, a very high current (shoot-through current) will flow through both power switches, shorting the bridge supply. To avoid this potentially destructive shoot-through current from flowing during switching, turning on either of the power switches is normally delayed to allow the other switch to completely turn off. In Half-Bridge mode, a digitally programmable dead-band delay is available to avoid shoot-through current from destroying the bridge power switches. The delay occurs at the signal transition from the non-active state to the active state. See Figure 14-14 for illustration. The lower seven bits of the associated PWM1CON register (Register 14-3) sets the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). FIGURE 14-14: EXAMPLE OF HALF-BRIDGE PWM OUTPUT FIGURE 14-15: EXAMPLE OF HALF-BRIDGE APPLICATIONS Period Pulse Width td td (1) P1A(2) P1B(2) td = Dead-Band Delay Period (1) (1) Note 1: At this time, the TMR2 register is equal to the PR2 register. 2: Output signals are shown as active-high. P1A P1B FET Driver FET Driver V+ V- Load + V - + V - Standard Half-Bridge Circuit (“Push-Pull”) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 128 Preliminary © 2009 Microchip Technology Inc. REGISTER 14-3: PWM1CON: ENHANCED PWM CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 PRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, ECCPASE must be cleared by software to restart the PWM bit 6-0 PDC<6:0>: PWM Delay Count bits PDCn = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal should transition active and the actual time it transitions active © 2009 Microchip Technology Inc. Preliminary DS41350C-page 129 PIC18F1XK50/PIC18LF1XK50 14.4.7 PULSE STEERING MODE In Single Output mode, pulse steering allows any of the PWM pins to be the modulated signal. Additionally, the same PWM signal can be simultaneously available on multiple pins. Once the Single Output mode is selected (CCP1M<3:2> = 11 and P1M<1:0> = 00 of the CCP1CON register), the user firmware can bring out the same PWM signal to one, two, three or four output pins by setting the appropriate STR bits of the PSTRCON register, as shown in Table 14-2. While the PWM Steering mode is active, CCP1M<1:0> bits of the CCP1CON register select the PWM output polarity for the P1 pins. The PWM auto-shutdown operation also applies to PWM Steering mode as described in Section 14.4.4 “Enhanced PWM Auto-shutdown mode”. An auto-shutdown event will only affect pins that have PWM outputs enabled. Note: The associated TRIS bits must be set to output (‘0’) to enable the pin output driver in order to see the PWM signal on the pin. REGISTER 14-4: PSTRCON: PULSE STEERING CONTROL REGISTER(1) U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 — — — STRSYNC STRD STRC STRB STRA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4 STRSYNC: Steering Sync bit 1 = Output steering update occurs on next PWM period 0 = Output steering update occurs at the beginning of the instruction cycle boundary bit 3 STRD: Steering Enable bit D 1 = P1D pin has the PWM waveform with polarity control from CCP1M<1:0> 0 = P1D pin is assigned to port pin bit 2 STRC: Steering Enable bit C 1 = P1C pin has the PWM waveform with polarity control from CCP1M<1:0> 0 = P1C pin is assigned to port pin bit 1 STRB: Steering Enable bit B 1 = P1B pin has the PWM waveform with polarity control from CCP1M<1:0> 0 = P1B pin is assigned to port pin bit 0 STRA: Steering Enable bit A 1 = P1A pin has the PWM waveform with polarity control from CCP1M<1:0> 0 = P1A pin is assigned to port pin Note 1: The PWM Steering mode is available only when the CCP1CON register bits CCP1M<3:2> = 11 and P1M<1:0> = 00. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 130 Preliminary © 2009 Microchip Technology Inc. FIGURE 14-16: SIMPLIFIED STEERING BLOCK DIAGRAM 1 0 TRIS P1A pin PORT Data P1A Signal STRA 1 0 TRIS P1B pin PORT Data STRB 1 0 TRIS P1C pin PORT Data STRC 1 0 TRIS P1D pin PORT Data STRD Note 1: Port outputs are configured as shown when the CCP1CON register bits P1M<1:0> = 00 and CCP1M<3:2> = 11. 2: Single PWM output requires setting at least one of the STRx bits. CCP1M1 CCP1M0 CCP1M1 CCP1M0 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 131 PIC18F1XK50/PIC18LF1XK50 14.4.7.1 Steering Synchronization The STRSYNC bit of the PSTRCON register gives the user two selections of when the steering event will happen. When the STRSYNC bit is ‘0’, the steering event will happen at the end of the instruction that writes to the PSTRCON register. In this case, the output signal at the P1 pins may be an incomplete PWM waveform. This operation is useful when the user firmware needs to immediately remove a PWM signal from the pin. When the STRSYNC bit is ‘1’, the effective steering update will happen at the beginning of the next PWM period. In this case, steering on/off the PWM output will always produce a complete PWM waveform. Figures 14-17 and 14-18 illustrate the timing diagrams of the PWM steering depending on the STRSYNC setting. FIGURE 14-17: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRSYNC = 0) FIGURE 14-18: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (STRSYNC = 1) PWM P1n = PWM STRn P1 PORT Data PWM Period PORT Data PWM PORT Data P1n = PWM STRn P1 PORT Data PIC18F1XK50/PIC18LF1XK50 DS41350C-page 132 Preliminary © 2009 Microchip Technology Inc. 14.4.8 OPERATION IN POWER-MANAGED MODES In Sleep mode, all clock sources are disabled. Timer2 will not increment and the state of the module will not change. If the ECCP pin is driving a value, it will continue to drive that value. When the device wakes up, it will continue from this state. If Two-Speed Start-ups are enabled, the initial start-up frequency from HFINTOSC and the postscaler may not be stable immediately. In PRI_IDLE mode, the primary clock will continue to clock the ECCP module without change. In all other power-managed modes, the selected power-managed mode clock will clock Timer2. Other power-managed mode clocks will most likely be different than the primary clock frequency. 14.4.8.1 Operation with Fail-Safe Clock Monitor If the Fail-Safe Clock Monitor is enabled, a clock failure will force the device into the RC_RUN Power-Managed mode and the OSCFIF bit of the PIR2 register will be set. The ECCP will then be clocked from the internal oscillator clock source, which may have a different clock frequency than the primary clock. See the previous section for additional details. 14.4.9 EFFECTS OF A RESET Both Power-on Reset and subsequent Resets will force all ports to Input mode and the CCP registers to their Reset states. This forces the enhanced CCP module to reset to a state compatible with the standard CCP module. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 133 PIC18F1XK50/PIC18LF1XK50 TABLE 14-3: REGISTERS ASSOCIATED WITH ECCP1 MODULE AND TIMER1 TO TIMER3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 RCON IPEN SBOREN — RI TO PD POR BOR 278 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 PIR2 OSCFIF C1IF C2IF EEIF BCLIF USBIF TMR3IF – 282 PIE2 OSCFIE C1IE C2IE EEIE BCLIE USBIE TMR3IE – 282 IPR2 OSCFIP C1IP C2IP EEIP BCLIP USBIP TMR3IP – 282 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 TMR1L Timer1 Register, Low Byte 280 TMR1H Timer1 Register, High Byte 280 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 280 TMR2 Timer2 Register 280 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 280 PR2 Timer2 Period Register 280 TMR3L Timer3 Register, Low Byte 281 TMR3H Timer3 Register, High Byte 281 T3CON RD16 — T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 281 CCPR1L Capture/Compare/PWM Register 1, Low Byte 281 CCPR1H Capture/Compare/PWM Register 1, High Byte 281 CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 281 ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 281 PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 281 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during ECCP operation. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 134 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 135 PIC18F1XK50/PIC18LF1XK50 15.0 MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE 15.1 Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface, useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C™) - Full Master mode - Slave mode (with general address call) The I2C interface supports the following modes in hardware: • Master mode • Multi-Master mode • Slave mode 15.2 SPI Mode The SPI mode allows 8 bits of data to be synchronously transmitted and received simultaneously. All four modes of SPI are supported. To accomplish communication, typically three pins are used: • Serial Data Out – SDO • Serial Data In – SDI • Serial Clock – SCK Additionally, a fourth pin may be used when in a Slave mode of operation: • Slave Select – SS Figure 15-1 shows the block diagram of the MSSP module when operating in SPI mode. FIGURE 15-1: MSSP BLOCK DIAGRAM (SPI MODE) ( ) Read Write Internal Data Bus SSPSR Reg SSPM<3:0> bit 0 Shift Clock SS Control Enable Edge Select Clock Select TMR2 Output Prescaler TOSC 4, 16, 64 2 Edge Select 2 4 TRIS bit SDO SSPBUF Reg SDI/SDA SS SCK/SCL PIC18F1XK50/PIC18LF1XK50 DS41350C-page 136 Preliminary © 2009 Microchip Technology Inc. 15.2.1 REGISTERS The MSSP module has four registers for SPI mode operation. These are: • SSPCON1 – Control Register • SSPSTAT – STATUS register • SSPBUF – Serial Receive/Transmit Buffer • SSPSR – Shift Register (Not directly accessible) SSPCON1 and SSPSTAT are the control and STATUS registers in SPI mode operation. The SSPCON1 register is readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in and out. SSPBUF provides indirect access to the SSPSR register. SSPBUF is the buffer register to which data bytes are written, and from which data bytes are read. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not double-buffered. A write to SSPBUF will write to both SSPBUF and SSPSR. REGISTER 15-1: SSPSTAT: MSSP STATUS REGISTER (SPI MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SMP: Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode. bit 6 CKE: SPI Clock Select bit(1) 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state bit 5 D/A: Data/Address bit Used in I2C mode only. bit 4 P: Stop bit Used in I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared. bit 3 S: Start bit Used in I2C mode only. bit 2 R/W: Read/Write Information bit Used in I2C mode only. bit 1 UA: Update Address bit Used in I2C mode only. bit 0 BF: Buffer Full Status bit (Receive mode only) 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Note 1: Polarity of clock state is set by the CKP bit of the SSPCON1 register. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 137 PIC18F1XK50/PIC18LF1XK50 REGISTER 15-2: SSPCON1: MSSP CONTROL 1 REGISTER (SPI MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 WCOL: Write Collision Detect bit (Transmit mode only) 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared by software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) SPI Slave mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be cleared by software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit(2) 1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits(3) 0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin 0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled 0011 = SPI Master mode, clock = TMR2 output/2 0010 = SPI Master mode, clock = FOSC/64 0001 = SPI Master mode, clock = FOSC/16 0000 = SPI Master mode, clock = FOSC/4 Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. 2: When enabled, these pins must be properly configured as input or output. 3: Bit combinations not specifically listed here are either reserved or implemented in I2C mode only. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 138 Preliminary © 2009 Microchip Technology Inc. 15.2.2 OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON1<5:0> and SSPSTAT<7:6>). These control bits allow the following to be specified: • Master mode (SCK is the clock output) • Slave mode (SCK is the clock input) • Clock Polarity (Idle state of SCK) • Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCK) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) The MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the 8 bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full detect bit, BF of the SSPSTAT register, and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data will be ignored and the write collision detect bit WCOL of the SSPCON1 register, will be set. User software must clear the WCOL bit to allow the following write(s) to the SSPBUF register to complete successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. The Buffer Full bit, BF of the SSPSTAT register, indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. Example 15-1 shows the loading of the SSPBUF (SSPSR) for data transmission. The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the MSSP STATUS register (SSPSTAT) indicates the various status conditions. EXAMPLE 15-1: LOADING THE SSPBUF (SSPSR) REGISTER LOOP BTFSS SSPSTAT, BF ;Has data been received (transmit complete)? BRA LOOP ;No MOVF SSPBUF, W ;WREG reg = contents of SSPBUF MOVWF RXDATA ;Save in user RAM, if data is meaningful MOVF TXDATA, W ;W reg = contents of TXDATA MOVWF SSPBUF ;New data to xmit © 2009 Microchip Technology Inc. Preliminary DS41350C-page 139 PIC18F1XK50/PIC18LF1XK50 15.2.3 ENABLING SPI I/O To enable the serial port, SSP Enable bit, SSPEN of the SSPCON1 register, must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, reinitialize the SSPCON registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDI is automatically controlled by the SPI module • SDO must have corresponding TRIS bit cleared • SCK (Master mode) must have corresponding TRIS bit cleared • SCK (Slave mode) must have corresponding TRIS bit set • SS must have corresponding TRIS bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. 15.2.4 TYPICAL CONNECTION Figure 15-2 shows a typical connection between two microcontrollers. The master controller (Processor 1) initiates the data transfer by sending the SCK signal. Data is shifted out of both shift registers on their programmed clock edge and latched on the opposite edge of the clock. Both processors should be programmed to the same Clock Polarity (CKP), then both controllers would send and receive data at the same time. Whether the data is meaningful (or dummy data) depends on the application software. This leads to three scenarios for data transmission: • Master sends data – Slave sends dummy data • Master sends data – Slave sends data • Master sends dummy data – Slave sends data FIGURE 15-2: TYPICAL SPI MASTER/SLAVE CONNECTION Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDO SDI Processor 1 SCK SPI Master SSPM<3:0> = 00xx Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDI SDO Processor 2 SCK SPI Slave SSPM<3:0> = 010x Serial Clock SS Slave Select General I/O (optional) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 140 Preliminary © 2009 Microchip Technology Inc. 15.2.5 MASTER MODE The master can initiate the data transfer at any time because it controls the SCK. The master determines when the slave (Processor 2, Figure 15-2) is to broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be disabled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and status bits appropriately set). The clock polarity is selected by appropriately programming the CKP bit of the SSPCON1 register. This then, would give waveforms for SPI communication as shown in Figure 15-3, Figure 15-5 and Figure 15-6, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user programmable to be one of the following: • FOSC/4 (or TCY) • FOSC/16 (or 4 • TCY) • FOSC/64 (or 16 • TCY) • Timer2 output/2 This allows a maximum data rate (at 64 MHz) of 16.00 Mbps. Figure 15-3 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown. FIGURE 15-3: SPI MODE WAVEFORM (MASTER MODE) SCK (CKP = 0 SCK (CKP = 1 SCK (CKP = 0 SCK (CKP = 1 4 Clock Modes Input Sample Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bit 7 SDI SSPIF (SMP = 1) (SMP = 0) (SMP = 1) CKE = 1) CKE = 0) CKE = 1) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 0) (CKE = 1) bit 0 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 141 PIC18F1XK50/PIC18LF1XK50 15.2.6 SLAVE MODE In Slave mode, the data is transmitted and received as external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. Before enabling the module in SPI Slave mode, the clock line must match the proper Idle state. The clock line can be observed by reading the SCK pin. The Idle state is determined by the CKP bit of the SSPCON1 register. While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the electrical specifications. While in Sleep mode, the slave can transmit/receive data. When a byte is received, the device will wake-up from Sleep. 15.2.7 SLAVE SELECT SYNCHRONIZATION The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON1<3:0> = 0100). When the SS pin is low, transmission and reception are enabled and the SDO pin is driven. When the SS pin goes high, the SDO pin is no longer driven, even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable depending on the application. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. FIGURE 15-4: SLAVE SYNCHRONIZATION WAVEFORM Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON<3:0> = 0100), the SPI module will reset if the SS pin is set to VDD. 2: When the SPI is used in Slave mode with CKE set the SS pin control must also be enabled. SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 7 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag bit 0 bit 7 bit 0 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 142 Preliminary © 2009 Microchip Technology Inc. FIGURE 15-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) FIGURE 15-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Optional bit 0 SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 1) CKE = 1) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Not Optional © 2009 Microchip Technology Inc. Preliminary DS41350C-page 143 PIC18F1XK50/PIC18LF1XK50 15.2.8 OPERATION IN POWER-MANAGED MODES In SPI Master mode, module clocks may be operating at a different speed than when in full power mode; in the case of the Sleep mode, all clocks are halted. In all Idle modes, a clock is provided to the peripherals. That clock could be from the primary clock source, the secondary clock (Timer1 oscillator at 32.768 kHz) or the INTOSC source. See Section 19.0 “Power-Managed Modes” for additional information. In most cases, the speed that the master clocks SPI data is not important; however, this should be evaluated for each system. When MSSP interrupts are enabled, after the master completes sending data, an MSSP interrupt will wake the controller: • from Sleep, in slave mode • from Idle, in slave or master mode If an exit from Sleep or Idle mode is not desired, MSSP interrupts should be disabled. In SPI master mode, when the Sleep mode is selected, all module clocks are halted and the transmission/reception will remain in that state until the devices wakes. After the device returns to Run mode, the module will resume transmitting and receiving data. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in any power-managed mode and data to be shifted into the SPI Transmit/Receive Shift register. When all 8 bits have been received, the MSSP interrupt flag bit will be set and if enabled, will wake the device. 15.2.9 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 15.2.10 BUS MODE COMPATIBILITY Table 15-1 shows the compatibility between the standard SPI modes and the states of the CKP and CKE control bits. TABLE 15-1: SPI BUS MODES There is also an SMP bit which controls when the data is sampled. TABLE 15-2: REGISTERS ASSOCIATED WITH SPI OPERATION Standard SPI Mode Terminology Control Bits State CKP CKE 0, 0 0 1 0, 1 0 0 1, 0 1 1 1, 1 1 0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 TRISB TRISB7 TRISB6 TRISB5 TRISB4 — — — — 282 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 SSPBUF SSP Receive Buffer/Transmit Register 280 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 280 SSPSTAT SMP CKE D/A P S R/W UA BF 280 Legend: Shaded cells are not used by the MSSP in SPI mode. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 144 Preliminary © 2009 Microchip Technology Inc. 15.3 I2C Mode The MSSP module in I2C mode fully implements all master and slave functions (including general call support) and provides interrupts on Start and Stop bits in hardware to determine a free bus (multi-master function). The MSSP module implements the standard mode specifications as well as 7-bit and 10-bit addressing. Two pins are used for data transfer: • Serial clock – SCL • Serial data – SDA FIGURE 15-7: MSSP BLOCK DIAGRAM (I2C™ MODE) 15.3.1 REGISTERS The MSSP module has seven registers for I2C operation. These are: • MSSP Control Register 1 (SSPCON1) • MSSP Control Register 2 (SSPCON2) • MSSP Status register (SSPSTAT) • Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible • MSSP Address Register (SSPADD) • MSSP Address Mask (SSPMSK) SSPCON1, SSPCON2 and SSPSTAT are the control and STATUS registers in I2C mode operation. The SSPCON1 and SSPCON2 registers are readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. When the MSSP is configured in Master mode, the SSPADD register acts as the Baud Rate Generator reload value. When the MSSP is configured for I2C slave mode the SSPADD register holds the slave device address. The MSSP can be configured to respond to a range of addresses by qualifying selected bits of the address register with the SSPMSK register. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not double-buffered. A write to SSPBUF will write to both SSPBUF and SSPSR. Note: The user must configure these pins as inputs with the corresponding TRIS bits. Read Write SSPSR Reg Match Detect SSPADD Reg Start and Stop bit Detect SSPBUF Reg Internal Data Bus Addr Match Set, Reset S, P bits (SSPSTAT Reg) SCK/SCL SDI/SDA Shift Clock MSb LSb SSPMSK Reg © 2009 Microchip Technology Inc. Preliminary DS41350C-page 145 PIC18F1XK50/PIC18LF1XK50 REGISTER 15-3: SSPSTAT: MSSP STATUS REGISTER (I2C MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P(1) S(1) R/W(2, 3) UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SMP: Slew Rate Control bit In Master or Slave mode: 1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high-speed mode (400 kHz) bit 6 CKE: SMBus Select bit In Master or Slave mode: 1 = Enable SMBus specific inputs 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit In Master mode: Reserved. In Slave mode: 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received was an address bit 4 P: Stop bit(1) 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last bit 3 S: Start bit(1) 1 = Indicates that a Start bit has been detected last 0 = Start bit was not detected last bit 2 R/W: Read/Write Information bit (I2C mode only)(2, 3) In Slave mode: 1 = Read 0 = Write In Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress bit 1 UA: Update Address bit (10-bit Slave mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit In Transmit mode: 1 = SSPBUF is full 0 = SSPBUF is empty In Receive mode: 1 = SSPBUF is full (does not include the ACK and Stop bits) 0 = SSPBUF is empty (does not include the ACK and Stop bits) Note 1: This bit is cleared on Reset and when SSPEN is cleared. 2: This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit or not ACK bit. 3: ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the Master mode is active. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 146 Preliminary © 2009 Microchip Technology Inc. REGISTER 15-4: SSPCON1: MSSP CONTROL 1 REGISTER (I2C MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 WCOL: Write Collision Detect bit In Master Transmit mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started (must be cleared by software) 0 = No collision In Slave Transmit mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared by software) 0 = No collision In Receive mode (Master or Slave modes): This is a “don’t care” bit. bit 6 SSPOV: Receive Overflow Indicator bit In Receive mode: 1 = A byte is received while the SSPBUF register is still holding the previous byte (must be cleared by software) 0 = No overflow In Transmit mode: This is a “don’t care” bit in Transmit mode. bit 5 SSPEN: Synchronous Serial Port Enable bit 1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins 0 = Disables serial port and configures these pins as I/O port pins When enabled, the SDA and SCL pins must be properly configured as inputs. bit 4 CKP: SCK Release Control bit In Slave mode: 1 = Release clock 0 = Holds clock low (clock stretch), used to ensure data setup time In Master mode: Unused in this mode. bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1011 = I2C Firmware Controlled Master mode (Slave Idle) 1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1)) 0111 = I2C Slave mode, 10-bit address 0110 = I2C Slave mode, 7-bit address Bit combinations not specifically listed here are either reserved or implemented in SPI mode only. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 147 PIC18F1XK50/PIC18LF1XK50 REGISTER 15-5: SSPCON2: MSSP CONTROL REGISTER (I2C MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GCEN ACKSTAT ACKDT(2) ACKEN(1) RCEN(1) PEN(1) RSEN(1) SEN(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GCEN: General Call Enable bit (Slave mode only) 1 = Generate interrupt when a general call address 0x00 or 00h is received in the SSPSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only) 1 = Acknowledge was not received from slave 0 = Acknowledge was received from slave bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only)(2) 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (Master Receive mode only)(1) 1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence Idle bit 3 RCEN: Receive Enable bit (Master mode only)(1) 1 = Enables Receive mode for I2C 0 = Receive Idle bit 2 PEN: Stop Condition Enable bit (Master mode only)(1) 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enable bit (Master mode only)(1) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enable/Stretch Enable bit(1) In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, these bits may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). 2: Value that will be transmitted when the user initiates an Acknowledge sequence at the end of a receive. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 148 Preliminary © 2009 Microchip Technology Inc. 15.3.2 OPERATION The MSSP module functions are enabled by setting SSPEN bit of the SSPCON1 register. The SSPCON1 register allows control of the I2C operation. Four mode selection bits of the SSPCON1 register allow one of the following I2C modes to be selected: • I2C Master mode, clock = (FOSC/(4*(SSPADD + 1)) • I2C Slave mode (7-bit address) • I2C Slave mode (10-bit address) • I2C Slave mode (7-bit address) with Start and Stop bit interrupts enabled • I2C Slave mode (10-bit address) with Start and Stop bit interrupts enabled • I2C Firmware Controlled Master mode, slave is Idle Selection of any I2C mode with the SSPEN bit set, forces the SCL and SDA pins to be open-drain, provided these pins are programmed to inputs by setting the appropriate TRIS bits 15.3.3 SLAVE MODE In Slave mode, the SCL and SDA pins must be configured as inputs. The MSSP module will override the input state with the output data when required (slave-transmitter). The I2C Slave mode hardware will always generate an interrupt on an address match. Through the mode select bits, the user can also choose to interrupt on Start and Stop bits When an address is matched, or the data transfer after an address match is received, the hardware automatically will generate the Acknowledge (ACK) pulse and load the SSPBUF register with the received value currently in the SSPSR register. Any combination of the following conditions will cause the MSSP module not to give this ACK pulse: • The Buffer Full bit, BF bit of the SSPSTAT register, is set before the transfer is received. • The overflow bit, SSPOV bit of the SSPCON1 register, is set before the transfer is received. In this case, the SSPSR register value is not loaded into the SSPBUF, but bit SSPIF of the PIR1 register is set. The BF bit is cleared by reading the SSPBUF register, while bit SSPOV is cleared through software. The SCL clock input must have a minimum high and low for proper operation. The high and low times of the I 2C specification, as well as the requirement of the MSSP module, are shown in Section 27.0 “Electrical Specifications”. 15.3.3.1 Addressing Once the MSSP module has been enabled, it waits for a Start condition to occur. Following the Start condition, the 8 bits are shifted into the SSPSR register. All incoming bits are sampled with the rising edge of the clock (SCL) line. The value of register SSPSR<7:1> is compared to the value of the SSPADD register. The address is compared on the falling edge of the eighth clock (SCL) pulse. If the addresses match and the BF and SSPOV bits are clear, the following events occur: 1. The SSPSR register value is loaded into the SSPBUF register. 2. The Buffer Full bit, BF, is set. 3. An ACK pulse is generated. 4. MSSP Interrupt Flag bit, SSPIF of the PIR1 register, is set (interrupt is generated, if enabled) on the falling edge of the ninth SCL pulse. In 10-bit Address mode, two address bytes need to be received by the slave. The five Most Significant bits (MSbs) of the first address byte specify if this is a 10-bit address. Bit R/W of the SSPSTAT register must specify a write so the slave device will receive the second address byte. For a 10-bit address, the first byte would equal ‘11110 A9 A8 0’, where ‘A9’ and ‘A8’ are the two MSbs of the address. The sequence of events for 10-bit address is as follows, with steps 7 through 9 for the slave-transmitter: 1. Receive first (high) byte of address (bits SSPIF, BF and UA of the SSPSTAT register are set). 2. Read the SSPBUF register (clears bit BF) and clear flag bit, SSPIF. 3. Update the SSPADD register with second (low) byte of address (clears bit UA and releases the SCL line). 4. Receive second (low) byte of address (bits SSPIF, BF and UA are set). If the address matches then the SCL is held until the next step. Otherwise the SCL line is not held. 5. Read the SSPBUF register (clears bit BF) and clear flag bit, SSPIF. 6. Update the SSPADD register with the first (high) byte of address. (This will clear bit UA and release a held SCL line.) 7. Receive Repeated Start condition. 8. Receive first (high) byte of address with R/W bit set (bits SSPIF, BF, R/W are set). 9. Read the SSPBUF register (clears bit BF) and clear flag bit, SSPIF. 10. Load SSPBUF with byte the slave is to transmit, sets the BF bit. 11. Set the CKP bit to release SCL. Note: To ensure proper operation of the module, pull-up resistors must be provided externally to the SCL and SDA pins. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 149 PIC18F1XK50/PIC18LF1XK50 15.3.3.2 Reception When the R/W bit of the address byte is clear and an address match occurs, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and the SDA line is held low (ACK). When the address byte overflow condition exists, then the no Acknowledge (ACK) pulse is given. An overflow condition is defined as either bit BF bit of the SSPSTAT register is set, or bit SSPOV bit of the SSPCON1 register is set. An MSSP interrupt is generated for each data transfer byte. Flag bit, SSPIF of the PIR1 register, must be cleared by software. When the SEN bit of the SSPCON2 register is set, SCL will be held low (clock stretch) following each data transfer. The clock must be released by setting the CKP bit of the SSPCON1 register. See Section 15.3.4 “Clock Stretching” for more detail. 15.3.3.3 Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register. The ACK pulse will be sent on the ninth bit and pin SCK/SCL is held low regardless of SEN (see Section 15.3.4 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then pin SCK/SCL should be released by setting the CKP bit of the SSPCON1 register. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time (Figure 15-9). The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. If the SDA line is high (not ACK), then the data transfer is complete. In this case, when the ACK is latched by the slave, the slave logic is reset (resets SSPSTAT register) and the slave monitors for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, pin SCK/SCL must be released by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared by software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 150 Preliminary © 2009 Microchip Technology Inc. FIGURE 15-8: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) S 1 234 567 89 1 2 34 5 67 89 1 23 45 7 89 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 ACK Receiving Data ACK Receiving Data R/W = 0 ACK Receiving Address Cleared by software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP (CKP does not reset to ‘0’ when SEN = 0) © 2009 Microchip Technology Inc. Preliminary DS41350C-page 151 PIC18F1XK50/PIC18LF1XK50 FIGURE 15-9: I2C™ SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESS) SDA SCL SSPIF (PIR1<3>) BF (SSPSTAT<0>) A6 A5 A4 A3 A2 A1 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9 SSPBUF is written by software Cleared by software From SSPIF ISR Data in sampled S ACK Transmitting Data R/W = 0 ACK Receiving Address A7 D7 9 1 D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 SSPBUF is written by software Cleared by software From SSPIF ISR Transmitting Data D7 1 CKP P ACK CKP is set by software CKP is set by software SCL held low while CPU responds to SSPIF SSPBUF is read by software Bus master terminates software PIC18F1XK50/PIC18LF1XK50 DS41350C-page 152 Preliminary © 2009 Microchip Technology Inc. FIGURE 15-10: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1234 567 89 12 345 67 89 1 2345 7 89 P 1 111 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared by software D2 6 (PIR1<3>) Cleared by software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP D7 D6 D5 D4 D3 D1 D0 12345 789 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared by software Cleared by software SSPOV (SSPCON1<6>) SSPOV is set because SSPBUF is still full. ACK is not sent. (CKP does not reset to ‘0’ when SEN = 0) Clock is held low until update of SSPADD has taken place © 2009 Microchip Technology Inc. Preliminary DS41350C-page 153 PIC18F1XK50/PIC18LF1XK50 FIGURE 15-11: I2C™ SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESS) SDA SCL SSPIF BF S 1 234 56 7 89 1 2345 67 89 1 2345 7 89 P 1 111 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 11110 A8 R/W=1 ACK ACK R/W = 0 ACK Receive First Byte of Address Cleared in software Bus Master sends Stop condition A9 6 Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address. UA Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address. SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag Receive First Byte of Address D7 D6 D5 D4 D3 D1 12345 789 ACK D2 6 Transmitting Data Byte D0 Dummy read of SSPBUF to clear BF flag Sr Cleared in software Write of SSPBUF Cleared in software Completion of clears BF flag CKP CKP is set in software, initiates transmission CKP is automatically cleared in hardware holding SCL low Clock is held low until update of SSPADD has taken place data transmission Clock is held low until CKP is set to ‘1’ Bus Master sends Restarts condition Dummy read of SSPBUF to clear BF flag PIC18F1XK50/PIC18LF1XK50 DS41350C-page 154 Preliminary © 2009 Microchip Technology Inc. 15.3.3.4 SSP Mask Register An SSP Mask (SSPMSK) register is available in I2C Slave mode as a mask for the value held in the SSPSR register during an address comparison operation. A zero (‘0’) bit in the SSPMSK register has the effect of making the corresponding bit in the SSPSR register a “don’t care”. This register is reset to all ‘1’s upon any Reset condition and, therefore, has no effect on standard SSP operation until written with a mask value. This register must be initiated prior to setting SSPM<3:0> bits to select the I2C Slave mode (7-bit or 10-bit address). The SSP Mask register is active during: • 7-bit Address mode: address compare of A<7:1>. • 10-bit Address mode: address compare of A<7:0> only. The SSP mask has no effect during the reception of the first (high) byte of the address. REGISTER 15-6: SSPMSK: SSP MASK REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-1 MSK<7:1>: Mask bits 1 = The received address bit n is compared to SSPADD to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address(1) I 2C Slave mode, 10-bit Address (SSPM<3:0> = 0111): 1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match Note 1: The MSK0 bit is used only in 10-bit slave mode. In all other modes, this bit has no effect. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 155 PIC18F1XK50/PIC18LF1XK50 REGISTER 15-7: SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER (I2C MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Master mode: bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits SCL pin clock period = ((ADD<7:0> + 1) *4)/FOSC 10-Bit Slave mode — Most significant address byte: bit 7-3 Not used: Unused for Most Significant Address Byte. Bit state of this register is a “don’t care.” Bit pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD<9:8>: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care.” 10-Bit Slave mode — Least significant address byte: bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD<6:0>: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care.” PIC18F1XK50/PIC18LF1XK50 DS41350C-page 156 Preliminary © 2009 Microchip Technology Inc. 15.3.4 CLOCK STRETCHING Both 7-bit and 10-bit Slave modes implement automatic clock stretching during a transmit sequence. The SEN bit of the SSPCON2 register allows clock stretching to be enabled during receives. Setting SEN will cause the SCL pin to be held low at the end of each data receive sequence. 15.3.4.1 Clock Stretching for 7-bit Slave Receive Mode (SEN = 1) In 7-bit Slave Receive mode, on the falling edge of the ninth clock at the end of the ACK sequence if the BF bit is set, the CKP bit of the SSPCON1 register is automatically cleared, forcing the SCL output to be held low. The CKP being cleared to ‘0’ will assert the SCL line low. The CKP bit must be set in the user’s ISR before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the SSPBUF before the master device can initiate another data transfer sequence. This will prevent buffer overruns from occurring (see Figure 15-13). 15.3.4.2 Clock Stretching for 10-bit Slave Receive Mode (SEN = 1) In 10-bit Slave Receive mode during the address sequence, clock stretching automatically takes place but CKP is not cleared. During this time, if the UA bit is set after the ninth clock, clock stretching is initiated. The UA bit is set after receiving the upper byte of the 10-bit address and following the receive of the second byte of the 10-bit address with the R/W bit cleared to ‘0’. The release of the clock line occurs upon updating SSPADD. Clock stretching will occur on each data receive sequence as described in 7-bit mode. 15.3.4.3 Clock Stretching for 7-bit Slave Transmit Mode 7-bit Slave Transmit mode implements clock stretching by clearing the CKP bit after the falling edge of the ninth clock. This occurs regardless of the state of the SEN bit. The user’s ISR must set the CKP bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the SSPBUF before the master device can initiate another data transfer sequence (see Figure 15-9). 15.3.4.4 Clock Stretching for 10-bit Slave Transmit Mode In 10-bit Slave Transmit mode, clock stretching is controlled during the first two address sequences by the state of the UA bit, just as it is in 10-bit Slave Receive mode. The first two addresses are followed by a third address sequence which contains the high-order bits of the 10-bit address and the R/W bit set to ‘1’. After the third address sequence is performed, the UA bit is not set, the module is now configured in Transmit mode and clock stretching is automatic with the hardware clearing CKP, as in 7-bit Slave Transmit mode (see Figure 15-11). Note 1: If the user reads the contents of the SSPBUF before the falling edge of the ninth clock, thus clearing the BF bit, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set by software regardless of the state of the BF bit. The user should be careful to clear the BF bit in the ISR before the next receive sequence in order to prevent an overflow condition. Note 1: If the user loads the contents of SSPBUF, setting the BF bit before the falling edge of the ninth clock, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set by software regardless of the state of the BF bit. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 157 PIC18F1XK50/PIC18LF1XK50 15.3.4.5 Clock Synchronization and the CKP bit When the CKP bit is cleared, the SCL output is forced to ‘0’. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have deasserted SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 15-12). FIGURE 15-12: CLOCK SYNCHRONIZATION TIMING SDA SCL DX DX – 1 WR Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SSPCON1 CKP Master device deasserts clock Master device asserts clock PIC18F1XK50/PIC18LF1XK50 DS41350C-page 158 Preliminary © 2009 Microchip Technology Inc. FIGURE 15-13: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) S 1 2 34 56 7 8 9 1 234 5 67 89 1 23 45 7 89 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 ACK Receiving Data ACK Receiving Data R/W = 0 ACK Receiving Address Cleared by software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP CKP written to ‘1’ in If BF is cleared prior to the falling edge of the 9th clock, CKP will not be reset to ‘0’ and no clock stretching will occur software Clock is held low until CKP is set to ‘1’ Clock is not held low because buffer full bit is clear prior to falling edge of 9th clock Clock is not held low because ACK = 1 BF is set after falling edge of the 9th clock, CKP is reset to ‘0’ and clock stretching occurs © 2009 Microchip Technology Inc. Preliminary DS41350C-page 159 PIC18F1XK50/PIC18LF1XK50 FIGURE 15-14: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 234 56 7 89 12345 67 89 1 2345 78 9 P 1 111 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared by software D2 6 (PIR1<3>) Cleared by software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address after falling edge UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address after falling edge SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP D7 D6 D5 D4 D3 D1 D0 12345 789 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared by software Cleared by software SSPOV (SSPCON1<6>) CKP written to ‘1’ Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. by software Clock is held low until update of SSPADD has taken place of ninth clock of ninth clock SSPOV is set because SSPBUF is still full. ACK is not sent. Dummy read of SSPBUF to clear BF flag Clock is held low until CKP is set to ‘1’ Clock is not held low because ACK = 1 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 160 Preliminary © 2009 Microchip Technology Inc. 15.3.5 GENERAL CALL ADDRESS SUPPORT The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R/W = 0. The general call address is recognized when the GCEN bit of the SSPCON2 is set. Following a Start bit detect, 8 bits are shifted into the SSPSR and the address is compared against the SSPADD. It is also compared to the general call address and fixed in hardware. If the general call address matches, the SSPSR is transferred to the SSPBUF, the BF flag bit is set (eighth bit) and on the falling edge of the ninth bit (ACK bit), the SSPIF interrupt flag bit is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the SSPBUF. The value can be used to determine if the address was device specific or a general call address. In 10-bit mode, the SSPADD is required to be updated for the second half of the address to match and the UA bit of the SSPSTAT register is set. If the general call address is sampled when the GCEN bit is set, while the slave is configured in 10-bit Address mode, then the second half of the address is not necessary, the UA bit will not be set and the slave will begin receiving data after the Acknowledge (Figure 15-15). FIGURE 15-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESS MODE) SDA SCL S SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) Cleared by software SSPBUF is read R/W = 0 ACK General Call Address Address is compared to General Call Address GCEN (SSPCON2<7>) Receiving Data ACK 1 2 34 56 7891 2 34 56 789 D7 D6 D5 D4 D3 D2 D1 D0 after ACK, set interrupt ‘0’ ‘1’ © 2009 Microchip Technology Inc. Preliminary DS41350C-page 161 PIC18F1XK50/PIC18LF1XK50 15.3.6 MASTER MODE Master mode is enabled by setting and clearing the appropriate SSPM bits in SSPCON1 and by setting the SSPEN bit. In Master mode, the SCL and SDA lines are manipulated by the MSSP hardware. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit is set, or the bus is Idle, with both the S and P bits clear. In Firmware Controlled Master mode, user code conducts all I2C bus operations based on Start and Stop bit conditions. Once Master mode is enabled, the user has six options. 1. Assert a Start condition on SDA and SCL. 2. Assert a Repeated Start condition on SDA and SCL. 3. Write to the SSPBUF register initiating transmission of data/address. 4. Configure the I2C port to receive data. 5. Generate an Acknowledge condition at the end of a received byte of data. 6. Generate a Stop condition on SDA and SCL. The following events will cause the SSP Interrupt Flag bit, SSPIF, to be set (SSP interrupt, if enabled): • Start condition • Stop condition • Data transfer byte transmitted/received • Acknowledge transmit • Repeated Start FIGURE 15-16: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE) Note: The MSSP module, when configured in I 2C Master mode, does not allow queueing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. Read Write SSPSR Start bit, Stop bit, SSPBUF Internal Data Bus Set/Reset, S, P, WCOL Shift Clock MSb LSb SDA Acknowledge Generate Stop bit Detect Write Collision Detect Clock Arbitration State Counter for end of XMIT/RCV SCL SCL In Bus Collision SDA In Receive Enable Clock Cntl Clock Arbitrate/WCOL Detect (hold off clock source) SSPADD<6:0> Baud Set SSPIF, BCLIF Reset ACKSTAT, PEN Rate Generator SSPM<3:0> Start bit Detect PIC18F1XK50/PIC18LF1XK50 DS41350C-page 162 Preliminary © 2009 Microchip Technology Inc. 15.3.6.1 I2C Master Mode Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. A Baud Rate Generator is used to set the clock frequency output on SCL. See Section 15.3.7 “Baud Rate” for more detail. A typical transmit sequence would go as follows: 1. The user generates a Start condition by setting the SEN bit of the SSPCON2 register. 2. SSPIF is set. The MSSP module will wait the required start time before any other operation takes place. 3. The user loads the SSPBUF with the slave address to transmit. 4. Address is shifted out the SDA pin until all 8 bits are transmitted. 5. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. 6. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 7. The user loads the SSPBUF with eight bits of data. 8. Data is shifted out the SDA pin until all 8 bits are transmitted. 9. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. 10. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 11. The user generates a Stop condition by setting the PEN bit of the SSPCON2 register. 12. Interrupt is generated once the Stop condition is complete. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 163 PIC18F1XK50/PIC18LF1XK50 15.3.7 BAUD RATE In I2C Master mode, the Baud Rate Generator (BRG) reload value is placed in the SSPADD register (Figure 15-17). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting. Once the given operation is complete (i.e., transmission of the last data bit is followed by ACK), the internal clock will automatically stop counting and the SCL pin will remain in its last state. Table 15-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. EQUATION 15-1: FIGURE 15-17: BAUD RATE GENERATOR BLOCK DIAGRAM TABLE 15-3: I2C™ CLOCK RATE W/BRG FSCL FOSC ( ) SSPADD 1 + ( ) 4 = ---------------------------------------------- SSPM<3:0> CLKOUT BRG Down Counter FOSC/2 SSPADD<7:0> SSPM<3:0> SCL Reload Control Reload FOSC FCY BRG Value FSCL (2 Rollovers of BRG) 48 MHz 12 MHz 0Bh 1 MHz(1) 48 MHz 12 MHz 1Dh 400 kHz 48 MHz 12 MHz 77h 100 kHz 40 MHz 10 MHz 18h 400 kHz(1) 40 MHz 10 MHz 1Fh 312.5 kHz 40 MHz 10 MHz 63h 100 kHz 16 MHz 4 MHz 09h 400 kHz(1) 16 MHz 4 MHz 0Ch 308 kHz 16 MHz 4 MHz 27h 100 kHz 4 MHz 1 MHz 02h 333 kHz(1) 4 MHz 1 MHz 09h 100 kHz 4 MHz 1 MHz 00h 1 MHz(1) Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 164 Preliminary © 2009 Microchip Technology Inc. 15.3.7.1 Clock Arbitration Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, deasserts the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 15-18). FIGURE 15-18: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA SCL SCL deasserted but slave holds DX DX – 1 BRG SCL is sampled high, reload takes place and BRG starts its count 03h 02h 01h 00h (hold off) 03h 02h Reload BRG Value SCL low (clock arbitration) SCL allowed to transition high BRG decrements on Q2 and Q4 cycles © 2009 Microchip Technology Inc. Preliminary DS41350C-page 165 PIC18F1XK50/PIC18LF1XK50 15.3.8 I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start Enable bit, SEN bit of the SSPCON2 register. If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low while SCL is high is the Start condition and causes the S bit of the SSPSTAT1 register to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<7:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit of the SSPCON2 register will be automatically cleared by hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. 15.3.8.1 WCOL Status Flag If the user writes the SSPBUF when a Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 15-19: FIRST START BIT TIMING Note: If at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I 2C module is reset into its Idle state. Note: Because queueing of events is not allowed, writing to the lower 5 bits of SSPCON2 is disabled until the Start condition is complete. SDA SCL S TBRG 1st bit 2nd bit TBRG SDA = 1, At completion of Start bit, SCL = 1 TBRG Write to SSPBUF occurs here hardware clears SEN bit TBRG Write to SEN bit occurs here Set S bit (SSPSTAT<3>) and sets SSPIF bit PIC18F1XK50/PIC18LF1XK50 DS41350C-page 166 Preliminary © 2009 Microchip Technology Inc. 15.3.9 I2C MASTER MODE REPEATED START CONDITION TIMING A Repeated Start condition occurs when the RSEN bit of the SSPCON2 register is programmed high and the I 2C logic module is in the Idle state. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. Following this, the RSEN bit of the SSPCON2 register will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit of the SSPSTAT register will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. Immediately following the SSPIF bit getting set, the user may write the SSPBUF with the 7-bit address in 7-bit mode or the default first address in 10-bit mode. After the first eight bits are transmitted and an ACK is received, the user may then transmit an additional eight bits of address (10-bit mode) or eight bits of data (7-bit mode). 15.3.9.1 WCOL Status Flag If the user writes the SSPBUF when a Repeated Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 15-20: REPEAT START CONDITION WAVEFORM Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. 2: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low-to-high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. Note: Because queueing of events is not allowed, writing of the lower 5 bits of SSPCON2 is disabled until the Repeated Start condition is complete. SDA SCL Sr = Repeated Start Write to SSPCON2 Write to SSPBUF occurs here on falling edge of ninth clock, end of Xmit At completion of Start bit, hardware clears RSEN bit 1st bit S bit set by hardware TBRG TBRG SDA = 1, SDA = 1, SCL (no change). SCL = 1 occurs here. TBRG TBRG TBRG and sets SSPIF RSEN bit set by hardware © 2009 Microchip Technology Inc. Preliminary DS41350C-page 167 PIC18F1XK50/PIC18LF1XK50 15.3.10 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full flag bit, BF and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted (see data hold time specification parameter SP106). SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high (see data setup time specification parameter SP107). When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received properly. The status of ACK is written into the ACKDT bit on the falling edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 15-21). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will deassert the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit of the SSPCON2 register. Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 15.3.10.1 BF Status Flag In Transmit mode, the BF bit of the SSPSTAT register is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. 15.3.10.2 WCOL Status Flag If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). WCOL must be cleared by software before the next transmission. 15.3.10.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit of the SSPCON2 register is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call), or when the slave has properly received its data. 15.3.11 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN bit of the SSPCON2 register. The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-to-low/low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable, ACKEN bit of the SSPCON2 register. 15.3.11.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 15.3.11.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 15.3.11.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 168 Preliminary © 2009 Microchip Technology Inc. FIGURE 15-21: I2C™ MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SEN A7 A6 A5 A4 A3 A2 A1 ACK = 0 D7 D6 D5 D4 D3 D2 D1 D0 ACK Transmitting Data or Second Half R/W = 0 Transmit Address to Slave 123456789 123456789 P Cleared by software service routine from SSP interrupt SSPBUF is written by software After Start condition, SEN cleared by hardware S SSPBUF written with 7-bit address and R/W start transmit SCL held low while CPU responds to SSPIF SEN = 0 of 10-bit Address Write SSPCON2<0> SEN = 1 Start condition begins From slave, clear ACKSTAT bit SSPCON2<6> ACKSTAT in SSPCON2 = 1 Cleared by software SSPBUF written PEN R/W Cleared by software © 2009 Microchip Technology Inc. Preliminary DS41350C-page 169 PIC18F1XK50/PIC18LF1XK50 FIGURE 15-22: I2C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) P 9 8 7 6 5 D0 D1 D2 D3 D4 D5 D6 D7 S A7 A6 A5 A4 A3 A2 A1 SDA SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 678 9 1234 Bus master terminates transfer ACK Receiving Data from Slave Receiving Data from Slave D0 D1 D2 D3 D4 D5 D6 D7 ACK R/W = 0 Transmit Address to Slave SSPIF BF ACK is not sent Write to SSPCON2<0> (SEN = 1), Write to SSPBUF occurs here, ACK from Slave Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) PEN bit = 1 written here Data shifted in on falling edge of CLK Cleared by software start XMIT SEN = 0 SSPOV SDA = 0, SCL = 1 while CPU (SSPSTAT<0>) ACK Cleared by software Cleared by software Set SSPIF interrupt at end of receive Set P bit (SSPSTAT<4>) and SSPIF Cleared in software ACK from Master Set SSPIF at end Set SSPIF interrupt at end of Acknowledge sequence Set SSPIF interrupt at end of Acknowledge sequence of receive Set ACKEN, start Acknowledge sequence SSPOV is set because SSPBUF is still full SDA = ACKDT = 1 RCEN cleared automatically RCEN = 1, start next receive Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 RCEN cleared automatically responds to SSPIF ACKEN begin Start condition Cleared by software SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF RCEN Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) RCEN cleared automatically ACK from Master SDA = ACKDT = 0 RCEN cleared automatically PIC18F1XK50/PIC18LF1XK50 DS41350C-page 170 Preliminary © 2009 Microchip Technology Inc. 15.3.12 ACKNOWLEDGE SEQUENCE TIMING An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN bit of the SSPCON2 register. When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 15-23). 15.3.12.1 WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). 15.3.13 STOP CONDITION TIMING A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN bit of the SSPCON2 register. At the end of a receive/transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to ‘0’. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit of the SSPSTAT register is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 15-24). 15.3.13.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 15-23: ACKNOWLEDGE SEQUENCE WAVEFORM FIGURE 15-24: STOP CONDITION RECEIVE OR TRANSMIT MODE Note: TBRG = one Baud Rate Generator period. SDA SCL SSPIF set at Acknowledge sequence starts here, write to SSPCON2 ACKEN automatically cleared Cleared in TBRG TBRG the end of receive 8 ACKEN = 1, ACKDT = 0 D0 9 SSPIF software SSPIF set at the end of Acknowledge sequence Cleared in software ACK SCL SDA SDA asserted low before rising edge of clock Write to SSPCON2, set PEN Falling edge of SCL = 1 for TBRG, followed by SDA = 1 for TBRG 9th clock SCL brought high after TBRG Note: TBRG = one Baud Rate Generator period. TBRG TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. TBRG to setup Stop condition ACK P TBRG PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set © 2009 Microchip Technology Inc. Preliminary DS41350C-page 171 PIC18F1XK50/PIC18LF1XK50 15.3.14 SLEEP OPERATION While in Sleep mode, the I2C Slave module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 15.3.15 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 15.3.16 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit of the SSPSTAT register is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed by hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • Address Transfer • Data Transfer • A Start Condition • A Repeated Start Condition • An Acknowledge Condition 15.3.17 MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA, by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF and reset the I 2C port to its Idle state (Figure 15-25). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared. FIGURE 15-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE SDA SCL BCLIF SDA released SDA line pulled low by another source Sample SDA. While SCL is high, data doesn’t match what is driven Bus collision has occurred. Set bus collision interrupt (BCLIF) by the master. by master Data changes while SCL = 0 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 172 Preliminary © 2009 Microchip Technology Inc. 15.3.17.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) SDA or SCL are sampled low at the beginning of the Start condition (Figure 15-26). b) SCL is sampled low before SDA is asserted low (Figure 15-27). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted, • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 15-26). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded and counts down. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 15-28). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to 0; if the SCL pin is sampled as ‘0’ during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. FIGURE 15-26: BUS COLLISION DURING START CONDITION (SDA ONLY) Note: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. SDA SCL SEN SDA sampled low before SDA goes low before the SEN bit is set. S bit and SSPIF set because SSP module reset into Idle state. SEN cleared automatically because of bus collision. S bit and SSPIF set because Set SEN, enable Start condition if SDA = 1, SCL = 1 SDA = 0, SCL = 1. BCLIF S SSPIF SDA = 0, SCL = 1. SSPIF and BCLIF are cleared by software SSPIF and BCLIF are cleared by software Set BCLIF, Start condition. Set BCLIF. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 173 PIC18F1XK50/PIC18LF1XK50 FIGURE 15-27: BUS COLLISION DURING START CONDITION (SCL = 0) FIGURE 15-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA SCL SEN bus collision occurs. Set BCLIF. SCL = 0 before SDA = 0, Set SEN, enable Start sequence if SDA = 1, SCL = 1 TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF Interrupt cleared by software bus collision occurs. Set BCLIF. SCL = 0 before BRG time-out, ‘0’ ‘0’ ‘0’ ‘0’ SDA SCL SEN Set S Less than TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF S Interrupts cleared set SSPIF by software SDA = 0, SCL = 1, SCL pulled low after BRG time-out Set SSPIF ‘0’ SDA pulled low by other master. Reset BRG and assert SDA. Set SEN, enable START sequence if SDA = 1, SCL = 1 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 174 Preliminary © 2009 Microchip Technology Inc. 15.3.17.2 Bus Collision During a Repeated Start Condition During a Repeated Start condition, a bus collision occurs if: a) A low level is sampled on SDA when SCL goes from low level to high level. b) SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. When the user deasserts SDA and the pin is allowed to float high, the BRG is loaded with SSPADD and counts down to 0. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 15-29). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition, see Figure 15-30. If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. FIGURE 15-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) FIGURE 15-30: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) SDA SCL RSEN BCLIF S SSPIF Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. Cleared by software ‘0’ ‘0’ SDA SCL BCLIF RSEN S SSPIF Interrupt cleared by software SCL goes low before SDA, set BCLIF. Release SDA and SCL. TBRG TBRG ‘0’ © 2009 Microchip Technology Inc. Preliminary DS41350C-page 175 PIC18F1XK50/PIC18LF1XK50 15.3.17.3 Bus Collision During a Stop Condition Bus collision occurs during a Stop condition if: a) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. b) After the SCL pin is deasserted, SCL is sampled low before SDA goes high. The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 15-31). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 15-32). FIGURE 15-31: BUS COLLISION DURING A STOP CONDITION (CASE 1) FIGURE 15-32: BUS COLLISION DURING A STOP CONDITION (CASE 2) SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG SDA asserted low SDA sampled low after TBRG, set BCLIF ‘0’ ‘0’ SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG Assert SDA SCL goes low before SDA goes high, set BCLIF ‘0’ ‘0’ PIC18F1XK50/PIC18LF1XK50 DS41350C-page 176 Preliminary © 2009 Microchip Technology Inc. TABLE 15-4: SUMMARY OF REGISTERS ASSOCIATED WITH I2C™ Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR2 OSCFIP C1IP C2IP EEIP BCLIP USBIP TMR3IP – 282 PIR2 OSCFIF C1IF C2IF EEIF BCLIF USBIF TMR3IF – 282 PIE2 OSCFIE C1IE C2IE EEIE BCLIE USBIE TMR3IE – 282 SSPADD SSP Address Register in I2C™ Slave Mode. SSP Baud Rate Reload Register in I2C Master Mode. 280 SSPBUF SSP Receive Buffer/Transmit Register 280 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 280 SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 280 SSPMSK MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0 282 SSPSTAT SMP CKE D/A P S R/W UA BF 280 TRISB TRISB7 TRISB6 TRISB5 TRISB4 – – – – 282 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by I2C™. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 177 PIC18F1XK50/PIC18LF1XK50 16.0 ENHANCED UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (EUSART) The Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module is a serial I/O communications peripheral. It contains all the clock generators, shift registers and data buffers necessary to perform an input or output serial data transfer independent of device program execution. The EUSART, also known as a Serial Communications Interface (SCI), can be configured as a full-duplex asynchronous system or half-duplex synchronous system. Full-Duplex mode is useful for communications with peripheral systems, such as CRT terminals and personal computers. Half-Duplex Synchronous mode is intended for communications with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs or other microcontrollers. These devices typically do not have internal clocks for baud rate generation and require the external clock signal provided by a master synchronous device. The EUSART module includes the following capabilities: • Full-duplex asynchronous transmit and receive • Two-character input buffer • One-character output buffer • Programmable 8-bit or 9-bit character length • Address detection in 9-bit mode • Input buffer overrun error detection • Received character framing error detection • Half-duplex synchronous master • Half-duplex synchronous slave • Programmable clock and data polarity The EUSART module implements the following additional features, making it ideally suited for use in Local Interconnect Network (LIN) bus systems: • Automatic detection and calibration of the baud rate • Wake-up on Break reception • 13-bit Break character transmit Block diagrams of the EUSART transmitter and receiver are shown in Figure 16-1 and Figure 16-2. FIGURE 16-1: EUSART TRANSMIT BLOCK DIAGRAM TXIF TXIE Interrupt TXEN TX9D MSb LSb Data Bus TXREG Register Transmit Shift Register (TSR) (8) 0 TX9 TRMT SPEN TX/CK pin Pin Buffer and Control 8 SPBRGH SPBRG BRG16 FOSC ÷ n n + 1 Multiplier x4 x16 x64 SYNC 1X00 0 BRGH X110 0 BRG16 X101 0 Baud Rate Generator ••• PIC18F1XK50/PIC18LF1XK50 DS41350C-page 178 Preliminary © 2009 Microchip Technology Inc. FIGURE 16-2: EUSART RECEIVE BLOCK DIAGRAM The operation of the EUSART module is controlled through three registers: • Transmit Status and Control (TXSTA) • Receive Status and Control (RCSTA) • Baud Rate Control (BAUDCTL) These registers are detailed in Register 16-1, Register 16-2 and Register 16-3, respectively. For all modes of EUSART operation, the TRIS control bits corresponding to the RX/DT and TX/CK pins should be set to ‘1’. The EUSART control will automatically reconfigure the pin from input to output, as needed. RX/DT pin Pin Buffer and Control SPEN Data Recovery CREN OERR FERR MSb RSR Register LSb RX9D RCREG Register FIFO Interrupt RCIF RCIE Data Bus 8 Stop (8) 7 1 0 START RX9 • • • SPBRGH SPBRG BRG16 RCIDL FOSC ÷ n n + 1 Multiplier x4 x16 x64 SYNC 1X00 0 BRGH X110 0 BRG16 X101 0 Baud Rate Generator © 2009 Microchip Technology Inc. Preliminary DS41350C-page 179 PIC18F1XK50/PIC18LF1XK50 16.1 EUSART Asynchronous Mode The EUSART transmits and receives data using the standard non-return-to-zero (NRZ) format. NRZ is implemented with two levels: a VOH mark state which represents a ‘1’ data bit, and a VOL space state which represents a ‘0’ data bit. NRZ refers to the fact that consecutively transmitted data bits of the same value stay at the output level of that bit without returning to a neutral level between each bit transmission. An NRZ transmission port idles in the mark state. Each character transmission consists of one Start bit followed by eight or nine data bits and is always terminated by one or more Stop bits. The Start bit is always a space and the Stop bits are always marks. The most common data format is 8 bits. Each transmitted bit persists for a period of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud Rate Generator is used to derive standard baud rate frequencies from the system oscillator. See Table 16-5 for examples of baud rate configurations. The EUSART transmits and receives the LSb first. The EUSART’s transmitter and receiver are functionally independent, but share the same data format and baud rate. Parity is not supported by the hardware, but can be implemented in software and stored as the ninth data bit. 16.1.1 EUSART ASYNCHRONOUS TRANSMITTER The EUSART transmitter block diagram is shown in Figure 16-1. The heart of the transmitter is the serial Transmit Shift Register (TSR), which is not directly accessible by software. The TSR obtains its data from the transmit buffer, which is the TXREG register. 16.1.1.1 Enabling the Transmitter The EUSART transmitter is enabled for asynchronous operations by configuring the following three control bits: • TXEN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the TXEN bit of the TXSTA register enables the transmitter circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART and automatically configures the TX/CK I/O pin as an output. If the TX/CK pin is shared with an analog peripheral the analog I/O function must be disabled by clearing the corresponding ANSEL bit. 16.1.1.2 Transmitting Data A transmission is initiated by writing a character to the TXREG register. If this is the first character, or the previous character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR register. If the TSR still contains all or part of a previous character, the new character data is held in the TXREG until the Stop bit of the previous character has been transmitted. The pending character in the TXREG is then transferred to the TSR in one TCY immediately following the Stop bit transmission. The transmission of the Start bit, data bits and Stop bit sequence commences immediately following the transfer of the data to the TSR from the TXREG. 16.1.1.3 Transmit Data Polarity The polarity of the transmit data can be controlled with the CKTXP bit of the BAUDCON register. The default state of this bit is ‘0’ which selects high true transmit idle and data bits. Setting the CKTXP bit to ‘1’ will invert the transmit data resulting in low true idle and data bits. The CKTXP bit controls transmit data polarity only in Asynchronous mode. In Synchronous mode the CKTXP bit has a different function. 16.1.1.4 Transmit Interrupt Flag The TXIF interrupt flag bit of the PIR1 register is set whenever the EUSART transmitter is enabled and no character is being held for transmission in the TXREG. In other words, the TXIF bit is only clear when the TSR is busy with a character and a new character has been queued for transmission in the TXREG. The TXIF flag bit is not cleared immediately upon writing TXREG. TXIF becomes valid in the second instruction cycle following the write execution. Polling TXIF immediately following the TXREG write will return invalid results. The TXIF bit is read-only, it cannot be set or cleared by software. The TXIF interrupt can be enabled by setting the TXIE interrupt enable bit of the PIE1 register. However, the TXIF flag bit will be set whenever the TXREG is empty, regardless of the state of TXIE enable bit. To use interrupts when transmitting data, set the TXIE bit only when there is more data to send. Clear the TXIE interrupt enable bit upon writing the last character of the transmission to the TXREG. Note 1: When the SPEN bit is set the RX/DT I/O pin is automatically configured as an input, regardless of the state of the corresponding TRIS bit and whether or not the EUSART receiver is enabled. The RX/DT pin data can be read via a normal PORT read but PORT latch data output is precluded. 2: The TXIF transmitter interrupt flag is set when the TXEN enable bit is set. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 180 Preliminary © 2009 Microchip Technology Inc. 16.1.1.5 TSR Status The TRMT bit of the TXSTA register indicates the status of the TSR register. This is a read-only bit. The TRMT bit is set when the TSR register is empty and is cleared when a character is transferred to the TSR register from the TXREG. The TRMT bit remains clear until all bits have been shifted out of the TSR register. No interrupt logic is tied to this bit, so the user needs to poll this bit to determine the TSR status. 16.1.1.6 Transmitting 9-Bit Characters The EUSART supports 9-bit character transmissions. When the TX9 bit of the TXSTA register is set the EUSART will shift 9 bits out for each character transmitted. The TX9D bit of the TXSTA register is the ninth, and Most Significant, data bit. When transmitting 9-bit data, the TX9D data bit must be written before writing the 8 Least Significant bits into the TXREG. All nine bits of data will be transferred to the TSR shift register immediately after the TXREG is written. A special 9-bit Address mode is available for use with multiple receivers. See Section 16.1.2.8 “Address Detection” for more information on the Address mode. 16.1.1.7 Asynchronous Transmission Set-up: 1. Initialize the SPBRGH:SPBRG register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 16.3 “EUSART Baud Rate Generator (BRG)”). 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If 9-bit transmission is desired, set the TX9 control bit. A set ninth data bit will indicate that the 8 Least Significant data bits are an address when the receiver is set for address detection. 4. Set the CKTXP control bit if inverted transmit data polarity is desired. 5. Enable the transmission by setting the TXEN control bit. This will cause the TXIF interrupt bit to be set. 6. If interrupts are desired, set the TXIE interrupt enable bit. An interrupt will occur immediately provided that the GIE and PEIE bits of the INTCON register are also set. 7. If 9-bit transmission is selected, the ninth bit should be loaded into the TX9D data bit. 8. Load 8-bit data into the TXREG register. This will start the transmission. FIGURE 16-3: ASYNCHRONOUS TRANSMISSION Note: The TSR register is not mapped in data memory, so it is not available to the user. Word 1 Stop bit Word 1 Transmit Shift Reg Start bit bit 0 bit 1 bit 7/8 Write to TXREG Word 1 BRG Output (Shift Clock) RB7/TX/CK TXIF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) 1 TCY pin © 2009 Microchip Technology Inc. Preliminary DS41350C-page 181 PIC18F1XK50/PIC18LF1XK50 FIGURE 16-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK) TABLE 16-1: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 281 TXREG EUSART Transmit Register 281 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 281 BAUDCON ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN 281 SPBRGH EUSART Baud Rate Generator Register, High Byte 281 SPBRG EUSART Baud Rate Generator Register, Low Byte 281 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission. Transmit Shift Reg Write to TXREG BRG Output (Shift Clock) RB7/TX/CK TXIF bit (Interrupt Reg. Flag) TRMT bit (Transmit Shift Reg. Empty Flag) Word 1 Word 2 Word 1 Word 2 Start bit Stop bit Start bit Transmit Shift Reg Word 1 Word 2 bit 0 bit 1 bit 7/8 bit 0 Note: This timing diagram shows two consecutive transmissions. 1 TCY 1 TCY pin PIC18F1XK50/PIC18LF1XK50 DS41350C-page 182 Preliminary © 2009 Microchip Technology Inc. 16.1.2 EUSART ASYNCHRONOUS RECEIVER The Asynchronous mode would typically be used in RS-232 systems. The receiver block diagram is shown in Figure 16-2. The data is received on the RX/DT pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at 16 times the baud rate, whereas the serial Receive Shift Register (RSR) operates at the bit rate. When all 8 or 9 bits of the character have been shifted in, they are immediately transferred to a two character First-In-First-Out (FIFO) memory. The FIFO buffering allows reception of two complete characters and the start of a third character before software must start servicing the EUSART receiver. The FIFO and RSR registers are not directly accessible by software. Access to the received data is via the RCREG register. 16.1.2.1 Enabling the Receiver The EUSART receiver is enabled for asynchronous operation by configuring the following three control bits: • CREN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the CREN bit of the RCSTA register enables the receiver circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART. The RX/DT I/O pin must be configured as an input by setting the corresponding TRIS control bit. If the RX/DT pin is shared with an analog peripheral the analog I/O function must be disabled by clearing the corresponding ANSEL bit. 16.1.2.2 Receiving Data The receiver data recovery circuit initiates character reception on the falling edge of the first bit. The first bit, also known as the Start bit, is always a zero. The data recovery circuit counts one-half bit time to the center of the Start bit and verifies that the bit is still a zero. If it is not a zero then the data recovery circuit aborts character reception, without generating an error, and resumes looking for the falling edge of the Start bit. If the Start bit zero verification succeeds then the data recovery circuit counts a full bit time to the center of the next bit. The bit is then sampled by a majority detect circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR. This repeats until all data bits have been sampled and shifted into the RSR. One final bit time is measured and the level sampled. This is the Stop bit, which is always a ‘1’. If the data recovery circuit samples a ‘0’ in the Stop bit position then a framing error is set for this character, otherwise the framing error is cleared for this character. See Section 16.1.2.5 “Receive Framing Error” for more information on framing errors. Immediately after all data bits and the Stop bit have been received, the character in the RSR is transferred to the EUSART receive FIFO and the RCIF interrupt flag bit of the PIR1 register is set. The top character in the FIFO is transferred out of the FIFO by reading the RCREG register. 16.1.2.3 Receive Data Polarity The polarity of the receive data can be controlled with the DTRXP bit of the BAUDCON register. The default state of this bit is ‘0’ which selects high true receive idle and data bits. Setting the DTRXP bit to ‘1’ will invert the receive data resulting in low true idle and data bits. The DTRXP bit controls receive data polarity only in Asynchronous mode. In synchronous mode the DTRXP bit has a different function. Note: When the SPEN bit is set the TX/CK I/O pin is automatically configured as an output, regardless of the state of the corresponding TRIS bit and whether or not the EUSART transmitter is enabled. The PORT latch is disconnected from the output driver so it is not possible to use the TX/CK pin as a general purpose output. Note: If the receive FIFO is overrun, no additional characters will be received until the overrun condition is cleared. See Section 16.1.2.6 “Receive Overrun Error” for more information on overrun errors. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 183 PIC18F1XK50/PIC18LF1XK50 16.1.2.4 Receive Interrupts The RCIF interrupt flag bit of the PIR1 register is set whenever the EUSART receiver is enabled and there is an unread character in the receive FIFO. The RCIF interrupt flag bit is read-only, it cannot be set or cleared by software. RCIF interrupts are enabled by setting the following bits: • RCIE interrupt enable bit of the PIE1 register • PEIE peripheral interrupt enable bit of the INTCON register • GIE global interrupt enable bit of the INTCON register The RCIF interrupt flag bit will be set when there is an unread character in the FIFO, regardless of the state of interrupt enable bits. 16.1.2.5 Receive Framing Error Each character in the receive FIFO buffer has a corresponding framing error status bit. A framing error indicates that a Stop bit was not seen at the expected time. The framing error status is accessed via the FERR bit of the RCSTA register. The FERR bit represents the status of the top unread character in the receive FIFO. Therefore, the FERR bit must be read before reading the RCREG. The FERR bit is read-only and only applies to the top unread character in the receive FIFO. A framing error (FERR = 1) does not preclude reception of additional characters. It is not necessary to clear the FERR bit. Reading the next character from the FIFO buffer will advance the FIFO to the next character and the next corresponding framing error. The FERR bit can be forced clear by clearing the SPEN bit of the RCSTA register which resets the EUSART. Clearing the CREN bit of the RCSTA register does not affect the FERR bit. A framing error by itself does not generate an interrupt. 16.1.2.6 Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated If a third character, in its entirety, is received before the FIFO is accessed. When this happens the OERR bit of the RCSTA register is set. The characters already in the FIFO buffer can be read but no additional characters will be received until the error is cleared. The error must be cleared by either clearing the CREN bit of the RCSTA register or by resetting the EUSART by clearing the SPEN bit of the RCSTA register. 16.1.2.7 Receiving 9-bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set, the EUSART will shift 9 bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth and Most Significant data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the 8 Least Significant bits from the RCREG. 16.1.2.8 Address Detection A special Address Detection mode is available for use when multiple receivers share the same transmission line, such as in RS-485 systems. Address detection is enabled by setting the ADDEN bit of the RCSTA register. Address detection requires 9-bit character reception. When address detection is enabled, only characters with the ninth data bit set will be transferred to the receive FIFO buffer, thereby setting the RCIF interrupt bit. All other characters will be ignored. Upon receiving an address character, user software determines if the address matches its own. Upon address match, user software must disable address detection by clearing the ADDEN bit before the next Stop bit occurs. When user software detects the end of the message, determined by the message protocol used, software places the receiver back into the Address Detection mode by setting the ADDEN bit. Note: If all receive characters in the receive FIFO have framing errors, repeated reads of the RCREG will not clear the FERR bit. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 184 Preliminary © 2009 Microchip Technology Inc. 16.1.2.9 Asynchronous Reception Set-up: 1. Initialize the SPBRGH:SPBRG register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 16.3 “EUSART Baud Rate Generator (BRG)”). 2. Enable the serial port by setting the SPEN bit and the RX/DT pin TRIS bit. The SYNC bit must be clear for asynchronous operation. 3. If interrupts are desired, set the RCIE interrupt enable bit and set the GIE and PEIE bits of the INTCON register. 4. If 9-bit reception is desired, set the RX9 bit. 5. Set the DTRXP if inverted receive polarity is desired. 6. Enable reception by setting the CREN bit. 7. The RCIF interrupt flag bit will be set when a character is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 8. Read the RCSTA register to get the error flags and, if 9-bit data reception is enabled, the ninth data bit. 9. Get the received 8 Least Significant data bits from the receive buffer by reading the RCREG register. 10. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. 16.1.2.10 9-bit Address Detection Mode Set-up This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRGH, SPBRG register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 16.3 “EUSART Baud Rate Generator (BRG)”). 2. Enable the serial port by setting the SPEN bit. The SYNC bit must be clear for asynchronous operation. 3. If interrupts are desired, set the RCIE interrupt enable bit and set the GIE and PEIE bits of the INTCON register. 4. Enable 9-bit reception by setting the RX9 bit. 5. Enable address detection by setting the ADDEN bit. 6. Set the DTRXP if inverted receive polarity is desired. 7. Enable reception by setting the CREN bit. 8. The RCIF interrupt flag bit will be set when a character with the ninth bit set is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 9. Read the RCSTA register to get the error flags. The ninth data bit will always be set. 10. Get the received 8 Least Significant data bits from the receive buffer by reading the RCREG register. Software determines if this is the device’s address. 11. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. 12. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and generate interrupts. FIGURE 16-5: ASYNCHRONOUS RECEPTION Start bit bit 0 bit 1 bit 7/8 Stop bit 0 bit 7/8 bit Start bit Start bit 7/8 Stop bit bit RX/DT pin Reg Rcv Buffer Reg Rcv Shift Read Rcv Buffer Reg RCREG RCIF (Interrupt Flag) OERR bit CREN Word 1 RCREG Word 2 RCREG Stop bit Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word, causing the OERR (overrun) bit to be set. RCIDL © 2009 Microchip Technology Inc. Preliminary DS41350C-page 185 PIC18F1XK50/PIC18LF1XK50 TABLE 16-2: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 281 RCREG EUSART Receive Register 281 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 281 BAUDCON ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN 281 SPBRGH EUSART Baud Rate Generator Register, High Byte 281 SPBRG EUSART Baud Rate Generator Register, Low Byte 281 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 186 Preliminary © 2009 Microchip Technology Inc. 16.2 Clock Accuracy with Asynchronous Operation The factory calibrates the internal oscillator block output (HFINTOSC). However, the HFINTOSC frequency may drift as VDD or temperature changes, and this directly affects the asynchronous baud rate. Two methods may be used to adjust the baud rate clock, but both require a reference clock source of some kind. The first (preferred) method uses the OSCTUNE register to adjust the HFINTOSC output. Adjusting the value in the OSCTUNE register allows for fine resolution changes to the system clock source. See Section 2.6.1 “OSCTUNE Register” for more information. The other method adjusts the value in the Baud Rate Generator. This can be done automatically with the Auto-Baud Detect feature (see Section 16.3.1 “Auto-Baud Detect”). There may not be fine enough resolution when adjusting the Baud Rate Generator to compensate for a gradual change in the peripheral clock frequency. REGISTER 16-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0 CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit enabled 0 = Transmit disabled bit 4 SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full bit 0 TX9D: Ninth bit of Transmit Data Can be address/data bit or a parity bit. Note 1: SREN/CREN overrides TXEN in Sync mode. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 187 PIC18F1XK50/PIC18LF1XK50 REGISTER 16-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER(1) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins) 0 = Serial port disabled (held in Reset) bit 6 RX9: 9-bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave Don’t care bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 8-bit (RX9 = 0): Don’t care bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCREG register and receive next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit CREN) 0 = No overrun error bit 0 RX9D: Ninth bit of Received Data This can be address/data bit or a parity bit and must be calculated by user firmware. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 188 Preliminary © 2009 Microchip Technology Inc. REGISTER 16-3: BAUDCON: BAUD RATE CONTROL REGISTER R-0 R-1 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ABDOVF: Auto-Baud Detect Overflow bit Asynchronous mode: 1 = Auto-baud timer overflowed 0 = Auto-baud timer did not overflow Synchronous mode: Don’t care bit 6 RCIDL: Receive Idle Flag bit Asynchronous mode: 1 = Receiver is Idle 0 = Start bit has been detected and the receiver is active Synchronous mode: Don’t care bit 5 DTRXP: Data/Receive Polarity Select bit Asynchronous mode: 1 = Receive data (RX) is inverted (active-low) 0 = Receive data (RX) is not inverted (active-high) Synchronous mode: 1 = Data (DT) is inverted (active-low) 0 = Data (DT) is not inverted (active-high) bit 4 CKTXP: Clock/Transmit Polarity Select bit Asynchronous mode: 1 = Idle state for transmit (TX) is low 0 = Idle state for transmit (TX) is high Synchronous mode: 1 = Data changes on the falling edge of the clock and is sampled on the rising edge of the clock 0 = Data changes on the rising edge of the clock and is sampled on the falling edge of the clock bit 3 BRG16: 16-bit Baud Rate Generator bit 1 = 16-bit Baud Rate Generator is used (SPBRGH:SPBRG) 0 = 8-bit Baud Rate Generator is used (SPBRG) bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = Receiver is waiting for a falling edge. No character will be received but RCIF will be set on the falling edge. WUE will automatically clear on the rising edge. 0 = Receiver is operating normally Synchronous mode: Don’t care bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete) 0 = Auto-Baud Detect mode is disabled Synchronous mode: Don’t care © 2009 Microchip Technology Inc. Preliminary DS41350C-page 189 PIC18F1XK50/PIC18LF1XK50 16.3 EUSART Baud Rate Generator (BRG) The Baud Rate Generator (BRG) is an 8-bit or 16-bit timer that is dedicated to the support of both the asynchronous and synchronous EUSART operation. By default, the BRG operates in 8-bit mode. Setting the BRG16 bit of the BAUDCON register selects 16-bit mode. The SPBRGH:SPBRG register pair determines the period of the free running baud rate timer. In Asynchronous mode the multiplier of the baud rate period is determined by both the BRGH bit of the TXSTA register and the BRG16 bit of the BAUDCON register. In Synchronous mode, the BRGH bit is ignored. Table 16-3 contains the formulas for determining the baud rate. Example 16-1 provides a sample calculation for determining the baud rate and baud rate error. Typical baud rates and error values for various asynchronous modes have been computed for your convenience and are shown in Table 16-5. It may be advantageous to use the high baud rate (BRGH = 1), or the 16-bit BRG (BRG16 = 1) to reduce the baud rate error. The 16-bit BRG mode is used to achieve slow baud rates for fast oscillator frequencies. Writing a new value to the SPBRGH, SPBRG register pair causes the BRG timer to be reset (or cleared). This ensures that the BRG does not wait for a timer overflow before outputting the new baud rate. If the system clock is changed during an active receive operation, a receive error or data loss may result. To avoid this problem, check the status of the RCIDL bit to make sure that the receive operation is Idle before changing the system clock. EXAMPLE 16-1: CALCULATING BAUD RATE ERROR TABLE 16-3: BAUD RATE FORMULAS TABLE 16-4: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: Solving for SPBRGH:SPBRG: Desired Baud Rate FOSC 64 [SPBRGH:SPBRG] 1 ( ) + = -------------------------------------------------------------------- 25.042 = = [ ] 25 Calculated Baud Rate 16000000 64 25 1 ( ) + = -------------------------- 9615 = Error Calc. Baud Rate Desired Baud Rate – Desired Baud Rate = -------------------------------------------------------------------------------------------- ( ) 9615 9600 – 9600 = = ---------------------------------- 0.16% FOSC X = 64 * (Desired Baud Rate) -1 ( ) 16,000,000 = 64 * 9600 -1 ( ) Configuration Bits BRG/EUSART Mode Baud Rate Formula SYNC BRG16 BRGH 000 8-bit/Asynchronous FOSC/[64 (n+1)] 001 8-bit/Asynchronous FOSC/[16 (n+1)] 010 16-bit/Asynchronous 011 16-bit/Asynchronous 10x 8-bit/Synchronous FOSC/[4 (n+1)] 11x 16-bit/Synchronous Legend: x = Don’t care, n = value of SPBRGH, SPBRG register pair Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 281 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 281 BAUDCON ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN 281 SPBRGH EUSART Baud Rate Generator Register, High Byte 281 SPBRG EUSART Baud Rate Generator Register, Low Byte 281 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the BRG. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 190 Preliminary © 2009 Microchip Technology Inc. TABLE 16-5: BAUD RATES FOR ASYNCHRONOUS MODES BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 48.000 MHz FOSC = 18.432 MHz FOSC = 12.000 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 — — — — — — — — — — — — 1200 —— — 1200 0.00 239 1202 0.16 155 1200 0.00 143 2400 —— — 2400 0.00 119 2404 0.16 77 2400 0.00 71 9600 9615 0.16 77 9600 0.00 29 9375 -2.34 19 9600 0.00 17 10417 10417 0.00 71 10286 -1.26 27 10417 0.00 17 10165 -2.42 16 19.2k 19.23k 0.16 38 19.20k 0.00 14 18.75k -2.34 9 19.20k 0.00 8 57.6k 57.69k 0.16 12 57.60k 0.00 7 —— — 57.60k 0.00 2 115.2k — — — — — — — — — — — — BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 — — — 300 0.16 207 300 0.00 191 300 0.16 51 1200 1202 0.16 103 1202 0.16 51 1200 0.00 47 1202 0.16 12 2400 2404 0.16 51 2404 0.16 25 2400 0.00 23 — — — 9600 9615 0.16 12 — — — 9600 0.00 5 — — — 10417 10417 0.00 11 10417 0.00 5 — — — — — — 19.2k — — — — — — 19.20k 0.00 2 — — — 57.6k — — — — — — 57.60k 0.00 0 — — — 115.2k — — — — — — — — — — — — BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 48.000 MHz FOSC = 18.432 MHz FOSC = 12.000 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 —— — —— — —— — —— — 1200 — — — — — — — — — — — — 2400 — — — — — — —— — —— — 9600 — — — 9600 0.00 119 9615 0.16 77 9600 0.00 71 10417 — — — 10378 -0.37 110 10417 0.00 71 10473 0.53 65 19.2k 19.23k 0.16 155 19.20k 0.00 59 19.23k 0.16 38 19.20k 0.00 35 57.6k 57.69k 0.16 51 57.60k 0.00 19 57.69k 0.16 12 57.60k 0.00 11 115.2k 115.38k 0.16 25 115.2k 0.00 9 — — — 115.2k 0.00 5 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 191 PIC18F1XK50/PIC18LF1XK50 BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 —— — — — — — — — 300 0.16 207 1200 — — — 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19231 0.16 25 19.23k 0.16 12 19.2k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 48.000 MHz FOSC = 18.432 MHz FOSC = 12.000 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) 300 300.0 0.00 9999 300.0 0.00 3839 300 0.00 2499 300.0 0.00 2303 1200 1200.1 0.00 2499 1200 0.00 959 1200 0.00 624 1200 0.00 575 2400 2400 0.00 1249 2400 0.00 479 2404 0.16 311 2400 0.00 287 9600 9615 0.16 311 9600 0.00 119 9615 0.16 77 9600 0.00 71 10417 10417 0.00 287 10378 -0.37 110 10417 0.00 71 10473 0.53 65 19.2k 19.23k 0.16 155 19.20k 0.00 59 19.23k 0.16 38 19.20k 0.00 35 57.6k 57.69k 0.16 51 57.60k 0.00 19 57.69k 0.16 12 57.60k 0.00 11 115.2k 115.38k 0.16 25 115.2k 0.00 9 — — — 115.2k 0.00 5 BAUD RATE SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) 300 299.9 -0.02 1666 300.1 0.04 832 300.0 0.00 767 300.5 0.16 207 1200 1199 -0.08 416 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19.23k 0.16 25 19.23k 0.16 12 19.20k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — TABLE 16-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 192 Preliminary © 2009 Microchip Technology Inc. BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 48.000 MHz FOSC = 18.432 MHz FOSC = 12.000 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) 300 300 0.00 39999 300.0 0.00 15359 300 0.00 9999 300.0 0.00 9215 1200 1200 0.00 9999 1200 0.00 3839 1200 0.00 2499 1200 0.00 2303 2400 2400 0.00 4999 2400 0.00 1919 2400 0.00 1249 2400 0.00 1151 9600 9600 0.00 1249 9600 0.00 479 9615 0.16 311 9600 0.00 287 10417 10417 0.00 1151 10425 0.08 441 10417 0.00 287 10433 0.16 264 19.2k 19.20k 0.00 624 19.20k 0.00 239 19.23k 0.16 155 19.20k 0.00 143 57.6k 57.69k 0.16 207 57.60k 0.00 79 57.69k 0.16 51 57.60k 0.00 47 115.2k 115.38k 0.16 103 115.2k 0.00 39 115.38k 0.16 25 115.2k 0.00 23 BAUD RATE SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) Actual Rate % Error SPBRGH :SPBRG (decimal) 300 300.0 0.00 6666 300.0 0.01 3332 300.0 0.00 3071 300.1 0.04 832 1200 1200 -0.02 1666 1200 0.04 832 1200 0.00 767 1202 0.16 207 2400 2401 0.04 832 2398 0.08 416 2400 0.00 383 2404 0.16 103 9600 9615 0.16 207 9615 0.16 103 9600 0.00 95 9615 0.16 25 10417 10417 0.00 191 10417 0.00 95 10473 0.53 87 10417 0.00 23 19.2k 19.23k 0.16 103 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 12 57.6k 57.14k -0.79 34 58.82k 2.12 16 57.60k 0.00 15 — — — 115.2k 117.6k 2.12 16 111.1k -3.55 8 115.2k 0.00 7 — — — TABLE 16-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) © 2009 Microchip Technology Inc. Preliminary DS41350C-page 193 PIC18F1XK50/PIC18LF1XK50 16.3.1 AUTO-BAUD DETECT The EUSART module supports automatic detection and calibration of the baud rate. In the Auto-Baud Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX signal, the RX signal is timing the BRG. The Baud Rate Generator is used to time the period of a received 55h (ASCII “U”) which is the Sync character for the LIN bus. The unique feature of this character is that it has five rising edges including the Stop bit edge. Setting the ABDEN bit of the BAUDCON register starts the auto-baud calibration sequence (Figure 16-6). While the ABD sequence takes place, the EUSART state machine is held in Idle. On the first rising edge of the receive line, after the Start bit, the SPBRG begins counting up using the BRG counter clock as shown in Table 16-6. The fifth rising edge will occur on the RX pin at the end of the eighth bit period. At that time, an accumulated value totaling the proper BRG period is left in the SPBRGH:SPBRG register pair, the ABDEN bit is automatically cleared, and the RCIF interrupt flag is set. A read operation on the RCREG needs to be performed to clear the RCIF interrupt. RCREG content should be discarded. When calibrating for modes that do not use the SPBRGH register the user can verify that the SPBRG register did not overflow by checking for 00h in the SPBRGH register. The BRG auto-baud clock is determined by the BRG16 and BRGH bits as shown in Table 16-6. During ABD, both the SPBRGH and SPBRG registers are used as a 16-bit counter, independent of the BRG16 bit setting. While calibrating the baud rate period, the SPBRGH and SPBRG registers are clocked at 1/8th the BRG base clock rate. The resulting byte measurement is the average bit time when clocked at full speed. TABLE 16-6: BRG COUNTER CLOCK RATES FIGURE 16-6: AUTOMATIC BAUD RATE CALIBRATION Note 1: If the WUE bit is set with the ABDEN bit, auto-baud detection will occur on the byte following the Break character (see Section 16.3.3 “Auto-Wake-up on Break”). 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible. 3: During the auto-baud process, the auto-baud counter starts counting at 1. Upon completion of the auto-baud sequence, to achieve maximum accuracy, subtract 1 from the SPBRGH:SPBRG register pair. BRG16 BRGH BRG Base Clock BRG ABD Clock 0 0 FOSC/64 FOSC/512 0 1 FOSC/16 FOSC/128 1 0 FOSC/16 FOSC/128 1 1 FOSC/4 FOSC/32 Note: During the ABD sequence, SPBRG and SPBRGH registers are both used as a 16-bit counter, independent of BRG16 setting. BRG Value RX pin ABDEN bit RCIF bit bit 0 bit 1 (Interrupt) Read RCREG BRG Clock Start Set by User Auto Cleared XXXXh 0000h Edge #1 bit 2 bit 3 Edge #2 bit 4 bit 5 Edge #3 bit 6 bit 7 Edge #4 Stop bit Edge #5 001Ch Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode. SPBRG XXh 1Ch SPBRGH XXh 00h RCIDL PIC18F1XK50/PIC18LF1XK50 DS41350C-page 194 Preliminary © 2009 Microchip Technology Inc. 16.3.2 AUTO-BAUD OVERFLOW During the course of automatic baud detection, the ABDOVF bit of the BAUDCON register will be set if the baud rate counter overflows before the fifth rising edge is detected on the RX pin. The ABDOVF bit indicates that the counter has exceeded the maximum count that can fit in the 16 bits of the SPBRGH:SPBRG register pair. After the ABDOVF has been set, the counter continues to count until the fifth rising edge is detected on the RX pin. Upon detecting the fifth RX edge, the hardware will set the RCIF Interrupt Flag and clear the ABDEN bit of the BAUDCON register. The RCIF flag can be subsequently cleared by reading the RCREG register. The ABDOVF flag of the BAUDCON register can be cleared by software directly. To terminate the auto-baud process before the RCIF flag is set, clear the ABDEN bit then clear the ABDOVF bit of the BAUDCON register. The ABDOVF bit will remain set if the ABDEN bit is not cleared first. 16.3.3 AUTO-WAKE-UP ON BREAK During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper character reception cannot be performed. The Auto-Wake-up feature allows the controller to wake-up due to activity on the RX/DT line. This feature is available only in Asynchronous mode. The Auto-Wake-up feature is enabled by setting the WUE bit of the BAUDCON register. Once set, the normal receive sequence on RX/DT is disabled, and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX/DT line. (This coincides with the start of a Sync Break or a wake-up signal character for the LIN protocol.) The EUSART module generates an RCIF interrupt coincident with the wake-up event. The interrupt is generated synchronously to the Q clocks in normal CPU operating modes (Figure 16-7), and asynchronously if the device is in Sleep mode (Figure 16-8). The interrupt condition is cleared by reading the RCREG register. The WUE bit is automatically cleared by the low-to-high transition on the RX line at the end of the Break. This signals to the user that the Break event is over. At this point, the EUSART module is in Idle mode waiting to receive the next character. 16.3.3.1 Special Considerations Break Character To avoid character errors or character fragments during a wake-up event, the wake-up character must be all zeros. When the wake-up is enabled the function works independent of the low time on the data stream. If the WUE bit is set and a valid non-zero character is received, the low time from the Start bit to the first rising edge will be interpreted as the wake-up event. The remaining bits in the character will be received as a fragmented character and subsequent characters can result in framing or overrun errors. Therefore, the initial character in the transmission must be all ‘0’s. This must be 10 or more bit times, 13-bit times recommended for LIN bus, or any number of bit times for standard RS-232 devices. Oscillator Startup Time Oscillator start-up time must be considered, especially in applications using oscillators with longer start-up intervals (i.e., LP, XT or HS/PLL mode). The Sync Break (or wake-up signal) character must be of sufficient length, and be followed by a sufficient interval, to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART. WUE Bit The wake-up event causes a receive interrupt by setting the RCIF bit. The WUE bit is cleared by hardware by a rising edge on RX/DT. The interrupt condition is then cleared by software by reading the RCREG register and discarding its contents. To ensure that no actual data is lost, check the RCIDL bit to verify that a receive operation is not in process before setting the WUE bit. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 195 PIC18F1XK50/PIC18LF1XK50 FIGURE 16-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION FIGURE 16-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1 Q2 Q3 Q4 Q1 Q2 Q3Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 OSC1 WUE bit RX/DT Line RCIF Bit set by user Auto Cleared Cleared due to User Read of RCREG Note 1: The EUSART remains in Idle while the WUE bit is set. Q1Q2Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2Q3 Q4 Q1Q2 Q3 Q4 OSC1 WUE bit RX/DT Line RCIF Bit Set by User Auto Cleared Cleared due to User Read of RCREG Sleep Command Executed Note 1 Note 1: If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is still active. This sequence should not depend on the presence of Q clocks. 2: The EUSART remains in Idle while the WUE bit is set. Sleep Ends PIC18F1XK50/PIC18LF1XK50 DS41350C-page 196 Preliminary © 2009 Microchip Technology Inc. 16.3.4 BREAK CHARACTER SEQUENCE The EUSART module has the capability of sending the special Break character sequences that are required by the LIN bus standard. A Break character consists of a Start bit, followed by 12 ‘0’ bits and a Stop bit. To send a Break character, set the SENDB and TXEN bits of the TXSTA register. The Break character transmission is then initiated by a write to the TXREG. The value of data written to TXREG will be ignored and all ‘0’s will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN specification). The TRMT bit of the TXSTA register indicates when the transmit operation is active or Idle, just as it does during normal transmission. See Figure 16-9 for the timing of the Break character sequence. 16.3.4.1 Break and Sync Transmit Sequence The following sequence will start a message frame header made up of a Break, followed by an auto-baud Sync byte. This sequence is typical of a LIN bus master. 1. Configure the EUSART for the desired mode. 2. Set the TXEN and SENDB bits to enable the Break sequence. 3. Load the TXREG with a dummy character to initiate transmission (the value is ignored). 4. Write ‘55h’ to TXREG to load the Sync character into the transmit FIFO buffer. 5. After the Break has been sent, the SENDB bit is reset by hardware and the Sync character is then transmitted. When the TXREG becomes empty, as indicated by the TXIF, the next data byte can be written to TXREG. 16.3.5 RECEIVING A BREAK CHARACTER The Enhanced EUSART module can receive a Break character in two ways. The first method to detect a Break character uses the FERR bit of the RCSTA register and the Received data as indicated by RCREG. The Baud Rate Generator is assumed to have been initialized to the expected baud rate. A Break character has been received when; • RCIF bit is set • FERR bit is set • RCREG = 00h The second method uses the Auto-Wake-up feature described in Section 16.3.3 “Auto-Wake-up on Break”. By enabling this feature, the EUSART will sample the next two transitions on RX/DT, cause an RCIF interrupt, and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Detect feature. For both methods, the user can set the ABDEN bit of the BAUDCON register before placing the EUSART in Sleep mode. FIGURE 16-9: SEND BREAK CHARACTER SEQUENCE Write to TXREG Dummy Write BRG Output (Shift Clock) Start bit bit 0 bit 1 bit 11 Stop bit Break TXIF bit (Transmit interrupt Flag) TX (pin) TRMT bit (Transmit Shift Reg. Empty Flag) SENDB (send Break control bit) SENDB Sampled Here Auto Cleared © 2009 Microchip Technology Inc. Preliminary DS41350C-page 197 PIC18F1XK50/PIC18LF1XK50 16.4 EUSART Synchronous Mode Synchronous serial communications are typically used in systems with a single master and one or more slaves. The master device contains the necessary circuitry for baud rate generation and supplies the clock for all devices in the system. Slave devices can take advantage of the master clock by eliminating the internal clock generation circuitry. There are two signal lines in Synchronous mode: a bidirectional data line and a clock line. Slaves use the external clock supplied by the master to shift the serial data into and out of their respective receive and transmit shift registers. Since the data line is bidirectional, synchronous operation is half-duplex only. Half-duplex refers to the fact that master and slave devices can receive and transmit data but not both simultaneously. The EUSART can operate as either a master or slave device. Start and Stop bits are not used in synchronous transmissions. 16.4.1 SYNCHRONOUS MASTER MODE The following bits are used to configure the EUSART for Synchronous Master operation: • SYNC = 1 • CSRC = 1 • SREN = 0 (for transmit); SREN = 1 (for receive) • CREN = 0 (for transmit); CREN = 1 (for receive) • SPEN = 1 Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Setting the CSRC bit of the TXSTA register configures the device as a master. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. If the RX/DT or TX/CK pins are shared with an analog peripheral the analog I/O functions must be disabled by clearing the corresponding ANSEL bits. The TRIS bits corresponding to the RX/DT and TX/CK pins should be set. 16.4.1.1 Master Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a master transmits the clock on the TX/CK line. The TX/CK pin output driver is automatically enabled when the EUSART is configured for synchronous transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One clock cycle is generated for each data bit. Only as many clock cycles are generated as there are data bits. 16.4.1.2 Clock Polarity A clock polarity option is provided for Microwire compatibility. Clock polarity is selected with the CKTXP bit of the BAUDCON register. Setting the CKTXP bit sets the clock Idle state as high. When the CKTXP bit is set, the data changes on the falling edge of each clock and is sampled on the rising edge of each clock. Clearing the CKTXP bit sets the Idle state as low. When the CKTXP bit is cleared, the data changes on the rising edge of each clock and is sampled on the falling edge of each clock. 16.4.1.3 Synchronous Master Transmission Data is transferred out of the device on the RX/DT pin. The RX/DT and TX/CK pin output drivers are automatically enabled when the EUSART is configured for synchronous master transmit operation. A transmission is initiated by writing a character to the TXREG register. If the TSR still contains all or part of a previous character the new character data is held in the TXREG until the last bit of the previous character has been transmitted. If this is the first character, or the previous character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR. The transmission of the character commences immediately following the transfer of the data to the TSR from the TXREG. Each data bit changes on the leading edge of the master clock and remains valid until the subsequent leading clock edge. 16.4.1.4 Data Polarity The polarity of the transmit and receive data can be controlled with the DTRXP bit of the BAUDCON register. The default state of this bit is ‘0’ which selects high true transmit and receive data. Setting the DTRXP bit to ‘1’ will invert the data resulting in low true transmit and receive data. Note: The TSR register is not mapped in data memory, so it is not available to the user. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 198 Preliminary © 2009 Microchip Technology Inc. 16.4.1.5 Synchronous Master Transmission Set-up: 1. Initialize the SPBRGH, SPBRG register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 16.3 “EUSART Baud Rate Generator (BRG)”). 2. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. Set the TRIS bits corresponding to the RX/DT and TX/CK I/O pins. 3. Disable Receive mode by clearing bits SREN and CREN. 4. Enable Transmit mode by setting the TXEN bit. 5. If 9-bit transmission is desired, set the TX9 bit. 6. If interrupts are desired, set the TXIE, GIE and PEIE interrupt enable bits. 7. If 9-bit transmission is selected, the ninth bit should be loaded in the TX9D bit. 8. Start transmission by loading data to the TXREG register. FIGURE 16-10: SYNCHRONOUS TRANSMISSION FIGURE 16-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) bit 0 bit 1 bit 7 Word 1 bit 2 bit 0 bit 1 bit 7 RX/DT Write to TXREG Reg TXIF bit (Interrupt Flag) TXEN bit ‘1’ ‘1’ Word 2 TRMT bit Write Word 1 Write Word 2 Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words. pin TX/CK pin TX/CK pin (SCKP = 0) (SCKP = 1) RX/DT pin TX/CK pin Write to TXREG reg TXIF bit TRMT bit bit 0 bit 1 bit 2 bit 6 bit 7 TXEN bit © 2009 Microchip Technology Inc. Preliminary DS41350C-page 199 PIC18F1XK50/PIC18LF1XK50 TABLE 16-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 281 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 TXREG EUSART Transmit Register 281 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 281 BAUDCON ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN 281 SPBRGH EUSART Baud Rate Generator Register, High Byte 281 SPBRG EUSART Baud Rate Generator Register, Low Byte 281 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 200 Preliminary © 2009 Microchip Technology Inc. 16.4.1.6 Synchronous Master Reception Data is received at the RX/DT pin. The RX/DT pin output driver must be disabled by setting the corresponding TRIS bits when the EUSART is configured for synchronous master receive operation. In Synchronous mode, reception is enabled by setting either the Single Receive Enable bit (SREN of the RCSTA register) or the Continuous Receive Enable bit (CREN of the RCSTA register). When SREN is set and CREN is clear, only as many clock cycles are generated as there are data bits in a single character. The SREN bit is automatically cleared at the completion of one character. When CREN is set, clocks are continuously generated until CREN is cleared. If CREN is cleared in the middle of a character the CK clock stops immediately and the partial character is discarded. If SREN and CREN are both set, then SREN is cleared at the completion of the first character and CREN takes precedence. To initiate reception, set either SREN or CREN. Data is sampled at the RX/DT pin on the trailing edge of the TX/CK clock pin and is shifted into the Receive Shift Register (RSR). When a complete character is received into the RSR, the RCIF bit is set and the character is automatically transferred to the two character receive FIFO. The Least Significant eight bits of the top character in the receive FIFO are available in RCREG. The RCIF bit remains set as long as there are un-read characters in the receive FIFO. 16.4.1.7 Slave Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a slave receives the clock on the TX/CK line. The TX/CK pin output driver must be disabled by setting the associated TRIS bit when the device is configured for synchronous slave transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One data bit is transferred for each clock cycle. Only as many clock cycles should be received as there are data bits. 16.4.1.8 Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated if a third character, in its entirety, is received before RCREG is read to access the FIFO. When this happens the OERR bit of the RCSTA register is set. Previous data in the FIFO will not be overwritten. The two characters in the FIFO buffer can be read, however, no additional characters will be received until the error is cleared. The OERR bit can only be cleared by clearing the overrun condition. If the overrun error occurred when the SREN bit is set and CREN is clear then the error is cleared by reading RCREG. If the overrun occurred when the CREN bit is set then the error condition is cleared by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. 16.4.1.9 Receiving 9-bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set the EUSART will shift 9-bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth, and Most Significant, data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the 8 Least Significant bits from the RCREG. 16.4.1.10 Synchronous Master Reception Set-up: 1. Initialize the SPBRGH, SPBRG register pair for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. Disable RX/DT and TX/CK output drivers by setting the corresponding TRIS bits. 3. Ensure bits CREN and SREN are clear. 4. If using interrupts, set the GIE and PEIE bits of the INTCON register and set RCIE. 5. If 9-bit reception is desired, set bit RX9. 6. Start reception by setting the SREN bit or for continuous reception, set the CREN bit. 7. Interrupt flag bit RCIF will be set when reception of a character is complete. An interrupt will be generated if the enable bit RCIE was set. 8. Read the RCSTA register to get the ninth bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG register. 10. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 201 PIC18F1XK50/PIC18LF1XK50 FIGURE 16-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) TABLE 16-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 281 RCREG EUSART Receive Register 281 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 281 BAUDCON ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN 281 SPBRGH EUSART Baud Rate Generator Register, High Byte 281 SPBRG EUSART Baud Rate Generator Register, Low Byte 281 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception. CREN bit RX/DT Write to bit SREN SREN bit RCIF bit (Interrupt) Read RXREG ‘0’ bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 ‘0’ Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0. TX/CK pin TX/CK pin pin (SCKP = 0) (SCKP = 1) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 202 Preliminary © 2009 Microchip Technology Inc. 16.4.2 SYNCHRONOUS SLAVE MODE The following bits are used to configure the EUSART for Synchronous slave operation: • SYNC = 1 • CSRC = 0 • SREN = 0 (for transmit); SREN = 1 (for receive) • CREN = 0 (for transmit); CREN = 1 (for receive) • SPEN = 1 Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Clearing the CSRC bit of the TXSTA register configures the device as a slave. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. If the RX/DT or TX/CK pins are shared with an analog peripheral the analog I/O functions must be disabled by clearing the corresponding ANSEL bits. RX/DT and TX/CK pin output drivers must be disabled by setting the corresponding TRIS bits. 16.4.2.1 EUSART Synchronous Slave Transmit The operation of the Synchronous Master and Slave modes are identical (see Section 16.4.1.3 “Synchronous Master Transmission”), except in the case of the Sleep mode. If two words are written to the TXREG and then the SLEEP instruction is executed, the following will occur: 1. The first character will immediately transfer to the TSR register and transmit. 2. The second word will remain in TXREG register. 3. The TXIF bit will not be set. 4. After the first character has been shifted out of TSR, the TXREG register will transfer the second character to the TSR and the TXIF bit will now be set. 5. If the PEIE and TXIE bits are set, the interrupt will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will call the Interrupt Service Routine. 16.4.2.2 Synchronous Slave Transmission Set-up: 1. Set the SYNC and SPEN bits and clear the CSRC bit. Set the TRIS bits corresponding to the RX/DT and TX/CK I/O pins. 2. Clear the CREN and SREN bits. 3. If using interrupts, ensure that the GIE and PEIE bits of the INTCON register are set and set the TXIE bit. 4. If 9-bit transmission is desired, set the TX9 bit. 5. Enable transmission by setting the TXEN bit. 6. If 9-bit transmission is selected, insert the Most Significant bit into the TX9D bit. 7. Start transmission by writing the Least Significant 8 bits to the TXREG register. TABLE 16-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 281 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 TXREG EUSART Transmit Register 281 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 281 BAUDCON ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN 281 SPBRGH EUSART Baud Rate Generator Register, High Byte 281 SPBRG EUSART Baud Rate Generator Register, Low Byte 281 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 203 PIC18F1XK50/PIC18LF1XK50 16.4.2.3 EUSART Synchronous Slave Reception The operation of the Synchronous Master and Slave modes is identical (Section 16.4.1.6 “Synchronous Master Reception”), with the following exceptions: • Sleep • CREN bit is always set, therefore the receiver is never Idle • SREN bit, which is a “don't care” in Slave mode A character may be received while in Sleep mode by setting the CREN bit prior to entering Sleep. Once the word is received, the RSR register will transfer the data to the RCREG register. If the RCIE enable bit is set, the interrupt generated will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will branch to the interrupt vector. 16.4.2.4 Synchronous Slave Reception Set-up: 1. Set the SYNC and SPEN bits and clear the CSRC bit. Set the TRIS bits corresponding to the RX/DT and TX/CK I/O pins. 2. If using interrupts, ensure that the GIE and PEIE bits of the INTCON register are set and set the RCIE bit. 3. If 9-bit reception is desired, set the RX9 bit. 4. Set the CREN bit to enable reception. 5. The RCIF bit will be set when reception is complete. An interrupt will be generated if the RCIE bit was set. 6. If 9-bit mode is enabled, retrieve the Most Significant bit from the RX9D bit of the RCSTA register. 7. Retrieve the 8 Least Significant bits from the receive FIFO by reading the RCREG register. 8. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. TABLE 16-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 281 RCREG EUSART Receive Register 281 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 281 BAUDCON ABDOVF RCIDL DTRXP CKTXP BRG16 — WUE ABDEN 281 SPBRGH EUSART Baud Rate Generator Register, High Byte 281 SPBRG EUSART Baud Rate Generator Register, Low Byte 281 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 204 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 205 PIC18F1XK50/PIC18LF1XK50 17.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESL and ADRESH). The ADC voltage reference is software selectable to either VDD, or a voltage applied to the external reference pins. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. Figure 17-1 shows the block diagram of the ADC. FIGURE 17-1: ADC BLOCK DIAGRAM ADC AN4 AVDD VREF+ ADON GO/DONE CHS<3:0> ADRESH ADRESL 10 10 ADFM VSS AN5 AN6 AN7 AN3 AN8 AN9 AN10 AN11 AVSS VREFNVCFG[1:0] = 00 FVR 0000 0001 0010 0011 0100 0101 0111 0110 1000 1001 1010 1011 1100 1101 1110 1111 Unused Unused 0 = Left Justify 1 = Right Justify Unused Unused Unused DAC NVCFG[1:0] = 01 FVR PVCFG[1:0] = 00 PVCFG[1:0] = 01 PVCFG[1:0] = 10 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 206 Preliminary © 2009 Microchip Technology Inc. 17.1 ADC Configuration When configuring and using the ADC the following functions must be considered: • Port configuration • Channel selection • ADC voltage reference selection • ADC conversion clock source • Interrupt control • Results formatting 17.1.1 PORT CONFIGURATION The ANSEL, ANSELH, TRISA, TRISB and TRISE registers all configure the A/D port pins. Any port pin needed as an analog input should have its corresponding ANSx bit set to disable the digital input buffer and TRISx bit set to disable the digital output driver. If the TRISx bit is cleared, the digital output level (VOH or VOL) will be converted. The A/D operation is independent of the state of the ANSx bits and the TRIS bits. 17.1.2 CHANNEL SELECTION The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 17.2 “ADC Operation” for more information. 17.1.3 ADC VOLTAGE REFERENCE The PVCFG and NVCFG bits of the ADCON1 register provide independent control of the positive and negative voltage references, respectively. The positive voltage reference can be either VDD, FVR or an external voltage source. The negative voltage reference can be either VSS or an external voltage source. 17.1.4 SELECTING AND CONFIGURING ACQUISITION TIME The ADCON2 register allows the user to select an acquisition time that occurs each time the GO/DONE bit is set. Acquisition time is set with the ACQT<2:0> bits of the ADCON2 register. Acquisition delays cover a range of 2 to 20 TAD. When the GO/DONE bit is set, the A/D module continues to sample the input for the selected acquisition time, then automatically begins a conversion. Since the acquisition time is programmed, there is no need to wait for an acquisition time between selecting a channel and setting the GO/DONE bit. Manual acquisition is selected when ACQT<2:0> = 000. When the GO/DONE bit is set, sampling is stopped and a conversion begins. The user is responsible for ensuring the required acquisition time has passed between selecting the desired input channel and setting the GO/DONE bit. This option is also the default Reset state of the ACQT<2:0> bits and is compatible with devices that do not offer programmable acquisition times. In either case, when the conversion is completed, the GO/DONE bit is cleared, the ADIF flag is set and the A/D begins sampling the currently selected channel again. When an acquisition time is programmed, there is no indication of when the acquisition time ends and the conversion begins. 17.1.5 CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ADCON2 register. There are seven possible clock options: • FOSC/2 • FOSC/4 • FOSC/8 • FOSC/16 • FOSC/32 • FOSC/64 • FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11 TAD periods as shown in Figure 17-3. For correct conversion, the appropriate TAD specification must be met. See A/D conversion requirements in Table 27-9 for more information. Table 17-1 gives examples of appropriate ADC clock selections. Note 1: When reading the PORT register, all pins with their corresponding ANSx bit set read as cleared (a low level). However, analog conversion of pins configured as digital inputs (ANSx bit cleared and TRISx bit set) will be accurately converted. 2: Analog levels on any pin with the corresponding ANSx bit cleared may cause the digital input buffer to consume current out of the device’s specification limits. Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 207 PIC18F1XK50/PIC18LF1XK50 17.1.6 INTERRUPTS The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital Conversion. The ADC interrupt flag is the ADIF bit in the PIR1 register. The ADC interrupt enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared by software. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the global interrupt must be disabled. If the global interrupt is enabled, execution will switch to the Interrupt Service Routine. Please see Section 17.1.6 “Interrupts” for more information. TABLE 17-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES 17.1.7 RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON2 register controls the output format. Figure 17-2 shows the two output formats. FIGURE 17-2: 10-BIT A/D CONVERSION RESULT FORMAT Note: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. ADC Clock Period (TAD) Device Frequency (FOSC) ADC Clock Source ADCS<2:0> 48 MHz 16 MHz 4 MHz 1 MHz FOSC/2 000 41.67 ns(2) 125 ns(2) 500 ns(2) 2.0 μs FOSC/4 100 83.33 ns(2) 250 ns(2) 1.0 μs 4.0 μs FOSC/8 001 167 ns(2) 500 ns(2) 2.0 μs 8.0 μs(3) FOSC/16 101 333 ns(2) 1.0 μs 4.0 μs 16.0 μs(3) FOSC/32 010 667 ns(2) 2.0 μs 8.0 μs(3) 32.0 μs(3) FOSC/64 110 1.33 μs 4.0 μs 16.0 μs(3) 64.0 μs(3) FRC x11 1-4 μs(1,4) 1-4 μs(1,4) 1-4 μs(1,4) 1-4 μs(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 1.7 μs. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the conversion will be performed during Sleep. ADRESH ADRESL (ADFM = 0) MSB LSB bit 7 bit 0 bit 7 bit 0 10-bit A/D Result Unimplemented: Read as ‘0’ (ADFM = 1) MSB LSB bit 7 bit 0 bit 7 bit 0 Unimplemented: Read as ‘0’ 10-bit A/D Result PIC18F1XK50/PIC18LF1XK50 DS41350C-page 208 Preliminary © 2009 Microchip Technology Inc. 17.2 ADC Operation 17.2.1 STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/ DONE bit of the ADCON0 register to a ‘1’ will, depending on the ACQT bits of the ADCON2 register, either immediately start the Analog-to-Digital conversion or start an acquisition delay followed by the Analog-toDigital conversion. Figure 17-3 shows the operation of the A/D converter after the GO bit has been set and the ACQT<2:0> bits are cleared. A conversion is started after the following instruction to allow entry into SLEEP mode before the conversion begins. Figure 17-4 shows the operation of the A/D converter after the GO bit has been set and the ACQT<2:0> bits are set to ‘010’ which selects a 4 TAD acquisition time before the conversion starts. FIGURE 17-3: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0) FIGURE 17-4: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD) Note: The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 17.2.9 “A/D Conversion Procedure”. TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11 Set GO bit Holding capacitor is disconnected from analog input (typically 100 ns) TCY - TAD TAD9 TAD10 ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. Conversion starts b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 On the following cycle: 2 TAD Discharge 1 2 3 4 5 6 7 8 11 Set GO bit (Holding capacitor is disconnected from analog input) 9 10 Conversion starts 1 2 3 4 (Holding capacitor continues acquiring input) TACQT Cycles TAD Cycles Automatic Acquisition Time b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. On the following cycle: 2 TAD Discharge © 2009 Microchip Technology Inc. Preliminary DS41350C-page 209 PIC18F1XK50/PIC18LF1XK50 17.2.2 COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF flag bit • Update the ADRESH:ADRESL registers with new conversion result 17.2.3 DISCHARGE The discharge phase is used to initialize the value of the capacitor array. The array is discharged after every sample. This feature helps to optimize the unity-gain amplifier, as the circuit always needs to charge the capacitor array, rather than charge/discharge based on previous measure values. 17.2.4 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared by software. The ADRESH:ADRESL registers will be updated with the partially complete Analog-to-Digital conversion sample. Unconverted bits will match the last bit converted. 17.2.5 DELAY BETWEEN CONVERSIONS After the A/D conversion is completed or aborted, a 2 TAD wait is required before the next acquisition can be started. After this wait, the currently selected channel is reconnected to the charge holding capacitor commencing the next acquisition. 17.2.6 ADC OPERATION IN POWERMANAGED MODES The selection of the automatic acquisition time and A/D conversion clock is determined in part by the clock source and frequency while in a power-managed mode. If the A/D is expected to operate while the device is in a power-managed mode, the ACQT<2:0> and ADCS<2:0> bits in ADCON2 should be updated in accordance with the clock source to be used in that mode. After entering the mode, an A/D acquisition or conversion may be started. Once started, the device should continue to be clocked by the same clock source until the conversion has been completed. If desired, the device may be placed into the corresponding Idle mode during the conversion. If the device clock frequency is less than 1 MHz, the A/D FRC clock source should be selected. 17.2.7 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. 17.2.8 SPECIAL EVENT TRIGGER The CCP1 Special Event Trigger allows periodic ADC measurements without software intervention. When this trigger occurs, the GO/DONE bit is set by hardware and the Timer1 or Timer3 counter resets to zero. Using the Special Event Trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. See Section 14.3.4 “Special Event Trigger” for more information. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 210 Preliminary © 2009 Microchip Technology Inc. 17.2.9 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. Configure Port: • Disable pin output driver (See TRIS register) • Configure pin as analog 2. Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Select result format • Select acquisition delay • Turn on ADC module 3. Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) 4. Wait the required acquisition time(2). 5. Start conversion by setting the GO/DONE bit. 6. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) 7. Read ADC Result 8. Clear the ADC interrupt flag (required if interrupt is enabled). EXAMPLE 17-1: A/D CONVERSION Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Software delay required if ACQT bits are set to zero delay. See Section 17.3 “A/D Acquisition Requirements”. ;This code block configures the ADC ;for polling, Vdd and Vss as reference, Frc clock and AN4 input. ; ;Conversion start & polling for completion ; are included. ; MOVLW B’10101111’ ;right justify, Frc, MOVWF ADCON2 ; & 12 TAD ACQ time MOVLW B’00000000’ ;ADC ref = Vdd,Vss MOVWF ADCON1 ; BSF TRISC,0 ;Set RC0 to input BSF ANSEL,4 ;Set RC0 to analog MOVLW B’00010001’ ;AN4, ADC on MOVWF ADCON0 ; BSF ADCON0,GO ;Start conversion ADCPoll: BTFSC ADCON0,GO ;Is conversion done? BRA ADCPoll ;No, test again ; Result is complete - store 2 MSbits in ; RESULTHI and 8 LSbits in RESULTLO MOVFF ADRESH,RESULTHI MOVFF ADRESL,RESULTLO © 2009 Microchip Technology Inc. Preliminary DS41350C-page 211 PIC18F1XK50/PIC18LF1XK50 17.2.10 ADC REGISTER DEFINITIONS The following registers are used to control the operation of the ADC. Note: Analog pin control is performed by the ANSEL and ANSELH registers. For ANSEL and ANSELH registers, see Register 9-15 and Register 9-16, respectively. REGISTER 17-1: ADCON0: A/D CONTROL REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-2 CHS<3:0>: Analog Channel Select bits 0000 = Reserved 0001 = Reserved 0010 = Reserved 0011 = AN3 0100 = AN4 0101 = AN5 0110 = AN6 0111 = AN7 1000 = AN8 1001 = AN9 1010 = AN10 1011 = AN11 1100 = Reserved 1101 = Reserved 1110 = DAC 1111 = FVR bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: Selecting reserved channels will yield unpredictable results as unimplemented input channels are left floating. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 212 Preliminary © 2009 Microchip Technology Inc. REGISTER 17-2: ADCON1: A/D CONTROL REGISTER 1 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — — PVCFG1 PVCFG0 NVCFG1 NVCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 Unimplemented: Read as ‘0’ bit 3-2 PVCFG<1:0>: Positive Voltage Reference select bit 00 = Positive voltage reference supplied internally by VDD. 01 = Positive voltage reference supplied externally through VREF+ pin. 10 = Positive voltage reference supplied internally through FVR. 11 = Reserved. bit 1-0 NVCFG<1:0>: Negative Voltage Reference select bit 00 = Positive voltage reference supplied internally by VSS. 01 = Positive voltage reference supplied externally through VREF- pin. 10 = Reserved. 11 = Reserved. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 213 PIC18F1XK50/PIC18LF1XK50 REGISTER 17-3: ADCON2: A/D CONTROL REGISTER 2 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADFM: A/D Conversion Result Format Select bit 1 = Right justified 0 = Left justified bit 6 Unimplemented: Read as ‘0’ bit 5-3 ACQT<2:0>: A/D Acquisition time select bits. Acquisition time is the duration that the A/D charge holding capacitor remains connected to A/D channel from the instant the GO/DONE bit is set until conversions begins. 000 = 0(1) 001 = 2 TAD 010 = 4 TAD 011 = 6 TAD 100 = 8 TAD 101 = 12 TAD 110 = 16 TAD 111 = 20 TAD bit 2-0 ADCS<2:0>: A/D Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 011 = FRC(1) (clock derived from a dedicated internal oscillator = 600 kHz nominal) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 111 = FRC(1) (clock derived from a dedicated internal oscillator = 600 kHz nominal) Note 1: When the A/D clock source is selected as FRC then the start of conversion is delayed by one instruction cycle after the GO/DONE bit is set to allow the SLEEP instruction to be executed. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 214 Preliminary © 2009 Microchip Technology Inc. REGISTER 17-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 ADRES<9:2>: ADC Result Register bits Upper 8 bits of 10-bit conversion result REGISTER 17-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x ADRES1 ADRES0 — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 ADRES<1:0>: ADC Result Register bits Lower 2 bits of 10-bit conversion result bit 5-0 Reserved: Do not use. REGISTER 17-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — — — — — ADRES9 ADRES8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Reserved: Do not use. bit 1-0 ADRES<9:8>: ADC Result Register bits Upper 2 bits of 10-bit conversion result REGISTER 17-7: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 ADRES<7:0>: ADC Result Register bits Lower 8 bits of 10-bit conversion result © 2009 Microchip Technology Inc. Preliminary DS41350C-page 215 PIC18F1XK50/PIC18LF1XK50 17.3 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 17-5. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 17-5. The maximum recommended impedance for analog sources is 10 kΩ. As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 17-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. EQUATION 17-1: ACQUISITION TIME EXAMPLE TACQ = Amplifier Settling Time Hold Capacitor Charging Time Temperature Coefficient + + T = AMP + + TC TCOFF = 5µs T + +C [ ] ( ) Temperature - 25°C ( ) 0.05µs/°C TC = –CHOLD( ) RIC + + RSS RS ln(1/2047) 13.5pF 1k = – ( ) Ω + + 700Ω 10kΩ ln(0.0004885) = 1.20µs TACQ = 5ΜS + + 1.20ΜS [ ] ( ) 50°C- 25°C ( ) 0.05ΜS/°C = 7.45ΜS VAPPLIED 1 e –Tc RC--------- – ⎝ ⎠ ⎜ ⎟ ⎛ ⎞ VAPPLIED 1 1 2047 – ----------- ⎝ ⎠ ⎛ ⎞ = VAPPLIED 1 1 2047 – ----------- ⎝ ⎠ ⎛ ⎞ = VCHOLD VAPPLIED 1 e –TC RC --------- – ⎝ ⎠ ⎜ ⎟ ⎛ ⎞ = VCHOLD ;[1] VCHOLD charged to within 1/2 lsb ;[2] VCHOLD charge response to VAPPLIED ;combining [1] and [2] The value for TC can be approximated with the following equations: Solving for TC: Therefore: Assumptions: Temperature 50°C and external impedance of 10k = Ω 3.0V VDD Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin leakage specification. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 216 Preliminary © 2009 Microchip Technology Inc. FIGURE 17-5: ANALOG INPUT MODEL FIGURE 17-6: ADC TRANSFER FUNCTION VA CPIN Rs ANx 5 pF VDD VT = 0.6V VT = 0.6V I LEAKAGE(1) RIC ≤ 1k Sampling Switch SS Rss CHOLD = 13.5 pF VSS/VREF- 2.5V Rss (kΩ) 2.0V 1.5V .1 1 10 VDD Legend: CPIN VT I LEAKAGE RIC SS CHOLD = Input Capacitance = Threshold Voltage = Leakage current at the pin due to = Interconnect Resistance = Sampling Switch = Sample/Hold Capacitance various junctions Discharge Switch 3.0V 3.5V 100 Note 1: See Section 27.0 “Electrical Specifications”. 3FFh 3FEh ADC Output Code 3FDh 3FCh 004h 003h 002h 001h 000h Full-Scale 3FBh 1/2 LSB ideal VSS/VREF- Zero-Scale Transition VDD/VREF+ Transition 1/2 LSB ideal Full-Scale Range Analog Input Voltage © 2009 Microchip Technology Inc. Preliminary DS41350C-page 217 PIC18F1XK50/PIC18LF1XK50 TABLE 17-2: REGISTERS ASSOCIATED WITH A/D OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 282 PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 282 IPR1 — ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 282 ADRESH A/D Result Register, High Byte 281 ADRESL A/D Result Register, Low Byte 281 ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 281 ADCON1 — — — — PVCFG1 PVCFG0 NVCFG1 NVCFG0 281 ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 281 ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 — — — 282 ANSELH — — — — ANS11 ANS10 ANS9 ANS8 282 TRISA – – TRISA5 TRISA4 – – – – 282 TRISB TRISB7 TRISB6 TRISB5 TRISB4 – – – – 282 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 218 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 219 PIC18F1XK50/PIC18LF1XK50 18.0 COMPARATOR MODULE Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. The comparators are very useful mixed signal building blocks because they provide analog functionality independent of the program execution. The Analog Comparator module includes the following features: • Independent comparator control • Programmable input selection • Comparator output is available internally/externally • Programmable output polarity • Interrupt-on-change • Wake-up from Sleep • Programmable Speed/Power optimization • PWM shutdown • Programmable and fixed voltage reference 18.1 Comparator Overview A single comparator is shown in Figure 18-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. FIGURE 18-1: SINGLE COMPARATOR – VIN+ + VIN- Output Output VIN+ VINNote: The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 220 Preliminary © 2009 Microchip Technology Inc. FIGURE 18-2: COMPARATOR C1 SIMPLIFIED BLOCK DIAGRAM Note 1: When C1ON = 0, the C1 comparator will produce a ‘0’ output to the XOR Gate. 2: Q1 and Q3 are phases of the four-phase system clock (FOSC). 3: Q1 is held high during Sleep mode. 4: Positive going pulse generated on both falling and rising edges of the bit. MUX C1 C1POL C1OUT To PWM Logic 0 1 2 3 C1ON(1) C1CH<1:0> 2 0 1 C1R MUX RD_CM1CON0 Set C1IF To C1VINC1VIN+ AGND C12IN1- C12IN2- C12IN3- C1IN+ D Q EN Q1 Data Bus D Q EN CL Q3*RD_CM1CON0 NReset + - 0 1 MUX VREF C1RSEL FVR C1SP C1VREF C1OE C12OUT 0 1 C1SYNC From TMR1L[0](4) D Q SYNCC1OUT C2OE © 2009 Microchip Technology Inc. Preliminary DS41350C-page 221 PIC18F1XK50/PIC18LF1XK50 FIGURE 18-3: COMPARATOR C2 SIMPLIFIED BLOCK DIAGRAM MUX C2 C2POL C2OUT To PWM Logic 0 1 2 3 C2ON(1) C2CH<1:0> 2 D Q EN D Q EN CL RD_CM2CON0 Q3*RD_CM2CON0 Q1 Set C2IF To NRESET C2VINC2VIN+ C12OUT pin AGND C12IN1- C12IN2- C12IN3- Data Bus Note 1: When C2ON = 0, the C2 comparator will produce a ‘0’ output to the XOR Gate. 2: Q1 and Q3 are phases of the four-phase system clock (FOSC). 3: Q1 is held high during Sleep mode. 4: Positive going pulse generated on both falling and rising edges of the bit. 0 1 C2R MUX C2IN+ 0 1 MUX VREF C2RSEL FVR C2SP C2VREF 0 1 C2SYNC C20E D Q SYNCC2OUT From TMR1L[0](4) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 222 Preliminary © 2009 Microchip Technology Inc. 18.2 Comparator Control Each comparator has a separate control and Configuration register: CM1CON0 for Comparator C1 and CM2CON0 for Comparator C2. In addition, Comparator C2 has a second control register, CM2CON1, for controlling the interaction with Timer1 and simultaneous reading of both comparator outputs. The CM1CON0 and CM2CON0 registers (see Registers 18-1 and 18-2, respectively) contain the control and status bits for the following: • Enable • Input selection • Reference selection • Output selection • Output polarity • Speed selection 18.2.1 COMPARATOR ENABLE Setting the CxON bit of the CMxCON0 register enables the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. 18.2.2 COMPARATOR INPUT SELECTION The CxCH<1:0> bits of the CMxCON0 register direct one of four analog input pins to the comparator inverting input. 18.2.3 COMPARATOR REFERENCE SELECTION Setting the CxR bit of the CMxCON0 register directs an internal voltage reference or an analog input pin to the non-inverting input of the comparator. See Section 21.0 “VOLTAGE REFERENCES” for more information on the Internal Voltage Reference module. 18.2.4 COMPARATOR OUTPUT SELECTION The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CM2CON1 register. In order to make the output available for an external connection, the following conditions must be true: • CxOE bit of the CMxCON0 register must be set • Corresponding TRIS bit must be cleared • CxON bit of the CMxCON0 register must be set Both comparators share the same output pin (C12OUT). Priority is determined by the states of the C1OE and C2OE bits. TABLE 18-1: COMPARATOR OUTPUT PRIORITY 18.2.5 COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CxPOL bit of the CMxCON0 register. Clearing the CxPOL bit results in a non-inverted output. Table 18-2 shows the output state versus input conditions, including polarity control. 18.2.6 COMPARATOR SPEED SELECTION The trade-off between speed or power can be optimized during program execution with the CxSP control bit. The default state for this bit is ‘1’ which selects the normal speed mode. Device power consumption can be optimized at the cost of slower comparator propagation delay by clearing the CxSP bit to ‘0’. 18.3 Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Reference Specifications in Section 27.0 “Electrical Specifications” for more details. Note: To use CxIN+ and C12INx- pins as analog inputs, the appropriate bits must be set in the ANSEL register and the corresponding TRIS bits must also be set to disable the output drivers. C10E C2OE C12OUT 0 0 I/O 0 1 C2OUT 1 0 C1OUT 1 1 C2OUT Note 1: The CxOE bit overrides the PORT data latch. Setting the CxON has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched. TABLE 18-2: COMPARATOR OUTPUT STATE VS. INPUT CONDITIONS Input Condition CxPOL CxOUT CxVIN- > CxVIN+ 0 0 CxVIN- < CxVIN+ 0 1 CxVIN- > CxVIN+ 1 1 CxVIN- < CxVIN+ 1 0 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 223 PIC18F1XK50/PIC18LF1XK50 18.4 Comparator Interrupt Operation The comparator interrupt flag can be set whenever there is a change in the output value of the comparator. Changes are recognized by means of a mismatch circuit which consists of two latches and an exclusiveor gate (see Figure 18-2 and Figure 18-3). One latch is updated with the comparator output level when the CMxCON0 register is read. This latch retains the value until the next read of the CMxCON0 register or the occurrence of a Reset. The other latch of the mismatch circuit is updated on every Q1 system clock. A mismatch condition will occur when a comparator output change is clocked through the second latch on the Q1 clock cycle. At this point the two mismatch latches have opposite output levels which is detected by the exclusive-or gate and fed to the interrupt circuitry. The mismatch condition persists until either the CMxCON0 register is read or the comparator output returns to the previous state. The comparator interrupt is set by the mismatch edge and not the mismatch level. This means that the interrupt flag can be reset without the additional step of reading or writing the CMxCON0 register to clear the mismatch registers. When the mismatch registers are cleared, an interrupt will occur upon the comparator’s return to the previous state, otherwise no interrupt will be generated. Software will need to maintain information about the status of the comparator output, as read from the CMxCON0 register, or CM2CON1 register, to determine the actual change that has occurred. See Figures 18-4 and 18-5. The CxIF bit of the PIR2 register is the comparator interrupt flag. This bit must be reset by software by clearing it to ‘0’. Since it is also possible to write a ‘1’ to this register, an interrupt can be generated. In mid-range Compatibility mode the CxIE bit of the PIE2 register and the PEIE and GIE bits of the INTCON register must all be set to enable comparator interrupts. If any of these bits are cleared, the interrupt is not enabled, although the CxIF bit of the PIR2 register will still be set if an interrupt condition occurs. 18.4.1 PRESETTING THE MISMATCH LATCHES The comparator mismatch latches can be preset to the desired state before the comparators are enabled. When the comparator is off the CxPOL bit controls the CxOUT level. Set the CxPOL bit to the desired CxOUT non-interrupt level while the CxON bit is cleared. Then, configure the desired CxPOL level in the same instruction that the CxON bit is set. Since all register writes are performed as a Read-Modify-Write, the mismatch latches will be cleared during the instruction Read phase and the actual configuration of the CxON and CxPOL bits will be occur in the final Write phase. FIGURE 18-4: COMPARATOR INTERRUPT TIMING W/O CMxCON0 READ FIGURE 18-5: COMPARATOR INTERRUPT TIMING WITH CMxCON0 READ Note 1: A write operation to the CMxCON0 register will also clear the mismatch condition because all writes include a read operation at the beginning of the write cycle. 2: Comparator interrupts will operate correctly regardless of the state of CxOE. Note 1: If a change in the CMxCON0 register (CxOUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CxIF interrupt flag of the PIR2 register may not get set. 2: When either comparator is first enabled, bias circuitry in the Comparator module may cause an invalid output from the comparator until the bias circuitry is stable. Allow about 1 μs for bias settling then clear the mismatch condition and interrupt flags before enabling comparator interrupts. Q1 Q3 CxIN+ CxOUT Set CxIF (edge) CxIF TRT Reset by Software Q1 Q3 CxIN+ CxOUT Set CxIF (edge) CxIF TRT Cleared by CMxCON0 Read Reset by Software PIC18F1XK50/PIC18LF1XK50 DS41350C-page 224 Preliminary © 2009 Microchip Technology Inc. 18.5 Operation During Sleep The comparator, if enabled before entering Sleep mode, remains active during Sleep. The additional current consumed by the comparator is shown separately in the Section 27.0 “Electrical Specifications”. If the comparator is not used to wake the device, power consumption can be minimized while in Sleep mode by turning off the comparator. Each comparator is turned off by clearing the CxON bit of the CMxCON0 register. A change to the comparator output can wake-up the device from Sleep. To enable the comparator to wake the device from Sleep, the CxIE bit of the PIE2 register and the PEIE bit of the INTCON register must be set. The instruction following the SLEEP instruction always executes following a wake from Sleep. If the GIE bit of the INTCON register is also set, the device will then execute the Interrupt Service Routine. 18.6 Effects of a Reset A device Reset forces the CMxCON0 and CM2CON1 registers to their Reset states. This forces both comparators and the voltage references to their Off states. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 225 PIC18F1XK50/PIC18LF1XK50 REGISTER 18-1: CM1CON0: COMPARATOR 1 CONTROL REGISTER 0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 C1ON C1OUT C1OE C1POL C1SP C1R C1CH1 C1CH0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 C1ON: Comparator C1 Enable bit 1 = Comparator C1 is enabled 0 = Comparator C1 is disabled bit 6 C1OUT: Comparator C1 Output bit If C1POL = 1 (inverted polarity): C1OUT = 0 when C1VIN+ > C1VINC1OUT = 1 when C1VIN+ < C1VINIf C1POL = 0 (non-inverted polarity): C1OUT = 1 when C1VIN+ > C1VINC1OUT = 0 when C1VIN+ < C1VINbit 5 C1OE: Comparator C1 Output Enable bit If C2OE = 0 (C2 output disable) 0 = C1OUT is internal only 1 = C1OUT is present on the C12OUT pin(1) If C2OE = 1 (C2 output enable) 0 = C1OUT is internal only 1 = C2OUT is present on the C12OUT pin(1) bit 4 C1POL: Comparator C1 Output Polarity Select bit 1 = C1OUT logic is inverted 0 = C1OUT logic is not inverted bit 3 C1SP: Comparator C1 Speed/Power Select bit 1 = C1 operates in normal power, higher speed mode 0 = C1 operates in low-power, low-speed mode bit 2 C1R: Comparator C1 Reference Select bit (non-inverting input) 1 = C1VIN+ connects to C1VREF output 0 = C1VIN+ connects to C12IN+ pin bit 1-0 C1CH<1:0>: Comparator C1 Channel Select bit 00 = C1VIN- connects to AGND 01 = C12IN1- pin of C1 connects to C1VIN- 10 = C12IN2- pin of C1 connects to C1VIN- 11 = C12IN3- pin of C1 connects to C1VINNote 1: Comparator output requires the following three conditions: C1OE = 1, C1ON = 1 and corresponding port TRIS bit = 0. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 226 Preliminary © 2009 Microchip Technology Inc. REGISTER 18-2: CM2CON0: COMPARATOR 2 CONTROL REGISTER 0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 C2ON C2OUT C2OE C2POL C2SP C2R C2CH1 C2CH0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 C2ON: Comparator C2 Enable bit 1 = Comparator C2 is enabled 0 = Comparator C2 is disabled bit 6 C2OUT: Comparator C2 Output bit If C2POL = 1 (inverted polarity): C2OUT = 0 when C2VIN+ > C2VINC2OUT = 1 when C2VIN+ < C2VINIf C2POL = 0 (non-inverted polarity): C2OUT = 1 when C2VIN+ > C2VINC2OUT = 0 when C2VIN+ < C2VINbit 5 C2OE: Comparator C2 Output Enable bit 1 = C2OUT is present on C12OUT pin(1) 0 = C2OUT is internal only bit 4 C2POL: Comparator C2 Output Polarity Select bit 1 = C2OUT logic is inverted 0 = C2OUT logic is not inverted bit 3 C2SP: Comparator C2 Speed/Power Select bit 1 = C2 operates in normal power, higher speed mode 0 = C2 operates in low-power, low-speed mode bit 2 C2R: Comparator C2 Reference Select bits (non-inverting input) 1 = C2VIN+ connects to C2VREF 0 = C2VIN+ connects to C2IN+ pin bit 1-0 C2CH<1:0>: Comparator C2 Channel Select bits 00 = C1VIN- connects to AGND 01 = C12IN1- pin of C2 connects to C2VIN- 10 = C12IN2- pin of C2 connects to C2VIN- 11 = C12IN3- pin of C2 connects to C2VINNote 1: Comparator output requires the following three conditions: C2OE = 1, C2ON = 1 and corresponding port TRIS bit = 0. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 227 PIC18F1XK50/PIC18LF1XK50 18.7 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 18-6. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 kΩ is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. FIGURE 18-6: ANALOG INPUT MODEL Note 1: When reading a PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert as an analog input, according to the input specification. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. VA Rs < 10K CPIN 5 pF VDD VT ≈ 0.6V VT ≈ 0.6V RIC ILEAKAGE(1) Vss AIN Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage VT = Threshold Voltage Note 1: See Section 27.0 “Electrical Specifications”. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 228 Preliminary © 2009 Microchip Technology Inc. 18.8 Additional Comparator Features There are four additional comparator features: • Simultaneous read of comparator outputs • Internal reference selection • Hysteresis selection • Output Synchronization 18.8.1 SIMULTANEOUS COMPARATOR OUTPUT READ The MC1OUT and MC2OUT bits of the CM2CON1 register are mirror copies of both comparator outputs. The ability to read both outputs simultaneously from a single register eliminates the timing skew of reading separate registers. 18.8.2 INTERNAL REFERENCE SELECTION There are two internal voltage references available to the non-inverting input of each comparator. One of these is the Fixed Voltage Reference (FVR) and the other is the variable Comparator Voltage Reference (CVREF). The CxRSEL bit of the CM2CON register determines which of these references is routed to the Comparator Voltage reference output (CXVREF). Further routing to the comparator is accomplished by the CxR bit of the CMxCON0 register. See Section 21.1 “Voltage Reference” and Figure 18-2 and Figure 18-3 for more detail. 18.8.3 COMPARATOR HYSTERESIS The Comparator Cx have selectable hysteresis. The hysteresis can be enable by setting the CxHYS bit of the CM2CON1 register. See Section 27.0 “Electrical Specifications” for more details. 18.8.4 SYNCHRONIZING COMPARATOR OUTPUT TO TIMER 1 The Comparator Cx output can be synchronized with Timer1 by setting the CxSYNC bit of the CM2CON1 register. When enabled, the Cx output is latched on the rising edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the rising edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 18-2 and Figure 18-3) and the Timer1 Block Diagram (Figure 18-2) for more information. Note 1: Obtaining the status of C1OUT or C2OUT by reading CM2CON1 does not affect the comparator interrupt mismatch registers. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 229 PIC18F1XK50/PIC18LF1XK50 REGISTER 18-3: CM2CON1: COMPARATOR 2 CONTROL REGISTER 1 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 MC1OUT MC2OUT C1RSEL C2RSEL C1HYS C2HYS C1SYNC C2SYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 MC1OUT: Mirror Copy of C1OUT bit bit 6 MC2OUT: Mirror Copy of C2OUT bit bit 5 C1RSEL: Comparator C1 Reference Select bit 1 = FVR routed to C1VREF input 0 = CVREF routed to C1VREF input bit 4 C2RSEL: Comparator C2 Reference Select bit 1 = FVR routed to C2VREF input 0 = CVREF routed to C2VREF input bit 3 C1HYS: Comparator C1 Hysteresis Enable bit 1 = Comparator C1 hysteresis enabled 0 = Comparator C1 hysteresis disabled bit 2 C2HYS: Comparator C2 Hysteresis Enable bit 1 = Comparator C2 hysteresis enabled 0 = Comparator C2 hysteresis disabled bit 1 C1SYNC: C1 Output Synchronous Mode bit 1 = C1 output is synchronous to rising edge to TMR1 clock 0 = C1 output is asynchronous bit 0 C2SYNC: C2 Output Synchronous Mode bit 1 = C2 output is synchronous to rising edge to TMR1 clock 0 = C2 output is asynchronous PIC18F1XK50/PIC18LF1XK50 DS41350C-page 230 Preliminary © 2009 Microchip Technology Inc. TABLE 18-3: REGISTERS ASSOCIATED WITH COMPARATOR MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page CM1CON0 C1ON C1OUT C1OE C1POL C1SP C1R C1CH1 C1CH0 282 CM2CON0 C2ON C2OUT C2OE C2POL C2SP C2R C2CH1 C2CH0 282 CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL C1HYS C2HYS C1SYNC C2SYNC 282 REFCON0 FVR1EN FVR1ST FVR1S1 FVR1S0 TSEN TSRS — — 281 REFCON1 D1EN D1LPS DAC1OE --- D1PSS1 D1PSS0 — D1NSS 281 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 279 PIR2 OSCFIF C1IF C2IF EEIF BCLIF USBIF TMR3IF — 282 PIE2 OSCFIE C1IE C2IE EEIE BCLIE USBIE TMR3IE — 282 IPR2 OSCFIP C1IP C2IP EEIP BCLIP USBIP TMR3IP — 282 PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 282 LATC LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 282 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 — — — 282 Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 231 PIC18F1XK50/PIC18LF1XK50 19.0 POWER-MANAGED MODES PIC18F1XK50/PIC18LF1XK50 devices offer a total of seven operating modes for more efficient power management. These modes provide a variety of options for selective power conservation in applications where resources may be limited (i.e., battery-powered devices). There are three categories of power-managed modes: • Run modes • Idle modes • Sleep mode These categories define which portions of the device are clocked and sometimes, what speed. The Run and Idle modes may use any of the three available clock sources (primary, secondary or internal oscillator block); the Sleep mode does not use a clock source. The power-managed modes include several powersaving features offered on previous PIC® microcontroller devices. One is the clock switching feature which allows the controller to use the Timer1 oscillator in place of the primary oscillator. Also included is the Sleep mode, offered by all PIC® microcontroller devices, where all device clocks are stopped. 19.1 Selecting Power-Managed Modes Selecting a power-managed mode requires two decisions: • Whether or not the CPU is to be clocked • The selection of a clock source The IDLEN bit of the OSCCON register controls CPU clocking, while the SCS<1:0> bits of the OSCCON register select the clock source. The individual modes, bit settings, clock sources and affected modules are summarized in Table 19-1. 19.1.1 CLOCK SOURCES The SCS<1:0> bits allow the selection of one of three clock sources for power-managed modes. They are: • the primary clock, as defined by the FOSC<3:0> Configuration bits • the secondary clock (the Timer1 oscillator) • the internal oscillator block 19.1.2 ENTERING POWER-MANAGED MODES Switching from one power-managed mode to another begins by loading the OSCCON register. The SCS<1:0> bits select the clock source and determine which Run or Idle mode is to be used. Changing these bits causes an immediate switch to the new clock source, assuming that it is running. The switch may also be subject to clock transition delays. Refer to Section 2.8 “Clock Switching” for more information. Entry to the power-managed Idle or Sleep modes is triggered by the execution of a SLEEP instruction. The actual mode that results depends on the status of the IDLEN bit of the OSCCON register. Depending on the current mode and the mode being switched to, a change to a power-managed mode does not always require setting all of these bits. Many transitions may be done by changing the oscillator select bits, or changing the IDLEN bit, prior to issuing a SLEEP instruction. If the IDLEN bit is already configured correctly, it may only be necessary to perform a SLEEP instruction to switch to the desired mode. TABLE 19-1: POWER-MANAGED MODES Mode OSCCON Bits Module Clocking Available Clock and Oscillator Source IDLEN(1) SCS<1:0> CPU Peripherals Sleep 0 N/A Off Off None – All clocks are disabled PRI_RUN N/A 00 Clocked Clocked Primary – LP, XT, HS, RC, EC and Internal Oscillator Block(2). This is the normal full power execution mode. SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 Oscillator RC_RUN N/A 1x Clocked Clocked Internal Oscillator Block(2) PRI_IDLE 1 00 Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC SEC_IDLE 1 01 Off Clocked Secondary – Timer1 Oscillator RC_IDLE 1 1x Off Clocked Internal Oscillator Block(2) Note 1: IDLEN reflects its value when the SLEEP instruction is executed. 2: Includes HFINTOSC and HFINTOSC postscaler, as well as the LFINTOSC source. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 232 Preliminary © 2009 Microchip Technology Inc. 19.1.3 MULTIPLE FUNCTIONS OF THE SLEEP COMMAND The power-managed mode that is invoked with the SLEEP instruction is determined by the setting of the IDLEN bit of the OSCCON register at the time the instruction is executed. All clocks stop and minimum power is consumed when SLEEP is executed with the IDLEN bit cleared. The system clock continues to supply a clock to the peripherals but is disconnected from the CPU when SLEEP is executed with the IDLEN bit set. 19.2 Run Modes In the Run modes, clocks to both the core and peripherals are active. The difference between these modes is the clock source. 19.2.1 PRI_RUN MODE The PRI_RUN mode is the normal, full power execution mode of the microcontroller. This is also the default mode upon a device Reset, unless Two-Speed Start-up is enabled (see Section 2.12 “Two-Speed Start-up Mode” for details). In this mode, the device operated off the oscillator defined by the FOSC bits of the CONFIGH Configuration register. 19.2.2 SEC_RUN MODE In SEC_RUN mode, the CPU and peripherals are clocked from the secondary external oscillator. This gives users the option of lower power consumption while still using a high accuracy clock source. SEC_RUN mode is entered by setting the SCS<1:0> bits of the OSCCON register to ‘01’. When SEC_RUN mode is active all of the following are true: • The main clock source is switched to the secondary external oscillator • Primary external oscillator is shut down • T1RUN bit of the T1CON register is set • OSTS bit is cleared. 19.2.3 RC_RUN MODE In RC_RUN mode, the CPU and peripherals are clocked from the internal oscillator. In this mode, the primary external oscillator is shut down. RC_RUN mode provides the best power conservation of all the Run modes when the LFINTOSC is the system clock. RC_RUN mode is entered by setting the SCS1 bit. When the clock source is switched from the primary oscillator to the internal oscillator, the primary oscillator is shut down and the OSTS bit is cleared. The IRCF bits may be modified at any time to immediately change the clock speed. Note: The secondary external oscillator should already be running prior to entering SEC_RUN mode. If the T1OSCEN bit is not set when the SCS<1:0> bits are set to ‘01’, entry to SEC_RUN mode will not occur until T1OSCEN bit is set and secondary external oscillator is ready. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 233 PIC18F1XK50/PIC18LF1XK50 19.3 Sleep Mode The Power-Managed Sleep mode in the PIC18F1XK50/ PIC18LF1XK50 devices is identical to the legacy Sleep mode offered in all other PIC® microcontroller devices. It is entered by clearing the IDLEN bit of the OSCCON register and executing the SLEEP instruction. This shuts down the selected oscillator (Figure 19-1) and all clock source status bits are cleared. Entering the Sleep mode from either Run or Idle mode does not require a clock switch. This is because no clocks are needed once the controller has entered Sleep. If the WDT is selected, the LFINTOSC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. When a wake event occurs in Sleep mode (by interrupt, Reset or WDT time-out), the device will not be clocked until the clock source selected by the SCS<1:0> bits becomes ready (see Figure 19-2), or it will be clocked from the internal oscillator block if either the Two-Speed Start-up or the Fail-Safe Clock Monitor are enabled (see Section 24.0 “Special Features of the CPU”). In either case, the OSTS bit is set when the primary clock is providing the device clocks. The IDLEN and SCS bits are not affected by the wake-up. 19.4 Idle Modes The Idle modes allow the controller’s CPU to be selectively shut down while the peripherals continue to operate. Selecting a particular Idle mode allows users to further manage power consumption. If the IDLEN bit is set to a ‘1’ when a SLEEP instruction is executed, the peripherals will be clocked from the clock source selected by the SCS<1:0> bits; however, the CPU will not be clocked. The clock source status bits are not affected. Setting IDLEN and executing a SLEEP instruction provides a quick method of switching from a given Run mode to its corresponding Idle mode. If the WDT is selected, the LFINTOSC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. Since the CPU is not executing instructions, the only exits from any of the Idle modes are by interrupt, WDT time-out, or a Reset. When a wake event occurs, CPU execution is delayed by an interval of TCSD while it becomes ready to execute code. When the CPU begins executing code, it resumes with the same clock source for the current Idle mode. For example, when waking from RC_IDLE mode, the internal oscillator block will clock the CPU and peripherals (in other words, RC_RUN mode). The IDLEN and SCS bits are not affected by the wake-up. While in any Idle mode or the Sleep mode, a WDT time-out will result in a WDT wake-up to the Run mode currently specified by the SCS<1:0> bits. FIGURE 19-1: TRANSITION TIMING FOR ENTRY TO SLEEP MODE FIGURE 19-2: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL) Q2 Q3 Q4 OSC1 Peripheral Sleep Program Q1 Q1 Counter Clock CPU Clock PC PC + 2 Q3 Q4 Q1 Q2 OSC1 Peripheral Program PC PLL Clock Q3 Q4 Output CPU Clock Q1 Q2 Q3 Q4 Q1 Q2 Clock Counter PC + 4 PC + 6 Q1 Q2 Q3 Q4 Wake Event Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. TOST(1) TPLL(1) OSTS bit set PC + 2 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 234 Preliminary © 2009 Microchip Technology Inc. 19.4.1 PRI_IDLE MODE This mode is unique among the three low-power Idle modes, in that it does not disable the primary device clock. For timing sensitive applications, this allows for the fastest resumption of device operation with its more accurate primary clock source, since the clock source does not have to “warm-up” or transition from another oscillator. PRI_IDLE mode is entered from PRI_RUN mode by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then clear the SCS bits and execute SLEEP. Although the CPU is disabled, the peripherals continue to be clocked from the primary clock source specified by the FOSC<3:0> Configuration bits. The OSTS bit remains set (see Figure 19-3). When a wake event occurs, the CPU is clocked from the primary clock source. A delay of interval TCSD is required between the wake event and when code execution starts. This is required to allow the CPU to become ready to execute instructions. After the wakeup, the OSTS bit remains set. The IDLEN and SCS bits are not affected by the wake-up (see Figure 19-4). 19.4.2 SEC_IDLE MODE In SEC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the Timer1 oscillator. This mode is entered from SEC_RUN by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set the IDLEN bit first, then set the SCS<1:0> bits to ‘01’ and execute SLEEP. When the clock source is switched to the Timer1 oscillator, the primary oscillator is shut down, the OSTS bit is cleared and the T1RUN bit is set. When a wake event occurs, the peripherals continue to be clocked from the Timer1 oscillator. After an interval of TCSD following the wake event, the CPU begins executing code being clocked by the Timer1 oscillator. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run (see Figure 19- 4). FIGURE 19-3: TRANSITION TIMING FOR ENTRY TO IDLE MODE FIGURE 19-4: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE Note: The Timer1 oscillator should already be running prior to entering SEC_IDLE mode. If the T1OSCEN bit is not set when the SLEEP instruction is executed, the main system clock will continue to operate in the previously selected mode and the corresponding IDLE mode will be entered (i.e., PRI_IDLE or RC_IDLE). Q1 Peripheral Program PC PC + 2 OSC1 Q3 Q4 Q1 CPU Clock Clock Counter Q2 OSC1 Peripheral Program PC CPU Clock Q1 Q3 Q4 Clock Counter Q2 Wake Event TCSD © 2009 Microchip Technology Inc. Preliminary DS41350C-page 235 PIC18F1XK50/PIC18LF1XK50 19.4.3 RC_IDLE MODE In RC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the internal oscillator block from the HFINTOSC multiplexer output. This mode allows for controllable power conservation during Idle periods. From RC_RUN, this mode is entered by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, first set IDLEN, then set the SCS1 bit and execute SLEEP. It is recommended that SCS0 also be cleared, although its value is ignored, to maintain software compatibility with future devices. The HFINTOSC multiplexer may be used to select a higher clock frequency by modifying the IRCF bits before executing the SLEEP instruction. When the clock source is switched to the HFINTOSC multiplexer, the primary oscillator is shut down and the OSTS bit is cleared. If the IRCF bits are set to any non-zero value, or the INTSRC bit is set, the HFINTOSC output is enabled. The IOSF bit becomes set, after the HFINTOSC output becomes stable, after an interval of TIOBST. Clocks to the peripherals continue while the HFINTOSC source stabilizes. If the IRCF bits were previously at a nonzero value, or INTSRC was set before the SLEEP instruction was executed and the HFINTOSC source was already stable, the IOSF bit will remain set. If the IRCF bits and INTSRC are all clear, the HFINTOSC output will not be enabled, the IOSF bit will remain clear and there will be no indication of the current clock source. When a wake event occurs, the peripherals continue to be clocked from the HFINTOSC multiplexer output. After a delay of TCSD following the wake event, the CPU begins executing code being clocked by the HFINTOSC multiplexer. The IDLEN and SCS bits are not affected by the wake-up. The LFINTOSC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. 19.5 Exiting Idle and Sleep Modes An exit from Sleep mode or any of the Idle modes is triggered by any one of the following: • an interrupt • a Reset • a Watchdog Time-out This section discusses the triggers that cause exits from power-managed modes. The clocking subsystem actions are discussed in each of the power-managed modes (see Section 19.2 “Run Modes”, Section 19.3 “Sleep Mode” and Section 19.4 “Idle Modes”). 19.5.1 EXIT BY INTERRUPT Any of the available interrupt sources can cause the device to exit from an Idle mode or the Sleep mode to a Run mode. To enable this functionality, an interrupt source must be enabled by setting its enable bit in one of the INTCON or PIE registers. The PEIE bIt must also be set If the desired interrupt enable bit is in a PIE register. The exit sequence is initiated when the corresponding interrupt flag bit is set. The instruction immediately following the SLEEP instruction is executed on all exits by interrupt from Idle or Sleep modes. Code execution then branches to the interrupt vector if the GIE/GIEH bit of the INTCON register is set, otherwise code execution continues without branching (see Section 7.0 “Interrupts”). A fixed delay of interval TCSD following the wake event is required when leaving Sleep and Idle modes. This delay is required for the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. 19.5.2 EXIT BY WDT TIME-OUT A WDT time-out will cause different actions depending on which power-managed mode the device is in when the time-out occurs. If the device is not executing code (all Idle modes and Sleep mode), the time-out will result in an exit from the power-managed mode (see Section 19.2 “Run Modes” and Section 19.3 “Sleep Mode”). If the device is executing code (all Run modes), the time-out will result in a WDT Reset (see Section 24.2 “Watchdog Timer (WDT)”). The WDT timer and postscaler are cleared by any one of the following: • executing a SLEEP instruction • executing a CLRWDT instruction • the loss of the currently selected clock source when the Fail-Safe Clock Monitor is enabled • modifying the IRCF bits in the OSCCON register when the internal oscillator block is the device clock source PIC18F1XK50/PIC18LF1XK50 DS41350C-page 236 Preliminary © 2009 Microchip Technology Inc. 19.5.3 EXIT BY RESET Exiting Sleep and Idle modes by Reset causes code execution to restart at address 0. See Section 23.0 “Reset” for more details. The exit delay time from Reset to the start of code execution depends on both the clock sources before and after the wake-up and the type of oscillator. Exit delays are summarized in Table 19-2. 19.5.4 EXIT WITHOUT AN OSCILLATOR START-UP DELAY Certain exits from power-managed modes do not invoke the OST at all. There are two cases: • PRI_IDLE mode, where the primary clock source is not stopped and • the primary clock source is not any of the LP, XT, HS or HSPLL modes. In these instances, the primary clock source either does not require an oscillator start-up delay since it is already running (PRI_IDLE), or normally does not require an oscillator start-up delay (RC, EC, INTOSC, and INTOSCIO modes). However, a fixed delay of interval TCSD following the wake event is still required when leaving Sleep and Idle modes to allow the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. TABLE 19-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE (BY CLOCK SOURCES) Clock Source before Wake-up Clock Source after Wake-up Exit Delay Clock Ready Status Bit (OSCCON) Primary Device Clock (PRI_IDLE mode) LP, XT, HS TCSD HSPLL (1) OSTS EC, RC HFINTOSC(2) IOSF T1OSC or LFINTOSC(1) LP, XT, HS TOST(3) HSPLL TOST + tPLL OSTS (3) EC, RC TCSD(1) HFINTOSC(1) TIOBST(4) IOSF HFINTOSC(2) LP, XT, HS TOST(4) HSPLL TOST + tPLL OSTS (3) EC, RC TCSD(1) HFINTOSC(1) None IOSF None (Sleep mode) LP, XT, HS TOST(3) HSPLL TOST + tPLL OSTS (3) EC, RC TCSD(1) HFINTOSC(1) TIOBST(4) IOSF Note 1: TCSD is a required delay when waking from Sleep and all Idle modes and runs concurrently with any other required delays (see Section 19.4 “Idle Modes”). On Reset, HFINTOSC defaults to 1 MHz. 2: Includes both the HFINTOSC 16 MHz source and postscaler derived frequencies. 3: TOST is the Oscillator Start-up Timer. tPLL is the PLL Lock-out Timer (parameter F12). 4: Execution continues during the HFINTOSC stabilization period, TIOBST. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 237 PIC18F1XK50/PIC18LF1XK50 20.0 SR LATCH The module consists of a single SR Latch with multiple Set and Reset inputs as well as selectable latch output. The SR Latch module includes the following features: • Programmable input selection • SR Latch output is available internally/externally • Selectable Q and Q output • Firmware Set and Reset 20.1 Latch Operation The latch is a Set-Reset latch that does not depend on a clock source. Each of the Set and Reset inputs are active-high. The latch can be Set or Reset by CxOUT, INT1 pin, or variable clock. Additionally the SRPS and the SRPR bits of the SRCON0 register may be used to Set or Reset the SR Latch, respectively. The latch is reset-dominant, therefore, if both Set and Reset inputs are high the latch will go to the Reset state. Both the SRPS and SRPR bits are self resetting which means that a single write to either of the bits is all that is necessary to complete a latch Set or Reset operation. 20.2 Latch Output The SRQEN and SRNQEN bits of the SRCON0 register control the latch output selection. Only one of the SR latch’s outputs may be directly output to an I/O pin at a time. Priority is determined by the state of bits SRQEN and SRNQEN in registers SRCON0. TABLE 20-1: SR LATCH OUTPUT CONTROL The applicable TRIS bit of the corresponding port must be cleared to enable the port pin output driver. 20.3 Effects of a Reset Upon any device Reset, the SR latch is not initialized. The user’s firmware is responsible to initialize the latch output before enabling it to the output pins. FIGURE 20-1: SR LATCH SIMPLIFIED BLOCK DIAGRAM SRLEN SRQEN SRNQEN SR Latch Output to Port I/O 0X X I/O 10 0 I/O 10 1 Q 11 0 Q 11 1 Q SRPS S R Q Q Note 1: If R = 1 and S = 1 simultaneously, Q = 0, Q = 1 2: Pulse generator causes a 2 Q-state pulse width. 3: Output shown for reference only. See I/O port pin block diagram for more detail. 4: Name denotes the source of connection at the comparator output. Pulse Gen(2) SR Latch(1) SRNQEN SRQ pin(3) SRQEN SRNQEN SRSPE SRSC2E INT1 SRSCKE SRCLK SYNCC2OUT(4) SRSC1E SYNCC1OUT(4) SRPR Pulse Gen(2) SRRPE SRRC2E INT1 SRRCKE SRCLK SYNCC2OUT(4) SRRC1E SYNCC1OUT(4) SRLEN SRLEN PIC18F1XK50/PIC18LF1XK50 DS41350C-page 238 Preliminary © 2009 Microchip Technology Inc. TABLE 20-1: SRCLK FREQUENCY TABLE SRCLK Divider FOSC = 20 MHz FOSC = 16 MHz FOSC = 8 MHz FOSC = 4 MHz FOSC = 1 MHz 111 512 25.6 μs 32 μs 64 μs 128 μs 512 μs 110 256 12.8 μs 16 μs 32 μs 64 μs 256 μs 101 128 6.4 μs 8 μs 16 μs 32 μs 128 μs 100 64 3.2 μs 4 μs 8 μs 16 μs 64 μs 011 32 1.6 μs 2 μs 4 μs 8 μs 32 μs 010 16 0.8 μs 1 μs 2 μs 4 μs 16 μs 001 8 0.4 μs 0.5 μs 1 μs 2 μs 8 μs 000 4 0.2 μs 0.25 μs 0.5 μs 1 μs 4 μs REGISTER 20-2: SRCON0: SR LATCH CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SRLEN SRCLK2 SRCLK1 SRCLK0 SRQEN SRNQEN SRPS SRPR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SRLEN: SR Latch Enable bit(1) 1 = SR latch is enabled 0 = SR latch is disabled bit 6-4 SRCLK<2:0>(1): SR Latch Clock divider bits 000 = 1/4 Peripheral cycle clock 001 = 1/8 Peripheral cycle clock 010 = 1/16 Peripheral cycle clock 011 = 1/32 Peripheral cycle clock 100 = 1/64 Peripheral cycle clock 101 = 1/128 Peripheral cycle clock 110 = 1/256 Peripheral cycle clock 111 = 1/512 Peripheral cycle clock bit 3 SRQEN: SR Latch Q Output Enable bit If SRNQEN = 0 1 = Q is present on the RC4 pin 0 = Q is internal only bit 2 SRNQEN: SR Latch Q Output Enable bit 1 =Q is present on the RC4 pin 0 =Q is internal only bit 1 SRPS: Pulse Set Input of the SR Latch 1 = Pulse input 0 = Always reads back ‘0’ bit 0 SRPR: Pulse Reset Input of the SR Latch 1 = Pulse input 0 = Always reads back ‘0’ Note 1: Changing the SRCLK bits while the SR latch is enabled may cause false triggers to the set and Reset inputs of the latch. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 239 PIC18F1XK50/PIC18LF1XK50 TABLE 20-2: REGISTERS ASSOCIATED WITH THE SR LATCH REGISTER 20-3: SRCON1: SR LATCH CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SRSPE: SR Latch Peripheral Set Enable bit 1 = INT1 pin status sets SR Latch 0 = INT1pin status has no effect on SR Latch bit 6 SRSCKE: SR Latch Set Clock Enable bit 1 = Set input of SR latch is pulsed with SRCLK 0 = Set input of SR latch is not pulsed with SRCLK bit 5 SRSC2E: SR Latch C2 Set Enable bit 1 = C2 Comparator output sets SR Latch 0 = C2 Comparator output has no effect on SR Latch bit 4 SRSC1E: SR Latch C1 Set Enable bit 1 = C1 Comparator output sets SR Latch 0 = C1 Comparator output has no effect on SR Latch bit 3 SRRPE: SR Latch Peripheral Reset Enable bit 1 = INT1 pin resets SR Latch 0 = INT1 pin has no effect on SR Latch bit 2 SRRCKE: SR Latch Reset Clock Enable bit 1 = Reset input of SR latch is pulsed with SRCLK 0 = Reset input of SR latch is not pulsed with SRCLK bit 1 SRRC2E: SR Latch C2 Reset Enable bit 1 = C2 Comparator output resets SR Latch 0 = C2 Comparator output has no effect on SR Latch bit 0 SRRC1E: SR Latch C1 Reset Enable bit 1 = C1 Comparator output resets SR Latch 0 = C1 Comparator output has no effect on SR Latch Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page SRCON0 SRLEN SRCLK2 SRCLK1 SRCLK0 SRQEN SRNQEN SRPS SRPR 282 SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 282 CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL C1HYS C2HYS C1SYNC C2SYNC 282 INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 279 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 Legend: Shaded cells are not used with the comparator voltage reference. Note 1: PORTA pins are enabled based on oscillator configuration. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 240 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 241 PIC18F1XK50/PIC18LF1XK50 21.0 VOLTAGE REFERENCES There are two independent voltage references available: • Programmable Voltage Reference • 1.024V Fixed Voltage Reference 21.1 Voltage Reference The Voltage Reference module provides an internally generated voltage reference for the comparators and the DAC module. The following features are available: • Independent from Comparator operation • Single 32-level voltage ranges • Output clamped to VSS • Ratiometric with VDD • 1.024V Fixed Reference Voltage (FVR) The REFCON1 register (Register 21-2) controls the Voltage Reference module shown in Figure 21-1. 21.1.1 INDEPENDENT OPERATION The voltage reference is independent of the comparator configuration. Setting the D1EN bit of the REFCON1 register will enable the voltage reference by allowing current to flow in the VREF voltage divider. When the D1EN bit is cleared, current flow in the VREF voltage divider is disabled minimizing the power drain of the voltage reference peripheral. 21.1.2 OUTPUT VOLTAGE SELECTION The VREF voltage reference has 32 voltage level ranges. The 32 levels are set with the DAC1R<4:0> bits of the REFCON2 register. The VREF output voltage is determined by the following equations: EQUATION 21-1: VREF OUTPUT VOLTAGE 21.1.3 OUTPUT CLAMPED TO VSS The VREF output voltage can be set to Vss with no power consumption by setting the D1EN bit of the REFCON1 register to ‘0’: This allows the comparator to detect a zero-crossing while not consuming additional VREF module current. 21.1.4 OUTPUT RATIOMETRIC TO VDD The comparator voltage reference is VDD derived and therefore, the VREF output changes with fluctuations in VDD. The tested absolute accuracy of the Comparator Voltage Reference can be found in Section 27.0 “Electrical Specifications”. 21.1.5 VOLTAGE REFERENCE OUTPUT The VREF voltage reference can be output to the device CVREF pin by setting the DAC1OE bit of the REFCON1 register to ‘1’. Selecting the reference voltage for output on the VREF pin automatically overrides the digital output buffer and digital input threshold detector functions of that pin. Reading the CVREF pin when it has been configured for reference voltage output will always return a ‘0’. Due to the limited current drive capability, a buffer must be used on the voltage reference output for external connections to CVREF. Figure 21-2 shows an example buffering technique. 21.1.6 OPERATION DURING SLEEP When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the RECON1 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 21.1.7 EFFECTS OF A RESET A device Reset affects the following: • Voltage reference is disabled • Fixed voltage reference is disabled • VREF is removed from the CVREF pin • The DAC1R<4:0> range select bits are cleared 21.2 FVR Reference Module The FVR reference is a stable fixed voltage reference, independent of VDD, with a nominal output voltage of 1.024V. This reference can be enabled by setting the FVR1EN bit of the REFCON0 register to ‘1’. The FVR voltage reference can be routed to the comparators or an ADC input channel. 21.2.1 FVR STABILIZATION PERIOD When the Fixed Voltage Reference module is enabled, it will require some time for the reference and its amplifier circuits to stabilize. The user program must include a small delay routine to allow the module to settle. The FVR1ST stable bit of the REFCON0 register also indicates that the FVR reference has been operating long enough to be stable. See Section 27.0 “Electrical Specifications” for the minimum delay requirement. VOUT = (VSOURCE+ - VSOURCE-)*(DAC1R<4:0>/(2^5)) + VSOURCEVSOURCE+ = VDD, VREF+, or FVR VSOURCE- = VSS, or VREF- PIC18F1XK50/PIC18LF1XK50 DS41350C-page 242 Preliminary © 2009 Microchip Technology Inc. FIGURE 21-1: VOLTAGE REFERENCE BLOCK DIAGRAM FIGURE 21-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE 16-to-1 MUX DAC1R<4:0> R D1EN VDD VREF+ D1PSS<1:0> = 00 D1NSS = 0 VREF- D1NSS = 1 R R R R R R 16 Steps VREF FVR D1PSS<1:0> = 01 D1PSS<1:0> = 10 CVREF pin DAC1OE FVR1S<1:0> X1 X2 X4 2 FVR + _ FVR1EN FVR1ST 1.024V Fixed Reference Buffered CVREF Output + – CVREF Module Voltage Reference Output Impedance R(1) CVREF Note 1: R is dependent upon the voltage reference Configuration bits, CVR<3:0> and CVRR. PIC18F1XK50/ PIC18LF1XK50 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 243 PIC18F1XK50/PIC18LF1XK50 REGISTER 21-1: REFCON0: REFERENCE CONTROL REGISTER 0 R/W-0 R-0 R/W-0 R/W-1 U-0 U-0 U-0 U-0 FVR1EN FVR1ST FVR1S1 FVR1S0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 FVR1EN: Fixed Voltage Reference 1 Enable bit 0 = FVR is disabled 1 = FVR is enabled bit 6 FVR1ST: Fixed Voltage Reference 1 Stable bit 0 = FVR is not stable 1 = FVR is stable bit 5-4 FVR1S<1:0>: Fixed Voltage Reference 1 Voltage Select bits 00 = Reserved, do not use 01 = 1.024V (x1) 10 = 2.048V (x2) 11 = 4.096V (x4) bit 3-0 Unimplemented: Read as ‘0’ REGISTER 21-2: REFCON1: REFERENCE CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 D1EN D1LPS DAC1OE --- D1PSS1 D1PSS0 --- D1NSS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 D1EN: DAC 1 Enable bit 0 = DAC 1 is disabled 1 = DAC 1 is enabled bit 6 D1LPS: DAC 1 Low-Power Voltage State Select bit 0 =VDAC = DAC1 Negative reference source selected 1 =VDAC = DAC1 Positive reference source selected bit 5 DAC1OE: DAC 1 Voltage Output Enable bit 1 = DAC 1 voltage level is also outputed on the RC2/AN6/P1D/C12IN2-/CVREF/INT2 pin 0 = DAC 1 voltage level is disconnected from RC2/AN6/P1D/C12IN2-/CVREF/INT2 pin bit 4 Unimplemented: Read as ‘0’ bit 3-2 D1PSS<1:0>: DAC 1 Positive Source Select bits 00 =VDD 01 =VREF+ 10 = FVR output 11 = Reserved, do not use bit 1 Unimplemented: Read as ‘0’ bit 0 D1NSS: DAC1 Negative Source Select bits 0 =VSS 1 =VREF- PIC18F1XK50/PIC18LF1XK50 DS41350C-page 244 Preliminary © 2009 Microchip Technology Inc. TABLE 21-1: REGISTERS ASSOCIATED WITH VOLTAGE REFERENCE REGISTER 21-3: REFCON2: REFERENCE CONTROL REGISTER 2 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 --- --- --- DAC1R4 DAC1R3 DAC1R2 DAC1R1 DAC1R0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 DAC1R<4:0>: DAC1 Voltage Output Select bits VOUT = ((VSOURCE+) - (VSOURCE-))*(DAC1R<4:0>/(2^5)) + VSOURCENote 1: The output select bits are always right justified to ensure that any number of bits can be used without affecting the register layout. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page REFCON0 FVR1EN FVR1ST FVR1S1 FVR1S0 — — — — 281 REFCON1 D1EN D1LPS DAC1OE --- D1PSS1 D1PSS0 — D1NSS 281 REFCON2 — — — DAC1R4 DAC1R3 DAC1R2 DAC1R1 DAC1R0 281 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 282 Legend: Shaded cells are not used with the comparator voltage reference. Note 1: PORTA pins are enabled based on oscillator configuration. © 200C Microchip Technology Inc. Preliminary DS41350C-page 245 PIC18F1XK50/PIC18LF1XK50 22.0 UNIVERSAL SERIAL BUS (USB) This section describes the details of the USB peripheral. Because of the very specific nature of the module, knowledge of USB is expected. Some high-level USB information is provided in Section 22.10 “Overview of USB” only for application design reference. Designers are encouraged to refer to the official specification published by the USB Implementers Forum (USB-IF) for the latest information. USB Specification Revision 2.0 is the most current specification at the time of publication of this document. 22.1 Overview of the USB Peripheral PIC18F1XK50/PIC18LF1XK50 devices contain a full-speed and low-speed, compatible USB Serial Interface Engine (SIE) that allows fast communication between any USB host and the PIC® microcontroller. The SIE can be interfaced directly to the USB by utilizing the internal transceiver. Some special hardware features have been included to improve performance. Dual access port memory in the device’s data memory space (USB RAM) has been supplied to share direct memory access between the microcontroller core and the SIE. Buffer descriptors are also provided, allowing users to freely program endpoint memory usage within the USB RAM space. Figure 22-1 presents a general overview of the USB peripheral and its features. FIGURE 22-1: USB PERIPHERAL AND OPTIONS 256 byte USB RAM USB SIE USB Control and Transceiver P P D+ D- Internal Pull-ups External 3.3V Supply FSEN UPUEN USB Clock from the Oscillator Module Optional External Pull-ups(1) (Full (Low PIC18F1XK50/PIC18LF1XK50 Family USB Bus FS Speed) Speed) Note 1: The internal pull-up resistors should be disabled (UPUEN = 0) if external pull-up resistors are used. Configuration VUSB 3.3V Regulator PIC18F1XK50/PIC18LF1XK50 DS41350C-page 246 Preliminary © 200C Microchip Technology Inc. 22.2 USB Status and Control The operation of the USB module is configured and managed through three control registers. In addition, a total of 14 registers are used to manage the actual USB transactions. The registers are: • USB Control register (UCON) • USB Configuration register (UCFG) • USB Transfer Status register (USTAT) • USB Device Address register (UADDR) • Frame Number registers (UFRMH:UFRML) • Endpoint Enable registers 0 through 7 (UEPn) 22.2.1 USB CONTROL REGISTER (UCON) The USB Control register (Register 22-1) contains bits needed to control the module behavior during transfers. The register contains bits that control the following: • Main USB Peripheral Enable • Ping-Pong Buffer Pointer Reset • Control of the Suspend mode • Packet Transfer Disable In addition, the USB Control register contains a status bit, SE0 (UCON<5>), which is used to indicate the occurrence of a single-ended zero on the bus. When the USB module is enabled, this bit should be monitored to determine whether the differential data lines have come out of a single-ended zero condition. This helps to differentiate the initial power-up state from the USB Reset signal. The overall operation of the USB module is controlled by the USBEN bit (UCON<3>). Setting this bit activates the module and resets all of the PPBI bits in the Buffer Descriptor Table to ‘0’. This bit also activates the internal pull-up resistors, if they are enabled. Thus, this bit can be used as a soft attach/detach to the USB. Although all Status and control bits are ignored when this bit is clear, the module needs to be fully preconfigured prior to setting this bit. This bit cannot be set until the USB module is supplied with an active clock source. If the PLL is being used, it should be enabled at least two milliseconds (enough time for the PLL to lock) before attempting to set the USBEN bit. REGISTER 22-1: UCON: USB CONTROL REGISTER U-0 R/W-0 R-x R/C-0 R/W-0 R/W-0 R/W-0 U-0 — PPBRST SE0 PKTDIS USBEN(1) RESUME SUSPND — bit 7 bit 0 Legend: C = Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6 PPBRST: Ping-Pong Buffers Reset bit 1 = Reset all Ping-Pong Buffer Pointers to the Even Buffer Descriptor (BD) banks 0 = Ping-Pong Buffer Pointers not being reset bit 5 SE0: Live Single-Ended Zero Flag bit 1 = Single-ended zero active on the USB bus 0 = No single-ended zero detected bit 4 PKTDIS: Packet Transfer Disable bit 1 = SIE token and packet processing disabled, automatically set when a SETUP token is received 0 = SIE token and packet processing enabled bit 3 USBEN: USB Module Enable bit(1) 1 = USB module and supporting circuitry enabled (device attached) 0 = USB module and supporting circuitry disabled (device detached) bit 2 RESUME: Resume Signaling Enable bit 1 = Resume signaling activated 0 = Resume signaling disabled bit 1 SUSPND: Suspend USB bit 1 = USB module and supporting circuitry in Power Conserve mode, SIE clock inactive 0 = USB module and supporting circuitry in normal operation, SIE clock clocked at the configured rate bit 0 Unimplemented: Read as ‘0’ Note 1: This bit cannot be set if the USB module does not have an appropriate clock source. © 200C Microchip Technology Inc. Preliminary DS41350C-page 247 PIC18F1XK50/PIC18LF1XK50 The PPBRST bit (UCON<6>) controls the Reset status when Double-Buffering mode (ping-pong buffering) is used. When the PPBRST bit is set, all Ping-Pong Buffer Pointers are set to the Even buffers. PPBRST has to be cleared by firmware. This bit is ignored in buffering modes not using ping-pong buffering. The PKTDIS bit (UCON<4>) is a flag indicating that the SIE has disabled packet transmission and reception. This bit is set by the SIE when a SETUP token is received to allow setup processing. This bit cannot be set by the microcontroller, only cleared; clearing it allows the SIE to continue transmission and/or reception. Any pending events within the Buffer Descriptor Table will still be available, indicated within the USTAT register’s FIFO buffer. The RESUME bit (UCON<2>) allows the peripheral to perform a remote wake-up by executing Resume signaling. To generate a valid remote wake-up, firmware must set RESUME for 10 ms and then clear the bit. For more information on “resume signaling”, see the “Universal Serial Bus Specification Revision 2.0”. The SUSPND bit (UCON<1>) places the module and supporting circuitry in a Low-Power mode. The input clock to the SIE is also disabled. This bit should be set by the software in response to an IDLEIF interrupt. It should be reset by the microcontroller firmware after an ACTVIF interrupt is observed. When this bit is active, the device remains attached to the bus but the transceiver outputs remain Idle. The voltage on the VUSB pin may vary depending on the value of this bit. Setting this bit before a IDLEIF request will result in unpredictable bus behavior. 22.2.2 USB CONFIGURATION REGISTER (UCFG) Prior to communicating over USB, the module’s associated internal and/or external hardware must be configured. Most of the configuration is performed with the UCFG register (Register 22-2).The UFCG register contains most of the bits that control the system level behavior of the USB module. These include: • Bus Speed (full speed versus low speed) • On-Chip Pull-up Resistor Enable • Ping-Pong Buffer Usage The UTEYE bit, UCFG<7>, enables eye pattern generation, which aids in module testing, debugging and USB certifications. 22.2.2.1 Internal Transceiver The USB peripheral has a built-in, USB 2.0, full-speed and low-speed capable transceiver, internally connected to the SIE. This feature is useful for low-cost, single chip applications. Enabling the USB module (USBEN = 1) will also enable the internal transceiver. The FSEN bit (UCFG<2>) controls the transceiver speed; setting the bit enables full-speed operation. The on-chip USB pull-up resistors are controlled by the UPUEN bit (UCFG<4>). They can only be selected when the on-chip transceiver is enabled. The internal USB transceiver obtains power from the VUSB pin. In order to meet USB signalling level specifications, VUSB must be supplied with a voltage source between 3.0V and 3.6V. The best electrical signal quality is obtained when a 3.3V supply is used and locally bypassed with a high quality ceramic capacitor. The capacitor should be placed as close as possible to the VUSB and VSS pins found on the same edge of the package (i.e., route ground of the capacitor to VSS pin 20 on 20-lead PDIP, SOIC, and SSOP packaged parts). The D+ and D- signal lines can be routed directly to their respective pins on the USB connector or cable (for hard-wired applications). No additional resistors, capacitors, or magnetic components are required as the D+ and D- drivers have controlled slew rate and output impedance intended to match with the characteristic impedance of the USB cable. In order to meet the USB specifications, the traces should be less than 30 cm long. Ideally, these traces should be designed to have a characteristic impedance matching that of the USB cable. Note: While in Suspend mode, a typical bus-powered USB device is limited to 500 μA of current. This is the complete current which may be drawn by the PIC device and its supporting circuitry. Care should be taken to assure minimum current draw when the device enters Suspend mode. Note: The USB speed, transceiver and pull-up should only be configured during the module setup phase. It is not recommended to switch these settings while the module is enabled. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 248 Preliminary © 200C Microchip Technology Inc. REGISTER 22-2: UCFG: USB CONFIGURATION REGISTER R/W-0 U-0 U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 UTEYE — — UPUEN(1) — FSEN(1) PPB1 PPB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 UTEYE: USB Eye Pattern Test Enable bit 1 = Eye pattern test enabled 0 = Eye pattern test disabled bit 6-5 Unimplemented: Read as ‘0’ bit 4 UPUEN: USB On-Chip Pull-up Enable bit(1) 1 = On-chip pull-up enabled (pull-up on D+ with FSEN = 1 or D- with FSEN = 0) 0 = On-chip pull-up disabled bit 3 Unimplemented: Read as ‘0’ bit 2 FSEN: Full-Speed Enable bit(1) 1 = Full-speed device: controls transceiver edge rates; requires input clock at 48 MHz 0 = Low-speed device: controls transceiver edge rates; requires input clock at 6 MHz bit 1-0 PPB<1:0>: Ping-Pong Buffers Configuration bits 11 = Even/Odd ping-pong buffers enabled for Endpoints 1 to 15 10 = Even/Odd ping-pong buffers enabled for all endpoints 01 = Even/Odd ping-pong buffer enabled for OUT Endpoint 0 00 = Even/Odd ping-pong buffers disabled Note 1: The UPUEN, and FSEN bits should never be changed while the USB module is enabled. These values must be preconfigured prior to enabling the module. © 200C Microchip Technology Inc. Preliminary DS41350C-page 249 PIC18F1XK50/PIC18LF1XK50 22.2.2.2 Internal Pull-up Resistors The PIC18F1XK50/PIC18LF1XK50 devices have built-in pull-up resistors designed to meet the requirements for low-speed and full-speed USB. The UPUEN bit (UCFG<4>) enables the internal pull-ups. Figure 22-1 shows the pull-ups and their control. 22.2.2.3 External Pull-up Resistors External pull-up may also be used. The VUSB pin may be used to pull up D+ or D-. The pull-up resistor must be 1.5 kΩ (±5%) as required by the USB specifications. Figure 22-2 shows an example. FIGURE 22-2: EXTERNAL CIRCUITRY 22.2.2.4 Ping-Pong Buffer Configuration The usage of ping-pong buffers is configured using the PPB<1:0> bits. Refer to Section 22.4.4 “Ping-Pong Buffering” for a complete explanation of the ping-pong buffers. 22.2.2.5 Eye Pattern Test Enable An automatic eye pattern test can be generated by the module when the UCFG<7> bit is set. The eye pattern output will be observable based on module settings, meaning that the user is first responsible for configuring the SIE clock settings, pull-up resistor and Transceiver mode. In addition, the module has to be enabled. Once UTEYE is set, the module emulates a switch from a receive to transmit state and will start transmitting a J-K-J-K bit sequence (K-J-K-J for full speed). The sequence will be repeated indefinitely while the Eye Pattern Test mode is enabled. Note that this bit should never be set while the module is connected to an actual USB system. This Test mode is intended for board verification to aid with USB certification tests. It is intended to show a system developer the noise integrity of the USB signals which can be affected by board traces, impedance mismatches and proximity to other system components. It does not properly test the transition from a receive to a transmit state. Although the eye pattern is not meant to replace the more complex USB certification test, it should aid during first order system debugging. Note: The official USB specifications require that USB devices must never source any current onto the +5V VBUS line of the USB cable. Additionally, USB devices must never source any current on the D+ and Ddata lines whenever the +5V VBUS line is less than 1.17V. In order to meet this requirement, applications which are not purely bus powered should monitor the VBUS line and avoid turning on the USB module and the D+ or D- pull-up resistor until VBUS is greater than 1.17V. VBUS can be connected to and monitored by any 5V tolerant I/O pin for this purpose. PIC® Microcontroller Host Controller/HUB VUSB D+ D- Note: The above setting shows a typical connection for a full-speed configuration using an on-chip regulator and an external pull-up resistor. 1.5 kΩ PIC18F1XK50/PIC18LF1XK50 DS41350C-page 250 Preliminary © 200C Microchip Technology Inc. 22.2.3 USB STATUS REGISTER (USTAT) The USB Status register reports the transaction status within the SIE. When the SIE issues a USB transfer complete interrupt, USTAT should be read to determine the status of the transfer. USTAT contains the transfer endpoint number, direction and Ping-Pong Buffer Pointer value (if used). The USTAT register is actually a read window into a four-byte status FIFO, maintained by the SIE. It allows the microcontroller to process one transfer while the SIE processes additional endpoints (Figure 22-3). When the SIE completes using a buffer for reading or writing data, it updates the USTAT register. If another USB transfer is performed before a transaction complete interrupt is serviced, the SIE will store the status of the next transfer into the status FIFO. Clearing the transfer complete flag bit, TRNIF, causes the SIE to advance the FIFO. If the next data in the FIFO holding register is valid, the SIE will reassert the interrupt within 6 TCY of clearing TRNIF. If no additional data is present, TRNIF will remain clear; USTAT data will no longer be reliable. FIGURE 22-3: USTAT FIFO Note: The data in the USB Status register is valid two SIE clocks after the TRNIF interrupt flag is asserted. In low-speed operation with the system clock operating at 48 MHz, a delay may be required between receiving the TRNIF interrupt and processing the data in the USTAT register. Note: If an endpoint request is received while the USTAT FIFO is full, the SIE will automatically issue a NAK back to the host. Data Bus USTAT from SIE 4-Byte FIFO for USTAT Clearing TRNIF Advances FIFO REGISTER 22-3: USTAT: USB STATUS REGISTER U-0 U-0 R-x R-x R-x R-x R-x U-0 — — ENDP2 ENDP1 ENDP0 DIR PPBI(1) — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-3 ENDP<2:0>: Encoded Number of Last Endpoint Activity bits (represents the number of the BDT updated by the last USB transfer) 111 = Endpoint 7 110 = Endpoint 6 .... 001 = Endpoint 1 000 = Endpoint 0 bit 2 DIR: Last BD Direction Indicator bit 1 = The last transaction was an IN token 0 = The last transaction was an OUT or SETUP token bit 1 PPBI: Ping-Pong BD Pointer Indicator bit(1) 1 = The last transaction was to the Odd BD bank 0 = The last transaction was to the Even BD bank bit 0 Unimplemented: Read as ‘0’ Note 1: This bit is only valid for endpoints with available Even and Odd BD registers. © 200C Microchip Technology Inc. Preliminary DS41350C-page 251 PIC18F1XK50/PIC18LF1XK50 22.2.4 USB ENDPOINT CONTROL Each of the 8 possible bidirectional endpoints has its own independent control register, UEPn (where ‘n’ represents the endpoint number). Each register has an identical complement of control bits. The prototype is shown in Register 22-4. The EPHSHK bit (UEPn<4>) controls handshaking for the endpoint; setting this bit enables USB handshaking. Typically, this bit is always set except when using isochronous endpoints. The EPCONDIS bit (UEPn<3>) is used to enable or disable USB control operations (SETUP) through the endpoint. Clearing this bit enables SETUP transactions. Note that the corresponding EPINEN and EPOUTEN bits must be set to enable IN and OUT transactions. For Endpoint 0, this bit should always be cleared since the USB specifications identify Endpoint 0 as the default control endpoint. The EPOUTEN bit (UEPn<2>) is used to enable or disable USB OUT transactions from the host. Setting this bit enables OUT transactions. Similarly, the EPINEN bit (UEPn<1>) enables or disables USB IN transactions from the host. The EPSTALL bit (UEPn<0>) is used to indicate a STALL condition for the endpoint. If a STALL is issued on a particular endpoint, the EPSTALL bit for that endpoint pair will be set by the SIE. This bit remains set until it is cleared through firmware, or until the SIE is reset. REGISTER 22-4: UEPn: USB ENDPOINT n CONTROL REGISTER (UEP0 THROUGH UEP7) U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4 EPHSHK: Endpoint Handshake Enable bit 1 = Endpoint handshake enabled 0 = Endpoint handshake disabled (typically used for isochronous endpoints) bit 3 EPCONDIS: Bidirectional Endpoint Control bit If EPOUTEN = 1 and EPINEN = 1: 1 = Disable Endpoint n from control transfers; only IN and OUT transfers allowed 0 = Enable Endpoint n for control (SETUP) transfers; IN and OUT transfers also allowed bit 2 EPOUTEN: Endpoint Output Enable bit 1 = Endpoint n output enabled 0 = Endpoint n output disabled bit 1 EPINEN: Endpoint Input Enable bit 1 = Endpoint n input enabled 0 = Endpoint n input disabled bit 0 EPSTALL: Endpoint STALL Enable bit(1) 1 = Endpoint n is stalled 0 = Endpoint n is not stalled Note 1: Valid only if Endpoint n is enabled; otherwise, the bit is ignored. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 252 Preliminary © 200C Microchip Technology Inc. 22.2.5 USB ADDRESS REGISTER (UADDR) The USB Address register contains the unique USB address that the peripheral will decode when active. UADDR is reset to 00h when a USB Reset is received, indicated by URSTIF, or when a Reset is received from the microcontroller. The USB address must be written by the microcontroller during the USB setup phase (enumeration) as part of the Microchip USB firmware support. 22.2.6 USB FRAME NUMBER REGISTERS (UFRMH:UFRML) The Frame Number registers contain the 11-bit frame number. The low-order byte is contained in UFRML, while the three high-order bits are contained in UFRMH. The register pair is updated with the current frame number whenever a SOF token is received. For the microcontroller, these registers are read-only. The Frame Number registers are primarily used for isochronous transfers. The contents of the UFRMH and UFRML registers are only valid when the 48 MHz SIE clock is active (i.e., contents are inaccurate when SUSPND (UCON<1>) bit = 1). 22.3 USB RAM USB data moves between the microcontroller core and the SIE through a memory space known as the USB RAM. This is a special dual access memory that is mapped into the normal data memory space in Bank 2 (200h to 2FFh) for a total of 256 bytes (Figure 22-4). Bank 2 (200h through 27Fh) is used specifically for endpoint buffer control. Depending on the type of buffering being used, all but 8 bytes of Bank 2 may also be available for use as USB buffer space. Although USB RAM is available to the microcontroller as data memory, the sections that are being accessed by the SIE should not be accessed by the microcontroller. A semaphore mechanism is used to determine the access to a particular buffer at any given time. This is discussed in Section 22.4.1.1 “Buffer Ownership”. FIGURE 22-4: IMPLEMENTATION OF USB RAM IN DATA MEMORY SPACE 200h 2FFh Buffer Descriptors, USB Data or User Data SFRs 1FFh 000h F60h FFFh Banks 2 (USB RAM) F5Fh F53h F52h 300h Banks 3 to 14 User Data Unused Banks 15 USB Data or User Data 27Fh 280h Banks 0 to 1 © 200C Microchip Technology Inc. Preliminary DS41350C-page 253 PIC18F1XK50/PIC18LF1XK50 22.4 Buffer Descriptors and the Buffer Descriptor Table The registers in Bank 2 are used specifically for endpoint buffer control in a structure known as the Buffer Descriptor Table (BDT). This provides a flexible method for users to construct and control endpoint buffers of various lengths and configuration. The BDT is composed of Buffer Descriptors (BD) which are used to define and control the actual buffers in the USB RAM space. Each BD, in turn, consists of four registers, where n represents one of the 32 possible BDs (range of 0 to 31): • BDnSTAT: BD Status register • BDnCNT: BD Byte Count register • BDnADRL: BD Address Low register • BDnADRH: BD Address High register BDs always occur as a four-byte block in the sequence, BDnSTAT:BDnCNT:BDnADRL:BDnADRH. The address of BDnSTAT is always an offset of (4n – 1) (in hexadecimal) from 200h, with n being the buffer descriptor number. Depending on the buffering configuration used (Section 22.4.4 “Ping-Pong Buffering”), there are up to 16, 17 or 32 sets of buffer descriptors. At a minimum, the BDT must be at least 8 bytes long. This is because the USB specification mandates that every device must have Endpoint 0 with both input and output for initial setup. Depending on the endpoint and buffering configuration, the BDT can be as long as 128 bytes. Although they can be thought of as Special Function Registers, the Buffer Descriptor Status and Address registers are not hardware mapped, as conventional microcontroller SFRs in Bank 15 are. If the endpoint corresponding to a particular BD is not enabled, its registers are not used. Instead of appearing as unimplemented addresses, however, they appear as available RAM. Only when an endpoint is enabled by setting the UEPn<1> bit does the memory at those addresses become functional as BD registers. As with any address in the data memory space, the BD registers have an indeterminate value on any device Reset. An example of a BD for a 64-byte buffer, starting at 280h, is shown in Figure 22-5. A particular set of BD registers is only valid if the corresponding endpoint has been enabled using the UEPn register. All BD registers are available in USB RAM. The BD for each endpoint should be set up prior to enabling the endpoint. 22.4.1 BD STATUS AND CONFIGURATION Buffer descriptors not only define the size of an endpoint buffer, but also determine its configuration and control. Most of the configuration is done with the BD Status register, BDnSTAT. Each BD has its own unique and correspondingly numbered BDnSTAT register. FIGURE 22-5: EXAMPLE OF A BUFFER DESCRIPTOR Unlike other control registers, the bit configuration for the BDnSTAT register is context sensitive. There are two distinct configurations, depending on whether the microcontroller or the USB module is modifying the BD and buffer at a particular time. Only three bit definitions are shared between the two. 22.4.1.1 Buffer Ownership Because the buffers and their BDs are shared between the CPU and the USB module, a simple semaphore mechanism is used to distinguish which is allowed to update the BD and associated buffers in memory. This is done by using the UOWN bit (BDnSTAT<7>) as a semaphore to distinguish which is allowed to update the BD and associated buffers in memory. UOWN is the only bit that is shared between the two configurations of BDnSTAT. When UOWN is clear, the BD entry is “owned” by the microcontroller core. When the UOWN bit is set, the BD entry and the buffer memory are “owned” by the USB peripheral. The core should not modify the BD or its corresponding data buffer during this time. Note that the microcontroller core can still read BDnSTAT while the SIE owns the buffer and vice versa. The buffer descriptors have a different meaning based on the source of the register update. Prior to placing ownership with the USB peripheral, the user can configure the basic operation of the peripheral through the BDnSTAT bits. During this time, the byte count and buffer location registers can also be set. When UOWN is set, the user can no longer depend on the values that were written to the BDs. From this point, the SIE updates the BDs as necessary, overwriting the original BD values. The BDnSTAT register is updated by the SIE with the token PID and the transfer count, BDnCNT, is updated. 200h USB Data Buffer Buffer BD0STAT BD0CNT BD0ADRL BD0ADRH 201h 202h 203h 280h 2BFh Descriptor Note: Memory regions not to scale. 40h 00h 05h Starting Size of Block (xxh) Address Contents Registers Address PIC18F1XK50/PIC18LF1XK50 DS41350C-page 254 Preliminary © 200C Microchip Technology Inc. The BDnSTAT byte of the BDT should always be the last byte updated when preparing to arm an endpoint. The SIE will clear the UOWN bit when a transaction has completed. No hardware mechanism exists to block access when the UOWN bit is set. Thus, unexpected behavior can occur if the microcontroller attempts to modify memory when the SIE owns it. Similarly, reading such memory may produce inaccurate data until the USB peripheral returns ownership to the microcontroller. 22.4.1.2 BDnSTAT Register (CPU Mode) When UOWN = 0, the microcontroller core owns the BD. At this point, the other seven bits of the register take on control functions. The Data Toggle Sync Enable bit, DTSEN (BDnSTAT<3>), controls data toggle parity checking. Setting DTSEN enables data toggle synchronization by the SIE. When enabled, it checks the data packet’s parity against the value of DTS (BDnSTAT<6>). If a packet arrives with an incorrect synchronization, the data will essentially be ignored. It will not be written to the USB RAM and the USB transfer complete interrupt flag will not be set. The SIE will send an ACK token back to the host to Acknowledge receipt, however. The effects of the DTSEN bit on the SIE are summarized in Table 22-1. The Buffer Stall bit, BSTALL (BDnSTAT<2>), provides support for control transfers, usually one-time stalls on Endpoint 0. It also provides support for the SET_FEATURE/CLEAR_FEATURE commands specified in Chapter 9 of the USB specification; typically, continuous STALLs to any endpoint other than the default control endpoint. The BSTALL bit enables buffer stalls. Setting BSTALL causes the SIE to return a STALL token to the host if a received token would use the BD in that location. The EPSTALL bit in the corresponding UEPn control register is set and a STALL interrupt is generated when a STALL is issued to the host. The UOWN bit remains set and the BDs are not changed unless a SETUP token is received. In this case, the STALL condition is cleared and the ownership of the BD is returned to the microcontroller core. The BD<9:8> bits (BDnSTAT<1:0>) store the two Most Significant digits of the SIE byte count; the lower 8 digits are stored in the corresponding BDnCNT register. See Section 22.4.2 “BD Byte Count” for more information. TABLE 22-1: EFFECT OF DTSEN BIT ON ODD/EVEN (DATA0/DATA1) PACKET RECEPTION OUT Packet from Host BDnSTAT Settings Device Response after Receiving Packet DTSEN DTS Handshake UOWN TRNIF BDnSTAT and USTAT Status DATA0 1 0 ACK 0 1 Updated DATA1 1 0 ACK 1 0 Not Updated DATA0 1 1 ACK 1 0 Not Updated DATA1 1 1 ACK 0 1 Updated Either 0 x ACK 0 1 Updated Either, with error x x NAK 1 0 Not Updated Legend: x = don’t care © 200C Microchip Technology Inc. Preliminary DS41350C-page 255 PIC18F1XK50/PIC18LF1XK50 REGISTER 22-5: BDnSTAT: BUFFER DESCRIPTOR n STATUS REGISTER (BD0STAT THROUGH BD31STAT), CPU MODE (DATA IS WRITTEN TO THE SIDE) R/W-x R/W-x U-0 U-0 R/W-x R/W-x R/W-x R/W-x UOWN(1) DTS(2) —(3) —(3) DTSEN BSTALL BC9 BC8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 UOWN: USB Own bit(1) 0 = The microcontroller core owns the BD and its corresponding buffer bit 6 DTS: Data Toggle Synchronization bit(2) 1 = Data 1 packet 0 = Data 0 packet bit 5-4 Unimplemented: These bits should always be programmed to ‘0’ (3). bit 3 DTSEN: Data Toggle Synchronization Enable bit 1 = Data toggle synchronization is enabled; data packets with incorrect Sync value will be ignored except for a SETUP transaction, which is accepted even if the data toggle bits do not match 0 = No data toggle synchronization is performed bit 2 BSTALL: Buffer Stall Enable bit 1 = Buffer stall enabled; STALL handshake issued if a token is received that would use the BD in the given location (UOWN bit remains set, BD value is unchanged) 0 = Buffer stall disabled bit 1-0 BC<9:8>: Byte Count 9 and 8 bits The byte count bits represent the number of bytes that will be transmitted for an IN token or received during an OUT token. Together with BC<7:0>, the valid byte counts are 0-1023. Note 1: This bit must be initialized by the user to the desired value prior to enabling the USB module. 2: This bit is ignored unless DTSEN = 1. 3: If these bits are set, USB communication may not work. Hence, these bits should always be maintained as ‘0’. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 256 Preliminary © 200C Microchip Technology Inc. 22.4.1.3 BDnSTAT Register (SIE Mode) When the BD and its buffer are owned by the SIE, most of the bits in BDnSTAT take on a different meaning. The configuration is shown in Register 22-6. Once the UOWN bit is set, any data or control settings previously written there by the user will be overwritten with data from the SIE. The BDnSTAT register is updated by the SIE with the token Packet Identifier (PID) which is stored in BDnSTAT<5:3>. The transfer count in the corresponding BDnCNT register is updated. Values that overflow the 8-bit register carry over to the two Most Significant digits of the count, stored in BDnSTAT<1:0>. 22.4.2 BD BYTE COUNT The byte count represents the total number of bytes that will be transmitted during an IN transfer. After an IN transfer, the SIE will return the number of bytes sent to the host. For an OUT transfer, the byte count represents the maximum number of bytes that can be received and stored in USB RAM. After an OUT transfer, the SIE will return the actual number of bytes received. If the number of bytes received exceeds the corresponding byte count, the data packet will be rejected and a NAK handshake will be generated. When this happens, the byte count will not be updated. The 10-bit byte count is distributed over two registers. The lower 8 bits of the count reside in the BDnCNT register. The upper two bits reside in BDnSTAT<1:0>. This represents a valid byte range of 0 to 1023. 22.4.3 BD ADDRESS VALIDATION The BD Address register pair contains the starting RAM address location for the corresponding endpoint buffer. No mechanism is available in hardware to validate the BD address. If the value of the BD address does not point to an address in the USB RAM, or if it points to an address within another endpoint’s buffer, data is likely to be lost or overwritten. Similarly, overlapping a receive buffer (OUT endpoint) with a BD location in use can yield unexpected results. When developing USB applications, the user may want to consider the inclusion of software-based address validation in their code. REGISTER 22-6: BDnSTAT: BUFFER DESCRIPTOR n STATUS REGISTER (BD0STAT THROUGH BD31STAT), SIE MODE (DATA RETURNED BY THE SIDE TO THE MCU) R/W-x U-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x UOWN — PID3 PID2 PID1 PID0 BC9 BC8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 UOWN: USB Own bit 1 = The SIE owns the BD and its corresponding buffer bit 6 Reserved: Not written by the SIE bit 5-2 PID<3:0>: Packet Identifier bits The received token PID value of the last transfer (IN, OUT or SETUP transactions only). bit 1-0 BC<9:8>: Byte Count 9 and 8 bits These bits are updated by the SIE to reflect the actual number of bytes received on an OUT transfer and the actual number of bytes transmitted on an IN transfer. © 200C Microchip Technology Inc. Preliminary DS41350C-page 257 PIC18F1XK50/PIC18LF1XK50 22.4.4 PING-PONG BUFFERING An endpoint is defined to have a ping-pong buffer when it has two sets of BD entries: one set for an Even transfer and one set for an Odd transfer. This allows the CPU to process one BD while the SIE is processing the other BD. Double-buffering BDs in this way allows for maximum throughput to/from the USB. The USB module supports four modes of operation: • No ping-pong support • Ping-pong buffer support for OUT Endpoint 0 only • Ping-pong buffer support for all endpoints • Ping-pong buffer support for all other Endpoints except Endpoint 0 The ping-pong buffer settings are configured using the PPB<1:0> bits in the UCFG register. The USB module keeps track of the Ping-Pong Pointer individually for each endpoint. All pointers are initially reset to the Even BD when the module is enabled. After the completion of a transaction (UOWN cleared by the SIE), the pointer is toggled to the Odd BD. After the completion of the next transaction, the pointer is toggled back to the Even BD and so on. The Even/Odd status of the last transaction is stored in the PPBI bit of the USTAT register. The user can reset all Ping-Pong Pointers to Even using the PPBRST bit. Figure 22-6 shows the four different modes of operation and how USB RAM is filled with the BDs. BDs have a fixed relationship to a particular endpoint, depending on the buffering configuration. The mapping of BDs to endpoints is detailed in Table 22-2. This relationship also means that gaps may occur in the BDT if endpoints are not enabled contiguously. This theoretically means that the BDs for disabled endpoints could be used as buffer space. In practice, users should avoid using such spaces in the BDT unless a method of validating BD addresses is implemented. FIGURE 22-6: BUFFER DESCRIPTOR TABLE MAPPING FOR BUFFERING MODES EP1 IN Even EP1 OUT Even EP1 OUT Odd EP1 IN Odd Descriptor Descriptor Descriptor Descriptor EP1 IN EP7 IN EP1 OUT EP0 OUT PPB<1:0> = 00 EP0 IN EP1 IN No Ping-Pong EP7 IN EP0 IN EP0 OUT Even PPB<1:0> = 01 EP0 OUT Odd EP1 OUT Ping-Pong Buffer EP7 IN Odd EP0 IN Even EP0 OUT Even PPB<1:0> = 10 EP0 OUT Odd EP0 IN Odd Ping-Pong Buffers Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor 200h 2FFh 2FFh 2FFh 200h 200h 23Fh 243h Available as Data RAM Available as Data RAM Maximum Memory Used: 64 bytes Maximum BDs: 16 (BD0 to BD15) Maximum Memory Used: 68 bytes Maximum BDs: 17 (BD0 to BD16) Maximum Memory Used: 128 bytes Maximum BDs: 32 (BD0 to BD31) Note: Memory area not shown to scale. Descriptor Descriptor Descriptor Descriptor Buffers on EP0 OUT on all EPs EP1 IN Even EP1 OUT Even EP1 OUT Odd EP1 IN Odd Descriptor Descriptor Descriptor Descriptor EP7 IN Odd EP0 OUT PPB<1:0> = 11 EP0 IN Ping-Pong Buffers Descriptor Descriptor Descriptor 2FFh 200h Maximum Memory Used: 120 bytes Maximum BDs: 30 (BD0 to BD29) on all other EPs except EP0 Available as Data RAM 277h 27Fh PIC18F1XK50/PIC18LF1XK50 DS41350C-page 258 Preliminary © 200C Microchip Technology Inc. TABLE 22-2: ASSIGNMENT OF BUFFER DESCRIPTORS FOR THE DIFFERENT BUFFERING MODES TABLE 22-3: SUMMARY OF USB BUFFER DESCRIPTOR TABLE REGISTERS Endpoint BDs Assigned to Endpoint Mode 0 (No Ping-Pong) Mode 1 (Ping-Pong on EP0 OUT) Mode 2 (Ping-Pong on all EPs) Mode 3 (Ping-Pong on all other EPs, except EP0) Out In Out In Out In Out In 0 0 1 0 (E), 1 (O) 2 0 (E), 1 (O) 2 (E), 3 (O) 0 1 1 2 3 3 4 4 (E), 5 (O) 6 (E), 7 (O) 2 (E), 3 (O) 4 (E), 5 (O) 2 4 5 5 6 8 (E), 9 (O) 10 (E), 11 (O) 6 (E), 7 (O) 8 (E), 9 (O) 3 6 7 7 8 12 (E), 13 (O) 14 (E), 15 (O) 10 (E), 11 (O) 12 (E), 13 (O) 4 8 9 9 10 16 (E), 17 (O) 18 (E), 19 (O) 14 (E), 15 (O) 16 (E), 17 (O) 5 10 11 11 12 20 (E), 21 (O) 22 (E), 23 (O) 18 (E), 19 (O) 20 (E), 21 (O) 6 12 13 13 14 24 (E), 25 (O) 26 (E), 27 (O) 22 (E), 23 (O) 24 (E), 25 (O) 7 14 15 15 16 28 (E), 29 (O) 30 (E), 31 (O) 26 (E), 27 (O) 28 (E), 29 (O) Legend: (E) = Even transaction buffer, (O) = Odd transaction buffer Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 BDnSTAT(1) UOWN DTS(4) PID3(2) PID2(2) PID1(2) DTSEN(3) PID0(2) BSTALL(3) BC9 BC8 BDnCNT(1) Byte Count BDnADRL(1) Buffer Address Low BDnADRH(1) Buffer Address High Note 1: For buffer descriptor registers, n may have a value of 0 to 31. For the sake of brevity, all 32 registers are shown as one generic prototype. All registers have indeterminate Reset values (xxxx xxxx). 2: Bits 5 through 2 of the BDnSTAT register are used by the SIE to return PID<3:0> values once the register is turned over to the SIE (UOWN bit is set). Once the registers have been under SIE control, the values written for DTSEN and BSTALL are no longer valid. 3: Prior to turning the buffer descriptor over to the SIE (UOWN bit is cleared), bits 5 through 2 of the BDnSTAT register are used to configure the DTSEN and BSTALL settings. 4: This bit is ignored unless DTSEN = 1. © 200C Microchip Technology Inc. Preliminary DS41350C-page 259 PIC18F1XK50/PIC18LF1XK50 22.5 USB Interrupts The USB module can generate multiple interrupt conditions. To accommodate all of these interrupt sources, the module is provided with its own interrupt logic structure, similar to that of the microcontroller. USB interrupts are enabled with one set of control registers and trapped with a separate set of flag registers. All sources are funneled into a single USB interrupt request, USBIF (PIR2<2>), in the microcontroller’s interrupt logic. Figure 22-7 shows the interrupt logic for the USB module. There are two layers of interrupt registers in the USB module. The top level consists of overall USB Status interrupts; these are enabled and flagged in the UIE and UIR registers, respectively. The second level consists of USB error conditions, which are enabled and flagged in the UEIR and UEIE registers. An interrupt condition in any of these triggers a USB Error Interrupt Flag (UERRIF) in the top level. Interrupts may be used to trap routine events in a USB transaction. Figure 22-8 shows some common events within a USB frame and their corresponding interrupts. FIGURE 22-7: USB INTERRUPT LOGIC FUNNEL FIGURE 22-8: EXAMPLE OF A USB TRANSACTION AND INTERRUPT EVENTS BTSEF BTSEE BTOEF BTOEE DFN8EF DFN8EE CRC16EF CRC16EE CRC5EF CRC5EE PIDEF PIDEE SOFIF SOFIE TRNIF TRNIE IDLEIF IDLEIE STALLIF STALLIE ACTVIF ACTVIE URSTIF URSTIE UERRIF UERRIE USBIF Second Level USB Interrupts (USB Error Conditions) UEIR (Flag) and UEIE (Enable) Registers Top Level USB Interrupts (USB Status Interrupts) UIR (Flag) and UIE (Enable) Registers USB Reset RESET SOF SETUP DATA STATUS SOF SETUPToken Data ACK OUT Token Empty Data ACK Start-of-Frame (SOF) IN Token Data ACK SOFIF URSTIF 1 ms Frame Differential Data From Host From Host To Host From Host To Host From Host From Host From Host To Host Transaction Control Transfer(1) Transaction Complete Note 1: The control transfer shown here is only an example showing events that can occur for every transaction. Typical control transfers will spread across multiple frames. Set TRNIF Set TRNIF Set TRNIF PIC18F1XK50/PIC18LF1XK50 DS41350C-page 260 Preliminary © 200C Microchip Technology Inc. 22.5.1 USB INTERRUPT STATUS REGISTER (UIR) The USB Interrupt Status register (Register 22-7) contains the flag bits for each of the USB Status interrupt sources. Each of these sources has a corresponding interrupt enable bit in the UIE register. All of the USB status flags are ORed together to generate the USBIF interrupt flag for the microcontroller’s interrupt funnel. Once an interrupt bit has been set by the SIE, it must be cleared by software by writing a ‘0’. The flag bits can also be set in software which can aid in firmware debugging. REGISTER 22-7: UIR: USB INTERRUPT STATUS REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R/W-0 — SOFIF STALLIF IDLEIF(1) TRNIF(2) ACTVIF(3) UERRIF(4) URSTIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6 SOFIF: Start-of-Frame Token Interrupt bit 1 = A Start-of-Frame token received by the SIE 0 = No Start-of-Frame token received by the SIE bit 5 STALLIF: A STALL Handshake Interrupt bit 1 = A STALL handshake was sent by the SIE 0 = A STALL handshake has not been sent bit 4 IDLEIF: Idle Detect Interrupt bit(1) 1 = Idle condition detected (constant Idle state of 3 ms or more) 0 = No Idle condition detected bit 3 TRNIF: Transaction Complete Interrupt bit(2) 1 = Processing of pending transaction is complete; read USTAT register for endpoint information 0 = Processing of pending transaction is not complete or no transaction is pending bit 2 ACTVIF: Bus Activity Detect Interrupt bit(3) 1 = Activity on the D+/D- lines was detected 0 = No activity detected on the D+/D- lines bit 1 UERRIF: USB Error Condition Interrupt bit(4) 1 = An unmasked error condition has occurred 0 = No unmasked error condition has occurred. bit 0 URSTIF: USB Reset Interrupt bit 1 = Valid USB Reset occurred; 00h is loaded into UADDR register 0 = No USB Reset has occurred Note 1: Once an Idle state is detected, the user may want to place the USB module in Suspend mode. 2: Clearing this bit will cause the USTAT FIFO to advance (valid only for IN, OUT and SETUP tokens). 3: This bit is typically unmasked only following the detection of a UIDLE interrupt event. 4: Only error conditions enabled through the UEIE register will set this bit. This bit is a status bit only and cannot be set or cleared by the user. © 200C Microchip Technology Inc. Preliminary DS41350C-page 261 PIC18F1XK50/PIC18LF1XK50 22.5.1.1 Bus Activity Detect Interrupt Bit (ACTVIF) The ACTVIF bit cannot be cleared immediately after the USB module wakes up from Suspend or while the USB module is suspended. A few clock cycles are required to synchronize the internal hardware state machine before the ACTVIF bit can be cleared by firmware. Clearing the ACTVIF bit before the internal hardware is synchronized may not have an effect on the value of ACTVIF. Additionally, if the USB module uses the clock from the 48 MHz PLL source, then after clearing the SUSPND bit, the USB module may not be immediately operational while waiting for the 48 MHz PLL to lock. The application code should clear the ACTVIF flag as shown in Example 22-1. Only one ACTVIF interrupt is generated when resuming from the USB bus Idle condition. If user firmware clears the ACTVIF bit, the bit will not immediately become set again, even when there is continuous bus traffic. Bus traffic must cease long enough to generate another IDLEIF condition before another ACTVIF interrupt can be generated. EXAMPLE 22-1: CLEARING ACTVIF BIT (UIR<2>) Assembly: BCF UCON, SUSPND LOOP: BTFSS UIR, ACTVIF BRA DONE BCF UIR, ACTVIF BRA LOOP DONE: C: UCONbits.SUSPND = 0; while (UIRbits.ACTVIF) { UIRbits.ACTVIF = 0; } PIC18F1XK50/PIC18LF1XK50 DS41350C-page 262 Preliminary © 200C Microchip Technology Inc. 22.5.2 USB INTERRUPT ENABLE REGISTER (UIE) The USB Interrupt Enable register (Register 22-8) contains the enable bits for the USB Status interrupt sources. Setting any of these bits will enable the respective interrupt source in the UIR register. The values in this register only affect the propagation of an interrupt condition to the microcontroller’s interrupt logic. The flag bits are still set by their interrupt conditions, allowing them to be polled and serviced without actually generating an interrupt. REGISTER 22-8: UIE: USB INTERRUPT ENABLE REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — SOFIE STALLIE IDLEIE TRNIE ACTVIE UERRIE URSTIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6 SOFIE: Start-of-Frame Token Interrupt Enable bit 1 = Start-of-Frame token interrupt enabled 0 = Start-of-Frame token interrupt disabled bit 5 STALLIE: STALL Handshake Interrupt Enable bit 1 = STALL interrupt enabled 0 = STALL interrupt disabled bit 4 IDLEIE: Idle Detect Interrupt Enable bit 1 = Idle detect interrupt enabled 0 = Idle detect interrupt disabled bit 3 TRNIE: Transaction Complete Interrupt Enable bit 1 = Transaction interrupt enabled 0 = Transaction interrupt disabled bit 2 ACTVIE: Bus Activity Detect Interrupt Enable bit 1 = Bus activity detect interrupt enabled 0 = Bus activity detect interrupt disabled bit 1 UERRIE: USB Error Interrupt Enable bit 1 = USB error interrupt enabled 0 = USB error interrupt disabled bit 0 URSTIE: USB Reset Interrupt Enable bit 1 = USB Reset interrupt enabled 0 = USB Reset interrupt disabled © 200C Microchip Technology Inc. Preliminary DS41350C-page 263 PIC18F1XK50/PIC18LF1XK50 22.5.3 USB ERROR INTERRUPT STATUS REGISTER (UEIR) The USB Error Interrupt Status register (Register 22-9) contains the flag bits for each of the error sources within the USB peripheral. Each of these sources is controlled by a corresponding interrupt enable bit in the UEIE register. All of the USB error flags are ORed together to generate the USB Error Interrupt Flag (UERRIF) at the top level of the interrupt logic. Each error bit is set as soon as the error condition is detected. Thus, the interrupt will typically not correspond with the end of a token being processed. Once an interrupt bit has been set by the SIE, it must be cleared by software by writing a ‘0’. REGISTER 22-9: UEIR: USB ERROR INTERRUPT STATUS REGISTER R/C-0 U-0 U-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 BTSEF — — BTOEF DFN8EF CRC16EF CRC5EF PIDEF bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 BTSEF: Bit Stuff Error Flag bit 1 = A bit stuff error has been detected 0 = No bit stuff error bit 6-5 Unimplemented: Read as ‘0’ bit 4 BTOEF: Bus Turnaround Time-out Error Flag bit 1 = Bus turnaround time-out has occurred (more than 16 bit times of Idle from previous EOP elapsed) 0 = No bus turnaround time-out bit 3 DFN8EF: Data Field Size Error Flag bit 1 = The data field was not an integral number of bytes 0 = The data field was an integral number of bytes bit 2 CRC16EF: CRC16 Failure Flag bit 1 = The CRC16 failed 0 = The CRC16 passed bit 1 CRC5EF: CRC5 Host Error Flag bit 1 = The token packet was rejected due to a CRC5 error 0 = The token packet was accepted bit 0 PIDEF: PID Check Failure Flag bit 1 = PID check failed 0 = PID check passed PIC18F1XK50/PIC18LF1XK50 DS41350C-page 264 Preliminary © 200C Microchip Technology Inc. 22.5.4 USB ERROR INTERRUPT ENABLE REGISTER (UEIE) The USB Error Interrupt Enable register (Register 22-10) contains the enable bits for each of the USB error interrupt sources. Setting any of these bits will enable the respective error interrupt source in the UEIR register to propagate into the UERR bit at the top level of the interrupt logic. As with the UIE register, the enable bits only affect the propagation of an interrupt condition to the microcontroller’s interrupt logic. The flag bits are still set by their interrupt conditions, allowing them to be polled and serviced without actually generating an interrupt. REGISTER 22-10: UEIE: USB ERROR INTERRUPT ENABLE REGISTER R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BTSEE — — BTOEE DFN8EE CRC16EE CRC5EE PIDEE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 BTSEE: Bit Stuff Error Interrupt Enable bit 1 = Bit stuff error interrupt enabled 0 = Bit stuff error interrupt disabled bit 6-5 Unimplemented: Read as ‘0’ bit 4 BTOEE: Bus Turnaround Time-out Error Interrupt Enable bit 1 = Bus turnaround time-out error interrupt enabled 0 = Bus turnaround time-out error interrupt disabled bit 3 DFN8EE: Data Field Size Error Interrupt Enable bit 1 = Data field size error interrupt enabled 0 = Data field size error interrupt disabled bit 2 CRC16EE: CRC16 Failure Interrupt Enable bit 1 = CRC16 failure interrupt enabled 0 = CRC16 failure interrupt disabled bit 1 CRC5EE: CRC5 Host Error Interrupt Enable bit 1 = CRC5 host error interrupt enabled 0 = CRC5 host error interrupt disabled bit 0 PIDEE: PID Check Failure Interrupt Enable bit 1 = PID check failure interrupt enabled 0 = PID check failure interrupt disabled © 200C Microchip Technology Inc. Preliminary DS41350C-page 265 PIC18F1XK50/PIC18LF1XK50 22.6 USB Power Modes Many USB applications will likely have several different sets of power requirements and configuration. The most common power modes encountered are Bus Power Only, Self-Power Only and Dual Power with Self-Power Dominance. The most common cases are presented here. Also provided is a means of estimating the current consumption of the USB transceiver. 22.6.1 BUS POWER ONLY In Bus Power Only mode, all power for the application is drawn from the USB (Figure 22-9). This is effectively the simplest power method for the device. In order to meet the inrush current requirements of the USB 2.0 specifications, the total effective capacitance appearing across VBUS and ground must be no more than 10 µF. If not, some kind of inrush liming is required. For more details, see section 7.2.4 of the USB 2.0 specification. According to the USB 2.0 specification, all USB devices must also support a Low-Power Suspend mode. In the USB Suspend mode, devices must consume no more than 500 μA (or 2.5 mA for high powered devices that are remote wake-up capable) from the 5V VBUS line of the USB cable. The host signals the USB device to enter the Suspend mode by stopping all USB traffic to that device for more than 3 ms. This condition will cause the IDLEIF bit in the UIR register to become set. During the USB Suspend mode, the D+ or D- pull-up resistor must remain active, which will consume some of the allowed suspend current: 500 μA/2.5 mA budget. FIGURE 22-9: BUS POWER ONLY 22.6.2 SELF-POWER ONLY In Self-Power Only mode, the USB application provides its own power, with very little power being pulled from the USB. Figure 22-10 shows an example. In order to meet compliance specifications, the USB module (and the D+ or D- pull-up resistor) should not be enabled until the host actively drives VBUS high. The application should never source any current onto the 5V VBUS pin of the USB cable. FIGURE 22-10: SELF-POWER ONLY VDD VUSB VSS VBUS VDD VUSB VSS VSELF PIC18F1XK50/PIC18LF1XK50 DS41350C-page 266 Preliminary © 200C Microchip Technology Inc. 22.6.3 DUAL POWER WITH SELF-POWER DOMINANCE Some applications may require a dual power option. This allows the application to use internal power primarily, but switch to power from the USB when no internal power is available. Figure 22-11 shows a simple Dual Power with Self-Power Dominance mode example, which automatically switches between Self-Power Only and USB Bus Power Only modes. Dual power devices must also meet all of the special requirements for inrush current and Suspend mode current and must not enable the USB module until VBUS is driven high. See Section 22.6.1 “Bus Power Only” and Section 22.6.2 “Self-Power Only” for descriptions of those requirements. Additionally, dual power devices must never source current onto the 5V VBUS pin of the USB cable. FIGURE 22-11: DUAL POWER EXAMPLE 22.6.4 USB TRANSCEIVER CURRENT CONSUMPTION The USB transceiver consumes a variable amount of current depending on the characteristic impedance of the USB cable, the length of the cable, the VUSB supply voltage and the actual data patterns moving across the USB cable. Longer cables have larger capacitances and consume more total energy when switching output states. Data patterns that consist of “IN” traffic consume far more current than “OUT” traffic. IN traffic requires the PIC® device to drive the USB cable, whereas OUT traffic requires that the host drive the USB cable. The data that is sent across the USB cable is NRZI encoded. In the NRZI encoding scheme, ‘0’ bits cause a toggling of the output state of the transceiver (either from a “J” state to a “K” state, or vise versa). With the exception of the effects of bit-stuffing, NRZI encoded ‘1’ bits do not cause the output state of the transceiver to change. Therefore, IN traffic consisting of data bits of value, ‘0’, cause the most current consumption, as the transceiver must charge/discharge the USB cable in order to change states. More details about NRZI encoding and bit-stuffing can be found in the USB 2.0 specification’s section 7.1, although knowledge of such details is not required to make USB applications using the PIC18F1XK50/PIC18LF1XK50 of microcontrollers. Among other things, the SIE handles bit-stuffing/unstuffing, NRZI encoding/decoding and CRC generation/checking in hardware. The total transceiver current consumption will be application-specific. However, to help estimate how much current actually may be required in full-speed applications, Equation 22-1 can be used. Example 22-2 shows how this equation can be used for a theoretical application. Note: Users should keep in mind the limits for devices drawing power from the USB. According to USB Specification 2.0, this cannot exceed 100 mA per low-power device or 500 mA per high-power device. VDD VUSB VSS VBUS VSELF ~5V ~5V 100 kΩ © 200C Microchip Technology Inc. Preliminary DS41350C-page 267 PIC18F1XK50/PIC18LF1XK50 EQUATION 22-1: ESTIMATING USB TRANSCEIVER CURRENT CONSUMPTION EXAMPLE 22-2: CALCULATING USB TRANSCEIVER CURRENT† IXCVR = + IPULLUP (60 mA • VUSB • PZERO • PIN • LCABLE) (3.3V • 5m) Legend: VUSB: Voltage applied to the VUSB pin in volts. (Should be 3.0V to 3.6V.) PZERO: Percentage (in decimal) of the IN traffic bits sent by the PIC® device that are a value of ‘0’. PIN: Percentage (in decimal) of total bus bandwidth that is used for IN traffic. LCABLE: Length (in meters) of the USB cable. The USB 2.0 specification requires that full-speed applications use cables no longer than 5m. IPULLUP: Current which the nominal, 1.5 kΩ pull-up resistor (when enabled) must supply to the USB cable. On the host or hub end of the USB cable, 15 kΩ nominal resistors (14.25 kΩ to 24.8 kΩ) are present which pull both the D+ and D- lines to ground. During bus Idle conditions (such as between packets or during USB Suspend mode), this results in up to 218 μA of quiescent current drawn at 3.3V. IPULLUP is also dependant on bus traffic conditions and can be as high as 2.2 mA when the USB bandwidth is fully utilized (either IN or OUT traffic) for data that drives the lines to the “K” state most of the time. For this example, the following assumptions are made about the application: • 3.3V will be applied to VUSB and VDD, with the core voltage regulator enabled. • This is a full-speed application that uses one interrupt IN endpoint that can send one packet of 64 bytes every 1 ms, with no restrictions on the values of the bytes being sent. The application may or may not have additional traffic on OUT endpoints. • A regular USB “B” or “mini-B” connector will be used on the application circuit board. In this case, PZERO = 100% = 1, because there should be no restriction on the value of the data moving through the IN endpoint. All 64 kBps of data could potentially be bytes of value, 00h. Since ‘0’ bits cause toggling of the output state of the transceiver, they cause the USB transceiver to consume extra current charging/discharging the cable. In this case, 100% of the data bits sent can be of value ‘0’. This should be considered the “max” value, as normal data will consist of a fair mix of ones and zeros. This application uses 64 kBps for IN traffic out of the total bus bandwidth of 1.5 MBps (12 Mbps), therefore: Since a regular “B” or “mini-B” connector is used in this application, the end user may plug in any type of cable up to the maximum allowed 5 m length. Therefore, we use the worst-case length: LCABLE = 5 meters Assume IPULLUP = 2.2 mA. The actual value of IPULLUP will likely be closer to 218 μA, but allow for the worst-case. USB bandwidth is shared between all the devices which are plugged into the root port (via hubs). If the application is plugged into a USB 1.1 hub that has other devices plugged into it, your device may see host to device traffic on the bus, even if it is not addressed to your device. Since any traffic, regardless of source, can increase the IPULLUP current above the base 218 μA, it is safest to allow for the worst-case of 2.2 mA. Therefore: The calculated value should be considered an approximation and additional guardband or application-specific product testing is recommended. The transceiver current is “in addition to” the rest of the current consumed by the PIC18F1XK50/PIC18LF1XK50 device that is needed to run the core, drive the other I/O lines, power the various modules, etc. Pin = 64 kBps 1.5 MBps = 4.3% = 0.043 IXCVR = + 2.2 mA = 4.8 mA (60 mA • 3.3V • 1 • 0.043 • 5m) (3.3V • 5m) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 268 Preliminary © 200C Microchip Technology Inc. 22.7 Oscillator The USB module has specific clock requirements. For full-speed operation, the clock source must be 48 MHz. Even so, the microcontroller core and other peripherals are not required to run at that clock speed. Available clocking options are described in detail in Section 2.11 “USB Operation”. 22.8 Interrupt-On-Change for D+/Dpins The PIC18F1XK50/PIC18LF1XK50 has interrupt-on-change functionality on both D+ and D- data pins. This feature allows the device to detect voltage level changes when first connected to a USB host/hub. The USB host/hub has 15K pull-down resistors on the D+ and D- pins. When the PIC18F1XK50/PIC18LF1XK50 attaches to the bus the D+ and D- pins can detect voltage changes. External resistors are needed for each pin to maintain a high state on the pins when detached. The USB module must be disable (USBEN = 0) for the interrupt-on-change to function. Enabling the USB module (USBEN = 1) will automatically disable the interrupt-on-change for D+ and D- pins. Refer to Section 7.11 “PORTA and PORTB Interrupt-on-Change” for mode detail. 22.9 USB Firmware and Drivers Microchip provides a number of application-specific resources, such as USB firmware and driver support. Refer to www.microchip.com for the latest firmware and driver support. TABLE 22-4: REGISTERS ASSOCIATED WITH USB MODULE OPERATION(1) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Details on Page: INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 65 IPR2 OSCFIP C1IP C2IP EEIP BCL1IP USBIP TMR3IP — 73 PIR2 OSCFIF C1IF C2IF EEIF BCL1IF USBIF TMR3IF — 69 PIE2 OSCFIE C1IE C2IE EEIE BCL1IE USBIE TMR3IE — 71 UCON — PPBRST SE0 PKTDIS USBEN RESUME SUSPND — 246 UCFG UTEYE — — UPUEN — FSEN PPB1 PPB0 248 USTAT — ENDP3 ENDP2 ENDP1 ENDP0 DIR PPBI — 250 UADDR — ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 252 UFRML FRM7 FRM6 FRM5 FRM4 FRM3 FRM2 FRM1 FRM0 246 UFRMH — — — — — FRM10 FRM9 FRM8 246 UIR — SOFIF STALLIF IDLEIF TRNIF ACTVIF UERRIF URSTIF 260 UIE — SOFIE STALLIE IDLEIE TRNIE ACTVIE UERRIE URSTIE 262 UEIR BTSEF — — BTOEF DFN8EF CRC16EF CRC5EF PIDEF 263 UEIE BTSEE — — BTOEE DFN8EE CRC16EE CRC5EE PIDEE 264 UEP0 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 UEP1 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 UEP2 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 UEP3 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 UEP4 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 UEP5 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 UEP6 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 UEP7 — — — EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL 251 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the USB module. Note 1: This table includes only those hardware mapped SFRs located in Bank 15 of the data memory space. The Buffer Descriptor registers, which are mapped into Bank 4 and are not true SFRs, are listed separately in Table 22-3. © 200C Microchip Technology Inc. Preliminary DS41350C-page 269 PIC18F1XK50/PIC18LF1XK50 22.10 Overview of USB This section presents some of the basic USB concepts and useful information necessary to design a USB device. Although much information is provided in this section, there is a plethora of information provided within the USB specifications and class specifications. Thus, the reader is encouraged to refer to the USB specifications for more information (www.usb.org). If you are very familiar with the details of USB, then this section serves as a basic, high-level refresher of USB. 22.10.1 LAYERED FRAMEWORK USB device functionality is structured into a layered framework graphically shown in Figure 22-12. Each level is associated with a functional level within the device. The highest layer, other than the device, is the configuration. A device may have multiple configurations. For example, a particular device may have multiple power requirements based on Self-Power Only or Bus Power Only modes. For each configuration, there may be multiple interfaces. Each interface could support a particular mode of that configuration. Below the interface is the endpoint(s). Data is directly moved at this level. There can be as many as 16 bidirectional endpoints. Endpoint 0 is always a control endpoint and by default, when the device is on the bus, Endpoint 0 must be available to configure the device. 22.10.2 FRAMES Information communicated on the bus is grouped into 1 ms time slots, referred to as frames. Each frame can contain many transactions to various devices and endpoints. Figure 22-8 shows an example of a transaction within a frame. 22.10.3 TRANSFERS There are four transfer types defined in the USB specification. • Isochronous: This type provides a transfer method for large amounts of data (up to 1023 bytes) with timely delivery ensured; however, the data integrity is not ensured. This is good for streaming applications where small data loss is not critical, such as audio. • Bulk: This type of transfer method allows for large amounts of data to be transferred with ensured data integrity; however, the delivery timeliness is not ensured. • Interrupt: This type of transfer provides for ensured timely delivery for small blocks of data, plus data integrity is ensured. • Control: This type provides for device setup control. While full-speed devices support all transfer types, low-speed devices are limited to interrupt and control transfers only. 22.10.4 POWER Power is available from the Universal Serial Bus. The USB specification defines the bus power requirements. Devices may either be self-powered or bus powered. Self-powered devices draw power from an external source, while bus powered devices use power supplied from the bus. FIGURE 22-12: USB LAYERS Device Configuration Interface Endpoint Interface Endpoint Endpoint Endpoint Endpoint To other Configurations (if any) To other Interfaces (if any) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 270 Preliminary © 200C Microchip Technology Inc. The USB specification limits the power taken from the bus. Each device is ensured 100 mA at approximately 5V (one unit load). Additional power may be requested, up to a maximum of 500 mA. Note that power above one unit load is a request and the host or hub is not obligated to provide the extra current. Thus, a device capable of consuming more than one unit load must be able to maintain a low-power configuration of a one unit load or less, if necessary. The USB specification also defines a Suspend mode. In this situation, current must be limited to 500 μA, averaged over 1 second. A device must enter a Suspend state after 3 ms of inactivity (i.e., no SOF tokens for 3 ms). A device entering Suspend mode must drop current consumption within 10 ms after Suspend. Likewise, when signaling a wake-up, the device must signal a wake-up within 10 ms of drawing current above the Suspend limit. 22.10.5 ENUMERATION When the device is initially attached to the bus, the host enters an enumeration process in an attempt to identify the device. Essentially, the host interrogates the device, gathering information such as power consumption, data rates and sizes, protocol and other descriptive information; descriptors contain this information. A typical enumeration process would be as follows: 1. USB Reset: Reset the device. Thus, the device is not configured and does not have an address (address 0). 2. Get Device Descriptor: The host requests a small portion of the device descriptor. 3. USB Reset: Reset the device again. 4. Set Address: The host assigns an address to the device. 5. Get Device Descriptor: The host retrieves the device descriptor, gathering info such as manufacturer, type of device, maximum control packet size. 6. Get configuration descriptors. 7. Get any other descriptors. 8. Set a configuration. The exact enumeration process depends on the host. 22.10.6 DESCRIPTORS There are eight different standard descriptor types of which five are most important for this device. 22.10.6.1 Device Descriptor The device descriptor provides general information, such as manufacturer, product number, serial number, the class of the device and the number of configurations. There is only one device descriptor. 22.10.6.2 Configuration Descriptor The configuration descriptor provides information on the power requirements of the device and how many different interfaces are supported when in this configuration. There may be more than one configuration for a device (i.e., low-power and high-power configurations). 22.10.6.3 Interface Descriptor The interface descriptor details the number of endpoints used in this interface, as well as the class of the interface. There may be more than one interface for a configuration. 22.10.6.4 Endpoint Descriptor The endpoint descriptor identifies the transfer type (Section 22.10.3 “Transfers”) and direction, as well as some other specifics for the endpoint. There may be many endpoints in a device and endpoints may be shared in different configurations. 22.10.6.5 String Descriptor Many of the previous descriptors reference one or more string descriptors. String descriptors provide human readable information about the layer (Section 22.10.1 “Layered Framework”) they describe. Often these strings show up in the host to help the user identify the device. String descriptors are generally optional to save memory and are encoded in a unicode format. 22.10.7 BUS SPEED Each USB device must indicate its bus presence and speed to the host. This is accomplished through a 1.5 kΩ resistor which is connected to the bus at the time of the attachment event. Depending on the speed of the device, the resistor either pulls up the D+ or D- line to 3.3V. For a low-speed device, the pull-up resistor is connected to the D- line. For a full-speed device, the pull-up resistor is connected to the D+ line. 22.10.8 CLASS SPECIFICATIONS AND DRIVERS USB specifications include class specifications which operating system vendors optionally support. Examples of classes include Audio, Mass Storage, Communications and Human Interface (HID). In most cases, a driver is required at the host side to ‘talk’ to the USB device. In custom applications, a driver may need to be developed. Fortunately, drivers are available for most common host systems for the most common classes of devices. Thus, these drivers can be reused. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 271 PIC18F1XK50/PIC18LF1XK50 23.0 RESET The PIC18F1XK50/PIC18LF1XK50 devices differentiate between various kinds of Reset: a) Power-on Reset (POR) b) MCLR Reset during normal operation c) MCLR Reset during power-managed modes d) Watchdog Timer (WDT) Reset (during execution) e) Programmable Brown-out Reset (BOR) f) RESET Instruction g) Stack Full Reset h) Stack Underflow Reset This section discusses Resets generated by MCLR, POR and BOR and covers the operation of the various start-up timers. Stack Reset events are covered in Section 3.1.2.4 “Stack Full and Underflow Resets”. WDT Resets are covered in Section 24.2 “Watchdog Timer (WDT)”. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 23-1. 23.1 RCON Register Device Reset events are tracked through the RCON register (Register 23-1). The lower five bits of the register indicate that a specific Reset event has occurred. In most cases, these bits can only be cleared by the event and must be set by the application after the event. The state of these flag bits, taken together, can be read to indicate the type of Reset that just occurred. This is described in more detail in Section 23.6 “Reset State of Registers”. The RCON register also has control bits for setting interrupt priority (IPEN) and software control of the BOR (SBOREN). Interrupt priority is discussed in Section 7.0 “Interrupts”. BOR is covered in Section 23.4 “Brown-out Reset (BOR)”. FIGURE 23-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR VDD OSC1 WDT Time-out VDD Rise Detect OST/PWRT LFINTOSC POR Pulse OST(2) 10-bit Ripple Counter PWRT(2) 11-bit Ripple Counter Enable OST(1) Enable PWRT Note 1: See Table 23-2 for time-out situations. 2: PWRT and OST counters are reset by POR and BOR. See Sections 23.3 and 23.4. Brown-out Reset BOREN RESET Instruction Stack Pointer Stack Full/Underflow Reset Sleep ( )_IDLE 1024 Cycles 65.5 ms 32 μs MCLRE S R Q Chip_Reset PIC18F1XK50/PIC18LF1XK50 DS41350C-page 272 Preliminary © 2009 Microchip Technology Inc. REGISTER 23-1: RCON: RESET CONTROL REGISTER R/W-0 R/W-1 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0 IPEN SBOREN(1) — RI TO PD POR(2) BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode) bit 6 SBOREN: BOR Software Enable bit(1) If BOREN<1:0> = 01: 1 = BOR is enabled 0 = BOR is disabled If BOREN<1:0> = 00, 10 or 11: Bit is disabled and read as ‘0’. bit 5 Unimplemented: Read as ‘0’ bit 4 RI: RESET Instruction Flag bit 1 = The RESET instruction was not executed (set by firmware or Power-on Reset) 0 = The RESET instruction was executed causing a device Reset (must be set in firmware after a code-executed Reset occurs) bit 3 TO: Watchdog Time-out Flag bit 1 = Set by power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 2 PD: Power-down Detection Flag bit 1 = Set by power-up or by the CLRWDT instruction 0 = Set by execution of the SLEEP instruction bit 1 POR: Power-on Reset Status bit(2) 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit(3) 1 = A Brown-out Reset has not occurred (set by firmware only) 0 = A Brown-out Reset occurred (must be set by firmware after a POR or Brown-out Reset occurs) Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’. 2: The actual Reset value of POR is determined by the type of device Reset. See the notes following this register and Section 23.6 “Reset State of Registers” for additional information. 3: See Table 23-3. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 273 PIC18F1XK50/PIC18LF1XK50 23.2 Master Clear (MCLR) The MCLR pin provides a method for triggering an external Reset of the device. A Reset is generated by holding the pin low. These devices have a noise filter in the MCLR Reset path which detects and ignores small pulses. The MCLR pin is not driven low by any internal Resets, including the WDT. In PIC18F1XK50/PIC18LF1XK50 devices, the MCLR input can be disabled with the MCLRE Configuration bit. When MCLR is disabled, the pin becomes a digital input. See Section 9.1 “PORTA, TRISA and LATA Registers” for more information. 23.3 Power-on Reset (POR) A Power-on Reset pulse is generated on-chip whenever VDD rises above a certain threshold. This allows the device to start in the initialized state when VDD is adequate for operation. To take advantage of the POR circuitry, tie the MCLR pin through a resistor (1 kΩ to 10 kΩ) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset delay. When the device starts normal operation (i.e., exits the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. POR events are captured by the POR bit of the RCON register. The state of the bit is set to ‘0’ whenever a POR occurs; it does not change for any other Reset event. POR is not reset to ‘1’ by any hardware event. To capture multiple events, the user must manually set the bit to ‘1’ by software following any POR. FIGURE 23-2: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) Note 1: External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. 2: R < 40 kΩ is recommended to make sure that the voltage drop across R does not violate the device’s electrical specification. 3: R1 ≥ 1 kΩ will limit any current flowing into MCLR from external capacitor C, in the event of MCLR/VPP pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). C R1 D R VDD MCLR VDD PIC® MCU PIC18F1XK50/PIC18LF1XK50 DS41350C-page 274 Preliminary © 2009 Microchip Technology Inc. 23.4 Brown-out Reset (BOR) PIC18F1XK50/PIC18LF1XK50 devices implement a BOR circuit that provides the user with a number of configuration and power-saving options. The BOR is controlled by the BORV<1:0> and BOREN<1:0> bits of the CONFIG2L Configuration register. There are a total of four BOR configurations which are summarized in Table 23-1. The BOR threshold is set by the BORV<1:0> bits. If BOR is enabled (any values of BOREN<1:0>, except ‘00’), any drop of VDD below VBOR for greater than TBOR will reset the device. A Reset may or may not occur if VDD falls below VBOR for less than TBOR. The chip will remain in Brown-out Reset until VDD rises above VBOR. If the Power-up Timer is enabled, it will be invoked after VDD rises above VBOR; it then will keep the chip in Reset for an additional time delay, TPWRT. If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be initialized. Once VDD rises above VBOR, the Power-up Timer will execute the additional time delay. BOR and the Power-on Timer (PWRT) are independently configured. Enabling BOR Reset does not automatically enable the PWRT. 23.4.1 SOFTWARE ENABLED BOR When BOREN<1:0> = 01, the BOR can be enabled or disabled by the user in software. This is done with the SBOREN control bit of the RCON register. Setting SBOREN enables the BOR to function as previously described. Clearing SBOREN disables the BOR entirely. The SBOREN bit operates only in this mode; otherwise it is read as ‘0’. Placing the BOR under software control gives the user the additional flexibility of tailoring the application to its environment without having to reprogram the device to change BOR configuration. It also allows the user to tailor device power consumption in software by eliminating the incremental current that the BOR consumes. While the BOR current is typically very small, it may have some impact in low-power applications. 23.4.2 DETECTING BOR When BOR is enabled, the BOR bit always resets to ‘0’ on any BOR or POR event. This makes it difficult to determine if a BOR event has occurred just by reading the state of BOR alone. A more reliable method is to simultaneously check the state of both POR and BOR. This assumes that the POR and BOR bits are reset to ‘1’ by software immediately after any POR event. If BOR is ‘0’ while POR is ‘1’, it can be reliably assumed that a BOR event has occurred. 23.4.3 DISABLING BOR IN SLEEP MODE When BOREN<1:0> = 10, the BOR remains under hardware control and operates as previously described. Whenever the device enters Sleep mode, however, the BOR is automatically disabled. When the device returns to any other operating mode, BOR is automatically re-enabled. This mode allows for applications to recover from brown-out situations, while actively executing code, when the device requires BOR protection the most. At the same time, it saves additional power in Sleep mode by eliminating the small incremental BOR current. TABLE 23-1: BOR CONFIGURATIONS Note: Even when BOR is under software control, the BOR Reset voltage level is still set by the BORV<1:0> Configuration bits. It cannot be changed by software. BOR Configuration Status of SBOREN (RCON<6>) BOR Operation BOREN1 BOREN0 0 0 Unavailable BOR disabled; must be enabled by reprogramming the Configuration bits. 0 1 Available BOR enabled by software; operation controlled by SBOREN. 1 0 Unavailable BOR enabled by hardware in Run and Idle modes, disabled during Sleep mode. 1 1 Unavailable BOR enabled by hardware; must be disabled by reprogramming the Configuration bits. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 275 PIC18F1XK50/PIC18LF1XK50 23.5 Device Reset Timers PIC18F1XK50/PIC18LF1XK50 devices incorporate three separate on-chip timers that help regulate the Power-on Reset process. Their main function is to ensure that the device clock is stable before code is executed. These timers are: • Power-up Timer (PWRT) • Oscillator Start-up Timer (OST) • PLL Lock Time-out 23.5.1 POWER-UP TIMER (PWRT) The Power-up Timer (PWRT) of PIC18F1XK50/PIC18LF1XK50 devices is an 11-bit counter which uses the LFINTOSC source as the clock input. This yields an approximate time interval of 2048 x 32 μs = 65.6 ms. While the PWRT is counting, the device is held in Reset. The power-up time delay depends on the LFINTOSC clock and will vary from chip-to-chip due to temperature and process variation. See Section 27.0 “Electrical Specifications” for details. The PWRT is enabled by clearing the PWRTEN Configuration bit. 23.5.2 OSCILLATOR START-UP TIMER (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over. This ensures that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP, HS and HSPLL modes and only on Power-on Reset, or on exit from all power-managed modes that stop the external oscillator. 23.5.3 PLL LOCK TIME-OUT With the PLL enabled in its PLL mode, the time-out sequence following a Power-on Reset is slightly different from other oscillator modes. A separate timer is used to provide a fixed time-out that is sufficient for the PLL to lock to the main oscillator frequency. This PLL lock time-out (TPLL) is typically 2 ms and follows the oscillator start-up time-out. 23.5.4 TIME-OUT SEQUENCE On power-up, the time-out sequence is as follows: 1. After the POR pulse has cleared, PWRT time-out is invoked (if enabled). 2. Then, the OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. Figure 23-3, Figure 23-4, Figure 23-5, Figure 23-6 and Figure 23-7 all depict time-out sequences on power-up, with the Power-up Timer enabled and the device operating in HS Oscillator mode. Figures 23-3 through 23-6 also apply to devices operating in XT or LP modes. For devices in RC mode and with the PWRT disabled, on the other hand, there will be no time-out at all. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, all time-outs will expire, after which, bringing MCLR high will allow program execution to begin immediately (Figure 23-5). This is useful for testing purposes or to synchronize more than one PIC18F1XK50/PIC18LF1XK50 device operating in parallel. TABLE 23-2: TIME-OUT IN VARIOUS SITUATIONS Oscillator Configuration Power-up(2) and Brown-out Exit from Power-Managed Mode PWRTEN = 0 PWRTEN = 1 HSPLL 66 ms(1) + 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC EC, ECIO 66 ms(1) — — RC, RCIO 66 ms(1) — — INTIO1, INTIO2 66 ms(1) — — Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay. 2: 2 ms is the nominal time required for the PLL to lock. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 276 Preliminary © 2009 Microchip Technology Inc. FIGURE 23-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT) FIGURE 23-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 FIGURE 23-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET TPWRT TOST © 2009 Microchip Technology Inc. Preliminary DS41350C-page 277 PIC18F1XK50/PIC18LF1XK50 FIGURE 23-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT) FIGURE 23-7: TIME-OUT SEQUENCE ON POR W/PLL ENABLED (MCLR TIED TO VDD) VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET 0V 5V TPWRT TOST TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET PLL TIME-OUT TPLL Note: TOST = 1024 clock cycles. TPLL ≈ 2 ms max. First three stages of the PWRT timer. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 278 Preliminary © 2009 Microchip Technology Inc. 23.6 Reset State of Registers Some registers are unaffected by a Reset. Their status is unknown on POR and unchanged by all other Resets. All other registers are forced to a “Reset state” depending on the type of Reset that occurred. Most registers are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. Status bits from the RCON register, RI, TO, PD, POR and BOR, are set or cleared differently in different Reset situations, as indicated in Table 23-3. These bits are used by software to determine the nature of the Reset. Table 23-4 describes the Reset states for all of the Special Function Registers. These are categorized by Power-on and Brown-out Resets, Master Clear and WDT Resets and WDT wake-ups. TABLE 23-3: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR RCON REGISTER Condition Program Counter RCON Register STKPTR Register SBOREN RI TO PD POR BOR STKFUL STKUNF Power-on Reset 0000h 1 11100 0 0 RESET Instruction 0000h u(2) 0uuuu u u Brown-out Reset 0000h u(2) 111u0 u u MCLR during Power-Managed Run Modes 0000h u(2) u1uuu u u MCLR during Power-Managed Idle Modes and Sleep Mode 0000h u(2) u10uu u u WDT Time-out during Full Power or Power-Managed Run Mode 0000h u(2) u0uuu u u MCLR during Full Power Execution 0000h u(2) uuuuu u u Stack Full Reset (STVREN = 1) 0000h u(2) uuuuu 1 u Stack Underflow Reset (STVREN = 1) 0000h u(2) uuuuu u 1 Stack Underflow Error (not an actual Reset, STVREN = 0) 0000h u(2) uuuuu u 1 WDT Time-out during Power-Managed Idle or Sleep Modes PC + 2 u(2) u00uu u u Interrupt Exit from Power-Managed Modes PC + 2(1) u(2) uu0uu u u Legend: u = unchanged Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the interrupt vector (008h or 0018h). 2: Reset state is ‘1’ for POR and unchanged for all other Resets when software BOR is enabled (BOREN<1:0> Configuration bits = 01 and SBOREN = 1). Otherwise, the Reset state is ‘0’. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 279 PIC18F1XK50/PIC18LF1XK50 TABLE 23-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS Register Address Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt TOSU FFFh ---0 0000 ---0 0000 ---0 uuuu(3) TOSH FFEh 0000 0000 0000 0000 uuuu uuuu(3) TOSL FFDh 0000 0000 0000 0000 uuuu uuuu(3) STKPTR FFCh 00-0 0000 uu-0 0000 uu-u uuuu(3) PCLATU FFBh ---0 0000 ---0 0000 ---u uuuu PCLATH FFAh 0000 0000 0000 0000 uuuu uuuu PCL FF9h 0000 0000 0000 0000 PC + 2(2) TBLPTRU FF8h ---0 0000 ---0 0000 ---u uuuu TBLPTRH FF7h 0000 0000 0000 0000 uuuu uuuu TBLPTRL FF6h 0000 0000 0000 0000 uuuu uuuu TABLAT FF5h 0000 0000 0000 0000 uuuu uuuu PRODH FF4h xxxx xxxx uuuu uuuu uuuu uuuu PRODL FF3h xxxx xxxx uuuu uuuu uuuu uuuu INTCON FF2h 0000 000x 0000 000u uuuu uuuu(1) INTCON2 FF1h 1111 -1-1 1111 -1-1 uuuu -u-u(1) INTCON3 FF0h 11-0 0-00 11-0 0-00 uu-u u-uu(1) INDF0 FEFh N/A N/A N/A POSTINC0 FEEh N/A N/A N/A POSTDEC0 FEDh N/A N/A N/A PREINC0 FECh N/A N/A N/A PLUSW0 FEBh N/A N/A N/A FSR0H FEAh ---- 0000 ---- 0000 ---- uuuu FSR0L FE9h xxxx xxxx uuuu uuuu uuuu uuuu WREG FE8h xxxx xxxx uuuu uuuu uuuu uuuu INDF1 FE7h N/A N/A N/A POSTINC1 FE6h N/A N/A N/A POSTDEC1 FE5h N/A N/A N/A PREINC1 FE4h N/A N/A N/A PLUSW1 FE3h N/A N/A N/A Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 23-3 for Reset value for specific condition. 5: All bits of the ANSELH register initialize to ‘0’ if the PBADEN bit of CONFIG3H is ‘0’. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 280 Preliminary © 2009 Microchip Technology Inc. FSR1H FE2h ---- 0000 ---- 0000 ---- uuuu FSR1L FE1h xxxx xxxx uuuu uuuu uuuu uuuu BSR FE0h ---- 0000 ---- 0000 ---- uuuu INDF2 FDFh N/A N/A N/A POSTINC2 FDEh N/A N/A N/A POSTDEC2 FDDh N/A N/A N/A PREINC2 FDCh N/A N/A N/A PLUSW2 FDBh N/A N/A N/A FSR2H FDAh ---- 0000 ---- 0000 ---- uuuu FSR2L FD9h xxxx xxxx uuuu uuuu uuuu uuuu STATUS FD8h ---x xxxx ---u uuuu ---u uuuu TMR0H FD7h 0000 0000 0000 0000 uuuu uuuu TMR0L FD6h xxxx xxxx uuuu uuuu uuuu uuuu T0CON FD5h 1111 1111 1111 1111 uuuu uuuu OSCCON FD3h 0011 qq00 0011 qq00 uuuu uuuu OSCCON2 FD2h ---- -10x ---- -10x ---- -uuu WDTCON FD1h ---- ---0 ---- ---0 ---- ---u RCON(4) FD0h 0q-1 11q0 0q-q qquu uq-u qquu TMR1H FCFh xxxx xxxx uuuu uuuu uuuu uuuu TMR1L FCEh xxxx xxxx uuuu uuuu uuuu uuuu T1CON FCDh 0000 0000 u0uu uuuu uuuu uuuu TMR2 FCCh 0000 0000 0000 0000 uuuu uuuu PR2 FCBh 1111 1111 1111 1111 1111 1111 T2CON FCAh -000 0000 -000 0000 -uuu uuuu SSPBUF FC9h xxxx xxxx uuuu uuuu uuuu uuuu SSPADD FC8h 0000 0000 0000 0000 uuuu uuuu SSPSTAT FC7h 0000 0000 0000 0000 uuuu uuuu SSPCON1 FC6h 0000 0000 0000 0000 uuuu uuuu SSPCON2 FC5h 0000 0000 0000 0000 uuuu uuuu TABLE 23-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Address Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 23-3 for Reset value for specific condition. 5: All bits of the ANSELH register initialize to ‘0’ if the PBADEN bit of CONFIG3H is ‘0’. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 281 PIC18F1XK50/PIC18LF1XK50 ADRESH FC4h xxxx xxxx uuuu uuuu uuuu uuuu ADRESL FC3h xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 FC2h --00 0000 --00 0000 --uu uuuu ADCON1 FC1h ---- 0000 ---- 0000 ---- uuuu ADCON2 FC0h 0-00 0000 0-00 0000 u-uu uuuu CCPR1H FBFh xxxx xxxx uuuu uuuu uuuu uuuu CCPR1L FBEh xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON FBDh 0000 0000 0000 0000 uuuu uuuu REFCON2 FBCh ---0 0000 ---0 0000 ---u uuuu REFCON1 FBBh 000- 00-0 000- 00-0 uuu- uu-u REFCON0 FBAh 0001 00-- 0001 00-- uuuu uu-- PSTRCON FB9h ---0 0001 ---0 0001 ---u uuuu BAUDCON FB8h 0100 0-00 0100 0-00 uuuu u-uu PWM1CON FB7h 0000 0000 0000 0000 uuuu uuuu ECCP1AS FB6h 0000 0000 0000 0000 uuuu uuuu TMR3H FB3h xxxx xxxx uuuu uuuu uuuu uuuu TMR3L FB2h xxxx xxxx uuuu uuuu uuuu uuuu T3CON FB1h 0000 0000 uuuu uuuu uuuu uuuu SPBRGH FB0h 0000 0000 0000 0000 uuuu uuuu SPBRG FAFh 0000 0000 0000 0000 uuuu uuuu RCREG FAEh 0000 0000 0000 0000 uuuu uuuu TXREG FADh 0000 0000 0000 0000 uuuu uuuu TXSTA FACh 0000 0010 0000 0010 uuuu uuuu RCSTA FABh 0000 000x 0000 000x uuuu uuuu EEADR FAAh 0000 0000 0000 0000 uuuu uuuu EEADRH FA9h ---- --00 ---- --00 ---- --uu EEDATA FA8h 0000 0000 0000 0000 uuuu uuuu EECON2 FA7h 0000 0000 0000 0000 0000 0000 EECON1 FA6h xx-0 x000 uu-0 u000 uu-0 u000 TABLE 23-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Address Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 23-3 for Reset value for specific condition. 5: All bits of the ANSELH register initialize to ‘0’ if the PBADEN bit of CONFIG3H is ‘0’. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 282 Preliminary © 2009 Microchip Technology Inc. IPR2 FA2h 1111 111- 1111 111- uuuu uuuPIR2 FA1h 0000 000- 0000 000- uuuu uuu-(1) PIE2 FA0h 0000 000- 0000 000- uuuu uuuIPR1 F9Fh -111 1111 -111 1111 -uuu uuuu PIR1 F9Eh -000 0000 -000 0000 -uuu uuuu(1) PIE1 F9Dh -000 0000 -000 0000 -uuu uuuu OSCTUNE F9Bh 0000 0000 0000 0000 uuuu uuuu TRISC F95h 1111 1111 1111 1111 uuuu uuuu TRISB F94h 1111 ---- 1111 ---- uuuu ---- TRISA F93h --11 ---- --11 ---- --uu ---- LATC F8Bh xxxx xxxx uuuu uuuu uuuu uuuu LATB F8Ah xxxx ---- uuuu ---- uuuu ---- LATA F89h --xx ---- --uu ---- --uu ---- PORTC F82h xxxx xxxx uuuu uuuu uuuu uuuu PORTB F81h xxxx ---- uuuu ---- uuuu ---- PORTA F80h --xx x-xx --xx x-xx --uu u-uu ANSELH(5) F7Fh ---- 1111 ---- 1111 ---- uuuu ANSEL F7Eh 1111 1--- 1111 1--- uuuu u--- IOCB F7Ah 0000 ---- 0000 ---- uuuu ---- IOCA F79h --00 0-00 --00 0-00 --uu u-uu WPUB F78h 1111 ---- 1111 ---- uuuu ---- WPUA F77h --11 1--- --11 1--- --uu u--- SLRCON F76h ---- -111 ---- -111 ---- -uuu SSPMSK F6Fh 1111 1111 1111 1111 uuuu uuuu CM1CON0 F6Dh 0000 0000 0000 0000 uuuu uuuu CM2CON1 F6Ch 0000 0000 0000 0000 uuuu uuuu CM2CON0 F6Bh 0000 0000 0000 0000 uuuu uuuu SRCON1 F69h 0000 0000 0000 0000 uuuu uuuu SRCON0 F68h 0000 0000 0000 0000 uuuu uuuu UCON F64h -0x0 000- -0x0 000- -uuu uuuTABLE 23-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Address Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 23-3 for Reset value for specific condition. 5: All bits of the ANSELH register initialize to ‘0’ if the PBADEN bit of CONFIG3H is ‘0’. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 283 PIC18F1XK50/PIC18LF1XK50 USTAT F63h -xxx xxx- -xxx xxx- -uuu uuuUIR F62h -000 0000 -000 0000 -uuu uuuu UCFG F61h 0--0 -000 0--0 -000 u--u -uuu UIE F60h -000 0000 -000 0000 -uuu uuuu UEIR F5Fh 0--0 0000 0--0 0000 u--u uuuu UFRMH F5Eh ---- -xxx ---- -xxx ---- -uuu UFRML F5Dh xxxx xxxx xxxx xxxx uuuu uuuu UADDR F5Ch -000 0000 -000 0000 -uuu uuuu UEIE F5Bh 0--0 0000 0--0 0000 u--u uuuu UEP7 F5Ah ----0 0000 ----0 0000 ----u uuuu UEP6 F59h ----0 0000 ----0 0000 ----u uuuu UEP5 F58h ----0 0000 ----0 0000 ----u uuuu UEP4 F57h ----0 0000 ----0 0000 ----u uuuu UEP3 F56h ----0 0000 ----0 0000 ----u uuuu UEP2 F55h ----0 0000 ----0 0000 ----u uuuu UEP1 F54h ----0 0000 ----0 0000 ----u uuuu UEP0 F53h ----0 0000 ----0 0000 ----u uuuu TABLE 23-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Address Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 23-3 for Reset value for specific condition. 5: All bits of the ANSELH register initialize to ‘0’ if the PBADEN bit of CONFIG3H is ‘0’. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 284 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 285 PIC18F1XK50/PIC18LF1XK50 24.0 SPECIAL FEATURES OF THE CPU PIC18F1XK50/PIC18LF1XK50 devices include several features intended to maximize reliability and minimize cost through elimination of external components. These are: • Oscillator Selection • Resets: - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Code Protection • ID Locations • In-Circuit Serial Programming™ The oscillator can be configured for the application depending on frequency, power, accuracy and cost. All of the options are discussed in detail in Section 2.0 “Oscillator Module”. A complete discussion of device Resets and interrupts is available in previous sections of this data sheet. In addition to their Power-up and Oscillator Start-up Timers provided for Resets, PIC18F1XK50/ PIC18LF1XK50 devices have a Watchdog Timer, which is either permanently enabled via the Configuration bits or software controlled (if configured as disabled). The inclusion of an internal RC oscillator also provides the additional benefits of a Fail-Safe Clock Monitor (FSCM) and Two-Speed Start-up. FSCM provides for background monitoring of the peripheral clock and automatic switchover in the event of its failure. TwoSpeed Start-up enables code to be executed almost immediately on start-up, while the primary clock source completes its start-up delays. All of these features are enabled and configured by setting the appropriate Configuration register bits. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 286 Preliminary © 2009 Microchip Technology Inc. 24.1 Configuration Bits The Configuration bits can be programmed (read as ‘0’) or left unprogrammed (read as ‘1’) to select various device configurations. These bits are mapped starting at program memory location 300000h. The user will note that address 300000h is beyond the user program memory space. In fact, it belongs to the configuration memory space (300000h-3FFFFFh), which can only be accessed using table reads and table writes. Programming the Configuration registers is done in a manner similar to programming the Flash memory. The WR bit in the EECON1 register starts a self-timed write to the Configuration register. In normal operation mode, a TBLWT instruction with the TBLPTR pointing to the Configuration register sets up the address and the data for the Configuration register write. Setting the WR bit starts a long write to the Configuration register. The Configuration registers are written a byte at a time. To write or erase a configuration cell, a TBLWT instruction can write a ‘1’ or a ‘0’ into the cell. For additional details on Flash programming, refer to Section 4.5 “Writing to Flash Program Memory”. TABLE 24-1: CONFIGURATION BITS AND DEVICE IDs File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default/ Unprogrammed Value 300000h CONFIG1L — — USBDIV CPUDIV1 CPUDIV0 — — — --00 0--- 300001h CONFIG1H IESO FCMEN PCLKEN PLLEN FOSC3 FOSC2 FOSC1 FOSC0 0010 0111 300002h CONFIG2L — — — BORV1 BORV0 BOREN1 BOREN0 PWRTEN ---1 1111 300003h CONFIG2H — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN ---1 1111 300005h CONFIG3H MCLRE — — — HFOFST — — — 1--- 1--- 300006h CONFIG4L — XINST — — BBSIZ LVP — STVREN -0-- 01-1 300008h CONFIG5L — — — — — — CP1 CP0 ---- --11 300009h CONFIG5H CPD CPB — — — — — — 11-- ---- 30000Ah CONFIG6L — — — — — — WRT1 WRT0 ---- --11 30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 111- ---- 30000Ch CONFIG7L — — — — — — EBTR1 EBTR0 ---- --11 30000Dh CONFIG7H — EBTRB — — — — — — -1-- ---- 3FFFFEh DEVID1(1) DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 qqqq qqqq(1) 3FFFFFh DEVID2(1) DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0000 1100 Legend: x = unknown, u = unchanged, – = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’ Note 1: See Register 24-13 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 287 PIC18F1XK50/PIC18LF1XK50 REGISTER 24-1: CONFIG1L: CONFIGURATION REGISTER 1 LOW U-0 U-0 R/P-0 R/P-0 R/P-0 U-0 U-0 U-0 — — USBDIV CPUDIV1 CPUDIV0 — — — bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5 USBDIV: USB Clock Selection bit Selects the clock source for Low-speed USB operation 1 = USB clock comes from the OSC1/OSC2 divided by 2 0 = USB clock comes directly from the OSC1/OSC2 Oscillator block; no divide bit 4-3 CPUDIV<1:0>: CPU System Clock Selection bits 11 = CPU system clock divided by 4 10 = CPU system clock divided by 3 01 = CPU system clock divided by 2 00 = No CPU system clock divide bit 2-0 Unimplemented: Read as ‘0’ PIC18F1XK50/PIC18LF1XK50 DS41350C-page 288 Preliminary © 2009 Microchip Technology Inc. REGISTER 24-2: CONFIG1H: CONFIGURATION REGISTER 1 HIGH R/P-0 R/P-0 R/P-1 R/P-0 R/P-0 R/P-1 R/P-1 R/P-1 IESO FCMEN PCLKEN PLLEN FOSC3 FOSC2 FOSC1 FOSC0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed x = Bit is unknown bit 7 IESO: Internal/External Oscillator Switchover bit 1 = Oscillator Switchover mode enabled 0 = Oscillator Switchover mode disabled bit 6 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor enabled 0 = Fail-Safe Clock Monitor disabled bit 5 PCLKEN: Primary Clock Enable bit 1 = Primary Clock enabled 0 = Primary Clock is under software control bit 4 PLLEN: 4 X PLL Enable bit 1 = Oscillator multiplied by 4 0 = PLL is under software control bit 3-0 FOSC<3:0>: Oscillator Selection bits 1111 = External RC oscillator, CLKOUT function on OSC2 1110 = External RC oscillator, CLKOUT function on OSC2 1101 = EC (low) 1100 = EC, CLKOUT function on OSC2 (low) 1011 = EC (medium) 1010 = EC, CLKOUT function on OSC2 (medium) 1001 = Internal RC oscillator, CLKOUT function on OSC2 1000 = Internal RC oscillator 0111 = External RC oscillator 0110 = External RC oscillator, CLKOUT function on OSC2 0101 = EC (high) 0100 = EC, CLKOUT function on OSC2 (high) 0011 = External RC oscillator, CLKOUT function on OSC2 0010 = HS oscillator 0001 = XT oscillator 0000 = LP oscillator © 2009 Microchip Technology Inc. Preliminary DS41350C-page 289 PIC18F1XK50/PIC18LF1XK50 REGISTER 24-3: CONFIG2L: CONFIGURATION REGISTER 2 LOW U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — — BORV1(1) BORV0(1) BOREN1(2) BOREN0(2) PWRTEN(2) bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-3 BORV<1:0>: Brown-out Reset Voltage bits(1) 11 = VBOR set to 1.9V nominal 10 = VBOR set to 2.2V nominal 01 = VBOR set to 2.7V nominal 00 = VBOR set to 3.0V nominal bit 2-1 BOREN<1:0>: Brown-out Reset Enable bits(2) 11 = Brown-out Reset enabled in hardware only (SBOREN is disabled) 10 = Brown-out Reset enabled in hardware only and disabled in Sleep mode (SBOREN is disabled) 01 = Brown-out Reset enabled and controlled by software (SBOREN is enabled) 00 = Brown-out Reset disabled in hardware and software bit 0 PWRTEN: Power-up Timer Enable bit(2) 1 = PWRT disabled 0 = PWRT enabled Note 1: See Section 26.1 “DC Characteristics: Supply Voltage” for specifications. 2: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to be independently controlled. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 290 Preliminary © 2009 Microchip Technology Inc. REGISTER 24-4: CONFIG2H: CONFIGURATION REGISTER 2 HIGH U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-1 WDTPS<3:0>: Watchdog Timer Postscale Select bits 1111 = 1:32,768 1110 = 1:16,384 1101 = 1:8,192 1100 = 1:4,096 1011 = 1:2,048 1010 = 1:1,024 1001 = 1:512 1000 = 1:256 0111 = 1:128 0110 = 1:64 0101 = 1:32 0100 = 1:16 0011 = 1:8 0010 = 1:4 0001 = 1:2 0000 = 1:1 bit 0 WDTEN: Watchdog Timer Enable bit 1 = WDT is always enabled. SWDTEN bit has no effect 0 = WDT is controlled by SWDTEN bit of the WDTCON register © 2009 Microchip Technology Inc. Preliminary DS41350C-page 291 PIC18F1XK50/PIC18LF1XK50 REGISTER 24-5: CONFIG3H: CONFIGURATION REGISTER 3 HIGH R/P-1 U-0 U-0 U-0 R/P-1 U-0 U-0 U-0 MCLRE — — — HFOFST — — — bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed x = Bit is unknown bit 7 MCLRE: MCLR Pin Enable bit 1 = MCLR pin enabled; RA3 input pin disabled 0 = RA3 input pin enabled; MCLR disabled bit 6-4 Unimplemented: Read as ‘0’ bit 3 HFOFST: HFINTOSC Fast Start-up bit 1 = HFINTOSC starts clocking the CPU without waiting for the oscillator to stabilize. 0 = The system clock is held off until the HFINTOSC is stable. bit 2-0 Unimplemented: Read as ‘0’ REGISTER 24-6: CONFIG4L: CONFIGURATION REGISTER 4 LOW U-0 R/P-0 U-0 U-0 R/P-0 R/P-1 U-0 R/P-1 — XINST — — BBSIZ LVP — STVREN bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6 XINST: Extended Instruction Set Enable bit 1 = Instruction set extension and Indexed Addressing mode enabled 0 = Instruction set extension and Indexed Addressing mode disabled (Legacy mode) bit 5-4 Unimplemented: Read as ‘0’ bit 3 BBSIZ: Boot BLock Size Select bit 1 = 2 kW boot block size for PIC18F14K50/PIC18LF14K50 (1 kW boot block size for PIC18F13K50/PIC18LF13K50) 0 = 1 kW boot block size for PIC18F14K50/PIC18LF14K50 (512 W boot block size for PIC18F13K50/PIC18LF13K50) bit 2 LVP: Single-Supply ICSP™ Enable bit 1 = Single-Supply ICSP enabled 0 = Single-Supply ICSP disabled bit 1 Unimplemented: Read as ‘0’ bit 0 STVREN: Stack Full/Underflow Reset Enable bit 1 = Stack full/underflow will cause Reset 0 = Stack full/underflow will not cause Reset PIC18F1XK50/PIC18LF1XK50 DS41350C-page 292 Preliminary © 2009 Microchip Technology Inc. REGISTER 24-7: CONFIG5L: CONFIGURATION REGISTER 5 LOW U-0 U-0 U-0 U-0 U-0 U-0 R/C-1 R/C-1 — — — — — — CP1 CP0 bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7-2 Unimplemented: Read as ‘0’ bit 1 CP1: Code Protection bit 1 = Block 1 not code-protected 0 = Block 1 code-protected bit 0 CP0: Code Protection bit 1 = Block 0 not code-protected 0 = Block 0 code-protected REGISTER 24-8: CONFIG5H: CONFIGURATION REGISTER 5 HIGH R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0 CPD CPB — — — — — — bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7 CPD: Data EEPROM Code Protection bit 1 = Data EEPROM not code-protected 0 = Data EEPROM code-protected bit 6 CPB: Boot Block Code Protection bit 1 = Boot block not code-protected 0 = Boot block code-protected bit 5-0 Unimplemented: Read as ‘0’ © 2009 Microchip Technology Inc. Preliminary DS41350C-page 293 PIC18F1XK50/PIC18LF1XK50 REGISTER 24-9: CONFIG6L: CONFIGURATION REGISTER 6 LOW U-0 U-0 U-0 U-0 U-0 U-0 R/C-1 R/C-1 — — — — — — WRT1 WRT0 bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7-2 Unimplemented: Read as ‘0’ bit 1 WRT1: Write Protection bit 1 = Block 1 not write-protected 0 = Block 1 write-protected bit 0 WRT0: Write Protection bit 1 = Block 0 not write-protected 0 = Block 0 write-protected REGISTER 24-10: CONFIG6H: CONFIGURATION REGISTER 6 HIGH R/C-1 R/C-1 R-1 U-0 U-0 U-0 U-0 U-0 WRTD WRTB WRTC(1) — — — — — bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7 WRTD: Data EEPROM Write Protection bit 1 = Data EEPROM not write-protected 0 = Data EEPROM write-protected bit 6 WRTB: Boot Block Write Protection bit 1 = Boot block not write-protected 0 = Boot block write-protected bit 5 WRTC: Configuration Register Write Protection bit(1) 1 = Configuration registers not write-protected 0 = Configuration registers write-protected bit 4-0 Unimplemented: Read as ‘0’ Note 1: This bit is read-only in normal execution mode; it can be written only in Program mode. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 294 Preliminary © 2009 Microchip Technology Inc. REGISTER 24-11: CONFIG7L: CONFIGURATION REGISTER 7 LOW U-0 U-0 U-0 U-0 U-0 U-0 R/C-1 R/C-1 — — — — — — EBTR1 EBTR0 bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7-2 Unimplemented: Read as ‘0’ bit 1 EBTR1: Table Read Protection bit 1 = Block 1 not protected from table reads executed in other blocks 0 = Block 1 protected from table reads executed in other blocks bit 0 EBTR0: Table Read Protection bit 1 = Block 0 not protected from table reads executed in other blocks 0 = Block 0 protected from table reads executed in other blocks REGISTER 24-12: CONFIG7H: CONFIGURATION REGISTER 7 HIGH U-0 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0 — EBTRB — — — — — — bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7 Unimplemented: Read as ‘0’ bit 6 EBTRB: Boot Block Table Read Protection bit 1 = Boot block not protected from table reads executed in other blocks 0 = Boot block protected from table reads executed in other blocks bit 5-0 Unimplemented: Read as ‘0’ © 2009 Microchip Technology Inc. Preliminary DS41350C-page 295 PIC18F1XK50/PIC18LF1XK50 REGISTER 24-13: DEVID1: DEVICE ID REGISTER 1 FOR PIC18F1XK50/PIC18LF1XK50 R RRRRRRR DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7-5 DEV<2:0>: Device ID bits 010 = PIC18F13K50 011 = PIC18F14K50 bit 4-0 REV<4:0>: Revision ID bits These bits are used to indicate the device revision. REGISTER 24-14: DEVID2: DEVICE ID REGISTER 2 FOR PIC18F1XK50/PIC18LF1XK50 R RRRRRRR DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 bit 7 bit 0 Legend: R = Readable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed C = Clearable only bit bit 7-0 DEV<10:3>: Device ID bits These bits are used with the DEV<2:0> bits in the Device ID Register 1 to identify the part number. 0010 0000 = PIC18F2XK20/4XK20 devices Note 1: These values for DEV<10:3> may be shared with other devices. The specific device is always identified by using the entire DEV<10:0> bit sequence. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 296 Preliminary © 2009 Microchip Technology Inc. 24.2 Watchdog Timer (WDT) For PIC18F1XK50/PIC18LF1XK50 devices, the WDT is driven by the LFINTOSC source. When the WDT is enabled, the clock source is also enabled. The nominal WDT period is 4 ms and has the same stability as the LFINTOSC oscillator. The 4 ms period of the WDT is multiplied by a 16-bit postscaler. Any output of the WDT postscaler is selected by a multiplexer, controlled by bits in Configuration Register 2H. Available periods range from 4 ms to 131.072 seconds (2.18 minutes). The WDT and postscaler are cleared when any of the following events occur: a SLEEP or CLRWDT instruction is executed, the IRCF bits of the OSCCON register are changed or a clock failure has occurred. FIGURE 24-1: WDT BLOCK DIAGRAM Note 1: The CLRWDT and SLEEP instructions clear the WDT and postscaler counts when executed. 2: Changing the setting of the IRCF bits of the OSCCON register clears the WDT and postscaler counts. 3: When a CLRWDT instruction is executed, the postscaler count will be cleared. LFINTOSC Source WDT Wake-up Reset WDT Counter Programmable Postscaler 1:1 to 1:32,768 Enable WDT WDTPS<3:0> SWDTEN WDTEN CLRWDT 4 from Power Reset All Device Resets Sleep ÷128 Change on IRCF bits Managed Modes © 2009 Microchip Technology Inc. Preliminary DS41350C-page 297 PIC18F1XK50/PIC18LF1XK50 24.2.1 CONTROL REGISTER Register 24-15 shows the WDTCON register. This is a readable and writable register which contains a control bit that allows software to override the WDT enable Configuration bit, but only if the Configuration bit has disabled the WDT. TABLE 24-2: SUMMARY OF WATCHDOG TIMER REGISTERS 24.3 Program Verification and Code Protection The overall structure of the code protection on the PIC18 Flash devices differs significantly from other PIC® microcontroller devices. The user program memory is divided into five blocks. One of these is a boot block of 0.5K or 2K bytes, depending on the device. The remainder of the memory is divided into individual blocks on binary boundaries. Each of the five blocks has three code protection bits associated with them. They are: • Code-Protect bit (CPn) • Write-Protect bit (WRTn) • External Block Table Read bit (EBTRn) Figure 24-2 shows the program memory organization for 8, 16 and 32-Kbyte devices and the specific code protection bit associated with each block. The actual locations of the bits are summarized in Table 24-3. REGISTER 24-15: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 — — — — — — — SWDTEN(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-1 Unimplemented: Read as ‘0’ bit 0 SWDTEN: Software Enable or Disable the Watchdog Timer bit(1) 1 = WDT is turned on 0 = WDT is turned off (Reset value) Note 1: This bit has no effect if the Configuration bit, WDTEN, is enabled. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page RCON IPEN SBOREN — RI TO PD POR BOR 272 WDTCON — — — — — — — SWDTEN 280 CONFIG2H WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN 290 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Watchdog Timer. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 298 Preliminary © 2009 Microchip Technology Inc. FIGURE 24-2: CODE-PROTECTED PROGRAM MEMORY FOR PIC18F1XK50/PIC18LF1XK50 Device Address (from/to) 14K50 13K50 BBSIZ = 1 BBSIZ = 0 BBSIZ = 1 BBSIZ = 0 0000h 01FFh Boot Block, 2 KW CPB, WRTB, EBTRB Boot Block, 1 KW CPB, WRTB, EBTRB Boot Block, 1 KW CPB, WRTB, EBTRB Boot Block, 0.512 KW CPB, WRTB, EBTRB 0200h 03FFh Block 0 1.512 KW 0400h CP0, WRT0, EBTR0 05FFh Block 0 3 KW CP0, WRT0, EBTR0 Block 0 1 KW 0600h CP0, WRT0, EBTR0 07FFh 0800h 0FFFh Block 0 2 KW CP0, WRT0, EBTR0 Block 1 2 KW CP1, WRT1, EBTR1 Block 1 2 KW CP1, WRT1, EBTR1 1000h 1FFFh Block 1 4 KW CP1, WRT1, EBTR1 Block 1 4 KW CP1, WRT1, EBTR1 Reads all ‘0’s Reads all ‘0’s 2000h 27FFh Reads all ‘0’s Reads all ‘0’s 2800h 2FFFh 3000h 37FFh 3800h 3FFFh 4000h 47FFh 4800h 4FFFh 5000h 57FFh 5800h 5FFFh 6000h 67FFh 6800h 6FFFh 7000h 77FFh 7800h 7FFFh 8000h FFFFh Note: Refer to the test section for requirements on test memory mapping. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 299 PIC18F1XK50/PIC18LF1XK50 TABLE 24-3: SUMMARY OF CODE PROTECTION REGISTERS 24.3.1 PROGRAM MEMORY CODE PROTECTION The program memory may be read to or written from any location using the table read and table write instructions. The device ID may be read with table reads. The Configuration registers may be read and written with the table read and table write instructions. In normal execution mode, the CPn bits have no direct effect. CPn bits inhibit external reads and writes. A block of user memory may be protected from table writes if the WRTn Configuration bit is ‘0’. The EBTRn bits control table reads. For a block of user memory with the EBTRn bit cleared to ‘0’, a table READ instruction that executes from within that block is allowed to read. A table read instruction that executes from a location outside of that block is not allowed to read and will result in reading ‘0’s. Figures 24-3 through 24-5 illustrate table write and table read protection. FIGURE 24-3: TABLE WRITE (WRTn) DISALLOWED File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 300008h CONFIG5L — — — — — — CP1 CP0 300009h CONFIG5H CPD CPB — — — — — — 30000Ah CONFIG6L — — — — — — WRT1 WRT0 30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 30000Ch CONFIG7L — — — — — — EBTR1 EBTR0 30000Dh CONFIG7H — EBTRB — — — — — — Legend: Shaded cells are unimplemented. Note 1: Unimplemented in PIC18FX3K20 and PIC18FX4K20 devices; maintain this bit set. Note: Code protection bits may only be written to a ‘0’ from a ‘1’ state. It is not possible to write a ‘1’ to a bit in the ‘0’ state. Code protection bits are only set to ‘1’ by a full chip erase or block erase function. The full chip erase and block erase functions can only be initiated via ICSP or an external programmer. 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh WRTB, EBTRB = 11 WRT0, EBTR0 = 01 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLWT* TBLPTR = 0008FFh PC = 001FFEh PC = 005FFEh TBLWT* Register Values Program Memory Configuration Bit Settings Results: All table writes disabled to Blockn whenever WRTn = 0. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 300 Preliminary © 2009 Microchip Technology Inc. FIGURE 24-4: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED FIGURE 24-5: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED WRTB, EBTRB = 11 WRT0, EBTR0 = 10 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLRD* TBLPTR = 0008FFh PC = 003FFEh Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0. TABLAT register returns a value of ‘0’. Register Values Program Memory Configuration Bit Settings 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh WRTB, EBTRB = 11 WRT0, EBTR0 = 10 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLRD* TBLPTR = 0008FFh PC = 001FFEh Register Values Program Memory Configuration Bit Settings Results: Table reads permitted within Blockn, even when EBTRBn = 0. TABLAT register returns the value of the data at the location TBLPTR. 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh © 2009 Microchip Technology Inc. Preliminary DS41350C-page 301 PIC18F1XK50/PIC18LF1XK50 24.3.2 DATA EEPROM CODE PROTECTION The entire data EEPROM is protected from external reads and writes by two bits: CPD and WRTD. CPD inhibits external reads and writes of data EEPROM. WRTD inhibits internal and external writes to data EEPROM. The CPU can always read data EEPROM under normal operation, regardless of the protection bit settings. 24.3.3 CONFIGURATION REGISTER PROTECTION The Configuration registers can be write-protected. The WRTC bit controls protection of the Configuration registers. In normal execution mode, the WRTC bit is readable only. WRTC can only be written via ICSP or an external programmer. 24.4 ID Locations Eight memory locations (200000h-200007h) are designated as ID locations, where the user can store checksum or other code identification numbers. These locations are both readable and writable during normal execution through the TBLRD and TBLWT instructions or during program/verify. The ID locations can be read when the device is code-protected. 24.5 In-Circuit Serial Programming PIC18F1XK50/PIC18LF1XK50 devices can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. 24.6 In-Circuit Debugger When the DEBUG Configuration bit is programmed to a ‘0’, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB® IDE. When the microcontroller has this feature enabled, some resources are not available for general use. Table 24-4 shows which resources are required by the background debugger. TABLE 24-4: DEBUGGER RESOURCES To use the In-Circuit Debugger function of the microcontroller, the design must implement In-Circuit Serial Programming connections to the following pins: • MCLR/VPP/RE3 • VDD • VSS • RB7 • RB6 This will interface to the In-Circuit Debugger module available from Microchip or one of the third party development tool companies. 24.7 Single-Supply ICSP Programming The LVP Configuration bit enables Single-Supply ICSP Programming (formerly known as Low-Voltage ICSP Programming or LVP). When Single-Supply Programming is enabled, the microcontroller can be programmed without requiring high voltage being applied to the MCLR/VPP/RE3 pin, but the RB5/KBI1/PGM pin is then dedicated to controlling Program mode entry and is not available as a general purpose I/O pin. While programming, using Single-Supply Programming mode, VDD is applied to the MCLR/VPP/RE3 pin as in normal execution mode. To enter Programming mode, VDD is applied to the PGM pin. If Single-Supply ICSP Programming mode will not be used, the LVP bit can be cleared. RB5/KBI1/PGM then becomes available as the digital I/O pin, RB5. The LVP bit may be set or cleared only when using standard high-voltage programming (VIHH applied to the MCLR/ VPP/RE3 pin). Once LVP has been disabled, only the standard high-voltage programming is available and must be used to program the device. Memory that is not code-protected can be erased using either a block erase, or erased row by row, then written at any specified VDD. If code-protected memory is to be erased, a block erase is required. I/O pins: RB6, RB7 Stack: 2 levels Program Memory: 512 bytes Data Memory: 10 bytes Note 1: High-voltage programming is always available, regardless of the state of the LVP bit or the PGM pin, by applying VIHH to the MCLR pin. 2: By default, Single-Supply ICSP is enabled in unprogrammed devices (as supplied from Microchip) and erased devices. 3: When Single-Supply Programming is enabled, the RB5 pin can no longer be used as a general purpose I/O pin. 4: When LVP is enabled, externally pull the PGM pin to VSS to allow normal program execution. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 302 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 303 PIC18F1XK50/PIC18LF1XK50 25.0 INSTRUCTION SET SUMMARY PIC18F1XK50/PIC18LF1XK50 devices incorporate the standard set of 75 PIC18 core instructions, as well as an extended set of 8 new instructions, for the optimization of code that is recursive or that utilizes a software stack. The extended set is discussed later in this section. 25.1 Standard Instruction Set The standard PIC18 instruction set adds many enhancements to the previous PIC® MCU instruction sets, while maintaining an easy migration from these PIC® MCU instruction sets. Most instructions are a single program memory word (16 bits), but there are four instructions that require two program memory locations. Each single-word instruction is a 16-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into four basic categories: • Byte-oriented operations • Bit-oriented operations • Literal operations • Control operations The PIC18 instruction set summary in Table 25-2 lists byte-oriented, bit-oriented, literal and control operations. Table 25-1 shows the opcode field descriptions. Most byte-oriented instructions have three operands: 1. The file register (specified by ‘f’) 2. The destination of the result (specified by ‘d’) 3. The accessed memory (specified by ‘a’) The file register designator ‘f’ specifies which file register is to be used by the instruction. The destination designator ‘d’ specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the WREG register. If ‘d’ is one, the result is placed in the file register specified in the instruction. All bit-oriented instructions have three operands: 1. The file register (specified by ‘f’) 2. The bit in the file register (specified by ‘b’) 3. The accessed memory (specified by ‘a’) The bit field designator ‘b’ selects the number of the bit affected by the operation, while the file register designator ‘f’ represents the number of the file in which the bit is located. The literal instructions may use some of the following operands: • A literal value to be loaded into a file register (specified by ‘k’) • The desired FSR register to load the literal value into (specified by ‘f’) • No operand required (specified by ‘—’) The control instructions may use some of the following operands: • A program memory address (specified by ‘n’) • The mode of the CALL or RETURN instructions (specified by ‘s’) • The mode of the table read and table write instructions (specified by ‘m’) • No operand required (specified by ‘—’) All instructions are a single word, except for four double-word instructions. These instructions were made double-word to contain the required information in 32 bits. In the second word, the 4 MSbs are ‘1’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. All single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles, with the additional instruction cycle(s) executed as a NOP. The double-word instructions execute in two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 μs. If a conditional test is true, or the program counter is changed as a result of an instruction, the instruction execution time is 2 μs. Two-word branch instructions (if true) would take 3 μs. Figure 25-1 shows the general formats that the instructions can have. All examples use the convention ‘nnh’ to represent a hexadecimal number. The Instruction Set Summary, shown in Table 25-2, lists the standard instructions recognized by the Microchip Assembler (MPASMTM). Section 25.1.1 “Standard Instruction Set” provides a description of each instruction. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 304 Preliminary © 2009 Microchip Technology Inc. TABLE 25-1: OPCODE FIELD DESCRIPTIONS Field Description a RAM access bit a = 0: RAM location in Access RAM (BSR register is ignored) a = 1: RAM bank is specified by BSR register bbb Bit address within an 8-bit file register (0 to 7). BSR Bank Select Register. Used to select the current RAM bank. C, DC, Z, OV, N ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative. d Destination select bit d = 0: store result in WREG d = 1: store result in file register f dest Destination: either the WREG register or the specified register file location. f 8-bit Register file address (00h to FFh) or 2-bit FSR designator (0h to 3h). fs 12-bit Register file address (000h to FFFh). This is the source address. fd 12-bit Register file address (000h to FFFh). This is the destination address. GIE Global Interrupt Enable bit. k Literal field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value). label Label name. mm The mode of the TBLPTR register for the table read and table write instructions. Only used with table read and table write instructions: * No change to register (such as TBLPTR with table reads and writes) *+ Post-Increment register (such as TBLPTR with table reads and writes) *- Post-Decrement register (such as TBLPTR with table reads and writes) +* Pre-Increment register (such as TBLPTR with table reads and writes) n The relative address (2’s complement number) for relative branch instructions or the direct address for CALL/BRANCH and RETURN instructions. PC Program Counter. PCL Program Counter Low Byte. PCH Program Counter High Byte. PCLATH Program Counter High Byte Latch. PCLATU Program Counter Upper Byte Latch. PD Power-down bit. PRODH Product of Multiply High Byte. PRODL Product of Multiply Low Byte. s Fast Call/Return mode select bit s = 0: do not update into/from shadow registers s = 1: certain registers loaded into/from shadow registers (Fast mode) TBLPTR 21-bit Table Pointer (points to a Program Memory location). TABLAT 8-bit Table Latch. TO Time-out bit. TOS Top-of-Stack. u Unused or unchanged. WDT Watchdog Timer. WREG Working register (accumulator). x Don’t care (‘0’ or ‘1’). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. zs 7-bit offset value for indirect addressing of register files (source). zd 7-bit offset value for indirect addressing of register files (destination). { } Optional argument. [text] Indicates an indexed address. (text) The contents of text. [expr] Specifies bit n of the register indicated by the pointer expr. → Assigned to. < > Register bit field. ∈ In the set of. italics User defined term (font is Courier). © 2009 Microchip Technology Inc. Preliminary DS41350C-page 305 PIC18F1XK50/PIC18LF1XK50 FIGURE 25-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 15 10 9 8 7 0 d = 0 for result destination to be WREG register OPCODE d a f (FILE #) d = 1 for result destination to be file register (f) a = 0 to force Access Bank Bit-oriented file register operations 15 12 11 9 8 7 0 OPCODE b (BIT #) a f (FILE #) b = 3-bit position of bit in file register (f) Literal operations 15 8 7 0 OPCODE k (literal) k = 8-bit immediate value Byte to Byte move operations (2-word) 15 12 11 0 OPCODE f (Source FILE #) CALL, GOTO and Branch operations 15 8 7 0 OPCODE n<7:0> (literal) n = 20-bit immediate value a = 1 for BSR to select bank f = 8-bit file register address a = 0 to force Access Bank a = 1 for BSR to select bank f = 8-bit file register address 15 12 11 0 1111 n<19:8> (literal) 15 12 11 0 1111 f (Destination FILE #) f = 12-bit file register address Control operations Example Instruction ADDWF MYREG, W, B MOVFF MYREG1, MYREG2 BSF MYREG, bit, B MOVLW 7Fh GOTO Label 15 8 7 0 OPCODE n<7:0> (literal) 15 12 11 0 1111 n<19:8> (literal) CALL MYFUNC 15 11 10 0 OPCODE n<10:0> (literal) S = Fast bit BRA MYFUNC 15 8 7 0 OPCODE n<7:0> (literal) BC MYFUNC S PIC18F1XK50/PIC18LF1XK50 DS41350C-page 306 Preliminary © 2009 Microchip Technology Inc. TABLE 25-2: PIC18FXXXX INSTRUCTION SET Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb BYTE-ORIENTED OPERATIONS ADDWF ADDWFC ANDWF CLRF COMF CPFSEQ CPFSGT CPFSLT DECF DECFSZ DCFSNZ INCF INCFSZ INFSNZ IORWF MOVF MOVFF MOVWF MULWF NEGF RLCF RLNCF RRCF RRNCF SETF SUBFWB SUBWF SUBWFB SWAPF TSTFSZ XORWF f, d, a f, d, a f, d, a f, a f, d, a f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a fs, fd f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a Add WREG and f Add WREG and CARRY bit to f AND WREG with f Clear f Complement f Compare f with WREG, skip = Compare f with WREG, skip > Compare f with WREG, skip < Decrement f Decrement f, Skip if 0 Decrement f, Skip if Not 0 Increment f Increment f, Skip if 0 Increment f, Skip if Not 0 Inclusive OR WREG with f Move f Move fs (source) to 1st word fd (destination) 2nd word Move WREG to f Multiply WREG with f Negate f Rotate Left f through Carry Rotate Left f (No Carry) Rotate Right f through Carry Rotate Right f (No Carry) Set f Subtract f from WREG with borrow Subtract WREG from f Subtract WREG from f with borrow Swap nibbles in f Test f, skip if 0 Exclusive OR WREG with f 1 1 1 1 1 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 (2 or 3) 1 0010 0010 0001 0110 0001 0110 0110 0110 0000 0010 0100 0010 0011 0100 0001 0101 1100 1111 0110 0000 0110 0011 0100 0011 0100 0110 0101 0101 0101 0011 0110 0001 01da0 0da 01da 101a 11da 001a 010a 000a 01da 11da 11da 10da 11da 10da 00da 00da ffff ffff 111a 001a 110a 01da 01da 00da 00da 100a 01da 11da 10da 10da 011a 10da ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z, OV, N C, DC, Z, OV, N Z, N Z Z, N None None None C, DC, Z, OV, N None None C, DC, Z, OV, N None None Z, N Z, N None None None C, DC, Z, OV, N C, Z, N Z, N C, Z, N Z, N None C, DC, Z, OV, N C, DC, Z, OV, N C, DC, Z, OV, N None None Z, N 1, 2 1, 2 1,2 2 1, 2 4 4 1, 2 1, 2, 3, 4 1, 2, 3, 4 1, 2 1, 2, 3, 4 4 1, 2 1, 2 1 1, 2 1, 2 1, 2 1, 2 4 1, 2 Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 307 PIC18F1XK50/PIC18LF1XK50 BIT-ORIENTED OPERATIONS BCF BSF BTFSC BTFSS BTG f, b, a f, b, a f, b, a f, b, a f, d, a Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set Bit Toggle f 1 1 1 (2 or 3) 1 (2 or 3) 1 1001 1000 1011 1010 0111 bbba bbba bbba bbba bbba ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff None None None None None 1, 2 1, 2 3, 4 3, 4 1, 2 CONTROL OPERATIONS BC BN BNC BNN BNOV BNZ BOV BRA BZ CALL CLRWDT DAW GOTO NOP NOP POP PUSH RCALL RESET RETFIE RETLW RETURN SLEEP n n n n n n n n n n, s — — n — — — — n s k s — Branch if Carry Branch if Negative Branch if Not Carry Branch if Not Negative Branch if Not Overflow Branch if Not Zero Branch if Overflow Branch Unconditionally Branch if Zero Call subroutine 1st word 2nd word Clear Watchdog Timer Decimal Adjust WREG Go to address 1st word 2nd word No Operation No Operation Pop top of return stack (TOS) Push top of return stack (TOS) Relative Call Software device Reset Return from interrupt enable Return with literal in WREG Return from Subroutine Go into Standby mode 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 2 1 (2) 2 1 1 2 1 1 1 1 2 1 2 2 2 1 1110 1110 1110 1110 1110 1110 1110 1101 1110 1110 1111 0000 0000 1110 1111 0000 1111 0000 0000 1101 0000 0000 0000 0000 0000 0010 0110 0011 0111 0101 0001 0100 0nnn 0000 110s kkkk 0000 0000 1111 kkkk 0000 xxxx 0000 0000 1nnn 0000 0000 1100 0000 0000 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0000 0000 kkkk kkkk 0000 xxxx 0000 0000 nnnn 1111 0001 kkkk 0001 0000 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0100 0111 kkkk kkkk 0000 xxxx 0110 0101 nnnn 1111 000s kkkk 001s 0011 None None None None None None None None None None TO, PD C None None None None None None All GIE/GIEH, PEIE/GIEL None None TO, PD 4 TABLE 25-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 308 Preliminary © 2009 Microchip Technology Inc. LITERAL OPERATIONS ADDLW ANDLW IORLW LFSR MOVLB MOVLW MULLW RETLW SUBLW XORLW k k k f, k k k k k k k Add literal and WREG AND literal with WREG Inclusive OR literal with WREG Move literal (12-bit) 2nd word to FSR(f) 1st word Move literal to BSR<3:0> Move literal to WREG Multiply literal with WREG Return with literal in WREG Subtract WREG from literal Exclusive OR literal with WREG 1 1 1 2 1 1 1 2 1 1 0000 0000 0000 1110 1111 0000 0000 0000 0000 0000 0000 1111 1011 1001 1110 0000 0001 1110 1101 1100 1000 1010 kkkk kkkk kkkk 00ff kkkk 0000 kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z, OV, N Z, N Z, N None None None None None C, DC, Z, OV, N Z, N DATA MEMORY ↔ PROGRAM MEMORY OPERATIONS TBLRD* TBLRD*+ TBLRD*- TBLRD+* TBLWT* TBLWT*+ TBLWT*- TBLWT+* Table Read Table Read with post-increment Table Read with post-decrement Table Read with pre-increment Table Write Table Write with post-increment Table Write with post-decrement Table Write with pre-increment 2 2 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1000 1001 1010 1011 1100 1101 1110 1111 None None None None None None None None TABLE 25-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 309 PIC18F1XK50/PIC18LF1XK50 25.1.1 STANDARD INSTRUCTION SET ADDLW ADD literal to W Syntax: ADDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) + k → W Status Affected: N, OV, C, DC, Z Encoding: 0000 1111 kkkk kkkk Description: The contents of W are added to the 8-bit literal ‘k’ and the result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: ADDLW 15h Before Instruction W = 10h After Instruction W = 25h ADDWF ADD W to f Syntax: ADDWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) + (f) → dest Status Affected: N, OV, C, DC, Z Encoding: 0010 01da ffff ffff Description: Add W to register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ADDWF REG, 0, 0 Before Instruction W = 17h REG = 0C2h After Instruction W = 0D9h REG = 0C2h Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s). PIC18F1XK50/PIC18LF1XK50 DS41350C-page 310 Preliminary © 2009 Microchip Technology Inc. ADDWFC ADD W and CARRY bit to f Syntax: ADDWFC f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) + (f) + (C) → dest Status Affected: N,OV, C, DC, Z Encoding: 0010 00da ffff ffff Description: Add W, the CARRY flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ADDWFC REG, 0, 1 Before Instruction CARRY bit = 1 REG = 02h W = 4Dh After Instruction CARRY bit = 0 REG = 02h W = 50h ANDLW AND literal with W Syntax: ANDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .AND. k → W Status Affected: N, Z Encoding: 0000 1011 kkkk kkkk Description: The contents of W are AND’ed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: ANDLW 05Fh Before Instruction W = A3h After Instruction W = 03h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 311 PIC18F1XK50/PIC18LF1XK50 ANDWF AND W with f Syntax: ANDWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .AND. (f) → dest Status Affected: N, Z Encoding: 0001 01da ffff ffff Description: The contents of W are AND’ed with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ANDWF REG, 0, 0 Before Instruction W = 17h REG = C2h After Instruction W = 02h REG = C2h BC Branch if Carry Syntax: BC n Operands: -128 ≤ n ≤ 127 Operation: if CARRY bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0010 nnnn nnnn Description: If the CARRY bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BC 5 Before Instruction PC = address (HERE) After Instruction If CARRY = 1; PC = address (HERE + 12) If CARRY = 0; PC = address (HERE + 2) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 312 Preliminary © 2009 Microchip Technology Inc. BCF Bit Clear f Syntax: BCF f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: 0 → f Status Affected: None Encoding: 1001 bbba ffff ffff Description: Bit ‘b’ in register ‘f’ is cleared. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BCF FLAG_REG, 7, 0 Before Instruction FLAG_REG = C7h After Instruction FLAG_REG = 47h BN Branch if Negative Syntax: BN n Operands: -128 ≤ n ≤ 127 Operation: if NEGATIVE bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0110 nnnn nnnn Description: If the NEGATIVE bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BN Jump Before Instruction PC = address (HERE) After Instruction If NEGATIVE = 1; PC = address (Jump) If NEGATIVE = 0; PC = address (HERE + 2) © 2009 Microchip Technology Inc. Preliminary DS41350C-page 313 PIC18F1XK50/PIC18LF1XK50 BNC Branch if Not Carry Syntax: BNC n Operands: -128 ≤ n ≤ 127 Operation: if CARRY bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0011 nnnn nnnn Description: If the CARRY bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNC Jump Before Instruction PC = address (HERE) After Instruction If CARRY = 0; PC = address (Jump) If CARRY = 1; PC = address (HERE + 2) BNN Branch if Not Negative Syntax: BNN n Operands: -128 ≤ n ≤ 127 Operation: if NEGATIVE bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0111 nnnn nnnn Description: If the NEGATIVE bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNN Jump Before Instruction PC = address (HERE) After Instruction If NEGATIVE = 0; PC = address (Jump) If NEGATIVE = 1; PC = address (HERE + 2) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 314 Preliminary © 2009 Microchip Technology Inc. BNOV Branch if Not Overflow Syntax: BNOV n Operands: -128 ≤ n ≤ 127 Operation: if OVERFLOW bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0101 nnnn nnnn Description: If the OVERFLOW bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNOV Jump Before Instruction PC = address (HERE) After Instruction If OVERFLOW = 0; PC = address (Jump) If OVERFLOW = 1; PC = address (HERE + 2) BNZ Branch if Not Zero Syntax: BNZ n Operands: -128 ≤ n ≤ 127 Operation: if ZERO bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0001 nnnn nnnn Description: If the ZERO bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNZ Jump Before Instruction PC = address (HERE) After Instruction If ZERO = 0; PC = address (Jump) If ZERO = 1; PC = address (HERE + 2) © 2009 Microchip Technology Inc. Preliminary DS41350C-page 315 PIC18F1XK50/PIC18LF1XK50 BRA Unconditional Branch Syntax: BRA n Operands: -1024 ≤ n ≤ 1023 Operation: (PC) + 2 + 2n → PC Status Affected: None Encoding: 1101 0nnn nnnn nnnn Description: Add the 2’s complement number ‘2n’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation Example: HERE BRA Jump Before Instruction PC = address (HERE) After Instruction PC = address (Jump) BSF Bit Set f Syntax: BSF f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: 1 → f Status Affected: None Encoding: 1000 bbba ffff ffff Description: Bit ‘b’ in register ‘f’ is set. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BSF FLAG_REG, 7, 1 Before Instruction FLAG_REG = 0Ah After Instruction FLAG_REG = 8Ah PIC18F1XK50/PIC18LF1XK50 DS41350C-page 316 Preliminary © 2009 Microchip Technology Inc. BTFSC Bit Test File, Skip if Clear Syntax: BTFSC f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: skip if (f) = 0 Status Affected: None Encoding: 1011 bbba ffff ffff Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next instruction is skipped. If bit ‘b’ is ‘0’, then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE FALSE TRUE BTFSC : : FLAG, 1, 0 Before Instruction PC = address (HERE) After Instruction If FLAG<1> = 0; PC = address (TRUE) If FLAG<1> = 1; PC = address (FALSE) BTFSS Bit Test File, Skip if Set Syntax: BTFSS f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b < 7 a ∈ [0,1] Operation: skip if (f) = 1 Status Affected: None Encoding: 1010 bbba ffff ffff Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next instruction is skipped. If bit ‘b’ is ‘1’, then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE FALSE TRUE BTFSS : : FLAG, 1, 0 Before Instruction PC = address (HERE) After Instruction If FLAG<1> = 0; PC = address (FALSE) If FLAG<1> = 1; PC = address (TRUE) © 2009 Microchip Technology Inc. Preliminary DS41350C-page 317 PIC18F1XK50/PIC18LF1XK50 BTG Bit Toggle f Syntax: BTG f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b < 7 a ∈ [0,1] Operation: (f) → f Status Affected: None Encoding: 0111 bbba ffff ffff Description: Bit ‘b’ in data memory location ‘f’ is inverted. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BTG PORTC, 4, 0 Before Instruction: PORTC = 0111 0101 [75h] After Instruction: PORTC = 0110 0101 [65h] BOV Branch if Overflow Syntax: BOV n Operands: -128 ≤ n ≤ 127 Operation: if OVERFLOW bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0100 nnnn nnnn Description: If the OVERFLOW bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BOV Jump Before Instruction PC = address (HERE) After Instruction If OVERFLOW = 1; PC = address (Jump) If OVERFLOW = 0; PC = address (HERE + 2) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 318 Preliminary © 2009 Microchip Technology Inc. BZ Branch if Zero Syntax: BZ n Operands: -128 ≤ n ≤ 127 Operation: if ZERO bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0000 nnnn nnnn Description: If the ZERO bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BZ Jump Before Instruction PC = address (HERE) After Instruction If ZERO = 1; PC = address (Jump) If ZERO = 0; PC = address (HERE + 2) CALL Subroutine Call Syntax: CALL k {,s} Operands: 0 ≤ k ≤ 1048575 s ∈ [0,1] Operation: (PC) + 4 → TOS, k → PC<20:1>, if s = 1 (W) → WS, (Status) → STATUSS, (BSR) → BSRS Status Affected: None Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) 1110 1111 110s k19kkk k7kkk kkkk kkkk0 kkkk8 Description: Subroutine call of entire 2-Mbyte memory range. First, return address (PC + 4) is pushed onto the return stack. If ‘s’ = 1, the W, Status and BSR registers are also pushed into their respective shadow registers, WS, STATUSS and BSRS. If ‘s’ = 0, no update occurs (default). Then, the 20-bit value ‘k’ is loaded into PC<20:1>. CALL is a two-cycle instruction. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’<7:0>, PUSH PC to stack Read literal ‘k’<19:8>, Write to PC No operation No operation No operation No operation Example: HERE CALL THERE, 1 Before Instruction PC = address (HERE) After Instruction PC = address (THERE) TOS = address (HERE + 4) WS = W BSRS = BSR STATUSS = Status © 2009 Microchip Technology Inc. Preliminary DS41350C-page 319 PIC18F1XK50/PIC18LF1XK50 CLRF Clear f Syntax: CLRF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: 000h → f 1 → Z Status Affected: Z Encoding: 0110 101a ffff ffff Description: Clears the contents of the specified register. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: CLRF FLAG_REG, 1 Before Instruction FLAG_REG = 5Ah After Instruction FLAG_REG = 00h CLRWDT Clear Watchdog Timer Syntax: CLRWDT Operands: None Operation: 000h → WDT, 000h → WDT postscaler, 1 → TO, 1 → PD Status Affected: TO, PD Encoding: 0000 0000 0000 0100 Description: CLRWDT instruction resets the Watchdog Timer. It also resets the postscaler of the WDT. Status bits, TO and PD, are set. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data No operation Example: CLRWDT Before Instruction WDT Counter = ? After Instruction WDT Counter = 00h WDT Postscaler = 0 TO = 1 PD = 1 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 320 Preliminary © 2009 Microchip Technology Inc. COMF Complement f Syntax: COMF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest Status Affected: N, Z Encoding: 0001 11da ffff ffff Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: COMF REG, 0, 0 Before Instruction REG = 13h After Instruction REG = 13h W = ECh CPFSEQ Compare f with W, skip if f = W Syntax: CPFSEQ f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) = (W) (unsigned comparison) Status Affected: None Encoding: 0110 001a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of W by performing an unsigned subtraction. If ‘f’ = W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSEQ REG, 0 NEQUAL : EQUAL : Before Instruction PC Address = HERE W =? REG = ? After Instruction If REG = W; PC = Address (EQUAL) If REG ≠ W; PC = Address (NEQUAL) © 2009 Microchip Technology Inc. Preliminary DS41350C-page 321 PIC18F1XK50/PIC18LF1XK50 CPFSGT Compare f with W, skip if f > W Syntax: CPFSGT f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) > (W) (unsigned comparison) Status Affected: None Encoding: 0110 010a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of the W by performing an unsigned subtraction. If the contents of ‘f’ are greater than the contents of WREG, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSGT REG, 0 NGREATER : GREATER : Before Instruction PC = Address (HERE) W = ? After Instruction If REG > W; PC = Address (GREATER) If REG ≤ W; PC = Address (NGREATER) CPFSLT Compare f with W, skip if f < W Syntax: CPFSLT f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) < (W) (unsigned comparison) Status Affected: None Encoding: 0110 000a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of W by performing an unsigned subtraction. If the contents of ‘f’ are less than the contents of W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSLT REG, 1 NLESS : LESS : Before Instruction PC = Address (HERE) W = ? After Instruction If REG < W; PC = Address (LESS) If REG ≥ W; PC = Address (NLESS) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 322 Preliminary © 2009 Microchip Technology Inc. DAW Decimal Adjust W Register Syntax: DAW Operands: None Operation: If [W<3:0> > 9] or [DC = 1] then (W<3:0>) + 6 → W<3:0>; else (W<3:0>) → W<3:0>; If [W<7:4> + DC > 9] or [C = 1] then (W<7:4>) + 6 + DC → W<7:4> ; else (W<7:4>) + DC → W<7:4> Status Affected: C Encoding: 0000 0000 0000 0111 Description: DAW adjusts the eight-bit value in W, resulting from the earlier addition of two variables (each in packed BCD format) and produces a correct packed BCD result. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register W Process Data Write W Example1: DAW Before Instruction W = A5h C =0 DC = 0 After Instruction W = 05h C =1 DC = 0 Example 2: Before Instruction W = CEh C =0 DC = 0 After Instruction W = 34h C =1 DC = 0 DECF Decrement f Syntax: DECF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest Status Affected: C, DC, N, OV, Z Encoding: 0000 01da ffff ffff Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: DECF CNT, 1, 0 Before Instruction CNT = 01h Z =0 After Instruction CNT = 00h Z =1 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 323 PIC18F1XK50/PIC18LF1XK50 DECFSZ Decrement f, skip if 0 Syntax: DECFSZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest, skip if result = 0 Status Affected: None Encoding: 0010 11da ffff ffff Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE DECFSZ CNT, 1, 1 GOTO LOOP CONTINUE Before Instruction PC = Address (HERE) After Instruction CNT = CNT - 1 If CNT = 0; PC = Address (CONTINUE) If CNT ≠ 0; PC = Address (HERE + 2) DCFSNZ Decrement f, skip if not 0 Syntax: DCFSNZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest, skip if result ≠ 0 Status Affected: None Encoding: 0100 11da ffff ffff Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE DCFSNZ TEMP, 1, 0 ZERO : NZERO : Before Instruction TEMP = ? After Instruction TEMP = TEMP – 1, If TEMP = 0; PC = Address (ZERO) If TEMP ≠ 0; PC = Address (NZERO) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 324 Preliminary © 2009 Microchip Technology Inc. GOTO Unconditional Branch Syntax: GOTO k Operands: 0 ≤ k ≤ 1048575 Operation: k → PC<20:1> Status Affected: None Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) 1110 1111 1111 k19kkk k7kkk kkkk kkkk0 kkkk8 Description: GOTO allows an unconditional branch anywhere within entire 2-Mbyte memory range. The 20-bit value ‘k’ is loaded into PC<20:1>. GOTO is always a two-cycle instruction. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’<7:0>, No operation Read literal ‘k’<19:8>, Write to PC No operation No operation No operation No operation Example: GOTO THERE After Instruction PC = Address (THERE) INCF Increment f Syntax: INCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest Status Affected: C, DC, N, OV, Z Encoding: 0010 10da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: INCF CNT, 1, 0 Before Instruction CNT = FFh Z =0 C =? DC = ? After Instruction CNT = 00h Z =1 C =1 DC = 1 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 325 PIC18F1XK50/PIC18LF1XK50 INCFSZ Increment f, skip if 0 Syntax: INCFSZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest, skip if result = 0 Status Affected: None Encoding: 0011 11da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE INCFSZ CNT, 1, 0 NZERO : ZERO : Before Instruction PC = Address (HERE) After Instruction CNT = CNT + 1 If CNT = 0; PC = Address (ZERO) If CNT ≠ 0; PC = Address (NZERO) INFSNZ Increment f, skip if not 0 Syntax: INFSNZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest, skip if result ≠ 0 Status Affected: None Encoding: 0100 10da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE INFSNZ REG, 1, 0 ZERO NZERO Before Instruction PC = Address (HERE) After Instruction REG = REG + 1 If REG ≠ 0; PC = Address (NZERO) If REG = 0; PC = Address (ZERO) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 326 Preliminary © 2009 Microchip Technology Inc. IORLW Inclusive OR literal with W Syntax: IORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .OR. k → W Status Affected: N, Z Encoding: 0000 1001 kkkk kkkk Description: The contents of W are ORed with the eight-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: IORLW 35h Before Instruction W = 9Ah After Instruction W = BFh IORWF Inclusive OR W with f Syntax: IORWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .OR. (f) → dest Status Affected: N, Z Encoding: 0001 00da ffff ffff Description: Inclusive OR W with register ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: IORWF RESULT, 0, 1 Before Instruction RESULT = 13h W = 91h After Instruction RESULT = 13h W = 93h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 327 PIC18F1XK50/PIC18LF1XK50 LFSR Load FSR Syntax: LFSR f, k Operands: 0 ≤ f ≤ 2 0 ≤ k ≤ 4095 Operation: k → FSRf Status Affected: None Encoding: 1110 1111 1110 0000 00ff k7kkk k11kkk kkkk Description: The 12-bit literal ‘k’ is loaded into the File Select Register pointed to by ‘f’. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ MSB Process Data Write literal ‘k’ MSB to FSRfH Decode Read literal ‘k’ LSB Process Data Write literal ‘k’ to FSRfL Example: LFSR 2, 3ABh After Instruction FSR2H = 03h FSR2L = ABh MOVF Move f Syntax: MOVF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: f → dest Status Affected: N, Z Encoding: 0101 00da ffff ffff Description: The contents of register ‘f’ are moved to a destination dependent upon the status of ‘d’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write W Example: MOVF REG, 0, 0 Before Instruction REG = 22h W = FFh After Instruction REG = 22h W = 22h PIC18F1XK50/PIC18LF1XK50 DS41350C-page 328 Preliminary © 2009 Microchip Technology Inc. MOVFF Move f to f Syntax: MOVFF fs,fd Operands: 0 ≤ fs ≤ 4095 0 ≤ fd ≤ 4095 Operation: (fs) → fd Status Affected: None Encoding: 1st word (source) 2nd word (destin.) 1100 1111 ffff ffff ffff ffff ffffs ffffd Description: The contents of source register ‘fs’ are moved to destination register ‘fd’. Location of source ‘fs’ can be anywhere in the 4096-byte data space (000h to FFFh) and location of destination ‘fd’ can also be anywhere from 000h to FFFh. Either source or destination can be W (a useful special situation). MOVFF is particularly useful for transferring a data memory location to a peripheral register (such as the transmit buffer or an I/O port). The MOVFF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. Words: 2 Cycles: 2 (3) Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ (src) Process Data No operation Decode No operation No dummy read No operation Write register ‘f’ (dest) Example: MOVFF REG1, REG2 Before Instruction REG1 = 33h REG2 = 11h After Instruction REG1 = 33h REG2 = 33h MOVLB Move literal to low nibble in BSR Syntax: MOVLW k Operands: 0 ≤ k ≤ 255 Operation: k → BSR Status Affected: None Encoding: 0000 0001 kkkk kkkk Description: The eight-bit literal ‘k’ is loaded into the Bank Select Register (BSR). The value of BSR<7:4> always remains ‘0’, regardless of the value of k7:k4. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write literal ‘k’ to BSR Example: MOVLB 5 Before Instruction BSR Register = 02h After Instruction BSR Register = 05h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 329 PIC18F1XK50/PIC18LF1XK50 MOVLW Move literal to W Syntax: MOVLW k Operands: 0 ≤ k ≤ 255 Operation: k → W Status Affected: None Encoding: 0000 1110 kkkk kkkk Description: The eight-bit literal ‘k’ is loaded into W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: MOVLW 5Ah After Instruction W = 5Ah MOVWF Move W to f Syntax: MOVWF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (W) → f Status Affected: None Encoding: 0110 111a ffff ffff Description: Move data from W to register ‘f’. Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: MOVWF REG, 0 Before Instruction W = 4Fh REG = FFh After Instruction W = 4Fh REG = 4Fh PIC18F1XK50/PIC18LF1XK50 DS41350C-page 330 Preliminary © 2009 Microchip Technology Inc. MULLW Multiply literal with W Syntax: MULLW k Operands: 0 ≤ k ≤ 255 Operation: (W) x k → PRODH:PRODL Status Affected: None Encoding: 0000 1101 kkkk kkkk Description: An unsigned multiplication is carried out between the contents of W and the 8-bit literal ‘k’. The 16-bit result is placed in the PRODH:PRODL register pair. PRODH contains the high byte. W is unchanged. None of the Status flags are affected. Note that neither overflow nor carry is possible in this operation. A zero result is possible but not detected. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write registers PRODH: PRODL Example: MULLW 0C4h Before Instruction W = E2h PRODH = ? PRODL = ? After Instruction W = E2h PRODH = ADh PRODL = 08h MULWF Multiply W with f Syntax: MULWF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (W) x (f) → PRODH:PRODL Status Affected: None Encoding: 0000 001a ffff ffff Description: An unsigned multiplication is carried out between the contents of W and the register file location ‘f’. The 16-bit result is stored in the PRODH:PRODL register pair. PRODH contains the high byte. Both W and ‘f’ are unchanged. None of the Status flags are affected. Note that neither overflow nor carry is possible in this operation. A zero result is possible but not detected. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write registers PRODH: PRODL Example: MULWF REG, 1 Before Instruction W = C4h REG = B5h PRODH = ? PRODL = ? After Instruction W = C4h REG = B5h PRODH = 8Ah PRODL = 94h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 331 PIC18F1XK50/PIC18LF1XK50 NEGF Negate f Syntax: NEGF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: ( f ) + 1 → f Status Affected: N, OV, C, DC, Z Encoding: 0110 110a ffff ffff Description: Location ‘f’ is negated using two’s complement. The result is placed in the data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: NEGF REG, 1 Before Instruction REG = 0011 1010 [3Ah] After Instruction REG = 1100 0110 [C6h] NOP No Operation Syntax: NOP Operands: None Operation: No operation Status Affected: None Encoding: 0000 1111 0000 xxxx 0000 xxxx 0000 xxxx Description: No operation. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation Example: None. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 332 Preliminary © 2009 Microchip Technology Inc. POP Pop Top of Return Stack Syntax: POP Operands: None Operation: (TOS) → bit bucket Status Affected: None Encoding: 0000 0000 0000 0110 Description: The TOS value is pulled off the return stack and is discarded. The TOS value then becomes the previous value that was pushed onto the return stack. This instruction is provided to enable the user to properly manage the return stack to incorporate a software stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation POP TOS value No operation Example: POP GOTO NEW Before Instruction TOS = 0031A2h Stack (1 level down) = 014332h After Instruction TOS = 014332h PC = NEW PUSH Push Top of Return Stack Syntax: PUSH Operands: None Operation: (PC + 2) → TOS Status Affected: None Encoding: 0000 0000 0000 0101 Description: The PC + 2 is pushed onto the top of the return stack. The previous TOS value is pushed down on the stack. This instruction allows implementing a software stack by modifying TOS and then pushing it onto the return stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode PUSH PC + 2 onto return stack No operation No operation Example: PUSH Before Instruction TOS = 345Ah PC = 0124h After Instruction PC = 0126h TOS = 0126h Stack (1 level down) = 345Ah © 2009 Microchip Technology Inc. Preliminary DS41350C-page 333 PIC18F1XK50/PIC18LF1XK50 RCALL Relative Call Syntax: RCALL n Operands: -1024 ≤ n ≤ 1023 Operation: (PC) + 2 → TOS, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1101 1nnn nnnn nnnn Description: Subroutine call with a jump up to 1K from the current location. First, return address (PC + 2) is pushed onto the stack. Then, add the 2’s complement number ‘2n’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ PUSH PC to stack Process Data Write to PC No operation No operation No operation No operation Example: HERE RCALL Jump Before Instruction PC = Address (HERE) After Instruction PC = Address (Jump) TOS = Address (HERE + 2) RESET Reset Syntax: RESET Operands: None Operation: Reset all registers and flags that are affected by a MCLR Reset. Status Affected: All Encoding: 0000 0000 1111 1111 Description: This instruction provides a way to execute a MCLR Reset by software. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Start Reset No operation No operation Example: RESET After Instruction Registers = Reset Value Flags* = Reset Value PIC18F1XK50/PIC18LF1XK50 DS41350C-page 334 Preliminary © 2009 Microchip Technology Inc. RETFIE Return from Interrupt Syntax: RETFIE {s} Operands: s ∈ [0,1] Operation: (TOS) → PC, 1 → GIE/GIEH or PEIE/GIEL, if s = 1 (WS) → W, (STATUSS) → Status, (BSRS) → BSR, PCLATU, PCLATH are unchanged. Status Affected: GIE/GIEH, PEIE/GIEL. Encoding: 0000 0000 0001 000s Description: Return from interrupt. Stack is popped and Top-of-Stack (TOS) is loaded into the PC. Interrupts are enabled by setting either the high or low priority global interrupt enable bit. If ‘s’ = 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, Status and BSR. If ‘s’ = 0, no update of these registers occurs (default). Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation POP PC from stack Set GIEH or GIEL No operation No operation No operation No operation Example: RETFIE 1 After Interrupt PC = TOS W = WS BSR = BSRS Status = STATUSS GIE/GIEH, PEIE/GIEL = 1 RETLW Return literal to W Syntax: RETLW k Operands: 0 ≤ k ≤ 255 Operation: k → W, (TOS) → PC, PCLATU, PCLATH are unchanged Status Affected: None Encoding: 0000 1100 kkkk kkkk Description: W is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). The high address latch (PCLATH) remains unchanged. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data POP PC from stack, Write to W No operation No operation No operation No operation Example: CALL TABLE ; W contains table ; offset value ; W now has ; table value : TABLE ADDWF PCL ; W = offset RETLW k0 ; Begin table RETLW k1 ; : : RETLW kn ; End of table Before Instruction W = 07h After Instruction W = value of kn © 2009 Microchip Technology Inc. Preliminary DS41350C-page 335 PIC18F1XK50/PIC18LF1XK50 RETURN Return from Subroutine Syntax: RETURN {s} Operands: s ∈ [0,1] Operation: (TOS) → PC, if s = 1 (WS) → W, (STATUSS) → Status, (BSRS) → BSR, PCLATU, PCLATH are unchanged Status Affected: None Encoding: 0000 0000 0001 001s Description: Return from subroutine. The stack is popped and the top of the stack (TOS) is loaded into the program counter. If ‘s’= 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, Status and BSR. If ‘s’ = 0, no update of these registers occurs (default). Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data POP PC from stack No operation No operation No operation No operation Example: RETURN After Instruction: PC = TOS RLCF Rotate Left f through Carry Syntax: RLCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<7>) → C, (C) → dest<0> Status Affected: C, N, Z Encoding: 0011 01da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the left through the CARRY flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RLCF REG, 0, 0 Before Instruction REG = 1110 0110 C =0 After Instruction REG = 1110 0110 W = 1100 1100 C =1 C register f PIC18F1XK50/PIC18LF1XK50 DS41350C-page 336 Preliminary © 2009 Microchip Technology Inc. RLNCF Rotate Left f (No Carry) Syntax: RLNCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<7>) → dest<0> Status Affected: N, Z Encoding: 0100 01da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the left. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RLNCF REG, 1, 0 Before Instruction REG = 1010 1011 After Instruction REG = 0101 0111 register f RRCF Rotate Right f through Carry Syntax: RRCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<0>) → C, (C) → dest<7> Status Affected: C, N, Z Encoding: 0011 00da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the right through the CARRY flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RRCF REG, 0, 0 Before Instruction REG = 1110 0110 C =0 After Instruction REG = 1110 0110 W = 0111 0011 C =0 C register f © 2009 Microchip Technology Inc. Preliminary DS41350C-page 337 PIC18F1XK50/PIC18LF1XK50 RRNCF Rotate Right f (No Carry) Syntax: RRNCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<0>) → dest<7> Status Affected: N, Z Encoding: 0100 00da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the right. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank will be selected, overriding the BSR value. If ‘a’ is ‘1’, then the bank will be selected as per the BSR value (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: RRNCF REG, 1, 0 Before Instruction REG = 1101 0111 After Instruction REG = 1110 1011 Example 2: RRNCF REG, 0, 0 Before Instruction W =? REG = 1101 0111 After Instruction W = 1110 1011 REG = 1101 0111 register f SETF Set f Syntax: SETF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: FFh → f Status Affected: None Encoding: 0110 100a ffff ffff Description: The contents of the specified register are set to FFh. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: SETF REG, 1 Before Instruction REG = 5Ah After Instruction REG = FFh PIC18F1XK50/PIC18LF1XK50 DS41350C-page 338 Preliminary © 2009 Microchip Technology Inc. SLEEP Enter Sleep mode Syntax: SLEEP Operands: None Operation: 00h → WDT, 0 → WDT postscaler, 1 → TO, 0 → PD Status Affected: TO, PD Encoding: 0000 0000 0000 0011 Description: The Power-down Status bit (PD) is cleared. The Time-out Status bit (TO) is set. Watchdog Timer and its postscaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data Go to Sleep Example: SLEEP Before Instruction TO = ? PD = ? After Instruction TO = 1 † PD = 0 † If WDT causes wake-up, this bit is cleared. SUBFWB Subtract f from W with borrow Syntax: SUBFWB f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) – (f) – (C) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 01da ffff ffff Description: Subtract register ‘f’ and CARRY flag (borrow) from W (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBFWB REG, 1, 0 Before Instruction REG = 3 W =2 C =1 After Instruction REG = FF W =2 C =0 Z =0 N = 1 ; result is negative Example 2: SUBFWB REG, 0, 0 Before Instruction REG = 2 W =5 C =1 After Instruction REG = 2 W =3 C =1 Z =0 N = 0 ; result is positive Example 3: SUBFWB REG, 1, 0 Before Instruction REG = 1 W =2 C =0 After Instruction REG = 0 W =2 C =1 Z = 1 ; result is zero N =0 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 339 PIC18F1XK50/PIC18LF1XK50 SUBLW Subtract W from literal Syntax: SUBLW k Operands: 0 ≤ k ≤ 255 Operation: k – (W) → W Status Affected: N, OV, C, DC, Z Encoding: 0000 1000 kkkk kkkk Description W is subtracted from the eight-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example 1: SUBLW 02h Before Instruction W = 01h C =? After Instruction W = 01h C = 1 ; result is positive Z =0 N =0 Example 2: SUBLW 02h Before Instruction W = 02h C =? After Instruction W = 00h C = 1 ; result is zero Z =1 N =0 Example 3: SUBLW 02h Before Instruction W = 03h C =? After Instruction W = FFh ; (2’s complement) C = 0 ; result is negative Z =0 N =1 SUBWF Subtract W from f Syntax: SUBWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – (W) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 11da ffff ffff Description: Subtract W from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBWF REG, 1, 0 Before Instruction REG = 3 W =2 C =? After Instruction REG = 1 W =2 C = 1 ; result is positive Z =0 N =0 Example 2: SUBWF REG, 0, 0 Before Instruction REG = 2 W =2 C =? After Instruction REG = 2 W =0 C = 1 ; result is zero Z =1 N =0 Example 3: SUBWF REG, 1, 0 Before Instruction REG = 1 W =2 C =? After Instruction REG = FFh ;(2’s complement) W =2 C = 0 ; result is negative Z =0 N =1 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 340 Preliminary © 2009 Microchip Technology Inc. SUBWFB Subtract W from f with Borrow Syntax: SUBWFB f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – (W) – (C) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 10da ffff ffff Description: Subtract W and the CARRY flag (borrow) from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBWFB REG, 1, 0 Before Instruction REG = 19h (0001 1001) W = 0Dh (0000 1101) C =1 After Instruction REG = 0Ch (0000 1011) W = 0Dh (0000 1101) C =1 Z =0 N = 0 ; result is positive Example 2: SUBWFB REG, 0, 0 Before Instruction REG = 1Bh (0001 1011) W = 1Ah (0001 1010) C =0 After Instruction REG = 1Bh (0001 1011) W = 00h C =1 Z = 1 ; result is zero N =0 Example 3: SUBWFB REG, 1, 0 Before Instruction REG = 03h (0000 0011) W = 0Eh (0000 1101) C =1 After Instruction REG = F5h (1111 0100) ; [2’s comp] W = 0Eh (0000 1101) C =0 Z =0 N = 1 ; result is negative SWAPF Swap f Syntax: SWAPF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f<3:0>) → dest<7:4>, (f<7:4>) → dest<3:0> Status Affected: None Encoding: 0011 10da ffff ffff Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: SWAPF REG, 1, 0 Before Instruction REG = 53h After Instruction REG = 35h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 341 PIC18F1XK50/PIC18LF1XK50 TBLRD Table Read Syntax: TBLRD ( *; *+; *-; +*) Operands: None Operation: if TBLRD *, (Prog Mem (TBLPTR)) → TABLAT; TBLPTR – No Change; if TBLRD *+, (Prog Mem (TBLPTR)) → TABLAT; (TBLPTR) + 1 → TBLPTR; if TBLRD *-, (Prog Mem (TBLPTR)) → TABLAT; (TBLPTR) – 1 → TBLPTR; if TBLRD +*, (TBLPTR) + 1 → TBLPTR; (Prog Mem (TBLPTR)) → TABLAT; Status Affected: None Encoding: 0000 0000 0000 10nn nn=0 * =1 *+ =2 *- =3 +* Description: This instruction is used to read the contents of Program Memory (P.M.). To address the program memory, a pointer called Table Pointer (TBLPTR) is used. The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-Mbyte address range. TBLPTR[0] = 0: Least Significant Byte of Program Memory Word TBLPTR[0] = 1: Most Significant Byte of Program Memory Word The TBLRD instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation No operation No operation (Read Program Memory) No operation No operation (Write TABLAT) TBLRD Table Read (Continued) Example1: TBLRD *+ ; Before Instruction TABLAT = 55h TBLPTR = 00A356h MEMORY (00A356h) = 34h After Instruction TABLAT = 34h TBLPTR = 00A357h Example2: TBLRD +* ; Before Instruction TABLAT = AAh TBLPTR = 01A357h MEMORY (01A357h) = 12h MEMORY (01A358h) = 34h After Instruction TABLAT = 34h TBLPTR = 01A358h PIC18F1XK50/PIC18LF1XK50 DS41350C-page 342 Preliminary © 2009 Microchip Technology Inc. TBLWT Table Write Syntax: TBLWT ( *; *+; *-; +*) Operands: None Operation: if TBLWT*, (TABLAT) → Holding Register; TBLPTR – No Change; if TBLWT*+, (TABLAT) → Holding Register; (TBLPTR) + 1 → TBLPTR; if TBLWT*-, (TABLAT) → Holding Register; (TBLPTR) – 1 → TBLPTR; if TBLWT+*, (TBLPTR) + 1 → TBLPTR; (TABLAT) → Holding Register; Status Affected: None Encoding: 0000 0000 0000 11nn nn=0 * =1 *+ =2 *- =3 +* Description: This instruction uses the 3 LSBs of TBLPTR to determine which of the 8 holding registers the TABLAT is written to. The holding registers are used to program the contents of Program Memory (P.M.). (Refer to Section 4.0 “Flash Program Memory” for additional details on programming Flash memory.) The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-MByte address range. The LSb of the TBLPTR selects which byte of the program memory location to access. TBLPTR[0] = 0: Least Significant Byte of Program Memory Word TBLPTR[0] = 1: Most Significant Byte of Program Memory Word The TBLWT instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation No operation No operation (Read TABLAT) No operation No operation (Write to Holding Register ) TBLWT Table Write (Continued) Example1: TBLWT *+; Before Instruction TABLAT = 55h TBLPTR = 00A356h HOLDING REGISTER (00A356h) = FFh After Instructions (table write completion) TABLAT = 55h TBLPTR = 00A357h HOLDING REGISTER (00A356h) = 55h Example 2: TBLWT +*; Before Instruction TABLAT = 34h TBLPTR = 01389Ah HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = FFh After Instruction (table write completion) TABLAT = 34h TBLPTR = 01389Bh HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = 34h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 343 PIC18F1XK50/PIC18LF1XK50 TSTFSZ Test f, skip if 0 Syntax: TSTFSZ f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: skip if f = 0 Status Affected: None Encoding: 0110 011a ffff ffff Description: If ‘f’ = 0, the next instruction fetched during the current instruction execution is discarded and a NOP is executed, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE TSTFSZ CNT, 1 NZERO : ZERO : Before Instruction PC = Address (HERE) After Instruction If CNT = 00h, PC = Address (ZERO) If CNT ≠ 00h, PC = Address (NZERO) XORLW Exclusive OR literal with W Syntax: XORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .XOR. k → W Status Affected: N, Z Encoding: 0000 1010 kkkk kkkk Description: The contents of W are XORed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: XORLW 0AFh Before Instruction W = B5h After Instruction W = 1Ah PIC18F1XK50/PIC18LF1XK50 DS41350C-page 344 Preliminary © 2009 Microchip Technology Inc. XORWF Exclusive OR W with f Syntax: XORWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .XOR. (f) → dest Status Affected: N, Z Encoding: 0001 10da ffff ffff Description: Exclusive OR the contents of W with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in the register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 25.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: XORWF REG, 1, 0 Before Instruction REG = AFh W = B5h After Instruction REG = 1Ah W = B5h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 345 PIC18F1XK50/PIC18LF1XK50 25.2 Extended Instruction Set In addition to the standard 75 instructions of the PIC18 instruction set, PIC18F1XK50/PIC18LF1XK50 devices also provide an optional extension to the core CPU functionality. The added features include eight additional instructions that augment indirect and indexed addressing operations and the implementation of Indexed Literal Offset Addressing mode for many of the standard PIC18 instructions. The additional features of the extended instruction set are disabled by default. To enable them, users must set the XINST Configuration bit. The instructions in the extended set can all be classified as literal operations, which either manipulate the File Select Registers, or use them for indexed addressing. Two of the instructions, ADDFSR and SUBFSR, each have an additional special instantiation for using FSR2. These versions (ADDULNK and SUBULNK) allow for automatic return after execution. The extended instructions are specifically implemented to optimize re-entrant program code (that is, code that is recursive or that uses a software stack) written in high-level languages, particularly C. Among other things, they allow users working in high-level languages to perform certain operations on data structures more efficiently. These include: • dynamic allocation and deallocation of software stack space when entering and leaving subroutines • function pointer invocation • software Stack Pointer manipulation • manipulation of variables located in a software stack A summary of the instructions in the extended instruction set is provided in Table 25-3. Detailed descriptions are provided in Section 25.2.2 “Extended Instruction Set”. The opcode field descriptions in Table 25-1 (page 304) apply to both the standard and extended PIC18 instruction sets. 25.2.1 EXTENDED INSTRUCTION SYNTAX Most of the extended instructions use indexed arguments, using one of the File Select Registers and some offset to specify a source or destination register. When an argument for an instruction serves as part of indexed addressing, it is enclosed in square brackets (“[ ]”). This is done to indicate that the argument is used as an index or offset. MPASM™ Assembler will flag an error if it determines that an index or offset value is not bracketed. When the extended instruction set is enabled, brackets are also used to indicate index arguments in byteoriented and bit-oriented instructions. This is in addition to other changes in their syntax. For more details, see Section 25.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”. TABLE 25-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET Note: The instruction set extension and the Indexed Literal Offset Addressing mode were designed for optimizing applications written in C; the user may likely never use these instructions directly in assembler. The syntax for these commands is provided as a reference for users who may be reviewing code that has been generated by a compiler. Note: In the past, square brackets have been used to denote optional arguments in the PIC18 and earlier instruction sets. In this text and going forward, optional arguments are denoted by braces (“{ }”). Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status MSb LSb Affected ADDFSR ADDULNK CALLW MOVSF MOVSS PUSHL SUBFSR SUBULNK f, k k zs, fd zs, zd k f, k k Add literal to FSR Add literal to FSR2 and return Call subroutine using WREG Move zs (source) to 1st word fd (destination) 2nd word Move zs (source) to 1st word zd (destination) 2nd word Store literal at FSR2, decrement FSR2 Subtract literal from FSR Subtract literal from FSR2 and return 1 2 2 2 2 1 1 2 1110 1110 0000 1110 1111 1110 1111 1110 1110 1110 1000 1000 0000 1011 ffff 1011 xxxx 1010 1001 1001 ffkk 11kk 0001 0zzz ffff 1zzz xzzz kkkk ffkk 11kk kkkk kkkk 0100 zzzz ffff zzzz zzzz kkkk kkkk kkkk None None None None None None None None PIC18F1XK50/PIC18LF1XK50 DS41350C-page 346 Preliminary © 2009 Microchip Technology Inc. 25.2.2 EXTENDED INSTRUCTION SET ADDFSR Add Literal to FSR Syntax: ADDFSR f, k Operands: 0 ≤ k ≤ 63 f ∈ [ 0, 1, 2 ] Operation: FSR(f) + k → FSR(f) Status Affected: None Encoding: 1110 1000 ffkk kkkk Description: The 6-bit literal ‘k’ is added to the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR Example: ADDFSR 2, 23h Before Instruction FSR2 = 03FFh After Instruction FSR2 = 0422h ADDULNK Add Literal to FSR2 and Return Syntax: ADDULNK k Operands: 0 ≤ k ≤ 63 Operation: FSR2 + k → FSR2, (TOS) → PC Status Affected: None Encoding: 1110 1000 11kk kkkk Description: The 6-bit literal ‘k’ is added to the contents of FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the ADDFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR No Operation No Operation No Operation No Operation Example: ADDULNK 23h Before Instruction FSR2 = 03FFh PC = 0100h After Instruction FSR2 = 0422h PC = (TOS) Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s). © 2009 Microchip Technology Inc. Preliminary DS41350C-page 347 PIC18F1XK50/PIC18LF1XK50 CALLW Subroutine Call Using WREG Syntax: CALLW Operands: None Operation: (PC + 2) → TOS, (W) → PCL, (PCLATH) → PCH, (PCLATU) → PCU Status Affected: None Encoding: 0000 0000 0001 0100 Description First, the return address (PC + 2) is pushed onto the return stack. Next, the contents of W are written to PCL; the existing value is discarded. Then, the contents of PCLATH and PCLATU are latched into PCH and PCU, respectively. The second cycle is executed as a NOP instruction while the new next instruction is fetched. Unlike CALL, there is no option to update W, Status or BSR. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read WREG PUSH PC to stack No operation No operation No operation No operation No operation Example: HERE CALLW Before Instruction PC = address (HERE) PCLATH = 10h PCLATU = 00h W = 06h After Instruction PC = 001006h TOS = address (HERE + 2) PCLATH = 10h PCLATU = 00h W = 06h MOVSF Move Indexed to f Syntax: MOVSF [zs], fd Operands: 0 ≤ zs ≤ 127 0 ≤ fd ≤ 4095 Operation: ((FSR2) + zs) → fd Status Affected: None Encoding: 1st word (source) 2nd word (destin.) 1110 1111 1011 ffff 0zzz ffff zzzzs ffffd Description: The contents of the source register are moved to destination register ‘fd’. The actual address of the source register is determined by adding the 7-bit literal offset ‘zs’ in the first word to the value of FSR2. The address of the destination register is specified by the 12-bit literal ‘fd’ in the second word. Both addresses can be anywhere in the 4096-byte data space (000h to FFFh). The MOVSF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Determine source addr Determine source addr Read source reg Decode No operation No dummy read No operation Write register ‘f’ (dest) Example: MOVSF [05h], REG2 Before Instruction FSR2 = 80h Contents of 85h = 33h REG2 = 11h After Instruction FSR2 = 80h Contents of 85h = 33h REG2 = 33h PIC18F1XK50/PIC18LF1XK50 DS41350C-page 348 Preliminary © 2009 Microchip Technology Inc. MOVSS Move Indexed to Indexed Syntax: MOVSS [zs], [zd] Operands: 0 ≤ zs ≤ 127 0 ≤ zd ≤ 127 Operation: ((FSR2) + zs) → ((FSR2) + zd) Status Affected: None Encoding: 1st word (source) 2nd word (dest.) 1110 1111 1011 xxxx 1zzz xzzz zzzzs zzzzd Description The contents of the source register are moved to the destination register. The addresses of the source and destination registers are determined by adding the 7-bit literal offsets ‘zs’ or ‘zd’, respectively, to the value of FSR2. Both registers can be located anywhere in the 4096-byte data memory space (000h to FFFh). The MOVSS instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. If the resultant destination address points to an indirect addressing register, the instruction will execute as a NOP. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Determine source addr Determine source addr Read source reg Decode Determine dest addr Determine dest addr Write to dest reg Example: MOVSS [05h], [06h] Before Instruction FSR2 = 80h Contents of 85h = 33h Contents of 86h = 11h After Instruction FSR2 = 80h Contents of 85h = 33h Contents of 86h = 33h PUSHL Store Literal at FSR2, Decrement FSR2 Syntax: PUSHL k Operands: 0 ≤ k ≤ 255 Operation: k → (FSR2), FSR2 – 1 → FSR2 Status Affected: None Encoding: 1111 1010 kkkk kkkk Description: The 8-bit literal ‘k’ is written to the data memory address specified by FSR2. FSR2 is decremented by 1 after the operation. This instruction allows users to push values onto a software stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process data Write to destination Example: PUSHL 08h Before Instruction FSR2H:FSR2L = 01ECh Memory (01ECh) = 00h After Instruction FSR2H:FSR2L = 01EBh Memory (01ECh) = 08h © 2009 Microchip Technology Inc. Preliminary DS41350C-page 349 PIC18F1XK50/PIC18LF1XK50 SUBFSR Subtract Literal from FSR Syntax: SUBFSR f, k Operands: 0 ≤ k ≤ 63 f ∈ [ 0, 1, 2 ] Operation: FSR(f) – k → FSRf Status Affected: None Encoding: 1110 1001 ffkk kkkk Description: The 6-bit literal ‘k’ is subtracted from the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: SUBFSR 2, 23h Before Instruction FSR2 = 03FFh After Instruction FSR2 = 03DCh SUBULNK Subtract Literal from FSR2 and Return Syntax: SUBULNK k Operands: 0 ≤ k ≤ 63 Operation: FSR2 – k → FSR2 (TOS) → PC Status Affected: None Encoding: 1110 1001 11kk kkkk Description: The 6-bit literal ‘k’ is subtracted from the contents of the FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the SUBFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination No Operation No Operation No Operation No Operation Example: SUBULNK 23h Before Instruction FSR2 = 03FFh PC = 0100h After Instruction FSR2 = 03DCh PC = (TOS) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 350 Preliminary © 2009 Microchip Technology Inc. 25.2.3 BYTE-ORIENTED AND BIT-ORIENTED INSTRUCTIONS IN INDEXED LITERAL OFFSET MODE In addition to eight new commands in the extended set, enabling the extended instruction set also enables Indexed Literal Offset Addressing mode (Section 3.5.1 “Indexed Addressing with Literal Offset”). This has a significant impact on the way that many commands of the standard PIC18 instruction set are interpreted. When the extended set is disabled, addresses embedded in opcodes are treated as literal memory locations: either as a location in the Access Bank (‘a’ = 0), or in a GPR bank designated by the BSR (‘a’ = 1). When the extended instruction set is enabled and ‘a’ = 0, however, a file register argument of 5Fh or less is interpreted as an offset from the pointer value in FSR2 and not as a literal address. For practical purposes, this means that all instructions that use the Access RAM bit as an argument – that is, all byte-oriented and bitoriented instructions, or almost half of the core PIC18 instructions – may behave differently when the extended instruction set is enabled. When the content of FSR2 is 00h, the boundaries of the Access RAM are essentially remapped to their original values. This may be useful in creating backward compatible code. If this technique is used, it may be necessary to save the value of FSR2 and restore it when moving back and forth between C and assembly routines in order to preserve the Stack Pointer. Users must also keep in mind the syntax requirements of the extended instruction set (see Section 25.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”). Although the Indexed Literal Offset Addressing mode can be very useful for dynamic stack and pointer manipulation, it can also be very annoying if a simple arithmetic operation is carried out on the wrong register. Users who are accustomed to the PIC18 programming must keep in mind that, when the extended instruction set is enabled, register addresses of 5Fh or less are used for Indexed Literal Offset Addressing. Representative examples of typical byte-oriented and bit-oriented instructions in the Indexed Literal Offset Addressing mode are provided on the following page to show how execution is affected. The operand conditions shown in the examples are applicable to all instructions of these types. 25.2.3.1 Extended Instruction Syntax with Standard PIC18 Commands When the extended instruction set is enabled, the file register argument, ‘f’, in the standard byte-oriented and bit-oriented commands is replaced with the literal offset value, ‘k’. As already noted, this occurs only when ‘f’ is less than or equal to 5Fh. When an offset value is used, it must be indicated by square brackets (“[ ]”). As with the extended instructions, the use of brackets indicates to the compiler that the value is to be interpreted as an index or an offset. Omitting the brackets, or using a value greater than 5Fh within brackets, will generate an error in the MPASM™ assembler. If the index argument is properly bracketed for Indexed Literal Offset Addressing, the Access RAM argument is never specified; it will automatically be assumed to be ‘0’. This is in contrast to standard operation (extended instruction set disabled) when ‘a’ is set on the basis of the target address. Declaring the Access RAM bit in this mode will also generate an error in the MPASM assembler. The destination argument, ‘d’, functions as before. In the latest versions of the MPASM assembler, language support for the extended instruction set must be explicitly invoked. This is done with either the command line option, /y, or the PE directive in the source listing. 25.2.4 CONSIDERATIONS WHEN ENABLING THE EXTENDED INSTRUCTION SET It is important to note that the extensions to the instruction set may not be beneficial to all users. In particular, users who are not writing code that uses a software stack may not benefit from using the extensions to the instruction set. Additionally, the Indexed Literal Offset Addressing mode may create issues with legacy applications written to the PIC18 assembler. This is because instructions in the legacy code may attempt to address registers in the Access Bank below 5Fh. Since these addresses are interpreted as literal offsets to FSR2 when the instruction set extension is enabled, the application may read or write to the wrong data addresses. When porting an application to the PIC18F1XK50/ PIC18LF1XK50, it is very important to consider the type of code. A large, re-entrant application that is written in ‘C’ and would benefit from efficient compilation will do well when using the instruction set extensions. Legacy applications that heavily use the Access Bank will most likely not benefit from using the extended instruction set. Note: Enabling the PIC18 instruction set extension may cause legacy applications to behave erratically or fail entirely. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 351 PIC18F1XK50/PIC18LF1XK50 ADDWF ADD W to Indexed (Indexed Literal Offset mode) Syntax: ADDWF [k] {,d} Operands: 0 ≤ k ≤ 95 d ∈ [0,1] Operation: (W) + ((FSR2) + k) → dest Status Affected: N, OV, C, DC, Z Encoding: 0010 01d0 kkkk kkkk Description: The contents of W are added to the contents of the register indicated by FSR2, offset by the value ‘k’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write to destination Example: ADDWF [OFST] , 0 Before Instruction W = 17h OFST = 2Ch FSR2 = 0A00h Contents of 0A2Ch = 20h After Instruction W = 37h Contents of 0A2Ch = 20h BSF Bit Set Indexed (Indexed Literal Offset mode) Syntax: BSF [k], b Operands: 0 ≤ f ≤ 95 0 ≤ b ≤ 7 Operation: 1 → ((FSR2) + k) Status Affected: None Encoding: 1000 bbb0 kkkk kkkk Description: Bit ‘b’ of the register indicated by FSR2, offset by the value ‘k’, is set. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: BSF [FLAG_OFST], 7 Before Instruction FLAG_OFST = 0Ah FSR2 = 0A00h Contents of 0A0Ah = 55h After Instruction Contents of 0A0Ah = D5h SETF Set Indexed (Indexed Literal Offset mode) Syntax: SETF [k] Operands: 0 ≤ k ≤ 95 Operation: FFh → ((FSR2) + k) Status Affected: None Encoding: 0110 1000 kkkk kkkk Description: The contents of the register indicated by FSR2, offset by ‘k’, are set to FFh. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write register Example: SETF [OFST] Before Instruction OFST = 2Ch FSR2 = 0A00h Contents of 0A2Ch = 00h After Instruction Contents of 0A2Ch = FFh PIC18F1XK50/PIC18LF1XK50 DS41350C-page 352 Preliminary © 2009 Microchip Technology Inc. 25.2.5 SPECIAL CONSIDERATIONS WITH MICROCHIP MPLAB® IDE TOOLS The latest versions of Microchip’s software tools have been designed to fully support the extended instruction set of the PIC18F1XK50/PIC18LF1XK50 family of devices. This includes the MPLAB® C18 C compiler, MPASM assembly language and MPLAB Integrated Development Environment (IDE). When selecting a target device for software development, MPLAB IDE will automatically set default Configuration bits for that device. The default setting for the XINST Configuration bit is ‘0’, disabling the extended instruction set and Indexed Literal Offset Addressing mode. For proper execution of applications developed to take advantage of the extended instruction set, XINST must be set during programming. To develop software for the extended instruction set, the user must enable support for the instructions and the Indexed Addressing mode in their language tool(s). Depending on the environment being used, this may be done in several ways: • A menu option, or dialog box within the environment, that allows the user to configure the language tool and its settings for the project • A command line option • A directive in the source code These options vary between different compilers, assemblers and development environments. Users are encouraged to review the documentation accompanying their development systems for the appropriate information. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 353 PIC18F1XK50/PIC18LF1XK50 26.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 26.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 354 Preliminary © 2009 Microchip Technology Inc. 26.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 26.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 26.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 26.5 MPLAB ASM30 Assembler, Linker and Librarian MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire dsPIC30F instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility 26.6 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 355 PIC18F1XK50/PIC18LF1XK50 26.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 26.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The MPLAB REAL ICE probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with the popular MPLAB ICD 2 system (RJ11) or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection (CAT5). MPLAB REAL ICE is field upgradeable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 26.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 26.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 356 Preliminary © 2009 Microchip Technology Inc. 26.11 PICSTART Plus Development Programmer The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. 26.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer and selected Flash device debugger with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. 26.13 Demonstration, Development and Evaluation Boards A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 357 PIC18F1XK50/PIC18LF1XK50 27.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings(†) Ambient temperature under bias....................................................................................................... -40°C to +125°C Storage temperature ........................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS, PIC18F1XK50 .......................................................................... -0.3V to +6.0V Voltage on VDD with respect to VSS, PIC18LF1XK50 ........................................................................ -0.3V to +4.0V Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V Voltage on VUSB pin with respect to VSS ............................................................................................ -0.3V to +4.0V Voltage on D+ and D- pins with respect to VSS ...................................................................... -0.3V to (VUSB + 0.3V) Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ...............................................................................................................................800 mW Maximum current out of VSS pin ...................................................................................................................... 95 mA Maximum current into VDD pin ......................................................................................................................... 95 mA Clamp current, IK (VPIN < 0 or VPIN > VDD)................................................................................................................± 20 mA Maximum output current sunk by any I/O pin.................................................................................................... 25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Maximum current sunk by all ports ................................................................................................................... 90 mA Maximum current sourced by all ports ............................................................................................................. 90 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOl x IOL). 2: Vusb must always be ≤ VDD + 0.3V † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 358 Preliminary © 2009 Microchip Technology Inc. 27.1 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Industrial, Extended) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param. No. Sym Characteristic Min Typ† Max Units Conditions D001 VDD Supply Voltage PIC18LF1XK50 1.8 2.7 — — 3.6 3.6 V V FOSC < = 20 MHz FOSC < = 48 MHz D001 PIC18F1XK50 1.8 2.7 — — 5.5 5.5 V V FOSC < = 20 MHz FOSC < = 48 MHz D002* VDR RAM Data Retention Voltage(1) PIC18LF1XK50 1.5 — — V Device in Sleep mode D002* PIC18F1XK50 1.7 — — V Device in Sleep mode VPOR* Power-on Reset Release Voltage — 1.6 — V VPORR* Power-on Reset Rearm Voltage — 0.8 — V VFVR Fixed Voltage Reference Voltage (calibrated) 0.974 1.968 3.736 1.024 2.048 4.096 1.064 2.158 4.226 V FVR1S<1:0> = 00 (1x) FVR1S<1:0> = 01 (2x) FVR1S<1:0> = 10 (4x), VDD > = 4.75V D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms * These parameters are characterized but not tested. † Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 359 PIC18F1XK50/PIC18LF1XK50 FIGURE 27-1: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR VSS VSS NPOR TPOR(3) POR REARM Note 1: When NPOR is low, the device is held in Reset. 2: TPOR 1 μs typical. 3: TVLOW 2.7 μs typical. TVLOW(2) PIC18F1XK50/PIC18LF1XK50 DS41350C-page 360 Preliminary © 2009 Microchip Technology Inc. 27.2 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Industrial, Extended) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note Supply Current (IDD) (1, 2) D009 LDO Regulator — 30 — μA — — 5 — μA — LP Clock mode and Sleep (requires FVR and BOR to be disabled) D010 — 6.0 9 μA 1.8 FOSC = 32 kHz LP Oscillator(4), -40°C ≤ TA ≤ +85°C — 7 12 μA 3.0 D010 — 6 11 μA 1.8 FOSC = 32 kHz LP Oscillator(4), -40°C ≤ TA ≤ +85°C — 7 17 μA 3.0 — 12 20 μA 5.0 D011* — 6.0 12 μA 1.8 FOSC = 32 kHz LP Oscillator -40°C ≤ TA ≤ +125°C — 9.0 16 μA 3.0 D011* — 8.0 15 μA 1.8 FOSC = 32 kHz LP Oscillator (4) -40°C ≤ TA ≤ +125°C — 11 25 μA 3.0 — 12 35 μA 5.0 D011* — 170 220 μA 1.8 FOSC = 1 MHz — 280 370 XT Oscillator μA 3.0 D011* — 200 250 μA 1.8 FOSC = 1 MHz — XT Oscillator 310 400 μA 3.0 — 380 490 μA 5.0 D011* — 75 110 μA 1.8 FOSC = 1 MHz XT Oscillator CPU Idle — 130 190 μA 3.0 D011* — 90 130 μA 1.8 FOSC = 1 MHz XT Oscillator CPU Idle — 140 210 μA 3.0 — 160 250 μA 5.0 * These parameters are characterized but not tested. Legend: TBD = To Be Determined Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ. 4: FVR and BOR are disabled. 5: 330 nF capacitor on VUSB pin. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 361 PIC18F1XK50/PIC18LF1XK50 Supply Current (IDD) (1, 2) D012 — 300 700 μA 1.8 FOSC = 4 MHz — 500 1200 XT Oscillator μA 3.0 D012 — 330 700 μA 1.8 FOSC = 4 MHz — XT Oscillator 530 1200 μA 3.0 — 730 1400 μA 5.0 D012A — 240 300 μA 1.8 FOSC = 4 MHz, XT Oscillator CPU Idle — 440 550 μA 3.0 D012A — 230 300 μA 1.8 FOSC = 4 MHz XT Oscillator CPU Idle — 400 550 μA 3.0 — 470 640 μA 5.0 D013 — 140 180 μA 1.8 FOSC = 1 MHz — 230 300 EC Oscillator (medium power) μA 3.0 D013 — 160 210 μA 1.8 FOSC = 1 MHz EC Oscillator (medium power)(5) — 250 310 μA 3.0 — 290 380 μA 5.0 D013A — 50 64 μA 1.8 FOSC = 1 MHz EC Oscillator (medium power) CPU Idle — 86 110 μA 3.0 D013A — 70 100 μA 1.8 FOSC = 1 MHz EC Oscillator (medium power) CPU Idle — (5) 100 150 μA 3.0 — 120 170 μA 5.0 D014 — 500 640 μA 1.8 FOSC = 4 MHz — 830 1100 EC Oscillator (medium power) μA 3.0 D014 — 520 660 μA 1.8 FOSC = 4 MHz EC Oscillator (medium power)(5) — 860 1100 μA 3.0 — 1000 1300 μA 5.0 27.2 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Industrial, Extended) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note * These parameters are characterized but not tested. Legend: TBD = To Be Determined Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ. 4: FVR and BOR are disabled. 5: 330 nF capacitor on VUSB pin. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 362 Preliminary © 2009 Microchip Technology Inc. Supply Current (IDD) (1, 2) D014A — 200 250 μA 1.8 FOSC = 4 MHz EC Oscillator (medium power) CPU Idle — 340 440 μA 3.0 D014A — 210 280 μA 1.8 FOSC = 4 MHz EC Oscillator (medium power) CPU Idle — (5) 360 470 μA 3.0 — 430 570 μA 5.0 D015 — 820 1000 μA 1.8 FOSC = 6 MHz — 1500 1900 EC Oscillator (high power) μA 3.0 D015 — 830 1100 μA 1.8 FOSC = 6 MHz EC Oscillator (high power)(5) — 1500 1900 μA 3.0 — 1700 2300 μA 5.0 D015A — 300 370 μA 1.8 FOSC = 6 MHz EC Oscillator (high power) CPU Idle — 510 660 μA 3.0 D015A — 320 430 μA 1.8 FOSC = 6 MHz EC Oscillator (high power) CPU Idle — (5) 530 690 μA 3.0 — 640 840 μA 5.0 D015B — 4.7 6.0 mA 3.0 FOSC = 24 MHz 6 MHz EC Oscillator (high power) PLL enabled D015B — 4.7 6.1 mA 3.0 FOSC = 24 MHz 6 MHz EC Oscillator (high power) PLL enabled — (5) 5.6 7.4 mA 5.0 D015C — 2.0 2.5 mA 3.0 FOSC = 24 MHz 6 MHz EC Oscillator (high power) PLL enabled, CPU Idle D015C — 2.0 2.5 mA 3.0 FOSC = 24 MHz 6 MHz EC Oscillator (high power) PLL enabled, CPU Idle — (5) 2.3 3.0 mA 5.0 27.2 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Industrial, Extended) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note * These parameters are characterized but not tested. Legend: TBD = To Be Determined Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ. 4: FVR and BOR are disabled. 5: 330 nF capacitor on VUSB pin. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 363 PIC18F1XK50/PIC18LF1XK50 27.2 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Industrial, Extended) (Continued) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note Supply Current (IDD) (1, 2) D016 — 2.6 3.3 mA 3.0 FOSC = 12 MHz EC Oscillator (high power) D016 — 2.6 3.3 mA 3.0 FOSC = 12 MHz EC Oscillator (high power)(5) — 3.1 4.1 mA 5.0 D017 — 1.0 1.3 mA 3.0 FOSC = 12 MHz EC Oscillator (high power) CPU Idle D017 — 1.0 1.3 mA 3.0 FOSC = 12 MHz EC Oscillator (high power) CPU Idle — (5) 1.2 1.6 mA 5.0 D017A — 9 12 mA 3.0 FOSC = 48 MHz 12 MHz EC Oscillator (high power) PLL enabled D017A — 8.9 12 mA 3.0 FOSC = 48 MHz 12 MHz EC Oscillator (high power) PLL enabled — (5) 11 14 mA 5.0 D017B — 3.9 5.0 mA 3.0 FOSC = 48 MHz 12 MHz EC Oscillator (high power) PLL enabled, CPU Idle D017B — 3.9 5.0 mA 3.0 FOSC = 48 MHz 12 MHz EC Oscillator (high power) PLL enabled, CPU Idle — (5) 4.7 6.0 mA 5.0 D018 — 19 38 μA 1.8 FOSC = 32 kHz LFINTOSC Oscillator mode(3, 5) — 23 44 μA 3.0 D018 — 21 40 μA 1.8 FOSC = 32 kHz LFINTOSC Oscillator mode(3, 5) — 25 46 μA 3.0 — 26 48 μA 5.0 D019 — 16 33 μA 1.8 FOSC = 32 kHz LFINTOSC Oscillator CPU Idle — 18 38 μA 3.0 D019 — 18 35 μA 1.8 FOSC = 32 kHz LFINTOSC Oscillator CPU Idle — (5) 20 40 μA 3.0 — 21 42 μA 5.0 * These parameters are characterized but not tested. Legend: TBD = To Be Determined Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ. 4: FVR and BOR are disabled. 5: 330 nF capacitor on VUSB pin. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 364 Preliminary © 2009 Microchip Technology Inc. Supply Current (IDD) (1, 2) D020 — 320 430 μA 1.8 FOSC = 500 kHz — 460 600 LFINTOSC Oscillator μA 3.0 D020 — 350 460 μA 1.8 FOSC = 500 kHz LFINTOSC Oscillator(5) — 490 630 μA 3.0 — 540 710 μA 5.0 D021 — 380 530 μA 1.8 FOSC = 1 MHz — 550 770 HFINTOSC Oscillator μA 3.0 D021 — 410 530 μA 1.8 FOSC = 1 MHz HFINTOSC Oscillator(5) — 580 770 μA 3.0 — 650 900 μA 5.0 D021A — 290 400 μA 1.8 FOSC = 1 MHz HFINTOSC Oscillator CPU Idle — 410 560 μA 3.0 D021A — 320 420 μA 1.8 FOSC = 1 MHz HFINTOSC Oscillator CPU Idle — (5) 440 570 μA 3.0 — 490 680 μA 5.0 D022 — 1.2 1.6 mA 1.8 FOSC = 8 MHz — 2.1 2.9 mA 3.0 HFINTOSC Oscillator D022 — 1.2 1.6 mA 1.8 FOSC = 8 MHz HFINTOSC Oscillator(5) — 2.1 2.9 mA 3.0 — 2.4 3.5 mA 5.0 D023 — 2.0 2.7 mA 1.8 FOSC = 16 MHz — 3.5 4.8 mA 3.0 HFINTOSC Oscillator D023 — 2.0 2.7 mA 1.8 FOSC = 16 MHz HFINTOSC Oscillator(5) — 3.5 4.8 mA 3.0 — 4.0 6.0 mA 5.0 D023A — 0.9 1.3 mA 1.8 FOSC = 16 MHz HFINTOSC Oscillator CPU Idle — 1.5 2.1 mA 3.0 D023A — 0.9 1.3 mA 1.8 FOSC = 16 MHz HFINTOSC Oscillator CPU Idle — (5) 1.5 2.1 mA 3.0 — 1.7 2.6 mA 5.0 27.2 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Industrial, Extended) (Continued) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note * These parameters are characterized but not tested. Legend: TBD = To Be Determined Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ. 4: FVR and BOR are disabled. 5: 330 nF capacitor on VUSB pin. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 365 PIC18F1XK50/PIC18LF1XK50 Supply Current (IDD) (1, 2) D024 — 0.5 0.7 mA 1.8 FOSC = 4 MHz — 0.9 1.1 mA 3.0 EXTRC Oscillator mode D024 — 0.5 0.7 mA 1.8 FOSC = 4 MHz EXTRC Oscillator mode(5) — 0.9 1.1 mA 3.0 — 1.0 1.4 mA 5.0 D025 — 1.0 1.1 mA 1.8 FOSC = 6 MHz — 2.1 2.0 mA 3.0 HS Oscillator D025 — 1.0 1.1 mA 1.8 FOSC = 6 MHz HS Oscillator(5) — 2.1 2.0 mA 3.0 — 3.5 2.5 mA 5.0 D025A — 5.4 6.0 mA 3.0 FOSC = 24 MHz 6 MHz HS Oscillator PLL enabled D025A — 5.4 6.0 mA 3.0 FOSC = 24 MHz 6 MHz HS Oscillator PLL enabled — (5) 7.4 7.6 mA 5.0 D026 — 3.2 3.3 mA 3.0 FOSC = 12 MHz HS Oscillator D026 — 3.2 3.3 mA 3.0 FOSC = 12 MHz HS Oscillator(5) — 4.8 4.2 mA 5.0 D026A — 10 12 mA 3.0 FOSC = 48 MHz, 12 MHz HS Oscillator PLL enabled D026A — 10 12 mA 3.0 FOSC = 48 MHz, 12 MHz HS Oscillator PLL enabled — (5) 13 15 mA 5.0 27.2 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Industrial, Extended) (Continued) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note * These parameters are characterized but not tested. Legend: TBD = To Be Determined Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ. 4: FVR and BOR are disabled. 5: 330 nF capacitor on VUSB pin. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 366 Preliminary © 2009 Microchip Technology Inc. 27.3 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Power-Down) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max +85°C Max +125°C Units Conditions VDD Note Power-down Base Current (IPD) (2) D027 — 0.024 0.7 6.7 μA 1.8 WDT, BOR, FVR, Voltage Regulator and T1OSC disabled, all Peripherals Inactive — 0.078 1.9 8.5 μA 3.0 D027 — 6.0 7.0 13 μA 1.8 WDT, BOR, FVR and T1OSC — disabled, all Peripherals Inactive 7.0 10 15 μA 3.0 — 8.0 12 19 μA 5.0 Power-down Module Current D028 — 0.45 1.3 4.4 μA 1.8 LPWDT Current(1) — 0.75 2.0 6.0 μA 3.0 D028 — 6.5 7.0 10.5 μA 1.8 LPWDT Current(1) — 9.6 10.6 17.6 μA 3.0 — 10.5 16.5 20 μA 5.0 D029 — 12 17 23 μA 1.8 FVR current (3) — 22 19 25 μA 3.0 D029 — 28 42 50 μA 1.8 FVR current(3, 5) — 35.6 45.6 55 μA 3.0 — 38.5 49 60 mA 5.0 D030 — — — — μA 1.8 BOR Current(1, 3) — — 21 27 μA 3.0 D030 — — — — μA 1.8 BOR Current(1, 3, 5) — 27 48 51 μA 3.0 — 36.5 51 55 μA 5.0 D031 — 0.79 3.6 5.3 μA 1.8 T1OSC Current(1) — 1.8 2.9 6.9 μA 3.0 D031 — 8.0 7.5 10 μA 1.8 T1OSC Current(1) — 8.5 10.5 15 μA 3.0 — 10.5 12.5 24 μA 5.0 Legend: TBD = To Be Determined * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral Δ current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: Fixed Voltage Reference is automatically enabled whenever the BOR is enabled 4: A/D oscillator source is FRC 5: 0.1 μs capacitor on VCAP (RA0). © 2009 Microchip Technology Inc. Preliminary DS41350C-page 367 PIC18F1XK50/PIC18LF1XK50 Power-down Module Current D032 — — 1.8 8 μA 1.8 A/D Current(1, 4), no conversion in — — 3 10 progress μA 3.0 D032 — — 6 12 μA 1.8 A/D Current(1, 4), no conversion in — — progress 10 17 μA 3.0 — — 11.5 22 μA 5.0 D033 — — 38 44 μA 1.8 Comparator Current, low power — — 40 47 μA 3.0 D033 — 30 40 49 μA 2.0 Comparator Current, low power — 34 44 53 μA 3.0 — 36 50 60 μA 5.0 D033A — — 239 244 μA 1.8 Comparator Current, high power — — 242 249 μA 3.0 D033A — 144 243 250 μA 2.0 Comparator Current, high power — 146 247 256 μA 3.0 — 151 253 264 μA 5.0 D034 — — 18 23 μA 1.8 Voltage Reference Current — — 30 35 μA 3.0 D034 — 35 36 44 μA 2.0 Voltage Reference Current — 43 44 60 μA 3.0 — 55 65 74 μA 5.0 27.3 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Power-Down) (Continued) PIC18LF1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended PIC18F1XK50 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max +85°C Max +125°C Units Conditions VDD Note Legend: TBD = To Be Determined * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral Δ current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. 3: Fixed Voltage Reference is automatically enabled whenever the BOR is enabled 4: A/D oscillator source is FRC 5: 0.1 μs capacitor on VCAP (RA0). PIC18F1XK50/PIC18LF1XK50 DS41350C-page 368 Preliminary © 2009 Microchip Technology Inc. 27.4 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions VIL Input Low Voltage I/O PORT: D036 with TTL buffer — — 0.8 V 4.5V ≤ VDD ≤ 5.5V D036A — — 0.15 VDD V 1.8V ≤ VDD ≤ 4.5V D037 with Schmitt Trigger buffer — — 0.2 VDD V 1.8V ≤ VDD ≤ 5.5V with I2C levels — — 0.3 VDD V D038 MCLR, OSC1 (RC mode)(1) — — 0.2 VDD V D039A OSC1 (HS mode) — — 0.3 VDD V VIH Input High Voltage I/O ports: — — D040 with TTL buffer 2.0 — — V 4.5V ≤ VDD ≤ 5.5V D040A 0.25 VDD + 0.8 — — V 1.8V ≤ VDD ≤ 4.5V D041 with Schmitt Trigger buffer 0.8 VDD — — V 1.8V ≤ VDD ≤ 5.5V with I2C levels 0.7 VDD — —V D042 MCLR 0.8 VDD — —V D043A OSC1 (HS mode) 0.7 VDD — —V D043B OSC1 (RC mode) 0.9 VDD — —V (Note 1) IIL Input Leakage Current(2) D060 I/O ports — ± 5 ± 100 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance D061 MCLR(3) — ± 50 ± 200 nA VSS ≤ VPIN ≤ VDD D063 OSC1 — ± 5 ± 100 nA VSS ≤ VPIN ≤ VDD, XT, HS and LP oscillator configuration IPUR PORTB Weak Pull-up Current D070* 50 250 400 μA VDD = 5.0V, VPIN = VSS VOL Output Low Voltage(4) D080 I/O ports — — VSS+0.6 VSS+0.6 VSS+0.6 V IOH = 8mA, VDD = 5V IOH = 6mA, VDD = 3.3V IOH = 3mA, VDD = 1.8V VOH Output High Voltage(4) D090 I/O ports VDD-0.7 VDD-0.7 VDD-0.7 — —V IOL = 3.5mA, VDD = 5V IOL = 3mA, VDD = 3.3V IOL = 2mA, VDD = 1.8V Legend: TBD = To Be Determined * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: Including OSC2 in CLKOUT mode. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 369 PIC18F1XK50/PIC18LF1XK50 Capacitive Loading Specs on Output Pins D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101A* CIO All I/O pins — — 50 pF Flash Memory D130 EP Cell Endurance 10K 100K — — E/W Program Flash Memory Data Flash Memory D131 VDD for Read VMIN — —V Voltage on MCLR/VPP during Erase/Program VDD + 1.5 — 9.0 V Temperature during programming: -40°C ≤ TA ≤ 85°C VDD for Bulk Erase TBD 2.1 — V Temperature during programming: 10°C ≤ TA ≤ 40°C D132 VPEW VDD for Write or Row Erase VMIN — — VVMIN = Minimum operating voltage VMAX = Maximum operating voltage IPPPGM Current on MCLR/VPP during Erase/Write — — 5.0 mA IDDPGM Current on VDD during Erase/Write — 5.0 mA D133 TPEW Erase/Write cycle time — 4.0 ms D134 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated VCAP Capacitor Charging D135 Charging current — 200 — μA D135A Source/sink capability when charging complete — 0.0 — mA 27.4 DC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E (Continued) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions Legend: TBD = To Be Determined * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: Including OSC2 in CLKOUT mode. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 370 Preliminary © 2009 Microchip Technology Inc. 27.5 USB Module Specifications Operating Conditions-40°C ≤ TA ≤ +85°C (unless otherwise state) Param No. Sym Characteristic Min Typ Max Units Conditions D313 VUSB USB Voltage 3.0 — 3.6 V Voltage on VUSB pin must be in this range for proper USB operation D314 IIL Input Leakage on pin — — ± 1 μA VSS ≤ VPIN ≤ VDD pin at high impedance D315 VILUSB Input Low Voltage for USB Buffer — — 0.8 V For VUSB range D316 VIHUSB Input High Voltage for USB Buffer 2.0 — — V For VUSB range D318 VDIFS Differential Input Sensitivity — — 0.2 V The difference between D+ and D- must exceed this value while VCM is met D319 VCM Differential Common Mode Range 0.8 — 2.5 V D320 ZOUT Driver Output Impedance(1) 28 — 44 Ω D321 VOL Voltage Output Low 0.0 — 0.3 V 1.5 kΩ load connected to 3.6V D322 VOH Voltage Output High 2.8 — 3.6 V 1.5 kΩ load connected to ground Note 1: The D+ and D- signal lines have been built-in impedance matching resistors. No external resistors, capacitors or magnetic components are necessary on the D+/D- signal paths between the PIC18F1XK50/PIC18LF1XK50 family device and USB cable. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 371 PIC18F1XK50/PIC18LF1XK50 27.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Typ Units Conditions TH01 θJA Thermal Resistance Junction to Ambient 62.4 °C/W 20-pin PDIP package 85.2 °C/W 20-pin SOIC package 108.1 °C/W 20-pin SSOP package TBD °C/W 20-pin QFN 5x5mm package TH02 θJC Thermal Resistance Junction to Case 31.4 °C/W 20-pin PDIP package 24 °C/W 20-pin SOIC package 24 °C/W 20-pin SSOP package 24 °C/W 20-pin QFN 6x6mm package TH03 TJMAX Maximum Junction Temperature 150 °C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/θJA(2) Legend: TBD = To Be Determined Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature 3: TJ = Junction Temperature PIC18F1XK50/PIC18LF1XK50 DS41350C-page 372 Preliminary © 2009 Microchip Technology Inc. 27.7 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: FIGURE 27-2: LOAD CONDITIONS 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKOUT rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O PORT t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance VSS CL Legend: CL = 50 pF for all pins, 15 pF for OSC2 output Load Condition Pin © 2009 Microchip Technology Inc. Preliminary DS41350C-page 373 PIC18F1XK50/PIC18LF1XK50 27.8 AC Characteristics: PIC18F1XK50/PIC18LF1XK50-I/E FIGURE 27-3: CLOCK TIMING FIGURE 27-4: PIC18F1XK50 VOLTAGE FREQUENCY GRAPH, -40°C ≤ TA ≤ +85°C OSC1/CLKIN OSC2/CLKOUT Q4 Q1 Q2 Q3 Q4 Q1 OS02 OS03 OS04 OS04 OSC2/CLKOUT (LP,XT,HS Modes) (CLKOUT Mode) 1.8 0 Frequency (MHz) VDD (V) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 27-1 for each Oscillator mode’s supported frequencies. 10 48 20 40 5.5 3.6 2.7 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 374 Preliminary © 2009 Microchip Technology Inc. FIGURE 27-5: PIC18LF1XK50 VOLTAGE FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C FIGURE 27-6: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE 1.8 2.7 0 Frequency (MHz) VDD (V) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 27-1 for each Oscillator mode’s supported frequencies. 10 48 20 40 3.6 125 25 2.0 0 60 85 VDD (V) 4.0 5.0 4.5 Temperature (°C) 1.8 2.5 3.0 3.5 5.5 Note 1: This chart covers both regulator enabled and regulator disabled states. 2: Regulator Nominal voltage 3.3(2) -40 -20 + 5% ± 2% ± 5% © 2009 Microchip Technology Inc. Preliminary DS41350C-page 375 PIC18F1XK50/PIC18LF1XK50 TABLE 27-1: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions OS01 FOSC External CLKIN Frequency(1) DC — 37 kHz EC Oscillator mode (low) DC — 4 MHz EC Oscillator mode (medium) DC — 48 MHz EC Oscillator mode (high) Oscillator Frequency(1) — 32.768 33 kHz LP Oscillator mode 0.1 — 4 MHz XT Oscillator mode 1 — 20 MHz HS Oscillator mode DC — 4 MHz RC Oscillator mode OS02 TOSC External CLKIN Period(1) 27 — ∞ μs LP Oscillator mode 250 — ∞ ns XT Oscillator mode 50 — ∞ ns HS Oscillator mode 20.80 — ∞ ns EC Oscillator mode Oscillator Period(1) — 30.5 — μs LP Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 1,000 ns HS Oscillator mode 250 — — ns RC Oscillator mode OS03 TCY Instruction Cycle Time(1) 83 TCY DC ns TCY = 4/FOSC OS04* TosH, TosL External CLKIN High, External CLKIN Low 2—— μs LP oscillator 100 — — ns XT oscillator 20 — — ns HS oscillator OS05* TosR, TosF External CLKIN Rise, External CLKIN Fall 0 — ∞ ns LP oscillator 0 — ∞ ns XT oscillator 0 — ∞ ns HS oscillator * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 376 Preliminary © 2009 Microchip Technology Inc. TABLE 27-2: OSCILLATOR PARAMETERS TABLE 27-3: PLL CLOCK TIMING SPECIFICATIONS (VDD = 42.7V TO 5.5V) Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Freq. Tolerance Min Typ† Max Units Conditions OS08 HFOSC Internal Calibrated HFINTOSC Frequency(2) ±2% — 16.0 — MHz 0°C ≤ TA ≤ +85°C ±5% — 16.0 — MHz -40°C ≤ TA ≤ +125°C OS10* TIOSC ST HFINTOSC Wake-up from Sleep Start-up Time — —5 7 μs VDD = 2.0V, -40°C to +85°C — —5 7 μs VDD = 3.0V, -40°C to +85°C — —5 7 μs VDD = 5.0V, -40°C to +85°C * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended. 3: By design. Param No. Sym Characteristic Min Typ† Max Units Conditions F10 FOSC Oscillator Frequency Range 4 — 12 MHz F11 FSYS On-Chip VCO System Frequency 16 — 48 MHz F12 trc PLL Start-up Time (Lock Time) — — 2 ms F13* ΔCLK CLKOUT Stability (Jitter) -0.25% — +0.25% % * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 377 PIC18F1XK50/PIC18LF1XK50 FIGURE 27-7: CLKOUT AND I/O TIMING TABLE 27-4: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions OS11 TosH2ckL Fosc↑ to CLKOUT↓ (1) — — 70 ns VDD = 3.3-5.0V OS12 TosH2ckH Fosc↑ to CLKOUT↑ (1) — — 72 ns VDD = 3.3-5.0V OS13 TckL2ioV CLKOUT↓ to Port out valid(1) — — 20 ns OS14 TioV2ckH Port input valid before CLKOUT↑(1) TOSC + 200 ns — — ns OS15 TosH2ioV Fosc↑ (Q1 cycle) to Port out valid — 50 70* ns VDD = 3.3-5.0V OS16 TosH2ioI Fosc↑ (Q2 cycle) to Port input invalid (I/O in hold time) 50 — — ns VDD = 3.3-5.0V OS17 TioV2osH Port input valid to Fosc↑ (Q2 cycle) (I/O in setup time) 20 — — ns OS18 TioR Port output rise time(2) — — 40 15 72 32 ns VDD = 2.0V VDD = 3.3-5.0V OS19 TioF Port output fall time(2) — — 28 15 55 30 ns VDD = 2.0V VDD = 3.3-5.0V OS20* Tinp INT pin input high or low time 25 — — ns OS21* Trbp PORTB interrupt-on-change new input level time TCY — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. 2: Includes OSC2 in CLKOUT mode. FOSC CLKOUT I/O pin (Input) I/O pin (Output) Q4 Q1 Q2 Q3 OS11 OS19 OS13 OS15 OS18, OS19 OS20 OS21 OS17 OS16 OS14 OS12 OS18 Old Value New Value Cycle Write Fetch Read Execute PIC18F1XK50/PIC18LF1XK50 DS41350C-page 378 Preliminary © 2009 Microchip Technology Inc. FIGURE 27-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING FIGURE 27-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD MCLR Internal POR PWRT Time-out OSC Start-Up Time Internal Reset(1) Watchdog Timer 33 32 30 31/ 34 I/O pins 34 Note 1: Asserted low. Reset(1) 31A VBOR VDD (Device in Brown-out Reset) (Device not in Brown-out Reset) 33(1) 37 Note 1: 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’. 2 ms delay if PWRTE = 0. Reset (due to BOR) VBOR and VHYST TBORREJ © 2009 Microchip Technology Inc. Preliminary DS41350C-page 379 PIC18F1XK50/PIC18LF1XK50 TABLE 27-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 5 — — — — μs μs VDD = 3.3-5V, -40°C to +85°C VDD = 3.3-5V 31 TWDT Standard Watchdog Timer Time-out Period (No Prescaler) (5) 10 10 17 17 27 30 ms ms VDD = 3.3V-5V, -40°C to +85°C VDD = 3.3V-5V 31A TWDTLP Low Power Watchdog Timer Time-out Period (No Prescaler) 10 10 18 18 27 33 ms ms VDD = 3.3V-5V, -40°C to +85°C VDD = 3.3V-5V 32 TOST Oscillator Start-up Timer Period(1), (2) — 1024 — Tosc (Note 3) 33* TPWRT Power-up Timer Period, PWRTE = 0 40 65 140 ms 34* TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 μs 35 VBOR Brown-out Reset Voltage TBD TBD TBD TBD 1.9 2.2 2.7 3.0 TBD TBD TBD TBD V V V V BORV = 1.9V BORV = 2.2V BORV = 2.7V BORV = 3.6V 36* VHYST Brown-out Reset Hysteresis 25 50 75 mV -40°C to +85°C 37* TBORDC Brown-out Reset DC Response Time 135 10 μs VDD ≤ VBOR, -40°C to +85°C VDD ≤ VBOR Legend: TBD = To Be Determined * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2: By design. 3: Period of the slower clock. 4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended. 5: Design Target. If unable to meet this target, the maximum can be increased, but the minimum cannot be changed. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 380 Preliminary © 2009 Microchip Technology Inc. FIGURE 27-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS TABLE 27-6: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions 40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 42* TT0P T0CKI Period Greater of: 20 or TCY + 40 N — — ns N = prescale value (2, 4, ..., 256) 45* TT1H T1CKI High Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 46* TT1L T1CKI Low Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 47* TT1P T1CKI Input Period Synchronous Greater of: 30 or TCY + 40 N — — ns N = prescale value (1, 2, 4, 8) Asynchronous 60 — — ns 48 FT1 Timer1 Oscillator Input Frequency Range (oscillator enabled by setting bit T1OSCEN) 32.4 32.768 33.1 kHz 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment 2 TOSC — 7 TOSC — Timers in Sync mode * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. T0CKI T1CKI 40 41 42 45 46 47 49 TMR0 or TMR1 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 381 PIC18F1XK50/PIC18LF1XK50 FIGURE 27-11: CAPTURE/COMPARE/PWM TIMINGS (CCP) TABLE 27-7: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP) TABLE 27-8: PIC18F1XK50/PIC18LF1XK50 A/D CONVERTER (ADC) CHARACTERISTICS: Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions CC01* TccL CCPx Input Low Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC02* TccH CCPx Input High Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC03* TccP CCPx Input Period 3TCY + 40 N — — ns N = prescale value (1, 4 or 16) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions AD01 NR Resolution — — 10 bit AD02 EIL Integral Error — — ±1 LSb VREF = 5.0V AD03 EDL Differential Error — — ±1 LSb No missing codes VREF = 5.0V AD04 EOFF Offset Error — — ±3 LSb VREF = 5.0V AD05 EGN Gain Error — — ±3 LSb VREF = 5.0V AD06 AD06A VREF Reference Voltage(3) 1.8 3.0 — — VDD VDD V V VDD <3.0V VDD <3.0V AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of Analog Voltage Source — — 2.5 kΩ Can go higher if external 0.01μF capacitor is present on input pin. AD09* IREF VREF Input Current(3) 10 — 1000 μA During VAIN acquisition. Based on differential of VHOLD to VAIN. — — 10 μA During A/D conversion cycle. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: ADC VREF is from external VREF, VDD pin or FVR, whichever is selected as reference input. 4: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. Note: Refer to Figure 27-2 for load conditions. (Capture mode) CC01 CC02 CC03 CCPx PIC18F1XK50/PIC18LF1XK50 DS41350C-page 382 Preliminary © 2009 Microchip Technology Inc. FIGURE 27-12: A/D CONVERSION TIMING TABLE 27-9: A/D CONVERSION REQUIREMENTS Param No. Symbol Characteristic Min Max Units Conditions 130 TAD A/D Clock Period 0.7 25.0(1) μs TOSC based, VREF ≥ 3.0V TBD 1 μs A/D RC mode 131 TCNV Conversion Time (not including acquisition time)(2) 11 12 TAD 132 TACQ Acquisition Time(3) 1.4 TBD — — μs μs -40°C to +85°C 0°C ≤ to ≤ +85°C 135 TSWC Switching Time from Convert → Sample — (Note 4) TBD TDIS Discharge Time 0.2 — μs Legend: TBD = To Be Determined Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider. 2: ADRES register may be read on the following TCY cycle. 3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50 Ω. 4: On the following cycle of the device clock. 131 130 132 BSF ADCON0, GO Q4 A/D CLK A/D DATA ADRES ADIF GO SAMPLE OLD_DATA SAMPLING STOPPED DONE NEW_DATA (Note 2) 9 87 2 1 0 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input. .. . . . . TCY © 2009 Microchip Technology Inc. Preliminary DS41350C-page 383 PIC18F1XK50/PIC18LF1XK50 TABLE 27-10: COMPARATOR SPECIFICATIONS TABLE 27-11: CVREF VOLTAGE REFERENCE SPECIFICATIONS TABLE 27-12: FIXED VOLTAGE REFERENCE (FVR) SPECIFICATIONS Operating Conditions: 1.8V < VDD < 3.6V, -40°C < TA < +125°C (unless otherwise stated). Param No. Sym Characteristics Min Typ Max Units Comments CM01 VIOFF Input Offset Voltage — ±7.5 ±15 mV CM02 VICM Input Common Mode Voltage 0 — VDD V CM03 CMRR Common Mode Rejection Ratio 55 — — dB CM04 TRESP Response Time — 150 400 ns Note 1 CM05 TMC2OV Comparator Mode Change to Output Valid* — — 10 μs * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to VDD. Operating Conditions: 1.8V < VDD < 3.6V, -40°C < TA < +125°C (unless otherwise stated). Param No. Sym Characteristics Min Typ Max Units Comments CV01* CLSB Step Size(2) — — VDD/24 VDD/32 — — V V Low Range (VRR = 1) High Range (VRR = 0) CV02* CACC Absolute Accuracy — — — — ± 1/4 ± 1/2 LSb LSb Low Range (VRR = 1) High Range (VRR = 0) CV03* CR Unit Resistor Value (R) — 2k — Ω CV04* CST Settling Time(1) — — 10 μs * These parameters are characterized but not tested. Note 1: Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from ‘0000’ to ‘1111’. Operating Conditions: 1.8V < VDD < 3.6V, -40°C < TA < +125°C (unless otherwise stated). VR Voltage Reference Specifications Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristics Min Typ Max Units Comments VR01 VROUT VR voltage output TBD 1.2 TBD V VR02 TCVOUT Voltage drift temperature coefficient — TBD TBD ppm/°C VR03 ΔVROUT/ ΔVDD Voltage drift with respect to VDD regulation — TBD — μV/V VR04 TSTABLE Settling Time — TBD TBD μs Legend: TBD = To Be Determined * These parameters are characterized but not tested. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 384 Preliminary © 2009 Microchip Technology Inc. FIGURE 27-13: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING TABLE 27-13: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS FIGURE 27-14: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING TABLE 27-14: USART SYNCHRONOUS RECEIVE REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param. No. Symbol Characteristic Min. Max. Units Conditions US120 TCKH2DTV SYNC XMIT (Master and Slave) Clock high to data-out valid 3.0-5.5V — 80 ns 1.8-5.5V — 100 ns US121 TCKRF Clock out rise time and fall time (Master mode) 3.0-5.5V — 45 ns 1.8-5.5V — 50 ns US122 TDTRF Data-out rise time and fall time 3.0-5.5V — 45 ns 1.8-5.5V — 50 ns Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param. No. Symbol Characteristic Min. Max. Units Conditions US125 TDTV2CKL SYNC RCV (Master and Slave) Data-hold before CK ↓ (DT hold time) 10 — ns US126 TCKL2DTL Data-hold after CK ↓ (DT hold time) 15 — ns Note: Refer to Figure 27-2 for load conditions. US121 US121 US120 US122 CK DT Note: Refer to Figure 27-2 for load conditions. US125 US126 CK DT © 2009 Microchip Technology Inc. Preliminary DS41350C-page 385 PIC18F1XK50/PIC18LF1XK50 FIGURE 27-15: SPI MASTER MODE TIMING (CKE = 0, SMP = 0) FIGURE 27-16: SPI MASTER MODE TIMING (CKE = 1, SMP = 1) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP70 SP71 SP72 SP73 SP74 SP75, SP76 SP79 SP78 SP80 SP78 SP79 MSb LSb bit 6 - - - - - -1 MSb In bit 6 - - - -1 LSb In Note: Refer to Figure 27-2 for load conditions. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP81 SP71 SP72 SP74 SP75, SP76 SP78 SP80 MSb SP79 SP73 MSb In bit 6 - - - - - -1 bit 6 - - - -1 LSb In LSb Note: Refer to Figure 27-2 for load conditions. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 386 Preliminary © 2009 Microchip Technology Inc. FIGURE 27-17: SPI SLAVE MODE TIMING (CKE = 0) FIGURE 27-18: SPI SLAVE MODE TIMING (CKE = 1) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP70 SP71 SP72 SP73 SP74 SP75, SP76 SP77 SP79 SP78 SP80 SP78 SP79 MSb LSb bit 6 - - - - - -1 MSb In bit 6 - - - -1 LSb In SP83 Note: Refer to Figure 27-2 for load conditions. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI SP70 SP71 SP72 SP82 SP74 SP75, SP76 MSb bit 6 - - - - - -1 LSb SP77 MSb In bit 6 - - - -1 LSb In SP80 SP83 Note: Refer to Figure 27-2 for load conditions. © 2009 Microchip Technology Inc. Preliminary DS41350C-page 387 PIC18F1XK50/PIC18LF1XK50 TABLE 27-15: SPI MODE REQUIREMENTS FIGURE 27-19: I2C™ BUS START/STOP BITS TIMING Param No. Symbol Characteristic Min Typ† Max Units Conditions SP70* TSSL2SCH, TSSL2SCL SS↓ to SCK↓ or SCK↑ input TCY — — ns SP71* TSCH SCK input high time (Slave mode) TCY + 20 — — ns SP72* TSCL SCK input low time (Slave mode) TCY + 20 — — ns SP73* TDIV2SCH, TDIV2SCL Setup time of SDI data input to SCK edge 100 — — ns SP74* TSCH2DIL, TSCL2DIL Hold time of SDI data input to SCK edge 100 — — ns SP75* TDOR SDO data output rise time 3.0-5.5V — 10 25 ns 1.8-5.5V — 25 50 ns SP76* TDOF SDO data output fall time — 10 25 ns SP77* TSSH2DOZ SS↑ to SDO output high-impedance 10 — 50 ns SP78* TSCR SCK output rise time (Master mode) 3.0-5.5V — 10 25 ns 1.8-5.5V — 25 50 ns SP79* TSCF SCK output fall time (Master mode) — 10 25 ns SP80* TSCH2DOV, TSCL2DOV SDO data output valid after SCK edge 3.0-5.5V — — 50 ns 1.8-5.5V — — 145 ns SP81* TDOV2SCH, TDOV2SCL SDO data output setup to SCK edge Tcy — — ns SP82* TSSL2DOV SDO data output valid after SS↓ edge — — 50 ns SP83* TSCH2SSH, TSCL2SSH SS ↑ after SCK edge 1.5TCY + 40 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: Refer to Figure 27-2 for load conditions. SP91 SP92 SP93 SCL SDA Start Condition Stop Condition SP90 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 388 Preliminary © 2009 Microchip Technology Inc. TABLE 27-16: I2C™ BUS START/STOP BITS REQUIREMENTS FIGURE 27-20: I2C™ BUS DATA TIMING Param No. Symbol Characteristic Min Typ Max Units Conditions SP90* TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for Repeated Setup time 400 kHz mode 600 — — Start condition SP91* THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first Hold time 400 kHz mode 600 — — clock pulse is generated SP92* TSU:STO Stop condition 100 kHz mode 4700 — — ns Setup time 400 kHz mode 600 — — SP93 THD:STO Stop condition 100 kHz mode 4000 — — ns Hold time 400 kHz mode 600 — — * These parameters are characterized but not tested. Note: Refer to Figure 27-2 for load conditions. SP90 SP91 SP92 SP100 SP101 SP103 SP106 SP107 SP109 SP109 SP110 SP102 SCL SDA In SDA Out © 2009 Microchip Technology Inc. Preliminary DS41350C-page 389 PIC18F1XK50/PIC18LF1XK50 TABLE 27-17: I2C™ BUS DATA REQUIREMENTS Param. No. Symbol Characteristic Min Max Units Conditions SP100* THIGH Clock high time 100 kHz mode 4.0 — μs Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — μs Device must operate at a minimum of 10 MHz SSP Module 1.5TCY — SP101* TLOW Clock low time 100 kHz mode 4.7 — μs Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — μs Device must operate at a minimum of 10 MHz SSP Module 1.5TCY — SP102* TR SDA and SCL rise time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1CB 300 ns CB is specified to be from 10-400 pF SP103* TF SDA and SCL fall time 100 kHz mode — 250 ns 400 kHz mode 20 + 0.1CB 250 ns CB is specified to be from 10-400 pF SP90* TSU:STA Start condition setup time 100 kHz mode 4.7 — μs Only relevant for Repeated Start condition 400 kHz mode 0.6 — μs SP91* THD:STA Start condition hold time 100 kHz mode 4.0 — μs After this period the first clock pulse is generated 400 kHz mode 0.6 — μs SP106* THD:DAT Data input hold time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 μs SP107* TSU:DAT Data input setup time 100 kHz mode 250 — ns (Note 2) 400 kHz mode 100 — ns SP92* TSU:STO Stop condition setup time 100 kHz mode 4.7 — μs 400 kHz mode 0.6 — μs SP109* TAA Output valid from clock 100 kHz mode — 3500 ns (Note 1) 400 kHz mode — — ns SP110* TBUF Bus free time 100 kHz mode 4.7 — μs Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — μs SP CB Bus capacitive loading — 400 pF * These parameters are characterized but not tested. Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A Fast mode (400 kHz) I2C bus device can be used in a Standard mode (100 kHz) I2C bus system, but the requirement TSU:DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 390 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 391 PIC18F1XK50/PIC18LF1XK50 28.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES Graphs and tables are not available at this time. PIC18F1XK50/PIC18LF1XK50 DS41350C-page 392 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 393 PIC18F1XK50/PIC18LF1XK50 29.0 PACKAGING INFORMATION 29.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 20-Lead PDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example PICXXFXXXX-I/P 0810017 20-Lead SSOP XXXXXXXXXXX XXXXXXXXXXX YYWWNNN Example PICXXFXXXX -I/SS 0810017 20-Lead SOIC (.300”) XXXXXXXXXXXXXX XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example PICXXFXXXX-I /SO 0810017 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 394 Preliminary © 2009 Microchip Technology Inc. 29.2 Package Details The following sections give the technical details of the packages.                   !" #$% &"'  ()"&'"!&) &#*&& &#    + % &,  &!& - '!! #.#&"#'#% ! &"!!#% ! &"!!! &$#/ !#  '!  #&   .0 1,2 1 !'!& $ & "!**&"&& !  3&'!&"& 4 # * !(  !!&  4   % & &# & && 255***' '5 4  6&! 7,8. 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Preliminary DS41350C-page 397 PIC18F1XK50/PIC18LF1XK50 APPENDIX A: REVISION HISTORY Revision A (May 2008) Original data sheet for PIC18F1XK50/PIC18LF1XK50 devices. Revision B (June 2008) Revised 27.4 DC Characteristics table. Revision C (04/2009) Revised data sheet title; Revised Features section; Revised Table 1-2; Revised Table 3-1, Table 3-2; Added Note 3 in Section 9.1; Revised Register 14-1; Revised Example 16-1; Revised Section 18.8.4; Revised Register 18-3; Revised Table 20-2; Revised Sections 22.2.1, 22.2.2, 22.5.1.1, 22.7; Revised Tables 23-4, 27-1, 27-2, 27-3 27-4, 27-8. APPENDIX B: DEVICE DIFFERENCES The differences between the devices listed in this data sheet are shown in Table B-1. TABLE B-1: DEVICE DIFFERENCES Features PIC18F13K50 PIC18F14K50 PIC18LF13K50 PIC18F26K20 PIC18LF14K50 PIC18F44K20 PIC18F45K20 PIC18F46K20 Program Memory (Bytes) 8192 16384 32768 65536 8192 16384 32768 65536 Program Memory (Instructions) 4096 8192 16384 32768 4096 8192 16384 32768 Interrupt Sources 19 19 19 19 20 20 20 20 I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E Capture/Compare/ PWM Modules 11 1 1 1 111 Enhanced Capture/Compare/ PWM Modules 11 1 1 1 111 Parallel Communications (PSP) No No No No Yes Yes Yes Yes 10-bit Analog-toDigital Module 11 input channels 11 input channels 11 input channels 11 input channels 14 input channels 14 input channels 14 input channels 14 input channels Packages 20-pin PDIP 20-pin SOIC 20-pin SSOP 20-pin PDIP 20-pin SOIC 20-pin SSOP 20-pin PDIP 20-pin SOIC 20-pin SSOP 28-pin PDIP 28-pin SOIC 28-pin SSOP 28-pin QFN 20-pin PDIP 20-pin SOIC 20-pin SSOP 40-pin PDIP 44-pin TQFP 44-pin QFN 40-pin PDIP 44-pin TQFP 44-pin QFN 40-pin PDIP 44-pin TQFP 44-pin QFN PIC18F1XK50/PIC18LF1XK50 DS41350C-page 398 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 399 PIC18F1XK50/PIC18LF1XK50 INDEX A A/D Analog Port Pins, Configuring .................................. 217 Associated Registers ............................................... 217 Conversions ............................................................. 208 Discharge ................................................................. 209 Selecting and Configuring Acquisition Time ............ 206 Specifications ........................................................... 381 Absolute Maximum Ratings ............................................. 357 AC Characteristics Industrial and Extended ........................................... 373 Load Conditions ....................................................... 372 Access Bank Mapping with Indexed Literal Offset Mode ................. 46 ACKSTAT ........................................................................ 167 ACKSTAT Status Flag ..................................................... 167 ADC ................................................................................. 205 Acquisition Requirements ........................................ 215 Block Diagram .......................................................... 205 Calculating Acquisition Time .................................... 215 Channel Selection .................................................... 206 Configuration ............................................................ 206 Conversion Clock ..................................................... 206 Conversion Procedure ............................................. 210 Internal Sampling Switch (RSS) IMPEDANCE ............. 215 Interrupts .................................................................. 207 Operation ................................................................. 208 Operation During Sleep ........................................... 209 Port Configuration .................................................... 206 Power Management ................................................. 209 Reference Voltage (VREF) ........................................ 206 Result Formatting ..................................................... 207 Source Impedance ................................................... 215 Special Event Trigger ............................................... 209 Starting an A/D Conversion ..................................... 207 ADCON0 Register ............................................................ 211 ADCON1 Register .................................................... 212, 213 ADDFSR .......................................................................... 346 ADDLW ............................................................................ 309 ADDULNK ........................................................................ 346 ADDWF ............................................................................ 309 ADDWFC ......................................................................... 310 ADRESH Register (ADFM = 0) ........................................ 214 ADRESH Register (ADFM = 1) ........................................ 214 ADRESL Register (ADFM = 0) ......................................... 214 ADRESL Register (ADFM = 1) ......................................... 214 Analog Input Connection Considerations ......................... 227 Analog-to-Digital Converter. See ADC ANDLW ............................................................................ 310 ANDWF ............................................................................ 311 ANSEL (PORT Analog Control) ......................................... 94 ANSEL Register ................................................................. 94 ANSELH Register .............................................................. 95 Assembler MPASM Assembler .................................................. 354 B Bank Select Register (BSR) ............................................... 31 Baud Rate Generator ....................................................... 163 BAUDCON Register ......................................................... 188 BC .................................................................................... 311 BCF .................................................................................. 312 BF .................................................................................... 167 BF Status Flag ................................................................. 167 Block Diagrams ADC ......................................................................... 205 ADC Transfer Function ............................................ 216 Analog Input Model .......................................... 216, 227 Baud Rate Generator .............................................. 163 Capture Mode Operation ......................................... 115 Clock Source ............................................................. 12 Comparator 1 ........................................................... 220 Comparator 2 ........................................................... 221 Crystal Operation ....................................................... 13 EUSART Receive .................................................... 178 EUSART Transmit ................................................... 177 External POR Circuit (Slow VDD Power-up) ............ 273 External RC Mode ..................................................... 14 Fail-Safe Clock Monitor (FSCM) ................................ 22 Generic I/O Port ......................................................... 79 Interrupt Logic ............................................................ 64 MSSP (I2C Master Mode) ........................................ 161 MSSP (I2C Mode) .................................................... 144 MSSP (SPI Mode) ................................................... 135 On-Chip Reset Circuit .............................................. 271 PIC18F1XK50/PIC18LF1XK50 .................................... 8 PWM (Enhanced) .................................................... 117 Reads from Flash Program Memory ......................... 51 Resonator Operation ................................................. 14 Table Read Operation ............................................... 47 Table Write Operation ............................................... 48 Table Writes to Flash Program Memory .................... 53 Timer0 in 16-Bit Mode ............................................... 99 Timer0 in 8-Bit Mode ................................................. 98 Timer1 ..................................................................... 102 Timer1 (16-Bit Read/Write Mode) ............................ 102 Timer2 ..................................................................... 108 Timer3 ..................................................................... 110 Timer3 (16-Bit Read/Write Mode) ............................ 111 USB Interrupt Logic ................................................. 259 USB Peripheral and Options ................................... 245 Voltage Reference ................................................... 242 Voltage Reference Output Buffer Example ............. 242 Watchdog Timer ...................................................... 296 BN .................................................................................... 312 BNC ................................................................................. 313 BNN ................................................................................. 313 BNOV .............................................................................. 314 BNZ ................................................................................. 314 BOR. See Brown-out Reset. BOV ................................................................................. 317 BRA ................................................................................. 315 Break Character (12-bit) Transmit and Receive .............. 196 BRG. See Baud Rate Generator. Brown-out Reset (BOR) ................................................... 274 Detecting ................................................................. 274 Disabling in Sleep Mode .......................................... 274 Software Enabled .................................................... 274 Specifications .......................................................... 379 Timing and Characteristics ...................................... 378 BSF .................................................................................. 315 BTFSC ............................................................................. 316 BTFSS ............................................................................. 316 BTG ................................................................................. 317 BZ .................................................................................... 318 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 400 Preliminary © 2009 Microchip Technology Inc. C C Compilers MPLAB C18 ............................................................. 354 MPLAB C30 ............................................................. 354 CALL ................................................................................ 318 CALLW ............................................................................. 347 Capture (CCP Module) ..................................................... 115 CCP Pin Configuration ............................................. 115 CCPRxH:CCPRxL Registers ................................... 115 Prescaler .................................................................. 115 Software Interrupt .................................................... 115 Timer1/Timer3 Mode Selection ................................ 115 Capture/Compare/PWM (CCP) Capture Mode. See Capture. CCP Mode and Timer Resources ............................114 Compare Mode. See Compare. CCP1CON Register ......................................................... 113 Clock Accuracy with Asynchronous Operation ................ 186 Clock Sources Associated registers ...................................................23 External Modes HS ......................................................................13 LP ....................................................................... 13 XT ......................................................................13 CLRF ................................................................................ 319 CLRWDT .......................................................................... 319 CM1CON0 Register ......................................................... 225 CM2CON0 Register ......................................................... 226 CM2CON1 Register ......................................................... 229 Code Examples 16 x 16 Signed Multiply Routine ................................62 16 x 16 Unsigned Multiply Routine ............................62 8 x 8 Signed Multiply Routine .................................... 61 8 x 8 Unsigned Multiply Routine ................................61 A/D Conversion ........................................................ 210 Changing Between Capture Prescalers ................... 115 Clearing RAM Using Indirect Addressing ................... 42 Computed GOTO Using an Offset Value ................... 28 Data EEPROM Read .................................................59 Data EEPROM Refresh Routine ................................60 Data EEPROM Write .................................................59 Erasing a Flash Program Memory Row ..................... 52 Fast Register Stack .................................................... 28 Implementing a Timer1 Real-Time Clock ................. 105 Initializing PORTA ...................................................... 80 Initializing PORTB ...................................................... 85 Initializing PORTC ...................................................... 90 Loading the SSPBUF (SSPSR) Register ................. 138 Reading a Flash Program Memory Word .................. 51 Saving Status, WREG and BSR Registers in RAM ... 75 Writing to Flash Program Memory ....................... 54–55 Code Protection ............................................................... 285 COMF ............................................................................... 320 Comparator Associated Registers ...............................................230 Operation ................................................................. 219 Operation During Sleep ........................................... 224 Response Time ........................................................ 222 Comparator Module ......................................................... 219 C1 Output State Versus Input Conditions ................ 222 Comparator Specifications ...............................................383 Comparator Voltage Reference (CVREF) Response Time ........................................................ 222 Comparator Voltage Reference (CVREF) Associated Registers ...............................................244 Effects of a Reset ............................................ 224, 241 Operation During Sleep ........................................... 241 Overview .................................................................. 241 Comparators Effects of a Reset .................................................... 224 Compare (CCP Module) .................................................. 116 CCPRx Register ...................................................... 116 Pin Configuration ..................................................... 116 Software Interrupt .................................................... 116 Special Event Trigger ...................................... 112, 116 Timer1/Timer3 Mode Selection ................................ 116 Computed GOTO ............................................................... 28 CONFIG1H Register ................................................ 287, 288 CONFIG1L Register ........................................................ 287 CONFIG2H Register ........................................................ 290 CONFIG2L Register ........................................................ 289 CONFIG3H Register ........................................................ 291 CONFIG4L Register ........................................................ 291 CONFIG5H Register ........................................................ 292 CONFIG5L Register ........................................................ 292 CONFIG6H Register ........................................................ 293 CONFIG6L Register ........................................................ 293 CONFIG7H Register ........................................................ 294 CONFIG7L Register ........................................................ 294 Configuration Bits ............................................................ 286 Configuration Register Protection .................................... 301 Context Saving During Interrupts ....................................... 75 CPFSEQ .......................................................................... 320 CPFSGT .......................................................................... 321 CPFSLT ........................................................................... 321 Customer Change Notification Service ............................ 409 Customer Notification Service ......................................... 409 Customer Support ............................................................ 409 CVREF Voltage Reference Specifications ........................ 383 D Data Addressing Modes .................................................... 42 Comparing Addressing Modes with the Extended Instruction Set Enabled ..................... 45 Direct ......................................................................... 42 Indexed Literal Offset ................................................ 44 Instructions Affected .......................................... 44 Indirect ....................................................................... 42 Inherent and Literal .................................................... 42 Data EEPROM Code Protection ....................................................... 301 Data EEPROM Memory ..................................................... 57 Associated Registers ................................................. 60 EEADR and EEADRH Registers ............................... 57 EECON1 and EECON2 Registers ............................. 57 Operation During Code-Protect ................................. 60 Protection Against Spurious Write ............................. 60 Reading ..................................................................... 59 Using ......................................................................... 60 Write Verify ................................................................ 59 Writing ....................................................................... 59 Data Memory ..................................................................... 31 Access Bank .............................................................. 35 and the Extended Instruction Set .............................. 44 Bank Select Register (BSR) ...................................... 31 General Purpose Registers ....................................... 35 Map for PIC18F13K50/PIC18LF13K50 ..................... 32 Map for PIC18F14K50/PIC18LF14K50 ..................... 33 Special Function Registers ........................................ 35 USB RAM .................................................................. 31 DAW ................................................................................ 322 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 401 PIC18F1XK50/PIC18LF1XK50 DC and AC Characteristics Graphs and Tables .................................................. 391 DC Characteristics Extended and Industrial ........................................... 368 Industrial and Extended ........................................... 358 DCFSNZ .......................................................................... 323 DECF ............................................................................... 322 DECFSZ ........................................................................... 323 Development Support ...................................................... 353 Device Differences ........................................................... 397 Device Overview .................................................................. 5 Details on Individual Family Members ......................... 6 Features (28-Pin Devices) ........................................... 7 New Core Features ...................................................... 5 Other Special Features ................................................ 6 Device Reset Timers ........................................................ 275 Oscillator Start-up Timer (OST) ............................... 275 PLL Lock Time-out ................................................... 275 Power-up Timer (PWRT) ......................................... 275 Time-out Sequence .................................................. 275 DEVID1 Register .............................................................. 295 DEVID2 Register .............................................................. 295 Direct Addressing ............................................................... 43 E ECCPAS Register ............................................................ 125 EECON1 Register ........................................................ 49, 58 Effect on Standard PIC Instructions ................................. 350 Electrical Specifications ................................................... 357 Enhanced Capture/Compare/PWM (ECCP) .................... 113 Associated Registers ............................................... 133 Enhanced PWM Mode ............................................. 117 Auto-Restart ..................................................... 126 Auto-shutdown ................................................. 125 Direction Change in Full-Bridge Output Mode . 123 Full-Bridge Application ..................................... 121 Full-Bridge Mode ............................................. 121 Half-Bridge Application .................................... 120 Half-Bridge Application Examples ................... 127 Half-Bridge Mode ............................................. 120 Output Relationships (Active-High and Active-Low) .............................................. 118 Output Relationships Diagram ......................... 119 Programmable Dead Band Delay .................... 127 Shoot-through Current ..................................... 127 Start-up Considerations ................................... 124 Outputs and Configuration ....................................... 114 Specifications ........................................................... 381 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................. 177 Equations Estimating USB Transceiver Current Consumption . 267 Errata ................................................................................... 4 EUSART .......................................................................... 177 Asynchronous Mode ................................................ 179 12-bit Break Transmit and Receive ................. 196 Associated Registers, Receive ........................ 185 Associated Registers, Transmit ....................... 181 Auto-Wake-up on Break .................................. 194 Baud Rate Generator (BRG) ........................... 189 Clock Accuracy ................................................ 186 Receiver ........................................................... 182 Setting up 9-bit Mode with Address Detect ...... 184 Transmitter ....................................................... 179 Baud Rate Generator (BRG) Associated Registers ....................................... 189 Auto Baud Rate Detect .................................... 193 Baud Rate Error, Calculating ........................... 189 Baud Rates, Asynchronous Modes ................. 190 Formulas .......................................................... 189 High Baud Rate Select (BRGH Bit) ................. 189 Clock polarity Synchronous Mode .......................................... 197 Data polarity Asynchronous Receive .................................... 182 Asynchronous Transmit ................................... 179 Synchronous Mode .......................................... 197 Interrupts Asynchronous Receive .................................... 183 Asynchronous Transmit ................................... 179 Synchronous Master Mode .............................. 197, 202 Associated Registers, Receive ........................ 201 Associated Registers, Transmit ............... 199, 202 Reception ........................................................ 200 Transmission ................................................... 197 Synchronous Slave Mode Associated Registers, Receive ........................ 203 Reception ........................................................ 203 Transmission ................................................... 202 Extended Instruction Set ADDFSR .................................................................. 346 ADDULNK ............................................................... 346 and Using MPLAB Tools ......................................... 352 CALLW .................................................................... 347 Considerations for Use ............................................ 350 MOVSF .................................................................... 347 MOVSS .................................................................... 348 PUSHL ..................................................................... 348 SUBFSR .................................................................. 349 SUBULNK ................................................................ 349 Syntax ...................................................................... 345 F Fail-Safe Clock Monitor ............................................. 22, 285 Fail-Safe Condition Clearing ...................................... 23 Fail-Safe Detection .................................................... 22 Fail-Safe Operation ................................................... 22 Reset or Wake-up from Sleep ................................... 23 Fast Register Stack ........................................................... 28 Firmware Instructions ...................................................... 303 Flash Program Memory ..................................................... 47 Associated Registers ................................................. 55 Control Registers ....................................................... 48 EECON1 and EECON2 ..................................... 48 TABLAT (Table Latch) Register ........................ 50 TBLPTR (Table Pointer) Register ...................... 50 Erase Sequence ........................................................ 52 Erasing ...................................................................... 52 Operation During Code-Protect ................................. 55 Reading ..................................................................... 51 Table Pointer Boundaries Based on Operation ....................... 50 Table Pointer Boundaries .......................................... 50 Table Reads and Table Writes .................................. 47 Write Sequence ......................................................... 53 Writing To .................................................................. 53 Protection Against Spurious Writes ................... 55 Unexpected Termination ................................... 55 Write Verify ........................................................ 55 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 402 Preliminary © 2009 Microchip Technology Inc. G General Call Address Support ......................................... 160 GOTO ............................................................................... 324 H Hardware Multiplier ............................................................ 61 Introduction ................................................................ 61 Operation ................................................................... 61 Performance Comparison .......................................... 61 I I/O Ports ............................................................................. 79 I 2C Associated Registers ...............................................176 I 2C Mode (MSSP) Acknowledge Sequence Timing ............................... 170 Baud Rate Generator ...............................................163 Bus Collision During a Repeated Start Condition .................. 174 During a Stop Condition ................................... 175 Clock Arbitration ....................................................... 164 Clock Stretching ....................................................... 156 10-Bit Slave Receive Mode (SEN = 1) ............. 156 10-Bit Slave Transmit Mode ............................. 156 7-Bit Slave Receive Mode (SEN = 1) ............... 156 7-Bit Slave Transmit Mode ............................... 156 Clock Synchronization and the CKP bit (SEN = 1) .. 157 Effects of a Reset ..................................................... 171 General Call Address Support ................................. 160 I 2C Clock Rate w/BRG ............................................. 163 Master Mode ............................................................ 161 Operation ......................................................... 162 Reception ......................................................... 167 Repeated Start Condition Timing ..................... 166 Start Condition Timing ..................................... 165 Transmission .................................................... 167 Multi-Master Communication, Bus Collision and Arbitration .................................................. 171 Multi-Master Mode ...................................................171 Operation ................................................................. 148 Read/Write Bit Information (R/W Bit) ............... 148, 149 Registers .................................................................. 144 Serial Clock (RC3/SCK/SCL) ................................... 149 Slave Mode .............................................................. 148 Addressing ....................................................... 148 Reception ......................................................... 149 Transmission .................................................... 149 Sleep Operation ....................................................... 171 Stop Condition Timing .............................................. 170 ID Locations ............................................................. 285, 301 INCF ................................................................................. 324 INCFSZ ............................................................................ 325 In-Circuit Debugger .......................................................... 301 In-Circuit Serial Programming (ICSP) ...................... 285, 301 Indexed Literal Offset Addressing and Standard PIC18 Instructions ............................. 350 Indexed Literal Offset Mode ............................................. 350 Indirect Addressing ............................................................ 43 INFSNZ ............................................................................ 325 Initialization Conditions for all Registers .................. 279–283 Instruction Cycle ................................................................. 29 Clocking Scheme ....................................................... 29 Instruction Flow/Pipelining .................................................29 Instruction Set .................................................................. 303 ADDLW ....................................................................309 ADDWF .................................................................... 309 ADDWF (Indexed Literal Offset Mode) .................... 351 ADDWFC ................................................................. 310 ANDLW .................................................................... 310 ANDWF .................................................................... 311 BC ............................................................................ 311 BCF ......................................................................... 312 BN ............................................................................ 312 BNC ......................................................................... 313 BNN ......................................................................... 313 BNOV ...................................................................... 314 BNZ ......................................................................... 314 BOV ......................................................................... 317 BRA ......................................................................... 315 BSF .......................................................................... 315 BSF (Indexed Literal Offset Mode) .......................... 351 BTFSC ..................................................................... 316 BTFSS ..................................................................... 316 BTG ......................................................................... 317 BZ ............................................................................ 318 CALL ........................................................................ 318 CLRF ....................................................................... 319 CLRWDT ................................................................. 319 COMF ...................................................................... 320 CPFSEQ .................................................................. 320 CPFSGT .................................................................. 321 CPFSLT ................................................................... 321 DAW ........................................................................ 322 DCFSNZ .................................................................. 323 DECF ....................................................................... 322 DECFSZ .................................................................. 323 Extended Instruction Set ......................................... 345 General Format ........................................................ 305 GOTO ...................................................................... 324 INCF ........................................................................ 324 INCFSZ .................................................................... 325 INFSNZ .................................................................... 325 IORLW ..................................................................... 326 IORWF ..................................................................... 326 LFSR ....................................................................... 327 MOVF ...................................................................... 327 MOVFF .................................................................... 328 MOVLB .................................................................... 328 MOVLW ................................................................... 329 MOVWF ................................................................... 329 MULLW .................................................................... 330 MULWF .................................................................... 330 NEGF ....................................................................... 331 NOP ......................................................................... 331 Opcode Field Descriptions ....................................... 304 POP ......................................................................... 332 PUSH ....................................................................... 332 RCALL ..................................................................... 333 RESET ..................................................................... 333 RETFIE .................................................................... 334 RETLW .................................................................... 334 RETURN .................................................................. 335 RLCF ....................................................................... 335 RLNCF ..................................................................... 336 RRCF ....................................................................... 336 RRNCF .................................................................... 337 SETF ....................................................................... 337 SETF (Indexed Literal Offset Mode) ........................ 351 SLEEP ..................................................................... 338 SUBFWB ................................................................. 338 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 403 PIC18F1XK50/PIC18LF1XK50 SUBLW .................................................................... 339 SUBWF .................................................................... 339 SUBWFB .................................................................. 340 SWAPF .................................................................... 340 TBLRD ..................................................................... 341 TBLWT ..................................................................... 342 TSTFSZ ................................................................... 343 XORLW .................................................................... 343 XORWF .................................................................... 344 INTCON Register ............................................................... 65 INTCON Registers ....................................................... 65–67 INTCON2 Register ............................................................. 66 INTCON3 Register ............................................................. 67 Inter-Integrated Circuit. See I2C. Internal Oscillator Block INTOSC Specifications ........................................... 376, 377 Internal RC Oscillator Use with WDT .......................................................... 296 Internal Sampling Switch (RSS) IMPEDANCE ..................... 215 Internet Address ............................................................... 409 Interrupt Sources ............................................................. 285 ADC ......................................................................... 207 Capture Complete (CCP) ......................................... 115 Compare Complete (CCP) ....................................... 116 Interrupt-on-Change (RB7:RB4) .......................... 79, 85 INTn Pin ..................................................................... 75 PORTB, Interrupt-on-Change .................................... 75 TMR0 ......................................................................... 75 TMR0 Overflow .......................................................... 99 TMR1 Overflow ........................................................ 101 TMR3 Overflow ................................................ 109, 111 Interrupts ............................................................................ 63 INTOSC Specifications ............................................ 376, 377 IOCA Register .................................................................... 82 IOCB Register .................................................................... 87 IORLW ............................................................................. 326 IORWF ............................................................................. 326 IPR Registers ..................................................................... 72 IPR1 Register ..................................................................... 72 IPR2 Register ..................................................................... 73 L LATA Register .................................................................... 82 LATB Register .................................................................... 87 LATC Register ................................................................... 91 LFSR ................................................................................ 327 Load Conditions ............................................................... 372 Low-Voltage ICSP Programming. See Single-Supply ICSP Programming M Master Clear (MCLR) ....................................................... 273 Master Synchronous Serial Port (MSSP). See MSSP. Memory Organization ......................................................... 25 Data Memory ............................................................. 31 Program Memory ....................................................... 25 Microchip Internet Web Site ............................................. 409 MOVF ............................................................................... 327 MOVFF ............................................................................ 328 MOVLB ............................................................................ 328 MOVLW ........................................................................... 329 MOVSF ............................................................................ 347 MOVSS ............................................................................ 348 MOVWF ........................................................................... 329 MPLAB ASM30 Assembler, Linker, Librarian .................. 354 MPLAB ICD 2 In-Circuit Debugger .................................. 355 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator ................................................... 355 MPLAB Integrated Development Environment Software . 353 MPLAB PM3 Device Programmer ................................... 355 MPLAB REAL ICE In-Circuit Emulator System ............... 355 MPLINK Object Linker/MPLIB Object Librarian ............... 354 MSSP ACK Pulse ....................................................... 148, 149 I 2C Mode. See I 2C Mode. Module Overview ..................................................... 135 SPI Mode. See SPI Mode. SSPBUF Register .................................................... 140 SSPSR Register ...................................................... 140 MULLW ............................................................................ 330 MULWF ............................................................................ 330 N NEGF ............................................................................... 331 NOP ................................................................................. 331 O OSCCON Register ....................................................... 16, 17 Oscillator Module ............................................................... 11 Oscillator Parameters ...................................................... 376 Oscillator Selection .......................................................... 285 Oscillator Specifications ................................................... 375 Oscillator Start-up Timer (OST) ....................................... 275 Specifications .......................................................... 379 Oscillator Switching Fail-Safe Clock Monitor ............................................. 22 Oscillator, Timer1 ..................................................... 101, 111 Oscillator, Timer3 ............................................................. 109 OSCTUNE Register ........................................................... 18 P P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/PWM (ECCP) .................................................................... 117 Packaging Information ..................................................... 393 Marking .................................................................... 393 PICSTART Plus Development Programmer .................... 356 PIE Registers ..................................................................... 70 PIE1 Register .................................................................... 70 PIE2 Register .................................................................... 71 Pinout Descriptions PIC18F1XK50/PIC18LF1XK50 .................................... 9 PIR Registers ..................................................................... 68 PIR1 Register .................................................................... 68 PIR2 Register .................................................................... 69 POP ................................................................................. 332 POR. See Power-on Reset. PORTA Associated Registers ................................................. 84 LATA Register ........................................................... 79 PORTA Register ........................................................ 79 Specifications .......................................................... 377 TRISA Register .......................................................... 79 PORTA Register ................................................................ 81 PORTB Associated Registers ................................................. 89 LATB Register ........................................................... 85 PORTB Register ........................................................ 85 TRISB Register .......................................................... 85 PORTB Register .......................................................... 86, 90 PORTC Associated Registers ................................................. 93 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 404 Preliminary © 2009 Microchip Technology Inc. LATC Register ........................................................... 90 PORTC Register ........................................................ 90 RC3/SCK/SCL Pin ...................................................149 Specifications ........................................................... 377 TRISC Register .......................................................... 90 Power Managed Modes ...................................................231 and A/D Operation ...................................................209 and PWM Operation ................................................ 132 and SPI Operation ...................................................143 Entering ....................................................................231 Exiting Idle and Sleep Modes .................................. 235 by Interrupt ....................................................... 235 by Reset ........................................................... 236 by WDT Time-out ............................................. 235 Without a Start-up Delay .................................. 236 Idle Modes ............................................................... 233 PRI_IDLE ......................................................... 234 RC_IDLE .......................................................... 235 SEC_IDLE ........................................................ 234 Multiple Sleep Functions .......................................... 232 Run Modes ............................................................... 232 PRI_RUN ......................................................... 232 RC_RUN .......................................................... 232 SEC_RUN ........................................................ 232 Selecting .................................................................. 231 Sleep Mode .............................................................. 233 Summary (table) ...................................................... 231 Power-on Reset (POR) .................................................... 273 Power-up Timer (PWRT) ......................................... 275 Time-out Sequence .................................................. 275 Power-up Timer (PWRT) Specifications ........................................................... 379 Precision Internal Oscillator Parameters ..........................377 Prescaler, Timer0 ............................................................... 99 PRI_IDLE Mode ............................................................... 234 PRI_RUN Mode ............................................................... 232 Program Counter ................................................................ 26 PCL, PCH and PCU Registers ................................... 26 PCLATH and PCLATU Registers ..............................26 Program Memory and Extended Instruction Set ..................................... 46 Code Protection ....................................................... 299 Instructions ................................................................. 30 Two-Word .......................................................... 30 Interrupt Vector .......................................................... 25 Look-up Tables .......................................................... 28 Map and Stack (diagram) ........................................... 25 Reset Vector .............................................................. 25 Program Verification and Code Protection ....................... 298 Associated Registers ...............................................298 Programming, Device Instructions ................................... 303 PSTRCON Register ......................................................... 129 Pulse Steering .................................................................. 129 PUSH ............................................................................... 332 PUSH and POP Instructions .............................................. 27 PUSHL ............................................................................. 348 PWM (ECCP Module) Effects of a Reset ..................................................... 132 Operation in Power Managed Modes ...................... 132 Operation with Fail-Safe Clock Monitor ................... 132 Pulse Steering .......................................................... 129 Steering Synchronization ......................................... 131 PWM Mode. See Enhanced Capture/Compare/PWM .....117 PWM1CON Register ........................................................ 128 R RAM. See Data Memory. RC_IDLE Mode ................................................................ 235 RC_RUN Mode ................................................................ 232 RCALL ............................................................................. 333 RCON Register .......................................................... 74, 272 Bit Status During Initialization .................................. 278 RCREG ............................................................................ 184 RCSTA Register .............................................................. 187 Reader Response ............................................................ 410 RECON0 (Reference Control 0) Register ........................ 243 RECON1 (Reference Control 1) Register ........................ 243 RECON2 (Reference Control 2) Register ........................ 244 Register RCREG Register ..................................................... 193 Register File ....................................................................... 35 Register File Summary ...................................................... 37 Registers ADCON0 (ADC Control 0) ....................................... 211 ADCON1 (ADC Control 1) ............................... 212, 213 ADRESH (ADC Result High) with ADFM = 0) ......... 214 ADRESH (ADC Result High) with ADFM = 1) ......... 214 ADRESL (ADC Result Low) with ADFM = 0) ........... 214 ADRESL (ADC Result Low) with ADFM = 1) ........... 214 ANSEL (Analog Select 1) .......................................... 94 ANSEL (PORT Analog Control) ................................. 94 ANSELH (Analog Select 2) ........................................ 95 ANSELH (PORT Analog Control) .............................. 95 BAUDCON (EUSART Baud Rate Control) .............. 188 BDnSTAT (Buffer Descriptor n Status, CPU Mode) 255 BDnSTAT (Buffer Descriptor n Status, SIE Mode) .. 256 CCP1CON (Enhanced Capture/Compare/PWM Control) ............................................................ 113 CM1CON0 (C1 Control) ........................................... 225 CM2CON0 (C2 Control) ........................................... 226 CM2CON1 (C2 Control) ........................................... 229 CONFIG1H (Configuration 1 High) .................. 287, 288 CONFIG1L (Configuration 1 Low) ........................... 287 CONFIG2H (Configuration 2 High) .......................... 290 CONFIG2L (Configuration 2 Low) ........................... 289 CONFIG3H (Configuration 3 High) .......................... 291 CONFIG4L (Configuration 4 Low) ........................... 291 CONFIG5H (Configuration 5 High) .......................... 292 CONFIG5L (Configuration 5 Low) ........................... 292 CONFIG6H (Configuration 6 High) .......................... 293 CONFIG6L (Configuration 6 Low) ........................... 293 CONFIG7H (Configuration 7 High) .......................... 294 CONFIG7L (Configuration 7 Low) ........................... 294 DEVID1 (Device ID 1) .............................................. 295 DEVID2 (Device ID 2) .............................................. 295 ECCPAS (Enhanced CCP Auto-shutdown Control) 125 EECON1 (Data EEPROM Control 1) ................... 49, 58 INTCON (Interrupt Control) ........................................ 65 INTCON2 (Interrupt Control 2) ................................... 66 INTCON3 (Interrupt Control 3) ................................... 67 IOCA (Interrupt-on-Change PORTA) ......................... 82 IOCB (Interrupt-on-Change PORTB) ......................... 87 IPR1 (Peripheral Interrupt Priority 1) ......................... 72 IPR2 (Peripheral Interrupt Priority 2) ......................... 73 LATA (PORTA Data Latch) ........................................ 82 LATB (PORTB Data Latch) ........................................ 87 LATC (PORTC Data Latch) ....................................... 91 OSCCON (Oscillator Control) .............................. 16, 17 OSCTUNE (Oscillator Tuning) ................................... 18 PIE1 (Peripheral Interrupt Enable 1) .......................... 70 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 405 PIC18F1XK50/PIC18LF1XK50 PIE2 (Peripheral Interrupt Enable 2) .......................... 71 PIR1 (Peripheral Interrupt Request 1) ....................... 68 PIR2 (Peripheral Interrupt Request 2) ....................... 69 PORTA ....................................................................... 81 PORTB ................................................................. 86, 90 PSTRCON (Pulse Steering Control) ........................ 129 PWM1CON (Enhanced PWM Control) .................... 128 RCON (Reset Control) ....................................... 74, 272 RCSTA (Receive Status and Control) ...................... 187 REFCON0 ................................................................ 243 REFCON1 ................................................................ 243 REFCON2 ................................................................ 244 SLRCON (PORT Slew Rate Control) ......................... 96 SRCON0 (SR Latch Control 0) ................................ 238 SRCON1 (SR Latch Control 1) ................................ 239 SSPADD (MSSP Address and Baud Rate, SPI Mode) ........................................................ 155 SSPCON1 (MSSP Control 1, I2C Mode) ................. 146 SSPCON1 (MSSP Control 1, SPI Mode) ................. 137 SSPCON2 (MSSP Control 2, I2C Mode) ................. 147 SSPMSK (SSP Mask) .............................................. 154 SSPSTAT (MSSP Status, SPI Mode) .............. 136, 145 STATUS ..................................................................... 41 STKPTR (Stack Pointer) ............................................ 27 T0CON (Timer0 Control) ............................................ 97 T1CON (Timer1 Control) .......................................... 101 T2CON (Timer2 Control) .......................................... 107 T3CON (Timer3 Control) .......................................... 109 TRISA (Tri-State PORTA) .......................................... 81 TRISB (Tri-State PORTB) .................................... 86, 90 TXSTA (Transmit Status and Control) ..................... 186 UCFG (USB Configuration) ...................................... 248 UCON (USB Control) ............................................... 246 UEIE (USB Error Interrupt Enable) .......................... 264 UEIR (USB Error Interrupt Status) ........................... 263 UEPn (USB Endpoint n Control) .............................. 251 UIE (USB Interrupt Enable) ...................................... 262 UIR (USB Interrupt Status) ...................................... 260 USTAT (USB Status) ............................................... 250 WDTCON (Watchdog Timer Control) ...................... 297 WPUA (Weak Pull-up PORTA) .................................. 82 WPUB (Weak Pull-up PORTB) .................................. 87 RESET ............................................................................. 333 Reset State of Registers .................................................. 278 Resets ...................................................................... 271, 285 Brown-out Reset (BOR) ........................................... 285 Oscillator Start-up Timer (OST) ............................... 285 Power-on Reset (POR) ............................................ 285 Power-up Timer (PWRT) ......................................... 285 RETFIE ............................................................................ 334 RETLW ............................................................................ 334 RETURN .......................................................................... 335 Return Address Stack ........................................................ 26 Return Stack Pointer (STKPTR) ........................................ 27 Revision History ............................................................... 397 RLCF ................................................................................ 335 RLNCF ............................................................................. 336 RRCF ............................................................................... 336 RRNCF ............................................................................ 337 S SCK .................................................................................. 135 SDI ................................................................................... 135 SDO ................................................................................. 135 SEC_IDLE Mode .............................................................. 234 SEC_RUN Mode .............................................................. 232 Serial Clock, SCK ............................................................ 135 Serial Data In (SDI) .......................................................... 135 Serial Data Out (SDO) ..................................................... 135 Serial Peripheral Interface. See SPI Mode. SETF ............................................................................... 337 Shoot-through Current ..................................................... 127 Single-Supply ICSP Programming. Slave Select (SS) ............................................................. 135 Slave Select Synchronization .......................................... 141 SLEEP ............................................................................. 338 Sleep Mode ..................................................................... 233 SLRCON Register ............................................................. 96 Software Simulator (MPLAB SIM) ................................... 354 SPBRG ............................................................................ 189 SPBRGH ......................................................................... 189 Special Event Trigger ...................................................... 209 Special Event Trigger. See Compare (ECCP Mode). Special Features of the CPU ........................................... 285 Special Function Registers ................................................ 35 Map ............................................................................ 36 SPI Mode Typical Master/Slave Connection ............................ 139 SPI Mode (MSSP) Associated Registers ............................................... 143 Bus Mode Compatibility ........................................... 143 Effects of a Reset .................................................... 143 Enabling SPI I/O ...................................................... 139 Master Mode ............................................................ 140 Operation ................................................................. 138 Operation in Power Managed Modes ...................... 143 Serial Clock ............................................................. 135 Serial Data In ........................................................... 135 Serial Data Out ........................................................ 135 Slave Mode .............................................................. 141 Slave Select ............................................................. 135 Slave Select Synchronization .................................. 141 SPI Clock ................................................................. 140 Typical Connection .................................................. 139 SR Latch .......................................................................... 237 Associated Registers ............................................... 239 SRCON0 Register ........................................................... 238 SRCON1 Register ........................................................... 239 SS .................................................................................... 135 SSP Typical SPI Master/Slave Connection ..................... 139 SSPADD Register ............................................................ 155 SSPCON1 Register ................................................. 137, 146 SSPCON2 Register ......................................................... 147 SSPMSK Register ........................................................... 154 SSPOV ............................................................................ 167 SSPOV Status Flag ......................................................... 167 SSPSTAT Register .................................................. 136, 145 R/W Bit ............................................................ 148, 149 Stack Full/Underflow Resets .............................................. 28 Standard Instructions ....................................................... 303 STATUS Register .............................................................. 41 STKPTR Register .............................................................. 27 SUBFSR .......................................................................... 349 SUBFWB ......................................................................... 338 SUBLW ............................................................................ 339 SUBULNK ........................................................................ 349 SUBWF ............................................................................ 339 SUBWFB ......................................................................... 340 SWAPF ............................................................................ 340 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 406 Preliminary © 2009 Microchip Technology Inc. T T0CON Register ................................................................. 97 T1CON Register ............................................................... 101 T2CON Register ............................................................... 107 T3CON Register ............................................................... 109 Table Pointer Operations (table) ........................................ 50 Table Reads/Table Writes .................................................. 28 TBLRD ............................................................................. 341 TBLWT ............................................................................. 342 Thermal Considerations ...................................................371 Time-out in Various Situations (table) ..............................275 Timer0 ................................................................................ 97 Associated Registers .................................................99 Operation ................................................................... 98 Overflow Interrupt ...................................................... 99 Prescaler .................................................................... 99 Prescaler Assignment (PSA Bit) ................................99 Prescaler Select (T0PS2:T0PS0 Bits) ....................... 99 Prescaler. See Prescaler, Timer0. Reads and Writes in 16-Bit Mode ..............................98 Source Edge Select (T0SE Bit) .................................. 98 Source Select (T0CS Bit) ........................................... 98 Specifications ........................................................... 380 Switching Prescaler Assignment ................................99 Timer1 .............................................................................. 101 16-Bit Read/Write Mode ........................................... 103 Associated Registers ...............................................106 Interrupt ....................................................................104 Operation ................................................................. 102 Oscillator .......................................................... 101, 103 Oscillator Layout Considerations ............................. 104 Overflow Interrupt .................................................... 101 Resetting, Using the CCP Special Event Trigger .....104 Specifications ........................................................... 380 TMR1H Register ...................................................... 101 TMR1L Register ....................................................... 101 Use as a Real-Time Clock ....................................... 105 Timer2 .............................................................................. 107 Associated Registers ...............................................108 Interrupt ....................................................................108 Operation ................................................................. 107 Output ......................................................................108 Timer3 .............................................................................. 109 16-Bit Read/Write Mode ........................................... 111 Associated Registers ...............................................112 Operation ................................................................. 110 Oscillator .......................................................... 109, 111 Overflow Interrupt ............................................ 109, 111 Special Event Trigger (CCP) .................................... 112 TMR3H Register ...................................................... 109 TMR3L Register ....................................................... 109 Timing Diagrams A/D Conversion ........................................................ 382 Acknowledge Sequence .......................................... 170 Asynchronous Reception ......................................... 184 Asynchronous Transmission .................................... 180 Asynchronous Transmission (Back to Back) ........... 181 Auto Wake-up Bit (WUE) During Normal Operation 195 Auto Wake-up Bit (WUE) During Sleep ................... 195 Automatic Baud Rate Calculator ..............................193 Baud Rate Generator with Clock Arbitration ............ 164 BRG Reset Due to SDA Arbitration During Start Condition .................................................173 Brown-out Reset (BOR) ........................................... 378 Bus Collision During a Repeated Start Condition (Case 1) ........................................................... 174 Bus Collision During a Repeated Start Condition (Case 2) ........................................................... 174 Bus Collision During a Start Condition (SCL = 0) .... 173 Bus Collision During a Stop Condition (Case 1) ...... 175 Bus Collision During a Stop Condition (Case 2) ...... 175 Bus Collision During Start Condition (SDA only) ..... 172 Bus Collision for Transmit and Acknowledge .......... 171 CLKOUT and I/O ..................................................... 377 Clock Synchronization ............................................. 157 Clock Timing ............................................................ 373 Clock/Instruction Cycle .............................................. 29 Comparator Output .................................................. 219 Enhanced Capture/Compare/PWM (ECCP) ............ 381 Fail-Safe Clock Monitor (FSCM) ................................ 23 First Start Bit Timing ................................................ 165 Full-Bridge PWM Output .......................................... 122 Half-Bridge PWM Output ................................. 120, 127 I 2C Bus Data ............................................................ 388 I 2C Bus Start/Stop Bits ............................................ 387 I 2C Master Mode (7 or 10-Bit Transmission) ........... 168 I 2C Master Mode (7-Bit Reception) .......................... 169 I 2C Slave Mode (10-Bit Reception, SEN = 0) .......... 152 I 2C Slave Mode (10-Bit Reception, SEN = 1) .......... 159 I 2C Slave Mode (10-Bit Transmission) .................... 153 I 2C Slave Mode (7-bit Reception, SEN = 0) ............ 150 I 2C Slave Mode (7-Bit Reception, SEN = 1) ............ 158 I 2C Slave Mode (7-Bit Transmission) ...................... 151 I 2C Slave Mode General Call Address Sequence (7 or 10-Bit Address Mode) ............................ 160 I 2C Stop Condition Receive or Transmit Mode ........ 170 Internal Oscillator Switch Timing ............................... 19 PWM Auto-shutdown Auto-restart Enabled ........................................ 126 Firmware Restart ............................................. 126 PWM Direction Change ........................................... 123 PWM Direction Change at Near 100% Duty Cycle .. 124 PWM Output (Active-High) ...................................... 118 PWM Output (Active-Low) ....................................... 119 Repeat Start Condition ............................................ 166 Reset, WDT, OST and Power-up Timer .................. 378 Send Break Character Sequence ............................ 196 Slave Synchronization ............................................. 141 Slow Rise Time (MCLR Tied to VDD, VDD Rise > TPWRT) ............................................................ 277 SPI Master Mode (CKE = 1, SMP = 1) .................... 385 SPI Mode (Master Mode) ......................................... 140 SPI Mode (Slave Mode, CKE = 0) ........................... 142 SPI Mode (Slave Mode, CKE = 1) ........................... 142 SPI Slave Mode (CKE = 0) ...................................... 386 SPI Slave Mode (CKE = 1) ...................................... 386 Synchronous Reception (Master Mode, SREN) ...... 201 Synchronous Transmission ..................................... 198 Synchronous Transmission (Through TXEN) .......... 198 Time-out Sequence on POR w/PLL Enabled (MCLR Tied to VDD) ........................................ 277 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 1) ................................. 276 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 2) ................................. 276 Time-out Sequence on Power-up (MCLR Tied to VDD, VDD Rise < TPWRT) ..................... 276 Timer0 and Timer1 External Clock .......................... 380 Transition for Entry to Sleep Mode .......................... 233 © 2009 Microchip Technology Inc. Preliminary DS41350C-page 407 PIC18F1XK50/PIC18LF1XK50 Transition for Wake from Sleep (HSPLL) ................. 233 Transition Timing for Entry to Idle Mode .................. 234 Transition Timing for Wake from Idle to Run Mode . 234 USART Synchronous Receive (Master/Slave) ........ 384 USART Synchronous Transmission (Master/Slave) 384 Timing Diagrams and Specifications A/D Conversion Requirements ................................ 382 PLL Clock ................................................................. 376 Timing Parameter Symbology .......................................... 372 Timing Requirements I 2C Bus Data ............................................................ 389 I2C Bus Start/Stop Bits ............................................ 388 SPI Mode ................................................................. 387 Top-of-Stack Access .......................................................... 26 TRISA Register .................................................................. 81 TRISB Register ............................................................ 86, 90 TSTFSZ ........................................................................... 343 Two-Speed Start-up ......................................................... 285 Two-Word Instructions Example Cases .......................................................... 30 TXREG ............................................................................. 179 TXSTA Register ............................................................... 186 BRGH Bit ................................................................. 189 U Universal Serial Bus Address Register (UADDR) ..................................... 252 Associated Registers ............................................... 268 Buffer Descriptor Table ............................................ 253 Buffer Descriptors .................................................... 253 Address Validation ........................................... 256 Assignment in Different Buffering Modes ........ 258 BDnSTAT Register (CPU Mode) ..................... 254 BDnSTAT Register (SIE Mode) ....................... 256 Byte Count ....................................................... 256 Example ........................................................... 253 Memory Map .................................................... 257 Ownership ........................................................ 253 Ping-Pong Buffering ......................................... 257 Register Summary ........................................... 258 Status and Configuration ................................. 253 Class Specifications and Drivers ............................. 270 Descriptors ............................................................... 270 Endpoint Control ...................................................... 251 Enumeration ............................................................. 270 External Pull-up Resistors ........................................ 249 Eye Pattern Test Enable .......................................... 249 Firmware and Drivers ............................................... 268 Frame Number Registers ......................................... 252 Frames ..................................................................... 269 Internal Pull-up Resistors ......................................... 249 Internal Transceiver ................................................. 247 Interrupts .................................................................. 259 and USB Transactions ..................................... 259 Layered Framework ................................................. 269 Oscillator Requirements ........................................... 268 Overview .......................................................... 245, 269 Ping-Pong Buffer Configuration ............................... 249 Power ....................................................................... 269 Power Modes ........................................................... 265 Bus Power Only ............................................... 265 Dual Power with Self-Power Dominance ......... 266 Self-Power Only ............................................... 265 RAM ......................................................................... 252 Memory Map .................................................... 252 Speed ....................................................................... 270 Status and Control ................................................... 246 Transfer Types ........................................................ 269 UFRMH:UFRML Registers ...................................... 252 USART Synchronous Master Mode Requirements, Synchronous Receive ............. 384 Requirements, Synchronous Transmission ..... 384 Timing Diagram, Synchronous Receive .......... 384 Timing Diagram, Synchronous Transmission .. 384 USB Module Electrical Specifications .............................. 370 USB RAM Serial Interface Engine (SIE) ..................................... 31 USB. See Universal Serial Bus. V Voltage Reference (VR) Specifications .......................................................... 383 Voltage Reference. See Comparator Voltage Reference (CVREF) Voltage References Fixed Voltage Reference (FVR) .............................. 241 VR Stabilization ....................................................... 241 VREF. SEE ADC Reference Voltage W Wake-up on Break ........................................................... 194 Watchdog Timer (WDT) ........................................... 285, 296 Associated Registers ............................................... 297 Control Register ....................................................... 297 Programming Considerations .................................. 296 Specifications .......................................................... 379 WCOL ...................................................... 165, 166, 167, 170 WCOL Status Flag ................................... 165, 166, 167, 170 WDTCON Register .......................................................... 297 WPUA Register .................................................................. 82 WPUB Register .................................................................. 87 WWW Address ................................................................ 409 WWW, On-Line Support ...................................................... 4 X XORLW ........................................................................... 343 XORWF ........................................................................... 344 PIC18F1XK50/PIC18LF1XK50 DS41350C-page 408 Preliminary © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. Preliminary DS41350C-page 409 PIC18F1XK50/PIC18LF1XK50 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com PIC18F1XK50/PIC18LF1XK50 DS41350C-page 410 Preliminary © 2009 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC18F1XK50/PIC18LF1XK50 DS41350C 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? © 2009 Microchip Technology Inc. Preliminary DS41350C-page 411 PIC18F1XK50/PIC18LF1XK50 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Temperature Package Pattern Range Device Device: PIC18F13K50(1), PIC18F14K50(1), PIC18LF13K50(1), PIC18LF14K50 Temperature Range: E = -40°C to +125°C (Extended) Package: P = PDIP SO = SOIC SS = SSOP Pattern: QTP, SQTP, Code or Special Requirements (blank otherwise) Examples: a) PIC18F14K50-E/P 301 = Extended temp., PDIP package, Extended VDD limits, QTP pattern #301. b) PIC18LF14K50-E/SO = Extended temp., SOIC package. c) PIC18LF14K50-E/P = Extended temp., PDIP package. Note 1: T = in tape and reel PLCC, and TQFP packages only. DS41350C-page 412 Preliminary © 2009 Microchip Technology Inc. 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DS21424D-page 1 TC4431/TC4432 Features • High Peak Output Current – 1.5 A • Wide Input Supply Operating Range: - 4.5V to 30V • High Capacitive Load Drive Capability: - 1000 pF in 25 nsec • Short Delay Times – <78 nsec Typ. • Low Supply Current: - With Logic ‘1’ Input – 2.5 mA - With Logic ‘0’ Input – 300 µA • Low Output Impedance – 7 Ω • Latch-Up Protected: Will Withstand >300 mA Reverse Current • ESD Protected – 4 kV Applications • Small Motor Drive • Power MOSFET Driver • Driving Bipolar Transistors General Description The TC4431/TC4432 are 30V CMOS buffer/drivers suitable for use in high-side driver applications. They will not latch up under any conditions within their power and voltage ratings. They can accept, without damage or logic upset, up to 300 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4 kV of electrostatic discharge. Under-voltage lockout circuitry forces the output to a ‘low’ state when the input supply voltage drops below 7V. For operation at lower voltages, disable the lockout and start-up circuit by grounding pin 3 (LOCK DIS); for all other situations, pin 3 (LOCK DIS) should be left floating. The under-voltage lockout and start-up circuit gives brown out protection when driving MOSFETS. Package Type OUT TC4431 1 2 3 4 VDD 5 6 7 8 OUT GND VDD IN LOCK DIS GND TC4432 1 2 3 4 VDD 5 6 7 8 OUT GND VDD IN GND 2 7 Inverting Non Inverting OUT 6 LOCK DIS 2 7 6 8-Pin PDIP/SOIC/CERDIP 1.5A High-Speed 30V MOSFET Drivers TC4431/TC4432 DS21424D-page 2 © 2007 Microchip Technology Inc. Functional Block Diagram 2 mA OUT Input GND Effective Input C = 10 pF VDD TC4431/TC4432 Inverting/Non Inverting OUT UV LOCK Inverting TC4431 250 mV LOCK DIS 3 2 4, 5 Non Inverting TC4432 6 7 8 © 2007 Microchip Technology Inc. DS21424D-page 3 TC4431/TC4432 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Supply Voltage .......................................................36V Input Voltage (Note 1)................... VDD + 0.3V to GND Package Power Dissipation (TA ≤ 70°C) PDIP ............................................................730 mW CERDIP.......................................................800 mW SOIC............................................................470 mW Maximum Junction Temperature, TJ ................ +150°C Storage Temperature Range.............. -65°C to +150°C † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.4 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current (Note 1) IIN -1 — 1 µA 0V ≤ VIN ≤ 12V Output High Output Voltage VOH VDD – 1.0 VDD – 0.8 — V IOUT = 100 mA Low Output Voltage VOL — — 0.025 V Output Resistance RO — 7 10 Ω IOUT = 10 mA, VDD = 30V Peak Output Current IPK — — 3.0 1.5 — — A Source: VDD = 30V Sink: VDD = 30V Latch-Up Protection Withstand Reverse Current IREV — 0.3 — A Duty cycle ≤ 2%, t ≤ 300 µsec Switching Time (Note 2) Rise Time tR — 25 40 ns Figure 4-1 Fall Time tF — 33 50 ns Figure 4-1 Delay Time tD1 — 62 80 ns Figure 4-1 Delay Time tD2 — 78 90 ns Figure 4-1 Power Supply Power Supply Current IS — — 2.5 0.3 4 0.4 mA VIN = 3V VIN = 0V Start-up Threshold VS — 8.4 10 V Drop-out Threshold VDO 7 7.7 — V Note 3 Note 1: For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance Curves” for input current graph. 2: Switching times are ensured by design. 3: For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. TC4431/TC4432 DS21424D-page 4 © 2007 Microchip Technology Inc. DC CHARACTERISTICS TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, Over operating temperature range with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.4 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current (Note 1) IIN -10 — 10 µA 0V ≤ VIN ≤ 12V Output High Output Voltage VOH VDD – 1.2 — — V IOUT = 100 mA Low Output Voltage VOL — — 0.025 V Output Resistance RO — — 12 Ω IOUT = 10 mA, VDD = 30V Switching Time (Note 2) Rise Time tR — — 60 ns Figure 4-1 Fall Time tF — — 70 ns Figure 4-1 Delay Time tD1 — — 100 ns Figure 4-1 Delay Time tD2 — — 110 ns Figure 4-1 Power Supply Power Supply Current IS — — — — 6 0.7 mA VIN = 3V VIN = 0V Start-up Threshold VS — 8.4 10 V Drop-out Threshold VDO 7 7.7 — V Note 3 Note 1: For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance Curves” for input current graph. 2: Switching times are ensured by design. 3: For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) TA 0 — +70 ºC Specified Temperature Range (E) TA -40 — +85 ºC Specified Temperature Range (V) TA -40 — +125 ºC Maximum Junction Temperature TJ — — +150 ºC Storage Temperature Range TA -65 — +150 ºC Package Thermal Resistances: Thermal Resistance, 8L-SOIC θJA — 155 — ºC/W Thermal Resistance, 8L-PDIP θJA — 125 — ºC/W Thermal Resistance, 8L-CERDIP θJA — 150 — ºC/W © 2007 Microchip Technology Inc. DS21424D-page 5 TC4431/TC4432 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 30V. FIGURE 2-1: Supply Current vs. Capacitive Load. FIGURE 2-2: Input Current vs. Input Voltage. FIGURE 2-3: Rise/Fall Time vs. VDD. FIGURE 2-4: tD1 and tD2 Delay vs. VDD. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 100 1000 10,000 2 MHz 600 kHz 200 kHz 20 kHz 900 kHz V = 12V DD 60 50 40 30 20 10 0 ISUPPLY (mA) CLOAD (pF) INPUT CURRENT (mA) INPUT VOLTAGE (VIN) 50 3 6 12 15 18 21 24 27 30 9 40 30 20 10 0 WITHOUT 1 K RES. 45 35 25 15 5 WITH 1 K RES. Time (nsec) 3 6 12 15 18 21 24 27 30 9 150 125 100 75 50 25 0 tFALL VDD (V) CLOAD = 1000 pF TA = +25°C tRISE TIME (nsec) 3 6 12 15 18 21 24 27 30 9 300 250 200 150 100 50 0 tD2 tD1 CLOAD = 1000 pF TA = +25°C VDD (V) TC4431/TC4432 DS21424D-page 6 © 2007 Microchip Technology Inc. 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Supply Input (VDD) The VDD input is the bias supply input for the MOSFET driver and is rated for 4.5V to 30V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of this capacitor should be chosen based on the capacitive load that is being driven. 3.2 Control Input (IN) The MOSFET driver input is a TTL/CMOS compatible input with 250 mV of hysteresis between the high and low threshold voltages. If an input signal level of greater than 12V is applied to the device, a series current limiting resistor is recommended. 3.3 Lockout Disable (LOCK DIS) The lockout pin enables/disables the undervoltage lockout feature of the device. If undervoltage lockout is desired (output is not enabled until the bias voltage reaches 8.4V (typical) on the rising edge and is disabled when the bias voltage reaches 7.7V (typical) on the falling edge), the lockout pin should be left floating. If operation below 7V is desired, the lockout pin should be tied to ground. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. Both ground pins should be used to ensure proper operation. The ground pins should be tied into a ground plane or have short traces to the bias supply source return. 3.5 Drive Output (OUT) The TC4431/TC4432 devices have individual source and sink output pins. This feature can be used to adjust the rise and fall time independently by adding separate charge and discharge resistors external to the device. Pin 7 (source output) can source 3 A peak currents into capacitive loads and pin 6 (sink output) can sink 1.5 A peak currents from a capacitive load. Pin No. Symbol Description 1 VDD Supply Input, 4.5V to 30V 2 IN TTL/CMOS Compatible Input 3 LOCK DIS Input Pin, Enable/Disable for UV Lockout 4 GND Ground 5 GND Ground 6 OUT Drive Output, Pull Down 7 OUT Drive Output, Pull Up 8 VDD Supply Input, 4.5V to 30V © 2007 Microchip Technology Inc. DS21424D-page 7 TC4431/TC4432 4.0 APPLICATIONS INFORMATION FIGURE 4-1: Switching Time Test Circuit. CL = 1000 pF 4.7 µF 0.1 µF Inverting Driver Non Inverting Driver Input VDD = 30V Input Output tD1 tF tR Input: 100 kHz, tD2 square wave, tRISE = tFALL ≤ 10 nsec Output Input Output tD1 tF tR tD2 +5V 10% 90% 10% 90% 10% 90% VDD 0V 90% 10% 10% 10% 90% +5V VDD 0V 0V 0V 90% 4, 5 2 6 1, 8 LOCK DIS 3 7 TC4431/TC4432 DS21424D-page 8 © 2007 Microchip Technology Inc. 5.0 PACKAGING INFORMATION 5.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TC4431 EPA^^256 0749 TC4431E OA^^0749 256 8-Lead CERDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW TC4432 EJA^^256 0749 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 e3 e3 e3 © 2007 Microchip Technology Inc. DS21424D-page 9 TC4431/TC4432      !"# $%&'                   !    "#$%&'($ )* ) ! +        $%' ,  " -   "   $" - "     "*.."." -  / 012% ! 3 $01 14$ $#5 1  1 6   77) +"   # 8 8 77   # 7( 8 8   - 2 # '7 8 9(   : % ;7 8 7   - : %  7 '6 77 4 3 ! 97 67 '77 +"   3 ( 8 77 3 +-  776 8 7( /""3 :  7'( 8 7<( 33 :  7( 8 7 4 ="  % ' 8 '7 N NOTE 1 E1 1 2 D E c E2 A2 L e b b1 A1 A $" +  !  7'>77) TC4431/TC4432 DS21424D-page 10 © 2007 Microchip Technology Inc. "&%  " ""# $%&'                   !  ! %   "  $  "    77?"  ' !    "#$%&'($ )*) ! +        $%' ,  " -   "   $" - "     "*.."." -  / 012% ! 3 $01 14$ $#5 1  1 6   77) +"   # 8 8 7 $  - +- # ( 7 ;( )    # 7( 8 8   : % ;7 7 ( $  - : % '7 (7 67 4 3 ! '6 <( '77 +"   3 ( 7 (7 3 +-  776 77 7( /""3 :  7'7 7<7 797 33 :  7' 76 7 4 ="  ) 8 8 ' 7 N E1 NOTE 1 D 1 2 3 A A1 A2 L b1 b e E eB c $" +  !  7'>76) © 2007 Microchip Technology Inc. DS21424D-page 11 TC4431/TC4432 "&% ( )% ($$ *+, () # $%&'                   !  ! %   "  $  "    7("  ' !    "#$%&'($ )* ) ! +        =%,* =!      " "    $%' ,  " -   "   $" - "     "*.."." -  / $0330$%+%= ! 3 $01 14$ $#5 1  1 6   9) 4 2 # 8 8 9( $  - +- # ( 8 8   # 77 8 7( 4 : % <77) $  - : % ;7) 4 3 ! ';7)  @" A  7( 8 7(7 ,3 3 7'7 8 9 ," 3 7'=%, ,#  7B 8 6B 3 +-  79 8 7( 3 :  7 8 7( $ ! # +" (B 8 (B $ ! # )  (B 8 (B D N e E E1 NOTE 1 12 3 b A A1 A2 L L1 c h h φ β α $" +  !  7'>7(9) TC4431/TC4432 DS21424D-page 12 © 2007 Microchip Technology Inc. "&% ( )% ($$ *+, () # $%' ,  " -   "   $" - "     "*.."." -  © 2007 Microchip Technology Inc. DS21424D-page 13 TC4431/TC4432 APPENDIX A: REVISION HISTORY Revision D (December 2007) The following is the list of modifications: 1. Section 1.0 “Electrical Characteristics”: Added V temperature information to Temperature Characteristics table. 2. Added Revision History. 3. Added V temperature range to Product identification System page. Revision C (May 2003) The following is the list of modifications: 1. Undocumented changes Revision B (May 2002) The following is the list of modifications: 1. Undocumented changes Revision A (April 2002) • Original Release of this Document. TC4431/TC4432 DS21424D-page 14 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS21424D-page 15 TC4431/TC4432 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TC4431: 1.5A High-Speed 30V MOSFET Driver, Inverting TC4432: 1.5A High-Speed 30V MOSFET Driver, Non Inverting Temperature Range: C = 0°C to +70°C E = -40°C to +85°C V = -40°C to +125°C Package: JA = Ceramic Dual In-line (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead* * * Offered in E-temp range only. * * The only package offered in the V temp range. PART NO. X /XX Temperature Package Range Device Examples: a) TC4431COA: 1.5A MOSFET driver, SOIC package, 0°C to +70°C. b) TC4431EJA: 1.5A MOSFET driver, CERDIP package, -40ºC to +85ºC. c) TC4431VPA: 1.5A MOSFET driver, PDIP package, -40°C to +125°C. a) TC4432CPA: 1.5A MOSFET driver, PDIP package, 0°C to +70°C. b) TC4432EPA: 1.5A MOSFET driver, PDIP package, -40°C to +85°C. c) TC4432VOA713: Tape and Reel, 1.5A MOSFET driver, SOIC package, -40°C to +125°C. TC4431/TC4432 DS21424D-page 16 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS21424D-page 17 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21424D-page 18 © 2007 Microchip Technology Inc. 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DS50005224A MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 2  2013 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. 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ISBN: 978-1-62077-520-2  2013 Microchip Technology Inc. DS20005224A-page 3 Object of Declaration: MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS20005224A-page 4  2013 Microchip Technology Inc. NOTES: MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE  2013 Microchip Technology Inc. DS50005224A-page 5 Table of Contents Preface ........................................................................................................................... 7 Introduction............................................................................................................ 7 Document Layout .................................................................................................. 7 Conventions Used in this Guide ............................................................................ 8 Recommended Reading........................................................................................ 9 The Microchip Web Site ........................................................................................ 9 Customer Support ................................................................................................. 9 Document Revision History ................................................................................... 9 Chapter 1. Product Overview 1.1 Overview ...................................................................................................... 11 1.2 What the MCP3913 ADC Evaluation Board for 16-Bit MCUs Contains ....... 12 Chapter 2. Hardware Description 2.1 PIM Module/MCP3913 Connection and Peripheral Usage Overview .......... 13 2.2 Analog Input Structure .................................................................................. 14 2.3 Universal Serial Bus (USB) .......................................................................... 15 Chapter 3. Firmware 3.1 PIC24FJ256GA110 Firmware Description ................................................... 17 3.2 Data Acquisition ........................................................................................... 17 3.3 UART Communication Protocol ................................................................... 18 Appendix A. Schematics and Layouts A.1 Introduction .................................................................................................. 19 A.2 Schematic – Power ...................................................................................... 20 A.3 Schematic – ADC ......................................................................................... 21 A.4 Schematic – Microcontroller (MCU) ............................................................. 22 A.5 Schematic – PIM Module ............................................................................. 23 A.6 Schematic – LCD and UART ....................................................................... 24 A.7 Board – Top Trace and Top Silk .................................................................. 25 A.8 Board – Bottom Trace and Bottom Silk ........................................................ 25 A.9 Board – Layer #2 GND ................................................................................ 26 A.10 Board – Layer #3 VDD ............................................................................... 26 A.11 Board – Top Silk and Pads ........................................................................ 27 A.12 Board – Bottom Silk and Pads ................................................................... 27 Appendix B. Bill of Materials (BOM) Worldwide Sales and Service .................................................................................... 32 MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 6  2013 Microchip Technology Inc. NOTES: MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE  2013 Microchip Technology Inc. DS50005224A-page 7 Preface INTRODUCTION This chapter contains general information that will be useful to know before using the MCP3913 ADC Evaluation Board for 16-Bit MCUs. Items discussed in this chapter include: • Document Layout • Conventions Used in this Guide • Recommended Reading • The Microchip Web Site • Customer Support • Document Revision History DOCUMENT LAYOUT This document describes how to use the MCP3913 ADC Evaluation Board for 16-Bit MCUs as a development tool to emulate and debug firmware on a target board. The manual layout is as follows: • Chapter 1. “Product Overview” – Provides important information about the MCP3913 ADC Evaluation Board for 16-Bit MCUs hardware. • Chapter 2. “Hardware Description” – Provides information about the evaluation board software. • Chapter 3. “Firmware” – Describes the MCP3913 ADC Evaluation Board for 16-Bit MCUs firmware. • Appendix A. “Schematics and Layouts”– Shows the schematic and board layouts for the MCP3913 ADC Evaluation Board for 16-Bit MCUs. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the MCP3913 ADC Evaluation Board for 16-Bit MCUs. NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 8  2013 Microchip Technology Inc. CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Represents Examples Arial font: Italic characters Referenced books MPLAB® IDE User’s Guide Emphasized text ...is the only compiler... Initial caps A window the Output window A dialog the Settings dialog A menu selection select Enable Programmer Quotes A field name in a window or dialog “Save project before build” Underlined, italic text with right angle bracket A menu path File>Save Bold characters A dialog button Click OK A tab Click the Power tab N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. 4‘b0010, 2‘hF1 Text in angle brackets < > A key on the keyboard Press , Courier New font: Plain Courier New Sample source code #define START Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -OpaBit values 0, 1 Constants 0xFF, ‘A’ Italic Courier New A variable argument file.o, where file can be any valid filename Square brackets [ ] Optional arguments mcc18 [options] file [options] Curly brackets and pipe character: { | } Choice of mutually exclusive arguments; an OR selection errorlevel {0|1} Ellipses... Replaces repeated text var_name [, var_name...] Represents code supplied by user void main (void) { ... } Preface  2013 Microchip Technology Inc. DS50005224A-page 9 RECOMMENDED READING This user’s guide describes how to use MCP3913 ADC Evaluation Board for 16-Bit MCUs. Another useful document is listed below. The following Microchip document is available and recommended as a supplemental reference resource: • MCP3913 Data Sheet – “3V Six-Channel Analog Front End” (DS20000000) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com. DOCUMENT REVISION HISTORY Revision A (October 2013) • Initial release of this document. MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 10  2013 Microchip Technology Inc. NOTES: MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE  2013 Microchip Technology Inc. DS50005224A-page 11 Chapter 1. Product Overview 1.1 OVERVIEW The MCP3913 ADC Evaluation Board for 16-Bit MCUs system provides the opportunity to evaluate the performance of the MCP3913 six-channel Analog Front End (AFE). It also provides a development platform for 16-bit microcontroller-based applications, using the existing 100-pin PIC® microcontroller Plug-in Module (PIM) systems that are compatible with the Explorer 16 and other high pin count PIC device based demo boards. The system comes with a programmed PIC24FJ256GA110 PIM module that communicates with the Energy Management Utility software for data exchange and ADC setup. The MCP3913 ADC Evaluation Board for 16-Bit MCUs uses the Energy Management Utility software for evaluation of the MCP3913 via a USB connection to the board. A download link for this software can be found on the evaluation board’s web page. For instructions on the use of this software, refer to the supporting documentation included within the application install package. 1.1.1 Feature Highlights • Six-channel ADC MCP3913 output display using serial communication to the PC software interface. • Simultaneous 57 ksps at OSR32 address loop ALL or 95 dB SINAD at OSR512 performance on MCP3913. • System and ADC performance analysis through graphical PC tools showing noise histogram, frequency domain (FFT), time domain scope plot, and statistical numerical analysis. • Robust hardware design with analog grounding and analog/digital separation, allowing low noise evaluation of the MCP3913 device; includes separate power supplies and power planes on a four-layer board. • PICtail™ Plus connectors for Explorer 16 daughter board compatibility. MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 12  2013 Microchip Technology Inc. FIGURE 1-1: MCP3913 Evaluation Board. 1.2 WHAT THE MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUS CONTAINS This MCP3913 ADC Evaluation Board for 16-Bit MCUs kit includes: • MCP3913 ADC Evaluation Board for 16-Bit MCUs (Part number ADM00522) • PIC24FJ256GA110 PIM • USB Cable • Important Information Sheet MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE  2013 Microchip Technology Inc. DS50005224A-page 13 Chapter 2. Hardware Description 2.1 PIM MODULE/MCP3913 CONNECTION AND PERIPHERAL USAGE OVERVIEW The MCP3913 ADC Evaluation Board for 16-Bit MCUs contains a 100-pin PIM socket compatible with Microchip’s PIM modules. The system comes with one PIM module, the PIC24FJ256GA110. FIGURE 2-1: Digital Connection Overview PIM/MCP3913 Connections. CONTROL SWITCHES (X3) CH0+ CH0- CH5+ CH5- AVDD OSC1 AGND MCP3913 SDI SDO RA5/ADC_RESET RG9/ADC_CS RG6/ADC_SCK RG8/ADC_MOSI RG7/ADC_MISO RD11/12/13 PIM Module SCK OSC2 OC1/RG6 RA9/10 LD2 LD3 RF5/U2TX RF4/U2RX UART SERIAL TO PC COMMUNICATION RESET DR CS SPI Serial Interface Delta Sigma Multi-Level Modulator Delta Sigma Multi-Level Modulator PGA PGA+ + - - INT Vre Clock Generation/ Phase Correction Current Boost Circuit Modulator Output Translation Block SINC3 Digital Filter SINC3 Digital Filter DGND DVDD RA14/ADC_DR MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 14  2013 Microchip Technology Inc. Ports A, D, and G are used for signals such as push buttons, output LEDs, CS and MCLR (for the MCP3913 data mode setting). Output Compare 1 is used for clock generation in the MCP3913. Serial communication is achieved through the MSSP module 1. The MCP3913 device is an AFE with six ADCs featuring a second order modulator and a third order sinc filter, plus a first order sinc filter used for higher OSR’s values. The delta-sigma A/D converters have an adjustable oversampling ratio. The CLKIN pin of the MCP3913 is the oversampling clock (MCLK) input. The MCP3913 ADC Evaluation Board for 16-Bit MCUs offers two different options for the MCP3913 master clock (MCLK). The default setting for the ADC internal clock is an external clock driven by the MCU. 2.1.1 Using the Crystal X1 The MCP3913 ADC Evaluation Board for 16-Bit MCUs is populated with a 10 MHz crystal, used as a clock source, by placing jumpers in the following position on the MCP3913 Digital I/O header block: FIGURE 2-2: ADC Clock Selection Jumpers – External Crystal. 2.1.2 Driving the Clock with the PIM Module The PIC MCU can be used to generate the CLKIN (MCLK) signal for the MCP3913, setting the ADC sample rate through the use of the output compare module OC1. To use this feature, make the following jumper change to the MCP3913 Digital I/O header block: FIGURE 2-3: ADC Clock Selection Jumpers – Clock from MCU. The frequency of the OC1 output is based on the PR1 bit settings in the firmware. 2.2 ANALOG INPUT STRUCTURE Six differential input paths allow external signal sources to be easily connected to the MCP3913 inputs. Screw-terminal connectors J1, J4, J7, J21, J23, J25, J27 and J29 are 3-pin connectors that act as both screw-type and clip-on post connectors. The connectors J1, J4, J7, J21, J23 and J25 can be used to force either channel from a differential to single-ended configuration. R4 and R11 (on CH0), R19 and R21 (on CH1) R18 and R65 (on CH2), R69 and R71 (on CH3), R75 and R77 (on CH4), and R81 and RR83 (on CH5) act as locations for burden resistor connectors for any current transformer inputs. XTAL XTAL CLKIN PIM OC1 CLKIN CLKOUT XTAL XTAL CLKIN PIM OC1 CLKIN CLKOUT Note: To use a screw-terminal connector as a post connector, pull up the blue plastic top to access the posts. Hardware Description  2013 Microchip Technology Inc. DS50005224A-page 15 2.3 UNIVERSAL SERIAL BUS (USB) The MCP3913 ADC Evaluation Board for 16-Bit MCUs also contains a USB connection for connecting the evaluation board to a PC. On the board, there is an MCP2200 USB to UART converter that creates a virtual COMM port on the PC. The MCP3913 ADC Evaluation Board for 16-Bit MCUs also features an RS-232 connector, just in case it is required. The RS-232 line driver is connected to the same UART pins of the MCU. For this reason, a 3-pin jumper (J16) is present on the evaluation board to select which serial communication will be used: USB or RS-232. The following figure summarizes the connections between the ADC, MCU, USB to serial converter and the RS-232 line driver. FIGURE 2-4: USB Block Diagram. The MCP2200 is powered from the USB with 5V. The Q1 transistor (see Appendix A.) is used to disconnect the board from the PC when it is powered down to avoid power consumption. By changing the jumper J9 setting, the user can select the source of the power supply for the board to be either +5V derived from the USB or an external +9V power supply. Since the PIC24F runs at 3.3V, a level shifter was used to modify the signal level to 5V as required by the MCP2200; this is done with U11 (see Appendix A.). The 7.3728 MHz value of the crystal is required to achieve the correct baud rate values for higher speed. This design uses a baud rate of 921.6 kbaud and for this baud rate, the register (U1BRG) value is 3 (decimal). PIM Module USB TX RX MCP2200 ADC MCP3913 SCK SDO SDI RS-232 Driver USB RS-232 TX RX RF4/U2RX RF5/U2TX RG6/SCK1 RG7/ADC_MISO RG8/ADC_MOSI MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 16  2013 Microchip Technology Inc. NOTES: MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE  2013 Microchip Technology Inc. DS50005224A-page 17 Chapter 3. Firmware 3.1 PIC24FJ256GA110 FIRMWARE DESCRIPTION 3.1.1 MCU Initialization The microcontroller used for the code example is the 16-bit XLP with 16 MIPS PIC24FJ256GA110. The MCU has remappable pins and output compare with a dedicated time base. The MCU uses a 7.3278 MHz crystal for the clock and the internal PLL to increase the frequency by four times. The uncommon crystal value was chosen to obtain the correct baud rate, even for high baud rates. The remappable pins are configured to make the PIM compatible with the Explorer 16 development board. The MCP3913 is linked with the MCU through the SPI1 port. The ADC clock is given by OC1. The DR pin of the MCP3913 is tied to external Interrupt 2. Serial data transmission is carried out through the UART2 module. For transmission, OC2 interrupt is used; for receiving, the _U1RX Interrupt is used. The UART communication speed is 921.6 kbaud. OC2 is used for the serial transmission to create short bursts of data that can be processed by the MCP2200. Sending too many characters, with no time between them at the current baud rate, will cause the MCP2200 to lose data. 3.2 DATA ACQUISITION External Interrupt 2 is used for detecting the end of conversion on the MCP3913. In the INT2 Interrupt, the data samples are read from the ADC using SPI. When a new buffer begins to be read, Timer4 is started. This is set as a 32-bit timer together with Timer5. It will be stopped when the buffer is full and is used to measure the sampling speed. Before reading the date samples, the MCU investigates the address loop setting (READ <1:0> bits) in the STATUSCOM register and adjusts the read sequence accordingly (when the address is not incremented automatically in hardware, the MCU has to do that in firmware, leading to a longer read sequence). The acquired samples are written in six long vectors created in the RAM of the MCU. The six vectors hold the first, second and third byte from both channels. The vectors have a length of 2048. The value of Timer 4, and the values of the other registers inside the ADC, are stored in a vector called “internal_registers[26]”. Note: The PIC24FJ256GA110 must be Rev. A5 or newer, in order for this code example to work. MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 18  2013 Microchip Technology Inc. 3.3 UART COMMUNICATION PROTOCOL The serial connection is used to send the acquired data to the PC at a speed of 921.6 kbaud, and the MCP2200 is used for the UART-to-USB conversion. The communication uses handshaking, meaning that the board will not send data to the PC unless the board receives a command from the PC. The UART transmission is triggered by the output compare module OC2.This allows the data to be transmitted to the PC in short bursts that are separated by a dead time. This method of sending data allows the MCP2200 to handle the high throughput. If the entire amount of data is sent continuously to the PC at the current baud rate, the MCP2200 will not be able to process the data for correct USB transfer. After a complete transmission, the UART RX interrupt is enabled by increasing its priority, while all other interrupts have lower priorities. In this interrupt, the MCU needs to receive the values of the internal registers as the user is setting them in the PC GUI. MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE  2013 Microchip Technology Inc. DS50005224A-page 19 Appendix A. Schematics and Layouts A.1 INTRODUCTION This appendix contains the following schematics of the MCP3913 ADC Evaluation Board for 16-Bit MCUs: • Schematic – Power • Schematic – ADC • Schematic – Microcontroller (MCU) • Schematic – PIM Module • Schematic – LCD and UART • Board – Top Trace and Top Silk • Board – Bottom Trace and Bottom Silk • Board – Layer #2 GND • Board – Layer #3 V DD • Board – Top Silk and Pads • Board – Bottom Silk and Pads MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 20  2013 Microchip Technology Inc. A.2 SCHEMATIC – POWER 1 1 2 2 3 3 4 4 5 5 6 6 D D C C B B A A 1 5 MCP3913 Eval Board ADM00461 4 4/18/2013 6:06:54 PM POWER.SchDoc Title Size: Number: Date: File: Revision: Sheet of Time: B Designed with Drawn By: Bogdan Popescu Checked: Adrian Mot Approved: Craig Approved: King Date: Date: Date: Date: Revision History Approved Date Description Rev ECO www.Altium.com GND GND GND GND GND POWER +5V USB GND +9V IN +9V IN Power Jack 2.5mm 1 3 2 J10 MRA4005 D1 9V C11 0.1uF 0603 C10 0.1uF 0603 GND C14 0.1uF 0603 3.3A Ferrite Bead 1806 3.3D L1 GND GND C12 0.1uF 0603 MCP1754-3.3V VOUT 3 VIN 1 GND 2 VOUT VIN VDNG U3 POWER GND GND GND LED 0603 Green 1 2 LD1 3.3D TP2 Via_2.5x1.5 Via_2.5x1.5 TP1 GND LM1117-5V VIN 3 GND 1 VOUT 2 VIN VOUT DNG U4 +5V EXT GND MCP1825S-3.3V VOUT 3 VIN 1 GND 2 VOUT VIN VDNG U2 5V GND Net Tie GND GNDA C15 10uF 20V TANT-B C44 10uF 10V 1206 C13 10uF 10V 1206 C45 10uF 10V 1206 GND R26 1k 5% 0603 1 2 3 4 J9 1 2 J19 5V SI1307EDL D G S Q1 5V_USB USB_EN R63 1k 5% 0603 C46 0.1uF 0603 R62 10k 5% 0603 5V_USB USB Standby Protection Bumpon Hemisphere Black PAD1 Schematics and Layouts  2013 Microchip Technology Inc. DS50005224A-page 21 A.3 SCHEMATIC – ADC 1 1 2 2 3 3 4 4 5 5 6 6 D D C C B B A A 2 5 MCP3913 Eval Board ADM00461 4 4/18/2013 6:06:55 PM ADC.SchDoc Title Size: Number: Date: File: Revision: Sheet of Time: B Designed with Drawn By: Bogdan Popescu Checked: Adrian Mot Approved: Craig Approved: King Date: Date: Date: Date: Revision History Approved Date Description Rev ECO www.Altium.com GND GNDA RG9/ADC_CS RG8/ADC_MOSI RG7/ADC_MISO RG6/ADC_SCK GND RA5/ADC_RESET XTAL RD3/ADC_CLKIN XTAL GND GNDA GNDA GNDA GNDA GNDA GNDA GNDA RG9/ADC_CS RG7/ADC_MISO RG6/ADC_SCK RA5/ADC_RESET GNDA GNDA RG8/ADC_MOSI GND GND CH0+ CH0- ADC CLOCK SELECT CH1- CH1+ 10MHz X1 15pF 0603 15pF C7 0603 C6 GND R20 1M 0603 5% 10 0603 R17 R7 5% 10 0603 0.1uF 0603 C3 R9 5% 10 0603 0.1uF 0603 C4 5% 10 0603 R6 5% 10 0603 R8 5% 10 0603 R10 5% 10 0603 R12 5% 100 0603 R5 5% 10 0603 R14 1k R2 0603 1k R1 0603 C2 0.1uF 0603 C1 0.1uF 0603 1k 0603 R13 1k 0603 R3 1k R4 0603 1k R11 0603 1k R19 0603 1k R21 0603 GNDA 1k 0603 R22 1k 0603 R15 C8 0.1uF 0603 C9 0.1uF 0603 1 2 3 4 5 6 J1 1 2 3 4 5 6 J4 GNDA GNDA GNDA C5 0.1uF 0603 HDR M 2x3 1 VERT 2 3 4 5 6 J3 ECCP3 3.3D 3.3A 3.3D HDR M 1x2 VERT 1 2 J6 HDR M 2x8 VERT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 J8 123 J2 123 J5 ADC 1k R24 0603 1k R23 0603 GND 1k 0603 5% R25 CH4- 8 NC 5 CH2- 2 REFIN+ 15 AVDD 18 NC 6 CH4+ 7 CH5- 9 CH5+ 10 CH2+ 1 CH3- 3 CH3+ 4 AGND 17 REFIN- 16 NC 19 DVDD 20 CH4- NC CH2- REFIN+ AVDD NC CH4+ CH5- CH5+ CH2+ CH3- CH3+ AGND REFINNC DVDD DGND 21 DR 22 NC 23 DGND 24 OSC1/CLKI 25 OSC2 26 CS 27 SCK 28 SDO 29 SDI 30 RESET 31 DGND 32 DVDD 33 NC 34 AVDD 35 AGND 36 CH0+ 37 CH0- 38 CH1- 39 CH1+ 40 U5 MCP3913 GND GNDA GNDA GNDA GNDA CH1- CH1+ 1k R18 0603 1k R65 0603 GNDA 1k 0603 R67 1k 0603 R16 C47 0.1uF 0603 C50 0.1uF 0603 1 2 3 4 5 6 J7 123 J20 1k R66 0603 1k R64 0603 GND GNDA GNDA GNDA GNDA CH1- CH1+ 1k R69 0603 1k R71 0603 GNDA 1k 0603 R73 1k 0603 R68 C51 0.1uF 0603 C52 0.1uF 0603 1 2 3 4 5 6 J21 123 J22 1k R72 0603 1k R70 0603 GND GNDA GNDA GNDA GNDA CH1- CH1+ 1k R75 0603 1k R77 0603 GNDA 1k 0603 R79 1k 0603 R74 C53 0.1uF 0603 C54 0.1uF 0603 1 2 3 4 5 6 J23 123 J24 1k R78 0603 1k R76 0603 GND GNDA GNDA GNDA GNDA CH1- CH1+ 1k R81 0603 1k R83 0603 GNDA 1k 0603 R85 1k 0603 R80 C55 0.1uF 0603 C56 0.1uF 0603 1 2 3 4 5 6 J25 123 J26 1k R84 0603 1k R82 0603 GND GNDA GNDA GNDA GNDA CH1- CH1+ 1k R87 0603 1k R89 0603 GNDA 1k 0603 R91 1k 0603 R86 C57 0.1uF 0603 C58 0.1uF 0603 1 2 3 4 5 6 J27 123 J28 1k R90 0603 1k R88 0603 GND GNDA GNDA GNDA GNDA CH1- CH1+ 1k R93 0603 1k R95 0603 GNDA 1k 0603 R97 1k 0603 R92 C59 0.1uF 0603 C60 0.1uF 0603 1 2 3 4 5 6 J29 123 J30 1k R96 0603 1k R94 0603 0.1uF 0603 C49 0.1uF 0603 C48 RA14/ADC_DR RA14/ADC_DR RA14/ADC_DR RF4/PMPA9/U2RX RF5/PMPA8/U2TX NC NC  NC    NC MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 22  2013 Microchip Technology Inc. A.4 SCHEMATIC – MICROCONTROLLER (MCU) 1 1 2 2 3 3 4 4 5 5 6 6 D D C C B B A A 3 5 MCP3913 Eval Board ADM00461 4 4/18/2013 6:06:55 PM MCU.SCHDOC Title Size: Number: Date: File: Revision: Sheet of Time: B Designed with Drawn By: Bogdan Popescu Checked: Adrian Mot Approved: Craig Approved: King Date: Date: Date: Date: Revision History Approved Date Description Rev ECO www.Altium.com RB0/AN0 RB1/AN1 RB2/SS1/AN2 RB4/AN4 RB5/AN5 RE9 RE8/INT1 RA0/TMS MCLR RC4/MISO1 RC2 RC3 RE5/PMPD5 RE6/PMPD6 RE7/PMPD7 RG15 RE3/PMPD3 RE4/PMPD4 RA10/PMPA6 RG13 RB8/AN8 RG14 RE1/PMPD1 RB10/PMPA13 RB9/AN9 RA7 RE0/PMPD0 RG0 RG1 RA1/TCK RF13/U2RTS RF0 RF1 RB12/PMPA11 VDDCORE RB14/PMPA1 RB15/PMPA0 RD4 RD5 RD6 RD13 RD15/U1RTS RF4/PMPA9/U2RX RD0/MOSI1 RD2 RF5/PMPA8/U2TX RD1/HOLD RF2/U1RX RF3/U1TX RA2/SCL2 RA3/SDA2 RD8 RA15/INT4 RC13 RC14 RD9 RG6/ADC_SCK RG8/ADC_MOSI RG9/ADC_CS RA5/ADC_RESET RD3/ADC_CLKIN RB3/AN3 GND RG7/ADC_MISO RA9/PMPA7 RA14/ADC_DR RG12 RE2/PMPD2 RB11/PMPA12 RF12/U2CTS RA6 ENVREG RB13/PMPA10 RD14/U1CTS RD7 RD12 GND GND GND GND GND RB6/AN6/PGC RB7/AN7/PGD RG2/SCL1 RG3/SDA1 RC1 OSC1 OSC2 3.3D 3.3D 3.3D 3.3D 3.3D 3.3D GND MCLR RB7/AN7/PGD RB6/AN6/PGC ENVREG VDDCORE GND GND GND ICD C16 0.1uF 0603 C17 10uF 1206 R31 0603 DNP 3.3D GND 3.3D GND 3.3D GND 3.3D GND 3.3D GND 3.3D GND RG3/SDA1 RG2/SCL1 OSC2 OSC1 GND GND RD8 GND 1M 1% R42 0603 0603 R43 DNP 3.3D R41 0603 DNP R40 0603 DNP 3.3D 3.3D 3.3D 3.3D 3.3D 3.3D 3.3D 7.3728MHz X2 0 0603 R32 R27 0 0603 R34 0603 DNP R28 10k 5% 0603 C19 0.1uF 0603 C20 0.1uF 0603 C21 0.1uF 0603 C22 0.1uF 0603 C23 0.1uF 0603 C24 0.1uF 0603 REACTIVE PWR HDR M 1x2 VERT 1 2 J13 R50 5% 1k 0603 LED 5mm Red 1 2 LD5 HCPL-181 2 3 1 4U7 RD5 GND GND RD10/SCK1 RD11 R38 2.2k 5% 0603 R39 2.2k 5% 0603 R51 1k 5% 0603 1x6 1 2 3 4 5 6 J11 C25 22pF 0603 C26 22pF 0603 RA4/TDI RF7 RF8 RF6/INT0/SCK1 3.3D GND C30 0.1uF 0603 CN82/RG15 1 VDD 2 CN63/PMD5/RE5 3 SCL3/CN64/PMD6/RE6 4 SDA3/CN65/PMD7/RE7 5 RPI38/CN45/RC1 6 RPI39/CN46/RC2 7 RPI40/CN47/RC3 8 RPI41/CN48/RC4 9 C1IND/RP21/CN8/PMA5/RG6 10 C1INC/RP26/CN9/PMA4/RG7 11 C2IND/RP19/CN10/PMA3/RG8 12 MCLR 13 C2INC/RP27/CN11/PMA2/RG9 14 VSS 15 VDD 16 TMS/CN33/RA0 17 RPI33/CN66/RE8 18 RPI34/CN67/RE9 19 PGEC3/AN5/C1INA/RP18/CN7/RB5 20 PGED3/AN4/C1INB/RP28/CN6/RB4 21 AN3/C2INA/CN5/RB3 22 AN2/C2INB/RP13/CN4/RB2 23 PGEC1/AN1/RP1/CN3/RB1 24 PGED1/AN0/RP0/CN2/RB0 25 PGEC2/AN6/RP6/CN24/RB6 26 PGED2/AN7/RP7/CN25/RB7 27 VREF-/CN41/PMA7/RA9 28 PMA6/VREF+/CN42/RA10 29 AVDD 30 AVSS 31 AN8/RP8/CN26/RB8 32 AN9/RP9/CN27/RB9 33 AN10/CVREF/CN28/PMA13/RB10 34 AN11/CN29/PMA12/RB11 35 VSS 36 VDD 37 TCK/CN34/RA1 38 RP31/CN76/RF13 39 RPI32/CN75/RF12 40 AN12/CTED2/CN30/PMA11/RB12 41 AN13/CTED1/CN31/PMA10/RB13 42 AN14/CTPLS/RP14/CN32/PMA1/RB14 43 AN15/REFO/RP29/CN12/PMA0/RB15 44 VSS 45 VDD 46 RPI43/CN20/RD14 47 RP5/CN21/RD15 48 RP10/CN17/PMA9/RF4 49 RP17/CN18/PMA8/RF5 50 RP16/CN71/RF3 51 RP30/CN70/RF2 52 RP15/CN74/RF8 53 RPI44/CN73/RF7 54 ASCK1/RPI45/INT0/CN72/RF6 55 SDA1/CN84/RG3 56 SCL1/CN83/RG2 57 SCL2/CN35/RA2 58 SDA2/CN36/RA3 59 TDI/CN37/RA4 60 TDO/CN38/RA5 61 VDD 62 OSCI/CLKI/CN23/RC12 63 OSCO/CLKO/CN22/RC15 64 VSS 65 ASCL2/RPI36/CN43/RA14 66 ASDA2/RPI35/CN44/RA15 67 RTCC/RP2/CN53/RD8 68 RP4/CN54/RD9 69 RP3/CN55/PMCS2/RD10 70 RP12/CN56/PMCS1/RD11 71 RP11/CN49/RD0 72 SOSCI/C3IND/CN1/RC13 73 SOSCO/C3INC/RPI37/CN0/RC14 74 VSS 75 RP24/CN50/RD1 76 RP23/CN51/RD2 77 RP22/CN52/PMBE/RD3 78 RPI42/CN57/RD12 79 CN19/RD13 80 RP25/CN13/PMWR/RD4 81 RP20/CN14/PMRD/RD5 82 C3INB/CN15/RD6 83 C3INA/CN16/RD7 84 VCAP/VDDCORE 85 ENVREG 86 CN68/RF0 87 CN69/RF1 88 CN78/RG1 89 CN77/RG0 90 CN39/RA6 91 CN40/RA7 92 CN58/PMD0/RE0 93 CN59/PMD1/RE1 94 CN81/RG14 95 CN79/RG12 96 CN80/RG13 97 CN60/PMD2/RE2 98 CN61/PMD3/RE3 99 CN62/PMD4/RE4 100 U1 PIC24FJ128GA110 CS 1 SO/SIO1 2 SIO2 3 VSS 4 SI/SIO0 5 SCK 6 HOLD/SIO3 7 VCC 8 23LC1024 U12 3.3D GND RD10/SCK1 RD1/HOLD CS 1 SO/SIO1 2 SIO2 3 VSS 4 SI/SIO0 5 SCK 6 HOLD/SIO3 7 VCC 8 23LC1024 U14 3.3D GND RD10/SCK1 RD1/HOLD 3.3D GND C61 0.1uF 0603 3.3D GND C66 0.1uF 0603 3.3D GND C67 0.1uF 0603 RD6 RC4/MISO1 RD0/MOSI1 RC4/MISO1 RD0/MOSI1 RD8 PULSE OUTPUTS ACTIVE PWR HDR M 1x2 VERT 1 2 J12 R46 5% 1k 0603 LED 5mm Red 1 2 LD4 HCPL-181 2 3 1 4U6 RD4 GND GND R47 1k 5% 0603 CS 1 SO/SIO1 2 SIO2 3 VSS 4 SI/SIO0 5 SCK 6 HOLD/SIO3 7 VCC 8 23LC1024 U13 CS 1 SO/SIO1 2 SIO2 3 VSS 4 SI/SIO0 5 SCK 6 HOLD/SIO3 7 VCC 8 23LC1024 U15 3.3D GND RD10/SCK1 RD1/HOLD 3.3D GND RD10/SCK1 RD1/HOLD RC4/MISO1 RD0/MOSI1 RC4/MISO1 RD0/MOSI1 RD7 RD9 RA9/PMPA7 GND RA10/PMPA6 GND LED 0603 Green 1 2 LD2 LED 0603 Red 1 2 LD3 R29 1k 5% 0603 R30 1k 5% 0603 MCLR RD13 GND 3.3D GND C18 0.1uF 0603 SW Tact SMD 1 4 2 3 SW1 GND GND 3.3D GND SW Tact SMD 1 4 2 3 SW2 GND GND 3.3D GND SW Tact SMD 1 4 2 3 SW3 GND GND 3.3D GND SW Tact SMD 1 4 2 3 SW4 GND 1k 0603 5% R35 R33 4.7k 5% 0603 C27 0.1uF 0603 1k 0603 5% R37 R36 4.7k 5% 0603 C28 0.1uF 0603 1k 0603 5% R45 R44 4.7k 5% 0603 C29 0.1uF 0603 1k 0603 5% R49 R48 4.7k 5% 0603 RD11 RD12 Schematics and Layouts  2013 Microchip Technology Inc. DS50005224A-page 23 A.5 SCHEMATIC – PIM MODULE 1 1 2 2 3 3 4 4 5 5 6 6 D D C C B B A A 4 5 MCP3913 Eval Board ADM00461 4 4/18/2013 6:06:55 PM PIM MODULE.SCHDOC Title Size: Number: Date: File: Revision: Sheet of Time: B Designed with Drawn By: Bogdan Popescu Checked: Adrian Mot Approved: Craig Approved: King Date: Date: Date: Date: Revision History Approved Date Description Rev ECO www.Altium.com RB0/AN0 RB1/AN1 RB2/SS1/AN2 RB4/AN4 RB5/AN5 RE9 RA0/TMS RA4/TDI RE8/INT1 MCLR RF8 RC4/MISO1 RC2 RC3 RE5/PMPD5 RE6/PMPD6 RE7/PMPD7 RG15 RA10/PMPA6 RE3/PMPD3 RE4/PMPD4 RG13 RB8/AN8 RG14 RE1/PMPD1 RB10/PMPA13 RB9/AN9 RA7 RE0/PMPD0 RG0 RG1 RA1/TCK RF13/U2RTS RF0 RF1 RB12/PMPA11 VDDCORE RB14/PMPA1 RB15/PMPA0 RD5 RD6 RD13 RD4 RD15/U1RTS RF4/PMPA9/U2RX RD0/MOSI1 RD2 RF5/PMPA8/U2TX RD1/HOLD RF2/U1RX RF3/U1TX RA2/SCL2 RA3/SDA2 RD8 RA15/INT4 RC13 RC14 RD9 RG6/ADC_SCK RG8/ADC_MOSI RG9/ADC_CS RA5/ADC_RESET RD3/ADC_CLKIN RB3/AN3 GND RG7/ADC_MISO RA9/PMPA7 RG12 RE2/PMPD2 RB11/PMPA12 RF12/U2CTS RA6 ENVREG RB13/PMPA10 RD14/U1CTS RD7 RD12 GND GND GND GND GND RB6/AN6/PGC RB7/AN7/PGD RG2/SCL1 RG3/SDA1 RC1 OSC1 OSC2 3.3D 3.3D 3.3D 3.3D 3.3D 3.3D 3.3D GND 3.3D GND 3.3D GND 3.3D GND 3.3D GND 3.3D GND C38 0.1uF 0603 C39 0.1uF 0603 C40 0.1uF 0603 C41 0.1uF 0603 C42 0.1uF 0603 C43 0.1uF 0603 RD10/SCK1 RD11 RA14/ADC_DR RF7 RF6/INT0/SCK1 TMS/RA0 17 TCK/RA1 38 SCL2/RA2 58 SDA2/RA3 59 TDI/RA4 60 TDO/RA5 61 TRCLK/RA6 91 TRD3/RA7 92 VREF-/CVREF-/AERXD2/PMA7/RA9 28 VREF+/CVREF+/AERXD3/PMA6/RA10 29 AETXCLK/SCL1/INT3/RA14 66 AETXEN/SDA1/INT4/RA15 67 PGED1/AN0/CN2/RB0 25 PGEC1/AN1/CN3/RB1 24 AN2/C2IN-/CN4/RB2 23 AN3/C2IN+/CN5/RB3 22 AN4/C1IN-/CN6/RB4 21 AN5/C1IN+/VBUSON/CN7/RB5 20 PGEC2/AN6/OCFA/RB6 26 PGED2/AN7/RB7 27 AN8/C1OUT/RB8 32 AN9/C2OUT/RB9 33 AN10/CVREFOUT/PMA13/RB10 34 AN11/ERXERR/AETXERR/PMA12/RB11 35 AN12/ERXD0/AECRS/PMA11/RB12 41 AN13/ERXD1/AECOL/PMA10/RB13 42 AN14/ERXD2/AETXD3/PMALH/PMA1/RB14 43 AN15/ERXD3/AETXD2/OCFB/PMALL/PMA0/CN12/RB15 44 T2CK/RC1 6 T3CK/AC2TX/RC2 7 T4CK/AC2RX/RC3 8 T5CK/SDI1/RC4 9 OSC1/CLKI/RC12 63 SOSCI/CN1/RC13 73 SOSCO/T1CK/CN0/RC14 74 OSC2/CLKO/RC15 64 SDO1/OC1/INT0/RD0 72 OC2/RD1 76 OC3/RD2 77 OC4/RD3 78 OC5/PMWR/CN13/RD4 81 PMRD/CN14/RD5 82 ETXEN/PMD14/CN15/RD6 83 ETXCLK/PMD15/CN16/RD7 84 RTCC/EMDIO/AEMDIO/IC1/RD8 68 SS1/IC2/RD9 69 SCK1/IC3/PMCS2/PMA15/RD10 70 EMDC/AEMDC/IC4/PMCS1/PMA14/RD11 71 ETXD2/IC5/PMD12/RD12 79 ETXD3/PMD13/CN19/RD13 80 AETXD0/SS3/U4RX/U1CTS/CN20/RD14 47 AETXD1/SCK3/U4TX/U1RTS/CN21/RD15 48 PMD0/RE0 93 PMD1/RE1 94 PMD2/RE2 98 PMD3/RE3 99 PMD4/RE4 100 PMD5/RE5 3 PMD6/RE6 4 PMD7/RE7 5 AERXD0/INT1/RE8 18 AERXD1/INT2/RE9 19 C1RX/ETXD1/PMD11/RF0 87 C1TX/ETXD0/PMD10/RF1 88 SDA3/SDI3/U1RX/RF2 52 USBID/RF3 51 SDA5/SDI4/U2RX/PMA9/CN17/RF4 49 SCL5/SDO4/U2TX/PMA8/CN18/RF5 50 VUSB 55 VBUS 54 SCL3/SDO3/U1TX/RF8 53 AC1RX/SS4/U5RX/U2CTS/RF12 40 AC1TX/SCK4/U5TX/U2RTS/RF13 39 C2RX/PMD8/RG0 90 C2TX/ETXERR/PMD9/RG1 89 D+/RG2 57 D-/RG3 56 ECOL/SCK2/U6TX/U3RTS/PMA5/CN8/RG6 10 ECRS/SDA4/SDI2/U3RX/PMA4/CN9/RG7 11 ERXDV/AERXDV/ECRSDV/AECRSDV/SCL4/SDO2/U3TX/PMA3/CN10/RG8 12 ERXCLK/AERXCLK/EREFCLK/AEREFCLK/SS2/U6RX/U3CTS/PMA2/CN11/RG9 14 TRD1/RG12 96 TRD0/RG13 97 TRD2/RG14 95 AERXERR/RG15 1 MCLR 13 VDD 86 VCAP/VDDCORE 85 VDD 2 VDD 16 VDD 37 VDD 46 VDD 62 AVDD 30 AVSS 31 VSS 15 VSS 36 VSS 45 VSS 65 VSS 75 U10 PIC32MX775 GND GND GND RE0/PMPD0 RE2/PMPD2 RE4/PMPD4 RE6/PMPD6 RD2 RD4 RD6 RD8 RD12 RD3/ADC_CLKIN RC3 RC13 RB10/PMPA13 RB12/PMPA11 RB5/AN5 RG9/ADC_CS RB6/AN6/PGC RA6 RA0/TMS RG15 RG12 RF12/U2CTS RA9/PMPA7 RA15/INT4 RB8/AN8 RF7 RF8 RA4/TDI RG0 RG1 RD14/U1CTS RE9 RB3/AN3 RG6/ADC_SCK RG7/ADC_MISO RG8/ADC_MOSI RB2/SS1/AN2 RD1/HOLD RD7 RD9 RD13 RE1/PMPD1 RE3/PMPD3 RE5/PMPD5 RE7/PMPD7 RD0/MOSI1 RB11/PMPA12 RB13/PMPA10 RC2 RC4/MISO1 RC14 RD5 MCLR RF3/U1TX RG2/SCL1 RG3/SDA1 RB4/AN4 RE8/INT1 RD15/U1RTS RF0 RF1 RF4/PMPA9/U2RX RA2/SCL2 RA3/SDA2 RB9/AN9 RA10/PMPA6 RF13/U2RTS RG1 RG13 RG14 RA1/TCK RA5/ADC_RESET RA7 RB7/AN7/PGD RF2/U1RX GND RB14/PMPA1 RF6/INT0/SCK1 RB0/AN0 RG0 RB15/PMPA0 RB1/AN1 RF5/PMPA8/U2TX GND GND GND GND GND GND PIM MODULE 3.3D 5V 9V 3.3D 5V 9V 3.3D 5V 9V 3.3D 5V 9V 3.3D 3.3D RD10/SCK1 RD11 GND GND GND RE0/PMPD0 RE2/PMPD2 RE4/PMPD4 RE6/PMPD6 RD2 RD4 RD6 RD8 RD12 RD3/ADC_CLKIN RC3 RC13 RB10/PMPA13 RB12/PMPA11 RB5/AN5 RG9/ADC_CS RB6/AN6/PGC RA6 RA0/TMS RG15 RG12 RF12/U2CTS RA9/PMPA7 RA15/INT4 RB8/AN8 RF7 RF8 RA4/TDI RG0 RG1 RD14/U1CTS RB3/AN3 RG6/ADC_SCK RG7/ADC_MISO RG8/ADC_MOSI RB2/SS1/AN2 RD1/HOLD RD7 RD9 RD13 RE1/PMPD1 RE3/PMPD3 RE5/PMPD5 RE7/PMPD7 RD0/MOSI1 RB11/PMPA12 RB13/PMPA10 RC2 RC4/MISO1 RC14 RD5 MCLR RF2/U1RX RF3/U1TX RG2/SCL1 RG3/SDA1 RB4/AN4 RE8/INT1 RD15/U1RTS RF0 RF1 RF4/PMPA9/U2RX RA2/SCL2 RA3/SDA2 RB9/AN9 RA10/PMPA6 RF13/U2RTS RG1 RG13 RG14 RA1/TCK RA5/ADC_RESET RA7 RB7/AN7/PGD GND RB14/PMPA1 RF6/INT0/SCK1 RB0/AN0 RG0 RB15/PMPA0 RB1/AN1 RF5/PMPA8/U2TX GND GND GND GND GND GND 3.3D 5V 9V 3.3D 5V 9V 3.3D 5V 9V 3.3D 5V 9V 3.3D 3.3D RD10/SCK1 RD11 MEC1-160-02-L-D-A 1 2 3 21 22 23 24 25 26 27 28 29 30 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 4 120 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 J17 1 2 3 21 22 23 24 25 26 27 28 29 30 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 4 120 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 J18 CON MEC1-160-02-X-D-A RE9 RC1 RC1 RA14/ADC_DR RA14/ADC_DR MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 24  2013 Microchip Technology Inc. A.6 SCHEMATIC – LCD AND UART 1 1 2 2 3 3 4 4 5 5 6 6 D D C C B B A A 5 5 MCP3913 Eval Board ADM00461 4 4/18/2013 6:06:56 PM LCD+USB+RS232.SchDoc Title Size: Number: Date: File: Revision: Sheet of Time: B Designed with Drawn By: Bogdan Popescu Checked: Adrian Mot Approved: Craig Approved: King Date: Date: Date: Date: Revision History Approved Date Description Rev ECO www.Altium.com GND USB DATAVIEW PORT USB-B-Mini SMD ID 4 VBUS 1 GND 5 D- 2 D+ 3 V ID BUS GND D- D+ J15 5V_USB U8-RX GND GND GND MCP2200 U9-RX VDD MCP2200 1 OSC1 2 OSC2 3 RST 4 GP7/TxLED 5 GP6/RxLED 6 GP5 7 GP4 8 GP3 9 TX 10 RTS 11 RX 12 CTS 13 GP2 14 GP1 15 GP0 16 VUSB 17 D- 18 D+ 19 VSS 20 VDD OSC1 OSC2 RST GP7/TxLED GP6/RxLED GP5 GP4 GP3 TX RTS RX CTS GP2 GP1 GP0 VUSB D D- + VSS U9 LED RD/GN SMD 2 1 3 4 GREEN RED LD6 HDR M 1x3 VERT 123 J16 C37 0.1uF 0603 12MHz 2 3 1 X3 C36 0.1uF 0603 R58 4.7k 5% 0603 5V_USB RX TX RD15/U1RTS RC14 GND RX GND TX RC13 U8-RX GND RD14/U1CTS C32 0.1uF 0603 0.1uF 0603 C33 0.1uF 0603 C34 C35 0.1uF 0603 GND GND 3.3D 3.3D C31 0.1uF 0603 GND GND GND 5% 1k 0603 R56 DB-9-RA_F 1 6 2 7 3 8 4 9 5 J14 SN75C3223PWR C2+ 5 C2- 6 V- 7 T2OUT 8 R2IN 9 R2OUT 10 INVALID 11 T2IN 12 T1N 13 FORCE_ON 14 R1OUT 15 R1IN 16 T1OUT 17 GND 18 VCC 19 FORCE_OFF 20 EN 1 C1+ 2 V+ 3 C1- 4 C2+ C2- V- T2OUT R2IN R2OUT INVALID T2IN T1N FORCE_ON R1OUT R1IN T1OUT GND VCC FORCE_OFF EN C1+ V+ C U8 1- 5% 1k 0603 R57 USB_P USB_N USB_N USB_P GND GND R59 1k 5% 0603 R60 1k 5% 0603 B2 TXS0102 1 GND 2 VCCA 3 A2 4 A1 5 OE 6 VCCB 7 B1 8 B2 GND VCCA A2 A1 OE VCCB B1 U11 U9-RX GND 5V_USB 3.3D 5V_USB USB_EN 3.3D 5V_USB NHD-C0216CIZ RST 1 SCL 2 SDA 3 VSS 4 VDD 5 VOUT 6 C1+ 7 C1- 8 A K LCD1 3.3D 5% 4.7k 0603 R53 3.3D 10 0603 5% R54 1uF 0603 C63 1uF 0603 C62 C64 0.1uF 0603 0.1uF 0603 C65 R52 1k 5% 0603 1k 5% 0603 R55 1k 5% 0603 R98 RA2/SCL2 RA3/SDA2 3.3D 3.3D 5V GND GND GND RF5/PMPA8/U2TX RF4/PMPA9/U2RX RF5/PMPA8/U2TX Schematics and Layouts  2013 Microchip Technology Inc. DS50005224A-page 25 A.7 BOARD – TOP TRACE AND TOP SILK A.8 BOARD – BOTTOM TRACE AND BOTTOM SILK MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 26  2013 Microchip Technology Inc. A.9 BOARD – LAYER #2 GND A.10 BOARD – LAYER #3 VDD Schematics and Layouts  2013 Microchip Technology Inc. DS50005224A-page 27 A.11 BOARD – TOP SILK AND PADS A.12 BOARD – BOTTOM SILK AND PADS MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 28  2013 Microchip Technology Inc. NOTES: MCP3913 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE  2013 Microchip Technology Inc. DS50005224A-page 29 Appendix B. Bill of Materials (BOM) TABLE B-1: BILL OF MATERIALS (BOM) Qty Reference Description Manufacturer Part Number 46 C1, C2, C3, C4, C5, C8, C9, C10, C11, C12, C14, C16, C18, C27, C28, C29, C30, C31, C32, C33, C34, C35, C36, C37, C38, C39, C40, C41, C42, C43, C46, C47, C48, C49, C50, C51, C52, C53, C54, C55, C56, C61, C64, C65, C66, C67 Cap. cer. 0.1uF 16V 10% X7R 0603 TDK Corp. C1608X7R1C104K 3 C13, C44, C45 Cap. cer. 10uF 10V 20% X7R SMD 1206 TDK Corp. C3216X7R1A106M 1 C15 Cap. Tant. 10uF 20V 10% 2.1 Ohm Size B AVX Corp. TAJB106K020RNJ 1 C17 Cap. cer. 10uF 10V X7R 20% 1206 TDK Corp. C3216X7R1A106M 0 C19, C20, C21, C22, C23, C24, C57, C58, C59, C60 DO NOT POPULATE – Cap. cer. 0.1uF 16V 10% X7R 0603 TDK Corp. C1608X7R1C104K 2 C25, C26 Cap. cer. 22pF 50V 5% C0G 0603 TDK Corp. C1608C0G1H220J 2 C6, C7 Cap. cer. 15pF 50V 5% NP0 SMD 0603 Yageo Corp. CC0603JRNP09BN150 2 C62, C63 Cap. cer. 1uF 10V X7R 20% 0603 TDK Corp. C1608X7R1A105M 1 D1 Diode std. rec. 1A 600V SMA ON Semiconductor MRA4005T3G 7 J1, J3, J4, J7, J21, J23, J25 Conn. hdr. Male .100 2x3 pos. vert. FCI 67996-206HLF 1 J10 Conn. power jack male 2.5 MM CLSD CUI Inc PJ-002B 1 J11 Conn. hdr.-2.54 male 1x6 TH R/A FCI 68016-106HLF 1 J14 Conn. D-sub. rcpt. R/A 9 pos. 15 GOLD TE Connectivity Ltd. 1734354-2 1 J15 Conn. Recept. mini SMD R/A 5 pos. Hirose Electric Co Ltd. UX60-MB-5ST 1 J16 Conn. hdr. male .100 1x3 pos. vert. FCI 68000-103HLF 1 J17 Mini edge card socket 1 mm pitch vertical Samtec, Inc. MEC1-160-02-L-D-A 6 J2, J5, J20, J22, J24, J26 Conn. term. blk. plug 6A 3.5 MM 3 pos. (mates with 8724 hdr.-24 pin) Keystone Electronics Corp. 8723 0 J27, J29 DO NOT POPULATE – Conn. hdr. male .100 2x3 pos. vertical Tyco Electronics Hdr. M. 2x3 vertical Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. MCP3913 ADC Evaluation Board for 16-Bit MCUs User’s Guide DS50005224A-page 30  2013 Microchip Technology Inc. 0 J28, J30 DO NOT POPULATE – Conn. Term. blk. plug 6A 3.5 MM 3 pos. (mates with 8724 hdr.-24 pin) Keystone Electronics Corp. 8723 4 J6, J12, J13, J19 Conn. hdr. male .100 1x2 pos. vertical FCI 77311-118-02LF 1 J8 Conn. hdr. male .100 2x8 pos. vertical FCI 68602-116HLF 1 J9 Conn. hdr. male .100 2x2 pos. vertical FCI 68602-204HLF 1 L1 Ferrite 300 MA 500 mOhm 1806 SMD Laird Technologies LI1806C151R-10 1 LCD1 LCD cog. char. 2X16 Transfl. Shenzhen Multisight Display Co., Ltd. NHD-C0216- CIZ-FSW-FBW-3V3 2 LD1, LD2 LED Smart LED green 570 nm 0603 OSRAM Opto Semiconductors GmbH. LG L29K-G2J1-24-Z 1 LD3 LED Smart LED red 630 nm 0603 OSRAM Opto Semiconductors GmbH. LS L29K-G1J2-1-0-2-R18-Z 2 LD4, LD5 LED 5 mm red 640 nm 20 mcd 2 mA Kingbright Corp. WP7113LSRD 1 LD6 LED 2X1.2 mm red/green wtr. clr. SMD Kingbright Corp. APHBM2012SURKCGKC 5 PAD1 Mech. HW rubber pad Bumpon Hemisphere 0.44" x 0.20" black 3M SJ-5003 (BLACK) 1 Q1 MOSFET P 12V 850 mA 290 mW SC-70-3 Vishay/Siliconix SI1307EDL-T1-GE3 0 R1, R2, R23, R24, R64, R66, R70, R72, R76, R78, R82, R84, R86, R87, R88, R89, R90, R91, R92, R93, R94, R95, R96, R97 DO NOT POPULATE – Res. TKF 1k 1% 1/10W SMD 0603 Panasonic - ECG ERJ-3EKF1001V 2 R20, R42 Res. 1M Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF1004V 20 R25, R26, R29, R30, R35, R37, R45, R46, R47, R49, R50, R51, R52, R55, R56, R57, R59, R60, R63, R98 Res. 1k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ102V 2 R27, R32 Res. 0 Ohm 1/10W 0603 SMD Panasonic - ECG ERJ-3GEY0R00V 2 R28, R62 Res. 10k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ103V 24 R3, R4, R11, R13, R15, R16, R18, R19, R21, R22, R65, R67, R68, R69, R71, R73, R74, R75, R77, R79, R80, R81, R83, R85 Res. TKF 1k 1% 1/10W SMD 0603 Panasonic - ECG ERJ-3EKF1001V 0 R31, R34 DO NOT POPULATE – Resistor 10 Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ100V TABLE B-1: BILL OF MATERIALS (BOM) Qty Reference Description Manufacturer Part Number Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. Bill of Materials (BOM)  2013 Microchip Technology Inc. DS50005224A-page 31 6 R33, R36, R44, R48, R53, R58 Res. 4.7k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ472V 2 R38, R39 Res. 2.2k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ222V 0 R40, R41 DO NOT POPULATE – Resistor 1k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ102V 0 R43 DO NOT POPULATE – Resistor 1M Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF1004V 1 R5 Res. 100 Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ101V 9 R6, R7, R8, R9, R10, R12, R14, R17, R54 Res. 10 Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ100V 4 SW1, SW2, SW3, SW4 Switch tact. 6 MM 160GF H = 4.3 MM Omron Electronics LLC - EMC Division B3S-1000P 0 U1 DO NOT POPULATE – PIC24FJxxxGA110 Microchip Technology Inc. PIC24FJ256GA110 1 U10 Four 25 X 1 header 1.27 mm pitch (100 pin socket) Samtec, Inc. MTMS-125-01-G-S-230 1 U11 IC Volt-level translator US-8 Texas Instruments TXS0102DCUR 4 U12, U13, U14, U15 IC SRAM SPI 1024K 2.5V TSSOP-8 Microchip Technology Inc. 23LC1024-I/ST 1 U2 IC LDO reg. 500 MA 3.3V SOT-223-3 Microchip Technology Inc. MCP1825S-3302E/DB 1 U3 IC reg. LDO 150 mA 3.3V SOT-223-3 Microchip Technology Inc. MCP1754ST-3302E/DB 1 U4 IC reg. LDO 800 MA 5V SOT-223 National Semiconductor LM1117MPX-5.0/NOPB 1 U5 IC 6-Ch AFE QFN-40 Microchip Technology Inc. MCP3913 2 U6, U7 Photocoupler Trans. out 4-minipak Avago Technologies HCPL-181-00CE 1 U8 IC line driver/receiver RS232 20-TSSOP Texas Instruments SN75C3223PWR 1 U9 IC USB to UART SSOP-20 Microchip Technology Inc. MCP2200-I/SS 1 X1 Crystal 10 MHz 18 pF HC49-SMD-B Abracon® Corporation ABLS-10.000MHZ-B4-T 1 X2 Crystal 7.3728 MHz 18 pF HC49-SMD-B Abracon Corporation ABLS-7.3728MHZ-B4-T 1 X3 Resonator 12 MHz 0.1% SMD CSTCE-G Murata Electronics® CSTCE12M0G15L99-R0 TABLE B-1: BILL OF MATERIALS (BOM) Qty Reference Description Manufacturer Part Number Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. DS50005224A-page 32  2013 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7828 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Worldwide Sales and Service 08/20/13  2012-2014 Microchip Technology Inc. DS50002081B MPLAB® ICD 3 In-Circuit Debugger User’s Guide For MPLAB X IDE DS50002081B-page 2  2012-2014 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2012-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-604-5  2012-2014 Microchip Technology Inc. DS50002081B-page 3 Object of Declaration: MPLAB® ICD 3 In-Circuit Debugger DS50002081B-page 4  2012-2014 Microchip Technology Inc. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE Table of Contents Preface ........................................................................................................................... 6 Part 1 –Getting Started Chapter 1. About the Debugger 1.1 Introduction ................................................................................................... 11 1.2 MPLAB ICD 3 In-Circuit Debugger Defined ................................................. 11 1.3 How the MPLAB ICD 3 In-Circuit Debugger Helps You ............................... 12 1.4 MPLAB ICD 3 In-Circuit Debugger Components ......................................... 12 Chapter 2. Operation 2.1 Introduction ................................................................................................... 13 2.2 Tools Comparison ........................................................................................ 14 2.3 Debugger to Target Communication ............................................................ 15 2.4 Target Communication Connections ............................................................ 17 2.5 Debugging .................................................................................................... 20 2.6 Requirements for Debugging ....................................................................... 21 2.7 Programming ................................................................................................ 23 2.8 Resources Used by the Debugger ............................................................... 23 Part 2 –Features Chapter 3. Debugger Usage 3.1 Introduction ................................................................................................... 25 3.2 Installation and Setup ................................................................................... 25 3.3 Common Debug Features ............................................................................ 26 3.4 Quick Debug/Program Reference ................................................................ 26 3.5 Debugger Limitations ................................................................................... 26 3.6 Connecting the Target .................................................................................. 26 3.7 Setting Up the Target Board ......................................................................... 27 3.8 Starting and Stopping Debugging ................................................................ 28 3.9 Viewing Processor Memory and Files .......................................................... 28 3.10 Breakpoints and Stopwatch ........................................................................ 29 Part 3 –Troubleshooting Chapter 4. Troubleshooting First Steps 4.1 Introduction ................................................................................................... 32 4.2 The Five Questions to Answer First ............................................................. 32 4.3 Top Reasons Why You Can’t Debug ........................................................... 32 4.4 Other Things to Consider ............................................................................. 33 Chapter 5. Frequently Asked Questions (FAQs) 5.1 Introduction ................................................................................................... 34 Table of Contents  2012-2014 Microchip Technology Inc. DS50002081B-page 5 5.2 How Does It Work? ...................................................................................... 34 5.3 What’s Wrong? ............................................................................................. 36 Chapter 6. Error Messages 6.1 Introduction ................................................................................................... 37 6.2 Specific Error Messages .............................................................................. 37 6.3 General Corrective Actions .......................................................................... 39 6.4 Information Messages .................................................................................. 40 Chapter 7. Engineering Technical Notes (ETNs) Part 4 –Reference Appendix A. Debugger Function Summary A.1 Introduction .................................................................................................. 43 A.2 Debugger Selection and Switching .............................................................. 43 A.3 Debugger Options Selection ........................................................................ 43 Appendix B. Hardware Specification B.1 Introduction .................................................................................................. 47 B.2 Highlights ..................................................................................................... 47 B.3 USB Port/Power ........................................................................................... 47 B.4 MPLAB ICD 3 In-Circuit Debugger .............................................................. 48 B.5 Standard Communication Hardware ............................................................ 49 B.6 ICD 3 Test Interface Board .......................................................................... 51 B.7 Target Board Considerations ....................................................................... 52 Appendix C. Revision History Support ........................................................................................................................ 54 A.1 Warranty Registration .................................................................................. 54 A.2 The Microchip Web Site ............................................................................... 54 A.3 myMicrochip Personalized Notification Service ........................................... 54 A.4 Customer Support ........................................................................................ 55 Glossary ....................................................................................................................... 56 Index ............................................................................................................................. 76 Worldwide Sales and Service .................................................................................... 78 MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 6  2012-2014 Microchip Technology Inc. Preface INTRODUCTION This chapter contains general information that will be useful to know before using the MPLAB ICD 3 In-Circuit Debugger. Items discussed in this chapter include: • Document Layout • Conventions Used in this Guide • Recommended Reading NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® X IDE online help. Select the Help menu, and then Topics to open a list of available online help files. Preface  2012-2014 Microchip Technology Inc. DS50002081B-page 7 DOCUMENT LAYOUT This document describes how to use the MPLAB ICD 3 In-Circuit Debugger as a development tool to emulate and debug firmware on a target board, as well as how to program devices. The document is organized as follows: Part 1 – Getting Started • Chapter 1. About the Debugger – What the MPLAB ICD 3 In-Circuit Debugger is and how it can help you develop your application. • Chapter 2. Operation – The theory of MPLAB ICD 3 In-Circuit Debugger operation. Explains configuration options. Part 2 – Features • Chapter 3. Debugger Usage – A description of basic debug features available in MPLAB X IDE when the MPLAB ICD 3 In-Circuit Debugger is chosen as the debug tool. This includes the debug features for breakpoints and stopwatch. Part 2 – Troubleshooting • Chapter 4. Troubleshooting First Steps – The first things you should try if you are having issues with debugger operation. • Chapter 5. Frequently Asked Questions (FAQs) – A list of frequently asked questions, useful for troubleshooting. • Chapter 6. Error Messages – A list of error messages and suggested resolutions. • Chapter 7. Engineering Technical Notes (ETNs) Part 3 – Reference • Appendix A. Debugger Function Summary – A summary of debugger functions available in MPLAB X IDE when the MPLAB ICD 3 debugger is chosen as the debug or program tool. • Appendix B. Hardware Specification – The hardware and electrical specifications of the debugger system. • Appendix C. Revision History MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 8  2012-2014 Microchip Technology Inc. CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Represents Examples Arial font: Italic characters Referenced books MPLAB® IDE User’s Guide Emphasized text ...is the only compiler... Initial caps A window the Output window A dialog the Settings dialog A menu selection select Enable Programmer Quotes A field name in a window or dialog “Save project before build” Underlined, italic text with right angle bracket A menu path File>Save Bold characters A dialog button Click OK A tab Click the Power tab N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. 4‘b0010, 2‘hF1 Text in angle brackets < > A key on the keyboard Press , Courier New font: Plain Courier New Sample source code #define START Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -OpaBit values 0, 1 Constants 0xFF, ‘A’ Italic Courier New A variable argument file.o, where file can be any valid filename Square brackets [ ] Optional arguments mcc18 [options] file [options] Curly brackets and pipe character: { | } Choice of mutually exclusive arguments; an OR selection errorlevel {0|1} Ellipses... Replaces repeated text var_name [, var_name...] Represents code supplied by user void main (void) { ... } Preface  2012-2014 Microchip Technology Inc. DS50002081B-page 9 RECOMMENDED READING This user's guide describes how to use MPLAB ICD 3 In-Circuit Debugger. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources. Multi-Tool Design Advisory (DS51764) Please read this first! This document contains important information about operational issues that should be considered when using the MPLAB ICD 3 with your target design. Release Notes for MPLAB ICD 3 In-Circuit Debugger For the latest information on using MPLAB ICD 3 In-Circuit Debugger, read the notes under “Release Notes and Support Documentation” on the MPLAB X IDE Start Page. The release notes contain update information and known issues that may not be included in this user’s guide. MPLAB X - Using MPLAB ICD 3 In-Circuit Debugger Poster (DS52011) This poster shows you how to hook up the hardware and install the software for the MPLAB ICD 3 In-Circuit Debugger using standard communications and a target board. MPLAB ICD 3 In-Circuit Debugger User’s Guide (DS51766) A comprehensive user’s guide for the debugger. Usage, troubleshooting and hardware specifications are included. MPLAB ICD 3 In-Circuit Debugger Online Help File A comprehensive help file for the debugger is included with MPLAB X IDE. Usage, troubleshooting and hardware specifications are covered. This help file may be more up-to-date than the printed documentation. Processor Extension Pak and Header Specification (DS51292) This booklet describes how to install and use headers. Headers are used to better debug selected devices, without the loss of pins or resources. See also the PEP and Header online help file. Transition Socket Specification (DS51194) Consult this document for information on transition sockets available for use with headers. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 10  2012-2014 Microchip Technology Inc. Part 1 – Getting Started Chapter 1. About the Debugger .................................................................................. 11 Chapter 2. Operation.................................................................................................... 13 MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 11 Chapter 1. About the Debugger 1.1 INTRODUCTION An overview of the MPLAB® ICD 3 In-Circuit Debugger system is provided. • MPLAB ICD 3 In-Circuit Debugger Defined • How the MPLAB ICD 3 In-Circuit Debugger Helps You • MPLAB ICD 3 In-Circuit Debugger Components 1.2 MPLAB ICD 3 IN-CIRCUIT DEBUGGER DEFINED The MPLAB ICD 3 In-Circuit Debugger is an in-circuit debugger that is controlled through a PC running MPLAB X IDE software on a Windows® platform. The MPLAB ICD 3 In-Circuit Debugger is an integral part of the development engineer's tool suite. The application usage can vary from software development to hardware integration. The MPLAB ICD 3 In-Circuit Debugger is a complex debugger system used for hardware and software development of Microchip PIC® microcontrollers (MCUs) and dsPIC® Digital Signal Controllers (DSCs) that are based on In-Circuit Serial Programming™ (ICSP™) and Enhanced In-Circuit Serial Programming 2-wire serial interfaces. The debugger system will execute code like an actual device because it uses a device with built-in emulation circuitry instead of a special debugger chip. All available features of a given device are accessible interactively, and can be set and modified by the MPLAB X IDE interface. The MPLAB ICD 3 debugger was developed for debugging embedded processors with rich debug facilities which differ from conventional system processors in the following aspects: • Processors run at maximum speeds • Capability to incorporate I/O port data input In addition to debugger functions, the MPLAB ICD 3 In-Circuit Debugger system also may be used as a device production programmer. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 12  2012-2014 Microchip Technology Inc. 1.3 HOW THE MPLAB ICD 3 IN-CIRCUIT DEBUGGER HELPS YOU The MPLAB ICD 3 In-Circuit Debugger system allows you to: • debug your application on your own hardware in real time • debug with hardware breakpoints • debug with software breakpoints • set breakpoints based on internal events • monitor internal file registers • emulate full speed • program your device 1.4 MPLAB ICD 3 IN-CIRCUIT DEBUGGER COMPONENTS The components of the MPLAB ICD 3 In-Circuit Debugger system are: • MPLAB ICD 3 with indicator lights • USB cable to provide communications between the debugger and a PC and to provide power to the debugger • Cable to connect the MPLAB ICD 3 to a header module or target board • ICD 3 Test Interface Board FIGURE 1-1: BASIC DEBUGGER SYSTEM Additional hardware that may be ordered separately: • Transition socket • ICD headers • MPLAB processor extension kits USB Cable Indicator Lights Modular Cable to Target Board, Header or ICD 3 ICD 3 Test Interface Board Test Interface Board MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 13 Chapter 2. Operation 2.1 INTRODUCTION A simplified description of how the MPLAB ICD 3 In-Circuit Debugger system works is provided here. It is intended to provide enough information so that a target board can be designed that is compatible with the debugger for both debugging and programming operations. The basic theory of in-circuit debugging and programming is discussed so that problems, if encountered, are quickly resolved. • Tools Comparison • Debugger to Target Communication • Target Communication Connections • Debugging • Requirements for Debugging • Programming • Resources Used by the Debugger MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 14  2012-2014 Microchip Technology Inc. 2.2 TOOLS COMPARISON The MPLAB ICD 3 In-Circuit Debugger system differs physically and operationally from other Microchip debug tools as shown below. Specific features may vary by device - see the Development Tools Selector (DTS) on the Microchip website for details. TABLE 2-1: DEBUG TOOLS COMPARISON Features MPLAB ICD 3 In-Circuit Debugger PICkit 3 Programmer/ Debugger MPLAB REAL ICE™ In-Circuit Emulator USB Speed High and Full Full Only High and Full USB Driver Microchip HID Microchip USB Powered Yes Yes Yes Power to Target Yes Yes No Programmable VPP and VDD Yes Yes Yes Vdd Drain from Target <50uA 20mA <50uA Overvoltage/Overcurrent Protection Yes (HW) Yes (SW) Yes (HW) Device emulation Full speed Full speed Full speed HW Breakpoints Complex Simple Complex Stopwatch Yes Yes Yes SW Breakpoints Yes No Yes Program Image No 512K bytes No Serialized USB Yes Yes Yes Trace No No Yes Data Capture No No Yes Logic Probe Triggers No No Yes High Speed/LVDS Connection No No Yes Production Programmer Yes No Yes Operation  2012-2014 Microchip Technology Inc. DS50002081B-page 15 2.3 DEBUGGER TO TARGET COMMUNICATION The debugger system configurations are discussed in the following sections. 2.3.1 Standard ICSP Device Communication The debugger system can be configured to use standard ICSP communication for both programming and debugging functions. This 6-pin connection is the same one used by the older MPLAB ICD 2 In-Circuit Debugger. The modular cable can be inserted into either: • a matching socket at the target, where the target device is on the target board (Figure 2-1), or • a standard adapter/header board combo (available as a Processor Pak), which is then plugged into the target board (Figure 2-2). For more on standard communication, see Appendix B. “Hardware Specification”. FIGURE 2-1: STANDARD DEBUGGER SYSTEM – DEVICE WITH ON-BOARD ICE CIRCUITRY CAUTION Communication Failure. Do not connect the hardware before installing the software and USB drivers. CAUTION Debugger or Target Damage. Do not change hardware connections while the pod or target is powered. Note: Older header boards used a 6-pin (RJ-11) modular connector instead of an 8-pin connector, so these headers may be connected directly to the debugger. Target Board Target Device or PIM Power MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 16  2012-2014 Microchip Technology Inc. FIGURE 2-2: STANDARD DEBUGGER SYSTEM – ICE DEVICE Target Board Transition Socket Device-ICE Processor Pak Standard Header Adapter Device-ICE ICD Header OR Power Operation  2012-2014 Microchip Technology Inc. DS50002081B-page 17 2.4 TARGET COMMUNICATION CONNECTIONS 2.4.1 Standard Communication Target Connection Using the RJ-11 connector, the MPLAB ICD 3 In-Circuit Debugger is connected to the target device with the modular interface (six conductor) cable. The pin numbering for the connector is shown from the bottom of the target PCB in Figure 2-3. FIGURE 2-3: STANDARD CONNECTION AT TARGET 2.4.2 Target Connection Circuitry Figure 2-4 shows the interconnections of the MPLAB ICD 3 In-Circuit Debugger to the connector on the target board. The diagram also shows the wiring from the connector to a device on the target PCB. A pull-up resistor (usually around 50 k) connected from the VPP/MCLR line to the VDD is recommended so that the line may be strobed low to reset the device. FIGURE 2-4: STANDARD CONNECTION TARGET CIRCUITRY Note: Cable connections at the debugger and target are mirror images of each other, i.e., pin 1 on one end of the cable is connected to pin 6 on the other end of the cable. See Section B.5.2.3 “Modular Cable Specification”. 1 2 3 4 5 6 Target Connector Target Bottom Side PC Board VPP/MCLR Vss PGC VDD PGD LVP VDD VPP/MCLR PGC PGD VSS AVDD AVSS 2 1 5 4 3 User Reset 50K Interface Connector Application PCB Device MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 18  2012-2014 Microchip Technology Inc. 2.4.3 Target Powered In the following descriptions, only three lines are active and relevant to core debugger operation: pins 1 (VPP/MCLR), 5 (PGC) and 4 (PGD). Pins 2 (VDD) and 3 (VSS) are shown on Figure 2-4 for completeness. MPLAB ICD 3 has two configurations for powering the target device: internal debugger and external target power. The recommended source of power is external and derived from the target application. In this configuration, target VDD is sensed by the debugger to allow level translation for the target low-voltage operation. If the debugger does not sense voltage on its VDD line (pin 2 of the interface connector), it will not operate. 2.4.4 Debugger Powered The internal debugger power is limited in two aspects: - the voltage range is not as wide (3-5V) - the amount of current it can supply is limited to 100 mA. This may be of benefit for very small applications that have the device VDD separated from the rest of the application circuit for independent programming. However, it is not recommended for general usage because it imposes more current demands from the USB power system derived from the PC. Be aware that the target VDD is sensed by the debugger to allow level translation for target low-voltage operation. If the debugger does not sense voltage on its VDD line (pin 2 of the interface connector), it will not allow communication with the target. Not all devices have the AVDD and AVSS lines, but if they are present on the target device, all must be connected to the appropriate levels in order for the debugger to operate. They cannot be left floating. In general, it is recommended that all VDD/AVDD and VSS/AVSS lines be connected to the appropriate levels. Also, devices with a VCAP line (PIC18FXXJ MCUs, for example) should be connected to the appropriate capacitor or level. Note: The interconnection is very simple. Any problems experienced are often caused by other connections or components on these critical lines that interfere with the operation of the MPLAB ICD 3 In-Circuit Debugger system, as discussed in the following section. Operation  2012-2014 Microchip Technology Inc. DS50002081B-page 19 2.4.5 Circuits That Will Prevent the Debugger From Functioning Figure 2-5 shows the active debugger lines with some components that will prevent the MPLAB ICD 3 In-Circuit Debugger system from functioning. FIGURE 2-5: IMPROPER CIRCUIT COMPONENTS In particular, these guidelines must be followed: • Do not use pull-ups on PGC/PGD – they will disrupt the voltage levels, since these lines have 4.7 k pull-down resistors in the debugger. • Do not use capacitors on PGC/PGD – they will prevent fast transitions on data and clock lines during programming and debugging communications. • Do not use capacitors on MCLR – they will prevent fast transitions of VPP. A simple pull-up resistor is generally sufficient. • Do not use diodes on PGC/PGD – they will prevent bidirectional communication between the debugger and the target device. No! No! No! No! VPP/MCLR PGC PGD 1 5 4 Interface Connector MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 20  2012-2014 Microchip Technology Inc. 2.5 DEBUGGING There are two steps to using the MPLAB ICD 3 In-Circuit Debugger system as a debugger. The first requires that an application be programmed into the target device (MPLAB ICD 3 can be used for this). The second uses the internal in-circuit debug hardware of the target Flash device to run and test the application program. These two steps are directly related to the MPLAB X IDE operations: 1. Programming the code into the target and activating special debug functions (see the next section for details). 2. Using the debugger to set breakpoints and run. If the target device cannot be programmed correctly, the MPLAB ICD 3 In-Circuit Debugger will not be able to debug. Figure 2-6 shows the basic interconnections required for programming. Note that this is the same as Figure 2-4, but for the sake of clarity, the VDD and VSS lines from the debugger are not shown. FIGURE 2-6: PROPER CONNECTIONS FOR PROGRAMMING A simplified diagram of some of the internal interface circuitry of the MPLAB ICD 3 In-Circuit Debugger is shown. For programming, no clock is needed on the target device, but power must be supplied. When programming, the debugger puts programming levels on VPP/MCLR, sends clock pulses on PGC and serial data via PGD. To verify that the part has been programmed correctly, clocks are sent to PGC and data is read back from PGD. This conforms to the ICSP protocol of the device under development. See the device programming specification for details. +5V Programming 4.7 k 4.7 k VPP/MCLR PGC PGD 1 5 4 Internal Circuits VSS VDD Voltage Operation  2012-2014 Microchip Technology Inc. DS50002081B-page 21 2.6 REQUIREMENTS FOR DEBUGGING To debug (set breakpoints, see registers, etc.) with the MPLAB ICD 3 In-Circuit Debugger system, there are critical elements that must be working correctly: • The debugger must be connected to a PC. It must be powered by the PC via the USB cable, and it must be communicating with the MPLAB X IDE software via the USB cable. See Section 3.3 “Common Debug Features” for details. • The debugger must be connected as shown in Figure 2-6 to the VPP, PGC and PGD pins of the target device with the modular interface cable (or equivalent). VSS and VDD are also required to be connected between the debugger and target device. • The target device must have power and a functional, running oscillator. If, for any reason, the target device does not run, the MPLAB ICD 3 In-Circuit Debugger cannot debug. • The target device must have its Configuration words programmed correctly: - The oscillator Configuration bits should correspond to RC, XT, etc., depending on the target design. - For some devices, the Watchdog Timer is enabled by default and needs to be disabled. - The target device must not have code protection enabled. - The target device must not have table read protection enabled. - For some devices with more than one PGC/PGD pair, the correct pair needs to be configured. This only refers to debugging, since programming will work over any PGC/PGD pair. • PGM (LVP) should be disabled. When the conditions listed above are met, you may proceed to the following: • Sequence of Operations Leading to Debugging • Debugging Details 2.6.1 Sequence of Operations Leading to Debugging Given that the Requirements for Debugging are met, these actions can be performed when the MPLAB ICD 3 In-Circuit Debugger is set as the current tool from the MPLAB X IDE menu (Edit>Project Properties, Advanced, MPLAB Environment): • When Debug>Debug Project is selected, the application code is programmed into the device’s memory via the ICSP protocol as described at the beginning of this section. • A small “debug executive” program is loaded into the high area of program memory of the target device. Since the debug executive must reside in program memory, the application program must not use this reserved space. Some devices have special memory areas dedicated to the debug executive. Check your device data sheet for details. • Special “in-circuit debug” registers in the target device are enabled by MPLAB X IDE. These allow the debug executive to be activated by the debugger. For more information on the device’s reserved resources, see Section 2.8 “Resources Used by the Debugger”. • The target device is run in Debug mode. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 22  2012-2014 Microchip Technology Inc. 2.6.2 Debugging Details Figure 2-7 illustrates the MPLAB ICD 3 In-Circuit Debugger system when it is ready for debugging. FIGURE 2-7: MPLAB® ICD 3 IN-CIRCUIT DEBUGGER READY FOR DEBUGGING Typically, to find out whether an application program will run correctly, a breakpoint is set early in the program code. When a breakpoint is set from the user interface of MPLAB X IDE, the address of the breakpoint is stored in the special internal debug registers of the target device. Commands on PGC and PGD communicate directly to these registers to set the breakpoint address. Next, the Debug>Debug Project function is usually selected in MPLAB X IDE. The debugger tells the debug executive to run. The target starts from the Reset vector and executes until the program counter reaches the breakpoint address that was stored previously in the internal debug registers. After the instruction at the breakpoint address is executed, the in-circuit debug mechanism of the target device “fires” and transfers the device’s program counter to the debug executive (much like an interrupt) and the user’s application is effectively halted. The debugger communicates with the debug executive via PGC and PGD, gets the breakpoint status information, and sends it back to MPLAB X IDE. MPLAB X IDE then sends a series of queries to the debugger to get information about the target device, i.e., file register contents and the state of the CPU. These queries are ultimately performed by the debug executive. The debug executive runs just like an application in program memory. It uses some locations on the stack for its temporary variables. If the device does not run, for whatever reason, such as no oscillator, faulty power supply connection, shorts on the target board, etc., then the debug executive cannot communicate to the MPLAB ICD 3 In-Circuit Debugger, and MPLAB X IDE will issue an error message. +5V +12V 4.7 k 4.7 k Internal Circuits Program Memory File Registers Internal Debug Registers VPP/MCLR PGC PGD 1 5 4 Executive Debug Area Used by Target be Running must for Debug Executive to Function Area VDD Hardware Stack Shared by Debug Exec Debug Exec Reserved for Debug Executive Operation  2012-2014 Microchip Technology Inc. DS50002081B-page 23 Another way to get a breakpoint is to select Debug>Pause. This toggles the PGC and PGD lines so that the in-circuit debug mechanism of the target device switches the Program Counter from the user’s code in program memory to the debug executive. Again, the target application program is effectively halted, and MPLAB X IDE uses the debugger communications with the debug executive to interrogate the state of the target device. 2.7 PROGRAMMING Use the MPLAB ICD 3 as a programmer to program an actual (non -ICE/-ICD) device, i.e., a device not on a header board. Set the MPLAB ICD 3 In-Circuit Debugger as the current tool (Edit>Project Properties, Advanced, MPLAB Environment) to perform these actions: • When Run>Run Project is selected, the application code is programmed into the device’s memory via the ICSP protocol. No clock is required while programming, and all modes of the processor can be programmed, including code protect, Watchdog Timer enabled, and table read protect. • A small “program executive” program may be loaded into the high area of program memory for some target devices. This increases programming speeds for devices with large memories. • Special “in-circuit debug” registers in the target device are disabled by MPLAB X IDE, along with all debug features. This means that a breakpoint cannot be set, and register contents cannot be seen or altered. • The target device is run in Release mode. As a programmer, the debugger can only toggle the MCLR line to Reset and start the target. 2.8 RESOURCES USED BY THE DEBUGGER For a complete list of resources used by the debugger for your device, please see the online help file in MPLAB X IDE for the MPLAB ICD 3 In-Circuit Debugger. From the MPLAB X IDE Start Page, click on Release Notes and Support Documentation, then clock on the link for the Reserved Resources for MPLAB ICD 3. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 24  2012-2014 Microchip Technology Inc. Part 2 – Features Chapter 3. Debugger Usage ........................................................................................ 25 MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 25 Chapter 3. Debugger Usage 3.1 INTRODUCTION The following topics regarding how to install and use the MPLAB ICD 3 In-Circuit Debugger are discussed. • Installation and Setup • Common Debug Features • Quick Debug/Program Reference • Debugger Limitations • Connecting the Target • Setting Up the Target Board • Starting and Stopping Debugging • Viewing Processor Memory and Files • Breakpoints and Stopwatch 3.2 INSTALLATION AND SETUP Refer to the Help file “Getting Started with MPLAB X IDE” for details on installing the IDE and setting up the debugger to work with it. In summary: 1. Install MPLAB X IDE. 2. Connect the MPLAB ICD 3 to the PC and allow the default USB drivers to install. For more information on target connections, see Chapter 2. “Operation”. 3. Install the language toolsuite/compiler you want to use for development. 4. Launch MPLAB X IDE. 5. Use the New Project wizard (File>New Project) to add your “ICD 3” debugger to your project. 6. Use the project Properties dialog (File>Project Properties) to set up options. 7. Use the project Properties dialog (File/Project Properties) to set up tool options for programming. 8. Run the project (build and run) from Run>Run Project. Items of note are: 1. Each debugger contains a unique identifier which, when first installed, will be recognized by the OS, regardless of which computer USB port is used. 2. MPLAB X IDE operation connects to the hardware tool at runtime (Run or Debug Run). To always be connected to the hardware tool (like MPLAB IDE v8), see Tools>Options, Embedded button, Generic Settings tab, “Keep hardware tool connected” check box. 3. Configuration bits can only be viewed in the Configuration Bits window. To set them in code select Window>PIC Memory Views, then, select “Configuration Bits” from the Memory drop list, and select “Read/Write” from the Format drop list to enable access to the settings. Note: The debugger can power a target board only up to 100 mA. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 26  2012-2014 Microchip Technology Inc. 3.3 COMMON DEBUG FEATURES Refer to the Help file “Getting Started with MPLAB X IDE”, Debugging Code section for details on debug features. That section includes: 1. Debug Running the project (build, program and run) from Debug>Debug Project. 2. Using breakpoints 3. Stepping through code 4. Using the Watch window 5. Viewing Memory, Variables and the Call Stack 6. Using the Call Graph 3.4 QUICK DEBUG/PROGRAM REFERENCE The following table is a quick reference for using the MPLAB ICD 3 In-Circuit Debugger as either a debugging or programming tool. 3.5 DEBUGGER LIMITATIONS For a complete list of debugger limitations for your device, please see the online help file in MPLAB X IDE for the MPLAB ICD 3 In-Circuit Debugger. 3.6 CONNECTING THE TARGET A connection is built in to select the type of communication with the target. See Section 2.3 “Debugger to Target Communication” for more details and a diagram. 1. Plug in the USB/power cable if not already connected. 2. Attach the communication cable(s) between debugger and target. TABLE 3-1: DEBUG VS. PROGRAM OPERATION Item Debug Program Needed Hardware A PC and target application (Microchip demo board or your own design). Debugger pod, USB cable, communication driver board(s) and cable(s). Device with on-board debug circuitry or debug header with special -ICE device. Device (with or without on-board debug circuitry). MPLAB X IDE selection Project Properties, ICD 3 as Hardware Tool. Debug>Debug Run Program Target Project toolbar button. Program operation Programs application code into the device. Depending on the selections on the Project Properties dialog, this can be any range of program memory. In addition, a small debug executive is placed in program memory and other debug resources are reserved. Programs application code into the device. Depending on the selections on the Project Properties dialog, this can be any range of program memory. Debug features available All for device – breakpoints, trace, etc. N/A. Serial Quick-Time Programming (SQTP) N/A Use the MPLAB PM3 to generate the SQTP file. Then, use the ICD3CMD to program the device. Command-line operation N/A Use ICD3CMD, found by default in: C:\Program Files (x86)\Microchip\MPLABX\mplab_ipe. Debugger Usage  2012-2014 Microchip Technology Inc. DS50002081B-page 27 FIGURE 3-1: CONNECT COMMUNICATIONS AND USB/POWER CABLES 3.7 SETTING UP THE TARGET BOARD The target must be set up for the type of target device to be used. 3.7.1 Using Production Devices For production devices, the debugger may be connected directly to the target board. The device on the target board must have built-in debug circuitry in order to debug with the MPLAB ICD 3 In-Circuit Debugger. Consult the device data sheet to see whether the device has the necessary debug circuitry, i.e., it should have a “Background Debugger Enable” Configuration bit. The target board must have a connector to accommodate the communications chosen for the debugger. For connection information, see Section 2.3 “Debugger to Target Communication”. 3.7.2 Using ICE Devices For ICE devices, an ICE header board is required. The header board contains the hardware that is required to emulate a specific device or family of devices. For more information on ICE headers, see the “Processor Extension Pak and Header Specification” (DS51292). A transition socket is used with the ICE header to connect the header to the target board. Transition sockets are available in various styles to allow a common header to be connected to one of the supported surface mount package styles. For more information on transition sockets, see the “Transition Socket Specification” (DS51194). Header board layout will be different for headers or processor extension packs. For connection information, see Section 2.3 “Debugger to Target Communication”. USB/Power From PC Communications Cable From Target 2 1 MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 28  2012-2014 Microchip Technology Inc. 3.7.3 Powering the Target There are a couple of configurations for powering MPLAB ICD 3 and the target. These are configuration essentials: • When using the USB connection, the MPLAB ICD 3 can be powered from the PC, but it can only provide a limited amount of current, up to 100 mA, (at VDD from 3-5V) to a small target board). • The desired method is for the target to provide VDD, as it can provide a wider voltage range from 2-5V. The additional benefit is that plug-and-play target detection facility is inherited, i.e., MPLAB X IDE will let you know in the Output window when it has detected the target and has detected the device. If you have not already done so, connect the MPLAB ICD 3 to the target using the appropriate cables (see Section 3.6 “Connecting the Target”). Then power the target. 3.8 STARTING AND STOPPING DEBUGGING To debug an application in MPLAB X IDE, you must create a project containing your source code so that the code may be built, programmed into your device, and executed as specified below: • To run your code, select either Debug>Debug Project or Debug Project from the Run toolbar. • To halt your code, select either Debug>Pause or Pause from the Debug toolbar. • To run your code again, select either Debug>Continue or Continue from the Debug toolbar. • To step through your code, select either Debug>Step Into or Step Into from the Debug toolbar. Be careful not to step into a Sleep instruction or you will have to perform a processor Reset to resume emulation. • To step over a line of code, select either Debug>Step Over or Step Over from the Debug toolbar. • To end code execution, select either Debug>Finish Debugger Session or Finish Debugger Session from the Debug toolbar. • To perform a processor Reset on your code, select either Debug>Reset or Reset from the Debug toolbar. Additional Resets, such as POR/BOR, MCLR and System, may be available, depending on the device. 3.9 VIEWING PROCESSOR MEMORY AND FILES MPLAB X IDE provides several windows, for viewing debug and various processor memory information that are selectable from the Window menu. See MPLAB X IDE online help for more information on using these windows. • Window>PIC Memory Views - View data (RAM) and code (ROM) device memory. Select from RAM, Flash, special function registers (SFRs), CPU, and Configuration bits. • Window>Debugging - View debug information. Select from variables, watches, call stack, breakpoints, and stopwatch. Note: The target voltage is only used for powering up the drivers for the ICSP interface; the target voltage does not power up the MPLAB ICD 3. The MPLAB ICD 3 system power is derived strictly from the USB port. Debugger Usage  2012-2014 Microchip Technology Inc. DS50002081B-page 29 To view your source code, find the source code file you wish to view in the Projects window and double-click to open in a Files window. Code in this window is color-coded according to the processor and build tool that you have selected. To change the style of color-coding, select Tools>Options, Fonts & Colors, Syntax tab. For more on the Editor, see NetBeans Help, IDE Basics>Basic File Features. 3.10 BREAKPOINTS AND STOPWATCH Use breakpoints to halt code execution at specified lines in your code. Use the stopwatch with breakpoints to time code execution. • Breakpoint Resources • Hardware or Software Breakpoint Selection • Breakpoint and Stopwatch Usage 3.10.1 Breakpoint Resources For 16-bit devices, breakpoints, data captures and runtime watches use the same resources. Therefore, the available number of breakpoints is actually the available number of combined breakpoints/triggers. For 32-bit devices, breakpoints use different resources than data captures and runtime watches. Therefore, the available number of breakpoints is independent of the available number of triggers. The number of hardware and software breakpoints available and/or used is displayed in the Dashboard window (Window>Dashboard). See the MPLAB X IDE documentation for more on this feature. Not all devices have software breakpoints. For limitations on breakpoint operation, including the general number of hardware breakpoints per device and hardware breakpoint skidding amounts, see the online help file in MPLAB X IDE for the MPLAB ICD 3 In-Circuit Debugger limitations. 3.10.2 Hardware or Software Breakpoint Selection To select hardware or software breakpoints: 1. Select your project in the Projects window. Then, select either File>Project Properties or right click and select “Properties”. 2. In the Project Properties dialog, select “ICD3” under “Categories”. 3. Under “Option Categories” select “Debug Options”. 4. Check “Use software breakpoints” to use software breakpoints. Uncheck to use hardware breakpoints. To help you decide which type of breakpoints to use (hardware or software) the following table compares the features of each. Note: Using software breakpoints for debug impacts device endurance. Therefore, it is recommended that devices used in this manner not be used as production parts. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 30  2012-2014 Microchip Technology Inc. TABLE 3-2: HARDWARE VS. SOFTWARE BREAKPOINTS 3.10.3 Breakpoint and Stopwatch Usage Breakpoints halt execution of code. To determine the time between the breakpoints, use the stopwatch. Please refer to the MPLAB X IDE online help for how to set up and use breakpoints and the stopwatch. Feature Hardware Breakpoints Software Breakpoints Number of breakpoints Limited Unlimited Breakpoints written to* Internal debug registers Flash Program Memory Breakpoints applied to** Program Memory/Data Memory Program Memory only Time to set breakpoints Minimal Dependent on oscillator speed, time to program Flash Memory and page size Breakpoint skidding Most devices. See the online help, Limitations section, for details. No * Where information about the breakpoint is written in the device. ** What kind of device feature applies to the breakpoint. This is where the breakpoint is set. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 31 Part 3 – Troubleshooting Chapter 4. Troubleshooting First Steps..................................................................... 32 Chapter 5. Frequently Asked Questions (FAQs) ....................................................... 34 Chapter 6. Error Messages.......................................................................................... 37 Chapter 7. Engineering Technical Notes (ETNs)....................................................... 41 MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 32  2012-2014 Microchip Technology Inc. Chapter 4. Troubleshooting First Steps 4.1 INTRODUCTION If you are having problems with MPLAB ICD 3 In-Circuit Debugger operation, start here. • The Five Questions to Answer First • Top Reasons Why You Can’t Debug • Other Things to Consider 4.2 THE FIVE QUESTIONS TO ANSWER FIRST 1. What device are you working with? Often an upgrade to a newer version of MPLAB X IDE is required to support newer devices. A yellow light = untested support. 2. Are you using a Microchip demo board or one of your own design? Have you followed the guidelines for resistors/capacitors for communications connections? See Chapter 2. “Operation”. 3. Have you powered the target? The debugger cannot power the target if greater than 100 mA. 4. Are you using a USB hub in your set up? Is it powered? If you continue to have problems, try using the debugger without the hub (plugged directly into the PC.) 5. Are you using the standard communication cable (RJ-11) shipped with the debugger? If you have made a longer cable, it could cause communications errors. 4.3 TOP REASONS WHY YOU CAN’T DEBUG 1. The oscillator is not working. Check your Configuration bits setting for the oscillator. If you are using an external oscillator, try using an internal oscillator. If you are using an internal PLL, make sure your PLL settings are correct. 2. The target board is not powered. Check the power cable connection. 3. The VDD voltage is outside the specifications for this device. See the device programming specification for details. 4. The debugger has become physically disconnected from the PC and/or the target board. Check the connections of the communications cables. 5. The device is code-protected. Check your Configuration bits setting for code protection. 6. Debugger to PC communications have been interrupted. Reconnect to the debugger in MPLAB X IDE. Troubleshooting First Steps  2012-2014 Microchip Technology Inc. DS50002081B-page 33 7. The production device you are trying to debug does not have debugging capabilities. Use a debug header instead. (See the “Processor Extension Pak and Debug Header Specification” in “Recommended Reading”). 8. The target application has somehow become corrupted or contains errors. For example, the regular linker script was used in the project instead of the debugger version of the linker script (e.g., 18F8722.lkr was used instead of 18F8722i.lkr). Try rebuilding and reprogramming the target application. Then initiate a Power-On-Reset of the target. 9. You do not have the correct PGC/PGD pin pairs programmed in your Configuration bits (for devices with multiple PGC/PGD pin pairs). 10. Other configuration settings are interfering with debugging. Any configuration setting that would prevent the target from executing code will also prevent the debugger from putting the code into Debug mode. 11. Brown-Out Detect voltage is greater than the operating voltage VDD. This means the device is in Reset and cannot be debugged. 12. The communications connection guidelines in Chapter 2. “Operation” were not followed. 13. The debugger cannot always perform the action requested. For example, the debugger cannot set a breakpoint if the target application is currently running. 4.4 OTHER THINGS TO CONSIDER 1. It is possible the error was a one-time glitch. Try the operation again. 2. There may be a problem programming in general. As a test, switch to Run mode and program the target with the simplest application possible (e.g., a program to blink an LED.) If the program will not run, then you know that something is wrong with the target setup. 3. It is possible that the target device has been damaged in some way (e.g., over current). Development environments are notoriously hostile to components. Consider trying another target device. 4. Microchip Technology Inc. offers demonstration boards to support most of its microcontrollers. Consider using one of these boards, which are known to work, to verify correct MPLAB ICD 3 In-Circuit Debugger functionality. Or, use the Loop-Back Test board to verify the debugger itself (Section B.6 “ICD 3 Test Interface Board”). 5. Review debugger operation to ensure proper application setup. For more information, see Chapter 2. “Operation”. 6. If the problem persists, contact Microchip Support. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 34  2012-2014 Microchip Technology Inc. Chapter 5. Frequently Asked Questions (FAQs) 5.1 INTRODUCTION Look here for answers to frequently asked questions about the MPLAB ICD 3 In-Circuit Debugger system. • How Does It Work? • What’s Wrong? 5.2 HOW DOES IT WORK? • What's in the silicon that allows it to communicate with the MPLAB ICD 3 In-Circuit Debugger? MPLAB ICD 3 In-Circuit Debugger can communicate with Flash silicon via the ICSP interface. It uses the debug executive located in test memory. • How is the throughput of the processor affected by having to run the debug executive? The debug executive doesn't run while in Run mode, so there is no throughput reduction when running your code, i.e., the debugger doesn’t ‘steal’ any cycles from the target device. • How does the MPLAB ICD 3 In-Circuit Debugger compare with other in-circuit emulators/debuggers? Please refer to Section 2.2 “Tools Comparison”. • How does MPLAB X IDE interface with the MPLAB ICD 3 In-Circuit Debugger to allow more features than older debuggers? MPLAB ICD 3 In-Circuit Debugger communicates using the debug executive located in the test area. The debug exec is streamlined for more efficient communication. The debugger contains an FPGA, large SRAM Buffers (1Mx8) and a High Speed USB interface. Program memory image is downloaded and is contained in the SRAM to allow faster programming. The FPGA in the debugger serves as an accelerator for interfacing with the device in-circuit debugger modules. • On traditional debuggers, the data must come out on the bus in order to perform a complex trigger on that data. Is this also required on the MPLAB ICD 3 In-Circuit Debugger? For example, could I halt, based on a flag going high? Traditional debuggers use a special debugger chip (-ME) for monitoring. There is no -ME with the MPLAB ICD 3 In-Circuit Debugger, so there are no busses to monitor externally. With the MPLAB ICD 3 In-Circuit Debugger, rather than using external breakpoints, the built-in breakpoint circuitry of the debug engine is used – the busses and breakpoint logic are monitored inside the part. • Does the MPLAB ICD 3 In-Circuit Debugger have complex breakpoints? Yes. You can break based on a value in a data memory location. You can also do sequenced breakpoints, where several events are happening before it breaks. However, you can only do two sequences. You can also do the AND condition and do PASS counts. Frequently Asked Questions (FAQs)  2012-2014 Microchip Technology Inc. DS50002081B-page 35 • Are any of the driver boards optoisolated or electrically isolated? They are DC optoisolated, but not AC optoisolated. You cannot apply a floating or high voltage (120V) to the current system. • What limitations are there with the standard cable? The standard ICSP RJ-11 cable does not allow for clock speeds greater than about 15 Mbps. dsPIC33F DSCs running at full speed are greater than the 15 Mbps. limit. • Will this slow down the running of the program? There is no cycle stealing with the MPLAB ICD 3 In-Circuit Debugger. The output of data is performed by the state machine in the silicon. • Is it possible to debug a dsPIC DSC running at any speed? The MPLAB ICD 3 is capable of debugging at any device speed as specified in the device’s data sheet. • What is the function of pin 6, the LVP pin? Pin 6 is reserved for the LVP (Low-Voltage Programming) connection. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 36  2012-2014 Microchip Technology Inc. 5.3 What’s Wrong? • Performing a Verify fails after programming the device. Is this a programming issue? If 'Run’ (Run>Run Project) is selected, the device will automatically run immediately after programming. Therefore, if your code changes the flash memory, verification could fail. To prevent the code from running after programming, please select 'Hold in Reset'. • My PC went into power-down/hibernate mode, and now my debugger won’t work. What happened? When using the debugger for prolonged periods of time, and especially as a debugger, be sure to disable the Hibernate mode in the Power Options Dialog window of your PC’s operating system. Go to the Hibernate tab and clear or uncheck the “Enable hibernation” check box. This will ensure that all communication is maintained across all the USB subsystem components. • I set my peripheral to NOT freeze on halt, but it is suddenly freezing. What's going on? For dsPIC30F/33F and PIC24F/H devices, a reserved bit in the peripheral control register (usually either bit 14 or 5) is used as a Freeze bit by the debugger. If you have performed a write to the entire register, you may have overwritten this bit. (The bit is user-accessible in Debug mode.) To avoid this problem, write only to the bits you wish to change for your application (BTS, BTC) instead of to the entire register (MOV). • When using a 16-bit device, an unexpected Reset occurred. How do I determine what caused it? Some things to consider: - To determine a Reset source, check the RCON register. - Handle traps/interrupts in an Interrupt Service Routine (ISR). You should include trap.c style code, i.e., void __attribute__((__interrupt__)) _OscillatorFail(void); : void __attribute__((__interrupt__)) _AltOscillatorFail(void); : void __attribute__((__interrupt__)) _OscillatorFail(void) { INTCON1bits.OSCFAIL = 0; //Clear the trap flag while (1); } : void __attribute__((__interrupt__)) _AltOscillatorFail(void) { INTCON1bits.OSCFAIL = 0; while (1); } : - Use ASSERTs. For example: ASSERT (IPL==7) MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 37 Chapter 6. Error Messages 6.1 INTRODUCTION The MPLAB ICD 3 In-Circuit Debugger produces various error messages; some are specific, some are informational, and others can be resolved with general corrective actions. In general, read any instructions under your error message. If those fail to fix the problem or if there are no instructions, refer to the following sections. • Specific Error Messages • General Corrective Actions • Information Messages 6.2 SPECIFIC ERROR MESSAGES 6.2.1 Debugger-to-Target Communication Errors Failed to send database If you receive this error: 1. Try downloading again. It may be a one-time error. 2. Try manually downloading the highest-number .jam file. If these actions fail to fix the problem, see Section 6.3.2 “Debugger-to-Target Communication Error Actions”. 6.2.2 Corrupted/Outdated Installation Errors Failed to download firmware If the Hex file exists: • Reconnect and try again. • If this does not work, the file may be corrupted. Reinstall MPLAB X IDE. If the Hex file does not exist: • Reinstall MPLAB IDE X. Unable to download debug executive If you receive this error while attempting to debug: 1. Deselect the debugger as the debug tool. 2. Close your project, and then close MPLAB IDE X. 3. Restart MPLAB IDE X, and re-open your project. 4. Reselect the debugger as the debug tool, and try to program the target device again. Unable to download program executive If you receive this error while attempting to program: 1. Deselect the debugger as the programmer. 2. Close your project, and then close MPLAB IDE X. 3. Restart MPLAB IDE X, and re-open your project. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 38  2012-2014 Microchip Technology Inc. 4. Reselect the debugger as the programmer, and try to program the target device again. If these actions fail to fix the problem, see Section 6.3.4 “Corrupted Installation Actions”. 6.2.3 Debug Failure Errors The target device is not ready for debugging. Please check your configuration bit settings and program the device before proceeding. You will receive this message if you try to Run before programming your device. If you receive this message after trying to Run, or immediately after programming your device: The device is code protected. The device on which you are attempting to operate (read, program, blank check or verify) is code protected, i.e., the code cannot be read or modified. Check your Configuration bits setting for code protection. Disable code protection, set or clear the appropriate Configuration bits in code or in the Configuration Bits window according to the device data sheet. Then erase and reprogram the entire device. If these actions fail to fix the problem, see Section 6.3.2 “Debugger-to-Target Communication Error Actions” and Section 6.3.6 “Debug Failure Actions”. 6.2.4 Miscellaneous Errors ICD 3 is busy. Please wait for the current operation to finish. If you receive this error when attempting to deselect the debugger as a debugger or programmer: 1. Wait - give the debugger time to finish any application tasks. Then try to deselect the debugger again. 2. Select Halt to stop any running applications. Then try to deselect the debugger again. 3. Unplug the debugger from the PC. Then try to deselect the debugger again. 4. Shut down MPLAB IDE X. Error Messages  2012-2014 Microchip Technology Inc. DS50002081B-page 39 6.3 GENERAL CORRECTIVE ACTIONS These general corrective actions may solve your problem: • Read/Write Error Actions • Debugger-to-Target Communication Error Actions • Debugger-to-PC Communication Error Actions • Corrupted Installation Actions • USB Port Communication Error Actions • Debug Failure Actions • Internal Error Actions 6.3.1 Read/Write Error Actions If you receive a read or write error: 1. Did you hit Abort? This may produce read/write errors. 2. Try the action again. It may be a one-time error. 3. Ensure that the target is powered and at the correct voltage levels for the device. See the device data sheet for required device voltage levels. 4. Ensure that the debugger-to-target connection is correct (PGC and PGD are connected.) 5. For write failures, ensure that “Erase all before Program” is checked on the Program Memory tab of the Settings dialog. 6. Ensure that the cables used are of the correct length. 6.3.2 Debugger-to-Target Communication Error Actions The MPLAB ICD 3 In-Circuit Debugger and the target device are out of sync with each other. 1. Select Reset and then try the action again. 2. Ensure that the cable(s) used are of the correct length. 6.3.3 Debugger-to-PC Communication Error Actions The MPLAB ICD 3 In-Circuit Debugger and MPLAB IDE X are out of sync with each other. 1. Unplug and then plug in the debugger. 1. Reconnect to the debugger. 2. Try the operation again. It is possible the error was a one-time glitch. 3. The version of MPLAB IDE X installed may be incorrect for the version of firmware loaded on the MPLAB ICD 3 In-Circuit Debugger. Follow the steps outlined in Section 6.3.4 “Corrupted Installation Actions”. 4. There may be an issue with the PC USB port. See Section 6.3.5 “USB Port Communication Error Actions”. 6.3.4 Corrupted Installation Actions The problem is most likely caused by a incomplete or corrupted installation of MPLAB IDE X. 1. Uninstall all versions of MPLAB IDE X from the PC. 2. Reinstall the desired MPLAB IDE X version. 3. If the problem persists contact Microchip Support. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 40  2012-2014 Microchip Technology Inc. 6.3.5 USB Port Communication Error Actions The problem is most likely caused by a faulty or non-existent communications port. 1. Reconnect to the MPLAB ICD 3 In-Circuit Debugger. 2. Make sure the debugger is physically connected to the PC on the appropriate USB port. 3. Make sure the appropriate USB port has been selected in the debugger Settings. 4. Make sure the USB port is not in use by another device. 5. If using a USB hub, make sure it is powered. 6. Make sure the USB drivers are loaded. 6.3.6 Debug Failure Actions The MPLAB ICD 3 In-Circuit Debugger was unable to perform a debugging operation. There are numerous reasons why this might occur. See Chapter 4. “Troubleshooting First Steps”. 6.3.7 Internal Error Actions Internal errors are unexpected and should not happen. They are primarily used for internal Microchip development. The most likely cause is a corrupted installation (Section 6.3.4 “Corrupted Installation Actions”). Another likely cause is exhausted system resources. 1. Try rebooting your system to free up memory. 2. Make sure you have a reasonable amount of free space on your hard drive (and that it is not overly fragmented.) If the problem persists contact Microchip Support. 6.4 INFORMATION MESSAGES MPLAB ICD 3 In-Circuit Debugger informational messages are listed below: ICD3Info0001: ICD3 is functioning properly. If you are still having problems with your target circuit please check the Target Board Considerations section of the online help. See Section B.7 “Target Board Considerations”. MPLAB® ICD 3 IN-CIRCUIT DEBUGGER USER’S GUIDE  2011 Microchip Technology Inc. MPLAB X Beta 7.10 DS51766B1-page 41 Chapter 7. Engineering Technical Notes (ETNs) The following ETNs are related to the MPLAB ICD 3 In-Circuit Debugger. Please see the product web page for details. • ETN-29: Applies to Assembly #10-00421-RC or below. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 42  2012-2014 Microchip Technology Inc. Part 4 – Reference Appendix A. Debugger Function Summary............................................................... 43 Appendix B. Hardware Specification.......................................................................... 47 Appendix C. Revision History..................................................................................... 53 MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 43 Appendix A. Debugger Function Summary A.1 INTRODUCTION A summary of the MPLAB ICD 3 In-Circuit Debugger functions is listed here. • Debugger Selection and Switching • Debugger Options Selection A.2 DEBUGGER SELECTION AND SWITCHING Use the Project Properties dialog to select or switch debuggers for a project. To switch you must have more than one MPLAB ICD 3 connected to your computer. MPLAB X IDE will differentiate between the two by displaying two different serial numbers. To select or change the debugger used for a project: 1. Open the Project Properties dialog by doing one of the following: a) Click on the project name in the Project window and select File>Project Properties. b) Right click on the project name in the Project window and select “Properties”. 2. Under “Categories”, click on “[[default]]” 3. Under “Hardware Tools”, find “ICD 3” and click on a serial number (SN) to select a debugger for use in the project. A.3 DEBUGGER OPTIONS SELECTION Set up debugger options on the debugger property pages of the Project Properties dialog. 1. Open the Project Properties dialog by doing one of the following: a) Click on the project name in the Project window and select File>Project Properties. b) Right click on the project name in the Project window and select “Properties”. 2. Under “Categories”, click on “ICD 3” 3. Select property pages from “Options categories”. Click on an option to see its description in the text box below. Click to the right of an option to change it. Available option categories are: • Memories to Program • Firmware • Program Options • Debug Options • Freeze Peripherals • Clock • Power MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 44  2012-2014 Microchip Technology Inc. A.3.1 Memories to Program Select the memories to be programmed into the target. A.3.2 Firmware Select and load debugger firmware. A.3.3 Program Options Choose to erase all memory before programming or to merge code. TABLE A-1: MEMORIES TO PROGRAM OPTION CATEGORY Auto select memories and ranges Allow ICD 3 to Select Memories - The debugger uses your selected device and default settings to determine what to program. Manually select memories and ranges - You select the type and range of memory to program (see below.) Memory Check to program Memory, where Memory is the type of memory. Types include: EEPROM, ID, Boot Flash, Auxiliary. Program Memory Check to program the target program memory range specified below. Program Memory Start (hex) Program Memory End (hex) The starting and ending hex address range in program memory for programming, reading, or verification. If you receive a programming error due to an incorrect end address, correct the end address and program again. Note: The address range does not apply to the Erase function. The Erase function will erase all data on the device. Preserve Program Memory Check to not program the target program memory range specified below. Preserve Program Memory Start (hex) Preserve Program Memory End (hex) The starting and ending hex address range in target program memory to preserve when programming, reading, or verifying. This memory is read from the target and overlayed with existing MPLAB X IDE memory. Preserve Memory Check to not erase Memory when programming, where Memory is the type of memory. Types include: EEPROM, ID, Boot Flash, Auxiliary. TABLE A-2: FIRMWARE OPTION CATEGORY Use Latest Firmware Check to use the latest firmware. Uncheck to select the firmware version below. Firmware File Click in the right-hand text box to search for a firmware file (.jam) to associate with the debugger. TABLE A-3: PROGRAM OPTIONS OPTION CATEGORY Erase All Before Program Check to erase all memory before programming begins. Unless programming new or already erased devices, it is important to have this box checked. If not checked, the device is not erased and program code will be merged with the code already in the device. Enable Low-Voltage Programming For Programmer Settings only, PIC12F/16F1xxx devices: For the LVP configuration bit set to “Low-voltage programming enabled”, you may program in either high-voltage (default) or low-voltage (enabled here.) For the LVP configuration bit set to “High-voltage on MCLR/Vpp must be used for programming”, you may only program in high-voltage. Debugger Function Summary  2012-2014 Microchip Technology Inc. DS50002081B-page 45 A.3.4 Debug Options Use software breakpoints, if available for the project device. A.3.5 Freeze Peripherals Select peripherals to freeze or not freeze on program halt. PIC12/16/18 MCU Devices To freeze/unfreeze all device peripherals on halt, check/uncheck the “Freeze on Halt” checkbox. If this does not halt your desired peripheral, be aware that some peripherals have no freeze on halt capability and cannot be controlled by the debugger. dsPIC30F/33F, PIC24F/H and PIC32MX Devices For peripherals in the list “Peripherals to Freeze on Halt”, check to freeze that peripheral on a halt. Uncheck the peripheral to let it run while the program is halted. If you do not see a peripheral on the list, check “All Other Peripherals”. If this does not halt your desired peripheral, be aware that some peripherals have no freeze on halt capability and cannot be controlled by the debugger. To select all peripherals, including “All Other Peripherals”, click Check All. To deselect all peripherals, including “All Other Peripherals”, click Uncheck All. A.3.6 Clock Set the option to use the fast internal RC clock for selected device. TABLE A-4: DEBUG OPTIONS OPTION CATEGORY Use Software Breakpoints Check to use software breakpoints. Uncheck to use hardware breakpoints. See discussion below to determine which type is best for your application. TABLE A-5: SOFTWARE VS HARDWARE BREAKPOINTS Features Software Breakpoints Hardware Breakpoints Number of breakpoints unlimited limited Breakpoints are written to program memory debug registers Time to set breakpoints oscillator speed dependent – can take minutes minimal Skidding no yes Note: Using software breakpoints for debugging impacts device endurance. Therefore, it is recommended that devices used in this manner not be used as production parts. TABLE A-6: FREEZE PERIPHERALS OPTION CATEGORY Freeze Peripherals Freeze all peripherals on halt. This options applies to PIC12/16/18 MCUs. Peripheral Freeze this peripheral on halt. This options applies to 16- and 32-bit MCUs. TABLE A-7: CLOCK OPTION CATEGORY Use FRC in debug mode (dsPIC33F and PIC24F/H devices only) When debugging, use the device fast internal RC (FRC) for clocking instead of the oscillator specified for the application. This is useful when the application clock is slow. Checking this checkbox will let the application run at the slow speed but debug at the faster FRC speed. Reprogram after changing this setting. Note: Peripherals that are not frozen will operate at the FRC speed while debugging. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 46  2012-2014 Microchip Technology Inc. A.3.7 Power Select power options. TABLE A-8: POWER OPTION CATEGORY Power target circuit from ICD 3 If you enable (check) this option, the Power On/Off button will be enabled on the toolbar. It will initially be in the Power On state. Every time it is clicked it will toggle to the opposite state. If it is on it will toggle to off, and if it is off it will toggle to on. If the power target circuit setting is disabled (unchecked) the Power On/Off button will go back to the disabled state. Whatever state it is in when the project was last saved will be the state that it is in when the project is reopened. Voltage Level If the checkbox above is checked, select the target Vdd (3.0V-3.5V) that the debugger will provide. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 47 Appendix B. Hardware Specification B.1 INTRODUCTION The hardware and electrical specifications of the MPLAB ICD 3 In-Circuit Debugger system are detailed. B.2 HIGHLIGHTS This chapter discusses: • USB Port/Power • MPLAB ICD 3 In-Circuit Debugger • Standard Communication Hardware • ICD 3 Test Interface Board • Target Board Considerations B.3 USB PORT/POWER The MPLAB ICD 3 In-Circuit Debugger is connected to the host PC via a Universal Serial Bus (USB) port, version 2.0 compliant. The USB connector is located on the side of the pod. The system is capable of reloading the firmware via the USB interface. System power is derived from the USB interface. The debugger is classified as a high-power system per the USB specification, and requires 300 mA of power from the USB to function in all operational modes (debugger/programmer). Cable Length – The PC-to-debugger cable length for proper operation is shipped in the debugger kit. Powered Hubs – If you are going to use a USB hub, make sure it is self-powered. Also, USB ports on PC keyboards do not have enough power for the debugger to operate. PC Hibernate/Power-Down Modes – Disable the hibernate or other power saver modes on your PC to ensure proper USB communications with the debugger. Note: The MPLAB ICD 3 In-Circuit Debugger is powered through its USB connection. The target board is powered from its own supply. Alternatively, the MPLAB ICD 3 can power it only if the target consumes less than 100 mA. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 48  2012-2014 Microchip Technology Inc. B.4 MPLAB ICD 3 IN-CIRCUIT DEBUGGER The debugger consists of a main board enclosed in the casing with a USB connector and an RJ-11 connector. On the debugger enclosure are indicator lights (LEDs). B.4.1 Main Board This component has the interface processor (dsPIC DSC), the USB 2.0 interface capable of USB speeds of 480 Mbps, a Field Programmable Gate Array (FPGA) for general system control and increased communication throughput, an SRAM for holding the program code image for programming into the emulation device on-board Flash and LED indicators. B.4.2 Indicator Lights (LEDs) The indicator lights have the following significance. LED Color Description Power Green Lit when powered. Active Blue Lit when power is first applied or when target is connected. Status Green Lit when the debugger is operating normally – standby. Red Lit when an operation has failed. Orange Lit when the debugger is busy. Hardware Specification  2012-2014 Microchip Technology Inc. DS50002081B-page 49 B.5 STANDARD COMMUNICATION HARDWARE For standard debugger communication with a target (Section 2.3 “Debugger to Target Communication”), use an adapter with the RJ-11 connector. To use this type of communication with a header board, you may need a device-specific Processor Pak, which includes an 8-pin connector header board containing the desired ICE/ICD device and a standard adapter board. For more on available header boards, see the “Processor Extension Pak and Header Specification” (DS51292). B.5.1 Standard Communication The standard communication is the main interface to the target processor. It contains the connections to the high voltage (VPP), VDD sense lines, and clock and data connections required for programming and connecting with the target devices. The VPP high-voltage lines can produce a variable voltage that can swing from 0 to 14 volts to satisfy the voltage requirements for the specific emulation processor. The VDD sense connection draws very little current from the target processor. The actual power comes from the MPLAB ICD 3 In-Circuit Debugger system as the VDD sense line is used as a reference only to track the target voltage. The VDD connection is isolated with an optical switch. The clock and data connections are interfaces with the following characteristics: • Clock and data signals are in high-impedance mode (even when no power is applied to the MPLAB ICD 3 In-Circuit Debugger system) • Clock and data signals are protected from high voltages caused by faulty targets systems, or improper connections • Clock and data signals are protected from high current caused from electrical shorts in faulty target systems FIGURE B-1: 6-PIN STANDARD PINOUT Note: Older header boards used a 6-pin (RJ-11) connector instead of an 8-pin connector, so these headers may be connected directly to the debugger. TABLE B-1: ELECTRICAL LOGIC TABLE(1) Logic Inputs Vih = Vdd x 0.7V (min.) Vil = Vdd x 0.3V (max.) Logic Outputs Vdd = 5V Vdd = 3V Vdd = 2.3V Vdd = 1.65V Voh = 3.8V min. Voh = 2.4V min. Voh = 1.9V min. Voh = 1.2V min. Vol = 0.55V max. Vol = 0.55V max. Vol = 0.3V max. Vol = 0.45V max. Note 1: Loading PGC/PGD - 4.7K ohm load to ground. 1 2 3 4 5 6 Pin Name Function 1 VPP Power 2 VDD_TGT Power on target 3 GND Ground 4 PGD (ICSPDAT) Standard Com Data 5 PGC (ICSPCLK) Standard Com Clock 6 PGM (LVP) Low-Voltage Programming Bottom of Standard Socket Target Board MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 50  2012-2014 Microchip Technology Inc. B.5.2 Modular Cable and Connector For standard communications, a modular cable connects the debugger and the target application. The specifications for this cable and its connectors are listed below. B.5.2.1 MODULAR CONNECTOR SPECIFICATION • Manufacturer, Part Number – AMP Incorporated, 555165-1 • Distributor, Part Number – Digi-Key, A9031ND The following table shows how the modular connector pins on an application correspond to the microcontroller pins. This configuration provides full ICD functionality. FIGURE B-2: MODULAR CONNECTOR PINOUT OF TARGET BOARD B.5.2.2 MODULAR PLUG SPECIFICATION • Manufacturer, Part Number – AMP Incorporated, 5-554710-3 • Distributor, Part Number – Digi-Key, A9117ND B.5.2.3 MODULAR CABLE SPECIFICATION Manufacturer, Part Number – Microchip Technology, 07-00024 FIGURE B-3: MODULAR CABLE Modular Connector Pin Microcontroller Pin 6 PGM (LVP) 5 RB6 4 RB7 3 Ground 2 VDD Target 1 VPP 1 6 Bottom View of Modular Connector Pinout on Target Board 1 6 Front View of Modular Connector on Target Board Pin 1 8.00‚ Pin 6 Hardware Specification  2012-2014 Microchip Technology Inc. DS50002081B-page 51 B.6 ICD 3 TEST INTERFACE BOARD This board can be used to verify that the debugger is functioning properly. To use this board: 1. Disconnect the debugger from the target and the PC. 2. Connect the ICD 3 test interface board to the debugger using the modular cable. FIGURE B-4: MPLAB ICD 3 CONNECTION TO TEST INTERFACE BOARD 3. Reconnect the debugger to the PC. 4. Launch MPLAB X IDE. Ensure that all existing projects are closed. 5. Select Debug>Run Debugger/Programmer Self Test, then, select the specific “ICD 3” you want to test and click OK. 6. Ensure the ICD 3 Test Interface Board and cable are connected. Click Yes to continue. 7. View the self test results in the debugger’s Output window. If the test runs successfully, you’ll see the following: Test interface PGC clock line write succeeded. Test interface PGD data line write succeeded. Test interface PGC clock line read succeeded. Test interface PGD data line read succeeded. Test interface LVP control line test succeeded. Test interface MCLR level test succeeded. ICD3 is functioning properly. If you are still having problems with your target circuit please check the Target Board Considerations section of the online help. 8. After the debugger passes the self test, disconnect the ICD 3 Test Interface board from the debugger. If any test failed, please enter a ticket on http://support.microchip.com/. Copy and paste the content of the output window into the problem description. ICD 3 Test Interface Board USB/Power From PC Modular Cable MPLAB® ICD 3 MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 52  2012-2014 Microchip Technology Inc. B.7 TARGET BOARD CONSIDERATIONS The target board should be powered according to the requirements of the selected device (2.0V-5.5V) and the application. The debugger does sense target power. There is a 10K load on Vdd_TGT. Depending on the type of debugger-to-target communications used, there will be some considerations for target board circuitry: • Section 2.4.2 “Target Connection Circuitry” • Section 2.4.5 “Circuits That Will Prevent the Debugger From Functioning” MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE  2012-2014 Microchip Technology Inc. DS50002081B-page 53 Appendix C. Revision History Revision A (May 2012) Initial release of this document. Revision B (September 2014) • Reorganized Debugger Usage section. • Updated Recommended Reading section. • Modified Troubleshooting First Steps, FAQs, and Error Messages chapters. • Added Engineering Technical Notes chapter. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 54  2012-2014 Microchip Technology Inc. Support Please refer to the items discussed here for support issues. • Warranty Registration • The Microchip Web Site • myMicrochip Personalized Notification Service • Customer Support A.1 WARRANTY REGISTRATION If your development tool package includes a Warranty Registration Card, please complete the card and mail it in promptly. Sending in your Warranty Registration Card entitles you to receive new product updates. Interim software releases are available at the Microchip web site. A.2 THE MICROCHIP WEB SITE Microchip provides online support via our web site at http://www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives A.3 myMICROCHIP PERSONALIZED NOTIFICATION SERVICE Microchip's personal notification service helps keep customers current on their Microchip products of interest. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool. Please visit http://www.microchip.com/pcn to begin the registration process and select your preferences to receive personalized notifications. A FAQ and registration details are available on the page, which can be opened by selecting the link above. Support  2012-2014 Microchip Technology Inc. DS50002081B-page 55 When you are selecting your preferences, choosing “Development Systems” will populate the list with available development tools. The main categories of tools are listed below: • Compilers – The latest information on Microchip C compilers, assemblers, linkers and other language tools. These include all MPLAB C compilers; all MPLAB assemblers (including MPASM assembler); all MPLAB linkers (including MPLINK object linker); and all MPLAB librarians (including MPLIB object librarian). • Emulators – The latest information on Microchip in-circuit emulators.These include the MPLAB REAL ICE and MPLAB ICE 2000 in-circuit emulators • In-Circuit Debuggers – The latest information on Microchip in-circuit debuggers. These include the MPLAB ICD 2 and 3 in-circuit debuggers and PICkit 2 and 3 debug express. • MPLAB IDE – The latest information on Microchip MPLAB IDE, the Windows Integrated Development Environment for development systems tools. This list is focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and MPLAB SIM simulator, as well as general editing and debugging features. • Programmers – The latest information on Microchip programmers. These include the device (production) programmers MPLAB REAL ICE in-circuit emulator, MPLAB ICD 3 in-circuit debugger, MPLAB PM3, and PRO MATE II and development (nonproduction) programmers MPLAB ICD 2 in-circuit debugger, PICSTART Plus and PICkit 1, 2 and 3. • Starter/Demo Boards – These include MPLAB Starter Kit boards, PICDEM demo boards, and various other evaluation boards. A.4 CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. See our web site for a complete, up-to-date listing of sales offices. Technical support is available through the web site at http://support.microchip.com. Documentation errors or comments may be emailed to docerrors@microchip.com. MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 56  2012-2014 Microchip Technology Inc. Glossary A Absolute Section A GCC compiler section with a fixed (absolute) address that cannot be changed by the linker. Absolute Variable/Function A variable or function placed at an absolute address using the OCG compiler’s @ address syntax. Access Memory PIC18 Only – Special registers on PIC18 devices that allow access regardless of the setting of the Bank Select Register (BSR). Access Entry Points Access entry points provide a way to transfer control across segments to a function which may not be defined at link time. They support the separate linking of boot and secure application segments. Address Value that identifies a location in memory. Alphabetic Character Alphabetic characters are those characters that are letters of the Roman alphabet (a, b, …, z, A, B, …, Z). Alphanumeric Alphanumeric characters are comprised of alphabetic characters and decimal digits (0,1, …, 9). ANDed Breakpoints Set up an ANDed condition for breaking, i.e., breakpoint 1 AND breakpoint 2 must occur at the same time before a program halt. This can only be accomplished if a data breakpoint and a program memory breakpoint occur at the same time. Anonymous Structure 16-bit C Compiler – An unnamed structure. PIC18 C Compiler – An unnamed structure that is a member of a C union. The members of an anonymous structure may be accessed as if they were members of the enclosing union. For example, in the following code, hi and lo are members of an anonymous structure inside the union caster. union castaway int intval; struct { char lo; //accessible as caster.lo char hi; //accessible as caster.hi }; } caster; Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 57 ANSI American National Standards Institute is an organization responsible for formulating and approving standards in the United States. Application A set of software and hardware that may be controlled by a PIC® microcontroller. Archive/Archiver An archive/library is a collection of relocatable object modules. It is created by assembling multiple source files to object files, and then using the archiver/librarian to combine the object files into one archive/library file. An archive/library can be linked with object modules and other archives/libraries to create executable code. ASCII American Standard Code for Information Interchange is a character set encoding that uses 7 binary digits to represent each character. It includes upper and lower case letters, digits, symbols and control characters. Assembly/Assembler Assembly is a programming language that describes binary machine code in a symbolic form. An assembler is a language tool that translates assembly language source code into machine code. Assigned Section A GCC compiler section which has been assigned to a target memory block in the linker command file. Asynchronously Multiple events that do not occur at the same time. This is generally used to refer to interrupts that may occur at any time during processor execution. Asynchronous Stimulus Data generated to simulate external inputs to a simulator device. Attribute GCC Characteristics of variables or functions in a C program which are used to describe machine-specific properties. Attribute, Section GCC Characteristics of sections, such as “executable”, “readonly”, or “data” that can be specified as flags in the assembler .section directive. B Binary The base two numbering system that uses the digits 0-1. The rightmost digit counts ones, the next counts multiples of 2, then 22 = 4, etc. Bookmarks Use bookmarks to easily locate specific lines in a file. Select Toggle Bookmarks on the Editor toolbar to add/remove bookmarks. Click other icons on this toolbar to move to the next or previous bookmark. Breakpoint Hardware Breakpoint: An event whose execution will cause a halt. Software Breakpoint: An address where execution of the firmware will halt. Usually achieved by a special break instruction. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 58  2012-2014 Microchip Technology Inc. Build Compile and link all the source files for an application. C C\C++ C is a general-purpose programming language which features economy of expression, modern control flow and data structures, and a rich set of operators. C++ is the object-oriented version of C. Calibration Memory A special function register or registers used to hold values for calibration of a PIC microcontroller on-board RC oscillator or other device peripherals. Central Processing Unit The part of a device that is responsible for fetching the correct instruction for execution, decoding that instruction, and then executing that instruction. When necessary, it works in conjunction with the arithmetic logic unit (ALU) to complete the execution of the instruction. It controls the program memory address bus, the data memory address bus, and accesses to the stack. Clean Clean removes all intermediary project files, such as object, hex and debug files, for the active project. These files are recreated from other files when a project is built. COFF Common Object File Format. An object file of this format contains machine code, debugging and other information. Command Line Interface A means of communication between a program and its user based solely on textual input and output. Compiled Stack A region of memory managed by the compiler in which variables are statically allocated space. It replaces a software or hardware stack when such mechanisms cannot be efficiently implemented on the target device. Compiler A program that translates a source file written in a high-level language into machine code. Conditional Assembly Assembly language code that is included or omitted based on the assembly-time value of a specified expression. Conditional Compilation The act of compiling a program fragment only if a certain constant expression, specified by a preprocessor directive, is true. Configuration Bits Special-purpose bits programmed to set PIC MCU and dsPIC DSC modes of operation. A Configuration bit may or may not be preprogrammed. Control Directives Directives in assembly language code that cause code to be included or omitted based on the assembly-time value of a specified expression. CPU See Central Processing Unit. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 59 Cross Reference File A file that references a table of symbols and a list of files that references the symbol. If the symbol is defined, the first file listed is the location of the definition. The remaining files contain references to the symbol. D Data Directives Data directives are those that control the assembler’s allocation of program or data memory and provide a way to refer to data items symbolically; that is, by meaningful names. Data Memory On Microchip MCU and DSC devices, data memory (RAM) is comprised of General Purpose Registers (GPRs) and Special Function Registers (SFRs). Some devices also have EEPROM data memory. Data Monitor and Control Interface (DMCI) The Data Monitor and Control Interface, or DMCI, is a tool in MPLAB X IDE. The interface provides dynamic input control of application variables in projects. Application-generated data can be viewed graphically using any of 4 dynamically-assignable graph windows. Debug/Debugger See ICE/ICD. Debugging Information Compiler and assembler options that, when selected, provide varying degrees of information used to debug application code. See compiler or assembler documentation for details on selecting debug options. Deprecated Features Features that are still supported for legacy reasons, but will eventually be phased out and no longer used. Device Programmer A tool used to program electrically programmable semiconductor devices such as microcontrollers. Digital Signal Controller A digital signal controller (DSC) is a microcontroller device with digital signal processing capability, i.e., Microchip dsPIC DSC devices. Digital Signal Processing\Digital Signal Processor Digital signal processing (DSP) is the computer manipulation of digital signals, commonly analog signals (sound or image) which have been converted to digital form (sampled). A digital signal processor is a microprocessor that is designed for use in digital signal processing. Directives Statements in source code that provide control of the language tool’s operation. Download Download is the process of sending data from a host to another device, such as an emulator, programmer or target board. DWARF Debug With Arbitrary Record Format. DWARF is a debug information format for ELF files. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 60  2012-2014 Microchip Technology Inc. E EEPROM Electrically Erasable Programmable Read Only Memory. A special type of PROM that can be erased electrically. Data is written or erased one byte at a time. EEPROM retains its contents even when power is turned off. ELF Executable and Linking Format. An object file of this format contains machine code. Debugging and other information is specified in with DWARF. ELF/DWARF provide better debugging of optimized code than COFF. Emulation/Emulator See ICE/ICD. Endianness The ordering of bytes in a multi-byte object. Environment MPLAB PM3 – A folder containing files on how to program a device. This folder can be transferred to a SD/MMC card. Epilogue A portion of compiler-generated code that is responsible for deallocating stack space, restoring registers and performing any other machine-specific requirement specified in the runtime model. This code executes after any user code for a given function, immediately prior to the function return. EPROM Erasable Programmable Read Only Memory. A programmable read-only memory that can be erased usually by exposure to ultraviolet radiation. Error/Error File An error reports a problem that makes it impossible to continue processing your program. When possible, an error identifies the source file name and line number where the problem is apparent. An error file contains error messages and diagnostics generated by a language tool. Event A description of a bus cycle which may include address, data, pass count, external input, cycle type (fetch, R/W), and time stamp. Events are used to describe triggers, breakpoints and interrupts. Executable Code Software that is ready to be loaded for execution. Export Send data out of the MPLAB IDE/MPLAB X IDE in a standardized format. Expressions Combinations of constants and/or symbols separated by arithmetic or logical operators. Extended Microcontroller Mode In extended microcontroller mode, on-chip program memory as well as external memory is available. Execution automatically switches to external if the program memory address is greater than the internal memory space of the PIC18 device. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 61 Extended Mode (PIC18 MCUs) In Extended mode, the compiler will utilize the extended instructions (i.e., ADDFSR, ADDULNK, CALLW, MOVSF, MOVSS, PUSHL, SUBFSR and SUBULNK) and the indexed with literal offset addressing. External Label A label that has external linkage. External Linkage A function or variable has external linkage if it can be referenced from outside the module in which it is defined. External Symbol A symbol for an identifier which has external linkage. This may be a reference or a definition. External Symbol Resolution A process performed by the linker in which external symbol definitions from all input modules are collected in an attempt to resolve all external symbol references. Any external symbol references which do not have a corresponding definition cause a linker error to be reported. External Input Line An external input signal logic probe line (TRIGIN) for setting an event based upon external signals. External RAM Off-chip Read/Write memory. F Fatal Error An error that will halt compilation immediately. No further messages will be produced. File Registers On-chip data memory, including General Purpose Registers (GPRs) and Special Function Registers (SFRs). Filter Determine by selection what data is included/excluded in a trace display or data file. Fixup The process of replacing object file symbolic references with absolute addresses after relocation by the linker. Flash A type of EEPROM where data is written or erased in blocks instead of bytes. FNOP Forced No Operation. A forced NOP cycle is the second cycle of a two-cycle instruction. Since the PIC microcontroller architecture is pipelined, it prefetches the next instruction in the physical address space while it is executing the current instruction. However, if the current instruction changes the program counter, this prefetched instruction is explicitly ignored, causing a forced NOP cycle. Frame Pointer A pointer that references the location on the stack that separates the stack-based arguments from the stack-based local variables. Provides a convenient base from which to access local variables and other values for the current function. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 62  2012-2014 Microchip Technology Inc. Free-Standing An implementation that accepts any strictly conforming program that does not use complex types and in which the use of the features specified in the library clause (ANSI ‘89 standard clause 7) is confined to the contents of the standard headers , , , , , and . G GPR General Purpose Register. The portion of device data memory (RAM) available for general use. H Halt A stop of program execution. Executing Halt is the same as stopping at a breakpoint. Heap An area of memory used for dynamic memory allocation where blocks of memory are allocated and freed in an arbitrary order determined at runtime. Hex Code\Hex File Hex code is executable instructions stored in a hexadecimal format code. Hex code is contained in a hex file. Hexadecimal The base 16 numbering system that uses the digits 0-9 plus the letters A-F (or a-f). The digits A-F represent hexadecimal digits with values of (decimal) 10 to 15. The rightmost digit counts ones, the next counts multiples of 16, then 162 = 256, etc. High Level Language A language for writing programs that is further removed from the processor than assembly. I ICE/ICD In-Circuit Emulator/In-Circuit Debugger: A hardware tool that debugs and programs a target device. An emulator has more features than an debugger, such as trace. In-Circuit Emulation/In-Circuit Debug: The act of emulating or debugging with an in-circuit emulator or debugger. -ICE/-ICD: A device (MCU or DSC) with on-board in-circuit emulation or debug circuitry. This device is always mounted on a header board and used to debug with an in-circuit emulator or debugger. ICSP In-Circuit Serial Programming. A method of programming Microchip embedded devices using serial communication and a minimum number of device pins. IDE Integrated Development Environment, as in MPLAB IDE/MPLAB X IDE. Identifier A function or variable name. IEEE Institute of Electrical and Electronics Engineers. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 63 Import Bring data into the MPLAB IDE/MPLAB X IDE from an outside source, such as from a hex file. Initialized Data Data which is defined with an initial value. In C, int myVar=5; defines a variable which will reside in an initialized data section. Instruction Set The collection of machine language instructions that a particular processor understands. Instructions A sequence of bits that tells a central processing unit to perform a particular operation and can contain data to be used in the operation. Internal Linkage A function or variable has internal linkage if it can not be accessed from outside the module in which it is defined. International Organization for Standardization An organization that sets standards in many businesses and technologies, including computing and communications. Also known as ISO. Interrupt A signal to the CPU that suspends the execution of a running application and transfers control to an Interrupt Service Routine (ISR) so that the event may be processed. Upon completion of the ISR, normal execution of the application resumes. Interrupt Handler A routine that processes special code when an interrupt occurs. Interrupt Service Request (IRQ) An event which causes the processor to temporarily suspend normal instruction execution and to start executing an interrupt handler routine. Some processors have several interrupt request events allowing different priority interrupts. Interrupt Service Routine (ISR) Language tools – A function that handles an interrupt. MPLAB IDE/MPLAB X IDE – User-generated code that is entered when an interrupt occurs. The location of the code in program memory will usually depend on the type of interrupt that has occurred. Interrupt Vector Address of an interrupt service routine or interrupt handler. L L-value An expression that refers to an object that can be examined and/or modified. An l-value expression is used on the left-hand side of an assignment. Latency The time between an event and its response. Library/Librarian See Archive/Archiver. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 64  2012-2014 Microchip Technology Inc. Linker A language tool that combines object files and libraries to create executable code, resolving references from one module to another. Linker Script Files Linker script files are the command files of a linker. They define linker options and describe available memory on the target platform. Listing Directives Listing directives are those directives that control the assembler listing file format. They allow the specification of titles, pagination and other listing control. Listing File A listing file is an ASCII text file that shows the machine code generated for each C source statement, assembly instruction, assembler directive, or macro encountered in a source file. Little Endian A data ordering scheme for multibyte data whereby the least significant byte is stored at the lower addresses. Local Label A local label is one that is defined inside a macro with the LOCAL directive. These labels are particular to a given instance of a macro’s instantiation. In other words, the symbols and labels that are declared as local are no longer accessible after the ENDM macro is encountered. Logic Probes Up to 14 logic probes can be connected to some Microchip emulators. The logic probes provide external trace inputs, trigger output signal, +5V, and a common ground. Loop-Back Test Board Used to test the functionality of the MPLAB REAL ICE in-circuit emulator. LVDS Low-Voltage Differential Signaling. A low noise, low-power, low amplitude method for high-speed (gigabits per second) data transmission over copper wire. With standard I/O signaling, data storage is contingent upon the actual voltage level. Voltage level can be affected by wire length (longer wires increase resistance, which lowers voltage). But with LVDS, data storage is distinguished only by positive and negative voltage values, not the voltage level. Therefore, data can travel over greater lengths of wire while maintaining a clear and consistent data stream. Source: http://www.webopedia.com/TERM/L/LVDS.html M Machine Code The representation of a computer program that is actually read and interpreted by the processor. A program in binary machine code consists of a sequence of machine instructions (possibly interspersed with data). The collection of all possible instructions for a particular processor is known as its “instruction set”. Machine Language A set of instructions for a specific central processing unit, designed to be usable by a processor without being translated. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 65 Macro Macro instruction. An instruction that represents a sequence of instructions in abbreviated form. Macro Directives Directives that control the execution and data allocation within macro body definitions. Makefile Export to a file the instructions to Make the project. Use this file to Make your project outside of MPLAB IDE/MPLAB X IDE, i.e., with a make. Make Project A command that rebuilds an application, recompiling only those source files that have changed since the last complete compilation. MCU Microcontroller Unit. An abbreviation for microcontroller. Also uC. Memory Model For C compilers, a representation of the memory available to the application. For the PIC18 C compiler, a description that specifies the size of pointers that point to program memory. Message Text displayed to alert you to potential problems in language tool operation. A message will not stop operation. Microcontroller A highly integrated chip that contains a CPU, RAM, program memory, I/O ports and timers. Microcontroller Mode One of the possible program memory configurations of PIC18 microcontrollers. In microcontroller mode, only internal execution is allowed. Thus, only the on-chip program memory is available in microcontroller mode. Microprocessor Mode One of the possible program memory configurations of PIC18 microcontrollers. In microprocessor mode, the on-chip program memory is not used. The entire program memory is mapped externally. Mnemonics Text instructions that can be translated directly into machine code. Also referred to as opcodes. Module The preprocessed output of a source file after preprocessor directives have been executed. Also known as a translation unit. MPASM™ Assembler Microchip Technology’s relocatable macro assembler for PIC microcontroller devices, KeeLoq® devices and Microchip memory devices. MPLAB Language Tool for Device Microchip’s C compilers, assemblers and linkers for specified devices. Select the type of language tool based on the device you will be using for your application, e.g., if you will be creating C code on a PIC18 MCU, select the MPLAB C Compiler for PIC18 MCUs. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 66  2012-2014 Microchip Technology Inc. MPLAB ICD Microchip in-circuit debugger that works with MPLAB IDE/MPLAB X IDE. See ICE/ICD. MPLAB IDE/MPLAB X IDE Microchip’s Integrated Development Environment. MPLAB IDE/MPLAB X IDE comes with an editor, project manager and simulator. MPLAB PM3 A device programmer from Microchip. Programs PIC18 microcontrollers and dsPIC digital signal controllers. Can be used with MPLAB IDE/MPLAB X IDE or stand-alone. Replaces PRO MATE II. MPLAB REAL ICE™ In-Circuit Emulator Microchip’s next-generation in-circuit emulator that works with MPLAB IDE/MPLAB X IDE. See ICE/ICD. MPLAB SIM Microchip’s simulator that works with MPLAB IDE/MPLAB X IDE in support of PIC MCU and dsPIC DSC devices. MPLIB™ Object Librarian Microchip’s librarian that can work with MPLAB IDE/MPLAB X IDE. MPLIB librarian is an object librarian for use with COFF object modules created using either MPASM assembler (mpasm or mpasmwin v2.0) or MPLAB C18 C Compiler. MPLINK™ Object Linker MPLINK linker is an object linker for the Microchip MPASM assembler and the Microchip C18 C compiler. MPLINK linker also may be used with the Microchip MPLIB librarian. MPLINK linker is designed to be used with MPLAB IDE/MPLAB X IDE, though it does not have to be. MRU Most Recently Used. Refers to files and windows available to be selected from MPLAB IDE/MPLAB X IDE main pull down menus. N Native Data Size For Native trace, the size of the variable used in a Watches window must be of the same size as the selected device’s data memory: bytes for PIC18 devices and words for 16-bit devices. Nesting Depth The maximum level to which macros can include other macros. Node MPLAB IDE/MPLAB X IDE project component. Non-Extended Mode (PIC18 MCUs) In Non-Extended mode, the compiler will not utilize the extended instructions nor the indexed with literal offset addressing. Non Real Time Refers to the processor at a breakpoint or executing single-step instructions or MPLAB IDE/MPLAB X IDE being run in simulator mode. Non-Volatile Storage A storage device whose contents are preserved when its power is off. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 67 NOP No Operation. An instruction that has no effect when executed except to advance the program counter. O Object Code/Object File Object code is the machine code generated by an assembler or compiler. An object file is a file containing machine code and possibly debug information. It may be immediately executable or it may be relocatable, requiring linking with other object files, e.g., libraries, to produce a complete executable program. Object File Directives Directives that are used only when creating an object file. Octal The base 8 number system that only uses the digits 0-7. The rightmost digit counts ones, the next digit counts multiples of 8, then 82 = 64, etc. Off-Chip Memory Off-chip memory refers to the memory selection option for the PIC18 device where memory may reside on the target board, or where all program memory may be supplied by the emulator. The Memory tab accessed from Options>Development Mode provides the Off-Chip Memory selection dialog box. Opcodes Operational Codes. See Mnemonics. Operators Symbols, like the plus sign ‘+’ and the minus sign ‘-’, that are used when forming well-defined expressions. Each operator has an assigned precedence that is used to determine order of evaluation. OTP One-Time-Programmable. EPROM devices that are not in windowed packages. Since EPROM needs ultraviolet light to erase its memory, only windowed devices are erasable. P Pass Counter A counter that decrements each time an event (such as the execution of an instruction at a particular address) occurs. When the pass count value reaches zero, the event is satisfied. You can assign the Pass Counter to break and trace logic, and to any sequential event in the complex trigger dialog. PC Personal Computer or Program Counter. PC Host Any PC running a supported Windows operating system. Persistent Data Data that is never cleared or initialized. Its intended use is so that an application can preserve data across a device Reset. Phantom Byte An unimplemented byte in the dsPIC architecture that is used when treating the 24-bit instruction word as if it were a 32-bit instruction word. Phantom bytes appear in dsPIC hex files. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 68  2012-2014 Microchip Technology Inc. PIC MCUs PIC microcontrollers (MCUs) refers to all Microchip microcontroller families. PICkit 2 and 3 Microchip’s developmental device programmers with debug capability through Debug Express. See the Readme files for each tool to see which devices are supported. Plug-ins The MPLAB IDE/MPLAB X IDE has both built-in components and plug-in modules to configure the system for a variety of software and hardware tools. Several plug-in tools may be found under the Tools menu. Pod The enclosure for an in-circuit emulator or debugger. Other names are “Puck”, if the enclosure is round, and “Probe”, not be confused with logic probes. Power-on-Reset Emulation A software randomization process that writes random values in data RAM areas to simulate uninitialized values in RAM upon initial power application. Pragma A directive that has meaning to a specific compiler. Often a pragma is used to convey implementation-defined information to the compiler. Precedence Rules that define the order of evaluation in expressions. Production Programmer A production programmer is a programming tool that has resources designed in to program devices rapidly. It has the capability to program at various voltage levels and completely adheres to the programming specification. Programming a device as fast as possible is of prime importance in a production environment where time is of the essence as the application circuit moves through the assembly line. Profile For MPLAB SIM simulator, a summary listing of executed stimulus by register. Program Counter The location that contains the address of the instruction that is currently executing. Program Counter Unit 16-bit assembler – A conceptual representation of the layout of program memory. The program counter increments by two for each instruction word. In an executable section, two program counter units are equivalent to three bytes. In a read-only section, two program counter units are equivalent to two bytes. Program Memory MPLAB IDE/MPLAB X IDE – The memory area in a device where instructions are stored. Also, the memory in the emulator or simulator containing the downloaded target application firmware. 16-bit assembler/compiler – The memory area in a device where instructions are stored. Project A project contains the files needed to build an application (source code, linker script files, etc.) along with their associations to various build tools and build options. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 69 Prologue A portion of compiler-generated code that is responsible for allocating stack space, preserving registers and performing any other machine-specific requirement specified in the runtime model. This code executes before any user code for a given function. Prototype System A term referring to a user's target application, or target board. Psect The OCG equivalent of a GCC section, short for program section. A block of code or data which is treated as a whole by the linker. PWM Signals Pulse-Width Modulation Signals. Certain PIC MCU devices have a PWM peripheral. Q Qualifier An address or an address range used by the Pass Counter or as an event before another operation in a complex trigger. R Radix The number base, hex, or decimal, used in specifying an address. RAM Random Access Memory (Data Memory). Memory in which information can be accessed in any order. Raw Data The binary representation of code or data associated with a section. Read Only Memory Memory hardware that allows fast access to permanently stored data but prevents addition to or modification of the data. Real Time When an in-circuit emulator or debugger is released from the halt state, the processor runs in Real Time mode and behaves exactly as the normal chip would behave. In Real Time mode, the real time trace buffer of an emulator is enabled and constantly captures all selected cycles, and all break logic is enabled. In an in-circuit emulator or debugger, the processor executes in real time until a valid breakpoint causes a halt, or until the user halts the execution. In the simulator, real time simply means execution of the microcontroller instructions as fast as they can be simulated by the host CPU. Recursive Calls A function that calls itself, either directly or indirectly. Recursion The concept that a function or macro, having been defined, can call itself. Great care should be taken when writing recursive macros; it is easy to get caught in an infinite loop where there will be no exit from the recursion. Reentrant A function that may have multiple, simultaneously active instances. This may happen due to either direct or indirect recursion or through execution during interrupt processing. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 70  2012-2014 Microchip Technology Inc. Relaxation The process of converting an instruction to an identical, but smaller instruction. This is useful for saving on code size. MPLAB XC16 currently knows how to relax a CALL instruction into an RCALL instruction. This is done when the symbol that is being called is within +/- 32k instruction words from the current instruction. Relocatable An object whose address has not been assigned to a fixed location in memory. Relocatable Section 16-bit assembler – A section whose address is not fixed (absolute). The linker assigns addresses to relocatable sections through a process called relocation. Relocation A process performed by the linker in which absolute addresses are assigned to relocatable sections and all symbols in the relocatable sections are updated to their new addresses. ROM Read-Only Memory (Program Memory). Memory that cannot be modified. Run The command that releases the emulator from halt, allowing it to run the application code and change or respond to I/O in real time. Run-time Model Describes the use of target architecture resources. Runtime Watch A Watch window where the variables change in as the application is run. See individual tool documentation to determine how to set up a runtime watch. Not all tools support runtime watches. S Scenario For MPLAB SIM simulator, a particular setup for stimulus control. Section The GCC equivalent of an OCG psect. A block of code or data which is treated as a whole by the linker. Section Attribute A GCC characteristic ascribed to a section (e.g., an access section). Sequenced Breakpoints Breakpoints that occur in a sequence. Sequence execution of breakpoints is bottom-up; the last breakpoint in the sequence occurs first. Serialized Quick Turn Programming Serialization allows you to program a serial number into each microcontroller device that the Device Programmer programs. This number can be used as an entry code, password or ID number. Shell The MPASM assembler shell is a prompted input interface to the macro assembler. There are two MPASM assembler shells: one for the DOS version and one for the Windows operating system version. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 71 Simulator A software program that models the operation of devices. Single Step This command steps though code, one instruction at a time. After each instruction, MPLAB IDE/MPLAB X IDE updates register windows, watch variables, and status displays so you can analyze and debug instruction execution. You can also single step C compiler source code, but instead of executing single instructions, MPLAB IDE/MPLAB X IDE will execute all assembly level instructions generated by the line of the high level C statement. Skew The information associated with the execution of an instruction appears on the processor bus at different times. For example, the executed opcodes appears on the bus as a fetch during the execution of the previous instruction, the source data address and value and the destination data address appear when the opcodes is actually executed, and the destination data value appears when the next instruction is executed. The trace buffer captures the information that is on the bus at one instance. Therefore, one trace buffer entry will contain execution information for three instructions. The number of captured cycles from one piece of information to another for a single instruction execution is referred to as the skew. Skid When a hardware breakpoint is used to halt the processor, one or more additional instructions may be executed before the processor halts. The number of extra instructions executed after the intended breakpoint is referred to as the skid. Source Code The form in which a computer program is written by the programmer. Source code is written in a formal programming language which can be translated into machine code or executed by an interpreter. Source File An ASCII text file containing source code. Special Function Registers (SFRs) The portion of data memory (RAM) dedicated to registers that control I/O processor functions, I/O status, timers or other modes or peripherals. SQTP See Serialized Quick Turn Programming. Stack, Hardware Locations in PIC microcontroller where the return address is stored when a function call is made. Stack, Software Memory used by an application for storing return addresses, function parameters, and local variables. This memory is dynamically allocated at runtime by instructions in the program. It allows for reentrant function calls. Stack, Compiled A region of memory managed and allocated by the compiler in which variables are statically assigned space. It replaces a software stack when such mechanisms cannot be efficiently implemented on the target device. It precludes reentrancy. MPLAB Starter Kit for Device Microchip’s starter kits contains everything needed to begin exploring the specified device. View a working application and then debug and program you own changes. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 72  2012-2014 Microchip Technology Inc. Static RAM or SRAM Static Random Access Memory. Program memory you can read/write on the target board that does not need refreshing frequently. Status Bar The Status Bar is located on the bottom of the MPLAB IDE/MPLAB X IDE window and indicates such current information as cursor position, development mode and device, and active tool bar. Step Into This command is the same as Single Step. Step Into (as opposed to Step Over) follows a CALL instruction into a subroutine. Step Over Step Over allows you to debug code without stepping into subroutines. When stepping over a CALL instruction, the next breakpoint will be set at the instruction after the CALL. If for some reason the subroutine gets into an endless loop or does not return properly, the next breakpoint will never be reached. The Step Over command is the same as Single Step except for its handling of CALL instructions. Step Out Step Out allows you to step out of a subroutine which you are currently stepping through. This command executes the rest of the code in the subroutine and then stops execution at the return address to the subroutine. Stimulus Input to the simulator, i.e., data generated to exercise the response of simulation to external signals. Often the data is put into the form of a list of actions in a text file. Stimulus may be asynchronous, synchronous (pin), clocked and register. Stopwatch A counter for measuring execution cycles. Storage Class Determines the lifetime of the memory associated with the identified object. Storage Qualifier Indicates special properties of the objects being declared (e.g., const). Symbol A symbol is a general purpose mechanism for describing the various pieces which comprise a program. These pieces include function names, variable names, section names, file names, struct/enum/union tag names, etc. Symbols in MPLAB IDE/MPLAB X IDE refer mainly to variable names, function names and assembly labels. The value of a symbol after linking is its value in memory. Symbol, Absolute Represents an immediate value such as a definition through the assembly .equ directive. System Window Control The system window control is located in the upper left corner of windows and some dialogs. Clicking on this control usually pops up a menu that has the items “Minimize,” “Maximize,” and “Close.” Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 73 T Target Refers to user hardware. Target Application Software residing on the target board. Target Board The circuitry and programmable device that makes up the target application. Target Processor The microcontroller device on the target application board. Template Lines of text that you build for inserting into your files at a later time. The MPLAB Editor stores templates in template files. Tool Bar A row or column of icons that you can click on to execute MPLAB IDE/MPLAB X IDE functions. Trace An emulator or simulator function that logs program execution. The emulator logs program execution into its trace buffer which is uploaded to the MPLAB IDE/MPLAB X IDE trace window. Trace Memory Trace memory contained within the emulator. Trace memory is sometimes called the trace buffer. Trace Macro A macro that will provide trace information from emulator data. Since this is a software trace, the macro must be added to code, the code must be recompiled or reassembled, and the target device must be programmed with this code before trace will work. Trigger Output Trigger output refers to an emulator output signal that can be generated at any address or address range, and is independent of the trace and breakpoint settings. Any number of trigger output points can be set. Trigraphs Three-character sequences, all starting with ??, that are defined by ISO C as replacements for single characters. U Unassigned Section A section which has not been assigned to a specific target memory block in the linker command file. The linker must find a target memory block in which to allocate an unassigned section. Uninitialized Data Data which is defined without an initial value. In C, int myVar; defines a variable which will reside in an uninitialized data section. Upload The Upload function transfers data from a tool, such as an emulator or programmer, to the host PC or from the target board to the emulator. MPLAB® ICD 3 User’s Guide for MPLAB X IDE DS50002081B-page 74  2012-2014 Microchip Technology Inc. USB Universal Serial Bus. An external peripheral interface standard for communication between a computer and external peripherals over a cable using bi-serial transmission. USB 1.0/1.1 supports data transfer rates of 12 Mbps. Also referred to as high-speed USB, USB 2.0 supports data rates up to 480 Mbps. V Vector The memory locations that an application will jump to when either a Reset or interrupt occurs. Volatile A variable qualifier which prevents the compiler applying optimizations that affect how the variable is accessed in memory. W Warning MPLAB IDE/MPLAB X IDE – An alert that is provided to warn you of a situation that would cause physical damage to a device, software file, or equipment. 16-bit assembler/compiler – Warnings report conditions that may indicate a problem, but do not halt processing. Watch Variable A variable that you may monitor during a debugging session in a Watches window. Watch Window Watch windows contain a list of watch variables that are updated at each breakpoint. Watchdog Timer (WDT) A timer on a PIC microcontroller that resets the processor after a selectable length of time. The WDT is enabled or disabled and set up using Configuration bits. Workbook For MPLAB SIM stimulator, a setup for generation of SCL stimulus. Glossary  2012-2014 Microchip Technology Inc. DS50002081B-page 75 NOTES: MPLAB® ICD 3 USER’S GUIDE FOR MPLAB X IDE DS50002081B-page 76  2012-2014 Microchip Technology Inc. Index A Auxiliary Memory...................................................... 44 AVdd ........................................................................ 18 AVss......................................................................... 18 B Boot Flash Memory.................................................. 44 Breakpoints Hardware .......................................................... 29 Setup ................................................................ 29 Software............................................................ 29 C Cables Length..........................................................47, 50 Capacitors...........................................................18, 19 CD-ROM .................................................................. 12 Circuits That Prevent Debugger Functioning ........... 19 Clock Speed............................................................. 45 Code Protect ............................................................ 21 Command-line Programming ................................... 26 Components............................................................. 12 Configuration Bits................................................21, 25 Configuration bits set in code................................... 25 Customer Support.................................................... 55 D Debug Executive .......................................................... 22 Debug Mode Sequence of Operations ................................... 21 Debug, Top Reasons Why You Can’t ...................... 32 Debug/Program Quick Reference............................ 26 Debugger Powered .................................................. 18 Debugging Requirements ........................................ 21 Documentation Conventions........................................................ 8 Layout ................................................................. 7 Driver Board Standard ........................................................... 49 Durability, Card Guide.............................................. 48 E EEPROM Memory.................................................... 44 Engineering Technical Notes ................................... 41 Erase All Before Program ........................................ 44 ETNs ........................................................................ 41 F Firmware Downloads ............................................... 44 Freeze on Halt ......................................................... 36 Freeze Peripherals Setup ........................................ 45 G General Corrective Actions ...................................... 39 H Header Board Specification........................................................ 9 Hibernate mode.................................................. 36, 47 Hubs, USB ............................................................... 47 I ICD 3 Test Interface Board ................................ 12, 51 ICD Headers ............................................................ 12 ICD3CMD................................................................. 26 ICD3Info0001 ........................................................... 40 ICSP........................................................20, 21, 23, 49 ICSPCLK.................................................................. 49 ICSPDAT.................................................................. 49 ID Memory................................................................ 44 Indicator Lights......................................................... 48 Information Messages.............................................. 40 Installation and Setup............................................... 25 Interconnections for Programming ........................... 20 Internal Debugger Power ......................................... 18 Internet Address, Microchip ..................................... 54 K Keep hardware tool connected ................................ 25 L LEDs ........................................................................ 48 Limitations ................................................................ 26 Low Voltage Programming, Enable.......................... 44 LVP configuration bit ................................................ 44 M Memories to Program............................................... 44 Memory Ranges....................................................... 44 Modular Interface Cable........................................... 21 MPLAB ICD 3 Defined ............................................. 11 myMicrochip Personalized Notification Service ....... 54 N New Project Wizard.................................................. 25 P PC, Power Down................................................ 36, 47 PGC ............................................ 17, 18, 19, 20, 21, 22 PGD ............................................ 17, 18, 19, 20, 21, 22 PIM........................................................................... 15 Power ....................................................................... 46 Power-Down mode............................................. 36, 47 Powering the Target................................................. 28 Index  2012-2014 Microchip Technology Inc. DS50002081B-page 77 Preserve Memory..................................................... 44 Processor Extension Kits ......................................... 12 Programming ........................................................... 13 Command-line .................................................. 26 Production....................................................11, 26 Project Properties Dialog ....................................25, 43 Pull-ups .................................................................... 19 Q Quick Reference Debug/Program ................................................ 26 R Reading, Recommended ........................................... 9 Readme ..................................................................... 9 Reserved Resources by Device............................... 23 Resistors .................................................................. 19 S Software Breakpoints Selection ............................... 45 SQTP ....................................................................... 26 Standard Communication Connections...................................................... 17 Driver Board...................................................... 49 Standard ICSP Device Communication ................... 15 Starting and Stopping Debugging ............................ 28 Stopwatch ................................................................ 29 T Table Read Protect .................................................. 21 Target Connection Circuitry............................................................. 17 Improper Circuits .............................................. 19 Standard ........................................................... 17 Target Device........................................................... 21 Target Low-Voltage Operation................................. 18 Target Powered ....................................................... 18 Transition Socket ..................................................... 12 Specification ..................................................9, 27 U USB.....................................................................47, 74 Cables............................................................... 12 Hubs ................................................................. 47 USB drivers.............................................................. 25 User ID Memory....................................................... 44 Using ICE Devices ................................................... 27 Using Production Devices........................................ 27 V Vcap......................................................................... 18 Vdd.......................................................... 17, 18, 20, 21 Vpp.......................................................... 17, 18, 19, 21 Vss .......................................................... 17, 18, 20, 21 W Watchdog Timer..................................................21, 74 Web Site, Microchip ................................................. 54 DS50002081B-page 78  2012-2014 Microchip Technology Inc. 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Advance Information DS20005263A-page 1 34AA04 Features: • 4 Kbit EEPROM: - Internally organized as two 256 x 8-bit banks - Byte or page writes (up to 16 bytes) - Byte or sequential reads within a single bank - Self-timed write cycle (5 ms max.) • JEDEC® JC42.4 (EE1004-v) Serial Presence Detect (SPD) compliant for DRAM (DDR 4) modules • High-Speed I2C™ Interface: - Industry standard 100 kHz, 400 kHz, and 1 MHz - Schmitt Trigger inputs for noise suppression - SMBus-compatible bus time out - Cascadable up to eight devices • Write Protection: - Reversible software write protection for four individual 128-byte blocks • Low-Power CMOS Technology: - Voltage range: 1.7V to 3.6V - Write current: 1.5 mA at 3.6V - Read current: 200 µA at 3.6V, 400 kHz - Standby current: 1 µA at 3.6V • High Reliability: - More than one million erase/write cycles - Data retention: > 200 years - ESD protection: > 4000V • 8-lead PDIP, SOIC, MSOP, TSSOP, TDFN, and UDFN Packages • Available Temperature Ranges: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Package Types Description: The Microchip Technology Inc. 34AA04 is a 4 Kbit Electrically Erasable PROM which utilizes the I2C serial interface and is capable of operation across a broad voltage range (1.7V to 3.6V). This device is JEDEC JC42.4 (EE1004-v) Serial Presence Detect (SPD) compliant and includes reversible software write protection for each of four independent 128 x 8-bit blocks. The device features a page write capability of up to 16 bytes of data. Address pins allow up to eight devices on the same bus. The 34AA04 is available in the 8-lead PDIP, SOIC, MSOP, TSSOP, TDFN, and UDFN packages. Block Diagram A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC NC SCL SDA A0 A1 A2 VSS NC SCL SDA 8 VCC 7 6 5 1 2 3 4 PDIP/SOIC/MSOP/TSSOP TDFN/UDFN I/O Control Logic Memory Control Logic XDEC HV Generator Write-Protect Circuitry YDEC VCC VSS Sense Amp. R/W Control SDA SCL A0 A1 A2 Block 0 (000h-07Fh) Block 1 (080h-0FFh) Block 2 (100h-17Fh) Block 3 (180h-1FFh) 4K I2C™ Serial EEPROM with Software Write-Protect Product Brief 34AA04 DS20005263A-page 2 Advance Information  2014 Microchip Technology Inc. NOTES:  2014 Microchip Technology Inc. Advance Information DS20005263A-page 3 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620778333 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS20005263A-page 4 Advance Information  2014 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Worldwide Sales and Service 10/28/13  2013 Microchip Technology Inc. DS00001586A-page 1 INTRODUCTION The USB3503 is the industry's first HSIC-based USB 2.0 hub controller designed specifically for portable consumer electronics products such as smartphones, tablets and e-readers. The USB3503 features one HSIC upstream port, 3 downstream USB 2.0 ports, and is designed to deliver the low-power and ultra-small footprint that portable product designers demand. Minimizing power consumption, thus extending portable device battery life, is crucial for maintaining a competitive edge in the portable device market. This document contains information for portable product designers looking to minimize suspended state power consumption in designs containing the USB3503. This document includes the following topics: • Low Power Modes Overview • Standard Suspend Mode • Reset Suspend Mode • Suspend Mode with Clock Power-Down Audience This document is written for developers who are familiar with USB/HSIC protocol and the various features of the USB3503 hub. The goal of this application note is to familiarize the reader with low power options for the USB3503 and to assist the developer with choosing the most appropriate configuration for their design. AN1586 USB3503 Low Power Configurations Author: Andrew Rogers, Microchip Technology Inc. DS00001586A-page 2  2013 Microchip Technology Inc. AN1586 LOW POWER MODES OVERVIEW The USB3503 is designed to handle USB communication within a personal device, such as a mobile phone or tablet device. The low power configurations detailed in this application note are presented as if the hub was designed into a personal device, where battery consumption is a primary concern. In a typical application, the HSIC upstream connection will interface with the personal device’s microprocessor/controller. A downstream port may be connected to a device such as a modem which may be used to send and receive calls. To conserve power consumption while there is no modem activity, it is desirable to place the USB hub into low-power, suspended state. It may also be desirable that hub be able to rapidly exit the suspended state when data is ready to be sent to the hub from the downstream port. This document presents three different options for minimizing hub power consumption while the hub is not in use: 1. Standard Suspend Mode 2. Reset Suspend Mode 3. Suspend Mode with Clock Power-Down Table 1 describes the primary trade-offs associated with these configuration options. TABLE 1: LOW POWER CONSUMPTION MODES QUICK COMPARISON Mode Pros Cons Standard Suspend Mode • Fastest resume/wakeup • Simplest implementation • Highest power consumption Reset Suspend • Lowest power consumption • Slow resume/wakeup due to reenumeration Suspend Mode with Clock Power-Down • Fast resume/wakeup • Reduced power consumption over standard suspend mode due to suspension of clock • Non-default hub configuration and additional chip-to-chip signaling required  2013 Microchip Technology Inc. DS00001586A-page 3 AN1586 STANDARD SUSPEND MODE For standard suspend configuration, the hub may be left in its default configuration. While the hub is in a suspended state, the downstream USB 2.0 D+ line is kept high and the D- line is kept low. When a downstream device attempts to wake up the hub from suspend to prepare upstream devices for data transmission, the downstream D+ line is switched low and D- line is switched high. This signaling is interpreted by the hub and passed upstream via the HSIC lines to signal the upstream device to prepare for data transmission. A screen capture of a standard wakeup event on the USB3503 is shown in Figure 1. While this method is fast, the hub must be kept in a low power suspended state while there is no USB activity. The clock signal is not interrupted when switching between states and thus continuously consumes power during the suspended state. FIGURE 1: STANDARD WAKE-UP EVENT DS00001586A-page 4  2013 Microchip Technology Inc. AN1586 RESET SUSPEND MODE The second option to minimize hub power consumption is to completely power down the hub when there is no activity by asserting the RESET_N pin. This configuration offers the lowest amount of power consumption, but is significantly slower to resume to active hub operation. Additionally, a microcontroller must be used in this case to determine when to de-assert RESET_N, as the hub will not automatically respond to communication from the downstream lines while in this state. The hub must then be fully configured (if needed) and enumerated every time the hub must switch to an active state. The hub startup stages are shown in Figure 2. Typical values for THUBINIT, THUBCONFIG, and THUBCONNECT are 3 ms, 95 ms, and 1 ms, respectively. After the hub startup sequence is complete, the hub must still be enumerated by the host before any data is transmitted, adding additional time delay until data may be transmitted upstream. FIGURE 2: USB3503 STARTUP TIMING DIAGRAM It is possible to cut down on the hub startup time by writing to register E7h, via SMBus address 8h, and forcing the hub to connect immediately instead of allowing the configuration timer to run out. Writing a “0” to bit [1] of this register will force the hub directly into the communication stage after asserted through a serial port write.  2013 Microchip Technology Inc. DS00001586A-page 5 AN1586 SUSPEND MODE WITH CLOCK POWER-DOWN A third option to minimize hub power consumption modifies the role of the INT_N pin to signal the power-down and power-up of the reference clock when entering and exiting the suspended state. This option requires a specific configuration of the internal registers of the USB hub prior to enumeration. This configuration modifies the INT_N pin of the hub to behave in the following ways: - INT_N asserted low: The hub is configured or not configured and is in USB suspend state. - INT_N negated high: The hub is configured and is active. Bit [6], named “IntSusp”, of the internal register EEh must be changed to “1” through SMBus address 8h prior to USB attachment and enumeration. The default value of this register is 00h. Therefore, 40h should be written to the register to enable this mode. A constant clock signal to the hub must be maintained during configuration and enumeration. After hub attachment and enumeration, the INT_N signal can be utilized to signal the use of the clock. When the pin is asserted high, the clock must be on. When the pin is asserted low, the clock may be turned off. The hub can enter and exit the suspended state repeatedly as long as it is not powered down. If the hub is powered down, it must be reconfigured before enumeration. The INT_N pin is open-drain, and can be pulled up to the voltage level that is required by the controller operating the clock. Excessive current draw must be addressed while the pin is pulled low with the placement of an appropriate resistor. Figure 3 details how the INT_N signal behaves during an attempted wake-up with no clock signal present. Due to the absence of a clock signal, the wake-up signaling is never passed onto the HSIC lines and the hub will not exit its suspended state. FIGURE 3: ATTEMPTED HUB WAKE-UP WITH NO CLOCK SIGNAL DS00001586A-page 6  2013 Microchip Technology Inc. AN1586 Figure 4 details the occurrence when the INT_N signal triggers the startup of a clock signal. It takes approximately 1.2 ms to pass the wake-up signal from the downstream USB 2.0 lines to the upstream HSIC lines in the USB3503 hub. FIGURE 4: HUB WAKE-UP SEQUENCE WITH INT_N TRIGGERED CLOCK SIGNAL  2013 Microchip Technology Inc. DS00001586A-page 7 AN1586 The clock signal must be triggered and reach a steady state within 10 ms of the INT_N signal assertion. Figure 5 details that even with a relatively long clock signal startup delay of just under 10 ms, the hub is still able to pass the wake-up signals to the upstream HSIC lines and resume its normal active state. FIGURE 5: HUB WAKE-UP SEQUENCE WITH 10 MS DELAYED INT_N TRIGGERED CLOCK SIGNAL DS00001586A-page 8  2013 Microchip Technology Inc. AN1586 NOTES:  2013 Microchip Technology Inc. DS00001586A-page 9 AN1586 APPENDIX A: REFERENCES The following document should be referenced when using this application note. Contact your Microchip representative for availability. • USB3503 Data Sheet DS00001586A-page 10  2013 Microchip Technology Inc. AN1586 APPENDIX B: REVISION HISTORY Revision A (November 2013) • Initial release of this document.  2013 Microchip Technology Inc. DS00001586A-page 11 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and ZScale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. A more complete list of registered trademarks and common law trademarks owned by Standard Microsystems Corporation (“SMSC”) is available at: www.smsc.com. The absence of a trademark (name, logo, etc.) from the list does not constitute a waiver of any intellectual property rights that SMSC has established in any of its trademarks. All other trademarks mentioned herein are property of their respective companies. © 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-62077-512-7 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS00001586A-page 12  2013 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Worldwide Sales and Service 10/28/13 Bill of Materials MCP2200 Isolated USB to UART Demo Board Document Number: 02-10365 Board Number: 04-10365 Part Number: ADM00276 Revision: 4 Engineer: Bogdan Bolocan Drawn By: Bogdan Popescu Creation Date: 3:42:47 PM Print Date: 3:51:40 PM Quantity Designator Description_ Manufacturer 1 Manufacturer Part Number 1 Supplier 1 Supplier Part Number 1 4 C1, C2, C3, C4 CAP CER 0.1uF 16V 10% X7R SMD 0603 Samsung CL10B104KO8NNNC Digi-Key 1276-1005-1-ND 2 C5, C6 CAP CER 18pF 50V 5% NP0 SMD 0603 KEMET C0603C180J5GACTU Digi-Key 399-1052-1-ND 1 J1 CON USB MINI-B Female SMD R/A Hirose UX60-MB-5ST Digi-Key H2959CT-ND 1 J2 CON HDR-2.54 Female 1x6 Gold TH R/A Sullins PPPC061LGBN-RC Digi-Key S5481-ND 2 LD1, LD3 DIO LED GREEN 2.2V 25mA 10mcd Diffuse RAD 1.8mm Kingbright Corp WP4060GD Digi-Key 754-1373-ND 1 LD2 DIO LED RED 1.85V 30mA 200mcd Diffuse RAD 1.8mm Kingbright Corp WP4060SRD Digi-Key 754-1375-ND 1 R1 RES TKF 4.7k 5% 1/10W SMD 0603 Yageo RC0603JR-074K7L Digi-Key 311-4.7KGRTR-ND 3 R2, R3, R4 RES TKF 1k 5% 1/10W SMD 0603 Panasonic ERJ-3GEYJ102V Digi-Key P1.0KGCT-ND 1 U2 IC PHOTO FOD8012 Bi-Dir 3.3V and 5V SOIC-8 Fairchild Semiconductor FOD8012 Digi-Key FOD8012-ND 1 X1 CRYSTAL 12MHz 18pF SMD HC49/US Abracon ABLS-12.000MHZ-B4-T Digi-Key 535-10218-1-ND 1 U1 MCHP INTERFACE USB UART MCP2200- I/SS SSOP-20 Microchip MCP2200-I/SS Digi-Key MCP2200-I/SS-ND 1 CBL1 MECH HW CABLE USB-A Male to Mini USB-B Male 3ft Black Katerno 10UM-02103BK Katerno 10UM-02103BK 1 Enclosure1 MECH HW ENCLOSURE P3A-201005SMIC12040 REV 2 (PMS485 red with white pad stamp) New Age Enclosures PXA-201005S-MIC12040 REV 2 3 M1, M2, M3 MECH HW STAND-OFF LED T1-3/4 0.120" Black Bivar LTM-120 Digi-Key 492-1301-ND Microchip Parts listed below Mechanical Parts to be added in the package 02-10365-R4_BOM.xls Page 1 Approved Notes M1, M2, M3 Mount all LEDs on these standoffs. Do Not Populate Parts listed below 02-10365-R4_BOM.xls Page 2 MAQ5300 Automotive Qualified Single Output 300 mA µCap LDO Summary The MAQ5300 is an automotive-qualified, ultra-small, ultra-low dropout CMOS regulator (ULDO) that is ideal for today’s most demanding automotive applications including infotainment, camera module, image sensors and anywhere PCB space is limited. It offers extremely low dropout voltage, very low output noise and can operate from a 2.3 to 5.5V input while delivering up to 300 mA. The MAQ5300 offers 2% initial accuracy, low ground current (typically 85 µA total), thermal shutdown, and current-limit protection. The MAQ5300 can also be put into a zero-offmode current state, drawing no current when disabled. The MAQ5300’s operating junction temperature range is –40°C to +125°C and it is available in fixed output voltages in a RoHS-compliant 6-pin 2 × 2 mm DFN package. Applications ■ CMOS image sensors ■ Backup camera modules ■ GPS receivers ■ Infotainment Typical Performance Benefi ts Features High Reliability ■ AEC-Q100 qualifi ed ■ PPAP documentation available High Performance ■ Low dropout voltage: 100 mV at 300 mA ■ ±2% initial output accuracy ■ ±3% output accuracy over temperature Compact footprint ■ Small 2 × 2 mm DFN package ■ Stable with 1 µF ceramic capacitors Ordering Information Part Operating Voltage Temperature Range Package MAQ5300-1.5YML 1.5V –40°C to +125°C 6-pin 2 ×2 mm DFN MAQ5300-1.8YML 1.8V –40°C to +125°C 6-pin 2 ×2 mm DFN MAQ5300-2.5YML 2.5V –40°C to +125°C 6-pin 2 ×2 mm DFN MAQ5300-2.8YML 2.8V –40°C to +125°C 6-pin 2 ×2 mm DFN MAQ5300-2.85YML 2.85V –40°C to +125°C 6-pin 2 ×2 mm DFN MAQ5300-3.0YML 3.0V –40°C to +125°C 6-pin 2 ×2 mm DFN MAQ5300-3.3YML 3.3V –40°C to +125°C 6-pin 2 ×2 mm DFN The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated. All Rights Reserved. Printed in the U.S.A. 1/16 DS20005484A Visit our web site for additional product information and to locate your local sales office. Microchip Technology Inc. • 2355 W. Chandler Blvd. • Chandler, AZ 85224-6199 www.microchip.com MIC4478/4479/4480 32V Low-Side Dual MOSFET Drivers Summary The MIC4478, MIC4479 and MIC4480 are low-side dual MOSFET drivers designed to switch N-channel enhancement type MOSFETs from TTL-compatible control signals for low-side switch applications. The MIC4478 is dual non-inverting, the MIC4479 is dual inverting, and the MIC4480 is complimentary non-inverting and inverting. These drivers feature short delays and high peak currents to produce precise edges and rapid rise and fall times. The MIC4478/4479/4480 are powered from a +4.5V to +32V supply voltage. The on-state gate drive output voltage is approximately equal to the supply voltage (no internal regulators or clamps). In a low-side configuration, the drivers can control a MOSFET that switches any voltage up to the rating of the MOSFET. The MIC4478/4479/4480 are available in the 8-lead SOIC (ePAD and non-ePAD) package and are rated for the −40°C to +125°C ambient temperature range. Typical Performance Applications ■ Power supplies ■ Communication/networking power ■ Uninterrupted Power Supply (UPS) ■ Photovoltaic inverters ■ Power inverters Benefi ts Features Ideal for Battery and Industrial Applications ■ Wide 4.5V to 32V input range ■ Low 4.5V operating range make this device ideal battery powered applications Power Saving ■ 300 μA quiescent current ■ Reduces power loss when the device is idling ■ Helps with overall system power effi ciency Improves Effi ciency ■ 2.5A peak current ■ Allows for faster switching ■ Improves power effi ciency by reducing the switching losses Reduces Heat ■ Reduces losses due to low on-resistance The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated. All Rights Reserved. Printed in the U.S.A. 1/16 DS20005494A Visit our web site for additional product information and to locate your local sales office. Microchip Technology Inc. • 2355 W. Chandler Blvd. • Chandler, AZ 85224-6199 www.microchip.com Ordering Information Part Number Marking Configuration Junction Temperature Range Package MIC4478YM 4478YM Dual Non-Inverting −40 to +125°C 8-pin SOIC MIC4478YME 4478YME Dual Non-Inverting −40 to +125°C 8-pin ePAD SOIC MIC4479YM 4479YM Dual Inverting −40 to +125°C 8-pin SOIC MIC4479YME 4479YME Dual Inverting −40 to +125°C 8-pin ePAD SOIC MIC4480YM 4480YM Inverting + Non-Inverting −40 to +125°C 8-pin SOIC MIC4480YME 4480YME Inverting + Non-Inverting −40 to +125°C 8-pin ePAD SOIC LO AD INA VS GND OUTA MIC4478YME +12V N-CHANNEL MOSFET OUTB N-CHANNEL INB MOSFET LO AD LOAD VOLTAGE LOAD VOLTAGE ENA ENB KSZ84XX EtherSynch® Technology KSZ8441HLI: EtherSynch IEEE 1588v2 10/100 Controller with Generic Host Bus Interface Summary The KSZ8441 controller enables end-device attachments for industrial Ethernet and electrical substation automation networks. Key applications include industrial Ethernet standards, including EtherNet/IP™, PROFINET® and Modbus TCP™, along with IEC 61850 standard for substation communications. The KSZ8441 controller simplifies integration with Host CPUs that do not provide embedded Ethernet MACs and has been optimized to offload synchronization and communications host processing through its hardwireintensive architecture. Microchip offers a precision timing protocol (PTPv2) synchronization stack solution integrated with the KSZ8441 driver to accelerate the design cycle. The KSZ8441 switch is also interoperable with leading third-party PTP stacks. Microchip features the industry’s most robust and costeffective Ethernet switches and physical layer transceivers, built upon Microchip’s low-power physical layer technology, advanced power management, and innovative design. Applications ■ Industrial control ■ Smart grid ■ Data acquisition ■ Mobile back haul ■ Audio/video streaming Benefi ts Features Supports ordinary, master, slave and transparent clocks in a single device ■ Comprehensive PTP clock modes Reduces host CPU processing load and network traffi c ■ Hardware-assisted PTP implementation Extends system synchronization to locally-connected devices ■ Extensive GPIO synchronized to precision clock Reduces board resources and BOM costs ■ Clock 10 × 10 mm, 64-pin, LQFP package ■ Lowest power consumption with energy effi cient Ethernet support KSZ8441 Readily Integrates with Host CPUs That Do Not Provide an Embedded Ethernet MAC 1588 TIMESTAMPING MAC 10/100 PHY KSZ8441 CONTROLLER PRECISION CLOCK PRECISION GPIO HOST PROCESSOR EMBEDDED CPU MEMORY MEMORY I/O I/O I/O I/O HOST INTERFACE 8-/16-BIT GENERIC HOST INTERFACE CONFIGURATION/ CONTROL (IN-BAND) INFRASTRUCTURE SWITCH The Microchip name and logo, the Microchip logo and EtherSynch are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated. All Rights Reserved. Printed in the U.S.A. 1/16 DS00002056A Visit our web site for additional product information and to locate your local sales office. Microchip Technology Inc. • 2355 W. Chandler Blvd. • Chandler, AZ 85224-6199 www.microchip.com PROGRAMMABLE I/O LED CONTROL GPIO INTEGRATED PHYs HOST INTERFACE IEEE 1588 PACKET/QUEUE PROCESSING QUEUE MGMT. FRAME BUFFERS MIBs EEPROM INTERFACE 10/100 PHY 1 10/100 MAC 1 CONTROL REGISTERS KSZ84XX EtherSynch® Technology KSZ8463MLI/RLI: EtherSynch IEEE 1588v2 3-Port 10/100 Switch with MII/RMII Interface Summary The KSZ8463 switch family enables end-device attachments for industrial Ethernet and electrical substation automation networks. Key applications include industrial Ethernet standards, including EtherNet/IP™, PROFINET® and Modbus TCP™, along with IEC 61850 standard for substation communications. The KSZ8463 switch simplifies integration with host CPUs that provide an embedded Ethernet MAC and has been optimized to offload synchronization and communications host processing through its hardwire-intensive architecture. Microchip offers a precision timing protocol (PTPv2) synchronization stack solution integrated with the KSZ8463 driver to accelerate the design cycle. The KSZ8463 switch is also interoperable with leading thirdparty PTP stacks. Microchip features the industry’s most robust and costeffective Ethernet switches and physical layer transceivers, built upon Microchip’s low-power physical layer technology, advanced power management, and innovative design. Applications ■ Industrial control ■ Smart grid ■ Data acquisition ■ Mobile back haul ■ Audio/video streaming ESZ8463 Readily Integrates with Host CPUs That Do Not Provide an Embedded Ethernet MAC Benefi ts Features Supports ordinary, master, slave and transparent clocks in a single device ■ Comprehensive PTP clock modes Reduces host CPU processing load and network traffi c ■ Hardware-assisted PTP implementation Extends system synchronization to locally-connected devices ■ Extensive GPIO synchronized to precision clock Reduces board resources and BOM costs ■ Compact 10 × 10 mm, 64-pin LQFP package ■ Lowest power consumption with energy effi cient Ethernet support 10/100 PHY SPI 1588 TIMESTAMPING MAC MAC MAC 10/100 PHY KSZ8463 3-PORT SWITCH 10/100 SWITCH PRECISION CLOCK PRECISION GPIO HOST PROCESSOR EMBEDDED CPU SPI MII/RMII SPI MAC MEMORY MEMORY I/O I/O I/O I/O UPSTREAM NODE DOWNSTREAM NODE The Microchip name and logo, the Microchip logo and EtherSynch are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated. All Rights Reserved. Printed in the U.S.A. 1/16 DS00002058A Visit our web site for additional product information and to locate your local sales office. Microchip Technology Inc. • 2355 W. Chandler Blvd. • Chandler, AZ 85224-6199 www.microchip.com PROGRAMMABLE I/O LED CONTROL GPIO INTEGRATED PHYs 10/100 PHY 2 MII/RMII SPI IEEE 1588 TIME STAMP 10/100 MAC 2 PACKET PROCESSING – VLAN, PRIORITY, FLOW CTL, etc. QUEUE MGMT. FRAME BUFFERS BUFFER MGMT. MIB COUNTERS 10/100 PHY 1 10/100 MAC 3 10/100 MAC 1 CONTROL REGISTERS ADDRESS LOOKUP SWITCH FABRIC Bill of Materials UCS1003-2 Evaluation Board Document Number: 02-10421 Board Number: 04-10421 Part Number: ADM00669 Revision: 1 Engineer: Adrian Toader Drawn By: Bogdan Popescu Creation Date: 6:07:13 PM Print Date: 10:03:27 AM Quantity Designator Description_ Manufacturer 1 Manufacturer Part Number 1 Supplier 1 Supplier Part Number 1 1 C1 CAP CER 47uF 10V 20% X5R SMD 1206 KEMET C1206C476M8PACTU Digi-Key 399-5508-2-ND 1 C2 CAP CER 0.1uF 16V 10% X7R SMD 0603 AVX 0603YC104KAT2A Digi-Key 478-1239-1-ND 1 C3 CAP CER 1uF 25V 10% X7R SMD 0603 TDK Corporation C1608X7R1E105K Digi-Key 445-5956-1-ND 1 C5 CAP TANT 150uF 10V 10% 100mOhm SMD D AVX Corporation TPSD157K010R0100 Digi-Key 478-1781-1-N D 1 C6 CAP CER 470pF 50V 10% X7R SMD 0603 Johanson Dielectrics 500R14W471KV4T Digi-Key 709-1164-1-ND 1 C7 CAP CER 10uF 10V 20% X7R SMD 1206 Murata GRM31CR71A106KA01LDigi-Key 490-3371-2-ND 1 C8 CAP CER 0.01uF 16V 10% X7R SMD 0603 Samsung CL10B103KO8NNNC Digi-Key 1276-1926-1-ND 1 D1 DIO ZENER T5V0S5-7 5V 150mW SMD SOD-523 Diodes Incorporated T5V0S5-7 Digi-Key T5V0S5DITR-ND 2 D2, D3 DIO ZENER PESD5V0X1BL 5V SMD SOD- 882 NXP Semiconductors PESD5V0X1BL,315 Digi-Key 568-4674-2-ND 3 J1, J2, J3 CON TP LOOP Tin SMD Harwin Inc S1751-46R Digi-Key 952-1478-1-ND 1 J4 CON TERMINAL 5mm 18A Female 1x2 TH R/A Phoenix Contact 1935161 Digi-Key 277-1667-ND 2 J5, J14 CON HDR-2.54 Male 2x2 Gold 5.84MH TH VERT Samtec HTSW-102-07-G-D Digi-Key HTSW-102-07-G-D-ND 1 J6 CON POWER 2.1mm 5.5mm SWITCH TH R/A CUI PJ-002A Digi-Key CP-002A-ND 1 J7 CON HDR-2.54 Male 1x2 Tin 6.10MH TH VERT Molex Inc 0022284020 Digi-Key WM6402-ND 2 J8, J12 CON HDR-2.54 Male 1x3 Tin 5.84MH TH VERT Samtec TSW-103-07-T-S Digi-Key SAM1035-03-ND 1 J9 CON USB 2.0 STD-B Female TH R/A Tyco Electronics (TE Connectivity) 292304-1 Digi-Key A31725-ND 1 J10 CON USB 2.0 STD-A Female TH R/A FCI 87520-0010BLF Digi-Key 609-1045-ND ADM00669_BOM_web.xls Page 1 1 J11 CON HDR-2.54 Male 2x4 Gold 5.84MH TH VERT Samtec TSW-104-08-L-D Digi-Key SAM1040-04-ND 1 J13 CON HDR-2.54 Male 2x8 Gold 5.84MH TH VERT FCI 68602-116HLF Digi-Key 609-3364-ND 1 L1 INDUCTOR CHOKE COMMON MODE 90 OHM 0805 Murata Electronics North America DLW21HN900SQ2L Digi-Key 490-1064-1-ND 1 LD1 DIO LED RED 1.95V 30mA 700mcd Clear SMD 0603 Kingbright APTD1608SURCK Digi-Key 754-1541-1-ND 1 LD2 DIO LED GREEN 2.2V 25mA 15mcd Clear SMD 0603 Kingbright APT1608SGC Digi-Key 754-1121-1-ND 4 R1, R2, R3, R4 RES TKF 0R 1/10W SMD 0603 NIC Components NRC06Z0TRF NIC ComponentsNRC06Z0TRF 6 R5, R6, R7, R8, R16, R17 RES TKF 10k 5% 1/10W SMD 0603 Panasonic ERJ-3GEYJ103V Digi-Key P10KGCT-ND 2 R9, R10 RES TKF 1M 5% 1/10W SMD 0603 Yageo 9C06031A1004JLHFT Yageo 9C06031A1004JLHFT 2 R11, R12 RES TKF 1k 5% 1/10W SMD 0603 Panasonic ERJ-3GEYJ102V Digi-Key P1.0KGCT-ND 1 R13 RES TKF 47k 1% 1/10W SMD 0603 Panasonic ERJ-3EKF4702V Digi-Key P47.0KHCT-ND 1 R14 RES TKF 56k 1% 1/10W SMD 0603 Stackpole Electronics Inc RMCF0603FT56K0 Digi-Key RMCF0603FT56K0CT-ND 1 R15 RES TKF 68k 1% 1/10W SMD 0603 Stackpole Electronics Inc RMCF0603FT68K0 Digi-Key RMCF0603FT68K0CT-ND 1 R18 RES TKF 82K 1% 1/10W SMD 0603 Panasonic Electronic Components ERJ-3EKF8202V Digi-Key P82.0KHCT-ND 1 R19 RES TKF 100k 1% 1/10W SMD 0603 Panasonic ERJ-3EKF1003V Digi-Key P100KHTR-ND 1 R20 RES TKF 120k 1% 1/10W SMD 0603 Panasonic ERJ-3EKF1203V Digi-Key P120KHCT-ND 1 R21 RES TKF 150k 1% 1/10W SMD 0603 Panasonic ERJ-3EKF1503V Digi-Key P150KHCT-ND 1 TP1 CON TP LOOP Yellow TH Keystone 5014 Digi-Key 5014K-ND 1 TP2 CON TP LOOP White TH Keystone 5012 Digi-Key 5012K-ND 1 U1 MCHP INTERFACE USB POWER SWITCH UCS1003-2-BP QFN-20 Microchip Technology UCS1003-2-BP Digi-Key UCS1003-2-BP-ND 1 ADAPTER1 MECH HW ADAPTER INTERCHANGEABLE BLADES KIT for PHIHONG R-Series Wall Adapters Phihong USA RPBAG Digi-Key 993-1053-ND 10 JP1 MECH HW JUMPER 2.54mm 1x2 Handle Gold TE Connectivity 881545-2 Digi-Key A26242-ND 4 PAD1, PAD2, PAD3, PAD4 MECH HW RUBBER PAD CYLINDRICAL D7.9 H5.3 BLACK 3M SJ61A11 Digi-Key SJ5747-0-ND 1 PS1 MECH HW POWER SUPPLY 5V 3A DC 2.1mm Phihong USA PSA15R-050PV Digi-Key 993-1110-ND Microchip Parts listed below Do Not Populate Parts listed below Mechanical Parts to be added in the package ADM00669_BOM_web.xls Page 2 Approved Notes ADM00669_BOM_web.xls Page 3  2016 Microchip Technology Inc. DS50002453A HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 2  2016 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0209-1  2016 Microchip Technology Inc. DS50002453A-page 3 Object of Declaration: HV9963 Boost LED Driver Demonstration Board DS50002453A-page 4  2016 Microchip Technology Inc. NOTES: HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE  2016 Microchip Technology Inc. DS50002453A-page 5 Table of Contents Preface ........................................................................................................................... 7 Introduction............................................................................................................ 7 Document Layout .................................................................................................. 7 Conventions Used in this Guide ............................................................................ 8 Recommended Reading........................................................................................ 9 The Microchip Website.......................................................................................... 9 Customer Support ................................................................................................. 9 Document Revision History ................................................................................... 9 Chapter 1. Product Overview 1.1 Introduction ................................................................................................... 11 1.2 HV9963 Device Short Overview ................................................................... 11 1.3 What is the HV9963 Boost LED Driver Demonstration Board? .................... 11 1.4 HV9963 Device Features ............................................................................. 12 1.5 HV9963 Boost LED Driver Demonstration Board Technical Specifications ............................................................................... 13 1.6 Functional Description .................................................................................. 14 1.7 What the HV9963 Boost LED Driver Demonstration Board User’s Guide Kit Contains .................................................................................................. 15 Chapter 2. Installation and Operation 2.1 Getting Started ............................................................................................. 17 2.2 Setup Procedure .......................................................................................... 17 2.3 Evaluating the HV9963 Boost LED Driver Demonstration Board ................. 20 2.4 Demonstration Board Testing ....................................................................... 20 Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 21 A.2 Board – Schematic ....................................................................................... 22 A.3 Board – Top Layer ....................................................................................... 23 A.4 Board – Top Silk Layer ................................................................................ 23 A.5 Board – Bottom Layer .................................................................................. 24 Appendix B. Bill of Materials (BOM)........................................................................... 25 Appendix C. Plots and Waveforms C.1 Plots and Waveforms Examples .................................................................. 27 Worldwide Sales and Service .................................................................................... 36 HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 6  2016 Microchip Technology Inc. NOTES: HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE  2016 Microchip Technology Inc. DS50002453A-page 7 Preface INTRODUCTION This chapter contains general information that will be useful to know before using the HV9963 Boost LED Driver Demonstration Board. Items discussed in this chapter include: • Document Layout • Conventions Used in this Guide • Recommended Reading • The Microchip Website • Customer Support • Document Revision History DOCUMENT LAYOUT This document describes how to use the HV9963 Boost LED Driver Demonstration Board as a development tool to emulate and debug firmware on a target board. The manual layout is as follows: • Chapter 1. “Product Overview” – Important information about the HV9963 Boost LED Driver Demonstration Board. • Chapter 2. “Installation and Operation” – This chapter includes a detailed description of each function of the demonstration board and instructions for how to use the board. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the HV9963 Boost LED Driver Demonstration Board. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the HV9963 Boost LED Driver Demonstration Board. • Appendix C. “Plots and Waveforms” – Describes the various plots and waveforms for the HV9963 Boost LED Driver Demonstration Board. NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 8  2016 Microchip Technology Inc. CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Represents Examples Arial font: Italic characters Referenced books MPLAB® IDE User’s Guide Emphasized text ...is the only compiler... Initial caps A window the Output window A dialog the Settings dialog A menu selection select Enable Programmer Quotes A field name in a window or dialog “Save project before build” Underlined, italic text with right angle bracket A menu path File>Save Bold characters A dialog button Click OK A tab Click the Power tab N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. 4‘b0010, 2‘hF1 Text in angle brackets < > A key on the keyboard Press , Courier New font: Plain Courier New Sample source code #define START Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -OpaBit values 0, 1 Constants 0xFF, ‘A’ Italic Courier New A variable argument file.o, where file can be any valid filename Square brackets [ ] Optional arguments mcc18 [options] file [options] Curly brackets and pipe character: { | } Choice of mutually exclusive arguments; an OR selection errorlevel {0|1} Ellipses... Replaces repeated text var_name [, var_name...] Represents code supplied by user void main (void) { ... } Preface  2016 Microchip Technology Inc. DS50002453A-page 9 RECOMMENDED READING This user’s guide describes how to use the HV9963 Boost LED Driver Demonstration Board. Another useful document is listed below. The following Microchip document is available and recommended as a supplemental reference resource: • HV9963 Data Sheet – “Closed Loop LED Driver with Enhanced PWM Dimming” (DSFP-HV9963). THE MICROCHIP WEBSITE Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://www.microchip.com/support DOCUMENT REVISION HISTORY Revision A (January 2016) • Initial Release of this Document. HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 10  2016 Microchip Technology Inc. NOTES: HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE  2016 Microchip Technology Inc. DS50002453A-page 11 Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the HV9963 Boost LED Driver Demonstration Board and covers the following topics: • HV9963 Device Short Overview • What is the HV9963 Boost LED Driver Demonstration Board? • HV9963 Device Features • HV9963 Boost LED Driver Demonstration Board Technical Specifications • Functional Description • What the HV9963 Boost LED Driver Demonstration Board User’s Guide Kit Contains 1.2 HV9963 DEVICE SHORT OVERVIEW The HV9963 is a current mode control LED driver IC designed to control single switch PWM converters (buck, boost, buck-boost or Single-Ended Primary Inductor Converter - SEPIC) in a constant frequency mode. The controller uses a peak current-mode control scheme (with programmable slope compensation) and includes an internal transconductance amplifier to accurately control the output current over all line and load conditions. Multiple HV9963s can be synchronized to each other or to an external clock using the SYNC pin. The IC also provides a disconnect switch gate drive output, which can be used to disconnect the LEDs in case of a fault condition using an external disconnect FET. The 10V external FET drivers allow the use of standard level FETs. The low voltage 5.0V AVDD is used to power the internal logic and also acts as a reference voltage to set the current level. The HV9963 includes an enhanced PWM dimming logic (patented) that enables very high PWM dimming ratios. The HV9963 also provides a TTL-compatible, low-frequency PWM dimming input that can accept an external control signal with a duty ratio of 0-100% and a frequency of up to a few tens of kilohertz. 1.3 WHAT IS THE HV9963 BOOST LED DRIVER DEMONSTRATION BOARD? The HV9963 Boost LED Driver Demonstration Board is a Boost Mode LED Driver capable of driving up to 20 one-watt LEDs in series from an input of 22V - 26V DC. It uses the Microchip Technology Inc. HV9963 device in a boost topology. The converter has very good initial regulation (+/-5%) and excellent line and load regulation over the entire input and output voltage range (< +/-1%). The full load efficiency of the converter is typically greater than 90%. The HV9963 Boost LED Driver Demonstration Board is protected against open-LED and output short circuit conditions. It is also protected from input undervoltage conditions by limiting the input current. It has excellent pulse-width modulation (PWM) dimming response, with typical rise and fall times less than 1.0 µs, which allows very high PWM dimming ratios. The switching frequency of the HV9963 can be synchronized to other HV9963 boards or to an external 200 kHz clock by connecting the clock to the SYNC pin of the HV9963 demo board. HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 12  2016 Microchip Technology Inc. The HV9963 Boost LED Driver Demonstration Board features Hiccup-mode short circuit and open-LED protection. Upon detection of either fault condition, the IC shuts down the driver and periodically attempts to restart until the fault condition ends. The board also features a built-in 500 ns blanking to prevent false tripping of the overcurrent comparator due to parasitic capacitance spikes during PWM dimming. CONNECTION DIAGRAM 1.4 HV9963 DEVICE FEATURES • Switch Mode controller for single-switch converters (Buck, Boost, Buck-Boost and SEPIC) • High output current accuracy • High PWM dimming ratio (more than 5000:1) • Internal 40V linear regulator • Internal ±2% voltage reference • Constant frequency operation with synchronization capability • Programmable soft start • 10V GATE drivers • Hiccup-mode protection for both short-circuit and open-circuit conditions Note: This application uses a Peak Current Mode Control. Use only the HV9963 device option for this board. + - 22V - 26V DC + - Product Overview  2016 Microchip Technology Inc. DS50002453A-page 13 1.5 HV9963 BOOST LED DRIVER DEMONSTRATION BOARD TECHNICAL SPECIFICATIONS • Mode of Operation: Continuous Conduction Mode • Input Voltage (steady state): 22V - 26V DC • Output LED String Voltage: 40V - 75V maximum • Output Current: 350 mA +/-5% • Output Current Ripple: 6.5% Typical • Switching Frequency: 200 kHz • Full-Load Efficiency: 93% (at 24V Input) • Open-LED Protection: Shuts Down at 86.4V • Output Short Circuit Protection: Included • Input Undervoltage Protection: Included • PWM Dimming: 1:5000 Dimming Ratio at 200 Hz Figure 1-1 shows a simplified block diagram of the application. FIGURE 1-1: HV9963 Boost LED Driver Demonstration Board Simplified Block Diagram. CIN L1 RCS CSC CPVDD D2 (optional) D1 ROVP1 CO RS RREF2 RREF1 RT CAVDD C CC CHCP SS Q2 VIN PVDD GT CS OVP FL T FB IREF HCP SYNC SS COMP RT AVDD PWMD GND HV9963 PWM Dimming Input VIN Q1 ROVP2 HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 14  2016 Microchip Technology Inc. 1.6 FUNCTIONAL DESCRIPTION The HV9963 device provides all the analog functions necessary to implement a Peak Current Mode PWM DC-DC Converter. The power train is based on the Boost topology. The converter provides adjustable constant current at the output, necessary to drive high-power LED applications. The output (load) current is sensed with a 1.24 shunt resistor (Rs). The voltage across this shunt resistor is compared with the reference voltage at the IREF pin by the HV9963 device’s transconductance amplifier. The reference voltage for the HV9963 output current is set by the resistor divider formed by RREF1 and RREF2. The output current is calculated with Equation 1-1 EQUATION 1-1: EQUATION 1-2: For continuous conduction mode converters operating in the constant frequency mode, slope compensation becomes necessary to ensure stability of the peak current mode controller, if the operating duty cycle is greater than 0.5. Choosing a slope compensation that is one half of the down slope of the inductor current ensures that the converter will be stable for all duty cycles. Slope compensation in the HV9963 can be programmed by one external capacitor (CSC) in series with the CS pin. A current proportional to the switching frequency is sourced out of the CS pin. EQUATION 1-3: This current flows into the capacitor and produces a ramp voltage across the capacitor. The voltage at the CS pin is then the sum of the voltage across the capacitor and the voltage across the current sense resistor, with the voltage across the capacitor providing the required slope compensation. When the GATE turns off, an internal pull-down MOSFET discharges the capacitor. Assuming a down slope of DS (A/µs) for the inductor current and a maximum desired peak inductor current of ISAT, the sense resistor can be computed as: EQUATION 1-4: IOUT VREF 1.24 = ------------ VREF RREF2 RREF1 + RREF2 = ------------------------------------- 5V  ISC 2A fS 1 100kHz =   ------------------ RCS 1 12----- AVDD   – 0.7V 1 DS 106  0.93 2 fs   ------------     I + SAT =   ---------------------------------------------------------------- Product Overview  2016 Microchip Technology Inc. DS50002453A-page 15 The slope compensation capacitor is chosen to provide the required amount of slope compensation needed to maintain stability. EQUATION 1-5: 1.6.1 ENHANCED PWM DIMMING: The HV9963 has enhanced PWM dimming capability, which allows PWM dimming widths less than one switching cycle with no drop in the LED current. The enhanced PWM dimming performance of the HV9963 can be best explained by considering a typical boost converter circuit without this functionality. When the PWM dimming pulse becomes very small (less than one switching cycle for a DCM design or less than five switching cycles for a CCM design), the boost converter is turned off before the input current can reach its steady state value. This causes the input power to droop, which is manifested in the output as a droop in the LED current. The inductor current does not rise enough to trip the CS comparator. This causes the closed loop amplifier to lose control of the LED current and COMP rails to VDD. In the HV9963, however, this problem is overcome by keeping the boost converter ON, even though the PWM signal has gone to zero to ensure that enough power is delivered to the output. Thus, the amplifier still has control over the LED current and the LED current will be in regulation. See the HV9963 data sheet for more information on Enhanced PWM Dimming. 1.7 WHAT THE HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE KIT CONTAINS The HV9963 Boost LED Driver Demonstration Board User’s Guide includes: • HV9963 Boost LED Driver Demonstration Board (ADM00650) • Important Information Sheet CSC ISC 0.5 DS  RCS    = ----------------------------------------- HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 16  2016 Microchip Technology Inc. NOTES: HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE  2016 Microchip Technology Inc. DS50002453A-page 17 Chapter 2. Installation and Operation 2.1 GETTING STARTED The HV9963 Boost LED Driver Demonstration Board is fully assembled and tested. The board requires the use of an external input voltage source (22V to 26V) and an external LED load. 2.1.1 Additional Tools Required for Operation • A DC power supply, a bench supply that can produce 30V and 3A is recommended to operate the board at the full rated power. • An oscilloscope and/or a multimeter to observe the waveforms and measure the electrical parameters (optional). • A Signal Generator capable of generating a TTL compatible, low-frequency Pulse waveform with variable pulse widths that can achieve PWM Dimming. 2.2 SETUP PROCEDURE To operate the HV9963 Boost LED Driver Demonstration Board, the following steps must be completed: 1. Attach an LED load (or dummy load) to the J2 Output Connector (observe the polarity). 2. Connect a jumper between the PWMD input and AVDD of the J3 Input Connector as shown by the dashed lines in Figure 2-1. To synchronize the switching frequencies of two or more HV9963 demo boards, connect an external push-pull waveform source between the terminals PWMD and GND of J3 connector as shown by the solid lines. 3. Connect a power supply to the J1 Input Connector (observe the polarity). 4. To synchronize two or more boards, connect the SYNC pins of all the boards together. To synchronize the HV9963 Boost LED Driver Demonstration Board to an external 200 kHz clock, connect the clock between the SYNC and GND pins of connector J3. 2.2.1 Demonstration Board Output Current Configuration The board is configured to deliver a nominal value of 350 mA to the LEDs’ load. The maximum output voltage is set to be approximately 75V with overvoltage protection set at approximately 83V. Note: During PWM dimming, Pin 2 of the J3 connector should be left open. Also, the PWM signal must have the proper polarity with the positive connected to Pin 3 of J3 connector. Note that Pin 4 of J3 is internally connected to the return path of the input voltage WARNING Please observe the polarity for all steps to avoid board damage. HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 18  2016 Microchip Technology Inc. 2.2.2 Connecting the Load A string of LEDs (1W each) can be powered by this board. The LED's string must be mounted on an appropriate heat sink to keep the maximum junction temperature at safe level (consult the HV9963 data sheet for details). The nominal current delivered by the board to the LED's string is set to 350 mA and the maximum output voltage is 75V. The LED's string can be replaced by a resistor of 220Ω and 20W dissipated power (dummy load). In this case, the power delivered to the load will be about 27W. Connect the LEDs’ string to the J3 connector. It is very important to use the correct polarity (see Figure 2-1). FIGURE 2-1: Power Supply and Load Connection Diagram. + - 22V - 26V DC + - Note: This board has no Thermal Shut-Down function implemented. Ensure that the load is properly cooled. Installation and Operation  2016 Microchip Technology Inc. DS50002453A-page 19 2.2.3 Using the Reference Board The board has Undervoltage Lock-Out and Overvoltage protections. The thresholds are 4.7 VDC for AVDD and 83 VDC, respectively. The board is protected against both No-Load and short circuit conditions. 2.2.4 Connectors Table 2-1 shows the available connectors on the board. TABLE 2-1: CONNECTORS DESCRIPTION Connector Description Pins Connection to PIN J1 Input Connector VIN Connect the positive end of the input voltage GND Connect the negative end of the input voltage J2 Output Connector LED+ Connect the Anode of LED string LED- Connect the Cathode of LED string J3 Signal Connector GND Connected to negative of input voltage AVDD Connected to the AVDD pin of the HV9963 (5V) PWMD Connect to AVDD to enable the evaluation board; connect to a TTL compatible signal to enable PWM Dimming HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 20  2016 Microchip Technology Inc. 2.3 EVALUATING THE HV9963 BOOST LED DRIVER DEMONSTRATION BOARD The best way to evaluate the HV9963 Boost LED Driver Demonstration Board is to examine the circuit and measure the voltages and currents with a Digital Voltage Meter (DVM) and probe the board with an oscilloscope. Additional tools (current probe, IR camera) are necessary to evaluate some technical parameters of the board (temperature of power components, ability to withstand surge voltage pulse on input, EMI). 2.4 DEMONSTRATION BOARD TESTING 1. Normal Operation: Connect the input source and the output LEDs as shown in the Connection Diagram (Figure 2-1) and enable the board. The LEDs will glow with a steady intensity. Connecting an ammeter in series with the LEDs will allow measurement of the LED Current. The current will be 350 mA ±5%. 2. Current Regulation: With the input power to the converter disconnected, change the LED string voltage within the specifications mentioned. The output current of the HV9963 will remain very steady over the entire load range. Vary the input voltage while the circuit is operational. The current will be regulated over the entire line range (see Figures C-3 and C-4). 3. Open LED Test: Connect a voltmeter across the output terminals of the HV9963. Start the demo board normally and once the LED current reaches steady state, unplug one end of the LED string from the demo board. The output voltage will rise to about 83V and the HV9963 will shut down. Once the LED string is reconnected, the driver will start regulating current again (see Figures C-5 and C-6). 4. Short Circuit Test: When the HV9963 is operating in steady state, connect a jumper across the terminals of the LED string. Notice that the output current will immediately go to zero and the converter will shut down. Removing the jumper will cause the HV9963 to restart and continue to regulate the LED current (see Figures C-7 and C-8). 5. PWM Dimming: With the input voltage to the board disconnected, apply a TTL-compatible, push-pull square wave signal between PWMD and GND terminals of J3 connector as shown in the Connection Diagram (Figure 2-1). Turn the input voltage back on and adjust the duty cycle and/or frequency of the PWM dimming signal. The output current will track the PWM dimming signal. Note that, although the converter operates perfectly at 1 kHz PWM dimming frequency, the widest PWM dimming ratio can be obtained at lower frequencies like 100 Hz or 200 Hz (see Figures C-9 — C-17). Some typical voltage and waveforms are provided in Appendix C. “Plots and Waveforms”. HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE  2016 Microchip Technology Inc. DS50002453A-page 21 Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the HV9963 Boost LED Driver Demonstration Board: • Board – Schematic • Board – Top Layer • Board – Top Silk Layer • Board – Bottom Layer HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 22  2016 Microchip Technology Inc. A.2 BOARD – SCHEMATIC C11 1 nF R1 681k R9 105k C2 2.2uF, 50V 1 2 L1 100 µH D1 B110-13-F C5 1nF R12 C9 open 33 nF C1 2.2uF, 50VQ1FDS3692 1 1 2 2 3 3 4 4 J3 1 1 2 2 J1 R8 1.24, 1/4W Q2 FQT7N10TF R5 0.1, 1/2W C13 33 nF R2 5 R7 121k R13 300 R4 10k R11 10k C3 1µF, 100V C14 1nF HV9963 VIN 1 PVDD 2 GATE 3 GND 4 CS 5 HCP 6 RT 7 SYNC 8 AVDD 10 OVP 12 PWM 13 SS 9 IREF 15 FB 16 COMP 14 FAULT 11 U2 C8 10 nF C7 R3 100 C12 0.1 uF C4 1 1 2 2 J2 R10 1k C6 220pF C10 10 nF R6 33 AVDD PWMD AVDD PWMD (DRA127-101) 1µF,16V 1µF, 100V Schematic and Layouts  2016 Microchip Technology Inc. DS50002453A-page 23 A.3 BOARD – TOP LAYER A.4 BOARD – TOP SILK LAYER HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 24  2016 Microchip Technology Inc. A.5 BOARD – BOTTOM LAYER HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE  2016 Microchip Technology Inc. DS50002453A-page 25 Appendix B. Bill of Materials (BOM) TABLE B-1: BILL OF MATERIALS (BOM) Qty. Reference Description Manufacturer Part Number 2 C1, C2 2.2 µF, 10% 50V X7R ceramic capacitor Murata Electronics® GRM31CR71H225KA88L 2 C3, C4 1 µF, 10%, 100V PEN film capacitor Panasonic® ECG ECW-U1105KCV 2 C5, C11 1 nF, 10%, 50V X7R ceramic capacitor TDK Corporation C2012X7R1H102K 1 C6 220 pF, 5%, 50V C0G ceramic capacitor AVX Corporation 08055A221JAT2A 1 C7 1 µF, 10%, 16V X7R ceramic capacitor Murata Electronics® GRM21BR71C105KA01L 2 C8, C10 10 nF, 5%, 50V C0G ceramic capacitor Murata Electronics® GRM2195C1H103JA01D 2 C9, C13 33 nF, 5%, 25V C0G ceramic capacitor TDK Corporation C2012C0G1H333J125AA 1 C12 0.1 µF, 10%, 16V X7R ceramic capacitor Murata Electronics® GRM219R71C104KA01D 1 C14 1 nF, 10%, 50V X7R ceramic capacitor TDK Corporation C1608X7R1H102K 1 D1 100V, 1A Schottky diode Diodes® Incorporated B1100-13-F 2 J1, J2 2 Position 5 mm pitch header TE Connectivity Ltd. 1546931-2 1 J3 4 Position 2.54 mm pitch header Molex® 22-03-2041 1 L1 100 µH, 2.77A sat, 1.89A rms inductor Eaton DRA127-101-R 1 PCB Printed Circuit Board - HV9963 Boost LED Driver Demo Board Microchip Technology Inc. 04-10382 1 Q1 100V, 60 m, 15 nC N-channel MOSFET Fairchild Semiconductor® FDS3692 1 Q2 100V, 350 m, 7.5 nC N-channel MOSFET Fairchild Semiconductor® FQT7N10TF 1 R1 681K, 1/4W, 1% chip resistor Yageo Corporation RC1206FR-07681KL 1 R2 5, 1/8W, 5% chip resistor Vishay Precision Group (VPG) Y4015R00000F9W 1 R3 100, 1/10W, 5% chip resistor Yageo Corporation RC0603FR-07100RL 2 R4, R11 10K, 1/8W, 1% chip resistor Yageo Corporation RC0805FR-0710KL 1 R5 0.1, 1/2W, 1% chip resistor Yageo Corporation RL1206FR-7W0R1L 1 R6 33, 1/8W, 5% chip resistor Yageo Corporation RC0805JR-0733RL 1 R7 121K, 1/8W, 1% chip resistor Yageo Corporation RC0805FR-07121KL 1 R8 1.24, 1/4W, 1% chip resistor Yageo Corporation RC1206FR-071R24L 1 R9 105K, 1/8W, 1% chip resistor Yageo Corporation RC0805FR-07105KL 1 R10 1K, 1/4W, 5% chip resistor Yageo Corporation RC1206JR-071KL 1 R12 Not Installed/Used 1 R13 300, 1/8W, 5% chip resistor Yageo Corporation RC0805JR-07300RL 1 U2 HV9963NG Microchip Technology Inc. HV9963NG-G 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 26  2016 Microchip Technology Inc. NOTES: HV9963 BOOST LED DRIVER DEMONSTRATION BOARD USER’S GUIDE  2016 Microchip Technology Inc. DS50002453A-page 27 Appendix C. Plots and Waveforms C.1 PLOTS AND WAVEFORMS EXAMPLES FIGURE C-1: Efficiency vs. Output Voltage, VIN = 24V. FIGURE C-2: Efficiency vs. Input Voltage, VOUT = 72V. 92.60% 92.80% 93.00% 93.20% 93.40% 93.60% 93.80% 94.00% 94.20% 94.40% 39 44 49 54 59 64 69 74 79 Efficiency Output Voltage (V) 92.00% 92.20% 92.40% 92.60% 92.80% 93.00% 93.20% 93.40% 93.60% 93.80% 21.5 22 22.5 23 23.5 24 24.5 25 25.5 26 26.5 Efficiency Input Voltage (V) HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 28  2016 Microchip Technology Inc. FIGURE C-3: Change in Output Current from Nominal Value vs. Output Voltage, VIN = 24V (Nominal Value is the Output Current at VOUT = 70V). FIGURE C-4: Output Current vs. Input Voltage, VOUT = 72V. 0.00% 0.05% 0.10% 0.15% 0.20% 0.25% 0.30% 39 44 49 54 59 64 69 74 79 Change in Current from Nominal Value Output Voltage -0.20% -0.10% 0.00% 0.10% 0.20% 0.30% 0.40% 22 23 24 25 26 Change in Current from Nominal Value Input Voltage Plots and Waveforms  2016 Microchip Technology Inc. DS50002453A-page 29 C.1.1 Various Signals During Open LED Protection Figures C-5 and C-6 show the Hiccup-mode overvoltage protection. When the open circuit condition occurs, the LED current immediately goes to zero. At that point, the inductor charges the output capacitor and the COMP voltage is pulled to GND. Once the output voltage reaches the overvoltage threshold, the converter shuts down and the output voltage slowly decays because the output capacitor is discharged by the overvoltage sensing resistor network. Once the output voltage falls to 90% of its trip point, the converter tries to restart. Since the fault condition still persists, the converter shuts down almost immediately. Thus, the HV9963 maintains the output voltage in a band until the LED string reconnects. FIGURE C-5: Hiccup Mode Overvoltage Protection. The figure below shows the recovery of the HV9963 from an overvoltage condition. In this case, the LED string has reconnected at some point when the converter is turned off. When the converter attempts to restart, the overvoltage condition is no longer met, therefore it starts up normally. There is no significant overshoot in the LED current. FIGURE C-6: Recovery From Open-LED Condition. COMP Output Voltage LED Current COMP Output Voltage LED Current HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 30  2016 Microchip Technology Inc. C.1.2 Short Circuit Protection Figure C-7 shows various signals during short circuit protection. The onset of the output short circuit is indicated by the first spike in the LED current. At this point, the HV9963 shuts down and the hiccup mode protection takes over. After the hiccup time ends, the converter attempts to restart and finding the fault condition still present, shuts down again. FIGURE C-7: Short Circuit Protection. In Figure C-8, the short across the LED string is removed at some point when the converter is turned off. When the converter attempts to restart, it finds the condition has disappeared and it starts up normally. There is no overshoot in the LED current. FIGURE C-8: Recovery From Short Circuit Condition. COMP Output Voltage LED Current COMP Output Voltage LED Current Plots and Waveforms  2016 Microchip Technology Inc. DS50002453A-page 31 C.1.3 PWM Dimming Edge Waveforms Figure C-9 shows various signals during PWM dimming, when PWMD goes low. The LED current falls to zero with a fall time of about 1 µs. FIGURE C-9: PWM Dimming at VOUT = 54V. Figure C-10 shows various signals during PWM dimming, when PWMD goes high.The LED current reaches its final steady state value without any significant overshoot. FIGURE C-10: PWM Dimming at VOUT = 54V. COMP Output Voltage LED Current COMP Output Voltage LED Current HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 32  2016 Microchip Technology Inc. FIGURE C-11: PWM Dimming at VOUT = 40V. FIGURE C-12: PWM Dimming at VOUT = 40V. COMP Output Voltage LED Current COMP Output Voltage LED Current Plots and Waveforms  2016 Microchip Technology Inc. DS50002453A-page 33 C.1.4 PWM Dimming with Narrow Pulse Widths Figure C-13 below shows the PWMD dimming input, the GATE drive output and the LED current for a pulse width of 800 ns (which is less than 1 period of the switching frequency waveform). As shown in Figure C-13, the GATE drive does not turn off immediately when the PWMD input goes low. The frequency of the Dimming input is 1 kHz. FIGURE C-13: PWM Dimming with PWMD Pulse Width = 800 ns. Figure C-14 shows the PWMD dimming input, the GATE drive output and the LED current for a pulse width of 2.5 µs (less than one period of fsw). Also, for this case, the LED current reaches it’s required value of 350 mA. Dimming input frequency = 1 kHz. FIGURE C-14: PWM Dimming with PWMD Pulse Width = 2.5 µs. PWM Dimming Input Gate of External MOSFET LED Current PWM Dimming Input Gate of External MOSFET LED Current HV9963 Boost LED Driver Demonstration Board User’s Guide DS50002453A-page 34  2016 Microchip Technology Inc. FIGURE C-15: PWM Dimming with PWMD Pulse Width = 5 µs; Dimming Frequency = 1 kHz. FIGURE C-16: PWM Dimming with PWMD Pulse Width = 30 µs; Dimming Frequency = 1 kHz. PWM Dimming Input Gate of External MOSFET LED Current PWM Dimming Input Gate of External MOSFET LED Current Plots and Waveforms  2016 Microchip Technology Inc. DS50002453A-page 35 FIGURE C-17: PWM Dimming with PWMD Pulse Width = 35 µs; Dimming Frequency = 200 Hz. PWM Dimming Input Gate of External MOSFET LED Current DS50002453A-page 36  2016 Microchip Technology Inc. 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DS21942E-page 1 MCP9700/9700A MCP9701/9701A Features • Tiny Analog Temperature Sensor • Available Packages: - SC70-5, SOT-23-5, TO-92-3 • Wide Temperature Measurement Range: - -40°C to +125°C (Extended Temperature) - -40°C to +150°C (High Temperature) (MCP9700/9700A) • Accuracy: - ±2°C (max.), 0°C to +70°C (MCP9700A/9701A) - ±4°C (max.), 0°C to +70°C (MCP9700/9701) • Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/°C (typical) MCP9700/9700A - 19.5 mV/°C (typical) MCP9701/9701A • Wide Operating Voltage Range: - VDD = 2.3V to 5.5V MCP9700/9700A - VDD = 3.1V to 5.5V MCP9701/9701A • Low Operating Current: 6 µA (typical) • Optimized to Drive Large Capacitive Loads Typical Applications • Hard Disk Drives and Other PC Peripherals • Entertainment Systems • Home Appliance • Office Equipment • Battery Packs and Portable Equipment • General Purpose Temperature Monitoring Description The MCP9700/9700A and MCP9701/9701A family of Linear Active Thermistor™ Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It’s a low-cost, low-power sensor with an accuracy of ±2°C from 0°C to +70°C (MCP9700A/9701A) ±4°C from 0°C to +70°C (MCP9700/9701) while consuming 6 µA (typical) of operating current. Unlike resistive sensors (such as thermistors), the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. The voltage output pin (VOUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A and MCP9701/9701A temperature coefficients are scaled to provide a 1°C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/9700A and MCP9701/9701A provide a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typical) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. Package Type 3-Pin SOT-23 MCP9700/9700A MCP9701/9701A 3-Pin TO-92 1 2 3 VDD VOUT GND Bottom View MCP9700/9701 Only 1 GND VOUT VDD NC 4 1 2 3 5 5-Pin SC70 NC MCP9700/9700A MCP9701/9701A GND VDD VOUT 3 1 2 Low-Power Linear Active Thermistor™ ICs MCP9700/9700A and MCP9701/9701A DS21942E-page 2 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 3 MCP9700/9700A and MCP9701/9701A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD:...................................................................... 6.0V Storage temperature: ........................ -65°C to +150°C Ambient Temp. with Power Applied:.. -40°C to +150°C Output Current ................................................. ±30 mA Junction Temperature (TJ): ................................ 150°C ESD Protection On All Pins (HBM:MM): ....(4 kV:200V) Latch-Up Current at Each Pin: ...................... ±200 mA †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Power Supply Operating Voltage Range VDD VDD 2.3 3.1 — — 5.5 5.5 V V MCP9700/9700A MCP9701/9701A Operating Current IDD — 6 12 µA Power Supply Rejection Δ°C/ΔVDD — 0.1 — °C/V Sensor Accuracy (Notes 1, 2) TA = +25°C TACY — ±1 — °C TA = 0°C to +70°C TACY -2.0 ±1 +2.0 °C MCP9700A/9701A TA = -40°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9700A TA = -10°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9701A TA = 0°C to +70°C TACY -4.0 ±2 +4.0 °C MCP9700/9701 TA = -40°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9700 TA = -10°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9701 TA = -40°C to +150°C TACY -4.0 ±2 +6.0 °C High Temperature, MCP9700 only Sensor Output Output Voltage, TA = 0°C V0°C — 500 — mV MCP9700/9700A Output Voltage, TA = 0°C V0°C — 400 — mV MCP9701/9701A Temperature Coefficient TC — 10.0 — mV/°C MCP9700/9700A TC — 19.5 — mV/°C MCP9701/9701A Output Non-linearity VONL — ±0.5 — °C TA = 0°C to +70°C (Note 2) Output Current IOUT — — 100 µA Output Impedance ZOUT — 20 — Ω IOUT = 100 µA, f = 500 Hz Output Load Regulation ΔVOUT/ ΔIOUT —1— Ω TA = 0°C to +70°C, IOUT = 100 µA Turn-on Time tON — 800 — µs Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. 2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. 3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). MCP9700/9700A and MCP9701/9701A DS21942E-page 4 © 2009 Microchip Technology Inc. M Typical Load Capacitance CLOAD — — 1000 pF The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. SC-70 Thermal Response to 63% tRES — 1.3 — s 30°C (Air) to +125°C (Fluid Bath) (Note 3) TO-92 Thermal Response to 63% tRES — 1.65 — s DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. 2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. 3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (Note 1) TA -40 — +125 °C MCP9700/9700A TA -10 — +125 °C MCP9701/9701A TA -40 — +150 °C High Temperature, MCP9700 only Operating Temperature Range TA -40 — +125 °C Extended Temperature TA -40 — +150 °C High Temperature Storage Temperature Range TA -65 — +150 °C Thermal Package Resistances Thermal Resistance, 5LD SC70 θJA — 331 — °C/W Thermal Resistance, 3LD SOT-23 θJA — 308 — °C/W Thermal Resistance, 3LD TO-92 θJA — 146 — °C/W Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). © 2009 Microchip Technology Inc. DS21942E-page 5 MCP9700/9700A and MCP9701/9701A 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700A/9701A). FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. FIGURE 2-3: Supply Current vs. Temperature. FIGURE 2-4: Accuracy vs. Ambient Temperature (MCP9700/9701). FIGURE 2-5: Changes in Accuracy vs. Ambient Temperature (Due to Load). FIGURE 2-6: Load Regulation vs. Ambient Temperature. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9700A VDD= 3.3V MCP9701A VDD= 5.0V Spec. Limits -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9701/ MCP9701A VDD= 5.5V VDD= 3.1V MCP9700 MCP9700A VDD = 5.5V VDD = 2.3V 0.0 2.0 4.0 6.0 8.0 10.0 12.0 -50 -25 0 25 50 75 100 125 150 TA (°C) IDD (µA) MCP9700/MCP9700A MCP9701 MCP9701A -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9700 VDD= 3.3V MCP9701 VDD= 5.0V Spec. Limits -0.2 -0.1 0 0.1 0.2 -50 -25 0 25 50 75 100 125 150 TA (°C) Δ Accuracy Due to Load (°C) MCP9701/MCP9701A VDD = 5.0V ILOAD = 100 µA MCP9700/MCP9700A VDD = 3.3V 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 TA (°C) Load Regulation ΔV/ ΔI ( Ω) MCP9700/MCP9700A MCP9701/MCP9701A VDD = 3.3V IOUT = 50 µA IOUT = 100 µA IOUT = 200 µA MCP9700/9700A and MCP9701/9701A DS21942E-page 6 © 2009 Microchip Technology Inc. Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-7: Output Voltage at 0°C (MCP9700/9700A). FIGURE 2-8: Occurrences vs. Temperature Coefficient (MCP9700/9700A). FIGURE 2-9: Power Supply Rejection (Δ°C/ΔVDD) vs. Ambient Temperature. FIGURE 2-10: Output Voltage at 0°C (MCP9701/9701A). FIGURE 2-11: Occurrences vs. Temperature Coefficient (MCP9701/9701A). FIGURE 2-12: Power Supply Rejection (Δ°C/ΔVDD) vs. Temperature. 0% 5% 10% 15% 20% 25% 30% 35% 400 420 440 460 480 500 520 540 560 580 600 V0°C (mV) Occurrences VDD = 3.3V 108 samples MCP9700A MCP9700 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 9.7 9.8 9.8 9.9 10.0 10.1 10.2 10.2 10.3 10.4 10.5 TC (mV/°C) Occurrences MCP9700 MCP9700A VDD = 3.3V 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 150 TA (°C) Normalized PSRR (°C/V) MCP9700/MCP9700A VDD= 2.3V to 5.5V MCP9700/MCP9700A VDD= 2.3V to 4.0V 0% 5% 10% 15% 20% 25% 30% 35% 300 320 340 360 380 400 420 440 460 480 500 V0°C (mV) Occurrences MCP9701 VDD = 5.0V 108 samples MCP9701A MCP9701 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 19.2 19.3 19.3 19.4 19.5 19.6 19.7 19.7 19.8 19.9 20.0 TC (mV/°C) Occurrences MCP9701 MCP9701A VDD = 5.0V 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 TA (°C) Normalized PSRR (°C/V) MCP9701/MCP9701A VDD= 3.1V to 5.5V MCP9701/MCP9701A VDD= 3.1V to 4.0V MCP9701/MCP9701A VDD= 3.1V to 5.5V MCP9701/MCP9701A VDD= 3.1V to 4.0V © 2009 Microchip Technology Inc. DS21942E-page 7 MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-13: Output Voltage vs. Power Supply. FIGURE 2-14: Output vs. Settling Time to step VDD. FIGURE 2-15: Thermal Response (Air to Fluid Bath). FIGURE 2-16: Output Voltage vs. Ambient Temperature. FIGURE 2-17: Output vs. Settling Time to Ramp VDD. FIGURE 2-18: Output Impedance vs. Frequency. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VOUT (V) TA = +26°C 0 2 4 6 8 10 12 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) VOUT (V) -2.5 -1.7 -0.8 0.0 0.8 1.7 2.5 IDD (mA) VDD_STEP = 5V TA = 26°C IDD VOUT 30 55 80 105 130 -2 0 2 4 6 8 10 12 14 16 18 Time (s) TA (°C) SC70-5 1 in. x 1 in. Copper Clad PCB Leaded, without PCB SC70-5 SOT-23-3 TO-92-3 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 TA (°C) VOUT (V) MCP9700 MCP9700A MCP9701 MCP9701A 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) VOUT (V) -42.0 -30.0 -18.0 -6.0 6.0 18.0 30.0 IDD (µA) IDD VOUT VDD_RAMP = 5V/ms TA = +26°C 1 10 100 1000 0.1 1 10 100 1000 10000 100000 Frequency (Hz) Output Impedance ( Ω) VDD = 5.0V IOUT = 100 µA TA = +26°C 0. 1 10 100 1k 10k 100k MCP9700/9700A and MCP9701/9701A DS21942E-page 8 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 9 MCP9700/9700A and MCP9701/9701A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Power Ground Pin (GND) GND is the system ground pin. 3.2 Output Voltage Pin (VOUT) The sensor output can be measured at VOUT. The voltage range over the operating temperature range for the MCP9700/9700A is 100 mV to 1.75V and for the MCP9701/9701A, 200 mV to 3V . 3.3 Power Supply Input (VDD) The operating voltage as specified in the “DC Electrical Characteristics” table is applied to VDD. 3.4 No Connect Pin (NC) This pin is not connected to the die. It can be used to improve thermal conduction to the package by connecting it to a Printed Circuit Board (PCB) trace from the thermal source. Pin No. SC70 Pin No. SOT-23 Pin No. TO-92 Symbol Function 1 — — NC No Connect (this pin is not connected to the die). 2 3 3 GND Power Ground Pin 3 2 2VOUT Output Voltage Pin 4 1 1VDD Power Supply Input 5 — — NC No Connect (this pin is not connected to the die). MCP9700/9700A and MCP9701/9701A DS21942E-page 10 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 11 MCP9700/9700A and MCP9701/9701A 4.0 APPLICATIONS INFORMATION The Linear Active Thermistor™ IC uses an internal diode to measure temperature. The diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 150°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typical) for the MCP9700/9700A and 19.5 mV/°C (typical) for the MCP9701/9701A. The output voltage at 0°C is also scaled to 500 mV (typical) and 400 mV (typical) for the MCP9700/9700A and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1 and Figure 2-16. EQUATION 4-1: SENSOR TRANSFER FUNCTION FIGURE 4-1: Typical Application Circuit. 4.1 Improving Accuracy The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typical) from 0°C to +70°C, as shown in Figure 4-2. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. FIGURE 4-2: Relative Accuracy to +25°C vs. Temperature. The change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output non-linearity. For higher accuracy using a sensor compensation technique, refer to AN1001 “IC Temperature Sensor Accuracy Compensation with a PICmicro® Microcontroller” (DS01001). The application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to ±0.5°C (typical) accuracy over the operating temperature (Figure 4-3). FIGURE 4-3: MCP9700/9700A Calibrated Sensor Accuracy. The compensation technique provides a linear temperature reading. A firmware look-up table can be generated to compensate for the sensor error. VOUT TC TA V0°C = • + Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C (See DC Electrical Characteristics table) TC = Temperature Coefficient (See DC Electrical Characteristics table) VDD VSS GND ANI VDD VSS VOUT MCP9700 PICmicro® MCU -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 TA (°C) Accuracy (°C) VDD= 3.3V 10 Samples -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 Temperature (°C) Accuracy (°C) + s Average - s Spec. Limits 100 Samples MCP9700/9700A and MCP9701/9701A DS21942E-page 12 © 2009 Microchip Technology Inc. 4.2 Shutdown Using Microcontroller I/O Pin The MCP9700/9700A and MCP9701/9701A family of low operating current of 6 µA (typical) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/ Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/9700A and MCP9701/9701A as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 Layout Considerations The MCP9700/9700A and MCP9701/9701A family does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200Ω resistor with a 1 µF decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. 4.4 Thermal Considerations The MCP9700/9700A and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, consider using the TO-92 package. The MCP9700/9700A and MCP9701/9701A is designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2. EQUATION 4-2: EFFECT OF SELFHEATING At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ – TA) is 0.179°C. TJ TA – θJA VDDIDD VDD VOUT + ( ) – IOUT = ( ) Where: TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage © 2009 Microchip Technology Inc. DS21942E-page 13 MCP9700/9700A and MCP9701/9701A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SC70 Example: XXNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 Device Code MCP9700T AUNN MCP9700AT AXNN MCP9701T AVNN MCP9701AT AYNN Note: Applies to 5-Lead SC70. AU25 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP 9700E TO^^ 916256 e3 3-Lead SOT-23 Example: XXNN Device Code MCP9700T AENN MCP9700AT AFNN MCP9701T AMNN MCP9701AT APNN Note: Applies to 3-Lead SOT-23 AE25 MCP9700/9700A and MCP9701/9701A DS21942E-page 14 © 2009 Microchip Technology Inc.              !"!  #$! !% # $    !% # $    #&!  !    !#    "'( )*+ )     #&#,$ --# $##      . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / 3# 44""   4# 5 56 7 5$8 %1 5 ( 1#  9()* 6, : #  ; <   !!1/ /  ; <  #! %%   <  6, =!# " ;    !!1/=!# " ( ( ( 6, 4#  ;  ( . #4# 4   9 4! /  ; < 9 4!=!# 8 ( <  D b 3 2 1 E1 E 4 5 e e c L A1 A A2         - *9) © 2009 Microchip Technology Inc. DS21942E-page 15 MCP9700/9700A and MCP9701/9701A   . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / MCP9700/9700A and MCP9701/9701A DS21942E-page 16 © 2009 Microchip Technology Inc.      !         !"!  #$! !% # $    !% # $    #&!(  !    !#    "'( )*+ )     #&#,$ --# $##      . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / 3# 44""   4# 5 56 7 5$8 %1 5  4!1#  ()* 6$# !4!1#  )* 6, : #  ; <   !!1/ /   (  #! %%   <  6, =!# "  < 9  !!1/=!# " 9   6, 4#  9  ( . #4# 4  ( 9 . # > < > 4! /  ; <  4!=!# 8  < ( b N E E1 1 2 e e1 D A A1 A2 c L φ         - *) © 2009 Microchip Technology Inc. DS21942E-page 17 MCP9700/9700A and MCP9701/9701A     "!        !"!  #$! !% # $    !% # $    #&!(?  !    !#    "'( )*+ )     #&#,$ --# $##      . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / 3# 5*:"   4# 5 7 5$8 %1 5  1#  ()* ) ## # 1/.#  ( 9( 6, =!# " ( ( 6, 4#     !!1/!$  ; (  # #1 4 ( < 4! /    4!=!# 8   E A 1 N L b e c R D 1 2 3         - *) MCP9700/9700A and MCP9701/9701A DS21942E-page 18 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 19 MCP9700/9700A and MCP9701/9701A APPENDIX A: REVISION HISTORY Revision E (April 2009) The following is the list of modifications: 1. Added High Temperature option throughout document. 2. Updated plots to reflect the high temperature performance. 3. Updated Package Outline drawings. 4. Updated Revision history. Revision D (October 2007) The following is the list of modifications: 1. Added the 3-lead SOT-23 devices to data sheet. 2. Replaced Figure 2-15. 3. Updated Package Outline Drawings. Revision C (June 2006) The following is the list of modifications: 1. Added the MCP9700A and MCP9701A devices to data sheet. 2. Added TO92 package for the MCP9700/ MCP9701. Revision B (October 2005) The following is the list of modifications: 1. Added Section 3.0 “Pin Descriptions”. 2. Added the Linear Active Thermistor™ IC trademark. 3. Removed the 2nd order temperature equation and the temperature coeficient histogram. 4. Added a reference to AN1001 and corresponding verbiage. 5. Added Figure 4-2 and corresponding verbiage. Revision A (November 2005) • Original Release of this Document. MCP9700/9700A and MCP9701/9701A DS21942E-page 20 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 21 MCP9700/9700A and MCP9701/9701A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP9700T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9700AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free Temperature Range: E = -40°C to +125°C H = -40°C to +150°C (MCP9700 only) Package: LT = Plastic Small Outline Transistor, 5-lead TO = Plastic Small Outline Transistor, 3-lead TT = Plastic Small Outline Transistor, 3-lead PART NO. X /XX Temperature Package Range Device Examples: a) MCP9700T-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9700-E/TO: Linear Active Thermistor™ IC, 3LD TO-92 package. c) MCP9700T-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. d) MCP9700T-H/LT: Linear Active Thermistor™ IC, Tape and Reel, High Temperature, 5LD SC70 package. a) MCP9700AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9700AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. a) MCP9701T-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9701-E/TO: Linear Active Thermistor™ IC, 3LD TO-92 package. c) MCP9701T-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. a) MCP9701AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9701AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. – MCP9700/9700A and MCP9701/9701A DS21942E-page 22 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21942E-page 24 © 2009 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 WORLDWIDE SALES AND SERVICE 03/26/09  2010 Microchip Technology Inc. DS40039F PIC16F630/676 Data Sheet 14-Pin, Flash-Based 8-Bit CMOS Microcontrollers DS40039F-page 2  2010 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-173-4 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2010 Microchip Technology Inc. DS40039F-page 3 PIC16F630/676 High-Performance RISC CPU: • Only 35 Instructions to Learn - All single-cycle instructions except branches • Operating Speed: - DC – 20 MHz oscillator/clock input - DC – 200 ns instruction cycle • Interrupt Capability • 8-level Deep Hardware Stack • Direct, Indirect, and Relative Addressing modes Special Microcontroller Features: • Internal and External Oscillator Options - Precision Internal 4 MHz oscillator factory calibrated to ±1% - External Oscillator support for crystals and resonators - 5 s wake-up from Sleep, 3.0V, typical • Power-Saving Sleep mode • Wide Operating Voltage Range – 2.0V to 5.5V • Industrial and Extended Temperature Range • Low-Power Power-on Reset (POR) • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Brown-out Detect (BOD) • Watchdog Timer (WDT) with Independent Oscillator for Reliable Operation • Multiplexed MCLR/Input-pin • Interrupt-on-Pin Change • Individual Programmable Weak Pull-ups • Programmable Code Protection • High Endurance Flash/EEPROM Cell - 100,000 write Flash endurance - 1,000,000 write EEPROM endurance - Flash/data EEPROM retention: > 40 years Low-Power Features: • Standby Current: - 1 nA @ 2.0V, typical • Operating Current: - 8.5 A @ 32 kHz, 2.0V, typical - 100 A @ 1 MHz, 2.0V, typical • Watchdog Timer Current - 300 nA @ 2.0V, typical • Timer1 Oscillator Current: - 4 A @ 32 kHz, 2.0V, typical Peripheral Features: • 12 I/O Pins with Individual Direction Control • High Current Sink/Source for Direct LED Drive • Analog Comparator module with: - One analog comparator - Programmable on-chip comparator voltage reference (CVREF) module - Programmable input multiplexing from device inputs - Comparator output is externally accessible • Analog-to-Digital Converter module (PIC16F676): - 10-bit resolution - Programmable 8-channel input - Voltage reference input • Timer0: 8-bit Timer/Counter with 8-bit Programmable Prescaler • Enhanced Timer1: - 16-bit timer/counter with prescaler - External Gate Input mode - Option to use OSC1 and OSC2 in LP mode as Timer1 oscillator, if INTOSC mode selected • In-Circuit Serial ProgrammingTM (ICSPTM) via two pins Device Program Memory Data Memory I/O 10-bit A/D (ch) Comparators Timers Flash 8/16-bit (words) SRAM (bytes) EEPROM (bytes) PIC16F630 1024 64 128 12 – 1 1/1 PIC16F676 1024 64 128 12 8 1 1/1 14-Pin, Flash-Based 8-Bit CMOS Microcontroller PIC16F630/676 DS40039F-page 4  2010 Microchip Technology Inc. Pin Diagrams 14-pin PDIP, SOIC, TSSOP VDD RA5/T1CKI/OSC1/CLKIN RA4/T1G/OSC2/AN3/CLKOUT RA3/MCLR/VPP RC5 RC4 RC3/AN7 VSS RA0/AN0/CIN+/ICSPDAT RA1/AN1/CIN-/VREF/ICSPCLK RA2/AN2/COUT/T0CKI/INT RC0/AN4 RC1/AN5 RC2/AN6 PIC16F676 1 2 3 4 5 6 7 14 13 12 9 11 10 8 VDD RA5/T1CKI/OSC1/CLKIN RA4/T1G/OSC2/CLKOUT RA3/MCLR/VPP RC5 RC4 RC3 VSS RA0/CIN+/ICSPDAT RA1/CIN-/ICSPCLK RA2/COUT/T0CKI/INT RC0 RC1 RC2 PIC16F630 1 2 3 4 5 6 7 14 13 12 9 11 10 8  2010 Microchip Technology Inc. DS40039F-page 5 PIC16F630/676 Table of Contents 1.0 Device Overview ......................................................................................................................................................................... 7 2.0 Memory Organization .................................................................................................................................................................. 9 3.0 Ports A and C ............................................................................................................................................................................ 21 4.0 Timer0 Module .......................................................................................................................................................................... 31 5.0 Timer1 Module with Gate Control ............................................................................................................................................. 34 6.0 Comparator Module .................................................................................................................................................................. 39 7.0 Analog-to-Digital Converter (A/D) Module (PIC16F676 only) ................................................................................................... 45 8.0 Data EEPROM Memory............................................................................................................................................................ 51 9.0 Special Features of the CPU .................................................................................................................................................... 55 10.0 Instruction Set Summary ........................................................................................................................................................... 73 11.0 Development Support ............................................................................................................................................................... 81 12.0 Electrical Specifications ............................................................................................................................................................ 85 13.0 DC and AC Characteristics Graphs and Tables ..................................................................................................................... 107 14.0 Packaging Information ............................................................................................................................................................ 117 Appendix A: Data Sheet Revision History ......................................................................................................................................... 123 Appendix B: Device Differences ....................................................................................................................................................... 123 Appendix C: Device Migrations ......................................................................................................................................................... 124 Appendix D: Migrating from other PIC® Devices .............................................................................................................................. 124 Index ................................................................................................................................................................................................. 125 On-Line Support ................................................................................................................................................................................ 129 Systems Information and Upgrade Hot Line ..................................................................................................................................... 129 Reader Response ............................................................................................................................................................................. 130 Product Identification System ........................................................................................................................................................... 131 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. PIC16F630/676 DS40039F-page 6  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS40039F-page 7 PIC16F630/676 1.0 DEVICE OVERVIEW This document contains device specific information for the PIC16F630/676. Additional information may be found in the PIC® Mid-Range Reference Manual (DS33023), which may be obtained from your local Microchip Sales Representative or downloaded from the Microchip web site. The Reference Manual should be considered a complementary document to this Data Sheet and is highly recommended reading for a better understanding of the device architecture and operation of the peripheral modules. The PIC16F630 and PIC16F676 devices are covered by this Data Sheet. They are identical, except the PIC16F676 has a 10-bit A/D converter. They come in 14-pin PDIP, SOIC and TSSOP packages. Figure 1-1 shows a block diagram of the PIC16F630/676 devices. Table 1-1 shows the pinout description. FIGURE 1-1: PIC16F630/676 BLOCK DIAGRAM Flash Program Memory 13 Data Bus 8 14 Program Bus Instruction Reg Program Counter RAM File Registers Direct Addr 7 RAM Addr 9 Addr MUX Indirect Addr FSR Reg STATUS Reg MUX ALU W Reg Instruction Decode and Control Timing Generation OSC1/CLKIN OSC2/CLKOUT PORTA 8 8 8 3 8-Level Stack 64 1K x 14 bytes (13-bit) Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer MCLR VSS Brown-out Detect Analog Timer0 Timer1 DATA EEPROM 128 bytes EEDATA EEADDR RA0 RA1 RA2 RA3 RA4 RA5 Analog to Digital Converter Comparator (PIC16F676 only) AN0 AN1AN2 AN3 CIN- CIN+ COUT T0CKI INT T1CKI Configuration Internal Oscillator VREF and reference T1G PORTC RC0 RC1 RC2 RC3 RC4 RC5 AN4 AN5 AN6AN7 VDD 8 PIC16F630/676 DS40039F-page 8  2010 Microchip Technology Inc. TABLE 1-1: PIC16F630/676 PINOUT DESCRIPTION Name Function Input Type Output Type Description RA0/AN0/CIN+/ICSPDAT RA0 TTL CMOS Bidirectional I/O w/ programmable pull-up and interrupt-on-change. AN0 AN — A/D Channel 0 input. CIN+ AN Comparator input. ICSPDAT TTL CMOS Serial Programming Data I/O. RA1/AN1/CIN-/VREF/ ICSPCLK RA1 TTL CMOS Bidirectional I/O w/ programmable pull-up and interrupt-on-change. AN1 AN — A/D Channel 1 input. CIN- AN — Comparator input. VREF AN — External Voltage reference. ICSPCLK ST — Serial Programming Clock. RA2/AN2/COUT/T0CKI/INT RA2 ST CMOS Bidirectional I/O w/ programmable pull-up and interrupt-on-change. AN2 AN — A/D Channel 2 input. COUT — CMOS Comparator output. T0CKI ST — Timer0 clock input. INT ST — External Interrupt. RA3/MCLR/VPP RA3 TTL — Input port with interrupt-on-change. MCLR ST — Master Clear. VPP HV — Programming voltage. RA4/T1G/AN3/OSC2/ CLKOUT RA4 TTL CMOS Bidirectional I/O w/ programmable pull-up and interrupt-on-change. T1G ST — Timer1 gate. AN3 AN3 — A/D Channel 3 input. OSC2 — XTAL Crystal/Resonator. CLKOUT — CMOS FOSC/4 output. RA5/T1CKI/OSC1/CLKIN RA5 TTL CMOS Bidirectional I/O w/ programmable pull-up and interrupt-on-change. T1CKI ST — Timer1 clock. OSC1 XTAL — Crystal/Resonator. CLKIN ST — External clock input/RC oscillator connection. RC0/AN4 RC0 TTL CMOS Bidirectional I/O. AN4 AN4 — A/D Channel 4 input. RC1/AN5 RC1 TTL CMOS Bidirectional I/O. AN5 AN5 — A/D Channel 5 input. RC2/AN6 RC2 TTL CMOS Bidirectional I/O. AN6 AN6 — A/D Channel 6 input. RC3/AN7 RC3 TTL CMOS Bidirectional I/O. AN7 AN7 — A/D Channel 7 input. RC4 RC4 TTL CMOS Bidirectional I/O. RC5 RC5 TTL CMOS Bidirectional I/O. VSS VSS Power — Ground reference. VDD VDD Power — Positive supply. Legend: Shade = PIC16F676 only TTL = TTL input buffer ST = Schmitt Trigger input buffer  2010 Microchip Technology Inc. DS40039F-page 9 PIC16F630/676 2.0 MEMORY ORGANIZATION 2.1 Program Memory Organization The PIC16F630/676 devices have a 13-bit program counter capable of addressing an 8K x 14 program memory space. Only the first 1K x 14 (0000h-03FFh) for the PIC16F630/676 devices is physically implemented. Accessing a location above these boundaries will cause a wrap around within the first 1K x 14 space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 2-1). FIGURE 2-1: PROGRAM MEMORY MAP AND STACK FOR THE PIC16F630/676 2.2 Data Memory Organization The data memory (see Figure 2-2) is partitioned into two banks, which contain the General Purpose Registers and the Special Function Registers. The Special Function Registers are located in the first 32 locations of each bank. Register locations 20h-5Fh are General Purpose Registers, implemented as static RAM and are mapped across both banks. All other RAM is unimplemented and returns ‘0’ when read. RP0 (STATUS<5>) is the bank select bit. • RP0 = 0 Bank 0 is selected • RP0 = 1 Bank 1 is selected 2.2.1 GENERAL PURPOSE REGISTER FILE The register file is organized as 64 x 8 in the PIC16F630/676 devices. Each register is accessed, either directly or indirectly, through the File Select Register FSR (see Section 2.4 “Indirect Addressing, INDF and FSR Registers”). PC<12:0> 13 000h 0004 0005 03FFh 0400h 1FFFh Stack Level 1 Stack Level 8 Reset Vector Interrupt Vector On-chip Program Memory CALL, RETURN RETFIE, RETLW Stack Level 2 Note: The IRP and RP1 bits STATUS<7:6> are reserved and should always be maintained as ‘0’s. PIC16F630/676 DS40039F-page 10  2010 Microchip Technology Inc. 2.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Table 2-1). These registers are static RAM. The special registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the “core” are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature. FIGURE 2-2: DATA MEMORY MAP OF THE PIC16F630/676 Indirect addr.(1) TMR0 PCL STATUS FSR PORTA PCLATH INTCON PIR1 TMR1L TMR1H T1CON 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h 7Fh Bank 0 Unimplemented data memory locations, read as ‘0’. 1: Not a physical register. 2: PIC16F676 only. CMCON VRCON General Purpose Registers accesses 20h-5Fh 64 Bytes EEDAT EEADR EECON2(1) 5Fh 60h File Address File Address WPUA IOCA Indirect addr.(1) OPTION_REG PCL STATUS FSR TRISA PCLATH INTCON PIE1 PCON OSCCAL 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h FFh Bank 1 DFh E0h ADRESH(2) ADCON0(2) EECON1 ADRESL(2) ADCON1(2) ANSEL(2) PORTC TRISC  2010 Microchip Technology Inc. DS40039F-page 11 PIC16F630/676 TABLE 2-1: PIC16F630/676 SPECIAL REGISTERS SUMMARY BANK 0 Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Page Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 20,63 01h TMR0 Timer0 Module’s Register xxxx xxxx 31 02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 19 03h STATUS IRP(2) RP1(2) RP0 TO PD Z DC C 0001 1xxx 13 04h FSR Indirect data memory Address Pointer xxxx xxxx 20 05h PORTA — — I/O Control Registers --xx xxxx 21 06h — Unimplemented — — 07h PORTC — — I/O Control Registers --xx xxxx 28 08h — Unimplemented — — 09h — Unimplemented — — 0Ah PCLATH — — — Write buffer for upper 5 bits of program counter ---0 0000 19 0Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 15 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 17 0Dh — Unimplemented — — 0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 xxxx xxxx 34 0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 xxxx xxxx 34 10h T1CON — T1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON -000 0000 36 11h — Unimplemented — — 12h — Unimplemented — — 13h — Unimplemented — — 14h — Unimplemented — — 15h — Unimplemented — — 16h — Unimplemented — — 17h — Unimplemented — — 18h — Unimplemented — — 19h CMCON — COUT — CINV CIS CM2 CM1 CM0 -0-0 0000 39 1Ah — Unimplemented — — 1Bh — Unimplemented — — 1Ch — Unimplemented — — 1Dh — Unimplemented — — 1Eh ADRESH(3) Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result xxxx xxxx 46 1Fh ADCON0(3) ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 47,63 Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented Note 1: Other (non Power-up) Resets include MCLR Reset, Brown-out Detect and Watchdog Timer Reset during normal operation. 2: IRP and RP1 bits are reserved, always maintain these bits clear. 3: PIC16F676 only. PIC16F630/676 DS40039F-page 12  2010 Microchip Technology Inc. TABLE 2-2: PIC16F630/676 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1 Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Page Bank 1 80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 20,63 81h OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 14,32 82h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 19 83h STATUS IRP(2) RP1(2) RP0 TO PD Z DC C 0001 1xxx 13 84h FSR Indirect data memory Address Pointer xxxx xxxx 20 85h TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 --11 1111 21 86h — Unimplemented — — 87h TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 --11 1111 — 88h — Unimplemented — — 89h — Unimplemented — — 8Ah PCLATH — — — Write buffer for upper 5 bits of program counter ---0 0000 19 8Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 15 8Ch PIE1 EEIE ADIE — — CMIE — — TMR1IE 00-- 0--0 16 8Dh — Unimplemented — — 8Eh PCON — — — — — — POR BOD ---- --qq 18 8Fh — — 90h OSCCAL CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — — 1000 00-- 18 91h ANSEL(3) ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 48 92h — Unimplemented — — 93h — Unimplemented — — 94h — Unimplemented — — 95h WPUA — — WPUA5 WPUA4 — WPUA2 WPUA1 WPUA0 --11 -111 22 96h IOCA — — IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 --00 0000 23 97h — Unimplemented — — 98h — Unimplemented — — 99h VRCON VREN — VRR — VR3 VR2 VR1 VR0 0-0- 0000 44 9Ah EEDAT EEPROM data register 0000 0000 51 9Bh EEADR — EEPROM address register 0000 0000 51 9Ch EECON1 — — — — WRERR WREN WR RD ---- x000 52 9Dh EECON2 EEPROM control register 2 (not a physical register) ---- ---- 51 9Eh ADRESL(3) Least Significant 2 bits of the left shifted result or 8 bits of the right shifted result xxxx xxxx 46 9Fh ADCON1(3) — ADCS2 ADCS1 ADCS0 — — — — -000 ---- 47,63 Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: Other (non Power-up) Resets include MCLR Reset, Brown-out Detect and Watchdog Timer Reset during normal operation. 2: IRP and RP1 bits are reserved, always maintain these bits clear. 3: PIC16F676 only.  2010 Microchip Technology Inc. DS40039F-page 13 PIC16F630/676 2.2.2.1 STATUS Register The STATUS register, shown in Register 2-1, contains: • the arithmetic status of the ALU • the Reset status • the bank select bits for data memory (SRAM) The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits, see Section 10.0 “Instruction Set Summary”. REGISTER 2-1: STATUS — STATUS REGISTER (ADDRESS: 03h OR 83h) Note 1: Bits IRP and RP1 (STATUS<7:6>) are not used by the PIC16F630/676 and should be maintained as clear. Use of these bits is not recommended, since this may affect upward compatibility with future products. 2: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x IRP RP1 RP0 TO PD Z DC C bit 7 bit 0 bit 7 IRP: This bit is reserved and should be maintained as ‘0’ bit 6 RP1: This bit is reserved and should be maintained as ‘0’ bit 5 RP0: Register Bank Select bit (used for direct addressing) 1 = Bank 1 (80h-FFh) 0 = Bank 0 (00h-7Fh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) For borrow, the polarity is reversed. 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result bit 0 C: Carry/borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note: For borrow the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F630/676 DS40039F-page 14  2010 Microchip Technology Inc. 2.2.2.2 OPTION Register The OPTION register is a readable and writable register, which contains various control bits to configure: • TMR0/WDT prescaler • External RA2/INT interrupt • TMR0 • Weak pull-ups on PORTA REGISTER 2-2: OPTION_REG — OPTION REGISTER (ADDRESS: 81h) Note: To achieve a 1:1 prescaler assignment for TMR0, assign the prescaler to the WDT by setting PSA bit to ‘1’ (OPTION<3>). See Section 4.4 “Prescaler”. R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 RAPU: PORTA Pull-up Enable bit 1 = PORTA pull-ups are disabled 0 = PORTA pull-ups are enabled by individual PORT latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of RA2/INT pin 0 = Interrupt on falling edge of RA2/INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on RA2/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on RA2/T0CKI pin 0 = Increment on low-to-high transition on RA2/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS2:PS0: Prescaler Rate Select bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 Bit Value TMR0 Rate WDT Rate  2010 Microchip Technology Inc. DS40039F-page 15 PIC16F630/676 2.2.2.3 INTCON Register The INTCON register is a readable and writable register, which contains the various enable and flag bits for TMR0 register overflow, PORTA change and external RA2/INT pin interrupts. REGISTER 2-3: INTCON — INTERRUPT CONTROL REGISTER (ADDRESS: 0Bh OR 8Bh) Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GIE PEIE T0IE INTE RAIE T0IF INTF RAIF bit 7 bit 0 bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: RA2/INT External Interrupt Enable bit 1 = Enables the RA2/INT external interrupt 0 = Disables the RA2/INT external interrupt bit 3 RAIE: Port Change Interrupt Enable bit(1) 1 = Enables the PORTA change interrupt 0 = Disables the PORTA change interrupt bit 2 T0IF: TMR0 Overflow Interrupt Flag bit(2) 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: RA2/INT External Interrupt Flag bit 1 = The RA2/INT external interrupt occurred (must be cleared in software) 0 = The RA2/INT external interrupt did not occur bit 0 RAIF: Port Change Interrupt Flag bit 1 = When at least one of the PORTA <5:0> pins changed state (must be cleared in software) 0 = None of the PORTA <5:0> pins have changed state Note 1: IOCA register must also be enabled. 2: T0IF bit is set when Timer0 rolls over. Timer0 is unchanged on Reset and should be initialized before clearing T0IF bit. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F630/676 DS40039F-page 16  2010 Microchip Technology Inc. 2.2.2.4 PIE1 Register The PIE1 register contains the interrupt enable bits, as shown in Register 2-4. REGISTER 2-4: PIE1 — PERIPHERAL INTERRUPT ENABLE REGISTER 1 (ADDRESS: 8Ch) Note: Bit PEIE (INTCON<6>) must be set to enable any peripheral interrupt. R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 EEIE ADIE — — CMIE — — TMR1IE bit 7 bit 0 bit 7 EEIE: EE Write Complete Interrupt Enable bit 1 = Enables the EE write complete interrupt 0 = Disables the EE write complete interrupt bit 6 ADIE: A/D Converter Interrupt Enable bit (PIC16F676 only) 1 = Enables the A/D converter interrupt 0 = Disables the A/D converter interrupt bit 5-4 Unimplemented: Read as ‘0’ bit 3 CMIE: Comparator Interrupt Enable bit 1 = Enables the comparator interrupt 0 = Disables the comparator interrupt bit 2-1 Unimplemented: Read as ‘0’ bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2010 Microchip Technology Inc. DS40039F-page 17 PIC16F630/676 2.2.2.5 PIR1 Register The PIR1 register contains the interrupt flag bits, as shown in Register 2-5. REGISTER 2-5: PIR1 — PERIPHERAL INTERRUPT REGISTER 1 (ADDRESS: 0Ch) Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 EEIF ADIF — — CMIF — — TMR1IF bit 7 bit 0 bit 7 EEIF: EEPROM Write Operation Interrupt Flag bit 1 = The write operation completed (must be cleared in software) 0 = The write operation has not completed or has not been started bit 6 ADIF: A/D Converter Interrupt Flag bit (PIC16F676 only) 1 = The A/D conversion is complete (must be cleared in software) 0 = The A/D conversion is not complete bit 5-4 Unimplemented: Read as ‘0’ bit 3 CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed (must be cleared in software) 0 = Comparator input has not changed bit 2-1 Unimplemented: Read as ‘0’ bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F630/676 DS40039F-page 18  2010 Microchip Technology Inc. 2.2.2.6 PCON Register The Power Control (PCON) register contains flag bits to differentiate between a: • Power-on Reset (POR) • Brown-out Detect (BOD) • Watchdog Timer Reset (WDT) • External MCLR Reset The PCON Register bits are shown in Register 2-6. REGISTER 2-6: PCON — POWER CONTROL REGISTER (ADDRESS: 8Eh) 2.2.2.7 OSCCAL Register The Oscillator Calibration register (OSCCAL) is used to calibrate the internal 4 MHz oscillator. It contains 6 bits to adjust the frequency up or down to achieve 4 MHz. The OSCCAL register bits are shown in Register 2-7. REGISTER 2-7: OSCCAL — INTERNAL OSCILLATOR CALIBRATION REGISTER (ADDRESS: 90h) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-x — — — — — — POR BOD bit 7 bit 0 bit 7-2 Unimplemented: Read as ‘0’ bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOD: Brown-out Detect Status bit 1 = No Brown-out Detect occurred 0 = A Brown-out Detect occurred (must be set in software after a Brown-out Detect occurs) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — — bit 7 bit 0 bit 7-2 CAL5:CAL0: 6-bit Signed Oscillator Calibration bits 111111 = Maximum frequency 100000 = Center frequency 000000 = Minimum frequency bit 1-0 Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2010 Microchip Technology Inc. DS40039F-page 19 PIC16F630/676 2.3 PCL and PCLATH The program counter (PC) is 13-bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 2-3 shows the two situations for the loading of the PC. The upper example in Figure 2-3 shows how the PC is loaded on a write to PCL (PCLATH<4:0>  PCH). The lower example in Figure 2-3 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3>  PCH). FIGURE 2-3: LOADING OF PC IN DIFFERENT SITUATIONS 2.3.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to the Application Note “Implementing a Table Read" (AN556). 2.3.2 STACK The PIC16F630/676 family has an 8-level x 13-bit wide hardware stack (see Figure 2-1). The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). PC 12 8 7 0 5 PCLATH<4:0> PCLATH Instruction with ALU Result GOTO, CALL Opcode <10:0> 8 PC 12 11 10 0 PCLATH<4:3> 11 PCH PCL 8 7 2 PCLATH PCH PCL PCL as Destination Note 1: There are no Status bits to indicate Stack Overflow or Stack Underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. PIC16F630/676 DS40039F-page 20  2010 Microchip Technology Inc. 2.4 Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register indirectly results in a no operation (although Status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (STATUS<7>), as shown in Figure 2-4. A simple program to clear RAM location 20h-2Fh using indirect addressing is shown in Example 2-1. EXAMPLE 2-1: INDIRECT ADDRESSING FIGURE 2-4: DIRECT/INDIRECT ADDRESSING PIC16F630/676 MOVLW 0x20 ;initialize pointer MOVWF FSR ;to RAM NEXT CLRF INDF ;clear INDF register INCF FSR ;inc pointer BTFSS FSR,4 ;all done? GOTO NEXT ;no clear next CONTINUE ;yes continue For memory map detail see Figure 2-2. Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear. Data Memory Direct Addressing Indirect Addressing Bank Select Location Select RP1(1) RP0 6 From Opcode 0 IRP(1) 7 FSR Register 0 Bank Select Location Select 00 01 10 11 180h 1FFh 00h 7Fh Bank 0 Bank 1 Bank 2 Bank 3 Not Used  2010 Microchip Technology Inc. DS40039F-page 21 PIC16F630/676 3.0 PORTS A AND C There are as many as twelve general purpose I/O pins available. Depending on which peripherals are enabled, some or all of the pins may not be available as general purpose I/O. In general, when a peripheral is enabled, the associated pin may not be used as a general purpose I/O pin. 3.1 PORTA and the TRISA Registers PORTA is an 6-bit wide, bidirectional port. The corresponding data direction register is TRISA. Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., put the contents of the output latch on the selected pin). The exception is RA3, which is input only and its TRIS bit will always read as ‘1’. Example 3-1 shows how to initialize PORTA. Reading the PORTA register reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch. RA3 reads ‘0’ when MCLREN = 1. The TRISA register controls the direction of the PORTA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. EXAMPLE 3-1: INITIALIZING PORTA 3.2 Additional Pin Functions Every PORTA pin on the PIC16F630/676 has an interrupt-on-change option and every PORTA pin, except RA3, has a weak pull-up option. The next two sections describe these functions. 3.2.1 WEAK PULL-UP Each of the PORTA pins, except RA3, has an individually configurable weak internal pull-up. Control bits WPUAx enable or disable each pull-up. Refer to Register 3-3. Each weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset by the RAPU bit (OPTION<7>). REGISTER 3-1: PORTA — PORTA REGISTER (ADDRESS: 05h) Note: Additional information on I/O ports may be found in the PIC® Mid-Range Reference Manual, (DS33023) Note: The ANSEL (91h) and CMCON (19h) registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. The ANSEL register is defined for the PIC16F676. BCF STATUS,RP0 ;Bank 0 CLRF PORTA ;Init PORTA MOVLW 05h ;Set RA<2:0> to MOVWF CMCON ;digital I/O BSF STATUS,RP0 ;Bank 1 CLRF ANSEL ;digital I/O MOVLW 0Ch ;Set RA<3:2> as inputs MOVWF TRISA ;and set RA<5:4,1:0> ;as outputs BCF STATUS,RP0 ;Bank 0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — RA5 RA4 RA3 RA2 RA1 RA0 bit 7 bit 0 bit 7-6: Unimplemented: Read as ‘0’ bit 5-0: PORTA<5:0>: PORTA I/O pin bits 1 = Port pin is >VIH 0 = Port pin is : PORTA Tri-State Control bits 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output Note: TRISA<3> always reads 1. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 — — WPUA5 WPUA4 — WPUA2 WPUA1 WPUA0 bit 7 bit 0 bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 WPUA<5:4>: Weak Pull-up Register bits 1 = Pull-up enabled 0 = Pull-up disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 WPUA<2:0>: Weak Pull-up Register bits 1 = Pull-up enabled 0 = Pull-up disabled Note 1: Global RAPU must be enabled for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is in Output mode (TRISA = 0). Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: If a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then the RAIF interrupt flag may not get set.  2010 Microchip Technology Inc. DS40039F-page 23 PIC16F630/676 REGISTER 3-4: IOCA — INTERRUPT-ON-CHANGE PORTA REGISTER (ADDRESS: 96h) U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 bit 7 bit 0 bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCA<5:0>: Interrupt-on-Change PORTA Control bits 1 = Interrupt-on-change enabled 0 = Interrupt-on-change disabled Note: Global Interrupt Enable (GIE) must be enabled for individual interrupts to be recognized. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F630/676 DS40039F-page 24  2010 Microchip Technology Inc. 3.2.3 PIN DESCRIPTIONS AND DIAGRAMS Each PORTA pin is multiplexed with other functions. The pins and their combined functions are briefly described here. For specific information about individual functions such as the comparator or the A/D, refer to the appropriate section in this Data Sheet. 3.2.3.1 RA0/AN0/CIN+ Figure 3-1 shows the diagram for this pin. The RA0 pin is configurable to function as one of the following: • a general purpose I/O • an analog input for the A/D (PIC16F676 only) • an analog input to the comparator 3.2.3.2 RA1/AN1/CIN-/VREF Figure 3-1 shows the diagram for this pin. The RA1 pin is configurable to function as one of the following: • as a general purpose I/O • an analog input for the A/D (PIC16F676 only) • an analog input to the comparator • a voltage reference input for the A/D (PIC16F676 only) FIGURE 3-1: BLOCK DIAGRAM OF RA0 AND RA1 PINS I/O pin VDD VSS D Q CK Q D Q CK Q D Q CK Q D Q CK Q VDD D EN Q D EN Q Weak Data Bus WR WPUA RD WPUA RD PORTA RD PORTA WR PORTA WR TRISA RD TRISA WR IOCA RD IOCA Interrupt-on-Change To Comparator To A/D Converter Analog Input Mode RAPU Analog Input Mode  2010 Microchip Technology Inc. DS40039F-page 25 PIC16F630/676 3.2.3.3 RA2/AN2/T0CKI/INT/COUT Figure 3-2 shows the diagram for this pin. The RA2 pin is configurable to function as one of the following: • a general purpose I/O • an analog input for the A/D (PIC16F676 only) • a digital output from the comparator • the clock input for TMR0 • an external edge triggered interrupt FIGURE 3-2: BLOCK DIAGRAM OF RA2 3.2.3.4 RA3/MCLR/VPP Figure 3-3 shows the diagram for this pin. The RA3 pin is configurable to function as one of the following: • a general purpose input • as Master Clear Reset FIGURE 3-3: BLOCK DIAGRAM OF RA3 I/O pin VDD VSS D Q CK Q D Q CK Q D Q CK Q D Q CK Q VDD D EN Q D EN Q Weak Analog Input Mode Data Bus WR WPUA RD WPUA RD PORTA WR PORTA WR TRISA RD TRISA WR IOCA RD IOCA Interrupt-on-Change To A/D Converter 0 COUT 1 COUT Enable To INT To TMR0 Analog Input Mode RAPU RD PORTA Analog Input Mode I/O pin VSS D Q CK Q D EN Q Data Bus RD PORTA RD PORTA WR IOCA RD IOCA Interrupt-on-Change Reset MCLRE RD TRISA VSS D EN Q MCLRE PIC16F630/676 DS40039F-page 26  2010 Microchip Technology Inc. 3.2.3.5 RA4/AN3/T1G/OSC2/CLKOUT Figure 3-4 shows the diagram for this pin. The RA4 pin is configurable to function as one of the following: • a general purpose I/O • an analog input for the A/D (PIC16F676 only) • a TMR1 gate input • a crystal/resonator connection • a clock output FIGURE 3-4: BLOCK DIAGRAM OF RA4 3.2.3.6 RA5/T1CKI/OSC1/CLKIN Figure 3-5 shows the diagram for this pin. The RA5 pin is configurable to function as one of the following: • a general purpose I/O • a TMR1 clock input • a crystal/resonator connection • a clock input FIGURE 3-5: BLOCK DIAGRAM OF RA5 I/O pin VDD VSS D Q CK Q D Q CK Q D Q CK Q D Q CK Q VDD D EN Q D EN Q Weak Analog Input Mode Data Bus WR WPUA RD WPUA RD PORTA WR PORTA WR TRISA RD TRISA WR IOCA RD IOCA Interrupt-on-Change FOSC/4 To A/D Converter Oscillator Circuit OSC1 CLKOUT 0 1 CLKOUT Enable Enable Analog Input Mode RAPU RD PORTA To TMR1 T1G INTOSC/ RC/EC(2) CLK(1) Modes CLKOUT Enable Note 1: CLK modes are XT, HS, LP, LPTMR1 and CLKOUT Enable. 2: With CLKOUT option. I/O pin VDD VSS D Q CK Q D Q CK Q D Q CK Q D Q CK Q VDD D EN Q D EN Q Weak Data Bus WR WPUA RD WPUA RD PORTA WR PORTA WR TRISA RD TRISA WR IOCA RD IOCA Interrupt-on-Change To TMR1 or CLKGEN INTOSC Mode RD PORTA INTOSC Mode RAPU Oscillator Circuit OSC2 (1) Note 1: Timer1 LP Oscillator enabled. 2: When using Timer1 with LP oscillator, the Schmitt Trigger is by-passed. TMR1LPEN(1)  2010 Microchip Technology Inc. DS40039F-page 27 PIC16F630/676 TABLE 3-1: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 05h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --uu uuuu 0Bh/8Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 0000 000u 19h CMCON — COUT — CINV CIS CM2 CM1 CM0 -0-0 0000 -0-0 0000 81h OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 85h TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 --11 1111 --11 1111 91h ANSEL(1) ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111 95h WPUA — — WPUA5 WPUA4 — WPUA2 WPUA1 WPUA0 --11 -111 --11 -111 96h IOCA — — IOCA5 IOCA4 IOCA3 IOCA2 IOCA1 IOCA0 --00 0000 --00 0000 Note 1: PIC16F676 only. Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. PIC16F630/676 DS40039F-page 28  2010 Microchip Technology Inc. 3.3 PORTC PORTC is a general purpose I/O port consisting of 6 bidirectional pins. The pins can be configured for either digital I/O or analog input to A/D converter. For specific information about individual functions such as the comparator or the A/D, refer to the appropriate section in this Data Sheet. EXAMPLE 3-2: INITIALIZING PORTC 3.3.1 RC0/AN4, RC1/AN5, RC2/AN6, RC3/ AN7 The RC0/RC1/RC2/RC3 pins are configurable to function as one of the following: • a general purpose I/O • an analog input for the A/D Converter (PIC16F676 only) FIGURE 3-6: BLOCK DIAGRAM OF RC0/RC1/RC2/RC3 PINs 3.3.2 RC4 AND RC5 The RC4 and RC5 pins are configurable to function as a general purpose I/Os. FIGURE 3-7: BLOCK DIAGRAM OF RC4 AND RC5 PINS Note: The ANSEL register (91h) must be clear to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. The ANSEL register is defined for the PIC16F676. BCF STATUS,RP0 ;Bank 0 CLRF PORTC ;Init PORTC BSF STATUS,RP0 ;Bank 1 CLRF ANSEL ;digital I/O MOVLW 0Ch ;Set RC<3:2> as inputs MOVWF TRISC ;and set RC<5:4,1:0> ;as outputs BCF STATUS,RP0 ;Bank 0 I/O Pin VDD VSS D Q CK Q D Q CK Q Data bus WR PORTC WR TRISC RD TRISC To A/D Converter RD PORTC Analog Input Mode I/O Pin VDD VSS D Q CK Q D Q CK Q Data bus WR PORTC WR TRISC RD TRISC RD PORTC  2010 Microchip Technology Inc. DS40039F-page 29 PIC16F630/676 REGISTER 3-5: PORTC — PORTC REGISTER (ADDRESS: 07h) REGISTER 3-6: TRISC — PORTC TRI-STATE REGISTER (ADDRESS: 87h) TABLE 3-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — RC5 RC4 RC3 RC2 RC1 RC0 bit 7 bit 0 bit 7-6: Unimplemented: Read as ‘0’ bit 5-0: PORTC<5:0>: General Purpose I/O pin bits 1 = Port pin is >VIH 0 = Port pin is : PORTC Tri-State Control bits 1 = PORTC pin configured as an input (tri-stated) 0 = PORTC pin configured as an output Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 07h PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx --uu uuuu 87h TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 --11 1111 --11 1111 91h ANSEL(1) ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111 Note 1: PIC16F676 only. Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTC. PIC16F630/676 DS40039F-page 30  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS40039F-page 31 PIC16F630/676 4.0 TIMER0 MODULE The Timer0 module timer/counter has the following features: • 8-bit timer/counter • Readable and writable • 8-bit software programmable prescaler • Internal or external clock select • Interrupt on overflow from FFh to 00h • Edge select for external clock Figure 4-1 is a block diagram of the Timer0 module and the prescaler shared with the WDT. 4.1 Timer0 Operation Timer mode is selected by clearing the T0CS bit (OPTION_REG<5>). In Timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 is written, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. Counter mode is selected by setting the T0CS bit (OPTION_REG<5>). In this mode, the Timer0 module will increment either on every rising or falling edge of pin RA2/T0CKI. The incrementing edge is determined by the source edge (T0SE) control bit (OPTION_REG<4>). Clearing the T0SE bit selects the rising edge. 4.2 Timer0 Interrupt A Timer0 interrupt is generated when the TMR0 register timer/counter overflows from FFh to 00h. This overflow sets the T0IF bit. The interrupt can be masked by clearing the T0IE bit (INTCON<5>). The T0IF bit (INTCON<2>) must be cleared in software by the Timer0 module Interrupt Service Routine before reenabling this interrupt. The Timer0 interrupt cannot wake the processor from Sleep since the timer is shutoff during Sleep. FIGURE 4-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER Note: Additional information on the Timer0 module is available in the PIC® Mid-Range Reference Manual, (DS33023). Note: Counter mode has specific external clock requirements. Additional information on these requirements is available in the PIC® Mid-Range Reference Manual, (DS33023). T0CKI T0SE pin CLKOUT TMR0 Watchdog Timer WDT Time-out PS0 - PS2 WDTE Data Bus Set Flag bit T0IF on Overflow T0CS Note 1: T0SE, T0CS, PSA, PS0-PS2 are bits in the OPTION register. 0 1 0 1 0 1 SYNC 2 Cycles 8 8 8-bit Prescaler 0 1 (= FOSC/4) PSA PSA PSA PIC16F630/676 DS40039F-page 32  2010 Microchip Technology Inc. 4.3 Using Timer0 with an External Clock When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI, with the internal phase clocks, is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and a small RC delay of 20 ns) and low for at least 2TOSC (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device. REGISTER 4-1: OPTION_REG — OPTION REGISTER (ADDRESS: 81h) Note: The ANSEL (91h) and CMCON (19h) registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. The ANSEL register is defined for the PIC16F676. R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 RAPU: PORTA Pull-up Enable bit 1 = PORTA pull-ups are disabled 0 = PORTA pull-ups are enabled by individual PORT latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of RA2/INT pin 0 = Interrupt on falling edge of RA2/INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on RA2/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on RA2/T0CKI pin 0 = Increment on low-to-high transition on RA2/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS2:PS0: Prescaler Rate Select bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 Bit Value TMR0 Rate WDT Rate  2010 Microchip Technology Inc. DS40039F-page 33 PIC16F630/676 4.4 Prescaler An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer. For simplicity, this counter will be referred to as “prescaler” throughout this Data Sheet. The prescaler assignment is controlled in software by the control bit PSA (OPTION_REG<3>). Clearing the PSA bit will assign the prescaler to Timer0. Prescale values are selectable via the PS2:PS0 bits (OPTION_REG<2:0>). The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1, x....etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the Watchdog Timer. 4.4.1 SWITCHING PRESCALER ASSIGNMENT The prescaler assignment is fully under software control (i.e., it can be changed “on the fly” during program execution). To avoid an unintended device Reset, the following instruction sequence (Example 4- 1) must be executed when changing the prescaler assignment from Timer0 to WDT. EXAMPLE 4-1: CHANGING PRESCALER (TIMER0WDT) To change prescaler from the WDT to the TMR0 module, use the sequence shown in Example 4-2. This precaution must be taken even if the WDT is disabled. EXAMPLE 4-2: CHANGING PRESCALER (WDTTIMER0) TABLE 4-1: REGISTERS ASSOCIATED WITH TIMER0 BCF STATUS,RP0 ;Bank 0 CLRWDT ;Clear WDT CLRF TMR0 ;Clear TMR0 and ; prescaler BSF STATUS,RP0 ;Bank 1 MOVLW b’00101111’ ;Required if desired MOVWF OPTION_REG ; PS2:PS0 is CLRWDT ; 000 or 001 ; MOVLW b’00101xxx’ ;Set postscaler to MOVWF OPTION_REG ; desired WDT rate BCF STATUS,RP0 ;Bank 0 CLRWDT ;Clear WDT and ; postscaler BSF STATUS,RP0 ;Bank 1 MOVLW b’xxxx0xxx’ ;Select TMR0, ; prescale, and ; clock source MOVWF OPTION_REG ; BCF STATUS,RP0 ;Bank 0 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 01h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu 0Bh/8Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 0000 000u 81h OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 85h TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 --11 1111 --11 1111 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Timer0 module. PIC16F630/676 DS40039F-page 34  2010 Microchip Technology Inc. 5.0 TIMER1 MODULE WITH GATE CONTROL The PIC16F630/676 devices have a 16-bit timer. Figure 5-1 shows the basic block diagram of the Timer1 module. Timer1 has the following features: • 16-bit timer/counter (TMR1H:TMR1L) • Readable and writable • Internal or external clock selection • Synchronous or asynchronous operation • Interrupt on overflow from FFFFh to 0000h • Wake-up upon overflow (Asynchronous mode) • Optional external enable input (T1G) • Optional LP oscillator The Timer1 Control register (T1CON), shown in Register 5-1, is used to enable/disable Timer1 and select the various features of the Timer1 module. FIGURE 5-1: TIMER1 BLOCK DIAGRAM Note: Additional information on timer modules is available in the PIC® Mid-Range Reference Manual, (DS33023). TMR1H TMR1L LP Oscillator T1SYNC TMR1CS T1CKPS<1:0> Sleep Input FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 0 1 Synchronized Clock Input 2 OSC1 OSC2 Set Flag bit TMR1IF on Overflow TMR1 TMR1ON TMR1GE TMR1ON TMR1GE INTOSC T1OSCEN LP w/o CLKOUT T1G  2010 Microchip Technology Inc. DS40039F-page 35 PIC16F630/676 5.1 Timer1 Modes of Operation Timer1 can operate in one of three modes: • 16-bit timer with prescaler • 16-bit synchronous counter • 16-bit asynchronous counter In Timer mode, Timer1 is incremented on every instruction cycle. In Counter mode, Timer1 is incremented on the rising edge of the external clock input T1CKI. In addition, the Counter mode clock can be synchronized to the microcontroller system clock or run asynchronously. In counter and timer modules, the counter/timer clock can be gated by the T1G input. If an external clock oscillator is needed (and the microcontroller is using the INTOSC w/o CLKOUT), Timer1 can use the LP oscillator as a clock source. 5.2 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit (PIR1<0>) is set. To enable the interrupt on rollover, you must set these bits: • Timer1 interrupt Enable bit (PIE1<0>) • PEIE bit (INTCON<6>) • GIE bit (INTCON<7>). The interrupt is cleared by clearing the TMR1IF in the Interrupt Service Routine. 5.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4, or 8 divisions of the clock input. The T1CKPS bits (T1CON<5:4>) control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. FIGURE 5-2: TIMER1 INCREMENTING EDGE Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge. Note: The TMR1H:TTMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: Arrows indicate counter increments. 2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. PIC16F630/676 DS40039F-page 36  2010 Microchip Technology Inc. REGISTER 5-1: T1CON — TIMER1 CONTROL REGISTER (ADDRESS: 10h) U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 bit 7 Unimplemented: Read as ‘0’ bit 6 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 is on if T1G pin is low 0 = Timer1 is on bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale Value 10 = 1:4 Prescale Value 01 = 1:2 Prescale Value 00 = 1:1 Prescale Value bit 3 T1OSCEN: LP Oscillator Enable Control bit If INTOSC without CLKOUT oscillator is active: 1 = LP oscillator is enabled for Timer1 clock 0 = LP oscillator is off Else: This bit is ignored bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock. bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from T1OSO/T1CKI pin (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2010 Microchip Technology Inc. DS40039F-page 37 PIC16F630/676 5.4 Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC (T1CON<2>) is set, the external clock input is not synchronized. The timer continues to increment asynchronous to the internal phase clocks. The timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (Section 5.4.1). 5.4.1 READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L, while the timer is running from an external asynchronous clock, will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the timer register. Reading the 16-bit value requires some care. Examples 12-2 and 12-3 in the PIC® Mid-Range MCU Family Reference Manual (DS33023) show how to read and write Timer1 when it is running in Asynchronous mode. 5.5 Timer1 Oscillator A crystal oscillator circuit is built-in between pins OSC1 (input) and OSC2 (amplifier output). It is enabled by setting control bit T1OSCEN (T1CON<3>). The oscillator is a low power oscillator rated up to 32 kHz. It will continue to run during Sleep. It is primarily intended for a 32 kHz crystal. Table 9-2 shows the capacitor selection for the Timer1 oscillator. The Timer1 oscillator is shared with the system LP oscillator. Thus, Timer1 can use this mode only when the system clock is derived from the internal oscillator. As with the system LP oscillator, the user must provide a software time delay to ensure proper oscillator start-up. TRISA5 and TRISA4 bits are set when the Timer1 oscillator is enabled. RA5 and RA4 read as ‘0’ and TRISA5 and TRISA4 bits read as ‘1’. 5.6 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To setup the timer to wake the device: • Timer1 must be on (T1CON<0>) • TMR1IE bit (PIE1<0>) must be set • PEIE bit (INTCON<6>) must be set The device will wake-up on an overflow. If the GIE bit (INTCON<7>) is set, the device will wake-up and jump to the Interrupt Service Routine on an overflow. TABLE 5-1: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER Note: The ANSEL (91h) and CMCON (19h) registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. The ANSEL register is defined for the PIC16F676. Note: The oscillator requires a start-up and stabilization time before use. Thus, T1OSCEN should be set and a suitable delay observed prior to enabling Timer1. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 0Bh/8Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 00-- 0--0 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 10h T1CON — TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON -000 0000 -uuu uuuu 8Ch PIE1 EEIE ADIE — — CMIE — — TMR1IE 00-- 0--0 00-- 0--0 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module. PIC16F630/676 DS40039F-page 38  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS40039F-page 39 PIC16F630/676 6.0 COMPARATOR MODULE The PIC16F630/676 devices have one analog comparator. The inputs to the comparator are multiplexed with the RA0 and RA1 pins. There is an on-chip Comparator Voltage Reference that can also be applied to an input of the comparator. In addition, RA2 can be configured as the comparator output. The Comparator Control Register (CMCON), shown in Register 6-1, contains the bits to control the comparator. REGISTER 6-1: CMCON — COMPARATOR CONTROL REGISTER (ADDRESS: 19h) U-0 R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — COUT — CINV CIS CM2 CM1 CM0 bit 7 bit 0 bit 7 Unimplemented: Read as ‘0’ bit 6 COUT: Comparator Output bit When CINV = 0: 1 = VIN+ > VIN- 0 = VIN+ < VINWhen CINV = 1: 1 = VIN+ < VIN- 0 = VIN+ > VINbit 5 Unimplemented: Read as ‘0’ bit 4 CINV: Comparator Output Inversion bit 1 = Output inverted 0 = Output not inverted bit 3 CIS: Comparator Input Switch bit When CM2:CM0 = 110 or 101: 1 = VIN- connects to CIN+ 0 = VIN- connects to CINbit 2-0 CM2:CM0: Comparator Mode bits Figure 6-2 shows the Comparator modes and CM2:CM0 bit settings Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F630/676 DS40039F-page 40  2010 Microchip Technology Inc. 6.1 Comparator Operation A single comparator is shown in Figure 6-1, along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 6-1 represent the uncertainty due to input offsets and response time. The polarity of the comparator output can be inverted by setting the CINV bit (CMCON<4>). Clearing CINV results in a non-inverted output. A complete table showing the output state versus input conditions and the polarity bit is shown in Table 6-1. TABLE 6-1: OUTPUT STATE VS. INPUT CONDITIONS FIGURE 6-1: SINGLE COMPARATOR Note: To use CIN+ and CIN- pins as analog inputs, the appropriate bits must be programmed in the CMCON (19h) register. Input Conditions CINV COUT VIN- > VIN+ 0 0 VIN- < VIN+ 0 1 VIN- > VIN+ 1 1 VIN- < VIN+ 1 0 Output VINVIN+ Output + – VIN+ VINNote: CINV bit (CMCON<4>) is clear.  2010 Microchip Technology Inc. DS40039F-page 41 PIC16F630/676 6.2 Comparator Configuration There are eight modes of operation for the comparator. The CMCON register, shown in Register 6-1, is used to select the mode. Figure 6-2 shows the eight possible modes. The TRISA register controls the data direction of the comparator pins for each mode. If the Comparator mode is changed, the comparator output level may not be valid for a specified period of time. Refer to the specifications in Section 12.0 “Electrical Specifications”. FIGURE 6-2: COMPARATOR I/O OPERATING MODES Note: Comparator interrupts should be disabled during a Comparator mode change. Otherwise, a false interrupt may occur. Comparator Reset (POR Default Value – low power) Comparator Off (Lowest power) CM2:CM0 = 000 CM2:CM0 = 111 Comparator without Output Comparator w/o Output and with Internal Reference CM2:CM0 = 010 CM2:CM0 = 100 Comparator with Output and Internal Reference Multiplexed Input with Internal Reference and Output CM2:CM0 = 011 CM2:CM0 = 101 Comparator with Output Multiplexed Input with Internal Reference CM2:CM0 = 001 CM2:CM0 = 110 A = Analog Input, ports always reads ‘0’ D = Digital Input CIS = Comparator Input Switch (CMCON<3>) RA1/CINRA0/CIN+ Off (Read as ‘0’) A A RA2/COUT D RA1/CINRA0/CIN+ Off (Read as ‘0’) D D RA2/COUT D RA1/CINRA0/CIN+ COUT A A RA2/COUT D RA1/CINRA0/CIN+ COUT A D RA2/COUT D From CVREF Module RA1/CINRA0/CIN+ COUT A D RA2/COUT D From CVREF Module RA1/CINRA0/CIN+ COUT A A RA2/COUT D From CVREF Module CIS = 0 CIS = 1 RA1/CINRA0/CIN+ COUT A A RA2/COUT D RA1/CINRA0/CIN+ COUT A A RA2/COUT D From CVREF Module CIS = 0 CIS = 1 PIC16F630/676 DS40039F-page 42  2010 Microchip Technology Inc. 6.3 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 6-3. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. FIGURE 6-3: ANALOG INPUT MODE 6.4 Comparator Output The comparator output, COUT, is read through the CMCON register. This bit is read-only. The comparator output may also be directly output to the RA2 pin in three of the eight possible modes, as shown in Figure 6-2. When in one of these modes, the output on RA2 is asynchronous to the internal clock. Figure 6-4 shows the comparator output block diagram. The TRISA<2> bit functions as an output enable/ disable for the RA2 pin while the comparator is in an Output mode. FIGURE 6-4: MODIFIED COMPARATOR OUTPUT BLOCK DIAGRAM VA Rs < 10K AIN CPIN 5 pF VDD VT = 0.6V VT = 0.6V RIC Leakage ±500 nA Vss Legend: CPIN = Input Capacitance VT = Threshold Voltage ILEAKAGE = Leakage Current at the pin due to Various Junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage Note 1: When reading the PORTA register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert an analog input according to the TTL input specification. 2: Analog levels on any pin that is defined as a digital input, may cause the input buffer to consume more current than is specified. To RA2/T0CKI pin RD CMCON Set CMIF bit Reset To Data Bus CINV CVREF D EN Q D EN Q RD CMCON RA1/CINRA0/CIN+ CM2:CM0  2010 Microchip Technology Inc. DS40039F-page 43 PIC16F630/676 6.5 Comparator Reference The comparator module also allows the selection of an internally generated voltage reference for one of the comparator inputs. The internal reference signal is used for four of the eight Comparator modes. The VRCON register, Register 6-2, controls the voltage reference module shown in Figure 6-5. 6.5.1 CONFIGURING THE VOLTAGE REFERENCE The voltage reference can output 32 distinct voltage levels, 16 in a high range and 16 in a low range. The following equations determine the output voltages: VRR = 1 (low range): CVREF = (VR3:VR0 / 24) x VDD VRR = 0 (high range): CVREF = (VDD / 4) + (VR3:VR0 x VDD / 32) 6.5.2 VOLTAGE REFERENCE ACCURACY/ERROR The full range of VSS to VDD cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 6-5) keep CVREF from approaching VSS or VDD. The Voltage Reference is VDD derived and therefore, the CVREF output changes with fluctuations in VDD. The tested absolute accuracy of the Comparator Voltage Reference can be found in Section 12.0 “Electrical Specifications”. FIGURE 6-5: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM 6.6 Comparator Response Time Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output is ensured to have a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (Table 12-7). 6.7 Operation During Sleep Both the comparator and voltage reference, if enabled before entering Sleep mode, remain active during Sleep. This results in higher Sleep currents than shown in the power-down specifications. The additional current consumed by the comparator and the voltage reference is shown separately in the specifications. To minimize power consumption while in Sleep mode, turn off the comparator, CM2:CM0 = 111, and voltage reference, VRCON<7> = 0. While the comparator is enabled during Sleep, an interrupt will wake-up the device. If the device wakes up from Sleep, the contents of the CMCON and VRCON registers are not affected. 6.8 Effects of a Reset A device Reset forces the CMCON and VRCON registers to their Reset states. This forces the comparator module to be in the Comparator Reset mode, CM2:CM0 = 000 and the voltage reference to its off state. Thus, all potential inputs are analog inputs with the comparator and voltage reference disabled to consume the smallest current possible. 8R VRR VR3:VR0 16-1 Analog 8R R R R R CVREF to 16 Stages Comparator Input VREN VDD MUX PIC16F630/676 DS40039F-page 44  2010 Microchip Technology Inc. REGISTER 6-2: VRCON — VOLTAGE REFERENCE CONTROL REGISTER (ADDRESS: 99h) 6.9 Comparator Interrupts The comparator interrupt flag is set whenever there is a change in the output value of the comparator. Software will need to maintain information about the status of the output bits, as read from CMCON<6>, to determine the actual change that has occurred. The CMIF bit, PIR1<3>, is the comparator interrupt flag. This bit must be reset in software by clearing it to ‘0’. Since it is also possible to write a ‘1’ to this register, a simulated interrupt may be initiated. The CMIE bit (PIE1<3>) and the PEIE bit (INTCON<6>) must be set to enable the interrupt. In addition, the GIE bit must also be set. If any of these bits are cleared, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of CMCON. This will end the mismatch condition. b) Clear flag bit CMIF. A mismatch condition will continue to set flag bit CMIF. Reading CMCON will end the mismatch condition and allow flag bit CMIF to be cleared. TABLE 6-2: REGISTERS ASSOCIATED WITH COMPARATOR MODULE R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 VREN — VRR — VR3 VR2 VR1 VR0 bit 7 bit 0 bit 7 VREN: CVREF Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down, no IDD drain bit 6 Unimplemented: Read as ‘0’ bit 5 VRR: CVREF Range Selection bit 1 = Low range 0 = High range bit 4 Unimplemented: Read as ‘0’ bit 3-0 VR3:VR0: CVREF value selection bits 0  VR [3:0]  15 When VRR = 1: CVREF = (VR3:VR0 / 24) * VDD When VRR = 0: CVREF = VDD/4 + (VR3:VR0 / 32) * VDD Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: If a change in the CMCON register (COUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR1<3>) interrupt flag may not get set. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 0Bh/8Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 00-- 0--0 19h CMCON — COUT — CINV CIS CM2 CM1 CM0 -0-0 0000 -0-0 0000 8Ch PIE1 EEIE ADIE — — CMIE — — TMR1IE 00-- 0--0 00-- 0--0 85h TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 --11 1111 --11 1111 99h VRCON VREN — VRR — VR3 VR2 VR1 VR0 0-0- 0000 0-0- 0000 Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the comparator module.  2010 Microchip Technology Inc. DS40039F-page 45 PIC16F630/676 7.0 ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE (PIC16F676 ONLY) The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. The PIC16F676 has eight analog inputs, multiplexed into one sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a binary result via successive approximation and stores the result in a 10-bit register. The voltage reference used in the conversion is software selectable to either VDD or a voltage applied by the VREF pin. Figure 7-1 shows the block diagram of the A/D on the PIC16F676. FIGURE 7-1: A/D BLOCK DIAGRAM 7.1 A/D Configuration and Operation There are three registers available to control the functionality of the A/D module: 1. ADCON0 (Register 7-1) 2. ADCON1 (Register 7-2) 3. ANSEL (Register 7-3) 7.1.1 ANALOG PORT PINS The ANS7:ANS0 bits (ANSEL<7:0>) and the TRISA bits control the operation of the A/D port pins. Set the corresponding TRISA bits to set the pin output driver to its high-impedance state. Likewise, set the corresponding ANS bit to disable the digital input buffer. 7.1.2 CHANNEL SELECTION There are eight analog channels on the PIC16F676, AN0 through AN7. The CHS2:CHS0 bits (ADCON0<4:2>) control which channel is connected to the sample and hold circuit. 7.1.3 VOLTAGE REFERENCE There are two options for the voltage reference to the A/D converter: either VDD is used, or an analog voltage applied to VREF is used. The VCFG bit (ADCON0<6>) controls the voltage reference selection. If VCFG is set, then the voltage on the VREF pin is the reference; otherwise, VDD is the reference. 7.1.4 CONVERSION CLOCK The A/D conversion cycle requires 11 TAD. The source of the conversion clock is software selectable via the ADCS bits (ADCON1<6:4>). There are seven possible clock options: • FOSC/2 • FOSC/4 • FOSC/8 • FOSC/16 • FOSC/32 • FOSC/64 • FRC (dedicated internal oscillator) For correct conversion, the A/D conversion clock (1/TAD) must be selected to ensure a minimum TAD of 1.6 s. Table 7-1 shows a few TAD calculations for selected frequencies. RA0/AN0 ADC RA1/AN1/VREF RA2/AN2 RC0/AN4 VDD VREF ADON GO/DONE VCFG = 1 VCFG = 0 CHS2:CHS0 ADRESH ADRESL 10 10 ADFM VSS RC1/AN5 RC2/AN6 RC3/AN7 RA4/AN3 Note: Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. PIC16F630/676 DS40039F-page 46  2010 Microchip Technology Inc. TABLE 7-1: TAD vs. DEVICE OPERATING FREQUENCIES 7.1.5 STARTING A CONVERSION The A/D conversion is initiated by setting the GO/DONE bit (ADCON0<1>). When the conversion is complete, the A/D module: • Clears the GO/DONE bit • Sets the ADIF flag (PIR1<6>) • Generates an interrupt (if enabled) If the conversion must be aborted, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete A/D conversion sample. Instead, the ADRESH:ADRESL registers will retain the value of the previous conversion. After an aborted conversion, a 2 TAD delay is required before another acquisition can be initiated. Following the delay, an input acquisition is automatically started on the selected channel. 7.1.6 CONVERSION OUTPUT The A/D conversion can be supplied in two formats: left or right shifted. The ADFM bit (ADCON0<7>) controls the output format. Figure 7-2 shows the output formats. FIGURE 7-2: 10-BIT A/D RESULT FORMAT A/D Clock Source (TAD) Device Frequency Operation ADCS2:ADCS0 20 MHz 5 MHz 4 MHz 1.25 MHz 2 TOSC 000 100 ns(2) 400 ns(2) 500 ns(2) 1.6 s 4 TOSC 100 200 ns(2) 800 ns(2) 1.0 s(2) 3.2 s 8 TOSC 001 400 ns(2) 1.6 s 2.0 s 6.4 s 16 TOSC 101 800 ns(2) 3.2 s 4.0 s 12.8 s(3) 32 TOSC 010 1.6 s 6.4 s 8.0 s(3) 25.6 s(3) 64 TOSC 110 3.2 s 12.8 s(3) 16.0 s(3) 51.2 s(3) A/D RC x11 2 - 6 s(1,4) 2 - 6 s(1,4) 2 - 6 s(1,4) 2 - 6 s(1,4) Legend:Shaded cells are outside of recommended range. Note 1: The A/D RC source has a typical TAD time of 4 s for VDD > 3.0V. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: When the device frequency is greater than 1 MHz, the A/D RC clock source is only recommended if the conversion will be performed during Sleep. Note: The GO/DONE bit should not be set in the same instruction that turns on the A/D. ADRESH ADRESL (ADFM = 0) MSB LSB bit 7 bit 0 bit 7 bit 0 10-bit A/D Result Unimplemented: Read as ‘0’ (ADFM = 1) MSB LSB bit 7 bit 0 bit 7 bit 0 Unimplemented: Read as ‘0’ 10-bit A/D Result  2010 Microchip Technology Inc. DS40039F-page 47 PIC16F630/676 REGISTER 7-1: ADCON0 — A/D CONTROL REGISTER (ADDRESS: 1Fh) REGISTER 7-2: ADCON1 — A/D CONTROL REGISTER 1 (ADRESS: 9Fh) R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 bit 7 ADFM: A/D Result Formed Select bit 1 = Right justified 0 = Left justified bit 6 VCFG: Voltage Reference bit 1 = VREF pin 0 = VDD bit 5 Unimplemented: Read as zero bit 4-2 CHS2:CHS0: Analog Channel Select bits 000 = Channel 00 (AN0) 001 = Channel 01 (AN1) 010 = Channel 02 (AN2) 011 = Channel 03 (AN3) 100 = Channel 04 (AN4) 101 = Channel 05 (AN5) 110 = Channel 06 (AN6) 111 = Channel 07 (AN7) bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: A/D Conversion Status bit 1 = A/D converter module is operating 0 = A/D converter is shut-off and consumes no operating current Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 — ADCS2 ADCS1 ADCS0 — — — — bit 7 bit 0 bit 7: Unimplemented: Read as ‘0’ bit 6-4: ADCS<2:0>: A/D Conversion Clock Select bits 000 =FOSC/2 001 =FOSC/8 010 =FOSC/32 x11 =FRC (clock derived from a dedicated internal oscillator = 500 kHz max) 100 =FOSC/4 101 =FOSC/16 110 =FOSC/64 bit 3-0: Unimplemented: Read as ‘0’ Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F630/676 DS40039F-page 48  2010 Microchip Technology Inc. REGISTER 7-3: ANSEL — ANALOG SELECT REGISTER (ADRESS: 91h) (PIC16F676 ONLY) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 bit 7 bit 0 bit 7-0: ANS<7:0>: Analog Select between analog or digital function on pins AN<7:0>, respectively. 1 = Analog input. Pin is assigned as analog input.(1) 0 = Digital I/O. Pin is assigned to port or special function. Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2010 Microchip Technology Inc. DS40039F-page 49 PIC16F630/676 7.2 A/D Acquisition Requirements For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 7-3. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 7-3. The maximum recommended impedance for analog sources is 10 k. As the impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (changed), this acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 7-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. To calculate the minimum acquisition time, TACQ, see the PIC® Mid-Range Reference Manual (DS33023). EQUATION 7-1: ACQUISITION TIME FIGURE 7-3: ANALOG INPUT MODEL TACQ TC TACQ = = = = = = = = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient TAMP + TC + TCOFF 2s + TC + [(Temperature -25°C)(0.05s/°C)] CHOLD (RIC + RSS + RS) In(1/2047) - 120pF (1k + 7k + 10k) In(0.0004885) 16.47s 2s + 16.47s + [(50°C -25C)(0.05s/C) 19.72s Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. VA CPIN RS ANx 5 pF VDD VT = 0.6V VT = 0.6V I LEAKAGE RIC  1K Sampling Switch SS RSS CHOLD = DAC capacitance VSS 6V Sampling Switch 5V 4V 3V 2V 5 6 7 8 9 10 11 (k) VDD ± 500 nA = 120 pF Legend: CPIN VT I LEAKAGE RIC SS CHOLD = input capacitance = threshold voltage = leakage current at the pin due to = interconnect resistance = sampling switch = sample/hold capacitance (from DAC) various junctions PIC16F630/676 DS40039F-page 50  2010 Microchip Technology Inc. 7.3 A/D Operation During Sleep The A/D converter module can operate during Sleep. This requires the A/D clock source to be set to the internal oscillator. When the RC clock source is selected, the A/D waits one instruction before starting the conversion. This allows the SLEEP instruction to be executed, thus eliminating much of the switching noise from the conversion. When the conversion is complete, the GO/DONE bit is cleared, and the result is loaded into the ADRESH:ADRESL registers. If the A/D interrupt is enabled, the device awakens from Sleep. If the A/D interrupt is not enabled, the A/D module is turned off, although the ADON bit remains set. When the A/D clock source is something other than RC, a SLEEP instruction causes the present conversion to be aborted, and the A/D module is turned off. The ADON bit remains set. 7.4 Effects of Reset A device Reset forces all registers to their Reset state. Thus, the A/D module is turned off and any pending conversion is aborted. The ADRESH:ADRESL registers are unchanged. TABLE 7-2: SUMMARY OF A/D REGISTERS Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 05h PORTA — — PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 --xx xxxx --uu uuuu 07h PORTC — — PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 --xx xxxx --uu uuuu 0Bh, 8Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 00-- 0--0 1Eh ADRESH Most Significant 8 bits of the Left Shifted A/D result or 2 bits of the Right Shifted Result xxxx xxxx uuuu uuuu 1Fh ADCON0 ADFM VCFG — CHS2 CHS1 CHS0 GO ADON 00-0 0000 00-0 0000 85h TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 --11 1111 --11 1111 87h TRISC — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 --11 1111 --11 1111 8Ch PIE1 EEIE ADIE — — CMIE — — TMR1IE 00-- 0--0 00-- 0--0 91h ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111 9Eh ADRESL Least Significant 2 bits of the Left Shifted A/D Result or 8 bits of the Right Shifted Result xxxx xxxx uuuu uuuu 9Fh ADCON1 — ADCS2 ADCS1 ADCS0 — — — — -000 ---- -000 ---- Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for A/D converter module.  2010 Microchip Technology Inc. DS40039F-page 51 PIC16F630/676 8.0 DATA EEPROM MEMORY The EEPROM data memory is readable and writable during normal operation (full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers. There are four SFRs used to read and write this memory: • EECON1 • EECON2 (not a physically implemented register) • EEDATA • EEADR EEDATA holds the 8-bit data for read/write, and EEADR holds the address of the EEPROM location being accessed. PIC16F630/676 devices have 128 bytes of data EEPROM with an address range from 0h to 7Fh. The EEPROM data memory allows byte read and write. A byte write automatically erases the location and writes the new data (erase before write). The EEPROM data memory is rated for high erase/write cycles. The write time is controlled by an on-chip timer. The write time will vary with voltage and temperature as well as from chip to chip. Please refer to AC Specifications for exact limits. When the data memory is code-protected, the CPU may continue to read and write the data EEPROM memory. The device programmer can no longer access this memory. Additional information on the data EEPROM is available in the PIC® Mid-Range Reference Manual, (DS33023). REGISTER 8-1: EEDAT — EEPROM DATA REGISTER (ADDRESS: 9Ah) REGISTER 8-2: EEADR — EEPROM ADDRESS REGISTER (ADDRESS: 9Bh) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 bit 7 bit 0 bit 7-0 EEDATn: Byte value to write to or read from data EEPROM Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ’1’ = Bit is set ’0’ = Bit is cleared x = Bit is unknown U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — EADR6 EADR5 EADR4 EADR3 EADR2 EADR1 EADR0 bit 7 bit 0 bit 7 Unimplemented: Should be set to ‘0’ bit 6-0 EEADR: Specifies one of 128 locations for EEPROM Read/Write Operation Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ’1’ = Bit is set ’0’ = Bit is cleared x = Bit is unknown PIC16F630/676 DS40039F-page 52  2010 Microchip Technology Inc. 8.1 EEADR The EEADR register can address up to a maximum of 128 bytes of data EEPROM. Only seven of the eight bits in the register (EEADR<6:0>) are required. The MSb (bit 7) is ignored. The upper bit should always be ‘0’ to remain upward compatible with devices that have more data EEPROM memory. 8.2 EECON1 AND EECON2 REGISTERS EECON1 is the control register with four low order bits physically implemented. The upper four bits are nonimplemented and read as ‘0’s. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset, or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit, clear it, and rewrite the location. The data and address will be cleared, therefore, the EEDATA and EEADR registers will need to be re-initialized. The Interrupt flag bit EEIF in the PIR1 register is set when the write is complete. This bit must be cleared in software. EECON2 is not a physical register. Reading EECON2 will read all ‘0’s. The EECON2 register is used exclusively in the data EEPROM write sequence. REGISTER 8-3: EECON1 — EEPROM CONTROL REGISTER (ADDRESS: 9Ch) U-0 U-0 U-0 U-0 R/W-x R/W-0 R/S-0 R/S-0 — — — — WRERR WREN WR RD bit 7 bit 0 bit 7-4 Unimplemented: Read as ‘0’ bit 3 WRERR: EEPROM Error Flag bit 1 =A write operation is prematurely terminated (any MCLR Reset, any WDT Reset during normal operation or BOD detect) 0 =The write operation completed bit 2 WREN: EEPROM Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the data EEPROM bit 1 WR: Write Control bit 1 = Initiates a write cycle (The bit is cleared by hardware once write is complete. The WR bit can only be set, not cleared, in software.) 0 = Write cycle to the data EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set, not cleared, in software.) 0 = Does not initiate an EEPROM read Legend: S = Bit can only be set R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ’1’ = Bit is set ’0’ = Bit is cleared x = Bit is unknown  2010 Microchip Technology Inc. DS40039F-page 53 PIC16F630/676 8.3 READING THE EEPROM DATA MEMORY To read a data memory location, the user must write the address to the EEADR register and then set control bit RD (EECON1<0>), as shown in Example 8-1. The data is available in the very next cycle in the EEDATA register. Therefore, it can be read in the next instruction. EEDATA holds this value until another read, or until it is written to by the user (during a write operation). EXAMPLE 8-1: DATA EEPROM READ 8.4 WRITING TO THE EEPROM DATA MEMORY To write an EEPROM data location, the user must first write the address to the EEADR register and the data to the EEDATA register. Then the user must follow a specific sequence to initiate the write for each byte, as shown in Example 8-2. EXAMPLE 8-2: DATA EEPROM WRITE The write will not initiate if the above sequence is not exactly followed (write 55h to EECON2, write AAh to EECON2, then set WR bit) for each byte. We strongly recommend that interrupts be disabled during this code segment. A cycle count is executed during the required sequence. Any number that is not equal to the required cycles to execute the required sequence will prevent the data from being written into the EEPROM. Additionally, the WREN bit in EECON1 must be set to enable write. This mechanism prevents accidental writes to data EEPROM due to errant (unexpected) code execution (i.e., lost programs). The user should keep the WREN bit clear at all times, except when updating EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect this write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. At the completion of the write cycle, the WR bit is cleared in hardware and the EE Write Complete Interrupt Flag bit (EEIF) is set. The user can either enable this interrupt or poll this bit. The EEIF bit (PIR<7>) register must be cleared by software. 8.5 WRITE VERIFY Depending on the application, good programming practice may dictate that the value written to the data EEPROM should be verified (see Example 8-3) to the desired value to be written. EXAMPLE 8-3: WRITE VERIFY 8.5.1 USING THE DATA EEPROM The data EEPROM is a high-endurance, byte addressable array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). Frequently changing values will typically be updated more often than specifications D120 or D120A. If this is not the case, an array refresh must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory. 8.6 PROTECTION AGAINST SPURIOUS WRITE There are conditions when the user may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-up Timer (72 ms duration) prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during: • brown-out • power glitch • software malfunction BSF STATUS,RP0 ;Bank 1 MOVLW CONFIG_ADDR ; MOVWF EEADR ;Address to read BSF EECON1,RD ;EE Read MOVF EEDATA,W ;Move data to W BSF STATUS,RP0 ;Bank 1 BSF EECON1,WREN ;Enable write BCF INTCON,GIE ;Disable INTs MOVLW 55h ;Unlock write MOVWF EECON2 ; MOVLW AAh ; MOVWF EECON2 ; BSF EECON1,WR ;Start the write BSF INTCON,GIE ;Enable INTS Required Sequence BCF STATUS,RP0 ;Bank 0 : ;Any code BSF STATUS,RP0 ;Bank 1 READ MOVF EEDATA,W ;EEDATA not changed ;from previous write BSF EECON1,RD ;YES, Read the ;value written XORWF EEDATA,W BTFSS STATUS,Z ;Is data the same GOTO WRITE_ERR ;No, handle error : ;Yes, continue PIC16F630/676 DS40039F-page 54  2010 Microchip Technology Inc. 8.7 DATA EEPROM OPERATION DURING CODE-PROTECT Data memory can be code-protected by programming the CPD bit to ‘0’. When the data memory is code-protected, the CPU is able to read and write data to the data EEPROM. It is recommended to code-protect the program memory when code protecting data memory. This prevents anyone from programming zeroes over the existing code (which will execute as NOPs) to reach an added routine, programmed in unused program memory, which outputs the contents of data memory. Programming unused locations to ‘0’ will also help prevent data memory code protection from becoming breached. TABLE 8-1: REGISTERS/BITS ASSOCIATED WITH DATA EEPROM Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 00-- 0--0 9Ah EEDATA EEPROM Data Register 0000 0000 0000 0000 9Bh EEADR — EEPROM Address Register -000 0000 -000 0000 9Ch EECON1 — — — — WRERR WREN WR RD ---- x000 ---- q000 9Dh EECON2(1) EEPROM Control Register 2 ---- ---- ---- ---- Legend: x = unknown, u = unchanged, – = unimplemented read as ‘0’, q = value depends upon condition. Shaded cells are not used by the data EEPROM module. Note 1: EECON2 is not a physical register.  2010 Microchip Technology Inc. DS40039F-page 55 PIC16F630/676 9.0 SPECIAL FEATURES OF THE CPU Certain special circuits that deal with the needs of real time applications are what sets a microcontroller apart from other processors. The PIC16F630/676 family has a host of such features intended to: • maximize system reliability • minimize cost through elimination of external components • provide power-saving operating modes and offer code protection These features are: • Oscillator selection • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Detect (BOD) • Interrupts • Watchdog Timer (WDT) • Sleep • Code protection • ID Locations • In-Circuit Serial Programming™ The PIC16F630/676 has a Watchdog Timer that is controlled by Configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay of 72 ms (nominal) on power-up only, designed to keep the part in Reset while the power supply stabilizes. There is also circuitry to reset the device if a brown-out occurs, which can provide at least a 72 ms Reset. With these three functions on-chip, most applications need no external Reset circuitry. The Sleep mode is designed to offer a very low current Power-down mode. The user can wake-up from Sleep through: • External Reset • Watchdog Timer wake-up • An interrupt Several oscillator options are also made available to allow the part to fit the application. The INTOSC option saves system cost while the LP crystal option saves power. A set of Configuration bits are used to select various options (see Register 9-1). PIC16F630/676 DS40039F-page 56  2010 Microchip Technology Inc. 9.1 Configuration Bits The Configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’) to select various device configurations, as shown in Register 9-1. These bits are mapped in program memory location 2007h. REGISTER 9-1: CONFIG — CONFIGURATION WORD (ADDRESS: 2007h) Note: Address 2007h is beyond the user program memory space. It belongs to the special configuration memory space (2000h-3FFFh), which can be accessed only during programming. See PIC16F630/676 Programming Specification for more information. R/P-1 R/P-1 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 BG1 BG0 — — — CPD CP BODEN MCLRE PWRTE WDTE F0SC2 F0SC1 F0SC0 bit 13 bit 0 bit 13-12 BG1:BG0: Bandgap Calibration bits for BOD and POR voltage(1) 00 = Lowest bandgap voltage 11 = Highest bandgap voltage bit 11-9 Unimplemented: Read as ‘0’ bit 8 CPD: Data Code Protection bit(2) 1 = Data memory code protection is disabled 0 = Data memory code protection is enabled bit 7 CP: Code Protection bit(3) 1 = Program Memory code protection is disabled 0 = Program Memory code protection is enabled bit 6 BODEN: Brown-out Detect Enable bit(4) 1 = BOD enabled 0 = BOD disabled bit 5 MCLRE: RA3/MCLR pin function select bit(5) 1 = RA3/MCLR pin function is MCLR 0 = RA3/MCLR pin function is digital I/O, MCLR internally tied to VDD bit 4 PWRTE: Power-up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 FOSC2:FOSC0: Oscillator Selection bits 111 = RC oscillator: CLKOUT function on RA4/OSC2/CLKOUT pin, RC on RA5/OSC1/CLKIN 110 = RC oscillator: I/O function on RA4/OSC2/CLKOUT pin, RC on RA5/OSC1/CLKIN 101 = INTOSC oscillator: CLKOUT function on RA4/OSC2/CLKOUT pin, I/O function on RA5/OSC1/CLKIN 100 = INTOSC oscillator: I/O function on RA4/OSC2/CLKOUT pin, I/O function on RA5/OSC1/CLKIN 011 = EC: I/O function on RA4/OSC2/CLKOUT pin, CLKIN on RA5/OSC1/CLKIN 010 = HS oscillator: High speed crystal/resonator on RA4/OSC2/CLKOUT and RA5/OSC1/CLKIN 001 = XT oscillator: Crystal/resonator on RA4/OSC2/CLKOUT and RA5/OSC1/CLKIN 000 = LP oscillator: Low power crystal on RA4/OSC2/CLKOUT and RA5/OSC1/CLKIN Note 1: The Bandgap Calibration bits are factory programmed and must be read and saved prior to erasing the device as specified in the PIC16F630/676 Programming Specification. These bits are reflected in an export of the Configuration Word. Microchip Development Tools maintain all calibration bits to factory settings. 2: The entire data EEPROM will be erased when the code protection is turned off. 3: The entire program memory will be erased, including OSCCAL value, when the code protection is turned off. 4: Enabling Brown-out Detect does not automatically enable Power-up Timer. 5: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled. Legend: P = Programmed using ICSP™ R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR 1 = bit is set 0 = bit is cleared x = bit is unknown  2010 Microchip Technology Inc. DS40039F-page 57 PIC16F630/676 9.2 Oscillator Configurations 9.2.1 OSCILLATOR TYPES The PIC16F630/676 can be operated in eight different Oscillator Option modes. The user can program three Configuration bits (FOSC2 through FOSC0) to select one of these eight modes: • LP Low-Power Crystal • XT Crystal/Resonator • HS High Speed Crystal/Resonator • RC External Resistor/Capacitor (2 modes) • INTOSC Internal Oscillator (2 modes) • EC External Clock In 9.2.2 CRYSTAL OSCILLATOR / CERAMIC RESONATORS In XT, LP or HS modes a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation (see Figure 9-1). The PIC16F630/676 oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may yield a frequency outside of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1 pin (see Figure 9-2). FIGURE 9-1: CRYSTAL OPERATION (OR CERAMIC RESONATOR) (HS, XT OR LP OSC CONFIGURATION) FIGURE 9-2: EXTERNAL CLOCK INPUT OPERATION (HS, XT, EC, OR LP OSC CONFIGURATION) TABLE 9-1: CAPACITOR SELECTION FOR CERAMIC RESONATORS TABLE 9-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR Note: Additional information on oscillator configurations is available in the PIC® Mid-Range Reference Manual, (DS33023). Note 1: See Table 9-1 and Table 9-2 for recommended values of C1 and C2. 2: A series resistor may be required for AT strip cut crystals. 3: RF varies with the Oscillator mode selected (Approx. value = 10 M C1(1) C2(1) XTAL OSC2 OSC1 RF(3) Sleep To Internal PIC16F630/676 Logic RS(2) Ranges Characterized: Mode Freq OSC1(C1) OSC2(C2) XT 455 kHz 2.0 MHz 4.0 MHz 68-100 pF 15-68 pF 15-68 pF 68-100 pF 15-68 pF 15-68 pF HS 8.0 MHz 16.0 MHz 10-68 pF 10-22 pF 10-68 pF 10-22 pF Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. Mode Freq OSC1(C1) OSC2(C2) LP 32 kHz 68-100 pF 68-100 pF XT 100 kHz 2 MHz 4 MHz 68-150 pF 15-30 pF 15-30 pF 150-200 pF 15-30 pF 15-30 pF HS 8 MHz 10 MHz 20 MHz 15-30 pF 15-30 pF 15-30 pF 15-30 pF 15-30 pF 15-30 pF Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. Clock from External System PIC16F630/676 OSC1 OSC2(1) Open Note 1: Functions as RA4 in EC Osc mode. PIC16F630/676 DS40039F-page 58  2010 Microchip Technology Inc. 9.2.3 EXTERNAL CLOCK IN For applications where a clock is already available elsewhere, users may directly drive the PIC16F630/ 676 provided that this external clock source meets the AC/DC timing requirements listed in Section 12.0 “Electrical Specifications”. Figure 9-2 shows how an external clock circuit should be configured. 9.2.4 RC OSCILLATOR For applications where precise timing is not a requirement, the RC oscillator option is available. The operation and functionality of the RC oscillator is dependent upon a number of variables. The RC oscillator frequency is a function of: • Supply voltage • Resistor (REXT) and capacitor (CEXT) values • Operating temperature The oscillator frequency will vary from unit to unit due to normal process parameter variation. The difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to account for the tolerance of the external R and C components. Figure 9-3 shows how the R/C combination is connected. Two options are available for this Oscillator mode which allow RA4 to be used as a general purpose I/O or to output FOSC/4. FIGURE 9-3: RC OSCILLATOR MODE 9.2.5 INTERNAL 4 MHZ OSCILLATOR When calibrated, the internal oscillator provides a fixed 4 MHz (nominal) system clock. See Electrical Specifications, Section 12.0 “Electrical Specifications”, for information on variation over voltage and temperature. Two options are available for this Oscillator mode which allow RA4 to be used as a general purpose I/O or to output FOSC/4. 9.2.5.1 Calibrating the Internal Oscillator A calibration instruction is programmed into the last location of program memory. This instruction is a RETLW XX, where the literal is the calibration value. The literal is placed in the OSCCAL register to set the calibration of the internal oscillator. Example 9-1 demonstrates how to calibrate the internal oscillator. For best operation, decouple (with capacitance) VDD and VSS as close to the device as possible. EXAMPLE 9-1: CALIBRATING THE INTERNAL OSCILLATOR 9.2.6 CLKOUT The PIC16F630/676 devices can be configured to provide a clock out signal in the INTOSC and RC Oscillator modes. When configured, the oscillator frequency divided by four (FOSC/4) is output on the RA4/OSC2/CLKOUT pin. FOSC/4 can be used for test purposes or to synchronize other logic. RA4/OSC2/CLKOUT CEXT VDD REXT VSS PIC16F630/676 RA5/OSC1/ FOSC/4 Internal Clock CLKIN Note: Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be saved prior to erasing part as specified in the PIC16F630/676 Programming specification. Microchip Development Tools maintain all calibration bits to factory settings. BSF STATUS, RP0 ;Bank 1 CALL 3FFh ;Get the cal value MOVWF OSCCAL ;Calibrate BCF STATUS, RP0 ;Bank 0  2010 Microchip Technology Inc. DS40039F-page 59 PIC16F630/676 9.3 Reset The PIC16F630/676 differentiates between various kinds of Reset: a) Power-on Reset (POR) b) WDT Reset during normal operation c) WDT Reset during Sleep d) MCLR Reset during normal operation e) MCLR Reset during Sleep f) Brown-out Detect (BOD) Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on: • Power-on Reset • MCLR Reset • WDT Reset • WDT Reset during Sleep • Brown-out Detect (BOD) They are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different Reset situations as indicated in Table 9-4. These bits are used in software to determine the nature of the Reset. See Table 9-7 for a full description of Reset states of all registers. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 9-4. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Table 12-4 in Electrical Specifications Section for pulse-width specification. FIGURE 9-4: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT S R Q External Reset MCLR/ VDD OSC1/ WDT Module VDD Rise Detect OST/PWRT On-chip(1) RC OSC WDT Time-out Power-on Reset OST PWRT Chip_Reset 10-bit Ripple Counter Reset Enable OST Enable PWRT SLEEP See Table 9-3 for time-out situations. Note 1: This is a separate oscillator from the INTOSC/EC oscillator. Brown-out Reset BODEN CLKIN pin VPP pin 10-bit Ripple Counter Q PIC16F630/676 DS40039F-page 60  2010 Microchip Technology Inc. 9.3.1 MCLR PIC16F630/676 devices have a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. The behavior of the ESD protection on the MCLR pin has been altered from previous devices of this family. Voltages applied to the pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RC network, as shown in Figure 9-5, is suggested. An internal MCLR option is enabled by setting the MCLRE bit in the Configuration Word. When enabled, MCLR is internally tied to VDD. No internal pull-up option is available for the MCLR pin. FIGURE 9-5: RECOMMENDED MCLR CIRCUIT 9.3.2 POWER-ON RESET (POR) The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply tie the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. A maximum rise time for VDD is required. See Section 12.0 “Electrical Specifications” for details. If the BOD is enabled, the maximum rise time specification does not apply. The BOD circuitry will keep the device in Reset until VDD reaches VBOD (see Section 9.3.5 “Brown-out Detect (BOD)”). When the device starts normal operation (exits the Reset condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. For additional information, refer to Application Note AN607 “Power-up Trouble Shooting.” 9.3.3 POWER-UP TIMER (PWRT) The Power-up Timer provides a fixed 72 ms (nominal) time-out on power-up only, from POR or Brown-out Detect. The Power-up Timer operates on an internal RC oscillator. The chip is kept in Reset as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A Configuration bit, PWRTE can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer should always be enabled when Brown-out Detect is enabled. The Power-up Time delay will vary from chip to chip and due to: • VDD variation • Temperature variation • Process variation. See DC parameters for details (Section 12.0 “Electrical Specifications”). 9.3.4 OSCILLATOR START-UP TIMER (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over. This ensures that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from Sleep. Note: The POR circuit does not produce an internal Reset when VDD declines. VDD PIC16F630/676 MCLR R1 1 kor greater C1 0.1 f (optional, not critical)  2010 Microchip Technology Inc. DS40039F-page 61 PIC16F630/676 9.3.5 BROWN-OUT DETECT (BOD) The PIC16F630/676 members have on-chip Brown-out Detect circuitry. A Configuration bit, BODEN, can disable (if clear/programmed) or enable (if set) the Brown-out Detect circuitry. If VDD falls below VBOD for greater than parameter (TBOD) in Table 12-4 (see Section 12.0 “Electrical Specifications”), the Brown-out situation will reset the device. This will occur regardless of VDD slew-rate. A Reset is not guaranteed to occur if VDD falls below VBOD for less than parameter (TBOD). On any Reset (Power-on, Brown-out Detect, Watchdog, etc.), the chip will remain in Reset until VDD rises above BVDD (see Figure 9-6). The Power-up Timer will now be invoked, if enabled, and will keep the chip in Reset an additional 72 ms. If VDD drops below BVDD while the Power-up Timer is running, the chip will go back into a Brown-out Detect and the Power-up Timer will be re-initialized. Once VDD rises above BVDD, the Power-up Timer will execute a 72 ms Reset. FIGURE 9-6: BROWN-OUT SITUATIONS 9.3.6 TIME-OUT SEQUENCE On power-up, the time-out sequence is as follows: first, PWRT time-out is invoked after POR has expired. Then, OST is activated. The total time-out will vary based on oscillator configuration and PWRTE bit status. For example, in EC mode with PWRTE bit erased (PWRT disabled), there will be no time-out at all. Figure 9-7, Figure 9-8 and Figure 9-9 depict timeout sequences. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then bringing MCLR high will begin execution immediately (see Figure 9-8). This is useful for testing purposes or to synchronize more than one PIC16F630/676 device operating in parallel. Table 9-6 shows the Reset conditions for some special registers, while Table 9-7 shows the Reset conditions for all the registers. 9.3.7 POWER CONTROL (PCON) STATUS REGISTER The power CONTROL/STATUS register, PCON (address 8Eh) has two bits. Bit 0 is BOD (Brown-out). BOD is unknown on Poweron Reset. It must then be set by the user and checked on subsequent Resets to see if BOD = 0, indicating that a brown-out has occurred. The BOD Status bit is a “don’t care” and is not necessarily predictable if the brown-out circuit is disabled (by setting BODEN bit = 0 in the Configuration Word). Bit 1 is POR (Power-on Reset). It is a ‘0’ on Power-on Reset and unaffected otherwise. The user must write a ‘1’ to this bit following a Power-on Reset. On a subsequent Reset, if POR is ‘0’, it will indicate that a Power-on Reset must have occurred (i.e., VDD may have gone too low). Note: A Brown-out Detect does not enable the Power-up Timer if the PWRTE bit in the Configuration Word is set. 72 ms(1) VBOD VDD Internal Reset VBOD VDD Internal Reset 72 ms(1) <72 ms 72 ms(1) VBOD VDD Internal Reset Note 1: 72 ms delay only if PWRTE bit is programmed to ‘0’. PIC16F630/676 DS40039F-page 62  2010 Microchip Technology Inc. TABLE 9-3: TIME-OUT IN VARIOUS SITUATIONS TABLE 9-4: STATUS/PCON BITS AND THEIR SIGNIFICANCE TABLE 9-5: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT TABLE 9-6: INITIALIZATION CONDITION FOR SPECIAL REGISTERS Oscillator Configuration Power-up Brown-out Detect Wake-up from Sleep PWRTE = 0 PWRTE = 1 PWRTE = 0 PWRTE = 1 XT, HS, LP TPWRT + 1024•TOSC 1024•TOSC TPWRT + 1024•TOSC 1024•TOSC 1024•TOSC RC, EC, INTOSC TPWRT — TPWRT — — POR BOD TO PD 0u11 Power-on Reset 1011 Brown-out Detect uu0u WDT Reset uu00 WDT Wake-up uuuu MCLR Reset during normal operation uu10 MCLR Reset during Sleep Legend: u = unchanged, x = unknown Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets(1) 03h STATUS IRP RP1 RPO TO PD Z DC C 0001 1xxx 000q quuu 8Eh PCON — — — — — — POR BOD ---- --0x ---- --uq Legend:u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’, q = value depends on condition. Note 1: Other (non Power-up) Resets include MCLR Reset, Brown-out Detect and Watchdog Timer Reset during normal operation. Condition Program Counter STATUS Register PCON Register Power-on Reset 000h 0001 1xxx ---- --0x MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during Sleep 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 uuuu ---- --uu WDT Wake-up PC + 1 uuu0 0uuu ---- --uu Brown-out Detect 000h 0001 1uuu ---- --10 Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu ---- --uu Legend:u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note 1: When the wake-up is due to an interrupt and global enable bit GIE is set, the PC is loaded with the interrupt vector (0004h) after execution of PC + 1.  2010 Microchip Technology Inc. DS40039F-page 63 PIC16F630/676 TABLE 9-7: INITIALIZATION CONDITION FOR REGISTERS Register Address Power-on Reset • MCLR Reset • WDT Reset • Brown-out Detect(1) • Wake-up from Sleep through interrupt • Wake-up from Sleep through WDT time-out W — xxxx xxxx uuuu uuuu uuuu uuuu INDF 00h/80h — — — TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu PCL 02h/82h 0000 0000 0000 0000 PC + 1(3) STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4) FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu PORTA 05h --xx xxxx --uu uuuu --uu uuuu PORTC 07h --xx xxxx --uu uuuu --uu uuuu PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu INTCON 0Bh/8Bh 0000 0000 0000 000u uuuu uuqq(2) PIR1 0Ch 00-- 0--0 00-- 0--0 qq-- q--q(2,5) T1CON 10h -000 0000 -uuu uuuu -uuu uuuu CMCON 19h -0-0 0000 -0-0 0000 -u-u uuuu ADRESH 1Eh xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 1Fh 00-0 0000 00-0 0000 uu-u uuuu OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu TRISA 85h --11 1111 --11 1111 --uu uuuu TRISC 87h --11 1111 --11 1111 --uu uuuu PIE1 8Ch 00-- 0--0 00-- 0--0 uu-- u--u PCON 8Eh ---- --0x ---- --uu(1,6) ---- --uu OSCCAL 90h 1000 00-- 1000 00-- uuuu uu-- ANSEL 91h 1111 1111 1111 1111 uuuu uuuu WPUA 95h --11 -111 --11 -111 uuuu uuuu IOCA 96h --00 0000 --00 0000 --uu uuuu VRCON 99h 0-0- 0000 0-0- 0000 u-u- uuuu EEDATA 9Ah 0000 0000 0000 0000 uuuu uuuu EEADR 9Bh -000 0000 -000 0000 -uuu uuuu EECON1 9Ch ---- x000 ---- q000 ---- uuuu EECON2 9Dh ---- ---- ---- ---- ---- ---- ADRESL 9Eh xxxx xxxx uuuu uuuu uuuu uuuu ADCON1 9Fh -000 ---- -000 ---- -uuu ---- Legend:u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’, q = value depends on condition. Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. 2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 4: See Table 9-6 for Reset value for specific condition. 5: If wake-up was due to data EEPROM write completing, bit 7 = 1; A/D conversion completing, bit 6 = 1; Comparator input changing, bit 3 = 1; or Timer1 rolling over, bit 0 = 1. All other interrupts generating a wake-up will cause these bits to = u. 6: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u. PIC16F630/676 DS40039F-page 64  2010 Microchip Technology Inc. FIGURE 9-7: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 FIGURE 9-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 FIGURE 9-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) TPWRT TOST VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset TPWRT TOST TPWRT TOST VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset  2010 Microchip Technology Inc. DS40039F-page 65 PIC16F630/676 9.4 Interrupts The PIC16F630/676 has 7 sources of interrupt: • External Interrupt RA2/INT • TMR0 Overflow Interrupt • PORTA Change Interrupts • Comparator Interrupt • A/D Interrupt (PIC16F676 only) • TMR1 Overflow Interrupt • EEPROM Data Write Interrupt The Interrupt Control register (INTCON) and Peripheral Interrupt register (PIR) record individual interrupt requests in flag bits. The INTCON register also has individual and Global Interrupt Enable bits. A Global Interrupt Enable bit, GIE (INTCON<7>) enables (if set) all unmasked interrupts, or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in INTCON register and PIE register. GIE is cleared on Reset. The return from interrupt instruction, RETFIE, exits interrupt routine, as well as sets the GIE bit, which reenables unmasked interrupts. The following interrupt flags are contained in the INTCON register: • INT pin interrupt • PORTA change interrupt • TMR0 overflow interrupt The peripheral interrupt flags are contained in the special register PIR1. The corresponding interrupt enable bit is contained in Special Register PIE1. The following interrupt flags are contained in the PIR register: • EEPROM data write interrupt • A/D interrupt • Comparator interrupt • Timer1 overflow interrupt When an interrupt is serviced: • The GIE is cleared to disable any further interrupt • The return address is pushed onto the stack • The PC is loaded with 0004h Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid RA2/INT recursive interrupts. For external interrupt events, such as the INT pin, or PORTA change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends upon when the interrupt event occurs (see Figure 9-11). The latency is the same for one or twocycle instructions. Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid multiple interrupt requests. Note 1: Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The interrupts which were ignored are still pending to be serviced when the GIE bit is set again. PIC16F630/676 DS40039F-page 66  2010 Microchip Technology Inc. FIGURE 9-10: INTERRUPT LOGIC TMR1IF TMR1IE CMIF CMIE T0IF T0IE INTF INTE RAIF RAIE GIE PEIE Wake-up (If in Sleep mode) Interrupt to CPU EEIE EEIF ADIF ADIE (1) Note 1: PIC16F676 only. IOCA-RA0 IOCA0 IOCA-RA1 IOCA1 IOCA-RA2 IOCA2 IOCA-RA3 IOCA3 IOCA-RA4 IOCA4 IOCA-RA5 IOCA5  2010 Microchip Technology Inc. DS40039F-page 67 PIC16F630/676 9.4.1 RA2/INT INTERRUPT External interrupt on RA2/INT pin is edge-triggered; either rising if INTEDG bit (OPTION<6>) is set, or falling, if INTEDG bit is clear. When a valid edge appears on the RA2/INT pin, the INTF bit (INTCON<1>) is set. This interrupt can be disabled by clearing the INTE control bit (INTCON<4>). The INTF bit must be cleared in software in the Interrupt Service Routine before re-enabling this interrupt. The RA2/INT interrupt can wake-up the processor from Sleep if the INTE bit was set prior to going into Sleep. The status of the GIE bit decides whether or not the processor branches to the interrupt vector following wake-up. See Section 9.7 “Power-Down Mode (Sleep)” for details on Sleep and Figure 9-13 for timing of wake-up from Sleep through RA2/INT interrupt. 9.4.2 TMR0 INTERRUPT An overflow (FFh  00h) in the TMR0 register will set the T0IF (INTCON<2>) bit. The interrupt can be enabled/disabled by setting/clearing T0IE (INTCON<5>) bit. For operation of the Timer0 module, see Section 4.0 “Timer0 Module”. 9.4.3 PORTA INTERRUPT An input change on PORTA change sets the RAIF (INTCON<0>) bit. The interrupt can be enabled/ disabled by setting/clearing the RAIE (INTCON<3>) bit. Plus individual pins can be configured through the IOCA register. 9.4.4 COMPARATOR INTERRUPT See Section 6.9 “Comparator Interrupts” for description of comparator interrupt. 9.4.5 A/D CONVERTER INTERRUPT After a conversion is complete, the ADIF flag (PIR<6>) is set. The interrupt can be enabled/disabled by setting or clearing ADIE (PIE<6>). See Section 7.0 “Analog-to-Digital Converter (A/D) Module (PIC16F676 only)” for operation of the A/D converter interrupt. FIGURE 9-11: INT PIN INTERRUPT TIMING Note: The ANSEL (91h) and CMCON (19h) registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. The ANSEL register is defined for the PIC16F676. Note: If a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then the RAIF interrupt flag may not get set. Q1 Q3 Q4 Q2 Q1 Q3 Q4 Q2 Q1 Q3 Q4 Q2 Q1 Q3 Q4 Q2 Q1 Q3 Q4 Q2 OSC1 CLKOUT INT pin INTF Flag (INTCON<1>) GIE bit (INTCON<7>) INSTRUCTION FLOW PC Instruction Fetched Instruction Executed Interrupt Latency PC PC + 1 PC + 1 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (PC) Inst (PC + 1) Inst (PC - 1) Dummy Cycle Inst (0004h) Inst (PC) — 1 4 5 1 2 3 Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT is available only in RC Oscillator mode. 4: For minimum width of INT pulse, refer to AC specs. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. PIC16F630/676 DS40039F-page 68  2010 Microchip Technology Inc. TABLE 9-8: SUMMARY OF INTERRUPT REGISTERS 9.5 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (e.g., W register and STATUS register). This must be implemented in software. Example 9-2 stores and restores the STATUS and W registers. The user register, W_TEMP, must be defined in both banks and must be defined at the same offset from the bank base address (i.e., W_TEMP is defined at 0x20 in Bank 0 and it must also be defined at 0xA0 in Bank 1). The user register, STATUS_TEMP, must be defined in Bank 0. The Example 9-2: • Stores the W register • Stores the STATUS register in Bank 0 • Executes the ISR code • Restores the Status (and bank select bit register) • Restores the W register EXAMPLE 9-2: SAVING THE STATUS AND W REGISTERS IN RAM 9.6 Watchdog Timer (WDT) The Watchdog Timer is a free running, on-chip RC oscillator, which requires no external components. This RC oscillator is separate from the external RC oscillator of the CLKIN pin. That means that the WDT will run, even if the clock on the OSC1 and OSC2 pins of the device has been stopped (for example, by execution of a SLEEP instruction). During normal operation, a WDT time-out generates a device Reset. If the device is in Sleep mode, a WDT time-out causes the device to wake-up and continue with normal operation. The WDT can be permanently disabled by programming the Configuration bit WDTE as clear (Section 9.1 “Configuration Bits”). 9.6.1 WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see DC specs). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT under software control by writing to the OPTION register. Thus, time-out periods up to 2.3 seconds can be realized. The CLRWDT and SLEEP instructions clear the WDT and the prescaler, if assigned to the WDT, and prevent it from timing out and generating a device Reset. The TO bit in the STATUS register will be cleared upon a Watchdog Timer time-out. 9.6.2 WDT PROGRAMMING CONSIDERATIONS It should also be taken in account that under worstcase conditions (i.e., VDD = Min., Temperature = Max., Max. WDT prescaler) it may take several seconds before a WDT time-out occurs. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 0Bh, 8Bh INTCON GIE PEIE T0IE INTE RAIE T0IF INTF RAIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 00-- 0--0 8Ch PIE1 EEIE ADIE — — CMIE — — TMR1IE 00-- 0--0 00-- 0--0 Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’, q = value depends upon condition. Shaded cells are not used by the Interrupt module. MOVWF W_TEMP ;copy W to temp register, could be in either bank SWAPF STATUS,W ;swap status to be saved into W BCF STATUS,RP0 ;change to bank 0 regardless of current bank MOVWF STATUS_TEMP ;save status to bank 0 register : :(ISR) : SWAPF STATUS_TEMP,W;swap STATUS_TEMP register into W, sets bank to original state MOVWF STATUS ;move W into STATUS register SWAPF W_TEMP,F ;swap W_TEMP SWAPF W_TEMP,W ;swap W_TEMP into W  2010 Microchip Technology Inc. DS40039F-page 69 PIC16F630/676 FIGURE 9-12: WATCHDOG TIMER BLOCK DIAGRAM TABLE 9-9: SUMMARY OF WATCHDOG TIMER REGISTERS T0CKI T0SE pin CLKOUT TMR0 Watchdog Timer WDT Time-out PS0 - PS2 WDTE Data Bus Set Flag bit T0IF on Overflow T0CS Note 1: T0SE, T0CS, PSA, PS0-PS2 are bits in the OPTION register. 0 1 0 1 0 1 SYNC 2 Cycles 8 8 8-bit Prescaler 0 1 (= FOSC/4) PSA PSA PSA Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 81h OPTION_REG RAPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 2007h Config. bits CP BODEN MCLRE PWRTE WDTE F0SC2 F0SC1 F0SC0 uuuu uuuu uuuu uuuu Legend: u = Unchanged, shaded cells are not used by the Watchdog Timer. PIC16F630/676 DS40039F-page 70  2010 Microchip Technology Inc. 9.7 Power-Down Mode (Sleep) The Power-down mode is entered by executing a SLEEP instruction. If the Watchdog Timer is enabled: • WDT will be cleared but keeps running • PD bit in the STATUS register is cleared • TO bit is set • Oscillator driver is turned off • I/O ports maintain the status they had before SLEEP was executed (driving high, low, or high-impedance). For lowest current consumption in this mode, all I/O pins should be either at VDD, or VSS, with no external circuitry drawing current from the I/O pin and the comparators and CVREF should be disabled. I/O pins that are high-impedance inputs should be pulled high or low externally to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pull-ups on PORTA should be considered. The MCLR pin must be at a logic high level (VIHMC). 9.7.1 WAKE-UP FROM SLEEP The device can wake-up from Sleep through one of the following events: 1. External Reset input on MCLR pin 2. Watchdog Timer Wake-up (if WDT was enabled) 3. Interrupt from RA2/INT pin, PORTA change, or a peripheral interrupt. The first event will cause a device Reset. The two latter events are considered a continuation of program execution. The TO and PD bits in the STATUS register can be used to determine the cause of device Reset. The PD bit, which is set on power-up, is cleared when Sleep is invoked. TO bit is cleared if WDT Wake-up occurred. When the SLEEP instruction is being executed, the next instruction (PC + 1) is pre-fetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction, then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have an NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. FIGURE 9-13: WAKE-UP FROM SLEEP THROUGH INTERRUPT Note: It should be noted that a Reset generated by a WDT time-out does not drive MCLR pin low. Note: If the global interrupts are disabled (GIE is cleared), but any interrupt source has both its interrupt enable bit and the corresponding interrupt flag bits set, the device will immediately wake-up from Sleep. The SLEEP instruction is completely executed. Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT(4) INT pin INTF flag (INTCON<1>) GIE bit (INTCON<7>) INSTRUCTION FLOW PC Instruction Fetched Instruction Executed PC PC+1 PC+2 Inst(PC) = Sleep Inst(PC - 1) Inst(PC + 1) Sleep Processor in Sleep Interrupt Latency (Note 3) Inst(PC + 2) Inst(PC + 1) Inst(0004h) Inst(0005h) Dummy cycle Inst(0004h) PC + 2 0004h 0005h Dummy cycle TOST(2) PC+2 Note 1: XT, HS or LP Oscillator mode assumed. 2: TOST = 1024TOSC (drawing not to scale). Approximately 1 s delay for RC Oscillator mode. See Section 12 for wake-up from Sleep delay in INTOSC mode. 3: GIE = 1 assumed. In this case after wake-up, the processor jumps to the interrupt routine. If GIE = 0, execution will continue in-line. 4: CLKOUT is not available in XT, HS, LP or EC Osc modes, but shown here for timing reference.  2010 Microchip Technology Inc. DS40039F-page 71 PIC16F630/676 9.8 Code Protection If the code protection bit(s) have not been programmed, the on-chip program memory can be read out for verification purposes. 9.9 ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution but are readable and writable during Program/Verify. Only the Least Significant 7 bits of the ID locations are used. 9.10 In-Circuit Serial Programming The PIC16F630/676 microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for: • power • ground • programming voltage This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. The device is placed into a Program/Verify mode by holding the RA0 and RA1 pins low, while raising the MCLR (VPP) pin from VIL to VIHH (see Programming Specification). RA0 becomes the programming data and RA1 becomes the programming clock. Both RA0 and RA1 are Schmitt Trigger inputs in this mode. After Reset, to place the device into Programming/Verify mode, the program counter (PC) is at location 00h. A 6-bit command is then supplied to the device. Depending on the command, 14 bits of program data are then supplied to or from the device, depending on whether the command was a load or a read. For complete details of serial programming, please refer to the PIC16F630/676 Programming Specification. A typical In-Circuit Serial Programming connection is shown in Figure 9-14. FIGURE 9-14: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION 9.11 In-Circuit Debugger Since in-circuit debugging requires the loss of clock, data and MCLR pins, MPLAB® ICD 2 development with an 14-pin device is not practical. A special 20-pin PIC16F676-ICD device is used with MPLAB ICD 2 to provide separate clock, data and MCLR pins and frees all normally available pins to the user. This special ICD device is mounted on the top of the header and its signals are routed to the MPLAB ICD 2 connector. On the bottom of the header is an 14-pin socket that plugs into the user’s target via the 14-pin stand-off connector. When the ICD pin on the PIC16F676-ICD device is held low, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB ICD 2. When the microcontroller has this feature enabled, some of the resources are not available for general use. Table 9-10 shows which features are consumed by the background debugger: TABLE 9-10: DEBUGGER RESOURCES For more information, see 14-Pin MPLAB ICD 2 Header Information Sheet (DS51292) available on Microchip’s web site (www.microchip.com). Note: The entire data EEPROM and Flash program memory will be erased when the code protection is turned off. The INTOSC calibration data is also erased. See PIC16F630/676 Programming Specification for more information. I/O pins ICDCLK, ICDDATA Stack 1 level Program Memory Address 0h must be NOP 300h-3FEh External Connector Signals To Normal Connections To Normal Connections PIC16F630/676 VDD VSS RA3/MCLR/VPP RA1 RA0 +5V 0V VPP CLK Data I/O VDD PIC16F630/676 DS40039F-page 72  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS40039F-page 73 PIC16F630/676 10.0 INSTRUCTION SET SUMMARY The PIC16F630/676 instruction set is highly orthogonal and is comprised of three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 14-bit word divided into an opcode, which specifies the instruction type, and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 10-1, while the various opcode fields are summarized in Table 10-1. Table 10-2 lists the instructions recognized by the MPASMTM assembler. A complete description of each instruction is also available in the PIC® Mid-Range Reference Manual (DS33023). For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator, which selects the bit affected by the operation, while ‘f’ represents the address of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8-bit or 11-bit constant, or literal value One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 s. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as a NOP. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. 10.1 READ-MODIFY-WRITE OPERATIONS Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction, or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. For example, a CLRF PORTA instruction will read PORTA, clear all the data bits, then write the result back to PORTA. This example would have the unintended result of clearing the condition that set the RAIF flag. TABLE 10-1: OPCODE FIELD DESCRIPTIONS FIGURE 10-1: GENERAL FORMAT FOR INSTRUCTIONS Note: To maintain upward compatibility with future products, do not use the OPTION and TRIS instructions. Field Description f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-out bit PD Power-down bit Byte-oriented file register operations 13 8 7 6 0 d = 0 for destination W OPCODE d f (FILE #) d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 0 OPCODE b (BIT #) f (FILE #) b = 3-bit bit address f = 7-bit file register address Literal and control operations 13 8 7 0 OPCODE k (literal) k = 8-bit immediate value 13 11 10 0 OPCODE k (literal) k = 11-bit immediate value General CALL and GOTO instructions only PIC16F630/676 DS40039F-page 74  2010 Microchip Technology Inc. TABLE 10-2: PIC16F630/676 INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode Status Affected Notes MSb LSb BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f - f, d f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff C,DC,Z Z Z Z Z Z Z Z Z C C C,DC,Z Z 1,2 1,2 2 1,2 1,2 1,2,3 1,2 1,2,3 1,2 1,2 1,2 1,2 1,2 1,2 1,2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 1,2 1,2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW k k k - k k k - k - - k k Add literal and W AND literal with W Call subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk C,DC,Z Z TO,PD Z TO,PD C,DC,Z Z Note 1: When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. 3: If Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Note: Additional information on the mid-range instruction set is available in the PIC® Mid-Range MCU Family Reference Manual (DS33023).  2010 Microchip Technology Inc. DS40039F-page 75 PIC16F630/676 10.2 Instruction Descriptions ADDLW Add Literal and W Syntax: [label] ADDLW k Operands: 0  k  255 Operation: (W) + k  (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the eight-bit literal ‘k’ and the result is placed in the W register. ADDWF Add W and f Syntax: [label] ADDWF f,d Operands: 0  f  127 d  Operation: (W) + (f)  (destination) Status Affected: C, DC, Z Description: Add the contents of the W register with register ‘f’. If ‘d’ is 0, the result is stored in the W register. If ‘d’ is 1, the result is stored back in register ‘f’. ANDLW AND Literal with W Syntax: [label] ANDLW k Operands: 0  k  255 Operation: (W) .AND. (k)  (W) Status Affected: Z Description: The contents of W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. ANDWF AND W with f Syntax: [label] ANDWF f,d Operands: 0  f  127 d  Operation: (W) .AND. (f)  (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is 0, the result is stored in the W register. If ‘d’ is 1, the result is stored back in register ‘f’. BCF Bit Clear f Syntax: [label] BCF f,b Operands: 0  f  127 0  b  7 Operation: 0  (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [label] BSF f,b Operands: 0  f  127 0  b  7 Operation: 1  (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. BTFSS Bit Test f, Skip if Set Syntax: [label] BTFSS f,b Operands: 0  f  127 0  b < 7 Operation: skip if (f) = 1 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and a NOP is executed instead, making this a 2-cycle instruction. BTFSC Bit Test, Skip if Clear Syntax: [label] BTFSC f,b Operands: 0  f  127 0  b  7 Operation: skip if (f) = 0 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. PIC16F630/676 DS40039F-page 76  2010 Microchip Technology Inc. CALL Call Subroutine Syntax: [ label ] CALL k Operands: 0  k  2047 Operation: (PC)+ 1 TOS, k  PC<10:0>, (PCLATH<4:3>)  PC<12:11> Status Affected: None Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. CLRF Clear f Syntax: [label] CLRF f Operands: 0  f  127 Operation: 00h  (f) 1  Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h  (W) 1  Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h  WDT 0  WDT prescaler, 1  TO 1  PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. COMF Complement f Syntax: [ label ] COMF f,d Operands: 0  f  127 d  [0,1] Operation: (f)  (destination) Status Affected: Z Description: The contents of register ‘f’ are complemented. If ‘d’ is 0, the result is stored in W. If ‘d’ is 1, the result is stored back in register ‘f’. DECF Decrement f Syntax: [label] DECF f,d Operands: 0  f  127 d  [0,1] Operation: (f) - 1  (destination) Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is 0, the result is stored in the W register. If ‘d’ is 1, the result is stored back in register ‘f’.  2010 Microchip Technology Inc. DS40039F-page 77 PIC16F630/676 DECFSZ Decrement f, Skip if 0 Syntax: [ label ] DECFSZ f,d Operands: 0  f  127 d  [0,1] Operation: (f) - 1  (destination); skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is 0, the result is placed in the W register. If ‘d’ is 1, the result is placed back in register ‘f’. If the result is 1, the next instruction is executed. If the result is 0, then a NOP is executed instead, making it a 2-cycle instruction. GOTO Unconditional Branch Syntax: [ label ] GOTO k Operands: 0  k  2047 Operation: k  PC<10:0> PCLATH<4:3>  PC<12:11> Status Affected: None Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a twocycle instruction. INCF Increment f Syntax: [ label ] INCF f,d Operands: 0  f  127 d  [0,1] Operation: (f) + 1  (destination) Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is 0, the result is placed in the W register. If ‘d’ is 1, the result is placed back in register ‘f’. INCFSZ Increment f, Skip if 0 Syntax: [ label ] INCFSZ f,d Operands: 0  f  127 d  [0,1] Operation: (f) + 1  (destination), skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are incremented. If ‘d’ is 0, the result is placed in the W register. If ‘d’ is 1, the result is placed back in register ‘f’. If the result is 1, the next instruction is executed. If the result is 0, a NOP is executed instead, making it a 2-cycle instruction. IORLW Inclusive OR Literal with W Syntax: [ label ] IORLW k Operands: 0  k  255 Operation: (W) .OR. k  (W) Status Affected: Z Description: The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. IORWF Inclusive OR W with f Syntax: [ label ] IORWF f,d Operands: 0  f  127 d  [0,1] Operation: (W) .OR. (f)  (destination) Status Affected: Z Description: Inclusive OR the W register with register ‘f’. If ‘d’ is 0, the result is placed in the W register. If ‘d’ is 1, the result is placed back in register ‘f’. PIC16F630/676 DS40039F-page 78  2010 Microchip Technology Inc. MOVF Move f Syntax: [ label ] MOVF f,d Operands: 0  f  127 d  [0,1] Operation: (f)  (destination) Status Affected: Z Description: The contents of register f are moved to a destination dependant upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register, since status flag Z is affected. MOVLW Move Literal to W Syntax: [ label ] MOVLW k Operands: 0  k  255 Operation: k  (W) Status Affected: None Description: The eight-bit literal ‘k’ is loaded into W register. The don’t cares will assemble as 0’s. MOVWF Move W to f Syntax: [ label ] MOVWF f Operands: 0  f  127 Operation: (W)  (f) Status Affected: None Description: Move data from W register to register ‘f’. NOP No Operation Syntax: [ label ] NOP Operands: None Operation: No operation Status Affected: None Description: No operation. RETFIE Return from Interrupt Syntax: [ label ] RETFIE Operands: None Operation: TOS  PC, 1  GIE Status Affected: None RETLW Return with Literal in W Syntax: [ label ] RETLW k Operands: 0  k  255 Operation: k  (W); TOS  PC Status Affected: None Description: The W register is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction.  2010 Microchip Technology Inc. DS40039F-page 79 PIC16F630/676 RLF Rotate Left f through Carry Syntax: [ label ] RLF f,d Operands: 0  f  127 d  [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry Flag. If ‘d’ is 0, the result is placed in the W register. If ‘d’ is 1, the result is stored back in register ‘f’. RETURN Return from Subroutine Syntax: [ label ] RETURN Operands: None Operation: TOS  PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. RRF Rotate Right f through Carry Syntax: [ label ] RRF f,d Operands: 0  f  127 d  [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry Flag. If ‘d’ is 0, the result is placed in the W register. If ‘d’ is 1, the result is placed back in register ‘f’. C Register f C Register f SLEEP Syntax: [ label ] SLEEP Operands: None Operation: 00h  WDT, 0  WDT prescaler, 1  TO, 0  PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. SUBLW Subtract W from Literal Syntax: [ label ] SUBLW k Operands: 0 k 255 Operation: k - (W) W) Status Affected: C, DC, Z Description: The W register is subtracted (2’s complement method) from the eight-bit literal ‘k’. The result is placed in the W register. SUBWF Subtract W from f Syntax: [ label ] SUBWF f,d Operands: 0 f 127 d  [0,1] Operation: (f) - (W) destination) Status Affected: C, DC, Z Description: Subtract (2’s complement method) W register from register ‘f’. If ‘d’ is 0, the result is stored in the W register. If ‘d’ is 1, the result is stored back in register ‘f’. PIC16F630/676 DS40039F-page 80  2010 Microchip Technology Inc. SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0  f  127 d  [0,1] Operation: (f<3:0>)  (destination<7:4>), (f<7:4>)  (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is 0, the result is placed in the W register. If ‘d’ is 1, the result is placed in register ‘f’. XORLW Exclusive OR Literal with W Syntax: [label] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. XORWF Exclusive OR W with f Syntax: [label] XORWF f,d Operands: 0  f  127 d  [0,1] Operation: (W) .XOR. (f) destination) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is 0, the result is stored in the W register. If ‘d’ is 1, the result is stored back in register ‘f’.  2010 Microchip Technology Inc. DS40039F-page 81 PIC16F630/676 11.0 DEVELOPMENT SUPPORT The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 11.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. PIC16F630/676 DS40039F-page 82  2010 Microchip Technology Inc. 11.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 11.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 11.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 11.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 11.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire device instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility  2010 Microchip Technology Inc. DS40039F-page 83 PIC16F630/676 11.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 11.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 11.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip’s most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 11.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer’s PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. PIC16F630/676 DS40039F-page 84  2010 Microchip Technology Inc. 11.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 11.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. 11.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.  2010 Microchip Technology Inc. DS40039F-page 85 PIC16F630/676 12.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings† Ambient temperature under bias........................................................................................................... -40 to +125°C Storage temperature ........................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS ..................................................................................................... -0.3 to +6.5V Voltage on MCLR with respect to Vss ..................................................................................................-0.3 to +13.5V Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ...............................................................................................................................800 mW Maximum current out of VSS pin ..................................................................................................................... 300 mA Maximum current into VDD pin ........................................................................................................................ 250 mA Input clamp current, IIK (VI < 0 or VI > VDD)20 mA Output clamp current, IOK (Vo < 0 or Vo >VDD)20 mA Maximum output current sunk by any I/O pin.................................................................................................... 25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Maximum current sunk by PORTA and PORTC (combined) .......................................................................... 200 mA Maximum current sourced PORTA and PORTC (combined).......................................................................... 200 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD -  IOH} +  {(VDD-VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100  should be used when applying a “low” level to the MCLR pin, rather than pulling this pin directly to VSS. PIC16F630/676 DS40039F-page 86  2010 Microchip Technology Inc. FIGURE 12-1: PIC16F630/676 WITH A/D DISABLED VOLTAGE-FREQUENCY GRAPH, -40°C  TA  +125°C FIGURE 12-2: PIC16F676 WITH A/D ENABLED VOLTAGE-FREQUENCY GRAPH, -40°C  TA  +125°C 5.5 2.0 3.5 2.5 0 3.0 4.0 4.5 5.0 4 Frequency (MHz) VDD (Volts) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 8 16 10 12 20 5.5 2.0 3.5 2.5 0 3.0 4.0 4.5 5.0 4 Frequency (MHz) VDD (Volts) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 8 16 10 12 20  2010 Microchip Technology Inc. DS40039F-page 87 PIC16F630/676 FIGURE 12-3: PIC16F676 WITH A/D ENABLED VOLTAGE-FREQUENCY GRAPH, 0°C  TA  +125°C 5.5 2.0 3.5 2.5 0 3.0 4.0 4.5 5.0 4 Frequency (MHz) VDD (Volts) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 8 16 10 12 20 2.2 PIC16F630/676 DS40039F-page 88  2010 Microchip Technology Inc. 12.1 DC Characteristics: PIC16F630/676-I (Industrial), PIC16F630/676-E (Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions D001 D001A D001B D001C D001D VDD Supply Voltage 2.0 2.2 2.5 3.0 4.5 — — — — — 5.5 5.5 5.5 5.5 5.5 V V V V V FOSC < = 4 MHz: PIC16F630/676 with A/D off PIC16F676 with A/D on, 0°C to +125°C PIC16F676 with A/D on, -40°C to +125°C 4 MHZ < FOSC < = 10 MHz D002 VDR RAM Data Retention Voltage(1) 1.5* — — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — V See section on Power-on Reset for details D004 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05* — — V/ms See section on Power-on Reset for details D005 VBOD — 2.1 — V * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.  2010 Microchip Technology Inc. DS40039F-page 89 PIC16F630/676 12.2 DC Characteristics: PIC16F630/676-I (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +85C for industrial Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note D010 Supply Current (IDD) — 9 16 A 2.0 FOSC = 32 kHz — 18 28 LP Oscillator Mode A 3.0 — 35 54 A 5.0 D011 — 110 150 A 2.0 FOSC = 1 MHz — 190 280 XT Oscillator Mode A 3.0 — 330 450 A 5.0 D012 — 220 280 A 2.0 FOSC = 4 MHz — 370 650 XT Oscillator Mode A 3.0 — 0.6 1.4 mA 5.0 D013 — 70 110 A 2.0 FOSC = 1 MHz — 140 250 EC Oscillator Mode A 3.0 — 260 390 A 5.0 D014 — 180 250 A 2.0 FOSC = 4 MHz — 320 470 EC Oscillator Mode A 3.0 — 580 850 A 5.0 D015 — 340 450 A 2.0 FOSC = 4 MHz — 500 780 INTOSC Mode A 3.0 — 0.8 1.1 mA 5.0 D016 — 180 250 A 2.0 FOSC = 4 MHz — 320 450 EXTRC Mode A 3.0 — 580 800 A 5.0 D017 — 2.1 2.95 mA 4.5 FOSC = 20 MHz — 2.4 3.0 mA 5.0 HS Oscillator Mode † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. PIC16F630/676 DS40039F-page 90  2010 Microchip Technology Inc. 12.3 DC Characteristics: PIC16F630/676-I (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +85C for industrial Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note D020 Power-down Base Current (IPD) — 0.99 700 nA 2.0 WDT, BOD, Comparators, VREF, — 1.2 770 nA 3.0 and T1OSC disabled — 2.9 995 nA 5.0 D021 — 0.3 1.5 A 2.0 WDT Current(1) — 1.8 3.5 A 3.0 — 8.4 17 A 5.0 D022 — 58 70 A 3.0 BOD Current(1) — 109 130 A 5.0 D023 — 3.3 6.5 A 2.0 Comparator Current(1) — 6.1 8.5 A 3.0 — 11.5 16 A 5.0 D024 — 58 70 A 2.0 CVREF Current(1) — 85 100 A 3.0 — 138 160 A 5.0 D025 — 4.0 6.5 A 2.0 T1 OSC Current(1) — 4.6 7.0 A 3.0 — 6.0 10.5 A 5.0 D026 — 1.2 755 nA 3.0 A/D Current(1) — 0.0022 1.0 A 5.0 † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.  2010 Microchip Technology Inc. DS40039F-page 91 PIC16F630/676 12.4 DC Characteristics: PIC16F630/676-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +125C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note D010E Supply Current (IDD) — 9 16 A 2.0 FOSC = 32 kHz — 18 28 LP Oscillator Mode A 3.0 — 35 54 A 5.0 D011E — 110 150 A 2.0 FOSC = 1 MHz — 190 280 XT Oscillator Mode A 3.0 — 330 450 A 5.0 D012E — 220 280 A 2.0 FOSC = 4 MHz — 370 650 XT Oscillator Mode A 3.0 — 0.6 1.4 mA 5.0 D013E — 70 110 A 2.0 FOSC = 1 MHz — 140 250 EC Oscillator Mode A 3.0 — 260 390 A 5.0 D014E — 180 250 A 2.0 FOSC = 4 MHz — 320 470 EC Oscillator Mode A 3.0 — 580 850 A 5.0 D015E — 340 450 A 2.0 FOSC = 4 MHz — 500 780 INTOSC Mode A 3.0 — 0.8 1.1 mA 5.0 D016E — 180 250 A 2.0 FOSC = 4 MHz — 320 450 EXTRC Mode A 3.0 — 580 800 A 5.0 D017E — 2.1 2.95 mA 4.5 FOSC = 20 MHz — 2.4 3.0 mA 5.0 HS Oscillator Mode † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. PIC16F630/676 DS40039F-page 92  2010 Microchip Technology Inc. 12.5 DC Characteristics: PIC16F630/676-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +125C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note D020E Power-down Base Current (IPD) — 0.00099 3.5 A 2.0 WDT, BOD, Comparators, VREF, — 0.0012 4.0 and T1OSC disabled A 3.0 — 0.0029 8.0 A 5.0 D021E — 0.3 6.0 A 2.0 WDT Current(1) — 1.8 9.0 A 3.0 — 8.4 20 A 5.0 D022E — 58 70 A 3.0 BOD Current(1) — 109 130 A 5.0 D023E — 3.3 10 A 2.0 Comparator Current(1) — 6.1 13 A 3.0 — 11.5 24 A 5.0 D024E — 58 70 A 2.0 CVREF Current(1) — 85 100 A 3.0 — 138 165 A 5.0 D025E — 4.0 10 A 2.0 T1 OSC Current(1) — 4.6 12 A 3.0 — 6.0 20 A 5.0 D026E — 0.0012 6.0 A 3.0 A/D Current(1) — 0.0022 8.5 A 5.0 † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.  2010 Microchip Technology Inc. DS40039F-page 93 PIC16F630/676 12.6 DC Characteristics: PIC16F630/676-I (Industrial), PIC16F630/676-E (Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions Input Low Voltage VIL I/O ports D030 with TTL buffer VSS — 0.8 V 4.5V  VDD  5.5V D030A VSS — 0.15 VDD V Otherwise D031 with Schmitt Trigger buffer VSS — 0.2 VDD V Entire range D032 MCLR, OSC1 (RC mode) VSS — 0.2 VDD V D033 OSC1 (XT and LP modes) VSS — 0.3 V (Note 1) D033A OSC1 (HS mode) VSS — 0.3 VDD V (Note 1) Input High Voltage VIH I/O ports — D040 D040A with TTL buffer 2.0 (0.25 VDD+0.8) — — VDD VDD V V 4.5V  VDD 5.5V otherwise D041 with Schmitt Trigger buffer 0.8 VDD — VDD entire range D042 MCLR 0.8 VDD — VDD V D043 OSC1 (XT and LP modes) 1.6 — VDD V (Note 1) D043A OSC1 (HS mode) 0.7 VDD — VDD V (Note 1) D043B OSC1 (RC mode) 0.9 VDD — VDD V D070 IPUR PORTA Weak Pull-up Current 50* 250 400* A VDD = 5.0V, VPIN = VSS Input Leakage Current(3) D060 IIL I/O ports — 01 1 A VSS VPIN VDD, Pin at high-impedance D060A Analog inputs — 01 1 A VSS VPIN VDD D060B VREF — 01 1 A VSS VPIN VDD D061 MCLR(2) — 01 5 A VSS VPIN VDD D063 OSC1 — 01 5 A VSS VPIN VDD, XT, HS and LP osc configuration Output Low Voltage D080 VOL I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 4.5V (Ind.) D083 OSC2/CLKOUT (RC mode) — — 0.6 V IOL = 1.6 mA, VDD = 4.5V (Ind.) IOL = 1.2 mA, VDD = 4.5V (Ext.) Output High Voltage D090 VOH I/O ports VDD - 0.7 — — V IOH = -3.0 mA, VDD = 4.5V (Ind.) D092 OSC2/CLKOUT (RC mode) VDD - 0.7 — — V IOH = -1.3 mA, VDD = 4.5V (Ind.) IOH = -1.0 mA, VDD = 4.5V (Ext.) * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. PIC16F630/676 DS40039F-page 94  2010 Microchip Technology Inc. 12.7 DC Characteristics: PIC16F630/676-I (Industrial), PIC16F630/676-E (Extended) (Cont.) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions Capacitive Loading Specs on Output Pins D100 COSC2 OSC2 pin — — 15* pF In XT, HS and LP modes when external clock is used to drive OSC1 D101 CIO All I/O pins — — 50* pF Data EEPROM Memory D120 ED Byte Endurance 100K 1M — E/W -40C  TA +85°C D120A ED Byte Endurance 10K 100K — E/W +85°C  TA +125°C D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write VMIN = Minimum operating voltage D122 TDEW Erase/Write cycle time — 5 6 ms D123 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated D124 TREF Number of Total Erase/Write Cycles before Refresh(1) 1M 10M — E/W -40C  TA +85°C Program Flash Memory D130 EP Cell Endurance 10K 100K — E/W -40C  TA +85°C D130A ED Cell Endurance 1K 10K — E/W +85°C  TA +125°C D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating voltage D132 VPEW VDD for Erase/Write 4.5 — 5.5 V D133 TPEW Erase/Write cycle time — 2 2.5 ms D134 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated * These parameters are characterized but not tested. † Data in ‘Typ’ column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: See Section 8.5.1 for additional information.  2010 Microchip Technology Inc. DS40039F-page 95 PIC16F630/676 12.8 TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created with one of the following formats: FIGURE 12-4: LOAD CONDITIONS 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKOUT rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O port t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance VDD/2 CL RL Pin Pin VSS VSS CL RL = 464 CL = 50 pF for all pins 15 pF for OSC2 output Load Condition 1 Load Condition 2 Legend: PIC16F630/676 DS40039F-page 96  2010 Microchip Technology Inc. 12.9 AC CHARACTERISTICS: PIC16F630/676 (INDUSTRIAL, EXTENDED) FIGURE 12-5: EXTERNAL CLOCK TIMING TABLE 12-1: EXTERNAL CLOCK TIMING REQUIREMENTS Param No. Sym Characteristic Min Typ† Max Units Conditions FOSC External CLKIN Frequency(1) DC — 37 kHz LP Osc mode DC — 4 MHz XT mode DC — 20 MHz HS mode DC — 20 MHz EC mode Oscillator Frequency(1) 5 — 37 kHz LP Osc mode — 4 — MHz INTOSC mode DC — 4 MHz RC Osc mode 0.1 — 4 MHz XT Osc mode 1 — 20 MHz HS Osc mode 1 TOSC External CLKIN Period(1) 27 —  s LP Osc mode 50 —  ns HS Osc mode 50 —  ns EC Osc mode 250 —  ns XT Osc mode Oscillator Period(1) 27 200 s LP Osc mode — 250 — ns INTOSC mode 250 — — ns RC Osc mode 250 — 10,000 ns XT Osc mode 50 — 1,000 ns HS Osc mode 2 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC 3 TosL, TosH External CLKIN (OSC1) High External CLKIN Low 2* — — s LP oscillator, TOSC L/H duty cycle 20* — — ns HS oscillator, TOSC L/H duty cycle 100 * — — ns XT oscillator, TOSC L/H duty cycle 4 TosR, TosF External CLKIN Rise External CLKIN Fall — — 50* ns LP oscillator — — 25* ns XT oscillator — — 15* ns HS oscillator * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. OSC1 CLKOUT Q4 Q1 Q2 Q3 Q4 Q1 1 2 3 3 4 4  2010 Microchip Technology Inc. DS40039F-page 97 PIC16F630/676 TABLE 12-2: PRECISION INTERNAL OSCILLATOR PARAMETERS Param No. Sym Characteristic Freq Tolerance Min Typ† Max Units Conditions F10 FOSC Internal Calibrated INTOSC Frequency 1 3.96 4.00 4.04 MHz VDD = 3.5V, 25C 2 3.92 4.00 4.08 MHz 2.5V VDD  5.5V 0C  TA  +85C 5 3.80 4.00 4.20 MHz 2.0V VDD  5.5V -40C  TA  +85C (IND) -40C  TA  +125C (EXT) F14 TIOSC ST Oscillator Wake-up from Sleep start-up time* — —6 8 s VDD = 2.0V, -40C to +85C — —4 6 s VDD = 3.0V, -40C to +85C — —3 5 s VDD = 5.0V, -40C to +85C * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. PIC16F630/676 DS40039F-page 98  2010 Microchip Technology Inc. FIGURE 12-6: CLKOUT AND I/O TIMING TABLE 12-3: CLKOUT AND I/O TIMING REQUIREMENTS Param No. Sym Characteristic Min Typ† Max Units Conditions 10 TosH2ckL OSC1 to CLOUT — 75 200 ns (Note 1) 11 TosH2ckH OSC1 to CLOUT — 75 200 ns (Note 1) 12 TckR CLKOUT rise time — 35 100 ns (Note 1) 13 TckF CLKOUT fall time — 35 100 ns (Note 1) 14 TckL2ioV CLKOUT to Port out valid — — 20 ns (Note 1) 15 TioV2ckH Port in valid before CLKOUT TOSC + 200 ns — — ns (Note 1) 16 TckH2ioI Port in hold after CLKOUT 0 — — ns (Note 1) 17 TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 * ns — — 300 ns 18 TosH2ioI OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) 100 — — ns 19 TioV2osH Port input valid to OSC1 (I/O in setup time) 0 — — ns 20 TioR Port output rise time — 10 40 ns 21 TioF Port output fall time — 10 40 ns 22 Tinp INT pin high or low time 25 — — ns 23 Trbp PORTA change INT high or low time TCY — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4xTOSC. OSC1 CLKOUT I/O pin (Input) I/O pin (Output) Q4 Q1 Q2 Q3 10 13 14 17 20, 21 22 23 19 18 15 11 12 16 Old Value New Value  2010 Microchip Technology Inc. DS40039F-page 99 PIC16F630/676 FIGURE 12-7: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING FIGURE 12-8: BROWN-OUT DETECT TIMING AND CHARACTERISTICS VDD MCLR Internal POR PWRT Time-out OSC Time-out Internal Reset Watchdog Timer Reset 33 32 30 31 34 I/O Pins 34 BVDD Reset (due to BOD) VDD (Device in Brown-out Detect) (Device not in Brown-out Detect) 72 ms time-out(1) 35 Note 1: 72 ms delay only if PWRTE bit in Configuration Word is programmed to ‘0’. PIC16F630/676 DS40039F-page 100  2010 Microchip Technology Inc. TABLE 12-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT DETECT REQUIREMENTS Param No. Sym Characteristic Min Typ† Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 11 — 18 — 24 s ms VDD = 5V, -40°C to +85°C Extended temperature 31 TWDT Watchdog Timer Time-out Period (No Prescaler) 10 10 17 17 25 30 ms ms VDD = 5V, -40°C to +85°C Extended temperature 32 TOST Oscillation Start-up Timer Period — 1024TOSC — —TOSC = OSC1 period 33* TPWRT Power-up Timer Period 28* TBD 72 TBD 132* TBD ms ms VDD = 5V, -40°C to +85°C Extended Temperature 34 TIOZ I/O High-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 s BVDD Brown-out Detect Voltage 2.025 — 2.175 V Brown-out Hysteresis TBD — — — 35 TBOD Brown-out Detect Pulse Width 100* — — s VDD  BVDD (D005) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.  2010 Microchip Technology Inc. DS40039F-page 101 PIC16F630/676 FIGURE 12-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS TABLE 12-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Param No. Sym Characteristic Min Typ† Max Units Conditions 40* Tt0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 42* Tt0P T0CKI Period Greater of: 20 or TCY + 40 N — — ns N = prescale value (2, 4, ..., 256) 45* Tt1H T1CKI High Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 46* Tt1L T1CKI Low Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 47* Tt1P T1CKI Input Period Synchronous Greater of: 30 or TCY + 40 N — — ns N = prescale value (1, 2, 4, 8) Asynchronous 60 — — ns Ft1 Timer1 oscillator input frequency range (oscillator enabled by setting bit T1OSCEN) DC — 200* kHz 48 TCKEZtmr1 Delay from external clock edge to timer increment 2 TOSC* — 7 TOSC* — * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. T0CKI T1CKI 40 41 42 45 46 47 48 TMR0 or TMR1 PIC16F630/676 DS40039F-page 102  2010 Microchip Technology Inc. TABLE 12-6: COMPARATOR SPECIFICATIONS TABLE 12-7: COMPARATOR VOLTAGE REFERENCE SPECIFICATIONS Comparator Specifications Standard Operating Conditions -40°C to +125°C (unless otherwise stated) Sym Characteristics Min Typ Max Units Comments VOS Input Offset Voltage —  5.0  10 mV VCM Input Common Mode Voltage 0 — VDD - 1.5 V CMRR Common Mode Rejection Ratio +55* — — db TRT Response Time(1) — 150 400* ns TMC2COV Comparator Mode Change to Output Valid — — 10* s * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD - 1.5)/2 while the other input transitions from VSS to VDD - 1.5V. Voltage Reference Specifications Standard Operating Conditions -40°C to +125°C (unless otherwise stated) Sym Characteristics Min Typ Max Units Comments Resolution — — VDD/24* VDD/32 — — LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Absolute Accuracy — — — —  1/2* 1/2* LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Unit Resistor Value (R) — 2k* —  Settling Time(1) — — 10* s * These parameters are characterized but not tested. Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from 0000 to 1111.  2010 Microchip Technology Inc. DS40039F-page 103 PIC16F630/676 TABLE 12-8: PIC16F676 A/D CONVERTER CHARACTERISTICS: Param No. Sym Characteristic Min Typ† Max Units Conditions A01 NR Resolution — — 10 bits bit A02 EABS Total Absolute Error* — — 1 LSb VREF = 5.0V A03 EIL Integral Error — — 1 LSb VREF = 5.0V A04 EDL Differential Error — — 1 LSb No missing codes to 10 bits VREF = 5.0V A05 EFS Full Scale Range 2.2* — 5.5* V A06 EOFF Offset Error — — 1 LSb VREF = 5.0V A07 EGN Gain Error — — 1 LSb VREF = 5.0V A10 — Monotonicity — guaranteed(3) — —VSS  VAIN  VREF+ A20 A20A VREF Reference Voltage 2.0 2.5 — — VDD + 0.3 V Absolute minimum to ensure 10-bit accuracy A21 VREF Reference V High (VDD or VREF) VSS — VDD V A25 VAIN Analog Input Voltage VSS — VREF V A30 ZAIN Recommended Impedance of Analog Voltage Source — — 10 k A50 IREF VREF Input Current(2) 10 — — — 1000 10 A A During VAIN acquisition. Based on differential of VHOLD to VAIN. During A/D conversion cycle. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from External VREF or VDD pin, whichever is selected as reference input. 3: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. PIC16F630/676 DS40039F-page 104  2010 Microchip Technology Inc. FIGURE 12-10: PIC16F676 A/D CONVERSION TIMING (NORMAL MODE) TABLE 12-9: PIC16F676 A/D CONVERSION REQUIREMENTS Param No. Sym Characteristic Min Typ† Max Units Conditions 130 TAD A/D Clock Period 1.6 — — s TOSC based, VREF 3.0V 3.0* — — s TOSC based, VREF full range 130 TAD A/D Internal RC Oscillator Period 3.0* 6.0 9.0* s ADCS<1:0> = 11 (RC mode) At VDD = 2.5V 2.0* 4.0 6.0* s At VDD = 5.0V 131 TCNV Conversion Time (not including Acquisition Time)(1) — 11 — TAD Set GO bit to new data in A/D result register 132 TACQ Acquisition Time (Note 2) 5* 11.5 — — — s s The minimum time is the amplifier settling time. This may be used if the “new” input voltage has not changed by more than 1 LSb (i.e., 4.1 mV @ 4.096V) from the last sampled voltage (as stored on CHOLD). 134 TGO Q4 to A/D Clock Start — TOSC/2 — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. 2: See Table 7-1 for minimum conditions. 131 130 132 BSF ADCON0, GO Q4 A/D CLK A/D DATA ADRES ADIF GO SAMPLE OLD_DATA SAMPLING STOPPED DONE NEW_DATA 9 87 3 2 10 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1 TCY 6 134 (TOSC/2)(1) 1 TCY  2010 Microchip Technology Inc. DS40039F-page 105 PIC16F630/676 FIGURE 12-11: PIC16F676 A/D CONVERSION TIMING (SLEEP MODE) TABLE 12-10: PIC16F676 A/D CONVERSION REQUIREMENTS (SLEEP MODE) Param No. Sym Characteristic Min Typ† Max Units Conditions 130 TAD A/D Clock Period 1.6 — — s VREF 3.0V 3.0* — — s VREF full range 130 TAD A/D Internal RC Oscillator Period 3.0* 6.0 9.0* s ADCS<1:0> = 11 (RC mode) At VDD = 2.5V 2.0* 4.0 6.0* s At VDD = 5.0V 131 TCNV Conversion Time (not including Acquisition Time)(1) — 11 — TAD 132 TACQ Acquisition Time (Note 2) 5* 11.5 — — — s s The minimum time is the amplifier settling time. This may be used if the “new” input voltage has not changed by more than 1 LSb (i.e., 4.1 mV @ 4.096V) from the last sampled voltage (as stored on CHOLD). 134 TGO Q4 to A/D Clock Start — TOSC/2 + TCY — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. 2: See Table 7-1 for minimum conditions. 131 130 BSF ADCON0, GO Q4 A/D CLK A/D DATA ADRES ADIF GO SAMPLE OLD_DATA SAMPLING STOPPED DONE NEW_DATA 9 7 3210 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 134 8 6 132 (TOSC/2 + TCY) 1 TCY (1) 1 TCY PIC16F630/676 DS40039F-page 106  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS40039F-page 107 PIC16F630/676 13.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time and matrix samples. “Typical” represents the mean of the distribution at 25°C. “Max” or “min” represents (mean + 3) or (mean - 3) respectively, where  is standard deviation, over the whole temperature range. FIGURE 13-1: TYPICAL IPD vs. VDD OVER TEMP (-40°C TO +25°C) FIGURE 13-2: TYPICAL IPD vs. VDD OVER TEMP (+85°C) Typical Baseline IPD 0.0E+00 1.0E-09 2.0E-09 3.0E-09 4.0E-09 5.0E-09 6.0E-09 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (A) -40 0 25 Typical Baseline IPD 0.0E+00 5.0E-08 1.0E-07 1.5E-07 2.0E-07 2.5E-07 3.0E-07 3.5E-07 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (A) 85 PIC16F630/676 DS40039F-page 108  2010 Microchip Technology Inc. FIGURE 13-3: TYPICAL IPD vs. VDD OVER TEMP (+125°C) FIGURE 13-4: MAXIMUM IPD vs. VDD OVER TEMP (-40°C TO +25°C) Typical Baseline IPD 0.0E+00 5.0E-07 1.0E-06 1.5E-06 2.0E-06 2.5E-06 3.0E-06 3.5E-06 4.0E-06 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (A) 125 Maximum Baseline IPD 0.0E+00 1.0E-08 2.0E-08 3.0E-08 4.0E-08 5.0E-08 6.0E-08 7.0E-08 8.0E-08 9.0E-08 1.0E-07 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (A) -40 0 25  2010 Microchip Technology Inc. DS40039F-page 109 PIC16F630/676 FIGURE 13-5: MAXIMUM IPD vs. VDD OVER TEMP (+85°C) FIGURE 13-6: MAXIMUM IPD vs. VDD OVER TEMP (+125°C) Maximum Baseline IPD 0.0E+00 1.0E-07 2.0E-07 3.0E-07 4.0E-07 5.0E-07 6.0E-07 7.0E-07 8.0E-07 9.0E-07 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (A) 85 Maximum Baseline IPD 0.0E+00 1.0E-06 2.0E-06 3.0E-06 4.0E-06 5.0E-06 6.0E-06 7.0E-06 8.0E-06 9.0E-06 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (A) 125 PIC16F630/676 DS40039F-page 110  2010 Microchip Technology Inc. FIGURE 13-7: TYPICAL IPD WITH BOD ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) FIGURE 13-8: TYPICAL IPD WITH CMP ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) Typical BOD IPD 50 60 70 80 90 100 110 120 130 3 3.5 4 4.5 5 5.5 VDD (V) IPD (uA) -40 0 25 85 125 Typical Comparator IPD 0.0E+00 2.0E-06 4.0E-06 6.0E-06 8.0E-06 1.0E-05 1.2E-05 1.4E-05 1.6E-05 1.8E-05 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (A) -40 0 25 85 125  2010 Microchip Technology Inc. DS40039F-page 111 PIC16F630/676 FIGURE 13-9: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (-40°C TO +25°C) FIGURE 13-10: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (+85°C) Typical A/D IPD 0.0E+00 5.0E-10 1.0E-09 1.5E-09 2.0E-09 2.5E-09 3.0E-09 3.5E-09 4.0E-09 4.5E-09 5.0E-09 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (A) -40 0 25 Typical A/D IPD 0.0E+00 5.0E-08 1.0E-07 1.5E-07 2.0E-07 2.5E-07 3.0E-07 3.5E-07 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (A) 85 PIC16F630/676 DS40039F-page 112  2010 Microchip Technology Inc. FIGURE 13-11: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (+125°C) FIGURE 13-12: TYPICAL IPD WITH T1 OSC ENABLED vs. VDD OVER TEMP (-40°C TO +125°C), 32 KHZ, C1 AND C2=50 pF) Typical A/D IPD 0.0E+00 5.0E-07 1.0E-06 1.5E-06 2.0E-06 2.5E-06 3.0E-06 3.5E-06 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (A) 125 Typical T1 IPD 0.00E+00 2.00E-06 4.00E-06 6.00E-06 8.00E-06 1.00E-05 1.20E-05 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (A) -40 0 25 85 125  2010 Microchip Technology Inc. DS40039F-page 113 PIC16F630/676 FIGURE 13-13: TYPICAL IPD WITH CVREF ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) FIGURE 13-14: TYPICAL IPD WITH WDT ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) Typical CVREF IPD 40 60 80 100 120 140 160 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (uA) -40 0 25 85 125 Typical WDT IPD 0 2 4 6 8 10 12 14 16 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (uA) -40 0 25 85 125 PIC16F630/676 DS40039F-page 114  2010 Microchip Technology Inc. FIGURE 13-15: MAXIMUM AND MINIMUM INTOSC FREQ vs. TEMPERATURE WITH 0.1F AND 0.01F DECOUPLING (VDD = 3.5V) FIGURE 13-16: MAXIMUM AND MINIMUM INTOSC FREQ vs. VDD WITH 0.1F AND 0.01F DECOUPLING (+25°C) Internal Oscillator Frequency vs Temperature 3.80E+06 3.85E+06 3.90E+06 3.95E+06 4.00E+06 4.05E+06 4.10E+06 4.15E+06 4.20E+06 -40°C 0°C 25°C 85°C 125°C Temperature (°C) Frequency (Hz) -3sigma average +3sigma Internal Oscillator Frequency vs VDD 3.80E+06 3.85E+06 3.90E+06 3.95E+06 4.00E+06 4.05E+06 4.10E+06 4.15E+06 4.20E+06 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V VDD (V) Fre quenc y (Hz) -3sigma average +3sigma  2010 Microchip Technology Inc. DS40039F-page 115 PIC16F630/676 FIGURE 13-17: TYPICAL WDT PERIOD vs. VDD (-40C TO +125C) WDT Time-out 0 5 10 15 20 25 30 35 40 45 50 2 2.5 3 3.5 4 4.5 5 5.5 VDD(V) Time (mS) -40 0 25 85 125 PIC16F630/676 DS40039F-page 116  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS40039F-page 117 PIC16F630/676 14.0 PACKAGING INFORMATION 14.1 Package Marking Information XXXXXXXXXXXXXX 14-Lead PDIP (Skinny DIP) Example XXXXXXXXXXXXXX YYWWNNN 16F630-I 1015/017 XXXXXXXXXXX 14-Lead SOIC XXXXXXXXXXX YYWWNNN Example 16F630-E 1015/017 14-Lead TSSOP NNN XXXXXXXX YYWW Example 017 16F630 1015 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 e3 e3 e3 PIC16F630/676 DS40039F-page 118  2010 Microchip Technology Inc. 14.2 Package Details The following sections give the technical details of the packages.                  !"#$%! & '(!%&! %( %")% %  % "   *$%+  %  % , &   "-"  %!"& "$ % !    "$ % !    %#".  "  &  "%    -/0 1+21 &    %#%! ))% !%%     3 % & %! % 4" ) '   %    4 $%  %"% %% 255)))&    &5 4 6% 7+8- &  9&% 7 7: ; 7!&( $ 7  %  1+ % %  < <   ""4 4  0 , 0 1 % %  0 < <  !" %  !" ="% -  , ,0  ""4="% -  0 > : 9%  ,0 0 0  % % 9 0 , 0 9" 4  >  0 6  9"="% ( 0 ?  9 ) 9"="% (  >  :  ) * 1 < < , N E1 D NOTE 1 1 2 3 E c eB A2 L A A1 b1 b e         ) +01  2010 Microchip Technology Inc. DS40039F-page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b e A A1 A2 L L1 c h h α β φ         ) +?01 PIC16F630/676 DS40039F-page 120  2010 Microchip Technology Inc.  3 % & %! % 4" ) '   %    4 $%  %"% %% 255)))&    &5 4  2010 Microchip Technology Inc. DS40039F-page 121 PIC16F630/676    )* !*#+ ! "  !)  &   )!!"     !"#$%! & '(!%&! %( %")% %  % "   &   "-"  %!"& "$ % !    "$ % !    %#"0&&  " , &  "%    -/0 1+2 1 &    %#%! ))% !%%    -32 $ &  '! !)% !%%  '$ $ &%  !    3 % & %! % 4" ) '   %    4 $%  %"% %% 255)))&    &5 4 6% 99-- &  9&% 7 7: ; 7!&( $ 7  %  ?01+ : 8 %  < <   ""4 4  >  0 %" $$  0 < 0 : ="% - ?1+  ""4="% - ,  0  ""49%   0 0 3 %9% 9 0 ? 0 3 % % 9 -3 3 % B < >B 9" 4   <  9"="% (  < , NOTE 1 D N E E1 1 2 e b c A A1 A2 L1 L φ         ) +>1 PIC16F630/676 DS40039F-page 122  2010 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2010 Microchip Technology Inc. DS40039F-page 123 PIC16F630/676 APPENDIX A: DATA SHEET REVISION HISTORY Revision A This is a new data sheet. Revision B Added characterization graphs. Updated specifications. Added notes to indicate Microchip programmers maintain all calibration bits to factory settings and the PIC16F676 ANSEL register must be initialized to configure pins as digital I/O. Revision C Revision D Updated Package Drawings; Replaced PICmicro with PIC. Revision E (03/2007) Replaced Package Drawings (Rev. AM); Replaced Development Support Section. Revision F (05/2010) Replaced Package Drawings (Rev. BD); Replaced Development Support Section. APPENDIX B: DEVICE DIFFERENCES The differences between the PIC16F630/676 devices listed in this data sheet are shown in Table B-1. TABLE B-1: DEVICE DIFFERENCES Feature PIC16F630 PIC16F676 A/D No Yes PIC16F630/676 DS40039F-page 124  2010 Microchip Technology Inc. APPENDIX C: DEVICE MIGRATIONS This section is intended to describe the functional and electrical specification differences when migrating between functionally similar devices (such as from a PIC16C74A to a PIC16C74B). Not Applicable APPENDIX D: MIGRATING FROM OTHER PIC® DEVICES This discusses some of the issues in migrating from other PIC devices to the PIC16F6XX family of devices. D.1 PIC12C67X to PIC12F6XX TABLE 1: FEATURE COMPARISON Feature PIC12C67X PIC16F6XX Max Operating Speed 10 MHz 20 MHz Max Program Memory 2048 bytes 1024 bytes A/D Resolution 8-bit 10-bit Data EEPROM 16 bytes 64 bytes Oscillator Modes 5 8 Brown-out Detect N Y Internal Pull-ups RA0/1/3 RA0/1/2/4/5 Interrupt-on-change RA0/1/3 RA0/1/2/3/4/5 Comparator N Y Note: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device.  2010 Microchip Technology Inc. DS40039F-page 125 PIC16F630/676 INDEX A A/D ...................................................................................... 45 Acquisition Requirements ........................................... 49 Block Diagram............................................................. 45 Calculating Acquisition Time....................................... 49 Configuration and Operation....................................... 45 Effects of a Reset........................................................ 50 Internal Sampling Switch (Rss) Impedance................ 49 Operation During Sleep .............................................. 50 PIC16F675 Converter Characteristics ...................... 103 Source Impedance...................................................... 49 Summary of Registers ................................................ 50 Absolute Maximum Ratings ................................................ 85 AC Characteristics Industrial and Extended .............................................. 96 Analog Input Connection Considerations............................ 42 Analog-to-Digital Converter. See A/D Assembler MPASM Assembler..................................................... 82 B Block Diagram TMR0/WDT Prescaler................................................. 31 Block Diagrams Analog Input Mode...................................................... 42 Analog Input Model..................................................... 49 Comparator Output ..................................................... 42 Comparator Voltage Reference .................................. 43 On-Chip Reset Circuit ................................................. 59 RA0 and RA1 Pins...................................................... 24 RA2............................................................................. 25 RA3............................................................................. 25 RA4............................................................................. 26 RA5............................................................................. 26 RC Oscillator Mode..................................................... 58 RC0/RC1/RC2/RC3 Pins ............................................ 28 RC4 AND RC5 Pins.................................................... 28 Timer1......................................................................... 34 Watchdog Timer.......................................................... 69 Brown-out Associated Registers .................................................. 62 Brown-out Detect (BOD) ..................................................... 61 Brown-out Detect Timing and Characteristics..................... 99 C C Compilers MPLAB C18 ................................................................ 82 Calibrated Internal RC Frequencies.................................... 97 CLKOUT ............................................................................. 58 Code Examples Changing Prescaler .................................................... 33 Data EEPROM Read .................................................. 53 Data EEPROM Write .................................................. 53 Initializing PORTA....................................................... 21 Initializing PORTC....................................................... 28 Saving STATUS and W Registers in RAM ................. 68 Write Verify ................................................................. 53 Code Protection .................................................................. 71 Comparator ......................................................................... 39 Associated Registers .................................................. 44 Configuration............................................................... 41 Effects of a Reset........................................................ 43 I/O Operating Modes................................................... 41 Interrupts..................................................................... 44 Operation .................................................................... 40 Operation During Sleep .............................................. 43 Output......................................................................... 42 Reference ................................................................... 43 Response Time .......................................................... 43 Comparator Specifications................................................ 102 Comparator Voltage Reference Specifications................. 102 Configuration Bits ............................................................... 56 Configuring the Voltage Reference..................................... 43 Crystal Operation................................................................ 57 Customer Change Notification Service............................. 129 Customer Notification Service .......................................... 129 Customer Support............................................................. 129 D Data EEPROM Memory Associated Registers/Bits........................................... 54 Code Protection.......................................................... 54 EEADR Register......................................................... 51 EECON1 Register ...................................................... 51 EECON2 Register ...................................................... 51 EEDATA Register....................................................... 51 Data Memory Organization................................................... 9 DC Characteristics Extended and Industrial.............................................. 93 Industrial ..................................................................... 88 Debugger............................................................................ 71 Development Support......................................................... 81 Device Differences............................................................ 123 Device Migrations ............................................................. 124 Device Overview................................................................... 7 E EEPROM Data Memory Reading ...................................................................... 53 Spurious Write............................................................ 53 Write Verify ................................................................. 53 Writing ........................................................................ 53 Electrical Specifications...................................................... 85 Errata.................................................................................... 5 F Firmware Instructions ......................................................... 73 G General Purpose Register File ............................................. 9 I ID Locations........................................................................ 71 In-Circuit Serial Programming............................................. 71 Indirect Addressing, INDF and FSR Registers ................... 20 Instruction Format............................................................... 73 Instruction Set..................................................................... 73 ADDLW....................................................................... 75 ADDWF ...................................................................... 75 ANDLW....................................................................... 75 ANDWF ...................................................................... 75 BCF ............................................................................ 75 BSF............................................................................. 75 BTFSC........................................................................ 75 BTFSS ........................................................................ 75 CALL........................................................................... 76 CLRF .......................................................................... 76 CLRW......................................................................... 76 CLRWDT .................................................................... 76 COMF......................................................................... 76 DECF.......................................................................... 76 DECFSZ ..................................................................... 77 GOTO......................................................................... 77 INCF ........................................................................... 77 INCFSZ....................................................................... 77 PIC16F630/676 DS40039F-page 126  2010 Microchip Technology Inc. IORLW ........................................................................77 IORWF ........................................................................77 MOVF..........................................................................78 MOVLW ......................................................................78 MOVWF ......................................................................78 NOP ............................................................................ 78 RETFIE ....................................................................... 78 RETLW ....................................................................... 78 RETURN ..................................................................... 79 RLF ............................................................................. 79 RRF............................................................................. 79 SLEEP ........................................................................79 SUBLW ....................................................................... 79 SUBWF ....................................................................... 79 SWAPF ....................................................................... 80 XORLW....................................................................... 80 XORWF....................................................................... 80 Summary Table........................................................... 74 Internal 4 MHz Oscillator.....................................................58 Internal Sampling Switch (Rss) Impedance ........................ 49 Internet Address................................................................ 129 Interrupts............................................................................. 65 A/D Converter ............................................................. 67 Comparator ................................................................. 67 Context Saving............................................................ 68 PORTA........................................................................67 RA2/INT ......................................................................67 Summary of Registers ................................................ 68 TMR0 ..........................................................................67 M MCLR.................................................................................. 60 Memory Organization Data EEPROM Memory.............................................. 51 Microchip Internet Web Site.............................................. 129 Migrating from other PICmicro Devices ............................124 MPLAB ASM30 Assembler, Linker, Librarian ..................... 82 MPLAB Integrated Development Environment Software .... 81 MPLAB PM3 Device Programmer....................................... 84 MPLAB REAL ICE In-Circuit Emulator System................... 83 MPLINK Object Linker/MPLIB Object Librarian .................. 82 O OPCODE Field Descriptions ............................................... 73 Oscillator Configurations .....................................................57 Oscillator Start-up Timer (OST) .......................................... 60 P Packaging ......................................................................... 117 Details ....................................................................... 118 Marking ..................................................................... 117 PCL and PCLATH............................................................... 19 Computed GOTO........................................................ 19 Stack ........................................................................... 19 Pinout Descriptions PIC16F630.................................................................... 8 PIC16F676.................................................................... 8 PORTA Additional Pin Functions ............................................. 21 Interrupt-on-Change............................................ 22 Weak Pull-up....................................................... 21 Associated Registers .................................................. 27 Pin Descriptions and Diagrams................................... 24 PORTA and TRISIO Registers............................................ 21 PORTC................................................................................ 28 Associated Registers .................................................. 29 Power Control/Status Register (PCON) ..............................61 Power-Down Mode (SLEEP)............................................... 70 Power-on Reset (POR)....................................................... 60 Power-up Timer (PWRT) .................................................... 60 Prescaler............................................................................. 33 Switching Prescaler Assignment ................................ 33 Program Memory Organization............................................. 9 Programming, Device Instructions...................................... 73 R RC Oscillator....................................................................... 58 Reader Response............................................................. 130 READ-MODIFY-WRITE OPERATIONS ............................. 73 Registers ADCON0 (A/D Control)............................................... 47 ADCON1..................................................................... 47 CMCON (Comparator Control) ................................... 39 CONFIG (Configuration Word) ................................... 56 EEADR (EEPROM Address) ...................................... 51 EECON1 (EEPROM Control) ..................................... 52 EEDAT (EEPROM Data) ............................................ 51 INTCON (Interrupt Control)......................................... 15 IOCA (Interrupt-on-Change PORTA).......................... 23 Maps PIC16F630 ......................................................... 10 PIC16F676 ......................................................... 10 OPTION_REG (Option) ........................................ 14, 32 OSCCAL (Oscillator Calibration) ................................ 18 PCON (Power Control) ............................................... 18 PIE1 (Peripheral Interrupt Enable 1)........................... 16 PIR1 (Peripheral Interrupt 1)....................................... 17 PORTC ....................................................................... 29 STATUS ..................................................................... 13 T1CON (Timer1 Control) ............................................ 36 TRISC......................................................................... 29 VRCON (Voltage Reference Control)......................... 44 WPUA (Weak Pull-up PORTA)................................... 22 RESET................................................................................ 59 Revision History................................................................ 123 S Software Simulator (MPLAB SIM) ...................................... 83 Special Features of the CPU .............................................. 55 Special Function Registers ................................................. 10 T Time-out Sequence ............................................................ 61 Timer0................................................................................. 31 Associated Registers.................................................. 33 External Clock............................................................. 32 Interrupt ...................................................................... 31 Operation.................................................................... 31 T0CKI ......................................................................... 32 Timer1 Associated Registers.................................................. 37 Asynchronous Counter Mode ..................................... 37 Reading and Writing ........................................... 37 Interrupt ...................................................................... 35 Modes of Operations .................................................. 35 Operation During SLEEP............................................ 37 Oscillator..................................................................... 37 Prescaler .................................................................... 35 Timer1 Module with Gate Control....................................... 34 Timing Diagrams CLKOUT and I/O ........................................................ 98 External Clock............................................................. 96 INT Pin Interrupt ......................................................... 67 PIC16F675 A/D Conversion (Normal Mode) ............ 104 PIC16F675 A/D Conversion Timing (Sleep Mode)... 105  2010 Microchip Technology Inc. DS40039F-page 127 PIC16F630/676 RESET, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer .......................................................... 99 Time-out Sequence on Power-up (MCLR not Tied to VDD)/ Case 1 ................................................................ 64 Case 2 ................................................................ 64 Time-out Sequence on Power-up (MCLR Tied to VDD) ........................................................................ 64 Timer0 and Timer1 External Clock ........................... 101 Timer1 Incrementing Edge.......................................... 35 Timing Parameter Symbology............................................. 95 TRISIO Registers................................................................ 21 V Voltage Reference Accuracy/Error ..................................... 43 W Watchdog Timer Summary of Registers ................................................ 69 Watchdog Timer (WDT) ...................................................... 68 WWW Address.................................................................. 129 WWW, On-Line Support ....................................................... 5 PIC16F630/676 DS40039F-page 128  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS40039F-page 129 PIC16F630/676 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com PIC16F630/676 DS40039F-page 130  2010 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC16F630/676 DS40039F 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document?  2010 Microchip Technology Inc. DS40039F-page 131 PIC16F630/676 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. * JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of each oscillator type. PART NO. X /XX XXX Temperature Package Pattern Range Device Device: : Standard VDD range T: (Tape and Reel) Temperature Range: I = -40°C to +85°C E = -40°C to +125°C Package: P = PDIP SL = SOIC (Gull wing, 3.90 mm body) ST = TSSOP(4.4 mm) Pattern: 3-Digit Pattern Code for QTP (blank otherwise) Examples: a) PIC16F630 – E/P 301 = Extended Temp., PDIP package, 20 MHz, QTP pattern #301 b) PIC16F676 – I/SL = Industrial Temp., SOIC package, 20 MHz DS40039F-page 132  2010 Microchip Technology Inc. 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DS21935D-page 1 TCN75A Features: • Temperature-to-Digital Converter • Accuracy: - ±1 (typical) from -40°C to +125°C - ±2°C (maximum) from -40°C to +125°C • User-selectable Resolution: 0.5°C to 0.0625°C • Operating Voltage Range: 2.7V to 5.5V • 2-wire Interface: I2C™ Compatible • Operating Current: 200 µA (typical) • Shutdown Current: 2 µA (maximum) • Power-saving One-shot Temperature Measurement • Available Packages: MSOP-8, SOIC-8 Typical Applications: • Personal Computers and Servers • Hard Disk Drives and Other PC Peripherals • Entertainment Systems • Office Equipment • Data Communication Equipment • General Purpose Temperature Monitoring Typical Application Description: Microchip Technology Inc.’s TCN75A digital temperature sensor converts temperatures between -40°C and +125°C to a digital word, with ±1°C (typical) accuracy. The TCN75A product comes with user-programmable registers that provide flexibility for temperature-sensing applications. The register settings allow user-selectable, 0.5°C to 0.0625°C temperature measurement resolution, configuration of the power-saving Shutdown and One-shot (single conversion on command while in Shutdown) modes and the specification of both temperature alert output and hysteresis limits. When the temperature changes beyond the specified limits, the TCN75A outputs an alert signal. The user has the option of setting the alert output signal polarity as an active-low or active-high comparator output for thermostat operation, or as temperature event interrupt output for microprocessor-based systems. This sensor has an industry standard 2-wire, I2C™ compatible serial interface, allowing up to eight devices to be controlled in a single serial bus. These features make the TCN75A ideal for low-cost, sophisticated multi-zone temperature-monitoring applications. Package Types VDD R TCN75A SDA SCL I/O Ports RPULL-UP PIC® 1 2 3 4 8 7 6 5 A0 VDD A1 A2 SDA GND ALERT SCL Microcontroller ALERT VDD SDA GND ALERT SCL 1 2 3 4 8 7 6 5 8-Pin SOIC, MSOP A0 VDD A1 A2 TCN75A 2-Wire Serial Temperature Sensor TCN75A DS21935D-page 2  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS21935D-page 3 TCN75A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD....................................................................... 6.0V Voltage at all Input/Output pins .....GND – 0.3V to 5.5V Storage temperature ..........................-65°C to +150°C Ambient temp. with power applied .....-55°C to +125°C Junction Temperature (TJ) ................................. 150°C ESD protection on all pins (HBM:MM) .......(4 kV:400V) Latch-up current at each pin ......................... ±200 mA †Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, and TA = -40°C to +125°C. Parameters Sym Min Typ Max Unit Conditions Power Supply Operating Voltage Range VDD 2.7 — 5.5 V Operating Current IDD — 200 500 µA Continuous operation Shutdown Current ISHDN — 0.1 2 µA Shutdown mode Power-on Reset (POR) Threshold VPOR — 1.7 — V VDD falling edge Line Regulation °C/VDD — 0.2 — °C/V VDD = 2.7V to 5.5V Temperature Sensor Accuracy TA = -40°C to +125°C TACY -2 ±1 +2 °C VDD = 3.3V Internal  ADC Conversion Time: 0.5°C Resolution tCONV — 30 — ms 33 samples/sec (typical) 0.25°C Resolution tCONV — 60 — ms 17 samples/sec (typical) 0.125°C Resolution tCONV — 120 — ms 8 samples/sec (typical) 0.0625°C Resolution tCONV — 240 — ms 4 samples/sec (typical) Alert Output (Open-drain) High-level Current IOH — — 1 µA VOH = 5V Low-level Voltage VOL — — 0.4 V IOL= 3 mA Thermal Response Response Time tRES — 1.4 — s Time to 63% (89°C) 27°C (air) to 125°C (oil bath) TCN75A DS21935D-page 4  2010 Microchip Technology Inc. Graphical Symbol Description DIGITAL INPUT/OUTPUT PIN CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground and TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Serial Input/Output (SCL, SDA, A0, A1, A2) Input High-level Voltage VIH 0.7 VDD —— V Low-level Voltage VIL — — 0.3 VDD V Input Current IIN -1 — +1 µA Output (SDA) Low-level Voltage VOL — — 0.4 V IOL= 3 mA High-level Current IOH — — 1 µA VOH = 5V Low-level Current IOL 6 — — mA VOL = 0.6V Capacitance CIN — 10 — pF SDA and SCL Inputs Hysteresis VHYST 0.05 VDD —— V VDD VIH VIL IIN Voltage Current time time VDD IOH Voltage Current time time INPUT OUTPUT VOL IOL TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V and GND = Ground. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range TA -40 — +125 °C Note 1 Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Package Resistances Thermal Resistance, 8L-SOIC JA — 163 — °C/W Thermal Resistance, 8L-MSOP JA — 206 — °C/W Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).  2010 Microchip Technology Inc. DS21935D-page 5 TCN75A Timing Diagram SERIAL INTERFACE TIMING SPECIFICATIONS (Note 1) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C, CL = 80 pF and all limits measured to 50% point. Parameters Sym Min Typ Max Units Conditions 2-Wire I2C™ Compatible Interface Serial Port Frequency fSC 0 — 400 kHz Clock Period tSC 2.5 — — µs Low Clock tLOW 1.3 — — µs High Clock tHIGH 0.6 — — µs Rise Time tR 20 — 300 ns 10% to 90% of VDD (SCL, SDA) Fall Time tF 20 — 300 ns 90% to 10% of VDD (SCL, SDA) Data Setup Before SCL High tSU-DATA 0.1 — — µs Data Hold After SCL Low tH-DATA 0 — — µs Start Condition Setup Time tSU-START 0.6 — — µs Start Condition Hold Time tH-START 0.6 — — µs Stop Condition Setup Time tSU-STOP 0.6 — — µs Bus Idle tB-FREE 1.3 — — µs Note 1: Specification limits are characterized but not product tested. tSU-START tH-START tSU-DATA tSU-STOP tB-FREE SCL SDA tH-DATA tHIGH tLOW tR, tF Start Condition Data Transmission Stop Condition TCN75A DS21935D-page 6  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS21935D-page 7 TCN75A 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise noted: VDD = 2.7V to 5.5V. FIGURE 2-1: Average Temperature Accuracy vs. Ambient Temperature, VDD = 3.3V. FIGURE 2-2: Average Temperature Accuracy vs. Ambient Temperature. FIGURE 2-3: Average Temperature Accuracy vs. Ambient Temperature, VDD = 3.3V. FIGURE 2-4: Temperature Accuracy Histogram, TA = +25°C. FIGURE 2-5: Supply Current vs. Ambient Temperature. FIGURE 2-6: Shutdown Current vs. Ambient Temperature. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -55 -35 -15 5 25 45 65 85 105 125 TA (°C) Temperature Accuracy (°C) 0.0625°C Resolution 160 Devices VDD = 3.3V Specification Limits -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -55 -35 -15 5 25 45 65 85 105 125 TA (°C) Temperature Accuracy (°C) 0.0625°C Resolution VDD = 2.7V 160 Devices VDD = 3.3V VDD = 5.5V VDD = 5.0V -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -55 -35 -15 5 25 45 65 85 105 125 TA (°C) Temperature Accuracy (°C) 0.125°C 0.0625°C 0.5°C 0.25°C VDD = 3.3V 160 Devices Resolution 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Temperature Accuracy (°C) Occurrences TA = +25°C VDD = 3.3V 5 lots 32 Samples/lot 160 Devices 50 100 150 200 250 300 350 400 -55 -35 -15 5 25 45 65 85 105 125 TA (°C) IDD (µA) VDD = 2.7V VDD = 3.3V VDD = 5.5V VDD = 5.0V 0 0.2 0.4 0.6 0.8 1 -55 -35 -15 5 25 45 65 85 105 125 TA (°C ) ISHDN (µA) TCN75A DS21935D-page 8  2010 Microchip Technology Inc. Note: Unless otherwise noted: VDD = 2.7V to 5.5V. FIGURE 2-7: ALERT and SDA IOL vs. Ambient Temperature. FIGURE 2-8: ALERT and SDA Output VOL vs. Ambient Temperature. FIGURE 2-9: TCN75A Thermal Response vs. Time. 6 12 18 24 30 36 42 48 -55 -35 -15 5 25 45 65 85 105 125 TA (°C) ALERT and SDA IOL (mA) VDD = 5.5V VDD = 3.3V VDD = 2.7V VOL = 0.6V 0 0.1 0.2 0.3 0.4 -55 -35 -15 5 25 45 65 85 105 125 TA (°C) ALERT and SDA VOL (V) VDD = 5.5V VDD = 3.3V VDD = 2.7V IOL = 3 mA 5 25 45 65 85 105 125 145 -2 0 2 4 6 8 10 12 14 16 18 20 Time (s) Temperature Data (°C) SOIC Average of 10 samples per package 27°C (Air) to 125°C (Oil bath) MSOP  2010 Microchip Technology Inc. DS21935D-page 9 TCN75A 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Serial Data Pin (SDA) SDA is a bidirectional input/output pin, used to serially transmit data to and from the host controller. This pin requires a pull-up resistor to output data. 3.2 Serial Clock Pin (SCL) SCL is a clock input pin. All communication and timing is relative to the signal on this pin. The clock is generated by the host controller on the bus. 3.3 Power Supply Input (VDD) VDD is the power pin. The operating voltage, as specified in the DC electrical specification table, is applied on this pin. 3.4 Ground (GND) GND is the system ground pin. 3.5 ALERT Output The TCN75A’s ALERT pin is an open-drain output. The device outputs an alert signal when the ambient temperature goes beyond the user-programmed temperature limit. 3.6 Address Pins (A2, A1, A0) A2, A1 and A0 are device or slave address input pins. The address pins are the Least Significant bits (LSb) of the device address bits. The Most Significant bits (MSb) (A6, A5, A4, A3) are factory-set to <1001>. This is illustrated in Table 3-2. MSOP, SOIC Symbol Function 1 SDA Bidirectional Serial Data 2 SCL Serial Clock Input 3 ALERT Temperature Alert Output 4 GND Ground 5 A2 Address Select Pin (bit 2) 6 A1 Address Select Pin (bit 1) 7 A0 Address Select Pin (bit 0) 8 VDD Power Supply Input TABLE 3-2: SLAVE ADDRESS Device A6 A5 A4 A3 A2 A1 A0 TCN75A 1001XXX Note: User-selectable address is shown by X. TCN75A DS21935D-page 10  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS21935D-page 11 TCN75A 4.0 SERIAL COMMUNICATION 4.1 2-Wire SMBus/Standard Mode I 2C™ Protocol-Compatible Interface The TCN75A serial clock input (SCL) and the bidirectional serial data line (SDA) form a 2-wire bidirectional SMBus/Standard mode I2C compatible communication port (refer to the Digital Input/output Pin Characteristics Table and Serial Interface Timing Specifications (Note 1) Table). The following bus protocol has been defined: TABLE 4-1: TCN75A SERIAL BUS PROTOCOL DESCRIPTIONS 4.1.1 DATA TRANSFER Data transfers are initiated by a Start condition (Start), followed by a 7-bit device address and a read/write bit. An Acknowledge (ACK) from the slave confirms the reception of each byte. Each access must be terminated by a Stop condition (Stop). Repeated communication is initiated after tB-FREE. This device does not support sequential register read/ write. Each register needs to be addressed using the Register Pointer. This device supports the Receive Protocol. The register can be specified using the pointer for the initial read. Each repeated read or receive begins with a Start condition and address byte. The TCN75A retains the previously selected register. Therefore, it outputs data from the previously specified register (repeated pointer specification is not necessary). 4.1.2 MASTER/SLAVE The bus is controlled by a master device (typically a microcontroller) that controls the bus access and generates the Start and Stop conditions. The TCN75A is a slave device and does not control other devices in the bus. Both master and slave devices can operate as either transmitter or receiver. However, the master device determines which mode is activated. 4.1.3 START/STOP CONDITION A high-to-low transition of the SDA line (while SCL is high) is the Start condition. All data transfers must be preceded by a Start condition from the master. If a Start condition is generated during data transfer, the TCN75A resets and accepts the new Start condition. A low-to-high transition of the SDA line (while SCL is high) signifies a Stop condition. If a Stop condition is introduced during data transmission, the TCN75A releases the bus. All data transfers are ended by a Stop condition from the master. 4.1.4 ADDRESS BYTE Following the Start condition, the host must transmit an 8-bit address byte to the TCN75A. The address for the TCN75A Temperature Sensor is ‘1001,A2,A1,A0’ in binary, where the A2, A1 and A0 bits are set externally by connecting the corresponding pins to VDD ‘1’ or GND ‘0’. The 7-bit address transmitted in the serial bit stream must match the selected address for the TCN75A to respond with an ACK. Bit 8 in the address byte is a read/write bit. Setting this bit to ‘1’ commands a read operation, while ‘0’ commands a write operation (see Figure 4-1). Term Description Master The device that controls the serial bus, typically a microcontroller. Slave The device addressed by the master, such as the TCN75A. Transmitter Device sending data to the bus. Receiver Device receiving data from the bus. Start A unique signal from master to initiate serial interface with a slave. Stop A unique signal from the master to terminate serial interface from a slave. Read/Write A read or write to the TCN75A registers. ACK A receiver Acknowledges (ACK) the reception of each byte by polling the bus. NAK A receiver Not-Acknowledges (NAK) or releases the bus to show End-of-Data (EOD). Busy Communication is not possible because the bus is in use. Not Busy The bus is in the Idle state, both SDA and SCL remain high. Data Valid SDA must remain stable before SCL becomes high in order for a data bit to be considered valid. During normal data transfers, SDA only changes state while SCL is low. TCN75A DS21935D-page 12  2010 Microchip Technology Inc. FIGURE 4-1: Device Addressing. 4.1.5 DATA VALID After the Start condition, each bit of data in transmission needs to be settled for a time specified by tSU-DATA before SCL toggles from low-to-high (see “Serial Interface Timing Specifications (Note 1)”. 4.1.6 ACKNOWLEDGE (ACK) Each receiving device, when addressed, is obliged to generate an ACK bit after the reception of each byte. The master device must generate an extra clock pulse for ACK to be recognized. The acknowledging device pulls down the SDA line for tSU-DATA before the low-to-high transition of SCL from the master. SDA also needs to remain pulled down for tH-DATA after a high-to-low transition of SCL. During read, the master must signal an End-of-Data (EOD) to the slave by not generating an ACK bit (NAK) once the last bit has been clocked out of the slave. In this case, the slave will leave the data line released to enable the master to generate the Stop condition. SCL 123456789 SDA 10 01 A2 A1 A0 Start Address Byte Address Slave R/W TCN75A Response Code Address A C K  2010 Microchip Technology Inc. DS21935D-page 13 TCN75A 5.0 FUNCTIONAL DESCRIPTION The TCN75A temperature sensor consists of a bandgap type temperature sensor, a  Analog-to-Digital Converter (ADC), user-programmable registers and a 2-wire I2C protocol-compatible serial interface. FIGURE 5-1: Functional Block Diagram. 5.1 Temperature Sensor The TCN75A uses the difference in the base-emitter voltage of a transistor while its collector current is changed from IC1 to IC2. With this method, the VBE depends only on the ratio of the two currents and the ambient temperature, as shown in Equation 5-1. EQUATION 5-1: 5.2  Analog-to-Digital Converter A Sigma-Delta ADC is used to convert VBE to a digital word that corresponds to the transistor temperature. The converter has an adjustable resolution from 0.5°C (at 30 ms conversion time) to 0.0625°C (at 240 ms conversion time). Thus, it allows the user to make trade-offs between resolution and conversion time. Refer to Section 5.3.2 “Sensor Configuration Register (CONFIG)” and Section 5.3.4.7 “ ADC Resolution” for details. Resolution 0.5°C 0.25°C 0.125°C 0.0625°C Temperature THYST TSET Register Register Register Register Pointer I 2C™ Interface Configuration Register  ADC Band-Gap Temperature Sensor One-Shot Shutdown Fault Queue Alert Polarity Alert Comp/Int VBE kT q -----     ln IC1 IC2 =     Where: T = temperature in kelvin VBE = change in diode base-emitter voltage k = Boltzmann’s constant q = electron charge IC1 and IC2 = currents with n:1 ratio TCN75A DS21935D-page 14  2010 Microchip Technology Inc. 5.3 Registers The TCN75A has four registers that are user-accessible. These registers are specified as the Ambient Temperature (TA) register, the Temperature Limit-set (TSET) register, the Temperature Hysteresis (THYST) register and device Configuration (CONFIG) register. The Ambient Temperature register is a read-only register and is used to access the ambient temperature data. The data from the ADC is loaded in parallel in the register. The Temperature Limit-set and Temperature Hysteresis registers are read/write registers that provide user-programmable temperature limits. If the ambient temperature drifts beyond the programmed limits, the TCN75A outputs an alert signal using the ALERT pin (refer to Section 5.3.4.3 “ALERT Output Configuration”). The device Configuration register provides access for the user to configure the TCN75A’s various features. These registers are described in further detail in the following sections. The registers are accessed by sending Register Pointers to the TCN75A using the serial interface. This is an 8-bit pointer. However, the two Least Significant bits (LSbs) are used as pointers and all other bits need to be cleared <0>. This device has additional registers that are reserved for test and calibration. If these registers are accessed, the device may not perform according to the specification. The pointer description is shown below. FIGURE 5-2: Register Block Diagram. ALERT Output Control Logic ALERT Output Resolution Temperature THYST TSET Register Register Register Configuration Register One-Shot Shutdown Fault Queue Alert Polarity Alert Comp/Int REGISTER 5-1: REGISTER POINTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 0 0 0 0 0 0 P1 P0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 Pointer bits 00 = Temperature register (TA) 01 = Configuration register (CONFIG) 10 = Temperature Hysteresis register (THYST) 11 = Temperature Limit-set register (TSET) .  2010 Microchip Technology Inc. DS21935D-page 15 TCN75A TABLE 5-1: BIT ASSIGNMENT SUMMARY FOR ALL REGISTERS Register Pointer P1 P0 MSB/ LSB Bit Assignment 7 6 5 4 3 2 10 Ambient Temperature Register (TA) 0 0 MSB Sign 26°C 25°C 24°C 23°C 22°C 21°C 20°C LSB 2-1°C 2-2°C 2-3°C 2-4°C 0 0 0 0 Sensor Configuration Register (CONFIG) 0 1 LSB One-Shot Resolution Fault Queue ALERT Polarity COMP/INT Shutdown Temperature Hysteresis Register (THYST) 1 0 MSB Sign 26°C 25°C 24°C 23°C 22°C 21°C 20°C LSB 2-1°C 0 0 0 0 0 0 0 Temperature Limit-Set Register (TSET) 1 1 MSB Sign 26°C 25°C 24°C 23°C 22°C 21°C 20°C LSB 2-1°C 0 0 0 0 0 0 0 TCN75A DS21935D-page 16  2010 Microchip Technology Inc. 5.3.1 AMBIENT TEMPERATURE REGISTER (TA) The TCN75A has a 16-bit read-only Ambient Temperature register that contains 9-bit to 12-bit temperature data. (0.5°C to 0.0625°C resolutions, respectively). This data is formatted in two’s complement. The bit assignments, as well as the corresponding resolution, is shown in the register assignment below. The refresh rate of this register depends on the selected ADC resolution. It takes 30 ms (typical) for 9-bit data and 240 ms (typical) for 12-bit data. Since this register is double-buffered, the user can read the register while the TCN75A performs Analog-to-Digital conversion in the background. The decimal code to ambient temperature conversion is shown in Equation 5-2: EQUATION 5-2: TA Code 2–4 =  Where: TA = Ambient Temperature (°C) Code = TCN75A output in decimal REGISTER 5-2: AMBIENT TEMPERATURE REGISTER (TA) — ADDRESS <0000 0000>b Upper Half: R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 Sign 26 °C 25 °C 24 °C 23 °C 22 °C 21 °C 20 °C bit 15 bit 8 Lower Half: R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 2-1 °C/bit 2-2 °C 2-3 °C 2-4 °C 0 0 0 0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note 1: When the 0.5°C, 0.25°C or 0.125°C resolutions are selected, bit 6, bit 7 or bit 8 will remain clear <0>, respectively.  2010 Microchip Technology Inc. DS21935D-page 17 TCN75A FIGURE 5-3: Timing Diagram for Reading +25.25°C Temperature from the TA Register (See Section 4.0 “Serial Communication”). SDA A C K 1001 A TA Pointer 0000 A C K S 2 A 1 A 0 12345678 12345678 SCL 0 Address Byte A C K 1001 A MSB Data A C K N A K S P 2 A 1 A 0 12345678 12345678 12345678 Address Byte LSB Data R TCN75A TCN75A TCN75A Master Master W SDA SCL 0 00 00 011 0 01 01 000 0 00 Note: It is not necessary to select the Register Pointer if it was set from the previous read/ write. (see Section 4.1.1) TCN75A DS21935D-page 18  2010 Microchip Technology Inc. 5.3.2 SENSOR CONFIGURATION REGISTER (CONFIG) The TCN75A has an 8-bit read/write Configuration register that allows the user to select the different features. These features include shutdown, ALERT output select as comparator or interrupt output, ALERT output polarity, fault queue cycle, temperature measurement resolution and One-shot mode (single conversion while in shutdown). These functions are described in detail in the following sections. REGISTER 5-3: CONFIGURATION REGISTER (CONFIG) — ADDRESS <0000 0001>b R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 One-Shot Resolution Fault Queue ALERT Polarity COMP/INT Shutdown bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ONE-SHOT bit 1 = Enabled 0 = Disabled (Power-up default) bit 6-5  ADC RESOLUTION bits 00 = 9 bit or 0.5°C (Power-up default) 01 = 10 bit or 0.25°C 10 = 11 bit or 0.125°C 11 = 12 bit or 0.0625°C bit 4-3 FAULT QUEUE bits 00 = 1 (Power-up default) 01 =2 10 =4 11 =6 bit 2 ALERT POLARITY bit 1 = Active-high 0 = Active-low (Power-up default) bit 1 COMP/INT bit 1 = Interrupt mode 0 = Comparator mode (Power-up default) bit 0 SHUTDOWN bit 1 = Enable 0 = Disable (Power-up default)  2010 Microchip Technology Inc. DS21935D-page 19 TCN75A FIGURE 5-4: Timing Diagram for Writing and Reading from the Configuration Register (See Section 4.0 “Serial Communication”). SDA A C K 1001 A CONFIG Pointer 0000 A C K S 2 A 1 A 0 12345678 12345678 SCL 0 Address Byte A C K 1001 A Data N A K S P 2 A 1 A 0 12345678 12345678 Address Byte R TCN75A TCN75A TCN75A W SDA SCL 0 01 01 100 0 00 • Reading the CONFIG Register. • Writing to the CONFIG Register to change the resolution to 0.0625°C <0110 0000>b. SDA A C K 1001 A 0000 A C K S 2 A 1 A 0 12345678 12345678 SCL 0 Address Byte W TCN75A TCN75A MSB Data A C K P 12345678 1 CONFIG Pointer TCN75A 001 01 100 0 00 Note: It is not necessary to select the Register Pointer if it was set from the previous read/ write (see Section 4.1.1). TCN75A DS21935D-page 20  2010 Microchip Technology Inc. 5.3.3 TEMPERATURE HYSTERESIS REGISTER (THYST) The TCN75A has a 16-bit read/write Temperature Hysteresis register that contains a 9-bit data in two’s compliment format. This register is used to set a hysteresis for the TSET limit. Therefore, the data represents a minimum temperature limit. If the ambient temperature drifts below the specified limit, the TCN75A asserts an alert output (refer to Section 5.3.4.3 “ALERT Output Configuration”). This register uses the nine Most Significant bits (MSbs) and all other bits are “don’t cares”. The power-up default value of THYST register is 75°C, or <0100 1011 0>b in binary. REGISTER 5-4: TEMPERATURE HYSTERESIS REGISTER (THYST) — ADDRESS <0000 0010>b Upper Half: R/W-0 R/W-1 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 R/W-1 Sign 26 °C 25 °C 24 °C 23 °C 22 °C 21 °C 20 °C bit 15 bit 8 Lower Half: R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 2-1 °C 0 0 0 0 0 0 0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2010 Microchip Technology Inc. DS21935D-page 21 TCN75A FIGURE 5-5: Timing Diagram for Writing and Reading from the Temperature Hysteresis Register (See Section 4.0 “Serial Communication”). SDA A C K 1001 A 0000 A C K S 2 A 1 A 0 12345678 12345678 SCL 0 Address Byte A C K 1001 A MSB Data A C K N A K S P 2 A 1 A 0 12345678 12345678 12345678 Address Byte LSB Data R TCN75A TCN75A TCN75A Master Master W SDA SCL 0 10 01 011 1 11 00 000 0 00 • Reading the THYST Register. • Writing to the THYST Register to set the temperature hysteresis to 95°C <0101 1111 0000 0000>b. SDA A C K 1001 A 0000 A C K S 2 A 1 A 0 12345678 12345678 SCL 0 Address Byte W TCN75A TCN75A MSB Data A C K A C K P 12345678 12345678 LSB Data THYST Pointer TCN75A TCN75A 010 01 011 1 11 00 000 0 00 Note: It is not necessary to select the Register Pointer if it was set from the previous read/ write (see Section 4.1.1). THYST Pointer TCN75A DS21935D-page 22  2010 Microchip Technology Inc. 5.3.4 TEMPERATURE LIMIT-SET REGISTER (TSET) The TCN75A has a 16-bit read/write Temperature Limit-Set register (TSET) which contains a 9-bit data in two’s compliment format. This data represents a maximum temperature limit. If the ambient temperature exceeds this specified limit, the TCN75A asserts an alert output. (Refer to Section 5.3.4.3 “ALERT Output Configuration”). This register uses the nine Most Significant bits (MSbs) and all other bits are “don’t cares”. The power-up default value of the TSET register is 80°C, or <0101 0000 0>b in binary. REGISTER 5-5: TEMPERATURE LIMIT-SET REGISTER (TSET) — ADDRESS <0000 0011>b Upper Half: R/W-0 R/W-1 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 Sign 26 °C 25 °C 24 °C 23 °C 22 °C 21 °C 20 °C bit 15 bit 8 Lower Half: R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 2-1 °C 0 0 0 0 0 0 0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2010 Microchip Technology Inc. DS21935D-page 23 TCN75A FIGURE 5-6: Timing Diagram for Writing and Reading from the Temperature Limit-set Register (See Section 4.0 “Serial Communication”). SDA A C K 1001 A TSET Pointer 0000 A C K S 2 A 1 A 0 12345678 12345678 SCL 0 Address Byte A C K 1001 A MSB Data A C K N A K S P 2 A 1 A 0 12345678 12345678 12345678 Address Byte LSB Data R TCN75A TCN75A TCN75A Master Master W SDA SCL 0 11 01 011 0 10 00 000 0 00 • Reading the TSET Register. • Writing to the TSET Register to set the temperature limit to 90°C, <0101 1010 0000 0000>b SDA A C K 1001 A 0000 A C K S 2 A 1 A 0 12345678 12345678 SCL 0 Address Byte W TCN75A TCN75A MSB Data A C K A C K P 12345678 12345678 LSB Data TSET Pointer TCN75A TCN75A 011 01 011 0 10 00 000 0 00 Note: It is not necessary to select the Register Pointer if it was set from the previous read/ write. (see Section 4.1.1) TCN75A DS21935D-page 24  2010 Microchip Technology Inc. 5.3.4.1 Shutdown Mode The Shutdown mode disables all power-consuming activities (including temperature sampling operations) while leaving the serial interface active. The device consumes 2 µA (maximum) in this mode. It remains in this mode until the Configuration register is updated to enable continuous conversion or until power is recycled. In Shutdown mode, the CONFIG, TA, TSET and THYST registers can be read or written to; however, the serial bus activity will increase the shutdown current. 5.3.4.2 One-Shot Mode The TCN75A can also be used in a One-shot mode that can be selected using bit 7 of the CONFIG register. The One-shot mode performs a single temperature measurement and returns to Shutdown mode. This mode is especially useful for low-power applications where temperature is measured upon command from a controller. For example, a 9-bit TA in One-shot mode consumes 200 µA (typical) for 30 ms and 0.1 µA (typical) during shutdown. To access this feature, the device needs to initially be in Shutdown mode. This is done by sending a byte to the CONFIG register with bit 0 set <1> and bit 7 cleared <0>. Once the device is in Shutdown mode, the CONFIG register needs to be written to again, with bit 0 and bit 7 set <1>. This begins the single conversion cycle of tCONV, 30ms for 9-bit data. Once the conversion is completed, TA is updated and bit 7 of the CONFIG register becomes cleared <0> by the TCN75A. TABLE 5-2: SHUTDOWN AND ONE-SHOT MODE DESCRIPTION 5.3.4.3 ALERT Output Configuration The ALERT output can be configured as either a comparator output or as Interrupt Output mode using bit 1 of the CONFIG register. The polarity can also be specified as an active-high or active-low using bit 2 of the CONFIG register. The following sections describe each output mode, while Figure 5-7 gives a graphical description. 5.3.4.4 Comparator Mode In Comparator mode, the ALERT output is asserted when TA is greater than TSET. The pin remains active until TA is lower than THYST. The Comparator mode is useful for thermostat-type applications, such as turning on a cooling fan or triggering a system shutdown when the temperature exceeds a safe operating range. In Comparator mode, if the device enters the Shutdown mode with asserted ALERT output, the output remains active during shutdown. The device must be operating in continuous conversion, with TA below THYST, for the ALERT output to be deasserted. 5.3.4.5 Interrupt Mode In Interrupt mode, the ALERT output is asserted when TA is greater than TSET. However, the output is deasserted when the user performs a read from any register. This mode is designed for interrupt-driven, microcontroller-based systems. The microcontroller receiving the interrupt will have to acknowledge the interrupt by reading any register from the TCN75A. This will clear the interrupt and the ALERT pin will become deasserted. When TA drifts below THYST, the TCN75A outputs another interrupt and the controller needs to read a register to deassert the ALERT output. Shutting down the device will also reset, or deassert, the ALERT output. Operational Mode One-Shot (Bit 7) Shutdown (Bit 0) Continuous Conversion 0 0 Shutdown 0 1 Continuous Conversion (One-shot is ignored) 1 0 One-shot (Note 1) 1 1 Note 1: The shutdown command <01> needs to be programmed before sending a one-shot command <11>. TSET THYST ALERT ALERT Comparator mode Interrupt mode Active-low Active-low TA Register Read * See Section 5.3.4.5 “Interrupt Mode” *  2010 Microchip Technology Inc. DS21935D-page 25 TCN75A FIGURE 5-7: Alert Output. 5.3.4.6 Fault Queue The fault queue feature can be used as a filter to lessen the probability of spurious activation of the ALERT pin. TA must remain above TSET for the consecutive number of conversion cycles selected using the Fault Queue bits. Bit 3 and bit 4 of the CONFIG register can be used to select up to six fault queue cycles. For example, if six fault queues are selected, TA must be greater than TSET for six consecutive conversions before ALERT is asserted as a comparator or an interrupt output. This queue setting also applies for THYST. If six fault queues are selected, TA must remain below THYST for six consecutive conversions before ALERT is deasserted (Comparator mode) or before another interrupt is asserted (Interrupt mode). 5.3.4.7  ADC Resolution The TCN75A provides access to select the ADC resolution from 9-bit to 12-bit (0.5°C to 0.0625°C resolution) using bit 6 and bit 5 of the CONFIG register. The user can gain better insight into the trends and characteristics of the ambient temperature by using a finer resolution. Increasing the resolution also reduces the quantization error. Figure 2-3 shows accuracy versus resolution. Table 5-3 shows the TA register conversion time for the corresponding resolution. TABLE 5-3: RESOLUTION AND CONVERSION TIME 5.4 Summary of Power-up Condition The TCN75A has an internal Power-on Reset (POR) circuit. If the power supply voltage VDD glitches down to the 1.7V (typical) threshold, the device resets the registers to the power-up default settings. Table 5-4 shows the power-up default summary. TABLE 5-4: POWER-UP DEFAULTS At power-up, the TCN75A has an inherent 2 ms (typical) power-up delay before updating the registers with default values and start a conversion cycle. This delay reduces register corruption due to unsettled power. After power-up, it takes tCONV for the TCN75A to update the TA register with valid temperature data. Bits Resolution tCONV (typical) 9 0.5 30 ms 10 0.25 60 ms 11 0.125 120 ms 12 0.0625 240 ms Register Data (Hex) Power-up Defaults TA 0000 0°C TSET A000 80°C THYST 9600 75°C Pointer 00 Temperature register CONFIG 00 Continuous Conversion Comparator mode Active-low Output Fault Queue 1 9-bit Resolution TCN75A DS21935D-page 26  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS21935D-page 27 TCN75A 6.0 APPLICATIONS INFORMATION 6.1 Connecting to the Serial Bus The SDA and SCL serial interface are open-drain pins that require pull-up resistors. This configuration is shown in Figure 6-1. FIGURE 6-1: Pull-up Resistors On Serial Interface. The TCN75A is designed to meet 0.4V (maximum) voltage drop at 3 mA of current. This allows the TCN75A to drive lower values of pull-up resistors and higher bus capacitance. In this application, all devices on the bus must meet the same pull-down current requirements. 6.2 Typical Application Microchip provides several microcontroller product lines with Master Synchronous Serial Port Modules (MSSP) that include the I2C interface mode. This module implements all master and slave functions and simplifies the firmware development overhead. Figure 6-2 shows a typical application using the PIC16F737 as a master to control other Microchip slave products, such as EEPROM, fan speed controllers and the TCN75A temperature sensor connected to the bus. FIGURE 6-2: Multiple Devices on I2C™ Bus. The ALERT output can be wire-ORed with a number of other open-drain devices. In such applications, the output needs to be programmed as an active-low output. Most systems will require pull-up resistors for this configuration. 6.3 Layout Considerations The TCN75A does not require any additional components besides the master controller in order to measure temperature. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the power pins in order to provide effective noise protection. For applications where a switching regulator is used to power the sensor, it is recommended to add a 200Ω resistor in series to VDD to filter out the switcher noise from the sensor. It is also recommended to add the series resistor in applications where a linear regulator is used to step-down a switching regulator voltage to power the sensor. For example, if a linearly regulated 3.3V from a 5V switching regulator is used to power the sensor, add a 200Ω series resistor (refer to Figure 6-3). FIGURE 6-3: Power-supply Filter using a Single Resistor. 6.4 Thermal Considerations The TCN75A measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the Printed Circuit Board (PCB) is provided by the pins. Therefore, the TCN75A effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator. A potential for self-heating errors can exist if the TCN75A SDA and SCL communication lines are heavily loaded with pull-ups. Typically, the self-heating error is negligible because of the relatively small current consumption of the TCN75A. However, in order to maximize the temperature accuracy, the SDA and SCL pins need to be lightly loaded. PIC® SDA SCL VDD R R MCU TCN75A SDA SCL PIC16F737 Microcontroller Temperature Sensor 24LC01 EEPROM TC654 Fan Speed Controller TCN75A VDD 200 TCN75A Switching Regulator 0.1µF bypass VDD 200 TCN75A Switching Regulator 0.1µF bypass Regulator Linear TCN75A DS21935D-page 28  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS21935D-page 29 TCN75A 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TCN75AV OA^^1018 256 8-Lead MSOP Example: XXXXX YWWNNN N75A/E 018256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 e3 TCN75A DS21935D-page 30  2010 Microchip Technology Inc.            ! "#$ %!&  '(!%&! %( %")%% %"    &   "*"%!"&"$  %!  "$  %!    %#"+&&  " , &   "%   *-+ ./0 . & % # % ! ))%!%%   *10 $& '! ! )%!%% '$$& % !     1%& %!% 2 " ) '   %  2   $ % %" % %% 033)))& &3 2  4% 55** & 5&% 6 67 8 6!&($ 6 9 % :+./ 7 ; %  < <  "" 2 2  + 9+ + % "$$   < + 7 ="% * ./ "" 2 ="% * ,./ 7 5 % ,./ 1%5 % 5  : 9 1% % 5 +*1 1%  > < 9> 5 "2  9 < , 5 "="% (  <  D N E E1 NOTE 1 1 2 e b A A1 A2 c L1 L φ     ) / .  2010 Microchip Technology Inc. DS21935D-page 31 TCN75A 8-Lead Plastic Micro Small Outline Package (UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging TCN75A DS21935D-page 32  2010 Microchip Technology Inc. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2010 Microchip Technology Inc. DS21935D-page 33 TCN75A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging TCN75A DS21935D-page 34  2010 Microchip Technology Inc.     !"#$%&'()*+   1%& %!% 2 " ) '   %  2   $ % %" % %% 033)))& &3 2   2010 Microchip Technology Inc. DS21935D-page 35 TCN75A APPENDIX A: REVISION HISTORY Revision D (September 2010) The following is the list of modifications: 1. Updated Section 6.3 Layout Considerations. Revision C (November 2006) The following is the list of modifications: 1. Updated the accuracy specification limits. 2. Numerous edits throughout the data sheet. 3. Updated the package outline drawings. 4. Added disclaimers to package outline drawings. 5. Updated the package marking information for pb-free markings. Revision B (May 2006) The following is the list of modifications: 1. Revised Product ID System; Added OA713 and UA713 packages. Revision A (November 2007) • Original Release of this Document. TCN75A DS21935D-page 36  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS21935D-page 37 TCN75A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TCN75A: Temperature Sensor Temperature Range: V = -40C to +125C Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead, Tape and Reel UA = Plastic Micro Small Outline (MSOP), 8-lead UA713 = Plastic Micro Small Outline (MSOP), 8-lead Tape and Reel PART NO. X /XX Temperature Package Range Device Examples: a) TCN75AVOA: 8LD SOIC package. b) TCN75AVOA713: Tape and Reel, 8LD SOIC package. a) TCN75AVUA: 8LD MSOP package. b) TCN75AVUA713: Tape and Reel, 8LD MSOP package. TCN75A DS21935D-page 38  2010 Microchip Technology Inc. NOTES:  2010 Microchip Technology Inc. DS21935D-page 39 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-565-7 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21935D-page 40  2010 Microchip Technology Inc. AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-213-7830 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Worldwide Sales and Service 08/04/10 © 2008 Microchip Technology Inc. DS39631E PIC18F2420/2520/4420/4520 Data Sheet 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology DS39631E-page ii © 2008 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2008, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2008 Microchip Technology Inc. DS39631E-page 1 PIC18F2420/2520/4420/4520 Power Management Features: • Run: CPU on, Peripherals on • Idle: CPU off, Peripherals on • Sleep: CPU off, Peripherals off • Ultra Low 50nA Input Leakage • Run mode Currents Down to 11 μA Typical • Idle mode Currents Down to 2.5 μA Typical • Sleep mode Current Down to 100 nA Typical • Timer1 Oscillator: 900 nA, 32 kHz, 2V • Watchdog Timer: 1.4 μA, 2V Typical • Two-Speed Oscillator Start-up Flexible Oscillator Structure: • Four Crystal modes, up to 40 MHz • 4x Phase Lock Loop (PLL) – Available for Crystal and Internal Oscillators • Two External RC modes, up to 4 MHz • Two External Clock modes, up to 40 MHz • Internal Oscillator Block: - Fast wake from Sleep and Idle, 1 μs typical - 8 use-selectable frequencies, from 31 kHz to 8 MHz - Provides a complete range of clock speeds from 31 kHz to 32 MHz when used with PLL - User-tunable to compensate for frequency drift • Secondary Oscillator using Timer1 @ 32 kHz • Fail-Safe Clock Monitor: - Allows for safe shutdown if peripheral clock stops Peripheral Highlights: • High-Current Sink/Source 25 mA/25 mA • Three Programmable External Interrupts • Four Input Change Interrupts • Up to 2 Capture/Compare/PWM (CCP) modules, one with Auto-Shutdown (28-pin devices) • Enhanced Capture/Compare/PWM (ECCP) module (40/44-pin devices only): - One, two or four PWM outputs - Selectable polarity - Programmable dead time - Auto-shutdown and auto-restart Peripheral Highlights (Continued): • Master Synchronous Serial Port (MSSP) module Supporting 3-Wire SPI (all 4 modes) and I2C™ Master and Slave modes • Enhanced Addressable USART module: - Supports RS-485, RS-232 and LIN/J2602 - RS-232 operation using internal oscillator block (no external crystal required) - Auto-wake-up on Start bit - Auto-Baud Detect • 10-Bit, up to 13-Channel Analog-to-Digital (A/D) Converter module: - Auto-acquisition capability - Conversion available during Sleep • Dual Analog Comparators with Input Multiplexing • Programmable 16-Level High/Low-Voltage Detection (HLVD) module: - Supports interrupt on High/Low-Voltage Detection Special Microcontroller Features: • C Compiler Optimized Architecture: - Optional extended instruction set designed to optimize re-entrant code • 100,000 Erase/Write Cycle Enhanced Flash Program Memory Typical • 1,000,000 Erase/Write Cycle Data EEPROM Memory Typical • Flash/Data EEPROM Retention: 100 Years Typical • Self-Programmable under Software Control • Priority Levels for Interrupts • 8 x 8 Single-Cycle Hardware Multiplier • Extended Watchdog Timer (WDT): - Programmable period from 4 ms to 131s • Single-Supply 5V In-Circuit Serial Programming™ (ICSP™) via Two Pins • In-Circuit Debug (ICD) via Two Pins • Wide Operating Voltage Range: 2.0V to 5.5V • Programmable Brown-out Reset (BOR) with Software Enable Option - Device Program Memory Data Memory I/O 10-Bit A/D (ch) CCP/ ECCP (PWM) MSSP EUSART Comp. Timers 8/16-Bit Flash (bytes) # Single-Word Instructions SRAM (bytes) EEPROM (bytes) SPI Master I 2C™ PIC18F2420 16K 8192 768 256 25 10 2/0 Y Y 1 2 1/3 PIC18F2520 32K 16384 1536 256 25 10 2/0 Y Y 1 2 1/3 PIC18F4420 16K 8192 768 256 36 13 1/1 Y Y 1 2 1/3 PIC18F4520 32K 16384 1536 256 36 13 1/1 Y Y 1 2 1/3 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology PIC18F2420/2520/4420/4520 DS39631E-page 2 © 2008 Microchip Technology Inc. Pin Diagrams PIC18F2520 10 11 2 3 4 5 6 1 8 7 9 12 13 14 15 16 17 18 19 20 23 24 25 26 27 28 22 21 MCLR/VPP/RE3 RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT VSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL RB7/KBI3/PGD RB6//KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11 RB3/AN9/CCP2(1) RB2/INT2/AN8 RB1/INT1/AN10 RB0/INT0/FLT0/AN12 VDD VSS RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA 28-Pin SPDIP, SOIC PIC18F2420 Note 1: RB3 is the alternate pin for CCP2 multiplexing. 10 11 2 3 6 1 18 19 20 21 22 12 13 14 15 8 7 16 17 2827 2625 2423 9 PIC18F2420 RC0/T1OSO/T13CKI 5 4 RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4KBI0/AN11 RB3/AN9/CCP2(1) RB2/INT2/AN8 RB1/INT1/AN10 RB0/INT0/FLT0/AN12 VDD VSS RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA MCLR/VPP/RE3 RA1/AN1 RA0/AN0 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT VSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL PIC18F2520 28-Pin QFN RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11 RB3/AN9/CCP2(1) RB2/INT2/AN8 RB1/INT1/AN10 RB0/INT0/FLT0/AN12 VDD VSS RD7/PSP7/P1D RD6/PSP6/P1C RD5/PSP5/P1B RD4/PSP4 RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 MCLR/VPP/RE3 RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT RE0/RD/AN5 RE1/WR/AN6 RE2/CS/AN7 VDD VSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1/P1A RC3/SCK/SCL RD0/PSP0 RD1/PSP1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 PIC18F4520 40-Pin PDIP PIC18F4420 © 2008 Microchip Technology Inc. DS39631E-page 3 PIC18F2420/2520/4420/4520 Pin Diagrams (Cont.’d) Note 1: RB3 is the alternate pin for CCP2 multiplexing. 10 11 2 3 4 5 6 1 12 13 14 15 18 19 20 21 22 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 35 34 9 PIC18F442037 RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA0/AN0 RA1/AN1 MCLR/VPP/RE3 RB3/AN9/CCP2(1) RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD NC RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 RD1/PSP1 RD0/PSP0 RC3/SCK/SCL RC2/CCP1/P1A RC1/T1OSI/CCP2(1) RC0/T1OSO/T13CKI OSC2/CLKO/RA6 OSC1/CLKI/RA7 VSS VSS VDD VDD RE2/CS/AN7 RE1/WR/AN6 RE0/RD/AN5 RA5/AN4/SS/HLVDIN/C2OUT RA4/T0CKI/C1OUT RC7/RX/DT RD4/PSP4 RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D VSS VDD VDD RB0/INT0/FLT0/AN12 RB1/INT1/AN10 RB2/INT2/AN8 44-pin QFN PIC18F4520 10 11 2 3 4 5 6 1 12 13 14 15 18 19 20 21 22 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 35 34 9 PIC18F442037 RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA0/AN0 RA1/AN1 MCLR/VPP/RE3 NC RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD NC RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 RD1/PSP1 RD0/PSP0 RC3/SCK/SCL RC2/CCP1/P1A RC1/T1OSI/CCP2(1) NC NC RC0/T1OSO/T13CKI OSC2/CLKO/RA6 OSC1/CLKI/RA7 VSS VDD RE2/CS/AN7 RE1/WR/AN6 RE0/RD/AN5 RA5/AN4/SS/HLVDIN/C2OUT RA4/T0CKI/C1OUT RC7/RX/DT RD4/PSP4 RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D VSS VDD RB0/INT0/FLT0/AN12 RB1/INT1/AN10 RB2/INT2/AN8 RB3/AN9/CCP2(1) 44-pin TQFP PIC18F4520 PIC18F2420/2520/4420/4520 DS39631E-page 4 © 2008 Microchip Technology Inc. Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 7 2.0 Oscillator Configurations ............................................................................................................................................................ 23 3.0 Power-Managed Modes ............................................................................................................................................................. 33 4.0 Reset .......................................................................................................................................................................................... 41 5.0 Memory Organization ................................................................................................................................................................. 53 6.0 Flash Program Memory.............................................................................................................................................................. 73 7.0 Data EEPROM Memory ............................................................................................................................................................. 83 8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 89 9.0 Interrupts .................................................................................................................................................................................... 91 10.0 I/O Ports ................................................................................................................................................................................... 105 11.0 Timer0 Module ......................................................................................................................................................................... 123 12.0 Timer1 Module ......................................................................................................................................................................... 127 13.0 Timer2 Module ......................................................................................................................................................................... 133 14.0 Timer3 Module ......................................................................................................................................................................... 135 15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 139 16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 147 17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 161 18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 201 19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 223 20.0 Comparator Module.................................................................................................................................................................. 233 21.0 Comparator Voltage Reference Module................................................................................................................................... 239 22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 243 23.0 Special Features of the CPU.................................................................................................................................................... 249 24.0 Instruction Set Summary .......................................................................................................................................................... 267 25.0 Development Support............................................................................................................................................................... 317 26.0 Electrical Characteristics .......................................................................................................................................................... 321 27.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 361 28.0 Packaging Information.............................................................................................................................................................. 383 Appendix A: Revision History............................................................................................................................................................. 395 Appendix B: Device Differences......................................................................................................................................................... 395 Appendix C: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 396 Appendix D: Migration from High-End to Enhanced Devices............................................................................................................. 396 Index .................................................................................................................................................................................................. 397 The Microchip Web Site ..................................................................................................................................................................... 407 Customer Change Notification Service .............................................................................................................................................. 407 Customer Support.............................................................................................................................................................................. 407 Reader Response .............................................................................................................................................................................. 408 PIC18F2420/2520/4420/4520 Product Identification System ............................................................................................................ 409 © 2008 Microchip Technology Inc. DS39631E-page 5 PIC18F2420/2520/4420/4520 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. PIC18F2420/2520/4420/4520 DS39631E-page 6 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 7 PIC18F2420/2520/4420/4520 1.0 DEVICE OVERVIEW This document contains device-specific information for the following devices: This family offers the advantages of all PIC18 microcontrollers – namely, high computational performance at an economical price – with the addition of high-endurance, Enhanced Flash program memory. On top of these features, the PIC18F2420/2520/4420/ 4520 family introduces design enhancements that make these microcontrollers a logical choice for many high-performance, power sensitive applications. 1.1 New Core Features 1.1.1 nanoWatt TECHNOLOGY All of the devices in the PIC18F2420/2520/4420/4520 family incorporate a range of features that can significantly reduce power consumption during operation. Key items include: • Alternate Run Modes: By clocking the controller from the Timer1 source or the internal oscillator block, power consumption during code execution can be reduced by as much as 90%. • Multiple Idle Modes: The controller can also run with its CPU core disabled but the peripherals still active. In these states, power consumption can be reduced even further, to as little as 4% of normal operation requirements. • On-the-Fly Mode Switching: The powermanaged modes are invoked by user code during operation, allowing the user to incorporate power-saving ideas into their application’s software design. • Low Consumption in Key Modules: The power requirements for both Timer1 and the Watchdog Timer are minimized. See Section 26.0 “Electrical Characteristics” for values. 1.1.2 MULTIPLE OSCILLATOR OPTIONS AND FEATURES All of the devices in the PIC18F2420/2520/4420/4520 family offer ten different oscillator options, allowing users a wide range of choices in developing application hardware. These include: • Four Crystal modes, using crystals or ceramic resonators • Two External Clock modes, offering the option of using two pins (oscillator input and a divide-by-4 clock output) or one pin (oscillator input, with the second pin reassigned as general I/O) • Two External RC Oscillator modes with the same pin options as the External Clock modes • An internal oscillator block which provides an 8 MHz clock and an INTRC source (approximately 31 kHz), as well as a range of 6 user-selectable clock frequencies, between 125 kHz to 4 MHz, for a total of 8 clock frequencies. This option frees the two oscillator pins for use as additional general purpose I/O. • A Phase Lock Loop (PLL) frequency multiplier, available to both the High-Speed Crystal and Internal Oscillator modes, which allows clock speeds of up to 40 MHz. Used with the internal oscillator, the PLL gives users a complete selection of clock speeds, from 31 kHz to 32 MHz – all without using an external crystal or clock circuit. Besides its availability as a clock source, the internal oscillator block provides a stable reference source that gives the family additional features for robust operation: • Fail-Safe Clock Monitor: This option constantly monitors the main clock source against a reference signal provided by the internal oscillator. If a clock failure occurs, the controller is switched to the internal oscillator block, allowing for continued low-speed operation or a safe application shutdown. • Two-Speed Start-up: This option allows the internal oscillator to serve as the clock source from Power-on Reset, or wake-up from Sleep mode, until the primary clock source is available. • PIC18F2420 • PIC18LF2420 • PIC18F2520 • PIC18LF2520 • PIC18F4420 • PIC18LF4420 • PIC18F4520 • PIC18LF4520 PIC18F2420/2520/4420/4520 DS39631E-page 8 © 2008 Microchip Technology Inc. 1.2 Other Special Features • Memory Endurance: The Enhanced Flash cells for both program memory and data EEPROM are rated to last for many thousands of erase/write cycles – up to 100,000 for program memory and 1,000,000 for EEPROM. Data retention without refresh is conservatively estimated to be greater than 40 years. • Self-Programmability: These devices can write to their own program memory spaces under internal software control. By using a bootloader routine located in the protected Boot Block at the top of program memory, it becomes possible to create an application that can update itself in the field. • Extended Instruction Set: The PIC18F2420/ 2520/4420/4520 family introduces an optional extension to the PIC18 instruction set, which adds 8 new instructions and an Indexed Addressing mode. This extension, enabled as a device configuration option, has been specifically designed to optimize re-entrant application code originally developed in high-level languages, such as C. • Enhanced CCP Module: In PWM mode, this module provides 1, 2 or 4 modulated outputs for controlling half-bridge and full-bridge drivers. Other features include auto-shutdown, for disabling PWM outputs on interrupt, or other select conditions, and auto-restart to reactivate outputs once the condition has cleared. • Enhanced Addressable USART: This serial communication module is capable of standard RS-232 operation and provides support for the LIN bus protocol. Other enhancements include automatic baud rate detection and a 16-bit Baud Rate Generator for improved resolution. When the microcontroller is using the internal oscillator block, the EUSART provides stable operation for applications that talk to the outside world without using an external crystal (or its accompanying power requirement). • 10-Bit A/D Converter: This module incorporates programmable acquisition time, allowing for a channel to be selected and a conversion to be initiated without waiting for a sampling period and thus, reducing code overhead. • Extended Watchdog Timer (WDT): This enhanced version incorporates a 16-bit prescaler, allowing an extended time-out range that is stable across operating voltage and temperature. See Section 26.0 “Electrical Characteristics” for time-out periods. 1.3 Details on Individual Family Members Devices in the PIC18F2420/2520/4420/4520 family are available in 28-pin and 40/44-pin packages. Block diagrams for the two groups are shown in Figure 1-1 and Figure 1-2. The devices are differentiated from each other in five ways: 1. Flash program memory (16 Kbytes for PIC18F2420/4420 devices and 32 Kbytes for PIC18F2520/4520 devices). 2. A/D channels (10 for 28-pin devices, 13 for 40/44-pin devices). 3. I/O ports (3 bidirectional ports on 28-pin devices, 5 bidirectional ports on 40/44-pin devices). 4. CCP and Enhanced CCP implementation (28-pin devices have 2 standard CCP modules, 40/44-pin devices have one standard CCP module and one ECCP module). 5. Parallel Slave Port (present only on 40/44-pin devices). All other features for devices in this family are identical. These are summarized in Table 1-1. The pinouts for all devices are listed in Table 1-2 and Table 1-3. Like all Microchip PIC18 devices, members of the PIC18F2420/2520/4420/4520 family are available as both standard and low-voltage devices. Standard devices with Enhanced Flash memory, designated with an “F” in the part number (such as PIC18F2420), accommodate an operating VDD range of 4.2V to 5.5V. Low-voltage parts, designated by “LF” (such as PIC18LF2420), function over an extended VDD range of 2.0V to 5.5V. © 2008 Microchip Technology Inc. DS39631E-page 9 PIC18F2420/2520/4420/4520 TABLE 1-1: DEVICE FEATURES Features PIC18F2420 PIC18F2520 PIC18F4420 PIC18F4520 Operating Frequency DC – 40 MHz DC – 40 MHz DC – 40 MHz DC – 40 MHz Program Memory (Bytes) 16384 32768 16384 32768 Program Memory (Instructions) 8192 16384 8192 16384 Data Memory (Bytes) 768 1536 768 1536 Data EEPROM Memory (Bytes) 256 256 256 256 Interrupt Sources 19 19 20 20 I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E Timers 4 4 4 4 Capture/Compare/PWM Modules 2 2 1 1 Enhanced Capture/Compare/PWM Modules 0011 Serial Communications MSSP, Enhanced USART MSSP, Enhanced USART MSSP, Enhanced USART MSSP, Enhanced USART Parallel Communications (PSP) No No Yes Yes 10-Bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels Resets (and Delays) POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT Programmable High/Low-Voltage Detect Yes Yes Yes Yes Programmable Brown-out Reset Yes Yes Yes Yes Instruction Set 75 Instructions; 83 with Extended Instruction Set Enabled 75 Instructions; 83 with Extended Instruction Set Enabled 75 Instructions; 83 with Extended Instruction Set Enabled 75 Instructions; 83 with Extended Instruction Set Enabled Packages 28-Pin SPDIP 28-Pin SOIC 28-Pin QFN 28-Pin SPDIP 28-Pin SOIC 28-Pin QFN 40-Pin PDIP 44-Pin QFN 44-Pin TQFP 40-Pin PDIP 44-Pin QFN 44-Pin TQFP PIC18F2420/2520/4420/4520 DS39631E-page 10 © 2008 Microchip Technology Inc. FIGURE 1-1: PIC18F2420/2520 (28-PIN) BLOCK DIAGRAM Instruction Decode and Control PORTA PORTB PORTC RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT RB0/INT0/FLT0/AN12 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 RB1/INT1/AN10 Data Latch Data Memory ( 3.9 Kbytes ) Address Latch Data Address<12> 12 BSR Access FSR0 FSR1 FSR2 inc/dec logic Address 4 12 4 PCH PCL PCLATH 8 31-Level Stack Program Counter PRODH PRODL 8 x 8 Multiply 8 BITOP 8 8 ALU<8> Address Latch Program Memory (16/32 Kbytes) Data Latch 20 8 8 Table Pointer<21> inc/dec logic 21 8 Data Bus<8> Table Latch 8 IR 12 3 ROM Latch RB2/INT2/AN8 RB3/AN9/CCP2(1) PCLATU PCU OSC2/CLKO(3)/RA6 Note 1: CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set, or RB3 when CCP2MX is not set. 2: RE3 is only available when MCLR functionality is disabled. 3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer to Section 2.0 “Oscillator Configurations” for additional information. RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD Comparator MSSP EUSART 10-Bit ADC Timer0 Timer1 Timer2 Timer3 CCP2 HLVD CCP1 BOR Data EEPROM W Instruction Bus <16> STKPTR Bank 8 State Machine Control Signals Decode 8 8 Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer OSC1(3) OSC2(3) VDD, Brown-out Reset Internal Oscillator Fail-Safe Clock Monitor Precision Reference Band Gap VSS MCLR(2) Block INTRC Oscillator 8 MHz Oscillator Single-Supply Programming In-Circuit Debugger T1OSO OSC1/CLKI(3)/RA7 T1OSI PORTE MCLR/VPP/RE3(2) © 2008 Microchip Technology Inc. DS39631E-page 11 PIC18F2420/2520/4420/4520 FIGURE 1-2: PIC18F4420/4520 (40/44-PIN) BLOCK DIAGRAM Instruction Decode and Control Data Latch Data Memory ( 3.9 Kbytes ) Address Latch Data Address<12> 12 BSR Access FSR0 FSR1 FSR2 inc/dec logic Address 4 12 4 PCH PCL PCLATH 8 31-Level Stack Program Counter PRODH PRODL 8 x 8 Multiply 8 BITOP 8 8 ALU<8> Address Latch Program Memory (16/32 Kbytes) Data Latch 20 8 8 Table Pointer<21> inc/dec logic 21 8 Data Bus<8> Table Latch 8 IR 12 3 ROM Latch PORTD RD0/PSP0 PCLATU PCU PORTE MCLR/VPP/RE3(2) RE2/CS/AN7 RE0/RD/AN5 RE1/WR/AN6 Note 1: CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set, or RB3 when CCP2MX is not set. 2: RE3 is only available when MCLR functionality is disabled. 3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer to Section 2.0 “Oscillator Configurations” for additional information. :RD4/PSP4 Comparator MSSP EUSART 10-Bit ADC Timer0 Timer1 Timer2 Timer3 CCP2 HLVD ECCP1 BOR Data EEPROM W Instruction Bus <16> STKPTR Bank 8 State Machine Control Signals Decode 8 8 Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer OSC1(3) OSC2(3) VDD, Brown-out Reset Internal Oscillator Fail-Safe Clock Monitor Precision Reference Band Gap VSS MCLR(2) Block INTRC Oscillator 8 MHz Oscillator Single-Supply Programming In-Circuit Debugger T1OSI T1OSO RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D PORTA PORTB PORTC RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT RB0/INT0/FLT0/AN12 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1/P1A RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 RB1/INT1/AN10 RB2/INT2/AN8 RB3/AN9/CCP2(1) OSC2/CLKO(3)/RA6 RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD OSC1/CLKI(3)/RA7 PIC18F2420/2520/4420/4520 DS39631E-page 12 © 2008 Microchip Technology Inc. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS Pin Name Pin Number Pin Type Buffer Type SPDIP, Description SOIC QFN MCLR/VPP/RE3 MCLR VPP RE3 1 26 I P I ST ST Master Clear (input) or programming voltage (input). Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input. OSC1/CLKI/RA7 OSC1 CLKI RA7 9 6 I I I/O ST CMOS TTL Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode; CMOS otherwise. External clock source input. Always associated with pin function, OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.) General purpose I/O pin. OSC2/CLKO/RA6 OSC2 CLKO RA6 10 7 O O I/O — — TTL Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. © 2008 Microchip Technology Inc. DS39631E-page 13 PIC18F2420/2520/4420/4520 PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 2 27 I/O I TTL Analog Digital I/O. Analog input 0. RA1/AN1 RA1 AN1 3 28 I/O I TTL Analog Digital I/O. Analog input 1. RA2/AN2/VREF-/CVREF RA2 AN2 VREFCVREF 4 1 I/O I I O TTL Analog Analog Analog Digital I/O. Analog input 2. A/D reference voltage (low) input. Comparator reference voltage output. RA3/AN3/VREF+ RA3 AN3 VREF+ 5 2 I/O I I TTL Analog Analog Digital I/O. Analog input 3. A/D reference voltage (high) input. RA4/T0CKI/C1OUT RA4 T0CKI C1OUT 6 3 I/O I O ST ST — Digital I/O. Timer0 external clock input. Comparator 1 output. RA5/AN4/SS/HLVDIN/ C2OUT RA5 AN4 SS HLVDIN C2OUT 7 4 I/O I I I O TTL Analog TTL Analog — Digital I/O. Analog input 4. SPI slave select input. High/Low-Voltage Detect input. Comparator 2 output. RA6 See the OSC2/CLKO/RA6 pin. RA7 See the OSC1/CLKI/RA7 pin. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type SPDIP, Description SOIC QFN Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. PIC18F2420/2520/4420/4520 DS39631E-page 14 © 2008 Microchip Technology Inc. PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT0/FLT0/AN12 RB0 INT0 FLT0 AN12 21 18 I/O I I I TTL ST ST Analog Digital I/O. External interrupt 0. PWM Fault input for CCP1. Analog input 12. RB1/INT1/AN10 RB1 INT1 AN10 22 19 I/O I I TTL ST Analog Digital I/O. External interrupt 1. Analog input 10. RB2/INT2/AN8 RB2 INT2 AN8 23 20 I/O I I TTL ST Analog Digital I/O. External interrupt 2. Analog input 8. RB3/AN9/CCP2 RB3 AN9 CCP2(1) 24 21 I/O I I/O TTL Analog ST Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM2 output. RB4/KBI0/AN11 RB4 KBI0 AN11 25 22 I/O I I TTL TTL Analog Digital I/O. Interrupt-on-change pin. Analog input 11. RB5/KBI1/PGM RB5 KBI1 PGM 26 23 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin. RB6/KBI2/PGC RB6 KBI2 PGC 27 24 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin. RB7/KBI3/PGD RB7 KBI3 PGD 28 25 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type SPDIP, Description SOIC QFN Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. © 2008 Microchip Technology Inc. DS39631E-page 15 PIC18F2420/2520/4420/4520 PORTC is a bidirectional I/O port. RC0/T1OSO/T13CKI RC0 T1OSO T13CKI 11 8 I/O O I ST — ST Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input. RC1/T1OSI/CCP2 RC1 T1OSI CCP2(2) 12 9 I/O I I/O ST Analog ST Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM2 output. RC2/CCP1 RC2 CCP1 13 10 I/O I/O ST ST Digital I/O. Capture 1 input/Compare 1 output/PWM1 output. RC3/SCK/SCL RC3 SCK SCL 14 11 I/O I/O I/O ST ST ST Digital I/O. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I2C™ mode. RC4/SDI/SDA RC4 SDI SDA 15 12 I/O I I/O ST ST ST Digital I/O. SPI data in. I 2C data I/O. RC5/SDO RC5 SDO 16 13 I/O O ST — Digital I/O. SPI data out. RC6/TX/CK RC6 TX CK 17 14 I/O O I/O ST — ST Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see related RX/DT). RC7/RX/DT RC7 RX DT 18 15 I/O I I/O ST ST ST Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see related TX/CK). RE3 — — — — See MCLR/VPP/RE3 pin. VSS 8, 19 5, 16 P — Ground reference for logic and I/O pins. VDD 20 17 P — Positive supply for logic and I/O pins. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type SPDIP, Description SOIC QFN Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. PIC18F2420/2520/4420/4520 DS39631E-page 16 © 2008 Microchip Technology Inc. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP MCLR/VPP/RE3 MCLR VPP RE3 1 18 18 I P I ST ST Master Clear (input) or programming voltage (input). Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input. OSC1/CLKI/RA7 OSC1 CLKI RA7 13 32 30 I I I/O ST CMOS TTL Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode; analog otherwise. External clock source input. Always associated with pin function, OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.) General purpose I/O pin. OSC2/CLKO/RA6 OSC2 CLKO RA6 14 33 31 O O I/O — — TTL Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. © 2008 Microchip Technology Inc. DS39631E-page 17 PIC18F2420/2520/4420/4520 PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 2 19 19 I/O I TTL Analog Digital I/O. Analog input 0. RA1/AN1 RA1 AN1 3 20 20 I/O I TTL Analog Digital I/O. Analog input 1. RA2/AN2/VREF-/CVREF RA2 AN2 VREFCVREF 4 21 21 I/O I I O TTL Analog Analog Analog Digital I/O. Analog input 2. A/D reference voltage (low) input. Comparator reference voltage output. RA3/AN3/VREF+ RA3 AN3 VREF+ 5 22 22 I/O I I TTL Analog Analog Digital I/O. Analog input 3. A/D reference voltage (high) input. RA4/T0CKI/C1OUT RA4 T0CKI C1OUT 6 23 23 I/O I O ST ST — Digital I/O. Timer0 external clock input. Comparator 1 output. RA5/AN4/SS/HLVDIN/ C2OUT RA5 AN4 SS HLVDIN C2OUT 7 24 24 I/O I I I O TTL Analog TTL Analog — Digital I/O. Analog input 4. SPI slave select input. High/Low-Voltage Detect input. Comparator 2 output. RA6 See the OSC2/CLKO/RA6 pin. RA7 See the OSC1/CLKI/RA7 pin. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. PIC18F2420/2520/4420/4520 DS39631E-page 18 © 2008 Microchip Technology Inc. PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT0/FLT0/AN12 RB0 INT0 FLT0 AN12 33 9 8 I/O I I I TTL ST ST Analog Digital I/O. External interrupt 0. PWM Fault input for Enhanced CCP1. Analog input 12. RB1/INT1/AN10 RB1 INT1 AN10 34 10 9 I/O I I TTL ST Analog Digital I/O. External interrupt 1. Analog input 10. RB2/INT2/AN8 RB2 INT2 AN8 35 11 10 I/O I I TTL ST Analog Digital I/O. External interrupt 2. Analog input 8. RB3/AN9/CCP2 RB3 AN9 CCP2(1) 36 12 11 I/O I I/O TTL Analog ST Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM2 output. RB4/KBI0/AN11 RB4 KBI0 AN11 37 14 14 I/O I I TTL TTL Analog Digital I/O. Interrupt-on-change pin. Analog input 11. RB5/KBI1/PGM RB5 KBI1 PGM 38 15 15 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin. RB6/KBI2/PGC RB6 KBI2 PGC 39 16 16 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin. RB7/KBI3/PGD RB7 KBI3 PGD 40 17 17 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. © 2008 Microchip Technology Inc. DS39631E-page 19 PIC18F2420/2520/4420/4520 PORTC is a bidirectional I/O port. RC0/T1OSO/T13CKI RC0 T1OSO T13CKI 15 34 32 I/O O I ST — ST Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input. RC1/T1OSI/CCP2 RC1 T1OSI CCP2(2) 16 35 35 I/O I I/O ST CMOS ST Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM2 output. RC2/CCP1/P1A RC2 CCP1 P1A 17 36 36 I/O I/O O ST ST — Digital I/O. Capture 1 input/Compare 1 output/PWM1 output. Enhanced CCP1 output. RC3/SCK/SCL RC3 SCK SCL 18 37 37 I/O I/O I/O ST ST ST Digital I/O. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I2C™ mode. RC4/SDI/SDA RC4 SDI SDA 23 42 42 I/O I I/O ST ST ST Digital I/O. SPI data in. I 2C data I/O. RC5/SDO RC5 SDO 24 43 43 I/O O ST — Digital I/O. SPI data out. RC6/TX/CK RC6 TX CK 25 44 44 I/O O I/O ST — ST Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see related RX/DT). RC7/RX/DT RC7 RX DT 26 1 1 I/O I I/O ST ST ST Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see related TX/CK). TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. PIC18F2420/2520/4420/4520 DS39631E-page 20 © 2008 Microchip Technology Inc. PORTD is a bidirectional I/O port or a Parallel Slave Port (PSP) for interfacing to a microprocessor port. These pins have TTL input buffers when PSP module is enabled. RD0/PSP0 RD0 PSP0 19 38 38 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD1/PSP1 RD1 PSP1 20 39 39 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD2/PSP2 RD2 PSP2 21 40 40 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD3/PSP3 RD3 PSP3 22 41 41 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD4/PSP4 RD4 PSP4 27 2 2 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD5/PSP5/P1B RD5 PSP5 P1B 28 3 3 I/O I/O O ST TTL — Digital I/O. Parallel Slave Port data. Enhanced CCP1 output. RD6/PSP6/P1C RD6 PSP6 P1C 29 4 4 I/O I/O O ST TTL — Digital I/O. Parallel Slave Port data. Enhanced CCP1 output. RD7/PSP7/P1D RD7 PSP7 P1D 30 5 5 I/O I/O O ST TTL — Digital I/O. Parallel Slave Port data. Enhanced CCP1 output. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. © 2008 Microchip Technology Inc. DS39631E-page 21 PIC18F2420/2520/4420/4520 PORTE is a bidirectional I/O port. RE0/RD/AN5 RE0 RD AN5 8 25 25 I/O I I ST TTL Analog Digital I/O. Read control for Parallel Slave Port (see also WR and CS pins). Analog input 5. RE1/WR/AN6 RE1 WR AN6 9 26 26 I/O I I ST TTL Analog Digital I/O. Write control for Parallel Slave Port (see CS and RD pins). Analog input 6. RE2/CS/AN7 RE2 CS AN7 10 27 27 I/O I I ST TTL Analog Digital I/O. Chip Select control for Parallel Slave Port (see related RD and WR). Analog input 7. RE3 — — — — — See MCLR/VPP/RE3 pin. VSS 12, 31 6, 30, 31 6, 29 P — Ground reference for logic and I/O pins. VDD 11, 32 7, 8, 28, 29 7, 28 P — Positive supply for logic and I/O pins. NC — 13 12, 13, 33, 34 — — No Connect. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. PIC18F2420/2520/4420/4520 DS39631E-page 22 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 23 PIC18F2420/2520/4420/4520 2.0 OSCILLATOR CONFIGURATIONS 2.1 Oscillator Types PIC18F2420/2520/4420/4520 devices can be operated in ten different oscillator modes. The user can program the Configuration bits, FOSC<3:0>, in Configuration Register 1H to select one of these ten modes: 1. LP Low-Power Crystal 2. XT Crystal/Resonator 3. HS High-Speed Crystal/Resonator 4. HSPLL High-Speed Crystal/Resonator with PLL Enabled 5. RC External Resistor/Capacitor with FOSC/4 Output on RA6 6. RCIO External Resistor/Capacitor with I/O on RA6 7. INTIO1 Internal Oscillator with FOSC/4 Output on RA6 and I/O on RA7 8. INTIO2 Internal Oscillator with I/O on RA6 and RA7 9. EC External Clock with FOSC/4 Output 10. ECIO External Clock with I/O on RA6 2.2 Crystal Oscillator/Ceramic Resonators In XT, LP, HS or HSPLL Oscillator modes, a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation. Figure 2-1 shows the pin connections. The oscillator design requires the use of a parallel cut crystal. FIGURE 2-1: CRYSTAL/CERAMIC RESONATOR OPERATION (XT, LP, HS OR HSPLL CONFIGURATION) TABLE 2-1: CAPACITOR SELECTION FOR CERAMIC RESONATORS Note: Use of a series cut crystal may give a frequency out of the crystal manufacturer’s specifications. Typical Capacitor Values Used: Mode Freq OSC1 OSC2 XT 3.58 MHz 4.19 MHz 4 MHz 4 MHz 15 pF 15 pF 30 pF 50 pF 15 pF 15 pF 30 pF 50 pF Capacitor values are for design guidance only. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. See the notes following Table 2-2 for additional information. Note: When using resonators with frequencies above 3.5 MHz, the use of HS mode, rather than XT mode, is recommended. HS mode may be used at any VDD for which the controller is rated. If HS is selected, it is possible that the gain of the oscillator will overdrive the resonator. Therefore, a series resistor should be placed between the OSC2 pin and the resonator. As a good starting point, the recommended value of RS is 330Ω. Note 1: See Table 2-1 and Table 2-2 for initial values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF varies with the oscillator mode chosen. C1(1) C2(1) XTAL OSC2 OSC1 RF(3) Sleep To Logic PIC18FXXXX RS(2) Internal PIC18F2420/2520/4420/4520 DS39631E-page 24 © 2008 Microchip Technology Inc. TABLE 2-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR An external clock source may also be connected to the OSC1 pin in the HS mode, as shown in Figure 2-2. FIGURE 2-2: EXTERNAL CLOCK INPUT OPERATION (HS OSC CONFIGURATION) 2.3 External Clock Input The EC and ECIO Oscillator modes require an external clock source to be connected to the OSC1 pin. There is no oscillator start-up time required after a Power-on Reset or after an exit from Sleep mode. In the EC Oscillator mode, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 2-3 shows the pin connections for the EC Oscillator mode. FIGURE 2-3: EXTERNAL CLOCK INPUT OPERATION (EC CONFIGURATION) The ECIO Oscillator mode functions like the EC mode, except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of PORTA (RA6). Figure 2-4 shows the pin connections for the ECIO Oscillator mode. FIGURE 2-4: EXTERNAL CLOCK INPUT OPERATION (ECIO CONFIGURATION) Osc Type Crystal Freq Typical Capacitor Values Tested: C1 C2 LP 32 kHz 30 pF 30 pF XT 1 MHz 4 MHz 15 pF 15 pF 15 pF 15 pF HS 4 MHz 10 MHz 20 MHz 25 MHz 25 MHz 15 pF 15 pF 15 pF 0 pF 15 pF 15 pF 15 pF 15 pF 5 pF 15 pF Capacitor values are for design guidance only. These capacitors were tested with the crystals listed below for basic start-up and operation. These values are not optimized. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. See the notes following this table for additional information. Crystals Used: 32 kHz 4 MHz 25 MHz 10 MHz 1 MHz 20 MHz Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. 2: When operating below 3V VDD, or when using certain ceramic resonators at any voltage, it may be necessary to use the HS mode or switch to a crystal oscillator. 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 4: Rs may be required to avoid overdriving crystals with low drive level specification. 5: Always verify oscillator performance over the VDD and temperature range that is expected for the application. OSC1 Open OSC2 Clock from Ext. System PIC18FXXXX (HS Mode) OSC1/CLKI FOSC/4 OSC2/CLKO Clock from Ext. System PIC18FXXXX OSC1/CLKI RA6 I/O (OSC2) Clock from Ext. System PIC18FXXXX © 2008 Microchip Technology Inc. DS39631E-page 25 PIC18F2420/2520/4420/4520 2.4 RC Oscillator For timing insensitive applications, the “RC” and “RCIO” device options offer additional cost savings. The actual oscillator frequency is a function of several factors: • supply voltage • values of the external resistor (REXT) and capacitor (CEXT) • operating temperature Given the same device, operating voltage and temperature and component values, there will also be unit-to-unit frequency variations. These are due to factors such as: • normal manufacturing variation • difference in lead frame capacitance between package types (especially for low CEXT values) • variations within the tolerance of limits of REXT and CEXT In the RC Oscillator mode, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 2-5 shows how the R/C combination is connected. FIGURE 2-5: RC OSCILLATOR MODE The RCIO Oscillator mode (Figure 2-6) functions like the RC mode, except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of PORTA (RA6). FIGURE 2-6: RCIO OSCILLATOR MODE 2.5 PLL Frequency Multiplier A Phase Locked Loop (PLL) circuit is provided as an option for users who wish to use a lower frequency oscillator circuit or to clock the device up to its highest rated frequency from a crystal oscillator. This may be useful for customers who are concerned with EMI due to high-frequency crystals or users who require higher clock speeds from an internal oscillator. 2.5.1 HSPLL OSCILLATOR MODE The HSPLL mode makes use of the HS Oscillator mode for frequencies up to 10 MHz. A PLL then multiplies the oscillator output frequency by 4 to produce an internal clock frequency up to 40 MHz. The PLLEN bit is not available in this oscillator mode. The PLL is only available to the crystal oscillator when the FOSC<3:0> Configuration bits are programmed for HSPLL mode (= 0110). FIGURE 2-7: PLL BLOCK DIAGRAM (HS MODE) 2.5.2 PLL AND INTOSC The PLL is also available to the internal oscillator block in selected oscillator modes. In this configuration, the PLL is enabled in software and generates a clock output of up to 32 MHz. The operation of INTOSC with the PLL is described in Section 2.6.4 “PLL in INTOSC Modes”. OSC2/CLKO CEXT REXT PIC18FXXXX OSC1 FOSC/4 Internal Clock VDD VSS Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ CEXT > 20 pF CEXT REXT PIC18FXXXX OSC1 Internal Clock VDD VSS Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ CEXT > 20 pF RA6 I/O (OSC2) MUX VCO Loop Filter Crystal Osc OSC2 OSC1 PLL Enable FIN FOUT SYSCLK Phase Comparator HS Oscillator Enable ÷4 (from Configuration Register 1H) HS Mode PIC18F2420/2520/4420/4520 DS39631E-page 26 © 2008 Microchip Technology Inc. 2.6 Internal Oscillator Block The PIC18F2420/2520/4420/4520 devices include an internal oscillator block which generates two different clock signals; either can be used as the microcontroller’s clock source. This may eliminate the need for external oscillator circuits on the OSC1 and/or OSC2 pins. The main output (INTOSC) is an 8 MHz clock source which can be used to directly drive the device clock. It also drives a postscaler which can provide a range of clock frequencies from 31 kHz to 4 MHz. The INTOSC output is enabled when a clock frequency from 125 kHz to 8 MHz is selected. The other clock source is the internal RC oscillator (INTRC), which provides a nominal 31 kHz output. INTRC is enabled if it is selected as the device clock source; it is also enabled automatically when any of the following are enabled: • Power-up Timer • Fail-Safe Clock Monitor • Watchdog Timer • Two-Speed Start-up These features are discussed in greater detail in Section 23.0 “Special Features of the CPU”. The clock source frequency (INTOSC direct, INTRC direct or INTOSC postscaler) is selected by configuring the IRCF bits of the OSCCON register (page 30). 2.6.1 INTIO MODES Using the internal oscillator as the clock source eliminates the need for up to two external oscillator pins, which can then be used for digital I/O. Two distinct configurations are available: • In INTIO1 mode, the OSC2 pin outputs FOSC/4, while OSC1 functions as RA7 for digital input and output. • In INTIO2 mode, OSC1 functions as RA7 and OSC2 functions as RA6, both for digital input and output. 2.6.2 INTOSC OUTPUT FREQUENCY The internal oscillator block is calibrated at the factory to produce an INTOSC output frequency of 8.0 MHz. The INTRC oscillator operates independently of the INTOSC source. Any changes in INTOSC across voltage and temperature are not necessarily reflected by changes in INTRC and vice versa. 2.6.3 OSCTUNE REGISTER The internal oscillator’s output has been calibrated at the factory but can be adjusted in the user’s application. This is done by writing to the OSCTUNE register (Register 2-1). When the OSCTUNE register is modified, the INTOSC frequency will begin shifting to the new frequency. The INTRC clock will reach the new frequency within 8 clock cycles (approximately 8 * 32 μs = 256 μs). The INTOSC clock will stabilize within 1 ms. Code execution continues during this shift. There is no indication that the shift has occurred. The OSCTUNE register also implements the INTSRC and PLLEN bits, which control certain features of the internal oscillator block. The INTSRC bit allows users to select which internal oscillator provides the clock source when the 31 kHz frequency option is selected. This is covered in greater detail in Section 2.7.1 “Oscillator Control Register”. The PLLEN bit controls the operation of the frequency multiplier, PLL, in internal oscillator modes. 2.6.4 PLL IN INTOSC MODES The 4x frequency multiplier can be used with the internal oscillator block to produce faster device clock speeds than are normally possible with an internal oscillator. When enabled, the PLL produces a clock speed of up to 32 MHz. Unlike HSPLL mode, the PLL is controlled through software. The control bit, PLLEN (OSCTUNE<6>), is used to enable or disable its operation. The PLL is available when the device is configured to use the internal oscillator block as its primary clock source (FOSC<3:0> = 1001 or 1000). Additionally, the PLL will only function when the selected output frequency is either 4 MHz or 8 MHz (OSCCON<6:4> = 111 or 110). If both of these conditions are not met, the PLL is disabled. The PLLEN control bit is only functional in those internal oscillator modes where the PLL is available. In all other modes, it is forced to ‘0’ and is effectively unavailable. 2.6.5 INTOSC FREQUENCY DRIFT The factory calibrates the internal oscillator block output (INTOSC) for 8 MHz. However, this frequency may drift as VDD or temperature changes, which can affect the controller operation in a variety of ways. It is possible to adjust the INTOSC frequency by modifying the value in the OSCTUNE register. This has no effect on the INTRC clock source frequency. Tuning the INTOSC source requires knowing when to make the adjustment, in which direction it should be made, and in some cases, how large a change is needed. Three compensation techniques are discussed in Section 2.6.5.1 “Compensating with the EUSART”, Section 2.6.5.2 “Compensating with the Timers” and Section 2.6.5.3 “Compensating with the CCP Module in Capture Mode”, but other techniques may be used. © 2008 Microchip Technology Inc. DS39631E-page 27 PIC18F2420/2520/4420/4520 2.6.5.1 Compensating with the EUSART An adjustment may be required when the EUSART begins to generate framing errors or receives data with errors while in Asynchronous mode. Framing errors indicate that the device clock frequency is too high. To adjust for this, decrement the value in OSCTUNE to reduce the clock frequency. On the other hand, errors in data may suggest that the clock speed is too low. To compensate, increment OSCTUNE to increase the clock frequency. 2.6.5.2 Compensating with the Timers This technique compares device clock speed to some reference clock. Two timers may be used; one timer is clocked by the peripheral clock, while the other is clocked by a fixed reference source, such as the Timer1 oscillator. Both timers are cleared, but the timer clocked by the reference generates interrupts. When an interrupt occurs, the internally clocked timer is read and both timers are cleared. If the internally clocked timer value is greater than expected, then the internal oscillator block is running too fast. To adjust for this, decrement the OSCTUNE register. 2.6.5.3 Compensating with the CCP Module in Capture Mode A CCP module can use free-running Timer1 (or Timer3), clocked by the internal oscillator block and an external event with a known period (i.e., AC power frequency). The time of the first event is captured in the CCPRxH:CCPRxL registers and is recorded for use later. When the second event causes a capture, the time of the first event is subtracted from the time of the second event. Since the period of the external event is known, the time difference between events can be calculated. If the measured time is much greater than the calculated time, the internal oscillator block is running too fast; to compensate, decrement the OSCTUNE register. If the measured time is much less than the calculated time, the internal oscillator block is running too slow; to compensate, increment the OSCTUNE register. REGISTER 2-1: OSCTUNE: OSCILLATOR TUNING REGISTER R/W-0 R/W-0(1) U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 INTSRC PLLEN(1) — TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit 1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled) 0 = 31 kHz device clock derived directly from INTRC internal oscillator bit 6 PLLEN: Frequency Multiplier PLL for INTOSC Enable bit(1) 1 = PLL enabled for INTOSC (4 MHz and 8 MHz only) 0 = PLL disabled bit 5 Unimplemented: Read as ‘0’ bit 4-0 TUN<4:0>: Frequency Tuning bits 011111 = Maximum frequency • • • • 000001 000000 = Center frequency. Oscillator module is running at the calibrated frequency. 111111 • • • • 100000 = Minimum frequency Note 1: Available only in certain oscillator configurations; otherwise, this bit is unavailable and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes” for details. PIC18F2420/2520/4420/4520 DS39631E-page 28 © 2008 Microchip Technology Inc. 2.7 Clock Sources and Oscillator Switching Like previous PIC18 devices, the PIC18F2420/2520/ 4420/4520 family includes a feature that allows the device clock source to be switched from the main oscillator to an alternate low-frequency clock source. PIC18F2420/2520/4420/4520 devices offer two alternate clock sources. When an alternate clock source is enabled, the various power-managed operating modes are available. Essentially, there are three clock sources for these devices: • Primary oscillators • Secondary oscillators • Internal oscillator block The primary oscillators include the External Crystal and Resonator modes, the External RC modes, the External Clock modes and the internal oscillator block. The particular mode is defined by the FOSC<3:0> Configuration bits. The details of these modes are covered earlier in this chapter. The secondary oscillators are those external sources not connected to the OSC1 or OSC2 pins. These sources may continue to operate even after the controller is placed in a power-managed mode. PIC18F2420/2520/4420/4520 devices offer the Timer1 oscillator as a secondary oscillator. This oscillator, in all power-managed modes, is often the time base for functions such as a Real-Time Clock (RTC). Most often, a 32.768 kHz watch crystal is connected between the RC0/T1OSO/T13CKI and RC1/T1OSI pins. Like the LP Oscillator mode circuit, loading capacitors are also connected from each pin to ground. The Timer1 oscillator is discussed in greater detail in Section 12.3 “Timer1 Oscillator”. In addition to being a primary clock source, the internal oscillator block is available as a power-managed mode clock source. The INTRC source is also used as the clock source for several special features, such as the WDT and Fail-Safe Clock Monitor. The clock sources for the PIC18F2420/2520/4420/4520 devices are shown in Figure 2-8. See Section 23.0 “Special Features of the CPU” for Configuration register details. FIGURE 2-8: PIC18F2420/2520/4420/4520 CLOCK DIAGRAM 4 x PLL FOSC<3:0> Secondary Oscillator T1OSCEN Enable Oscillator T1OSO T1OSI Clock Source Option for Other Modules OSC1 OSC2 Sleep HSPLL, INTOSC/PLL LP, XT, HS, RC, EC T1OSC CPU Peripherals IDLEN Postscaler MUX MUX 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz 125 kHz 250 kHz OSCCON<6:4> 111 110 101 100 011 010 001 000 31 kHz INTRC Source Internal Oscillator Block WDT, PWRT, FSCM 8 MHz Internal Oscillator (INTOSC) OSCCON<6:4> Clock Control OSCCON<1:0> Source 8 MHz 31 kHz (INTRC) OSCTUNE<6> 0 1 OSCTUNE<7> and Two-Speed Start-up Primary Oscillator PIC18F2420/2520/4420/4520 © 2008 Microchip Technology Inc. DS39631E-page 29 PIC18F2420/2520/4420/4520 2.7.1 OSCILLATOR CONTROL REGISTER The OSCCON register (Register 2-2) controls several aspects of the device clock’s operation, both in full-power operation and in power-managed modes. The System Clock Select bits, SCS<1:0>, select the clock source. The available clock sources are the primary clock (defined by the FOSC<3:0> Configuration bits), the secondary clock (Timer1 oscillator) and the internal oscillator block. The clock source changes immediately after one or more of the bits is written to, following a brief clock transition interval. The SCS bits are cleared on all forms of Reset. The Internal Oscillator Frequency Select bits (IRCF<2:0>) select the frequency output of the internal oscillator block to drive the device clock. The choices are the INTRC source, the INTOSC source (8 MHz) or one of the frequencies derived from the INTOSC postscaler (31.25 kHz to 4 MHz). If the internal oscillator block is supplying the device clock, changing the states of these bits will have an immediate change on the internal oscillator’s output. On device Resets, the default output frequency of the internal oscillator block is set at 1 MHz. When a nominal output frequency of 31 kHz is selected (IRCF<2:0> = 000), users may choose which internal oscillator acts as the source. This is done with the INTSRC bit in the OSCTUNE register (OSCTUNE<7>). Setting this bit selects INTOSC as a 31.25 kHz clock source by enabling the divide-by-256 output of the INTOSC postscaler. Clearing INTSRC selects INTRC (nominally 31 kHz) as the clock source. This option allows users to select the tunable and more precise INTOSC as a clock source, while maintaining power savings with a very low clock speed. Regardless of the setting of INTSRC, INTRC always remains the clock source for features such as the Watchdog Timer and the Fail-Safe Clock Monitor. The OSTS, IOFS and T1RUN bits indicate which clock source is currently providing the device clock. The OSTS bit indicates that the Oscillator Start-up Timer (OST) has timed out and the primary clock is providing the device clock in primary clock modes. The IOFS bit indicates when the internal oscillator block has stabilized and is providing the device clock in RC Clock modes. The T1RUN bit (T1CON<6>) indicates when the Timer1 oscillator is providing the device clock in secondary clock modes. In power-managed modes, only one of these three bits will be set at any time. If none of these bits are set, the INTRC is providing the clock or the internal oscillator block has just started and is not yet stable. The IDLEN bit determines if the device goes into Sleep mode or one of the Idle modes when the SLEEP instruction is executed. The use of the flag and control bits in the OSCCON register is discussed in more detail in Section 3.0 “Power-Managed Modes”. 2.7.2 OSCILLATOR TRANSITIONS PIC18F2420/2520/4420/4520 devices contain circuitry to prevent clock “glitches” when switching between clock sources. A short pause in the device clock occurs during the clock switch. The length of this pause is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Clock transitions are discussed in greater detail in Section 3.1.2 “Entering Power-Managed Modes”. Note 1: The Timer1 oscillator must be enabled to select the secondary clock source. The Timer1 oscillator is enabled by setting the T1OSCEN bit in the Timer1 Control register (T1CON<3>). If the Timer1 oscillator is not enabled, then any attempt to select a secondary clock source will be ignored. 2: It is recommended that the Timer1 oscillator be operating and stable before selecting the secondary clock source or a very long delay may occur while the Timer1 oscillator starts. PIC18F2420/2520/4420/4520 DS39631E-page 30 © 2008 Microchip Technology Inc. REGISTER 2-2: OSCCON: OSCILLATOR CONTROL REGISTER R/W-0 R/W-1 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0 IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IDLEN: Idle Enable bit 1 = Device enters an Idle mode on SLEEP instruction 0 = Device enters Sleep mode on SLEEP instruction bit 6-4 IRCF<2:0>: Internal Oscillator Frequency Select bits 111 = 8 MHz (INTOSC drives clock directly) 110 = 4 MHz 101 = 2 MHz 100 = 1 MHz(3) 011 = 500 kHz 010 = 250 kHz 001 = 125 kHz 000 = 31 kHz (from either INTOSC/256 or INTRC directly)(2) bit 3 OSTS: Oscillator Start-up Timer Time-out Status bit(1) 1 = Oscillator Start-up Timer (OST) time-out has expired; primary oscillator is running 0 = Oscillator Start-up Timer (OST) time-out is running; primary oscillator is not ready bit 2 IOFS: INTOSC Frequency Stable bit 1 = INTOSC frequency is stable 0 = INTOSC frequency is not stable bit 1-0 SCS<1:0>: System Clock Select bits 1x = Internal oscillator block 01 = Secondary (Timer1) oscillator 00 = Primary oscillator Note 1: Reset state depends on state of the IESO Configuration bit. 2: Source selected by the INTSRC bit (OSCTUNE<7>), see text. 3: Default output frequency of INTOSC on Reset. © 2008 Microchip Technology Inc. DS39631E-page 31 PIC18F2420/2520/4420/4520 2.8 Effects of Power-Managed Modes on the Various Clock Sources When PRI_IDLE mode is selected, the designated primary oscillator continues to run without interruption. For all other power-managed modes, the oscillator using the OSC1 pin is disabled. The OSC1 pin (and OSC2 pin, if used by the oscillator) will stop oscillating. In secondary clock modes (SEC_RUN and SEC_IDLE), the Timer1 oscillator is operating and providing the device clock. The Timer1 oscillator may also run in all power-managed modes if required to clock Timer1 or Timer3. In internal oscillator modes (RC_RUN and RC_IDLE), the internal oscillator block provides the device clock source. The 31 kHz INTRC output can be used directly to provide the clock and may be enabled to support various special features, regardless of the powermanaged mode (see Section 23.2 “Watchdog Timer (WDT)”, Section 23.3 “Two-Speed Start-up” and Section 23.4 “Fail-Safe Clock Monitor” for more information on WDT, Fail-Safe Clock Monitor and TwoSpeed Start-up). The INTOSC output at 8 MHz may be used directly to clock the device or may be divided down by the postscaler. The INTOSC output is disabled if the clock is provided directly from the INTRC output. If Sleep mode is selected, all clock sources are stopped. Since all the transistor switching currents have been stopped, Sleep mode achieves the lowest current consumption of the device (only leakage currents). Enabling any on-chip feature that will operate during Sleep will increase the current consumed during Sleep. The INTRC is required to support WDT operation. The Timer1 oscillator may be operating to support a RealTime Clock. Other features may be operating that do not require a device clock source (i.e., MSSP slave, PSP, INTx pins and others). Peripherals that may add significant current consumption are listed in Section 26.2 “DC Characteristics”. 2.9 Power-up Delays Power-up delays are controlled by two timers so that no external Reset circuitry is required for most applications. The delays ensure that the device is kept in Reset until the device power supply is stable under normal circumstances and the primary clock is operating and stable. For additional information on power-up delays, see Section 4.5 “Device Reset Timers”. The first timer is the Power-up Timer (PWRT), which provides a fixed delay on power-up (parameter 33, Table 26-10). It is enabled by clearing (= 0) the PWRTEN Configuration bit. The second timer is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable (LP, XT and HS modes). The OST does this by counting 1024 oscillator cycles before allowing the oscillator to clock the device. When the HSPLL Oscillator mode is selected, the device is kept in Reset for an additional 2 ms, following the HS mode OST delay, so the PLL can lock to the incoming clock frequency. There is a delay of interval, TCSD (parameter 38, Table 26-10), following POR, while the controller becomes ready to execute instructions. This delay runs concurrently with any other delays. This may be the only delay that occurs when any of the EC, RC or INTIO modes are used as the primary clock source. TABLE 2-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE OSC Mode OSC1 Pin OSC2 Pin RC, INTIO1 Floating, external resistor should pull high At logic low (clock/4 output) RCIO Floating, external resistor should pull high Configured as PORTA, bit 6 INTIO2 Configured as PORTA, bit 7 Configured as PORTA, bit 6 ECIO Floating, pulled by external clock Configured as PORTA, bit 6 EC Floating, pulled by external clock At logic low (clock/4 output) LP, XT and HS Feedback inverter disabled at quiescent voltage level Feedback inverter disabled at quiescent voltage level Note: See Table 4-2 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset. PIC18F2420/2520/4420/4520 DS39631E-page 32 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. Advance Information DS39631E-page 33 PIC18F2420/2520/4420/4520 3.0 POWER-MANAGED MODES PIC18F2420/2520/4420/4520 devices offer a total of seven operating modes for more efficient powermanagement. These modes provide a variety of options for selective power conservation in applications where resources may be limited (i.e., battery-powered devices). There are three categories of power-managed modes: • Run modes • Idle modes • Sleep mode These categories define which portions of the device are clocked and sometimes, what speed. The Run and Idle modes may use any of the three available clock sources (primary, secondary or internal oscillator block); the Sleep mode does not use a clock source. The power-managed modes include several powersaving features offered on previous PIC® devices. One is the clock switching feature, offered in other PIC18 devices, allowing the controller to use the Timer1 oscillator in place of the primary oscillator. Also included is the Sleep mode, offered by all PIC devices, where all device clocks are stopped. 3.1 Selecting Power-Managed Modes Selecting a power-managed mode requires two decisions: if the CPU is to be clocked or not and the selection of a clock source. The IDLEN bit (OSCCON<7>) controls CPU clocking, while the SCS<1:0> bits (OSCCON<1:0>) select the clock source. The individual modes, bit settings, clock sources and affected modules are summarized in Table 3-1. 3.1.1 CLOCK SOURCES The SCS<1:0> bits allow the selection of one of three clock sources for power-managed modes. They are: • the primary clock, as defined by the FOSC<3:0> Configuration bits • the secondary clock (the Timer1 oscillator) • the internal oscillator block (for RC modes) 3.1.2 ENTERING POWER-MANAGED MODES Switching from one power-managed mode to another begins by loading the OSCCON register. The SCS<1:0> bits select the clock source and determine which Run or Idle mode is to be used. Changing these bits causes an immediate switch to the new clock source, assuming that it is running. The switch may also be subject to clock transition delays. These are discussed in Section 3.1.3 “Clock Transitions and Status Indicators” and subsequent sections. Entry to the power-managed Idle or Sleep modes is triggered by the execution of a SLEEP instruction. The actual mode that results depends on the status of the IDLEN bit. Depending on the current mode and the mode being switched to, a change to a power-managed mode does not always require setting all of these bits. Many transitions may be done by changing the oscillator select bits, or changing the IDLEN bit, prior to issuing a SLEEP instruction. If the IDLEN bit is already configured correctly, it may only be necessary to perform a SLEEP instruction to switch to the desired mode. TABLE 3-1: POWER-MANAGED MODES Mode OSCCON<7,1:0> Bits Module Clocking Available Clock and Oscillator Source IDLEN(1) SCS<1:0> CPU Peripherals Sleep 0 N/A Off Off None – All clocks are disabled PRI_RUN N/A 00 Clocked Clocked Primary – LP, XT, HS, HSPLL, RC, EC and Internal Oscillator Block(2). This is the normal full-power execution mode. SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 Oscillator RC_RUN N/A 1x Clocked Clocked Internal Oscillator Block(2) PRI_IDLE 1 00 Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC SEC_IDLE 1 01 Off Clocked Secondary – Timer1 Oscillator RC_IDLE 1 1x Off Clocked Internal Oscillator Block(2) Note 1: IDLEN reflects its value when the SLEEP instruction is executed. 2: Includes INTOSC and INTOSC postscaler, as well as the INTRC source. PIC18F2420/2520/4420/4520 DS39631E-page 34 Advance Information © 2008 Microchip Technology Inc. 3.1.3 CLOCK TRANSITIONS AND STATUS INDICATORS The length of the transition between clock sources is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Three bits indicate the current clock source and its status. They are: • OSTS (OSCCON<3>) • IOFS (OSCCON<2>) • T1RUN (T1CON<6>) In general, only one of these bits will be set while in a given power-managed mode. When the OSTS bit is set, the primary clock is providing the device clock. When the IOFS bit is set, the INTOSC output is providing a stable 8 MHz clock source to a divider that actually drives the device clock. When the T1RUN bit is set, the Timer1 oscillator is providing the clock. If none of these bits are set, then either the INTRC clock source is clocking the device or the INTOSC source is not yet stable. If the internal oscillator block is configured as the primary clock source by the FOSC<3:0> Configuration bits, then both the OSTS and IOFS bits may be set when in PRI_RUN or PRI_IDLE modes. This indicates that the primary clock (INTOSC output) is generating a stable 8 MHz output. Entering another power-managed RC mode at the same frequency would clear the OSTS bit. 3.1.4 MULTIPLE SLEEP COMMANDS The power-managed mode that is invoked with the SLEEP instruction is determined by the setting of the IDLEN bit at the time the instruction is executed. If another SLEEP instruction is executed, the device will enter the power-managed mode specified by IDLEN at that time. If IDLEN has changed, the device will enter the new power-managed mode specified by the new setting. 3.2 Run Modes In the Run modes, clocks to both the core and peripherals are active. The difference between these modes is the clock source. 3.2.1 PRI_RUN MODE The PRI_RUN mode is the normal, full-power execution mode of the microcontroller. This is also the default mode upon a device Reset unless Two-Speed Start-up is enabled (see Section 23.3 “Two-Speed Start-up” for details). In this mode, the OSTS bit is set. The IOFS bit may be set if the internal oscillator block is the primary clock source (see Section 2.7.1 “Oscillator Control Register”). 3.2.2 SEC_RUN MODE The SEC_RUN mode is the compatible mode to the “clock switching” feature offered in other PIC18 devices. In this mode, the CPU and peripherals are clocked from the Timer1 oscillator. This gives users the option of lower power consumption while still using a high-accuracy clock source. SEC_RUN mode is entered by setting the SCS<1:0> bits to ‘01’. The device clock source is switched to the Timer1 oscillator (see Figure 3-1), the primary oscillator is shut down, the T1RUN bit (T1CON<6>) is set and the OSTS bit is cleared. On transitions from SEC_RUN mode to PRI_RUN mode, the peripherals and CPU continue to be clocked from the Timer1 oscillator while the primary clock is started. When the primary clock becomes ready, a clock switch back to the primary clock occurs (see Figure 3-2). When the clock switch is complete, the T1RUN bit is cleared, the OSTS bit is set and the primary clock is providing the clock. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run. Note 1: Caution should be used when modifying a single IRCF bit. If VDD is less than 3V, it is possible to select a higher clock speed than is supported by the low VDD. Improper device operation may result if the VDD/FOSC specifications are violated. 2: Executing a SLEEP instruction does not necessarily place the device into Sleep mode. It acts as the trigger to place the controller into either the Sleep mode or one of the Idle modes, depending on the setting of the IDLEN bit. Note: The Timer1 oscillator should already be running prior to entering SEC_RUN mode. If the T1OSCEN bit is not set when the SCS<1:0> bits are set to ‘01’, entry to SEC_RUN mode will not occur. If the Timer1 oscillator is enabled, but not yet running, device clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result. © 2008 Microchip Technology Inc. Advance Information DS39631E-page 35 PIC18F2420/2520/4420/4520 FIGURE 3-1: TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE FIGURE 3-2: TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL) 3.2.3 RC_RUN MODE In RC_RUN mode, the CPU and peripherals are clocked from the internal oscillator block using the INTOSC multiplexer. In this mode, the primary clock is shut down. When using the INTRC source, this mode provides the best power conservation of all the Run modes while still executing code. It works well for user applications which are not highly timing sensitive or do not require high-speed clocks at all times. If the primary clock source is the internal oscillator block (either INTRC or INTOSC), there are no distinguishable differences between PRI_RUN and RC_RUN modes during execution. However, a clock switch delay will occur during entry to and exit from RC_RUN mode. Therefore, if the primary clock source is the internal oscillator block, the use of RC_RUN mode is not recommended. This mode is entered by setting the SCS1 bit to ‘1’. Although it is ignored, it is recommended that the SCS0 bit also be cleared; this is to maintain software compatibility with future devices. When the clock source is switched to the INTOSC multiplexer (see Figure 3-3), the primary oscillator is shut down and the OSTS bit is cleared. The IRCF bits may be modified at any time to immediately change the clock speed. Q2 Q3 Q4 OSC1 Peripheral Program Q1 T1OSI Q1 Counter Clock CPU Clock PC PC + 2 1 2 3 n-1 n Clock Transition(1) Q2 Q3 Q4 Q1 Q2 Q3 PC + 4 Note 1: Clock transition typically occurs within 2-4 TOSC. Q1 Q3 Q4 OSC1 Peripheral Program PC T1OSI PLL Clock Q1 PC + 4 Q2 Output Q3 Q4 Q1 CPU Clock PC + 2 Clock Counter Q2 Q2 Q3 Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. 2: Clock transition typically occurs within 2-4 TOSC. SCS<1:0> bits Changed TPLL(1) 1 2 n-1 n Clock OSTS bit Set Transition(2) TOST(1) Note: Caution should be used when modifying a single IRCF bit. If VDD is less than 3V, it is possible to select a higher clock speed than is supported by the low VDD. Improper device operation may result if the VDD/FOSC specifications are violated. PIC18F2420/2520/4420/4520 DS39631E-page 36 Advance Information © 2008 Microchip Technology Inc. If the IRCF bits and the INTSRC bit are all clear, the INTOSC output is not enabled and the IOFS bit will remain clear; there will be no indication of the current clock source. The INTRC source is providing the device clocks. If the IRCF bits are changed from all clear (thus, enabling the INTOSC output), or if INTSRC is set, the IOFS bit becomes set after the INTOSC output becomes stable. Clocks to the device continue while the INTOSC source stabilizes after an interval of TIOBST. If the IRCF bits were previously at a non-zero value, or if INTSRC was set before setting SCS1 and the INTOSC source was already stable, the IOFS bit will remain set. On transitions from RC_RUN mode to PRI_RUN mode, the device continues to be clocked from the INTOSC multiplexer while the primary clock is started. When the primary clock becomes ready, a clock switch to the primary clock occurs (see Figure 3-4). When the clock switch is complete, the IOFS bit is cleared, the OSTS bit is set and the primary clock is providing the device clock. The IDLEN and SCS bits are not affected by the switch. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. FIGURE 3-3: TRANSITION TIMING TO RC_RUN MODE FIGURE 3-4: TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE Q2 Q3 Q4 OSC1 Peripheral Program Q1 INTRC Q1 Counter Clock CPU Clock PC PC + 2 1 2 3 n-1 n Clock Transition(1) Q2 Q3 Q4 Q1 Q2 Q3 PC + 4 Note 1: Clock transition typically occurs within 2-4 TOSC. Q1 Q3 Q4 OSC1 Peripheral Program PC INTOSC PLL Clock Q1 PC + 4 Q2 Output Q3 Q4 Q1 CPU Clock PC + 2 Clock Counter Q2 Q2 Q3 Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. 2: Clock transition typically occurs within 2-4 TOSC. SCS<1:0> bits Changed TPLL(1) 1 2 n-1 n Clock OSTS bit Set Transition(2) Multiplexer TOST(1) © 2008 Microchip Technology Inc. Advance Information DS39631E-page 37 PIC18F2420/2520/4420/4520 3.3 Sleep Mode The power-managed Sleep mode in the PIC18F2420/ 2520/4420/4520 devices is identical to the legacy Sleep mode offered in all other PIC devices. It is entered by clearing the IDLEN bit (the default state on device Reset) and executing the SLEEP instruction. This shuts down the selected oscillator (Figure 3-5). All clock source status bits are cleared. Entering the Sleep mode from any other mode does not require a clock switch. This is because no clocks are needed once the controller has entered Sleep. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. When a wake event occurs in Sleep mode (by interrupt, Reset or WDT time-out), the device will not be clocked until the clock source selected by the SCS<1:0> bits becomes ready (see Figure 3-6), or it will be clocked from the internal oscillator block if either the Two-Speed Start-up or the Fail-Safe Clock Monitor are enabled (see Section 23.0 “Special Features of the CPU”). In either case, the OSTS bit is set when the primary clock is providing the device clocks. The IDLEN and SCS bits are not affected by the wake-up. 3.4 Idle Modes The Idle modes allow the controller’s CPU to be selectively shut down while the peripherals continue to operate. Selecting a particular Idle mode allows users to further manage power consumption. If the IDLEN bit is set to ‘1’ when a SLEEP instruction is executed, the peripherals will be clocked from the clock source selected using the SCS<1:0> bits; however, the CPU will not be clocked. The clock source status bits are not affected. Setting IDLEN and executing a SLEEP instruction provides a quick method of switching from a given Run mode to its corresponding Idle mode. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. Since the CPU is not executing instructions, the only exits from any of the Idle modes are by interrupt, WDT time-out or a Reset. When a wake event occurs, CPU execution is delayed by an interval of TCSD (parameter 38, Table 26-10) while it becomes ready to execute code. When the CPU begins executing code, it resumes with the same clock source for the current Idle mode. For example, when waking from RC_IDLE mode, the internal oscillator block will clock the CPU and peripherals (in other words, RC_RUN mode). The IDLEN and SCS bits are not affected by the wake-up. While in any Idle mode or the Sleep mode, a WDT time-out will result in a WDT wake-up to the Run mode currently specified by the SCS1:SCS0 bits. FIGURE 3-5: TRANSITION TIMING FOR ENTRY TO SLEEP MODE FIGURE 3-6: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL) Q2 Q3 Q4 OSC1 Peripheral Sleep Program Q1 Q1 Counter Clock CPU Clock PC PC + 2 Q3 Q4 Q1 Q2 OSC1 Peripheral Program PC PLL Clock Q3 Q4 Output CPU Clock Q1 Q2 Q3 Q4 Q1 Q2 Clock Counter PC + 4 PC + 6 Q1 Q2 Q3 Q4 Wake Event Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. TOST(1) TPLL(1) OSTS bit Set PC + 2 PIC18F2420/2520/4420/4520 DS39631E-page 38 Advance Information © 2008 Microchip Technology Inc. 3.4.1 PRI_IDLE MODE This mode is unique among the three low-power Idle modes in that it does not disable the primary device clock. For timing-sensitive applications, this allows for the fastest resumption of device operation with its more accurate primary clock source, since the clock source does not have to “warm-up” or transition from another oscillator. PRI_IDLE mode is entered from PRI_RUN mode by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then clear the SCS bits and execute SLEEP. Although the CPU is disabled, the peripherals continue to be clocked from the primary clock source specified by the FOSC<3:0> Configuration bits. The OSTS bit remains set (see Figure 3-7). When a wake event occurs, the CPU is clocked from the primary clock source. A delay of interval TCSD is required between the wake event and when code execution starts. This is required to allow the CPU to become ready to execute instructions. After the wakeup, the OSTS bit remains set. The IDLEN and SCS bits are not affected by the wake-up (see Figure 3-8). 3.4.2 SEC_IDLE MODE In SEC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the Timer1 oscillator. This mode is entered from SEC_RUN by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set the IDLEN bit first, then set the SCS<1:0> bits to ‘01’ and execute SLEEP. When the clock source is switched to the Timer1 oscillator, the primary oscillator is shut down, the OSTS bit is cleared and the T1RUN bit is set. When a wake event occurs, the peripherals continue to be clocked from the Timer1 oscillator. After an interval of TCSD, following the wake event, the CPU begins executing code being clocked by the Timer1 oscillator. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run (see Figure 3-8). FIGURE 3-7: TRANSITION TIMING FOR ENTRY TO IDLE MODE FIGURE 3-8: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE Note: The Timer1 oscillator should already be running prior to entering SEC_IDLE mode. If the T1OSCEN bit is not set when the SLEEP instruction is executed, the SLEEP instruction will be ignored and entry to SEC_IDLE mode will not occur. If the Timer1 oscillator is enabled but not yet running, peripheral clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result. Q1 Peripheral Program PC PC + 2 OSC1 Q3 Q4 Q1 CPU Clock Clock Counter Q2 OSC1 Peripheral Program PC CPU Clock Q1 Q3 Q4 Clock Counter Q2 Wake Event TCSD © 2008 Microchip Technology Inc. Advance Information DS39631E-page 39 PIC18F2420/2520/4420/4520 3.4.3 RC_IDLE MODE In RC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the internal oscillator block using the INTOSC multiplexer. This mode allows for controllable power conservation during Idle periods. From RC_RUN, this mode is entered by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, first set IDLEN, then set the SCS1 bit and execute SLEEP. Although its value is ignored, it is recommended that SCS0 also be cleared; this is to maintain software compatibility with future devices. The INTOSC multiplexer may be used to select a higher clock frequency by modifying the IRCF bits before executing the SLEEP instruction. When the clock source is switched to the INTOSC multiplexer, the primary oscillator is shut down and the OSTS bit is cleared. If the IRCF bits are set to any non-zero value, or the INTSRC bit is set, the INTOSC output is enabled. The IOFS bit becomes set, after the INTOSC output becomes stable, after an interval of TIOBST (parameter 39, Table 26-10). Clocks to the peripherals continue while the INTOSC source stabilizes. If the IRCF bits were previously at a non-zero value, or INTSRC was set before the SLEEP instruction was executed and the INTOSC source was already stable, the IOFS bit will remain set. If the IRCF bits and INTSRC are all clear, the INTOSC output will not be enabled, the IOFS bit will remain clear and there will be no indication of the current clock source. When a wake event occurs, the peripherals continue to be clocked from the INTOSC multiplexer. After a delay of TCSD following the wake event, the CPU begins executing code being clocked by the INTOSC multiplexer. The IDLEN and SCS bits are not affected by the wake-up. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. 3.5 Exiting Idle and Sleep Modes An exit from Sleep mode or any of the Idle modes is triggered by an interrupt, a Reset or a WDT time-out. This section discusses the triggers that cause exits from power-managed modes. The clocking subsystem actions are discussed in each of the power-managed modes (see Section 3.2 “Run Modes”, Section 3.3 “Sleep Mode” and Section 3.4 “Idle Modes”). 3.5.1 EXIT BY INTERRUPT Any of the available interrupt sources can cause the device to exit from an Idle mode or the Sleep mode to a Run mode. To enable this functionality, an interrupt source must be enabled by setting its enable bit in one of the INTCON or PIE registers. The exit sequence is initiated when the corresponding interrupt flag bit is set. On all exits from Idle or Sleep modes by interrupt, code execution branches to the interrupt vector if the GIE/ GIEH bit (INTCON<7>) is set. Otherwise, code execution continues or resumes without branching (see Section 9.0 “Interrupts”). A fixed delay of interval TCSD following the wake event is required when leaving Sleep and Idle modes. This delay is required for the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. 3.5.2 EXIT BY WDT TIME-OUT A WDT time-out will cause different actions depending on which power-managed mode the device is in when the time-out occurs. If the device is not executing code (all Idle modes and Sleep mode), the time-out will result in an exit from the power-managed mode (see Section 3.2 “Run Modes” and Section 3.3 “Sleep Mode”). If the device is executing code (all Run modes), the time-out will result in a WDT Reset (see Section 23.2 “Watchdog Timer (WDT)”). The WDT timer and postscaler are cleared by executing a SLEEP or CLRWDT instruction, the loss of a currently selected clock source (if the Fail-Safe Clock Monitor is enabled) and modifying the IRCF bits in the OSCCON register if the internal oscillator block is the device clock source. 3.5.3 EXIT BY RESET Normally, the device is held in Reset by the Oscillator Start-up Timer (OST) until the primary clock becomes ready. At that time, the OSTS bit is set and the device begins executing code. If the internal oscillator block is the new clock source, the IOFS bit is set instead. The exit delay time from Reset to the start of code execution depends on both the clock sources before and after the wake-up and the type of oscillator if the new clock source is the primary clock. Exit delays are summarized in Table 3-2. Code execution can begin before the primary clock becomes ready. If either the Two-Speed Start-up (see Section 23.3 “Two-Speed Start-up”) or Fail-Safe Clock Monitor (see Section 23.4 “Fail-Safe Clock Monitor”) is enabled, the device may begin execution as soon as the Reset source has cleared. Execution is clocked by the INTOSC multiplexer driven by the internal oscillator block. Execution is clocked by the internal oscillator block until either the primary clock becomes ready or a power-managed mode is entered before the primary clock becomes ready; the primary clock is then shut down. PIC18F2420/2520/4420/4520 DS39631E-page 40 Advance Information © 2008 Microchip Technology Inc. 3.5.4 EXIT WITHOUT AN OSCILLATOR START-UP DELAY Certain exits from power-managed modes do not invoke the OST at all. There are two cases: • PRI_IDLE mode, where the primary clock source is not stopped and • the primary clock source is not any of the LP, XT, HS or HSPLL modes. In these instances, the primary clock source either does not require an oscillator start-up delay, since it is already running (PRI_IDLE), or normally does not require an oscillator start-up delay (RC, EC and INTIO Oscillator modes). However, a fixed delay of interval TCSD following the wake event is still required when leaving Sleep and Idle modes to allow the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. TABLE 3-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE (BY CLOCK SOURCES) Clock Source Before Wake-up Clock Source After Wake-up Exit Delay Clock Ready Status Bit (OSCCON) Primary Device Clock (PRI_IDLE mode) LP, XT, HS TCSD HSPLL (1) OSTS EC, RC INTOSC(2) IOFS T1OSC or INTRC(1) LP, XT, HS TOST(3) HSPLL TOST + trc OSTS (3) EC, RC TCSD(1) INTOSC(2) TCSD(1) IOFS INTOSC(2) LP, XT, HS TOST(3) HSPLL TOST + trc OSTS (3) EC, RC TCSD(1) INTOSC(2) TCSD(1) IOFS None (Sleep mode) LP, XT, HS TOST(3) HSPLL TOST + trc OSTS (3) EC, RC TCSD(1) INTOSC(2) TCSD(1) IOFS Note 1: TCSD (parameter 38) is a required delay when waking from Sleep and all Idle modes and runs concurrently with any other required delays (see Section 3.4 “Idle Modes”). On Reset, INTOSC defaults to 1 MHz. 2: Includes both the INTOSC 8 MHz source and postscaler derived frequencies. 3: TOST is the Oscillator Start-up Timer (parameter 32). trc is the PLL lock-out timer (parameter F12); it is also designated as TPLL. © 2008 Microchip Technology Inc. DS39631E-page 41 PIC18F2420/2520/4420/4520 4.0 RESET The PIC18F2420/2520/4420/4520 devices differentiate between various kinds of Reset: a) Power-on Reset (POR) b) MCLR Reset during normal operation c) MCLR Reset during power-managed modes d) Watchdog Timer (WDT) Reset (during execution) e) Programmable Brown-out Reset (BOR) f) RESET Instruction g) Stack Full Reset h) Stack Underflow Reset This section discusses Resets generated by MCLR, POR and BOR and covers the operation of the various start-up timers. Stack Reset events are covered in Section 5.1.2.4 “Stack Full and Underflow Resets”. WDT Resets are covered in Section 23.2 “Watchdog Timer (WDT)”. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 4-1. 4.1 RCON Register Device Reset events are tracked through the RCON register (Register 4-1). The lower five bits of the register indicate that a specific Reset event has occurred. In most cases, these bits can only be cleared by the event and must be set by the application after the event. The state of these flag bits, taken together, can be read to indicate the type of Reset that just occurred. This is described in more detail in Section 4.6 “Reset State of Registers”. The RCON register also has control bits for setting interrupt priority (IPEN) and software control of the BOR (SBOREN). Interrupt priority is discussed in Section 9.0 “Interrupts”. BOR is covered in Section 4.4 “Brown-out Reset (BOR)”. FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR VDD OSC1 WDT Time-out VDD Rise Detect OST/PWRT INTRC(1) POR Pulse OST 10-Bit Ripple Counter PWRT 11-Bit Ripple Counter Enable OST(2) Enable PWRT Note 1: This is the INTRC source from the internal oscillator block and is separate from the RC oscillator of the CLKI pin. 2: See Table 4-2 for time-out situations. Brown-out Reset BOREN RESET Instruction Stack Pointer Stack Full/Underflow Reset Sleep ( )_IDLE 1024 Cycles 65.5 ms 32 μs MCLRE S R Q Chip_Reset PIC18F2420/2520/4420/4520 DS39631E-page 42 © 2008 Microchip Technology Inc. REGISTER 4-1: RCON: RESET CONTROL REGISTER R/W-0 R/W-1(1) U-0 R/W-1 R-1 R-1 R/W-0(2) R/W-0 IPEN SBOREN — RI TO PD POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode) bit 6 SBOREN: BOR Software Enable bit(1) If BOREN1:BOREN0 = 01: 1 = BOR is enabled 0 = BOR is disabled If BOREN1:BOREN0 = 00, 10 or 11: Bit is disabled and read as ‘0’. bit 5 Unimplemented: Read as ‘0’ bit 4 RI: RESET Instruction Flag bit 1 = The RESET instruction was not executed (set by firmware only) 0 = The RESET instruction was executed causing a device Reset (must be set in software after a Brown-out Reset occurs) bit 3 TO: Watchdog Time-out Flag bit 1 = Set by power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 2 PD: Power-Down Detection Flag bit 1 = Set by power-up or by the CLRWDT instruction 0 = Set by execution of the SLEEP instruction bit 1 POR: Power-on Reset Status bit 1 = A Power-on Reset has not occurred (set by firmware only) 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = A Brown-out Reset has not occurred (set by firmware only) 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’. 2: The actual Reset value of POR is determined by the type of device Reset. See the notes following this register and Section 4.6 “Reset State of Registers” for additional information. Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected so that subsequent Power-on Resets may be detected. 2: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming that POR was set to ‘1’ by software immediately after a Power-on Reset). © 2008 Microchip Technology Inc. DS39631E-page 43 PIC18F2420/2520/4420/4520 4.2 Master Clear (MCLR) The MCLR pin provides a method for triggering an external Reset of the device. A Reset is generated by holding the pin low. These devices have a noise filter in the MCLR Reset path which detects and ignores small pulses. The MCLR pin is not driven low by any internal Resets, including the WDT. In PIC18F2420/2520/4420/4520 devices, the MCLR input can be disabled with the MCLRE Configuration bit. When MCLR is disabled, the pin becomes a digital input. See Section 10.5 “PORTE, TRISE and LATE Registers” for more information. 4.3 Power-on Reset (POR) A Power-on Reset pulse is generated on-chip whenever VDD rises above a certain threshold. This allows the device to start in the initialized state when VDD is adequate for operation. To take advantage of the POR circuitry, tie the MCLR pin through a resistor (1 kΩ to 10 kΩ) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset delay. A minimum rise rate for VDD is specified (parameter D004). For a slow rise time, see Figure 4-2. When the device starts normal operation (i.e., exits the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. POR events are captured by the POR bit (RCON<1>). The state of the bit is set to ‘0’ whenever a POR occurs; it does not change for any other Reset event. POR is not reset to ‘1’ by any hardware event. To capture multiple events, the user manually resets the bit to ‘1’ in software following any POR. FIGURE 4-2: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) Note 1: External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. 2: R < 40 kΩ is recommended to make sure that the voltage drop across R does not violate the device’s electrical specification. 3: R1 ≥ 1 kΩ will limit any current flowing into MCLR from external capacitor C, in the event of MCLR/VPP pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). C R1 D R VDD MCLR PIC18FXXXX VDD PIC18F2420/2520/4420/4520 DS39631E-page 44 © 2008 Microchip Technology Inc. 4.4 Brown-out Reset (BOR) PIC18F2420/2520/4420/4520 devices implement a BOR circuit that provides the user with a number of configuration and power-saving options. The BOR is controlled by the BORV<1:0> and BOREN<1:0> Configuration bits. There are a total of four BOR configurations which are summarized in Table 4-1. The BOR threshold is set by the BORV<1:0> bits. If BOR is enabled (any values of BOREN<1:0>, except ‘00’), any drop of VDD below VBOR (parameter D005) for greater than TBOR (parameter 35) will reset the device. A Reset may or may not occur if VDD falls below VBOR for less than TBOR. The chip will remain in Brown-out Reset until VDD rises above VBOR. If the Power-up Timer is enabled, it will be invoked after VDD rises above VBOR; it then will keep the chip in Reset for an additional time delay, TPWRT (parameter 33). If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be initialized. Once VDD rises above VBOR, the Power-up Timer will execute the additional time delay. BOR and the Power-up Timer (PWRT) are independently configured. Enabling the Brown-out Reset does not automatically enable the PWRT. 4.4.1 SOFTWARE ENABLED BOR When BOREN<1:0> = 01, the BOR can be enabled or disabled by the user in software. This is done with the control bit, SBOREN (RCON<6>). Setting SBOREN enables the BOR to function as previously described. Clearing SBOREN disables the BOR entirely. The SBOREN bit operates only in this mode; otherwise it is read as ‘0’. Placing the BOR under software control gives the user the additional flexibility of tailoring the application to its environment without having to reprogram the device to change BOR configuration. It also allows the user to tailor device power consumption in software by eliminating the incremental current that the BOR consumes. While the BOR current is typically very small, it may have some impact in low-power applications. 4.4.2 DETECTING BOR When BOR is enabled, the BOR bit always resets to ‘0’ on any BOR or POR event. This makes it difficult to determine if a BOR event has occurred just by reading the state of BOR alone. A more reliable method is to simultaneously check the state of both POR and BOR. This assumes that the POR bit is reset to ‘1’ in software immediately after any POR event. If BOR is ‘0’ while POR is ‘1’, it can be reliably assumed that a BOR event has occurred. 4.4.3 DISABLING BOR IN SLEEP MODE When BOREN<1:0> = 10, the BOR remains under hardware control and operates as previously described. Whenever the device enters Sleep mode, however, the BOR is automatically disabled. When the device returns to any other operating mode, BOR is automatically re-enabled. This mode allows for applications to recover from brown-out situations, while actively executing code, when the device requires BOR protection the most. At the same time, it saves additional power in Sleep mode by eliminating the small incremental BOR current. TABLE 4-1: BOR CONFIGURATIONS Note: Even when BOR is under software control, the Brown-out Reset voltage level is still set by the BORV<1:0> Configuration bits; it cannot be changed in software. BOR Configuration Status of SBOREN (RCON<6>) BOR Operation BOREN1 BOREN0 0 0 Unavailable BOR disabled; must be enabled by reprogramming the Configuration bits. 0 1 Available BOR enabled in software; operation controlled by SBOREN. 1 0 Unavailable BOR enabled in hardware in Run and Idle modes, disabled during Sleep mode. 1 1 Unavailable BOR enabled in hardware; must be disabled by reprogramming the Configuration bits. © 2008 Microchip Technology Inc. DS39631E-page 45 PIC18F2420/2520/4420/4520 4.5 Device Reset Timers PIC18F2420/2520/4420/4520 devices incorporate three separate on-chip timers that help regulate the Power-on Reset process. Their main function is to ensure that the device clock is stable before code is executed. These timers are: • Power-up Timer (PWRT) • Oscillator Start-up Timer (OST) • PLL Lock Time-out 4.5.1 POWER-UP TIMER (PWRT) The Power-up Timer (PWRT) of PIC18F2420/2520/ 4420/4520 devices is an 11-bit counter which uses the INTRC source as the clock input. This yields an approximate time interval of 2048 x 32 μs = 65.6 ms. While the PWRT is counting, the device is held in Reset. The power-up time delay depends on the INTRC clock and will vary from chip to chip due to temperature and process variation. See DC parameter 33 for details. The PWRT is enabled by clearing the PWRTEN Configuration bit. 4.5.2 OSCILLATOR START-UP TIMER (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over (parameter 33). This ensures that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP, HS and HSPLL modes and only on Power-on Reset, or on exit from most power-managed modes. 4.5.3 PLL LOCK TIME-OUT With the PLL enabled in its PLL mode, the time-out sequence following a Power-on Reset is slightly different from other oscillator modes. A separate timer is used to provide a fixed time-out that is sufficient for the PLL to lock to the main oscillator frequency. This PLL lock time-out (TPLL) is typically 2 ms and follows the oscillator start-up time-out. 4.5.4 TIME-OUT SEQUENCE On power-up, the time-out sequence is as follows: 1. After the POR pulse has cleared, PWRT time-out is invoked (if enabled). 2. Then, the OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. Figure 4-3, Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7 all depict time-out sequences on power-up, with the Power-up Timer enabled and the device operating in HS Oscillator mode. Figure 4-3 through Figure 4-6 also apply to devices operating in XT or LP modes. For devices in RC mode and with the PWRT disabled, on the other hand, there will be no time-out at all. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, all time-outs will expire. Bringing MCLR high will begin execution immediately (Figure 4-5). This is useful for testing purposes or to synchronize more than one PIC18FXXXX device operating in parallel. TABLE 4-2: TIME-OUT IN VARIOUS SITUATIONS Oscillator Configuration Power-up(2) and Brown-out Exit from Power-Managed Mode PWRTEN = 0 PWRTEN = 1 HSPLL 66 ms(1) + 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC EC, ECIO 66 ms(1) — — RC, RCIO 66 ms(1) — — INTIO1, INTIO2 66 ms(1) — — Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay. 2: 2 ms is the nominal time required for the PLL to lock. PIC18F2420/2520/4420/4520 DS39631E-page 46 © 2008 Microchip Technology Inc. FIGURE 4-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT) FIGURE 4-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 FIGURE 4-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET TPWRT TOST © 2008 Microchip Technology Inc. DS39631E-page 47 PIC18F2420/2520/4420/4520 FIGURE 4-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT) FIGURE 4-7: TIME-OUT SEQUENCE ON POR W/PLL ENABLED (MCLR TIED TO VDD) VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET 0V 5V TPWRT TOST TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET PLL TIME-OUT TPLL Note: TOST = 1024 clock cycles. TPLL ≈ 2 ms max. First three stages of the PWRT timer. PIC18F2420/2520/4420/4520 DS39631E-page 48 © 2008 Microchip Technology Inc. 4.6 Reset State of Registers Most registers are unaffected by a Reset. Their status is unknown on POR and unchanged by all other Resets. The other registers are forced to a “Reset state” depending on the type of Reset that occurred. Most registers are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. Status bits from the RCON register, RI, TO, PD, POR and BOR, are set or cleared differently in different Reset situations, as indicated in Table 4-3. These bits are used in software to determine the nature of the Reset. Table 4-4 describes the Reset states for all of the Special Function Registers. These are categorized by Power-on and Brown-out Resets, Master Clear and WDT Resets and WDT wake-ups. TABLE 4-3: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR RCON REGISTER Condition Program Counter RCON Register STKPTR Register RI TO PD POR BOR STKFUL STKUNF Power-on Reset 0000h 11100 0 0 RESET Instruction 0000h 0uuuu u u Brown-out Reset 0000h 111u0 u u MCLR Reset during Power-Managed Run Modes 0000h u1uuu u u MCLR Reset during Power-Managed Idle Modes and Sleep Mode 0000h u10uu u u WDT Time-out during Full Power or Power-Managed Run Mode 0000h u0uuu u u MCLR Reset during Full-Power Execution 0000h uuuuu u u Stack Full Reset (STVREN = 1) 0000h uuuuu 1 u Stack Underflow Reset (STVREN = 1) 0000h uuuuu u 1 Stack Underflow Error (not an actual Reset, STVREN = 0) 0000h uuuuu u 1 WDT Time-out during Power-Managed Idle or Sleep Modes PC + 2 u00uu u u Interrupt Exit from Power-Managed Modes PC + 2(1) uu0uu u u Legend: u = unchanged Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the interrupt vector (008h or 0018h). © 2008 Microchip Technology Inc. DS39631E-page 49 PIC18F2420/2520/4420/4520 TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt TOSU 2420 2520 4420 4520 ---0 0000 ---0 0000 ---0 uuuu(3) TOSH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu(3) TOSL 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu(3) STKPTR 2420 2520 4420 4520 00-0 0000 uu-0 0000 uu-u uuuu(3) PCLATU 2420 2520 4420 4520 ---0 0000 ---0 0000 ---u uuuu PCLATH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu PCL 2420 2520 4420 4520 0000 0000 0000 0000 PC + 2(2) TBLPTRU 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu TBLPTRH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TBLPTRL 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TABLAT 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu PRODH 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PRODL 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu INTCON 2420 2520 4420 4520 0000 000x 0000 000u uuuu uuuu(1) INTCON2 2420 2520 4420 4520 1111 -1-1 1111 -1-1 uuuu -u-u(1) INTCON3 2420 2520 4420 4520 11-0 0-00 11-0 0-00 uu-u u-uu(1) INDF0 2420 2520 4420 4520 N/A N/A N/A POSTINC0 2420 2520 4420 4520 N/A N/A N/A POSTDEC0 2420 2520 4420 4520 N/A N/A N/A PREINC0 2420 2520 4420 4520 N/A N/A N/A PLUSW0 2420 2520 4420 4520 N/A N/A N/A FSR0H 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu FSR0L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu WREG 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu INDF1 2420 2520 4420 4520 N/A N/A N/A POSTINC1 2420 2520 4420 4520 N/A N/A N/A POSTDEC1 2420 2520 4420 4520 N/A N/A N/A PREINC1 2420 2520 4420 4520 N/A N/A N/A PLUSW1 2420 2520 4420 4520 N/A N/A N/A Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. 6: The Reset value of the PCFG bits depends on the value of the PBADEN Configuration bit (CONFIG3H<1>). When PBADEN = 1, PCFG<2:0> = 000; when PBADEN = 0, PCFG<2:0> = 111. PIC18F2420/2520/4420/4520 DS39631E-page 50 © 2008 Microchip Technology Inc. FSR1H 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu FSR1L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu BSR 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu INDF2 2420 2520 4420 4520 N/A N/A N/A POSTINC2 2420 2520 4420 4520 N/A N/A N/A POSTDEC2 2420 2520 4420 4520 N/A N/A N/A PREINC2 2420 2520 4420 4520 N/A N/A N/A PLUSW2 2420 2520 4420 4520 N/A N/A N/A FSR2H 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu FSR2L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu STATUS 2420 2520 4420 4520 ---x xxxx ---u uuuu ---u uuuu TMR0H 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TMR0L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu T0CON 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu OSCCON 2420 2520 4420 4520 0100 q000 0100 q000 uuuu quuu HLVDCON 2420 2520 4420 4520 0-00 0101 0-00 0101 u-uu uuuu WDTCON 2420 2520 4420 4520 ---- ---0 ---- ---0 ---- ---u RCON(4) 2420 2520 4420 4520 0q-1 11q0 0q-q qquu uq-u qquu TMR1H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu TMR1L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu T1CON 2420 2520 4420 4520 0000 0000 u0uu uuuu uuuu uuuu TMR2 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu PR2 2420 2520 4420 4520 1111 1111 1111 1111 1111 1111 T2CON 2420 2520 4420 4520 -000 0000 -000 0000 -uuu uuuu SSPBUF 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu SSPADD 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SSPSTAT 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SSPCON1 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SSPCON2 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. 6: The Reset value of the PCFG bits depends on the value of the PBADEN Configuration bit (CONFIG3H<1>). When PBADEN = 1, PCFG<2:0> = 000; when PBADEN = 0, PCFG<2:0> = 111. © 2008 Microchip Technology Inc. DS39631E-page 51 PIC18F2420/2520/4420/4520 ADRESH 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu ADRESL 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu ADCON1 2420 2520 4420 4520 --00 0qqq(6) --00 0qqq(6) --uu uuuu ADCON2 2420 2520 4420 4520 0-00 0000 0-00 0000 u-uu uuuu CCPR1H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCPR1L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu CCPR2H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCPR2L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCP2CON 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu BAUDCON 2420 2520 4420 4520 0100 0-00 0100 0-00 uuuu u-uu PWM1CON 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu ECCP1AS 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu 2420 2520 4420 4520 0000 00-- 0000 00-- uuuu uu-- CVRCON 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu CMCON 2420 2520 4420 4520 0000 0111 0000 0111 uuuu uuuu TMR3H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu TMR3L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu T3CON 2420 2520 4420 4520 0000 0000 uuuu uuuu uuuu uuuu SPBRGH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SPBRG 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu RCREG 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TXREG 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TXSTA 2420 2520 4420 4520 0000 0010 0000 0010 uuuu uuuu RCSTA 2420 2520 4420 4520 0000 000x 0000 000x uuuu uuuu EEADR 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu EEDATA 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu EECON2 2420 2520 4420 4520 0000 0000 0000 0000 0000 0000 EECON1 2420 2520 4420 4520 xx-0 x000 uu-0 u000 uu-0 u000 TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. 6: The Reset value of the PCFG bits depends on the value of the PBADEN Configuration bit (CONFIG3H<1>). When PBADEN = 1, PCFG<2:0> = 000; when PBADEN = 0, PCFG<2:0> = 111. PIC18F2420/2520/4420/4520 DS39631E-page 52 © 2008 Microchip Technology Inc. IPR2 2420 2520 4420 4520 11-1 1111 11-1 1111 uu-u uuuu PIR2 2420 2520 4420 4520 00-0 0000 00-0 0000 uu-u uuuu(1) PIE2 2420 2520 4420 4520 00-0 0000 00-0 0000 uu-u uuuu IPR1 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu 2420 2520 4420 4520 -111 1111 -111 1111 -uuu uuuu PIR1 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu(1) 2420 2520 4420 4520 -000 0000 -000 0000 -uuu uuuu(1) PIE1 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu 2420 2520 4420 4520 -000 0000 -000 0000 -uuu uuuu OSCTUNE 2420 2520 4420 4520 00-0 0000 00-0 0000 uu-u uuuu TRISE 2420 2520 4420 4520 0000 -111 0000 -111 uuuu -uuu TRISD 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu TRISC 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu TRISB 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu TRISA(5) 2420 2520 4420 4520 1111 1111(5) 1111 1111(5) uuuu uuuu(5) LATE 2420 2520 4420 4520 ---- -xxx ---- -uuu ---- -uuu LATD 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu LATC 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu LATB 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu LATA(5) 2420 2520 4420 4520 xxxx xxxx(5) uuuu uuuu(5) uuuu uuuu(5) PORTE 2420 2520 4420 4520 ---- xxxx ---- uuuu ---- uuuu PORTD 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PORTC 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PORTB 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PORTA(5) 2420 2520 4420 4520 xx0x 0000(5) uu0u 0000(5) uuuu uuuu(5) TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. 6: The Reset value of the PCFG bits depends on the value of the PBADEN Configuration bit (CONFIG3H<1>). When PBADEN = 1, PCFG<2:0> = 000; when PBADEN = 0, PCFG<2:0> = 111. © 2008 Microchip Technology Inc. DS39631E-page 53 PIC18F2420/2520/4420/4520 5.0 MEMORY ORGANIZATION There are three types of memory in PIC18 enhanced microcontroller devices: • Program Memory • Data RAM • Data EEPROM As Harvard architecture devices, the data and program memories use separate busses; this allows for concurrent access of the two memory spaces. The data EEPROM, for practical purposes, can be regarded as a peripheral device, since it is addressed and accessed through a set of control registers. Additional detailed information on the operation of the Flash program memory is provided in Section 6.0 “Flash Program Memory”. Data EEPROM is discussed separately in Section 7.0 “Data EEPROM Memory”. 5.1 Program Memory Organization PIC18 microcontrollers implement a 21-bit program counter, which is capable of addressing a 2-Mbyte program memory space. Accessing a location between the upper boundary of the physically implemented memory and the 2-Mbyte address will return all ‘0’s (a NOP instruction). The PIC18F2420 and PIC18F4420 each have 16 Kbytes of Flash memory and can store up to 8,192 single-word instructions. The PIC18F2520 and PIC18F4520 each have 32 Kbytes of Flash memory and can store up to 16,384 single-word instructions. PIC18 devices have two interrupt vectors. The Reset vector address is at 0000h and the interrupt vector addresses are at 0008h and 0018h. The program memory map for PIC18F2420/2520/ 4420/4520 devices is shown in Figure 5-1. FIGURE 5-1: PROGRAM MEMORY MAP AND STACK FOR PIC18F2420/2520/4420/4520 DEVICES PC<20:0> Stack Level 1 • Stack Level 31 Reset Vector Low-Priority Interrupt Vector • • CALL,RCALL,RETURN RETFIE,RETLW 21 0000h 0018h On-Chip Program Memory High-Priority Interrupt Vector 0008h User Memory Space 1FFFFFh 4000h 3FFFh Read ‘0’ 200000h 8000h 7FFFh On-Chip Program Memory Read ‘0’ PIC18F2420/4420 PIC18F2520/4520 PIC18F2420/2520/4420/4520 DS39631E-page 54 © 2008 Microchip Technology Inc. 5.1.1 PROGRAM COUNTER The Program Counter (PC) specifies the address of the instruction to fetch for execution. The PC is 21 bits wide and is contained in three separate 8-bit registers. The low byte, known as the PCL register, is both readable and writable. The high byte, or PCH register, contains the PC<15:8> bits; it is not directly readable or writable. Updates to the PCH register are performed through the PCLATH register. The upper byte is called PCU. This register contains the PC<20:16> bits; it is also not directly readable or writable. Updates to the PCU register are performed through the PCLATU register. The contents of PCLATH and PCLATU are transferred to the program counter by any operation that writes PCL. Similarly, the upper two bytes of the program counter are transferred to PCLATH and PCLATU by an operation that reads PCL. This is useful for computed offsets to the PC (see Section 5.1.4.1 “Computed GOTO”). The PC addresses bytes in the program memory. To prevent the PC from becoming misaligned with word instructions, the Least Significant bit of PCL is fixed to a value of ‘0’. The PC increments by 2 to address sequential instructions in the program memory. The CALL, RCALL, GOTO and program branch instructions write to the program counter directly. For these instructions, the contents of PCLATH and PCLATU are not transferred to the program counter. 5.1.2 RETURN ADDRESS STACK The return address stack allows any combination of up to 31 program calls and interrupts to occur. The PC is pushed onto the stack when a CALL or RCALL instruction is executed or an interrupt is Acknowledged. The PC value is pulled off the stack on a RETURN, RETLW or a RETFIE instruction. PCLATU and PCLATH are not affected by any of the RETURN or CALL instructions. The stack operates as a 31-word by 21-bit RAM and a 5-bit Stack Pointer, STKPTR. The stack space is not part of either program or data space. The Stack Pointer is readable and writable and the address on the top of the stack is readable and writable through the Top-ofStack (TOS) Special Function Registers. Data can also be pushed to, or popped from the stack, using these registers. A CALL type instruction causes a push onto the stack; the Stack Pointer is first incremented and the location pointed to by the Stack Pointer is written with the contents of the PC (already pointing to the instruction following the CALL). A RETURN type instruction causes a pop from the stack; the contents of the location pointed to by the STKPTR are transferred to the PC and then the Stack Pointer is decremented. The Stack Pointer is initialized to ‘00000’ after all Resets. There is no RAM associated with the location corresponding to a Stack Pointer value of ‘00000’; this is only a Reset value. Status bits indicate if the stack is full, or has overflowed or underflowed. 5.1.2.1 Top-of-Stack Access Only the top of the return address stack (TOS) is readable and writable. A set of three registers, TOSU:TOSH:TOSL, hold the contents of the stack location pointed to by the STKPTR register (Figure 5-2). This allows users to implement a software stack if necessary. After a CALL, RCALL or interrupt, the software can read the pushed value by reading the TOSU:TOSH:TOSL registers. These values can be placed on a user-defined software stack. At return time, the software can return these values to TOSU:TOSH:TOSL and do a return. The user must disable the global interrupt enable bits while accessing the stack to prevent inadvertent stack corruption. FIGURE 5-2: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS 00011 001A34h 11111 11110 11101 00010 00001 00000 00010 Return Address Stack <20:0> Top-of-Stack 000D58h TOSU TOSH TOSL 00h 1Ah 34h STKPTR<4:0> Top-of-Stack Registers Stack Pointer © 2008 Microchip Technology Inc. DS39631E-page 55 PIC18F2420/2520/4420/4520 5.1.2.2 Return Stack Pointer (STKPTR) The STKPTR register (Register 5-1) contains the Stack Pointer value, the STKFUL (Stack Full) status bit and the STKUNF (Stack Underflow) status bits. The value of the Stack Pointer can be 0 through 31. The Stack Pointer increments before values are pushed onto the stack and decrements after values are popped off the stack. On Reset, the Stack Pointer value will be zero. The user may read and write the Stack Pointer value. This feature can be used by a Real-Time Operating System (RTOS) for return stack maintenance. After the PC is pushed onto the stack 31 times (without popping any values off the stack), the STKFUL bit is set. The STKFUL bit is cleared by software or by a POR. The action that takes place when the stack becomes full depends on the state of the STVREN (Stack Overflow Reset Enable) Configuration bit. (Refer to Section 23.1 “Configuration Bits” for a description of the device Configuration bits.) If STVREN is set (default), the 31st push will push the (PC + 2) value onto the stack, set the STKFUL bit and reset the device. The STKFUL bit will remain set and the Stack Pointer will be set to zero. If STVREN is cleared, the STKFUL bit will be set on the 31st push and the Stack Pointer will increment to 31. Any additional pushes will not overwrite the 31st push and STKPTR will remain at 31. When the stack has been popped enough times to unload the stack, the next pop will return a value of zero to the PC and sets the STKUNF bit, while the Stack Pointer remains at zero. The STKUNF bit will remain set until cleared by software or until a POR occurs. 5.1.2.3 PUSH and POP Instructions Since the Top-of-Stack is readable and writable, the ability to push values onto the stack and pull values off the stack without disturbing normal program execution is a desirable feature. The PIC18 instruction set includes two instructions, PUSH and POP, that permit the TOS to be manipulated under software control. TOSU, TOSH and TOSL can be modified to place data or a return address on the stack. The PUSH instruction places the current PC value onto the stack. This increments the Stack Pointer and loads the current PC value onto the stack. The POP instruction discards the current TOS by decrementing the Stack Pointer. The previous value pushed onto the stack then becomes the TOS value. Note: Returning a value of zero to the PC on an underflow has the effect of vectoring the program to the Reset vector, where the stack conditions can be verified and appropriate actions can be taken. This is not the same as a Reset, as the contents of the SFRs are not affected. REGISTER 5-1: STKPTR: STACK POINTER REGISTER R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STKFUL(1) STKUNF(1) — SP4 SP3 SP2 SP1 SP0 bit 7 bit 0 Legend: C = Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 STKFUL: Stack Full Flag bit(1) 1 = Stack became full or overflowed 0 = Stack has not become full or overflowed bit 6 STKUNF: Stack Underflow Flag bit(1) 1 = Stack underflow occurred 0 = Stack underflow did not occur bit 5 Unimplemented: Read as ‘0’ bit 4-0 SP<4:0>: Stack Pointer Location bits Note 1: Bit 7 and bit 6 are cleared by user software or by a POR. PIC18F2420/2520/4420/4520 DS39631E-page 56 © 2008 Microchip Technology Inc. 5.1.2.4 Stack Full and Underflow Resets Device Resets on stack overflow and stack underflow conditions are enabled by setting the STVREN bit in Configuration Register 4L. When STVREN is set, a full or underflow will set the appropriate STKFUL or STKUNF bit and then cause a device Reset. When STVREN is cleared, a full or underflow condition will set the appropriate STKFUL or STKUNF bit but not cause a device Reset. The STKFUL or STKUNF bits are cleared by the user software or a Power-on Reset. 5.1.3 FAST REGISTER STACK A Fast Register Stack is provided for the STATUS, WREG and BSR registers, to provide a “fast return” option for interrupts. The stack for each register is only one level deep and is neither readable nor writable. It is loaded with the current value of the corresponding register when the processor vectors for an interrupt. All interrupt sources will push values into the stack registers. The values in the registers are then loaded back into their associated registers if the RETFIE, FAST instruction is used to return from the interrupt. If both low and high-priority interrupts are enabled, the stack registers cannot be used reliably to return from low-priority interrupts. If a high-priority interrupt occurs while servicing a low-priority interrupt, the stack register values stored by the low-priority interrupt will be overwritten. In these cases, users must save the key registers in software during a low-priority interrupt. If interrupt priority is not used, all interrupts may use the Fast Register Stack for returns from interrupt. If no interrupts are used, the Fast Register Stack can be used to restore the STATUS, WREG and BSR registers at the end of a subroutine call. To use the Fast Register Stack for a subroutine call, a CALL label, FAST instruction must be executed to save the STATUS, WREG and BSR registers to the Fast Register Stack. A RETURN, FAST instruction is then executed to restore these registers from the Fast Register Stack. Example 5-1 shows a source code example that uses the Fast Register Stack during a subroutine call and return. EXAMPLE 5-1: FAST REGISTER STACK CODE EXAMPLE 5.1.4 LOOK-UP TABLES IN PROGRAM MEMORY There may be programming situations that require the creation of data structures, or look-up tables, in program memory. For PIC18 devices, look-up tables can be implemented in two ways: • Computed GOTO • Table Reads 5.1.4.1 Computed GOTO A computed GOTO is accomplished by adding an offset to the program counter. An example is shown in Example 5-2. A look-up table can be formed with an ADDWF PCL instruction and a group of RETLW nn instructions. The W register is loaded with an offset into the table before executing a call to that table. The first instruction of the called routine is the ADDWF PCL instruction. The next instruction executed will be one of the RETLW nn instructions that returns the value ‘nn’ to the calling function. The offset value (in WREG) specifies the number of bytes that the program counter should advance and should be multiples of 2 (LSb = 0). In this method, only one data byte may be stored in each instruction location and room on the return address stack is required. EXAMPLE 5-2: COMPUTED GOTO USING AN OFFSET VALUE 5.1.4.2 Table Reads and Table Writes A better method of storing data in program memory allows two bytes of data to be stored in each instruction location. Look-up table data may be stored two bytes per program word by using table reads and writes. The Table Pointer (TBLPTR) register specifies the byte address and the Table Latch (TABLAT) register contains the data that is read from or written to program memory. Data is transferred to or from program memory one byte at a time. Table read and table write operations are discussed further in Section 6.1 “Table Reads and Table Writes”. CALL SUB1, FAST ;STATUS, WREG, BSR ;SAVED IN FAST REGISTER ;STACK • • SUB1 • • RETURN, FAST ;RESTORE VALUES SAVED ;IN FAST REGISTER STACK MOVF OFFSET, W CALL TABLE ORG nn00h TABLE ADDWF PCL RETLW nnh RETLW nnh RETLW nnh . . . © 2008 Microchip Technology Inc. DS39631E-page 57 PIC18F2420/2520/4420/4520 5.2 PIC18 Instruction Cycle 5.2.1 CLOCKING SCHEME The microcontroller clock input, whether from an internal or external source, is internally divided by four to generate four non-overlapping quadrature clocks (Q1, Q2, Q3 and Q4). Internally, the program counter is incremented on every Q1; the instruction is fetched from the program memory and latched into the instruction register during Q4. The instruction is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow are shown in Figure 5-3. 5.2.2 INSTRUCTION FLOW/PIPELINING An “Instruction Cycle” consists of four Q cycles: Q1 through Q4. The instruction fetch and execute are pipelined in such a manner that a fetch takes one instruction cycle, while the decode and execute take another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO), then two cycles are required to complete the instruction (Example 5-3). A fetch cycle begins with the Program Counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 5-3: CLOCK/INSTRUCTION CYCLE EXAMPLE 5-3: INSTRUCTION PIPELINE FLOW Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Q3 Q4 PC OSC2/CLKO (RC mode) PC PC + 2 PC + 4 Fetch INST (PC) Execute INST (PC – 2) Fetch INST (PC + 2) Execute INST (PC) Fetch INST (PC + 4) Execute INST (PC + 2) Internal Phase Clock All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed. TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOVLW 55h Fetch 1 Execute 1 2. MOVWF PORTB Fetch 2 Execute 2 3. BRA SUB_1 Fetch 3 Execute 3 4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP) 5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1 PIC18F2420/2520/4420/4520 DS39631E-page 58 © 2008 Microchip Technology Inc. 5.2.3 INSTRUCTIONS IN PROGRAM MEMORY The program memory is addressed in bytes. Instructions are stored as two bytes or four bytes in program memory. The Least Significant Byte of an instruction word is always stored in a program memory location with an even address (LSb = 0). To maintain alignment with instruction boundaries, the PC increments in steps of 2 and the LSb will always read ‘0’ (see Section 5.1.1 “Program Counter”). Figure 5-4 shows an example of how instruction words are stored in the program memory. The CALL and GOTO instructions have the absolute program memory address embedded into the instruction. Since instructions are always stored on word boundaries, the data contained in the instruction is a word address. The word address is written to PC<20:1>, which accesses the desired byte address in program memory. Instruction #2 in Figure 5-4 shows how the instruction GOTO 0006h is encoded in the program memory. Program branch instructions, which encode a relative address offset, operate in the same manner. The offset value stored in a branch instruction represents the number of single-word instructions that the PC will be offset by. Section 24.0 “Instruction Set Summary” provides further details of the instruction set. FIGURE 5-4: INSTRUCTIONS IN PROGRAM MEMORY 5.2.4 TWO-WORD INSTRUCTIONS The standard PIC18 instruction set has four two-word instructions: CALL, MOVFF, GOTO and LSFR. In all cases, the second word of the instructions always has ‘1111’ as its four Most Significant bits; the other 12 bits are literal data, usually a data memory address. The use of ‘1111’ in the 4 MSbs of an instruction specifies a special form of NOP. If the instruction is executed in proper sequence – immediately after the first word – the data in the second word is accessed and used by the instruction sequence. If the first word is skipped for some reason and the second word is executed by itself, a NOP is executed instead. This is necessary for cases when the two-word instruction is preceded by a conditional instruction that changes the PC. Example 5-4 shows how this works. EXAMPLE 5-4: TWO-WORD INSTRUCTIONS Word Address LSB = 1 LSB = 0 ↓ Program Memory Byte Locations → 000000h 000002h 000004h 000006h Instruction 1: MOVLW 055h 0Fh 55h 000008h Instruction 2: GOTO 0006h EFh 03h 00000Ah F0h 00h 00000Ch Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh F4h 56h 000010h 000012h 000014h Note: See Section 5.6 “PIC18 Instruction Execution and the Extended Instruction Set” for information on two-word instructions in the extended instruction set. CASE 1: Object Code Source Code 0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0? 1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word 1111 0100 0101 0110 ; Execute this word as a NOP 0010 0100 0000 0000 ADDWF REG3 ; continue code CASE 2: Object Code Source Code 0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0? 1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word 1111 0100 0101 0110 ; 2nd word of instruction 0010 0100 0000 0000 ADDWF REG3 ; continue code © 2008 Microchip Technology Inc. DS39631E-page 59 PIC18F2420/2520/4420/4520 5.3 Data Memory Organization The data memory in PIC18 devices is implemented as static RAM. Each register in the data memory has a 12-bit address, allowing up to 4096 bytes of data memory. The memory space is divided into as many as 16 banks that contain 256 bytes each; PIC18F2420/ 2520/4420/4520 devices implement all 16 banks. Figure 5-5 shows the data memory organization for the PIC18F2420/2520/4420/4520 devices. The data memory contains Special Function Registers (SFRs) and General Purpose Registers (GPRs). The SFRs are used for control and status of the controller and peripheral functions, while GPRs are used for data storage and scratchpad operations in the user’s application. Any read of an unimplemented location will read as ‘0’s. The instruction set and architecture allow operations across all banks. The entire data memory may be accessed by Direct, Indirect or Indexed Addressing modes. Addressing modes are discussed later in this subsection. To ensure that commonly used registers (SFRs and select GPRs) can be accessed in a single cycle, PIC18 devices implement an Access Bank. This is a 256-byte memory space that provides fast access to SFRs and the lower portion of GPR Bank 0 without using the BSR. Section 5.3.2 “Access Bank” provides a detailed description of the Access RAM. 5.3.1 BANK SELECT REGISTER (BSR) Large areas of data memory require an efficient addressing scheme to make rapid access to any address possible. Ideally, this means that an entire address does not need to be provided for each read or write operation. For PIC18 devices, this is accomplished with a RAM banking scheme. This divides the memory space into 16 contiguous banks of 256 bytes. Depending on the instruction, each location can be addressed directly by its full 12-bit address, or an 8-bit low-order address and a 4-bit Bank Pointer. Most instructions in the PIC18 instruction set make use of the Bank Pointer, known as the Bank Select Register (BSR). This SFR holds the 4 Most Significant bits of a location’s address; the instruction itself includes the 8 Least Significant bits. Only the four lower bits of the BSR are implemented (BSR<3:0>). The upper four bits are unused; they will always read ‘0’ and cannot be written to. The BSR can be loaded directly by using the MOVLB instruction. The value of the BSR indicates the bank in data memory; the 8 bits in the instruction show the location in the bank and can be thought of as an offset from the bank’s lower boundary. The relationship between the BSR’s value and the bank division in data memory is shown in Figure 5-7. Since up to 16 registers may share the same low-order address, the user must always be careful to ensure that the proper bank is selected before performing a data read or write. For example, writing what should be program data to an 8-bit address of F9h while the BSR is 0Fh will end up resetting the program counter. While any bank can be selected, only those banks that are actually implemented can be read or written to. Writes to unimplemented banks are ignored, while reads from unimplemented banks will return ‘0’s. Even so, the STATUS register will still be affected as if the operation was successful. The data memory map in Figure 5-5 indicates which banks are implemented. In the core PIC18 instruction set, only the MOVFF instruction fully specifies the 12-bit address of the source and target registers. This instruction ignores the BSR completely when it executes. All other instructions include only the low-order address as an operand and must use either the BSR or the Access Bank to locate their target registers. Note: The operation of some aspects of data memory are changed when the PIC18 extended instruction set is enabled. See Section 5.5 “Data Memory and the Extended Instruction Set” for more information. PIC18F2420/2520/4420/4520 DS39631E-page 60 © 2008 Microchip Technology Inc. FIGURE 5-5: DATA MEMORY MAP FOR PIC18F2420/4420 DEVICES Bank 0 Bank 1 Bank 14 Bank 15 BSR<3:0> Data Memory Map = 0000 = 0001 = 1111 080h 07Fh F80h FFFh 00h 7Fh 80h FFh Access Bank When ‘a’ = 0: The BSR is ignored and the Access Bank is used. The first 128 bytes are general purpose RAM (from Bank 0). The second 128 bytes are Special Function Registers (from Bank 15). When ‘a’ = 1: The BSR specifies the Bank used by the instruction. F7Fh F00h EFFh 1FFh 100h 0FFh 000h Access RAM FFh 00h FFh 00h FFh 00h GPR GPR SFR Access RAM High Access RAM Low Bank 2 = 0110 = 0010 (SFRs) 2FFh 200h 3FFh 300h 4FFh 400h 5FFh 500h 6FFh 600h 7FFh 700h 8FFh 800h 9FFh 900h AFFh A00h BFFh B00h CFFh C00h DFFh D00h E00h Bank 3 Bank 4 Bank 5 Bank 6 Bank 7 Bank 8 Bank 9 Bank 10 Bank 11 Bank 12 Bank 13 FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h GPR FFh 00h = 0011 = 0100 = 0101 = 0111 = 1000 = 1001 = 1010 = 1011 = 1100 = 1101 = 1110 Unused Read 00h Unused © 2008 Microchip Technology Inc. DS39631E-page 61 PIC18F2420/2520/4420/4520 FIGURE 5-6: DATA MEMORY MAP FOR PIC18F2520/4520 DEVICES Bank 0 Bank 1 Bank 14 Bank 15 BSR<3:0> Data Memory Map = 0000 = 0001 = 1111 080h 07Fh F80h FFFh 00h 7Fh 80h FFh Access Bank When ‘a’ = 0: The BSR is ignored and the Access Bank is used. The first 128 bytes are general purpose RAM (from Bank 0). The second 128 bytes are Special Function Registers (from Bank 15). When ‘a’ = 1: The BSR specifies the Bank used by the instruction. F7Fh F00h EFFh 1FFh 100h 0FFh 000h Access RAM FFh 00h FFh 00h FFh 00h GPR GPR SFR Access RAM High Access RAM Low Bank 2 = 0110 = 0010 (SFRs) 2FFh 200h 3FFh 300h 4FFh 400h 5FFh 500h 6FFh 600h 7FFh 700h 8FFh 800h 9FFh 900h AFFh A00h BFFh B00h CFFh C00h DFFh D00h E00h Bank 3 Bank 4 Bank 5 Bank 6 Bank 7 Bank 8 Bank 9 Bank 10 Bank 11 Bank 12 Bank 13 FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h GPR FFh 00h = 0011 = 0100 = 0101 = 0111 = 1000 = 1001 = 1010 = 1011 = 1100 = 1101 = 1110 Unused Read 00h Unused GPR GPR GPR PIC18F2420/2520/4420/4520 DS39631E-page 62 © 2008 Microchip Technology Inc. FIGURE 5-7: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING) 5.3.2 ACCESS BANK While the use of the BSR with an embedded 8-bit address allows users to address the entire range of data memory, it also means that the user must always ensure that the correct bank is selected. Otherwise, data may be read from or written to the wrong location. This can be disastrous if a GPR is the intended target of an operation, but an SFR is written to instead. Verifying and/or changing the BSR for each read or write to data memory can become very inefficient. To streamline access for the most commonly used data memory locations, the data memory is configured with an Access Bank, which allows users to access a mapped block of memory without specifying a BSR. The Access Bank consists of the first 128 bytes of memory (00h-7Fh) in Bank 0 and the last 128 bytes of memory (80h-FFh) in Block 15. The lower half is known as the “Access RAM” and is composed of GPRs. This upper half is also where the device’s SFRs are mapped. These two areas are mapped contiguously in the Access Bank and can be addressed in a linear fashion by an 8-bit address (Figure 5-5). The Access Bank is used by core PIC18 instructions that include the Access RAM bit (the ‘a’ parameter in the instruction). When ‘a’ is equal to ‘1’, the instruction uses the BSR and the 8-bit address included in the opcode for the data memory address. When ‘a’ is ‘0’, however, the instruction is forced to use the Access Bank address map; the current value of the BSR is ignored entirely. Using this “forced” addressing allows the instruction to operate on a data address in a single cycle, without updating the BSR first. For 8-bit addresses of 80h and above, this means that users can evaluate and operate on SFRs more efficiently. The Access RAM below 80h is a good place for data values that the user might need to access rapidly, such as immediate computational results or common program variables. Access RAM also allows for faster and more code efficient context saving and switching of variables. The mapping of the Access Bank is slightly different when the extended instruction set is enabled (XINST Configuration bit = 1). This is discussed in more detail in Section 5.5.3 “Mapping the Access Bank in Indexed Literal Offset Mode”. 5.3.3 GENERAL PURPOSE REGISTER FILE PIC18 devices may have banked memory in the GPR area. This is data RAM, which is available for use by all instructions. GPRs start at the bottom of Bank 0 (address 000h) and grow upwards towards the bottom of the SFR area. GPRs are not initialized by a Power-on Reset and are unchanged on all other Resets. Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to the registers of the Access Bank. 2: The MOVFF instruction embeds the entire 12-bit address in the instruction. Data Memory Bank Select(2) 7 0 From Opcode(2) 0000 000h 100h 200h 300h F00h E00h FFFh Bank 0 Bank 1 Bank 2 Bank 14 Bank 15 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh Bank 3 through Bank 13 0011 11111111 7 0 BSR(1) © 2008 Microchip Technology Inc. DS39631E-page 63 PIC18F2420/2520/4420/4520 5.3.4 SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral modules for controlling the desired operation of the device. These registers are implemented as static RAM. SFRs start at the top of data memory (FFFh) and extend downward to occupy the top half of Bank 15 (F80h to FFFh). A list of these registers is given in Table 5-1 and Table 5-2. The SFRs can be classified into two sets: those associated with the “core” device functionality (ALU, Resets and interrupts) and those related to the peripheral functions. The Reset and Interrupt registers are described in their respective chapters, while the ALU’s STATUS register is described later in this section. Registers related to the operation of a peripheral feature are described in the chapter for that peripheral. The SFRs are typically distributed among the peripherals whose functions they control. Unused SFR locations are unimplemented and read as ‘0’s. TABLE 5-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18F2420/2520/4420/4520 DEVICES Address Name Address Name Address Name Address Name FFFh TOSU FDFh INDF2(1) FBFh CCPR1H F9Fh IPR1 FFEh TOSH FDEh POSTINC2(1) FBEh CCPR1L F9Eh PIR1 FFDh TOSL FDDh POSTDEC2(1) FBDh CCP1CON F9Dh PIE1 FFCh STKPTR FDCh PREINC2(1) FBCh CCPR2H F9Ch —(2) FFBh PCLATU FDBh PLUSW2(1) FBBh CCPR2L F9Bh OSCTUNE FFAh PCLATH FDAh FSR2H FBAh CCP2CON F9Ah —(2) FF9h PCL FD9h FSR2L FB9h —(2) F99h —(2) FF8h TBLPTRU FD8h STATUS FB8h BAUDCON F98h —(2) FF7h TBLPTRH FD7h TMR0H FB7h PWM1CON(3) F97h —(2) FF6h TBLPTRL FD6h TMR0L FB6h ECCP1AS(3) F96h TRISE(3) FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD(3) FF4h PRODH FD4h —(2) FB4h CMCON F94h TRISC FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB FF2h INTCON FD2h HLVDCON FB2h TMR3L F92h TRISA FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h —(2) FF0h INTCON3 FD0h RCON FB0h SPBRGH F90h —(2) FEFh INDF0(1) FCFh TMR1H FAFh SPBRG F8Fh —(2) FEEh POSTINC0(1) FCEh TMR1L FAEh RCREG F8Eh —(2) FEDh POSTDEC0(1) FCDh T1CON FADh TXREG F8Dh LATE(3) FECh PREINC0(1) FCCh TMR2 FACh TXSTA F8Ch LATD(3) FEBh PLUSW0(1) FCBh PR2 FABh RCSTA F8Bh LATC FEAh FSR0H FCAh T2CON FAAh —(2) F8Ah LATB FE9h FSR0L FC9h SSPBUF FA9h EEADR F89h LATA FE8h WREG FC8h SSPADD FA8h EEDATA F88h —(2) FE7h INDF1(1) FC7h SSPSTAT FA7h EECON2(1) F87h —(2) FE6h POSTINC1(1) FC6h SSPCON1 FA6h EECON1 F86h —(2) FE5h POSTDEC1(1) FC5h SSPCON2 FA5h —(2) F85h —(2) FE4h PREINC1(1) FC4h ADRESH FA4h —(2) F84h PORTE(3) FE3h PLUSW1(1) FC3h ADRESL FA3h —(2) F83h PORTD(3) FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA Note 1: This is not a physical register. 2: Unimplemented registers are read as ‘0’. 3: This register is not available on 28-pin devices. PIC18F2420/2520/4420/4520 DS39631E-page 64 © 2008 Microchip Technology Inc. TABLE 5-2: PIC18F2420/2520/4420/4520 REGISTER FILE SUMMARY File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: TOSU — — — Top-of-Stack Upper Byte (TOS<20:16>) ---0 0000 49, 54 TOSH Top-of-Stack High Byte (TOS<15:8>) 0000 0000 49, 54 TOSL Top-of-Stack Low Byte (TOS<7:0>) 0000 0000 49, 54 STKPTR STKFUL STKUNF — SP4 SP3 SP2 SP1 SP0 00-0 0000 49, 55 PCLATU — — — Holding Register for PC<20:16> ---0 0000 49, 54 PCLATH Holding Register for PC<15:8> 0000 0000 49, 54 PCL PC Low Byte (PC<7:0>) 0000 0000 49, 54 TBLPTRU — — bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 49, 76 TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000 49, 76 TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000 49, 76 TABLAT Program Memory Table Latch 0000 0000 49, 76 PRODH Product Register High Byte xxxx xxxx 49, 89 PRODL Product Register Low Byte xxxx xxxx 49, 89 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 49, 93 INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP 1111 -1-1 49, 94 INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 11-0 0-00 49, 95 INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 49, 69 POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 49, 69 POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A 49, 69 PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 49, 69 PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) – value of FSR0 offset by W N/A 49, 69 FSR0H — — — — Indirect Data Memory Address Pointer 0 High Byte ---- 0000 49, 69 FSR0L Indirect Data Memory Address Pointer 0 Low Byte xxxx xxxx 49, 69 WREG Working Register xxxx xxxx 49 INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 49, 69 POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 49, 69 POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 49, 69 PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 49, 69 PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) – value of FSR1 offset by W N/A 49, 69 FSR1H — — — — Indirect Data Memory Address Pointer 1 High Byte ---- 0000 50, 69 FSR1L Indirect Data Memory Address Pointer 1 Low Byte xxxx xxxx 50, 69 BSR — — — — Bank Select Register ---- 0000 50, 59 INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 50, 69 POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 50, 69 POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 50, 69 PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 50, 69 PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) – value of FSR2 offset by W N/A 50, 69 FSR2H — — — — Indirect Data Memory Address Pointer 2 High Byte ---- 0000 50, 69 FSR2L Indirect Data Memory Address Pointer 2 Low Byte xxxx xxxx 50, 69 STATUS — — — N OV Z DC C ---x xxxx 50, 67 Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”. 2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; individual unimplemented bits should be interpreted as ‘-’. 3: The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes”. 4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0); otherwise, RE3 reads as ‘0’. This bit is read-only. 5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. © 2008 Microchip Technology Inc. DS39631E-page 65 PIC18F2420/2520/4420/4520 TMR0H Timer0 Register High Byte 0000 0000 50, 125 TMR0L Timer0 Register Low Byte xxxx xxxx 50, 125 T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 50, 123 OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0100 q000 30, 50 HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 0-00 0101 50, 245 WDTCON — — — — — — — SWDTEN --- ---0 50, 259 RCON IPEN SBOREN(1) — RI TO PD POR BOR 0q-1 11q0 42, 48, 102 TMR1H Timer1 Register High Byte xxxx xxxx 50, 132 TMR1L Timer1 Register Low Bytes xxxx xxxx 50, 132 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 50, 127 TMR2 Timer2 Register 0000 0000 50, 134 PR2 Timer2 Period Register 1111 1111 50, 134 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 50, 133 SSPBUF MSSP Receive Buffer/Transmit Register xxxx xxxx 50, 169, 170 SSPADD MSSP Address Register in I2C™ Slave Mode. MSSP Baud Rate Reload Register in I2C Master Mode. 0000 0000 50, 170 SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 50, 162, 171 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 50, 163, 172 SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 50, 173 ADRESH A/D Result Register High Byte xxxx xxxx 51, 232 ADRESL A/D Result Register Low Byte xxxx xxxx 51, 232 ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON --00 0000 51, 223 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0qqq 51, 224 ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 51, 225 CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 51, 140 CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 51, 140 CCP1CON P1M1(2) P1M0(2) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 51, 139, 147 CCPR2H Capture/Compare/PWM Register 2 High Byte xxxx xxxx 51, 140 CCPR2L Capture/Compare/PWM Register 2 Low Byte xxxx xxxx 51, 140 CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 51, 139 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 0100 0-00 51, 204 PWM1CON PRSEN PDC6(2) PDC5(2) PDC4(2) PDC3(2) PDC2(2) PDC1(2) PDC0(2) 0000 0000 51, 156 ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(2) PSSBD0(2) 0000 0000 51, 157 CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000 0000 51, 239 CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 51, 233 TMR3H Timer3 Register High Byte xxxx xxxx 51, 137 TMR3L Timer3 Register Low Byte xxxx xxxx 51, 137 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 51, 135 TABLE 5-2: PIC18F2420/2520/4420/4520 REGISTER FILE SUMMARY (CONTINUED) File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”. 2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; individual unimplemented bits should be interpreted as ‘-’. 3: The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes”. 4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0); otherwise, RE3 reads as ‘0’. This bit is read-only. 5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. PIC18F2420/2520/4420/4520 DS39631E-page 66 © 2008 Microchip Technology Inc. SPBRGH EUSART Baud Rate Generator Register High Byte 0000 0000 51, 206 SPBRG EUSART Baud Rate Generator Register Low Byte 0000 0000 51, 206 RCREG EUSART Receive Register 0000 0000 51, 213 TXREG EUSART Transmit Register 0000 0000 51, 211 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 51, 202 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 51, 203 EEADR EEPROM Address Register 0000 0000 51, 74, 83 EEDATA EEPROM Data Register 0000 0000 51, 74, 83 EECON2 EEPROM Control Register 2 (not a physical register) 0000 0000 51, 74, 83 EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 51, 75, 84 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 11-1 1111 52, 101 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 00-0 0000 52, 97 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 00-0 0000 52, 99 IPR1 PSPIP(2) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 52, 100 PIR1 PSPIF(2) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 52, 96 PIE1 PSPIE(2) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 52, 98 OSCTUNE INTSRC PLLEN(3) — TUN4 TUN3 TUN2 TUN1 TUN0 0q-0 0000 27, 52 TRISE(2) IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 0000 -111 52, 118 TRISD(2) PORTD Data Direction Register 1111 1111 52, 114 TRISC PORTC Data Direction Register 1111 1111 52, 111 TRISB PORTB Data Direction Register 1111 1111 52, 108 TRISA TRISA7(5) TRISA6(5) PORTA Data Direction Register 1111 1111 52, 105 LATE(2) — — — — — PORTE Data Latch Register (Read and Write to Data Latch) ---- -xxx 52, 117 LATD(2) PORTD Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 114 LATC PORTC Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 111 LATB PORTB Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 108 LATA LATA7(5) LATA6(5) PORTA Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 105 PORTE — — — — RE3(4) RE2(2) RE1(2) RE0(2) ---- xxxx 52, 117 PORTD(2) RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx 52, 114 PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx 52, 111 PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 52, 108 PORTA RA7(5) RA6(5) RA5 RA4 RA3 RA2 RA1 RA0 xx0x 0000 52, 105 TABLE 5-2: PIC18F2420/2520/4420/4520 REGISTER FILE SUMMARY (CONTINUED) File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”. 2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; individual unimplemented bits should be interpreted as ‘-’. 3: The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes”. 4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0); otherwise, RE3 reads as ‘0’. This bit is read-only. 5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. © 2008 Microchip Technology Inc. DS39631E-page 67 PIC18F2420/2520/4420/4520 5.3.5 STATUS REGISTER The STATUS register, shown in Register 5-2, contains the arithmetic status of the ALU. As with any other SFR, it can be the operand for any instruction. If the STATUS register is the destination for an instruction that affects the Z, DC, C, OV or N bits, the results of the instruction are not written; instead, the STATUS register is updated according to the instruction performed. Therefore, the result of an instruction with the STATUS register as its destination may be different than intended. As an example, CLRF STATUS will set the Z bit and leave the remaining Status bits unchanged (‘000u u1uu’). It is recommended that only BCF, BSF, SWAPF, MOVFF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect the Z, C, DC, OV or N bits in the STATUS register. For other instructions that do not affect Status bits, see the instruction set summaries in Table 24-2 and Table 24-3. Note: The C and DC bits operate as the borrow and digit borrow bits, respectively, in subtraction. REGISTER 5-2: STATUS REGISTER U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — N OV Z DC(1) C(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4 N: Negative bit This bit is used for signed arithmetic (2’s complement). It indicates whether the result was negative (ALU MSB = 1). 1 = Result was negative 0 = Result was positive bit 3 OV: Overflow bit This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit magnitude which causes the sign bit (bit 7) to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/borrow bit(1) For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/borrow bit(2) For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register. 2: For borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the source register. PIC18F2420/2520/4420/4520 DS39631E-page 68 © 2008 Microchip Technology Inc. 5.4 Data Addressing Modes While the program memory can be addressed in only one way – through the program counter – information in the data memory space can be addressed in several ways. For most instructions, the addressing mode is fixed. Other instructions may use up to three modes, depending on which operands are used and whether or not the extended instruction set is enabled. The addressing modes are: • Inherent • Literal • Direct • Indirect An additional addressing mode, Indexed Literal Offset, is available when the extended instruction set is enabled (XINST Configuration bit = 1). Its operation is discussed in greater detail in Section 5.5.1 “Indexed Addressing with Literal Offset”. 5.4.1 INHERENT AND LITERAL ADDRESSING Many PIC18 control instructions do not need any argument at all; they either perform an operation that globally affects the device or they operate implicitly on one register. This addressing mode is known as Inherent Addressing. Examples include SLEEP, RESET and DAW. Other instructions work in a similar way but require an additional explicit argument in the opcode. This is known as Literal Addressing mode because they require some literal value as an argument. Examples include ADDLW and MOVLW, which respectively, add or move a literal value to the W register. Other examples include CALL and GOTO, which include a 20-bit program memory address. 5.4.2 DIRECT ADDRESSING Direct Addressing specifies all or part of the source and/or destination address of the operation within the opcode itself. The options are specified by the arguments accompanying the instruction. In the core PIC18 instruction set, bit-oriented and byteoriented instructions use some version of Direct Addressing by default. All of these instructions include some 8-bit literal address as their Least Significant Byte. This address specifies either a register address in one of the banks of data RAM (Section 5.3.3 “General Purpose Register File”) or a location in the Access Bank (Section 5.3.2 “Access Bank”) as the data source for the instruction. The Access RAM bit ‘a’ determines how the address is interpreted. When ‘a’ is ‘1’, the contents of the BSR (Section 5.3.1 “Bank Select Register (BSR)”) are used with the address to determine the complete 12-bit address of the register. When ‘a’ is ‘0’, the address is interpreted as being a register in the Access Bank. Addressing that uses the Access RAM is sometimes also known as Direct Forced Addressing mode. A few instructions, such as MOVFF, include the entire 12-bit address (either source or destination) in their opcodes. In these cases, the BSR is ignored entirely. The destination of the operation’s results is determined by the destination bit ‘d’. When ‘d’ is ‘1’, the results are stored back in the source register, overwriting its original contents. When ‘d’ is ‘0’, the results are stored in the W register. Instructions without the ‘d’ argument have a destination that is implicit in the instruction; their destination is either the target register being operated on or the W register. 5.4.3 INDIRECT ADDRESSING Indirect Addressing allows the user to access a location in data memory without giving a fixed address in the instruction. This is done by using File Select Registers (FSRs) as pointers to the locations to be read or written to. Since the FSRs are themselves located in RAM as Special Function Registers, they can also be directly manipulated under program control. This makes FSRs very useful in implementing data structures, such as tables and arrays in data memory. The registers for Indirect Addressing are also implemented with Indirect File Operands (INDFs) that permit automatic manipulation of the pointer value with auto-incrementing, auto-decrementing or offsetting with another value. This allows for efficient code, using loops, such as the example of clearing an entire RAM bank in Example 5-5. EXAMPLE 5-5: HOW TO CLEAR RAM (BANK 1) USING INDIRECT ADDRESSING Note: The execution of some instructions in the core PIC18 instruction set are changed when the PIC18 extended instruction set is enabled. See Section 5.5 “Data Memory and the Extended Instruction Set” for more information. LFSR FSR0, 100h; NEXT CLRF POSTINC0 ; Clear INDF ; register then ; inc pointer BTFSS FSR0H, 1; All done with ; Bank1? BRA NEXT ; NO, clear next CONTINUE ; YES, continue © 2008 Microchip Technology Inc. DS39631E-page 69 PIC18F2420/2520/4420/4520 5.4.3.1 FSR Registers and the INDF Operand At the core of Indirect Addressing are three sets of registers: FSR0, FSR1 and FSR2. Each represents a pair of 8-bit registers, FSRnH and FSRnL. The four upper bits of the FSRnH register are not used so each FSR pair holds a 12-bit value. This represents a value that can address the entire range of the data memory in a linear fashion. The FSR register pairs, then, serve as pointers to data memory locations. Indirect Addressing is accomplished with a set of Indirect File Operands, INDF0 through INDF2. These can be thought of as “virtual” registers: they are mapped in the SFR space but are not physically implemented. Reading or writing to a particular INDF register actually accesses its corresponding FSR register pair. A read from INDF1, for example, reads the data at the address indicated by FSR1H:FSR1L. Instructions that use the INDF registers as operands actually use the contents of their corresponding FSR as a pointer to the instruction’s target. The INDF operand is just a convenient way of using the pointer. Because Indirect Addressing uses a full 12-bit address, data RAM banking is not necessary. Thus, the current contents of the BSR and the Access RAM bit have no effect on determining the target address. 5.4.3.2 FSR Registers and POSTINC, POSTDEC, PREINC and PLUSW In addition to the INDF operand, each FSR register pair also has four additional indirect operands. Like INDF, these are “virtual” registers that cannot be indirectly read or written to. Accessing these registers actually accesses the associated FSR register pair, but also performs a specific action on it stored value. They are: • POSTDEC: accesses the FSR value, then automatically decrements it by 1 afterwards • POSTINC: accesses the FSR value, then automatically increments it by 1 afterwards • PREINC: increments the FSR value by 1, then uses it in the operation • PLUSW: adds the signed value of the W register (range of -127 to 128) to that of the FSR and uses the new value in the operation. In this context, accessing an INDF register uses the value in the FSR registers without changing them. Similarly, accessing a PLUSW register gives the FSR value offset by that in the W register; neither value is actually changed in the operation. Accessing the other virtual registers changes the value of the FSR registers. Operations on the FSRs with POSTDEC, POSTINC and PREINC affect the entire register pair; that is, rollovers of the FSRnL register from FFh to 00h carry over to the FSRnH register. On the other hand, results of these operations do not change the value of any flags in the STATUS register (e.g., Z, N, OV, etc.). FIGURE 5-8: INDIRECT ADDRESSING FSR1H:FSR1L 7 0 Data Memory 000h 100h 200h 300h F00h E00h FFFh Bank 0 Bank 1 Bank 2 Bank 14 Bank 15 Bank 3 through Bank 13 ADDWF, INDF1, 1 7 0 Using an instruction with one of the Indirect Addressing registers as the operand.... ...uses the 12-bit address stored in the FSR pair associated with that register.... ...to determine the data memory location to be used in that operation. In this case, the FSR1 pair contains ECCh. This means the contents of location ECCh will be added to that of the W register and stored back in ECCh. xxxx 1110 11001100 PIC18F2420/2520/4420/4520 DS39631E-page 70 © 2008 Microchip Technology Inc. The PLUSW register can be used to implement a form of Indexed Addressing in the data memory space. By manipulating the value in the W register, users can reach addresses that are fixed offsets from pointer addresses. In some applications, this can be used to implement some powerful program control structure, such as software stacks, inside of data memory. 5.4.3.3 Operations by FSRs on FSRs Indirect Addressing operations that target other FSRs or virtual registers represent special cases. For example, using an FSR to point to one of the virtual registers will not result in successful operations. As a specific case, assume that FSR0H:FSR0L contains FE7h, the address of INDF1. Attempts to read the value of the INDF1 using INDF0 as an operand will return 00h. Attempts to write to INDF1 using INDF0 as the operand will result in a NOP. On the other hand, using the virtual registers to write to an FSR pair may not occur as planned. In these cases, the value will be written to the FSR pair but without any incrementing or decrementing. Thus, writing to INDF2 or POSTDEC2 will write the same value to the FSR2H:FSR2L. Since the FSRs are physical registers mapped in the SFR space, they can be manipulated through all direct operations. Users should proceed cautiously when working on these registers, particularly if their code uses indirect addressing. Similarly, operations by Indirect Addressing are generally permitted on all other SFRs. Users should exercise the appropriate caution that they do not inadvertently change settings that might affect the operation of the device. 5.5 Data Memory and the Extended Instruction Set Enabling the PIC18 extended instruction set (XINST Configuration bit = 1) significantly changes certain aspects of data memory and its addressing. Specifically, the use of the Access Bank for many of the core PIC18 instructions is different; this is due to the introduction of a new addressing mode for the data memory space. What does not change is just as important. The size of the data memory space is unchanged, as well as its linear addressing. The SFR map remains the same. Core PIC18 instructions can still operate in both Direct and Indirect Addressing mode; inherent and literal instructions do not change at all. Indirect Addressing with FSR0 and FSR1 also remains unchanged. 5.5.1 INDEXED ADDRESSING WITH LITERAL OFFSET Enabling the PIC18 extended instruction set changes the behavior of Indirect Addressing using the FSR2 register pair within Access RAM. Under the proper conditions, instructions that use the Access Bank – that is, most bit-oriented and byte-oriented instructions – can invoke a form of Indexed Addressing using an offset specified in the instruction. This special addressing mode is known as Indexed Addressing with Literal Offset, or Indexed Literal Offset mode. When using the extended instruction set, this addressing mode requires the following: • The use of the Access Bank is forced (‘a’ = 0) and • The file address argument is less than or equal to 5Fh. Under these conditions, the file address of the instruction is not interpreted as the lower byte of an address (used with the BSR in direct addressing), or as an 8-bit address in the Access Bank. Instead, the value is interpreted as an offset value to an Address Pointer, specified by FSR2. The offset and the contents of FSR2 are added to obtain the target address of the operation. 5.5.2 INSTRUCTIONS AFFECTED BY INDEXED LITERAL OFFSET MODE Any of the core PIC18 instructions that can use Direct Addressing are potentially affected by the Indexed Literal Offset Addressing mode. This includes all byte-oriented and bit-oriented instructions, or almost one-half of the standard PIC18 instruction set. Instructions that only use Inherent or Literal Addressing modes are unaffected. Additionally, byte-oriented and bit-oriented instructions are not affected if they do not use the Access Bank (Access RAM bit is ‘1’), or include a file address of 60h or above. Instructions meeting these criteria will continue to execute as before. A comparison of the different possible addressing modes when the extended instruction set is enabled in shown in Figure 5-9. Those who desire to use byte-oriented or bit-oriented instructions in the Indexed Literal Offset mode should note the changes to assembler syntax for this mode. This is described in more detail in Section 24.2.1 “Extended Instruction Syntax”. © 2008 Microchip Technology Inc. DS39631E-page 71 PIC18F2420/2520/4420/4520 FIGURE 5-9: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED) EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff) When ‘a’ = 0 and f ≥ 60h: The instruction executes in Direct Forced mode. ‘f’ is interpreted as a location in the Access RAM between 060h and 0FFh. This is the same as locations 060h to 07Fh (Bank 0) and F80h to FFFh (Bank 15) of data memory. Locations below 60h are not available in this addressing mode. When ‘a’ = 0 and f ≤ 5Fh: The instruction executes in Indexed Literal Offset mode. ‘f’ is interpreted as an offset to the address value in FSR2. The two are added together to obtain the address of the target register for the instruction. The address can be anywhere in the data memory space. Note that in this mode, the correct syntax is now: ADDWF [k], d where ‘k’ is the same as ‘f’. When ‘a’ = 1 (all values of f): The instruction executes in Direct mode (also known as Direct Long mode). ‘f’ is interpreted as a location in one of the 16 banks of the data memory space. The bank is designated by the Bank Select Register (BSR). The address can be in any implemented bank in the data memory space. 000h 060h 100h F00h F80h FFFh Valid range 00h 60h 80h FFh Data Memory Access RAM Bank 0 Bank 1 through Bank 14 Bank 15 SFRs 000h 080h 100h F00h F80h FFFh Data Memory Bank 0 Bank 1 through Bank 14 Bank 15 SFRs FSR2H FSR2L 001001da ffffffff 001001da ffffffff 000h 080h 100h F00h F80h FFFh Data Memory Bank 0 Bank 1 through Bank 14 Bank 15 SFRs for ‘f’ BSR 00000000 080h PIC18F2420/2520/4420/4520 DS39631E-page 72 © 2008 Microchip Technology Inc. 5.5.3 MAPPING THE ACCESS BANK IN INDEXED LITERAL OFFSET MODE The use of Indexed Literal Offset Addressing mode effectively changes how the first 96 locations of Access RAM (00h to 5Fh) are mapped. Rather than containing just the contents of the bottom half of Bank 0, this mode maps the contents from Bank 0 and a user-defined “window” that can be located anywhere in the data memory space. The value of FSR2 establishes the lower boundary of the addresses mapped into the window, while the upper boundary is defined by FSR2 plus 95 (5Fh). Addresses in the Access RAM above 5Fh are mapped as previously described (see Section 5.3.2 “Access Bank”). An example of Access Bank remapping in this addressing mode is shown in Figure 5-10. Remapping of the Access Bank applies only to operations using the Indexed Literal Offset mode. Operations that use the BSR (Access RAM bit is ‘1’) will continue to use Direct Addressing as before. 5.6 PIC18 Instruction Execution and the Extended Instruction Set Enabling the extended instruction set adds eight additional commands to the existing PIC18 instruction set. These instructions are executed as described in Section 24.2 “Extended Instruction Set”. FIGURE 5-10: REMAPPING THE ACCESS BANK WITH INDEXED LITERAL OFFSET ADDRESSING Data Memory 000h 100h 200h F80h F00h FFFh Bank 1 Bank 15 Bank 2 through Bank 14 SFRs 05Fh ADDWF f, d, a FSR2H:FSR2L = 120h Locations in the region from the FSR2 Pointer (120h) to the pointer plus 05Fh (17Fh) are mapped to the bottom of the Access RAM (000h-05Fh). Locations in Bank 0 from 060h to 07Fh are mapped, as usual, to the middle half of the Access Bank. Special Function Registers at F80h through FFFh are mapped to 80h through FFh, as usual. Bank 0 addresses below 5Fh can still be addressed by using the BSR. Access Bank 00h 80h FFh 7Fh Bank 0 SFRs Bank 1 “Window” Bank 0 Bank 0 Window Example Situation: 07Fh 120h 17Fh 5Fh Bank 1 © 2008 Microchip Technology Inc. DS39631E-page 73 PIC18F2420/2520/4420/4520 6.0 FLASH PROGRAM MEMORY The Flash program memory is readable, writable and erasable during normal operation over the entire VDD range. A read from program memory is executed on one byte at a time. A write to program memory is executed on blocks of 32 bytes at a time. Program memory is erased in blocks of 64 bytes at a time. A bulk erase operation may not be issued from user code. Writing or erasing program memory will cease instruction fetches until the operation is complete. The program memory cannot be accessed during the write or erase, therefore, code cannot execute. An internal programming timer terminates program memory writes and erases. A value written to program memory does not need to be a valid instruction. Executing a program memory location that forms an invalid instruction results in a NOP. 6.1 Table Reads and Table Writes In order to read and write program memory, there are two operations that allow the processor to move bytes between the program memory space and the data RAM: • Table Read (TBLRD) • Table Write (TBLWT) The program memory space is 16 bits wide, while the data RAM space is 8 bits wide. Table reads and table writes move data between these two memory spaces through an 8-bit register (TABLAT). Table read operations retrieve data from program memory and places it into the data RAM space. Figure 6-1 shows the operation of a table read with program memory and data RAM. Table write operations store data from the data memory space into holding registers in program memory. The procedure to write the contents of the holding registers into program memory is detailed in Section 6.5 “Writing to Flash Program Memory”. Figure 6-2 shows the operation of a table write with program memory and data RAM. Table operations work with byte entities. A table block containing data, rather than program instructions, is not required to be word aligned. Therefore, a table block can start and end at any byte address. If a table write is being used to write executable code into program memory, program instructions will need to be word aligned. FIGURE 6-1: TABLE READ OPERATION Table Pointer(1) Table Latch (8-bit) Program Memory TBLPTRH TBLPTRL TABLAT TBLPTRU Instruction: TBLRD* Note 1: The Table Pointer register points to a byte in program memory. Program Memory (TBLPTR) PIC18F2420/2520/4420/4520 DS39631E-page 74 © 2008 Microchip Technology Inc. FIGURE 6-2: TABLE WRITE OPERATION 6.2 Control Registers Several control registers are used in conjunction with the TBLRD and TBLWT instructions. These include the: • EECON1 register • EECON2 register • TABLAT register • TBLPTR registers 6.2.1 EECON1 AND EECON2 REGISTERS The EECON1 register (Register 6-1) is the control register for memory accesses. The EECON2 register is not a physical register; it is used exclusively in the memory write and erase sequences. Reading EECON2 will read all ‘0’s. The EEPGD control bit determines if the access will be a program or data EEPROM memory access. When clear, any subsequent operations will operate on the data EEPROM memory. When set, any subsequent operations will operate on the program memory. The CFGS control bit determines if the access will be to the Configuration/Calibration registers or to program memory/data EEPROM memory. When set, subsequent operations will operate on Configuration registers regardless of EEPGD (see Section 23.0 “Special Features of the CPU”). When clear, memory selection access is determined by EEPGD. The FREE bit, when set, will allow a program memory erase operation. When FREE is set, the erase operation is initiated on the next WR command. When FREE is clear, only writes are enabled. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set in hardware when the WR bit is set and cleared when the internal programming timer expires and the write operation is complete. The WR control bit initiates write operations. The bit cannot be cleared, only set, in software; it is cleared in hardware at the completion of the write operation. Table Pointer(1) Table Latch (8-bit) TBLPTRH TBLPTRL TABLAT Program Memory (TBLPTR) TBLPTRU Instruction: TBLWT* Note1: The Table Pointer actually points to one of 32 holding registers, the address of which is determined by TBLPTRL<4:0>. The process for physically writing data to the program memory array is discussed in Section 6.5 “Writing to Flash Program Memory”. Holding Registers Program Memory Note: During normal operation, the WRERR is read as ‘1’. This can indicate that a write operation was prematurely terminated by a Reset, or a write operation was attempted improperly. Note: The EEIF interrupt flag bit (PIR2<4>) is set when the write is complete. It must be cleared in software. © 2008 Microchip Technology Inc. DS39631E-page 75 PIC18F2420/2520/4420/4520 REGISTER 6-1: EECON1: EEPROM CONTROL REGISTER 1 R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0 EEPGD CFGS — FREE WRERR(1) WREN WR RD bit 7 bit 0 Legend: S = Settable bit (cannot be cleared in software) R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit 1 = Access Flash program memory 0 = Access data EEPROM memory bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit 1 = Access Configuration registers 0 = Access Flash program or data EEPROM memory bit 5 Unimplemented: Read as ‘0’ bit 4 FREE: Flash Row Erase Enable bit 1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by completion of erase operation) 0 = Perform write only bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit(1) 1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal operation, or an improper write attempt) 0 = The write operation completed bit 2 WREN: Flash Program/Data EEPROM Write Enable bit 1 = Allows write cycles to Flash program/data EEPROM 0 = Inhibits write cycles to Flash program/data EEPROM bit 1 WR: Write Control bit 1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle (The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.) 0 = Does not initiate an EEPROM read Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error condition. PIC18F2420/2520/4420/4520 DS39631E-page 76 © 2008 Microchip Technology Inc. 6.2.2 TABLAT – TABLE LATCH REGISTER The Table Latch (TABLAT) is an 8-bit register mapped into the SFR space. The Table Latch register is used to hold 8-bit data during data transfers between program memory and data RAM. 6.2.3 TBLPTR – TABLE POINTER REGISTER The Table Pointer (TBLPTR) register addresses a byte within the program memory. The TBLPTR is comprised of three SFR registers: Table Pointer Upper Byte, Table Pointer High Byte and Table Pointer Low Byte (TBLPTRU:TBLPTRH:TBLPTRL). These three registers join to form a 22-bit wide pointer. The low-order 21 bits allow the device to address up to 2 Mbytes of program memory space. The 22nd bit allows access to the device ID, the user ID and the Configuration bits. The Table Pointer register, TBLPTR, is used by the TBLRD and TBLWT instructions. These instructions can update the TBLPTR in one of four ways based on the table operation. These operations are shown in Table 6-1. These operations on the TBLPTR only affect the low-order 21 bits. 6.2.4 TABLE POINTER BOUNDARIES TBLPTR is used in reads, writes and erases of the Flash program memory. When a TBLRD is executed, all 22 bits of the TBLPTR determine which byte is read from program memory into TABLAT. When a TBLWT is executed, the five LSbs of the Table Pointer register (TBLPTR<4:0>) determine which of the 32 program memory holding registers is written to. When the timed write to program memory begins (via the WR bit), the 16 MSbs of the TBLPTR (TBLPTR<21:6>) determine which program memory block of 32 bytes is written to. For more detail, see Section 6.5 “Writing to Flash Program Memory”. When an erase of program memory is executed, the 16 MSbs of the Table Pointer register (TBLPTR<21:6>) point to the 64-byte block that will be erased. The Least Significant bits (TBLPTR<5:0>) are ignored. Figure 6-3 describes the relevant boundaries of TBLPTR based on Flash program memory operations. TABLE 6-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS FIGURE 6-3: TABLE POINTER BOUNDARIES BASED ON OPERATION Example Operation on Table Pointer TBLRD* TBLWT* TBLPTR is not modified TBLRD*+ TBLWT*+ TBLPTR is incremented after the read/write TBLRD*- TBLWT*- TBLPTR is decremented after the read/write TBLRD+* TBLWT+* TBLPTR is incremented before the read/write 21 16 15 8 7 0 TABLE ERASE TABLE READ – TBLPTR<21:0> TBLPTRU TBLPTRH TBLPTRL TBLPTR<21:6> TABLE WRITE – TBLPTR<21:5> © 2008 Microchip Technology Inc. DS39631E-page 77 PIC18F2420/2520/4420/4520 6.3 Reading the Flash Program Memory The TBLRD instruction is used to retrieve data from program memory and places it into data RAM. Table reads from program memory are performed one byte at a time. TBLPTR points to a byte address in program space. Executing TBLRD places the byte pointed to into TABLAT. In addition, TBLPTR can be modified automatically for the next table read operation. The internal program memory is typically organized by words. The Least Significant bit of the address selects between the high and low bytes of the word. Figure 6-4 shows the interface between the internal program memory and the TABLAT. FIGURE 6-4: READS FROM FLASH PROGRAM MEMORY EXAMPLE 6-1: READING A FLASH PROGRAM MEMORY WORD (Even Byte Address) Program Memory (Odd Byte Address) TBLRD TABLAT TBLPTR = xxxxx1 FETCH Instruction Register (IR) Read Register TBLPTR = xxxxx0 MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base MOVWF TBLPTRU ; address of the word MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL READ_WORD TBLRD*+ ; read into TABLAT and increment MOVF TABLAT, W ; get data MOVWF WORD_EVEN TBLRD*+ ; read into TABLAT and increment MOVFW TABLAT, W ; get data MOVF WORD_ODD PIC18F2420/2520/4420/4520 DS39631E-page 78 © 2008 Microchip Technology Inc. 6.4 Erasing Flash Program Memory The minimum erase block is 32 words or 64 bytes. Only through the use of an external programmer, or through ICSP control, can larger blocks of program memory be bulk erased. Word erase in the Flash array is not supported. When initiating an erase sequence from the microcontroller itself, a block of 64 bytes of program memory is erased. The Most Significant 16 bits of the TBLPTR<21:6> point to the block being erased. TBLPTR<5:0> are ignored. The EECON1 register commands the erase operation. The EEPGD bit must be set to point to the Flash program memory. The WREN bit must be set to enable write operations. The FREE bit is set to select an erase operation. For protection, the write initiate sequence for EECON2 must be used. A long write is necessary for erasing the internal Flash. Instruction execution is halted while in a long write cycle. The long write will be terminated by the internal programming timer. 6.4.1 FLASH PROGRAM MEMORY ERASE SEQUENCE The sequence of events for erasing a block of internal program memory location is: 1. Load Table Pointer register with address of row being erased. 2. Set the EECON1 register for the erase operation: • set EEPGD bit to point to program memory; • clear the CFGS bit to access program memory; • set WREN bit to enable writes; • set FREE bit to enable the erase. 3. Disable interrupts. 4. Write 55h to EECON2. 5. Write 0AAh to EECON2. 6. Set the WR bit. This will begin the row erase cycle. 7. The CPU will stall for duration of the erase (about 2 ms using internal timer). 8. Re-enable interrupts. EXAMPLE 6-2: ERASING A FLASH PROGRAM MEMORY ROW MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL ERASE_ROW BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BSF EECON1, FREE ; enable Row Erase operation BCF INTCON, GIE ; disable interrupts Required MOVLW 55h Sequence MOVWF EECON2 ; write 55h MOVLW 0AAh MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start erase (CPU stall) BSF INTCON, GIE ; re-enable interrupts © 2008 Microchip Technology Inc. DS39631E-page 79 PIC18F2420/2520/4420/4520 6.5 Writing to Flash Program Memory The minimum programming block is 16 words or 32 bytes. Word or byte programming is not supported. Table writes are used internally to load the holding registers needed to program the Flash memory. There are 32 holding registers used by the table writes for programming. Since the Table Latch (TABLAT) is only a single byte, the TBLWT instruction may need to be executed 32 times for each programming operation. All of the table write operations will essentially be short writes because only the holding registers are written. At the end of updating the 32 holding registers, the EECON1 register must be written to in order to start the programming operation with a long write. The long write is necessary for programming the internal Flash. Instruction execution is halted while in a long write cycle. The long write will be terminated by the internal programming timer. The EEPROM on-chip timer controls the write time. The write/erase voltages are generated by an on-chip charge pump, rated to operate over the voltage range of the device. FIGURE 6-5: TABLE WRITES TO FLASH PROGRAM MEMORY 6.5.1 FLASH PROGRAM MEMORY WRITE SEQUENCE The sequence of events for programming an internal program memory location should be: 1. Read 64 bytes into RAM. 2. Update data values in RAM as necessary. 3. Load Table Pointer register with address being erased. 4. Execute the row erase procedure. 5. Load Table Pointer register with address of first byte being written. 6. Write the 32 bytes into the holding registers with auto-increment. 7. Set the EECON1 register for the write operation: • set EEPGD bit to point to program memory; • clear the CFGS bit to access program memory; • set WREN to enable byte writes. 8. Disable interrupts. 9. Write 55h to EECON2. 10. Write 0AAh to EECON2. 11. Set the WR bit. This will begin the write cycle. 12. The CPU will stall for duration of the write (about 2 ms using internal timer). 13. Re-enable interrupts. 14. Verify the memory (table read). This procedure will require about 6 ms to update one row of 64 bytes of memory. An example of the required code is given in Example 6-3. Note: The default value of the holding registers on device Resets and after write operations is FFh. A write of FFh to a holding register does not modify that byte. This means individual bytes of program memory may be modified, provided that the change does not attempt to change any bit from a ‘0’ to a ‘1’. When modifying individual bytes, it is not necessary to load all 32 holding registers before executing a write operation. TABLAT TBLPTR = xxxxx0 TBLPTR = xxxxx1 TBLPTR = xxxx3F Write Register TBLPTR = xxxxx2 Program Memory Holding Register Holding Register Holding Register Holding Register 8 8 8 8 Note: Before setting the WR bit, the Table Pointer address needs to be within the intended address range of the 32 bytes in the holding register. PIC18F2420/2520/4420/4520 DS39631E-page 80 © 2008 Microchip Technology Inc. EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY MOVLW D'64 ; number of bytes in erase block MOVWF COUNTER MOVLW BUFFER_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW BUFFER_ADDR_LOW MOVWF FSR0L MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL READ_BLOCK TBLRD*+ ; read into TABLAT, and inc MOVF TABLAT, W ; get data MOVWF POSTINC0 ; store data DECFSZ COUNTER ; done? BRA READ_BLOCK ; repeat MODIFY_WORD MOVLW DATA_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW DATA_ADDR_LOW MOVWF FSR0L MOVLW NEW_DATA_LOW ; update buffer word MOVWF POSTINC0 MOVLW NEW_DATA_HIGH MOVWF INDF0 ERASE_BLOCK MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BSF EECON1, FREE ; enable Row Erase operation BCF INTCON, GIE ; disable interrupts MOVLW 55h Required MOVWF EECON2 ; write 55h Sequence MOVLW 0AAh MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start erase (CPU stall) BSF INTCON, GIE ; re-enable interrupts TBLRD*- ; dummy read decrement MOVLW BUFFER_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW BUFFER_ADDR_LOW MOVWF FSR0L WRITE_BUFFER_BACK MOVLW D’32 ; number of bytes in holding register MOVWF COUNTER WRITE_BYTE_TO_HREGS MOVFF POSTINC0, WREG ; get low byte of buffer data MOVWF TABLAT ; present data to table latch TBLWT+* ; write data, perform a short write ; to internal TBLWT holding register. DECFSZ COUNTER ; loop until buffers are full BRA WRITE_WORD_TO_HREGS © 2008 Microchip Technology Inc. DS39631E-page 81 PIC18F2420/2520/4420/4520 EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY (CONTINUED) 6.5.2 WRITE VERIFY Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. 6.5.3 UNEXPECTED TERMINATION OF WRITE OPERATION If a write is terminated by an unplanned event, such as loss of power or an unexpected Reset, the memory location just programmed should be verified and reprogrammed if needed. If the write operation is interrupted by a MCLR Reset or a WDT Time-out Reset during normal operation, the user can check the WRERR bit and rewrite the location(s) as needed. 6.5.4 PROTECTION AGAINST SPURIOUS WRITES To protect against spurious writes to Flash program memory, the write initiate sequence must also be followed. See Section 23.0 “Special Features of the CPU” for more detail. 6.6 Flash Program Operation During Code Protection See Section 23.5 “Program Verification and Code Protection” for details on code protection of Flash program memory. TABLE 6-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY PROGRAM_MEMORY BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BCF INTCON, GIE ; disable interrupts MOVLW 55h Required MOVWF EECON2 ; write 55h Sequence MOVLW 0AAh MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start program (CPU stall) BSF INTCON, GIE ; re-enable interrupts BCF EECON1, WREN ; disable write to memory Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page TBLPTRU — — bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) 49 TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 49 TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 49 TABLAT Program Memory Table Latch 49 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 EECON2 EEPROM Control Register 2 (not a physical register) 51 EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 51 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access. PIC18F2420/2520/4420/4520 DS39631E-page 82 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 83 PIC18F2420/2520/4420/4520 7.0 DATA EEPROM MEMORY The data EEPROM is a nonvolatile memory array, separate from the data RAM and program memory, that is used for long-term storage of program data. It is not directly mapped in either the register file or program memory space but is indirectly addressed through the Special Function Registers (SFRs). The EEPROM is readable and writable during normal operation over the entire VDD range. Five SFRs are used to read and write to the data EEPROM as well as the program memory. They are: • EECON1 • EECON2 • EEDATA • EEADR The data EEPROM allows byte read and write. When interfacing to the data memory block, EEDATA holds the 8-bit data for read/write and the EEADR register holds the address of the EEPROM location being accessed. The EEPROM data memory is rated for high erase/write cycle endurance. A byte write automatically erases the location and writes the new data (erase-before-write). The write time is controlled by an on-chip timer; it will vary with voltage and temperature as well as from chip to chip. Please refer to parameter D122 (Table 26-1 in Section 26.0 “Electrical Characteristics”) for exact limits. 7.1 EEADR Register The EEADR register is used to address the data EEPROM for read and write operations. The 8-bit range of the register can address a memory range of 256 bytes (00h to FFh). 7.2 EECON1 and EECON2 Registers Access to the data EEPROM is controlled by two registers: EECON1 and EECON2. These are the same registers which control access to the program memory and are used in a similar manner for the data EEPROM. The EECON1 register (Register 7-1) is the control register for data and program memory access. Control bit EEPGD determines if the access will be to program or data EEPROM memory. When clear, operations will access the data EEPROM memory. When set, program memory is accessed. Control bit, CFGS, determines if the access will be to the Configuration registers or to program memory/data EEPROM memory. When set, subsequent operations access Configuration registers. When CFGS is clear, the EEPGD bit selects either program Flash or data EEPROM memory. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set in hardware when the WR bit is set and cleared when the internal programming timer expires and the write operation is complete. The WR control bit initiates write operations. The bit can be set but not cleared in software. It is only cleared in hardware at the completion of the write operation. Control bits, RD and WR, start read and erase/write operations, respectively. These bits are set by firmware and cleared by hardware at the completion of the operation. The RD bit cannot be set when accessing program memory (EEPGD = 1). Program memory is read using table read instructions. See Section 6.1 “Table Reads and Table Writes” regarding table reads. The EECON2 register is not a physical register. It is used exclusively in the memory write and erase sequences. Reading EECON2 will read all ‘0’s. Note: During normal operation, the WRERR may read as ‘1’. This can indicate that a write operation was prematurely terminated by a Reset, or a write operation was attempted improperly. Note: The EEIF interrupt flag bit (PIR2<4>) is set when the write is complete. It must be cleared in software. PIC18F2420/2520/4420/4520 DS39631E-page 84 © 2008 Microchip Technology Inc. REGISTER 7-1: EECON1: EEPROM CONTROL REGISTER 1 R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0 EEPGD CFGS — FREE WRERR(1) WREN WR RD bit 7 bit 0 Legend: S = Settable bit (cannot be cleared in software) R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit 1 = Access Flash program memory 0 = Access data EEPROM memory bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit 1 = Access Configuration registers 0 = Access Flash program or data EEPROM memory bit 5 Unimplemented: Read as ‘0’ bit 4 FREE: Flash Row Erase Enable bit 1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by completion of erase operation) 0 = Perform write only bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit(1) 1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal operation, or an improper write attempt) 0 = The write operation completed bit 2 WREN: Flash Program/Data EEPROM Write Enable bit 1 = Allows write cycles to Flash program/data EEPROM 0 = Inhibits write cycles to Flash program/data EEPROM bit 1 WR: Write Control bit 1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle (The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.) 0 = Does not initiate an EEPROM read Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error condition. © 2008 Microchip Technology Inc. DS39631E-page 85 PIC18F2420/2520/4420/4520 7.3 Reading the Data EEPROM Memory To read a data memory location, the user must write the address to the EEADR register, clear the EEPGD control bit (EECON1<7>) and then set control bit, RD (EECON1<0>). The data is available on the very next instruction cycle; therefore, the EEDATA register can be read by the next instruction. EEDATA will hold this value until another read operation, or until it is written to by the user (during a write operation). The basic process is shown in Example 7-1. 7.4 Writing to the Data EEPROM Memory To write an EEPROM data location, the address must first be written to the EEADR register and the data written to the EEDATA register. The sequence in Example 7-2 must be followed to initiate the write cycle. The write will not begin if this sequence is not exactly followed (write 55h to EECON2, write 0AAh to EECON2, then set WR bit) for each byte. It is strongly recommended that interrupts be disabled during this code segment. Additionally, the WREN bit in EECON1 must be set to enable writes. This mechanism prevents accidental writes to data EEPROM due to unexpected code execution (i.e., runaway programs). The WREN bit should be kept clear at all times, except when updating the EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, EECON1, EEADR and EEDATA cannot be modified. The WR bit will be inhibited from being set unless the WREN bit is set. Both WR and WREN cannot be set with the same instruction. At the completion of the write cycle, the WR bit is cleared in hardware and the EEPROM Interrupt Flag bit, EEIF, is set. The user may either enable this interrupt or poll this bit. EEIF must be cleared by software. 7.5 Write Verify Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. EXAMPLE 7-1: DATA EEPROM READ EXAMPLE 7-2: DATA EEPROM WRITE MOVLW DATA_EE_ADDR ; MOVWF EEADR ; Data Memory Address to read BCF EECON1, EEPGD ; Point to DATA memory BCF EECON1, CFGS ; Access EEPROM BSF EECON1, RD ; EEPROM Read MOVF EEDATA, W ; W = EEDATA MOVLW DATA_EE_ADDR ; MOVWF EEADR ; Data Memory Address to write MOVLW DATA_EE_DATA ; MOVWF EEDATA ; Data Memory Value to write BCF EECON1, EEPGD ; Point to DATA memory BCF EECON1, CFGS ; Access EEPROM BSF EECON1, WREN ; Enable writes BCF INTCON, GIE ; Disable Interrupts MOVLW 55h ; Required MOVWF EECON2 ; Write 55h Sequence MOVLW 0AAh ; MOVWF EECON2 ; Write 0AAh BSF EECON1, WR ; Set WR bit to begin write BSF INTCON, GIE ; Enable Interrupts ; User code execution BCF EECON1, WREN ; Disable writes on write complete (EEIF set) PIC18F2420/2520/4420/4520 DS39631E-page 86 © 2008 Microchip Technology Inc. 7.6 Operation During Code-Protect Data EEPROM memory has its own code-protect bits in Configuration Words. External read and write operations are disabled if code protection is enabled. The microcontroller itself can both read and write to the internal data EEPROM, regardless of the state of the code-protect Configuration bit. Refer to Section 23.0 “Special Features of the CPU” for additional information. 7.7 Protection Against Spurious Write There are conditions when the user may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been implemented. On power-up, the WREN bit is cleared. In addition, writes to the EEPROM are blocked during the Power-up Timer period (TPWRT, parameter 33). The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch or software malfunction. 7.8 Using the Data EEPROM The data EEPROM is a high-endurance, byte addressable array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). Frequently changing values will typically be updated more often than specification D124. If this is not the case, an array refresh must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory. A simple data EEPROM refresh routine is shown in Example 7-3. EXAMPLE 7-3: DATA EEPROM REFRESH ROUTINE Note: If data EEPROM is only used to store constants and/or data that changes rarely, an array refresh is likely not required. See specification D124. CLRF EEADR ; Start at address 0 BCF EECON1, CFGS ; Set for memory BCF EECON1, EEPGD ; Set for Data EEPROM BCF INTCON, GIE ; Disable interrupts BSF EECON1, WREN ; Enable writes Loop ; Loop to refresh array BSF EECON1, RD ; Read current address MOVLW 55h ; MOVWF EECON2 ; Write 55h MOVLW 0AAh ; MOVWF EECON2 ; Write 0AAh BSF EECON1, WR ; Set WR bit to begin write BTFSC EECON1, WR ; Wait for write to complete BRA $-2 INCFSZ EEADR, F ; Increment address BRA LOOP ; Not zero, do it again BCF EECON1, WREN ; Disable writes BSF INTCON, GIE ; Enable interrupts © 2008 Microchip Technology Inc. DS39631E-page 87 PIC18F2420/2520/4420/4520 TABLE 7-1: REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 EEADR EEPROM Address Register 51 EEDATA EEPROM Data Register 51 EECON2 EEPROM Control Register 2 (not a physical register) 51 EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 51 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access. PIC18F2420/2520/4420/4520 DS39631E-page 88 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 89 PIC18F2420/2520/4420/4520 8.0 8 x 8 HARDWARE MULTIPLIER 8.1 Introduction All PIC18 devices include an 8 x 8 hardware multiplier as part of the ALU. The multiplier performs an unsigned operation and yields a 16-bit result that is stored in the product register pair, PRODH:PRODL. The multiplier’s operation does not affect any flags in the STATUS register. Making multiplication a hardware operation allows it to be completed in a single instruction cycle. This has the advantages of higher computational throughput and reduced code size for multiplication algorithms and allows the PIC18 devices to be used in many applications previously reserved for digital signal processors. A comparison of various hardware and software multiply operations, along with the savings in memory and execution time, is shown in Table 8-1. 8.2 Operation Example 8-1 shows the instruction sequence for an 8 x 8 unsigned multiplication. Only one instruction is required when one of the arguments is already loaded in the WREG register. Example 8-2 shows the sequence to do an 8 x 8 signed multiplication. To account for the sign bits of the arguments, each argument’s Most Significant bit (MSb) is tested and the appropriate subtractions are done. EXAMPLE 8-1: 8 x 8 UNSIGNED MULTIPLY ROUTINE EXAMPLE 8-2: 8 x 8 SIGNED MULTIPLY ROUTINE TABLE 8-1: PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS MOVF ARG1, W ; MULWF ARG2 ; ARG1 * ARG2 -> ; PRODH:PRODL MOVF ARG1, W MULWF ARG2 ; ARG1 * ARG2 -> ; PRODH:PRODL BTFSC ARG2, SB ; Test Sign Bit SUBWF PRODH, F ; PRODH = PRODH ; - ARG1 MOVF ARG2, W BTFSC ARG1, SB ; Test Sign Bit SUBWF PRODH, F ; PRODH = PRODH ; - ARG2 Routine Multiply Method Program Memory (Words) Cycles (Max) Time @ 40 MHz @ 10 MHz @ 4 MHz 8 x 8 unsigned Without hardware multiply 13 69 6.9 μs 27.6 μs 69 μs Hardware multiply 1 1 100 ns 400 ns 1 μs 8 x 8 signed Without hardware multiply 33 91 9.1 μs 36.4 μs 91 μs Hardware multiply 6 6 600 ns 2.4 μs 6 μs 16 x 16 unsigned Without hardware multiply 21 242 24.2 μs 96.8 μs 242 μs Hardware multiply 28 28 2.8 μs 11.2 μs 28 μs 16 x 16 signed Without hardware multiply 52 254 25.4 μs 102.6 μs 254 μs Hardware multiply 35 40 4.0 μs 16.0 μs 40 μs PIC18F2420/2520/4420/4520 DS39631E-page 90 © 2008 Microchip Technology Inc. Example 8-3 shows the sequence to do a 16 x 16 unsigned multiplication. Equation 8-1 shows the algorithm that is used. The 32-bit result is stored in four registers (RES<3:0>). EQUATION 8-1: 16 x 16 UNSIGNED MULTIPLICATION ALGORITHM EXAMPLE 8-3: 16 x 16 UNSIGNED MULTIPLY ROUTINE Example 8-4 shows the sequence to do a 16 x 16 signed multiply. Equation 8-2 shows the algorithm used. The 32-bit result is stored in four registers (RES<3:0>). To account for the sign bits of the arguments, the MSb for each argument pair is tested and the appropriate subtractions are done. EQUATION 8-2: 16 x 16 SIGNED MULTIPLICATION ALGORITHM EXAMPLE 8-4: 16 x 16 SIGNED MULTIPLY ROUTINE RES<3:0> = ARG1H:ARG1L • ARG2H:ARG2L = (ARG1H • ARG2H • 216) + (ARG1H • ARG2L • 28) + (ARG1L • ARG2H • 28) + (ARG1L • ARG2L) MOVF ARG1L, W MULWF ARG2L ; ARG1L * ARG2L-> ; PRODH:PRODL MOVFF PRODH, RES1 ; MOVFF PRODL, RES0 ; ; MOVF ARG1H, W MULWF ARG2H ; ARG1H * ARG2H-> ; PRODH:PRODL MOVFF PRODH, RES3 ; MOVFF PRODL, RES2 ; ; MOVF ARG1L, W MULWF ARG2H ; ARG1L * ARG2H-> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; ; MOVF ARG1H, W ; MULWF ARG2L ; ARG1H * ARG2L-> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; RES<3:0> = ARG1H:ARG1L • ARG2H:ARG2L = (ARG1H • ARG2H • 216) + (ARG1H • ARG2L • 28) + (ARG1L • ARG2H • 28) + (ARG1L • ARG2L) + (-1 • ARG2H<7> • ARG1H:ARG1L • 216) + (-1 • ARG1H<7> • ARG2H:ARG2L • 216) MOVF ARG1L, W MULWF ARG2L ; ARG1L * ARG2L -> ; PRODH:PRODL MOVFF PRODH, RES1 ; MOVFF PRODL, RES0 ; ; MOVF ARG1H, W MULWF ARG2H ; ARG1H * ARG2H -> ; PRODH:PRODL MOVFF PRODH, RES3 ; MOVFF PRODL, RES2 ; ; MOVF ARG1L, W MULWF ARG2H ; ARG1L * ARG2H -> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; ; MOVF ARG1H, W ; MULWF ARG2L ; ARG1H * ARG2L -> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; ; BTFSS ARG2H, 7 ; ARG2H:ARG2L neg? BRA SIGN_ARG1 ; no, check ARG1 MOVF ARG1L, W ; SUBWF RES2 ; MOVF ARG1H, W ; SUBWFB RES3 ; SIGN_ARG1 BTFSS ARG1H, 7 ; ARG1H:ARG1L neg? BRA CONT_CODE ; no, done MOVF ARG2L, W ; SUBWF RES2 ; MOVF ARG2H, W ; SUBWFB RES3 ; CONT_CODE : © 2008 Microchip Technology Inc. DS39631E-page 91 PIC18F2420/2520/4420/4520 9.0 INTERRUPTS The PIC18F2420/2520/4420/4520 devices have multiple interrupt sources and an interrupt priority feature that allows most interrupt sources to be assigned a high-priority level or a low-priority level. The high-priority interrupt vector is at 0008h and the lowpriority interrupt vector is at 0018h. High-priority interrupt events will interrupt any low-priority interrupts that may be in progress. There are ten registers which are used to control interrupt operation. These registers are: • RCON • INTCON • INTCON2 • INTCON3 • PIR1, PIR2 • PIE1, PIE2 • IPR1, IPR2 It is recommended that the Microchip header files supplied with MPLAB® IDE be used for the symbolic bit names in these registers. This allows the assembler/ compiler to automatically take care of the placement of these bits within the specified register. In general, interrupt sources have three bits to control their operation. They are: • Flag bit to indicate that an interrupt event occurred • Enable bit that allows program execution to branch to the interrupt vector address when the flag bit is set • Priority bit to select high priority or low priority The interrupt priority feature is enabled by setting the IPEN bit (RCON<7>). When interrupt priority is enabled, there are two bits which enable interrupts globally. Setting the GIEH bit (INTCON<7>) enables all interrupts that have the priority bit set (high priority). Setting the GIEL bit (INTCON<6>) enables all interrupts that have the priority bit cleared (low priority). When the interrupt flag, enable bit and appropriate global interrupt enable bit are set, the interrupt will vector immediately to address 0008h or 0018h, depending on the priority bit setting. Individual interrupts can be disabled through their corresponding enable bits. When the IPEN bit is cleared (default state), the interrupt priority feature is disabled and interrupts are compatible with PIC® mid-range devices. In Compatibility mode, the interrupt priority bits for each source have no effect. INTCON<6> is the PEIE bit, which enables/disables all peripheral interrupt sources. INTCON<7> is the GIE bit, which enables/disables all interrupt sources. All interrupts branch to address 0008h in Compatibility mode. When an interrupt is responded to, the global interrupt enable bit is cleared to disable further interrupts. If the IPEN bit is cleared, this is the GIE bit. If interrupt priority levels are used, this will be either the GIEH or GIEL bit. High-priority interrupt sources can interrupt a lowpriority interrupt. Low-priority interrupts are not processed while high-priority interrupts are in progress. The return address is pushed onto the stack and the PC is loaded with the interrupt vector address (0008h or 0018h). Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bits must be cleared in software before re-enabling interrupts to avoid recursive interrupts. The “return from interrupt” instruction, RETFIE, exits the interrupt routine and sets the GIE bit (GIEH or GIEL if priority levels are used), which re-enables interrupts. For external interrupt events, such as the INTx pins or the PORTB input change interrupt, the interrupt latency will be three to four instruction cycles. The exact latency is the same for one or two-cycle instructions. Individual interrupt flag bits are set, regardless of the status of their corresponding enable bit or the GIE bit. Note: Do not use the MOVFF instruction to modify any of the interrupt control registers while any interrupt is enabled. Doing so may cause erratic microcontroller behavior. PIC18F2420/2520/4420/4520 DS39631E-page 92 © 2008 Microchip Technology Inc. FIGURE 9-1: PIC18 INTERRUPT LOGIC TMR0IE GIE/GIEH PEIE/GIEL Wake-up if in Interrupt to CPU Vector to Location 0008h INT2IF INT2IE INT2IP INT1IF INT1IE INT1IP TMR0IF TMR0IE TMR0IP RBIF RBIE RBIP IPEN TMR0IF TMR0IP INT1IF INT1IE INT1IP INT2IF INT2IE INT2IP RBIF RBIE RBIP INT0IF INT0IE PEIE/GIE Interrupt to CPU Vector to Location IPEN IPEN 0018h SSPIF SSPIE SSPIP SSPIF SSPIE SSPIP ADIF ADIE ADIP RCIF RCIE RCIP Additional Peripheral Interrupts ADIF ADIE ADIP High-Priority Interrupt Generation Low-Priority Interrupt Generation RCIF RCIE RCIP Additional Peripheral Interrupts Idle or Sleep modes GIE/GIEH © 2008 Microchip Technology Inc. DS39631E-page 93 PIC18F2420/2520/4420/4520 9.1 INTCON Registers The INTCON registers are readable and writable registers, which contain various enable, priority and flag bits. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. REGISTER 9-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GIE/GIEH: Global Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked interrupts 0 = Disables all interrupts When IPEN = 1: 1 = Enables all high-priority interrupts 0 = Disables all interrupts bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts When IPEN = 1: 1 = Enables all low-priority peripheral interrupts 0 = Disables all low-priority peripheral interrupts bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 overflow interrupt 0 = Disables the TMR0 overflow interrupt bit 4 INT0IE: INT0 External Interrupt Enable bit 1 = Enables the INT0 external interrupt 0 = Disables the INT0 external interrupt bit 3 RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INT0IF: INT0 External Interrupt Flag bit 1 = The INT0 external interrupt occurred (must be cleared in software) 0 = The INT0 external interrupt did not occur bit 0 RBIF: RB Port Change Interrupt Flag bit(1) 1 = At least one of the RB<7:4> pins changed state (must be cleared in software) 0 = None of the RB<7:4> pins have changed state Note 1: A mismatch condition will continue to set this bit. Reading PORTB will end the mismatch condition and allow the bit to be cleared. PIC18F2420/2520/4420/4520 DS39631E-page 94 © 2008 Microchip Technology Inc. REGISTER 9-2: INTCON2: INTERRUPT CONTROL REGISTER 2 R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 U-0 R/W-1 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RBPU: PORTB Pull-up Enable bit 1 = All PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values bit 6 INTEDG0: External Interrupt 0 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 5 INTEDG1: External Interrupt 1 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 4 INTEDG2: External Interrupt 2 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 3 Unimplemented: Read as ‘0’ bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 Unimplemented: Read as ‘0’ bit 0 RBIP: RB Port Change Interrupt Priority bit 1 = High priority 0 = Low priority Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. © 2008 Microchip Technology Inc. DS39631E-page 95 PIC18F2420/2520/4420/4520 REGISTER 9-3: INTCON3: INTERRUPT CONTROL REGISTER 3 R/W-1 R/W-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 INT2IP: INT2 External Interrupt Priority bit 1 = High priority 0 = Low priority bit 6 INT1IP: INT1 External Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 Unimplemented: Read as ‘0’ bit 4 INT2IE: INT2 External Interrupt Enable bit 1 = Enables the INT2 external interrupt 0 = Disables the INT2 external interrupt bit 3 INT1IE: INT1 External Interrupt Enable bit 1 = Enables the INT1 external interrupt 0 = Disables the INT1 external interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 INT2IF: INT2 External Interrupt Flag bit 1 = The INT2 external interrupt occurred (must be cleared in software) 0 = The INT2 external interrupt did not occur bit 0 INT1IF: INT1 External Interrupt Flag bit 1 = The INT1 external interrupt occurred (must be cleared in software) 0 = The INT1 external interrupt did not occur Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. PIC18F2420/2520/4420/4520 DS39631E-page 96 © 2008 Microchip Technology Inc. 9.2 PIR Registers The PIR registers contain the individual flag bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are two Peripheral Interrupt Request Flag registers (PIR1 and PIR2). Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE (INTCON<7>). 2: User software should ensure the appropriate interrupt flag bits are cleared prior to enabling an interrupt and after servicing that interrupt. REGISTER 9-4: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1 R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 PSPIF: Parallel Slave Port Read/Write Interrupt Flag bit(1) 1 = A read or a write operation has taken place (must be cleared in software) 0 = No read or write has occurred bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed (must be cleared in software) 0 = The A/D conversion is not complete bit 5 RCIF: EUSART Receive Interrupt Flag bit 1 = The EUSART receive buffer, RCREG, is full (cleared when RCREG is read) 0 = The EUSART receive buffer is empty bit 4 TXIF: EUSART Transmit Interrupt Flag bit 1 = The EUSART transmit buffer, TXREG, is empty (cleared when TXREG is written) 0 = The EUSART transmit buffer is full bit 3 SSPIF: Master Synchronous Serial Port Interrupt Flag bit 1 = The transmission/reception is complete (must be cleared in software) 0 = Waiting to transmit/receive bit 2 CCP1IF: CCP1 Interrupt Flag bit Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused in this mode. bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit 1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match occurred bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’. © 2008 Microchip Technology Inc. DS39631E-page 97 PIC18F2420/2520/4420/4520 REGISTER 9-5: PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit 1 = Device oscillator failed, clock input has changed to INTOSC (must be cleared in software) 0 = Device clock operating bit 6 CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed (must be cleared in software) 0 = Comparator input has not changed bit 5 Unimplemented: Read as ‘0’ bit 4 EEIF: Data EEPROM/Flash Write Operation Interrupt Flag bit 1 = The write operation is complete (must be cleared in software) 0 = The write operation is not complete or has not been started bit 3 BCLIF: Bus Collision Interrupt Flag bit 1 = A bus collision occurred (must be cleared in software) 0 = No bus collision occurred bit 2 HLVDIF: High/Low-Voltage Detect Interrupt Flag bit 1 = A high/low-voltage condition occurred (direction determined by VDIRMAG bit, HLVDCON<7>) 0 = A high/low-voltage condition has not occurred bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit 1 = TMR3 register overflowed (must be cleared in software) 0 = TMR3 register did not overflow bit 0 CCP2IF: CCP2 Interrupt Flag bit Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused in this mode. PIC18F2420/2520/4420/4520 DS39631E-page 98 © 2008 Microchip Technology Inc. 9.3 PIE Registers The PIE registers contain the individual enable bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are two Peripheral Interrupt Enable registers (PIE1 and PIE2). When IPEN = 0, the PEIE bit must be set to enable any of these peripheral interrupts. REGISTER 9-6: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit(1) 1 = Enables the PSP read/write interrupt 0 = Disables the PSP read/write interrupt bit 6 ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D interrupt 0 = Disables the A/D interrupt bit 5 RCIE: EUSART Receive Interrupt Enable bit 1 = Enables the EUSART receive interrupt 0 = Disables the EUSART receive interrupt bit 4 TXIE: EUSART Transmit Interrupt Enable bit 1 = Enables the EUSART transmit interrupt 0 = Disables the EUSART transmit interrupt bit 3 SSPIE: Master Synchronous Serial Port Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the TMR2 to PR2 match interrupt 0 = Disables the TMR2 to PR2 match interrupt bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’. © 2008 Microchip Technology Inc. DS39631E-page 99 PIC18F2420/2520/4420/4520 REGISTER 9-7: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit 1 = Enabled 0 = Disabled bit 6 CMIE: Comparator Interrupt Enable bit 1 = Enabled 0 = Disabled bit 5 Unimplemented: Read as ‘0’ bit 4 EEIE: Data EEPROM/Flash Write Operation Interrupt Enable bit 1 = Enabled 0 = Disabled bit 3 BCLIE: Bus Collision Interrupt Enable bit 1 = Enabled 0 = Disabled bit 2 HLVDIE: High/Low-Voltage Detect Interrupt Enable bit 1 = Enabled 0 = Disabled bit 1 TMR3IE: TMR3 Overflow Interrupt Enable bit 1 = Enabled 0 = Disabled bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = Enabled 0 = Disabled PIC18F2420/2520/4420/4520 DS39631E-page 100 © 2008 Microchip Technology Inc. 9.4 IPR Registers The IPR registers contain the individual priority bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are two Peripheral Interrupt Priority registers (IPR1 and IPR2). Using the priority bits requires that the Interrupt Priority Enable (IPEN) bit be set. REGISTER 9-8: IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 PSPIP: Parallel Slave Port Read/Write Interrupt Priority bit(1) 1 = High priority 0 = Low priority bit 6 ADIP: A/D Converter Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 RCIP: EUSART Receive Interrupt Priority bit 1 = High priority 0 = Low priority bit 4 TXIP: EUSART Transmit Interrupt Priority bit 1 = High priority 0 = Low priority bit 3 SSPIP: Master Synchronous Serial Port Interrupt Priority bit 1 = High priority 0 = Low priority bit 2 CCP1IP: CCP1 Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit 1 = High priority 0 = Low priority bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’. © 2008 Microchip Technology Inc. DS39631E-page 101 PIC18F2420/2520/4420/4520 REGISTER 9-9: IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 OSCFIP: Oscillator Fail Interrupt Priority bit 1 = High priority 0 = Low priority bit 6 CMIP: Comparator Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 Unimplemented: Read as ‘0’ bit 4 EEIP: Data EEPROM/Flash Write Operation Interrupt Priority bit 1 = High priority 0 = Low priority bit 3 BCLIP: Bus Collision Interrupt Priority bit 1 = High priority 0 = Low priority bit 2 HLVDIP: High/Low-Voltage Detect Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 TMR3IP: TMR3 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority bit 0 CCP2IP: CCP2 Interrupt Priority bit 1 = High priority 0 = Low priority PIC18F2420/2520/4420/4520 DS39631E-page 102 © 2008 Microchip Technology Inc. 9.5 RCON Register The RCON register contains flag bits which are used to determine the cause of the last Reset or wake-up from Idle or Sleep modes. RCON also contains the IPEN bit which enables interrupt priorities. The operation of the SBOREN bit and the Reset flag bits is discussed in more detail in Section 4.1 “RCON Register”. REGISTER 9-10: RCON: RESET CONTROL REGISTER R/W-0 R/W-1(1) U-0 R/W-1 R-1 R-1 R/W-0(1) R/W-0 IPEN SBOREN — RI TO PD POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode) bit 6 SBOREN: Software BOR Enable bit(1) For details of bit operation, see Register 4-1. bit 5 Unimplemented: Read as ‘0’ bit 4 RI: RESET Instruction Flag bit For details of bit operation, see Register 4-1. bit 3 TO: Watchdog Timer Time-out Flag bit For details of bit operation, see Register 4-1. bit 2 PD: Power-Down Detection Flag bit For details of bit operation, see Register 4-1. bit 1 POR: Power-on Reset Status bit(1) For details of bit operation, see Register 4-1. bit 0 BOR: Brown-out Reset Status bit For details of bit operation, see Register 4-1. Note 1: Actual Reset values are determined by device configuration and the nature of the device Reset. See Register 4-1 for additional information. © 2008 Microchip Technology Inc. DS39631E-page 103 PIC18F2420/2520/4420/4520 9.6 INTx Pin Interrupts External interrupts on the RB0/INT0, RB1/INT1 and RB2/INT2 pins are edge-triggered. If the corresponding INTEDGx bit in the INTCON2 register is set (= 1), the interrupt is triggered by a rising edge; if the bit is clear, the trigger is on the falling edge. When a valid edge appears on the RBx/INTx pin, the corresponding flag bit, INTxIF, is set. This interrupt can be disabled by clearing the corresponding enable bit, INTxIE. Flag bit, INTxIF, must be cleared in software in the Interrupt Service Routine before re-enabling the interrupt. All external interrupts (INT0, INT1 and INT2) can wakeup the processor from Idle or Sleep modes if bit INTxIE was set prior to going into those modes. If the Global Interrupt Enable bit, GIE, is set, the processor will branch to the interrupt vector following wake-up. Interrupt priority for INT1 and INT2 is determined by the value contained in the Interrupt Priority bits, INT1IP (INTCON3<6>) and INT2IP (INTCON3<7>). There is no priority bit associated with INT0. It is always a high-priority interrupt source. 9.7 TMR0 Interrupt In 8-bit mode (which is the default), an overflow in the TMR0 register (FFh → 00h) will set flag bit, TMR0IF. In 16-bit mode, an overflow in the TMR0H:TMR0L register pair (FFFFh → 0000h) will set TMR0IF. The interrupt can be enabled/disabled by setting/clearing enable bit, TMR0IE (INTCON<5>). Interrupt priority for Timer0 is determined by the value contained in the interrupt priority bit, TMR0IP (INTCON2<2>). See Section 11.0 “Timer0 Module” for further details on the Timer0 module. 9.8 PORTB Interrupt-on-Change An input change on PORTB<7:4> sets flag bit, RBIF (INTCON<0>). The interrupt can be enabled/disabled by setting/clearing enable bit, RBIE (INTCON<3>). Interrupt priority for PORTB interrupt-on-change is determined by the value contained in the interrupt priority bit, RBIP (INTCON2<0>). 9.9 Context Saving During Interrupts During interrupts, the return PC address is saved on the stack. Additionally, the WREG, STATUS and BSR registers are saved on the Fast Return Stack. If a fast return from interrupt is not used (see Section 5.3 “Data Memory Organization”), the user may need to save the WREG, STATUS and BSR registers on entry to the Interrupt Service Routine. Depending on the user’s application, other registers may also need to be saved. Example 9-1 saves and restores the WREG, STATUS and BSR registers during an Interrupt Service Routine. EXAMPLE 9-1: SAVING STATUS, WREG AND BSR REGISTERS IN RAM MOVWF W_TEMP ; W_TEMP is in virtual bank MOVFF STATUS, STATUS_TEMP ; STATUS_TEMP located anywhere MOVFF BSR, BSR_TEMP ; BSR_TMEP located anywhere ; ; USER ISR CODE ; MOVFF BSR_TEMP, BSR ; Restore BSR MOVF W_TEMP, W ; Restore WREG MOVFF STATUS_TEMP, STATUS ; Restore STATUS PIC18F2420/2520/4420/4520 DS39631E-page 104 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 105 PIC18F2420/2520/4420/4520 10.0 I/O PORTS Depending on the device selected and features enabled, there are up to five ports available. Some pins of the I/O ports are multiplexed with an alternate function from the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Each port has three registers for its operation. These registers are: • TRIS register (Data Direction register) • PORT register (reads the levels on the pins of the device) • LAT register (Data Latch register) The Data Latch (LAT register) is useful for read-modifywrite operations on the value that the I/O pins are driving. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 10-1. FIGURE 10-1: GENERIC I/O PORT OPERATION 10.1 PORTA, TRISA and LATA Registers PORTA is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISA. Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., put the contents of the output latch on the selected pin). Reading the PORTA register reads the status of the pins, whereas writing to it, will write to the port latch. The Data Latch (LATA) register is also memory mapped. Read-modify-write operations on the LATA register read and write the latched output value for PORTA. The RA4 pin is multiplexed with the Timer0 module clock input and one of the comparator outputs to become the RA4/T0CKI/C1OUT pin. Pins RA6 and RA7 are multiplexed with the main oscillator pins; they are enabled as oscillator or I/O pins by the selection of the main oscillator in the Configuration register (see Section 23.1 “Configuration Bits” for details). When they are not used as port pins, RA6 and RA7 and their associated TRIS and LAT bits are read as ‘0’. The other PORTA pins are multiplexed with analog inputs, the analog VREF+ and VREF- inputs and the comparator voltage reference output. The operation of pins RA<3:0> and RA5 as A/D Converter inputs is selected by clearing or setting the control bits in the ADCON1 register (A/D Control Register 1). Pins RA0 through RA5 may also be used as comparator inputs or outputs by setting the appropriate bits in the CMCON register. To use RA<3:0> as digital inputs, it is also necessary to turn off the comparators. The RA4/T0CKI/C1OUT pin is a Schmitt Trigger input. All other PORTA pins have TTL input levels and full CMOS output drivers. The TRISA register controls the direction of the PORTA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. EXAMPLE 10-1: INITIALIZING PORTA Data Bus WR LAT WR TRIS RD Port Data Latch TRIS Latch RD TRIS Input Buffer I/O pin(1) D Q CK D Q CK EN Q D EN RD LAT or Port Note 1: I/O pins have diode protection to VDD and VSS. Note: On a Power-on Reset, RA5 and RA<3:0> are configured as analog inputs and read as ‘0’. RA4 is configured as a digital input. CLRF PORTA ; Initialize PORTA by ; clearing output ; data latches CLRF LATA ; Alternate method ; to clear output ; data latches MOVLW 07h ; Configure A/D MOVWF ADCON1 ; for digital inputs MOVWF 07h ; Configure comparators MOVWF CMCON ; for digital input MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISA ; Set RA<3:0> as inputs ; RA<5:4> as outputs PIC18F2420/2520/4420/4520 DS39631E-page 106 © 2008 Microchip Technology Inc. TABLE 10-1: PORTA I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RA0/AN0 RA0 0 O DIG LATA<0> data output; not affected by analog input. 1 I TTL PORTA<0> data input; disabled when analog input enabled. AN0 1 I ANA A/D input channel 0 and comparator C1- input. Default input configuration on POR; does not affect digital output. RA1/AN1 RA1 0 O DIG LATA<1> data output; not affected by analog input. 1 I TTL PORTA<1> data input; disabled when analog input enabled. AN1 1 I ANA A/D input channel 1 and comparator C2- input. Default input configuration on POR; does not affect digital output. RA2/AN2/ VREF-/CVREF RA2 0 O DIG LATA<2> data output; not affected by analog input. Disabled when CVREF output enabled. 1 I TTL PORTA<2> data input. Disabled when analog functions enabled; disabled when CVREF output enabled. AN2 1 I ANA A/D input channel 2 and comparator C2+ input. Default input configuration on POR; not affected by analog output. VREF- 1 I ANA A/D and comparator voltage reference low input. CVREF x O ANA Comparator voltage reference output. Enabling this feature disables digital I/O. RA3/AN3/VREF+ RA3 0 O DIG LATA<3> data output; not affected by analog input. 1 I TTL PORTA<3> data input; disabled when analog input enabled. AN3 1 I ANA A/D input channel 3 and comparator C1+ input. Default input configuration on POR. VREF+ 1 I ANA A/D and comparator voltage reference high input. RA4/T0CKI/C1OUT RA4 0 O DIG LATA<4> data output. 1 I ST PORTA<4> data input; default configuration on POR. T0CKI 1 I ST Timer0 clock input. C1OUT 0 O DIG Comparator 1 output; takes priority over port data. RA5/AN4/SS/ HLVDIN/C2OUT RA5 0 O DIG LATA<5> data output; not affected by analog input. 1 I TTL PORTA<5> data input; disabled when analog input enabled. AN4 1 I ANA A/D input channel 4. Default configuration on POR. SS 1 I TTL Slave select input for MSSP module. HLVDIN 1 I ANA High/Low-Voltage Detect external trip point input. C2OUT 0 O DIG Comparator 2 output; takes priority over port data. OSC2/CLKO/RA6 RA6 0 O DIG LATA<6> data output. Enabled in RCIO, INTIO2 and ECIO modes only. 1 I TTL PORTA<6> data input. Enabled in RCIO, INTIO2 and ECIO modes only. OSC2 x O ANA Main oscillator feedback output connection (XT, HS and LP modes). CLKO x O DIG System cycle clock output (FOSC/4) in RC, INTIO1 and EC Oscillator modes. OSC1/CLKI/RA7 RA7 0 O DIG LATA<7> data output. Disabled in external oscillator modes. 1 I TTL PORTA<7> data input. Disabled in external oscillator modes. OSC1 x I ANA Main oscillator input connection. CLKI x I ANA Main clock input connection. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). © 2008 Microchip Technology Inc. DS39631E-page 107 PIC18F2420/2520/4420/4520 TABLE 10-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52 LATA LATA7(1) LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch) 52 TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Register 52 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51 CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTA. Note 1: RA<7:6> and their associated latch and data direction bits are enabled as I/O pins based on oscillator configuration; otherwise, they are read as ‘0’. PIC18F2420/2520/4420/4520 DS39631E-page 108 © 2008 Microchip Technology Inc. 10.2 PORTB, TRISB and LATB Registers PORTB is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISB. Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output (i.e., put the contents of the output latch on the selected pin). The Data Latch register (LATB) is also memory mapped. Read-modify-write operations on the LATB register read and write the latched output value for PORTB. EXAMPLE 10-2: INITIALIZING PORTB Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit, RBPU (INTCON2<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset. Four of the PORTB pins (RB<7:4>) have an interrupton-change feature. Only pins configured as inputs can cause this interrupt to occur (i.e., any RB<7:4> pin configured as an output is excluded from the interrupton-change comparison). The input pins (of RB<7:4>) are compared with the old value latched on the last read of PORTB. The “mismatch” outputs of RB<7:4> are ORed together to generate the RB Port Change Interrupt with Flag bit, RBIF (INTCON<0>). This interrupt can wake the device from the Sleep mode, or any of the Idle modes. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of PORTB (except with the MOVFF (ANY), PORTB instruction). b) Clear flag bit, RBIF. A mismatch condition will continue to set flag bit, RBIF. Reading PORTB will end the mismatch condition and allow flag bit, RBIF, to be cleared. The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt-on-change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. RB3 can be configured by the Configuration bit, CCP2MX, as the alternate peripheral pin for the CCP2 module (CCP2MX = 0). Note: On a Power-on Reset, RB<4:0> are configured as analog inputs by default and read as ‘0’; RB<7:5> are configured as digital inputs. By programming the Configuration bit, PBADEN, RB<4:0> will alternatively be configured as digital inputs on POR. CLRF PORTB ; Initialize PORTB by ; clearing output ; data latches CLRF LATB ; Alternate method ; to clear output ; data latches MOVLW 0Fh ; Set RB<4:0> as MOVWF ADCON1 ; digital I/O pins ; (required if config bit ; PBADEN is set) MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISB ; Set RB<3:0> as inputs ; RB<5:4> as outputs ; RB<7:6> as inputs © 2008 Microchip Technology Inc. DS39631E-page 109 PIC18F2420/2520/4420/4520 TABLE 10-3: PORTB I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RB0/INT0/FLT0/ AN12 RB0 0 O DIG LATB<0> data output; not affected by analog input. 1 I TTL PORTB<0> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) INT0 1 I ST External interrupt 0 input. FLT0 1 I ST Enhanced PWM Fault input (ECCP1 module); enabled in software. AN12 1 I ANA A/D input channel 12.(1) RB1/INT1/AN10 RB1 0 O DIG LATB<1> data output; not affected by analog input. 1 I TTL PORTB<1> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) INT1 1 I ST External Interrupt 1 input. AN10 1 I ANA A/D input channel 10.(1) RB2/INT2/AN8 RB2 0 O DIG LATB<2> data output; not affected by analog input. 1 I TTL PORTB<2> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) INT2 1 I ST External interrupt 2 input. AN8 1 I ANA A/D input channel 8.(1) RB3/AN9/CCP2 RB3 0 O DIG LATB<3> data output; not affected by analog input. 1 I TTL PORTB<3> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) AN9 1 I ANA A/D input channel 9.(1) CCP2(2) 0 O DIG CCP2 compare and PWM output. 1 I ST CCP2 capture input RB4/KBI0/AN11 RB4 0 O DIG LATB<4> data output; not affected by analog input. 1 I TTL PORTB<4> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) KBI0 1 I TTL Interrupt-on-pin change. AN11 1 I ANA A/D input channel 11.(1) RB5/KBI1/PGM RB5 0 O DIG LATB<5> data output. 1 I TTL PORTB<5> data input; weak pull-up when RBPU bit is cleared. KBI1 1 I TTL Interrupt-on-pin change. PGM x I ST Single-Supply In-Circuit Serial Programming™ mode entry (ICSP™). Enabled by LVP Configuration bit; all other pin functions disabled. RB6/KBI2/PGC RB6 0 O DIG LATB<6> data output. 1 I TTL PORTB<6> data input; weak pull-up when RBPU bit is cleared. KBI2 1 I TTL Interrupt-on-pin change. PGC x I ST Serial execution (ICSP) clock input for ICSP and ICD operation.(3) RB7/KBI3/PGD RB7 0 O DIG LATB<7> data output. 1 I TTL PORTB<7> data input; weak pull-up when RBPU bit is cleared. KBI3 1 I TTL Interrupt-on-pin change. PGD x O DIG Serial execution data output for ICSP and ICD operation.(3) x I ST Serial execution data input for ICSP and ICD operation.(3) Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Note 1: Configuration on POR is determined by the PBADEN Configuration bit. Pins are configured as analog inputs by default when PBADEN is set and digital inputs when PBADEN is cleared. 2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is ‘0’. Default assignment is RC1. 3: All other pin functions are disabled when ICSP or ICD are enabled. PIC18F2420/2520/4420/4520 DS39631E-page 110 © 2008 Microchip Technology Inc. TABLE 10-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 52 LATB PORTB Data Latch Register (Read and Write to Data Latch) 52 TRISB PORTB Data Direction Register 52 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP 49 INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 49 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTB. © 2008 Microchip Technology Inc. DS39631E-page 111 PIC18F2420/2520/4420/4520 10.3 PORTC, TRISC and LATC Registers PORTC is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISC. Setting a TRISC bit (= 1) will make the corresponding PORTC pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., put the contents of the output latch on the selected pin). The Data Latch register (LATC) is also memory mapped. Read-modify-write operations on the LATC register read and write the latched output value for PORTC. PORTC is multiplexed with several peripheral functions (Table 10-5). The pins have Schmitt Trigger input buffers. RC1 is normally configured by Configuration bit, CCP2MX, as the default peripheral pin of the CCP2 module (default/erased state, CCP2MX = 1). When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTC pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. The user should refer to the corresponding peripheral section for additional information. The contents of the TRISC register are affected by peripheral overrides. Reading TRISC always returns the current contents, even though a peripheral device may be overriding one or more of the pins. EXAMPLE 10-3: INITIALIZING PORTC Note: On a Power-on Reset, these pins are configured as digital inputs. CLRF PORTC ; Initialize PORTC by ; clearing output ; data latches CLRF LATC ; Alternate method ; to clear output ; data latches MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISC ; Set RC<3:0> as inputs ; RC<5:4> as outputs ; RC<7:6> as inputs PIC18F2420/2520/4420/4520 DS39631E-page 112 © 2008 Microchip Technology Inc. TABLE 10-5: PORTC I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RC0/T1OSO/ T13CKI RC0 0 O DIG LATC<0> data output. 1 I ST PORTC<0> data input. T1OSO x O ANA Timer1 oscillator output; enabled when Timer1 oscillator enabled. Disables digital I/O. T13CKI 1 I ST Timer1/Timer3 counter input. RC1/T1OSI/CCP2 RC1 0 O DIG LATC<1> data output. 1 I ST PORTC<1> data input. T1OSI x I ANA Timer1 oscillator input; enabled when Timer1 oscillator enabled. Disables digital I/O. CCP2(1) 0 O DIG CCP2 compare and PWM output; takes priority over port data. 1 I ST CCP2 capture input. RC2/CCP1/P1A RC2 0 O DIG LATC<2> data output. 1 I ST PORTC<2> data input. CCP1 0 O DIG ECCP1 compare or PWM output; takes priority over port data. 1 I ST ECCP1 capture input. P1A(2) 0 O DIG ECCP1 Enhanced PWM output, channel A. May be configured for tri-state during Enhanced PWM shutdown events. Takes priority over port data. RC3/SCK/SCL RC3 0 O DIG LATC<3> data output. 1 I ST PORTC<3> data input. SCK 0 O DIG SPI clock output (MSSP module); takes priority over port data. 1 I ST SPI clock input (MSSP module). SCL 0 O DIG I2C™ clock output (MSSP module); takes priority over port data. 1 I I2C/SMB I2C clock input (MSSP module); input type depends on module setting. RC4/SDI/SDA RC4 0 O DIG LATC<4> data output. 1 I ST PORTC<4> data input. SDI 1 I ST SPI data input (MSSP module). SDA 1 O DIG I2C data output (MSSP module); takes priority over port data. 1 I I2C/SMB I2C data input (MSSP module); input type depends on module setting. RC5/SDO RC5 0 O DIG LATC<5> data output. 1 I ST PORTC<5> data input. SDO 0 O DIG SPI data output (MSSP module); takes priority over port data. RC6/TX/CK RC6 0 O DIG LATC<6> data output. 1 I ST PORTC<6> data input. TX 1 O DIG Asynchronous serial transmit data output (EUSART module); takes priority over port data. User must configure as output. CK 1 O DIG Synchronous serial clock output (EUSART module); takes priority over port data. 1 I ST Synchronous serial clock input (EUSART module). RC7/RX/DT RC7 0 O DIG LATC<7> data output. 1 I ST PORTC<7> data input. RX 1 I ST Asynchronous serial receive data input (EUSART module). DT 1 O DIG Synchronous serial data output (EUSART module); takes priority over port data. 1 I ST Synchronous serial data input (EUSART module). User must configure as an input. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; I 2C/SMB = I2C/SMBus input buffer; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. Alternate assignment is RB3. 2: Enhanced PWM output is available only on PIC18F4520 devices. © 2008 Microchip Technology Inc. DS39631E-page 113 PIC18F2420/2520/4420/4520 TABLE 10-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 52 LATC PORTC Data Latch Register (Read and Write to Data Latch) 52 TRISC PORTC Data Direction Register 52 PIC18F2420/2520/4420/4520 DS39631E-page 114 © 2008 Microchip Technology Inc. 10.4 PORTD, TRISD and LATD Registers PORTD is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISD. Setting a TRISD bit (= 1) will make the corresponding PORTD pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISD bit (= 0) will make the corresponding PORTD pin an output (i.e., put the contents of the output latch on the selected pin). The Data Latch register (LATD) is also memory mapped. Read-modify-write operations on the LATD register read and write the latched output value for PORTD. All pins on PORTD are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. Three of the PORTD pins are multiplexed with outputs P1B, P1C and P1D of the Enhanced CCP module. The operation of these additional PWM output pins is covered in greater detail in Section 16.0 “Enhanced Capture/Compare/PWM (ECCP) Module”. PORTD can also be configured as an 8-bit wide microprocessor port (Parallel Slave Port) by setting control bit, PSPMODE (TRISE<4>). In this mode, the input buffers are TTL. See Section 10.6 “Parallel Slave Port” for additional information on the Parallel Slave Port (PSP). EXAMPLE 10-4: INITIALIZING PORTD Note: PORTD is only available on 40/44-pin devices. Note: On a Power-on Reset, these pins are configured as digital inputs. Note: When the enhanced PWM mode is used with either dual or quad outputs, the PSP functions of PORTD are automatically disabled. CLRF PORTD ; Initialize PORTD by ; clearing output ; data latches CLRF LATD ; Alternate method ; to clear output ; data latches MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISD ; Set RD<3:0> as inputs ; RD<5:4> as outputs ; RD<7:6> as inputs © 2008 Microchip Technology Inc. DS39631E-page 115 PIC18F2420/2520/4420/4520 TABLE 10-7: PORTD I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RD0/PSP0 RD0 0 O DIG LATD<0> data output. 1 I ST PORTD<0> data input. PSP0 x O DIG PSP read data output (LATD<0>); takes priority over port data. x I TTL PSP write data input. RD1/PSP1 RD1 0 O DIG LATD<1> data output. 1 I ST PORTD<1> data input. PSP1 x O DIG PSP read data output (LATD<1>); takes priority over port data. x I TTL PSP write data input. RD2/PSP2 RD2 0 O DIG LATD<2> data output. 1 I ST PORTD<2> data input. PSP2 x O DIG PSP read data output (LATD<2>); takes priority over port data. x I TTL PSP write data input. RD3/PSP3 RD3 0 O DIG LATD<3> data output. 1 I ST PORTD<3> data input. PSP3 x O DIG PSP read data output (LATD<3>); takes priority over port data. x I TTL PSP write data input. RD4/PSP4 RD4 0 O DIG LATD<4> data output. 1 I ST PORTD<4> data input. PSP4 x O DIG PSP read data output (LATD<4>); takes priority over port data. x I TTL PSP write data input. RD5/PSP5/P1B RD5 0 O DIG LATD<5> data output. 1 I ST PORTD<5> data input. PSP5 x O DIG PSP read data output (LATD<5>); takes priority over port data. x I TTL PSP write data input. P1B 0 O DIG ECCP1 Enhanced PWM output, channel B; takes priority over port and PSP data. May be configured for tri-state during Enhanced PWM shutdown events. RD6/PSP6/P1C RD6 0 O DIG LATD<6> data output. 1 I ST PORTD<6> data input. PSP6 x O DIG PSP read data output (LATD<6>); takes priority over port data. x I TTL PSP write data input. P1C 0 O DIG ECCP1 Enhanced PWM output, channel C; takes priority over port and PSP data. May be configured for tri-state during Enhanced PWM shutdown events. RD7/PSP7/P1D RD7 0 O DIG LATD<7> data output. 1 I ST PORTD<7> data input. PSP7 x O DIG PSP read data output (LATD<7>); takes priority over port data. x I TTL PSP write data input. P1D 0 O DIG ECCP1 Enhanced PWM output, channel D; takes priority over port and PSP data. May be configured for tri-state during Enhanced PWM shutdown events. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). PIC18F2420/2520/4420/4520 DS39631E-page 116 © 2008 Microchip Technology Inc. TABLE 10-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 52 LATD PORTD Data Latch Register (Read and Write to Data Latch) 52 TRISD PORTD Data Direction Register 52 TRISE(1) IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTD. Note 1: These registers and/or bits are unimplemented on 28-oin devices. © 2008 Microchip Technology Inc. DS39631E-page 117 PIC18F2420/2520/4420/4520 10.5 PORTE, TRISE and LATE Registers Depending on the particular PIC18F2420/2520/4420/ 4520 device selected, PORTE is implemented in two different ways. For 40/44-pin devices, PORTE is a 4-bit wide port. Three pins (RE0/RD/AN5, RE1/WR/AN6 and RE2/CS/ AN7) are individually configurable as inputs or outputs. These pins have Schmitt Trigger input buffers. When selected as an analog input, these pins will read as ‘0’s. The corresponding Data Direction register is TRISE. Setting a TRISE bit (= 1) will make the corresponding PORTE pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISE bit (= 0) will make the corresponding PORTE pin an output (i.e., put the contents of the output latch on the selected pin). TRISE controls the direction of the RE pins, even when they are being used as analog inputs. The user must make sure to keep the pins configured as inputs when using them as analog inputs. The upper four bits of the TRISE register also control the operation of the Parallel Slave Port. Their operation is explained in Register 10-1. The Data Latch register (LATE) is also memory mapped. Read-modify-write operations on the LATE register, read and write the latched output value for PORTE. The fourth pin of PORTE (MCLR/VPP/RE3) is an input only pin. Its operation is controlled by the MCLRE Configuration bit. When selected as a port pin (MCLRE = 0), it functions as a digital input only pin; as such, it does not have TRIS or LAT bits associated with its operation. Otherwise, it functions as the device’s Master Clear input. In either configuration, RE3 also functions as the programming voltage input during programming. EXAMPLE 10-5: INITIALIZING PORTE 10.5.1 PORTE IN 28-PIN DEVICES For 28-pin devices, PORTE is only available when Master Clear functionality is disabled (MCLRE = 0). In these cases, PORTE is a single bit, input only port comprised of RE3 only. The pin operates as previously described. Note: On a Power-on Reset, RE<2:0> are configured as analog inputs. Note: On a Power-on Reset, RE3 is enabled as a digital input only if Master Clear functionality is disabled. CLRF PORTE ; Initialize PORTE by ; clearing output ; data latches CLRF LATE ; Alternate method ; to clear output ; data latches MOVLW 0Ah ; Configure A/D MOVWF ADCON1 ; for digital inputs MOVLW 03h ; Value used to ; initialize data ; direction MOVWF TRISE ; Set RE<0> as inputs ; RE<1> as outputs ; RE<2> as inputs PIC18F2420/2520/4420/4520 DS39631E-page 118 © 2008 Microchip Technology Inc. REGISTER 10-1: TRISE REGISTER (40/44-PIN DEVICES ONLY) R-0 R-0 R/W-0 R/W-0 U-0 R/W-1 R/W-1 R/W-1 IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IBF: Input Buffer Full Status bit 1 = A word has been received and waiting to be read by the CPU 0 = No word has been received bit 6 OBF: Output Buffer Full Status bit 1 = The output buffer still holds a previously written word 0 = The output buffer has been read bit 5 IBOV: Input Buffer Overflow Detect bit (in Microprocessor mode) 1 = A write occurred when a previously input word has not been read (must be cleared in software) 0 = No overflow occurred bit 4 PSPMODE: Parallel Slave Port Mode Select bit 1 = Parallel Slave Port mode 0 = General purpose I/O mode bit 3 Unimplemented: Read as ‘0’ bit 2 TRISE2: RE2 Direction Control bit 1 = Input 0 = Output bit 1 TRISE1: RE1 Direction Control bit 1 = Input 0 = Output bit 0 TRISE0: RE0 Direction Control bit 1 = Input 0 = Output © 2008 Microchip Technology Inc. DS39631E-page 119 PIC18F2420/2520/4420/4520 TABLE 10-9: PORTE I/O SUMMARY TABLE 10-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE Pin Function TRIS Setting I/O I/O Type Description RE0/RD/AN5 RE0 0 O DIG LATE<0> data output; not affected by analog input. 1 I ST PORTE<0> data input; disabled when analog input enabled. RD 1 I TTL PSP read enable input (PSP enabled). AN5 1 I ANA A/D input channel 5; default input configuration on POR. RE1/WR/AN6 RE1 0 O DIG LATE<1> data output; not affected by analog input. 1 I ST PORTE<1> data input; disabled when analog input enabled. WR 1 I TTL PSP write enable input (PSP enabled). AN6 1 I ANA A/D input channel 6; default input configuration on POR. RE2/CS/AN7 RE2 0 O DIG LATE<2> data output; not affected by analog input. 1 I ST PORTE<2> data input; disabled when analog input enabled. CS 1 I TTL PSP write enable input (PSP enabled). AN7 1 I ANA A/D input channel 7; default input configuration on POR. MCLR/VPP/RE3(1) MCLR — I ST External Master Clear input; enabled when MCLRE Configuration bit is set. VPP — I ANA High-voltage detection; used for ICSP™ mode entry detection. Always available regardless of pin mode. RE3 —(2) I ST PORTE<3> data input; enabled when MCLRE Configuration bit is clear. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Note 1: RE3 is available on both 28-pin and 40/44-pin devices. All other PORTE pins are only implemented on 40/44-pin devices. 2: RE3 does not have a corresponding TRIS bit to control data direction. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTE — — — — RE3(1,2) RE2 RE1 RE0 52 LATE(2) — — — — — LATE Data Latch Register 52 TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTE. Note 1: Implemented only when Master Clear functionality is disabled (MCLRE Configuration bit = 0). 2: RE3 is the only PORTE bit implemented on both 28-pin and 40/44-pin devices. All other bits are implemented only when PORTE is implemented (i.e., 40/44-pin devices). PIC18F2420/2520/4420/4520 DS39631E-page 120 © 2008 Microchip Technology Inc. 10.6 Parallel Slave Port In addition to its function as a general I/O port, PORTD can also operate as an 8-bit wide Parallel Slave Port (PSP) or microprocessor port. PSP operation is controlled by the 4 upper bits of the TRISE register (Register 10-1). Setting control bit, PSPMODE (TRISE<4>), enables PSP operation as long as the Enhanced CCP module is not operating in dual output or quad output PWM mode. In Slave mode, the port is asynchronously readable and writable by the external world. The PSP can directly interface to an 8-bit microprocessor data bus. The external microprocessor can read or write the PORTD latch as an 8-bit latch. Setting the control bit, PSPMODE, enables the PORTE I/O pins to become control inputs for the microprocessor port. When set, port pin RE0 is the RD input, RE1 is the WR input and RE2 is the CS (Chip Select) input. For this functionality, the corresponding data direction bits of the TRISE register (TRISE<2:0>) must be configured as inputs (set). The A/D port configuration bits, PFCG<3:0> (ADCON1<3:0>), must also be set to a value in the range of ‘1010’ through ‘1111’. A write to the PSP occurs when both the CS and WR lines are first detected low and ends when either are detected high. The PSPIF and IBF flag bits are both set when the write ends. A read from the PSP occurs when both the CS and RD lines are first detected low. The data in PORTD is read out and the OBF bit is clear. If the user writes new data to PORTD to set OBF, the data is immediately read out; however, the OBF bit is not set. When either the CS or RD lines are detected high, the PORTD pins return to the input state and the PSPIF bit is set. User applications should wait for PSPIF to be set before servicing the PSP; when this happens, the IBF and OBF bits can be polled and the appropriate action taken. The timing for the control signals in Write and Read modes is shown in Figure 10-3 and Figure 10-4, respectively. FIGURE 10-2: PORTD AND PORTE BLOCK DIAGRAM (PARALLEL SLAVE PORT) Note: The Parallel Slave Port is only available on 40/44-pin devices. Data Bus WR LATD RDx pin D Q CK EN Q D RD PORTD EN One bit of PORTD Set Interrupt Flag PSPIF (PIR1<7>) Read Chip Select Write RD CS WR TTL TTL TTL TTL or WR PORTD RD LATD Data Latch Note: I/O pins have diode protection to VDD and VSS. PORTE Pins © 2008 Microchip Technology Inc. DS39631E-page 121 PIC18F2420/2520/4420/4520 FIGURE 10-3: PARALLEL SLAVE PORT WRITE WAVEFORMS FIGURE 10-4: PARALLEL SLAVE PORT READ WAVEFORMS TABLE 10-11: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 52 LATD PORTD Data Latch Register (Read and Write to Data Latch) 52 TRISD PORTD Data Direction Register 52 PORTE — — — — RE3 RE2 RE1 RE0 52 LATE — — — — — LATE Data Latch Register 52 TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 INTCON GIE/GIEH PEIE/GIEL TMR0IF INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Parallel Slave Port. Q1 Q2 Q3 Q4 CS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 WR RD IBF OBF PSPIF PORTD<7:0> Q1 Q2 Q3 Q4 CS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 WR IBF PSPIF RD OBF PORTD<7:0> PIC18F2420/2520/4420/4520 DS39631E-page 122 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 123 PIC18F2420/2520/4420/4520 11.0 TIMER0 MODULE The Timer0 module incorporates the following features: • Software selectable operation as a timer or counter in both 8-bit or 16-bit modes • Readable and writable registers • Dedicated 8-bit, software programmable prescaler • Selectable clock source (internal or external) • Edge select for external clock • Interrupt-on-overflow The T0CON register (Register 11-1) controls all aspects of the module’s operation, including the prescale selection. It is both readable and writable. A simplified block diagram of the Timer0 module in 8-bit mode is shown in Figure 11-1. Figure 11-2 shows a simplified block diagram of the Timer0 module in 16-bit mode. REGISTER 11-1: T0CON: TIMER0 CONTROL REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 TMR0ON: Timer0 On/Off Control bit 1 = Enables Timer0 0 = Stops Timer0 bit 6 T08BIT: Timer0 8-Bit/16-Bit Control bit 1 = Timer0 is configured as an 8-bit timer/counter 0 = Timer0 is configured as a 16-bit timer/counter bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (CLKO) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Timer0 Prescaler Assignment bit 1 = TImer0 prescaler is not assigned. Timer0 clock input bypasses prescaler. 0 = Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output. bit 2-0 T0PS<2:0>: Timer0 Prescaler Select bits 111 = 1:256 Prescale value 110 = 1:128 Prescale value 101 = 1:64 Prescale value 100 = 1:32 Prescale value 011 = 1:16 Prescale value 010 = 1:8 Prescale value 001 = 1:4 Prescale value 000 = 1:2 Prescale value PIC18F2420/2520/4420/4520 DS39631E-page 124 © 2008 Microchip Technology Inc. 11.1 Timer0 Operation Timer0 can operate as either a timer or a counter; the mode is selected with the T0CS bit (T0CON<5>). In Timer mode (T0CS = 0), the module increments on every clock by default unless a different prescaler value is selected (see Section 11.3 “Prescaler”). If the TMR0 register is written to, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. The Counter mode is selected by setting the T0CS bit (= 1). In this mode, Timer0 increments either on every rising or falling edge of pin RA4/T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit, T0SE (T0CON<4>); clearing this bit selects the rising edge. Restrictions on the external clock input are discussed below. An external clock source can be used to drive Timer0; however, it must meet certain requirements to ensure that the external clock can be synchronized with the internal phase clock (TOSC). There is a delay between synchronization and the onset of incrementing the timer/counter. 11.2 Timer0 Reads and Writes in 16-Bit Mode TMR0H is not the actual high byte of Timer0 in 16-bit mode; it is actually a buffered version of the real high byte of Timer0 which is not directly readable nor writable (refer to Figure 11-2). TMR0H is updated with the contents of the high byte of Timer0 during a read of TMR0L. This provides the ability to read all 16 bits of Timer0 without having to verify that the read of the high and low byte were valid, due to a rollover between successive reads of the high and low byte. Similarly, a write to the high byte of Timer0 must also take place through the TMR0H Buffer register. The high byte is updated with the contents of TMR0H when a write occurs to TMR0L. This allows all 16 bits of Timer0 to be updated at once. FIGURE 11-1: TIMER0 BLOCK DIAGRAM (8-BIT MODE) FIGURE 11-2: TIMER0 BLOCK DIAGRAM (16-BIT MODE) Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale. T0CKI pin T0SE 0 1 0 1 T0CS FOSC/4 Programmable Prescaler Sync with Internal Clocks TMR0L (2 TCY Delay) PSA Internal Data Bus T0PS<2:0> Set TMR0IF on Overflow 3 8 8 Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale. T0CKI pin T0SE 0 1 0 1 T0CS FOSC/4 Programmable Prescaler Sync with Internal Clocks TMR0L (2 TCY Delay) Internal Data Bus 8 PSA T0PS<2:0> Set TMR0IF on Overflow 3 TMR0 TMR0H High Byte 8 8 8 Read TMR0L Write TMR0L 8 © 2008 Microchip Technology Inc. DS39631E-page 125 PIC18F2420/2520/4420/4520 11.3 Prescaler An 8-bit counter is available as a prescaler for the Timer0 module. The prescaler is not directly readable or writable; its value is set by the PSA and T0PS<2:0> bits (T0CON<3:0>) which determine the prescaler assignment and prescale ratio. Clearing the PSA bit assigns the prescaler to the Timer0 module. When it is assigned, prescale values from 1:2 through 1:256 in power-of-2 increments are selectable. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF TMR0, MOVWF TMR0, BSF TMR0, etc.) clear the prescaler count. 11.3.1 SWITCHING PRESCALER ASSIGNMENT The prescaler assignment is fully under software control and can be changed “on-the-fly” during program execution. 11.4 Timer0 Interrupt The TMR0 interrupt is generated when the TMR0 register overflows from FFh to 00h in 8-bit mode, or from FFFFh to 0000h in 16-bit mode. This overflow sets the TMR0IF flag bit. The interrupt can be masked by clearing the TMR0IE bit (INTCON<5>). Before reenabling the interrupt, the TMR0IF bit must be cleared in software by the Interrupt Service Routine. Since Timer0 is shut down in Sleep mode, the TMR0 interrupt cannot awaken the processor from Sleep. TABLE 11-1: REGISTERS ASSOCIATED WITH TIMER0 Note: Writing to TMR0 when the prescaler is assigned to Timer0 will clear the prescaler count but will not change the prescaler assignment. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page TMR0L Timer0 Register Low Byte 50 TMR0H Timer0 Register High Byte 50 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 50 TRISA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52 Legend: Shaded cells are not used by Timer0. Note 1: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. PIC18F2420/2520/4420/4520 DS39631E-page 126 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 127 PIC18F2420/2520/4420/4520 12.0 TIMER1 MODULE The Timer1 timer/counter module incorporates these features: • Software selectable operation as a 16-bit timer or counter • Readable and writable 8-bit registers (TMR1H and TMR1L) • Selectable clock source (internal or external) with device clock or Timer1 oscillator internal options • Interrupt-on-overflow • Reset on CCP Special Event Trigger • Device clock status flag (T1RUN) A simplified block diagram of the Timer1 module is shown in Figure 12-1. A block diagram of the module’s operation in Read/Write mode is shown in Figure 12-2. The module incorporates its own low-power oscillator to provide an additional clocking option. The Timer1 oscillator can also be used as a low-power clock source for the microcontroller in power-managed operation. Timer1 can also be used to provide Real-Time Clock (RTC) functionality to applications with only a minimal addition of external components and code overhead. Timer1 is controlled through the T1CON Control register (Register 12-1). It also contains the Timer1 Oscillator Enable bit (T1OSCEN). Timer1 can be enabled or disabled by setting or clearing control bit, TMR1ON (T1CON<0>). REGISTER 12-1: T1CON: TIMER1 CONTROL REGISTER R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RD16: 16-Bit Read/Write Mode Enable bit 1 = Enables register read/write of TImer1 in one 16-bit operation 0 = Enables register read/write of Timer1 in two 8-bit operations bit 6 T1RUN: Timer1 System Clock Status bit 1 = Device clock is derived from Timer1 oscillator 0 = Device clock is derived from another source bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 T1OSCEN: Timer1 Oscillator Enable bit 1 = Timer1 oscillator is enabled 0 = Timer1 oscillator is shut off The oscillator inverter and feedback resistor are turned off to eliminate power drain. bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit When TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0. bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from pin RC0/T1OSO/T13CKI (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 PIC18F2420/2520/4420/4520 DS39631E-page 128 © 2008 Microchip Technology Inc. 12.1 Timer1 Operation Timer1 can operate in one of these modes: • Timer • Synchronous Counter • Asynchronous Counter The operating mode is determined by the clock select bit, TMR1CS (T1CON<1>). When TMR1CS is cleared (= 0), Timer1 increments on every internal instruction cycle (FOSC/4). When the bit is set, Timer1 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. When Timer1 is enabled, the RC1/T1OSI and RC0/ T1OSO/T13CKI pins become inputs. This means the values of TRISC<1:0> are ignored and the pins are read as ‘0’. FIGURE 12-1: TIMER1 BLOCK DIAGRAM FIGURE 12-2: TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE) T1SYNC TMR1CS T1CKPS<1:0> Sleep Input T1OSCEN(1) FOSC/4 Internal Clock On/Off Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T1OSO/T13CKI T1OSI 1 0 TMR1ON TMR1L Set TMR1IF on Overflow TMR1 High Byte Clear TMR1 (CCP Special Event Trigger) Timer1 Oscillator Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. On/Off Timer1 Timer1 Clock Input T1SYNC TMR1CS T1CKPS<1:0> Sleep Input T1OSCEN(1) FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T1OSO/T13CKI T1OSI Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. 1 0 TMR1L Internal Data Bus 8 Set TMR1IF on Overflow TMR1 TMR1H High Byte 8 8 8 Read TMR1L Write TMR1L 8 TMR1ON Clear TMR1 (CCP Special Event Trigger) Timer1 Oscillator On/Off Timer1 Timer1 Clock Input © 2008 Microchip Technology Inc. DS39631E-page 129 PIC18F2420/2520/4420/4520 12.2 Timer1 16-Bit Read/Write Mode Timer1 can be configured for 16-bit reads and writes (see Figure 12-2). When the RD16 control bit (T1CON<7>) is set, the address for TMR1H is mapped to a buffer register for the high byte of Timer1. A read from TMR1L will load the contents of the high byte of Timer1 into the Timer1 high byte buffer. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. A write to the high byte of Timer1 must also take place through the TMR1H Buffer register. The Timer1 high byte is updated with the contents of TMR1H when a write occurs to TMR1L. This allows a user to write all 16 bits to both the high and low bytes of Timer1 at once. The high byte of Timer1 is not directly readable or writable in this mode. All reads and writes must take place through the Timer1 High Byte Buffer register. Writes to TMR1H do not clear the Timer1 prescaler. The prescaler is only cleared on writes to TMR1L. 12.3 Timer1 Oscillator An on-chip crystal oscillator circuit is incorporated between pins T1OSI (input) and T1OSO (amplifier output). It is enabled by setting the Timer1 Oscillator Enable bit, T1OSCEN (T1CON<3>). The oscillator is a lowpower circuit rated for 32 kHz crystals. It will continue to run during all power-managed modes. The circuit for a typical LP oscillator is shown in Figure 12-3. Table 12-1 shows the capacitor selection for the Timer1 oscillator. The user must provide a software time delay to ensure proper start-up of the Timer1 oscillator. FIGURE 12-3: EXTERNAL COMPONENTS FOR THE TIMER1 LP OSCILLATOR TABLE 12-1: CAPACITOR SELECTION FOR THE TIMER OSCILLATOR 12.3.1 USING TIMER1 AS A CLOCK SOURCE The Timer1 oscillator is also available as a clock source in power-managed modes. By setting the clock select bits, SCS<1:0> (OSCCON<1:0>), to ‘01’, the device switches to SEC_RUN mode; both the CPU and peripherals are clocked from the Timer1 oscillator. If the IDLEN bit (OSCCON<7>) is cleared and a SLEEP instruction is executed, the device enters SEC_IDLE mode. Additional details are available in Section 3.0 “Power-Managed Modes”. Whenever the Timer1 oscillator is providing the clock source, the Timer1 system clock status flag, T1RUN (T1CON<6>), is set. This can be used to determine the controller’s current clocking mode. It can also indicate the clock source being currently used by the Fail-Safe Clock Monitor. If the Clock Monitor is enabled and the Timer1 oscillator fails while providing the clock, polling the T1RUN bit will indicate whether the clock is being provided by the Timer1 oscillator or another source. 12.3.2 LOW-POWER TIMER1 OPTION The Timer1 oscillator can operate at two distinct levels of power consumption based on device configuration. When the LPT1OSC Configuration bit is set, the Timer1 oscillator operates in a low-power mode. When LPT1OSC is not set, Timer1 operates at a higher power level. Power consumption for a particular mode is relatively constant, regardless of the device’s operating mode. The default Timer1 configuration is the higher power mode. As the low-power Timer1 mode tends to be more sensitive to interference, high noise environments may cause some oscillator instability. The low-power option is, therefore, best suited for low noise applications where power conservation is an important design consideration. Note: See the Notes with Table 12-1 for additional information about capacitor selection. C1 C2 XTAL PIC18FXXXX T1OSI T1OSO 32.768 kHz 27 pF 27 pF Osc Type Freq C1 C2 LP 32 kHz 27 pF(1) 27 pF(1) Note 1: Microchip suggests these values as a starting point in validating the oscillator circuit. 2: Higher capacitance increases the stability of the oscillator but also increases the start-up time. 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 4: Capacitor values are for design guidance only. PIC18F2420/2520/4420/4520 DS39631E-page 130 © 2008 Microchip Technology Inc. 12.3.3 TIMER1 OSCILLATOR LAYOUT CONSIDERATIONS The Timer1 oscillator circuit draws very little power during operation. Due to the low-power nature of the oscillator, it may also be sensitive to rapidly changing signals in close proximity. The oscillator circuit, shown in Figure 12-3, should be located as close as possible to the microcontroller. There should be no circuits passing within the oscillator circuit boundaries other than VSS or VDD. If a high-speed circuit must be located near the oscillator (such as the CCP1 pin in Output Compare or PWM mode, or the primary oscillator using the OSC2 pin), a grounded guard ring around the oscillator circuit, as shown in Figure 12-4, may be helpful when used on a single-sided PCB or in addition to a ground plane. FIGURE 12-4: OSCILLATOR CIRCUIT WITH GROUNDED GUARD RING 12.4 Timer1 Interrupt The TMR1 register pair (TMR1H:TMR1L) increments from 0000h to FFFFh and rolls over to 0000h. The Timer1 interrupt, if enabled, is generated on overflow, which is latched in interrupt flag bit, TMR1IF (PIR1<0>). This interrupt can be enabled or disabled by setting or clearing the Timer1 Interrupt Enable bit, TMR1IE (PIE1<0>). 12.5 Resetting Timer1 Using the CCP Special Event Trigger If either of the CCP modules is configured to use Timer1 and generate a Special Event Trigger in Compare mode (CCP1M<3:0> or CCP2M<3:0> = 1011), this signal will reset Timer1. The trigger from CCP2 will also start an A/D conversion if the A/D module is enabled (see Section 15.3.4 “Special Event Trigger” for more information). The module must be configured as either a timer or a synchronous counter to take advantage of this feature. When used this way, the CCPRxH:CCPRxL register pair effectively becomes a Period register for Timer1. If Timer1 is running in Asynchronous Counter mode, this Reset operation may not work. In the event that a write to Timer1 coincides with a Special Event Trigger, the write operation will take precedence. 12.6 Using Timer1 as a Real-Time Clock Adding an external LP oscillator to Timer1 (such as the one described in Section 12.3 “Timer1 Oscillator”) gives users the option to include RTC functionality to their applications. This is accomplished with an inexpensive watch crystal to provide an accurate time base and several lines of application code to calculate the time. When operating in Sleep mode and using a battery or supercapacitor as a power source, it can completely eliminate the need for a separate RTC device and battery backup. The application code routine, RTCisr, shown in Example 12-1, demonstrates a simple method to increment a counter at one-second intervals using an Interrupt Service Routine. Incrementing the TMR1 register pair to overflow triggers the interrupt and calls the routine, which increments the seconds counter by one; additional counters for minutes and hours are incremented as the previous counter overflow. Since the register pair is 16 bits wide, counting up to overflow the register directly from a 32.768 kHz clock would take 2 seconds. To force the overflow at the required one-second intervals, it is necessary to preload it. The simplest method is to set the MSb of TMR1H with a BSF instruction. Note that the TMR1L register is never preloaded or altered; doing so may introduce cumulative error over many cycles. For this method to be accurate, Timer1 must operate in Asynchronous mode and the Timer1 overflow interrupt must be enabled (PIE1<0> = 1), as shown in the routine, RTCinit. The Timer1 oscillator must also be enabled and running at all times. VDD OSC1 VSS OSC2 RC0 RC1 RC2 Note: Not drawn to scale. Note: The Special Event Triggers from the CCP2 module will not set the TMR1IF interrupt flag bit (PIR1<0>). © 2008 Microchip Technology Inc. DS39631E-page 131 PIC18F2420/2520/4420/4520 12.7 Considerations in Asynchronous Counter Mode Following a Timer1 interrupt and an update to the TMR1 registers, the Timer1 module uses a falling edge on its clock source to trigger the next register update on the rising edge. If the update is completed after the clock input has fallen, the next rising edge will not be counted. If the application can reliably update TMR1 before the timer input goes low, no additional action is needed. Otherwise, an adjusted update can be performed following a later Timer1 increment. This can be done by monitoring TMR1L within the interrupt routine until it increments, and then updating the TMR1H:TMR1L register pair while the clock is low, or one-half of the period of the clock source. Assuming that Timer1 is being used as a Real-Time Clock, the clock source is a 32.768 kHz crystal oscillator; in this case, one half period of the clock is 15.25 μs. The Real-Time Clock application code in Example 12-1 shows a typical ISR for Timer1, as well as the optional code required if the update cannot be done reliably within the required interval. EXAMPLE 12-1: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE RTCinit MOVLW 80h ; Preload TMR1 register pair MOVWF TMR1H ; for 1 second overflow CLRF TMR1L MOVLW b’00001111’ ; Configure for external clock, MOVWF T1CON ; Asynchronous operation, external oscillator CLRF secs ; Initialize timekeeping registers CLRF mins ; MOVLW .12 MOVWF hours BSF PIE1, TMR1IE ; Enable Timer1 interrupt RETURN RTCisr ; Start ISR here ; Insert the next 4 lines of code when TMR1 ; can not be reliably updated before clock pulse goes low BTFSC TMR1L,0 ; wait for TMR1L<0> to become clear BRA $-2 ; (may already be clear) BTFSS TMR1L,0 ; wait for TMR1L<0> to become set BRA $-2 ; TMR1 has just incremented ; If TMR1 update can be completed before clock pulse goes low BSF TMR1H, 7 ; Preload for 1 sec overflow BCF PIR1, TMR1IF ; Clear interrupt flag INCF secs, F ; Increment seconds MOVLW .59 ; 60 seconds elapsed? CPFSGT secs RETURN ; No, done CLRF secs ; Clear seconds INCF mins, F ; Increment minutes MOVLW .59 ; 60 minutes elapsed? CPFSGT mins RETURN ; No, done CLRF mins ; clear minutes INCF hours, F ; Increment hours MOVLW .23 ; 24 hours elapsed? CPFSGT hours RETURN ; No, done CLRF hours ; Reset hours RETURN ; Done PIC18F2420/2520/4420/4520 DS39631E-page 132 © 2008 Microchip Technology Inc. TABLE 12-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TMR1L Timer1 Register Low Byte 50 TMR1H Timer1 Register High Byte 50 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 Legend: Shaded cells are not used by the Timer1 module. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. © 2008 Microchip Technology Inc. DS39631E-page 133 PIC18F2420/2520/4420/4520 13.0 TIMER2 MODULE The Timer2 module timer incorporates the following features: • 8-Bit Timer and Period registers (TMR2 and PR2, respectively) • Readable and writable (both registers) • Software programmable prescaler (1:1, 1:4 and 1:16) • Software programmable postscaler (1:1 through 1:16) • Interrupt on TMR2 to PR2 match • Optional use as the shift clock for the MSSP module The module is controlled through the T2CON register (Register 13-1), which enables or disables the timer and configures the prescaler and postscaler. Timer2 can be shut off by clearing control bit, TMR2ON (T2CON<2>), to minimize power consumption. A simplified block diagram of the module is shown in Figure 13-1. 13.1 Timer2 Operation In normal operation, TMR2 is incremented from 00h on each clock (FOSC/4). A 4-bit counter/prescaler on the clock input gives direct input, divide-by-4 and divide-by- 16 prescale options; these are selected by the prescaler control bits, T2CKPS<1:0> (T2CON<1:0>). The value of TMR2 is compared to that of the Period register, PR2, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMR2 to 00h on the next cycle and drives the output counter/postscaler (see Section 13.2 “Timer2 Interrupt”). The TMR2 and PR2 registers are both directly readable and writable. The TMR2 register is cleared on any device Reset, while the PR2 register initializes at FFh. Both the prescaler and postscaler counters are cleared on the following events: • a write to the TMR2 register • a write to the T2CON register • any device Reset (Power-on Reset, MCLR Reset, Watchdog Timer Reset or Brown-out Reset) TMR2 is not cleared when T2CON is written. REGISTER 13-1: T2CON: TIMER2 CONTROL REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscale Select bits 0000 = 1:1 Postscale 0001 = 1:2 Postscale • • • 1111 = 1:16 Postscale bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16 PIC18F2420/2520/4420/4520 DS39631E-page 134 © 2008 Microchip Technology Inc. 13.2 Timer2 Interrupt Timer2 also can generate an optional device interrupt. The Timer2 output signal (TMR2 to PR2 match) provides the input for the 4-bit output counter/postscaler. This counter generates the TMR2 match interrupt flag which is latched in TMR2IF (PIR1<1>). The interrupt is enabled by setting the TMR2 Match Interrupt Enable bit, TMR2IE (PIE1<1>). A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, T2OUTPS<3:0> (T2CON<6:3>). 13.3 Timer2 Output The unscaled output of TMR2 is available primarily to the CCP modules, where it is used as a time base for operations in PWM mode. Timer2 can optionally be used as the shift clock source for the MSSP module operating in SPI mode. Additional information is provided in Section 17.0 “Master Synchronous Serial Port (MSSP) Module”. FIGURE 13-1: TIMER2 BLOCK DIAGRAM TABLE 13-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TMR2 Timer2 Register 50 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50 PR2 Timer2 Period Register 50 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. Comparator TMR2 Output TMR2 Postscaler Prescaler PR2 2 FOSC/4 1:1 to 1:16 1:1, 1:4, 1:16 4 T2OUTPS<3:0> T2CKPS<1:0> Set TMR2IF Internal Data Bus 8 Reset TMR2/PR2 8 8 (to PWM or MSSP) Match © 2008 Microchip Technology Inc. DS39631E-page 135 PIC18F2420/2520/4420/4520 14.0 TIMER3 MODULE The Timer3 module timer/counter incorporates these features: • Software selectable operation as a 16-bit timer or counter • Readable and writable 8-bit registers (TMR3H and TMR3L) • Selectable clock source (internal or external) with device clock or Timer1 oscillator internal options • Interrupt-on-overflow • Module Reset on CCP Special Event Trigger A simplified block diagram of the Timer3 module is shown in Figure 14-1. A block diagram of the module’s operation in Read/Write mode is shown in Figure 14-2. The Timer3 module is controlled through the T3CON register (Register 14-1). It also selects the clock source options for the CCP modules (see Section 15.1.1 “CCP Modules and Timer Resources” for more information). REGISTER 14-1: T3CON: TIMER3 CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RD16: 16-Bit Read/Write Mode Enable bit 1 = Enables register read/write of Timer3 in one 16-bit operation 0 = Enables register read/write of Timer3 in two 8-bit operations bit 6,3 T3CCP<2:1>: Timer3 and Timer1 to CCPx Enable bits 1x = Timer3 is the capture/compare clock source for the CCP modules 01 = Timer3 is the capture/compare clock source for CCP2; Timer1 is the capture/compare clock source for CCP1 00 = Timer1 is the capture/compare clock source for the CCP modules bit 5-4 T3CKPS<1:0>: Timer3 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 2 T3SYNC: Timer3 External Clock Input Synchronization Control bit (Not usable if the device clock comes from Timer1/Timer3.) When TMR3CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR3CS = 0: This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0. bit 1 TMR3CS: Timer3 Clock Source Select bit 1 = External clock input from Timer1 oscillator or T13CKI (on the rising edge after the first falling edge) 0 = Internal clock (FOSC/4) bit 0 TMR3ON: Timer3 On bit 1 = Enables Timer3 0 = Stops Timer3 PIC18F2420/2520/4420/4520 DS39631E-page 136 © 2008 Microchip Technology Inc. 14.1 Timer3 Operation Timer3 can operate in one of three modes: • Timer • Synchronous Counter • Asynchronous Counter The operating mode is determined by the clock select bit, TMR3CS (T3CON<1>). When TMR3CS is cleared (= 0), Timer3 increments on every internal instruction cycle (FOSC/4). When the bit is set, Timer3 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. As with Timer1, the RC1/T1OSI and RC0/T1OSO/ T13CKI pins become inputs when the Timer1 oscillator is enabled. This means the values of TRISC<1:0> are ignored and the pins are read as ‘0’. FIGURE 14-1: TIMER3 BLOCK DIAGRAM FIGURE 14-2: TIMER3 BLOCK DIAGRAM (16-BIT READ/WRITE MODE) T3SYNC TMR3CS T3CKPS<1:0> Sleep Input T1OSCEN(1) FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T1OSO/T13CKI T1OSI 1 0 TMR3ON TMR3L Set TMR3IF on Overflow TMR3 High Byte Timer1 Oscillator Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. On/Off Timer3 CCP1/CCP2 Special Event Trigger CCP1/CCP2 Select from T3CON<6,3> Clear TMR3 Timer1 Clock Input T3SYNC TMR3CS T3CKPS<1:0> Sleep Input T1OSCEN(1) FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T13CKI/T1OSO T1OSI Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. 1 0 TMR3L Internal Data Bus 8 Set TMR3IF on Overflow TMR3 TMR3H High Byte 8 8 8 Read TMR1L Write TMR1L 8 TMR3ON CCP1/CCP2 Special Event Trigger Timer1 Oscillator On/Off Timer3 Timer1 Clock Input CCP1/CCP2 Select from T3CON<6,3> Clear TMR3 © 2008 Microchip Technology Inc. DS39631E-page 137 PIC18F2420/2520/4420/4520 14.2 Timer3 16-Bit Read/Write Mode Timer3 can be configured for 16-bit reads and writes (see Figure 14-2). When the RD16 control bit (T3CON<7>) is set, the address for TMR3H is mapped to a buffer register for the high byte of Timer3. A read from TMR3L will load the contents of the high byte of Timer3 into the Timer3 High Byte Buffer register. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. A write to the high byte of Timer3 must also take place through the TMR3H Buffer register. The Timer3 high byte is updated with the contents of TMR3H when a write occurs to TMR3L. This allows a user to write all 16 bits to both the high and low bytes of Timer3 at once. The high byte of Timer3 is not directly readable or writable in this mode. All reads and writes must take place through the Timer3 High Byte Buffer register. Writes to TMR3H do not clear the Timer3 prescaler. The prescaler is only cleared on writes to TMR3L. 14.3 Using the Timer1 Oscillator as the Timer3 Clock Source The Timer1 internal oscillator may be used as the clock source for Timer3. The Timer1 oscillator is enabled by setting the T1OSCEN (T1CON<3>) bit. To use it as the Timer3 clock source, the TMR3CS bit must also be set. As previously noted, this also configures Timer3 to increment on every rising edge of the oscillator source. The Timer1 oscillator is described in Section 12.0 “Timer1 Module”. 14.4 Timer3 Interrupt The TMR3 register pair (TMR3H:TMR3L) increments from 0000h to FFFFh and overflows to 0000h. The Timer3 interrupt, if enabled, is generated on overflow and is latched in interrupt flag bit, TMR3IF (PIR2<1>). This interrupt can be enabled or disabled by setting or clearing the Timer3 Interrupt Enable bit, TMR3IE (PIE2<1>). 14.5 Resetting Timer3 Using the CCP Special Event Trigger If either of the CCP modules is configured to use Timer3 and to generate a Special Event Trigger in Compare mode (CCP1M<3:0> or CCP2M<3:0> = 1011), this signal will reset Timer3. It will also start an A/D conversion if the A/D module is enabled (see Section 15.3.4 “Special Event Trigger” for more information). The module must be configured as either a timer or synchronous counter to take advantage of this feature. When used this way, the CCPRxH:CCPRxL register pair effectively becomes a Period register for Timer3. If Timer3 is running in Asynchronous Counter mode, the Reset operation may not work. In the event that a write to Timer3 coincides with a Special Event Trigger from a CCP module, the write will take precedence. TABLE 14-1: REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER Note: The Special Event Triggers from the CCP2 module will not set the TMR3IF interrupt flag bit (PIR1<0>). Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 TMR3L Timer3 Register Low Byte 51 TMR3H Timer3 Register High Byte 51 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer3 module. PIC18F2420/2520/4420/4520 DS39631E-page 138 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 139 PIC18F2420/2520/4420/4520 15.0 CAPTURE/COMPARE/PWM (CCP) MODULES PIC18F2420/2520/4420/4520 devices all have two CCP (Capture/Compare/PWM) modules. Each module contains a 16-bit register which can operate as a 16-bit Capture register, a 16-bit Compare register or a PWM Master/Slave Duty Cycle register. In 28-pin devices, the two standard CCP modules (CCP1 and CCP2) operate as described in this chapter. In 40/ 44-pin devices, CCP1 is implemented as an Enhanced CCP module with standard Capture and Compare modes and Enhanced PWM modes. The ECCP implementation is discussed in Section 16.0 “Enhanced Capture/Compare/PWM (ECCP) Module”. The capture and compare operations described in this chapter apply to all standard and Enhanced CCP modules. Note: Throughout this section and Section 16.0 “Enhanced Capture/Compare/PWM (ECCP) Module”, references to the register and bit names for CCP modules are referred to generically by the use of ‘x’ or ‘y’ in place of the specific module number. Thus, “CCPxCON” might refer to the control register for CCP1, CCP2 or ECCP1. “CCPxCON” is used throughout these sections to refer to the module control register, regardless of whether the CCP module is a standard or enhanced implementation. REGISTER 15-1: CCPxCON: CCPx CONTROL REGISTER (28-PIN DEVICES) U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — DCxB1 DCxB0 CCPxM3 CCPxM2 CCPxM1 CCPxM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 DCxB<1:0>: PWM Duty Cycle bit 1 and bit 0 for CCPx Module Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs (bit 1 and bit 0) of the 10-bit PWM duty cycle. The eight MSbs (DCxB<9:2>) of the duty cycle are found in CCPRxL. bit 3-0 CCPxM<3:0>: CCPx Module Mode Select bits 0000 = Capture/Compare/PWM disabled (resets CCPx module) 0001 = Reserved 0010 = Compare mode, toggle output on match (CCPxIF bit is set) 0011 = Reserved 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, initialize CCPx pin low; on compare match, force CCPx pin high (CCPxIF bit is set) 1001 = Compare mode, initialize CCPx pin high; on compare match, force CCPx pin low (CCPxIF bit is set) 1010 = Compare mode, generate software interrupt on compare match (CCPxIF bit is set, CCPx pin reflects I/O state) 1011 = Compare mode, trigger special event; reset timer; CCP2 match starts A/D conversion (CCPxIF bit is set) 11xx = PWM mode PIC18F2420/2520/4420/4520 DS39631E-page 140 © 2008 Microchip Technology Inc. 15.1 CCP Module Configuration Each Capture/Compare/PWM module is associated with a control register (generically, CCPxCON) and a data register (CCPRx). The data register, in turn, is comprised of two 8-bit registers: CCPRxL (low byte) and CCPRxH (high byte). All registers are both readable and writable. 15.1.1 CCP MODULES AND TIMER RESOURCES The CCP modules utilize Timers 1, 2 or 3, depending on the mode selected. Timer1 and Timer3 are available to modules in Capture or Compare modes, while Timer2 is available for modules in PWM mode. TABLE 15-1: CCP MODE – TIMER RESOURCE The assignment of a particular timer to a module is determined by the Timer to CCP enable bits in the T3CON register (Register 14-1). Both modules may be active at any given time and may share the same timer resource if they are configured to operate in the same mode (Capture/Compare or PWM) at the same time. The interactions between the two modules are summarized in Figure 15-1 and Figure 15-2. In Timer1 in Asynchronous Counter mode, the capture operation will not work. 15.1.2 CCP2 PIN ASSIGNMENT The pin assignment for CCP2 (Capture input, Compare and PWM output) can change, based on device configuration. The CCP2MX Configuration bit determines which pin CCP2 is multiplexed to. By default, it is assigned to RC1 (CCP2MX = 1). If the Configuration bit is cleared, CCP2 is multiplexed with RB3. Changing the pin assignment of CCP2 does not automatically change any requirements for configuring the port pin. Users must always verify that the appropriate TRIS register is configured correctly for CCP2 operation, regardless of where it is located. TABLE 15-2: INTERACTIONS BETWEEN CCP1 AND CCP2 FOR TIMER RESOURCES CCP/ECCP Mode Timer Resource Capture Compare PWM Timer1 or Timer3 Timer1 or Timer3 Timer2 CCP1 Mode CCP2 Mode Interaction Capture Capture Each module can use TMR1 or TMR3 as the time base. The time base can be different for each CCP. Capture Compare CCP2 can be configured for the Special Event Trigger to reset TMR1 or TMR3 (depending upon which time base is used). Automatic A/D conversions on trigger event can also be done. Operation of CCP1 could be affected if it is using the same timer as a time base. Compare Capture CCP1 can be configured for the Special Event Trigger to reset TMR1 or TMR3 (depending upon which time base is used). Operation of CCP2 could be affected if it is using the same timer as a time base. Compare Compare Either module can be configured for the Special Event Trigger to reset the time base. Automatic A/D conversions on CCP2 trigger event can be done. Conflicts may occur if both modules are using the same time base. Capture PWM(1) None Compare PWM(1) None PWM(1) Capture None PWM(1) Compare None PWM(1) PWM(1) Both PWMs will have the same frequency and update rate (TMR2 interrupt). Note 1: Includes standard and Enhanced PWM operation. © 2008 Microchip Technology Inc. DS39631E-page 141 PIC18F2420/2520/4420/4520 15.2 Capture Mode In Capture mode, the CCPRxH:CCPRxL register pair captures the 16-bit value of the TMR1 or TMR3 register when an event occurs on the corresponding CCPx pin. An event is defined as one of the following: • every falling edge • every rising edge • every 4th rising edge • every 16th rising edge The event is selected by the mode select bits, CCPxM<3:0> (CCPxCON<3:0>). When a capture is made, the interrupt request flag bit, CCPxIF, is set; it must be cleared in software. If another capture occurs before the value in register CCPRx is read, the old captured value is overwritten by the new captured value. 15.2.1 CCP PIN CONFIGURATION In Capture mode, the appropriate CCPx pin should be configured as an input by setting the corresponding TRIS direction bit. 15.2.2 TIMER1/TIMER3 MODE SELECTION The timers that are to be used with the capture feature (Timer1 and/or Timer3) must be running in Timer mode or Synchronized Counter mode. In Asynchronous Counter mode, the capture operation will not work. The timer to be used with each CCP module is selected in the T3CON register (see Section 15.1.1 “CCP Modules and Timer Resources”). 15.2.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCPxIE interrupt enable bit clear to avoid false interrupts. The interrupt flag bit, CCPxIF, should also be cleared following any such change in operating mode. 15.2.4 CCP PRESCALER There are four prescaler settings in Capture mode; they are specified as part of the operating mode selected by the mode select bits (CCPxM<3:0>). Whenever the CCP module is turned off, or Capture mode is disabled, the prescaler counter is cleared. This means that any Reset will clear the prescaler counter. Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared; therefore, the first capture may be from a non-zero prescaler. Example 15-1 shows the recommended method for switching between capture prescalers. This example also clears the prescaler counter and will not generate the “false” interrupt. EXAMPLE 15-1: CHANGING BETWEEN CAPTURE PRESCALERS (CCP2 SHOWN) FIGURE 15-1: CAPTURE MODE OPERATION BLOCK DIAGRAM Note: If RB3/CCP2 or RC1/CCP2 is configured as an output, a write to the port can cause a capture condition. CLRF CCP2CON ; Turn CCP module off MOVLW NEW_CAPT_PS ; Load WREG with the ; new prescaler mode ; value and CCP ON MOVWF CCP2CON ; Load CCP2CON with ; this value CCPR1H CCPR1L TMR1H TMR1L Set CCP1IF TMR3 Enable Q1:Q4 CCP1CON<3:0> CCP1 pin Prescaler ÷ 1, 4, 16 and Edge Detect TMR1 Enable T3CCP2 T3CCP2 CCPR2H CCPR2L TMR1H TMR1L Set CCP2IF TMR3 Enable CCP2CON<3:0> CCP2 pin Prescaler ÷ 1, 4, 16 TMR3H TMR3L TMR1 Enable T3CCP2 T3CCP1 T3CCP2 T3CCP1 TMR3H TMR3L and Edge Detect 4 4 4 PIC18F2420/2520/4420/4520 DS39631E-page 142 © 2008 Microchip Technology Inc. 15.3 Compare Mode In Compare mode, the 16-bit CCPRx register value is constantly compared against either the TMR1 or TMR3 register pair value. When a match occurs, the CCPx pin can be: • driven high • driven low • toggled (high-to-low or low-to-high) • remain unchanged (that is, reflects the state of the I/O latch) The action on the pin is based on the value of the mode select bits (CCPxM<3:0>). At the same time, the interrupt flag bit, CCPxIF, is set. 15.3.1 CCP PIN CONFIGURATION The user must configure the CCPx pin as an output by clearing the appropriate TRIS bit. 15.3.2 TIMER1/TIMER3 MODE SELECTION Timer1 and/or Timer3 must be running in Timer mode or Synchronized Counter mode if the CCP module is using the compare feature. In Asynchronous Counter mode, the compare operation may not work. 15.3.3 SOFTWARE INTERRUPT MODE When the Generate Software Interrupt mode is chosen (CCPxM<3:0> = 1010), the corresponding CCPx pin is not affected. A CCP interrupt is generated when the CCPxIF interrupt flag is set while the CCPxIE bit is set. 15.3.4 SPECIAL EVENT TRIGGER Both CCP modules are equipped with a Special Event Trigger. This is an internal hardware signal generated in Compare mode to trigger actions by other modules. The Special Event Trigger is enabled by selecting the Compare Special Event Trigger mode (CCPxM<3:0> = 1011). For either CCP module, the Special Event Trigger resets the Timer register pair for whichever timer resource is currently assigned as the module’s time base. This allows the CCPRx registers to serve as a programmable Period register for either timer. The Special Event Trigger for CCP2 can also start an A/D conversion. In order to do this, the A/D Converter must already be enabled. FIGURE 15-2: COMPARE MODE OPERATION BLOCK DIAGRAM Note: Clearing the CCP2CON register will force the RB3 or RC1 compare output latch (depending on device configuration) to the default low level. This is not the PORTB or PORTC I/O data latch. CCPR1H CCPR1L TMR1H TMR1L Comparator S Q R Output Logic Special Event Trigger Set CCP1IF CCP1 pin TRIS CCP1CON<3:0> Output Enable TMR3H TMR3L CCPR2H CCPR2L Comparator 1 0 T3CCP2 T3CCP1 Set CCP2IF 1 0 Compare 4 (Timer1/Timer3 Reset) S Q R Output Logic Special Event Trigger CCP2 pin TRIS CCP2CON<3:0> 4 Output Enable (Timer1/Timer3 Reset, A/D Trigger) Match Compare Match © 2008 Microchip Technology Inc. DS39631E-page 143 PIC18F2420/2520/4420/4520 TABLE 15-3: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 RCON IPEN SBOREN — RI TO PD POR BOR 48 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 TRISB PORTB Data Direction Register 52 TRISC PORTC Data Direction Register 52 TMR1L Timer1 Register Low Byte 50 TMR1H Timer1 Register High Byte 50 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 TMR3H Timer3 Register High Byte 51 TMR3L Timer3 Register Low Byte 51 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51 CCPR1L Capture/Compare/PWM Register 1 Low Byte 51 CCPR1H Capture/Compare/PWM Register 1 High Byte 51 CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 CCPR2L Capture/Compare/PWM Register 2 Low Byte 51 CCPR2H Capture/Compare/PWM Register 2 High Byte 51 CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Capture/Compare, Timer1 or Timer3. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. PIC18F2420/2520/4420/4520 DS39631E-page 144 © 2008 Microchip Technology Inc. 15.4 PWM Mode In Pulse-Width Modulation (PWM) mode, the CCPx pin produces up to a 10-bit resolution PWM output. Since the CCP2 pin is multiplexed with a PORTB or PORTC data latch, the appropriate TRIS bit must be cleared to make the CCP2 pin an output. Figure 15-3 shows a simplified block diagram of the CCP module in PWM mode. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 15.4.4 “Setup for PWM Operation”. FIGURE 15-3: SIMPLIFIED PWM BLOCK DIAGRAM A PWM output (Figure 15-4) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period). FIGURE 15-4: PWM OUTPUT 15.4.1 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following formula: EQUATION 15-1: PWM frequency is defined as 1/[PWM period]. When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCPx pin is set (exception: if PWM duty cycle = 0%, the CCPx pin will not be set) • The PWM duty cycle is latched from CCPRxL into CCPRxH 15.4.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing to the CCPRxL register and to the CCPxCON<5:4> bits. Up to 10-bit resolution is available. The CCPRxL contains the eight MSbs and the CCPxCON<5:4> bits contain the two LSbs. This 10-bit value is represented by CCPRxL:CCPxCON<5:4>. The following equation is used to calculate the PWM duty cycle in time: EQUATION 15-2: CCPRxL and CCPxCON<5:4> can be written to at any time, but the duty cycle value is not latched into CCPRxH until after a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPRxH is a read-only register. Note: Clearing the CCP2CON register will force the RB3 or RC1 output latch (depending on device configuration) to the default low level. This is not the PORTB or PORTC I/O data latch. CCPRxL CCPRxH (Slave) Comparator TMR2 Comparator PR2 (Note 1) R Q S Duty Cycle Registers CCPxCON<5:4> Clear Timer, CCPx pin and latch D.C. Note 1: The 8-bit TMR2 value is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit time base. CCPx Output Corresponding TRIS bit Period Duty Cycle TMR2 = PR2 TMR2 = Duty Cycle TMR2 = PR2 Note: The Timer2 postscalers (see Section 13.0 “Timer2 Module”) are not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. PWM Period = [(PR2) + 1] • 4 • TOSC • (TMR2 Prescale Value) PWM Duty Cycle = (CCPRXL:CCPXCON<5:4>) • TOSC • (TMR2 Prescale Value) © 2008 Microchip Technology Inc. DS39631E-page 145 PIC18F2420/2520/4420/4520 The CCPRxH register and a 2-bit internal latch are used to double-buffer the PWM duty cycle. This double-buffering is essential for glitchless PWM operation. When the CCPRxH and 2-bit latch match TMR2, concatenated with an internal 2-bit Q clock or 2 bits of the TMR2 prescaler, the CCPx pin is cleared. The maximum PWM resolution (bits) for a given PWM frequency is given by the equation: EQUATION 15-3: TABLE 15-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz 15.4.3 PWM AUTO-SHUTDOWN (CCP1 ONLY) The PWM auto-shutdown features of the Enhanced CCP module are also available to CCP1 in 28-pin devices. The operation of this feature is discussed in detail in Section 16.4.7 “Enhanced PWM Auto-Shutdown”. Auto-shutdown features are not available for CCP2. 15.4.4 SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for PWM operation: 1. Set the PWM period by writing to the PR2 register. 2. Set the PWM duty cycle by writing to the CCPRxL register and CCPxCON<5:4> bits. 3. Make the CCPx pin an output by clearing the appropriate TRIS bit. 4. Set the TMR2 prescale value, then enable Timer2 by writing to T2CON. 5. Configure the CCPx module for PWM operation. Note: If the PWM duty cycle value is longer than the PWM period, the CCPx pin will not be cleared. FOSC FPWM --------------- ⎝ ⎠ ⎛ ⎞ log log( ) 2 PWM Resolution (max) = -----------------------------bits PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz Timer Prescaler (1, 4, 16) 16 4 1 1 1 1 PR2 Value FFh FFh FFh 3Fh 1Fh 17h Maximum Resolution (bits) 10 10 10 8 7 6.58 PIC18F2420/2520/4420/4520 DS39631E-page 146 © 2008 Microchip Technology Inc. TABLE 15-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 RCON IPEN SBOREN — RI TO PD POR BOR 48 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TRISB PORTB Data Direction Register 52 TRISC PORTC Data Direction Register 52 TMR2 Timer2 Register 50 PR2 Timer2 Period Register 50 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50 CCPR1L Capture/Compare/PWM Register 1 Low Byte 51 CCPR1H Capture/Compare/PWM Register 1 High Byte 51 CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 CCPR2L Capture/Compare/PWM Register 2 Low Byte 51 CCPR2H Capture/Compare/PWM Register 2 High Byte 51 CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 51 ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) 51 PWM1CON PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PWM or Timer2. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. © 2008 Microchip Technology Inc. DS39631E-page 147 PIC18F2420/2520/4420/4520 16.0 ENHANCED CAPTURE/ COMPARE/PWM (ECCP) MODULE In PIC18F4420/4520 devices, CCP1 is implemented as a standard CCP module with Enhanced PWM capabilities. These include the provision for 2 or 4 output channels, user-selectable polarity, dead-band control and automatic shutdown and restart. The enhanced features are discussed in detail in Section 16.4 “Enhanced PWM Mode”. Capture, Compare and single output PWM functions of the ECCP module are the same as described for the standard CCP module. The control register for the Enhanced CCP module is shown in Register 16-2. It differs from the CCPxCON registers in PIC18F2420/2520 devices in that the two Most Significant bits are implemented to control PWM functionality. Note: The ECCP module is implemented only in 40/44-pin devices. REGISTER 16-1: CCP1CON: ECCP CONTROL REGISTER (40/44-PIN DEVICES) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 P1M<1:0>: Enhanced PWM Output Configuration bits If CCP1M3:CCP1M2 = 00, 01, 10: xx = P1A assigned as capture/compare input/output; P1B, P1C, P1D assigned as port pins If CCP1M3:CCP1M2 = 11: 00 = Single output, P1A modulated; P1B, P1C, P1D assigned as port pins 01 = Full-bridge output forward, P1D modulated; P1A active; P1B, P1C inactive 10 = Half-bridge output, P1A, P1B modulated with dead-band control; P1C, P1D assigned as port pins 11 = Full-bridge output reverse, P1B modulated; P1C active; P1A, P1D inactive bit 5-4 DC1B<1:0>: PWM Duty Cycle bit 1 and bit 0 Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs of the 10-bit PWM duty cycle. The eight MSbs of the duty cycle are found in CCPR1L. bit 3-0 CCP1M<3:0>: Enhanced CCP Mode Select bits 0000 = Capture/Compare/PWM off (resets ECCP module) 0001 = Reserved 0010 = Compare mode, toggle output on match 0011 = Capture mode 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, initialize CCP1 pin low; set output on compare match (set CCP1IF) 1001 = Compare mode, initialize CCP1 pin high; clear output on compare match (set CCP1IF) 1010 = Compare mode, generate software interrupt only; CCP1 pin reverts to I/O state 1011 = Compare mode, trigger special event (ECCP resets TMR1 or TMR3, sets CCP1IF bit) 1100 = PWM mode, P1A, P1C active-high; P1B, P1D active-high 1101 = PWM mode, P1A, P1C active-high; P1B, P1D active-low 1110 = PWM mode, P1A, P1C active-low; P1B, P1D active-high 1111 = PWM mode, P1A, P1C active-low; P1B, P1D active-low PIC18F2420/2520/4420/4520 DS39631E-page 148 © 2008 Microchip Technology Inc. In addition to the expanded range of modes available through the CCP1CON register and ECCP1AS register, the ECCP module has an additional register associated with Enhanced PWM operation and auto-shutdown features. It is: • PWM1CON (PWM Dead-Band Delay) 16.1 ECCP Outputs and Configuration The Enhanced CCP module may have up to four PWM outputs, depending on the selected operating mode. These outputs, designated P1A through P1D, are multiplexed with I/O pins on PORTC and PORTD. The outputs that are active depend on the CCP operating mode selected. The pin assignments are summarized in Table 16-1. To configure the I/O pins as PWM outputs, the proper PWM mode must be selected by setting the P1M<1:0> and CCP1M<3:0> bits. The appropriate TRISC and TRISD direction bits for the port pins must also be set as outputs. 16.1.1 ECCP MODULES AND TIMER RESOURCES Like the standard CCP modules, the ECCP module can utilize Timers 1, 2 or 3, depending on the mode selected. Timer1 and Timer3 are available for modules in Capture or Compare modes, while Timer2 is available for modules in PWM mode. Interactions between the standard and Enhanced CCP modules are identical to those described for standard CCP modules. Additional details on timer resources are provided in Section 15.1.1 “CCP Modules and Timer Resources”. 16.2 Capture and Compare Modes Except for the operation of the Special Event Trigger discussed below, the Capture and Compare modes of the ECCP module are identical in operation to that of CCP2. These are discussed in detail in Section 15.2 “Capture Mode” and Section 15.3 “Compare Mode”. No changes are required when moving between 28-pin and 40/44-pin devices. 16.2.1 SPECIAL EVENT TRIGGER The Special Event Trigger output of ECCP resets the TMR1 or TMR3 register pair, depending on which timer resource is currently selected. This allows the CCPR1 register to effectively be a 16-Bit Programmable Period register for Timer1 or Timer3. 16.3 Standard PWM Mode When configured in Single Output mode, the ECCP module functions identically to the standard CCP module in PWM mode, as described in Section 15.4 “PWM Mode”. This is also sometimes referred to as “Compatible CCP” mode, as in Table 16-1. TABLE 16-1: PIN ASSIGNMENTS FOR VARIOUS ECCP MODES Note: When setting up single output PWM operations, users are free to use either of the processes described in Section 15.4.4 “Setup for PWM Operation” or Section 16.4.9 “Setup for PWM Operation”. The latter is more generic and will work for either single or multi-output PWM. ECCP Mode CCP1CON Configuration RC2 RD5 RD6 RD7 All 40/44-Pin Devices: Compatible CCP 00xx 11xx CCP1 RD5/PSP5 RD6/PSP6 RD7/PSP7 Dual PWM 10xx 11xx P1A P1B RD6/PSP6 RD7/PSP7 Quad PWM x1xx 11xx P1A P1B P1C P1D Legend: x = Don’t care. Shaded cells indicate pin assignments not used by ECCP in a given mode. © 2008 Microchip Technology Inc. DS39631E-page 149 PIC18F2420/2520/4420/4520 16.4 Enhanced PWM Mode The Enhanced PWM mode provides additional PWM output options for a broader range of control applications. The module is a backward compatible version of the standard CCP module and offers up to four outputs, designated P1A through P1D. Users are also able to select the polarity of the signal (either active-high or active-low). The module’s output mode and polarity are configured by setting the P1M<1:0> and CCP1M<3:0> bits of the CCP1CON register. Figure 16-1 shows a simplified block diagram of PWM operation. All control registers are double-buffered and are loaded at the beginning of a new PWM cycle (the period boundary when Timer2 resets) in order to prevent glitches on any of the outputs. The exception is the PWM Dead-Band Delay register, PWM1CON, which is loaded at either the duty cycle boundary or the period boundary (whichever comes first). Because of the buffering, the module waits until the assigned timer resets instead of starting immediately. This means that Enhanced PWM waveforms do not exactly match the standard PWM waveforms, but are instead offset by one full instruction cycle (4 TOSC). As before, the user must manually configure the appropriate TRIS bits for output. 16.4.1 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following equation. EQUATION 16-1: PWM frequency is defined as 1/[PWM period]. When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCP1 pin is set (if PWM duty cycle = 0%, the CCP1 pin will not be set) • The PWM duty cycle is copied from CCPR1L into CCPR1H FIGURE 16-1: SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODULE Note: The Timer2 postscaler (see Section 13.0 “Timer2 Module”) is not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. PWM Period = [(PR2) + 1] • 4 • TOSC • (TMR2 Prescale Value) CCPR1L CCPR1H (Slave) Comparator TMR2 Comparator PR2 (Note 1) R Q S Duty Cycle Registers CCP1CON<5:4> Clear Timer, set CCP1 pin and latch D.C. Note: The 8-bit TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit time base. TRISx CCP1/P1A TRISx P1B TRISx TRISx P1D Output Controller P1M1<1:0> 2 CCP1M<3:0> 4 PWM1CON CCP1/P1A P1B P1C P1D P1C PIC18F2420/2520/4420/4520 DS39631E-page 150 © 2008 Microchip Technology Inc. 16.4.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing to the CCPR1L register and to the CCP1CON<5:4> bits. Up to 10-bit resolution is available. The CCPR1L contains the eight MSbs and the CCP1CON<5:4> bits contain the two LSbs. This 10-bit value is represented by CCPR1L:CCP1CON<5:4>. The PWM duty cycle is calculated by the following equation. EQUATION 16-2: CCPR1L and CCP1CON<5:4> can be written to at any time, but the duty cycle value is not copied into CCPR1H until a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPR1H is a read-only register. The CCPR1H register and a 2-bit internal latch are used to double-buffer the PWM duty cycle. This double-buffering is essential for glitchless PWM operation. When the CCPR1H and 2-bit latch match TMR2, concatenated with an internal 2-bit Q clock or two bits of the TMR2 prescaler, the CCP1 pin is cleared. The maximum PWM resolution (bits) for a given PWM frequency is given by the following equation. EQUATION 16-3: 16.4.3 PWM OUTPUT CONFIGURATIONS The P1M<1:0> bits in the CCP1CON register allow one of four configurations: • Single Output • Half-Bridge Output • Full-Bridge Output, Forward mode • Full-Bridge Output, Reverse mode The Single Output mode is the standard PWM mode discussed in Section 16.4 “Enhanced PWM Mode”. The Half-Bridge and Full-Bridge Output modes are covered in detail in the sections that follow. The general relationship of the outputs in all configurations is summarized in Figure 16-2 and Figure 16-3. TABLE 16-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz PWM Duty Cycle = (CCPR1L:CCP1CON<5:4>) • TOSC • (TMR2 Prescale Value) Note: If the PWM duty cycle value is longer than the PWM period, the CCP1 pin will not be cleared. ( ) PWM Resolution (max) = FOSC FPWM log log(2) bits PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz Timer Prescaler (1, 4, 16) 16 4 1 1 1 1 PR2 Value FFh FFh FFh 3Fh 1Fh 17h Maximum Resolution (bits) 10 10 10 8 7 6.58 © 2008 Microchip Technology Inc. DS39631E-page 151 PIC18F2420/2520/4420/4520 FIGURE 16-2: PWM OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE) FIGURE 16-3: PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE) 0 Period 00 10 01 11 SIGNAL PR2 + 1 CCP1CON<7:6> P1A Modulated P1A Modulated P1B Modulated P1A Active P1B Inactive P1C Inactive P1D Modulated P1A Inactive P1B Modulated P1C Active P1D Inactive Duty Cycle (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay(1) Delay(1) 0 Period 00 10 01 11 SIGNAL PR2 + 1 CCP1CON<7:6> P1A Modulated P1A Modulated P1B Modulated P1A Active P1B Inactive P1C Inactive P1D Modulated P1A Inactive P1B Modulated P1C Active P1D Inactive Duty Cycle (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay(1) Delay(1) Relationships: • Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value) • Duty Cycle = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value) • Delay = 4 * TOSC * (PWM1CON<6:0>) Note 1: Dead-band delay is programmed using the PWM1CON register (see Section 16.4.6 “Programmable Dead-Band Delay”). PIC18F2420/2520/4420/4520 DS39631E-page 152 © 2008 Microchip Technology Inc. 16.4.4 HALF-BRIDGE MODE In the Half-Bridge Output mode, two pins are used as outputs to drive push-pull loads. The PWM output signal is output on the P1A pin, while the complementary PWM output signal is output on the P1B pin (Figure 16-4). This mode can be used for half-bridge applications, as shown in Figure 16-5, or for full-bridge applications where four power switches are being modulated with two PWM signals. In Half-Bridge Output mode, the programmable deadband delay can be used to prevent shoot-through current in half-bridge power devices. The value of bits, PDC<6:0>, sets the number of instruction cycles before the output is driven active. If the value is greater than the duty cycle, the corresponding output remains inactive during the entire cycle. See Section 16.4.6 “Programmable Dead-Band Delay” for more details of the dead-band delay operations. Since the P1A and P1B outputs are multiplexed with the PORTC<2> and PORTD<5> data latches, the TRISC<2> and TRISD<5> bits must be cleared to configure P1A and P1B as outputs. FIGURE 16-4: HALF-BRIDGE PWM OUTPUT FIGURE 16-5: EXAMPLES OF HALF-BRIDGE OUTPUT MODE APPLICATIONS Period Duty Cycle td td (1) P1A(2) P1B(2) td = Dead-Band Delay Period (1) (1) Note 1: At this time, the TMR2 register is equal to the PR2 register. 2: Output signals are shown as active-high. PIC18F4X2X P1A P1B FET Driver FET Driver V+ V- Load + V - + V - FET Driver FET Driver V+ V- Load FET Driver FET Driver PIC18F4X2X P1A P1B Standard Half-Bridge Circuit (“Push-Pull”) Half-Bridge Output Driving a Full-Bridge Circuit © 2008 Microchip Technology Inc. DS39631E-page 153 PIC18F2420/2520/4420/4520 16.4.5 FULL-BRIDGE MODE In Full-Bridge Output mode, four pins are used as outputs; however, only two outputs are active at a time. In the Forward mode, pin P1A is continuously active and pin P1D is modulated. In the Reverse mode, pin P1C is continuously active and pin P1B is modulated. These are illustrated in Figure 16-6. P1A, P1B, P1C and P1D outputs are multiplexed with the PORTC<2> and PORTD<7:5> data latches. The TRISC<2> and TRISD<7:5> bits must be cleared to make the P1A, P1B, P1C and P1D pins outputs. FIGURE 16-6: FULL-BRIDGE PWM OUTPUT Period Duty Cycle P1A(2) P1B(2) P1C(2) P1D(2) Forward Mode (1) Period Duty Cycle P1A(2) P1C(2) P1D(2) P1B(2) Reverse Mode (1) (1) (1) Note 1: At this time, the TMR2 register is equal to the PR2 register. Note 2: Output signal is shown as active-high. PIC18F2420/2520/4420/4520 DS39631E-page 154 © 2008 Microchip Technology Inc. FIGURE 16-7: EXAMPLE OF FULL-BRIDGE OUTPUT MODE APPLICATION 16.4.5.1 Direction Change in Full-Bridge Mode In the Full-Bridge Output mode, the P1M1 bit in the CCP1CON register allows user to control the forward/ reverse direction. When the application firmware changes this direction control bit, the module will assume the new direction on the next PWM cycle. Just before the end of the current PWM period, the modulated outputs (P1B and P1D) are placed in their inactive state, while the unmodulated outputs (P1A and P1C) are switched to drive in the opposite direction. This occurs in a time interval of 4 TOSC * (Timer2 Prescale Value) before the next PWM period begins. The Timer2 prescaler will be either 1, 4 or 16, depending on the value of the T2CKPS<1:0> bits (T2CON<1:0>). During the interval from the switch of the unmodulated outputs to the beginning of the next period, the modulated outputs (P1B and P1D) remain inactive. This relationship is shown in Figure 16-8. Note that in the Full-Bridge Output mode, the CCP1 module does not provide any dead-band delay. In general, since only one output is modulated at all times, dead-band delay is not required. However, there is a situation where a dead-band delay might be required. This situation occurs when both of the following conditions are true: 1. The direction of the PWM output changes when the duty cycle of the output is at or near 100%. 2. The turn-off time of the power switch, including the power device and driver circuit, is greater than the turn-on time. Figure 16-9 shows an example where the PWM direction changes from forward to reverse at a near 100% duty cycle. At time t1, the outputs P1A and P1D become inactive, while output P1C becomes active. In this example, since the turn-off time of the power devices is longer than the turn-on time, a shoot-through current may flow through power devices, QC and QD (see Figure 16-7), for the duration of ‘t’. The same phenomenon will occur to power devices, QA and QB, for PWM direction change from reverse to forward. If changing PWM direction at high duty cycle is required for an application, one of the following requirements must be met: 1. Reduce PWM for a PWM period before changing directions. 2. Use switch drivers that can drive the switches off faster than they can drive them on. Other options to prevent shoot-through current may exist. P1A P1C FET Driver FET Driver V+ V- Load FET Driver FET Driver P1B P1D QA QB QD QC PIC18F4X2X © 2008 Microchip Technology Inc. DS39631E-page 155 PIC18F2420/2520/4420/4520 FIGURE 16-8: PWM DIRECTION CHANGE FIGURE 16-9: PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE DC Period(1) SIGNAL Note 1: The direction bit in the CCP1 Control register (CCP1CON<7>) is written any time during the PWM cycle. 2: When changing directions, the P1A and P1C signals switch before the end of the current PWM cycle at intervals of 4 TOSC, 16 TOSC or 64 TOSC, depending on the Timer2 prescaler value. The modulated P1B and P1D signals are inactive at this time. Period (Note 2) P1A (Active-High) P1B (Active-High) P1C (Active-High) P1D (Active-High) DC Forward Period Reverse Period P1A(1) tON(2) tOFF(3) t = tOFF – tON(2,3) P1B(1) P1C(1) P1D(1) External Switch D(1) Potential Shoot-Through Current(1) Note 1: All signals are shown as active-high. 2: tON is the turn-on delay of power switch, QC, and its driver. 3: tOFF is the turn-off delay of power switch, QD, and its driver. External Switch C(1) t1 DC DC PIC18F2420/2520/4420/4520 DS39631E-page 156 © 2008 Microchip Technology Inc. 16.4.6 PROGRAMMABLE DEAD-BAND DELAY In half-bridge applications where all power switches are modulated at the PWM frequency at all times, the power switches normally require more time to turn off than to turn on. If both the upper and lower power switches are switched at the same time (one turned on and the other turned off), both switches may be on for a short period of time until one switch completely turns off. During this brief interval, a very high current (shootthrough current) may flow through both power switches, shorting the bridge supply. To avoid this potentially destructive shoot-through current from flowing during switching, turning on either of the power switches is normally delayed to allow the other switch to completely turn off. In the Half-Bridge Output mode, a digitally programmable dead-band delay is available to avoid shoot-through current from destroying the bridge power switches. The delay occurs at the signal transition from the nonactive state to the active state (see Figure 16-4 for illustration). Bits, PDC<6:0>, of the PWM1CON register (Register 16-2) set the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). These bits are not available on 28-pin devices as the standard CCP module does not support half-bridge operation. 16.4.7 ENHANCED PWM AUTO-SHUTDOWN When the CCP1 is programmed for any of the Enhanced PWM modes, the active output pins may be configured for auto-shutdown. Auto-shutdown immediately places the Enhanced PWM output pins into a defined shutdown state when a shutdown event occurs. A shutdown event can be caused by either of the comparator modules, a low level on the Fault input pin (FLT0) or any combination of these three sources. The comparators may be used to monitor a voltage input proportional to a current being monitored in the bridge circuit. If the voltage exceeds a threshold, the comparator switches state and triggers a shutdown. Alternatively, a low digital signal on FLT0 can also trigger a shutdown. The auto-shutdown feature can be disabled by not selecting any auto-shutdown sources. The autoshutdown sources to be used are selected using the ECCPAS<2:0> bits (ECCP1AS<6:4>). When a shutdown occurs, the output pins are asynchronously placed in their shutdown states, specified by the PSSAC<1:0> and PSSBD<1:0> bits (ECCPAS<2:0>). Each pin pair (P1A/P1C and P1B/ P1D) may be set to drive high, drive low or be tri-stated (not driving). The ECCPASE bit (ECCP1AS<7>) is also set to hold the Enhanced PWM outputs in their shutdown states. The ECCPASE bit is set by hardware when a shutdown event occurs. If automatic restarts are not enabled, the ECCPASE bit is cleared by firmware when the cause of the shutdown clears. If automatic restarts are enabled, the ECCPASE bit is automatically cleared when the cause of the auto-shutdown has cleared. If the ECCPASE bit is set when a PWM period begins, the PWM outputs remain in their shutdown state for that entire PWM period. When the ECCPASE bit is cleared, the PWM outputs will return to normal operation at the beginning of the next PWM period. Note: Programmable dead-band delay is not implemented in 28-pin devices with standard CCP modules. Note: Writing to the ECCPASE bit is disabled while a shutdown condition is active. REGISTER 16-2: PWM1CON: PWM DEAD-BAND DELAY REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 PRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM bit 6-0 PDC6:PDC0: PWM Delay Count bits(1) Delay time, in number of FOSC/4 (4 * TOSC) cycles, between the scheduled and actual time for a PWM signal to transition to active. Note 1: Reserved on 28-pin devices; maintain these bits clear. © 2008 Microchip Technology Inc. DS39631E-page 157 PIC18F2420/2520/4420/4520 REGISTER 16-3: ECCP1AS: ECCP AUTO-SHUTDOWN CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; ECCP outputs are in shutdown state 0 = ECCP outputs are operating bit 6-4 ECCPAS<2:0>: ECCP Auto-Shutdown Source Select bits 111 = FLT0 or Comparator 1 or Comparator 2 110 = FLT0 or Comparator 2 101 = FLT0 or Comparator 1 100 = FLT0 011 = Either Comparator 1 or 2 010 = Comparator 2 output 001 = Comparator 1 output 000 = Auto-shutdown is disabled bit 3-2 PSSAC<1:0>: Pins A and C Shutdown State Control bits 1x = Pins A and C are tri-state (40/44-pin devices); PWM output is tri-state (28-pin devices) 01 = Drive Pins A and C to ‘1’ 00 = Drive Pins A and C to ‘0’ bit 1-0 PSSBD<1:0>: Pins B and D Shutdown State Control bits(1) 1x = Pins B and D tri-state 01 = Drive Pins B and D to ‘1’ 00 = Drive Pins B and D to ‘0’ Note 1: Reserved on 28-pin devices; maintain these bits clear. PIC18F2420/2520/4420/4520 DS39631E-page 158 © 2008 Microchip Technology Inc. 16.4.7.1 Auto-Shutdown and Automatic Restart The auto-shutdown feature can be configured to allow automatic restarts of the module following a shutdown event. This is enabled by setting the PRSEN bit of the PWM1CON register (PWM1CON<7>). In Shutdown mode with PRSEN = 1 (Figure 16-10), the ECCPASE bit will remain set for as long as the cause of the shutdown continues. When the shutdown condition clears, the ECCPASE bit is cleared. If PRSEN = 0 (Figure 16-11), once a shutdown condition occurs, the ECCPASE bit will remain set until it is cleared by firmware. Once ECCPASE is cleared, the Enhanced PWM will resume at the beginning of the next PWM period. Independent of the PRSEN bit setting, if the autoshutdown source is one of the comparators, the shutdown condition is a level. The ECCPASE bit cannot be cleared as long as the cause of the shutdown persists. The Auto-Shutdown mode can be forced by writing a ‘1’ to the ECCPASE bit. 16.4.8 START-UP CONSIDERATIONS When the ECCP module is used in the PWM mode, the application hardware must use the proper external pullup and/or pull-down resistors on the PWM output pins. When the microcontroller is released from Reset, all of the I/O pins are in the high-impedance state. The external circuits must keep the power switch devices in the OFF state until the microcontroller drives the I/O pins with the proper signal levels or activates the PWM output(s). The CCP1M<1:0> bits (CCP1CON<1:0>) allow the user to choose whether the PWM output signals are active-high or active-low for each pair of PWM output pins (P1A/P1C and P1B/P1D). The PWM output polarities must be selected before the PWM pins are configured as outputs. Changing the polarity configuration while the PWM pins are configured as outputs is not recommended, since it may result in damage to the application circuits. The P1A, P1B, P1C and P1D output latches may not be in the proper states when the PWM module is initialized. Enabling the PWM pins for output at the same time as the ECCP module may cause damage to the application circuit. The ECCP module must be enabled in the proper output mode and complete a full PWM cycle before configuring the PWM pins as outputs. The completion of a full PWM cycle is indicated by the TMR2IF bit being set as the second PWM period begins. FIGURE 16-10: PWM AUTO-SHUTDOWN (PRSEN = 1, AUTO-RESTART ENABLED) FIGURE 16-11: PWM AUTO-SHUTDOWN (PRSEN = 0, AUTO-RESTART DISABLED) Note: Writing to the ECCPASE bit is disabled while a shutdown condition is active. Shutdown PWM ECCPASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Resumes Normal PWM Start of PWM Period PWM Period Shutdown PWM ECCPASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Resumes Normal PWM Start of PWM Period ECCPASE Cleared by Firmware PWM Period © 2008 Microchip Technology Inc. DS39631E-page 159 PIC18F2420/2520/4420/4520 16.4.9 SETUP FOR PWM OPERATION The following steps should be taken when configuring the ECCP module for PWM operation: 1. Configure the PWM pins, P1A and P1B (and P1C and P1D, if used), as inputs by setting the corresponding TRIS bits. 2. Set the PWM period by loading the PR2 register. 3. If auto-shutdown is required: • Disable auto-shutdown (ECCPASE = 0) • Configure source (FLT0, Comparator 1 or Comparator 2) • Wait for non-shutdown condition 4. Configure the ECCP module for the desired PWM mode and configuration by loading the CCP1CON register with the appropriate values: • Select one of the available output configurations and direction with the P1M<1:0> bits. • Select the polarities of the PWM output signals with the CCP1M<3:0> bits. 5. Set the PWM duty cycle by loading the CCPR1L register and CCP1CON<5:4> bits. 6. For Half-Bridge Output mode, set the deadband delay by loading PWM1CON<6:0> with the appropriate value. 7. If auto-shutdown operation is required, load the ECCP1AS register: • Select the auto-shutdown sources using the ECCPAS<2:0> bits. • Select the shutdown states of the PWM output pins using the PSSAC<1:0> and PSSBD<1:0> bits. • Set the ECCPASE bit (ECCP1AS<7>). • Configure the comparators using the CMCON register. • Configure the comparator inputs as analog inputs. 8. If auto-restart operation is required, set the PRSEN bit (PWM1CON<7>). 9. Configure and start TMR2: • Clear the TMR2 interrupt flag bit by clearing the TMR2IF bit (PIR1<1>). • Set the TMR2 prescale value by loading the T2CKPS bits (T2CON<1:0>). • Enable Timer2 by setting the TMR2ON bit (T2CON<2>). 10. Enable PWM outputs after a new PWM cycle has started: • Wait until TMRx overflows (TMRxIF bit is set). • Enable the CCP1/P1A, P1B, P1C and/or P1D pin outputs by clearing the respective TRIS bits. • Clear the ECCPASE bit (ECCP1AS<7>). 16.4.10 OPERATION IN POWER-MANAGED MODES In Sleep mode, all clock sources are disabled. Timer2 will not increment and the state of the module will not change. If the ECCP pin is driving a value, it will continue to drive that value. When the device wakes up, it will continue from this state. If Two-Speed Start-ups are enabled, the initial start-up frequency from INTOSC and the postscaler may not be stable immediately. In PRI_IDLE mode, the primary clock will continue to clock the ECCP module without change. In all other power-managed modes, the selected power-managed mode clock will clock Timer2. Other power-managed mode clocks will most likely be different than the primary clock frequency. 16.4.10.1 Operation with Fail-Safe Clock Monitor If the Fail-Safe Clock Monitor is enabled, a clock failure will force the device into the power-managed RC_RUN mode and the OSCFIF bit (PIR2<7>) will be set. The ECCP will then be clocked from the internal oscillator clock source, which may have a different clock frequency than the primary clock. See the previous section for additional details. 16.4.11 EFFECTS OF A RESET Both Power-on Reset and subsequent Resets will force all ports to Input mode and the CCP registers to their Reset states. This forces the Enhanced CCP module to reset to a state compatible with the standard CCP module. PIC18F2420/2520/4420/4520 DS39631E-page 160 © 2008 Microchip Technology Inc. TABLE 16-3: REGISTERS ASSOCIATED WITH ECCP MODULE AND TIMER1 TO TIMER3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 RCON IPEN SBOREN — RI TO PD POR BOR 48 PIR1 PSPIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 TRISB PORTB Data Direction Register 52 TRISC PORTC Data Direction Register 52 TRISD PORTD Data Direction Register 52 TMR1L Timer1 Register Low Byte 50 TMR1H Timer1 Register High Byte 50 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 TMR2 Timer2 Register 50 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50 PR2 Timer2 Period Register 50 TMR3L Timer3 Register Low Byte 51 TMR3H Timer3 Register High Byte 51 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51 CCPR1L Capture/Compare/PWM Register 1 Low Byte 51 CCPR1H Capture/Compare/PWM Register 1 High Byte 51 CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) 51 PWM1CON PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during ECCP operation. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. © 2008 Microchip Technology Inc. DS39631E-page 161 PIC18F2420/2520/4420/4520 17.0 MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE 17.1 Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface, useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D Converters, etc. The MSSP module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C) - Full Master mode - Slave mode (with general address call) The I2C interface supports the following modes in hardware: • Master mode • Multi-Master mode • Slave mode 17.2 Control Registers The MSSP module has three associated registers. These include a status register (SSPSTAT) and two control registers (SSPCON1 and SSPCON2). The use of these registers and their individual configuration bits differ significantly depending on whether the MSSP module is operated in SPI or I2C mode. Additional details are provided under the individual sections. 17.3 SPI Mode The SPI mode allows 8 bits of data to be synchronously transmitted and received simultaneously. All four modes of SPI are supported. To accomplish communication, typically three pins are used: • Serial Data Out (SDO) – RC5/SDO • Serial Data In (SDI) – RC4/SDI/SDA • Serial Clock (SCK) – RC3/SCK/SCL Additionally, a fourth pin may be used when in a Slave mode of operation: • Slave Select (SS) – RA5/SS Figure 17-1 shows the block diagram of the MSSP module when operating in SPI mode. FIGURE 17-1: MSSP BLOCK DIAGRAM (SPI MODE) ( ) Read Write Internal Data Bus SSPSR reg SSPM<3:0> bit 0 Shift Clock SS Control Enable Edge Select Clock Select TMR2 Output Prescaler TOSC 4, 16, 64 2 Edge Select 2 4 Data to TX/RX in SSPSR TRIS bit 2 SMP:CKE RC5/SDO SSPBUF reg RC4/SDI/SDA RA5/AN4/SS/ RC3/SCK/ SCL HLVDIN/C2OUT PIC18F2420/2520/4420/4520 DS39631E-page 162 © 2008 Microchip Technology Inc. 17.3.1 REGISTERS The MSSP module has four registers for SPI mode operation. These are: • MSSP Control Register 1 (SSPCON1) • MSSP Status Register (SSPSTAT) • Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible SSPCON1 and SSPSTAT are the control and status registers in SPI mode operation. The SSPCON1 register is readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. REGISTER 17-1: SSPSTAT: MSSP STATUS REGISTER (SPI MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE(1) D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SMP: Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode. bit 6 CKE: SPI Clock Select bit(1) 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state bit 5 D/A: Data/Address bit Used in I2C™ mode only. bit 4 P: Stop bit Used in I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared. bit 3 S: Start bit Used in I2C mode only. bit 2 R/W: Read/Write Information bit Used in I2C mode only. bit 1 UA: Update Address bit Used in I2C mode only. bit 0 BF: Buffer Full Status bit (Receive mode only) 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Note 1: Polarity of clock state is set by the CKP bit (SSPCON1<4>). © 2008 Microchip Technology Inc. DS39631E-page 163 PIC18F2420/2520/4420/4520 REGISTER 17-2: SSPCON1: MSSP CONTROL REGISTER 1 (SPI MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV(1) SSPEN(2) CKP SSPM3(3) SSPM2(3) SSPM1(3) SSPM0(3) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 WCOL: Write Collision Detect bit 1 = The SSPxBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) SPI Slave mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be cleared in software). 0 = No overflow bit 5 SSPEN: Master Synchronous Serial Port Enable bit(2) 1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level bit 3-0 SSPM<3:0>: Master Synchronous Serial Port Mode Select bits(3) 0101 = SPI Slave mode, clock = SCK pin; SS pin control disabled; SS can be used as I/O pin 0100 = SPI Slave mode, clock = SCK pin; SS pin control enabled 0011 = SPI Master mode, clock = TMR2 output/2 0010 = SPI Master mode, clock = FOSC/64 0001 = SPI Master mode, clock = FOSC/16 0000 = SPI Master mode, clock = FOSC/4 Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. 2: When enabled, these pins must be properly configured as input or output. 3: Bit combinations not specifically listed here are either reserved or implemented in I2C™ mode only. PIC18F2420/2520/4420/4520 DS39631E-page 164 © 2008 Microchip Technology Inc. 17.3.2 OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON1<5:0> and SSPSTAT<7:6>). These control bits allow the following to be specified: • Master mode (SCK is the clock output) • Slave mode (SCK is the clock input) • Clock Polarity (Idle state of SCK) • Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCK) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) The MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the 8 bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full detect bit, BF (SSPSTAT<0>) and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data will be ignored and the write collision detect bit, WCOL (SSPCON1<7>), will be set. User software must clear the WCOL bit so that it can be determined if the following write(s) to the SSPBUF register completed successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. The Buffer Full bit, BF (SSPSTAT<0>), indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. The SSPBUF must be read and/or written. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. Example 17-1 shows the loading of the SSPBUF (SSPSR) for data transmission. The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the MSSP Status register (SSPSTAT) indicates the various status conditions. EXAMPLE 17-1: LOADING THE SSPBUF (SSPSR) REGISTER Note: The SSPBUF register cannot be used with read-modify-write instructions such as BCF, BTFSC and COMF, etc. LOOP BTFSS SSPSTAT, BF ;Has data been received (transmit complete)? BRA LOOP ;No MOVF SSPBUF, W ;WREG reg = contents of SSPBUF MOVWF RXDATA ;Save in user RAM, if data is meaningful MOVF TXDATA, W ;W reg = contents of TXDATA MOVWF SSPBUF ;New data to xmit Note: To avoid lost data in Master mode, a read of the SSPBUF must be performed to clear the Buffer Full (BF) detect bit (SSPSTAT<0>) between each transmission. © 2008 Microchip Technology Inc. DS39631E-page 165 PIC18F2420/2520/4420/4520 17.3.3 ENABLING SPI I/O To enable the serial port, MSSP Enable bit, SSPEN (SSPCON1<5>), must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, reinitialize the SSPCON registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDI is automatically controlled by the SPI module • SDO must have TRISC<5> bit cleared • SCK (Master mode) must have TRISC<3> bit cleared • SCK (Slave mode) must have TRISC<3> bit set • SS must have TRISA<5> bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. 17.3.4 TYPICAL CONNECTION Figure 17-2 shows a typical connection between two microcontrollers. The master controller (Processor 1) initiates the data transfer by sending the SCK signal. Data is shifted out of both shift registers on their programmed clock edge and latched on the opposite edge of the clock. Both processors should be programmed to the same Clock Polarity (CKP), then both controllers would send and receive data at the same time. Whether the data is meaningful (or dummy data) depends on the application software. This leads to three scenarios for data transmission: • Master sends data – Slave sends dummy data • Master sends data – Slave sends data • Master sends dummy data – Slave sends data FIGURE 17-2: SPI MASTER/SLAVE CONNECTION Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDO SDI PROCESSOR 1 SCK SPI Master SSPM<3:0> = 00xxb Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDI SDO PROCESSOR 2 SCK SPI Slave SSPM<3:0> = 010xb Serial Clock PIC18F2420/2520/4420/4520 DS39631E-page 166 © 2008 Microchip Technology Inc. 17.3.5 MASTER MODE The master can initiate the data transfer at any time because it controls the SCK. The master determines when the slave (Processor 2, Figure 17-2) is to broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be disabled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and status bits appropriately set). This could be useful in receiver applications as a “Line Activity Monitor” mode. The clock polarity is selected by appropriately programming the CKP bit (SSPCON1<4>). This, then, would give waveforms for SPI communication as shown in Figure 17-3, Figure 17-5 and Figure 17-6, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user-programmable to be one of the following: • FOSC/4 (or TCY) • FOSC/16 (or 4 • TCY) • FOSC/64 (or 16 • TCY) • Timer2 output/2 This allows a maximum data rate (at 40 MHz) of 10.00 Mbps. Figure 17-3 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown. FIGURE 17-3: SPI MODE WAVEFORM (MASTER MODE) SCK (CKP = 0 SCK (CKP = 1 SCK (CKP = 0 SCK (CKP = 1 4 Clock Modes Input Sample Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bit 7 SDI SSPIF (SMP = 1) (SMP = 0) (SMP = 1) CKE = 1) CKE = 0) CKE = 1) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 0) (CKE = 1) Next Q4 Cycle after Q2↓ bit 0 © 2008 Microchip Technology Inc. DS39631E-page 167 PIC18F2420/2520/4420/4520 17.3.6 SLAVE MODE In Slave mode, the data is transmitted and received as the external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. Before enabling the module in SPI Slave mode, the clock line must match the proper Idle state. The clock line can be observed by reading the SCK pin. The Idle state is determined by the CKP bit (SSPCON1<4>). While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the electrical specifications. While in Sleep mode, the slave can transmit/receive data. When a byte is received, the device will wake-up from Sleep. 17.3.7 SLAVE SELECT SYNCHRONIZATION The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON1<3:0> = 04h). The pin must not be driven low for the SS pin to function as an input. The data latch must be high. When the SS pin is low, transmission and reception are enabled and the SDO pin is driven. When the SS pin goes high, the SDO pin is no longer driven, even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable depending on the application. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. To emulate two-wire communication, the SDO pin can be connected to the SDI pin. When the SPI needs to operate as a receiver, the SDO pin can be configured as an input. This disables transmissions from the SDO. The SDI can always be left as an input (SDI function) since it cannot create a bus conflict. FIGURE 17-4: SLAVE SYNCHRONIZATION WAVEFORM Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON<3:0> = 0100), the SPI module will reset if the SS pin is set to VDD. 2: If the SPI is used in Slave mode with CKE set, then the SS pin control must be enabled. SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 7 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag bit 0 bit 7 bit 0 Next Q4 Cycle after Q2↓ PIC18F2420/2520/4420/4520 DS39631E-page 168 © 2008 Microchip Technology Inc. FIGURE 17-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) FIGURE 17-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Optional Next Q4 Cycle after Q2↓ bit 0 SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 1) CKE = 1) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Not Optional Next Q4 Cycle after Q2↓ © 2008 Microchip Technology Inc. DS39631E-page 169 PIC18F2420/2520/4420/4520 17.3.8 OPERATION IN POWER-MANAGED MODES In SPI Master mode, module clocks may be operating at a different speed than when in full-power mode; in the case of Sleep mode, all clocks are halted. In most Idle modes, a clock is provided to the peripherals. That clock should be from the primary clock source, the secondary clock (Timer1 oscillator at 32.768 kHz) or the INTOSC source. See Section 2.7 “Clock Sources and Oscillator Switching” for additional information. In most cases, the speed that the master clocks SPI data is not important; however, this should be evaluated for each system. If MSSP interrupts are enabled, they can wake the controller from Sleep mode, or one of the Idle modes, when the master completes sending data. If an exit from Sleep or Idle mode is not desired, MSSP interrupts should be disabled. If the Sleep mode is selected, all module clocks are halted and the transmission/reception will remain in that state until the devices wakes. After the device returns to Run mode, the module will resume transmitting and receiving data. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in any power-managed mode and data to be shifted into the SPI Transmit/ Receive Shift register. When all 8 bits have been received, the MSSP interrupt flag bit will be set, and if enabled, will wake the device. 17.3.9 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 17.3.10 BUS MODE COMPATIBILITY Table 17-1 shows the compatibility between the standard SPI modes and the states of the CKP and CKE control bits. TABLE 17-1: SPI BUS MODES There is also an SMP bit which controls when the data is sampled. TABLE 17-2: REGISTERS ASSOCIATED WITH SPI OPERATION Standard SPI Mode Terminology Control Bits State CKP CKE 0, 0 0 1 0, 1 0 0 1, 0 1 1 1, 1 1 0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TRISA TRISA7(2) TRISA6(2) PORTA Data Direction Register 52 TRISC PORTC Data Direction Register 52 SSPBUF MSSP Receive Buffer/Transmit Register 50 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 50 SSPSTAT SMP CKE D/A P S R/W UA BF 50 Legend: Shaded cells are not used by the MSSP in SPI mode. Note 1: These bits are unimplemented in 28-pin devices; always maintain these bits clear. 2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. PIC18F2420/2520/4420/4520 DS39631E-page 170 © 2008 Microchip Technology Inc. 17.4 I2C Mode The MSSP module in I2C mode fully implements all master and slave functions (including general call support) and provides interrupts on Start and Stop bits in hardware to determine a free bus (multi-master function). The MSSP module implements the standard mode specifications, as well as 7-Bit and 10-Bit Addressing modes. Two pins are used for data transfer: • Serial clock (SCL) – RC3/SCK/SCL • Serial data (SDA) – RC4/SDI/SDA The user must configure these pins as inputs or outputs through the TRISC<4:3> bits. FIGURE 17-7: MSSP BLOCK DIAGRAM (I2C MODE) 17.4.1 REGISTERS The MSSP module has six registers for I2C operation. These are: • MSSP Control Register 1 (SSPCON1) • MSSP Control Register 2 (SSPCON2) • MSSP Status Register (SSPSTAT) • Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible • MSSP Address Register (SSPADD) SSPCON1, SSPCON2 and SSPSTAT are the control and status registers in I2C mode operation. The SSPCON1 and SSPCON2 registers are readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. SSPADD register holds the slave device address when the MSSP is configured in I2C Slave mode. When the MSSP is configured in Master mode, the lower seven bits of SSPADD act as the Baud Rate Generator reload value. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. Read Write SSPSR reg Match Detect SSPADD reg Start and Stop bit Detect SSPBUF reg Internal Data Bus Addr Match Set, Reset S, P bits (SSPSTAT reg) RC3/SCK/SCL RC4/SDI/ Shift Clock MSb SDA LSb © 2008 Microchip Technology Inc. DS39631E-page 171 PIC18F2420/2520/4420/4520 REGISTER 17-3: SSPSTAT: MSSP STATUS REGISTER (I2C™ MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P(1) S(1) R/W(2,3) UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SMP: Slew Rate Control bit In Master or Slave mode: 1 = Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for High-Speed mode (400 kHz) bit 6 CKE: SMBus Select bit In Master or Slave mode: 1 = Enable SMBus specific inputs 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit In Master mode: Reserved. In Slave mode: 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit(1) 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last bit 3 S: Start bit(1) 1 = Indicates that a Start bit has been detected last 0 = Start bit was not detected last bit 2 R/W: Read/Write Information bit (I2C mode only)(2,3) In Slave mode: 1 = Read 0 = Write In Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress bit 1 UA: Update Address bit (10-Bit Slave mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit In Transmit mode: 1 = SSPBUF is full 0 = SSPBUF is empty In Receive mode: 1 = SSPBUF is full (does not include the ACK and Stop bits) 0 = SSPBUF is empty (does not include the ACK and Stop bits) Note 1: This bit is cleared on Reset and when SSPEN is cleared. 2: This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit or not ACK bit. 3: ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Active mode. PIC18F2420/2520/4420/4520 DS39631E-page 172 © 2008 Microchip Technology Inc. REGISTER 17-4: SSPCON1: MSSP CONTROL REGISTER 1 (I2C™ MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV SSPEN(1) CKP SSPM3 SSPM2 SSPM1 SSPM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 WCOL: Write Collision Detect bit In Master Transmit mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started (must be cleared in software) 0 = No collision In Slave Transmit mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision In Receive mode (Master or Slave modes): This is a “don’t care” bit. bit 6 SSPOV: Receive Overflow Indicator bit In Receive mode: 1 = A byte is received while the SSPBUF register is still holding the previous byte (must be cleared in software) 0 = No overflow In Transmit mode: This is a “don’t care” bit in Transmit mode. bit 5 SSPEN: Master Synchronous Serial Port Enable bit(1) 1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: SCK Release Control bit In Slave mode: 1 = Releases clock 0 = Holds clock low (clock stretch), used to ensure data setup time In Master mode: Unused in this mode. bit 3-0 SSPM<3:0>: Master Synchronous Serial Port Mode Select bits(2) 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1011 = I2C Firmware Controlled Master mode (Slave Idle) 1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1)) 0111 = I2C Slave mode, 10-bit address 0110 = I2C Slave mode, 7-bit address Bit combinations not specifically listed here are either reserved or implemented in SPI mode only. Note 1: When enabled, the SDA and SCL pins must be properly configured as inputs or outputs. © 2008 Microchip Technology Inc. DS39631E-page 173 PIC18F2420/2520/4420/4520 REGISTER 17-5: SSPCON2: MSSP CONTROL REGISTER 2 (I2C™ MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GCEN ACKSTAT ACKDT(2) ACKEN(1) RCEN(1) PEN(1) RSEN(1) SEN(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GCEN: General Call Enable bit (Slave mode only) 1 = Enables interrupt when a general call address (0000h) is received in the SSPSR 0 = General call address disabled. bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only) 1 = Acknowledge was not received from slave 0 = Acknowledge was received from slave bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only)(2) 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (Master Receive mode only)(1) 1 = Initiates Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence Idle bit 3 RCEN: Receive Enable bit (Master mode only)(1) 1 = Enables Receive mode for I2C 0 = Receive Idle bit 2 PEN: Stop Condition Enable bit (Master mode only)(1) 1 = Initiates Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enable bit (Master mode only)(1) 1 = Initiates Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enable/Stretch Enable bit(1) In Master mode: 1 = Initiates Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, these bits may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). 2: Value that will be transmitted when the user initiates an Acknowledge sequence at the end of a receive. PIC18F2420/2520/4420/4520 DS39631E-page 174 © 2008 Microchip Technology Inc. 17.4.2 OPERATION The MSSP module functions are enabled by setting the MSSP Enable bit, SSPEN (SSPCON1<5>). The SSPCON1 register allows control of the I2C operation. Four mode selection bits (SSPCON1<3:0>) allow one of the following I2C modes to be selected: • I2C Master mode, clock = (FOSC/4) x (SSPADD + 1) • I2C Slave mode (7-bit addressing) • I2C Slave mode (10-bit addressing) • I2C Slave mode (7-bit addressing) with Start and Stop bit interrupts enabled • I2C Slave mode (10-bit addressing) with Start and Stop bit interrupts enabled • I2C Firmware Controlled Master mode, slave is Idle Selection of any I2C mode, with the SSPEN bit set, forces the SCL and SDA pins to be open-drain, provided these pins are programmed to inputs by setting the appropriate TRISC bits. To ensure proper operation of the module, pull-up resistors must be provided externally to the SCL and SDA pins. 17.4.3 SLAVE MODE In Slave mode, the SCL and SDA pins must be configured as inputs (TRISC<4:3> set). The MSSP module will override the input state with the output data when required (slave-transmitter). The I2C Slave mode hardware will always generate an interrupt on an address match. Through the mode select bits, the user can also choose to interrupt on Start and Stop bits When an address is matched, or the data transfer after an address match is received, the hardware automatically will generate the Acknowledge (ACK) pulse and load the SSPBUF register with the received value currently in the SSPSR register. Any combination of the following conditions will cause the MSSP module not to give this ACK pulse: • The Buffer Full bit, BF (SSPSTAT<0>), was set before the transfer was received. • The overflow bit, SSPOV (SSPCON2<6>), was set before the transfer was received. In this case, the SSPSR register value is not loaded into the SSPBUF, but bit, SSPIF (PIR1<3>), is set. The BF bit is cleared by reading the SSPBUF register, while bit SSPOV is cleared through software. The SCL clock input must have a minimum high and low for proper operation. The high and low times of the I 2C specification, as well as the requirement of the MSSP module, are shown in timing parameter 100 and parameter 101. 17.4.3.1 Addressing Once the MSSP module has been enabled, it waits for a Start condition to occur. Following the Start condition, the 8 bits are shifted into the SSPSR register. All incoming bits are sampled with the rising edge of the clock (SCL) line. The value of register SSPSR<7:1> is compared to the value of the SSPADD register. The address is compared on the falling edge of the eighth clock (SCL) pulse. If the addresses match and the BF and SSPOV bits are clear, the following events occur: 1. The SSPSR register value is loaded into the SSPBUF register. 2. The Buffer Full bit, BF, is set. 3. An ACK pulse is generated. 4. MSSP Interrupt Flag bit, SSPIF (PIR1<3>), is set (interrupt is generated, if enabled) on the falling edge of the ninth SCL pulse. In 10-Bit Addressing mode, two address bytes need to be received by the slave. The five Most Significant bits (MSbs) of the first address byte specify if this is a 10-bit address. Bit, R/W (SSPSTAT<2>), must specify a write so the slave device will receive the second address byte. For a 10-bit address, the first byte would equal ‘11110 A9 A8 0’, where ‘A9’ and ‘A8’ are the two MSbs of the address. The sequence of events for 10-Bit Addressing mode is as follows, with steps 7 through 9 for the slave-transmitter: 1. Receive first (high) byte of address (bits, SSPIF, BF and UA (SSPSTAT<1>), are set). 2. Update the SSPADD register with second (low) byte of address (clears UA bit and releases the SCL line). 3. Read the SSPBUF register (clears BF bit) and clear flag bit, SSPIF. 4. Receive second (low) byte of address (bits, SSPIF, BF and UA, are set). 5. Update the SSPADD register with the first (high) byte of address. If match releases SCL line, this will clear bit, UA. 6. Read the SSPBUF register (clears BF bit) and clear flag bit, SSPIF. 7. Receive Repeated Start condition. 8. Receive first (high) byte of address (bits, SSPIF and BF, are set). 9. Read the SSPBUF register (clears BF bit) and clear flag bit, SSPIF. © 2008 Microchip Technology Inc. DS39631E-page 175 PIC18F2420/2520/4420/4520 17.4.3.2 Reception When the R/W bit of the address byte is clear and an address match occurs, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and the SDA line is held low (ACK). When the address byte overflow condition exists, then the no Acknowledge (ACK) pulse is given. An overflow condition is defined as either bit, BF (SSPSTAT<0>), is set, or bit, SSPOV (SSPCON1<6>), is set. An MSSP interrupt is generated for each data transfer byte. Flag bit, SSPIF (PIR1<3>), must be cleared in software. The SSPSTAT register is used to determine the status of the byte. If SEN is enabled (SSPCON2<0> = 1), RC3/SCK/SCL will be held low (clock stretch) following each data transfer. The clock must be released by setting bit, CKP (SSPCON<4>). See Section 17.4.4 “Clock Stretching” for more details. 17.4.3.3 Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register. The ACK pulse will be sent on the ninth bit and the RC3/SCK/SCL pin is held low regardless of SEN (see Section 17.4.4 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then the RC3/SCK/SCL pin should be enabled by setting bit, CKP (SSPCON1<4>). The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time (Figure 17-9). The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. If the SDA line is high (not ACK), then the data transfer is complete. In this case, when the ACK is latched by the slave, the slave logic is reset (resets SSPSTAT register) and the slave monitors for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, the RC3/SCK/SCL pin must be enabled by setting bit, CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared in software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse. PIC18F2420/2520/4420/4520 DS39631E-page 176 © 2008 Microchip Technology Inc. FIGURE 17-8: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESSING) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) S 1 2 34 56 7 89 1 2 34 5 67 89 1 23 45 7 89 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 ACK Receiving Data ACK Receiving Data R/W = 0 ACK Receiving Address Cleared in software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP (SSPCON1<4>) (CKP does not reset to ‘0’ when SEN = 0) © 2008 Microchip Technology Inc. DS39631E-page 177 PIC18F2420/2520/4420/4520 FIGURE 17-9: I2C™ SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESSING) SDA SCL SSPIF (PIR1<3>) BF (SSPSTAT<0>) A6 A5 A4 A3 A2 A1 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9 SSPBUF is written in software Cleared in software Data in sampled S ACK Transmitting Data R/W = 1 ACK Receiving Address A7 D7 9 1 D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 SSPBUF is written in software Cleared in software From SSPIF ISR Transmitting Data D7 1 CKP P ACK CKP is set in software CKP is set in software SCL held low while CPU responds to SSPIF Clear by reading From SSPIF ISR PIC18F2420/2520/4420/4520 DS39631E-page 178 © 2008 Microchip Technology Inc. FIGURE 17-10: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESSING) SDA SCL SSPIF BF (SSPSTAT<0>) S 1234 567 89 12 345 67 89 1 2345 7 89 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared in software D2 6 (PIR1<3>) Cleared in software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP (SSPCON1<4>) D7 D6 D5 D4 D3 D1 D0 12345 789 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared in software Cleared in software SSPOV (SSPCON1<6>) SSPOV is set because SSPBUF is still full. ACK is not sent. (CKP does not reset to ‘0’ when SEN = 0) Clock is held low until update of SSPADD has taken place © 2008 Microchip Technology Inc. DS39631E-page 179 PIC18F2420/2520/4420/4520 FIGURE 17-11: I2C™ SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESSING) SDA SCL SSPIF BF (SSPSTAT<0>) S 1234 5 6789 1 23 45 678 9 12345 7 89 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 1 1 1 0 A8 R/W=1 ACK ACK R/W = 0 ACK Receive First Byte of Address Cleared in software Bus master terminates transfer A9 6 (PIR1<3>) Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address. SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag Receive First Byte of Address D7 D6 D5 D4 D3 D1 12345 789 ACK D2 6 Transmitting Data Byte D0 Dummy read of SSPBUF to clear BF flag Sr Cleared in software Write of SSPBUF initiates transmit Cleared in software Completion of clears BF flag CKP (SSPCON1<4>) CKP is set in software CKP is automatically cleared in hardware, holding SCL low Clock is held low until update of SSPADD has taken place data transmission Clock is held low until CKP is set to ‘1’ BF flag is clear at the end of the third address sequence PIC18F2420/2520/4420/4520 DS39631E-page 180 © 2008 Microchip Technology Inc. 17.4.4 CLOCK STRETCHING Both 7-Bit and 10-Bit Slave modes implement automatic clock stretching during a transmit sequence. The SEN bit (SSPCON2<0>) allows clock stretching to be enabled during receives. Setting SEN will cause the SCL pin to be held low at the end of each data receive sequence. 17.4.4.1 Clock Stretching for 7-Bit Slave Receive Mode (SEN = 1) In 7-Bit Slave Receive mode, on the falling edge of the ninth clock at the end of the ACK sequence if the BF bit is set, the CKP bit in the SSPCON1 register is automatically cleared, forcing the SCL output to be held low. The CKP being cleared to ‘0’ will assert the SCL line low. The CKP bit must be set in the user’s Interrupt Service Routine (ISR) before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the SSPBUF before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring (see Figure 17-13). 17.4.4.2 Clock Stretching for 10-Bit Slave Receive Mode (SEN = 1) In 10-Bit Slave Receive mode during the address sequence, clock stretching automatically takes place but CKP is not cleared. During this time, if the UA bit is set after the ninth clock, clock stretching is initiated. The UA bit is set after receiving the upper byte of the 10-bit address and following the receive of the second byte of the 10-bit address with the R/W bit cleared to ‘0’. The release of the clock line occurs upon updating SSPADD. Clock stretching will occur on each data receive sequence as described in 7-bit mode. 17.4.4.3 Clock Stretching for 7-Bit Slave Transmit Mode 7-Bit Slave Transmit mode implements clock stretching by clearing the CKP bit after the falling edge of the ninth clock if the BF bit is clear. This occurs regardless of the state of the SEN bit. The user’s ISR must set the CKP bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the SSPBUF before the master device can initiate another transmit sequence (see Figure 17-9). 17.4.4.4 Clock Stretching for 10-Bit Slave Transmit Mode In 10-Bit Slave Transmit mode, clock stretching is controlled during the first two address sequences by the state of the UA bit, just as it is in 10-Bit Slave Receive mode. The first two addresses are followed by a third address sequence which contains the high-order bits of the 10-bit address and the R/W bit set to ‘1’. After the third address sequence is performed, the UA bit is not set, the module is now configured in Transmit mode and clock stretching is controlled by the BF flag as in 7-Bit Slave Transmit mode (see Figure 17-11). Note 1: If the user reads the contents of the SSPBUF before the falling edge of the ninth clock, thus clearing the BF bit, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. The user should be careful to clear the BF bit in the ISR before the next receive sequence in order to prevent an overflow condition. Note: If the user polls the UA bit and clears it by updating the SSPADD register before the falling edge of the ninth clock occurs and if the user hasn’t cleared the BF bit by reading the SSPBUF register before that time, then the CKP bit will still NOT be asserted low. Clock stretching on the basis of the state of the BF bit only occurs during a data sequence, not an address sequence. Note 1: If the user loads the contents of SSPBUF, setting the BF bit before the falling edge of the ninth clock, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. © 2008 Microchip Technology Inc. DS39631E-page 181 PIC18F2420/2520/4420/4520 17.4.4.5 Clock Synchronization and the CKP bit When the CKP bit is cleared, the SCL output is forced to ‘0’. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have deasserted SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 17-12). FIGURE 17-12: CLOCK SYNCHRONIZATION TIMING SDA SCL DX DX – 1 WR Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SSPCONx CKP Master device deasserts clock Master device asserts clock PIC18F2420/2520/4420/4520 DS39631E-page 182 © 2008 Microchip Technology Inc. FIGURE 17-13: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESSING) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) S 1 2 34 56 7 8 9 1 234 5 67 89 1 23 45 7 89 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 ACK Receiving Data ACK Receiving Data R/W = 0 ACK Receiving Address Cleared in software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP (SSPCON1<4>) CKP written to ‘1’ in If BF is cleared prior to the falling edge of the 9th clock, CKP will not be reset to ‘0’ and no clock stretching will occur software Clock is held low until CKP is set to ‘1’ Clock is not held low because buffer full bit is clear prior to falling edge of 9th clock Clock is not held low because ACK = 1 BF is set after falling edge of the 9th clock, CKP is reset to ‘0’ and clock stretching occurs © 2008 Microchip Technology Inc. DS39631E-page 183 PIC18F2420/2520/4420/4520 FIGURE 17-14: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESSING) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 234 56 7 89 12345 67 89 1 2345 78 9 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared in software D2 6 (PIR1<3>) Cleared in software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address after falling edge UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address after falling edge SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP (SSPCON1<4>) D7 D6 D5 D4 D3 D1 D0 12345 789 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared in software Cleared in software SSPOV (SSPCON1<6>) CKP written to ‘1’ Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. in software Clock is held low until update of SSPADD has taken place of ninth clock of ninth clock SSPOV is set because SSPBUF is still full. ACK is not sent. Dummy read of SSPBUF to clear BF flag Clock is held low until CKP is set to ‘1’ Clock is not held low because ACK = 1 PIC18F2420/2520/4420/4520 DS39631E-page 184 © 2008 Microchip Technology Inc. 17.4.5 GENERAL CALL ADDRESS SUPPORT The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R/W = 0. The general call address is recognized when the General Call Enable bit, GCEN, is enabled (SSPCON2<7> is set). Following a Start bit detect, 8 bits are shifted into the SSPSR and the address is compared against the SSPADD. It is also compared to the general call address and fixed in hardware. If the general call address matches, the SSPSR is transferred to the SSPBUF, the BF flag bit is set (eighth bit) and on the falling edge of the ninth bit (ACK bit), the SSPIF interrupt flag bit is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the SSPBUF. The value can be used to determine if the address was device specific or a general call address. In 10-bit mode, the SSPADD is required to be updated for the second half of the address to match and the UA bit is set (SSPSTAT<1>). If the general call address is sampled when the GCEN bit is set, while the slave is configured in 10-Bit Addressing mode, then the second half of the address is not necessary, the UA bit will not be set and the slave will begin receiving data after the Acknowledge (Figure 17-15). FIGURE 17-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESSING MODE) SDA SCL S SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) Cleared in software SSPBUF is read R/W = 0 ACK General Call Address Address is compared to General Call Address GCEN (SSPCON2<7>) Receiving Data ACK 1 2 34 56 7891 2 34 56 789 D7 D6 D5 D4 D3 D2 D1 D0 after ACK, set interrupt ‘0’ ‘1’ © 2008 Microchip Technology Inc. DS39631E-page 185 PIC18F2420/2520/4420/4520 17.4.6 MASTER MODE Master mode is enabled by setting and clearing the appropriate SSPM bits in SSPCON1 and by setting the SSPEN bit. In Master mode, the SCL and SDA lines are manipulated by the MSSP hardware. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit is set, or the bus is Idle, with both the S and P bits clear. In Firmware Controlled Master mode, user code conducts all I2C bus operations based on Start and Stop bit conditions. Once Master mode is enabled, the user has six options. 1. Assert a Start condition on SDA and SCL. 2. Assert a Repeated Start condition on SDA and SCL. 3. Write to the SSPBUF register initiating transmission of data/address. 4. Configure the I2C port to receive data. 5. Generate an Acknowledge condition at the end of a received byte of data. 6. Generate a Stop condition on SDA and SCL. The following events will cause the MSSP Interrupt Flag bit, SSPIF, to be set (MSSP interrupt, if enabled): • Start condition • Stop condition • Data transfer byte transmitted/received • Acknowledge transmit • Repeated Start FIGURE 17-16: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE) Note: The MSSP module, when configured in I 2C Master mode, does not allow queueing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. Read Write SSPSR Start bit, Stop bit, SSPBUF Internal Data Bus Set/Reset, S, P, WCOL (SSPSTAT); Shift Clock MSb LSb SDA Acknowledge Generate Stop bit Detect Write Collision Detect Clock Arbitration State Counter for end of XMIT/RCV SCL SCL In Bus Collision SDA In Receive Enable Clock Cntl Clock Arbitrate/WCOL Detect (hold off clock source) SSPADD<6:0> Baud Set SSPIF, BCLIF; Reset ACKSTAT, PEN (SSPCON2) Rate Generator SSPM<3:0> Start bit Detect PIC18F2420/2520/4420/4520 DS39631E-page 186 © 2008 Microchip Technology Inc. 17.4.6.1 I2C Master Mode Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. The Baud Rate Generator used for the SPI mode operation is used to set the SCL clock frequency for either 100 kHz, 400 kHz or 1 MHz I2C operation. See Section 17.4.7 “Baud Rate” for more detail. A typical transmit sequence would go as follows: 1. The user generates a Start condition by setting the Start Enable bit, SEN (SSPCON2<0>). 2. SSPIF is set. The MSSP module will wait the required start time before any other operation takes place. 3. The user loads the SSPBUF with the slave address to transmit. 4. Address is shifted out the SDA pin until all 8 bits are transmitted. 5. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 6. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 7. The user loads the SSPBUF with eight bits of data. 8. Data is shifted out the SDA pin until all 8 bits are transmitted. 9. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 10. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 11. The user generates a Stop condition by setting the Stop Enable bit, PEN (SSPCON2<2>). 12. Interrupt is generated once the Stop condition is complete. © 2008 Microchip Technology Inc. DS39631E-page 187 PIC18F2420/2520/4420/4520 17.4.7 BAUD RATE In I2C Master mode, the Baud Rate Generator (BRG) reload value is placed in the lower 7 bits of the SSPADD register (Figure 17-17). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting. The BRG counts down to 0 and stops until another reload has taken place. The BRG count is decremented twice per instruction cycle (TCY) on the Q2 and Q4 clocks. In I2C Master mode, the BRG is reloaded automatically. Once the given operation is complete (i.e., transmission of the last data bit is followed by ACK), the internal clock will automatically stop counting and the SCL pin will remain in its last state. Table 17-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. FIGURE 17-17: BAUD RATE GENERATOR BLOCK DIAGRAM TABLE 17-3: I2C™ CLOCK RATE W/BRG SSPM<3:0> CLKO BRG Down Counter FOSC/4 SSPADD<6:0> SSPM<3:0> SCL Reload Control Reload FCY FCY * 2 BRG Value FSCL (2 Rollovers of BRG) 10 MHz 20 MHz 18h 400 kHz(1) 10 MHz 20 MHz 1Fh 312.5 kHz 10 MHz 20 MHz 63h 100 kHz 4 MHz 8 MHz 09h 400 kHz(1) 4 MHz 8 MHz 0Ch 308 kHz 4 MHz 8 MHz 27h 100 kHz 1 MHz 2 MHz 02h 333 kHz(1) 1 MHz 2 MHz 09h 100 kHz 1 MHz 2 MHz 00h 1 MHz(1) Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. PIC18F2420/2520/4420/4520 DS39631E-page 188 © 2008 Microchip Technology Inc. 17.4.7.1 Clock Arbitration Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, deasserts the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 17-18). FIGURE 17-18: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA SCL SCL deasserted but slave holds DX DX – 1 BRG SCL is sampled high, reload takes place and BRG starts its count 03h 02h 01h 00h (hold off) 03h 02h Reload BRG Value SCL low (clock arbitration) SCL allowed to transition high BRG decrements on Q2 and Q4 cycles © 2008 Microchip Technology Inc. DS39631E-page 189 PIC18F2420/2520/4420/4520 17.4.8 I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start Enable bit, SEN (SSPCON2<0>). If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low while SCL is high is the Start condition and causes the S bit (SSPSTAT<3>) to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit (SSPCON2<0>) will be automatically cleared by hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. 17.4.8.1 WCOL Status Flag If the user writes the SSPBUF when a Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 17-19: FIRST START BIT TIMING Note: If, at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I 2C module is reset into its Idle state. Note: Because queueing of events is not allowed, writing to the lower 5 bits of SSPCON2 is disabled until the Start condition is complete. SDA SCL S TBRG 1st bit 2nd bit TBRG SDA = 1, At completion of Start bit, SCL = 1 TBRG Write to SSPBUF occurs here hardware clears SEN bit TBRG Write to SEN bit occurs here Set S bit (SSPSTAT<3>) and sets SSPIF bit PIC18F2420/2520/4420/4520 DS39631E-page 190 © 2008 Microchip Technology Inc. 17.4.9 I2C MASTER MODE REPEATED START CONDITION TIMING A Repeated Start condition occurs when the RSEN bit (SSPCON2<1>) is programmed high and the I2C logic module is in the Idle state. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded with the contents of SSPADD<5:0> and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. Following this, the RSEN bit (SSPCON2<1>) will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit (SSPSTAT<3>) will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. Immediately following the SSPIF bit getting set, the user may write the SSPBUF with the 7-bit address in 7-bit mode or the default first address in 10-bit mode. After the first eight bits are transmitted and an ACK is received, the user may then transmit an additional eight bits of address (10-bit mode) or eight bits of data (7-bit mode). 17.4.9.1 WCOL Status Flag If the user writes the SSPBUF when a Repeated Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 17-20: REPEATED START CONDITION WAVEFORM Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. 2: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low-to-high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. Note: Because queueing of events is not allowed, writing of the lower 5 bits of SSPCON2 is disabled until the Repeated Start condition is complete. SDA SCL Sr = Repeated Start Write to SSPCON2 Write to SSPBUF occurs here on falling edge of ninth clock, end of Xmit At completion of Start bit, hardware clears RSEN bit 1st bit S bit set by hardware TBRG TBRG SDA = 1, SDA = 1, SCL (no change). SCL = 1 occurs here. TBRG TBRG TBRG and sets SSPIF RSEN bit set by hardware © 2008 Microchip Technology Inc. DS39631E-page 191 PIC18F2420/2520/4420/4520 17.4.10 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full flag bit, BF, and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted (see data hold time specification parameter 106). SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high (see data setup time specification parameter 107). When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received properly. The status of ACK is written into the ACKDT bit on the falling edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 17-21). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will deassert the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit (SSPCON2<6>). Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 17.4.10.1 BF Status Flag In Transmit mode, the BF bit (SSPSTAT<0>) is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. 17.4.10.2 WCOL Status Flag If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). WCOL must be cleared in software. 17.4.10.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call), or when the slave has properly received its data. 17.4.11 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN (SSPCON2<3>). The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-to-low/ low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>). 17.4.11.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 17.4.11.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 17.4.11.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded. PIC18F2420/2520/4420/4520 DS39631E-page 192 © 2008 Microchip Technology Inc. FIGURE 17-21: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESSING) SDA SCL SSPIF BF (SSPSTAT<0>) SEN A7 A6 A5 A4 A3 A2 A1 ACK = ‘0’ D7 D6 D5 D4 D3 D2 D1 D0 ACK Transmitting Data or Second Half R/W = 0 Transmit Address to Slave 123456789 123456789 P Cleared in software service routine from MSSP interrupt SSPBUF is written in software After Start condition, SEN cleared by hardware S SSPBUF written with 7-bit address and R/W start transmit SCL held low while CPU responds to SSPIF SEN = 0 of 10-Bit Address Write SSPCON2<0> SEN = 1 Start condition begins From slave, clear ACKSTAT bit SSPCON2<6> ACKSTAT in SSPCON2 = 1 Cleared in software SSPBUF written PEN R/W Cleared in software © 2008 Microchip Technology Inc. DS39631E-page 193 PIC18F2420/2520/4420/4520 FIGURE 17-22: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESSING) P 9 8 7 6 5 D0 D1 D2 D3 D4 D5 D6 D7 S A7 A6 A5 A4 A3 A2 A1 SDA SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 678 9 1234 Bus master terminates transfer ACK Receiving Data from Slave Receiving Data from Slave D0 D1 D2 D3 D4 D5 D6 D7 ACK R/W = 0 Transmit Address to Slave SSPIF BF ACK is not sent Write to SSPCON2<0> (SEN = 1), Write to SSPBUF occurs here, ACK from Slave Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) PEN bit = 1 written here Data shifted in on falling edge of CLK Cleared in software start XMIT SEN = 0 SSPOV SDA = 0, SCL = 1 while CPU (SSPSTAT<0>) ACK Cleared in software Cleared in software Set SSPIF interrupt at end of receive Set P bit (SSPSTAT<4>) and SSPIF Cleared in software ACK from Master Set SSPIF at end Set SSPIF interrupt at end of Acknowledge sequence Set SSPIF interrupt at end of Acknowledge sequence of receive Set ACKEN, start Acknowledge sequence SSPOV is set because SSPBUF is still full SDA = ACKDT = 1 RCEN cleared automatically RCEN = 1, start next receive Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 RCEN cleared automatically responds to SSPIF ACKEN begin Start condition Cleared in software SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF PIC18F2420/2520/4420/4520 DS39631E-page 194 © 2008 Microchip Technology Inc. 17.4.12 ACKNOWLEDGE SEQUENCE TIMING An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>). When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 17-23). 17.4.12.1 WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). 17.4.13 STOP CONDITION TIMING A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN (SSPCON2<2>). At the end of a receive/ transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to 0. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit (SSPSTAT<4>) is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 17-24). 17.4.13.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 17-23: ACKNOWLEDGE SEQUENCE WAVEFORM FIGURE 17-24: STOP CONDITION RECEIVE OR TRANSMIT MODE Note: TBRG = one Baud Rate Generator period. SDA SCL SSPIF set at Acknowledge sequence starts here, write to SSPCON2 ACKEN automatically cleared Cleared in TBRG TBRG the end of receive 8 ACKEN = 1, ACKDT = 0 D0 9 SSPIF software SSPIF set at the end of Acknowledge sequence Cleared in software ACK SCL SDA SDA asserted low before rising edge of clock Write to SSPCON2, set PEN Falling edge of SCL = 1 for TBRG, followed by SDA = 1 for TBRG 9th clock SCL brought high after TBRG Note: TBRG = one Baud Rate Generator period. TBRG TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. TBRG to setup Stop condition ACK P TBRG PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set © 2008 Microchip Technology Inc. DS39631E-page 195 PIC18F2420/2520/4420/4520 17.4.14 SLEEP OPERATION While in Sleep mode, the I2C module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 17.4.15 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 17.4.16 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit (SSPSTAT<4>) is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the MSSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed in hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • Address Transfer • Data Transfer • A Start Condition • A Repeated Start Condition • An Acknowledge Condition 17.4.17 MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF and reset the I 2C port to its Idle state (Figure 17-25). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared. FIGURE 17-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE SDA SCL BCLIF SDA released SDA line pulled low by another source Sample SDA. While SCL is high, data doesn’t match what is driven Bus collision has occurred. Set bus collision interrupt (BCLIF) by the master. by master Data changes while SCL = 0 PIC18F2420/2520/4420/4520 DS39631E-page 196 © 2008 Microchip Technology Inc. 17.4.17.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) SDA or SCL is sampled low at the beginning of the Start condition (Figure 17-26). b) SCL is sampled low before SDA is asserted low (Figure 17-27). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted, • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 17-26). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded from SSPADD<6:0> and counts down to 0. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 17-28). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to 0; if the SCL pin is sampled as ‘0’ during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. FIGURE 17-26: BUS COLLISION DURING START CONDITION (SDA ONLY) Note: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. SDA SCL SEN SDA sampled low before SDA goes low before the SEN bit is set. S bit and SSPIF set because MSSP module reset into Idle state. SEN cleared automatically because of bus collision. S bit and SSPIF set because Set SEN, enable Start condition if SDA = 1, SCL = 1 SDA = 0, SCL = 1. BCLIF S SSPIF SDA = 0, SCL = 1. SSPIF and BCLIF are cleared in software SSPIF and BCLIF are cleared in software Set BCLIF, Start condition. Set BCLIF. © 2008 Microchip Technology Inc. DS39631E-page 197 PIC18F2420/2520/4420/4520 FIGURE 17-27: BUS COLLISION DURING START CONDITION (SCL = 0) FIGURE 17-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA SCL SEN bus collision occurs. Set BCLIF. SCL = 0 before SDA = 0, Set SEN, enable Start sequence if SDA = 1, SCL = 1 TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF Interrupt cleared in software bus collision occurs. Set BCLIF. SCL = 0 before BRG time-out, ‘0’ ‘0’ ‘0’ ‘0’ SDA SCL SEN Set S Less than TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF S Interrupts cleared set SSPIF in software SDA = 0, SCL = 1, SCL pulled low after BRG time-out Set SSPIF ‘0’ SDA pulled low by other master. Reset BRG and assert SDA. Set SEN, enable Start sequence if SDA = 1, SCL = 1 PIC18F2420/2520/4420/4520 DS39631E-page 198 © 2008 Microchip Technology Inc. 17.4.17.2 Bus Collision During a Repeated Start Condition During a Repeated Start condition, a bus collision occurs if: a) A low level is sampled on SDA when SCL goes from low level to high level. b) SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. When the user deasserts SDA and the pin is allowed to float high, the BRG is loaded with SSPADD<6:0> and counts down to 0. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 17-29). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition, see Figure 17-30. If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. FIGURE 17-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) FIGURE 17-30: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) SDA SCL RSEN BCLIF S SSPIF Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. Cleared in software ‘0’ ‘0’ SDA SCL BCLIF RSEN S SSPIF Interrupt cleared in software SCL goes low before SDA, set BCLIF. Release SDA and SCL. TBRG TBRG ‘0’ © 2008 Microchip Technology Inc. DS39631E-page 199 PIC18F2420/2520/4420/4520 17.4.17.3 Bus Collision During a Stop Condition Bus collision occurs during a Stop condition if: a) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. b) After the SCL pin is deasserted, SCL is sampled low before SDA goes high. The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD<6:0> and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 17-31). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 17-32). FIGURE 17-31: BUS COLLISION DURING A STOP CONDITION (CASE 1) FIGURE 17-32: BUS COLLISION DURING A STOP CONDITION (CASE 2) SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG SDA asserted low SDA sampled low after TBRG, set BCLIF ‘0’ ‘0’ SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG Assert SDA SCL goes low before SDA goes high, set BCLIF ‘0’ ‘0’ PIC18F2420/2520/4420/4520 DS39631E-page 200 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 201 PIC18F2420/2520/4420/4520 18.0 ENHANCED UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (EUSART) The Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module is one of the two serial I/O modules. (Generically, the USART is also known as a Serial Communications Interface or SCI.) The EUSART can be configured as a full-duplex asynchronous system that can communicate with peripheral devices, such as CRT terminals and personal computers. It can also be configured as a halfduplex, synchronous system that can communicate with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs, etc. The Enhanced USART module implements additional features, including automatic baud rate detection and calibration, automatic wake-up on Sync Break reception and 12-bit Break character transmit. These make it ideally suited for use in Local Interconnect Network bus (LIN bus) systems. The EUSART can be configured in the following modes: • Asynchronous (full duplex) with: - Auto-wake-up on character reception - Auto-baud calibration - 12-bit Break character transmission • Synchronous – Master (half duplex) with selectable clock polarity • Synchronous – Slave (half duplex) with selectable clock polarity The pins of the Enhanced USART are multiplexed with PORTC. In order to configure RC6/TX/CK and RC7/RX/DT as an EUSART: • bit SPEN (RCSTA<7>) must be set (= 1) • bit TRISC<7> must be set (= 1) • bit TRISC<6> must be set (= 1) The operation of the Enhanced USART module is controlled through three registers: • Transmit Status and Control (TXSTA) • Receive Status and Control (RCSTA) • Baud Rate Control (BAUDCON) These are detailed on the following pages in Register 18-1, Register 18-2 and Register 18-3, respectively. Note: The EUSART control will automatically reconfigure the pin from input to output as needed. PIC18F2420/2520/4420/4520 DS39631E-page 202 © 2008 Microchip Technology Inc. REGISTER 18-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0 CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-Bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit enabled 0 = Transmit disabled bit 4 SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care. bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full bit 0 TX9D: 9th Bit of Transmit Data Can be address/data bit or a parity bit. Note 1: SREN/CREN overrides TXEN in Sync mode. © 2008 Microchip Technology Inc. DS39631E-page 203 PIC18F2420/2520/4420/4520 REGISTER 18-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins) 0 = Serial port disabled (held in Reset) bit 6 RX9: 9-Bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care. Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave: Don’t care. bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-Bit (RX9 = 1): 1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 9-Bit (RX9 = 0): Don’t care. bit 2 FERR: Framing Error bit 1 = Framing error (can be cleared by reading RCREG register and receiving next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit, CREN) 0 = No overrun error bit 0 RX9D: 9th Bit of Received Data This can be address/data bit or a parity bit and must be calculated by user firmware. PIC18F2420/2520/4420/4520 DS39631E-page 204 © 2008 Microchip Technology Inc. REGISTER 18-3: BAUDCON: BAUD RATE CONTROL REGISTER R/W-0 R-1 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ABDOVF: Auto-Baud Acquisition Rollover Status bit 1 = A BRG rollover has occurred during Auto-Baud Rate Detect mode (must be cleared in software) 0 = No BRG rollover has occurred bit 6 RCIDL: Receive Operation Idle Status bit 1 = Receive operation is Idle 0 = Receive operation is active bit 5 RXDTP: Data/Receive Polarity Select bit Asynchronous mode: 1 = Receive data (RX) is inverted (active-low) 0 = Receive data (RX) is not inverted (active-high) Synchronous mode: 1 = Data (DT) is inverted (active-low) 0 = Data (DT) is not inverted (active-high) bit 4 TXCKP: Clock and Data Polarity Select bit Asynchronous mode: 1 = Idle state for transmit (TX) is a low level 0 = Idle state for transmit (TX) is a high level Synchronous mode: 1 = Idle state for clock (CK) is a high level 0 = Idle state for clock (CK) is a low level bit 3 BRG16: 16-Bit Baud Rate Register Enable bit 1 = 16-bit Baud Rate Generator – SPBRGH and SPBRG 0 = 8-bit Baud Rate Generator – SPBRG only (Compatible mode), SPBRGH value ignored bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = EUSART will continue to sample the RX pin – interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = RX pin not monitored or rising edge detected Synchronous mode: Unused in this mode. bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Enable baud rate measurement on the next character. Requires reception of a Sync field (55h); cleared in hardware upon completion. 0 = Baud rate measurement disabled or completed Synchronous mode: Unused in this mode. © 2008 Microchip Technology Inc. DS39631E-page 205 PIC18F2420/2520/4420/4520 18.1 Baud Rate Generator (BRG) The BRG is a dedicated, 8-bit or 16-bit generator that supports both the Asynchronous and Synchronous modes of the EUSART. By default, the BRG operates in 8-bit mode; setting the BRG16 bit (BAUDCON<3>) selects 16-bit mode. The SPBRGH:SPBRG register pair controls the period of a free-running timer. In Asynchronous mode, bits, BRGH (TXSTA<2>) and BRG16 (BAUDCON<3>), also control the baud rate. In Synchronous mode, BRGH is ignored. Table 18-1 shows the formula for computation of the baud rate for different EUSART modes which only apply in Master mode (internally generated clock). Given the desired baud rate and FOSC, the nearest integer value for the SPBRGH:SPBRG registers can be calculated using the formulas in Table 18-1. From this, the error in baud rate can be determined. An example calculation is shown in Example 18-1. Typical baud rates and error values for the various Asynchronous modes are shown in Table 18-2. It may be advantageous to use the high baud rate (BRGH = 1) or the 16-bit BRG to reduce the baud rate error, or achieve a slow baud rate for a fast oscillator frequency. Writing a new value to the SPBRGH:SPBRG registers causes the BRG timer to be reset (or cleared). This ensures the BRG does not wait for a timer overflow before outputting the new baud rate. 18.1.1 OPERATION IN POWER-MANAGED MODES The device clock is used to generate the desired baud rate. When one of the power-managed modes is entered, the new clock source may be operating at a different frequency. This may require an adjustment to the value in the SPBRG register pair. 18.1.2 SAMPLING The data on the RX pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the RX pin. TABLE 18-1: BAUD RATE FORMULAS Configuration Bits BRG/EUSART Mode Baud Rate Formula SYNC BRG16 BRGH 000 8-Bit/Asynchronous FOSC/[64 (n + 1)] 001 8-Bit/Asynchronous FOSC/[16 (n + 1)] 010 16-Bit/Asynchronous 011 16-Bit/Asynchronous 10x 8-Bit/Synchronous FOSC/[4 (n + 1)] 11x 16-Bit/Synchronous Legend: x = Don’t care, n = value of SPBRGH:SPBRG register pair PIC18F2420/2520/4420/4520 DS39631E-page 206 © 2008 Microchip Technology Inc. EXAMPLE 18-1: CALCULATING BAUD RATE ERROR TABLE 18-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register High Byte 51 SPBRG EUSART Baud Rate Generator Register Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the BRG. For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: Desired Baud Rate = FOSC/(64 ([SPBRGH:SPBRG] + 1)) Solving for SPBRGH:SPBRG: X = ((FOSC/Desired Baud Rate)/64) – 1 = ((16000000/9600)/64) – 1 = [25.042] = 25 Calculated Baud Rate = 16000000/(64 (25 + 1)) = 9615 Error = (Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate = (9615 – 9600)/9600 = 0.16% © 2008 Microchip Technology Inc. DS39631E-page 207 PIC18F2420/2520/4420/4520 TABLE 18-3: BAUD RATES FOR ASYNCHRONOUS MODES BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 — — — — — — — — — — — — 1.2 — — — 1.221 1.73 255 1.202 0.16 129 1.201 -0.16 103 2.4 2.441 1.73 255 2.404 0.16 129 2.404 0.16 64 2.403 -0.16 51 9.6 9.615 0.16 64 9.766 1.73 31 9.766 1.73 15 9.615 -0.16 12 19.2 19.531 1.73 31 19.531 1.73 15 19.531 1.73 7 — — — 57.6 56.818 -1.36 10 62.500 8.51 4 52.083 -9.58 2 — — — 115.2 125.000 8.51 4 104.167 -9.58 2 78.125 -32.18 1 — — — BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 0.300 0.16 207 0.300 -0.16 103 0.300 -0.16 51 1.2 1.202 0.16 51 1.201 -0.16 25 1.201 -0.16 12 2.4 2.404 0.16 25 2.403 -0.16 12 — — — 9.6 8.929 -6.99 6 — — — — — — 19.2 20.833 8.51 2 — — — — — — 57.6 62.500 8.51 0 — — — — — — 115.2 62.500 -45.75 0 — — — — — — BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 — — — — — — — — — — — — 1.2 — — — — — — — — — — — — 2.4 — — — — — — 2.441 1.73 255 2.403 -0.16 207 9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51 19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25 57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8 115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — — BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 — — — — — — 0.300 -0.16 207 1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51 2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25 9.6 9.615 0.16 25 9.615 -0.16 12 — — — 19.2 19.231 0.16 12 — — — — — — 57.6 62.500 8.51 3 — — — — — — 115.2 125.000 8.51 1 — — — — — — PIC18F2420/2520/4420/4520 DS39631E-page 208 © 2008 Microchip Technology Inc. BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 0.300 0.00 8332 0.300 0.02 4165 0.300 0.02 2082 0.300 -0.04 1665 1.2 1.200 0.02 2082 1.200 -0.03 1041 1.200 -0.03 520 1.201 -0.16 415 2.4 2.402 0.06 1040 2.399 -0.03 520 2.404 0.16 259 2.403 -0.16 207 9.6 9.615 0.16 259 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51 19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25 57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8 115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — — BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 0.300 0.04 832 0.300 -0.16 415 0.300 -0.16 207 1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51 2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25 9.6 9.615 0.16 25 9.615 -0.16 12 — — — 19.2 19.231 0.16 12 — — — — — — 57.6 62.500 8.51 3 — — — — — — 115.2 125.000 8.51 1 — — — — — — BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 0.300 0.00 33332 0.300 0.00 16665 0.300 0.00 8332 0.300 -0.01 6665 1.2 1.200 0.00 8332 1.200 0.02 4165 1.200 0.02 2082 1.200 -0.04 1665 2.4 2.400 0.02 4165 2.400 0.02 2082 2.402 0.06 1040 2.400 -0.04 832 9.6 9.606 0.06 1040 9.596 -0.03 520 9.615 0.16 259 9.615 -0.16 207 19.2 19.193 -0.03 520 19.231 0.16 259 19.231 0.16 129 19.230 -0.16 103 57.6 57.803 0.35 172 57.471 -0.22 86 58.140 0.94 42 57.142 0.79 34 115.2 114.943 -0.22 86 116.279 0.94 42 113.636 -1.36 21 117.647 -2.12 16 BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) Actual Rate (K) % Error SPBRG Value (decimal) 0.3 0.300 0.01 3332 0.300 -0.04 1665 0.300 -0.04 832 1.2 1.200 0.04 832 1.201 -0.16 415 1.201 -0.16 207 2.4 2.404 0.16 415 2.403 -0.16 207 2.403 -0.16 103 9.6 9.615 0.16 103 9.615 -0.16 51 9.615 -0.16 25 19.2 19.231 0.16 51 19.230 -0.16 25 19.230 -0.16 12 57.6 58.824 2.12 16 55.555 3.55 8 — — — 115.2 111.111 -3.55 8 — — — — — — TABLE 18-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) © 2008 Microchip Technology Inc. DS39631E-page 209 PIC18F2420/2520/4420/4520 18.1.3 AUTO-BAUD RATE DETECT The Enhanced USART module supports the automatic detection and calibration of baud rate. This feature is active only in Asynchronous mode and while the WUE bit is clear. The automatic baud rate measurement sequence (Figure 18-1) begins whenever a Start bit is received and the ABDEN bit is set. The calculation is self-averaging. In the Auto-Baud Rate Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX signal, the RX signal is timing the BRG. In ABD mode, the internal Baud Rate Generator is used as a counter to time the bit period of the incoming serial byte stream. Once the ABDEN bit is set, the state machine will clear the BRG and look for a Start bit. The Auto-Baud Rate Detect must receive a byte with the value 55h (ASCII “U”, which is also the LIN bus Sync character) in order to calculate the proper bit rate. The measurement is taken over both a low and a high bit time in order to minimize any effects caused by asymmetry of the incoming signal. After a Start bit, the SPBRG begins counting up, using the preselected clock source on the first rising edge of RX. After eight bits on the RX pin or the fifth rising edge, an accumulated value totalling the proper BRG period is left in the SPBRGH:SPBRG register pair. Once the 5th edge is seen (this should correspond to the Stop bit), the ABDEN bit is automatically cleared. If a rollover of the BRG occurs (an overflow from FFFFh to 0000h), the event is trapped by the ABDOVF status bit (BAUDCON<7>). It is set in hardware by BRG rollovers and can be set or cleared by the user in software. ABD mode remains active after rollover events and the ABDEN bit remains set (Figure 18-2). While calibrating the baud rate period, the BRG registers are clocked at 1/8th the preconfigured clock rate. Note that the BRG clock will be configured by the BRG16 and BRGH bits. Independent of the BRG16 bit setting, both the SPBRG and SPBRGH will be used as a 16-bit counter. This allows the user to verify that no carry occurred for 8-bit modes by checking for 00h in the SPBRGH register. Refer to Table 18-4 for counter clock rates to the BRG. While the ABD sequence takes place, the EUSART state machine is held in Idle. The RCIF interrupt is set once the fifth rising edge on RX is detected. The value in the RCREG needs to be read to clear the RCIF interrupt. The contents of RCREG should be discarded. TABLE 18-4: BRG COUNTER CLOCK RATES 18.1.3.1 ABD and EUSART Transmission Since the BRG clock is reversed during ABD acquisition, the EUSART transmitter cannot be used during ABD. This means that whenever the ABDEN bit is set, TXREG cannot be written to. Users should also ensure that ABDEN does not become set during a transmit sequence. Failing to do this may result in unpredictable EUSART operation. Note 1: If the WUE bit is set with the ABDEN bit, Auto-Baud Rate Detection will occur on the byte following the Break character. 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible due to bit error rates. Overall system timing and communication baud rates must be taken into consideration when using the Auto-Baud Rate Detection feature. BRG16 BRGH BRG Counter Clock 0 0 FOSC/512 0 1 FOSC/128 1 0 FOSC/128 1 1 FOSC/32 Note: During the ABD sequence, SPBRG and SPBRGH are both used as a 16-bit counter, independent of BRG16 setting. PIC18F2420/2520/4420/4520 DS39631E-page 210 © 2008 Microchip Technology Inc. FIGURE 18-1: AUTOMATIC BAUD RATE CALCULATION FIGURE 18-2: BRG OVERFLOW SEQUENCE BRG Value RX pin ABDEN bit RCIF bit Bit 0 Bit 1 (Interrupt) Read RCREG BRG Clock Start Set by User Auto-Cleared XXXXh 0000h Edge #1 Bit 2 Bit 3 Edge #2 Bit 4 Bit 5 Edge #3 Bit 6 Bit 7 Edge #4 Stop Bit Edge #5 001Ch Note: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0. SPBRG XXXXh 1Ch SPBRGH XXXXh 00h Start Bit 0 XXXXh 0000h 0000h FFFFh BRG Clock ABDEN bit RX pin ABDOVF bit BRG Value © 2008 Microchip Technology Inc. DS39631E-page 211 PIC18F2420/2520/4420/4520 18.2 EUSART Asynchronous Mode The Asynchronous mode of operation is selected by clearing the SYNC bit (TXSTA<4>). In this mode, the EUSART uses standard Non-Return-to-Zero (NRZ) format (one Start bit, eight or nine data bits and one Stop bit). The most common data format is 8 bits. An on-chip, dedicated 8-bit/16-bit Baud Rate Generator can be used to derive standard baud rate frequencies from the oscillator. The EUSART transmits and receives the LSb first. The EUSART’s transmitter and receiver are functionally independent but use the same data format and baud rate. The Baud Rate Generator produces a clock, either x16 or x64 of the bit shift rate depending on the BRGH and BRG16 bits (TXSTA<2> and BAUDCON<3>). Parity is not supported by the hardware but can be implemented in software and stored as the 9th data bit. When operating in Asynchronous mode, the EUSART module consists of the following important elements: • Baud Rate Generator • Sampling Circuit • Asynchronous Transmitter • Asynchronous Receiver • Auto-Wake-up on Sync Break Character • 12-Bit Break Character Transmit • Auto-Baud Rate Detection 18.2.1 EUSART ASYNCHRONOUS TRANSMITTER The EUSART transmitter block diagram is shown in Figure 18-3. The heart of the transmitter is the Transmit (Serial) Shift Register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG. The TXREG register is loaded with data in software. The TSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the TSR is loaded with new data from the TXREG register (if available). Once the TXREG register transfers the data to the TSR register (occurs in one TCY), the TXREG register is empty and the TXIF flag bit (PIR1<4>) is set. This interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TXIE (PIE1<4>). TXIF will be set regardless of the state of TXIE; it cannot be cleared in software. TXIF is also not cleared immediately upon loading TXREG, but becomes valid in the second instruction cycle following the load instruction. Polling TXIF immediately following a load of TXREG will return invalid results. While TXIF indicates the status of the TXREG register, another bit, TRMT (TXSTA<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR register is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. To set up an Asynchronous Transmission: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. 3. If interrupts are desired, set enable bit, TXIE. 4. If 9-bit transmission is desired, set transmit bit, TX9. Can be used as address/data bit. 5. Enable the transmission by setting bit, TXEN, which will also set bit, TXIF. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. 7. Load data to the TXREG register (starts transmission). 8. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. FIGURE 18-3: EUSART TRANSMIT BLOCK DIAGRAM Note 1: The TSR register is not mapped in data memory so it is not available to the user. 2: Flag bit, TXIF, is set when enable bit, TXEN, is set. TXIF TXIE Interrupt TXEN Baud Rate CLK SPBRG Baud Rate Generator TX9D MSb LSb Data Bus TXREG Register TSR Register (8) 0 TX9 TRMT SPEN TX pin Pin Buffer and Control 8 • • • BRG16 SPBRGH PIC18F2420/2520/4420/4520 DS39631E-page 212 © 2008 Microchip Technology Inc. FIGURE 18-4: ASYNCHRONOUS TRANSMISSION FIGURE 18-5: ASYNCHRONOUS TRANSMISSION (BACK TO BACK) TABLE 18-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 TXREG EUSART Transmit Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register High Byte 51 SPBRG EUSART Baud Rate Generator Register Low Byte 51 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission. Note 1: Reserved in 28-pin devices; always maintain these bits clear. Word 1 Word 1 Transmit Shift Reg Start bit bit 0 bit 1 bit 7/8 Write to TXREG BRG Output (Shift Clock) TX (pin) TXIF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) 1 TCY Stop bit Word 1 Transmit Shift Reg. Write to TXREG BRG Output (Shift Clock) TX (pin) TXIF bit (Interrupt Reg. Flag) TRMT bit (Transmit Shift Reg. Empty Flag) Word 1 Word 2 Word 1 Word 2 Stop bit Start bit Transmit Shift Reg. Word 1 Word 2 bit 0 bit 1 bit 7/8 bit 0 Note: This timing diagram shows two consecutive transmissions. 1 TCY 1 TCY Start bit © 2008 Microchip Technology Inc. DS39631E-page 213 PIC18F2420/2520/4420/4520 18.2.2 EUSART ASYNCHRONOUS RECEIVER The receiver block diagram is shown in Figure 18-6. The data is received on the RX pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at x16 times the baud rate, whereas the main receive serial shifter operates at the bit rate or at FOSC. This mode would typically be used in RS-232 systems. To set up an Asynchronous Reception: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. 3. If interrupts are desired, set enable bit, RCIE. 4. If 9-bit reception is desired, set bit, RX9. 5. Enable the reception by setting bit, CREN. 6. Flag bit, RCIF, will be set when reception is complete and an interrupt will be generated if enable bit, RCIE, was set. 7. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 8. Read the 8-bit received data by reading the RCREG register. 9. If any error occurred, clear the error by clearing enable bit, CREN. 10. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. 18.2.3 SETTING UP 9-BIT MODE WITH ADDRESS DETECT This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If interrupts are required, set the RCEN bit and select the desired priority level with the RCIP bit. 4. Set the RX9 bit to enable 9-bit reception. 5. Set the ADDEN bit to enable address detect. 6. Enable reception by setting the CREN bit. 7. The RCIF bit will be set when reception is complete. The interrupt will be Acknowledged if the RCIE and GIE bits are set. 8. Read the RCSTA register to determine if any error occurred during reception, as well as read bit 9 of data (if applicable). 9. Read RCREG to determine if the device is being addressed. 10. If any error occurred, clear the CREN bit. 11. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and interrupt the CPU. FIGURE 18-6: EUSART RECEIVE BLOCK DIAGRAM x64 Baud Rate CLK Baud Rate Generator RX Pin Buffer and Control SPEN Data Recovery CREN OERR FERR MSb RSR Register LSb RX9D RCREG Register FIFO Interrupt RCIF RCIE Data Bus 8 ÷ 64 ÷ 16 or Stop (8) 7 1 0 Start RX9 • • • BRG16 SPBRGH SPBRG or ÷ 4 PIC18F2420/2520/4420/4520 DS39631E-page 214 © 2008 Microchip Technology Inc. FIGURE 18-7: ASYNCHRONOUS RECEPTION TABLE 18-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION 18.2.4 AUTO-WAKE-UP ON SYNC BREAK CHARACTER During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper byte reception cannot be performed. The auto-wake-up feature allows the controller to wake-up due to activity on the RX/DT line while the EUSART is operating in Asynchronous mode. The auto-wake-up feature is enabled by setting the WUE bit (BAUDCON<1>). Once set, the typical receive sequence on RX/DT is disabled and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX/DT line. (This coincides with the start of a Sync Break or a Wake-up Signal character for the LIN protocol.) Following a wake-up event, the module generates an RCIF interrupt. The interrupt is generated synchronously to the Q clocks in normal operating modes (Figure 18-8) and asynchronously, if the device is in Sleep mode (Figure 18-9). The interrupt condition is cleared by reading the RCREG register. The WUE bit is automatically cleared once a low-tohigh transition is observed on the RX line following the wake-up event. At this point, the EUSART module is in Idle mode and returns to normal operation. This signals to the user that the Sync Break event is over. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 RCREG EUSART Receive Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register High Byte 51 SPBRG EUSART Baud Rate Generator Register Low Byte 51 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception. Note 1: Reserved in 28-pin devices; always maintain these bits clear. Start bit bit 0 bit 7/8 bit 1 Stop bit 0 bit 7/8 bit Start bit Start bit 7/8 Stop bit bit RX (pin) Rcv Buffer Reg Rcv Shift Reg Read Rcv Buffer Reg RCREG RCIF (Interrupt Flag) OERR bit CREN Word 1 RCREG Word 2 RCREG Stop bit Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word causing the OERR (overrun) bit to be set. © 2008 Microchip Technology Inc. DS39631E-page 215 PIC18F2420/2520/4420/4520 18.2.4.1 Special Considerations Using Auto-Wake-up Since auto-wake-up functions by sensing rising edge transitions on RX/DT, information with any state changes before the Stop bit may signal a false End-ofCharacter (EOC) and cause data or framing errors. To work properly, therefore, the initial character in the transmission must be all ‘0’s. This can be 00h (8 bytes) for standard RS-232 devices or 000h (12 bits) for LIN bus. Oscillator start-up time must also be considered, especially in applications using oscillators with longer start-up intervals (i.e., XT or HS mode). The Sync Break (or Wake-up Signal) character must be of sufficient length and be followed by a sufficient interval to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART. 18.2.4.2 Special Considerations Using the WUE Bit The timing of WUE and RCIF events may cause some confusion when it comes to determining the validity of received data. As noted, setting the WUE bit places the EUSART in an Idle mode. The wake-up event causes a receive interrupt by setting the RCIF bit. The WUE bit is cleared after this when a rising edge is seen on RX/DT. The interrupt condition is then cleared by reading the RCREG register. Ordinarily, the data in RCREG will be dummy data and should be discarded. The fact that the WUE bit has been cleared (or is still set) and the RCIF flag is set should not be used as an indicator of the integrity of the data in RCREG. Users should consider implementing a parallel method in firmware to verify received data integrity. To assure that no actual data is lost, check the RCIDL bit to verify that a receive operation is not in process. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode. FIGURE 18-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION FIGURE 18-9: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 WUE bit(1) RX/DT Line RCIF Note 1: The EUSART remains in Idle while the WUE bit is set. Bit Set by User Cleared Due to User Read of RCREG Auto-Cleared Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 WUE bit(2) RX/DT Line RCIF Bit Set by User Cleared Due to User Read of RCREG Sleep Command Executed Note 1: If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur before the oscillator is ready. This sequence should not depend on the presence of Q clocks. 2: The EUSART remains in Idle while the WUE bit is set. Sleep Ends Note 1 Auto-Cleared PIC18F2420/2520/4420/4520 DS39631E-page 216 © 2008 Microchip Technology Inc. 18.2.5 BREAK CHARACTER SEQUENCE The EUSART module has the capability of sending the special Break character sequences that are required by the LIN bus standard. The Break character transmit consists of a Start bit, followed by twelve ‘0’ bits and a Stop bit. The frame Break character is sent whenever the SENDB and TXEN bits (TXSTA<3> and TXSTA<5>) are set while the Transmit Shift register is loaded with data. Note that the value of data written to TXREG will be ignored and all ‘0’s will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN specification). Note that the data value written to the TXREG for the Break character is ignored. The write simply serves the purpose of initiating the proper sequence. The TRMT bit indicates when the transmit operation is active or Idle, just as it does during normal transmission. See Figure 18-10 for the timing of the Break character sequence. 18.2.5.1 Break and Sync Transmit Sequence The following sequence will send a message frame header made up of a Break, followed by an Auto-Baud Sync byte. This sequence is typical of a LIN bus master. 1. Configure the EUSART for the desired mode. 2. Set the TXEN and SENDB bits to set up the Break character. 3. Load the TXREG with a dummy character to initiate transmission (the value is ignored). 4. Write ‘55h’ to TXREG to load the Sync character into the transmit FIFO buffer. 5. After the Break has been sent, the SENDB bit is reset by hardware. The Sync character now transmits in the preconfigured mode. When the TXREG becomes empty, as indicated by the TXIF, the next data byte can be written to TXREG. 18.2.6 RECEIVING A BREAK CHARACTER The Enhanced USART module can receive a Break character in two ways. The first method forces configuration of the baud rate at a frequency of 9/13 the typical speed. This allows for the Stop bit transition to be at the correct sampling location (13 bits for Break versus Start bit and 8 data bits for typical data). The second method uses the auto-wake-up feature described in Section 18.2.4 “Auto-Wake-up on Sync Break Character”. By enabling this feature, the EUSART will sample the next two transitions on RX/DT, cause an RCIF interrupt and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Rate Detect feature. For both methods, the user can set the ABD bit once the TXIF interrupt is observed. FIGURE 18-10: SEND BREAK CHARACTER SEQUENCE Write to TXREG BRG Output (Shift Clock) Start Bit Bit 0 Bit 1 Bit 11 Stop Bit Break TXIF bit (Transmit Buffer Reg. Empty Flag) TX (pin) TRMT bit (Transmit Shift Reg. Empty Flag) SENDB (Transmit Shift Reg. Empty Flag) SENDB Sampled Here Auto-Cleared Dummy Write © 2008 Microchip Technology Inc. DS39631E-page 217 PIC18F2420/2520/4420/4520 18.3 EUSART Synchronous Master Mode The Synchronous Master mode is entered by setting the CSRC bit (TXSTA<7>). In this mode, the data is transmitted in a half-duplex manner (i.e., transmission and reception do not occur at the same time). When transmitting data, the reception is inhibited and vice versa. Synchronous mode is entered by setting bit, SYNC (TXSTA<4>). In addition, enable bit, SPEN (RCSTA<7>), is set in order to configure the TX and RX pins to CK (clock) and DT (data) lines, respectively. The Master mode indicates that the processor transmits the master clock on the CK line. Clock polarity is selected with the TXCKP bit (BAUDCON<4>); setting TXCKP sets the Idle state on CK as high, while clearing the bit sets the Idle state as low. This option is provided to support Microwire devices with this module. 18.3.1 EUSART SYNCHRONOUS MASTER TRANSMISSION The EUSART transmitter block diagram is shown in Figure 18-3. The heart of the transmitter is the Transmit (Serial) Shift Register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG. The TXREG register is loaded with data in software. The TSR register is not loaded until the last bit has been transmitted from the previous load. As soon as the last bit is transmitted, the TSR is loaded with new data from the TXREG (if available). Once the TXREG register transfers the data to the TSR register (occurs in one TCY), the TXREG is empty and the TXIF flag bit (PIR1<4>) is set. The interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TXIE (PIE1<4>). TXIF is set regardless of the state of enable bit, TXIE; it cannot be cleared in software. It will reset only when new data is loaded into the TXREG register. While flag bit, TXIF, indicates the status of the TXREG register, another bit, TRMT (TXSTA<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TSR is not mapped in data memory so it is not available to the user. To set up a Synchronous Master Transmission: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. 2. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. 3. If interrupts are desired, set enable bit, TXIE. 4. If 9-bit transmission is desired, set bit, TX9. 5. Enable the transmission by setting bit, TXEN. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. 7. Start transmission by loading data to the TXREG register. 8. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. FIGURE 18-11: SYNCHRONOUS TRANSMISSION bit 0 bit 1 bit 7 Word 1 Q1 Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3Q4 Q1Q2 Q3Q4 Q1 Q2Q3Q4 Q1 Q2Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 bit 2 bit 0 bit 1 bit 7 RC7/RX/DT RC6/TX/CK pin Write to TXREG Reg TXIF bit (Interrupt Flag) TXEN bit ‘1’ ‘1’ Word 2 TRMT bit Write Word 1 Write Word 2 Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words. RC6/TX/CK pin (TXCKP = 0) (TXCKP = 1) PIC18F2420/2520/4420/4520 DS39631E-page 218 © 2008 Microchip Technology Inc. FIGURE 18-12: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) TABLE 18-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 TXREG EUSART Transmit Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register High Byte 51 SPBRG EUSART Baud Rate Generator Register Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission. Note 1: Reserved in 28-pin devices; always maintain these bits clear. RC7/RX/DT pin RC6/TX/CK pin Write to TXREG reg TXIF bit TRMT bit bit 0 bit 1 bit 2 bit 6 bit 7 TXEN bit © 2008 Microchip Technology Inc. DS39631E-page 219 PIC18F2420/2520/4420/4520 18.3.2 EUSART SYNCHRONOUS MASTER RECEPTION Once Synchronous mode is selected, reception is enabled by setting either the Single Receive Enable bit, SREN (RCSTA<5>), or the Continuous Receive Enable bit, CREN (RCSTA<4>). Data is sampled on the RX pin on the falling edge of the clock. If enable bit, SREN, is set, only a single word is received. If enable bit, CREN, is set, the reception is continuous until CREN is cleared. If both bits are set, then CREN takes precedence. To set up a Synchronous Master Reception: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. 2. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. 3. Ensure bits, CREN and SREN, are clear. 4. If interrupts are desired, set enable bit, RCIE. 5. If 9-bit reception is desired, set bit, RX9. 6. If a single reception is required, set bit, SREN. For continuous reception, set bit, CREN. 7. Interrupt flag bit, RCIF, will be set when reception is complete and an interrupt will be generated if the enable bit, RCIE, was set. 8. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG register. 10. If any error occurred, clear the error by clearing bit, CREN. 11. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. FIGURE 18-13: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) TABLE 18-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 RCREG EUSART Receive Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register High Byte 51 SPBRG EUSART Baud Rate Generator Register Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception. Note 1: Reserved in 28-pin devices; always maintain these bits clear. CREN bit RC7/RX/DT RC6/TX/CK pin Write to bit SREN SREN bit RCIF bit (Interrupt) Read RXREG Q2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 ‘0’ bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 ‘0’ Q1 Q2 Q3 Q4 Note: Timing diagram demonstrates Sync Master mode with bit, SREN = 1, and bit, BRGH = 0. RC6/TX/CK pin pin (TXCKP = 0) (TXCKP = 1) PIC18F2420/2520/4420/4520 DS39631E-page 220 © 2008 Microchip Technology Inc. 18.4 EUSART Synchronous Slave Mode Synchronous Slave mode is entered by clearing bit, CSRC (TXSTA<7>). This mode differs from the Synchronous Master mode in that the shift clock is supplied externally at the CK pin (instead of being supplied internally in Master mode). This allows the device to transfer or receive data while in any low-power mode. 18.4.1 EUSART SYNCHRONOUS SLAVE TRANSMISSION The operation of the Synchronous Master and Slave modes is identical, except in the case of the Sleep mode. If two words are written to the TXREG and then the SLEEP instruction is executed, the following will occur: a) The first word will immediately transfer to the TSR register and transmit. b) The second word will remain in the TXREG register. c) Flag bit, TXIF, will not be set. d) When the first word has been shifted out of TSR, the TXREG register will transfer the second word to the TSR and flag bit, TXIF, will now be set. e) If enable bit, TXIE, is set, the interrupt will wake the chip from Sleep. If the global interrupt is enabled, the program will branch to the interrupt vector. To set up a Synchronous Slave Transmission: 1. Enable the synchronous slave serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. 2. Clear bits, CREN and SREN. 3. If interrupts are desired, set enable bit, TXIE. 4. If 9-bit transmission is desired, set bit, TX9. 5. Enable the transmission by setting enable bit, TXEN. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. 7. Start transmission by loading data to the TXREG register. 8. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. TABLE 18-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 TXREG EUSART Transmit Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register High Byte 51 SPBRG EUSART Baud Rate Generator Register Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission. Note 1: Reserved in 28-pin devices; always maintain these bits clear. © 2008 Microchip Technology Inc. DS39631E-page 221 PIC18F2420/2520/4420/4520 18.4.2 EUSART SYNCHRONOUS SLAVE RECEPTION The operation of the Synchronous Master and Slave modes is identical, except in the case of Sleep, or any Idle mode and bit, SREN, which is a “don’t care” in Slave mode. If receive is enabled by setting the CREN bit prior to entering Sleep or any Idle mode, then a word may be received while in this low-power mode. Once the word is received, the RSR register will transfer the data to the RCREG register; if the RCIE enable bit is set, the interrupt generated will wake the chip from the low-power mode. If the global interrupt is enabled, the program will branch to the interrupt vector. To set up a Synchronous Slave Reception: 1. Enable the synchronous master serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. 2. If interrupts are desired, set enable bit, RCIE. 3. If 9-bit reception is desired, set bit, RX9. 4. To enable reception, set enable bit, CREN. 5. Flag bit, RCIF, will be set when reception is complete. An interrupt will be generated if enable bit, RCIE, was set. 6. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 7. Read the 8-bit received data by reading the RCREG register. 8. If any error occurred, clear the error by clearing bit, CREN. 9. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. TABLE 18-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 RCREG EUSART Receive Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register High Byte 51 SPBRG EUSART Baud Rate Generator Register Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception. Note 1: Reserved in 28-pin devices; always maintain these bits clear. PIC18F2420/2520/4420/4520 DS39631E-page 222 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 223 PIC18F2420/2520/4420/4520 19.0 10-BIT ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE The Analog-to-Digital (A/D) Converter module has 10 inputs for the 28-pin devices and 13 for the 40/44-pin devices. This module allows conversion of an analog input signal to a corresponding 10-bit digital number. The module has five registers: • A/D Result High Register (ADRESH) • A/D Result Low Register (ADRESL) • A/D Control Register 0 (ADCON0) • A/D Control Register 1 (ADCON1) • A/D Control Register 2 (ADCON2) The ADCON0 register, shown in Register 19-1, controls the operation of the A/D module. The ADCON1 register, shown in Register 19-2, configures the functions of the port pins. The ADCON2 register, shown in Register 19-3, configures the A/D clock source, programmed acquisition time and justification. REGISTER 19-1: ADCON0: A/D CONTROL REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-2 CHS<3:0>: Analog Channel Select bits 0000 = Channel 0 (AN0) 0001 = Channel 1 (AN1) 0010 = Channel 2 (AN2) 0011 = Channel 3 (AN3) 0100 = Channel 4 (AN4) 0101 = Channel 5 (AN5)(1,2) 0110 = Channel 6 (AN6)(1,2) 0111 = Channel 7 (AN7)(1,2) 1000 = Channel 8 (AN8) 1001 = Channel 9 (AN9) 1010 = Channel 10 (AN10) 1011 = Channel 11 (AN11) 1100 = Channel 12 (AN12) 1101 = Unimplemented)(2) 1110 = Unimplemented)(2) 1111 = Unimplemented)(2) bit 1 GO/DONE: A/D Conversion Status bit When ADON = 1: 1 = A/D conversion in progress 0 = A/D Idle bit 0 ADON: A/D On bit 1 = A/D Converter module is enabled 0 = A/D Converter module is disabled Note 1: These channels are not implemented on 28-pin devices. 2: Performing a conversion on unimplemented channels will return a floating input measurement. PIC18F2420/2520/4420/4520 DS39631E-page 224 © 2008 Microchip Technology Inc. REGISTER 19-2: ADCON1: A/D CONTROL REGISTER 1 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-q(1) R/W-q(1) R/W-q(1) — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5 VCFG1: Voltage Reference Configuration bit (VREF- source) 1 = VREF- (AN2) 0 = VSS bit 4 VCFG0: Voltage Reference Configuration bit (VREF+ source) 1 = VREF+ (AN3) 0 = VDD bit 3-0 PCFG<3:0>: A/D Port Configuration Control bits: Note 1: The POR value of the PCFG bits depends on the value of the PBADEN Configuration bit. When PBADEN = 1, PCFG<2:0> = 000; when PBADEN = 0, PCFG<2:0> = 111. 2: AN5 through AN7 are available only on 40/44-pin devices. A = Analog input D = Digital I/O PCFG3: PCFG0 AN12 AN11 AN10 AN9 AN8 AN7(2) AN6(2) AN5(2) AN4 AN3 AN2 AN1 AN0 0000(1) A A A A A A A A A AAAA 0001 A A A A A A A A A AAAA 0010 A A A A A A A A A AAAA 0011 D A A A A A A A A AAAA 0100 D D A A A A A A A AAAA 0101 D D D A A A A A A AAAA 0110 D D D D A A A A A AAAA 0111(1) D D D D D A A A A AAAA 1000 D D D D D D A A A AAAA 1001 D D D D D D D A A AAAA 1010 D D D D D D D D A AAAA 1011 D D D D D D D D D AAAA 1100 D D D D D D D D D DAAA 1101 D D D D D D D D D DDAA 1110 D D D D D D D D D DDDA 1111 D D D D D D D D D DDDD © 2008 Microchip Technology Inc. DS39631E-page 225 PIC18F2420/2520/4420/4520 REGISTER 19-3: ADCON2: A/D CONTROL REGISTER 2 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADFM: A/D Result Format Select bit 1 = Right justified 0 = Left justified bit 6 Unimplemented: Read as ‘0’ bit 5-3 ACQT<2:0>: A/D Acquisition Time Select bits 111 = 20 TAD 110 = 16 TAD 101 = 12 TAD 100 = 8 TAD 011 = 6 TAD 010 = 4 TAD 001 = 2 TAD 000 = 0 TAD(1) bit 2-0 ADCS<2:0>: A/D Conversion Clock Select bits 111 = FRC (clock derived from A/D RC oscillator)(1) 110 = FOSC/64 101 = FOSC/16 100 = FOSC/4 011 = FRC (clock derived from A/D RC oscillator)(1) 010 = FOSC/32 001 = FOSC/8 000 = FOSC/2 Note 1: If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is added before the A/D clock starts. This allows the SLEEP instruction to be executed before starting a conversion. PIC18F2420/2520/4420/4520 DS39631E-page 226 © 2008 Microchip Technology Inc. The analog reference voltage is software selectable to either the device’s positive and negative supply voltage (VDD and VSS), or the voltage level on the RA3/AN3/ VREF+ and RA2/AN2/VREF-/CVREF pins. The A/D Converter has a unique feature of being able to operate while the device is in Sleep mode. To operate in Sleep, the A/D conversion clock must be derived from the A/D’s internal RC oscillator. The output of the sample and hold is the input into the converter, which generates the result via successive approximation. A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off and any conversion in progress is aborted. Each port pin associated with the A/D Converter can be configured as an analog input, or as a digital I/O. The ADRESH and ADRESL registers contain the result of the A/D conversion. When the A/D conversion is complete, the result is loaded into the ADRESH:ADRESL register pair, the GO/DONE bit (ADCON0 register) is cleared and the A/D Interrupt Flag bit, ADIF, is set. The block diagram of the A/D module is shown in Figure 19-1. FIGURE 19-1: A/D BLOCK DIAGRAM (Input Voltage) VAIN VREF+ Reference Voltage VDD(2) VCFG<1:0> CHS<3:0> AN7(1) AN6(1) AN5(1) AN4 AN3 AN2 AN1 AN0 0111 0110 0101 0100 0011 0010 0001 0000 10-Bit A/D VREFVSS(2) Converter AN12 AN11 AN10 AN9 AN8 1100 1011 1010 1001 1000 Note 1: Channels, AN5 through AN7, are not available on 28-pin devices. 2: I/O pins have diode protection to VDD and VSS. 0X 1X X1 X0 © 2008 Microchip Technology Inc. DS39631E-page 227 PIC18F2420/2520/4420/4520 The value in the ADRESH:ADRESL registers is not modified for a Power-on Reset. The ADRESH:ADRESL registers will contain unknown data after a Power-on Reset. After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as an input. To determine acquisition time, see Section 19.1 “A/D Acquisition Requirements”. After this acquisition time has elapsed, the A/D conversion can be started. An acquisition time can be programmed to occur between setting the GO/DONE bit and the actual start of the conversion. The following steps should be followed to perform an A/D conversion: 1. Configure the A/D module: • Configure analog pins, voltage reference and digital I/O (ADCON1) • Select A/D input channel (ADCON0) • Select A/D acquisition time (ADCON2) • Select A/D conversion clock (ADCON2) • Turn on A/D module (ADCON0) 2. Configure A/D interrupt (if desired): • Clear ADIF bit • Set ADIE bit • Set GIE bit 3. Wait the required acquisition time (if required). 4. Start conversion: • Set GO/DONE bit (ADCON0 register) 5. Wait for A/D conversion to complete, by either: • Polling for the GO/DONE bit to be cleared OR • Waiting for the A/D interrupt 6. Read A/D Result registers (ADRESH:ADRESL); clear bit, ADIF, if required. 7. For next conversion, go to step 1 or step 2, as required. The A/D conversion time per bit is defined as TAD. A minimum wait of 2 TAD is required before the next acquisition starts. FIGURE 19-2: A/D TRANSFER FUNCTION FIGURE 19-3: ANALOG INPUT MODEL Digital Code Output 3FEh 003h 002h 001h 000h 0.5 LSB 1 LSB 1.5 LSB 2 LSB 2.5 LSB 1022 LSB 1022.5 LSB 3 LSB Analog Input Voltage 3FFh 1023 LSB 1023.5 LSB VAIN CPIN Rs ANx 5 pF VT = 0.6V VT = 0.6V ILEAKAGE RIC ≤ 1k Sampling Switch SS RSS CHOLD = 25 pF VSS VDD ±100 nA Legend: CPIN VT ILEAKAGE RIC SS CHOLD = Input Capacitance = Threshold Voltage = Leakage Current at the pin due to = Interconnect Resistance = Sampling Switch = Sample/Hold Capacitance (from DAC) various junctions RSS = Sampling Switch Resistance VDD 6V Sampling Switch 5V 4V 3V 2V 1 23 4 (kΩ) PIC18F2420/2520/4420/4520 DS39631E-page 228 © 2008 Microchip Technology Inc. 19.1 A/D Acquisition Requirements For the A/D Converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 19-3. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD). The source impedance affects the offset voltage at the analog input (due to pin leakage current). The maximum recommended impedance for analog sources is 2.5 kΩ. After the analog input channel is selected (changed), the channel must be sampled for at least the minimum acquisition time before starting a conversion. To calculate the minimum acquisition time, Equation 19-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. Example 19-3 shows the calculation of the minimum required acquisition time TACQ. This calculation is based on the following application system assumptions: CHOLD = 25 pF Rs = 2.5 kΩ Conversion Error ≤ 1/2 LSb VDD = 5V → Rss = 2 kΩ Temperature = 85°C (system max.) EQUATION 19-1: ACQUISITION TIME EQUATION 19-2: A/D MINIMUM CHARGING TIME EQUATION 19-3: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME Note: When the conversion is started, the holding capacitor is disconnected from the input pin. TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient = TAMP + TC + TCOFF VHOLD = (VREF – (VREF/2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS))) or TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048) TACQ =TAMP + TC + TCOFF TAMP = 0.2 μs TCOFF = (Temp – 25°C)(0.02 μs/°C) (85°C – 25°C)(0.02 μs/°C) 1.2 μs Temperature coefficient is only required for temperatures > 25°C. Below 25°C, TCOFF = 0 μs. TC = -(CHOLD)(RIC + RSS + RS) ln(1/2047) μs -(25 pF) (1 kΩ + 2 kΩ + 2.5 kΩ) ln(0.0004883) μs 1.05 μs TACQ = 0.2 μs + 1 μs + 1.2 μs 2.4 μs © 2008 Microchip Technology Inc. DS39631E-page 229 PIC18F2420/2520/4420/4520 19.2 Selecting and Configuring Acquisition Time The ADCON2 register allows the user to select an acquisition time that occurs each time the GO/DONE bit is set. It also gives users the option to use an automatically determined acquisition time. Acquisition time may be set with the ACQT<2:0> bits (ADCON2<5:3>), which provides a range of 2 to 20 TAD. When the GO/DONE bit is set, the A/D module continues to sample the input for the selected acquisition time, then automatically begins a conversion. Since the acquisition time is programmed, there may be no need to wait for an acquisition time between selecting a channel and setting the GO/DONE bit. Manual acquisition is selected when ACQT<2:0> = 000. When the GO/DONE bit is set, sampling is stopped and a conversion begins. The user is responsible for ensuring the required acquisition time has passed between selecting the desired input channel and setting the GO/DONE bit. This option is also the default Reset state of the ACQT<2:0> bits and is compatible with devices that do not offer programmable acquisition times. In either case, when the conversion is completed, the GO/DONE bit is cleared, the ADIF flag is set and the A/D begins sampling the currently selected channel again. If an acquisition time is programmed, there is nothing to indicate if the acquisition time has ended or if the conversion has begun. 19.3 Selecting the A/D Conversion Clock The A/D conversion time per bit is defined as TAD. The A/D conversion requires 11 TAD per 10-bit conversion. The source of the A/D conversion clock is software selectable. There are seven possible options for TAD: • 2 TOSC • 4 TOSC • 8 TOSC • 16 TOSC • 32 TOSC • 64 TOSC • Internal RC Oscillator For correct A/D conversions, the A/D conversion clock (TAD) must be as short as possible, but greater than the minimum TAD (see parameter 130 for more information). Table 19-1 shows the resultant TAD times derived from the device operating frequencies and the A/D clock source selected. TABLE 19-1: TAD vs. DEVICE OPERATING FREQUENCIES AD Clock Source (TAD) Maximum Device Frequency Operation ADCS<2:0> PIC18F2X20/4X20 PIC18LF2X2X/4X20(4) 2 TOSC 000 2.86 MHz 1.43 kHz 4 TOSC 100 5.71 MHz 2.86 MHz 8 TOSC 001 11.43 MHz 5.72 MHz 16 TOSC 101 22.86 MHz 11.43 MHz 32 TOSC 010 40.0 MHz 22.86 MHz 64 TOSC 110 40.0 MHz 22.86 MHz RC(3) x11 1.00 MHz(1) 1.00 MHz(2) Note 1: The RC source has a typical TAD time of 1.2 μs. 2: The RC source has a typical TAD time of 2.5 μs. 3: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D accuracy may be out of specification. 4: Low-power (PIC18LFXXXX) devices only. PIC18F2420/2520/4420/4520 DS39631E-page 230 © 2008 Microchip Technology Inc. 19.4 Operation in Power-Managed Modes The selection of the automatic acquisition time and A/D conversion clock is determined in part by the clock source and frequency while in a power-managed mode. If the A/D is expected to operate while the device is in a power-managed mode, the ACQT<2:0> and ADCS<2:0> bits in ADCON2 should be updated in accordance with the clock source to be used in that mode. After entering the mode, an A/D acquisition or conversion may be started. Once started, the device should continue to be clocked by the same clock source until the conversion has been completed. If desired, the device may be placed into the corresponding Idle mode during the conversion. If the device clock frequency is less than 1 MHz, the A/D RC clock source should be selected. Operation in Sleep mode requires the A/D FRC clock to be selected. If the ACQT<2:0> bits are set to ‘000’ and a conversion is started, the conversion will be delayed one instruction cycle to allow execution of the SLEEP instruction and entry to Sleep mode. The IDLEN bit (OSCCON<7>) must have already been cleared prior to starting the conversion. 19.5 Configuring Analog Port Pins The ADCON1, TRISA, TRISB and TRISE registers all configure the A/D port pins. The port pins needed as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The A/D operation is independent of the state of the CHS<3:0> bits and the TRIS bits. Note 1: When reading the PORT register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will convert as analog inputs. Analog levels on a digitally configured input will be accurately converted. 2: Analog levels on any pin defined as a digital input may cause the digital input buffer to consume current out of the device’s specification limits. 3: The PBADEN bit, in Configuration Register 3H, configures PORTB pins to reset as analog or digital pins by controlling how the PCFG bits in ADCON1 are reset. © 2008 Microchip Technology Inc. DS39631E-page 231 PIC18F2420/2520/4420/4520 19.6 A/D Conversions Figure 19-4 shows the operation of the A/D Converter after the GO/DONE bit has been set and the ACQT<2:0> bits are cleared. A conversion is started after the following instruction to allow entry into Sleep mode before the conversion begins. Figure 19-5 shows the operation of the A/D Converter after the GO/DONE bit has been set and the ACQT<2:0> bits are set to ‘010’, and selecting a 4 TAD acquisition time before the conversion starts. Clearing the GO/DONE bit during a conversion will abort the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. This means the ADRESH:ADRESL registers will continue to contain the value of the last completed conversion (or the last value written to the ADRESH:ADRESL registers). After the A/D conversion is completed or aborted, a 2 TAD wait is required before the next acquisition can be started. After this wait, acquisition on the selected channel is automatically started. 19.7 Discharge The discharge phase is used to initialize the value of the capacitor array. The array is discharged before every sample. This feature helps to optimize the unitygain amplifier, as the circuit always needs to charge the capacitor array, rather than charge/discharge based on previous measure values. FIGURE 19-4: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0) FIGURE 19-5: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD) Note: The GO/DONE bit should NOT be set in the same instruction that turns on the A/D. TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11 Set GO/DONE bit Holding capacitor is disconnected from analog input (typically 100 ns) TCY - TAD TAD9 TAD10 ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. Conversion starts b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 On the following cycle: TAD1 Discharge 1 2 3 4 5 6 7 8 11 Set GO/DONE bit (Holding capacitor is disconnected) 9 10 Conversion starts 1 2 3 4 (Holding capacitor continues acquiring input) TACQT Cycles TAD Cycles Automatic Acquisition Time b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. On the following cycle: TAD1 Discharge PIC18F2420/2520/4420/4520 DS39631E-page 232 © 2008 Microchip Technology Inc. 19.8 Use of the CCP2 Trigger An A/D conversion can be started by the Special Event Trigger of the CCP2 module. This requires that the CCP2M<3:0> bits (CCP2CON<3:0>) be programmed as ‘1011’ and that the A/D module is enabled (ADON bit is set). When the trigger occurs, the GO/DONE bit will be set, starting the A/D acquisition and conversion, and the Timer1 (or Timer3) counter will be reset to zero. Timer1 (or Timer3) is reset to automatically repeat the A/D acquisition period with minimal software overhead (moving ADRESH:ADRESL to the desired location). The appropriate analog input channel must be selected and the minimum acquisition period is either timed by the user, or an appropriate TACQ time is selected before the Special Event Trigger sets the GO/DONE bit (starts a conversion). If the A/D module is not enabled (ADON is cleared), the Special Event Trigger will be ignored by the A/D module, but will still reset the Timer1 (or Timer3) counter. TABLE 19-2: REGISTERS ASSOCIATED WITH A/D OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 ADRESH A/D Result Register High Byte 51 ADRESL A/D Result Register Low Byte 51 ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 51 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 51 PORTA RA7(2) RA6(2) RA5 RA4 RA3 RA2 RA1 RA0 52 TRISA TRISA7(2) TRISA6(2) PORTA Data Direction Register 52 PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 52 TRISB PORTB Data Direction Register 52 LATB PORTB Data Latch Register (Read and Write to Data Latch) 52 PORTE(4) — — — — RE3(3) RE2 RE1 RE0 52 TRISE(4) IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 LATE(4) — — — — — PORTE Data Latch Register 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. 2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. 3: RE3 port bit is available only as an input pin when the MCLRE Configuration bit is ‘0’. 4: These registers are not implemented on 28-pin devices. © 2008 Microchip Technology Inc. DS39631E-page 233 PIC18F2420/2520/4420/4520 20.0 COMPARATOR MODULE The analog comparator module contains two comparators that can be configured in a variety of ways. The inputs can be selected from the analog inputs multiplexed with pins, RA0 through RA5, as well as the on-chip voltage reference (see Section 21.0 “Comparator Voltage Reference Module”). The digital outputs (normal or inverted) are available at the pin level and can also be read through the control register. The CMCON register (Register 20-1) selects the comparator input and output configuration. Block diagrams of the various comparator configurations are shown in Figure 20-1. REGISTER 20-1: CMCON: COMPARATOR CONTROL REGISTER R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 C2OUT: Comparator 2 Output bit When C2INV = 0: 1 = C2 VIN+ > C2 VIN- 0 = C2 VIN+ < C2 VINWhen C2INV = 1: 1 = C2 VIN+ < C2 VIN- 0 = C2 VIN+ > C2 VINbit 6 C1OUT: Comparator 1 Output bit When C1INV = 0: 1 = C1 VIN+ > C1 VIN- 0 = C1 VIN+ < C1 VINWhen C1INV = 1: 1 = C1 VIN+ < C1 VIN- 0 = C1 VIN+ > C1 VINbit 5 C2INV: Comparator 2 Output Inversion bit 1 = C2 output inverted 0 = C2 output not inverted bit 4 C1INV: Comparator 1 Output Inversion bit 1 = C1 output inverted 0 = C1 output not inverted bit 3 CIS: Comparator Input Switch bit When CM<2:0> = 110: 1 = C1 VIN- connects to RA3/AN3/VREF+ C2 VIN- connects to RA2/AN2/VREF-/CVREF 0 = C1 VIN- connects to RA0/AN0 C2 VIN- connects to RA1/AN1 bit 2-0 CM<2:0>: Comparator Mode bits Figure 20-1 shows the Comparator modes and the CM<2:0> bit settings. PIC18F2420/2520/4420/4520 DS39631E-page 234 © 2008 Microchip Technology Inc. 20.1 Comparator Configuration There are eight modes of operation for the comparators, shown in Figure 20-1. Bits CM<2:0> of the CMCON register are used to select these modes. The TRISA register controls the data direction of the comparator pins for each mode. If the Comparator mode is changed, the comparator output level may not be valid for the specified mode change delay shown in Section 26.0 “Electrical Characteristics”. FIGURE 20-1: COMPARATOR I/O OPERATING MODES Note: Comparator interrupts should be disabled during a Comparator mode change; otherwise, a false interrupt may occur. C1 RA0/AN0 VINVIN+ RA3/AN3/ Off (Read as ‘0’) Comparators Reset A A CM<2:0> = 000 C2 RA1/AN1 VINVIN+ RA2/AN2/ Off (Read as ‘0’) A A C1 VINVIN+ C1OUT Two Independent Comparators A A CM<2:0> = 010 C2 VINVIN+ C2OUT A A C1 VINVIN+ C1OUT Two Common Reference Comparators A A CM<2:0> = 100 C2 VINVIN+ C2OUT A D C2 VINVIN+ Off (Read as ‘0’) One Independent Comparator with Output D D CM<2:0> = 001 C1 VINVIN+ C1OUT A A C1 VINVIN+ Off (Read as ‘0’) Comparators Off (POR Default Value) D D CM<2:0> = 111 C2 VINVIN+ Off (Read as ‘0’) D D C1 VINVIN+ C1OUT Four Inputs Multiplexed to Two Comparators A A CM<2:0> = 110 C2 VINVIN+ C2OUT A A From VREF Module CIS = 0 CIS = 1 CIS = 0 CIS = 1 C1 VINVIN+ C1OUT Two Common Reference Comparators with Outputs A A CM<2:0> = 101 C2 VINVIN+ C2OUT A D A = Analog Input, port reads zeros always D = Digital Input CIS (CMCON<3>) is the Comparator Input Switch CVREF C1 VINVIN+ C1OUT Two Independent Comparators with Outputs A A CM<2:0> = 011 C2 VINVIN+ C2OUT A A RA5/AN4/SS/HLVDIN/C2OUT* RA4/T0CKI/C1OUT* VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ VREF+ RA1/AN1 RA2/AN2/ VREF-/CVREF RA4/T0CKI/C1OUT* RA5/AN4/SS/HLVDIN/C2OUT* RA0/AN0 RA3/AN3/ VREF+ RA1/AN1 RA2/AN2/ VREF-/CVREF RA4/T0CKI/C1OUT* * Setting the TRISA<5:4> bits will disable the comparator outputs by configuring the pins as inputs. © 2008 Microchip Technology Inc. DS39631E-page 235 PIC18F2420/2520/4420/4520 20.2 Comparator Operation A single comparator is shown in Figure 20-2, along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 20-2 represent the uncertainty, due to input offsets and response time. 20.3 Comparator Reference Depending on the comparator operating mode, either an external or internal voltage reference may be used. The analog signal present at VIN- is compared to the signal at VIN+ and the digital output of the comparator is adjusted accordingly (Figure 20-2). FIGURE 20-2: SINGLE COMPARATOR 20.3.1 EXTERNAL REFERENCE SIGNAL When external voltage references are used, the comparator module can be configured to have the comparators operate from the same or different reference sources. However, threshold detector applications may require the same reference. The reference signal must be between VSS and VDD and can be applied to either pin of the comparator(s). 20.3.2 INTERNAL REFERENCE SIGNAL The comparator module also allows the selection of an internally generated voltage reference from the comparator voltage reference module. This module is described in more detail in Section 21.0 “Comparator Voltage Reference Module”. The internal reference is only available in the mode where four inputs are multiplexed to two comparators (CM<2:0> = 110). In this mode, the internal voltage reference is applied to the VIN+ pin of both comparators. 20.4 Comparator Response Time Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output has a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (see Section 26.0 “Electrical Characteristics”). 20.5 Comparator Outputs The comparator outputs are read through the CMCON register. These bits are read-only. The comparator outputs may also be directly output to the RA4 and RA5 I/O pins. When enabled, multiplexers in the output path of the RA4 and RA5 pins will switch and the output of each pin will be the unsynchronized output of the comparator. The uncertainty of each of the comparators is related to the input offset voltage and the response time given in the specifications. Figure 20-3 shows the comparator output block diagram. The TRISA bits will still function as an output enable/ disable for the RA4 and RA5 pins while in this mode. The polarity of the comparator outputs can be changed using the C2INV and C1INV bits (CMCON<4:5>). – VIN+ + VINOutput Output VINVIN+ Note 1: When reading the PORT register, all pins configured as analog inputs will read as ‘0’. Pins configured as digital inputs will convert an analog input according to the Schmitt Trigger input specification. 2: Analog levels on any pin defined as a digital input may cause the input buffer to consume more current than is specified. PIC18F2420/2520/4420/4520 DS39631E-page 236 © 2008 Microchip Technology Inc. FIGURE 20-3: COMPARATOR OUTPUT BLOCK DIAGRAM 20.6 Comparator Interrupts The comparator interrupt flag is set whenever there is a change in the output value of either comparator. Software will need to maintain information about the status of the output bits, as read from CMCON<7:6>, to determine the actual change that occurred. The CMIF bit (PIR2<6>) is the Comparator Interrupt Flag. The CMIF bit must be reset by clearing it. Since it is also possible to write a ‘1’ to this register, a simulated interrupt may be initiated. Both the CMIE bit (PIE2<6>) and the PEIE bit (INTCON<6>) must be set to enable the interrupt. In addition, the GIE bit (INTCON<7>) must also be set. If any of these bits are clear, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of CMCON will end the mismatch condition. b) Clear flag bit, CMIF. A mismatch condition will continue to set flag bit, CMIF. Reading CMCON will end the mismatch condition and allow flag bit, CMIF, to be cleared. 20.7 Comparator Operation During Sleep When a comparator is active and the device is placed in Sleep mode, the comparator remains active and the interrupt is functional if enabled. This interrupt will wake-up the device from Sleep mode when enabled. Each operational comparator will consume additional current, as shown in the comparator specifications. To minimize power consumption while in Sleep mode, turn off the comparators (CM<2:0> = 111) before entering Sleep. If the device wakes up from Sleep, the contents of the CMCON register are not affected. 20.8 Effects of a Reset A device Reset forces the CMCON register to its Reset state, causing the comparator modules to be turned off (CM<2:0> = 111). However, the input pins (RA0 through RA3) are configured as analog inputs by default on device Reset. The I/O configuration for these pins is determined by the setting of the PCFG<3:0> bits (ADCON1<3:0>). Therefore, device current is minimized when analog inputs are present at Reset time. D Q EN To RA4 or RA5 pin Bus Data Set MULTIPLEX CMIF bit - + Port pins Read CMCON Reset From Other Comparator CxINV D Q EN CL Note: If a change in the CMCON register (C1OUT or C2OUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR2<6>) interrupt flag may not get set. © 2008 Microchip Technology Inc. DS39631E-page 237 PIC18F2420/2520/4420/4520 20.9 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 20-4. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up condition may occur. A maximum source impedance of 10 kΩ is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. FIGURE 20-4: COMPARATOR ANALOG INPUT MODEL TABLE 20-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51 CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52 LATA LATA7(1) LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch) 52 TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Register 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module. Note 1: PORTA<7:6> and their direction and latch bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits are read as ‘0’. VA RS < 10k AIN CPIN 5 pF VDD VT = 0.6V VT = 0.6V RIC ILEAKAGE ±100 nA VSS Legend: CPIN = Input Capacitance VT = Threshold Voltage ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage Comparator Input PIC18F2420/2520/4420/4520 DS39631E-page 238 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 239 PIC18F2420/2520/4420/4520 21.0 COMPARATOR VOLTAGE REFERENCE MODULE The comparator voltage reference is a 16-tap resistor ladder network that provides a selectable reference voltage. Although its primary purpose is to provide a reference for the analog comparators, it may also be used independently of them. A block diagram of the module is shown in Figure 21-1. The resistor ladder is segmented to provide two ranges of CVREF values and has a power-down function to conserve power when the reference is not being used. The module’s supply reference can be provided from either device VDD/VSS or an external voltage reference. 21.1 Configuring the Comparator Voltage Reference The voltage reference module is controlled through the CVRCON register (Register 21-1). The comparator voltage reference provides two ranges of output voltage, each with 16 distinct levels. The range to be used is selected by the CVRR bit (CVRCON<5>). The primary difference between the ranges is the size of the steps selected by the CVREF Selection bits (CVR<3:0>), with one range offering finer resolution. The equations used to calculate the output of the comparator voltage reference are as follows: If CVRR = 1: CVREF = ((CVR<3:0>)/24) x CVRSRC If CVRR = 0: CVREF = (CVRSRC x 1/4) + (((CVR<3:0>)/32) x CVRSRC) The comparator reference supply voltage can come from either VDD and VSS, or the external VREF+ and VREF- that are multiplexed with RA2 and RA3. The voltage source is selected by the CVRSS bit (CVRCON<4>). The settling time of the comparator voltage reference must be considered when changing the CVREF output (see Table 26-3 in Section 26.0 “Electrical Characteristics”). REGISTER 21-1: CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CVREN CVROE(1) CVRR CVRSS CVR3 CVR2 CVR1 CVR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 CVREN: Comparator Voltage Reference Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down bit 6 CVROE: Comparator VREF Output Enable bit(1) 1 = CVREF voltage level is also output on the RA2/AN2/VREF-/CVREF pin 0 = CVREF voltage is disconnected from the RA2/AN2/VREF-/CVREF pin bit 5 CVRR: Comparator VREF Range Selection bit 1 = 0 to 0.667 CVRSRC, with CVRSRC/24 step size (low range) 0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size (high range) bit 4 CVRSS: Comparator VREF Source Selection bit 1 = Comparator reference source, CVRSRC = (VREF+) – (VREF-) 0 = Comparator reference source, CVRSRC = VDD – VSS bit 3-0 CVR3:CVR0: Comparator VREF Value Selection bits (0 ≤ (CVR<3:0>) ≤ 15) When CVRR = 1: CVREF = ((CVR<3:0>)/24) • (CVRSRC) When CVRR = 0: CVREF = (CVRSRC/4) + ((CVR<3:0>)/32) • (CVRSRC) Note 1: CVROE overrides the TRISA<2> bit setting. PIC18F2420/2520/4420/4520 DS39631E-page 240 © 2008 Microchip Technology Inc. FIGURE 21-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM 21.2 Voltage Reference Accuracy/Error The full range of voltage reference cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 21-1) keep CVREF from approaching the reference source rails. The voltage reference is derived from the reference source; therefore, the CVREF output changes with fluctuations in that source. The tested absolute accuracy of the voltage reference can be found in Section 26.0 “Electrical Characteristics”. 21.3 Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the CVRCON register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 21.4 Effects of a Reset A device Reset disables the voltage reference by clearing bit, CVREN (CVRCON<7>). This Reset also disconnects the reference from the RA2 pin by clearing bit, CVROE (CVRCON<6>) and selects the high-voltage range by clearing bit, CVRR (CVRCON<5>). The CVR value select bits are also cleared. 21.5 Connection Considerations The voltage reference module operates independently of the comparator module. The output of the reference generator may be connected to the RA2 pin if the CVROE bit is set. Enabling the voltage reference output onto RA2 when it is configured as a digital input will increase current consumption. Connecting RA2 as a digital output with CVRSS enabled will also increase current consumption. The RA2 pin can be used as a simple D/A output with limited drive capability. Due to the limited current drive capability, a buffer must be used on the voltage reference output for external connections to VREF. Figure 21-2 shows an example buffering technique. 16-to-1 MUX CVR<3:0> 8R R CVREN CVRSS = 0 VDD VREF+ CVRSS = 1 8R CVRSS = 0 VREF- CVRSS = 1 R R R R R R 16 Steps CVRR CVREF © 2008 Microchip Technology Inc. DS39631E-page 241 PIC18F2420/2520/4420/4520 FIGURE 21-2: COMPARATOR VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE TABLE 21-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51 CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51 TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Register 52 Legend: Shaded cells are not used with the comparator voltage reference. Note 1: PORTA pins are enabled based on oscillator configuration. CVREF Output + – CVREF Module Voltage Reference Output Impedance R(1) RA2 Note 1: R is dependent upon the comparator voltage reference configuration bits, CVRCON<3:0> and CVRCON<5>. PIC18FXXXX PIC18F2420/2520/4420/4520 DS39631E-page 242 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. Advance Information DS39631E-page 243 PIC18F2420/2520/4420/4520 22.0 HIGH/LOW-VOLTAGE DETECT (HLVD) PIC18F2420/2520/4420/4520 devices have a High/Low-Voltage Detect module (HLVD). This is a programmable circuit that allows the user to specify both a device voltage trip point and the direction of change from that point. If the device experiences an excursion past the trip point in that direction, an interrupt flag is set. If the interrupt is enabled, the program execution will branch to the interrupt vector address and the software can then respond to the interrupt. The High/Low-Voltage Detect Control register (Register 22-1) completely controls the operation of the HLVD module. This allows the circuitry to be “turned off” by the user under software control, which minimizes the current consumption for the device. The block diagram for the HLVD module is shown in Figure 22-1. REGISTER 22-1: HLVDCON: HIGH/LOW-VOLTAGE DETECT CONTROL REGISTER R/W-0 U-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 VDIRMAG — IRVST HLVDEN HLVDL3(1) HLVDL2(1) HLVDL1(1) HLVDL0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 VDIRMAG: Voltage Direction Magnitude Select bit 1 = Event occurs when voltage equals or exceeds trip point (HLVDL<3:0>) 0 = Event occurs when voltage equals or falls below trip point (HLVDL<3:0>) bit 6 Unimplemented: Read as ‘0’ bit 5 IRVST: Internal Reference Voltage Stable Flag bit 1 = Indicates that the voltage detect logic will generate the interrupt flag at the specified voltage range 0 = Indicates that the voltage detect logic will not generate the interrupt flag at the specified voltage range and the HLVD interrupt should not be enabled bit 4 HLVDEN: High/Low-Voltage Detect Power Enable bit 1 = HLVD enabled 0 = HLVD disabled bit 3-0 HLVDL<3:0>: Voltage Detection Limit bits(1) 1111 = External analog input is used (input comes from the HLVDIN pin) 1110 = Maximum setting . . . 0000 = Minimum setting Note 1: See Table 26-4 for specifications. PIC18F2420/2520/4420/4520 DS39631E-page 244 Advance Information © 2008 Microchip Technology Inc. The module is enabled by setting the HLVDEN bit. Each time that the HLVD module is enabled, the circuitry requires some time to stabilize. The IRVST bit is a read-only bit and is used to indicate when the circuit is stable. The module can only generate an interrupt after the circuit is stable and IRVST is set. The VDIRMAG bit determines the overall operation of the module. When VDIRMAG is cleared, the module monitors for drops in VDD below a predetermined set point. When the bit is set, the module monitors for rises in VDD above the set point. 22.1 Operation When the HLVD module is enabled, a comparator uses an internally generated reference voltage as the set point. The set point is compared with the trip point, where each node in the resistor divider represents a trip point voltage. The “trip point” voltage is the voltage level at which the device detects a high or low-voltage event, depending on the configuration of the module. When the supply voltage is equal to the trip point, the voltage tapped off of the resistor array is equal to the internal reference voltage generated by the voltage reference module. The comparator then generates an interrupt signal by setting the HLVDIF bit. The trip point voltage is software programmable to any one of 16 values. The trip point is selected by programming the HLVDL<3:0> bits (HLVDCON<3:0>). The HLVD module has an additional feature that allows the user to supply the trip voltage to the module from an external source. This mode is enabled when bits, HLVDL<3:0>, are set to ‘1111’. In this state, the comparator input is multiplexed from the external input pin, HLVDIN. This gives users flexibility because it allows them to configure the High/Low-Voltage Detect interrupt to occur at any voltage in the valid operating range. FIGURE 22-1: HLVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT) Set VDD 16-to-1 MUX HLVDEN HLVDCON HLVDIN HLVDL<3:0> Register HLVDIN VDD Externally Generated Trip Point HLVDIF HLVDEN BOREN Internal Voltage Reference VDIRMAG © 2008 Microchip Technology Inc. Advance Information DS39631E-page 245 PIC18F2420/2520/4420/4520 22.2 HLVD Setup The following steps are needed to set up the HLVD module: 1. Write the value to the HLVDL<3:0> bits that selects the desired HLVD trip point. 2. Set the VDIRMAG bit to detect high voltage (VDIRMAG = 1) or low voltage (VDIRMAG = 0). 3. Enable the HLVD module by setting the HLVDEN bit. 4. Clear the HLVD interrupt flag (PIR2<2>), which may have been set from a previous interrupt. 5. Enable the HLVD interrupt, if interrupts are desired, by setting the HLVDIE and GIE bits (PIE2<2> and INTCON<7>). An interrupt will not be generated until the IRVST bit is set. 22.3 Current Consumption When the module is enabled, the HLVD comparator and voltage divider are enabled and will consume static current. The total current consumption, when enabled, is specified in electrical specification parameter D022B. Depending on the application, the HLVD module does not need to be operating constantly. To decrease the current requirements, the HLVD circuitry may only need to be enabled for short periods where the voltage is checked. After doing the check, the HLVD module may be disabled. 22.4 HLVD Start-up Time The internal reference voltage of the HLVD module, specified in electrical specification parameter D420, may be used by other internal circuitry, such as the programmable Brown-out Reset. If the HLVD or other circuits using the voltage reference are disabled to lower the device’s current consumption, the reference voltage circuit will require time to become stable before a low or high-voltage condition can be reliably detected. This start-up time, TIRVST, is an interval that is independent of device clock speed. It is specified in electrical specification parameter 36. The HLVD interrupt flag is not enabled until TIRVST has expired and a stable reference voltage is reached. For this reason, brief excursions beyond the set point may not be detected during this interval (refer to Figure 22-2 or Figure 22-3). FIGURE 22-2: LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 0) VLVD VDD HLVDIF VLVD VDD Enable HLVD TIRVST HLVDIF may not be set Enable HLVD HLVDIF HLVDIF Cleared in Software HLVDIF Cleared in Software HLVDIF cleared in software, CASE 1: CASE 2: HLVDIF remains set since HLVD condition still exists TIRVST Internal Reference is Stable Internal Reference is Stable IRVST IRVST PIC18F2420/2520/4420/4520 DS39631E-page 246 Advance Information © 2008 Microchip Technology Inc. FIGURE 22-3: HIGH-VOLTAGE DETECT OPERATION (VDIRMAG = 1) 22.5 Applications In many applications, the ability to detect a drop below, or rise above, a particular threshold is desirable. For example, the HLVD module could be periodically enabled to detect Universal Serial Bus (USB) attach or detach. This assumes the device is powered by a lower voltage source than the USB when detached. An attach would indicate a high-voltage detect from, for example, 3.3V to 5V (the voltage on USB) and vice versa for a detach. This feature could save a design a few extra components and an attach signal (input pin). For general battery applications, Figure 22-4 shows a possible voltage curve. Over time, the device voltage decreases. When the device voltage reaches voltage, VA, the HLVD logic generates an interrupt at time, TA. The interrupt could cause the execution of an ISR, which would allow the application to perform “housekeeping tasks” and perform a controlled shutdown before the device voltage exits the valid operating range at TB. The HLVD, thus, would give the application a time window, represented by the difference between TA and TB, to safely exit. FIGURE 22-4: TYPICAL LOW-VOLTAGE DETECT APPLICATION VLVD VDD HLVDIF VLVD VDD Enable HLVD TIRVST HLVDIF may not be set Enable HLVD HLVDIF HLVDIF Cleared in Software HLVDIF Cleared in Software HLVDIF cleared in software, CASE 1: CASE 2: HLVDIF remains set since HLVD condition still exists TIRVST IRVST Internal Reference is Stable Internal Reference is Stable IRVST Time Voltage VA VB TA TB VA = HLVD trip point VB = Minimum valid device operating voltage Legend: © 2008 Microchip Technology Inc. Advance Information DS39631E-page 247 PIC18F2420/2520/4420/4520 22.6 Operation During Sleep When enabled, the HLVD circuitry continues to operate during Sleep. If the device voltage crosses the trip point, the HLVDIF bit will be set and the device will wake-up from Sleep. Device execution will continue from the interrupt vector address if interrupts have been globally enabled. 22.7 Effects of a Reset A device Reset forces all registers to their Reset state. This forces the HLVD module to be turned off. TABLE 22-1: REGISTERS ASSOCIATED WITH HIGH/LOW-VOLTAGE DETECT MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 50 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OCSFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the HLVD module. PIC18F2420/2520/4420/4520 DS39631E-page 248 Advance Information © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 249 PIC18F2420/2520/4420/4520 23.0 SPECIAL FEATURES OF THE CPU PIC18F2420/2520/4420/4520 devices include several features intended to maximize reliability and minimize cost through elimination of external components. These are: • Oscillator Selection • Resets: - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Fail-Safe Clock Monitor • Two-Speed Start-up • Code Protection • ID Locations • In-Circuit Serial Programming The oscillator can be configured for the application depending on frequency, power, accuracy and cost. All of the options are discussed in detail in Section 2.0 “Oscillator Configurations”. A complete discussion of device Resets and interrupts is available in previous sections of this data sheet. In addition to their Power-up and Oscillator Start-up Timers provided for Resets, PIC18F2420/2520/4420/ 4520 devices have a Watchdog Timer, which is either permanently enabled via the Configuration bits or software controlled (if configured as disabled). The inclusion of an internal RC oscillator also provides the additional benefits of a Fail-Safe Clock Monitor (FSCM) and Two-Speed Start-up. FSCM provides for background monitoring of the peripheral clock and automatic switchover in the event of its failure. TwoSpeed Start-up enables code to be executed almost immediately on start-up, while the primary clock source completes its start-up delays. All of these features are enabled and configured by setting the appropriate Configuration register bits. 23.1 Configuration Bits The Configuration bits can be programmed (read as ‘0’) or left unprogrammed (read as ‘1’) to select various device configurations. These bits are mapped starting at program memory location, 300000h. The user will note that address 300000h is beyond the user program memory space. In fact, it belongs to the configuration memory space (300000h-3FFFFFh), which can only be accessed using table reads and table writes. Programming the Configuration registers is done in a manner similar to programming the Flash memory. The WR bit in the EECON1 register starts a self-timed write to the Configuration register. In normal operation mode, a TBLWT instruction with the TBLPTR pointing to the Configuration register sets up the address and the data for the Configuration register write. Setting the WR bit starts a long write to the Configuration register. The Configuration registers are written a byte at a time. To write or erase a configuration cell, a TBLWT instruction can write a ‘1’ or a ‘0’ into the cell. For additional details on Flash programming, refer to Section 6.5 “Writing to Flash Program Memory”. TABLE 23-1: CONFIGURATION BITS AND DEVICE IDs File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default/ Unprogrammed Value 300001h CONFIG1H IESO FCMEN — — FOSC3 FOSC2 FOSC1 FOSC0 00-- 0111 300002h CONFIG2L — — — BORV1 BORV0 BOREN1 BOREN0 PWRTEN ---1 1111 300003h CONFIG2H — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN ---1 1111 300005h CONFIG3H MCLRE — — — — LPT1OSC PBADEN CCP2MX 1--- -011 300006h CONFIG4L DEBUG XINST — — — LVP — STVREN 10-- -1-1 300008h CONFIG5L — — — — CP3(1) CP2(1) CP1 CP0 ---- 1111 300009h CONFIG5H CPD CPB — — — — — — 11-- ---- 30000Ah CONFIG6L — — — — WRT3(1) WRT2(1) WRT1 WRT0 ---- 1111 30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 111- ---- 30000Ch CONFIG7L — — — — EBTR3(1) EBTR2(1) EBTR1 EBTR0 ---- 1111 30000Dh CONFIG7H — EBTRB — — — — — — -1-- ---- 3FFFFEh DEVID1 DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 xxxx xxxx(2) 3FFFFFh DEVID2 DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 xxxx xxxx(2) Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. 2: See Register 23-12 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user. PIC18F2420/2520/4420/4520 DS39631E-page 250 © 2008 Microchip Technology Inc. REGISTER 23-1: CONFIG1H: CONFIGURATION REGISTER 1 HIGH (BYTE ADDRESS 300001h) R/P-0 R/P-0 U-0 U-0 R/P-0 R/P-1 R/P-1 R/P-1 IESO FCMEN — — FOSC3 FOSC2 FOSC1 FOSC0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7 IESO: Internal/External Oscillator Switchover bit 1 = Oscillator Switchover mode enabled 0 = Oscillator Switchover mode disabled bit 6 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor enabled 0 = Fail-Safe Clock Monitor disabled bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 FOSC<3:0>: Oscillator Selection bits 11xx = External RC oscillator, CLKO function on RA6 101x = External RC oscillator, CLKO function on RA6 1001 = Internal oscillator block, CLKO function on RA6; port function on RA7 1000 = Internal oscillator block, port function on RA6 and RA7 0111 = External RC oscillator, port function on RA6 0110 = HS oscillator, PLL enabled (Clock Frequency = 4 x FOSC1) 0101 = EC oscillator, port function on RA6 0100 = EC oscillator, CLKO function on RA6 0011 = External RC oscillator, CLKO function on RA6 0010 = HS oscillator 0001 = XT oscillator 0000 = LP oscillator © 2008 Microchip Technology Inc. DS39631E-page 251 PIC18F2420/2520/4420/4520 REGISTER 23-2: CONFIG2L: CONFIGURATION REGISTER 2 LOW (BYTE ADDRESS 300002h) U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — — BORV1(1) BORV0(1) BOREN1(2) BOREN0(2) PWRTEN(2) bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7-5 Unimplemented: Read as ‘0’ bit 4-3 BORV<1:0>: Brown-out Reset Voltage bits(1) 11 = Minimum setting . . . 00 = Maximum setting bit 2-1 BOREN<1:0>: Brown-out Reset Enable bits(2) 11 = Brown-out Reset enabled in hardware only (SBOREN is disabled) 10 = Brown-out Reset enabled in hardware only and disabled in Sleep mode (SBOREN is disabled) 01 = Brown-out Reset enabled and controlled by software (SBOREN is enabled) 00 = Brown-out Reset disabled in hardware and software bit 0 PWRTEN: Power-up Timer Enable bit(2) 1 = PWRT disabled 0 = PWRT enabled Note 1: See Section 26.1 “DC Characteristics: Supply Voltage” for specifications. 2: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to be independently controlled. PIC18F2420/2520/4420/4520 DS39631E-page 252 © 2008 Microchip Technology Inc. REGISTER 23-3: CONFIG2H: CONFIGURATION REGISTER 2 HIGH (BYTE ADDRESS 300003h) U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7-5 Unimplemented: Read as ‘0’ bit 4-1 WDTPS<3:0>: Watchdog Timer Postscale Select bits 1111 = 1:32,768 1110 = 1:16,384 1101 = 1:8,192 1100 = 1:4,096 1011 = 1:2,048 1010 = 1:1,024 1001 = 1:512 1000 = 1:256 0111 = 1:128 0110 = 1:64 0101 = 1:32 0100 = 1:16 0011 = 1:8 0010 = 1:4 0001 = 1:2 0000 = 1:1 bit 0 WDTEN: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled (control is placed on the SWDTEN bit) © 2008 Microchip Technology Inc. DS39631E-page 253 PIC18F2420/2520/4420/4520 REGISTER 23-4: CONFIG3H: CONFIGURATION REGISTER 3 HIGH (BYTE ADDRESS 300005h) R/P-1 U-0 U-0 U-0 U-0 R/P-0 R/P-1 R/P-1 MCLRE — — — — LPT1OSC PBADEN CCP2MX bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7 MCLRE: MCLR Pin Enable bit 1 = MCLR pin enabled; RE3 input pin disabled 0 = RE3 input pin enabled; MCLR disabled bit 6-3 Unimplemented: Read as ‘0’ bit 2 LPT1OSC: Low-Power Timer1 Oscillator Enable bit 1 = Timer1 configured for low-power operation 0 = Timer1 configured for higher power operation bit 1 PBADEN: PORTB A/D Enable bit (Affects ADCON1 Reset state. ADCON1 controls PORTB<4:0> pin configuration.) 1 = PORTB<4:0> pins are configured as analog input channels on Reset 0 = PORTB<4:0> pins are configured as digital I/O on Reset bit 0 CCP2MX: CCP2 MUX bit 1 = CCP2 input/output is multiplexed with RC1 0 = CCP2 input/output is multiplexed with RB3 REGISTER 23-5: CONFIG4L: CONFIGURATION REGISTER 4 LOW (BYTE ADDRESS 300006h) R/P-1 R/P-0 U-0 U-0 U-0 R/P-1 U-0 R/P-1 DEBUG XINST — — — LVP — STVREN bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7 DEBUG: Background Debugger Enable bit 1 = Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins 0 = Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug bit 6 XINST: Extended Instruction Set Enable bit 1 = Instruction set extension and Indexed Addressing mode enabled 0 = Instruction set extension and Indexed Addressing mode disabled (Legacy mode) bit 5-3 Unimplemented: Read as ‘0’ bit 2 LVP: Single-Supply ICSP™ Enable bit 1 = Single-Supply ICSP enabled 0 = Single-Supply ICSP disabled bit 1 Unimplemented: Read as ‘0’ bit 0 STVREN: Stack Full/Underflow Reset Enable bit 1 = Stack full/underflow will cause Reset 0 = Stack full/underflow will not cause Reset PIC18F2420/2520/4420/4520 DS39631E-page 254 © 2008 Microchip Technology Inc. REGISTER 23-6: CONFIG5L: CONFIGURATION REGISTER 5 LOW (BYTE ADDRESS 300008h) U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1 — — — — CP3(1) CP2(1) CP1 CP0 bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7-4 Unimplemented: Read as ‘0’ bit 3 CP3: Code Protection bit(1) 1 = Block 3 (006000-007FFFh) not code-protected 0 = Block 3 (006000-007FFFh) code-protected bit 2 CP2: Code Protection bit(1) 1 = Block 2 (004000-005FFFh) not code-protected 0 = Block 2 (004000-005FFFh) code-protected bit 1 CP1: Code Protection bit 1 = Block 1 (002000-003FFFh) not code-protected 0 = Block 1 (002000-003FFFh) code-protected bit 0 CP0: Code Protection bit 1 = Block 0 (000800-001FFFh) not code-protected 0 = Block 0 (000800-001FFFh) code-protected Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. REGISTER 23-7: CONFIG5H: CONFIGURATION REGISTER 5 HIGH (BYTE ADDRESS 300009h) R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0 CPD CPB — — — — — — bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7 CPD: Data EEPROM Code Protection bit 1 = Data EEPROM not code-protected 0 = Data EEPROM code-protected bit 6 CPB: Boot Block Code Protection bit 1 = Boot block (000000-0007FFh) not code-protected 0 = Boot block (000000-0007FFh) code-protected bit 5-0 Unimplemented: Read as ‘0’ © 2008 Microchip Technology Inc. DS39631E-page 255 PIC18F2420/2520/4420/4520 REGISTER 23-8: CONFIG6L: CONFIGURATION REGISTER 6 LOW (BYTE ADDRESS 30000Ah) U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1 — — — — WRT3(1) WRT2(1) WRT1 WRT0 bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7-4 Unimplemented: Read as ‘0’ bit 3 WRT3: Write Protection bit(1) 1 = Block 3 (006000-007FFFh) not write-protected 0 = Block 3 (006000-007FFFh) write-protected bit 2 WRT2: Write Protection bit(1) 1 = Block 2 (004000-005FFFh) not write-protected 0 = Block 2 (004000-005FFFh) write-protected bit 1 WRT1: Write Protection bit 1 = Block 1 (002000-003FFFh) not write-protected 0 = Block 1 (002000-003FFFh) write-protected bit 0 WRT0: Write Protection bit 1 = Block 0 (000800-001FFFh) not write-protected 0 = Block 0 (000800-001FFFh) write-protected Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. REGISTER 23-9: CONFIG6H: CONFIGURATION REGISTER 6 HIGH (BYTE ADDRESS 30000Bh) R/C-1 R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 WRTD WRTB WRTC(1) — — — — — bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7 WRTD: Data EEPROM Write Protection bit 1 = Data EEPROM not write-protected 0 = Data EEPROM write-protected bit 6 WRTB: Boot Block Write Protection bit 1 = Boot block (000000-0007FFh) not write-protected 0 = Boot block (000000-0007FFh) write-protected bit 5 WRTC: Configuration Register Write Protection bit(1) 1 = Configuration registers (300000-3000FFh) not write-protected 0 = Configuration registers (300000-3000FFh) write-protected bit 4-0 Unimplemented: Read as ‘0’ Note 1: This bit is read-only in normal execution mode; it can be written only in Program mode. PIC18F2420/2520/4420/4520 DS39631E-page 256 © 2008 Microchip Technology Inc. REGISTER 23-10: CONFIG7L: CONFIGURATION REGISTER 7 LOW (BYTE ADDRESS 30000Ch) U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1 — — — — EBTR3(1) EBTR2(1) EBTR1 EBTR0 bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7-4 Unimplemented: Read as ‘0’ bit 3 EBTR3: Table Read Protection bit(1) 1 = Block 3 (006000-007FFFh) not protected from table reads executed in other blocks 0 = Block 3 (006000-007FFFh) protected from table reads executed in other blocks bit 2 EBTR2: Table Read Protection bit(1) 1 = Block 2 (004000-005FFFh) not protected from table reads executed in other blocks 0 = Block 2 (004000-005FFFh) protected from table reads executed in other blocks bit 1 EBTR1: Table Read Protection bit 1 = Block 1 (002000-003FFFh) not protected from table reads executed in other blocks 0 = Block 1 (002000-003FFFh) protected from table reads executed in other blocks bit 0 EBTR0: Table Read Protection bit 1 = Block 0 (000800-001FFFh) not protected from table reads executed in other blocks 0 = Block 0 (000800-001FFFh) protected from table reads executed in other blocks Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. REGISTER 23-11: CONFIG7H: CONFIGURATION REGISTER 7 HIGH (BYTE ADDRESS 30000Dh) U-0 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0 — EBTRB — — — — — — bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7 Unimplemented: Read as ‘0’ bit 6 EBTRB: Boot Block Table Read Protection bit 1 = Boot block (000000-0007FFh) not protected from table reads executed in other blocks 0 = Boot block (000000-0007FFh) protected from table reads executed in other blocks bit 5-0 Unimplemented: Read as ‘0’ © 2008 Microchip Technology Inc. DS39631E-page 257 PIC18F2420/2520/4420/4520 REGISTER 23-12: DEVID1: DEVICE ID REGISTER 1 FOR PIC18F2420/2520/4420/4520 R R R RR R R R DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7-5 DEV<2:0>: Device ID bits 110 = PIC18F4420 100 = PIC18F4520 010 = PIC18F2420 000 = PIC18F2520 bit 4-0 REV<4:0>: Revision ID bits These bits are used to indicate the device revision. REGISTER 23-13: DEVID2: DEVICE ID REGISTER 2 FOR PIC18F2420/2520/4420/4520 R R R RR R R R DEV10(1) DEV9(1) DEV8(1) DEV7(1) DEV6(1) DEV5(1) DEV4(1) DEV3(1) bit 7 bit 0 Legend: R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state bit 7-0 DEV<10:3>: Device ID bits(1) These bits are used with the DEV<2:0> bits in Device ID Register 1 to identify the part number. 0001 0001 = PIC18F2420/2520 devices 0001 0000 = PIC18F4420/4520 devices Note 1: These values for DEV<10:3> may be shared with other devices. The specific device is always identified by using the entire DEV<10:0> bit sequence. PIC18F2420/2520/4420/4520 DS39631E-page 258 © 2008 Microchip Technology Inc. 23.2 Watchdog Timer (WDT) For PIC18F2420/2520/4420/4520 devices, the WDT is driven by the INTRC source. When the WDT is enabled, the clock source is also enabled. The nominal WDT period is 4 ms and has the same stability as the INTRC oscillator. The 4 ms period of the WDT is multiplied by a 16-bit postscaler. Any output of the WDT postscaler is selected by a multiplexer, controlled by bits in Configuration Register 2H. Available periods range from 4 ms to 131.072 seconds (2.18 minutes). The WDT and postscaler are cleared when any of the following events occur: a SLEEP or CLRWDT instruction is executed, the IRCF bits (OSCCON<6:4>) are changed or a clock failure has occurred. 23.2.1 CONTROL REGISTER Register 23-14 shows the WDTCON register. This is a readable and writable register which contains a control bit that allows software to override the WDT enable Configuration bit, but only if the Configuration bit has disabled the WDT. FIGURE 23-1: WDT BLOCK DIAGRAM Note 1: The CLRWDT and SLEEP instructions clear the WDT and postscaler counts when executed. 2: Changing the setting of the IRCF bits (OSCCON<6:4>) clears the WDT and postscaler counts. 3: When a CLRWDT instruction is executed, the postscaler count will be cleared. INTRC Source WDT Wake-up from Reset WDT Counter Programmable Postscaler 1:1 to 1:32,768 Enable WDT WDTPS<3:0> SWDTEN WDTEN CLRWDT 4 Power-Managed Reset All Device Resets Sleep ÷128 Change on IRCF bits Modes © 2008 Microchip Technology Inc. DS39631E-page 259 PIC18F2420/2520/4420/4520 TABLE 23-2: SUMMARY OF WATCHDOG TIMER REGISTERS REGISTER 23-14: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 — — — — — — — SWDTEN(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-1 Unimplemented: Read as ‘0’ bit 0 SWDTEN: Software Controlled Watchdog Timer Enable bit(1) 1 = Watchdog Timer is on 0 = Watchdog Timer is off Note 1: This bit has no effect if the Configuration bit, WDTEN, is enabled. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page RCON IPEN SBOREN(1) — RI TO PD POR BOR 48 WDTCON — — — — — — — SWDTEN(2) 50 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Watchdog Timer. Note 1: The SBOREN bit is only available when the BOREN<1:0> Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”. 2: This bit has no effect if the Configuration bit, WDTEN, is enabled. PIC18F2420/2520/4420/4520 DS39631E-page 260 © 2008 Microchip Technology Inc. 23.3 Two-Speed Start-up The Two-Speed Start-up feature helps to minimize the latency period from oscillator start-up to code execution by allowing the microcontroller to use the INTOSC oscillator as a clock source until the primary clock source is available. It is enabled by setting the IESO Configuration bit. Two-Speed Start-up should be enabled only if the primary oscillator mode is LP, XT, HS or HSPLL (Crystal-Based modes). Other sources do not require an OST start-up delay; for these, Two-Speed Start-up should be disabled. When enabled, Resets and wake-ups from Sleep mode cause the device to configure itself to run from the internal oscillator block as the clock source, following the time-out of the Power-up Timer after a Power-on Reset is enabled. This allows almost immediate code execution while the primary oscillator starts and the OST is running. Once the OST times out, the device automatically switches to PRI_RUN mode. To use a higher clock speed on wake-up, the INTOSC or postscaler clock sources can be selected to provide a higher clock speed by setting bits, IRCF<2:0>, immediately after Reset. For wake-ups from Sleep, the INTOSC or postscaler clock sources can be selected by setting the IRCF<2:0> bits prior to entering Sleep mode. In all other power-managed modes, Two-Speed Startup is not used. The device will be clocked by the currently selected clock source until the primary clock source becomes available. The setting of the IESO bit is ignored. 23.3.1 SPECIAL CONSIDERATIONS FOR USING TWO-SPEED START-UP While using the INTOSC oscillator in Two-Speed Startup, the device still obeys the normal command sequences for entering power-managed modes, including multiple SLEEP instructions (refer to Section 3.1.4 “Multiple Sleep Commands”). In practice, this means that user code can change the SCS<1:0> bit settings or issue SLEEP instructions before the OST times out. This would allow an application to briefly wake-up, perform routine “housekeeping” tasks and return to Sleep before the device starts to operate from the primary oscillator. User code can also check if the primary clock source is currently providing the device clocking by checking the status of the OSTS bit (OSCCON<3>). If the bit is set, the primary oscillator is providing the clock. Otherwise, the internal oscillator block is providing the clock during wake-up from Reset or Sleep mode. FIGURE 23-2: TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL) Q1 Q3 Q4 OSC1 Peripheral Program PC PC + 2 INTOSC PLL Clock Q1 PC + 6 Q2 Output Q3 Q4 Q1 CPU Clock PC + 4 Clock Counter Q2 Q2 Q3 Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. 2: Clock transition typically occurs within 2-4 TOSC. Wake from Interrupt Event TPLL(1) 1 2 n-1 n Clock OSTS bit Set Transition(2) Multiplexer TOST(1) © 2008 Microchip Technology Inc. DS39631E-page 261 PIC18F2420/2520/4420/4520 23.4 Fail-Safe Clock Monitor The Fail-Safe Clock Monitor (FSCM) allows the microcontroller to continue operation in the event of an external oscillator failure by automatically switching the device clock to the internal oscillator block. The FSCM function is enabled by setting the FCMEN Configuration bit. When FSCM is enabled, the INTRC oscillator runs at all times to monitor clocks to peripherals and provide a backup clock in the event of a clock failure. Clock monitoring (shown in Figure 23-3) is accomplished by creating a sample clock signal, which is the INTRC output divided by 64. This allows ample time between FSCM sample clocks for a peripheral clock edge to occur. The peripheral device clock and the sample clock are presented as inputs to the Clock Monitor latch (CM). The CM is set on the falling edge of the device clock source, but cleared on the rising edge of the sample clock. FIGURE 23-3: FSCM BLOCK DIAGRAM Clock failure is tested for on the falling edge of the sample clock. If a sample clock falling edge occurs while CM is still set, a clock failure has been detected (Figure 23-4). This causes the following: • the FSCM generates an oscillator fail interrupt by setting bit, OSCFIF (PIR2<7>); • the device clock source is switched to the internal oscillator block (OSCCON is not updated to show the current clock source – this is the fail-safe condition) and • the WDT is reset. During switchover, the postscaler frequency from the internal oscillator block may not be sufficiently stable for timing sensitive applications. In these cases, it may be desirable to select another clock configuration and enter an alternate power-managed mode. This can be done to attempt a partial recovery or execute a controlled shutdown. See Section 3.1.4 “Multiple Sleep Commands” and Section 23.3.1 “Special Considerations for Using Two-Speed Start-up” for more details. To use a higher clock speed on wake-up, the INTOSC or postscaler clock sources can be selected to provide a higher clock speed by setting bits, IRCF<2:0>, immediately after Reset. For wake-ups from Sleep, the INTOSC or postscaler clock sources can be selected by setting the IRCF<2:0> bits prior to entering Sleep mode. The FSCM will detect failures of the primary or secondary clock sources only. If the internal oscillator block fails, no failure would be detected, nor would any action be possible. 23.4.1 FSCM AND THE WATCHDOG TIMER Both the FSCM and the WDT are clocked by the INTRC oscillator. Since the WDT operates with a separate divider and counter, disabling the WDT has no effect on the operation of the INTRC oscillator when the FSCM is enabled. As already noted, the clock source is switched to the INTOSC clock when a clock failure is detected. Depending on the frequency selected by the IRCF<2:0> bits, this may mean a substantial change in the speed of code execution. If the WDT is enabled with a small prescale value, a decrease in clock speed allows a WDT time-out to occur and a subsequent device Reset. For this reason, fail-safe clock events also reset the WDT and postscaler, allowing it to start timing from when execution speed was changed and decreasing the likelihood of an erroneous time-out. 23.4.2 EXITING FAIL-SAFE OPERATION The fail-safe condition is terminated by either a device Reset or by entering a power-managed mode. On Reset, the controller starts the primary clock source specified in Configuration Register 1H (with any required start-up delays that are required for the oscillator mode, such as the OST or PLL timer). The INTOSC multiplexer provides the device clock until the primary clock source becomes ready (similar to a TwoSpeed Start-up). The clock source is then switched to the primary clock (indicated by the OSTS bit in the OSCCON register becoming set). The Fail-Safe Clock Monitor then resumes monitoring the peripheral clock. The primary clock source may never become ready during start-up. In this case, operation is clocked by the INTOSC multiplexer. The OSCCON register will remain in its Reset state until a power-managed mode is entered. Peripheral INTRC ÷ 64 S C Q (32 μs) 488 Hz (2.048 ms) Clock Monitor Latch (CM) (edge-triggered) Clock Failure Detected Source Clock Q PIC18F2420/2520/4420/4520 DS39631E-page 262 © 2008 Microchip Technology Inc. FIGURE 23-4: FSCM TIMING DIAGRAM 23.4.3 FSCM INTERRUPTS IN POWER-MANAGED MODES By entering a power-managed mode, the clock multiplexer selects the clock source selected by the OSCCON register. Fail-Safe Clock Monitoring of the powermanaged clock source resumes in the power-managed mode. If an oscillator failure occurs during power-managed operation, the subsequent events depend on whether or not the oscillator failure interrupt is enabled. If enabled (OSCFIF = 1), code execution will be clocked by the INTOSC multiplexer. An automatic transition back to the failed clock source will not occur. If the interrupt is disabled, subsequent interrupts while in Idle mode will cause the CPU to begin executing instructions while being clocked by the INTOSC source. 23.4.4 POR OR WAKE FROM SLEEP The FSCM is designed to detect oscillator failure at any point after the device has exited Power-on Reset (POR) or low-power Sleep mode. When the primary device clock is EC, RC or INTRC modes, monitoring can begin immediately following these events. For oscillator modes involving a crystal or resonator (HS, HSPLL, LP or XT), the situation is somewhat different. Since the oscillator may require a start-up time considerably longer than the FCSM sample clock time, a false clock failure may be detected. To prevent this, the internal oscillator block is automatically configured as the device clock and functions until the primary clock is stable (the OST and PLL timers have timed out). This is identical to Two-Speed Start-up mode. Once the primary clock is stable, the INTRC returns to its role as the FSCM source. As noted in Section 23.3.1 “Special Considerations for Using Two-Speed Start-up”, it is also possible to select another clock configuration and enter an alternate power-managed mode while waiting for the primary clock to become stable. When the new powermanaged mode is selected, the primary clock is disabled. OSCFIF CM Output Device Clock Output Sample Clock Failure Detected Oscillator Failure Note: The device clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity. (Q) CM Test CM Test CM Test Note: The same logic that prevents false oscillator failure interrupts on POR, or wake from Sleep, will also prevent the detection of the oscillator’s failure to start at all following these events. This can be avoided by monitoring the OSTS bit and using a timing routine to determine if the oscillator is taking too long to start. Even so, no oscillator failure interrupt will be flagged. © 2008 Microchip Technology Inc. DS39631E-page 263 PIC18F2420/2520/4420/4520 23.5 Program Verification and Code Protection The overall structure of the code protection on the PIC18 Flash devices differs significantly from other PIC® devices. The user program memory is divided into five blocks. One of these is a boot block of 2 Kbytes. The remainder of the memory is divided into four blocks on binary boundaries. Each of the five blocks has three code protection bits associated with them. They are: • Code-Protect bit (CPn) • Write-Protect bit (WRTn) • External Block Table Read bit (EBTRn) Figure 23-5 shows the program memory organization for 16 and 32-Kbyte devices and the specific code protection bit associated with each block. The actual locations of the bits are summarized in Table 23-3. FIGURE 23-5: CODE-PROTECTED PROGRAM MEMORY FOR PIC18F2420/2520/4420/4520 TABLE 23-3: SUMMARY OF CODE PROTECTION REGISTERS File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 300008h CONFIG5L — — — — CP3(1) CP2(1) CP1 CP0 300009h CONFIG5H CPD CPB — — — — — — 30000Ah CONFIG6L — — — — WRT3(1) WRT2(1) WRT1 WRT0 30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 30000Ch CONFIG7L — — — — EBTR3(1) EBTR2(1) EBTR1 EBTR0 30000Dh CONFIG7H — EBTRB — — — — — — Legend: Shaded cells are unimplemented. Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. MEMORY SIZE/DEVICE Block Code Protection 16 Kbytes Controlled By: (PIC18F2420/4420) 32 Kbytes (PIC18F2520/4520) Address Range Boot Block Boot Block 000000h 0007FFh CPB, WRTB, EBTRB Block 0 Block 0 000800h 001FFFh CP0, WRT0, EBTR0 Block 1 Block 1 002000h 003FFFh CP1, WRT1, EBTR1 Unimplemented Read ‘0’s Block 2 004000h 005FFFh CP2, WRT2, EBTR2 Block 3 006000h 007FFFh CP3, WRT3, EBTR3 Unimplemented Read ‘0’s 1FFFFFh (Unimplemented Memory Space) PIC18F2420/2520/4420/4520 DS39631E-page 264 © 2008 Microchip Technology Inc. 23.5.1 PROGRAM MEMORY CODE PROTECTION The program memory may be read to, or written from, any location using the table read and table write instructions. The Device ID may be read with table reads. The Configuration registers may be read and written with the table read and table write instructions. In normal execution mode, the CPn bits have no direct effect. CPn bits inhibit external reads and writes. A block of user memory may be protected from table writes if the WRTn Configuration bit is ‘0’. The EBTRn bits control table reads. For a block of user memory with the EBTRn bit set to ‘0’, a table read instruction that executes from within that block is allowed to read. A table read instruction that executes from a location outside of that block is not allowed to read and will result in reading ‘0’s. Figures 23-6 through 23-8 illustrate table write and table read protection. FIGURE 23-6: TABLE WRITE (WRTn) DISALLOWED Note: Code protection bits may only be written to a ‘0’ from a ‘1’ state. It is not possible to write a ‘1’ to a bit in the ‘0’ state. Code protection bits are only set to ‘1’ by a full chip erase or block erase function. The full chip erase and block erase functions can only be initiated via ICSP or an external programmer. 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh WRTB, EBTRB = 11 WRT0, EBTR0 = 01 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLWT* TBLPTR = 0008FFh PC = 001FFEh PC = 005FFEh TBLWT* Register Values Program Memory Configuration Bit Settings Results: All table writes disabled to Blockn whenever WRTn = 0. © 2008 Microchip Technology Inc. DS39631E-page 265 PIC18F2420/2520/4420/4520 FIGURE 23-7: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED FIGURE 23-8: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED WRTB, EBTRB = 11 WRT0, EBTR0 = 10 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLRD* TBLPTR = 0008FFh PC = 003FFEh Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0. TABLAT register returns a value of ‘0’. Register Values Program Memory Configuration Bit Settings 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh WRTB, EBTRB = 11 WRT0, EBTR0 = 10 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLRD* TBLPTR = 0008FFh PC = 001FFEh Register Values Program Memory Configuration Bit Settings Results: Table reads permitted within Blockn, even when EBTRBn = 0. TABLAT register returns the value of the data at the location TBLPTR. 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh PIC18F2420/2520/4420/4520 DS39631E-page 266 © 2008 Microchip Technology Inc. 23.5.2 DATA EEPROM CODE PROTECTION The entire data EEPROM is protected from external reads and writes by two bits: CPD and WRTD. CPD inhibits external reads and writes of data EEPROM. WRTD inhibits internal and external writes to data EEPROM. The CPU can always read data EEPROM under normal operation, regardless of the protection bit settings. 23.5.3 CONFIGURATION REGISTER PROTECTION The Configuration registers can be write-protected. The WRTC bit controls protection of the Configuration registers. In normal execution mode, the WRTC bit is read-only. WRTC can only be written via ICSP or an external programmer. 23.6 ID Locations Eight memory locations (200000h-200007h) are designated as ID locations, where the user can store checksum or other code identification numbers. These locations are both readable and writable during normal execution through the TBLRD and TBLWT instructions, or during program/verify. The ID locations can be read when the device is code-protected. 23.7 In-Circuit Serial Programming PIC18F2420/2520/4420/4520 devices can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. 23.8 In-Circuit Debugger When the DEBUG Configuration bit is programmed to a ‘0’, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB® IDE. When the microcontroller has this feature enabled, some resources are not available for general use. Table 23-4 shows which resources are required by the background debugger. TABLE 23-4: DEBUGGER RESOURCES To use the In-Circuit Debugger function of the microcontroller, the design must implement In-Circuit Serial Programming connections to MCLR/VPP/RE3, VDD, VSS, RB7 and RB6. This will interface to the In-Circuit Debugger module available from Microchip or one of the third party development tool companies. 23.9 Single-Supply ICSP Programming The LVP Configuration bit enables Single-Supply ICSP Programming (formerly known as Low-Voltage ICSP Programming or LVP). When Single-Supply Programming is enabled, the microcontroller can be programmed without requiring high voltage being applied to the MCLR/VPP/RE3 pin, but the RB5/KBI1/PGM pin is then dedicated to controlling Program mode entry and is not available as a general purpose I/O pin. While programming, using Single-Supply Programming mode, VDD is applied to the MCLR/VPP/RE3 pin as in normal execution mode. To enter Programming mode, VDD is applied to the PGM pin. If Single-Supply ICSP Programming mode will not be used, the LVP bit can be cleared. RB5/KBI1/PGM then becomes available as the digital I/O pin, RB5. The LVP bit may be set or cleared only when using standard high-voltage programming (VIHH applied to the MCLR/ VPP/RE3 pin). Once LVP has been disabled, only the standard high-voltage programming is available and must be used to program the device. Memory that is not code-protected can be erased using either a block erase, or erased row by row, then written at any specified VDD. If code-protected memory is to be erased, a block erase is required. If a block erase is to be performed when using Low-Voltage Programming, the device must be supplied with VDD of 4.5V to 5.5V. I/O pins: RB6, RB7 Stack: 2 levels Program Memory: 512 bytes Data Memory: 10 bytes Note 1: High-voltage programming is always available, regardless of the state of the LVP bit or the PGM pin, by applying VIHH to the MCLR pin. 2: By default, Single-Supply ICSP is enabled in unprogrammed devices (as supplied from Microchip) and erased devices. 3: When Single-Supply Programming is enabled, the RB5 pin can no longer be used as a general purpose I/O pin. 4: When LVP is enabled, externally pull the PGM pin to VSS to allow normal program execution. © 2008 Microchip Technology Inc. DS39631E-page 267 PIC18F2420/2520/4420/4520 24.0 INSTRUCTION SET SUMMARY PIC18F2420/2520/4420/4520 devices incorporate the standard set of 75 PIC18 core instructions, as well as an extended set of 8 new instructions, for the optimization of code that is recursive or that utilizes a software stack. The extended set is discussed later in this section. 24.1 Standard Instruction Set The standard PIC18 instruction set adds many enhancements to the previous PIC® MCU instruction sets, while maintaining an easy migration from these PIC MCU instruction sets. Most instructions are a single program memory word (16 bits), but there are four instructions that require two program memory locations. Each single-word instruction is a 16-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into four basic categories: • Byte-oriented operations • Bit-oriented operations • Literal operations • Control operations The PIC18 instruction set summary in Table 24-2 lists byte-oriented, bit-oriented, literal and control operations. Table 24-1 shows the opcode field descriptions. Most byte-oriented instructions have three operands: 1. The file register (specified by ‘f’) 2. The destination of the result (specified by ‘d’) 3. The accessed memory (specified by ‘a’) The file register designator ‘f’ specifies which file register is to be used by the instruction. The destination designator ‘d’ specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the WREG register. If ‘d’ is one, the result is placed in the file register specified in the instruction. All bit-oriented instructions have three operands: 1. The file register (specified by ‘f’) 2. The bit in the file register (specified by ‘b’) 3. The accessed memory (specified by ‘a’) The bit field designator ‘b’ selects the number of the bit affected by the operation, while the file register designator ‘f’ represents the number of the file in which the bit is located. The literal instructions may use some of the following operands: • A literal value to be loaded into a file register (specified by ‘k’) • The desired FSR register to load the literal value into (specified by ‘f’) • No operand required (specified by ‘—’) The control instructions may use some of the following operands: • A program memory address (specified by ‘n’) • The mode of the CALL or RETURN instructions (specified by ‘s’) • The mode of the table read and table write instructions (specified by ‘m’) • No operand required (specified by ‘—’) All instructions are a single word, except for four double-word instructions. These instructions were made double-word to contain the required information in 32 bits. In the second word, the 4 MSbs are ‘1’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. All single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles, with the additional instruction cycle(s) executed as a NOP. The double-word instructions execute in two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 μs. If a conditional test is true, or the program counter is changed as a result of an instruction, the instruction execution time is 2 μs. Two-word branch instructions (if true) would take 3 μs. Figure 24-1 shows the general formats that the instructions can have. All examples use the convention ‘nnh’ to represent a hexadecimal number. The Instruction Set Summary, shown in Table 24-2, lists the standard instructions recognized by the Microchip Assembler (MPASMTM). Section 24.1.1 “Standard Instruction Set” provides a description of each instruction. PIC18F2420/2520/4420/4520 DS39631E-page 268 © 2008 Microchip Technology Inc. TABLE 24-1: OPCODE FIELD DESCRIPTIONS Field Description a RAM access bit a = 0: RAM location in Access RAM (BSR register is ignored) a = 1: RAM bank is specified by BSR register bbb Bit address within an 8-bit file register (0 to 7). BSR Bank Select Register. Used to select the current RAM bank. C, DC, Z, OV, N ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative. d Destination select bit d = 0: store result in WREG d = 1: store result in file register f dest Destination: either the WREG register or the specified register file location. f 8-bit Register file address (00h to FFh) or 2-bit FSR designator (0h to 3h). fs 12-bit Register file address (000h to FFFh). This is the source address. fd 12-bit Register file address (000h to FFFh). This is the destination address. GIE Global Interrupt Enable bit. k Literal field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value). label Label name. mm The mode of the TBLPTR register for the table read and table write instructions. Only used with table read and table write instructions: * No change to register (such as TBLPTR with table reads and writes) *+ Post-Increment register (such as TBLPTR with table reads and writes) *- Post-Decrement register (such as TBLPTR with table reads and writes) +* Pre-Increment register (such as TBLPTR with table reads and writes) n The relative address (2’s complement number) for relative branch instructions or the direct address for Call/Branch and Return instructions. PC Program Counter. PCL Program Counter Low Byte. PCH Program Counter High Byte. PCLATH Program Counter High Byte Latch. PCLATU Program Counter Upper Byte Latch. PD Power-down bit. PRODH Product of Multiply High Byte. PRODL Product of Multiply Low Byte. s Fast Call/Return mode select bit s = 0: do not update into/from shadow registers s = 1: certain registers loaded into/from shadow registers (Fast mode) TBLPTR 21-bit Table Pointer (points to a Program Memory location). TABLAT 8-bit Table Latch. TO Time-out bit. TOS Top-of-Stack. u Unused or unchanged. WDT Watchdog Timer. WREG Working register (accumulator). x Don’t care (‘0’ or ‘1’). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. zs 7-bit offset value for indirect addressing of register files (source). zd 7-bit offset value for indirect addressing of register files (destination). { } Optional argument. [text] Indicates an indexed address. (text) The contents of text. [expr] Specifies bit n of the register indicated by the pointer expr. → Assigned to. < > Register bit field. ∈ In the set of. italics User-defined term (font is Courier New). © 2008 Microchip Technology Inc. DS39631E-page 269 PIC18F2420/2520/4420/4520 FIGURE 24-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 15 10 9 8 7 0 d = 0 for result destination to be WREG register OPCODE d a f (FILE #) d = 1 for result destination to be file register (f) a = 0 to force Access Bank Bit-oriented file register operations 15 12 11 9 8 7 0 OPCODE b (BIT #) a f (FILE #) b = 3-bit position of bit in file register (f) Literal operations 15 8 7 0 OPCODE k (literal) k = 8-bit immediate value Byte to Byte move operations (2-word) 15 12 11 0 OPCODE f (Source FILE #) CALL, GOTO and Branch operations 15 8 7 0 OPCODE n<7:0> (literal) n = 20-bit immediate value a = 1 for BSR to select bank f = 8-bit file register address a = 0 to force Access Bank a = 1 for BSR to select bank f = 8-bit file register address 15 12 11 0 1111 n<19:8> (literal) 15 12 11 0 1111 f (Destination FILE #) f = 12-bit file register address Control operations Example Instruction ADDWF MYREG, W, B MOVFF MYREG1, MYREG2 BSF MYREG, bit, B MOVLW 7Fh GOTO Label 15 8 7 0 OPCODE n<7:0> (literal) 15 12 11 0 1111 n<19:8> (literal) CALL MYFUNC 15 11 10 0 OPCODE n<10:0> (literal) S = Fast bit BRA MYFUNC 15 8 7 0 OPCODE n<7:0> (literal) BC MYFUNC S PIC18F2420/2520/4420/4520 DS39631E-page 270 © 2008 Microchip Technology Inc. TABLE 24-2: PIC18FXXXX INSTRUCTION SET Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb BYTE-ORIENTED OPERATIONS ADDWF ADDWFC ANDWF CLRF COMF CPFSEQ CPFSGT CPFSLT DECF DECFSZ DCFSNZ INCF INCFSZ INFSNZ IORWF MOVF MOVFF MOVWF MULWF NEGF RLCF RLNCF RRCF RRNCF SETF SUBFWB SUBWF SUBWFB SWAPF TSTFSZ XORWF f, d, a f, d, a f, d, a f, a f, d, a f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a fs, fd f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a Add WREG and f Add WREG and Carry bit to f AND WREG with f Clear f Complement f Compare f with WREG, Skip = Compare f with WREG, Skip > Compare f with WREG, Skip < Decrement f Decrement f, Skip if 0 Decrement f, Skip if Not 0 Increment f Increment f, Skip if 0 Increment f, Skip if Not 0 Inclusive OR WREG with f Move f Move fs (source) to 1st word fd (destination) 2nd word Move WREG to f Multiply WREG with f Negate f Rotate Left f through Carry Rotate Left f (No Carry) Rotate Right f through Carry Rotate Right f (No Carry) Set f Subtract f from WREG with Borrow Subtract WREG from f Subtract WREG from f with Borrow Swap Nibbles in f Test f, Skip if 0 Exclusive OR WREG with f 1 1 1 1 1 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 (2 or 3) 1 0010 0010 0001 0110 0001 0110 0110 0110 0000 0010 0100 0010 0011 0100 0001 0101 1100 1111 0110 0000 0110 0011 0100 0011 0100 0110 0101 0101 0101 0011 0110 0001 01da 00da 01da 101a 11da 001a 010a 000a 01da 11da 11da 10da 11da 10da 00da 00da ffff ffff 111a 001a 110a 01da 01da 00da 00da 100a 01da 11da 10da 10da 011a 10da ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z, OV, N C, DC, Z, OV, N Z, N Z Z, N None None None C, DC, Z, OV, N None None C, DC, Z, OV, N None None Z, N Z, N None None None C, DC, Z, OV, N C, Z, N Z, N C, Z, N Z, N None C, DC, Z, OV, N C, DC, Z, OV, N C, DC, Z, OV, N None None Z, N 1, 2 1, 2 1,2 2 1, 2 4 4 1, 2 1, 2, 3, 4 1, 2, 3, 4 1, 2 1, 2, 3, 4 4 1, 2 1, 2 1 1, 2 1, 2 1, 2 1, 2 4 1, 2 Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. © 2008 Microchip Technology Inc. DS39631E-page 271 PIC18F2420/2520/4420/4520 BIT-ORIENTED OPERATIONS BCF BSF BTFSC BTFSS BTG f, b, a f, b, a f, b, a f, b, a f, d, a Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set Bit Toggle f 1 1 1 (2 or 3) 1 (2 or 3) 1 1001 1000 1011 1010 0111 bbba bbba bbba bbba bbba ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff None None None None None 1, 2 1, 2 3, 4 3, 4 1, 2 CONTROL OPERATIONS BC BN BNC BNN BNOV BNZ BOV BRA BZ CALL CLRWDT DAW GOTO NOP NOP POP PUSH RCALL RESET RETFIE RETLW RETURN SLEEP n n n n n n n n n n, s — — n — — — — n s k s — Branch if Carry Branch if Negative Branch if Not Carry Branch if Not Negative Branch if Not Overflow Branch if Not Zero Branch if Overflow Branch Unconditionally Branch if Zero Call Subroutine 1st word 2nd word Clear Watchdog Timer Decimal Adjust WREG Go to Address 1st word 2nd word No Operation No Operation Pop Top of Return Stack (TOS) Push Top of Return Stack (TOS) Relative Call Software Device Reset Return from Interrupt Enable Return with Literal in WREG Return from Subroutine Go into Standby mode 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 2 1 (2) 2 1 1 2 1 1 1 1 2 1 2 2 2 1 1110 1110 1110 1110 1110 1110 1110 1101 1110 1110 1111 0000 0000 1110 1111 0000 1111 0000 0000 1101 0000 0000 0000 0000 0000 0010 0110 0011 0111 0101 0001 0100 0nnn 0000 110s kkkk 0000 0000 1111 kkkk 0000 xxxx 0000 0000 1nnn 0000 0000 1100 0000 0000 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0000 0000 kkkk kkkk 0000 xxxx 0000 0000 nnnn 1111 0001 kkkk 0001 0000 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0100 0111 kkkk kkkk 0000 xxxx 0110 0101 nnnn 1111 000s kkkk 001s 0011 None None None None None None None None None None TO, PD C None None None None None None All GIE/GIEH, PEIE/GIEL None None TO, PD 4 TABLE 24-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. PIC18F2420/2520/4420/4520 DS39631E-page 272 © 2008 Microchip Technology Inc. LITERAL OPERATIONS ADDLW ANDLW IORLW LFSR MOVLB MOVLW MULLW RETLW SUBLW XORLW k k k f, k k k k k k k Add Literal and WREG AND Literal with WREG Inclusive OR Literal with WREG Move Literal (12-bit)2nd word to FSR(f) 1st word Move Literal to BSR<3:0> Move Literal to WREG Multiply Literal with WREG Return with Literal in WREG Subtract WREG from Literal Exclusive OR Literal with WREG 1 1 1 2 1 1 1 2 1 1 0000 0000 0000 1110 1111 0000 0000 0000 0000 0000 0000 1111 1011 1001 1110 0000 0001 1110 1101 1100 1000 1010 kkkk kkkk kkkk 00ff kkkk 0000 kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z, OV, N Z, N Z, N None None None None None C, DC, Z, OV, N Z, N DATA MEMORY ↔ PROGRAM MEMORY OPERATIONS TBLRD* TBLRD*+ TBLRD*- TBLRD+* TBLWT* TBLWT*+ TBLWT*- TBLWT+* Table Read Table Read with Post-Increment Table Read with Post-Decrement Table Read with Pre-Increment Table Write Table Write with Post-Increment Table Write with Post-Decrement Table Write with Pre-Increment 2 2 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1000 1001 1010 1011 1100 1101 1110 1111 None None None None None None None None TABLE 24-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb Note 1: When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. © 2008 Microchip Technology Inc. DS39631E-page 273 PIC18F2420/2520/4420/4520 24.1.1 STANDARD INSTRUCTION SET ADDLW ADD Literal to W Syntax: ADDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) + k → W Status Affected: N, OV, C, DC, Z Encoding: 0000 1111 kkkk kkkk Description: The contents of W are added to the 8-bit literal ‘k’ and the result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: ADDLW 15h Before Instruction W = 10h After Instruction W = 25h ADDWF ADD W to f Syntax: ADDWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) + (f) → dest Status Affected: N, OV, C, DC, Z Encoding: 0010 01da ffff ffff Description: Add W to register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ADDWF REG, 0, 0 Before Instruction W = 17h REG = 0C2h After Instruction W = 0D9h REG = 0C2h Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s). PIC18F2420/2520/4420/4520 DS39631E-page 274 © 2008 Microchip Technology Inc. ADDWFC ADD W and Carry bit to f Syntax: ADDWFC f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) + (f) + (C) → dest Status Affected: N,OV, C, DC, Z Encoding: 0010 00da ffff ffff Description: Add W, the Carry flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ADDWFC REG, 0, 1 Before Instruction Carry bit = 1 REG = 02h W = 4Dh After Instruction Carry bit = 0 REG = 02h W = 50h ANDLW AND Literal with W Syntax: ANDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .AND. k → W Status Affected: N, Z Encoding: 0000 1011 kkkk kkkk Description: The contents of W are ANDed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: ANDLW 05Fh Before Instruction W = A3h After Instruction W = 03h © 2008 Microchip Technology Inc. DS39631E-page 275 PIC18F2420/2520/4420/4520 ANDWF AND W with f Syntax: ANDWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .AND. (f) → dest Status Affected: N, Z Encoding: 0001 01da ffff ffff Description: The contents of W are ANDed with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ANDWF REG, 0, 0 Before Instruction W = 17h REG = C2h After Instruction W = 02h REG = C2h BC Branch if Carry Syntax: BC n Operands: -128 ≤ n ≤ 127 Operation: if Carry bit is ‘1’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0010 nnnn nnnn Description: If the Carry bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BC 5 Before Instruction PC = address (HERE) After Instruction If Carry = 1; PC = address (HERE + 12) If Carry = 0; PC = address (HERE + 2) PIC18F2420/2520/4420/4520 DS39631E-page 276 © 2008 Microchip Technology Inc. BCF Bit Clear f Syntax: BCF f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: 0 → f Status Affected: None Encoding: 1001 bbba ffff ffff Description: Bit ‘b’ in register ‘f’ is cleared. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BCF FLAG_REG, 7, 0 Before Instruction FLAG_REG = C7h After Instruction FLAG_REG = 47h BN Branch if Negative Syntax: BN n Operands: -128 ≤ n ≤ 127 Operation: if Negative bit is ‘1’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0110 nnnn nnnn Description: If the Negative bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BN Jump Before Instruction PC = address (HERE) After Instruction If Negative = 1; PC = address (Jump) If Negative = 0; PC = address (HERE + 2) © 2008 Microchip Technology Inc. DS39631E-page 277 PIC18F2420/2520/4420/4520 BNC Branch if Not Carry Syntax: BNC n Operands: -128 ≤ n ≤ 127 Operation: if Carry bit is ‘0’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0011 nnnn nnnn Description: If the Carry bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNC Jump Before Instruction PC = address (HERE) After Instruction If Carry = 0; PC = address (Jump) If Carry = 1; PC = address (HERE + 2) BNN Branch if Not Negative Syntax: BNN n Operands: -128 ≤ n ≤ 127 Operation: if Negative bit is ‘0’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0111 nnnn nnnn Description: If the Negative bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNN Jump Before Instruction PC = address (HERE) After Instruction If Negative = 0; PC = address (Jump) If Negative = 1; PC = address (HERE + 2) PIC18F2420/2520/4420/4520 DS39631E-page 278 © 2008 Microchip Technology Inc. BNOV Branch if Not Overflow Syntax: BNOV n Operands: -128 ≤ n ≤ 127 Operation: if Overflow bit is ‘0’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0101 nnnn nnnn Description: If the Overflow bit is ‘0’, then the program will branch. The 2’s complement number, ‘2n’, is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNOV Jump Before Instruction PC = address (HERE) After Instruction If Overflow = 0; PC = address (Jump) If Overflow = 1; PC = address (HERE + 2) BNZ Branch if Not Zero Syntax: BNZ n Operands: -128 ≤ n ≤ 127 Operation: if Zero bit is ‘0’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0001 nnnn nnnn Description: If the Zero bit is ‘0’, then the program will branch. The 2’s complement number, ‘2n’, is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNZ Jump Before Instruction PC = address (HERE) After Instruction If Zero = 0; PC = address (Jump) If Zero = 1; PC = address (HERE + 2) © 2008 Microchip Technology Inc. DS39631E-page 279 PIC18F2420/2520/4420/4520 BRA Unconditional Branch Syntax: BRA n Operands: -1024 ≤ n ≤ 1023 Operation: (PC) + 2 + 2n → PC Status Affected: None Encoding: 1101 0nnn nnnn nnnn Description: Add the 2’s complement number, ‘2n’, to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation Example: HERE BRA Jump Before Instruction PC = address (HERE) After Instruction PC = address (Jump) BSF Bit Set f Syntax: BSF f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: 1 → f Status Affected: None Encoding: 1000 bbba ffff ffff Description: Bit ‘b’ in register ‘f’ is set. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BSF FLAG_REG, 7, 1 Before Instruction FLAG_REG = 0Ah After Instruction FLAG_REG = 8Ah PIC18F2420/2520/4420/4520 DS39631E-page 280 © 2008 Microchip Technology Inc. BTFSC Bit Test File, Skip if Clear Syntax: BTFSC f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: skip if (f) = 0 Status Affected: None Encoding: 1011 bbba ffff ffff Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next instruction is skipped. If bit ‘b’ is ‘0’, then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE FALSE TRUE BTFSC : : FLAG, 1, 0 Before Instruction PC = address (HERE) After Instruction If FLAG<1> = 0; PC = address (TRUE) If FLAG<1> = 1; PC = address (FALSE) BTFSS Bit Test File, Skip if Set Syntax: BTFSS f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b < 7 a ∈ [0,1] Operation: skip if (f) = 1 Status Affected: None Encoding: 1010 bbba ffff ffff Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next instruction is skipped. If bit ‘b’ is ‘1’, then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE FALSE TRUE BTFSS : : FLAG, 1, 0 Before Instruction PC = address (HERE) After Instruction If FLAG<1> = 0; PC = address (FALSE) If FLAG<1> = 1; PC = address (TRUE) © 2008 Microchip Technology Inc. DS39631E-page 281 PIC18F2420/2520/4420/4520 BTG Bit Toggle f Syntax: BTG f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b < 7 a ∈ [0,1] Operation: (f) → f Status Affected: None Encoding: 0111 bbba ffff ffff Description: Bit ‘b’ in data memory location ‘f’ is inverted. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BTG PORTC, 4, 0 Before Instruction: PORTC = 0111 0101 [75h] After Instruction: PORTC = 0110 0101 [65h] BOV Branch if Overflow Syntax: BOV n Operands: -128 ≤ n ≤ 127 Operation: if Overflow bit is ‘1’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0100 nnnn nnnn Description: If the Overflow bit is ‘1’, then the program will branch. The 2’s complement number, ‘2n’, is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BOV Jump Before Instruction PC = address (HERE) After Instruction If Overflow = 1; PC = address (Jump) If Overflow = 0; PC = address (HERE + 2) PIC18F2420/2520/4420/4520 DS39631E-page 282 © 2008 Microchip Technology Inc. BZ Branch if Zero Syntax: BZ n Operands: -128 ≤ n ≤ 127 Operation: if Zero bit is ‘1’, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0000 nnnn nnnn Description: If the Zero bit is ‘1’, then the program will branch. The 2’s complement number, ‘2n’, is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BZ Jump Before Instruction PC = address (HERE) After Instruction If Zero = 1; PC = address (Jump) If Zero = 0; PC = address (HERE + 2) CALL Subroutine Call Syntax: CALL k {,s} Operands: 0 ≤ k ≤ 1048575 s ∈ [0,1] Operation: (PC) + 4 → TOS, k → PC<20:1>; if s = 1, (W) → WS, (STATUS) → STATUSS, (BSR) → BSRS Status Affected: None Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) 1110 1111 110s k19kkk k7kkk kkkk kkkk0 kkkk8 Description: Subroutine call of entire 2-Mbyte memory range. First, return address (PC + 4) is pushed onto the return stack. If ‘s’ = 1, the W, STATUS and BSR registers are also pushed into their respective shadow registers, WS, STATUSS and BSRS. If ‘s’ = 0, no update occurs (default). Then, the 20-bit value ‘k’ is loaded into PC<20:1>. CALL is a two-cycle instruction. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’<7:0>, PUSH PC to stack Read literal ‘k’<19:8>, Write to PC No operation No operation No operation No operation Example: HERE CALL THERE, 1 Before Instruction PC = address (HERE) After Instruction PC = address (THERE) TOS = address (HERE + 4) WS = W BSRS = BSR STATUSS = STATUS © 2008 Microchip Technology Inc. DS39631E-page 283 PIC18F2420/2520/4420/4520 CLRF Clear f Syntax: CLRF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: 000h → f, 1 → Z Status Affected: Z Encoding: 0110 101a ffff ffff Description: Clears the contents of the specified register. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: CLRF FLAG_REG, 1 Before Instruction FLAG_REG = 5Ah After Instruction FLAG_REG = 00h CLRWDT Clear Watchdog Timer Syntax: CLRWDT Operands: None Operation: 000h → WDT, 000h → WDT postscaler, 1 → TO, 1 → PD Status Affected: TO, PD Encoding: 0000 0000 0000 0100 Description: CLRWDT instruction resets the Watchdog Timer. It also resets the postscaler of the WDT. Status bits, TO and PD, are set. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data No operation Example: CLRWDT Before Instruction WDT Counter = ? After Instruction WDT Counter = 00h WDT Postscaler = 0 TO = 1 PD = 1 PIC18F2420/2520/4420/4520 DS39631E-page 284 © 2008 Microchip Technology Inc. COMF Complement f Syntax: COMF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest Status Affected: N, Z Encoding: 0001 11da ffff ffff Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: COMF REG, 0, 0 Before Instruction REG = 13h After Instruction REG = 13h W = ECh CPFSEQ Compare f with W, Skip if f = W Syntax: CPFSEQ f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) = (W) (unsigned comparison) Status Affected: None Encoding: 0110 001a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of W by performing an unsigned subtraction. If ‘f’ = W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSEQ REG, 0 NEQUAL : EQUAL : Before Instruction PC Address = HERE W =? REG = ? After Instruction If REG = W; PC = Address (EQUAL) If REG ≠ W; PC = Address (NEQUAL) © 2008 Microchip Technology Inc. DS39631E-page 285 PIC18F2420/2520/4420/4520 CPFSGT Compare f with W, Skip if f > W Syntax: CPFSGT f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) > (W) (unsigned comparison) Status Affected: None Encoding: 0110 010a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of the W by performing an unsigned subtraction. If the contents of ‘f’ are greater than the contents of WREG, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSGT REG, 0 NGREATER : GREATER : Before Instruction PC = Address (HERE) W = ? After Instruction If REG > W; PC = Address (GREATER) If REG ≤ W; PC = Address (NGREATER) CPFSLT Compare f with W, Skip if f < W Syntax: CPFSLT f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) < (W) (unsigned comparison) Status Affected: None Encoding: 0110 000a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of W by performing an unsigned subtraction. If the contents of ‘f’ are less than the contents of W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSLT REG, 1 NLESS : LESS : Before Instruction PC = Address (HERE) W = ? After Instruction If REG < W; PC = Address (LESS) If REG ≥ W; PC = Address (NLESS) PIC18F2420/2520/4420/4520 DS39631E-page 286 © 2008 Microchip Technology Inc. DAW Decimal Adjust W Register Syntax: DAW Operands: None Operation: If [W<3:0> > 9] or [DC = 1] then, (W<3:0>) + 6 → W<3:0>; else, (W<3:0>) → W<3:0>; If [W<7:4> + DC > 9] or [C = 1] then, (W<7:4>) + 6 + DC → W<7:4>; else, (W<7:4>) + DC → W<7:4> Status Affected: C Encoding: 0000 0000 0000 0111 Description: DAW adjusts the 8-bit value in W, resulting from the earlier addition of two variables (each in packed BCD format) and produces a correct packed BCD result. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register W Process Data Write W Example 1: DAW Before Instruction W = A5h C =0 DC = 0 After Instruction W = 05h C =1 DC = 0 Example 2: Before Instruction W = CEh C =0 DC = 0 After Instruction W = 34h C =1 DC = 0 DECF Decrement f Syntax: DECF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest Status Affected: C, DC, N, OV, Z Encoding: 0000 01da ffff ffff Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: DECF CNT, 1, 0 Before Instruction CNT = 01h Z =0 After Instruction CNT = 00h Z =1 © 2008 Microchip Technology Inc. DS39631E-page 287 PIC18F2420/2520/4420/4520 DECFSZ Decrement f, Skip if 0 Syntax: DECFSZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest, skip if result = 0 Status Affected: None Encoding: 0010 11da ffff ffff Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE DECFSZ CNT, 1, 1 GOTO LOOP CONTINUE Before Instruction PC = Address (HERE) After Instruction CNT = CNT – 1 If CNT = 0; PC = Address (CONTINUE) If CNT ≠ 0; PC = Address (HERE + 2) DCFSNZ Decrement f, Skip if Not 0 Syntax: DCFSNZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest, skip if result ≠ 0 Status Affected: None Encoding: 0100 11da ffff ffff Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE DCFSNZ TEMP, 1, 0 ZERO : NZERO : Before Instruction TEMP = ? After Instruction TEMP = TEMP – 1, If TEMP = 0; PC = Address (ZERO) If TEMP ≠ 0; PC = Address (NZERO) PIC18F2420/2520/4420/4520 DS39631E-page 288 © 2008 Microchip Technology Inc. GOTO Unconditional Branch Syntax: GOTO k Operands: 0 ≤ k ≤ 1048575 Operation: k → PC<20:1> Status Affected: None Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) 1110 1111 1111 k19kkk k7kkk kkkk kkkk0 kkkk8 Description: GOTO allows an unconditional branch anywhere within entire 2-Mbyte memory range. The 20-bit value ‘k’ is loaded into PC<20:1>. GOTO is always a two-cycle instruction. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’<7:0>, No operation Read literal ‘k’<19:8>, Write to PC No operation No operation No operation No operation Example: GOTO THERE After Instruction PC = Address (THERE) INCF Increment f Syntax: INCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest Status Affected: C, DC, N, OV, Z Encoding: 0010 10da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: INCF CNT, 1, 0 Before Instruction CNT = FFh Z =0 C =? DC = ? After Instruction CNT = 00h Z =1 C =1 DC = 1 © 2008 Microchip Technology Inc. DS39631E-page 289 PIC18F2420/2520/4420/4520 INCFSZ Increment f, Skip if 0 Syntax: INCFSZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest, skip if result = 0 Status Affected: None Encoding: 0011 11da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE INCFSZ CNT, 1, 0 NZERO : ZERO : Before Instruction PC = Address (HERE) After Instruction CNT = CNT + 1 If CNT = 0; PC = Address (ZERO) If CNT ≠ 0; PC = Address (NZERO) INFSNZ Increment f, Skip if Not 0 Syntax: INFSNZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest, skip if result ≠ 0 Status Affected: None Encoding: 0100 10da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE INFSNZ REG, 1, 0 ZERO NZERO Before Instruction PC = Address (HERE) After Instruction REG = REG + 1 If REG ≠ 0; PC = Address (NZERO) If REG = 0; PC = Address (ZERO) PIC18F2420/2520/4420/4520 DS39631E-page 290 © 2008 Microchip Technology Inc. IORLW Inclusive OR Literal with W Syntax: IORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .OR. k → W Status Affected: N, Z Encoding: 0000 1001 kkkk kkkk Description: The contents of W are ORed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: IORLW 35h Before Instruction W = 9Ah After Instruction W = BFh IORWF Inclusive OR W with f Syntax: IORWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .OR. (f) → dest Status Affected: N, Z Encoding: 0001 00da ffff ffff Description: Inclusive OR W with register ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: IORWF RESULT, 0, 1 Before Instruction RESULT = 13h W = 91h After Instruction RESULT = 13h W = 93h © 2008 Microchip Technology Inc. DS39631E-page 291 PIC18F2420/2520/4420/4520 LFSR Load FSR Syntax: LFSR f, k Operands: 0 ≤ f ≤ 2 0 ≤ k ≤ 4095 Operation: k → FSRf Status Affected: None Encoding: 1110 1111 1110 0000 00ff k7kkk k11kkk kkkk Description: The 12-bit literal ‘k’ is loaded into the File Select Register pointed to by ‘f’. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ MSB Process Data Write literal ‘k’ MSB to FSRfH Decode Read literal ‘k’ LSB Process Data Write literal ‘k’ to FSRfL Example: LFSR 2, 3ABh After Instruction FSR2H = 03h FSR2L = ABh MOVF Move f Syntax: MOVF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: f → dest Status Affected: N, Z Encoding: 0101 00da ffff ffff Description: The contents of register ‘f’ are moved to a destination dependent upon the status of ‘d’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write W Example: MOVF REG, 0, 0 Before Instruction REG = 22h W = FFh After Instruction REG = 22h W = 22h PIC18F2420/2520/4420/4520 DS39631E-page 292 © 2008 Microchip Technology Inc. MOVFF Move f to f Syntax: MOVFF fs,fd Operands: 0 ≤ fs ≤ 4095 0 ≤ fd ≤ 4095 Operation: (fs) → fd Status Affected: None Encoding: 1st word (source) 2nd word (destin.) 1100 1111 ffff ffff ffff ffff ffffs ffffd Description: The contents of source register ‘fs’ are moved to destination register ‘fd’. Location of source ‘fs’ can be anywhere in the 4096-byte data space (000h to FFFh) and location of destination ‘fd’ can also be anywhere from 000h to FFFh. Either source or destination can be W (a useful special situation). MOVFF is particularly useful for transferring a data memory location to a peripheral register (such as the transmit buffer or an I/O port). The MOVFF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. Words: 2 Cycles: 2 (3) Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ (src) Process Data No operation Decode No operation No dummy read No operation Write register ‘f’ (dest) Example: MOVFF REG1, REG2 Before Instruction REG1 = 33h REG2 = 11h After Instruction REG1 = 33h REG2 = 33h MOVLB Move Literal to Low Nibble in BSR Syntax: MOVLW k Operands: 0 ≤ k ≤ 255 Operation: k → BSR Status Affected: None Encoding: 0000 0001 kkkk kkkk Description: The 8-bit literal ‘k’ is loaded into the Bank Select Register (BSR). The value of BSR<7:4> always remains ‘0’, regardless of the value of k7:k4. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write literal ‘k’ to BSR Example: MOVLB 5 Before Instruction BSR Register = 02h After Instruction BSR Register = 05h © 2008 Microchip Technology Inc. DS39631E-page 293 PIC18F2420/2520/4420/4520 MOVLW Move Literal to W Syntax: MOVLW k Operands: 0 ≤ k ≤ 255 Operation: k → W Status Affected: None Encoding: 0000 1110 kkkk kkkk Description: The 8-bit literal ‘k’ is loaded into W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: MOVLW 5Ah After Instruction W = 5Ah MOVWF Move W to f Syntax: MOVWF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (W) → f Status Affected: None Encoding: 0110 111a ffff ffff Description: Move data from W to register ‘f’. Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: MOVWF REG, 0 Before Instruction W = 4Fh REG = FFh After Instruction W = 4Fh REG = 4Fh PIC18F2420/2520/4420/4520 DS39631E-page 294 © 2008 Microchip Technology Inc. MULLW Multiply Literal with W Syntax: MULLW k Operands: 0 ≤ k ≤ 255 Operation: (W) x k → PRODH:PRODL Status Affected: None Encoding: 0000 1101 kkkk kkkk Description: An unsigned multiplication is carried out between the contents of W and the 8-bit literal ‘k’. The 16-bit result is placed in the PRODH:PRODL register pair. PRODH contains the high byte. W is unchanged. None of the Status flags are affected. Note that neither Overflow nor Carry is possible in this operation. A zero result is possible but not detected. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write registers PRODH: PRODL Example: MULLW 0C4h Before Instruction W = E2h PRODH = ? PRODL = ? After Instruction W = E2h PRODH = ADh PRODL = 08h MULWF Multiply W with f Syntax: MULWF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (W) x (f) → PRODH:PRODL Status Affected: None Encoding: 0000 001a ffff ffff Description: An unsigned multiplication is carried out between the contents of W and the register file location ‘f’. The 16-bit result is stored in the PRODH:PRODL register pair. PRODH contains the high byte. Both W and ‘f’ are unchanged. None of the Status flags are affected. Note that neither Overflow nor Carry is possible in this operation. A zero result is possible but not detected. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write registers PRODH: PRODL Example: MULWF REG, 1 Before Instruction W = C4h REG = B5h PRODH = ? PRODL = ? After Instruction W = C4h REG = B5h PRODH = 8Ah PRODL = 94h © 2008 Microchip Technology Inc. DS39631E-page 295 PIC18F2420/2520/4420/4520 NEGF Negate f Syntax: NEGF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: ( f ) + 1 → f Status Affected: N, OV, C, DC, Z Encoding: 0110 110a ffff ffff Description: Location ‘f’ is negated using two’s complement. The result is placed in the data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: NEGF REG, 1 Before Instruction REG = 0011 1010 [3Ah] After Instruction REG = 1100 0110 [C6h] NOP No Operation Syntax: NOP Operands: None Operation: No operation Status Affected: None Encoding: 0000 1111 0000 xxxx 0000 xxxx 0000 xxxx Description: No operation. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation Example: None. PIC18F2420/2520/4420/4520 DS39631E-page 296 © 2008 Microchip Technology Inc. POP Pop Top of Return Stack Syntax: POP Operands: None Operation: (TOS) → bit bucket Status Affected: None Encoding: 0000 0000 0000 0110 Description: The TOS value is pulled off the return stack and is discarded. The TOS value then becomes the previous value that was pushed onto the return stack. This instruction is provided to enable the user to properly manage the return stack to incorporate a software stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation POP TOS value No operation Example: POP GOTO NEW Before Instruction TOS = 0031A2h Stack (1 level down) = 014332h After Instruction TOS = 014332h PC = NEW PUSH Push Top of Return Stack Syntax: PUSH Operands: None Operation: (PC + 2) → TOS Status Affected: None Encoding: 0000 0000 0000 0101 Description: The PC + 2 is pushed onto the top of the return stack. The previous TOS value is pushed down on the stack. This instruction allows implementing a software stack by modifying TOS and then pushing it onto the return stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode PUSH PC + 2 onto return stack No operation No operation Example: PUSH Before Instruction TOS = 345Ah PC = 0124h After Instruction PC = 0126h TOS = 0126h Stack (1 level down) = 345Ah © 2008 Microchip Technology Inc. DS39631E-page 297 PIC18F2420/2520/4420/4520 RCALL Relative Call Syntax: RCALL n Operands: -1024 ≤ n ≤ 1023 Operation: (PC) + 2 → TOS, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1101 1nnn nnnn nnnn Description: Subroutine call with a jump up to 1K from the current location. First, return address (PC + 2) is pushed onto the stack. Then, add the 2’s complement number ‘2n’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ PUSH PC to stack Process Data Write to PC No operation No operation No operation No operation Example: HERE RCALL Jump Before Instruction PC = Address (HERE) After Instruction PC = Address (Jump) TOS = Address (HERE + 2) RESET Reset Syntax: RESET Operands: None Operation: Reset all registers and flags that are affected by a MCLR Reset. Status Affected: All Encoding: 0000 0000 1111 1111 Description: This instruction provides a way to execute a MCLR Reset in software. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Start Reset No operation No operation Example: RESET After Instruction Registers = Reset Value Flags* = Reset Value PIC18F2420/2520/4420/4520 DS39631E-page 298 © 2008 Microchip Technology Inc. RETFIE Return from Interrupt Syntax: RETFIE {s} Operands: s ∈ [0,1] Operation: (TOS) → PC, 1 → GIE/GIEH or PEIE/GIEL; if s = 1, (WS) → W, (STATUSS) → STATUS, (BSRS) → BSR, PCLATU, PCLATH are unchanged Status Affected: GIE/GIEH, PEIE/GIEL. Encoding: 0000 0000 0001 000s Description: Return from interrupt. Stack is popped and Top-of-Stack (TOS) is loaded into the PC. Interrupts are enabled by setting either the high or low-priority global interrupt enable bit. If ‘s’ = 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, STATUS and BSR. If ‘s’ = 0, no update of these registers occurs (default). Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation POP PC from stack Set GIEH or GIEL No operation No operation No operation No operation Example: RETFIE 1 After Interrupt PC = TOS W = WS BSR = BSRS STATUS = STATUSS GIE/GIEH, PEIE/GIEL = 1 RETLW Return Literal to W Syntax: RETLW k Operands: 0 ≤ k ≤ 255 Operation: k → W, (TOS) → PC, PCLATU, PCLATH are unchanged Status Affected: None Encoding: 0000 1100 kkkk kkkk Description: W is loaded with the 8-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). The high address latch (PCLATH) remains unchanged. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data POP PC from stack, Write to W No operation No operation No operation No operation Example: CALL TABLE ; W contains table ; offset value ; W now has ; table value : TABLE ADDWF PCL ; W = offset RETLW k0 ; Begin table RETLW k1 ; : : RETLW kn ; End of table Before Instruction W = 07h After Instruction W = value of kn © 2008 Microchip Technology Inc. DS39631E-page 299 PIC18F2420/2520/4420/4520 RETURN Return from Subroutine Syntax: RETURN {s} Operands: s ∈ [0,1] Operation: (TOS) → PC; if s = 1, (WS) → W, (STATUSS) → STATUS, (BSRS) → BSR, PCLATU, PCLATH are unchanged Status Affected: None Encoding: 0000 0000 0001 001s Description: Return from subroutine. The stack is popped and the top of the stack (TOS) is loaded into the program counter. If ‘s’= 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, STATUS and BSR. If ‘s’ = 0, no update of these registers occurs (default). Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data POP PC from stack No operation No operation No operation No operation Example: RETURN After Instruction: PC = TOS RLCF Rotate Left f through Carry Syntax: RLCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<7>) → C, (C) → dest<0> Status Affected: C, N, Z Encoding: 0011 01da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RLCF REG, 0, 0 Before Instruction REG = 1110 0110 C =0 After Instruction REG = 1110 0110 W = 1100 1100 C =1 C register f PIC18F2420/2520/4420/4520 DS39631E-page 300 © 2008 Microchip Technology Inc. RLNCF Rotate Left f (No Carry) Syntax: RLNCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<7>) → dest<0> Status Affected: N, Z Encoding: 0100 01da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the left. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RLNCF REG, 1, 0 Before Instruction REG = 1010 1011 After Instruction REG = 0101 0111 register f RRCF Rotate Right f through Carry Syntax: RRCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<0>) → C, (C) → dest<7> Status Affected: C, N, Z Encoding: 0011 00da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RRCF REG, 0, 0 Before Instruction REG = 1110 0110 C =0 After Instruction REG = 1110 0110 W = 0111 0011 C =0 C register f © 2008 Microchip Technology Inc. DS39631E-page 301 PIC18F2420/2520/4420/4520 RRNCF Rotate Right f (No Carry) Syntax: RRNCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<0>) → dest<7> Status Affected: N, Z Encoding: 0100 00da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the right. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank will be selected, overriding the BSR value. If ‘a’ is ‘1’, then the bank will be selected as per the BSR value (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: RRNCF REG, 1, 0 Before Instruction REG = 1101 0111 After Instruction REG = 1110 1011 Example 2: RRNCF REG, 0, 0 Before Instruction W =? REG = 1101 0111 After Instruction W = 1110 1011 REG = 1101 0111 register f SETF Set f Syntax: SETF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: FFh → f Status Affected: None Encoding: 0110 100a ffff ffff Description: The contents of the specified register are set to FFh. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: SETF REG, 1 Before Instruction REG = 5Ah After Instruction REG = FFh PIC18F2420/2520/4420/4520 DS39631E-page 302 © 2008 Microchip Technology Inc. SLEEP Enter Sleep mode Syntax: SLEEP Operands: None Operation: 00h → WDT, 0 → WDT postscaler, 1 → TO, 0 → PD Status Affected: TO, PD Encoding: 0000 0000 0000 0011 Description: The Power-Down status bit (PD) is cleared. The Time-out status bit (TO) is set. Watchdog Timer and its postscaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data Go to Sleep Example: SLEEP Before Instruction TO = ? PD = ? After Instruction TO = 1 † PD = 0 † If WDT causes wake-up, this bit is cleared. SUBFWB Subtract f from W with Borrow Syntax: SUBFWB f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) – (f) – (C) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 01da ffff ffff Description: Subtract register ‘f’ and Carry flag (borrow) from W (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBFWB REG, 1, 0 Before Instruction REG = 3 W =2 C =1 After Instruction REG = FF W =2 C =0 Z =0 N = 1 ; result is negative Example 2: SUBFWB REG, 0, 0 Before Instruction REG = 2 W =5 C =1 After Instruction REG = 2 W =3 C =1 Z =0 N = 0 ; result is positive Example 3: SUBFWB REG, 1, 0 Before Instruction REG = 1 W =2 C =0 After Instruction REG = 0 W =2 C =1 Z = 1 ; result is zero N =0 © 2008 Microchip Technology Inc. DS39631E-page 303 PIC18F2420/2520/4420/4520 SUBLW Subtract W from Literal Syntax: SUBLW k Operands: 0 ≤ k ≤ 255 Operation: k – (W) → W Status Affected: N, OV, C, DC, Z Encoding: 0000 1000 kkkk kkkk Description W is subtracted from the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example 1: SUBLW 02h Before Instruction W = 01h C =? After Instruction W = 01h C = 1 ; result is positive Z =0 N =0 Example 2: SUBLW 02h Before Instruction W = 02h C =? After Instruction W = 00h C = 1 ; result is zero Z =1 N =0 Example 3: SUBLW 02h Before Instruction W = 03h C =? After Instruction W = FFh ; (2’s complement) C = 0 ; result is negative Z =0 N =1 SUBWF Subtract W from f Syntax: SUBWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – (W) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 11da ffff ffff Description: Subtract W from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBWF REG, 1, 0 Before Instruction REG = 3 W =2 C =? After Instruction REG = 1 W =2 C = 1 ; result is positive Z =0 N =0 Example 2: SUBWF REG, 0, 0 Before Instruction REG = 2 W =2 C =? After Instruction REG = 2 W =0 C = 1 ; result is zero Z =1 N =0 Example 3: SUBWF REG, 1, 0 Before Instruction REG = 1 W =2 C =? After Instruction REG = FFh ;(2’s complement) W =2 C = 0 ; result is negative Z =0 N =1 PIC18F2420/2520/4420/4520 DS39631E-page 304 © 2008 Microchip Technology Inc. SUBWFB Subtract W from f with Borrow Syntax: SUBWFB f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – (W) – (C) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 10da ffff ffff Description: Subtract W and the Carry flag (borrow) from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBWFB REG, 1, 0 Before Instruction REG = 19h (0001 1001) W = 0Dh (0000 1101) C =1 After Instruction REG = 0Ch (0000 1011) W = 0Dh (0000 1101) C =1 Z =0 N = 0 ; result is positive Example 2: SUBWFB REG, 0, 0 Before Instruction REG = 1Bh (0001 1011) W = 1Ah (0001 1010) C =0 After Instruction REG = 1Bh (0001 1011) W = 00h C =1 Z = 1 ; result is zero N =0 Example 3: SUBWFB REG, 1, 0 Before Instruction REG = 03h (0000 0011) W = 0Eh (0000 1101) C =1 After Instruction REG = F5h (1111 0100) ; [2’s comp] W = 0Eh (0000 1101) C =0 Z =0 N = 1 ; result is negative SWAPF Swap f Syntax: SWAPF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f<3:0>) → dest<7:4>, (f<7:4>) → dest<3:0> Status Affected: None Encoding: 0011 10da ffff ffff Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: SWAPF REG, 1, 0 Before Instruction REG = 53h After Instruction REG = 35h © 2008 Microchip Technology Inc. DS39631E-page 305 PIC18F2420/2520/4420/4520 TBLRD Table Read Syntax: TBLRD ( *; *+; *-; +*) Operands: None Operation: if TBLRD *, (Prog Mem (TBLPTR)) → TABLAT, TBLPTR – No Change; if TBLRD *+, (Prog Mem (TBLPTR)) → TABLAT, (TBLPTR) + 1 → TBLPTR; if TBLRD *-, (Prog Mem (TBLPTR)) → TABLAT, (TBLPTR) – 1 → TBLPTR; if TBLRD +*, (TBLPTR) + 1 → TBLPTR, (Prog Mem (TBLPTR)) → TABLAT Status Affected: None Encoding: 0000 0000 0000 10nn nn=0 * =1 *+ =2 *- =3 +* Description: This instruction is used to read the contents of Program Memory (P.M.). To address the program memory, a pointer called Table Pointer (TBLPTR) is used. The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-Mbyte address range. TBLPTR<0> = 0:Least Significant Byte of Program Memory Word TBLPTR<0> = 1:Most Significant Byte of Program Memory Word The TBLRD instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation No operation No operation (Read Program Memory) No operation No operation (Write TABLAT) TBLRD Table Read (Continued) Example1: TBLRD *+ ; Before Instruction TABLAT = 55h TBLPTR = 00A356h MEMORY (00A356h) = 34h After Instruction TABLAT = 34h TBLPTR = 00A357h Example2: TBLRD +* ; Before Instruction TABLAT = AAh TBLPTR = 01A357h MEMORY (01A357h) = 12h MEMORY (01A358h) = 34h After Instruction TABLAT = 34h TBLPTR = 01A358h PIC18F2420/2520/4420/4520 DS39631E-page 306 © 2008 Microchip Technology Inc. TBLWT Table Write Syntax: TBLWT ( *; *+; *-; +*) Operands: None Operation: if TBLWT*, (TABLAT) → Holding Register, TBLPTR – No Change; if TBLWT*+, (TABLAT) → Holding Register, (TBLPTR) + 1 → TBLPTR; if TBLWT*-, (TABLAT) → Holding Register, (TBLPTR) – 1 → TBLPTR; if TBLWT+*, (TBLPTR) + 1 → TBLPTR, (TABLAT) → Holding Register Status Affected: None Encoding: 0000 0000 0000 11nn nn=0 * =1 *+ =2 *- =3 +* Description: This instruction uses the 3 LSBs of TBLPTR to determine which of the 8 holding registers the TABLAT is written to. The holding registers are used to program the contents of Program Memory (P.M.). (Refer to Section 6.0 “Flash Program Memory” for additional details on programming Flash memory.) The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-MByte address range. The LSb of the TBLPTR selects which byte of the program memory location to access. TBLPTR<0> = 0:Least Significant Byte of Program Memory Word TBLPTR<0> = 1:Most Significant Byte of Program Memory Word The TBLWT instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation No operation No operation (Read TABLAT) No operation No operation (Write to Holding Register ) TBLWT Table Write (Continued) Example1: TBLWT *+; Before Instruction TABLAT = 55h TBLPTR = 00A356h HOLDING REGISTER (00A356h) = FFh After Instructions (table write completion) TABLAT = 55h TBLPTR = 00A357h HOLDING REGISTER (00A356h) = 55h Example 2: TBLWT +*; Before Instruction TABLAT = 34h TBLPTR = 01389Ah HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = FFh After Instruction (table write completion) TABLAT = 34h TBLPTR = 01389Bh HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = 34h © 2008 Microchip Technology Inc. DS39631E-page 307 PIC18F2420/2520/4420/4520 TSTFSZ Test f, Skip if 0 Syntax: TSTFSZ f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: skip if f = 0 Status Affected: None Encoding: 0110 011a ffff ffff Description: If ‘f’ = 0, the next instruction fetched during the current instruction execution is discarded and a NOP is executed, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE TSTFSZ CNT, 1 NZERO : ZERO : Before Instruction PC = Address (HERE) After Instruction If CNT = 00h, PC = Address (ZERO) If CNT ≠ 00h, PC = Address (NZERO) XORLW Exclusive OR Literal with W Syntax: XORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .XOR. k → W Status Affected: N, Z Encoding: 0000 1010 kkkk kkkk Description: The contents of W are XORed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: XORLW 0AFh Before Instruction W = B5h After Instruction W = 1Ah PIC18F2420/2520/4420/4520 DS39631E-page 308 © 2008 Microchip Technology Inc. XORWF Exclusive OR W with f Syntax: XORWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .XOR. (f) → dest Status Affected: N, Z Encoding: 0001 10da ffff ffff Description: Exclusive OR the contents of W with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in the register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: XORWF REG, 1, 0 Before Instruction REG = AFh W = B5h After Instruction REG = 1Ah W = B5h © 2008 Microchip Technology Inc. DS39631E-page 309 PIC18F2420/2520/4420/4520 24.2 Extended Instruction Set In addition to the standard 75 instructions of the PIC18 instruction set, PIC18F2420/2520/4420/4520 devices also provide an optional extension to the core CPU functionality. The added features include eight additional instructions that augment indirect and indexed addressing operations and the implementation of Indexed Literal Offset Addressing mode for many of the standard PIC18 instructions. The additional features of the extended instruction set are disabled by default. To enable them, users must set the XINST Configuration bit. The instructions in the extended set can all be classified as literal operations, which either manipulate the File Select Registers, or use them for indexed addressing. Two of the instructions, ADDFSR and SUBFSR, each have an additional special instantiation for using FSR2. These versions (ADDULNK and SUBULNK) allow for automatic return after execution. The extended instructions are specifically implemented to optimize re-entrant program code (that is, code that is recursive or that uses a software stack) written in high-level languages, particularly C. Among other things, they allow users working in high-level languages to perform certain operations on data structures more efficiently. These include: • Dynamic allocation and deallocation of software stack space when entering and leaving subroutines • Function Pointer invocation • Software Stack Pointer manipulation • Manipulation of variables located in a software stack A summary of the instructions in the extended instruction set is provided in Table 24-3. Detailed descriptions are provided in Section 24.2.2 “Extended Instruction Set”. The opcode field descriptions in Table 24-1 (page 268) apply to both the standard and extended PIC18 instruction sets. 24.2.1 EXTENDED INSTRUCTION SYNTAX Most of the extended instructions use indexed arguments, using one of the File Select Registers and some offset to specify a source or destination register. When an argument for an instruction serves as part of indexed addressing, it is enclosed in square brackets (“[ ]”). This is done to indicate that the argument is used as an index or offset. MPASM™ Assembler will flag an error if it determines that an index or offset value is not bracketed. When the extended instruction set is enabled, brackets are also used to indicate index arguments in byteoriented and bit-oriented instructions. This is in addition to other changes in their syntax. For more details, see Section 24.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”. TABLE 24-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET Note: The instruction set extension and the Indexed Literal Offset Addressing mode were designed for optimizing applications written in C; the user may likely never use these instructions directly in assembler. The syntax for these commands is provided as a reference for users who may be reviewing code that has been generated by a compiler. Note: In the past, square brackets have been used to denote optional arguments in the PIC18 and earlier instruction sets. In this text and going forward, optional arguments are denoted by braces (“{ }”). Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status MSb LSb Affected ADDFSR ADDULNK CALLW MOVSF MOVSS PUSHL SUBFSR SUBULNK f, k k zs, fd zs, zd k f, k k Add Literal to FSR Add Literal to FSR2 and Return Call Subroutine using WREG Move zs (source) to 1st word fd (destination) 2nd word Move zs (source) to 1st word zd (destination) 2nd word Store Literal at FSR2, Decrement FSR2 Subtract Literal from FSR Subtract Literal from FSR2 and Return 1 2 2 2 2 1 1 2 1110 1110 0000 1110 1111 1110 1111 1110 1110 1110 1000 1000 0000 1011 ffff 1011 xxxx 1010 1001 1001 ffkk 11kk 0001 0zzz ffff 1zzz xzzz kkkk ffkk 11kk kkkk kkkk 0100 zzzz ffff zzzz zzzz kkkk kkkk kkkk None None None None None None None None PIC18F2420/2520/4420/4520 DS39631E-page 310 © 2008 Microchip Technology Inc. 24.2.2 EXTENDED INSTRUCTION SET ADDFSR Add Literal to FSR Syntax: ADDFSR f, k Operands: 0 ≤ k ≤ 63 f ∈ [ 0, 1, 2 ] Operation: FSR(f) + k → FSR(f) Status Affected: None Encoding: 1110 1000 ffkk kkkk Description: The 6-bit literal ‘k’ is added to the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR Example: ADDFSR 2, 23h Before Instruction FSR2 = 03FFh After Instruction FSR2 = 0422h ADDULNK Add Literal to FSR2 and Return Syntax: ADDULNK k Operands: 0 ≤ k ≤ 63 Operation: FSR2 + k → FSR2, (TOS) → PC Status Affected: None Encoding: 1110 1000 11kk kkkk Description: The 6-bit literal ‘k’ is added to the contents of FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the ADDFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR No Operation No Operation No Operation No Operation Example: ADDULNK 23h Before Instruction FSR2 = 03FFh PC = 0100h After Instruction FSR2 = 0422h PC = (TOS) Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s). © 2008 Microchip Technology Inc. DS39631E-page 311 PIC18F2420/2520/4420/4520 CALLW Subroutine Call Using WREG Syntax: CALLW Operands: None Operation: (PC + 2) → TOS, (W) → PCL, (PCLATH) → PCH, (PCLATU) → PCU Status Affected: None Encoding: 0000 0000 0001 0100 Description First, the return address (PC + 2) is pushed onto the return stack. Next, the contents of W are written to PCL; the existing value is discarded. Then, the contents of PCLATH and PCLATU are latched into PCH and PCU, respectively. The second cycle is executed as a NOP instruction while the new next instruction is fetched. Unlike CALL, there is no option to update W, STATUS or BSR. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read WREG PUSH PC to stack No operation No operation No operation No operation No operation Example: HERE CALLW Before Instruction PC = address (HERE) PCLATH = 10h PCLATU = 00h W = 06h After Instruction PC = 001006h TOS = address (HERE + 2) PCLATH = 10h PCLATU = 00h W = 06h MOVSF Move Indexed to f Syntax: MOVSF [zs], fd Operands: 0 ≤ zs ≤ 127 0 ≤ fd ≤ 4095 Operation: ((FSR2) + zs) → fd Status Affected: None Encoding: 1st word (source) 2nd word (destin.) 1110 1111 1011 ffff 0zzz ffff zzzzs ffffd Description: The contents of the source register are moved to destination register ‘fd’. The actual address of the source register is determined by adding the 7-bit literal offset ‘zs’ in the first word to the value of FSR2. The address of the destination register is specified by the 12-bit literal ‘fd’ in the second word. Both addresses can be anywhere in the 4096-byte data space (000h to FFFh). The MOVSF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Determine source addr Determine source addr Read source reg Decode No operation No dummy read No operation Write register ‘f’ (dest) Example: MOVSF [05h], REG2 Before Instruction FSR2 = 80h Contents of 85h = 33h REG2 = 11h After Instruction FSR2 = 80h Contents of 85h = 33h REG2 = 33h PIC18F2420/2520/4420/4520 DS39631E-page 312 © 2008 Microchip Technology Inc. MOVSS Move Indexed to Indexed Syntax: MOVSS [zs], [zd] Operands: 0 ≤ zs ≤ 127 0 ≤ zd ≤ 127 Operation: ((FSR2) + zs) → ((FSR2) + zd) Status Affected: None Encoding: 1st word (source) 2nd word (dest.) 1110 1111 1011 xxxx 1zzz xzzz zzzzs zzzzd Description The contents of the source register are moved to the destination register. The addresses of the source and destination registers are determined by adding the 7-bit literal offsets ‘zs’ or ‘zd’, respectively, to the value of FSR2. Both registers can be located anywhere in the 4096-byte data memory space (000h to FFFh). The MOVSS instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. If the resultant destination address points to an indirect addressing register, the instruction will execute as a NOP. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Determine source addr Determine source addr Read source reg Decode Determine dest addr Determine dest addr Write to dest reg Example: MOVSS [05h], [06h] Before Instruction FSR2 = 80h Contents of 85h = 33h Contents of 86h = 11h After Instruction FSR2 = 80h Contents of 85h = 33h Contents of 86h = 33h PUSHL Store Literal at FSR2, Decrement FSR2 Syntax: PUSHL k Operands: 0 ≤ k ≤ 255 Operation: k → (FSR2), FSR2 – 1 → FSR2 Status Affected: None Encoding: 1111 1010 kkkk kkkk Description: The 8-bit literal ‘k’ is written to the data memory address specified by FSR2. FSR2 is decremented by 1 after the operation. This instruction allows users to push values onto a software stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process data Write to destination Example: PUSHL 08h Before Instruction FSR2H:FSR2L = 01ECh Memory (01ECh) = 00h After Instruction FSR2H:FSR2L = 01EBh Memory (01ECh) = 08h © 2008 Microchip Technology Inc. DS39631E-page 313 PIC18F2420/2520/4420/4520 SUBFSR Subtract Literal from FSR Syntax: SUBFSR f, k Operands: 0 ≤ k ≤ 63 f ∈ [ 0, 1, 2 ] Operation: FSR(f) – k → FSRf Status Affected: None Encoding: 1110 1001 ffkk kkkk Description: The 6-bit literal ‘k’ is subtracted from the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: SUBFSR 2, 23h Before Instruction FSR2 = 03FFh After Instruction FSR2 = 03DCh SUBULNK Subtract Literal from FSR2 and Return Syntax: SUBULNK k Operands: 0 ≤ k ≤ 63 Operation: FSR2 – k → FSR2, (TOS) → PC Status Affected: None Encoding: 1110 1001 11kk kkkk Description: The 6-bit literal ‘k’ is subtracted from the contents of the FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the SUBFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination No Operation No Operation No Operation No Operation Example: SUBULNK 23h Before Instruction FSR2 = 03FFh PC = 0100h After Instruction FSR2 = 03DCh PC = (TOS) PIC18F2420/2520/4420/4520 DS39631E-page 314 © 2008 Microchip Technology Inc. 24.2.3 BYTE-ORIENTED AND BIT-ORIENTED INSTRUCTIONS IN INDEXED LITERAL OFFSET MODE In addition to eight new commands in the extended set, enabling the extended instruction set also enables Indexed Literal Offset Addressing mode (Section 5.5.1 “Indexed Addressing with Literal Offset”). This has a significant impact on the way that many commands of the standard PIC18 instruction set are interpreted. When the extended set is disabled, addresses embedded in opcodes are treated as literal memory locations: either as a location in the Access Bank (‘a’ = 0), or in a GPR bank designated by the BSR (‘a’ = 1). When the extended instruction set is enabled and ‘a’ = 0, however, a file register argument of 5Fh or less is interpreted as an offset from the pointer value in FSR2 and not as a literal address. For practical purposes, this means that all instructions that use the Access RAM bit as an argument – that is, all byte-oriented and bitoriented instructions, or almost half of the core PIC18 instructions – may behave differently when the extended instruction set is enabled. When the content of FSR2 is 00h, the boundaries of the Access RAM are essentially remapped to their original values. This may be useful in creating backward compatible code. If this technique is used, it may be necessary to save the value of FSR2 and restore it when moving back and forth between C and assembly routines in order to preserve the Stack Pointer. Users must also keep in mind the syntax requirements of the extended instruction set (see Section 24.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”). Although the Indexed Literal Offset Addressing mode can be very useful for dynamic stack and pointer manipulation, it can also be very annoying if a simple arithmetic operation is carried out on the wrong register. Users who are accustomed to the PIC18 programming must keep in mind that, when the extended instruction set is enabled, register addresses of 5Fh or less are used for Indexed Literal Offset Addressing. Representative examples of typical byte-oriented and bit-oriented instructions in the Indexed Literal Offset Addressing mode are provided on the following page to show how execution is affected. The operand conditions shown in the examples are applicable to all instructions of these types. 24.2.3.1 Extended Instruction Syntax with Standard PIC18 Commands When the extended instruction set is enabled, the file register argument, ‘f’, in the standard byte-oriented and bit-oriented commands is replaced with the literal offset value, ‘k’. As already noted, this occurs only when ‘f’ is less than or equal to 5Fh. When an offset value is used, it must be indicated by square brackets (“[ ]”). As with the extended instructions, the use of brackets indicates to the compiler that the value is to be interpreted as an index or an offset. Omitting the brackets, or using a value greater than 5Fh within brackets, will generate an error in the MPASM Assembler. If the index argument is properly bracketed for Indexed Literal Offset Addressing, the Access RAM argument is never specified; it will automatically be assumed to be ‘0’. This is in contrast to standard operation (extended instruction set disabled) when ‘a’ is set on the basis of the target address. Declaring the Access RAM bit in this mode will also generate an error in the MPASM Assembler. The destination argument, ‘d’, functions as before. In the latest versions of the MPASM assembler, language support for the extended instruction set must be explicitly invoked. This is done with either the command line option, /y, or the PE directive in the source listing. 24.2.4 CONSIDERATIONS WHEN ENABLING THE EXTENDED INSTRUCTION SET It is important to note that the extensions to the instruction set may not be beneficial to all users. In particular, users who are not writing code that uses a software stack may not benefit from using the extensions to the instruction set. Additionally, the Indexed Literal Offset Addressing mode may create issues with legacy applications written to the PIC18 assembler. This is because instructions in the legacy code may attempt to address registers in the Access Bank below 5Fh. Since these addresses are interpreted as literal offsets to FSR2 when the instruction set extension is enabled, the application may read or write to the wrong data addresses. When porting an application to the PIC18F2420/2520/ 4420/4520, it is very important to consider the type of code. A large, re-entrant application that is written in ‘C’ and would benefit from efficient compilation will do well when using the instruction set extensions. Legacy applications that heavily use the Access Bank will most likely not benefit from using the extended instruction set. Note: Enabling the PIC18 instruction set extension may cause legacy applications to behave erratically or fail entirely. © 2008 Microchip Technology Inc. DS39631E-page 315 PIC18F2420/2520/4420/4520 ADDWF ADD W to Indexed (Indexed Literal Offset mode) Syntax: ADDWF [k] {,d} Operands: 0 ≤ k ≤ 95 d ∈ [0,1] Operation: (W) + ((FSR2) + k) → dest Status Affected: N, OV, C, DC, Z Encoding: 0010 01d0 kkkk kkkk Description: The contents of W are added to the contents of the register indicated by FSR2, offset by the value ‘k’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write to destination Example: ADDWF [OFST] , 0 Before Instruction W = 17h OFST = 2Ch FSR2 = 0A00h Contents of 0A2Ch = 20h After Instruction W = 37h Contents of 0A2Ch = 20h BSF Bit Set Indexed (Indexed Literal Offset mode) Syntax: BSF [k], b Operands: 0 ≤ f ≤ 95 0 ≤ b ≤ 7 Operation: 1 → ((FSR2) + k) Status Affected: None Encoding: 1000 bbb0 kkkk kkkk Description: Bit ‘b’ of the register indicated by FSR2, offset by the value ‘k’, is set. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: BSF [FLAG_OFST], 7 Before Instruction FLAG_OFST = 0Ah FSR2 = 0A00h Contents of 0A0Ah = 55h After Instruction Contents of 0A0Ah = D5h SETF Set Indexed (Indexed Literal Offset mode) Syntax: SETF [k] Operands: 0 ≤ k ≤ 95 Operation: FFh → ((FSR2) + k) Status Affected: None Encoding: 0110 1000 kkkk kkkk Description: The contents of the register indicated by FSR2, offset by ‘k’, are set to FFh. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write register Example: SETF [OFST] Before Instruction OFST = 2Ch FSR2 = 0A00h Contents of 0A2Ch = 00h After Instruction Contents of 0A2Ch = FFh PIC18F2420/2520/4420/4520 DS39631E-page 316 © 2008 Microchip Technology Inc. 24.2.5 SPECIAL CONSIDERATIONS WITH MICROCHIP MPLAB® IDE TOOLS The latest versions of Microchip’s software tools have been designed to fully support the extended instruction set of the PIC18F2420/2520/4420/4520 family of devices. This includes the MPLAB C18 C compiler, MPASM assembly language and MPLAB Integrated Development Environment (IDE). When selecting a target device for software development, MPLAB IDE will automatically set default Configuration bits for that device. The default setting for the XINST Configuration bit is ‘0’, disabling the extended instruction set and Indexed Literal Offset Addressing mode. For proper execution of applications developed to take advantage of the extended instruction set, XINST must be set during programming. To develop software for the extended instruction set, the user must enable support for the instructions and the Indexed Addressing mode in their language tool(s). Depending on the environment being used, this may be done in several ways: • A menu option, or dialog box within the environment, that allows the user to configure the language tool and its settings for the project • A command line option • A directive in the source code These options vary between different compilers, assemblers and development environments. Users are encouraged to review the documentation accompanying their development systems for the appropriate information. © 2008 Microchip Technology Inc. DS39631E-page 317 PIC18F2420/2520/4420/4520 25.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 25.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. PIC18F2420/2520/4420/4520 DS39631E-page 318 © 2008 Microchip Technology Inc. 25.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 25.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 25.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 25.5 MPLAB ASM30 Assembler, Linker and Librarian MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire dsPIC30F instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility 25.6 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. © 2008 Microchip Technology Inc. DS39631E-page 319 PIC18F2420/2520/4420/4520 25.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 25.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The MPLAB REAL ICE probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with the popular MPLAB ICD 2 system (RJ11) or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection (CAT5). MPLAB REAL ICE is field upgradeable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 25.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 25.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. PIC18F2420/2520/4420/4520 DS39631E-page 320 © 2008 Microchip Technology Inc. 25.11 PICSTART Plus Development Programmer The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. 25.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer and selected Flash device debugger with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. 25.13 Demonstration, Development and Evaluation Boards A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. © 2008 Microchip Technology Inc. DS39631E-page 321 PIC18F2420/2520/4420/4520 26.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V Voltage on MCLR with respect to VSS (Note 2) ......................................................................................... 0V to +13.25V Total power dissipation (Note 1) ...............................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) .............................................................................................................. ±20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports ..................................................................................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL) 2: Voltage spikes below VSS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP/ RE3 pin, rather than pulling this pin directly to VSS. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIC18F2420/2520/4420/4520 DS39631E-page 322 © 2008 Microchip Technology Inc. FIGURE 26-1: PIC18F2420/2520/4420/4520 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) FIGURE 26-2: PIC18F2420/2520/4420/4520 VOLTAGE-FREQUENCY GRAPH (EXTENDED) Frequency Voltage 6.0V 5.5V 4.5V 4.0V 2.0V 40 MHz 5.0V 3.5V 3.0V 2.5V 4.2V PIC18F2420/2520/4420/4520 Frequency Voltage 6.0V 5.5V 4.5V 4.0V 2.0V 25 MHz 5.0V 3.5V 3.0V 2.5V 4.2V PIC18F2420/2520/4420/4520 © 2008 Microchip Technology Inc. DS39631E-page 323 PIC18F2420/2520/4420/4520 FIGURE 26-3: PIC18LF2420/2520/4420/4520 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) Frequency Voltage 6.0V 5.5V 4.5V 4.0V 2.0V 40 MHz 5.0V 3.5V 3.0V 2.5V FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz Note: VDDAPPMIN is the minimum voltage of the PIC® device in the application. 4 MHz 4.2V PIC18LF2420/2520/4420/4520 PIC18F2420/2520/4420/4520 DS39631E-page 324 © 2008 Microchip Technology Inc. 26.1 DC Characteristics: Supply Voltage PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Symbol Characteristic Min Typ Max Units Conditions D001 VDD Supply Voltage PIC18LF2X2X/4X20 2.0 — 5.5 V HS, XT, RC and LP Oscillator mode PIC18F2X20/4X20 4.2 — 5.5 V D002 VDR RAM Data Retention Voltage(1) 1.5 — — V D003 VPOR VDD Start Voltage to Ensure Internal Power-on Reset Signal — — 0.7 V See section on Power-on Reset for details D004 SVDD VDD Rise Rate to Ensure Internal Power-on Reset Signal 0.05 — — V/ms See section on Power-on Reset for details VBOR Brown-out Reset Voltage D005 PIC18LF2X2X/4X20 BORV<1:0> = 11 2.00 2.11 2.22 V BORV<1:0> = 10 2.65 2.79 2.93 V D005 All Devices BORV<1:0> = 01(2) 4.11 4.33 4.55 V BORV<1:0> = 00 4.36 4.59 4.82 V Legend: Shading of rows is to assist in readability of the table. Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data. 2: With BOR enabled, full-speed operation (FOSC = 40 MHz) is supported until a BOR occurs. This is valid although VDD may be below the minimum voltage for this frequency. © 2008 Microchip Technology Inc. DS39631E-page 325 PIC18F2420/2520/4420/4520 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Power-Down Current (IPD) (1) PIC18LF2X2X/4X20 0.1 0.5 μA -40°C VDD = 2.0V (Sleep mode) 0.1 0.5 μA +25°C 0.2 2.5 μA +85°C PIC18LF2X2X/4X20 0.1 0.7 μA -40°C VDD = 3.0V (Sleep mode) 0.1 0.7 μA +25°C 0.3 3.5 μA +85°C All devices 0.1 1.0 μA -40°C VDD = 5.0V (Sleep mode) 0.2 1.0 μA +25°C 0.7 10 μA +85°C Extended devices only 10 100 μA +125°C Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631E-page 326 © 2008 Microchip Technology Inc. Supply Current (IDD) (2) PIC18LF2X2X/4X20 13 25 μA -40°C VDD = 2.0V FOSC = 31 kHz (RC_RUN mode, INTRC source) 13 22 μA +25°C 14 25 μA +85°C PIC18LF2X2X/4X20 42 61 μA -40°C 34 46 μA +25°C VDD = 3.0V 28 45 μA +85°C All devices 103 160 μA -40°C VDD = 5.0V 82 130 μA +25°C 67 120 μA +85°C Extended devices only 71 230 μA +125°C PIC18LF2X2X/4X20 320 440 μA -40°C VDD = 2.0V FOSC = 1 MHz (RC_RUN mode, INTOSC source) 330 440 μA +25°C 330 440 μA +85°C PIC18LF2X2X/4X20 630 800 μA -40°C 590 720 μA +25°C VDD = 3.0V 570 700 μA +85°C All devices 1.2 1.6 mA -40°C VDD = 5.0V 1.0 1.5 mA +25°C 1.0 1.5 mA +85°C Extended devices only 1.0 1.5 mA +125°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2008 Microchip Technology Inc. DS39631E-page 327 PIC18F2420/2520/4420/4520 Supply Current (IDD) (2) PIC18LF2X2X/4X20 0.8 1.1 mA -40°C VDD = 2.0V FOSC = 4 MHz (RC_RUN mode, INTOSC source) 0.8 1.1 mA +25°C 0.8 1.1 mA +85°C PIC18LF2X2X/4X20 1.3 1.7 mA -40°C 1.3 1.7 mA +25°C VDD = 3.0V 1.3 1.7 mA +85°C All devices 2.5 3.5 mA -40°C VDD = 5.0V 2.5 3.5 mA +25°C 2.5 3.5 mA +85°C Extended devices only 2.5 3.5 mA +125°C PIC18LF2X2X/4X20 2.9 5 μA -40°C VDD = 2.0V FOSC = 31 kHz (RC_IDLE mode, INTRC source) 3.1 5 μA +25°C 3.6 9.5 μA +85°C PIC18LF2X2X/4X20 4.5 8 μA -40°C 4.8 8 μA +25°C VDD = 3.0V 5.8 15 μA +85°C All devices 9.2 16 μA -40°C VDD = 5.0V 9.8 16 μA +25°C 11.0 35 μA +85°C Extended devices only 21 160 μA +125°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631E-page 328 © 2008 Microchip Technology Inc. Supply Current (IDD) (2) PIC18LF2X2X/4X20 165 250 μA -40°C VDD = 2.0V FOSC = 1 MHz (RC_IDLE mode, INTOSC source) 175 250 μA +25°C 190 270 μA +85°C PIC18LF2X2X/4X20 250 360 μA -40°C 270 360 μA +25°C VDD = 3.0V 290 380 μA +85°C All devices 500 700 μA -40°C VDD = 5.0V 520 700 μA +25°C 550 700 μA +85°C Extended devices only 0.6 1 mA +125°C PIC18LF2X2X/4X20 340 500 μA -40°C VDD = 2.0V FOSC = 4 MHz (RC_IDLE mode, INTOSC source) 350 500 μA +25°C 360 500 μA +85°C PIC18LF2X2X/4X20 520 800 μA -40°C 540 800 μA +25°C VDD = 3.0V 580 850 μA +85°C All devices 1.0 1.6 mA -40°C VDD = 5.0V 1.1 1.4 mA +25°C 1.1 1.4 mA +85°C Extended devices only 1.1 2.0 mA +125°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2008 Microchip Technology Inc. DS39631E-page 329 PIC18F2420/2520/4420/4520 Supply Current (IDD) (2) PIC18LF2X2X/4X20 250 350 μA -40°C VDD = 2.0V FOSC = 1 MHZ (PRI_RUN, EC oscillator) 260 350 μA +25°C 250 350 μA +85°C PIC18LF2X2X/4X20 550 650 μA -40°C 480 640 μA +25°C VDD = 3.0V 460 600 μA +85°C All devices 1.2 1.5 mA -40°C VDD = 5.0V 1.1 1.4 mA +25°C 1.0 1.3 mA +85°C Extended devices only 1.0 3.0 mA +125°C PIC18LF2X2X/4X20 0.72 1.0 mA -40°C VDD = 2.0V FOSC = 4 MHz (PRI_RUN, EC oscillator) 0.74 1.0 mA +25°C 0.74 1.0 mA +85°C PIC18LF2X2X/4X20 1.3 1.8 mA -40°C 1.3 1.8 mA +25°C VDD = 3.0V 1.3 1.8 mA +85°C All devices 2.7 4.0 mA -40°C VDD = 5.0V 2.6 4.0 mA +25°C 2.5 4.0 mA +85°C Extended devices only 2.6 5.0 mA +125°C Extended devices only 8.4 13 mA +125°C VDD = 4.2V FOSC = 25 MHz (PRI_RUN, EC oscillator) 11 16 mA +125°C VDD = 5.0V All devices 15 20 mA -40°C VDD = 4.2V FOSC = 40 MHZ (PRI_RUN, EC oscillator) 15 20 mA +25°C 15 20 mA +85°C All devices 20 25 mA -40°C 20 25 mA +25°C VDD = 5.0V 20 25 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631E-page 330 © 2008 Microchip Technology Inc. Supply Current (IDD) (2) All devices 7.5 10 mA -40°C VDD = 4.2V FOSC = 4 MHZ, 16 MHz internal (PRI_RUN HS+PLL) 7.4 10 mA +25°C 7.3 10 mA +85°C Extended devices only 8.0 12 mA +125°C All devices 10 12 mA -40°C VDD = 5.0V FOSC = 4 MHZ, 16 MHz internal (PRI_RUN HS+PLL) 10 12 mA +25°C 9.7 12 mA +85°C Extended devices only 10 14 mA +125°C All devices 15 20 mA -40°C VDD = 4.2V FOSC = 10 MHZ, 40 MHz internal (PRI_RUN HS+PLL) 15 20 mA +25°C 15 20 mA +85°C All devices 20 25 mA -40°C VDD = 5.0V FOSC = 10 MHZ, 40 MHz internal (PRI_RUN HS+PLL) 20 25 mA +25°C 20 25 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2008 Microchip Technology Inc. DS39631E-page 331 PIC18F2420/2520/4420/4520 Supply Current (IDD) (2) PIC18LF2X2X/4X20 65 100 μA -40°C VDD = 2.0V FOSC = 1 MHz (PRI_IDLE mode, EC oscillator) 65 100 μA +25°C 70 110 μA +85°C PIC18LF2X2X/4X20 120 140 μA -40°C 120 140 μA +25°C VDD = 3.0V 130 160 μA +85°C All devices 230 300 μA -40°C VDD = 5.0V 235 300 μA +25°C 240 300 μA +85°C Extended devices only 260 500 μA +125°C PIC18LF2X2X/4X20 260 360 μA -40°C VDD = 2.0V FOSC = 4 MHz (PRI_IDLE mode, EC oscillator) 255 360 μA +25°C 270 360 μA +85°C PIC18LF2X2X/4X20 420 620 μA -40°C 430 620 μA +25°C VDD = 3.0V 450 650 μA +85°C All devices 0.9 1.2 mA -40°C VDD = 5.0V 0.9 1.2 mA +25°C 0.9 1.2 mA +85°C Extended devices only 1 1.3 mA +125°C Extended devices only 2.8 6.0 mA +125°C VDD = 4.2V FOSC = 25 MHz (PRI_IDLE mode, EC oscillator) 4.3 8.0 mA +125°C VDD = 5.0V All devices 6.0 10 mA -40°C VDD = 4.2V FOSC = 40 MHz (PRI_IDLE mode, EC oscillator) 6.2 10 mA +25°C 6.6 10 mA +85°C All devices 8.1 13 mA -40°C 9.1 12 mA +25°C VDD = 5.0V 8.3 12 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631E-page 332 © 2008 Microchip Technology Inc. Supply Current (IDD) (2) PIC18LF2X2X/4X20 10 25 μA -40°C(3) VDD = 2.0V FOSC = 32 kHz(3) (SEC_RUN mode, Timer1 as clock) 11 21 μA +25°C 12 25 μA +85°C PIC18LF2X2X/4X20 42 57 μA -40°C(3) 33 45 μA +25°C VDD = 3.0V 29 45 μA +85°C All devices 105 150 μA -40°C(3) 81 130 μA +25°C VDD = 5.0V 67 130 μA +85°C PIC18LF2X2X/4X20 3.0 12 μA -40°C(3) VDD = 2.0V FOSC = 32 kHz(3) (SEC_IDLE mode, Timer1 as clock) 3.0 6 μA +25°C 3.7 10 μA +85°C PIC18LF2X2X/4X20 5.0 15 μA -40°C(3) 5.4 10 μA +25°C VDD = 3.0V 6.3 15 μA +85°C All devices 8.5 25 μA -40°C(3) 9.0 20 μA +25°C VDD = 5.0V 10.5 30 μA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2008 Microchip Technology Inc. DS39631E-page 333 PIC18F2420/2520/4420/4520 Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD) D026 (ΔIAD) A/D Converter 0.2 1.0 μA -40°C to +85°C VDD = 2.0V A/D on, not converting 0.2 1.0 μA -40°C to +85°C VDD = 3.0V 0.2 1.0 μA -40°C to +85°C VDD = 5.0V 0.5 4.0 μA -40°C to +125°C D022 (ΔIWDT) Watchdog Timer 1.3 2.2 μA -40°C 1.4 2.2 μA +25°C VDD = 2.0V 1.6 2.3 μA +85°C 1.9 3.5 μA -40°C 2.0 3.5 μA +25°C VDD = 3.0V 2.2 3.5 μA +85°C 3.0 7.5 μA -40°C VDD = 5.0V 3.5 7.5 μA +25°C 3.5 7.8 μA +85°C 4.0 10 μA +125°C D022A (ΔIBOR) Brown-out Reset(4) 35 50 μA -40°C to +85°C VDD = 3.0V 40 55 μA -40°C to +85°C VDD = 5.0V 55 65 μA -40°C to +125°C 0 2 μA -40°C to +85°C Sleep mode, 0 5 μA -40°C to +125°C BOREN<1:0> = 10 D022B (ΔILVD) High/Low-Voltage Detect(4) 22 38 μA -40°C to +85°C VDD = 2.0V 25 40 μA -40°C to +85°C VDD = 3.0V 29 45 μA -40°C to +85°C VDD = 5.0V 30 45 μA -40°C to +125°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631E-page 334 © 2008 Microchip Technology Inc. D025L (ΔIOSCB) Timer1 Oscillator 4.5 9.0 μA -40°C(3) VDD = 2.0V 32 kHz on Timer1 0.9 1.6 μA -10°C 0.9 1.6 μA +25°C 0.9 1.8 μA +85°C 4.8 10 μA -40°C(3) VDD = 3.0V 32 kHz on Timer1 1.0 2.0 μA -10°C 1.0 2.0 μA +25°C 1.0 2.6 μA +85°C 6.0 11 μA -40°C(3) VDD = 5.0V 32 kHz on Timer1 1.6 4.0 μA -10°C 1.6 4.0 μA +25°C 1.6 4.0 μA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2008 Microchip Technology Inc. DS39631E-page 335 PIC18F2420/2520/4420/4520 26.3 DC Characteristics: PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Symbol Characteristic Min Max Units Conditions VIL Input Low Voltage I/O Ports: D030 with TTL Buffer VSS 0.15 VDD V VDD < 4.5V D030A — 0.8 V 4.5V ≤ VDD ≤ 5.5V D031 with Schmitt Trigger Buffer VSS 0.2 VDD V D031A RC3 and RC4 VSS 0.3 VDD V I2C™ enabled D031B VSS 0.8 V SMBus enabled D032 MCLR VSS 0.2 VDD V D033 OSC1 VSS 0.3 VDD V HS, HSPLL modes D033A D033B D034 OSC1 OSC1 T13CKI VSS VSS VSS 0.2 VDD 0.3 0.3 V V V RC, EC modes(1) XT, LP modes VIH Input High Voltage I/O Ports: D040 with TTL Buffer 0.25 VDD + 0.8V VDD V VDD < 4.5V D040A 2.0 VDD V 4.5V ≤ VDD ≤ 5.5V D041 with Schmitt Trigger Buffer 0.8 VDD VDD V D041A RC3 and RC4 0.7 VDD VDD V I2C enabled D041B 2.1 VDD V SMBus enabled D042 MCLR 0.8 VDD VDD V D043 OSC1 0.7 VDD VDD V HS, HSPLL modes D043A D043B D043C D044 OSC1 OSC1 OSC1 T13CKI 0.8 VDD 0.9 VDD 1.6 1.6 VDD VDD VDD VDD V V V V EC mode RC mode(1) XT, LP modes IIL Input Leakage Current(2,3) D060 I/O Ports — ±200 ±50 nA nA VDD < 5.5V, VSS ≤ VPIN ≤ VDD, Pin at high-impedance VDD < 3V, VSS ≤ VPIN ≤ VDD, Pin at high-impedance D061 MCLR — ±1 μA Vss ≤ VPIN ≤ VDD D063 OSC1 — ±1 μA Vss ≤ VPIN ≤ VDD IPU Weak Pull-up Current D070 IPURB PORTB Weak Pull-up Current 50 400 μA VDD = 5V, VPIN = VSS Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC® device be driven with an external clock while in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. PIC18F2420/2520/4420/4520 DS39631E-page 336 © 2008 Microchip Technology Inc. VOL Output Low Voltage D080 I/O Ports — 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40°C to +85°C D083 OSC2/CLKO (RC, RCIO, EC, ECIO modes) — 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40°C to +85°C VOH Output High Voltage(3) D090 I/O Ports VDD – 0.7 — V IOH = -3.0 mA, VDD = 4.5V, -40°C to +85°C D092 OSC2/CLKO (RC, RCIO, EC, ECIO modes) VDD – 0.7 — V IOH = -1.3 mA, VDD = 4.5V, -40°C to +85°C Capacitive Loading Specs on Output Pins D100 COSC2 OSC2 pin — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101 CIO All I/O pins and OSC2 (in RC mode) — 50 pF To meet the AC Timing Specifications D102 CB SCL, SDA — 400 pF I2C™ Specification 26.3 DC Characteristics: PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Symbol Characteristic Min Max Units Conditions Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC® device be driven with an external clock while in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. © 2008 Microchip Technology Inc. DS39631E-page 337 PIC18F2420/2520/4420/4520 TABLE 26-1: MEMORY PROGRAMMING REQUIREMENTS DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Sym Characteristic Min Typ† Max Units Conditions Data EEPROM Memory D120 ED Byte Endurance 100K 1M — E/W -40°C to +85°C D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write VMIN = Minimum operating voltage D122 TDEW Erase/Write Cycle Time — 4 — ms D123 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated D124 TREF Number of Total Erase/Write Cycles before Refresh(1) 1M 10M — E/W -40°C to +85°C D125 IDDP Supply Current during Programming — 10 — mA Program Flash Memory D130 EP Cell Endurance 10K 100K — E/W -40°C to +85°C D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating voltage D132 VIE VDD for Block Erase 3.0 — 5.5 V Using ICSP™ port, +25°C D132A VIW VDD for Externally Timed Erase or Write 4.5 — 5.5 V Using ICSP™ port, +25°C D132B VPEW VDD for Self-Timed Write VMIN — 5.5 V VMIN = Minimum operating voltage D133 TIE ICSP Block Erase Cycle Time — 4 — ms VDD ≥ 4.5V D133A TIW ICSP Erase or Write Cycle Time (externally timed) 1 — — ms VDD ≥ 4.5V, +25°C D133A TIW Self-Timed Write Cycle Time — 2 — ms D134 TRETD Characteristic Retention 40 100 — Year Provided no other specifications are violated D135 IDDP Supply Current during Programming — 10 — mA † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Refer to Section 7.8 “Using the Data EEPROM” for a more detailed discussion on data EEPROM endurance. PIC18F2420/2520/4420/4520 DS39631E-page 338 © 2008 Microchip Technology Inc. TABLE 26-2: COMPARATOR SPECIFICATIONS TABLE 26-3: VOLTAGE REFERENCE SPECIFICATIONS Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated). Param No. Sym Characteristics Min Typ Max Units Comments D300 VIOFF Input Offset Voltage — ±5.0 ±10 mV D301 VICM Input Common Mode Voltage 0 — VDD – 1.5 V D302 CMRR Common Mode Rejection Ratio 55 — — dB 300 TRESP Response Time(1) — 150 400 ns PIC18FXXXX 300A — 150 600 ns PIC18LFXXXX, VDD = 2.0V 301 TMC2OV Comparator Mode Change to Output Valid — — 10 μs Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions from VSS to VDD. Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated). Param No. Sym Characteristics Min Typ Max Units Comments D310 VRES Resolution VDD/24 — VDD/32 LSb D311 VRAA Absolute Accuracy — — 1/2 LSb D312 VRUR Unit Resistor Value (R) — 2k — Ω 310 TSET Settling Time(1) — — 10 μs Note 1: Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from ‘0000’ to ‘1111’. © 2008 Microchip Technology Inc. DS39631E-page 339 PIC18F2420/2520/4420/4520 FIGURE 26-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS TABLE 26-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Sym Characteristic Min Typ Max Units Conditions D420 HLVD Voltage on VDD Transition High-to-Low HLVDL<3:0> = 0000 2.06 2.17 2.28 V HLVDL<3:0> = 0001 2.12 2.23 2.34 V HLVDL<3:0> = 0010 2.24 2.36 2.48 V HLVDL<3:0> = 0011 2.32 2.44 2.56 V HLVDL<3:0> = 0100 2.47 2.60 2.73 V HLVDL<3:0> = 0101 2.65 2.79 2.93 V HLVDL<3:0> = 0110 2.74 2.89 3.04 V HLVDL<3:0> = 0111 2.96 3.12 3.28 V HLVDL<3:0> = 1000 3.22 3.39 3.56 V HLVDL<3:0> = 1001 3.37 3.55 3.73 V HLVDL<3:0> = 1010 3.52 3.71 3.90 V HLVDL<3:0> = 1011 3.70 3.90 4.10 V HLVDL<3:0> = 1100 3.90 4.11 4.32 V HLVDL<3:0> = 1101 4.11 4.33 4.55 V HLVDL<3:0> = 1110 4.36 4.59 4.82 V VLVD HLVDIF(1) VDD (HLVDIF set by hardware) (HLVDIF can be cleared in software) Note 1: VDIRMAG = 0. PIC18F2420/2520/4420/4520 DS39631E-page 340 © 2008 Microchip Technology Inc. 26.4 AC (Timing) Characteristics 26.4.1 TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created using one of the following formats: 1. TppS2ppS 3. TCC:ST (I2C specifications only) 2. TppS 4. Ts (I2C specifications only) T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKO rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O port t1 T13CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance I 2C only AA output access High High BUF Bus free Low Low TCC:ST (I2C specifications only) CC HD Hold SU Setup ST DAT DATA input hold STO Stop condition STA Start condition © 2008 Microchip Technology Inc. DS39631E-page 341 PIC18F2420/2520/4420/4520 26.4.2 TIMING CONDITIONS The temperature and voltages specified in Table 26-5 apply to all timing specifications unless otherwise noted. Figure 26-5 specifies the load conditions for the timing specifications. TABLE 26-5: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC FIGURE 26-5: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Note: Because of space limitations, the generic terms “PIC18FXXXX” and “PIC18LFXXXX” are used throughout this section to refer to the PIC18F2420/2520/4420/4520 and PIC18LF2420/2520/4420/4520 families of devices specifically and only those devices. AC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Operating voltage VDD range as described in DC specification Section 26.1 and Section 26.3. LF parts operate for industrial temperatures only. VDD/2 CL RL Pin Pin VSS VSS CL RL = 464Ω CL = 50 pF for all pins except OSC2/CLKO and including D and E outputs as ports Load Condition 1 Load Condition 2 PIC18F2420/2520/4420/4520 DS39631E-page 342 © 2008 Microchip Technology Inc. 26.4.3 TIMING DIAGRAMS AND SPECIFICATIONS FIGURE 26-6: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL) TABLE 26-6: EXTERNAL CLOCK TIMING REQUIREMENTS Param. No. Symbol Characteristic Min Max Units Conditions 1A FOSC External CLKI Frequency(1) DC 1 MHz XT, RC Oscillator mode DC 25 MHz HS Oscillator mode DC 31.25 kHz LP Oscillator mode DC 40 MHz EC Oscillator mode Oscillator Frequency(1) DC 4 MHz RC Oscillator mode 0.1 4 MHz XT Oscillator mode 4 25 MHz HS Oscillator mode 4 10 MHz HS + PLL Oscillator mode 5 200 kHz LP Oscillator mode 1 TOSC External CLKI Period(1) 1000 — ns XT, RC Oscillator mode 40 — ns HS Oscillator mode 32 — μs LP Oscillator mode 25 — ns EC Oscillator mode Oscillator Period(1) 250 — ns RC Oscillator mode 0.25 10 μs XT Oscillator mode 40 250 ns HS Oscillator mode 100 250 ns HS + PLL Oscillator mode 5 200 μs LP Oscillator mode 2 TCY Instruction Cycle Time(1) 100 — ns TCY = 4/FOSC, Industrial 160 — ns TCY = 4/FOSC, Extended 3 TOSL, TOSH External Clock in (OSC1) High or Low Time 30 — ns XT Oscillator mode 2.5 — μs LP Oscillator mode 10 — ns HS Oscillator mode 4 TOSR, TOSF External Clock in (OSC1) Rise or Fall Time — 20 ns XT Oscillator mode — 50 ns LP Oscillator mode — 7.5 ns HS Oscillator mode Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations except PLL. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices. OSC1 CLKO Q4 Q1 Q2 Q3 Q4 Q1 1 2 3 3 4 4 © 2008 Microchip Technology Inc. DS39631E-page 343 PIC18F2420/2520/4420/4520 TABLE 26-7: PLL CLOCK TIMING SPECIFICATIONS (VDD = 4.2V TO 5.5V) TABLE 26-8: AC CHARACTERISTICS: INTERNAL RC ACCURACY PIC18F2420/2520/4420/4520 (INDUSTRIAL) PIC18LF2420/2520/4420/4520 (INDUSTRIAL) Param No. Sym Characteristic Min Typ† Max Units Conditions F10 FOSC Oscillator Frequency Range 4 — 10 MHz HS mode only F11 FSYS On-Chip VCO System Frequency 16 — 40 MHz HS mode only F12 trc PLL Start-up Time (Lock Time) — — 2 ms F13 ΔCLK CLKO Stability (Jitter) -2 — +2 % † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Device Min Typ Max Units Conditions INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz, 31 kHz(1) PIC18LF2420/2520/4420/4520 -2 +/-1 2 % +25°C VDD = 2.7-3.3V -5 +/-1 5 % -40°C to +85°C VDD = 2.7-3.3V PIC18F2420/2520/4420/4520 -2 +/-1 2 % +25°C VDD = 4.5-5.5V -5 +/-1 5 % -40°C to +85°C VDD = 4.5-5.5V INTRC Accuracy @ Freq = 31 kHz PIC18LF2420/2520/4420/4520 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3V PIC18F2420/2520/4420/4520 26.562 — 35.938 kHz -40°C to +85°C VDD = 4.5-5.5V Legend: Shading of rows is to assist in readability of the table. Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift. PIC18F2420/2520/4420/4520 DS39631E-page 344 © 2008 Microchip Technology Inc. FIGURE 26-7: CLKO AND I/O TIMING TABLE 26-9: CLKO AND I/O TIMING REQUIREMENTS Param No. Symbol Characteristic Min Typ Max Units Conditions 10 TosH2ckL OSC1 ↑ to CLKO ↓ — 75 200 ns (Note 1) 11 TosH2ckH OSC1 ↑ to CLKO ↑ — 75 200 ns (Note 1) 12 TckR CLKO Rise Time — 35 100 ns (Note 1) 13 TckF CLKO Fall Time — 35 100 ns (Note 1) 14 TckL2ioV CLKO ↓ to Port Out Valid — — 0.5 TCY + 20 ns (Note 1) 15 TioV2ckH Port In Valid before CLKO ↑ 0.25 TCY + 25 — — ns (Note 1) 16 TckH2ioI Port In Hold after CLKO ↑ 0 — — ns (Note 1) 17 TosH2ioV OSC1 ↑ (Q1 cycle) to Port Out Valid — 50 150 ns 18 TosH2ioI OSC1 ↑ (Q2 cycle) to Port Input Invalid (I/O in hold time) PIC18FXXXX 100 — — ns 18A PIC18LFXXXX 200 — — ns VDD = 2.0V 19 TioV2osH Port Input Valid to OSC1 ↑ (I/O in setup time) 0 — — ns 20 TioR Port Output Rise Time PIC18FXXXX — 10 25 ns 20A PIC18LFXXXX — — 60 ns VDD = 2.0V 21 TioF Port Output Fall Time PIC18FXXXX — 10 25 ns 21A PIC18LFXXXX — — 60 ns VDD = 2.0V 22† TINP INTx pin High or Low Time TCY — — ns 23† TRBP RB<7:4> Change INTx High or Low Time TCY — — ns † These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC. Note: Refer to Figure 26-5 for load conditions. OSC1 CLKO I/O pin (Input) I/O pin (Output) Q4 Q1 Q2 Q3 10 13 14 17 20, 21 19 18 15 11 12 16 Old Value New Value © 2008 Microchip Technology Inc. DS39631E-page 345 PIC18F2420/2520/4420/4520 FIGURE 26-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING FIGURE 26-9: BROWN-OUT RESET TIMING TABLE 26-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET REQUIREMENTS Param. No. Symbol Characteristic Min Typ Max Units Conditions 30 TmcL MCLR Pulse Width (low) 2 — — μs 31 TWDT Watchdog Timer Time-out Period (no postscaler) 3.4 4.1 4.71 ms 32 TOST Oscillation Start-up Timer Period 1024 TOSC — 1024 TOSC — TOSC = OSC1 period 33 TPWRT Power-up Timer Period 55.6 65.5 75.4 ms 34 TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset —2— μs 35 TBOR Brown-out Reset Pulse Width 200 — — μs VDD ≤ BVDD (see D005) 36 TIRVST Time for Internal Reference Voltage to become Stable — 20 50 μs 37 TLVD High/Low-Voltage Detect Pulse Width 200 — — μs VDD ≤ VLVD 38 TCSD CPU Start-up Time — 10 — μs 39 TIOBST Time for INTOSC to Stabilize — 1 — μs VDD MCLR Internal POR PWRT Time-out OSC Time-out Internal Reset Watchdog Timer Reset 33 32 30 31 34 I/O pins 34 Note: Refer to Figure 26-5 for load conditions. VDD BVDD 35 VIRVST Enable Internal Internal Reference 36 Reference Voltage Voltage Stable PIC18F2420/2520/4420/4520 DS39631E-page 346 © 2008 Microchip Technology Inc. FIGURE 26-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS TABLE 26-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Param No. Symbol Characteristic Min Max Units Conditions 40 Tt0H T0CKI High Pulse Width No prescaler 0.5 TCY + 20 — ns With prescaler 10 — ns 41 Tt0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 — ns With prescaler 10 — ns 42 Tt0P T0CKI Period No prescaler TCY + 10 — ns With prescaler Greater of: 20 ns or (TCY + 40)/N — ns N = prescale value (1, 2, 4,..., 256) 45 Tt1H T13CKI High Time Synchronous, no prescaler 0.5 TCY + 20 — ns Synchronous, with prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 25 — ns VDD = 2.0V Asynchronous PIC18FXXXX 30 — ns PIC18LFXXXX 50 — ns VDD = 2.0V 46 Tt1L T13CKI Low Time Synchronous, no prescaler 0.5 TCY + 5 — ns Synchronous, with prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 25 — ns VDD = 2.0V Asynchronous PIC18FXXXX 30 — ns PIC18LFXXXX 50 — ns VDD = 2.0V 47 Tt1P T13CKI Input Period Synchronous Greater of: 20 ns or (TCY + 40)/N — ns N = prescale value (1, 2, 4, 8) Asynchronous 60 — ns Ft1 T13CKI Oscillator Input Frequency Range DC 50 kHz 48 Tcke2tmrI Delay from External T13CKI Clock Edge to Timer Increment 2 TOSC 7 TOSC — Note: Refer to Figure 26-5 for load conditions. 46 47 45 48 41 42 40 T0CKI T1OSO/T13CKI TMR0 or TMR1 © 2008 Microchip Technology Inc. DS39631E-page 347 PIC18F2420/2520/4420/4520 FIGURE 26-11: CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES) TABLE 26-12: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES) Param No. Symbol Characteristic Min Max Units Conditions 50 TccL CCPx Input Low Time No prescaler 0.5 TCY + 20 — ns With prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 20 — ns VDD = 2.0V 51 TccH CCPx Input High Time No prescaler 0.5 TCY + 20 — ns With prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 20 — ns VDD = 2.0V 52 TccP CCPx Input Period 3 TCY + 40 N — ns N = prescale value (1, 4 or 16) 53 TccR CCPx Output Fall Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 54 TccF CCPx Output Fall Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V Note: Refer to Figure 26-5 for load conditions. CCPx (Capture Mode) 50 51 52 CCPx 53 54 (Compare or PWM Mode) PIC18F2420/2520/4420/4520 DS39631E-page 348 © 2008 Microchip Technology Inc. FIGURE 26-12: PARALLEL SLAVE PORT TIMING (PIC18F4420/4520) TABLE 26-13: PARALLEL SLAVE PORT REQUIREMENTS (PIC18F4420, PIC18F4520) Param. No. Symbol Characteristic Min Max Units Conditions 62 TdtV2wrH Data In Valid before WR ↑ or CS ↑ (setup time) 20 — ns 63 TwrH2dtI WR ↑ or CS ↑ to Data–In Invalid (hold time) PIC18FXXXX 20 — ns PIC18LFXXXX 35 — ns VDD = 2.0V 64 TrdL2dtV RD ↓ and CS ↓ to Data–Out Valid — 80 ns 65 TrdH2dtI RD ↑ or CS ↓ to Data–Out Invalid 10 30 ns 66 TibfINH Inhibit of the IBF Flag bit being Cleared from WR ↑ or CS ↑ — 3 TCY Note: Refer to Figure 26-5 for load conditions. RE2/CS RE0/RD RE1/WR RD<7:0> 62 63 64 65 © 2008 Microchip Technology Inc. DS39631E-page 349 PIC18F2420/2520/4420/4520 FIGURE 26-13: EXAMPLE SPI MASTER MODE TIMING (CKE = 0) TABLE 26-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0) Param No. Symbol Characteristic Min Max Units Conditions 70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input TCY — ns 73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 20 — ns 73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 40 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 79 TscF SCK Output Fall Time (Master mode) — 25 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 70 71 72 73 74 75, 76 79 78 80 78 79 MSb LSb bit 6 - - - - - -1 MSb In bit 6 - - - -1 LSb In Note: Refer to Figure 26-5 for load conditions. PIC18F2420/2520/4420/4520 DS39631E-page 350 © 2008 Microchip Technology Inc. FIGURE 26-14: EXAMPLE SPI MASTER MODE TIMING (CKE = 1) TABLE 26-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1) Param. No. Symbol Characteristic Min Max Units Conditions 73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 20 — ns 73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 40 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 79 TscF SCK Output Fall Time (Master mode) — 25 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V 81 TdoV2scH, TdoV2scL SDO Data Output Setup to SCK Edge TCY — ns Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 81 71 72 74 75, 76 78 80 MSb 79 73 MSb In bit 6 - - - - - -1 bit 6 - - - -1 LSb In LSb Note: Refer to Figure 26-5 for load conditions. © 2008 Microchip Technology Inc. DS39631E-page 351 PIC18F2420/2520/4420/4520 FIGURE 26-15: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0) TABLE 26-16: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0) Param No. Symbol Characteristic Min Max Units Conditions 70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input 3 TCY — ns 71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns 71A Single Byte 40 — ns (Note 1) 72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns 72A Single Byte 40 — ns (Note 1) 73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 20 — ns 73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 40 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 77 TssH2doZ SS ↑ to SDO Output High-Impedance 10 50 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V 83 TscH2ssH, TscL2ssH SS ↑ after SCK edge 1.5 TCY + 40 — ns Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 70 71 72 73 74 75, 76 77 79 78 80 78 79 SDI MSb LSb bit 6 - - - - - -1 bit 6 - - - -1 LSb In 83 Note: Refer to Figure 26-5 for load conditions. MSb In PIC18F2420/2520/4420/4520 DS39631E-page 352 © 2008 Microchip Technology Inc. FIGURE 26-16: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1) TABLE 26-17: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1) Param No. Symbol Characteristic Min Max Units Conditions 70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input 3 TCY — ns 71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns 71A Single Byte 40 — ns (Note 1) 72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns 72A Single Byte 40 — ns (Note 1) 73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 40 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 77 TssH2doZ SS ↑ to SDO Output High-Impedance 10 50 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V 82 TssL2doV SDO Data Output Valid after SS ↓ Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V 83 TscH2ssH, TscL2ssH SS ↑ after SCK Edge 1.5 TCY + 40 — ns Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 70 71 72 82 74 75, 76 MSb bit 6 - - - - - -1 LSb 77 MSb In bit 6 - - - -1 LSb In 80 83 Note: Refer to Figure 26-5 for load conditions. © 2008 Microchip Technology Inc. DS39631E-page 353 PIC18F2420/2520/4420/4520 FIGURE 26-17: I2C™ BUS START/STOP BITS TIMING TABLE 26-18: I2C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE) FIGURE 26-18: I2C™ BUS DATA TIMING Param. No. Symbol Characteristic Min Max Units Conditions 90 TSU:STA Start Condition 100 kHz mode 4700 — ns Only relevant for Repeated Setup Time 400 kHz mode 600 — Start condition 91 THD:STA Start Condition 100 kHz mode 4000 — ns After this period, the first Hold Time 400 kHz mode 600 — clock pulse is generated 92 TSU:STO Stop Condition 100 kHz mode 4700 — ns Setup Time 400 kHz mode 600 — 93 THD:STO Stop Condition 100 kHz mode 4000 — ns Hold Time 400 kHz mode 600 — Note: Refer to Figure 26-5 for load conditions. 91 92 93 SCL SDA Start Condition Stop Condition 90 Note: Refer to Figure 26-5 for load conditions. 90 91 92 100 101 103 106 107 109 109 110 102 SCL SDA In SDA Out PIC18F2420/2520/4420/4520 DS39631E-page 354 © 2008 Microchip Technology Inc. TABLE 26-19: I2C™ BUS DATA REQUIREMENTS (SLAVE MODE) Param. No. Symbol Characteristic Min Max Units Conditions 100 THIGH Clock High Time 100 kHz mode 4.0 — μs 400 kHz mode 0.6 — μs MSSP module 1.5 TCY — 101 TLOW Clock Low Time 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs MSSP module 1.5 TCY — 102 TR SDA and SCL Rise Time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF 103 TF SDA and SCL Fall Time 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF 90 TSU:STA Start Condition Setup Time 100 kHz mode 4.7 — μs Only relevant for Repeated Start condition 400 kHz mode 0.6 — μs 91 THD:STA Start Condition Hold Time 100 kHz mode 4.0 — μs After this period, the first clock pulse is generated 400 kHz mode 0.6 — μs 106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 μs 107 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns (Note 2) 400 kHz mode 100 — ns 92 TSU:STO Stop Condition Setup Time 100 kHz mode 4.7 — μs 400 kHz mode 0.6 — μs 109 TAA Output Valid from Clock 100 kHz mode — 3500 ns (Note 1) 400 kHz mode — — ns 110 TBUF Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — μs D102 CB Bus Capacitive Loading — 400 pF Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement TSU:DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released. © 2008 Microchip Technology Inc. DS39631E-page 355 PIC18F2420/2520/4420/4520 FIGURE 26-19: MASTER SSP I2C™ BUS START/STOP BITS TIMING WAVEFORMS TABLE 26-20: MASTER SSP I2C™ BUS START/STOP BITS REQUIREMENTS FIGURE 26-20: MASTER SSP I2C™ BUS DATA TIMING Param. No. Symbol Characteristic Min Max Units Conditions 90 TSU:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Only relevant for Repeated Start condition Setup Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 91 THD:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns After this period, the first clock pulse is generated Hold Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 92 TSU:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Setup Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 93 THD:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Hold Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — Note 1: Maximum pin capacitance = 10 pF for all I2C pins. Note: Refer to Figure 26-5 for load conditions. 91 93 SCL SDA Start Condition Stop Condition 90 92 Note: Refer to Figure 26-5 for load conditions. 90 91 92 100 101 103 106 107 109 109 110 102 SCL SDA In SDA Out PIC18F2420/2520/4420/4520 DS39631E-page 356 © 2008 Microchip Technology Inc. TABLE 26-21: MASTER SSP I2C™ BUS DATA REQUIREMENTS Param. No. Symbol Characteristic Min Max Units Conditions 100 THIGH Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 102 TR SDA and SCL Rise Time 100 kHz mode — 1000 ns CB is specified to be from 10 to 400 pF 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(1) — 300 ns 103 TF SDA and SCL Fall Time 100 kHz mode — 300 ns CB is specified to be from 10 to 400 pF 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(1) — 100 ns 90 TSU:STA Start Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms Only relevant for Repeated Start condition 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 91 THD:STA Start Condition Hold Time 100 kHz mode 2(TOSC)(BRG + 1) — ms After this period, the first clock pulse is generated 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 ms 107 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns (Note 2) 400 kHz mode 100 — ns 92 TSU:STO Stop Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 109 TAA Output Valid from Clock 100 kHz mode — 3500 ns 400 kHz mode — 1000 ns 1 MHz mode(1) — — ns 110 TBUF Bus Free Time 100 kHz mode 4.7 — ms Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — ms D102 CB Bus Capacitive Loading — 400 pF Note 1: Maximum pin capacitance = 10 pF for all I2C pins. 2: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but parameter 107 ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, parameter 102 + parameter 107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the SCL line is released. © 2008 Microchip Technology Inc. DS39631E-page 357 PIC18F2420/2520/4420/4520 FIGURE 26-21: EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING TABLE 26-22: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS Param No. Symbol Characteristic Min Max Units Conditions 120 TckH2dtV SYNC XMIT (MASTER & SLAVE) Clock High to Data Out Valid PIC18FXXXX — 40 ns PIC18LFXXXX — 100 ns VDD = 2.0V 121 Tckrf Clock Out Rise Time and Fall Time (Master mode) PIC18FXXXX — 20 ns PIC18LFXXXX — 50 ns VDD = 2.0V 122 Tdtrf Data Out Rise Time and Fall Time PIC18FXXXX — 20 ns PIC18LFXXXX — 50 ns VDD = 2.0V 121 121 120 122 RC6/TX/CK RC7/RX/DT pin pin Note: Refer to Figure 26-5 for load conditions. PIC18F2420/2520/4420/4520 DS39631E-page 358 © 2008 Microchip Technology Inc. FIGURE 26-22: EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING TABLE 26-23: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS TABLE 26-24: A/D CONVERTER CHARACTERISTICS: PIC18F2420/2520/4420/4520 (INDUSTRIAL) PIC18LF2420/2520/4420/4520 (INDUSTRIAL) Param. No. Symbol Characteristic Min Max Units Conditions 125 TdtV2ckl SYNC RCV (MASTER & SLAVE) Data Hold before CK ↓ (DT hold time) 10 — ns 126 TckL2dtl Data Hold after CK ↓ (DT hold time) 15 — ns Param No. Symbol Characteristic Min Typ Max Units Conditions A01 NR Resolution — — 10 bit ΔVREF ≥ 3.0V A03 EIL Integral Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V A04 EDL Differential Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V A06 EOFF Offset Error — — <±2.0 LSb ΔVREF ≥ 3.0V A07 EGN Gain Error — — <±1 LSb ΔVREF ≥ 3.0V A10 — Monotonicity Guaranteed(1) — VSS ≤ VAIN ≤ VREF A20 ΔVREF Reference Voltage Range (VREFH – VREFL) 1.8 3 — — — — V V VDD < 3.0V VDD ≥ 3.0V A21 VREFH Reference Voltage High VSS — VREFH V A22 VREFL Reference Voltage Low VSS – 0.3V — VDD – 3.0V V A25 VAIN Analog Input Voltage VREFL — VREFH V A30 ZAIN Recommended Impedance of Analog Voltage Source — — 2.5 kΩ A40 IAD A/D Current from VDD PIC18FXXXX — 180 — μA Average current during PIC18 conversion LFXX20 — 90 — μA A50 IREF VREF Input Current(2) — — — — 5 150 μA μA During VAIN acquisition. During A/D conversion cycle. Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 2: VREFH current is from RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source. VREFL current is from RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source. 125 126 RC6/TX/CK RC7/RX/DT pin pin Note: Refer to Figure 26-5 for load conditions. © 2008 Microchip Technology Inc. DS39631E-page 359 PIC18F2420/2520/4420/4520 FIGURE 26-23: A/D CONVERSION TIMING TABLE 26-25: A/D CONVERSION REQUIREMENTS Param No. Symbol Characteristic Min Max Units Conditions 130 TAD A/D Clock Period PIC18FXXXX 0.7 25.0(1) μs TOSC based, VREF ≥ 3.0V PIC18LFXXXX 1.4 25.0(1) μs VDD = 2.0V; TOSC based, VREF full range PIC18FXXXX — 1 μs A/D RC mode PIC18LFXXXX — 3 μs VDD = 2.0V; A/D RC mode 131 TCNV Conversion Time (not including acquisition time) (Note 2) 11 12 TAD 132 TACQ Acquisition Time (Note 3) 1.4 — μs -40°C to +85°C 135 TSWC Switching Time from Convert → Sample — (Note 4) TBD TDIS Discharge Time 0.2 — μs Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider. 2: ADRES register may be read on the following TCY cycle. 3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50Ω. 4: On the following cycle of the device clock. 131 130 132 BSF ADCON0, GO Q4 A/D CLK(1) A/D DATA ADRES ADIF GO SAMPLE OLD_DATA SAMPLING STOPPED DONE NEW_DATA (Note 2) 9 87 2 1 0 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input. . . . . . . TCY PIC18F2420/2520/4420/4520 DS39631E-page 360 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 361 PIC18F2420/2520/4420/4520 27.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES “Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3σ) or (mean – 3σ) respectively, where σ is a standard deviation, over the whole temperature range. FIGURE 27-1: SLEEP MODE Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. 0.01 0.1 1 10 100 -50 -25 0 25 50 75 100 125 Temp (C) Ipd (uA) 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 Test instrument results are compressed to about 0.05 μA for actual values below 0.05 mA. Measurements below 0.01 mA are suspect and considered unmeasurable. This is supported by the instrument specifications. PIC18F2420/2520/4420/4520 DS39631E-page 362 © 2008 Microchip Technology Inc. FIGURE 27-2: TYPICAL IPD vs. VDD ACROSS TEMPERATURE (SLEEP MODE) FIGURE 27-3: MAXIMUM IPD vs. VDD ACROSS TEMPERATURE (SLEEP MODE) 0.01 0.1 1 10 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) 125°C 85°C 25°C -40°C 0.01 0.1 1 10 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) 125°C 85°C 25°C -40°C © 2008 Microchip Technology Inc. DS39631E-page 363 PIC18F2420/2520/4420/4520 FIGURE 27-4: TYPICAL T1OSC DELTA CURRENT vs. VDD ACROSS TEMP. (DEVICE IN SLEEP, T1OSC IN LOW-POWER MODE) FIGURE 27-5: MAXIMUM T1OSC DELTA CURRENT vs. VDD ACROSS TEMP. (DEVICE IN SLEEP, TIOSC IN LOW-POWER MODE) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) 85°C 25°C -10°C 0 1 2 3 4 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) 85°C 25°C -10°C PIC18F2420/2520/4420/4520 DS39631E-page 364 © 2008 Microchip Technology Inc. FIGURE 27-6: TYPICAL T1OSC DELTA CURRENT vs. VDD ACROSS TEMP. (DEVICE IN SLEEP, T1OSC IN HIGH-POWER MODE) FIGURE 27-7: MAXIMUM T1OSC DELTA CURRENT vs. VDD ACROSS TEMP. (DEVICE IN SLEEP, T1OSC IN HIGH-POWER MODE) 0 2 4 6 8 10 12 14 16 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 DD IPD (uA) 85°C 25°C -40°C 0 5 10 15 20 25 30 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 V DD (V) IPD (uA) 85°C 25°C -40°C © 2008 Microchip Technology Inc. DS39631E-page 365 PIC18F2420/2520/4420/4520 FIGURE 27-8: TYPICAL BOR DELTA CURRENT vs. VDD ACROSS TEMP. (BORV = 2.7V, SLEEP MODE) 20.00 25.00 30.00 35.00 40.00 45.00 50.00 55.00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) IPD (uA) MAX (85°C) MAX TYP (25°C) MIN (-40°C) Device in SLEEP Device Held in RESET PIC18F2420/2520/4420/4520 DS39631E-page 366 © 2008 Microchip Technology Inc. FIGURE 27-9: TYPICAL WDT CURRENT vs. VDD ACROSS TEMPERATURE (WDT DELTA CURRENT IN SLEEP MODE) FIGURE 27-10: MAXIMUM WDT CURRENT vs. VDD ACROSS TEMPERATURE (WDT DELTA CURRENT IN SLEEP MODE) 0.00 1.00 2.00 3.00 4.00 5.00 6.00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) 125°C 85°C 25°C -40°C 0.0 2.0 4.0 6.0 8.0 10.0 12.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) 125°C 85°C 25°C -40°C © 2008 Microchip Technology Inc. DS39631E-page 367 PIC18F2420/2520/4420/4520 FIGURE 27-11: TYPICAL IDD ACROSS VDD (RC_RUN MODE, +25°C) FIGURE 27-12: MAXIMUM IDD ACROSS VDD (RC_RUN MODE, +85°C) 0.1 1 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (mA) 8 MHz 4 MHz 2 MHz 1 MHz 250 kHz 500 kHz 125 kHz 4.2V 0.1 1 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (mA) 8 MHz 4.2V 4 MHz 2 MHz 1 MHz 250 kHz 500 kHz 125 kHz PIC18F2420/2520/4420/4520 DS39631E-page 368 © 2008 Microchip Technology Inc. FIGURE 27-13: TYPICAL AND MAXIMUM IDD ACROSS VDD (RC_RUN MODE, 31 kHz) FIGURE 27-14: TYPICAL IDD ACROSS VDD (RC_IDLE MODE, +25°C) 10 100 1000 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (uA) Maximum (-40°C) Typical (25°C) 0.01 0.1 1 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (mA) 8 MHz 4.2V 4 MHz 2 MHz 1 MHz 250 kHz 500 kHz 125 kHz © 2008 Microchip Technology Inc. DS39631E-page 369 PIC18F2420/2520/4420/4520 FIGURE 27-15: MAXIMUM IDD ACROSS VDD (RC_IDLE MODE, -40°C TO +85°C) FIGURE 27-16: TYPICAL AND MAXIMUM IDD ACROSS VDD (RC_IDLE MODE, 31 kHz) 0.1 1 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (mA) 8 MHz 4.2V 4 MHz 2 MHz 1 MHz 250 kHz 500 kHz 125 kHz 0 5 10 15 20 25 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (uA) Maximum (85°C) Typical (25°C) PIC18F2420/2520/4420/4520 DS39631E-page 370 © 2008 Microchip Technology Inc. FIGURE 27-17: TYPICAL AND MAXIMUM SEC_RUN CURRENT vs. VDD ACROSS TEMPERATURE (T1OSC IN LOW-POWER MODE) FIGURE 27-18: TYPICAL AND MAXIMUM SEC_IDLE CURRENT vs. VDD ACROSS TEMPERATURE (T1OSC IN LOW-POWER MODE) 0.0 20.0 40.0 60.0 80.0 100.0 120.0 140.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (uA) Max (-10°C) Typ (25°C) Typ (85°C) Typ (-10°C) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (uA) Max (85°C) 14.0 Typ (85°C) Typ (-10°C) Typ (25°C) © 2008 Microchip Technology Inc. DS39631E-page 371 PIC18F2420/2520/4420/4520 FIGURE 27-19: TYPICAL IDD vs. FOSC, 500 kHz TO 4 MHz (PRI_RUN MODE (EC CLOCK), +25°C) FIGURE 27-20: MAXIMUM IDD vs. FOSC, 500 kHz TO 4 MHz (PRI_RUN MODE (EC CLOCK), -40°C TO +125°C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V 2.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V 2.0V PIC18F2420/2520/4420/4520 DS39631E-page 372 © 2008 Microchip Technology Inc. FIGURE 27-21: TYPICAL IDD vs. FOSC, 4 MHz TO 40 MHz (PRI_RUN MODE (EC CLOCK), +25°C) FIGURE 27-22: MAXIMUM IDD vs. FOSC, 4 MHz TO 40 MHz (PRI_RUN MODE (EC CLOCK), -40°C TO +125°C) 0 2 4 6 8 10 12 14 16 18 20 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V 2.0V 0 2 4 6 8 10 12 14 16 18 20 22 24 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V 2.0V © 2008 Microchip Technology Inc. DS39631E-page 373 PIC18F2420/2520/4420/4520 FIGURE 27-23: TYPICAL IDD vs. FOSC, HS/PLL (PRI_RUN MODE, +25°C) FIGURE 27-24: MAXIMUM IDD vs. FOSC, HS/PLL (PRI_RUN MODE, -40°C) 4 6 8 10 12 14 16 18 20 22 24 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.2V 4 6 8 10 12 14 16 18 20 22 24 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.2V PIC18F2420/2520/4420/4520 DS39631E-page 374 © 2008 Microchip Technology Inc. FIGURE 27-25: TYPICAL IDD vs. FOSC, 500 kHz TO 4 MHz (PRI_IDLE MODE, +25°C) FIGURE 27-26: MAXIMUM IDD vs. FOSC, 500 kHz TO 4 MHz (PRI_IDLE MODE, -40°C TO +125°C) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Fosc (MHz) IDD (mA) 5.0V 5.5V 4.0V 4.5V 3.0V 3.5V 2.0V 2.5V 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Fosc (MHz) IDD (mA) 5.0V 5.5V 4.0V 4.5V 3.0V 3.5V 2.0V 2.5V © 2008 Microchip Technology Inc. DS39631E-page 375 PIC18F2420/2520/4420/4520 FIGURE 27-27: TYPICAL IDD vs. FOSC, 4 MHz TO 40 MHz (PRI_IDLE MODE, +25°C) FIGURE 27-28: MAXIMUM IDD vs. FOSC, 4 MHz TO 40 MHz (PRI_IDLE MODE, -40°C TO +125°C) 0 1 2 3 4 5 6 7 8 9 10 11 12 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.0V 5.5V 4.0V 4.5V 3.0V 3.5V 2.0V 2.5V 0 1 2 3 4 5 6 7 8 9 10 11 12 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.0V 5.5V 4.0V 4.5V 3.0V 3.5V 2.0V 2.5V PIC18F2420/2520/4420/4520 DS39631E-page 376 © 2008 Microchip Technology Inc. FIGURE 27-29: TYPICAL IDD vs. FOSC, HS/PLL (PRI_IDLE MODE, +25°C) FIGURE 27-30: MAXIMUM IDD vs. FOSC, HS/PLL (PRI_IDLE MODE, -40°C) 0 1 2 3 4 5 6 7 8 9 10 11 12 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.2V 0 1 2 3 4 5 6 7 8 9 10 11 12 16 18 20 22 24 26 28 30 32 34 36 38 40 Fosc (MHz) IDD (mA) 5.5V 5.0V 4.5V 4.2V © 2008 Microchip Technology Inc. DS39631E-page 377 PIC18F2420/2520/4420/4520 FIGURE 27-31: VIN (ST) vs. VDD, +25°C (-40°C TO +125°C) FIGURE 27-32: VIN (TTL) vs. VDD, +25°C (-40°C TO +125°C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VIN (V) VIH Max (125°C) VIH Typ (25°C) VIH Min (-40°C) VIL Min (125°C) VIL Typ (25°C) VIL Max (-40°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VIN (V) VIH Min (125°C) VIH Typ (25°C) VIH Max (-40°C) PIC18F2420/2520/4420/4520 DS39631E-page 378 © 2008 Microchip Technology Inc. FIGURE 27-33: VOL vs. IOL (VDD = 3.0V, -40°C TO +85°C) FIGURE 27-34: VOL vs. IOL (VDD = 5.0V, -40°C TO +125°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 5 10 15 20 25 IOL (-ma) VOL (V) Typ (25°C) Min (-40°C) Max (85°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 5 10 15 20 25 IOL (-ma) VOL (V) Min (-40°C) Max (85°C) Typ (25°C) © 2008 Microchip Technology Inc. DS39631E-page 379 PIC18F2420/2520/4420/4520 FIGURE 27-35: VOH vs. IOH (VDD = 3.0V, -40°C TO +85°C) FIGURE 27-36: VOH vs. IOH (VDD = 5.0V, -40°C TO +125°C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 25 IOH (-ma) VOH (V) Max (-40°C) Typ (25°C) Min (85°C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 5 10 15 20 25 IOH (-ma) VOH (V) Max (-40°C) Typ (25°C) Min (125°C) PIC18F2420/2520/4420/4520 DS39631E-page 380 © 2008 Microchip Technology Inc. FIGURE 27-37: INTOSC FREQUENCY vs. VDD, TEMPERATURE (-40°C, +25°C, +85°C, +125°C) FIGURE 27-38: INTRC vs. VDD ACROSS TEMPERATURE (-40°C TO +125°C) 7.6 7.7 7.8 7.9 8.0 8.1 8.2 8.3 8.4 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (MHz) Max Freq 125°C Typ 85°C Typ 25°C Typ -40°C Typ Min Freq 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (kHz) Max (125°C) Max (-40°C) Typ (25°C) Min (85°C) Min (125°C) © 2008 Microchip Technology Inc. DS39631E-page 381 PIC18F2420/2520/4420/4520 FIGURE 27-39: WDT PERIOD vs. VDD ACROSS TEMPERATURE (1:1 POSTSCALER, -40°C TO +125°C) 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Period (ms) Longest Typical (25°C) Shortest (85°C) Shortest (125°C) PIC18F2420/2520/4420/4520 DS39631E-page 382 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 383 PIC18F2420/2520/4420/4520 28.0 PACKAGING INFORMATION 28.1 Package Marking Information 28-Lead SPDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F2520-I/SP 0810017 28-Lead SOIC XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F2520-E/SO 0810017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 e3 e3 28-Lead QFN XXXXXXXX XXXXXXXX YYWWNNN Example 18F2420 -I/ML 0810017 e3 PIC18F2420/2520/4420/4520 DS39631E-page 384 © 2008 Microchip Technology Inc. Package Marking Information (Continued) 44-Lead TQFP XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Example PIC18F4420 -I/PT 0810017 XXXXXXXXXX 44-Lead QFN XXXXXXXXXX XXXXXXXXXX YYWWNNN PIC18F4520 Example -I/ML 0810017 e3 e3 40-Lead PDIP XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F4420-I/P 0810017 e3 © 2008 Microchip Technology Inc. DS39631E-page 385 PIC18F2420/2520/4420/4520 28.2 Package Details The following sections give the technical details of the packages.                 !"   !"#$%&" '  ()"&'"!&) &#*& &  & #   +%&,  & !& - '! !#.#  &"#' #%! & "! ! #%! & "! !!  &$#/  !#  '! #&    .0 1,2 1!'!   &$& "! **& "&&  ! !" 3 & ' !&" & 4# *!( !!&    4 %&  &#& && 255***'    '5 4 6&! 7,8. '! 9'&! 7 7: ; 7"') %! 7 < &  1, & &  = =   ##4 4!!   -  1!& &   = =  "# &  "# >#& .  - --  ##4>#& .  <  :  9&  - -?   & & 9  -  9# 4!!  <   6  9#>#& )    9 * 9#>#& )  <  :   * + 1 = = - NOTE 1 N 1 2 D E1 eB c E L A2 b e A1 b1 A 3         * ,1 PIC18F2420/2520/4420/4520 DS39631E-page 386 © 2008 Microchip Technology Inc.     #   #  $ % &'(    #) !"   !"#$%&" '  ()"&'"!&) &#*& &  & #   +%&,  & !& - '! !#.#  &"#' #%! & "! ! #%! & "! !!  &$#''  !#  '! #&    .0 1,2 1!'!   &$& "! **& "&&  ! .32 % '! ("!"*& "&&  (% % '&  " !!  !" 3 & ' !&" & 4# *!( !!&    4 %&  &#& && 255***'    '5 4 6&! 99.. 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'! 9'&! 7 7: ; 7"') %! 7  &  1, & &  = =   ##4 4!!   =  1!& &   = =  "# &  "# >#& .  = ?  ##4>#& . < = < :  9&  < =   & & 9  =  9# 4!!  < =  6  9#>#& ) - =  9 * 9#>#& )  = - :   * + 1 = =  N NOTE 1 E1 D 123 A A1 b1 b e c eB E L A2         * ,?1 PIC18F2420/2520/4420/4520 DS39631E-page 390 © 2008 Microchip Technology Inc. 22   * +% !   , -  /   *+! !"   !"#$%&" '  ()"&'"!&) &#*& &  & #   4!!*!"&# - '! #&    .0 1,2 1!'!   &$& "! **& "&&  ! .32 % '! ("!"*& "&&  (% % '&  " !!  !" 3 & ' !&" & 4# *!( !!&    4 %&  &#& && 255***'    '5 4 6&! 99.. '! 9'&! 7 7: ; 7"') %! 7  &  ?1, :  8 &  <   &# %%     , && 4!! - .3 :  >#& . <1, .$ !##>#& . ?- ? ?< :  9&  <1, .$ !##9&  ?- ? ?< , &&>#& )  - -< , &&9& 9 -   , &&& .$ !## C  = = D EXPOSED PAD D2 e b K L E2 2 1 N NOTE 1 2 1 E N TOP VIEW BOTTOM VIEW A3 A1 A         * ,-1 © 2008 Microchip Technology Inc. DS39631E-page 391 PIC18F2420/2520/4420/4520 22   * +% !   , -  /   *+! !" 3 & ' !&" & 4# *!( !!&    4 %&  &#& && 255***'    '5 4 PIC18F2420/2520/4420/4520 DS39631E-page 392 © 2008 Microchip Technology Inc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e b NOTE 1 NOTE 2 N 123 c A1 L A2 L1 α φ β         * ,?1 © 2008 Microchip Technology Inc. DS39631E-page 393 PIC18F2420/2520/4420/4520 22   31 * +4 3  5/5/5  % '  3*+ !" 3 & ' !&" & 4# *!( !!&    4 %&  &#& && 255***'    '5 4 PIC18F2420/2520/4420/4520 DS39631E-page 394 © 2008 Microchip Technology Inc. NOTES: © 2008 Microchip Technology Inc. DS39631E-page 395 PIC18F2420/2520/4420/4520 APPENDIX A: REVISION HISTORY Revision A (June 2004) Original data sheet for PIC18F2420/2520/4420/4520 devices. Revision B (January 2007) This revision includes updates to the packaging diagrams. Revision C (June 2007) This revision includes updates to Section 6.0 “Flash Program Memory”, Section 23.0 “Special Features of the CPU”, Section 26.0 “Electrical Characteristics” and minor corrections applicable to Timer1, EUSART and the packaging diagrams. Also added the 125°C specifications. Revision D (July 2007) This revision updated the extended temperature information in Section 26.0 “Electrical Characteristics”. Revision E (October 2008) This revision updated Section 26.0 “Electrical Characteristics”, Section 27.0 “DC and AC Characteristics Graphs and Tables” and Section 28.0 “Packaging Information”. APPENDIX B: DEVICE DIFFERENCES The differences between the devices listed in this data sheet are shown in Table B-1. TABLE B-1: DEVICE DIFFERENCES Features PIC18F2420 PIC18F2520 PIC18F4420 PIC18F4520 Program Memory (Bytes) 16384 32768 16384 32768 Program Memory (Instructions) 8192 16384 8192 16384 Interrupt Sources 19 19 20 20 I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E Capture/Compare/PWM Modules 2 2 1 1 Enhanced Capture/Compare/PWM Modules 00 1 1 Parallel Communications (PSP) No No Yes Yes 10-Bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels Packages 28-Pin SPDIP 28-Pin SOIC 28-Pin QFN 28-Pin SPDIP 28-Pin SOIC 28-Pin QFN 40-Pin PDIP 44-Pin TQFP 44-Pin QFN 40-Pin PDIP 44-Pin TQFP 44-Pin QFN PIC18F2420/2520/4420/4520 DS39631E-page 396 © 2008 Microchip Technology Inc. APPENDIX C: MIGRATION FROM MID-RANGE TO ENHANCED DEVICES A detailed discussion of the differences between the mid-range MCU devices (i.e., PIC16CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in AN716, “Migrating Designs from PIC16C74A/74B to PIC18C442”. The changes discussed, while device specific, are generally applicable to all mid-range to enhanced device migrations. This Application Note is available as Literature Number DS00716. APPENDIX D: MIGRATION FROM HIGH-END TO ENHANCED DEVICES A detailed discussion of the migration pathway and differences between the high-end MCU devices (i.e., PIC17CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in AN726, “PIC17CXXX to PIC18CXXX Migration”. This Application Note is available as Literature Number DS00726. DS39631E-page 397 © 2008 Microchip Technology Inc. PIC18F2420/2520/4420/4520 INDEX A A/D ....................................................................................223 Acquisition Requirements .........................................228 ADCON0 Register.....................................................223 ADCON1 Register.....................................................223 ADCON2 Register.....................................................223 ADRESH Register.............................................223, 226 ADRESL Register .....................................................223 Analog Port Pins, Configuring ...................................230 Associated Registers ................................................232 Configuring the Module .............................................227 Conversion Clock (TAD) ............................................229 Conversion Status (GO/DONE Bit) ...........................226 Conversions ..............................................................231 Converter Characteristics..........................................359 Converter Interrupt, Configuring................................227 Discharge ..................................................................231 Operation in Power-Managed Modes .......................230 Selecting and Configuring Acquisition Time..............229 Special Event Trigger (CCP).....................................232 Special Event Trigger (ECCP) ..................................148 Use of the CCP2 Trigger...........................................232 Absolute Maximum Ratings...............................................321 AC (Timing) Characteristics ..............................................340 Load Conditions for Device Timing Specifications ........................................341 Parameter Symbology...............................................340 Temperature and Voltage Specifications ..................341 Timing Conditions .....................................................341 AC Characteristics Internal RC Accuracy ................................................343 Access Bank Mapping with Indexed Literal Offset Mode..................72 ACKSTAT..........................................................................191 ACKSTAT Status Flag.......................................................191 ADCON0 Register.............................................................223 GO/DONE Bit ............................................................226 ADCON1 Register.............................................................223 ADCON2 Register.............................................................223 ADDFSR............................................................................310 ADDLW .............................................................................273 ADDULNK .........................................................................310 ADDWF .............................................................................273 ADDWFC...........................................................................274 ADRESH Register.............................................................223 ADRESL Register......................................................223, 226 Analog-to-Digital Converter. See A/D. ANDLW .............................................................................274 ANDWF .............................................................................275 Assembler MPASM Assembler ...................................................318 Auto-Wake-up on Sync Break Character ..........................214 B Bank Select Register (BSR)................................................59 Baud Rate Generator ........................................................187 BC .....................................................................................275 BCF ...................................................................................276 BF......................................................................................191 BF Status Flag...................................................................191 Block Diagrams A/D............................................................................ 226 Analog Input Model................................................... 227 Baud Rate Generator................................................ 187 Capture Mode Operation .......................................... 141 Comparator Analog Input Model............................... 237 Comparator I/O Operating Modes ............................ 234 Comparator Output ................................................... 236 Comparator Voltage Reference ................................ 240 Comparator Voltage Reference Output Buffer Example ................................................. 241 Compare Mode Operation ........................................ 142 Device Clock............................................................... 28 Enhanced PWM........................................................ 149 EUSART Receive ..................................................... 213 EUSART Transmit .................................................... 211 External Power-on Reset Circuit (Slow VDD Power-up).......................................... 43 Fail-Safe Clock Monitor (FSCM)............................... 261 Generic I/O Port........................................................ 105 High/Low-Voltage Detect with External Input ........... 244 Interrupt Logic............................................................. 92 MSSP (I2C Master Mode) ......................................... 185 MSSP (I2C Mode) ..................................................... 170 MSSP (SPI Mode) .................................................... 161 On-Chip Reset Circuit................................................. 41 PIC18F2420/2520....................................................... 10 PIC18F4420/4520....................................................... 11 PLL (HS Mode) ........................................................... 25 PORTD and PORTE (Parallel Slave Port)................ 120 PWM Operation (Simplified) ..................................... 144 Reads from Flash Program Memory........................... 77 Single Comparator.................................................... 235 Table Read Operation ................................................ 73 Table Write Operation................................................. 74 Table Writes to Flash Program Memory ..................... 79 Timer0 in 16-Bit Mode .............................................. 124 Timer0 in 8-Bit Mode ................................................ 124 Timer1....................................................................... 128 Timer1 (16-Bit Read/Write Mode)............................. 128 Timer2....................................................................... 134 Timer3....................................................................... 136 Timer3 (16-Bit Read/Write Mode)............................. 136 Watchdog Timer ....................................................... 258 BN..................................................................................... 276 BNC .................................................................................. 277 BNN .................................................................................. 277 BNOV................................................................................ 278 BNZ................................................................................... 278 BOR. See Brown-out Reset. BOV .................................................................................. 281 BRA................................................................................... 279 Break Character (12-Bit) Transmit and Receive ............... 216 BRG. See Baud Rate Generator. Brown-out Reset (BOR)...................................................... 44 Detecting..................................................................... 44 Disabling in Sleep Mode ............................................. 44 Software Enabled ....................................................... 44 BSF................................................................................... 279 BTFSC .............................................................................. 280 BTFSS .............................................................................. 280 BTG................................................................................... 281 BZ ..................................................................................... 282 PIC18F2420/2520/4420/4520 DS39631E-page 398 © 2008 Microchip Technology Inc. C C Compilers MPLAB C18 .............................................................. 318 MPLAB C30 .............................................................. 318 CALL ................................................................................. 282 CALLW.............................................................................. 311 Capture (CCP Module)...................................................... 141 Associated Registers ................................................ 143 CCP Pin Configuration.............................................. 141 CCPRxH:CCPRxL Registers .................................... 141 Prescaler................................................................... 141 Software Interrupt ..................................................... 141 Timer1/Timer3 Mode Selection................................. 141 Capture (ECCP Module) ...................................................148 Capture/Compare/PWM (CCP)......................................... 139 Capture Mode. See Capture. CCP Mode and Timer Resources ............................. 140 CCPRxH Register ..................................................... 140 CCPRxL Register...................................................... 140 Compare Mode. See Compare. Interaction of Two CCP Modules ..............................140 Module Configuration................................................ 140 Clock Sources..................................................................... 28 Selecting the 31 kHz Source....................................... 29 Selection Using OSCCON Register............................29 CLRF................................................................................. 283 CLRWDT........................................................................... 283 Code Examples 16 x 16 Signed Multiply Routine ................................. 90 16 x 16 Unsigned Multiply Routine ............................. 90 8 x 8 Signed Multiply Routine ..................................... 89 8 x 8 Unsigned Multiply Routine ................................. 89 Changing Between Capture Prescalers.................... 141 Computed GOTO Using an Offset Value.................... 56 Data EEPROM Read .................................................. 85 Data EEPROM Refresh Routine................................. 86 Data EEPROM Write .................................................. 85 Erasing a Flash Program Memory Row ...................... 78 Fast Register Stack.....................................................56 How to Clear RAM (Bank 1) Using Indirect Addressing ............................................. 68 Implementing a Real-Time Clock Using a Timer1 Interrupt Service ................................ 131 Initializing PORTA..................................................... 105 Initializing PORTB..................................................... 108 Initializing PORTC..................................................... 111 Initializing PORTD..................................................... 114 Initializing PORTE..................................................... 117 Loading the SSPBUF (SSPSR) Register.................. 164 Reading a Flash Program Memory Word ................... 77 Saving STATUS, WREG and BSR Registers in RAM.............................................. 103 Writing to Flash Program Memory ........................ 80–81 Code Protection ................................................................ 249 COMF................................................................................ 284 Comparator ....................................................................... 233 Analog Input Connection Considerations.................. 237 Associated Registers ................................................ 237 Configuration............................................................. 234 Effects of a Reset...................................................... 236 Interrupts................................................................... 236 Operation .................................................................. 235 Operation During Sleep ............................................ 236 Outputs ..................................................................... 235 Reference ................................................................. 235 External Signal ................................................. 235 Internal Signal................................................... 235 Response Time......................................................... 235 Comparator Specifications................................................ 338 Comparator Voltage Reference........................................ 239 Accuracy and Error................................................... 240 Associated Registers................................................ 241 Configuring ............................................................... 239 Connection Considerations....................................... 240 Effects of a Reset ..................................................... 240 Operation During Sleep ............................................ 240 Compare (CCP Module) ................................................... 142 Associated Registers................................................ 143 CCPRx Register ....................................................... 142 Pin Configuration ...................................................... 142 Software Interrupt ..................................................... 142 Special Event Trigger ............................... 137, 142, 232 Timer1/Timer3 Mode Selection................................. 142 Compare (ECCP Module)................................................. 148 Special Event Trigger ............................................... 148 Computed GOTO................................................................ 56 Configuration Bits ............................................................. 249 Configuration Register Protection..................................... 266 Context Saving During Interrupts...................................... 103 CPFSEQ........................................................................... 284 CPFSGT ........................................................................... 285 CPFSLT............................................................................ 285 Crystal Oscillator/Ceramic Resonator................................. 23 Customer Change Notification Service............................. 407 Customer Notification Service .......................................... 407 Customer Support............................................................. 407 D Data Addressing Modes ..................................................... 68 Comparing Addressing Modes with the Extended Instruction Set Enabled ...................... 71 Direct .......................................................................... 68 Indexed Literal Offset ................................................. 70 Instructions Affected........................................... 70 Indirect........................................................................ 68 Inherent and Literal..................................................... 68 Data EEPROM Code Protection........................................................ 266 Data EEPROM Memory...................................................... 83 Associated Registers.................................................. 87 EEADR Register......................................................... 83 EECON1 and EECON2 Registers.............................. 83 Operation During Code-Protect .................................. 86 Protection Against Spurious Write.............................. 86 Reading ...................................................................... 85 Using .......................................................................... 86 Write Verify ................................................................. 85 Writing ........................................................................ 85 Data Memory ...................................................................... 59 Access Bank............................................................... 62 and the Extended Instruction Set ............................... 70 Bank Select Register (BSR) ....................................... 59 General Purpose Registers ........................................ 62 Map for PIC18F2420/4420 ......................................... 60 Map for PIC18F2520/4520 ......................................... 61 Special Function Registers......................................... 63 DAW ................................................................................. 286 DC and AC Characteristics Graphs and Tables ................................................... 361 DS39631E-page 399 © 2008 Microchip Technology Inc. PIC18F2420/2520/4420/4520 DC Characteristics ............................................................335 Power-Down and Supply Current..............................325 Supply Voltage ..........................................................324 DCFSNZ............................................................................287 DECF.................................................................................286 DECFSZ............................................................................287 Development Support........................................................317 Device Differences ............................................................395 Device Overview ...................................................................7 Details on Individual Family Members ..........................8 Features (table).............................................................9 New Core Features .......................................................7 Other Special Features .................................................8 Device Reset Timers...........................................................45 Oscillator Start-up Timer (OST) ..................................45 PLL Lock Time-out ......................................................45 Power-up Timer (PWRT).............................................45 Time-out Sequence.....................................................45 Direct Addressing................................................................69 E Effect on Standard PIC MCU Instructions.........................314 Effects of Power-Managed Modes on Various Clock Sources................................................31 Electrical Characteristics...................................................321 Enhanced Capture/Compare/PWM (ECCP) .....................147 Associated Registers ................................................160 Capture and Compare Modes...................................148 Capture Mode. See Capture (ECCP Module). Outputs and Configuration ........................................148 Pin Configurations for ECCP.....................................148 PWM Mode. See PWM (ECCP Module). Standard PWM Mode................................................148 Timer Resources.......................................................148 Enhanced PWM Mode. See PWM (ECCP Module). Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART). See EUSART. Equations A/D Acquisition Time.................................................228 A/D Minimum Charging Time ....................................228 Calculating the Minimum Required Acquisition Time................................................228 Errata.....................................................................................6 EUSART Asynchronous Mode .................................................211 12-Bit Break Transmit and Receive ..................216 Associated Registers, Receive .........................214 Associated Registers, Transmit ........................212 Auto-Wake-up on Sync Break...........................214 Receiver............................................................213 Setting up 9-Bit Mode with Address Detect .........................................213 Transmitter........................................................211 Baud Rate Generator Operation in Power-Managed Mode .................205 Baud Rate Generator (BRG).....................................205 Associated Registers ........................................206 Auto-Baud Rate Detect .....................................209 Baud Rate Error, Calculating ............................206 Baud Rates, Asynchronous Modes...................207 High Baud Rate Select (BRGH Bit)...................205 Sampling ...........................................................205 Synchronous Master Mode....................................... 217 Associated Registers, Receive......................... 219 Associated Registers, Transmit ........................ 218 Reception.......................................................... 219 Transmission .................................................... 217 Synchronous Slave Mode......................................... 220 Associated Registers, Receive......................... 221 Associated Registers, Transmit ........................ 220 Reception.......................................................... 221 Transmission .................................................... 220 Extended Instruction Set ADDFSR ................................................................... 310 ADDULNK................................................................. 310 and Using MPLAB IDE Tools.................................... 316 CALLW ..................................................................... 311 Considerations for Use ............................................. 314 MOVSF ..................................................................... 311 MOVSS..................................................................... 312 PUSHL...................................................................... 312 SUBFSR ................................................................... 313 SUBULNK................................................................. 313 Syntax....................................................................... 309 External Clock Input............................................................ 24 F Fail-Safe Clock Monitor............................................. 249, 261 Exiting Operation ...................................................... 261 Interrupts in Power-Managed Modes........................ 262 POR or Wake from Sleep ......................................... 262 WDT During Oscillator Failure .................................. 261 Fast Register Stack............................................................. 56 Firmware Instructions........................................................ 267 Flash Program Memory ...................................................... 73 Associated Registers .................................................. 81 Control Registers ........................................................ 74 EECON1 and EECON2 ...................................... 74 TABLAT (Table Latch) Register.......................... 76 TBLPTR (Table Pointer) Register....................... 76 Erase Sequence ......................................................... 78 Erasing........................................................................ 78 Operation During Code-Protect .................................. 81 Reading ...................................................................... 77 Table Pointer Boundaries Based on Operation......................... 76 Table Pointer Boundaries ........................................... 76 Table Reads and Table Writes ................................... 73 Write Sequence .......................................................... 79 Writing To ................................................................... 79 Protection Against Spurious Writes .................... 81 Unexpected Termination..................................... 81 Write Verify ......................................................... 81 FSCM. See Fail-Safe Clock Monitor. G General Call Address Support .......................................... 184 GOTO ............................................................................... 288 H Hardware Multiplier ............................................................. 89 Introduction ................................................................. 89 Operation .................................................................... 89 Performance Comparison........................................... 89 PIC18F2420/2520/4420/4520 DS39631E-page 400 © 2008 Microchip Technology Inc. High/Low-Voltage Detect Applications............................................................... 246 Associated Registers ................................................ 247 Characteristics .......................................................... 339 Current Consumption................................................ 245 Effects of a Reset...................................................... 247 Operation .................................................................. 244 During Sleep ..................................................... 247 Setup......................................................................... 245 Start-up Time ............................................................ 245 Typical Application .................................................... 246 HLVD. See High/Low-Voltage Detect. I I/O Ports............................................................................ 105 I 2C Mode (MSSP) Acknowledge Sequence Timing................................ 194 Baud Rate Generator................................................ 187 Bus Collision During a Repeated Start Condition................... 198 During a Stop Condition.................................... 199 Clock Arbitration........................................................ 188 Clock Stretching........................................................ 180 10-Bit Slave Receive Mode (SEN = 1).............. 180 10-Bit Slave Transmit Mode..............................180 7-Bit Slave Receive Mode (SEN = 1)................ 180 7-Bit Slave Transmit Mode................................ 180 Clock Synchronization and the CKP bit (SEN = 1)............................................. 181 Effects of a Reset...................................................... 195 General Call Address Support .................................. 184 I 2C Clock Rate w/BRG.............................................. 187 Master Mode ............................................................. 185 Operation .......................................................... 186 Reception.......................................................... 191 Repeated Start Condition Timing...................... 190 Start Condition Timing ...................................... 189 Transmission..................................................... 191 Multi-Master Communication, Bus Collision and Arbitration.................................... 195 Multi-Master Mode .................................................... 195 Operation .................................................................. 174 Read/Write Bit Information (R/W Bit) ................ 174, 175 Registers................................................................... 170 Serial Clock (RC3/SCK/SCL).................................... 175 Slave Mode ............................................................... 174 Addressing........................................................ 174 Reception.......................................................... 175 Transmission..................................................... 175 Sleep Operation ........................................................ 195 Stop Condition Timing...............................................194 ID Locations .............................................................. 249, 266 INCF.................................................................................. 288 INCFSZ ............................................................................. 289 In-Circuit Debugger........................................................... 266 In-Circuit Serial Programming (ICSP) ....................... 249, 266 Indexed Literal Offset Addressing and Standard PIC18 Instructions ..............................314 Indexed Literal Offset Mode.............................................. 314 Indirect Addressing ............................................................. 69 INFSNZ ............................................................................. 289 Initialization Conditions for all Registers ....................... 49–52 Instruction Cycle.................................................................. 57 Clocking Scheme ........................................................ 57 Instruction Flow/Pipelining .................................................. 57 Instruction Set ................................................................... 267 ADDLW..................................................................... 273 ADDWF..................................................................... 273 ADDWF (Indexed Literal Offset Mode)..................... 315 ADDWFC.................................................................. 274 ANDLW..................................................................... 274 ANDWF..................................................................... 275 BC............................................................................. 275 BCF .......................................................................... 276 BN............................................................................. 276 BNC .......................................................................... 277 BNN .......................................................................... 277 BNOV ....................................................................... 278 BNZ .......................................................................... 278 BOV .......................................................................... 281 BRA .......................................................................... 279 BSF........................................................................... 279 BSF (Indexed Literal Offset Mode) ........................... 315 BTFSC...................................................................... 280 BTFSS ...................................................................... 280 BTG .......................................................................... 281 BZ ............................................................................. 282 CALL......................................................................... 282 CLRF ........................................................................ 283 CLRWDT .................................................................. 283 COMF ....................................................................... 284 CPFSEQ................................................................... 284 CPFSGT ................................................................... 285 CPFSLT.................................................................... 285 DAW ......................................................................... 286 DCFSNZ ................................................................... 287 DECF........................................................................ 286 DECFSZ ................................................................... 287 Extended Instruction Set .......................................... 309 General Format......................................................... 269 GOTO ....................................................................... 288 INCF ......................................................................... 288 INCFSZ..................................................................... 289 INFSNZ..................................................................... 289 IORLW...................................................................... 290 IORWF...................................................................... 290 LFSR ........................................................................ 291 MOVF ....................................................................... 291 MOVFF ..................................................................... 292 MOVLB ..................................................................... 292 MOVLW .................................................................... 293 MOVWF.................................................................... 293 MULLW..................................................................... 294 MULWF..................................................................... 294 NEGF........................................................................ 295 NOP.......................................................................... 295 Opcode Field Descriptions........................................ 268 POP .......................................................................... 296 PUSH........................................................................ 296 RCALL ...................................................................... 297 RESET...................................................................... 297 RETFIE..................................................................... 298 RETLW ..................................................................... 298 RETURN................................................................... 299 RLCF ........................................................................ 299 RLNCF...................................................................... 300 RRCF........................................................................ 300 RRNCF ..................................................................... 301 SETF ........................................................................ 301 SETF (Indexed Literal Offset Mode)......................... 315 SLEEP ...................................................................... 302 DS39631E-page 401 © 2008 Microchip Technology Inc. PIC18F2420/2520/4420/4520 Standard Instructions ................................................267 SUBFWB...................................................................302 SUBLW .....................................................................303 SUBWF .....................................................................303 SUBWFB...................................................................304 SWAPF .....................................................................304 TBLRD ......................................................................305 TBLWT ......................................................................306 TSTFSZ.....................................................................307 XORLW .....................................................................307 XORWF.....................................................................308 INTCON Registers ........................................................93–95 Inter-Integrated Circuit. See I2C. Internal Oscillator Block.......................................................26 Adjustment ..................................................................26 INTIO Modes...............................................................26 INTOSC Frequency Drift .............................................26 INTOSC Output Frequency.........................................26 OSCTUNE Register ....................................................26 PLL in INTOSC Modes................................................26 Internal RC Oscillator Use with WDT ...........................................................258 Internet Address................................................................407 Interrupt Sources...............................................................249 A/D Conversion Complete.........................................227 Capture Complete (CCP) ..........................................141 Compare Complete (CCP) ........................................142 Interrupt-on-Change (RB7:RB4) ...............................108 INTx Pin ....................................................................103 PORTB, Interrupt-on-Change ...................................103 TMR0 ........................................................................103 TMR0 Overflow .........................................................125 TMR1 Overflow .........................................................127 TMR2 to PR2 Match (PWM) .............................144, 149 TMR3 Overflow .................................................135, 137 Interrupts .............................................................................91 Interrupts, Flag Bits Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit) ..........................................................108 INTOSC, INTRC. See Internal Oscillator Block. IORLW...............................................................................290 IORWF ..............................................................................290 IPR Registers ............................................................100–101 L LFSR .................................................................................291 Low-Voltage ICSP Programming. See Single-Supply ICSP Programming M Master Clear (MCLR) ..........................................................43 Master Synchronous Serial Port (MSSP). See MSSP. Memory Organization..........................................................53 Data Memory...............................................................59 Program Memory ........................................................53 Memory Programming Requirements ...............................337 Microchip Internet Web Site ..............................................407 Migration from High-End to Enhanced Devices ................396 Migration from Mid-Range to Enhanced Devices..............396 MOVF................................................................................291 MOVFF..............................................................................292 MOVLB..............................................................................292 MOVLW.............................................................................293 MOVSF..............................................................................311 MOVSS .............................................................................312 MOVWF.............................................................................293 MPLAB ASM30 Assembler, Linker, Librarian ................... 318 MPLAB ICD 2 In-Circuit Debugger ................................... 319 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator .................................... 319 MPLAB Integrated Development Environment Software .............................................. 317 MPLAB PM3 Device Programmer .................................... 319 MPLAB REAL ICE In-Circuit Emulator System................. 319 MPLINK Object Linker/MPLIB Object Librarian ................ 318 MSSP ACK Pulse ........................................................ 174, 175 Control Registers (general)....................................... 161 I 2C Mode. See I 2C Mode. Module Overview ...................................................... 161 SPI Master/Slave Connection................................... 165 SPI Mode. See SPI Mode. SSPBUF Register ..................................................... 166 SSPSR Register ....................................................... 166 MULLW............................................................................. 294 MULWF............................................................................. 294 N NEGF................................................................................ 295 NOP .................................................................................. 295 O Oscillator Configuration....................................................... 23 EC............................................................................... 23 ECIO ........................................................................... 23 HS............................................................................... 23 HSPLL ........................................................................ 23 Internal Oscillator Block .............................................. 26 INTIO1 ........................................................................ 23 INTIO2 ........................................................................ 23 LP ............................................................................... 23 RC............................................................................... 23 RCIO........................................................................... 23 XT ............................................................................... 23 Oscillator Selection ........................................................... 249 Oscillator Start-up Timer (OST) .................................... 31, 45 Oscillator Switching............................................................. 28 Oscillator Transitions .......................................................... 29 Oscillator, Timer1...................................................... 127, 137 Oscillator, Timer3.............................................................. 135 P Packaging Information ...................................................... 383 Details....................................................................... 385 Marking ..................................................................... 383 Parallel Slave Port (PSP).......................................... 114, 120 Associated Registers ................................................ 121 CS (Chip Select) ....................................................... 120 PORTD ..................................................................... 120 RD (Read Input)........................................................ 120 Select (PSPMODE Bit) ..................................... 114, 120 WR (Write Input) ....................................................... 120 PICSTART Plus Development Programmer..................... 320 PIE Registers................................................................ 98–99 Pin Functions MCLR/VPP/RE3 .................................................... 12, 16 OSC1/CLKI/RA7 ................................................... 12, 16 OSC2/CLKO/RA6 ................................................. 12, 16 RA0/AN0............................................................... 13, 17 RA1/AN1............................................................... 13, 17 RA2/AN2/VREF-/CVREF......................................... 13, 17 RA3/AN3/VREF+.................................................... 13, 17 PIC18F2420/2520/4420/4520 DS39631E-page 402 © 2008 Microchip Technology Inc. RA4/T0CKI/C1OUT............................................... 13, 17 RA5/AN4/SS/HLVDIN/C2OUT.............................. 13, 17 RB0/INT0/FLT0/AN12........................................... 14, 18 RB1/INT1/AN10 .................................................... 14, 18 RB2/INT2/AN8 ...................................................... 14, 18 RB3/AN9/CCP2 .................................................... 14, 18 RB4/KBI0/AN11 .................................................... 14, 18 RB5/KBI1/PGM ..................................................... 14, 18 RB6/KBI2/PGC ..................................................... 14, 18 RB7/KBI3/PGD ..................................................... 14, 18 RC0/T1OSO/T13CKI ............................................ 15, 19 RC1/T1OSI/CCP2................................................. 15, 19 RC2/CCP1 .................................................................. 15 RC2/CCP1/P1A .......................................................... 19 RC3/SCK/SCL ...................................................... 15, 19 RC4/SDI/SDA ....................................................... 15, 19 RC5/SDO .............................................................. 15, 19 RC6/TX/CK ........................................................... 15, 19 RC7/RX/DT ........................................................... 15, 19 RD0/PSP0................................................................... 20 RD1/PSP1................................................................... 20 RD2/PSP2................................................................... 20 RD3/PSP3................................................................... 20 RD4/PSP4................................................................... 20 RD5/PSP5/P1B........................................................... 20 RD6/PSP6/P1C........................................................... 20 RD7/PSP7/P1D........................................................... 20 RE0/RD/AN5............................................................... 21 RE1/WR/AN6 .............................................................. 21 RE2/CS/AN7............................................................... 21 VDD........................................................................ 15, 21 VSS........................................................................ 15, 21 Pinout I/O Descriptions PIC18F2420/2520....................................................... 12 PIC18F4420/4520....................................................... 16 PIR Registers ................................................................ 96–97 PLL Frequency Multiplier .................................................... 25 HSPLL Oscillator Mode............................................... 25 Use with INTOSC........................................................ 25 POP................................................................................... 296 POR. See Power-on Reset. PORTA Associated Registers ................................................ 107 LATA Register........................................................... 105 PORTA Register ....................................................... 105 TRISA Register ......................................................... 105 PORTB Associated Registers ................................................ 110 LATB Register........................................................... 108 PORTB Register ....................................................... 108 RB7:RB4 Interrupt-on-Change Flag (RBIF Bit) .......................................................... 108 TRISB Register ......................................................... 108 PORTC Associated Registers ................................................ 113 LATC Register .......................................................... 111 PORTC Register ....................................................... 111 RC3/SCK/SCL Pin .................................................... 175 TRISC Register......................................................... 111 PORTD Associated Registers ................................................ 116 LATD Register .......................................................... 114 Parallel Slave Port (PSP) Function ........................... 114 PORTD Register ....................................................... 114 TRISD Register......................................................... 114 PORTE Associated Registers................................................ 119 LATE Register .......................................................... 117 PORTE Register....................................................... 117 PSP Mode Select (PSPMODE Bit)........................... 114 TRISE Register......................................................... 117 Power-Managed Modes...................................................... 33 and A/D Operation.................................................... 230 and EUSART Operation ........................................... 205 and Multiple Sleep Commands................................... 34 and PWM Operation ................................................. 159 and SPI Operation .................................................... 169 Clock Transitions and Status Indicators ..................... 34 Effects on Clock Sources............................................ 31 Entering ...................................................................... 33 Exiting Idle and Sleep Modes ..................................... 39 by Interrupt ......................................................... 39 by Reset ............................................................. 39 by WDT Time-out ............................................... 39 Without a Start-up Delay .................................... 40 Idle Modes .................................................................. 37 PRI_IDLE............................................................ 38 RC_IDLE ............................................................ 39 SEC_IDLE .......................................................... 38 Run Modes ................................................................. 34 PRI_RUN............................................................ 34 RC_RUN............................................................. 35 SEC_RUN .......................................................... 34 Selecting..................................................................... 33 Sleep Mode ................................................................ 37 Summary (table) ......................................................... 33 Power-on Reset (POR)....................................................... 43 Power-up Timer (PWRT) ............................................ 45 Time-out Sequence .................................................... 45 Power-up Delays ................................................................ 31 Power-up Timer (PWRT) .................................................... 31 Prescaler Timer2 ...................................................................... 150 Prescaler, Timer0 ............................................................. 125 Prescaler, Timer2 ............................................................. 145 PRI_IDLE Mode.................................................................. 38 PRI_RUN Mode .................................................................. 34 Program Counter ................................................................ 54 PCL, PCH and PCU Registers ................................... 54 PCLATH and PCLATU Registers ............................... 54 Program Memory and Extended Instruction Set ..................................... 72 Code Protection........................................................ 264 Instructions ................................................................. 58 Two-Word ........................................................... 58 Interrupt Vector........................................................... 53 Look-up Tables........................................................... 56 Map and Stack (diagram) ........................................... 53 Reset Vector............................................................... 53 Program Verification and Code Protection ....................... 263 Associated Registers................................................ 263 Programming, Device Instructions.................................... 267 PSP. See Parallel Slave Port. Pulse-Width Modulation. See PWM (CCP Module) and PWM (ECCP Module). PUSH................................................................................ 296 PUSH and POP Instructions............................................... 55 PUSHL.............................................................................. 312 DS39631E-page 403 © 2008 Microchip Technology Inc. PIC18F2420/2520/4420/4520 PWM (CCP Module) Associated Registers ................................................146 Auto-Shutdown (CCP1 Only) ....................................145 Duty Cycle.................................................................144 Example Frequencies/Resolutions............................145 Period........................................................................144 Setup for PWM Operation .........................................145 TMR2 to PR2 Match..................................................144 PWM (ECCP Module) .......................................................149 CCPR1H:CCPR1L Registers ....................................149 Direction Change in Full-Bridge Output Mode .....................................................154 Duty Cycle.................................................................150 Effects of a Reset......................................................159 Enhanced PWM Auto-Shutdown...............................156 Example Frequencies/Resolutions............................150 Full-Bridge Mode.......................................................153 Full-Bridge Output Mode Application Example .........154 Half-Bridge Mode ......................................................152 Half-Bridge Output Mode Applications Example .......152 Operation in Power-Managed Modes .......................159 Operation with Fail-Safe Clock Monitor.....................159 Output Configurations ...............................................150 Output Relationships (Active-High) ...........................151 Output Relationships (Active-Low)............................151 Period........................................................................149 Programmable Dead-Band Delay .............................156 Setup for PWM Operation .........................................159 Start-up Considerations ............................................158 TMR2 to PR2 Match..................................................149 Q Q Clock......................................................................145, 150 R RAM. See Data Memory. RBIF Bit.............................................................................108 RC Oscillator .......................................................................25 RCIO Oscillator Mode .................................................25 RC_IDLE Mode ...................................................................39 RC_RUN Mode ...................................................................35 RCALL...............................................................................297 RCON Register Bit Status During Initialization .....................................48 Reader Response .............................................................408 Register File ........................................................................62 Register File Summary..................................................64–66 Registers ADCON0 (A/D Control 0) ..........................................223 ADCON1 (A/D Control 1) ..........................................224 ADCON2 (A/D Control 2) ..........................................225 BAUDCON (Baud Rate Control) ...............................204 CCP1CON (ECCP Control, 40/44-Pin Devices)............................................147 CCPxCON (CCPx Control, 28-Pin Devices) .............139 CMCON (Comparator Control)..................................233 CONFIG1H (Configuration 1 High) ...........................250 CONFIG2H (Configuration 2 High) ...........................252 CONFIG2L (Configuration 2 Low).............................251 CONFIG3H (Configuration 3 High) ...........................253 CONFIG4L (Configuration 4 Low).............................253 CONFIG5H (Configuration 5 High) ...........................254 CONFIG5L (Configuration 5 Low).............................254 CONFIG6H (Configuration 6 High) ...........................255 CONFIG6L (Configuration 6 Low).............................255 CONFIG7H (Configuration 7 High) ...........................256 CONFIG7L (Configuration 7 Low) ............................ 256 CVRCON (Comparator Voltage Reference Control) ........................................... 239 DEVID1 (Device ID 1)............................................... 257 DEVID2 (Device ID 2)............................................... 257 ECCP1AS (ECCP Auto-Shutdown Control) ............. 157 EECON1 (EEPROM Control 1) ............................ 75, 84 HLVDCON (High/Low-Voltage Detect Control) ........ 243 INTCON (Interrupt Control)......................................... 93 INTCON2 (Interrupt Control 2).................................... 94 INTCON3 (Interrupt Control 3).................................... 95 IPR1 (Peripheral Interrupt Priority 1) ........................ 100 IPR2 (Peripheral Interrupt Priority 2) ........................ 101 OSCCON (Oscillator Control) ..................................... 30 OSCTUNE (Oscillator Tuning).................................... 27 PIE1 (Peripheral Interrupt Enable 1)........................... 98 PIE2 (Peripheral Interrupt Enable 2)........................... 99 PIR1 (Peripheral Interrupt Request (Flag) 1).............. 96 PIR2 (Peripheral Interrupt Request (Flag) 2).............. 97 PWM1CON (PWM Dead-Band Delay) ..................... 156 RCON (Reset Control)........................................ 42, 102 RCSTA (Receive Status and Control) ...................... 203 SSPCON1 (MSSP Control 1, I2C Mode) .................. 172 SSPCON1 (MSSP Control 1, SPI Mode).................. 163 SSPCON2 (MSSP Control 2, I2C Mode) .................. 173 SSPSTAT (MSSP Status, I2C Mode) ....................... 171 SSPSTAT (MSSP Status, SPI Mode)....................... 162 STATUS...................................................................... 67 STKPTR (Stack Pointer)............................................. 55 T0CON (Timer0 Control) .......................................... 123 T1CON (Timer1 Control) .......................................... 127 T2CON (Timer2 Control) .......................................... 133 T3CON (Timer3 Control) .......................................... 135 TRISE (PORTE/PSP Control)................................... 118 TXSTA (Transmit Status and Control) ...................... 202 WDTCON (Watchdog Timer Control) ....................... 259 RESET.............................................................................. 297 Reset State of Registers..................................................... 48 Resets......................................................................... 41, 249 Brown-out Reset (BOR)............................................ 249 Oscillator Start-up Timer (OST) ................................ 249 Power-on Reset (POR)............................................. 249 Power-up Timer (PWRT) .......................................... 249 RETFIE ............................................................................. 298 RETLW ............................................................................. 298 RETURN........................................................................... 299 Return Address Stack ......................................................... 54 Return Stack Pointer (STKPTR) ......................................... 55 Revision History................................................................ 395 RLCF................................................................................. 299 RLNCF.............................................................................. 300 RRCF................................................................................ 300 RRNCF ............................................................................. 301 S SCK................................................................................... 161 SDI.................................................................................... 161 SDO .................................................................................. 161 SEC_IDLE Mode................................................................. 38 SEC_RUN Mode................................................................. 34 Serial Clock, SCK ............................................................. 161 Serial Data In (SDI)........................................................... 161 Serial Data Out (SDO) ...................................................... 161 Serial Peripheral Interface. See SPI Mode. SETF................................................................................. 301 Slave Select (SS).............................................................. 161 PIC18F2420/2520/4420/4520 DS39631E-page 404 © 2008 Microchip Technology Inc. Slave Select Synchronization............................................ 167 SLEEP............................................................................... 302 Sleep OSC1 and OSC2 Pin States ....................................... 31 Software Simulator (MPLAB SIM)..................................... 318 Special Event Trigger. See Compare (ECCP Mode). Special Event Trigger. See Compare (ECCP Module). Special Features of the CPU............................................. 249 Special Function Registers Map ............................................................................. 63 SPI Mode (MSSP) Associated Registers ................................................ 169 Bus Mode Compatibility ............................................ 169 Effects of a Reset...................................................... 169 Enabling SPI I/O ....................................................... 165 Master Mode ............................................................. 166 Master/Slave Connection.......................................... 165 Operation .................................................................. 164 Operation in Power-Managed Modes ....................... 169 Serial Clock............................................................... 161 Serial Data In ............................................................ 161 Serial Data Out ......................................................... 161 Slave Mode ............................................................... 167 Slave Select .............................................................. 161 Slave Select Synchronization ................................... 167 SPI Clock .................................................................. 166 Typical Connection ...................................................165 SS ..................................................................................... 161 SSPOV.............................................................................. 191 SSPOV Status Flag........................................................... 191 SSPSTAT Register R/W Bit.............................................................. 174, 175 Stack Full/Underflow Resets ............................................... 56 STATUS Register................................................................ 67 SUBFSR............................................................................ 313 SUBFWB........................................................................... 302 SUBLW ............................................................................. 303 SUBULNK ......................................................................... 313 SUBWF ............................................................................. 303 SUBWFB........................................................................... 304 SWAPF ............................................................................. 304 T Table Pointer Operations with TBLRD and TBLWT .................................................... 76 Table Reads/Table Writes...................................................56 TBLRD .............................................................................. 305 TBLWT.............................................................................. 306 Time-out in Various Situations (table)................................. 45 Timer0............................................................................... 123 Associated Registers ................................................ 125 Operation .................................................................. 124 Overflow Interrupt ..................................................... 125 Prescaler................................................................... 125 Prescaler Assignment (PSA Bit) ............................... 125 Prescaler Select (T0PS2:T0PS0 Bits) ...................... 125 Prescaler. See Prescaler, Timer0. Reads and Writes in 16-Bit Mode ............................. 124 Source Edge Select (T0SE Bit)................................. 124 Source Select (T0CS Bit).......................................... 124 Switching Prescaler Assignment............................... 125 Timer1............................................................................... 127 16-Bit Read/Write Mode ........................................... 129 Associated Registers................................................ 132 Considerations in Asynchronous Counter Mode................................................... 131 Interrupt .................................................................... 130 Operation.................................................................. 128 Oscillator........................................................... 127, 129 Oscillator Layout Considerations.............................. 130 Overflow Interrupt ..................................................... 127 Resetting, Using the CCP Special Event Trigger.................................................... 130 Special Event Trigger (ECCP).................................. 148 TMR1H Register....................................................... 127 TMR1L Register........................................................ 127 Use as a Real-Time Clock........................................ 130 Timer2............................................................................... 133 Associated Registers................................................ 134 Interrupt .................................................................... 134 Operation.................................................................. 133 Output....................................................................... 134 PR2 Register .................................................... 144, 149 TMR2 to PR2 Match Interrupt........................... 144, 149 Timer3............................................................................... 135 16-Bit Read/Write Mode ........................................... 137 Associated Registers................................................ 137 Operation.................................................................. 136 Oscillator........................................................... 135, 137 Overflow Interrupt ............................................. 135, 137 Special Event Trigger (CCP) .................................... 137 TMR3H Register....................................................... 135 TMR3L Register........................................................ 135 Timing Diagrams A/D Conversion......................................................... 360 Acknowledge Sequence ........................................... 194 Asynchronous Reception.......................................... 214 Asynchronous Transmission..................................... 212 Asynchronous Transmission (Back to Back) ............ 212 Automatic Baud Rate Calculation............................. 210 Auto-Wake-up Bit (WUE) During Normal Operation ............................................. 215 Auto-Wake-up Bit (WUE) During Sleep.................... 215 Baud Rate Generator with Clock Arbitration............. 188 BRG Overflow Sequence.......................................... 210 BRG Reset Due to SDA Arbitration During Start Condition ...................................... 197 Brown-out Reset (BOR)............................................ 345 Bus Collision During a Repeated Start Condition (Case 1) ................................... 198 Bus Collision During a Repeated Start Condition (Case 2) ................................... 198 Bus Collision During a Start Condition (SCL = 0).......................................... 197 Bus Collision During a Stop Condition (Case 1)............................................ 199 Bus Collision During a Stop Condition (Case 2)............................................ 199 Bus Collision During Start Condition (SDA only)........................................ 196 Bus Collision for Transmit and Acknowledge ........... 195 Capture/Compare/PWM (All CCP Modules)............. 347 DS39631E-page 405 © 2008 Microchip Technology Inc. PIC18F2420/2520/4420/4520 CLKO and I/O............................................................344 Clock Synchronization...............................................181 Clock/Instruction Cycle................................................57 EUSART Synchronous Receive (Master/Slave)...................................................359 EUSART Synchronous Transmission (Master/Slave)...................................................358 Example SPI Master Mode (CKE = 0).......................349 Example SPI Master Mode (CKE = 1).......................350 Example SPI Slave Mode (CKE = 0).........................351 Example SPI Slave Mode (CKE = 1).........................353 External Clock (All Modes Except PLL) ....................342 Fail-Safe Clock Monitor (FSCM) ...............................262 First Start Bit Timing..................................................189 Full-Bridge PWM Output ...........................................153 Half-Bridge PWM Output...........................................152 High/Low-Voltage Detect Characteristics..................339 High-Voltage Detect Operation (VDIRMAG = 1).......246 I 2C Bus Data .............................................................354 I 2C Bus Start/Stop Bits..............................................354 I 2C Master Mode (7 or 10-Bit Transmission).............192 I 2C Master Mode (7-Bit Reception) ...........................193 I 2C Slave Mode (10-Bit Reception, SEN = 0)............178 I 2C Slave Mode (10-Bit Reception, SEN = 1)............183 I 2C Slave Mode (10-Bit Transmission)......................179 I 2C Slave Mode (7-Bit Reception, SEN = 0)..............176 I 2C Slave Mode (7-Bit Reception, SEN = 1)..............182 I 2C Slave Mode (7-Bit Transmission)........................177 I 2C Slave Mode General Call Address Sequence (7 or 10-Bit Addressing Mode).........184 I 2C Stop Condition Receive or Transmit Mode .........194 Low-Voltage Detect Operation (VDIRMAG = 0)........245 Master SSP I2C Bus Data .........................................356 Master SSP I2C Bus Start/Stop Bits..........................356 Parallel Slave Port (PIC18F4420/4520) ....................348 Parallel Slave Port (PSP) Read ................................121 Parallel Slave Port (PSP) Write.................................121 PWM Auto-Shutdown (PRSEN = 0, Auto-Restart Disabled)......................................158 PWM Auto-Shutdown (PRSEN = 1, Auto-Restart Enabled).......................................158 PWM Direction Change.............................................155 PWM Direction Change at Near 100% Duty Cycle...............................................155 PWM Output..............................................................144 Repeated Start Condition..........................................190 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer .....................................345 Send Break Character Sequence .............................216 Slave Synchronization...............................................167 Slow Rise Time (MCLR Tied to VDD, VDD Rise > TPWRT) .............................................47 SPI Mode (Master Mode) ..........................................166 SPI Mode (Slave Mode, CKE = 0).............................168 SPI Mode (Slave Mode, CKE = 1).............................168 Synchronous Reception (Master Mode, SREN)........219 Synchronous Transmission.......................................217 Synchronous Transmission (Through TXEN) ...........218 Time-out Sequence on POR w/PLL Enabled (MCLR Tied to VDD)............................................47 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 1) ........................46 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 2) ........................46 Time-out Sequence on Power-up (MCLR Tied to VDD, VDD Rise < TPWRT) ............ 46 Timer0 and Timer1 External Clock ........................... 346 Transition for Entry to Idle Mode................................. 38 Transition for Entry to SEC_RUN Mode ..................... 35 Transition for Entry to Sleep Mode ............................. 37 Transition for Two-Speed Start-up (INTOSC to HSPLL) ......................................... 260 Transition for Wake from Idle to Run Mode ........................................................... 38 Transition for Wake from Sleep (HSPLL) ................... 37 Transition from RC_RUN Mode to PRI_RUN Mode.................................................. 36 Transition from SEC_RUN Mode to PRI_RUN Mode (HSPLL) ................................... 35 Transition to RC_RUN Mode ...................................... 36 Timing Diagrams and Specifications................................. 342 A/D Conversion Requirements ................................. 360 Capture/Compare/PWM (CCP) Requirements ................................................... 347 CLKO and I/O Requirements.................................... 344 EUSART Synchronous Receive Requirements ................................................... 359 EUSART Synchronous Transmission Requirements ................................................... 358 Example SPI Mode Requirements (Master Mode, CKE = 0)................................... 349 Example SPI Mode Requirements (Master Mode, CKE = 1)................................... 350 Example SPI Mode Requirements (Slave Mode, CKE = 0)..................................... 352 Example SPI Mode Requirements (Slave Mode, CKE = 1)..................................... 353 External Clock Requirements ................................... 342 I 2C Bus Data Requirements (Slave Mode) ............... 355 Master SSP I2C Bus Data Requirements ................................................... 357 Master SSP I2C Bus Start/Stop Bits Requirements ................................................... 356 Parallel Slave Port Requirements (PIC18F4420/4520) .......................................... 348 PLL Clock ................................................................. 343 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements......................................... 345 Timer0 and Timer1 External Clock Requirements ................................................... 346 Top-of-Stack Access........................................................... 54 TRISE Register PSPMODE Bit........................................................... 114 TSTFSZ ............................................................................ 307 Two-Speed Start-up.................................................. 249, 260 Two-Word Instructions Example Cases........................................................... 58 TXSTA Register BRGH Bit .................................................................. 205 V Voltage Reference Specifications..................................... 338 PIC18F2420/2520/4420/4520 DS39631E-page 406 © 2008 Microchip Technology Inc. W Watchdog Timer (WDT) ............................................ 249, 258 Associated Registers ................................................ 259 Control Register ........................................................ 258 During Oscillator Failure ........................................... 261 Programming Considerations ................................... 258 WCOL ....................................................... 189, 190, 191, 194 WCOL Status Flag .................................... 189, 190, 191, 194 WWW Address.................................................................. 407 WWW, On-Line Support........................................................ 6 X XORLW............................................................................. 307 XORWF ............................................................................ 308 © 2008 Microchip Technology Inc. DS39631E-page 407 PIC18F2420/2520/4420/4520 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com PIC18F2420/2520/4420/4520 DS39631E-page 408 © 2008 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC18F2420/2520/4420/4520 DS39631E 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? © 2008 Microchip Technology Inc. Advance Information DS39631E-page 409 PIC18F2420/2520/4420/4520 PIC18F2420/2520/4420/4520 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Temperature Package Pattern Range Device Device PIC18F2420/2520(1), PIC18F4420/4520(1), PIC18F2420/2520T(2), PIC18F4420/4520T(2); VDD range 4.2V to 5.5V PIC18LF2420/2520(1), PIC18LF4420/4520(1), PIC18LF2420/2520T(2), PIC18LF4420/4520T(2); VDD range 2.0V to 5.5V Temperature Range I = -40°C to +85°C (Industrial) E = -40°C to +125°C (Extended) Package PT = TQFP (Thin Quad Flatpack) SO = SOIC SP = Skinny Plastic DIP P = PDIP ML = QFN Pattern QTP, SQTP, Code or Special Requirements (blank otherwise) Examples: a) PIC18LF4520-I/P 301 = Industrial temp., PDIP package, Extended VDD limits, QTP pattern #301. b) PIC18LF2420-I/SO = Industrial temp., SOIC package, Extended VDD limits. c) PIC18F4420-I/P = Industrial temp., PDIP package, normal VDD limits. Note 1: F = Standard Voltage Range LF = Wide Voltage Range 2: T = in tape and reel TQFP packages only. DS39631E-page 410 © 2008 Microchip Technology Inc. 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DS39582C-page 1 PIC16F87XA Devices Included in this Data Sheet: High-Performance RISC CPU: • Only 35 single-word instructions to learn • All single-cycle instructions except for program branches, which are two-cycle • Operating speed: DC – 20 MHz clock input DC – 200 ns instruction cycle • Up to 8K x 14 words of Flash Program Memory, Up to 368 x 8 bytes of Data Memory (RAM), Up to 256 x 8 bytes of EEPROM Data Memory • Pinout compatible to other 28-pin or 40/44-pin PIC16CXXX and PIC16FXXX microcontrollers Peripheral Features: • Timer0: 8-bit timer/counter with 8-bit prescaler • Timer1: 16-bit timer/counter with prescaler, can be incremented during Sleep via external crystal/clock • Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler • Two Capture, Compare, PWM modules - Capture is 16-bit, max. resolution is 12.5 ns - Compare is 16-bit, max. resolution is 200 ns - PWM max. resolution is 10-bit • Synchronous Serial Port (SSP) with SPI (Master mode) and I2C™ (Master/Slave) • Universal Synchronous Asynchronous Receiver Transmitter (USART/SCI) with 9-bit address detection • Parallel Slave Port (PSP) – 8 bits wide with external RD, WR and CS controls (40/44-pin only) • Brown-out detection circuitry for Brown-out Reset (BOR) Analog Features: • 10-bit, up to 8-channel Analog-to-Digital Converter (A/D) • Brown-out Reset (BOR) • Analog Comparator module with: - Two analog comparators - Programmable on-chip voltage reference (VREF) module - Programmable input multiplexing from device inputs and internal voltage reference - Comparator outputs are externally accessible Special Microcontroller Features: • 100,000 erase/write cycle Enhanced Flash program memory typical • 1,000,000 erase/write cycle Data EEPROM memory typical • Data EEPROM Retention > 40 years • Self-reprogrammable under software control • In-Circuit Serial Programming™ (ICSP™) via two pins • Single-supply 5V In-Circuit Serial Programming • Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation • Programmable code protection • Power saving Sleep mode • Selectable oscillator options • In-Circuit Debug (ICD) via two pins CMOS Technology: • Low-power, high-speed Flash/EEPROM technology • Fully static design • Wide operating voltage range (2.0V to 5.5V) • Commercial and Industrial temperature ranges • Low-power consumption • PIC16F873A • PIC16F874A • PIC16F876A • PIC16F877A Device Program Memory Data SRAM (Bytes) EEPROM (Bytes) I/O 10-bit A/D (ch) CCP (PWM) MSSP USART Timers 8/16-bit Comparators Bytes # Single Word Instructions SPI Master I 2C PIC16F873A 7.2K 4096 192 128 22 5 2 Yes Yes Yes 2/1 2 PIC16F874A 7.2K 4096 192 128 33 8 2 Yes Yes Yes 2/1 2 PIC16F876A 14.3K 8192 368 256 22 5 2 Yes Yes Yes 2/1 2 PIC16F877A 14.3K 8192 368 256 33 8 2 Yes Yes Yes 2/1 2 28/40/44-Pin Enhanced Flash Microcontrollers PIC16F87XA DS39582C-page 2  2001-2013 Microchip Technology Inc. Pin Diagrams PIC16F873A/876A 10 11 2 3 4 5 6 1 8 7 9 12 13 14 15 16 17 18 19 20 23 24 25 26 27 28 22 21 MCLR/VPP RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT VSS OSC1/CLKI OSC2/CLKO RC0/T1OSO/T1CKI RC1/T1OSI/CCP2 RC2/CCP1 RC3/SCK/SCL RB7/PGD RB6/PGC RB5 RB4 RB3/PGM RB2 RB1 RB0/INT VDD VSS RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA 28-Pin PDIP, SOIC, SSOP 2 3 4 5 6 1 7 MCLR/VPP RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT VSS OSC1/CLKI 15 16 17 18 19 20 21 RB3/PGM VDD VSS RB0/INT RC7/RX/DT RC1/T1OSI/CCP2 RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK 28 27 26 25 24 23 22 RA1/AN1 RA0/AN0 RB7/PGD RB6/PGC RB5 RB4 8 9 10 11 12 13 14 28-Pin QFN PIC16F873A PIC16F876A RB2 RB1 RC0/T1OSO/T1CKI OSC2/CLKO 10 11 2 3 4 5 6 1 12 13 14 15 18 19 20 21 22 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 35 34 9 PIC16F874A37 RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA0/AN0 RA1/AN1 MCLR/VPP RB3/PGM RB6/PGC RB7/PGD RB4 RB5 NC RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 RD1/PSP1 RD0/PSP0 RC3/SCK/SCL RC2/CCP1 RC1/T1OSI/CCP2 RC0/T1OSO/T1CKI OSC2/CLKO OSC1/CLKI VSS VSS VDD VDD RE2/CS/AN7 RE1/WR/AN6 RE0/RD/AN5 RA5/AN4/SS/C2OUT RA4/T0CKI/C1OUT RC7/RX/DT RD4/PSP4 RD5/PSP5 RD6/PSP6 RD7/PSP7 VSS VDD VDD RB0/INT RB1 RB2 44-Pin QFN PIC16F877A  2001-2013 Microchip Technology Inc. DS39582C-page 3 PIC16F87XA Pin Diagrams (Continued) RB7/PGD RB6/PGC RB5 RB4 RB3/PGM RB2 RB1 RB0/INT VDD VSS RD7/PSP7 RD6/PSP6 RD5/PSP5 RD4/PSP4 RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 MCLR/VPP RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT RE0/RD/AN5 RE1/WR/AN6 RE2/CS/AN7 VDD VSS OSC1/CLKI OSC2/CLKO RC0/T1OSO/T1CKI RC1/T1OSI/CCP2 RC2/CCP1 RC3/SCK/SCL RD0/PSP0 RD1/PSP1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 PIC16F874A/877A 40-Pin PDIP 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 44 8 7 6 5 4 3 2 1 27 28 29 30 31 32 33 34 35 36 37 38 39 43 42 41 40 9 PIC16F874A RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT RE0/RD/AN5 OSC1/CLKI OSC2/CLKO RC0/T1OSO/T1CK1 NC RE1/WR/AN6 RE2/CS/AN7 VDD VSS RB3/PGM RB2 RB1 RB0/INT VDD VSS RD7/PSP7 RD6/PSP6 RD5/PSP5 RD4/PSP4 RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 MCLR/VPP NC RB7/PGD RB6/PGC RB5 RB4 NC NC RC6/TX/CK RC5/SDO RC4/SDI/SDA RD0/PSP0 RD1/PSP1 RD2/PSP2 RD3/PSP3 RC3/SCK/SCL RC2/CCP1 RC1/T1OSI/CCP2 10 11 2 3 4 5 6 1 12 13 14 15 18 19 20 21 22 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 35 34 9 PIC16F874A37 RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA0/AN0 RA1/AN1 MCLR/VPP NC RB6/PGC RB7/PGD RB4 RB5 NC RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 RD1/PSP1 RD0/PSP0 RC3/SCK/SCL RC2/CCP1 RC1/T1OSI/CCP2 NC NC RC0/T1OSO/T1CKI OSC2/CLKO OSC1/CLKI VSS VDD RE2/CS/AN7 RE1/WR/AN6 RE0/RD/AN5 RA5/AN4/SS/C2OUT RA4/T0CKI/C1OUT RC7/RX/DT RD4/PSP4 RD5/PSP5 RD6/PSP6 RD7/PSP7 VSS VDD RB0/INT RB1 RB2 RB3/PGM 44-Pin PLCC 44-Pin TQFP PIC16F877A PIC16F877A RC7/RX/DT PIC16F87XA DS39582C-page 4  2001-2013 Microchip Technology Inc. Table of Contents 1.0 Device Overview......................................................................................................................................................................... 5 2.0 Memory Organization................................................................................................................................................................ 15 3.0 Data EEPROM and Flash Program Memory ............................................................................................................................ 33 4.0 I/O Ports.................................................................................................................................................................................... 41 5.0 Timer0 Module.......................................................................................................................................................................... 53 6.0 Timer1 Module.......................................................................................................................................................................... 57 7.0 Timer2 Module.......................................................................................................................................................................... 61 8.0 Capture/Compare/PWM Modules............................................................................................................................................. 63 9.0 Master Synchronous Serial Port (MSSP) Module..................................................................................................................... 71 10.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART) ............................................................ 111 11.0 Analog-to-Digital Converter (A/D) Module .............................................................................................................................. 127 12.0 Comparator Module ................................................................................................................................................................ 135 13.0 Comparator Voltage Reference Module ................................................................................................................................. 141 14.0 Special Features of the CPU .................................................................................................................................................. 143 15.0 Instruction Set Summary......................................................................................................................................................... 159 16.0 Development Support ............................................................................................................................................................. 167 17.0 Electrical Characteristics......................................................................................................................................................... 173 18.0 DC and AC Characteristics Graphs and Tables ..................................................................................................................... 197 19.0 Packaging Information ............................................................................................................................................................ 209 Appendix A: Revision History ............................................................................................................................................................ 219 Appendix B: Device Differences........................................................................................................................................................ 219 Appendix C: Conversion Considerations........................................................................................................................................... 220 Index ................................................................................................................................................................................................. 221 On-Line Support................................................................................................................................................................................ 229 Systems Information and Upgrade Hot Line ..................................................................................................................................... 229 Reader Response ............................................................................................................................................................................. 230 PIC16F87XA Product Identification System...................................................................................................................................... 231 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@mail.microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) • The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our Web site at www.microchip.com/cn to receive the most current information on all of our products.  2001-2013 Microchip Technology Inc. DS39582C-page 5 PIC16F87XA 1.0 DEVICE OVERVIEW This document contains device specific information about the following devices: • PIC16F873A • PIC16F874A • PIC16F876A • PIC16F877A PIC16F873A/876A devices are available only in 28-pin packages, while PIC16F874A/877A devices are available in 40-pin and 44-pin packages. All devices in the PIC16F87XA family share common architecture with the following differences: • The PIC16F873A and PIC16F874A have one-half of the total on-chip memory of the PIC16F876A and PIC16F877A • The 28-pin devices have three I/O ports, while the 40/44-pin devices have five • The 28-pin devices have fourteen interrupts, while the 40/44-pin devices have fifteen • The 28-pin devices have five A/D input channels, while the 40/44-pin devices have eight • The Parallel Slave Port is implemented only on the 40/44-pin devices The available features are summarized in Table 1-1. Block diagrams of the PIC16F873A/876A and PIC16F874A/877A devices are provided in Figure 1-1 and Figure 1-2, respectively. The pinouts for these device families are listed in Table 1-2 and Table 1-3. Additional information may be found in the PIC® MidRange Reference Manual (DS33023), which may be obtained from your local Microchip Sales Representative or downloaded from the Microchip web site. The Reference Manual should be considered a complementary document to this data sheet and is highly recommended reading for a better understanding of the device architecture and operation of the peripheral modules. TABLE 1-1: PIC16F87XA DEVICE FEATURES Key Features PIC16F873A PIC16F874A PIC16F876A PIC16F877A Operating Frequency DC – 20 MHz DC – 20 MHz DC – 20 MHz DC – 20 MHz Resets (and Delays) POR, BOR (PWRT, OST) POR, BOR (PWRT, OST) POR, BOR (PWRT, OST) POR, BOR (PWRT, OST) Flash Program Memory (14-bit words) 4K 4K 8K 8K Data Memory (bytes) 192 192 368 368 EEPROM Data Memory (bytes) 128 128 256 256 Interrupts 14 15 14 15 I/O Ports Ports A, B, C Ports A, B, C, D, E Ports A, B, C Ports A, B, C, D, E Timers 3 3 3 3 Capture/Compare/PWM modules 2 2 2 2 Serial Communications MSSP, USART MSSP, USART MSSP, USART MSSP, USART Parallel Communications — PSP — PSP 10-bit Analog-to-Digital Module 5 input channels 8 input channels 5 input channels 8 input channels Analog Comparators 2 2 2 2 Instruction Set 35 Instructions 35 Instructions 35 Instructions 35 Instructions Packages 28-pin PDIP 28-pin SOIC 28-pin SSOP 28-pin QFN 40-pin PDIP 44-pin PLCC 44-pin TQFP 44-pin QFN 28-pin PDIP 28-pin SOIC 28-pin SSOP 28-pin QFN 40-pin PDIP 44-pin PLCC 44-pin TQFP 44-pin QFN PIC16F87XA DS39582C-page 6  2001-2013 Microchip Technology Inc. FIGURE 1-1: PIC16F873A/876A BLOCK DIAGRAM Flash 13 Data Bus 8 14 Program Bus Instruction reg Program Counter 8 Level Stack (13-bit) RAM File Registers Direct Addr 7 RAM Addr(1) 9 Addr MUX Indirect Addr FSR reg Status reg MUX ALU W reg Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer Instruction Decode & Control Timing Generation OSC1/CLKI OSC2/CLKO MCLR VDD, VSS PORTA PORTB PORTC RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT RB0/INT RC0/T1OSO/T1CKI RC1/T1OSI/CCP2 RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT 8 8 Brown-out Reset Note 1: Higher order bits are from the Status register. CCP1,2 USART Synchronous Timer0 Timer1 Timer2 10-bit A/D Serial Port RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 8 3 Data EEPROM RB1 RB2 RB3/PGM RB4 RB5 RB6/PGC RB7/PGD In-Circuit Debugger Low-Voltage Programming Comparator Voltage Reference Device Program Flash Data Memory Data EEPROM PIC16F873A 4K words 192 Bytes 128 Bytes PIC16F876A 8K words 368 Bytes 256 Bytes Program Memory  2001-2013 Microchip Technology Inc. DS39582C-page 7 PIC16F87XA FIGURE 1-2: PIC16F874A/877A BLOCK DIAGRAM 13 Data Bus 8 14 Program Bus Instruction reg Program Counter 8 Level Stack (13-bit) RAM File Registers Direct Addr 7 RAM Addr(1) 9 Addr MUX Indirect Addr FSR reg Status reg MUX ALU W reg Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer Instruction Decode & Control Timing Generation OSC1/CLKI OSC2/CLKO MCLR VDD, VSS PORTA PORTB PORTC PORTD PORTE RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT RC0/T1OSO/T1CKI RC1/T1OSI/CCP2 RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT RE0/RD/AN5 RE1/WR/AN6 RE2/CS/AN7 8 8 Brown-out Reset Note 1: Higher order bits are from the Status register. RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 Parallel 8 3 RB0/INT RB1 RB2 RB3/PGM RB4 RB5 RB6/PGC RB7/PGD In-Circuit Debugger Low-Voltage Programming RD0/PSP0 RD1/PSP1 RD2/PSP2 RD3/PSP3 RD4/PSP4 RD5/PSP5 RD6/PSP6 RD7/PSP7 CCP1,2 USART Synchronous Timer0 Timer1 Timer2 10-bit A/D Serial Port Data EEPROM Comparator Voltage Reference Device Program Flash Data Memory Data EEPROM PIC16F874A 4K words 192 Bytes 128 Bytes PIC16F877A 8K words 368 Bytes 256 Bytes Flash Program Memory Slave Port PIC16F87XA DS39582C-page 8  2001-2013 Microchip Technology Inc. TABLE 1-2: PIC16F873A/876A PINOUT DESCRIPTION Pin Name PDIP, SOIC, SSOP Pin# QFN Pin# I/O/P Type Buffer Type Description OSC1/CLKI OSC1 CLKI 9 6 I I ST/CMOS(3) Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode; otherwise CMOS. External clock source input. Always associated with pin function OSC1 (see OSC1/CLKI, OSC2/CLKO pins). OSC2/CLKO OSC2 CLKO 10 7 O O — Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO, which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. MCLR/VPP MCLR VPP 1 26 I P ST Master Clear (input) or programming voltage (output). Master Clear (Reset) input. This pin is an active low Reset to the device. Programming voltage input. PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 2 27 I/O I TTL Digital I/O. Analog input 0. RA1/AN1 RA1 AN1 3 28 I/O I TTL Digital I/O. Analog input 1. RA2/AN2/VREF-/ CVREF RA2 AN2 VREFCVREF 4 1 I/O I I O TTL Digital I/O. Analog input 2. A/D reference voltage (Low) input. Comparator VREF output. RA3/AN3/VREF+ RA3 AN3 VREF+ 5 2 I/O I I TTL Digital I/O. Analog input 3. A/D reference voltage (High) input. RA4/T0CKI/C1OUT RA4 T0CKI C1OUT 6 3 I/O I O ST Digital I/O – Open-drain when configured as output. Timer0 external clock input. Comparator 1 output. RA5/AN4/SS/C2OUT RA5 AN4 SS C2OUT 7 4 I/O I I O TTL Digital I/O. Analog input 4. SPI slave select input. Comparator 2 output. Legend: I = input O = output I/O = input/output P = power — = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.  2001-2013 Microchip Technology Inc. DS39582C-page 9 PIC16F87XA PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT RB0 INT 21 18 I/O I TTL/ST(1) Digital I/O. External interrupt. RB1 22 19 I/O TTL Digital I/O. RB2 23 20 I/O TTL Digital I/O. RB3/PGM RB3 PGM 24 21 I/O I TTL Digital I/O. Low-voltage (single-supply) ICSP programming enable pin. RB4 25 22 I/O TTL Digital I/O. RB5 26 23 I/O TTL Digital I/O. RB6/PGC RB6 PGC 27 24 I/O I TTL/ST(2) Digital I/O. In-circuit debugger and ICSP programming clock. RB7/PGD RB7 PGD 28 25 I/O I/O TTL/ST(2) Digital I/O. In-circuit debugger and ICSP programming data. PORTC is a bidirectional I/O port. RC0/T1OSO/T1CKI RC0 T1OSO T1CKI 11 8 I/O O I ST Digital I/O. Timer1 oscillator output. Timer1 external clock input. RC1/T1OSI/CCP2 RC1 T1OSI CCP2 12 9 I/O I I/O ST Digital I/O. Timer1 oscillator input. Capture2 input, Compare2 output, PWM2 output. RC2/CCP1 RC2 CCP1 13 10 I/O I/O ST Digital I/O. Capture1 input, Compare1 output, PWM1 output. RC3/SCK/SCL RC3 SCK SCL 14 11 I/O I/O I/O ST Digital I/O. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I2C mode. RC4/SDI/SDA RC4 SDI SDA 15 12 I/O I I/O ST Digital I/O. SPI data in. I 2C data I/O. RC5/SDO RC5 SDO 16 13 I/O O ST Digital I/O. SPI data out. RC6/TX/CK RC6 TX CK 17 14 I/O O I/O ST Digital I/O. USART asynchronous transmit. USART1 synchronous clock. RC7/RX/DT RC7 RX DT 18 15 I/O I I/O ST Digital I/O. USART asynchronous receive. USART synchronous data. VSS 8, 19 5, 6 P — Ground reference for logic and I/O pins. VDD 20 17 P — Positive supply for logic and I/O pins. TABLE 1-2: PIC16F873A/876A PINOUT DESCRIPTION (CONTINUED) Pin Name PDIP, SOIC, SSOP Pin# QFN Pin# I/O/P Type Buffer Type Description Legend: I = input O = output I/O = input/output P = power — = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise. PIC16F87XA DS39582C-page 10  2001-2013 Microchip Technology Inc. TABLE 1-3: PIC16F874A/877A PINOUT DESCRIPTION Pin Name PDIP Pin# PLCC Pin# TQFP Pin# QFN Pin# I/O/P Type Buffer Type Description OSC1/CLKI OSC1 CLKI 13 14 30 32 I I ST/CMOS(4) Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode; otherwise CMOS. External clock source input. Always associated with pin function OSC1 (see OSC1/CLKI, OSC2/CLKO pins). OSC2/CLKO OSC2 CLKO 14 15 31 33 O O — Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO, which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. MCLR/VPP MCLR VPP 1 2 18 18 I P ST Master Clear (input) or programming voltage (output). Master Clear (Reset) input. This pin is an active low Reset to the device. Programming voltage input. PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 2 3 19 19 I/O I TTL Digital I/O. Analog input 0. RA1/AN1 RA1 AN1 3 4 20 20 I/O I TTL Digital I/O. Analog input 1. RA2/AN2/VREF-/CVREF RA2 AN2 VREFCVREF 4 5 21 21 I/O I I O TTL Digital I/O. Analog input 2. A/D reference voltage (Low) input. Comparator VREF output. RA3/AN3/VREF+ RA3 AN3 VREF+ 5 6 22 22 I/O I I TTL Digital I/O. Analog input 3. A/D reference voltage (High) input. RA4/T0CKI/C1OUT RA4 T0CKI C1OUT 6 7 23 23 I/O I O ST Digital I/O – Open-drain when configured as output. Timer0 external clock input. Comparator 1 output. RA5/AN4/SS/C2OUT RA5 AN4 SS C2OUT 7 8 24 24 I/O I I O TTL Digital I/O. Analog input 4. SPI slave select input. Comparator 2 output. Legend: I = input O = output I/O = input/output P = power — = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.  2001-2013 Microchip Technology Inc. DS39582C-page 11 PIC16F87XA PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-up on all inputs. RB0/INT RB0 INT 33 36 8 9 I/O I TTL/ST(1) Digital I/O. External interrupt. RB1 34 37 9 10 I/O TTL Digital I/O. RB2 35 38 10 11 I/O TTL Digital I/O. RB3/PGM RB3 PGM 36 39 11 12 I/O I TTL Digital I/O. Low-voltage ICSP programming enable pin. RB4 37 41 14 14 I/O TTL Digital I/O. RB5 38 42 15 15 I/O TTL Digital I/O. RB6/PGC RB6 PGC 39 43 16 16 I/O I TTL/ST(2) Digital I/O. In-circuit debugger and ICSP programming clock. RB7/PGD RB7 PGD 40 44 17 17 I/O I/O TTL/ST(2) Digital I/O. In-circuit debugger and ICSP programming data. TABLE 1-3: PIC16F874A/877A PINOUT DESCRIPTION (CONTINUED) Pin Name PDIP Pin# PLCC Pin# TQFP Pin# QFN Pin# I/O/P Type Buffer Type Description Legend: I = input O = output I/O = input/output P = power — = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise. PIC16F87XA DS39582C-page 12  2001-2013 Microchip Technology Inc. PORTC is a bidirectional I/O port. RC0/T1OSO/T1CKI RC0 T1OSO T1CKI 15 16 32 34 I/O O I ST Digital I/O. Timer1 oscillator output. Timer1 external clock input. RC1/T1OSI/CCP2 RC1 T1OSI CCP2 16 18 35 35 I/O I I/O ST Digital I/O. Timer1 oscillator input. Capture2 input, Compare2 output, PWM2 output. RC2/CCP1 RC2 CCP1 17 19 36 36 I/O I/O ST Digital I/O. Capture1 input, Compare1 output, PWM1 output. RC3/SCK/SCL RC3 SCK SCL 18 20 37 37 I/O I/O I/O ST Digital I/O. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I2C mode. RC4/SDI/SDA RC4 SDI SDA 23 25 42 42 I/O I I/O ST Digital I/O. SPI data in. I 2C data I/O. RC5/SDO RC5 SDO 24 26 43 43 I/O O ST Digital I/O. SPI data out. RC6/TX/CK RC6 TX CK 25 27 44 44 I/O O I/O ST Digital I/O. USART asynchronous transmit. USART1 synchronous clock. RC7/RX/DT RC7 RX DT 26 29 1 1 I/O I I/O ST Digital I/O. USART asynchronous receive. USART synchronous data. TABLE 1-3: PIC16F874A/877A PINOUT DESCRIPTION (CONTINUED) Pin Name PDIP Pin# PLCC Pin# TQFP Pin# QFN Pin# I/O/P Type Buffer Type Description Legend: I = input O = output I/O = input/output P = power — = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.  2001-2013 Microchip Technology Inc. DS39582C-page 13 PIC16F87XA PORTD is a bidirectional I/O port or Parallel Slave Port when interfacing to a microprocessor bus. RD0/PSP0 RD0 PSP0 19 21 38 38 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. RD1/PSP1 RD1 PSP1 20 22 39 39 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. RD2/PSP2 RD2 PSP2 21 23 40 40 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. RD3/PSP3 RD3 PSP3 22 24 41 41 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. RD4/PSP4 RD4 PSP4 27 30 2 2 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. RD5/PSP5 RD5 PSP5 28 31 3 3 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. RD6/PSP6 RD6 PSP6 29 32 4 4 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. RD7/PSP7 RD7 PSP7 30 33 5 5 I/O I/O ST/TTL(3) Digital I/O. Parallel Slave Port data. PORTE is a bidirectional I/O port. RE0/RD/AN5 RE0 RD AN5 8 9 25 25 I/O I I ST/TTL(3) Digital I/O. Read control for Parallel Slave Port. Analog input 5. RE1/WR/AN6 RE1 WR AN6 9 10 26 26 I/O I I ST/TTL(3) Digital I/O. Write control for Parallel Slave Port. Analog input 6. RE2/CS/AN7 RE2 CS AN7 10 11 27 27 I/O I I ST/TTL(3) Digital I/O. Chip select control for Parallel Slave Port. Analog input 7. VSS 12, 31 13, 34 6, 29 6, 30, 31 P — Ground reference for logic and I/O pins. VDD 11, 32 12, 35 7, 28 7, 8, 28, 29 P — Positive supply for logic and I/O pins. NC — 1, 17, 28, 40 12,13, 33, 34 13 — — These pins are not internally connected. These pins should be left unconnected. TABLE 1-3: PIC16F874A/877A PINOUT DESCRIPTION (CONTINUED) Pin Name PDIP Pin# PLCC Pin# TQFP Pin# QFN Pin# I/O/P Type Buffer Type Description Legend: I = input O = output I/O = input/output P = power — = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise. PIC16F87XA DS39582C-page 14  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 15 PIC16F87XA 2.0 MEMORY ORGANIZATION There are three memory blocks in each of the PIC16F87XA devices. The program memory and data memory have separate buses so that concurrent access can occur and is detailed in this section. The EEPROM data memory block is detailed in Section 3.0 “Data EEPROM and Flash Program Memory”. Additional information on device memory may be found in the PIC® Mid-Range MCU Family Reference Manual (DS33023). FIGURE 2-1: PIC16F876A/877A PROGRAM MEMORY MAP AND STACK 2.1 Program Memory Organization The PIC16F87XA devices have a 13-bit program counter capable of addressing an 8K word x 14 bit program memory space. The PIC16F876A/877A devices have 8K words x 14 bits of Flash program memory, while PIC16F873A/874A devices have 4K words x 14 bits. Accessing a location above the physically implemented address will cause a wraparound. The Reset vector is at 0000h and the interrupt vector is at 0004h. FIGURE 2-2: PIC16F873A/874A PROGRAM MEMORY MAP AND STACK PC<12:0> 13 0000h 0004h 0005h Stack Level 1 Stack Level 8 Reset Vector Interrupt Vector On-Chip CALL, RETURN RETFIE, RETLW 1FFFh Stack Level 2 Program Memory Page 0 Page 1 Page 2 Page 3 07FFh 0800h 0FFFh 1000h 17FFh 1800h PC<12:0> 13 0000h 0004h 0005h Stack Level 1 Stack Level 8 Reset Vector Interrupt Vector On-Chip CALL, RETURN RETFIE, RETLW 1FFFh Stack Level 2 Program Memory Page 0 Page 1 07FFh 0800h 0FFFh 1000h PIC16F87XA DS39582C-page 16  2001-2013 Microchip Technology Inc. 2.2 Data Memory Organization The data memory is partitioned into multiple banks which contain the General Purpose Registers and the Special Function Registers. Bits RP1 (Status<6>) and RP0 (Status<5>) are the bank select bits. Each bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the Special Function Registers. Above the Special Function Registers are General Purpose Registers, implemented as static RAM. All implemented banks contain Special Function Registers. Some frequently used Special Function Registers from one bank may be mirrored in another bank for code reduction and quicker access. 2.2.1 GENERAL PURPOSE REGISTER FILE The register file can be accessed either directly, or indirectly, through the File Select Register (FSR). RP1:RP0 Bank 00 0 01 1 10 2 11 3 Note: The EEPROM data memory description can be found in Section 3.0 “Data EEPROM and Flash Program Memory” of this data sheet.  2001-2013 Microchip Technology Inc. DS39582C-page 17 PIC16F87XA FIGURE 2-3: PIC16F876A/877A REGISTER FILE MAP Indirect addr.(*) TMR0 PCL STATUS FSR PORTA PORTB PORTC PCLATH INTCON PIR1 TMR1L TMR1H T1CON TMR2 T2CON SSPBUF SSPCON CCPR1L CCPR1H CCP1CON OPTION_REG PCL STATUS FSR TRISA TRISB TRISC PCLATH INTCON PIE1 PCON PR2 SSPADD SSPSTAT 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh 20h A0h 7Fh FFh Bank 0 Bank 1 Unimplemented data memory locations, read as ‘0’. * Not a physical register. Note 1: These registers are not implemented on the PIC16F876A. 2: These registers are reserved; maintain these registers clear. File Address Indirect addr.(*) Indirect addr.(*) PCL STATUS FSR PCLATH INTCON PCL STATUS FSR PCLATH INTCON 100h 101h 102h 103h 104h 105h 106h 107h 108h 109h 10Ah 10Bh 10Ch 10Dh 10Eh 10Fh 110h 111h 112h 113h 114h 115h 116h 117h 118h 119h 11Ah 11Bh 11Ch 11Dh 11Eh 11Fh 180h 181h 182h 183h 184h 185h 186h 187h 188h 189h 18Ah 18Bh 18Ch 18Dh 18Eh 18Fh 190h 191h 192h 193h 194h 195h 196h 197h 198h 199h 19Ah 19Bh 19Ch 19Dh 19Eh 19Fh 120h 1A0h 17Fh 1FFh Bank 2 Bank 3 Indirect addr.(*) PORTD(1) PORTE(1) TRISD(1) ADRESL TRISE(1) TMR0 OPTION_REG PIR2 PIE2 RCSTA TXREG RCREG CCPR2L CCPR2H CCP2CON ADRESH ADCON0 TXSTA SPBRG ADCON1 General Purpose Register General Purpose Register General Purpose Register General Purpose Register 1EFh 1F0h accesses 70h - 7Fh EFh F0h accesses 70h-7Fh 16Fh 170h accesses 70h-7Fh General Purpose Register General Purpose Register PORTB TRISB 96 Bytes 80 Bytes 80 Bytes 80 Bytes 16 Bytes 16 Bytes SSPCON2 EEDATA EEADR EECON1 EECON2 EEDATH EEADRH Reserved(2) Reserved(2) File Address File Address File Address CMCON CVRCON PIC16F87XA DS39582C-page 18  2001-2013 Microchip Technology Inc. FIGURE 2-4: PIC16F873A/874A REGISTER FILE MAP Indirect addr.(*) TMR0 PCL STATUS FSR PORTA PORTB PORTC PCLATH INTCON PIR1 TMR1L TMR1H T1CON TMR2 T2CON SSPBUF SSPCON CCPR1L CCPR1H CCP1CON OPTION_REG PCL STATUS FSR TRISA TRISB TRISC PCLATH INTCON PIE1 PCON PR2 SSPADD SSPSTAT 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh 20h A0h 7Fh FFh Bank 0 Bank 1 Indirect addr.(*) Indirect addr.(*) PCL STATUS FSR PCLATH INTCON PCL STATUS FSR PCLATH INTCON 100h 101h 102h 103h 104h 105h 106h 107h 108h 109h 10Ah 10Bh 180h 181h 182h 183h 184h 185h 186h 187h 188h 189h 18Ah 18Bh 17Fh 1FFh Bank 2 Bank 3 Indirect addr.(*) PORTD(1) PORTE(1) TRISD(1) ADRESL TRISE(1) TMR0 OPTION_REG PIR2 PIE2 RCSTA TXREG RCREG CCPR2L CCPR2H CCP2CON ADRESH ADCON0 TXSTA SPBRG ADCON1 General Purpose Register General Purpose Register 1EFh 1F0h accesses A0h - FFh 16Fh 170h accesses 20h-7Fh PORTB TRISB 96 Bytes 96 Bytes SSPCON2 10Ch 10Dh 10Eh 10Fh 110h 18Ch 18Dh 18Eh 18Fh 190h EEDATA EEADR EECON1 EECON2 EEDATH EEADRH Reserved(2) Reserved(2) Unimplemented data memory locations, read as ‘0’. * Not a physical register. Note 1: These registers are not implemented on the PIC16F873A. 2: These registers are reserved; maintain these registers clear. 120h 1A0h File Address File Address File Address File Address CMCON CVRCON  2001-2013 Microchip Technology Inc. DS39582C-page 19 PIC16F87XA 2.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral modules for controlling the desired operation of the device. These registers are implemented as static RAM. A list of these registers is given in Table 2-1. The Special Function Registers can be classified into two sets: core (CPU) and peripheral. Those registers associated with the core functions are described in detail in this section. Those related to the operation of the peripheral features are described in detail in the peripheral features section. TABLE 2-1: SPECIAL FUNCTION REGISTER SUMMARY Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Details on page: Bank 0 00h(3) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 31, 150 01h TMR0 Timer0 Module Register xxxx xxxx 55, 150 02h(3) PCL Program Counter (PC) Least Significant Byte 0000 0000 30, 150 03h(3) STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 22, 150 04h(3) FSR Indirect Data Memory Address Pointer xxxx xxxx 31, 150 05h PORTA — — PORTA Data Latch when written: PORTA pins when read --0x 0000 43, 150 06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx 45, 150 07h PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx 47, 150 08h(4) PORTD PORTD Data Latch when written: PORTD pins when read xxxx xxxx 48, 150 09h(4) PORTE — — — — — RE2 RE1 RE0 ---- -xxx 49, 150 0Ah(1,3) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 30, 150 0Bh(3) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 24, 150 0Ch PIR1 PSPIF(3) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 26, 150 0Dh PIR2 — CMIF — EEIF BCLIF — — CCP2IF -0-0 0--0 28, 150 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 60, 150 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 60, 150 10h T1CON — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 57, 150 11h TMR2 Timer2 Module Register 0000 0000 62, 150 12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 61, 150 13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx 79, 150 14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 82, 82, 150 15h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx 63, 150 16h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx 63, 150 17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 64, 150 18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 112, 150 19h TXREG USART Transmit Data Register 0000 0000 118, 150 1Ah RCREG USART Receive Data Register 0000 0000 118, 150 1Bh CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx 63, 150 1Ch CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx 63, 150 1Dh CCP2CON — — CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 64, 150 1Eh ADRESH A/D Result Register High Byte xxxx xxxx 133, 150 1Fh ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE — ADON 0000 00-0 127, 150 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8>, whose contents are transferred to the upper byte of the program counter. 2: Bits PSPIE and PSPIF are reserved on PIC16F873A/876A devices; always maintain these bits clear. 3: These registers can be addressed from any bank. 4: PORTD, PORTE, TRISD and TRISE are not implemented on PIC16F873A/876A devices, read as ‘0’. 5: Bit 4 of EEADRH implemented only on the PIC16F876A/877A devices. PIC16F87XA DS39582C-page 20  2001-2013 Microchip Technology Inc. Bank 1 80h(3) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 31, 150 81h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 23, 150 82h(3) PCL Program Counter (PC) Least Significant Byte 0000 0000 30, 150 83h(3) STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 22, 150 84h(3) FSR Indirect Data Memory Address Pointer xxxx xxxx 31, 150 85h TRISA — — PORTA Data Direction Register --11 1111 43, 150 86h TRISB PORTB Data Direction Register 1111 1111 45, 150 87h TRISC PORTC Data Direction Register 1111 1111 47, 150 88h(4) TRISD PORTD Data Direction Register 1111 1111 48, 151 89h(4) TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction bits 0000 -111 50, 151 8Ah(1,3) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 30, 150 8Bh(3) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 24, 150 8Ch PIE1 PSPIE(2) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 25, 151 8Dh PIE2 — CMIE — EEIE BCLIE — — CCP2IE -0-0 0--0 27, 151 8Eh PCON — — — — — — POR BOR ---- --qq 29, 151 8Fh — Unimplemented — — 90h — Unimplemented — — 91h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 83, 151 92h PR2 Timer2 Period Register 1111 1111 62, 151 93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 79, 151 94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 79, 151 95h — Unimplemented — — 96h — Unimplemented — — 97h — Unimplemented — — 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 111, 151 99h SPBRG Baud Rate Generator Register 0000 0000 113, 151 9Ah — Unimplemented — — 9Bh — Unimplemented — — 9Ch CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 135, 151 9Dh CVRCON CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 000- 0000 141, 151 9Eh ADRESL A/D Result Register Low Byte xxxx xxxx 133, 151 9Fh ADCON1 ADFM ADCS2 — — PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 128, 151 TABLE 2-1: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Details on page: Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8>, whose contents are transferred to the upper byte of the program counter. 2: Bits PSPIE and PSPIF are reserved on PIC16F873A/876A devices; always maintain these bits clear. 3: These registers can be addressed from any bank. 4: PORTD, PORTE, TRISD and TRISE are not implemented on PIC16F873A/876A devices, read as ‘0’. 5: Bit 4 of EEADRH implemented only on the PIC16F876A/877A devices.  2001-2013 Microchip Technology Inc. DS39582C-page 21 PIC16F87XA Bank 2 100h(3) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 31, 150 101h TMR0 Timer0 Module Register xxxx xxxx 55, 150 102h(3) PCL Program Counter’s (PC) Least Significant Byte 0000 0000 30, 150 103h(3) STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 22, 150 104h(3) FSR Indirect Data Memory Address Pointer xxxx xxxx 31, 150 105h — Unimplemented — — 106h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx 45, 150 107h — Unimplemented — — 108h — Unimplemented — — 109h — Unimplemented — — 10Ah(1,3) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 30, 150 10Bh(3) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 24, 150 10Ch EEDATA EEPROM Data Register Low Byte xxxx xxxx 39, 151 10Dh EEADR EEPROM Address Register Low Byte xxxx xxxx 39, 151 10Eh EEDATH — — EEPROM Data Register High Byte --xx xxxx 39, 151 10Fh EEADRH — — — —(5) EEPROM Address Register High Byte ---- xxxx 39, 151 Bank 3 180h(3) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 31, 150 181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 23, 150 182h(3) PCL Program Counter (PC) Least Significant Byte 0000 0000 30, 150 183h(3) STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 22, 150 184h(3) FSR Indirect Data Memory Address Pointer xxxx xxxx 31, 150 185h — Unimplemented — — 186h TRISB PORTB Data Direction Register 1111 1111 45, 150 187h — Unimplemented — — 188h — Unimplemented — — 189h — Unimplemented — — 18Ah(1,3) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 30, 150 18Bh(3) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 24, 150 18Ch EECON1 EEPGD — — — WRERR WREN WR RD x--- x000 34, 151 18Dh EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- 39, 151 18Eh — Reserved; maintain clear 0000 0000 — 18Fh — Reserved; maintain clear 0000 0000 — TABLE 2-1: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Details on page: Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8>, whose contents are transferred to the upper byte of the program counter. 2: Bits PSPIE and PSPIF are reserved on PIC16F873A/876A devices; always maintain these bits clear. 3: These registers can be addressed from any bank. 4: PORTD, PORTE, TRISD and TRISE are not implemented on PIC16F873A/876A devices, read as ‘0’. 5: Bit 4 of EEADRH implemented only on the PIC16F876A/877A devices. PIC16F87XA DS39582C-page 22  2001-2013 Microchip Technology Inc. 2.2.2.1 Status Register The Status register contains the arithmetic status of the ALU, the Reset status and the bank select bits for data memory. The Status register can be the destination for any instruction, as with any other register. If the Status register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable, therefore, the result of an instruction with the Status register as destination may be different than intended. For example, CLRF STATUS, will clear the upper three bits and set the Z bit. This leaves the Status register as 000u u1uu (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the Status register because these instructions do not affect the Z, C or DC bits from the Status register. For other instructions not affecting any status bits, see Section 15.0 “Instruction Set Summary”. REGISTER 2-1: STATUS REGISTER (ADDRESS 03h, 83h, 103h, 183h) Note: The C and DC bits operate as a borrow and digit borrow bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x IRP RP1 RP0 TO PD Z DC C bit 7 bit 0 bit 7 IRP: Register Bank Select bit (used for indirect addressing) 1 = Bank 2, 3 (100h-1FFh) 0 = Bank 0, 1 (00h-FFh) bit 6-5 RP1:RP0: Register Bank Select bits (used for direct addressing) 11 = Bank 3 (180h-1FFh) 10 = Bank 2 (100h-17Fh) 01 = Bank 1 (80h-FFh) 00 = Bank 0 (00h-7Fh) Each bank is 128 bytes. bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) (for borrow, the polarity is reversed) 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result bit 0 C: Carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note: For borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high, or low order bit of the source register. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 23 PIC16F87XA 2.2.2.2 OPTION_REG Register The OPTION_REG Register is a readable and writable register, which contains various control bits to configure the TMR0 prescaler/WDT postscaler (single assignable register known also as the prescaler), the external INT interrupt, TMR0 and the weak pull-ups on PORTB. REGISTER 2-2: OPTION_REG REGISTER (ADDRESS 81h, 181h) Note: To achieve a 1:1 prescaler assignment for the TMR0 register, assign the prescaler to the Watchdog Timer. R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 RBPU: PORTB Pull-up Enable bit 1 = PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of RB0/INT pin 0 = Interrupt on falling edge of RB0/INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on RA4/T0CKI pin 0 = Internal instruction cycle clock (CLKO) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on RA4/T0CKI pin 0 = Increment on low-to-high transition on RA4/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS2:PS0: Prescaler Rate Select bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: When using Low-Voltage ICSP Programming (LVP) and the pull-ups on PORTB are enabled, bit 3 in the TRISB register must be cleared to disable the pull-up on RB3 and ensure the proper operation of the device 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 Bit Value TMR0 Rate WDT Rate PIC16F87XA DS39582C-page 24  2001-2013 Microchip Technology Inc. 2.2.2.3 INTCON Register The INTCON register is a readable and writable register, which contains various enable and flag bits for the TMR0 register overflow, RB port change and external RB0/INT pin interrupts. REGISTER 2-3: INTCON REGISTER (ADDRESS 0Bh, 8Bh, 10Bh, 18Bh) Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF bit 7 bit 0 bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: RB0/INT External Interrupt Enable bit 1 = Enables the RB0/INT external interrupt 0 = Disables the RB0/INT external interrupt bit 3 RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: RB0/INT External Interrupt Flag bit 1 = The RB0/INT external interrupt occurred (must be cleared in software) 0 = The RB0/INT external interrupt did not occur bit 0 RBIF: RB Port Change Interrupt Flag bit 1 = At least one of the RB7:RB4 pins changed state; a mismatch condition will continue to set the bit. Reading PORTB will end the mismatch condition and allow the bit to be cleared (must be cleared in software). 0 = None of the RB7:RB4 pins have changed state Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 25 PIC16F87XA 2.2.2.4 PIE1 Register The PIE1 register contains the individual enable bits for the peripheral interrupts. REGISTER 2-4: PIE1 REGISTER (ADDRESS 8Ch) Note: Bit PEIE (INTCON<6>) must be set to enable any peripheral interrupt. R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE bit 7 bit 0 bit 7 PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit(1) 1 = Enables the PSP read/write interrupt 0 = Disables the PSP read/write interrupt Note 1: PSPIE is reserved on PIC16F873A/876A devices; always maintain this bit clear. bit 6 ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D converter interrupt 0 = Disables the A/D converter interrupt bit 5 RCIE: USART Receive Interrupt Enable bit 1 = Enables the USART receive interrupt 0 = Disables the USART receive interrupt bit 4 TXIE: USART Transmit Interrupt Enable bit 1 = Enables the USART transmit interrupt 0 = Disables the USART transmit interrupt bit 3 SSPIE: Synchronous Serial Port Interrupt Enable bit 1 = Enables the SSP interrupt 0 = Disables the SSP interrupt bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the TMR2 to PR2 match interrupt 0 = Disables the TMR2 to PR2 match interrupt bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 26  2001-2013 Microchip Technology Inc. 2.2.2.5 PIR1 Register The PIR1 register contains the individual flag bits for the peripheral interrupts. REGISTER 2-5: PIR1 REGISTER (ADDRESS 0Ch) Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt bits are clear prior to enabling an interrupt. R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF bit 7 bit 0 bit 7 PSPIF: Parallel Slave Port Read/Write Interrupt Flag bit(1) 1 = A read or a write operation has taken place (must be cleared in software) 0 = No read or write has occurred Note 1: PSPIF is reserved on PIC16F873A/876A devices; always maintain this bit clear. bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed 0 = The A/D conversion is not complete bit 5 RCIF: USART Receive Interrupt Flag bit 1 = The USART receive buffer is full 0 = The USART receive buffer is empty bit 4 TXIF: USART Transmit Interrupt Flag bit 1 = The USART transmit buffer is empty 0 = The USART transmit buffer is full bit 3 SSPIF: Synchronous Serial Port (SSP) Interrupt Flag bit 1 = The SSP interrupt condition has occurred and must be cleared in software before returning from the Interrupt Service Routine. The conditions that will set this bit are: • SPI – A transmission/reception has taken place. • I2C Slave – A transmission/reception has taken place. • I2C Master - A transmission/reception has taken place. - The initiated Start condition was completed by the SSP module. - The initiated Stop condition was completed by the SSP module. - The initiated Restart condition was completed by the SSP module. - The initiated Acknowledge condition was completed by the SSP module. - A Start condition occurred while the SSP module was Idle (multi-master system). - A Stop condition occurred while the SSP module was Idle (multi-master system). 0 = No SSP interrupt condition has occurred bit 2 CCP1IF: CCP1 Interrupt Flag bit Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused in this mode. bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit 1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match occurred bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 27 PIC16F87XA 2.2.2.6 PIE2 Register The PIE2 register contains the individual enable bits for the CCP2 peripheral interrupt, the SSP bus collision interrupt, EEPROM write operation interrupt and the comparator interrupt. REGISTER 2-6: PIE2 REGISTER (ADDRESS 8Dh) Note: Bit PEIE (INTCON<6>) must be set to enable any peripheral interrupt. U-0 R/W-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 — CMIE — EEIE BCLIE — — CCP2IE bit 7 bit 0 bit 7 Unimplemented: Read as ‘0’ bit 6 CMIE: Comparator Interrupt Enable bit 1 = Enables the comparator interrupt 0 = Disable the comparator interrupt bit 5 Unimplemented: Read as ‘0’ bit 4 EEIE: EEPROM Write Operation Interrupt Enable bit 1 = Enable EEPROM write interrupt 0 = Disable EEPROM write interrupt bit 3 BCLIE: Bus Collision Interrupt Enable bit 1 = Enable bus collision interrupt 0 = Disable bus collision interrupt bit 2-1 Unimplemented: Read as ‘0’ bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = Enables the CCP2 interrupt 0 = Disables the CCP2 interrupt Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 28  2001-2013 Microchip Technology Inc. 2.2.2.7 PIR2 Register The PIR2 register contains the flag bits for the CCP2 interrupt, the SSP bus collision interrupt, EEPROM write operation interrupt and the comparator interrupt. REGISTER 2-7: PIR2 REGISTER (ADDRESS 0Dh) Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. U-0 R/W-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 — CMIF — EEIF BCLIF — — CCP2IF bit 7 bit 0 bit 7 Unimplemented: Read as ‘0’ bit 6 CMIF: Comparator Interrupt Flag bit 1 = The comparator input has changed (must be cleared in software) 0 = The comparator input has not changed bit 5 Unimplemented: Read as ‘0’ bit 4 EEIF: EEPROM Write Operation Interrupt Flag bit 1 = The write operation completed (must be cleared in software) 0 = The write operation is not complete or has not been started bit 3 BCLIF: Bus Collision Interrupt Flag bit 1 = A bus collision has occurred in the SSP when configured for I2C Master mode 0 = No bus collision has occurred bit 2-1 Unimplemented: Read as ‘0’ bit 0 CCP2IF: CCP2 Interrupt Flag bit Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 29 PIC16F87XA 2.2.2.8 PCON Register The Power Control (PCON) register contains flag bits to allow differentiation between a Power-on Reset (POR), a Brown-out Reset (BOR), a Watchdog Reset (WDT) and an external MCLR Reset. REGISTER 2-8: PCON REGISTER (ADDRESS 8Eh) Note: BOR is unknown on Power-on Reset. It must be set by the user and checked on subsequent Resets to see if BOR is clear, indicating a brown-out has occurred. The BOR status bit is a “don’t care” and is not predictable if the brown-out circuit is disabled (by clearing the BODEN bit in the configuration word). U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-1 — — — — — — POR BOR bit 7 bit 0 bit 7-2 Unimplemented: Read as ‘0’ bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 30  2001-2013 Microchip Technology Inc. 2.3 PCL and PCLATH The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register which is a readable and writable register. The upper bits (PC<12:8>) are not readable, but are indirectly writable through the PCLATH register. On any Reset, the upper bits of the PC will be cleared. Figure 2-5 shows the two situations for the loading of the PC. The upper example in the figure shows how the PC is loaded on a write to PCL (PCLATH<4:0>  PCH). The lower example in the figure shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3>  PCH). FIGURE 2-5: LOADING OF PC IN DIFFERENT SITUATIONS 2.3.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When doing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to the application note, AN556, “Implementing a Table Read” (DS00556). 2.3.2 STACK The PIC16F87XA family has an 8-level deep x 13-bit wide hardware stack. The stack space is not part of either program or data space and the stack pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed, or an interrupt causes a branch. The stack is POP’ed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). 2.4 Program Memory Paging All PIC16F87XA devices are capable of addressing a continuous 8K word block of program memory. The CALL and GOTO instructions provide only 11 bits of address to allow branching within any 2K program memory page. When doing a CALL or GOTO instruction, the upper 2 bits of the address are provided by PCLATH<4:3>. When doing a CALL or GOTO instruction, the user must ensure that the page select bits are programmed so that the desired program memory page is addressed. If a return from a CALL instruction (or interrupt) is executed, the entire 13-bit PC is popped off the stack. Therefore, manipulation of the PCLATH<4:3> bits is not required for the RETURN instructions (which POPs the address from the stack). Example 2-1 shows the calling of a subroutine in page 1 of the program memory. This example assumes that PCLATH is saved and restored by the Interrupt Service Routine (if interrupts are used). EXAMPLE 2-1: CALL OF A SUBROUTINE IN PAGE 1 FROM PAGE 0 PC 12 8 7 0 5 PCLATH<4:0> PCLATH Instruction with ALU GOTO,CALL Opcode <10:0> 8 PC 12 11 10 0 PCLATH<4:3> 11 PCH PCL 8 7 2 PCLATH PCH PCL PCL as Destination Note 1: There are no status bits to indicate stack overflow or stack underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. Note: The contents of the PCLATH register are unchanged after a RETURN or RETFIE instruction is executed. The user must rewrite the contents of the PCLATH register for any subsequent subroutine calls or GOTO instructions. ORG 0x500 BCF PCLATH,4 BSF PCLATH,3 ;Select page 1 ;(800h-FFFh) CALL SUB1_P1 ;Call subroutine in : ;page 1 (800h-FFFh) : ORG 0x900 ;page 1 (800h-FFFh) SUB1_P1 : ;called subroutine ;page 1 (800h-FFFh) : RETURN ;return to ;Call subroutine ;in page 0 ;(000h-7FFh)  2001-2013 Microchip Technology Inc. DS39582C-page 31 PIC16F87XA 2.5 Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses the register pointed to by the File Select Register, FSR. Reading the INDF register itself, indirectly (FSR = 0) will read 00h. Writing to the INDF register indirectly results in a no operation (although status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (Status<7>) as shown in Figure 2-6. A simple program to clear RAM locations 20h-2Fh using indirect addressing is shown in Example 2-2. EXAMPLE 2-2: INDIRECT ADDRESSING FIGURE 2-6: DIRECT/INDIRECT ADDRESSING MOVLW 0x20 ;initialize pointer MOVWF FSR ;to RAM NEXT CLRF INDF ;clear INDF register INCF FSR,F ;inc pointer BTFSS FSR,4 ;all done? GOTO NEXT ;no clear next CONTINUE : ;yes continue Note 1: For register file map detail, see Figure 2-3. Data Memory(1) Direct Addressing Indirect Addressing Bank Select Location Select RP1:RP0 6 From Opcode 0 IRP FSR Register 7 0 Bank Select Location Select 00 01 10 11 Bank 0 Bank 1 Bank 2 Bank 3 FFh 80h 7Fh 00h 17Fh 100h 1FFh 180h PIC16F87XA DS39582C-page 32  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 33 PIC16F87XA 3.0 DATA EEPROM AND FLASH PROGRAM MEMORY The data EEPROM and Flash program memory is readable and writable during normal operation (over the full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers. There are six SFRs used to read and write this memory: • EECON1 • EECON2 • EEDATA • EEDATH • EEADR • EEADRH When interfacing to the data memory block, EEDATA holds the 8-bit data for read/write and EEADR holds the address of the EEPROM location being accessed. These devices have 128 or 256 bytes of data EEPROM (depending on the device), with an address range from 00h to FFh. On devices with 128 bytes, addresses from 80h to FFh are unimplemented and will wraparound to the beginning of data EEPROM memory. When writing to unimplemented locations, the on-chip charge pump will be turned off. When interfacing the program memory block, the EEDATA and EEDATH registers form a two-byte word that holds the 14-bit data for read/write and the EEADR and EEADRH registers form a two-byte word that holds the 13-bit address of the program memory location being accessed. These devices have 4 or 8K words of program Flash, with an address range from 0000h to 0FFFh for the PIC16F873A/874A and 0000h to 1FFFh for the PIC16F876A/877A. Addresses above the range of the respective device will wraparound to the beginning of program memory. The EEPROM data memory allows single-byte read and write. The Flash program memory allows single-word reads and four-word block writes. Program memory write operations automatically perform an erase-beforewrite on blocks of four words. A byte write in data EEPROM memory automatically erases the location and writes the new data (erase-before-write). The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump, rated to operate over the voltage range of the device for byte or word operations. When the device is code-protected, the CPU may continue to read and write the data EEPROM memory. Depending on the settings of the write-protect bits, the device may or may not be able to write certain blocks of the program memory; however, reads of the program memory are allowed. When code-protected, the device programmer can no longer access data or program memory; this does NOT inhibit internal reads or writes. 3.1 EEADR and EEADRH The EEADRH:EEADR register pair can address up to a maximum of 256 bytes of data EEPROM or up to a maximum of 8K words of program EEPROM. When selecting a data address value, only the LSByte of the address is written to the EEADR register. When selecting a program address value, the MSByte of the address is written to the EEADRH register and the LSByte is written to the EEADR register. If the device contains less memory than the full address reach of the address register pair, the Most Significant bits of the registers are not implemented. For example, if the device has 128 bytes of data EEPROM, the Most Significant bit of EEADR is not implemented on access to data EEPROM. 3.2 EECON1 and EECON2 Registers EECON1 is the control register for memory accesses. Control bit, EEPGD, determines if the access will be a program or data memory access. When clear, as it is when reset, any subsequent operations will operate on the data memory. When set, any subsequent operations will operate on the program memory. Control bits, RD and WR, initiate read and write or erase, respectively. These bits cannot be cleared, only set, in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write or erase operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write (or erase) operation is interrupted by a MCLR or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and rewrite the location. The data and address will be unchanged in the EEDATA and EEADR registers. Interrupt flag bit, EEIF in the PIR2 register, is set when the write is complete. It must be cleared in software. EECON2 is not a physical register. Reading EECON2 will read all ‘0’s. The EECON2 register is used exclusively in the EEPROM write sequence. Note: The self-programming mechanism for Flash program memory has been changed. On previous PIC16F87X devices, Flash programming was done in single-word erase/ write cycles. The newer PIC18F87XA devices use a four-word erase/write cycle. See Section 3.6 “Writing to Flash Program Memory” for more information. PIC16F87XA DS39582C-page 34  2001-2013 Microchip Technology Inc. REGISTER 3-1: EECON1 REGISTER (ADDRESS 18Ch) R/W-x U-0 U-0 U-0 R/W-x R/W-0 R/S-0 R/S-0 EEPGD — — — WRERR WREN WR RD bit 7 bit 0 bit 7 EEPGD: Program/Data EEPROM Select bit 1 = Accesses program memory 0 = Accesses data memory Reads ‘0’ after a POR; this bit cannot be changed while a write operation is in progress. bit 6-4 Unimplemented: Read as ‘0’ bit 3 WRERR: EEPROM Error Flag bit 1 = A write operation is prematurely terminated (any MCLR or any WDT Reset during normal operation) 0 = The write operation completed bit 2 WREN: EEPROM Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the EEPROM bit 1 WR: Write Control bit 1 = Initiates a write cycle. The bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software. 0 = Write cycle to the EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read; RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate an EEPROM read Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 35 PIC16F87XA 3.3 Reading Data EEPROM Memory To read a data memory location, the user must write the address to the EEADR register, clear the EEPGD control bit (EECON1<7>) and then set control bit RD (EECON1<0>). The data is available in the very next cycle in the EEDATA register; therefore, it can be read in the next instruction (see Example 3-1). EEDATA will hold this value until another read or until it is written to by the user (during a write operation). The steps to reading the EEPROM data memory are: 1. Write the address to EEADR. Make sure that the address is not larger than the memory size of the device. 2. Clear the EEPGD bit to point to EEPROM data memory. 3. Set the RD bit to start the read operation. 4. Read the data from the EEDATA register. EXAMPLE 3-1: DATA EEPROM READ 3.4 Writing to Data EEPROM Memory To write an EEPROM data location, the user must first write the address to the EEADR register and the data to the EEDATA register. Then the user must follow a specific write sequence to initiate the write for each byte. The write will not initiate if the write sequence is not exactly followed (write 55h to EECON2, write AAh to EECON2, then set WR bit) for each byte. We strongly recommend that interrupts be disabled during this code segment (see Example 3-2). Additionally, the WREN bit in EECON1 must be set to enable write. This mechanism prevents accidental writes to data EEPROM due to errant (unexpected) code execution (i.e., lost programs). The user should keep the WREN bit clear at all times, except when updating EEPROM. The WREN bit is not cleared by hardware After a write sequence has been initiated, clearing the WREN bit will not affect this write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. At the completion of the write cycle, the WR bit is cleared in hardware and the EE Write Complete Interrupt Flag bit (EEIF) is set. The user can either enable this interrupt or poll this bit. EEIF must be cleared by software. The steps to write to EEPROM data memory are: 1. If step 10 is not implemented, check the WR bit to see if a write is in progress. 2. Write the address to EEADR. Make sure that the address is not larger than the memory size of the device. 3. Write the 8-bit data value to be programmed in the EEDATA register. 4. Clear the EEPGD bit to point to EEPROM data memory. 5. Set the WREN bit to enable program operations. 6. Disable interrupts (if enabled). 7. Execute the special five instruction sequence: • Write 55h to EECON2 in two steps (first to W, then to EECON2) • Write AAh to EECON2 in two steps (first to W, then to EECON2) • Set the WR bit 8. Enable interrupts (if using interrupts). 9. Clear the WREN bit to disable program operations. 10. At the completion of the write cycle, the WR bit is cleared and the EEIF interrupt flag bit is set. (EEIF must be cleared by firmware.) If step 1 is not implemented, then firmware should check for EEIF to be set, or WR to clear, to indicate the end of the program cycle. EXAMPLE 3-2: DATA EEPROM WRITE BSF STATUS,RP1 ; BCF STATUS,RP0 ; Bank 2 MOVF DATA_EE_ADDR,W ; Data Memory MOVWF EEADR ; Address to read BSF STATUS,RP0 ; Bank 3 BCF EECON1,EEPGD ; Point to Data ; memory BSF EECON1,RD ; EE Read BCF STATUS,RP0 ; Bank 2 MOVF EEDATA,W ; W = EEDATA BSF STATUS,RP1 ; BSF STATUS,RP0 BTFSC EECON1,WR ;Wait for write GOTO $-1 ;to complete BCF STATUS, RP0 ;Bank 2 MOVF DATA_EE_ADDR,W ;Data Memory MOVWF EEADR ;Address to write MOVF DATA_EE_DATA,W ;Data Memory Value MOVWF EEDATA ;to write BSF STATUS,RP0 ;Bank 3 BCF EECON1,EEPGD ;Point to DATA ;memory BSF EECON1,WREN ;Enable writes BCF INTCON,GIE ;Disable INTs. MOVLW 55h ; MOVWF EECON2 ;Write 55h MOVLW AAh ; MOVWF EECON2 ;Write AAh BSF EECON1,WR ;Set WR bit to ;begin write BSF INTCON,GIE ;Enable INTs. BCF EECON1,WREN ;Disable writes Required Sequence PIC16F87XA DS39582C-page 36  2001-2013 Microchip Technology Inc. 3.5 Reading Flash Program Memory To read a program memory location, the user must write two bytes of the address to the EEADR and EEADRH registers, set the EEPGD control bit (EECON1<7>) and then set control bit RD (EECON1<0>). Once the read control bit is set, the program memory Flash controller will use the next two instruction cycles to read the data. This causes these two instructions immediately following the “BSF EECON1,RD” instruction to be ignored. The data is available in the very next cycle in the EEDATA and EEDATH registers; therefore, it can be read as two bytes in the following instructions. EEDATA and EEDATH registers will hold this value until another read or until it is written to by the user (during a write operation). EXAMPLE 3-3: FLASH PROGRAM READ BSF STATUS, RP1 ; BCF STATUS, RP0 ; Bank 2 MOVLW MS_PROG_EE_ADDR ; MOVWF EEADRH ; MS Byte of Program Address to read MOVLW LS_PROG_EE_ADDR ; MOVWF EEADR ; LS Byte of Program Address to read BSF STATUS, RP0 ; Bank 3 BSF EECON1, EEPGD ; Point to PROGRAM memory BSF EECON1, RD ; EE Read ; NOP NOP ; Any instructions here are ignored as program ; memory is read in second cycle after BSF EECON1,RD ; BCF STATUS, RP0 ; Bank 2 MOVF EEDATA, W ; W = LS Byte of Program EEDATA MOVWF DATAL ; MOVF EEDATH, W ; W = MS Byte of Program EEDATA MOVWF DATAH ; Required Sequence  2001-2013 Microchip Technology Inc. DS39582C-page 37 PIC16F87XA 3.6 Writing to Flash Program Memory Flash program memory may only be written to if the destination address is in a segment of memory that is not write-protected, as defined in bits WRT1:WRT0 of the device configuration word (Register 14-1). Flash program memory must be written in four-word blocks. A block consists of four words with sequential addresses, with a lower boundary defined by an address, where EEADR<1:0> = 00. At the same time, all block writes to program memory are done as erase and write operations. The write operation is edge-aligned and cannot occur across boundaries. To write program data, it must first be loaded into the buffer registers (see Figure 3-1). This is accomplished by first writing the destination address to EEADR and EEADRH and then writing the data to EEDATA and EEDATH. After the address and data have been set up, then the following sequence of events must be executed: 1. Set the EEPGD control bit (EECON1<7>). 2. Write 55h, then AAh, to EECON2 (Flash programming sequence). 3. Set the WR control bit (EECON1<1>). All four buffer register locations MUST be written to with correct data. If only one, two or three words are being written to in the block of four words, then a read from the program memory location(s) not being written to must be performed. This takes the data from the program location(s) not being written and loads it into the EEDATA and EEDATH registers. Then the sequence of events to transfer data to the buffer registers must be executed. To transfer data from the buffer registers to the program memory, the EEADR and EEADRH must point to the last location in the four-word block (EEADR<1:0> = 11). Then the following sequence of events must be executed: 1. Set the EEPGD control bit (EECON1<7>). 2. Write 55h, then AAh, to EECON2 (Flash programming sequence). 3. Set control bit WR (EECON1<1>) to begin the write operation. The user must follow the same specific sequence to initiate the write for each word in the program block, writing each program word in sequence (00,01,10,11). When the write is performed on the last word (EEADR<1:0> = 11), the block of four words are automatically erased and the contents of the buffer registers are written into the program memory. After the “BSF EECON1,WR” instruction, the processor requires two cycles to set up the erase/write operation. The user must place two NOP instructions after the WR bit is set. Since data is being written to buffer registers, the writing of the first three words of the block appears to occur immediately. The processor will halt internal operations for the typical 4 ms, only during the cycle in which the erase takes place (i.e., the last word of the four-word block). This is not Sleep mode as the clocks and peripherals will continue to run. After the write cycle, the processor will resume operation with the third instruction after the EECON1 write instruction. If the sequence is performed to any other location, the action is ignored. FIGURE 3-1: BLOCK WRITES TO FLASH PROGRAM MEMORY 14 14 14 14 Program Memory Buffer Register EEADR<1:0> = 00 Buffer Register EEADR<1:0> = 01 Buffer Register EEADR<1:0> = 10 Buffer Register EEADR<1:0> = 11 EEDATH EEDATA 7 5 0 7 0 6 8 First word of block to be written Four words of to Flash automatically after this word is written are transferred Flash are erased, then all buffers PIC16F87XA DS39582C-page 38  2001-2013 Microchip Technology Inc. An example of the complete four-word write sequence is shown in Example 3-4. The initial address is loaded into the EEADRH:EEADR register pair; the four words of data are loaded using indirect addressing. EXAMPLE 3-4: WRITING TO FLASH PROGRAM MEMORY ; This write routine assumes the following: ; ; 1. A valid starting address (the least significant bits = ‘00’)is loaded in ADDRH:ADDRL ; 2. The 8 bytes of data are loaded, starting at the address in DATADDR ; 3. ADDRH, ADDRL and DATADDR are all located in shared data memory 0x70 - 0x7f ; BSF STATUS,RP1 ; BCF STATUS,RP0 ; Bank 2 MOVF ADDRH,W ; Load initial address MOVWF EEADRH ; MOVF ADDRL,W ; MOVWF EEADR ; MOVF DATAADDR,W ; Load initial data address MOVWF FSR ; LOOP MOVF INDF,W ; Load first data byte into lower MOVWF EEDATA ; INCF FSR,F ; Next byte MOVF INDF,W ; Load second data byte into upper MOVWF EEDATH ; INCF FSR,F ; BSF STATUS,RP0 ; Bank 3 BSF EECON1,EEPGD ; Point to program memory BSF EECON1,WREN ; Enable writes BCF INTCON,GIE ; Disable interrupts (if using) MOVLW 55h ; Start of required write sequence: MOVWF EECON2 ; Write 55h MOVLW AAh ; MOVWF EECON2 ; Write AAh BSF EECON1,WR ; Set WR bit to begin write NOP ; Any instructions here are ignored as processor ; halts to begin write sequence NOP ; processor will stop here and wait for write complete ; after write processor continues with 3rd instruction BCF EECON1,WREN ; Disable writes BSF INTCON,GIE ; Enable interrupts (if using) BCF STATUS,RP0 ; Bank 2 INCF EEADR,F ; Increment address MOVF EEADR,W ; Check if lower two bits of address are ‘00’ ANDLW 0x03 ; Indicates when four words have been programmed XORLW 0x03 ; BTFSC STATUS,Z ; Exit if more than four words, GOTO LOOP ; Continue if less than four words Required Sequence  2001-2013 Microchip Technology Inc. DS39582C-page 39 PIC16F87XA 3.7 Protection Against Spurious Write There are conditions when the device should not write to the data EEPROM or Flash program memory. To protect against spurious writes, various mechanisms have been built-in. On power-up, WREN is cleared. Also, the Power-up Timer (72 ms duration) prevents an EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch or software malfunction. 3.8 Operation During Code-Protect When the data EEPROM is code-protected, the microcontroller can read and write to the EEPROM normally. However, all external access to the EEPROM is disabled. External write access to the program memory is also disabled. When program memory is code-protected, the microcontroller can read and write to program memory normally, as well as execute instructions. Writes by the device may be selectively inhibited to regions of the memory depending on the setting of bits WR1:WR0 of the configuration word (see Section 14.1 “Configuration Bits” for additional information). External access to the memory is also disabled. TABLE 3-1: REGISTERS/BITS ASSOCIATED WITH DATA EEPROM AND FLASH PROGRAM MEMORIES Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on Power-on Reset Value on all other Resets 10Ch EEDATA EEPROM/Flash Data Register Low Byte xxxx xxxx uuuu uuuu 10Dh EEADR EEPROM/Flash Address Register Low Byte xxxx xxxx uuuu uuuu 10Eh EEDATH — — EEPROM/Flash Data Register High Byte xxxx xxxx ---0 q000 10Fh EEADRH — — — EEPROM/Flash Address Register High Byte xxxx xxxx ---- ---- 18Ch EECON1 EEPGD — — — WRERR WREN WR RD x--- x000 ---0 q000 18Dh EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- ---- ---- 0Dh PIR2 — CMIF — EEIF BCLIF — — CCP2IF -0-0 0--0 -0-0 0--0 8Dh PIE2 — CMIE — EEIE BCLIE — — CCP2IE -0-0 0--0 -0-0 0--0 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’, q = value depends upon condition. Shaded cells are not used by data EEPROM or Flash program memory. PIC16F87XA DS39582C-page 40  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 41 PIC16F87XA 4.0 I/O PORTS Some pins for these I/O ports are multiplexed with an alternate function for the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Additional information on I/O ports may be found in the PIC® Mid-Range Reference Manual (DS33023). 4.1 PORTA and the TRISA Register PORTA is a 6-bit wide, bidirectional port. The corresponding data direction register is TRISA. Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., put the contents of the output latch on the selected pin). Reading the PORTA register reads the status of the pins, whereas writing to it will write to the port latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, the value is modified and then written to the port data latch. Pin RA4 is multiplexed with the Timer0 module clock input to become the RA4/T0CKI pin. The RA4/T0CKI pin is a Schmitt Trigger input and an open-drain output. All other PORTA pins have TTL input levels and full CMOS output drivers. Other PORTA pins are multiplexed with analog inputs and the analog VREF input for both the A/D converters and the comparators. The operation of each pin is selected by clearing/setting the appropriate control bits in the ADCON1 and/or CMCON registers. The TRISA register controls the direction of the port pins even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. EXAMPLE 4-1: INITIALIZING PORTA FIGURE 4-1: BLOCK DIAGRAM OF RA3:RA0 PINS Note: On a Power-on Reset, these pins are configured as analog inputs and read as ‘0’. The comparators are in the off (digital) state. BCF STATUS, RP0 ; BCF STATUS, RP1 ; Bank0 CLRF PORTA ; Initialize PORTA by ; clearing output ; data latches BSF STATUS, RP0 ; Select Bank 1 MOVLW 0x06 ; Configure all pins MOVWF ADCON1 ; as digital inputs MOVLW 0xCF ; Value used to ; initialize data ; direction MOVWF TRISA ; Set RA<3:0> as inputs ; RA<5:4> as outputs ; TRISA<7:6>are always ; read as '0'. Data Bus D Q CK Q D Q CK Q Q D EN P N WR PORTA WR TRISA Data Latch TRIS Latch RD RD PORTA VSS VDD I/O pin(1) Note 1: I/O pins have protection diodes to VDD and VSS. Analog Input Mode TTL Input Buffer To A/D Converter or Comparator TRISA PIC16F87XA DS39582C-page 42  2001-2013 Microchip Technology Inc. FIGURE 4-2: BLOCK DIAGRAM OF RA4/T0CKI PIN FIGURE 4-3: BLOCK DIAGRAM OF RA5 PIN Data Bus WR PORTA WR TRISA RD PORTA Data Latch TRIS Latch RD TRISA Schmitt Trigger Input Buffer N VSS I/O pin(1) TMR0 Clock Input D Q CK Q D Q CK Q EN Q D EN C1OUT Note 1: I/O pin has protection diodes to VSS only. CMCON<2:0> = x01 or 011 1 0 Data Bus WR PORTA WR TRISA RD PORTA Data Latch TRIS Latch RD TRISA TTL Input Buffer I/O pin(1) A/D Converter or SS Input D Q CK Q D Q CK Q EN Q D EN C2OUT CMCON<2:0> = 011 or 101 1 0 P N VSS VDD Note 1: I/O pin has protection diodes to VDD and VSS. Analog IIP Mode  2001-2013 Microchip Technology Inc. DS39582C-page 43 PIC16F87XA TABLE 4-1: PORTA FUNCTIONS TABLE 4-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Name Bit# Buffer Function RA0/AN0 bit 0 TTL Input/output or analog input. RA1/AN1 bit 1 TTL Input/output or analog input. RA2/AN2/VREF-/CVREF bit 2 TTL Input/output or analog input or VREF- or CVREF. RA3/AN3/VREF+ bit 3 TTL Input/output or analog input or VREF+. RA4/T0CKI/C1OUT bit 4 ST Input/output or external clock input for Timer0 or comparator output. Output is open-drain type. RA5/AN4/SS/C2OUT bit 5 TTL Input/output or analog input or slave select input for synchronous serial port or comparator output. Legend: TTL = TTL input, ST = Schmitt Trigger input Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 05h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --0x 0000 --0u 0000 85h TRISA — — PORTA Data Direction Register --11 1111 --11 1111 9Ch CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111 9Dh CVRCON CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000 9Fh ADCON1 ADFM ADCS2 — — PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 00-- 0000 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. Note: When using the SSP module in SPI Slave mode and SS enabled, the A/D converter must be set to one of the following modes, where PCFG3:PCFG0 = 0100, 0101, 011x, 1101, 1110, 1111. PIC16F87XA DS39582C-page 44  2001-2013 Microchip Technology Inc. 4.2 PORTB and the TRISB Register PORTB is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISB. Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output (i.e., put the contents of the output latch on the selected pin). Three pins of PORTB are multiplexed with the In-Circuit Debugger and Low-Voltage Programming function: RB3/PGM, RB6/PGC and RB7/PGD. The alternate functions of these pins are described in Section 14.0 “Special Features of the CPU”. Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit RBPU (OPTION_REG<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset. FIGURE 4-4: BLOCK DIAGRAM OF RB3:RB0 PINS Four of the PORTB pins, RB7:RB4, have an interrupton-change feature. Only pins configured as inputs can cause this interrupt to occur (i.e., any RB7:RB4 pin configured as an output is excluded from the interrupton-change comparison). The input pins (of RB7:RB4) are compared with the old value latched on the last read of PORTB. The “mismatch” outputs of RB7:RB4 are OR’ed together to generate the RB port change interrupt with flag bit RBIF (INTCON<0>). This interrupt can wake the device from Sleep. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of PORTB. This will end the mismatch condition. b) Clear flag bit RBIF. A mismatch condition will continue to set flag bit RBIF. Reading PORTB will end the mismatch condition and allow flag bit RBIF to be cleared. The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt-on-change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. This interrupt-on-mismatch feature, together with software configurable pull-ups on these four pins, allow easy interface to a keypad and make it possible for wake-up on key depression. Refer to the application note, AN552, “Implementing Wake-up on Key Stroke” (DS00552). RB0/INT is an external interrupt input pin and is configured using the INTEDG bit (OPTION_REG<6>). RB0/INT is discussed in detail in Section 14.11.1 “INT Interrupt”. FIGURE 4-5: BLOCK DIAGRAM OF RB7:RB4 PINS Data Latch RBPU(2) P VDD D Q CK D Q CK Q D EN Data Bus WR Port WR TRIS RD TRIS RD Port Weak Pull-up RD Port RB0/INT I/O pin(1) TTL Input Buffer Schmitt Trigger Buffer TRIS Latch Note 1: I/O pins have diode protection to VDD and VSS. 2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>). RB3/PGM Data Latch From other RBPU(2) P VDD I/O pin(1) D Q CK D Q CK Q D EN Q D EN Data Bus WR Port WR TRIS Set RBIF TRIS Latch RD TRIS RD Port RB7:RB4 pins Weak Pull-up RD Port Latch TTL Input Buffer ST Buffer RB7:RB6 Q3 Q1 Note 1: I/O pins have diode protection to VDD and VSS. 2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>). In Serial Programming Mode  2001-2013 Microchip Technology Inc. DS39582C-page 45 PIC16F87XA TABLE 4-3: PORTB FUNCTIONS TABLE 4-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Name Bit# Buffer Function RB0/INT bit 0 TTL/ST(1) Input/output pin or external interrupt input. Internal software programmable weak pull-up. RB1 bit 1 TTL Input/output pin. Internal software programmable weak pull-up. RB2 bit 2 TTL Input/output pin. Internal software programmable weak pull-up. RB3/PGM(3) bit 3 TTL Input/output pin or programming pin in LVP mode. Internal software programmable weak pull-up. RB4 bit 4 TTL Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. RB5 bit 5 TTL Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. RB6/PGC bit 6 TTL/ST(2) Input/output pin (with interrupt-on-change) or in-circuit debugger pin. Internal software programmable weak pull-up. Serial programming clock. RB7/PGD bit 7 TTL/ST(2) Input/output pin (with interrupt-on-change) or in-circuit debugger pin. Internal software programmable weak pull-up. Serial programming data. Legend: TTL = TTL input, ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode or in-circuit debugger. 3: Low-Voltage ICSP Programming (LVP) is enabled by default which disables the RB3 I/O function. LVP must be disabled to enable RB3 as an I/O pin and allow maximum compatibility to the other 28-pin and 40-pin mid-range devices. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 06h, 106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu 86h, 186h TRISB PORTB Data Direction Register 1111 1111 1111 1111 81h, 181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB. PIC16F87XA DS39582C-page 46  2001-2013 Microchip Technology Inc. 4.3 PORTC and the TRISC Register PORTC is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISC. Setting a TRISC bit (= 1) will make the corresponding PORTC pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., put the contents of the output latch on the selected pin). PORTC is multiplexed with several peripheral functions (Table 4-5). PORTC pins have Schmitt Trigger input buffers. When the I2C module is enabled, the PORTC<4:3> pins can be configured with normal I2C levels, or with SMBus levels, by using the CKE bit (SSPSTAT<6>). When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTC pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. Since the TRIS bit override is in effect while the peripheral is enabled, read-modifywrite instructions (BSF, BCF, XORWF) with TRISC as the destination, should be avoided. The user should refer to the corresponding peripheral section for the correct TRIS bit settings. FIGURE 4-6: PORTC BLOCK DIAGRAM (PERIPHERAL OUTPUT OVERRIDE) RC<2:0>, RC<7:5> FIGURE 4-7: PORTC BLOCK DIAGRAM (PERIPHERAL OUTPUT OVERRIDE) RC<4:3> Port/Peripheral Select(2) Data Bus WR Port WR TRIS Data Latch TRIS Latch Schmitt Trigger D Q CK Q Q D EN Peripheral Data Out 0 1 D Q CK Q P N VDD VSS RD Port Peripheral OE(3) Peripheral Input I/O pin(1) Note 1: I/O pins have diode protection to VDD and VSS. 2: Port/Peripheral Select signal selects between port data and peripheral output. 3: Peripheral OE (Output Enable) is only activated if Peripheral Select is active. RD TRIS Port/Peripheral Select(2) Data Bus WR Port WR TRIS Data Latch TRIS Latch Schmitt Trigger D Q CK Q Q D EN Peripheral Data Out 0 1 D Q CK Q P N VDD VSS RD Port Peripheral OE(3) SSP Input I/O pin(1) Note 1: I/O pins have diode protection to VDD and VSS. 2: Port/Peripheral Select signal selects between port data and peripheral output. 3: Peripheral OE (Output Enable) is only activated if Peripheral Select is active. 0 1 CKE SSPSTAT<6> Schmitt Trigger with SMBus Levels RD TRIS  2001-2013 Microchip Technology Inc. DS39582C-page 47 PIC16F87XA TABLE 4-5: PORTC FUNCTIONS TABLE 4-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Name Bit# Buffer Type Function RC0/T1OSO/T1CKI bit 0 ST Input/output port pin or Timer1 oscillator output/Timer1 clock input. RC1/T1OSI/CCP2 bit 1 ST Input/output port pin or Timer1 oscillator input or Capture2 input/ Compare2 output/PWM2 output. RC2/CCP1 bit 2 ST Input/output port pin or Capture1 input/Compare1 output/ PWM1 output. RC3/SCK/SCL bit 3 ST RC3 can also be the synchronous serial clock for both SPI and I 2C modes. RC4/SDI/SDA bit 4 ST RC4 can also be the SPI data in (SPI mode) or data I/O (I2C mode). RC5/SDO bit 5 ST Input/output port pin or Synchronous Serial Port data output. RC6/TX/CK bit 6 ST Input/output port pin or USART asynchronous transmit or synchronous clock. RC7/RX/DT bit 7 ST Input/output port pin or USART asynchronous receive or synchronous data. Legend: ST = Schmitt Trigger input Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 07h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu 87h TRISC PORTC Data Direction Register 1111 1111 1111 1111 Legend: x = unknown, u = unchanged PIC16F87XA DS39582C-page 48  2001-2013 Microchip Technology Inc. 4.4 PORTD and TRISD Registers PORTD is an 8-bit port with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. PORTD can be configured as an 8-bit wide microprocessor port (Parallel Slave Port) by setting control bit, PSPMODE (TRISE<4>). In this mode, the input buffers are TTL. FIGURE 4-8: PORTD BLOCK DIAGRAM (IN I/O PORT MODE) TABLE 4-7: PORTD FUNCTIONS TABLE 4-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD Note: PORTD and TRISD are not implemented on the 28-pin devices. Data Bus WR Port WR TRIS RD Port Data Latch TRIS Latch RD Schmitt Trigger Input Buffer I/O pin(1) Note 1: I/O pins have protection diodes to VDD and VSS. D Q CK D Q CK EN Q D EN TRIS Name Bit# Buffer Type Function RD0/PSP0 bit 0 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 0. RD1/PSP1 bit 1 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 1. RD2/PSP2 bit2 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 2. RD3/PSP3 bit 3 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 3. RD4/PSP4 bit 4 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 4. RD5/PSP5 bit 5 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 5. RD6/PSP6 bit 6 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 6. RD7/PSP7 bit 7 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 7. Legend: ST = Schmitt Trigger input, TTL = TTL input Note 1: Input buffers are Schmitt Triggers when in I/O mode and TTL buffers when in Parallel Slave Port mode. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 08h PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx uuuu uuuu 88h TRISD PORTD Data Direction Register 1111 1111 1111 1111 89h TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction Bits 0000 -111 0000 -111 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by PORTD.  2001-2013 Microchip Technology Inc. DS39582C-page 49 PIC16F87XA 4.5 PORTE and TRISE Register PORTE has three pins (RE0/RD/AN5, RE1/WR/AN6 and RE2/CS/AN7) which are individually configurable as inputs or outputs. These pins have Schmitt Trigger input buffers. The PORTE pins become the I/O control inputs for the microprocessor port when bit PSPMODE (TRISE<4>) is set. In this mode, the user must make certain that the TRISE<2:0> bits are set and that the pins are configured as digital inputs. Also, ensure that ADCON1 is configured for digital I/O. In this mode, the input buffers are TTL. Register 4-1 shows the TRISE register which also controls the Parallel Slave Port operation. PORTE pins are multiplexed with analog inputs. When selected for analog input, these pins will read as ‘0’s. TRISE controls the direction of the RE pins, even when they are being used as analog inputs. The user must make sure to keep the pins configured as inputs when using them as analog inputs. FIGURE 4-9: PORTE BLOCK DIAGRAM (IN I/O PORT MODE) TABLE 4-9: PORTE FUNCTIONS Note: PORTE and TRISE are not implemented on the 28-pin devices. Note: On a Power-on Reset, these pins are configured as analog inputs and read as ‘0’. Data Bus WR Port WR TRIS RD Port Data Latch TRIS Latch RD Schmitt Trigger Input Buffer D Q CK D Q CK EN Q D EN I/O pin(1) Note 1: I/O pins have protection diodes to VDD and VSS. TRIS Name Bit# Buffer Type Function RE0/RD/AN5 bit 0 ST/TTL(1) I/O port pin or read control input in Parallel Slave Port mode or analog input: RD 1 = Idle 0 = Read operation. Contents of PORTD register are output to PORTD I/O pins (if chip selected). RE1/WR/AN6 bit 1 ST/TTL(1) I/O port pin or write control input in Parallel Slave Port mode or analog input: WR 1 = Idle 0 = Write operation. Value of PORTD I/O pins is latched into PORTD register (if chip selected). RE2/CS/AN7 bit 2 ST/TTL(1) I/O port pin or chip select control input in Parallel Slave Port mode or analog input: CS 1 = Device is not selected 0 = Device is selected Legend: ST = Schmitt Trigger input, TTL = TTL input Note 1: Input buffers are Schmitt Triggers when in I/O mode and TTL buffers when in Parallel Slave Port mode. PIC16F87XA DS39582C-page 50  2001-2013 Microchip Technology Inc. TABLE 4-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE REGISTER 4-1: TRISE REGISTER (ADDRESS 89h) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 09h PORTE — — — — — RE2 RE1 RE0 ---- -xxx ---- -uuu 89h TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction bits 0000 -111 0000 -111 9Fh ADCON1 ADFM ADCS2 — — PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 00-- 0000 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by PORTE. R-0 R-0 R/W-0 R/W-0 U-0 R/W-1 R/W-1 R/W-1 IBF OBF IBOV PSPMODE — Bit 2 Bit 1 Bit 0 bit 7 bit 0 Parallel Slave Port Status/Control Bits: bit 7 IBF: Input Buffer Full Status bit 1 = A word has been received and is waiting to be read by the CPU 0 = No word has been received bit 6 OBF: Output Buffer Full Status bit 1 = The output buffer still holds a previously written word 0 = The output buffer has been read bit 5 IBOV: Input Buffer Overflow Detect bit (in Microprocessor mode) 1 = A write occurred when a previously input word has not been read (must be cleared in software) 0 = No overflow occurred bit 4 PSPMODE: Parallel Slave Port Mode Select bit 1 = PORTD functions in Parallel Slave Port mode 0 = PORTD functions in general purpose I/O mode bit 3 Unimplemented: Read as ‘0’ PORTE Data Direction Bits: bit 2 Bit 2: Direction Control bit for pin RE2/CS/AN7 1 = Input 0 = Output bit 1 Bit 1: Direction Control bit for pin RE1/WR/AN6 1 = Input 0 = Output bit 0 Bit 0: Direction Control bit for pin RE0/RD/AN5 1 = Input 0 = Output Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 51 PIC16F87XA 4.6 Parallel Slave Port The Parallel Slave Port (PSP) is not implemented on the PIC16F873A or PIC16F876A. PORTD operates as an 8-bit wide Parallel Slave Port, or microprocessor port, when control bit PSPMODE (TRISE<4>) is set. In Slave mode, it is asynchronously readable and writable by the external world through RD control input pin, RE0/RD/AN5, and WR control input pin, RE1/WR/AN6. The PSP can directly interface to an 8-bit microprocessor data bus. The external microprocessor can read or write the PORTD latch as an 8-bit latch. Setting bit PSPMODE enables port pin RE0/RD/AN5 to be the RD input, RE1/WR/AN6 to be the WR input and RE2/CS/AN7 to be the CS (Chip Select) input. For this functionality, the corresponding data direction bits of the TRISE register (TRISE<2:0>) must be configured as inputs (set). The A/D port configuration bits, PCFG3:PCFG0 (ADCON1<3:0>), must be set to configure pins RE2:RE0 as digital I/O. There are actually two 8-bit latches: one for data output and one for data input. The user writes 8-bit data to the PORTD data latch and reads data from the port pin latch (note that they have the same address). In this mode, the TRISD register is ignored since the external device is controlling the direction of data flow. A write to the PSP occurs when both the CS and WR lines are first detected low. When either the CS or WR lines become high (level triggered), the Input Buffer Full (IBF) status flag bit (TRISE<7>) is set on the Q4 clock cycle, following the next Q2 cycle, to signal the write is complete (Figure 4-11). The interrupt flag bit, PSPIF (PIR1<7>), is also set on the same Q4 clock cycle. IBF can only be cleared by reading the PORTD input latch. The Input Buffer Overflow (IBOV) status flag bit (TRISE<5>) is set if a second write to the PSP is attempted when the previous byte has not been read out of the buffer. A read from the PSP occurs when both the CS and RD lines are first detected low. The Output Buffer Full (OBF) status flag bit (TRISE<6>) is cleared immediately (Figure 4-12), indicating that the PORTD latch is waiting to be read by the external bus. When either the CS or RD pin becomes high (level triggered), the interrupt flag bit PSPIF is set on the Q4 clock cycle, following the next Q2 cycle, indicating that the read is complete. OBF remains low until data is written to PORTD by the user firmware. When not in PSP mode, the IBF and OBF bits are held clear. However, if flag bit IBOV was previously set, it must be cleared in firmware. An interrupt is generated and latched into flag bit PSPIF when a read or write operation is completed. PSPIF must be cleared by the user in firmware and the interrupt can be disabled by clearing the interrupt enable bit PSPIE (PIE1<7>). FIGURE 4-10: PORTD AND PORTE BLOCK DIAGRAM (PARALLEL SLAVE PORT) Data Bus WR Port RD Port RDx pin D Q CK EN Q D EN One bit of PORTD Set Interrupt Flag PSPIF (PIR1<7>) Read Chip Select Write RD CS WR TTL TTL TTL TTL Note 1: I/O pins have protection diodes to VDD and VSS. PIC16F87XA DS39582C-page 52  2001-2013 Microchip Technology Inc. FIGURE 4-11: PARALLEL SLAVE PORT WRITE WAVEFORMS FIGURE 4-12: PARALLEL SLAVE PORT READ WAVEFORMS TABLE 4-11: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT Q1 Q2 Q3 Q4 CS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 WR RD IBF OBF PSPIF PORTD<7:0> Q1 Q2 Q3 Q4 CS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 WR IBF PSPIF RD OBF PORTD<7:0> Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 08h PORTD Port Data Latch when written; Port pins when read xxxx xxxx uuuu uuuu 09h PORTE — — — — — RE2 RE1 RE0 ---- -xxx ---- -uuu 89h TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction bits 0000 -111 0000 -111 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 9Fh ADCON1 ADFM ADCS2 — — PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 00-- 0000 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Parallel Slave Port. Note 1: Bits PSPIE and PSPIF are reserved on the PIC16F873A/876A; always maintain these bits clear.  2001-2013 Microchip Technology Inc. DS39582C-page 53 PIC16F87XA 5.0 TIMER0 MODULE The Timer0 module timer/counter has the following features: • 8-bit timer/counter • Readable and writable • 8-bit software programmable prescaler • Internal or external clock select • Interrupt on overflow from FFh to 00h • Edge select for external clock Figure 5-1 is a block diagram of the Timer0 module and the prescaler shared with the WDT. Additional information on the Timer0 module is available in the PIC® Mid-Range MCU Family Reference Manual (DS33023). Timer mode is selected by clearing bit T0CS (OPTION_REG<5>). In Timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If the TMR0 register is written, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. Counter mode is selected by setting bit T0CS (OPTION_REG<5>). In Counter mode, Timer0 will increment either on every rising or falling edge of pin RA4/T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit, T0SE (OPTION_REG<4>). Clearing bit T0SE selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 5.2 “Using Timer0 with an External Clock”. The prescaler is mutually exclusively shared between the Timer0 module and the Watchdog Timer. The prescaler is not readable or writable. Section 5.3 “Prescaler” details the operation of the prescaler. 5.1 Timer0 Interrupt The TMR0 interrupt is generated when the TMR0 register overflows from FFh to 00h. This overflow sets bit TMR0IF (INTCON<2>). The interrupt can be masked by clearing bit TMR0IE (INTCON<5>). Bit TMR0IF must be cleared in software by the Timer0 module Interrupt Service Routine before re-enabling this interrupt. The TMR0 interrupt cannot awaken the processor from Sleep since the timer is shut-off during Sleep. FIGURE 5-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER RA4/T0CKI T0SE pin M U X CLKO (= FOSC/4) Sync 2 Cycles TMR0 Reg 8-bit Prescaler 8-to-1 MUX M U X MUX Watchdog Timer PSA 0 1 0 1 WDT Time-out PS2:PS0 8 Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION_REG<5:0>). PSA WDT Enable bit M U X 0 1 0 1 Data Bus Set Flag bit TMR0IF on Overflow 8 PSA T0CS PRESCALER PIC16F87XA DS39582C-page 54  2001-2013 Microchip Technology Inc. 5.2 Using Timer0 with an External Clock When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, it is necessary for T0CKI to be high for at least 2 TOSC (and a small RC delay of 20 ns) and low for at least 2 TOSC (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device. 5.3 Prescaler There is only one prescaler available which is mutually exclusively shared between the Timer0 module and the Watchdog Timer. A prescaler assignment for the Timer0 module means that there is no prescaler for the Watchdog Timer and vice versa. This prescaler is not readable or writable (see Figure 5-1). The PSA and PS2:PS0 bits (OPTION_REG<3:0>) determine the prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x....etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the Watchdog Timer. The prescaler is not readable or writable. REGISTER 5-1: OPTION_REG REGISTER Note: Writing to TMR0 when the prescaler is assigned to Timer0 will clear the prescaler count, but will not change the prescaler assignment. R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 RBPU bit 6 INTEDG bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (CLKO) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS2:PS0: Prescaler Rate Select bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: To avoid an unintended device Reset, the instruction sequence shown in the PIC® Mid-Range MCU Family Reference Manual (DS33023) must be executed when changing the prescaler assignment from Timer0 to the WDT. This sequence must be followed even if the WDT is disabled. 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 Bit Value TMR0 Rate WDT Rate  2001-2013 Microchip Technology Inc. DS39582C-page 55 PIC16F87XA TABLE 5-1: REGISTERS ASSOCIATED WITH TIMER0 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 01h,101h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu 0Bh,8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u 81h,181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by Timer0. PIC16F87XA DS39582C-page 56  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 57 PIC16F87XA 6.0 TIMER1 MODULE The Timer1 module is a 16-bit timer/counter consisting of two 8-bit registers (TMR1H and TMR1L) which are readable and writable. The TMR1 register pair (TMR1H:TMR1L) increments from 0000h to FFFFh and rolls over to 0000h. The TMR1 interrupt, if enabled, is generated on overflow which is latched in interrupt flag bit, TMR1IF (PIR1<0>). This interrupt can be enabled/disabled by setting/clearing TMR1 interrupt enable bit, TMR1IE (PIE1<0>). Timer1 can operate in one of two modes: • As a Timer • As a Counter The operating mode is determined by the clock select bit, TMR1CS (T1CON<1>). In Timer mode, Timer1 increments every instruction cycle. In Counter mode, it increments on every rising edge of the external clock input. Timer1 can be enabled/disabled by setting/clearing control bit, TMR1ON (T1CON<0>). Timer1 also has an internal “Reset input”. This Reset can be generated by either of the two CCP modules (Section 8.0 “Capture/Compare/PWM Modules”). Register 6-1 shows the Timer1 Control register. When the Timer1 oscillator is enabled (T1OSCEN is set), the RC1/T1OSI/CCP2 and RC0/T1OSO/T1CKI pins become inputs. That is, the TRISC<1:0> value is ignored and these pins read as ‘0’. Additional information on timer modules is available in the PIC® Mid-Range MCU Family Reference Manual (DS33023). REGISTER 6-1: T1CON: TIMER1 CONTROL REGISTER (ADDRESS 10h) U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits 11 = 1:8 prescale value 10 = 1:4 prescale value 01 = 1:2 prescale value 00 = 1:1 prescale value bit 3 T1OSCEN: Timer1 Oscillator Enable Control bit 1 = Oscillator is enabled 0 = Oscillator is shut-off (the oscillator inverter is turned off to eliminate power drain) bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit When TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0. bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from pin RC0/T1OSO/T1CKI (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 58  2001-2013 Microchip Technology Inc. 6.1 Timer1 Operation in Timer Mode Timer mode is selected by clearing the TMR1CS (T1CON<1>) bit. In this mode, the input clock to the timer is FOSC/4. The synchronize control bit, T1SYNC (T1CON<2>), has no effect since the internal clock is always in sync. 6.2 Timer1 Counter Operation Timer1 may operate in either a Synchronous, or an Asynchronous mode, depending on the setting of the TMR1CS bit. When Timer1 is being incremented via an external source, increments occur on a rising edge. After Timer1 is enabled in Counter mode, the module must first have a falling edge before the counter begins to increment. FIGURE 6-1: TIMER1 INCREMENTING EDGE 6.3 Timer1 Operation in Synchronized Counter Mode Counter mode is selected by setting bit TMR1CS. In this mode, the timer increments on every rising edge of clock input on pin RC1/T1OSI/CCP2 when bit T1OSCEN is set, or on pin RC0/T1OSO/T1CKI when bit T1OSCEN is cleared. If T1SYNC is cleared, then the external clock input is synchronized with internal phase clocks. The synchronization is done after the prescaler stage. The prescaler stage is an asynchronous ripple counter. In this configuration, during Sleep mode, Timer1 will not increment even if the external clock is present since the synchronization circuit is shut-off. The prescaler, however, will continue to increment. FIGURE 6-2: TIMER1 BLOCK DIAGRAM T1CKI (Default High) T1CKI (Default Low) Note: Arrows indicate counter increments. TMR1H TMR1L T1OSC T1SYNC TMR1CS T1CKPS1:T1CKPS0 Q Clock T1OSCEN Enable Oscillator(1) FOSC/4 Internal Clock TMR1ON On/Off Prescaler 1, 2, 4, 8 Synchronize det 1 0 0 1 Synchronized Clock Input 2 RC0/T1OSO/T1CKI RC1/T1OSI/CCP2(2) Note 1: When the T1OSCEN bit is cleared, the inverter is turned off. This eliminates power drain. Set Flag bit TMR1IF on Overflow TMR1  2001-2013 Microchip Technology Inc. DS39582C-page 59 PIC16F87XA 6.4 Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC (T1CON<2>) is set, the external clock input is not synchronized. The timer continues to increment asynchronous to the internal phase clocks. The timer will continue to run during Sleep and can generate an interrupt-on-overflow which will wake-up the processor. However, special precautions in software are needed to read/write the timer. In Asynchronous Counter mode, Timer1 cannot be used as a time base for capture or compare operations. 6.4.1 READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers while the register is incrementing. This may produce an unpredictable value in the timer register. Reading the 16-bit value requires some care. Examples 12-2 and 12-3 in the PIC® Mid-Range MCU Family Reference Manual (DS33023) show how to read and write Timer1 when it is running in Asynchronous mode. 6.5 Timer1 Oscillator A crystal oscillator circuit is built-in between pins T1OSI (input) and T1OSO (amplifier output). It is enabled by setting control bit, T1OSCEN (T1CON<3>). The oscillator is a low-power oscillator, rated up to 200 kHz. It will continue to run during Sleep. It is primarily intended for use with a 32 kHz crystal. Table 6-1 shows the capacitor selection for the Timer1 oscillator. The Timer1 oscillator is identical to the LP oscillator. The user must provide a software time delay to ensure proper oscillator start-up. TABLE 6-1: CAPACITOR SELECTION FOR THE TIMER1 OSCILLATOR 6.6 Resetting Timer1 Using a CCP Trigger Output If the CCP1 or CCP2 module is configured in Compare mode to generate a “special event trigger” (CCP1M3:CCP1M0 = 1011), this signal will reset Timer1. Timer1 must be configured for either Timer or Synchronized Counter mode to take advantage of this feature. If Timer1 is running in Asynchronous Counter mode, this Reset operation may not work. In the event that a write to Timer1 coincides with a special event trigger from CCP1 or CCP2, the write will take precedence. In this mode of operation, the CCPRxH:CCPRxL register pair effectively becomes the period register for Timer1. Osc Type Freq. C1 C2 LP 32 kHz 33 pF 33 pF 100 kHz 15 pF 15 pF 200 kHz 15 pF 15 pF These values are for design guidance only. Crystals Tested: 32.768 kHz Epson C-001R32.768K-A ± 20 PPM 100 kHz Epson C-2 100.00 KC-P ± 20 PPM 200 kHz STD XTL 200.000 kHz ± 20 PPM Note 1: Higher capacitance increases the stability of oscillator but also increases the start-up time. 2: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. Note: The special event triggers from the CCP1 and CCP2 modules will not set interrupt flag bit, TMR1IF (PIR1<0>). PIC16F87XA DS39582C-page 60  2001-2013 Microchip Technology Inc. 6.7 Resetting of Timer1 Register Pair (TMR1H, TMR1L) TMR1H and TMR1L registers are not reset to 00h on a POR, or any other Reset, except by the CCP1 and CCP2 special event triggers. T1CON register is reset to 00h on a Power-on Reset, or a Brown-out Reset, which shuts off the timer and leaves a 1:1 prescale. In all other Resets, the register is unaffected. 6.8 Timer1 Prescaler The prescaler counter is cleared on writes to the TMR1H or TMR1L registers. TABLE 6-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh,8Bh, 10Bh, 18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 10h T1CON — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module. Note 1: Bits PSPIE and PSPIF are reserved on the 28-pin devices; always maintain these bits clear.  2001-2013 Microchip Technology Inc. DS39582C-page 61 PIC16F87XA 7.0 TIMER2 MODULE Timer2 is an 8-bit timer with a prescaler and a postscaler. It can be used as the PWM time base for the PWM mode of the CCP module(s). The TMR2 register is readable and writable and is cleared on any device Reset. The input clock (FOSC/4) has a prescale option of 1:1, 1:4 or 1:16, selected by control bits T2CKPS1:T2CKPS0 (T2CON<1:0>). The Timer2 module has an 8-bit period register, PR2. Timer2 increments from 00h until it matches PR2 and then resets to 00h on the next increment cycle. PR2 is a readable and writable register. The PR2 register is initialized to FFh upon Reset. The match output of TMR2 goes through a 4-bit postscaler (which gives a 1:1 to 1:16 scaling inclusive) to generate a TMR2 interrupt (latched in flag bit, TMR2IF (PIR1<1>)). Timer2 can be shut-off by clearing control bit, TMR2ON (T2CON<2>), to minimize power consumption. Register 7-1 shows the Timer2 Control register. Additional information on timer modules is available in the PIC® Mid-Range MCU Family Reference Manual (DS33023). FIGURE 7-1: TIMER2 BLOCK DIAGRAM REGISTER 7-1: T2CON: TIMER2 CONTROL REGISTER (ADDRESS 12h) Comparator TMR2 Sets Flag TMR2 Reg Output(1) Reset Postscaler Prescaler PR2 Reg 2 FOSC/4 1:1 to 1:16 1:1, 1:4, 1:16 EQ 4 bit TMR2IF Note 1: TMR2 register output can be software selected by the SSP module as a baud clock. T2OUTPS3: T2OUTPS0 T2CKPS1: T2CKPS0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 bit 7 Unimplemented: Read as ‘0’ bit 6-3 TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits 0000 = 1:1 postscale 0001 = 1:2 postscale 0010 = 1:3 postscale • • • 1111 = 1:16 postscale bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 62  2001-2013 Microchip Technology Inc. 7.1 Timer2 Prescaler and Postscaler The prescaler and postscaler counters are cleared when any of the following occurs: • a write to the TMR2 register • a write to the T2CON register • any device Reset (POR, MCLR Reset, WDT Reset or BOR) TMR2 is not cleared when T2CON is written. 7.2 Output of TMR2 The output of TMR2 (before the postscaler) is fed to the SSP module, which optionally uses it to generate the shift clock. TABLE 7-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh, 18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 11h TMR2 Timer2 Module’s Register 0000 0000 0000 0000 12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 92h PR2 Timer2 Period Register 1111 1111 1111 1111 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.  2001-2013 Microchip Technology Inc. DS39582C-page 63 PIC16F87XA 8.0 CAPTURE/COMPARE/PWM MODULES Each Capture/Compare/PWM (CCP) module contains a 16-bit register which can operate as a: • 16-bit Capture register • 16-bit Compare register • PWM Master/Slave Duty Cycle register Both the CCP1 and CCP2 modules are identical in operation, with the exception being the operation of the special event trigger. Table 8-1 and Table 8-2 show the resources and interactions of the CCP module(s). In the following sections, the operation of a CCP module is described with respect to CCP1. CCP2 operates the same as CCP1 except where noted. CCP1 Module: Capture/Compare/PWM Register 1 (CCPR1) is comprised of two 8-bit registers: CCPR1L (low byte) and CCPR1H (high byte). The CCP1CON register controls the operation of CCP1. The special event trigger is generated by a compare match and will reset Timer1. CCP2 Module: Capture/Compare/PWM Register 2 (CCPR2) is comprised of two 8-bit registers: CCPR2L (low byte) and CCPR2H (high byte). The CCP2CON register controls the operation of CCP2. The special event trigger is generated by a compare match and will reset Timer1 and start an A/D conversion (if the A/D module is enabled). Additional information on CCP modules is available in the PIC® Mid-Range MCU Family Reference Manual (DS33023) and in application note AN594, “Using the CCP Module(s)” (DS00594). TABLE 8-1: CCP MODE – TIMER RESOURCES REQUIRED TABLE 8-2: INTERACTION OF TWO CCP MODULES CCP Mode Timer Resource Capture Compare PWM Timer1 Timer1 Timer2 CCPx Mode CCPy Mode Interaction Capture Capture Same TMR1 time base Capture Compare The compare should be configured for the special event trigger which clears TMR1 Compare Compare The compare(s) should be configured for the special event trigger which clears TMR1 PWM PWM The PWMs will have the same frequency and update rate (TMR2 interrupt) PWM Capture None PWM Compare None PIC16F87XA DS39582C-page 64  2001-2013 Microchip Technology Inc. REGISTER 8-1: CCP1CON REGISTER/CCP2CON REGISTER (ADDRESS 17h/1Dh) U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — CCPxX CCPxY CCPxM3 CCPxM2 CCPxM1 CCPxM0 bit 7 bit 0 bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 CCPxX:CCPxY: PWM Least Significant bits Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL. bit 3-0 CCPxM3:CCPxM0: CCPx Mode Select bits 0000 = Capture/Compare/PWM disabled (resets CCPx module) 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, set output on match (CCPxIF bit is set) 1001 = Compare mode, clear output on match (CCPxIF bit is set) 1010 = Compare mode, generate software interrupt on match (CCPxIF bit is set, CCPx pin is unaffected) 1011 = Compare mode, trigger special event (CCPxIF bit is set, CCPx pin is unaffected); CCP1 resets TMR1; CCP2 resets TMR1 and starts an A/D conversion (if A/D module is enabled) 11xx = PWM mode Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 65 PIC16F87XA 8.1 Capture Mode In Capture mode, CCPR1H:CCPR1L captures the 16-bit value of the TMR1 register when an event occurs on pin RC2/CCP1. An event is defined as one of the following: • Every falling edge • Every rising edge • Every 4th rising edge • Every 16th rising edge The type of event is configured by control bits, CCP1M3:CCP1M0 (CCPxCON<3:0>). When a capture is made, the interrupt request flag bit, CCP1IF (PIR1<2>), is set. The interrupt flag must be cleared in software. If another capture occurs before the value in register CCPR1 is read, the old captured value is overwritten by the new value. 8.1.1 CCP PIN CONFIGURATION In Capture mode, the RC2/CCP1 pin should be configured as an input by setting the TRISC<2> bit. FIGURE 8-1: CAPTURE MODE OPERATION BLOCK DIAGRAM 8.1.2 TIMER1 MODE SELECTION Timer1 must be running in Timer mode, or Synchronized Counter mode, for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. 8.1.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep bit CCP1IE (PIE1<2>) clear to avoid false interrupts and should clear the flag bit, CCP1IF, following any such change in operating mode. 8.1.4 CCP PRESCALER There are four prescaler settings, specified by bits CCP1M3:CCP1M0. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared, therefore, the first capture may be from a non-zero prescaler. Example 8-1 shows the recommended method for switching between capture prescalers. This example also clears the prescaler counter and will not generate the “false” interrupt. EXAMPLE 8-1: CHANGING BETWEEN CAPTURE PRESCALERS Note: If the RC2/CCP1 pin is configured as an output, a write to the port can cause a Capture condition. CCPR1H CCPR1L TMR1H TMR1L Set Flag bit CCP1IF (PIR1<2>) Capture Enable Qs CCP1CON<3:0> RC2/CCP1 Prescaler  1, 4, 16 and Edge Detect pin CLRF CCP1CON ; Turn CCP module off MOVLW NEW_CAPT_PS ; Load the W reg with ; the new prescaler ; move value and CCP ON MOVWF CCP1CON ; Load CCP1CON with this ; value PIC16F87XA DS39582C-page 66  2001-2013 Microchip Technology Inc. 8.2 Compare Mode In Compare mode, the 16-bit CCPR1 register value is constantly compared against the TMR1 register pair value. When a match occurs, the RC2/CCP1 pin is: • Driven high • Driven low • Remains unchanged The action on the pin is based on the value of control bits, CCP1M3:CCP1M0 (CCP1CON<3:0>). At the same time, interrupt flag bit CCP1IF is set. FIGURE 8-2: COMPARE MODE OPERATION BLOCK DIAGRAM 8.2.1 CCP PIN CONFIGURATION The user must configure the RC2/CCP1 pin as an output by clearing the TRISC<2> bit. 8.2.2 TIMER1 MODE SELECTION Timer1 must be running in Timer mode, or Synchronized Counter mode, if the CCP module is using the compare feature. In Asynchronous Counter mode, the compare operation may not work. 8.2.3 SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen, the CCP1 pin is not affected. The CCPIF bit is set, causing a CCP interrupt (if enabled). 8.2.4 SPECIAL EVENT TRIGGER In this mode, an internal hardware trigger is generated which may be used to initiate an action. The special event trigger output of CCP1 resets the TMR1 register pair. This allows the CCPR1 register to effectively be a 16-bit programmable period register for Timer1. The special event trigger output of CCP2 resets the TMR1 register pair and starts an A/D conversion (if the A/D module is enabled). Note: Clearing the CCP1CON register will force the RC2/CCP1 compare output latch to the default low level. This is not the PORTC I/O data latch. CCPR1H CCPR1L TMR1H TMR1L Comparator Q S R Output Logic Special Event Trigger Set Flag bit CCP1IF (PIR1<2>) Match RC2/CCP1 TRISC<2> CCP1CON<3:0> Mode Select Output Enable pin Special event trigger will: reset Timer1, but not set interrupt flag bit TMR1IF (PIR1<0>) and set bit GO/DONE (ADCON0<2>). Note: The special event trigger from the CCP1 and CCP2 modules will not set interrupt flag bit TMR1IF (PIR1<0>).  2001-2013 Microchip Technology Inc. DS39582C-page 67 PIC16F87XA 8.3 PWM Mode (PWM) In Pulse Width Modulation mode, the CCPx pin produces up to a 10-bit resolution PWM output. Since the CCP1 pin is multiplexed with the PORTC data latch, the TRISC<2> bit must be cleared to make the CCP1 pin an output. Figure 8-3 shows a simplified block diagram of the CCP module in PWM mode. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 8.3.3 “Setup for PWM Operation”. FIGURE 8-3: SIMPLIFIED PWM BLOCK DIAGRAM A PWM output (Figure 8-4) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period). FIGURE 8-4: PWM OUTPUT 8.3.1 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following formula: PWM Period = [(PR2) + 1] • 4 • TOSC • (TMR2 Prescale Value) PWM frequency is defined as 1/[PWM period]. When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCP1 pin is set (exception: if PWM duty cycle = 0%, the CCP1 pin will not be set) • The PWM duty cycle is latched from CCPR1L into CCPR1H 8.3.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing to the CCPR1L register and to the CCP1CON<5:4> bits. Up to 10-bit resolution is available. The CCPR1L contains the eight MSbs and the CCP1CON<5:4> contains the two LSbs. This 10-bit value is represented by CCPR1L:CCP1CON<5:4>. The following equation is used to calculate the PWM duty cycle in time: PWM Duty Cycle =(CCPR1L:CCP1CON<5:4>) • TOSC • (TMR2 Prescale Value) CCPR1L and CCP1CON<5:4> can be written to at any time, but the duty cycle value is not latched into CCPR1H until after a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPR1H is a read-only register. The CCPR1H register and a 2-bit internal latch are used to double-buffer the PWM duty cycle. This double-buffering is essential for glitch-free PWM operation. When the CCPR1H and 2-bit latch match TMR2, concatenated with an internal 2-bit Q clock or 2 bits of the TMR2 prescaler, the CCP1 pin is cleared. The maximum PWM resolution (bits) for a given PWM frequency is given by the following formula. EQUATION 8-1: Note: Clearing the CCP1CON register will force the CCP1 PWM output latch to the default low level. This is not the PORTC I/O data latch. CCPR1L CCPR1H (Slave) Comparator TMR2 Comparator PR2 (Note 1) R Q S Duty Cycle Registers CCP1CON<5:4> Clear Timer, CCP1 pin and latch D.C. TRISC<2> RC2/CCP1 Note 1: The 8-bit timer is concatenated with 2-bit internal Q clock, or 2 bits of the prescaler, to create 10-bit time base. Period Duty Cycle TMR2 = PR2 TMR2 = Duty Cycle TMR2 = PR2 Note: The Timer2 postscaler (see Section 7.1 “Timer2 Prescaler and Postscaler”) is not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. Note: If the PWM duty cycle value is longer than the PWM period, the CCP1 pin will not be cleared. log(FPWM log(2) FOSC ) Resolution = bits PIC16F87XA DS39582C-page 68  2001-2013 Microchip Technology Inc. 8.3.3 SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for PWM operation: 1. Set the PWM period by writing to the PR2 register. 2. Set the PWM duty cycle by writing to the CCPR1L register and CCP1CON<5:4> bits. 3. Make the CCP1 pin an output by clearing the TRISC<2> bit. 4. Set the TMR2 prescale value and enable Timer2 by writing to T2CON. 5. Configure the CCP1 module for PWM operation. TABLE 8-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 20 MHz TABLE 8-4: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE AND TIMER1 PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12kHz 156.3 kHz 208.3 kHz Timer Prescaler (1, 4, 16) 16 4 1 1 1 1 PR2 Value 0xFFh 0xFFh 0xFFh 0x3Fh 0x1Fh 0x17h Maximum Resolution (bits) 10 10 10 8 7 5.5 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh,8Bh, 10Bh, 18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 0Dh PIR2 — — — — — — — CCP2IF ---- ---0 ---- ---0 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 8Dh PIE2 — — — — — — — CCP2IE ---- ---0 ---- ---0 87h TRISC PORTC Data Direction Register 1111 1111 1111 1111 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 10h T1CON — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu 15h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu 16h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu 17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 1Bh CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu 1Ch CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu 1Dh CCP2CON — — CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by Capture and Timer1. Note 1: The PSP is not implemented on 28-pin devices; always maintain these bits clear.  2001-2013 Microchip Technology Inc. DS39582C-page 69 PIC16F87XA TABLE 8-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh,8Bh, 10Bh, 18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 0Dh PIR2 — — — — — — — CCP2IF ---- ---0 ---- ---0 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 8Dh PIE2 — — — — — — — CCP2IE ---- ---0 ---- ---0 87h TRISC PORTC Data Direction Register 1111 1111 1111 1111 11h TMR2 Timer2 Module’s Register 0000 0000 0000 0000 92h PR2 Timer2 Module’s Period Register 1111 1111 1111 1111 12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 15h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu 16h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu 17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 1Bh CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu 1Ch CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu 1Dh CCP2CON — — CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by PWM and Timer2. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear. PIC16F87XA DS39582C-page 70  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 71 PIC16F87XA 9.0 MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE 9.1 Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface, useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C) - Full Master mode - Slave mode (with general address call) The I2C interface supports the following modes in hardware: • Master mode • Multi-Master mode • Slave mode 9.2 Control Registers The MSSP module has three associated registers. These include a status register (SSPSTAT) and two control registers (SSPCON and SSPCON2). The use of these registers and their individual configuration bits differ significantly, depending on whether the MSSP module is operated in SPI or I2C mode. Additional details are provided under the individual sections. 9.3 SPI Mode The SPI mode allows 8 bits of data to be synchronously transmitted and received simultaneously. All four modes of SPI are supported. To accomplish communication, typically three pins are used: • Serial Data Out (SDO) – RC5/SDO • Serial Data In (SDI) – RC4/SDI/SDA • Serial Clock (SCK) – RC3/SCK/SCL Additionally, a fourth pin may be used when in a Slave mode of operation: • Slave Select (SS) – RA5/AN4/SS/C2OUT Figure 9-1 shows the block diagram of the MSSP module when operating in SPI mode. FIGURE 9-1: MSSP BLOCK DIAGRAM (SPI MODE) Note: When the SPI is in Slave mode with SS pin control enabled (SSPCON<3:0> = 0100), the state of the SS pin can affect the state read back from the TRISC<5> bit. The Peripheral OE signal from the SSP module in PORTC controls the state that is read back from the TRISC<5> bit (see Section 4.3 “PORTC and the TRISC Register” for information on PORTC). If Read-Modify-Write instructions, such as BSF, are performed on the TRISC register while the SS pin is high, this will cause the TRISC<5> bit to be set, thus disabling the SDO output. Read Write Internal Data Bus SSPSR reg SSPM3:SSPM0 bit0 Shift Clock SS Control Enable Edge Select Clock Select TMR2 Output Prescaler TOSC 4, 16, 64 2 Edge Select 2 4 Data to TX/RX in SSPSR TRIS bit 2 SMP:CKE RC5/SDO  SSPBUF reg RC4/SDI/SDA RA5/AN4/ RC3/SCK/SCL Peripheral OE SS/C2OUT PIC16F87XA DS39582C-page 72  2001-2013 Microchip Technology Inc. 9.3.1 REGISTERS The MSSP module has four registers for SPI mode operation. These are: • MSSP Control Register (SSPCON) • MSSP Status Register (SSPSTAT) • Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible SSPCON and SSPSTAT are the control and status registers in SPI mode operation. The SSPCON register is readable and writable. The lower six bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. REGISTER 9-1: SSPSTAT: MSSP STATUS REGISTER (SPI MODE) (ADDRESS 94h) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 bit 7 SMP: Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode. bit 6 CKE: SPI Clock Select bit 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state Note: Polarity of clock state is set by the CKP bit (SSPCON1<4>). bit 5 D/A: Data/Address bit Used in I2C mode only. bit 4 P: Stop bit Used in I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared. bit 3 S: Start bit Used in I2C mode only. bit 2 R/W: Read/Write bit information Used in I2C mode only. bit 1 UA: Update Address bit Used in I2C mode only. bit 0 BF: Buffer Full Status bit (Receive mode only) 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 73 PIC16F87XA REGISTER 9-2: SSPCON1: MSSP CONTROL REGISTER 1 (SPI MODE) (ADDRESS 14h) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 bit 7 bit 0 bit 7 WCOL: Write Collision Detect bit (Transmit mode only) 1 = The SSPBUF register is written while it is still transmitting the previous word. (Must be cleared in software.) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit SPI Slave mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user must read the SSPBUF, even if only transmitting data, to avoid setting overflow. (Must be cleared in software.) 0 = No overflow Note: In Master mode, the overflow bit is not set, since each new reception (and transmission) is initiated by writing to the SSPBUF register. bit 5 SSPEN: Synchronous Serial Port Enable bit 1 = Enables serial port and configures SCK, SDO, SDI, and SS as serial port pins 0 = Disables serial port and configures these pins as I/O port pins Note: When enabled, these pins must be properly configured as input or output. bit 4 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits 0101 = SPI Slave mode, clock = SCK pin. SS pin control disabled. SS can be used as I/O pin. 0100 = SPI Slave mode, clock = SCK pin. SS pin control enabled. 0011 = SPI Master mode, clock = TMR2 output/2 0010 = SPI Master mode, clock = FOSC/64 0001 = SPI Master mode, clock = FOSC/16 0000 = SPI Master mode, clock = FOSC/4 Note: Bit combinations not specifically listed here are either reserved or implemented in I 2C mode only. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 74  2001-2013 Microchip Technology Inc. 9.3.2 OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON<5:0> and SSPSTAT<7:6>). These control bits allow the following to be specified: • Master mode (SCK is the clock output) • Slave mode (SCK is the clock input) • Clock Polarity (Idle state of SCK) • Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCK) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) The MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the eight bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full detect bit, BF (SSPSTAT<0>), and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data will be ignored and the write collision detect bit, WCOL (SSPCON<7>), will be set. User software must clear the WCOL bit so that it can be determined if the following write(s) to the SSPBUF register completed successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. Buffer Full bit, BF (SSPSTAT<0>), indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. The SSPBUF must be read and/or written. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. Example 9-1 shows the loading of the SSPBUF (SSPSR) for data transmission. The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the MSSP Status register (SSPSTAT) indicates the various status conditions. EXAMPLE 9-1: LOADING THE SSPBUF (SSPSR) REGISTER LOOP BTFSS SSPSTAT, BF ;Has data been received(transmit complete)? BRA LOOP ;No MOVF SSPBUF, W ;WREG reg = contents of SSPBUF MOVWF RXDATA ;Save in user RAM, if data is meaningful MOVF TXDATA, W ;W reg = contents of TXDATA MOVWF SSPBUF ;New data to xmit  2001-2013 Microchip Technology Inc. DS39582C-page 75 PIC16F87XA 9.3.3 ENABLING SPI I/O To enable the serial port, SSP Enable bit, SSPEN (SSPCON<5>), must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, re-initialize the SSPCON registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed. That is: • SDI is automatically controlled by the SPI module • SDO must have TRISC<5> bit cleared • SCK (Master mode) must have TRISC<3> bit cleared • SCK (Slave mode) must have TRISC<3> bit set • SS must have TRISC<4> bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. 9.3.4 TYPICAL CONNECTION Figure 9-2 shows a typical connection between two microcontrollers. The master controller (Processor 1) initiates the data transfer by sending the SCK signal. Data is shifted out of both shift registers on their programmed clock edge and latched on the opposite edge of the clock. Both processors should be programmed to the same Clock Polarity (CKP), then both controllers would send and receive data at the same time. Whether the data is meaningful (or dummy data) depends on the application software. This leads to three scenarios for data transmission: • Master sends data – Slave sends dummy data • Master sends data – Slave sends data • Master sends dummy data – Slave sends data FIGURE 9-2: SPI MASTER/SLAVE CONNECTION Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDO SDI PROCESSOR 1 SCK SPI Master SSPM3:SSPM0 = 00xxb Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDI SDO PROCESSOR 2 SCK SPI Slave SSPM3:SSPM0 = 010xb Serial Clock PIC16F87XA DS39582C-page 76  2001-2013 Microchip Technology Inc. 9.3.5 MASTER MODE The master can initiate the data transfer at any time because it controls the SCK. The master determines when the slave (Processor 2, Figure 9-2) is to broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be disabled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and status bits appropriately set). This could be useful in receiver applications as a “Line Activity Monitor” mode. The clock polarity is selected by appropriately programming the CKP bit (SSPCON<4>). This then, would give waveforms for SPI communication as shown in Figure 9-3, Figure 9-5 and Figure 9-6, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user programmable to be one of the following: • FOSC/4 (or TCY) • FOSC/16 (or 4 • TCY) • FOSC/64 (or 16 • TCY) • Timer2 output/2 This allows a maximum data rate (at 40 MHz) of 10.00 Mbps. Figure 9-3 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown. FIGURE 9-3: SPI MODE WAVEFORM (MASTER MODE) SCK (CKP = 0 SCK (CKP = 1 SCK (CKP = 0 SCK (CKP = 1 4 Clock Modes Input Sample Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bit 7 bit 0 SDI SSPIF (SMP = 1) (SMP = 0) (SMP = 1) CKE = 1) CKE = 0) CKE = 1) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 0) (CKE = 1) Next Q4 Cycle after Q2  2001-2013 Microchip Technology Inc. DS39582C-page 77 PIC16F87XA 9.3.6 SLAVE MODE In Slave mode, the data is transmitted and received as the external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the electrical specifications. While in Sleep mode, the slave can transmit/receive data. When a byte is received, the device will wake-up from Sleep. 9.3.7 SLAVE SELECT SYNCHRONIZATION The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON<3:0> = 04h). The pin must not be driven low for the SS pin to function as an input. The data latch must be high. When the SS pin is low, transmission and reception are enabled and the SDO pin is driven. When the SS pin goes high, the SDO pin is no longer driven even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable, depending on the application. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. To emulate two-wire communication, the SDO pin can be connected to the SDI pin. When the SPI needs to operate as a receiver, the SDO pin can be configured as an input. This disables transmissions from the SDO. The SDI can always be left as an input (SDI function) since it cannot create a bus conflict. FIGURE 9-4: SLAVE SYNCHRONIZATION WAVEFORM Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON<3:0> = 0100), the SPI module will reset if the SS pin is set to VDD. 2: If the SPI is used in Slave Mode with CKE set, then the SS pin control must be enabled. SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 7 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag bit 0 bit 7 bit 0 Next Q4 Cycle after Q2 PIC16F87XA DS39582C-page 78  2001-2013 Microchip Technology Inc. FIGURE 9-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) FIGURE 9-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Optional Next Q4 Cycle after Q2 SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 1) CKE = 1) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Not Optional Next Q4 Cycle after Q2  2001-2013 Microchip Technology Inc. DS39582C-page 79 PIC16F87XA 9.3.8 SLEEP OPERATION In Master mode, all module clocks are halted and the transmission/reception will remain in that state until the device wakes from Sleep. After the device returns to normal mode, the module will continue to transmit/ receive data. In Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in Sleep mode and data to be shifted into the SPI Transmit/Receive Shift register. When all 8 bits have been received, the MSSP interrupt flag bit will be set and if enabled, will wake the device from Sleep. 9.3.9 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 9.3.10 BUS MODE COMPATIBILITY Table 9-1 shows the compatibility between the standard SPI modes and the states of the CKP and CKE control bits. TABLE 9-1: SPI BUS MODES There is also a SMP bit which controls when the data is sampled. TABLE 9-2: REGISTERS ASSOCIATED WITH SPI OPERATION Standard SPI Mode Terminology Control Bits State CKP CKE 0, 0 0 1 0, 1 0 0 1, 0 1 1 1, 1 1 0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets INTCON GIE/ GIEH PEIE/ GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 TRISC PORTC Data Direction Register 1111 1111 1111 1111 SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000 TRISA — PORTA Data Direction Register --11 1111 --11 1111 SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode. Note 1: The PSPIF, PSPIE and PSPIP bits are reserved on 28-pin devices; always maintain these bits clear. PIC16F87XA DS39582C-page 80  2001-2013 Microchip Technology Inc. 9.4 I2C Mode The MSSP module in I2C mode fully implements all master and slave functions (including general call support) and provides interrupts on Start and Stop bits in hardware to determine a free bus (multi-master function). The MSSP module implements the standard mode specifications, as well as 7-bit and 10-bit addressing. Two pins are used for data transfer: • Serial clock (SCL) – RC3/SCK/SCL • Serial data (SDA) – RC4/SDI/SDA The user must configure these pins as inputs or outputs through the TRISC<4:3> bits. FIGURE 9-7: MSSP BLOCK DIAGRAM (I2C MODE) 9.4.1 REGISTERS The MSSP module has six registers for I2C operation. These are: • MSSP Control Register (SSPCON) • MSSP Control Register 2 (SSPCON2) • MSSP Status Register (SSPSTAT) • Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible • MSSP Address Register (SSPADD) SSPCON, SSPCON2 and SSPSTAT are the control and status registers in I2C mode operation. The SSPCON and SSPCON2 registers are readable and writable. The lower six bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. SSPADD register holds the slave device address when the SSP is configured in I2C Slave mode. When the SSP is configured in Master mode, the lower seven bits of SSPADD act as the baud rate generator reload value. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. Read Write SSPSR reg Match Detect SSPADD reg Start and Stop bit Detect SSPBUF reg Internal Data Bus Addr Match Set, Reset S, P bits (SSPSTAT reg) RC3/SCK/SCL RC4/SDI/ Shift Clock MSb LSb SDA  2001-2013 Microchip Technology Inc. DS39582C-page 81 PIC16F87XA REGISTER 9-3: SSPSTAT: MSSP STATUS REGISTER (I2C MODE) (ADDRESS 94h) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 bit 7 SMP: Slew Rate Control bit In Master or Slave mode: 1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high-speed mode (400 kHz) bit 6 CKE: SMBus Select bit In Master or Slave mode: 1 = Enable SMBus specific inputs 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit In Master mode: Reserved. In Slave mode: 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Note: This bit is cleared on Reset and when SSPEN is cleared. bit 3 S: Start bit 1 = Indicates that a Start bit has been detected last 0 = Start bit was not detected last Note: This bit is cleared on Reset and when SSPEN is cleared. bit 2 R/W: Read/Write bit information (I2C mode only) In Slave mode: 1 = Read 0 = Write Note: This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit or not ACK bit. In Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress Note: ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode. bit 1 UA: Update Address (10-bit Slave mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit In Transmit mode: 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty In Receive mode: 1 = Data Transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data Transmit complete (does not include the ACK and Stop bits), SSPBUF is empty Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 82  2001-2013 Microchip Technology Inc. REGISTER 9-4: SSPCON1: MSSP CONTROL REGISTER 1 (I2C MODE) (ADDRESS 14h) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 bit 7 bit 0 bit 7 WCOL: Write Collision Detect bit In Master Transmit mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started. (Must be cleared in software.) 0 = No collision In Slave Transmit mode: 1 = The SSPBUF register is written while it is still transmitting the previous word. (Must be cleared in software.) 0 = No collision In Receive mode (Master or Slave modes): This is a “don’t care” bit. bit 6 SSPOV: Receive Overflow Indicator bit In Receive mode: 1 = A byte is received while the SSPBUF register is still holding the previous byte. (Must be cleared in software.) 0 = No overflow In Transmit mode: This is a “don’t care” bit in Transmit mode. bit 5 SSPEN: Synchronous Serial Port Enable bit 1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins 0 = Disables the serial port and configures these pins as I/O port pins Note: When enabled, the SDA and SCL pins must be properly configured as input or output. bit 4 CKP: SCK Release Control bit In Slave mode: 1 = Release clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In Master mode: Unused in this mode. bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1011 = I2C Firmware Controlled Master mode (Slave Idle) 1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1)) 0111 = I2C Slave mode, 10-bit address 0110 = I2C Slave mode, 7-bit address Note: Bit combinations not specifically listed here are either reserved or implemented in SPI mode only. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 83 PIC16F87XA REGISTER 9-5: SSPCON2: MSSP CONTROL REGISTER 2 (I2C MODE) (ADDRESS 91h) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 bit 7 GCEN: General Call Enable bit (Slave mode only) 1 = Enable interrupt when a general call address (0000h) is received in the SSPSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only) 1 = Acknowledge was not received from slave 0 = Acknowledge was received from slave bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only) 1 = Not Acknowledge 0 = Acknowledge Note: Value that will be transmitted when the user initiates an Acknowledge sequence at the end of a receive. bit 4 ACKEN: Acknowledge Sequence Enable bit (Master Receive mode only) 1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence Idle bit 3 RCEN: Receive Enable bit (Master mode only) 1 = Enables Receive mode for I2C 0 = Receive Idle bit 2 PEN: Stop Condition Enable bit (Master mode only) 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enabled bit (Master mode only) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enabled/Stretch Enabled bit In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is enabled for slave transmit only (PIC16F87X compatibility) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). PIC16F87XA DS39582C-page 84  2001-2013 Microchip Technology Inc. 9.4.2 OPERATION The MSSP module functions are enabled by setting MSSP Enable bit, SSPEN (SSPCON<5>). The SSPCON register allows control of the I2C operation. Four mode selection bits (SSPCON<3:0>) allow one of the following I2C modes to be selected: • I2C Master mode, clock = OSC/4 (SSPADD + 1) • I2C Slave mode (7-bit address) • I2C Slave mode (10-bit address) • I2C Slave mode (7-bit address) with Start and Stop bit interrupts enabled • I2C Slave mode (10-bit address) with Start and Stop bit interrupts enabled • I2C Firmware Controlled Master mode, slave is Idle Selection of any I2C mode, with the SSPEN bit set, forces the SCL and SDA pins to be open-drain, provided these pins are programmed to inputs by setting the appropriate TRISC bits. To ensure proper operation of the module, pull-up resistors must be provided externally to the SCL and SDA pins. 9.4.3 SLAVE MODE In Slave mode, the SCL and SDA pins must be configured as inputs (TRISC<4:3> set). The MSSP module will override the input state with the output data when required (slave-transmitter). The I2C Slave mode hardware will always generate an interrupt on an address match. Through the mode select bits, the user can also choose to interrupt on Start and Stop bits When an address is matched, or the data transfer after an address match is received, the hardware automatically will generate the Acknowledge (ACK) pulse and load the SSPBUF register with the received value currently in the SSPSR register. Any combination of the following conditions will cause the MSSP module not to give this ACK pulse: • The buffer full bit, BF (SSPSTAT<0>), was set before the transfer was received. • The overflow bit, SSPOV (SSPCON<6>), was set before the transfer was received. In this case, the SSPSR register value is not loaded into the SSPBUF, but bit SSPIF (PIR1<3>) is set. The BF bit is cleared by reading the SSPBUF register, while bit SSPOV is cleared through software. The SCL clock input must have a minimum high and low for proper operation. The high and low times of the I 2C specification, as well as the requirement of the MSSP module, are shown in timing parameter #100 and parameter #101. 9.4.3.1 Addressing Once the MSSP module has been enabled, it waits for a Start condition to occur. Following the Start condition, the 8 bits are shifted into the SSPSR register. All incoming bits are sampled with the rising edge of the clock (SCL) line. The value of register SSPSR<7:1> is compared to the value of the SSPADD register. The address is compared on the falling edge of the eighth clock (SCL) pulse. If the addresses match, and the BF and SSPOV bits are clear, the following events occur: 1. The SSPSR register value is loaded into the SSPBUF register. 2. The Buffer Full bit, BF, is set. 3. An ACK pulse is generated. 4. MSSP Interrupt Flag bit, SSPIF (PIR1<3>), is set (interrupt is generated if enabled) on the falling edge of the ninth SCL pulse. In 10-bit Address mode, two address bytes need to be received by the slave. The five Most Significant bits (MSbs) of the first address byte specify if this is a 10-bit address. Bit R/W (SSPSTAT<2>) must specify a write so the slave device will receive the second address byte. For a 10-bit address, the first byte would equal ‘11110 A9 A8 0’, where ‘A9’ and ‘A8’ are the two MSbs of the address. The sequence of events for 10-bit address is as follows, with steps 7 through 9 for the slave-transmitter: 1. Receive first (high) byte of address (bits SSPIF, BF and bit UA (SSPSTAT<1>) are set). 2. Update the SSPADD register with second (low) byte of address (clears bit UA and releases the SCL line). 3. Read the SSPBUF register (clears bit BF) and clear flag bit SSPIF. 4. Receive second (low) byte of address (bits SSPIF, BF and UA are set). 5. Update the SSPADD register with the first (high) byte of address. If match releases SCL line, this will clear bit UA. 6. Read the SSPBUF register (clears bit BF) and clear flag bit SSPIF. 7. Receive Repeated Start condition. 8. Receive first (high) byte of address (bits SSPIF and BF are set). 9. Read the SSPBUF register (clears bit BF) and clear flag bit SSPIF.  2001-2013 Microchip Technology Inc. DS39582C-page 85 PIC16F87XA 9.4.3.2 Reception When the R/W bit of the address byte is clear and an address match occurs, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and the SDA line is held low (ACK). When the address byte overflow condition exists, then the No Acknowledge (ACK) pulse is given. An overflow condition is defined as either bit BF (SSPSTAT<0>) is set or bit SSPOV (SSPCON<6>) is set. An MSSP interrupt is generated for each data transfer byte. Flag bit SSPIF (PIR1<3>) must be cleared in software. The SSPSTAT register is used to determine the status of the byte. If SEN is enabled (SSPCON<0> = 1), RC3/SCK/SCL will be held low (clock stretch) following each data transfer. The clock must be released by setting bit CKP (SSPCON<4>). See Section 9.4.4 “Clock Stretching” for more detail. 9.4.3.3 Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register. The ACK pulse will be sent on the ninth bit and pin RC3/SCK/SCL is held low regardless of SEN (see Section 9.4.4 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. The transmit data must be loaded into the SSPBUF register, which also loads the SSPSR register. Then pin RC3/SCK/SCL should be enabled by setting bit CKP (SSPCON<4>). The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time (Figure 9-9). The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. If the SDA line is high (not ACK), then the data transfer is complete. In this case, when the ACK is latched by the slave, the slave logic is reset (resets SSPSTAT register) and the slave monitors for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, pin RC3/SCK/SCL must be enabled by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared in software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse. PIC16F87XA DS39582C-page 86  2001-2013 Microchip Technology Inc. FIGURE 9-8: I2C SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON<6>) S 1 2 34 56 7 8 91 234 5 67 89 1 23 45 7 89 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 ACK Receiving Data ACK Receiving Data R/W = 0 ACK Receiving Address Cleared in software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP (CKP does not reset to ‘0’ when SEN = 0)  2001-2013 Microchip Technology Inc. DS39582C-page 87 PIC16F87XA FIGURE 9-9: I2C SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESS) SDA SCL SSPIF (PIR1<3>) BF (SSPSTAT<0>) A6 A5 A4 A3 A2 A1 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9 SSPBUF is written in software Cleared in software SCL held low while CPU responds to SSPIF From SSPIF ISR Data in sampled S ACK Transmitting Data R/W = 1 ACK Receiving Address A7 D7 9 1 D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 SSPBUF is written in software Cleared in software From SSPIF ISR Transmitting Data D7 1 CKP P ACK CKP is set in software CKP is set in software PIC16F87XA DS39582C-page 88  2001-2013 Microchip Technology Inc. FIGURE 9-10: I2C SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 234 567 89 1 2345 67 89 1 2345 7 89 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared in software D2 6 (PIR1<3>) Cleared in software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP D7 D6 D5 D4 D3 D1 D0 12345 789 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared in software Cleared in software SSPOV (SSPCON<6>) SSPOV is set because SSPBUF is still full. ACK is not sent. (CKP does not reset to ‘0’ when SEN = 0) Clock is held low until update of SSPADD has taken place  2001-2013 Microchip Technology Inc. DS39582C-page 89 PIC16F87XA FIGURE 9-11: I2C SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 234 56 789 1 2345 67 89 1 2345 789 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 1 1 1 0 A8 R/W=1 ACK ACK R/W = 0 ACK Receive First Byte of Address Cleared in software Bus master terminates transfer A9 6 (PIR1<3>) Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag Receive First Byte of Address D7 D6 D5 D4 D3 D1 12345 789 ACK D2 6 Transmitting Data Byte D0 Dummy read of SSPBUF to clear BF flag Sr Cleared in software Write of SSPBUF initiates transmit Cleared in software Completion of clears BF flag CKP (SSPCON<4>) CKP is set in software CKP is automatically cleared in hardware holding SCL low Clock is held low until update of SSPADD has taken place data transmission Clock is held low until CKP is set to ‘1’ BF flag is clear at the end of the third address sequence PIC16F87XA DS39582C-page 90  2001-2013 Microchip Technology Inc. 9.4.4 CLOCK STRETCHING Both 7 and 10-bit Slave modes implement automatic clock stretching during a transmit sequence. The SEN bit (SSPCON2<0>) allows clock stretching to be enabled during receives. Setting SEN will cause the SCL pin to be held low at the end of each data receive sequence. 9.4.4.1 Clock Stretching for 7-bit Slave Receive Mode (SEN = 1) In 7-bit Slave Receive mode, on the falling edge of the ninth clock at the end of the ACK sequence, if the BF bit is set, the CKP bit in the SSPCON register is automatically cleared, forcing the SCL output to be held low. The CKP bit being cleared to ‘0’ will assert the SCL line low. The CKP bit must be set in the user’s ISR before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the SSPBUF before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring (see Figure 9-13). 9.4.4.2 Clock Stretching for 10-bit Slave Receive Mode (SEN = 1) In 10-bit Slave Receive mode, during the address sequence, clock stretching automatically takes place but CKP is not cleared. During this time, if the UA bit is set after the ninth clock, clock stretching is initiated. The UA bit is set after receiving the upper byte of the 10-bit address and following the receive of the second byte of the 10-bit address, with the R/W bit cleared to ‘0’. The release of the clock line occurs upon updating SSPADD. Clock stretching will occur on each data receive sequence as described in 7-bit mode. 9.4.4.3 Clock Stretching for 7-bit Slave Transmit Mode 7-bit Slave Transmit mode implements clock stretching by clearing the CKP bit after the falling edge of the ninth clock, if the BF bit is clear. This occurs regardless of the state of the SEN bit. The user’s ISR must set the CKP bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the SSPBUF before the master device can initiate another transmit sequence (see Figure 9-9). 9.4.4.4 Clock Stretching for 10-bit Slave Transmit Mode In 10-bit Slave Transmit mode, clock stretching is controlled during the first two address sequences by the state of the UA bit, just as it is in 10-bit Slave Receive mode. The first two addresses are followed by a third address sequence, which contains the high order bits of the 10-bit address and the R/W bit set to ‘1’. After the third address sequence is performed, the UA bit is not set, the module is now configured in Transmit mode and clock stretching is controlled by the BF flag as in 7-bit Slave Transmit mode (see Figure 9-11). Note 1: If the user reads the contents of the SSPBUF before the falling edge of the ninth clock, thus clearing the BF bit, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. The user should be careful to clear the BF bit in the ISR before the next receive sequence in order to prevent an overflow condition. Note: If the user polls the UA bit and clears it by updating the SSPADD register before the falling edge of the ninth clock occurs and if the user hasn’t cleared the BF bit by reading the SSPBUF register before that time, then the CKP bit will still NOT be asserted low. Clock stretching, on the basis of the state of the BF bit, only occurs during a data sequence, not an address sequence. Note 1: If the user loads the contents of SSPBUF, setting the BF bit before the falling edge of the ninth clock, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit.  2001-2013 Microchip Technology Inc. DS39582C-page 91 PIC16F87XA 9.4.4.5 Clock Synchronization and the CKP Bit When the CKP bit is cleared, the SCL output is forced to ‘0’; however, setting the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have deasserted SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 9-12). FIGURE 9-12: CLOCK SYNCHRONIZATION TIMING SDA SCL DX DX-1 WR Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SSPCON CKP Master device deasserts clock Master device asserts clock PIC16F87XA DS39582C-page 92  2001-2013 Microchip Technology Inc. FIGURE 9-13: I2C SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON<6>) S 1 2 34 56 7 8 9 1 234 5 67 89 1 23 45 7 89 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 ACK Receiving Data ACK Receiving Data R/W = 0 ACK Receiving Address Cleared in software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP CKP written to ‘1’ in If BF is cleared prior to the falling edge of the 9th clock, CKP will not be reset to ‘0’ and no clock stretching will occur software Clock is held low until CKP is set to ‘1’ Clock is not held low because buffer full bit is clear prior to falling edge of 9th clock Clock is not held low because ACK = 1 BF is set after falling edge of the 9th clock, CKP is reset to ‘0’ and clock stretching occurs  2001-2013 Microchip Technology Inc. DS39582C-page 93 PIC16F87XA FIGURE 9-14: I2C SLAVE MODE TIMING SEN = 1 (RECEPTION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 234 56 7 89 1 2345 67 89 1 2345 7 89 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared in software D2 6 (PIR1<3>) Cleared in software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address after falling edge UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address after falling edge SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP D7 D6 D5 D4 D3 D1 D0 12345 789 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared in software Cleared in software SSPOV (SSPCON<6>) CKP written to ‘1’ Note:An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA, and UA will remain set. Note:An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. in software Clock is held low until update of SSPADD has taken place of ninth clock of ninth clock SSPOV is set because SSPBUF is still full. ACK is not sent. Dummy read of SSPBUF to clear BF flag Clock is held low until CKP is set to ‘1’ Clock is not held low because ACK = 1 PIC16F87XA DS39582C-page 94  2001-2013 Microchip Technology Inc. 9.4.5 GENERAL CALL ADDRESS SUPPORT The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R/W = 0. The general call address is recognized when the General Call Enable bit (GCEN) is enabled (SSPCON2<7> set). Following a Start bit detect, 8 bits are shifted into the SSPSR and the address is compared against the SSPADD. It is also compared to the general call address and fixed in hardware. If the general call address matches, the SSPSR is transferred to the SSPBUF, the BF flag bit is set (eighth bit) and on the falling edge of the ninth bit (ACK bit), the SSPIF interrupt flag bit is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the SSPBUF. The value can be used to determine if the address was device specific or a general call address. In 10-bit mode, the SSPADD is required to be updated for the second half of the address to match and the UA bit is set (SSPSTAT<1>). If the general call address is sampled when the GCEN bit is set, while the slave is configured in 10-bit Address mode, then the second half of the address is not necessary, the UA bit will not be set and the slave will begin receiving data after the Acknowledge (Figure 9-15). FIGURE 9-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESS MODE) SDA SCL S SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON<6>) Cleared in software SSPBUF is read R/W = 0 ACK General Call Address Address is compared to general call address. GCEN (SSPCON2<7>) Receiving Data ACK 1 2 34 56 7891 2 34 56 789 D7 D6 D5 D4 D3 D2 D1 D0 After ACK, set interrupt. ‘0’ ‘1’  2001-2013 Microchip Technology Inc. DS39582C-page 95 PIC16F87XA 9.4.6 MASTER MODE Master mode is enabled by setting and clearing the appropriate SSPM bits in SSPCON and by setting the SSPEN bit. In Master mode, the SCL and SDA lines are manipulated by the MSSP hardware. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit is set or the bus is Idle, with both the S and P bits clear. In Firmware Controlled Master mode, user code conducts all I2C bus operations based on Start and Stop bit conditions. Once Master mode is enabled, the user has six options. 1. Assert a Start condition on SDA and SCL. 2. Assert a Repeated Start condition on SDA and SCL. 3. Write to the SSPBUF register, initiating transmission of data/address. 4. Configure the I2C port to receive data. 5. Generate an Acknowledge condition at the end of a received byte of data. 6. Generate a Stop condition on SDA and SCL. The following events will cause SSP Interrupt Flag bit, SSPIF, to be set (SSP interrupt if enabled): • Start condition • Stop condition • Data transfer byte transmitted/received • Acknowledge transmit • Repeated Start FIGURE 9-16: MSSP BLOCK DIAGRAM (I2C MASTER MODE) Note: The MSSP module, when configured in I 2C Master mode, does not allow queueing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. Read Write SSPSR Start bit, Stop bit, Start bit Detect SSPBUF Internal Data Bus Set/Reset, S, P, WCOL (SSPSTAT) Shift Clock MSb LSb SDA Acknowledge Generate Stop bit Detect Write Collision Detect Clock Arbitration State Counter for end of XMIT/RCV SCL SCL In Bus Collision SDA In Receive Enable Clock Cntl Clock Arbitrate/WCOL Detect (hold off clock source) SSPADD<6:0> Baud Set SSPIF, BCLIF Reset ACKSTAT, PEN (SSPCON2) Rate Generator SSPM3:SSPM0 PIC16F87XA DS39582C-page 96  2001-2013 Microchip Technology Inc. 9.4.6.1 I2C Master Mode Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. The baud rate generator used for the SPI mode operation is used to set the SCL clock frequency for either 100 kHz, 400 kHz or 1 MHz I2C operation. See Section 9.4.7 “Baud Rate Generator” for more detail. A typical transmit sequence would go as follows: 1. The user generates a Start condition by setting the Start Enable bit, SEN (SSPCON2<0>). 2. SSPIF is set. The MSSP module will wait the required Start time before any other operation takes place. 3. The user loads the SSPBUF with the slave address to transmit. 4. Address is shifted out the SDA pin until all 8 bits are transmitted. 5. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 6. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 7. The user loads the SSPBUF with eight bits of data. 8. Data is shifted out the SDA pin until all 8 bits are transmitted. 9. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 10. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 11. The user generates a Stop condition by setting the Stop Enable bit, PEN (SSPCON2<2>). 12. Interrupt is generated once the Stop condition is complete.  2001-2013 Microchip Technology Inc. DS39582C-page 97 PIC16F87XA 9.4.7 BAUD RATE GENERATOR In I2C Master mode, the Baud Rate Generator (BRG) reload value is placed in the lower 7 bits of the SSPADD register (Figure 9-17). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting. The BRG counts down to 0 and stops until another reload has taken place. The BRG count is decremented twice per instruction cycle (TCY) on the Q2 and Q4 clocks. In I2C Master mode, the BRG is reloaded automatically. Once the given operation is complete (i.e., transmission of the last data bit is followed by ACK), the internal clock will automatically stop counting and the SCL pin will remain in its last state. Table 9-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. FIGURE 9-17: BAUD RATE GENERATOR BLOCK DIAGRAM TABLE 9-3: I2C CLOCK RATE W/BRG SSPM3:SSPM0 CLKO BRG Down Counter FOSC/4 SSPADD<6:0> SSPM3:SSPM0 SCL Reload Control Reload FCY FCY*2 BRG Value FSCL (2 Rollovers of BRG) 10 MHz 20 MHz 19h 400 kHz(1) 10 MHz 20 MHz 20h 312.5 kHz 10 MHz 20 MHz 3Fh 100 kHz 4 MHz 8 MHz 0Ah 400 kHz(1) 4 MHz 8 MHz 0Dh 308 kHz 4 MHz 8 MHz 28h 100 kHz 1 MHz 2 MHz 03h 333 kHz(1) 1 MHz 2 MHz 0Ah 100 kHz 1 MHz 2 MHz 00h 1 MHz(1) Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. PIC16F87XA DS39582C-page 98  2001-2013 Microchip Technology Inc. 9.4.7.1 Clock Arbitration Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, deasserts the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count, in the event that the clock is held low by an external device (Figure 9-17). FIGURE 9-18: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA SCL SCL deasserted but slave holds DX DX-1 BRG SCL is sampled high, reload takes place and BRG starts its count 03h 02h 01h 00h (hold off) 03h 02h Reload BRG Value SCL low (clock arbitration) SCL allowed to transition high BRG decrements on Q2 and Q4 cycles  2001-2013 Microchip Technology Inc. DS39582C-page 99 PIC16F87XA 9.4.8 I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start condition enable bit, SEN (SSPCON2<0>). If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low, while SCL is high, is the Start condition and causes the S bit (SSPSTAT<3>) to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit (SSPCON2<0>) will be automatically cleared by hardware, the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. 9.4.8.1 WCOL Status Flag If the user writes the SSPBUF when a Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 9-19: FIRST START BIT TIMING Note: If at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag (BCLIF) is set, the Start condition is aborted and the I 2C module is reset into its Idle state. Note: Because queueing of events is not allowed, writing to the lower 5 bits of SSPCON2 is disabled until the Start condition is complete. SDA SCL S TBRG 1st Bit 2nd Bit TBRG SDA = 1, At completion of Start bit, SCL = 1 TBRG Write to SSPBUF occurs here hardware clears SEN bit TBRG Write to SEN bit occurs here Set S bit (SSPSTAT<3>) and sets SSPIF bit PIC16F87XA DS39582C-page 100  2001-2013 Microchip Technology Inc. 9.4.9 I2C MASTER MODE REPEATED START CONDITION TIMING A Repeated Start condition occurs when the RSEN bit (SSPCON2<1>) is programmed high and the I2C logic module is in the Idle state. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded with the contents of SSPADD<5:0> and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. Following this, the RSEN bit (SSPCON2<1>) will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit (SSPSTAT<3>) will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. Immediately following the SSPIF bit getting set, the user may write the SSPBUF with the 7-bit address in 7-bit mode or the default first address in 10-bit mode. After the first eight bits are transmitted and an ACK is received, the user may then transmit an additional eight bits of address (10-bit mode) or eight bits of data (7-bit mode). 9.4.9.1 WCOL Status Flag If the user writes the SSPBUF when a Repeated Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 9-20: REPEAT START CONDITION WAVEFORM Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. 2: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low to high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. Note: Because queueing of events is not allowed, writing of the lower 5 bits of SSPCON2 is disabled until the Repeated Start condition is complete. SDA SCL Sr = Repeated Start Write to SSPCON2 Write to SSPBUF occurs here Falling edge of ninth clock, end of Xmit At completion of Start bit, hardware clears RSEN bit 1st Bit Set S (SSPSTAT<3>) TBRG TBRG SDA = 1, SDA = 1, SCL (no change) SCL = 1 occurs here, TBRG TBRG TBRG and sets SSPIF  2001-2013 Microchip Technology Inc. DS39582C-page 101 PIC16F87XA 9.4.10 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full flag bit, BF, and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted (see data hold time specification, parameter #106). SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high (see data setup time specification, parameter #107). When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time, if an address match occurred or if data was received properly. The status of ACK is written into the ACKDT bit on the falling edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 9-21). After the write to the SSPBUF, each bit of address will be shifted out on the falling edge of SCL, until all seven address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will deassert the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit (SSPCON2<6>). Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 9.4.10.1 BF Status Flag In Transmit mode, the BF bit (SSPSTAT<0>) is set when the CPU writes to SSPBUF and is cleared when all eight bits are shifted out. 9.4.10.2 WCOL Status Flag If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). WCOL must be cleared in software. 9.4.10.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does Not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call) or when the slave has properly received its data. 9.4.11 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN (SSPCON2<3>). The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high to low/ low to high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state, awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>). 9.4.11.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 9.4.11.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 9.4.11.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded. PIC16F87XA DS39582C-page 102  2001-2013 Microchip Technology Inc. FIGURE 9-21: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SEN A7 A6 A5 A4 A3 A2 A1 ACK = 0 D7 D6 D5 D4 D3 D2 D1 D0 ACK Transmitting Data or Second Half R/W = 0 Transmit Address to Slave 123456789 123456789 P Cleared in software service routine from SSP interrupt SSPBUF is written in software After Start condition, SEN cleared by hardware S SSPBUF written with 7-bit address and R/W. Start transmit. SCL held low while CPU responds to SSPIF SEN = 0 of 10-bit Address Write SSPCON2<0> SEN = 1 Start condition begins From Slave, clear ACKSTAT bit SSPCON2<6> ACKSTAT in SSPCON2 = 1 Cleared in software SSPBUF written PEN Cleared in software R/W  2001-2013 Microchip Technology Inc. DS39582C-page 103 PIC16F87XA FIGURE 9-22: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) P 9 8 7 6 5 D0 D1 D2 D3 D4 D5 D6 D7 S A7 A6 A5 A4 A3 A2 A1 SDA SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 678 9 1234 Bus master terminates transfer ACK Receiving Data from Slave Receiving Data from Slave D0 D1 D2 D3 D4 D5 D6 D7 ACK R/W = 1 Transmit Address to Slave SSPIF BF ACK is not sent Write to SSPCON2<0> (SEN = 1), Write to SSPBUF occurs here, ACK from Slave Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) PEN bit = 1 written here Data shifted in on falling edge of CLK Cleared in software start XMIT SEN = 0 SDA = SSPOV 0, SCL = 1 while CPU (SSPSTAT<0>) ACK Last bit is shifted into SSPSR and contents are unloaded into SSPBUF Cleared in software Cleared in software Set SSPIF interrupt at end of receive Set P bit (SSPSTAT<4>) and SSPIF Cleared in software ACK from master Set SSPIF at end Set SSPIF interrupt at end of Acknowledge sequence Set SSPIF interrupt at end of Acknowledge sequence of receive Set ACKEN, start Acknowledge sequence, SSPOV is set because SSPBUF is still full SDA = ACKDT = 1 RCEN cleared automatically RCEN = 1, start next receive Write to SSPCON2<4> to start Acknowledge sequence, SDA = ACKDT (SSPCON2<5>) = 0 RCEN cleared automatically responds to SSPIF ACKEN begin Start condition Cleared in software SDA = ACKDT = 0 PIC16F87XA DS39582C-page 104  2001-2013 Microchip Technology Inc. 9.4.12 ACKNOWLEDGE SEQUENCE TIMING An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>). When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the baud rate generator is turned off and the MSSP module then goes into Idle mode (Figure 9-23). 9.4.12.1 WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). 9.4.13 STOP CONDITION TIMING A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN (SSPCON2<2>). At the end of a receive/ transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to 0. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit (SSPSTAT<4>) is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 9-24). 9.4.13.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 9-23: ACKNOWLEDGE SEQUENCE WAVEFORM FIGURE 9-24: STOP CONDITION RECEIVE OR TRANSMIT MODE Note: TBRG = one Baud Rate Generator period. SDA SCL Set SSPIF at the end Acknowledge sequence starts here, write to SSPCON2 ACKEN automatically cleared Cleared in TBRG TBRG of receive 8 ACKEN = 1, ACKDT = 0 D0 9 SSPIF software Set SSPIF at the end of Acknowledge sequence Cleared in software ACK SCL SDA SDA asserted low before rising edge of clock Write to SSPCON2, set PEN Falling edge of SCL = 1 for TBRG, followed by SDA = 1 for TBRG 9th clock SCL brought high after TBRG Note: TBRG = one Baud Rate Generator period. TBRG TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. TBRG to setup Stop condition ACK P TBRG PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set  2001-2013 Microchip Technology Inc. DS39582C-page 105 PIC16F87XA 9.4.14 SLEEP OPERATION While in Sleep mode, the I2C module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 9.4.15 EFFECT OF A RESET A Reset disables the MSSP module and terminates the current transfer. 9.4.16 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit (SSPSTAT<4>) is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is at the expected output level. This check is performed in hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • Address Transfer • Data Transfer • A Start Condition • A Repeated Start Condition • An Acknowledge Condition 9.4.17 MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF, and reset the I 2C port to its Idle state (Figure 9-25). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The Master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register or the bus is Idle and the S and P bits are cleared. FIGURE 9-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE SDA SCL BCLIF SDA released SDA line pulled low by another source Sample SDA. While SCL is high, data doesn’t match what is driven Set bus collision interrupt (BCLIF) by the master. Bus collision has occurred. by master Data changes while SCL = 0 PIC16F87XA DS39582C-page 106  2001-2013 Microchip Technology Inc. 9.4.17.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) SDA or SCL are sampled low at the beginning of the Start condition (Figure 9-26). b) SCL is sampled low before SDA is asserted low (Figure 9-27). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted, • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 9-26). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded from SSPADD<6:0> and counts down to 0. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 9-28). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to 0 and during this time, if the SCL pin is sampled as ‘0’, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. FIGURE 9-26: BUS COLLISION DURING START CONDITION (SDA ONLY) Note: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. SDA SCL SEN SDA sampled low before SDA goes low before the SEN bit is set. S bit and SSPIF set because SSP module reset into Idle state. SEN cleared automatically because of bus collision. S bit and SSPIF set because Set SEN, enable Start condition if SDA = 1, SCL = 1 SDA = 0, SCL = 1. BCLIF SSPIF SDA = 0, SCL = 1. SSPIF and BCLIF are cleared in software SSPIF and BCLIF are cleared in software Set BCLIF, Start condition. Set BCLIF. S  2001-2013 Microchip Technology Inc. DS39582C-page 107 PIC16F87XA FIGURE 9-27: BUS COLLISION DURING START CONDITION (SCL = 0) FIGURE 9-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA SCL SEN bus collision occurs. Set BCLIF. SCL = 0 before SDA = 0, Set SEN, enable Start sequence if SDA = 1, SCL = 1 TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF Interrupt cleared in software bus collision occurs. Set BCLIF. SCL = 0 before BRG time-out, ‘0’ ‘0’ ‘0’ ‘0’ SDA SCL SEN Set S Less than TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF S Interrupts cleared set SSPIF in software SDA = 0, SCL = 1, SCL pulled low after BRG time-out Set SSPIF ‘0’ SDA pulled low by other master. Reset BRG and assert SDA. Set SEN, enable Start sequence if SDA = 1, SCL = 1 PIC16F87XA DS39582C-page 108  2001-2013 Microchip Technology Inc. 9.4.17.2 Bus Collision During a Repeated Start Condition During a Repeated Start condition, a bus collision occurs if: a) A low level is sampled on SDA when SCL goes from low level to high level. b) SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. When the user deasserts SDA and the pin is allowed to float high, the BRG is loaded with SSPADD<6:0> and counts down to 0. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, see Figure 9-29). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high to low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. If SCL goes from high to low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition (Figure 9-30). If at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. FIGURE 9-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) FIGURE 9-30: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) SDA SCL RSEN BCLIF S SSPIF Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. Cleared in software ‘0’ ‘0’ SDA SCL BCLIF RSEN S SSPIF Interrupt cleared in software SCL goes low before SDA, set BCLIF. Release SDA and SCL. TBRG TBRG ‘0’  2001-2013 Microchip Technology Inc. DS39582C-page 109 PIC16F87XA 9.4.17.3 Bus Collision During a Stop Condition Bus collision occurs during a Stop condition if: a) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. b) After the SCL pin is deasserted, SCL is sampled low before SDA goes high. The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD<6:0> and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 9-31). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 9-32). FIGURE 9-31: BUS COLLISION DURING A STOP CONDITION (CASE 1) FIGURE 9-32: BUS COLLISION DURING A STOP CONDITION (CASE 2) SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG SDA asserted low SDA sampled low after TBRG, set BCLIF ‘0’ ‘0’ SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG Assert SDA SCL goes low before SDA goes high, set BCLIF ‘0’ ‘0’ PIC16F87XA DS39582C-page 110  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 111 PIC16F87XA 10.0 ADDRESSABLE UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (USART) The Universal Synchronous Asynchronous Receiver Transmitter (USART) module is one of the two serial I/O modules. (USART is also known as a Serial Communications Interface or SCI.) The USART can be configured as a full-duplex asynchronous system that can communicate with peripheral devices, such as CRT terminals and personal computers, or it can be configured as a half-duplex synchronous system that can communicate with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs, etc. The USART can be configured in the following modes: • Asynchronous (full-duplex) • Synchronous – Master (half-duplex) • Synchronous – Slave (half-duplex) Bit SPEN (RCSTA<7>) and bits TRISC<7:6> have to be set in order to configure pins RC6/TX/CK and RC7/RX/DT as the Universal Synchronous Asynchronous Receiver Transmitter. The USART module also has a multi-processor communication capability using 9-bit address detection. REGISTER 10-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER (ADDRESS 98h) R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R-1 R/W-0 CSRC TX9 TXEN SYNC — BRGH TRMT TX9D bit 7 bit 0 bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit 1 = Transmit enabled 0 = Transmit disabled Note: SREN/CREN overrides TXEN in Sync mode. bit 4 SYNC: USART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 Unimplemented: Read as ‘0’ bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full bit 0 TX9D: 9th bit of Transmit Data, can be Parity bit Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 112  2001-2013 Microchip Technology Inc. REGISTER 10-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER (ADDRESS 18h) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 bit 7 SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RC7/RX/DT and RC6/TX/CK pins as serial port pins) 0 = Serial port disabled bit 6 RX9: 9-bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care. Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave: Don’t care. bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables continuous receive 0 = Disables continuous receive Synchronous mode: 1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enables interrupt and load of the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCREG register and receive next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit CREN) 0 = No overrun error bit 0 RX9D: 9th bit of Received Data (can be parity bit but must be calculated by user firmware) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown  2001-2013 Microchip Technology Inc. DS39582C-page 113 PIC16F87XA 10.1 USART Baud Rate Generator (BRG) The BRG supports both the Asynchronous and Synchronous modes of the USART. It is a dedicated 8-bit baud rate generator. The SPBRG register controls the period of a free running 8-bit timer. In Asynchronous mode, bit BRGH (TXSTA<2>) also controls the baud rate. In Synchronous mode, bit BRGH is ignored. Table 10-1 shows the formula for computation of the baud rate for different USART modes which only apply in Master mode (internal clock). Given the desired baud rate and FOSC, the nearest integer value for the SPBRG register can be calculated using the formula in Table 10-1. From this, the error in baud rate can be determined. It may be advantageous to use the high baud rate (BRGH = 1) even for slower baud clocks. This is because the FOSC/(16 (X + 1)) equation can reduce the baud rate error in some cases. Writing a new value to the SPBRG register causes the BRG timer to be reset (or cleared). This ensures the BRG does not wait for a timer overflow before outputting the new baud rate. 10.1.1 SAMPLING The data on the RC7/RX/DT pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the RX pin. TABLE 10-1: BAUD RATE FORMULA TABLE 10-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR SYNC BRGH = 0 (Low Speed) BRGH = 1 (High Speed) 0 1 (Asynchronous) Baud Rate = FOSC/(64 (X + 1)) (Synchronous) Baud Rate = FOSC/(4 (X + 1)) Baud Rate = FOSC/(16 (X + 1)) N/A Legend: X = value in SPBRG (0 to 255) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded cells are not used by the BRG. PIC16F87XA DS39582C-page 114  2001-2013 Microchip Technology Inc. TABLE 10-3: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 0) BAUD RATE (K) FOSC = 20 MHz FOSC = 16 MHz FOSC = 10 MHz KBAUD % ERROR SPBRG value (decimal) KBAUD % ERROR SPBRG value (decimal) KBAUD % ERROR SPBRG value (decimal) 0.3 - - - - - - - - - 1.2 1.221 1.75 255 1.202 0.17 207 1.202 0.17 129 2.4 2.404 0.17 129 2.404 0.17 103 2.404 0.17 64 9.6 9.766 1.73 31 9.615 0.16 25 9.766 1.73 15 19.2 19.531 1.72 15 19.231 0.16 12 19.531 1.72 7 28.8 31.250 8.51 9 27.778 3.55 8 31.250 8.51 4 33.6 34.722 3.34 8 35.714 6.29 6 31.250 6.99 4 57.6 62.500 8.51 4 62.500 8.51 3 52.083 9.58 2 HIGH 1.221 - 255 0.977 - 255 0.610 - 255 LOW 312.500 - 0 250.000 - 0 156.250 - 0 BAUD RATE (K) FOSC = 4 MHz FOSC = 3.6864 MHz KBAUD % ERROR SPBRG value (decimal) KBAUD % ERROR SPBRG value (decimal) 0.3 0.300 0 207 0.3 0 191 1.2 1.202 0.17 51 1.2 0 47 2.4 2.404 0.17 25 2.4 0 23 9.6 8.929 6.99 6 9.6 0 5 19.2 20.833 8.51 2 19.2 0 2 28.8 31.250 8.51 1 28.8 0 1 33.6 - - - - - - 57.6 62.500 8.51 0 57.6 0 0 HIGH 0.244 - 255 0.225 - 255 LOW 62.500 - 0 57.6 - 0 TABLE 10-4: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 1) BAUD RATE (K) FOSC = 20 MHz FOSC = 16 MHz FOSC = 10 MHz KBAUD % ERROR SPBRG value (decimal) KBAUD % ERROR SPBRG value (decimal) KBAUD % ERROR SPBRG value (decimal) 0.3 - - - - - - - - - 1.2 - - - - - - - - - 2.4 - - - - - - 2.441 1.71 255 9.6 9.615 0.16 129 9.615 0.16 103 9.615 0.16 64 19.2 19.231 0.16 64 19.231 0.16 51 19.531 1.72 31 28.8 29.070 0.94 42 29.412 2.13 33 28.409 1.36 21 33.6 33.784 0.55 36 33.333 0.79 29 32.895 2.10 18 57.6 59.524 3.34 20 58.824 2.13 16 56.818 1.36 10 HIGH 4.883 - 255 3.906 - 255 2.441 - 255 LOW 1250.000 - 0 1000.000 0 625.000 - 0 BAUD RATE (K) FOSC = 4 MHz FOSC = 3.6864 MHz KBAUD % ERROR SPBRG value (decimal) KBAUD % ERROR SPBRG value (decimal) 0.3 - - - - - - 1.2 1.202 0.17 207 1.2 0 191 2.4 2.404 0.17 103 2.4 0 95 9.6 9.615 0.16 25 9.6 0 23 19.2 19.231 0.16 12 19.2 0 11 28.8 27.798 3.55 8 28.8 0 7 33.6 35.714 6.29 6 32.9 2.04 6 57.6 62.500 8.51 3 57.6 0 3 HIGH 0.977 - 255 0.9 - 255 LOW 250.000 - 0 230.4 - 0  2001-2013 Microchip Technology Inc. DS39582C-page 115 PIC16F87XA 10.2 USART Asynchronous Mode In this mode, the USART uses standard Non-Returnto-Zero (NRZ) format (one Start bit, eight or nine data bits and one Stop bit). The most common data format is 8 bits. An on-chip, dedicated, 8-bit Baud Rate Generator can be used to derive standard baud rate frequencies from the oscillator. The USART transmits and receives the LSb first. The transmitter and receiver are functionally independent but use the same data format and baud rate. The baud rate generator produces a clock, either x16 or x64 of the bit shift rate, depending on bit BRGH (TXSTA<2>). Parity is not supported by the hardware but can be implemented in software (and stored as the ninth data bit). Asynchronous mode is stopped during Sleep. Asynchronous mode is selected by clearing bit SYNC (TXSTA<4>). The USART Asynchronous module consists of the following important elements: • Baud Rate Generator • Sampling Circuit • Asynchronous Transmitter • Asynchronous Receiver 10.2.1 USART ASYNCHRONOUS TRANSMITTER The USART transmitter block diagram is shown in Figure 10-1. The heart of the transmitter is the Transmit (Serial) Shift Register (TSR). The shift register obtains its data from the Read/Write Transmit Buffer, TXREG. The TXREG register is loaded with data in software. The TSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the TSR is loaded with new data from the TXREG register (if available). Once the TXREG register transfers the data to the TSR register (occurs in one TCY), the TXREG register is empty and flag bit, TXIF (PIR1<4>), is set. This interrupt can be enabled/disabled by setting/clearing enable bit, TXIE (PIE1<4>). Flag bit TXIF will be set regardless of the state of enable bit TXIE and cannot be cleared in software. It will reset only when new data is loaded into the TXREG register. While flag bit TXIF indicates the status of the TXREG register, another bit, TRMT (TXSTA<1>), shows the status of the TSR register. Status bit TRMT is a read-only bit which is set when the TSR register is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. Transmission is enabled by setting enable bit, TXEN (TXSTA<5>). The actual transmission will not occur until the TXREG register has been loaded with data and the Baud Rate Generator (BRG) has produced a shift clock (Figure 10-2). The transmission can also be started by first loading the TXREG register and then setting enable bit TXEN. Normally, when transmission is first started, the TSR register is empty. At that point, transfer to the TXREG register will result in an immediate transfer to TSR, resulting in an empty TXREG. A back-to-back transfer is thus possible (Figure 10-3). Clearing enable bit TXEN during a transmission will cause the transmission to be aborted and will reset the transmitter. As a result, the RC6/TX/CK pin will revert to high-impedance. In order to select 9-bit transmission, transmit bit TX9 (TXSTA<6>) should be set and the ninth bit should be written to TX9D (TXSTA<0>). The ninth bit must be written before writing the 8-bit data to the TXREG register. This is because a data write to the TXREG register can result in an immediate transfer of the data to the TSR register (if the TSR is empty). In such a case, an incorrect ninth data bit may be loaded in the TSR register. FIGURE 10-1: USART TRANSMIT BLOCK DIAGRAM Note 1: The TSR register is not mapped in data memory so it is not available to the user. 2: Flag bit TXIF is set when enable bit TXEN is set. TXIF is cleared by loading TXREG. TXIF TXIE Interrupt TXEN Baud Rate CLK SPBRG Baud Rate Generator TX9D MSb LSb Data Bus TXREG Register TSR Register (8) 0 TX9 TRMT SPEN RC6/TX/CK pin Pin Buffer and Control 8  PIC16F87XA DS39582C-page 116  2001-2013 Microchip Technology Inc. When setting up an Asynchronous Transmission, follow these steps: 1. Initialize the SPBRG register for the appropriate baud rate. If a high-speed baud rate is desired, set bit BRGH (Section 10.1 “USART Baud Rate Generator (BRG)”). 2. Enable the asynchronous serial port by clearing bit SYNC and setting bit SPEN. 3. If interrupts are desired, then set enable bit TXIE. 4. If 9-bit transmission is desired, then set transmit bit TX9. 5. Enable the transmission by setting bit TXEN, which will also set bit TXIF. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit TX9D. 7. Load data to the TXREG register (starts transmission). 8. If using interrupts, ensure that GIE and PEIE (bits 7 and 6) of the INTCON register are set. FIGURE 10-2: ASYNCHRONOUS MASTER TRANSMISSION FIGURE 10-3: ASYNCHRONOUS MASTER TRANSMISSION (BACK TO BACK) TABLE 10-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x 19h TXREG USART Transmit Register 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear. Word 1 Stop Bit Word 1 Transmit Shift Reg Start Bit Bit 0 Bit 1 Bit 7/8 Write to TXREG Word 1 BRG Output (Shift Clock) RC6/TX/CK (pin) TXIF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) Transmit Shift Reg. Write to TXREG BRG Output (Shift Clock) RC6/TX/CK (pin) TXIF bit (Interrupt Reg. Flag) TRMT bit (Transmit Shift Reg. Empty Flag) Word 1 Word 2 Word 1 Word 2 Start Bit Stop Bit Start Bit Transmit Shift Reg. Word 1 Word 2 Bit 0 Bit 1 Bit 7/8 Bit 0 Note: This timing diagram shows two consecutive transmissions.  2001-2013 Microchip Technology Inc. DS39582C-page 117 PIC16F87XA 10.2.2 USART ASYNCHRONOUS RECEIVER The receiver block diagram is shown in Figure 10-4. The data is received on the RC7/RX/DT pin and drives the data recovery block. The data recovery block is actually a high-speed shifter, operating at x16 times the baud rate; whereas the main receive serial shifter operates at the bit rate or at FOSC. Once Asynchronous mode is selected, reception is enabled by setting bit CREN (RCSTA<4>). The heart of the receiver is the Receive (Serial) Shift Register (RSR). After sampling the Stop bit, the received data in the RSR is transferred to the RCREG register (if it is empty). If the transfer is complete, flag bit, RCIF (PIR1<5>), is set. The actual interrupt can be enabled/disabled by setting/clearing enable bit, RCIE (PIE1<5>). Flag bit RCIF is a read-only bit which is cleared by the hardware. It is cleared when the RCREG register has been read and is empty. The RCREG is a double-buffered register (i.e., it is a two-deep FIFO). It is possible for two bytes of data to be received and transferred to the RCREG FIFO and a third byte to begin shifting to the RSR register. On the detection of the Stop bit of the third byte, if the RCREG register is still full, the Overrun Error bit, OERR (RCSTA<1>), will be set. The word in the RSR will be lost. The RCREG register can be read twice to retrieve the two bytes in the FIFO. Overrun bit OERR has to be cleared in software. This is done by resetting the receive logic (CREN is cleared and then set). If bit OERR is set, transfers from the RSR register to the RCREG register are inhibited and no further data will be received. It is, therefore, essential to clear error bit OERR if it is set. Framing error bit, FERR (RCSTA<2>), is set if a Stop bit is detected as clear. Bit FERR and the 9th receive bit are buffered the same way as the receive data. Reading the RCREG will load bits RX9D and FERR with new values, therefore, it is essential for the user to read the RCSTA register before reading the RCREG register in order not to lose the old FERR and RX9D information. FIGURE 10-4: USART RECEIVE BLOCK DIAGRAM x64 Baud Rate CLK SPBRG Baud Rate Generator RC7/RX/DT Pin Buffer and Control SPEN Data Recovery CREN OERR FERR MSb RSR Register LSb RX9D RCREG Register FIFO Interrupt RCIF RCIE Data Bus 8 64 16 or Stop (8) 7 1 0 Start RX9  FOSC PIC16F87XA DS39582C-page 118  2001-2013 Microchip Technology Inc. FIGURE 10-5: ASYNCHRONOUS RECEPTION When setting up an Asynchronous Reception, follow these steps: 1. Initialize the SPBRG register for the appropriate baud rate. If a high-speed baud rate is desired, set bit BRGH (Section 10.1 “USART Baud Rate Generator (BRG)”). 2. Enable the asynchronous serial port by clearing bit SYNC and setting bit SPEN. 3. If interrupts are desired, then set enable bit RCIE. 4. If 9-bit reception is desired, then set bit RX9. 5. Enable the reception by setting bit CREN. 6. Flag bit RCIF will be set when reception is complete and an interrupt will be generated if enable bit RCIE is set. 7. Read the RCSTA register to get the ninth bit (if enabled) and determine if any error occurred during reception. 8. Read the 8-bit received data by reading the RCREG register. 9. If any error occurred, clear the error by clearing enable bit CREN. 10. If using interrupts, ensure that GIE and PEIE (bits 7 and 6) of the INTCON register are set. TABLE 10-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Start bit bit 0 bit 1 bit 7/8 bit 0 Stop bit 7/8 bit Start bit Start bit 7/8 Stop bit bit RX (pin) Reg Rcv Buffer Reg Rcv Shift Read Rcv Buffer Reg RCREG RCIF (Interrupt Flag) OERR bit CREN Word 1 RCREG Word 2 RCREG Stop bit Note: This timing diagram shows three words appearing on the RX input. The RCREG (Receive Buffer) is read after the third word, causing the OERR (Overrun Error) bit to be set. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x 1Ah RCREG USART Receive Register 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.  2001-2013 Microchip Technology Inc. DS39582C-page 119 PIC16F87XA 10.2.3 SETTING UP 9-BIT MODE WITH ADDRESS DETECT When setting up an Asynchronous Reception with address detect enabled: • Initialize the SPBRG register for the appropriate baud rate. If a high-speed baud rate is desired, set bit BRGH. • Enable the asynchronous serial port by clearing bit SYNC and setting bit SPEN. • If interrupts are desired, then set enable bit RCIE. • Set bit RX9 to enable 9-bit reception. • Set ADDEN to enable address detect. • Enable the reception by setting enable bit CREN. • Flag bit RCIF will be set when reception is complete, and an interrupt will be generated if enable bit RCIE was set. • Read the RCSTA register to get the ninth bit and determine if any error occurred during reception. • Read the 8-bit received data by reading the RCREG register to determine if the device is being addressed. • If any error occurred, clear the error by clearing enable bit CREN. • If the device has been addressed, clear the ADDEN bit to allow data bytes and address bytes to be read into the receive buffer and interrupt the CPU. FIGURE 10-6: USART RECEIVE BLOCK DIAGRAM x64 Baud Rate CLK SPBRG Baud Rate Generator RC7/RX/DT Pin Buffer and Control SPEN Data Recovery CREN OERR FERR MSb RSR Register LSb RX9D RCREG Register FIFO Interrupt RCIF RCIE Data Bus 8  64  16 or Stop Start (8) 7 1 0 RX9  RX9 ADDEN RX9 ADDEN RSR<8> Enable Load of Receive Buffer 8 8 FOSC PIC16F87XA DS39582C-page 120  2001-2013 Microchip Technology Inc. FIGURE 10-7: ASYNCHRONOUS RECEPTION WITH ADDRESS DETECT FIGURE 10-8: ASYNCHRONOUS RECEPTION WITH ADDRESS BYTE FIRST TABLE 10-7: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Start bit bit 0 bit 1 bit 8 bit 0 Stop bit Start bit bit 8 Stop bit RC7/RX/DT Load RSR Read RCIF Word 1 RCREG Bit 8 = 0, Data Byte Bit 8 = 1, Address Byte Note: This timing diagram shows a data byte followed by an address byte. The data byte is not read into the RCREG (Receive Buffer) because ADDEN = 1. (pin) Start bit bit 0 bit 1 bit 8 bit 0 Stop bit Start bit bit 8 Stop bit RC7/RX/DT Load RSR Read RCIF Word 1 RCREG Bit 8 = 1, Address Byte Bit 8 = 0, Data Byte Note: This timing diagram shows a data byte followed by an address byte. The data byte is not read into the RCREG (Receive Buffer) because ADDEN was not updated and still = 0. (pin) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 1Ah RCREG USART Receive Register 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear.  2001-2013 Microchip Technology Inc. DS39582C-page 121 PIC16F87XA 10.3 USART Synchronous Master Mode In Synchronous Master mode, the data is transmitted in a half-duplex manner (i.e., transmission and reception do not occur at the same time). When transmitting data, the reception is inhibited and vice versa. Synchronous mode is entered by setting bit, SYNC (TXSTA<4>). In addition, enable bit, SPEN (RCSTA<7>), is set in order to configure the RC6/TX/CK and RC7/RX/DT I/O pins to CK (clock) and DT (data) lines, respectively. The Master mode indicates that the processor transmits the master clock on the CK line. The Master mode is entered by setting bit, CSRC (TXSTA<7>). 10.3.1 USART SYNCHRONOUS MASTER TRANSMISSION The USART transmitter block diagram is shown in Figure 10-6. The heart of the transmitter is the Transmit (Serial) Shift Register (TSR). The shift register obtains its data from the Read/Write Transmit Buffer register, TXREG. The TXREG register is loaded with data in software. The TSR register is not loaded until the last bit has been transmitted from the previous load. As soon as the last bit is transmitted, the TSR is loaded with new data from the TXREG (if available). Once the TXREG register transfers the data to the TSR register (occurs in one TCYCLE), the TXREG is empty and interrupt bit, TXIF (PIR1<4>), is set. The interrupt can be enabled/disabled by setting/clearing enable bit TXIE (PIE1<4>). Flag bit TXIF will be set regardless of the state of enable bit TXIE and cannot be cleared in software. It will reset only when new data is loaded into the TXREG register. While flag bit TXIF indicates the status of the TXREG register, another bit, TRMT (TXSTA<1>), shows the status of the TSR register. TRMT is a readonly bit which is set when the TSR is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TSR is not mapped in data memory so it is not available to the user. Transmission is enabled by setting enable bit, TXEN (TXSTA<5>). The actual transmission will not occur until the TXREG register has been loaded with data. The first data bit will be shifted out on the next available rising edge of the clock on the CK line. Data out is stable around the falling edge of the synchronous clock (Figure 10-9). The transmission can also be started by first loading the TXREG register and then setting bit TXEN (Figure 10-10). This is advantageous when slow baud rates are selected since the BRG is kept in Reset when bits TXEN, CREN and SREN are clear. Setting enable bit TXEN will start the BRG, creating a shift clock immediately. Normally, when transmission is first started, the TSR register is empty so a transfer to the TXREG register will result in an immediate transfer to TSR, resulting in an empty TXREG. Back-to-back transfers are possible. Clearing enable bit TXEN during a transmission will cause the transmission to be aborted and will reset the transmitter. The DT and CK pins will revert to highimpedance. If either bit CREN or bit SREN is set during a transmission, the transmission is aborted and the DT pin reverts to a high-impedance state (for a reception). The CK pin will remain an output if bit CSRC is set (internal clock). The transmitter logic, however, is not reset, although it is disconnected from the pins. In order to reset the transmitter, the user has to clear bit TXEN. If bit SREN is set (to interrupt an on-going transmission and receive a single word), then after the single word is received, bit SREN will be cleared and the serial port will revert back to transmitting since bit TXEN is still set. The DT line will immediately switch from HighImpedance Receive mode to transmit and start driving. To avoid this, bit TXEN should be cleared. In order to select 9-bit transmission, the TX9 (TXSTA<6>) bit should be set and the ninth bit should be written to bit TX9D (TXSTA<0>). The ninth bit must be written before writing the 8-bit data to the TXREG register. This is because a data write to the TXREG can result in an immediate transfer of the data to the TSR register (if the TSR is empty). If the TSR was empty and the TXREG was written before writing the “new” TX9D, the “present” value of bit TX9D is loaded. Steps to follow when setting up a Synchronous Master Transmission: 1. Initialize the SPBRG register for the appropriate baud rate (Section 10.1 “USART Baud Rate Generator (BRG)”). 2. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. 3. If interrupts are desired, set enable bit TXIE. 4. If 9-bit transmission is desired, set bit TX9. 5. Enable the transmission by setting bit TXEN. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit TX9D. 7. Start transmission by loading data to the TXREG register. 8. If using interrupts, ensure that GIE and PEIE (bits 7 and 6) of the INTCON register are set. PIC16F87XA DS39582C-page 122  2001-2013 Microchip Technology Inc. TABLE 10-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION FIGURE 10-9: SYNCHRONOUS TRANSMISSION FIGURE 10-10: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x 19h TXREG USART Transmit Register 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear. bit 0 bit 1 bit 7 Word 1 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4Q1Q2Q3 Q4Q1Q2Q3 Q4Q1 Q2 Q3 Q4 Q3 Q4 Q1Q2 Q3Q4 Q1Q2Q3Q4 Q1Q2Q3 Q4Q1 Q2Q3Q4 Q1Q2Q3 Q4Q1Q2Q3 Q4 bit 2 bit 0 bit 1 bit 7 RC7/RX/DT RC6/TX/CK Write to TXREG reg TXIF bit (Interrupt Flag) TXEN bit ‘1’ ‘1’ Word 2 TRMT bit Write Word 1 Write Word 2 Note: Sync Master mode; SPBRG = 0. Continuous transmission of two 8-bit words. pin pin RC7/RX/DT pin RC6/TX/CK pin Write to TXREG Reg TXIF bit TRMT bit bit 0 bit 1 bit 2 bit 6 bit 7 TXEN bit  2001-2013 Microchip Technology Inc. DS39582C-page 123 PIC16F87XA 10.3.2 USART SYNCHRONOUS MASTER RECEPTION Once Synchronous mode is selected, reception is enabled by setting either enable bit, SREN (RCSTA<5>), or enable bit, CREN (RCSTA<4>). Data is sampled on the RC7/RX/DT pin on the falling edge of the clock. If enable bit SREN is set, then only a single word is received. If enable bit CREN is set, the reception is continuous until CREN is cleared. If both bits are set, CREN takes precedence. After clocking the last bit, the received data in the Receive Shift Register (RSR) is transferred to the RCREG register (if it is empty). When the transfer is complete, interrupt flag bit, RCIF (PIR1<5>), is set. The actual interrupt can be enabled/ disabled by setting/clearing enable bit, RCIE (PIE1<5>). Flag bit RCIF is a read-only bit which is reset by the hardware. In this case, it is reset when the RCREG register has been read and is empty. The RCREG is a double-buffered register (i.e., it is a twodeep FIFO). It is possible for two bytes of data to be received and transferred to the RCREG FIFO and a third byte to begin shifting into the RSR register. On the clocking of the last bit of the third byte, if the RCREG register is still full, then Overrun Error bit, OERR (RCSTA<1>), is set. The word in the RSR will be lost. The RCREG register can be read twice to retrieve the two bytes in the FIFO. Bit OERR has to be cleared in software (by clearing bit CREN). If bit OERR is set, transfers from the RSR to the RCREG are inhibited so it is essential to clear bit OERR if it is set. The ninth receive bit is buffered the same way as the receive data. Reading the RCREG register will load bit RX9D with a new value, therefore, it is essential for the user to read the RCSTA register before reading RCREG in order not to lose the old RX9D information. When setting up a Synchronous Master Reception: 1. Initialize the SPBRG register for the appropriate baud rate (Section 10.1 “USART Baud Rate Generator (BRG)”). 2. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. 3. Ensure bits CREN and SREN are clear. 4. If interrupts are desired, then set enable bit RCIE. 5. If 9-bit reception is desired, then set bit RX9. 6. If a single reception is required, set bit SREN. For continuous reception, set bit CREN. 7. Interrupt flag bit RCIF will be set when reception is complete and an interrupt will be generated if enable bit RCIE was set. 8. Read the RCSTA register to get the ninth bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG register. 10. If any error occurred, clear the error by clearing bit CREN. 11. If using interrupts, ensure that GIE and PEIE (bits 7 and 6) of the INTCON register are set. TABLE 10-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x 1Ah RCREG USART Receive Register 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear. PIC16F87XA DS39582C-page 124  2001-2013 Microchip Technology Inc. FIGURE 10-11: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) 10.4 USART Synchronous Slave Mode Synchronous Slave mode differs from the Master mode in the fact that the shift clock is supplied externally at the RC6/TX/CK pin (instead of being supplied internally in Master mode). This allows the device to transfer or receive data while in Sleep mode. Slave mode is entered by clearing bit, CSRC (TXSTA<7>). 10.4.1 USART SYNCHRONOUS SLAVE TRANSMIT The operation of the Synchronous Master and Slave modes is identical, except in the case of the Sleep mode. If two words are written to the TXREG and then the SLEEP instruction is executed, the following will occur: a) The first word will immediately transfer to the TSR register and transmit. b) The second word will remain in TXREG register. c) Flag bit TXIF will not be set. d) When the first word has been shifted out of TSR, the TXREG register will transfer the second word to the TSR and flag bit TXIF will now be set. e) If enable bit TXIE is set, the interrupt will wake the chip from Sleep and if the global interrupt is enabled, the program will branch to the interrupt vector (0004h). When setting up a Synchronous Slave Transmission, follow these steps: 1. Enable the synchronous slave serial port by setting bits SYNC and SPEN and clearing bit CSRC. 2. Clear bits CREN and SREN. 3. If interrupts are desired, then set enable bit TXIE. 4. If 9-bit transmission is desired, then set bit TX9. 5. Enable the transmission by setting enable bit TXEN. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit TX9D. 7. Start transmission by loading data to the TXREG register. 8. If using interrupts, ensure that GIE and PEIE (bits 7 and 6) of the INTCON register are set. CREN bit RC7/RX/DT RC6/TX/CK Write to bit SREN SREN bit RCIF bit (Interrupt) Read RXREG Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRG = 0. Q2 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 ‘0’ bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 ‘0’ Q1 Q2 Q3 Q4 pin pin  2001-2013 Microchip Technology Inc. DS39582C-page 125 PIC16F87XA TABLE 10-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION 10.4.2 USART SYNCHRONOUS SLAVE RECEPTION The operation of the Synchronous Master and Slave modes is identical, except in the case of the Sleep mode. Bit SREN is a “don't care” in Slave mode. If receive is enabled by setting bit CREN prior to the SLEEP instruction, then a word may be received during Sleep. On completely receiving the word, the RSR register will transfer the data to the RCREG register and if enable bit RCIE bit is set, the interrupt generated will wake the chip from Sleep. If the global interrupt is enabled, the program will branch to the interrupt vector (0004h). When setting up a Synchronous Slave Reception, follow these steps: 1. Enable the synchronous master serial port by setting bits SYNC and SPEN and clearing bit CSRC. 2. If interrupts are desired, set enable bit RCIE. 3. If 9-bit reception is desired, set bit RX9. 4. To enable reception, set enable bit CREN. 5. Flag bit RCIF will be set when reception is complete and an interrupt will be generated if enable bit RCIE was set. 6. Read the RCSTA register to get the ninth bit (if enabled) and determine if any error occurred during reception. 7. Read the 8-bit received data by reading the RCREG register. 8. If any error occurred, clear the error by clearing bit CREN. 9. If using interrupts, ensure that GIE and PEIE (bits 7 and 6) of the INTCON register are set. TABLE 10-11: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 19h TXREG USART Transmit Register 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices; always maintain these bits clear. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh, 8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF R0IF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 1Ah RCREG USART Receive Register 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010 99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000 Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception. Note 1: Bits PSPIE and PSPIF are reserved on 28-pin devices, always maintain these bits clear. PIC16F87XA DS39582C-page 126  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 127 PIC16F87XA 11.0 ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE The Analog-to-Digital (A/D) Converter module has five inputs for the 28-pin devices and eight for the 40/44-pin devices. The conversion of an analog input signal results in a corresponding 10-bit digital number. The A/D module has high and low-voltage reference input that is software selectable to some combination of VDD, VSS, RA2 or RA3. The A/D converter has a unique feature of being able to operate while the device is in Sleep mode. To operate in Sleep, the A/D clock must be derived from the A/D’s internal RC oscillator. The A/D module has four registers. These registers are: • A/D Result High Register (ADRESH) • A/D Result Low Register (ADRESL) • A/D Control Register 0 (ADCON0) • A/D Control Register 1 (ADCON1) The ADCON0 register, shown in Register 11-1, controls the operation of the A/D module. The ADCON1 register, shown in Register 11-2, configures the functions of the port pins. The port pins can be configured as analog inputs (RA3 can also be the voltage reference) or as digital I/O. Additional information on using the A/D module can be found in the PIC® Mid-Range MCU Family Reference Manual (DS33023). REGISTER 11-1: ADCON0 REGISTER (ADDRESS 1Fh) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE — ADON bit 7 bit 0 bit 7-6 ADCS1:ADCS0: A/D Conversion Clock Select bits (ADCON0 bits in bold) bit 5-3 CHS2:CHS0: Analog Channel Select bits 000 = Channel 0 (AN0) 001 = Channel 1 (AN1) 010 = Channel 2 (AN2) 011 = Channel 3 (AN3) 100 = Channel 4 (AN4) 101 = Channel 5 (AN5) 110 = Channel 6 (AN6) 111 = Channel 7 (AN7) Note: The PIC16F873A/876A devices only implement A/D channels 0 through 4; the unimplemented selections are reserved. Do not select any unimplemented channels with these devices. bit 2 GO/DONE: A/D Conversion Status bit When ADON = 1: 1 = A/D conversion in progress (setting this bit starts the A/D conversion which is automatically cleared by hardware when the A/D conversion is complete) 0 = A/D conversion not in progress bit 1 Unimplemented: Read as ‘0’ bit 0 ADON: A/D On bit 1 = A/D converter module is powered up 0 = A/D converter module is shut-off and consumes no operating current Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown ADCON1 ADCON0 Clock Conversion 0 00 FOSC/2 0 01 FOSC/8 0 10 FOSC/32 0 11 FRC (clock derived from the internal A/D RC oscillator) 1 00 FOSC/4 1 01 FOSC/16 1 10 FOSC/64 1 11 FRC (clock derived from the internal A/D RC oscillator) PIC16F87XA DS39582C-page 128  2001-2013 Microchip Technology Inc. REGISTER 11-2: ADCON1 REGISTER (ADDRESS 9Fh) R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM ADCS2 — — PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 bit 7 ADFM: A/D Result Format Select bit 1 = Right justified. Six (6) Most Significant bits of ADRESH are read as ‘0’. 0 = Left justified. Six (6) Least Significant bits of ADRESL are read as ‘0’. bit 6 ADCS2: A/D Conversion Clock Select bit (ADCON1 bits in shaded area and in bold) bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 PCFG3:PCFG0: A/D Port Configuration Control bits Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: On any device Reset, the port pins that are multiplexed with analog functions (ANx) are forced to be an analog input. ADCON1 ADCON0 Clock Conversion 0 00 FOSC/2 0 01 FOSC/8 0 10 FOSC/32 0 11 FRC (clock derived from the internal A/D RC oscillator) 1 00 FOSC/4 1 01 FOSC/16 1 10 FOSC/64 1 11 FRC (clock derived from the internal A/D RC oscillator) A = Analog input D = Digital I/O C/R = # of analog input channels/# of A/D voltage references PCFG <3:0> AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0 VREF+ VREF- C/R 0000 AA A A A A A AVDD VSS 8/0 0001 A A A AVREF+ A A A AN3 VSS 7/1 0010 DDD A A A A AVDD VSS 5/0 0011 D D D AVREF+ A A A AN3 VSS 4/1 0100 DDDD A D A AVDD VSS 3/0 0101 D D D DVREF+ D A A AN3 VSS 2/1 011x D D D D D D D D — — 0/0 1000 A A A AVREF+ VREF- A A AN3 AN2 6/2 1001 DD A A A A A AVDD VSS 6/0 1010 D D A AVREF+ A A A AN3 VSS 5/1 1011 D D A AVREF+ VREF- A A AN3 AN2 4/2 1100 D D D AVREF+ VREF- A A AN3 AN2 3/2 1101 D D D DVREF+ VREF- A A AN3 AN2 2/2 1110 DDDD D D DAVDD VSS 1/0 1111 D D D DVREF+ VREF- D A AN3 AN2 1/2  2001-2013 Microchip Technology Inc. DS39582C-page 129 PIC16F87XA The ADRESH:ADRESL registers contain the 10-bit result of the A/D conversion. When the A/D conversion is complete, the result is loaded into this A/D Result register pair, the GO/DONE bit (ADCON0<2>) is cleared and the A/D interrupt flag bit ADIF is set. The block diagram of the A/D module is shown in Figure 11-1. After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as inputs. To determine sample time, see Section 11.1 “A/D Acquisition Requirements”. After this acquisition time has elapsed, the A/D conversion can be started. To do an A/D Conversion, follow these steps: 1. Configure the A/D module: • Configure analog pins/voltage reference and digital I/O (ADCON1) • Select A/D input channel (ADCON0) • Select A/D conversion clock (ADCON0) • Turn on A/D module (ADCON0) 2. Configure A/D interrupt (if desired): • Clear ADIF bit • Set ADIE bit • Set PEIE bit • Set GIE bit 3. Wait the required acquisition time. 4. Start conversion: • Set GO/DONE bit (ADCON0) 5. Wait for A/D conversion to complete by either: • Polling for the GO/DONE bit to be cleared (interrupts disabled); OR • Waiting for the A/D interrupt 6. Read A/D Result register pair (ADRESH:ADRESL), clear bit ADIF if required. 7. For the next conversion, go to step 1 or step 2 as required. The A/D conversion time per bit is defined as TAD. FIGURE 11-1: A/D BLOCK DIAGRAM (Input Voltage) VAIN VREF+ (Reference Voltage) VDD PCFG3:PCFG0 CHS2:CHS0 RE2/AN7(1) RE1/AN6(1) RE0/AN5(1) RA5/AN4 RA3/AN3/VREF+ RA2/AN2/VREFRA1/AN1 RA0/AN0 111 110 101 100 011 010 001 000 A/D Converter Note 1: Not available on 28-pin devices. VREF- (Reference Voltage) VSS PCFG3:PCFG0 PIC16F87XA DS39582C-page 130  2001-2013 Microchip Technology Inc. 11.1 A/D Acquisition Requirements For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 11-2. The source impedance (RS) and the internal sampling switch impedance (RSS) directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD); see Figure 11-2. The maximum recommended impedance for analog sources is 2.5 k. As the impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (changed), this acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 11-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. To calculate the minimum acquisition time, TACQ, see the PIC® Mid-Range MCU Family Reference Manual (DS33023). EQUATION 11-1: ACQUISITION TIME FIGURE 11-2: ANALOG INPUT MODEL TACQ TC TACQ = = = = = = = = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient TAMP + TC + TCOFF 2 s + TC + [(Temperature – 25°C)(0.05 s/°C)] CHOLD (RIC + RSS + RS) In(1/2047) - 120 pF (1 k + 7 k + 10 k) In(0.0004885) 16.47 s 2 s + 16.47 s + [(50°C – 25C)(0.05 s/C) 19.72 s Note 1: The reference voltage (VREF) has no effect on the equation since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 2.5 k. This is required to meet the pin leakage specification. VA CPIN RS ANx 5 pF VDD VT = 0.6V VT = 0.6V ILEAKAGE RIC  1K Sampling Switch SS RSS CHOLD = DAC Capacitance VSS 6V Sampling Switch 5V 4V 3V 2V 5 6 7 8 9 10 11 (k) VDD ± 500 nA = 120 pF Legend: CPIN VT ILEAKAGE RIC SS CHOLD = input capacitance = threshold voltage = leakage current at the pin due to = interconnect resistance = sampling switch = sample/hold capacitance (from DAC) various junctions  2001-2013 Microchip Technology Inc. DS39582C-page 131 PIC16F87XA 11.2 Selecting the A/D Conversion Clock The A/D conversion time per bit is defined as TAD. The A/D conversion requires a minimum 12 TAD per 10-bit conversion. The source of the A/D conversion clock is software selected. The seven possible options for TAD are: • 2 TOSC • 4 TOSC • 8 TOSC • 16 TOSC • 32 TOSC • 64 TOSC • Internal A/D module RC oscillator (2-6 s) For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of 1.6 s. Table 11-1 shows the resultant TAD times derived from the device operating frequencies and the A/D clock source selected. 11.3 Configuring Analog Port Pins The ADCON1 and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The A/D operation is independent of the state of the CHS2:CHS0 bits and the TRIS bits. TABLE 11-1: TAD vs. MAXIMUM DEVICE OPERATING FREQUENCIES (STANDARD DEVICES (F)) Note 1: When reading the port register, any pin configured as an analog input channel will read as cleared (a low level). Pins configured as digital inputs will convert an analog input. Analog levels on a digitally configured input will not affect the conversion accuracy. 2: Analog levels on any pin that is defined as a digital input (including the AN7:AN0 pins) may cause the input buffer to consume current that is out of the device specifications. AD Clock Source (TAD) Maximum Device Frequency Operation ADCS2:ADCS1:ADCS0 2 TOSC 000 1.25 MHz 4 TOSC 100 2.5 MHz 8 TOSC 001 5 MHz 16 TOSC 101 10 MHz 32 TOSC 010 20 MHz 64 TOSC 110 20 MHz RC(1, 2, 3) x11 (Note 1) Note 1: The RC source has a typical TAD time of 4 s but can vary between 2-6 s. 2: When the device frequencies are greater than 1 MHz, the RC A/D conversion clock source is only recommended for Sleep operation. 3: For extended voltage devices (LF), please refer to Section 17.0 “Electrical Characteristics”. PIC16F87XA DS39582C-page 132  2001-2013 Microchip Technology Inc. 11.4 A/D Conversions Clearing the GO/DONE bit during a conversion will abort the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. That is, the ADRESH:ADRESL registers will continue to contain the value of the last completed conversion (or the last value written to the ADRESH:ADRESL registers). After the A/D conversion is aborted, the next acquisition on the selected channel is automatically started. The GO/DONE bit can then be set to start the conversion. In Figure 11-3, after the GO bit is set, the first time segment has a minimum of TCY and a maximum of TAD. FIGURE 11-3: A/D CONVERSION TAD CYCLES 11.4.1 A/D RESULT REGISTERS The ADRESH:ADRESL register pair is the location where the 10-bit A/D result is loaded at the completion of the A/D conversion. This register pair is 16 bits wide. The A/D module gives the flexibility to left or right justify the 10-bit result in the 16-bit result register. The A/D Format Select bit (ADFM) controls this justification. Figure 11-4 shows the operation of the A/D result justification. The extra bits are loaded with ‘0’s. When an A/D result will not overwrite these locations (A/D disable), these registers may be used as two general purpose 8-bit registers. FIGURE 11-4: A/D RESULT JUSTIFICATION Note: The GO/DONE bit should NOT be set in the same instruction that turns on the A/D. TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 Set GO bit Holding capacitor is disconnected from analog input (typically 100 ns) b9 b8 b7 b6 b5 b4 b3 b2 TAD10 TAD11 b1 b0 TCY to TAD Conversion starts ADRES is loaded GO bit is cleared ADIF bit is set Holding capacitor is connected to analog input 10-bit Result ADRESH ADRESL 0000 00 ADFM = 0 7 2 1 0 7 0 10-bit Result ADRESH ADRESL 10-bit Result 0000 00 7 0 7 6 5 0 ADFM = 1 Right Justified Left Justified  2001-2013 Microchip Technology Inc. DS39582C-page 133 PIC16F87XA 11.5 A/D Operation During Sleep The A/D module can operate during Sleep mode. This requires that the A/D clock source be set to RC (ADCS1:ADCS0 = 11). When the RC clock source is selected, the A/D module waits one instruction cycle before starting the conversion. This allows the SLEEP instruction to be executed which eliminates all digital switching noise from the conversion. When the conversion is completed, the GO/DONE bit will be cleared and the result loaded into the ADRES register. If the A/D interrupt is enabled, the device will wake-up from Sleep. If the A/D interrupt is not enabled, the A/D module will then be turned off, although the ADON bit will remain set. When the A/D clock source is another clock option (not RC), a SLEEP instruction will cause the present conversion to be aborted and the A/D module to be turned off, though the ADON bit will remain set. Turning off the A/D places the A/D module in its lowest current consumption state. 11.6 Effects of a Reset A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off and any conversion is aborted. All A/D input pins are configured as analog inputs. The value that is in the ADRESH:ADRESL registers is not modified for a Power-on Reset. The ADRESH:ADRESL registers will contain unknown data after a Power-on Reset. TABLE 11-2: REGISTERS/BITS ASSOCIATED WITH A/D Note: For the A/D module to operate in Sleep, the A/D clock source must be set to RC (ADCS1:ADCS0 = 11). To allow the conversion to occur during Sleep, ensure the SLEEP instruction immediately follows the instruction that sets the GO/DONE bit. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on MCLR, WDT 0Bh,8Bh, 10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 8Ch PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000 1Eh ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu 9Eh ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu 1Fh ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE — ADON 0000 00-0 0000 00-0 9Fh ADCON1 ADFM ADCS2 — — PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 00-- 0000 85h TRISA — — PORTA Data Direction Register --11 1111 --11 1111 05h PORTA — — PORTA Data Latch when written: PORTA pins when read --0x 0000 --0u 0000 89h(1) TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction bits 0000 -111 0000 -111 09h(1) PORTE — — — — — RE2 RE1 RE0 ---- -xxx ---- -uuu Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion. Note 1: These registers are not available on 28-pin devices. PIC16F87XA DS39582C-page 134  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 135 PIC16F87XA 12.0 COMPARATOR MODULE The comparator module contains two analog comparators. The inputs to the comparators are multiplexed with I/O port pins RA0 through RA3, while the outputs are multiplexed to pins RA4 and RA5. The on-chip voltage reference (Section 13.0 “Comparator Voltage Reference Module”) can also be an input to the comparators. The CMCON register (Register 12-1) controls the comparator input and output multiplexers. A block diagram of the various comparator configurations is shown in Figure 12-1. REGISTER 12-1: CMCON REGISTER R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 bit 7 bit 0 bit 7 C2OUT: Comparator 2 Output bit When C2INV = 0: 1 = C2 VIN+ > C2 VIN- 0 = C2 VIN+ < C2 VINWhen C2INV = 1: 1 = C2 VIN+ < C2 VIN- 0 = C2 VIN+ > C2 VINbit 6 C1OUT: Comparator 1 Output bit When C1INV = 0: 1 = C1 VIN+ > C1 VIN- 0 = C1 VIN+ < C1 VINWhen C1INV = 1: 1 = C1 VIN+ < C1 VIN- 0 = C1 VIN+ > C1 VINbit 5 C2INV: Comparator 2 Output Inversion bit 1 = C2 output inverted 0 = C2 output not inverted bit 4 C1INV: Comparator 1 Output Inversion bit 1 = C1 output inverted 0 = C1 output not inverted bit 3 CIS: Comparator Input Switch bit When CM2:CM0 = 110: 1 = C1 VIN- connects to RA3/AN3 C2 VIN- connects to RA2/AN2 0 = C1 VIN- connects to RA0/AN0 C2 VIN- connects to RA1/AN1 bit 2 CM2:CM0: Comparator Mode bits Figure 12-1 shows the Comparator modes and CM2:CM0 bit settings. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 136  2001-2013 Microchip Technology Inc. 12.1 Comparator Configuration There are eight modes of operation for the comparators. The CMCON register is used to select these modes. Figure 12-1 shows the eight possible modes. The TRISA register controls the data direction of the comparator pins for each mode. If the Comparator mode is changed, the comparator output level may not be valid for the specified mode change delay shown in Section 17.0 “Electrical Characteristics”. FIGURE 12-1: COMPARATOR I/O OPERATING MODES Note: Comparator interrupts should be disabled during a Comparator mode change. Otherwise, a false interrupt may occur. C1 RA0/AN0 VINVIN+ RA3/AN3 Off (Read as ‘0’) Comparators Reset A A CM2:CM0 = 000 C2 RA1/AN1 VINVIN+ RA2/AN2 Off (Read as ‘0’) A A C1 RA0/AN0 VINVIN+ RA3/AN3 C1OUT Two Independent Comparators A A CM2:CM0 = 010 C2 RA1/AN1 VINVIN+ RA2/AN2 C2OUT A A C1 RA0/AN0 VINVIN+ RA3/AN3 C1OUT Two Common Reference Comparators A A CM2:CM0 = 100 C2 RA1/AN1 VINVIN+ RA2/AN2 C2OUT A D C2 RA1/AN1 VINVIN+ RA2/AN2 Off (Read as ‘0’) One Independent Comparator with Output D D CM2:CM0 = 001 C1 RA0/AN0 VINVIN+ RA3/AN3 C1OUT A A C1 RA0/AN0 VINVIN+ RA3/AN3 Off (Read as ‘0’) Comparators Off (POR Default Value) D D CM2:CM0 = 111 C2 RA1/AN1 VINVIN+ RA2/AN2 Off (Read as ‘0’) D D C1 RA0/AN0 VINVIN+ RA3/AN3 C1OUT Four Inputs Multiplexed to Two Comparators A A CM2:CM0 = 110 C2 RA1/AN1 VINVIN+ RA2/AN2 C2OUT A A From Comparator CIS = 0 CIS = 1 CIS = 0 CIS = 1 C1 RA0/AN0 VINVIN+ RA3/AN3 C1OUT Two Common Reference Comparators with Outputs A A CM2:CM0 = 101 C2 RA1/AN1 VINVIN+ RA2/AN2 C2OUT A D A = Analog Input, port reads zeros always. D = Digital Input. CIS (CMCON<3>) is the Comparator Input Switch. CVREF C1 RA0/AN0 VINVIN+ RA3/AN3 C1OUT Two Independent Comparators with Outputs A A CM2:CM0 = 011 C2 RA1/AN1 VINVIN+ RA2/AN2 C2OUT A A RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT RA4/T0CKI/C1OUT RA5/AN4/SS/C2OUT RA4/T0CKI/C1OUT VREF Module  2001-2013 Microchip Technology Inc. DS39582C-page 137 PIC16F87XA 12.2 Comparator Operation A single comparator is shown in Figure 12-2 along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 12-2 represent the uncertainty due to input offsets and response time. 12.3 Comparator Reference An external or internal reference signal may be used depending on the comparator operating mode. The analog signal present at VIN- is compared to the signal at VIN+ and the digital output of the comparator is adjusted accordingly (Figure 12-2). FIGURE 12-2: SINGLE COMPARATOR 12.3.1 EXTERNAL REFERENCE SIGNAL When external voltage references are used, the comparator module can be configured to have the comparators operate from the same or different reference sources. However, threshold detector applications may require the same reference. The reference signal must be between VSS and VDD and can be applied to either pin of the comparator(s). 12.3.2 INTERNAL REFERENCE SIGNAL The comparator module also allows the selection of an internally generated voltage reference for the comparators. Section 13.0 “Comparator Voltage Reference Module” contains a detailed description of the Comparator Voltage Reference module that provides this signal. The internal reference signal is used when comparators are in mode, CM<2:0> = 110 (Figure 12-1). In this mode, the internal voltage reference is applied to the VIN+ pin of both comparators. 12.4 Comparator Response Time Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output has a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (Section 17.0 “Electrical Characteristics”). 12.5 Comparator Outputs The comparator outputs are read through the CMCON register. These bits are read-only. The comparator outputs may also be directly output to the RA4 and RA5 I/O pins. When enabled, multiplexors in the output path of the RA4 and RA5 pins will switch and the output of each pin will be the unsynchronized output of the comparator. The uncertainty of each of the comparators is related to the input offset voltage and the response time given in the specifications. Figure 12-3 shows the comparator output block diagram. The TRISA bits will still function as an output enable/ disable for the RA4 and RA5 pins while in this mode. The polarity of the comparator outputs can be changed using the C2INV and C1INV bits (CMCON<4:5>). – VIN+ + VINOutput VIN– VIN+ Output Output VIN+ VINNote 1: When reading the Port register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert an analog input according to the Schmitt Trigger input specification. 2: Analog levels on any pin defined as a digital input may cause the input buffer to consume more current than is specified. 3: RA4 is an open collector I/O pin. When used as an output, a pull-up resistor is required. PIC16F87XA DS39582C-page 138  2001-2013 Microchip Technology Inc. FIGURE 12-3: COMPARATOR OUTPUT BLOCK DIAGRAM 12.6 Comparator Interrupts The comparator interrupt flag is set whenever there is a change in the output value of either comparator. Software will need to maintain information about the status of the output bits, as read from CMCON<7:6>, to determine the actual change that occurred. The CMIF bit (PIR registers) is the Comparator Interrupt Flag. The CMIF bit must be reset by clearing it (‘0’). Since it is also possible to write a ‘1’ to this register, a simulated interrupt may be initiated. The CMIE bit (PIE registers) and the PEIE bit (INTCON register) must be set to enable the interrupt. In addition, the GIE bit must also be set. If any of these bits are clear, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of CMCON will end the mismatch condition. b) Clear flag bit CMIF. A mismatch condition will continue to set flag bit CMIF. Reading CMCON will end the mismatch condition and allow flag bit CMIF to be cleared. Q D EN To RA4 or RA5 Pin Bus Data Read CMCON Set MULTIPLEX CMIF bit + - Q D EN CL Port Pins Read CMCON Reset From Other Comparator CxINV Note: If a change in the CMCON register (C1OUT or C2OUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR registers) interrupt flag may not get set.  2001-2013 Microchip Technology Inc. DS39582C-page 139 PIC16F87XA 12.7 Comparator Operation During Sleep When a comparator is active and the device is placed in Sleep mode, the comparator remains active and the interrupt is functional if enabled. This interrupt will wake-up the device from Sleep mode when enabled. While the comparator is powered up, higher Sleep currents than shown in the power-down current specification will occur. Each operational comparator will consume additional current as shown in the comparator specifications. To minimize power consumption while in Sleep mode, turn off the comparators, CM<2:0> = 111, before entering Sleep. If the device wakes up from Sleep, the contents of the CMCON register are not affected. 12.8 Effects of a Reset A device Reset forces the CMCON register to its Reset state, causing the comparator module to be in the Comparator Off mode, CM<2:0> = 111. This ensures compatibility to the PIC16F87X devices. 12.9 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 12-4. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up condition may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. FIGURE 12-4: ANALOG INPUT MODEL VA RS < 10K AIN CPIN 5 pF VDD VT = 0.6 V VT = 0.6 V RIC ILEAKAGE ±500 nA VSS Legend: CPIN = Input Capacitance VT = Threshold Voltage ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage PIC16F87XA DS39582C-page 140  2001-2013 Microchip Technology Inc. TABLE 12-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on all other Resets 9Ch CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111 9Dh CVRCON CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000 0Bh, 8Bh, 10Bh,18Bh INTCON GIE/ GIEH PEIE/ GIEL TMR0IE INTIE RBIE TMR0IF INTIF RBIF 0000 000x 0000 000u 0Dh PIR2 — CMIF — — BCLIF LVDIF TMR3IF CCP2IF -0-- 0000 -0-- 0000 8Dh PIE2 — CMIE — — BCLIE LVDIE TMR3IE CCP2IE -0-- 0000 -0-- 0000 05h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --0x 0000 --0u 0000 85h TRISA — — PORTA Data Direction Register --11 1111 --11 1111 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module.  2001-2013 Microchip Technology Inc. DS39582C-page 141 PIC16F87XA 13.0 COMPARATOR VOLTAGE REFERENCE MODULE The Comparator Voltage Reference Generator is a 16-tap resistor ladder network that provides a fixed voltage reference when the comparators are in mode ‘110’. A programmable register controls the function of the reference generator. Register 13-1 lists the bit functions of the CVRCON register. As shown in Figure 13-1, the resistor ladder is segmented to provide two ranges of CVREF values and has a power-down function to conserve power when the reference is not being used. The comparator reference supply voltage (also referred to as CVRSRC) comes directly from VDD. It should be noted, however, that the voltage at the top of the ladder is CVRSRC – VSAT, where VSAT is the saturation voltage of the power switch transistor. This reference will only be as accurate as the values of CVRSRC and VSAT. The output of the reference generator may be connected to the RA2/AN2/VREF-/CVREF pin. This can be used as a simple D/A function by the user if a very highimpedance load is used. The primary purpose of this function is to provide a test path for testing the reference generator function. REGISTER 13-1: CVRCON CONTROL REGISTER (ADDRESS 9Dh) R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 bit 7 bit 0 bit 7 CVREN: Comparator Voltage Reference Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down bit 6 CVROE: Comparator VREF Output Enable bit 1 = CVREF voltage level is output on RA2/AN2/VREF-/CVREF pin 0 = CVREF voltage level is disconnected from RA2/AN2/VREF-/CVREF pin bit 5 CVRR: Comparator VREF Range Selection bit 1 = 0 to 0.75 CVRSRC, with CVRSRC/24 step size 0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size bit 4 Unimplemented: Read as ‘0’ bit 3-0 CVR3:CVR0: Comparator VREF Value Selection bits 0  VR3:VR0  15 When CVRR = 1: CVREF = (VR<3:0>/ 24)  (CVRSRC) When CVRR = 0: CVREF = 1/4  (CVRSRC) + (VR3:VR0/ 32)  (CVRSRC) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC16F87XA DS39582C-page 142  2001-2013 Microchip Technology Inc. FIGURE 13-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM TABLE 13-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE 8R CVRR CVR3 CVR0 16:1 Analog MUX 8R R R R R CVREN CVREF 16 Stages Input to Comparator CVROE RA2/AN2/VREF-/CVREF VDD CVR2 CVR1 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on all other Resets 9Dh CVRCON CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000 9Ch CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used with the comparator voltage reference.  2001-2013 Microchip Technology Inc. DS39582C-page 143 PIC16F87XA 14.0 SPECIAL FEATURES OF THE CPU All PIC16F87XA devices have a host of features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protection. These are: • Oscillator Selection • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Sleep • Code Protection • ID Locations • In-Circuit Serial Programming • Low-Voltage In-Circuit Serial Programming • In-Circuit Debugger PIC16F87XA devices have a Watchdog Timer which can be shut-off only through configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay of 72 ms (nominal) on power-up only. It is designed to keep the part in Reset while the power supply stabilizes. With these two timers on-chip, most applications need no external Reset circuitry. Sleep mode is designed to offer a very low current power-down mode. The user can wake-up from Sleep through external Reset, Watchdog Timer wake-up or through an interrupt. Several oscillator options are also made available to allow the part to fit the application. The RC oscillator option saves system cost while the LP crystal option saves power. A set of configuration bits is used to select various options. Additional information on special features is available in the PIC® Mid-Range MCU Family Reference Manual (DS33023). 14.1 Configuration Bits The configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’) to select various device configurations. The erased or unprogrammed value of the Configuration Word register is 3FFFh. These bits are mapped in program memory location 2007h. It is important to note that address 2007h is beyond the user program memory space which can be accessed only during programming. PIC16F87XA DS39582C-page 144  2001-2013 Microchip Technology Inc. REGISTER 14-1: CONFIGURATION WORD (ADDRESS 2007h)(1) R/P-1 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 CP — DEBUG WRT1 WRT0 CPD LVP BOREN — — PWRTEN WDTEN FOSC1 FOSC0 bit 13 bit0 bit 13 CP: Flash Program Memory Code Protection bit 1 = Code protection off 0 = All program memory code-protected bit 12 Unimplemented: Read as ‘1’ bit 11 DEBUG: In-Circuit Debugger Mode bit 1 = In-Circuit Debugger disabled, RB6 and RB7 are general purpose I/O pins 0 = In-Circuit Debugger enabled, RB6 and RB7 are dedicated to the debugger bit 10-9 WRT1:WRT0 Flash Program Memory Write Enable bits For PIC16F876A/877A: 11 = Write protection off; all program memory may be written to by EECON control 10 = 0000h to 00FFh write-protected; 0100h to 1FFFh may be written to by EECON control 01 = 0000h to 07FFh write-protected; 0800h to 1FFFh may be written to by EECON control 00 = 0000h to 0FFFh write-protected; 1000h to 1FFFh may be written to by EECON control For PIC16F873A/874A: 11 = Write protection off; all program memory may be written to by EECON control 10 = 0000h to 00FFh write-protected; 0100h to 0FFFh may be written to by EECON control 01 = 0000h to 03FFh write-protected; 0400h to 0FFFh may be written to by EECON control 00 = 0000h to 07FFh write-protected; 0800h to 0FFFh may be written to by EECON control bit 8 CPD: Data EEPROM Memory Code Protection bit 1 = Data EEPROM code protection off 0 = Data EEPROM code-protected bit 7 LVP: Low-Voltage (Single-Supply) In-Circuit Serial Programming Enable bit 1 = RB3/PGM pin has PGM function; low-voltage programming enabled 0 = RB3 is digital I/O, HV on MCLR must be used for programming bit 6 BOREN: Brown-out Reset Enable bit 1 = BOR enabled 0 = BOR disabled bit 5-4 Unimplemented: Read as ‘1’ bit 3 PWRTEN: Power-up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 2 WDTEN: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0 FOSC1:FOSC0: Oscillator Selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ - n = Value when device is unprogrammed u = Unchanged from programmed state Note 1: The erased (unprogrammed) value of the Configuration Word is 3FFFh.  2001-2013 Microchip Technology Inc. DS39582C-page 145 PIC16F87XA 14.2 Oscillator Configurations 14.2.1 OSCILLATOR TYPES The PIC16F87XA can be operated in four different oscillator modes. The user can program two configuration bits (FOSC1 and FOSC0) to select one of these four modes: • LP Low-Power Crystal • XT Crystal/Resonator • HS High-Speed Crystal/Resonator • RC Resistor/Capacitor 14.2.2 CRYSTAL OSCILLATOR/CERAMIC RESONATORS In XT, LP or HS modes, a crystal or ceramic resonator is connected to the OSC1/CLKI and OSC2/CLKO pins to establish oscillation (Figure 14-1). The PIC16F87XA oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturer’s specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1/CLKI pin (Figure 14-2). FIGURE 14-1: CRYSTAL/CERAMIC RESONATOR OPERATION (HS, XT OR LP OSC CONFIGURATION) FIGURE 14-2: EXTERNAL CLOCK INPUT OPERATION (HS, XT OR LP OSC CONFIGURATION) TABLE 14-1: CERAMIC RESONATORS Note 1: See Table 14-1 and Table 14-2 for recommended values of C1 and C2. 2: A series resistor (Rs) may be required for AT strip cut crystals. 3: RF varies with the crystal chosen. C1(1) C2(1) XTAL OSC2 OSC1 RF(3) Sleep To Logic PIC16F87XA Rs (2) Internal Ranges Tested: Mode Freq. OSC1 OSC2 XT 455 kHz 2.0 MHz 4.0 MHz 68-100 pF 15-68 pF 15-68 pF 68-100 pF 15-68 pF 15-68 pF HS 8.0 MHz 16.0 MHz 10-68 pF 10-22 pF 10-68 pF 10-22 pF These values are for design guidance only. See notes following Table 14-2. Resonators Used: 2.0 MHz Murata Erie CSA2.00MG  0.5% 4.0 MHz Murata Erie CSA4.00MG  0.5% 8.0 MHz Murata Erie CSA8.00MT  0.5% 16.0 MHz Murata Erie CSA16.00MX  0.5% All resonators used did not have built-in capacitors. OSC1 Open OSC2 Clock from Ext. System PIC16F87XA PIC16F87XA DS39582C-page 146  2001-2013 Microchip Technology Inc. TABLE 14-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR 14.2.3 RC OSCILLATOR For timing insensitive applications, the “RC” device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 14-3 shows how the R/C combination is connected to the PIC16F87XA. FIGURE 14-3: RC OSCILLATOR MODE Osc Type Crystal Freq. Cap. Range C1 Cap. Range C2 LP 32 kHz 33 pF 33 pF 200 kHz 15 pF 15 pF XT 200 kHz 47-68 pF 47-68 pF 1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF HS 4 MHz 15 pF 15 pF 8 MHz 15-33 pF 15-33 pF 20 MHz 15-33 pF 15-33 pF These values are for design guidance only. See notes following this table. Crystals Used 32 kHz Epson C-001R32.768K-A ± 20 PPM 200 kHz STD XTL 200.000KHz ± 20 PPM 1 MHz ECS ECS-10-13-1 ± 50 PPM 4 MHz ECS ECS-40-20-1 ± 50 PPM 8 MHz EPSON CA-301 8.000M-C ± 30 PPM 20 MHz EPSON CA-301 20.000M-C ± 30 PPM Note 1: Higher capacitance increases the stability of oscillator but also increases the start-up time. 2: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 3: Rs may be required in HS mode, as well as XT mode, to avoid overdriving crystals with low drive level specification. 4: When migrating from other PIC® devices, oscillator performance should be verified. OSC2/CLKO CEXT REXT PIC16F87XA OSC1 FOSC/4 Internal Clock VDD VSS Recommended values: 3 k  REXT  100 k CEXT > 20 pF  2001-2013 Microchip Technology Inc. DS39582C-page 147 PIC16F87XA 14.3 Reset The PIC16F87XA differentiates between various kinds of Reset: • Power-on Reset (POR) • MCLR Reset during normal operation • MCLR Reset during Sleep • WDT Reset (during normal operation) • WDT Wake-up (during Sleep) • Brown-out Reset (BOR) Some registers are not affected in any Reset condition. Their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on Power-on Reset (POR), on the MCLR and WDT Reset, on MCLR Reset during Sleep and Brownout Reset (BOR). They are not affected by a WDT wake-up which is viewed as the resumption of normal operation. The TO and PD bits are set or cleared differently in different Reset situations as indicated in Table 14-4. These bits are used in software to determine the nature of the Reset. See Table 14-6 for a full description of Reset states of all registers. A simplified block diagram of the on-chip Reset circuit is shown in Figure 14-4. FIGURE 14-4: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT S R Q External Reset MCLR VDD OSC1 WDT Module VDD Rise Detect OST/PWRT On-chip RC OSC WDT Time-out Power-on Reset OST 10-bit Ripple Counter PWRT Chip_Reset 10-bit Ripple Counter Reset Enable OST Enable PWRT Sleep Note 1: This is a separate oscillator from the RC oscillator of the CLKI pin. Brown-out Reset BODEN (1) PIC16F87XA DS39582C-page 148  2001-2013 Microchip Technology Inc. 14.4 MCLR PIC16F87XA devices have a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. The behavior of the ESD protection on the MCLR pin differs from previous devices of this family. Voltages applied to the pin that exceed its specification can result in both Resets and current consumption outside of device specification during the Reset event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RCR network, as shown in Figure 14-5, is suggested. FIGURE 14-5: RECOMMENDED MCLR CIRCUIT 14.5 Power-on Reset (POR) A Power-on Reset pulse is generated on-chip when VDD rise is detected (in the range of 1.2V-1.7V). To take advantage of the POR, tie the MCLR pin to VDD through an RC network, as described in Section 14.4 “MCLR”. A maximum rise time for VDD is specified. See Section 17.0 “Electrical Characteristics” for details. When the device starts normal operation (exits the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. Brown-out Reset may be used to meet the start-up conditions. For additional information, refer to application note, AN607, “Power-up Trouble Shooting” (DS00607). 14.6 Power-up Timer (PWRT) The Power-up Timer provides a fixed 72 ms nominal time-out on power-up only from the POR. The Powerup Timer operates on an internal RC oscillator. The chip is kept in Reset as long as the PWRT is active. The PWRT’s time delay allows VDD to rise to an acceptable level. A configuration bit is provided to enable or disable the PWRT. The power-up time delay will vary from chip to chip due to VDD, temperature and process variation. See Section 17.0 “Electrical Characteristics” for details (TPWRT, parameter #33). 14.7 Oscillator Start-up Timer (OST) The Oscillator Start-up Timer (OST) provides a delay of 1024 oscillator cycles (from OSC1 input) after the PWRT delay is over (if PWRT is enabled). This helps to ensure that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from Sleep. 14.8 Brown-out Reset (BOR) The configuration bit, BODEN, can enable or disable the Brown-out Reset circuit. If VDD falls below VBOR (parameter D005, about 4V) for longer than TBOR (parameter #35, about 100 S), the brown-out situation will reset the device. If VDD falls below VBOR for less than TBOR, a Reset may not occur. Once the brown-out occurs, the device will remain in Brown-out Reset until VDD rises above VBOR. The Power-up Timer then keeps the device in Reset for TPWRT (parameter #33, about 72 mS). If VDD should fall below VBOR during TPWRT, the Brown-out Reset process will restart when VDD rises above VBOR with the Power-up Timer Reset. The Power-up Timer is always enabled when the Brown-out Reset circuit is enabled, regardless of the state of the PWRT configuration bit. 14.9 Time-out Sequence On power-up, the time-out sequence is as follows: the PWRT delay starts (if enabled) when a POR Reset occurs. Then, OST starts counting 1024 oscillator cycles when PWRT ends (LP, XT, HS). When the OST ends, the device comes out of Reset. If MCLR is kept low long enough, the time-outs will expire. Bringing MCLR high will begin execution immediately. This is useful for testing purposes or to synchronize more than one PIC16F87XA device operating in parallel. Table 14-5 shows the Reset conditions for the Status, PCON and PC registers, while Table 14-6 shows the Reset conditions for all the registers. C1 R1(1) VDD MCLR PIC16F87XA R2(2) Note 1: R1 < 40 k is recommended to make sure that the voltage drop across R does not violate the device’s electrical specification. 2: R2 > than 1K will limit any current flowing into MCLR from the external capacitor C, in the event of MCLR/VPP breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS).  2001-2013 Microchip Technology Inc. DS39582C-page 149 PIC16F87XA 14.10 Power Control/Status Register (PCON) The Power Control/Status Register, PCON, has up to two bits depending upon the device. Bit 0 is the Brown-out Reset Status bit, BOR. The BOR bit is unknown on a Power-on Reset. It must then be set by the user and checked on subsequent Resets to see if it has been cleared, indicating that a BOR has occurred. When the Brown-out Reset is disabled, the state of the BOR bit is unpredictable and is, therefore, not valid at any time. Bit 1 is the Power-on Reset Status bit, POR. It is cleared on a Power-on Reset and unaffected otherwise. The user must set this bit following a Power-on Reset. TABLE 14-3: TIME-OUT IN VARIOUS SITUATIONS TABLE 14-4: STATUS BITS AND THEIR SIGNIFICANCE TABLE 14-5: RESET CONDITIONS FOR SPECIAL REGISTERS Oscillator Configuration Power-up Brown-out Wake-up from Sleep PWRTE = 0 PWRTE = 1 XT, HS, LP 72 ms + 1024 TOSC 1024 TOSC 72 ms + 1024 TOSC 1024 TOSC RC 72 ms — 72 ms — POR BOR TO PD Condition 0 x 11 Power-on Reset 0 x 0x Illegal, TO is set on POR 0 x x0 Illegal, PD is set on POR 1 0 11 Brown-out Reset 1 1 01 WDT Reset 1 1 00 WDT Wake-up 1 1 uu MCLR Reset during normal operation 1 1 10 MCLR Reset during Sleep or Interrupt Wake-up from Sleep Legend: x = don’t care, u = unchanged Condition Program Counter Status Register PCON Register Power-on Reset 000h 0001 1xxx ---- --0x MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during Sleep 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 1uuu ---- --uu WDT Wake-up PC + 1 uuu0 0uuu ---- --uu Brown-out Reset 000h 0001 1uuu ---- --u0 Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu ---- --uu Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’ Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). PIC16F87XA DS39582C-page 150  2001-2013 Microchip Technology Inc. TABLE 14-6: INITIALIZATION CONDITIONS FOR ALL REGISTERS Register Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset Wake-up via WDT or Interrupt W 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu INDF 73A 74A 76A 77A N/A N/A N/A TMR0 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu PCL 73A 74A 76A 77A 0000 0000 0000 0000 PC + 1(2) STATUS 73A 74A 76A 77A 0001 1xxx 000q quuu(3) uuuq quuu(3) FSR 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu PORTA 73A 74A 76A 77A --0x 0000 --0u 0000 --uu uuuu PORTB 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu PORTC 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu PORTD 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu PORTE 73A 74A 76A 77A ---- -xxx ---- -uuu ---- -uuu PCLATH 73A 74A 76A 77A ---0 0000 ---0 0000 ---u uuuu INTCON 73A 74A 76A 77A 0000 000x 0000 000u uuuu uuuu(1) PIR1 73A 74A 76A 77A r000 0000 r000 0000 ruuu uuuu(1) 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu(1) PIR2 73A 74A 76A 77A -0-0 0--0 -0-0 0--0 -u-u u--u(1) TMR1L 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu TMR1H 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu T1CON 73A 74A 76A 77A --00 0000 --uu uuuu --uu uuuu TMR2 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu T2CON 73A 74A 76A 77A -000 0000 -000 0000 -uuu uuuu SSPBUF 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu SSPCON 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu CCPR1L 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu CCPR1H 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON 73A 74A 76A 77A --00 0000 --00 0000 --uu uuuu RCSTA 73A 74A 76A 77A 0000 000x 0000 000x uuuu uuuu TXREG 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu RCREG 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu CCPR2L 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu CCPR2H 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu CCP2CON 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu ADRESH 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 73A 74A 76A 77A 0000 00-0 0000 00-0 uuuu uu-u OPTION_REG 73A 74A 76A 77A 1111 1111 1111 1111 uuuu uuuu TRISA 73A 74A 76A 77A --11 1111 --11 1111 --uu uuuu TRISB 73A 74A 76A 77A 1111 1111 1111 1111 uuuu uuuu TRISC 73A 74A 76A 77A 1111 1111 1111 1111 uuuu uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition, r = reserved, maintain clear. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in INTCON, PIR1 and/or PIR2 will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 3: See Table 14-5 for Reset value for specific condition.  2001-2013 Microchip Technology Inc. DS39582C-page 151 PIC16F87XA FIGURE 14-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD VIA RC NETWORK) TRISD 73A 74A 76A 77A 1111 1111 1111 1111 uuuu uuuu TRISE 73A 74A 76A 77A 0000 -111 0000 -111 uuuu -uuu PIE1 73A 74A 76A 77A r000 0000 r000 0000 ruuu uuuu 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu PIE2 73A 74A 76A 77A -0-0 0--0 -0-0 0--0 -u-u u--u PCON 73A 74A 76A 77A ---- --qq ---- --uu ---- --uu SSPCON2 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu PR2 73A 74A 76A 77A 1111 1111 1111 1111 1111 1111 SSPADD 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu SSPSTAT 73A 74A 76A 77A --00 0000 --00 0000 --uu uuuu TXSTA 73A 74A 76A 77A 0000 -010 0000 -010 uuuu -uuu SPBRG 73A 74A 76A 77A 0000 0000 0000 0000 uuuu uuuu CMCON 73A 974 76A 77A 0000 0111 0000 0111 uuuu uuuu CVRCON 73A 74A 76A 77A 000- 0000 000- 0000 uuu- uuuu ADRESL 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu ADCON1 73A 74A 76A 77A 00-- 0000 00-- 0000 uu-- uuuu EEDATA 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu EEADR 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu EEDATH 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu EEADRH 73A 74A 76A 77A xxxx xxxx uuuu uuuu uuuu uuuu EECON1 73A 74A 76A 77A x--- x000 u--- u000 u--- uuuu EECON2 73A 74A 76A 77A ---- ---- ---- ---- ---- ---- TABLE 14-6: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition, r = reserved, maintain clear. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in INTCON, PIR1 and/or PIR2 will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 3: See Table 14-5 for Reset value for specific condition. TPWRT TOST VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset PIC16F87XA DS39582C-page 152  2001-2013 Microchip Technology Inc. FIGURE 14-7: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 FIGURE 14-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 FIGURE 14-9: SLOW RISE TIME (MCLR TIED TO VDD VIA RC NETWORK) TPWRT TOST VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset TPWRT TOST VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset 0V 1V 5V TPWRT TOST  2001-2013 Microchip Technology Inc. DS39582C-page 153 PIC16F87XA 14.11 Interrupts The PIC16F87XA family has up to 15 sources of interrupt. The Interrupt Control register (INTCON) records individual interrupt requests in flag bits. It also has individual and global interrupt enable bits. A global interrupt enable bit, GIE (INTCON<7>), enables (if set) all unmasked interrupts or disables (if cleared) all interrupts. When bit GIE is enabled and an interrupt’s flag bit and mask bit are set, the interrupt will vector immediately. Individual interrupts can be disabled through their corresponding enable bits in various registers. Individual interrupt bits are set regardless of the status of the GIE bit. The GIE bit is cleared on Reset. The “return from interrupt” instruction, RETFIE, exits the interrupt routine, as well as sets the GIE bit, which re-enables interrupts. The RB0/INT pin interrupt, the RB port change interrupt and the TMR0 overflow interrupt flags are contained in the INTCON register. The peripheral interrupt flags are contained in the Special Function Registers, PIR1 and PIR2. The corresponding interrupt enable bits are contained in Special Function Registers, PIE1 and PIE2, and the peripheral interrupt enable bit is contained in Special Function Register, INTCON. When an interrupt is responded to, the GIE bit is cleared to disable any further interrupt, the return address is pushed onto the stack and the PC is loaded with 0004h. Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid recursive interrupts. For external interrupt events, such as the INT pin or PORTB change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends when the interrupt event occurs. The latency is the same for one or two-cycle instructions. Individual interrupt flag bits are set regardless of the status of their corresponding mask bit, PEIE bit or GIE bit. FIGURE 14-10: INTERRUPT LOGIC Note: Individual interrupt flag bits are set regardless of the status of their corresponding mask bit or the GIE bit. PSPIF(1) PSPIE(1) ADIF ADIE RCIF RCIE TXIF TXIE SSPIF SSPIE TMR2IF TMR2IE TMR1IF TMR1IE TMR0IF TMR0IE INTF INTE RBIF RBIE GIE PEIE Wake-up (If in Sleep mode) Interrupt to CPU CCP2IE CCP2IF BCLIE BCLIF EEIF EEIE CCP1IF CCP1IE CMIE CMIF Note 1: PSP interrupt is implemented only on PIC16F874A/877A devices. PIC16F87XA DS39582C-page 154  2001-2013 Microchip Technology Inc. 14.11.1 INT INTERRUPT External interrupt on the RB0/INT pin is edge triggered, either rising if bit INTEDG (OPTION_REG<6>) is set or falling if the INTEDG bit is clear. When a valid edge appears on the RB0/INT pin, flag bit, INTF (INTCON<1>), is set. This interrupt can be disabled by clearing enable bit, INTE (INTCON<4>). Flag bit INTF must be cleared in software in the Interrupt Service Routine before re-enabling this interrupt. The INT interrupt can wake-up the processor from Sleep if bit INTE was set prior to going into Sleep. The status of global interrupt enable bit, GIE, decides whether or not the processor branches to the interrupt vector following wake-up. See Section 14.14 “Power-down Mode (Sleep)” for details on Sleep mode. 14.11.2 TMR0 INTERRUPT An overflow (FFh  00h) in the TMR0 register will set flag bit, TMR0IF (INTCON<2>). The interrupt can be enabled/disabled by setting/clearing enable bit, TMR0IE (INTCON<5>). See Section 5.0 “Timer0 Module”. 14.11.3 PORTB INTCON CHANGE An input change on PORTB<7:4> sets flag bit, RBIF (INTCON<0>). The interrupt can be enabled/disabled by setting/clearing enable bit, RBIE (INTCON<4>). See Section 4.2 “PORTB and the TRISB Register”. 14.12 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (i.e., W register and Status register). This will have to be implemented in software. For the PIC16F873A/874A devices, the register W_TEMP must be defined in both Banks 0 and 1 and must be defined at the same offset from the bank base address (i.e., If W_TEMP is defined at 0x20 in Bank 0, it must also be defined at 0xA0 in Bank 1). The registers, PCLATH_TEMP and STATUS_TEMP, are only defined in Bank 0. Since the upper 16 bytes of each bank are common in the PIC16F876A/877A devices, temporary holding registers, W_TEMP, STATUS_TEMP and PCLATH_TEMP, should be placed in here. These 16 locations don’t require banking and therefore, make it easier for context save and restore. The same code shown in Example 14-1 can be used. EXAMPLE 14-1: SAVING STATUS, W AND PCLATH REGISTERS IN RAM MOVWF W_TEMP ;Copy W to TEMP register SWAPF STATUS,W ;Swap status to be saved into W CLRF STATUS ;bank 0, regardless of current bank, Clears IRP,RP1,RP0 MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register MOVF PCLATH, W ;Only required if using pages 1, 2 and/or 3 MOVWF PCLATH_TEMP ;Save PCLATH into W CLRF PCLATH ;Page zero, regardless of current page : :(ISR) ;(Insert user code here) : MOVF PCLATH_TEMP, W ;Restore PCLATH MOVWF PCLATH ;Move W into PCLATH SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W ;(sets bank to original state) MOVWF STATUS ;Move W into STATUS register SWAPF W_TEMP,F ;Swap W_TEMP SWAPF W_TEMP,W ;Swap W_TEMP into W  2001-2013 Microchip Technology Inc. DS39582C-page 155 PIC16F87XA 14.13 Watchdog Timer (WDT) The Watchdog Timer is a free running, on-chip RC oscillator which does not require any external components. This RC oscillator is separate from the RC oscillator of the OSC1/CLKI pin. That means that the WDT will run even if the clock on the OSC1/CLKI and OSC2/CLKO pins of the device has been stopped, for example, by execution of a SLEEP instruction. During normal operation, a WDT time-out generates a device Reset (Watchdog Timer Reset). If the device is in Sleep mode, a WDT time-out causes the device to wake-up and continue with normal operation (Watchdog Timer Wake-up). The TO bit in the Status register will be cleared upon a Watchdog Timer time-out. The WDT can be permanently disabled by clearing configuration bit, WDTE (Section 14.1 “Configuration Bits”). WDT time-out period values may be found in Section 17.0 “Electrical Characteristics” under parameter #31. Values for the WDT prescaler (actually a postscaler but shared with the Timer0 prescaler) may be assigned using the OPTION_REG register. FIGURE 14-11: WATCHDOG TIMER BLOCK DIAGRAM TABLE 14-7: SUMMARY OF WATCHDOG TIMER REGISTERS Note 1: The CLRWDT and SLEEP instructions clear the WDT and the postscaler, if assigned to the WDT and prevent it from timing out and generating a device Reset condition. 2: When a CLRWDT instruction is executed and the prescaler is assigned to the WDT, the prescaler count will be cleared but the prescaler assignment is not changed. From TMR0 Clock Source (Figure 5-1) To TMR0 (Figure 5-1) Postscaler WDT Timer WDT Enable Bit 0 1 M U X PSA 8-to-1 MUX PS2:PS0 0 1 MUX PSA WDT Time-out 8 Note: PSA and PS2:PS0 are bits in the OPTION_REG register. Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 2007h Config. bits (1) BODEN(1) CP1 CP0 PWRTE(1) WDTE FOSC1 FOSC0 81h, 181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Legend: Shaded cells are not used by the Watchdog Timer. Note 1: See Register 14-1 for operation of these bits. PIC16F87XA DS39582C-page 156  2001-2013 Microchip Technology Inc. 14.14 Power-down Mode (Sleep) Power-down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the PD bit (Status<3>) is cleared, the TO (Status<4>) bit is set and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, low or high-impedance). For lowest current consumption in this mode, place all I/O pins at either VDD or VSS, ensure no external circuitry is drawing current from the I/O pin, powerdown the A/D and disable external clocks. Pull all I/O pins that are high-impedance inputs, high or low externally, to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pull-ups on PORTB should also be considered. The MCLR pin must be at a logic high level (VIHMC). 14.14.1 WAKE-UP FROM SLEEP The device can wake-up from Sleep through one of the following events: 1. External Reset input on MCLR pin. 2. Watchdog Timer wake-up (if WDT was enabled). 3. Interrupt from INT pin, RB port change or peripheral interrupt. External MCLR Reset will cause a device Reset. All other events are considered a continuation of program execution and cause a “wake-up”. The TO and PD bits in the Status register can be used to determine the cause of device Reset. The PD bit, which is set on power-up, is cleared when Sleep is invoked. The TO bit is cleared if a WDT time-out occurred and caused wake-up. The following peripheral interrupts can wake the device from Sleep: 1. PSP read or write (PIC16F874/877 only). 2. TMR1 interrupt. Timer1 must be operating as an asynchronous counter. 3. CCP Capture mode interrupt. 4. Special event trigger (Timer1 in Asynchronous mode using an external clock). 5. SSP (Start/Stop) bit detect interrupt. 6. SSP transmit or receive in Slave mode (SPI/I2C). 7. USART RX or TX (Synchronous Slave mode). 8. A/D conversion (when A/D clock source is RC). 9. EEPROM write operation completion. 10. Comparator output changes state. Other peripherals cannot generate interrupts since during Sleep, no on-chip clocks are present. When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction and then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. 14.14.2 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction, the SLEEP instruction will complete as a NOP. Therefore, the WDT and WDT postscaler will not be cleared, the TO bit will not be set and PD bits will not be cleared. • If the interrupt occurs during or after the execution of a SLEEP instruction, the device will immediately wake-up from Sleep. The SLEEP instruction will be completely executed before the wake-up. Therefore, the WDT and WDT postscaler will be cleared, the TO bit will be set and the PD bit will be cleared. Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. To ensure that the WDT is cleared, a CLRWDT instruction should be executed before a SLEEP instruction.  2001-2013 Microchip Technology Inc. DS39582C-page 157 PIC16F87XA FIGURE 14-12: WAKE-UP FROM SLEEP THROUGH INTERRUPT 14.15 In-Circuit Debugger When the DEBUG bit in the configuration word is programmed to a ‘0’, the in-circuit debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB® ICD. When the microcontroller has this feature enabled, some of the resources are not available for general use. Table 14-8 shows which features are consumed by the background debugger. TABLE 14-8: DEBUGGER RESOURCES To use the in-circuit debugger function of the microcontroller, the design must implement In-Circuit Serial Programming connections to MCLR/VPP, VDD, GND, RB7 and RB6. This will interface to the in-circuit debugger module available from Microchip or one of the third party development tool companies. 14.16 Program Verification/Code Protection If the code protection bit(s) have not been programmed, the on-chip program memory can be read out for verification purposes. 14.17 ID Locations Four memory locations (2000h-2003h) are designated as ID locations, where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution but are readable and writable during program/verify. It is recommended that only the 4 Least Significant bits of the ID location are used. Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKO(4) INT pin INTF Flag (INTCON<1>) GIE bit (INTCON<7>) INSTRUCTION FLOW PC Instruction Fetched Instruction Executed PC PC+1 PC+2 Inst(PC) = Sleep Inst(PC - 1) Inst(PC + 1) Sleep Processor in Sleep Interrupt Latency(2) Inst(PC + 2) Inst(PC + 1) Inst(0004h) Inst(0005h) Dummy cycle Inst(0004h) PC + 2 0004h 0005h Dummy cycle TOST(2) PC+2 Note 1: XT, HS or LP Oscillator mode assumed. 2: TOST = 1024 TOSC (drawing not to scale). This delay will not be there for RC Oscillator mode. 3: GIE = 1 assumed. In this case, after wake- up, the processor jumps to the interrupt routine. If GIE = 0, execution will continue in-line. 4: CLKO is not available in these oscillator modes but shown here for timing reference. I/O pins RB6, RB7 Stack 1 level Program Memory Address 0000h must be NOP Last 100h words Data Memory 0x070 (0x0F0, 0x170, 0x1F0) 0x1EB-0x1EF PIC16F87XA DS39582C-page 158  2001-2013 Microchip Technology Inc. 14.18 In-Circuit Serial Programming PIC16F87XA microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. When using ICSP, the part must be supplied at 4.5V to 5.5V if a bulk erase will be executed. This includes reprogramming of the code-protect, both from an on state to an off state. For all other cases of ICSP, the part may be programmed at the normal operating voltages. This means calibration values, unique user IDs or user code can be reprogrammed or added. For complete details of serial programming, please refer to the “PIC16F87XA Flash Memory Programming Specification” (DS39589). 14.19 Low-Voltage (Single-Supply) ICSP Programming The LVP bit of the configuration word enables lowvoltage ICSP programming. This mode allows the microcontroller to be programmed via ICSP using a VDD source in the operating voltage range. This only means that VPP does not have to be brought to VIHH but can instead be left at the normal operating voltage. In this mode, the RB3/PGM pin is dedicated to the programming function and ceases to be a general purpose I/O pin. During programming, VDD is applied to the MCLR pin. To enter Programming mode, VDD must be applied to the RB3/PGM provided the LVP bit is set. The LVP bit defaults to on (‘1’) from the factory. If Low-Voltage Programming mode is not used, the LVP bit can be programmed to a ‘0’ and RB3/PGM becomes a digital I/O pin. However, the LVP bit may only be programmed when programming is entered with VIHH on MCLR. The LVP bit can only be charged when using high voltage on MCLR. It should be noted, that once the LVP bit is programmed to ‘0’, only the High-Voltage Programming mode is available and only High-Voltage Programming mode can be used to program the device. When using low-voltage ICSP, the part must be supplied at 4.5V to 5.5V if a bulk erase will be executed. This includes reprogramming of the code-protect bits from an on state to an off state. For all other cases of low-voltage ICSP, the part may be programmed at the normal operating voltage. This means calibration values, unique user IDs or user code can be reprogrammed or added. Note 1: The High-Voltage Programming mode is always available, regardless of the state of the LVP bit, by applying VIHH to the MCLR pin. 2: While in Low-Voltage ICSP mode, the RB3 pin can no longer be used as a general purpose I/O pin. 3: When using Low-Voltage ICSP Programming (LVP) and the pull-ups on PORTB are enabled, bit 3 in the TRISB register must be cleared to disable the pull-up on RB3 and ensure the proper operation of the device. 4: RB3 should not be allowed to float if LVP is enabled. An external pull-down device should be used to default the device to normal operating mode. If RB3 floats high, the PIC16F87XA device will enter Programming mode. 5: LVP mode is enabled by default on all devices shipped from Microchip. It can be disabled by clearing the LVP bit in the CONFIG register. 6: Disabling LVP will provide maximum compatibility to other PIC16CXXX devices.  2001-2013 Microchip Technology Inc. DS39582C-page 159 PIC16F87XA 15.0 INSTRUCTION SET SUMMARY The PIC16 instruction set is highly orthogonal and is comprised of three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 14-bit word divided into an opcode which specifies the instruction type and one or more operands which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 15-1, while the various opcode fields are summarized in Table 15-1. Table 15-2 lists the instructions recognized by the MPASM™ Assembler. A complete description of each instruction is also available in the PIC® Mid-Range MCU Family Reference Manual (DS33023). For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator which selects the bit affected by the operation, while ‘f’ represents the address of the file in which the bit is located. For literal and control operations, ‘k’ represents an eight or eleven-bit constant or literal value One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 s. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles with the second cycle executed as a NOP. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. 15.1 READ-MODIFY-WRITE OPERATIONS Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. For example, a “CLRF PORTB” instruction will read PORTB, clear all the data bits, then write the result back to PORTB. This example would have the unintended result that the condition that sets the RBIF flag would be cleared. TABLE 15-1: OPCODE FIELD DESCRIPTIONS FIGURE 15-1: GENERAL FORMAT FOR INSTRUCTIONS Note: To maintain upward compatibility with future PIC16F87XA products, do not use the OPTION and TRIS instructions. Field Description f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don't care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-out bit PD Power-down bit Byte-oriented file register operations 13 8 7 6 0 d = 0 for destination W OPCODE d f (FILE #) d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 0 OPCODE b (BIT #) f (FILE #) b = 3-bit bit address f = 7-bit file register address Literal and control operations 13 8 7 0 OPCODE k (literal) k = 8-bit immediate value 13 11 10 0 OPCODE k (literal) k = 11-bit immediate value General CALL and GOTO instructions only PIC16F87XA DS39582C-page 160  2001-2013 Microchip Technology Inc. TABLE 15-2: PIC16F87XA INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode Status Affected Notes MSb LSb BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f - f, d f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff C,DC,Z Z Z Z Z Z Z Z Z C C C,DC,Z Z 1,2 1,2 2 1,2 1,2 1,2,3 1,2 1,2,3 1,2 1,2 1,2 1,2 1,2 1,2 1,2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 1,2 1,2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW k k k - k k k - k - - k k Add Literal and W AND Literal with W Call Subroutine Clear Watchdog Timer Go to Address Inclusive OR Literal with W Move Literal to W Return from Interrupt Return with Literal in W Return from Subroutine Go into Standby mode Subtract W from Literal Exclusive OR Literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk C,DC,Z Z TO,PD Z TO,PD C,DC,Z Z Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. 3: If Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Note: Additional information on the mid-range instruction set is available in the PIC® Mid-Range MCU Family Reference Manual (DS33023).  2001-2013 Microchip Technology Inc. DS39582C-page 161 PIC16F87XA 15.2 Instruction Descriptions ADDLW Add Literal and W Syntax: [ label ] ADDLW k Operands: 0  k  255 Operation: (W) + k  (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the eight-bit literal ‘k’ and the result is placed in the W register. ADDWF Add W and f Syntax: [ label ] ADDWF f,d Operands: 0  f  127 d  Operation: (W) + (f)  (destination) Status Affected: C, DC, Z Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ANDLW AND Literal with W Syntax: [ label ] ANDLW k Operands: 0  k  255 Operation: (W) .AND. (k)  (W) Status Affected: Z Description: The contents of W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. ANDWF AND W with f Syntax: [ label ] ANDWF f,d Operands: 0  f  127 d  Operation: (W) .AND. (f)  (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. BCF Bit Clear f Syntax: [ label ] BCF f,b Operands: 0  f  127 0  b  7 Operation: 0  (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [ label ] BSF f,b Operands: 0  f  127 0  b  7 Operation: 1  (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. BTFSS Bit Test f, Skip if Set Syntax: [ label ] BTFSS f,b Operands: 0  f  127 0  b < 7 Operation: skip if (f) = 1 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and a NOP is executed instead, making this a 2 TCY instruction. BTFSC Bit Test, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0  f  127 0  b  7 Operation: skip if (f) = 0 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is discarded and a NOP is executed instead, making this a 2 TCY instruction. PIC16F87XA DS39582C-page 162  2001-2013 Microchip Technology Inc. CALL Call Subroutine Syntax: [ label ] CALL k Operands: 0  k  2047 Operation: (PC)+ 1 TOS, k  PC<10:0>, (PCLATH<4:3>)  PC<12:11> Status Affected: None Description: Call Subroutine. First, return address (PC+1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF f Operands: 0  f  127 Operation: 00h  (f) 1  Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h  (W) 1  Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h  WDT 0  WDT prescaler, 1  TO 1  PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits, TO and PD, are set. COMF Complement f Syntax: [ label ] COMF f,d Operands: 0  f  127 d  [0,1] Operation: (f)  (destination) Status Affected: Z Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECF Decrement f Syntax: [ label ] DECF f,d Operands: 0  f  127 d  [0,1] Operation: (f) - 1  (destination) Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’.  2001-2013 Microchip Technology Inc. DS39582C-page 163 PIC16F87XA DECFSZ Decrement f, Skip if 0 Syntax: [ label ] DECFSZ f,d Operands: 0  f  127 d  [0,1] Operation: (f) - 1  (destination); skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a NOP is executed instead, making it a 2 TCY instruction. GOTO Unconditional Branch Syntax: [ label ] GOTO k Operands: 0  k  2047 Operation: k  PC<10:0> PCLATH<4:3>  PC<12:11> Status Affected: None Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. INCF Increment f Syntax: [ label ] INCF f,d Operands: 0  f  127 d  [0,1] Operation: (f) + 1  (destination) Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. INCFSZ Increment f, Skip if 0 Syntax: [ label ] INCFSZ f,d Operands: 0  f  127 d  [0,1] Operation: (f) + 1  (destination), skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, a NOP is executed instead, making it a 2 TCY instruction. IORLW Inclusive OR Literal with W Syntax: [ label ] IORLW k Operands: 0  k  255 Operation: (W) .OR. k  (W) Status Affected: Z Description: The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. IORWF Inclusive OR W with f Syntax: [ label ] IORWF f,d Operands: 0  f  127 d  [0,1] Operation: (W) .OR. (f)  (destination) Status Affected: Z Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. PIC16F87XA DS39582C-page 164  2001-2013 Microchip Technology Inc. RLF Rotate Left f through Carry Syntax: [ label ] RLF f,d Operands: 0  f  127 d  [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. RETURN Return from Subroutine Syntax: [ label ] RETURN Operands: None Operation: TOS  PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. RRF Rotate Right f through Carry Syntax: [ label ] RRF f,d Operands: 0  f  127 d  [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. C Register f C Register f SLEEP Syntax: [ label ] SLEEP Operands: None Operation: 00h  WDT, 0  WDT prescaler, 1  TO, 0  PD Status Affected: TO, PD Description: The power-down status bit, PD, is cleared. Time-out status bit, TO, is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. SUBLW Subtract W from Literal Syntax: [ label ] SUBLW k Operands: 0 k 255 Operation: k - (W) W) Status Affected: C, DC, Z Description: The W register is subtracted (2’s complement method) from the eight-bit literal ‘k’. The result is placed in the W register. SUBWF Subtract W from f Syntax: [ label ] SUBWF f,d Operands: 0 f 127 d  [0,1] Operation: (f) - (W) destination) Status Affected: C, DC, Z Description: Subtract (2’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’.  2001-2013 Microchip Technology Inc. DS39582C-page 165 PIC16F87XA SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0  f  127 d  [0,1] Operation: (f<3:0>)  (destination<7:4>), (f<7:4>)  (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. XORLW Exclusive OR Literal with W Syntax: [ label ] XORLW k Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. XORWF Exclusive OR W with f Syntax: [ label ] XORWF f,d Operands: 0  f  127 d  [0,1] Operation: (W) .XOR. (f) destination) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. PIC16F87XA DS39582C-page 166  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page167 PIC16F87XA 16.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C17 and MPLAB C18 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB C30 C Compiler - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator - MPLAB dsPIC30 Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PRO MATE® II Universal Device Programmer - PICSTART® Plus Development Programmer • Low Cost Demonstration Boards - PICDEMTM 1 Demonstration Board - PICDEM.netTM Demonstration Board - PICDEM 2 Plus Demonstration Board - PICDEM 3 Demonstration Board - PICDEM 4 Demonstration Board - PICDEM 17 Demonstration Board - PICDEM 18R Demonstration Board - PICDEM LIN Demonstration Board - PICDEM USB Demonstration Board • Evaluation Kits - KEELOQ® - PICDEM MSC - microID® - CAN - PowerSmart® - Analog 16.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® based application that contains: • An interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) • A full-featured editor with color coded context • A multiple project manager • Customizable data windows with direct edit of contents • High level source code debugging • Mouse over variable inspection • Extensive on-line help The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - source files (assembly or C) - absolute listing file (mixed assembly and C) - machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increasing flexibility and power. 16.2 MPASM Assembler The MPASM assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM assembler generates relocatable object files for the MPLINK object linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM assembler features include: • Integration into MPLAB IDE projects • User defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process PIC16F87XA DS39582C-page 168  2001-2013 Microchip Technology Inc. 16.3 MPLAB C17 and MPLAB C18 C Compilers The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI C compilers for Microchip’s PIC17CXXX and PIC18CXXX family of microcontrollers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 16.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB object librarian manages the creation and modification of library files of pre-compiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 16.5 MPLAB C30 C Compiler The MPLAB C30 C compiler is a full-featured, ANSI compliant, optimizing compiler that translates standard ANSI C programs into dsPIC30F assembly language source. The compiler also supports many commandline options and language extensions to take full advantage of the dsPIC30F device hardware capabilities, and afford fine control of the compiler code generator. MPLAB C30 is distributed with a complete ANSI C standard library. All library functions have been validated and conform to the ANSI C library standard. The library includes functions for string manipulation, dynamic memory allocation, data conversion, timekeeping, and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic information for high level source debugging with the MPLAB IDE. 16.6 MPLAB ASM30 Assembler, Linker, and Librarian MPLAB ASM30 assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 compiler uses the assembler to produce it’s object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire dsPIC30F instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility 16.7 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the PIC series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until Break, or Trace mode. The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and MPLAB C18 C Compilers, as well as the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 16.8 MPLAB SIM30 Software Simulator The MPLAB SIM30 software simulator allows code development in a PC hosted environment by simulating the dsPIC30F series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any of the pins. The MPLAB SIM30 simulator fully supports symbolic debugging using the MPLAB C30 C Compiler and MPLAB ASM30 assembler. The simulator runs in either a Command Line mode for automated tasks, or from MPLAB IDE. This high speed simulator is designed to debug, analyze and optimize time intensive DSP routines.  2001-2013 Microchip Technology Inc. DS39582C-page169 PIC16F87XA 16.9 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator The MPLAB ICE 2000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 in-circuit emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 16.10 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator The MPLAB ICE 4000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for highend PIC microcontrollers. Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICD 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, up to 2 Mb of emulation memory, and the ability to view variables in real-time. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 16.11 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC microcontrollers. The MPLAB ICD 2 utilizes the incircuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers cost effective in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, singlestepping and watching variables, CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real-time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 16.12 PRO MATE II Universal Device Programmer The PRO MATE II is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features an LCD display for instructions and error messages and a modular detachable socket assembly to support various package types. In Stand-Alone mode, the PRO MATE II device programmer can read, verify, and program PIC devices without a PC connection. It can also set code protection in this mode. 16.13 PICSTART Plus Development Programmer The PICSTART Plus development programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus development programmer supports most PIC devices up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant. PIC16F87XA DS39582C-page 170  2001-2013 Microchip Technology Inc. 16.14 PICDEM 1 PIC MCU Demonstration Board The PICDEM 1 demonstration board demonstrates the capabilities of the PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The sample microcontrollers provided with the PICDEM 1 demonstration board can be programmed with a PRO MATE II device programmer, or a PICSTART Plus development programmer. The PICDEM 1 demonstration board can be connected to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232 interface, a potentiometer for simulated analog input, push button switches and eight LEDs. 16.15 PICDEM.net Internet/Ethernet Demonstration Board The PICDEM.net demonstration board is an Internet/ Ethernet demonstration board using the PIC18F452 microcontroller and TCP/IP firmware. The board supports any 40-pin DIP device that conforms to the standard pinout used by the PIC16F877 or PIC18C452. This kit features a user friendly TCP/IP stack, web server with HTML, a 24L256 Serial EEPROM for Xmodem download to web pages into Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface, and a 16 x 2 LCD display. Also included is the book and CD-ROM “TCP/IP Lean, Web Servers for Embedded Systems,” by Jeremy Bentham. 16.16 PICDEM 2 Plus Demonstration Board The PICDEM 2 Plus demonstration board supports many 18-, 28-, and 40-pin microcontrollers, including PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers provided with the PICDEM 2 demonstration board can be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or MPLAB ICD 2 with a Universal Programmer Adapter. The MPLAB ICD 2 and MPLAB ICE in-circuit emulators may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area extends the circuitry for additional application components. Some of the features include an RS-232 interface, a 2 x 16 LCD display, a piezo speaker, an on-board temperature sensor, four LEDs, and sample PIC18F452 and PIC16F877 Flash microcontrollers. 16.17 PICDEM 3 PIC16C92X Demonstration Board The PICDEM 3 demonstration board supports the PIC16C923 and PIC16C924 in the PLCC package. All the necessary hardware and software is included to run the demonstration programs. 16.18 PICDEM 4 8/14/18-Pin Demonstration Board The PICDEM 4 can be used to demonstrate the capabilities of the 8, 14, and 18-pin PIC16XXXX and PIC18XXXX MCUs, including the PIC16F818/819, PIC16F87/88, PIC16F62XA and the PIC18F1320 family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts, including LIN and Motor Control using ECCP. Special provisions are made for low power operation with the supercapacitor circuit, and jumpers allow on-board hardware to be disabled to eliminate current draw in this mode. Included on the demo board are provisions for Crystal, RC or Canned Oscillator modes, a five volt regulator for use with a nine volt wall adapter or battery, DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2, 2x16 liquid crystal display, PCB footprints for H-Bridge motor driver, LIN transceiver and EEPROM. Also included are: header for expansion, eight LEDs, four potentiometers, three push buttons and a prototyping area. Included with the kit is a PIC16F627A and a PIC18F1320. Tutorial firmware is included along with the User’s Guide. 16.19 PICDEM 17 Demonstration Board The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user tailored application development. The PICDEM 17 demonstration board supports program download and execution from external on-board Flash memory. A generous prototype area is available for user hardware expansion.  2001-2013 Microchip Technology Inc. DS39582C-page171 PIC16F87XA 16.20 PICDEM 18R PIC18C601/801 Demonstration Board The PICDEM 18R demonstration board serves to assist development of the PIC18C601/801 family of Microchip microcontrollers. It provides hardware implementation of both 8-bit Multiplexed/Demultiplexed and 16-bit Memory modes. The board includes 2 Mb external Flash memory and 128 Kb SRAM memory, as well as serial EEPROM, allowing access to the wide range of memory types supported by the PIC18C601/801. 16.21 PICDEM LIN PIC16C43X Demonstration Board The powerful LIN hardware and software kit includes a series of boards and three PIC microcontrollers. The small footprint PIC16C432 and PIC16C433 are used as slaves in the LIN communication and feature onboard LIN transceivers. A PIC16F874 Flash microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus communication. 16.22 PICkitTM 1 Flash Starter Kit A complete “development system in a box”, the PICkit Flash Starter Kit includes a convenient multi-section board for programming, evaluation and development of 8/14-pin Flash PIC® microcontrollers. Powered via USB, the board operates under a simple Windows GUI. The PICkit 1 Starter Kit includes the user's guide (on CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB® IDE (Integrated Development Environment) software, software and hardware “Tips 'n Tricks for 8-pin Flash PIC® Microcontrollers” Handbook and a USB Interface Cable. Supports all current 8/14-pin Flash PIC microcontrollers, as well as many future planned devices. 16.23 PICDEM USB PIC16C7X5 Demonstration Board The PICDEM USB Demonstration Board shows off the capabilities of the PIC16C745 and PIC16C765 USB microcontrollers. This board provides the basis for future USB products. 16.24 Evaluation and Programming Tools In addition to the PICDEM series of circuits, Microchip has a line of evaluation kits and demonstration software for these products. • KEELOQ evaluation and programming tools for Microchip’s HCS Secure Data Products • CAN developers kit for automotive network applications • Analog design boards and filter design software • PowerSmart battery charging evaluation/ calibration kits • IrDA® development kit • microID development and rfLabTM development software • SEEVAL® designer kit for memory evaluation and endurance calculations • PICDEM MSC demo boards for Switching mode power supply, high power IR driver, delta sigma ADC, and flow rate sensor Check the Microchip web page and the latest Product Line Card for the complete list of demonstration and evaluation kits. PIC16F87XA DS39582C-page 172  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 173 PIC16F87XA 17.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Ambient temperature under bias.................................................................................................................-55 to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD, MCLR. and RA4) ......................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ............................................................................................................ -0.3 to +7.5V Voltage on MCLR with respect to VSS (Note 2) .................................................................................................0 to +14V Voltage on RA4 with respect to Vss..................................................................................................................0 to +8.5V Total power dissipation (Note 1) ...............................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD) 20 mA Output clamp current, IOK (VO < 0 or VO > VDD)  20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by PORTA, PORTB and PORTE (combined) (Note 3)....................................................200 mA Maximum current sourced by PORTA, PORTB and PORTE (combined) (Note 3)...............................................200 mA Maximum current sunk by PORTC and PORTD (combined) (Note 3) .................................................................200 mA Maximum current sourced by PORTC and PORTD (combined) (Note 3) ............................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD -  IOH} +  {(VDD - VOH) x IOH} + (VOl x IOL) 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR pin rather than pulling this pin directly to VSS. 3: PORTD and PORTE are not implemented on PIC16F873A/876A devices. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIC16F87XA DS39582C-page 174  2001-2013 Microchip Technology Inc. FIGURE 17-1: PIC16F87XA VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL, EXTENDED) FIGURE 17-2: PIC16LF87XA VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) Frequency Voltage 6.0V 5.5V 4.5V 4.0V 2.0V 20 MHz 5.0V 3.5V 3.0V 2.5V PIC16F87XA Frequency Voltage 6.0V 5.5V 4.5V 4.0V 2.0V 5.0V 3.5V 3.0V 2.5V FMAX = (6.0 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz Note 1: VDDAPPMIN is the minimum voltage of the PIC® device in the application. 4 MHz 10 MHz Note 2: FMAX has a maximum frequency of 10 MHz. PIC16LF87XA  2001-2013 Microchip Technology Inc. DS39582C-page 175 PIC16F87XA 17.1 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial, Extended) PIC16LF873A/874A/876A/877A (Industrial) PIC16LF873A/874A/876A/877A (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC16F873A/874A/876A/877A (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Symbol Characteristic/ Device Min Typ† Max Units Conditions VDD Supply Voltage D001 16LF87XA 2.0 — 5.5 V All configurations (DC to 10 MHz) D001 16F87XA 4.0 — 5.5 V All configurations D001A VBOR 5.5 V BOR enabled, FMAX = 14 MHz(7) D002 VDR RAM Data Retention Voltage(1) — 1.5 — V D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — V See Section 14.5 “Power-on Reset (POR)” for details D004 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms See Section 14.5 “Power-on Reset (POR)” for details D005 VBOR Brown-out Reset Voltage 3.65 4.0 4.35 V BODEN bit in configuration word enabled Legend: Rows with standard voltage device data only are shaded for improved readability. † Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS. 4: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k. 5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for design guidance only. This is not tested. 6: The  current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached. PIC16F87XA DS39582C-page 176  2001-2013 Microchip Technology Inc. IDD Supply Current(2,5) D010 16LF87XA — 0.6 2.0 mA XT, RC osc configurations, FOSC = 4 MHz, VDD = 3.0V D010 16F87XA — 1.6 4 mA XT, RC osc configurations, FOSC = 4 MHz, VDD = 5.5V D010A 16LF87XA — 20 35 A LP osc configuration, FOSC = 32 kHz, VDD = 3.0V, WDT disabled D013 16F87XA — 7 15 mA HS osc configuration, FOSC = 20 MHz, VDD = 5.5V D015 IBOR Brown-out Reset Current(6) — 85 200 A BOR enabled, VDD = 5.0V 17.1 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial, Extended) PIC16LF873A/874A/876A/877A (Industrial) (Continued) PIC16LF873A/874A/876A/877A (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC16F873A/874A/876A/877A (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Symbol Characteristic/ Device Min Typ† Max Units Conditions Legend: Rows with standard voltage device data only are shaded for improved readability. † Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS. 4: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k. 5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for design guidance only. This is not tested. 6: The  current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.  2001-2013 Microchip Technology Inc. DS39582C-page 177 PIC16F87XA IPD Power-down Current(3,5) D020 16LF87XA — 7.5 30 A VDD = 3.0V, WDT enabled, -40C to +85C D020 16F87XA — 10.5 42 60 A A VDD = 4.0V, WDT enabled, -40C to +85C VDD = 4.0V, WDT enabled, -40C to +125C (extended) D021 16LF87XA — 0.9 5 A VDD = 3.0V, WDT disabled, 0C to +70C D021 16F87XA — 1.5 16 20 A A VDD = 4.0V, WDT disabled, -40C to +85C VDD = 4.0V, WDT disabled, -40C to +125C (extended) D021A 16LF87XA 0.9 5 A VDD = 3.0V, WDT disabled, -40C to +85C D021A 16F87XA 1.5 19 A VDD = 4.0V, WDT disabled, -40C to +85C D023 IBOR Brown-out Reset Current(6) — 85 200 A BOR enabled, VDD = 5.0V 17.1 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial, Extended) PIC16LF873A/874A/876A/877A (Industrial) (Continued) PIC16LF873A/874A/876A/877A (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC16F873A/874A/876A/877A (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Symbol Characteristic/ Device Min Typ† Max Units Conditions Legend: Rows with standard voltage device data only are shaded for improved readability. † Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS. 4: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k. 5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for design guidance only. This is not tested. 6: The  current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached. PIC16F87XA DS39582C-page 178  2001-2013 Microchip Technology Inc. 17.2 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial, Extended) PIC16LF873A/874A/876A/877A (Industrial) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Operating voltage VDD range as described in DC specification (Section 17.1) Param No. Sym Characteristic Min Typ† Max Units Conditions VIL Input Low Voltage I/O ports: D030 with TTL buffer VSS — 0.15 VDD V For entire VDD range D030A VSS — 0.8V V 4.5V  VDD 5.5V D031 with Schmitt Trigger buffer VSS — 0.2 VDD V D032 MCLR, OSC1 (in RC mode) VSS — 0.2 VDD V D033 OSC1 (in XT and LP modes) VSS — 0.3V V (Note 1) OSC1 (in HS mode) VSS — 0.3 VDD V Ports RC3 and RC4: — D034 with Schmitt Trigger buffer VSS — 0.3 VDD V For entire VDD range D034A with SMBus -0.5 — 0.6 V For VDD = 4.5 to 5.5V VIH Input High Voltage I/O ports: — D040 with TTL buffer 2.0 — VDD V 4.5V  VDD 5.5V D040A 0.25 VDD + 0.8V — VDD V For entire VDD range D041 with Schmitt Trigger buffer 0.8 VDD — VDD V For entire VDD range D042 MCLR 0.8 VDD — VDD V D042A OSC1 (in XT and LP modes) 1.6V — VDD V (Note 1) OSC1 (in HS mode) 0.7 VDD — VDD V D043 OSC1 (in RC mode) 0.9 VDD — VDD V Ports RC3 and RC4: D044 with Schmitt Trigger buffer 0.7 VDD — VDD V For entire VDD range D044A with SMBus 1.4 — 5.5 V For VDD = 4.5 to 5.5V D070 IPURB PORTB Weak Pull-up Current 50 250 400 A VDD = 5V, VPIN = VSS, -40°C TO +85°C IIL Input Leakage Current(2, 3) D060 I/O ports — — 1 A VSS VPIN VDD, pin at high-impedance D061 MCLR, RA4/T0CKI — — 5 A VSS VPIN VDD D063 OSC1 — — 5 A VSS VPIN VDD, XT, HS and LP osc configuration * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC16F87XA be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin.  2001-2013 Microchip Technology Inc. DS39582C-page 179 PIC16F87XA VOL Output Low Voltage D080 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40C to +85C D083 OSC2/CLKO (RC osc config) — — 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C VOH Output High Voltage D090 I/O ports(3) VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C D092 OSC2/CLKO (RC osc config) VDD – 0.7 — — V IOH = -1.3 mA, VDD = 4.5V, -40C to +85C D150* VOD Open-Drain High Voltage — — 8.5 V RA4 pin Capacitive Loading Specs on Output Pins D100 COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101 D102 CIO CB All I/O pins and OSC2 (RC mode) SCL, SDA (I2C mode) — — — — 50 400 pF pF Data EEPROM Memory D120 ED Endurance 100K 1M — E/W -40C to +85C D121 VDRW VDD for read/write VMIN — 5.5 V Using EECON to read/write, VMIN = min. operating voltage D122 TDEW Erase/write cycle time — 4 8 ms Program Flash Memory D130 EP Endurance 10K 100K — E/W -40C to +85C D131 VPR VDD for read VMIN — 5.5 V VMIN = min. operating voltage D132A VDD for erase/write VMIN — 5.5 V Using EECON to read/write, VMIN = min. operating voltage D133 TPEW Erase/Write cycle time — 4 8 ms 17.2 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial, Extended) PIC16LF873A/874A/876A/877A (Industrial) (Continued) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Operating voltage VDD range as described in DC specification (Section 17.1) Param No. Sym Characteristic Min Typ† Max Units Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC16F87XA be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. PIC16F87XA DS39582C-page 180  2001-2013 Microchip Technology Inc. TABLE 17-1: COMPARATOR SPECIFICATIONS TABLE 17-2: VOLTAGE REFERENCE SPECIFICATIONS Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated) 4.0V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated) Param No. Sym Characteristics Min Typ Max Units Comments D300 VIOFF Input Offset Voltage — ± 5.0 ± 10 mV D301 VICM Input Common Mode Voltage* 0 - VDD – 1.5 V D302 CMRR Common Mode Rejection Ratio* 55 - — dB 300 300A TRESP Response Time*(1) — 150 400 600 ns ns PIC16F87XA PIC16LF87XA 301 TMC2OV Comparator Mode Change to Output Valid* — — 10 s * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD – 1.5)/2 while the other input transitions from VSS to VDD. Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated) 4.0V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated) Spec No. Sym Characteristics Min Typ Max Units Comments D310 VRES Resolution VDD/24 — VDD/32 LSb D311 VRAA Absolute Accuracy — — — — 1/2 1/2 LSb LSb Low Range (VRR = 1) High Range (VRR = 0) D312 VRUR Unit Resistor Value (R)* — 2k —  310 TSET Settling Time*(1) — — 10 s * These parameters are characterized but not tested. Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from ‘0000’ to ‘1111’.  2001-2013 Microchip Technology Inc. DS39582C-page 181 PIC16F87XA 17.3 Timing Parameter Symbology The timing parameter symbols have been created following one of the following formats: FIGURE 17-3: LOAD CONDITIONS 1. TppS2ppS 3. TCC:ST (I2C specifications only) 2. TppS 4. Ts (I2C specifications only) T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKO rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O port t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance I 2C only AA output access High High BUF Bus free Low Low TCC:ST (I2C specifications only) CC HD Hold SU Setup ST DAT Data input hold STO Stop condition STA Start condition VDD/2 CL RL Pin Pin VSS VSS CL RL = 464 CL = 50 pF for all pins except OSC2, but including PORTD and PORTE outputs as ports, 15 pF for OSC2 output Note: PORTD and PORTE are not implemented on PIC16F873A/876A devices. Load Condition 1 Load Condition 2 PIC16F87XA DS39582C-page 182  2001-2013 Microchip Technology Inc. FIGURE 17-4: EXTERNAL CLOCK TIMING OSC1 CLKO Q4 Q1 Q2 Q3 Q4 Q1 1 2 3 3 4 4 TABLE 17-3: EXTERNAL CLOCK TIMING REQUIREMENTS Param No. Symbol Characteristic Min Typ† Max Units Conditions FOSC External CLKI Frequency (Note 1) DC — 1 MHz XT and RC Osc mode DC — 20 MHz HS Osc mode DC — 32 kHz LP Osc mode Oscillator Frequency (Note 1) DC — 4 MHz RC Osc mode 0.1 — 4 MHz XT Osc mode 4 5 — — 20 200 MHz kHz HS Osc mode LP Osc mode 1 TOSC External CLKI Period (Note 1) 1000 — — ns XT and RC Osc mode 50 — — ns HS Osc mode 5—— s LP Osc mode Oscillator Period (Note 1) 250 — — ns RC Osc mode 250 — 1 s XT Osc mode 100 — 250 ns HS Osc mode 50 — 250 ns HS Osc mode 31.25 — — s LP Osc mode 2 TCY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC 3 TOSL, TOSH External Clock in (OSC1) High or Low Time 100 — — ns XT oscillator 2.5 — — s LP oscillator 15 — — ns HS oscillator 4 TOSR, TOSF External Clock in (OSC1) Rise or Fall Time — — 25 ns XT oscillator — — 50 ns LP oscillator — — 15 ns HS oscillator † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type, under standard operating conditions, with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.  2001-2013 Microchip Technology Inc. DS39582C-page 183 PIC16F87XA FIGURE 17-5: CLKO AND I/O TIMING TABLE 17-4: CLKO AND I/O TIMING REQUIREMENTS Note: Refer to Figure 17-3 for load conditions. OSC1 CLKO I/O pin (Input) I/O pin (Output) Q4 Q1 Q2 Q3 10 13 14 17 20, 21 19 18 15 11 12 16 Old Value New Value Param No. Symbol Characteristic Min Typ† Max Units Conditions 10* TOSH2CKL OSC1  to CLKO  — 75 200 ns (Note 1) 11* TOSH2CKH OSC1  to CLKO  — 75 200 ns (Note 1) 12* TCKR CLKO Rise Time — 35 100 ns (Note 1) 13* TCKF CLKO Fall Time — 35 100 ns (Note 1) 14* TCKL2IOV CLKO  to Port Out Valid — — 0.5 TCY + 20 ns (Note 1) 15* TIOV2CKH Port In Valid before CLKO  TOSC + 200 — — ns (Note 1) 16* TCKH2IOI Port In Hold after CLKO  0 — — ns (Note 1) 17* TOSH2IOV OSC1  (Q1 cycle) to Port Out Valid — 100 255 ns 18* TOSH2IOI OSC1  (Q2 cycle) to Port Input Invalid (I/O in hold time) Standard (F) 100 — — ns Extended (LF) 200 — — ns 19* TIOV2OSH Port Input Valid to OSC1 (I/O in setup time) 0 — — ns 20* TIOR Port Output Rise Time Standard (F) — 10 40 ns Extended (LF) — — 145 ns 21* TIOF Port Output Fall Time Standard (F) — 10 40 ns Extended (LF) — — 145 ns 22††* TINP INT pin High or Low Time TCY — — ns 23††* TRBP RB7:RB4 Change INT High or Low Time TCY — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. †† These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in RC mode where CLKO output is 4 x TOSC. PIC16F87XA DS39582C-page 184  2001-2013 Microchip Technology Inc. FIGURE 17-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING FIGURE 17-7: BROWN-OUT RESET TIMING TABLE 17-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET REQUIREMENTS VDD MCLR Internal POR PWRT Time-out OSC Time-out Internal Reset Watchdog Timer Reset 33 32 30 31 34 I/O pins 34 Note: Refer to Figure 17-3 for load conditions. VDD VBOR 35 Param No. Symbol Characteristic Min Typ† Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 — — s VDD = 5V, -40°C to +85°C 31* TWDT Watchdog Timer Time-out Period (no prescaler) 7 18 33 ms VDD = 5V, -40°C to +85°C 32 TOST Oscillation Start-up Timer Period — 1024 TOSC — —TOSC = OSC1 period 33* TPWRT Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +85°C 34 TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset — — 2.1 s 35 TBOR Brown-out Reset Pulse Width 100 — — s VDD  VBOR (D005) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.  2001-2013 Microchip Technology Inc. DS39582C-page 185 PIC16F87XA FIGURE 17-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS TABLE 17-6: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Param No. Symbol Characteristic Min Typ† Max Units Conditions 40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns Must also meet With Prescaler 10 — — ns parameter 42 41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns Must also meet With Prescaler 10 — — ns parameter 42 42* TT0P T0CKI Period No Prescaler TCY + 40 — — ns With Prescaler Greater of: 20 or TCY + 40 N — — ns N = prescale value (2, 4,..., 256) 45* TT1H T1CKI High Time Synchronous, Prescaler = 1 0.5 TCY + 20 — — ns Must also meet Synchronous, parameter 47 Prescaler = 2, 4, 8 Standard(F) 15 — — ns Extended(LF) 25 — — ns Asynchronous Standard(F) 30 — — ns Extended(LF) 50 — — ns 46* TT1L T1CKI Low Time Synchronous, Prescaler = 1 0.5 TCY + 20 — — ns Must also meet Synchronous, parameter 47 Prescaler = 2, 4, 8 Standard(F) 15 — — ns Extended(LF) 25 — — ns Asynchronous Standard(F) 30 — — ns Extended(LF) 50 — — ns 47* TT1P T1CKI Input Period Synchronous Standard(F) Greater of: 30 or TCY + 40 N — — ns N = prescale value (1, 2, 4, 8) Extended(LF) Greater of: 50 or TCY + 40 N N = prescale value (1, 2, 4, 8) Asynchronous Standard(F) 60 — — ns Extended(LF) 100 — — ns FT1 Timer1 Oscillator Input Frequency Range (oscillator enabled by setting bit T1OSCEN) DC — 200 kHz 48 TCKEZTMR1 Delay from External Clock Edge to Timer Increment 2 TOSC — 7 TOSC — * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: Refer to Figure 17-3 for load conditions. 46 47 45 48 41 42 40 RA4/T0CKI RC0/T1OSO/T1CKI TMR0 or TMR1 PIC16F87XA DS39582C-page 186  2001-2013 Microchip Technology Inc. FIGURE 17-9: CAPTURE/COMPARE/PWM TIMINGS (CCP1 AND CCP2) TABLE 17-7: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1 AND CCP2) Note: Refer to Figure 17-3 for load conditions. and RC2/CCP1 (Capture Mode) 50 51 52 53 54 RC1/T1OSI/CCP2 and RC2/CCP1 (Compare or PWM Mode) RC1/T1OSI/CCP2 Param No. Symbol Characteristic Min Typ† Max Units Conditions 50* TCCL CCP1 and CCP2 Input Low Time No Prescaler 0.5 TCY + 20 — — ns With Prescaler Standard(F) 10 — — ns Extended(LF) 20 — — ns 51* TCCH CCP1 and CCP2 Input High Time No Prescaler 0.5 TCY + 20 — — ns With Prescaler Standard(F) 10 — — ns Extended(LF) 20 — — ns 52* TCCP CCP1 and CCP2 Input Period 3 TCY + 40 N — — ns N = prescale value (1, 4 or 16) 53* TCCR CCP1 and CCP2 Output Rise Time Standard(F) — 10 25 ns Extended(LF) — 25 50 ns 54* TCCF CCP1 and CCP2 Output Fall Time Standard(F) — 10 25 ns Extended(LF) — 25 45 ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.  2001-2013 Microchip Technology Inc. DS39582C-page 187 PIC16F87XA FIGURE 17-10: PARALLEL SLAVE PORT TIMING (PIC16F874A/877A ONLY) TABLE 17-8: PARALLEL SLAVE PORT REQUIREMENTS (PIC16F874A/877A ONLY) Note: Refer to Figure 17-3 for load conditions. RE2/CS RE0/RD RE1/WR RD7:RD0 62 63 64 65 Param No. Symbol Characteristic Min Typ† Max Units Conditions 62 TDTV2WRH Data In Valid before WR  or CS  (setup time) 20 — — ns 63* TWRH2DTI WR  or CS  to Data–in Invalid (hold time) Standard(F) 20 — — ns Extended(LF) 35 — — ns 64 TRDL2DTV RD  and CS  to Data–out Valid — — 80 ns 65 TRDH2DTI RD  or CS  to Data–out Invalid 10 — 30 ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. PIC16F87XA DS39582C-page 188  2001-2013 Microchip Technology Inc. FIGURE 17-11: SPI MASTER MODE TIMING (CKE = 0, SMP = 0) FIGURE 17-12: SPI MASTER MODE TIMING (CKE = 1, SMP = 1) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 70 71 72 73 74 75, 76 79 78 80 78 79 MSb LSb Bit 6 - - - - - -1 MSb In Bit 6 - - - -1 LSb In Note: Refer to Figure 17-3 for load conditions. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 81 71 72 74 75, 76 78 80 MSb 79 73 MSb In Bit 6 - - - - - -1 Bit 6 - - - -1 LSb In LSb Note: Refer to Figure 17-3 for load conditions.  2001-2013 Microchip Technology Inc. DS39582C-page 189 PIC16F87XA FIGURE 17-13: SPI SLAVE MODE TIMING (CKE = 0) FIGURE 17-14: SPI SLAVE MODE TIMING (CKE = 1) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 70 71 72 73 74 75, 76 77 79 78 80 78 79 SDI MSb LSb Bit 6 - - - - - -1 MSb In Bit 6 - - - -1 LSb In 83 Note: Refer to Figure 17-3 for load conditions. SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 70 71 72 82 74 75, 76 MSb Bit 6 - - - - - -1 LSb 77 MSb In Bit 6 - - - -1 LSb In 80 83 Note: Refer to Figure 17-3 for load conditions. PIC16F87XA DS39582C-page 190  2001-2013 Microchip Technology Inc. TABLE 17-9: SPI MODE REQUIREMENTS FIGURE 17-15: I2C BUS START/STOP BITS TIMING Param No. Symbol Characteristic Min Typ† Max Units Conditions 70* TSSL2SCH, TSSL2SCL SS  to SCK  or SCK  Input TCY — — ns 71* TSCH SCK Input High Time (Slave mode) TCY + 20 — — ns 72* TSCL SCK Input Low Time (Slave mode) TCY + 20 — — ns 73* TDIV2SCH, TDIV2SCL Setup Time of SDI Data Input to SCK Edge 100 — — ns 74* TSCH2DIL, TSCL2DIL Hold Time of SDI Data Input to SCK Edge 100 — — ns 75* TDOR SDO Data Output Rise Time Standard(F) Extended(LF) — — 10 25 25 50 ns ns 76* TDOF SDO Data Output Fall Time — 10 25 ns 77* TSSH2DOZ SS  to SDO Output High-Impedance 10 — 50 ns 78* TSCR SCK Output Rise Time (Master mode) Standard(F) Extended(LF) — — 10 25 25 50 ns ns 79* TSCF SCK Output Fall Time (Master mode) — 10 25 ns 80* TSCH2DOV, TSCL2DOV SDO Data Output Valid after SCK Edge Standard(F) Extended(LF) — — — — 50 145 ns 81* TDOV2SCH, TDOV2SCL SDO Data Output Setup to SCK Edge TCY — — ns 82* TSSL2DOV SDO Data Output Valid after SS  Edge — — 50 ns 83* TSCH2SSH, TSCL2SSH SS after SCK Edge 1.5 TCY + 40 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: Refer to Figure 17-3 for load conditions. 91 93 SCL SDA Start Condition Stop Condition 90 92  2001-2013 Microchip Technology Inc. DS39582C-page 191 PIC16F87XA TABLE 17-10: I2C BUS START/STOP BITS REQUIREMENTS FIGURE 17-16: I2C BUS DATA TIMING Param No. Symbol Characteristic Min Typ Max Units Conditions 90 TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for Repeated Start condition Setup time 400 kHz mode 600 — — 91 THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first clock pulse is generated Hold time 400 kHz mode 600 — — 92 TSU:STO Stop condition 100 kHz mode 4700 — — ns Setup time 400 kHz mode 600 — — 93 THD:STO Stop condition 100 kHz mode 4000 — — ns Hold time 400 kHz mode 600 — — Note: Refer to Figure 17-3 for load conditions. 90 91 92 100 101 103 106 107 109 109 110 102 SCL SDA In SDA Out PIC16F87XA DS39582C-page 192  2001-2013 Microchip Technology Inc. TABLE 17-11: I2C BUS DATA REQUIREMENTS Param No. Sym Characteristic Min Max Units Conditions 100 THIGH Clock High Time 100 kHz mode 4.0 — s 400 kHz mode 0.6 — s SSP Module 0.5 TCY — 101 TLOW Clock Low Time 100 kHz mode 4.7 — s 400 kHz mode 1.3 — s SSP Module 0.5 TCY — 102 TR SDA and SCL Rise Time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns Cb is specified to be from 10 to 400 pF 103 TF SDA and SCL Fall Time 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF 90 TSU:STA Start Condition Setup Time 100 kHz mode 4.7 — s Only relevant for Repeated Start condition 400 kHz mode 0.6 — s 91 THD:STA Start Condition Hold Time 100 kHz mode 4.0 — s After this period, the first clock pulse is generated 400 kHz mode 0.6 — s 106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 s 107 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns (Note 2) 400 kHz mode 100 — ns 92 TSU:STO Stop Condition Setup Time 100 kHz mode 4.7 — s 400 kHz mode 0.6 — s 109 TAA Output Valid from Clock 100 kHz mode — 3500 ns (Note 1) 400 kHz mode — — ns 110 TBUF Bus Free Time 100 kHz mode 4.7 — s Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — s CB Bus Capacitive Loading — 400 pF Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A fast mode (400 kHz) I2C bus device can be used in a standard mode (100 kHz) I2C bus system, but the requirement that, TSU:DAT  250 ns, must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, TR MAX. + TSU:DAT = 1000 + 250 = 1250 ns (according to the standard mode I2C bus specification), before the SCL line is released.  2001-2013 Microchip Technology Inc. DS39582C-page 193 PIC16F87XA FIGURE 17-17: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING TABLE 17-12: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS FIGURE 17-18: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING TABLE 17-13: USART SYNCHRONOUS RECEIVE REQUIREMENTS Note: Refer to Figure 17-3 for load conditions. 121 121 122 RC6/TX/CK RC7/RX/DT pin pin 120 Param No. Symbol Characteristic Min Typ† Max Units Conditions 120 TCKH2DTV SYNC XMIT (MASTER & SLAVE) Clock High to Data Out Valid Standard(F) — — 80 ns Extended(LF) — — 100 ns 121 TCKRF Clock Out Rise Time and Fall Time (Master mode) Standard(F) — — 45 ns Extended(LF) — — 50 ns 122 TDTRF Data Out Rise Time and Fall Time Standard(F) — — 45 ns Extended(LF) — — 50 ns † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: Refer to Figure 17-3 for load conditions. 125 126 RC6/TX/CK RC7/RX/DT pin pin Param No. Symbol Characteristic Min Typ† Max Units Conditions 125 TDTV2CKL SYNC RCV (MASTER & SLAVE) Data Setup before CK  (DT setup time) 15 — — ns 126 TCKL2DTL Data Hold after CK  (DT hold time) 15 — — ns † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. PIC16F87XA DS39582C-page 194  2001-2013 Microchip Technology Inc. TABLE 17-14: A/D CONVERTER CHARACTERISTICS:PIC16F873A/874A/876A/877A (INDUSTRIAL) PIC16LF873A/874A/876A/877A (INDUSTRIAL) Param No. Sym Characteristic Min Typ† Max Units Conditions A01 NR Resolution — — 10-bits bit VREF = VDD = 5.12V, VSS  VAIN  VREF A03 EIL Integral Linearity Error — — < ± 1 LSb VREF = VDD = 5.12V, VSS  VAIN  VREF A04 EDL Differential Linearity Error — — < ± 1 LSb VREF = VDD = 5.12V, VSS  VAIN  VREF A06 EOFF Offset Error — — < ± 2 LSb VREF = VDD = 5.12V, VSS  VAIN  VREF A07 EGN Gain Error — — < ± 1 LSb VREF = VDD = 5.12V, VSS  VAIN  VREF A10 — Monotonicity — guaranteed(3) — —VSS  VAIN  VREF A20 VREF Reference Voltage (VREF+ – VREF-) 2.0 — VDD + 0.3 V A21 VREF+ Reference Voltage High AVDD – 2.5V AVDD + 0.3V V A22 VREF- Reference Voltage Low AVSS – 0.3V VREF+ – 2.0V V A25 VAIN Analog Input Voltage VSS – 0.3V — VREF + 0.3V V A30 ZAIN Recommended Impedance of Analog Voltage Source — — 2.5 k (Note 4) A40 IAD A/D Conversion Current (VDD) PIC16F87XA — 220 — A Average current consumption when A/D is on (Note 1) PIC16LF87XA — 90 — A A50 IREF VREF Input Current (Note 2) — — — — 5 150 A A During VAIN acquisition. Based on differential of VHOLD to VAIN to charge CHOLD, see Section 11.1 “A/D Acquisition Requirements”. During A/D conversion cycle * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input. 3: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 4: Maximum allowed impedance for analog voltage source is 10 kThis requires higher acquisition time.  2001-2013 Microchip Technology Inc. DS39582C-page 195 PIC16F87XA FIGURE 17-19: A/D CONVERSION TIMING TABLE 17-15: A/D CONVERSION REQUIREMENTS 131 130 132 BSF ADCON0, GO Q4 A/D CLK A/D DATA ADRES ADIF GO SAMPLE OLD_DATA Sampling Stopped DONE NEW_DATA (TOSC/2)(1) 9 8 7 2 10 Note: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1 TCY   Param No. Symbol Characteristic Min Typ† Max Units Conditions 130 TAD A/D Clock Period PIC16F87XA 1.6 — — s TOSC based, VREF  3.0V PIC16LF87XA 3.0 — — s TOSC based, VREF  2.0V PIC16F87XA 2.0 4.0 6.0 s A/D RC mode PIC16LF87XA 3.0 6.0 9.0 s A/D RC mode 131 TCNV Conversion Time (not including S/H time) (Note 1) — 12 TAD 132 TACQ Acquisition Time (Note 2) 10* 40 — — — s s The minimum time is the amplifier settling time. This may be used if the “new” input voltage has not changed by more than 1 LSb (i.e., 20.0 mV @ 5.12V) from the last sampled voltage (as stated on CHOLD). 134 TGO Q4 to A/D Clock Start — TOSC/2 § — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. § This specification ensured by design. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 11.1 “A/D Acquisition Requirements” for minimum conditions. PIC16F87XA DS39582C-page 196  2001-2013 Microchip Technology Inc. NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 197 PIC16F87XA 18.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES “Typical” represents the mean of the distribution at 25C. “Maximum” or “minimum” represents (mean + 3) or (mean – 3) respectively, where  is a standard deviation, over the whole temperature range. FIGURE 18-1: TYPICAL IDD vs. FOSC OVER VDD (HS MODE) FIGURE 18-2: MAXIMUM IDD vs. FOSC OVER VDD (HS MODE) Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. 0 1 2 3 4 5 6 7 4 6 8 10 12 14 16 18 20 FOSC (MHz) IDD (mA) 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) 0 1 2 3 4 5 6 7 8 4 6 8 10 12 14 16 18 20 FOSC (MHz) IDD (mA) 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) PIC16F87XA DS39582C-page 198  2001-2013 Microchip Technology Inc. FIGURE 18-3: TYPICAL IDD vs. FOSC OVER VDD (XT MODE) FIGURE 18-4: MAXIMUM IDD vs. FOSC OVER VDD (XT MODE) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 500 1000 1500 2000 2500 3000 3500 4000 FOSC (MHz) IDD (mA) 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) 0.0 0.5 1.0 1.5 2.0 2.5 0 500 1000 1500 2000 2500 3000 3500 4000 FOSC (MHz) IDD (mA) 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C)  2001-2013 Microchip Technology Inc. DS39582C-page 199 PIC16F87XA FIGURE 18-5: TYPICAL IDD vs. FOSC OVER VDD (LP MODE) FIGURE 18-6: MAXIMUM IDD vs. FOSC OVER VDD (LP MODE) 0 10 20 30 40 50 60 70 20 30 40 50 60 70 80 90 100 FOSC (kHz) IDD (uA) 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) 0 20 40 60 80 100 120 20 30 40 50 60 70 80 90 100 FOSC (kHz) IDD (uA) 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) PIC16F87XA DS39582C-page 200  2001-2013 Microchip Technology Inc. FIGURE 18-7: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R (RC MODE, C = 20 pF, +25C) FIGURE 18-8: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R (RC MODE, C = 100 pF, +25C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (MHz) 100 kOhm 10 kOhm 5.1 kOhm Operation above 4 MHz is not recommended 0.0 0.5 1.0 1.5 2.0 2.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (MHz) 100 kOhm 10 kOhm 5.1 kOhm 3.3 kOhm  2001-2013 Microchip Technology Inc. DS39582C-page 201 PIC16F87XA FIGURE 18-9: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R (RC MODE, C = 300 pF, +25C) FIGURE 18-10: IPD vs. VDD, -40C TO +125C (SLEEP MODE, ALL PERIPHERALS DISABLED) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Freq (MHz) 100 kOhm 10 kOhm 5.1 kOhm 3.3 kOhm 0.001 0.01 0.1 1 10 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) Typ (25°C) Max (85°C) Max (125°C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) PIC16F87XA DS39582C-page 202  2001-2013 Microchip Technology Inc. FIGURE 18-11: TYPICAL AND MAXIMUMITMR1 vs. VDD OVER TEMPERATURE (-10C TO +70C, TIMER1 WITH OSCILLATOR, XTAL = 32 kHz, C1 AND C2 = 47 pF) FIGURE 18-12: TYPICAL AND MAXIMUM IWDT vs. VDD OVER TEMPERATURE (WDT ENABLED) 0 2 4 6 8 10 12 14 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) Typ (25C) Max (70C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-10°C to +70°C) Minimum: mean – 3 (-10°C to +70°C) IPD (A) Max (+70°C) Typ (+25°C) 0.1 1 10 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (uA) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) Max (+125°C) Max (+85°C) Typ (+25°C)  2001-2013 Microchip Technology Inc. DS39582C-page 203 PIC16F87XA FIGURE 18-13: IBOR vs. VDD OVER TEMPERATURE FIGURE 18-14: TYPICAL, MINIMUM AND MAXIMUM WDT PERIOD vs. VDD (-40C TO +125C) 10 100 1,000 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (A) Device in Reset Device in Indeterminant Sleep State Max (125°C) Typ (25°C) Max (125°C) Typ (25°C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) Note: Device current in Reset depends on oscillator mode, frequency and circuit. 0 5 10 15 20 25 30 35 40 45 50 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) WDT Period (ms) Max (125°C) Typ (25°C) Min (-40°C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) PIC16F87XA DS39582C-page 204  2001-2013 Microchip Technology Inc. FIGURE 18-15: AVERAGE WDT PERIOD vs. VDD OVER TEMPERATURE (-40C TO +125C) FIGURE 18-16: TYPICAL, MINIMUM AND MAXIMUM VOH vs. IOH (VDD = 5V, -40C TO +125C) 0 5 10 15 20 25 30 35 40 45 50 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) WDT Period (ms) 125°C 85°C 25°C -40°C Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 5 10 15 20 25 IOH (-mA) VOH (V) Max Typ (25°C) Min Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C)  2001-2013 Microchip Technology Inc. DS39582C-page 205 PIC16F87XA FIGURE 18-17: TYPICAL, MINIMUM AND MAXIMUM VOH vs. IOH (VDD = 3V, -40C TO +125C) FIGURE 18-18: TYPICAL, MINIMUM AND MAXIMUM VOL vs. IOL (VDD = 5V, -40C TO +125C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 5 10 15 20 25 IOH (-mA) VOH (V) Max Typ (25°C) Min Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 5 10 15 20 25 IOL (-mA) VOL (V) Max (125°C) Max (85°C) Typ (25°C) Min (-40°C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) PIC16F87XA DS39582C-page 206  2001-2013 Microchip Technology Inc. FIGURE 18-19: TYPICAL, MINIMUM AND MAXIMUM VOL vs. IOL (VDD = 3V, -40C TO +125C) FIGURE 18-20: MINIMUM AND MAXIMUM VIN vs. VDD (TTL INPUT, -40C TO +125C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 25 IOL (-mA) VOL (V) Max (125°C) Max (85°C) Typ (25°C) Min (-40°C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VIN (V) VTH Max (-40°C) VTH Min (125°C) VTH Typ (25°C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C)  2001-2013 Microchip Technology Inc. DS39582C-page 207 PIC16F87XA FIGURE 18-21: MINIMUM AND MAXIMUM VIN vs. VDD (ST INPUT, -40C TO +125C) FIGURE 18-22: MINIMUM AND MAXIMUM VIN vs. VDD (I2C INPUT, -40C TO +125C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VIN (V) VIH Max (125°C) VIH Min (-40°C) VIL Max (-40°C) VIL Min (125°C) Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VIN (V) VIH Max VIH Min VILMax VIL Min Typical: statistical mean @ 25°C Maximum: mean + 3 (-40°C to +125°C) Minimum: mean – 3 (-40°C to +125°C) VIL Max PIC16F87XA DS39582C-page 208  2001-2013 Microchip Technology Inc. FIGURE 18-23: A/D NONLINEARITY vs. VREFH (VDD = VREFH, -40C TO +125C) FIGURE 18-24: A/D NONLINEARITY vs. VREFH (VDD = 5V, -40C TO +125C) 0 0.5 1 1.5 2 2.5 3 3.5 4 2 2.5 3 3.5 4 4.5 5 5.5 VDD and VREFH (V) Differential or Integral Nonlinearity (LSB) -40C 25C 85C 125C -40°C +25°C +85°C +125°C 0 0.5 1 1.5 2 2.5 3 2 2.5 3 3.5 4 4.5 5 5.5 VREFH (V) Differential or Integral Nonlinearilty (LSB) Max (-40C to 125C) Typ (+25°C) Typ (25C) Max (-40°C to +125°C)  2001-2013 Microchip Technology Inc. DS39582C-page 209 PIC16F87XA 19.0 PACKAGING INFORMATION 19.1 Package Marking Information 40-Lead PDIP XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX YYWWNNN Example PIC16F877A/P 0310017 44-Lead TQFP XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Example PIC16F877A /PT 0310017 44-Lead PLCC XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Example PIC16F877A -20/L 0310017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 PIC16F87XA DS39582C-page 210  2001-2013 Microchip Technology Inc. Package Marking Information (Cont’d) XXXXXXXXXX 44-Lead QFN XXXXXXXXXX XXXXXXXXXX YYWWNNN Example 28-Lead PDIP (Skinny DIP) XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example PIC16F876A/SP 0310017 28-Lead SOIC XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example PIC16F876A/SO 0310017 28-Lead SSOP XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example PIC16F876A/ SS 0310017 28-Lead QFN Example XXXXXXXX XXXXXXXX YYWWNNN PIC16F877A -I/ML 0310017 16F873A -I/ML 0310017  2001-2013 Microchip Technology Inc. DS39582C-page 211 PIC16F87XA 40-Lead Plastic Dual In-line (P) – 600 mil (PDIP) Mold Draft Angle Bottom  5 10 15 5 10 15 Mold Draft Angle Top  5 10 15 5 10 15 Overall Row Spacing § eB .620 .650 .680 15.75 16.51 17.27 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Upper Lead Width B1 .030 .050 .070 0.76 1.27 1.78 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Tip to Seating Plane L .120 .130 .135 3.05 3.30 3.43 Overall Length D 2.045 2.058 2.065 51.94 52.26 52.45 Molded Package Width E1 .530 .545 .560 13.46 13.84 14.22 Shoulder to Shoulder Width E .595 .600 .625 15.11 15.24 15.88 Base to Seating Plane A1 .015 0.38 Molded Package Thickness A2 .140 .150 .160 3.56 3.81 4.06 Top to Seating Plane A .160 .175 .190 4.06 4.45 4.83 Pitch p .100 2.54 Number of Pins n 40 40 Dimension Limits MIN NOM MAX MIN NOM MAX Units INCHES* MILLIMETERS A2 1 2 D n E1 c  eB E  p L B B1 A A1 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-011 Drawing No. C04-016 § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging PIC16F87XA DS39582C-page 212  2001-2013 Microchip Technology Inc. 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) * Controlling Parameter Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-076 Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14 Footprint (Reference) (F) .039 1.00 (F) A A1 A2  E E1 #leads=n1 p B D1 D n 1 2  c  L Units INCHES MILLIMETERS* Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 44 44 Pitch p .031 0.80 Overall Height A .039 .043 .047 1.00 1.10 1.20 Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05 Standoff § A1 .002 .004 .006 0.05 0.10 0.15 Foot Length L .018 .024 .030 0.45 0.60 0.75 Foot Angle  0 3.5 7 0 3.5 7 Overall Width E .463 .472 .482 11.75 12.00 12.25 Overall Length D .463 .472 .482 11.75 12.00 12.25 Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10 Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10 Pins per Side n1 11 11 Lead Thickness c .004 .006 .008 0.09 0.15 0.20 Lead Width B .012 .015 .017 0.30 0.38 0.44 Mold Draft Angle Top  5 10 15 5 10 15 Mold Draft Angle Bottom  5 10 15 5 10 15 CH x 45  § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS39582C-page 213 PIC16F87XA 44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) CH2 x 45 CH1 x 45 Mold Draft Angle Bottom  0 5 10 0 5 10 Mold Draft Angle Top  0 5 10 0 5 10 B .013 .020 .021 0.33 0.51 0.53 Upper Lead Width B1 .026 .029 .032 0.66 0.74 0.81 Lead Thickness c .008 .011 .013 0.20 0.27 0.33 Pins per Side n1 11 11 Footprint Length D2 .590 .620 .630 14.99 15.75 16.00 Footprint Width E2 .590 .620 .630 14.99 15.75 16.00 Molded Package Length D1 .650 .653 .656 16.51 16.59 16.66 Molded Package Width E1 .650 .653 .656 16.51 16.59 16.66 Overall Length D .685 .690 .695 17.40 17.53 17.65 Overall Width E .685 .690 .695 17.40 17.53 17.65 Corner Chamfer (others) CH2 .000 .005 .010 0.00 0.13 0.25 Corner Chamfer 1 CH1 .040 .045 .050 1.02 1.14 1.27 Side 1 Chamfer Height A3 .024 .029 .034 0.61 0.74 0.86 Standoff § A1 .020 0.51 Molded Package Thickness A2 Overall Height A .165 .173 .180 4.19 4.39 4.57 Pitch p .050 1.27 Number of Pins n 44 44 Dimension Limits MIN NOM MAX MIN NOM MAX Units INCHES* MILLIMETERS  A2 c E2 2 D1 D n #leads=n1 E E1 1  p A3 A 35 B1 B D2 A1 .145 .153 .160 3.68 3.87 4.06 .028 .035 0.71 0.89 Lower Lead Width * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-047 Drawing No. C04-048 § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging PIC16F87XA DS39582C-page 214  2001-2013 Microchip Technology Inc. 44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN) Lead Width *Controlling Parameter Drawing No. C04-103 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. B .012 .013 .013 0.30 0.33 0.35 Pitch Number of Pins Overall Width Standoff Overall Length Overall Height MAX Units Dimension Limits A1 D E n p A .315 BSC .000 INCHES .026 BSC MIN 44 NOM MAX .002 0 8.00 BSC MILLIMETERS* .039 MIN 44 0.65 BSC NOM 0.05 1.00 Base Thickness A3 .010 REF 0.25 REF JEDEC equivalent: M0-220 .035 0.90 .001 0.02 .315 BSC 8.00 BSC Lead Length L .014 .016 .018 0.35 0.40 0.45 E2 D2 Exposed Pad Width Exposed Pad Length .262 .268 .274 6.65 6.80 6.95 .262 .268 .274 6.65 6.80 6.95 D D2 A1 A3 A TOP VIEW n 1 L E2 BOTTOM VIEW B E 2 PAD METAL EXPOSED p PIN 1 INDEX ON TOP MARKING EXPOSED PAD INDEX ON OPTIONAL PIN 1 .031 0.80 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS39582C-page 215 PIC16F87XA 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP) Mold Draft Angle Bottom  5 10 15 5 10 15 Mold Draft Angle Top  5 10 15 5 10 15 Overall Row Spacing § eB .320 .350 .430 8.13 8.89 10.92 Lower Lead Width B .016 .019 .022 0.41 0.48 0.56 Upper Lead Width B1 .040 .053 .065 1.02 1.33 1.65 Lead Thickness c .008 .012 .015 0.20 0.29 0.38 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Overall Length D 1.345 1.365 1.385 34.16 34.67 35.18 Molded Package Width E1 .275 .285 .295 6.99 7.24 7.49 Shoulder to Shoulder Width E .300 .310 .325 7.62 7.87 8.26 Base to Seating Plane A1 .015 0.38 Molded Package Thickness A2 .125 .130 .135 3.18 3.30 3.43 Top to Seating Plane A .140 .150 .160 3.56 3.81 4.06 Pitch p .100 2.54 Number of Pins n 28 28 Dimension Limits MIN NOM MAX MIN NOM MAX Units INCHES* MILLIMETERS 2 1 D n E1 c eB  E  p L A2 B B1 A A1 Notes: JEDEC Equivalent: MO-095 Drawing No. C04-070 * Controlling Parameter Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging PIC16F87XA DS39582C-page 216  2001-2013 Microchip Technology Inc. 28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) Foot Angle Top  048048 Mold Draft Angle Bottom  0 12 15 0 12 15 Mold Draft Angle Top  0 12 15 0 12 15 Lead Width B .014 .017 .020 0.36 0.42 0.51 Lead Thickness c .009 .011 .013 0.23 0.28 0.33 Foot Length L .016 .033 .050 0.41 0.84 1.27 Chamfer Distance h .010 .020 .029 0.25 0.50 0.74 Overall Length D .695 .704 .712 17.65 17.87 18.08 Molded Package Width E1 .288 .295 .299 7.32 7.49 7.59 Overall Width E .394 .407 .420 10.01 10.34 10.67 Standoff § A1 .004 .008 .012 0.10 0.20 0.30 Molded Package Thickness A2 .088 .091 .094 2.24 2.31 2.39 Overall Height A .093 .099 .104 2.36 2.50 2.64 Pitch p .050 1.27 Number of Pins n 28 28 Dimension Limits MIN NOM MAX MIN NOM MAX Units INCHES* MILLIMETERS 2 1 D p n B E E1 L c  45 h  A2  A A1 * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-052 § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS39582C-page 217 PIC16F87XA 28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP) * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-150 Drawing No. C04-073 Mold Draft Angle Bottom 0 5 10 0 5 10 Mold Draft Angle Top  0 5 10 0 5 10 Lead Width B .010 .013 .015 0.25 0.32 0.38 Foot Angle  0 4 8 0.00 101.60 203.20 Lead Thickness c .004 .007 .010 0.10 0.18 0.25 Foot Length L .022 .030 .037 0.56 0.75 0.94 Overall Length D .396 .402 .407 10.06 10.20 10.34 Molded Package Width E1 .201 .207 .212 5.11 5.25 5.38 Overall Width E .299 .309 .319 7.59 7.85 8.10 Standoff § A1 .002 .006 .010 0.05 0.15 0.25 Molded Package Thickness A2 .064 .068 .072 1.63 1.73 1.83 Overall Height A .068 .073 .078 1.73 1.85 1.98 Pitch p .026 0.65 Number of Pins n 28 28 Dimension Limits MIN NOM MAX MIN NOM MAX Units INCHES MILLIMETERS* 2 1 D p n B E1 E L  c   A2 A1 A  § Significant Characteristic Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging PIC16F87XA DS39582C-page 218  2001-2013 Microchip Technology Inc. 28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN) Lead Width *Controlling Parameter Drawing No. C04-114 Notes: Mold Draft Angle Top Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. B α .009 12° .011 .014 0.23 12° 0.28 0.35 Pitch Number of Pins Overall Width Standoff Molded Package Length Overall Length Molded Package Width Molded Package Thickness Overall Height MAX Units Dimension Limits A2 A1 E1 D D1 E n p A .026 .236 BSC .000 .226 BSC INCHES .026 BSC MIN 28 NOM MAX .031 0.65 .002 0.00 6.00 BSC 5.75 BSC MILLIMETERS* .039 MIN 28 0.65 BSC NOM 0.80 0.05 1.00 Base Thickness A3 .008 REF 0.20 REF JEDEC equivalent: mMO-220 .033 0.85 .0004 0.01 .236 BSC .226 BSC 6.00 BSC 5.75 BSC Lead Length Tie Bar Width L .020 .024 .030 0.50 0.60 0.75 R .005 .007 .010 0.13 0.17 0.23 Tie Bar Length Q .012 .016 .026 0.30 0.40 0.65 Chamfer CH .009 .017 .024 0.24 0.42 0.60 E2 D2 Exposed Pad Width Exposed Pad Length .140 .146 .152 3.55 3.70 3.85 .140 .146 .152 3.55 3.70 3.85 D E E1 n 1 2 D1 A A2 EXPOSED METAL PADS TOP VIEW BOTTOM VIEW Q L R p A1 A3 α CH X 45° B D2 E2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS39582C-page 219 PIC16F87XA APPENDIX A: REVISION HISTORY Revision A (November 2001) Original data sheet for PIC16F87XA devices. The devices presented are enhanced versions of the PIC16F87X microcontrollers discussed in the “PIC16F87X Data Sheet” (DS30292). Revision B (October 2003) This revision includes the DC and AC Characteristics Graphs and Tables. The Electrical Specifications in Section 17.0 “Electrical Characteristics” have been updated and there have been minor corrections to the data sheet text. Revision C (January 2013) Added a note to each package outline drawing. APPENDIX B: DEVICE DIFFERENCES The differences between the devices in this data sheet are listed in Table B-1. TABLE B-1: DIFFERENCES BETWEEN DEVICES IN THE PIC16F87XA FAMILY PIC16F873A PIC16F874A PIC16F876A PIC16F877A Flash Program Memory (14-bit words) 4K 4K 8K 8K Data Memory (bytes) 192 192 368 368 EEPROM Data Memory (bytes) 128 128 256 256 Interrupts 14 15 14 15 I/O Ports Ports A, B, C Ports A, B, C, D, E Ports A, B, C Ports A, B, C, D, E Serial Communications MSSP, USART MSSP, USART MSSP, USART MSSP, USART Parallel Slave Port No Yes No Yes 10-bit Analog-to-Digital Module 5 input channels 8 input channels 5 input channels 8 input channels Packages 28-pin PDIP 28-pin SOIC 28-pin SSOP 28-pin QFN 40-pin PDIP 44-pin PLCC 44-pin TQFP 44-pin QFN 28-pin PDIP 28-pin SOIC 28-pin SSOP 28-pin QFN 40-pin PDIP 44-pin PLCC 44-pin TQFP 44-pin QFN PIC16F87XA DS39582C-page 220  2001-2013 Microchip Technology Inc. APPENDIX C: CONVERSION CONSIDERATIONS Considerations for converting from previous versions of devices to the ones listed in this data sheet are listed in Table C-1. TABLE C-1: CONVERSION CONSIDERATIONS Characteristic PIC16C7X PIC16F87X PIC16F87XA Pins 28/40 28/40 28/40 Timers 3 3 3 Interrupts 11 or 12 13 or 14 14 or 15 Communication PSP, USART, SSP (SPI, I2C Slave) PSP, USART, SSP (SPI, I2C Master/Slave) PSP, USART, SSP (SPI, I2C Master/Slave) Frequency 20 MHz 20 MHz 20 MHz Voltage 2.5V-5.5V 2.2V-5.5V 2.0V-5.5V A/D 8-bit, 4 conversion clock selects 10-bit, 4 conversion clock selects 10-bit, 7 conversion clock selects CCP 2 2 2 Comparator — — 2 Comparator Voltage Reference — — Yes Program Memory 4K, 8K EPROM 4K, 8K Flash (Erase/Write on single-word) 4K, 8K Flash (Erase/Write on four-word blocks) RAM 192, 368 bytes 192, 368 bytes 192, 368 bytes EEPROM Data None 128, 256 bytes 128, 256 bytes Code Protection On/Off Segmented, starting at end of program memory On/Off Program Memory Write Protection — On/Off Segmented, starting at beginning of program memory Other  In-Circuit Debugger, Low-Voltage Programming In-Circuit Debugger, Low-Voltage Programming  2001-2013 Microchip Technology Inc. DS39582C-page 221 PIC16F87XA INDEX A A/D ................................................................................... 127 Acquisition Requirements ........................................ 130 ADCON0 Register .................................................... 127 ADCON1 Register .................................................... 127 ADIF Bit .................................................................... 129 ADRESH Register .................................................... 127 ADRESL Register .................................................... 127 Analog Port Pins .................................................. 49, 51 Associated Registers and Bits ................................. 133 Calculating Acquisition Time .................................... 130 Configuring Analog Port Pins ................................... 131 Configuring the Interrupt .......................................... 129 Configuring the Module ............................................ 129 Conversion Clock ..................................................... 131 Conversions ............................................................. 132 Converter Characteristics ........................................ 194 Effects of a Reset ..................................................... 133 GO/DONE Bit ........................................................... 129 Internal Sampling Switch (Rss) Impedance ............. 130 Operation During Sleep ........................................... 133 Result Registers ....................................................... 132 Source Impedance ................................................... 130 A/D Conversion Requirements ......................................... 195 Absolute Maximum Ratings ............................................. 173 ACKSTAT ......................................................................... 101 ADCON0 Register .............................................................. 19 ADCON1 Register .............................................................. 20 Addressable Universal Synchronous Asynchronous Receiver Transmitter. See USART. ADRESH Register .............................................................. 19 ADRESL Register .............................................................. 20 Analog-to-Digital Converter. See A/D. Application Notes AN552 (Implementing Wake-up on Key Stroke) ................................................... 44 AN556 (Implementing a Table Read) ........................ 30 Assembler MPASM Assembler .................................................. 167 Asynchronous Reception Associated Registers ....................................... 118, 120 Asynchronous Transmission Associated Registers ............................................... 116 B Banking, Data Memory ................................................. 16, 22 Baud Rate Generator ......................................................... 97 Associated Registers ............................................... 113 BCLIF ................................................................................. 28 BF ..................................................................................... 101 Block Diagrams A/D ........................................................................... 129 Analog Input Model .......................................... 130, 139 Baud Rate Generator ................................................. 97 Capture Mode Operation ........................................... 65 Comparator I/O Operating Modes ............................ 136 Comparator Output .................................................. 138 Comparator Voltage Reference ............................... 142 Compare Mode Operation ......................................... 66 Crystal/Ceramic Resonator Operation (HS, XT or LP Osc Configuration) .................... 145 External Clock Input Operation (HS, XT or LP Osc Configuration) .................... 145 Interrupt Logic .......................................................... 153 MSSP (I2C Mode) ...................................................... 80 MSSP (SPI Mode) ..................................................... 71 On-Chip Reset Circuit .............................................. 147 PIC16F873A/PIC16F876A Architecture ...................... 6 PIC16F874A/PIC16F877A Architecture ...................... 7 PORTC Peripheral Output Override (RC2:0, RC7:5) Pins .................................. 46 Peripheral Output Override (RC4:3) Pins .......... 46 PORTD (in I/O Port Mode) ......................................... 48 PORTD and PORTE (Parallel Slave Port) ................. 51 PORTE (In I/O Port Mode) ......................................... 49 RA3:RA0 Pins ............................................................ 41 RA4/T0CKI Pin .......................................................... 42 RA5 Pin ..................................................................... 42 RB3:RB0 Pins ............................................................ 44 RB7:RB4 Pins ............................................................ 44 RC Oscillator Mode .................................................. 146 Recommended MCLR Circuit .................................. 148 Simplified PWM Mode ............................................... 67 Timer0/WDT Prescaler .............................................. 53 Timer1 ....................................................................... 58 Timer2 ....................................................................... 61 USART Receive ................................................117, 119 USART Transmit ...................................................... 115 Watchdog Timer ...................................................... 155 BOR. See Brown-out Reset. BRG. See Baud Rate Generator. BRGH Bit ......................................................................... 113 Brown-out Reset (BOR) .................... 143, 147, 148, 149, 150 BOR Status (BOR Bit) ............................................... 29 Bus Collision During a Repeated Start Condition ............ 108 Bus Collision During a Start Condition ............................. 106 Bus Collision During a Stop Condition ............................. 109 Bus Collision Interrupt Flag bit, BCLIF ............................... 28 C C Compilers MPLAB C17 ............................................................. 168 MPLAB C18 ............................................................. 168 MPLAB C30 ............................................................. 168 Capture/Compare/PWM (CCP) ......................................... 63 Associated Registers Capture, Compare and Timer1 .......................... 68 PWM and Timer2 ............................................... 69 Capture Mode ............................................................ 65 CCP1IF .............................................................. 65 Prescaler ........................................................... 65 CCP Timer Resources ............................................... 63 Compare Special Event Trigger Output of CCP1 .............. 66 Special Event Trigger Output of CCP2 .............. 66 Compare Mode .......................................................... 66 Software Interrupt Mode .................................... 66 Special Event Trigger ........................................ 66 Interaction of Two CCP Modules (table) .................... 63 PWM Mode ................................................................ 67 Duty Cycle ......................................................... 67 Example Frequencies/Resolutions (table) ......... 68 PWM Period ...................................................... 67 Special Event Trigger and A/D Conversions ............. 66 PIC16F87XA DS39582C-page 222  2001-2013 Microchip Technology Inc. Capture/Compare/PWM Requirements (CCP1 and CCP2) .................................................... 186 CCP. See Capture/Compare/PWM. CCP1CON Register ........................................................... 19 CCP2CON Register ........................................................... 19 CCPR1H Register ........................................................ 19, 63 CCPR1L Register ......................................................... 19, 63 CCPR2H Register ........................................................ 19, 63 CCPR2L Register ......................................................... 19, 63 CCPxM0 Bit ........................................................................64 CCPxM1 Bit ........................................................................64 CCPxM2 Bit ........................................................................64 CCPxM3 Bit ........................................................................64 CCPxX Bit ..........................................................................64 CCPxY Bit ..........................................................................64 CLKO and I/O Timing Requirements ............................... 183 CMCON Register ............................................................... 20 Code Examples Call of a Subroutine in Page 1 from Page 0 ............... 30 Indirect Addressing .................................................... 31 Initializing PORTA ...................................................... 41 Loading the SSPBUF (SSPSR) Register ................... 74 Reading Data EEPROM ............................................. 35 Reading Flash Program Memory ............................... 36 Saving Status, W and PCLATH Registers in RAM ............................................................ 154 Writing to Data EEPROM ........................................... 35 Writing to Flash Program Memory ............................. 38 Code Protection ....................................................... 143, 157 Comparator Module ......................................................... 135 Analog Input Connection Considerations .................................................139 Associated Registers ...............................................140 Configuration ............................................................ 136 Effects of a Reset ..................................................... 139 Interrupts .................................................................. 138 Operation ................................................................. 137 Operation During Sleep ............................................ 139 Outputs ..................................................................... 137 Reference ................................................................. 137 Response Time ........................................................ 137 Comparator Specifications ...............................................180 Comparator Voltage Reference ....................................... 141 Associated Registers ...............................................142 Computed GOTO ............................................................... 30 Configuration Bits ............................................................. 143 Configuration Word .......................................................... 144 Conversion Considerations .............................................. 220 CVRCON Register ............................................................. 20 D Data EEPROM and Flash Program Memory EEADR Register ........................................................ 33 EEADRH Register ...................................................... 33 EECON1 Register ...................................................... 33 EECON2 Register ...................................................... 33 EEDATA Register ...................................................... 33 EEDATH Register ...................................................... 33 Data EEPROM Memory Associated Registers ................................................. 39 EEADR Register ........................................................ 33 EEADRH Register ..................................................... 33 EECON1 Register ...................................................... 33 EECON2 Register ...................................................... 33 Operation During Code-Protect ................................. 39 Protection Against Spurious Writes ........................... 39 Reading ..................................................................... 35 Write Complete Flag Bit (EEIF) ................................. 33 Writing ........................................................................ 35 Data Memory ..................................................................... 16 Bank Select (RP1:RP0 Bits) .................................16, 22 General Purpose Registers ....................................... 16 Register File Map ..................................................17, 18 Special Function Registers ........................................ 19 DC and AC Characteristics Graphs and Tables .............. 197 DC Characteristics ....................................................175–179 Demonstration Boards PICDEM 1 ................................................................ 170 PICDEM 17 .............................................................. 170 PICDEM 18R PIC18C601/801 ................................. 171 PICDEM 2 Plus ........................................................ 170 PICDEM 3 PIC16C92X ............................................ 170 PICDEM 4 ................................................................ 170 PICDEM LIN PIC16C43X ........................................ 171 PICDEM USB PIC16C7X5 ...................................... 171 PICDEM.net Internet/Ethernet ................................. 170 Development Support ...................................................... 167 Device Differences ........................................................... 219 Device Overview .................................................................. 5 Direct Addressing ............................................................... 31 E EEADR Register ...........................................................21, 33 EEADRH Register .........................................................21, 33 EECON1 Register .........................................................21, 33 EECON2 Register .........................................................21, 33 EEDATA Register .............................................................. 21 EEDATH Register .............................................................. 21 Electrical Characteristics .................................................. 173 Errata ................................................................................... 4 Evaluation and Programming Tools ................................. 171 External Clock Timing Requirements ............................... 182 External Interrupt Input (RB0/INT). See Interrupt Sources. External Reference Signal ............................................... 137 F Firmware Instructions ....................................................... 159 Flash Program Memory Associated Registers ................................................. 39 EECON1 Register ...................................................... 33 EECON2 Register ...................................................... 33 Reading ..................................................................... 36 Writing ........................................................................ 37 FSR Register ..........................................................19, 20, 31 G General Call Address Support ........................................... 94  2001-2013 Microchip Technology Inc. DS39582C-page 223 PIC16F87XA I I/O Ports ............................................................................. 41 I2C Bus Data Requirements ............................................ 192 I 2C Bus Start/Stop Bits Requirements ............................. 191 I 2C Mode Registers .................................................................... 80 I 2C Mode ............................................................................ 80 ACK Pulse ............................................................ 84, 85 Acknowledge Sequence Timing ............................... 104 Baud Rate Generator ................................................. 97 Bus Collision Repeated Start Condition ................................. 108 Start Condition ................................................. 106 Stop Condition ................................................. 109 Clock Arbitration ......................................................... 98 Effect of a Reset ...................................................... 105 General Call Address Support ................................... 94 Master Mode .............................................................. 95 Operation ........................................................... 96 Repeated Start Timing ..................................... 100 Master Mode Reception ........................................... 101 Master Mode Start Condition ..................................... 99 Master Mode Transmission ...................................... 101 Multi-Master Communication, Bus Collision and Arbitration .................................................. 105 Multi-Master Mode ................................................... 105 Read/Write Bit Information (R/W Bit) ................... 84, 85 Serial Clock (RC3/SCK/SCL) ..................................... 85 Slave Mode ................................................................ 84 Addressing ......................................................... 84 Reception ........................................................... 85 Transmission ...................................................... 85 Sleep Operation ....................................................... 105 Stop Condition Timing .............................................. 104 ID Locations ............................................................. 143, 157 In-Circuit Debugger .................................................. 143, 157 Resources ................................................................ 157 In-Circuit Serial Programming (ICSP) ...................... 143, 158 INDF Register .........................................................19, 20, 31 Indirect Addressing ............................................................ 31 FSR Register ............................................................. 16 Instruction Format ............................................................ 159 Instruction Set .................................................................. 159 ADDLW .................................................................... 161 ADDWF .................................................................... 161 ANDLW .................................................................... 161 ANDWF .................................................................... 161 BCF .......................................................................... 161 BSF .......................................................................... 161 BTFSC ..................................................................... 161 BTFSS ..................................................................... 161 CALL ........................................................................ 162 CLRF ........................................................................ 162 CLRW ...................................................................... 162 CLRWDT .................................................................. 162 COMF ...................................................................... 162 DECF ....................................................................... 162 DECFSZ ................................................................... 163 GOTO ...................................................................... 163 INCF ......................................................................... 163 INCFSZ .................................................................... 163 IORLW ..................................................................... 163 IORWF ..................................................................... 163 RETURN .................................................................. 164 RLF .......................................................................... 164 RRF ......................................................................... 164 SLEEP ..................................................................... 164 SUBLW .................................................................... 164 SUBWF .................................................................... 164 SWAPF .................................................................... 165 XORLW ................................................................... 165 XORWF ................................................................... 165 Summary Table ....................................................... 160 INT Interrupt (RB0/INT). See Interrupt Sources. INTCON Register ............................................................... 24 GIE Bit ....................................................................... 24 INTE Bit ..................................................................... 24 INTF Bit ..................................................................... 24 PEIE Bit ..................................................................... 24 RBIE Bit ..................................................................... 24 RBIF Bit ................................................................24, 44 TMR0IE Bit ................................................................ 24 TMR0IF Bit ................................................................. 24 Inter-Integrated Circuit. See I2C. Internal Reference Signal ................................................ 137 Internal Sampling Switch (Rss) Impedance ..................... 130 Interrupt Sources ......................................................143, 153 Interrupt-on-Change (RB7:RB4) ................................ 44 RB0/INT Pin, External .....................................9, 11, 154 TMR0 Overflow ........................................................ 154 USART Receive/Transmit Complete ....................... 111 Interrupts Bus Collision Interrupt ................................................ 28 Synchronous Serial Port Interrupt .............................. 26 Interrupts, Context Saving During .................................... 154 Interrupts, Enable Bits Global Interrupt Enable (GIE Bit) ........................24, 153 Interrupt-on-Change (RB7:RB4) Enable (RBIE Bit) .......................................24, 154 Peripheral Interrupt Enable (PEIE Bit) ....................... 24 RB0/INT Enable (INTE Bit) ........................................ 24 TMR0 Overflow Enable (TMR0IE Bit) ........................ 24 Interrupts, Flag Bits Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit) ..............................................24, 44, 154 RB0/INT Flag (INTF Bit) ............................................ 24 TMR0 Overflow Flag (TMR0IF Bit) .....................24, 154 L Loading of PC .................................................................... 30 Low-Voltage ICSP Programming ..................................... 158 Low-Voltage In-Circuit Serial Programming ..................... 143 M Master Clear (MCLR) ........................................................... 8 MCLR Reset, Normal Operation ...............147, 149, 150 MCLR Reset, Sleep ..................................147, 149, 150 Master Synchronous Serial Port (MSSP). See MSSP. MCLR ............................................................................... 148 MCLR/VPP ......................................................................... 10 Memory Organization ........................................................ 15 Data EEPROM Memory ............................................. 33 Data Memory ............................................................. 16 Flash Program Memory ............................................. 33 Program Memory ....................................................... 15 MPLAB ASM30 Assembler, Linker, Librarian .................. 168 MPLAB ICD 2 In-Circuit Debugger .................................. 169 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator ................................................... 169 PIC16F87XA DS39582C-page 224  2001-2013 Microchip Technology Inc. MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator ...................................................169 MPLAB Integrated Development Environment Software .............................................. 167 MPLINK Object Linker/MPLIB Object Librarian ............... 168 MSSP ................................................................................. 71 I 2C Mode. See I2C. SPI Mode ................................................................... 71 SPI Mode. See SPI. MSSP Module Clock Stretching ......................................................... 90 Clock Synchronization and the CKP Bit ..................... 91 Control Registers (General) ....................................... 71 Operation ................................................................... 84 Overview .................................................................... 71 SPI Master Mode ....................................................... 76 SPI Slave Mode ......................................................... 77 SSPBUF ..................................................................... 76 SSPSR ....................................................................... 76 Multi-Master Mode ........................................................... 105 O Opcode Field Descriptions ...............................................159 OPTION_REG Register .....................................................23 INTEDG Bit ................................................................ 23 PS2:PS0 Bits .............................................................. 23 PSA Bit ....................................................................... 23 RBPU Bit .................................................................... 23 T0CS Bit ..................................................................... 23 T0SE Bit ..................................................................... 23 OSC1/CLKI Pin .............................................................. 8, 10 OSC2/CLKO Pin ............................................................ 8, 10 Oscillator Configuration HS .................................................................... 145, 149 LP ..................................................................... 145, 149 RC ............................................................ 145, 146, 149 XT ..................................................................... 145, 149 Oscillator Selection .......................................................... 143 Oscillator Start-up Timer (OST) ............................... 143, 148 Oscillator, WDT ................................................................ 155 Oscillators Capacitor Selection .................................................. 146 Ceramic Resonator Selection .................................. 145 Crystal and Ceramic Resonators ............................. 145 RC ............................................................................ 146 P Package Information Marking ....................................................................209 Packaging Information ..................................................... 209 Paging, Program Memory .................................................. 30 Parallel Slave Port (PSP) ....................................... 13, 48, 51 Associated Registers .................................................52 RE0/RD/AN5 Pin .................................................. 49, 51 RE1/WR/AN6 Pin ................................................. 49, 51 RE2/CS/AN7 Pin .................................................. 49, 51 Select (PSPMODE Bit) ..............................48, 49, 50, 51 Parallel Slave Port Requirements (PIC16F874A/ 877A Only) ....................................... 187 PCL Register .......................................................... 19, 20, 30 PCLATH Register ................................................... 19, 20, 30 PCON Register .................................................... 20, 29, 149 BOR Bit ......................................................................29 POR Bit ......................................................................29 PIC16F87XA Product Identification System ..................... 231 PICkit 1 Flash Starter Kit .................................................. 171 PICSTART Plus Development Programmer .................... 169 PIE1 Register ................................................................20, 25 PIE2 Register ................................................................20, 27 Pinout Descriptions PIC16F873A/PIC16F876A ........................................... 8 PIR1 Register ...............................................................19, 26 PIR2 Register ...............................................................19, 28 POP ................................................................................... 30 POR. See Power-on Reset. PORTA ...........................................................................8, 10 Associated Registers ................................................. 43 Functions ................................................................... 43 PORTA Register ...................................................19, 41 TRISA Register .......................................................... 41 PORTB ...........................................................................9, 11 Associated Registers ................................................. 45 Functions ................................................................... 45 PORTB Register ...................................................19, 44 Pull-up Enable (RBPU Bit) ......................................... 23 RB0/INT Edge Select (INTEDG Bit) .......................... 23 RB0/INT Pin, External .....................................9, 11, 154 RB7:RB4 Interrupt-on-Change ................................ 154 RB7:RB4 Interrupt-on-Change Enable (RBIE Bit) ....................................................24, 154 RB7:RB4 Interrupt-on-Change Flag (RBIF Bit) ..............................................24, 44, 154 TRISB Register .....................................................21, 44 PORTB Register ................................................................ 21 PORTC ...........................................................................9, 12 Associated Registers ................................................. 47 Functions ................................................................... 47 PORTC Register ...................................................19, 46 RC3/SCK/SCL Pin ..................................................... 85 RC6/TX/CK Pin ........................................................ 112 RC7/RX/DT Pin .................................................112, 113 TRISC Register ...................................................46, 111 PORTD .........................................................................13, 51 Associated Registers ................................................. 48 Functions ................................................................... 48 Parallel Slave Port (PSP) Function ............................ 48 PORTD Register ...................................................19, 48 TRISD Register .......................................................... 48 PORTE .............................................................................. 13 Analog Port Pins ...................................................49, 51 Associated Registers ................................................. 50 Functions ................................................................... 49 Input Buffer Full Status (IBF Bit) ................................ 50 Input Buffer Overflow (IBOV Bit) ................................ 50 Output Buffer Full Status (OBF Bit) ........................... 50 PORTE Register ...................................................19, 49 PSP Mode Select (PSPMODE Bit) ........... 48, 49, 50, 51 RE0/RD/AN5 Pin ..................................................49, 51 RE1/WR/AN6 Pin ..................................................49, 51 RE2/CS/AN7 Pin ...................................................49, 51 TRISE Register .......................................................... 49 Postscaler, WDT Assignment (PSA Bit) ................................................ 23 Rate Select (PS2:PS0 Bits) ....................................... 23 Power-down Mode. See Sleep. Power-on Reset (POR) ..................... 143, 147, 148, 149, 150 POR Status (POR Bit) ............................................... 29 Power Control (PCON) Register .............................. 149 Power-down (PD Bit) ..........................................22, 147 Power-up Timer (PWRT) ......................................... 143 Time-out (TO Bit) ................................................22, 147  2001-2013 Microchip Technology Inc. DS39582C-page 225 PIC16F87XA Power-up Timer (PWRT) .................................................. 148 PR2 Register ................................................................ 20, 61 Prescaler, Timer0 Assignment (PSA Bit) ................................................ 23 Rate Select (PS2:PS0 Bits) ....................................... 23 PRO MATE II Universal Device Programmer .................. 169 Program Counter Reset Conditions ...................................................... 149 Program Memory ............................................................... 15 Interrupt Vector .......................................................... 15 Paging ........................................................................ 30 Program Memory Map and Stack (PIC16F873A/874A) ........................................... 15 Program Memory Map and Stack (PIC16F876A/877A) ........................................... 15 Reset Vector .............................................................. 15 Program Verification ......................................................... 157 Programming Pin (VPP) ........................................................ 8 Programming, Device Instructions ................................... 159 PSP. See Parallel Slave Port. Pulse Width Modulation. See Capture/Compare/PWM, PWM Mode. PUSH ................................................................................. 30 R RA0/AN0 Pin .................................................................. 8, 10 RA1/AN1 Pin .................................................................. 8, 10 RA2/AN2/VREF-/CVREF Pin ............................................ 8, 10 RA3/AN3/VREF+ Pin ....................................................... 8, 10 RA4/T0CKI/C1OUT Pin .................................................. 8, 10 RA5/AN4/SS/C2OUT Pin ............................................... 8, 10 RAM. See Data Memory. RB0/INT Pin ................................................................... 9, 11 RB1 Pin .......................................................................... 9, 11 RB2 Pin .......................................................................... 9, 11 RB3/PGM Pin ................................................................. 9, 11 RB4 Pin .......................................................................... 9, 11 RB5 Pin .......................................................................... 9, 11 RB6/PGC Pin ................................................................. 9, 11 RB7/PGD Pin ................................................................. 9, 11 RC0/T1OSO/T1CKI Pin ................................................. 9, 12 RC1/T1OSI/CCP2 Pin .................................................... 9, 12 RC2/CCP1 Pin ............................................................... 9, 12 RC3/SCK/SCL Pin ......................................................... 9, 12 RC4/SDI/SDA Pin .......................................................... 9, 12 RC5/SDO Pin ................................................................. 9, 12 RC6/TX/CK Pin .............................................................. 9, 12 RC7/RX/DT Pin .............................................................. 9, 12 RCREG Register ................................................................ 19 RCSTA Register ................................................................. 19 ADDEN Bit ............................................................... 112 CREN Bit .................................................................. 112 FERR Bit .................................................................. 112 OERR Bit ................................................................. 112 RX9 Bit ..................................................................... 112 RX9D Bit .................................................................. 112 SPEN Bit .......................................................... 111, 112 SREN Bit .................................................................. 112 RD0/PSP0 Pin .................................................................... 13 RD1/PSP1 Pin .................................................................... 13 RD2/PSP2 Pin .................................................................... 13 RD3/PSP3 Pin .................................................................... 13 RD4/PSP4 Pin .................................................................... 13 RD5/PSP5 Pin .................................................................... 13 RD6/PSP6 Pin .................................................................... 13 RD7/PSP7 Pin .................................................................... 13 RE0/RD/AN5 Pin ............................................................... 13 RE1/WR/AN6 Pin ............................................................... 13 RE2/CS/AN7 Pin ................................................................ 13 Read-Modify-Write Operations ........................................ 159 Register File ....................................................................... 16 Register File Map (PIC16F873A/874A) ............................. 18 Register File Map (PIC16F876A/877A) ............................. 17 Registers ADCON0 (A/D Control 0) ......................................... 127 ADCON1 (A/D Control 1) ......................................... 128 CCP1CON/CCP2CON (CCP Control 1 and CCP Control 2) ........................................... 64 CMCON (Comparator Control) ................................ 135 CVRCON (Comparator Voltage Reference Control) .......................................... 141 EECON1 (EEPROM Control 1) ................................. 34 FSR ........................................................................... 31 INTCON ..................................................................... 24 OPTION_REG ......................................................23, 54 PCON (Power Control) .............................................. 29 PIE1 (Peripheral Interrupt Enable 1) .......................... 25 PIE2 (Peripheral Interrupt Enable 2) .......................... 27 PIR1 (Peripheral Interrupt Request 1) ....................... 26 PIR2 (Peripheral Interrupt Request 2) ....................... 28 RCSTA (Receive Status and Control) ..................... 112 Special Function, Summary ....................................... 19 SSPCON (MSSP Control 1, I2C Mode) ..................... 82 SSPCON (MSSP Control 1, SPI Mode) ..................... 73 SSPCON2 (MSSP Control 2, I2C Mode) ................... 83 SSPSTAT (MSSP Status, I2C Mode) ........................ 81 SSPSTAT (MSSP Status, SPI Mode) ........................ 72 Status ........................................................................ 22 T1CON (Timer1 Control) ........................................... 57 T2CON (Timer2 Control) ........................................... 61 TRISE Register .......................................................... 50 TXSTA (Transmit Status and Control) ..................... 111 Reset ........................................................................143, 147 Brown-out Reset (BOR). See Brown-out Reset (BOR). MCLR Reset. See MCLR. Power-on Reset (POR). See Power-on Reset (POR). Reset Conditions for PCON Register ...................... 149 Reset Conditions for Program Counter .................... 149 Reset Conditions for Status Register ....................... 149 WDT Reset. See Watchdog Timer (WDT). Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements .......................................................... 184 Revision History ............................................................... 219 S SCI. See USART. SCK ................................................................................... 71 SDI ..................................................................................... 71 SDO ................................................................................... 71 Serial Clock, SCK .............................................................. 71 Serial Communication Interface. See USART. Serial Data In, SDI ............................................................. 71 Serial Data Out, SDO ........................................................ 71 Serial Peripheral Interface. See SPI. Slave Select Synchronization ............................................ 77 Slave Select, SS ................................................................ 71 Sleep .................................................................143, 147, 156 Software Simulator (MPLAB SIM) ................................... 168 Software Simulator (MPLAB SIM30) ............................... 168 SPBRG Register ................................................................ 20 Special Features of the CPU ........................................... 143 PIC16F87XA DS39582C-page 226  2001-2013 Microchip Technology Inc. Special Function Registers ................................................ 19 Special Function Registers (SFRs) .................................... 19 Speed, Operating ................................................................. 1 SPI Mode ..................................................................... 71, 77 Associated Registers .................................................79 Bus Mode Compatibility ............................................. 79 Effects of a Reset ....................................................... 79 Enabling SPI I/O ......................................................... 75 Master Mode .............................................................. 76 Master/Slave Connection ........................................... 75 Serial Clock ................................................................ 71 Serial Data In ............................................................. 71 Serial Data Out ........................................................... 71 Slave Select ............................................................... 71 Slave Select Synchronization ..................................... 77 Sleep Operation ......................................................... 79 SPI Clock ................................................................... 76 Typical Connection .....................................................75 SPI Mode Requirements .................................................. 190 SS ...................................................................................... 71 SSP SPI Master/Slave Connection .................................... 75 SSPADD Register .............................................................. 20 SSPBUF Register .............................................................. 19 SSPCON Register .............................................................. 19 SSPCON2 Register ............................................................ 20 SSPIF ................................................................................. 26 SSPOV ............................................................................. 101 SSPSTAT Register ............................................................ 20 R/W Bit ................................................................. 84, 85 Stack .................................................................................. 30 Overflows ................................................................... 30 Underflow ................................................................... 30 Status Register C Bit ........................................................................... 22 DC Bit ......................................................................... 22 IRP Bit ........................................................................22 PD Bit ................................................................. 22, 147 RP1:RP0 Bits ............................................................. 22 TO Bit ................................................................. 22, 147 Z Bit ............................................................................ 22 Synchronous Master Reception Associated Registers ...............................................123 Synchronous Master Transmission Associated Registers ...............................................122 Synchronous Serial Port Interrupt ...................................... 26 Synchronous Slave Reception Associated Registers ...............................................125 Synchronous Slave Transmission Associated Registers ...............................................125 T T1CKPS0 Bit ......................................................................57 T1CKPS1 Bit ......................................................................57 T1CON Register ................................................................. 19 T1OSCEN Bit ..................................................................... 57 T1SYNC Bit ........................................................................57 T2CKPS0 Bit ......................................................................61 T2CKPS1 Bit ......................................................................61 T2CON Register ................................................................. 19 TAD ................................................................................... 131 Time-out Sequence .......................................................... 148 Timer0 ................................................................................ 53 Associated Registers ................................................. 55 Clock Source Edge Select (T0SE Bit) ....................... 23 Clock Source Select (T0CS Bit) ................................. 23 External Clock ............................................................ 54 Interrupt ..................................................................... 53 Overflow Enable (TMR0IE Bit) ................................... 24 Overflow Flag (TMR0IF Bit) ................................24, 154 Overflow Interrupt .................................................... 154 Prescaler .................................................................... 54 T0CKI ......................................................................... 54 Timer0 and Timer1 External Clock Requirements ........... 185 Timer1 ................................................................................ 57 Associated Registers ................................................. 60 Asynchronous Counter Mode .................................... 59 Reading and Writing to ...................................... 59 Counter Operation ..................................................... 58 Operation in Timer Mode ........................................... 58 Oscillator .................................................................... 59 Capacitor Selection ............................................ 59 Prescaler .................................................................... 60 Resetting of Timer1 Registers ................................... 60 Resetting Timer1 Using a CCP Trigger Output ......... 59 Synchronized Counter Mode ..................................... 58 TMR1H ...................................................................... 59 TMR1L ....................................................................... 59 Timer2 ................................................................................ 61 Associated Registers ................................................. 62 Output ........................................................................ 62 Postscaler .................................................................. 61 Prescaler .................................................................... 61 Prescaler and Postscaler ........................................... 62 Timing Diagrams A/D Conversion ........................................................ 195 Acknowledge Sequence .......................................... 104 Asynchronous Master Transmission ........................ 116 Asynchronous Master Transmission (Back to Back) ................................................. 116 Asynchronous Reception ......................................... 118 Asynchronous Reception with Address Byte First ........................................... 120 Asynchronous Reception with Address Detect ................................................ 120 Baud Rate Generator with Clock Arbitration .............. 98 BRG Reset Due to SDA Arbitration During Start Condition ................................................. 107 Brown-out Reset ...................................................... 184 Bus Collision During a Repeated Start Condition (Case 1) .................................. 108 Bus Collision During Repeated Start Condition (Case 2) .................................. 108 Bus Collision During Start Condition (SCL = 0) ......................................................... 107 Bus Collision During Start Condition (SDA Only) ....................................................... 106 Bus Collision During Stop Condition (Case 1) ........................................................... 109 Bus Collision During Stop Condition (Case 2) ........................................................... 109 Bus Collision for Transmit and Acknowledge .......... 105 Capture/Compare/PWM (CCP1 and CCP2) ............ 186 CLKO and I/O .......................................................... 183 Clock Synchronization ............................................... 91 External Clock .......................................................... 182 First Start Bit .............................................................. 99  2001-2013 Microchip Technology Inc. DS39582C-page 227 PIC16F87XA I 2C Bus Data ............................................................ 191 I 2C Bus Start/Stop Bits ............................................. 190 I 2C Master Mode (Reception, 7-bit Address) ........... 103 I 2C Master Mode (Transmission, 7 or 10-bit Address) ......................................... 102 I 2C Slave Mode (Transmission, 10-bit Address) ........ 89 I 2C Slave Mode (Transmission, 7-bit Address) .......... 87 I 2C Slave Mode with SEN = 1 (Reception, 10-bit Address) ................................................... 93 I 2C Slave Mode with SEN = 0 (Reception, 10-bit Address) ................................................... 88 I 2C Slave Mode with SEN = 0 (Reception, 7-bit Address) ..................................................... 86 I 2C Slave Mode with SEN = 1 (Reception, 7-bit Address) ..................................................... 92 Parallel Slave Port (PIC16F874A/877A Only) .......... 187 Parallel Slave Port (PSP) Read ................................. 52 Parallel Slave Port (PSP) Write ................................. 52 Repeat Start Condition ............................................. 100 Reset, Watchdog Timer, Start-up Timer and Power-up Timer ........................................ 184 Slave Mode General Call Address Sequence (7 or 10-bit Address Mode) ................................ 94 Slave Synchronization ............................................... 77 Slow Rise Time (MCLR Tied to VDD via RC Network) .................................................... 152 SPI Master Mode (CKE = 0, SMP = 0) .................... 188 SPI Master Mode (CKE = 1, SMP = 1) .................... 188 SPI Mode (Master Mode) ........................................... 76 SPI Mode (Slave Mode with CKE = 0) ....................... 78 SPI Mode (Slave Mode with CKE = 1) ....................... 78 SPI Slave Mode (CKE = 0) ...................................... 189 SPI Slave Mode (CKE = 1) ...................................... 189 Stop Condition Receive or Transmit Mode .............. 104 Synchronous Reception (Master Mode, SREN) ...................................... 124 Synchronous Transmission ...................................... 122 Synchronous Transmission (Through TXEN) .......... 122 Time-out Sequence on Power-up (MCLR Not Tied to VDD) Case 1 .............................................................. 152 Case 2 .............................................................. 152 Time-out Sequence on Power-up (MCLR Tied to VDD via RC Network) ................................... 151 Timer0 and Timer1 External Clock .......................... 185 USART Synchronous Receive (Master/Slave) .................................................. 193 USART Synchronous Transmission (Master/Slave) .................................................. 193 Wake-up from Sleep via Interrupt ............................ 157 Timing Parameter Symbology .......................................... 181 TMR0 Register ................................................................... 19 TMR1CS Bit ....................................................................... 57 TMR1H Register ................................................................ 19 TMR1L Register ................................................................. 19 TMR1ON Bit ....................................................................... 57 TMR2 Register ................................................................... 19 TMR2ON Bit ....................................................................... 61 TMRO Register .................................................................. 21 TOUTPS0 Bit ..................................................................... 61 TOUTPS1 Bit ..................................................................... 61 TOUTPS2 Bit ..................................................................... 61 TOUTPS3 Bit ..................................................................... 61 TRISA Register .................................................................. 20 TRISB Register .................................................................. 20 TRISC Register .................................................................. 20 TRISD Register .................................................................. 20 TRISE Register .................................................................. 20 IBF Bit ........................................................................ 50 IBOV Bit ..................................................................... 50 OBF Bit ...................................................................... 50 PSPMODE Bit ........................................... 48, 49, 50, 51 TXREG Register ................................................................ 19 TXSTA Register ................................................................. 20 BRGH Bit ................................................................. 111 CSRC Bit ................................................................. 111 SYNC Bit ................................................................. 111 TRMT Bit .................................................................. 111 TX9 Bit ..................................................................... 111 TX9D Bit .................................................................. 111 TXEN Bit .................................................................. 111 U USART ............................................................................. 111 Address Detect Enable (ADDEN Bit) ....................... 112 Asynchronous Mode ................................................ 115 Asynchronous Receive (9-bit Mode) ........................ 119 Asynchronous Receive with Address Detect. See Asynchronous Receive (9-bit Mode). Asynchronous Receiver ........................................... 117 Asynchronous Reception ......................................... 118 Asynchronous Transmitter ....................................... 115 Baud Rate Generator (BRG) ................................... 113 Baud Rate Formula ......................................... 113 Baud Rates, Asynchronous Mode (BRGH = 0) .............................................. 114 Baud Rates, Asynchronous Mode (BRGH = 1) .............................................. 114 High Baud Rate Select (BRGH Bit) ................. 111 Sampling .......................................................... 113 Clock Source Select (CSRC Bit) .............................. 111 Continuous Receive Enable (CREN Bit) .................. 112 Framing Error (FERR Bit) ........................................ 112 Mode Select (SYNC Bit) .......................................... 111 Overrun Error (OERR Bit) ........................................ 112 Receive Data, 9th Bit (RX9D Bit) ............................. 112 Receive Enable, 9-bit (RX9 Bit) ............................... 112 Serial Port Enable (SPEN Bit) ..........................111, 112 Single Receive Enable (SREN Bit) .......................... 112 Synchronous Master Mode ...................................... 121 Synchronous Master Reception ............................... 123 Synchronous Master Transmission ......................... 121 Synchronous Slave Mode ........................................ 124 Synchronous Slave Reception ................................. 125 Synchronous Slave Transmit ................................... 124 Transmit Data, 9th Bit (TX9D) ................................. 111 Transmit Enable (TXEN Bit) .................................... 111 Transmit Enable, 9-bit (TX9 Bit) .............................. 111 Transmit Shift Register Status (TRMT Bit) .............. 111 USART Synchronous Receive Requirements ................. 193 V VDD Pin ...........................................................................9, 13 Voltage Reference Specifications .................................... 180 VSS Pin ...........................................................................9, 13 PIC16F87XA DS39582C-page 228  2001-2013 Microchip Technology Inc. W Wake-up from Sleep ................................................ 143, 156 Interrupts .......................................................... 149, 150 MCLR Reset ............................................................. 150 WDT Reset ............................................................... 150 Wake-up Using Interrupts ................................................ 156 Watchdog Timer Register Summary ...................................................155 Watchdog Timer (WDT) ........................................... 143, 155 Enable (WDTE Bit) ...................................................155 Postscaler. See Postscaler, WDT. Programming Considerations ................................... 155 RC Oscillator ............................................................ 155 Time-out Period ........................................................ 155 WDT Reset, Normal Operation ................ 147, 149, 150 WDT Reset, Sleep ................................... 147, 149, 150 WCOL ................................................................ 99, 101, 104 WCOL Status Flag ............................................................. 99 WWW, On-Line Support .......................................................4  2001-2013 Microchip Technology Inc. DS39582C-page 229 PIC16F87XA THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support PIC16F87XA DS39582C-page 230  2001-2013 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC16F87XA DS39582C 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document?  2001-2013 Microchip Technology Inc. DS39582C-page 231 PIC16F87XA PIC16F87XA PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Temperature Package Pattern Range Device Device PIC16F87XA(1), PIC16F87XAT(2); VDD range 4.0V to 5.5V PIC16LF87XA(1), PIC16LF87XAT(2); VDD range 2.0V to 5.5V Temperature Range I = -40C to +85C (Industrial) Package ML = QFN (Metal Lead Frame) PT = TQFP (Thin Quad Flatpack) SO = SOIC SP = Skinny Plastic DIP P = PDIP L = PLCC S = SSOP Examples: a) PIC16F873A-I/P 301 = Industrial temp., PDIP package, normal VDD limits, QTP pattern #301. b) PIC16LF876A-I/SO = Industrial temp., SOIC package, Extended VDD limits. c) PIC16F877A-I/P = Industrial temp., PDIP package, 10 MHz, normal VDD limits. Note 1: F = CMOS Flash LF = Low-Power CMOS Flash 2: T = in tape and reel - SOIC, PLCC, TQFP packages only  2001-2013 Microchip Technology Inc. DS39582C-page 232 PIC16F87XA NOTES:  2001-2013 Microchip Technology Inc. DS39582C-page 233 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620769621 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS39582C-page 234  2001-2013 Microchip Technology Inc. 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DS39957D PIC18F87K90 Family Data Sheet 64/80-Pin, High-Performance Microcontrollers with LCD Driver and nanoWatt XLP Technology © 2007 Microchip Technology Inc. DS21424D-page 1 TC4431/TC4432 Features • High Peak Output Current – 1.5 A • Wide Input Supply Operating Range: - 4.5V to 30V • High Capacitive Load Drive Capability: - 1000 pF in 25 nsec • Short Delay Times – <78 nsec Typ. • Low Supply Current: - With Logic ‘1’ Input – 2.5 mA - With Logic ‘0’ Input – 300 µA • Low Output Impedance – 7 Ω • Latch-Up Protected: Will Withstand >300 mA Reverse Current • ESD Protected – 4 kV Applications • Small Motor Drive • Power MOSFET Driver • Driving Bipolar Transistors General Description The TC4431/TC4432 are 30V CMOS buffer/drivers suitable for use in high-side driver applications. They will not latch up under any conditions within their power and voltage ratings. They can accept, without damage or logic upset, up to 300 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 4 kV of electrostatic discharge. Under-voltage lockout circuitry forces the output to a ‘low’ state when the input supply voltage drops below 7V. For operation at lower voltages, disable the lockout and start-up circuit by grounding pin 3 (LOCK DIS); for all other situations, pin 3 (LOCK DIS) should be left floating. The under-voltage lockout and start-up circuit gives brown out protection when driving MOSFETS. Package Type OUT TC4431 1 2 3 4 VDD 5 6 7 8 OUT GND VDD IN LOCK DIS GND TC4432 1 2 3 4 VDD 5 6 7 8 OUT GND VDD IN GND 2 7 Inverting Non Inverting OUT 6 LOCK DIS 2 7 6 8-Pin PDIP/SOIC/CERDIP 1.5A High-Speed 30V MOSFET Drivers TC4431/TC4432 DS21424D-page 2 © 2007 Microchip Technology Inc. Functional Block Diagram 2 mA OUT Input GND Effective Input C = 10 pF VDD TC4431/TC4432 Inverting/Non Inverting OUT UV LOCK Inverting TC4431 250 mV LOCK DIS 3 2 4, 5 Non Inverting TC4432 6 7 8 © 2007 Microchip Technology Inc. DS21424D-page 3 TC4431/TC4432 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Supply Voltage .......................................................36V Input Voltage (Note 1)................... VDD + 0.3V to GND Package Power Dissipation (TA ≤ 70°C) PDIP ............................................................730 mW CERDIP.......................................................800 mW SOIC............................................................470 mW Maximum Junction Temperature, TJ ................ +150°C Storage Temperature Range.............. -65°C to +150°C † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.4 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current (Note 1) IIN -1 — 1 µA 0V ≤ VIN ≤ 12V Output High Output Voltage VOH VDD – 1.0 VDD – 0.8 — V IOUT = 100 mA Low Output Voltage VOL — — 0.025 V Output Resistance RO — 7 10 Ω IOUT = 10 mA, VDD = 30V Peak Output Current IPK — — 3.0 1.5 — — A Source: VDD = 30V Sink: VDD = 30V Latch-Up Protection Withstand Reverse Current IREV — 0.3 — A Duty cycle ≤ 2%, t ≤ 300 µsec Switching Time (Note 2) Rise Time tR — 25 40 ns Figure 4-1 Fall Time tF — 33 50 ns Figure 4-1 Delay Time tD1 — 62 80 ns Figure 4-1 Delay Time tD2 — 78 90 ns Figure 4-1 Power Supply Power Supply Current IS — — 2.5 0.3 4 0.4 mA VIN = 3V VIN = 0V Start-up Threshold VS — 8.4 10 V Drop-out Threshold VDO 7 7.7 — V Note 3 Note 1: For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance Curves” for input current graph. 2: Switching times are ensured by design. 3: For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. TC4431/TC4432 DS21424D-page 4 © 2007 Microchip Technology Inc. DC CHARACTERISTICS TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, Over operating temperature range with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.4 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current (Note 1) IIN -10 — 10 µA 0V ≤ VIN ≤ 12V Output High Output Voltage VOH VDD – 1.2 — — V IOUT = 100 mA Low Output Voltage VOL — — 0.025 V Output Resistance RO — — 12 Ω IOUT = 10 mA, VDD = 30V Switching Time (Note 2) Rise Time tR — — 60 ns Figure 4-1 Fall Time tF — — 70 ns Figure 4-1 Delay Time tD1 — — 100 ns Figure 4-1 Delay Time tD2 — — 110 ns Figure 4-1 Power Supply Power Supply Current IS — — — — 6 0.7 mA VIN = 3V VIN = 0V Start-up Threshold VS — 8.4 10 V Drop-out Threshold VDO 7 7.7 — V Note 3 Note 1: For inputs >12V, add a 1 kΩ resistor in series with the input. See Section 2.0 “Typical Performance Curves” for input current graph. 2: Switching times are ensured by design. 3: For operation below 7V, pin 3 (LOCK DIS) should be tied to ground to disable the lockout and start-up circuit, otherwise, pin 3 must be left floating. Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 30V. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) TA 0 — +70 ºC Specified Temperature Range (E) TA -40 — +85 ºC Specified Temperature Range (V) TA -40 — +125 ºC Maximum Junction Temperature TJ — — +150 ºC Storage Temperature Range TA -65 — +150 ºC Package Thermal Resistances: Thermal Resistance, 8L-SOIC θJA — 155 — ºC/W Thermal Resistance, 8L-PDIP θJA — 125 — ºC/W Thermal Resistance, 8L-CERDIP θJA — 150 — ºC/W © 2007 Microchip Technology Inc. DS21424D-page 5 TC4431/TC4432 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated, TA = +25ºC with 4.5V ≤ VDD ≤ 30V. FIGURE 2-1: Supply Current vs. Capacitive Load. FIGURE 2-2: Input Current vs. Input Voltage. FIGURE 2-3: Rise/Fall Time vs. VDD. FIGURE 2-4: tD1 and tD2 Delay vs. VDD. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 100 1000 10,000 2 MHz 600 kHz 200 kHz 20 kHz 900 kHz V = 12V DD 60 50 40 30 20 10 0 ISUPPLY (mA) CLOAD (pF) INPUT CURRENT (mA) INPUT VOLTAGE (VIN) 50 3 6 12 15 18 21 24 27 30 9 40 30 20 10 0 WITHOUT 1 K RES. 45 35 25 15 5 WITH 1 K RES. Time (nsec) 3 6 12 15 18 21 24 27 30 9 150 125 100 75 50 25 0 tFALL VDD (V) CLOAD = 1000 pF TA = +25°C tRISE TIME (nsec) 3 6 12 15 18 21 24 27 30 9 300 250 200 150 100 50 0 tD2 tD1 CLOAD = 1000 pF TA = +25°C VDD (V) TC4431/TC4432 DS21424D-page 6 © 2007 Microchip Technology Inc. 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Supply Input (VDD) The VDD input is the bias supply input for the MOSFET driver and is rated for 4.5V to 30V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of this capacitor should be chosen based on the capacitive load that is being driven. 3.2 Control Input (IN) The MOSFET driver input is a TTL/CMOS compatible input with 250 mV of hysteresis between the high and low threshold voltages. If an input signal level of greater than 12V is applied to the device, a series current limiting resistor is recommended. 3.3 Lockout Disable (LOCK DIS) The lockout pin enables/disables the undervoltage lockout feature of the device. If undervoltage lockout is desired (output is not enabled until the bias voltage reaches 8.4V (typical) on the rising edge and is disabled when the bias voltage reaches 7.7V (typical) on the falling edge), the lockout pin should be left floating. If operation below 7V is desired, the lockout pin should be tied to ground. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. Both ground pins should be used to ensure proper operation. The ground pins should be tied into a ground plane or have short traces to the bias supply source return. 3.5 Drive Output (OUT) The TC4431/TC4432 devices have individual source and sink output pins. This feature can be used to adjust the rise and fall time independently by adding separate charge and discharge resistors external to the device. Pin 7 (source output) can source 3 A peak currents into capacitive loads and pin 6 (sink output) can sink 1.5 A peak currents from a capacitive load. Pin No. Symbol Description 1 VDD Supply Input, 4.5V to 30V 2 IN TTL/CMOS Compatible Input 3 LOCK DIS Input Pin, Enable/Disable for UV Lockout 4 GND Ground 5 GND Ground 6 OUT Drive Output, Pull Down 7 OUT Drive Output, Pull Up 8 VDD Supply Input, 4.5V to 30V © 2007 Microchip Technology Inc. DS21424D-page 7 TC4431/TC4432 4.0 APPLICATIONS INFORMATION FIGURE 4-1: Switching Time Test Circuit. CL = 1000 pF 4.7 µF 0.1 µF Inverting Driver Non Inverting Driver Input VDD = 30V Input Output tD1 tF tR Input: 100 kHz, tD2 square wave, tRISE = tFALL ≤ 10 nsec Output Input Output tD1 tF tR tD2 +5V 10% 90% 10% 90% 10% 90% VDD 0V 90% 10% 10% 10% 90% +5V VDD 0V 0V 0V 90% 4, 5 2 6 1, 8 LOCK DIS 3 7 TC4431/TC4432 DS21424D-page 8 © 2007 Microchip Technology Inc. 5.0 PACKAGING INFORMATION 5.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN TC4431 EPA^^256 0749 TC4431E OA^^0749 256 8-Lead CERDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW TC4432 EJA^^256 0749 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 e3 e3 e3 © 2007 Microchip Technology Inc. DS21424D-page 9 TC4431/TC4432      !"# $%&'                   !    "#$%&'($ )* ) ! +        $%' ,  " -   "   $" - "     "*.."." -  / 012% ! 3 $01 14$ $#5 1  1 6   77) +"   # 8 8 77   # 7( 8 8   - 2 # '7 8 9(   : % ;7 8 7   - : %  7 '6 77 4 3 ! 97 67 '77 +"   3 ( 8 77 3 +-  776 8 7( /""3 :  7'( 8 7<( 33 :  7( 8 7 4 ="  % ' 8 '7 N NOTE 1 E1 1 2 D E c E2 A2 L e b b1 A1 A $" +  !  7'>77) TC4431/TC4432 DS21424D-page 10 © 2007 Microchip Technology Inc. "&%  " ""# $%&'                   !  ! %   "  $  "    77?"  ' !    "#$%&'($ )*) ! +        $%' ,  " -   "   $" - "     "*.."." -  / 012% ! 3 $01 14$ $#5 1  1 6   77) +"   # 8 8 7 $  - +- # ( 7 ;( )    # 7( 8 8   : % ;7 7 ( $  - : % '7 (7 67 4 3 ! '6 <( '77 +"   3 ( 7 (7 3 +-  776 77 7( /""3 :  7'7 7<7 797 33 :  7' 76 7 4 ="  ) 8 8 ' 7 N E1 NOTE 1 D 1 2 3 A A1 A2 L b1 b e E eB c $" +  !  7'>76) © 2007 Microchip Technology Inc. DS21424D-page 11 TC4431/TC4432 "&% ( )% ($$ *+, () # $%&'                   !  ! %   "  $  "    7("  ' !    "#$%&'($ )* ) ! +        =%,* =!      " "    $%' ,  " -   "   $" - "     "*.."." -  / $0330$%+%= ! 3 $01 14$ $#5 1  1 6   9) 4 2 # 8 8 9( $  - +- # ( 8 8   # 77 8 7( 4 : % <77) $  - : % ;7) 4 3 ! ';7)  @" A  7( 8 7(7 ,3 3 7'7 8 9 ," 3 7'=%, ,#  7B 8 6B 3 +-  79 8 7( 3 :  7 8 7( $ ! # +" (B 8 (B $ ! # )  (B 8 (B D N e E E1 NOTE 1 12 3 b A A1 A2 L L1 c h h φ β α $" +  !  7'>7(9) TC4431/TC4432 DS21424D-page 12 © 2007 Microchip Technology Inc. "&% ( )% ($$ *+, () # $%' ,  " -   "   $" - "     "*.."." -  © 2007 Microchip Technology Inc. DS21424D-page 13 TC4431/TC4432 APPENDIX A: REVISION HISTORY Revision D (December 2007) The following is the list of modifications: 1. Section 1.0 “Electrical Characteristics”: Added V temperature information to Temperature Characteristics table. 2. Added Revision History. 3. Added V temperature range to Product identification System page. Revision C (May 2003) The following is the list of modifications: 1. Undocumented changes Revision B (May 2002) The following is the list of modifications: 1. Undocumented changes Revision A (April 2002) • Original Release of this Document. TC4431/TC4432 DS21424D-page 14 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS21424D-page 15 TC4431/TC4432 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: TC4431: 1.5A High-Speed 30V MOSFET Driver, Inverting TC4432: 1.5A High-Speed 30V MOSFET Driver, Non Inverting Temperature Range: C = 0°C to +70°C E = -40°C to +85°C V = -40°C to +125°C Package: JA = Ceramic Dual In-line (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead* * * Offered in E-temp range only. * * The only package offered in the V temp range. PART NO. X /XX Temperature Package Range Device Examples: a) TC4431COA: 1.5A MOSFET driver, SOIC package, 0°C to +70°C. b) TC4431EJA: 1.5A MOSFET driver, CERDIP package, -40ºC to +85ºC. c) TC4431VPA: 1.5A MOSFET driver, PDIP package, -40°C to +125°C. a) TC4432CPA: 1.5A MOSFET driver, PDIP package, 0°C to +70°C. b) TC4432EPA: 1.5A MOSFET driver, PDIP package, -40°C to +85°C. c) TC4432VOA713: Tape and Reel, 1.5A MOSFET driver, SOIC package, -40°C to +125°C. TC4431/TC4432 DS21424D-page 16 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS21424D-page 17 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21424D-page 18 © 2007 Microchip Technology Inc. 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Product profile 1.1 General description Planar Schottky barrier single diode with an integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features ■ Low forward voltage ■ Very small and flat lead SMD plastic package ■ Low capacitance ■ Flat leads: excellent coplanarity and improved thermal behavior 1.3 Applications ■ Voltage clamping ■ Line termination ■ Reverse polarity protection 1.4 Quick reference data [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. BAT54J Schottky barrier single diode Rev. 01 — 8 March 2007 Product data sheet Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit IF forward current - - 200 mA VR reverse voltage - - 30 V VF forward voltage IF = 1 mA [1] - - 320 mV BAT54J_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 8 March 2007 2 of 8 NXP Semiconductors BAT54J Schottky barrier single diode 2. Pinning information [1] The marking bar indicates the cathode. 3. Ordering information 4. Marking 5. Limiting values [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Table 2. Pinning Pin Description Simplified outline Symbol 1 cathode [1] 2 anode 1 2 sym001 1 2 Table 3. Ordering information Type number Package Name Description Version BAT54J SC-90 plastic surface-mounted package; 2 leads SOD323F Table 4. Marking codes Type number Marking code BAT54J AP Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VR reverse voltage - 30 V IF forward current - 200 mA IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 300 mA IFSM non-repetitive peak forward current square wave; tp < 10 ms - 600 mA Ptot total power dissipation Tamb ≤ 25 °C [1] - 550 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C BAT54J_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 8 March 2007 3 of 8 NXP Semiconductors BAT54J Schottky barrier single diode 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point of cathode tab. 7. Characteristics [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1][2] - - 230 K/W Rth(j-sp) thermal resistance from junction to solder point [3] - - 55 K/W Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage [1] IF = 0.1 mA - - 240 mV IF = 1 mA - - 320 mV IF = 10 mA - - 400 mV IF = 30 mA - - 500 mV IF = 100 mA - - 800 mV IR reverse current VR = 25 V - - 2 µA Cd diode capacitance VR = 1 V; f = 1 MHz - - 10 pF BAT54J_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 8 March 2007 4 of 8 NXP Semiconductors BAT54J Schottky barrier single diode (1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values Tamb = 25 °C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values 103 102 10−1 IF (mA) VF (V) 10 1 0 0.4 0.8 1.2 msa892 (1) (2) (3) (1) (2) (3) 0 10 20 30 VR (V) 103 102 10−1 IR (µA) 10 1 (1) (2) (3) msa893 0 10 20 30 0 5 10 15 VR (V) Cd (pF) msa891 BAT54J_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 8 March 2007 5 of 8 NXP Semiconductors BAT54J Schottky barrier single diode 8. Package outline 9. Packing information [1] For further information and the availability of packing methods, see Section 13. 10. Soldering Fig 4. Package outline SOD323F (SC-90) Dimensions in mm 04-09-13 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 BAT54J SOD323F 4 mm pitch, 8 mm tape and reel -115 -135 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 5. Reflow soldering footprint SOD323F (SC-90) 001aab169 1.65 0.50 (2×) 2.10 1.60 2.80 0.60 3.05 0.95 0.50 solder lands solder resist occupied area solder paste BAT54J_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 8 March 2007 6 of 8 NXP Semiconductors BAT54J Schottky barrier single diode 11. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BAT54J_1 20070308 Product data sheet - - BAT54J_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 8 March 2007 7 of 8 NXP Semiconductors BAT54J Schottky barrier single diode 12. Legal information 12.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors BAT54J Schottky barrier single diode © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 8 March 2007 Document identifier: BAT54J_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information. . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Contact information. . . . . . . . . . . . . . . . . . . . . . 7 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 DATA SHEET Product data sheet Supersedes data of 1999 Apr 15 2004 Jan 16 DISCRETE SEMICONDUCTORS BCX70 series NPN general purpose transistors 2004 Jan 16 2 NXP Semiconductors Product data sheet NPN general purpose transistors BCX70 series FEATURES • Low current (max. 100 mA) • Low voltage (max. 45 V). APPLICATIONS • General purpose switching and amplification. DESCRIPTION NPN transistor in a SOT23 plastic package. PNP complements: BCX71 series. MARKING Note 1. * = p : Made in Hong Kong. * = t : Made in Malaysia. * = W : Made in China. PINNING TYPE NUMBER MARKING CODE(1) BCX70G AG* BCX70H AH* BCX70J AJ* BCX70K AK* PIN DESCRIPTION 1 base 2 emitter 3 collector Fig.1 Simplified outline (SOT23) and symbol. handbook, halfpage 1 2 3 Top view MAM255 2 3 1 ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION BCX70G − plastic surface mounted package; 3 leads SOT23 BCX70H BCX70J BCX70K 2004 Jan 16 3 NXP Semiconductors Product data sheet NPN general purpose transistors BCX70 series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). THERMAL CHARACTERISTICS Note 1. Transistor mounted on an FR4 printed-circuit board. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 45 V VCEO collector-emitter voltage open base − 45 V VEBO emitter-base voltage open collector − 5 V IC collector current (DC) − 100 mA ICM peak collector current − 200 mA IBM peak base current − 200 mA Ptot total power dissipation Tamb ≤ 25 °C − 250 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient note 1 500 K/W 2004 Jan 16 4 NXP Semiconductors Product data sheet NPN general purpose transistors BCX70 series CHARACTERISTICS Tamb = 25 °C unless otherwise specified. Note 1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICBO collector cut-off current IE = 0; VCB = 45 V − − 20 nA IE = 0; VCB = 45 V; Tamb = 150 °C − − 20 μA IEBO emitter cut-off current IC = 0; VEB = 4 V − − 20 nA hFE DC current gain IC = 10 μA; VCE = 5 V BCX70G − − − BCX70H 40 − − BCX70J 30 − − BCX70K 100 − − DC current gain IC = 2 mA; VCE = 5 V BCX70G 120 − 220 BCX70H 180 − 310 BCX70J 250 − 460 BCX70K 380 − 630 DC current gain IC = 50 mA; VCE = 1 V BCX70G 50 − − BCX70H 70 − − BCX70J 90 − − BCX70K 100 − − VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.25 mA 50 − 350 mV IC = 50 mA; IB = 1.25 mA 100 − 550 mV VBEsat base-emitter saturation voltage IC = 10 mA; IB = 0.25 mA 600 − 850 mV IC = 50 mA; IB = 1.25 mA 700 − 1050 mV VBE base-emitter voltage IC = 10 μA; VCE = 5 V − 520 − mV IC = 2 mA; VCE = 5 V 550 650 750 mV IC = 50 mA; VCE = 1 V − 780 − mV Cc collector capacitance IE = ie = 0; VCB = 10 V; f = 1 MHz − 1.7 − pF Ce emitter capacitance IC = ic = 0; VEB = 0.5 V; f = 1 MHz − 11 − pF fT transition frequency IC = 10 mA; VCE = 5 V; f = 100 MHz; note 1 100 250 − MHz F noise figure IC = 200 μA; VCE = 5 V; RS = 2 kΩ; f = 1 kHz; B = 200 Hz − 2 6 dB 2004 Jan 16 5 NXP Semiconductors Product data sheet NPN general purpose transistors BCX70 series PACKAGE OUTLINE UNIT A1 max. bp c D E e1 HE Lp Q w v REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 04-11-04 06-03-16 IEC JEDEC JEITA mm 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 0.95 e 1.9 2.5 2.1 0.55 0.45 0.2 0.1 DIMENSIONS (mm are the original dimensions) 0.45 0.15 SOT23 TO-236AB bp D e1 e A A1 Lp Q detail X HE E w M v M A B B A 0 1 2 mm scale A 1.1 0.9 c X 1 2 3 Plastic surface-mounted package; 3 leads SOT23 2004 Jan 16 6 NXP Semiconductors Product data sheet NPN general purpose transistors BCX70 series DATA SHEET STATUS Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Printed in The Netherlands R75/04/pp7 Date of release: 2004 Jan 16 Document order number: 9397 750 12408 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. [1] Valid for all available selection groups. 1.2 Features and benefits  High current  Three current gain selections  High power dissipation capability  Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  Leadless very small SMD plastic package with medium power capability (SOT1061)  AEC-Q101 qualified 1.3 Applications 1.4 Quick reference data [1] Pulse test: tp  300 s;  = 0.02. BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors Rev. 8 — 24 October 2011 Product data sheet Table 1. Product overview Type number[1] Package PNP complement NXP JEITA JEDEC BCP55 SOT223 SC-73 - BCP52 BCX55 SOT89 SC-62 TO-243 BCX52 BC55PA SOT1061 - - BC52PA  Linear voltage regulators  Power management  Low-side switches  MOSFET drivers  Battery-driven devices  Amplifiers Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 60 V IC collector current - - 1 A ICM peak collector current single pulse; tp  1 ms - - 2 A hFE DC current gain VCE = 2 V; IC = 150 mA [1] 63 - 250 hFE selection -10 VCE = 2 V; IC = 150 mA [1] 63 - 160 hFE selection -16 VCE = 2 V; IC = 150 mA [1] 100 - 250 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 2 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 2. Pinning information 3. Ordering information [1] Valid for all available selection groups. Table 3. Pinning Pin Description Simplified outline Graphic symbol SOT223 1 base 2 collector 3 emitter 4 collector SOT89 1 emitter 2 collector 3 base SOT1061 1 base 2 emitter 3 collector 1 3 2 4 sym016 2, 4 3 1 321 sym042 1 2 3 Transparent top view 1 2 3 sym021 3 2 1 Table 4. Ordering information Type number[1] Package Name Description Version BCP55 SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 BCX55 SC-62 plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 BC55PA HUSON3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2  2  0.65 mm SOT1061 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 3 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 4. Marking Table 5. Marking codes Type number Marking code BCP55 BCP55 BCP55-10 BCP55/10 BCP55-16 BCP55/16 BCX55 BE BCX55-10 BG BCX55-16 BM BC55PA AW BC55-10PA BH BC55-16PA BJ BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 4 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 5. Limiting values [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 60 V VCEO collector-emitter voltage open base - 60 V VEBO emitter-base voltage open collector - 5 V IC collector current - 1 A ICM peak collector current single pulse; tp  1 ms - 2A IB base current - 0.3 A IBM peak base current single pulse; tp  1 ms - 0.3 A Ptot total power dissipation Tamb  25 C BCP55 [1] - 0.65 W [2] - 1.00 W [3] - 1.35 W BCX55 [1] - 0.50 W [2] - 0.95 W [3] - 1.35 W BC55PA [1] - 0.42 W [2] - 0.83 W [3] - 1.10 W [4] - 0.81 W [5] - 1.65 W Tj junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 5 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors (1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint (1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves SOT223 Fig 2. Power derating curves SOT89 (1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2 (2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2 (3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm2 (4) FR4 PCB, 4-layer copper, standard footprint (5) FR4 PCB, single-sided copper, standard footprint Fig 3. Power derating curves SOT1061 Tamb (°C) –75 175 –25 25 75 125 006aac674 0.5 1.0 1.5 Ptot (W) 0.0 (1) (2) (3) Tamb (°C) –75 175 –25 25 75 125 006aac675 0.5 1.0 1.5 Ptot (W) 0.0 (1) (2) (3) Tamb (°C) –75 175 –25 25 75 125 006aac676 1.0 0.5 1.5 2.0 Ptot (W) 0.0 (1) (2) (3) (4) (5) BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 6 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2. Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air BCP55 [1] - - 192 K/W [2] - - 125 K/W [3] - - 93 K/W BCX55 [1] - - 250 K/W [2] - - 132 K/W [3] - - 93 K/W BC55PA [1] - - 298 K/W [2] - - 151 K/W [3] - - 114 K/W [4] - - 154 K/W [5] - - 76 K/W Rth(j-sp) thermal resistance from junction to solder point BCP55 - - 16 K/W BCX55 - - 16 K/W BC55PA - - 20 K/W BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 7 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values FR4 PCB, mounting pad for collector 1 cm2 Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values 006aac677 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac678 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 8 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors FR4 PCB, mounting pad for collector 6 cm2 Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values FR4 PCB, standard footprint Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values 006aac679 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac680 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 9 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors FR4 PCB, mounting pad for collector 1 cm2 Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values FR4 PCB, mounting pad for collector 6 cm2 Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values 006aac681 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac682 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 10 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors FR4 PCB, single-sided copper, standard footprint Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values FR4 PCB, single-sided copper, mounting pad for collector 1 cm2 Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 006aac683 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 006aac684 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 11 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors FR4 PCB, single-sided copper, mounting pad for collector 6 cm2 Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values FR4 PCB, 4-layer copper, standard footprint Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 006aac685 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 006aac686 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 12 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 7. Characteristics [1] Pulse test: tp  300 s;  = 0.02. FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2 Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 006aac687 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10 –2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = 30 V; IE = 0 A - - 100 nA VCB = 30 V; IE = 0 A; Tj = 150 C - - 10 A IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 100 nA hFE DC current gain VCE =2V IC = 5 mA [1] 63 - - IC = 150 mA [1] 63 - 250 IC = 500 mA [1] 40 - - DC current gain VCE =2V hFE selection -10 IC = 150 mA [1] 63 - 160 hFE selection -16 IC = 150 mA [1] 100 - 250 VCEsat collector-emitter saturation voltage IC = 500 mA; IB = 50 mA [1] - - 0.5 V VBE base-emitter voltage VCE = 2 V; IC = 500 mA [1] - - 1V Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - 6 - pF fT transition frequency VCE = 5 V; IC = 50 mA; f = 100 MHz 100 180 - MHz BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 13 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors VCE =2V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Tamb = 25 C Fig 15. DC current gain as a function of collector current; typical values Fig 16. Collector current as a function of collector-emitter voltage; typical values VCE = 2 V (1) Tamb = 55 C (2) Tamb = 25 C (3) Tamb = 100 C IC/IB = 10 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 17. Base-emitter voltage as a function of collector current; typical values Fig 18. Collector-emitter saturation voltage as a function of collector current; typical values 006aac691 100 200 300 hFE 0 IC (A) 10–4 10 1 10 –3 10–1 10–2 (1) (2) (3) VCE (V) 0 2.0 0.4 0.8 1.2 1.6 006aaa084 0.8 0.4 1.2 1.6 IC (A) 0 25 20 15 10 5 IB (mA) = 50 45 40 35 30 006aac692 0.4 0.8 1.2 VBE (V) 0.0 IC (mA) 10–1 104 103 1 102 10 (1) (2) (3) 006aac693 IC (mA) 10–1 104 103 1 102 10 10–1 1 VCEsat (V) 10–2 (1) (2) (3) BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 14 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 19. Package outline SOT223 (SC-73) Fig 20. Package outline SOT89 (SC-62/TO-243) Dimensions in mm 04-11-10 6.7 6.3 3.1 2.9 1.8 1.5 7.3 6.7 3.7 3.3 1.1 0.7 1 3 2 4 4.6 2.3 0.8 0.6 0.32 0.22 Dimensions in mm 06-08-29 4.6 4.4 1.8 1.4 1.6 1.4 1.2 0.8 3 1.5 0.48 0.35 0.44 0.23 0.53 0.40 2.6 2.4 4.25 3.75 1 23 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 15 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 10. Packing information [1] For further information and the availability of packing methods, see Section 14. [2] Valid for all available selection groups. [3] T1: normal taping [4] T3: 90 rotated taping Fig 21. Package outline SOT1061 (HUSON3) Dimensions in mm 09-11-12 0.65 max 2.1 1.9 1.6 1.4 0.35 0.25 0.45 0.35 2.1 1.1 1.9 0.9 0.3 0.2 1.05 0.95 1.3 2 3 1 Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] Package Description Packing quantity 1000 3000 4000 BCP55 SOT223 8 mm pitch, 12 mm tape and reel -115 - -135 BCX55 SOT89 8 mm pitch, 12 mm tape and reel; T1 [3] -115 - -135 8 mm pitch, 12 mm tape and reel; T3 [4] -146 - - BC55PA SOT1061 4 mm pitch, 8 mm tape and reel - -115 - BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 16 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 11. Soldering Fig 22. Reflow soldering footprint SOT223 (SC-73) Fig 23. Wave soldering footprint SOT223 (SC-73) sot223_fr 1.2 (4×) 1.2 (3×) 1.3 (4×) 1.3 (3×) 6.15 7 3.85 3.6 3.5 0.3 3.9 7.65 2.3 2.3 6.1 4 1 2 3 solder lands solder resist occupied area solder paste Dimensions in mm sot223_fw 1.9 6.7 8.9 8.7 1.9 (3×) 1.9 (2×) 1.1 6.2 2.7 2.7 2 4 1 3 solder lands solder resist occupied area preferred transport direction during soldering Dimensions in mm BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 17 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243) Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243) solder lands solder resist occupied area solder paste sot089_fr 1.2 1.9 2 2.25 4.75 1 (3×) 0.7 (3×) 0.6 (3×) 1.1 (2×) 1.2 0.85 0.2 0.5 1.7 4.85 3.95 4.6 1.5 1.5 Dimensions in mm solder lands solder resist occupied area preferred transport direction during soldering sot089_fw 0.7 5.3 6.6 2.4 3.5 0.5 1.8 (2×) 1.5 (2×) 7.6 1.9 1.9 Dimensions in mm BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 18 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors Reflow soldering is the only recommended soldering method. Fig 26. Reflow soldering footprint SOT1061 (HUSON3) occupied area solder paste = solder lands Dimensions in mm solder resist sot1061_fr 0.4 2.1 1.3 0.25 0.25 0.25 1.1 1.2 2.3 0.6 0.55 0.5 (2×) 0.5 (2×) 0.6 (2×) 0.4 (2×) 0.5 1.6 1.7 1.05 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 19 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BCP55_BCX55_BC55PA v.8 20111024 Product data sheet - BC637_BCP55_BCX55 v.7 Modifications: • Type number removed: BC637 • Type number added: BC55PA, BC55-10PA and BC55-16PA • Section 1 “Product profile”: updated • Section 2 “Pinning information”: updated • Table 6 and 7: updated according to latest measurements • Figure 1, 2, 4, 5, 7 to 9, 15, 17 and 18: updated • Figure 3, 6, 10 to 14: added • Section 8 “Test information”: added • Section 10 “Packing information”: updated • Section 11 “Soldering”: added • Section 13 “Legal information”: updated BC637_BCP55_BCX55 v.7 20070625 Product data sheet - BC637_BCP55_BCX55 v.6 BC637_BCP55_BCX55 v.6 20050218 Product data sheet CPCN2004050 29 BC635_637_639 v.4 BCP54_55_56 v.5 BCX54_55_56 v.4 BC635_637_639 v.4 20011010 Product specification - BC635_637_639 v.3 BCP54_55_56 v.5 20030206 Product specification - BCP54_55_56 v.4 BCX54_55_56 v.4 20011010 Product specification - BCX54_55_56 v.3 BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 20 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors 13. Legal information 13.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 21 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 October 2011 Document identifier: BCP55_BCX55_BC55PA Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . 14 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 14 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 10 Packing information . . . . . . . . . . . . . . . . . . . . 15 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 14 Contact information. . . . . . . . . . . . . . . . . . . . . 21 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 © 2009 Microchip Technology Inc. DS21942E-page 1 MCP9700/9700A MCP9701/9701A Features • Tiny Analog Temperature Sensor • Available Packages: - SC70-5, SOT-23-5, TO-92-3 • Wide Temperature Measurement Range: - -40°C to +125°C (Extended Temperature) - -40°C to +150°C (High Temperature) (MCP9700/9700A) • Accuracy: - ±2°C (max.), 0°C to +70°C (MCP9700A/9701A) - ±4°C (max.), 0°C to +70°C (MCP9700/9701) • Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/°C (typical) MCP9700/9700A - 19.5 mV/°C (typical) MCP9701/9701A • Wide Operating Voltage Range: - VDD = 2.3V to 5.5V MCP9700/9700A - VDD = 3.1V to 5.5V MCP9701/9701A • Low Operating Current: 6 µA (typical) • Optimized to Drive Large Capacitive Loads Typical Applications • Hard Disk Drives and Other PC Peripherals • Entertainment Systems • Home Appliance • Office Equipment • Battery Packs and Portable Equipment • General Purpose Temperature Monitoring Description The MCP9700/9700A and MCP9701/9701A family of Linear Active Thermistor™ Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It’s a low-cost, low-power sensor with an accuracy of ±2°C from 0°C to +70°C (MCP9700A/9701A) ±4°C from 0°C to +70°C (MCP9700/9701) while consuming 6 µA (typical) of operating current. Unlike resistive sensors (such as thermistors), the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. The voltage output pin (VOUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A and MCP9701/9701A temperature coefficients are scaled to provide a 1°C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/9700A and MCP9701/9701A provide a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typical) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. Package Type 3-Pin SOT-23 MCP9700/9700A MCP9701/9701A 3-Pin TO-92 1 2 3 VDD VOUT GND Bottom View MCP9700/9701 Only 1 GND VOUT VDD NC 4 1 2 3 5 5-Pin SC70 NC MCP9700/9700A MCP9701/9701A GND VDD VOUT 3 1 2 Low-Power Linear Active Thermistor™ ICs MCP9700/9700A and MCP9701/9701A DS21942E-page 2 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 3 MCP9700/9700A and MCP9701/9701A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD:...................................................................... 6.0V Storage temperature: ........................ -65°C to +150°C Ambient Temp. with Power Applied:.. -40°C to +150°C Output Current ................................................. ±30 mA Junction Temperature (TJ): ................................ 150°C ESD Protection On All Pins (HBM:MM): ....(4 kV:200V) Latch-Up Current at Each Pin: ...................... ±200 mA †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Power Supply Operating Voltage Range VDD VDD 2.3 3.1 — — 5.5 5.5 V V MCP9700/9700A MCP9701/9701A Operating Current IDD — 6 12 µA Power Supply Rejection Δ°C/ΔVDD — 0.1 — °C/V Sensor Accuracy (Notes 1, 2) TA = +25°C TACY — ±1 — °C TA = 0°C to +70°C TACY -2.0 ±1 +2.0 °C MCP9700A/9701A TA = -40°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9700A TA = -10°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9701A TA = 0°C to +70°C TACY -4.0 ±2 +4.0 °C MCP9700/9701 TA = -40°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9700 TA = -10°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9701 TA = -40°C to +150°C TACY -4.0 ±2 +6.0 °C High Temperature, MCP9700 only Sensor Output Output Voltage, TA = 0°C V0°C — 500 — mV MCP9700/9700A Output Voltage, TA = 0°C V0°C — 400 — mV MCP9701/9701A Temperature Coefficient TC — 10.0 — mV/°C MCP9700/9700A TC — 19.5 — mV/°C MCP9701/9701A Output Non-linearity VONL — ±0.5 — °C TA = 0°C to +70°C (Note 2) Output Current IOUT — — 100 µA Output Impedance ZOUT — 20 — Ω IOUT = 100 µA, f = 500 Hz Output Load Regulation ΔVOUT/ ΔIOUT —1— Ω TA = 0°C to +70°C, IOUT = 100 µA Turn-on Time tON — 800 — µs Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. 2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. 3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). MCP9700/9700A and MCP9701/9701A DS21942E-page 4 © 2009 Microchip Technology Inc. M Typical Load Capacitance CLOAD — — 1000 pF The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. SC-70 Thermal Response to 63% tRES — 1.3 — s 30°C (Air) to +125°C (Fluid Bath) (Note 3) TO-92 Thermal Response to 63% tRES — 1.65 — s DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. 2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. 3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (Note 1) TA -40 — +125 °C MCP9700/9700A TA -10 — +125 °C MCP9701/9701A TA -40 — +150 °C High Temperature, MCP9700 only Operating Temperature Range TA -40 — +125 °C Extended Temperature TA -40 — +150 °C High Temperature Storage Temperature Range TA -65 — +150 °C Thermal Package Resistances Thermal Resistance, 5LD SC70 θJA — 331 — °C/W Thermal Resistance, 3LD SOT-23 θJA — 308 — °C/W Thermal Resistance, 3LD TO-92 θJA — 146 — °C/W Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). © 2009 Microchip Technology Inc. DS21942E-page 5 MCP9700/9700A and MCP9701/9701A 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700A/9701A). FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. FIGURE 2-3: Supply Current vs. Temperature. FIGURE 2-4: Accuracy vs. Ambient Temperature (MCP9700/9701). FIGURE 2-5: Changes in Accuracy vs. Ambient Temperature (Due to Load). FIGURE 2-6: Load Regulation vs. Ambient Temperature. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9700A VDD= 3.3V MCP9701A VDD= 5.0V Spec. Limits -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9701/ MCP9701A VDD= 5.5V VDD= 3.1V MCP9700 MCP9700A VDD = 5.5V VDD = 2.3V 0.0 2.0 4.0 6.0 8.0 10.0 12.0 -50 -25 0 25 50 75 100 125 150 TA (°C) IDD (µA) MCP9700/MCP9700A MCP9701 MCP9701A -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 TA (°C) Accuracy (°C) MCP9700 VDD= 3.3V MCP9701 VDD= 5.0V Spec. Limits -0.2 -0.1 0 0.1 0.2 -50 -25 0 25 50 75 100 125 150 TA (°C) Δ Accuracy Due to Load (°C) MCP9701/MCP9701A VDD = 5.0V ILOAD = 100 µA MCP9700/MCP9700A VDD = 3.3V 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 TA (°C) Load Regulation ΔV/ ΔI ( Ω) MCP9700/MCP9700A MCP9701/MCP9701A VDD = 3.3V IOUT = 50 µA IOUT = 100 µA IOUT = 200 µA MCP9700/9700A and MCP9701/9701A DS21942E-page 6 © 2009 Microchip Technology Inc. Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-7: Output Voltage at 0°C (MCP9700/9700A). FIGURE 2-8: Occurrences vs. Temperature Coefficient (MCP9700/9700A). FIGURE 2-9: Power Supply Rejection (Δ°C/ΔVDD) vs. Ambient Temperature. FIGURE 2-10: Output Voltage at 0°C (MCP9701/9701A). FIGURE 2-11: Occurrences vs. Temperature Coefficient (MCP9701/9701A). FIGURE 2-12: Power Supply Rejection (Δ°C/ΔVDD) vs. Temperature. 0% 5% 10% 15% 20% 25% 30% 35% 400 420 440 460 480 500 520 540 560 580 600 V0°C (mV) Occurrences VDD = 3.3V 108 samples MCP9700A MCP9700 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 9.7 9.8 9.8 9.9 10.0 10.1 10.2 10.2 10.3 10.4 10.5 TC (mV/°C) Occurrences MCP9700 MCP9700A VDD = 3.3V 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 150 TA (°C) Normalized PSRR (°C/V) MCP9700/MCP9700A VDD= 2.3V to 5.5V MCP9700/MCP9700A VDD= 2.3V to 4.0V 0% 5% 10% 15% 20% 25% 30% 35% 300 320 340 360 380 400 420 440 460 480 500 V0°C (mV) Occurrences MCP9701 VDD = 5.0V 108 samples MCP9701A MCP9701 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 19.2 19.3 19.3 19.4 19.5 19.6 19.7 19.7 19.8 19.9 20.0 TC (mV/°C) Occurrences MCP9701 MCP9701A VDD = 5.0V 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 TA (°C) Normalized PSRR (°C/V) MCP9701/MCP9701A VDD= 3.1V to 5.5V MCP9701/MCP9701A VDD= 3.1V to 4.0V MCP9701/MCP9701A VDD= 3.1V to 5.5V MCP9701/MCP9701A VDD= 3.1V to 4.0V © 2009 Microchip Technology Inc. DS21942E-page 7 MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. FIGURE 2-13: Output Voltage vs. Power Supply. FIGURE 2-14: Output vs. Settling Time to step VDD. FIGURE 2-15: Thermal Response (Air to Fluid Bath). FIGURE 2-16: Output Voltage vs. Ambient Temperature. FIGURE 2-17: Output vs. Settling Time to Ramp VDD. FIGURE 2-18: Output Impedance vs. Frequency. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VOUT (V) TA = +26°C 0 2 4 6 8 10 12 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) VOUT (V) -2.5 -1.7 -0.8 0.0 0.8 1.7 2.5 IDD (mA) VDD_STEP = 5V TA = 26°C IDD VOUT 30 55 80 105 130 -2 0 2 4 6 8 10 12 14 16 18 Time (s) TA (°C) SC70-5 1 in. x 1 in. Copper Clad PCB Leaded, without PCB SC70-5 SOT-23-3 TO-92-3 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 TA (°C) VOUT (V) MCP9700 MCP9700A MCP9701 MCP9701A 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) VOUT (V) -42.0 -30.0 -18.0 -6.0 6.0 18.0 30.0 IDD (µA) IDD VOUT VDD_RAMP = 5V/ms TA = +26°C 1 10 100 1000 0.1 1 10 100 1000 10000 100000 Frequency (Hz) Output Impedance ( Ω) VDD = 5.0V IOUT = 100 µA TA = +26°C 0. 1 10 100 1k 10k 100k MCP9700/9700A and MCP9701/9701A DS21942E-page 8 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 9 MCP9700/9700A and MCP9701/9701A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Power Ground Pin (GND) GND is the system ground pin. 3.2 Output Voltage Pin (VOUT) The sensor output can be measured at VOUT. The voltage range over the operating temperature range for the MCP9700/9700A is 100 mV to 1.75V and for the MCP9701/9701A, 200 mV to 3V . 3.3 Power Supply Input (VDD) The operating voltage as specified in the “DC Electrical Characteristics” table is applied to VDD. 3.4 No Connect Pin (NC) This pin is not connected to the die. It can be used to improve thermal conduction to the package by connecting it to a Printed Circuit Board (PCB) trace from the thermal source. Pin No. SC70 Pin No. SOT-23 Pin No. TO-92 Symbol Function 1 — — NC No Connect (this pin is not connected to the die). 2 3 3 GND Power Ground Pin 3 2 2VOUT Output Voltage Pin 4 1 1VDD Power Supply Input 5 — — NC No Connect (this pin is not connected to the die). MCP9700/9700A and MCP9701/9701A DS21942E-page 10 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 11 MCP9700/9700A and MCP9701/9701A 4.0 APPLICATIONS INFORMATION The Linear Active Thermistor™ IC uses an internal diode to measure temperature. The diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 150°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typical) for the MCP9700/9700A and 19.5 mV/°C (typical) for the MCP9701/9701A. The output voltage at 0°C is also scaled to 500 mV (typical) and 400 mV (typical) for the MCP9700/9700A and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1 and Figure 2-16. EQUATION 4-1: SENSOR TRANSFER FUNCTION FIGURE 4-1: Typical Application Circuit. 4.1 Improving Accuracy The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typical) from 0°C to +70°C, as shown in Figure 4-2. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. FIGURE 4-2: Relative Accuracy to +25°C vs. Temperature. The change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output non-linearity. For higher accuracy using a sensor compensation technique, refer to AN1001 “IC Temperature Sensor Accuracy Compensation with a PICmicro® Microcontroller” (DS01001). The application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to ±0.5°C (typical) accuracy over the operating temperature (Figure 4-3). FIGURE 4-3: MCP9700/9700A Calibrated Sensor Accuracy. The compensation technique provides a linear temperature reading. A firmware look-up table can be generated to compensate for the sensor error. VOUT TC TA V0°C = • + Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C (See DC Electrical Characteristics table) TC = Temperature Coefficient (See DC Electrical Characteristics table) VDD VSS GND ANI VDD VSS VOUT MCP9700 PICmicro® MCU -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 TA (°C) Accuracy (°C) VDD= 3.3V 10 Samples -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 Temperature (°C) Accuracy (°C) + s Average - s Spec. Limits 100 Samples MCP9700/9700A and MCP9701/9701A DS21942E-page 12 © 2009 Microchip Technology Inc. 4.2 Shutdown Using Microcontroller I/O Pin The MCP9700/9700A and MCP9701/9701A family of low operating current of 6 µA (typical) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/ Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/9700A and MCP9701/9701A as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 Layout Considerations The MCP9700/9700A and MCP9701/9701A family does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200Ω resistor with a 1 µF decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. 4.4 Thermal Considerations The MCP9700/9700A and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, consider using the TO-92 package. The MCP9700/9700A and MCP9701/9701A is designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2. EQUATION 4-2: EFFECT OF SELFHEATING At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ – TA) is 0.179°C. TJ TA – θJA VDDIDD VDD VOUT + ( ) – IOUT = ( ) Where: TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage © 2009 Microchip Technology Inc. DS21942E-page 13 MCP9700/9700A and MCP9701/9701A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SC70 Example: XXNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 Device Code MCP9700T AUNN MCP9700AT AXNN MCP9701T AVNN MCP9701AT AYNN Note: Applies to 5-Lead SC70. AU25 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP 9700E TO^^ 916256 e3 3-Lead SOT-23 Example: XXNN Device Code MCP9700T AENN MCP9700AT AFNN MCP9701T AMNN MCP9701AT APNN Note: Applies to 3-Lead SOT-23 AE25 MCP9700/9700A and MCP9701/9701A DS21942E-page 14 © 2009 Microchip Technology Inc.              !"!  #$! !% # $    !% # $    #&!  !    !#    "'( )*+ )     #&#,$ --# $##      . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / 3# 44""   4# 5 56 7 5$8 %1 5 ( 1#  9()* 6, : #  ; <   !!1/ /  ; <  #! %%   <  6, =!# " ;    !!1/=!# " ( ( ( 6, 4#  ;  ( . #4# 4   9 4! /  ; < 9 4!=!# 8 ( <  D b 3 2 1 E1 E 4 5 e e c L A1 A A2         - *9) © 2009 Microchip Technology Inc. DS21942E-page 15 MCP9700/9700A and MCP9701/9701A   . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / MCP9700/9700A and MCP9701/9701A DS21942E-page 16 © 2009 Microchip Technology Inc.      !         !"!  #$! !% # $    !% # $    #&!(  !    !#    "'( )*+ )     #&#,$ --# $##      . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / 3# 44""   4# 5 56 7 5$8 %1 5  4!1#  ()* 6$# !4!1#  )* 6, : #  ; <   !!1/ /   (  #! %%   <  6, =!# "  < 9  !!1/=!# " 9   6, 4#  9  ( . #4# 4  ( 9 . # > < > 4! /  ; <  4!=!# 8  < ( b N E E1 1 2 e e1 D A A1 A2 c L φ         - *) © 2009 Microchip Technology Inc. DS21942E-page 17 MCP9700/9700A and MCP9701/9701A     "!        !"!  #$! !% # $    !% # $    #&!(?  !    !#    "'( )*+ )     #&#,$ --# $##      . #  #$ # /! - 0   #    1/ %#  #!# ## +22---    2 / 3# 5*:"   4# 5 7 5$8 %1 5  1#  ()* ) ## # 1/.#  ( 9( 6, =!# " ( ( 6, 4#     !!1/!$  ; (  # #1 4 ( < 4! /    4!=!# 8   E A 1 N L b e c R D 1 2 3         - *) MCP9700/9700A and MCP9701/9701A DS21942E-page 18 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 19 MCP9700/9700A and MCP9701/9701A APPENDIX A: REVISION HISTORY Revision E (April 2009) The following is the list of modifications: 1. Added High Temperature option throughout document. 2. Updated plots to reflect the high temperature performance. 3. Updated Package Outline drawings. 4. Updated Revision history. Revision D (October 2007) The following is the list of modifications: 1. Added the 3-lead SOT-23 devices to data sheet. 2. Replaced Figure 2-15. 3. Updated Package Outline Drawings. Revision C (June 2006) The following is the list of modifications: 1. Added the MCP9700A and MCP9701A devices to data sheet. 2. Added TO92 package for the MCP9700/ MCP9701. Revision B (October 2005) The following is the list of modifications: 1. Added Section 3.0 “Pin Descriptions”. 2. Added the Linear Active Thermistor™ IC trademark. 3. Removed the 2nd order temperature equation and the temperature coeficient histogram. 4. Added a reference to AN1001 and corresponding verbiage. 5. Added Figure 4-2 and corresponding verbiage. Revision A (November 2005) • Original Release of this Document. MCP9700/9700A and MCP9701/9701A DS21942E-page 20 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 21 MCP9700/9700A and MCP9701/9701A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP9700T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9700AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701AT: Linear Active Thermistor™ IC, Tape and Reel, Pb free Temperature Range: E = -40°C to +125°C H = -40°C to +150°C (MCP9700 only) Package: LT = Plastic Small Outline Transistor, 5-lead TO = Plastic Small Outline Transistor, 3-lead TT = Plastic Small Outline Transistor, 3-lead PART NO. X /XX Temperature Package Range Device Examples: a) MCP9700T-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9700-E/TO: Linear Active Thermistor™ IC, 3LD TO-92 package. c) MCP9700T-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. d) MCP9700T-H/LT: Linear Active Thermistor™ IC, Tape and Reel, High Temperature, 5LD SC70 package. a) MCP9700AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9700AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. a) MCP9701T-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9701-E/TO: Linear Active Thermistor™ IC, 3LD TO-92 package. c) MCP9701T-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. a) MCP9701AT-E/LT: Linear Active Thermistor™ IC, Tape and Reel, 5LD SC70 package. b) MCP9701AT-E/TO: Linear Active Thermistor™ IC, Tape and Reel, 3LD SOT-23 package. – MCP9700/9700A and MCP9701/9701A DS21942E-page 22 © 2009 Microchip Technology Inc. NOTES: © 2009 Microchip Technology Inc. DS21942E-page 23 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21942E-page 24 © 2009 Microchip Technology Inc. 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Abschluss- und Zwischenplatte, 1 mm dick orange 2016-1392100 (4 x 25) grau 2016-1391100 (4 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 2-fach 2016-402 50 (2 x 25) 3-fach 2016-403 50 (2 x 25) 4-fach 2016-404 50 (2 x 25) 5-fach 2016-405 50 (2 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Warnabdeckung, mit schwarzem Blitzpfeil, für 5 Klemmen gelb 2016-115 50 (2 x 25) Prüfadapter, für Prüfstecker 4 mm Ø 2009-174 100 (4 x 25) Prüfabgriff, für max. 2,5 mm2 2009-182 100 (4 x 25) Beschriftungsstreifen, weiß, unbedruckt, auf Spule für mittige Beschriftung 11 mm breit 50 m 2009-110 1 300 m 2009-130 1 Abschluss- und Zwischenplatte, 1 mm dick orange 2016-1292100 (4 x 25) grau 2016-1291100 (4 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 2-fach 2016-402 50 (2 x 25) 3-fach 2016-403 50 (2 x 25) 4-fach 2016-404 50 (2 x 25) 5-fach 2016-405 50 (2 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Warnabdeckung, mit schwarzem Blitzpfeil, für 5 Klemmen gelb 2016-115 50 (2 x 25) Prüfadapter, für Prüfstecker 4 mm Ø 2009-174 100 (4 x 25) Prüfabgriff, für max. 2,5 mm2 2009-182 100 (4 x 25) Beschriftungsstreifen, weiß, unbedruckt, auf Spule für mittige Beschriftung 11 mm breit 50 m 2009-110 1 300 m 2009-130 1 Reduzierbrücken mit Reduzierbrücker Beim Reduzierbrücken ist immer eine Abschlussplatte zwischen den zu brückenden Klemmen zu setzen. Der Reduzierbrücker 2016-499 ist für das Reduzierbrücken von 16/10 mm2 auf 10/6/4/2,5 mm2 geeignet. Die Reduzierbrücker werden – wie auch bei den Kammbrückern üblich – von oben in die zu brückenden Klemmen bis zum Anschlag hineingesteckt. 3-Leiter-Durchgangsklemmen grau 2016-1301 20 blau 2016-1304 20 orange 2016-1302 20 3-Leiter-Schutzleiterklemme grün-gelb 2016-1307 20 4 Ex e II-Anwendungen in Vorbereitung Für Ex i-Anwendungen geeignet 2-Leiter-Durchgangsklemmen grau 2016-1201 20 blau 2016-1204 20 orange 2016-1202 20 2-Leiter-Schutzleiterklemme grün-gelb 2016-1207 20 4 Ex e II-Anwendungen in Vorbereitung Für Ex i-Anwendungen geeignet Bestell- Stück je Nr. Verp.-Einh. Bestell- Stück je Nr. Verp.-Einh. TOPJOB® S Reihenklemmen 16 (25 „f“) mm2 Serie 2016 Zubehör passende Beschriftungssysteme WMB/Mini-WSB/Beschriftungsstreifen (siehe Kapitel 14) ➊ anschließbar: 0,5 mm2 – 16 mm2 „e + f“, 25 mm2 „f“; direkt steckbar: 2,5 mm2 – 16 mm2 „e“ und 2,5 mm2 – 16 mm2 „Aderendhülse mit Kunststoffkragen, 18 mm“ Reduzierbrücker, lichtgrau, isoliert 57A 2016-499 50 (2 x 25) Reduzierbrücken mit Kammbrückern Das Reduzierbrücken über die offene Klemmenseite mit Abschlussplatte ist bei 16 mm2 und 10 mm2 bis zu zwei Querschnitte kleiner möglich und bei 6 / 4 und 2,5 mm2 um einen Querschnitt kleiner möglich; z.B. 16 mm2 auf 6 mm2 (siehe linke Abb.) oder 10 mm2 auf 4 mm2 . Das Reduzierbrücken über die Klemmenrückwand mit Abschlussplatte ist um zwei Querschnitte kleiner möglich; z.B. 16 mm2 auf 6 mm2 oder 6 mm2 auf 2,5 mm2 (siehe rechte Abb.) Reduzierbrücken Generell ist zu beachten: Der Summenstrom der Abgänge darf den Nennstrom des Reduzierbrückers/Kammbrückers nicht überschreiten. Bestell- Stück je Nr. Verp.-Einh. <_18_> <___________ 70 mm /2.76 in _________> <_________________ 92 mm /3.62 in ___________________> <___ 37 mm/ ___> 1.46 in <___ 37 mm/ ___> 1.46 in 0,5 – 16 (25 „f“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Klemmenbreite 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 0,5 – 16 (25 „f“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Klemmenbreite 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 1 1 11 *UY2KCCA { *UY2KCCA { * For further approvals with corresponding ratings see section 15. End and intermediate plate, 1 mm /0.039 in thick orange 2016-1392100 (4 x 25) grey 2016-1391100 (4 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 2-way 2016-402 50 (2 x 25) 3-way 2016-403 50 (2 x 25) 4-way 2016-404 50 (2 x 25) 5-way 2016-405 50 (2 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Protective warning marker, for 5 terminal blocks yellow 2016-115 100 (4 x 25) Test plug adapter, for test plug 4 mm Ø 2009-174 100 (4 x 25) Testing tap, for max. 2.5 mm2 2009-182 100 (4 x 25) Marker strip, white, plain for center marking 11 mm /0.433 in wide 50 m 2009-110 1 on roll 300 m 2009-130 1 End and intermediate plate, 1 mm /0.039 in thick orange 2016-1292100 (4 x 25) grey 2016-1291100 (4 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 2-way 2016-402 50 (2 x 25) 3-way 2016-403 50 (2 x 25) 4-way 2016-404 50 (2 x 25) 5-way 2016-405 50 (2 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Protective warning marker, for 5 terminal blocks yellow 2016-115 100 (4 x 25) Test plug adapter, for test plug 4 mm Ø 2009-174 100 (4 x 25) Testing tap, for max. 2.5 mm2 2009-182 100 (4 x 25) Marker strip, white, plain for center marking 11 mm /0.433 in wide 50 m 2009-110 1 on roll 300 m 2009-130 1 Commoning with step-down jumpers An end plate must be applied between the two terminal blocks. Step-down jumper 2016-499 can be used for commoning AWG 8/6 (10/16 mm2 ) terminal blocks with AWG 8/10/12/14 (10/6/4/2.5 mm2 ) terminal blocks. Step-down jumpers are simply pushed down to full insertion, in the same way as all other push-in type jumper bars. 3-conductor through terminal blocks grey 2016-1301 20 blue 2016-1304 20 orange 2016-1302 20 3-conductor ground (earth) terminal block green-yellow 2016-1307 20 4 Ex e II applications are being prepared Suitable for Ex i applications 2-conductor through terminal blocks grey 2016-1201 20 blue 2016-1204 20 orange 2016-1202 20 2-conductor ground (earth) terminal block green-yellow 2016-1207 20 4 Ex e II applications are being prepared Suitable for Ex i applications Item Pack.-unit No. pcs Item Pack.-unit No. pcs TOPJOB® S Rail-Mounted Terminal Blocks 16 (25 ”f-st”) mm2 /AWG 4 Series 2016 Accessories appropriate marker system WMB/Miniature WSB/Marker strips (see section 14) ➊ Push-in conductor sizes: AWG 14 – 6 (2.5 mm2 – 16 mm2 ) “s“ and AWG 14 – 6 (2.5 mm2 – 16 mm2 ) ”insulated ferrules, 18 mm“ Step-down jumper, light grey, insulated 57 A 2016-499 50 (2 x 25) Commoning with step-down jumpers Note: The total current flowing must not exceed the rating of the step-down jumper/push-in type jumper bar. 0.5 – 16 (25 ”f-st“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Terminal block width 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 0.5 – 16 (25 ”f-st“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Terminal block width 12 mm / 0.472 in L 18 – 20 mm / 0.75 in Item Pack.-unit No. pcs Commoning with push-in type jumper bars Commoning over the open side of the terminal block with end plate allows jumpering over two cross section sizes for 16 mm2 and 10 mm2 and one cross section size for 6 mm2 , 4 mm2 and 2.5 mm2 : e.g. from 16 mm2 to 6 mm2 (see orange terminal blocks) or from 10 mm2 to 4 mm2 . Commoning over the closed side of the terminal block with end plate allows jumpering over two cross section sizes: e.g. from 16 mm2 to 6 mm2 or from 6 mm2 to 2.5 mm2 (see blue terminal blocks). <_18_> <___________ 70 mm /2.76 in _________> <_________________ 92 mm /3.62 in ___________________> <___ 37 mm/ ___> 1.46 in <___ 37 mm/ ___> 1.46 in 1 1 11 *UY2KCCA { *UY2KCCA { * Pour d’autres approbations avec les données techniques correspondantes, voir chapitre 15. Plaque d’extrémité et intermédiaire, épaisseur 1 mm orange 2016-1392100 (4 x 25) gris 2016-1391100 (4 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 2 pôles 2016-402 50 (2 x 25) 3 pôles 2016-403 50 (2 x 25) 4 pôles 2016-404 50 (2 x 25) 5 pôles 2016-405 50 (2 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Couverture protectrice de signalisation de danger, pour 5 bornes jaune 2016-115 50 (2 x 25) Adaptateur de test, pour fiche de contrôle Ø 4 mm 2009-174 100 (4 x 25) Prise de test pour 2,5 mm2 max. 2009-182 100 (4 x 25) Bandes de marquage, blanches, vierges, en rouleau pour marquage central largeur 11 mm 50 m 2009-110 1 300 m 2009-130 1 Plaque d’extrémité et intermédiaire, épaisseur 1 mm orange 2016-1292100 (4 x 25) gris 2016-1291100 (4 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 2 pôles 2016-402 50 (2 x 25) 3 pôles 2016-403 50 (2 x 25) 4 pôles 2016-404 50 (2 x 25) 5 pôles 2016-405 50 (2 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Couverture protectrice de signalisation de danger, pour 5 bornes jaune 2016-115 50 (2 x 25) Adaptateur de test, pour fiche de contrôle Ø 4 mm 2009-174 100 (4 x 25) Prise de test pour 2,5 mm2 max. 2009-182 100 (4 x 25) Bandes de marquage, blanches, vierges, en rouleau pour marquage central largeur 11 mm 50 m 2009-110 1 300 m 2009-130 1 Pontage avec pont réducteur Lors du pontage avec pont réducteur, il faut toujours prévoir une plaque d’extrémité entre les bornes à ponter. Le pont réducteur 2016-499 est prévu pour le pontage des bornes de 16/10 mm2 à 10/6/4/2,5 mm2 . Comme pour les peignes de pontage, les ponts réducteurs sont enfichés par le haut dans les bornes à ponter jusqu’à la butée. Bornes de passage pour 3 conducteurs gris 2016-1301 20 bleu 2016-1304 20 orange 2016-1302 20 Borne de protection pour 3 conducteurs vert-jaune 2016-1307 20 4 Applications Ex e II en préparation pour applications Ex i Bornes de passage pour 2 conducteurs gris 2016-1201 20 bleu 2016-1204 20 orange 2016-1202 20 Borne de protection pour 2 conducteurs vert-jaune 2016-1207 20 4 Applications Ex e II en préparation pour applications Ex i N° de Unité produit d’emballage N° de Unité produit d’emballage TOPJOB®S Bornes sur rail 16 (25 «s») mm2 Série 2016 Accessoires Système de marquage WMB/Mini-WSB/Bandes de repérage (voir chapitre 14) ➊ Raccordement possible : 0,5 mm2 – 16 mm2 «r+ s»; 25 mm2 «s»; Enfichage direct : 2,5 mm2 – 16 mm2 «r» et 2,5 mm2 – 16 mm2 «Embout d’extrémité avec rebord en plastique, 18 mm» Pont réducteur, gris clair, isolé 57A 2016-499 50 (2 x 25) Pontage avec pont réducteur Remarque : D’une manière générale, le courant total des sorties ne doit pas dépasser le courant nominal du pont réducteur/peigne de pontage. N° de Unité produit d’emballage <_18_> <___________ 70 mm /2.76 in _________> <_________________ 92 mm /3.62 in ___________________> <___ 37 mm/ ___> 1.46 in <___ 37 mm/ ___> 1.46 in Pontage avec peignes de pontage Pour les sections de 16 mm2 et 10 mm2 , le pontage avec ponts réducteurs par la face ouverte de la borne avec plaque d’extrémité est possible jusqu’à deux sections inférieures le pour les bornes de 6 / 4 et 2,5 mm2 jusqu’à une section inférieure. Ex. : de 16 mm2 à 6 mm2 (voir fig. à gauche), de 10 mm2 à 4 mm2 ou de 10 à 4 mm2 . Le pontage avec ponts réducteurs par la face arrière de la borne avec plaque d’extrémité est possible jusqu’à deux sections inférieures. Ex. : de 16 mm2 à 6 mm2 ou de 6 mm2 à 2,5 mm2 (voir fig. à droite). 0,5 – 16 (25 «s») mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Largeur des bornes 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 0,5 – 16 (25 «s») mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Largeur des bornes 12 mm / 0.472 in L 18 – 20 mm / 0.75 in This document was generated on 07/07/2015 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 0877602016 Status: Active Overview: Milli-Grid™ Connector System Description: 2.00mm Pitch Milli-Grid™ Header, Right Angle, Through Hole, 20 Circuits, 0.38µm Gold (Au) Selective Plating, Tray, Lead-Free Documents: 3D Model Product Specification PS-87761-100 (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family PCB Headers Series 87760 Application Board-to-Board, Signal, Wire-to-Board Comments Lead-Free version of 87049 series Overview Milli-Grid™ Connector System Product Name Milli-Grid™ UPC 822348273737 Physical Breakaway No Circuits (Loaded) 20 Circuits (maximum) 20 Color - Resin Black First Mate / Last Break No Flammability 94V-0 Glow-Wire Compliant No Guide to Mating Part No Keying to Mating Part None Lock to Mating Part None Mated Height 4.00mm Material - Metal Phosphor Bronze Material - Plating Mating Gold Material - Plating Termination Tin Material - Resin High Temperature Thermoplastic Net Weight 0.798/g Number of Rows 2 Orientation Right Angle PC Tail Length 2.60mm PCB Locator No PCB Retention None PCB Thickness - Recommended 1.60mm Packaging Type Tray Pitch - Mating Interface 2.00mm Pitch - Termination Interface 2.00mm Plating min - Mating 0.381µm Plating min - Termination 1.905µm Polarized to Mating Part No Polarized to PCB No Shrouded No Stackable Yes Surface Mount Compatible (SMC) Yes Temperature Range - Operating -55°C to +105°C Series image - Reference only EU ELV Not Relevant EU RoHS China RoHS Compliant REACH SVHC Contains SVHC(2014 December 17): No Halogen-Free Status Not Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com Please visit the Contact Us section for any non-product compliance questions. China ROHS Green Image ELV Not Relevant Search Parts in this Series 87760 Series Mates With Milli-Grid™ Vertical Through Hole Receptacle 79107 , 78787 , Milli-Grid™ Flex-to-Board Vertical Receptacle 79108 , Milli-Grid™ Vertical Surface Mount Receptacle 79109 , 78788 , Milli-Grid™ Top Entry Surface Mount Receptacle 87381 Termination Interface: Style Through Hole Electrical Current - Maximum per Contact 2.0A Voltage - Maximum 125V Solder Process Data Duration at Max. Process Temperature (seconds) 014 Lead-freeProcess Capability WAVE Max. Cycles at Max. Process Temperature 001 Process Temperature max. C 265 Material Info Reference - Drawing Numbers Product Specification PS-87761-100 Sales Drawing SD-87760-109 This document was generated on 07/07/2015 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Valid Connectors 00 = SMA straight male (plug) 10 = SMA Right Angle ** 20 = SMA Female 01 = TNC female 11 = Reverse polarity SMA** 21 = U.FL. Male (micro-coax cable) 02 = MCX straight male (plug) 12 = Waterproof SMA** 22 = R/A QMA** 03 = MMCX straight male (plug) 13 = SSMA ** 23 = SMP** 04 = SMB straight male (plug) 14 = N-Type Female** 24 = SMC Male 05 = MCX right angle male (plug) 15 = TNC male (plug) 25 = SMC Straight Female 06 = MMCX right angle male (plug) 16 = N-Type Male** 26 = SMB Straight Female 17 = BNC Male** 08 = H.FL (female)** (micro-coax cable) 18 = FME** 09 = U.FL (micro-coax cable) 19 = MMCX Female ** Premiums apply. Please check with your Distributor Part Number Structure : Connector 33-1aaa-xx-yyyy-zz Product cable length in mm Assigned by Tallysman for custom tuned antennas TALLYSMAN - PART NUMBER ORDERING GUIDE November 2015 For the TW1000 Family of Products (Embedded) + TW3865 & TW3870E For the TW2000 Family of Products Part Number Structure : Connector 33-2aaa-xx-yyyy Product cable length in mm Valid Connectors Without Cable: 07 = SMA female (jack) bulkhead With Cable (max length 5m): 00 = SMA straight male (plug) 10 = SMA Right Angle ** 20 = SMA Female 01 = TNC female 11 = Reverse polarity SMA** 02 = MCX straight male (plug) 12 = Waterproof SMA** 22 = R/A QMA** 03 = MMCX straight male (plug) 13 = SSMA ** 23 = SMP** 04 = SMB straight male (plug) 14 = N-Type Female** 24 = SMC Male 05 = MCX right angle male (plug) 15 = TNC male (plug) 25 = SMC Straight Female 06 = MMCX right angle male (plug) 16 = N-Type Male** 26 = SMB Straight Female 17 = BNC Male** 18 = FME** 19 = MMCX Female ** Premiums apply. Please check with your Distributor NOTE: To order any of the TW2000 antennas with NO MAGNETS, add “NM” after the Product (eg. 33-2410NM-00-3000). To add Adhesive Tape to the bottom of the same, add “AT” after the Product Name (eg. 33-2410AT-07). If you desire both, then use NMAT, eg. 33-2410NMAT-07. Page 1 TALLYSMAN - PART NUMBER ORDERING GUIDE Part Number Structure : Connector 33-3aaa-xx-yy-zzzz radome type and colour cable length in mm 4 digits (if applicable) TALLYSMAN - PART NUMBER ORDERING GUIDE Product For the TW3000 Family of Products EXCEPT TW3865 & TW3870E (embedded antennas) Radome Codes: 00 = Dark grey Conical 10 = Dark grey low prole 01 = White Conical 11 = White low prole Valid Connectors Without Cable: 01 = TNC female 14 = N-Type female With Cable (max length 5m): 00 = SMA straight male (plug) 10 = SMA Right Angle ** 20 = SMA Female 01 = TNC female 11 = Reverse polarity SMA** 02 = MCX straight male (plug) 12 = Waterproof SMA** 22=R/A QMA** 03 = MMCX straight male (plug) 13 = SSMA ** 23 = SMP** 04 = SMB straight male (plug) 14 = N-Type Female** 24 = SMC Male 05 = MCX right angle male (plug) 15 = TNC male 25 = SMC Straight Female 06 = MMCX right angle male (plug) 16 = N-TYpe Male** 26 = SMB Straight Female 17 = BNC Male** 18 = FME** 19 = MMCX Female ** Premiums apply. Please check with your Distributor For the TW4000 Family of Products Part Number Structure : Connector 33-4aaa-xx-yyyy Product cable length in mm Valid Connectors 00 = SMA straight male (plug) 10 = SMA Right Angle ** 20 = SMA Female 01 = TNC female 11 = Reverse polarity SMA** 02 = MCX straight male (plug) 12 = Waterproof SMA** 22 = R/A QMA** 03 = MMCX straight male (plug) 13 = SSMA ** 23 = SMP** 04 = SMB straight male (plug) 14 = N-Type Female** 24 = SMC Male 05 = MCX right angle male (plug) 15 = TNC male (plug) 25 = SMC Straight Female 06 = MMCX right angle male (plug) 16 = N-Type Male** 26 = SMB Straight Female 17 = BNC Male** 18 = FME** 19 = MMCX Female ** Premiums apply. Please check with your Distributor NOTE: To order any of the TW4000 antennas with NO MAGNETS, add “NM” after the Product (eg. 33-4421NM-00-3000). To add Adhesive Tape to the bottom of the same, add “AT” after the Product Name (eg. 33-4421AT-00-3000). If you desire both, then add them together, eg> 33-4421NMAT-00-3000 Page 2 November 2015 TALLYSMAN - PART NUMBER ORDERING GUIDE For the TW5000 Family of Products Part Number Structure : Conguration 33-5aaa-x-yy radome type and colour Product Conguration code: x= 0 = RS232 12V; 1 = RS232 5V; 2 = CMOS 5V, 3 = CMOS, 3.3V, 5 = RS232 3.3V Radome Codes: 00 = Dark grey Conical 10 = Dark grey low prole 01 = White Conical 11 = White low prole ee and  = connector types: 01 = TNC Female 14 = N-Type Female ** xx = no connector ** Premiums apply. Please check with your Distributor. NOTE:  denes a second connector (requiring a custom base to be ordered) At this time,  defaults to “xx” gg = radome: 01 = White Conical 11 = White Flat top Part Number Structure : 33-6abbcd-ee--gg a = Covered Frequencies: 0 = All GNSS frequencies + L-Band (1525 - 1559 MHz) 1 - 9 = Reserved for future use bb = Antenna gain in dB: 35 or 50 c = Base Type 0 = Standard base 1 - 9 = Reserved for future use d = Options 0 = No options Example: 33-605000-01-xx-11 Is an antenna which covers all GNSS frequencies + L-Band, provides, 50 dB of gain, uses a standard base, has one TNC female connector and a white at top radome. For the TW6000 Family of Products Page 3 November 2015 Part Number Structure : 33-6abbcd-ee--gg Classification: "Lithium Coin" Chemical System: Lithium / Manganese Dioxide (Li/MnO2 ) Designation: ANSI / NEDA-5000LC, IEC-CR2016 Nominal Voltage: 3.0 Volts Typical Capacity: 90 mAh (to 2.0 volts) (Rated at 30K ohms at 21°C) Typical Weight: 1.9 grams (0.07 oz.) Typical Volume: 0.5 cubic centimeters (0.03 cubic inch) Max Rev Charge: 1 microampere Energy Density: 122 milliwatt hr/g, 464 milliwatt hr/cc Typical Li Content: 0.036 grams (0.0013 oz.) UL Recognized: MH29980 Operating Temp: -30C to 60C Self Discharge: ~1% / year Load Cutoff 2.0V (ohms) (hours) 30,000 928 Bkgnd Drain: Continuous 30K ohms 0.097 mA @2.9V Pulse Drain: 2 seconds X 12 times/day 400 ohms 6.8 mA @2.7V Lithium Coin ©Energizer Holdings, Inc. - Contents herein do not constitute a warranty. Typical Drains: at 2.9V (mA) 0.097 Pulse Test at 21°C (70°F) Typical Discharge Characteristics Internal Resistance Characteristics Important Notice This datasheet contains typical information specific to products manufactured at the time of its publication. ENERGIZER CR2016 Schedule: Simulated Application test Typical Performance at 21°C (70°F) Continuous Specifications mm (inches) Industry Standard Dimensions Safety: (1) KEEP OUT OF REACH OF CHILDREN. Swallowing may lead to serious injury or death in as little as 2 hours due to chemical burns and potential perforation of the esophagus. Immediately see doctor; have doctor phone (202) 625-3333. (2) Battery compartment design. To prevent children from removing batteries, battery compartments should be designed with one of the following methods: a) a tool such as screwdriver or coin is required to open battery compartment or b) the battery compartment door/cover requires the application of a minimum of two independent and simultaneous movements of the securing mechanism to open by hand. Screws should remain captive with the battery door or cover. PRODUCT DATASHEET 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 0 200 400 600 800 1000 Voltage, CCV Service, Hours Load: 30K ohms - Continuous Typical Drain @ 2.9V: 0.097 mA 0 20 40 60 80 100 120 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 0 10 20 30 40 50 60 70 80 90 100 IR, ohms Voltage, CCV Capacity, mAh IR Pulse Bkgnd 1-800-383-7323 USA/CAN www.energizer.com 1.60 (0.063) 1.40 (0.055) 1.47 (0.058) Ref. 1.22 (0.048) Ref. 8.00 (0.314) Minimum 19.80 (0.780) 20.00 (0.787) 0.20 (0.008) Maximum Ref. Permissible deflection from a flat. 0.08 (0.003) Minimum Ref. (Applies to top edge of gasket or edge of crimp, whichever is higher.) This Battery has Underwriters Laboratories component Recognition Form No. EBC - 4118H Page 1 of 1 *UY2KCCA { *UY2KCCA { * Weitere Prüfzeichen und zugeordnete Zulassungsdaten siehe Kapitel 15. Abschluss- und Zwischenplatte, 1 mm dick orange 2016-1392100 (4 x 25) grau 2016-1391100 (4 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 2-fach 2016-402 50 (2 x 25) 3-fach 2016-403 50 (2 x 25) 4-fach 2016-404 50 (2 x 25) 5-fach 2016-405 50 (2 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Warnabdeckung, mit schwarzem Blitzpfeil, für 5 Klemmen gelb 2016-115 50 (2 x 25) Prüfadapter, für Prüfstecker 4 mm Ø 2009-174 100 (4 x 25) Prüfabgriff, für max. 2,5 mm2 2009-182 100 (4 x 25) Beschriftungsstreifen, weiß, unbedruckt, auf Spule für mittige Beschriftung 11 mm breit 50 m 2009-110 1 300 m 2009-130 1 Abschluss- und Zwischenplatte, 1 mm dick orange 2016-1292100 (4 x 25) grau 2016-1291100 (4 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 2-fach 2016-402 50 (2 x 25) 3-fach 2016-403 50 (2 x 25) 4-fach 2016-404 50 (2 x 25) 5-fach 2016-405 50 (2 x 25) Kammbrücker, lichtgrau, isoliert, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Warnabdeckung, mit schwarzem Blitzpfeil, für 5 Klemmen gelb 2016-115 50 (2 x 25) Prüfadapter, für Prüfstecker 4 mm Ø 2009-174 100 (4 x 25) Prüfabgriff, für max. 2,5 mm2 2009-182 100 (4 x 25) Beschriftungsstreifen, weiß, unbedruckt, auf Spule für mittige Beschriftung 11 mm breit 50 m 2009-110 1 300 m 2009-130 1 Reduzierbrücken mit Reduzierbrücker Beim Reduzierbrücken ist immer eine Abschlussplatte zwischen den zu brückenden Klemmen zu setzen. Der Reduzierbrücker 2016-499 ist für das Reduzierbrücken von 16/10 mm2 auf 10/6/4/2,5 mm2 geeignet. Die Reduzierbrücker werden – wie auch bei den Kammbrückern üblich – von oben in die zu brückenden Klemmen bis zum Anschlag hineingesteckt. 3-Leiter-Durchgangsklemmen grau 2016-1301 20 blau 2016-1304 20 orange 2016-1302 20 3-Leiter-Schutzleiterklemme grün-gelb 2016-1307 20 4 Ex e II-Anwendungen in Vorbereitung Für Ex i-Anwendungen geeignet 2-Leiter-Durchgangsklemmen grau 2016-1201 20 blau 2016-1204 20 orange 2016-1202 20 2-Leiter-Schutzleiterklemme grün-gelb 2016-1207 20 4 Ex e II-Anwendungen in Vorbereitung Für Ex i-Anwendungen geeignet Bestell- Stück je Nr. Verp.-Einh. Bestell- Stück je Nr. Verp.-Einh. TOPJOB® S Reihenklemmen 16 (25 „f“) mm2 Serie 2016 Zubehör passende Beschriftungssysteme WMB/Mini-WSB/Beschriftungsstreifen (siehe Kapitel 14) ➊ anschließbar: 0,5 mm2 – 16 mm2 „e + f“, 25 mm2 „f“; direkt steckbar: 2,5 mm2 – 16 mm2 „e“ und 2,5 mm2 – 16 mm2 „Aderendhülse mit Kunststoffkragen, 18 mm“ Reduzierbrücker, lichtgrau, isoliert 57A 2016-499 50 (2 x 25) Reduzierbrücken mit Kammbrückern Das Reduzierbrücken über die offene Klemmenseite mit Abschlussplatte ist bei 16 mm2 und 10 mm2 bis zu zwei Querschnitte kleiner möglich und bei 6 / 4 und 2,5 mm2 um einen Querschnitt kleiner möglich; z.B. 16 mm2 auf 6 mm2 (siehe linke Abb.) oder 10 mm2 auf 4 mm2 . Das Reduzierbrücken über die Klemmenrückwand mit Abschlussplatte ist um zwei Querschnitte kleiner möglich; z.B. 16 mm2 auf 6 mm2 oder 6 mm2 auf 2,5 mm2 (siehe rechte Abb.) Reduzierbrücken Generell ist zu beachten: Der Summenstrom der Abgänge darf den Nennstrom des Reduzierbrückers/Kammbrückers nicht überschreiten. Bestell- Stück je Nr. Verp.-Einh. <_18_> <___________ 70 mm /2.76 in _________> <_________________ 92 mm /3.62 in ___________________> <___ 37 mm/ ___> 1.46 in <___ 37 mm/ ___> 1.46 in 0,5 – 16 (25 „f“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Klemmenbreite 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 0,5 – 16 (25 „f“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Klemmenbreite 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 1 1 11 *UY2KCCA { *UY2KCCA { * For further approvals with corresponding ratings see section 15. End and intermediate plate, 1 mm /0.039 in thick orange 2016-1392100 (4 x 25) grey 2016-1391100 (4 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 2-way 2016-402 50 (2 x 25) 3-way 2016-403 50 (2 x 25) 4-way 2016-404 50 (2 x 25) 5-way 2016-405 50 (2 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Protective warning marker, for 5 terminal blocks yellow 2016-115 100 (4 x 25) Test plug adapter, for test plug 4 mm Ø 2009-174 100 (4 x 25) Testing tap, for max. 2.5 mm2 2009-182 100 (4 x 25) Marker strip, white, plain for center marking 11 mm /0.433 in wide 50 m 2009-110 1 on roll 300 m 2009-130 1 End and intermediate plate, 1 mm /0.039 in thick orange 2016-1292100 (4 x 25) grey 2016-1291100 (4 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 2-way 2016-402 50 (2 x 25) 3-way 2016-403 50 (2 x 25) 4-way 2016-404 50 (2 x 25) 5-way 2016-405 50 (2 x 25) Push-in type jumper bars, light grey, insulated, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Protective warning marker, for 5 terminal blocks yellow 2016-115 100 (4 x 25) Test plug adapter, for test plug 4 mm Ø 2009-174 100 (4 x 25) Testing tap, for max. 2.5 mm2 2009-182 100 (4 x 25) Marker strip, white, plain for center marking 11 mm /0.433 in wide 50 m 2009-110 1 on roll 300 m 2009-130 1 Commoning with step-down jumpers An end plate must be applied between the two terminal blocks. Step-down jumper 2016-499 can be used for commoning AWG 8/6 (10/16 mm2 ) terminal blocks with AWG 8/10/12/14 (10/6/4/2.5 mm2 ) terminal blocks. Step-down jumpers are simply pushed down to full insertion, in the same way as all other push-in type jumper bars. 3-conductor through terminal blocks grey 2016-1301 20 blue 2016-1304 20 orange 2016-1302 20 3-conductor ground (earth) terminal block green-yellow 2016-1307 20 4 Ex e II applications are being prepared Suitable for Ex i applications 2-conductor through terminal blocks grey 2016-1201 20 blue 2016-1204 20 orange 2016-1202 20 2-conductor ground (earth) terminal block green-yellow 2016-1207 20 4 Ex e II applications are being prepared Suitable for Ex i applications Item Pack.-unit No. pcs Item Pack.-unit No. pcs TOPJOB® S Rail-Mounted Terminal Blocks 16 (25 ”f-st”) mm2 /AWG 4 Series 2016 Accessories appropriate marker system WMB/Miniature WSB/Marker strips (see section 14) ➊ Push-in conductor sizes: AWG 14 – 6 (2.5 mm2 – 16 mm2 ) “s“ and AWG 14 – 6 (2.5 mm2 – 16 mm2 ) ”insulated ferrules, 18 mm“ Step-down jumper, light grey, insulated 57 A 2016-499 50 (2 x 25) Commoning with step-down jumpers Note: The total current flowing must not exceed the rating of the step-down jumper/push-in type jumper bar. 0.5 – 16 (25 ”f-st“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Terminal block width 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 0.5 – 16 (25 ”f-st“) mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Terminal block width 12 mm / 0.472 in L 18 – 20 mm / 0.75 in Item Pack.-unit No. pcs Commoning with push-in type jumper bars Commoning over the open side of the terminal block with end plate allows jumpering over two cross section sizes for 16 mm2 and 10 mm2 and one cross section size for 6 mm2 , 4 mm2 and 2.5 mm2 : e.g. from 16 mm2 to 6 mm2 (see orange terminal blocks) or from 10 mm2 to 4 mm2 . Commoning over the closed side of the terminal block with end plate allows jumpering over two cross section sizes: e.g. from 16 mm2 to 6 mm2 or from 6 mm2 to 2.5 mm2 (see blue terminal blocks). <_18_> <___________ 70 mm /2.76 in _________> <_________________ 92 mm /3.62 in ___________________> <___ 37 mm/ ___> 1.46 in <___ 37 mm/ ___> 1.46 in 1 1 11 *UY2KCCA { *UY2KCCA { * Pour d’autres approbations avec les données techniques correspondantes, voir chapitre 15. Plaque d’extrémité et intermédiaire, épaisseur 1 mm orange 2016-1392100 (4 x 25) gris 2016-1391100 (4 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 2 pôles 2016-402 50 (2 x 25) 3 pôles 2016-403 50 (2 x 25) 4 pôles 2016-404 50 (2 x 25) 5 pôles 2016-405 50 (2 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Couverture protectrice de signalisation de danger, pour 5 bornes jaune 2016-115 50 (2 x 25) Adaptateur de test, pour fiche de contrôle Ø 4 mm 2009-174 100 (4 x 25) Prise de test pour 2,5 mm2 max. 2009-182 100 (4 x 25) Bandes de marquage, blanches, vierges, en rouleau pour marquage central largeur 11 mm 50 m 2009-110 1 300 m 2009-130 1 Plaque d’extrémité et intermédiaire, épaisseur 1 mm orange 2016-1292100 (4 x 25) gris 2016-1291100 (4 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 2 pôles 2016-402 50 (2 x 25) 3 pôles 2016-403 50 (2 x 25) 4 pôles 2016-404 50 (2 x 25) 5 pôles 2016-405 50 (2 x 25) Peigne de pontage enfichable, gris clair, isolé, IN 76 A 1 - 3 2016-433 50 (2 x 25) 1 - 4 2016-434 50 (2 x 25) 1 - 5 2016-435 50 (2 x 25) Couverture protectrice de signalisation de danger, pour 5 bornes jaune 2016-115 50 (2 x 25) Adaptateur de test, pour fiche de contrôle Ø 4 mm 2009-174 100 (4 x 25) Prise de test pour 2,5 mm2 max. 2009-182 100 (4 x 25) Bandes de marquage, blanches, vierges, en rouleau pour marquage central largeur 11 mm 50 m 2009-110 1 300 m 2009-130 1 Pontage avec pont réducteur Lors du pontage avec pont réducteur, il faut toujours prévoir une plaque d’extrémité entre les bornes à ponter. Le pont réducteur 2016-499 est prévu pour le pontage des bornes de 16/10 mm2 à 10/6/4/2,5 mm2 . Comme pour les peignes de pontage, les ponts réducteurs sont enfichés par le haut dans les bornes à ponter jusqu’à la butée. Bornes de passage pour 3 conducteurs gris 2016-1301 20 bleu 2016-1304 20 orange 2016-1302 20 Borne de protection pour 3 conducteurs vert-jaune 2016-1307 20 4 Applications Ex e II en préparation pour applications Ex i Bornes de passage pour 2 conducteurs gris 2016-1201 20 bleu 2016-1204 20 orange 2016-1202 20 Borne de protection pour 2 conducteurs vert-jaune 2016-1207 20 4 Applications Ex e II en préparation pour applications Ex i N° de Unité produit d’emballage N° de Unité produit d’emballage TOPJOB®S Bornes sur rail 16 (25 «s») mm2 Série 2016 Accessoires Système de marquage WMB/Mini-WSB/Bandes de repérage (voir chapitre 14) ➊ Raccordement possible : 0,5 mm2 – 16 mm2 «r+ s»; 25 mm2 «s»; Enfichage direct : 2,5 mm2 – 16 mm2 «r» et 2,5 mm2 – 16 mm2 «Embout d’extrémité avec rebord en plastique, 18 mm» Pont réducteur, gris clair, isolé 57A 2016-499 50 (2 x 25) Pontage avec pont réducteur Remarque : D’une manière générale, le courant total des sorties ne doit pas dépasser le courant nominal du pont réducteur/peigne de pontage. N° de Unité produit d’emballage <_18_> <___________ 70 mm /2.76 in _________> <_________________ 92 mm /3.62 in ___________________> <___ 37 mm/ ___> 1.46 in <___ 37 mm/ ___> 1.46 in Pontage avec peignes de pontage Pour les sections de 16 mm2 et 10 mm2 , le pontage avec ponts réducteurs par la face ouverte de la borne avec plaque d’extrémité est possible jusqu’à deux sections inférieures le pour les bornes de 6 / 4 et 2,5 mm2 jusqu’à une section inférieure. Ex. : de 16 mm2 à 6 mm2 (voir fig. à gauche), de 10 mm2 à 4 mm2 ou de 10 à 4 mm2 . Le pontage avec ponts réducteurs par la face arrière de la borne avec plaque d’extrémité est possible jusqu’à deux sections inférieures. Ex. : de 16 mm2 à 6 mm2 ou de 6 mm2 à 2,5 mm2 (voir fig. à droite). 0,5 – 16 (25 «s») mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Largeur des bornes 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 0,5 – 16 (25 «s») mm2➊ AWG 20 – 4 800 V/8 kV/3 600 V, 85 A U 76 A 600 V, 85 A 2 Largeur des bornes 12 mm / 0.472 in L 18 – 20 mm / 0.75 in 1. General description The 74HC257; 74HCT257 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). The 74HC257 and 74HCT257 have four identical 2-input multiplexers with 3-state outputs, which select 4 bits of data from two sources and are controlled by a common data select input (S). The data inputs from source 0 (1I0 to 4I0) are selected when input S is LOW and the data inputs from source 1 (1I1 to 4I1) are selected when S is HIGH. Data appears at the outputs (1Y to 4Y) in true (non-inverting) form from the selected inputs. The 74HC257 and 74HCT257 are the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to S. The outputs are forced to a high-impedance OFF-state when OE is HIGH. The logic equations for the outputs are: Except for their non-inverting (true) outputs the 74HC257; 74HCT257 are identical to the 74HC258. 2. Features and benefits  Non-inverting data path  3-state outputs interface directly with system bus  Complies with JEDEC standard no. 7A  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  Multiple package options  Specified from 40 C to +85 C and from 40 C to +125 C 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Rev. 6 — 26 January 2015 Product data sheet 1Y OE 1I1 S =      1I0  S 2Y OE 2I1 S =      2I0  S 3Y OE 3I1 S =      3I0  S 4Y OE 4I1 S =      4I0  S 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 2 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 3. Ordering information 4. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC257N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HCT257N 74HC257D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HCT257D 74HC257DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HCT257DB 74HC257PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 74HCT257PW Fig 1. Logic symbol Fig 2. IEC logic symbol PJD 6 2( < < < <               , , , , , , , , DDG   *  08;              (1 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 3 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 3. Functional diagram PJU 6 ,  <  ,  6(/(&725 67$7(08/7,3/(;(52873876 ,  <  ,  ,  <  ,  ,  <  ,   2( Fig 4. Logic diagram DDG < 6 2( , , , , , , , , < < < 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 4 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Functional description 6.1 Function table [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. Fig 5. Pin configuration DIP16, SO16, SSOP16 and TSSOP16 +& +&7 6 9&& , 2( , , < , , < , , < , *1' < DDG                 Table 2. Pin description Symbol Pin Description S 1 common data select input 1I0 to 4I0 2, 5, 11, 14 data input from source 0 1I1 to 4I1 3, 6, 10, 13 data input from source 1 1Y to 4Y 4, 7, 9, 12 3-state multiplexer output GND 8 ground (0 V) OE 15 3-state output enable input (active LOW) VCC 16 supply voltage Table 3. Function table[1] Control Input Output OE S nl0 nl1 nY HXXXZ L HXL L L HXHH LLLXL L L HXH 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 5 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 7. Limiting values [1] For DIP16 packages: above 70 C, Ptot derates linearly with 12 mW/K. [2] For SO16 packages: above 70 C, Ptot derates linearly with 8 mW/K. [3] For SSOP16 and TSSOP16 packages: above 60 C, Ptot derates linearly with 5.5 mW/K. 8. Recommended operating conditions Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.5 +7 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V - 20 mA IO output current VO = 0.5 V to VCC + 0.5 V - 35 mA ICC supply current - +70 mA IGND ground current - 70 mA Tstg storage temperature 65 +150 C Ptot total power dissipation DIP16 package [1] - 750 mW SO16 package [2] - 500 mW SSOP16 package [3] - 500 mW TSSOP16 package [3] - 500 mW Table 5. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit 74HC257 VCC supply voltage 2.0 5.0 6.0 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V t/V input transition rise and fall rates VCC = 2.0 V - - 625 ns VCC = 4.5 V - 1.67 139 ns VCC = 6.0 V - - 83 ns Tamb ambient temperature 40 - +125 C 74HCT257 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - VCC V VO output voltage 0 - VCC V t/V input transition rise and fall rates VCC = 4.5 V - 1.67 139 ns Tamb ambient temperature 40 - +125 C 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 6 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC257 VIH HIGH-level input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VIL LOW-level input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = 6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = 7.8 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 - 1.0 1.0 1.0 A IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND; VCC = 6.0 V - - 0.5 - 5.0 10.0 10.0 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 160 160 A Ci input capacitance - 3.5 - pF 74HCT257 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V IO = 6 mA 3.98 4.32 - 3.84 - 3.7 - V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V - 0.1 - 0.1 IO = 20 A - 0 0.1 - 0.33 - 0.4 V IO = 6.0 mA - 0.15 0.26 - 1.0 - 1.0 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 - 5.0 - 10 A 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 7 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 10. Dynamic characteristics IOZ OFF-state output current VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO =0A - - 0.5 - 80 - 160 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 8.0 A ICC additional supply current VI = VCC  2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO =0A per input pin; nI0, nI1 inputs - 40 144 - 180 - 196 A per input pin; OE input - 135 486 - 608 - 662 A per input pin; S input - 70 252 - 315 - 343 A CI input capacitance - 3.5 - pF Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Typ Max Max Max 74HC257 tpd propagation delay nl0 to nY or nl1 to nY; see Figure 6 [1] VCC = 2.0 V 36 110 140 165 ns VCC = 4.5 V 13 22 28 33 ns VCC = 5.0 V; CL = 15 pF 11 - - - ns VCC = 6.0 V 10 19 24 28 ns S to nY; see Figure 6 VCC = 2.0 V 47 150 190 225 ns VCC = 4.5 V 17 30 38 45 ns VCC = 5.0 V; CL = 15 pF 14 - - - ns VCC = 6.0 V 14 26 33 38 ns ten enable time OE to nY; see Figure 7 [2] VCC = 2.0 V 33 150 190 225 ns VCC = 4.5 V 12 30 38 45 ns VCC = 6.0 V 10 26 33 38 ns tdis disable time OE to nY; see Figure 7 [3] VCC = 2.0 V 41 150 190 225 ns VCC = 4.5 V 15 30 38 45 ns VCC = 6.0 V 12 26 33 38 ns 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 8 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state [1] tpd is the same as tPHL, tPLH. [2] ten is the same as tPZH, tPZL. [3] tdis is the same as tPHZ, tPLZ. [4] tt is the same as tTHL, tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL  VCC2  fo) = sum of outputs. tt transition time see Figure 6 [4] VCC = 2.0 V 14 60 75 90 ns VCC = 4.5 V 5 12 15 18 ns VCC = 6.0 V 4 10 13 15 ns CPD power dissipation capacitance per multiplexer; VI = GND to VCC [5] 45 - pF 74HCT257 tpd propagation delay nl0 to nY or nl1 to nY; see Figure 6 [1] VCC = 4.5 V 16 30 38 45 ns VCC = 5.0 V; CL = 15 pF 13 - - ns S to nY; see Figure 6 VCC = 4.5 V 20 35 44 53 ns VCC = 5.0 V; CL = 15 pF 17 - ns ten enable time OE to nY; VCC = 4.5 V; see Figure 7 [2] 15 30 38 45 ns tdis disable time OE to nY; VCC = 4.5 V; see Figure 7 [3] 16 30 38 45 ns tt transition time VCC = 4.5 V; see Figure 6 [4] 5 12 15 18 ns CPD power dissipation capacitance per multiplexer; VI = GND to VCC  1.5 V [5] 45 - pF Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Typ Max Max Max 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 9 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 11. Waveforms Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Propagation delays input (S, nI0, nI1) to output (nY) and output (nY) transition times DDG W3+/ W3/+ 90 90   90 90 RXWSXW Q< LQSXW 6Q,Q, 9, *1' 92+ 92/ W7+/ W7/+ Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. 3-state output enable and disable times DDF W3/= W3+= RXWSXWV GLVDEOHG RXWSXWV HQDEOHG   RXWSXWV HQDEOHG 2(LQSXW 9, 9&& 92/ 92+ *1' *1' 90 W3=/ W3=+ 90 90 RXWSXW /2:WR2)) 2))WR/2: RXWSXW +,*+WR2)) 2))WR+,*+ WU WI   Table 8. Measurement points Type Input Output VM VM 74HC257 0.5VCC 0.5VCC 74HCT257 1.3 V 1.3 V 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 10 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Measurement points are given in Table 8 and test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistor. Fig 8. Test circuit for measuring switching times 90 90 W: W:   9 9, 9, QHJDWLYH SXOVH SRVLWLYH SXOVH 9 90 90   WI WU WU WI DDG '87 9&& 9&& 9, 92 57 5/ 6 &/ RSHQ * Table 9. Test data Type Input Load Switch position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC257 VCC 6 ns 50 pF 1 k open GND VCC 74HCT257 3 V 6 ns 50 pF 1 k open GND VCC 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 11 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 12. Package outline Fig 9. Package outline SOT38-4 (DIP16) 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ 627   0+ F H  0( $ / VHDWLQJSODQH $ Z 0 E E H ' $ =     ( SLQLQGH[ E   PP VFDOH 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG 81,7 $ PD[   E    E F ' ( H 0 = / + PP ',0(16,216 LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV $ PLQ $ PD[ E PD[ H 0( Z                         LQFKHV                            ',3SODVWLFGXDOLQOLQHSDFNDJHOHDGV PLO 627 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 12 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 10. Package outline SOT109-1 (SO16) ; Z 0 ș $ $ $ ES ' +( /S 4 GHWDLO; ( = H F / Y 0 $ $  $     \ SLQLQGH[ 81,7 $ PD[ $ $ $ ES F '  (   H +( / /S 4 Y Z \ = ș 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ PP LQFKHV                        R R   ',0(16,216 LQFKGLPHQVLRQVDUHGHULYHGIURPWKHRULJLQDOPPGLPHQVLRQV 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPP LQFK PD[LPXPSHUVLGHDUHQRWLQFOXGHG   627   ( 06                                PP VFDOH 62SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 13 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 11. Package outline SOT338-1 (SSOP16) 81,7 $ $ $ ES F '  (  H +( / /S 4 Y Z \ = ș 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ PP                          R    R ',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 627    Z 0 ES ' +( ( = H F Y 0 $ ; $ \     ș $ $ $ /S 4 GHWDLO; / $  02 SLQLQGH[   PP VFDOH 6623SODVWLFVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 $ PD[  74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 14 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 12. Package outline SOT403-1 (TSSOP16) 81,7 $ $ $ ES F '  (   H +( / /S 4 Y Z \ = ș 287/,1( 5()(5(1&(6 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ PP                      R     R ',0(16,216 PPDUHWKHRULJLQDOGLPHQVLRQV 1RWHV 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFLQWHUOHDGSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG   627 02   Z 0 ES ' = H      ș $ $ $ /S 4 GHWDLO; / $  +( ( F Y 0 $ ; $ \   PP VFDOH 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 627 $ PD[  SLQLQGH[ 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 15 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 13. Abbreviations 14. Revision history Table 10. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT257 v.6 20150126 Product data sheet - 74HC_HCT257 v.5 Modifications: • Table 7: Power dissipation capacitance condition for 74HCT257 is corrected. 74HC_HCT257 v.5 20100113 Product data sheet - 74HC_HCT257 v.4 Modifications: • Table 7: changed 3OE to OE 74HC_HCT257 v.4 20090608 Product data sheet - 74HC_HCT257 v.3 74HC_HCT257 v.3 20050920 Product data sheet - 74HC_HCT257_CNV v.2 74HC_HCT257_CNV v.2 19980930 Product specification - - 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 16 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 15. Legal information 15.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. 74HC_HCT257 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 26 January 2015 17 of 18 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 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The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 January 2015 Document identifier: 74HC_HCT257 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Recommended operating conditions. . . . . . . . 5 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16 Contact information. . . . . . . . . . . . . . . . . . . . . 17 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 31 PolyZen Devices 5 PolyZen devices are polymer enhanced precision Zener diode micro-assemblies that help protect sensitive electronics from damage caused by inductive voltage spikes, voltage transients, use of incorrect power supplies and reverse bias. The PolyZen micro-assembly incorporates a stable Zener diode for precise voltage clamping and a resistively non-linear, polymeric positive temperature coefficient (PPTC) layer that responds to either diode heating or overcurrent events by transitioning from a low to high resistance state. PolyZen devices help provide resettable protection against damage caused by multi-watt fault events and require only 0.7W power dissipation. In the event of sustained high power conditions, the PPTC element of the device “trips” to limit current and generate voltage drop. This functionality helps protect both the Zener and the follow-on electronics, effectively increasing the diode’s power handling capacity. • Helps shield downstream electronics from overvoltage and reverse bias • Trip events shut out overvoltage and reverse bias sources • Analog nature of trip events minimize upstream inductive spikes • Helps reduce design costs with single component placement and minimal heat sinking requirements • RoHS compliant • Overvoltage transient suppression • Hold currents up to 2.3A • Time delayed, overvoltage trip • Time delayed, reverse bias trip • Power handling on the order of 30 watts • Integrated device construction • Portable media players • Global positioning systems • Hard disk drives 5V & 12V bus • Solid State Drives (SSD) 5V bus PolyZen Devices Polymer Protected Zener Diode Benefits Features Applications • Cellphone charger port and USB power • Automotive peripheral input power • DC power port protection • Industrial handheld POS 32 RoHS Compliant, ELV Compliant 5 (Performance ratings @ 25°C unless otherwise specified) + Power Supply (External or internal) GND 1 2 3 Regulated Output Protected downstream electronics VOUT VIN RLOAD Protected Electronics PolyZen Device Polymer PTC GND Zener Diode VIN VOUT GND VIN VOUT IPTC IOUT IFLT ZEN056V130A24LS 5.45 5.60 5.75 0.10 1.30 0.12 0.16 24V 3A +10/-40 +24/-16V ZEN059V130A24LS† 5.80 5.90 6.00 0.10 1.30 0.12 0.15 24V 3A +6/-40 +24/-16V ZEN065V130A24LS 6.35 6.50 6.65 0.10 1.30 0.12 0.16 24V 3A +6/-40 +24/-16V ZEN098V130A24LS 9.60 9.80 10.00 0.10 1.30 0.12 0.16 24V 3A +3.5/-40 +24/-16V ZEN132V130A24LS 13.20 13.40 13.60 0.10 1.30 0.12 0.16 24V 3A +2/-40 +24/-16V ZEN164V130A24LS 16.10 16.40 16.60 0.10 1.30 0.12 0.16 24V 3A +1.25/-40 +24/-16V ZEN056V230A16LS 5.45 5.60 5.75 0.10 2.30 0.04 0.06 16V 5A +5/-40 +16/-12V ZEN065V230A16LS 6.35 6.50 6.65 0.10 2.30 0.04 0.06 16V 5A +3.5/-40 +16/-12V ZEN098V230A16LS 9.60 9.80 10.00 0.10 2.30 0.04 0.06 16V 5A +3.5/-40 +16/-12V ZEN132V230A16LS 13.20 13.40 13.60 0.10 2.30 0.04 0.06 16V 5A +2/-40 +20/-12V ZEN056V075A48LS 5.45 5.60 5.75 0.10 0.75 0.28 0.45 48V 3A +10/-40 +48/-16V ZEN132V075A48LS 13.20 13.40 13.60 0.10 0.75 0.28 0.45 48V 3A +2/-40 +48/-16V ZEN056V115A24LS 5.45 5.60 5.75 0.10 1.15 0.15 0.18 24V 3A +10/-40 +24/-16V ZEN056V130A24GS* 5.45 5.60 5.75 0.10 1.30 0.12 0.18 24V 3A +6/-40 +24/-16V * Module height is 1.25mm. Module height of all other part numbers is 2.0mm. † Typical operating current is 500µA @ 5.0V which meets USB suspend mode requirement. Part Number VZ(V) Min. Typ. Max. IZt (A) IHOLD @ 20°C (A) RTyp (Ω) R1MAX (Ω) VINT MAX Test VINT MAX Current (V) (A) IFLT MAX Test IFLT MAX Voltage (A) (V) VZ Zener clamping voltage measured at current IZt and 20°C. IZt Test current at which VZ is measured. IHOLD Maximum steady state current IPTC that will not generate a trip event at the specified temperature. Ratings assume IFLT = 0A. RTyp Typical resistance between VIN and VOUT pins when the device is at room temperature. R1MAX The maximum resistance between VIN and VOUT pins, at room temperature, one hour after first trip or after reflow soldering. IFLT Current flowing through the Zener diode. IFLT MAX Maximum RMS fault current the Zener diode component of the device can withstand and remain resettable; testing is conducted at rated voltage with no load connected to VOUT. VINT MAX The voltage (VIN - VOUT “post trip”) at which typical qualification devices (98% devices, 95% confidence) survived at least 100 trip cycles and 24 hours trip endurance when “tripped” at the specified voltage and current (IPTC). IPTC Current flowing through the PTC portion of the circuit. IOUT Current flowing out the VOUT pin of the device. Trip Event A condition where the PTC transitions to a high resistance state, thereby limiting IPTC, and significantly increasing the voltage drop between VIN and VOUT. Figure PZ1 Typical Application Block Diagram for PolyZen Devices Table PZ1 Electrical Characteristics for PolyZen Devices Table PZ2 Definitions of Terms for PolyZen Devices 33 PolyZen Devices RoHS Compliant, ELV Compliant 5 VOUT Peak vs IFLT RMS (IOUT = 0) I FLT RMS (A) 0 12 34 56789 10 VOUT Peak (V) 22.0 20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0 A = ZEN056V230A16LS B = ZEN065V230A16LS C = ZEN098V230A16LS D = ZEN132V230A16LS A B C D VOUT Peak vs IFLT RMS (IOUT = 0) VOUT Peak (V) I FLT RMS (A) A B C 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 -50 -40 -30 -20 -10 0 A = ZENxxxV1yyA24LS/GS B = ZENxxxV230A16LS C = ZENxxxV075A48LS Figure PZ6 Figure PZ4 VOUT Peak vs IFLT RMS (IOUT = 0) VOUT Peak (V) I FLT RMS (A) 0 12 34 56789 10 22.0 20.0 18.0 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0 A = ZEN056V1yyA24LS/GS B = ZEN059V130A24LS C = ZEN065V130A24LS D = ZEN098V130A24LS E = ZEN132V130A24LS F = ZEN164V130A24LS B A C D E F 0 12 34 56789 10 Time-to-Trip vs IFLT RMS (IOUT = 0) Time-to-Trip (Sec) I FLT RMS (A) 10 1 0.1 0.01 A = ZEN056V1yyA24LS/GS B = ZEN059V130A24LS C = ZEN065V130A24LS D = ZEN098V130A24LS E = ZEN132V130A24LS F = ZEN164V130A24LS A D C B E F Figure PZ2 Figure PZ3 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 IHOLD (A) AmbientTemperature (˚C) Temperature Effect on IHOLD (IFLT = 0) A C D B A = ZENxxxV130A24LS/GS B = ZENxxxV230A16LS C = ZENxxxV075A48LS D = ZENxxxV115A24LS Figure PZ8 0 12 34 56789 10 Time-to-Trip vs IFLT RMS (IOUT = 0) Time-to-Trip (Sec) I FLT RMS (A) 100 10 1 0.1 0.01 A = ZEN056V230A16LS B = ZEN065V230A16LS C = ZEN098V230A16LS D = ZEN132V230A16LS A B D C Time-to-Trip vs IFLT RMS (IOUT = 0) Time-to-Trip (Sec) I FLT RMS (A) -50 -40 -30 -20 -10 0 100 10 1 0.1 0.01 0.001 A B C A = ZENxxxV1yyA24LS/GS B = ZENxxxV230A16LS C = ZENxxxV075A48LS Figure PZ7 Figure PZ5 Time-to-Trip (Sec) 0 5 10 15 20 25 30 35 40 45 10 1 0.1 0.01 0.001 IPTC RMS (A) Time-to-Trip vs IPTC RMS (IFLT = 0) A B C A = ZENxxxV1yyA24LS/GS B = ZENxxxV230A16LS C = ZENxxxV075A48LS Figure PZ9 Figure PZ2-PZ9 Typical Performance Curves for PolyZen Devices 34 RoHS Compliant, ELV Compliant 5 Operating temperature range -40° to +85°C Storage temperature -40° to +85°C ESD withstand 15kV Human body model Diode capacitance 4200pF Typical @ 1MHz, 1V RMS Construction RoHS compliant 35 30 25 20 15 10 5 0 350 300 250 200 150 100 50 0 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 Voltage (V) and Current (A) Power (Watts) Time (Sec) Hot-Plug Response ZEN056V130A24LS vs a 22V/120W Universal Power Supply Capacitive Current Spike VOUT Peak Current Pulled to GND via diode Supply Voltage dropped by current Supply Voltage returns to normal PPTC switches to high resistance Output Voltage remains clamped A A D D B B C C A = VIN B = VOUT C = CURRENT (IFLT) D = POWER Figure PZ10 Figure PZ10-PZ23 Basic Operation Examples for PolyZen Devices 24 22 20 18 16 14 12 10 8 6 4 2 0 Voltage (V) or Current (A) Typical Fault Response: ZEN059V130A24LS 24V / 6A Current Limited Source (IOUT=0) 0.02 0.05 0.10 0.15 Time (s) A B C A = VIN (V) B = VOUT (V) C = IFLT (A) Figure PZ12 20 18 16 14 12 10 8 6 4 2 0 -0.02 0.02 0.06 0.10 0.14 0.18 Voltage (V) or Current (A) Typical Fault Response: ZEN056V1xxA24LS 20V, 3.5A Current Limited Source (IOUT=0) Time (s) A B C A = VIN (V) B = VOUT (V) C = IFLT (A) Figure PZ11 24 22 20 18 16 14 12 10 8 6 4 2 0 Voltage (V) or Current (A) Typical Fault Response: ZEN098V130A24LS 24V, 3.5A Current Limited Source (IOUT=0) 0 0.05 0.10 0.15 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C Figure PZ14 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Voltage (V) or Current (A) Typical Fault Response: ZEN065V130A24LS 24V, 5.0A Current Limited Source (IOUT=0) 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C Figure PZ13 Table PZ3 General Characteristics for PolyZen Devices 35 PolyZen Devices RoHS Compliant, ELV Compliant 20 5 15 10 5 0 Voltage (V) or Current (A) Typical Fault Response: ZEN056V230A16LS 16V, 5.0A Current Limited Source (IOUT=0) 0 0.10 0.20 0.30 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C 18 16 14 12 10 8 6 4 2 0 Voltage (V) or Current (A) Typical Fault Response: ZEN098V230A16LS 16V, 3.5A Current Limited Source (IOUT=0) 0 0.05 0.10 0.15 0.20 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C Figure PZ19 Figure PZ17 30 25 20 15 10 5 0 Voltage (V) or Current (A) Typical Fault Response: ZEN132V130A24LS 24V, 2.0A Current Limited Source (IOUT=0) 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C 30 25 20 15 10 5 0 Voltage (V) or Current (A) Typical Fault Response: ZEN164V130A24LS 24V, 1.0A Current Limited Source (IOUT=0) 0 0.10 0.20 0.30 0.40 0.50 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C Figure PZ15 Figure PZ16 50 40 30 20 10 0 Voltage (V) or Current (A) Typical Fault Response: ZEN056V075A48LS 48V, 10.0A Current Limited Source (IOUT=0) 0 0.01 0.02 0.03 0.04 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C Figure PZ21 20 15 10 5 0 Voltage (V) or Current (A) Typical Fault Response: ZEN065V230A16LS 16V, 3.5A Current Limited Source (IOUT=0) 0 0.10 0.20 0.30 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C Voltage (V) or Current (A) 22 20 18 16 14 12 10 8 6 4 2 0 Typical Fault Response: ZEN132V230A16LS 20V, 2.0A Current Limited Source (IOUT=0) 0 0.05 0.10 0.15 0.20 0.25 0.30 Time (s) A = VIN (V) B = VOUT (V) C = IFLT (A) A B C Figure PZ20 Figure PZ18 50 45 40 35 30 25 20 15 10 5 0 Voltage (V) or Current (A) Typical Fault Response: ZEN132V075A48LS 48V, 2.0A Current Limited Source (IOUT=0) A = VIN (V) B = VOUT (V) C = IFLT (A) 0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 Time (s) A B C Figure PZ22 Figure PZ16-PZ23 Basic Operation Examples for PolyZen Devices Cont’d 36 RoHS Compliant, ELV Compliant 5 Part Number Bag Quantity Tape & Reel Quantity Standard Package ZENxxxVyyyAzzLS - 3,000 15,000 ZENxxxVyyyAzzGS - 4,000 20,000 mm 3.85 4.15 3.85 4.15 1.40 2.00 inch (0.152) (0.163) (0.152) (0.163) (0.055) (0.081) A Min. Max. B Min. Max. C Min. Max. C B A ZENxxxVyyyAzzLS Devices mm 3.85 4.15 3.85 4.15 1.16 1.25 inch (0.152) (0.163) (0.152) (0.163) (0.046) (0.049) L Min. Max. W Min. Max. H Min. Max. ZENxxxVyyyAzzGS Devices L W H Table PZ4 Packaging and Marking Information for PolyZen Devices Table PZ5 Dimensions for PolyZen Devices in Millimeters (Inches) 24 22 20 18 16 14 12 10 8 6 4 2 0 Voltage (V) or Current (A) Typical Fault Response: ZEN056V130A24GS 24V, 1.0A Current Limited Source (IOUT=0) A = VIN (V) B = VOUT (V) C = IFLT (A) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (s) A B C Figure PZ23 Figure PZ16-PZ23 Basic Operation Examples for PolyZen Devices Cont’d 37 PolyZen Devices RoHS Compliant, ELV Compliant 5 Pin Number Pin Name Pin Function 1 VIN VIN = Protected input to Zener diode 2 GND GND = Ground 3 VOUT VOUT = Zener regulated voltage output 2 GND 3 VOUT VIN 1 Pin Configuration (Top View) 2.21mm (0.087”) 0.56mm (0.022”) 2.88mm (0.1135”) 0.56mm (0.022”) 0.33mm (0.013”) 0.94mm (0.037”) 0.94mm (0.037”) Pad Dimensions Solder Reflow and Rework Recommendation for PolyZen Devices Critical Zone TL Ramp up to Tp t 25˚C to Peak Reflow Profile Time Ramp down ts Preheat TsMAX TL Tp tp 25 TsMIN t L Temperature Figure PZ24 Classification Reflow Profiles Profile Feature Pb-Free Assembly Average ramp up rate (TsMAX toTp) 3°C/second max. Preheat • Temperature min. (TsMIN) 150°C • Temperature max. (TsMAX) 200°C • Time (tsMIN to tsMAX) 60-180 seconds Time maintained above: • Temperature (TL) 217°C • Time (tL) 60-150 seconds Peak/Classification temperature (Tp) 260°C Time within 5°C of actual peak temperature Time (tp) 20-40 seconds Ramp down rate 6°C/second max. Time 25°C to peak temperature 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Table PZ6 Pad Layout and Configuration Information for PolyZen Devices 38 RoHS Compliant, ELV Compliant 5 ZEN 056V 130A 24 LS & GS Special Labeling LS = Module Height of 2.0mm GS = Module Height of 1.25mm VINT Max Rating (24 = 24V) PPTC Hold Current Group (130 = 1.3A) Zener Voltage Group (056 = 5.6V) PolyZen Series Part Numbering System for PolyZen Devices 102.0 Ref NMin AMax W2 (measured at hub) W1 (measured at hub) Matte Finish These Area Lock Feature (6 places) See “Detail A” Detail A ø20.0 Min ø13.0 +0.5 –0.2 2.0 +/– 0.5 330.0 +0.25 –4.00 Description Dimension (mm) AMax 330 NMin 102 W1 8.4 W2 11.1 Figure PZ26 Reel Dimensions for PolyZen Devices (in Millimeters) Description ZENxxxVyyyAzzLS Devices ZENxxxVyyyAzzGS Devices A0 4.35 4.35 B0 4.35 4.35 K0 2.30 1.80 A0 B0 K0 2.00 ± 0.05 0.35 ± 0.05 Note 3 4.00Note 1 8.00 ø1.5 + 0.1 / -0.0 ø1.50 Min 0.25 R 0.25 12.0 ± 0.3 5.50 ± 0.05Note 3 A 1.75 ± 0.10 A R 0.3 Max Notes: 1. 10 sprocket hole pitch cumulative tolerance ±0.2 2. Camber in compliance with EIA 481 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole Tape and Reel Specifications for PolyZen Devices (in Millimeters) Figure PZ25 EIA Referenced Taped Component Dimensions for PolyZen Devices (in Millimeters) 39PolyZen Devices RoHS Compliant, ELV Compliant 5 Warning : All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies (“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TE’s only obligations are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition,TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. Part Marking System for PolyZen Devices tnnn 12345 Zener Diode Voltage Rating nnn = 056 (5.6V) nnn = 059 (5.9V) nnn = 065 (6.5V) nnn = 098 (9.8V) nnn = 132 (13.4V) nnn = 164 (16.4V) Batch Number ZENxxxVyyyAzzLS Devices tnnn 1234567 Zener Diode Voltage Rating nnn = 056 (5.6V) Batch Number ZENxxxVyyyAzzGS Devices 40 5 1. General description The 74HC259; 74HCT259 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard No. 7-A. The 74HC259; 74HCT259 are high-speed 8-bit addressable latches designed for general-purpose storage applications in digital systems. They are multifunctional devices capable of storing single-line data in eight addressable latches. They provide a 3-to-8 decoder and multiplexer function with active HIGH outputs (Q0 to Q7). They also incorporate an active LOW common reset (MR) for resetting all latches as well as an active LOW enable input (LE). The 74HC259; 74HCT259 has four modes of operation: • Addressable latch mode, in this mode data on the data line (D) is written into the addressed latch. The addressed latch follows the data input with all non-addressed latches remaining in their previous states. • Memory mode, in this mode all latches remain in their previous states and are unaffected by the data or address inputs. • Demultiplexing mode (or 3-to-8 decoding), in this mode the addressed output follows the state of the data input (D) with all other outputs in the LOW state. • Reset mode, in this mode all outputs are LOW and unaffected by the address inputs (A0 to A2) and data input (D). When operating the 74HC259; 74HCT259 as an address latch, changing more than one address bit could impose a transient wrong address. Therefore, this should only be done while in the Memory mode. 2. Features and benefits  Combined demultiplexer and 8-bit latch  Serial-to-parallel capability  Output from each storage bit available  Random (addressable) data entry  Easily expandable  Common reset input  Useful as a 3-to-8 active HIGH decoder  Input levels:  For 74HC259: CMOS level  For 74HCT259: TTL level 74HC259; 74HCT259 8-bit addressable latch Rev. 5 — 7 August 2012 Product data sheet 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 2 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  CDM JESD22E exceeds 1000 V  Multiple package options  Specified from 40 C to +85 C and from 40 C to +125 C 3. Ordering information 4. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC259N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HCT259N 74HC259D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HCT259D 74HC259DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HCT259DB 74HC259PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 74HCT259PW 74HC259BQ 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5  3.5  0.85 mm SOT763-1 74HCT259BQ Fig 1. Logic symbol Fig 2. IEC logic symbol mna573 D A0 A1 A2 MR LE Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 14 15 12 11 10 9 7 6 5 4 3 2 1 13 mna572 1 9,10D Z9 G8 G10 C10 8R 13 15 14 0 1 2 3 1 2 0 DX 0 7 2 3 4 5 4 6 7 9 10 11 12 5 6 7 G 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 3 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 5. Pinning information 5.1 Pinning Fig 3. Functional diagram mna571 8 LATCHES 1-of-8 DECODER Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 12 11 10 9 7 6 5 4 A0 A1 A2 LE MR 13 D 15 14 3 2 1 (1) The die substrate is attached to this pad using conductive die attach material. It cannot be used as supply pin or input. Fig 4. Pin configuration (DIP16, SO16, SSOP16 and TSSOP16) Fig 5. Pin configuration (DHVQFN16) 74HC259 74HCT259 A0 VCC A1 MR A2 LE Q0 D Q1 Q7 Q2 Q6 Q3 Q5 GND Q4 001aaj444 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 001aaj445 74HC259 74HCT259 Q3 Q5 Q2 Q6 Q1 Q7 Q0 D A2 LE A1 MR GNDQ4 A0 VCC Transparent top view GND(1) 7 10 6 11 5 12 4 13 3 14 2 15 8 9 1 16 terminal 1 index area 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 4 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 5.2 Pin description 6. Functional description [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; d = HIGH or LOW data one set-up time prior to the LOW-to-HIGH LE transition; q = lower case letter indicates the state of the referenced input one set-up time prior to the LOW-to-HIGH transition. Table 2. Pin description Symbol Pin Description A0, A1, A2 1, 2, 3 address input Q0, Q1, Q2, Q3, Q4, Q5, Q6, Q7 4, 5, 6, 7, 9, 10, 11, 12 latch output GND 8 ground (0 V) D 13 data input LE 14 latch enable input (active LOW) MR 15 conditional reset input (active LOW) VCC 16 supply voltage Table 3. Function table[1] Operating mode Input Output MR LE D A0 A1 A2 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Reset (clear) L H X X X X L L L L L L L L Demultiplexer (active HIGH 8-channel) decoder (when D = H) L L d L L L Q=d L L L L L L L L L d H L L L Q=d L L L L L L L L d L H L L L Q=d L L L L L L L d H H L L L L Q=d L L L L L L d L L H L L L L Q=d L L L L L d H L H L L L L L Q=d L L L L d L H H L L L L L L Q=d L L L d H H H L L L L L L L Q=d Memory (no action) H H X X X X q0 q1 q2 q3 q4 q5 q6 q7 Addressable latch H L d L L L Q = d q1 q2 q3 q4 q5 q6 q7 HL d HL L q0 Q=d q2 q3 q4 q5 q6 q7 HL d L HL q0 q1 Q=d q3 q4 q5 q6 q7 HL d HHL q0 q1 q2 Q=d q4 q5 q6 q7 HL d L L Hq0 q1 q2 q3 Q=d q5 q6 q7 HL d HL Hq0 q1 q2 q3 q4 Q=d q6 q7 HL d L HHq0 q1 q2 q3 q4 q5 Q=d q7 HL d HHHq0 q1 q2 q3 q4 q5 q6 Q=d 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 5 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch [1] H = HIGH voltage level; L = LOW voltage level. 7. Limiting values [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] Ptot derates linearly with 12 mW/K above 70 C. [3] Ptot derates linearly with 8 mW/K above 70 C. [4] Ptot derates linearly with 5.5 mW/K above 60 C. [5] Ptot derates linearly with 4.5 mW/K above 60 C. Table 4. Operating mode select table[1] LE MR Mode L H Addressable latch mode H H Memory mode L L Demultiplexer mode H L Reset mode Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.5 +7.0 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] - 20 mA IO output current VO = 0.5 V to VCC + 0.5 V - 25 mA ICC supply current - +70 mA IGND ground current 70 - mA Tstg storage temperature 65 +150 C Ptot total power dissipation Tamb = 40 C to +125 C DIP16 package [2] - 750 mW SO16 package [3] - 500 mW (T)SSOP16 package [4] - 500 mW DHVQFN16 package [5] - 500 mW 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 6 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 8. Recommended operating conditions 9. Static characteristics Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter Conditions 74HC259 74HCT259 Unit Min Typ Max Min Typ Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0- VCC V VO output voltage 0 - VCC 0- VCC V Tamb ambient temperature 40 - +125 40 - +125 C t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC259 VIH HIGH-level input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VIL LOW-level input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = 4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = 5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 A 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 7 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch CI input capacitance - 3.5 - - - - - pF 74HCT259 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V IO = 4.0 mA 3.98 4.32 - 3.84 - 3.7 - V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 5.2 mA; VCC = 6.0 V - 0.15 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 8.0 - 80 - 160 A ICC additional supply current VI = VCC  2.1 V; IO = 0 A; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V pin An, LE - 150 540 - 675 - 735 A pin D - 120 432 - 540 - 588 A pin MR - 75 270 - 338 - 368 A CI input capacitance - 3.5 - - - - - pF Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 8 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 10. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 12. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ[1] Max Min Max Min Max 74HC259 tpd propagation delay D to Qn; see Figure 6 [2] VCC = 2.0 V - 58 185 - 230 - 280 ns VCC = 4.5 V - 21 37 - 46 - 56 ns VCC = 5.0 V; CL = 15 pF - 18 - - - - - ns VCC = 6.0 V - 17 31 - 39 - 48 ns An to Qn; see Figure 7 [2] VCC = 2.0 V - 58 185 - 230 - 280 ns VCC = 4.5 V - 21 37 - 46 - 56 ns VCC = 5.0 V; CL = 15 pF - 17 - - - - - ns VCC = 6.0 V - 17 31 - 39 - 48 ns LE to Qn; see Figure 8 [2] VCC = 2.0 V - 55 170 - 215 - 255 ns VCC = 4.5 V - 20 34 - 43 - 51 ns VCC = 5.0 V; CL = 15 pF - 17 - - - - - ns VCC = 6.0 V - 16 29 - 37 - 43 ns tPHL HIGH to LOW propagation delay MR to Qn; see Figure 9 VCC = 2.0 V - 50 155 - 195 - 235 ns VCC = 4.5 V - 18 31 - 39 - 47 ns VCC = 5.0 V; CL = 15 pF - 15 - - - - - ns VCC = 6.0 V - 14 26 - 33 - 40 ns tt transition time see Figure 8 [3] VCC = 2.0 V - 19 75 - 95 - 119 ns VCC = 4.5 V - 7 15 - 19 - 22 ns VCC = 6.0 V - 6 13 - 16 - 19 ns tW pulse width LE HIGH or LOW; see Figure 8 VCC = 2.0 V 70 17 - 90 - 105 - ns VCC = 4.5 V 14 6 - 18 - 21 - ns VCC = 6.0 V 12 5 - 15 - 18 - ns MR LOW; see Figure 9 VCC = 2.0 V 70 17 - 90 - 105 - ns VCC = 4.5 V 14 6 - 18 - 21 - ns VCC = 6.0 V 12 5 - 15 - 18 - ns 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 9 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch tsu set-up time D, An to LE; see Figure 10 and Figure 11 VCC = 2.0 V 80 19 - 100 - 120 - ns VCC = 4.5 V 16 7 - 20 - 24 - ns VCC = 6.0 V 14 6 - 17 - 20 - ns th hold time D to LE; see Figure 10 and Figure 11 VCC = 2.0 V 0 19 - 0 - 0 - ns VCC = 4.5 V 0 6 - 0 - 0 - ns VCC = 6.0 V 0 5 - 0 - 0 - ns An to LE; see Figure 10 and Figure 11 VCC = 2.0 V 2 11 - 2 - 2 - ns VCC = 4.5 V 2 4 - 2 - 2 - ns VCC = 6.0 V 2 3 - 2 - 2 - ns CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC [4] - 19 - - - - - pF 74HCT259 tpd propagation delay D to Qn; see Figure 6 [2] VCC = 4.5 V - 23 39 - 49 - 59 ns VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns An to Qn; see Figure 7 [2] VCC = 4.5 V - 25 41 51 62 ns VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns LE to Qn; see Figure 8 [2] VCC = 4.5 V - 22 38 - 48 - 57 ns VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns tPHL HIGH to LOW propagation delay MR to Qn; see Figure 9 VCC = 4.5 V - 23 39 - 49 - 59 ns VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns tt transition time see Figure 8 [3] VCC = 4.5 V - 7 15 - 19 - 22 ns tW pulse width LE HIGH or LOW; see Figure 8 VCC = 4.5 V 19 11 - 24 - 29 - ns MR LOW; see Figure 9 VCC = 4.5 V 18 10 - 23 - 27 - ns Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 12. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ[1] Max Min Max Min Max 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 10 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL. [3] tt is the same as tTHL and tTLH. [4] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL  VCC2  fo) = sum of the outputs. 11. Waveforms tsu set-up time D, An to LE; see Figure 10 and Figure 11 VCC = 4.5 V 17 10 - 21 - 26 - ns th hold time D to LE; see Figure 10 and Figure 11 VCC = 4.5 V 0 8 - 0 - 0 - ns An to LE; see Figure 10 and Figure 11 VCC = 4.5 V 0 4 - 0 - 0 - ns CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC  1.5 V [4] - 19 - - - - - pF Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 12. Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ[1] Max Min Max Min Max Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Data input to output propagation delays 001aah123 D input Qn output tPHL tPLH GND VCC VM VM VOH VOL 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 11 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Address input to output propagation delays 001aah122 An input Qn output tPHL tPLH GND VCC VM VM VOH VOL Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 8. Enable input to output propagation delays and pulse width tPHL VCC GND D input LE input Qn output tTHL tTLH tW VM VY VM VX tPLH VCC GND VOH VOL 001aaj446 Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 9. Master reset input to output propagation delays 001aah124 MR input Qn output tPHL tW VM VOH VCC GND VOL VM 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 12 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Measurement points are given in Table 9. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical voltage output levels that occur with the output load. Fig 10. Data input to latch enable input set-up and hold times 001aah125 GND GND th tsu th tsu VM VM VM VCC VOH VOL VCC Qn output Q = D Q = D LE input D input Measurement points are given in Table 9. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical voltage output levels that occur with the output load. Fig 11. Address input to latch enable input set-up and hold times 001aah126 VM ADDRESS STABLE VM tsu th VCC GND VCC GND LE input An input Table 9. Measurement points Type Input Output VM VM VX VY 74HC259 0.5VCC 0.5VCC 0.1VCC 0.9VCC 74HCT259 1.3 V 1.3 V 0.1VCC 0.9VCC 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 13 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Test data is given in Table 10. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch Fig 12. Load circuit for measuring switching times VM VM tW tW 10 % 90 % 0 V VI VI negative pulse positive pulse 0 V VM VM 90 % 10 % tf tr tr tf 001aad983 DUT VCC VCC VI VO RT RL S1 CL open G Table 10. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH 74HC259 VCC 6 ns 15 pF, 50 pF 1 k open 74HCT259 3 V 6 ns 15 pF, 50 pF 1 k open 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 14 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 12. Package outline Fig 13. Package outline SOT38-4 (DIP16) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT38-4 95-01-14 03-02-13 MH c (e ) 1 ME A L seating plane A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. UNIT A max. 1 2 b1 (1) (1) (1) b2 cD E e M Z L H mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. e1 ME w 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 2.54 7.62 0.254 8.25 7.80 10.0 8.3 4.2 0.51 3.2 0.76 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.1 0.3 0.01 0.32 0.31 0.39 0.33 0.17 0.02 0.13 0.03 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 15 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Fig 14. Package outline SOT109-1 (SO16) X w M θ A A1 A2 bp D HE Lp Q detail X E Z e c L v M A (A ) 3 A 8 9 1 16 y pin 1 index UNIT A max. A1 A2 A3 bp c D(1) E(1) (1) e HE L Lp Q Z ywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT109-1 99-12-27 03-02-19 076E07 MS-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 16 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Fig 15. Package outline SOT338-1 (SSOP16) UNIT A1 A2 A3 bp c D(1) E(1) e HE L Lp Q Z ywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o 0.2 0.1 0.13 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT338-1 99-12-27 03-02-19 (1) w M bp D HE E Z e c v M A X A y 1 8 16 9 θ A A1 A2 Lp Q detail X L (A ) 3 MO-150 pin 1 index 0 2.5 5 mm scale SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 A max. 2 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 17 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Fig 16. Package outline SOT403-1 (TSSOP16) UNIT A1 A2 A3 bp c D (1) E (2) (1) e HE L Lp Q Z ywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT403-1 MO-153 99-12-27 03-02-18 w M bp D Z e 0.25 1 8 16 9 θ A A1 A2 Lp Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 A max. 1.1 pin 1 index 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 18 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Fig 17. Package outline SOT763-1 (DHVQFN16) terminal 1 index area 1 0.5 UNIT A1 b Eh e y 0.2 c OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.6 3.4 Dh 2.15 1.85 y1 2.6 2.4 1.15 0.85 e1 2.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT763-1 MO-241 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT763-1 DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm A(1) max. A A1 c detail X y y e 1 C L Eh Dh e e1 b 2 7 15 10 9 1 8 16 X D E C B A terminal 1 index area AC C v M B w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) 02-10-17 03-01-27 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 19 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 13. Abbreviations 14. Revision history Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model TTL Transistor-Transistor Logic Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT259 v.5 20120807 Product data sheet - 74HC_HCT259 v.4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74HC_HCT259 v.4 20090225 Product data sheet - 74HC_HCT259 v.3 Modifications: • Added type number 74HC259N and 74HCT259N (DIP16 package) • Added type number 74HC259DB and 74HCT259DB (SSOP16 package) 74HC_HCT259 v.3 20090108 Product data sheet - 74HC_HCT259_CNV v.2 74HC_HCT259_CNV v.2 19970828 Product specification - - 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 20 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch 15. Legal information 15.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. 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NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. 74HC_HCT259 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 7 August 2012 21 of 22 NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors 74HC259; 74HCT259 8-bit addressable latch © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 August 2012 Document identifier: 74HC_HCT259 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Recommended operating conditions. . . . . . . . 6 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 19 14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 16 Contact information. . . . . . . . . . . . . . . . . . . . . 21 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 This document was generated on 06/22/2015 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 0836119006 Status: Active Overview: Commercial Micro-D High-Density Connectors Description: 1.27mm Pitch Commercial Micro D, PCB Mount, Right Angle Plug, 9 Circuits Documents: 3D Model Product Specification PS-83421-001 (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) General Product Family I/O Connectors Series 83611 Application Wire-to-Board Comments Pin Contact Component Type Plug Overview Commercial Micro-D High-Density Connectors Product Name Commercial Micro-D Type N/A UPC 800754026239 Physical Circuits (Loaded) 9 Circuits (maximum) 9 Durability (mating cycles max) 500 Lock to Mating Part Yes Material - Plating Mating Gold Net Weight 4.479/g Orientation Right Angle PC Tail Length 2.79mm PCB Retention Yes PCB Thickness - Recommended 1.52mm Packaging Type Tube Panel Mount Yes Pitch - Mating Interface 1.27mm Plating min - Mating 0.381µm Polarized to Mating Part Yes Surface Mount Compatible (SMC) No Temperature Range - Operating -40°C to +125°C Termination Interface: Style Through Hole Wire Size AWG N/A Electrical Current - Maximum per Contact 1.0A Shielded Yes Voltage - Maximum 350V AC Solder Process Data Duration at Max. Process Temperature (seconds) 030 Lead-freeProcess Capability WAVE Material Info Reference - Drawing Numbers Product Specification PS-83421-001, RPS-83421-001 Sales Drawing SD-83611-001 Series image - Reference only EU ELV Not Relevant EU RoHS China RoHS Compliant REACH SVHC Contains SVHC(2014 December 17): No Halogen-Free Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com Please visit the Contact Us section for any non-product compliance questions. China ROHS Green Image ELV Not Relevant Search Parts in this Series 83611 Series Mates With 83421 , 83424 , 83423 This document was generated on 06/22/2015 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION 1. General description The 74HC4020; 74HCT4020 are high-speed Si-gate CMOS devices and are pin compatible with the HEF4020B series. They are specified in compliance with JEDEC standard no. 7A. The 74HC4020; 74HCT4020 are 14-stage binary ripple counters with a clock input (CP), an overriding asynchronous master reset input (MR) and twelve parallel outputs (Q0, Q3 to Q13). The counter advances on the HIGH-to-LOW transition of CP. A HIGH on MR clears all counter stages and forces all outputs LOW, independent of the state of CP. Each counter stage is a static toggle flip-flop. 2. Features and benefits  Multiple package options  Complies with JEDEC standard no. 7A  Specified from 40 C to +85 C and from 40 C to +125 C 3. Applications  Frequency dividing circuits  Time delay circuits  Control counters 4. Ordering information 74HC4020; 74HCT4020 14-stage binary ripple counter Rev. 5 — 6 August 2012 Product data sheet Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC4020N 40 C to +125 C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HCT4020N 74HC4020D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HCT4020D 74HC4020DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HCT4020DB 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 2 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 5. Functional diagram 74HC4020PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 74HCT4020PW 74HC4020BQ 40 C to +125 C DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5  3.5  0.85 mm SOT763-1 74HCT4020BQ Table 1. Ordering information …continued Type number Package Temperature range Name Description Version Fig 1. Functional diagram 001aal201 14-STAGE COUNTER Q0 CP 10 T MR 11 CD 9 Q3 7 Q4 5 Q5 4 Q6 6 Q7 13 Q8 12 Q9 14 Q10 15 Q11 1 Q12 2 Q13 3 Fig 2. Logic symbol Fig 3. IEC logic symbol 001aal202 Q0 9 Q3 7 Q4 5 Q5 4 Q6 6 Q7 13 Q8 12 Q9 14 Q10 15 Q11 1 Q12 2 Q13 3 11 MR 10 CP 001aal203 0 9 7 5 4 6 CTR14 13 12 14 15 1 2 13 3 11 CT CT = 0 10 + 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 3 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 6. Pinning information 6.1 Pinning 6.2 Pin description Fig 4. Logic diagram 001aal204 FF 1 RD Q CP MR Q T FF 2 RD Q Q T FF 3 RD Q Q T FF 4 RD Q Q T FF 6 RD Q0 Q3 Q13 Q Q T (1) The substrate is attached to this pad using conductive die attach material. It cannot be used as supply pin or input. It is recommended that no connection is made at all. Fig 5. Pin configuration DIP16, SO16, SSOP16 and TSSOP16 Fig 6. Pin configuration DHVQFN16 74HC4020 74HCT4020 Q11 VCC Q12 Q10 Q13 Q9 Q5 Q7 Q4 Q8 Q6 MR Q3 CP GND Q0 001aal205 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 001aal206 VCC(1) 74HC4020 74HCT4020 Q3 CP Q6 MR Q4 Q8 Q5 Q7 Q13 Q9 Q12 Q10 GNDQ0 Q11 VCC Transparent top view 7 10 6 11 5 12 4 13 3 14 2 15 8 9 1 16 terminal 1 index area Table 2. Pin description Symbol Pin Description Q0, Q3 to Q13 9, 7, 5, 4, 6, 13, 12, 14, 15, 1, 2, 3 output GND 8 ground (0 V) CP 10 clock input (HIGH-to-LOW, edge-triggered) MR 11 master reset input (active HIGH) VCC 16 positive supply voltage 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 4 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 7. Functional description [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care;  = LOW-to-HIGH clock transition;  = HIGH-to-LOW clock transition. 7.1 Timing diagram Table 3. Function table Input Output CP MR Q0, Q3 to Q13  L no change  L count XHL Fig 7. Timing diagram 001aal207 12 4 8 16 32 64 128 256 512 1024 2048 4096 CP input MR input Q0 Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q10 Q11 8192 16384 Q12 Q13 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 5 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 8. Limiting values [1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C. For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C. For DHVQFN16 package: Ptot derates linearly with 4.5 mW/K above 60 C. 9. Recommended operating conditions Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.5 +7 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IOK output clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IO output current 0.5 V < VO < VCC + 0.5 V - 25 mA ICC supply current - 50 mA IGND ground current - 50 mA Tstg storage temperature 65 +150 C Ptot total power dissipation Tamb = 40 C to +125 C [1] DIP16 package - 750 mW SO16, SSOP16, TSSOP16 and DHVQFN16 packages - 500 mW Table 5. Recommended operating conditions Symbol Parameter Conditions 74HC4020 74HCT4020 Unit Min Typ Max Min Typ Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 -VCC V VO output voltage 0 - VCC 0 -VCC V t/V input transition rise and fall rate except for Schmitt trigger inputs VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V Tamb ambient temperature 40 +25 +125 40 +25 +125 C 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 6 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 10. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC4020 VIH HIGH-level input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VIL LOW-level input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = 4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = 5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 A CI input capacitance - 3.5 - - - - - pF 74HCT4020 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V IO = 4.0 mA 3.98 4.32 - 3.84 - 3.7 - V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 - 1 - 1 A 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 7 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 11. Dynamic characteristics ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 8.0 - 80 - 160 A ICC additional supply current VI = VCC  2.1 V; IO = 0 A; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V pin MR - 110 396 - 495 - 539 A pin CP - 85 306 - 383 - 417 A CI input capacitance - 3.5 - - - - - pF Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max Table 7. Dynamic characteristics GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10 Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC4020 tpd propagation delay CP to Q0; see Figure 8 [1] VCC = 2.0 V; CL = 50 pF - 39 140 - 175 - 210 ns VCC = 4.5 V; CL = 50 pF - 14 28 - 35 - 42 ns VCC = 5.0 V; CL = 15 pF - 11 - - - - - ns VCC = 6.0 V; CL = 50 pF - 11 24 - 30 - 36 ns Qn to Qn+1; see Figure 9 VCC = 2.0 V; CL = 50 pF - 22 75 - 95 - 110 ns VCC = 4.5 V; CL = 50 pF - 8 15 - 19 - 22 ns VCC = 5.0 V; CL = 15 pF - 6 - - - - - ns VCC = 6.0 V; CL = 50 pF - 6 13 - 16 - 19 ns tPHL HIGH to LOW propagation delay MR to Qn; see Figure 8 VCC =2.0 V; CL = 50 pF - 55 170 - 215 - 225 ns VCC = 4.5 V; CL = 50 pF - 20 34 - 43 - 51 ns VCC = 5.0 V; CL = 15 pF - 17 - - - - - ns VCC = 6.0 V; CL = 50 pF - 16 29 - 37 - 43 ns tt transition time Qn; see Figure 8 [2] VCC = 2.0 V; CL = 50 pF - 19 75 - 95 - 110 ns VCC = 4.5 V; CL = 50 pF - 7 15 - 19 - 22 ns VCC = 6.0 V; CL = 50 pF - 6 13 - 16 - 19 ns 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 8 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter tW pulse width CP HIGH or LOW; see Figure 8 VCC = 2.0 V; CL = 50 pF 80 14 - 100 - 120 - ns VCC = 4.5 V; CL = 50 pF 16 4 - 20 - 24 - ns VCC = 6.0 V; CL = 50 pF 14 3 - 17 - 20 - ns MR HIGH; see Figure 8 VCC = 2.0 V; CL = 50 pF 80 17 - 100 - 120 - ns VCC = 4.5 V; CL = 50 pF 16 6 - 20 - 24 - ns VCC = 6.0 V; CL = 50 pF 14 5 - 17 - 20 - ns trec recovery time MR to CP; see Figure 8 VCC = 2.0 V; CL = 50 pF 50 6 - 65 - 75 - ns VCC = 4.5 V; CL = 50 pF 10 2 - 13 - 15 - ns VCC = 6.0 V; CL = 50 pF 9 2 - 11 - 13 - ns fmax maximum frequency see Figure 8 VCC = 2.0 V; CL = 50 pF 6.0 30 - 4.8 - 4.0 - MHz VCC = 4.5 V; CL = 50 pF 30 92 - 24 - 20 - MHz VCC = 5.0 V; CL = 15 pF - 101 - - - - - MHz VCC = 6.0 V; CL = 50 pF 35 109 - 28 - 24 - MHz CPD power dissipation capacitance [3] - 19 - - - - - pF 74HCT4020 tpd propagation delay CP to Q0; see Figure 8 [1] VCC = 4.5 V; CL = 50 pF - 18 36 - 45 - 54 ns VCC = 5.0 V; CL = 15 pF - 15 - - - - - ns Qn to Qn+1; see Figure 9 VCC = 4.5 V; CL = 50 pF - 8 15 - 19 - 22 ns VCC = 5.0 V; CL = 15 pF - 6 - - - - - ns tPHL HIGH to LOW propagation delay MR to Qn; see Figure 8 VCC = 4.5 V; CL = 50 pF - 22 45 - 56 - 68 ns VCC = 5.0 V; CL = 15 pF - 19 - - - - - ns tt transition time Qn; see Figure 8 [2] VCC = 4.5 V; CL = 50 pF - 7 15 - 19 - 22 ns tW pulse width CP HIGH or LOW; see Figure 8 VCC = 4.5 V; CL = 50 pF 20 7 - 25 - 30 - ns MR HIGH; see Figure 8 VCC = 4.5 V; CL = 50 pF 20 8 - 25 - 30 - ns trec recovery time MR to CP; see Figure 8 VCC = 4.5 V; CL = 50 pF 10 2 - 13 - 15 - ns Table 7. Dynamic characteristics …continued GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10 Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 9 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter [1] tpd is the same as tPHL and tPLH. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi + (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz;  (CL  VCC2  fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V. 12. Waveforms fmax maximum frequency see Figure 8 VCC = 4.5 V; CL = 50 pF 25 47 - 20 - 17 - MHz VCC = 5.0 V; CL = 15 pF - 52 - - - - - MHz CPD power dissipation capacitance [3] - 20 - - - - - pF Table 7. Dynamic characteristics …continued GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10 Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 8. Clock timing, propagation delays, pulse widths and measurement points MR input 90 % 90 % 10 % 10 % CP input Q0 or Qn output tW tPHL 1/fmax trec VM VI VI VM 001aad590 tPLH tW tTLH tTHL tPHL VM 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 10 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 9. Waveforms showing the output Qn to output Qn+1 propagation delays 001aai120 Qn output tPLH tPHL VOH VOH VOL VOL VM Qn+1 output VM Table 8. Measurement points Type Input Output VM VM 74HC4020 0.5  VCC 0.5  VCC 74HCT4020 1.3 V 1.3 V 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 11 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. Fig 10. Test circuit for measuring switching times 001aah768 tW tW tr tr tf VM VI negative pulse GND VI positive pulse GND 10 % 90 % 90 % 10 % VM VM VM tf VCC DUT RT VI VO CL G Table 9. Test data Type Input Load VI tr, tf CL 74HC4020 VCC 6 ns 15 pF, 50 pF 74HCT4020 3 V 6 ns 15 pF, 50 pF 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 12 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 13. Package outline Fig 11. Package outline SOT38-4 (DIP16) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT38-4 95-01-14 03-02-13 MH c (e ) 1 ME A L seating plane A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. UNIT A max. 1 2 b1 (1) (1) (1) b2 cD E e M Z L H mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. e1 ME w 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 2.54 7.62 0.254 8.25 7.80 10.0 8.3 4.2 0.51 3.2 0.76 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.1 0.3 0.01 0.32 0.31 0.39 0.33 0.17 0.02 0.13 0.03 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 13 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter Fig 12. Package outline SOT109-1 (SO16) X w M θ A A1 A2 bp D HE Lp Q detail X E Z e c L v M A (A ) 3 A 8 9 1 16 y pin 1 index UNIT A max. A1 A2 A3 bp c D(1) E(1) (1) e HE L Lp Q Z ywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT109-1 99-12-27 03-02-19 076E07 MS-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 14 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter Fig 13. Package outline SOT338-1 (SSOP16) UNIT A1 A2 A3 bp c D(1) E(1) e HE L Lp Q Z ywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o 0.2 0.1 0.13 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT338-1 99-12-27 03-02-19 (1) w M bp D HE E Z e c v M A X A y 1 8 16 9 θ A A1 A2 Lp Q detail X L (A ) 3 MO-150 pin 1 index 0 2.5 5 mm scale SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 A max. 2 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 15 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter Fig 14. Package outline SOT403-1 (TSSOP16) UNIT A1 A2 A3 bp c D (1) E (2) (1) e HE L Lp Q Z ywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT403-1 MO-153 99-12-27 03-02-18 w M bp D Z e 0.25 1 8 16 9 θ A A1 A2 Lp Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 A max. 1.1 pin 1 index 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 16 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter Fig 15. Package outline SOT763-1 (DHVQFN16) terminal 1 index area 1 0.5 UNIT A1 b Eh e y 0.2 c OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.6 3.4 Dh 2.15 1.85 y1 2.6 2.4 1.15 0.85 e1 2.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT763-1 MO-241 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT763-1 DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm A(1) max. A A1 c detail X y y e 1 C L Eh Dh e e1 b 2 7 15 10 9 1 8 16 X D E C B A terminal 1 index area AC C v M B w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) 02-10-17 03-01-27 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 17 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 14. Abbreviations 15. Revision history Table 10. Abbreviations Acronym Abbreviation CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT4020 v.5 20120806 Product data sheet - 74HC_HCT4020 v.4 Modifications: • Measurement points added to figure 8 (errata). 74HC_HCT4020 v.4 20111213 Product data sheet - 74HC_HCT4020 v.3 Modifications: • Legal pages updated. 74HC_HCT4020 v.3 20100120 Product data sheet - 74HC_HCT4020_CNV v.2 74HC_HCT4020_CNV v.2 19970901 Product specification - - 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 18 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter 16. Legal information 16.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. 74HC_HCT4020 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 — 6 August 2012 19 of 20 NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors 74HC4020; 74HCT4020 14-stage binary ripple counter © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 August 2012 Document identifier: 74HC_HCT4020 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 Timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Recommended operating conditions. . . . . . . . 5 10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 17 Contact information. . . . . . . . . . . . . . . . . . . . . 19 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 1. Product profile 1.1 General description PNP switching transistor in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package. NPN complement: PMBT3904. 1.2 Features and benefits „ Collector-emitter voltage VCEO = −40 V „ Collector current capability IC = −200 mA 1.3 Applications „ General amplification and switching 1.4 Quick reference data 2. Pinning information PMBT3906 PNP switching transistor Rev. 06 — 2 March 2010 Product data sheet Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - −40 V IC collector current - - −200 mA Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 base 2 emitter 3 collector 1 2 3 006aab259 2 1 3 PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 2 of 11 NXP Semiconductors PMBT3906 PNP switching transistor 3. Ordering information 4. Marking [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values [1] Device mounted on an FR4 Printed-Circuit Board (PCB). Table 3. Ordering information Type number Package Name Description Version PMBT3906 - plastic surface-mounted package; 3 leads SOT23 Table 4. Marking codes Type number Marking code[1] PMBT3906 *2A Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - −40 V VCEO collector-emitter voltage open base - −40 V VEBO emitter-base voltage open collector - −6 V IC collector current - −200 mA ICM peak collector current - −200 mA IBM peak base current - −100 mA Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 3 of 11 NXP Semiconductors PMBT3906 PNP switching transistor 6. Thermal characteristics [1] Device mounted on an FR4 PCB. 7. Characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 500 K/W Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = −30 V; IE =0A - - −50 nA IEBO emitter-base cut-off current VEB = −6 V; IC =0A - - −50 nA hFE DC current gain VCE = −1 V IC = −0.1 mA 60 - - IC = −1 mA 80 - - IC = −10 mA 100 - 300 IC = −50 mA 60 - - IC = −100 mA 30 - - VCEsat collector-emitter saturation voltage IC = −10 mA; IB = −1 mA - - −250 mV IC = −50 mA; IB = −5 mA - - −400 mV VBEsat base-emitter saturation voltage IC = −10 mA; IB = −1 mA - - −850 mV IC = −50 mA; IB = −5 mA - - −950 mV td delay time ICon = −10 mA; IBon = −1 mA; IBoff = 1 mA - - 35 ns tr rise time - - 35 ns ton turn-on time - - 70 ns ts storage time - - 225 ns tf fall time - - 75 ns toff turn-off time - - 300 ns fT transition frequency VCE = −20 V; IC = −10 mA; f = 100 MHz 250 - - MHz Cc collector capacitance VCB = −5 V; IE = ie = 0 A; f = 1 MHz - - 4.5 pF Ce emitter capacitance VEB = −500 mV; IC = ic = 0 A; f = 1 MHz - - 10 pF NF noise figure IC = −100 μA; VCE = −5 V; RS =1kΩ; f = 10 Hz to 15.7 kHz - - 4 dB PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 4 of 11 NXP Semiconductors PMBT3906 PNP switching transistor VCE = −1 V (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C Fig 1. DC current gain as a function of collector current; typical values Fig 2. Collector current as a function of collector-emitter voltage; typical values VCE = −1 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C Fig 3. Base-emitter voltage as a function of collector current; typical values Fig 4. Base-emitter saturation voltage as a function of collector current; typical values 0 400 600 200 mhc459 −10−1 −1 −10 IC (mA) hFE −102 −103 (1) (3) (2) 0 −10 −250 0 −50 −100 −150 −200 −2 VCE (V) IC (mA) −4 −6 −8 006aab845 IB (mA) = −1.5 −1.05 −0.75 −0.45 −0.15 −0.3 −0.6 −0.9 −1.2 −1.35 mhc461 −600 −800 −400 −1000 −1200 VBE (mV) −200 IC (mA) −10−1 −103 −102 −1 −10 (1) (2) (3) mhc462 −600 −800 −400 −1000 −1200 VBEsat (mV) −200 IC (mA) −10−1 −103 −102 −1 −10 (1) (2) (3) PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 5 of 11 NXP Semiconductors PMBT3906 PNP switching transistor IC/IB = 10 (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 5. Collector-emitter saturation voltage as a function of collector current; typical values −103 −102 −10 mhc463 −10−1 −1 −10 IC (mA) VCEsat (mV) −102 −103 (1) (2) (3) PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 6 of 11 NXP Semiconductors PMBT3906 PNP switching transistor 8. Test information Fig 6. BISS transistor switching time definition VI = 5 V; T = 500 μs; tp = 10 μs; tr = tf ≤ 3 ns R1 = 56 Ω; R2 = 2.5 kΩ; RB = 3.9 kΩ; RC = 270 Ω VBB = 1.9 V; VCC = −3 V Oscilloscope: input impedance Zi = 50 Ω Fig 7. Test circuit for switching times 006aaa266 −IBon (100 %) −IB input pulse (idealized waveform) −IBoff 90 % 10 % −IC (100 %) −IC td ton 90 % 10 % tr output pulse (idealized waveform) tf t ts toff RC R2 R1 DUT mgd624 Vo RB (probe) 450 Ω (probe) 450 Ω oscilloscope oscilloscope VBB VI VCC PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 7 of 11 NXP Semiconductors PMBT3906 PNP switching transistor 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 13. Fig 8. Package outline SOT23 (TO-236AB) Dimensions in mm 04-11-04 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 1 2 3 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 PMBT3906 SOT23 4 mm pitch, 8 mm tape and reel -215 -235 PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 8 of 11 NXP Semiconductors PMBT3906 PNP switching transistor 11. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMBT3906_6 20100302 Product data sheet - PMBT3906_N_5 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 4 “Marking”: amended • Table 7 “Characteristics”: F redefined to NF noise figure • Section 8 “Test information”: added • Figure 6: added • Figure 8: superseded by minimized package outline drawing • Section 10 “Packing information”: added • Section 12 “Legal information”: updated PMBT3906_N_5 20071004 Product data sheet - PMBT3906_4 PMBT3906_4 20040121 Product specification - PMBT3906_3 PMBT3906_3 19990427 Product specification - PMBT3906_CNV_2 PMBT3906_CNV_2 19970505 Product specification - - PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 9 of 11 NXP Semiconductors PMBT3906 PNP switching transistor 12. Legal information 12.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PMBT3906_6 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 2 March 2010 10 of 11 NXP Semiconductors PMBT3906 PNP switching transistor 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PMBT3906 PNP switching transistor © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 March 2010 Document identifier: PMBT3906_6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information . . . . . . . . . . . . . . . . . . . . . 7 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Contact information. . . . . . . . . . . . . . . . . . . . . 10 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 1. General description The TEA1703T is a low power standby controller IC intended to be used in applications which require an extreme low no-load standby power. The TEA1703T includes circuitry for detecting output voltage, output power and switching. The TEA1703T integrates a switched-mode optocoupler driver, which enables an optocoupler to be driven with a high peak current while keeping the required power low1. The TEA1703T’s typical current consumption is 30 μA. In a typical notebook adapter application the TEA1703T’s power consumption is less than 0.5 mW. 2. Features and benefits 􀂄 Switched-Mode Power Supply (SMPS) standby controller IC enabling very low power standby operation 􀂄 Large input voltage range (5 V up to 30 V) 􀂄 Very low supply current (30 μA) typical 􀂄 Switched-mode optocoupler driver output (NXP Semiconductors patented) 􀂄 Easy application, only 6 pins to connect 3. Applications The device can be used in applications that require a very low power no-load standby. 4. Ordering information TEA1703T GreenChip SMPS standby control IC Rev. 2.3 — 28 April 2011 Product data sheet 1. NXP Semiconductors patented. Table 1. Ordering information Type number Package Name Description Version TEA1703T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 2 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 5. Block diagram 6. Pinning information 6.1 Pinning 6.2 Pin description Fig 1. Block diagram 001aan119 OSCILLATOR voltage sense power sense 1.22 V 0.94 μA 1.3 μA 0.5 V switch detect REFERENCE AND SUPPLY 8 VSENSE PSENSE SWDET n.c. 7 6 5 OPTO 3 n.c. 4 GND 2 VCC 1 TEA1703T Fig 2. Pin configuration (SOT96-1) TEA1703T VCC VSENSE GND PSENSE OPTO SWDET n.c. n.c. 001aan120 1 2 3 4 6 5 8 7 Table 2. Pin description Symbol Pin Description VCC 1 supply voltage GND 2 ground OPTO 3 optocoupler driver n.c. 4, 5 not connected SWDET 6 switch detect input PSENSE 7 power sense input VSENSE 8 voltage sense input TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 3 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 7. Functional description 7.1 General control The TEA1703T contains a standby controller for switched-mode power supplies. Typical configurations are shown in Figure 3 and Figure 4. Typically the TEA1703T senses the output voltage and output power of a switched-mode power supply. The output voltage is sensed via a resistive divider network connected to pin VSENSE. The output power is sensed by determining the switching frequency of the converter using an external filtering network. The converter output power is dependent on the switching frequency, such as in a discontinuous conduction mode flyback converter which has a fixed primary peak current during low load operation. A switching detection input on pin SWDET disables the TEA1703T output when the primary-side controller is not switching. TEA1753’s pin VINSENSE is used to reset a latched protection and for standby control. If the TEA1753 is not switching due to latched protection, the TEA1703T will not activate standby mode. Activating standby mode resets latched protection. When configured with the TEA1733, switching detection is only required if the primary-side VCC (TEA1733 pin 1) is discharged below the latched protection reset level. In Figure 4 a Zener diode is connected in series with the NPN transistor which discharges VCC on pin 1. The Zener diode is chosen to keep VCC on pin 1 just below the TEA1733’s VCC start-up level while the application is in standby mode, guaranteeing a short restart time. If the Zener diode is omitted, the switching detection input must be connected as shown in Figure 4, otherwise pin VCC can be connected via a series resistor to a fixed voltage. The TEA1703T has an open-drain optocoupler driver output with an integrated diode to pin VCC. The optocoupler is efficiently driven in pulse mode which ensures that the optocoupler’s Current Transfer Ratio (CTR) remains high; see Section 7.7 and Section 7.8. xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 4 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC Fig 3. Typical configuration of TEA1703T with TEA1753 001aan121 TEA1703T TEA1753T 8 7 6 5 1 2 3 4 opto controller opto controller opto on/off opto on/off Vout 12 11 9 16 13 2 14 8 6 7 3 10 4 1 GND OPTO n.c. n.c. SWDET PSENSE VSENSE VCC xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 5 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC Fig 4. Typical configuration of TEA1703T with TEA1733 001aan122 TEA1703T TEA1733T 8 7 6 5 1 2 3 4 opto controller opto on/off opto on/off opto controller 1 2 3 4 8 7 6 5 OPTO n.c. n.c. SWDET PSENSE VSENSE VCC Θ GND TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 6 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 7.2 Standby operation When the output load of the switched-mode power supply falls, the voltage on pin PSENSE also falls. When the voltage on pin PSENSE falls below the Vth(Psense) level, the TEA1703T activates its pin OPTO output as soon as its pin SWDET current is above the Ith(det)sw level. In a typical application, the switched-mode power supply is disabled by the TEA1703T as soon as its pin OPTO output is activated. The application’s output voltage will then start to fall. After a period dependent on the output load and the output capacitor value, the VSENSE voltage falls below the Vth(Vsense) level and the OPTO output is disabled again. This restarts the primary-side converter. If the output load remains low, the application reverts to standby mode again after the output capacitor has been recharged. When a normal load is detected, the converter resumes normal operation; see Figure 5. 7.3 Voltage sensing (pin VSENSE) If the voltage on pin VSENSE is above the Vth(Vsense) level, pin VSENSE outputs a current IO(Vsense), which, in combination with the external resistive divider, creates a hysteresis on the adapter output voltage level. In a typical application, the effective output voltage hysteresis is larger than that set by IO(Vsense) and the resistive divider. This is because the external PSENSE filter circuit keeps the PSENSE voltage above the Vth(Psense) level as long as the output capacitor is not charged to the normal output voltage level. Fig 5. Standby operation signals Vth(Vsense) Vo(nom) Vth(Psense) Ith(det)sw normal operation standby standby normal operation low output load stopping SMPS re-starting SMPS re-starting SMPS stopping SMPS output load output voltage VSENSE PSENSE SWDET OPTO primary side converter active 001aan123 TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 7 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 7.4 Power sensing (pin PSENSE) Output power sensing is implemented using an external filter network on pin PSENSE. The PSENSE input is not latched internally. If, during standby mode, pin PSENSE is pulled above the Vth(Psense) level, the OPTO output is disabled. 7.5 Switching detection (pin SWDET) A switching detection pin is provided to prevent applications resetting a latched protection of the primary-side converter, such as the TEA1753. The standby mode can only be activated when the current into pin SWDET is above the Ith(det)sw level. The SWDET signal is latched internally. As soon as the OPTO output is activated, the SWDET signal is ignored. If the SWDET input is not needed, it can be connected to pin VCC via a series resistor. The current into pin SWDET must be above the Ith(det)sw level when the switched mode power supply is in normal operation. 7.6 Optocoupler output (pin OPTO) The optocoupler output is an open-drain output with an integrated diode connected to pin VCC. The output is driven with a fixed frequency (fosc,) and a fixed on-time (ton(OPTO)). The optocoupler diode current can be set by choosing the value of the series inductor. The current is not limited internally. 7.7 Optocoupler CTR The CTR of a typical optocoupler falls significantly when small opto-diode currents are used. With low optocoupler output currents, a significantly higher diode current is needed for a typical low-cost optocoupler. In low standby power operation of the switched-mode power supply it is necessary to keep all currents low. To maintain a high CTR, the optocoupler diode can be driven with a high current and a small duty cycle. The average driving current will still be low. Figure 6 shows a typical optocoupler CTR plotted for a DC-driven opto-diode and a pulse-driven opto-diode. The pulse-driven diode is driven with a 2 mA duty cycle modulated current. The CTR remains high even for a very small average diode current (low duty cycle) when the diode is pulse-driven, while the CTR for a DC-driven optocoupler falls to a few percent. TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 8 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 7.8 Optocoupler drive If a series resistor is used to limit the optocoupler diode current and the output voltage of the application is 19 V, about 95 % of the driving energy is lost in the series resistor. The efficiency to drive the optocoupler is therefore not more than about 5 %. In the intended application, the optocoupler is active in standby, therefore, the energy needed to drive the optocoupler must be as low as possible. To improve the efficiency of the optocoupler drive, the optocoupler diode can be driven with a series inductor. The optocoupler diode is then driven like a switched-mode power supply2. Driving the optocoupler with a series inductor improves the efficiency by a factor of 10 compared to driving it with a series resistor. (1) Pulse driven. (2) DC driven. Fig 6. Typical optocoupler CTR 001aan124 (average) diode current (μA) 1 10 102 103 104 105 10 100 1000 CTR (%) 1 (1) (2) 2. NXP Semiconductors patented. Fig 7. Switched-mode optocoupler driver 001aan125 lOPTO 1 2 3 opto on/off TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 9 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 8. Limiting values [1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor. Fig 8. Switched-mode optocoupler drive signals 001aan126 VCC VOPTO IOPTO Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Voltages VCC supply voltage continuous −0.4 +30 V VVSENSE voltage on pin VSENSE current limited −0.4 +5 V VPSENSE voltage on pin PSENSE current limited −0.4 +3 V VOPTO voltage on pin OPTO current limited −0.4 VCC + 2 V Currents IVSENSE current on pin VSENSE −1 +1 mA IPSENSE current on pin PSENSE −1 +1 mA ISWDET current on pin SWDET −1 +1 mA IOPTO current on pin OPTO −1 +25 mA General Ptot total power dissipation Tamb < 75 °C - 0.5 W Tstg storage temperature −55 +150 °C Tj junction temperature −40 +150 °C ESD VESD electrostatic discharge voltage class 1 human body model [1] - 2000 V machine model [2] - 200 V charged device model - 500 V TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 10 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 9. Thermal characteristics 10. Characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; JEDEC test board 160 K/W Rth(j-c) thermal resistance from junction to case in free air; JEDEC test board 72 K/W Table 5. Characteristics Tamb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply voltage management (pin VCC) VCC(min) minimum supply voltage 3.5 4 4.5 V ICC(oper) operating supply current 28 31 35 μA Voltage sensing (pin VSENSE) Vth(Vsense) voltage sense threshold voltage 1.17 1.22 1.31 V IO(Vsense) voltage sense output current VVSENSE > 1.2 V −1.10 −0.94 −0.75 μA VVSENSE < 1.2 V −30 −11 −5 nA Power sensing (pin PSENSE) Vth(Psense) power sense threshold voltage 0.45 0.5 0.55 V IO(Psense) power sense output current −30 −11 −5 nA Switching detection (pin SWDET) Ith(det)sw switching detection threshold current 0.8 1.3 2 μA Vdet(sw) switching detection voltage ISWDET = 1.3 μA 0.7 0.74 0.8 V Optocoupler output (pin OPTO) RDSon drain-source on-state resistance VOPTO = 1 V 90 100 110 Ω ton(OPTO) on-time on pin OPTO 1.2 1.42 1.65 μs ILZ off-state leakage current VOPTO = VCC - - 100 nA fosc oscillator frequency 24 28 33 kHz TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 11 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 11. Package outline Fig 9. Package outline SOT96-1 (SO8) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z (1) θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 SOT96-1 X w M θ A A 1 A2 bp D HE Lp Q detail X E Z e c L v M A (A 3 ) A 4 5 pin 1 index 1 8 y 076E03 MS-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.041 0.01 0.01 0.004 0.039 0.016 0 2.5 5 mm scale SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 99-12-27 03-02-18 TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 12 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 12. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes TEA1703T v.2.3 20110428 Product data sheet - TEA1703T v.2.2 TEA1703T v.2.2 20110303 Objective data sheet - TEA1703T v.2.1 TEA1703T v.2.1 20110228 Objective data sheet - TEA1703T v.2 TEA1703T v.2 20110126 Objective data sheet - TEA1703T v.1 TEA1703T v.1 20110103 Objective data sheet - - TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 13 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC 13. Legal information 13.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. TEA1703T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2.3 — 28 April 2011 14 of 15 NXP Semiconductors TEA1703T GreenChip SMPS standby control IC Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors TEA1703T GreenChip SMPS standby control IC © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 28 April 2011 Document identifier: TEA1703T Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 7.1 General control . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Standby operation. . . . . . . . . . . . . . . . . . . . . . . 6 7.3 Voltage sensing (pin VSENSE). . . . . . . . . . . . . 6 7.4 Power sensing (pin PSENSE) . . . . . . . . . . . . . 7 7.5 Switching detection (pin SWDET). . . . . . . . . . . 7 7.6 Optocoupler output (pin OPTO) . . . . . . . . . . . . 7 7.7 Optocoupler CTR . . . . . . . . . . . . . . . . . . . . . . . 7 7.8 Optocoupler drive . . . . . . . . . . . . . . . . . . . . . . . 8 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Thermal characteristics . . . . . . . . . . . . . . . . . 10 10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Développer avec le meilleur! www.farnell.fr Farnell propose plus de 5000 nouveaux circuits intégrés* et le choix le plus vaste en technologie de pointe. Une fiche technique pour chaque produit, une assistance technique spécialisée et une livraison le jour même : si vous êtes à la recherche des meilleurs circuits intégrés, optez sans hésitation pour Farnell. Microcontrôleurs et processeurs de signal numérique Le meilleur choix de microcontrôleurs 8 bits et 32 bits, de processeurs ARM et de processeurs de signal numérique, en provenance de TOUS les fabricants leaders : } Blackfin et AduC7000 d'Analog Devices } ATMEGA et ATTINY d'Atmel } Série SO8, Coldfire et PowerQUICC de Freescale } PIC24 et dsPIC de Microchip } STM32 CORTEX, uPSD et STR7 de ST Microelectronics } DaVinci et MSP430 de TI Mémoires Une gamme de mémoires évoluées, en provenance de nouveaux fabricants comme: } Brilliance Semiconductor, ISSI, SST, GSI } En plus des larges gammes de mémoires EEPROM, SRAM, et NRAM. Circuits de communication, modules et outils de développement Large gamme de circuits, de modules et d'outils de développement, adaptés aux protocoles filaires et sans fil les plus courants: } ProC de Cypress } Bluetooth d'Ezurio } ZigBee de Freescale, Microchip, Telegesis et TI (Chipcon) } FTDI 232/USB/UART } WiPort/Wport de Lantronix } RadioWire de Micrel Traitement du signal et gestion de puissance Le meilleur choix en matière de traitement du signal et de gestion de puissance. } Plus de 1000 nouveaux produits pour le traitement du signal offrant une technologie de pointe } Une large gamme de circuits de puissance Découvrez la meilleure gamme de CI de l'industrie sur www.farnell.fr *introduits depuis février 2007. Les toutes dernières technologies en provenance des plus grands fabricants Mai 2008 COMMANDEZ DES MAINTENANT Livraison GRATUITE le lendemain • Pas de minimum de commande www.farnell.fr 􀁌􀁥􀁜􀀗􀃔􀀗􀁣􀁠􀁘􀁣􀁜􀀗􀁛􀁬􀀗􀁞􀁩􀁦􀁬􀁧􀁜􀀗􀁇􀁩􀁜􀁤􀁠􀁜􀁩􀀗􀀽􀁘􀁩􀁥􀁜􀁣􀁣 Les toutes dernières innovations technologiques pour un contrôle effi cace du mouvement Les nouveaux produits des fabricants leaders du marché Des solutions complètes pour des applications de pointe. } } } Contrôle de mouvement & Automation 􀁉􀁜􀁪􀁫􀁜􀁱 􀁥􀁥􀁜􀁚􀁫􀂄􀀗􀀘 Le plus large choix de connecteurs en provenance des fabricants leaders – des tous derniers composants miniatures aux connecteurs industriels intégrant une technologie de connexion spécifi que. Voir page 50 AU 04 74 68 99 99 *Ne couvre pas les semiconducteurs, les produits chimiques, les aérosols, les consommables, les pièces, les batteries, les livres et les logiciels. 􀁌􀁥􀁜􀀗􀃔􀀗􀁣􀁠􀁘􀁣􀁜􀀗􀁛􀁬􀀗􀁞􀁩􀁦􀁬􀁧􀁜􀀗􀁇􀁩􀁜􀁤􀁠􀁜􀁩􀀗􀀽􀁘􀁩􀁥􀁜􀁣􀁣 Une question supplémentaire ? Support technique Nos techniciens sont là pour vous aider, du lundi au vendredi, de 8h30 à 19h sans interruption Téléphone : 04 74 68 99 88 Email : technique@farnell.com Fax : 04 74 68 99 80 Besoin d’un meilleur prix ? Notre service cotations est à votre disposition pour vous proposer un meilleur tarif sur toute demande à partir de 500 €. Contactez-nous : Téléphone : 04 74 68 99 98 Email : cotations@farnell.com Fax : 04 74 68 99 80 SIMPLICITE de commande, livraison RAPIDE Garantie 100% SATISFAIT ! Livraison gratuite le lendemain : pour tous les articles en stock commandés avant 19h00, du lundi au vendredi. Besoin d’une livraison encore plus rapide ? Service de livraison express le lendemain MATIN : Coût forfaitaire de ce service : 6 € HT (dans les zones couvertes par les transports UPS pour ce service). Livraison “Newark Direct’’ stock aux USA Vous trouverez ces produits sur www.farnell.fr et dans l’index par références fabricants. Livraison en 2 à 3 jours – 18 € de frais d’expédition (par commande). Diverses options de paiement : compte client, chèque ou carte de crédit. 100% satisfait ! Si pour quelque raison que ce soit, vous n’êtes pas satisfait à 100% des produits que vous recevez, vous avez 30 jours pour nous les retourner* – voir conditions générales de vente sur www.farnell.fr. Pour tout retour de marchandise, faire une demande de numéro de retour – RMA – à notre service clientèle au 04 74 68 99 99 ou utilisez le formulaire de numéro de retour en fi n de notre catalogue général Téléphone 04 74 68 99 99 A votre disposition du lundi au vendredi de 8h30 à 19h sans interruption. En ligne www.farnell.fr Commande en ligne sécurisée, recherche rapide de produits, accès aux toutes dernières nouveautés, informations et offres spéciales. E-mail ventes@farnell.com Pour vos commandes, demandes d’informations ou nous adresser vos commentaires. Fax 04 74 68 99 90 Adresse 81 rue Henri Depagneux, B.P. 60426 – LIMAS, 69654 Villefranche sur Saône Cedex. PAS DE MINIMUM DE COMMANDE 􀁃􀁦􀁩􀁪􀁨􀁬􀁜􀀗􀁭􀁦􀁪􀀗􀁙􀁜􀁪􀁦􀁠􀁥􀁪􀀗􀁪􀁦􀁥􀁫􀀗􀁪􀁬􀁧􀂄􀁩􀁠􀁜􀁬􀁩􀁪􀀗􀁾􀀗􀁣􀁘􀀗 􀁨􀁬􀁘􀁥􀁫􀁠􀁫􀂄􀀗􀁛􀁜􀀗􀁥􀁦􀁫􀁩􀁜􀀗􀁛􀁜􀁩􀁥􀁠􀂅􀁩􀁜􀀗􀁚􀁦􀁣􀁦􀁥􀁥􀁜􀀣􀀗􀁥􀁦􀁬􀁪􀀗 􀁧􀁦􀁬􀁭􀁦􀁥􀁪􀀗􀁭􀁦􀁬􀁪􀀗􀂄􀁫􀁘􀁙􀁣􀁠􀁩􀀗􀁬􀁥􀁜􀀗􀁚􀁦􀁫􀁘􀁫􀁠􀁦􀁥􀀗􀁪􀁧􀂄􀁚􀁠􀁘􀁣􀁜􀀥 􀁉􀁜􀁥􀁛􀁜􀁱􀀤􀁭􀁦􀁬􀁪􀀗􀁪􀁬􀁩􀀗􀁮􀁮􀁮􀀥􀁝􀁘􀁩􀁥􀁜􀁣􀁣􀀥􀁝􀁩􀀗􀁧􀁦􀁬􀁩􀀗􀁛􀁜􀀗􀁧􀁣􀁬􀁪􀀗􀁘􀁤􀁧􀁣􀁜􀁪􀀗􀁠􀁥􀁝􀁦􀁩􀁤􀁘􀁫􀁠􀁦􀁥􀁪 􀀺􀁦􀁤􀁤􀁘􀁥􀁛􀁜􀁱􀀗􀁜􀁥􀀗 􀁞􀁩􀁘􀁥􀁛􀁜􀀗􀁨􀁬􀁘􀁥􀁫􀁠􀁫􀂄􀀣􀀗 􀁭􀁦􀁬􀁪􀀗􀁙􀂄􀁥􀂄􀃔􀀗􀁚􀁠􀁜􀁱􀀗 􀁛􀁜􀀗􀁤􀁜􀁠􀁣􀁣􀁜􀁬􀁩􀁪􀀗􀁧􀁩􀁠􀁯􀀗􀀘 Les besoins grandissants en termes d’efficacité et de niveau de contrôle ont engendré ces dernières années une accélération de l’innovation dans les domaines du contrôle de mouvement et de l’automation et notamment d’énormes avancées technologiques sur de larges gammes de produits. Dans cette nouvelle édition de notre Select, nous vous présentons les tous derniers développements de l’industrie pour vous apporter un niveau de contrôle toujours plus fiable et efficace: microcontrôleurs, DSP et DSC (à partir de la page 4) conçus spécifiquement pour les applications du contrôle de mouvement et composants analogiques avec drivers de porte haute tension (page 14). De plus, les toutes dernières technologies OLED (page 17), les relais sub-miniatures (page 29), et les produits d’automation (page 37) vous offrent une solution complète pour vos applications de pointe. Pour plus d’information sur les nouveaux développements, ainsi que des conseils sur la conception et la mise en application des technologies de contrôle du mouvement et de l’automation, nous vous invitons à consulter notre brochure Technology First, jointe à ce Select. Découvrez enfin notre sélection de produits d’interconnexion en provenance des fabricants leaders du marché - des nouveaux composants miniatures, aux connecteurs industriels conçus pour les environnements sévères – pour rester connecté avec Farnell ! Rendez-vous page 50 pour plus d’informations. Ce Select vous permet d’accéder à une partie des 50 000 nouveaux produits ajoutés à notre offre sur les 12 derniers mois. Un service de livraison rapide, une équipe de conseillers techniques à votre disposition et désormais une baisse de prix sur plus de 36 000 composants phares, font de Farnell la source d’approvisionnement de référence des ingénieurs en électronique. Nous vous donnons rendez-vous à Munich sur le salon Electronica 2008 pour rencontrer l’équipe Farnell. Nous vous disons à très bientôt, Peter Davis Directeur du Développement Produits, Farnell 􀁌􀁥􀁜􀀗􀃔􀀗􀁣􀁠􀁘􀁣􀁜􀀗􀁛􀁬􀀗􀁞􀁩􀁦􀁬􀁧􀁜􀀗􀁇􀁩􀁜􀁤􀁠􀁜􀁩􀀗􀀽􀁘􀁩􀁥􀁜􀁣􀁣 New Munich Trade Fair Centre 11-14 November 2008 Semiconducteurs, Passifs et Optoélectronique 4 Microcontrôleurs 8 Mémoires 9 Interfaces 10 Gestion de puissance 15 Discrets 17 Affi chage et Optoélectronique 19 Drivers de LED & LCD 20 Condensateurs et Filtres 22 Résistances et Potentiomètres 24 Capteurs Electromécanique 25 Capteurs 27 Commutateurs 29 Relais 31 Ventilateurs 34 Coffrets et Boîtiers 35 Fusibles Automatisme 37 Moteurs, Drivers et Transmission de puissance 39 Informatique industrielle et PLC 40 Cartes mères pour automates Test et Puissance 41 Fils et Câbles 43 Alimentations et Convertisseurs DC/DC 45 Test et Mesure 48 Prototypage 50 Introduction 51 Connecteurs industriels 53 Borniers et Blocs de jonction 56 Connecteurs fi l à fi l 60 Connecteurs circulaires 62 Connecteurs carte à fi l 64 Connecteurs carte à carte Maintenance et réparation 67 Test & Mesure 75 Alimentations 77 Soudage 82 Outillage 88 Produits de maintenance 89 Circuits imprimés 90 Composants d’automatisme et de process 92 Fournitures industrielles 93 Electromécanique 95 Bureautique 97 Câbles 98 Connecteurs multipolaires 􀁉􀁜􀁪􀁫􀁜􀁱 􀁥􀁥􀁜􀁚􀁫􀂄􀀗􀀘 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Microcontrôleurs 4 Semiconducteurs, Passifs et Optoélectronique Code Prix Unitaire Fab. Broches Boîtier Description Réf. Fab. Commande 1+ INF 48 TQFP Microcontrôleur 8 bits, 24KB FLASH SAK-XC886-6FFA 147-2751● g5,09 INF 48 TQFP Microcontrôleur 8 bits, 32KB FLASH SAK-XC886-8FFA 147-2752● g5,70 INF 48 TQFP Microcontrôleur 8 bits, 32KB FLASH, CAN Module SAK-XC886C-8FFA 147-2753● g6,37 INF 48 TQFP Microcontrôleur 8 bits, 32KB FLASH, CAN Module, LIN BSL Support, MDU Module SAK-XC886CLM-8FFA 147-2754● g6,84 INF 64 TQFP Microcontrôleur 8 bits, 32KB FLASH, CAN Module, LIN BSL Support, MDU Module SAK-XC888CLM-8FFA 147-2762● g6,72 INF 64 TQFP Microcontrôleur 8 bits, 32KB FLASH, CAN Module, MDU Module SAK-XC888CM-8FFA 147-2763● g6,60 INF 64 TQFP Microcontrôleur 8 bits, 24KB FLASH, LIN BSL Support, MDU Module SAK-XC888LM-6FFA 147-2764● g5,50 INF 64 TQFP Microcontrôleur 8 bits, 32KB FLASH, LIN BSL Support, MDU Module SAK-XC888LM-8FFA 147-2765● g5,85 Broches/ Data Programme Data Programme Boot Timers de coeur Code Prix Unitaire Réf. Fab. Boîtier (Ko) (Ko) (Ko) (Ko) (Ko) (V) Commande 1+ DSP56F801FA80E LQFP/48 2 2 4 16 4 8 3.3 114-8361● g8,27 Le kit de référence Luminary Micro Stellaris pour moteur pas à pas (Stepper RDK) contient tous le matériel nécessaire pour concevoir, développer et intégrer vos applications de commande moteur. Le kit associe la flexibilité des microcontrôleurs Luminary Stellaris et les driver de MOSFET Fairchild pour créer un contrôle de moteur performant, flexible et faible coût. Les moteurs pas à pas sont particulièrement recommandés pour les Microcontrôleurs 8 bits Flash SAK-XC886/8 Contrôleurs de signal numérique 16 bits Série DSP56F801 équipements CNC qui utilisent deux ou trois axes comme les imprimantes et les scanners. Le kit de référence Luminary Micro Stellaris pour moteur AC à induction (ACIM RDK) contient tous le matériel nécessaire pour concevoir, développer et intégrer vos applications qui utilisent un moteur AC à induction. Le kit ACIM RDK associe la fexibilité des microcontrôleurs Luminary Stellaris et les driver de MOSFET Fairchild pour créer des applications à vitesse variable évoluées. Les moteurs AC à induction sont particulièrement adaptés aux applications électroménager (réfrigérateurs, lave vaisselle, lave linge et sèche linge), éclairage commerciale et les commandes moteur pour l’industrie. Le XC886/888LM vient renforcer la famille des XC800 avec un nouveau membre capable de commander des moteurs qui dispose jusqu’à 32 Ko de Flash intégré et une puissante unité capturer comparer (CCU6) pour générer une PWM nouvelle génération et une unité Multiplication / Division (MDU) pour la rapidité des calculs mathématiques. Parmi les fonctions supplémentaires, il supporte LIN, un CAN 10 bits de très grande précision avec une vitesse de conversion rapide et un CORDIC (COrdinate Rotation Digital Computer). La souplesse offerte par le XC886/888LM est également élargie pour inclure une famille compatible avec de la ROM pour les versions plus économiques en grand volume et production. Le XC886/888LM est optimisé pour les applications de contrôle moteur, y compris l’automobile, l’industrie et des Le kit PICDEM™ Mechatronics est une plateforme de développement simple à utiliser. Il permet une approche simple pour apprendre la mécatronique de manière ludique. Il est fourni avec des cavaliers pour permettre à l’utilisateur de connecter le PIC aux differents composants sur la carte. Les composants disponibles sont des capteurs, des Leds, des drivers de moteurs. La carte dispose aussi de neufs projets complets (avec firmware, schémas et plan de câblage). Le circuit 56F801, est un membre de la famille des contrôleurs de signal numérique 56800 , qui associe la capacité de traitement d’un DSP et la fonctionnalité d’un microcontrôleur avec un ensemble de périphériques flexibles. C’est une solution extrêmement rentable pour commander les servos, les moteurs, les inverseurs de puissance, et les convertisseurs. Caractéristiques: • MCU PIC16F917 avec oscillateur interne 8 MHz et module LCD • Affichage: 8 LEDs et LCD (pre-connecté au module LCD) • Moteur pas à pas et moteurs DC • Capteur de température Analog (Microchip TC1047A) • Capteur de lumière • Quartz 32.768 kHz • 4 touches tactiles, 2 potentiomètres • Circuit de protection ’Over-current’ • Programmation ICSP™ et connecteur pour MPLAB ICD 2 • Capteur optique pour la vitesse du moteur DC • Support 20 broches(compatible avec tout les circuits flash 8, 14 et 20 broches) • Neufs exemples de projects avec codes sources complets contrôle moteur dur. Code Réf. Fab. Description Commande Prix Unitaire RDK-ACIM Kit de référence pour moteur AC à induction 149-4154● g305,04 RDK-STEPPER Kit de référence pour moteur pas à pas 149-4155● g160,12 Code Commande Prix Unitaire DM163029Kit PICDEM Mechatronics 111-2782 g107,60 • Oscillateur à quartz 8MHz et PLL • Gestion et conversion de puissance sur carte PICDEM™ MECHATRONICS • Module de communication série (SCI et SPI) • Interface JTAG/OnCE (Déboguage et Programmation) Caractéristiques: • PWM évoluée • Double convertisseur Analogique Numérique • Timers 16 bits programmables RDK-ACIM RDKSTEPPER Kit de réference Stellaris® pour moteur pas à pas & moteur AC à induction RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Microcontrôleurs 5 Semiconducteurs, Passifs et Optoélectronique Outils de développement Réf. Fab. Code Commande Prix Unitaire ATAVRMC100 120-5491● g227,44 La carte de développement PICDEM MC LV est un outil de développement et d’apprentissage qui propose aux concepteurs une méthode simple et rapide pour évaluer leurs applications à moteurs (moteurs BLDC ou avec capteur). Les utilisateurs peuvent créer des applications de commande moteur embarquée, à base de Code Prix Unitaire Réf. Fab. Description Commande 1+ DM300020 Carte de développement dsPICDEM MC1 734-8517 g215,20 DM300022 Module de Puissance, dsPICDEM MC1H 3-Phase, Basse tension 734-8533 g502,00 AC300021 Moteur triphasé ACIM Haute tension (208/460V) 111-2769 g86,10 MA300015 dsPIC30F6010 80L Plug-In Module for DM300020 143-9703● g18,00 microcontrôleurs 28 broches (PIC18F) ou de contrôleurs de signal numérique (dsPIC30F). Kit d’évaluation ATAVRMC100 Système de L’ATAVRMC100 est un kit d’évaluation destiné à la commande de moteur BLDC (moteur DC sans balais), avec un contrôle de commande, par capteurs à effet hall ou par retour de force électromotrice. Ce kit contient une carte d’évaluation avec un microcontrôleur programmé, un moteur BLDC triphasé Code Réf. Fab. Commande Prix Unitaire DM183021 Carte PICDEM MC LV 108-4612 g93,30 AC300020 24V BLDC Motor mit Kabeln Moteur BLDC 24V avec câble 108-4614 g86,10 AC002013 Carte PICDEM MC LV pour alimentation 24V 108-4617 g35,90 développement pour contrôle moteur, MC1, dsPICDEM™ Carte de démonstration PICDEM MC LV et un logiciel de démonstration. Il permet aux utilisateurs d’évaluer rapidement les possibilités des microcontrôleurs AVR® AT90PWM3 qui supportent la programmation In-Situ et une émulation sur circuit. Le kit peut également servir de plateforme de développement faible coût pour les autres microcontrôleurs de la famille AVR d’Atmel. Cet outil permet de modifier simplement des codes source écrits en C, pour les adapter et les rendre facilement réutilisable par les concepteurs, dans leurs propres applications de commande moteur. • Moteur BLDC triphasé • CD-ROM avec Datasheets, Notes d’application et logiciel de démonstration. Caractèristiques: • Capable de piloter des moteurs jusqu’à 48V, 2.2A • Pont inverseur pour les sources de tension triphasées • Capteur de température avec interface I2C • Connecteur pour MPLAB ICD2 • Connecteur RS232 • Potentiomètre de contrôle de vitesse • Point de test pour le controle du courant et capteur EMF • Option moteurs triphasés, et 24V BLDC, Alimentation externe 24V disponible Contenu: • Carte PICDEM MC LV avec PIC18F2431 pre-programmé (firmware BLDC) et dsPIC30F3010 • CD ROM avec logiciel et documentation MC-GUI (Motor Control GUI), guide d’utilisation et exemples de programme Système de développement pour contrôle moteur avec trois composants principaux pour le prototypage rapide et la validation des applications BCDC, PMAC et ACIM. Les 3 composants sont: dsPICDEM MC1: carte de développement pour contrôle moteur, dsPICDEM MC1L3- Phase: module de puissance basse tension triphasée et dsPICDEM MC1H3-Phase, module de puissance haute tension triphasée. La carte dsPICDEM MC1 contient le dsPIC30F6010, supporte tous les Contenu: • Carte d’évaluation avec AT90PWM3 • Supporte Programmation In-Situ microcontrôleurs dsPIC le contrôle des variations moteur, interface de périphiriques variés et un système d’interface qui permet de connecter les différents modules de puissance. dsPICDEM MC1L3- Phase optimisé pour des applications à moteur triphasé qui nécessite une tension continue inférieure à 50V et peut fournir plus de 400W de puissance en sortie, prévu pour alimenter les moteurs BLDC et PMAC. dsPICDEM MC1H3-Phase optimisé pour des applications à moteur triphasé qui nécessite une tension supérieure à 400V et peut founir plus de 1KW de puissance en sortie. Ce module est prévu pour les moteurs à induction c.a. et applications d’inversion de puissance qui fonctionne directement de la ligne de tension c.a. et possède un circuit de compensation de phase contrôlé par le dsPIC30F. • Module de puissance haute ou basse tension • Carte de développement pour contrôle moteur dsPICDEM MC1 avec circuit dsPIC30F pré-programmé • Dissipateur pour refroidir le circuit de puissance • Protection automatique et complète du circuit de puissance • Isolation électrique du circuit de puissance • Beaucoup d’options pour les signaux de retour des moteurs • Exemples de programmes et documentations sur CD Prix sujets à variation. Consultez le dernier prix en vigueur sur notre site Internet www.farnellinone.fr Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Microcontrôleurs 6 Semiconducteurs, Passifs et Optoélectronique Code Prix Unitaire Fab. Broches Boîtier Description Réf. Fab. Commande 1+ 505 INF 44 MQFP Microcontrôleur 20MHz sans ROM avec CAN SAF-C505CA-LM 147-2711● g15,04 505 INF 44 MQFP Microcontrôleur 20MHz mémoire OTP 16kB avec CAN SAK-C505CA-4EM 147-2746● g19,31 515 INF 80 MQFP Microcontrôleur 10 MHz, mémoire OTP 64kB et CAN SAF-C515C-8EM 147-2712● g20,60 Le kit MC-LVKIT est un outil simple à utiliser pour les gammes de microcontrôleurs NEC 8 et 32 bits dédiés aux applications de contrôle moteur. Il est aussi possible de le connecter aux outils de développement NEC pour l’évaluation, la Microcontrôleurs 8 bits - C500 programmation et le débogage. Le module inverseur basse tension peut être utilisé pour les Outils de développement et d’évaluation pour les mictrocontrôleurs STM32 ARM basés sur les coeur cortex M3. applications avec des moteurs basse tension qui nécessitent des tensions jusqu’à 24V, mais aussi pour évaluer les moteurs triphasés synchrones ou asynchrones. La carte d’entrées/ sorties dispose d’une interface utilisateur, pour contrôler, et conditionner le signal entre le microcontrôleur et le module inverseur basse tension. Le C505CA dispose d’un CAN complet version 2.0B intégré et offre de hautes performances. Optimisé pour la compatibilité électromagnétique (CEM) et des communications rapides entre différents éléments décentralisés (capteurs, actionneurs et l’hôte). Le circuit dispose de 32 Ko d’OTP ou 16/32 Ko de ROM, 256 octets de RAM, 1 Ko de XRAM, Un CAN (Controller Area Network) Version 2.0B, une interface série asynchrone / synchrone et un CAN (Convertisseur A/N) 10 bits très précis. Avec une horloge externe de 20 MHz, le C505CA dispose d’un temps d’instruction de 300 ns. Il est recommandé pour les applications automobiles et les organes de contrôle industriel. Les microcontrôleurs 32 bits STM32F10xxx disposent des performances élevées des coeurs ARM Cortex-M3 RISC. Ils possédent de la mémoire flash, une large gamme d’E/S, des péripheriques connéctées à deux buses APB, des interfaces de communication Contenu Logiciel: • RIDE7 development software toolset avec project manager • Compilateur GNU C/C++ • Gestionnaire d’application CircleOS task scheduler • Code source en C pour tout les exemples Contenu: d’applications & libraries • Carte microcontrôleur MC-78F0714 avec un microcontrôleur μPD78F0714 ASSP • Carte d’interface MC-I/O (Pour relier la carte microcontrôleur au module de puissance) standard (I2C, SPI, USART), un timer 16 bits générique. Le STM32F103 dispose aussi d’un port USB, CAN et d’un timer PWM. Avec une tension d’alimentation de 2.0 à 3.6 V le STM32F101(série entrée de gamme) offre une température d’utilisation de -40 à +85°C alors que le STM32F103xx (série hautes performances) peut fonctionner de -40 à +105 °C. Une gamme compléte de mode é’connomie d’énérgie’ permet de réaliser des applications basse consommation. • Péripherique de jeux et plateforme GPS • Applications industrielles: PLC, imprimantes et scanners • Module de puissance basse tension (MC-PWR-LV) avec le MOSFET inverseur • Moteur BLDC Pittman N2311 12V • Alimentation DC FW7362/15 • Oscillateur 20 MHz (pour utiliser avec l’unité de débogage On-Chip) Hardware Primer • The Primer se connecte directement au port USB du PC • Afficheur LCD couleur 128x128 pixel • Capteur MEMs, • Buzzer • Transceiver IrDA Réf. Fab. Code Commande Prix Unitaire STM3210B-PRIMER 150-2504▲ g37,98 Réf. Fab. Description Code Commande Prix Unitaire MC-LVKIT Kit de développement Contrôle moteur 129-7152● g70,49 Freq Flash RAM E/S Code Prix Unitaire Broches Boîtier (MHz) (Kb) (kB) Lines Description Réf. Fab. Commande 1+ Série entrée de gamme 32F101C6 48 LQFP 36 32 KB 6 32 Microcontrôleur 32 bits, ARM Cortex M2 STM32F101C6T6 144-7627● g5,15 32F101R6 64 LQFP 36 32 KB 6 49 Microcontrôleur 32 bits, ARM Cortex M3 STM32F101R6T6 144-7628● g5,50 32F101C8 48 LQFP 36 64 KB 10 32 Microcontrôleur 32 bits, ARM Cortex M4 STM32F101C8T6 144-7629● g5,95 32F101R8 64 LQFP 36 64 KB 10 49 Microcontrôleur 32 bits, ARM Cortex M5 STM32F101R8T6 144-7630● g6,35 32F101V8 100 LQFP 36 64 KB 10 80 Microcontrôleur 32 bits, ARM Cortex M6 STM32F101V8T6 144-7631● g7,30 32F101RB 64 LQFP 36 128 KB 16 49 Microcontrôleur 32 bits, ARM Cortex M7 STM32F101RBT6 144-7632● g7,65 32F101VB 100 LQFP 36 128 KB 16 80 Microcontrôleur 32 bits, ARM Cortex M8 STM32F101VBT6 144-7633● g8,55 Série hautes performances 32F103C6 48 LQFP 72 32 KB 10 32 Microcontrôleur 32 bits, ARM Cortex M9 STM32F103C6T6 144-7635● g6,20 32F103R6 64 LQFP 72 32 KB 10 49 Microcontrôleur 32 bits, ARM Cortex M10 STM32F103R6T6 144-7636● g6,55 32F103C8 48 LQFP 72 64 KB 20 32 Microcontrôleur 32 bits, ARM Cortex M11 STM32F103C8T6 144-7637● g7,30 32F103R8 64 LQFP 72 64 KB 20 49 Microcontrôleur 32 bits, ARM Cortex M12 STM32F103R8T6 144-7638● g7,85 32F103V8 100 LQFP 72 64 KB 20 80 Microcontrôleur 32 bits, ARM Cortex M13 STM32F103V8T6 144-7639● g8,80 32F103RB 64 LQFP 72 128 KB 20 49 Microcontrôleur 32 bits, ARM Cortex M14 STM32F103RBT6 144-7640● g9,10 32F103VB 100 LQFP 72 128 KB 20 80 Microcontrôleur 32 bits, ARM Cortex M15 STM32F103VBT6 144-7641● g10,20 Kit de démarrage pour Applications: • Pilote de moteu, Contrôle d’application et interface utilisateur • Equipment médical et portable Kit de démarrage pour contrôle moteur STM3210B-PRIMER Microcontrôleur 32 bits - STM32 ARM Cortex M3 • Système d’alarme,vidéo intercome et HVAC Kit de démarrage 78K0/Lx3 – See it! www.eu.necel.com/seeit 􀀺􀁓􀁘􀁖􀁉􀀄􀁇􀁌􀁅􀁑􀁔􀀄􀁚􀁍􀁗􀁙􀁉􀁐􀀄􀁚􀁅􀀄􀁉􀁒􀂴􀁒􀀄􀁔􀁓􀁙􀁚􀁓􀁍􀁖􀀄􀁗􀂫􀁱􀁐􀁅􀁖􀁋􀁍􀁖􀀄􀀅 􀀱􀁍􀁇􀁖􀁓􀁇􀁓􀁒􀁘􀁖􀁼􀁐􀁉􀁙􀁖􀁗􀀄􀀷􀁱􀁖􀁍􀁉􀀄􀀰􀀐􀀄􀁅􀁚􀁉􀁇􀀄􀁇􀁓􀁒􀁘􀁖􀁼􀁐􀁉􀁙􀁖􀀄􀁔􀁓􀁙􀁖􀀄􀁅􀁊􀂴􀁇􀁌􀁉􀁙􀁖􀀄􀀰􀀧􀀨􀀄􀁎􀁙􀁗􀁕􀁙􀀋􀁫􀀄􀀖􀀜􀀜􀀄􀁗􀁉􀁋􀁑􀁉􀁒􀁘􀁗􀀒 NEC Electronics propose une nouvelle famille de microcontrôleurs, la série Lx3/78KO, spécialement 􀀃 􀁇􀁰􀁙􀁈􀁏􀁒􀁓􀁓􀁰􀁈􀀃􀁓􀁒􀁘􀁕􀀃􀁏􀁈􀁖􀀃􀁄􀁓􀁓􀁏􀁌􀁆􀁄􀁗􀁌􀁒􀁑􀁖􀀃􀁄􀁙􀁈􀁆􀀃􀁄􀁉􀃀􀁆􀁋􀁈􀁘􀁕􀀃􀀯􀀦􀀧􀀃 􀁪􀀃􀁖􀁈􀁊􀁐􀁈􀁑􀁗􀁖􀀏􀀃􀁑􀁰􀁆􀁈􀁖􀁖􀁌􀁗􀁄􀁑􀁗􀀃􀁏􀁄􀀃􀁓􀁈􀁕􀁉􀁒􀁕􀁐􀁄􀁑􀁆􀁈􀀃􀁈􀁗􀀃􀁏􀁈􀀃􀁆􀁋􀁒􀁌􀁛􀀃􀁇􀁈􀁖􀀃􀁓􀁰􀁕􀁌􀁓􀁋􀁰􀁕􀁌􀁔􀁘􀁈􀁖 􀁈􀁐􀁅􀁄􀁕􀁔􀁘􀁰􀁖􀀑􀀃􀀦􀁈􀁖􀀃􀁆􀁒􀁑􀁗􀁕􀁻􀁏􀁈􀁘􀁕􀁖􀀃􀁓􀁈􀁕􀁐􀁈􀁗􀁗􀁈􀁑􀁗􀀃􀁇􀁈􀀃􀁆􀁒􀁐􀁐􀁄􀁑􀁇􀁈􀁕􀀃􀀃􀁘􀁑􀀃􀁓􀁏􀁘􀁖 grand nombre de segments pour vous offrir plus de possibilités : Contrôleur de 88 à 288 segments 􀀃􀀃􀀷􀁈􀁆􀁋􀁑􀁒􀁏􀁒􀁊􀁌􀁈􀀃􀁉􀁄􀁌􀁅􀁏􀁈􀀃􀁆􀁒􀁑􀁖􀁒􀁐􀁐􀁄􀁗􀁌􀁒􀁑 Une gamme inédite de boîtiers et de tailles mémoire • • • www.eu.necel.com/lcdcontrol Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Mémoires 8 Semiconducteurs, Passifs et Optoélectronique Les mémoires MRAM (magnetoresistive random access memory) de 1M et 4M sont organisées en respectivement 65 536 & 262 144 mots de 16 bits. elles dispose des broches suivantes: chip enable (E), write enable (W), et output enable (G), qui apporte de la flexibilité à votre système sans utilisé de bus. le contrôle séparé de ’Bytes-enable’ (LB et UB) permet de lire et écrire individuellement les octets. La technologie MRAM et non volatile et protège les données en cas de perte d’alimentation et ne nécessite pas de rafraîchissement périodique. Rétention des données pendant 20 ans. Ces circuits sont idéaux pour les applications qui ont besoin de stocker et récupérer en permanence des données critiques de façon rapide. Fonction avec une alimentation 3.3V Température d’utilisation (°C) Boîtier/Broches Description Réf. Fab. Code Commande Prix Unitaire -45/85 / TSOP II44 Mémoire MRAM 1M (64K x 16 bit) tps d’acc. 35ns MR0A16ACYS35 149-9761● g25,70 -40/105 44 / TSOP II Mémoire MRAM 1M (64K x 16 bit) tps d’acc. 35ns MR0A16AVYS35 149-9763● g34,20 0/70 / TSOP II44 Mémoire MRAM 1M (64K x 16 bit) tps d’acc. 35ns MR0A16AYS35 149-9764● g12,90 -40/85 / TSOP II44 Mémoire MRAM 4M (256K x 16 bits) tps d’acc. 35ns MR2A16ACYS35 149-9758● g34,20 0/70 / TSOP II44 Mémoire MRAM 4M (256K x 16 bits) tps d’acc. 35ns MR2A16ATS35C 149-9759● g19,40 -40/105 / TSOP II44 Mémoire MRAM 4M (256K x 16 bits) tps d’acc. 35ns MR2A16AVYS35 149-9760● g32,10 Mémoire MRAM Non-Volatile Statique • Deux unités de programmation indépendantes par cellules • Architecture facilement parcourable • Même boîtier et brochages que les familles de circuits AMD Am29LV en 3V • La famille de mémoire flash série SST 25 dispose de 4 fils de communication, compatible SPI. Le boîtier faible nombre de broche permet de gagner de la place sur les cartes et de réduire les coûts. • PIN-TO-PIN compatible ls standards industrie SPI serie EEPROM Réf. Fab. Boîtier/ Broches Déscription du produit Réf. Fab. Code Commande Prix Unitaire 45DB001 8 / SOIC Mémoire série DataFlash 1M , 2.7V - 20MHz AT45DB011B-SU 109-5792● g1,54 45DB011 8 / SOIC Mémoire FLASH, 1MB, 2.7V DataFlash, 20MHz AT45DB011D-SU 136-2659● g1,25 45DB021 8 / SOIC Mémoire FLASH 2MB, 2.7V, 20MHz AT45DB021D-SU 136-2660● g2,50 45DB021 8 / SOIC Mémoire FLASH 2Mb, 2.7V, SPI, interface série RapidS AT45DB021D-SSU 145-5036● g1,49 45DB041 8 / SOIC Mémoire FLASH 4Mb, 2.5V, interface série SPI et RapidS AT45DB041D-SSU 145-5037● g1,86 45DB041 28 / TSOP Mémoire série DataFlash 4M, 2.7V - 20MHz AT45DB041B-TU 109-5795● g2,62 45DB041 8 / SOIC Mémoire FLASH 4MB, 2.5V ou 2.7V, 20MHz AT45DB041D-SU 136-2661● g2,00 45DB081 8 / SOIC Mémoire FLASH 8Mb, 2.5V, interface série SPI, RapidS, boîtier SOIC large (0.150”) AT45DB081D-SSU 145-5038● g1,94 45DB081 8 / SOIC Mémoire FLASH 8Mb, 2.5V, interface série SPI, RapidS, boîtier SOIC large (0.209”) AT45DB081D-SU 145-5039● g1,94 45DB081 28 / TSOP Mémoire série DataFlash 8Mo AT45DB081B-TU 109-5796● g3,29 45DB161 8 / SOIC Mémoire FLASH 16Mb, interface série SPI, RapidS AT45DB161D-SU 145-5040● g2,95 45DB161 28 / TSOP Mémoire FLASH 16Mb, interface série SPI, RapidS AT45DB161D-TU 145-5041● g2,65 45DB321 8 / SOIC Mémoire FLASH 32MB, 2.7V, interface série SPI et RapidS AT45DB321D-SU 145-5042● g3,35 45DB321 28 / TSOP Mémoire FLASH 32MB, 2.7V, 20MHz AT45DB321D-TU 136-2664● g6,55 45DB642 28 / TSOP Mémoire FLASH 64Mb (8M x 8) Série SPI et interface E/S parallèle TSOP (TEMP IND) AT45DB642D-TU 109-5799● g11,70 45DB642 8 / CASON Mémoire FLASH 64MB, 2.7V DataFlash, double-interface AT45DB642D-CNU 145-5043● g7,10 Réf. Fab.BrochesBoîtierDéscription Réf. Fab. Code Commande Prix Unitaire 25FL008 8 SOP Mémoire FLASH 8Mb (512K×8) CMOS 3V, 50 MHz bus SPI S25FL008A0LMFI001 147-8653● g1,57 25FL016 16 SOIC Mémoire FLASH 16Mb (512Kx32) 3V, 50 MHz Bus SPI S25FL016A0LMFI001 147-8654● g1,79 25FL064 16 SOIC Mémoire FLASH 64Mb (512Kx128) 3V, 50 MHz Bus SPI S25FL064A0LMFI001 147-8656● g6,14 29GL512 64 BGA 512Mb (32Mx16 / 64Mx8) High Sector Protect S29GL512N10FFI010 147-8657● g23,74 29GL512 64 BGA 512Mb (32Mx16 / 64Mx8) Low Sector Protect S29GL512N10FFI020 147-8658● g23,74 Mémoire DataFlash Atmel AT45D Réf. Fab. Fab. Broches Boîtier Description Code Commande Prix Unitaire SST25VF010A-33-4I-SAE SST 8 SOIC Mémoire FLASH Série 1 Mbit Fréquence d’horloge 33MHz 136-8686● g1,74 SST25VF010A-33-4I-QAE SST 8 WSON Mémoire FLASH Série 1 Mbit Fréquence d’horloge 33MHz 136-8687● g2,02 SST25LF020A-33-4I-SAE SST 8 SOIC Mémoire FLASH Série 2 Mbit Fréquence d’horloge 33MHz 136-8688● g2,13 SST25VF040B-50-4I-S2AF SST 8 SOIC Mémoire FLASH Série 4 Mbit Fréquence d’horloge 50MHz 136-8690● g2,88 SST25VF040B-50-4I-QAF SST 8 WSON Mémoire FLASH Série 4 Mbit Fréquence d’horloge 50MHz 136-8691● g3,00 SST25VF080B-50-4I-S2AF SST 8 SOIC Mémoire FLASH Série 8 Mbit Fréquence d’horloge 50MHz 136-8693● g3,46 SST25VF080B-50-4I-QAF SST 8 WSON Mémoire FLASH Série 8 Mbit Fréquence d’horloge 50MHz 136-8694● g3,79 SST25VF016B-50-4I-S2AF SST 8 SOIC Mémoire FLASH Série 16 Mbit Fréquence d’horloge 50MHz 136-8695● g3,88 SST25VF016B-50-4I-QAF SST 8 WSON Mémoire FLASH Série 16 Mbit Fréquence d’horloge 50MHz 136-8696● g4,11 Mémoire FLASH faible tenion MirrorBit™ Caractéristiques : • Disponible en densités allant de 1 Mo à 64 Mo (mise à niveau facile) • Interface série SPI simple nécessitant uniquement 7 broches pour assurer l’interface avec le processeur hôte Mémoire Flash série SST 25x • Transfert de données SPI rapide jusqu’à 20 MHz • Un/deux tampons bidirectionnels intégrés, pour expédier le flux des données vers/ depuis le dispositif Caractéristiques: • Deux bits de données stockés dans une seule cellule mémoire grace à une architecture symétrique • Deux emplacement de stockage distincts par cellule RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Interfaces 9 Semiconducteurs, Passifs et Optoélectronique Maxim présente le driver MOSFET sans inversion simple/double 6 A et 1,5 A pour la permutation des alimentations électriques, convertisseurs CC/CC, les contrôleurs de moteurs et les drivers Diode PIN. Les FDMF8700/05 présentent une solution complètement intégrée et optimisée de drivers 12 V plus puissance MOSFET pour des applications CC-CC Buck synchrones à haute intensité. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 8 SOIC -40°C à +85°C Driver de MOSFET 6A Simple non-inverseur . . . . . . . . . . . . . . . . . . . .MAX4420ESA+ 142-2324● g4,65 8 SOIC -40°C à +85°C Driver de MOSFET 1.5A Double non-inverseur . . . . . . . . . . . . . . . . . . .MAX4427ESA+ 142-2325● g4,10 Linear Technology présente des drivers MOSFET de puissance en configuration N pont plein/demipont, économiques, pour le contrôle de moteur en pont plein ou demi-pont et une charge inductive à haute intensité PWM. Les commandes de grille en demi-pont Fairchild avec fonctions d’arrêt et programmables de contrôle de temps mort pour la commande des MOSFET et IGBT. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 56 Power 88 -55°C à +150°C Driver plus FET Multi-chip Module . . . . . . . . . . . . . . . . . . . . . . . . . . . .FDMF8705 149-5481● g1,95 56 Power 88 -55°C à +150°C Driver plus FET Multi-chip Module . . . . . . . . . . . . . . . . . . . . . . . . . . . .FDMF8700 149-5480● g4,23 Broches Boîtier Description Réf. Fab. Code Commande Prix Unitaire 14 SOP Driver de demi pont . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FAN7384M 149-5478● g0,68 8 SOIC Driver de demi pont . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FAN73832M 149-5475● g0,68 8 DIP Driver de demi pont . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FAN73832N 149-5476● g0,84 14 SOP Driver 2 canaux High Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FAN7385M 149-5479● g0,73 14 SOP Driver de demi pont . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FAN7383M 149-5477● g0,68 Drivers MOSFET Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 16 SOIC 0°C à +70°C Driver de MOSFET Canal N Demi pont . . . . . . . . . . . . . . . . . . . . . . . . .LT1158CSW#PBF 127-3473● g6,75 14 SOIC 0°C à +70°C Driver de MOSFET Canal N Demi pont . . . . . . . . . . . . . . . . . . . . . . . . .LT1160CS#PBF 127-3475● g6,05 20 SOIC 0°C à +70°C Quadruple driver MOSFET, haute tension, large bande . . . . . . . . . . . . .LT1161CSW#PBF 127-3476● g7,00 24 SOIC 0°C à +70°C Driver de MOSFET canal N Full bridge . . . . . . . . . . . . . . . . . . . . . . . . .LT1162CSW#PBF 127-3477● g9,80 8 SOIC -40°C à +85°C Driver MOSFET large bande protégé. . . . . . . . . . . . . . . . . . . . . . . . . . .LT1910ES8#PBF 127-3493● g4,45 8 SOIC 0°C à +70°C Commutateur MOSFET "High Side", Dx . . . . . . . . . . . . . . . . . . . . . . . .LTC1154CS8#PBF 127-3505● g3,75 8 SOIC 0°C à +70°C Driver de MOSFET, rapide, double . . . . . . . . . . . . . . . . . . . . . . . . . . . .LTC1693-1CS8#PBF 127-3525● g3,75 8 SOIC 0°C à +70°C Driver de MOSFET, rapide, double . . . . . . . . . . . . . . . . . . . . . . . . . . . .LTC1693-2CS8#PBF 127-3526● g3,80 10 MSOP -40°C à +85°C Driver de MOSFET N 6A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LTC4441EMSE#PBF 127-3554● g3,90 Les TPS40180 peuvent être utilisés dans un bloc d’alimentation PSU, branchés en parallèle afin de créer la puissance de sortie exigée. La famille des contrôleurs de moteur UC3625 intègre, dans un seul boîtier, la plupart des fonctions nécessaires au contrôle de moteur cc sans charbon à haute performance. Drivers de MOSFET Commandes en demi-pont Drivers MOSFET Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 24 QFN -40°C à +85°C Contrôleur simple phase empilable. . . . . . . . . . . . . . . . . . . . . . . . . . . .TPS40180RGETG4 149-4893● g3,83 28 PDIP Contrôleur de moteur BLDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UC2625N 146-1190● g9,40 16 TSSOP -40°C à +85°C Contrôleur 3 canaux (2 Boost, 1 Buck/Boost), faible tension d’entrée . .TPS5100IPW 147-1232● g2,64 Contrôleurs de moteur Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Gestion de puissance 10 Semiconducteurs, Passifs et Optoélectronique TI présente une famille complète de convertisseurs analogiques numériques (ADC), offrant une sortie de courant et de tension, des interfaces série et parallèle et des ADC de précision en résolution jusqu’à 24 bits pour des applications industrielles rigoureuses. National Semiconductor présente une famille complète de convertisseurs analogiques numériques (ADC), offrant une sortie de courant et de tension, des interfaces série et parallèle et des ADC de précision en résolution jusqu’à 12 bits pour des applications industrielles rigoureuses. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 64 QFN Convertisseur A/N 14 bits, 65MSPS, sortie LVDS sérialisées, quadruple . . . .ADS6442IRGCT 139-0656● g136,68 16 QFN Convertisseur A/N 16 bits série avec MUX 2-vers-1, 2.7-5.5V, 1MSPS . . . . .ADS8330IBRSATG4 139-0681● g33,62 28 SSOP Convertisseur N/A 16 bits 250kHz, interface parallèle, référence de tension interne 4.096V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADS8515IDBG4 143-9620● g20,40 28 SOIC Convertisseur N/A 16 bits 250kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ADS7811U 145-9270● g54,10 16 SOIC Convertisseur A/N 16 bits, série, basse puissance . . . . . . . . . . . . . . . . . . . .ADS7813UB 145-9277● g38,30 28 PDIP Convertisseur A/N 16 bits 4 canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ADS7825PB 145-9283● g53,10 28 SSOP Convertisseur N/A 16 bits 250kHz, interface parallèle, référence de tension interne 4.096V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADS8515IBDBRG4 149-4883● g23,56 24 TSSOP Convertisseur A/N 24 bits très faible bruit . . . . . . . . . . . . . . . . . . . . . . . . . . .ADS1232IPWG4 139-0671● g7,68 16 TSSOP Convertisseur A/N 20 bits Delta Sigma pour capteur de pont . . . . . . . . . . . . .ADS1230IPWG4 139-0672● g5,14 28 TSSOP Convertisseur A/N 24 bits Ultra faible bruit . . . . . . . . . . . . . . . . . . . . . . . . . .ADS1234IPWG4 139-0674● g9,25 10 MSOP Convertisseur N/A 24 bits Delta Sigma avec rejection 50 & 60Hz, 15SPS . . .ADS1244IDGSTG4 139-0675● g6,68 14 TSSOP Convertisseur A/N 24 bits Stéréo, entrée analogique assymétrique, 96-kHz . .PCM1808PWG4 139-0705● g2,01 48 TQFP Convertisseur A/N 24 bits audio stéréo, 216kHz, 124dB . . . . . . . . . . . . . . . .PCM4222PFBG4 139-0708● g30,72 48 TQFP -40°C à +85°C Convertisseur N/A 24 bits, 8 canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ADS1217IPFBT 145-9253● g9,30 Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 48 TQFP / 48 -40°C à +105°C Convertisseur A/N 8 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADC08B200CIVS 137-0034● g36,70 128 LQFP -40°C à +85°C Convertisseur A/N 8 bits 3 GSPS, Haute performance, basse puissance de la famille PowerWise® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADC083000CIYB 147-1251● g825,20 8 MSOP -40°C à +105°C Convertisseur A/N 12 bits, 500 kSPS à 1 MSPS, entrée Diff.. . . . . . . . . . . ADC121S705CIMM 132-0971● g4,65 8 MSOP -40°C à +105°C Convertisseur A/N 12 bits 500KSPS, entrées différentielles. . . . . . . . . . . . ADC121S655CIMM 137-0035● g4,60 32 LLP Convertisseur A/N 12 bits 105 MSPS de la famille PowerWise®. . . . . . . . ADC12C105CISQ 143-3177● g54,10 32 LLP Convertisseur A/N 14 bits 105 MSPS de la famille PowerWise®. . . . . . . . ADC14C105CISQ 143-3178● g92,40 48 LLP -40°C à +85°C Convertisseur A/N 14 bits 155 MSPS, bande passante 1.1 GHz, avec sortie LVDS de la famille PowerWise®. . . . . . . . . . . . . . . . . . . . . . . . . . . ADC14V155CISQ 147-1252● g122,60 Convertisseurs A/N Convertisseurs A/N RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Gestion de puissance 11 Semiconducteurs, Passifs et Optoélectronique Maxim présente une famille complète de convertisseurs analogiques numériques (ADC), offrant une sortie de courant et de tension, des interfaces série et parallèle et des ADC de précision en résolution jusqu’à 12 bits pour des applications industrielles rigoureuses. Linear Technology présente une famille complète de convertisseurs numériques analogiques (DAC), offrant une sortie de courant et de tension, des interfaces série et parallèle et des DAC de précision en résolution jusqu’à 16 bits pour des applications industrielles rigoureuses et des convertisseurs numériques analogiques (DAC) avec des fréquences de sorties jusqu’à 50 Msps Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 16 QSOP -40°C à +85°C Convertisseur A/N 8 bits 12 canaux, série 2 fils . . . . . . . . . . . . . . . . . . . . . .MAX1038AEEE+ 142-2279● g4,05 48 TQFP -40°C à +85°C Convertisseur A/N 8 bits, Double, Basse consommation. . . . . . . . . . . . . . . .MAX1198ECM+D 143-3195● g32,10 20 TSSOP -40°C à +85°C 4 Channel Multirange Inputs Serial 16-Bit ADCs . . . . . . . . . . . . . . . . . . . . . .MAX1303BEUP+ 143-3196● g82,90 48 TQFP -40°C à +85°C Interface pour afficheur numérique 3.5 digits . . . . . . . . . . . . . . . . . . . . . . . .MAX1367ECM+ 143-3198● g18,10 16 QSOP -40°C à +85°C Convertisseur A/N 12 bits, interface série 2 fils. . . . . . . . . . . . . . . . . . . . . . .MAX1238EEE+ 142-2280● g12,90 Broches Boîtier Description Réf. Fab. Code Commande Prix Unitaire 6 SC-70 R, R2R, D/B, L, S, V . . . . . . . .LTC2630CSC6-LM12#PBF 143-2693● g3,30 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630ACSC6-HM12#PBF 143-2706● g4,40 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630ACSC6-HZ12#PBF 143-2707● g4,40 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AHSC6-HM12#PBF 143-2711● g4,95 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AHSC6-HZ12#PBF 143-2712● g4,95 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AHSC6-LM12#PBF 143-2713● g4,95 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AHSC6-LZ12#PBF 143-2714● g4,95 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AISC6-HM12#PBF 143-2715● g4,75 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AISC6-HZ12#PBF 143-2716● g4,75 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AISC6-LM12#PBF 143-2717● g4,75 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630AISC6-LZ12#PBF 143-2718● g4,75 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630CSC6-HM12#PBF 143-2719● g3,30 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630CSC6-HZ12#PBF 143-2721● g3,30 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630CSC6-LZ12#PBF 143-2724● g3,30 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630HSC6-HM12#PBF 143-2726● g3,70 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630HSC6-HZ12#PBF 143-2728● g3,70 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630HSC6-LM12#PBF 143-2730● g3,70 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630HSC6-LZ12#PBF 143-2732● g3,70 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630ISC6-HM12#PBF 143-2735● g3,60 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630ISC6-HZ12#PBF 143-2737● g3,60 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630ISC6-LM12#PBF 143-2739● g3,60 6 SC-70 R, V, D/B, L. . . . . . . . . . . . . . .LTC2630ISC6-LZ12#PBF 143-2741● g3,60 8 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2641CDD-12#PBF 143-2743● g6,50 8 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2641IDD-12#PBF 143-2748● g7,80 10 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2642CDD-12#PBF 143-2753● g6,50 10 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2642IDD-12#PBF 143-2756● g7,80 8 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2641CDD-16#PBF 143-2745● g13,80 8 MSOP R, V . . . . . . . . . . . . . . . . . . . .LTC2641CMS8-16#PBF 143-2747● g13,80 8 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2641IDD-16#PBF 143-2750● g16,60 8 MSOP R, V . . . . . . . . . . . . . . . . . . . .LTC2641IMS8-16#PBF 143-2751● g16,60 10 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2642CDD-16#PBF 143-2755● g13,80 10 DFN R, V . . . . . . . . . . . . . . . . . . . .LTC2642IDD-16#PBF 143-2759● g16,60 Convertisseurs A/N National Semiconductor lance les convertisseurs numériques analogiques (DAC) en résolutions de 8 à 12 bits et un choix de sorties rail à rail. Convertisseurs N/A Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 10 MSOP -40°C à +105°C Convertisseur N/A 8 bits Micro Power, sorties Rail-to-Rail, double . . . . . . . . . . . . . . .DAC082S085CIMM 131-2535● g3,85 10 MSOP -40°C à +105°C Convertisseur N/A 8 bits Micro Power, sorties Rail-to-Rail, quadruple . . . . . . . . . . . . .DAC084S085CIMM 131-2536● g4,80 10 MSOP -40°C à +105°C Convertisseur N/A10 bits très faible puissance avec sortie Rail-to-Rail, double . . . . . .DAC102S085CIMM 131-2537● g5,70 10 MSOP -40°C à +105°C Convertisseur N/A10 bits très faible puissance avec sortie Rail-to-Rail, quadruple . . . .DAC104S085CIMM 131-2538● g8,85 16 TSSOP Convertisseur N/A10 bits très faible puissance avec sortie Rail-to-Rail, octal. . . . . . . .DAC108S085CIMT 149-5063● g7,65 10 MSOP -40°C à +105°C Convertisseur N/A 12 bits faible puissance, sortie Rail-to-Rail, double. . . . . . . . . . . . .DAC122S085CIMM 131-2539● g6,80 10 MSOP -40°C à +105°C Convertisseur N/A 12 bits faible puissance, sortie Rail-to-Rail, quadruple . . . . . . . . . .DAC124S085CIMM 131-2540● g11,40 16 TSSOP Convertisseur N/A 12bits 8 canaux. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DAC128S085CIMT 149-5073● g13,60 Convertisseurs N/A Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Gestion de puissance 12 Semiconducteurs, Passifs et Optoélectronique La gamme élargie des amplificateurs opérationnels (OP AMP) que présente ASI offre un bruit ultra faible, une puissance basse et un décalage faible pour une variété d’applications industrielles à grande vitesse et haute précision. Maxim lance une vaste gamme de convertisseurs numériques analogiques (DAC) en résolutions de 8 à 16 bits avec des fréquences de sortie variables jusqu’à 50 Msps Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 8 SO 0°C à +70°C Amplificateur opérationnel, simple alimentation 1,2uA max . . . . . . . . . . . . . . . .MAX406BCSA+ 142-2316● g4,85 8 SO -40°C à +85°C Amplificateur double . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX4126ESA+ 142-2317● g3,80 8 SOIC -40°C à +85°C Ampli op E/S Rail-to-Rail, Micropower, Simple alim. SOT23 . . . . . . . . . . . . . . .MAX4163ESA+ 137-9964● g3,05 8 MSOP -40°C à +85°C Ampli op Simple/Doublel/Quad large bande passante, faible puissance, simple alim. E/S Rail-to-Rail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAX4132EUA+ 137-9962● g4,05 8 SOIC -40°C à +85°C Amplificateur OP de précision double 28MHz . . . . . . . . . . . . . . . . . . . . . . . . . .MAX412ESA+ 142-2318● g10,20 8 SOIC -40°C à +85°C Amplificateur OP, Rail-to-Rail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX4162ESA+ 142-2320● g2,85 8 μMAX -40°C à +85°C Amplificateur OP, 3 MHz double Rail-to-Rail . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX4252EUA+ 142-2321● g3,55 8 SOIC -40°C à +85°C Amplificateur, Comparateur & Référence de tension . . . . . . . . . . . . . . . . . . . . .MAX951ESA+ 142-2371● g4,35 Code Broches Boîtier Description Réf. Fab. Commande Prix Unitaire 28 TSSOP Amplificateur OP basse puissance, fort courant d’entrée, Driver de ligne ADSL/ ADSL2+, Quadruple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AD8392AAREZ 149-8681● g5,78 14 TSSOP Amplificateur OP, faible puissance, Triple, basse puissance, sortie Rail-to-Rail, avec supression des très faibles puissances, triple. . . . . . . . . . . . . . . . . . . . . . . . ADA4853-3YRUZ 149-8692● g1,79 8 SOIC Amplificateur OP de précision simple, entrée JFET . . . . . . . . . . . . . . . . . . . . . . . .ADA4000-1ARZ 149-8688● g1,41 8 SOIC Amplificateur OP de précision,entrée JFET, double . . . . . . . . . . . . . . . . . . . . . . . .ADA4000-2ARZ 149-8689● g2,58 14 SOIC Amplificateur OP de précision entrée JFET, quadruple . . . . . . . . . . . . . . . . . . . . .ADA4000-4ARZ 149-8690● g4,38 8 SOT-23 Amplificateur OP, CMOS, 1 uA, faible consommation, double. . . . . . . . . . . . . . . .AD8502ARJZ 149-8684● g1,95 14 TSSOP Amplificateur OP, CMOS très basse puissance 1uA, quadruple. . . . . . . . . . . . . . .AD8504ARUZ 149-8685● g2,33 14 SOIC Amplificateur OP de précision Rail to Rail 16 V, quadruple . . . . . . . . . . . . . . . . . .AD8664ARZ 149-8687● g4,48 8 SOIC Amplificateur OP de précision, basse puissance, double . . . . . . . . . . . . . . . . . . .AD8539ARZ 149-8686● g2,58 Convertisseurs N/A Amplificateurs opérationnels Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 8 SOIC 0°C à +70°C Serial-Input, Voltage-Output, 14-Bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX5544CSA+ 145-5630● g12,30 8 SOIC -40°C à +85°C Serial-Input, Voltage-Output, 14-Bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX5544ESA+ 145-5632● g13,30 8 DIP 0°C à +70°C Convertisseur N/A 8 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX517ACPA+ 142-2333● g7,75 16 DIP 0°C à +70°C Convertisseur N/A 8 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX519ACPE+ 142-2334● g8,65 16 NSOIC 0°C à +70°C Convertisseur N/A 8 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX519ACSE+ 142-2335● g8,65 16 TQFN -40°C à +85°C Convertisseur N/A 8 bits, Programmable, Double . . . . . . . . . . . . . . . . . . . . . .MAX5548ETE+ 143-3202● g8,30 16 DIP 0°C à +70°C MDAC 12 bits, double. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX532BCPE+ 142-2337● g23,50 68 QFN -40°C à +85°C Convertisseur N/A 12 bits, haute performance Dynamique. . . . . . . . . . . . . . . .MAX5873EGK+D 143-3204● g26,40 68 QFN -40°C à +85°C Convertisseur N/A 16 bits, 600Msps, Haute Dynamique avec entrée LVDS . . .MAX5891EGK+D 143-3205● g85,80 28 DIP 0°C à +70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX197BCNI+ 142-2294● g30,30 8 SOIC -40°C à +85°C Convertisseur N/A Audio Stéréo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX5556ESA+ 143-3203● g2,65 14 SO 0°C à +70°C Convertisseur N/A 12 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX531ACSD+ 142-2336● g19,20 La gamme des amplificateurs opérationnels (OP AMP) que présente Maxim offre une sortie rail à rail à bruit ultra faible, distorsion ultra faible, micropuissance pour des applications industrielles rigoureuses. Amplificateurs opérationnels Amplificateurs opérationnels RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Gestion de puissance 13 Semiconducteurs, Passifs et Optoélectronique Besoin d’un meilleur prix? Obtenez le meilleur prix Fairchild présente des amplificateurs opérationnels (OP AMP) à retour de tension, haute performance et grande vitesse avec une sortie rail à rail pour des applications vidéo et autres applications grande vitesse. Nos prix sont revus de manière régulière, afin de vous permettre d’obtenir le prix le plus adapté au marché Consultez nos tarifs en vigueur sur www.farnell.fr Les LTC1380/LTC1393 sont des multiplexeurs analogiques CMOS avec des interfaces numériques compatibles SMBus®. Le LTC1380 est un multiplexeur à 8 canaux à terminaison simple, alors que le LTC1393 est un multiplexeur à 4 canaux différentiel. La gamme des amplificateurs opérationnels (OP AMP) que présente LT offre une sortie rail à rail, bruit ultra faible, distorsion ultra faible, faible puissance et faible décalage pour toutes les applications industrielles rigoureuses. 04 74 68 99 98 cotations@farnell.com Conditionne- Température Code -ment Broches Boîtier d’utilisation Description Réf. Fab. Commande Prix Unitaire 10 DFN Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, double . . . . . . . .LTC6081CDD#PBF 143-2782● g3,75 8 MSOP Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, double . . . . . . . .LTC6081CMS8#PBF 143-2784● g3,75 8 MSOP Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, double . . . . . . . .LTC6081HMS8#PBF 143-2785● g4,55 10 DFN Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, double . . . . . . . .LTC6081IDD#PBF 143-2786● g4,55 16 DFN Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, quadruple. . . . . .LTC6082CDHC#PBF 143-2787● g6,40 16 SSOP Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, quadruple. . . . . .LTC6082CGN#PBF 143-2788● g6,40 16 SSOP Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, quadruple. . . . . .LTC6082HGN#PBF 143-2789● g7,75 16 DFN Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, quadruple. . . . . .LTC6082IDHC#PBF 143-2790● g7,75 16 SSOP Amplificateur OP de précision CMOS, Rail-to-Rail, E/S, quadruple. . . . . .LTC6082IGN#PBF 143-2791● g7,75 16 SSOP Amplificateur OP, 8MHz, faible bruit, Rail-to-Rail, quadruple . . . . . . . . . .LTC6242HVCGN#PBF 146-2132● g4,85 8 SOIC Amplificateur opérationnel CMOS simple 18MHz, faible bruit, rail-to-rail .LTC6240CS8#PBF 143-2090● g1,80 8 SOIC Amplificateur opérationnel CMOS simple 18MHz, faible bruit, rail-to-rail .LTC6240HVCS8#PBF 143-2091● g3,35 6 DFN Amplificateur opérationnel simple de précision 13uA rail to rail 1.8V . . . .LT6000IDCB#PBF 143-2092● g2,00 5 TSOT-23 Amplificateur OP, 1.6V, 1μA précision, E/S Rail-to-Rail. . . . . . . . . . . . . .LT6003IS5#PBF 143-2097● g1,65 8 MSOP Amplificateur OP, 1.6V, 1μA précision, E/S Rail-to-Rail. . . . . . . . . . . . . .LT6004IMS8#PBF 143-2098● g2,70 16 TSSOP Amplificateur OP, 1.6V, 1μA précision, E/S Rail-to-Rail. . . . . . . . . . . . . .LT6005IGN#PBF 143-2099● g4,15 8 MSOP Amplificateur OP, faible bruit, 50MHz, Rail-to-Rail, double . . . . . . . . . . .LTC6244IMS8#PBF 143-2088● g4,10 8 MSOP Amplificateur OP de précision, Rail-to-Rail, 13μA, 1.8V, double . . . . . . .LT6001IMS8#PBF 143-2094● g3,25 8 MSOP Double amplificateur CMOS rail to rail de précision . . . . . . . . . . . . . . . . .LTC6081IMS8#PBF 143-2122● g4,55 16 SSOP Amplificateur OP de précision 1,8V, 13A, Rail-to-Rail, quadruple. . . . . . .LT6002IGN#PBF 143-2095● g5,20 Tube 14 DIP 0°C à +70°C Amplificateur OP de précision à faible consommation, quadruple . . . . . .LT1014CN#PBF 152-3868● g172,87 Broches Boîtier Description Réf. Fab. Code Commande Prix Unitaire 16 SOIC Multiplexeur analogique 8 canaux, Single -End avec interface SMBus . .LTC1380CS#PBF 141-7732● g6,30 16 SOIC Multiplexeur analogique 8 canaux, Single -End avec interface SMBus . .LTC1380IS#PBF 141-7734● g7,05 16 SOIC Multiplexeur analogique 4 canaux, Différentiel, avec interface SMBus . .LTC1393CS#PBF 141-7735● g6,30 Température Code Broches Boîtier d’utilisation Description Réf. Fab. Commande Prix Unitaire 14 TSSOP Amplificateur triple à tension feedback conçu pour applications vidéos, haute performance . . . . . . . . . .FHP3350IMTC14X 149-5447● g0,76 5 SOT-23 Amplificateur Rail-to-Rail, simple, haute rapidité . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FHP3132IS5X 149-5444● g0,68 14 TSSOP Quadruple amplificateur à tension feedback conçu pour les applications vidéo, haute performance . . . .FHP3450IMTC14X 149-5449● g0,88 6 SOT-23 Amplificateur 0.4mA, 2.5V à 12V, 70MHz Rail-to-Rail. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FHP3131IS6X 149-5443● g0,58 8 SOIC Amplificateur rapide, Rail-to-Rail, double . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .FHP3232IM8X 149-5445● g1,19 14 TSSOP Quad, High Speed, 2.7V to 12V, Rail to Rail Amplifier, low differential gain and phase (0.008% /0.01°) and 0.1dB gain flatness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FHP3430IMTC14X 149-5448● g1,06 14 DIP Amplificateur OP, entrée JFET, quadruple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LF347N 141-7639● g0,50 14 DIP Amplificateur OP, quadruple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LM324N 141-7640● g0,29 8 DIP Amplificateur OP, pour utilisation générale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LM741CN 141-7641● g0,27 Amplificateurs opérationnels @ Amplificateurs opérationnels Multiplexeur 4/8 canaux Notre service cotations est à votre disposition pour vous proposer un meilleur tarif sur toute demande à partir de 500g Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Gestion de puissance 14 Semiconducteurs, Passifs et Optoélectronique Multiplexeurs ADI lance ses multiplexeurs JFET et CMOS à plusieurs canaux, faible capacitance avec de larges plages de tension et une précision de première classe. Maxim présente la gamme industrielle la plus vaste de multiplexeurs et commutateurs analogiques à haute performance et faible résistance. Les produits sont disponibles pour des applications d’utilisation générale, mais également pour des applications spécifiques. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 8 PDIP Multiplicateur analogique quatre quadrants, précision 2% max . . . . . . . . . . . . . . . . . .AD633ANZ 143-8410● g7,90 16 PDIP Multiplexeur analogique CMOS 8 canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .AD7503JNZ 143-8640● g11,60 16 PDIP Multiplexeur analogique CMOS 8 canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .AD7503KNZ 143-8641● g12,10 28 PDIP Multiplexeur analogique CMOS 16 canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .AD7506KNZ 143-8642● g19,90 48 TQFP 16-Channel, Serially Controlled 3.5 Ohm 1.8 V to 5.5 V, ±2.5 V, Analog Multiplexer . .ADG726BSUZ 143-8753● g9,60 48 TQFP Multiplexeur analogique, 32 canaux, contrôle série, 3.5 Ohms 1.8 V à 5.5 V, ±2.5 V .ADG732BSUZ 143-8754● g9,60 16 PDIP 8-Channel JFET Analog Multiplexer (Overvoltage & Power Supply Loss Protected) . . .MUX08EPZ 143-8755● g11,10 28 TSSOP Low Capacitance, 16 - Channel ±15 V/12 V iCMOS™ Multiplexer . . . . . . . . . . . . . . .ADG1206YRUZ 143-8936● g7,65 28 TSSOP Low Capacitance, 8 - Channel ±15 V/12 V iCMOS™ Multiplexer . . . . . . . . . . . . . . . .ADG1207YRUZ 143-8937● g8,05 16 SOIC Low Capacitance, 8-Channel, ±15 V/+12 V iCMOS™ Multiplexer . . . . . . . . . . . . . . .ADG1208YRZ 143-8938● g4,40 16 SOIC Low Capacitance, 4-Channel, ±15 V/+12 V iCMOS™ Multiplexer . . . . . . . . . . . . . . .ADG1209YRZ 143-8939● g4,40 16 TSSOP Multiplexeur 8 canaux ±15 V /12 V /±5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ADG1408YRUZ 143-8940● g5,55 16 TSSOP Multiplexeur analogique ±15 V /12 V /±5 V, CMOS, 4 canaux . . . . . . . . . . . . . . . . . .ADG1409YRUZ 143-8941● g5,55 24 TSSOP 350 MHz Single-Supply (5 V) Triple 2:1 Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . .AD8188ARUZ 149-8723● g3,62 Les multiplexeurs analogiques TI offrent des entrées multicanaux à terminaison simple ainsi que des entrées différentielles. Ils offrent également une protection contre les surtensions et une protection ESD. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 16 DIP 0°C à +70°C Multiplexeur analogiqueique CMOS monolitique . . . . . . . . . . . . . . . . . .DG509ACJ+ 137-9794● g5,80 16 SOIC 0°C à +70°C Multiplexeur analogiqueique CMOS monolitique . . . . . . . . . . . . . . . . . .DG509ACWE+ 137-9795● g9,45 16 SOIC 0°C à +70°C Multiplexeur analogiqueique CMOS monolitique . . . . . . . . . . . . . . . . . .DG509ADY+ 137-9796● g7,30 16 NSOIC 0°C à +70°C Analogue Multiplexer/Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX4051ACSE+ 142-2311● g4,10 16 QSOP 0°C à +70°C Analogue Multiplexer/Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX4051AEEE+ 142-2312● g6,30 16 NSOIC 0°C à +70°C Analogue Multiplexer/Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX4052ACSE+ 142-2313● g3,90 16 QSOP -40°C à +85°C Analogue Multiplexer/Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX4052EEE+ 142-2314● g4,70 Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 16 SOIC -40°C à +85°C Multiplexeur analogique 16 canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MPC506AUG4 120-6919● g8,70 16 SOIC -40°C à +85°C Multiplexeur, 16-canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MPC508AUG4 120-6920● g5,25 16 SOIC -40°C à +85°C Multiplexeur analogique 4 canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MPC509AUG4 120-6921● g6,00 28 DIP -40°C à +85°C Multiplexeur analogique CMOS bipolaire à 4 canaux, avec protection contre les surtensions et résistance aux déchar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPC509AP 121-4449● g5,40 28 SOIC -40°C à +85°C Multiplexeur Analogique 8 canaux. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MPC507AUG4 123-4707● g11,00 28 DIP -40°C à +85°C Multiplexeur analogique CMOS unipolaire à 16 canaux, avec protection contre les surtensions et résistance aux décharges . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPC506AP 141-7416● g14,60 Multiplexeurs Multiplexeurs Multiplexeurs RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Discrets 15 Semiconducteurs, Passifs et Optoélectronique SEMITOP2 SEMITOP3 IC cont VCE(sat) IC tr tf max. PD VCES 25°C max. pulsé typ. typ. 25°C Code Prix V A V A ns ns W Boîtier Réf. Fab. Commande Unitaire 400 20 1.8 60 340 1500 125 D2PAK STGB10NB37LZ 145-6833● g3,20 410 20 1.8 40 270 1400 150 D2PAK STGB10NB40LZT4 145-6834● g3,35 600 20 1.7 80 460 1200 80 D2PAK STGB10NB60ST4 145-6835● g1,70 600 20 2.5 30 6 82 60 D2PAK STGB10NC60KDT4 145-6836● g1,30 600 20 2.5 30 6 82 60 D2PAK STGB10NC60KT4 145-6837● g1,30 600 25 2.5 50 8.5 75 D2PAK STGB14NC60KDT4 145-6838● g2,15 600 25 2.5 50 8.5 75 80 D2PAK STGB14NC60KT4 145-6839● g1,85 400 40 2 80 600 11500 200 D2PAK STGB20NB37LZT4 145-6841● g4,75 412 40 2 80 220 1600 200 D2PAK STGB20NB41LZT4 145-6843● g4,55 600 6 1.5 25 150 720 70 D2PAK STGB3NB60SDT4 145-6845● g1,35 600 15 2.5 21 5 76 56 D2PAK STGB6NC60HDT4 145-6846● g1,30 600 15 2.5 21 5 76 56 D2PAK STGB6NC60HT4 145-6847● g1,30 600 25 2.5 50 8.5 72 80 D2PAK STGB7NC60HDT4 145-6849● g1,40 IGBTs PowerMesh™ TJmax = 150 °C VCES = 600 V Suffixes: • D - Avec diode anti-parallèle • H - Optimisé pour des applications à haute fréquence pour réaliser des hautes performances de commutation (réduit tfall) en maintenant une faible une chute de tension • Quatrième génération IGBT • Type enrichissement • Faible tension de saturation: VCE = 1.9 à 2V • Diode de protection inverse intégrée Assemblage rapide, sans soudure • Contact à ressort fiable utilisé comme conducteur électrique • Assemblage rapide par le haut dans une direction • Connexion sans soudure pour faciliter une étape de production Contact à ressort pour connexion du driver • Assemblage sans soudure • Certifié UL No.E209204 (boîtier SPM27-CA) • Très faible résistance thermique par l’utilisation du DBC • Pont inverseur IGBT triphasé 600V-15A intégrant un circuit de contrôle pour la protection et la commande de la grille • Broches de connexion DC négative divisée pour des applications de détection d’inversion de courant • Isolation nominale de 2500Vrms/min. • IC = 15 A, ICM = 30 A, PC = 50 W • Suffixe ’F’ indique une protection contre le surchauffe • K - Optimisé pour des applications commande moteur à haute fréquence avec la capacité de supporter un court-circuit • PowerMESH™ IGBT, canal N, très rapide • Faible Vcesat • Faible rapport CRES / CIES • Diode anti-parallèle de redressement très rapide et doux • Design compact IC cont VCE(sat) IC tr PD à 25°C max. pulsé typ. à 25°C A V A ns W Boîtier Réf. Fab. Code Commande Prix Unitaire 15 2.45 30 40 30 (b) GT15J321 130-0813● g3,34 20 2.45 40 40 45 (b) GT20J321 130-0814● g4,47 30 2.45 60 70 170 (a) GT30J324 130-0815● g6,34 IC IC VCE Sat VCEO à 25°C Nom. Typ. Code Prix V A A V Type Boîtier Réf. Fab. Commande Unitaire 1200 169 137 1.85 B miniSKiiP-3 SKIIP39AC12T4V1 151-8353● g203,62 600 33 25 1.45 B miniSKiiP-0 SKIIP 04AC066V1 151-8354● g31,70 600 40 32 1.45 B miniSKiiP-1 SKIIP 15AC066V1 151-8356● g47,62 1200 44 35 1.85 B miniSKiiP-1 SKIIP13AC12T4V1 151-8357● g57,72 600 19 14 1.45 C miniSKiiP-0 SKIIP 02NAC066V3 151-8358● g31,23 1200 31 25 1.85 A miniSKiiP-1 SKIIP12NAB12T4V1 151-8360● g56,67 600 30 21 1.45 A miniSKiiP-1 SKIIP 14NAB066V1 151-8361● g48,22 600 39 27 1.45 A miniSKiiP-3 SKIIP25NAB066V1 151-8362● g62,78 1200 56 45 1.85 A miniSKiiP-3 SKIIP24NAB12T4V1 151-8363● g94,18 1200 71 54 1.85 A miniSKiiP-3 SKIIP35NAB12T4V1 151-8364● g132,37 A: Pont redesseur triphasé + hacheur de freinage + inverseur de pont triphasé B: Inverseur de pont triphasér C: Pont redesseur triphasé + inverseur de pont triphasé IC cont VCE(sat) VCES à 80°C max V A V Réf. Fab. Boîtier Code Commande Prix Unitaire Pont redresseur monophasé + inverseur triphasé 600 10 2.5 STG3P2M10N60B SEMITOP 2 145-6831● g31,10 Inverseur triphasé 600 25 2.5 STG3P3M25N60 SEMITOP 3 145-6832● g53,30 • L - Zener collecteur-grille intégrée présente un réglage actif du signal pendant que la zener grille-émetteur fournit une protection ESD • S - Optimisé pour réaliser une chute de tension "on" minimum pour des applications à basse fréquence (<1kHz) Accessoires Code Prix Accessoires Code Prix Réf. Fab. Commande Unitaire Réf. Fab. Commande Unitaire SKIIP SLIM LID0 151-8365● g2,03 SKIIP LID SIZE 0 151-8370● g2,03 SKIIP SLIM LID1 151-8366● g2,12 SKIIP LID SIZE 1 151-8371● g2,12 SKIIP SLIM LID2 151-8368● g2,91 SKIIP LID SIZE 2 151-8372● g2,91 SKIIP SLIM LID3 151-8369● g3,74 SKIIP LID SIZE 3 151-8373● g3,74 600V, Commutation rapide Réf. Fab. Code Commande Prix Unitaire FSBB15CH60 149-5134● g23,11 FSBB15CH60F 149-5135● g33,22 Modules IGBT SEMITOP® Modules IGBT Miniskiip Modules de puissance Smart, série FSBB (a) TO-3P(N) D2PAK 1 Mini SKiiP-0 2 Mini SKiiP-1 3 Mini SKiiP-3 (b) 1 TO-220NIS Mini SKiiP Standard Lid 2 3 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Discrets 16 Semiconducteurs, Passifs et Optoélectronique ISOPLUS220 SOT-227B TO-220AC SOT-227B VRRM IF av Ifs VF max. max. max. max. Code Prix V A A V Boîtier Réf. Fab. Commande Unitaire 1200 109 600 1.16 TO-247 DSEI120-12A 142-7253● g9,45 1000 12 75 2.1 TO-220AC DSEI12-10A 142-7254● g1,37 1200 17 130 1.87 TO-220AC DSEI20-12A 142-7255● g2,42 1200 92 1200 1.61 SOT-227B DSEI2X101-12A 142-7256● g27,75 1200 28 200 2.2 SOT-227B DSEI2X31-12B 142-7257● g18,06 1200 52 450 2.15 SOT-227B DSEI2X61-12B 142-7259● g25,37 200 69 600 0.88 TO-247 DSEI60-02A 142-7261● g4,00 VRRM IF av IFS VF max. max. max. max. Code Prix V A A V Boîtier Réf. Fab. Commande Unitaire 600 10 120 1.42 ISOPLUS220 DSEA16-06AC 142-7235● g4,62 600 15 130 1.34 ISOPLUS220 DSEA29-06AC 142-7236● g5,45 600 30 105 1.56 ISOPLUS220 DSEA59-06BC 142-7237● g6,99 600 15 115 1.25 ISOPLUS220 DSEE15-06CC 142-7249● g5,41 1200 10 130 1.12 ISOPLUS220 DSEE15-12CC 142-7250● g5,45 1200 15 100 1.5 ISOPLUS220 DSEE29-12CC 142-7251● g6,99 600 6 150 1.35 ISOPLUS220 DSEE6-06CC 142-7252● g4,45 1200 25 95 3.3 SOT-227B DSEP2X25-12C 142-7267● g24,06 600 35 100 2 SOT-227B DSEP2X35-06C 142-7272● g22,26 VRRM IF av IFS VF max. max. max. max. Code Prix V A A V Boîtier Réf. Fab. Commande Unitaire 600 10 50 1.42 TO-220AB DSEC16-06A 142-7238● g2,77 1200 10 40 1.96 TO-220AB DSEC16-12A 142-7239● g3,29 400 120 2000 1.07 SOT-227B DSEC240-04A 142-7240● g48,99 600 120 2000 1.39 SOT-227B DSEC240-06A 142-7241● g48,99 200 30 1.05 TO-247AD DSEC30-02A 142-7242● g3,65 1200 15 90 1.78 TO-247AD DSEC30-12A 142-7243● g4,26 200 30 325 0.95 TO-247AD DSEC60-02A 142-7244● g7,60 400 30 140 1.09 TO-247AD DSEC60-04A 142-7245● g7,79 600 30 250 1.25 TO-247AD DSEC60-06A 142-7247● g8,49 1200 30 200 1.78 TO-247AD DSEC60-12A 142-7248● g10,99 1200 15 90 1.79 TO-220AC DSEP12-12A 142-7262● g1,80 600 15 110 1.35 TO-220AC DSEP15-06A 142-7263● g1,71 300 30 300 0.93 TO-220AC DSEP29-03A 142-7264● g2,67 600 30 250 1.26 TO-220AC DSEP29-06A 142-7265● g2,67 1200 30 200 1.81 TO-220AC DSEP29-12A 142-7266● g3,34 300 30 300 0.96 SOT-227B DSEP2X31-03A 142-7268● g15,69 600 30 250 1.3 SOT-227B DSEP2X31-06A 142-7269● g16,48 1200 30 200 1.96 SOT-227B DSEP2X31-12A 142-7270● g19,96 300 60 600 1.26 SOT-227B DSEP2X61-03A 142-7273● g19,96 600 60 600 1.48 SOT-227B DSEP2X61-06A 142-7274● g19,96 1200 60 800 1.7 SOT-227B DSEP2X61-12A 142-7275● g26,16 300 90 1000 1.3 SOT-227B DSEP2X91-03A 142-7276● g25,33 600 90 1000 1.52 SOT-227B DSEP2X91-06A 142-7277● g28,36 600 30 250 1.56 TO-247AC DSEP30-06B 142-7278● g3,38 200 8 80 0.94 TO-220AC DSEP8-02A 142-7279● g1,37 600 10 50 1.42 TO-220AC DSEP8-06A 142-7280● g1,40 VRRM IF (av) IFRM IFSM trr max. VF max. Code Prix V A A A ns V Boîtier Réf. Fab. Commande Unitaire 600 120 360 90 2.2 TO-3P FFA120UP60DN 149-5125● g13,55 600 8 80 30 2.6 TO-220 FFP08S60STU 149-5099● g0,79 600 8 60 45 2.1 TO-220F FFPF08H60STU 149-5109● g0,93 600 8 80 30 2.6 TO-220F FFPF08S60STU 149-5110● g0,93 600 10 100 40 2.5 TO-220F FFPF10H60STU 149-5111● g0,93 600 15 30 200 40 2.2 TO-247 ISL9K1560G3 149-5115● g4,03 600 4 8 50 22 2.4 TO-220 ISL9K460P3 149-5101● g1,41 1200 8 16 100 44 3.3 TO-220 ISL9K8120P3 149-5102● g2,31 600 8 16 100 30 2.4 TO-220 ISL9K860P3 149-5103● g2,08 600 15 30 200 40 2.2 TO-247 ISL9R1560G2 149-5116● g2,17 600 15 30 200 40 2.2 TO-220 ISL9R1560P2 149-5104● g1,64 600 15 30 200 40 2.2 TO-220F ISL9R1560PF2 149-5113● g1,81 1200 18 36 200 70 3.3 TO-247 ISL9R18120G2 149-5117● g2,70 1200 18 36 200 70 3.3 TO-220 ISL9R18120P2 149-5105● g2,08 1200 30 70 325 100 3.3 TO-247 ISL9R30120G2 149-5118● g4,39 600 30 70 325 45 2.4 TO-247 ISL9R3060G2 149-5119● g3,86 600 30 70 325 45 2.4 TO-220 ISL9R3060P2 149-5106● g3,36 600 4 8 50 22 2.4 TO-220 ISL9R460P2 149-5107● g0,88 600 4 8 50 22 2.4 TO-220F ISL9R460PF2 149-5114● g0,88 1200 8 16 100 44 3.3 TO-220 ISL9R8120P2 149-5108● g1,41 Diodes à recouvrement ultra rapide Diode épitaxiale HiPerDynFRED™ Diodes Epitaxiales à recouvrement rapide • Faibles valeurs d’IRM • Recouvrement doux • Faibles valeurs d’IRM • Recouvrement doux • Epoxy conforme UL 94V-0 • Faibles valeurs d’IRM • Recouvrement doux • Epoxy conforme UL 94V-0 • Epoxy conforme UL 94V-0 VRRM IF av IFS VF max. max. max. max. Code Prix V A A V Boîtier Réf. Fab. Commande Unitaire 300 60 550 1.1 TO-3P DPG120C300QB 142-7228● g5,41 200 15 150 1 TO-220AC DPG15I200PA 142-7229● g1,09 300 15 150 1 TO-220AC DPG15I300PA 142-7230● g1,09 400 10 100 1.04 TO-220AB DPG20C400PB 142-7231● g1,40 400 15 150 1.07 TO-247 DPG30C400HB 142-7232● g2,72 300 30 300 1.06 TO-247 DPG60C300HB 142-7233● g3,70 TO-220 SOT-227B Diodes à recouvrement rapide haute performance (HiPerFRED™ 2nd Gen) TO-220F • Puce silicium sur substrat DCB (Direct-Copper-Bond) • Haute dissipation de puissance • Puces passivées Planes • Temps de redressement très court • Pertes de commutation extrêmement faibles • Puces passivées Planes • Très faible courant de fuite • Temps de redressement très court • Comportement thermique amélioré • Faibles valeurs d’IRM TO-220AB TO-247AD TO-220AB TO-3P TO-247AD TO-220AC TO-247AD TO-247 TO-220AC • Puces passivées Planes • Temps de redressement très court • Pertes de commutation extrêmement faibles • Recouvrement doux • Tension nominale avalanche pour un fonctionnement fiable • Recouvrement inverse doux pour de faibles EMI/RFI épitaxiale à cathode commune TO-3P • Puces passivées Planes • Temps de redressement très court • Pertes de commutation extrêmement faibles HiPerFRED™ Diode RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Affichage et Optoélectronique 17 Semiconducteurs, Passifs et Optoélectronique Réf. Fab. Code Commande Prix Unitaire Evaluation Kits DUO DD-2832BE-2A 150-0743● g429,23 DUO DD-160128FC-1A 150-0749● g429,23 DUO DD-160128FC-2A 150-0750● g429,23 DUO DD-12864WE-1A 150-0751● g429,23 EVK-CONNECT-001 150-0753● g22,35 EVK-CONNECT-008 150-0757● g22,35 EVK-CONNECT-010 150-0758● g22,35 EVK-CONNECT-012 150-0759● g22,35 EVK-CONNECT-013 150-0760● g22,35 EVK-CONNECT-015 150-0761● g22,35 EVK-CONNECT-016 150-0762● g22,35 EVK-CONNECT-017 150-0763● g22,35 EVK-CONNECT-018 150-0765● g22,35 1498844 1498845 EZK Anschluss Board • Faible consommation • Taille industrie standard • Excellent design, 50° d’angle de vue • Point décimal côté droit • Excellent pour le multiplexage des digits • Compatible soudage à la vague • Disponibles en 5 couleurs • Technologie CMOS faible puissance • Compatible TTL • Tension d’alimentation 3.3V Réf. Fab. Couleur d’affichage Code Commande Prix Unitaire 4 caractères, 0.15" HCMS-3901 Jaune 124-1262● g35,36 HCMS-3903 Vert 124-1263● g36,35 4 caractères, 0.2" HCMS-3961 Jaune 124-1267● g36,37 HCMS-3963 Vert 124-1268● g36,37 8 caractères, 0.2" HCMS-2976 Bleu 124-1257● g133,37 HCMS-3971 Jaune 124-1269● g55,36 HCMS-3973 Vert 124-1270● g56,91 8 caractères, 0.15" HCMS-2919 Bleu 124-1258● g131,04 HCMS-3911 Jaune 124-1264● g53,17 HCMS-3913 Vert 124-1265● g53,17 Couleur Intensité lum./segment, typ. mcd à IF(mA) VF à Typ IF (mA) VR Connexion Réf. Fab. Code Commande Prix Unitaire Rouge 0.65 1 1.6 15 3 Anode HDSP-F101 124-1276● g2,34 Rouge 0.65 1 1.6 15 3 Cathode HDSP-F103 124-1277● g2,34 Brochage, *F101 1 = Anode commune 10 = a 2 = f 9 = b 3 = g 8 = c 4 = e 7 = DP 5 = d 6 = Anode commune Afficheur à LED, 4 à 8 caractères • Simple d’utilisation • Interfaces directes avec Microprocesseurs • Hauteur caractère 0.15" dans un boîtier 4 caractères • Boîtier robuste empilable X et Y • Entrée série • Commande de la luminosité Brochage, *F103 1 = Cathode Commune 10 = a 2 = f 9 = b 3 = g 8 = c 4 = e 7 = DP 5 = d 6 = Cathode commune • Couleurs vives • Fort contrast • Large angle de vue • Faible puissance de consommation • Large gamme de température • Forme fine et légère 10mm, faible consommation Taille afficheur Couleur pixel Réf. Fab. Code Commande Prix Unitaire 64x64 Bleu DD-6448BE-2A 149-8838● g11,75 96x64 Rouge, Vert, Bleu DD-9664FC-2A 149-8841● g16,26 128x64 Bleu Jaune DD-2864BY-1A 149-8842● g11,92 128x64 Bleu Jaune DD-2864BY-2A 149-8843● g19,90 132x32 Bleu DD-2832BE-1A 149-8844● g14,45 132x32 Bleu DD-2832BE-2A 149-8845● g18,86 132x64 Bleu, Jaune, Orange, Vert DD-32645C-1A 149-8846● g17,70 132x64 Bleu, Jaune, Orange, Vert DD-32645C-2A 149-8847● g21,64 128x33 Jaune DD-12833YW-1A 149-8852● g46,97 128x64 Blanc DD-12864WE-1A 149-8853● g10,48 160x128 Rouge, Vert, Bleu DD-160128FC-1A 149-8857● g22,77 160x128 Rouge, Vert, Bleu DD-160128FC-2A 149-8858● g29,99 128x64 Jaune DD-12864YO-3A 149-8860● g25,30 128x64 Jaune DD-12864YO-1A 149-8862● g57,09 128x64 Jaune DD-12864YO-5A 149-8863● g57,09 Afficheurs OLED Evaluationskit Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Affichage et Optoélectronique 18 Semiconducteurs, Passifs et Optoélectronique Style 1 Style 3 Style A Style 2 Intensité Lum. Iv à 20mA (mcd) L.onde (nm) Couleur Tension utilisation Réf. Fab. Code Commande Prix Unitaire 12 - 28V dc 11000 643 Rouge 12 à 28V dc 534-501-63 149-8499● g23,81 16000 591 Jaune 12 à 28V dc 534-521-63 149-8500● g23,81 23000 527 Vert 12 à 28V dc 534-532-63 149-8501● g25,61 7000 470 Bleu 12 à 28V dc 534-930-63 149-8503● g25,61 14000 Blanc 12 à 28V dc 534-997-63 149-8504● g25,61 110Vca 11000 643 Rouge 110V ac 534-501-75 149-8505● g23,81 16000 591 Jaune 110V ac 534-521-75 149-8506● g23,81 23000 527 Vert 110V ac 534-532-75 149-8507● g25,61 7000 470 Bleu 110V ac 534-930-75 149-8508● g25,61 14000 Blanc 110V ac 534-997-75 149-8509● g25,61 8.1mm montage panneau - IP67 Style 4 Style B Style 5 • Protection IP67 • Adapté avec une diode interne pour une protection contre les tensions inverses jusqu’à 1000Vdc Longueur d’onde crête 700nm Température d’utilisation -5°C à +60°C Style 6 Série 534 Tension d’alimentation Puiss. Dimensions Code Minimum Maximum Consommée Haut. Prof. largeur Réf. Fab. Commande Prix Unitaire 5.25V 3.3V 25mW 12.0mm 1.5mm 7.87mm S9226 149-5579● g50,44 5.25V 4.75V 150mW 12.0mm 1.5mm 7.87mm S9227 149-5580● g59,55 5.25V 3.3V 70mW 41.6mm 3.0mm 9.1mm S10077 149-5581● g80,35 Code Prix Code Prix Couleur Tension (mcd) Réf. Fab. Commande Unitaire Couleur Tension (mcd) Réf. Fab. Commande Unitaire Style A Vert 12 120 19531251* 136-9032● g13,14 Rouge 45 à 65 135 19531B50* 136-9331● g16,64 R,V,J 12 120 19540354 136-9038● g18,44 Vert 45 à 65 100 19531B51* 136-9332● g16,64 R,V,J 12 120 19541354* 136-9041● g18,68 Jaune 45 à 65 295 19531B52* 136-9333● g16,64 Style A - V AC/DC Rouge 24 160 19531350* 136-9033● g13,14 Rouge 24 100 19531360* 136-9036● g13,51 Jaune 24 350 19531352* 136-9034● g13,14 Vert 24 75 19531361* 136-9037● g13,51 Bleu 24 — 19531357* 136-9035● g16,34 Style B Vert 110 20 19571131* 136-9043● g14,78 Rouge 24 à 36 135 19530A50 136-9326● g16,43 Vert 24 à 100 19530A51 136-9327● g16,43 Jaune 230 48 19571232* 136-9044● g14,78 Jaune 24 à 36 295 19530A52 136-9328● g16,43 Bleu 230 — 19570237 136-9042● g17,93 Rouge 24 à 36 135 19531A50* 136-9329● g16,64 Bleu 230 — 19571237* 136-9045● g18,15 Vert 24 à 36 100 19531A51* 136-9330● g16,64 Style 7 Capteur d’image linéaire CMOS • Fonctionne sur une large gamme de tension • Boîtier robuste acier inoxydable • Résiste aux chocs et aux vibrations Indicateur à LED M22 Protection IP67 Caractéristiques • Générateur d’horloge intégré permet le fonctionnement avec des entrées de deémarrage et d’implusion d’horloge • Plage de réponse spectral: 400nm à 1000nm • Générateur d’horloge et circuit de traitement de signal intégrés, alim.simple: 3.3V • Sortie rapide, intégration simultanée • Sortie numéque, CAN 8/10-bits, simple alimentation Applications • Détection de Position • Lecture d’image • LED 22mm • Broche 2.8x0.8 • Profondeur derrière panneau: 58mm • Encadrement 25mm Réf. Fab. avec " * " = support de lentille noir chromé (sans "*" = chrome satin) Type de Entrée Diode Sortie Phototransistor L.onde Distance Code boîtier VF (V) IR (μA) VCEO (V) ICEO (μA) (nm) Réflective (mm) Réf. Fab. Commande Prix Unitaire 1 1.7 100 30 500 935 1.27 OPB606A 149-7898● g1,33 2 1.7 100 25 2.5 890 5.08 OPB700ALZ 149-7901● g11,39 2 1.7 100 25 2.5 890 5.08 OPB700Z 149-7902● g10,08 2 1.7 100 15 43 890 5.08 OPB701ALZ 149-7903● g11,36 3 1.7 50 24 25 935 1.27 OPB706A 149-7904● g2,23 3 1.7 50 15 125 935 1.27 OPB707A 149-7905● g2,87 4 1.5 50 30 150 935 6.35 OPB710F 149-7906● g8,04 4 1.5 50 30 150 935 6.35 OPB710 149-7907● g6,63 5 5 50 35 V 890 12.7 OPB716Z 149-7908● g7,42 6 1.7 40 30 10 880 3.81 OPB742 149-7909● g2,50 6 1.7 40 15 1000 890 3.81 OPB745 149-7910● g3,13 7 1.8 40 890 5.6 OPB770TZ 149-7912● g7,75 Optocommutateur Réflectif Monté côte à côte • Machine d’automatisme • Machine de sécurité • Capteur fin de course • Capteur de porte Applications: • Capteur d’objet sans contact • Assemblage de ligne RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Drivers de LED & LCD 19 Semiconducteurs, Passifs et Optoélectronique ON Semiconductor propose les nouveaux drivers de LED/WLED pour des rétroéclairages d’affichage, multicouleur et des applications d’éclairage LED multicouleur. Maxim propose des drivers de LED de pompe de charge, des drivers de LED blanche à intensité constante pour les applications d’affichage à haute efficacité. Fairchild propose les drivers de LED à faible perte et les drivers de LED à intensité constante haute efficacité. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 12 LLGA -40°C à +85°C Driver de LED blanche, 5.7V, deux sorties, contrôle I²C . . . . . . . . . . . . . . . . .NCP5602MUTBG 136-9737● g1,30 8 FLIP CHIP CSP -40°C à +85°C Driver de LED Boost rétroéclairage intégré. . . . . . . . . . . . . . . . . . . . . . . . . . .NCP5010FCT1G 146-0679● g1,15 12 LLGA -40°C à +85°C Driver de LED blanche, 5.7V, deux sorties, contrôle série . . . . . . . . . . . . . . .NCP5612MUTBG 136-9739● g1,30 10 Micro -20°C à +85°C Driver de LED boost pour rétro-éclairage. . . . . . . . . . . . . . . . . . . . . . . . . . . .NCP5008DMR2G 146-0678● g1,50 ADI présente le DecDriver ® LCD à décimation , sortie 6 canaux, 10 bits (10 bits, Low Cost 10-Bit, 6-Channel Output Decimating LCD DecDriver®) avec des convertisseurs N/A et boucle de temporisation LCD à blocage de retard (Delay-Locked LCD Timing Loop) pour le driver de colonne analogique LCD et la temporisation horizontale à microaffichage. Broches Boîtier Description Réf. Fab. Code Commande Prix Unitaire 6 MLP Driver de LED, Low Dropout, pourLED blanches, bleues etc... . . . . . . .FAN5611MPX 149-5473● g0,43 16 MLP Driver de LED, rendement élevé, courant constant avec pompe de charge adaptable et contrôleur un fil TinyWire . . . . . . . . . . . . . . . . . . .FAN5617MPX 149-5474● g1,11 Les drivers de LED multicanaux avec correction de POINT, que propose Texas Instruments, sont parfaits pour des affichages monocouleur, multicouleur, pleine couleur, des enseignes d’affichage LED, des rétroéclairages d’affichage et des applications d’éclairage LED multicouleur. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 28 DIP -40°C à +85°C Système de pilote LED CMOS à 8 chiffres (affichage C.A.) interface μP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM7218AIPI+ 129-0860● g11,90 8 TDFN -40°C à +85°C Driver de LED blanche à courant constant . . . . . . . . . . . . . . . . . . .MAX8901AETA+T 145-5607● g2,45 8 TDFN -40°C à +85°C Driver de LED blanche à courant constant . . . . . . . . . . . . . . . . . . .MAX8901BETA+T 145-5608● g2,45 16 TQFN -40°C à +85°C Diver de LED à pompe de charge . . . . . . . . . . . . . . . . . . . . . . . . . .MAX8647ETE+ 145-5609● g4,60 16 TQFN -40°C à +85°C Diver de LED à pompe de charge . . . . . . . . . . . . . . . . . . . . . . . . . .MAX8648ETE+ 145-5610● g4,00 10 MSOP -40°C à +85°C High-Efficiency Step-Up Current Regulator for LEDs. . . . . . . . . . . .MAX1698EUB+ 137-9759● g3,25 Drivers de LED Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 48 LFCSP DecDriver® LCD 10 bits, 6 canaux, faible coût . . . . . . . . . . . . . . . . . .AD8383ACPZ 143-8631● g7,15 48 LFCSP Boucle à retard verrouillé triple,Temporisation LCD 6 canaux . . . . . . . .AD8389ACPZ 143-8632● g2,95 8 MSOP -40°C à +125°C Driver de LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .AD8240YRMZ 107-8293● g2,70 Drivers de LED Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 100 HTQFP / 100 -20°C à +85°C Driver de LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5904PZPG4 120-7284● g8,00 32 HTSSOP -20°C à +85°C Driver de LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5921DAPG4 120-7285● g2,55 100 TQFP / 100 -20°C à +85°C Driver de LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5911PZPG4 122-6301● g9,80 48 SSOP -20°C à +85°C Driver de LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5920DLG4 122-6302● g2,45 32 TSSOP -20°C à +85°C Driver de LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5922DAPG4 122-6303● g3,00 32 TSSOP -40°C à +85°C Driver de LED 16 voies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5923DAPG4 122-6304● g3,15 24 TSSOP -20°C à +85°C Driver de LED 12 voies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5930PWPG4 122-6305● g9,00 28 DIP -40°C à +85°C Driver de LED 16 voies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5940NTG4 122-6306● g4,25 28 TSSOP -40°C à +85°C Driver de LED 16 voies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TLC5941PWPG4 122-6308● g3,65 30 SM-8 -40°C à +85°C Contrôleur CCFL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TPS68000DBTG4 122-6318● g5,55 Drivers de LED Drivers de LED Drivers de LED Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Condensateurs et Filtres 20 Semiconducteurs, Passifs et Optoélectronique Température d’utilisation -40°C à +100°C -40°C à +85°C (UL, CSA) Tolérance ±20% Résistance d’isolement C<0.33μF 15000MΩ C>0.33μF 5000MΩ Catégorie climatique 40/100/21 • Condensateur type terminaison à vis, standard 105°C Tension max. 450V c.a. Tolérance ±5% Température d’utilisation -25°C à +85°C Facteur de dissipation à 20°C 0.002 (Par multiple de 10) Capacité Dimensions nF μF H l P Pas Ø pattes Réf. Fab. Code Commande Prix Unitaire 10 0.01 11.5 15 5 12.5 0.6 ECQU2A103ML 119-8290● g0,29 22 0.022 11.5 15 5 12.5 0.6 ECQU2A223ML 119-8291● g0,31 47 0.047 13 15 6 12.5 0.6 ECQU2A473ML 119-8292● g0,31 68 0.068 11.5 17.5 4.5 15 0.6 ECQU2A683ML 119-8293● g0,30 100 0.1 12.1 17.5 5 15 0.6 ECQU2A104ML 119-8295● g0,30 150 0.15 14.5 17.5 6.5 15 0.6 ECQU2A154ML 119-8296● g0,35 220 0.22 17.5 17.5 8 15 0.6 ECQU2A224ML 119-8297● g0,38 330 0.33 17.5 17.5 9.5 15 0.6 ECQU2A334ML 119-8298● g0,59 470 0.47 17.5 25.5 8.5 22.5 0.8 ECQU2A474ML 119-8299● g0,68 680 0.68 19.5 25.5 10.5 22.5 0.8 ECQU2A684ML 119-8301● g0,88 1000 1 22 25.5 12 22.5 0.8 ECQU2A105ML 119-8302● g1,15 Ondul. Dimensions Pas Code Ondul. Dimensions Pas Code μF (mA) H Dia. broche Réf. Fab. Commande Prix Unitaire μF (mA) H Dia. broche Réf. Fab. Commande Prix Unitaire 25 Volt d.c. 33000 10.3 118 51 21.8 63LSW33000M51X118 141-5848● g56,36 68000 10.7 98 51 21.8 25LSW68000M51X98 141-5843● g41,20 100 Volt d.c. 35 Volt d.c. 2200 2.9 20 36 12.7 100LSW2200M36X50 141-5849● g26,85 22000 6.6 98 36 12.7 35LSW22000M36X98 141-5844● g31,44 4700 4.6 83 36 12.7 100LSW4700M36X83 141-5850● g31,44 47000 9.9 98 51 21.8 35LSW47000M51X98 141-5845● g44,12 22000 10.3 119 64 28.2 100LSW22000M64X119 141-5851● g69,53 63 Volt d.c. 450 Volt d.c. 4700 3.2 50 36 12.7 63LSW4700M36X50 141-5846● g33,01 1000 4.3 98 51 21.8 450LSG1000M51X98 141-5841● g68,61 15000 6.4 118 36 12.7 63LSW15000M36X118 141-5847● g42,03 4700 14.6 121 90 31.4 450LSG4700M90X121 141-5842● g186,83 Dimensions Code Prix Dimensions Code Prix μF H Dia. Réf. Fab. Commande Unitaire μF H Dia. Réf. Fab. Commande Unitaire 1 55 28 4.16.15.69.14 121-9034● g3,78 12 70 36 4.16.10.17.14 121-9041● g7,45 2 55 28 4.16.15.01.14 121-9035● g3,92 15 70 36 4.16.10.22.14 121-9043● g8,70 3 55 28 4.16.10.03.14 121-9036● g3,94 18 70 40 4.16.10.24.14 121-9044● g9,59 4 55 28 4.16.10.06.14 121-9037● g4,22 20 70 40 4.16.10.25.14 121-9045● g10,74 5 55 28 4.16.10.08.14 121-9038● g4,68 25 92 40 4.16.10.26.14 121-9046● g12,32 8 55 32 4.16.10.13.14 121-9039● g5,66 30 92 40 4.16.10.70.14 121-9047● g13,23 10 58 36 4.16.10.15.14 121-9040● g6,65 40 92 45 4.16.10.29.14 121-9048● g17,77 Condensateurs Polyester métallisé classe X2 Série ECQU – 275 Volts c.a. • Condensateur pour démarrage moteur • Montage sur goujon • Polypropylène métallisé auto-cicatrisant • Retardateur de combustion UL94V-0 • Approuvé VDE, CEI et SEV Température d’utilisation -25°C à 105°C Courant ondulé mesuré à 120Hz à 105°C Tolérance ±20% Couple de serrage max 33kg·cm ou moins Durée de vie à 105°C 5000h Courant de fuite (μA) 3√CV ou 5mA, le plus petit des deux • Condensateur polyester métallisé classe X2 • Conforme IEC384-14 2ème Edition 1993 classe X2 • Homologation UL1414 et EN132400 Série LSG / LSW – Standard – 105°C Boulon filté=M8 x 10, Longueur fil=250 Condensateur pour démarrage moteur - Boîtier plastique 450 Volts c.a. (Sortie par câbles) N.B. Pour facilitier la sélection, la capacité est exprimée en nF et μF RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Condensateurs et Filtres 21 Semiconducteurs, Passifs et Optoélectronique Série 305 Vca, B3292* • Courant de fuite optimisé • Facile à installerl • Design compact • Construction économique • Applications pour les systèmes télécom, systèmes de données et applications DC Perte d’insertion faible • Condensateur de suppression EMI • Boîtier compact • Boîtier retardateur de flamme selon UL94V-0 • Approuvé CSA, reconnu UL Série IRJ04 et IRJ08 I ondu. (A) ESR max. à 20Hz mΩ à 20°C μF 85°C 100kHz Dia. Long. Poids (kg) Réf. Fab. Code Commande Prix Unitaire 800 Volt d.c. 360 72 1.3 93 97 0.9 947C361K801 154-4972● 490 70 1.6 93 120 1.0 947C491K801 154-4973● 600 68 2.0 93 145 1.2 947C601K801 154-4975● 730 68 2.3 93 170 1.3 947C731K801 154-4976● 1000 Volt d.c. 230 67 1.5 93 97 0.9 947C231K102 154-4977● 310 63 2.0 93 120 1.0 947C311K102 154-4978● 390 62 2.4 93 145 1.2 947C391K102 154-4979● 470 60 2.9 93 170 1.3 947C471K102 154-4980● 1200 Volt d.c. 160 62 1.8 93 97 0.9 947C161K122 154-4981● 210 57 2.4 93 120 1.0 947C211K122 154-4982● 270 56 2.9 93 145 1.2 947C271K122 154-4983● 320 56 3.4 93 170 1.3 947C321K122 154-4984● Intensité Capacitance Inductance Nominale X Y (mH) H l P Réf. Fab. Code Commande Prix Unitaire 3A 0.22μF 4700pF 10 89.5 52 29 B84112GB30 146-7064● g14,63 6A 0.47 4700pF 3.3 89.5 52 29 B84112GB60 146-7065● g18,15 10A 0.68 4700pF 1.8 89.5 52 29 B84112GB110 146-7066● g22,82 16A 0.47μF 4700pF 1.8 89.5 52 29 B84112GB116 146-7067● g23,82 20A 1.0μF 4700pF 1.8 135 52 43 B84112GG120 146-7068● g49,80 25A 1.0μF 4700pF 1.6 135 52 43 B84112GG125 146-7069● g60,34 36A 1.5μF 4700pF 0.75 135 52 43 B84112GG136 146-7070● g69,53 Caractéristiques • Résine et matériau magnétique doux, haute flexibilité, résistant aux chocs • Approprié pour les composants compacts et minces Applications • Réduction de bruit pour les câbles flexibles utilisés pour les appareils portables (PDA, appareil photo numérique, consoles de jeux, téléphones portables) • Réduction du rayonnement provenant des appareils électroniques (incluant le bruit du CPU) Tolérance ±20% Température d’utilisation -40°C à +110°C Tension de test 305V ca Condensateur DC à fort courant Applications: Industrie: Driver moteur, ascenseur, et de soudure Onduleur: >5kW Energie renouvelable: Vent, Solaire, pile combustible Aéronautique: alimentations et drivers de moteur Transport: véhicule électrique, traction nF μF H l P Ø broche mm Réf. Fab. Code Commande Prix Unitaire Pas 10 mm 10 0.01 9 13 4 0.6 B32921C3103M 120-0827● g0,37 47 0.047 11 13 5 0.6 B32921C3473M 111-2839● g0,27 Pas 15 mm 100 0.1 10.5 18 5 0.8 B32922C3104M 111-2840● g0,31 150 0.15 12 18 6 0.8 B32922C3154M 111-2841● g0,41 220 0.22 12.5 18 7 0.8 B32922C3224M 111-2842● g0,42 330 0.33 14 18 8 0.8 B32922C3334M 111-2844● g0,61 Pas 22.5 mm 330 0.33 28.5 41.5 16 0.8 B32923C3334M 120-0831● g0,68 470 0.47 16.5 26.5 8.5 0.8 B32923C3474M 111-2845● g0,79 680 0.68 16.5 26.5 10.5 0.8 B32923C3684M 111-2846● g1,02 Pas 27.5 mm 1000 1 19 31.5 11 0.8 B32924C3105M 111-2847● g1,27 1500 1.5 21.5 31.5 12.5 0.8 B32924C3155M 111-2848● g2,16 2200 2.2 24.5 31.5 14 0.8 B32924C3225M 111-2849● g2,84 Pas 37.5 mm 3300 3.3 28.5 41.5 16 1 B32926C3335M 111-2850● g9,18 • Réduction du Débit (ou rayonnement) Absorbé Spécifique (DAS) provenant des téléphones portables • Réduction des EMI internes (résonance, diaphonie) à l’intérieur des boîtier blindés Filtres EMC SIFI-G Dimensions (mm) Gamme de fréq. L l H recommandée Réf. Fab. Code Commande Prix Unitaire Série IRJ08 300mm 200mm 0.13mm 10MHz à 3GHz IRJ08AB 300X200X0.13 150-3731● g81,35 300mm 200mm 0.25mm 10MHz à 3GHz IRJ08AB 300X200X0.25 150-3732● g120,46 Série IRJ04 300mm 200mm 0.1mm 50MHz bis 10GHz IRJ04AB 300X200X0.1 150-3733● g68,49 300mm 200mm 0.25mm 50MHz bis 10GHz IRJ04AB 300X200X0.25 150-3734● g80,32 300mm 200mm 0.5mm 50MHz bis 10GHz IRJ04AB 300X200X0.5 150-3735● g120,46 300mm 200mm 0.05mm 50MHz bis 10GHz IFL04AT 300X200X0.05 150-3736● g95,12 300mm 200mm 0.1mm 50MHz bis 10GHz IFL04AB 300X200X0.1 150-3737● g76,09 • Boîtier métal • Encapsulé en polyuréthane (UL94 V-0) • Connection par cosses 6.3X0.8mm Condensateur Compact X2, Polypropylène Température d’utilisation -40°C à +85°C Feuille de ferrite pour suppression de bruit g95,47 g107,32 g97,26 g134,91 g154,57 g115,27 g80,10 g121,41 g93,09 g72,85 g107,21 g83,65 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Résistances et Potentiomètres 22 Semiconducteurs, Passifs et Optoélectronique Potentiometers Boîtier 1206 Boîtier 2010 Boîtier 2512 Puissance nominale à 70°C 0.5W 1W 2W Coefficient de température 75ppm/°C 75ppm/°C 75ppm/°C Température d’utilisation -65°C à 155°C -65°C à 155°C -65°C à 155°C(4mR, 5mR, 6mR, 7mR and 8mR) Puissance impulsionnelle max 1.5kW Toérance ±10% Charge continue max. 180W Tension de travail max. 2500V c.c 12R = 129-2591 22R = 129-2592 47R = 129-2593 100R = 129-2594 150R = 129-2595 Tension nominale = √(Puissance nominale x valeur résistance) ou tension de travail max., qui est la plus faible. Par Multiple de 1 Valeurs Courant max. P. nominale Réf. Fab. Code Commande Prix Unitaire 0.10Ohm 100A 1000W PFE5KR100EW 146-2328● g203,55 0.12Ohm 91A 993W PFE5KR120EW 146-2329● g233,73 0.14Ohm 89A 1108W PFE5KR140EW 146-2330● g158,32 0.16Ohm 78A 973W PFE5KR160EW 146-2331● g135,70 0.18Ohm 75A 1012W PFE5KR180EW 146-2332● g127,09 0.25Ohm 63A 992W PFE5KR250EW 146-2333● g155,09 0.33Ohm 54A 962W PFE5KR330EW 146-2334● g135,70 0.50Ohm 47A 1104W PFE5KR500EW 146-2335● g152,93 0.75Ohm 39A 1140W PFE5KR750EW 146-2336● g128,17 1.0Ohm 33A 1089W PFE5K1R00EW 146-2338● g112,01 1.6Ohm 26A 1081W PFE5K1R60EW 146-2339● g91,55 2.8Ohm 16.3A 743W PFE5K2R80EW 146-2340● g78,63 3.5Ohm 14.6A 746W PFE5K3R50EW 146-2341● g75,39 4.5Ohm 12.7A 725W PFE5K4R50EW 146-2342● g127,09 5.4Ohm 11.8A 751W PFE5K5R40EW 146-2343● g114,60 6.8Ohm 10.3A 721W PFE5K6R80EW 146-2344● g110,93 8.5Ohm 9.4A 751W PFE5K8R50EW 146-2345● g108,77 Puissance impulsionnelle max 2kW Toérance ±10% Charge continue max. 200W Tension de travail max. 2500V c.c Résistance Tension Code (Ω) d’utilisation (V) Réf. Fab. Commande 20 550 B59201J140B10 151-1740 56 650 B59202J135B10 151-1741 100 800 B59204J130B10 151-1742 12R = 129-2597 22R = 129-2598 47R = 129-2599 100R = 465-9570 150R = 129-2601 Par Multiple de 1 Code Commande Prix Unitaire Toutes Valeurs ● g4,30 Puissance impulsionnelle max 3kW Toérance ±10% Charge continue max. 260W Tension de travail max. 2500V c.c 0R002 = 140-0810 0R006 = 140-0815 0R012 = 140-0819 0R016 = 140-0822 0R003 = 140-0811 0R008 = 140-0816 0R013 = 140-0820 0R018 = 140-0823 0R004 = 140-0813 0R01 = 140-0817 0R015 = 140-0821 0R02 = 140-0825 0R005 = 140-0814 0R011 = 140-0818 Résistance bobinée Powr-Rib, ±10% 0R001 = 140-0826 0R004 = 140-0829 0R007 = 140-0832 0R009 = 140-0834 0R002 = 140-0827 0R005 = 140-0830 0R008 = 140-0833 0R01 = 140-0835 0R003 = 140-0828 0R006 = 140-0831 12R = 129-2603 22R = 129-2604 47R = 129-2605 100R = 129-2606 150R = 129-2607 Thermistance CTP Puissance impulsionnelle max 7kW Toérance ±10% Charge continue max. 280W Tension de travail max. 2500V c.c 0R002 = 140-0837 0R004 = 140-0839 0R006 = 140-0841 0R008 = 140-0843 0R003 = 140-0838 0R005 = 140-0840 0R007 = 140-0842 • Fabriqué à partir d’un alliage haute résistance monté sur un isolateur céramique avec un support de montage métallique • Conçu pour obtenir une faible valeur ohmique avec forte puissance • Terminaison type crochet pour une connexion fiable, qui peut bouger tout au long de l’élément résistif pour obtenir des valeurs intermédiaires • Auto-protection en cas de disfonctionnement ou de court-circuit interne du condensateur • Applications limiteur de courant crête (résistance de charge) pour des condensateurs de lissage et de liaison DC... Résistance auto-protection pour condensateur de charge 47R = 129-2608 100R = 129-2609 150R = 129-2610 Par Multiple de 10 Boîtier Code Commande Prix Unitaire 1206 Toutes Valeurs ● g1,06 2010 Toutes Valeurs ● g1,08 2512 Toutes Valeurs ● g1,20 Série PFE Résistance détection de courant – Série TLR Puissance nominale Code Commande Prix Unitaire 1.5 kW Toutes valeurs ● g13,32 2 kW Toutes valeurs ● g18,64 3 kW Toutes valeurs ● g31,96 7 kW Toutes valeurs ● g31,96 Résistance de puissance Série WDBR, 2 kWatt & 5 kWatt • Résistance de très faible valeur (mΩ) • Haute fiabilité et performance • Tolérance ±1% Valeurs ohmiques disponibles : 1.5 kWatt - WDBR1 7 kWatt - WDBR7 Boîtier 1206 Boîtier 2010 • Résistance de puissance ultra plate en acier profilé • Puissance mininale élevée - 1.5kW, 2kW, 3kW and 7kW • Capacité de manipulation à haute impulsion • Sécurité (circuit ouvert) en cas de surcharge maintient au minimum 1kV de tension diélectrique • Applications : frein moteur dynamique et soudure industrielle Boîtier 2512 Valeurs ohmiques disponibles: Valeurs ohmiques disponibles: 2 kWatt - WDBR2 Valeurs ohmiques disponibles: 3 kWatt - WDBR3 Valeurs ohmiques disponibles: RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Résistances et Potentiomètres 23 Semiconducteurs, Passifs et Optoélectronique Pour les dernières technologies en contrôle de mouvement et automation regroupant plus de 1000 nouveaux produits, consultez le Technology First en ligne : www.electronicsdesignworld.com www.farnell.fr 04 74 68 99 99 Service de mise en bobine Le modèle 601-HE représente une nouvelle génération de capteur Smart technologie sans broche basé sur le principe de l’effet Hall. Ce composant électronique fournit une sortie analogique sur 360° sans composant électronique externe. Une faible puissance de consommation et une sortie non-volatile permettent à ce capteur universel d’être très économique. Optimisez vos stocks et accélérez le montage de vos composants CMS. Commande et plus d’informations: Tolérance résistance ±15% Coefficient de température ±400ppm/°C(500Ω = 80ppm/°C) Linéarité ±20% Température d’utilisation -30°C à +105°C Tolérance résistance ±20% Coefficient de température ±400ppm/°C(500Ω = 80ppm/°C) Température d’utilisation -30°C à +105°C Longueur de course Résistance (kΩ) Puissance nominale (W) Code Commande Prix Unitaire 200mm 5 2 130-7078● g42,51 300mm 10 3 130-7079● g144,64 Résistance (kΩ) Puissance Nominale (W) Réf. Fab. Code Commande Prix Unitaire LCP12A - Axe fileté 5 0.7 LCP12A-50-5K 130-7081● g135,55 10 0.7 LCP12A-50-10K 130-7080● g135,55 LCP12S - Axe avec ressort de retour 1 0.4 LCP12S-25-1K 130-7085● g144,97 10 0.2 LCP12S-12-10K 130-7084● g122,94 10 0.4 LCP12S-25-10K 130-7086● g144,97 10 0.7 LCP12S-50-10K 130-7087● g167,07 10 1.2 LCP12S-100-10K 130-7082● g244,76 LCP8P - Extrêmités à rotule sphérique 5 1.2 LCP12Y-100-5K 130-7089● g242,67 10 1.2 LCP12Y-100-10K 130-7088● g242,67 Puissance nominale 0.2W Linéarité ±2% Tolérance résistance ±15% Température d’utilisation -30°C à +105°C Coefficient de température ±400ppm/°C(500Ω = 80ppm/°C) Potentiomètre linéaire Série LCP12 Résistance (kΩ) Code Commande Prix Unitaire LCP8P - Axe plat 5 130-7091● g41,50 10 130-7090● g41,50 LCP8S - Axe fileté 5 130-7093● g56,32 10 130-7092● g56,32 LCP8P - Axe fileté avec ressort de rappel interne 10 130-7094● g56,32 Potentiomètre linéaire Open Frame Tension d’alimentation 4.5 à 5.5V Courant d’alimentation 10mA max Angle de rotation 360° Linéarité indépendante ±1% Indice IP Température d’utilisation -45°C à 125°C Potentiomètre linéaire miniature • Elément plastique conducteur • Noir, corps aluminium anodisé • Axe acier inoxydable • Terminaisons plaqué Or • Elément plastique conducteur • Open frame avec contact glissière mobile • Boîtier aluminium anodisé • Terminaison laiton plaqué Or Signal de sortie Sens Réf. Fab. Code Commande Prix Unitaire horaire 601HE1000B01 151-7319● g103,45 anti-horaire 601HE2000B01 151-7318● g103,45 • Elément plastique conducteur • Support bronze Capteur Smart - Série 601-HE Série LCPL Usage général Série LCP8 • Sortie absolue ratiométrique sur 360° sans point mort • Interface nécessitant pas de composant externe • Technologie Contactless • Protection contre les inversions de polarité • Sortie Non-volatile Technologie Effet Hall Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Capteurs 24 Semiconducteurs, Passifs et Optoélectronique Capteurs National Semiconductor présente ses capteurs de température centigrade, basse tension, de précision avec diodes distantes doubles et quadruples et une interface SMBus de la famille PowerWise. Les capteurs que propose Allegros permettent une détection sans contact de vide créé par une usure mécanique, en détectant un aimant externe ou un objet ferreux et sont spécialement utilisés pour la détection extrêmement sensible de mouvement de roue, la détection de direction, la détection linéaire, la détection de vitesse et de position et la commutation sans contact pour des applications automobiles et électroniques industrielles. Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 3 SIP -40°C to +85°C Verrou à effet Hall, Hacheur stabilisé. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A1242EUA-I1-T 152-1675● g1,09 3 SOT-23W -40°C to +85°C Capteur linéaire Ratiometric à effet hall pour haute température. . . . . . . . . .A1321ELHLT-T 152-1677● g1,25 3 SIP -40°C to +85°C Capteur linéaire Ratiometric à effet hall pour haute température. . . . . . . . . .A1321EUA-T 152-1678● g1,25 3 SIP -40°C to +85°C Capteur linéaire Ratiometric à effet hall pour haute température. . . . . . . . . .A1322EUA-T 152-1679● g1,25 6 DFN -20°C to +85°C Capteur linéaire à effet Hall 3V très faible puissance, avec 3 états de sortie .A1395SEHLT-T 152-1680● g1,49 3 SIP -40°C to +85°C Commutateur effet Hall ultra sensible, très faible puissance. . . . . . . . . . . . .A3213EUA-T 152-1681● g0,88 3 SOT-23W -40°C to +85°C Chopper Stabilized Precision Hall Effect Latches . . . . . . . . . . . . . . . . . . . . .A3281ELHLT-T 152-1682● g1,03 3 Ultra Mini SIP -40°C to +85°C Chopper Stabilized Precision Hall Effect Latches . . . . . . . . . . . . . . . . . . . . .A3281EUA-T 152-1683● g1,03 3 SIP -40°C to +85°C Chopper Stabilized Hall Effect Latch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A3282EUA-T 152-1684● g0,88 3 SOT-23W -40°C to +150°C Chopper Stabilized Hall Effect Latch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A3282LLHLT-T 152-1685● g1,00 4 SIP -40°C to +85°C Commutateur bipolaire à effets de champ qaudrature, Ultra Sensible, Double canaux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3425EK-T 152-1686● g1,88 3 SIP -40°C to +150°C Commutateur temps-continu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A1101LUA-T 152-1703● g1,41 3 SIP -40°C to +85°C Commutateur temps-continu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A1102EUA-T 152-1704● g1,16 3 SIP -40°C to +85°C Continuous-Time Ratiometric Linear Hall Effect Sensor. . . . . . . . . . . . . . . .A1302EUA-T 152-1708● g0,93 3 SIP -40°C to +85°C Chopper-Stabilized Omnipolar Hall-Effect Switch. . . . . . . . . . . . . . . . . . . . .A3245EUA-T 152-1709● g0,93 Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 5 SOT-23 -55°C à +125°C Thermostat faible puissance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LM26CIM5-HHD 134-2333● g0,836 14 LLP -40°C à +140°C Capteur de température, 2 Diodes, 2 fils I/F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LM95213CISD 134-2334● g1,900 14 LLP -40°C à +140°C Capteur de température, 2 Diodes, 2 fils I/F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LM95214CISD 134-2335● g2,100 3 TO-92 -40°C à +110°C Capteur de temp. centigrade de précision sortie 10 mV/°C, préc. ±1,0°C à 25°C, temp. ext. de -40°C à 110°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LM35CZ/HALF 135-9978● g7,400 3 TO-92 0°C à +100°C Capteur de temp. centigrade de précision sortie 10 mV/°C, préc. ±1,0°C à 25°C, 0°C à +100°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LM35DZ/HALF 135-9979● g2,000 8 SOIC -55°C à +125°C Capteur de temp. avec interface I2C, CAN delta-sigma 9 bits et détecteur de température excessive, p. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LM75CIM-5/HALF 135-9993● g3,300 8 Mini SOIC Capteur de température à contrôleur double diode digitalavec interface SMBus. . . .LM95221CIMM 143-3171● g2,100 Capteurs de température Capteurs à effet Hall Les capteurs de température multicanaux que propose Maxim surveillent leur propre température et la température d’un maximum de six transistors connectés par diode externe. Tous les canaux de température ont des seuils d’alerte programmables. L’interface série à 2 fils supporte les protocoles de bus de gestion de système standard (SMBus™). Broches Boîtier Température d’utilisation Description Réf. Fab. Code Commande Prix Unitaire 20 TSSOP -40°C à +125°C Contrôleur de température 7 voies, grande précision, Supporte les protocoles SMBus™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAX6689UP9A+ 143-3254● g7,75 16 TSSOP -40°C à +125°C Contrôleur de température 5 voies, grande précision, Supporte les protocoles SMBus™ ID esclave:0011 010. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MAX6699UE34+ 143-3255● g8,75 10 MSOP -40°C to +125°C Capteur de température et système de contrôle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX6652AUB+ 138-0012● g4,85 16 QSOP -55°C to +125°C Capteur de température local/ à distance et controleur de tension 4 voies, double . . . .MAX6656MEE+ 138-0013● g7,50 48 TQFN -40°C to +85°C Contrôleur de température intégré pour modules Peltiers. . . . . . . . . . . . . . . . . . . . . . .MAX1978ETM+ 137-9716● g18,70 16 QSOP -55°C to +125°C Multichannel Remote/Local Temperature Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . .MAX1668MEE+ 137-9863● g10,00 8 microSOP -40°C to +125°C Analog Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .DS600U+ 142-2277● g3,40 Capteurs de température RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Capteurs 25 Electromécanique Seulement g70,30 CODE COMMANDE424-9112 Seulement g55,27 CODE COMMANDE100-6801● Contrôle de sortie Collecteur ouvert PNP ou NPN, courant de charge current 200mA max. Mode de fonctionnement NO pour tous les types Alimentation 12 à 24V dc Fréquence de réponse M12 - 1kHz, M18 - 500Hz, M30 - 250Hz Température d’utilisation -40°C à +70°C Obtenez le meilleur prix Tension de commutation max. 300V ac/dc Courant de commutation max. 0.5A Densité mini.du liquide 0.80 Filetage 1/8" BSP NPT Longueur fil 500mm Tension de commutation max. 300V ac/dc Courant de commutation max. 0.5A Densité mini.du liquide 0.80 Filetage 1/2" NPT Longueur fil 500mm Nos prix sont revus de manière régulière, afin de vous permettre d’obtenir le prix le plus adapté au marché Consultez nos tarifs en vigueur sur www.farnell.fr • Gamme de détecteurs à sensibilité améliorée augmentant la fiabilité • Protection IP67 • Indicateur de visualisation lors du fonctionnement Seulement g70,30 CODE COMMANDE424-9100 Dimension Ø x L (mm) Réf. Fab. Code Commande Prix Unitaire Type J 1.5 x 150 91-9326-03 101-0213● g27,87 1.5 x 250 91-9327-03 101-0214● g28,43 1.5 x 150 91-9328-03 101-0215● g28,19 3 x 250 91-9329-03 101-0216● g28,99 6 x 150 91-9330-03 101-0217● g35,55 6 x 250 91-9331-03 101-0218● g37,72 Type K 1.5 x 150 91-9332-03 101-0221● g27,87 1.5 x 250 91-9333-03 101-0222● g28,43 3 x 150 91-9334-03 101-0223● g28,19 3 x 250 91-9335-03 101-0224● g28,99 6 x 150 91-9336-03 101-0225● g35,55 6 x 250 91-9337-03 101-0226● g37,72 Type T 1.5 x 150 91-9341-03 101-0227● g33,45 1.5 x 250 91-9342-03 101-0228● g33,77 1.5 x 150 91-9343-03 101-0229● g34,20 3 x 250 91-9344-03 101-0230● g34,73 6 x 150 91-9345-03 101-0231● g36,11 6 x 250 91-9346-03 101-0233● g37,16 Termocouple à isolation minérale Détecteur de niveau horizontal - Modèle SSF212 Détecteur de niveau horizontal - Modèle SSF211 Tension commuté max. 100Vdc,250Vac Courant commuté max. 1A Pouvoir de coupure 15W Densité mini du liquide 0.75 Matériau Acier inoxydable Température d’utilisation -30°C à +120°C Eléments d’étanchéité Silicone Câble PVC 2 x 18AWG isolé • Conception à isolation minérale • Flexible pour des mesures difficiles d’accès Montage interne Montage externe Distance de File- Longueur Longueur Code Prix Commutation tage Filetage Totale Sortie Réf. Fab. Commande Unitaire 4mm M12 34 50 PNP E2A-M12KS04-WP-B1 2M 500-9893 g30,60 4mm M12 34 50 NPN E2A-M12KS04-WP-C1 2M 500-9900 g30,60 4mm M12 34 48 PNP E2A-M12KS04-M1-B1 500-9911 g30,60 4mm M12 34 48 NPN E2A-M12KS04-M1-C1 500-9923 g35,70 8mm M18 39 59 NPN E2A-M18KS08-WP-C1 2M 500-9947 g35,70 8mm M18 39 53 PNP E2A-M18KS08-M1-B1 500-9959 g35,70 Flotteur vertical, Acier inoxydable • Acier inoxydable grade 304 • Montage externe • Forme compacte • Plage de température jusqu’à 120°C • Configuration d’action N/O ou N/F • Action réversible de commutation • Flotteur réversible pour une action à la montée ou à la descente • Utilisable pour une large gamme de liquides • Gamme de température jusqu’à 120°C • Acier Inoxydable • Conception robuste • Montage intérieur • Entrée sur le dessus ou le dessous • Excellente durée de vie et fiabilité grâce au relais Reed Détecteurs de proximité hautes performances • Acier inoxydable grade 304 • Montage interne • Forme compacte • Plage de température jusqu’à 120°C • Configuration d’action N/O ou N/F • Action réversible de commutation • Gaine en acier inoxydable 310 • Température d’utilisation de -100°C à +1100°C • Câble 1m PFA Séries E2A Les thermocouples à isolation minérale sont extrêmement robustes et capables de résister à des températures allant jusqu’à 1100°C. Ils sont disponibles en type J, K et T. Ces sondes peuvent être pliées pour permettre l’installation dans des lieux difficiles d’accès. Ils sont particulièrement adaptés pour les applications industrielles, y compris à haute pression, un vide élevé et à haute vibration. La jonction du thermocouple est située à la pointe du capteur et est isolée de la gaine. Gaine en acier inoxydable 310 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Capteurs 26 Electromécanique • Sortie N • Détecteurs inductifs intrinsèquement sûrs Nano-change (M8) droit • Commutation lumineux / sombre • Versions Reflex polarisé ou optique • Led rouge visible • Versions câble 2m 3 fils ou connecteur M8 4 points • Sensibilité/Gamme ajustables • Indicateur de sortie à Led • Réflecteur P250 fourni avec les versions Reflex • Fixation fournies • Reconnu UL et certifié CSA Série CBN c.c. Nano-change (M8) 90° Tension d’ alimentation 10 - 30V dc Retard à la mise au repos 100ms Sortie Transistor PNP ou NPN Temporisations -25°C à +55°C Temps de réponse 350μs Distance de détection avec WILL160-F420 Diffusé 70mm, séparé 400mm Longueur du câble 2m (peut être réduit) Rayon de coubure max. 25mm Température d’utilisation -40°C à +70°C Distance de détection 100mm Temps de réponse 2.5ms max Sortie 100mA max Tension de fonctionnement 12 à 24V dc ± 10% Mode de sortie Normalement ouvert ou Normalement fermé Température d’utilisation -25°C à +55°C Réf. Fab. Code Commande Prix Unitaire Reflex PNP, Câble WL160-F142 414-7716 g118,81 PNP, Connecteur M8 WL160-F440 414-7728 g131,96 Diffusé PNP, Câble WT160-F182 414-7730 g95,52 PNP, Connecteur M8 WT160-F480 414-7741 g121,52 Compact - Série W160 Sortie Réf. Fab. Code Commande Prix Unitaire NPN E3F2-DS10C4-P1 176-775 g118,13 PNP E3F2-DS10B4-P1 176-776 g118,13 Sortie Réf. Fab. Code Commande Prix Unitaire PNP WLL160-F122 722-9677 g132,06 NPN WLL160-E122 722-9689 g125,80 PNP WLL160-F420 730-397 g142,59 NPN WLL160-E420 722-9690 g125,80 Réf. Fab. Code Commande Prix Unitaire Diffusé LL3-DB01 730-403 g52,09 Séparé LL3-TB01 730-415 g50,47 Fente Miniature, Série WLL160 Câble de fibre optique pour amplificateur WLL160 M18 de proximité – M12 embrochable Cylindrique Câbles de fibre optique de type proximité ou séparé pour l’utilisation avec le SICK WILL 160 ou similaire. Ces cordons ont des connecteurs filetés, montés à chaque bouts et peuvent être recoupés à la longueur désirée, à l’aide du coupe-câble fourni. • Protection contre les courtcircuits • Protection IP66 • Mode de fonctionnement modifiable par inversion de polarité de la sortie • Indication par LED de l’état de la sortie • Connecteur de capteurs M12 embrochable, 3 voies • Sensibilité réglable • clair/obscur Fonctionnement(sélection par commutateur) • Etanchéité conforme IP66 • Sortie alarme (avertissement de panne) • UL et CSA • Temporisation à la descente (100 ms à sélection par commutateur) • Protection des contrôles par couvercle plastique à charnières • Raccordement par câble intégral de 2 m ou par connecteur M8 à verrouillage par vis Distance de détection Reflex : 0.01 à 6m avec réflecteur PL80A Reflex : 0.005 à 4m avec réflecteur P250 Diffusé : 0 à 900mm Tension d’alimentation 10 à 30V dc Sortie PNP, 100mA Commutation Lumineux / Sombre sélectionnable Fréquence de commutation 1000 Hz Température de fonct. -25°C à 55°C Séries E3F2-DS10-P1 Code Commande Prix Unitaire Code Commande Prix Unitaire Nano-change (M8) droit Nano-change (M8) 90° 2mPVC-3pôles 346-1981 g7,86 2mPVC-3pôles 346-2067 g7,92 2mPUR-3pôles 346-1993 g8,73 5mPVC-3pôles 346-2080 g9,71 5mPVC-3pôles 346-2006 g9,78 2mPUR-3pôles 346-2079 g8,79 2mPUR-3pôles 346-1993 g8,73 5mPUR-3pôles 346-2092 g12,85 5mPUR-3pôles 346-2018 g11,73 2mPVC-4pôles 346-2109 g9,47 2mPVC-4pôles 346-2020 g8,68 5mPVC-4pôles 346-2122 g11,04 5mPVC-4pôles 346-2043 g10,96 5mPUR-4pôles 346-2134 g13,69 5mPUR-4pôles 346-2055 g13,69 Distance Taille Code de détection Sortie filetage Réf. Fab. Commande Prix Unitaire Cylindrique acier inox 1.5mm. N/O M8 NCB1,5-8GM25-NO 312-5014 g33,15 2mm. N/O M12 NCB2-12GM35-NO 280-720 g37,55 5mm. N/O M18 NCB5-18GM40-NO 280-732 g39,16 Type fente 3,5mm N N/A SJ3,5-N 372-6770 g34,99 5mm N N/A SJ5-N 372-5960 g33,57 Connecteurs femelles, Nano-change 3 et 4 pôles RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Commutateurs 27 Electromécanique 30mA - 12V dc 0.4VA à 20V ac/dc 6A à 125V ac, 3A à 250V ac 16(6)A à 250V ac 3.5VA à 50V dc • Panneau étanche jusqu’à IP67 • Découpe panneau industrie standard 30 x 11mm • Vendus avec joints d’étanchéité • Terminaisons : 6.3 x 0.8mm • Approuvés ENEC et CSA , Reconnu UL • Miniature : gain d’espace sur les circuits imprimés • Terminaux moulés prévenant l’entrée de flux; solvants et autres substances radioactives • Award récompensant le mécanisme de Contacts Jumelés Glissant • Levier en laiton plaqué nickel de 10.5mm • Versions montage traversant ou en surface (CMS) • Ultra petite taille • Etanche à la poussière • Montage en surface • Disponible avec ou sans picot de positionnement pour un meilleur maintien ( nécessite de percer la plaque) Puissance de commutation (Max.) 3.5VA Tension des contacts (Min./Max.) 20mV / 50V Force d’action (Course pleine) 2.5N Gamme de température -40 à 85°C Commutation Fonction de Couleur Déclencheur/LED Réf. Fab. Code Commande Prix Unitaire Non -Lumineux SPST On - Off Noir C6100FLAAA 138-8233● g4,13 SPST On - Off Noir, O/I C6100FLAAB 138-8234● g4,39 SPDT On - On Noir C6110FLAAA 138-8235● g5,04 SPDT On - On(Mom.) Noir C6111FLAAA 138-8236● g5,25 230V ca LED-Lumineux SPST On - Off Noir / Rouge C6108PLMAA 138-8237● g6,01 SPST On - Off Noir / Vert C6108PLMAB 138-8238● g6,01 12V cc LED-Lumineux SPST On - Off Noir / Rouge C6108PLLAA 138-8239● g6,60 SPST On - Off Noir / Vert C6108PLLAB 138-8240● g6,60 Résistance des Contacts 10mOhm (Max.) Amplitude d’angle 24° Durée de vie élecrique 25000 opérations Gamme de température -30 à 85°C Configuration des Contacts SPST-NO Courant nominale 1 à 50mA Tension nominale 5 à 12V dc Gamme de températures -25°C à +70°C Couleur Code Prix de la LED Réf. Fab. Commande Unitaire Action momentanée Blanc ELUMOATHQ1C12 143-7643● g5,16 Rouge ELUMOATHQ3C12 143-7644● g4,54 Ambre ELUMOATHQ5C12 143-7645● g4,56 Vert ELUMOATHQ6C12 143-7646● g4,54 Blue ELUMOATHQ7C12 143-7647● g4,75 Rouge/Vert ELUMOATHQ2C12 143-7648● g4,89 Ambre/Vert ELUMOATHQ8C12 143-7649● g4,90 Action verrouillable Blanc ELUMEETHQ1C12 143-7650● g5,36 Rouge ELUMEETHQ3C12 143-7651● g4,77 Amber ELUMEETHQ5C12 143-7652● g4,77 Vert ELUMEETHQ6C12 143-7654● g4,77 Bleu ELUMEETHQ7C12 143-7655● g4,95 Rouge/Vert ELUMEETHQ2C12 143-7656● g5,09 Ambre/Vert ELUMEETHQ8C12 143-7657● g5,10 Action momentanée Blanc ELUMOASAQ1C12 143-7658● g5,62 Rouge ELUMOASAQ3C12 143-7659● g5,03 Ambre ELUMOASAQ5C12 143-7660● g5,03 Vert ELUMOASAQ6C12 143-7661● g5,03 Bleu ELUMOASAQ7C12 143-7662● g5,21 Rouge/Vert ELUMOASAQ2C12 143-7663● g5,34 Ambre/Vert ELUMOASAQ8C12 143-7664● g5,36 Action verrouillable Blanc ELUMEESAQ1C12 143-7666● g5,83 Rouge ELUMEESAQ3C12 143-7667● g5,22 Ambre ELUMEESAQ5C12 143-7668● g5,22 Vert ELUMEESAQ6C12 143-7669● g5,22 Bleu ELUMEESAQ7C12 143-7670● g5,41 Rouge/Vert ELUMEESAQ2C12 143-7671● g5,54 Ambre/Rouge ELUMEESAQ8C12 143-7672● g5,56 Vertical Réf. Fab. Code Commande Prix Unitaire Montage vertical SPDT- On-On GT11MCBE 143-7674● g4,69 SPDT- On-Off-On GT13MCBE 143-7675● g5,41 DPDT- On-On GT21MCBE 143-7676● g6,30 DPDT- On-Off-On GT23MCBE 143-7678● g6,78 SPDT- On-On GT11MSCBETR 143-7679● g6,78 SPDT- On-Off-On GT13MSCBETR 143-7680● g6,02 DPDT- On-On GT21MSCBETR 143-7681● g6,94 DPDT- On-Off-On GT23MSCBETR 143-7682● g7,45 Action Horizontal SPDT- On-On GT11MABE 143-7683● g2,97 SPDT- On-Off-On GT13MABE 143-7684● g6,01 DPDT- On-On GT21MABE 143-7685● g4,69 DPDT- On-Off-On GT23MABE 143-7686● g7,60 SPDT- On-On GT11MSABETR 143-7687● g3,81 SPDT- On-Off-On GT13MSABETR 143-7688● g4,44 Action Vertical SPDT- On-On GT11MAVBE 143-7691● g5,28 SPDT- On-Off-On GT13MAVBE 143-7692● g6,04 DPDT- On-On GT21MAVBE 143-7693● g7,12 DPDT- On-Off-On GT23MAVBE 143-7694● g7,60 Commutateur lumineux à LED - Coudé Ultraminiature Etanche Etanche - IP67 Fonction de Commutation Réf. Fab. Code Commande Prix Unitaire Montage Vertical - Terminaisons Droites Montage CI SPDT On - On M2012SS1W03 135-7668● g1,84 SPDT On - (On) M2015SS1W03 135-7671● g2,22 SPDT On - Off - On M2013SS1W03 135-7672● g2,22 SPDT (On) - Off - (On) M2018SS1W03 135-7674● g2,42 SPDT On - Off - (On) M2019SS1W03 135-7675● g2,42 DPDT On - On M2022SS1W03 135-7676● g2,34 DPDT On - (On) M2025SS1W03 135-7677● g2,74 DPDT On - Off - On M2023SS1W03 135-7678● g2,74 DPDT (On) - Off - (On) M2028SS1W03 135-7679● g2,92 DPDT On - Off - (On) M2029SS1W03 135-7680● g2,92 Montage Type de Réf. Fab. Code Commande Prix Unitaire Version Activation sur le dessus Sans picots de positionnement B3U-1000P 133-3652● g0,82 Avec picots de positionnement B3U-1000P-B 133-3654● g0,85 VersionActivation sur le côté Sans picots de positionnement B3U-3000P 133-3655● g0,82 Avec picots de positionnement B3U-3000P-B 133-3656● g0,85 Commutateur SPST-NO - Série B3U • SPDT (NO & NC) • Faible hauteur au dessus du circuit imprimé • Versions montage en surface (CMS) ou traversant • LED lumineux central • Actions verrouillable ou momentané • Course longue Miniature - Fixation dans un Trou Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Commutateurs 28 Electromécanique Seulement g20,80 CODE COMMANDE142-8454● Seulement g7,27 CODE COMMANDE143-7673● Commutateurs • Ultra petite taille et bas profil • Contact haute fiabilité • Hauté précision • Montage en surface • Disponible en version gauche ou droite selon les types d’opérations Seulement g1,09 CODE COMMANDE131-6988● • Trackerball miniature avec une bille de 8mm • IP54 • Protection ESD Tension Courant Nominale Nominal (Vcc) (mA) 20 50 • Design moderne • Montage à visser ou par canon 22mm • Vendu avec un joint PVC Direction Réf. Fab. Code commande Prix Unitaire Angle Droit MCTE-MRR-V 131-6980● g0,64 Angle Gauche MCTE-MRL-V 131-6981● g0,64 Interrupteur de navigation Réf. Fab. Code Commande Prix Unitaire Boutons Noir NAVIKITTH09WL 139-0523● g13,23 NAVIKITSM09WL 139-0524● g14,00 Boutons Bleu NAVIKITTH30WL 139-0525● g13,23 NAVIKITSM30WL 139-0526● g14,00 Configuration des Contacts SPST-NO / SPST-NC Courant 1mA Tension 5V dc Direction des Opérations Type de Contacts Réf. Fab. Code Commande Prix Unitaire Version Levier Standard Droit SPST-NO D3SH-A0R 133-3657● g1,69 Gauche SPST-NO D3SH-A0L 133-3658● g1,69 Droit SPST-NC D3SH-B0R 133-3659● g1,69 Gauche SPST-NC D3SH-B0L 133-3660● g1,69 Version Levier Long Droit SPST-NO D3SH-A0R1 133-3661● g1,69 Gauche SPST-NO D3SH-A0L1 133-3662● g1,69 Droit SPST-NC D3SH-B0R1 133-3663● g1,69 Gauche SPST-NC D3SH-B0L1 133-3664● g1,69 Multidirectionnel 5 voies - CMS - SPDT Commutateur de détection Trackerball Miniature Joystick montage surface ou panneau Commutateur tactile multidirectionnel. La force de commande exigée pour les commutateurs latéraux est de 180gf et de 320gf pour le commutateur central. Ils possèdent une durée de vie électrique très longue d’au moins 200.000 cycles. UL94V-0 Kits Interrupteur de navigation Angle droit et angle gauche - CMS - SPDT Balayage et Selection Série Navimec IP 65 • Commutateurs momentanés SPNO autonomes • 50mA à 24V dc • IP67 • Gamme de température de -40°C à 115°C • Version montage en surface ou traversant disponibles Commutateur de détection - Activation par le côté Tension Courant Nominale Nominal (Vcc) (mA) 12 50 Inensité nominale 6A à 250V ac Type de Contact Change-over Montage par canon 22mm Bush Gamme de température -20 à 50°C Puissance (Max.) 0.2VA Tension (Min./Max.) 20mV / 32V Force d’action - Balayage 0.35N Force d’action - Select 2.2N Commutateur de détection tactile horizontal à contact NO. Le commutateur possède une partie à pousser de 2.15mm et force de commande de 40gf. • UL94V-0 • Durée de vie électrique 50 000 cycles 1mA - 5V cc Droit Gauche RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Relais 29 Electromécanique • Contacts SPST • Haute sensibilité (200mW) • Approuvé CSA et VDE, Reconnu UL d Configuration des Contacts DPDT - CO Courant nominal/Courant max. instantané 30A / 50A Tension nominal 250V ac Matériau des Contacts AgCdO Enclenchement/Déclenchement 8 / 15ms typique Gamme de température -40 à 70°C BOBINE Tension Ω Réf. Fab. Code Commande Prix Unitaire 24V ac 50 66.22.8.024.0000 132-9682● g10,54 110V ac 930 66.22.8.110.0000 132-9683● g10,54 230V ac 4000 66.22.8.230.0000 132-9684● g11,22 12V dc 85 66.22.9.012.0000 132-9685● g10,54 24V dc 340 66.22.9.024.0000 132-9687● g10,54 Configuration des contacts SPDT / SPST-NO Contact (Résistance) - (NO) 16A @ 250V ac, 24V dc Contact (Résistance) - (NC) 5A à 250V cc, 24V ca Capacité de commutation 4000VA, 384W Consommation de bobine nominale 0.75VA Fonctionnement/Relâchement 20ms/20ms Plage de fonctionnement bobine 15 - 75% Gamme de température -40 à 70°C Bobine Tension Ω Code Commande Prix Unitaire DPCO - Série G5V2 4.5V c.c. 40 994-9810● g2,43 5V c.c. 50 994-9488● g2,43 9V c.c. 162 994-9828● g2,43 12V c.c. 288 994-9496● g2,43 24V c.c. 1152 994-9500● g2,43 48V c.c. 4000 994-9836● g2,43 DPCO - Haute sensibilité - Série G5V-2-HI 5V c.c. 166 994-9844● g4,12 9V c.c. 540 994-9852● g4,12 12V c.c. 960 994-9860● g4,12 24V c.c. 2880 994-9879● g4,12 Relais de puissance Configuration contacts 1RT (1RT) Consommation bobine 150mW Pouvoir de coupure 1A @ 24V c.c., Fonctionnement/Relâchement 5ms/5ms 0.5A @ 125V c.a. Plage de fonctionnement bobine 80 - 200% (@ 55°C) Matériau des contacts Argent plaqué or Gamme de températures -40°C à +70°C Configuration des Contacts SPST-NO Intensité nominale - AC 5A à 250V ac Intensité nominale - DC 3A à 30V dc Consommation de bobine (nom.) 200mW Enclenchement/Déclenchement 10ms/10ms Gamme de température -40 à 85°C Bobine Tension Ω Réf. Fab. Code Commande Prix Unitaire Bobine c.a. - SPDT 115V ac 11600 G5RL-1E 115/120AC 125-7568● g6,85 230V ac 47600 G5RL-1E 230/240AC 125-7569● g7,55 Bobine c.c. - SPST-NO (Version Bruit Faible) 5V dc 47.2 G5RL-1AE-LN 5DC 133-3634● g4,45 12V dc 272 G5RL-1AE-LN 12DC 133-3635● g4,45 24V dc 1086 G5RL-1AE-LN 24DC 133-3636● g4,45 Bobine c.c. - SPDT (High inresh version) 5V dc 62.5 G5RL-1E-HR 5DC 133-3637● g4,38 12V dc 360 G5RL-1E-HR 12DC 133-3638● g4,38 24V dc 1440 G5RL-1E-HR 24DC 133-3639● g4,38 Configuration des Contacts SPDT - CO Courant nominale/Courant max. instantané 6A / 15A Tension nominale 250V Matériau des Contacts AgCdO Consommation de Bobine 200mW Enclenchement/Déclenchement 6 / 4ms typique Gamme de températures -40 à 85°C Relais CI subminiature - Série G5V2 DPDT 30A - Montage CI Bobine Tension Ω Code Commande Prix Unitaire SPCO - Série G5V-1 5V c.c. 167 994-9577● g2,29 12V c.c. 960 994-9585● g2,29 24V c.c. 3840 994-9593● g2,29 BOBINE Tension Ω Réf. Fab. Code Commande Prix Unitaire 5V dc 125 32.21.7.005.2000 132-9651● g2,93 12V dc 720 32.21.7.012.2000 132-9652● g2,93 24V dc 2880 32.21.7.024.2000 132-9653● g2,93 48V dc 11520 32.21.7.048.2000 132-9654● g3,11 • Contacts DPCO • Entièrement étanche • Commute de 10mA à 2A • Contacts jumelés, idéal pour la commutation de signaux • Agréé UL et CSA Bobine Volts Ω Réf. Fab. Code Commande Prix Unitaire 5V dc 125 G5NB-1AE 5DC 133-3631● g2,07 12V dc 720 G5NB-1AE 12DC 133-3632● g2,07 24V dc 2880 G5NB-1AE 24DC 133-3633● g2,07 16A Bas Profil Relais miniatures pour CI - SPCO 6A Relais Miniature 5A • SPDT contacts • Consommation de puissance 0.75VA Série 66.22 Subminiatures - Série G5V1 Série Subminiature 32 Série G5NB-E - Tenue diélectrique de 10kV • Dégagement/distance de fluage de 8mm • Reconnu UL, Approuvé CSA et VDE • Courant de commutation 30A • Disponible en versions AC et DC • Montage CI - Contacts inverseurs • Double isolement entre bobine et contacts selon EN 60335-1 • Distance d’isolement et ligne de fuite de 8mm • Approuvé CE, ANCE, IMQ, VDE et Reconnu UL • 1 contact RT (SPCO) • Bobine haute sensiblité consommant 150mW • Large pouvoir de commutation (1mA à 1A) • Entièrement étanche • Agréé UL et CSA • Bas profil • Type THT • Bobine DC sensible - 200 mW • Lavable : RT III Série G5RL - Bobine AC Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Relais 30 Electromécanique Tension de Tension Code contrôle de charge Réf. Fab. Commande DC Input - AC Output 3 à 15V c.c. 12 - 280V rms CX240D5 120-0213 4 à 15V c.c. 48 - 660V rms CX480D5 120-0214 DC Input - DC Output 3 à 10V dc 0 - 60V dc CMX60D5 120-0212 3 à 10V dc 0 - 60V dc CMX60D10... 120-0211 • Etanche • Isolation entre les contacts ouverts de 8kV • Designés et conçus conformément à AIAG QS9000 • Fils volants (0.4m) pour connexion bobine Seulement g22,90 CODE COMMANDE120-0285● Tension Ω Réf. Fab. Code Commande Prix Unitaire SPDT - CO Terminaison à vis 24V ac 320 4C.01.8.024.0060SPA 132-9693● g13,59 110V ac 6900 4C.01.8.110.0060SPA 132-9694● g14,77 230V ac 28000 4C.01.8.230.0060SPA 132-9695● g16,31 12V dc 300 4C.01.9.012.0050SPA 132-9696● g12,01 24V dc 1200 4C.01.9.024.0050SPA 132-9697● g12,01 Terminaison sans vis 24V ac 320 4C.51.8.024.0060SPA 132-9699● g13,77 110V ac 6900 4C.51.8.110.0060SPA 132-9700● g15,01 230V ac 28000 4C.51.8.230.0060SPA 132-9701● g16,51 12V dc 300 4C.51.9.012.0050SPA 132-9702● g12,20 24V dc 1200 4C.51.9.024.0050SPA 132-9703● g12,20 DPDT - CO Terminaison à vis 24V ac 320 4C.02.8.024.0060SPA 132-9705● g15,01 110V ac 6900 4C.02.8.110.0060SPA 132-9706● g16,13 230V ac 28000 4C.02.8.230.0060SPA 132-9707● g17,75 12V dc 300 4C.02.9.012.0050SPA 132-9708● g13,36 24V dc 1200 4C.02.9.024.0050SPA 132-9709● g13,36 Terminaison sans vis 24V ac 320 4C.52.8.024.0060SPA 132-9710● g15,31 110V ac 6900 4C.52.8.110.0060SPA 132-9711● g16,43 230V ac 28000 4C.52.8.230.0060SPA 132-9712● g18,05 12V dc 300 4C.52.9.012.0050SPA 132-9713● g13,70 24V dc 1200 4C.52.9.024.0050SPA 132-9714● g13,70 Interface modulaire à relais - Série 4C A0241/AS0241 Courant d’entrée 15mA @ 5V c.c. Isolation 4000V rms Courant de charge 60mA - 5A rms Courant de fuite état off 0.1mA (240V rms) Courant de surcharge 250A crête Courant de Tension de Courant de charge surcharge charge Sortie Code Commande DC Input - 240V ac Output 25mA -1A rms 40A pic 24 - 280V rms Triac 121-3165 25mA -1.5A rms 10A pic 10 - 280V rms Thyristor 120-0222 25mA -1.5A rms 10A pic 10 - 280V rms Thyristor 120-0224 60mA - 2A rms 120A pk 12 - 280V rms Thyristor 120-0223 DC Input - 60V dc Output 0 - 3A dc 12A dc (10ms) 0 - 60V dc MOSFET 120-0225 25A PowerFin • Accepte de fortes surintensités avec des fuites très faibles • Agréé UL, CSA et VDE Bobine Tension Réf. Fab. Code Commande Prix Unitaire Montage en bas 12V dc LEV100A4ANG 143-6198● g109,73 Montage sur le côté 12V dc LEV100A4ANH 143-6199● g114,71 8A DPCO, 16 et 10A SPCO Série PF Tension de contrôle 4 -10V c.c. Tension de blocage 600V pic • Boîtier SIL époxy compact • Commutation de faibles courants • Commutation au zéro de tension Relais de puisance - 100A • Montage sur Rail DIN 35mm (EN 50022) • Disponible en version AC et DC • Fourni avec circuit de présence tension et protection bobine • Relais approuvés CE, CSA, GOST, IMQ, VDE et Reconnu UL Charge nominale Code Commande Prix Unitaire DC Input - AC Output Control Voltage 3/4-15V dc 5A @ 240V c.a. 120-0213● g12,60 5A @ 480V c.a. 120-0214● g17,20 DC Input - DC Output 5A @ 60V ac 120-0212● g25,70 10A @ 60V ac 120-0211● g36,00 SPST - NO (1 Forme X) 5A, Série CX Tension de contrôle Tension de charge Tension de blocage Réf. Fab. Code Commande 3 - 15V c.c. 12 - 280V rms 600V crête PF240D25 120-0285 CX/CMX Série Configuration des contacts SPST-NO (1 Form X) Courant continu des contacts 100A Tension des Contacts 9 à 16V dc Temps Fonctionnement/Relâchement 40 / 10ms Durée de vie mécanique 1 million cycles Gamme de température -40 à 85°C • Similaire à la série CX + dissipateur thermique • Accepte des charges élevées • Conforme EN60950:1993. Courant de charge (air ventilé) 0.06 - 25A rms Courant d’entrée 15 @ 24V c.c. Courant de charge (convection) 0.06 - 10A rms Courant de surcharge 250A crête Courant decharge Réf. Fab. Code Commande Prix Unitaire DC Input - 240V ac Output 1A A0241 121-3165● g10,20 1.5A ASO241 120-0222● g10,30 1.5A CX241 120-0224● g11,70 2A ASO242 120-0223● g12,50 DC Input - 60V dc Output 3A DMO063 120-0225● g15,90 1A/1,5A - Montage CI CX241 RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Ventilateurs 31 Electromécanique 40mm Ventilateur CC Ultra Plat Séries LT Flight • Micro-ventilateurs c.c. à moteur à rotor externe et à commutation électronique • Protection électronique contre les inversions de polarité • Protection par impédance contre les blocages et les surcharges • Paliers à coussinet-douille Sintec • Température de fonctionnement -10°C to +70°C Tension Puissance Débit Bruit V c.c. Watts m3/h dB(A) Réf. Fab. Code Commande Prix Unitaire 5 0.2 2.17 12 255M 960-0710● g22,21 5 0.4 3.23 15 255N 960-0728● g14,33 5 0.6 4.93 28 255H 960-0736● g14,76 12 0.5 3.23 15 252N 960-0744● g14,33 12 0.5 3.23 15 252/2N 960-0752● g23,43 Tension Puissance Débit Bruit Dim Tension V c.c. Watts (m3/h) dB(A)C/M H L P V c.c. Réf. Fab. Code Commande Prix Unitaire 5 0.7 7.99 26 40 40 10 5 405F 960-0620● g16,79 5 0.9 10.02 18 40 40 20 5 405 960-0639● g16,79 12 0.7 7.99 26 40 40 10 12 412F 960-1260● g15,63 12 0.8 9.51 29 40 40 10 12 412FH 960-1279● g15,63 12 0.9 10.02 18 40 40 20 12 412 960-1287● g16,49 24 0.7 7.99 26 40 40 10 24 414F 960-1295● g15,63 24 0.9 10.02 18 40 40 20 24 414 960-1309● g16,49 Dimensions (HxlxP) 25 x 25 x 8 Trou de fixation Ø 2.8 Entraxe fixations 20 x 20 Découpe Ø 25 Ventilateurs miniatures, basse tension Réf. Fab. Tension Code Commande Prix Unitaire Ventilateur Miniature UF385-10 3V dc 138-0653● g22,97 Turbine Miniature UB393-10 3V dc 138-0654● g22,97 Tension Vitesse Puissance Débit Bruit Dimensions Vmin - Vmax rpm Watts m3/h dBA (mm) Tension Réf. Fab. Code Commande Prix Unitaire 40mm 4.5 / 5.5 6000 0.95 6.8 27.5 40 x 40 x 10 5V dc CR0405HB-G70 (032604) 126-7472● g8,48 10.8 / 13.2 6000 1.2 6.8 27.5 40 x 40 x 10 12V dc CR0412HB-G70 (032608) 126-7473● g8,48 21.6 / 26.4 6000 1.68 6.8 27.5 40 x 40 x 10 24V dc CR0424HB-G70 (032612) 126-7475● g8,48 60mm 60mm 4.5 / 5.5 3900 1.25 14 28.8 60 x 60 x 15 5V dc CR0605MB-D71GL (032684) 126-7476● g12,72 10.8 / 13.2 3900 1.32 14 28.8 60 x 60 x 15 12V dc CR0612MB-D71GL (032688) 126-7477● g12,72 21.6 / 26.4 3900 1.68 14 28.8 60 x 60 x 15 24V dc CR0624MB-D71GL (032692) 126-7478● g12,72 80mm 80mm 4.5 / 5.5 2440 1.2 22 26 80 x 80 x 15 5V dc CR0805MB-D71 (032716) 126-7479● g19,08 10.8 / 13.2 2440 1.8 22 26 80 x 80 x 15 12V dc CR0812MB-D71 (032720) 126-7480● g19,08 21.6 / 26.4 2440 2.4 22 26 80 x 80 x 15 24V dc CR0824MB-D71 (032724) 126-7481● g19,08 Ventilateurs miniatures, 25mm • Haute performance, idéals pour les CPU, les petits appareils ou le refroidissement local sur circuit imprimé • Protégés contre les surcharges et les inversions de polarité • Paliers à bagues • Fil de 300mm • Gamme de température -10°C à +70°C Ventilateur Mini Mighty - Sub-centimètre • Breveté, technologie petite taille sub-centimètre • Très faible bruit • Faible consommation de puissance • Conçu pour des applications de téléphones mobiles, de téléphones intelligents, d’assistants numériques personnels, d’ordinateurs et de téléphones portables • Faible bruit, ventilateur ‘ultra slim’ • Protection de polarité renversée • Remise en route automatique 3V cc - Ventilateur et Turbine Dimensions Gamme de tension Puissance Débit d’air Réf. Code H x l x P (mm) V cc Watts cu ft/min Fab. Commande Ventilateur 8 x 8 x 5 2.2 à 3.5 0.2 0.43 UF385-10 138-0653 Turbine 9 x 9 x 3 2.2 à 3.5 0.09 1.13 UB393-10 138-0654 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Ventilateurs 32 Electromécanique Fixation pour ventilateur • Réduction du bruit jusqu’à 9dB • Simple et rapide d’installation - Montage et démontage avec ou sans vis sécurisé • Durée de vie augmentée Seulement g35,92 CODE COMMANDE137-2297● Seulement g1,87 CODE COMMANDE129-3012● • Moteur externe • Protection de polarité invesrée électronique • Roulement à billes • Approuvés VDE, CSA, CE , Reconnus UL Dimensions Tension Puissance Débit d’air Bruit H l P Vcc en Watts m3/h dBA à 1m Réf. Fab. Code Commande Prix Unitaire 45 44 12 12 1.08 4.50 35 BM4515-04W-B30-L00 101-2796● g21,63 51 51 15 12 0.72 3.57 26 BM5115-04W-B30-L00 101-2798● g21,63 51 51 15 12 2.16 5.95 42 BM5115-04W-B50-L00 101-2799● g21,63 51 51 25 12 0.72 5.95 27 BM5125-04W-B30-L00 101-2801● g21,63 51 51 25 12 2.88 11.38 43 BM5125-04W-B50-L00 101-2802● g21,63 76 76 25 12 3 16.14 43 BG0702-B045-000-00 101-2804● g28,09 76 76 25 24 3.36 16.14 43 BG0702-B055-000-00 101-2806● g28,09 97 94 33 12 4.8 34.83 47.5 BG0903-B042-000-00 101-2807● g33,00 97 94 33 12 12.4 48.59 54.5 BG0903-B044-000-00 101-2808● g33,00 97 94 33 24 11.8 48.59 52.5 BG0903-B054-000-00 101-2811● g33,00 107 25 25 12 6.7 37.21 48 BG1002-B044-000-00 101-2813● g33,00 120 120 32 12 11.16 56.41 54 BG1203-B045-000-00 101-2814● g44,14 120 120 32 24 11.52 56.41 54 BG1203-B055-000-00 101-2815● g44,14 Taille du Ventilateur Code Commande Prix Unitaire Taille du Ventilateur Code Commande Prix Unitaire Paliers Filtre Blindé EMI 40mm 132-6544● g3,45 40mm 132-6555● g2,57 60mm 132-6546● g4,14 60mm 132-6556● g3,88 80mm 132-6547● g4,77 80mm 132-6558● g5,86 92mm 132-6548● g5,50 92mm 132-6559● g7,12 119mm 132-6549● g7,19 119mm 132-6560● g12,05 Grille de ventilateur - Plastique Filtre Media 40mm 132-6550● g1,38 40mm 132-6561● g0,44 60mm 132-6551● g1,71 60 mm 132-6562● g0,51 80mm 132-6552● g1,89 80 mm 132-6563● g0,64 92mm 132-6553● g1,97 92 mm 132-6564● g0,67 119mm 132-6554● g2,73 119 mm 132-6565● g0,75 Vis de Fixation Rubber 132-6566● g0,70 Ventilateur compact c.c Dimensions (H x l x P) 77.3 x 102.5 x 58.85mm Absorbeur de Vibration • Haut niveau de fiabilité • Roulement de précision • Moteur cc Brushless • Connexion par 2 fils AWG26 (Rouge, Noir) • Auto restart/Protection de polarité inversée • Approuvé UL/CSA/VDE/CE Fixation pour ventilateur - Universelle Turbine radiale c.c. Pour Ventilateurs de 40mm à 119mm Revers Silicone Plastique sans halogène • Fixation pour ventilateur universelle convenant pour tout les ventilateurs dans l’entraxe est prévue entre 3.2 et 4.5mm Dia. • Anti-vibration • Facile et rapide à utiliser - Ne nécessite pas d’outils Ventilateur NON inclus Puissance Débit Vitesse Tension (Vdc) Réf. Fab. 4.5 24 4800 12 RV40-18/12H Nous vous proposions déjà les produits et les informations dont vous aviez besoin, les services sur lesquels vous pouviez compter et maintenant nous avons réduit des milliers de prix sur les gammes de composants les plus courants, pour donner encore plus de valeur ajoutée à votre production. 􀀻􀂄􀁭􀁜􀁣􀁦􀁧􀁧􀁜􀁱􀀗􀁘􀁭􀁜􀁚􀀗􀁣􀁜􀀗􀁤􀁜􀁠􀁣􀁣􀁜􀁬􀁩􀀗􀀘􀀗􀀗􀀗􀀗􀀗􀀗􀀗􀀗 􀁮􀁮􀁮􀀥􀁝􀁘􀁩􀁥􀁜􀁣􀁣􀀥􀁚􀁦􀁤􀀗 􀁃􀁜􀀗􀁤􀁜􀁠􀁣􀁣􀁜􀁬􀁩􀀗􀁥􀃋􀁜􀁪􀁫􀀗􀁧􀁘􀁪􀀗 􀁝􀁦􀁩􀁚􀂄􀁤􀁜􀁥􀁫􀀗􀁣􀁜􀀗􀁧􀁣􀁬􀁪􀀗􀁚􀁟􀁜􀁩􀀗􀀘 􀁇􀁣􀁬􀁪􀀗􀁛􀁜􀀗􀀪􀀭􀀗􀀧􀀧􀀧􀀗 􀁧􀁩􀁠􀁯􀀗􀁜􀁥􀀗 􀁙􀁘􀁠􀁪􀁪􀁜 􀀸􀀗􀁇􀁩􀁜􀁤􀁠􀁜􀁩􀀗􀀽􀁘􀁩􀁥􀁜􀁣􀁣􀀗􀀺􀁦􀁤􀁧􀁘􀁥􀁰 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Coffrets et Boîtiers 34 Electromécanique • Boîtiers renforcés polyester, 30% bille de verre, protection IP65 • Le couvercle encastré sur 5 mm protège les commandes • Conviennent à l’utilisation de machines dans des environnements difficiles Boîtiers pour toutes utilisations • Polystyrène haute résistance • Trous de fixation • 4 supports pour C.I. • Rainure pour l’étanchéité • Disponibles en version adaptable à un clavier membrane P Dimensions externes Pour boîtier H l P de taille Réf. Fab. Code Commande Prix Unitaire Boîtier 180 250 116 Petit M5825105 132-9970● g117,65 250 350 116 Moyen M5835105 132-9971● g128,46 300 450 116 Grand M5840105 132-9973● g140,24 Plaques avant 159.5 220 Petit M5800025 132-9974● g13,38 229.5 320 Moyen M5800035 132-9975● g20,58 279.5 370 Grand M5800040 132-9976● g24,68 Kit Suppot Plaques 120 175 Petit M5804125 132-9977● g14,58 190 275 Moyen M5804135 132-9978● g17,73 240 325 Grand M5804140 132-9979● g21,20 • ABS gris, à couvercle plat ou profond • Résistant à 85°C, usinable • Fentes de tenue des circuits imprimés • Conçus pour éviter la contamination par l’humidité Longueur Largeur Profondeur Réf. Fab. Code Commande Prix Unitaire Sans compartiment piles Noir 117 79 24 1553BBK 100-9437● g6,17 147 89 25 1553DBK 100-9439● g6,75 Gris 117 79 24 1553BGY 100-9438● g6,17 147 89 25 1553DGY 100-9440● g6,75 Avec compartiment piles Noir 117 79 24 1553BBKBAT 100-9441● g9,20 147 89 25 1553DBKBAT 100-9443● g10,22 Gris 117 79 24 1553BGYBAT 100-9442● g9,20 147 89 25 1553DGYBAT 100-9444● g10,22 Boîtier aluminium Datamet Boîtiers de commande ABS l - Montage mural Surface de retrait 244 x 84 mm Dimensions Extérieures H W D Type Code Commande Prix Unitaire 25 50 100 E410 117-7048● g10,36 40 65 120 E430 117-7049● g12,75 65 65 120 E435 112-4099● g15,44 55 80 150 E440 117-7050● g14,66 80 80 150 E445 117-7051● g18,64 70 110 188 E450 117-7052● g19,23 100 110 188 E460 117-7053● g23,20 Dimensions extérieures H W D Commande Code Prix Unitaire 250 91 46 112-4106● g32,15 250 91 80 112-4107● g36,53 • Design ergonomique • Moulé en plastique ABS et coque en plastique gris souple • Retrait prévu pour l’insertion d’un clavier membrane Utilisation en intérieur l H1 H2 P Réf. Fab. Code Commande Prix Unitaire Standard 75 27 50 BIM 2000/10/GY 117-1676● g2,24 85 40 56 BIM 2001/11/GY 117-1678● g3,17 100 25 50 BIM 2002/12/GY 117-1679● g3,11 112 31 62 BIM 2003/13/GY 117-1681● g3,67 120 40 65 BIM 2004/14/GY 117-1682● g5,06 150 50 80 BIM 2005/15/GY 117-1684● g4,53 190 60 110 BIM 2006/16/GY 117-1686● g8,30 55 42 55 BIM 2008/18/GY 117-1688● g2,43 200 250 65 BIM 2009/19/GY 117-1691● g9,88 142 30 80 BIM 2030/30/GY 117-1692● g4,13 Deep Lid 100 40 19 50 BIM 2002/22/GY/GY 117-1680● g3,20 120 60 24 65 BIM 2004/24/GY/GY 117-1683● g4,25 150 76 30 80 BIM 2005/25/GY/GY 117-1685● g5,38 190 90 34 110 BIM 2006/26/GY/GY 117-1687● g9,11 Dimensions extérieures H x l x P (mm) Réf. Fab. Code Commande Prix Unitaire 42 BIM 2008/18/EMI/RFI 117-1600● g4,10 27 BIM 2000/10/EMI/RFI 117-1592● g3,91 40 BIM 2001/11/EMI/RFI 117-1593● g5,07 25 BIM 2002/12 EMI/RFI 117-1594● g3,88 31 BIM 2003/13 EMI/RFI 117-1595● g4,73 40 BIM 2004/14 EMI/RFI 117-1596● g4,75 50 BIM 2005/15 EMI/RFI 117-1597● g6,33 60 BIM 2006/16 EMI/RFI 117-1599● g9,62 Boîtiers deux tons Boîtiers de commande portables industriels IP65 GRP ABS Boîtiers protégés EMI/RFI - ‘Série 2000’ Element • ABS haute résistance, revêtement intérieur acrylique/nickel • Poids inférieur aux coffrets métalliques • Fournis avec guides de C.I. verticaux et horizontaux Boîtier au design moderne pour une utilisation en intérieur. Conçu avec tableau de contrôle et un couvercle et panneau arrière en forme de " L". Tableau de contrôle coulé sous pression. Faces avant et supports de plaques internes à commander séparemment. ‘Tastomat’ ABS (Impact Resistant) H RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Fusibles 35 Electromécanique Besoin d’un meilleur prix? Tension nominale c.a.250V ac Capacité de rupture à Vn ou 10 X In à Vn,35A à Vn ou 10 X In à Vn, la valeur la plus grande étant retenue Tension nominale (Vn) 250V ac Tension nominale (Vn) 250V ac • Disponibles en version Action rapide (F) ou temporisé (T) • Compacts • Bonne résistance aux chocs et aux vibrations • Se soudent directement sur la carte ou se monte avec un support 04 74 68 99 98 cotations@farnell.com Hauteur - mm Largeur - mm Profondeur - mm Style de (Nominal) (Nominal) (Nominal) Boîtier 0.4 1.0 0.55 0402E 0.63 1.6 0.81 0603E 0.9 2.1 1.27 0805B 1.2 3.1 1.6 1206B @ Par Multiple de 10 Par Multiple de 10 Intensité Code Commande Prix Unitaire Intensité Code Commande Prix Unitaire 200mA 135-4561● g0,540 2A 135-4573● g0,147 315mA 135-4563● g0,540 3.15A 135-4575● g0,147 400mA 135-4564● g0,147 4A 135-4576● g0,147 500mA 135-4567● g0,147 5A 135-4578● g0,147 630mA 135-4568● g0,147 6.3A 135-4579● g0,147 800mA 135-4569● g0,147 10A 135-4580● g0,147 1A 135-4570● g0,147 15A 135-4581● g0,147 Par Multiple de 5 Intensité Réf. Fab. Commande Unitaire Boîtier Style 0402E 0.25A MCF0402E0R25FSTR 133-7395● g0,47 0.5A MCF0402E0R50FSTR 133-7398● g0,47 0.75A MCF0402E0R75FSTR 133-7399● g0,47 1A MCF0402E1R00FSTR 133-7400● g0,47 1.5A MCF0402E1R50FSTR 133-7402● g0,47 2A MCF0402E2R00FSTR 133-7404● g0,47 Boîtier Style 0603E 0.25A MCF0603E0R25FSTR 133-7405● g0,47 0.5A MCF0603E0R50FSTR 133-7406● g0,47 0.75A MCF0603E0R75FSTR 133-7407● g0,47 1A MCF0603E1R00FSTR 133-7408● g0,47 1.25A MCF0603E1R25FSTR 133-7409● g0,47 1.5A MCF0603E1R50FSTR 133-7410● g0,47 2A MCF0603E2R00FSTR 133-7411● g0,47 Boîtier Style 0805B 0.25A MCF0805B0R25FSTR 133-7414● g0,54 0.5A MCF0805B0R50FSTR 133-7416● g0,54 0.75A MCF0805B0R75FSTR 133-7417● g0,54 1A MCF0805B1R00FSTR 133-7418● g0,54 1.25A MCF0805B1R25FSTR 133-7419● g0,54 1.5A MCF0805B1R50FSTR 133-7420● g0,54 2A MCF0805B2R00FSTR 133-7421● g0,54 2.5A MCF0805B2R50FSTR 133-7422● g0,54 3A MCF0805B3R00FSTR 133-7423● g0,54 Boîtier Style 1206B 0.2A MCF1206B0R20FSTR 133-7424● g0,47 0.5A MCF1206B0R50FSTR 133-7425● g0,47 1A MCF1206B1R00FSTR 133-7426● g0,47 1.5A MCF1206B1R50FSTR 133-7428● g0,47 2A MCF1206B2R00FSTR 133-7429● g0,47 3A MCF1206B3R00FSTR 133-7431● g0,47 Action Rapide (Par multiple de 10) (Par multiple de 10) Intensité Code Commande Prix Unitaire Intensité Code Commande Prix Unitaire Action Rapide Temporisé 50mA 951-5887● g2,13 50mA 951-6034● g1,09 63mA 135-4621● g2,51 63mA 135-4626● g1,00 80mA 135-4622● g2,51 80mA 135-4627● g0,81 100mA 951-5895● g0,66 100mA 951-6042● g0,68 125mA 951-5909● g0,66 125mA 951-6050● g0,68 160mA 951-5917● g0,66 160mA 951-6069● g0,68 200mA 951-5925● g0,66 250mA 951-6085● g0,68 250mA 951-5933● g0,66 315mA 951-6093● g0,68 315mA 951-5941● g0,66 400mA 135-4628● g0,72 400mA 135-4623● g0,74 500mA 951-6107● g0,68 500mA 951-5950● g0,66 630mA 951-6115● g0,68 630mA 135-4624● g0,74 800mA 951-6123● g0,68 800mA 135-4625● g0,74 1A 951-6131● g0,68 1A 951-5968● g0,66 1.25A 951-6140● g0,68 1.25A 951-5976● g0,66 1.6A 951-6158● g0,68 1.6A 951-5984● g0,66 2A 951-6166● g0,68 2A 951-5992● g0,66 2.5A 951-6174● g0,68 2.5A 951-6000● g0,66 3.15A 951-6182● g0,68 3.15A 951-6018● g0,66 4A 951-6190● g0,68 4A 951-6026● g0,66 5A 951-6204● g0,68 Porte Fusible Montage CI 118-5363● g0,51 Fusibles Action Rapide (F) Verre Par Multiple de 10 Par Multiple de 10 Intensité Code Commande Prix Unitaire Intensité Code Commande Prix Unitaire 200mA 135-4598● g0,31 3.15A 135-4611● g0,31 315mA 135-4600● g0,31 4A 135-4613● g0,31 400mA 135-4601● g0,31 5A 135-4614● g0,31 500mA 135-4602● g0,31 6.3A 135-4615● g0,31 630mA 135-4603● g0,31 8A 135-4616● g0,31 800mA 135-4604● g0,31 10A 135-4617● g0,31 1A 135-4605● g0,31 12A 135-4618● g0,31 2A 135-4609● g0,31 Fusibles temporisés CMS - Couche mince Céramique HPC Notre service cotations est à votre disposition pour vous proposer un meilleur tarif sur toute demande à partir de 500g Fusibles TR5 Fusibles 5 x 20mm - Série 217P Reconnu UL • Courant nominal précis • Petite taille Fusibles 5 x 20mm - Série 215P • Conçus pour être utilisés dans les Standards Internationaux (IEC) • Conforme aux exigences IEC 60127-2, Feuille 1 spécifications pour fusibles action rapide • Haut pouvoir de coupure • I2 t amélioré • Approuvés CSA, METI, CCC, K-Mark, Semko et VDE • Reconnu UL Réf. Fab. = 217. suivie par la valeur puis P Réf. Fab. = 215. suivie par la valeur puis P Conforme à IEC127-3. Approuvé VDE et SEMKO. • Compatible avec les sytèmes de soudage CMS • Reconnu UL • Conçus pour être utilisés dans les Standards Internationaux (IEC) • Conforme aux exigences IEC 60127-2, Feuille 5 spécifications pour fusibles temporisés • Haut pouvoir de coupure • I2 t amélioré • CSA, METI, CCC, K-Mark, Approuvés Semko et VDE • Reconnu UL Cette série de fusible est conçue sur la technique de couches minces. Cette technologie offre un niveau de contrôle sur les caracteristiques physiques et électriques des composants, ce qui n’est généralement pas possible avec les fusibles de technologie standard. Conçus pour être utilisés dans des équipements tels que les téléphones mobiles, les PDA, les écrans LCD et les appareils photos. Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Fusibles 36 Electromécanique • Coupe circuit réarmable • Certifié CSA , Approuvé VDE , Approuvé SEV3A à 10A, Reconnu UL Tension max. 250Vc.a., 32Vc.c., 50/60 Hz Terminaison 6.35 x 0.813mm Connexion rapide Montage Encliquetage (à partir de la face avant) Intensité Nominale Réf. Fab. Code Commande Prix Unitaire 0.5A W28-XQ1A-0.50 143-6216● g4,16 0.75A W28-XQ1A-0.75 143-6217● g4,16 1A W28-XQ1A-1 143-6218● g4,16 2A W28-XQ1A-2 965-9064● g8,67 3A W28-XQ1A-3 965-9072● g4,24 4A W28-XQ1A-4 143-6219● g4,16 5A W28-XQ1A-5 965-9080● g4,24 6A W28-XQ1A-6 143-6220● g4,16 7A W28-XQ1A-7 143-6221● g4,16 8A W28-XQ1A-8 143-6222● g4,16 10A W28-XQ1A-10 965-9099● g4,24 12A W28-XQ1A-12 143-6224● g4,16 Par Multiple de 5 IT Vmax Imax I Intensité (A) (A) (V dc) (A) Réf. Fab. Code Commande Prix Unitaire 2.5 4.7 16 100 RGEF250 134-5946● g0,52 3.0 5.1 16 100 RGEF300 134-5947● g0,52 4.0 6.8 16 100 RGEF400 134-5948● g0,53 5.0 8.5 16 100 RGEF500 134-5949● g0,53 6.0 10.2 16 100 RGEF600 134-5950● g0,56 7.0 11.9 16 100 RGEF700 134-5951● g0,59 8.0 13.6 16 100 RGEF800 134-5952● g0,65 9.0 15.3 16 100 RGEF900 134-5954● g0,71 10.0 17.0 16 100 RGEF1000 134-5955● g0,87 11.0 18.7 16 100 RGEF1100 134-5956● g0,87 12.0 20.4 16 100 RGEF1200 134-5957● g0,93 14.0 23.8 16 100 RGEF1400 134-5958● g1,02 Disjoncteur thermique PolySwitch - Série RGEF Tension nominale maximum 250V ac - 50V dc Réinitialisation par pression - Série W28 16V - Haute température Intensité Nominale Réf. Fab. Code Commande Prix Unitaire 1A KD1-1 133-8862● g8,69 2A KD1-2 133-8863● g4,83 3A KD1-3 133-8864● g4,83 4A KD1-4 133-8865● g4,83 5A KD1-5 133-8866● g4,83 6A KD1-6 133-8867● g4,83 7A KD1-7 133-8868● g4,83 8A KD1-8 133-8871● g4,83 9A KD1-9 133-8872● g4,83 10A KD1-10 133-8873● g4,83 12A KD1-12 133-8874● g4,83 15A KD1-15 133-8875● g4,83 Accessoires Clip Anti-Traction 006-10417 133-8876● g0,30 Capot de Protection 1213/44 133-8877● g2,25 • Coupe circuit thermique simple pôle • Réinitialisation par pression • Approuvé CSA et VDE, ReconnuUL La série RGEF possède une offre un taux de 16V et des courants de maintien qui s’étendent de 2.5A à 14A. Les dispositifs de RGEF sont utilisés dans beaucoup d’applications comme les ordinateurs, le multimédia, l’équipement industriel. Ces dispositifs sont approuvés CSA et TUV , conformes ELV et reconnu UL. Par Mulitple de 5 IH IT Vmax Imax I Maintien (A) (A) (A) (V dc) (A) Réf. Fab. Code Commande Prix Unitaire 0.05 0.05 0.15 30 10 MICROSMD005F 134-5915● g0,43 0.10 0.10 0.25 30 10 MICROSMD010F 134-5917● g0,43 0.35 0.35 0.75 6 40 MICROSMD035F-2 117-5837● g0,41 0.50 0.50 1.00 30 40 MICROSMD050F 134-5918● g0,43 0.75 0.75 1.50 13.2 40 MICROSMD075F 134-5919● g0,43 1.10 1.10 2.20 6 40 MICROSMD110F 134-5920● g0,43 1.50 1.50 3.00 6 40 MICROSMD150F 134-5921● g0,43 1.75 1.75 3.50 6 40 MICROSMD175F 134-5922● g0,43 Coupe circuit thermique réarmable PolySwitch - Fusibles réarmables Montage Panneau - Avant ou Arrière Les fusibles Polyswitch réarmables CMS sont conçus pour les installations où l’espace est réduit comme les cartes de circuits imprimés, les appareils photos, les cartes de PC, les ordinateurs... Approuvés CSA et TUV , ELV Conformes et reconnus UL . Série MicroSMD 1210 - Montage Surface RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Moteurs, Drivers et Transmission de puissance 37 Automatisme Commande moteur Seulement g292,81 CODE COMMANDE715-4320 Carte de commande pour moteur pas à pas Unipolaire 2A Seulement g35,76 CODE COMMANDE318-7585 Seulement g11,31 CODE COMMANDE474-3295 Driver de moteur pas à pas bipolaire Circuit driver de courant IMT-901 / Microstep Carte de commande de moteur Tension 10 -24V dc Sortie moteur 350mA per phase (typ), 500mA(max) Fréquence de pas 40 à 300Hz réglable Température 0°C à 40°C Alimentation 15-30V c.c. (+10% max) Consommation: Carte 60mA Sortie moteur 2A/phase max Sortie auxiliaire +12V c.c. 50mA max Fréquence d’entrée max 30kHz(durée min de l’impulsion 5μs) Entrées de contrôle Entrée CMOS Trigger de schmitt à +12V avec résistance de 10 KΩ pull up 0 logique (bas) 0V à +2V 1 logique (haut) +9V à +15V max Le IMT 901 est un hacheur PWM, driver de moteur pas à pas bipolaire sinusoïdal (micro step). La fonction micro-step sinusoïdale est généré par un hardware intégré. • 1 simple CI pour la puissance et logique (jusqu’à 2.5A/phase) • Pas sélectionnable de 1/1, 1⁄2,. 1⁄4, 1/8 • Système de gestion de courant (baisse) ou courant nul réduit ou élimine la perte de puissance moteur ou de surchauffe Attention: de sérieux dommages peuvent être occasionnés si un des moteurs venait à se déconnecter en marche Seulement g47,12 CODE COMMANDE959-8685 Seulement g177,99 CODE COMMANDE415-8544 Commande pour moteur pas à pas Unipolaire 0.5A Tension d’alimentation 15 - 42 Vdc Tension alimentation logique Ne nécessite pas alim. séparée, utiliser alimentation moteur Consommation de courant 1 - 3 Amps Niveau de sortie biphase bipolaire, courant constant haché régle sur carte via commutateur DIP Step logic pas complet / demi-pas Courant de sortie par phase 0.5 - 3.5 Amps Signals de commande entrée trigger Schmitt CMOS fonctionnant à +12V 10KΩ résistances et diode d’isolation Logique 0 (bas) 0V à +2V Logique 1 (haut) +9V à +30V max. Réf. Fab. MSE570 EVO 2 • Carte de commande pour moteurs hybrides ou à aimants permanents 6 ou 8 fils • Mode 1/2 pas et 1 pas • Commande avec une impulsion et indication du sens • Fonctionnement mono tension - 2A par phase 30V c.c. max • Format simple Europe avec connecteur (100x160mm) DIN41612 type B, 32 voies, rangée A, classe 3• Hauteur 17mm Alimentation moteur 20-70V c.c. (non régulé) Logique moteur 15-28V c.c. (non régulé) Intensité de sortie 2-6A (par commutateur DIL) Gamme d’intensité moteur 2A-9A Sortie auxiliaire (régulée) +12V c.c., 50mA max. +5V c.c., 50mA max. Fréquence d’entrée max 20kHz Contrôle en entrée Entrée par Trigger de Schmitt à 12V avec 10KΩ Logique 0 (bas) 0V à +2V Logique 1 (haut) +9V à +30V max. • Convient aux moteurs pas à pas unipolaires (4 phases) • Format compact 55mm x 40mm • Mode pas et demi-pas • Une horloge interne et une fréquence LS TTL externe sont disponibles sur la carte • 350mA par phase à 24V • Connecteur MTA au pas de 2.54mm - 6 voies • Haute performance • Efficacité améliorée • Ne nécessite pas de dissipateur thermique • Alimentation simple pour moteur et logique • Peut piloter 4, 6 ou 8 moteurs jusqu’à 70V c.c. et 6A par phase • Sortie courant sélectionnable, 2A à 6A permet de piloter 23 à 42 moteurs • Mode pas entier et demi pas (mode micro pas possible via une carte annexe) • Protection contre les surcharges et surchauffes • Sorties auxiliaires 5V et 12V pour unités de puissance externes • Connecteur DIN41612, 32 voies, 2 rangées a+c, corps D, classe 2 • Dimensions (LxlxH): 220x100x76mm • Protection thermique standard et surveillance de condition • Conçu pour une hauteur de montage de 3U Euro card • Dimensions (HxLxl): 100x160x60mm Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Moteurs, Drivers et Transmission de puissance 38 Automatisme Seulement g148,55 CODE COMMANDE391-4513 Seulement g22,87 CODE COMMANDE391-4537 Automates Pour les dernières technologies en contrôle de mouvement et automation regroupant plus de 1000 nouveaux produits, consultez le Technology First en ligne : www.electronicsdesignworld.com Type Réf. Fab. Code Commande Prix Unitaire Standard 6SE64000PM000AA0 391-4501 g35,06 Mutidrop 6SE64000MD000AA0 391-4495 g45,73 • Gamme de 0.1kW à 1.5kW • Version monophasée et triphasée • Interface opérateur • Potentiomètre en façade • Trés compact et prêt à câbler • Filtre RFI en option et protection contre les chocs en sortie • Approuvé UL, CUL et CE • Protection par interruption instantanée de la puissance • Communication RS485 • Multi-fonctions configurables en entrée et sortie • Sortie analogique programmable • Freinage par injection c.c. • Courbe programmable • 8 vitesses pré-sélectionnées Filtres RFI Code Commande Prix Unitaire Monophasé 0.1kW - 0.55kW 318-1601 g37,21 0.7kW - 1.5kW 318-1613 g46,48 Seulement g128,89 CODE COMMANDE377-5161 Filtre CEM —Série 3GJV Module ProfiBus - Micro Master Filtre CEM —Série 3G3MV Platines presseétoupe - MicroMaster • Utilisées pour remplacer les inserts moulés de fixation de presse-étoupe de câble • Améliore la suppression EMC • Disponible dans les trois tailles de structure de convertisseur Une gamme compacte de filtres RFI, faible perte et de protections contre les chocs sont disponibles pour une parfaite conformité avec les directives CEM. Une gamme compacte de filtres RFI, faible perte et de protections contre les chocs sont disponibles pour une parfaite conformité avec les directives CEM Micromaster - Série 420 Remarque sur le contenu technique : Le fonctionnement commandé par ProfiBus est possible jusqu’ à 12Mbaud/s Le BOP ou l’ AOP peuvent être enfichés dans le module donnant un affichage du fonctionnement. Le module ProfiBus peut être alimenté à partir d’ une alimentation 24V externe∼: ainsi le bus reste actif quand le convertisseur n’est pas sous tension. Tension d’entrée (monophasé) 200-240V c.a, -15% à +10%, 50/60Hz Tension d’entrée (triphasé) 200-230V c.a, -10% à +10%, 50/60Hz Température -10°C à +50°C Fréquence sortie 0.1Hz à 400Hz Surcharge 150% pour 60 secondes Accél./Décél. 0.0 à 999 secondes séparément réglable Protection IP20 Réf. Fab. Code Commande Prix Unitaire Monophasé 1.1kW CIMR-J7AZB0P70 318-1522 g266,22 Triphasé 0.55kW CIMR-J7AZ20P40 318-1560 g227,92 Three Phase (400V) 0.37kW CIMR-J7AZ40P20 377-4065 g431,76 1.1kW CIMR-J7AZ40P70 377-4089 g515,85 1.5kW CIMR-J7AZ41P50 377-4090 g500,59 universelle Siemens pour les moteurs c.a. de 120W à 11kW. Elle se distingue par une structure de paramètres nouvelle et conviviale, une installation simple, des terminaisons de câblage aisément accessibles et des panneaux opérateurs interchangeables qui simplifient l’installation Le Micromaster 420 est la nouvelle série de commande Variateur de vitesse — Série 3G3JV Le variateur de vitesse 3G3JV est extrêmement compact, facile à utiliser et est disponible sous une version monophasée 240Vc.a. jusqu’à 1.1kW et triphasée 200Vc.a. jusqu’à 1.5kW Tous les modèles sont conformes aux dernières directives CEM grâce à un filtre RFI (option) • Technologie IGBT commandée par microprocesseur • Entrée analogique programmable et extensible de 0 à 20mA • Les hautes fréquences de commutation permettent un fonctionnement silencieux des moteurs • Sortie par relais totalement programmable • Commande de courant de flux (FCC) pour réponse dynamique améliorée et commande du moteur optimisée • Options de connexion à un PC • Panneaux opérationnels en option pour établir/changer les paramètres • Contre-réaction PI pour simple commande de processus Monophasé et triphasé RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Informatique industrielle et PLC 39 Automatisme Série Easy 500 Série Easy 700 E/S 12 18 (20) Entrées 8 12 Sorties 4 6 (8) Dimensions (lxHxP) 71.5x90x58mm 107.5x90x58mm Type sortie relais 8A à 230 Vca / 24 Vcc 8A à 230 Vca / 24 Vcc Sortie transistor 0.5 A à 24 Vcc 0.5 A à 24 Vcc Température d’utilisation -25 à 55°C -25 à 55°C Tension Type de Entrée Configurable Afficheur & Code alimentation sortie analogique clavier Réf. Fab. Commande Prix Unitaire Easy 500 12V dc Relais Oui (2) Oui EASY512-DA-RC 120-5697● g134,86 12V dc Relais Oui (2) Non EASY512-DA-RCX 120-5698● g104,61 24V dc Relais Oui (2) Oui EASY512-DC-R 120-5700● g117,68 24V dc Relais Oui (2) Oui EASY512-DC-RC 120-5701● g134,86 24V dc Relais Oui (2) Non EASY512-DC-RCX 120-5702● g104,61 24V dc Transistor Oui (2) Oui EASY512-DC-TC 120-5703● g117,68 24V dc Transistor Oui (2) Non EASY512-DC-TCX 120-5704● g98,15 24V ac Relais Oui (2) Oui EASY512-AB-RC 120-5692● g134,86 24V ac Relais Oui (2) Non EASY512-AB-RCX 120-5693● g104,61 100 - 240V ac Relais Non Oui EASY512-AC-R 120-5694● g117,68 100 - 240V ac Relais Non Oui EASY512-AC-RC 120-5695● g134,86 100 - 240V ac Relais Non Non EASY512-AC-RCX 120-5696● g104,61 Easy 700 12V dc Relais Oui (4) Oui EASY719-DA-RC 120-5710● g188,10 12V dc Relais Oui (4) Non EASY719-DA-RCX 120-5711● g170,14 24V dc Relais Oui (4) Oui EASY719-DC-RC 120-5712● g188,10 24V dc Relais Oui (4) Non EASY719-DC-RCX 120-5713● g170,14 24V dc Transistor Oui (4) Oui EASY721-DC-TC 120-5714● g188,10 24V dc Transistor Oui (4) Non EASY721-DC-TCX 120-5715● g170,14 24V ac Relais Oui (4) Oui EASY719-AB-RC 120-5706● g188,10 24V ac Relais Oui (4) Non EASY719-AB-RCX 120-5707● g170,14 100 - 240V ac Relais Non Oui EASY719-AC-RC 120-5708● g188,10 100 - 240V ac Relais Non Non EASY719-AC-RCX 120-5709● g170,14 Tension Type de Nbre de Code d’alimentation sortie sorties Description Réf. Fab. Commande Prix Unitaire 24V dc Transistor 8 EASY CONTROL 24VDC SORTIE TRANSISTOR EC4P-221-MTXD1 146-0600● g467,05 24V dc Transistor 8 EASY CONTROL 24VDC SORTIE TRANSISTOR EC4P-221-MTXX1 146-0601● g439,07 24V dc Relais 10A 6 EASY CONTROL 24VDC SORTIE RELAY EC4P-221-MRXD1 146-0603● g467,05 24V dc Relais 10A 6 EASY CONTROL 24VDC SORTIE RELAY EC4P-221-MRXX1 146-0604● g439,07 24V dc Transistor 8 EASY CONTROL 24VDC SORTIE TRANSISTOR EC4P-221-MTAD1 146-0605● g516,74 24V dc Transistor 8 EASY CONTROL 24VDC SORTIE TRANSISTOR EC4P-221-MTAX1 146-0606● g488,76 24V dc Relais 10A 6 EASY CONTROL 24VDC SORTIE RELAY EC4P-221-MRAD1 146-0607● g516,74 24V dc Relais 10A 6 EASY CONTROL 24VDC SORTIE RELAY EC4P-221-MRAX1 146-0608● g488,76 E/S Type de total sortie Réf. Fab. Code Commande Prix Unitaire Kits de démarrage 12 Relais EASY-BOX-512-AC 120-5716● g220,55 12 Relais EASY-BOX-512-DC 120-5718● g252,07 18 Relais EASY-BOX-719-AC 120-5719● g267,81 20 Transistor EASY-BOX-721-DC 120-5720● g299,33 18 Relais EASY-BOX-819-AC 120-5689● g330,83 20 Transistor EASY-BOX-822-DC 120-5690● g425,36 Description Code Accessoires Réf. Fab. Commande Prix Unitaire Logiciel de programmation ECP-SOFT 146-0609● g245,74 Carte mémoire externe EU4A-MEM-CARD1 146-0610● g46,77 Câble RJ45 EU4A-RJ45-CAB1 146-0611● g48,60 Module easyControl Description Réf. Fab. Code Commande Prix Unitaire Accessoires Câble de liaison, 5m MFD-800-CAB5 120-5682● g78,46 PC Programming Cable EASY800-PC-CAB 120-5724● g67,12 Module EEPROM 32k EASY-M-32K 120-5684● g22,85 Module EEPROM 256k EASY-M-256K 120-5673● g26,16 Easy Software, Basic EASY-SOFT-BASIC 120-5726● g34,35 Easy Software, PRO EASY-SOFT-PRO 120-5725● g116,10 Manual, Easy 500 & 700 AWB2528-1508-GB 120-5723 g16,38 Manual, Easy 800 AWB2528-1423-GB 120-5722 g32,77 • Iinterfaces flexibles- CANopen ou easyNet: l’interface CAN combiné vous permet de choisir votre propre structure de réseau. • Mise à jour simple et facile - grâce à son emplacement du module de mémoire, la mise à jour de programme ou du Firmware est un jeu d’enfant. TLe module mémoire est également compatible pour l’archivage de données. • Ethernet sur carte - l’interface Ethernet intégrée permet une programmation facile du easyControl mais également une installation dans les infrastructures existantes telles que les OPC. • Fonctionnement convivial - PLC compact avec un afficheur intégré ou détachable, l’easyControl est aussi compatible avec les fonctions HMI basiques comme les modèles Easy standard. Contrôleur Easy Logic La gamme de contrôleurs logiques Easy offre un choix de caractéristiques et d’options appropriées à une large gamme d’application pour des machines d’automation de petite et moyenne taille, contrôle d’accès et d’éclairage. Les Easy 500 et 700 sont des versions améliorées des Easy 400 et 600. La gamme est disponible avec une alimentation 12Vcc, 24Vcc et 100-240Vca. Le kit de démarrage contient le contrôleur, logiciel et câble de programmation. Module interface Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Cartes mères pour automates 40 Automatisme Seulement g294,50 CODE COMMANDE371-6089 Seulement g424,70 CODE COMMANDE371-6077 (PCI24) (PCI08-DC/DC) (PCO24) • Plage de tension de commutation d’entrée de 10V à 30V • Fréquence d’entrée maximum 50Hz avec filtres sélectionnés, 10kHz sans filtres sélectionnés • Diodes de protection de tension inverse sur toutes les entrées • Fréquence de sortie maximum 40kHz • Diode de détection sur toutes les sorties pour la protection lors la commande de charges inductives • LED d’accès à la carte Conçue pour la commande industrielle et la surveillance, l’interfaçage de dispositifs E/S parallèles, l’isolement de la boucle de terre. (PCSER4) (PC-SYSCON) (PCPIC) • 24 canaux d’entrées numériques jusqu’à 24V, isolés par opto-électronique • Diodes de protection inverse Carte ISA à 8/8-canaux d’Entrée/Sortie numériques isolées par opto-électronique Code Commande Prix Unitaire PCSER4 371-6107 g350,30 • Temporisation de l’horloge sur 2 ou 10 secondes • Détecteur de tension (+5V, +12V, -12V) ; points de déclenchement programmables • 24 canaux de sorties numériques jusqu’à (APCI-RELAY8/IN8) • Résolution du moniteur de tension : 24,2mV pour +5V; 60,7mV pour ±12V • Détecteur de température, résolution 0,48°C • Sur la carte : ronfleur et sortie de relais • Fonctionnement par interruptions • 8 entrées numériques et 8 sorties numériques • 2 canaux d’alarme avec entrées analogiques (0 à 20V) ou isolées par opto-électronique (12 à 24V) • Source d’alimentation 24V isolée • Traitement des interruptions • Isolement transitoire jusqu’à 1500V efficaces • Interface du bus PC à deux octets avec identification de carte et test fonctionnel d’état par LED • Trois compteurs-temporisateurs polyvalents à 16-bits Carte ISA E/S série à 4 canaux Réalisée pour commande industrielle par tout ou rien, commande de contacteur externe, surveillance d’entrées numériques et surveillance de l’état de contacts 24V, isolées par opto-électronique • Courant de commande isolée jusqu’à 400mA, à 50V par canal, avec test d’état ‘par relecture’ • Neuf canaux de compteurs temporisateurs à 16 bits, l’un est utilisé comme base de temps • Mesure multifonction de fréquences, comptages ou temps • Interface à deux octets avec le bus PC avec fonction d’identification de carte et test fonctionnel par LED • Jusqu’à 16 entrées numériques et 8 entrées d’interruption † Disponible jusqu’à épuisement du stock • Isolement des transitoires jusqu’à 1500V efficaces • Interface du PC bus à deux octets avec identification de carte et test fonctionnel d’état par LED † Disponible jusqu’à épuisement du stock † Disponible jusqu’à épuisement du stock Code Commande Prix Unitaire PCIO8-DC/DC 371-6065 g213,90 • 8 relais commutateurs • Contacts disponibles normalement fermés (NF) et normalement ouverts (NO) • Les drivers de relais peuvent être désactivés à la mise sous tension et remis à zéro • Registre d’état à relecture • 8 entrées numériques à opto-isolateur • Filtres d’entrée anti-rebonds (sélectionnables par liaison) • LED d’accès à la carte Code Commande Prix Unitaire PCSYSCON 371-6119† g489,80 Code Commande Prix Unitaire APCI-RELAY8/IN8 371-6156 g219,84 • 4 canaux indépendants RS232 ou RS422/485 • Taux de données programmables jusqu’à 115K bauds (async), 1,9M bauds (sync) avec interruption vectorisée • LED d’accès à la carte et LED programmable par l’utilisateur • FIFO émission et FIFO réception • Modules 85230 ESCC † Disponible jusqu’à épuisement du stock Code Commande Prix Unitaire PCI24 371-6041† g325,50 ISA Compteur temporisateur multifonctions ISA Surveillance : intégrité et horloge Carte ISA à 24 canaux de sorties numériques isolées par opto-électronique PCI 8 Sorties de relais de commutation & 8 Entrées numériques à opto-isolateur Carte ISA à 24 canaux d’entrées numériques de surveillance isolées par optoélectronique RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Fils et Câbles 41 Test et Puissance Gaine 0.25mm Température d’utilisation 5° à +105°C Tension 300V Taille CSA Réf. Fab. Taille AWG conducteur mm2 Øext. norm. (X = couleur) 24 19/0.127mm 0.24 1.02 44A0111-24-0-X 22 19/0.15mm 0.38 1.19 44A0111-22-0-X 20 19/0.203mm 0.62 1.4 44A0111-20-0-X 18 19/0.254mm 0.96 1.65 44A0111-18-0-X Diamètre ext. Réf. Prix par Diamètre ext. Réf. Prix par Nbre de conducteurs nominal Fab. Code Commande métre Nbre de conducteurs nominal Fab. Code Commande métre Par multiple de 1m 24AWG 28AWG 2 4.8 86202CY 151-5269● g6,98 2 4.4 86002CY 151-5259● g6,20 3 5.0 86203CY 151-5270● g8,00 3 4.6 86003CY 151-5260● g6,67 4 5.3 86204CY 151-5271● g9,30 4 4.8 86004CY 151-5261● g7,49 5 5.7 86205CY 151-5272● g10,32 26AWG 7 6.4 86207CY 151-5273● g11,10 2 4.6 86102CY 151-5262● g6,45 12 8.1 86212CY 151-5274● g12,91 3 4.7 86103CY 151-5264● g7,22 22AWG 4 5.0 86104CY 151-5265● g8,77 2 5.2 86302CY 151-5276● g7,49 5 5.3 86105CY 151-5266● g9,55 3 5.4 86303CY 151-5277● g9,04 7 5.8 86107CY 151-5267● g10,08 4 5.7 86304CY 151-5278● g10,08 12 7.4 86112CY 151-5268● g12,40 (Bobine de 100m) AWG CSA (mm2) Couleurs Code Commande Prix Par Bobine Câble monobrin non isolé 26 0.16 139-9530● g34,29 139-9531● g34,29 139-9532● g34,29 139-9533● g34,29 24 0.24 Noir 134-820● g45,91 Blanc 134-831● g39,21 Rouge 417-5980● g40,91 Bleu 417-5992● g40,91 22 0.38 Noir 134-843● g59,06 Blanc 134-855● g59,30 Rouge 417-6005● g50,83 Bleu 417-6017● g50,83 20 0.62 Noir 134-867● g66,42 Blanc 134-879● g66,42 Rouge 417-6029● g58,96 Bleu 417-6030● g58,96 18 0.96 Noir 134-880● g78,87 Blanc 134-892● g77,71 Rouge 417-6042● g74,25 XTRA-GUARD Multiconducteur blindé Câbles et fils Spec 44™ • Légers et faibles dimensions • Faible dégagement de fumées et de gaz corrosif • Résistants à la plupart des produits chimiques • Gaine et Isolant PVC souple pour les applications nécessitant de forte flexion. Jusqu’à 6 millions de cycles • Isolant PVC unique ’Premium-Grade’ permet un passage plus simple dans les espaces restreints • Résiste aux huiles, essences, solvants, et autres produits chimiques • Parfaitement rond et étanche aux liquides (IP-67 ou NEMA 6) • Grandes performances EMI/RFI lorsqu’il est spécifié SUPRASHIELD Câble monobrin non isolé • Recommandé pour les applications électroniques industrielles, les équipments de communication et de transfert de données, la connexion de capteurs et d’actionneurs avec des contrôleurs • UL AWM Style 2661 • Conviennent pour les applications ou les conditions environnementales demandent une fiabilité et des performances constantes • Tension nominale 600V • Double couche d’isolation • Gamme de températures de -65°C à +150°C Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Fils et Câbles 42 Test et Puissance Les SolderSleeve™ sont réalisés en une seule pièce, complétement soudée. Très facile d’installation. Compatible avec les fils basse températures (PVC). Bobine de 50m Nbre de Conducteurs Dia. de conducteurs Réf. Fab. Code Commande Prix Par Bobine 4 1.5 00410013 128-5898● g217,88 5 1.5 00410023 128-5899● g269,56 8 1.5 0041004 128-5900● g387,97 12 1.5 0041006 128-5901● g622,92 4 2.5 00410073 128-5902● g304,93 5 2.5 00410153 128-5903● g391,23 8 2.5 0041009 128-5904● g567,82 12 2.5 0041020 128-5905● g861,30 • Serre-câbles moulés en une seule pièce, desserrables, Câble plat et souple - Résistant aux intempéries Taille de Surface du Jauge Diamètre Taille de Surface du Jauge Diamètre conducteur conducteur (mm2) AWG Externe conducteur conducteur (mm2) AWG Externe 19/0.120 mm 0.215 24 1.15mm 19/0.300 mm 1.343 16 2.15mm 19/0.150 mm 0.336 22 1.3mm 37/0.250 mm 1.675 14 2.46mm 19/0.200 mm 0.597 20 1.55mm 37/0.320 mm 3.022 12 2.99mm Gamme Longueur Qté par Code 19/0.250 mm 0.933 18 1.9mm de diamêtre gaine Paquet Réf. Fab. Commande Prix Par Paquet 1.5mm - 3.0mm 24.5 100 B-155-03 129-2903● g47,36 2.0mm - 4.8mm 29.3 100 B-155-05 129-2904● g50,32 3.3mm - 7.3mm 32.5 50 B-155-07 129-2905● g27,68 4.5mm - 11.5mm 35.5 25 B-155-11 129-2906● g37,37 7.0mm - 15.1mm 45.5 10 B-155-13 129-2907● g21,61 Spécifications • Gaine : Noir, Polychoroprène composé de 5GM3 • Code d’identification des conducteurs : Jusqu’à 5 conducteurs = codage couleur; 6 conducteurs ou plus = noir numéroté; un conducteur vert/jaune au milieu • Rayon de courbure minimim = 10 x le diamêtre extérieur • Tension nominale = 300/500V AWG Couleur Code Commande Prix Unitaire AWG Couleur Code Commande Prix Unitaire 24 Noir 142-5466● g79,85 18 Blanc 142-5475● g137,74 24 Blanc 142-5467● g79,85 16 Noir 142-5476● g173,94 22 Noir 142-5469● g90,53 16 Blanc 142-5477● g173,94 22 Blanc 142-5471● g90,53 14 Noir 142-5478● g217,38 20 Noir 142-5472● g109,93 14 Blanc 142-5479● g217,38 20 Blanc 142-5473● g109,93 12 Noir 142-5480● g265,53 18 Noir 142-5474● g137,74 12 Blanc 142-5482● g265,53 Skintop Click Terminaisons SolderSleeve™ Conforme RoHS fabriqués en nylon 6/6 noir ou naturel, approuvés UL • Non propagateurs de flamme selon UL94V-2 • Idéals pour la maintenance, le remplacement ou le prototypage Par Paquet de 100 Dia. Tension Dia. Faisceau Code L l Max. Max. (kg) Max. Commande Prix Unitaire Naturel 125 7.6 30 22 30 121-8017● g3,36 150 7.6 35 22 35 141-6065● g7,10 200 7.6 50 22 50 141-6067● g8,35 300 7.6 80 22 80 141-6068● g13,58 Noir 125 7.6 30 22 30 126-9017● g3,49 150 7.6 35 22 35 141-6069● g7,10 200 7.6 50 22 50 141-6070● g8,35 300 7.6 80 22 80 141-6071● g13,58 SKINTOP CLICK BS en polyamide est basé sur un système de verrouillage par clip qui permet une installation facile et très rapide, garantissant une résistance aux vibrations permanentes. Il est conçu pour être utilisé en particulier avec des applications de sécurité fonctionnelle pour du matériel portable, avec des pièces de machine en mouvement, des appareils d’ingénierie, des applications son et lumière et de la robotique industrielle. • Plage de températures de -25°C à 90°C Fil d’équipement isolant ETFE • Système unique de ’clip’ pour un montage rapide • Indice de protection IP68 • Température d’utilisation: -20°C à 100°C • Corps en polyamide Serre-câbles desserrables Les câbles NEOFLEX® plats résistent aux intempéries et sont destinés à équiper des grues, des portiques portuaires, des ponts roulants sur des chantiers de construction ou des chantiers navals et permettent d’assurer un fonctionnement en • Conducteurs multibrins en cuivre étamés • Gamme de températures de -55°C à +125°C Diamètre de câble Filetage Longueur épaisseur du panneau Code (mm) (mm) (mm) (mm) Qté par pqt Réf. Fab. Commande Prix par paquet Gris 5 - 9 M16 94 1 - 4 50 53112906 150-4030● g141,08 7 - 13 M20 108 1 - 4 25 53112907 150-4031● g90,18 9 - 17 M25 127 1 - 4 25 53112908 150-4033● g117,72 Noir 5 - 9 M16 94 1 - 4 50 53112909 150-4035● g141,08 7 - 13 M20 108 1 - 4 25 53112911 150-4036● g90,18 9 - 17 M25 128 1 - 4 25 53112912 150-4037● g117,72 Chaque paquet contient un outil de démontage toute sécurité, dans les conditions d’exploitation les plus sévères. DEF STAN 61-12 • Tension 600V rms • Température de -40°C (flex.) ou -75°C (fixe) à 135°C • Conducteur: Cuivre étamé Presse-étoupe RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Alimentations et Convertisseurs DC/DC 43 Test et Puissance 15 W - Forte densité de puissance Série NMJ Série JCA06 Series, Brochage standard industriel, Boîtier faible taille • Convertisseur 15 W dans un boîter métalique 25.4x25.4x10.2 mm • Large plage de tension d’entrée 4:1 Série RK • Reconnu UL60950 • Simple sortie • Isolation 5.2KVdc • Entrée 5V et 12V • Sortie 5V, 9V, 12V et 15V • Aimant toroidal Une gamme de convertisseurs CC/CC innovants. Un boîtier 24 broches compatible avec les standards industriels, qui permet d’économiser de l’éspace sur la carte grace une taille plus faible, tout en fournissant la même puissance. • Rendement 87% • Protection contre les courts circuits • Brochage industriel • "Remote" On/Off • Conforme: UL/cUL 60950-1, EN 60950-1 et IEC 60950-1 • Garantie constructeur 3 ans • Deux enroulements pour connexion série ou parallèle • Isolation renforcée entre le primaire et le secondaire • Très faible emission de champs magnetique • Approuvé UL, CUL, EN61-558, VDE0570 Installation à l’aide d’un kit de fixation (! prendre garde à ne pas trop serrer et s’assurer que les deux extrémités soit bien connectés à la masse métallique) • Boîtier UL 94V-0 • Plage d’entrée Largeur 2:1 • Sortie régulée • Boîtier métallique 24 broches • Isolation 1.5kVdc Tension Tension Courant de (%) d’entrée Vdc de sortie Vdc sortie (max.) mA Réf. Fab. Code Commande Prix Unitaire 9 - 36 5 3000 84 THN 15-2411WI 144-1226● g50,07 12 1300 86 THN 15-2412WI 144-1227● g50,07 15 1000 85 THN 15-2413WI 144-1228● g50,07 18 - 75 5 3000 86 THN 15-4811WI 144-1229● g50,07 12 1300 87 THN 15-4812WI 144-1230● g50,07 15 1000 87 THN 15-4813WI 144-1232● g50,07 Code Commande Prix Unitaire 15VA 0-6V, 0-6V @ 0.08A 141-9526● g20,96 0-9V, 0-9V @ 0.08A 141-9527● g20,96 0-12V, 0-12V @ 0.08A 141-9528● g20,96 0-15V, 0-15V @ 0.08A 141-9529● g20,96 0-18V, 0-18V @ 0.08A 141-9530● g20,96 25VA 0-6V, 0-6V @ 0.14A 141-9531● g24,22 0-9V, 0-9V @ 0.14A 141-9532● g24,22 0-12V, 0-12V @ 0.14A 141-9533● g24,22 0-15V, 0-15V @ 0.14A 141-9534● g24,22 0-18V, 0-18V @ 0.14A 141-9536● g24,22 0-22V, 0-22V @ 0.14A 141-9537● g24,22 40VA 0-6V, 0-6V @ 0.22A 141-9538● g26,45 0-9V, 0-9V @ 0.22A 141-9539● g26,45 0-12V, 0-12V @ 0.22A 141-9540● g26,45 0-15V, 0-15V @ 0.22A 141-9541● g26,45 0-18V, 0-18V @ 0.22A 141-9542● g26,45 0-22V, 0-22V @ 0.22A 141-9543● g26,45 63VA 0-6V, 0-6V @ 0.34A 141-9544● g30,79 0-9V, 0-9V @ 0.34A 141-9545● g30,79 0-12V, 0-12V @ 0.34A 141-9546● g30,79 0-15V, 0-15V @ 0.34A 141-9548● g30,79 0-18V, 0-18V @ 0.34A 141-9549● g30,79 0-22V, 0-22V @ 0.34A 141-9550● g30,79 0-25V, 0-25V @ 0.34A 141-9551● g30,79 0-30V, 0-30V @ 0.34A 141-9552● g30,79 100VA 0-9V, 0-9V @ 0.51A 141-9553● g37,36 0-12V, 0-12V @ 0.51A 141-9554● g37,36 0-15V, 0-15V @ 0.51A 141-9555● g37,36 0-18V, 0-18V @ 0.51A 141-9556● g37,36 0-22V, 0-22V @ 0.51A 141-9557● g37,36 0-25V, 0-25V @ 0.51A 141-9558● g37,36 0-30V, 0-30V @ 0.51A 141-9561● g37,36 Convertisseur DC/DC - Série Tension d’entrée Tension de sortie Courant de sortie Réf. Brochage Nominale (V) (V) (mA) Fab. Code Commande Broche 1 Vin 5 5 100 NMJ0505SAC 137-1585 Broche 2 GND 5 9 55 NMJ0509SAC 137-1586 Broche 5 -V 5 12 42 NMJ0512SAC 137-1588 Broche 7 +V 5 15 33 NMJ0515SAC 137-1589 12 5 100 NMJ1205SAC 137-1590 12 9 55 NMJ1209SAC 137-1591 12 12 42 NMJ1212SAC 137-1592 12 15 33 NMJ1215SAC 137-1593 • Bloquage des sous tensions • Protection contre les courts-circuits • Filtre d’entrée Pi • Conformes UL & TUV THN15 WI • Boîtier SIP Code Commande Prix Unitaire Sortie Simple Tous les codes● g25,73 Sortie Double Tous les codes● g26,46 Rendement Dimensions Dia. des trous de fixation Poid Charge VA % Dia H mm kg 15 83 62 29 5 0.30 25 82 68 29 5 0.40 40 84 80 33 5 0.45 63 86 90 35 5 0.75 100 89 93 43 5 1.00 120 89 100 43 5 1.25 160 90 108 42 5 1.50 Température ambiente Max. 40°C Isolation Class A Convertisseur DC/DC 1W - Primaire 115V/ 230Vac Simple sortie Réf. Fab. Tension d’entrée Sortie 1 Sortie 2 Code Commande Réf. Fab. Tension d’entrée Sortie 1 Sortie 2 Code Commande JCA0605S03 4.5 à 9 Vdc 3.3V dc, 1.52A – 133-7125 JCA0624S03 18 à 36 Vdc 3.3V dc, 1.52A – 133-7141 JCA0605S05 4.5 à 9 Vdc 5V dc, 1A – 133-7126 JCA0624S05 18 à 36 Vdc 5V dc, 1A – 133-7143 JCA0605S12 4.5 à 9 Vdc 12V dc, 0.5A – 133-7127 JCA0624S12 18 à 36 Vdc 12V dc, 0.5A – 133-7144 JCA0605S15 4.5 à 9 Vdc 15V dc, 0.4A – 133-7128 JCA0624S15 18 à 36 Vdc 15V dc, 0.4A – 133-7145 JCA0605D01 4.5 à 9 Vdc 5V dc, 0.5A -5V dc, 0.5A 133-7131 JCA0624D01 18 à 36 Vdc 5V dc, 0.5A -5V dc, 0.5A 133-7146 JCA0605D02 4.5 à 9 Vdc 12V dc, 0.25A -12V dc, 0.25A 133-7132 JCA0624D02 18 à 36 Vdc 12V dc, 0.25A -12V dc, 0.25A 133-7147 JCA0605D03 4.5 à 9 Vdc 15V dc, 0.2A -15V dc, 0.2A 133-7133 JCA0624D03 18 à 36 Vdc 15V dc, 0.2A -15V dc, 0.2A 133-7148 JCA0612S03 9 à 18 Vdc 3.3V dc, 1.52A – 133-7134 JCA0648S03 36 à 75 Vdc 3.3V dc, 1.52A – 133-7149 JCA0612S05 9 à 18 Vdc 5V dc, 1A – 133-7135 JCA0648S05 36 à 75 Vdc 5V dc, 1A – 133-7150 JCA0612S12 9 à 18 Vdc 12V dc, 0.5A – 133-7136 JCA0648S12 36 à 75 Vdc 12V dc, 0.5A – 133-7151 JCA0612S15 9 à 18 Vdc 15V dc, 0.4A – 133-7137 JCA0648S15 36 à 75 Vdc 15V dc, 0.4A – 133-7152 JCA0612D01 9 à 18 Vdc 5V dc, 0.5A -5V dc, 0.5A 133-7138 JCA0648D01 36 à 75 Vdc 5V dc, 0.5A -5V dc, 0.5A 133-7153 JCA0612D02 9 à 18 Vdc 12V dc, 0.25A -12V dc, 0.25A 133-7139 JCA0648D02 36 à 75 Vdc 12V dc, 0.25A -12V dc, 0.25A 133-7155 JCA0612D03 9 à 18 Vdc 15V dc, 0.2A -15V dc, 0.2A 133-7140 JCA0648D03 36 à 75 Vdc 15V dc, 0.2A -15V dc, 0.2A 133-7156 Code Commande Prix Unitaire Séries NMJ Tous codes● g12,60 Convertisseur DC/DC 6W - Sortie Simple ou Double • Construction interne CMS • Ne nécessite pas de dissipateur thermique Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Alimentations et Convertisseurs DC/DC 44 Test et Puissance Alimentation Puissance Tension Courant de sortie (A) Code Commande Réf. Fab.* de sortie (W) de sortie (V) Nominal Crête Montage PCB Montage Chassis ECL15US3V3 10 3.3 3 3.9 133-7079 133-7086 ECL15US05 15 5 3 3.9 133-7080 133-7088 ECL15US09 15 9 1.67 2.17 133-7081 133-7089 ECL15US12 15 12 1.25 1.62 133-7082 133-7090 ECL15US15 15 15 1 1.3 133-7083 133-7091 ECL15US24 15 24 0.63 0.82 133-7084 133-7092 ECL15US48 15 48 0.32 0.41 133-7085 133-7093 * Suffix: -P = Montage PCB , -T = Montage Chassis Puissance Tension Réglage de la Code Puissance Tension Réglage de la Code Réf. Fab. de sortie de sortie Courant tension de sortie Commande Réf. Fab. de sortie de sortie Courant tension de sortie Commande DNR18US05 18W 5V 3A 4.5 - 5.75V 137-2689 DNR60US48 60W 48V 1.25A 48.0 - 55.0V 120-9252 DNR18US12 18W 12V 1.5A 10.8 - 13.8V 137-2690 DNR120AS12-I 120W 12V 10A 11.4 - 14.5V 137-2699 DNR18US15 18W 15V 1.2A 13.5 - 17.25V 137-2691 DNR120AS24-I 120W 24V 5A 22.5 - 30V 137-2700 DNR18US24 18W 24V 0.75A 21.6 - 28.8V 137-2692 DNR120AS48-I 120W 48V 2.5A 45 - 55V 137-2702 DNR30US05 30W 5V 6A 5.0 - 5.5V 137-2693 DNR240PS24-I 240W 24V 10A 22.5 - 28.5V 120-9257 DNR30US12 30W 12V 2.5A 12 - 14V 137-2694 DNR240PS48-I 240W 48V 5A 47.0 - 56.0V 120-9258 DNR30US24 30W 24V 1.25A 24 - 28V 137-2696 DNR480PS24-I 480W 24V 20A 22.5 - 28.5V 137-2703 DNR30US48 30W 48V 0.625A 48 - 55V 137-2697 DNR480PS48-I 480W 48V 10A 47 - 56V 137-2704 DNR60US05 60W 5V 10A 5 - 5.5V 137-2698 DNR480TS24-I 480W 24V 20A 22.5 - 28.5V 137-2705 DNR60US12 60W 12V 5A 12.0 - 14.0V 120-9250 DNR480TS48-I 480W 48V 10A 47 - 56V 137-2706 DNR60US24 60W 24V 2.5A 24.0 - 28.0V 120-9251 Réf. Fab. Code Commande Prix Unitaire DNR18 Tous Codes● g36,75 DNR30 Tous Codes● g47,04 DNR60 Tous Codes● g58,80 DNR120 Tous Codes● g79,38 DNR240 Tous Codes● g126,42 DNR480 Tous Codes● g183,75 Code Commande Prix Unitaire Tous les codes● g33,81 Tension Puissance Tension / Courant d’entrée de sortie Sortie 1 Sortie 2 Sortie 3 Réf. Fab. Code Commande Prix Unitaire 85 - 264V 65W 12V / 5.4A – – NLP65-9612GJ 151-6432● g74,10 85 - 264V 65W 24V / 2.7A – – NLP65-9624GJ 151-6433● g74,10 85 - 264V 65W 5V / 7A 24V / 2A – NLP65-9620GJ 151-6434● g74,10 85 - 264V 65W 5V / 7.5A 12V / 2.5A -12V / 0.65A NLP65-9608GJ 151-6435● g74,10 Médicale 85 - 264V 65W 24V / 2.7A – – NLP65-9924J 151-6436● g81,32 85 - 264V 65W 5V / 7A 24V / 2A – NLP65-9920J 151-6438● g81,32 85 - 264V 65W 5V / 7A 12V / 2.5A – NLP65-9929J 151-6439● g81,32 85 - 264V 65W 5V / 7A 12V / 2.5A -12V / 0.5A NLP65-9908J 151-6440● g81,32 Alimentation 18-480 W Rail DIN - Simple sortie Alimentation 15W - Simple sortie Montage sur Chassis ou PCB Alimentation à découpage 65W Sortie simple, double ou triple. • Montage chassis ou PCB • Class II • Très grande fiabilité >400 000Hrs Série DNR • Empreinte 127.0 x 76.2 x 32mm • Protection contre les surtensions et les courts-circuits • Taille réduite • 65W avec un refroidissement par air • Faible coût • Ultra compacte • Sortie 3.3V à 48V • Approuvé pour le normes de sécurité internationales • +60°C à pleine puissance • Protection contre les surtensions et les sous tension • Fonctionne en parallèle • Version triphasée 480W Série NLP • Conception solide pour les applications industrielles • Modèles DC OK 24 V • Rendement jusqu’à 90% • Large plage d’entrée • Plage ajustable Série ECL15 AC/DC Miniature Alimentation miniature AC/DC permet d’avoir 15 Watts en sortie. Disponible en version montage chassis ou PCB avec des plages de tension de sorties de 3.3V à 48V. RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Test et Mesure 45 Test et Puissance • Mesure en RMS vrai • Mesure CA+CC • Gamme automatique/manuelle sélectionnable • Enregistrement et rappel des données • Gel du max. et gel de l’affichage • Mode Max/min et modes relatifs • Mesure de boucle de courant 4 - 20mA • Double niveau d’affichage avec rétro-éclairage • Livré avec un cordon USB opto-couplé 100mm, logiciel d’enregistrement de données, cordons de test standard, cordons à pince courts pour une mesure de capacité précise, adaptateur de pinces crocodiles, pile 9V, sacoche de transport et manuel d’instruction (en anglais) Tension d’entrée 85-265V ac(47/63Hz) ou 120-330V dc Facteur de puissance Meets EN61000-3-2 Température d’utilisation -10°C à +70°C, derating linéaire 50% de la charge de 50°C à 70°C Immunité IEC61000-4-2, -3, -4, -6 (Level 3), -5, -8 (Level 4), -11 Remote on/off Oui (Isolé de la sortie) Refroidissement Ventilateur interne Gammes Précision Tension AC 600mV/6V/60V/600V/1000V ±(0,6%+5)±(0.6% +5) Tension DC 600mV/6V/60V/600V/1000V ±(0.3%+2) Courant AC 600μA/6mA/60mA/600mA/10A ±(1.0%+5) Courant DC 600μA/6mA/60mA/600mA/10A ±(0.5%+3) Résistance 600Ω/6kΩ/60kΩ/600kΩ/6MΩ/60MΩ ±(0.5%+2) Capacité 6nF/60nF/600nF/6μF/60μF/600μF/6mF ±(2.0%+5) Température -40°C - 1000°C ±(1.0%+3) Fréquence 6kHz/60kHz/600kHz/6MHz/60MHz ±(0.1%+3) Puissance Tension de sortie Courant de sortie Réf. Fab. Code Commande Puissance Tension de sortie Courant de sortie Réf. Fab. Code Commande 198W 3.3V(2.64 - 3.96) 60A HWS300-3 145-6492 396W 3.3V(2.64 - 3.96) 120A HWS600-3 145-6498 300W 5V(4 - 6) 60A HWS300-5 145-6493 600W 5V(4 - 6) 120A HWS600-5 145-6499 324W 12V(9.6 - 14.4) 27A HWS300-12 145-6494 636W 12V(9.6 - 14.4) 53A HWS600-12 145-6500 330W 15V(12 - 18) 22A HWS300-15 145-6495 645W 15V(12 - 18) 43A HWS600-15 145-6501 336W 24V(19.2 - 28.8) 14A HWS300-24 145-6496 648W 24V(19.2 - 28.8) 27A HWS600-24 145-6502 336W 48V(38.4 - 52.8) 7A HWS300-48 145-6497 624W 48V(38.4 - 52.8) 13A HWS600-48 145-6503 Description Réf. Fab. Code Commande Prix Unitaire Multimètre de table 72-1016 119-6432 g145,53 Etalonnage Standard S g51,83 Etalonnage NAMAS N g84,76 Multimètre de table – RMS vrai • 5 ans de garantie constructeur • Approuvé UL508 • Conforme SEMI F47 (Ligne AC haute) • Entrée universelle (85 - 265VAC) • Rendement élevé • Large plage de tension d’entrée AC Gammes Précision Tension DC 200mV, 2V, 20V, 200V, 1000V ±(0.05% + 5) Tension AC 2V, 20V, 200V, 1000V ±(0.6% + 40) Résistance 200R, 2kR, 20kR, 200kR, 2MR, 20MR ±(0.4% + 20) Capacité 20nF, 200nF, 2μF, 20μF, 200μF, 2mF, 20mF ±(1.2% + 20) Température -40°C à 1000°C ±(1.0% + 30) Fréquence 20Hz, 200Hz, 2kHz, 20kHz, 200kHz, 2MHz, 20MHz, 200MHz ±(0.1% + 15) Rapport cyclique 10% à 90% ±(1.0% + 30) Mesure de boucle de courant 4-20mA - 0 - 100% ±(1% + 50) Impédance d’entrée 10MOhm Réf. Fab. Code Commande Prix Unitaire 72-7730 128-3642 g102,83 Etalonnage Standard S g51,83 Etalonnage NAMAS N g84,76 Un multimètre de table numérique pour la mesure de signaux AC en RMS vrai avec un affichage à LED. Livré avec des cordons de test, un cordon d’alimentation, un manuel d’utilisation, une sonde de température, des pinces crocodiles, une borne de test multifonctions, un câble d’interface RS232C et un logiciel de communication. Alimentation à découpage 300-600W Sortie simple • Affichage LCD 5,999 points • Rétro-éclairage, affichage complet • Mesure de courant jusqu’à 10A • Gamme automatique • Mesure RMS vraie avec une bande passante 100kHz • Tests de diode, de continuité et de transistor • Mode Max/Min et sauvegarde des données 72-7730 Réf. Fab. Code Commande Prix Unitaire Série HWS300 Tous les codes g239,25 Série HWS600 Tous les codes g435,00 • Affichage de l’autonomie faible de la batterie et mode veille • Se connecte à un PC via une interface RS232 (logiciel et cordon fournis) • Alimentation secteur ou par 6 piles C (non fournies) • Compartiment pour accessoires intégré • Manuel utilisateur en anglais Multimètre pleinement fonctionnel offrant une variété de gammes pour chaque application de service: la précision d’un affichage 19,999 points, et une interface USB opto-isolée. Il mesure la tension CA/CC, le courant CA/CC, la résistance, la capacité, la température, la fréquence et le rapport cyclique. Triple affichage avec chiffres primaires de 12mm et double affichage secondaire de 6mm, plus un bargraphe analogique et de nombreux icônes sur écran. Série HWS Multimètre RMS vrai avec interface USB 72-1016 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Test et Mesure 46 Test et Puissance Description Réf. Fab. Code Commande Prix Unitaire Générateur de fonctions 33220A 133-5878 g1475,00 Etalonnage Standard S g131,10 Etalonnage NAMAS N g180,65 Générateur de fonctions arbitraire Modèle Puissance max. Sortie 1 Sortie 2 Sortie 3 E3631A 80W 6V, 5A 25V, 1A 25V, 1A E3632A 120W Gamme 1: 15V, 7A Gamme 2: 30V, 4A E3633A 200W Gamme 1: 8V, 20A Gamme 2: 20V, 10A E3634A 200W Gamme 1: 25V, 7A Gamme 2: 50V, 4A Utilise les techniques DDS (Synthèse numérique directe) pour créer des signaux de sortie stables et avec faible distorsion pour des résultats précis. Ce générateur permet de créer des formes d’onde personnalisées en Gammes Précision Tension AC 100mV à 750V ±(0.06% lect. + 0.03% gamme) Tension DC 100mV, 1V, 10V, 100V, 1000V ±(0.003% lect. + 0.0005% gamme) Courant AC 100μA à 3A ±(0.1% lect. + 0.04% gamme) Courant DC 100μA à 3A ±(0.1% lect. + 0.04% gamme) Résistance 100Ω, 1kΩ, 10kΩ, 100kΩ, 1MΩ, 10MΩ, 100MΩ, 1GΩ ±(0.01% lect. + 0.001% gamme) Capacité 1nF, 10nF, 100nF, 1μF, 10μF ±(0.4% lect. + 0.1% gamme) Température -80 à 150°C ±0.08°C Fréquence 3Hz - 300kHz ±(0.007% lect. + 0% gamme) Description Réf. Fab. Code Commande Prix Unitaire Multimètre de table 34410A 144-0376 g1028,00 Multimètre de table 34411A 144-0377 g1588,00 Kit de test 34138A 144-0379 g21,21 Etalonnage standard S g131,10 Etalonnage NAMAS N g180,65 Réf. Fab. Code Commande Prix Unitaire E3631A 121-4487 g985,00 E3632A 121-4488 g861,00 E3633A 121-4489 g1041,00 E3634A 121-4490 g1041,00 Etalonnage standard S g107,90 Etalonnage NAMAS N g148,60 utilisant la fonction de formes d’onde arbitraires. La fonction pulsée de front variable, avec PWM, offre une flexibilité inégalée pour la conception, la vérification, et applications de test. Le générateur est livré avec les interfaces USB, LAN et GPIB en standard et le logiciel Intuilink pour la génération simple de formes d’onde personnalisées sur PC. Multimètres numériques de table Alimentations de laboratoire programmables • Conforme LXI Classe C • Interfaces USB, GPIB et LAN • Mode graphique, vérification visuelle des réglages du signal • Logiciel IntuiLink • Formes d’onde 20 MHz sinus ou carré • Impulsion, Rampe, Triangulaire, Bruit, et DC • Formes d’onde arbitraires 4-bits, 50 Méch/s, 64 k-points • Types de modulation: AM, FM, PM, FSK, et PWM • Balayage linéaire et logarithmique et fonctionnement burst • Gamme d’amplitude 10 mVpp à 10 Vpp Caractéristiques supplémentaires pour le multimètre 34411A: • 50,000 mesures/sec à 41⁄2 chiffres en continu vers le PC • Mémoire 1 Million mesures • Déclenchement analogique sur niveau • Déclenchement programmable pré/post 33220A Ces alimentations combinent les performances d’une alimentation de laboratoire avec des fonctionnalités flexibles et des sorties multiples. Pour des applications de laboratoire uniquement, 2 modèles sont disponibles sans interface entrée/sortie. 34410A et 34411A • Jusqu’à 3 sorties (double gamme) isolées • Interfaces GPIB et RS-232 avec commande SCPI (pilotes disponibles) • Meilleure intégrité du signal dans les systèmes de test grâce à des sorties faible bruit • Simplifie le câblage avec les mesures intégrées • Simple d’utilisation avec commandes en face avant et fonctions programmables basiques • Protection contre les surtensions, sécurité DUT assurée Série E363xA Formes d’onde standard Sinus 1μHz à 20MHz Carré 1μHz à 20MHz Rampe 1μHz à 200kHz Triangulaire 1μHz à 200kHz Pulsé 500μHz à 5MHz Bruit 9MHz BW typiquel Formes d’onde arbitraires Intégré montée exponentielle, chute exponentielle, rampe négative, sin(x)/x, cardiac. Gamme de fréquences 1μHz à 6MHz Longueur de la forme d’onde 2 à 64k points Résolution d’amplitude 14-bits Taux d’échantillonnage 50Méch/s Caractéristiques générales Gamme Résolution Précision Fréquence 1μHz ±(10ppm + 3pHz) Amplitude 10mVpp à 10Vpp 4 digits ±(1% de réglage + 1mVpp) Offset DC ±5V 4 digits ±(2% de réglage + 0.5% d’amp. + 2mVpp) Offset de phase +360° à -360° 0.001° 20ns Modulation AM, FM, PM, PWM, FSK, balayage, Burst 34410A: • Multimètres hautes performances 61⁄2 chiffres • 10,000 mesures/sec à 51⁄2 chiffres en continu vers le PC • 1,000 mesures/sec à 61⁄2 chiffres en continu vers le PC • Précision DC de base 30 PPM pour 1 an • Interfaces LAN, USB et GPIB en standard • DCV, ACV, DCI, ACI, résistance 2-fils et 4-fils, fréquence, période, continuité, et test de diodes • Mesures de capacité et températures • Gammes de mesure étendues • Fonction d’enregistrement de données, avec mémoire rémanente de 50 000 mesures Les 2 modèles sont livrés avec: kit de test avec sondes et attachement CMS, rapport de test, cordon d’alimentation, câble d’interface USB, CD-ROM avec documentation et logiciel. Accessoires inclus: Manuel d’instructions, manuel d’entretien, guide de référence, logiciel d’édition de formes Intuilink, données de test, câble USB et cordon d’alimentation. RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Test et Mesure 47 Test et Puissance 150MHz & 250MHz Ces oscilloscopes numériques à écran couleur ont été conçus pour une multitude d’applications dans l’industrie, l’éducation et les services de maintenance. Pour simplifier PSA1301T • Gamme de fréquence 150kHz à 1300MHz • Ecran TFT couleur, résolution 480 x 320 pixels • Format portable avec un poids inférieur à 500g • Alimentation sur batterie (autonomie 4heures) ou sur secteur • Pied intégré pour une utilisation sur table • Intervalle de mesure réglable son utilisation, la fonction "Autoset" permet un réglage Le PSA1301 utilise la puissance d’un ordinateur portable pour fournir un niveau de performance impossible auparavant pour un instrument de petit taille et à faible coût. Le résultat est un analyseur de spectre RF de haute performance dans un format compact et léger. Bon rapport qualité-prix, idéal pour des applications de terrain et sur banc. Le PSA1301 intègre un Palm Tungsten, accès ports USB, toutes les fonctionnalités sont maintenues et peuvent être désactivées de l’instrument si nécessaire. automatique des paramètres de mesure du signal reçu. 72-6800 & 72-6805 • 2 voies, bande passante de 150MHz & 250MHz • Echantillonnage jusqu’à 25Géch/s ET • Longueur d’enregistrement de 125K par voie • Grand écran couleur LCD 5.7" • Mode "apprentissage" intégré pour le marquage et l’entraînement • Mode intervalle Zéro avec démodulation AM/FM • Analyse en continu, simple, crête, moyenne • Gamme à l’écran 90dB. -110dbm minimum • Double curseurs avec valeurs absolue/différence • Mouvement intelligent du curseur pour lecture rapide Une gamme d’oscilloscopes 20MHz double voie de haute qualité offrant de nombreuses fonctions. Le 72-6805 intègre également un générateur de fonctions 1MHz. • Fonction FFT intégrée • Menu d’aide intégré • Stockage illimité pour les formes d’ondes, les réglages et les captures d’écran annotées , avec les noms de fichier utilisateur • Transfert de données vers PC et impression • Ordinateur intégré fournissant le traitement de texte, bilan, représentation graphique, web, email, etc. • 20MHz, double voie • Ecran CRT 6" (Affichage 8x10 div.) • Haute sensibilité (1mV/div.) • Fonction X-Y • Entrée axe Z Description Réf. Fab. Code Commande Prix Unitaire Analyseur de spectre portable PSA1301T 107-6496 g1193,00 Etalonnage Standard S g159,77 Etalonnage NAMAS N g188,58 • Fréquencemètre 6 digits • Fonction "Go-No-Go" intégrée • Interface RS-232, port USB et port imprimante inclus La lecture sur écran et la fonction curseur pour la tension, la fréquence et la mesure de fréquence font de cet appareil un outil pratique et opérationnel. Il offre également la possibilité de mémoriser 15 réglages utilisateur et de les rappeler sans restriction. Le mode "Program" très utile permet d’aider les utilisateurs à enregistrer toutes les étapes de mesure necessaires et de les lancer à nouveau. La fonction spéciale "Go-No-Go" est utile pour distinguer les états Succès/Echec. • Sortie CH1 • Synchronisation TV • Déclenchements multiples dont la fonction ALT • Générateur de fonctions 1MHz (72-6805 seulement) Analyseur de spectre portable 1.3 GHz 491-1945 491-1969 72-7235 72-7240 Vertical Bande passante 150MHz 250MHz Nbre de voies 2 Sensibilité 2mV/ div - 5V/ div Temps de montée <2.3ns <1.4ns Couplage entrée 1MΩ Tension max. entre les signaux 300V (DC+AC crête) CAT II Acquisition signal Echantillonnage en temps réel 100MS/s Max. sur chaque voie Echantillonnage équivalent 25GS/s Max. sur chaque voie Longueur d’enregistrement 125K / CH Horizontal Base de temps 1 ns/ div à 10 s/div Précision base de temps + r - 0.01% Déclenchements Source CH1, CH2, LINE, EXT Mode Auto Level, Auto, Normal, Single, TV, Time Delay, Event Delay, Edge, largeur d’impulsion Couplage AC, DC, HF, LF, Réjection du bruit X-Y-Mode X- Axis Input / Y- Axis Input CH1 / CH2 Fréquencemètre Lecture 6 digits Panneau de contrôle Autoset, Save/Recall, Waveform Trace Vertical Déclenchements Fonctions CH1, CH2, DUAL (ALT/CHOP), ADD Modes AUTO, NORM, TV-V, TV-H Tension d’entrée 250V cr (300V cr pour 72-6805) Sources CH1, CH2, ALT, LINE, EXT Sensibilité 5mV/div à 5V/div ±3% Couplage AC Bande passante DC à 20MHz (-3dB) Slope + Ou - Temps de montée 17.5ns Mode X-Y Impédance d’entrée 1MΩ Sensibilité 5mV à 5V/div ±4% Couplage AC, DC, GND Bande passante DC à 500kHz Sortie CH1 20mV/div Différence de phase <3 Horizontal Axe Z Temps de balayage 0.2μS/div à 0.5s/div ±3% Sensibilité >5V cr-cr X-Mag x10 Réponse en fréquence DC à 2MHz Oscilloscopes double voie 20MHz Réf. Fab. Code Commande Prix Unitaire 72-7235 150MHz 491-1945 g992,25 72-7240 250MHz 491-1969 g1292,13 Standard Calibration Charge S g131,10 UKAS Calibration Charge N g180,65 Oscilloscopes numériques - 72-7235 & 72-7240 Réf. Fab. Code Commande Prix Unitaire 72-6800 491-1842 g292,53 72-6805 428-3958 g330,75 Etalonnage Standard S g107,90 N g148,60 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Prototypage 48 Test et Puissance Machine avec base en option Suffisamment pour 1 litre (0,5kg) ou 5 litres (2,5kg) Logiciel pour le layout de platines pour Windows • Fibre de verre époxyde FR4 1,50 mm, double face 35 μm CU (entièrement métallisées) • Côté soudure et composants avec une surface d’or chimique et pourvus d’un masque d’arrêt de soudure • Perforation 1,00 mm TARGET 3001! a permis à une nouvelle génération de logiciels de CAO/IAO de voir le jour. Ces programmes sont en effet utilisés pour la conception, la simulation de circuits électroniques ainsi que le développement de cartes dont le routage peut être vérifié grâce à l’outil de CEM disponible dans TARGET 3001!. L’intégration dans un même environnement de la saisie de schéma, du simulateur électronique et du PCB permet de révolutionner le travail de l’ingénieur dans le processus de conception et permet ainsi de respecter les délais de commercialisation de plus en plus courts. TARGET 3001! includes: Réf. Fab. Connector Type Code Commande Prix Unitaire RE903 MSOP-8 128-7740● g6,98 RE904 MSOP-10 128-7741● g6,98 ’Rota-Spray’ • Granulés de chlorure ferrique hexogène, pour la corrosion de plaques de circuits imprimés en cuivre. * Schematic * Mixed Mode Simulation * Shape Based Contour Autorouter * PCB Layout Code Commande Prix Unitaire Chlorure de fer 0,5kg (1litre) 141-311 g8,44 2,5kg (5 litres) 149-080 g23,05 Suractivé Liquide (5l) 413-8697 g21,20 Traitement chimique pour PCB Poudre crystaux fins pour 5l de traitement 320-5022 g38,31 Révélateur 1l pour 5l de traitement 320-4996 g27,04 Détachant 1,0kg 769-897 g24,16 • Gravure les PCBs en moins de 90 secondes • Format de la carte 10" x 12" (254 x 305mm) • Contrôle de la température numérique • Commande de la temporisation numérique • Réservoir spray nettoyant intégré • Trémie d’éclaboussure intégré • Réservoir 5 litres avec capteur de niveau • Drainage par le fond - pas de syphon • Unité de Base option Adaptateur CMS - MSOP * AutoPlacer * EMC Analysis * Frontpanel engraving tool Granulés de chlorure ferrique • Adaptateur pour 1 x MSOP-8 / 1 x MSOP-10 Le réservoir de traitement est conçu pour de multitâches de la petite carte jusqu’à un panneau de 10" x 12" max. Panneau transparant pour une visibilté de la carte après traitement sans retirer du résoir. Arrêt du moteur en cas d’ouverture du capot durant le gravure. L’unté de Base optionnel est placé en haut du réservoir de tratement à une hauteur de 110cm pour un travail plus efficace. • Logiciel pour schéma de connexions et platines spécialement pour développeurs • Schéma de connexion, simulation en mode mixte, layout et analyse CEM avec autorouter et outil pour plaques frontales dans un programme • Toutes les fonctions se basent sur un fichier de projet • Graphique vectoriel avec résolution de 1 nm • 50 pas en retour/en répétition (Undo/Redo) • Chargement de projets de Protel* et Eagle*, enregistrement de listes réseau en formats OrCAD*, Multiwire et Mentor*, en formats TARGET-ASCII et Gerber* • Enregistrement des Bitmaps (logos des entreprises, etc.) • Gestion des variantes de layout • Circuit multicouche avec passages borgnes et noyés • Technologie BGAs et COB supportée • Designs starr-flex possibles • Fraisage de l’isolation • Version sur toutes les imprimantes Windows, en Gerber*, XGerber*, Excellon*, S&M, DXF, PostScript* et TARGET-ASCII (*Protel, Eagle, OrCAD, Gerber, Excellon et PostScript sont des marques de fabriques déposées par les concessionnaires respectifs) • Nouvel autorouter hybride • Fixer les prestations nécessaires • Générer des points de test • Arrêt de soudure/pâte de soudure applicable individuellement par Pad/DuKo • Assistant de sélection (sélection d’éléments avec des caractéristiques déterminées) • Export Eagle • Liste des 20 derniers composants utilisés • Bibliothèques de composants et de modèles remaniées • DRC en ligne (design-rule-check) • Format d’exportation *.idf pour le transfert des programmes de construction en CAD 3D • Concepteur de la plaque frontale Machine à graver/développer Exigences du système: • Systeme d’exploitation Windows 98/ME/NT4/2000/XP/VISTA • Processeur AMD Athlon ou Intel Pentium III • Mémoire vive 64 MB • Graphique Résolution minimale 1024 x 768 pixels et 256 couleurs • Lecteur CD-ROM • Accès Internet Nécessaire pour quelques fonctions: mise à jour de programme, mise à jour de bibliothèque, bibliothèque en ligne, fiches techniques, données supplémentaires de fournisseurs etc. Description Code Commande Prix Unitaire Réservoir de traitement 120-1824● L g1337,03 Unité de base 440-2455 g112,64 L Article lourd (≈29kg), condition de livraison spéciales Version light: 400 broches/pastilles et vias, 2 couches cuivre maximum, simulation avec 30 signaux analogiques et numériques Version smart: 700 broches/pastilles et vias, 2 couches cuivre maximum, simulation avec 50 signaux analogiques et numériques Version economy: 1.000 broches/pastilles et vias, 4 couches cuivre maximum, simulation avec 75 signaux analogiques et numériques Version professional: Nombres de broches/pastilles et vias illimitées, 100 couches cuivre maximum, simulation avec 100 signaux analogiques et numériques Version design station: Nombres de broches/pastilles/vias et signaux illimités, 100 couches cuivre maximum Réf. Fab. Code Commande Prix Unitaire Version light F13_LIG 142-5147 g49,60 Version smart F13_SMA 142-5148 g115,00 Version economy F13_ECO 142-5149 g410,00 Version professional F13_PRO 142-5150 g1187,00 Version design station F13_DS 142-5151 g2160,00 Target 3001! RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Prototypage 49 Test et Puissance Seulement g24,46 CODE COMMANDE117-2126● • Pas 1,27 mm • fibre de verre époxyde FR4 1,50 mm, double face 35 μm CU (entiérement métallisées) • côté de soudure et des composants avec une surface d’or chimique et pourvus d’un masque d’arrêt de soudure • perforation Ø 1.00 mm • Circuit souple • Isolant 50μ - cuivre 35μ • Côté composant avec masquage d’arrêt de soudure • 4 rangée de points de soudure de 2 x 18 pôles, grille standard 2.54 mm, trou 1.00 mm Ø • Taille 57,2 x 57,2 mm • Adapteur pour 10 SO différents • Support de montage avec autocollant (épaisseur 0.8 mm), fabriqué en mousse de polyuréthane et colle acrylique doubleface (UL-listed Card File MH 16770) • Epaisseur du PCB 1.6 mm • Trou Ø 3.2 mm • Matériau: polyamide 6.6, 7 RMS-01 UL94 V-2 carte jaune E41938 • Résine époxyde FR4 1.50 mm double-côté, 35 μm CU (pth) • points destinés à la rupture pour séparer des modules de la platine • dimensions 58 x 88.00 mm Format Nbre de face Présensibilisé Réf. Fab. Code Commande Prix Unitaire 600x100 1 No AN10 126-7756● g27,05 500x100 2 No AN210 126-7757● g48,00 Réf. Fab. Code Commande Prix Unitaire 06.21.807 146-6932● g0,41 06.21.809 146-6933● g0,42 06.21.812 146-6934● g0,44 06.21.815 146-6935● g0,45 • Matériau NI/AU • 2 empreintes QFP universelles pour une variété de boîtier et brochage: LQFP; PQFP, TQFP – Couche 1: 24 - 144 pins, pas 0.50 mm – Couche 2: 24 - 144 pins, pas 0.65 mm. Circuit souple • Support de montage avec autocollant (épaisseur 0,8 mm) fait de mousse de polyuréthane et colle acrylique double-face (UL-listed Card File MH 16770) • Epaisseur de PCB 1.6 mm • Trou Ø 3.2 mm • Matériau: polyamide 6.6, 7 RMS-01 UL94 V-2 carte jaune E41938 Réf. Fab. Code Commande Prix Unitaire RE932 117-2131● g18,03 Boîtier SO 8 RE932-01 142-6169● g4,48 SO 8w RE932-02 142-6170● g4,48 SO 14 RE932-03 142-6171● g4,48 SO 16 RE932-04 142-6172● g4,48 SO 16w RE932-05 142-6173● g4,48 SO 20 w RE932-06 142-6174● g4,48 SO 24 w RE932-07 142-6176● g4,48 SO 28 w RE932-08 142-6177● g4,48 SO 32 RE932-09 142-6178● g4,48 SOJ 40 RE932-10 142-6179● g4,48 Réf. Fab. L. A (mm) Code Commande Prix Unitaire 06.02.046 4.8 146-6886● g0,169 06.02.066 6.4 146-6887● g0,169 06.02.096 9.5 146-6888● g0,169 06.02.126 12.7 146-6889● g0,230 06.02.156 15.9 146-6890● g0,230 06.02.196 19.1 146-6891● g0,260 06.02.256 25.4 146-6892● g0,330 06.02.346 34.9 146-6893● g0,390 Pas (mm) mil Nbre de broches Taille (mm) Pas (mm) mil Nbre de broches Taille (mm) 1.27 0.5 8 3.9 (153 mil) 1.27 0.5 20 - w 7.5 (295 mil) 1.27 0.5 8 - w 7.5 (295 mil) 1.27 0.5 24 - w 7.5 (295 mil) 1.27 0.5 14 3.9 (153 mil) 1.27 0.5 28 - w 7.5 (295 mil) 1.27 0.5 16 3.9 (153 mil) 1.27 0.5 32 7.5 (295 mil) 1.27 0.5 16 - w 7.5 (295 mil) 1.27 0.5 40 (SOJ) 10.16 (400 mil) Multi-adaptateur QFP 144 L. A Code L. A Code en mm Réf. Fab. Commande en mm Réf. Fab. Commande 7.9 06.21.807 146-6932 12.7 06.21.812 146-6934 9.5 06.21.809 146-6933 15.9 06.21.815 146-6935 Multiadaptateur CMS - Description LCBS Description LCBS Epaisseur de PCB 1.6 Trou de plaque de montage 4.8 Trou alésage PCB 4.0 Classe inflammabilité UL94V-2 Epaisseur de la plaque de montage 1.6 Entretoise, support SO / SOJ autocollant Entretoise, support de carte LCBS 4,8 􀁉􀁜􀁪􀁫􀁜􀁱 􀁥􀁥􀁜􀁚􀁫􀂄􀀗􀀘 􀁘􀁭􀁜􀁚􀀗􀀽􀁘􀁩􀁥􀁜􀁣􀁣 Notre gamme de plus de 27 000 connecteurs disponibles sur stock pour une livraison le lendemain vous offre le plus large choix pour vos applications. Et pour mieux répondre à vos besoins, nous avons ajouté plus de 3500 références à notre gamme sur les 12 derniers mois, ainsi que 15 000 connecteurs assemblés conformes aux spécifications militaires. En choisissant Farnell, vous accédez facilement à plus de 70 fabricants leaders sur le marché de la connectique. Utilisez le guide de sélection ci-dessous pour identifier les produits adaptés à vos applications ou découvrez notre guide de sélection en ligne, simple d’utilisation, sur www.farnell.com et consultez notre gamme complète. Solutions complètes de connectivité chez Farnell 1 Connecteurs de carte 2 Connecteurs Entrée/Sortie 3 Connecteurs de puissance 4 Borniers et barrettes de connexion 5 Cosses 6 Connecteurs coaxiaux 7 Connecteurs pour câble flexible/en nappe 8 Connecteurs Fibre optique 9 Connecteurs carte mémoire & Supports 16 pages de sélection sur notre offre phare en connectique Image utilisée avec la permission de Tyco Electronics Corporation. Copyright 2006-2007 Tyco Electronics Corporation. Tous droits réservés. RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Connecteurs industriels 51 Restez Connecté ! Courant 22A Nbre de cycles d’accouplement 500 Tension 250V Résistance d’isolement 1010Ω Gamme de températures -40°C à + 125°C Couleur Gris Courant 22A Tension 250V Gamme de températures -40°C à + 125°C Nbre de cycles d’accouplement 500 Résistance d’isolement 1010Ω Couleur Gris Description Fil De Glande Réf. Fab. Code Commande Prix Unitaire Capot, plastique, entrée supérieure avec adaptateur PG11 1-1102416-7 131-740● g3,39 Capot, métal, entrée supérieure avec adaptateur PG11 1-1102101-7 131-763● g3,29 Capot, métal, entrée latérale avec adaptateur PG11 1-1102103-7 131-775● g4,36 Capot, plastique, câble à câble PG11 1-1102424-2 131-866● g4,72 Capot, métallique, câble à câble PG11 1-1102112-2 131-878● g4,48 Capot, métal, entrée supérieure M16 1106405-1 135-5226● g3,72 Capot, métal, entrée latérale M16 1106406-1 135-5228● g4,97 Capot, plastique, entrée supérieure M16 1106402-2 135-5234● g33,56 Capot, métallique, câble à câble M16 1106403-1 135-5230● g5,21 Capot, métal, entrée latérale M20 1106406-3 135-5229● g5,96 Capot, plastique, entrée supérieure M20 1102856-1 135-5231● g4,53 Capot, plastique, entrée latérale M20 1102858-1 135-5232● g4,89 Capot, plastique, câble à câble M20 1102862-1 135-5233● g5,38 Capot, métal, entrée supérieure M20 1106405-3 135-5227● g4,33 Inserts Filetage Réf. Fab. Code Commande Prix Unitaire PG16 Entrée latérale, Métal 1663810000 136-1593● g5,90 PG16 Entrée sur le dessus, Métal 1663930000 136-1595● g6,50 M20 Entrée latérale, Métal 1788860000 136-1601● g13,00 M20 Entrée sur le dessus, Métal 1788620000 136-1602● g6,50 N/A Couvercle, Métal 1665890000 136-1599● g15,60 Capots Description Fil De Glande Réf. Fab. Code Commande Prix Unitaire Embase, plastique, coudé 90°, entrée inférieure N/A 1-1102420-2 131-910● g6,08 Embase, plastique, droit, entrée inférieure N/A 1-1102419-2 131-921● g3,25 Embase, métallique, coudé 90°, entrée inférieure N/A 1-1102107-2 131-933● g5,50 Embase, métallique, droit, entrée inférieure N/A 1-1102105-2 131-945● g3,29 Embase, métallique, droit, entrée inférieure N/A 4-1102703-5 135-5237● g50,46 Embase, métallique, coudé 90°, entrée inférieure N/A 4-1102702-5 135-5238● g40,61 Embase, métallique, entrée latérale avec adaptateur PG11 1-1102109-2 131-994● g8,71 Embase, métallique, entrée latérale M16 1106401-2 135-5239● g39,09 Embase, plastique, entrée latérale M20 1102860-1 135-5236● g11,10 Filetage Réf. Fab. Code Commande Prix Unitaire A écrou PG16 Entrée sur le dessus, Plastique avec douilles 1664170000 136-1597● g10,70 M20 Entrée sur le dessus, Métal avec douilles 1901100000 136-1603● g11,30 Base N/A Métal 1664040000 136-1596● g6,60 N/A Métal, Couvercle pour bases de boîtiers 1665880000 136-1598● g12,60 Description Réf. Fab. Code Commande Prix Unitaire Cache anti-poussière métallique 2-1106205-7 132-032● g3,03 Kit serre-câble 1-1106004-9 355-1532● g1,33 Capot de protection métallique 4-1106200-5 135-5240● g23,89 Inserts Boîtiers Rockstar Taille 1 Capots HTS Taille 1 Boîtiers Un minimum d’espace de 40mm x 28mm pour les embases entrée inférieure. Rockstar Taille 2 Inserts Capots Embases Nbre de Voies Réf. Fab. Code Commande Prix Unitaire 3 Insert Mâle HA 1498100000 136-1573● g6,20 3 Insert Femelle HA 1498200000 136-1572● g6,60 4 Insert Mâle HA 1498300000 136-1575● g7,00 4 Insert Femelle HA 1498400000 136-1574● g7,50 Filetage Réf. Fab. Code Commande Prix Unitaire PG11 Entrée latérale, Plastique 1652400000 136-1576● g3,10 PG11 Entrée latérale, Métal 1652480000 136-1577● g4,80 M20 Entrée latérale, Plastique 1788510000 136-1585● g3,10 M20 Entrée latérale, Métal 1788810000 136-1586● g4,80 PG11 Entrée sur le dessus, Plastique 1652380000 136-1578● g2,60 PG11 Entrée sur le dessus, Métal 1652470000 136-1579● g2,80 M20 Entrée sur le dessus, Plastique 1788520000 136-1587● g2,60 M20 Entrée sur le dessus, Métal 1788820000 136-1588● g2,80 Nbre de Voies Réf. Fab. Code Commande Prix Unitaire 10 Insert Femelle HA 1650610000 136-1592● g8,60 10 Insert Mâle HA 1650620000 136-1591● g9,30 Accesssoires Description Réf. Fab. Code Commande Prix Unitaire Insert mâle HA, terminaison à vis - 3 voies+T 1-1103400-1 131-647● g6,54 Insert femelle HA, terminaison à vis - 3 voies+T 1-1103401-1 131-696● g7,33 Insert mâle HA, terminaison à vis - 4 voies+T 1-1103402-1 152-780● g7,91 Insert femelle HA, terminaison à vis - 4 voies+T 1-1103403-1 152-791● g8,49 Insert femelle HA, terminaison à vis - 4 voies+T 1102195-1 135-5217● g6,08 Insert femelle HA, terminaison à vis - 4 voies+T 1102194-1 135-5218● g6,38 Insert femelle HA, terminaison à vis - 4 voies+T 2-1103100-3 135-5219● g6,69 Insert femelle HA, terminaison à vis - 4 voies+T 2-1103103-3 135-5220● g6,99 Insert femelle HA, terminaison à vis - 4 voies+T 2-1103102-3 135-5221● g6,69 Insert femelle HA, terminaison à vis - 4 voies+T 2-1103103-3 135-5222● g6,99 Insert mâle HA, contacts à sertir - 7 voies+T 2-1103002-3 133-115● g4,33 Insert femelle HA, contacts à sertir - 7 voies+T 2-1103003-3 133-127● g7,44 Insert mâle HA, contacts à sertir - 7 voies+T 2-1103104-3 135-5224● g7,33 Insert femelle HA, contacts à sertir - 7 voies+T 2-1103105-3 135-5225● g7,63 Filetage Réf. Fab. Code Commande Prix Unitaire A écrou PG11 Entrée sur le dessus, Plastique avec douille 1652440000 136-1583● g7,10 PG11 Entrée sur le dessus, Métal avec douille 1652490000 136-1584● g8,30 M20 Entrée sur le dessus, Plastique avec douille 1788530000 136-1589● g7,10 M20 Entrée sur le dessus, Métal avec douille 1788830000 136-1590● g8,30 Base N/A Plastique 1652410000 136-1580● g2,60 N/A Métal 1497600000 136-1581● g3,50 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Connecteurs industriels 52 Restez Connecté ! Capot sortie latérale avec insert mâle Capot sortie latérale avec insert mâle Capot sortie verticale avec insert mâle Capot sortie verticale avec insert mâle Embase encastrée droite avec insert femelle Embase encastrée droite avec insert femelle Capot prolongateur avec insert femelle Embase encastrée coudée avec insert femelle Capot prolongateur avec insert femelle Embase encastrée coudée avec insert femelle Courant nominal 10A Tension nominale 600V CA Terminaison A visser Résistance de contact 1mΩ Gamme de température -40°C à 125°C • Kits partiels de connecteurs type HAN A 3 et 4 voies • Terminaison à visser • Boîtiers plastiques • Les kits contiennent le boîtier du connecteur et l’insert Note: Le presse-étoupe n’est pas inclus dans le kit. Gland Filetage Code Commande Prix Unitaire Capots avec insert mâle 3 voies, sortie latérale M20 963-7176● g12,06 3 voies, sortie verticale M20 963-7168● g9,50 4 voies, sortie latérale M20 963-7192● g9,90 4 voies, sortie verticale M20 963-7184● g12,35 Embases encastrées droites avec insert femelle 3 voies N/A 963-7206● g11,21 4 voies N/A 963-7222● g11,28 Embases encastrées coudées avec insert femelle 3 voies N/A 963-7214● g12,99 4 voies N/A 963-7230● g13,13 Capot prolongateur avec insert femelle 3 voies - PG11 M20 963-7249● g12,53 4 voies - PG11 M20 963-7257● g12,24 Courant nominal 10A Tension nominale 600V CA Terminaison A visser Résistance de contact 1mΩ Gamme de température -40°C à 125°C Kits d’embases et de capots métalliques HAN 3A, HAN 4A Gland Filetage Code Commande Prix Unitaire Capots avec insert mâle 3 voies, sortie latérale M20 963-7079● g9,43 3 voies, sortie verticale M20 963-7060● g9,15 4 voies, sortie latérale M20 963-7095● g9,86 4 voies, sortie verticale M20 963-7087● g9,58 Embases encastrées droites avec insert femelle 3 voies N/A 963-7109● g10,18 4 voies N/A 963-7125● g10,20 Embases encastrées coudées avec insert femelle 3 voies N/A 963-7117● g13,64 4 voies N/A 963-7133● g13,61 Capot prolongateur avec insert femelle 3 voies, plastique M20 963-7141● g10,66 4 voies, plastique M20 963-7150● g10,74 • Kits partiels de connecteurs type HAN A 3 et 4 voies • Terminaison à visser • Boîtiers métalliques • Les kits contiennent le boîtier du connecteur et l’insert Note: Le presse-étoupe n’est pas inclus dans le kit. Kits d’embases et de capots plastiques HAN 3A, HAN 4A RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Borniers et Blocs de jonction 53 Restez Connecté ! Tension maximum 300V Intensité nominale 10A Gamme de température -40°C à +105°C Taille de fil maximum 1.5mm² Boîtier Polyamide 66 Couleur Vert Nbre de Voies Code Commande Prix Unitaire Nbre de Voies Code Commande Prix Unitaire Fiche mâle coudé 6 voies 136-0305● g1,05 2 voies 136-0293● g0,93 8 voies 136-0306● g1,31 3 voies 136-0294● g1,25 10 voies 136-0307● g1,56 4 voies 136-0295● g1,51 12 voies 136-0308● g1,83 5 voies 136-0296● g1,83 Embase mâle verticale 6 voies 136-0297● g2,09 2 voies 136-0311● g0,57 8 voies 136-0298● g2,71 3 voies 136-0312● g0,69 10 voies 136-0299● g3,27 4 voies 136-0313● g0,78 12 voies 136-0300● g3,84 5 voies 136-0314● g0,93 Embase mâle entrée latérale 6 voies 136-0315● g1,05 2 voies 136-0301● g0,57 8 voies 136-0316● g1,31 3 voies 136-0302● g0,69 10 voies 136-0317● g1,56 4 voies 136-0303● g0,78 12 voies 136-0318● g1,83 5 voies 136-0304● g0,93 Nbre de Voies Code Commande Prix Unitaire Nbre de Voies Code Commande Prix Unitaire Fiche mâle coudé 6 voies 136-0251● g0,99 2 voies 136-0238● g0,84 8 voies 136-0252● g1,25 3 voies 136-0239● g1,05 10 voies 136-0253● g1,47 4 voies 136-0240● g1,31 12 voies 136-0254● g1,71 5 voies 136-0241● g1,51 Embase mâle verticale 6 voies 136-0242● g1,77 2 voies 136-0256● g0,53 8 voies 136-0244● g2,25 3 voies 136-0257● g0,63 10 voies 136-0245● g2,71 4 voies 136-0258● g0,78 12 voies 136-0246● g3,18 5 voies 136-0259● g0,89 Embase mâle entrée latérale 6 voies 136-0260● g0,99 2 voies 136-0247● g0,53 8 voies 136-0261● g1,25 3 voies 136-0248● g0,63 10 voies 136-0262● g1,47 4 voies 136-0249● g0,78 12 voies 136-0263● g1,71 5 voies 136-0250● g0,89 Fiches mâles verrouillables pour bloc de connexion Fiches mâles verrouillables pour bloc de connexion Pas de 5.08mm • Embases mâles et fiches mâles disponibles • Pas de 5.08mm • Approuvés : UL, CE et VDE Pas de 3.50mm • Embases mâles et fiches mâles disponibles • Pas de 3.50mm • Approuvé : UL, CE et VDE Tension nominale (VDE) 125V c.a. (Group C) Contact Alliage cuivre étamé 250V c.a. (Group B) Boîtier PBT Intensité nominale 10A Couleur Orange Gamme de températures -20°C à +100°C Section conducteur 0.5-1.5mm² Vis Acier zingué Tension maximum 300V Intensité nominale 16A Gamme de température -40°C à +105°C Taille de fil maximum 4mm² Boîtier Polyamide 66 Couleur Vert Fiches et embases 10A - Pas 3.5mm Nbre de voies Code Commande Prix Unitaire Nbre de voies Code Commande Prix Unitaire Nbre de voies Code Commande Prix Unitaire Fiche libre série BL 6 117-9255● g5,050 Embase CI droite - Fermée 2 113-1800● g1,050 8 117-9256● g6,550 2 112-1785● g0,357 3 113-1802● g1,600 10 117-9248● g8,150 3 112-1788● g0,536 4 113-1803● g2,100 12 117-9249● g9,800 4 112-1792● g0,704 5 113-1804● g2,650 16 112-1767● g11,000 5 112-1794● g0,882 6 113-1805● g3,200 Embase CI coudée - Fermée 6 112-1797● g1,050 8 113-1806● g4,150 2 112-1786● g0,357 8 112-1800● g1,450 10 113-1807● g5,250 3 112-1791● g0,536 10 112-1776● g2,250 12 113-1808● g6,250 4 112-1793● g0,704 12 112-1779● g2,750 14 113-1809● g7,300 5 112-1795● g0,882 14 112-1781● g3,300 16 113-1810● g8,250 6 112-1798● g1,050 16 112-1783● g2,850 Fiche libre série BLZF 8 112-1801● g1,450 Embase 135° avec fixations 2 117-9250● g1,850 10 112-1778● g2,300 3 112-1787● g0,938 3 117-9252● g2,550 12 112-1780● g2,750 6 112-1796● g1,550 4 117-9253● g4,750 14 112-1782● g3,300 8 112-1799● g2,050 5 117-9254● g4,200 16 112-1784● g2,850 10 112-1775● g2,600 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Borniers et Blocs de jonction 54 Restez Connecté ! Blocs de jonction Seulement g9,93 CODE COMMANDE152-1777● Seulement g12,39 CODE COMMANDE152-1774● Seulement g18,54 CODE COMMANDE152-1773● * Précédemment EN 60335 ** Température constante. Borniers testés à +30° C au-dessus de cette valeur Tension nominale 250V ac Courant nominal 32A IP IP68 Gamme de température 0°C à 125°C Matériel du boîtier Nylon (PA66) Inflammabilité UL94V2 Tension nominal 400V ac Courant nominal 16A IP IP67 Gamme de température 0°C à 125°C Boîtier PA66 Inflammabilité UL94V2 Nbre de Pôles Réf. Fab. Code Commande Prix Unitaire 6 THR.209.S6D 152-1772● g21,61 8 THR.209.S8L 152-1771● g23,10 Boîtier Nylon 6 blanc UL94V-2 Vis Acier, plaqué zinc et passivé Tension d’exploitation 450V c.a. Contacts Laiton plaqué nickel Protecteurs de fils Acier inoxydable Plage de température -5°C à +125°C Tension nominal 250V ac Courant nominal 4A IP IP68 Gamme de température 0°C à 100°C Diamètre de câble accepté 9.5 - 12mm Boîtier Nylon 66 Inflammabilité UL94V2 Tension nominal 250V ac Courant nominal 16A IP IP68 Gamme de température 0°C à 100°C Boîtier PA66 Inflammabilité UL94V2 Bloc de Jonction Section max. de fil Largeur Longueur Hauteur Pas Ø de Troude Fixation Code Intensité mm2 mm mm mm mm mm Commande Prix Unitaire 17.5A 1.5 15 93.5 15.2 8 2.6 121-1490● g1,56 24A 2.5 20 117 17.5 10 3.2 120-6595● g1,67 32A 4 23 139 20.7 12 3.2 121-1491● g2,31 57A 6 25.3 175 25.5 15 4.2 121-1492● g3,88 3 Pôles Connecteur pour câble miniature Connecteur de câble T Splitter Nylon 12 voies, 6, 10 et 16A Bloc de Jonction 4 Ports • Diamètre de câble de 9.5mm à 12mm • Vendu en kit complet • Conforme aux exigences CE et approuvés IMQ et NEMKO • Diamètre de câble de 5mm à 14mm • Vendu en kit complet • Convient pour les distributions de puissance exterieures • Approuvés CE IMQ et NEMO • Corps en polyamide 6 avec socle relevé • Approuvé UL, CSA, CEBEC, IMQ, OVE, KEMA, NEMKO, SEMKO, SEV et VDE à 380V c.a. 3 Pôles 3 Pôles • Diamètre de câble de 5mm à 13mm • Vendu en kit complet • Conforme aux exigences CE et approuvés IMQ et NEMKO Avec protecteurs de fils IP68 • Diamètre de câble de 4mm à 9.5mm • Vendu en kit complet • Conforme aux exigences CE et approuvés IMQ et NEMKO RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Borniers et Blocs de jonction 55 Restez Connecté ! 12 voies 15A, 20A et 43A Nbre de voies Code Commande Prix Unitaire Fusible 5 x 20mm - 10A 1 113-4203● g0,90 3 113-4205● g1,29 Fusible 6.35 x 25/32 - 16A 1 113-4207● g1,09 3 113-4208● g1,29 with Standoffs Seulement g4,27 CODE COMMANDE117-8400● • Blocs de connexion à verrouillage 16A, montage sur chassis • Chaque bloc contient 6 lames 20mm 1"/11⁄4" Nbre de voies 1 3 1 3 Hauteur 27.5 27.5 32 32 Largeur 14.5 30 19 36 Profondeur 27 27 39 39 Ø trou de fixation 2.1 3.1 3.6 3.6 Vis de terre M3 x 12 M3.5 x 12 Tension max. d’exploitation 380V c.a. Intensité 16A Température maximale 120°C Boîtier Nylon blanc 66 Terminaisons à vis Entraînement direct M4 Current Fixing Code Rating Height Width Length Pitch Centres Dia Réf. Fab. Commande Prix Unitaire 15A 13.9 15.9 95.3 7.9 11.1x7.9 2.4 L1350/NI 942-7040● g10,16 20A 15.9 19.1 127 10.8 14.3x10.8 2.4 L744/NI 942-7058● g11,20 43A 23.8 26.2 181.4 15.1 19.5x15.1 4 L1325/NI 942-7066● g23,66 Pas et entraxe fixations=10 Ø trou de fixation=3.25, Longueur broche=9 Code Commande Prix Unitaire Six lames 121-1488● g0,87 3 Cosses/ 1 Vis 120-6593● g0,97 (1 nécessaire par bloc) 120-6594● g0,62 Tension max. d’exploitation 250V c.a. Boîtier Nylon 66 Intensité Couleur Gris (boîtier) Type 20mm 10A Noir (porte-fusible) Type 25,4/31,8mm Porte-fusible 13A Contacts de fusible acier inoxidable Bornes 16A Vis à terre M3 x 6 (type de 20mm) M3.5 x 7(type 25.4/31.8mm Gamme de températures -40°C à +100°C Section max. de câble 4mm² Tension de Service max. 380V c.a. Intensité 10A Gamme de températures -60°C à +110°C Isolant Nylon blanc 6.6, UL94V-2 Contacts Laiton, Nickel Vis M3 Acier zingué Section conducteur max. 2.5mm² Bornes pour cosses faston - 16A A verrouillage, fusibles 20mm ou 25/32mm Borniers mâle et femelle, 12 voies 10A 121-1488 • Blocs de connexion à verrouillage avec porte-fusible • Equipés d’une vis de montage à l’arrière, filetée à travers la borne de terre • Approuvés VDE, et SEMKO et SEV pour les versions 20mm • Bornier mâle et femelle en Nylon 6.6 avec base surélevée. • Permet de déconnecter rapidement un ensemble de conducteurs. • Conforme UL. 120-6593 120-6594 H = 29.5 , l = 20.2 , P = 38 (par module), Trous de fixation = 3.5 Ø x pas de 11.3 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Connecteurs fil à fil 56 Restez Connecté ! Boîtier mâle Boîtier mâle 143-207 Boîtier fiche mâle Boîtier femelle Montage libre ou panneau Epaisseur panneau = 0.76-2.29 Boîtier femelle 143-208 Boîtier fiche femelle Embase CI Ø trou CI = 1.8 Pas = 6.35 Quantité Paquet Code Commande Prix Par Paquet Mâle 100 977-3843● g14,25 1000 973-1547● g192,71 Femelle 100 977-3835● g23,97 1000 973-1555● g196,82 Embase 143-211 Boîtier fiche mâle Code Commande Code Commande Description Réf. Tech. Réf. Fab. (paquet de 100) (paquet de 1000) Mâle 1376ATL 02-09-2134.(PACK 100) 977-3843 973-1547 Femelle 1377ATL 02-09-2134 973-1555 977-3835 143-212 Boîtier fiche femelle Contacts CI pour connecteurs 2,36mm 143-203 Boîtier mâle • Corps moulé blanc opaque conforme UL94V-0 Ø de trou PCB = 1.58 (Par multiple de=5) Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Boîtiers Mâles - Acceptent des Contacts mâle ou femelles 2 1-480698-0 285-146● g0,44 3 1-480700-0 285-158● g0,62 4 1-480702-0 285-160● g0,56 5 1-480763-0 285-171● g0,86 6 1-480704-0. g0,56 9 1-480706-0 285-195● g0,73 12 1-480708-0 285-201● g0,81 15 1-480710-0 285-213● g0,94 Boîtiers Femelles - Acceptent des Contacts mâle ou femelles 2 1-480699-0 285-225● g0,44 3 1-480701-0 285-237● g0,64 4 1-480703-0 285-249● g0,56 5 1-480764-0 285-250● g0,84 6 1-480705-0 285-262● g0,56 9 1-480707-0 285-274● g0,73 12 1-480709-0 285-286● g0,81 15 1-480711-0 285-298● g0,94 Embases CI Mâles 2 350428-1 285-304● g0,62 3 350429-1 285-316● g0,83 4 350430-1 285-328● g1,04 5 640466-1 285-330● g1,67 6 350431-1 285-341● g1,04 9 350432-1 285-353● g1,54 12 350433-1 285-365● g2,00 15 350434-1 285-377● g2,33 Mâle (Par multiple de 5) (Par multiple de 5) Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Boîtiers Mâles - Acceptent les contacts à douille ou à broche 6 350781-1 750-190● g0,82 2 350777-1 750-074● g0,42 9 350782-1 750-207● g0,84 3 350766-1 750-086● g0,59 12 350783-1 750-219● g2,24 4 350779-1 750-098● g0,56 15 350784-1 750-220● g3,55 5 350809-1 750-104● g0,91 Embases montées avec des contacts à broche 6 350715-1 750-116● g0,87 2 350786-1 750-232● g0,74 9 350720-1 750-128● g2,02 3 350789-1 750-244● g0,85 12 350735-1 750-130● g2,13 4 350792-1 750-256● g1,27 15 350736-1 750-141● g1,52 5 640900-1 750-268● g1,78 Boîtiers Femelles - Acceptent les contacts à douille ou à broche 6 350711-1 750-270● g1,87 2 350778-1 750-153● g0,48 9 350712-1 750-281● g2,02 3 350767-1 750-165● g0,70 12 350713-1 750-293● g1,96 4 350780-1 750-177● g0,62 15 350714-1 750-300● g2,31 5 350810-1 750-189● g1,02 Boîtiers et embases CI Femelle Version européenne Connecteurs standard pour des applications allant des appareils ménagers aux ordinateurs Moulés en Nylon 6.6 Fiches mâles et femelles reçoivent des cosses serties mâles ou femelles Connecteurs avec oeillets intégralement moulés pour montage en panneau et verrou anti-friction Les connecteurs 12 et 15 voies ne sont pas munis d’ergot de blocage Polarisation garantie par la conception des fiches Homologués UL et certifiés CSA Max 12A (Par Multiple de 3) Intensité maximale Montage Ø Nbre de voies Boîtier Description Par Circuit de trou (mm) Nbre de Réf. Réf. Fab. Code Commande Prix Unitaire 1 Fiche Boîtier prise femelle 1 voie1 way plug housing 12A — 1619R (03-09-2011) 973-1482● g0,156 1 Fiche femelle Boîtier fiche mâle 3 voiesBoîtier fiche femelle 1 voie 12A 23,70 x 9,52 1396P (03-09-1011) 973-1490● g0,156 3 Fiche mâle Boîtier prise femelle 3 voiesBoîtier fiche mâle 3 voies 12A 21,34 x 7,92 1396R (03-09-2031) 143-205● g0,359 3 Fiche femelle Boîtier fiche mâle 4 voiesBoîtier fiche femelle 3 voies 12A 28,73 x 9,53 1490P (03-09-1031) 143-206● g0,270 4 Fiche mâle Boîtier prise femelle 4 voiesBoîtier fiche mâle 4 voies 9A 26,37 x 7,92 1490R (03-09-2041) 143-207● g0,468 4 Fiche femelle Boîtier fiche mâle 6 voiesBoîtier fiche femelle 4 voies 9A 19,05 x 17,65 1261P (03-09-1041) 143-208● g0,442 6 Fiche mâle Boîtier prise femelle 6 voiesBoîtier fiche mâle 6 voies 9A 18,24 x 15,24 1261R (03-09-2061) 143-209● g0,546 6 Fiche femelle Boîtier fiche mâle 9 voiesBoîtier fiche femelle 6 voies 9A 23,80 x 17,56 1292P (03-09-1061) 143-210● g0,516 9 Fiche mâle Boîtier prise femelle 9 voiesBoîtier fiche mâle 9 voies 9A 21,03 x 18,42 1292R (03-09-2091) 143-211● g0,676 9 Fiche femelle Boîtier fiche mâle 12 voiesBoîtier fiche femelle 9 voies 9A 29,34 x 19,30 1360P1 (03-09-1091) 143-212● g0,676 12 Fiche mâle Boîtier prise femelle 12 voiesBoîtier fiche mâle 12 voies 7.5A 26,67 x 16,64 1360R (03-09-2122) 143-213● g0,741 12 Fiche femelle Boîtier fiche mâle 15 voiesBoîtier fiche femelle 12 voies 7.5A 34,11 x 19,30 1375P4 (03-09-1121) 143-214● g0,650 15 Fiche mâle Boîtier prise femelle 15 voiesBoîtier fiche mâle 15 voies 7.5A 31,50 x 16,64 1375R (03-09-2159) 143-215● g1,500 15 Fiche femelle Boîtier fiche mâle 15 voiesBoîtier fiche femelle 15 voies 7.5A 34,11 x 19,30 1375P4 (03-09-1151) 143-216● g0,936 Connecteurs 2.36mm 1 Pôle 4 Pôles 9 Pôles RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Connecteurs fil à fil 57 Restez Connecté ! Réf. Fab. En-tête droit = 43045-XX12, 90° En-tête = 43045-XX00, Tension maximum 250V c.a. 12 voies 6A Courant maximum Tension d’essai 1500V c.a. 2 voies 9A Résistance de contact 10mΩ max. 4/6 voies 8A Boîtier Nylon clair 6/6, UL94V-2 8/10 voies 7A Contacts Laiton, plaqué Etain plated Connecteurs de puissance à sertir ’Mini-Fit Jr’ Tension 250V Taux de Courant 5A Gamme de température -40°C à +105°C Contact Bronze Phosphoreux Une gamme de connecteurs de puissance haute densité pour des applications fil à fil, carte à fil et fil à panneau. Ces connecteurs double rangée sont destinés aux interconnexions de puissance où l’espace est la principale contrainte. Un clic audible et la polarisation assurent une bonne connexion. Reconnus UL et certifiés CSA . (Par multiple de 10) Nb. de voies Code Commande Prix Unitaire Embase CI droite - Double rangée 2 973-3000● g0,933 4 101-2247● g1,300 6 101-2248● g1,700 8 101-2249● g2,000 10 101-2250● g2,350 Embase CI coudée - Double rangée 2 101-2251● g1,250 4 973-3019● g1,450 6 101-2252● g2,000 8 101-2254● g2,450 10 101-2255● g2,850 Nbre de Voies Longueur câble Réf. Fab. Code Commande Prix Unitaire 2 1 0795161021 139-1527● g4,56 2 3 0795161023 139-1528● g6,05 2 5 0795161025 139-1529● g7,92 4 1 0795161041 139-1530● g6,13 4 3 0795161043 139-1531● g9,30 4 5 0795161045 139-1532● g11,75 6 1 0795161061 139-1533● g7,40 6 3 0795161063 139-1534● g9,83 6 5 0795161065 139-1535● g12,69 10 1 0795161101 139-1536● g10,90 10 3 0795161103 139-1538● g15,38 10 5 0795161105 139-1539● g20,90 Embases CI mâles • Max 9A Micro-Fit • Boîtier entièrement polarisé • Verrouillage positif prévenant les accidents de disconnexion • Fermeture en bout de la terminaion sécurisant les terminaions dans le boîtier Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Connecteurs fil à fil 58 Restez Connecté ! Implantation CI (Sans les trous de fixation pour embase droite) Contact Mâle Contact Femelle Nbre de Voies Code Commande Prix Unitaire Nbre de Voies Code Commande Prix Unitaire Embases coudées 90° 3 996-3480● g0,52 3 996-3545● g1,46 4 996-3499● g0,58 4 996-3553● g0,73 5 996-3502● g0,60 5 996-3561● g0,84 Fiches mâles Embases droites 3 996-3510● g0,52 3 996-3570● g1,13 4 996-3529● g0,56 4 996-3588● g0,98 5 996-3537● g0,26 5 996-3596● g0,94 Mini-fit Jr Fiches Réf. Fab. Code Commande Prix Unitaire Pince à sertir 69008-0724 269-207 g277,63 Outils d’extraction11-03-0044 525-080 g26,80 Nbre de Voies Code Commande Prix Unitaire 2 996-3367● g0,98 4 996-3375● g1,60 6 996-3383● g1,99 8 996-3391● g2,41 10 996-3405● g2,80 12 996-3413● g3,20 14 996-3421● g3,61 16 996-3430● g1,80 18 996-3448● g1,99 20 996-3456● g2,71 22 996-3464● g2,43 24 996-3472● g2,65 Nbre de voies Code Commande Prix Unitaire Nbre de voies Code Commande Prix Unitaire 2 151-866● g0,236 8 307-5722● g2,450 4 151-867● g0,303 Fiches Femelles - Acceptent les Contacts Mâle 6 151-868● g0,382 2 151-872● g0,303 8 151-869● g0,404 4 151-873● g0,360 10 151-870● g0,427 6 151-874● g0,427 12 151-871● g0,517 8 151-875● g0,484 14 996-3243● g0,380 10 151-876● g0,541 16 413-8399● g0,551 12 151-877● g0,641 18 996-3251● g0,430 14 996-3278● g0,490 20 413-8405● g0,573 16 413-8429● g0,675 22 996-3260● g0,660 18 996-3286● g1,460 24 413-8417● g0,730 20 413-8430● g1,670 Serre-câbles – Pour Fiches Mâles 22 996-3294● g1,040 6 307-5710● g2,350 24 413-8442● g1,700 femelles, fiches mâles, embases coudées et embases droites Mini-fit Jr Fiches mâles et femelles Pince à sertir Mini-Fit Jr. Embases coudées 90° - Mini-fit Jr Réf. Fab. Fiche femelle = 390114xx0, Fiche mâle = 39014xx6, Embase droite = 39302xx5, Embase coudée = 39303xx5, où xx=Nbre de voies Réf. Fab. 39301xx0, où xx=Nbre de voies • Pince à sertir à cliquet avec barre de maintien de fermeture • Pour sertir les contacts Mini-Fit Junior, 5556 et 5558 (jauge 16-28) AWG • Livrée avec notice d’utilisation Réf. Fab. Fiche Libre=39-01-2xx0, Boîtier=39- 01-2xx1, où xx=Nbre de voies Nbre de voies Réf. Fab. Code Commande Prix Unitaire Embases droites - Contacts mâles 2 39-28-1023 973-2080● g0,495 4 39-28-1043 973-2098● g0,731 6 39-28-1063 973-2101● g0,900 8 39-28-1083 973-2110● g1,250 10 39-28-1103 973-2136● g1,450 12 39-28-1123 973-2144● g1,700 14 39281143 996-3308● g1,130 16 39281163 973-4244● g1,580 18 39281183 996-3316● g1,430 20 39281203 973-4252● g2,080 22 39281223 996-3324● g2,150 24 39281243 973-4260● g2,460 Embases coudées à 90° - Contacts mâles 2 39-29-1028 101-2166● g0,585 4 39-29-1048 973-2152● g0,833 6 39-29-1068 101-2167● g1,250 8 39-29-1088 973-2160● g1,550 10 39-29-1108 973-2179● g1,850 12 39-29-1128 973-2187● g2,200 14 39291148 996-3332● g2,060 16 39291168 973-4279● g2,450 18 39291188 996-3340● g2,590 20 39291208 973-4287● g2,550 24 39291248 973-4295● g3,650 100 Par Paquet Jauge fil Section fil Code Prix Par Jauge (mm2) Ø Isolant Réf. Fab. Commande Paquet Mâle 16 1.29 1.8-3.1 39-00-0082 973-2667● g23,51 Mâle 18-24 0.240.82 1.33.1 39-00-0041 101-2168● g21,17 Femelle 16 1.29 1.8-3.1 39-00-0078 973-2675● g25,14 Femelle 18-24 0.24-0.82 1.3-3.1 39-00-0039 973-2195● g16,93 Réf. Fab. 69008-0724=269-207, 11-03-0044(HT60630B)=525-080 Fiche mâle 151-868 • Ergots de maintien pour une rétention accrue sur le CI • Bas profil pour les containtes de place • Verrouillage positif • Contacts entièrement isolés pour une protection contre les éventuels dommages Contact à sertir Mini-Fit Jr. • Ergots de maintien pour une rétention accrue sur le CI • Bas profil pour les containtes de place • Verrouillage positif • Contacts entièrement isolés pour une protection contre les éventuels dommages • Compatibles avec les fiches femelles double rangée 5557 Embases pour CI droites 5566 et coudées à 90° 5569 Double rangée avec ergots de maintien Fiche femelle 151-877 Réf. Fab. Embase droite=39-28-1xx3, embase coudée 90°=39-29-1xx8, où xx=Nbre. de voies Outil d’ extraction Simple rangée avec ergots de maintien Embase coudée à 90° 151-886 Pince à sertir à rochet Embase droite 151-881 Tout sous le même toit G a m m e c o m p l è t e a l l a n t d e s connecteurs haut débit/ haute densité aux connecteurs industriels standard FCI, la référence en matière de connecteur Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Connecteurs circulaires 60 Restez Connecté ! Amphenol Bouchon Protecteur Nbre. Orien-Long- Code Prix Nbre. Orien-Long- Code Prix de voies tation ueur Commande Unitaire de voies tation ueur Commande Unitaire Argent Noir 7 A 1m 120-9047● g224,11 5 A 0.5m 120-9040● g206,27 7 A 3m 120-9049● g233,35 5 A 1m 120-9041● g208,58 7 B 0.5m 120-9051● g221,80 5 A 3m 120-9042● g217,79 7 B 1m 120-9052● g224,11 5 B 0.5m 120-9043● g206,27 7 B 3m 120-9053● g233,35 5 B 1m 120-9044● g208,58 Bouchon anti-poussière 5 B 3m 120-9045● g217,79 120-9086● g27,13 7 A 0.5m 120-9046● g221,80 Nbre. Code de Voies Orientation Commande Prix Unitaire Noir plaqué argent - Montage C.I. 5 A 120-9054● g28,17 5 B 120-9055● g28,17 7 A 120-9058● g26,28 7 B 120-9059● g26,28 Noir plaqué argent - Cosses à souder 5 A 120-9056● g26,94 5 B 120-9057● g26,94 7 A 120-9060● g25,47 7 B 120-9062● g25,47 Bouchon anti-poussière 120-9084● g18,06 Contacts Protection CEM Cordons Assemblés fiche mâle-fiche mâle Nbre. de voies Réf. Fab. Code Commande Prix Unitaire Terminaison à souder - Contacts plaqués argent 6+Terre C016 30G006 100 12 118-8969● g5,54 Terminaison à souder - Contacts plaqués or 6+Terre C016 30G006 200 12 118-8970● g7,85 Terminaison à sertir - Contacts vendus séparemment 6+Terre C016 10G006 000 12 118-8971● g4,11 Terminaison à visser - Contacts plaqués argent 3+Terre C016 20G003 100 12 118-8986● g7,02 Terminaison à visser - Contacts plaqués or 3+Terre C016 20G003 200 12 118-8988● g7,44 Corps Réf. Fab. Code Commande Prix Unitaire Embase panneau mâle C016 00U000 000 12 122-8715● g3,83 Embase panneau femelle C016 00V000 000 12 122-8718● g3,62 Fiche mâle C016 00U000 010 12 122-8714● g3,73 Fiche femelle C016 00V000 010 12 122-8716● g3,52 Système anti-traction avec bague de serrage Fiche femelle montage panneau - Avec contre-écrou Contact Dia. Fil mm2 Code Commande Prix Par Paquet de 10 Contacts des broches - Plaqué Argent 1.6 0.14-0.5 112-3499● g5,78 1.6 0.5-1.5 112-3501● g5,78 Contacts de la prise femelle - Plaqué Argent 1.6 0.14-0.5 112-3500● g2,90 1.6 0.5-1.5 112-3502● g5,78 Outil Outil de sertissage 379-1002 g264,63 Outil d’insertion 379-0988 g31,70 Couleur Réf. Fab. Code Commande Prix Par Paquet de 5 C016G11043E10V 152-0089● g5,68 C016G11046E10V 152-0091● g5,68 C016G11045E10V 152-0092● g5,68 C016G11042E10V 152-0093● g5,68 C016G11000E10V 152-0094● g5,68 Système anti-traction interne et bague de serrage Embase femelle, 3 et 6 voies + Terre Nbre. de voies Réf. Fab. Code Commande Prix Unitaire Terminaison à souder - Contacts plaqués argent 6+Terre C016 30H006 100 10 118-8939● g7,46 Terminaison à souder - Contacts plaqués or 6+Terre C016 30H006 200 10 118-8949● g9,69 Terminaison à sertir - Contacts vendus séparemment 6+Terre C016 10H006 000 10 118-8953● g5,45 Terminaison à visser - Contacts plaqués argent 3+Terre C016 20H003 100 10 118-8972● g8,10 Terminaison à visser - Contacts plaqués or 3+Terre C016 20H003 200 10 118-8974● g10,53 Accessoires Ecomate Nbre. de voies Réf. Fab. Code Commande Prix Unitaire Terminaison à souder - Contacts plaqués argent 6+Terre C016 30H006 110 10 118-8948● g8,11 Terminaison à souder - Contacts plaqués or 6+Terre C016 30H006 210 10 118-8950● g10,53 Terminaison à sertir - Contacts vendus séparemment 6+Terre C016 10H006 010 10 118-8954● g5,94 Terminaison à visser - Contacts plaqués argent 3+Terre C016 20H003 110 10 118-8973● g8,43 Terminaison à visser - Contacts plaqués or 3+Terre C016 20H003 210 10 118-8976● g10,95 Fiche mâle libe, 3 et 6 voies + Terre RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Connecteurs circulaires 61 Restez Connecté ! Besoin d’un meilleur prix? Description Réf. Fab. Code Commande Prix Unitaire Embases femelles Embase femelle 2 Voies QC24-1602X 152-0329● g5,020 Embase femelle 7 Voies QC24-2007X 152-0330● g5,020 Embase femelle 12 Voies QC24-2212X 152-0331● g5,020 Fiches mâles Fiche mâle 2 Voies QC26-1602X 152-0332● g2,890 Fiche mâle 7 Voies QC26-2007X 152-0333● g2,890 Fiche mâle 12 Voies QC26-2212X 152-0334● g2,890 Capôt arrière QC210N-L 152-0336● g2,420 Ecrou et Rondelle QC205P 152-0338● g0,610 Ki Montage Platine QC-DM02 152-0339● g3,420 Fil Etanche Fil Etanche 2 Voies QC220-02 152-0340● g0,820 Fil Etanche 7 Voies QC220-07 152-0341● g0,820 Fil Etanche 12 Voies QC220-12 152-0342● g0,820 7 Way Wire Seal Filler Plug 0413-204-2005 152-0348● g0,091 12 Way Wire Seal Filler Plug 600300-22 152-0351● g0,210 Capôt Capôt pour fiche mâle - Economique QC28 152-0347● g1,230 Capôt pour fiche mâle avec Cordon QC38 152-0352● g5,780 Capôt pour embase femelle avec Cordon QC39 152-0353● g4,560 04 74 68 99 98 cotations@farnell.com Connexion Rapide @ Construit à partir de l’Ultem, matériel en composite résistant à la corrosion et à la haute température. Cette série de connecteurs composite en 2, 7 et 12 voies sont résistants aux produits chimiques et IP68. Ils sont idéales pour les applications rigoureuses. Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Fiches mâles libres 3 99-9205-00-03 143-7595● g6,22 4 99-9209-00-04 143-7596● g7,54 Fiches femelles libres 3 99-9206-00-03 143-7597● g8,72 4 99-9210-00-04 143-7599● g13,96 Fiches mâles montage panneau 3 99-9207-00-03 143-7600● g5,60 4 99-9211-00-04 143-7601● g9,72 Fiches femelles montage panneau 3 99-9208-00-03 143-7602● g5,69 4 99-9212-00-04 143-7603● g6,40 Adaptateur pour fiches femelles Montage arrière 08-2636-000-001 143-7605● g5,34 Montage avant 08-2629-000-001 143-7606● g5,34 Notre service cotations est à votre disposition pour vous proposer un meilleur tarif sur toute demande à partir de 500g Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Cordons assemblés Fiche mâle 4 voies 2m 79-3107-52-04 143-7624● g20,56 Fiche femelle 4 voies 2m 79-3108-52-04 143-7625● g21,88 Fil Volant Fiche mâle montage panneau 4 voies 09-3111-86-04 143-7626● g16,82 Fiche femelle 4 voies 09-3112-00-04 143-7627● g17,94 Courant nominal 2 Voies = 13 A 7 Voies = 3 et 7 A 12 Voies = 5 A Gamme de Température -55 à 150 Résistance d’isolement >1000MΩ Série 620 Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Cordon assemblé mâle 2 79-1405-12-02 143-7607● g27,26 4 79-1409-12-04 143-7608● g28,48 5 79-1413-12-05 143-7609● g30,06 7 79-1421-12-07 143-7610● g40,17 8 79-1425-12-08 143-7611● g41,58 Cordon assemblée femelle 5 79-1414-12-05 143-7612● g31,28 7 79-1422-12-07 143-7613● g43,37 8 79-1426-12-08 143-7614● g45,30 Fiche mâle montage panneau 5 09-0415-00-05 143-7615● g9,93 7 09-0423-00-07 143-7617● g13,78 8 09-0427-00-08 143-7618● g13,68 Fiche femelle montage panneau 2 09-0404-00-02 143-7619● g7,63 4 09-0412-00-04 143-7620● g9,11 5 09-0416-00-05 143-7621● g9,93 7 09-0424-00-07 143-7622● g13,40 8 09-0428-00-08 143-7623● g14,32 • Mécanisme de verrouillage rapide • Montage universel • Joint standard • Construit avec du Utem, matériel composite résistant haute température Série 707 • Système de verrouillage encliquetable • Système anti-traction interne • Assemblage facile • IP67 Série 702 1437624 1437597 1437600 • Connecteur circulaire avec vis M5x0.5 • Fileté résistant aux vibrations • IP67 1437615 1437602 1437625 1437619 1437626 • Câble PUR • Connecteur et câble avec protection EMC à 360° • Compatible avec la série de connecteur 712 • Câble de 2m avec cordon assemblé • IP67 Système de verrouillage Encliquetable Tension nominal 3 voies 125V 4 voies 60V Termination A souder Intensité nominal 3 voies 3A 4 voies 2A Gamme de température -40°C à 85°C Plaquage des Contacts Or 1437607 1437627 1437612 1437595 Tension nominal 3 voies 125V 4 voies 60V Intensité nominal 3 voies 3A 4 voies 2A Plaquage des Contacts Or Système de verrouillage Encliquetable Termination A souder Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Connecteurs carte à fil 62 Restez Connecté ! Par multiple de 5 Par multiple de 5 Par multiple de 5 Nbre de Réf. Code Prix Nbre de Réf. Code Prix Nbre de Réf. Code Prix Voies Fab. Commande Unitaire Voies Fab. Commande Unitaire Voies Fab. Commande Unitaire Embase mâle CMS Droite 3 SM03B-GHS-TB (LF)(SN) 151-6223● g0,680 4 GHR-04V-S 151-6240● g0,230 2 BM02B-GHS-TBT (LF)(SN) 151-6205● g0,640 4 SM04B-GHS-TB (LF)(SN) 151-6224● g0,730 5 GHR-05V-S 151-6241● g0,290 3 BM03B-GHS-TBT (LF)(SN) 151-6207● g0,680 5 SM05B-GHS-TB (LF)(SN) 151-6225● g0,760 6 GHR-06V-S 151-6242● g0,290 4 BM04B-GHS-TBT (LF)(SN) 151-6208● g0,730 6 SM06B-GHS-TB (LF)(SN) 151-6226● g0,900 7 GHR-07V-S 151-6244● g0,300 5 BM05B-GHS-TBT (LF)(SN) 151-6209● g0,760 7 SM07B-GHS-TB (LF)(SN) 151-6227● g0,940 8 GHR-08V-S 151-6246● g0,300 6 BM06B-GHS-TBT (LF)(SN) 151-6210● g0,900 8 SM08B-GHS-TB (LF)(SN) 151-6228● g0,970 9 GHR-09V-S 151-6247● g0,300 7 BM07B-GHS-TBT (LF)(SN) 151-6211● g0,930 9 SM09B-GHS-TB (LF)(SN) 151-6229● g1,000 10 GHR-10V-S 151-6248● g0,300 8 BM08B-GHS-TBT (LF)(SN) 151-6212● g0,970 10 SM10B-GHS-TB (LF)(SN) 151-6230● g1,060 11 GHR-11V-S 151-6249● g0,300 9 BM09B-GHS-TBT (LF)(SN) 151-6213● g1,000 11 SM11B-GHS-TB (LF)(SN) 151-6232● g1,140 12 GHR-12V-S 151-6250● g0,320 10 BM10B-GHS-TBT (LF)(SN) 151-6214● g1,060 12 SM12B-GHS-TB (LF)(SN) 151-6233● g1,160 13 GHR-13V-S 151-6251● g0,320 11 BM11B-GHS-TBT (LF)(SN) 151-6215● g1,140 13 SM13B-GHS-TB (LF)(SN) 151-6234● g1,230 14 GHR-14V-S 151-6252● g0,320 12 BM12B-GHS-TBT (LF)(SN) 151-6216● g1,160 14 SM14B-GHS-TB (LF)(SN) 151-6235● g1,230 15 GHR-15V-S 151-6253● g0,330 13 BM13B-GHS-TBT (LF)(SN) 151-6217● g1,230 15 SM15B-GHS-TB (LF)(SN) 151-6236● g1,260 Par multiple de 100 14 BM14B-GHS-TBT (LF)(SN) 151-6219● g1,230 Boîtier Fiche femelle à sertir MINI-SSHL-002T-P0.2 151-6254● g0,106 2 BM02B-GHS-TBT (LF)(SN) 151-6205● g0,640 2 GHR-02V-S 151-6237● g0,198 Par multiple de 1 Embase mâle CMS coudée 3 GHR-03V-S 151-6238● g0,210 Outils à main WC-GH2630 151-6256 g685,520 2 SM02B-GHS-TB (LF)(SN) 151-6222● g0,640 • Structure de verrouillage sécurisé • Contact verrouillable • Contacts prévus contre la déformation 2.5mm Série WPJ Par Multiple de 10 Par Multiple de 10 Par Multiple de 10 Nbre Code Prix Nbre Code Prix Nbre Code Prix de Voies Réf. Fab. Commande Unitaire de Voies Réf. Fab. Commande Unitaire de Voies Réf. Fab. Commande Unitaire Boîtier 3 B3B-XH-A (LF)(SN) 151-6277● g0,152 4 S4B-XH-A (LF)(SN) 151-6291● g0,210 2 XHP-2 151-6264● g0,046 4 B4B-XH-A (LF)(SN) 151-6278● g0,198 5 S5B-XH-A (LF)(SN) 151-6293● g0,260 3 XHP-3 151-6265● g0,061 5 B5B-XH-A (LF)(SN) 151-6281● g0,198 6 S6B-XH-A (LF)(SN) 151-6294● g0,270 4 XHP-4 151-6266● g0,091 6 B6B-XH-A (LF)(SN) 151-6282● g0,230 7 S7B-XH-A (LF)(SN) 151-6295● g0,320 5 XHP-5 151-6268● g0,091 7 B7B-XH-A (LF)(SN) 151-6283● g0,260 8 S8B-XH-A (LF)(SN) 151-6296● g0,330 6 XHP-6 151-6269● g0,106 8 B8B-XH-A (LF)(SN) 151-6284● g0,270 9 S9B-XH-A (LF)(SN) 151-6297● g0,380 7 XHP-7 151-6270● g0,106 9 B9B-XH-A (LF)(SN) 151-6285● g0,320 10 S10B-XH-A (LF)(SN) 151-6298● g0,380 8 XHP-8 151-6271● g0,106 10 B10B-XH-A (LF)(SN) 151-6286● g0,320 11 S11B-XH-A (LF)(SN) 151-6299● g0,430 9 XHP-9 151-6272● g0,106 11 B11B-XH-A (LF)(SN) 151-6287● g0,410 12 S12B-XH-A (LF)(SN) 151-6300● g0,530 10 XHP-10 151-6273● g0,122 12 B12B-XH-A (LF)(SN) 151-6288● g0,460 Par Multiple de 10 11 XHP-11 151-6274● g0,137 Embase mâle coudée Terminaison à sertir BXH-001T-P0.6 151-6301● g0,044 12 XHP-12 151-6275● g0,152 2 S2B-XH-A (LF)(SN) 151-6289● g0,198 Par Multiple de 1 Embase mâle droite 3 S3B-XH-A (LF)(SN) 151-6290● g0,198 Outil à main WC-110 151-6302 g282,720 2 B2B-XH-A (LF)(SN) 151-6276● g0,106 Connecteur GH Par multiple de 5 Par multiple de 5 Nbre de Voies Couleur Réf. Fab. Code Commande Prix Unitaire Nbre de Voies Couleur Réf. Fab. Code Commande Prix Unitaire Embase mâle CI 2 Rouge 02R-WPJV-2-RMM(N) 142-5991● g2,070 2 Naturel B02B-WPJSS-1(LF)(SN) 142-5983● g0,420 2 Bleu 02R-WPJV-3-EMM(N) 142-5992● g2,070 2 Rouge B02B-WPJRS-2(LF)(SN) 142-5984● g0,440 3 Naturel 03R-WPJV-1-SMM(N) 142-5993● g2,480 2 Bleu B02B-WPJES-3(LF)(SN) 142-5986● g0,440 3 Rouge 03R-WPJV-2-RMM(N) 142-5994● g2,490 3 Naturel B03B-WPJSS-1(LF)(SN) 142-5987● g0,530 3 Bleu 03R-WPJV-3-EMM(N) 142-5995● g2,490 3 Rouge B03B-WPJRS-2(LF)(SN) 142-5988● g0,540 Par multiple de 10 3 Bleu B03B-WPJES-3(LF)(SN) 142-5989● g0,540 Contact BWP-JR-21T-M0.5 142-5996● g0,107 Capôt Par multiple de 1 2 Naturel 02R-WPJV-1.SMM(N) 142-5990● g2,050 Outil WC-WPJ 142-5998 g384,750 1.25mm Connecteur XH Embases mâles étanches Courant nominal 3A ac/dc Résistance des Contacts 20m Ω Tension nominal 250V ac/dc Résistance d’isolement 800M Ω Tenue de tension 1000V/1min. Gamme de température °C to °C-25°C à 85°C Contacts Bronze Phosphoreux, Plaqué étain • Pas de 5mm • Performance étanche • Système de clé de contrôle pour prévenir des mauvais accouplement • Contacts en faisceaux • Embase femelle prévenant contre les mauvaises insertion de circuits imprimés • Système enclenchant • Design compact Courant nominal 7A @ °C Gamme de température -25°C à +85°C Taille de fil 22 à 18 AWG Boîtier Verre rempli de PBT • Hauteur de montage très petite de 9.8mm RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Connecteurs carte à fil 63 Restez Connecté ! Datamate Caractéristiques: Courant nominal: 3.0A max. @ 25°C 2.2A max. @ 85°C Tension de fonctionnement: 120V c.c. ou c.a. en pointe Résistance de contact: 25mΩ max. Résistance d’isolement: 100Ω min. à 500Vcc Tension max.: 360V c.c. ou c.a. en pointe Boîtier: Thermoplastique chargé verre UL94V-0 Contacts femelle: Contact intérieur laiton / Extérieur Cuivre au Béryllium mâle: Bronze phosphoreux Plaquage femelle: Or mâle Contact intérieur or / Queue étain/plomb Cycles de raccordement 500 • Pour les liaisons cartes à cartes • 1 ou 2 rangées • Contacts pleins • Contacts en Cuivre au Béryllium pour une transmission haute vitesse • Polarisés avec verrou en option • Conformes BS9525-F0033 (Par multiple de 10) Code (Par multiple de 10) Code Taille Contact Longueur (mm) Commande Prix Unitaire Taille Contact Longueur (mm) Commande Prix Unitaire Contact femelle vers extrémité libre Contact femelle vers contact femelle 22AWG 150 872-9247● g0,99 22AWG 150 872-9328● g1,78 24AWG 150 872-9255● g0,96 24AWG 150 872-9336● g1,72 26AWG 150 872-9263● g0,96 28AWG 150 872-9352● g1,72 28AWG 150 872-9271● g0,96 22AWG 300 872-9360● g1,78 22AWG 300 872-9280● g0,99 24AWG 300 872-9379● g1,72 24AWG 300 872-9298● g0,96 26AWG 300 872-9387● g1,70 26AWG 300 872-9301● g0,96 28AWG 300 872-9395● g1,70 28AWG 300 872-9310● g0,96 A visser Plaqué Zinc Tension nominale 450V Température Max. 110° Intensité 10A Matériel Nylon DIL, grandes oreilles avec vis de verrouillage M80-460xx42 Utiliser des contacts à sertir de taille : 22AWG DIL, petites oreilles avec vis de verrouillage M80-461xx42 Utiliser des contacts à sertir de taille : 28 - 24 AWG Contacts femelles à sertir Nbre. de voies Code Commande Prix Unitaire Nbre. de voies Code Commande Prix Unitaire DIL - Petites oreilles avec vis de verrouillage - 28 - 24 AWG DIL - Grandes oreilles avec vis de verrouillage- 22 AWG 3+3 114-4550● g7,31 3+3 114-4541● g7,31 5+5 114-4551● g9,22 5+5 114-4542● g9,22 7+7 114-4552● g11,40 7+7 114-4543● g11,40 10+10 114-4553● g14,23 10+10 114-4544● g14,23 13+13 114-4554● g17,80 13+13 114-4545● g17,80 17+17 114-4555● g21,60 17+17 114-4547● g21,60 21+21 114-4556● g25,42 21+21 114-4548● g25,42 25+25 114-4557● g29,20 25+25 114-4549● g29,20 Par Multiple de 5 Par Multiple de 5 Nbre de Pôles Code Commande Prix Unitaire Nbre de Pôles Code Commande Prix Unitaire Droite Coudé 2 135-7318● g0,187 2 135-7325● g0,187 3 135-7319● g0,270 3 135-7326● g0,280 4 135-7320● g0,360 4 135-7327● g0,360 6 135-7321● g0,530 6 135-7328● g0,540 8 135-7322● g0,700 8 135-7329● g0,720 10 135-7324● g0,870 10 135-7330● g0,900 DIL Vertical, avec vis de verrouillage M80-500xx42 DIL Coudé, avec vis de verrouillage M80-530xx42 Nbre de voies Code Commande Prix Unitaire Nbre de voies Code Commande Prix Unitaire DIL Vertical - Montage sur carte avec vis de verrouillage DIL Angle Droit - Montage sur carte avec vis de verrouillage 3+3 114-4568● g10,41 3+3 114-4586● g16,06 5+5 114-4569● g11,11 5+5 114-4587● g16,76 7+7 114-4570● g12,01 7+7 114-4588● g17,68 10+10 114-4572● g13,07 10+10 114-4589● g18,71 13+13 114-4573● g14,73 13+13 114-4590● g20,37 17+17 114-4574● g16,09 34+34 114-4591● g21,77 21+21 114-4575● g17,48 21+21 114-4592● g23,12 25+25 114-4576● g17,65 25+25 114-4593● g24,51 Fiche mâle - Montage sur carte Bloc de Terminaison 10A • Livrés en câbles pré-sertis • Choix entre différentes longueur de câble et différentes tailles • A utiliser avec les boîtiers 2.0mm ci-dessus • Contacts à double harpon pour une haute fiabilité • Fil d’équipement en PTFE rouge Nbre. de voies Code Commande Prix Unitaire Nbre. de voies Code Commande Prix Unitaire DIL Vertical - avec vis de verrouillage DIL Coudée - avec vis de verrouillage 3+3 114-4559● g4,99 3+3 114-4577● g4,99 5+5 114-4561● g5,71 5+5 114-4578● g5,71 7+7 114-4562● g6,63 7+7 114-4579● g6,63 10+10 114-4563● g7,65 10+10 114-4580● g7,65 13+13 114-4564● g9,31 13+13 114-4581● g9,32 17+17 114-4565● g10,70 17+17 114-4582● g10,70 21+21 114-4566● g12,07 21+21 114-4584● g12,04 25+25 114-4567● g13,43 25+25 114-4585● g13,43 Fiche femelle à sertir Embase mâle 3mm Réferences fabricant. Où xx = nombre de voies Réf. Fab. Où xx = Nombre de voies • Disponible en version droite et coudée • De 2 à 12 pôles • Approuvés CSA et Reconnu UL Avec vis de verrouillage Réf. Fab. Où xx = Nombre de voies Avec vis de verrouillage Pas de 5mm 1144569 Avec vis de câblage 1144563 1144589 1144580 DIL Vertical, Montage sur carte avec vis de verrouillage M80-510xx42 DIL Angle Droit, Montage sur carte avec vis de verrouillageM80-540xx42 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Connecteurs carte à carte 64 Restez Connecté ! Courant nominal 0.3A Tension nominale c.a. 50V Résistance de contact mΩ≤50mOhm Résistance d’isolement ≥500MOhm Matériau isolant Résine Polyamide Matériau des contacts Cuivre Phosphoreux Plaquage des contacts Or Plage de températures -35°C à +85°C Courant nominal 0.4A Matériau isolant PBS Tension nominale c.a. 100V Matériau des contacts Bronze Phosphoreux Résistance de contact ≤45mOhm Plaquage des contacts Or Résistance d’isolement ≥1000MOhm Plage de températures -55°C à +85°C Nbre de voies Réf. Fab. Code Commande Prix Unitaire Nbre de voies Réf. Fab. Code Commande Prix Unitaire Embase femelle 20 DF16(2.0)-20DP-0.5V(86) 132-4712● g0,96 14 DF16-14DS-0.5V(86) 132-4726● g0,81 30 DF16(2.0)-30DP-0.5V(86) 132-4713● g1,19 16 DF16-16DS-0.5V(86) 132-4727● g0,91 40 DF16(2.0)-40DP-0.5V(86) 132-4714● g1,41 20 DF16-20DS-0.5V(86) 132-4728● g1,06 50 DF16(2.0)-50DP-0.5V(86) 132-4715● g1,72 30 DF16-30DS-0.5V(86) 132-4729● g1,26 60 DF16(2.0)-60DP-0.5V(86) 132-4716● g2,02 34 DF16-34DS-0.5V(86) 132-4730● g1,34 80 DF16(2.0)-80DP-0.5V(86) 132-4717● g3,27 40 DF16-40DS-0.5V(86) 132-4732● g1,52 Embase, hauteur emboîtée 2,5mm 50 DF16-50DS-0.5V(86) 132-4733● g1,67 20 DF16(2.5)-20DP-0.5V(86) 132-4719● g0,84 60 DF16-60DS-0.5V(86) 132-4734● g1,87 30 DF16(2.5)-30DP-0.5V(86) 132-4721● g1,14 80 DF16-80DS-0.5V(86) 132-4735● g2,96 34 DF16(2.5)-34DP-0.5V(86) 132-4722● g1,22 Embase, hauteur emboîtée 2mm 40 DF16(2.5)-40DP-0.5V(86) 132-4723● g1,34 14 DF16(2.0)-14DP-0.5V(86) 132-4710● g0,65 50 DF16(2.5)-50DP-0.5V(86) 132-4724● g1,60 16 DF16(2.0)-16DP-0.5V(86) 132-4711● g0,76 60 DF16(2.5)-60DP-0.5V(86) 132-4725● g1,90 Nbre de voies Réf. Fab. Code Commande Prix Unitaire Nbre de voies Réf. Fab. Code Commande Prix Unitaire Embase femelle, hauteur emboîtée 3mm à 4mm 100 FX8-100P-SV(91) 132-4653● g4,07 60 FX8-60S-SV(21) 132-4656● g3,27 120 FX8-120P-SV(91) 132-4654● g4,61 80 FX8-80S-SV(21) 132-4657● g3,92 140 FX8-140P-SV(91) 132-4655● g5,17 90 FX8-90S-SV(21) 132-4658● g4,23 Embase mâle, hauteur emboîtée 4mm 100 FX8-100S-SV(21) 132-4659● g4,53 60 FX8-60P-SV1(91) 132-4662● g2,51 120 FX8-120S-SV(21) 132-4660● g5,14 80 FX8-80P-SV1(91) 132-4663● g2,89 140 FX8-140S-SV(21) 132-4661● g5,78 90 FX8-90P-SV1(91) 132-4665● g3,12 Embase mâle, hauteur emboîtée 3mm 100 FX8-100P-SV1(91) 132-4666● g3,31 60 FX8-60P-SV(91) 132-4649● g2,96 120 FX8-120P-SV1(91) 132-4667● g3,72 80 FX8-80P-SV(91) 132-4650● g3,54 140 FX8-140P-SV1(91) 132-4668● g4,15 90 FX8-90P-SV(71) 132-4651● g3,80 Courant nominal 0.4A Matériau isolant PBS Tension nominale c.a. 100V Matériau des contacts Bronze Phosphoreux Résistance de contact ≤80mOhm Plaquage des contacts Or Résistance d’isolement ≥1000MOhm Plage de températures -55°C à +85°C Connecteur carte à carte DF16 Nbre de voies Réf. Fab. Code Commande Prix Unitaire Nbre de voies Réf. Fab. Code Commande Prix Unitaire Embase Femelle, hauteur empilée 5mm à 9mm Embase mâle, hauteur empilée 6mm ou 11mm 60 FX8C-60S-SV(91) 132-4693● g4,33 60 FX8C-60P-SV1(91) 132-4674● g3,95 80 FX8C-80S-SV(91) 132-4694● g4,99 80 FX8C-80P-SV1(91) 132-4675● g4,45 100 FX8C-100S-SV(91) 132-4695● g5,59 100 FX8C-100P-SV1(91) 132-4677● g5,02 120 FX8C-120S-SV(91) 132-4696● g6,23 120 FX8C-120P-SV1(91) 132-4678● g5,52 140 FX8C-140S-SV(91) 132-4697● g6,89 140 FX8C-140P-SV1(91) 132-4679● g6,08 Embase Femelle, hauteur empilée 10mm à 14mm Embase mâle, hauteur empilée 7mm ou 12mm 60 FX8C-60S-SV5(91) 132-4698● g4,23 60 FX8C-60P-SV2(91) 132-4680● g3,95 80 FX8C-80S-SV5(91) 132-4699● g4,94 80 FX8C-80P-SV2(91) 132-4681● g4,45 100 FX8C-100S-SV5(91) 132-4700● g5,55 100 FX8C-100P-SV2(91) 132-4682● g5,02 120 FX8C-120S-SV5(91) 132-4701● g6,23 120 FX8C-120P-SV2(91) 132-4683● g5,52 140 FX8C-140S-SV5(91) 132-4702● g6,92 140 FX8C-140P-SV2(91) 132-4685● g6,08 Embase male, hauteur empilée 5mm ou 10mm Embase mâle, hauteur empilée 9mm ou 14mm 60 FX8C-60P-SV(91) 132-4669● g4,26 60 FX8C-60P-SV4(91) 132-4686● g3,95 80 FX8C-80P-SV(91) 132-4670● g4,76 80 FX8C-80P-SV4(91) 132-4687● g4,45 100 FX8C-100P-SV(91) 132-4671● g5,40 100 FX8C-100P-SV4(91) 132-4689● g5,02 120 FX8C-120P-SV(91) 132-4672● g5,97 120 FX8C-120P-SV4(91) 132-4691● g5,52 140 FX8C-140P-SV(91) 132-4673● g6,58 140 FX8C-140P-SV4(91) 132-4692● g6,08 Pas de 0,5mm Connecteur carte à carte FX8 et FX8C • Pas de 0,5mm • Disponible en 2mm et 2,5mm de hauteur emboîtée • Zone de préhension par le vide permettant un montage automatique • Comprend une patte de soudage métallique pour éviter l’écaillage de la soudure • Contacts à haute fiabilité • Encliquetage positif une fois complètement raccordé Pas de 0,6mm • Pas de 0,6mm • Hauteur emboîtée 3mm et 4mm de carte à carte avec la série FX8 • Hauteur emboîtée 5mm à 14mm de carte à carte avec la série FX8C - combinaison d’une des 2 tailles de réceptacle et d’une des 4 tailles d’embase • Haute coplanarité • Guide de raccordement • Bossage détrompeur • Remarque : la série FX8 ne se raccorde pas avec la série FX8C Série FX8 Série FX8C RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Connecteurs carte à carte 65 Restez Connecté ! Pas de 1 mm Pas de 0.5 mm Pas de 1.27mm • Connexion entre les bords parallèles de 12 à 24mm • Convient pour le montage sur rack ou panneau • Type de contacts ribbon assurant une bonne tenue aux torsions Pas de 0.80mm • Pas de 0.5mm • Hauteurs disponibles de 5 et 7mm • Connexion entre les bords parallèles de 4 à 9mm • Contacts orientables • Verrouillage moins sensibles aux vibrations et de résistance à la traction • Type de contacts ribbon assurant une bonne tenue aux torsions • Pas de 1mm • Hauteur de 5mm, versions droites et coudées Nbre de Contacts Réf. Fab. Code Commande prix Unitaire Nbre de Contacts Réf. Fab. Code Commande prix Unitaire Fiches femelles droites Fiches femelles coudées 40 TX24-40R-6ST-H1E 151-9620● g1,09 40 TX24-40R-LT-H1E 151-9634● g1,09 50 TX24-50R-6ST-H1E 151-9622● g1,32 50 TX24-50R-LT-H1E 151-9635● g1,32 60 TX24-60R-6ST-H1E 151-9623● g1,44 60 TX24-60R-LT-H1E 151-9636● g1,44 80 TX24-80R-6ST-H1E 151-9624● g1,81 80 TX24-80R-LT-H1E 151-9637● g1,81 100 TX24-100R-6ST-H1E 151-9625● g2,05 100 TX24-100R-LT-H1E 151-9638● g2,05 120 TX24-120R-6ST-H1E 151-9626● g2,49 120 TX24-120R-LT-H1E 151-9639● g2,49 Fiches mâles droites Fiches mâles coudées 40 TX25-40P-6ST-H1E 151-9627● g1,09 40 TX25-40P-LT-H1E 151-9640● g1,09 50 TX25-50P-6ST-H1E 151-9628● g1,32 50 TX25-50P-LT-H1E 151-9641● g1,32 60 TX25-60P-6ST-H1E 151-9629● g1,44 60 TX25-60P-LT-H1E 151-9642● g1,44 80 TX25-80P-6ST-H1E 151-9630● g1,81 80 TX25-80P-LT-H1E 151-9643● g1,81 100 TX25-100P-6ST-H1E 151-9631● g2,05 100 TX25-100P-LT-H1E 151-9644● g2,05 120 TX25-120P-6ST-H1E 151-9632● g2,49 120 TX25-120P-LT-H1E 151-9646● g2,49 Par Multiple de 5 Par Multiple de 5 Nbre de Voies Code Commande Prix Unitaire Nbre de Voies Code Commande Prix Unitaire Hauteur embase mâle 5.0mm 60 135-6754● g1,44 20 135-6740● g2,74 70 135-6755● g1,57 30 135-6741● g0,61 80 135-6757● g2,02 40 135-6742● g0,81 90 135-6758● g1,64 50 135-6743● g0,84 100 135-6759● g1,82 60 135-6745● g1,19 Hauteur fiche femelle 5.0/7.0mm 70 135-6746● g1,34 20 135-6760● g1,98 80 135-6747● g1,37 30 135-6761● g0,65 90 135-6748● g1,57 40 135-6762● g0,76 100 135-6749● g1,72 50 135-6763● g0,99 Hauteur embase mâle 7.0mm 60 135-6764● g1,26 20 135-6750● g1,87 70 135-6765● g1,49 30 135-6751● g0,88 80 135-6766● g1,41 40 135-6752● g0,99 90 135-6767● g1,87 50 135-6753● g1,22 100 135-6769● g1,82 Nbre de Contacts Réf. Fab. Code Commande Prix Unitaire Nbre de Contacts Réf. Fab. Code Commande Prix Unitaire Nbre de Contacts Réf. Fab. Code Commande Prix Unitaire Fiches femelles Droites - 3.55mm de hauteur 70 KX14-70K5DE 151-9654● g2,74 40 KX15-40K3DE 151-9662● g1,72 20 KX14-20K2DE 151-9647● g1,40 80 KX14-80K5DE 151-9656● g4,73 50 KX15-50K3DE 151-9665● g2,69 40 KX14-40K2DRE 151-9649● g2,19 Fiches mâles Droites - 3.75mm de hauteur 70 KX15-70K3DE 151-9668● g3,57 50 KX14-50K2DRE 151-9651● g2,63 20 KX15-20K2DE 151-9658● g1,31 80 KX15-80K3DE 151-9673● g5,37 70 KX14-70K2DE 151-9653● g2,69 40 KX15-40K2D-RE 151-9661● g1,57 Fiches mâles coudées 80 KX14-80K2DE 151-9655● g4,68 50 KX15-50K2DE 151-9664● g2,61 20 KX15-20KLDLE 151-9660● g1,47 Fiches femelles Droites - 6.55mm de hauteur 70 KX15-70K2DE 151-9667● g3,51 40 KX15-40KLDLE 151-9663● g2,49 20 KX14-20K5DE 151-9648● g1,43 80 KX15-80K2DE 151-9672● g5,32 50 KX15-50KLDLE 151-9666● g2,98 40 KX14-40K5DRE 151-9650● g2,25 Fiches mâles Droites - 4.75mm de hauteur 70 KX15-70KLDLE 151-9671● g4,01 50 KX14-50K5DRE 151-9652● g2,69 20 KX15-20K3DE 151-9659● g1,31 80 KX15-80KLDLE 151-9674● g5,73 Séries TX24/TX25 Carte à Carte Par Multiple de 5 Par Multiple de 5 Nbre de Voies Code Commande Prix Unitaire Nbre de Voies Code Commande Prix Unitaire Embase mâle droite Fiche femelle droite 30 135-6771● g1,98 30 135-6779● g4,07 40 135-6772● g2,17 40 135-6780● g2,25 50 135-6773● g2,13 50 135-6782● g2,43 60 135-6774● g2,48 60 135-6783● g2,81 Embase mâle coudée Fiche femelle coudée 30 135-6775● g3,01 30 135-6784● g3,19 40 135-6776● g3,27 40 135-6785● g2,51 50 135-6777● g3,27 50 135-6786● g3,31 60 135-6778● g3,65 60 135-6787● g3,69 Matériaux des Contats Alliage de Cuivre Gamme de température -40°C à +85°C Matériaux des Contats Alliage de Cuivre Gamme de température -40°C à +85°C Embases mâles FPC et Fiches femelles Séries KX14/KX15 Carte à carte Embases mâles FPC et Fiches femelles Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Connecteurs carte à carte 66 Restez Connecté ! Pour les dernières technologies en contrôle de mouvement et automation regroupant plus de 1000 nouveaux produits, consultez le Technology First en ligne : www.electronicsdesignworld.com Seulement g9,97 CODE COMMANDE151-6181● Nbre de Voies Réf. Fab. Code Commande Prix Unitaire 2 45719-0004 150-6372● g4,48 3 45719-0005 150-6373● g6,73 4 45719-0006 150-6374● g8,88 8 45844-0001 150-6375● g11,55 8 45844-0002 150-6376● g12,80 8 45911-0001 150-6378● g10,67 8 45911-0007 150-6379● g14,68 8 45911-0011 150-6380● g15,56 Haute intensité Connecteurs "Power Edge" Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Nbre de Voies Réf. Fab. Code Commande Prix Unitaire Embases Mâles Fiches Femelles 3 5164711-3 135-7550● g0,35 3 5164713-3 135-7563● g0,27 4 5164711-4 135-7551● g0,46 4 5164713-4 135-7564● g0,35 5 5164711-5 135-7552● g0,58 5 5164713-5 135-7565● g0,46 6 5164711-6 135-7553● g0,68 6 5164713-6 135-7567● g0,50 7 5164711-7 135-7556● g0,81 7 5164713-7 135-7568● g0,58 8 5164711-8 135-7557● g0,91 8 5164713-8 135-7569● g0,68 9 5164711-9 135-7558● g1,03 9 5164713-9 135-7570● g0,76 10 1-5164711-0 135-7560● g1,14 10 1-5164713-0 135-7572● g0,81 11 1-5164711-1 135-7561● g1,26 11 1-5164713-1 135-7573● g0,99 12 1-5164711-2 135-7562● g1,37 12 1-5164713-2 135-7574● g1,11 • Basse tension • Contacts gauche et droit isolés • Courant nominal jusqu’à 320A • Entrée sur le dessus • Connecteurs assemblés disponible en deux, trois ou quatre segments (2 contacts par segments) améliorant la flexibilité pour les applicaions de ditribution de puissance • Segments empliables améliorant la flexibilité • Intensité nominal de 40A par contacts pour des besoins en haut courant • Terminaisons Press-fit ou à souder compatibles avec les circuits imprimés ou aux fonds de paniers Connecteur Bar Bus Mini-Match Ce connecteur BBC est parfaitement adapté aux applications pour l’équipement des télécommunications : commutateurs, routeurs en réseau ou non, aux applications informatiques. • Connecteurs haute densité carte à carte • Pas de 2.5mm • Contacts plaqués étain • Contacts haute pression Intensité nominal 250V ac/dc Courant nominal 40A Gamme de température -40°C à 105°C Boîtier LCP rempli de verre Contact Alliage de Cuivre Plaquage des Contacts Or Séléctif Embases mâles et Fiches femelles Sub-D filtree Offre spéciale, durée limitée … Pour tout achat d’un oscilloscope TPS2000, recevez gratuitement une sacoche de transport *Pour les conditions générales de vente, visitez le site internet www.tektronix.com/lifetimewarranty Modèle Bande passante Taux d’échantillonnage Nbre de voies Prix Unitaire TDS2024B 200 MHz 2.0 Géch/s 4 TDS2022B 200 MHz 2.0 Géch/s 2 TDS2014B 100 MHz 1.0 Géch/s 4 TDS2012B 100 MHz 1.0 Géch/s 2 TDS2004B 60 MHz 1.0 Géch/s 4 TDS2002B 60 MHz 1.0 Géch/s 2 TDS1012B 100 MHz 1.0 Géch/s 2 TDS1002B 60 MHz 1.0 Géch/s 2 TDS1001B 40 MHz 500Méch/s 2 1970􀂽􀀒CHF 3354.00 1600􀂽􀀒CHF 2718.00 􀀔􀀙􀀓􀀓􀂽􀀒CHF 2718.00 􀀔􀀖􀀔􀀓􀂽􀀒CHF 2236.00 􀀔􀀖􀀔􀀓􀂽􀀒CHF 2236.00 􀀔􀀓􀀜􀀓􀂽􀀒CHF 1858.00 􀀔􀀓􀀜􀀓􀂽􀀒CHF 1858.00 􀀛􀀚􀀘􀂽􀀒CHF 1491.00 􀀚􀀕􀀜􀂽􀀒CHF 1244.00 SÉRIE TDS1000B/2000B : Port USB en face avant (pilote Flash) Connexion PC Plug-and-Play – documentation et analyse facile des résultats avec les logiciels PC NI SignalExpressTM et Open ChoiceTM Garantie à vie* Fonction d’impression directe – impression facile sur toutes imprimantes compatibles PictBridge Plus Performant. Plus Facile à utiliser. Oscilloscopes série TDS1000B/2000B de Tektronix Caractéristiques TPS2012 TPS2014 TPS2024 Voies (isolées) 2 4 4 Bande passante 100MHz 100MHz 200MHz Taux d’échantillonnage/voie 1.0 Géch/s 1.0 Géch/s 2.0 Géch/s Durée d’enregistrement 2.5K 2.5K 2.5K Autonomie Affichage (1/4 VGA LCD) Couleur Couleur Couleur Mesures automatiques 11 11 11 Entrée déclenchement externe isolé oui oui oui Mesures de puissance en option Accessoires standard Sondes livrées P2220 (2) P2220 (4) P2220 (4) Prix Unitaire 2310􀂽􀀒CHF 3715.00 􀀕􀀙􀀕􀀓􀂽􀀒CHF 4214.00 2930􀂽􀀒CHF 4713.00 8h de fonctionnement en continu avec 2 batteries chargées interchangeables à chaud Le logiciel TPSWR1 en option offre une analyse instantanée du signal de puissance, harmoniques, de la perte de commutation, des angles de phase, des valeurs dv/dt et di/dt Batterie TPSBAT, stockage CompactFlash intégré, logiciel OpenChoice TDSPCS1 STOCK LIMITÉ Commandez AUJOURD’HUI et recevez GRATUITEMENT une sacoche de transport polyvalente Une grande productivité du laboratoire au terrain. Avec 4 voies isolées. Autonomie 8h. Léger, seulement 3.7kg. Oscilloscope portable pour une utilisation sur terrain Lanière d’attache polyvalente pour les espaces restreints et en utilisation mains-libres Jusqu’à 8h de fonctionnement en continu Touches rétro-éclairées et 2 ou 4 voies isolées pour une meilleure sécurité et confort Logiciel d’analyse du signal de puissance en option Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Lecroy 68 Test et Mesure Extensions d’analyse logique avec les modules MSO-250, 250MHz 18 voies : code-commande 134-8276 et MSO-500, 500MHz 36 voies : code-commande 134-8275 ou MSO-500, 500MHz 18 voies: 134-8273. Modèle WS24XS WS42XS WS44XS WS62XS WS64XS WS104XS Code Commande 130-0622 113-2560 113-2561 113-2562 130-2563 127-2489 Nbre de voies 4 2 4 2 4 4 Echantillonnage 2.5 Géch./s Longueur d’enregistrement std 2 MPts/voies Affichage Ecran SVGA TFT-LCD 10.4" tactile couleur / système d’exploitation Windows XP Temps de montée 1.75 ns 1.75 ns 625 ns 400 ns Résolution verticale 8-bits Sensibilité verticale 2mV/div - 10V/div (1MΩ); 2mV/div - 2V/div (50Ω) Précision verticale +/- (1.5% + 0.5% de la pleine échelle) Tension d’entrée max. ±400V (CAT I) Limite bande passante 20 20 MHz, 200 MHz Couplage d’entrée 50Ω: DC, GND; 1MΩ: AC, DC, GND Impédance d’entrée 1MΩ/16pF, ou 50Ω ±1% Base de temps/div. 200ps/div - 1000s/div (mode roulant de 500ms/div à 1000s/div) Précision base de temps 10 ppm WAVEJET WJ312WJ312 WAVEJET WJ314WJ314 WAVEJET WJ322WJ322 WAVEJET WJ324WJ324 WAVEJET WJ332WJ332 WAVEJET WJ334WJ334 WAVEJET WJ352WJ352 WAVEJET WJ354WJ354 Affichage Ecran couleur VGA, TFT-LCD 7.5" Bande passante 100MHz 100MHz 200MHz 200MHz 350MHz 350MHz 500MHz 500MHz Nbre de voies 2 4 2 4 2 4 2 4 Echantillonnage 1 Géch/s 1 Géch/s, 2Géch/s (Entrelacé) Temps de montée 3.5 ns 1.75 ns 1 ns 750 ps Longueur d’enregistrement 500kpts par voie Résolution verticale 8-bit Sensibilité verticale 2 mV/div - 10 V/div 2 mV/div - 10 V/div, 2mV/div - 1V/div (50Ω) Précision du gain DC 2% Tension d’entrée max. 400V CAT I 400V CAT I, 5Vrms (50Ω) Limite bande passante 20 MHz 20 MHz, 200MHz Couplage d’entrée GND, DC 1MΩ, AC 1MΩ GND, DC 1MΩ, AC 1MΩ, DC 50Ω 1MΩ ±1.5% / 20pF Impédance d’entrée 1MΩ ±1.5% / 20pF 1MΩ ±1.5% / 16pF ±1.5% Base de temps 5ns/div - 50s/div 2ns/div - 50s/div 1ns/div - 50s/div 500ps/div - 50s/div Précision base de temps 10 ppm Déclenchements Front, largeur d’impulsion, période (Intervalle), compteur d’impulsions, vidéo Zoom Utiliser le bouton "QuickZoom" en face avant pour agrandir toute forme d’onde dans une grille séparée Math Somme, différence, produit, FFT Réf. Fab. Code Commande Prix Unitaire Oscilloscopes 200MHz, 4 voies WS24XS 130-0622 g5990,00 400MHz, 2 voies WS42XS 146-8088 g5750,00 400MHz, 4 voies WS44XS 113-2561 g7290,00 600MHz, 2 voies WS62XS 113-2562 g7250,00 600MHz, 4 voies WS64XS 113-2563 g8990,00 1GHz, 4 voies WS104XS 127-2489 g10490,00 Réf. Fab. Description Code Commande Prix Unitaire Oscilloscopes 100MHz, 2 voies WAVEJET WJ312 113-2564 g2290,00 100MHz, 4 voies WAVEJET WJ314 113-2565 g2690,00 200MHz, 2 voies WAVEJET WJ322 113-2566 g2990,00 200MHz, 4 voies WAVEJET WJ324 113-2567 g3490,00 350MHz, 2 voies WAVEJET WJ332 113-2569 g4490,00 350MHz, 4 voies WAVEJET WJ334 113-2571 g5190,00 500MHz, 2 voies WAVEJET WJ352 113-2572 g5790,00 500MHz, 4 voies WAVEJET WJ354 113-2573 g6490,00 Oscilloscopes numériques Oscilloscopes numériques Série WaveSurfer XS Série WaveJet 300 l=285 H=190 P=108mm Poids= 3.2kg • Mémoire étendue et fenêtre d’acquisition supérieure • Gagnez du temps grâce à la touche d’accès unique aux 23 mesures • Sauvegardez les formes d’onde et les réglages sur le disque dur local ou sur une mémoire USB externe ou envoyez grâce à la connectivité réseau • Fonctions Maths, FFT et zoom en standard • Garantie 3 ans et support technique 7 ans La série WaveJet 300 fournit des performances et une portabilité inégalées dans cette catégorie d’oscilloscopes numériques. Ses oscilloscopes présentent une profondeur de seulement 105mm, un large écran couleur de 7.5 pouces, et une profondeur mémoire bien supérieure pour un prix très compétitif. Ils sont disponibles en 4 bandes passantes de 100 à 500MHz. • Bandes passantes de 100, 200, 350 et 500MHz • 2 ou 4 voies • Grand écran couleur VGA TFT-LCD 7.5 pouces • Fréquence d’échantillonnage de 1Géch/s max. sur les modèles 100MHz et de 2Géch/s sur tous les autres modèles • Longueur d’enregistrement de 500kpts par voie • 26 mesures automatiques • Fonction Zoom • Compteur de fréquence intégré à 6 chiffres pour simplifier vos méthodes de mesure • Mode "Répéter" qui permet d’afficher un historique des formes d’onde capturées • 4 fonctions mathématiques dont FFT • Encombrement réduit • Port USB • Une sonde passive 500MHz (PP006A) offerte par voie • Garantie 3 ans et support technique 7 ans • Bandes passantes 200 MHz, 400 MHz, 600 MHz et 1 GHz • Echantillonnage 2.5 Géch./s • 2 ou 4 voies • Ecran SVGA tactile couleur 10.4" • Mode de visualisation rapide WavestreamTM qui utilise un affichage rapide à 256 niveaux, idéal pour visualiser les formes d’onde avec leurs jitters et leurs anomalies RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Fluke 71 Test et Mesure Multimètres enregistreurs numériques Fonction Gamme max. Courant AC/DC max 1400 A rms Tension AC 600 V AC rms (355 uniquement) Tension DC 1000 V DC (355 uniquement) Résistance 400 kΩ (355 uniquement) Fréquence 5Hz à 999Hz (353 uniquement) Indicateur sonore de continuité ≤ 30Ω Fonctions Max. Res. 175 177 179 Tension c.c. 1000V 0.1mV ±(0.15%+2) ±(0.09%+2) ±(0.09%+2) Tension c.a. 1000V 0.1mV ±(1.0%+3) ±(1.0%+3) ±(1.0%+3) Courant c.c. 10A 0.01mA ±(1.0%+3) ±(1.0%+3) ±(1.0%+3) Courant c.a. 10A 0.01mA ±(1.5%+3) ±(1.5%+3) ±(1.5%+3) Résistance 50MΩ 0.1Ω ±(0.9%+1) ±(0.9%+1) ±(0.9%+1) Capacité 10000μF 1NF ±(1.2%+2) ±(1.2%+2) ±(1.2%+2) Fréquence 100kHz 0.01Hz ±(0.1%+1) ±(0.1%+1) ±(0.1%+1) Température -40 à +400°C 0.1°C ±(1.0%+10) 353 355 Mesures RMS vrai ✓ ✓ Affichage rétro-éclairé ✓ ✓ Courant de démarrage moteur ✓ ✓ Min/Max/Moy. ✓ ✓ Tension AC/DC — ✓ Mesure de résistance — ✓ Indicateur sonore de continuité — ✓ Mesure de fréquence* — 5Hz à 0.9kHz Fluke 287 et Fluke 289 Code Prix Unitaire Réf. Fab. Commande 1+ FLUKE 175 355-8678 g232,00 FLUKE 177 355-8680 g266,00 FLUKE 179 355-8691 g294,00 Accessoires C90 424-018 g30,00 ToolPackTPAK 302-9578 g29,00 80TK 424-080 g105,00 80T-IR 479-652 g193,00 • Affichage numérique 50 000 points, résolution de ¼ VGA avec rétroéclairage • Fonction d’enregistrement avec TrendCapture pour une révision facile des données enregistrées • Mesures en RMS vrai (AC et AC+DC) • Interface USB optique de communication • Mémoire interne pour un enregistrement autonome sur plus de 200 heures • Mesure de courant jusquà 20A (30s), 10A en continue Multimètres - Série 170 Code Prix Réf. Fab. Commande Unitaire FLUKE-353 155-3580 g463,45 FLUKE-355 155-3581 g643,25 • Mesures en valeurs efficaces vraies CA • Affichage 6000 points avec bargraphe • Rétro-éclairage sur modèles 177 et 179 • Mode d’ enregistrement valeurs min., max., moyenne avec alerte sur valeurs minimale et maximale • Mode de lissage permettant de filtrer les variations rapides en entrée Pinces multimètres industrielles 353 355 Mesures RMS vrai Ì Ì Affichage rétro-éclairé Ì Ì Courant démarrage moteur Ì Ì Min / Max / Moyenne Ì Ì Tension AC/DC Ì Mesure de résistance Ì Test de continuité avec indicateur sonore Ì • Capture de crête pour l’enregistrement jusqu’à 250μs • Min/Max/Moy avec horodatage permettant d’enregistrer les fluctuations du signal • Sorties protégées conformément à la norme EN61010-1 CAT III 1000V / CAT IV 600V • Livré avec cordons de test siliconés TL71, porte-sondes, 6 piles AA (installées) et manuel Caractéristiques supplémentaires du Fluke 289: • Filtre passe-bas pour des mesures précises de la fréquence et de la tension • Fonction de faible impédance d’entrée • Gamme de 50Ω pour mesurer et comparer les différences de résistance des enroulements de moteur, ou effectuer des mesures de faibles résistances ou d’autres résistances de contact Série 353 et 355 Kit combo FlukeView 289FVF: comprend le multimètre Fluke 289, les accessoires ci-dessus et en plus: pinces crocodiles, thermocouple 80BK, logiciel de formes FlukeView, câble de données et valise de transport. 353 355 Gamme Précision Courant AC/DC 0 - 2000A dc (1400A ac) ±(1.5%+5 chiffres) ±(1.5%+5 chiffres) Tension AC/DC 0 - 1000V dc (600V ac) ±(1.0%+5 chiffres) Résistance 0 - 400kΩ ±(1.5%+5 chiffres) Fréquence 5Hz - 1MHz ±(0.2%+2 chiffres) Test de continuité (355 uniquement) <30Ω • Mesure de fréquence et de capacité • Mesure de température (179) • Mesure de diodes et de continuité avec avertisseur acoustique • Etui de protection • EN61010-1 CAT IV 600V / CAT III 1000V Code Description Réf. Fab. Commande Prix Unitaire Multimètre 287 142-2691● g499,00 Multimètre 289 142-2692● g539,00 Kit combo FlukeView 289/FVF 142-2693● g621,00 Permet de prendre des mesures fiables grâce aux pinces multimètres TRMS Fluke 353 et 355; un outil de référence pour les mesures à A partir de g232,00 CODE COMMANDE 355-8678 Prix Unitaire Réf. Fab. Code Commande 1+ 353 150-3749 g439,00 355 150-3750 g599,00 pince du courant élevé jusqu’à 2 000 A. La mâchoire très large s’adapte facilement autour des conducteurs de grande taille, caractéristiques des applications présentant un courant élevé. La conception extrêmement robuste et la certification CAT IV 600 V et CAT III 1 000 V offrent également une meilleure protection de l’utilisateur lors des mesures dans des environnements haute tension. Pinces de courant TRMS Les mesures de crête précises peuvent être effectuées à l’aide du mode de mesure de courant de démarrage, idéal pour les moteurs et les charges inductives. La Fluke 355 mesure aussi la tension et la résistance, ce qui en fait la pince de courant idéale pour les applications électriques, les électriciens et les techniciens de maintenance. Série Fluke 350 l=98 H=300 P=52mm. Poids 814g Livrées avec les accessoires suivants: Fluke 353: Pince multimètre 353, sacoche de transport C43, 6 piles AA, manuel d’utilisation Fluke 355: Pince multimètre 355, sacoche de transport C43, 6 piles AA, cordons de mesure en caoutchouc avec gaine en silicone TL224 de 1,5m, sondes de test TP2 (2 mm), pinces crocodile AC285, manuel d’utilsation • Mesures fiables en RMS vrai, idéales pour les mesures de courant élevé jusqu’à 2000 A • Mâchoires extra-larges s’agrippant facilement autour de larges conducteurs, qui se trouvent dans les applications typiques avec courant élevé • Certifié CATIV 600 V, CAT III 1000 V • Mesures de crête précises avec mode de courant d’urgence - idéale pour les moteurs et charges inductives • Filtre passe-bas pour aplanir des charges bruyantes et des lectures stabilisées Accessoires inclus: Fluke 353: sacoche souple C43, 6 piles AA, manuel d’utilisation Fluke 355: sacoche souple C43, 6 piles AA, kit de test silicone SureGrip TL224, kit pointes de touche fines et étroitesTP2 (2 mm), kit de pinces crocodile SureGrip® AC285, manuel d’utilisation. A partir de g439,00 CODE COMMANDE 150-3749 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Testo 72 Test et Mesure Vitesse d’air Température Humidité (410-2 uniquement) Gamme de mesure 0.4 à 20 m/s -10 à 50°C 0 à 100 %rh Résolution 0.1 m/s 0.1°C 0.1 %rh Précision ± 0.2 m/s + 2% m.v. ± 0.5 °C ± 2.5 %rh (5 à 95 %rh) Unités m/s, km/h, fpm, mph, knots, temp. perçue °C/°F, Beaufort °C/°F %rh, humidité, point de rosée Température de fonctionnement -10 à 50°C Type de piles 2 piles alcaline AAA Autonomie de la pile 100h (410-1), 60h (410-2) (en moyenne, sans l’affichage rétro-éclairé) Dimensions 133 x 46 x 25mm (avec capuchon de protection) Gamme de mesures 0 à 99.999 Lux 1 Lux (0 à 19.999 Lux) 10 Lux (20.000 à 99.999 Lux) Précision ± 3% (par rapport à la référence) Unités Lux, Footcandle Température de fonctionnement 0 à 50°C Type de piles Alcaline (2 x AAA) Autonomie de la pile 20h (en moyenne, sans l’affichage rétroéclairé) Dimensions (avec capuchon de protection) 133 x 46 x 25mm Réf. Fab. Code Commande Prix Unitaire 410-1 147-1402 g117,00 410-2 147-1403 g183,00 Thermomètre de poche Luxmètre Moisissure Humidité ambiante (606-2 uniquement) Temp. ambiante (606-2 uniquement) Gamme de mesures 0 à 90% 0 à 100%rh -10 à 50°C Résolution 0.1 0.1%rh 0.1°C Précision ± 1% (Conductivité) ± 2.5%rh (5 à 95%rF) ± 0.5°C Unités - %rh, humidité, point de rosée °C/°F Température de fonctionnement -10 à 50°C Type de piles 2 piles alcaline AAA Autonomie de la pile 200h (606-1), 130h (606-2) (en moyenne, sans l’affichage rétro-éclairé) Dimensions 119 x 46 x 25mm (avec capuchon de protection) Réf. Fab. Code Commande Prix Unitaire 606-1 147-1400 g108,00 606-2 147-1401 g195,00 Anémomètres de poche 810 540 410-1 et 410-2 • Mesure de la température ambiante et température de surface infrarouge en un seul appareil • Mesure infrarouge avec visée laser 1 point et optique 6:1 • Affichage du delta de température, par ex. entre la température de fenêtre et ambiante • Affichage de la différence entre la température de l’air et température de surface • Gel de l’affichage et valeurs max./ min. • Affichage avec rétro-éclairage • Arrêt automatique • Livré avec protocole d’étalonnage, lanière, porte-ceinture, capuchon de protection et piles Hygromètres de poche • Capteur adapté à la sensibilité du spectre de l’oeil • Gel de l’affichage • Mesure valeurs max./min. • Affichage avec rétro-éclairage • Arrêt automatique • Livré avec protocole d’étalonnage, lanière de transport, étui pour ceinture, capuchon de protection et piles Seulement g135,00 CODE COMMANDE 147-1404 606-1 et 606-2 Deux modèles disponibles: 410-1 mesure la vitesse d’air et la température 410-2 mesure la vitesse d’air, la température et l’humidité Seulement g106,50 CODE COMMANDE 147-1398 Deux modèles disponibles: 606-1 Mesure de moississure 606-2 Mesure de moississure, température de l’air et humidité • Sonde à hélice intégrée Ø 40mm • Calcul de la moyenne temporelle • Gel de l’affichage et valeurs min./max. • Calcul de la vitesse du vent (échelle de beaufort) • Affichage avec rétro-éclairage • Arrêt automatique • Livré avec protocole d’étalonnage, lanière, porte-ceinture, capuchon de protection et piles Température de surface Gamme de mesures -30°C à 300°C Résolution 0.1°C Précision ± 2.0°C (-30 à +100°C, ± 2% m.v. gamme restante) Optique 6:1 Température de l’air Gamme de mesure -10 à 50°C Résolution 0.1°C Précision ± 0.5°C Unités °C/°F Caractéristiques générales Température de fonctionnement -10 à 50°C Type de piles 2 piles alcaline AAA Autonomie de la pile 50h (en moyenne, sans l’affichage rétro-éclairé) Dimensions (avec capuchon de protection) 119 x 46 x 25mm • Mesures précises de l’humidité du bois grâce aux courbes caractéristiques mémorisées dans l’appareil • Courbes caractéristiques pour les matériaux de construction • Gel de l’affichage • Affichage avec rétro-éclairage • Arrêt automatique • Livré avec protocole d’étalonnage, lanière, porte-ceinture, capuchon de protection et piles Caractéristiques supplémentaires pour le 606-2: • Mesure de l’humidité et de la température ambiante pour le contrôle des procédures de séchage RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Metrix et Chauvin Arnoux 73 Test et Mesure Code Prix Unitaire Description Réf. Fab. Commande E-oscilloscope virtuel MTX 2x150MHz MTX1052-PC 155-8615 g1090,00 E-oscilloscope virtuel MTX 4x150MHz MTX1054-PC 155-8616 g1590,00 Oscilloscopes numériques analyseurs-enregistreurs Scope in@box Description Réf. Fab. Code Commande Prix Unitaire E-oscilloscope numérique 2x60MHz SD N&B OX6062E-MSD 155-8617 g1030,00 E-oscilloscope numérique 2x60MHz SD Couleur OX6062E-CSD 155-8618 g1130,00 E-oscilloscope numérique 2x150MHz SD Couleur OX6152E-CSD 155-8619 g1330,00 E-oscilloscope numérique 2x200MHz SD Couleur OX6202E-CSD 155-8620 g1630,00 * Conditions d’application sur www.chauvin-arnoux.com Caractéristiques techniques CA1884 Matrice 160x120 pixels 50Hz Objectif 20°x15° Distance min. foc. 0.1m Gamme de mesure -20 à +250°C Résolution thermique 0.1°C (à 25°C) Positionnement 3 pts positionnables Détection Automatique max/min Alarme dépassement max/min oui Nbre images enregistrables 1000 images radiométriques dans 250 dossiers Affichage Ecran TFT monté sur axe Mise au point de l’image manuelle Pointeur laser oui Alimentation Batterie Li-Ion rechargeable via adaptateur externe Oscilloscopes numériques OX6000 version SD • Oscilloscopes virtuels avec analyse FFT, analyseur d’harmoniques et enregistreur • 2 ou 4 voies, 150MHz • Sensibilité verticale: 2.5mV à 100V/div • Profondeur mémoire 50k par voie et zoom dynamique • Ecran LCD tactile N&B ou couleur • 200Méch/s monocoup, 100Géch/s ETS et mode Glitch • Analyse FFT et fonctions de calcul en temps réel • Multi-fenêtrage jusqu’à 4 courbes à l’écran • Ethernet + serveur web, USB et compatible Wifi • Conformes IEC 61010-1 / CATII 300V • Livrée avec logiciel PC Scope in@box, sondes de tension 1/1-1/10-200MHz 300V (x2) et cordons Caméra thermographique RayCam • Ethernet + serveur web • Analyse FFT et calcul en temps réel • 2 multimètres TRMS 200kHz avec enregistreur • Sensibilité d’entrée de 150μV à 100V/div • Convertisseur 10 bits, 1 Géch/s monocoup, 50 Géch/s ETS • Stockage interne 2Mo + support de stockage SD card 2Go maxi • Garantie à vie* CA 1884 • Nouvelle caméra infra-rouge RayCam CA1884 offre des performances haut de gamme à un prix entrée de gamme • Possède de nombreux outils qui faciliteront la prise de mesure et la détecion des problèmes: alarme, détection automatique de point chaud / froid, isotherme, curseurs manuels • Ergonomique, outil très simple d’utilisation s’adaptant à toutes les situations • Ecran orientable • IP54 • Livrée en standard avec logiciel d’analyse RayCam Report pour une analyse très fine du thermogramme et la création de rapport personnalisé pour une meilleure traçabilité des inspections 2 voies 60MHz, 150MHz et 200MHz Seulement g3950,00 CODE COMMANDE 155-8613 MTX1052-PC et MTX1054-PC Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Sefram 74 Test et Mesure Code Prix Unitaire Modèle Réf. Fab. Commande 1+ Oscilloscope numérique 2x25Mhz BK2530 153-2985 g399,00 Générateur de fonctions DDS 7MHz BK 4007DDS 136-7291● g320,00 Générateur de fonctions DDS 15MHz SEFRAM 4415 136-7294● g550,00 Générateur de fonctions DDS 120MHz BK4087 153-2987● g1490,00 Alimentation triple programmable BK 9130 136-7290● g795,00 Code Prix Description Réf. Fab. Commande Unitaire Mini-enregistreur de températures IP68 SEFRAMLOG1501P 122-5538● g169,00 Mini-enregistreur de températures + humidité SEFRAMLOG1520P 122-5539● g287,00 Kit logiciel interface IR SI693 122-8156 g147,90 Code Prix Réf Fab. Commande Unitaire BK5491A 122-5519● g463,05 BK5492 122-5520● g690,00 BK5492GPIB 122-5518● g870,00 A partir de g320,00 CODE COMMANDE 136-7291● Multimètres de table numériques RMS vrai Mini-enregistreurs de BK 5491A, BK 5492 et BK5492 GPIB températures et hygrométrie • Mesures AC RMS vrai et AC+DC SEFRAM LOG 1501P et 1520P • Affichage double • Bande passante 30Hz à 100kHz • Fonctions: mode relatif, MIN, MAX, HOLD et COMP • Mesure DBm • Test de diode et de continuité • Interface RS 232 • Conforme IEC61010-1 Cat II 600V Modèle 5491A: • Mini-enregistreurs de grandeurs physiques telles que la température et l’humidité • Enregistrements faciles, pointus et fiables, pour des applications variées • Récupération des données par interface infra-rouge • 2 alarmes entièrement programmables • Valeurs récupérables à tout moment • Affichage LED 50 000 points Modèle 5492: • 51⁄2 chiffres, affichage sélectionnable 120 000 / 40 000 / 4 000 points • Taux d’échantillonnage sélectionnable • Mesure de résistance en 2 ou 4 fils Modèle 5492 GPIB: • Idem au modèle 5492 en version IEEE sans interrompre l’enregistrement • Kit logiciel interface infra-rouge avec câble USB disponible séparément (122- 8156) Nota: les 2 modèles sont compatibles avec les assistants personnels de type PALM PDA compatible (MI30, Zire 31, 72, Tungstène E2, T3, T5) Dimensions: 42x57x25mm, Poids = 52g RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Elc 75 Test et Mesure Code Prix Description Réf. Fab. Commande Unitaire Boîtes à décades Boîte à décades résistive DR05 334-6699 g105,00 Boîte à décades résistive DR06 334-6705 g119,00 Boîte à décades résistive DR07 334-6717 g134,00 Boîte à décades capacitive DC05 334-6729 g195,00 Boîte à décades inductive DL07 334-6730 g186,06 Code Prix Code Prix Description Réf. Fab. Commande Unitaire Description Réf. Fab. Commande Unitaire Alimentations de laboratoire Alimentation 12V 5A ALF1205 491-6086 g70,00 Alimentation 24V 800mA AL912A 334-6596 g38,50 Alimentation 12V 10A ALF1210 491-6104 g124,00 Alimentation 5 à 29V 4A à 2A ALF2902M 434-0474 g80,00 Alimentation 12V 25A ALF1225 112-3218 g200,00 Alimentation 24V 5A ALF2405 129-0015● g119,00 Alimentation ±15V 2A ALF1502D 151-0795● g85,00 Alimentation 12V 1A AL911A 129-0014● g36,50 Code Prix Description Réf. Fab. Commande Unitaire Générateurs de fonctions Générateur de fonctions 5MHz GF265 489-6403 g345,00 Générateur de fonctions 12MHz GF266 489-6415 g490,00 Générateur de fonctions 5MHz GF467F 857-3883 g305,00 Code Prix Code Prix Réf. Fab. Commande Unitaire Réf. Fab. Commande Unitaire CP 910A. 334-6766 g6,10 ALE2405. 491-6130 g106,00 ALE1205. 489-7493 g68,00 ALE2412 112-3217 g180,00 ALE1210. 491-6128 g115,00 ALE2902M. 411-4188 g75,00 ALE1225 112-3216 g185,00 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 XP 76 Alimentations Alimentations Tension d’entrée 90-264 VAC (120-370 VDC) Fréquence 47-63 Hz Tension de sortie Voir tableau Ajustement de la sortie ±5% Precision initiale ±1% Régulation de ligne ±0.5% Régulation de charge ±1%, 1-100% de la charge (voir note 4) Ondulation et bruit 50 mV (Vo ≤ 5 V), 1% (Vo ≥ 12 V) (voir note 2) MTBF 150 000Hrs min en MIL-HDBK-217F Emissions FCC Part 15 & EN55022 niveau B Normes de sécurité UL60950, CSA C22.2 No. 950, EN60950-1:2001, CE Mark LVD, Conforme SEMI F47 (ligne haute seulement) à 100% de la puissance de sortie Sortie 1 Sortie 2 Sortie 3 Sortie 4 Code Réf. Fab. Commande Prix Unitaire HUL300-12 12V/25A 100-5699● g266,07 HUL300-13 15V/20A 100-5700● g266,07 HUL300-14 24V/12.5A 100-5701● g266,07 HUL300-18 48V/6.25A 100-5702● g266,07 HUL300-40 +5V/30A +12V/10A -5V/2A F 12V/2A 100-5709● g292,53 Accessoires HUL300 F/Cache 100-5714● g35,28 HUL300 Kit de Raccordement 100-5712● g4,04 Tension d’entrée 85-264 Vca (120-370 Vcc) Frequence d’entrée 47-63 Hz Régulation de ligne 0.5% maximum Régulation de charge <±1% (simple sorties) Réponse au signal <4% max. dérivation de 1% à 500 μs pour une charge de 25% Ondulation et bruit 3.3-5 V versions: 50 mV cr-cr, 12-15 V versions: 120 mV cr-cr, 24-48 V versions: 200 mV cr-cr, 20MHz BW Rendement 72%-82% Températures d’utilisation 0°C à +70°C,Réduction linéaire de la valeure nominale de 100% à +50 °C de 50% à +70 °C MTBF >500 kHrs per MIL-HDBK-217F Normes de sécurité EN60950, UL60950, CSA22.2 No. 234 par cUL CEM EN55022, Classe B conduit Tension de Courant de Réf. sortie sortie Fab. Code Commande 12V 62.5A SMR800PS12 143-6109 15V 50A SMR800PS15 143-6110 24V 33.39A SMR800PS24 143-6111 27V 29.62A SMR800PS27 143-6112 48V 16.67A SMR800PS48 143-6113 Puissance Tension Courant de sortie (A) Code Commande Prix Unitaire Réf. Fab.* de sortie (W) de sortie (V) Nominal Crête Montage CI Montage châssis ECL10US3V3 8.6 3.3 2.6 3.38 128-9130● 128-9138● g29,40 ECL10US05 10 5 2 2.6 128-9131● 128-9131● g29,40 ECL10US09 10 9 1.1 1.43 128-9132● 128-9140● g29,40 ECL10US12 10 12 0.83 1.08 128-9133● 128-9141● g29,40 ECL10US15 10 15 0.67 0.87 128-9134● 128-9142● g29,40 ECL10US24 10 24 0.42 0.55 128-9136● 128-9143● g29,40 ECL10US48 10 48 0.21 0.27 128-9137● 128-9144● g29,40 * Suffix: -P = Montage CI, -T = Montage Châssis Alimentations simple et multi-sorties 300 W Réf. Fab. Code Commande Prix Unitaire SMR800PS12 143-6109● g551,25 SMR800PS15 143-6110● g551,25 SMR800PS24 143-6111● g551,25 SMR800PS27 143-6112● g551,25 SMR800PS48 143-6113● g551,25 Correction du facteur de puissance Série ELC 10W - Montage CI ou Châssis H = 50.8, W = 108.0, L = 203.2 (mm) Alimentation ca/cc miniature Alimentation 800 W Simple sortie L’alimentation SMR800 est une simple sortie, forte puissance, recommandée pour les applications industrielles qui nécessitent une tension de sortie stable, une grande fiabilité et une protection en l’entrée. La dernière génération d’alimentation ac/cc miniature offrant 10W en puissance de sotie. Disponible en version montage CI ou montage châssis avec des sorties de 3.3-48V. • Conformes à EN61000-3-2 • Taille compacte • Jusqu’à 4.4 W/in³ • Entrée à sélection automatique de gamme • Signal de panne d’alimentation électrique • 4e sortie flottante • Conformes aux normes de sécurité internationales • Simple sortie de 12V à 60V • Conforme SEMI F47 • Ventilateur intégré • Contrôle de courant, "power good" et "remote on/off" • Capteur Une gamme d’unités d’alimentation compactes et économiques à sorties simples et multiples, convenant aux applications à refroidissement forcé par circulation d’air et par convection. Ces unités sont montées sur des châssis en U et disponibles avec un cache en option. • Montage CI ou châssis • Châssis ouvert • Taille ultra compacte • Simple tension de sortie de 3.3 à 48V • Tension d’entrée = 85-264Vca • Gamme de température = de 0°C à 70°C • Dimensions (LxlxP): 45.72x22.86x25.4mm (Montage CI); 58.04x21.59x18.47 (Montage châssis) Compacte RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Weller 77 Soudage Seulement g714,00 CODE COMMANDE137-8427● Composition modèle WR 3000M (133-9573) :WR 3M ; fer à air chaud HAP 200 et support de sécurité WDH 30 ; Fer de dessoudage DSX 80 et support de sécurité WDH 30; Fer à souder WP 80 et tablette de sécurité Stop + Go WDH 10 ; pincette à vide WVP ; nettoyeur à sec WDC 2 ; câble de réseau standard. Composition modèle WR 3000M (133-9575) :WR 3M; fer à air chaud HAP 200 et support de sécurité WDH 30 ; fer de dessoudage en ligne DXV 80 et support de sécurité WDH 30 ; fer à souder WP 80 et support de sécurité Stop + Go WDH 10 ; pincette à vide WVP ; nettoyeur à sec WDC 2, câble de réseau standard et version britannique. Weller Le kit comprend : • 1 station de soudage WD1000 de Weller • 1 distributeur de soudure universel Weller • 1 bloc étameur de pannes Multicore • 1 bobine 250g de soudure sans plomb Sn97.1Ag2.6Cu0.3 No Clean 0.5mm Multicomp Station de soudage - WS81 Kit de soudage RoHS 80W - Antistatique • Système de filtration à niveaux de haute qualité comprenant: - Filtre pour poussière fine de classe F5 (paquet de 10) - Filtre combiné à particules gaz H12 Puratex, garantie une filtration efficace à 99.5%. • Turbine sans entretien (1800 Pascal), permet une aspiration continue à un débit d’air maximal de 220m³/h • Niveau sonore faible, moins de 55dBA • Supporte jusqu’à 2 postes de travail avec un kit bras d’extraction simple en option (Code Commande: 137-8431) • Kit d’extraction comprenant un bras d’extraction de fumée Description Réf. Fab. Code Commande Prix Unitaire Station avec fer à dessouder DSX 80 5 33 686 99 133-9573● g1990,00 Station avec fer à dessouder DXV 80 5 33 683 99 133-9575● g1990,00 • Régulation électronique de la température • Peut-être utilisée avec tous les alliages sans plomb • Température réglable de 150°C à 450°C • Compatible avec tous les fers Temtronic jusqu’à 80W • Reconnaissance Station de réparation innovante WR 3000M Système d’aspiration de fumée portable WFE 2ES 230V automatique du fer utilisé • La station comprend un bloc PU81, un fer antistatique WSP80 équipé d’une panne LT-A et un support WPH80 • Station de soudage digitale 80W programmable avec fer à souder type WP 80 • Peut être utilisée avec tous les alliages sans plomb • Station de réparation polyvalente • Conçue spécifiquement pour effectuer des réparations de modules électroniques à la pointe de la technique de fabrication industrielle, et pour le secteur des réparations et des travaux de laboratoire • 3 canaux d’outils indépendants avec détection automatique des outils permettant un fonctionnement simultané des outils • Température précise en bout de panne grâce à la régulation très haute performance gérée par microprocesseur associée à un excellent transfert thermique • Mesure de température effectuée par l’intermédiaire des sondes ultra rapides, permet une très grande réactivité afin d’éviter un temps de réponse et une variation de température trop importants • Tous les outils Weller High-Speed Micro tels que le microfer à souder WMRP et les micro brucelles de dessoudage WMRT peuvent être raccordés • Accèpte également des fers plus puissants, tels que le nouveau fer à air chaud HAP 200 • Avec mini port USB pour des applications ISO • Livré avec logiciel de commande pour la mise en place des paramètres de la station, le contrôle par PC des paramètres et l’enregistrement des données • Fonctions innovantes telles que le changement automatique de l’affichage de la température suivant l’outil utilisé, 3 températures re-programmées, et des vérifications d’étalonnage en usine Seulement g199,00 CODE COMMANDE 380-4379 • Régulation électronique contrôlée par un microprocesseur • Température réglable de 50°C à 450°C • Affichage LCD • Anti-statique • 3 températures différentes programmables pouvant être sélectionnées par simple pression sur un bouton • Plusieurs fonctions: contrôle et calibrage de la température, programmation du temps après laquelle la station se met en veille (setback), verrouillage des paramètres de la station et une commande ID pour les applications ISO • Support de sécurité à 4 positions pour une meilleure ergonomie • Reconnaissance automatique de tous les fers et accessoires connectés • Utilise les pannes des séries LT et LT-LF 3 canaux indépendants Seulement g289,00 CODE COMMANDE 126-3871● Modèle WR 3M (avec DSX 80) Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 OKi 78 Soudage Doseur numérique DX-200 Série MX-500 Un système de dosage précis avec contrôle d’aspiration pour toutes Code Prix Pack Réf. Fab. Commande Unitaire Système complet pour 2 postes avec 2 bras flexibles de 1.2m, Pré-HEPA-Gas 1 BVX-201-KIT 802-6181 g703,00 Pièces détachées Système sans bras pour 2 postes, Pré-HEPAGas 1 BVX-201 802-6190 g580,00 Bras flexible ESD, 1.22m sans buse 1 BVX-ARML 802-6203 g90,00 Bras BVX (600mm) avec tuyau de 1.83m et support de table 1 BVX-ARM-K1 802-6211 g131,00 Pré-Filtre (Paquet de 5) 5 FP-BVX200 802-6220 g47,00 Filtre à gaz, HEPA 99.95% Charbon actif 1 FM-BVX200 802-6238 g86,00 Filtre à gaz 1 FG-BVX200 802-6246 g160,00 Retrouvez tous les accessoires et les pannes sur notre site internet www.farnell.fr Tension 220V acV c.a. 50Hz Puissance 400W Type de pompe Diaphragme Débit d’air 6-25 Litres/min. Températures 100°C - 500°C Dimensions (HxlxP) 140x170x210mm Niveau sonore <46 dBA Poids 4.7kg Réf. Fab. Description Code Commande Prix Unitaire MX-500S-21 Station de soudage 2 entrées 495-0343 g479,00 MX-500TS-21 Système de soudage/Talon 2 entrées 495-0355 g819,00 MX-500DS-21Système de soudage/dessoudage 2 entrées 495-0367 g896,00 Stations de soudage Contient: station à air chaud manuelle, outil à main et buse 5mm H-D50 Tension 90-240 V ac 50-60Hz Puissance 50W Puissance de sortie 35W Dimensions (HxlxD) 100x70x161mm les viscosités de fluide avec l’utilisation de seringues à air jetables. Un contrôleur offre des cycles de dosage précis et répétitifs. L’aspiration réglable permet de contrôler l’écoulement des gouttes de fluide entre les cycles de dosage. Ce système polyvalent et économique Système d’extraction de fumées BVX-201 La station HCT-900 est un outil polyvalent à air chaud pour souder et dessouder les composants CMS. La station HCT-900 est une solution de réparation polyvalente pour un large panel d’applications, compatible avec les applications sans plomb. Elle est robuste, compacte et simple à utiliser comportant un contrôle analogique du débit d’air et de la température. comprend un affichage numérique pour un réglage de temps de dosage précis par l’utilisateur. La plage de pression d’utilisation du DX200 s’étend de 0 à 6.9 bar (100psi) pour des applications générales. Livré avec: interrupteur de pas micro, support de seringue, support pour l’air en ligne, tête receveur, aiguilles les plus utilisées et manuel d’utilisation. MX-500DS - Station de dessoudage et de réparation Le système utilise de l’air comprimé pour créer un vide venturi pour le nettoyage rapide et efficace des trous du circuit imprimé. La récupération de la soudure dans un papier absorbant à l’intérieur du réservoir de la poignée facilite la maintenance et constitue une amélioration par rapport aux tubes en verre conventionnels. Note: Requiert une source d’air comprimé Système de soudage SmartHeat PS-800E Pour 2 postes • Alimentation auto-ajustable acceptant une tension de 100-240 V c.a. • Connecteur 6mm push pour la connexion de l’air entrant • Plage de durée numérique de 0.008-99.999 sec • Interrupteur de pas micro inclus • Faible empreinte • Affichage LCD • Certifié CSA et CE • Système d’extraction de fumées conçue pour 2 postes • Extraction puissante et filtration efficace supérieure à 99.5% • Fonctionnement silencieux • Kit comprenant un système d’extraction, 2 bras flexibles de1.2m, un filtre Pré-HEPA-Gaz • Design compact • Pas de calibration nécessaire • Technologie SmartHeat • Design unique en 2 parties, bobine d’induction séparée de la panne chauffante • Idéal pour les applications de soudage répétées • Répond aux exigences du soudage sans plomb avec des températures élevées Comprend: bloc alimentation, manche avec élément chauffant, support de fer avec éponge et tapis extracteur de panne Note: Utilise les pannes de la série SFV-Cxxxx Station de réparation à air chaud HCT-900 Seulement g399,00 CODE COMMANDE 127-7189● Seulement g215,00 CODE COMMANDE 127-7186● MX-500TS - Station de réparation système Talon Le design de la pince Talon procure des performances supérieures, un confort et un contrôle optimum. Fournie avec pince Talon, fer à souder MX-RM3E avec cordon et support de fer MX-WS4 Réparation de composants CMS (Soudage / Dessoudage) Seulement g508,00 CODE COMMANDE 101-5504● MX-500S - Station de soudage et réparation Fournie avec fer à souder MX-RM3E avec cordon et support de fer MX-WS4 RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Pace / Duratool / Ersa 79 Soudage Code Description Réf. Fab. Commande Prix Unitaire ST50-TD100 8007-0514 127-9326● g218,00 Composition de la station: bloc d’alimentation, fer à souder avec panne conique, pistolet à dessouder avec 3 pannes coniques, support ZD-10K avec éponge et manuel d’instructions (anglais). Code Description Commande Prix Unitaire Station bleue 149-8366● g52,44 Station ESD noire 149-8367● g59,28 Niveau de Temp. Temp. Code Prix Unitaire Réf. Fab. Couleur Temp. °C °F Commande 1207-0446-01-P1 Vert 5 260 500 127-9376● g10,00 1207-0446-02-P1 Turquoise 5.5 288 550 127-9377● g10,00 1207-0446-03-P1 Orange 6 316 600 127-9378● g10,00 1207-0446-04-P1 Or 6.5 343 650 127-9379● g10,00 1207-0446-05-P1 Rouge 7 371 700 127-9380● g10,00 1207-0446-06-P1 Violet 7.5 399 750 127-9381● g10,00 1207-0446-07-P1 Noir 8 427 800 127-9382● g10,00 1207-0446-08-P1 Argent 8.5 454 850 127-9383● g10,00 Station de soudage comprenant: 0IC103A Bloc d’alimentation, 230/24V 0100CDJ Fer à souder i-TOOL avec panne 0102CDLF16, 24V, 150W, antistatique 0A48 Support de fer, anti-statique Stations de soudage avec régulation de température Caractéristiques: Tension 197-253V c.a., 50Hz 120 W max. à 230V c.a., 50Hz Gamme de températures 176°C à 482°C Stabilité thermique ±1.1°C de la température de la panne au repos Code Prix Réf. Fab. Description: Commande Unitaire I-CON Station de soudage 120-3962● g411,14 Pièces détachées I-TOOL Fer à souder avec panne 120-3963● g156,94 010100J Elément chauffant pour i-TOOL 120-3965● g66,32 • Contrôle de la température par simple bouton (haut/ bas) • Sécurisée, fonctionnement du fer en 24V basse tension • Support complet intégré • Tiroir pour éponge • Disponible en version antistatique • Bouton marche/arrêt et fusible • Gamme de pannes Caractéristiques techniques Tension 230V (220-240V) Puissance 60W soudage 80W dessoudage Plage de températures 160°C - 480°C Station de soudage numérique haute performance Le système de soudage et de réparation ST75-SX90 est idéal pour le soudage, dessoudage et extraction de composants avec une large gamme de brucelles et buses de dessoudage mais aussi avec le stylo à air chaud haute performance. La technologie de dessoudage SNAPVAC de Pace enlève de manière rapide et propre tout joint de montage en surface ou traversant. Station ERSA i-CON et Fer à souder i-TOOL ST50-TD100 Station mixte Seulement g586,00 CODE COMMANDE 127-9329● disponibles Station comprenant: bloc d’alimentation, fer à souder (avec panne pointue de 0.5mm), éponge, manuel d’instructions Note: l’éponge de remplacement doit être découpée à la taille du tiroir L’innovation ultime dans le brasage manuel • Système de contrôle thermique Intelliheat™ • Affichage numérique à LED de la température • Contrôle de la température par des Jacks à code couleur ZD-917 A partir de g52,44 CODE COMMANDE 149-8366● Cette station offre un contrôle de la montée en température, idéale pour le dessoudage de tous les composants et pour l’extraction des résidus de soudure. Les fers à souder et à dessouder peuvent être utilisés séparément ou au même moment. Le capteur de température placé au dessus de la panne permet de vérifier rapidement la température de la panne et de diminuer le risque de chute de la température de panne. Idéale pour les applications sans plomb. Haute Puissance et Performance: • Micro élément chauffant de 150W • Chauffe ultra rapide: de 30°C à 350°C en 9 sec. environ, Veille à 350°C en 3 sec. environ • Fonctions veille et arrêt automatique • Livrée avec le fer à souder universel TD100 • Pompe d’aspiration silencieuse • Verrouillage de la température • Temps de reprise ultra-rapide • Dernières innovations • Fonction d’alarme de process, avertit l’utilisateur si la température de la panne est hors process • 3 niveaux de puissance contrôlant les écarts • Fonction ASM - capteur de mouvement automatique pour la mise en veille Ergonomie optimum et facilité d’utilisation: • Distance panne/main ultra courte: 45 mm, Ultra court: 155 mm, Ultra léger: 30 gr. • Cordon léger et fin pour un confort maximum • Poignée bi-matière ‘Soft Pad’, ne chauffe pas pendant l’utilisation • Fonctionnement simple ‘Un Bouton’ avec le nouveau contrôle i-Op • Affichage multi-fonctions ultra large • Empreinte B: 150 mm x L: 175 mm x H: 100 mm • Détection automatique de 6 outils de soudage et dessoudage Station économique: • Economique, longue durée de vie, changement rapide des pannes conçues pour le sans plomb • Peu d’entretien, peu de coûts liés à la programmation et calibration • Haute productivité dans le brasage manuel • Système de contrôle thermique Intelliheat™ • Fonction Auto snap-vac, durée de vie des pannes améliorée • Accepte tout type d’outils Intelliheat de Pace (SX90 inclus) • Jack anti-statique de mise à la terre • Ne nécessite aucune calibration Seulement g182,40 CODE COMMANDE 149-8363● Station de soudage et réparation ST75-SX90 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Multicomp / Radiel Fondam 80 Soudage A partir de g12,00 CODE COMMANDE 136-0465● A partir de g18,47 CODE COMMANDE 101-5446● Alliage Sn97.1Ag2.6Cu0.3 Type de flux Moyennement activé, sans nettoyage Température de fusion 217°C - 224°C Température de la panne (Approx.) 350°C - 370°C Code Prix Réf. Fab. Commande Unitaire Stylo de flux 8ml 4UFXL248_BRUSH 136-0459● g32,00 Recharge de flux 250ml 4UFXL248_RECH 136-0460● g29,00 Stylo (pinceau) de flux de réparation FXL 248 Alliage Sn99Ag0.3Cu0.7 Type de flux Flux activé - 2.2% Température de fusion 217°C Température pannes 340 - 400°C Durée de Viscosité Application Type de produit Couleur polymérisation (Pa.s) Tous types de circuits MSP/2007 Blanc 15mn env. 46-51 Alliage Sn99Ag0.3Cu0.7 Type de flux No clean - 2.2% Température de fusion 217 - 227°C Température pannes 340 - 400°C Code Prix par Diamètre fil Commande Bobine Bobine de 250g 0.5mm 101-5459●g25,92 0.7mm 101-5460●g19,58 1mm 101-5462●g17,47 1.2mm 101-5463●g17,44 Bobine de 500g 0.7mm 101-5464●g38,09 1mm 101-5465●g34,87 1.2mm 101-5466●g34,74 Alliage Sn97.1Ag2.6Cu0.3 Températures de fusion 217°C - 224°C Température de la panne (Approx.) 350°C Soudure sans plomb Masque pelable "sans plomb" universel et sans odeur • Pour toutes applications de retouche ou de réparation • Flux sans-nettoyage développé spécialement : applications sans/avec plomb • Sans halogène, sans nettoyage, garantit la fiabilité des réparations • Contrôle parfait du volume déposé, facilité d’utilisation • Excellent mouillage, refusion sans microbillage autour du joint brillant • Adapté à tous types de finitions de composants ou circuits standards • Recharge disponible en flacon de 250ml, permet de recharger le stylo de 25 à 30 fois Code Prix par Bobine Diamètre Commande Bobine 500g 1mm 136-0468● g13,00 0.7mm 136-0469● g12,00 0.5mm 136-0470● g11,00 250g 1mm 136-0471● g10,94 0.7mm 136-0472● g11,44 0.5mm 136-0473● g12,66 Code Prix par Diamètre fil Commande Bobine Bobine de 250g 0.5mm 101-5443● g27,72 0.7mm 101-5444● g20,85 1mm 101-5445● g19,04 1.2mm 101-5446● g18,47 Bobine de 500g 0.7mm 101-5447● g40,51 1mm 101-5449● g36,93 1.2mm 101-5451● g36,73 Code Prix par Bobine Diamètre Commande Bobine 500g 1mm 136-0461● g23,00 0.7mm 136-0463● g24,00 0.5mm 136-0464● g26,00 250g 1mm 136-0465● g12,00 0.7mm 136-0466● g13,10 0.5mm 136-0467● g14,90 Soudure sans plomb Soudure sans plomb • Masque à polymérisation rapide adapté à toutes les finitions, y compris au cuivre passivé • Répond à l’ensemble des besoins de masquage • Sans odeur d’amoniaque • Convient aux plus hautes températures des process sans plomb mais aussi au plomb • Moyen simple et efficace pour épargner temporairement et localement les surfaces ne devant pas être brasées (visseries, pastilles, connecteurs etc.) • Flacon de 250 g • Polymérisation à température ambiante (accélérée à 60°C) Etain (97.1%)/ Argent (2.6%)/ Cuivre (0.3%) Seulement g32,00 CODE COMMANDE 136-0459● Soudure sans plomb Seulement g15,09 CODE COMMANDE 136-0458● • Flux sans nettoyage, moyennement activé • 5 canaux de flux • Contient 2.7% de flux - peu de fumée et peu de résidus • Un minimum de résidus transparents ne nécessitant pas de nettoyage • Conforme à la législation SAC0307 Sn99 Ag0.3 Cu0.7 Etain (97.1%)/ Argent (2.6%)/ Cuivre (0.3%) SAC0307 Sn99 Ag0.3 Cu0.7 • Idéale pour des applications électroniques exigeantes, grande fiabilité • Alliage brillant à faible teneur d’argent, composition économique • Flux sans-nettoyage garantissant la plus grande fiabilité • Excellent mouillage sur les métallisations usuelles • Flux réparti en 5 canaux : efficacité et quantité faible de résidus • Brasage sans projections, joints réguliers et brillants • Intervalle de fusion de 217-227°C - Température pannes : 340 - 400°C sans plomb • Convient pour des montages généraux sans plomb, sans nettoyage et pour la réparation de CI montés selon la procédure sans plomb/sans nettoyage • Sans plomb • Un canal de flux à base colophane • Résidus de couleur ambre ne nécessitant aucun nettoyage • Convient pour tous les assemblages électroniques sans plomb et les applications de réparation • Conformes à la législation sans plomb • Convient pour des applications électriques, électromécaniques ou de réparation • Alliage brillant à faible teneur d’argent, donc plus économique • Flux résineux activé réparti en 5 canaux facilitant un très bon étalement • Convient aux surfaces oxydées et à soudabilité médiocre • Intervalle de fusion de 217-227°C - Température pannes : 340 - 400°C A partir de g10,94 CODE COMMANDE 136-0471● RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Multicore 81 Soudage Largeur Longueur Code Prix Unitaire (mm) (m) Réf. Fab. Commande Bobines 1.5m 0.5 NC-MW 111-5476● g3,10 0.8 NC-OO 111-5541● g3,10 1.5 1.5 NC-AA 252-487 g3,16 2.2 1.5 NC-AB 252-499 g3,71 2.7 1.5 NC-BB 252-505 g4,01 Bobines 30m 0.8 NC-OO 30M 111-5542● g40,70 1.5 30 NC-AA30M 609-377 g45,07 2.2 30 NC-AB30M 609-389 g51,45 Alliage Sans plomb, Etain 96.5%, Cuivre 0.5%, Argent 3% Type de flux 5 canaux - flux colophane non-corrosif 309 (SAC305) Température de fusion 217°C Température de pannes (approx.) 340°C - 420°C Tresse à dessouder Code Prix Application Récipient Commande Unitaire Usage général Cartouche de 25g149-976▲ g23,33 Usage général Seringue de 25g 149-968▲ g20,20 Sérigraphie Pot de 500g 201-364▲ g113,71 Code Prix par Ø fil Commande Bobine 0.5mm 125-7142● g44,69 0.7mm 125-7143● g35,30 1.0mm 125-7144● g34,67 1.2mm 125-7145● g34,11 1.6mm 125-7148● g33,78 Flux de réparation en gel Soudure sans plomb Crystal 511™ Code Prix par Ø fil Bobine de Commande Bobine 0.5mm 250g 111-5458● g44,36 0.7mm 500g 111-5459● g42,94 1mm 500g 111-5460● g50,75 Soudure sans plomb (97SC) SAC305 "No Clean" • Flux en gel spécialement conçu pour la réparation et montage de compoants • Seringue optimisée pour une dépose précise • Sans halogène, formulation ne donnant qu’un minimum de résidus de couleurs claire et ne nécessitant pas de nettoyage Soudure sans plomb Crystal 400™ Crème à braser 96SC 511 3C 96SC 400 5C La tresse à dessouder est une tresse de cuivre spéciale souple, livrée en rouleaux dans un distributeur de bobine en plastique anti-statique ou non. Conçues pour le dessoudage anti-statique, les tresses à dessouder d’apport sont imprégnées d’une quantité réduite de décapant synthétique évitant pratiquement tout besoin de nettoyage qui dépend alors de la composition du décapant utilisé sur la soudure d’origine et l’état du Cl. Mode d’emploi. 1 Poser la tresse à dessouder sur la Seulement g19,29 CODE COMMANDE 453-547 • Soudure standard 3 canaux en combinaison avec l’alliage sans plomb SAC387 (96SC) • Idéale pour la réparation d’assemblages sans plomb ou pour la brasage manuel, compatibilité totale garantie avec les joints de soudure à fusion SMT • Distribution constante et égale du flux • Flux haute activité avec d’excellentes caractéristiques de mouillage sur les substrats difficiles Flux avec colophane 309 A partir de g20,20 CODE COMMANDE 149-968▲ soudure. 2. Appliquer la panne d’un fer à souder de 30 à 40W sur le dessus de la tresse pendant 1 seconde. 3. Enlever en même temps la tresse et le fer à souder. 4. Le raccord est dépourvu de métal; le composant peut être extrait, remplacé et ressoudé. 5. Couper la tresse à dessouder utilisée pour exposer une nouvelle surface prête à l’emploi. La tresse à dessouder élimine la décoloration, la corrosion et les pannes électriques. • Résidus de couleur pâle ne nécessitant pas de nettoyage • Peu d’odeur • Contient < 1.0% d’halogènure • Contient 5 canaux de flux 309 à base de colophane non-corrosif • Conforme aux directives sans plomb • Mélange de décapant et de poudre de soudure • Résidus transparents • Alliage étain (62), plomb (36), argent (2) • Soudure standard 5 canaux en • Crème spèciale pour les applications de sérigraphie combinaison avec l’alliage sans plomb SAC387 (96SC) • Distribution constante et égale du flux • Sans halogène • Flux No Clean, sans nettoyage • Résidus translucides • Alliages: Etain (Sn 95.5%), Argent (Ag 3.8%), Cuivre (Cu 0.7%) • Point de fusion 217°C (Température de la panne: 350°C à 370°C) • Classification J-STD ROL0 • Flux No Clean, sans nettoyage • Résidus translucides • Alliages: Etain (Sn 95.5%), Argent (Ag 3.8%), Cuivre (Cu 0.7%) • Point de fusion 217°C (Température de la panne: 350°C à 370°C) • Classification J-STD ROM1 • Disponible en bobine de 250g Ø0.23mm A partir de g33,78 CODE COMMANDE 125-7148● Seulement g37,05 CODE COMMANDE 111-5464● A partir de g42,94 CODE COMMANDE 111-5459● Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Outillage à main 82 Outillage Bâtonnets de test plomb direct Baguettes ESD "Magic Wands" rigide Code Prix Unitaire Modèle Applications Commande Pinces coupantes de côté arrondies tête ovale 2412E Pour des fils doux et tendres 132-6105 g44,50 2422E Pour des fils doux et tendres, dureté moyenne 132-6106 g44,50 2432E Seulement pour des fils tendres 132-6108 g44,50 Pince coupante de côté tête effilée 2477E Pour des travaux dans les endroits difficiles d’accès 132-6109 g47,50 Pince coupante en pointe tête droite 2470E Pour coupe horizontale et pour faciliter l’accès aux endroits très fournis. Uniquement pour de petits fils. 132-6110 g53,50 Pinces coupantes en pointe coudées, 30° 2403E Tête assez large et robuste. Pour coupes universelles 132-6111 g57,50 2404E Comparable au 2403E, avec une tête fine et arrondie 132-6112 g59,50 Pinces coupantes en pointe coudées, 45° 2482E Taille moyenne. Idéale pour les travaux sur CI pour la coupe d’élément DIL etc. Utilisable à 90° aussi bien qu’à 180°. 132-6113 g50,50 2475E Pour travaux de précision sur circuits hybrides ou micro-modules. Pour les travaux dans des endroits difficiles d’accès. 132-6114 g53,50 Pince coupante en pointe tête effilée 2476TX1Pour un travail parfait aux endroits étroits. Pince haute précision pour des fils inoxydables, cathéters, spirales par ex. Adèquate pour les applications médicales. 132-6115 g135,00 Pinces de pliage et de préhension 2411P Pince à becs demi-ronds très fins en pointe 132-6116 g44,50 2411PD Comparable au 2411P, mais striée à l’intérieur pour un maintien sûr. 132-6117 g49,50 2442P Pince à becs plats avec arêtes et sections polies 132-6118 g44,50 2443P Pince à becs ronds très précise et fine pour plier les fils par exemple. 132-6121 g46,50 • En titane • S’utilise avec des perceuses • Comprend les tailles suivantes: 0.3. 0.35. 0.4. 0.45. 0.5. 0.55. 0.6. 0.65. 0.7. 0.75. 0.8. 0.85. 0.9. 0.95. 1.0. 1.2. 1.3. 1.4. 1.5 et 1.6mm Idéales dans l’industrie électronique et dans les laboratoires, les différentes applications sont: • Sonde pour opérations de brasage classique et sans plomb Bâtonnets de test plomb LeadCheck facile à utiliser Troisième main Seulement g295,00 CODE COMMANDE 136-0343 Pince à dénuder • Permet de tenir en position un CI ou toutes petites pièces grâce aux deux pinces crocodiles sur toute surface, tournant instantanément au rose vif quand il y a présence de plomb • Outil de positionnement pour les opérations d’assemblage • Spatule de préparation et application de produits chimiques visqueux comme adhésifs • Racleur pour enlever les couches de protection acrylique, latex, agents de masquage ESD PEEK (CP) très rigides. Excellente résistance à l’usage et à l’abrasion. Haute résistance aux températures élevées (max. 300°C). Excellente résistance aux produits chimiques et agents agressifs. Brucelles "Smart Tweezers" • Jeu de 6 tournevis de précision comprenant un choix de tournevis torx: T5, T6, T7, T8, T9, T10 • Embouts en acier avec carbone haute qualité • Jeu livré dans un coffret Pinces coupantes et de pliage Jeu de 20 forets micro HSS • Pince automatique 5-en-1 conçue pour un dénudage facile des câbles • Outil à sertir pour les bornes isolées et non isolées 10-22AWG • Laisse les mains libres pour positionner, souder et assembler Série MagicSense 2400 • Mâchoires en acier avec ajustement automatique de 10-26AWG • Coupe-fils intégré • Longueur: 215mm Seulement g3,62 CODE COMMANDE 132-8720 Un LCR-mètre et identificateur de composants dans une seule paire de brucelles. Les brucelles Smart Tweezer déterminent automatiquement le type de composant Jeu de tournevis de précision Seulement g68,00 CODE COMMANDE 141-7755 Seulement g6,64 CODE COMMANDE 125-7167 (résistance/capacitance/ inductance) et sélectionne la gamme propre des mesures Seulement g8,00 CODE COMMANDE 312-5350 Code Réf. Fab. Description Commande Prix Unitaire MPT1.CP Embout fin - embout plat 125-6969 g6,00 MPT2.CP Embout très fin et courbée - embout plat 125-6971 g6,00 MPT3.CP Embout large et fin - embout plat et pointu 125-6972 g6,00 MPT123.CP Kit (MPT1, MPT2 et MPT3)Kit (MPT1, MPT2 & MPT3) 136-0344 g15,93 • Ressort Erem Magic intégré, breveté: tension constante du ressort, garanti plus de 1 millions d’opérations • Système de vissage autobloquant de très haute précision: mouvement libre, sans jeu des branches • coupe nette sans chevauchement des lames • Butée d’ouverture EMOS, limite d’ouverture Seulement g2,32 CODE COMMANDE 134-1141 des pointes à 5mm • Manche ergonomique pour un confort élevé et une bonne prise en main • Système de retenue des fils coupés • Lames trempées par induction avec une dureté Rockwell de 63-65 HRc • Protection ESD haute précision. L’unité affiche clairement le type de composant, le résultat de la mesure et les conditions de test. RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Outillage à main Facom 83 Outillage • Dimensions: 49.3 x 25.6 x 24.8cm Seulement g119,00 CODE COMMANDE 134-0969 Jeu de clés mâles pour vis 6 pans creux Jeu de 9 clés à fourches miniatures Micro-Tech Pince coupante Boîte outils PVC 19" • Coffret de 9 clés à fourches comprenant les tailles : 3.2 - 4 - 5 - 5.5 - 6 - 7 - 8 - 9 - 10mm • En coffret plastique : 123x95x28mm • Poids : 176g • Les clés mâles longues sont présentées dans un étui compact à volet rabattable permettant la sélection rapide de la dimension souhaitée électronique • Cette pince permet une coupe nette pour multimatériaux - du fil de cuivre à la corde à piano 0.5mm • Le modèle 405.10RMT possède une retenue de • Livré avec un sac à dos Facom offert • Coffret 1/4" pour le serrage et le vissage composé de: Monture de scie à métaux Seulement g49,00 CODE COMMANDE 431-2132 • Jeux métriques 83H.JP9, 83SH.JP9 comprenant : 1,5-2-2,5-3-4-5-6-8-10mm • Jeux US (en pouces) 83SH.JP8U comprenant : 3/32-1/8-5/32- 3/16-7/32-1/4-5/16-3/8 • NF/ISO 2936, DIN 911 Seulement g16,40 CODE COMMANDE 137-4160 A partir de g18,40 CODE COMMANDE 352-2751 Réf. Fab. : A.402J2 A.404J2 Capacité : 0.5-2.5 Nm 2-10 Nm Embouts : Fente 4.5 - 6.5 - 8mm 4.5 - 6.5 - 8mm Pozidriv PZ 1 - 2 - 3 PZ 1 - 2 - 3 6 pans mâles 3 - 4 - 5mm 4 - 5 - 6mm Accessoires : Porte-embout, poignée et clé de réglage • AEF.J5 : Coffret de 5 tournevis série Micro Tech : AEF.2x75 - 2.5x75 - 3x75 AEFD.0x75 - 1x75 • AEF.J6 : Coffret de 8 tournevis série Micro Tech : AEF.2x75 - 2,5x75 - 3x75 - 3,5x75 - 4x75 AEFP.00x75 AEFD.0x75 - 1x75 • AE.J1 : Coffret de 8 tournevis série Micro Tech : AE.1x35 - 1,2x35 - 1,5x35 - 1,8x35 - 2x35 - 2,5x35 AEP.000x35 - 00x35 - Douilles 6 pans : 5,5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14mm - D’un cliquet avec platine "paume de main" permettant de tenir la tête du cliquet pendant le serrage, sans manoeuvrer l’inverseur - D’une rallonge de 55mm et d’une de 100mm - D’un cardan restant dans la position initiale pour atteindre les endroits • Monture avec archet métallique coulissant destinée aux travaux de mécanique qui exigent précision et adaptabilité • Tension de lame: +100Kg • Livré avec une lame super HSS 666A.10 • Poids 760g chute évitant l’éjection du fil • ISO 9654 Coffret de tournevis Micro Tech difficilement accessibles et permettant de grandes économies de temps - D’un tournevis emmanché - D’un porte-embout cliquet - D’embouts RESISTORX N° 10 - 15 - 20 - 25 - 27 - 30 - 40 et 6 pans : 3 - 4 - 5 - 6 - 7mm, POZIDRIV N° 1 - 2 - 3, PHILLIPS N° 1 - 2 - 3 et plats : 4,5 - 6,5 - 8mm Seulement g25,60 CODE COMMANDE 352-2398 A partir de g36,20 CODE COMMANDE 352-1989 Code Prix Unitaire Réf. Fab. Commande A.402J2 442-1310 g222,00 A.404J2 442-1322 g224,00 • 2 compartiments et un plateau porte-outils amovible • Fermetures métalliques résistantes et cadenassables Nbre de Code Réf. Fab. tournevis Commande Prix Unitaire AEF.J5 5 365-4620 g24,60 AEF.J6 8 365-4631 g36,90 AE.J1 8 365-4643 g42,90 Tournevis dynamométriques à vernier Ø Cu-Ni ØFe30HRc Code Prix (mm) (mm) Réf. Fab. Commande Unitaire 1.4 0.7 405.10MT 352-1989 g36,20 1.2 0.7 405.10RMT 352-1990 g47,70 Nbre de Code Prix Unitaire Type clés clés Réf. Fab. Commande Longues 9 83H.JP9 352-2751 g18,40 Têtes sphériques 9 83SH.JP9 352-2763 g21,80 Têtes sphériques 8(us) 83SH.JP8U 352-2775 g24,70 BP.C19PB Coffret "RADIO" 1⁄4" Modèle trapu 37 pièces Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Outillage à main CK 84 Outillage Réf. Fab. T2371 • Douilles au chrome-vanadium • Surfaces moletées • Système ‘Sure Drive’ permettant d’appliquer un couple supérieur Longueur Longueur Coupe Coupe Code Type de tête hors tout de coupe acier doux cuivre Commande Ovale 120 9 0.6 1.2 872-283 Pointue, évidée 120 9 0.6 1 872-106 Pointue, évidée 120 9 0.6 1 872-118 Longueur Longueur Coupe Coupe Code Type de tête hors tout de coupe doux cuivre Commande Ovale 125mm 13mm 1.0mm 1.5mm 872-155 Ovale 125mm 13mm 1.0mm 1.5mm 872-167 Ovale 125mm 13mm 1.0mm 1.5mm 872-179 Poinçon Outil bien conçu et facile à utiliser pour différentes dimensions de support. L’outil se place dans deux coins opposés du support et extrait le C.I. en pinçant les bras plastiques de l’outil, en protégeant le C.I. et le support. Code Prix Réf. Fab. Commande Unitaire T3773 D-115 Avec chanfrein T3773 D-115 872-155 g30,54 T3773 DF-115 Micro chanfrein T3773 DF-115 872-167 g32,14 T3773 DEF-115 Rase T3773 DEF-115 872-179 g30,54 Jeu 1 Réf. Fab. T4883XESD Code Commande 725-4246 Lame parallèle 2.5 x 75, 3 x 100, 4 x 150, 4 x 150 Phillips 0 x 60, 1 x 80 Coffret de douilles métriques 1/4" ‘SURE DRIVE’ - 39 pièces Convient aux supports de 3M Textool, Augat et Harwin PLCC et prises similaires. Code Prix Coupe Réf. Fab. Coupe Commande Unitaire Micro chanfrein T3880 DF-110 Micro chanfrein 872-283 g33,71 Micro chanfrein T3766 DF-110 Micro chanfrein 872-106 g34,38 Rase T3766 DEF-110 Rase 872-118 g34,38 Type de mâchoires Longueur hors tout Longueur de mâchoires Code Commande Lisses 135 22 872-131 Striées 145 32 872-143 Striées 165 40 872-192 Code Réf. Fab. Commande Prix Unitaire 484001 128-3270 g10,66 484002 128-3271 g14,65 • Permet d’insérer les câbles téléphone et de données dans les bornes • Ajuste automatiquement les câbles lors du poinçonnage • Convient à de nombreuses bornes, y compris KRONE et similaires • Manche avec crochet tire-câble et lame de déverrouillage • Taille 180mm Seulement g28,58 CODE COMMANDE 128-3225 Code Réf. Fab. Commande Prix Unitaire T3772 D-120 872-131 g27,17 T3772-1D-120 872-143 g27,17 T3777 D-150 872-192 g33,26 Jeu 2 Réf. Fab. T4884X ESD Code Commande 939-8775 Lame parallèle 1.5 x 60, 2.5 x 75, 3 x 100 Phillips 0 x 60 Contenu:• Cliquet 1/4" à 45 dents • Douilles: 4, 4.5, 5, 5.5, 6, 7, 8, 9, 10, 11, 12, 13, 14mm • Embouts de vissage à fente: 4, 5.5, 7mm Pince coupante diagonale Pince coupante diagonale Couteau d’électricien • Embouts de vissage Phillips: PH1, PH2, PH3 • Embouts de vissage Pozidriv: PZ1, PZ2, PZ3 • Embouts de vissage Torx percé: T8, T10, T15, T20, T25, T27, T30, T40 • Embouts de vissage 6 pans: 3, 4, 5, 6mm • Rallonge 50mm • Cardan universel • Adaptateur • Déverrouillage rapide Seulement g19,68 CODE COMMANDE 150-4085 Jeu 3 Réf. Fab. T4881X/5 ESD Code Commande 725-4260 Torx inviolable TX07, TX08, TX09, TX10, TX15 Pince à becs demi-ronds Seulement g72,17 CODE COMMANDE 109-8815 Série Senso-Plus Série Senso-Plus • Lame serpette polie et dénudeur • Rivets en laiton et système de verrouillage • Dispositif d’accrochage • Manche plastique noir • Taille: 95mm Outil d’extraction PLCC Code Réf. Fab. Commande Prix Unitaire T4883XESD 725-4246 g37,91 T4884X ESD 939-8775 g22,18 T4881X/5 ESD 725-4260 g61,71 Série Senso-Plus • Gainage bi-matières souple, confortable et antidérapant • Tête ovale ou pointue et évidée • Double ressort de rappel • Finition poli-brillant • Antistatique A partir de g27,17 CODE COMMANDE 872-131 • Lame acier en carbone • Lame tournevis à fente, très pratique pour dénuder • Les 2 lames sont verrouillées pour une utilisation en toute sécurité • Taille: 110mm Jeux de tournevis antistatiques • Gainage bi-matières souple, confortable et antidérapant • Tête ovale ou semi ovale • Double ressort de rappel • Finition poli-brillant • Antistatique A partir de g10,66 CODE COMMANDE 128-3270 Tournevis Xonic haute précision • Tournevis offrant une protection contre les décharges électrostatiques RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Outillage à main CK 85 Outillage Modèle/ Code Prix Longueur Réf. Fab. Commande Unitaire Métrique, 3m T3442M 3 152-1872 g4,81 Métrique, 5m T3442M 5 152-1873 g7,52 Métrique, 8m T3442M 8 152-1874 g13,02 Clé universelle type stylo Extracteur de vis Pinces coupantes obliques VDE/1000V Gilet de technicien Coupe-tubes PVC à cliquet • Disponibles en 3 longueurs • Précision Classe II • Corps en plastique ABS Code Prix Réf. Fab. Commande Unitaire Kit d’électricien T1630 FKIT 152-1875 g244,13 Trousse à outils seule T1630 789-0028 g43,30 • Fabrication en polyester durable • Entièrement réglable • 26 poches et supports pour outils, équipement et téléphone mobile • 3 boucles métalliques résistantes pour fixer des objets suspendus - dont 1 mousqueton • 3 boucles pivotantes pour marteaux • Bande réfléchissante donnant de la visibilité sur chantier • Doublure en maille donnant du confort et une bonne respirabilité • Support résistant pour ruban métallique Avec ou sans une fonction de dénudage • Permet de retirer les vis endommagées en quelques secondes • Fonctionne avec tous types de vis • À utiliser avec une perceuse réversible • Le coffret contient 2 tailles pour les vis 6 -10 et 12 - 14 mm • Avec bouton de verrouillage et de pause • Avec clip ceinture • Rubans en nylon résistants à l’abrasion avec revêtement antiusure et anti-corrosion Kit de démarrage pour • Pour tubes PVC et matières similaires comme conduite d’eau principale bleue, tuyaux en caoutchouc, conduits pneumatiques, cosses électriques etc. • Modèle de grande résistance et à cliquet permettant une réduction considérable de l’effort de travail • Livré avec un adaptateur permettant la coupe droite de sections rectangulaires • Corps en aluminium et lame à tranchants très affûtés en acier inoxydable pour une coupe nette et sans effort • Longueur: 220mm • Capacité de coupe: Ø32.0mm Clé unique et compacte type stylo, conçue pour être rangée facilement et tenir facilement dans une poche • Clip de poche • Multi-fonctions pour utilisation sur les systèmes de verrouillage d’armoires électriques, de gaz et d’eau, les consoles de secteur, etc • Comprend un embout de tournevis pour bornes Modulo taille 2 Seulement g34,13 CODE COMMANDE 128-3281 Seulement g11,95 CODE COMMANDE 146-5984 Seulement g25,28 CODE COMMANDE 128-3221 électriciens A partir de g4,81 CODE COMMANDE 152-1872 • Fabriquée selon VDE 0682- 0201 / IEC 60900:2004 Seulement g21,39 CODE COMMANDE 139-1009 Kit de technicien récompensé avec 19 outils les plus couramment utilisés: • Trousse en polyester avec poches latérales séparées pour outils, un compartiment central rembourré pour ordinateur portable, bande réfléchissante • 2 tournevis VDE/1000V à fente: 3 x 75 mm (341018), 4 x 100 mm (341021) • 2 tournevis VDE/1000V : PZD: No. 1 & 2 (341011 et 341012) / Phillips No. 1 &2 • Chaque pince testée à 10 000V pour s’assurer d’une utilisation en toute sécurité sur des équipements sous tension jusqu’à 1000V • Version 431019 uniquement : pince à (341003 et 341004) • 2 tournevis VDE/1000V pour bornes modulo - No. 1 & 2 (340001 et 340002) • 1 pince universelle 200 mm VDE/1000V (431003) • 1 pince demi-ronde 170 mm VDE/1000V (431013) • 1 pince coupante oblique 160 mm VDE/1000V (413017) • 1 couteau à câble (T10280) • 1 pince à dénuder automatique no.54 (T20040) • 1 testeur secteur (440007) • 1 mini scie à métaux (T0836A) • 1 mètre ruban 5m (T3442M) • 1 couteau d’électricien (T84001) • 1 clé universelle (495002) • 1 scie pour plaques de plâtre (T0831) encoches pour fils de 1,5mm2 et 2,5 mm2 • Capacités de coupe: dur: 1,6 mm; souple:≥ 4,0 mm • Poignée ergonomique pour un meilleur confort • Finition anti-reflet et anti-corrosion • Coupe de précision • Longueur totale: 160 mm Mètres à ruban métriques Seulement g244,13 CODE COMMANDE 152-1875 Code Prix Unitaire Réf. Fab. Commande 431017 152-1876 g32,55 431019 152-1877 g43,40 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Bosch 86 Outillage Viseur télescopique pour télémètre • Amèliore la visibilité du point laser à grandes distances • Filtre à lumière rouge en cas de fort ensoleillement • Grossissement 4 fois • Porte-embouts magnétique • Version IXO III Classic (153-3892) livrée avec chargeur et 10 embouts de vissage • Version IXO III Medium (153-3893) livrée avec chargeur, 10 embouts de vissage et un embout renvoi d’angle • Version IXO III Deluxe (153-3894) livrée avec chargeur, 10 embouts de vissage, un embout renvoi d’angle et un embout réglage de couple 39 embouts de vissage de L=25mm Dimensions Plats 2x4/2x6/2x7 Six-pans 2x3/2x4/2x5/2x6 Phillips 2x0/2x1/2x2/2x3 Pozidriv 2x0/2x1/2x2/2x3 Torx 10/10/15/15/20/ 20/25/930/40 Visseuse à choc sans fil 10.8V Li 10 embouts de vissage de L=50mm Dimensions Plats 4/6 Phillips 0/1/2/3 Pozidriv 0/1/2/3 Plage de mesure 0.3 - 150m Précision de mesure ± 2mm (0.3 - 30m), ± 3mm Temps de mesure < 0.5s à 4s GDR 10.8V Li Professional Perceuse-visseuse sans fil 12V Coffret de vissage 65 pièces XLINE Tension 3.6V - 1.3Ah Vitesse à vide 180tr/min Couple max. (Nm) 3 Nm Ø de vissage 5-6mm Poids (g) 300g Code Prix Commande Unitaire Télémètre laser DLE 150 834-0781 g379,00 Viseur télescopique ZO 4 834-0790 g227,00 • Visseuse à choc de poche sans fil Li-Ion 10.8V • Permet de travailler dans toutes les positions, sans fatigue et en toute sécurité • Technologie Lithium-Ion, excellent rapport puissance/poids, aucun effet mémoire et pas d’autodécharge • 70% de la batterie chargée en 15 min. • Réversibilité droite/gauche • Protection électronique des éléments (ECP): protection de la batterie contre la surcharge, la surchauffe et la décharge totale • Extrêmement robuste, carter « Dura-Shield » GSR 12 VE-2 • Porte-embouts verrouillable • 3 LEDs • Système de ventilation optimisé • Poignée Soft Grip • Livrée avec chargeur ultra-rapide AL1130CV 2 batteries 10.8V Li-Ion 1.3Ah et sacoche de transport • Nouveau moteur 48mm • 15 positions de réglage de couple • Mandrin automatique 13mm Autolock • Réversibles • 2 vitesses • Batteries O-pack 2.6Ah Ni-Mh nouvelle génération • Livrées avec coffret, 2 batteries 2.6Ah NiMh, chargeur, scie trépan 32mm, adaptateur 6 pans et foret centrage HSS Code Description Réf. Fab. Commande Prix Unitaire IXO III CLASSIC 0 603 959 100 153-3892 g52,20 IXO III MEDIUM 0 603 959 101 153-3893 g62,65 IXO III DELUXE 0 603 959 200 153-3894 g73,10 • Coffret complet pour tous les travaux de vissage • Rangement pratique dans un coffret plastique • Idéal pour les visseuses sans fil • Embouts de qualité pour une grande longévité et une grande résistance à la rupture et à l’usure • 1 porte-embout magnétique, tournevis à cliquet (angle variable), adaptateur de douilles 25mm, rallonge flexible, 12 douilles six pans (1/4", 9/32", 5/16", 11/32", 3/8", 1/2", 6, 7, 8, 9, 10, 13mm) Télémètre laser Seulement g242,00 CODE COMMANDE 142-7669 Tournevis sans fil 3.6V Lithium-Ion • 39 embouts de vissage de 25mm et 10 embouts de vissage de 50mm • Coffret avec fenêtre transparente DLE 150 A partir de g289,00 CODE COMMANDE 155-8964 Seulement g47,00 CODE COMMANDE 142-7670 • Télémètre permettant la prise de mesure de longueurs, surfaces et volumes • Mesure jusqu’à 150 mètres à quelques millimètres près • Nombreuses fonctions pratiques • Embout universel permettant d’effectuer des mesures de surfaces, de chants et d’angles • Livré avec un embout universel et compact, niveau à bulle, 4 piles 1,5 V et un sac de transport IXO III Classic, Medium et Deluxe 153-3892 + 153-3893 153-3894 • Nouvelle batterie lithium-ion (1.3Ah), sans effet mémoire et pas d’auto-décharge • Technologie lithium-ion permettant de la mettre sur sa base en toute tranquilité après chaque utilisation sans avoir besoin de vérifier le niveau de charge de la batterie • Accu extrêmement petit, tournevis léger et facile à manier, s’utilise même dans les endroits difficiles d’accès • Blocage de broche entièrement automatique pour finir le vissage manuellement • Rotation droite/gauche • Indication du sens de rotation et de l’état de charge par LED • PowerLight, faisceau de lumière sur la tâche • Poignée Soft grip • Gâchette 2 doigts avec 2 positions • Prise en main optimale, angle de 12° A partir de g52,20 CODE COMMANDE 153-3892 RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Skil/Dewalt/Dremel 87 Outillage Puissance nominale 30W Tension 230V Deux températures 120/195°C Poids 360g Puissance absorbée 1800W Température position 1 50°C Température position 2 400°C Température position 3 570°C Débit d’air position 1 250 l/min Débit d’air position 2 250 l/min Débit d’air position 3 500 l/min Poids 0.7kg Caractéristiques techniques Puissance 125W Tension 230V Vitesse à vide 10000-33000t/min Poids 550g Tension 4.8V Vitesse 180tr/min Couple max. (Nm) 4 Nm Ø max. des vis 5mm Temps de charge 3-5h Pistolet à colle Décapeur thermique 1800W Dremel Multipro Tournevis sans fil 4.8V Modèle 2348 TWIST type 300-1/25 Type 1200JA • Régulation du débit d’air de 250 à 500 l/min • 3 niveaux de températures: 50°C, 400°C ou 570°C • "Contrôle constant de la température" pour un travail long sans surchauffe • Poignée ergonomique, une utilisation longue durée sans fatigue • Interrupteur 4 positions, facile à utiliser, à l’arrière de la poignée • Peut être maintenu dans une position stable, permet de se dégager les 2 mains • Anneau frontal amovible, permet un accès aux endroits difficiles • Tournevis sans fil 4.8V puissant et polyvalent • Tête pivotante pour un vissage dans les endroits difficiles à atteindre • Lumière intégrée pour un meilleur éclairage sur la pièce à travailler • Sens de rotation indiqué par un voyant avant/arrière • De nombreuses fonctionnalités et facile à utiliser • Deux températures, une application sur une large gamme de matériaux • Embout anti-goutte, évite que la colle chaude ne goutte sur la pièce à travailler Coffret plastique avec 25 accessoires • Livré dans un coffret plastique avec 1 buse protège vitre, 1 buse à jet plat, 1 buse de réduction et 1 buse à réflecteur • Eclairage par LED • Grande gâchette 3 doigts, permet d’appliquer la colle avec précision • Support large, outil stable sur la surface de travail • Taille standard du tube de colle • Témoins lumineux, indiquent lorsque l’outil est prêt à fonctionner • Commutateur à 3 voies, sélection de la bonne température pour le projet en Seulement g39,90 CODE COMMANDE 125-7503 • Outil polyvalent pour des applications de précision et de contrôle • Nouveau et unique design, plus d’ergonomie et confort • Poignée soft grip, moins de vibrations • Léger et maniement facile • Vitesse variable entre 10000 à 33000 tr/ mn, idéal pour des applications • Poignée pivotante sur 180° • Blocage automatique de l’arbre pour des vissages et dévissages manuels • Poignée bi-matières • Témoin de charge de la batterie • Porte-outils adaptable à la ceinture • Livré avec 10 embouts et 1 mèche (2mm) pour avant trous manuelles • Très performant, moteur 125W • Coffret de rangement robuste • Pince porte-embout 3.2mm, écrou de blocage et clé de pince porte-outil • Livré avec coffret plastique et 25 accessoires cours • Livré avec 3 buses différentes et 6 tubes Seulement de colle (deux températures) g39,90 CODE COMMANDE 125-7496 Seulement g68,60 CODE COMMANDE 112-1282 Modèle 8003 Seulement g29,90 CODE COMMANDE 122-3530 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Adhésifs et nettoyants 88 Produits de maintenance • Ignifugé, auto-extinguible • Bonne résistance à l’abrasion • Large gamme de couleurs • Température de fonctionnement: 5°C à +70°C • Conformes EN 60454/Type2 Colle néoprène liquide Le kit de nettoyage pour fibres optiques comprend toutes les fournitures de nettoyage nécessaires à l’épissure par fusion et au raccord par fibres optiques 2.5mm. Le nettoyant de précision Electro- Wash PX et la plate-forme de nettoyage QbE ont été inclus pour permettre l’utilisation du processus CCp™. Des Code Prix Réf. Fab. Commande Unitaire Flacon de 50ml 195752 394-4803 g37,95 Flacon de 250ml 195753 394-4815 g126,96 • Colle de contact pour l’assemblage et le placage multi-matériaux lingettes pré-saturées Electro-Wash MX sont également incluses pour essuyer les outils et les câbles. • Conçu pour fixer et coller de nombreux matériaux • Rapide et facile à utiliser • Appliquer sur les deux surfaces, attendre que l’adhésif colle au toucher puis coller simplement les surfaces l’une contre l’autre • Convient pour le bois, le métal, la plupart des plastiques, le caoutchouc, le verre, le papier et le carton, etc. • Idéal pour les habillages de haut-parleurs et les placages de caissons • 400ml Code Prix Taille Couleur Commande Unitaire 19mm x 33m Gris 137-3976● g1,57 19mm x 33m Orange 137-3977● g1,57 19mm x 33m Violet 137-3978● g1,57 25mm x 33m Noir 137-3979● g2,05 25mm x 33m Bleu 137-3980● g2,05 25mm x 33m Marron 137-3981● g2,05 25mm x 33m Vert 137-3982● g2,05 25mm x 33m Vert/Jaune 137-3983● g2,05 25mm x 33m Gris 137-3984● g2,05 25mm x 33m Orange 137-3986● g2,05 25mm x 33m Rouge 137-3987● g2,05 25mm x 33m Violet 137-3988● g2,05 25mm x 33m Blanc 137-3989● g2,05 25mm x 33m Jaune 137-3990● g2,05 50mm x 33m Noir 137-3991● g4,08 Résine époxy Loctite 3463 Adhésif en spray Freinfiletnormal 243 • Permet de coller sur la plupart des matériaux entre eux et sur tous supports tels que PVC rigide, caoutchouc, métal, céramique, verre etc. • S’utilise sans pressen, ni serre-joints • S’étale très facilement car très fluide • Forme un film de colle souple • Temps ouvert: 2h Seulement g4,37 CODE COMMANDE 120-6537 • Résine époxy bicomposante en bâtonnet modelable pour la réparation multi-usage • Couleur gris métal • Se dépose comme un mastic • Forte adhésion sur la plupart des surfaces une fois le mastic polymérisé • Polymérise en 10min, idéal pour les réparations rapides • Polymérise sous l’eau et adhère sur des surfaces humides • S’utilise entre -30°C et +120°C • Idéale pour lisser les soudures, reboucher de trous percés trop gros, stopper les fuites et colmater les trous dans les réservoirs • Certifié NSF pour l’eau potable • Disponible en bâtonnet 114g Rubans isolants électriques Kit de nettoyage pour fibres • Sans toluène • Livrée avec pinceau et spatule pour la dépose • Disponible en pot Nettoyant de flux de soudure Conseil : Pour un freinage optimum, il est recommandé d’utiliser le nettoyant-dégraissant Loctite 7063 (394-4920) - voir PAGE 0000 Seulement g18,95 CODE COMMANDE 150-0274 optiques FFTH • Adhésif anaérobie pour le freinage des filetages (jusqu’au M36), monocomposant , de résistance moyenne • S’oppose au desserrage de pièces sous contraintes de vibrations • Efficace sur les éléments filetés métalliques et particulièrement sur l’acier inoxydable et les surfaces traitées • Recommandé pour des pièces dont le démontage est possible à l’aide d’un outillage classique • Pour des températures de -55°C à +150°C • Nettoie les circuits imprimés après soudure et avant vernissage • Supprime les traces de chlorure et d’acides • Retire certains vernis de protection • Sans danger pour les composants et la plupart des marquages • Séchage rapide (8mn à 20 °C) • Livré avec un pinceau brosse adaptable • Aérosol de 650ml (400ml net) Isolant électrique PVC AT7 de 650g • Couple de rupture de 20Nm - Temps de prise de 2h (à 22°C) Seulement g12,30 CODE COMMANDE 391-6613 • Pour l’isolation des câbles, code couleur et striés • Se découpe facilement, résistant à l’eau et aux UV Seulement g9,50 CODE COMMANDE 150-0270 Kit comprenant: • 1 plate-forme de nettoyage QbE® (200 feuilles) • 1 nettoyant pour fibres optiques Electro-Wash® PX haute précision ES810E (aérosol 200 ml) • 1 tube de bâtonnets mousse 2.5 mm, 48042F (50 bâtonnets) • 1 tube de bâtonnets nettoyants pour rainures et ferrules 38542F (50 bâtonnets) • 1 tube de bâtonnets pour miroir d’épissure par fusion 51125F (15 bâtonnets) • 1 Manuel d’instructions • 1 sac robuste avec clips Code Commande Prix par Kit 150-2492 g71,42 RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain CIF/Multicomp/Vero 89 Circuits imprimés A partir de g4,04 CODE COMMANDE 126-7738● Seulement g918,53 CODE COMMANDE 153-8099● www.farnell.fr 04 74 68 99 99 Pour les dernières technologies en contrôle de mouvement et automation regroupant plus de 1000 nouveaux produits, consultez le Technology First en ligne : www.electronicsdesignworld.com A partir de g10,29 CODE COMMANDE 126-7761● Seulement g7,26 CODE COMMANDE 942-3230● A partir de g7,60 CODE COMMANDE 153-6938● Service de mise en bobine • Simple face bakélite • Bande cuivre étamée • Bordure libre sur le côté de la carte Nbre de trou/ Code Prix Taille pistes piste Réf. Fab. Commande Unitaire 121x102 41 44 01-0021H 153-6938● g7,60 100x160 36 60 09-2196L 153-6939● g10,64 95x454 34 179 01-0040A 153-6940● g19,76 179x454 60 179 01-0042B 153-6942● g36,48 100x500 36 197 01-27567 153-6943● g34,96 Optimisez vos stocks et accélérez le montage de vos composants CMS. Commande et plus d’informations: Caractéristiques Caractéristiques Epaisseur cuivre 35μm Epaisseur carte 1.6mm Diamètre trou 1.02mm Matériau SRBP Pas de trou 2.54x2.54mm VEGA10 • Résine positive colorée bleue sans marbrure • Epoxy 1 ou 2 faces selon modèle • Epaisseur de résine : 2.5μ • Protection adhésive anti UV • Emballage individuel plastique • Garantie 5 ans Code Pas Commande Prix Unitaire 2.54 942-3230● g7,26 • Carte d’essai à pastilles cuivrées étamées simple face • Verre Epoxy - Epaisseur 16/10e • Percée au pas de 2.54mm • Pastilles carrés de 2mm de coté • Intervalle de 0.54mm sur toute la surface Carte de prototypage Vero • Compacte • Permet un travail rapide • Droitier/gaucher • Complète pour le placement des composants • Autonome : pompe intégrée • Idéale pour manipuler les composants CMS • Porte-outil intégré • La touche casse vide intégrée dans la table Code Réf. Fab. Commande Prix Unitaire AGP10 126-7761● g10,29 AGP12 112-0339 g22,38 AGP20 126-7762● g16,40 AGP58 112-0340 g57,66 AGP30 126-7763● g25,83 Pas L (mm)l (mm)Ep (mm)Bande (mm)Rangée (mm)Code Commande 2.54117 368 41 x 1.9 144 942-3230 Format (mm) 1 face 2 faces 100 x 160 AA16 AB16 200 x 300 AA20 AB20 300 x 600 AA60 AB60 Code Réf. Fab. Commande Prix Unitaire AA16 126-7738● g4,04 AA20 126-7739● g12,03 AA60 126-7740● g33,98 AB16 126-7741● g4,98 AB20 126-7742● g15,95 AB60 126-7743● g41,81 Carte à bandes cuivrées étamées La station de placement VEGA 10 comprend : • 1 table support pour des cartes d’un format utile 280 x 120 mm. • 2 barrettes aimantées pour le support des cartes • 1 support bras anti-fatigue coulissant pour droitier ou gaucher • 1 pompe à vide avec casse vide intégré • 1 pipette de préhension des composants • 12 boîtes à clapets pour le stockage des CMS • 1 porte outils pour support accessoires • 1 boîte de rangement aimantée Carte simple face - bandes cuivrées Cartes présensibilisées positives 16/10e - 35μ Caratéristiques: VEGA 10 Format utile de placement 280 x 120 mm Pompe à vide Oui Pipette de préhension droite Oui Stockage des composants 12 boîtes Dimensions Ext. L x W x H 385 x 390 x 75 mm Masse Net 4.5kg Tension d’alimentation 230 V - 50/60 Hz Carte de prototypage de haute qualité à bande permettant de concevoir et de tester les composants avant la conception sur circuit imprimé. La carte Vero s’adapte avec tous types de composants discrets, circuit analogique et général. Ces cartes sont simples faces et flexibles, pouvant être découpées à l’aide d’un cutter. Fabriquée selon BS4585 part 5. Code Prix Description Réf. Fab. Commande Unitaire Station VEGA 10 F51207 153-8099● g918,53 Station de placement manuel CMS Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Sécurité machines 90 Composants d’automatisme et de process RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Omron 91 Composants d’automatisme et de process A partir de g329,02 CODE COMMANDE 135-0658● A partir de g2,43 CODE COMMANDE 994-9810● A partir de g296,70 CODE COMMANDE 135-0656● H=15.7, l=12.7, P=29 A partir de g3,53 CODE COMMANDE 995-0087● A partir de g584,44 CODE COMMANDE 135-0654● • Reconnaissance de donnée par affichage clair et facile à lire, avec changement de couleurs rouge et vert • Equipé d’un mesureur de position pour la surveillance du fonctionnement • Boîtier compact avec une profondeur de 95mm (à partir du panneau frontal) ou de • Reconnaissance de données par affichage clair et facile à lire, avec changement de couleurs rouge et vert • Equipé d’un mesureur de position pour la surveillance du fonctionnement • Entrée événement externe permettant des applications de mesure variées • Large gamme jusqu’au modèle DeviceNet 97mm pour modèle DeviceNet • Certifié, approuvé UL (Certification Mark License) • Conforme au marquage CE • Boîtier étanche conforme NEMA 4X (équivalent IP66) • Vitesse d’échantillonnage de 50Hz • Pour la mesure et distinction à haute vitesse avec une période d’échantillonnage de 0.5ms et temps de réponse en sortie de 1ms max • Reconnaissance de donnée par affichage clair et facile à lire, avec changement de couleurs rouge et vert • Equipé d’un mesureur de position • Boîtier compact avec une profondeur de 95mm (à partir du panneau frontal) ou de 97mm pour modèle DeviceNet • Certifié, approuvé UL (Certification Mark License) • Conforme au marquage CE • Boîtier étanche conforme NEMA 4X (équivalent IP66) • Vitesse d’échantillonnage de 50Hz • Réglage facile du point de graduation pour une conversion et affichage • Contacts DPCO • Entièrement étanche • Commute de 10mA à 2A • Contacts jumelés, idéal pour la commutation de signaux • Agréé UL et CSA Code Réf. Fab. Commande Prix Unitaire K3HBXAD 100/240VAC 135-0658● g329,02 K3HBXAD 24VACVDC 135-0659● g329,02 K3HBXVD 100/240VAC 135-0660● g329,02 K3HBXVD 24VACVDC 135-0661● g329,02 qui représente la quantité mesurée et la position relative • Le calibrage Zéro peut être effectué facilement avec la fonction Zéro forcé • Boîtier compact avec une profondeur de 95mm (à partir du panneau frontal) ou de 97mm pour modèle DeviceNet • Certifié, approuvé UL (Certification Mark License), CE • Boîtier étanche conforme NEMA 4X (équivalent IP66) • Contacts SPCO et DPCO • Bas profil, 15.7mm de hauteur • Bobine 400mW haute sensibilité • 10mm entre contacts • Homologation UL, CSA et VDE Consommation bobine Configuration des contacts 2RT Standard 500mW Pouvoir de coupure 2A @ 30V c.c., Haute sensibilité 150mW 0.5A @ 125V c.a. Fonctionnement/ 7ms/3ms Matériau de contact Argent plaqué or Relâchement Rigidité électrique 1000V c.a. (contact bobine) Domaine de températures -25°C à +65°C Domaine de 75%-120% fonctionnement bobine • Réglage facile du point de graduation pour une conversion et affichage Code Réf. Fab. Commande Prix Unitaire K3HB-SSD 100/240VAC 135-0654● g584,44 K3HB-SSD 24VACVDC 135-0655● g584,44 Bobine Code Prix Tension Ω Commande Unitaire SPCO, 12A - Série G2RL1 5V c.c. 62.5 995-0087● g3,53 12V c.c. 360 995-0095● g3,53 24V c.c. 1440 995-0109● g3,53 48V c.c. 5358 995-0117● g3,53 SPCO, 16A - Série G2RL1E 5V c.c. 62.5 995-0125● g4,03 12V c.c. 360 995-0133● g4,03 24V c.c. 1440 995-0141● g4,03 48V c.c. 5358 995-0150● g4,03 DPCO, 8A - Série G2R2L 5V c.c. 62.5 995-0168● g4,25 12V c.c. 360 995-0176● g4,25 24V c.c. 1440 995-0184● g4,25 48V c.c. 5358 995-0192● g4,25 Code Réf. Fab. Commande Prix Unitaire K3HBVLC 100/240VAC 135-0656● g296,70 K3HBVLC 24VACVDC 135-0657● g296,70 Bobine Code Prix Tension Ω Commande Unitaire DPCO - Série G5V2 4.5V c.c. 40 994-9810● g2,43 5V c.c. 50 994-9488● g2,43 9V c.c. 162 994-9828● g2,43 12V c.c. 288 994-9496● g2,43 24V c.c. 1152 994-9500● g2,43 48V c.c. 4000 994-9836● g2,43 DPCO - Haute sensibilité - Série G5V-2-HI 5V c.c. 166 994-9844● g4,12 9V c.c. 540 994-9852● g4,12 12V c.c. 960 994-9860● g4,12 24V c.c. 2880 994-9879● g4,12 Indicateur de Process Relais CI subminiature - Série G5V2 Indicateur pour Indicateur de poids, de pression, de charge et de 8A/12A/16A - Série G2RL couple capteur linéaire Configuration des contacts SPCO/DPCO Pouvoir de coupure (résis.) SPCO 12A à 240V c.a.,30V c.c. 16A à 240V c.a.,30V c.c. DPCO 8A à 240V c.a.,30V c.c. Matériau de contact 12A/16A 8A AgNi Consommation bobine 5/12/24V 400mW 5V 400mW Fonctionnement/Déclenchement 7ms/5ms Domaine de fonctionnement bobine 70 - 130% Température d’utilisation -40°C à 85°C Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Visserie 92 Fournitures industrielles Visserie Qté par Code Prix Par Qté par Code Prix Par Longueur boîte Commande Boite Longueur boîte Commande Boite M8 16 50 707-5224 g9,83 M10 20 50 707-5297 g14,06 20 50 707-5236 g10,54 30 50 707-5303 g14,57 25 50 707-5248 g11,15 40 50 707-5315 g15,67 30 50 707-5250 g11,60 50 50 707-5327 g16,30 40 50 707-5261 g12,52 60 50 707-5339 g15,70 60 50 707-5273 g16,85 100 50 707-5352 g45,26 80 50 707-5285 g16,81 (100 par boîte) Code Commande Prix Par Boîte M3 706-1857● g8,05 M4 706-6946● g8,17 M5 706-6958● g9,19 M6 706-6960● g10,71 (100 Par Boîte) Code Prix Par (100 Par Boîte) Code Prix Par Longueur Commande Boîte Longueur Commande Boîte à Aillettes 12 758-619 g4,24 M3 6 758-530 g6,30 M4 6 758-620 g3,61 12 758-541 g4,38 12 758-632 g3,87 M4 6 758-553 g5,58 M3 6 758-668 g4,59 12 758-565 g4,95 12 758-670 g4,80 16 758-577 g4,66 M4 6 758-681 g4,52 Rondelle fendue 12 758-693 g5,41 M3 6 758-607 g3,71 Tête cylindrique Pozidriv™ Valises compartimentées Combinaison écrou/rondelle Vis nylon à tête hexagonale Boîtes de rangement haute qualité fabriquées en polypropylène avec un couvercle transparent en polycarbonate et des poignées moulées. Avec rondelle-frein Code Commande M3 25 de longueurs 6, 10, 20, 25mm 306-2661 M4 25 de longueurs 6, 10, 20, 25mm 306-2673 M5 25 de longueurs 6, 10, 20, 25mm 306-2685 Nylon 6.6 Nylon 6.6 Code Commande Prix Unitaire M3 306-2661 g7,54 M4 306-2673 g8,18 M5 306-2685 g8,79 • Taille M8 et M10, de 16 à 100mm selon diamètre • Bonnes propriétés d’isolation électrique • Fabriqué selon DIN 1589 • Boîtes avec compartiments démontables • Système permettant de tenir les couvercles en place • Dimensions (LxlxH) : 423 x 334 x 52 mm A partir de g8,05 CODE COMMANDE 706-1857● • Vis Pozidriv usinées avec rondelle d’anti-désserrage captive • Disponibles avec rondelle à ailettes, anneau ressort fendu ou rondelle plate • Fabriquées selon BS4183 Tête cylindrique fendue Seulement g18,14 CODE COMMANDE 394-8559 A partir de g3,71 CODE COMMANDE 758-607 Nylon 6.6 • Nylon 6.6 ivoire • Choix de longueurs différentes pour chaque assortiment • Chaque longueur fait l’objet d’un conditionnement séparé RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Coffrets, boîtiers 93 Electromécanique Dimensions externes Code H1 H2 W D Commande Prix Unitiare Sans panneau surélevé 62 33 190 120 117-1612● g20,83 78 33 262 185 117-1613● g29,28 85 35 400 230 117-1615● g55,92 Avec panneau surélevé 117 33 260 185 117-1614● g30,27 145 35 400 230 117-1617● g60,57 Console panneau ‘Abox’ H L P Code H L P Code Cadres à monter sur CI avec un couvercle Commande Prix Unitaire Cadres à monter sur CI avec un couvercle Commande Prix Unitaire 10 20 20 118-1371● g6,06 50 100 160 118-1389● g13,87 15 30 30 118-1372● g9,16 10 20 20 118-1391● g6,90 15 25 50 118-1374● g7,89 15 30 30 118-1392● g8,49 15 50 50 118-1375● g10,86 15 50 25 118-1393● g9,33 25 50 75 118-1376● g10,99 25 75 75 118-1394● g10,46 25 75 75 118-1377● g10,67 Boîtiers à monter sur CI 25 50 100 118-1378● g15,12 15 20 20 444-6641● g2,88 25 75 125 118-1379● g17,10 15 25 25 444-6653● g3,18 15 75 50 118-1395● g10,09 15 40 30 444-6689● g3,68 10 25 25 118-1396● g6,98 15 40 40 444-6707● g3,68 15 40 40 118-1398● g9,28 15 50 50 444-6719● g4,60 Cadres ouverts avec deux couvercles 20 60 40 444-6720● g4,60 15 50 50 118-1380● g12,09 25 70 50 444-6732● g5,93 15 50 75 118-1381● g12,25 25 75 75 444-6744● g6,97 25 50 100 118-1382● g12,94 Cloisons 35 100 160 118-1383● g18,55 232 10 0.54 444-6768● g6,90 50 100 220 118-1384● g21,32 232 15 0.54 444-6770● g7,90 Boîtiers avec un couvercle 232 20 0.54 444-6781● g8,46 15 50 50 118-1386● g8,98 Cloisons pour modèles à monter sur CI 25 50 75 118-1387● g10,26 118-1390● g1,71 35 50 100 118-1388● g10,79 Dimensions Dimensions Dimensions Dimensions externes Code externes Code externes Code externes Code H l P Commande Prix Unitaire H l P Commande Prix Unitaire H l P Commande Prix Unitaire H l P Commande Prix Unitaire 23 80 54 427-2810● g11,54 43 120 78 928-7825● g19,01 23 80 54 427-2936● g10,80 19 71.381 124-4178● g10,22 23 120 54 427-2821● g11,14 31 120 103 928-7841● g13,27 23 120 54 427-2948● g11,22 19 71.3101 124-4182● g10,78 43 120 78 427-2857● g16,80 53 120 103 928-7876● g20,73 27 120 78 427-2950● g11,29 19 71.3121 124-4186● g11,36 27 120 78 427-2833● g13,72 27 160 78 928-7817● g16,35 43 120 78 427-2973● g13,49 23 80 54 928-7906● g10,44 31 120 103 427-2870● g15,33 43 160 78 928-7833● g20,21 31 120 103 427-2997● g11,73 23 120 54 928-7914● g10,92 53 120 103 427-2900● g18,71 31 160 103 928-7850● g15,58 53 120 103 427-3023● g15,73 27 120 78 928-7922● g11,03 27 160 78 427-2845● g15,73 53 160 103 928-7884● g22,31 27 160 78 427-2961● g12,17 43 120 78 928-7949● g14,92 43 160 78 427-2869● g18,13 31 220 103 928-7868● g17,27 43 160 78 427-2985● g11,99 31 120 103 928-7965● g12,05 31 160 103 427-2882● g16,54 53 220 103 928-7892● g24,92 31 160 103 427-3000● g14,48 53 120 103 928-7990● g17,13 53 160 103 427-2912● g20,33 12 70 81 124-4174● g8,06 53 160 103 427-3035● g17,27 27 160 78 928-7930● g11,89 31 220 103 427-2894● g18,38 12 70 101 124-4179● g8,42 31 220 103 427-3011● g16,36 43 160 78 928-7957● g16,21 53 220 103 427-2924● g22,98 12 70 121 124-4183● g8,86 53 220 103 427-3047● g19,67 31 160 103 928-7973● g13,27 23 80 54 928-7787● g13,27 19 71.381 124-4177● g8,72 12 70 81 124-4175● g9,56 53 160 103 928-8007● g18,71 23 120 54 928-7795● g13,74 19 71.3101 124-4181● g9,16 12 70 101 124-4180● g10,07 31 220 103 928-7981● g14,37 27 120 78 928-7809● g15,48 19 71.3121 124-4185● g9,67 12 70 121 124-4184● g10,55 53 220 103 928-8015● g21,07 Coffrets blindés EMI/RFI • Grande console de bureau moulée en ABS gris avec zone d’utilisation inclinée • Equipée de deux panneaux en aluminium anodisé épais de 2mm • Bossage pour montage de CI et Eurocartes • Facile à percer ou poinçonner • Fournis avec 2 pieds anti-dérapants en PVC • Supportent jusqu’à 85°C PERANCEA Boîtiers à usage général Coffrets aluminium pour instruments • Boîtiers en aluminium avec rainures intérieures pour le montage de C.I. • Rebord intérieur pour une bonne étanchéité • Acceptent toute finition avec une préparation minimum • Certains modèles avec rainures guide-cartes • Corps robuste en aluminium extrudé • Conviennent à la protection des cartes électroniques, interfaces entre appareils ainsi que les applications portables Cadre CI avec 1 couvercle Cadre ouvert avec 2 couvercles Dimensions extérieures Guide Code Prix H H1 l P Cartes Réf. Fab. Commande Unitaire 30 4 60 55 OUI 459-0150. 278-804● g4,23 25 4 80 55 OUI 459-0140. 525-595● g5,10 29.5 4 88.9 34.9 NON 459-0010. 525-601● g5,06 29.5 4 114.3 63.5 NON 459-0020. 525-613● g5,78 54.9 4 114.3 63.5 NON 459-0040. 525-625● g6,86 54.9 4 114.3 88.9 NON 459-0030. 525-637● g8,09 54.9 4 120.6 54.9 NON 459-0050 525-649● g12,41 105.7 4 171.5 120.6 NON 459-0060. 525-650● g19,60 55 4 222.3 146 NON 459-0070. 278-841● g20,46 105.7 4 222.3 146 NON 459-0080. 278-853● g28,68 35 4 120 100 OUI 459-0120. 278-816● g16,51 76 4 139.7 101.6 OUI 459-0100. 278-828● g22,26 76 4 165 127 OUI 459-0110. 278-830● g29,21 65 4 275 175 OUI 459-0090. 278-865● g42,01 100 4 250 250 OUI 459-0130. 278-877● g52,57 Boîtier avec 1 couvercle • Système de blindage économique, efficace, facile à mettre en oeuvre • 4 modèles : Cadres et boîtiers à monter sur circuit imprimé ; cadre ouvert muni de deux couvercles ; boîtier muni d’un seul couvercle. • Le couvercle à ergots permet un montage et démontage facile tout en procurant une excellente atténuation • Acier brillant BS1449 Pt.1 CR4. • Cloisons à commander séparément Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Ventilateurs 94 Electromécanique 119mm Tension Plage tension P Débit Code Prix V cc V cc Watts m3/h Roulement Réf. Fab. Commande Unitare 60mm, Faible bruit 12 10 à 13.2 1.1 29 SB 612F 960-0086● g20,24 24 21.6 à 26.4 1.1 29 SB 614F 960-0094● g20,09 80mm, Standard 12 8 à 15 2 69 SB 8412NG 960-1023● g18,71 12* 8 à 15 2 69 SB 8412NG/2 960-0000● g19,42 24 18 à 28 2 69 SB 8414NG 960-1031● g18,71 24* 18 à 28 2 69 SB 8414N/2G 960-0043● g19,87 12 7 à 15 2.8 79 SB 8412NGH 960-1040● g20,30 12* 7 à 15 2.8 79 SB 8412N/2GH 960-0019● g24,48 24 18 à 26 2.2 79 SB 8414NGH 960-1058● g20,30 24* 18 à 26 2.2 79 SB 8414N/2GH 960-0051● g24,48 80mm, Faible bruit 12 8 à 15 1.3 58 SB 8412NGM 960-1007● g18,71 12* 8 à 15 1.3 58 SB 8412N/2GM 959-9991● g22,36 24 18 à 28 1.4 58 SB 8414NGM 960-1015● g18,71 24* 18 à 28 1.4 58 SB 8414/2GM 960-0035● g21,92 80mm, Trés faible bruit 12 8 à 15 0.6 33 SB 8412NGL 960-0981● g18,71 12 8 à 15 0.6 33 SB 8412N/2GL 959-9983● g22,36 24 18 à 28 0.7 33 SB 8414NGL 960-0990● g18,71 24* 18 à 28 0.7 33 SB 8414N/2GL 960-0027● g22,58 92mm, Standard 12 8 à 15 2.2 84 SB 3412NG 960-0388● g18,95 12 8 à 15 2.2 84 BB 3412N 960-0396● g22,26 24 18 à 28 2.3 84 SB 3414NG 960-0434● g18,95 24 18 à 28 2.3 84 BB 3414N 960-0442● g22,26 12 8 à 15 3 94 SB 3412NGH 960-0400● g18,95 24 18 à 28 3 94 SB 3414NGH 960-0450● g18,95 92mm, Faible bruit 12 8 à 15 1.6 72 SB 3412NGM 960-0370● g18,95 24 18 à 28 1.8 72 SB 3414NGM 960-0426● g18,95 92mm, Trés faible bruit 12 8 à 15 1.2 61 SB 3412NGL 960-0361● g18,95 24 18 à 28 1.4 61 SB 3414NGL 960-0418● g18,95 119mm, Standard 24 12 à 28 5 170 BB 4414F 960-1082● g34,94 24* 12 à 28 5 170 BB 4414F/2 960-0078● g38,85 119mm, Faible bruit 12 7 à 12.6 3.2 140 SB 4412FGM 960-1066● g35,77 12* 7 à 12.6 3.2 140 BB 4412F/2 960-0060● g38,85 24 12 à 28 3.2 140 BB 4414FM 960-1074● g34,94 * Option capteur de vitesse *Les ventilateurs à connexions à ergots doivent être raccordés à un câble (959-9720) par soudure. Tension Puissance Débit Bruit Température Réf. Code (Vca) (W) m3/h ltrs/s dBA à 1m (°C) Fab. Commande 115 24 390 108.2 57 -30°C à +80°C 7006ES 960-1120 230 29 330 91.5 52 -30°C à +65°C 7056ES 960-1139 115 29 500 138.7 58 -30°C à +75°C 6028ES 960-1147 230 26 420 116.6 54 -30°C à +75°C 6078ES 960-1155 80mm 60mm 80mm 92mm 119mm Hauteur 60 80 92 119 Largeur 60 80 92 119 Epaisseur 15 25 25 25 Ø Découpe 57 77 89 116 Entraxe Fixation 50 x 50 71.5 x 71.5 82.5 x 82.5 104.8 x 104.8 Ø trous 3.7 4.5 4.5 4.5 *Option capteur de vitesse : signal de forme carrée dont l’amplitude dépend la résistance utilisée,2 impulsions par tour, collecteur ouvert sans résistance interne. Tension Puiss. Débit Bruit *Type Type Code Prix V ac Watts m3/h dBA à 1m Connexion Roulement Réf. Fab. Commande Unitaire 80mm, Ultra faible bruit 115 8 36 21 Fil SB 8830N 960-1473● g39,84 230 9 30 18 Fil SB 8880N 960-1481● g39,84 80mm, Très faible bruit 115 11 47 28 Fil SB 8800N 959-9800● g43,37 230 12.5 37 24 Fil SB 8850N 959-9797● g39,84 80mm, Faible Bruit 115 11 61 34 Fil SB 8500N 959-9754● g41,01 230 12 50 30 Fil SB 8550N 959-9762● g30,90 80mm, Standard 115 11 61 35 Fil BB 8506N 960-1414● g47,01 230 12 50 31 Fil BB 8556N 960-1422● g52,77 80mm, Double tension 115/220 11 49.3 31 Fil SB 8560N 959-9924● g49,36 92mm, Standard 115 11 89 41 Fil SB 3600 960-0523● g29,75 230 12 20.8 36 Fil SB 3650 960-0531● g29,75 115 11 89 42 Fil BB 3606 960-0540● g40,62 230 12 75 37 Fil BB 3656 960-0558● g41,93 119mm, Trés faible bruit 115 10 85 26 Boitier mâle SB 4840N 959-9789● g32,55 230 11 80 25 Boitier mâle SB 4890N 959-9770● g33,84 119mm, Faible bruit 115 9 97 32 Boitier mâle SB 4800N 959-9738● g32,69 230 10 100 30 Boitier mâle SB 4850N 959-9746● g29,46 119mm, Standard (PL) 115 18 180 50 Boitier mâle SB 4600N 959-9703● g35,80 230 19 160 46 Boitier mâle SB 4650N 959-9711● g39,37 115 18 180 51 Boitier mâle SB 4606N 960-1511● g49,16 230 19 160 47 Boitier mâle SB 4656N 960-1520● g49,16 Dimensions Code H x L x P Tension Commande Prix Unitaire 150150x172x38 115V 960-1120● g109,61 150150x172x38 230V 960-1139● g109,61 Ø172x51 115V 960-1147● g117,64 Ø172x51 230V 960-1155● g117,64 • Ventilateurs faible puissance et haut débit • Cadre en plastique (PTB) renforcé verre • Roulement à billes (BB) ou à paliers (SB) • Approuvés VDE, UL et CSA, UL seulement pour les 92mm Ventilateurs secteur c.a. métalliques Ventilateurs basse tension c.c. H=150, L=172, P=38,Ø =172, P=51 Ventilateurs secteur c.a. Haute pression • Ventilateurs avec cadre et pales métalliques • Protection thermique, rotor externe • Paliers à roulements à billes • Approuvés VDE, UL et CSA 60mm A partir de g109,61 CODE COMMANDE 960-1120● • Moteur à bagues de roulements à déphasage et rotor extérieur • Homologués VDE, CSA and UL • Roulement à billes (BB) ou à paliers (SB) 80mm 80mm H=80, L=80, P=38. Ø découpage =77. Centrages fix.=71.5 x 71.5 x 4 92mm 119mm H=119, L=119, P=38 découpage Ø=115. Centrages fix.=105 x 105 x 4. 119mm • Ventilateurs puissants à haute pression RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Informatique 95 Bureautique Mini souris optique Bluetooth Carte PC CardBus USB 2.0/FireWire • Permet d’ajouter une connexion USB 2.0 et Firewire à l’ordinateur portable • 2 fiches USB 2.0, 1x 4 pin et 1x 6 pin FireWire • Rétro-compatible USB 1.1 • Taux de transfert jusqu’à 480Mbps (USB 2.0) et 400Mbps (FireWire) Code Description Commande Prix Unitaire Boîtier DVD simple Individuel 371-0464 g0,54 Paquet de 5 426-0211 g2,84 Boîtier DVD double Individuel 426-0193 g0,78 Paquet de 3 426-0200 g1,86 Casque Bluetooth Ellipse Souris optique • Commutation économique • Indicateur de faible batterie • Aucun dongle • Compatible Win 98SE/2000/2003/XP et Mac OSX 10.2.8 ou sup. • Comprend : souris, batteries et manuel Ecran TFT 19" VGA/DVI Dépoussiérants Gaz sec Boîtiers DVD Seulement g40,28 CODE COMMANDE 145-6571 Clavier noir standard XpertTouch Vitesse/ Code Prix par Description Imprimable Commande Paquet DVD+R Spindle x25 8x 869-5350 g66,50 Spindle x10 16x 110-3413 g29,70 Spindle x25 16x 110-3414 g67,00 Spindle x25 16x Imprimable 110-3415 g69,00 Spindle x50 16x Imprimable 110-3417 g139,00 Boîte x5 16x 110-3426 g15,00 Boîte x10 16x Imprimable 110-3423 g30,00 DVD+RW Boîte x10 4x 728-2540 g33,00 Spindle x25 4x 110-3433 g74,00 DVD-R Spindle x10 16x 110-3421 g28,00 Spindle x25 16x 110-3418 g67,00 Spindle x25 16x Imprimable 110-3419 g69,00 Spindle x50 16x Imprimable 110-3420 g139,00 Boîte x10 16x Imprimable 110-3422 g30,00 DVD-RW Boîte x5 2x 728-2552 g17,00 Boîte x5 2x-4x 110-3424 g17,20 Boîte x5 6x 110-3432 g17,80 • Jusqu’à 4h de communication • Autonomie en veille: 100h • Très confortable • Indicateur par LED • Très léger (seulement 5g avec pile) • Compatible Bluetooth version 1.2 Seulement g28,00 CODE COMMANDE 418-4683 • Compatible Plug and Play • Alimentée par adaptateur c.a. ou cordon alimentation USB • Compatible Win 98SE/ME/2000/XP Comprend: adaptateur, adaptateur c.a., cordon USB et driver A partir de g39,70 CODE COMMANDE 870-6565 • Dépoussiérants hautes performances • Forte pression • Dépoussiérent les endroits les plus inaccessibles • Sec et pur à 99.9% • Utilisable sous tension • Ininflammable • Profiles casque et mains libres DVD±R/RW Media • Clavier noir standard AZERTY, 108 touches • Compact avec configuration classique pour une frappe intuitive • 3 touches supplémentaires: alimentation, veille et sortie de veille • Compatible avec ordinateurs dotés d’une connexion PS/2 Modèle: TS902D • Résolution 1280x1024 (pas 0.294) • Temps de réponse: 8ms • Hauts-parleurs intégrés (1W par canal) • Base inclinable démontable • Fixation VESA • Garantie constructeur 3 ans • Comprend: écran, cordon VGA, cordon DVI, cordon secteur IEC, cordon audio et manuel d’utilisation. • Boîtiers plastiques robustes noirs • Disponibles en version simple ou double Navigator 900 • Souris optique pouvant s’utiliser sur toutes surfaces sans tapis • Molette de défilement • Logiciel IntelliPoint fourni • Pour droitiers et gauchers • Connecteur PS/2 ou USB A partir de g13,00 CODE COMMANDE 361-9060 • 4.7Go, simple couche, pour usage général • Technologie Advanced AZO pour tous les DVD+R/-R – protection anti-UV et une plus grande fiabilité et performance • SERL pour tous les DVD +RW/-RW – une couche spéciale d’enregistrement sans parasite sonore • Livrés en spindle ou boîte • Compatible Win 98/ME/2000 pro/XP/NT4.0 (sp6 ou sup.-non USB), Mac OS8.6 à 9.x-OS10.1 A partir de g34,99 CODE COMMANDE 130-3532● Seulement g189,00 CODE COMMANDE 150-7896 Seulement g7,94 CODE COMMANDE 110-4982▲ Réf. Code Prix Fab. Commande Unitaire Gaz sec Aérosol 650ml (400 grs net) 6903 361-9060 g13,00 Gaz sec toutes positions Aérosol 650ml (300 grs net) 6910 361-9072 g13,00 Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Informatique 96 Bureautique Code Réf. Fab. Description Commande Prix Unitaire 34627 LW400 110-9641 g115,81 34635 LW400 TURBO 110-9642 g150,33 34643 LW400 DUO 110-9644 g210,50 Code Description Commande Prix Unitaire 6 à 6 broches 2m 782-6923 g6,10 3m 782-6931 g8,30 5m 782-6940 g6,38 6 à 4 broches 2m 782-6958 g6,10 3m 782-6966 g4,15 5m 782-6974 g6,38 4 à 4 broches 2m 782-6982 g6,10 3m 782-6990 g8,30 5m 782-7008 g6,38 Câbles USB 2.0 Câbles FireWire Câbles USB A vers B ou A vers A pour une utilisation avec l’interface USB 2.0 plus rapide. Code Prix Code Prix Commande Description Unitaire Commande Description Unitaire 431-6459 Gris 0.5m g2,45 431-6587 Jaune 3m g3,48 431-6460 Gris 1m g2,77 431-6599 Jaune 5m g4,30 431-6472 Gris 2m g3,09 431-6605 Vert 0.5m g2,45 431-6484 Gris 3m g3,65 431-6617 Vert 1m g2,77 431-6496 Gris 5m g4,44 431-6629 Vert 2m g3,01 431-6502 Rouge 0.5m g2,45 431-6630 Vert 3m g3,52 431-6514 Rouge 1m g2,77 431-6642 Vert 5m g4,30 431-6526 Rouge 2m g3,01 431-6654 Bleu 0.5m g2,52 431-6538 Rouge 3m g3,65 431-6666 Bleu 1m g2,77 431-6540 Rouge 5m g4,44 431-6678 Bleu 2m g3,09 431-6551 Jaune 0.5m g2,45 431-6680 Bleu 3m g3,52 431-6563 Jaune 1m g2,77 431-6691 Bleu 5m g4,30 431-6575 Jaune 2m g3,01 Code Description Commande Prix Unitaire 1.8m 124-2281 g6,78 3m 124-2282 g8,29 5m 124-2284 g10,56 Nbre d’étiquettes Code Réf. Fab. Description par rouleau Commande Prix Unitaire LabelWriter - Etiquettes multi-usages 11353 12 x 24 mm, blanc 1000 783-6732 g8,26 11354 57 x 32 mm, blanc 1000 783-6740 g22,17 11355 19 x 51 mm, blanc 500 783-6759 g9,19 LabelWriter - Etiquettes classeur 99018 38 x 190 mm, blanc 110 154-787 g27,24 99019 50 x 190 mm, blanc 110 154-799 g29,83 99017 Etiquettes dossiers suspendus 12 x 50 mm, blanc 220 154-775 g12,55 LabelWriter - Etiquettes de données 99015 Etiquettes disquette 54 x 70 mm, blanc 320 154-751 g26,68 99016 Etiquettes vidéo blanches Top: 46 x 78 mm; Dos: 19 x 147 mm 150 783-6805 g35,61 14681 Etiquettes CD-/DVD 1000 783-6708 g11,79 14682 Applicateur étiquettes CD-/DVD 783-6813 g8,65 LabelWriter - Etiquettes adresse et expédition 99013 Etiquettes d’adresse 36 x 89 mm, transparent 260 154-738 g31,39 99012 Etiquettes d’adresse 36 x 89 mm, blanc 260 783-6791 g22,41 99011 Etiquettes, 28 x 89 mm, jaune, rose, bleu, vert 130 783-6783 g35,61 99014 Etiquettes d’expédition 54 x 101 mm, blanc 220 154-740 g25,11 99010 Etiquettes d’adresse 28 x 89 mm, blanc 1000 783-6775 g12,02 11352 Etiquettes adresse retour 25 x 54 mm, blanc 500 783-6724 g11,09 LabelWriter - Etiquettes pour badge nominatif 11356 Etiquettes badge blanches 41 x 89 mm 300 783-6767 g16,19 LabelWriter - Etiquettes de prix 11351 Etiquettes de prix 54 x 11 mm, blanc 1500 783-6716 g25,80 Une gamme de câbles IEEE1394 ’FireWire’ pour la connection de votre PC avec tout périphérique audio/vidéo équipé d’un connecteur Firewire.Ces câbles sont disponibles en plusieurs longueurs, avec des connecteurs mâles de 4 ou 6 broches. Etiqueteuses DYMO LabelWriters Cordons RJ45 UTP Cat 6 • Permet de rallonger le cordon d’une souris série, moniteur vidéo CGA/EGA ou tout autre appareil doté de connecteur DB9 • Gaine de câble caoutchoutée en PVC Flextec • Contacts cuivre plaqués or • Installation facile grâce aux vis à oreilles • Garantie Belkin à vie A partir de g1,97 CODE COMMANDE 101-9951 A partir de g4,15 CODE COMMANDE 782-6966 Série 400 Code Prix Description Commande Unitaire A mâle vers B mâle Type A mâle - B mâle, 2m 393-4251 g3,00 Type A mâle - B mâle, 3m 393-4263 g3,84 Type A mâle - B mâle, 5m 395-2782 g5,49 A mâle vers A mâle Type A mâle - A mâle, 2m 101-9939 g3,15 Type A mâle - A mâle, 3m 101-9953 g3,56 Type A mâle - A mâle, 5m 101-9954 g4,36 A mâle vers A femelle Type A mâle - A femelle, 0.5m 101-9951 g1,97 Type A mâle - A femelle, 1m 101-9952 g2,38 Type A mâle - A femelle, 2m 101-9940 g3,15 Câble d’extension série DB9 LabelWriter 400 • Imprime directement et automatiquement de MS Word, Outlook et des Palms • Ajout dans la base de données avec par exemple MS Access, MS Excel • Impression de 40 étiquettes à la minute • Résolution de 300 dpi pour des étiquettes de très haute A partir de g6,78 CODE COMMANDE 124-2281 qualité • Etiquettes d’une largeur maximale de 60 mm • Sauvegarde automatique de la première étiquette LabelWriter 400 Turbo • Caractéristiques similaires au LabelWriter 400 hormis la vitesse d’impression • Vitesse d’impression de 55 étiquettes par minute LabelWriter 400 Duo • Toutes les fonctions exceptionnelles mais aussi la rapidité de la LabelWriter 400 Turbo • Etiquettes papier (LW) et rubans (LM) Unité supérieure • Résolution de 300 dpi pour des étiquettes de très haute qualité • Etiquettes d’une largeur maximale de 60 mm • Vitesse d’impression de 55 étiquettes par minute • Sauvegarde automatique de la première étiquette Unité LabelMANAGER PC: • Résolution de 180 dpi • Impression en continue sur le ruban • Accepte les rubans D1 6, 9, 12,19, 19, 24mm • Détachage automatique Caractéristiques générales: • Connexion USB • Compatible PC et Mac RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Pro Power 97 Câbles Codage couleur conducteurs 3 conducteurs : 2 Noirs numérotés, Vert/Jaune 4 conducteurs : 3 Noirs numérotés, Vert/Jaune 5 conducteurs : 4 Noirs numérotés, Vert/Jaune 7 conducteurs : 6 Noirs numérotés, Vert/Jaune 12 conducteurs : 11 Noirs numérotés, Vert/Jaune 18 conducteurs : 18 Noirs numérotés, Vert/Jaune Capacité 100pF Diamètre nominal extérieur 4.95mm Impédance 50Ω Capacité 67pF Diamètre nominal extérieur 6mm Taille Brins Courant Dia. extérieur Conducteur CSA Nominal Nominale 1mm² 1x1.13mm 13A 2.8mm 1.5mm² 7x0.53mm 17A 3.5mm 2.5mm² 7x0.67mm 24A 4.2mm 4mm² 7/0.85mm 32A 4.8mm 6mm² 7x1.04mm 41A 5.4mm 10mm² 7x1.35mm 55A 6.8mm 16mm² 7x1.70mm 74A 8mm 25mm² 7/2.14mm 97A 9.8mm RG58CU 50Ω RG59BU 75Ω Code Prix Par Commande Couleur Bobine 1.0mm2 120-2719● Rouge g19,04 133-3157● Noir g19,04 1.5mm2 120-2722● Rouge g22,05 133-3163● Noir g22,05 133-3165● Marron g22,05 133-3166● Vert/Jaune g22,05 2.5mm2 120-2725● Rouge g31,56 133-3168● Noir g31,56 133-3169● Bleu g31,56 120-2729● Jaune g31,56 133-3171● Vert/Jaune g31,56 4.0mm2 133-3176● Marron g54,70 133-3175● Blue g54,70 120-2732● Jaune g54,70 133-3177● Vert/Jaune g54,70 6.0mm2 133-3182● Vert/Jaune g73,24 10mm2 133-3188● Vert/Jaune g121,19 16mm2 133-3190● Noir g193,92 133-3193● Vert/Jaune g193,92 Longueur Longueur Section bobine Code Prix Par Section bobine Code Prix Par conducteurs(m) Commande Bobine conducteurs(m) Commande Bobine 3 conducteurs 7 conducteurs 0.75mm² 50 388-4466● g29,14 0.75mm² 50 388-4650● g59,45 0.75mm² 100 388-4478● g54,67 1mm² 50 388-4661● g74,18 1mm² 50 388-4480● g32,83 1.5mm² 50 388-4673● g103,52 1mm² 100 388-4491● g61,64 2.5mm² 50 120-2708● g194,13 1.5mm² 100 388-4510● g76,25 8 conducteurs 2.5mm² 100 388-4533● g121,85 1.5mm² 50 120-2709● g156,56 4 conducteurs 2.5mm² 50 120-2710● g221,06 0.75mm² 50 388-4545● g33,87 12 conducteurs 0.75mm² 100 388-4557● g63,56 0.75mm² 50 388-4685● g97,78 1mm² 50 388-4569● g48,80 1.5mm² 50 120-2711● g200,39 1mm² 100 388-4570● g91,65 2.5mm² 50 120-2712● g347,55 1.5mm² 50 388-4582● g58,43 18 conduceturs 1.5mm² 100 388-4594● g109,71 0.75mm² 50 120-2713● g270,85 2.5mm² 50 388-4600● g95,65 1.5mm² 50 120-2714● g308,88 2.5mm² 100 388-4612● g179,59 2.5mm² 50 120-2715● g582,75 5 conducteurs 0.75mm² 50 388-4624● g50,27 1.5mm² 50 388-4636● g65,72 2.5mm² 50 388-4648● g119,72 • Câble RG58 haute qualité • Conducteur multibrin en cuivre étamé 19/0,18mm • Diélectrique en polyéthylène plein • Tresse en cuivre couvrant à 90% • Isolation en PVC noir • Bobine de 100m Câble 6491X BS6004 Câble Type YY • Câble coaxial RG59 haute qualité • Conducteur en cuivre plein 0,58mm • Diélectrique plein en polyéthylène • Tresse en cuivre couvrant à 90% et PVC isolant noir Seulement g53,84 CODE COMMANDE 378-8155 • Câble de commande d’alimentation souple d’usage général dans la commande d’alimentation, l’instrumentation ou l’équipement automatisé nécessitant ni blindage ni armature • Gaine extérieure PVC gris avec conducteurs en cuivre Seulement g43,58 CODE COMMANDE 121-9357● Ces câbles servent dans des applications électriques d’installation où des câbles vont être protégés par le conduit. Ils peuvent également être employés à l’intérieur des installations fixes et protégées telles que des appareils, du mécanisme et de la vitesse de commande. A partir de g29,14 CODE COMMANDE 388-4466● • Approuvé BASEC • Type HO7V-R1(1.5mm to 25mm) ou HO5V-U1(1.0mm) • Les conducteurs en cuivre sont isolés avec du PVC - BS 6004 table 1 • Tension nominale entre les conducteurs et la terre : 450V (750V entre les conducteurs) • Plusieurs couleurs disponibles • Vendu en bobine de 100m A partir de g19,04 CODE COMMANDE 120-2719● Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tél.: 04 74 68 99 99 Fax: 04 74 68 99 90 Jaeger 98 Connecteurs multipolaires Intensité admissible par contact7A Résistance de contact <3mΩ Tension de claquage >1500V efficaces Résistance d’isolement >5000MΩ Température d’utilisation -40 à 100°C Corps Matière Alliage léger Revêtement Nickel Contacts Matière Laiton Revêtement Doré Section max. des conducteurs 0.34mm2 Intensité admissible par contact 10A Résistance de contact <2mΩ Tension de claquage >2500V efficaces Résistance d’isolement >5000MΩ Température d’utilisation -40 à 100°C Corps Matière Alliage léger Revêtement Nickel Contacts Matière Laiton Revêtement Doré Section max. des conducteurs 0.93mm2 Nombre Nombre Taille de Code Prix Taille de Code Prix Boîtier Contacts Réf. Fab. Commande Unitaire Boîtier Contacts Réf. Fab. Commande Unitaire Embases mâles Fiches mâles 00 7 761107006 488-4632● g20,55 00 7 762107006 488-4693● g17,33 0 19 761119006 488-4644● g24,39 0 19 762119006 488-4700● g21,35 Embases femelles Raccords à presse-étoupe 00 7 761207006 488-4656● g23,24 00 7 769807006 488-4711● g11,04 0 19 761219006 488-4668● g38,38 0 19 769819006 488-4723● g11,71 Fiches femelles Raccords à presse-étoupe + masse 360° 00 7 762207006 488-4670● g20,95 00 7 769907006 488-4735● g12,87 0 19 762219006 488-4681● g37,57 0 19 769919006 488-4747● g16,35 Tension de claquage entre broches voisines >2500V efficaces Tension de claquage entre broches périphériques et masse >1500V efficaces efficaces Résistance d’isolement >5000MΩ Température d’utilisation -40 à 100°C Corps Matière Alliage léger Revêtement Nickel Contacts Matière Laiton Revêtement Argent Section max. des conducteurs Ø2mm: 1.34mm2 Ø3mm: 3.18mm2 Ø4mm: 5.26mm2 Nombre Nombre Taille de Code Prix Taille de Code Prix Boîtier Contacts Réf. Fab. Commande Unitaire Boîtier Contacts Réf. Fab. Commande Unitaire Embases mâles Fiches femelles 1 3 536003006 488-3512● g13,63 1 3 532003006 488-3536● g17,40 1 4 536004006 488-3998● g8,54 1 4 532004006 488-4000● g18,13 1 6 536006006 488-3524● g8,97 1 6 532006006 488-3548● g19,44 2 4 533755006 488-4498● g18,30 2 4 530755006 488-4516● g36,22 2 8 536008006 488-4504● g9,67 2 8 532008006 488-4528● g22,97 2 12 536012006 488-4024● g10,94 2 12 532012006 488-4036● g25,57 Embases femelles Fiches mâles 1 3 536603006 488-3457● g11,80 1 3 532653006 488-3550● g17,93 1 4 536604006 488-3937● g12,37 1 4 532654006 488-4012● g18,13 1 6 536606006 488-3469● g13,86 1 6 532656006 488-3561● g18,38 2 4 533760006 488-4450● g28,81 2 4 530754006 488-4530● g28,29 2 8 536608006 488-4462● g15,87 2 8 532658006 488-4541● g19,73 2 12 536612006 488-3974● g17,39 2 12 532662006 488-4048● g21,01 Série "Push-Pull Atto" Nombre Nombre Taille de Code Prix Taille de Code Prix Boîtier Contacts Réf. Fab. Commande Unitaire Boîtier Contacts Réf. Fab. Commande Unitaire Embases mâles 00 4 530801006 488-3846● g30,20 00 3 533233006 488-4188● g20,35 0 7 530272006 488-3858● g36,71 00 4 533801006 488-3809● g20,35 Fiches mâles 0 7 533273006 488-3810● g21,47 00 3 530233006 488-4218● g22,19 Embases femelles 00 4 530800006 488-3860● g23,70 00 3 533232006 488-4206● g25,13 0 7 530273006 488-3871● g24,63 00 4 533800006 488-3822● g27,16 Raccords serre-câbles 0 7 533272006 488-3834● g33,55 00 3 530331006 488-4220● g13,58 Fiches femelles 00 4 530841006 488-3883● g12,39 00 3 530232006 488-4190● g28,07 0 7 530371006 488-3895● g12,59 Série "Rapide" Série "Push-Pull Natto" Fiches et embases • IP 50 à IP 54 avec joint sous embase et conexil • 3 à 12 contacts de diamètre 2mm, 3mm et/ou 4mm • Intensité admissible par contact : Ø2mm=15A, Ø3mm=35A et Ø4mm=50A • Résistance de contact : Ø2mm<1.5mΩ, Ø3mm<1mΩ et Ø4mm<0.7mΩ • Prolongateurs et accessoires disponibles sur le catalogue ou le site internet Fiches et embases • Embases et fiches de la série "Push-Pull ATTO" • Verrouillage Push-Pull, pour verrouillage et déverrouillage très fréquent • Forte densité de contact et encombrement réduit • Disponibles en version 7 contacts (boîtier taille 00) ou 19 contacts (boîtier taille 0) de diamètre 0.76mm • Contacts démontables à souder ou à sertir. L’outillage 769131006 (code commande 488-4759) est indispensable au montage et démontage des contacts • 7 Ampères maxi, à moduler en fonction du nombre de contacts traversés par cette intensité, de l’échauffement admissible et de la température ambiante • IP 65, répond à la spécification MIL-C-5015 • Répond à la spécification MIL-C-5015 • Embases et fiches de la série "Push-Pull NATTO" • Verrouillage Push-Pull, pour verrouillage et déverrouillage très fréquent • Forte densité de contact et encombrement réduit • Disponibles en version 3 ou 4 contacts (boîtier taille 00) ou 7 contacts (boîtier taille 0) de diamètre 1mm • Contacts démontables à souder ou à sertir. L’outillage 597104006 (code commande 488-3901) est indispensable au montage et démontage des contacts • 7 Ampères maxi, à moduler en fonction du nombre de contacts traversés par cette intensité, de l’échauffement admissible et de la température ambiante • IP 65, répond à la spécification MIL-C-5015 Fiches et embases • Contacts indémontables à souder RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain MIL-C-5015 99 Connecteurs multipolaires Spécifications Intensité nominale 13A Résistance d’isolement ≥5000MΩ Tension Nominale CA 200V rms Tension Nominale CC 250V Endurance 500 cycles Gamme de température -55°C à 125°C Données de Test Environnemental Vibration MIL-STD-1344 Méthode 2005. 10 ∼ 500Hz (10G) Chocs 50G/ Temps 11 sec. Test de Courant 100mA Tests Salins MIL-STD-1344 Méthode 1001. Solution salée 5% 48 heures Humidité 95% ± 3% température 71oC ± 2oC Matériaux Boîtiers Alliage d’Aluminium, Plaqué Zinc avec Chromate Noir Conatcst (Taille 16) Alliage de Cuivre, Finition Argent Isolants et Joints Ruban Synthétique Taille Nbre de Code Prix Taille Nbre de Code Prix du Boîtier Contacts Commande Unitaire du Boîtier Contacts Commande Unitaire Fiches mâles libres Contacts Femelles Embases femelles Montage Panneau - Contacts Mâles 10 2 130-6063● g19,15 10 2 130-6076● g9,04 10 3 130-6064● g20,32 10 3 130-6077● g9,88 14 4 130-6062● g21,81 14 4 130-6075● g9,94 14 6 130-6061● g24,06 14 6 130-6074● g11,63 Fiches mâles libres Contacts Mâles Fiches femelles libres Contacts Femelles 10 2 130-6068● g18,49 10 2 130-6082● g19,62 10 3 130-6069● g19,33 10 3 130-6083● g20,47 14 4 130-6067● g20,46 14 4 130-6081● g22,31 14 6 130-6065● g22,15 14 6 130-6079● g24,03 Embases femelles Montage Panneau - Contacts Femelles Fiches femelles libres Contacts Mâles 10 2 130-6072● g9,69 10 2 130-6086● g18,31 10 3 130-6073● g10,82 10 3 130-6087● g18,76 14 4 130-6071● g11,30 14 4 130-6085● g20,35 14 6 130-6070● g13,55 14 6 130-6084● g21,19 Connecteurs MIL-C-5015 14S-6 14S-2 10SL-4 10SL-3 Seulement g2143,20 CODE COMMANDE 133-4041 Description Réf. Fab. Code Commande Prix Unitaire 1 voie, 25MHz AFG3021B 142-5300 g1590,00 2 voies, 25MHz AFG3022B 142-5301 g2390,00 1 voie, 100MHz AFG3101 129-9081 g3150,00 2 voies, 100MHz AFG3102 129-9082 g4160,00 A partir de g1590,00 CODE COMMANDE 142-5300 La chaîne de signal analogique, selon National Semiconductor Haute vitesse et basse puissance 19 Il y a quelques années, on annonçait le déclin de l’électronique analogique, mais en fait ce secteur va de mieux en mieux. Dans nombre de domaines, les composants analogiques ont été remplacés par des numériques, mais ils ont trouvé d’autres niches de marché. Par exemple, on estime à dix le nombre de composants analogiques requis pour le fonctionnement de chaque DSP dans un circuit. L’organisation mondiale des statistiques du commerce des semi-conducteurs estime le marché analogique à 36.77 milliards de dollars US en 2007 et il semblerait que sa croissance atteigne 12,6% l’année prochaine (le deuxième plus important secteur de croissance de l’industrie, après le logique). Ce développement a été alimenté par une croissance considérable de l’utilisation des appareils électroniques portables grand public et de l’infrastructure de communications venant en support de ceux-ci. Les deux fonctions principales qui restent et demeureront analogiques dans l’avenir prévisible sont la gestion de puissance et la chaîne de signal. Le rôle de la gestion de puissance est évident, notamment dans les appareils portables alimentés sur batteries, la durée de vie de celles-ci étant primordiale au succès d’un produit portable. La chaîne de signal constitue la seconde fonction analogique d’un circuit et, bien qu’elle ait un rôle moins évident qu’auparavant, elle est tout aussi importante. Focus sur les composants analogiques de National Semiconductor National Semiconductor est l’un des premiers fabricants de composants analogiques. L’entreprise a cédé son activité microprocesseur Geode à AMD en 2003 afin de cibler exclusivement ses solutions analogiques. L’entreprise focalise tous ses efforts de R&D dans ce domaine technologique. National offre des solutions de transfert de données série et de conversion, de conditionnement de signal analogique haute performance pour répondre aux besoins des applications finales techniquement exigeantes, telles que les stations de base sans fil, la réseautique, l’instrumentation, l’équipement militaire, aérospatial et médical. L’entreprise tente de simplifier le processus de conception de la chaîne de signal avec une offre étendue de solutions. Cet article traite de certaines solutions de National et explique les spécifications les plus importantes requises par les ingénieurs concepteurs. Les trois domaines du concept MIDAS, sur lesquels l’article se concentre, sont les amplificateurs, les convertisseurs de données et les produits d’interface. Besoins pour la conception La sélection des composants de la chaîne de signal implique la prise en compte du flux d’un signal, de sa source (souvent un capteur ou une source de signal) vers l’univers numérique des contrôleurs, processeurs et FPGA où le traitement du signal a lieu. Le processus de conception nécessite des valeurs d’impédance appariées, une minimisation des sources de bruit et la garantie d’un gain suffisant au niveau de l’entrée pour commander un CAN. Dès que la chaîne de base est élaborée, le travail de développement subsidiaire implique de s’assurer que chaque composant de la chaîne est correctement entraîné et protégé. La sélection du CAN le « mieux adapté » pour une application donnée repose sur plusieurs facteurs. La résolution est l’une des priorités car la précision du système en dépend, généralement. La précision elle-même dépend beaucoup de l’exécution du CAN et peut varier selon qu’il s’agit d’applications à très haut débit avec des fréquences d’échantillonnage supérieures à 200Msps (ex., ADC08D1000WG-QV), d’applications à haut débit allant de 1Msps à 200Msps (ex., ADC14V155) ou d’applications à usage général et débit plus faible, inférieur à 1Msps. En général, le choix entre le CAN ou l’amplificateur est habituellement le facteur restrictif dans les chaînes de signal à haute fréquence, si bien que la sélection des deux exige une grande attention. L’un des besoins les plus exigeants pour ce qui concerne le traitement de signal analogique est la fonction de conversion d’une terminaison simple vers une différentielle : éclatement du signal en deux signaux identiques qui peuvent être comparés pour filtrer le bruit, la distorsion ou tout autre effet non désiré au niveau signal. Celle-ci est souvent réalisée avec des transformateurs, mais si la gamme de fréquence du signal inclut du courant continu, le transformateur ne fonctionnera pas et il sera nécessaire d’utiliser un amplificateur terminaison simple / différentielle (ex., LMH6551). L’amplificateur ne fournit pas seulement une amplification, mais offre également déphasage niveau (permettant de soustraire le composant CC du signal), fonctions de correspondance d’impédance et gain. Bande passante, gain, bruit et distorsion constituent les principales spécifications dont il faut tenir compte pour un amplificateur. Le gain d’un amplificateur qui est légèrement inférieur au signal maximum de la pleine échelle d’un CAN est idéal pour éviter que le signal amplifié ne surcharge l’entrée du CAN et écrêter le signal en raison d’un décalage ou de légères imprécisions des valeurs de gain. Pour éviter également l’atténuation du signal avant qu’il arrive au CAN, il est souhaitable d’utiliser une bande passante d’amplificateur de 3dB supérieure à la bande passante du signal d’entrée. Enfin, dans tout système intégrant une chaîne de signal, le rapport signal/bruit est sans conteste une métrique clé. Du fait que le bruit d’horloge contribue au bruit d’ensemble du système, et que les horloges sont des composants essentiels de tout système, la régulation du bruit d’horloge est un élément capital de la conception système. National fabrique des conditionneurs d’horloge de précision avec VCO intégré (ex., LMK03000). Ce dispositif permet au concepteur de créer une architecture d’horloge complète (sous-système) qui réalise la meilleure performance possible et, à un niveau fonctionnel, non seulement génère une horloge de précision, mais également reconditionne et distribue une horloge générée en externe. Invitez vos clients à consulter cet article en ligne sur www.electronicsdesignworld.com 11 Puissance utile pour une performance de pointe Aujourd’hui, cette déclaration est devenue une nécessité. Dans la conception électronique moderne, la puissance représente un produit fini et la plus grande partie de la puissance qui fait fonctionner l’électronique finit en chaleur perdue car inutilisée. De plus en plus de pays ajoutent des fonctionnalités technologiquement avancées, la courbe de la consommation énergétique va cependant continuer à monter. Conscient de cette tendance à la hausse, National Semiconductor a développé des produits PowerWise pour offrir un niveau de performance avec une consommation énergétique réduite. Le rapport performance/puissance Une mesure métrique simple pour une voiture est la consommation moyenne de 0 à 100 km/h. Du fait de l’augmentation du prix des carburants, cette mesure métrique prend de l’importance. Ce concept s’applique également au rapport performance/puissance et pour un ingénieur cela peut signifier une ou deux choses : consommation plus faible ou performance supérieure. L’avantage évident d’une consommation moindre est l’économie plus importante réalisée ou la durée de vie prolongée des batteries, en plus d’une usure thermique réduite des composants électroniques. Plus la température ambiante est faible, plus la durée de vie du produit est prolongée, impliquant une baisse des coûts de remplacement. Améliorer le rapport performance/ puissance peut aussi offrir des avantages lorsqu’il est nécessaire d’installer un nouveau design avec des ressources sortantes. Par exemple, un boîtier Set Top (STB) pour connexion par câble peut nécessiter un espace physique égal ou plus petit que le modèle précédent, une puissance de même niveau ou supérieur, mais requiert un niveau de performance supérieur. Même si les ressources n’ont pas changées, pour réaliser avec succès son projet, le concepteur doit utiliser des composants plus performants et consommant la même énergie ou moins. Technologie de processus, architecture et systèmes La technologie de processus est importante, non seulement pour un niveau de qualité constant, mais également pour une meilleure performance avec une consommation moindre. Des traitements à bande passante élevée et faible déperdition sont essentiels pour fournir une performance globale optimale dans les semiconducteurs, mais ils ne représentent que 50% des critères requis. Les techniques et propriétés intellectuelles à la base de la conception des dispositifs sont aussi importantes que les traitements employés. Autre aspect important de la mesure du rapport performance/puissance qui n’est pas toujours apparent au niveau des composants individuels : la façon dont ces composants interagissent entre eux et qui permettra de réduire la consommation d’énergie. Outils pour augmenter l’efficacité Certains composants ont besoin d’outils pour contribuer à améliorer le rapport performance/puissance. Cela s’applique essentiellement, mais non exclusivement, aux régulateurs de commutation de puissance. L’outil de conception WEBENCH de National Semiconductor permet aux ingénieurs de ‘composer en interne’ un niveau de performance pour circuits d’alimentation en contrepartie d’autres paramètres, c.-à-d. la taille des composants. La famille PowerWise de régulateurs commutateurs simples (LM5576) en est un bon exemple. Cette famille est prise en charge par l’outil WEBENCH avec un contrôle du réglage du rendement requis pour le système, comme indiqué en Figure 1. En 1908, William A. Smith déclarait, « L’ingénierie est la science de la maîtrise, de la conservation de l’énergie fournie et stockée sous forme naturelle pour les besoins de l’homme. C’est le rôle de l’ingénierie d’utiliser cette énergie de manière optimale afin qu’il y ait le moins de pertes possible. » Figure 1. Contrôle d’optimisation WEBENCH Premier Farnell Global Technology Centre Conception de systèmes médicaux avec des microprocesseurs Abrégé Les dispositifs électroniques médicaux représentent toute une gamme de matériel comprenant aussi bien des machines de diagnostic par imagerie qui occupent toute une pièce, que des petits dispositifs portables que les patients peuvent emporter partout. Pour atteindre leurs objectifs de prestations optimales et de coûts réduits, les prestataires de soins de santé réclament aux fabricants des améliorations dans le domaine de la visualisation et de la transmission des données médicales image et vidéo. En réponse à cette demande, nous assistons à l'émergence de plusieurs tendances techniques susceptibles d'influencer l'architecture des matériels futurs : 􀁺 Le développement de matériel disponible dans le commerce et de matériel portable ; 􀁺 L'interface parallèle propriétaire sera remplacée par une interface HSIO standardisée ; 􀁺 Ajout de dispositifs de communication par Internet filaires et sans-fil. Alors que le public se préoccupe de plus en plus des questions de santé, la demande en produits médicaux électroniques sur le marché augmente, plus particulièrement dans le secteur des produits haut de gamme, comme les scanners CT, les IRM, les appareils de diagnostic à ultrasons ultra performants, etc. La taille du marché mondial de l'électronique médicale a connu une croissance importante. Espicom (une société d'étude de marché) prévoit que le volume des ventes sur le marché mondial de l'instrumentation médicale dépassera les 200 milliards de dollars, la part des produits médicaux électroniques étant de 45 %, c'est-à-dire 90 milliards de dollars. Quant à la perspective sur le marché médical chinois, il est évident que l'influence favorable provient des changements de politique gouvernementale, des progrès en matière de libéralisation du milieu hospitalier et d'une croissance accélérée du marché. La tendance au développement de matériel de petites dimensions plus portable sera accompagnée d'exigences plus strictes en matière de consommation d'énergie et de traitement des signaux. Les ingénieurs vont donc devoir relever des défis encore plus importants. Le marché chinois de l'électronique médicale poursuivait son expansion en 2006. Le volume total des ventes sur ce marché a dépassé les 20 milliards de RMB pour atteindre 21,08 milliards de RMB, une croissance de 15,6 % par rapport à l'année précédente, ce qui, de toute évidence, dépasse celle du même marché à l'échelle mondiale. Le marché chinois de l'électronique médicale maintiendra une croissance régulière avec un taux de croissance annuel moyen de 18,2 % dans les années à venir et on peut s'attendre à ce qu'en 2011, le volume de ce marché approche les 50 milliards de RMB. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Taux de croissance annuel moyen 11 % Figure 1 Marché international des semi-conducteurs médicaux Taux de croissance annuel moyen 12 % Taux de croissance annuel moyen ultrasons 15 % Source : Databeans, 2007 Figure 2 Marché international des semi-conducteurs d'imagerie médicale NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ bone density scanner scanner de densité osseuse MRI scanner scanner IRM Premier Farnell Global Technology Centre X-ray Rayon-X PET scanner scanner PET CT Scanner scanner CT electrocardiogram électrocardiogramme other imaging autre type d'imagerie ultrasound ultrasons Les secteurs de l'industrie tels que les semi-conducteurs, les composants, les matériaux électroniques médicaux et le matériel de fabrication ont vu leur production accélérée par la croissance du marché de l'électronique médicale. Dans les cinq prochaines années, le volume du marché des semi-conducteurs électroniques médicaux dépassera les 3,5 milliards de dollars avec un taux de croissance annuel moyen de 11 %. Pour répondre aux exigences strictes concernant la stabilité et les performances du matériel électronique médical, la sécurité du matériel et la sécurité personnelle des utilisateurs, ainsi qu'aux exigences spécifiques de certification des systèmes médicaux, les éléments électroniques médicaux et les programmes de conception, ainsi que les matériaux et les technologies de fabrication, etc., doivent satisfaire des exigences plus strictes. Architecture des systèmes médicaux À l'exclusion des analyseurs des gaz du sang, des tensiomètres numériques, des moniteurs de rythme cardiaque/pouls numériques, des glucomètres ou même des thermomètres numériques, la plupart des dispositifs médicaux se composent de cinq blocs de niveau système communs à chaque : 􀁺 Élément de biocapteur 􀁺 Module AFE 􀁺 Contrôle et traitement des données 􀁺 Interface utilisateur 􀁺 Gestion de batterie/d'alimentation électrique En apparence, la topologie de mise en oeuvre effective diffère largement d'un bloc à l'autre selon les exigences de détection, de traitement et d'affichage des informations qui dépendent du type d'appareil de mesure et de l'ensemble des caractéristiques. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Figure 3 Schéma fonctionnel d'un système médical uProcessor microprocesseur biosensor biocapteur precision amp ampli. précision buffer/ op. amp. buffer/ampli op. monitor moniteur speaker haut-parleur ADC CAN LCD Ctrl Commande LCD data bus bus de données Bluetooth ..... Transmission de données sans fil Bluetooth Zigbee WiFi/WiMax LED/KEY driver Driver de LED/Clavier USB controller wired data transmission Contrôleur USB - Transmission de données filaire Flash/ROM Mémoire flash/ROM Keypad clavier Power charger/management chargeur/gestion d'alimentation sensor capteur user interface interface utilisateur power alimentation back end arrière data ctrl contrôle des données LED display affichage LED NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Matériel à ultrasons utilisant des DSP et MCU Les systèmes à ultrasons tant médicaux qu'industriels utilisent des techniques d'imagerie focales pour obtenir des images performantes ; cette technique dépasse largement ce qui peut être obtenu par une approche à une voie. En utilisant un réseau de récepteurs, on peut créer une image haute définition en décalant, en mettant à l'échelle puis en résumant intelligemment l'énergie d'écho. Le concept de décalage et les signaux reçus d'un réseau de transducteurs de mise à l'échelle lui permettent de se concentrer sur un point unique dans la région balayée. En se concentrant sur différents points en une seule séquence, on peut finalement assembler une image. Figure 4 Schéma fonctionnel d'un système à ultrasons scan conversion post processing post-traitement de conversion de scan spectral doppler processing traitement de doppler spectral color/power doppler processing traitement de doppler couleur/Power doppler B mode processing traitement mode B switches commutateurs feedback retour time gain control contrôle de gain de temps audio amp. ampli audio monitor moniteur speaker haut-parleur beamformer unit Tx & Tx Transmission/réception - filtre de formation de voies numériques ADC CAN transducer matrix matrice de transducteur data bus bus de données Power management gestion de puissance NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Core power alimentation de coeur I/O power alimentation des E/S system power alimentation du système Flash/ROM Mémoire flash/ROM data storage stockage de données Keypad clavier Power management gestion d'alimentation sensor capteur user interface interface utilisateur power alimentation back end arrière data ctrl contrôle des données LED display affichage LED On utilise généralement un filtre passe-bas comme filtre anti-alias entre la tension Vac et le CAN, pour limiter la bande passante du bruit. On pourra trouver ici les topologies en phase linéaire basées sur le filtre deux à cinq pôles d'un système spécifique. Quant à la sélection d'un ampli op., les considérations primaires doivent inclure les fréquences d'entrée minimales et maximales, les déviations de signal, les distorsions harmoniques et les exigences de gain. Typiquement, les convertisseurs analogique/numérique (CAN) sont de 10 et 12 bits. Le rapport signal/bruit et la consommation électrique sont les facteurs les plus importants, suivis de l'intégration de voie. Source : www.ti.com/ADS527x EVM User’s Guide Figure 5 Mise en oeuvre des convertisseurs analogiques/numériques (CAN) [see note = voir note] L'ajout d'une interface LVDS entre le CAN et le filtre de formation de voies représente une autre tendance dans les CAN, le nombre de lignes d'interface pouvant être réduit de 6144 à 1024 pour un système à 512 voies en sérialisant les données sortant du CAN. Cette réduction permet d'utiliser des cartes de circuit imprimé plus petites et plus économiques qui forment une partie essentielle des systèmes d'imagerie portables. Les fonctions du DSP pouvant être utilisées dans un système d'imagerie comprennent le traitement Doppler, l'imagerie 2D, 3D et même 4D ainsi que tout un éventail d'algorithmes post-traitement destinés à améliorer la fonctionnalité et les performances. Les exigences les plus importantes d'un système d'imagerie sont des performances élevées et une large bande passante. Les systèmes à ultrasons offrent de nombreux niveaux de performance et de fonctionnalité différents. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Certaines solutions peuvent contenir des composants réclamant une gamme dynamique élevée, ou des composants dont les fonctions consistent à réaliser un traitement en virgule flottante en beaucoup moins de cycles. On peut citer la réduction spectrale ou la racine carrée comme exemples de ce type de fonctions. Les DSP conviennent parfaitement dans les applications qui favorisent un traitement en virgule flottante. Lorsqu'une application à ultrasons réclame un système d'exécution, un microcontrôleur de type processeur ARM, peut fournir la solution, car il est capable de gérer les exigences d'un système d'exécution. L'assemblage des signaux est assuré par un filtre de formation des voies numérique. Il s'agit d'un ASIC normal conçu sur mesure, mais sa fonction est mise en oeuvre par un procédé de logique programmable différent. Le signal numérisé est mis à l'échelle et décalé dans le filtre de formation des voies de manière à générer l'effet de concentration dans la chaîne réceptrice. Après le réglage correct, les signaux de toutes les voies réceptrices sont alors rassemblés et transférés au système d'imagerie. Le système d'imagerie peut être développé en tant qu'ASIC séparé, être un processeur programmable tel qu'un DSP, ou être entièrement un ordinateur de bureau. Les éléments de transmission doivent pouvoir être capables de contrôler des déviations de signal entre 100 V et 200 V. La plupart du temps cette opération est assurée par des FET haute tension. Deux types de commandes de FET peuvent être utilisés : marche/arrêt (pousser/tirer) ou linéaire classe-AB. La plus populaire est la méthode pousser/tirer qui ne demande qu'une interface très simple et très économique pour connecter les FET. La méthode classe-AB peut beaucoup améliorer la distorsion harmonique mais réclame des pilotes plus complexes et consomme plus d'énergie. Les fabricants de systèmes et d'équipement ont choisi de nombreux types de produits différents de plusieurs fournisseurs pour leurs applications d'imagerie à ultrasons, y compris les amplis op., les CAN simples, doubles et octaux (tous avec récupération de surcharge d'entrée rapide et d'excellentes performances dynamiques), les processeurs de signaux numériques, une circuit intégré frontal ultrason basse puissance à 8 voies, par exemple VCA8617 et ADS5270, conçu spécifiquement pour le marché des appareils à ultrasons. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Conception d'un scanner PET avec FPGA /PLD Selon le type d'isotope utilisé, on peut observer différentes fonctions métaboliques. Un scanner PET étant capable de suivre le trajet d'un cancer dans le corps et d'illustrer avec précision l'étendue de la maladie, c'est un outil particulièrement efficace dans le diagnostic des cancers, par exemple. Un autre secteur d'application en développement constant des scanners PET est le diagnostic des troubles neurologiques courants tels que la maladie d'Alzheimer, la maladie de Hodgkins et les accidents cérébrovasculaires. Figure 6 Schéma fonctionnel d'un scanner PET radiation radiation PMT array réseau PMT motors moteurs Precision amps amplis de précision HV supply control commande d'alimentation HT Rx gain control commande réception gain motor driver Driver moteur motion control contrôle de mouvement monitor moniteur timing and control relation temps et commande image processor processeur d'image ADC CAN data bus bus de données Power management gestion d'alimentation Core power alimentation coeur I/O power alimentation E/S system power alimentation système Flash/ROM Mémoire flash/ROM NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre data storage stockage de données Keypad clavier À cause du grand nombre de détecteurs qu'ils contiennent et de leurs caractéristiques avancées, les scanners PET ont besoin d'une solution de traitement frontal économique, souple, puissante et rapide. L'avantage d'utiliser des FPGA/PLD dans les scanners PET plutôt qu'un circuit intégré spécifique à l'application (ASIC) parait évident aux ingénieurs système. La reconfigurabilité en circuit (ICR) des dispositifs FPGA /PLD leur permet d'être configurés pour l'installation, reconfigurés pour le processus de détection effectif, et reconfigurés encore une fois pour réaliser des autodiagnostics, le cas échéant. Par exemple, pendant la configuration, l'ordinateur PC/104 programme les algorithmes d'étalonnage dans les dispositifs Altera, permettant ainsi à toutes les voies de traitement en bloc de réaliser l'étalonnage en même temps, réduisant ainsi la durée de configuration des détecteurs. La reconfigurabilité du dispositif FPGA/PLD lui permet de traiter facilement toutes ces fonctions. Il suffit de reconfigurer dans le système à chaque étape du processus. De même, la durée de traitement du signal reste minimale car le dispositif Altera peut accéder simultanément à tous les autres dispositifs du sous-système. Les dispositifs FPGA/PLD pouvant être facilement reconfigurés dans le système, ils représentent le meilleur choix pour la plupart des scanner PET haute résolution. Ils peuvent mettre en oeuvre la configuration, le processus de détection et un autodiagnostic dans les mêmes dispositifs FPGA/PLD, et permettent ainsi de raccourcir les temps de développement, d'économiser de l'espace au niveau des cartes et de réduire la consommation et les coûts d'énergie. Ils offrent également l'avantage supplémentaire d'un support garanti en cas de modifications futures éventuelles des exigences ou de la configuration du système. Tensiomètre avec microcontrôleurs Un microcontrôleur est conçu pour les applications haute précision en temps réel portables qui ont besoin d'un circuit intégré avec une grande mémoire. Il est utilisé en général dans les tensiomètres, les moniteurs du rythme cardiaque, les analyseurs de sang, les thermomètres numériques, les oxymètres de pouls, etc. Le système mesure la pression artérielle par l'une de trois méthodes, c'est-à-dire Korotkoff, oscillométrie ou pouls. À l'aide d'un brassard, d'une pompe et d'un transducteur, il mesure la pression artérielle et le rythme cardiaque en trois étapes : gonflement, mesure, et dégonflement. Il comporte un écran LCD, des boutons de sélection, un rappel de mémoire, une gestion d'alimentation et une interface USB. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre LCD display afficheur LCD LED display afficheur LED air pressure control commande de pression d'air Precision amp ampli de précision Pressure transducer transducteur de pression audio amp ampli audio MCU processor processeur MCU LCD ctrl commande LCD speaker haut-parleur I/O port LED driver port E/S Driver de LED I/O port keypad port E/S clavier I/O port air pressure control port E/S Commande de pression d'air ADC can data bus bus de données Power charger/management Chargeur/gestion d'alimentation USB controller wired data transmission Contrôleur USB - transmission de données filaire Flash/ROM Mémoire flash/ROM Présentation du modèle : Processeur MCU : commande du système, traitement des données. Mémoire flash : données et consignes d'enregistrement. Interface utilisateur : manipulation par l'utilisateur et affichage des résultats. Capteur : conversion de la pression en signal électronique Modèle AFE : amplification et numérisation du signal analogique Alimentation : électrique. NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Premier Farnell Global Technology Centre Suggestions de conception de dispositif médical électronique avec MCU, DSP, FPGA ou PLD Suggestions de dispositif médical électronique avec microcontrôleur (coeur ARM) 􀁺 Les capacités de traitement d'image améliorée par moteur HD avec contrôles de graphiques accélérés 2D répondent aux besoins de la plupart des produits avec des écrans larges ; 􀁺 Algorithmes matériels propriétaires et calculs logiques pour les différents produits ; 􀁺 Conception hautement intégrée pour assurer portabilité, fiabilité et économie ; 􀁺 Consommation d'énergie ultra-basse pour garantir la portabilité des appareils ; 􀁺 Les systèmes sur puce hautement intégrés à consommation ultra-basse sont les systèmes de choix pour les dispositifs médicaux implantables. Suggestions de dispositif médical électronique avec DSP 􀁺 Utilisation d'un DSP pour mettre en oeuvre des algorithmes complexes ; 􀁺 Utilisation d'un DSP pour mettre en oeuvre des performances d'imagerie 3D et 4D avec plus de précision et de clarté qu'en 2D. Suggestions de dispositif médical électronique avec FPGA/PLD 􀁺 Utilisation d'un FPGA quand les données d'un appareil médical doivent être fréquemment mises à jour ; 􀁺 Utilisation d'un FPGA haute performance avec plusieurs modules DSP, bus PCIe, mémoires DDR2 et DDR3 ; 􀁺 Utilisation d'un FPGA avec E/S multi-types et interface mémoire ; 􀁺 Développement avec les outils IP rapides intégrés ; 􀁺 Utilisation d'un FPGA avec une interface série haute vitesse, telle que LVDS. Références : www.ti.com www.eetchina.com www.ednchina.com www.analog.com www.altera.com www.xilinx.com NOUVEAU Le site Produits électroniques de Premier Farnell maintenant consultable en Chinois - Essayez dès AUJOURD'HUI !! http://www.farnell.com/ Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tel.: 04 74 68 99 99 Fax: 04 74 68 99 90 Semiconducteurs 12 TECHNOLOGY FIRST Récemment, ZigBee™ a été un sujet largement discuté. Le standard, ZigBee ou 802.15.4 peut être, un très bon choix dans de nombreuses applications de communication à faible puissance, faible taux de transfert. Cependant, est-il adapté pour toutes les applications? Bien sûr que non ! Il y a des situations où un réseau local sans fil (WLAN) 802.11 est meilleur, car son taux de transfert est plus élevé. De la même façon, il y a des applications qui nécessitent une plus grande portée ou une autonomie plus longue. En fait, l’architecture nécessaire permet de déterminer le type de réseau sans fil le plus adapté à une application. Cet article vous expose les différentes solutions disponibles pour réaliser des réseaux industriels sans fil. 8Ko «Réseaux propriétaires» BANDE ISM 315, 433, 915 GHz Ressources système (Ko de mémoire) Zigbee™ 2,4 GHz mondial 915 GHz NA 868 GHz Europe Bluetooth 2,4GHz Réseau local sans fil (WLAN) 2,4GHz, 5,4 GHz 32-7Ko 1000 _ 100 _ 10 _ 1 _ 250Ko 1MOctet Dans les réseaux sans fil, lorsque le taux de transfert augmente, les ressources système nécessaire augmentent également. Par exemple un réseau local sans fil avec un protocole 802.11, ne fonctionnerait pas avec la plupart des applications embarquées (comme les téléphones portables), à cause de la consommation et de la taille du code nécessaires pour réaliser ce type de réseau. Un réseau local sans fil 802.11 nécessite jusqu’à 1 Mo de mémoire programme pour réaliser un noeud et la consommation, de l’émetteur radio, ajoutée à celle du processeur système, le rend plus adapté aux applications informatiques ou aux réseaux industriels pour lesquels la puissance n’est pas un problème. De nombreuses tâches, comme le contrôle à distance de températures, de pressions et l’activation, tiennent compte de l’importance de la consommation et de la taille de code des réseaux sans fil 802.11. Les protocoles ZigBee sont relativement légers en ce qui concerne les tailles de code (32 à 70 Ko) et ont une portée comprise entre 10 et 100 mètres. Cela leur permet d’être un bonne alternative pour le réseautage industriel. Un de ces principaux avantages, est sa capacité de «maillage». Un réseau maillé permet le passage des messages d’un noeud à l’autre, de manière que, si un des noeuds échoue ou est coupé, le message peut tout de même atteindre sa destination par un autre noeud. Les réseaux maillés ZigBee ou les différents réseaux sans fil, adaptés à votre application par Vince Stueve FAE, Micrel, Inc. Figure 1. Ressources système nécessaires pour différents types de réseaux RF nécessitent un traitement sophistiqué des paquets et donc, plus de mémoire. La figure 1 montre la taille de code utilisé par différents réseaux sans fil. Certains réseaux propriétaires utilisent les bandes ISM (réservées aux utilisations industrielles, scientifiques, et médicales). Les applications de surveillance à distance de températures, de pressions et d’activation sont nettement mieux traitées sur ce type de réseaux. La portée des réseaux propriétaires à bande ISM est nettement plus importante que celle des réseaux réalisés avec les protocoles ZigBee, Bluetooth ou WLAN (réseau local sans fil). La figure 2 montre une comparaison des portées en fonction de la technologie utilisée. Participez au premier concours de conception électronique où vos idées deviennent réalité ... et gagnez un prix de 100.000$ US ! www.live-edge.com/fr RoHS Conforme Non-conforme Commandez du lundi au vendredi de 8h30 à 19h pour une livraison gratuite le lendemain Semiconducteurs 13 TECHNOLOGY FIRST La consommation d’énergie d’un réseau ZigBee ou d’un réseau propriétaire sur bande ISM est plus en ligne avec les besoins des applications de surveillance à distance des températures, des pressions et l’activation. Un noeud ZigBee doit pouvoir fonctionner environ un an avec deux piles AA, alors que les noeuds utilisant les protocoles propriétaires sur bande ISM peuvent facilement durer jusqu’à dix ans sur la même source d’alimentation. Une durée de vie plus longue, des piles, peut être un critère de choix important, pour le concepteur, qui doit adapter le choix de la solution à la situation. La fréquence des systèmes ZigBee 802.15.4 est 2,4 GHz. Elle est largement et mondialement utilisée, pour les techniques de DSSS (étalement de spectre à séquence directe, O-QPSK). Les émissions ZigBee sont également autorisées à 915 MHz DSSS aux États-Unis et à 868 MHz DSSS en Europe. Ces fréquences utilisent la modulation BPSK (Binary Phase Shift Keying) une modulation de phase à enveloppe du spectre. La plupart des solutions ZigBee utilisent actuellement la bande des 2,4 GHz, mais elle est devenue de plus en plus encombrée à cause de son utilisation mondiale, notamment pour les fours à micro-ondes. Les bandes ISM sont moins encombrées, et les fréquences de 915MHz, 868 MHz ou 433 MHz offrent une alternative aux réseaux sans fil 2,4 GHz. Jusqu’à 200 Ko ps «Réseaux propriétaires» BANDE ISM 315, 433, 915 GHz Portée (mètres) Zigbee™ 2,4 GHz mondial 915 GHz NA 868 GHz Europe Bluetooth 2,4GHz Réseau local sans fil (WLAN) 2,4GHz, 5,4 GHz 20-250 Ko ps 1000 _ 100 _ 10 _ 1-3 Mo ps 11-54 Mo ps La longueur d’onde d’antenne à 2.4GHz est plus courte que celles des fréquences inférieures ou égales à 915MHz. C’est la raison pour laquelle de nombreux routeurs WLAN nécessitent deux antennes (voir même 3 antennes pour les 802.11g à 5,6 GHz). Les réflexions et les trajets multiples provoquent des trous de polarisation sur les transmissions à 2,4 GHz. Les réseaux qui utilisent des fréquences plus basses comme le 915 MHz présentent moins de trajets multiples ou de trous de polarisation. De ce fait, ils fonctionnent très bien avec une seule antenne. De nombreuses applications qui fonctionnent sur des fréquences de 915 MHz ou inférieures, peuvent être réalisées avec une antenne PCB intégrée. Cette diminution de l’antenne permet de réduire considérablement le coût total du système. Ceci est une des raisons pour laquelle les réseaux qui fonctionnent hors de la bande des 2,4 GHz sont souvent choisis pour les réseaux industriels à faible coût et ou la portée est plus longue. Quelles sont donc les autres options disponibles avec les bandes ISM ? Pendant très longtemps, les ingénieurs ont créé des réseaux RF propriétaires en utilisant les modulations OOK (On/Off Key) une modulation en tout ou rien, ASK (Amplitude Shift Key) une modulation d’amplitude ou FSK (Frequency Shift Key) une modulation de fréquence. Très souvent, ces réseaux offrent des avantages que les ingénieurs ne peuvent pas se permettre d’omettre. Micrel propose, des émetteurs-récepteurs pour la bande de 310 MHz à 950 MHz Figure 2. Portée en fonction de la technologie pour différents type de réseaux Tous les prix de cette brochure sont en euros hors TVA www.farnell.fr Tel.: 04 74 68 99 99 Fax: 04 74 68 99 90 Semiconducteurs 14 TECHNOLOGY FIRST ƒ 25-50 Sauts Figure 3. Modulation par étalement du spectre à sauts de fréquence (FHSS) qui peuvent exécuter de nombreux RKE (télé déverrouillage) et des protocoles de réseau sans fil à deux voies sur la bande ISM. La principale difficulté d’un réseau sans fil est la pile de protocole utilisée par le microcontrôleur. Cette partie du développement est généralement celle qui pose le plus de problèmes. Pour le protocole 15.247, Micrel rend maintenant disponible un code source générique en C, conforme FCC pour la modulation à spectre étalé à saut de fréquence (FHSS) utilisable avec les émetteurs-récepteurs MICRF505 FSK. Ce logiciel est appelé MicrelNet™, il permet une modulation FHSS d’une largeur de bande de 250 KHz avec 25 sauts de fréquence. Le circuit MICRF505 dispose d’un amplificateur de puissance intégré (PA) permettant une transmission de -3 dBm à +10 dBm avec une antenne sans commutateur émetteur/récepteur externe. En utilisant l’amplificateur intégré, réglé à 10 dBm, la portée du MICRF505, peut facilement atteindre jusqu’à 300 mètres avec un taux de transfert allant jusqu’à 200 Kbps. La figure 3 montre différentes fréquences de porteuses utilisées dans les systèmes FHSS. Tous les noeuds sont synchronisés pour permettre un saut. S’il y a une mauvaise fréquence ou une fréquence utilisée, le système saute simplement sur la fréquence suivante. La pile de protocole gère le rassemblement des paquets qui sont envoyés entre les noeuds. MicrelNet dispose d’un programme d’adressage IP qui prend en charge le formatage de l’adresse de destination et de source, et rend facilement reconnaissable les paquets de données. Les contrôles par redondance cyclique logiciels assurent l’acheminement des données. Dans les réseaux industriels sans fil, l’application et l’environnement sont déterminant, pour choisir le type de réseau le plus adapté. Les choix de la fréquence, du protocole, et la consommation sont les éléments clés qui permettent de prendre la bonne décision. Des protocoles comme 802.11, ZigBee, et mêmes les systèmes propriétaires comme MicrelNet peuvent tous cohabiter. L’émergence de «contrôleurs de porte», comme le montre la figure 4, permettra à différents réseaux de communiquer sur le réseau le plus commun de tous. Note : MicrelNet est une marque déposée de Micrel, Inc. Toutes les autres maques déposées sont les propriétaires de leurs sociétés respectives. Contrôleur de passerelle 10/100 Copper Ethernet, RS232 ou tRS485 o el 0 e ZigBee™ 65 000 noeuds possibles LIAISON VIRTUELLE COORDINATEUR DE RÉSEAU NOEUD À FONCTION INTÉGRALE NOEUD À FONCTION RÉDUITE 802.11 WLAN 30 noeuds par routeur Bande ISM MicrelNet™ 65 000 noeuds possibles MAÎTRE CENTRAL MAÎTRE ESCLAVE Figure 4. Différents exemples de réseaux 19 www.rohs.fr Les derniers semiconducteurs discrets conformes RoHS Semiconducteurs discrets Commutateurs de charge très performants en petits signaux Transistors bipolaires à émetteur commuté Modules de puissance IGBT Diodes Schottky ThinQ!™ de 600V au SiC Modules de puissance intelligents Transistors pour applications Triacs Sanrex d’éclairage Drivers intelligents MOSFET MOSFET de puissance DirectFET™ IGBT NPT (Non-Punch Through) visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Transistors à valeur VCE(sat) ultrabasse et transistors numériques réunis dans des boîtiers miniatures SOT-666. Commutation 150kHz. Tension assignée 1700V, avec faibles pertes et RBSOA carrée (zone de fonctionnement sûre avec polarisation inverse). Tension assignée 1200V. Technologie Trench, pouvant supporter le courant d’avalanche. Tension assignée 600V - 1700V, faisant appel à une technologie évoluée de mise sous boîtier. Module original, effficace d’un point de vue thermique. Compatibilité SO-8. Caractéristiques de commutation presque parfaites, à base de carbure de silicum. Contrôleur autonome SMPS (alimentation à commutation) en mode courant avec CoolMOS™ intégré de 650V/800V. Pont inverseur IGBT 600V 10A triphasé, comprenant des circuits intégrés pour la commande de grille et la protection. Gamme de transistors de puissance bipolaires pour ballasts de lampes industrielles et domestiques. Gamme très variée, offrant la commutation standard et haute dans des modules de puissance couramment demandés. Increase System Reliability and Effi ciency www.fairchildsemi.com Industrial Applications Integrated solutions Fairchild Semiconductor offers the industry’s widest range of integrated motor drive solutions (50VA to 10kVA). Motion-SPM provides complete adjustable speed motor drive control and fully integrated circuit protection for AC motors in appliance applications. The PFC-SPM™ reduce component count and board space while increasing system reliability and effi ciency. The PFC-SPM™ provides 99% power factor (typical) to meet the mandatory PFC standard (IEC61000-3-2). Discrete solutions Fairchild Semiconductor offers a wide portfolio of discrete solutions. Gate Drivers: Fairchild’s high voltage gate drivers improve system reliability by using an innovative noise cancelling circuit that provides excellent noise immunity. IGBTs: Fairchild IGBTs are designed for high speed switching to improve power density, system effi ciency, and reliability compared to the MOSFET technology. SuperFETs™: N-channel SuperFET™ MOSFETs minimize conduction losses and increase switching performance by lowering RDS[ON] and gate charge (Qg). These devices are designed to operate reliably at higher frequencies. 21 www.rohs.fr Condensateurs Les derniers condensateurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection parmi les plus récentes technologies de condensateurs conformes RoHS proposées par Farnell InOne. Pour toutes informations complémentaires, veuillez consulter www.farnellinone.fr Condensateurs céramique multicouche série Série FM Série FCA & FKA Série T528 Kits de condensateurs AVX pour concepteurs Gamme élargie de condensateurs tantale et Oxicap™ Série VE Série VC32 Il s’agit de deux condensateurs connectés en série dans un seul composant, ce qui réduit le risque de court-circuit. Condensateurs électrolytiques en aluminium à faible impédance et excellente endurance, livrés dans un boîtier qui est environ 30% plus petit que celui de la série FC. Les condensateurs de ces nouvelles séries se basent sur les séries FC et FK, et ils sont réalisés spécialement pour supporter les conditions sévères de brasage par refusion. Condensateurs tantales organiques montés en surface, cathodes en polymères, présentant une faible inductance et un bon comportement en hautes fréquences. Gamme de 12 kits offrant un choix maximum d’échantillons en nombre suffisant pour servir la conception et le développement. Pour ajouter aux kits de condensateurs pour concepteurs, cinq gammes courantes élargies plus cinq nouvelles séries. Varistances radiales en métal-oxyde pour applications de protection contre les surtensions. Varistances monocouche à montage en surface, offrant des tensions assignées et des énergies transitoires plus élevées que les varistances typiques multicouches. Pour le RoHS ne vous risquez pas ailleurs Condensateurs 22 Les derniers condensateurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Séries W2H et W3H Séries W2F4 et W3F4 Série MLCC Hi-Cap Condensateurs céramiques multicouches à connexions flexibles Condensateurs Oxicap™ Série T510 Série A700 Série BXA Série ZLH Série NP Condensateurs céramiques miniatures fort courant, réunissant des condensateurs et inductances dans un seul circuit de filtre à régime permanent. Condensateurs céramiques multicouches de forte capacité dans des boîtiers compacts. Les condensateurs de cette série sont également livrables sur bobines. Condensateurs électrolytiques, dont la céramique est faite d’oxyde de niobium. En cas de défaillance sous une tension inférieure ou égale à la tension assignée, le condensateur OxiCap™ ne prend pas feu. Ensembles de condensateurs de fuite contenant quatre éléments et une connexion de mise à la masse commune, donnant une faible inductance parallèle et une excellente capacité de découplage. Les connexions flexibles garantissent une flexion minimum de 5mm sans aucune fissuration. Ces condensateurs conviennent idéalement pour les circuits-imprimés soumis à des flexions importantes. Condensateurs tantales multianodes d’une résistance série équivalente très faible, donnant un courant d’ondulation allant jusqu’à 4 ampères. Condensateurs en aluminium polymères offrant une plus grande rétention de capacité, et donc plus performants aux hautes fréquences. Conception assurant une bonne protection contre la fissuration. Condensateurs électrolytiques miniatures haute température en aluminium, à très longue durée de vie et courant d’ondulation très élevé. Série améliorée de condensateurs électrolytiques miniatures en aluminium, très fiables et à longue durée de vie, présentant une faible impédance aux hautes fréquences. Condensateurs électrolytiques aluminium, non polarisés, de type radial, présentant d’excellentes caractéristiques de fréquences, et utilisable dans les réseaux de transition. 23 www.rohs.fr Les dernières résistances RoHS Résistances visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Série WP-S Résistances de puissance bobinées et compactes résistant à la flamme, excellente tenue aux impulsions. Disponibles en versions 2W ou 4W. Deux résistances parallèles dans un seul boîtier, excellente tenue en impulsions. Série DSC Série WSL Résistances métalliques de puissance avec une grande capacité résistive aux surtensions, excellente stabilité sur une large plage de conditions environnementales. visitez www.rohs.fr visitez www.rohs.fr Résistances à couches épaisses, haute puissance, à résistance thermique extrêmement basse, livrées dans un boîtier mince pour l’installation haute densité sur circuits-imprimés. Série MHP140 Sélection parmi des milliers de nouvelles résistances conformes RoHS en provenance des plus grands fabricants. Pour toutes informations complémentaires, veuillez consulter www.farnellinone.fr Série CB10 Série CT6 Série CP16 Série Modèle 18 Potentiomètres d’ajustement en carbone, avec flèche indicatrice de position. Livrés avec axe de réglage. Potentiomètres de réglage contenant un élément moulé en résine dans un boîtier miniature. A l’abri de la poussière et du flux et stable en présence d’une forte humidité. Potentiomètres en plastique avec axe de réglage, haute résistance d’isolement et capables de supporter des tensions élevées. Différentes tailles disponibles, grande fiabilité. Diamètre 22,2mm, cadrans 15 tours et “frein à encliquetage” puissant. Pour le RoHS ne vous risquez pas ailleurs 24 Les dernières résistances RoHS Résistances visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Série SMHP Série FC Série YR1 Série RWM 6 x 22 Série BSC8 Série LVR Série B57540 Série B59601 Série 3204 Séries PRC201 et PRC221 Résistances non inductives, haute puissance, à résistance thermique extrêmement basse. Montage sur circuits-imprimés par soudure ou par clip. Résistances de précision à faible résistance interne, qui fonctionnent presque comme des résistances pures dans une bande de fréquences très large. Résistances à couches métalliques, très faible bruit et faible coefficient de tension, et excellente stabilité en présence de charges et de conditions environnementales sévères. Résistances de puissance émaillées à bobinage axial, forte dissipation et grande fiabilité. Disponibles en faible valeurs ohmiques. Résistances de détection de courant, excellente tenue en présence d’impulsions et de surtensions, livrées dans un boîtier bas profil pour montage en surface. Résistances de puissance de précision à bobinage axial offrant des valeurs de résistance extrêmement faibles et une excellente stabilité en présence de charges. Thermistances haute stabilité à coefficient de température négatif, encapsulées dans du verre avec fils “dumet”, conçues pour les hautes températures et des temps de réponse très rapide. Thermistances compactes à coefficient de température positif, conçues pour fournir une réponse rapide et fiable. Conviennent pour le brasage par refusion. Potentiomètres de réglage Cermet CMS compacts monotour, dont la disposition des bornes empêche le chevauchement des soudures. Résistances CMS, dissipation thermique de 1 watt. Les résistances de la série PRC221 sont également livrables en bobines. visitez www.rohs.fr 25 www.rohs.fr Les derniers composants optoélectroniques conformes RoHS Optoélectronique visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection de Leds mono ou multicouleurs pour l’affi chage ou la détection. Densité de flux lumineux élevée, émettant vers le haut ou le côté. Choix de couleurs. Types: BA9S, BA15D, BA15S, GX53 et S6S. Livrée sur bobines de 4,5m. 6 LED indicatrices de tension, choix de couleurs: rouge, blanc et bleu. Solution souple et modulaire pour l’éclairage. Génération la plus récente, intensité lumineuse parmi la plus élevées du marché. Intensités de flux les plus élevées dans cette catégorie, encombrement réduit. visitez www.rohs.fr visitez www.rohs.fr Système LinkLED™ LED de puissance Atlas 8,6W Source lumineuse LED - RVB (rouge, vert, bleu) Bande lumineuse flexible Ampoule de remplacement à LED Bande de LED Bande de LED de puissance, 8W LED de puissance K2 visitez www.rohs.fr visitez www.rohs.fr www.avagotech.com/LED For more information please visit our website Technical Specifications © 2006 Avago Technologies, Ltd. All rights reserved. LED Lighting Solutions Technology Features • IR-reflow solderable, compatible with standard SMT assembly process • Robust moisture sensitivity level (MLS) 2a, for flexible assembly at customers’ site • Low thermal resistance, for reliable long operating life • High current operation • Wide viewing angle • Silicon encapsulation • Available in white, blue and green color Key Applications • Portable Lighting– flash light, bicycle head light, miner’s head lamp • Focused Lighting– reading light, spot light, accent light • General Lighting– decorative, architectural & garden • Back Lighting– signs and billboards From lighting your way through the darkness to high performance lighting for your outdoor signage, Avago Technologies has a high power LED lighting solution for you. Avago’s high brightness, high performance, energy efficient LEDs can handle high thermal and high driving current. A smooth radiation pattern offers a 120º viewing angle and the low profile package design is ideal for a wide range of applications especially where height is a constraint. The ASMT-Mx00 is the first of Avago’s 1W high Power LED products with moisture sensitivity level (MSL) 2a and can be driven at 350mA. It is one of the thinnest packages available and has superior heat dissipation. It is compatible with IR soldering, and is encapsulated in a heat and UV resistant silicon compound. High brightness LED lighting solutions from Avago Technologies give you reliable, high performance illumination, flexibility of design and robust, easy to handle packaging Light up the night These products are available from Farnell InOne: www.farnellinone.com 27 www.rohs.fr Optoélectronique Les derniers composants optoélectroniques conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Montées dans un module TO-220 facilitant la dissipation thermique. LED de puissance, 350mW et 700mW LED de puissance ‘Lednium’ 10W LED de puissance Platinum Dragon LED de puissance Ostar Modules LCD d’interface série I2C Afficheurs OLED Afficheurs industriels LCD Capteur de couleurs RVB dans un boîtier QFN Capteurs de distance Convertisseur lumière-signal numérique Génération la plus récente de LED de 4,6W dans des modules à profil réduit montés en surface. Module tridimensionnel révolutionnaire donnant un angle de visualisation de 120°. Luminosité et luminance exceptionnelles dans un module en forme d’étoile thermiquement efficace. Dimensions très demandées, avec interfaçage simplifié et souple. Affichages clair, brillant et efficaces sur une large gamme de couleurs. Capacité vidéo intégrale. 6.5” à 12.1” - VGA, SVGA et XGA. Convertit la lumière pour la séparer en tensions de sortie RVB. Choix très varié, avec mesures précises entre 4,5 mm et 800 mm. Se rapproche du comportement de l’oeil humain. Option I2C offerte. Pour le RoHS ne vous risquez pas ailleurs 28 Optoélectronique Les derniers composants optoélectroniques conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Ecran couleur à matrice active, de 3.6” à 10.4” Kits de démarrage pour écrans couleurs à matrice active Sharp Module LCD interfaçable facilement Modules émetteurs/récepteurs à fibres optiques LC Kits d’évaluation des lentilles pour LED LED CMS Emetteurs et récepteurs numériques audio à fibres optiques Guides de lumière flexibles ou rigides Le plus petit multiplexeur/ démultiplexeur au monde Emetteurs infrarouges rapides à montage en surface Série ‘Strong’: brillance et facteur de contraste élevés. Livré avec contrôleur RVB, panneau d’affichage sur écran et câbles de raccordement nécessaires. Ecran couleur à matrice active 320 x 234 de 32K, avec bus d’interface 8051. Conformes aux normes de l’industrie, faible facteur de forme. Conçus pour les LEDde puissance Osram Golden Dragon et Luxeon K2. Choix très varié de couleurs et de designs, y compris le blanc. Conforme à la norme JEITA CP-1212. Livrés en tronçons de 1m et 3m de long, avec systèmes optiques correspondants. 4 et 8 voies. Haute intensité 35mW dans un très petit boîtier . To explore the possibilities or receive free samples please contact us at +49 6322 95670 or visit us online at www.cml-it.com Europe - Robert-Bunsen-Str.1, 67098, Bad Durkheim, Germany America - 147 Central Avenue, Hackensack, NJ07601 Asia - 61 Aida Street, Singapore 459975 Un-leading by example! European product range from CML Innovative Technologies now fully RoHS compliant CML Innovative Technologies (CML-IT) is producing its wide European range of miniature lighting products according to the RoHS directive from the European Commission. All devices are manufactured featuring the same product specifications as before but now comply with the RoHS' significant limitations on the use of lead, mercury, cadmium and hexavalent chromium. All lamps and bulbs in CML-IT's European product range are manufactured using lead-free glass and RoHS-compliant chips for the company's range of LEDs and Power LEDs More Innovative Technology from CML-IT! Engineering Know-How from CML-IT 30 Pour le RoHS ne vous risquez pas ailleurs Connecteur Les dernières gammes de connecteurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Vous trouverez ci-dessous une sélection de nouveaux connecteurs originaux issus des plus grands fabricants Connecteurs autodénudants 0,27 mm Série UTS de connecteurs circulaires étanches Série Harax M12 Ecomate SCE & PPS Série Datamate à montage en surface et vis d’accouplement MicroClasp Mini USB Bucanneer • Système d’accouplement triphasé robuste • Interface autodénudante très performante du type bosselé • Capot-verrou métallique et serrecâble en option assurant la fiabilité à long terme • Connecteurs circulaires en plastique IP68/IP69K • Système de blocage rapide et sûr, sertissage et installation rapides • Etanchéité extrême à l’eau • Comportant le système de raccordement rapide HARAX • Pour les applications utilisant auparavant du câble préassemblé • Connecteur ergonomique et résistant à la poussière • Convient pour usage dans des environnements hostiles • Utilisable avec câbles de 6 à 12,5 mm de diamètre • Connecteurs miniatures PPS (du type push-pull) et SCE (à désaccouplement) et assemblages de câbles • Robustes avec excellente étanchéité (IP65 à IP68) • Nouveaux connecteurs J-Tek (vis d’accouplement) venant s’ajouter à la gamme Datamate très fiable de Harwin • Livrés en double rangée, de 6 à 50 voies • Nouveau connecteur MicroClasp™ au pas de 2,00 mm • Système fils/cartes à simple et double rangée conçu par Molex • Conception unique pour le marché des connecteurs • Nouveau Mini USB Buccaneer - résistant à la poussière conformément à IP68 après accouplement • Câbles livrés en tronçons longueurs de 2, 3 et 4,5m Farnell InOne exclusif 31 www.rohs.fr Connecteurs Les dernières gammes de connecteurs conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Connecteurs Sub D avec filtres Connecteurs Sub D double empilage I Pass Série ZDC, SMA, SMC Accessoires modulaires HAN Connecteurs pour câbles plats souples Mate N Lock Type RJ48 Fiches et douilles de test 1mm Champ RJ • Mini-connecteurs Harting bas profil et autodénudants pour circuits imprimés • Hauteur après montage inférieure à 5,5 mm • Connecteurs Sub D à montage sur carte, et empilables • Réduisent l’espace total occupé sur le circuit-imprimé par les connecteurs individuels • Totalement interconnectables avec les autres connecteurs Sub D • Ensembles connecteurs et câbles offrant une plus grande densité et des vitesses plus élevées • Solution idéale pour l’interconnexion dans le marché des serveurs en pleine croissance • Solutions rentables pour applications commerciales • Composants moulés de précision avec diélectriques thermoplastiques • La série comprend à présent les connecteurs SMA et SMC • Gamme plus étendue d’accessoires modulaires HAN • Comprenant USB (bus série universel), Firewire, D Sub et DDD • Les nouveaux accessoires comprennent des serre-câble métalliques et en plastique Tyco Electronics présente sa gamme de connecteurs pour câbles plats souples (FFC). Tailles 0,5mm à 1,25mm, 4 à 30 voies. Montage en surface et options ZIF prévues. • Farnell InOne ajoute à sa gamme de connecteurs Mate N Lock • Utiles pour les connexions internes des équipements, fils à fils, et fils à cartes • Nouvelle gamme RJ48 10 voies proposée par Farnell InOne • Fiche sans blindage et fiche à angle droit sans blindage • Fiches et douilles de test 1mm pour le raccordement fiable dans les espaces très restreints • Livrés en un choix de couleurs • Permet de transformer les groupes de cordons standard RJ45 ou USB pour usage dans les applications industrielles • Etanchéité assurée en une minute - sans aucun outillage 32 Pour le RoHS ne vous risquez pas ailleurs Les dernières gammes d’accessoires conformes RoHS Accessoires visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection dans notre gamme courante de vêtements/ équipements de protection antistatique et d’accessoires pour semi-conducteurs Connecteurs d’extension mémoire DIMM Matériau conducteur thermique Sil-Pad SP900S Ruban auto-adhésif à conductivité thermique Bond-Ply 100 Matériau conducteur thermique Gap-Pad™ Ensembles de dissipateurs thermiques avec ventilation forcé en option Ensembles de bracelets économiques Bracelet ajustable économique Cordons de mise à la terre économique Comportant SDRAM, DRAM DDR, DDR1 et DDR2. Grosseur moyenne, haute conformité et faible impédance thermique. Ruban adhésif très performant, à conductivité thermique, et à forte adhérence. Elément de conduction thermique, placé entre les dissipateurs thermiques et les circuits électroniques. Dissipateurs thermiques à utiliser avec les modules d’alimentation isolés Semikron: Semipack, Semitrans et redresseurs en pont Semipoint. Bracelet ajustable et cordon spiralé de mise à la terre de 3m. Non allergénique - pas de fibres en acier inoxydable, choix de boutons 4mm ou 10mm. Cordons jaunes à haute visibilité, longueur déployée 3m. 33 www.rohs.fr Les dernières gammes d’accessoires conformes RoHS Accessoires visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Talons de mise à la terre économique Kit d’entretien sur le terrain Ioniseur de table Vestes et blouses de protection antistatiques Tablier de mise à la terre (ESD) Caisses antistatiques pour pièces détachées Couvre-chaussure jetable antistatique Appareil de contrôle continu des bracelets de mise à la terre Boîte à outils antistatique Sonde à anneaux concentriques Talons durables double couche en PVC/caoutchouc nitrile à dissipation/ conduction. Kit d’entretien sur le terrain offrant une protection optimale contre l’électricité statique. Ioniseur compact et léger à autoéquilibrage, courant continu. Montage sur banc ou mural. Vêtements antistatiques fabriqués avec du tissu haute qualité. Protège les vêtements des salissures et des taches dans la zone de protection électrostatique. Caisses empilables fabriquées en polypropylène E9 à propriétés antistatiques permanentes. Modèle élégant et confortable, revêtement en polyuréthane, résistant aux produits chimiques avec sole non glissante. Signale toute interruption accidentelle de la boucle de mise à la terre dans une zone de protection électrostatique. Boîte à outils robuste, résistant aux chocs, fabriquée en E9 durAstatic. Mesure la résistivité de surface des matériaux. 34 Pour le RoHS ne vous risquez pas ailleurs Câbles Les dernières gammes de câbles conformes RoHS visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr Sélection de produits dans notre gamme de câbles et accessoires conformes RoHS pour des applications très variées. Pour toutes informations complémentaires, veuillez consulter www.farnellinone.fr Fils UL pour la connexion des équipements XTRA-GUARD® 1 - Câble de transmission de données Câble Belden Câble coaxial Presse-étoupes SKINTOP® et SKINDICHT® Marqueurs Helagrip en chevrons Attaches et montures de câble Panduit Gaines thermorétractables Fil de connexion UL1007, 1015, 1061 & 1213, à isolant en PVC et TFE. Conducteurs torsadés en cuivre étamé. Applications possibles: périphériques connectés aux ordinateurs, équipements commerciaux, électroniques médicaux et autres environnements de haute technologie. Gamme variée de câbles à paires torsadées offrant un large choix de longueurs, d’applications et de nombres de paires. Gamme de câbles coaxiaux proposée par Nexans - Possibilité de coupe au mètre. Gamme de presse-étoupes, contreécrous et bouchons en nylon, polyamide et laiton nickelé. Gamme de marqueurs de câble en PVC. Gamme Panduit d’attaches et de montures et plaques de fixation de câble adhésives/vissées. Tubes souples en polyoléfine livrés en longueurs de 1,2 m et aussi sur bobines. Choix varié de couleurs et de tailles. Et si vous pouviez devenir quelqu’un d’autre? NXP– La nouvelle compagnie née de Philips Semiconducteurs Avec toute l’énergie d’un nouveau commencement, alimenté par 50 années de sagesse, NXP Semiconducteurs est prêt à répondre à toutes vos questions, et tout spécialement aux questions impossibles. Celles qui ne sont encore que des rêves, mais qui se transformeront rapidement en expériences sensorielles étonnantes. Conduit par l’ouverture d’esprit et la curiosité d’un nouveau-né, NXP est déjà à l’avant-garde d’un univers vibrant des technologies multimédias. Cette position de leader se reflète dans les milliards de dollars investis dans les projets de recherche, le dépôt de plus de 25 000 brevets, ainsi que dans le nombre de solutions innovantes dans les secteurs de l’identification, de l’automobile, de la mobilité et de l’électronique domestique. Découvrez comment vos idées d’avant-garde peuvent être vues, entendues et ressenties d’une manière totalement nouvelle sur www.what-if-you-could.com, parce que la question à partir de maintenant est la suivante: qu’aimeriezvous mettre en question? Et si vous pouviez Pour le RoHS ne vous risquez pas ailleurs 36 Pro-Power La dernière gamme Pro-Power conforme RoHS Gaines thermorétractable 2:1 Fils d’équipements Fil pour appareillage de commutation conforme TRI Câble résistant à la chaleur de 1/0,80mm Fil de connexion Câble coaxial RG58BU/CU Gaines thermorétractable 3:1 à revêtement adhésif Gaine thermorétractable 4:1 en PTFE Gaine isolante Gaine en PTFE Tube thermorétractable 2:1 ignifuge, livré en longueurs différentes. Fils d’équipements de 1/0,60mm à isolant en PVC. Entre autres applications: câblage des tableaux de commutation et de commande, et câblage interne général. Câbles à âme unique servant normalement au câblage d’éclairage fluorescent. Fil de connexion homologué UL et certifié CSA. Câbles coaxiaux à isolant en polyéthylène solide. Tube thermorétractable de rapport 3:1 à revêtement adhésif noir. Gaine thermorétractable haute température en PTFE translucide naturel. Gaine isolante en PVC souple sans plomb, livrée en bobines de 100m. Excellentes propriétés d’isolement, convient idéalement pour les applications haute température. visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr visitez www.rohs.fr A selection of quality products from Pro-Power - platine à adaptateur multiple doté de six éléments semi-conducteurs micro-miniature - fibre de verre époxyde FR4 1,50 mm, simple face 35 μm CU - côté des composants chimiques nickel/or, cache d'arrêt de brasage et impression d'équipement - le placement de vingt différents types de semi-conducteurs énoncés dans le tableau est possible sur la platine - baguette à 8 broches pas 2,54 mm, diamètre de perçage 1,00 mm - point rainuré destiné à la rupture de séparation des modules - données de Gerber pour la fabrication de la cache d'arrêt de brasage et de l'impression de la pâte à braser sont gratuitement mises à disposition sur simple demande - dimensions 22,86 mm x 46,72 mm Layout Pad Size Pad Pitch Taille Configuration Occupation TO252 * * * * TO252 SOT223 * * * * SOT223 SOT89 * * * * SOT89A SOT23 0,71 x 1,0 mm 0,95 mm 2,4 mm 2 Reihen x 3 SC59, SC74 SC74A,SMT3, SMT5, SMT6, SOT23, SOT23-5, SOT23-6 SOT23-8 0,46 x 1,1 mm 0,65 mm 2,4 mm 2 Reihen x 4 SC70, SC88A, SOT23-8, UMT3, UMT5, UMT6 SC75 * * * * EMT3, SC75 SOT 23 Multiadaptateur-CMS RE901 26 Réaliser un circuit de protection fiable La technologie HDMI comble cet écart en utilisant des débits de transmission très élevés, jusqu’à 10Gbit/s (norme HDMI 1.3). En raison de leur microélectronique complexe, les téléviseurs à écran plat sont extrêmement sensibles aux surtensions transitoires, telles que les ESD (surtensions électrostatiques). La protection ESD de l’interface HDMI présente un défi particulier pour les fabricants d’équipements électroniques grand public. Il y a de très fortes chances qu’une impulsion ESD atteigne l’appareil si des câbles périphériques sont touchés ou si des connecteurs sont débranchés. L’impulsion circule alors du terminal vers la carte, détruisant potentiellement la carte ou ses composants. Les diodes à semiconducteurs conventionnelles ne sont pas bien adaptées à la protection ESD dans les téléviseurs à écran plat car leurs propriétés protectrices commencent à s’altérer à partir de 25°C (réduction des caractéristiques de fonctionnement). À l’opposé, la CeraDiode, développée par EPCOS, est immunisée contre les températures élevées souvent rencontrées dans les téléviseurs LCD et plasma. Ses propriétés protectrices restent stables jusqu’à une température de fonctionnement de 85°C. La CeraDiode est fabriquée à base d’oxydes de céramique selon une technologie multicouche. Ces composants suppriment efficacement les tensions transitoires. Ses couches sont composées de nombreux grains d’oxyde de zinc, formant une micro- CeraDiode, comparable à une diode Zener. Grâce au grand nombre de micro-CeraDiodes individuelles, la puissance globale ESD d’une CeraDiode est supérieure à celle d’une diode de suppression, qui ne présente qu’une simple jonction PN. Les CeraDiodes offrent une résistance très stable, insensible aux variations de température et aux tensions de polarisation continues. Cela signifie que la résistance elle-même peut servir de filtre pour les composants haute fréquence, remplaçant ainsi plusieurs composants externes qui auraient été nécessaires pour la protection ESD et la fonction de filtrage. En raison de leur structure interne et d’un boîtier plus petit, les CeraDiodes ont des inductances parasites très faibles, par conséquent, les temps de réponse sont inférieur à 0,5ns et garantissent une protection ESD fiable. Les diodes de suppression ont des temps de réponse de 0,8ns ou plus en raison d’un format plus grand et d’une inductance parasite supérieure. Les CeraDiodes ne sont pas seulement une alternative rentable par rapport aux composants de protection ESD à base de semiconducteurs – comme les diodes Zener ou TVS – Elles offrent également des avantages techniques. Elles remplacent dans de nombreux cas une diode à semiconducteur sans modifications. Les CeraDiodes étant des composants bidirectionnels, il n’y a aucun risque de mauvais positionnement au cours du processus de placement automatique. Avoir une norme de connexion numérique à haut débit pour la transmission audio et vidéo de qualité optimale n’a jamais été un besoin aussi pressant qu’aujourd’hui. L’utilisation très répandue des écrans plats et l’avènement de la télévision haute définition (jusqu’à 1920 x 1080 pixels) ont créé un réel décalage dans le domaine de la connexion. 0 Time [ns] 1.8 875 -875 Voltage [mV] Source Eye Diagram 17 Les tendances du marché incitent à réduire la consommation d’énergie tout en continuant à satisfaire aux demandes de performances et de fonctionnalités accrues. Plusieurs domaines sont concernés par l’optimisation, comme la technologie des semiconducteurs, les techniques de conception, les architectures système, les configurations de plate-forme et les méthodes de conception. Cette optimisation s’étend également au logiciel système, un composant intégral des produits à base de semiconducteurs. La consommation électrique dans les circuits intégrés CMOS est en général classée en puissance dynamique dans un circuit de commande, comme la puissance commutée et la puissance statique ; la déperdition d’électricité qui est mesurée à chaque fois qu’un circuit est mis sous tension en est un exemple. Traditionnellement, la puissance statique consomme moins d’énergie que la puissance dynamique. Cependant, du fait que les configurations CMOS continuent à se réduire, la puissance statique commence à représenter une portion plus importante de l’énergie totale utilisée. Par conséquent, les technologies d’économie d’énergie doivent s’attaquer aux deux formes de consommation électrique. Exemple d’application : Microcontrôleurs QE128 Le ColdFire V1 MCF51QE128 (32 bits) fait partie de la série de microcontrôleur Flexis. La série Flexis fait preuve d’une efficacité énergétique optimale, prolongeant la durée de vie des batteries dans les applications portables grâce à des modes de veille prolongée « Deep-Sleep ». Chaque appareil dispose de plusieurs modes d’arrêt, en plus des nouveaux modes d’attente et de fonctionnement en basse puissance, chacun d’eux économisant encore plus l’énergie consommée. Les modes d’attente et de fonctionnement en basse puissance permettent à l’appareil d’opérer en mode basse puissance avec tous les périphériques activés. En outre, un oscillateur externe 32KHz ultra-basse puissance consomme moins de 1uA et peut être utilisé dans toutes ces configurations. Normalement, en mode exécution un circuit intégré doit fonctionner à une fréquence d’au moins 1MHz. Les passages répétés entre le mode veille et le mode réveil pour contrôler les besoins et les événements système peuvent augmenter considérablement la consommation d’énergie (les arborescences peuvent consommer jusqu’à 40% de la puissance active du circuit). Les MCU QE128, par contre, utilisent un oscillateur 32kHz avec un courant d’alimentation très faible, évitant ainsi les pointes de courant qui se produisent normalement lors de chaque changement de mode. Les MCU QE128 sont fabriqués à l’aide d’une technique LVLP (basse tension – basse puissance), utilisant des transistors avec une longueur de canal plus grande pour réduire le courant de fuite qui, à terme, diminue la consommation de puissance statique. La bibliothèque de cellules standard a aussi été considérablement optimisée et comprend des éléments basse puissance. Ces appareils sont également dotés d’un registre périphérique ‘clock gating’ pour désactiver les modules non utilisés, ainsi que l’oscillateur externe 32kHz qui fournit une source d’horloge précise au compteur temps réel. Collaborer pour un rendement énergétique rentable Enfin, l’efficacité énergétique est mesurée par rapport aux besoins du client. Que l’application nécessite une longévité batterie accrue ou une diminution de la dissipation thermique, les concepteurs se basent sur les semiconducteurs qui répondent à leurs exigences de performance sans dépasser le budget énergie fixé. Freescale travaille en étroite collaboration avec ses clients pour définir clairement les paramètres de performance énergétique requis. Cette étroite collaboration contribue à optimiser des solutions en vue de développer facilement des applications économiques d’énergie, accélérer la commercialisation et rendre le produit fini plus attrayant pour les clients. L’efficacité énergétique pour un rendement optimum Les fabricants de produits électroniques disent que l’objectif de performance pure n’est plus leur préoccupation première. Il s’agit désormais de réduire la facture énergétique au maximum, en raison de l’augmentation des coûts et des responsabilités environnementales. Produits Luxeon, SuperFlux et SnapLED G U I D E D E S P R O D U I T S 2 Qu’est-ce que Luxeon ? Les diodes Luxeon sont les diodes électroluminescentes qui ont le flux lumineux le plus élevé au monde, pour fournir les solutions d’éclairage à semiconducteurs les plus lumineuses. La couleur blanche Luxeon produit plus de 20 lumens par Watt ; les diodes Luxeon sont 10 à 20 fois plus lumineuses que les DEL standard, ce qui permet d’obtenir des densités lumineuses de 5 à 20 fois supérieures. Luxeon est une source lumineuse optimale. Dure plus longtemps que toute autre source lumineuse — plus de 10 ans Luxeon a recours à des technologies de semi-conducteurs utilisées dans la Silicon Valley et similaires à celles des derniers microprocesseurs. A la différence des sources lumineuses classiques, les DEL ne tombent pas en panne d’un seul coup, dans le sens où elles ne brûlent pas et ne cessent de fonctionner sans prévenir. Dans de nombreuses applications, les solutions Luxeon fonctionnent pendant plus de 10 ans. Frais de maintenance réduits Du fait que les produits Luxeon durent au moins 10 fois plus longtemps qu’une source lumineuse classique, il n’est pas nécessaire de remplacer la source lumineuse, ce qui réduit, et même élimine, les frais de maintenance récurrents et de remplacement de l’éclairage. Meilleur rendement énergétique Adoptez la solution écologique. Luxeon, avec un meilleur rendement que les sources halogènes et incandescentes, se rapproche rapidement du rendement des solutions fluorescentes. Couleurs vives saturées — sans filtre Luxeon ne nécessite aucun filtre pour générer une lumière colorée, ce qui a pour effet des couleurs saturées plus profondes sans perte de lumière. La profondeur des rouges, verts et bleus est générée directement par cette source lumineuse à semi-conducteur. Eclairage dirigé pour améliorer le rendement lumineux Les sources lumineuses Luxeon sont de petits points de lumière directionnels. Leur taille et la commande de leur direction en font des systèmes optiques très contrôlables, sans gaspillage de lumière. Eclairage à semi-conducteurs fiable Les sources lumineuses Luxeon sont des appareils à semi-conducteurs. Elles ne comportent pas de pièces mobiles, aucun élément susceptible de rompre, de se briser, de fuir ou de contaminer l’environnement. Contrôle dynamique des couleurs, réglable sur le blanc Les couleurs vives et saturées de Luxeon permettent d’obtenir une large gamme d’effets d’éclairage statiques et dynamiques. Du blanc réglable à une seule lumière capable de générer numériquement n’importe quelle couleur de l’arc-en-ciel, Luxeon ouvre de nouvelles dimensions au monde de l’éclairage. Totalement réglable — sans variation de couleur Les sources lumineuses Luxeon sont totalement réglables — plus de 1000 fois — sans compromettre les caractéristiques de la lumière. Pas de mercure dans la source A la différence de la plupart des sources fluorescentes, Luxeon ne contient pas de mercure. Absence de chaleur ou d’UV dans le rayon lumineux Pas de rayons ultraviolets ou infrarouges nuisibles dans le rayon lumineux Luxeon. Démarrage à froid Luxeon n’a aucun problème de démarrage aux basses températures — jusqu’à -400 C. Fonctionnement basse tension CC Luxeon est un appareil à semi-conducteur commandé par le courant, qui fonctionne sous des tensions aussi faibles que 3,5 VCC. Caractéristiques Luxeon 3 Conservation supérieure de l’intensité lumineuse — par conception Les sources lumineuses Luxeon ne contiennent pas d’époxy. L’époxy se dégrade dans le temps, ce qui entraîne une médiocre conservation de l’intensité lumineuse. La technologie Luxeon apporte une conservation supérieure de l’intensité lumineuse par rapport à d’autres sources semi-conductrices et aux éclairages classiques. Meilleur rendement — par conception La lumière émise par un produit Luxeon est directionnelle. Les sources lumineuses classiques (incandescentes, halogènes, fluorescentes) sont omnidirectionnelles : la lumière est émise dans toutes les directions. Pour éclairer un objet, la lumière qui n’est pas dirigée vers l’endroit voulu doit être redirigée au moyen d’optiques secondaires. Chaque fois qu’un rayon lumineux est reflété, il perd de son intensité. Les pertes typiques sont de l’ordre de 40 à 60 % : cela signifie que dans certains cas, la moitié de la lumière générée par la source est dirigée vers l’endroit voulu. La nature dirigée de la lumière Luxeon fournit des rendements de 80 à 90%. L’intensité lumineuse totale nécessaire est donc inférieure pour obtenir la même luminosité. Par exemple, la source Luxeon Star/O génère un rayon étroit de 2x5 degrés avec un rendement optique égal à 85 %. Lorsque vous envisagez d’utiliser un produit Luxeon comme source lumineuse, il est important de prendre en compte tous les facteurs, y compris le modèle de rayonnement le plus adapté à votre application. Il existe différents modèles de rayonnement pour de nombreux produits Luxeon. Le choix et la conception du modèle de rayonnement améliore notablement le rendement de votre système d’éclairage. 0 20 40 60 80 100 120 4000 8000 12000 20000 temps (heures) puissance lumineuse relative % DEL blanche 5 mm incandescence typique luxeon forte puissance déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % aile de chauve-souris modèle de rayonnement (sans optique) -100 0 100 20 60 100 Supériorité de la conception lambert modèle de rayonnement (sans optique) -100 20 60 100 0 100 déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % émission latérale modèle de rayonnement (sans optique) 20 60 100 -120 0 120 déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % 0 - 40 20 60 100 40 modèle de rayonnement optique de réglage déplacement angulaire (degrés) i n t e n s i t é r e l a t i v e % 4 Diode Luxeon Emitter Description La puissance Luxeon sous sa forme la plus basique. Concevez et construisez votre source lumineuse Luxeon selon vos spécifications. Diodes standard Luxeon disponibles en blanc chaud, blanc, vert, cyan, bleu, bleu roi, rouge, rouge/orange et ambre. LXHL-BW02 Blanc 5500 K 25 LXHL-BW03 Blanc chaud 3300 K 20 LXHL-BM01 Vert 530 nm 30 LXHL-BE01 Cyan 505 nm 30 LXHL-BB01 Bleu 470 nm 10 LXHL-BR02 Bleu roi 455 nm 150 mW LXHL-BD01 Rouge 625 nm 27 LXHL-BL01 Ambre 590 nm 25 LXHL-BD03 Rouge 625 nm 42 LXHL-BH03 Rouge/Orange 617 nm 55 LXHL BL03 Ambre 590 nm 42 LXHL-PL01 Ambre 590 nm 42 LXHL-DW01 Blanc 5500 K 22 LXHL-DM01 Vert 530 nm 27 LXHL-DE01 Cyan 505 nm 27 LXHL-DB01 Bleu 470 nm 9 LXHL-DR01 Bleu roi 455 nm 135 mW LXHL-DD01 Rouge 625 nm 40 LXHL-DH01 Rouge/Orange 617 nm 50 LXHL-DL01 Ambre 590 nm 38 Aile de chauve-souris Lambert Emission latérale DESSINS A L’ECHELLE REELLE LXHL-PM01 Vert 530 nm 30 LXHL-PE01 Cyan 505 nm 30 LXHL-PB01 Bleu 470 nm 10 LXHL-PR03 Bleu roi 455 nm 150 mW LXHL-PD01 Rouge 625 nm 44 LXHL-PH01 Rouge/Orange 617 nm 55 LXHL-PW01 Blanc 5500 K 25 Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement Luxeon Star 5 LXHL-FD1C N/A N/A Rouge 625 nm 40 — LXHL-FH1C N/A N/A Rouge/Orange 617 nm 50 — LXHL-FL1C N/A N/A Ambre 590 nm 38 — Description Modules Luxeon de forme carrée et hexagonale. Fournis avec connecteur AMP 2 broches, ou pastilles à souder pour la connexion électrique. Pour un contrôle précis du rayonnement, également disponible avec optique secondaire PMMA à haut rendement. Disponible en blanc, blanc chaud, vert, cyan, bleu, bleu roi, rouge, rouge/orange et ambre. LXHL-MM1C LXHL-MM1A LXHL-NM98 Vert 530 nm 30 600 LXHL-ME1C LXHL-ME1A LXHL-NE98 Cyan 505 nm 30 600 LXHL-MB1C LXHL-MB1A LXHL-NB98 Bleu 470 nm 10 200 LXHL-MRRC LXHL-MRRA LXHL-NRR8 Bleu roi 455 nm 150 mW 120 LXHL-MD1C LXHL-MD1A LXHL-ND98 Rouge 625 nm 27 810 LXHL-ML1C LXHL-ML1A LXHL-NL98 Ambre 590 nm 25 750 LXHL-MDAC N/A N/A Rouge 625 nm 42 — LXHL-MHAC N/A N/A Rouge/Orange 617 nm 55 — LXHL-MLAC N/A N/A Ambre 590 nm 42 — LXHL-MW1D LXHL-MW1B N/A Blanc 5500 K 25 — LXHL-MM1D LXHL-MM1B N/A Vert 530 nm 30 — LXHL-ME1D LXHL-ME1B N/A Cyan 505 nm 30 — LXHL-MB1D LXHL-MB1B N/A Bleu 470 nm 10 — LXHL-MRRD LXHL-MRRB N/A Bleu roi 455 nm 150 mW — LXHL-MD1D LXHL-MD1B LXHL-ND94 Rouge 625 nm 44 660 LXHL-MH1D LXHL-MH1B LXHL-NH94 Rouge/Orange 617 nm 55 825 LXHL-ML1D LXHL-ML1B LXHL-NL94 Ambre 590 nm 42 540 LXHL-FW1C N/A N/A Blanc 5500 K 22 — LXHL-FM1C N/A N/A Vert 530 nm 27 — LXHL-FE1C N/A N/A Cyan 505 nm 27 — LXHL-FB1C N/A N/A Bleu 470 nm 10 — LXHL-FR1C N/A N/A Bleu roi 455 nm 135 mW — Blanc chaud 3300 K 20 200 LXHL-MWEC LXHL-MWEA LXHL-NWE8 Blanc 5500 K 25 500 DESSINS A L’ECHELLE REELLE LXHL-MWGC N/A LXHL-NWG8 La valeur “Lumens typique” pour les produits Star/O est approximativement inférieure de 10% à la même valeur pour les produits Luxeon Star sans optique de réglage. Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Candela typique (Star/O) Modèle de rayonnement Star (aile de chauve-souris, Lambert) Star/O (avec optique) Star (émission latérale) Star/C (avec connecteur) Référence Luxeon Star Référence Luxeon Star/C Référence Luxeon Star/O Emission latérale Lambert Aile de chauve-souris Pour de plus amples informations, veuillez visiter le site www.luxeon.com. 6 Luxeon III Emitter & Star Star Modules Luxeon de forme hexagonale. Deux ou trois fois plus de lumière que les produits Luxeon I. Livré avec pastilles à souder pour la connexion électrique. Disponibles en blanc, vert, cyan, bleu et bleu roi. Prévu pour fonctionner en 700 mA et 1000 mA. Emitter La puissance Luxeon III sous sa forme la plus basique. Concevez et construisez votre source lumineuse Luxeon III selon vos spécifications. Luxeon III est prévu pour fonctionner en 700 mA et 1000 mA. Les diodes Luxeon III sont disponibles en blanc, vert, cyan, bleu et bleu roi. LXHL-PW09 Blanc 5500 K 65 80 LXHL-PM09 Vert 530 nm 64 80 LXHL-PE09 Cyan 505 nm 64 80 LXHL-PB09 Bleu 470 nm 23 30 LXHL-PR09 Bleu roi 455 nm 340 mW 450 mW Lambert Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP (700 mA) Lumens TYP (1000 mA) Modèle de rayonnement Pour de plus amples informations, veuillez visiter le site www.luxeon.com. LXHL-LW3C Blanc 5500 K 65 80 LXHL-LM3C Vert 530 nm 64 80 LXHL-LE3C Cyan 505 nm 64 80 LXHL-LB3C Bleu 470 nm 23 30 LXHL-LR3C Bleu roi 455 nm 340 mW 450 mW Lambert Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP (700 mA) Lumens TYP (1000 mA) Modèle de rayonnement DESSINS A L’ECHELLE REELLE Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement 7 Luxeon V Emitter & Star Star Star (émission latérale) Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement LXHL-LM5C Vert 530 nm 120 LXHL-LE5C Cyan 505 nm 120 LXHL-LB5C Bleu 470 nm 45 LXHL-LR5C Bleu roi 455 nm 500 mW LXHL-FW6C Blanc 5500 K 105 Emission latérale LXHL-FM5C Vert 530 nm 110 LXHL-FE5C Cyan 505 nm 110 LXHL-FB5C Bleu 470 nm 27 LXHL-FR5C Bleu roi 455 nm 450 mW Star Modules Luxeon de forme hexagonale. Quatre fois plus de lumière que les produits Luxeon standard. Livré avec pastilles à souder pour la connexion électrique. Disponibles en vert, cyan, bleu et bleu roi. Les diodes Luxeon V portables, disponibles en blanc, sont conçues pour les applications avec piles (1000 heures), les «lampes de mineur» et les issues de secours. Lambert Emission latérale LXHL-LW6C Blanc 5500 K 120 Lambert Remarque : Les diodes portables Luxeon V sont conçues et spécifiées pour une durée de vie de 1 000 heures. Voir la fiche technique (document DS40) pour la conservation de l’intensité lumineuse. Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Lambert Emission latérale LXHL-PM02 Vert 530 nm 120 LXHL-PE02 Cyan 505 nm 120 LXHL-PB02 Bleu 470 nm 45 LXHL-PR02 Bleu roi 455 nm 500 mW LXHL-DM02 Vert 530 nm 110 LXHL-DE02 Cyan 505 nm 110 LXHL-DB02 Bleu 470 nm 27 LXHL-DR02 Bleu roi 455 nm 450 mW LXHL-PW03 Blanc 5500 K 120 Lambert LXHL-DW03 Blanc 5500 K 105 Emission latérale Luxeon V Emitter Remarque : Les diodes portables blanches Luxeon V sont conçues et spécifiées pour une durée de vie de 1 000 heures. Voir la fiche technique (document DS40) pour la conservation de l’intensité lumineuse. Emitter La puissance des diodes Luxeon V et Luxeon V portables sous sa forme la plus basique. Concevez et construisez votre source lumineuse Luxeon V selon vos spécifications. Les diodes Luxeon V sont disponibles en vert, cyan, bleu et bleu roi. Les diodes portables Luxeon V sont disponibles en blanc. Luxeon V Portable DESSIN A L’ECHELLE REELLE Luxeon V Star Luxeon V Portable Star 8 Luxeon Warm White LXHL-BW03 Blanc chaud 3300 K 20 Aile de chauve-souris LXHL-NWG8 Blanc chaud 3300 K 17 Avec optique de réglage Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement Description Les produits Luxeon Emitter et Star Warm White sont les seules sources de lumière blanche à semi-conducteurs de faible CCT et de CRI élevé. Avec un indice de rendu des couleurs de 90 et une température de couleur corrélée de 3200 K, les produits Luxeon en lumière blanche ouvrent la porte à l’utilisation plus importante d’éclairages par semi-conducteurs dans les applications intérieures et spécialisées en apportant le caractère apaisant et chaud des lampes incandescentes et halogènes. DESSINS A L’ECHELLE REELLE Emitter LXHL-MWGC Blanc chaud 3300 K 20 Aile de chauve-souris Pour de plus amples informations, veuillez visiter le site www.luxeon.com. LXHL-BRD1 Bleu dentaire 460nm 140mw Aile de chauve-souris LXHL-PRD5 Bleu dentaire 460nm 600mw Lambert 9 Luxeon Dental Référence Couleur Longueur d’onde dominante ou temp. couleur Puissance Radiométrique Typique Modèle de rayonnement LXHL-MRD1 Bleu dentaire 460nm 140mw Aile de chauve-souris LXHL-LRD5 Bleu dentaire 460nm 600mw Lambert Star Emitter Description Les solutions Luxeon Dental incluent les produits Luxeon et Luxeon V qui offrent deux options de correction des puissances élevées. La gamme Luxeon Dental est disponible en configurations diode et étoile qui permettent une conception souple des systèmes de corrections de puissance. Les produits Luxeon Dental sont choisis sur la base de la longueur d’onde en pointe pour des temps de correction courts. Ils sont produits avec des niveaux élevés de puissance minimale pour fournir la courte longueur d’onde bleue nécessaire à la réduction des temps de correction tout en autorisant des baguettes portatives. Cette gamme révolutionnaire est particulièrement adaptée au secteur des soins dentaires pour fournir le meilleur rendement nécessaire à ces applications. Pour de plus amples informations, veuillez visiter le site www.luxeon.com. DESSINS A L’ECHELLE REELLE 10 Luxeon DCC DESSIN A L’ECHELLE REELLE Description Luxeon DCC est une matrice linéaire de DEL Luxeon RVB spécialement conçue comme source lumineuse de rétro-éclairage des écrans à cristaux liquides (LCD). Pour ces applications, Luxeon DCC offre des avantages significatifs par rapport aux solutions classiques et à base d’autres DEL. Luxeon DCC permet aux fabricants de réaliser des écrans plus lumineux, plus colorés et plus solides avec des avantages concurrentiels sur le marché. Lumileds a mis rassemblé les compétences de base pour profiter des caractéristiques uniques de chaque diode Luxeon. Chacune a été choisie pour compléter les caractéristiques de chaque autre diode de la source lumineuse. LXHL-MGAA 99 x 32 LXHL-MGBA 153 x 32 Source lumineuse Taille (mm) 5” 7” 8” 9” 10.1” 12.1” 15.0” 18.1” 4:3 16:10 4:3 4:3 4:3 4:3 4:3 4:3 Taille & proportions de l’écran B S B B B S LXHL-MGCA 225 x 32 LXHL-MGDA 306 x 32 B S S B LXHL-MGEA 360 x 32 B S= source lumineuse Luxeon DCC placée sur le côté de l’écran B= source lumineuse Luxeon DCC placée au bas de l’écran 11 Luxeon Flood LXHL-MWCA Blanc 5500 K 300 LXHL-MMCA Vert 530 nm 360 LXHL-MECA Cyan 505 nm 360 LXHL-MBCA Bleu 470 nm 120 LXHL-MDCA Rouge 625 nm 320 LXHL-MLCA Ambre 590 nm 300 LXHL-MWJA Blanc 5500 K 450 LXHL-MMJA Vert 530 nm 540 LXHL-MEJA Cyan 505 nm 540 LXHL-MBJA Bleu 470 nm 180 LXHL-MDJA Rouge 625 nm 480 LXHL-MLJA Ambre 590 nm 450 LXHL-MDCB Rouge 625 nm 525 LXHL-MLCB Ambre 590 nm 500 LXHL-MDJB Rouge 625 nm 790 LXHL-MLJB Ambre 590 nm 750 12 18 12 18 Aile de chauvesouris Lambert Nombre Référence Couleur de DEL Longueur d’onde dominante ou temp. couleur Lumens TYP Modèle de rayonnement Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Description Matrice rectangulaire de 12 ou 18 sources lumineuses Luxeon densément conditionnées. Connecteur AMP fourni pour faciliter la connexion électrique. Disponible en blanc, vert, cyan, bleu, rouge et ambre. DESSIN A L’ECHELLE REELLE 12 Luxeon Line & Ring LXHL-NW97 Blanc 5500 K 125 LXHL-NM97 Vert 530 nm 150 LXHL-NE97 Cyan 505 nm 150 LXHL-NB97 Bleu 470 nm 50 LXHL-ND93 Rouge 625 nm 225 LXHL-NL93 Ambre 590 nm 215 LXHL-NW96 Blanc 5500 K 250 LXHL-NM96 Vert 530 nm 300 LXHL-NE96 Cyan 505 nm 300 LXHL-NB96 Bleu 470 nm 100 LXHL-ND92 Rouge 625 nm 450 LXHL-NL92 Ambre 590 nm 425 Jusqu’à 6 Luxeon Ring Jusqu’à 12 Luxeon Ring Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Configuration Pour de plus amples informations, veuillez visiter le site www.luxeon.com. Ring Matrices circulaires de 6 ou 12 sources lumineuses, utilisables séparément ou conjointement. Livrées avec optique secondaire PMMA haut rendement pour le contrôle précis du rayonnement. Connecteur AMP 2 broches fourni pour faciliter la connexion électrique. Disponible en blanc, vert, cyan, bleu, rouge et ambre. Line Matrice linéaire de 12 sources lumineuses Luxeon. Livrée avec optique secondaire PMMA haut rendement pour le contrôle précis du rayonnement. Deux connecteurs AMP 2 broches permettent la connexion en chaîne de mètres de lumière. Disponible en blanc, vert, cyan, bleu, rouge et ambre. LXHL-NW99 Blanc 5500 K 250 LXHL-NM99 Vert 530 nm 300 LXHL-NE99 Cyan 505 nm 300 LXHL-NB99 Bleu 470 nm 100 LXHL-ND95 Rouge 625 nm 450 LXHL-NL95 Ambre 590 nm 425 Référence Couleur Longueur d’onde dominante ou temp. couleur Lumens TYP Pour de plus amples informations, veuillez visiter le site www.luxeon.com. DESSINS A L’ECHELLE REELLE 13 HPWN-MG00 Vert 525 nm 4,5 4,1 90 HPWN-MC00 Cyan 505 nm 5,0 4,5 90 HPWN-MB00 Bleu 470 nm 2,0 1,8 90 HPWT-RD00 Rouge 630 nm 3,0 3,8 25 x 68 HPWT-MD00 Rouge 630 nm 3,0 1,8 70 HPWT-DD00 Rouge 630 nm 3,0 4,5 40 HPWT-BD00 Rouge 630 nm 3,0 6,0 30 HPWT-RH00 Rouge/Orange 620 nm 3,8 4,8 25 x 68 HPWT-MH00 Rouge/Orange 620 nm 3,8 2,3 70 HPWT-DH00 Rouge/Orange 620 nm 3,8 5,7 40 HPWT-BH00 Rouge/Orange 620 nm 3,8 7,6 30 HPWT-RL00 Ambre 594 nm 1,5 1,9 25 x 68 HPWT-ML00 Ambre 594 nm 1,5 0,9 70 HPWT-DL00 Ambre 594 nm 1,5 2,3 40 HPWT-BL00 Ambre 594 nm 1,5 3,0 30 Référence Couleur Longueur d’onde dominante Lumens Candela Angle de vision (deg.) SuperFlux DEL carrées, 4 broches, montage sur trou. Disponible en vert, cyan, bleu, rouge, rouge/orange et ambre et avec différents angles de vision pour tous besoins de conception. DEL SuperFlux & SnapLED DESSINS A L’ECHELLE REELLE Pour de plus amples informations, veuillez visiter le site www.lumileds.com. SnapLED DEL SnapLED rectangulaires haute luminosité. Il est possible de créer des dispositions innovantes dans des boîtiers qui utilisent une technologie de montage sans soudure. Disponibles en couleurs rouge/orange et ambre en versions 70 mA et 150 mA. HPWT-TH00 Rouge/Orange 621 nm 3,0 1,8 85 HPWT-TL00 Ambre 594 nm 1,5 0,9 85 HPWT-FH00 Rouge/Orange 621 nm 3,0 6,0 30 HPWT-FL00 Ambre 594 nm 1,5 3,0 30 HPWS-TH00 Rouge/Orange 621 nm 6,0 3,6 85 HPWS-TL00 Ambre 594 nm 3,0 1,8 85 HPWS-FH00 Rouge/Orange 621 nm 6,0 12,0 30 HPWS-FL00 Ambre 594 nm 3,0 6,0 30 Référence Couleur Longueur d’onde dominante Lumens (min.) Candela (min.) Angle de vision (deg.) Pour de plus amples informations, veuillez visiter le site www.lumileds.com. 70mA 150mA 14 Documentation générale Lumileds Plug and Play Guide Lumileds Application Overview Luxeon Lighting Vitrines des applications AS01 Portable Lighting AS02 Task/Reading Lights AS03 Architectural Detail Lighting AS04 Landscape and Path Lighting AS05 Stairway and Marker Lighting AS06 Interior Decorative Color Lighting AS08 Colored Signal Lighting AS10 Interior Decorative Lighting AS11 Museum Quality/Fiber Alternative/Display Pinpoint Lighting AS12 Entertainment, Film and Studio Lighting AS13 LED Retrofit Lamps AS14 Luxeon DCC AS15 Lighting for Digital Imaging AS16 Sign Lighting Fiches techniques DS05 SuperFlux LEDs DS21 Luxeon Line DS22 Luxeon Ring DS23 Luxeon Star DS23A Luxeon Star Option Code Selections DS24 Luxeon Flood DS25 Luxeon Emitter DS25A Luxeon Emitter Option Code Selections DS26 Luxeon Collimator DS30 Luxeon V Star DS34 Luxeon V Emitter DS35 Luxeon Dental DS40 Luxeon V Portable DS45 Luxeon III Emitter DS46 Luxeon III Star DS47 Luxeon Warm White Light Sources DS48 Luxeon DCC Notes d’applications résumées AB05 Luxeon Thermal Design Guide AB07 Lumen Maintenance of White Luxeon Light Sources AB08 Optical Testing for SuperFlux, SnapLED and Luxeon Emitters AB10 Luxeon Emitter Assembly Guide AB11 Electrical Drive Information for Luxeon Samples AB12 Luxeon Custom Design Guide AB13 Soldering SuperFlux LEDs AB16 Lumileds SuperFlux LEDs versus Other LEDs AB17 Benefits of Lumileds Solid-State Lighting Solutions vs. Conventional Lighting Ressources Documentation Luxeon - Index Lumileds modifie et met à jour régulièrement sa documentation. Pour les versions les plus récentes de ces documents et d’autres, veuillez visiter la bibliothèque Lumileds à l’adresse : www.lumileds.com. 15 Guide des fournisseurs Le Guide des fournisseurs (Lumileds Vendor Resource Guide) est un annuaire complet des sociétés qui fournissent dans le monde entier les produits et services Luxeon, SuperFlux et SnapLED. Vous pouvez les rechercher par nom, par pays ou par spécialité. Si vous avez besoin de l’assistance d’experts pour le développement de vos solutions à base de produits Lumileds, consultez d’abord notre Guide des fournisseurs. AB20-3 Electrical Design Considerations for Super FluxLEDs AB20-3A Advanced Electrical Design Models AB20-3B SuperFlux and SnapLED Emitter Forward Voltage Data AB20-4 Thermal Management Considerations for SuperFlux LEDs AB20-5 Secondary Optics Design Considerations for SuperFlux LEDs AB20-6 Reliability Considerations for SuperFlux LEDs AB20-7 SuperFlux Categories and Labels AB21 Luxeon Product Binning and Labeling (June 2003) AB22 Thyristor Application Brief AB23 Thermal Design Considerations for Luxeon V Power Light Sources AB25 Luxeon Reliability Modèles de référence DR01 Luxeon for Camera, Phone Flash PDA and DSC Applications Lumileds Lighting 370 W. Trimble Road San Jose, CA 95131 +1 408.435.6044 en Amérique du Nord +31 499.339.439 en Europe +60 4680.5342 en Asie / Japon www.lumileds.com www.luxeon.com Luxeon distribué par Future Electronics www.FutureElectronics.com 888.589.3662 en Amérique du Nord 00.800.443.88.873 en Europe 800.5864.5337 en Asie Document : PG-01-E Mars 2004 TO-220AB BT136-600D 4Q Triac 30 September 2013 Product data sheet Scan or click this QR code to view the latest information for this product 1. General description Planar passivated very sensitive gate four quadrant triac in a SOT78 plastic package intended for use in general purpose bidirectional switching and phase control applications, where high sensitivity is required in all four quadrants. This very sensitive gate "series D" triac is intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. 2. Features and benefits • Direct triggering from low power drivers and logic ICs • High blocking voltage capability • Low holding current for low current loads and lowest EMI at commutation • Planar passivated for voltage ruggedness and reliability • Triggering in all four quadrants • Very sensitive gate 3. Applications • General purpose motor control • General purpose switching 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDRM repetitive peak offstate voltage - - 600 V ITSM non-repetitive peak onstate current full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 - - 25 A IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C; Fig. 1; Fig. 2; Fig. 3 - - 4 A Static characteristics VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 IGT gate trigger current - 2 5 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 2 / 13 Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 °C; Fig. 7 - 5 10 mA IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 1.2 10 mA 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 1 2 mb 3 TO-220AB (SOT78) sym051 T1 G T2 6. Ordering information Table 3. Ordering information Type number Package Name Description Version BT136-600D TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 BT136-600D/DG TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 3 / 13 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDRM repetitive peak off-state voltage - 600 V IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C; Fig. 1; Fig. 2; Fig. 3 - 4 A full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 ITSM non-repetitive peak on-state - 25 A current full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 27 A I2t I2t for fusing tp = 10 ms; SIN - 3.1 A2s IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2+ G+ - 50 A/μs IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2+ G- - 50 A/μs IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2- G- - 50 A/μs dIT/dt rate of rise of on-state current IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/μs; T2- G+ - 10 A/μs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power over any 20 ms period - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 4 / 13 Tmb (°C) - 50 0 50 100 150 003aae828 2 3 1 4 5 IT(RMS) (A) 0 Fig. 1. RMS on-state current as a function of mounting base temperature; maximum values 003aae830 4 8 12 IT(RMS) (A) 0 surge duration (s) 10- 2 10- 1 1 10 2 6 10 f = 50 Hz Tmb ≤ 107 °C Fig. 2. RMS on-state current as a function of surge duration; maximum values 003aae827 4 2 6 8 Ptot (W) 0 IT(RMS) (A) 0 1 2 3 4 5 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α α = 180° 120° 90° 60° 30° α = conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 5 / 13 003aae831 10 20 30 ITSM (A) 0 number of cycles 1 10 102 103 104 5 15 25 ITSM t IT Tj(init) = 25 °C max 1/f f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aae829 tp (s) 10- 5 10- 4 10- 3 10- 2 10- 1 102 103 ITSM (A) 10 ITSM t IT Tj(init) = 25 °C max tp (1) (2) tp ≤ 20 ms (1) dIT/dt limit (2) T2- G+ quadrant limit Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 6 / 13 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance half cycle; Fig. 6 - - 3.7 K/W from junction to mounting base full cycle; Fig. 6 - - 3 K/W Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/W 003aae836 tp (s) 10- 5 10- 4 10- 3 10- 2 10- 1 1 10 1 10- 1 10 Zth(j-mb) (K/W) 10- 2 bidirectional unidirectional tp P t Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 7 / 13 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 - 2 5 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 - 2.5 5 mA IGT gate trigger current VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 °C; Fig. 7 - 5 10 mA VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 8 - 1.6 10 mA VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 8 - 4.5 15 mA VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; Fig. 8 - 1.2 10 mA IL latching current VD = 12 V; IG = 0.1 A; T2- G+; Tj = 25 °C; Fig. 8 - 2.2 15 mA IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 1.2 10 mA VT on-state voltage IT = 5 A; Tj = 25 °C; Fig. 10 - 1.4 1.7 V VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 11 VGT gate trigger voltage - 0.7 1 V VD = 400 V; IT = 0.1 A; Tj = 125 °C; Fig. 11 0.25 0.4 - V ID off-state current VD = 600 V; Tj = 125 °C - 0.1 0.5 mA Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 125 °C; RGT1 = 1 kΩ; (VDM = 67% of VDRM); exponential waveform - 5 - V/μs tgt gate-controlled turn-on time ITM = 6 A; VD = 600 V; IG = 0.1 A; dIG/ dt = 5 A/μs - 2 - μs NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 8 / 13 Tj (°C) - 60 - 10 40 90 140 003aae833 1 2 3 0 (1) (2) (3) (4) (1) (2) (3) (4) IGT IGT (25 °C) (1) T2- G+ (2) T2- G- (3) T2+ G- (4) T2+ G+ Fig. 7. Normalized gate trigger current as a function of junction temperature Tj (°C) - 60 - 10 40 90 140 003aae835 1 2 3 0 IL IL(25°C) Fig. 8. Normalized latching current as a function of junction temperature Tj (°C) - 60 - 10 40 90 140 003aae837 1.0 0.5 1.5 2.0 0 IH IH(25°C) Fig. 9. Normalized holding current as a function of junction temperature VT (V) 0 1 2 3 003aae834 4 8 12 IT (A) 0 (1) (2) (3) Vo = 1.27 V Rs = 0.091 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 10. On-state current as a function of on-state voltage NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 9 / 13 Tj (°C) - 60 - 10 40 90 140 003aae832 0.8 0.4 1.2 1.6 0 VGT VGT (25 °C) Fig. 11. Normalized gate trigger voltage as a function of junction temperature NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 10 / 13 10. Package outline OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT78 3-lead TO-220AB SC-46 SOT78 08-04-23 08-06-13 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. UNIT A mm 4.7 4.1 1.40 1.25 0.9 0.6 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 15.0 12.8 3.30 2.79 3.8 3.5 A1 DIMENSIONS (mm are the original dimensions) Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB 0 5 10 mm scale b b1(2) 1.6 1.0 c D 1.3 1.0 b2(2) D1 E e 2.54 L L1(1) L2(1) max. 3.0 p q 3.0 2.7 Q 2.6 2.2 D D1 q p L 1 2 3 L1(1) b1(2) (3×) b2(2) (2×) e e b(3×) E A A1 c Q L2(1) mounting base Fig. 12. Package outline TO-220AB (SOT78) NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 11 / 13 11. Legal information 11.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 12 / 13 grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. NXP Semiconductors BT136-600D 4Q Triac BT136-600D All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 30 September 2013 13 / 13 12. Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ............................................. 2 7 Limiting values .......................................................3 8 Thermal characteristics .........................................6 9 Characteristics .......................................................7 10 Package outline ................................................... 10 11 Legal information .................................................11 11.1 Data sheet status ............................................... 11 11.2 Definitions ...........................................................11 11.3 Disclaimers .........................................................11 11.4 Trademarks ........................................................ 12 © NXP N.V. 2013. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 September 2013 Page 26-1 Semiconductors Integrated Circuits Part Number Description NTE4001B IC-CMOS, Quad 2-Input NOR Gate NTE4001BT IC-CMOS, Quad 2-Input NOR Gate (Surface Mount) NTE4002B IC-CMOS, Dual 4-Input NOR Gate NTE4002BT IC-CMOS, Dual 4-Input NOR Gate (Surface Mount) NTE4006B IC-CMOS, 18-Stage Static Shift Register NTE4007 IC-CMOS, Dual Complementary Pair Plus Inverter NTE4007T IC-CMOS, Dual Complementary Pair Plus Inverter (Surface Mount) NTE4008B IC-CMOS, 4-Bit Full Adder w/Parallel Carry Out NTE4009 IC-CMOS, Hex Buffer/Converter (Inverting) NTE40098B IC-CMOS, Hex 3-State Buffer (Inverting) NTE40100B IC-CMOS, 32-Stage Static Shift Left/Right, Shift Register NTE40106B IC-CMOS, Hex Schmitt Trigger NTE40106BT IC-CMOS, Hex Schmitt Trigger (Surface Mount) NTE4011B IC-CMOS, Quad 2-Input NAND Gate NTE4011BT IC-CMOS, Quad 2-Input NAND Gate (Surface Mount) NTE4012B IC-CMOS, Dual 4-Input NAND Gate NTE4012BT IC-CMOS, Dual 4-Input NAND Gate (Surface Mount) NTE4013B IC-CMOS, Dual D Type Flip-Flop NTE4013BT IC-CMOS, Dual D Type Flip-Flop (Surface Mount) NTE4014B IC-CMOS, 8-Stage Shift Register Synchronous Parallel or Serial Input/Serial Output NTE4015B IC-CMOS, Dual 4-Stage Static Shift Register w/Serial Input/Parallel Output NTE4015BT IC-CMOS, Dual 4-Stage Static Shift Register w/Serial Input/Parallel Output (Surface Mount) NTE40160B IC-CMOS, Synchronous Programmable 4-Bit BCD Counter w/Asynchronous Clear Integrated Circuits (cont.) Part Number Description NTE40161B IC-CMOS, Synchronous Programmable 4-Bit Binary Counter w/Asynchronous Clear NTE40162B IC-CMOS, Synchronous Programmable 4-Bit BCD Counter w/Synchronous Clear NTE40163B IC-CMOS, Synchronous Programmable 4-Bit BCD Counter w/Synchronous Clear NTE4016B IC-CMOS, Quad Bilateral Switch for Transmission or Multiplexing of Analog or Digital Signals NTE40174B IC-CMOS, Hex D-Type Flip-Flop NTE40174BT IC-CMOS, Hex D-Type Flip-Flop (Surface Mount) NTE40175B IC-CMOS, Quad D-Type Flip-Flop NTE4017B IC-CMOS, Decade Counter w/10 Decoder Outputs NTE40182B IC-CMOS, Look Ahead Carry Generator NTE4018B IC-CMOS, Presettable Divide-By-"N" Counter NTE40192B IC-CMOS, Presettable Up/Down BCD Counter, Dual Clock w/Reset NTE40193B IC-CMOS, Presettable Up/Down Binary Counter, Dual Clock w/Reset NTE40194B IC-CMOS, 4-Bit Bidirectional Universal Shift Register w/Asynchronous Master/Reset NTE40195B IC-CMOS, 4-Bit Shift Register NTE4020B IC-CMOS, 14-Stage Ripple-Carry Binary Counter/Divider NTE4020BT IC-CMOS, 14-Stage Ripple-Carry Binary Counter/Divider (Surface Mount) NTE4021B IC-CMOS, 8-Stage Static Shift Register Asynchronous Parallel Input or Synchronous Serial Input/Serial Output NTE4021BT IC-CMOS, 8-Stage Static Shift Register Asynchronous Parallel Input or Synchronous Serial Input/Serial Output (Surface Mount) NTE4022B IC-CMOS, Octal Counter/Divider w/8 Decoded Outputs NTE4023B IC-CMOS, Triple 3-Input NAND Gate NTE4023BT IC-CMOS, Triple 3-Input NAND Gate (Surface Mount) NTE4024B IC-CMOS, 7-Stage Ripple-Carry Binary Counter/Divider NTE4025B IC-CMOS, Triple 3-Input NOR Gate NTE4016BT NTE4019B IC-CMOS, Quad Bilateral Switch for Transmission or Multiplexing of Analog or Digital Signals (Surface Mount) IC-CMOS, Quad AND/OR Select Gate NTE4025BT IC-CMOS, Triple 3-Input NOR Gate (Surface Mount) NTE4026B IC-CMOS, Decade Counter/Divider w/Decoded Seven- Segment Display Outputs and Display Enable NTE4027B IC-CMOS, Dual J-K Master-Slave Flip-Flop NTE4027BT IC-CMOS, Dual J-K Master-Slave Flip-Flop (Surface Mount) NTE4028B IC-CMOS, BCD-to-Decimal Decoder NTE4029BT IC-CMOS, Presettable Up/Down Counter, Binary or BCD Decade Decoder (Surface Mount) NTE4030B IC-CMOS, Quad Exclusive OR Gate NTE4028BT IC-CMOS, BCD-to-Decimal Decoder (Surface Mount) NTE4029B IC-CMOS, Presettable Up/Down Counter, Binary or BCD Decade Decoder NTE4031B IC-CMOS, 64-Stage Static Shift Register NTE4032B IC-CMOS, Triple Serial Positive Logic Adder NTE4033B IC-CMOS, Decade Counter/Divider w/Decoded Seven- Segment Display Outputs and Ripple Blanking NTE4034B IC-CMOS, 8-Stage Static Bi-Directional Parallel/Serial Input/Output Bus Register NTE4035B IC-CMOS, 4-Stage Parallel In/Parallel Out Shift Register w/J-K Serial Input and True Complement Output NTE4038B IC-CMOS, Triple Serial Negative Logic Adder NTE4040B IC-CMOS, 12-Stage Ripple-Carry Binary Counter/Divider Page 26-2 Semiconductors NTE4256 IC-NMOS, 256K Dynamic RAM, 100ns NTE4501 IC-CMOS, Dual 4-Input NAND Gate, 2-Input NOR/OR Gate, 8- Input AND/NAND Gate NTE4503B IC-CMOS, Hex 3-State Non-Inverting Buffer NTE4510B IC-CMOS, Presettable UP/Down BCD Counter NTE4510BT IC-CMOS, Presettable UP/Down BCD Counter (Surface Mount) NTE4511B IC-CMOS, BCD-to-Seven-Segment Latch Decoder Driver Integrated Circuits (cont.) Part Number Description NTE4041 IC-CMOS, Quad True/Complement Buffer NTE4042B IC-CMOS, Quad, Clocked D-Type Latch NTE4042BT IC-CMOS, Quad, Clocked D-Type Latch (Surface Mount) NTE4043B IC-CMOS, Quad, 3-State NOR R/S Latch NTE4043BT IC-CMOS, Quad, 3-State NOR R/S Latch (Surface Mount) NTE4044B IC-CMOS, Quad 3-State NAND R/S Latch NTE4044BT IC-CMOS, Quad 3-State NAND R/S Latch (Surface Mount) NTE4045B IC-CMOS, 21-Stage Counter NTE4045BT IC-CMOS, 21-Stage Counter (Surface Mount) NTE4046B IC-CMOS, Phase-Lock Loop (PLL) NTE4046BT IC-CMOS, Phase-Lock Loop (PLL) (Surface Mount) Integrated Circuits (cont.) Part Number Description NTE4047B IC-CMOS, Low-Power Monostable/Astable Multivibrator NTE4047BT IC-CMOS, Low-Power Monostable/Astable Multivibrator (Surface Mount) NTE4048B IC-CMOS, Multi-Function Expandable 8-Input Gate NTE4049 IC-CMOS, Hex Buffer/Converter, Inverting NTE4049T IC-CMOS, Hex Buffer/Converter, Inverting (Surface Mount) NTE4050BT IC-CMOS, Hex Buffer/Converter, Non-Inverting (Surface Mount) NTE4051B IC-CMOS, Analog, Single 8-Channel Multiplexer/Demultiplexer NTE4051BT IC-CMOS, Analog, Single 8-Channel Multiplexer/Demultiplexer (Surface Mount) NTE4052B IC-CMOS, Analog, Differential 4-Channel Multiplexer NTE4052BT IC-CMOS, Analog, Differential 4-Channel Multiplexer NTE4053B IC-CMOS, Triple 2-Channel Analog Multiplexer NTE4053BT IC-CMOS, Triple 2-Channel Analog Multiplexer (Surface Mount) NTE4055B IC-CMOS, BCD-to-7 Segment Decoder/Driver w/"Display- Frequency" Output NTE4056B IC-CMOS, BCD-to-7-Segement Decoder/Divider w/Strobed Latch Function NTE4060B IC-CMOS 14-Stage Ripple-Carry Binary Counter/Divider and Oscillator NTE4060BT IC-CMOS 14-Stage Ripple-Carry Binary Counter/Divider and Oscillator (Surface Mount) NTE4063B IC-CMOS, 4-Bit Magnitude Comparator (High-Voltage Type) NTE4066B IC-CMOS, Quad Bilateral Switch NTE4066BT IC-CMOS, Quad Bilateral Switch (Surface Mount) NTE4067B IC-CMOS, Analog, Single 16-Channel Multiplexer/Demultiplexer NTE4068B IC-CMOS, 8-Input NAND/AND Gate (High Voltage Type) NTE4050B IC-CMOS, Hex Buffer/Converter, Non-Inverting NTE4040BT IC-CMOS, 12-Stae Ripple-Carry Binary Counter/Divider (Surface Mount) NTE4070B IC-CMOS, Quad Exclusive OR Gate NTE4070BT IC-CMOS, Quad Exclusive OR Gate (Surface Mount) NTE4071B IC-CMOS, Quad 2-Input OR Gate NTE4071BT IC-CMOS, Quad 2-Input OR Gate (Surface Mount) NTE4072B IC-CMOS, Dual 4-Input OR Gate NTE4073B IC-CMOS, Triple 3-Input AND Gate NTE4073BT IC-CMOS, Triple 3-Input AND Gate (Surface Mount) NTE4075BT IC-CMOS, Triple 3-Input OR Gate NTE4076B IC-CMOS, 4-Bit D-Type Register (High Voltage Type) NTE4077B IC-CMOS, Quad Exclusive NOR Gate NTE4077BT IC-CMOS, Quad Exclusive NOR Gate (Surface Mount) NTE4078B IC-CMOS, 8-Input NOR Gate NTE4081B IC-CMOS, Quad 2-Input AND Gate NTE4082B IC-CMOS, Dual 4-Input AND Gate NTE4085B IC-CMOS, Dual 2-Wide, 2-Input AND/OR Invert Gate NTE4086B IC-CMOS, Expandable 4-Wide, 2-Input AND/OR Invert Gate NTE4089B IC-CMOS, Binary Rte Multiplier NTE4093B IC-CMOS, Quad 2-Input NAND Schmitt Trigger NTE4093BT IC-CMOS, Quad 2-Input NAND Schmitt Trigger (Surface Mount) NTE4094B IC-CMOS, 8-Stage Shift and Storage Bus Register NTE4094BT IC-CMOS, 8-Stage Shift and Storage Bus Register (Surface Mount) NTE4095B IC-CMOS, Gated J-K Master/Slave Flip-Flop w/Set-Reset Capability Non-Inverting J and K Inputs NTE4096B IC-CMOS, Gated J-K Master/Slave Flip-Flop w/Set-Reset Capability Inverting and Non-Inverting J and K Inputs NTE4097B IC-CMOS, Analog, Differential 8-Channel Multiplexer/Demultiplexer NTE4098B IC-CMOS, Dual Monostable Multivibrator NTE4099B IC-CMOS, 8-Bit Addressable Latch NTE4164 IC-NMOS, 64K Dynamic RAM, 150ns NTE4075B IC-CMOS, Triple 3-Input AND Gate (Surface Mount) NTE4068BT IC-CMOS, 8-Input NAND/AND Gate (High Voltage Type) NTE4069 IC-CMOS, Hex Inverter (High Voltage Type) NTE4069T IC-CMOS, Hex Inverter (High Voltage Type) (Surface Mount) NTE4511BT IC-CMOS, BCD-to-Seven-Segment Latch Decoder Driver (Surface Mount) NTE4512B IC-CMOS, 8-Channel Data Selector Page 26-3 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE4513B IC-CMOS, BCD-to-Seven-Segment Latch Decoder Driver NTE4514B IC-CMOS, 4-Bit Latch/4-to-16 Decoder Line (Output "High" on Select) NTE4515B IC-CMOS, 4-Bit Latch/4-to-16 Line Decoder (Output "Low" on Select) NTE4516B IC-CMOS, Presettable UP/Down Binary Counter NTE4517B IC-CMOS, Dual 64-Stage Static Shift Register NTE4518B IC-CMOS, Dual BCD UP-Counter NTE4518BT IC-CMOS, Dual BCD UP-Counter (Surface Mount) NTE4520B IC-CMOS, Dual Binary Up-Counter NTE4520BT IC-CMOS, Dual Binary Up-Counter (Surface Mount) NTE4522B IC-CMOS, Programmable Diode-by-"N" 4-Bit BCD Counter NTE4526B IC-CMOS, Programmable Divide-by-"N" 4-Bit Binary Counter NTE4527B IC-CMOS, BCD Rate Multiplier NTE4528B IC-CMOS, Dual Retriggerable/Resettable Monostable Multivibrator NTE4528BT IC-CMOS, Dual Retriggerable/Resettable Monostable Multivibrator (Surface Mount) NTE4529B IC-CMOS, Dual 4-Channel Analog Data Selector NTE4531B IC-CMOS, 12-Bit Parity Tree NTE4532B IC-CMOS, 8-Bit Priority Encoder NTE4536B IC-CMOS, Programmable Timer NTE4538B IC-CMOS, Dual Precision Monostable Multivibrator NTE4521B IC-CMOS, 24-Stage Frequency Divider NTE4539B IC-CMOS, Dual 4-Channel Data Selector/Multiplexer NTE4541B NTE4541BT IC-CMOS, Programmable Timer (Surface Mount) NTE4543B IC-CMOS, BCD-to-Seven-Segment Latch/Decoder/Driver for Liquid Crystals NTE4547B IC-CMOS, High Current BCD-to-Seven-Segment Decoder/Driver NTE4553B IC-CMOS, 3-Digit BCD Counter NTE4555B IC-CMOS, Dual Binary to 1-of-4 Decoder/Demultiplexer (Output "High" on Select) NTE4556B IC-CMOS, Dual Binary to 1-of-4 Decoder/Demultiplexer (Output "Low" on Select) NTE4558B IC-CMOS, BCD-to-Seven-Segment Decoder NTE4566B IC-CMOS, Industrial Time Base Generator NTE4569B IC-CMOS, Programmable Divide-by-"N" Dual 4-Bit BCD/Binary Counter NTE4583B IC-CMOS, Dual Schmitt Trigger NTE4551B IC-CMOS, Quad 2-Input analog Multiplexer/Demultiplexer Part Number Description NTE4597B IC-CMOS, 8-Bit, Bus Compatible Counter Latch NTE4598B IC-CMOS, 8-Bit, Bus Compatible Addressable Latch NTE7400 IC-TTL, Quad 2-Input Pos NAND Gate NTE7401 IC-TTL, Quad 2-Input Pos NAND Gate w/Open Collector Outputs NTE7402 IC-TTL, Quad 2-Input Positive NOR Gate NTE7403 IC-TTL, Quad 2-Input Positive NAND Gate w/Open Collector Outputs NTE7404 IC-TTL, Hex Inverter NTE7405 IC-TTL Hex Inverter w/Open Collector Outputs NTE7406 IC-TTL, Hex Inverter Buffer/Driver w/Open Collector HV Outputs NTE7407 IC-TTL, Hex Buffer/Driver w/Open Collector HV Outputs NTE7408 IC-TTL, Quad 2-Input Pos AND Gate NTE7409 IC-TTL, Quad 2-Input Pos AND Gate w/Open Collector Outputs NTE7410 IC-TTL, Triple 3-Input Pos NAND Gate NTE74107 IC-TTL, Dual J-K Negative Edge Triggered Flip-FLop w/Clear and Preset NTE74109 IC-TTL, Dual J-K Pos Edge Triggered Flip-FLop w/Clear and Preset NTE7411 IC-TTL, Triple 3-Input Pos AND Gate NTE74110 IC-TTL, AND Gated J-K Master/Slave Flip-FLop w/Data Lockout NTE74116 IC-TTl, Dual 4-Bit Latch NTE7412 IC-TTL, Triple 3-Input Pos NAND Gate w/Collector Outputs NTE74120 IC-TTL, Dual Pulse Synchronizer/Driver NTE74121 IC-TTL, Monostable Multivibrator NTE74122 IC-TTL, Retriggerable Monostable Multivibrator w/Clear NTE74123 IC-TTL, Dual Retriggerable Monostable Multivibrator w/Clear NTE74126 IC-TTL, Quad Bus Buffer w/3-State Outputs NTE74128 IC-TTL, Quad 2-Input NOR 50ohm Line Driver NTE7413 IC-TTL, Dual 4-Input NAND Schmitt Trigger NTE74132 IC-TTL, Quad 2-Input Pos NAND Schmitt Trigger NTE7414 IC-TTL, Hex Schmitt Trigger NTE74141 IC-TTL, BCD-to-Decimal Decoder/Driver, Driver Filled Cold Cathode Indicator Tubes Directly NTE74145 IC-TTL, BCD-to-Decimal Decoder/Driver for Lamps, Relays, MOS NTE74147 IC-TTL, 10-Line Decimal-to-4-Line BCD Priority Encoder NTE74136 IC-TTL, Quad Exclusive OR Gate w/Open Collector Outputs NTE74150 IC-TTL, 1-of-16 Data Selector/Mulitplexer NTE74151 IC-TTL, 8-Channel Multiplexer NTE74148 IC-TTL, 8-Line to 3-Line OCtal Priority Encoder NTE74152 IC-TTL, 1-of-8 Data Selector/Multiplexer IC-CMOS, Programmable Timer NTE4584B IC-CMOS, Hex Schmitt Trigger NTE4585B IC-CMOS, 4-Bit Magnitude Comparator NTE74153 IC-TTL, Dual 4-Line-to-1-Line Data Selector/Mulitplexer NTE74154 IC-TTL, 4-Line-to-16-Line Decoder/Demultiplexer Page 26-4 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE74155 IC-TTL, Dual 2-Line-to-4-Line Decoder/Demultiplexer w/Totem Pole Outputs NTE74156 IC-TTL, Dual 2-Line-to-4-Line Decoder/Demultiplexer w/Open Collector Outputs NTE74157 IC-TTL, Quad 2-to-1-Line Data Selector/ Multiplexer w/Non- Inverted Data Outputs NTE74158 IC-TTL, Quad 2-to-1-Line Data Selector/ Multiplexer w/Inverted Data Outputs NTE7416 IC-TTL, Hex Inverter Buffer/Driver w/Open Collector HV Outputs NTE74160 IC-TTL, Synchronous 4-Bit Decade Counter w/Direct Clear NTE74161 IC-TTL, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74162 IC-TTL, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74163 IC-TTL, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74164 IC-TTL, 8-Bit Parallel-Out Serial Shift Register w/Async Clear NTE74165 IC-TTL, 8-Bit Parallel-In/Serial Out Shift Register NTE74166 IC-TTL, 8-Bit Parallel-In or Serieal-In/Serial Out Shift Register NTE7417 IC-TTL, Hex Buffer/Driver w/Open Collector HV Outputs NTE74170 IC-TTL, 4-by-4 Register File w/Open Collector Outputs NTE74173 IC-TTL, 4-Bit D-Type Flip-Flop w/3-State Outputs NTE74174 IC-TTL, Hex D-Type Flip-Flop w/Serial Rail Outputs and Common Direct Clear NTE74175 IC-TTl, Quad D-Type Flip-FLop w/Common Direct Clear and Complementary Outputs NTE74176 IC-TTL, Presettable Decade Counter/Latch NTE74177 IC-TTL, Presettable Binary Counter/Latch NTE74179 IC-TTL, 4-Bit Universal Shift Register w/Direct Clear NTE74180 IC-TTL, 9-Bit Odd/Even Parity Generator/Checker NTE74182 IC-TTL, Look-Ahead Carry Generator NTE74191 IC-TTL, Synchronous Up/Down Binary Counter NTE74192 IC-TTL, Synchronous Up/Down BCD Counter (Dual Clock w/Clear) NTE74193 IC-TTL, Synchronous Up/Down Binary Counter (Dual Clock w/Clear) NTE74195 IC-TTL, 4-Bit Parallel Access Shift Register NTE74196 IC-TTL, Presettable Decade Counter/Latch NTE74197 IC-TTL, Presettable Modulo-16 Binary Counter/Latch NTE74199 IC-TTL, 8-Bit Bidirectional Universal Shift Register NTE7420 IC-TTL, Dual 4-Input NAND Gate NTE7421 IC-TTL, Dual 4-Input AND Gate NTE7422 IC-TTL, Dual 4-Input NAND Gate w/Open COllector Outputs Part Number Description NTE74251 IC-TTL, Data Selector/Mulitplexer w/True and Inverted 3-State Outputs NTE7426 IC-TTL, Quad 2-Input High Voltage Interface NAND Gate NTE74265 IC-TTL, Quad Complementary Output Elements NTE7427 IC-TTL, Triple 3-Input Pos NOR Gate NTE74278 IC-TTL, 4-Bit Cascadable Priority Register w/Latched Data Inputs and Priority Output Gating NTE74279 IC-TTL, Quad Set-Reset Latch w/Diode-Clamped Inputs and Totem Pole Outputs NTE7428 IC-TTL, Quad 2-Input Pos NOR Buffer/Clock Driver w/Totem Pole Outputs NTE7430 IC-TTL, 8-Input Pos NAND Gate NTE7432 IC-TTL, Quad 2-Input OR Gate NTE7433 IC-TTL, Quad 2-Input NOR Buffer w/Open Collector Outputs NTE74298 IC-TTL, Quad 2-Input Multiplexer w/Storage NTE74365 IC-TTL, 3-State Hex Bus/Buffer Driver w/Non-Inverted Outputs NTE74366 IC-TTL, 3-State Hex Bus/Buffer Driver w/Inverted Outputs NTE74367 IC-TTL, Hex Bus/Buffer Driver w/Non-Inverted 3-State Outputs, Organized to Handle 4-Bit Data NTE74368 IC-TTL, Hex Bus/Buffer Driver w/Inverted 3-State Outputs, Organized to Handle 4-Bit Data NTE7437 IC-TTL, Quad 2-Input NAND Buffer NTE74376 IC-TTL, Quardruple J-K Flip-Flop NTE7438 IC-TTL, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE7439 IC-TTL, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE74390 IC-TTL, Dual 4-Bit Decade Ripple Counter NTE74393 IC-TTL, Dual 4-Bit Binary Ripple Counter NTE7440 IC-TTL, Dual 4-Input NAND Buffer NTE7441 IC-TTL, 1-of-10 Decoder Driver for Cold Cathode Indicator Tubes NTE7442 IC-TTL, 4-Line-to-10-Line BCD-to-Decimal Decoder NTE74426 IC-TTL, Quad Gate w/3-State Outputs and Active High Enabling NTE7443 IC-TTL, 4-Line-to-10-Line Excess-3-Decimal Decoder NTE7444 IC-TTL, 4-Line-to-10-Line Excess-3-Gray-to Decimal Decoder NTE7445 IC-TTL, BCD-to-Decimal Decoder/Driver NTE7446 IC-TTL, BCD-to-Seven-Segment Decoder/Driver w/Active Low, Open Collector Outputs NTE7423 IC-TTL, Expandable Dual 4-Input NOR Gate w/Strobe NTE74221 IC-TTL, Dual Monostable Multivibrator NTE74249 IC-TTL, BCD-to-Seven-Segment Decoder/driver w/Open Collector Outputs NTE7425 IC-TTL, Dual 4-Input Pos NOR Gate w/Strobe NTE7447 IC-TTL, BCD-to-Seven-Segment Decoder/Driver w/Active Low, Open Collector Outputs NTE7448 IC-TTL, BCD-to-Seven-Segment Decoder/Driver w/Internal Pull-Up Outputs NTE74490 IC-TTL, Dual BCD Decade Ripple Counter NTE7450 IC-TTL, Dual 2-Wide, 2-Input, AND/OR Invert Gate (One Gate Expandable) NTE7451 IC-TTL, Dual 2-Wide, 2-Input, AND/OR Gate Page 26-5 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE7453 IC-TTL, Expandable AND/OR Invert Gate NTE7454 IC-TTL, 4-Wide AND/OR Invert Gate NTE7460 IC-TTL, Dual 4-Input Expander NTE7470 IC-TTL, AND Gated J-K Pos Edge Triggered Flip-Flop w/Present and Clear NTE7472 IC-TTL, AND Gated J-K Master/Slave Flip-Flop w/Present and Clear NTE7473 IC-TTL, Dual J-K Flip-Flop w/Clear NTE7474 IC-TTL, Dual D-Type Pos Edge Triggered Flip-Flop w/Present and Clear NTE7475 IC-TTL, 4-Bit Bistable Latch NTE7476 IC-TTL, Dual J-K Flip-Flop w/Present and Clear NTE7480 IC-TTL, Gated Full Adder w/Complementary Inputs and Complementary Sum Outputs NTE7482 IC-TTL, 2-Bit Binary Full Adder NTE7483 IC-TTL, 4-Bit Binary Full Adder w/Fast Carry NTE7485 IC-TTL, 4-Bit Magnitude Comparator NTE7486 IC-TTL, Quad 2-Input Exclusive OR Gate NTE7489 IC-TTL, 64-Bit Read/Write Memory NTE7490 IC-TTL, Decade Counter (Divide by 2 and 5) NTE7491 IC-TTL, 8-Bit Shift Register w/Gated Serial INputs and Serial Outputs NTE7492 IC-TTL, Divide-by-Twelve Counter NTE7493A IC-TTL, 4-Bit Binary Counter (Divide by 2 and 8) NTE7495 IC-TTL, 4-Bit Parallel In/Parallel Out Shift Register NTE7496 IC-TTL, 5-Bit Shift Register w/Async Preset NTE7497 IC-TTL, Sychronous 6-Bit Binary Rate Multiplier NTE74C160 IC-CMOS, Synchronous 4-Bit Decade Counter with Direct Clear NTE74C161 IC-CMOS, Synchronous 4-Bit Binary Counter with Direct Clear NTE74C164 IC-CMOS, 8-Bit Parallel-Out Serial Shift Register with Async Clear NTE74C174 IC-CMOS, Hex D-Type Flip-Flop with Serial Rail Outputs and Common Direct Clear NTE74C173 IC-CMOS, 4-Bit D-Type Flip-Flop w/3-State Outputs NTE74C175 IC-CMOS, Quad D-Type Flip-Flop with Common Direct Clear and Complementary Outputs NTE74C192 IC-CMOS, Synchronous Up/Down BCD Counter (Dual Clock with Clear) Part Number Description NTE74C373 IC-CMOS, Octal D-Type Latch with 3-State Outputs and Common Output Control NTE74C901 IC-CMOS, Hex Inverting TTL Buffer NTE74C902 IC-CMOS, Hex Non-Inverting TTL Buffer NTE74C903 IC-CMOS, Hex Inverting DMOS Buffer NTE74C904 IC-CMOS, Hex Non-Inverting DMOS Buffer NTE74C922 IC-CMOS, 16-Key Keyboard Encoder with 3-State Output NTE74C923 IC-CMOS, 20 Key Keyboard Encoder with 3-State Output NTE74C925 IC-CMOS, 4-Digit Counter with Multiplexed Seven-Segment Output Driver NTE74H00 IC-TTL, High Speed, Quad 2-Input Pos NAND Gate NTE74H01 IC-TTL, High Speed, quad 2-Input Pos NAND Gate with Open Collector Outputs NTE74H04 IC-TTL, High Speed, Hex Inverter NTE74H05 IC-TTL, High Speed, Hex Inverter with Open Collector Outputs NTE74H101 IC-TTL, High Speed, AND OR Gate J-K Neg Edge Triggered Flip-Flop w/Present NTE74H102 IC-TTL, High Speed, AND Gated J-K Neg Edge Triggered Flip- Flop w/Clear & Reset NTE74H103 IC-TTL, High Speed, Dual J-K Neg Edge Triggered Flip-Flop w/Clears NTE74H106 IC-TTL, High Speed, Dual J-K Neg Edge Triggered Flip-Flop w/Present and Clear NTE74C374 IC-CMOS, Octal D-Type Flip-Flop w/3-State Outputs, Common Output Control and Common Clock NTE74H108 IC-TTL, High Speed, Dual J-K Neg Triggered Flip-Flop w/Presents, Common Clear & Common Clock NTE74H183 IC-TTL, High Speed Dual Carry/ Save Full Adder NTE74H21 IC-TTL, High Speed, Dual 4-Input AND Gate NTE74H22 IC-TTL, High Speed, Dual 4-Input NAND Gate with Open Collector Outputs NTE74H30 IC-TTL, High Speed, 8-Input Pos NAND Gate NTE74H40 IC-TTL, High Speed, Dual 4-Input NAND Buffer NTE74H50 IC-TTL, High Speed, Dual 2-Wide, 2-Input, AND/OR Invert Gate (One Gate Expandable) NTE74H51 IC-TTL, High Speed, Dual 2-Wide, 2-Input AND/OR Gate NTE74H52 IC-TTL, High Speed, Expandable 4-Wide AND/OR Gate NTE74H53 IC-TTL, High Speed, Expandable AND/OR Inver Gate NTE74H54 IC-TTL, High Speed, 4-Wide AND/OR Invert Gate NTE74H55 IC-TTL, High Speed, Expandable, 2-Wide, 4-Input AND/OR Invert Gate NTE74C193 IC-CMOS, Synchronous Up/Down Binary Counter (Dual Clock with Clear) NTE74C221 IC-CMOS, Dual Monostable Multivibrator NTE74C240 IC-CMOS, Octal Buffer/Line Driver/Receiver with 3-State Inverted Outputs NTE74C244 IC-CMOS, Octal Buffer/Line Driver/Receiver with 3-State Non- Inverted Outputs NTE74H61 IC-TTL, High Speed Triple 3-Input Expander NTE74H62 IC-TTL, High Speed 4-Wide AND/OR Expander NTE74H71 IC-TTL, High Speed AND Gated J-K Master/Slave Flip-Flop with Preset and Clear NTE74H60 IC-TTL, High Speed Dual 4-Input Expander NTE74H72 IC-TTL, High Speed, AND Gated Page 26-6 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE74H73 IC-TTL, High Speed, Dual J-K Flip-Flop w/Clear NTE74H74 IC-TTL, High Speed Dual D-Type Pos Edge Triggered Flip-Flop w/Present & Clear NTE74H76 IC-TTL, High Speed, Dual J-K Flip-Flop w/Present & Clear NTE74H78 IC-TTL, High Speed, Dual J-K Flip-Flop w/Present Common Clear & Common Clock NTE74H87 IC-TTL, High Speed, 4-Bit True/ Complement Zero/One Element NTE74HC00 IC-TTL, High Speed CMOS, QUAD 2-Input NAND Gate NTE74HC02 IC-TTL, High Speed CMOS, Quad 2-Input NOR Gate NTE74HC04 IC-TTL, High Speed CMOS, Hex Inverter NTE74HC08 IC-TTL, High Speed CMOS, Quad 2-Input AND Gate NTE74HC10 IC-TTL, High Speed CMOS, Triple 3-Input NAND Gate NTE74HC109 IC-TTL, High Speed CMOS, Dual J-K Flip-Flop w/Present & Clear NTE74HC11 IC-TTL, High Speed CMOS, Triple 3-Input AND Gate NTE74HC123 IC-TTL, High Speed CMOS, Dual Retriggerable Monostable Multivibrator NTE74HC125 IC-TTL, High Speed CMOS, TRI-STATE Quad Buffer NTE74HC126 IC-TTL, High Speed CMOS, TRI-STATE Quad Buffer NTE74HC132 IC-TTL, High Speed CMOS, Quad 2-Input NAND Schmitt Trigger NTE74HC138 IC-TTL, High Speed CMOS, 3-to-8-Line Decoder/ Demultiplexer NTE74HC139 IC-TTL, High Speed CMOS, Dual 2-to-4-line Decoder/ Demultiplexer NTE74HC14 IC-TTL, High Speed CMOS, Hex Schmitt Trigger Inverter NTE74HC151 IC-TTL, High Speed CMOS, 8-Channel Multiplexer NTE74HC153 IC-TTL, High Speed CMOS, Dual 4-Input, Multiplexer NTE74HC154 IC-TTL, High Speed CMOS, 4-to-16-Line Decoder/ Demultiplexer NTE74HC161 IC-TTL, High Speed CMOS, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74HC163 IC-TTL, High Speed CMOS, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74HC164 IC-TTL, High Speed CMOS, 8-Bit Serial-In/ Parallel-Out Shift Register NTE74HC165 IC-TTL, High Speed CMOS, Parallel-In/ Serial-Out 8-Bit Shift Register NTE74HC173 IC-TTL, High Speed CMOS, Tri-State Quad D-Type Flip-Flop Part Number Description NTE74HC273 IC-TTL, High Speed CMOS, Octal D-Type Flip-Flop w/ Clear NTE74HC299 IC-TTL, High Speed CMOS, 8-Bit TRI-STATE Universal Shift Register NTE74HC32 IC-TTL, High Speed CMOS, Quad 2-Input OR Gate. NTE74HC373 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HC374 IC-TTL, High Sped CMOS, TRI-STATE Octal D-Type Flip-Flop NTE74HC377 IC-TTL, High Speed CMOS, Octal D-Type Flip-Flop NTE74HC390 IC-TTL, High Speed CMOS, Dual 4-Bit Decade Counter NTE74HC393 IC-TTL, High Speed CMOS, Dual 4-Bit Binary Counter NTE74HC40105 IC-TTL, High Speed CMOS, 4-Bit x 16 Word FIFO Register NTE74HC4020 IC-TTL, High Speed CMOS, 14-Stage Binary Counter NTE74HC4040 IC-TTL, High Speed CMOS, 12-Stage Binary Counter NTE74HC4053 IC-TTL, High Speed CMOS, Triple 2-Channel Analog Multiplexer/Demultiplexer NTE74HC4060 IC-TTL, High Speed CMOS, 14-Stage Binary Counter/ Oscillator NTE74HC4067 IC-TTL, High Speed CMOS, 16-Channel/ Multiplexer/Demultiplexer NTE74HC574 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Edge Triggered Edge NTE74HC86 IC-TTL, High Speed CMOS, Quad 2-Input Exclusive OR Gate NTE74HCT00 IC-TTL, High Speed CMOS, Quad 2-Input NAND Gate NTE74HCT04 IC-TTL, High Speed CMOS, Hex Inverter NTE74HC573 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HCT08 IC-TTL, High Speed CMOS, Quad 2-Input AND Gate NTE74HCT138 IC-TTL, High Speed CMOS, 3-to-8-Line Decoder/ Demultiplexer NTE74HCT14 IC-TTL, High Speed CMOS, Hex Schmitt Trigger Inverter NTE74HCT161 IC-TTL, High Speed CMOS, 4-Bit Binary Counter w/Asynchronous Clear NTE74HCT163 IC-TTL, High Speed CMOS, 4-Bit Binary Counter w/Asynchronous Clear NTE74HCT174 IC-TTL, High Speed CMOS, Hex D-Type Flip-Flop w/ Clock and Clear NTE74HC175 IC-TTL, High Speed CMOS, Quad D-Type Flip-Flop w/Clear NTE74HC240 IC-TTL, High Speed CMOS, Inverting Octal TRI-STATE Buffer NTE74HC244 IC-TTL, High Speed CMOS, Octal TRI-STATE Buffer NTE74HC257 IC-TTL, High Speed CMOS, Quad 2-Channel TRI-STATE Multiplexer NTE74HC174 IC-TTL, High Speed CMOS, Hex D-Type Flip-Flops w/Clock & Clear NTE74HC259 IC-TTL, High Speed CMOS, 8-Bit Addressable Latch/3-to-8 Line Decoder NTE74HCT240 IC-TTL, High Speed CMOS, Inverting Octal TRI-STATE Buffer NTE74HCT244 IC-TTL, High Speed CMOS, Octal TRI-STATE Buffer NTE74HCT273 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Flip- Flop w/ Clear NTE74HCT32 IC-TTL, High Speed CMOS, Quad 2-Input OR Gate. NTE74HCT373 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HCT573 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Latch NTE74HCT574 IC-TTL, High Speed CMOS, TRI-STATE Octal D-Type Flip- Flop NTE74L93 IC-TTL, 4-Bit Counter (Divide by 2 & 8) Page 26-7 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) NTE74LS00 Quad 2-Input Pos NAND Gate NTE74LS01 IC-TTL, Low Power Schottky, Quad 2-Input Pos NAND Gate w/Open Collector Outputs NTE74LS02 IC-TTL, Low Power Schottky, Quad 2-Input Pos NOR Gate NTE74LS03 IC-TTL, Low Power Schottky, Quad 2-Input Pos NAND Gate w/Power Collector Outputs NTE74LS04 IC-TTL, Low Power Schottky, Hex Inverter NTE74LS05 IC-TTL, Low Power Schottky, Hex Inverter w/Open Collector Outputs NTE74LS06 IC-TTL, Low Power Schottky, Hex Inverter Buffer/Driver w/Open Collector HV Outputs NTE74LS08 IC-TTL, Low Power Schottky, Triple 3-Input Pos AND Gate NTE74LS09 IC-TTL, Low Power Schottky, Triple 3-Input Pos NAND Gate w/Open Collector Outputs NTE74LS124 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS125A IC-TTL, Low Power Schottky, Quad Bus w/3-State Outputs NTE74LS126A IC-TTL, Low Power Schottky, Quad Bus w/3-State Outputs Part Number Description NTE74LS10 IC-TTL, Low Power Schottky, Triple 3-Input Pos NAND Gate NTE74LS107 IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Clear NTE74LS109A IC-TTL, Low Power Schottky, Dual J-K Pos Edge Triggered Flip-Flop w/Clear & Present NTE74LS11 IC-TTL, Low Power Schottky, Triple 3-Input Pos AND Gate NTE74LS112A IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Present & Clear NTE74LS113 IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Present NTE74LS114 IC-TTL, Low Power Schottky, Dual J-K Neg Edge Triggered Flip-Flop w/Present Common Clock & Clear NTE74LS12 IC-TTL, Low Power Schottky, Triple 3-Input Pos NAND Gate w/Open Collector Outputs NTE74LS122 IC-TTL, Low Power Schottky, Retriggerable Monostable Multivibrator w/Clear NTE74LS123 IC-TTL, Low Power Schottky, Dual Retriggerable Monostable Multivibrator w/Clear Part Number Description NTE74LS140 IC-TTL, Ultra-High Speed, Dual 4-Input Pos NAND "W"50 Line Driver NTE74LS145 IC-TTL, Low Power Schottky, BCD-to-Decimal Decoder/ Drive For Lamps, Relays MOS NTE74LS147 IC-TTL, Low Power Schottky, 10-Line Decimal-to-4-Line BCD Priority Encoder NTE74LS148 IC-TTL, Low Power Schottky, 8-Line-to-3-Line Octal Priority Encoder NTE74LS15 IC-TTL, Low Power Schottky, Triple 3-Input AND Gate w/Open Collector Outputs NTE74LS151 IC-TTL, Low Power Schottky, 8-Channel Multiplexer NTE74LS153 IC-TTL, Low Power Schottky, Dual4-Line-to-1 Line Data Selector/ Multiplexer NTE74LS155 IC-TTL, Low Power Schottky, Dual 2-Line-to-4-Line Decoder/ Demultiplxer w/Totem Pole Outputs NTE74LS156 IC-TTL, Low Power Schottky, Dual 2-Line-to-4-Line Decoder/Demultiplexer w/Open Collector Outputs NTE74LS157 IC-TTL, Low Power Schottky, Quad 2-to1-Line Data Selector/Multiplexer w/Non-Inverted Date Outputs NTE74LS158 IC-TTL, Low Pwr Schottky, Quad 2-to-1- Line Data Selector/Multiplexer w/Inverted Data Outputs NTE74LS160A IC-TTL, Low Power Schottky, Synchronous 4-Bit Decade Counter w/Direct Clear NTE74LS161A IC-TTL, Low Power Schottky, Synchronous 4-Bit Binary Counter w/Direct Clear NTE74LS162A IC-TTL, Low Power Schottky, Synchronous 4-Bit Decade Counter w/ Synchronous Clear NTE74LS163 IC-TTL, Ultra-High Speed, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74LS163A IC-TTL, Low Power Schottky, Synchronous 4-Bit Binary Counter w/Synchronous Clear NTE74LS164 IC-TTL, Low Power Schottky, 8-Bit Parallel-Out Serial Shift Register w/Async Clear NTE74LS165 IC-TTL, Low Power Schottky, 8-Bit Parallel-In/Serial-Out Shift Register NTE74LS166 IC-TTL, Low Power Schottky, 8-Bit, Parallel-In/Serial-Out Shift Register NTE74LS168A IC-TTL, Low Power Schottky, Synchronous Presettable BCD NTE74LS13 IC-TTL, Low Power Schottky, Dual 4-Input NAND Schmitt Decade Up-Down Counter Trigger NTE74LS132 IC-TTL, Low Power Schottky, Quad 2-Input Pos NAND Schmitt Trigger NTE74LS133 IC-TTL, Low Power Schottky, 13-Input Pos NAND Gate NTE74LS136 IC-TTL, Low Power Schottky, Quad Exclusive OR Gate w/Open Collector Outputs NTE74LS138 IC-TTL, Low Power Schottky, 3-of-8 Decoder/Demultiplexer NTE74LS139 IC-TLL, Low Power Schottky, Dual 4-to-4 Line Decoder/ Demultiplexer NTE74LS14 IC-TTL, Low Power Schottky, Hex Schmitt Trigger Inverter NTE74LS169A IC-TTL, Low Power Schottky, Synchronous Presettable 4-Bit Binary Up/Down Counter NTE74LS170 IC-TTL , Low Power Schottky, 4-by-4 Register File w/Open Collector Output NTE74LS173A IC-TTL, Low Power Schottky, 4-Bit D-Type Flip-Flop w/3-State Outputs NTE74LS174 IC-TTL, Low Power Schottky, Hex D-Type Flip Flop w/3-State Outputs NTE74LS175 IC-TTL, Low Power Schottky, Hex D-Type Flip Flop w/Serial Rail Outputs & Common Direct Clear Page 26-8 Semiconductors Part Number Description Integrated Circuits (cont.) Integrated Circuits (cont.) IC-TTL, Schottky, 256-Bit (32 x 8) PROM w/Open Collector Outputs NTE74LS181 IC-TTL, Low Power Schottky, Quad D-Type Flip-Flop w/Common Direct Clear & Complementary Outputs NTE74LS182 IC-TTL, Ultra-High Speed, Lock-Ahead Carry Generator NTE74LS188 NTE74LS189 IC-TTL, Schottky, 64-Bit RAM w/3-State Outputs NTE74LS190 IC-TTL, Low Power Schottky, Arithmetic Logic Unit/ Function Generator NTE74LS191 IC-TTL, Low Power Schottky, Synchronous Up/Down BCD Counter NTE74LS192 IC-TTL, Low Power Schottky, Synchronous Up/ Down BCD Counter (Dual Clock w/Clear) NTE74LS193 IC-TTL, Low Power Schottky, Synchronous Up/ Down Binary Counter (Dual Clock w/Clear) NTE74LS194 IC-TTL, Low Power Schottky, 4-Bit BiDirectional Universal Shift Register NTE74LS194A IC-TTL, Low Power Schottky, 4-Bit BiDirectional Universal Shift Register NTE74LS195A IC-TTL, Low Power Schottky, 4-Bit Parallel Access Shift Register NTE74LS196 IC-TTL, Low Power Schottky, Presentable Decade Counter/Latch NTE74LS197 IC-TTL, Low Power Schottky, Presettable Modulo-16 Binary Counter/Latch NTE74LS20 IC-TTL, Low Power Schottky, Dual 4-Input NAND Gate NTE74LS21 IC-TTL, Low Power Schottky, Dual 4-Input AND Gate NTE74LS22 IC-TTL, Low Power Schottky, Dual 4-Input NAND Gate w/Open Collector Outputs NTE74LS221 IC-TTL, Low Power Schottky, Dual Monostable Multivibrator NTE74LS240 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver/Receiver w/3-State Inverted Outputs NTE74LS241 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver/Receiver w/3-State Non-Inverted Outputs NTE74LS242 IC-TTL, Low Power Schottky, Quad Bus Transceiver w/Inverted 3-State Outputs NTE74LS243 IC-TTL, Low Power Schottky, Quad Bus Transceiver w/Non- Inverted 3-State Outputs NTE74LS244 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver/Receiver w/3-State Non-Inverted Outputs NTE74LS245 IC-TTL, Low Power Schottky, Octal Bus Transceiver w/Non- Inverted 3-State Outputs Part Number Description NTE74LS253 IC-TTL, Low Power Schottky, Quad Data Selector/Multiplexer w/3-State Outputs NTE74LS257 IC-TTL, Low Power Schottky, Quad Data Selector/Multiplexer w/Non-Inverted 3-State Outputs NTE74LS258 IC-TTL, Low Power Schottky, Quad Data Selector/Multiplexer w/Non-Inverted 3-State Outputs NTE74LS259 IC-TTL, Low Power Schottky, 8-Bit Addressable Latch NTE74LS26 IC-TTL, Low Power Schottky, Quad 2-Input High Voltage Interface NAND Gate NTE74LS260 IC-TTL, Low Power Schottky, Dual 5-Input NOR Gate NTE74LS266 IC-TTL, Low Power Schottky, Quad 2-Input Exclusive NOR Gate w/Open Collector Outputs NTE74LS27 IC-TTL, Low Power Schottky, Triple 3-Input Positive NOR Gate NTE74LS273 IC-TTL, Low Power Schottky, Octal D-Type Flip-Flop w/Common Clock & Single Rail Outputs NTE74LS279 IC-TTL, Low Power Schottky, Quad Set-Reset Latch w/Diode- Clamped Inputs & Totem Pole Outputs NTE74LS28 IC-TTL, Low Power Schottky, Quad 2-Input NOR Buffer/Clock Driver w/ Totem Pole Outputs NTE74LS280 IC-TTL, Low Power Schottky, 9-Bit Odd/ Even Parity Generator/Checker (N-Bit Cascadable) NTE74LS283 IC-TTL, Low Power Schottky, 4-Bit Binary Full Adder NTE74LS287 IC-TTL, Schottky, Bipolar 1024-Bit PROM, 50ns Max Addressable Access NTE74LS288 IC-TTL, Schottky, 256-Bit (32 x 8) PROM w/TRI-STATE Outputs NTE74LS290 IC-TTL,Low Power Schottky,Decade Counter(Divide by 2 & 5) NTE74LS293 IC-TTL, Low Power Schottky, 4-Bit Binary Counter (Divide by 2 & 5) NTE74LS295 IC-TTL, Low Power Schottky, 4-Bit Bidirectional Universal Shift Register NTE74LS295A IC-TTL, Low Power Schottky, 4-Bit Bidirectional Universal Shift Register NTE74LS298 IC-TTL, Low Power Schottky, Quad 2-Input Multiplexer w/Storage NTE74LS299 IC-TTL, Low Power Schottky, 8-Bit Shift Register w/3-State Outputs NTE74LS30 IC-TTL, Low Power, Schottky, 8-Input Pos NAND Gate. NTE74LS32 IC-TTL, Low Power Schottky, Quad 2-Input OR Gate. NTE74LS324 IC-TTL, Low Power Schottky, Voltage Controlled Oscillator NTE74LS247 IC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/3-State Non-Inverted Outputs NTE74LS248 lC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/International Pull-Up Outputs NTE74LS249 lC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/Open Collector Outputs NTE74LS251 IC-TTL, Low Power Schottky, Data Selector/Multiplexer w/True & Inverted 3-State Outputs NTE74LS327 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS33 IC-TTL, Low Power Schottky, Quad 2-Input NOR Buffer/Clock w/Open Collector Outputs NTE74LS348 IC-TTL, Low Power Schottky, 8-Line-to-3-Line Priority Encoder NTE74LS352 IC-TTL, Low Power Schottky, Dual 4-Line-to-1-Line Data Selector/Multiplexer (Inverting Version of NTE74LS153) Page 26-9 Semiconductors Integrated Circuits (cont.) Integrated Circuits (cont.) Part Number Description NTE74LS365A IC-TTL, Low Power Schottky, 3-State Hex Bus/Buffer w/Non- Inverted Outputs NTE74LS366A IC-TTL, Low Power Schottky, 3-State Hex Bus/Buffer Drive w/Inverted Outputs NTE74LS367 IC-TTL, Low Power Schottky, Hex Bus/Buffer Driver w/Non- Inverted 3-State Outputs, Organize to Handle 4-Bit Data NTE74LS368 IC-TTL, Low Power Schottky, Hex Bus/Buffer Driver w/Inverted 3-State Outputs, Organize to Handle 4-Bit Data NTE74LS37 IC-TTL, Low Power Schottky, Quad 2-Input NAND Buffer NTE74LS373 IC-TTL, Low Power Schottky, Octal D-Type Latch w/3-State Outputs & Common Output Control NTE74LS374 IC-TTL, Low Power Schottky, Octal D-Type Flip-Flop w/3-State Outputs, Common Output Control & Common Clock NTE74LS377 IC-TTL, Low Power Schottky, Octal D-Type Flip-Flop w/Common Enable w/Clock & Single Rail Outputs NTE74LS378 IC-TTL, Low Power Schottky, Hex D-Type Flip-Flop w/Clock Enable NTE74LS379 IC-TTL, Low Power Schottky, Quad D-Type Flip-Flop NTE74LS38 IC-TTL, Low Power Schottky, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE74LS386 IC-TTL, Low Power Schottky, Quad 2-Input Exclusive OR Gate NTE74LS387 IC-TTL, Schottky, 1024-Bit (256 x 4) PROM w/Open Collector Outputs, 50ns Max Address Access NTE74LS390 IC-TTL, Low Power Schottky, Dual 4-Bit Decade Ripple Counter NTE74LS393 IC-TTL, Low Power Schottky, Dual 4-Bit Binary Ripple Counter NTE74LS395A IC-TTL, Low Power Schottky, 4-Bit Cascadable Shift Register w/3-State Outputs NTE74LS396 IC-TTL, Low Power Schottky, Octal Storage Register w/Parallel Access NTE74LS398 IC-TTL, Low Power Schottky, Quad 2-Port Register NTE74LS399 IC-TTL, Low Power Schottky, Quad 2-Input Multiplexer w/Storage NTE74LS40 IC-TTL, Low Power Schottky, Dual 4-Input NAND Buffer NTE74LS42 IC-TTL, Low Power Schottky, 4-Line-to-10-Line BCD-to- Decimal Decoder Part Number Description NTE74LS49 IC-TTL, Low Power Schottky, BCD-to-Seven -Segment Decoder/ Driver w/Open Collector Outputs NTE74LS490 IC-TTL, Low Power Schottky, Dual BCD Decade Ripple Counter NTE74LS51 IC-TTL, Low Pwr Schottky, Dual 2-Wide2-Input AND/OR Gate. NTE74LS54 IC-TTL, Low Power Schottky, 4-Wide AND/OR Invert Gate. NTE74LS540 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver w/Inverted 3-State Outputs NTE74LS541 IC-TTL, Low Power Schottky, Octal Buffer/Line Driver w/Non- Inverted 3-State Outputs NTE74LS55 IC-TTL, Low Power Schottky, Expandable 2-Wide 4-Input AND/OR Invert Gate NTE74LS570 IC-TTL, Schottky, 2048-Bit PROM w/Open Collector Outputs NTE74LS571 IC-TTL, Schottky, 2048-Bit PROM w/3-State Outputs NTE74LS572 IC-TTL, Schottky, 4096-Bit PROM w/Open Collector Outputs NTE74LS624 IC-TTL, Low Power Schottky, Voltage Controlled Oscillator NTE74LS625 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS627 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS629 IC-TTL, Low Power Schottky, Dual Voltage Controlled Oscillator NTE74LS63 IC-TTL, Low Power Schottky, Hex Current-Sensing Interface Gate NTE74LS640 IC-TTL, Low Power Schottky, Inverting Octal Bus Transceiver w/3-State Outputs NTE74LS641 IC-TTL, Low Power Schottky, Non-Inverting, Octal Bus Transceiver w/Open Collector Outputs NTE74LS642 IC-TTL, Low Power Schottky, Inverting Octal Bus Transceiver w/Open Collector Outputs NTE74LS643 IC-TTL, Low Power Schottky, True & Inverting Octal Bus Transceiver w/3-State Outputs NTE74LS645 IC-TTL, Low Power Schottky, Non-Inverting, Octal Bus Transceiver w/3-State Outputs NTE74LS670 IC-TTL, Low Power Schottky, 4-By-4-Register File w/Simultaneous Read/Write, 3-State Outputs & Expandable to 1024 Words NTE74LS353 IC-TTL, Low Power Schottky, Dual 4-Line-to-1-Line Data Selector/Multiplexer NTE74LS363 IC-TTL, Low Power Schottky, Octal Transparent Latch w/3- State Outputs NTE74LS445 IC-TTL, Low Power Schottky, BCD-to-Decimal Decoder/Driver w/Open Collector Outputs NTE74LS47 IC-TTL, Low Power Schottky, BCD-to-Seven Segment Decoder/Driver w/Active Low, Open Collector Outputs NTE74LS472 IC-TTL, Schottky, 4096-Bit (512 x 8) PROM w/3-State Outputs NTE74LS474 IC-TTL, Schottky, 4096-Bit (512 x 8) PROM w/3-State Outputs NTE74LS48 IC-TTL, Low Power Schottky, BCD-to-Seven-Segment Decoder/Driver w/International Pull-Up Outputs NTE74LS73 IC-TTL, Low Power Schottky, Dual J-K-Flip-Flop w/Clear NTE74LS74A IC-TTL, Low Power Schottky, Dual D-Type Pos Edge Triggered Flip-Flip w/Present & Clear NTE74LS75 IC-TTL, Low Power Schottky, 4-Bit Bistable Latch NTE74LS76A IC-TTL, Low Power Schottky, Dual J-K-Flip w/Present & Clear NTE74LS77 IC-TTL, Low Power Schottky, 4-Bit D-Type Latch NTE74LS78 IC-TTL, Low Power Schottky, Dual J-K Flip-Flop w/Present, Common Clear & Common Clock NTE74LS83A IC-TTL, Low Power Schottky, 4-Bit Binary Full Adder w/Fast Carry NTE74LS85 IC-TTL, Low Power Schottky, 4-Bit Magnitude Comparator Page 26-10 Semiconductors Part Number Description NTE74LS86 IC-TTL, Low Power Schottky, Quad 2-Input Exclusive OR Gate NTE74LS90 IC-TTL, Low Power Schottky, Decade Counter (Divide by 2&5) NTE74LS91 IC-TTL, Low Power Schottky, 8-Bit Shift Register w/Gated Serial Inputs & Serial Outputs NTE74LS92 IC-TTL, Low Power Schottky, Divide - by - Twelve Counter NTE74LS93 IC-TTL, Low Power Schottky, 4-Bit Binary Counter (Divide by 2 & 8) Integrated Circuits (cont.) Integrated Circuits (cont.) NTE74LS95B IC-TTL, Low Power Schottky, 4-Bit Shift Register NTE74S00 IC-TTL, Ultra-High Speed, Quad 2-Input Pos NAND Gate NTE74S02 IC-TTL, Ultra-High Speed, Quad 2-Input Pos NOR Gate NTE74S03 IC-TTL, Ultra-High Speed, Quad 2-Input Pos NAND Gate w/Open Collector Ouputs NTE74S04 IC-TTL, Ultra-High Speed, Hex Inverter NTE74S05 IC-TTL, Ultra-High Speed, Hex Inverter NTE74S08 IC-TTL, Ultra-High Speed, Quad 2-Input Pos AND Gate NTE74S09 IC-TTL, Ultra-High Speed, Quad 2-Input Pos AND Gate w/Collector Outputs NTE74S10 IC-TTL, Ultra-High Speed, Triple 3-Input Pos NAND Gate NTE74S11 IC-TTL, Ultra-High Speed, Triple 3-Input Pos AND Gate NTE74S112 IC-TTL, Ultra-High Speed, Dual J-K Neg Edge Triggered Flip- Flop w/Present & Clear Part Number Description NTE74S74 IC-TTL, Ultra-High Speed, Dual D-Type Pos Edge Triggered Flip-Flop w/Present & Clear NTE74S85 IC-TTL, Ultra-High Speed, 4-Bit Magnitude Comparator NTE74S86 IC-TTL, Ultra-High Speed, Quad 2-Input Exclusive OR Gate NTE75188 IC-TTL, DTL Quad Line Driver RS232C NTE75189 IC-TTL, DTL Quad Line Driver RS232C NTE74S51 IC-TTL, Ultra-High Speed, Dual 2-Wide 2-Input AND/OR Gate NTE74S64 IC-TTL, Ultra-High Speed, 4-2-3-2 Input AND/OR Invert Gate w/Totem Pole Ouputs NTE74S65 IC-TTL, Ultra-High Speed, 4-2-3-2 Input AND/OR Invert Gate w/Open Collector Outputs NTE75450B IC-TTL, Dual Peripheral AND Driver NTE75451B IC-TTL, Dual Peripheral AND Driver NTE75454B IC-TTL, Dual Peripheral NOR Driver NTE75491B IC-TTL, 4-Segment MOS TO LED Anode Driver NTE75492B IC-TTL, 6-Digit MOS to LED Cathode Driver NTE75493 IC-TTL, 4-Segment MOS to LED Anode Driver NTE75494 IC-TTL, 6-Digit MOS to LED Cathode Driver NTE74S40 IC-TTL, Ultra-High Speed, Dual 4-Input NAND Buffer Transient Suppressors Part Number Description NTE4900 Overvoltage Transient Suppressor, Vr =5.0V NTE4901 Overvoltage Transient Suppressor, Bi-Directional Vr =5.0V NTE4902 Overvoltage Transient Suppressor, Vr =5.8V NTE4903 Overvoltage Transient Suppressor, Bi-Directional Vr =5.50V NTE4904 Overvoltage Transient Suppressor, Vr =6.40V NTE4905 Overvoltage Transient Suppressor, Bi-Directional Vr =6.40V NTE4906 Overvoltage Transient Suppressor, Vr =7.02V NTE4907 Overvoltage Transient Suppressor, Bi-Directional Vr =7.02V NTE4910 Overvoltage Transient Suppressor, Vr =8.55V NTE4911 Overvoltage Transient Suppressor, Bi-Directional Vr =8.55V NTE4914 Overvoltage Transient Suppressor, Vr =10.20V NTE4915 Overvoltage Transient Suppressor, Bi-Directional Vr =10.20V NTE4918 Overvoltage Transient Suppressor, Vr =11.1V NTE4919 Overvoltage Transient Suppressor, Bi-Directional Vr =11.1V NTE4920 Overvoltage Transient Suppressor, Vr =12.80V NTE4921 Overvoltage Transient Suppressor, Bi-Directional Vr =12.80V NTE74S113 IC-TTL, Ultra-High Speed, Dual J-K Neg Edge Triggered Flip- Flop w/Present NTE4922 Overvoltage Transient Suppressor, Vr =13.60V NTE4923 Overvoltage Transient Suppressor, Bi-Directional Vr =13.60V NTE4926 Overvoltage Transient Suppressor, Vr =15.3V NTE4927 Overvoltage Transient Suppressor, Bi-Directional Vr =15.3V NTE4929 Overvoltage Transient Suppressor, Bi-Directional Vr =17.1V NTE4933 Overvoltage Transient Suppressor, Bi-Directional Vr =20.50V NTE4934 Overvoltage Transient Suppressor, Vr =23.1V NTE4935 Overvoltage Transient Suppressor, Bi-Directional Vr =23.1V NTE4936 Overvoltage Transient Suppressor, Vr =25.60V NTE4932 Overvoltage Transient Suppressor, Vr=20.50V NTE4937 Overvoltage Transient Suppressor, Bi-Directional Vr =25.60V NTE4938 Overvoltage Transient Suppressor, Vr =28.20V NTE4939 Overvoltage Transient Suppressor, Bi-Directional Vr =28.20V NTE4940 Overvoltage Transient Suppressor, Vr =30.80V NTE4944 Overvoltage Transient Suppressor, Vr =36.80V NTE4941 Overvoltage Transient Suppressor, Bi-Directional Vr =30.80V NTE4942 Overvoltage Transient Suppressor, Vr =33.30V NTE4943 Overvoltage Transient Suppressor, Bi-Directional Vr =33.30V NTE4928 Overvoltage Transient Suppressor, Vr =17.1V NTE74S114 IC-TTL, Ultra-High Speed, Dual J-K Neg Edge Triggered Flip- Flop w/Present, Common Clock & Clear NTE74S15 IC-TTL, Ultra-High Speed, Triple 3-Input And Gate w/Open Collector Outputs NTE74S20 IC-TTL, Ultra-High Speed, Dual 4-Input NAND Gate NTE74S22 IC-TTL, Ultra-High Speed, Dual 4-Input NAND Gate w/Open Collector Outputs NTE74S30 IC-TTL, Ultra-High Speed, 8-Input Pos NAND Gate NTE74S37 IC-TTL, Ultra-High Speed, Quad 2-Input NAND Buffer NTE74S38 IC-TTL, Ultra-High Speed, Quad 2-Input NAND Buffer w/Open Collector Outputs NTE75452B IC-TTL, Dual Peripheral NAND Driver NTE75453B IC-TTL, Dual Peripheral OR Driver Page 26-11 Semiconductors Part Number Description NTE4945 Overvoltage Transient Suppressor, Bi-Directional Vr =36.80V NTE4946 Overvoltage Transient Suppressor, Vr =40.2V NTE4947 Overvoltage Transient Suppressor, Bi-Directional Vr =40.20V NTE4950 Overvoltage Transient Suppressor, Vr =43.6V NTE4951 Overvoltage Transient Suppressor, Bi-Directional Vr =43.6V NTE4952 Overvoltage Transient Suppressor, Vr =47.80V NTE4953 Overvoltage Transient Suppressor, Bi-Directional Vr =47.80V NTE4954 Overvoltage Transient Suppressor, Vr =53V NTE4955 Overvoltage Transient Suppressor, Bi-Directional Vr =53V NTE4958 Overvoltage Transient Suppressor, Vr =58.1V NTE4960 Overvoltage Transient Suppressor, Vr =64.10V NTE4961 Overvoltage Transient Suppressor, Bi-Directional Vr =64.10V Part Number Description NTE4959 Overvoltage Transient Suppressor, Bi-Directional Vr =58.1V NTE4979 Overvoltage Transient Suppressor,Bi-Directional Vr =145.00V NTE4980 Overvoltage Transient Suppressor, Vr =154.00V NTE4981 Overvoltage Transient Suppressor,Bi-Directional Vr =154.00V NTE4982 Overvoltage Transient Suppressor, Vr =185.00V NTE4983 Overvoltage Transient Suppressor,Bi-Directional Vr =185.00V NTE4984 Overvoltage Transient Suppressor, Vr =214.00V NTE4985 Overvoltage Transient Suppressor,Bi-Directional Vr =214.00V NTE4988 Overvoltage Transient Suppressor, Vr =171V NTE4989 Overvoltage Transient Suppressor,Bi-Directional Vr =171V NTE4990 Overvoltage Transient Suppressor, Vr =256.00V NTE4991 Overvoltage Transient Suppressor,Bi-Directional Vr =256.00V NTE4992 NTE4993 Overvoltage Transient Suppressor,Bi-Directional Vr =273.00V NTE4994 Overvoltage Transient Suppressor, Vr =300V NTE4962 Overvoltage Transient Suppressor, Vr =70.10V NTE4963 Overvoltage Transient Suppressor, Bi-Directional Vr =70.10V NTE4964 Overvoltage Transient Suppressor, Vr =77.80V NTE4965 Overvoltage Transient Suppressor, Bi-Directional Vr =77.80V NTE4966 Overvoltage Transient Suppressor, Vr =85.80V NTE4967 Overvoltage Transient Suppressor, Bi-Directional Vr =85.50V NTE4968 Overvoltage Transient Suppressor, Vr =94.00V NTE4969 Overvoltage Transient Suppressor, Bi-Directional Vr =94.00V NTE4970 Overvoltage Transient Suppressor, Vr =102.00V NTE4971 Overvoltage Transient Suppressor, Bi-Directional Vr =102.00V NTE4972 Overvoltage Transient Suppressor, Vr =111.00V NTE4973 Overvoltage Transient Suppressor, Bi-Directional Vr =111.00V NTE4995 Overvoltage Transient Suppressor,Bi-Directional Vr =300V NTE4996 Overvoltage Transient Suppressor, Vr =342.00V NTE4997 Overvoltage Transient Suppressor,Bi-Directional Vr =342.00V NTE4998 Overvoltage Transient Suppressor, Vr =376.00V NTE4999 Overvoltage Transient Suppressor,Bi-Directional Vr =376.00V NTE4976 Overvoltage Transient Suppressor, Vr =136.00V NTE4977 Overvoltage Transient Suppressor,Bi-Directional Vr =136.00V NTE4974 Overvoltage Transient Suppressor, Vr =121.00V NTE4975 Overvoltage Transient Suppressor,Bi-Directional Vr =128.00V NTE4978 Overvoltage Transient Suppressor, Vr =145.00V Transient Suppressors (cont.) Transient Suppressors (cont.) NTE5000A Zener Diode, 2.4V, 1/2W, 5% Tol NTE5001A Zener Diode, 2.5V, 1/2W, 5% Tol NTE5002A Zener Diode, 2.7V, 1/2W, 5% Tol NTE5003A Zener Diode, 2.8V, 1/2W, 5% Tol NTE5004A Zener Diode, 3.0V, 1/2W, 5% Tol NTE5005SM Zener Diode, 3.3V, 300mW, 5% Tol, Surface Mount NTE5007A Zener Diode, 3.9V, 1/2W, 5% Tol NTE5005A NTE5007SM Zener Diode, 3.3V, 1/2W, 5% Tol Zener Diode, 3.9V, 300mW, 5% Tol, Surface Mount NTE5008A Zener Diode, 4.3V, 1/2W, 5% Tol NTE5008SM Zener Diode, 4.3V, 300mW, 5% Tol, Surface Mount NTE5009A Zener Diode, 4.7V, 1/2W, 5% Tol NTE5009SM Zener Diode, 4.7V, 300mW, 5% Tol, Surface Mount NTE5010A Zener Diode, 5.1V, 1/2W, 5% Tol NTE5010SM Zener Diode, 5.1V, 300mW, 5% Tol, Surface Mount NTE5010T1 Zener Diode, 5.1V, 1/2W, 1% Tol NTE5011A Zener Diode, 5.6V, 1/2W, 5% Tol NTE5011SM Zener Diode, 5.6V, 300mW, 5% Tol, Surface Mount NTE5011T1 Zener Diode, 5.6V, 1/2W, 1% Tol NTE5012A Zener Diode, 6.0V, 1/2W, 5% Tol NTE5013SM Zener Diode, 6.2V, 300mW, 5% Tol, Surface Mount NTE5013A Zener Diode, 6.2V, 1/2W, 5% Tol NTE5013T1 Zener Diode, 6.2V, 1/2W, 1% Tol NTE5014A Zener Diode, 6.8V, 1/2W, 5% Tol NTE5014SM Zener Diode, 6.8V, 300mW, 5% Tol, Surface Mount NTE5015A Zener Diode, 7.5V, 1/2W, 5% Tol Part Number Description Zener Diodes Overvoltage Transient Suppressor, Vr =273.00V Page 26-12 Semiconductors 2.4 5000A 5061A - - - 2.5 5001A 5062A - - - 2.7 5002A 5063A - - - 2.8 5003A 5064A - - - 3.0 5004A 5065A - - - 3.3 5005A 5066A 5111A - - 3.6 5006A 134A 5112A - - 3.9 5007A 5067A 5113A 5174A 5240A 4.3 5008A 5068A 5114A 5175A 5241A 4.7 5009A 5069A 5115A 5176A 5242A 5.1 5010A 135A 5116A 5177A 5243A 5.6 5011A 136A 5117A 5178A 5244A 6.0 5012A 5070A 5118A 5179A 5245A 6.2 5013A 137A 5119A 5180A 5246A 6.8 5014A 5071A 5120A 5181A 5247A 7.5 5015A 138A 5121A 5182A 5248A 8.2 5016A 5072A 5122A 5183A 5249A 8.7 5017A 5073A 5123A 5184A 5250A 9.1 5018A 139A 5124A 5185A 5251A 10.0 5019A 140A 5125A 5186A 5252A 11.0 5020A 5074A 5126A 5187A 5253A 11.5 - 141A - - - Zener Diodes (cont.) Rated Voltage ±5% PD NTE Number Axial Leads 1/2 Watt 1 Watt 5 Watt 10 Watt 50 Watt NTE Number Stud Mount Package Type Package Style DO35 DO41/DO15 DO4 DO5 Page 26-13 Semiconductors 12.0 5021A 142A 5127A 5188A 5254A 13.0 5022A 143A 5128A 5189A 5255A 14.0 5023A 144A 5129A 5190A 5256A 15.0 5024A 145A 5130A 5191A 5257A 16.0 5025A 5075A 5131A 5192A 5258A 17.0 5026A 5076A 5132A 5193A 5259A 18.0 5027A 5077A 5133A 5194A 5260A 19.0 5028A 5078A 5134A 5195A 5261A 20.0 5029A 5079A 5135A 5196A 5262A 22.0 5030A 5080A 5136A 5197A 5263A 24.0 5031A 5081A 5137A 5198A 5264A 25.0 5032A 5082A 5138A 5199A 5265A 27.0 5033A 146A 5139A 5200A 5266A 28.0 5034A 5083A 5140A 5201A 5267A 30.0 5035A 5084A 5141A 5202A 5268A 33.0 5036A 147A 5142A 5203A 5269A 36.0 5037A 5085A 5143A 5204A 5270A 39.0 5038A 5086A 5144A 5205A 5271A 43.0 5039A 5087A 5145A 5206A 5272A 45.0 - - - 5207A 5273A 47 5040A 5088A 5146A 5208A 5274A 50.0 - - - 5209A 5275A 51.0 5041A 5089A 5147A 5210A 5276A Zener Diodes (cont.) Rated Voltage ±5% PD NTE Number Axial Leads 1/2 Watt 1 Watt 5 Watt 10 Watt 50 Watt NTE Number Stud Mount Package Type Package Style DO35 DO41/DO15 DO4 DO5 Page 26-14 Semiconductors 52.0 - - - 5211A 5277A 55.0 - 148A - - - 56.0 5042A 5090A 5148A 5212A 5278A 60.0 5043A 5091A 5149A 5213A 5279A 62.0 5044A 149A 5150A 5214A 5280A 68.0 5045A 5092A 5151A 5215A 5281A 75.0 5046A 5093A 5152A 5216A 5282A 82.0 5047A 150A 5153A 5217A 5283A 87.0 5048A 5094A 5154A 5218A - 91.0 5049A 5095A 5155A 5219A 5284A 100.0 5050A 5096A 5156A 5220A 5285A 105.0 - - - 5221A 5286A 110.0 5051A 151A 5157A 5222A 5287A 120.0 5052A 5097A 5158A 5223A 5288A 130.0 5053A 5098A 5159A 5224A 5289A 140.0 5054A 5099A 5160A 5225A 5290A 150.0 5055A 5100A 5161A 5226A 5291A 160.0 5056A 5101A 5162A 5227A 5292A 170.0 5057A 5102A 5163A 5228A - 175.0 - - - 5229A 5293A 180.0 5058A 5103A 5164A 5230A 5294A 190.0 5059A 5104A 5165A 5231A 5295A 200.0 5060A 5105A 5166A 5232A 5296A Zener Diodes (cont.) Rated Voltage ±5% PD NTE Number Axial Leads 1/2 Watt 1 Watt 5 Watt 10 Watt 50 Watt NTE Number Stud Mount Package Type Package Style DO35 DO41/DO15 DO4 DO5 Page 26-15 Semiconductors Part Number Case Style Description NTE1961 TO220 (Isol) IC-Vltg Reg, Neg, -5V, 1A, Isol Tab NTE1913 TO3 IC-Vltg Reg, Neg, -5V, 1.5A NTE1917 TO92 IC-Vltg Reg, Neg, -5V, 100mA NTE963 TO220 IC-Vltg Reg, Neg, -6V, 1A NTE1963 TO220 (Isol) IC-Vltg Reg, Neg, -6V, 1A, Isol Tab NTE965 TO220 IC-Vltg Reg, Neg, -8V, 1A NTE961 TO220 IC-Vltg Reg, Neg, -5V, 1A Part Number Case Style Description NTE309K TO3 IC-Vltg Reg, Pos, 5V, 1A NTE 1934 TO3P IC-Vltg Reg, Pos, 5V, 2A NTE1934X TO3P IC-Vltg Reg, Pos, 5V, 2A NTE931 TO3 IC-Vltg Reg, Pos 5V, 3A NTE932 TO3 IC-Vltg Reg, Pos 5V, 5A NTE960 TO220 IC-Vltg Reg, Pos, 5V, 1A NTE 1960 TO220 (Isol) IC-Vltg Reg, Pos, 5V, 1A, Isol Tab NTE977 TO92 IC-Vltg Reg, Pos, 5V, 100mA NTE 1962 TO220 (Isol) IC-Vltg Reg, Pos, 6V, 1A, Isol Tab NTE988 TO92 IC-Vltg Reg, Pos, 6.2V, 100mA NTE964 TO220 IC-Vltg Reg, Pos, 8V, 1A NTE1964 TO220 (isol) IC-Vltg Reg, Pos, 8V, 1A, Isol Tab NTE981 TO92 IC-Vltg Reg, Pos, 8V, 100mA NTE1902 TO92 IC-Vltg Reg, Pos, 9V, 100mA NTE1910 TO220 IC-Vltg Reg, Pos, 9V, 1A NTE 1966 TO220 (Isol) IC-Vltg Reg, Pos, 9V, 1A, Isol Tab NTE1932 TO220 IC-Vltg Reg, Pos, 10V, 1A NTE 1968 TO220 (Isol) IC0Vltg Reg, Pos, 10V, 1A, Isol Tab NTE933 TO3 IC-Vltg Reg, Pos 12V, 5A NTE1912 TO3 IC-Vltg Reg, Pos, 12V, 3A NTE1914 TO3 IC-Vltg Reg, Pos, 12V, 1.5A NTE1936 TO3P IC-Vltg Reg, Pos, 12V, 2A NTE950 TO92 IC-Vltg Reg, Pos, 12V, 100mA NTE966 TO220 IC-Vltg Reg, Pos, 12V, 1A Voltage Regulators Positive, 3 terminal, arranged by output voltage TO3 TO3P TO220 TO220(Isol) TO92 Positive, 3 terminal, arranged by output voltage (cont.) Negative, 3 terminal, arranged by output voltage Part Number Case Style Description NTE1970 TO220 (Isol) IC-Vltg Reg, Pos, 12V, 1A, Isol Tab NTE951 TO92 IC-Vltg Reg, Pos, 15V, 100mA NTE968 TO220 IC-Vltg Reg, Pos, 15V, 1A NTE1972 TO220 (Isol) IC-Vltg Reg, Pos, 15V, 1A, Isol Tab NTE1938 TO3P IC-Vltg Reg, Pos, 15V, 2A NTE1920 TO3 IC-Vltg Reg, Pos, 18V, 3A NTE958 TO220 IC-Vltg Reg, Pos, 18V, 1A NTE1974 TO220 (Isol) IC-Vltg Reg, Pos, 18V, 1A, Isol Tab NTE1906 TO92 IC-Vltg Reg, Pos, 18V, 100mA NTE1924 TO3 IC-Vltg Reg, Pos, 24V, 1.5A NTE972 TO220 IC-Vltg Reg, Pos, 24V, 1A NTE1976 TO220 (Isol) IC-Vltg Reg, Pos, 24V, 1A, Isol Tab NTE1908 TO92 IC-Vltg, Pos, 24V, 100mA NTE1940 TO3P IC-Vltg, Pos, 24V, 2A IC-Vltg Page 26-16 Semiconductors Part Number Case Style Description NTE935 TO3 IC-Vltg Reg, Pos Adj., 1.2V to 32V, 5A NTE970 TO3 IC-Vltg Reg, Pos Adj., 1.2V to 33V, 3A NTE956 TO220 IC-Vltg Reg, Pos Adj., 1.2V to 37V, 1.5A NTE1900 TO92 IC-Vltg Reg, Pos Adj., 1.2V to 37V, 100mA NTE1942 TO220 IC-Vltg Reg, Pos Adj., 2.85V to 36V, 2A NTE1928 8-Lead Metal Can IC-Vltg Reg, Pos Adj., 4.5 V to 40 V, 45mA NTE953 4-Lead Power Tab IC-Vltg Reg, Pos Adj., 4-Terminal, 7.5V to 40V, 1A Part Number Case Style Description NTE1951 TO220 IC-Vltg Reg, Pos, 5V, 1A, Low Dropout NTE1952 TO220 IC-Vltg Reg, Pos, 8V, 1A, Low Dropout NTE1953 TO220 IC-Vltg Reg, Pos, 10V, 1A, Low Dropout NTE1954 TO220 IC-Vltg Reg, Pos, 12V, 1A, Low Dropout NTE1955 TO220 IC-Vltg Reg, Pos, 15V, 1A, Low Dropout Part Number Case Style Description NTE1965 TO220 (Isol) IC-Vltg Reg, Neg, -8V, 1A, Isol Tab NTE1967 TO220 (Isol) IC-Vltg Reg, Neg, -9V, 1A, Isol Tab NTE967 TO220 IC-Vltg Reg, Neg, -12V, 1A NTE1971 TO220 (Isol) IC-Vltg Reg, Neg, -12V, 1A, Isol Tab NTE1903 TO92 IC-Vltg Reg, Neg, -12V, 100mA NTE1915 TO3 IC-Vltg Reg, Neg, -12V, 1.5A NTE969 TO220 IC-Vltg Reg, Neg, -15V, 1A NTE1973 TO220 (Isol) IC-Vltg Reg, Neg, -15V, 1A, Isol Tab NTE1905 TO92 IC-Vltg Reg, Neg, -15V, 100mA NTE1919 TO3 IC-Vltg Reg, Neg, -15V, 1.5A NTE959 TO220 IC-Vltg Reg, Neg, -18V, 1A NTE1975 TO220 (Isol) IC-Vltg Reg, Neg, -18V, 1A, Isol Tab NTE1907 TO92 IC-Vltg Reg, Neg,-18V, 100mA NTE1923 TO3 IC-Vltg Reg, Neg, -18V, 100mA NTE971 TO220 IC-Vltg Reg, Neg, -24V, 1A NTE1977 TO220 (Isol) IC-Vltg Reg, Neg, -24V, 1A, Isol Tab NTE1909 TO92 IC-Vltg Reg, Neg, -24V, 100mA NTE1925 TO3 IC-Vltg Reg, Neg, -24V, 1.5A Voltage Regulators (cont.) Negative, 3 terminal, arranged by output voltage (cont.) Positive, low dropout voltage, arranged by output voltage 8-Lead Metal Can 8-Lead Dip 4-Lead Power 4-Lead TO3 10-Lead Metal Can 14-Lead Dip Axial TO3 TO220 TO92 Positive adjustable, arranged by output voltage Page 26-17 Semiconductors Part Number Output Configuration Viso Pt Ctr If Vf Vr Bvcbo Bvceo Ic NTE3040 NPN Transistor 7500 250 20 80 1.5 3 70 30 100 NTE3041 NPN Transistor 7500 300 100 60 1.5 6 70 30 50 NTE3042 NPN Transistor 7500 250 20 60 1.5 3 70 30 50 NTE3043 NPN Transistor 3550 260 70 60 1.5 3 70 80 50 NTE3044 NPN Darlington 7500 250 300 80 2.0 3 - 80 1000 NTE3045 NPN Darlington 7500 250 500 80 2.0 3 - 80 1000 NTE3081 NPN Transistor 6000 250 20 60 1.7 4 - 30 100 NTE3082 NPN Darlington 6000 250 400 60 1.7 4 - 30 100 NTE3083 NPN Darlington 7500 250 200 60 1.5 3 - 30 100 NTE3084 NPN Darlington 7500 250 100 60 1.5 3 - 55 100 NTE3086 Dual NPN Transistor 7500 400 50 60 1.5 3 - 30 100 NTE3088 HV NPN Transistor 7500 300 20 60 1.5 6 300 300 (Vcer) 100 NTE3089 AC Input NPN Transistor 7500 250 20 60 1.5 - 70 30 100 NTE3096 Low LED Drive NPN Transistor 7500 300 50 @ If = 1mA 60 1.4 6 70 30 25 NTE3098 NPN Transistor 5000 200 100 50 1.3 5 - 55 100 NTE3220 Dual NPN Transistor 5000 200 50 @ If = 5mA 50 1.2 6 - 35 50 NTE3221 Quad NPN Transistor 5000 200 50 @ If = 5mA 50 1.2 6 - 35 50 Part Number Case Style Description NTE1927 4-Lead TO3 IC-Vltg Reg, Neg Adj., -2.2V to -30V, 1A NTE957 TO220 IC-Vltg Reg, Neg Adj., - 1.2V to - 37V, 1.5A NTE1901 TO92 IC-Vltg Reg, Neg Adj., -1.2V to -37V, 100mA NTE1911 TO3 IC-Vltg Reg, Neg, Adj., -1.2V to -37V, 1.5A Voltage Regulators (cont.) Negative adjustable, arranged by output voltage Precision Voltage Regulators 0.01% line and load regulation, Positive or negative supply. Reference Voltage Regulators For electronic tuner. Optoisolators Phototransitor Outputs Part Number Case Style Description NTE923 10-Lead Metal Can IC-Linear, Precision Voltage Regulator NTE923D 14-Lead DIP IC-Linear, Precision Voltage Regulator Part Number Case Style Description NTE615 Axial Reference Voltage Regulator for Electronic Tuner NTE615P TO92 Reference Voltage Regulator for Electronic Tuner Page 26-18 Semiconductors 123AP 159 Amp, Gen Purpose 75/80 40/80 0.6/1 0.625 200/180 300 Min/200 TO92 46 - Darlington, Gen Purp Amp, Preamp, Driver 100 100 0.5 0.625 10000 Min 200 TO92 289A 290A Audio Pwr Amp 100 80 0.5 0.6 100 Min 120 TO92 194 - Audio Pwr Amp 180 160 0.6 0.31 100 100 Min TO92 287 288 High Vltg, Gen Purp Amp 300 300 0.5 0.625 40 Min 50 Min TO92 192 193 Audio Pwr Amp, Gen Purp 70 70 (CES) 1 1* 150 120 Min TO92HS 192A 193A Audio Pwr Output 70 70 (CES) 0.5 0.6 120 Min 120 TO92HS 48 - Darlington, High Current, Gen Purp Amp 60 50 (CES) 1 2.5* 25000 Min 100 Min Giant TO92 293 294 Audio Amp & Driver 60 50 1 1 120 Min 200 Giant TO92 297 298 Audio Amp Driver 80 80 0.5 0.75 130 Min 120 Giant TO92 90 91 Amp, High Vltg, High Gain 120 120 0.05 0.75/150 400 Min 350/20 Giant TO92 Part Number Output Configuration Viso Pt Ctr If Vf Vr Bvcbo Bvceo Ic NTE3100 NPN Transistor 6 60 1.7 55 100 100 250 8 50 NTE3101 NPN Darlington 6 60 1.7 55 100 100 250 7 45 NTE3102 NPN Transistor 6 60 1.7 55 100 100 250 8 50 NTE3103 NPN Darlington 6 60 1.7 55 100 100 250 7 45 NTE3105 NPN Transistor 3 50 1.3 30 20 200 75 20 20 TO92 TO92HS Giant TO92 Silicone Transistor Selector Guide NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagram Number IC PD hFE fT Maximum Collector Current (Amps) Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Diss. (Watts) Optoisolators Phototransitor Outputs (cont.) *Tc=25ºC Page 26-19 Semiconductors 31 32 Sound/Vert Output 160 160 1 0.9 100 Min 20 Min/15 Min Giant TO92 399 - High Vltg Video Amp 300 300 0.1 0.9 100 Min 50 Min Giant TO92 108-1 - Amp, RF/IF Video 30 15 0.05 0.625 20 Min 800 TO106 75 - High Pwr Amp, Switch 100 80 5 50 40 Min 50 Min TO111 95 - High Vltg, Switch Isolated Stud 250 250 3 40 90 Min 40 TO111 76 - Amp, Broad Band, CATV 50 30 0.4 5 30 Min 1500 TO117 2338 - Darlington Power Amp w/Internal Damper 60±10 60±10 1.5 10 2000 Min - TO126 184 185 Amp, High Speed Switch 80 80 4 40 25 Min 2 Min TO126 253 254 Darlington Pwr Amp 80 80 4 40 2,500 - TO126 295 - RF Power Output/Driver 80 40 1.5 5 20 Min 150 Min TO126 - 374 Audio Amp, Gen Purp 180 160 1.5 20 190 140 TO126 157 39 High Vltg Amp, Gen Purp 325/300 300 0.5 20 90/92 10 Min TO126 2327 - High Vltg, High Speed Sw 1000 (CES) 450 0.5 20 50 20 TO126 2501 2502 HV for Video Output 300 300 0.1 1.5 100 Min 70 TO126ML 78 - RF Pwr Output 36 18 0.6 5 5 Min - TO220 152 153 Amp, Gen Purp 60 60 5 50 60 10 TO220 236 - Final RF Pwr Amp 60 25 6 1.5 15 - B26 TO106 TO111 TO117 TO126 Silicone Transistor Selector Guide (cont.) NTE Type Number Application Package Style/Diagram Number Typical Forward Current Gain Typical Freq (MHZ) NPN PNP BVCBO BVCEO IC PD hFE fT Maximum Breakdown Voltage (Volts) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC Giant TO92 TO126ML TO220 Page 26-20 Semiconductors 2332 - Darlington w/Internal Damper & Zener Diode 60±10 60±10 2 20 4000 - TO220 2334 - Darlington Driver w/Internal Damper & Zener Diode 60±10 60±10 5 40 4000 20 TO220 235 - Final RF Pwr Amp 65 65(CER) 3 Pulse 12 80 300 TO220 241 242 Amp Gen Purp 80 80 4 60 25 Min 25 Min TO220 377 378 Pwr Amp, Pwr Driver, Switch 80 80 10 50 60 Min 50 TO220 196 197 Amp Gen Purp 90 80 (CER) 7 50* 20 Min 4 TO220 56 - High Gain Switch 100 80 3 30 500 Min 15 TO220 261 262 Darlington Pwr Amp 100 100 8 65 1000 Min - TO220 263 264 Darlington Pwr Amp 100 100 10 65 1000 Min - TO220 331 332 Audio Amp, Switch 100 100 15 90 40 Min 3 Min TO220 2343 2344 Darlington Audio Amp, Dr 100 100 12 80* 1000 Min - TO220 291 292 Amp, Gen Purp 130 120 4 40 70 4 Min/5 Min TO220 54 55 High Freq Audio Driver 150 150 8 50 100/120 30 Min TO220 375 398 Vert Deflection Amp 200 150 3/2 25 150/100 8/5 TO220 376 - TV Pwr Supply Driver 300 300 0.2 15* 100 70 TO220 2315 - Fast Switch Pwr Darlington 400 200 8 60 125 - TO220 198 - High Vltg Audio Output 500 500 (CES) 1 40* 80 10 Min TO220 51 - High Vltg, High Speed Sw 700 400 4 75 30 4 Min TO220 379 - High Vltg Switch 700 400 12 100 12 4 Min TO220 Silicone Transistor Selector Guide (cont.) TO220 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC Page 26-21 Semiconductors 2312 - HV High Speed Switch 700 CEV 400 (SUS) 8 80 60 Max 4 Min TO220 2325 - High Voltage Switch 900 800 3 50 8 Min 15 TO220 2313 - High Speed Switch 1000 (CES) 450 2 40 50 20 TO220 2333 - High Vltg, High Speed Sw 1000 (CES) 450 8 100* 4 Min 10 TO220 2303 - High Vltg Horiz Output 1500 750 2.5 65 4.5 4 TO220 2336 - Darlington Switch w/Internal Damper & Zener Diode 60±10 60±10 8 45 2000 Min - TO220 Isol Tab 2337 - High Vltg, High Speed Sw 900 500 7 2/45* 15 Min 20 TO220 Isol Tab 2339 - High Vltg, High Speed Sw 1100 800 3 30 20 Min 15 TO220 Isol Tab 216 - High Speed Switch 80 50 1 1.5 60 Min - TO237 128P 129P General Purp Amp 100 80 1 1/2 100 Min 150/125 TO237 24 25 General Purp Amp, Switch 100 80 1 2* 50 Min/40Min 150/125 TO237 227 - HV Amp Video Output 300 300 0.01 2* 40 Min 50 Min TO237 255 - Horiz Dr, Amp 325 300 0.5 2* 110 60 TO237 2340 - Darlington Sw w/Internal Damper Diode 60±10 60±10 8 45 2000 - "N" Pack 2351 2352 Darlington Pwr Amp, Sw 100 80 4 1 1000 Min - "N" Pack 2504 - High Gain Audio Amp 30 25 2 1.2 1500 260 TO126LP 182 183 High Speed Amp, Switch 70 60 10 90 20 min. 2 TO127 267 - Darlington Pwr Amp Switch 30 30 0.5 6.25 90000 min - TO202 265 - Darlington Pwr Amp Sw 50 50 0.5 6.25 10000 min - TO202 266 - Darlington Pwr Amp Switch 50 50 0.5 6.25 40000 min - TO202 - 269 Darlington Pwr Amp 50 50 2 10 1000 min - TO202 300 307 Audio Pwr Amp 50 40 1.5 7 90 min 65 TO202 186 187 Audio Driver, Output 70 60 3 12.5 100 min 50 TO202 299 - RF Pwr Amp Driver 75 35 1 4 70 min - TO202 Silicone Transistor Selector Guide (cont.) TO202 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagr am Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) “N” Pack TO126LP TO127 Max. Collector Current (Amps) Max. Collector Diss. (Watts) TO220 TO220 Isol Tab TO237 *Tc=25ºC Page 26-22 Semiconductors 210 211 Gen Purp Output Driver 90 75 1 6.25 120 min 200/150 min TO202 49 50 High Vltg Amp, Driver 120 100 2 10 100 150 TO202 171 - Audio, Video Amp 300 300 0.5 6.25 30 min 75 TO202 78 - RF Pwr Output 36 18 0.6 5 5 min - TO202M 79 - RF Pwr Output 36 18 2 15 5 min - TO202M 186A 187A Med Audio Amp 40/50 50/40 3 10 120 150 TO202M 228A - HV Amp Video Output 450 350 0.5 2-10* 25 Min 45 Min TO202M 272 273 Darlington Pwr Amp, Switch 50 40 2 10* 25000 Min - TO202N 322 - RF Pwr Output 65 65 (CES) 0.5 10 10 Min 100 TO202N 188 189 High Vltg Amp 80 80 2 10 60 Min 100 TO202N 190 - High Vltg Amp 180 180 1 10 40 Min 100 TO202N 191 240 High Vltg Amp 300 300 0.5 10 45 min/70 40 min/60 min TO202N 270 271 Darlington Pwr Amp Switch 100 100 10 125 1000 min - TO218 390 391 Pwr Amp, Switch 100 100 10 80 40 min 3 TO218 392 393 Pwr Amp, Switch 100 100 25 125 25 min 3 TO218 2305 2306 High Pwr Audio Amp 160 160 16 125 35 1 min TO218 2316 - HV Pwr Darlington 500 450 10 120 130 - TO218 394 - Pwr Amp, High Speed Sw 500 400 3 100 30 min - TO218 2317 - High Vltg. Fast Switch, Power Darlington 500 (CES) 450 15 150 300 min - TO218 256 - Darlington with Damper Diode 600 400 28 150 30 min - TO218 2310 - High Vltg 1000 450 8 125 10 - TO218 2311 - High Vltg/Speed Sw 1000 450 15 150 10 - TO218 2300 - High Vltg, Horiz Output 1500 700 8 125 6 - TO218 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) Silicone Transistor Selector Guide (cont.) TO202M TO202N *Tc=25ºC TO218 Page 26-23 Semiconductors 2301 - High Vltg Horiz Output 1500 750 5 100 5 4 TO218 2318 - HV Sw with Internal Damper Diode 1500(CES) 700 8 125 5 0.5 TO218 16002 - RF Power, Dr 65 40 3 23* 5 min 400 TO60 16003 - RF Power, Dr 65 40 1.5 11.6* 10 min 500 TO60 72 - High Current, Fast Switch 120 100 10 115 30 min 30 TO61 73 - High Vltg Switch 220 200 10 85 15 min 40 TO61 71 - High Current, Fast Switch 150 90 20 200 20 min 20 TO63 70 - Pwr Amp, High Vltg, Switch 180 150 50 250 30 min - TO63 274 275 Darlington Pwr Amp Switch 80 80 4 50 3000 - TO66 - 218 Audio Power Output 90 80 4 25 30 min 4 min TO66 124 - High Vltg, Gen Purpose 300 300 0.15 20 100 10 TO66 384 - High Vltg Pwr Amp/Switch 375 350 7 45 28 1 min TO66 175 38 Pwr Amp, Gen Purpose 500/400 300 (CER)/350 3/2 40/35 60/50 15/20 TO66 369 - Vert Deflection, Switch 800 400 3 Peak 40 30 min 7 TO66 319 - VHF Amp with AGC 20 20 0.05 0.26 80 300 min TO92 - 395 Wide Band Amp 30 25 0.05 0.36 80 2.3Ghz TO92 316 - High Gain, Lo Noise UHF Amp 30 15 0.05 0.2 25 min 1400 TO92 161 - VHF-UHF Amp, Mixer/OSC 45 45 (CES) 0.05 0.2 60 800 TO92 81 - Amp, Dual VHF, Switch 75/60 40/60 0.5/0.6 0.6/each 2 total 100 250/320 TO92 10 - UHF Low noise Amp 25 12 0.07 0.4 40 min 4.5GHz TO92 23 - Ultra High Freq Amp 30 14 0.05 0.25 80 2GHz TO92 107 - UHF OSC 30 15 0.05 0.2 75 1000 TO92 108 - RF-IF Amp 30 15 0.05 0.625 20 min. 800 TO92 Silicone Transistor Selector Guide (cont.) TO218 TO60 TO61 TO63 TO66 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC TO92 Page 26-24 Semiconductors 233 - Video IF OSC 30 30 0.1 0.625 45 300 min TO92 - 232 Gen Purp Darlington Amp 30 30 0.3 0.625 50000 min 175 TO92 69 - UHF/VHF Amplifier 35 25 0.05 1 60 1100 TO92 289 290 Audio Amp, Switch 35 30 0.8 0.6 120 min 100/120 TO92 11 12 High Current Am 40/27 20/18 5 0.75 230 min/180 min 150/120 TO92 319P - VHF Amp with AGC Control 40 30 0.05 0.5 80 300 min TO92 172A - Darlington Pre-Amp 40 40 0.3 0.4 7000 min 60 min TO92 229 - VHF OSC, Mixer 40 40 0.05 0.425 30 min 500 min TO92 47 - High Gain, Low Noise Amp 45 45 0.2 0.625 1150 160 TO92 199 234 Amp, Gen Purpose 70/120 50/120 0.1 0.36/0.3 400 min/350 min 90 min/100 TO92 85 - Amp, Gen Purp Switch 70 70 (CES) 0.4 0.625 120 min 200 min TO92 20 21 AF PO, Dr, Series Pass 40 32 2 1 120 min 100 ATR 16 17 Gen Purp Sm Sig Amp, Low Noise 50 40 0.1 0.3 270 min 180/140 ATR 18 19 High Breakdown Voltage Large Current Capacity Driver 80 80 0.7 1 120 min 120/100 ATR 22 - AF PO, Dr, Gen Purp Amp 100 80 1 0.9 120 min 100 ATR 302 - CB, Driver Switch 100 50 1.5 Peak 7.9 199 min 70 B2 306 - CB, Driver, Switch 100 50 1.5 Peak 7.9* 199 min 70 B2 15 - VHF Amp, Mixer, OSC, UHF OSC 30 19 50 0.3 39 min 1100 FTR - 14 Low Freq, Driver 80 80 0.7 0.75 120 min 100 FTR 315 - Medium Pwr Audio Amp 100 50 1 0.75 199 min - R245 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagr am Number IC PD hFE fT Max. Collector Diss. (Watts) Max. Collector Current (Amps) Typical Forward Current Gain Typical Freq (MHZ) Silicone Transistor Selector Guide (cont.) *Tc=25ºC TO92 ATR B2 FTR R245 Page 26-25 Semiconductors 382 383 Audio Freq Driver 120 100 1 0.9 200 140 R245 42 43 Dual, Differential Amp, High Gain Low Noise, Common Emitter 50 50 0.1 0.2/unit 0.4 total 400 min 100 min SIP-5 - 41 Dual, Differential Amp, High Gain Low Noise, Common Emitter 100 100 0.05 0.2/unit 0.4 total 400 min 100 min SIP-5 44 45 Dual, High Gain, Low Noise, Bias Amp, Common Base 100 100 0.1 0.2/unit 0.4 total 400 min 100 min SIP-5 2402 2403 Low Noise, UHF/VHF amp 20 15 0.025 0.2 90/50 5GHz SOT-23 - 2401 RF Stages in FM Front-Ends 30 30 0.025 0.3 - 450 SOT-23 2404 2405 Darlington 40 30 0.3 0.35 4000 min 220 SOT-23 2414 2415 Digital with 2 Built-in Bias 10k Resistors 50 50 0.1 0.2 50 min 250 SOT-23 2416 2417 Digital with 2 Built-in Bais 22k Resistors 50 50 0.1 0.2 50 min 250 SOT-23 2418 2419 Digital with 2 Built-in Bias 47k Resistors 50 50 0.1 0.2 50 min 250 SOT-23 2406 2407 General Purpose Amp 75/60 40/60 0.6 0.35 100 min 300 min/200 min SOT-23 2408 2409 Low Noise, Driver, Output 80 65 0.1 0.2 125 min/220 min 300/150 SOT-23 2410 2411 HV Amp/Dr 160 140/150 0.6/0.5 0.3/0.35 80 min/60 min 100 min SOT-23 2412 2413 General Purpose HV Amp 300 300 (CER) 0.05 0.31 50 min 60 min SOT-23 2345 2346 Dalington Power Amp 120 120 3 30 750 min - SOT-82 2426 2427 Darlington Switch 90 80 (CER) 0.5 1 2000 min - SOT-89 2428 2429 General Purpose Amp, SW 90 80 1 1 100 min 100 min SOT-89 2430 2431 HV Amp/Sw 400/350 350/300 1 1 30 min 15 min SOT-89 29 30 High Current Switch 80 80 50 300 25 2 TO3 NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) IC Silicone Transistor Selector Guide (cont.) *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) R245 SIP-5 SOT-23 SOT-82 SOT-89 TO3 Page 26-26 Semiconductors 243 244 Darlington Power Amp 80 80 8 150 2500 - TO3 245 246 Darlington Power Amp 80 80 10 150 4000 - TO3 247 248 Darlington Power Amp 100 100 12 150 3000 - TO3 249 250 Darlington Power Amp 100 100 16 150 4000 - TO3 251 252 Darlington Power Amp 100 100 20 160 2500 - TO3 130 219 Power Amp, Gen Purpose 100 70 (CER) 15 115 20 min 2.5 min TO3 181 180 High Power Audio Amp 100 100 (CER) 30 200 25 min 2 min TO3 2349 2350 High Current Darlington 120 120 50 300 2000 min - TO3 60 61 High Power Audio Amp 140 140 20 250 150 max 2 min TO3 280 281 Audio Power Amp 150 150 12 100 70 5/6 TO3 328 - Power Amp, Switch 150 130 (CER) 15 140 12 min 60 min TO3 284 285 Audio Amp Output 180 180 16 150 70 6 TO3 327 - Power Amp, Switch 180 150 25 200 30 min 40 min TO3 387 - Power Amp, Switch 180 150 50 250 80 30 min TO3 87 88 High Power AF, Switch 250 250 (CEX) 10 200 20 min. - TO3 94 - High Voltage Switch 300 300 5 100 40 2.5 min TO3 388 68 Power Amp, Gen Purpose 400 250 16 250 30/35 4 min TO3 162 - TV Vert Deflection 500 300 10 Peak 100 20 min. - TO3 97 - HV Darlington Pwr Amp, Fast Sw 500 400 10 150 40 min - TO3 385 - Audio Power Amp, Switch 550 350 10 150 17 - TO3 99 - HV Darlington Pwr Amp, Fast Sw 600 400 50 250 25 min - TO3 98 - HV Darlington Pwr Amp, Fast Sw 700 500 20 175 40 min - TO3 163A - TV Horiz Deflection 700 700 (CEV) 6 100 10 min - TO3 Silicone Transistor Selector Guide (cont.) NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) IC TO3 *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) Page 26-27 Semiconductors 52 - High Vltg, High Speed Sw 750 450 5 125 17 - TO3 386 - Audio Power Amp, Switch 800 500 20 175 20 - TO3 283 - Horiz Output, Switch 800 325 10 100 10 min 6 TO3 53 - High Vltg, High Speed, Sw 850 400 15 175 25 6 min TO3 2319 - High Vltg, High Speed, Sw 850 (CES) 450 15 Cont 175 5 min - TO3 89 - Horiz Output with Internal Damper Diode 1500 600 7 50 8 min - TO3 164 - TV Vertical Output 1500 700 (CER) 1 50 30 min 3 TO3 389 - Horizontal Output 1500 1500 (CER) 4 100 10 min 4 min TO3 165 - TV Horizontal Output 1500 1400 (CES) 6 50 8 min 3 TO3 238 - TV Horizontal Output 1500 1500 (CEX) 8 100 8 - TO3 62 - Very High Vltg Horiz Output 2500 900 3 50 7 - TO3 2330 - High Gain Amp, with Internal Zener Diode 55+15- 10 55+15-10 4 80 1000 - TO3P 2335 - Darlington with Internal Zener Diode for Line Operated TV 60±15 60±15 5 80 2000 min - TO3P 2304 2314 High Current, Speed Switch 60 50 15 90 100 Min/ 70 Min 20 TO3P 214 - Darlington Driver 70 60 10 60* 5000 20 TO3P 215 - Darlington Driver 110 100 8 60* 4000 20 TO3P 36 37 Audio Power Amp 160 140 12 100 100 15 TO3P Silicone Transistor Selector Guide (cont.) TO3P NPN PNP NTE Type Number Application BVCBO BVCEO Maximum Breakdown Voltage (Volts) Package Style/Dia. Number PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) IC Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC TO3 Page 26-28 Semiconductors 2307 - High Gain, Power Amp 200 180 5 80 500 Min - TO3P 2308 - High Voltage/Current Switch 500 400 12 100* 15 Min 20 TO3P 2309 - High Voltage/Speed Switch 900 800 6 100 10 min 15 TO3P 2348 - High Voltage/Speed Switch 1100 800 12 150 10 min 15 TO3P 2302 - High Voltage Output with Internal Damper diode 1500 800 5 120 8 min 3 TO3P 2354 - High Vltg, Horiz Output for High Definition CRT 1500 800 10 150* 8 min - TO3P 2353 - Color TV Horiz Deflection with Damper Diode 1500 800 10 70* 5 min - TO3PML 2324 - High Voltage Switch 1500 800 8 70* 8 min - TO3PML 2331 - TV Horiz Deflection with Damper Diode 1500 800 6 60 8 min - TO3PML 16007 - Med Power Gen Purp 100 100 (CEV) 3 25 35 min 1.25 TO8 - 106 Amp, OSC, FM Mixer 35 15 0.05 0.35 50 min 650 min TO18 123A 159M General Purpose Amp 75/60 40/60 0.8/0.6 0.4 200/100 min 300/200 min TO18 278 - RF Amp, Broad Band 40 20 0.4 3.5 40 min 1400 TO39 346 - RF Driver, Predriver 40 20 0.4 1 10 min 500 min TO39 77 - Broad Band, CATV 50 30 0.4 3.5 30 min 1500 TO39 311 - Driver, VHF/UHF OSC 55 30 0.4 5 25 min 800 min TO39 329 - RF Power Amp - 30 1.5 Peak 5 - - TO39 195A - RF Pwr Amp, Driver 70 70 (CER) 1.5 8 30 min 150 TO39 123 - Amp, Gen Purpose 75 40 0.8 0.8 200 300 min TO39 Silicone Transistor Selector Guide (cont.) NPN PNP NTE Type Number Application BVCB O BVCEO Maximum Breakdown Voltage (Volts) Package Style/Diagr am Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) Max. Collector Current (Amps) Max. Collector Diss. (Watts) *Tc=25ºC TO3P TO3PML TO8 TO18 Page 26-29 Semiconductors 282 - Final RF Powr Amp, Sw 100 60 4 10* 100 140 TO39 16005 16004 High Current Gen Purpose 100 75 2 10 30 min - TO39 128 129 Amp, Gen Purpose 120/90 80 1 1 90 min 100/150 min TO39 2347 - Med Power Gen Purp 120 80 5 4 40 min - TO39 324 323 Amp, Gen Purpose 120 100 1.5 0.8 90/80 20 min TO39 154 - High Vltg Video Output 300 300 0.2 1 100 80 TO39 396 397 Pwr Amp, High Vltg 450 350 350 300 1 10 40 min/30 min 15 min TO39 224 - Final RF Pwer Output 60 60 (CEV) 2 10 60 200 TO39 with Flange 225 - High Speed Sw Linear Amp 450 350 1 10 40 min 15 TO39 with Flange 237 - Final RF Pwr Out 80 40 3 Pulse 10 50 250 TO39HS 74 - Amp, Gen Purpose, Switch 100 100 7 60 60 min 30 TO59 96 - Switching Power Transistor 100 100 7 60 60 min 30 min TO59 95 - High Vltg, Switch Isolated Stud 250 250 3 40 90 min 40 TO59 2320 2320 Quad Gen Purp Sw Amp 60 30 0.5 0.65/Unit 1.25 total 100 min 350 14-Lead DIP 2321 - Quad Gen Purpose 60 40 0.5 0.65/Unit 1.25 total 100 min 350 14-Lead DIP - 2322 Quad Gen Purpose 60 40 0.6 0.65/Unit 1.25 total 100 min 350 14-Lead DIP 2323 - Quad High Vltg Gen Purpose Amp 200 200 0.5 0.75/Unit 1.7 total 80 80 14-Lead DIP Silicone Transistor Selector Guide (cont.) NPN PNP NTE Type Number Application BVCB O BVCE O Maximum Breakdown Voltage (Volts) Package Style/Diagram Number IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) TO39 TO39 w/Flange TO39HS TO59 14-Lead Dip Page 26-30 Semiconductors 58 59 High Pwr Audio Output 200 200 17 200 30 min 20 92 93 Hi-Fi Pwr Amp, Audio Output 200 200 15 150 120 20 63 - High gain, Low Noise, Wide Band, Small Signal Amp 20 12 0.04 0.4 40 5GHz 64 - UHF/Microwave Amp/Hi Speed Sw 25 15 0.03 0.375 80 4.5GHz 313 - VHF Mixer and UHF/RF Amp, High Gain Low Noise 30 30 0.02 0.15 60 530 2363 2364 High Current Gen Purp Amp 60 50 2 1 200 min 150 315 - Medium Power Audio Amp 100 50 1 0.75 199 min - 344 - RF Power Output 35 17 7 50 50 - 65 - High Vltg, Low Noise for CATV, MATV 20 15 0.025 0.18 70 6GHz 26 - Low Noise Audio Amp 120 120 0.1 0.2 350 min 100 2355 2356 Digital with 2 Built-in Bias 10k Resistors 50 50 0.1 0.3 50 min 250 2357 2358 Digital with 2 Built-in Bias 22k Resistors 50 50 0.1 0.3 50 min 250 2359 2360 Digital with 2 Built-in Bias 47k Resistors 50 50 0.1 0.3 50 min 250 2367 2368 Digital with 2 Built-in Bias 4.7k Resistors 50 50 0.1 0.3/0.2 30 min 250/200 2369 2370 Digital with 2 Built-in Bias 4.7k/47k Resistors 50 50 0.1 0.3/0.2 80 min 250/200 2361 2362 High Speed Switch 60 50 0.5 0.3 200 min 300/200 13 - Low Vlt Output Amp 25 20 0.5 0.6 400 min 200 16006 - AF Amp 20 20 0.7 1 1000 min - 16001 - Video IF Amp 45 35 0.05 0.6 50 500 NPN PNP NTE Type Number Application BVCB O BVCE O Maximum Breakdown Voltage (Volts) Package Type IC PD hFE fT Typical Forward Current Gain Typical Freq (MHZ) *Tc=25ºC Max. Collector Current (Amps) Max. Collector Diss. (Watts) Silicone Transistor Selector Guide (cont.) Page 26-31 Semiconductors 50 5800 5830 5850 - 5870 - 5940 5892 5912 - 5980 50 - 5831* 5851* - 5871* - 5941* 5893* 5913* - 5981* 100 5801 5832 5852 5812 5872 - 5942 5894 5914 - 5982 100 - 5833* 5853* - 5873* - 5943* 5895* 5915* - 5893* 200 5802 5834 5854 - 5874 - 5944 5896 5916 - 5986 200 - 5835* 5855* - 5875* - 5945* 5897* 5917* - 5987* 300 5803 5836 5856 - 5876 - 5946 5898 5918 - 5988 300 - 5837* 5857* - 5877* - 5947* 5899* 5919* - 5989* 400 5804 5838 5858 5814 5878 - 5948 5900 5920 5962 5990 400 - 5839* 5859* - 5879* - 5949* 5901* 5921* 5963* 5991* 500 5805 5840 5860 - 5880 - 5950 5902 5922 - 5992 500 - 5841* 5861* - 5881* - 5951* 5903* 5923* - 5993* 600 5806 5842 5862 5815 5882 6013 5952 5904 5924 - 5994 600 - 5843* 5863* - 5883* - 5953* 5905* 5925* - 5995* IFSM 200A 40A 150A 400A 250A 300A 250A 300A 400A 300A 500A VF @ IF 1.2V max 0.9V Typ 1.1V Max 0.9V Typ 1.1V Max 0.9V Typ 0.9V Max 0.8V Typ 1.2V Max 1V TyP 1.6V Max 1V Typ 1.5V Max 1.1V Typ 1.2V Max 0.9V Typ 1.5V Max 1.1V Typ 107V Max 1V Typ 1.2V Max 1V Typ TC @ IF (ºC) +105 (TL) +150 +150 +60 +150 - +150 +150 +150 +100 +150 Mtg Torque inlb (mN) - 20 (2.22) 20 (2.22) - 20 92.22) - 30 (3.33) 20 (2.22) 20 (2.22) - 30 (3.33) Thread Size - 10-32 NF-2A 10-32 NF-2A - 10-34 NF-2A - 1/4-28 UNF-2A 10-32 NF-2A 10-32 NF-2A - 1/4-28 UNF-2A Industrial Rectifiers Package Type Case Style Axial Lead TO220 DO5 PRV Volts Maximum Average Rectified Forward Current IF in Amperes 3A 6A 12A 12.7A 15A 16A 25A 40A DO27 DO4 DO4 20A DO4 Press Fit DO5 Page 26-32 Semiconductors 800 5808 5846 5866 - 5886 - - 5908 5928 5966 5998 800 - 5847* 5867* - 5887* - - 5909* 5929* 5967* 5999* 1000 5809 5848 5868 5817 5890 - - 5910 5932 - 6002 1000 - 5849* 5869* - 5891* - - 5911* 5933* - 6003* IFSM 200A 40A 150A 400A 250A 300A 250A 300A 400A 300A 500A VF @ IF 1.2V max 0.9V Typ 1.1V Max 0.9V Typ 1.1V Max 0.9V Typ 0.9V Max 0.8V Typ 1.2V Max 1V TyP 1.6V Max 1V Typ 1.5V Max 1.1V Typ 1.2V Max 0.9V Typ 1.5V Max 1.1V Typ 107V Max 1V Typ 1.2V Max 1V Typ TC @ IF (ºC) +105 (TL) +150 +150 +60 +150 - +150 +150 +150 +100 +150 Mtg Torque inlb (mN) - 20 (2.22) 20 (2.22) - 20 92.22) - 30 (3.33) 20 (2.22) 20 (2.22) - 30 (3.33) Thread Size - 10-32 NF-2A 10-32 NF-2A - 10-34 NF-2A - 1/4-28 UNF-2A 10-32 NF-2A 10-32 NF-2A - 1/4-28 UNF-2A Industrial Rectifiers (cont.) PRV Volts Maximum Average Rectified Forward Current IF in Amperes 3A 6A 12A 12.7A 15A 16A 20A 25A 40A Package Type Case Style DO27 DO4 Axial Lead DO4 TO220 DO5 DO4 Press Fit DO5 Not only do we have local experts, but Edge members have hundreds of specially trained professionals on staff who are experts in providing answers and prompt solutions to all your product needs. Page 26-33 Semiconductors PRV 1A 1.5A 2A 4A 4A 6A 8A 25A 40A 80A 100A 100 - - NTE166 - - - NTE5312 - - - - 200 - - NTE167 NTE5309 NTE5318 NTE5329 NTE5313 NTE5322 NTE5340 - - 400 - NTE5304 NTE168 - - - NTE5314 NTE5324 - - - 600 NTE5332 NTE5305 NTE169 NTE5310 NTE5319 NTE5330 NTE5315 NTE5326 NTE5342 NTE5346 NTE5348 800 - NTE5306 - - - - NTE5316 NTE5327 - - - 1000 NTE5334 NTE5307 NTE170 NTE5311 NTE5320 NTE5331 NTE5317 NTE5328 NTE5344 - - IFSM (AMP) 25 50 60 20 200 200 200 300 300 1000 1000 VF @ IF 1.2V @ 1A 1V @ 1A 1V @1A 1V @ 3A 1V @ 3A 1V @ 3A 1.1V @4A 1.2V @12.5A 1.2V @ 20A 1.3V @80A 1.3V @100A Max TA @ IF ºC +40 +30 +55 +50 +50 +50 +50 +55 +55 +150 +150 Single Phase Bridge Rectifiers IF Averaged Rectified Forward Current Maximum Average Rectified Current @ Half - Wave Resistive Load 60HZ Package Type PRV Volts No part of this catalog may be reproduced without the express written permission of Edge, Inc. Page 26-34 Semiconductors 25 - - - NTE5600 - - - - 50 - - - NTE5601 - - - NTE5661 100 - NTE5640 NTE560 NTE5602 - - - - 200 NTE5655 NTE5641 NTE5651 NTE5603 - - - - 300 - - - NTE5604 - - - - 400 NTE5656 NTE5642 NTE5652 NTE5605 NTE5629 NTE5608 NTE5638 - 500 - - - NTE5606 - - - - 600 NTE5657 NTE5643 NTE5653 NTE5607 - NTE5609 - - 800 - - - - - NTE5610 NTE5620 - IGT (mA) 5 Max 25/40 Max 3 Max 30 Max 3 Max 10 Max 10 Max 50/75 Max VGT (V) 2 Max 2.2 Max 2.2 Max 2.5 Max 2 Max 2.5 Max 2 Max 2 Max VFDN (V) 1.5 Max 1.8 Max 2.2Max 2 Max 1.6 Max 1.5 Max 1.6 Max 2 Max ISURGE (A) 8 Max 25 Max 25 Max 30 Max 40 Max 80 Max 80 Max 100 Max IHOLD (Ma) 20 Max 35 Max 5 Max 30 Max 5 Max 15 Max 15 Max 50 Max Firing Quads ALL ALL ALL ALL ALL ALL ALL ALL Triacs VRRM Dc or Pk Volts IT RMS Maximum Forward Current 0.8A 2.5A 4A 8A 10A Package Type Package TO92 TO5 TO126 TO202 TO220 TO220 Full Pack TO64** Page 26-35 Semiconductors 25 NTE5611 NTE5621 - - - - - NTE5680 - - 50 NTE5612 NTE5622 NTE5631 - - - - NTE5681 - - 100 NTE5613 NTE5623 NTE5632 - - - - MTE5682 - - 200 - - NTE5633 - NTE5673 NTE56004 - NTE5683 NTE56019 NTE56015 300 NTE5615 - NTE5634 - - - - NTE5684 - - 400 - - NTE5635 - NTE5675 NTE56006 - NTE5685 NTE56020 NTE56016 500 - - NTE5636 - NTE5676 - - NTE5686 - - 600 NTE5618 - NTE5637 NTE5645 NTE5677 NTE56008 - NTE5687 - NTE56017 800 - - - - - NTE56010 NTE5671 - - NTE56018 IGT (mA) 50/75 Max 50 Max 50 Max 25/50 Max 50/80 Max 40/75 Max 50/75 Max 75/100 Max 80 Max 50/100 Max VGT (V) 2.5 Max 2 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max 2.5 Max VFON (V) 1.8 Max 1.8 Max 1.65 Max 1.6 Max 2.2 Max 1.6 Max 1.7 Max 1.8 Max 1.8 Max 1.8 Max ISURGE (A) 100 Max 100 Max 100 Max 110 Max 150 Max 150 Max 150 Max 250 Max 250 Max 180 Max IHOLD (Ma) 50 Max 50 Max 50 Max 50 Max 60 Max 40 Max 40 Max 80 Max 100 Max 50 Max Firing Quads ALL I, II I, II, III ALL ALL ALL ALL ALL I, II, III ALL Triacs (cont.) VRRM Dc or Pk Volts IT RMS Maximum Forward Current 10A 15A 20A 25A Package Type Package TO127 TO220 TO220 Full Pack TO220 Isolated TO48** 1/4-28 UNF-2A TO220 TO48** 1/4-28 UNF-2A TO220 Isolated TO220 Page 26-36 Semiconductors Package Type Case Style TO92 TO5 TO126 TO202 TO64 TO66 TO5 TO220 TO127 TO220 Full Pack TO64 TO220 25 NTE5480 30 NTE5400 NTE5411 NTE5452 50 NTE5453 NTE570 NTE5442 NTE5481 NTE5461 60 NTE5401 NTE5412 100 NTE5402 NTE5413 NTE5454 NTE5471 NTE5482 NTE5461 150 NTE5403 200 NTE5404 NTE5408 NTE5414 NTE5455 NTE5472 NTE5511 NTE5427 NTE5483 NTE5463 250 300 NTE5456 NTE5473 NTE5484 400 NTE5405 NTE5408 NTE5415 NTE5457 NTE5474 NTE5512 NTE5428 NTE5437 NTE5485 NTE5465 500 NTE5475 NTE5486 600 NTE5406 NTE5410 NTE5416 NTE5458 NTE5476 NTE5413 NTE5429 NTE5438 NTE5448 NTE5487 NTE5466 700 800 NTE5440 NTE5468 1200 IGT MAX 200 NA# 1mA# 200 NA# 200 NA# 10mA 15mA 25mA 200 NA# 30mA 30mA 15mA 15mA VGT MAX (V) 0.8 1.0 1.0 1.5 1.5 2.0 1.5 0.08 1.5 1.5 1.5 1.5 IHOLD MAX(ma) 5 10 5 3 25 20 50 3 40 30 20 20 VF(ON)(V) 1.7 1.2 2.0 2.2 2.0 2.8 2.6 1.6 1.5 2.0 1.75 2.0 Silicon Controlled Rectifiers Dc or Pk Volts VDRM IT RMS Maximum Forward Current (All Conducting Angles 4A Sensitive Gate 0.8A Sensitive Gate 3A Sensitive Gate 5A 7A 8A Sensitive Gate 8A 10A NTE5409 NTE5462 NTE5470 Page 26-37 Semiconductors 25 - - - - NTE5500 - NTE5520 - - - - - 30 - - - - - - - - - - - - 50 - - - - NTE5501 - NTE5521 NTE5550 - NTE5541 - - 100 - - NTE5491 - NTE5502 - NTE5522 - - NTE5542 - - 150 - - - - NTE5503 - NTE5523 - - - - - 200 NTE5417 - NTE5492 - NTE5504 NTE5514 NTE5524 NTE5552 NTE5543 NTE5517 NTE5- 562 250 - - - - NTE5505 - NTE5525 - - - - - 300 - - - - NTE5506 - NTE5526 - - NTE5544 - - 400 NTE5418 NTE5426 NTE5494 NTE314 NTE5507 NTE5515 NTE5527 NTE5554 - NTE5545 NTE5518 NTE5- 564 IGT MAX 15mA 200NA 15mA 40mA 30mA 15mA 40mA 30mA 40mA 30mA 30mA 30mA VGT MAX 1.5 0.8 2 2 1.5 2 3 1.5 1.5 2 2 2 IHOLD MAX 30 3 20 50 40 20 50 40 40 50 50 50 VF(ON) 1.6 1.6 2.5 1.8 1.6 2.4 2 1.6 1.8 1.6 1.6 1.6 ISURGE(A) 100 100 100 200 150 200 150 300 300 300 300 300 VGFM(V) - - 10 - 10 10 10 - - 10 10 10 GRM(V) - - 10 - 5 5 5 - - 10 10 10 Mtg Torque - - 30(3.33) - 30(3.33) - 30(3.33) - - 30(3.33) - 30(3.3- 3) Thread Size - - 1/4-28 UNF-2A - 1/4-28 UNF-2A - 1/4-28 UNF-2A - - 1/4-28 UNF-2A - 1/4-28 UNF-2- A Silicon Controlled Rectifiers (cont.) Dc or Pk Volts+ VDRM IT RMS Maximum Forward Current (All Conducting Angles 10A 10A 10A Sensitive Gate 12.5A 16A 20A 25A 35A 35A Package Type Case Style TO220 Isolated TO48 TO3 TO48 1/2” Press Fit TO48 TO220 TO220 Full Pack TO48 1/2” Press Fit TO48 Isol Stud Page 26-38 Semiconductors 500 - - - - NTE5508 - NTE5528 - - NTE5546 - - 600 NTE5419 NTE5496 - NTE5509 NTE5516 NTE5529 NTE5556 - NTE5547 NTE5- 519 NTE5566 700 - - - - - - NTE5530 - - - - - 800 - - - - - - NTE5531 NTE5558 NTE5460 NTE5548 - - 1200 - - - - - - - - - - - - IGT MAX 15mA 200A 15mA 40mA 30mA 15mA 40mA 30mA 40mA 30mA 30mA 30mA VGT MAX 1.5 0.8 2 2 1.5 2 3 1.5 1.5 2 2 2 IHOLD MAX 30 3 20 50 40 20 50 40 40 50 50 50 VF(ON) 1.6 1.6 2.5 1.8 1.6 2.4 .2 1.6 1.8 1.6 1.6 1.6 ISURGE(A) 100 100 100 200 150 200 150 300 300 300 300 300 VGFM(V) - - 10 - 10 10 10 - - 10 10 10 GRM(V) - - 10 - 50 5 5 - - 10 10 10 Mtg Torque - - 30(3.33) - 30 (3.33) - 30 (3.33) - - 30 93.33) - 30 (3.33) Thread Size - - 1/4-28 UNF-2A - 1/4-28 UNF-28 - 1/4-28 UNF-28 - - 1/4-28 UNF-28 - 1/4-28 UNF-28 Silicon Controlled Rectifiers (cont.) Dc or Pk Volts+ VDRM IT RMS Maximum Forward Current (All Conducting Angles 10A 10A 10A Sensitive Gate 12.5A 16A 20A 25A 35A 35A Package Type Case Style TO220 Isolated TO48 TO3 TO48 1/2” Press Fit TO48 TO220 TO220 Full Pack TO48 1/2” Press Fit TO48 Isol Stud Page 26-39 Semiconductors 200 - - - - NTE5567 NTE5570 NTE5575 NTE5580 NTE5590 - NTE5594 - 250 - - - - - - - - - - - - 300 - - - - - - - - - - - - 400 - - - NTE5539 - - - - - - - - 500 - - - - - - - - - - - - 600 NTE5534A - - - NTE5568 NTE5572 NTE5577 NTE5582 NTE5591 NTE5587 NTE5595 NTE5598 700 - - - - - - - - - - - - 800 - NTE5536 NTE5538 NTE5540 - - - - - - - - 1200 - - - - NTE5569 NTE5574 NTE5579 NTE5584 NTE5592 NTE5589 NTE5596 NTE5599 IGT Max 80mA 50mA 80mA 40mA 100mA 150mA 150mA 150mA 150mA 150mA 150mA 200mA VGT Max 1.5 1.5 3 1.5 2.5 3 3 3 3 3 3 3 IHOLD Max 150 60 150 60 200 - - - - - - - VF(ON) 2.0 1.6 2 1.8 1.6 1.95 2.2 1.5 1.55 1.4 1.4 1.35 ISURGE (A) 525 400 525 650 1255 1800 1600 5500 5500 10,000 10,000 27,000 VGFM (V) - - 15 - 20 4 - 4 5 5 5 5 VGRM (V) - - 5 - 5 5 5 5 5 5 5 5 Mtg Torque - - - - 30 (3.33) 130 (14.46) 130 (14.46) 360 (40.06) 1400 Lbs (6.2 KN) 360 (40.06) 2400 LBS (10.7KN) 5500 Lbs (24.5KN) Thread Size - - - - 1/4-28 1/2-20 1/2-20 3/4-16 - 3/4-16 - - Silicon Controlled Rectifiers (For Phase Control Applications) DC or Pk Volts VDRM IT RMS Maximum Forward Current Amps (All Conducting Angles) 40A 50A 55A 80A 125A 275A 470A 550A 850A 1800A Package Type Case Style TO3 Isolated Flange TO218 Isolated TO220 TO218 TO65 TO94 TO83 TO93 Hockey Puck 1.65” Dia TO118 Hockey Puck 2.3” Dia Hockey Puck 2.9” Dia Page 26-40 Semiconductors 600 5351 5360 5368 5371 5374 5380 5377 5386 1200 5369 5372 5375 5381 5378 5387 IGT Max 50mA 180mA 150mA 150mA 150mA 150mA 150mA 150mA VGT Max (V) 2 3 3 3 3 3 3 3 IHOLDMax (mA) 100 150 - - - - - - VF(on) Max (V) 2.06 2.05 3.2 3.3 1.85 1.85 1.45 1.45 ISURGE (A) 90 180 1400 1400 4500 4500 8000 8000 "Repetitive di/dt Amps/us Max" - - 150 150 300 300 400 400 "Non-Repetitive di/dt Amps/ns Max" 500 400 800 800 800 800 500 800 dv/dt Volts/μs Max 400 (Typ) 200 200 200 300 300 300 300 Turn-Off tq/μs Max 2.9 (Typ) 10 10 10 10 15 25 25 "Mounting Torque in.lb (m.N)" - 30 (3.33) 130 (14.46) 130 (14.46) 360 (40.06) 1400 lbs (6.2 kN) 360 (40.06) 2400 lbs (10.7 kN) Thread Size - 1/4-28 UNF-2A 1/2-20 UNF-2A 1/2-20 UNF-2A 3/4-16 UNF-2A - 3/4-16 UNF-2A - DC or Pk Volts VDRM IT RMS Maximum Forward Current Amps (All Conducting Angles) 5A 35A 125A 275A 400A 475A 700A Package Type Case Style TO66 TO83 TO94 Hockey Puck 1.65” Dia TO118 Hockey Puck 2.3” Dia TO48 TO93 Silicon Controlled Rectifiers (For High Speed Switching) Cross Reference NTE Semiconductors at: http://nte01.nteinc.com/nte/NTExRefSemiProd.nsf/$$Search?OpenForm Page 26-41 Semiconductors 1V010 8.5mm 10 12 0.8 250 18 45 0.25 2V010 16mm 10 12 3.5 1000 18 45 0.60 1V014 8.5mm 14 18 1.2 250 22 55 0.25 2V014 16mm 14 18 4.0 1000 22 55 0.60 1V015 8.5mm 15 20 1.0 250 24 52 0.25 2V015 16mm 15 20 4.5 1000 24 48 0.60 1V017 8.5mm 17 22 1.3 250 27 60 0.25 2V017 16mm 17 22 5.0 1000 27 60 0.60 1V020 8.5mm 20 26 1.5 250 33 70 0.25 2V020 16mm 20 26 6.0 1000 33 70 0.60 1V025 8.5mm 25 31 1.7 250 39 80 0.25 2V025 16mm 25 31 7.0 1000 39 80 0.60 1V030 8.5mm 30 38 2.3 250 47 95 0.25 230 Deflection Circuit of TV 700 8 90 2 50 1.8 100 - TO66 231 Deflection Circuit of TV 600 8 90 2 50 3.8 100 - TO66 314 Power Regulating Switch 400 12.5 200 2 40 20 Typ 50 5 TO3 Metal Oxide Varistor TO66 Silicon Controlled Rectifiers (For High Speed Switching Applications) TO3 NTE Type Number VDRM Description and Application ITRMS ITSM Package Style/Diag. Number Repetitive Peak Forward Off-State Voltage (V) RMS On- State Current (Amps) Peak Forward Surge Current (Amps) Maximum Ratings Gate Trigger Voltage (Volts) Gate Trigger Current (mA) VGT IGT Turn-Off Time (μs) toff Holding Current (mA) IHOLD Typical Reverse Recovery Time (μs) trr NTE Type Number Vm (AC) Case Diameter WTM RMS Voltage (Volts) DC Voltage (Volts) Energy (10/1000μs) (Joules) Maximum Ratings (TA=25ºC) Peak Current (8/20μs) (Amps) ITM Nom. Varistor Volt.@1 mA DC Test Current (V) VNOM Max. Clamping Volt.,Vc @Test Current (8/20μs)(V) Vm (DC) VCL PD Continuous Transient Characteristics Transient Pwr. Dissipation (Watts) Page 26-42 Semiconductors 2V030 16mm 30 38 8.5 1000 47 95 0.60 1V035 8.5mm 35 45 2.7 250 56 110 0.25 2V035 16mm 35 45 10.0 1000 56 110 0.60 1V040 8.5mm 43 55 3.2 250 68 135 0.25 2V040 16mm 43 55 13.0 1000 68 135 0.60 1V050 8.5mm 52 6 4.0 250 82 150 0.25 2V050 16mm 52 66 14.0 1000 82 150 0.60 1V060 8.5mm 63 80 6.0 1200 100 175 0.25 2V060 16mm 63 80 18.0 4500 100 175 0.60 1V075 8.5mm 75 95 5.0 1200 120 205 0.25 2V075 16mm 75 95 21.0 4500 120 205 0.60 1V095 8.5mm 95 125 7.0 1200 150 250 0.25 2V095 16mm 95 125 29.0 4500 150 250 0.60 1V115 8.5mm 115 150 10.0 1200 171 295 0.25 2V115 16mm 115 150 35.0 4500 171 300 0.60 1V130 8.5mm 135 180 10.0 1200 216 355 0.25 524V13 23mm 135 180 72.0 6500 216 355 1.00 1V150 8.5mm 160 210 10.0 1200 240 410 0.25 2V150 16mm 160 210 40.0 4500 240 410 0.60 524V15 23mm 160 210 80.0 6500 240 410 1.00 1V175 8.5mm 170 225 12.0 1200 270 450 0.25 524V17 23mm 170 225 90.0 6500 270 450 1.00 1V250 8.5mm 240 320 20.0 1200 390 630 0.25 2V250 16mm 240 320 70.0 4500 390 630 0.60 524V25 23mm 240 320 129.0 6500 390 630 1.00 1V275 8.5mm 260 330 20.0 1200 430 685 0.25 2V275 16mm 260 330 72.0 4500 430 685 0.60 524V27 23mm 260 330 135.0 6500 430 685 1.00 Metal Oxide Varistor (cont.) NTE Type Number Vm (AC) Case Diameter WTM RMS Voltage (Volts) DC Voltage (Volts) Energy (10/1000μs) (Joules) Maximum Ratings (TA=25ºC) Peak Current (8/20μs) (Amps) ITM Nom. Varistor Volt.@1 mA DC Test Current (V) VNOM Max. Clamping Volt.,Vc @Test Current (8/20μs)(V) Vm (DC) VCL PD Continuous Transient Characteristics Transient Pwr. Dissipation (Watts) Page 26-43 Semiconductors IC Sockets (Stamp Pins) Tin plated, stamped contacts. Pin spacing 0.1" (2.54mm). Two different row widths. Narrow: A= 7.62mm (0.3"). Wide: A= 15.20mm (0.6"). Multi Row Part #: SCS-38 Narrow (0.3") Part #’s: SCS-06, SCS-08, SCS-14, SCS-16, SCS-18, SCS-20, SCS-22, SCS-24, SCS-28, SCS-34 Pin Sockets (Machined Pins) Gold plated, 4 finger beryllium copper contacts. Tin plated outer sleeve. Pin spacing is 0.10" (2.54mm). Notched sides for cleaner breaking. Part #’s: HQ-1X16, HQ-1X20, HQ-1X30, HQ-1X40, HQ-2X30 Wire Wrap Pins Part #: HQA-1X40 IC Extractor Part #: SCS-IC-XTR Dual Wipe Standard I.C. Sockets 30% glass filled polyester UL94V-0 insulator. Contacts are phosphor bronze with 50 microinches hot tin dip. Bulk. Part Number Pins 39-008-0 8-position 39-014-0 14-position 39-016-0 16-position 39-018-0 18-position 39-024-0 24-position 39-028-0 28-position 39-020-0 20-position 39-032-0 32-position Wide (0.6") Part #’s: SCL-24, SCL-32, SCL-28, SCL-40 Thru Holes Part #’s: PLCC-28, PLCC-32, PLCC-44, PLCC-52, PLCC-68, PLCC- 84 Tin Plated Contacts Part #: PLCC-28T Chip Carriers Gold plated contacts and solder post. Plastic leaded chip carrier and surface mount chip carrier. Surface Mount Part #’s: SMT-28 NT, SMT-32 NT, SMT-44 NT, SMT-52 NT, SMT- 68 NT, SMT-84 NT Regular Part #’s: SQ-06, SQ-08, SQ-14, SQ-16, SQ-18, SQ-20, SQ-22, SQ-24, SQ-24N, SQ-28, SQ-40 Wire Wrap Part #’s: SQA-06, SQA-08, SQA-14, SQA-16, SQA-18, SQA-20, SQA-24, SQA-28, SQA-40 IC Socket (Machined Pins) Gold plated, 4 finger beryllium copper contacts. Tin plated outer sleeve. Pin spacing is 8-24 = 2.54mm x 7.62mm (0.1" x 0.3") and 24-40 = 2.54mm x 15.24mm (0.1" x 0.6"). Machined Contact I.C. Sockets 94V-0 PBT insulator 15 micro inch gold plated contact area. Part Number Type Pins 39-108-0 Bulk 8-position 39-114-0 Bulk 14-position 39-116-0 Bulk 16-position 39-140-0 Bulk 40-position P.C. Board Mount Dip IC Sockets Part Number Position 70-4608 8 70-4614 14 70-4616 16 70-4618 18 70-4620 20 70-4624 24 70-4628 28 70-4640 40 Features: 8, 14 ,16, 18, 20, 24, 28 and 40 contact available. Tin plated contact. Industry standard spacing. Specification: Contact resistance: 30m ohm max. at DC 100mA. Insulator resistance: 1000m ohm min. at DC 500V; Current rating: 1 amp dielectric withstanding. Voltage: AC 500V for one minute; Operating temperature: -55°C to 105°C. Contact: Phosphor bronze. Housing: PBT and 30% glass fiber (UL-94V-0). 39-040-0 40-position © 2010 Microchip Technology Inc. DS51775B-page 1 Overview The PIC32 USB Plug-In Module (PIM) demonstrates the capabilities of PIC32MX460F512 and PIC32MX795F512 microcontrollers using the Explorer 16 Development Board and the PICtail™ Plus Daughter Boards. This PIM supports USB device, embedded host, and On-The-Go (OTG) designs, when used in conjunction with the Explorer 16 and the USB PICtail Plus Daughter Board. The pinout for the PIC32 family of USB On-The-Go microcontrollers varies slightly from that of the General Purpose (GP) family. Therefore, on the USB PIM (MA320002), signals from the MCU are routed differently than those on the GP PIM (MA320001). This routing is intended to maximize the compatibility of the USB PIM with the Explorer 16 and its PICtail Plus daughter cards, therefore, some signals have changed location. See Figure 1 and Figure 3 for an overview of the PIM routing changes. Refer the PIM schematics (see Figure 2 and Figure 4 and the PIC32MX4XX (DS61143) and PIC32MX5XX/ 6XX/7XX (DS61156) family data sheets for additional details. FIGURE 1: USB PIM INTERCONNECT DIAGRAM FOR PIC32MX460F512 DEVICES RA14/SCL1 (66) *D-/RG3 (56) *VBUS (54) *USBID/RF3 (51) RB8/AN8 (32) *VBUSON/RB5 (20) *D+/RG2 (57) PIC32MX460F512 USB PICtail™ Plus RG2/SCL1 (57) D+ DVBUS USBID RA15/SDA1 (67) RA15 (67) RG3/SDA1 (56) RC4/*SDI1 (9) RC4 (9) RF7/SDI1 (54) RF8/*U1TX (53) U1TX/RF3 (51) RE8/INT1 (18) RE8/INT1 (18) RA14/INT3 (66) (32) [OVERCURRENT] (96) SHDN Explorer 16 (95) (89) (90) (1) (65) (60) (62) (68) (43) (67) J1/P1 P9/J4 RG15 (1) RD9 (69) RB2/C2IN-/AN2 (23) RB5/C1IN+/AN5 (20) RD9/SS1 (69) RB2/SS1 (23) RD0/*SDO1 (72) RF8/SDO1 (53) RD0 (72) *VUSB (55) VDD RG0 (90) NO CONNECT RG1 (89) NO CONNECT RG14 (95) NO CONNECT RG12 (96) NO CONNECT RD10/SCK1 (70) RD10 (70) RF6/SCK1 (55) RG13 (97) [PGOOD] (97) (66) RB6 (26) RB6 (26) Explorer 16 USB PIM RB0/CN2 (25) J10 RB0 (25) Legend: *xxx - Pin function changed from the PIC32MX3XX family. [xxx] - Pin function is optional, based on the USB PICtail™ Plus (xx) pin number. Pins not listed are unchanged from the PIC32MX3XX family. Revision History: REVB: Initial release REVC: Removed short between RB6 and RB8 REV1: Added Jumper J10 to allow CN2 to be used with PGOOD. PIC32MX PIC32 USB Plug-In Module for the Explorer 16 Development Board PIC32MX DS51775B-page 2 © 2010 Microchip Technology Inc. FIGURE 2: PIC32 USB PLUG-IN MODULE SCHEMATIC FOR PIC32MX460F512 DEVICES U1 PIC32MX460F512L © 2010 Microchip Technology Inc. DS51775B-page 3 PIC32MX FIGURE 3: USB PIM INTERCONNECT DIAGRAM FOR PIC32MX795F512 DEVICES RA14/SCL1 (66) *D-/RG3 (56) *VBUS (54) *USBID/RF3 (51) *RB8/AN8 (32) *VBUSON/RB5 (20) *D+/RG2 (57) PIC32MX795F512 USB PICtail™ Plus RG2/SCL1 (57) D+ DVBUS USBID RA15/SDA1 (67) RA15 (67) RG3/SDA1 (56) RC4/*SDI1 (9) RC4 (9) RF7/SDI1 (54) RF8/*U1TX (53) U1TX/RF3 (51) RE8/INT1 (18) RE8/INT1 (18) RA14/INT3 (66) (32) [OVERCURRENT] (96) [SHDN] Explorer 16 (95) (89) (90) (1) (65) (60) (62) (68) (43) (67) J1/P1 P9/J4 RG15 (1) RD9 (69) RB2/C2IN-/AN2 (23) RB5/C1IN+/AN5 (20) RD9/SS1 (69) RB2/SS1 (23) RD0/*SDO1 (72) RF8/SDO1 (53) RD0 (72) *VUSB (55) VDD RG0/C2RX (90) NO CONNECT RG1/C2TX (89) NO CONNECT RG14 (95) NO CONNECT RG12 (96) NO CONNECT RD10/SCK1 (70) RD10 (70) RF6/SCK1 (55) *RG13 (97) [PGOOD] (97) (66) Explorer 16 USB PIM RB0 (25) J10 RB0 (25) VCAP (85) C6 10 μF VCAP (85) Legend: *xxx - Pin function changed from the PIC32MX3XX family. [xxx] - Pin function is optional, based on the USB PICtail™ Plus (xx) pin number. Pins not listed are unchanged from the PIC32MX3XX family. Revision History: REV1: Initial release PIC32MX DS51775B-page 4 © 2010 Microchip Technology Inc. FIGURE 4: PIC32 USB PLUG-IN MODULE SCHEMATIC FOR PIC32MX795F512 DEVICES U1 PIC32MX795F512L © 2010 Microchip Technology Inc. DS51775B-page 5 PIC32MX REVISION HISTORY Revision A (October 2008) This is the original released version of the document. Revision B (April 2010) This revision includes the following updates: • Revised the “Overview” section • Updated Figure 1 and Figure 2 • Updated document to include information on the PIC32MX795F512 device • Added Figure 3 and Figure 4 PIC32MX DS51775B-page 6 © 2010 Microchip Technology Inc. NOTES: © 2010 Microchip Technology Inc. DS51775B-page 7 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-123-9 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51775B-page 8 © 2010 Microchip Technology Inc. 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As defined by IEC 60539, NTC (Negative Temperature Coefficient) thermistors are thermally sensitive semiconductor resistors which show a decrease in resistance as temperature increases.  SMD NTCs are designed for temperature measurement and compensation. Benefits for customer applications  Available case sizes 0402, 0603 and 0805 (1206 upon request)  Resistance values 1 kV up to 680 kV  Operating temperature range: –55 … +125 °C  Excellent long-term aging stability in high-temperature environment  Nickel barrier termination and lead-free solderability Important information: Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products. We expressly point out that these statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. It is incumbent on the customer to check and decide whether a product is suitable for use in a particular application. This publication is only a brief product survey which may be changed from time to time. Our products are described in detail in our data sheets. The Important notes (www.epcos.com /ImportantNotes) and the product-specific Cautions and warnings must be observed. All relevant information is available through our sales offices. B57221 V2472J060 B57230 V2103F260 B57221 V2103J060 B57261 V2223J060 B57221 V2473J060 B57321 V2102J060 B57301 V2472J060 B57330 V2103F260 B57321 V2103J060 B57371 V2103J060 B57321 V2223J060 B57371 V2223J060 B57321 V2473J060 B57371 V2473J060 B57371 V2104J060 B57371 V2474J060 B57421 V2102J062 B57421 V2222J062 B57401 V2472J062 B57471 V2472J062 B57421 V2103J062 B57471 V2103J062 B57421 V2223J062 B57471 V2223J062 B57471 V2473J062 B57471 V2104J062 B57471 V2474J062 Components Product range Electrical specifications and ordering codes EIA R25 DRR B25/50 B25/85 B25/100 Ordering code case size [kV] % [K] [K] [K] Case size 0402 0402 4.7 ±5 3940 3980 4000 ±3% B57221V2472J060 0402 10 ±1 3380 3435 3455 ±1% B57230V2103F260 0402 10 ±5 3940 3980 4000 ±3% B57221V2103J060 0402 22 ±5 4473 4548 4575 ±3% B57261V2223J060 0402 47 ±5 3940 3980 4000 ±3% B57221V2473J060 Case size 0603 0603 1 ±3, ±5 3940 3980 4000 ±3% B57321V2102+060 0603 4.7 ±3, ±5 3590 3635 3650 ±3% B57301V2472+060 0603 10 ±1 3380 3435 3455 ±1% B57330V2103F260 0603 10 ±3, ±5 3940 3980 4000 ±3% B57321V2103+060 0603 10 ±3, ±5 4386 4455 4480 ±3% B57371V2103+060 0603 22 ±3, ±5 3940 3980 4000 ±3% B57321V2223+060 0603 22 ±3, ±5 4386 4455 4480 ±3% B57371V2223+060 0603 47 ±3, ±5 3940 3980 4000 ±3% B57321V2473+060 0603 47 ±3, ±5 4386 4455 4480 ±3% B57371V2473+060 0603 100 ±3, ±5 4386 4455 4480 ±3% B57371V2104+060 0603 470 ±3, ±5 4386 4455 4480 ±3% B57371V2474+060 Case size 0805 0805 1 ±3, ±5 3940 3980 4000 ±3% B57421V2102+062 0805 2.2 ±3, ±5 3940 3980 4000 ±3% B57421V2222+062 0805 4.7 ±3, ±5 3590 3635 3650 ±3% B57401V2472+062 0805 4.7 ±3, ±5 4386 4455 4480 ±3% B57471V2472+062 0805 10 ±3, ±5 3940 3980 4000 ±3% B57421V2103+062 0805 10 ±3, ±5 4386 4455 4480 ±3% B57471V2103+062 0805 22 ±3, ±5 3940 3980 4000 ±3% B57421V2223+062 0805 22 ±3, ±5 4386 4455 4480 ±3% B57471V2223+062 0805 47 ±3, ±5 4386 4455 4480 ±3% B57471V2473+062 0805 100 ±3, ±5 4386 4455 4480 ±3% B57471V2104+062 0805 470 ±3, ±5 4386 4455 4480 ±3% B57471V2474+062 See enclosed CD-ROM for data sheets and further details. + = Resistance tolerance: H = ±3%, J = ±5% Application examples for SMD NTC thermistors Diagrams for LED, power amplifier and battery pack LED LED lifetime is extended if the current through the LED is controlled by using a NTC thermistor as temperature sensor. 10 kV ±5% 10 kV ±1% 100 kV ±5% Power amplifier Compensation circuit of a power amplifier using a NTC thermistor as temperature sensor. Battery pack Schematic drawing of the charging control unit of a battery pack using NTC thermistors as temperature sensors. 10 kV ±5% 10 kV ±1% Further applications: Temperature sensing and compensation in e.g.  Household electronics (refrigerators and deep-freezers, washing machines, water boilers, LED lighting etc.)  Heating and air-conditioning  Industrial electronics  Computer and consumer electronics  Telecommunications © EPCOS AG · A Member of TDK-EPC Corporation Edition 07/2012 · Ordering No. B57999V2999J099 · Printed in Germany · SO 0712.5 1. General description The PCA9555 is a 24-pin CMOS device that provides 16 bits of General Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O configuration, and smaller packaging. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc. The PCA9555 consists of two 8-bit Configuration (Input or Output selection); Input, Output and Polarity Inversion (active HIGH or active LOW operation) registers. The system master can enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for each Input or Output is kept in the corresponding Input or Output register. The polarity of the read register can be inverted with the Polarity Inversion register. All registers can be read by the system master. Although pin-to-pin and I2C-bus address compatible with the PCF8575, software changes are required due to the enhancements, and are discussed in Application Note AN469. The PCA9555 open-drain interrupt output is activated when any input state differs from its corresponding input port register state and is used to indicate to the system master that an input state has changed. The power-on reset sets the registers to their default values and initializes the device state machine. Three hardware pins (A0, A1, A2) vary the fixed I2C-bus address and allow up to eight devices to share the same I2C-bus/SMBus. The fixed I2C-bus address of the PCA9555 is the same as the PCA9554, allowing up to eight of these devices in any combination to share the same I2C-bus/SMBus. 2. Features n Operating power supply voltage range of 2.3 V to 5.5 V n 5 V tolerant I/Os n Polarity Inversion register n Active LOW interrupt output n Low standby current n Noise filter on SCL/SDA inputs n No glitch on power-up n Internal power-on reset n 16 I/O pins which default to 16 inputs n 0 Hz to 400 kHz clock frequency n ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Rev. 08 — 22 October 2009 Product data sheet PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 2 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA n Six packages offered: DIP24, SO24, SSOP24, TSSOP24, HVQFN24 and HWQFN24 3. Ordering information 3.1 Ordering options Table 1. Ordering information Type number Package Name Description Version PCA9555N DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 PCA9555D SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 PCA9555DB SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 PCA9555PW TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 PCA9555BS HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 ´ 4 ´ 0.85 mm SOT616-1 PCA9555HF HWQFN24 plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 ´ 4 ´ 0.75 mm SOT994-1 Table 2. Ordering options Type number Topside mark Temperature range PCA9555N PCA9555 -40 °C to +85 °C PCA9555D PCA9555D -40 °C to +85 °C PCA9555DB PCA9555 -40 °C to +85 °C PCA9555PW PCA9555 -40 °C to +85 °C PCA9555BS 9555 -40 °C to +85 °C PCA9555HF P55H -40 °C to +85 °C PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 3 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 4. Block diagram 5. Pinning information 5.1 Pinning Remark: All I/Os are set to inputs at reset. Fig 1. Block diagram of PCA9555 PCA9555 POWER-ON RESET 002aac702 I2C-BUS/SMBus CONTROL INPUT FILTER SCL SDA VDD INPUT/ OUTPUT PORTS IO0_0 VSS 8-bit write pulse read pulse IO0_2 IO0_1 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 INPUT/ OUTPUT PORTS IO1_0 8-bit write pulse read pulse IO1_2 IO1_1 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7 INT A1 A0 A2 LP filter VDD Fig 2. Pin configuration for DIP24 Fig 3. Pin configuration for SO24 VDD SDA SCL A0 IO1_7 IO1_6 IO1_5 IO1_4 IO1_3 IO1_2 IO1_1 IO1_0 INT A1 A2 IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VSS PCA9555N 002aac697 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 INT VDD A1 SDA A2 SCL IO0_0 A0 IO0_1 IO1_7 IO0_2 IO1_6 IO0_3 IO1_5 IO0_4 IO1_4 IO0_5 IO1_3 IO0_6 IO1_2 IO0_7 IO1_1 VSS IO1_0 PCA9555D 002aac698 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 4 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 4. Pin configuration for SSOP24 Fig 5. Pin configuration for TSSOP24 Fig 6. Pin configuration for HVQFN24 Fig 7. Pin configuration for HWQFN24 INT A1 A2 IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VSS PCA9555DB 002aac699 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 VDD SDA SCL A0 IO1_7 IO1_6 IO1_5 IO1_4 IO1_3 IO1_2 IO1_1 IO1_0 VDD SDA SCL A0 IO1_7 IO1_6 IO1_5 IO1_4 IO1_3 IO1_2 IO1_1 IO1_0 INT A1 A2 IO0_0 IO0_1 IO0_2 IO0_3 IO0_4 IO0_5 IO0_6 IO0_7 VSS PCA9555PW 002aac700 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 002aac701 PCA9555BS Transparent top view IO1_3 IO0_4 IO0_5 IO1_4 IO0_3 IO1_5 IO0_2 IO1_6 IO0_1 IO1_7 IO0_0 A0 IO0_6 IO0_7 VSS IO1_0 IO1_1 IO1_2 A2 A1 VDD SDA SCL terminal 1 index area 6 13 5 14 4 15 3 16 2 17 1 18 7 8 9 10 11 12 24 23 22 21 20 19 INT 002aac881 Transparent top view IO1_3 IO0_4 IO0_5 IO1_4 IO0_3 IO1_5 IO0_2 IO1_6 IO0_1 IO1_7 IO0_0 A0 IO0_6 IO0_7 VSS IO1_0 IO1_1 IO1_2 A2 A1 INT VDD SDA SCL terminal 1 index area 6 13 5 14 4 15 3 16 2 17 1 18 7 8 9 10 11 12 24 23 22 21 20 19 PCA9555HF PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 5 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 5.2 Pin description [1] HVQFN and HWQFN package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the PCB in the thermal pad region. Table 3. Pin description Symbol Pin Description DIP24, SO24, SSOP24, TSSOP24 HVQFN24, HWQFN24 INT 1 22 interrupt output (open-drain) A1 2 23 address input 1 A2 3 24 address input 2 IO0_0 4 1 port 0 input/output IO0_1 5 2 IO0_2 6 3 IO0_3 7 4 IO0_4 8 5 IO0_5 9 6 IO0_6 10 7 IO0_7 11 8 VSS 12 9[1] supply ground IO1_0 13 10 port 1 input/output IO1_1 14 11 IO1_2 15 12 IO1_3 16 13 IO1_4 17 14 IO1_5 18 15 IO1_6 19 16 IO1_7 20 17 A0 21 18 address input 0 SCL 22 19 serial clock line SDA 23 20 serial data line VDD 24 21 supply voltage PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 6 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6. Functional description Refer to Figure 1 “Block diagram of PCA9555”. 6.1 Device address 6.2 Registers 6.2.1 Command byte The command byte is the first byte to follow the address byte during a write transmission. It is used as a pointer to determine which of the following registers will be written or read. Fig 8. PCA9555 device address R/W 002aac219 0 1 0 0 A2 A1 A0 programmable slave address fixed Table 4. Command byte Command Register 0 Input port 0 1 Input port 1 2 Output port 0 3 Output port 1 4 Polarity Inversion port 0 5 Polarity Inversion port 1 6 Configuration port 0 7 Configuration port 1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 7 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.2.2 Registers 0 and 1: Input port registers This register is an input-only port. It reflects the incoming logic levels of the pins, regardless of whether the pin is defined as an input or an output by Register 3. Writes to this register have no effect. The default value ‘X’ is determined by the externally applied logic level. 6.2.3 Registers 2 and 3: Output port registers This register is an output-only port. It reflects the outgoing logic levels of the pins defined as outputs by Registers 6 and 7. Bit values in this register have no effect on pins defined as inputs. In turn, reads from this register reflect the value that is in the flip-flop controlling the output selection, not the actual pin value. 6.2.4 Registers 4 and 5: Polarity Inversion registers This register allows the user to invert the polarity of the Input port register data. If a bit in this register is set (written with ‘1’), the Input port data polarity is inverted. If a bit in this register is cleared (written with a ‘0’), the Input port data polarity is retained. Table 5. Input port 0 Register Bit 7 6 5 4 3 2 1 0 Symbol I0.7 I0.6 I0.5 I0.4 I0.3 I0.2 I0.1 I0.0 Default X X X X X X X X Table 6. Input port 1 register Bit 7 6 5 4 3 2 1 0 Symbol I1.7 I1.6 I1.5 I1.4 I1.3 I1.2 I1.1 I1.0 Default X X X X X X X X Table 7. Output port 0 register Bit 7 6 5 4 3 2 1 0 Symbol O0.7 O0.6 O0.5 O0.4 O0.3 O0.2 O0.1 O0.0 Default 1 1 1 1 1 1 1 1 Table 8. Output port 1 register Bit 7 6 5 4 3 2 1 0 Symbol O1.7 O1.6 O1.5 O1.4 O1.3 O1.2 O1.1 O1.0 Default 1 1 1 1 1 1 1 1 Table 9. Polarity Inversion port 0 register Bit 7 6 5 4 3 2 1 0 Symbol N0.7 N0.6 N0.5 N0.4 N0.3 N0.2 N0.1 N0.0 Default 0 0 0 0 0 0 0 0 Table 10. Polarity Inversion port 1 register Bit 7 6 5 4 3 2 1 0 Symbol N1.7 N1.6 N1.5 N1.4 N1.3 N1.2 N1.1 N1.0 Default 0 0 0 0 0 0 0 0 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 8 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.2.5 Registers 6 and 7: Configuration registers This register configures the directions of the I/O pins. If a bit in this register is set (written with ‘1’), the corresponding port pin is enabled as an input with high-impedance output driver. If a bit in this register is cleared (written with ‘0’), the corresponding port pin is enabled as an output. Note that there is a high value resistor tied to VDD at each pin. At reset, the device's ports are inputs with a pull-up to VDD. 6.3 Power-on reset When power is applied to VDD, an internal power-on reset holds the PCA9555 in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9555 registers and SMBus state machine will initialize to their default states. The power-on reset typically completes the reset and enables the part by the time the power supply is above VPOR. However, when it is required to reset the part by lowering the power supply, it is necessary to lower it below 0.2 V. 6.4 I/O port When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a high-impedance input with a weak pull-up to VDD. The input voltage may be raised above VDD to a maximum of 5.5 V. If the I/O is configured as an output, then either Q1 or Q2 is on, depending on the state of the Output Port register. Care should be exercised if an external voltage is applied to an I/O configured as an output because of the low-impedance path that exists between the pin and either VDD or VSS. Table 11. Configuration port 0 register Bit 7 6 5 4 3 2 1 0 Symbol C0.7 C0.6 C0.5 C0.4 C0.3 C0.2 C0.1 C0.0 Default 1 1 1 1 1 1 1 1 Table 12. Configuration port 1 register Bit 7 6 5 4 3 2 1 0 Symbol C1.7 C1.6 C1.5 C1.4 C1.3 C1.2 C1.1 C1.0 Default 1 1 1 1 1 1 1 1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 9 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.5 Bus transactions 6.5.1 Writing to the port registers Data is transmitted to the PCA9555 by sending the device address and setting the least significant bit to a logic 0 (see Figure 8 “PCA9555 device address”). The command byte is sent after the address and determines which register will receive the data following the command byte. The eight registers within the PCA9555 are configured to operate as four register pairs. The four pairs are Input Ports, Output Ports, Polarity Inversion Ports, and Configuration Ports. After sending data to one register, the next data byte will be sent to the other register in the pair (see Figure 10 and Figure 11). For example, if the first byte is sent to Output Port 1 (register 3), then the next byte will be stored in Output Port 0 (register 2). There is no limitation on the number of data bytes sent in one write transmission. In this way, each 8-bit register may be updated independently of the other registers. At power-on reset, all registers return to default values. Fig 9. Simplified schematic of I/Os VDD I/O pin output port configuration register data register D Q CK Q data from shift register write configuration pulse output port register D Q write pulse CK polarity inversion register D Q CK data from shift register write polarity pulse input port register D Q read pulse CK input port register data polarity inversion register data 002aac703 FF data from shift register FF FF FF Q1 Q2 VSS to INT 100 kW xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 10 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 10. Write to Output port registers S 0 1 0 0 A2 A1 A0 0 A START condition R/W acknowledge from slave 002aac220 A SCL SDA A write to port data out from port 0 P tv(Q) 1 2 3 4 5 6 7 8 9 command byte data to port 0 DATA 0 slave address 0 0 0 0 0 0 1 0 STOP condition 0.7 0.0 acknowledge from slave acknowledge from slave data to port 1 1.7 DATA 1 1.0 A data out from port 1 tv(Q) DATA VALID Fig 11. Write to Configuration registers S 0 1 0 0 A2 A1 A0 0 A START condition R/W acknowledge from slave 002aac221 A SCL SDA A P 1 2 3 4 5 6 7 8 9 command byte data to register DATA 0 slave address 0 0 0 0 0 1 1 0 STOP condition MSB LSB acknowledge from slave acknowledge from slave data to register DATA 1 MSB LSB A PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 11 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.5.2 Reading the port registers In order to read data from the PCA9555, the bus master must first send the PCA9555 address with the least significant bit set to a logic 0 (see Figure 8 “PCA9555 device address”). The command byte is sent after the address and determines which register will be accessed. After a restart, the device address is sent again, but this time the least significant bit is set to a logic 1. Data from the register defined by the command byte will then be sent by the PCA9555 (see Figure 12, Figure 13 and Figure 14). Data is clocked into the register on the falling edge of the acknowledge clock pulse. After the first byte is read, additional bytes may be read but the data will now reflect the information in the other register in the pair. For example, if you read Input Port 1, then the next byte read would be Input Port 0. There is no limitation on the number of data bytes received in one read transmission but the final byte received, the bus master must not acknowledge the data. Remark: Transfer can be stopped at any time by a STOP condition. Fig 12. Read from register S A START condition R/W acknowledge from slave 002aac222 A acknowledge from slave SDA A P acknowledge from master DATA (first byte) slave address STOP condition S (repeated) START condition (cont.) (cont.) 0 1 0 0 A2 A1 A0 1 A R/W acknowledge from slave slave address at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter NA no acknowledge from master 0 1 0 0 A2 A1 A0 0 COMMAND BYTE data from lower or upper byte of register MSB LSB DATA (last byte) data from upper or lower byte of register MSB LSB xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 12 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read Input Port register). Fig 13. Read Input port register, scenario 1 S 0 1 0 0 A2 A1 A0 1 A START condition R/W acknowledge from slave 002aac223 A SCL SDA A read from port 0 P 1 2 3 4 5 6 7 8 9 slave address I0.x STOP condition acknowledge from master I1.x acknowledge from master A I0.x acknowledge from master 1 I1.x non acknowledge from master data into port 0 read from port 1 data into port 1 INT 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 tv(INT_N) trst(INT_N) xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 13 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It is assumed that the command byte has previously been set to ‘00’ (read Input Port register). Fig 14. Read Input port register, scenario 2 S 0 1 0 0 A2 A1 A0 1 A START condition R/W acknowledge from slave 002aac224 A SCL SDA A read from port 0 P 1 2 3 4 5 6 7 8 9 slave address I0.x STOP condition acknowledge from master I1.x acknowledge from master A I0.x acknowledge from master 1 I1.x non acknowledge from master data into port 0 read from port 1 data into port 1 INT tv(INT_N) trst(INT_N) DATA 00 DATA 10 DATA 03 DATA 12 DATA 00 DATA 01 th(D) th(D) DATA 02 tsu(D) DATA 03 tsu(D) DATA 10 DATA 11 DATA 12 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 14 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 6.5.3 Interrupt output The open-drain interrupt output is activated when one of the port pins changes state and the pin is configured as an input. The interrupt is deactivated when the input returns to its previous state or the Input Port register is read (see Figure 13). A pin configured as an output cannot cause an interrupt. Since each 8-bit port is read independently, the interrupt caused by Port 0 will not be cleared by a read of Port 1 or the other way around. Remark: Changing an I/O from an output to an input may cause a false interrupt to occur if the state of the pin does not match the contents of the Input Port register. 7. Characteristics of the I2C-bus The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 15). 7.1.1 START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 16). Fig 15. Bit transfer mba607 data line stable; data valid change of data allowed SDA SCL Fig 16. Definition of START and STOP conditions mba608 SDA SCL P STOP condition S START condition PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 15 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 7.2 System configuration A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Figure 17). 7.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold time must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. Fig 17. System configuration 002aaa966 MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER SDA SCL I2C-BUS MULTIPLEXER SLAVE Fig 18. Acknowledgement on the I2C-bus 002aaa987 S START condition 1 2 8 9 clock pulse for acknowledgement not acknowledge acknowledge data output by transmitter data output by receiver SCL from master PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 16 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 8. Application design-in information Device address configured as 0100 000xb for this example. IO0_0, IO0_2, IO0_3 configured as outputs. IO0_1, IO0_4, IO0_5 configured as inputs. IO0_6, IO0_7, and IO1_0 to IO1_7 configured as inputs. Fig 19. Typical application PCA9555 IO0_0 IO0_1 SCL SDA VDD (5 V) MASTER CONTROLLER SCL SDA INT IO0_2 VDD A2 A1 A0 VDD GND INT 10 kW SUB-SYSTEM 1 (e.g., temp sensor) IO0_3 INT SUB-SYSTEM 2 (e.g., counter) RESET controlled switch (e.g., CBT device) VDD A B ENABLE SUB-SYSTEM 3 (e.g., alarm system) ALARM IO0_4 IO0_5 IO0_6 10 DIGIT NUMERIC KEYPAD VSS 002aac704 10 kW 10 kW 2 kW IO0_7 IO1_0 IO1_1 IO1_2 IO1_3 IO1_4 IO1_5 IO1_6 IO1_7 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 17 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 9. Limiting values Table 13. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage -0.5 +6.0 V VI/O voltage on an input/output pin VSS - 0.5 6 V IO output current on an I/O pin - ±50 mA II input current - ±20 mA IDD supply current - 160 mA ISS ground supply current - 200 mA Ptot total power dissipation - 200 mW Tstg storage temperature -65 +150 °C Tamb ambient temperature operating -40 +85 °C PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 18 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 10. Static characteristics [1] VDD must be lowered to 0.2 V for at least 5 ms in order to reset part. Table 14. Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = -40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDD supply voltage 2.3 - 5.5 V IDD supply current Operating mode; VDD = 5.5 V; no load; fSCL = 100 kHz - 135 200 mA Istb standby current Standby mode; VDD = 5.5 V; no load; VI = VSS; fSCL = 0 kHz; I/O = inputs - 1.1 1.5 mA Standby mode; VDD = 5.5 V; no load; VI = VDD; fSCL = 0 kHz; I/O = inputs - 0.25 1 mA VPOR power-on reset voltage[1] no load; VI = VDD or VSS - 1.5 1.65 V Input SCL; input/output SDA VIL LOW-level input voltage -0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VOL = 0.4 V 3 - - mA IL leakage current VI = VDD = VSS -1 - +1 mA Ci input capacitance VI = VSS - 6 10 pF I/Os VIL LOW-level input voltage -0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V IOL LOW-level output current VDD = 2.3 V to 5.5 V; VOL = 0.5 V [2] 8 (8 to 20) - mA VDD = 2.3 V to 5.5 V; VOL = 0.7 V [2] 10 (10 to 24) - mA VOH HIGH-level output voltage IOH = -8 mA; VDD = 2.3 V [3] 1.8 - - V IOH = -10 mA; VDD = 2.3 V [3] 1.7 - - V IOH = -8 mA; VDD = 3.0 V [3] 2.6 - - V IOH = -10 mA; VDD = 3.0 V [3] 2.5 - - V IOH = -8 mA; VDD = 4.75 V [3] 4.1 - - V IOH = -10 mA; VDD = 4.75 V [3] 4.0 - - V ILIH HIGH-level input leakage current VDD = 5.5 V; VI = VDD - - 1 mA ILIL LOW-level input leakage current VDD = 5.5 V; VI = VSS - - -100 mA Ci input capacitance - 3.7 5 pF Co output capacitance - 3.7 5 pF Interrupt INT IOL LOW-level output current VOL = 0.4 V 3 - - mA Select inputs A0, A1, A2 VIL LOW-level input voltage -0.5 - +0.3VDD V VIH HIGH-level input voltage 0.7VDD - 5.5 V ILI input leakage current -1 - +1 mA PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 19 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt [2] Each I/O must be externally limited to a maximum of 25 mA and each octal (IO0_0 to IO0_7 and IO1_0 to IO1_7) must be limited to a maximum current of 100 mA for a device total of 200 mA. [3] The total current sourced by all I/Os must be limited to 160 mA. (1) IOH = -8 mA (2) IOH = -10 mA (1) IOH = -8 mA (2) IOH = -10 mA Fig 20. VOH maximum Fig 21. VOH minimum VDD = 5.5 V; VI/O = 5.5 V; A2, A1, A0 set to logic 0. (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 22. IDD versus number of I/Os held LOW 2.0 5.0 4.0 3.0 6.0 VOH (V) VDD (V) 2.7 3.6 5.5 002aac706 (1) (2) 2.5 3.5 4.5 VOH (V) 1.5 VDD (V) 2.3 3.0 4.75 002aac707 (1) (2) 0 1.2 0.8 0.4 1.6 IDD (mA) number of I/Os 002aac705 all 1s one 0 three 0s all 0s (1) (2) (3) PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 20 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 11. Dynamic characteristics [1] tVD;ACK = time for acknowledgement signal from SCL LOW to SDA (out) LOW. [2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. [3] Cb = total capacitance of one bus line in pF. Table 15. Dynamic characteristics Symbol Parameter Conditions Standard-mode I2C-bus Fast-mode I2C-bus Unit Min Max Min Max fSCL SCL clock frequency 0 100 0 400 kHz tBUF bus free time between a STOP and START condition 4.7 - 1.3 - ms tHD;STA hold time (repeated) START condition 4.0 - 0.6 - ms tSU;STA set-up time for a repeated START condition 4.7 - 0.6 - ms tSU;STO set-up time for STOP condition 4.0 - 0.6 - ms tVD;ACK data valid acknowledge time [1] 0.3 3.45 0.1 0.9 ms tHD;DAT data hold time 0 - 0 - ns tVD;DAT data valid time [2] 300 - 50 - ns tSU;DAT data set-up time 250 - 100 - ns tLOW LOW period of the SCL clock 4.7 - 1.3 - ms tHIGH HIGH period of the SCL clock 4.0 - 0.6 - ms tf fall time of both SDA and SCL signals - 300 20 + 0.1Cb [3] 300 ns tr rise time of both SDA and SCL signals - 1000 20 + 0.1Cb [3] 300 ns tSP pulse width of spikes that must be suppressed by the input filter - 50 - 50 ns Port timing tv(Q) data output valid time - 200 - 200 ns tsu(D) data input set-up time 150 - 150 - ns th(D) data input hold time 1 - 1 - ms Interrupt timing tv(INT_N) valid time on pin INT - 4 - 4 ms trst(INT_N) reset time on pin INT - 4 - 4 ms PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 21 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 12. Test information Fig 23. Definition of timing on the I2C-bus tBUF tSP tHD;STA P S P tLOW tr tHD;DAT tf tHIGH tSU;DAT tSU;STA Sr tHD;STA tSU;STO SDA SCL 002aaa986 RL = load resistor. CL = load capacitance includes jig and probe capacitance. RT = termination resistance should be equal to the output impedance of Zo of the pulse generators. Fig 24. Test circuitry for switching times Fig 25. Load circuit PULSE GENERATOR VO CL 50 pF RL 500 W 002aab284 RT VI VDD DUT VDD open GND CL 50 pF 002aac226 RL 500 W from output under test 2VDD open GND RL S1 500 W PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 22 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 13. Package outline Fig 26. Package outline SOT101-1 (DIP24) UNIT A max. 1 2 b1 c D E e MH L OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT101-1 99-12-27 03-02-13 A min. A max. b e1 ME w 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 3.9 3.4 2.54 15.24 0.25 15.80 15.24 17.15 15.90 5.1 0.51 4 2.2 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.15 0.13 0.1 0.6 0.01 0.62 0.60 0.68 0.63 0.2 0.02 0.16 0.087 051G02 MO-015 SC-509-24 MH c (e 1 ) ME A L seating plane A1 w M b1 e D A2 Z 24 1 13 12 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Z max. (1) (1) (1) DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 23 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 27. Package outline SOT137-1 (SO24) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT137-1 X 12 24 w M q A A1 A2 bp D HE Lp Q detail X E Z c L v M A 13 (A 3 ) A y 0.25 075E05 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.61 0.60 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 e 1 0 5 10 mm scale SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 99-12-27 03-02-19 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 24 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 28. Package outline SOT340-1 (SSOP24) UNIT A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 0.8 0.4 8 0 o 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 SOT340-1 MO-150 99-12-27 03-02-19 X w M q A A1 A2 bp D HE Lp Q detail X E Z e c L v M A (A 3 ) A 1 12 24 13 0.25 y pin 1 index 0 2.5 5 mm scale SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 A max. 2 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 25 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 29. Package outline SOT355-1 (TSSOP24) UNIT A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 0.4 0.3 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT355-1 MO-153 99-12-27 03-02-19 0.25 0.5 0.2 w M bp Z e 1 12 24 13 pin 1 index q A A1 A2 Lp Q detail X L (A 3 ) HE E c v M A X D A y 0 2.5 5 mm scale TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 A max. 1.1 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 26 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 30. Package outline SOT616-1 (HVQFN24) 1 0.2 0.5 UNIT A1 b Eh e y OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 4.1 3.9 Dh 2.25 1.95 y1 4.1 3.9 2.25 1.95 e1 2.5 e2 2.5 0.30 0.18 c 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT616-1 - - - MO-220 - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT616-1 HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm A(1) max. A A1 c detail X y1 C y e L Eh Dh e e1 b 7 12 24 19 18 13 6 1 X D E C B A e2 01-08-08 02-10-22 terminal 1 index area terminal 1 index area C A C v M B w M 1/2 e 1/2 e E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 27 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt Fig 31. Package outline SOT994-1 (HWQFN24) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT994-1 - - - MO-220 - - - SOT994-1 07-02-07 07-03-03 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. UNIT A(1) max mm 0.8 0.05 0.00 0.30 0.18 4.1 3.9 2.25 1.95 4.1 3.9 2.25 1.95 2.5 2.5 0.1 A1 DIMENSIONS (mm are the original dimensions) HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm 0 2.5 5 mm scale b c 0.2 D(1) Dh E(1) Eh e 0.5 e1 e2 L 0.5 0.3 v w 0.05 y 0.05 y1 0.1 B A terminal 1 index area E D detail X A A1 c b e2 e1 e e 1/2 e 1/2 e Æ v M C A B Æ w M C terminal 1 index area 6 13 7 12 18 24 19 1 L Eh Dh C y1 C y X PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 28 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 14. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 15.3 Wave soldering Key characteristics in wave soldering are: PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 29 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 32) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 16 and 17 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 32. Table 16. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ³ 350 < 2.5 235 220 ³ 2.5 220 220 Table 17. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 30 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages This text gives a very brief insight into wave, dip and manual soldering. Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 16.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds. MSL: Moisture Sensitivity Level Fig 32. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 31 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 16.4 Package related soldering information [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. 17. Abbreviations Table 18. Suitability of through-hole mount IC packages for dipping and wave soldering Package Soldering method Dipping Wave CPGA, HCPGA - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1] PMFP[2] - not suitable Table 19. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor GPIO General Purpose Input/Output I2C-bus Inter-Integrated Circuit bus SMBus System Management Bus I/O Input/Output ACPI Advanced Configuration and Power Interface LED Light Emitting Diode ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model CDM Charged Device Model PCB Printed-Circuit Board FET Field-Effect Transistor MSB Most Significant Bit LSB Least Significant Bit PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 32 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 18. Revision history Table 20. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA9555_8 20091022 Product data sheet - PCA9555_7 Modifications: • Table 2 “Ordering options”, Topside mark for TSSOP24 package, PCA9555PW, is changed from “PCA9555PW” to “PCA9555” • Figure 13 “Read Input port register, scenario 1” modified • Figure 14 “Read Input port register, scenario 2” modified • Table 14 “Static characteristics”, Table note [1] modified (added phrase “for at least 5 ms”) • updated soldering information PCA9555_7 20070605 Product data sheet - PCA9555_6 PCA9555_6 20060825 Product data sheet - PCA9555_5 PCA9555_5 (9397 750 14125) 20040930 Product data sheet - PCA9555_4 PCA9555_4 (9397 750 13271) 20040727 Product data sheet - PCA9555_3 PCA9555_3 (9397 750 10164) 20020726 Product data 853-2252 28672 of 2002 July 26 PCA9555_2 PCA9555_2 (9397 750 09818) 20020513 Product data - PCA9555_1 PCA9555_1 (9397 750 08343) 20010507 Product data - - PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 33 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 19. Legal information 19.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 19.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 October 2009 Document identifier: PCA9555_8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 6 6.1 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2.1 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2.2 Registers 0 and 1: Input port registers . . . . . . . 7 6.2.3 Registers 2 and 3: Output port registers. . . . . . 7 6.2.4 Registers 4 and 5: Polarity Inversion registers . 7 6.2.5 Registers 6 and 7: Configuration registers . . . . 8 6.3 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.4 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.5 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 9 6.5.1 Writing to the port registers . . . . . . . . . . . . . . . 9 6.5.2 Reading the port registers . . . . . . . . . . . . . . . 11 6.5.3 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 14 7 Characteristics of the I2C-bus. . . . . . . . . . . . . 14 7.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7.1.1 START and STOP conditions . . . . . . . . . . . . . 14 7.2 System configuration . . . . . . . . . . . . . . . . . . . 15 7.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 15 8 Application design-in information . . . . . . . . . 16 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 18 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 20 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 21 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22 14 Handling information. . . . . . . . . . . . . . . . . . . . 28 15 Soldering of SMD packages . . . . . . . . . . . . . . 28 15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 28 15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 28 15.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 28 15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 29 16 Soldering of through-hole mount packages . 30 16.1 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 16.2 Soldering by dipping or by solder wave . . . . . 30 16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 30 16.4 Package related soldering information . . . . . . 31 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 31 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . 32 19 Legal information . . . . . . . . . . . . . . . . . . . . . . 33 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33 19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 33 19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 33 20 Contact information . . . . . . . . . . . . . . . . . . . . 33 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Features • High Performance, Low Power Atmel® AVR® 8-Bit Microcontroller • Advanced RISC Architecture – 130 Powerful Instructions – Most Single Clock Cycle Execution – 32 × 8 General Purpose Working Registers – Fully Static Operation – Up to 16 MIPS Throughput at 16 MHz – On-Chip 2-cycle Multiplier • High Endurance Non-volatile Memory segments – 16 Kbytes of In-System Self-programmable Flash program memory – 512 Bytes EEPROM – 1 Kbytes Internal SRAM – Write/Erase cycles: 10,000 Flash/100,000 EEPROM – Data retention: 20 years at 85°C/100 years at 25°C(1) – Optional Boot Code Section with Independent Lock Bits In-System Programming by On-chip Boot Program True Read-While-Write Operation – Programming Lock for Software Security • JTAG (IEEE std. 1149.1 compliant) Interface – Boundary-scan Capabilities According to the JTAG Standard – Extensive On-chip Debug Support – Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface • Peripheral Features – 4 × 25 Segment LCD Driver – Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode – One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode – Real Time Counter with Separate Oscillator – Four PWM Channels – 8-channel, 10-bit ADC – Programmable Serial USART – Master/Slave SPI Serial Interface – Universal Serial Interface with Start Condition Detector – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator – Interrupt and Wake-up on Pin Change • Special Microcontroller Features – Power-on Reset and Programmable Brown-out Detection – Internal Calibrated Oscillator – External and Internal Interrupt Sources – Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby • I/O and Packages – 54 Programmable I/O Lines – 64-lead TQFP, 64-pad QFN/MLF and 64-pad DRQFN • Speed Grade: – ATmega169PV: 0 - 4 MHz @ 1.8V - 5.5V, 0 - 8 MHz @ 2.7V - 5.5V – ATmega169P: 0 - 8 MHz @ 2.7V - 5.5V, 0 - 16 MHz @ 4.5V - 5.5V • Temperature range: – -40°C to 85°C Industrial • Ultra-Low Power Consumption – Active Mode: 1 MHz, 1.8V: 330 μA 32 kHz, 1.8V: 10 μA (including Oscillator) 32 kHz, 1.8V: 25 μA (including Oscillator and LCD) – Power-down Mode: 0.1 μA at 1.8V – Power-save Mode: 0.6 μA at 1.8V (Including 32 kHz RTC) 8-bit Microcontroller with 16K Bytes In-System Programmable Flash ATmega169P ATmega169PV Preliminary Summary Rev. 8018PS–AVR–08/10 2 8018PS–AVR–08/10 ATmega169P 1. Pin Configurations 1.1 Pinout - TQFP/QFN/MLF Figure 1-1. 64A (TQFP)and 64M1 (QFN/MLF) Pinout ATmega169P Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. 64 63 62 47 46 48 45 44 43 42 41 40 39 38 37 36 35 33 34 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 15 17 61 60 18 59 20 58 19 21 57 22 56 23 55 24 54 25 53 26 52 27 51 29 28 50 32 49 31 30 PC0 (SEG12) VCC GND PF0 (ADC0) PF7 (ADC7/TDI) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) AREF GND AVCC (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 LCDCAP (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 (SS/PCINT8) PB0 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC2A/PCINT15) PB7 (T1/SEG24) PG3 (OC1B/PCINT14) PB6 (T0/SEG23) PG4 (OC1A/PCINT13) PB5 PC1 (SEG11) PG0 (SEG14) (SEG15) PD7 PC2 (SEG10) PC3 (SEG9) PC4 (SEG8) PC5 (SEG7) PC6 (SEG6) PC7 (SEG5) PA7 (SEG3) PG2 (SEG4) PA6 (SEG2) PA5 (SEG1) PA4 (SEG0) PA3 (COM3) PA0 (COM0) PA1 (COM1) PA2 (COM2) PG1 (SEG13) (SEG16) PD6 (SEG17) PD5 (SEG18) PD4 (SEG19) PD3 (SEG20) PD2 (INT0/SEG21) PD1 (ICP1/SEG22) PD0 (TOSC1) XTAL1 (TOSC2) XTAL2 RESET/PG5 GND VCC INDEX CORNER 3 8018PS–AVR–08/10 ATmega169P 1.2 Pinout - DRQFN Figure 1-2. 64MC (DRQFN) Pinout ATmega169P Top view Bottom view A1 B1 A2 B2 A3 B3 A4 B4 A5 B5 A6 B6 A7 B7 A8 A9 B8 A10 B9 A11 B10 A12 B11 A13 B12 A14 B13 A15 B14 A16 B15 A17 A25 B22 A24 B21 A23 B20 A22 B19 A21 B18 A20 B17 A19 B16 A18 A34 B30 A33 B29 A32 B28 A31 B27 A30 B26 A29 B25 A28 B24 A27 B23 A26 A1 B1 A2 B2 A3 B3 A4 B4 A5 B5 A6 B6 A7 B7 A8 A25 B22 A24 B21 A23 B20 A22 B19 A21 B18 A20 B17 A19 B16 A18 A17 B15 A16 B14 A15 B13 A14 B12 A13 B11 A12 B10 A11 B9 A10 B8 A9 A26 B23 A27 B24 A28 B25 A29 B26 A30 B27 A31 B28 A32 B29 A33 B30 A34 Table 1-1. DRQFN-64 Pinout ATmega169P. A1 PE0 A9 PB7 A18 PG1 (SEG13) A26 PA2 (COM2) B1 VLCDCAP B8 PB6 B16 PG0 (SEG14) B23 PA3 (COM3) A2 PE1 A10 PG3 A19 PC0 (SEG12) A27 PA1 (COM1) B2 PE2 B9 PG4 B17 PC1 (SEG11) B24 PA0 (COM0) A3 PE3 A11 RESET A20 PC2 (SEG10) A28 VCC B3 PE4 B10 VCC B18 PC3 (SEG9) B25 GND A4 PE5 A12 GND A21 PC4 (SEG8) A29 PF7 B4 PE6 B11 XTAL2 (TOSC2) B19 PC5 (SEG7) B26 PF6 A5 PE7 A13 XTAL1 (TOSC1) A22 PC6 (SEG6) A30 PF5 B5 PB0 B12 PD0 (SEG22) B20 PC7 (SEG5) B27 PF4 A6 PB1 A14 PD1 (SEG21) A23 PG2 (SEG4) A31 PF3 B6 PB2 B13 PD2 (SEG20) B21 PA7 (SEG3) B28 PF2 A7 PB3 A15 PD3 (SEG19) A24 PA6 (SEG2) A32 PF1 B7 PB5 B14 PD4 (SEG18) B22 PA4 (SEG0) B29 PF0 A8 PB4 A16 PD5 (SEG17) A25 PA5 (SEG1) A33 AREF B15 PD7 (SEG15) B30 AVCC A17 PD6 (SEG16) A34 GND 4 8018PS–AVR–08/10 ATmega169P 2. Overview The ATmega169P is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATmega169P achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram PROGRAM COUNTER INTERNAL OSCILLATOR WATCHDOG TIMER STACK POINTER PROGRAM FLASH MCU CONTROL REGISTER SRAM GENERAL PURPOSE REGISTERS INSTRUCTION REGISTER TIMER/ COUNTERS INSTRUCTION DECODER DATA DIR. REG. PORTB DATA DIR. REG. PORTE DATA DIR. REG. PORTA DATA DIR. REG. PORTD DATA REGISTER PORTB DATA REGISTER PORTE DATA REGISTER PORTA DATA REGISTER PORTD TIMING AND CONTROL OSCILLATOR INTERRUPT UNIT EEPROM USART SPI STATUS REGISTER Z Y X ALU PORTE DRIVERS PORTB DRIVERS PORTF DRIVERS PORTA DRIVERS PORTD DRIVERS PORTC DRIVERS PE0 - PE7 PB0 - PB7 PF0 - PF7 PA0 - PA7 VCC GND AREF XTAL1 XTAL2 CONTROL LINES + - ANALOG COMPARATOR PC0 - PC7 8-BIT DATA BUS RESET AVCC CALIB. OSC DATA DIR. REG. PORTC DATA REGISTER PORTC ON-CHIP DEBUG JTAG TAP PROGRAMMING LOGIC BOUNDARYSCAN DATA DIR. REG. PORTF DATA REGISTER PORTF ADC PD0 - PD7 DATA DIR. REG. PORTG DATA REG. PORTG PORTG DRIVERS PG0 - PG4 UNIVERSAL SERIAL INTERFACE AVR CPU LCD CONTROLLER/ DRIVER 5 8018PS–AVR–08/10 ATmega169P The AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATmega169P provides the following features: 16 Kbytes of In-System Programmable Flash with Read-While-Write capabilities, 512 bytes EEPROM, 1 Kbyte SRAM, 53 general purpose I/O lines, 32 general purpose working registers, a JTAG interface for Boundary-scan, On-chip Debugging support and programming, a complete On-chip LCD controller with internal step-up voltage, three flexible Timer/Counters with compare modes, internal and external interrupts, a serial programmable USART, Universal Serial Interface with Start Condition Detector, an 8- channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, an SPI serial port, and five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next interrupt or hardware reset. In Power-save mode, the asynchronous timer and the LCD controller continues to run, allowing the user to maintain a timer base and operate the LCD display while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except asynchronous timer, LCD controller and ADC, to minimize switching noise during ADC conversions. In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low-power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The On-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPI serial interface, by a conventional non-volatile memory programmer, or by an On-chip Boot program running on the AVR core. The Boot program can use any interface to download the application program in the Application Flash memory. Software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel ATmega169P is a powerful microcontroller that provides a highly flexible and cost effective solution to many embedded control applications. The ATmega169P AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators, In-Circuit Emulators, and Evaluation kits. 6 8018PS–AVR–08/10 ATmega169P 2.2 Pin Descriptions 2.2.1 VCC Digital supply voltage. 2.2.2 GND Ground. 2.2.3 Port A (PA7:PA0) Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port A” on page 73. 2.2.4 Port B (PB7:PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B has better driving capabilities than the other ports. Port B also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port B” on page 74. 2.2.5 Port C (PC7:PC0) Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port C output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port C also serves the functions of special features of the ATmega169P as listed on ”Alternate Functions of Port C” on page 77. 2.2.6 Port D (PD7:PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port D” on page 79. 7 8018PS–AVR–08/10 ATmega169P 2.2.7 Port E (PE7:PE0) Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port E output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up resistors are activated. The Port E pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port E also serves the functions of various special features of the ATmega169P as listed on ”Alternate Functions of Port E” on page 81. 2.2.8 Port F (PF7:PF0) Port F serves as the analog inputs to the A/D Converter. Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pins can provide internal pull-up resistors (selected for each bit). The Port F output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port F pins that are externally pulled low will source current if the pull-up resistors are activated. The Port F pins are tri-stated when a reset condition becomes active, even if the clock is not running. If the JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) will be activated even if a reset occurs. Port F also serves the functions of the JTAG interface, see ”Alternate Functions of Port F” on page 83. 2.2.9 Port G (PG5:PG0) Port G is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port G output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port G pins that are externally pulled low will source current if the pull-up resistors are activated. The Port G pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port G also serves the functions of various special features of the ATmega169P as listed on page 85. 2.2.10 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running. The minimum pulse length is given in Table 28-4 on page 333. Shorter pulses are not guaranteed to generate a reset. 2.2.11 XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit. 2.2.12 XTAL2 Output from the inverting Oscillator amplifier. 2.2.13 AVCC AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. 8 8018PS–AVR–08/10 ATmega169P 2.2.14 AREF This is the analog reference pin for the A/D Converter. 2.2.15 LCDCAP An external capacitor (typical > 470 nF) must be connected to the LCDCAP pin as shown in Figure 23-2 on page 236. This capacitor acts as a reservoir for LCD power (VLCD). A large capacitance reduces ripple on VLCD but increases the time until VLCD reaches its target value. 9 8018PS–AVR–08/10 ATmega169P 3. Resources A comprehensive set of development tools, application notes and datasheets are available for download on http://www.atmel.com/avr. Note: 1. 4. Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 10 8018PS–AVR–08/10 ATmega169P 5. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page (0xFF) Reserved – – – – – – – – (0xFE) LCDDR18 – – – – – – – SEG324 250 (0xFD) LCDDR17 SEG323 SEG322 SEG321 SEG320 SEG319 SEG318 SEG317 SEG316 250 (0xFC) LCDDR16 SEG315 SEG314 SEG313 SEG312 SEG311 SEG310 SEG309 SEG308 250 (0xFB) LCDDR15 SEG307 SEG306 SEG305 SEG304 SEG303 SEG302 SEG301 SEG300 250 (0xFA) Reserved – – – – – – – – (0xF9) LCDDR13 – – – – – – – SEG224 250 (0xF8) LCDDR12 SEG223 SEG222 SEG221 SEG220 SEG219 SEG218 SEG217 SEG216 250 (0xF7) LCDDR11 SEG215 SEG214 SEG213 SEG212 SEG211 SEG210 SEG209 SEG208 250 (0xF6) LCDDR10 SEG207 SEG206 SEG205 SEG204 SEG203 SEG202 SEG201 SEG200 250 (0xF5) Reserved – – – – – – – – (0xF4) LCDDR8 – – – – – – – SEG124 250 (0xF3) LCDDR7 SEG123 SEG122 SEG121 SEG120 SEG119 SEG118 SEG117 SEG116 250 (0xF2) LCDDR6 SEG115 SEG114 SEG113 SEG112 SEG111 SEG110 SEG109 SEG108 250 (0xF1) LCDDR5 SEG107 SEG106 SEG105 SEG104 SEG103 SEG102 SEG101 SEG100 250 (0xF0) Reserved – – – – – – – – (0xEF) LCDDR3 – – – – – – – SEG024 250 (0xEE) LCDDR2 SEG023 SEG022 SEG021 SEG020 SEG019 SEG018 SEG017 SEG016 250 (0xED) LCDDR1 SEG015 SEG014 SEG013 SEG012 SEG011 SEG010 SEG09 SEG008 250 (0xEC) LCDDR0 SEG007 SEG006 SEG005 SEG004 SEG003 SEG002 SEG001 SEG000 250 (0xEB) Reserved – – – – – – – – (0xEA) Reserved – – – – – – – – (0xE9) Reserved – – – – – – – – (0xE8) Reserved – – – – – – – – (0xE7) LCDCCR LCDDC2 LCDDC1 LCDDC0 LCDMDT LCDCC3 LCDCC2 LCDCC1 LCDCC0 249 (0xE6) LCDFRR – LCDPS2 LCDPS1 LCDPS0 – LCDCD2 LCDCD1 LCDCD0 247 (0xE5) LCDCRB LCDCS LCD2B LCDMUX1 LCDMUX0 – LCDPM2 LCDPM1 LCDPM0 246 (0xE4) LCDCRA LCDEN LCDAB – LCDIF LCDIE LCDBD LCDCCD LCDBL 245 (0xE3) Reserved – – – – – – – – (0xE2) Reserved – – – – – – – – (0xE1) Reserved – – – – – – – – (0xE0) Reserved – – – – – – – – (0xDF) Reserved – – – – – – – – (0xDE) Reserved – – – – – – – – (0xDD) Reserved – – – – – – – – (0xDC) Reserved – – – – – – – – (0xDB) Reserved – – – – – – – – (0xDA) Reserved – – – – – – – – (0xD9) Reserved – – – – – – – – (0xD8) Reserved – – – – – – – – (0xD7) Reserved – – – – – – – – (0xD6) Reserved – – – – – – – – (0xD5) Reserved – – – – – – – – (0xD4) Reserved – – – – – – – – (0xD3) Reserved – – – – – – – – (0xD2) Reserved – – – – – – – – (0xD1) Reserved – – – – – – – – (0xD0) Reserved – – – – – – – – (0xCF) Reserved – – – – – – – – (0xCE) Reserved – – – – – – – – (0xCD) Reserved – – – – – – – – (0xCC) Reserved – – – – – – – – (0xCB) Reserved – – – – – – – – (0xCA) Reserved – – – – – – – – (0xC9) Reserved – – – – – – – – (0xC8) Reserved – – – – – – – – (0xC7) Reserved – – – – – – – – (0xC6) UDR0 USART0 I/O Data Register 190 (0xC5) UBRRH0 USART0 Baud Rate Register High 194 (0xC4) UBRRL0 USART0 Baud Rate Register Low 194 (0xC3) Reserved – – – – – – – – (0xC2) UCSR0C – UMSEL0 UPM01 UPM00 USBS0 UCSZ01 UCSZ00 UCPOL0 190 (0xC1) UCSR0B RXCIE0 TXCIE0 UDRIE0 RXEN0 TXEN0 UCSZ02 RXB80 TXB80 190 (0xC0) UCSR0A RXC0 TXC0 UDRE0 FE0 DOR0 UPE0 U2X0 MPCM0 190 11 8018PS–AVR–08/10 ATmega169P (0xBF) Reserved – – – – – – – – (0xBE) Reserved – – – – – – – – (0xBD) Reserved – – – – – – – – (0xBC) Reserved – – – – – – – – (0xBB) Reserved – – – – – – – – (0xBA) USIDR USI Data Register 207 (0xB9) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 207 (0xB8) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC 208 (0xB7) Reserved – – – – – – – (0xB6) ASSR – – – EXCLK AS2 TCN2UB OCR2UB TCR2UB 156 (0xB5) Reserved – – – – – – – – (0xB4) Reserved – – – – – – – – (0xB3) OCR2A Timer/Counter2 Output Compare Register A 155 (0xB2) TCNT2 Timer/Counter2 (8-bit) 155 (0xB1) Reserved – – – – – – – – (0xB0) TCCR2A FOC2A WGM20 COM2A1 COM2A0 WGM21 CS22 CS21 CS20 153 (0xAF) Reserved – – – – – – – – (0xAE) Reserved – – – – – – – – (0xAD) Reserved – – – – – – – – (0xAC) Reserved – – – – – – – – (0xAB) Reserved – – – – – – – – (0xAA) Reserved – – – – – – – – (0xA9) Reserved – – – – – – – – (0xA8) Reserved – – – – – – – – (0xA7) Reserved – – – – – – – – (0xA6) Reserved – – – – – – – – (0xA5) Reserved – – – – – – – – (0xA4) Reserved – – – – – – – – (0xA3) Reserved – – – – – – – – (0xA2) Reserved – – – – – – – – (0xA1) Reserved – – – – – – – – (0xA0) Reserved – – – – – – – – (0x9F) Reserved – – – – – – – – (0x9E) Reserved – – – – – – – – (0x9D) Reserved – – – – – – – – (0x9C) Reserved – – – – – – – – (0x9B) Reserved – – – – – – – – (0x9A) Reserved – – – – – – – – (0x99) Reserved – – – – – – – – (0x98) Reserved – – – – – – – – (0x97) Reserved – – – – – – – – (0x96) Reserved – – – – – – – – (0x95) Reserved – – – – – – – – (0x94) Reserved – – – – – – – – (0x93) Reserved – – – – – – – – (0x92) Reserved – – – – – – – – (0x91) Reserved – – – – – – – – (0x90) Reserved – – – – – – – – (0x8F) Reserved – – – – – – – – (0x8E) Reserved – – – – – – – – (0x8D) Reserved – – – – – – – – (0x8C) Reserved – – – – – – – – (0x8B) OCR1BH Timer/Counter1 - Output Compare Register B High Byte 132 (0x8A) OCR1BL Timer/Counter1 - Output Compare Register B Low Byte 132 (0x89) OCR1AH Timer/Counter1 - Output Compare Register A High Byte 132 (0x88) OCR1AL Timer/Counter1 - Output Compare Register A Low Byte 132 (0x87) ICR1H Timer/Counter1 - Input Capture Register High Byte 133 (0x86) ICR1L Timer/Counter1 - Input Capture Register Low Byte 133 (0x85) TCNT1H Timer/Counter1 - Counter Register High Byte 132 (0x84) TCNT1L Timer/Counter1 - Counter Register Low Byte 132 (0x83) Reserved – – – – – – – – (0x82) TCCR1C FOC1A FOC1B – – – – – – 131 (0x81) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 130 (0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 128 (0x7F) DIDR1 – – – – – – AIN1D AIN0D 214 (0x7E) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D 232 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 12 8018PS–AVR–08/10 ATmega169P (0x7D) Reserved – – – – – – – – (0x7C) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 228 (0x7B) ADCSRB – ACME – – – ADTS2 ADTS1 ADTS0 213, 232 (0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 230 (0x79) ADCH ADC Data Register High byte 231 (0x78) ADCL ADC Data Register Low byte 231 (0x77) Reserved – – – – – – – – (0x76) Reserved – – – – – – – – (0x75) Reserved – – – – – – – – (0x74) Reserved – – – – – – – – (0x73) Reserved – – – – – – – – (0x72) Reserved – – – – – – – – (0x71) Reserved – – – – – – – – (0x70) TIMSK2 – – – – – – OCIE2A TOIE2 156 (0x6F) TIMSK1 – – ICIE1 – – OCIE1B OCIE1A TOIE1 133 (0x6E) TIMSK0 – – – – – – OCIE0A TOIE0 104 (0x6D) Reserved – – – – – – – – (0x6C) PCMSK1 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 63 (0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 64 (0x6A) Reserved – – – – – – – – (0x69) EICRA – – – – – – ISC01 ISC00 62 (0x68) Reserved – – – – – – – – (0x67) Reserved – – – – – – – – (0x66) OSCCAL Oscillator Calibration Register 38 (0x65) Reserved – – – – – – – – (0x64) PRR – – – PRLCD PRTIM1 PRSPI PRUSART0 PRADC 45 (0x63) Reserved – – – – – – – – (0x62) Reserved – – – – – – – – (0x61) CLKPR CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 38 (0x60) WDTCR – – – WDCE WDE WDP2 WDP1 WDP0 54 0x3F (0x5F) SREG I T H S V N Z C 13 0x3E (0x5E) SPH – – – – – SP10 SP9 SP8 15 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 15 0x3C (0x5C) Reserved 0x3B (0x5B) Reserved 0x3A (0x5A) Reserved 0x39 (0x59) Reserved 0x38 (0x58) Reserved 0x37 (0x57) SPMCSR SPMIE RWWSB – RWWSRE BLBSET PGWRT PGERS SPMEN 293 0x36 (0x56) Reserved – – – – – – – – 0x35 (0x55) MCUCR JTD – – PUD – – IVSEL IVCE 60, 88, 278 0x34 (0x54) MCUSR – – – JTRF WDRF BORF EXTRF PORF 278 0x33 (0x53) SMCR – – – – SM2 SM1 SM0 SE 45 0x32 (0x52) Reserved – – – – – – – – 0x31 (0x51) OCDR IDRD/OCDR7 OCDR6 OCDR5 OCDR4 OCDR3 OCDR2 OCDR1 OCDR0 257 0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 213 0x2F (0x4F) Reserved – – – – – – – – 0x2E (0x4E) SPDR SPI Data Register 167 0x2D (0x4D) SPSR SPIF WCOL – – – – – SPI2X 166 0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 165 0x2B (0x4B) GPIOR2 General Purpose I/O Register 2 29 0x2A (0x4A) GPIOR1 General Purpose I/O Register 1 29 0x29 (0x49) Reserved – – – – – – – – 0x28 (0x48) Reserved – – – – – – – – 0x27 (0x47) OCR0A Timer/Counter0 Output Compare Register A 104 0x26 (0x46) TCNT0 Timer/Counter0 (8 Bit) 104 0x25 (0x45) Reserved – – – – – – – – 0x24 (0x44) TCCR0A FOC0A WGM00 COM0A1 COM0A0 WGM01 CS02 CS01 CS00 102 0x23 (0x43) GTCCR TSM – – – – – PSR2 PSR10 137, 157 0x22 (0x42) EEARH – – – – – – – EEAR8 27 0x21 (0x41) EEARL EEPROM Address Register Low Byte 27 0x20 (0x40) EEDR EEPROM Data Register 27 0x1F (0x3F) EECR – – – – EERIE EEMWE EEWE EERE 27 0x1E (0x3E) GPIOR0 General Purpose I/O Register 0 29 0x1D (0x3D) EIMSK PCIE1 PCIE0 – – – – – INT0 62 0x1C (0x3C) EIFR PCIF1 PCIF0 – – – – – INTF0 63 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 13 8018PS–AVR–08/10 ATmega169P Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operate on the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 4. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using LD and ST instructions, 0x20 must be added to these addresses. The ATmega169P is a complex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from 0x60 - 0xFF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used. 0x1B (0x3B) Reserved – – – – – – – – 0x1A (0x3A) Reserved – – – – – – – – 0x19 (0x39) Reserved – – – – – – – – 0x18 (0x38) Reserved – – – – – – – – 0x17 (0x37) TIFR2 – – – – – – OCF2A TOV2 156 0x16 (0x36) TIFR1 – – ICF1 – – OCF1B OCF1A TOV1 134 0x15 (0x35) TIFR0 – – – – – – OCF0A TOV0 105 0x14 (0x34) PORTG – – PORTG5 PORTG4 PORTG3 PORTG2 PORTG1 PORTG0 90 0x13 (0x33) DDRG – – DDG5 DDG4 DDG3 DDG2 DDG1 DDG0 90 0x12 (0x32) PING – – PING5 PING4 PING3 PING2 PING1 PING0 90 0x11 (0x31) PORTF PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 90 0x10 (0x30) DDRF DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 90 0x0F (0x2F) PINF PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 90 0x0E (0x2E) PORTE PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 89 0x0D (0x2D) DDRE DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 89 0x0C (0x2C) PINE PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 90 0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 89 0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 89 0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 89 0x08 (0x28) PORTC PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 89 0x07 (0x27) DDRC DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 89 0x06 (0x26) PINC PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 89 0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 88 0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 88 0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 88 0x02 (0x22) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 88 0x01 (0x21) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 88 0x00 (0x20) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 88 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 14 8018PS–AVR–08/10 ATmega169P 6. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 MUL Rd, Rr Multiply Unsigned R1:R0 ← Rd x Rr Z,C 2 MULS Rd, Rr Multiply Signed R1:R0 ← Rd x Rr Z,C 2 MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr Z,C 2 FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2 FMULS Rd, Rr Fractional Multiply Signed R1:R0 ← (Rd x Rr) << 1 Z,C 2 FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2 BRANCH INSTRUCTIONS RJMP k Relative Jump PC ← PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC ← Z None 2 JMP k Direct Jump PC ← k None 3 RCALL k Relative Subroutine Call PC ← PC + k + 1 None 3 ICALL Indirect Call to (Z) PC ← Z None 3 CALL k Direct Subroutine Call PC ← k None 4 RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 15 8018PS–AVR–08/10 ATmega169P BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1 ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 SEC Set Carry C ← 1 C 1 CLC Clear Carry C ← 0 C 1 SEN Set Negative Flag N ← 1 N 1 CLN Clear Negative Flag N ← 0 N 1 SEZ Set Zero Flag Z ← 1 Z 1 CLZ Clear Zero Flag Z ← 0 Z 1 SEI Global Interrupt Enable I ← 1 I 1 CLI Global Interrupt Disable I ← 0 I 1 SES Set Signed Test Flag S ← 1 S 1 CLS Clear Signed Test Flag S ← 0 S 1 SEV Set Twos Complement Overflow. V ← 1 V 1 CLV Clear Twos Complement Overflow V ← 0 V 1 SET Set T in SREG T ← 1 T 1 CLT Clear T in SREG T ← 0 T 1 SEH Set Half Carry Flag in SREG H ← 1 H 1 CLH Clear Half Carry Flag in SREG H ← 0 H 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers Rd ← Rr None 1 MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1 LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 LPM Load Program Memory R0 ← (Z) None 3 LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 SPM Store Program Memory (Z) ← R1:R0 None - IN Rd, P In Port Rd ← P None 1 OUT P, Rr Out Port P ← Rr None 1 Mnemonics Operands Description Operation Flags #Clocks 16 8018PS–AVR–08/10 ATmega169P PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/timer) None 1 BREAK Break For On-chip Debug Only None N/A Mnemonics Operands Description Operation Flags #Clocks 17 8018PS–AVR–08/10 ATmega169P 7. Ordering Information Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 331 and Figure 28-2 on page 332. Speed (MHz)(3) Power Supply Ordering Code Package(1)(2) Operation Range 8 1.8V - 5.5V ATmega169PV-8AU ATmega169PV-8MU ATmega169PV-8MCH 64A 64M1 64MC Industrial (-40°C to 85°C) 16 2.7V - 5.5V ATmega169P-16AU ATmega169P-16MU ATmega169P-16MCH 64A 64M1 64MC Industrial (-40°C to 85°C) Package Type 64A 64-Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 × 9 × 1.0 mm body, lead pitch 0.50 mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 64MC 64-lead (2-row Staggered), 7 × 7 × 1.0 mm body, 4.0 × 4.0 mm Exposed Pad, Quad Flat No-Lead Package (QFN) 18 8018PS–AVR–08/10 ATmega169P 8. Packaging Information 8.1 64A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 64A, 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 64A B 10/5/2001 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1.This package conforms to JEDEC reference MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e 0.80 TYP 19 8018PS–AVR–08/10 ATmega169P 8.2 64M1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 64M1, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, 64M1 G 5/25/06 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 – 0.02 0.05 b 0.18 0.25 0.30 D D2 5.20 5.40 5.60 8.90 9.00 9.10 E 8.9 0 9.00 9.10 E2 5.20 5.40 5.60 e 0.50 BSC L 0.35 0.40 0.45 Note: 1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD. 2. Dimension and tolerance conform to ASMEY14.5M-1994. TOP VIEW SIDE VIEW BOTTOM VIEW D E Marked Pin# 1 ID SEATING PLANE A1 C A 0.08 C 1 2 3 K 1.25 1.40 1.55 E2 D2 b e Pin #1 Corner L Pin #1 Triangle Pin #1 Chamfer (C 0.30) Option A Option B Pin #1 Notch (0.20 R) Option C K K 5.40 mm Exposed Pad, Micro Lead Frame Package (MLF) 20 8018PS–AVR–08/10 ATmega169P 8.3 64MC TITLE GPC DRAWING NO. REV. Package Drawing Contact: packagedrawings@atmel.com ZXC 64MC A 64MC, 64QFN (2-Row Staggered), 7 x 7 x 1.00 mm Body, 4.0 x 4.0 mm Exposed Pad, Quad Flat No Lead Package 10/3/07 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 0.00 0.02 0.05 b 0.18 0.23 0.28 C 0.20 REF D 6.90 7.00 7.10 D2 3.95 4.00 4.05 E 6.90 7.00 7.10 E2 3.95 4.00 4.05 eT – 0.65 – eR – 0.65 – K 0.20 – – (REF) L 0.35 0.40 0.45 y 0.00 – 0.075 SIDE VIEW TOP VIEW BOTTOM VIEW Note: 1. The terminal #1 ID is a Laser-marked Feature. Pin 1 ID D E A1 A y C eT/2 R0.20 0.40 B1 A1 B30 A34 b A8 B7 eT D2 B16 A18 B22 A25 E2 K (0.1) REF B8 A9 (0.18) REF L B15 A17 L eR A26 B23 eT 21 8018PS–AVR–08/10 ATmega169P 9. Errata 9.1 ATmega169P Rev. G No known errata. 9.2 ATmega169P Rev. A to F Not sampled. 22 8018PS–AVR–08/10 ATmega169P 10. Datasheet Revision History Please note that the referring page numbers in this section are referring to this document. The referring revision in this section are referring to the document revision. 10.1 Rev. 8018P 08/10 10.2 Rev. 8018O 10/09 10.3 Rev. 8018N 08/09 10.4 Rev. 8018M 07/09 10.5 Rev. L 08/08 10.6 Rev. K 06/08 1. Status changed to active 2. EEPROM minimum wait delay, Table 27-15 on page 312, has been changed from 9.0 ms to 3.6 ms 3. Datasheet layout and technical terminology updated 1. Changed datasheet status to “Mature” 2. Added Capacitance for Low-frequency Crystal Oscillator, Table 8-5 on page 33. 1. Updated ”Ordering Information” on page 17, MCU replaced by MCH. 1. Updated the last page with new Atmel’s addresses. 1. Updated package information in ”Features” on page 1. 2. Added ”Pinout - DRQFN” on page 3: • The Staggered QFN is named Dual Row QFN (DRQFN). 1. Updated package information in ”Features” on page 1. 2. Removed “Disclaimer” from section ”Pin Configurations” on page 2 3. Added ”64MC (DRQFN) Pinout ATmega169P” on page 3 4. Added ”Data Retention” on page 9. 5. Updated ”Stack Pointer” on page 13. 6. Updated ”Low-frequency Crystal Oscillator” on page 34. 7. Updated ”USART Register Description” on page 194, register descriptions and tables. 8. Updated ”UCSRnB – USART Control and Status Register n B” on page 195. 9. Updated VIL2 in ”DC Characteristics” on page 329, by removing 0.2VCC from the table. 23 8018PS–AVR–08/10 ATmega169P 10.7 Rev. J 08/07 10.8 Rev. I 11/06 10.9 Rev. H 09/06 10.10 Rev. G 08/06 10.11 Rev. F 08/06 10.12 Rev. E 08/06 10. Replaced Figure 29-36 on page 357 by a correct one. 11. Updated ”Ordering Information” on page 17. 12. Added ”64MC” on page 20 package to ”Packaging Information” on page 18. 1. Updated ”Features” on page 1. 2. Added ”Minimizing Power Consumption” on page 237 in the LCD section. 3. Updated ”System and Reset Characteristics” on page 333. 1. Updated ”Low-frequency Crystal Oscillator” on page 34. 2. Updated Table 8-8 on page 35, Table 8-9 on page 35, Table 8-10 on page 35, Table 28-7 on page 336. 3. Updated note in Table 28-7 on page 336. 1. All characterization data moved to ”Electrical Characteristics” on page 329. 2. Updated ”Calibrated Internal RC Oscillator” on page 32. 3. Updated ”System Control and Reset” on page 47. 4. Added note to Table 27-16 on page 314. 5. Updated ”LCD Controller Characteristics” on page 337. 1. Updated ”LCD Controller Characteristics” on page 337. 1. Updated ”DC Characteristics” on page 329. 2. Updated Table 13-19 on page 84. 1. Updated ”Low-frequency Crystal Oscillator” on page 34. 2. Updated ”Device Identification Register” on page 260. 3. Updated ”Signature Bytes” on page 299. 4. Added Table 27-6 on page 299. 24 8018PS–AVR–08/10 ATmega169P 10.13 Rev. D 07/06 10.14 Rev. C 06/06 10.15 Rev. B 04/06 10.16 Rev. A 03/06 1. Updated ”Register Description for I/O-Ports” on page 88. 2. Updated ”Fast PWM Mode” on page 97. 3. Updated ”Fast PWM Mode” on page 120. 4. Updated Table 14-2 on page 102, Table 14-4 on page 103, Table 15-3 on page 129, Table 15-4 on page 130, Table 17-2 on page 153 and Table 17-4 on page 154. 5 Updated ”UCSRnC – USART Control and Status Register n C” on page 196. 6. Updated Features in ”USI – Universal Serial Interface” on page 199. 7. Added ”Clock speed considerations.” on page 206. 8. Updated Features in ”LCD Controller” on page 234. 9. Updated ”Register Summary” on page 10. 1. Updated typos. 2. Updated ”Calibrated Internal RC Oscillator” on page 32. 3. Updated ”OSCCAL – Oscillator Calibration Register” on page 38. 4. Added Table 28-2 on page 332. 1. Updated ”Calibrated Internal RC Oscillator” on page 32. 1. Initial revision. 8018PS–AVR–08/10 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-en- Yvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Product Contact Web Site www.atmel.com Technical Support avr@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Rev. 04 — 9 March 2011 Product data sheet LFPAK Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤175°C - - 30 V ID drain current Tmb = 25 °C; VGS = 10 V; see Figure 1 - - 76 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 51 W Tj junction temperature -55 - 175 °C Static characteristics RDSon drain-source on-state resistance VGS = 10 V; ID = 15 A; Tj = 25 °C - 4.92 7 mΩ Dynamic characteristics QGD gate-drain charge VGS = 4.5 V; ID = 10 A; VDS = 12 V; see Figure 14; see Figure 15 - 2.9 - nC QG(tot) total gate charge - 10 - nC Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 65 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - - 21 mJ PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 2 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 2. Pinning information 3. Ordering information 4. Limiting values Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 S source SOT669 (LFPAK) 2 S source 3 S source 4 G gate mb D mounting base; connected to drain mb 1 2 3 4 S D G mbb076 Table 3. Ordering information Type number Package Name Description Version PSMN7R0-30YL LFPAK plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669 Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 30 V VDSM peak drain-source voltage tp ≤ 25 ns; f ≤ 500 kHz; EDS(AL) ≤ 90 nJ; pulsed - 35 V VDGR drain-gate voltage Tj ≥ 25 °C; Tj ≤ 175 °C; RGS = 20 kΩ - 30 V VGS gate-source voltage -20 20 V ID drain current VGS = 10 V; Tmb = 100 °C; see Figure 1 - 53 A VGS = 10 V; Tmb = 25 °C; see Figure 1 - 76 A IDM peak drain current pulsed; tp ≤ 10 μs; Tmb = 25 °C; see Figure 3 - 260 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 51 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C Source-drain diode IS source current Tmb = 25 °C - 65 A ISM peak source current pulsed; tp ≤ 10 μs; Tmb = 25 °C - 260 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 65 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - 21 mJ PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 3 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 1. Continuous drain current as a function of mounting base temperature Fig 2. Normalized total power dissipation as a function of mounting base temperature Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage 003aac720 0 20 40 60 80 100 0 50 100 150 200 Tmb (°C) ID (A) Tmb (°C) 0 50 100 150 200 03aa16 40 80 120 Pder (%) 0 003aac732 10-1 1 10 102 103 10-1 1 10 102 VDS (V) ID (A) DC Limit RDSon = VDS / ID 100 ms 10 ms 1 ms 100 μs 10 μs PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 4 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - 1.4 2.45 K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration 003aac721 single shot 0.2 0.1 0.05 0.02 10-2 10-1 1 10 10-6 10-5 10-4 10-3 10-2 10-1 tp (s) 1 Zth(j-mb) (K/W) δ = 0.5 tp T P t tp T δ = PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 5 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 6. Characteristics Table 6. Characteristics Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Static characteristics V(BR)DSS drain-source breakdown voltage ID = 250 μA; VGS = 0 V; Tj=25°C 30 - - V ID = 250 μA; VGS = 0 V; Tj = -55 °C 27 - - V VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 25 °C; see Figure 11; see Figure 12 1.3 1.7 2.15 V ID = 1 mA; VDS = VGS; Tj = 150 °C; see Figure 12 0.65 - - V ID = 1 mA; VDS = VGS; Tj = -55 °C; see Figure 12 - - 2.45 V IDSS drain leakage current VDS = 30 V; VGS = 0 V; Tj=25°C - - 1 μA VDS = 30 V; VGS = 0 V; Tj = 150 °C - - 100 μA IGSS gate leakage current VGS = 16 V; VDS = 0 V; Tj = 25 °C - - 100 nA VGS = -16 V; VDS = 0 V; Tj = 25 °C - - 100 nA RDSon drain-source on-state resistance VGS = 4.5 V; ID = 15 A; Tj = 25 °C - 6.97 9.1 mΩ VGS = 10 V; ID = 15 A; Tj = 150 °C; see Figure 13 - - 12.2 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C - 4.92 7 mΩ RG gate resistance f = 1 MHz - 0.6 1.5 Ω Dynamic characteristics QG(tot) total gate charge ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14; see Figure 15 - 10 - nC ID = 0 A; VDS = 0 V; VGS = 10 V - 20 - nC ID = 10 A; VDS = 12 V; VGS = 10 V; see Figure 14; see Figure 15 - 22 - nC QGS gate-source charge ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14; see Figure 15 - 3.7 - nC QGS(th) pre-threshold gate-source charge - 2.1 - nC QGS(th-pl) post-threshold gate-source charge - 1.6 - nC QGD gate-drain charge - 2.9 - nC VGS(pl) gate-source plateau voltage VDS = 12 V; see Figure 14; see Figure 15 - 2.6 - V Ciss input capacitance VDS = 12 V; VGS = 0 V; f = 1 MHz; Tj = 25 °C; see Figure 16 - 1270 - pF Coss output capacitance - 255 - pF Crss reverse transfer capacitance - 145 - pF td(on) turn-on delay time VDS = 12 V; RL = 0.5 Ω; VGS = 4.5 V; RG(ext) = 4.7 Ω - 24 - ns tr rise time - 39 - ns td(off) turn-off delay time - 30 - ns tf fall time - 11 - ns PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 6 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Source-drain diode VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C; see Figure 17 - 0.88 1.2 V trr reverse recovery time IS = 20 A; dIS/dt = -100 A/μs; VGS = 0 V; VDS = 20 V - 30 - ns Qr recovered charge - 22 - nC Table 6. Characteristics …continued Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Fig 5. Transfer characteristics: drain current as a function of gate-source voltage; typical values Fig 6. Forward transconductance as a function of drain current; typical values Fig 7. Drain-source on-state resistance as a function of gate-source voltage; typical values Fig 8. Output characteristics: drain current as a function of drain-source voltage; typical values 003aac729 0 20 40 60 80 0 1 2 3 VGS (V) 4 ID (A) Tj = 150 °C 25 °C 003aac728 30 40 50 60 0 10 20 30 I 40 D (A) gfs (S) 003aac727 4 6 8 10 12 14 2 4 6 8 V 10 GS (V) RDSon (mΩ) 003aac726 0 20 40 60 80 100 0 2 4 6 8 10 VDS (V) ID (A) VGS (V) = 4.5 10 3.2 3 2.8 2.6 2.4 2.2 PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 7 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 9. Input and reverse transfer capacitances as a function of gate-source voltage; typical values Fig 10. Drain-source on-state resistance as a function of drain current; typical values Fig 11. Sub-threshold drain current as a function of gate-source voltage Fig 12. Gate-source threshold voltage as a function of junction temperature 003aac724 0 500 1000 1500 2000 2500 0 2 4 6 8 10 VGS (V) C (pF) Ciss Crss 003aac722 4 6 8 10 12 14 16 0 20 40 60 80 100 ID (A) RDSon (mΩ) VGS (V) = 4.5 10 3.2 003aab271 10-6 10-5 10-4 10-3 10-2 10-1 0 1 2 VGS (V) 3 ID (A) min typ max 003aac337 0 1 2 3 -60 0 60 120 180 Tj (°C) VGS(th) (V) max typ min PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 8 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 13. Normalized drain-source on-state resistance factor as a function of junction temperature Fig 14. Gate charge waveform definitions Fig 15. Gate-source voltage as a function of gate charge; typical values Fig 16. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values 03aa27 0 0.5 1 1.5 2 −60 0 60 120 180 Tj (°C) a 003aaa508 VGS VGS(th) QGS1 QGS2 QGD VDS QG(tot) ID QGS VGS(pl) 003aac725 0 2 4 6 8 10 0 5 10 15 20 25 QG (nC) VGS (V) VDS = 19 (V) VDS = 12 (V) 003aac723 0 400 800 1200 1600 10-1 1 10 102 VDS (V) C (pF) Ciss Coss Crss PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 9 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values 003aac730 0 20 40 60 80 0.0 0.2 0.4 0.6 0.8 1.0 VSD (V) IS (A) Tj = 150 °C 25 °C PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 10 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 7. Package outline Fig 18. Package outline SOT669 (LFPAK) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 04-10-13 06-03-16 0 2.5 5 mm scale e E1 b c2 A2 UNIT A A2 b c e DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A1 A3 0.15 0.00 1.20 1.01 0.50 0.35 b2 4.41 3.62 b3 2.2 2.0 b4 0.9 0.7 0.25 0.19 c2 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 L2 0.85 0.40 L 1.3 0.8 L1 8° 0° D(1) w y 5.0 4.8 E(1) 3.3 3.1 E1 D1 (1) (1) max 0.25 4.20 1.27 0.25 0.1 1 2 3 4 mounting base D1 c Plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669 E b2 b3 b4 H D L2 L1 A w M A C C X 1/2 e y C θ θ (A 3 ) L A A1 detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 11 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PSMN7R0-30YL v.4 20110309 Product data sheet - PSMN7R0-30YL v.3 Modifications: • Various changes to content. PSMN7R0-30YL v.3 20100104 Product data sheet - PSMN7R0-30YL v.2 PSMN7R0-30YL v.2 20090105 Product data sheet - PSMN7R0-30YL v.1 PSMN7R0-30YL v.1 20081015 Preliminary data sheet - - PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 12 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK 9. Legal information 9.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PSMN7R0-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 04 — 9 March 2011 13 of 14 NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PSMN7R0-30YL N-channel 30 V 7 mΩ logic level MOSFET in LFPAK © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 March 2011 Document identifier: PSMN7R0-30YL Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. DPO4000 Series Digital Phosphor Oscilloscopes User Manual www.tektronix.com 071-1785-00 Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or suppliers, and are protected by national copyright laws and international treaty provisions. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specifications and price change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. e*Scope, iView, OpenChoice, TekSecure, and TekVPI are registered trademarks of Tektronix, Inc. Wave Inspector is a trademark of Tektronix, Inc. Contacting Tektronix Tektronix, Inc. 14200 SW Karl Braun Drive P.O. Box 500 Beaverton, OR 97077 USA For product information, sales, service, and technical support: In North America, call 1-800-833-9200. Worldwide, visit www.tektronix.com to find contacts in your area. Warranty 4 Tektronix warrants that this product will be free from defects in materials and workmanship for a period of three (3) years from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work may be new or reconditioned to like new performance. All replaced parts, modules and products become the property of Tektronix. In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations. This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product. THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES. Table of Contents Table of Contents General Safety Summary ................................................................................................................... v Environmental Considerations ............................................................................................................ viii Preface....................................................................................................................................... x Key Features........................................................................................................................... x Where to Find More Information..................................................................................................... xii Conventions Used in This Manual................................................................................................... xiii Installation .................................................................................................................................. 1 Before Installation..................................................................................................................... 1 Operating Considerations ............................................................................................................ 6 Connecting Probes .................................................................................................................. 10 Powering On the Oscilloscope ...................................................................................................... 11 Powering Off the Oscilloscope ...................................................................................................... 14 Functional Check .................................................................................................................... 15 Compensating the Probe ............................................................................................................ 17 Installing an Application Module..................................................................................................... 19 Changing the User Interface Language ............................................................................................. 20 Changing the Date and Time ........................................................................................................ 23 Signal Path Compensation .......................................................................................................... 25 Upgrading Firmware ................................................................................................................. 28 Connecting Your Oscilloscope to a Computer ...................................................................................... 34 DPO4000 Series User Manual i Table of Contents Get Acquainted with the Instrument....................................................................................................... 45 Front-Panel Menus and Controls.................................................................................................... 45 Front-Panel Connectors ............................................................................................................. 66 Side-Panel Connector ............................................................................................................... 67 Rear-Panel Connectors.............................................................................................................. 68 Acquire the Signal ......................................................................................................................... 70 Setting Up Signal Input .............................................................................................................. 70 Using the Default Setup ............................................................................................................. 73 Using Autoset ........................................................................................................................ 74 Acquisition Concepts ................................................................................................................ 75 How the Acquisition Modes Work ................................................................................................... 78 Changing the Acquisition Mode and Record Length................................................................................ 80 Using Roll Mode ..................................................................................................................... 83 Defining a Serial Bus ................................................................................................................ 84 Trigger Setup and Run .................................................................................................................... 91 Triggering Concepts ................................................................................................................. 91 Choosing a Trigger................................................................................................................... 98 Selecting Triggers.................................................................................................................... 99 Triggering on Buses ................................................................................................................ 102 Checking Trigger Status ............................................................................................................ 107 Using A (Main) and B (Delayed) Triggers .......................................................................................... 107 Starting and Stopping an Acquisition............................................................................................... 111 ii DPO4000 Series User Manual Table of Contents Display Waveform Data .................................................................................................................. 112 Adding and Removing a Waveform ................................................................................................ 112 Setting the Display Style and Persistence ......................................................................................... 112 Setting Waveform and Graticule Intensity.......................................................................................... 115 Setting the Graticule Style .......................................................................................................... 117 Setting the LCD Backlight .......................................................................................................... 118 Scaling and Positioning a Waveform............................................................................................... 120 Setting Input Parameters ........................................................................................................... 122 Analyze Waveform Data.................................................................................................................. 129 Taking Automatic Measurements................................................................................................... 129 Selecting Automatic Measurements................................................................................................ 131 Customizing an Automatic Measurement .......................................................................................... 137 Taking Manual Measurements with Cursors ....................................................................................... 144 Using Math Waveforms ............................................................................................................. 150 Using FFT........................................................................................................................... 153 Using Advanced Math .............................................................................................................. 157 Using Reference Waveforms ....................................................................................................... 160 Managing Long Record Length Waveforms........................................................................................ 163 Save and Recall Information ............................................................................................................. 174 Saving a Screen Image............................................................................................................. 174 Saving and Recalling Waveform Data.............................................................................................. 176 Saving and Recalling Setups ....................................................................................................... 184 DPO4000 Series User Manual iii Table of Contents Saving with One Button Push ...................................................................................................... 187 Printing a Hard Copy................................................................................................................ 189 Erasing DPO4000 Memory ......................................................................................................... 196 Use Application Modules ................................................................................................................. 200 Application Examples..................................................................................................................... 201 Taking Simple Measurements ...................................................................................................... 201 Analyzing Signal Detail ............................................................................................................. 217 Triggering on a Video Signal ....................................................................................................... 226 Capturing a Single-Shot Signal..................................................................................................... 230 Correlating Data With a TLA5000 Logic Analyzer ................................................................................. 235 Tracking Down Bus Anomalies ..................................................................................................... 238 Index iv DPO4000 Series User Manual General Safety Summary General Safety Summary Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it. To avoid potential hazards, use this product only as specified. Only qualified personnel should perform service procedures. To Avoid Fire or Personal Injury Use Proper Power Cord. Use only the power cord specified for this product and certified for the country of use. Connect and Disconnect Properly. Do not connect or disconnect probes or test leads while they are connected to a voltage source. Connect and Disconnect Properly. De-energize the circuit under test before connecting or disconnecting the current probe. Ground the Product. This product is grounded through the grounding conductor of the power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded. Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings and markings on the product. Consult the product manual for further ratings information before making connections to the product. The inputs are not rated for connection to mains or Category II, III, or IV circuits. Connect the probe reference lead to earth ground only. Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal. DPO4000 Series User Manual v General Safety Summary Power Disconnect. The power switch disconnects the product from the power source. See instructions for the location. Do not block the power switch; it must remain accessible to the user at all times. Do Not Operate Without Covers. Do not operate this product with covers or panels removed. Do Not Operate With Suspected Failures. If you suspect that there is damage to this product, have it inspected by qualified service personnel. Avoid Exposed Circuitry. Do not touch exposed connections and components when power is present. Do Not Operate in Wet/Damp Conditions. Do Not Operate in an Explosive Atmosphere. Keep Product Surfaces Clean and Dry. Provide Proper Ventilation. Refer to the manual’s installation instructions for details on installing the product so it has proper ventilation. Terms in this Manual These terms may appear in this manual: WARNING. Warning statements identify conditions or practices that could result in injury or loss of life. CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property. vi DPO4000 Series User Manual General Safety Summary Symbols and Terms on the Product These terms may appear on the product: DANGER indicates an injury hazard immediately accessible as you read the marking. WARNING indicates an injury hazard not immediately accessible as you read the marking. CAUTION indicates a hazard to property including the product. The following symbols may appear on the product: DPO4000 Series User Manual vii Environmental Considerations Environmental Considerations This section provides information about the environmental impact of the product. Product End-of-Life Handling Observe the following guidelines when recycling an instrument or component: Equipment Recycling. Production of this equipment required the extraction and use of natural resources. The equipment may contain substances that could be harmful to the environment or human health if improperly handled at the product’s end of life. In order to avoid release of such substances into the environment and to reduce the use of natural resources, we encourage you to recycle this product in an appropriate system that will ensure that most of the materials are reused or recycled appropriately. The symbol shown below indicates that this product complies with the European Union’s requirements according to Directive 2002/96/EC on waste electrical and electronic equipment (WEEE). For information about recycling options, check the Support/Service section of the Tektronix Web site (www.tektronix.com). Mercury Notification. This product uses an LCD backlight lamp that contains mercury. Disposal may be regulated due to environmental considerations. Please contact your local authorities or, within the United States, the Electronics Industries Alliance (www.eiae.org) for disposal or recycling information. viii DPO4000 Series User Manual Environmental Considerations Restriction of Hazardous Substances This product has been classified as Monitoring and Control equipment, and is outside the scope of the 2002/95/EC RoHS Directive. This product is known to contain lead, cadmium, mercury, and hexavalent chromium. DPO4000 Series User Manual ix Preface Preface This manual describes the installation and operation of the following DPO4000 Series Instruments: DPO4104 DPO4054 DPO4034 DPO4032 Key Features DPO4000 Series instruments can help you verify, debug, and characterize electronic designs. Key features include: 1 GHz, 500 MHz, and 350 MHz bandwidths 2 and 4 channel models Sample rates up to 5 GS/s on all channels 10 Megapoint record length on all channels I2C, SPI, and CAN serial triggering and analysis (Requires use of the DPO4EMBD (for I2C and SPI) or DPO4AUTO (for CAN) application modules) Wave Inspector controls for managing long record lengths, with zoom and pan, play and pause, search and mark 10.4 inch (264 mm) XGA color display Small footprint and lightweight, at 140 mm (5.5 inches) deep and 5 kg (11 pounds) USB and CompactFlash available for quick and easy storage Built-in Ethernet port USB 2.0 device port for direct PC control of the oscilloscope using USBTMC protocol x DPO4000 Series User Manual Preface OpenChoice documentation and analysis software Remote viewing with control (e*Scope and OpenChoice connectivity) TekVPI Versatile Probe Interface supports active, differential, and current probes for automatic scaling and units DPO4000 Series User Manual xi Preface Where to Find More Information The following information is available for your oscilloscope: To read about Use these documents Installation and Operation This DPO4000 User Manual English: 071-1785-XX French: 071-1799-XX Italian: 071-1800-XX German: 071-1801-XX Spanish: 071-1802-XX Japanese: 071-1803-XX Portuguese: 071-1804-XX Simplified Chinese: 071-1805-XX Traditional Chinese: 071-1806-XX Korean: 071-1807-XX Russian: 071-1808-XX Specifications and Performance Verification The DPO4000 Technical Reference (071-1843-XX) (PDF only) Programmer Commands The DPO4000 Programmer Manual (071-1845-XX) (PDF only) Analysis and Connectivity Tools The optional Getting Started with OpenChoice Solutions Manual (020-2514-XX) (includes a CD) xii DPO4000 Series User Manual Preface To read about Use these documents Servicing and calibration The optional DPO4000 Service Manual (071-1844-XX) Installing and testing application modules The DPO4000 Series Application Module Installation Instructions manual (071-1833-XX) (11 languages) Conventions Used in This Manual The following icons are used throughout this manual. Sequence Step Front panel power Connect power Network USB DPO4000 Series User Manual xiii Preface xiv DPO4000 Series User Manual Installation Installation Before Installation Unpack the oscilloscope and check that you received all items listed as standard accessories. The following pages list recommended accessories and probes, instrument options, and upgrades. Check the Tektronix Web site (www.tektronix.com) for the most current information. Standard Accessories Accessory Tektronix part number English (Option L0) 071-1785-XX French (Option L1) 071-1799-XX Italian (Option L2) 071-1800-XX German (Option L3) 071-1801-XX Spanish (Option L4) 071-1802-XX Japanese (Option L5) 071-1803-XX Portuguese (Option L6) 071-1804-XX Simple Chinese (Option L7) 071-1805-XX Traditional Chinese (Option L8) 071-1806-XX Korean (Option L9) 071-1807-XX DPO4000 User Manual Russian (Option L10) 071-1808-XX DPO4000 Series User Manual 1 Installation Standard Accessories (cont.) Accessory Tektronix part number DPO4000 Documentation Browser CD Electronic versions of DPO4000 documents, including the Programmer Manual and the Technical Reference. 063-1810-XX OpenChoice Desktop CD Applications that let you capture and transfer data from your oscilloscope to an external PC. Use the standalone OpenChoice Desktop, MS Word, or MS Excel Toolbars. 020-2514-XX Calibration certificate documenting traceability to national metrology institute(s), and ISO9001 quality system registration. —— One 500 MHz, 10x passive probe per channel P6139A Front Cover Hard plastic cover to help protect the instrument 200-4908-00 CompactFlash memory card Extra storage 156-9413-00 2 DPO4000 Series User Manual Installation Standard Accessories (cont.) Accessory Tektronix part number North America (Option A0) 161-0104-00 Universal Euro (Option A1) 161-0104-06 United Kingdom (Option A2) 161-0104-07 Australia (Option A3) 161-0104-05 Switzerland (Option A5) 161-0167-00 Japan (Option A6) 161-A005-00 China (Option A10) 161-0306-00 India (Option A11) 161-0400-00 Power Cord No power cord or AC adapter (Option A99) —— DPO4000 Series User Manual 3 Installation Optional Accessories Accessory Tektronix Part Number DPO4EMBD The embedded serial triggering and analysis module enables triggering on packet level information on I2C and SPI serial buses, as well as digital views of the signal, bus views, bus decoding, search tools, and packet decode tables with timestamp information DPO4EMBD DPO4AUTO The embedding automotive serial triggering and analysis module enables triggering on packet level information on CAN serial buses, as well as digital views of the signal, bus views, bus decoding, search tools, and packet decode tables with timestamp information DPO4AUTO TPA-BNC TekVPI to TekProbe 2 BNC Adapter TPA-BNC TEK-USB-488 Adapter GPIB to USB Adapter TEK-USB-488 Getting Started with OpenChoice Solutions Manual with CD Describes ways to develop host-computer software applications that work with your oscilloscope 020-2513-XX Rackmount kit Adds rackmount brackets RM4000 Soft transit case Case for carrying instrument AC4000 Hard transit case Traveling case, which requires use of the soft transit case (AC4000) HCTEK4321 4 DPO4000 Series User Manual Installation Optional Accessories (cont.) Accessory Tektronix Part Number CompactFlash memory card Extra storage 156-9413-00 CompactFlash to USB memory card reader Card reader 119-6827-00 DPO4000 Programmer Manual Describes commands for remote control of the DPO4000 oscilloscope. Available electronically on the Documentation Browser CD or for download from www.tektronix.com. 071-1845-XX DPO4000 Technical Reference Manual Describes the DPO4000 oscilloscope specifications and performance verification procedure. Available electronically on the Documentation Browser CD or for download from www.tektronix.com. 071-1809-XX DPO4000 Service manual Service information 071-1844-XX DPO4000 Module Installation Instructions Manual 071-1833-XX The DPO4000 oscilloscope works with multiple optional probes. (See page 10, Connecting Probes.) Check the Tektronix Web site (www.tektronix.com) for the most current information. DPO4000 Series User Manual 5 Installation Operating Considerations DPO4000 Series Oscilloscope Input Voltage: 100 V to 240 V ±10% Input Power Frequency: 47 Hz to 66 Hz (100 V to 240 V) 400 Hz (100 V to 132 V) Power Consumption: 250 W maximum Weight: 5 kg (11 lbs), stand-alone instrument Height, including feet but not handle: 229 mm (9.0 in) Width, from handle hub to handle hub: 439 mm (17.3 in) Depth, from feet to front of knobs: 137 mm (5.4 in) Depth, from feet to front of front cover: 145 mm (5.7 in) Clearance: 51 mm (2 in) Temperature: Operating: +0 °C to +50 °C Nonoperating: -20 °C to +60 °C 6 DPO4000 Series User Manual Installation Humidity: Operating: High: 40 °C to 50 °C, 10% to 60% RH Operating: Low: 0 °C to 40 °C, 10 to 90% RH Non-operating: High: 40 °C to 60 °C, 5 to 60% RH Non-operating: Low: 0 °C to 40 °C, 5 to 90% RH Altitude: Operating: 3,000 m (about 10,000 ft) Nonoperating Altitude: 12,192 m (40,000 ft) Random Vibration: Operating: 0.31 GRMS, 5 – 500 Hz, 10 minutes per axis, 3 axes (30 minutes total) Non-operating: 2.46 GRMS, 5 – 500 Hz, 10 minutes per axis, 3 axes (30 minutes total) Pollution Degree: 2, Indoor use only Acquisition System: 1 MΩ The maximum input voltage at the BNC, between center conductor and shield is 400 Vpeak (DF ≤ 39.2%), 250 VRMS to 130 kHz derated to 2.6 V RMS at 500 MHz. The maximum transient withstand voltage is ± 800 Vpeak. For steady-state sinusoidal waveforms, derate at 20 dB/decade above 200 kHz to 13 Vpk at 3 MHz and above. Acquisition System: 50Ω The maximum input voltage at the BNC, between center conductor and shield is 5 VRMS, with peaks ≤ ±20 V (DF ≤ 6.25%) DPO4000 Series User Manual 7 Installation External Trigger: 1 MΩ The maximum input voltage at the BNC, between center conductor and shield is 400 Vpeak (DF ≤ 39.2%), 250 VRMS to 2 MHz derated to 5 VRMS at 500 MHz. The maximum transient withstand voltage is ±800 Vpeak. For steady-state sinosoidal waveforms, derate at 20 dB/decade above 200 kHz to 13 Vpeak at 3 MHz and above. P6139A Passive Probe Input Voltage: 400 VRMS or 400 V DC; CAT I (2,500 Vpeak transient) 300 VRMS or 300 V DC; CAT II (2,500 Vpeak transient 150 VRMS or 150 V DC; CAT III (2,500 Vpeak transient) For steady-state, sinusoidal waveforms, derate at 20 dB/decade above 2.5 MHz to 50 VRMS at 20 MHz and above. Output Voltage (terminated into 1 MΩ): 40 VRMS or 40 V DC; CAT I (2,500 Vpeak impulse) 30 VRMS or 30 V DC; CAT I (250 Vpeak impulse) 15 VRMS or 15 V DC; CAT I (250 Vpeak impulse) Temperature: Operating: -15 °C to +65 °C ( +5 °F to +149 °F) Nonoperating: -62 °C to +85 °C ( -80 °F to +185 °F) Altitude: ≤ 2,000 meters 8 DPO4000 Series User Manual Installation Pollution Degree: 2, Indoor use only Humidity: Operating: High: 40 °C to 50 °C, 10% to 60% RH Operating: Low: 0 °C to 40 °C, 10 to 90% RH CAUTION. To ensure proper cooling, keep the sides and rear of the instrument clear of obstructions. Cleaning Inspect the oscilloscope and probes as often as operating conditions require. To clean the exterior surface, perform the following steps: 1. Remove loose dust on the outside of the oscilloscope and probes with a lint-free cloth. Use care to avoid scratching the clear glass display filter. 2. Use a soft cloth dampened with water to clean the oscilloscope. Use an aqueous solution of 75% isopropyl alcohol for more efficient cleaning. CAUTION. To avoid damage to the surface of the oscilloscope or probes, do not use any abrasive or chemical cleaning agents. DPO4000 Series User Manual 9 Installation Connecting Probes The DPO4000 oscilloscope supports probes with the following: 1. Tektronix Versatile Probe Interface (TekVPI) These probes support two-way communication with the oscilloscope through on-screen menus and remotely through programmable support. The remote control is useful in applications like ATE where you want the system to preset probe parameters. 2. TPA-BNC Adapter The TPA-BNC Adapter allows you to use TekProbe Level II probe capabilities, such as providing probe power and passing information to the oscilloscope on scaling and whether the units are volts or amperes. 3. Plain BNC interfaces These probes only pass the waveform signal to the oscilloscope. There is no other communication. 10 DPO4000 Series User Manual Installation For more information on the many probes available for use with DPO4000 oscilloscopes, refer to www.tektronix.com. Powering On the Oscilloscope Ground the Oscilloscope and Yourself Before pushing the power switch, connect the oscilloscope to an electrically neutral reference point, such as earth ground. Do this by plugging the three-pronged power cord into an outlet grounded to earth ground. Grounding the oscilloscope is necessary for safety and to take accurate measurements. The oscilloscope needs to share the same ground as any circuits that you are testing. DPO4000 Series User Manual 11 Installation If you are working with static sensitive components, ground yourself. Static electricity that builds up on your body can damage static-sensitive components. Wearing a grounding strap safely sends static charges on your body to earth ground. 12 DPO4000 Series User Manual Installation To connect the power cord and power on the oscilloscope: DPO4000 Series User Manual 13 Installation Powering Off the Oscilloscope To power off the oscilloscope and remove the power cord: 14 DPO4000 Series User Manual Installation Functional Check Perform this quick functional check to verify that your oscilloscope is operating correctly. 1. Connect the oscilloscope power cable as described above. 2. Power on the oscilloscope. DPO4000 Series User Manual 15 Installation 3. Connect the oscilloscope P6139A probe tip and reference lead to the PROBE COMP connectors. 4. Press Default Setup. 16 DPO4000 Series User Manual Installation 5. Push the Autoset button. The screen should now display a square wave, approximately 2.5 V at 1 kHz. If the signal appears but is misshapen, perform the procedures for compensating the probe. (See page 17, Compensating the Probe.) If no signal appears, rerun the procedure. If it no signal still appears, have the instrument serviced by qualified service personnel. Compensating the Probe Whenever you attach a passive voltage probe for the first time to any input channel, compensate the probe to match it to the corresponding oscilloscope input channel. To properly compensate your passive probe: 1. Follow the steps for the functional check. (See page 15, Functional Check.) DPO4000 Series User Manual 17 Installation 2. Check the shape of the displayed waveform to determine if your probe is properly compensated. Properly compensated Under compensated Over compensated 3. If necessary, adjust your probe. Repeat as needed. 18 DPO4000 Series User Manual Installation Quick Tips Use the shortest possible ground lead and signal path to minimize probe-induced ringing and distortion on the measured signal. Short ground lead Long ground lead Installing an Application Module CAUTION. To avoid damage to the oscilloscope or application module, observe ESD precautions. (See page 11, Powering On the Oscilloscope.) Turn off the oscilloscope power while removing or adding an application module. (See page 14, Powering Off the Oscilloscope.) DPO4000 Series User Manual 19 Installation Optional application module packages extend the capability of your oscilloscope. Install up to four application modules at one time into the two slots with windows in the upper right corner of the front panel and the two additional slots hidden behind the two you can see. Refer to the DPO4000 Series Application Module Installation Instructions that came with your application module for instructions on installing and testing an application module. NOTE. If you remove an application module, the features provided by the application module become unavailable. To restore the features, turn off the oscilloscope power, reinstall the module and turn on the oscilloscope power. Changing the User Interface Language To change the language of the oscilloscope user interface and the front-panel button labels: 1. Push Utility. 2. Push System repeatedly until you select Config from the pop-up menu. Config 20 DPO4000 Series User Manual Installation 3. Push Language from the resulting lower-bezel menu. System Config Language English Set Date & Time TekSecure Erase Memory Version v1.00 4. Push the side-bezel button corresponding to the desired language. Choose among: English, French, Italian, German, Spanish, Japanese, Brazilian Portuguese, Simplified Chinese, Traditional Chinese, Korean, and Russian. Language English Francais Deutsch Italiano -more- 1 of 3 DPO4000 Series User Manual 21 Installation 5. If you choose to use English, be sure that the plastic front-panel overlay is removed. If you choose a language other than English, place the plastic overlay for the language that you desire over the front panel to display labels in that language. 22 DPO4000 Series User Manual Installation Changing the Date and Time To set the internal clock with the current date and time: 1. Push Utility. 2. Push System repeatedly until you select Config from the pop-up menu. Config 3. Push Set Date & Time. System Config Language English Set Date & Time TekSecure Erase Memory Version DPO4000 Series User Manual 23 Installation Date Time Set Display Date/Time ON OFF 4. Push the side-panel buttons and rotate both multipurpose knobs (a and b) to set the time and date values. Hour: 4 Min: 1 Month: July Day: 19 Year: 2005 OK Enter Date & Time 5. Push OK Enter Date & Time. OK Enter Date & Time 24 DPO4000 Series User Manual Installation Signal Path Compensation Signal Path Compensation (SPC) corrects for DC inaccuracies caused by temperature variations and/or long-term drift. Run the compensation whenever the ambient temperature has changed by more than 10 °C or once a week if you use vertical settings of 5 mV/division or less. Failure to do so may result in the instrument not meeting warranted performance levels at those volts/div settings. To compensate the signal path: 1. Warm up the oscilloscope for at least 20 minutes. Remove all input signals (probes and cables) from channel inputs. Input signals with AC components adversely affect SPC. DPO4000 Series User Manual 25 Installation 2. Push Utility. 3. Push System repeatedly until you select Calibration from the resulting pop-up menu. Calibration 4. Push Signal Path from the lower-bezel menu. System Calibration Signal Path Pass Factory Pass 5. Push OK Compensate Signal path from the resulting side-bezel menu. OK Compensate Signal Path The calibration will take approximately 10 minutes to complete. 26 DPO4000 Series User Manual Installation 6. After calibration, verify that the status indicator on the lower-bezel menu displays Pass. System Calibration Signal Path Pass Factory Pass If it does not, then recalibrate the instrument or have the instrument serviced by qualified service personnel. 7. Service personnel use the factory calibration functions to calibrate the internal voltage references of the oscilloscope using external sources. Refer to your Tektronix field office or representative for assistance with factory calibration. NOTE. Signal Path Compensation does not include calibration to the probe tip. (See page 17, Compensating the Probe.) DPO4000 Series User Manual 27 Installation Upgrading Firmware To upgrade the firmware of the oscilloscope: 1. Open up a Web browser and go to www.tektronix.com. Proceed to the software finder. Download the latest firmware for your DPO4000 series oscilloscope onto a USB storage device. 28 DPO4000 Series User Manual Installation 2. Power off your DPO4000. DPO4000 Series User Manual 29 Installation 3. Insert the USB storage device into the front-panel USB port on your DPO4000. 30 DPO4000 Series User Manual Installation 4. Power on the DPO4000. The instrument automatically recognizes the replacement firmware and installs it. If the instrument does not install the firmware, rerun the procedure. It the problem continues, contact qualified service personnel. CAUTION. Do not power off the oscilloscope or remove the USB storage device until the oscilloscope finishes installing the firmware. DPO4000 Series User Manual 31 Installation 5. Power off the DPO4000 and remove the USB storage device. 32 DPO4000 Series User Manual Installation 6. Power on the DPO4000. 7. Push Utility. DPO4000 Series User Manual 33 Installation 8. Push Version. The oscilloscope displays the firmware version number. System Config Language English Set Date & Time TekSecure Erase Memory Version 9. Confirm that the version number matches that of the new firmware. Connecting Your Oscilloscope to a Computer You may want to document your work for future reference. Instead of saving screen images and waveform data to a CompactFlash or USB storage device, and then generating a report later, you may want to send it directly to a remote PC for analysis. You may also want to control an oscilloscope at a remote location from your computer. Two ways to connect your oscilloscope to a computer are the TekVISA-based OpenChoice and the e*Scope Web-enabled tool. Use OpenChoice to communicate with your oscilloscope from your computer through a software application. Use e*Scope to communicate with your oscilloscope through a Web browser. Using OpenChoice OpenChoice lets you use your MS-Windows computer to acquire data from your oscilloscope for use in an analysis package that runs on your PC, such as Microsoft Excel, National Instruments LabVIEW. or a program of your own creation. You can use a common communications protocol, such as USB, Ethernet, or GPIB to connect the computer to the oscilloscope. 34 DPO4000 Series User Manual Installation To set up OpenChoice communications between your oscilloscope and a computer: 1. Load the TekVISA drivers on your computer. Find these on the OpenChoice Desktop CD or at the Tektronix software finder Web page (www.tektronix.com). When done, the TekVISA icon appears in the Windows System Tray. Typically, this is the bottom right of the Windows desktop on your MS-Windows computer. DPO4000 Series User Manual 35 Installation 2. Connect the DPO4000 to your computer with the appropriate USB or Ethernet cable. To communicate between the DPO4000 and a GPIB system, connect the oscilloscope to the TEK-USB-488 GPIB-to-USB Adapter with a USB cable. Then connect the adapter to your GPIB system with a GPIB cable. 36 DPO4000 Series User Manual Installation 3. Push Utility. 4. Push System repeatedly to select I/O. I/O 5. To use Ethernet, push Ethernet Network Settings. System I/O USB Enabled Ethernet Network Settings GPIB 1 DPO4000 Series User Manual 37 Installation Network Configuration Change Instrument Settings DHCP/ BOOTP On Off On the side-bezel menu, if you are on a DHCP Ethernet network and using a through cable, set DHCP to On. If you are using a cross-over cable, set it to Off and set a hard coded TCPIP address. Test Connection 6. If you are using GPIB, push GPIB. 7. Enter the GPIB address on the side-bezel menu, using multipurpose knob a. Talk/Listen Address a 1 This will set the GPIB address on an attached TEK-USB-488 Adapter. 38 DPO4000 Series User Manual Installation 8. If you are using USB, the system sets itself up automatically for you, if USB is enabled. Check USB on the bottom-bezel menu to be sure that USB is enabled. If it is not enabled, push USB. Then push Enabled on the side-bezel menu. 9. Run your application software on your computer. 10. In case of problems getting oscilloscope-to-PC communications to work, refer to the networking troubleshooter. To bring up the troubleshooter, click the TekVISA icon on the System Tray of your MS-Windows computer. Then go to the online help. Quick Tips The DPO4000 comes with a variety of Windows-based software tools designed to ensure efficient connectivity between your oscilloscope and your computer. There are tool bars that speed connectivity with Microsoft Excel and Word. There is also a standalone acquisition program called the OpenChoice Desktop. The rear-panel USB 2.0 device port is the correct USB port for computer connectivity. Use the rear- and front-panel USB 2.0 host ports to connect your oscilloscope to storage devices and printers. DPO4000 Series User Manual 39 Installation Using e*Scope e*Scope lets you access any Internet-connected DPO4000 Series Oscilloscope from a browser on your workstation, PC, or laptop computer. No matter where you are, your DPO4000 is as close as the nearest browser. To set up e*Scope communications between your oscilloscope and a Web browser running on a remote computer: 1. Connect the DPO4000 to your computer network with the appropriate Ethernet cable. 2. Push Utility. 40 DPO4000 Series User Manual Installation 3. Push System repeatedly to select I/O. I/O 4. Push Ethernet Network Settings. System I/O USB Ethernet Network Settings GPIB DPO4000 Series User Manual 41 Installation Network Configuration 5. Push Change Instrument Settings to determine the Ethernet address and instrument name. On the side-bezel menu, if you are on a DHCP Ethernet network and using dynamic addressing, set DHCP to On. If you are using static addressing, set it to Off. Change Instrument Settings DHCP/ BOOTP On Off Test Connection 6. Start your browser on your remote computer. In the browser address line, enter the IP address or, if DHCP is set to On in the oscilloscope, simply enter the instrument name. 42 DPO4000 Series User Manual Installation 7. You should now see the e*Scope screen, with a copy of the oscilloscope display, on your Web browser. If e*Scope does not work, rerun the procedure. If it still does not work, contact qualified service personnel. DPO4000 Series User Manual 43 Installation 44 DPO4000 Series User Manual Get Acquainted with the Instrument Get Acquainted with the Instrument Front-Panel Menus and Controls The front panel has buttons and controls for the functions that you use most often. Use the menu buttons to access more specialized functions. DPO4000 Series User Manual 45 Get Acquainted with the Instrument Using the Menu System To use the menu system: 1. Push a front-panel menu button to display the menu that you want to use. 46 DPO4000 Series User Manual Get Acquainted with the Instrument 2. Push a lower-bezel button to select a menu item. If a pop-up menu appears, push the lower-bezel button repeatedly to select the desired choice. 3. Push a side-bezel button to choose a side-bezel menu item. If the menu item contains more than one choice, push the side-bezel button repeatedly to cycle through the choices. DPO4000 Series User Manual 47 Get Acquainted with the Instrument 4. To remove a side-bezel menu, push the lower-bezel button again or push Menu Off. 5. Certain menu choices require you to set a numerical value to complete the setup. Use the upper and lower multipurpose knobs a and b to adjust values. 6. Push Fine to turn off or on the ability to make smaller adjustments. 48 DPO4000 Series User Manual Get Acquainted with the Instrument Using the Menu Buttons Use the menu buttons to perform many functions in the oscilloscope. 1. Measure. Push to perform automated measurements on waveforms or to configure cursors. 2. Search. Push to search through an acquisition for user-defined events/criteria. 3. Test. Push to activate advanced or application-specific testing features. 4. Acquire. Push to set the acquisition mode and adjust the record length. 5. Autoset. Push to perform an automatic setup of oscilloscope settings. 6. Trigger Menu. Push to specify trigger settings. DPO4000 Series User Manual 49 Get Acquainted with the Instrument 7. Utility. Push to activate the system utility functions, such as selecting a language or setting the date/time. 8. Default Setup. Push to restore the oscilloscope to the default settings. 9. Save / Recall Menu. Push to save and recall setups, waveforms, and screen images to internal memory, a CompactFlash card, or a USB storage device. 10. Channel 1,2,3, or 4. Push to set vertical parameters for input waveforms and to display or remove the corresponding waveform from the display. 50 DPO4000 Series User Manual Get Acquainted with the Instrument 11. B1 or B2. Push to define and display a bus, if you have the appropriate module application keys. The DPO4AUTO module supports CAN. The DPO4EMBD module supports I2C and SPI. Also, push the B1 or B2 button to display or remove the corresponding bus from the display. 12. R. Push to manage reference waveforms, including the display or removal of each reference waveform from the display. 13. M. Push to manage the math waveform, including the display or removal of the math waveform from the display. DPO4000 Series User Manual 51 Get Acquainted with the Instrument Using Other Controls These buttons and knobs control waveforms, cursors and other data input. 1. Turn the upper multipurpose knob a, when activated, to move a cursor or set a numerical parameter value for a menu item. Push the nearby Fine button to toggle between coarse and fine adjustment. Screen icons tell you when a or b are active. 2. Cursors. Push once to activate the two vertical cursors. Push again to turn on the two vertical and two horizontal cursors. Push again to turn off all cursors. When the cursors are on, you can turn the multipurpose knobs to control their position. 52 DPO4000 Series User Manual Get Acquainted with the Instrument 3. Select. Push to activate special functions. For example, when using the two vertical cursors (and no horizontal ones are visible), you can push this button to link or unlink the cursors. When the two vertical and two horizontal cursors are both visible, you can push this button to make either the vertical cursors or the horizontal ones active. 4. Fine. Push to toggle between making coarse and fine adjustments with the vertical and horizontal position knobs, the trigger level knob, and many operations of multipurpose knobs a and b. 5. Waveform Intensity. Push to enable multipurpose knob a to control waveform display intensity and knob b to control graticule intensity. DPO4000 Series User Manual 53 Get Acquainted with the Instrument 6. Turn the lower multipurpose knob b, when activated, to move a cursor or set a numerical parameter value for a menu item. Push Fine to make adjustments more slowly. 7. Zoom button. Push to activate zoom mode. 8. Pan (outer knob). Turn to scroll the zoom window through the acquired waveform. 9. Zoom (inner knob). Turn to control the zoom factor. Turning it clockwise zooms in further. Turning it counterclockwise zooms out. 10. Play-pause button. Push to start or stop the automatic panning of a waveform. Control the speed and direction with the pan knob. 11. ← Prev. Push to jump to the previous waveform mark. 54 DPO4000 Series User Manual Get Acquainted with the Instrument 12. Set/Clear Mark. Push to establish or delete a waveform mark. 13. → Next. Push to jump to the next waveform mark. 14. Horizontal Position. Turn to adjust the trigger point location relative to the acquired waveforms. Push Fine to make smaller adjustments. 15. Horizontal Scale. Turn to adjust the horizontal scale (time/division). DPO4000 Series User Manual 55 Get Acquainted with the Instrument 16. Run/Stop. Push to start or stop acquisitions. 17. Single. Push to make a single acquisition. 18. Autoset. Push to automatically set the vertical, horizontal, and trigger controls for a usable, stable display. 19. Trigger Level. Turn to adjust the trigger level. 20. Set to 50%. Push to set the trigger level to the midpoint of the waveform. 21. Force Trig. Push to force an immediate trigger event. 56 DPO4000 Series User Manual Get Acquainted with the Instrument 22. Vertical Position. Turn to adjust the vertical position of the corresponding waveform. Push Fine to make smaller adjustments. 23. 1, 2, 3, 4. Push to display or remove the corresponding waveform from the display and access the vertical menu. 24. Vertical Scale. Turn to adjust the vertical scale factor of the corresponding waveform (volts/division). 25. Print. Push to initiate a hard copy using the printer selected in the Utility menu. 26. Power switch. Push to power on or off the instrument. DPO4000 Series User Manual 57 Get Acquainted with the Instrument 27. USB 2.0 host port. Insert a USB cable here to connect peripherals, such as printers and storage devices, to the oscilloscope. There are also two more USB 2.0 host ports on the rear panel. 28. CompactFlash Drive. Insert a CompactFlash card here. 29. CompactFlash Eject. Pops the CompactFlash card out of the CompactFlash drive. 30. Save. Push to perform an immediate save operation. The save operation uses the current save parameters, as defined in the Save / Recall menu. 31. Default Setup. Push to perform an immediate restore of the oscilloscope to the default settings. 32. Menu Off. Push to clear a displayed menu from the screen. 58 DPO4000 Series User Manual Get Acquainted with the Instrument Identifying Items in the Display The items shown to the right may appear in the display. Not all of these items are visible at any given time. Some readouts move outside the graticule area when menus are turned off. DPO4000 Series User Manual 59 Get Acquainted with the Instrument 1. The acquisition readout shows when an acquisition is running, stopped, or when acquisition preview is in effect. Icons are: Run: Acquisitions enabled Stop: Acquisitions not enabled Roll: In roll mode (40 ms/div or slower) PreVu: In this state, the oscilloscope is stopped or between triggers. You can change the horizontal or vertical position or scale to see approximately what the next acquisition will look like. RUN 60 DPO4000 Series User Manual Get Acquainted with the Instrument 2. The trigger position icon shows the trigger position in the acquisition. 3. The expansion point icon (an orange triangle) shows the point that the horizontal scale expands and compresses around. 4. The waveform record view shows the trigger location relative to the waveform record. The line color corresponds to the selected waveform color. DPO4000 Series User Manual 61 Get Acquainted with the Instrument 5. The trigger status readout shows trigger status. Status conditions are: Trig’d: Triggered Auto: Acquiring untriggered signal PrTrig: Acquiring pretrigger data Trig?: Waiting for trigger Trig’d 6. The cursor readout shows time, amplitude, and delta (Δ) values for each cursor. For FFT measurements, it shows frequency and magnitude. 62 DPO4000 Series User Manual Get Acquainted with the Instrument 7. The trigger level icon shows the trigger level on the waveform. The icon color corresponds to the trigger source channel color. 8. The edge trigger readout shows the trigger source, slope, and level. The trigger readouts for other trigger types show other parameters. 9. The top line of the record length/sampling rate readout shows the sampling rate (adjust with the Horizontal Scale knob). The bottom line shows the record length (adjust with the Acquire menu). DPO4000 Series User Manual 63 Get Acquainted with the Instrument 10. The horizontal position/scale readout shows on the top line the horizontal scale (adjust with the Horizontal Scale knob) and on the bottom line the time from the T symbol to the expansion point icon (adjust with the Horizontal Position knob). Use horizontal position to insert added delay between when the trigger occurs and when you actually capture the data. Insert a negative time to capture more pretrigger information. 11. The auxiliary waveform readouts show the vertical and horizontal scale factors of the math or reference waveforms. 12. The channel readout shows the channel scale factor (per division), coupling, and invert status. Adjust with the Vertical Scale knob and the channel 1, 2, 3, or 4 menus. 64 DPO4000 Series User Manual Get Acquainted with the Instrument 13. Measurement readouts show the selected measurements. You can select up to four measurements to display at one time. A symbol appears instead of the expected numerical measurement if a vertical clipping condition exists. Part of the waveform is above or below the display. To obtain a proper numerical measurement, turn the vertical scale and position knobs to make all of the waveform appear in the display. 14. The waveform baseline indicator shows the zero-volt level of a waveform (ignoring the effect of offset). The icon colors correspond to the waveform colors. DPO4000 Series User Manual 65 Get Acquainted with the Instrument Front-Panel Connectors 1. Channel 1, 2, (3, 4). Channel inputs with TekVPI Versatile Probe Interface. 2. Aux In. Trigger level range is adjustable from +8 V to –8 V. The maximum input voltage is 400V peak, 250V RMS. Input resistance is 1 MΩ ± 1% in parallel with 13 pF ±2 pF. 3. PROBE COMP. Square wave signal source to compensate probes. Output voltage: 0 – 2.5V, amplitude ± 1% behind 1k Ω ±2%. Frequency: 1 kHz. 4. Ground. 5. Application Module Slots. 66 DPO4000 Series User Manual Get Acquainted with the Instrument Side-Panel Connector 1. Ground strap connector. This is a receptacle for a grounding strap. DPO4000 Series User Manual 67 Get Acquainted with the Instrument Rear-Panel Connectors 1. Trigger Out. Use the trigger signal output to synchronize other test equipment with your oscilloscope. A LOW to HIGH transition indicates the trigger occurred. The logic level for Vout (HI) is ≥2.5V open circuit; ≥1.0 V into a 50Ω load to ground. The logic level for Vout (LO) is ≤0.7 V into a load of ≤4 mA; ≤0.25 V into a 50Ω load to ground. 2. XGA Out. Use the XGA Video port (DB-15 female connector) to show the oscilloscope display on an external monitor or projector. 3. LAN. Use the LAN (Ethernet) port (RJ-45 connector) to connect the oscilloscope to a 10/100 Base-T local area network. 4. Device. Use the USB 2.0 High speed device port to control the oscilloscope through USBTMC or GPIB with a TEK-USB-488 Adapter. The USBTMC protocol allows USB devices to communicate using IEEE488 style messages. This lets you run your GPIB software applications on USB hardware. 68 DPO4000 Series User Manual Get Acquainted with the Instrument 5. Host. Use the USB 2.0 Full speed host ports (two) to take advantage of USB mass storage devices and printers. 6. Power input. Attach to an AC power line with integral safety ground. (See page 6, Operating Considerations.) DPO4000 Series User Manual 69 Acquire the Signal Acquire the Signal This section describes concepts of and procedures for setting up the oscilloscope to acquire the signal as you want it to. Setting Up Signal Input Use front-panel buttons to set up your instrument to acquire the signal. 1. Connect the P6139A or VPI probe to the input signal source. 70 DPO4000 Series User Manual Acquire the Signal 2. Select the input channel by pushing the front-panel buttons. NOTE. If you are using a probe that does not supply probe encoding (not a P6139A nor a VPI probe), set the attenuation (probe factor) on the oscilloscope side-bezel menu. 3. Push Autoset. DPO4000 Series User Manual 71 Acquire the Signal 4. Push the desired channel button. Then adjust the vertical position and scale. 5. Adjust the horizontal position and scale. The horizontal position determines the number of pretrigger and posttrigger samples. The horizontal scale determines the size of the acquisition window relative to the waveform. You can scale the window to contain a waveform edge, a cycle, several cycles, or thousands of cycles. 72 DPO4000 Series User Manual Acquire the Signal Quick Tip Use the zoom feature to see multiple acquisition cycles in the upper part and a single cycle in the lower part of the display. (See page 163, Managing Long Record Length Waveforms.) Using the Default Setup To return the oscilloscope to its default settings: 1. Push Default Setup. 2. If you change your mind, push Undo Default Setup to undo the last default setup. Undo Default Setup Quick Tip The DPO4000 Technical Reference describes the default setup settings in detail. This manual is available on the accompanying CD or at www.tektronix.com. DPO4000 Series User Manual 73 Acquire the Signal Using Autoset Autoset adjusts the instrument (acquisition, horizontal, trigger, and vertical controls) such that it displays two or three waveform cycles with the trigger near the midlevel. 1. Connect the probe, and then select the input channel. (See page 70, Setting Up Signal Input.) 2. Push Autoset to execute an Autoset. 3. If desired, push Autoset Undo to undo the last Autoset. Undo Autoset 74 DPO4000 Series User Manual Acquire the Signal Quick Tips To position the waveform appropriately, Autoset may change the vertical position. Autoset always sets vertical offset to 0 V. If you use Autoset when no channels are displayed, the instrument turns on channel one (1) and scales it. Acquisition Concepts Before a signal can be displayed, it must pass through the input channel where it is scaled and digitized. Each channel has a dedicated input amplifier and digitizer. Each channel produces a stream of digital data from which the instrument extracts waveform records. Sampling Process Acquisition is the process of sampling an analog signal, converting it into digital data, and assembling it into a waveform record, which is then stored in acquisition memory. Input signal Sampled points Digital values DPO4000 Series User Manual 75 Acquire the Signal Real-time Sampling Record points DPO4000 series oscilloscopes use real-time sampling. In real-time sampling, the instrument digitizes all of the points it acquires using a single trigger event. Sampling rate 76 DPO4000 Series User Manual Acquire the Signal Waveform Record The instrument builds the waveform record through use of the following parameters: Sample interval: The time between recorded sample points. Adjust this by turning the Horizontal Scale knob. Record length: The number of samples required to fill a waveform record. Set this by pushing the Acquire button and using the resulting lower-bezel menu. Trigger point: The zero time reference in a waveform record. It is shown on the screen by an orange T. DPO4000 Series User Manual 77 Acquire the Signal Horizontal position: The time from the trigger point to the expansion point. Adjust this by turning the Horizontal Position knob. Use a positive time to acquire the record after the trigger point. Use a negative time to acquire it before the trigger point. Expansion point: The point that the horizontal scale expands and contracts around. It is shown by an orange triangle. How the Acquisition Modes Work Sample mode retains the first sampled point from each acquisition interval. Sample is the default mode. 78 DPO4000 Series User Manual Acquire the Signal Peak Detect mode uses the highest and lowest of all the samples contained in two consecutive acquisition intervals. This mode only works with real-time, noninterpolated sampling and is useful for catching high frequency glitches. Hi Res mode calculates the average of all the samples for each acquisition interval. This mode also only works with real-time, noninterpolated sampling. Hi-Res provides a higher-resolution, lower-bandwidth waveform. Envelope mode finds the highest and lowest record points over all acquisitions. Envelope uses Peak Detect for each individual acquisition. Average mode calculates the average value for each record point over a user-specified number of acquisitions. Average uses Sample mode for each individual acquisition. Use average mode to reduce random noise. DPO4000 Series User Manual 79 Acquire the Signal Changing the Acquisition Mode and Record Length Use this procedure to change the acquisition mode. 1. Push Acquire. 2. Push Mode. Mode Average Record Length 10k Reset Horizontal Position Waveform Display 80 DPO4000 Series User Manual Acquire the Signal Acquisition Mode Sample Peak Detect Hi Res Envelope 3. Then choose the acquisition mode from the side-bezel menu. You can chose from: Sample, Peak Detect, Hi Res, Envelope, or Average. NOTE. Peak Detect and High Res require more than one sample point per sample interval. If there is only one sample point, these two modes will appear the same as sample mode. Average 16 DPO4000 Series User Manual 81 Acquire the Signal 4. If you chose Average, turn multipurpose knob a to set the number of waveforms to average over. 5. Push Record Length. 6. Push the side-bezel menu, record length button. 1000 points Choose between: 1000, 10 k, 100 k, 1 M, and 10 M points. 82 DPO4000 Series User Manual Acquire the Signal Using Roll Mode Roll mode gives a display similar to a strip chart recorder for low-frequency signals. Roll mode lets you see acquired data points without waiting for the acquisition of a complete waveform record. Roll mode is enabled when the trigger mode is auto and the horizontal scale is set to 40 ms/div or slower. Quick Tips Switching to Envelope or Average acquisition mode, using math waveforms, or switching to normal trigger will disable Roll mode. Roll mode is disabled when you set the horizontal scale to 20 ms per division or faster. Push Run/Stop to halt Roll mode. DPO4000 Series User Manual 83 Acquire the Signal Defining a Serial Bus Your DPO4000 oscilloscope can trigger on I2C and SPI serial buses if the DPO4EMBD application module is installed. It can trigger on CAN serial buses if the DPO4AUTO application module is installed. It can display the physical layer of a bus (as analog waveforms), digital waveforms, and protocol level information (as symbolic waveforms). Plug in the DPO4EMBD application module to use the I2C and SPI features. Plug in the DPO4AUTO application module to use the CAN features. Using buses in two steps To quickly use serial bus triggering: 1. Push B1 or B2 and enter parameters of the bus to trigger on. You can separately use B1 and B2 to view two different buses. 2. Push Trigger Menu and enter trigger parameters. (See page 98, Choosing a Trigger.) You can display bus information without triggering on the bus signal. 84 DPO4000 Series User Manual Acquire the Signal Setting up serial bus parameters To set up bus parameters: 1. Push B1 or B2 to bring up the lower-bezel bus menu. I2C SPI 2. Push Bus as many times as needed to select the desired bus (I2C, SPI, or CAN) from the pop-up menu. CAN DPO4000 Series User Manual 85 Acquire the Signal 3. Push Define Inputs and use the side-bezel buttons to assign oscilloscope channels to the serial bus signal(s). Bus I2C Define Inputs Thresholds Display As Bus Bus Decode Hex For example, with an I2C bus, you might assign channel 1 to supply the SCLK signal and channel 2 to supply the SDA signal. You can assign any channel to a predefined bus signal. For all serial bus sources, use channel 1 to channel 4. Do not use the Aux In input. 4. Push Thresholds. Bus I2C Define Inputs Thresholds Display As Bus Decode 86 DPO4000 Series User Manual Acquire the Signal For each signal that makes up the serial bus, push the appropriate side-bezel menu button. Then turn the appropriate multipurpose knob to define the voltage level above which the oscilloscope treats the signal as high and below which as low. 5. If you selected CAN above, push Bit Rate and the desired side-bezel menu choice. Bus CAN Define Inputs Thresholds Bit Rate 500 Kbps Display As Bus Bus Decode Hex 6. If you selected SPI above, push Polarity and the desired side-bezel menu choice. Bus SPI Define Inputs Thresholds Polarity Display As Bus Bus Decode Hex Active High means when a signal is greater than the threshold value, it is considered a logical 1. Active Low means when the signal is lower than the threshold value, it is considered a logical 1. DPO4000 Series User Manual 87 Acquire the Signal 7. Push Display As and use the side-bezel menu to define how to display the serial bus. Display As Push Bus to display packet level information decoded for easy visual inspection, much like what you would see on a logic analyzer. Bus Push Waveforms to display the digital (high or low) representations of the waveforms. Waveforms Push Bus and Waveforms to display both views of the signal. Bus and Waveforms Push Event Table On to display a list of packets in the bus. Event Table On Off Sample bus information: 88 DPO4000 Series User Manual Acquire the Signal Sample waveforms: Sample event table: 8. Push Bus Decode and the desired side-bezel menu choice to display the bus data in hexadecimal or binary format. 9. Turn multipurpose knob a to move the bus display up or down on the screen. DPO4000 Series User Manual 89 Acquire the Signal You can also trigger on packet level information on your serial bus. (See page 102, Triggering on Buses.) NOTE. To acquire signals from two buses simultaneously, use this procedure once to define the parameters of the B1 bus and again to define the B2 bus. 90 DPO4000 Series User Manual Trigger Setup and Run Trigger Setup and Run This section contains concepts and procedures for setting up the oscilloscope to trigger on your signal. Triggering Concepts Trigger Event The trigger event establishes the time-reference point in the waveform record. All waveform record data is located in time with respect to that point. The instrument continuously acquires and retains enough sample points to fill the pretrigger portion of the waveform record. That is the part of the waveform that is displayed before, or to the left of, the triggering event on screen. When a trigger event occurs, the instrument starts acquiring samples to build the posttrigger portion of the waveform record, that is, the part displayed after or to the right of the trigger event. After a trigger is recognized, the instrument will not accept another trigger until the acquisition is complete and the holdoff time has expired. DPO4000 Series User Manual 91 Trigger Setup and Run Untriggered display Triggered display Trigger Modes The trigger mode determines how the instrument behaves in the absence of a trigger event: Normal trigger mode enables the instrument to acquire a waveform only when it is triggered. If no trigger occurs, the last waveform record acquired remains on the display. If no last waveform exists, no waveform is displayed. Auto trigger mode enables the instrument to acquire a waveform even if a trigger does not occur. Auto mode uses a timer that starts when the acquisition is started, and the pretrigger information is obtained. If a trigger event is not detected before the timer times out, the instrument forces a trigger. The length of time it waits for a trigger event depends on the time base setting. 92 DPO4000 Series User Manual Trigger Setup and Run Auto mode, when forcing triggers in the absence of valid triggering events, does not synchronize the waveform on the display. The waveform will appear to roll across the screen. If valid triggers occur, the display will become stable. You can also force the instrument to trigger by pushing the front-panel Force Trig button. Trigger Holdoff Adjust holdoff to obtain stable triggering when the instrument is triggering on undesired trigger events. Trigger holdoff can help stabilize triggering, since the oscilloscope does not recognize new triggers during the holdoff time. When the instrument recognizes a trigger event, it disables the trigger system until acquisition is complete. In addition, the trigger system remains disabled during the holdoff period that follows each acquisition. Holdoffs DPO4000 Series User Manual 93 Trigger Setup and Run Trigger Coupling Trigger coupling determines what part of the signal is passed to the trigger circuit. Edge triggering can use all available coupling types: DC, Low Frequency Rejection, High Frequency Rejection, and Noise Rejection. All other trigger types use DC coupling only. Horizontal Position Use horizontal position to acquire waveform detail in a region that is separated from the trigger location by a significant interval of time. 94 DPO4000 Series User Manual Trigger Setup and Run 1. Adjust the position (delay) time by rotating the Horizontal Position knob. 2. Turn horizontal SCALE to acquire the detail that you need around the position (delay) expansion point. DPO4000 Series User Manual 95 Trigger Setup and Run The part of the record that occurs before the trigger is the pretrigger portion. The part that occurs after the trigger is the posttrigger portion. Pretrigger data can help you troubleshoot. For example, to find the cause of an unwanted glitch in your test circuit, you can trigger on the glitch and make the pretrigger period large enough to capture data before the glitch. By analyzing what happens before the glitch, you may uncover information that helps you find the source of the glitch. Alternatively, to see what is happening in your system as a result of the trigger event, make the posttrigger period large enough to capture data after the trigger. Slope and Level The slope control determines whether the instrument finds the trigger point on the rising or the falling edge of a signal. The level control determines where on that edge the trigger point occurs. The DPO4000 provides a long horizontal bar or bars across the graticule to temporarily show the trigger level. 96 DPO4000 Series User Manual Trigger Setup and Run 1. Turn the front-panel Trigger Level knob to adjust the trigger level without going to a menu. 2. Push the front-panel Set to 50% button to quickly set the trigger level to the midpoint of the waveform. Delayed Trigger System Trigger with the A (Main) trigger system alone or, if using an edge trigger, combine the A (Main) trigger with the B (Delayed) trigger to trigger on sequential events. When using sequential triggering, the A trigger event arms the trigger system, and the B trigger event triggers the instrument when the B trigger conditions are met. A and B triggers can (and typically do) have separate sources. The B trigger condition can be based on a time delay or a specified number of events. (See page 107, Using A (Main) and B (Delayed) Triggers.) DPO4000 Series User Manual 97 Trigger Setup and Run Choosing a Trigger To select a trigger: 1. Push Trigger Menu. Edge Pulse Width Runt Logic Setup & Hold Rise/Fall Time Video 2. Push Type repeatedly to select the trigger type to use. NOTE. The bus trigger requires use of the DPO4EMBD or the DPO4AUTO application module. Bus 98 DPO4000 Series User Manual Trigger Setup and Run 3. Complete the trigger setup using the lower-bezel menu controls displayed for the trigger type. The controls to set up the trigger vary depending on the trigger type. Type Edge Source 1 Coupling DC Slope Level 100 mV Mode Auto & Holdoff Configure B Trigger Selecting Triggers Trigger Type Trigger Conditions Edge Trigger on a rising or falling edge, as defined by the slope control. Coupling choices are DC, LF Reject, HF Reject, and Noise Reject. Edge triggers are the simplest and most commonly used trigger type, with both analog and digital signals. An edge trigger event occurs when the trigger source passes through a specified voltage level in the specified direction. DPO4000 Series User Manual 99 Trigger Setup and Run Trigger Type Trigger Conditions Pulse/Width Trigger on pulses that are less than, greater than, equal to, or not equal to a specified time. You can trigger on positive or negative pulses. Pulse/width triggers are primarily used on digital signals. Runt Trigger on a pulse amplitude that crosses one threshold but fails to cross a second threshold before recrossing the first. You can detect positive or negative (or either) runts, or only those wider than, less than, greater than, equal to, or not equal to a specified width. Runt triggers are primarily used on digital signals. Logic Logic triggers are primarily used with digital signals. You can set each input to high, low, or don’t care. In addition, you can use one channel as a clock source set to either the rising or falling edge. Trigger when logic inputs cause the selected function to become True or False. You can also specify that the logic conditions be satisfied for a specific amount of time before triggering. 100 DPO4000 Series User Manual Trigger Setup and Run Trigger Type Trigger Conditions Setup and Hold Violation Trigger when a logic data input changes state inside of the setup or hold time relative to a clock edge. Setup is the amount of time that data should be stable and not change before a clock edge occurs. Hold is the time that data should be stable and not change after a clock edge occurs. Rise/Fall Time Trigger on rise and fall times. Trigger on pulse edges that traverse between two thresholds at faster or slower rates than the specified time. Specify pulse edges as positive or negative or either. Video Trigger on specified fields or lines of a composite video signal. Only composite signal formats are supported. Trigger on NTSC, PAL, or SECAM.Works with Macrovision signals. DPO4000 Series User Manual 101 Trigger Setup and Run Trigger Type Trigger Conditions Bus Optional: Trigger on common, serial-bus, packet-level information with the following application modules: DPO4EMBD — I2C and SPI DPO4AUTO — CAN Triggering on Buses You can use your DPO4000 oscilloscope to trigger on CAN, I2C, and SPI buses, if you have the DPO4AUTO or the DPO4EMBD application module installed. The DPO4000 can display both physical layer (as analog waveforms ) and protocol level information (as digital and symbolic waveforms). To set up the bus trigger: 1. If you have not already defined your bus using the front-panel B1 or B2 buttons, do so now. (See page 84, Defining a Serial Bus.) 102 DPO4000 Series User Manual Trigger Setup and Run 2. Push Trigger Menu. Bus 3. Push and keep pushing the Type button of the lower-bezel menu until you select Bus. Type Bus Source Bus B1 (I2C) Trigger On Address Address 07F Direction Write Mode Auto & Holdoff DPO4000 Series User Manual 103 Trigger Setup and Run 4. Push and keep pushing the Source Bus B1 (I2C) button of the lower-bezel menu until you select the bus that you want to trigger on. B2 (I2C) 5. Push and keep pushing the lower-bezel menu Trigger On button until you select the desired trigger on feature. If you are using the I2C bus trigger, you can trigger on Start, Repeated Start, Stop, Missing Ack, Address, Data, or Address/Data. If you are using the SPI bus trigger, you can trigger on SS Active, MOSI, MISO, or MOSI & MISO. If you are using the CAN bus trigger, you can trigger on Start of Frame, Type of Frame, Identifier, Data, Id & Data, End of Frame, and Missing Ack. 104 DPO4000 Series User Manual Trigger Setup and Run 6. If you are setting up an I2C trigger and have selected a Trigger On selection of Address or Address/Data, push the lower-bezel menu Address button to access the Address side-bezel menu. Press the side-bezel menu Address button. Enter the address parameters of interest with multipurpose knobs a and b. Then push the lower-bezel menu Direction button to enter the direction of interest. Choices are: Read, Write, and Read or Write. DPO4000 Series User Manual 105 Trigger Setup and Run Bus Trigger Data Matching Rolling window byte matching for I2C and SPI. You can use a rolling window to trigger on data with SPI and I2C buses. You define the number of bytes to match. Then the oscilloscope uses a rolling window to find any match within a packet, with the window rolling one byte at a time. For example, if the number of bytes is one, the oscilloscope will match the first byte, second byte, third, and so on within the packet. If the number of bytes is two, the oscilloscope will try to match any two consecutive bytes, such as one and two, two and three, three and four, and so on. If the oscilloscope finds a match, it will then trigger. Specific byte matching (non-rolling window matching) for CAN, I2C, and SPI. You can trigger on a specific byte for SPI and I2C in two ways: For I2C and SPI, enter the number of bytes to match the number of bytes in the signal. Then use don’t cares (X) to mask the bytes that you are not interested in. For I2C, push the bottom-bezel Trigger On to trigger on Address/Data. Push Address. On the side-bezel menu, push Address and rotate multipurpose knobs a and b as needed. Set the address to don’t cares (X) if you want to mask the address. The data will be matched starting at the first byte without using a rolling window. For CAN, triggering occurs when the user-selected data input matches the data and qualifier in the signal starting at the first byte. Set the number of bytes to match the number of bytes of interest. Use the data qualifier to perform: =, !=, <, >, >=, and <= operations. Triggering on identifier and data always matches the identifier and data selected by the user, with the data starting at the first byte. No rolling window is used. 106 DPO4000 Series User Manual Trigger Setup and Run Checking Trigger Status To quickly determine the settings of some key trigger parameters, check the Trigger readout at the bottom of the display. The readouts differ for edge and the advanced triggers. 1. Trigger source = channel 1. 2. Trigger slope = rising. 3. Trigger level = 0.00 V. Edge trigger readout Using A (Main) and B (Delayed) Triggers Combine an edge A Event (Main) trigger with the B Event (Delayed) trigger to capture more complex signals. After the A Event occurs, the trigger system looks for the B Event before triggering and displaying the waveform. To use the B trigger: 1. Push Trigger Menu. DPO4000 Series User Manual 107 Trigger Setup and Run 2. Press Type repeatedly to select a trigger type of Edge. 3. Push Configure B Trigger. This brings up the B trigger menu. The B Trigger Setup item only appears if the A trigger is set to edge trigger. Type Edge Source 1 Coupling DC Slope Level 0.00 V Mode Auto & Holdoff Configure B Trigger 4. Set the B trigger parameters as defined in the B trigger lower-bezel and side-bezel menu items. B Trigger On B Trigger After A Time Source 1 Coupling DC Slope Level 0.00V Configure A Trigger 108 DPO4000 Series User Manual Trigger Setup and Run Trigger on B Event The A trigger arms the instrument. Posttrigger acquisition starts on the nth B event. DPO4000 Series User Manual 109 Trigger Setup and Run B Trigger After Delay Time The A trigger arms the instrument. Posttrigger acquisition starts on the first B edge after the trigger delay time. Quick Tips B-trigger delay time and horizontal position are independent functions. When you establish a trigger condition using either the A trigger alone or the A and B triggers together, you can also use horizontal position to delay the acquisition by an additional amount. When using the B trigger, the A and B trigger types can only be Edge. 110 DPO4000 Series User Manual Trigger Setup and Run Starting and Stopping an Acquisition After you have defined the acquisition and trigger parameters, start the acquisition with Run/Stop or Single. Push Run/Stop to start the acquisition. Push it again to stop the acquisition. Push Single to take a single acquisition. Single sets the trigger mode to Normal for the single acquisition. DPO4000 Series User Manual 111 Display Waveform Data Display Waveform Data This section contains concepts and procedures for displaying the acquired waveform. Adding and Removing a Waveform 1. To add or remove an active waveform from the display, push the relevant front-panel channel button. You can use the channel as a trigger source whether or not it is displayed. Setting the Display Style and Persistence 1. To set the display style, push Acquire. 112 DPO4000 Series User Manual Display Waveform Data 2. Push Waveform Display. Mode Sample Record Length 10k Reset Horizontal Position Waveform Display DPO4000 Series User Manual 113 Display Waveform Data 3. Push Dots Only On Off from the side-bezel menu. Dots on will display the waveform record points as dots on the screen. Dots off connects the dots with vectors. Waveform Display Dots Only On Off 4. Push Persist Time, and turn multipurpose knob a to have waveform data remain on screen for a user-specified amount of time. Persist Time a Auto 5. Push Set to Auto to have the oscilloscope automatically determine a persistence time for you. Set to Auto 6. Push Clear Persistence to reset the persistence information. Clear Persistence 114 DPO4000 Series User Manual Display Waveform Data Quick Tips Variable persistence accumulates record points for a specified time interval. Each record point decays independently according to the time interval. Use variable persistence for displaying infrequently appearing signal anomalies, such as glitches. Infinite persistence continuously accumulates record points until you change one of the acquisition display settings. Use infinite persistence for displaying unique signal anomalies, such as glitches. Setting Waveform and Graticule Intensity 1. Push the front-panel Intensity button. This will bring up the intensity readout on the display. DPO4000 Series User Manual 115 Display Waveform Data 2. Rotate multipurpose knob a to select the desired waveform intensity. 3. Rotate multipurpose knob b to select the desired intensity for the graticule and text. 4. Push Intensity again to clear the intensity readout from the display. 116 DPO4000 Series User Manual Display Waveform Data Setting the Graticule Style 1. To set the graticule style, push Utility. 2. Push System repeatedly until you select Display from the pop-up menu. Display 3. Push Graticule from the lower-bezel menu. System Display Backlight Intensity High Graticule Full DPO4000 Series User Manual 117 Display Waveform Data 4. Select the desired style from the resulting side-bezel menu. Use the Full graticule for quick estimates of waveform parameters. Use the Grid graticule for full-screen measurements with cursors and automatic readouts when cross hairs are not needed. Use the Cross Hair graticule for making quick estimates of waveforms while leaving more room for automatic readouts and other data. Use the Frame graticule with automatic readouts and other screen text when display features are not needed. Setting the LCD Backlight 1. Push Utility. 118 DPO4000 Series User Manual Display Waveform Data 2. Push System repeatedly until you select Display. Display 3. Push Backlight Intensity. System Display Backlight Intensity High Graticule Full Backlight Intensity High Medium 4. Select the intensity level from the resulting side-bezel menu. Choices are: High, Medium, and Low. Low DPO4000 Series User Manual 119 Display Waveform Data Scaling and Positioning a Waveform Use the horizontal controls to adjust the time base, adjust the trigger point, and to examine waveform details more closely. Original waveform Scaled horizontally Positioned horizontally 120 DPO4000 Series User Manual Display Waveform Data Use the vertical controls to select waveforms, adjust the waveform vertical position and scale, and set input parameters. Push a channel button (1, 2, 3, or 4), the MATH button, or the REF button or the B1 or B2 button as many times as needed and the associated menu items to select, add, or remove a waveform. Original waveform Scaled vertically Positioned vertically Quick Tips Preview. If you change the Position or Scale controls when the acquisition is stopped or when it is waiting for the next trigger, the oscilloscope rescales and repositions the relevant waveforms in response to the new control settings. It simulates what you will see when you next push the RUN button. The oscilloscope uses the new settings for the next acquisition. You may see a clipped waveform if the original acquisition went off the screen. The math waveform, cursors, and automatic measurements remain active and valid when using preview. DPO4000 Series User Manual 121 Display Waveform Data Setting Input Parameters Use the vertical controls to select waveforms, adjust the waveform vertical position and scale, and set input parameters. 1. Push channel button 1, 2, 3, or 4 to bring up the vertical menu for the designated waveform. The vertical menu only affects the selected waveform. Pushing a channel button will also select or cancel that waveform selection. 2. Push Coupling. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1X 122 DPO4000 Series User Manual Display Waveform Data 3. Push DC, AC, or GND (ground). Use DC coupling to pass both AC and DC components. DC Use AC coupling to block the DC component and show only the AC signal. AC Use Ground (GND) to display the reference potential. GND 4. Push Ω. Ω 1M 50 Set the input impedance (termination) to 50 Ω or 1 MΩ if using DC or Gnd coupling. Input impedance is automatically set to 1 MΩ when using AC coupling. For more information on input impedance, see Quick Tips below. DPO4000 Series User Manual 123 Display Waveform Data 5. Push Invert to invert the signal. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1X Select Invert Off for normal operation and Invert On to invert the polarity of the signal in the preamplifier. 6. Push Bandwidth, and select the desired bandwidth from the resulting side-bezel menu. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X The set choices are: Full, 250 MHz, and 20 MHz. Additional choices may appear, depending on the probe that you use. Select Full to set the bandwidth to the full oscilloscope bandwidth. Select 250 MHz to set the bandwidth to 250 MHz. Select 20 MHz to set the bandwidth to 20 MHz. 124 DPO4000 Series User Manual Display Waveform Data 7. Push Fine Scale to enable multipurpose knob a to make fine vertical scale adjustments. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X 8. Push Offset to enable multipurpose knob a to make vertical offset adjustments. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X On the side-bezel menu, choose Set to 0 V to set the vertical offset to 0 V. For more information on offset, see the Quick Tips below. DPO4000 Series User Manual 125 Display Waveform Data 9. Push Position to enable multipurpose knob a to make vertical position adjustments. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X NOTE. You can also use the position knob on the front panel to do this. On the side-bezel menu, choose Set to 0 divs to set the vertical position to the center of the screen. For more information on vertical position, see the Quick Tips below. 126 DPO4000 Series User Manual Display Waveform Data 10. Push Probe Setup to define probe parameters. Coupling DC Invert Off Bandwidth Full Fine Scale 100mV/div Offset 0.00V Position 0.00 div Probe Setup 1 X On the resulting side-bezel menu: Select Voltage Probe or Current Probe to set the probe gain or attenuation for probes that do not have the TekProbe II or TekVPI interface. Push Deskew to set the time skew correction to zero. Turn multipurpose knob a to adjust the time skew (deskew) correction for the probe attached to the selected channel. This shifts acquisition and display of the waveform left or right, relative to the trigger time. Use this to compensate for differences in cable lengths or probe types. Select Attenuation to choose the probe attenuation. DPO4000 Series User Manual 127 Display Waveform Data Quick Tips Using Probes with the TekProbe II and TekVPI Interfaces. When you attach a probe with the TekProbe II or the TekVPI interface, the oscilloscope sets the channel sensitivity, coupling, and termination resistance automatically to match the probe requirements. Tek Probe II probes require use of the TPA-BNC Adapter. The Difference Between Vertical Position and Offset. Vertical position is a display function. Adjust the vertical position to place the waveforms where you want to see them. The waveform baseline locations track adjustments made to their positions. When you adjust vertical offset, you see a similar effect, but it is actually quite different. Vertical offset is applied before the oscilloscope preamplifier and can be used to increase the effective dynamic range of the inputs. For example, you can use vertical offset to look at small variations in a large DC voltage. Set the vertical offset to match the nominal DC voltage and the signal appears in the center of the screen. 50 Ω Protection. If you select 50 Ω termination, the maximum vertical scale factor is limited to 1 V/div. If you apply excessive input voltage, the oscilloscope automatically switches to 1 M Ω termination to protect the internal 50 Ω termination. For more details, refer to the specifications in the DPO4000 Technical Reference. 128 DPO4000 Series User Manual Analyze Waveform Data Analyze Waveform Data After having properly set up the acquisition, triggering, and display of your desired waveform, you can then analyze the results. Select from features such as cursors, automatic measurements, statistics, math, and FFT. Taking Automatic Measurements To take an automatic measurement: 1. Push Measure. 2. Push Select Measurement. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 129 Analyze Waveform Data 3. Turn multipurpose knob a to select the channel from which you want to measure. This step is only needed if you are acquiring data on more than one channel. 4. Select the specific measurement or measurements from the side-bezel menu. 5. To remove a measurement, push Remove Measurement and the specific measurement from the resulting side-bezel menu. Quick Tips To remove all measurements, select Remove All. A symbol appears instead of the expected numerical measurement if a vertical clipping condition exists. Part of the waveform is above or below the display. To obtain a proper numerical measurement, turn the vertical scale and position knobs to make all of the waveform appear in the display. 130 DPO4000 Series User Manual Analyze Waveform Data Selecting Automatic Measurements The following tables list each automatic measurement by category: amplitude or time. (See page 129, Taking Automatic Measurements.) Time Measurements Measurement Description Period The time required to complete the first cycle in a waveform or gated region. Period is the reciprocal of frequency and is measured in seconds. Frequency The first cycle in a waveform or gated region. Frequency is the reciprocal of the period; it is measured in hertz (Hz) where one Hz is one cycle per second. Delay The time between the mid reference (default 50%) amplitude point of two different waveforms. See also Phase. Rise Time The time required for the leading edge of the first pulse in the waveform or gated region to rise from the low reference value (default = 10%) to the high reference value (default = 90%) of the final value. Fall Time The time required for the falling edge of the first pulse in the waveform or gated region to fall from the high reference value (default = 90%) to the low reference value (default = 10%) of the final value. Positive Duty Cycle The ratio of the positive pulse width to the signal period expressed as a percentage. The duty cycle is measured on the first cycle in the waveform or gated region. DPO4000 Series User Manual 131 Analyze Waveform Data Time Measurements (cont.) Measurement Description Negative Duty Cycle The ratio of the negative pulse width to the signal period expressed as a percentage. The duty cycle is measured on the first cycle in the waveform or gated region. Positive Pulse Width The distance (time) between the mid reference (default 50%) amplitude points of a positive pulse. The measurement is made on the first pulse in the waveform or gated region. Negative Pulse Width The distance (time) between the mid reference (default 50%) amplitude points of a negative pulse. The measurement is made on the first pulse in the waveform or gated region. Burst Width The duration of a burst (a series of transient events) and is measured over the entire waveform or gated region. Phase The amount of time that one waveform leads or lags another waveform, expressed in degrees where 360° comprises one waveform cycle. See also Delay. 132 DPO4000 Series User Manual Analyze Waveform Data Amplitude Measurements Measurement Description Positive Overshoot This is measured over the entire waveform or gated region and is expressed as: Positive Overshoot = (Maximum – High) / Amplitude x 100%. Negative Overshoot This is measured over the entire waveform or gated region and is expressed as: Negative Overshoot = (Low – Minimum) / Amplitude x 100%. DPO4000 Series User Manual 133 Analyze Waveform Data Amplitude Measurements (cont.) Measurement Description Pk-Pk The absolute difference between the maximum and minimum amplitude in the entire waveform or gated region. Amplitude The high value less the low value measured over the entire waveform or gated region. High This value is used as 100% whenever high reference, mid reference, or low reference values are needed, such as in fall time or rise time measurements. Calculate using either the min/max or histogram method. The min/max method uses the maximum value found. The histogram method uses the most common value found above the midpoint. This value is measured over the entire waveform or gated region. Low This value is used as 0% whenever high reference, mid reference, or low reference values are needed, such as in fall time or rise time measurements. Calculate using either the min/max or histogram method. The min/max method uses the minimum value found. The histogram method uses the most common value found below the midpoint. This value is measured over the entire waveform or gated region. Max The most positive peak voltage. Max is measured over the entire waveform or gated region. Min The most negative peak voltage. Min is measured over the entire waveform or gated region. 134 DPO4000 Series User Manual Analyze Waveform Data Amplitude Measurements (cont.) Measurement Description Mean The arithmetic mean over the entire waveform or gated region. Cycle Mean The arithmetic mean over the first cycle in the waveform or the first cycle in the gated region. RMS The true Root Mean Square voltage over the entire waveform or gated region. Cycle RMS The true Root Mean Square voltage over the first cycle in the waveform or the first cycle in the gated region. DPO4000 Series User Manual 135 Analyze Waveform Data Miscellaneous Measurements Measurement Description Area Area measurement is a voltage over time measurement. It returns the area over the entire waveform or gated region in volt-seconds. Area measured above ground is positive; area measured below ground is negative. Cycle Area A voltage over time measurement. The measurement is the area over the first cycle in the waveform or the first cycle in the gated region expressed in volt-seconds. The area above the common reference point is positive while the area below the common reference point is negative. 136 DPO4000 Series User Manual Analyze Waveform Data Customizing an Automatic Measurement You can customize automatic measurements by using gating, modifying measurement statistics, adjusting the measurement reference levels, or taking a snapshot. Gating Gating confines the measurement to a certain portion of a waveform. To use: 1. Push Measure. 2. Push Gating. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 137 Analyze Waveform Data 3. Position the gates from the side-bezel menu options. Gating Off (Full record) Screen Between cursors Bring cursors on screen 138 DPO4000 Series User Manual Analyze Waveform Data Statistics Statistics characterize the stability of measurements. To adjust statistics: 1. Push Measure. 2. Push Statistics. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 139 Analyze Waveform Data Measurement Statistics On Off Mean & Std Dev Samples a 32 3. Push the side-bezel menu options. These include whether to turn statistics on or off and how many samples to use for mean and standard deviation calculations. Reset Statistics Snapshot To see all the single-sourced measurements at one moment in time: 1. Push Measure. 140 DPO4000 Series User Manual Analyze Waveform Data 2. Push Select Measurement. Select measurement Remove Measurement Gating Off Statistics Off High-Low Setup Reference Levels Indicators Off 3. Push Snapshot All Measurements. Snapshot All Measurements 4. View results. Snapshot on 1 Period: 588.0 ns Freq: 1.701 MHz +Width: 529.7 ns -Width: 58.33 ns BrstW: 39.91 μs Rise: 2.014 μs Fall: 1.522 μs ... ... ... ... DPO4000 Series User Manual 141 Analyze Waveform Data Reference Levels Reference levels determine how time-related measurements are taken. For example, they are used in calculating rise and fall times. 1. Push Measure. 2. Push Reference Levels. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 142 DPO4000 Series User Manual Analyze Waveform Data 3. Set the levels from the side-bezel menu. Reference Levels Set Levels in % units Use High and Low reference to calculate rise and fall times. High Ref a 90.0 % Use Mid reference primarily for measurements between edges such as pulse widths. Mid Ref a 50.0 % b 50.0 % Low Ref a 10.0 % - more - 1 of 2 DPO4000 Series User Manual 143 Analyze Waveform Data Taking Manual Measurements with Cursors Cursors are on-screen markers that you position in the waveform display to take manual measurements on acquired data. They appear as horizontal and/or as vertical lines. To use cursors: 1. Push Cursors. This changes the cursor state. The three states are: No cursors appear on the screen, Two vertical waveform cursors appear. They are attached to the selected waveform Four screen cursors appear. Two are vertical and two are horizontal. They are no longer specifically attached to a waveform For example, the first time you push Cursors the state might be off. 144 DPO4000 Series User Manual Analyze Waveform Data 2. Push Cursors again. In the example, two vertical cursors appear on the selected screen waveform. As you turn multipurpose knob a, you move one cursor to the right or left. As you turn knob b, you move the other cursor. If you change the selected waveform by pushing the front-panel 1, 2, 3, 4, M or R button, both cursors jump to the new selected waveform. 3. Push Select. This turns the cursor linking on and off. If linking is on, turning multipurpose knob a moves the two cursors together. Turning multipurpose knob b adjusts the time between the cursors. DPO4000 Series User Manual 145 Analyze Waveform Data 4. Push Fine to toggle between a coarse or a fine adjustment for multipurpose knobs a and b. Pushing Fine also changes the sensitivity of other knobs as well. 5. Push Cursors again. This will put the cursors into screen mode. Two horizontal bars and two vertical bars span the graticule. 6. Turn multipurpose knobs a and b to move the pair of horizontal cursors. 146 DPO4000 Series User Manual Analyze Waveform Data 7. Push Select. This makes the vertical cursors active and the horizontal ones inactive. Now, as you turn the multipurpose knobs, the vertical cursors will move. Push Select again to make the horizontal cursors active again. 8. View the cursor and the cursor readout. DPO4000 Series User Manual 147 Analyze Waveform Data 9. Push Cursors again. This will turn off the cursor mode. The screen will no longer display the cursors and the cursor readout. 148 DPO4000 Series User Manual Analyze Waveform Data Using cursor readouts Cursor readouts supply textual and numeric information relating to the current cursor positions. Readouts appear in the upper right corner of the graticule. If Zoom is on, the readout appears in the upper right corner of the zoom window. The oscilloscope always shows the readouts when the cursors are turned on. When a bus is the currently selected waveform, the readout is the decoded bus data in whatever format you have selected (hexadecimal or binary). Δ Readout: The Δ readouts indicate the difference between the cursor positions. a Readout: Indicates the value is controlled by multipurpose knob a. b Readout: Indicates the value is controlled by multipurpose knob b. The horizontal cursor lines on the display measure the vertical parameters, typically voltage. DPO4000 Series User Manual 149 Analyze Waveform Data The vertical cursor lines on the display measure horizontal parameters, typically time. Using Math Waveforms Create math waveforms to support the analysis of your channel and reference waveforms. By combining and transforming source waveforms and other data into math waveforms, you can derive the data view that your application requires. Use the following procedure for executing simple (+, –, *, ÷) math operations on two waveforms: 1. Push Math. 150 DPO4000 Series User Manual Analyze Waveform Data 2. Push Dual Wfm Math. Dual Wfm Math FFT Advanced Math 3. On the side-bezel menu, set the sources to either channel 1, 2, 3, 4, or reference waveforms R1, 2, 3, or 4. Choose the +, –, x, or ÷ operators. 4. For example, you might calculate power by multiplying a voltage waveform and a current waveform. DPO4000 Series User Manual 151 Analyze Waveform Data Quick Tips Math waveforms can be created from channel or reference waveforms or a combination of them. Measurements can be taken on math waveforms in the same way as on channel waveforms. Math waveforms derive their horizontal scale and position from the sources in their math expressions. Adjusting these controls for the source waveforms also adjusts the math waveform. You can zoom in on math waveforms using the inner knob of the Pan-Zoom control. Use the outer knob for positioning the zoomed area. (See page 163, Managing Long Record Length Waveforms.) 152 DPO4000 Series User Manual Analyze Waveform Data Using FFT An FFT breaks down signals into component frequencies, which the oscilloscope uses to display a graph of the frequency domain of a signal, as opposed to the oscilloscope’s standard time domain graph. You can match these frequencies with known system frequencies, such as system clocks, oscillators, or power supplies. 1. Push Math. 2. Push FFT. Dual Wfm Math FFT Advanced Math DPO4000 Series User Manual 153 Analyze Waveform Data 3. Push the side-bezel menu FFT Source button repeatedly to select the source to use. Choices are: channels 1, 2, 3, 4, reference waveforms 1, 2, 3, and 4. Math Definition FFT Source 1 4. Push the side-bezel Vertical Scale button repeatedly to select either Linear RMS or dBV RMS. Vertical Scale Linear RMS 5. Push the side-bezel Window button repeatedly to select the desired window. Window choices are: Rectangular, Hamming, Hanning, and Blackman-Harris. Window Hanning 6. Push the side-bezel Horizontal button to activate multipurpose knobs a and b to pan and zoom the FFT display. Horizontal 0.00 Hz 40.0 154 DPO4000 Series User Manual Analyze Waveform Data 7. The FFT will appear on the display. Quick Tips Use short record lengths for faster instrument response. Use long record lengths to lower the noise relative to the signal and increase the frequency resolution. DPO4000 Series User Manual 155 Analyze Waveform Data If desired, use the zoom feature along with the horizontal Position and Scale controls to magnify and position the FFT waveform. Use the default dBV RMS scale to see a detailed view of multiple frequencies, even if they have very different amplitudes. Use the linear RMS scale to see an overall view of how all frequencies compare to each other. The FFT feature provides four windows. Each is a trade-off between frequency resolution and magnitude accuracy. What you want to measure and your source signal characteristics help determine which window to use. Use the following guidelines to select the best window. Description Window Rectangular This is the best type of window for resolving frequencies that are very close to the same value but worst for accurately measuring the amplitude of those frequencies. It is the best type for measuring the frequency spectrum of nonrepetitive signals and measuring frequency components near DC. Use Rectangular for measuring transients or bursts where the signal level before and after the event are nearly equal. Also, use this window for equal-amplitude sine waves with frequencies that are very close and for broadband random noise with a relatively slow varying spectrum. Hamming This is a very good window for resolving frequencies that are very close to the same value with somewhat improved amplitude accuracy over the rectangular window. It has a slightly better frequency resolution than the Hanning. Use Hamming for measuring sine, periodic, and narrow band random noise. This window works on transients or bursts where the signal levels before and after the event are significantly different. 156 DPO4000 Series User Manual Analyze Waveform Data Description Window Hanning This is a very good window for measuring amplitude accuracy but less so for resolving frequencies. Use Hanning for measuring sine, periodic, and narrow band random noise. This window works on transients or bursts where the signal levels before and after the event are significantly different. Blackman-Harris: This is the best window for measuring the amplitude of frequencies but worst at resolving frequencies. Use Blackman-Harris for measuring predominantly single frequency waveforms to look for higher order harmonics. Using Advanced Math The advanced math feature lets you create a custom math waveform expression that can incorporate active and reference waveforms, measurements, and/or numeric constants. To use this feature: 1. Push Math. DPO4000 Series User Manual 157 Analyze Waveform Data 2. Push Advanced Math. Dual Wfm Math FFT Advanced Math 3. Use the side-bezel menu buttons to create custom expressions. 4. Push Edit Expression and use the multipurpose knobs and the resulting lower-bezel buttons to create an expression. When done, push the side-bezel menu OK Accept button. 158 DPO4000 Series User Manual Analyze Waveform Data For example, to use Edit Expression to take the integral of a square wave: 1. Push the lower-bezel Clear button 2. Turn multipurpose knob a to select INTG( 3. Push Enter Selection 4. Turn multipurpose knob a to select channel 1 5. Push Enter Selection 6. Turn multipurpose knob a to select ) 7. Push OK Accept. DPO4000 Series User Manual 159 Analyze Waveform Data Using Reference Waveforms Create a reference waveform to store a waveform. For example, you might do this to set up a standard against which to compare other waveforms. To use the reference waveforms: 1. Push Ref R. This brings up the lower-bezel reference menu. 2. Use the resulting lower-bezel menu selections to display or select a reference waveform. R 1 (On) 25–Oct- 2006 R 2 (Off) R 3 (Off) R 4 (Off) 160 DPO4000 Series User Manual Analyze Waveform Data 3. Use the side-bezel menu and the multipurpose knobs to adjust the vertical and horizontal settings of the reference waveform. R1 Vertical a 0.00 div b 100 mV/div Horizontal 0.00 s 4.00 μs/div Quick Tips Selecting and Displaying Reference Waveforms. You can display all the reference waveforms at the same time. Push the appropriate screen button to select a particular reference waveform. The selected waveform appears brighter than other displayed reference waveforms. Removing Reference Waveforms from the Display. To remove a reference waveform from the display, push the front-panel R button to access the lower-bezel menu. Then push the associated button from the lower-bezel menu to turn it off. Scaling and Positioning a Reference Waveform. You can position and scale a reference waveform independently from all other displayed waveforms. Select the reference waveform and then adjust it with a multipurpose knob. You can do this whether acquisition is running or not. DPO4000 Series User Manual 161 Analyze Waveform Data If a reference waveform is selected, scaling and repositioning of the reference waveform operates the same way whether zoom is turned on or off. Saving 10M Reference Waveforms. 10M reference waveforms are volatile and not saved when the oscilloscope power is turned off. To keep these waveforms, save them to external storage. Recalling Reference Waveforms from External Storage. 162 DPO4000 Series User Manual Analyze Waveform Data Managing Long Record Length Waveforms The DPO4000 Series Wave Inspector controls (zoom/pan, play/pause, marks, search) help you to efficiently work with long record length waveforms. To magnify a waveform horizontally, rotate the Zoom knob. To scroll through a zoomed waveform, rotate the Pan knob. The Pan-Zoom Control consists of: 1. An outer pan knob 2. An inner zoom knob DPO4000 Series User Manual 163 Analyze Waveform Data Zooming a Waveform To use zoom: 1. Rotate the inner knob on the Pan-Zoom control clockwise to zoom in on a selected portion of the waveform. Rotate the knob counterclockwise to zoom back out. 2. Alternatively, enable or disable the zoom mode by pushing the zoom button. 164 DPO4000 Series User Manual Analyze Waveform Data 3. Examine the zoomed view of the waveform that appears on the larger, lower portion of the display. The upper portion of the display will show the position and size of the zoomed portion in the waveform, within the context of the overall record. DPO4000 Series User Manual 165 Analyze Waveform Data Panning a Waveform While the zoom feature is on, you can use the pan feature to quickly scroll through the waveform. To use pan: 1. Rotate the pan (outer) knob of the pan-zoom controls to pan the waveform. Turn the knob clockwise to pan forward. Turn it counterclockwise to pan backwards. The further you turn the knob, the faster the zoom window pans. 166 DPO4000 Series User Manual Analyze Waveform Data Playing and Pausing a Waveform Use the play-pause feature to automatically pan through a waveform record. To use it: 1. Enable the play-pause mode by pushing the play-pause button. 2. Adjust the play speed by turning the pan (outer) knob further. The further you turn it, the faster it goes. DPO4000 Series User Manual 167 Analyze Waveform Data 3. Change the play direction by reversing the direction that you are turning the pan knob. 4. During play, up to a point, the more you turn the ring, the faster the waveform accelerates. If you rotate the ring as far as it can go, the play speed does not change, but the zoom box quickly moves in that direction. Use this maximum rotation feature to replay a portion of the waveform that you just saw and want to see again. 5. Pause the play-pause feature by pushing the play-pause button again. 168 DPO4000 Series User Manual Analyze Waveform Data Searching and Marking Waveforms You can mark locations of interest in the acquired waveform. These marks help you limit your analysis to particular regions of the waveform. You can mark areas of the waveform automatically, if they meet some special criteria, or you can manually mark each item of interest. You can use arrow keys to jump from mark to mark (area of interest to area of interest). You can automatically search and mark many of the same parameters that you can trigger on. Search marks provide a way to mark a waveform region for reference. You can set marks automatically with search criteria. You can search for and mark regions with particular edges, pulse widths, runts, logic states, rise/fall times, setup and hold, and bus search types. To manually set and clear (delete) marks: 1. Move (the zoom box) to the area on the waveform where you want to set (or clear) a search mark by turning the pan (outer) knob. Push the next ( →) or previous (←) arrow button to jump to an existing mark. 2. Push Set/Clear. If no search mark is at the screen center, the oscilloscope will add one. DPO4000 Series User Manual 169 Analyze Waveform Data 3. Now investigate your waveform by moving from search mark to search mark. Use the next ( →) or previous (←) arrow button to jump from one marked location to another, without adjusting any other controls. 4. Delete a mark. Push the next ( →) or previous (←) arrow button to jump to the mark you want to clear. To remove the current, center-positioned mark, just push Set/Clear. It works on both manually and automatically created marks. To automatically set and clear (delete) search marks: 1. Push Search. 170 DPO4000 Series User Manual Analyze Waveform Data 2. Select the search type desired from the lower-bezel menu. Search Off Search Type Edge Source 1 Slope Threshold 0.00V The search menu is similar to the trigger menu. 3. From the side-bezel menu, turn on the search. 4. On the screen, hollow triangles show the location of automatic marks and solid triangles show the custom (user-defined) locations. These appear on both normal and zoomed waveform views. DPO4000 Series User Manual 171 Analyze Waveform Data 5. Again, you can quickly investigate your waveform by moving from search mark to search mark with the next ( →) and previous (←) arrow buttons. No other adjustments are needed. Quick Tips. You can copy trigger settings to search for other locations in your acquired waveform that meet the trigger conditions. You can also copy search settings to your trigger. Custom (User) marks are saved with the waveform when the waveform is saved and when the setup is saved. Automatic search marks are not saved with the waveform when the waveform is saved. However, you can easily recapture them by re-using the search function. The search criteria are saved in the saved setup. With the optional DPO4EMBD and DPO4AUTO application modules installed, you can use the front-panel B1 and B2 buttons to define a combination of inputs to be either I2C, SPI, or CAN serial bus. Once set up, you can trigger on user-specified packet level content and have the DPO4000 automatically decode every packet in the acquisition into either binary or hex. The Wave Inspector includes the following search capabilities: Search Description Edge Searches for edges (rising or falling) with a user-specified threshold level. Pulse Width Searches for positive or negative pulse widths that are >, <, =, or ≠ a user specified pulse width. 172 DPO4000 Series User Manual Analyze Waveform Data Search Description Runt Searches for positive or negative pulses that cross one amplitude threshold but fail to cross a second threshold before crossing the first again. Search for all runt pulses or only those with a duration >, <, =, or ≠ a user specified time. Logic Search for a logic pattern (AND, OR, NAND, or NOR) across multiple waveforms with each input set to either High, Low, or Don’t Care. Search for when the event goes true, goes false, or stays valid for >, <, =, or ≠ a user specified time. Additionally, you can define one of the inputs as a clock for synchronous (state) searches. Setup & Hold Search for violations of user specified Setup and Hold times. Rise/Fall Time Search for rising and/or falling edges that are >, <, =, or ≠ a user specified time. Bus I2C: Search for Start, Repeated Start, Stop, Missing Ack, Address, Data, or Address and Data. SPI: Search for SS Active, MOSI, MISO, or MOSI & MISO CAN: Search for Start of Frame, Type of Frame (Data, Remote, Error, Overload), Identifier (standard or extended), Data, Identifier and Data, End of Frame, or Missing Ack. DPO4000 Series User Manual 173 Save and Recall Information Save and Recall Information The DPO4000 Series oscilloscope provides permanent storage for setups, waveforms, and screen images. Use the internal storage of the oscilloscope to save setups and reference waveform data. Use external storage, such as CompactFlash media and USB flash-memory storage devices to save setups, waveforms, and screen images. Use the external storage to carry data to remote computers for further analysis and for archiving. Saving a Screen Image A screen image consists of a graphical image of the oscilloscope screen. This is different from waveform data, which consists of numeric values for each point in the waveform. To save a screen image: 1. Push Save / Recall Menu. Do not yet push the Save button. 2. Push Save Screen Image from the lower-bezel menu. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 174 DPO4000 Series User Manual Save and Recall Information Save Screen Image 3. From the side-bezel menu, push File Format repeatedly to select among: .tif, .bmp, and .png formats. File Format .png 4. Push Orientation to select between saving the image in a landscape (horizontal) and a portrait (vertical) orientation. Orientation 5. Push Ink Saver to turn the Ink Saver mode on or off. When on, this mode provides a white background. Ink Saver On Off 6. Push Edit File Name to create a custom name for the screen image file. Skip this step to use a default name. Edit File Name 7. Push OK Save Screen Image to write the image to the selected media. OK Save Screen Image DPO4000 Series User Manual 175 Save and Recall Information For information on printing screen images of waveforms, go to Printing a Hardcopy. (See page 189, Printing a Hard Copy.) Saving and Recalling Waveform Data Waveform data consists of the numeric values for each point in the waveform. It copies the data, as opposed to a graphical image of the screen. To save the current waveform data or to recall previously stored waveform data: 1. Push Save / Recall Menu. 2. Push Save Waveform or Recall Waveform from the lower-bezel menu. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Waveform File Utilities 176 DPO4000 Series User Manual Save and Recall Information 3. From the resulting side-bezel menu, select the location to save the waveform data to or to recall it from. Save the information externally to a file on a CompactFlash card or USB memory stick. Alternatively, save the information internally to one of the four reference memories in the oscilloscope. 4. Push To File to save to a CompactFlash card or USB memory stick. To File This brings up the file manager screen. Use it to define a custom file name. Skip this step to use the default name and location. Editing File, Directory, Reference Waveform, or Instrument Setup Names. Give files descriptive names that you can recognize at a later date. To edit file names, directory names, reference waveform and instrument setup labels: 1. Push Save / Recall Menu. DPO4000 Series User Manual 177 Save and Recall Information 2. Push Save Screen Image, Save Waveform, or Save Setup. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 3. Enter the file manager by pushing the side-bezel menu To File item. To File 4. Turn multipurpose knob a to scroll through the file structure. D: is the CompactFlash drive. E: is the USB drive plugged into the USB port on the front of the oscilloscope. F: and G: are the USB drives plugged into the USB host ports on the rear of the oscilloscope. 178 DPO4000 Series User Manual Save and Recall Information 5. Push Select to open or close file folders. 6. Push the Menu Off button to cancel the save operation, or push a side-bezel menu OK Save. item to complete the operation. OK Save DPO4000 Series User Manual 179 Save and Recall Information Naming Your File. The oscilloscope gives all files it creates the default name tekxxxxx where xxxxx is an integer from 00000 to 99999. For example, the first time you save a file, that file is named tek00000. The next file is named tek00001. To define a file name of your own choosing: 1. Push Save / Recall Menu. 2. Push Save Screen Image, Save Waveform, or Save Setup. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Map Save Button File Utilities 3. Enter the file manager by pushing the side-bezel menu To File item. To File 180 DPO4000 Series User Manual Save and Recall Information 4. Push the front-panel Select or the lower-bezel menu Enter Character to select a character. 5. Push the Menu Off button to cancel the file naming operation or push a side-bezel menu Save to Selected File item to complete the operation. Save to Selected File DPO4000 Series User Manual 181 Save and Recall Information Saving a Waveform to File. When you push the To File side-bezel menu button, the oscilloscope changes the side- menu contents. The following table describes these side-bezel menu items for saving data to a mass storage file. Side-bezel menu button Description Internal File Format (.ISF) Sets the oscilloscope to save waveform data in internal waveform save file (.isf) format. This format is the fastest to write and creates the smallest-sized file. Use this format if you intend to recall a waveform to reference memory for viewing or measuring. Spreadsheet File Format (.CSV) Sets the oscilloscope to save waveform data as a comma-separated data file compatible with popular spreadsheet programs. This file cannot be recalled to reference memory. Saving a Waveform to Reference Memory. To save a waveform to nonvolatile memory inside the oscilloscope, first select the waveform that you want to save. Push the Save Waveform screen button. Then select one of the reference waveform locations. Four-channel models have four reference locations. Two-channel models have two reference locations. Saved waveforms contain only the most current acquisition. Gray-scale information, if any, is not saved. Displaying a Reference Waveform. To display a waveform stored in nonvolatile memory: 1. Push Ref R. 182 DPO4000 Series User Manual Save and Recall Information 2. Push R1, R2, R3, or R4. R 1 (On) R 2 (Off) R 3 (Off) R 4 (Off) Removing a Reference Waveform from the Display. To remove a reference waveform from the display: 1. Push Ref R. 2. Push the R1, R2, R3, or R4 screen button to select a reference waveform. R 1 (On) R 2 (Off) R 3 (Off) R 4 (Off) 3. Push the front-panel Ref or the appropriate lower-bezel R button again to remove the reference waveform from the display. The reference waveform is still in nonvolatile memory and can be displayed again. DPO4000 Series User Manual 183 Save and Recall Information Saving and Recalling Setups Setup information includes acquisition information, such as vertical, horizontal, trigger, cursor, and measurement information. It does not include communications information, such as GPIB addresses. To save the setup information: 1. Push Save / Recall Menu. 2. Push Save Setup or Recall Setup from the lower-bezel menu. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 184 DPO4000 Series User Manual Save and Recall Information Save Setup To File To Setup 1 3. From the resulting side-bezel menu, select the location to save the setup to or to recall it from. To save setup information to one of the ten internal setup memories in the oscilloscope, push the appropriate side-bezel button. To save setup information to a CompactFlash or USB file, push the To File button. To Setup 2 To Setup 3 – more – DPO4000 Series User Manual 185 Save and Recall Information 4. If you are saving information to a CompactFlash or USB memory device, turn multipurpose knob a to scroll through the file structure. D: is the CompactFlash drive. E: is the USB drive plugged into the USB port on the front of the oscilloscope. F: and G: are the USB drives plugged into the USB ports on the rear of the oscilloscope. Push Select to open or close file folders. Push the Menu Off button to cancel the save operation, or push a side-bezel menu Save to Selected File item to complete the operation. 186 DPO4000 Series User Manual Save and Recall Information Save 1 to Selected File Quick Tips Recalling the Default Setup. Push the front-panel Default Setup button to initialize the oscilloscope to a known setup. (See page 73, Using the Default Setup.) Saving with One Button Push After you have defined the save/recall parameters with the Save/Recall Menu button and menu, you can make saves to files with a single push of the Save button. For example, if you have defined the save operation to save waveform data to a USB drive, then each push of the Save button will save current waveform data to the defined USB drive. 1. To define the Save button behavior, push Save/Recall Menu. DPO4000 Series User Manual 187 Save and Recall Information 2. Push Assign Save button. Save Screen Image Save Waveform Save Setup Recall Waveform Recall Setup Assign Save to Setup File Utilities 3. Push the action to assign to the Save button. Assign Save to Screen Image Waveform Setup 4. From now on, when you push Save the button will perform the action that you just specified rather than having to navigate menus each time. 188 DPO4000 Series User Manual Save and Recall Information Printing a Hard Copy To print an image of what appears on the oscilloscope screen, do the following procedure. Connect a Printer to Your Oscilloscope Connect your printer to a USB port on the rear or front panel of the oscilloscope. Alternatively, you can print to networked printers through the Ethernet port. Set Up Print Parameters To set up the oscilloscope to print hard copies: 1. Push Utility. 2. Push System as many times as needed to select Print Setup from the resulting pop-up menu. Print Setup DPO4000 Series User Manual 189 Save and Recall Information System Print Setup Select Printer N/A Orientation Landscape Ink Saver On 3. Push Select Printer if you are changing the default printer. Turn multipurpose knob a to scroll through the list of available printers. Push Select to choose the desired printer. To add a USB printer to the list, plug the printer into the USB slot. The oscilloscope will automatically recognize it. To add an Ethernet printer to the list, use the instructions in the section titled Printing Over Ethernet. 190 DPO4000 Series User Manual Save and Recall Information 4. Select the image orientation (portrait or landscape). Landscape Portrait 5. Choose Ink Saver On or Off. The On selection will print out a copy with a clear (white) background. Ink Saver on Ink Saver off DPO4000 Series User Manual 191 Save and Recall Information Printing Over Ethernet To set up the oscilloscope to print over Ethernet: 1. Connect an Ethernet cable to the rear-panel Ethernet port. 2. Push Utility. 192 DPO4000 Series User Manual Save and Recall Information 3. Push System repeatedly until you select Print Setup. Print Setup 4. Push Select Printer. System Print Setup Select Printer (N/A) Orientation Landscape Ink Saver Off Select Printer 5. Push Add Network Printer. Add Network Printer Rename Printer DPO4000 Series User Manual 193 Save and Recall Information 6. Turn multipurpose knob a to scroll through the list of letters, numbers, and other characters to find the first character in the printer name that you want to enter. ABCDEFGHIJKLMNOPQRSTUVWXYZ abcdefghijklmnopqrstuvwxyz 0123456789_=+-!@#$%^&*()[]{}<>/~’”\|:,.? 7. Push Select or Enter Character to let the oscilloscope know that you have picked the proper character to use. You can use the lower-bezel buttons to edit the name, as needed. Enter Character Back Space Delete Clear 8. Continue scrolling and pushing Select until you have entered all the desired characters. 194 DPO4000 Series User Manual Save and Recall Information 9. Push the down arrow key to move the character cursor down a row to the Server Name field. 10. Turn multipurpose knob a and push Select or Enter Character as often as needed to enter the name. 11. If desired, push the down arrow key to move the character cursor down a row to the Server IP Address: field. 12. Turn multipurpose knob a and push Select or Enter Character as often as needed to enter the name. Add Printer 13. When done, push OK Accept. OK Accept DPO4000 Series User Manual 195 Save and Recall Information NOTE. If you have multiple printers connected to the oscilloscope at the same time, the oscilloscope will print to the printer listed in the Utility > System > Print Setup > Select Printer menu item. Print to a Printer Once you have connected a printer to your oscilloscope and set up print parameters, you can print current screen images with a single push of a button: 1. Push the printer icon button in the lower left corner of the front panel. Erasing DPO4000 Memory You can erase all setup and waveform information saved in the nonvolatile memory with the TekSecure function. If you have acquired confidential data on your oscilloscope, you may want to execute the TekSecure function before you return the oscilloscope to general use. The TekSecure function: Replaces all waveforms in all reference memories with null values 196 DPO4000 Series User Manual Save and Recall Information Replaces the current front-panel setup and all stored setups with the default setup Displays a confirmation or warning message, depending on whether the verification is successful or unsuccessful To use TekSecure: 1. Push Utility. 2. Push System repeatedly until you select Config. Config 3. Push TekSecure. System Config Language English Set Date & Time TekSecure Erase Memory Version v1.00 DPO4000 Series User Manual 197 Save and Recall Information 4. Push OK Erase Setup and Ref Memory from the side-bezel menu. OK Erase Setup and Ref Memory To abort the procedure, push Menu Off. 198 DPO4000 Series User Manual Save and Recall Information 5. Power off the oscilloscope, and then power it back on to complete the process. DPO4000 Series User Manual 199 Use Application Modules Use Application Modules Optional application module packages extend the capability of your oscilloscope. Install up to four application modules at one time. Application modules go into the two slots with windows in the upper right corner of the front panel. Two additional slots are directly behind the two that you can see. Refer to the DPO4000 Series Application Module Installation Instructions that came with your application module for instructions on installing and testing an application module. Some modules are described below. Additional packages may be available. Contact your Tektronix representative or visit our Web site at www.tektronix.com for more information. Also, refer to Contacting Tektronix at the beginning of the manual. The DPO4EMBD Serial Triggering and Analysis Module adds triggering on packet level information in serial buses used in embedded designs (I2C and SPI), as well as analytical tools to help you efficiently analyze your serial bus. These include digital views of the signal, bus views, packet decoding, search tools, and event tables with timestamp information. The DPO4AUTO Serial Triggering and Analysis Module adds triggering on packet level information in serial buses used in automotive designs (CAN), as well as analytical tools to help you efficiently analyze your serial bus. These include digital views of the signal, bus views, packet decoding, search tools, and event tables with timestamp information. 200 DPO4000 Series User Manual Application Examples Application Examples This section contains ways to use your instrument in both common and advanced troubleshooting tasks. Taking Simple Measurements If you need to see a signal in a circuit, but you do not know the signal amplitude or frequency, connect the probe from channel 1 of the oscilloscope to the signal. Then display the signal and measure its frequency and peak-to-peak amplitude. DPO4000 Series User Manual 201 Application Examples Using Autoset To quickly display a signal: 1. Push Autoset. 202 DPO4000 Series User Manual Application Examples The oscilloscope sets vertical, horizontal, and trigger controls automatically. You can manually adjust any of these controls if you need to optimize the display of the waveform. When you are using more than one channel, the autoset function sets the vertical controls for each channel and uses the lowest-numbered active channel to set the horizontal and trigger controls. Selecting Automatic Measurements The oscilloscope can take automatic measurements of most displayed signals. To measure signal frequency and peak-to-peak amplitude: 1. Push Measure. 2. Push Select Measurement. Select Measurement a 1 Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 203 Application Examples 3. Turn multipurpose knob a to select the channel from which you want to measure. For example, select channel 1. This step is only needed if you are acquiring data on more than one channel. 4. Select the Frequency measurement from the side-bezel menu. Frequency 5. Push -more- until you can select the Pk-Pk measurement. -more- 6. Push Menu Off. 204 DPO4000 Series User Manual Application Examples 7. Observe that the measurements appear on the screen and update as the signal changes. DPO4000 Series User Manual 205 Application Examples Measuring Two Signals In this example, you are testing a piece of equipment and need to measure the gain of its audio amplifier. You have an audio generator that can inject a test signal at the amplifier input. Connect two oscilloscope channels to the amplifier input and output as shown. Measure both signal levels and use these measurements to calculate the gain. 206 DPO4000 Series User Manual Application Examples To display the signals connected to channels 1 and 2: 1. Push channel 1 and channel 2 to activate both channels. 2. Push Autoset. To select measurements for the two channels: 1. Push Measure to see the measurement menu. DPO4000 Series User Manual 207 Application Examples 2. Push Select Measurement. Select Measurement a 1 Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 3. Turn multipurpose knob a to select channel 1. 4. Page through the measurement menus until you find Amplitude. Select Amplitude. Amplitude 208 DPO4000 Series User Manual Application Examples 5. Turn multipurpose knob a to select channel 2. 6. Select Amplitude. Amplitude 7. Calculate the amplifier gain using the following equations: Gain = (output amplitude ÷ input amplitude) = (3.155 V ÷ 130.0 mV) = 24.27 Gain (dB) = 20 x log(24.27) = 27.7 dB DPO4000 Series User Manual 209 Application Examples Customizing Your Measurements In this example, you want to verify that the incoming signal to digital equipment meets its specifications. Specifically, the transition time from a low logic level (0.8 V) to a high logic level (2.0 V) must be 10 ns or less. To select the rise time measurement. 1. Push Measure. 210 DPO4000 Series User Manual Application Examples 2. Push Select Measurement. Select Measurement a 1 Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 3. Turn multipurpose knob a to select channel 1. This step is only needed if you are acquiring data on more channels than just channel 1. 4. Select the Rise Time measurement from the side-bezel menu. Rise Time DPO4000 Series User Manual 211 Application Examples 5. Press Reference Levels. Reference Levels 6. Push Set Levels in to select units. Set Levels in % units 7. Push High Ref and turn multipurpose knob a to enter 2.00 V. If needed, push Fine to change the sensitivity of the multipurpose knob. High Ref a 2.00 V Mid Ref 8. Push Low Ref and turn multipurpose knob a to enter 800 mV. If needed, push Fine to change the sensitivity of the multipurpose knob. Low Ref a 800 mV 212 DPO4000 Series User Manual Application Examples Rise time is typically measured between the 10% and 90% amplitude levels of a signal. These are the default reference levels that the oscilloscope uses for rise time measurements, However, in this example, you need to measure the time that the signal takes to pass between the 0.8 V and 2.0 V levels. You can customize the rise time measurement to measure the signal transition time between any two reference levels. You can set each of these reference levels to a specific percent of the signal amplitude or to a specific level in vertical units (such as volts or amperes). Measuring Specific Events. Next you want to see the pulses in the incoming digital signal, but the pulse widths vary so it is hard to establish a stable trigger. To look at a snapshot of the digital signal, do this step: 1. Push Single to capture a single acquisition. Now you want to measure the width of each displayed pulse. You can use measurement gating to select a specific pulse to measure. To measure the second pulse: 1. Push Measure. DPO4000 Series User Manual 213 Application Examples 2. Push Select Measurement. Select measurement a 1 Remove Measurement Gating Statistics Reference Levels Indicators Configure Cursors 3. Turn multipurpose knob a to select channel 1. 4. Select Positive Pulse Width measurement. Positive Pulse Width 214 DPO4000 Series User Manual Application Examples 5. Push Gating. Select Measurement Remove Measurement Gating Off Statistics Off Reference Levels Indicators Configure Cursors 6. Select Between Cursors from the side-bezel menu to choose measurement gating using cursors. Between Cursors 7. Place one cursor to the left and one cursor to the right of the second pulse. DPO4000 Series User Manual 215 Application Examples 8. View the resulting width measurement (160 ms) for the second pulse. 216 DPO4000 Series User Manual Application Examples Analyzing Signal Detail In this example, you have a noisy signal displayed on the oscilloscope, and you need to know more about it. You suspect that the signal contains much more detail than you can currently see in the display. DPO4000 Series User Manual 217 Application Examples Looking at a Noisy Signal The signal appears noisy. You suspect that noise is causing problems in your circuit. To better analyze the noise: 1. Push Acquire. 2. Push Mode on the lower-bezel menu. Mode Record Length 10k Reset Horizontal Position Waveform Display 218 DPO4000 Series User Manual Application Examples 3. Push Peak Detect on the side-bezel menu. Sample Peak Detect Hi Res Envelope Average 4. Push Intensity and turn multipurpose knob a to see the noise more easily. DPO4000 Series User Manual 219 Application Examples 5. View the results on the display. Peak detect emphasizes noise spikes and glitches in your signal as narrow as 1 ns, even when the time base is set to a slow setting. 220 DPO4000 Series User Manual Application Examples Peak-detect and the other acquisition modes are explained earlier in this manual. (See page 75, Acquisition Concepts.) Separating the Signal from Noise Now you want to analyze the signal shape and ignore the noise. To reduce random noise in the oscilloscope display: 1. Push Acquire. 2. Push Mode. Mode Record Length Reset Horizontal Position Waveform Display 3. Push Average on the side-bezel menu. Average DPO4000 Series User Manual 221 Application Examples Averaging reduces random noise and makes it easier to see detail in a signal. In the example to the right, a ring shows on the rising and falling edges of the signal when the noise is removed. 222 DPO4000 Series User Manual Application Examples Taking Cursor Measurements You can use the cursors to take quick measurements on a waveform. To measure the ring frequency at the rising edge of the signal: 1. Push channel 1 to select the channel 1 signal. 2. Push Measure. 3. Push Configure Cursors. Select Measurement Remove Measurement Gating Statistics Reference Levels Indicators Configure Cursors DPO4000 Series User Manual 223 Application Examples 4. Push Vertical Bar Units repeatedly to select Hz (1/s). Vertical Bar Units Hz (1/s) 5. Push Cursors repeatedly until the two vertical bar cursors appear on the selected waveform. 6. Place one cursor on the first peak of the ring using multipurpose knob a. 7. If the cursor readout says that the cursors are linked, push Select to unlink them. 224 DPO4000 Series User Manual Application Examples 8. Place the other cursor on the next peak of the ring using multipurpose knob b. 9. The cursor Δ readout shows the measured ring frequency is 227 kHz. DPO4000 Series User Manual 225 Application Examples Triggering on a Video Signal The DPO4000 Series of oscilloscopes supports triggering on NTSC, SECAM, and PAL signals. In this example, you are testing the video circuit in a piece of medical equipment and need to display the video output signal. The video output is an NTSC standard signal. Use the video signal to obtain a stable display. To trigger on the video fields: 1. Push Trigger Menu. 226 DPO4000 Series User Manual Application Examples 2. Push Type repeatedly to select Video. Video 3. Push Standard repeatedly to select 525/NTSC. Type Video Standard 525/NTSC Source 1 Trigger on All Lines Mode Auto & Holdoff 4. Push Trigger On. 5. Select Odd Fields. Odd Fields If the signal had been noninterlaced, you could choose to trigger on All Fields. 6. Turn the Horizontal Scale knob to see a complete field across the screen. DPO4000 Series User Manual 227 Application Examples 7. View results. Triggering on Lines Triggering on Lines. To look at the video lines in the field: 1. Push Trigger Menu. 228 DPO4000 Series User Manual Application Examples 2. Push Type repeatedly to select Video. Video Type Video Standard 525/NTSC Source 1 Trigger On All Lines Mode Auto & Holdoff 3. Push Trigger On. 4. Select All Lines. All Lines 5. Adjust Horizontal Scale to see a complete video line across the screen. DPO4000 Series User Manual 229 Application Examples 6. Observe the results. Capturing a Single-Shot Signal In this example, the reliability of a reed relay in a piece of equipment has been poor, and you need to investigate the problem. You suspect that the relay contacts arc when the relay opens. The fastest you can open and close the relay is about once per minute, so you need to capture the voltage across the relay as a single-shot acquisition. To set up for a single-shot acquisition: 1. Adjust the Vertical Scale and Horizontal Scale to appropriate ranges for the signal you expect to see. 230 DPO4000 Series User Manual Application Examples 2. Push Acquire. 3. Push Mode. 4. Select Sample. 5. Push Trigger Menu. 6. Push Slope and . 7. Turn the Trigger Level knob to adjust the trigger level to a voltage midway between the open and closed voltages of the replay. DPO4000 Series User Manual 231 Application Examples 8. Push Single (single sequence). When the relay opens, the oscilloscope triggers and captures the event. The Single sequence button disables auto triggering so that only a valid triggered signal is acquired. 232 DPO4000 Series User Manual Application Examples Optimizing the Acquisition The initial acquisition shows the relay contact beginning to open at the trigger point. This is followed by large spikes that indicate contact bounce and inductance in the circuit. The inductance can cause contact arcing and premature relay failure. Before you take the next acquisition, you can adjust the vertical and horizontal controls to give you a preview of how the next acquisition might appear. As you adjust these controls, the current acquisition is repositioned, expanded, or compressed. This preview is useful to optimize the settings before the next single-shot event is captured. When the next acquisition is captured with the new vertical and horizontal settings, you can see more detail about the relay contact opening. You can now see that the contact bounces several times as it opens. DPO4000 Series User Manual 233 Application Examples Using the Horizontal Zoom Function To take a close look at a particular point on the acquired waveform, use the horizontal zoom function. To look closely at the point where the relay contact first begins to open: 1. Turn the Zoom knob. 2. Turn the Pan knob to place the center of the zoom box close to where the relay contact begins to open. 3. Turn the Zoom knob to magnify the waveform in the zoom window. 234 DPO4000 Series User Manual Application Examples The ragged waveform and the inductive load in the circuit suggest that the relay contact may be arcing as it opens. The zoom function works equally well when the acquisition is running or is stopped. Horizontal position and scale changes affect only the display, not the next acquisition. Correlating Data With a TLA5000 Logic Analyzer To troubleshoot designs with fast clock edges and data rates, it helps to view analog characteristics of digital signals in relation to complex digital events in the circuit. You can do that with iView, which lets you transfer analog waveforms from the oscilloscope to the logic analyzer display. You can then view time-correlated analog and digital signals side-by-side and use this to pinpoint sources of glitches and other problems. DPO4000 Series User Manual 235 Application Examples The iView External Oscilloscope Cable allows you to connect your logic analyzer to a Tektronix oscilloscope. This enables communication between the two instruments. The Add External Oscilloscope wizard, which is available from the TLA application System menu, guides you through the process of connecting the iView cable between your logic analyzer and oscilloscope. The TLA also provides a setup window to assist you in verifying, changing, and testing the oscilloscope settings. Before acquiring and displaying a waveform you must establish a connection between your Tektronix logic analyzer and oscilloscope using the Add External Oscilloscope wizard. To do this: 1. Select Add iView External Oscilloscope ... from the logic analyzer System menu. 236 DPO4000 Series User Manual Application Examples 2. Select your model of oscilloscope. 3. Follow the on-screen instructions, and then click Next. 4. See your Tektronix Logic Analyzer documentation for more information on correlating data between a DPO4000 Series Oscilloscope and a Tektronix Logic Analyzer. DPO4000 Series User Manual 237 Application Examples Tracking Down Bus Anomalies In this example, you are testing your new I2C circuit. Something is not working. You tell the master IC to send a message to the slave IC. Then you expect to receive data back and an LED to light. The light never goes on. Where in the ten or so commands that were sent out did the problem occur? Once you locate the problem location, how do you determine what went wrong? You can use your DPO4000 Series oscilloscope, with its serial triggering and long-record length management features, to track down the problem in both the physical layer and in the protocol layer of the bus. Basic strategy First, you will display and acquire the bus signal by setting up the bus parameters and trigger. Then, you will search through each packet with the search/mark functions. NOTE. Triggering on bus signals requires use of the DPO4EMBD or the DPO4AUTO Serial Triggering and Analysis Module. 238 DPO4000 Series User Manual Application Examples 1. Connect the channel 1 probe to the clock line. 2. Connect the channel 2 probe to the data line. 3. Push Autoset. DPO4000 Series User Manual 239 Application Examples 4. Push the B1 button and enter the parameters of your I2C bus in the resulting screen menus. 5. Push Trigger Menu. 6. Push Type to select Bus. Enter trigger parameters in the resulting screen menus. Type Bus Source Bus B1 (I2C) Trigger On Address Address 07F Direction Read Mode Auto & Holdoff 240 DPO4000 Series User Manual Application Examples 7. Analyze the physical layer. For example, you can use the cursors for manual measurements. (See page 144, Taking Manual Measurements with Cursors.) You can also use the automated measurements. (See page 129, Taking Automatic Measurements.) 8. Push Search. Set Search Marks to On. Enter a search type, source, and other parameters as relevant on the lower-bezel menu and associated side-bezel menus. (See page 163, Managing Long Record Length Waveforms.) 9. Jump ahead to the next search point by pushing the right arrow key. Push it again and again until you see all the events. Jump back with the left arrow key. Do you have all the packets that you expected to have? If not, at least you have narrowed your search down to the last packet sent. DPO4000 Series User Manual 241 Application Examples 10. Analyze the decoded packets in the protocol layer. Did you send the data bytes in the correct order? Did you use the correct address? 242 DPO4000 Series User Manual Index Index Symbols and Numbers 50 Ω protection, 128 A Accessories, 1 Acquire button, 49, 80, 112, 218, 221 Acquisition input channels and digitizers, 75 modes defined, 78 readout, 60 sampling, 75 Adapter TEK-USB-488, 4 TPA-BNC, 4, 10 Adding waveform, 112 Advanced math, 157 Altitude DPO4000, 7 P6139A, 8 Analysis and Connectivity, xii Application module DPO4AUTO, 84 DPO4EMBD, 84 Application Module, xiii, 19 Applications modules, 200 Attenuation, 127 Auto trigger mode, 92 Autoset, 74, 202 Autoset button, 17, 49, 56, 71, 74, 202, 207 Autoset undo, 74 Auxiliary readout, 64 Average acquisition mode, 79 BB Trigger, 109 B1 / B2 button, 51, 84, 85, 102 Backlight intensity, 119 Bandwidth, x Before Installation, 1 Blackman-Harris FFT window, 157 BNC interface, 10 Bus button, 84, 85, 102 menu, 51, 85 Bus trigger, defined, 102 Buses, 84, 102 Button Acquire, 49, 80, 112, 218, 221 Autoset, 17, 49, 56, 71, 74, 202, 207 B1 / B2, 51, 84, 85, 102 bus, 84, 85, 102 Channel, 50 Cursors, 52, 144, 224 Default Setup, 50, 58, 73 Fine, 48, 52, 53, 54, 55, 57 Force Trig, 56, 93 hard copy, 57, 196 Intensity, 115 M, 51, 150, 153 Math, 51, 150, 153 Measure, 49, 129, 139, 140, 203, 207, 210, 213 Menu Off, 58, 204 Next, 55 play-pause, 167 Play-pause, 54 Previous, 54 printer icon, 57, 196 Ref, 51, 160, 182 DPO4000 Series User Manual 243 Index Run/Stop, 56, 83, 111 Save / Recall, 50, 58, 174 Search, 49, 170 Select, 53, 224 Set / Clear Mark, 55, 169 Set to 50%, 56, 97 Single, 56, 111, 213, 232 Test, 49 Trigger, 49 Trigger level, 56 Trigger menu, 226 Trigger Menu, 98 Utility, 20, 23, 26, 50, 117, 118, 189 Vertical, 50 Zoom, 54 C Calibration, 25, 27 Calibration certificate, 2 CAN, 51, 84, 102 Channel button, 50 Channel readout, 64 Clearance, DPO4000, 6 Communications, 35, 40 CompactFlash, x, 2, 5, 50, 58, 174 Compensate probe, 17 Compensate signal path, 25 Confidential data, 196 Connectivity, 2, 35, 40 Connector, side-panel, 67 Connectors front-panel, 66 rear-panel, 68 Controls, 45 Coupling, trigger, 94 Cover, front, 2 Cross Hair graticule style, 118 Cursor readout, 62, 149 Cursor, measurements, 144 Cursors, 144 button, 52, 144, 224 linking, 145 Cursors menu, 144 D Date and time, changing, 23 Default setup, 187 Default Setup, 73 button, 50, 58, 73 menu, 50 Undo, 73 Delayed trigger, 107 Depth, DPO4000, 6 Deskew, 127 Display persistence, 112 style, 112 Displaying, reference waveforms, 182 Documentation, xii DPO4AUTO, 84 DPO4EMBD, 84 Drivers, 35, 39 Dual waveform math, 150 Ee *Scope, 40 Edge trigger, defined, 99 Envelope acquisition mode, 79 Erase setup and ref memory, 196 Ethernet, x, 37, 40, 41 port, 68 printing, 192 Event Table, 88, 89 Excel, 34 Expansion point icon, 61 244 DPO4000 Series User Manual Index FF actory calibration, 27 FFT Blackman-Harris, 157 controls, 153 Hamming, 156 Hanning, 157 Rectangular, 156 File format, 175 Internal File Format (ISF), 182 Spreadsheet file format (.CSV), 182 File system, 174, 177, 180 Fine, 53 Fine button, 48, 52, 54, 55, 57 Firmware upgrade, 28 Force Trig button, 56, 93 Frame graticule style, 118 Frequency, Input power DPO4000, 6 Front cover, 2 Front panel, 45 Front-panel connectors, 66 Front-panel overlay, 22 Full graticule style, 118 Functional check, 15 G Gating, 137 GPIB, 36, 38, 68 GPIB address, 38 Graticule Cross Hair, 118 Frame, 118 Full, 118 Grid, 118 intensity, 115 styles, 117 Grid graticule style, 118 Ground, 11 Ground lead, 19 Ground strap, 67 H Hamming FFT window, 156 Hanning FFT window, 157 Hard copy, 57, 189 Height, DPO4000, 6 Hi Res acquisition mode, 79 Holdoff, trigger, 93 Horizontal delay, 94 Horizontal position, 55, 94, 95, 120, 156, 234, 235 and math waveforms, 152 defined, 72 Horizontal position/scale readout, 64 Horizontal scale, 55, 120, 156, 227, 229, 230, 234 and math waveforms, 152 defined, 72 How to erase memory, 196 print a hard copy, 189 recall setups, 184 recall waveforms, 174 save screen images, 174 save setups, 184 save waveforms, 174 Humidity DPO4000, 7 P6139A, 9 I I2C, 51, 84, 102 DPO4000 Series User Manual 245 Index Icon Expansion point, 61 Trigger level, 63 Trigger position, 61 Image orientation, 175, 191 Impedance, 123 Indicator, waveform baseline, 65 Infinite persistence, 115 Ink Saver, 175, 191 Inner knob, 54, 152 Installing, application modules, xiii Intensity button, 115 Internal File Format, 182 K Knob inner, 54, 152 Multipurpose, 24, 48, 53, 54, 80, 86, 177, 224, 225 outer, 54 pan, 54, 166, 169 Trigger level, 97 Vertical position, 57, 72 Vertical scale, 57, 72 zoom, 54, 152, 164 LL abView, 34 Landscape, 175, 191 Language change, 20 overlay, 22 Level, trigger, 96 Logic trigger, defined, 100 Long record length, 238 Long record length management, 163 MM button, 51, 150, 153 Main trigger, 107 Mark, 169 Math Advanced, 157 button, 51, 150, 153 Dual waveform, 150 FFT, 153 menu, 51 waveforms, 150 Measure button, 49, 129, 139, 140, 203, 207, 210, 213 Measurement menu, 49 Measurements automatic, 129 cursor, 144 defined, 131 reference levels, 142 snapshot, 140 statistics, 139 Memory, erasure of, 196 Menu Bus, 51, 85 Cursors, 144 Default Setup, 50 Math, 51 Measurement, 49 Reference, 51, 160, 161 Save / Recall, 50, 58, 174 Trigger, 49, 98, 108, 226 Utility, 20, 23, 50, 57, 117, 189 Vertical, 50, 122 Menu buttons, 49 Menu Off button, 58, 204 Menus, 45 Mode, roll, 83 Multipurpose knob, 48, 53, 54, 80, 86, 177, 224, 225 246 DPO4000 Series User Manual Index N Network printing, 192 Next button, 55 Normal trigger mode, 92 O Offset and position, 128 OpenChoice, 2, 35 Operating specifications, 6 Orientation of the image, 175, 191 Outer knob, 54 Overlay, 22 P Pan, 164, 166 knob, 54, 166, 169 Pause, 166 Peak detect acquisition mode, 79 Performance verification, xii Persistence display, 112 infinite, 115 variable, 115 Play, 166 Play-pause button, 54, 167 Play-pause mode, 167 Pollution Degree DPO4000, 7 P6139A, 9 Portrait, 175, 191 Position Horizontal, 94, 95, 120, 156, 234, 235 Vertical, 121 Position and offset, 128 Posttrigger, 91, 96 Power cord, 3 input, 69 off, 14 removing, 14 supply, 11 switch, 57 Power consumption, DPO4000, 6 Predefined math expressions, 150 Pretrigger, 91, 96 Previous button, 54 Print, 57, 189 Printing a hard copy, 189 Printing, Ethernet, 192 Probe Comp, 16 Probe compensation, 17 Probes BNC, 10 connecting, 10 ground lead, 19 TEK-USB-488 Adapter, 4 TekVPI, 10 TPA-BNC Adapter, 4, 10 Programmer Commands, xii Pulse/Width trigger, defined, 100 R Rackmount, 4 Readout Acquisition, 60 Auxiliary, 64 Channel, 64 Cursor, 62, 149 Horizontal position/scale, 64 Record length/sampling rate, 63 Trigger, 63, 107 Trigger status, 62 Rear-panel connectors, 68 Recalling setups, 184 waveforms, 174 Record length, x DPO4000 Series User Manual 247 Index Record length/sampling rate readout, 63 Rectangular FFT window, 156 Ref button, 51, 160 Ref R, 182 Reference button, 182 Reference levels, 142 Reference menu, 51, 160, 161 Reference waveforms, 160 displaying, 182 removing, 161, 183 saving, 182 saving 10M waveforms, 162 Related documents, xii Removing reference waveforms, 183 Removing reference waveforms, 161 Removing waveform, 112 Rise/Fall trigger, defined, 101 Roll mode, 83 Run/Stop button, 56, 83, 111 Runt trigger, defined, 100 SS afety Summary, v Sample acquisition mode, 78 Sample rates, x Sampling process, defined, 75 Sampling, real-time, 76 Save / Recall menu, 50, 58, 174 Save / Recall Menu button, 50 Save / Recall Save button, 58, 174 Saving reference waveforms, 182 screen images, 174 waveforms, 174 Saving and recalling Information, 174 Saving setups, 184 Scale Horizontal, 55, 120, 156, 227, 229, 230, 234 Vertical, 121, 230 Search, 169 Search / Mark, 238 Search button, 49, 170 Securing DPO4000 memory, 196 Select button, 53, 224 Sequential triggering, 107 Serial, 84, 102, 238 Service information, xiii Set / Clear Mark button, 55, 169 Set to 50% button, 56, 97 Setup default, 58, 187 Default, 73 Setup and Hold trigger, defined, 101 Side panel connector, 67 Signal path compensation, 25 Single button, 56, 111, 213, 232 Single sequence, 83, 111 Slope, trigger, 96 Snapshot, 140 Software drivers, 35, 39 Software, optional, 200 SPC, 25 Specifications, xii operating, 6 power supply, 11 SPI, 51, 84, 102 Spreadsheet file format (.CSV), 182 Start an acquisition, 111 Statistics, 139 Stop an acquisition, 111 Switch, power, 57 T Table, Event, 88, 89 TDSPCS1, 35 248 DPO4000 Series User Manual Index TEK-USB-488 Adapter, 36, 38, 68 TEK-USB–488 Adapter, 4 TekSecure, 196 TekVPI, 10 Temperature DPO4000, 6 P6139A, 8 Termination, 123 Test button, 49 TPA-BNC Adapter, 4, 10 Transit case, 4 Transition trigger, defined, 101 Trigger concepts, 91 coupling, 94 delayed, 107 event, defined, 91 forcing, 92 holdoff, 93 level, 96 modes, 92, 98 posttrigger, 91, 96 pretrigger, 91, 96 readout, 107 sequential, 107 Serial, 84, 102, 238 slope, 96 Trigger level button, 56 Icon, 63 knob, 97 Trigger menu, 49, 98, 108, 226 Trigger menu button, 226 Trigger Menu button, 98 Trigger modes Auto, 92 Normal, 92 Trigger position icon, 61 Trigger readout, 63 Trigger status readout, 62 Trigger types, defined, 99 U Undo Autoset, 74 Default Setup, 73 Upgrading firmware, 28 USB, x, 5, 36, 39, 50, 58, 69, 174, 189 port, 68 USBTMC, 68 User marks, 169 Utility button, 20, 23, 26, 50, 117, 118, 189 Utility menu, 20, 23, 50, 57, 117 V Variable persistence, 115 Versatile Probe Interface, 10 Vertical button, 50 menu, 50, 122 Position, 121 position and autoset, 75 position and offset, 128 Position knob, 57, 72 Scale, 121, 230 Scale knob, 57, 72 Vibration, DPO4000, 7 Video lines, 228 port, 68 Video trigger, defined, 101 View waveform record, 61 Voltage, Input DPO4000, 6 P6139A, 8 DPO4000 Series User Manual 249 Index Voltage, Output, P6139A, 8 W Waveform adding, 112 display style, 112 intensity, 115 pan, 164, 166 pause, 166 play, 166 play-pause, 167 record defined, 77 removing, 112 search and mark, 169 user marks, 169 zoom, 164 Waveform baseline indicator, 65 Waveform record, 77 Waveform record view, 61 Weight DPO4000, 6 Width DPO4000, 6 ZZ oom, 164 button, 54 graticule size, 166 Horizontal, 234 knob, 54, 164 PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor Rev. 03 — 11 December 2009 Product data sheet Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - −100 V IC collector current - - −1 A ICM peak collector current single pulse; tp ≤ 1 ms - - −3 A RCEsat collector-emitter saturation resistance IC = −1 A; IB = −100 mA [1] - 170 320 mΩ PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 2 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values Table 2. Pinning Pin Description Simplified outline Symbol 1 base 2 collector 3 emitter 4 collector 1 2 3 4 sym028 2, 4 3 1 Table 3. Ordering information Type number Package Name Description Version PBSS9110Z SC-73 plastic surface-mounted package with increased heat sink; 4 leads SOT223 Table 4. Marking codes Type number Marking code PBSS9110Z PB9110 Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - −120 V VCEO collector-emitter voltage open base - −100 V VEBO emitter-base voltage open collector - −5 V IC collector current - −1 A ICM peak collector current single pulse; tp ≤ 1 ms - −3 A IB base current - −0.3 A Ptot total power dissipation Tamb ≤ 25 °C [1] - 0.65 W [2] - 1 W [3] - 1.4 W PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 3 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6cm2. Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C (1) FR4 PCB, mounting pad for collector 6cm2 (2) FR4 PCB, mounting pad for collector 1cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tamb (°C) 0 40 80 120 160 001aaa508 0.8 0.4 1.2 1.6 Ptot (W) 0 (1) (2) (3) Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1]- - 192 K/W [2]- - 125 K/W [3]- - 89 K/W Rth(j-sp) thermal resistance from junction to solder point - - 17 K/W PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 4 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values FR4 PCB, mounting pad for collector 1cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aaa819 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10−4 10−2 10−1 10 102 tp (s) 10−3 1 103 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 006aaa820 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10−4 10−2 10−1 10 102 tp (s) 10−3 1 103 duty cycle = 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 1 PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 5 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor FR4 PCB, mounting pad for collector 6cm2 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aaa821 10 1 102 103 Zth(j-a) (K/W) 10−1 10−5 10−4 10−2 10−1 10 102 tp (s) 10−3 1 103 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 6 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 7. Characteristics [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. Table 7. Characteristics Tamb = 25°C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = −80 V; IE = 0 A - - −100 nA VCB = −80 V; IE = 0 A; Tj = 150 °C - - −50 μA ICES collector-emitter cut-off current VCE = −80 V; VBE = 0 V - - −100 nA IEBO emitter-base cut-off current VEB = −4 V; IC = 0 A - - −100 nA hFE DC current gain VCE = −5 V; IC = −1 mA 150 - - VCE = −5 V; IC = −250 mA 150 - - VCE = −5 V; IC = −0.5 A [1] 150 - 450 VCE = −5 V; IC = −1 A [1] 125 - - VCEsat collector-emitter saturation voltage IC = −250 mA; IB = −25 mA - - −120 mV IC = −500 mA; IB = −50 mA [1]- - −180 mV IC = −1 A; IB = −100 mA [1]- - −320 mV RCEsat collector-emitter saturation resistance IC = −1 A; IB = −100 mA [1] - 170 320 mΩ VBEsat base-emitter saturation voltage IC = −1 A; IB = −100 mA [1]- - −1.1 V VBEon base-emitter turn-on voltage VCE = −5 V; IC = −1 A [1]- - −1.0 V td delay time VCC = −10 V; IC = −0.5 A; IBon = −0.025 A; IBoff = 0.025 A - 20 - ns tr rise time - 60 - ns ton turn-on time - 80 - ns ts storage time - 290 - ns tf fall time - 120 - ns toff turn-off time - 410 - ns fT transition frequency VCE = −10 V; IC = −50 mA; f = 100 MHz 100 - - MHz Cc collector capacitance VCB = −10 V; IE = ie = 0 A; f = 1 MHz - - 17 pF PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 7 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor VCE = −10 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C Fig 5. DC current gain as a function of collector current; typical values Fig 6. Collector current as a function of collector-emitter voltage; typical values VCE = −10 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Fig 7. Base-emitter voltage as a function of collector current; typical values Fig 8. Base-emitter saturation voltage as a function of collector current; typical values 001aaa376 200 400 600 hFE 0 IC (mA) −10−1 −1 −10 −102 −103 −104 (1) (2) (3) VCE (V) 0 −1 −2 −3 −4 −5 001aaa384 −0.8 −1.2 −0.4 −1.6 −2 IC (A) 0 IB (mA) = −45 −40.5 −36 −31.5 −27 −22.5 −18 −13.5 −9 −4.5 001aaa377 −0.4 −0.8 −1.2 VBE (V) 0 IC (mA) −10−1 −1 −10 −102 −103 −104 (1) (2) (3) 001aaa381 IC (mA) −10−1 −1 −10 −102 −103 −104 −1 −10 VBEsat (V) −10−1 (1) (2) (3) PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 8 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor IC/IB = 10 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C (1) IC/IB = 50 (2) IC/IB = 20 Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Tamb = 25 °C (1) IC/IB = 50 (2) IC/IB = 20 Fig 11. Collector-emitter saturation resistance as a function of collector current; typical values Fig 12. Collector-emitter saturation resistance as a function of collector current; typical values 001aaa378 IC (mA) −10−1 −1 −10 −102 −103 −104 −10−1 −1 VCEsat (V) −10−2 (1) (2) (3) 001aaa380 IC (mA) −10−1 −1 −10 −102 −103 −104 −10−1 −1 VCEsat (V) −10−2 (1) (2) 001aaa382 IC (mA) −10−1 −1 −10 −102 −103 −104 1 10 102 103 RCEsat (Ω) 10−1 (1) (2) (3) 001aaa383 IC (mA) −10−1 −1 −10 −102 −103 −104 1 10 102 103 RCEsat (Ω) 10−1 (1) (2) PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 9 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 8. Test information Fig 13. BISS transistor switching time definition VCC = −10 V; IC = −0.5 A; IBon = −0.025 A; IBoff = 0.025 A Fig 14. Test circuit for switching times 006aaa266 −IBon (100 %) −IB input pulse (idealized waveform) −IBoff 90 % 10 % −IC (100 %) −IC td ton 90 % 10 % tr output pulse (idealized waveform) tf t ts toff RC R2 R1 DUT mgd624 Vo RB (probe) 450 Ω (probe) 450 Ω oscilloscope oscilloscope VBB VI VCC PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 10 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 14. Fig 15. Package outline SOT223 (SC-73) Dimensions in mm 04-11-10 6.7 6.3 3.1 2.9 1.8 1.5 7.3 6.7 3.7 3.3 1.1 0.7 1 2 3 4 4.6 2.3 0.8 0.6 0.32 0.22 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 1000 4000 PBSS9110Z SOT223 8 mm pitch, 12 mm tape and reel -115 -135 PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 11 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 11. Soldering Fig 16. Reflow soldering footprint SOT223 (SC-73) Fig 17. Wave soldering footprint SOT223 (SC-73) sot223_fr 1.2 (4×) 1.2 (3×) 1.3 (4×) 1.3 (3×) 6.15 7 3.85 3.6 3.5 0.3 3.9 7.65 2.3 2.3 6.1 4 1 2 3 solder lands solder resist occupied area solder paste Dimensions in mm sot223_fw 1.9 6.7 8.9 8.7 1.9 (3×) 1.9 1.1 (2×) 6.2 2.7 2.7 2 4 1 3 solder lands solder resist occupied area preferred transport direction during soldering Dimensions in mm PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 12 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PBSS9110Z_3 20091211 Product data sheet - PBSS9110Z_2 Modifications: • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 16 “Reflow soldering footprint SOT223 (SC-73)”: updated • Figure 17 “Wave soldering footprint SOT223 (SC-73)”: updated PBSS9110Z_2 20060724 Product data sheet - PBSS9110Z_1 PBSS9110Z_1 20040609 Product data sheet - - PBSS9110Z_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 11 December 2009 13 of 14 NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor 13. Legal information 13.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors PBSS9110Z 100 V, 1 A PNP low VCEsat (BISS) transistor © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 December 2009 Document identifier: PBSS9110Z_3 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 43020-1200 Status: Active Overview: Micro-Fit 3.0™ Connectors Description: Micro-Fit 3.0™ Plug Housing, Dual Row, with Panel Mount Ears, 12 Circuits Documents: 3D Model Test Summary TS-43045-001 (PDF) Drawing (PDF) RoHS Certificate of Compliance (PDF) Product Specification PS-43045 (PDF) Product Literature (PDF) Packaging Specification PK-43020-001 (PDF) Agency Certification CSA LR19980 TUV R72081037 UL E29179 General Product Family Crimp Housings Series 43020 Application Power, Wire-to-Wire Comments Glow Wire Equivalent Part Number 43020-1208 Overview Micro-Fit 3.0™ Connectors Product Literature Order No 987650-5984 Product Name Micro-Fit 3.0™ UPC 800754383530 Physical Circuits (maximum) 12 Circuits Detail 12 Color - Resin Black Flammability 94V-0 Gender Male Glow-Wire Compliant No Lock to Mating Part Yes Material - Resin Polyester Net Weight 1.476/g Number of Rows 2 Packaging Type Bag Panel Mount Yes Pitch - Mating Interface 3.00mm Pitch - Termination Interface 3.00mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -40°C to +105°C Electrical Current - Maximum per Contact 5A Material Info Reference - Drawing Numbers Packaging Specification PK-43020-001 Product Specification PS-43045, RPS-43045-003, RPS-43045-004 Sales Drawing SDA-43020-**** Test Summary TS-43045-001 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 43020Series Mates With 43025 Micro-Fit 3.0™ Receptacle Housing Use With Micro-Fit 3.0™ Crimp Terminal, MaleThis document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 07/03/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 87439-0800 Status: Active Overview: Pico-Spox™ Description: 1.50mm Pitch Pico-SPOX™ Wire-to-Board Housing, 8 Circuits, Off-White Housing Documents: 3D Model RoHS Certificate of Compliance (PDF) Drawing (PDF) Product Literature (PDF) Product Specification PS-87437 (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family Crimp Housings Series 87439 Application Signal, Wire-to-Board MolexKits Yes Overview Pico-Spox™ Product Literature Order No USA-235 Product Name Pico-SPOX™ UPC 800754313278 Physical Circuits (maximum) 8 Color - Resin Natural Flammability 94V-0 Gender Female Glow-Wire Compliant No Lock to Mating Part Yes Material - Resin Nylon Net Weight 0.120/g Number of Rows 1 Packaging Type Bag Panel Mount No Pitch - Mating Interface 1.50mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -55°C to +105°C Electrical Current - Maximum per Contact 2.5A Material Info Reference - Drawing Numbers Product Specification PS-87437, RPS-87437, RPS-87437-001, RPS-87437-200 Sales Drawing SD-87439-**00 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 87439Series Mates With Pico-SPOX™ Wire-to-Board Header 87437 , 87438 Use With 87421 Pico-SPOX™ Crimp Terminal This document was generated on 07/03/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 01/08/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 43160-3102 Status: Active Overview: Sabre™ Power Connector Description: 7.50mm Pitch Sabre™ Header, Right Angle, 2 Circuits, Glow Wire Compatible. Recommended PCB Thickness 1.60mm, with Board Lock Documents: 3D Model RoHS Certificate of Compliance (PDF) Drawing (PDF) Product Literature (PDF) Product Specification PSX-44441-9999 (PDF) Agency Certification CSA LR19980 TUV R72130381 UL E29179 General Product Family PCB Headers Series 43160 Application Power, Wire-to-Board Comments "Fully Polarized, high power wire to board and wire to wire connector system

This Molex product is manufactured from material that has the following ratings, tested by independent agencies:. a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 60695-2-13.. b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with the requirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire.

The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s).

If it is determined during the customer’s evaluation of suitability, that higher performance is required, please contact Molex for possible product options." Overview Sabre™ Power Connector Product Literature Order No 987650-5662 Product Name Sabre™ UPC 800754378185 Physical Breakaway No Circuits (Loaded) 2 Circuits (maximum) 2 Color - Resin Black Durability (mating cycles max) 25 First Mate / Last Break No Flammability 94V-0 Glow-Wire Compliant Yes Guide to Mating Part No Keying to Mating Part Yes Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Not Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 43160Series Mates With 44441-2002 Sabre™ Receptacle Housing Lock to Mating Part Yes Material - Metal Brass Material - Plating Mating Tin Material - Plating Termination Tin Material - Resin High Temperature Thermoplastic Net Weight 3.331/g Number of Rows 1 Orientation Right Angle PC Tail Length 3.81mm PCB Locator Yes PCB Retention Yes PCB Thickness - Recommended 1.60mm Packaging Type Tray Pitch - Mating Interface 7.50mm Pitch - Termination Interface 7.50mm Plating min - Mating 0.889μm Plating min - Termination 0.889μm Polarized to Mating Part Yes Polarized to PCB Yes Shrouded Fully Stackable No Surface Mount Compatible (SMC) No Temperature Range - Operating -40°C to +75°C Termination Interface: Style Through Hole Electrical Current - Maximum per Contact 18A Voltage - Maximum 600V Solder Process Data Duration at Max. Process Temperature (seconds) 5 Lead-free Process Capability Wave Capable (TH only) Max. Cycles at Max. Process Temperature 1 Process Temperature max. C 235 Material Info Reference - Drawing Numbers Product Specification PSX-44441-9999 Sales Drawing SDA-43160-**** This document was generated on 01/08/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 39-00-0038 Status: Active Overview: Mini-Fit Jr.™ Power Connectors Description: Mini-Fit® Female Crimp Terminal, Tin (Sn) over Copper (Cu) Plated Brass, 18-24 AWG, Reel Documents: Drawing (PDF) Product Specification PS-52034-003 (PDF) Product Specification PS-51010-005 (PDF) Product Specification PS-52034-004 (PDF) Product Specification PS-51010-006 (PDF) Product Specification PS-5556-001 (PDF) Product Specification PS-51045-001 (PDF) Product Specification PS-5556-002 (PDF) Product Specification PS-51045-002 (PDF) Packaging Specification PK-5556-001 (PDF) Product Specification PS-51045-004 (PDF) Test Summary TS-5556-002 (PDF) Product Specification PS-51096-001 (PDF) RoHS Certificate of Compliance (PDF) General Product Family Crimp Terminals Series 5556 Application Power Crimp Quality Equipment Yes Overview Mini-Fit Jr.™ Power Connectors Packaging Alternative 39-00-0039 (Loose) Product Name Mini-Fit® UPC 800753585010 Physical Durability (mating cycles max) 30 Gender Receptacle Material - Metal Brass Material - Plating Mating Tin Material - Plating Termination Tin Net Weight 0.130/g Packaging Type Reel Plating min - Mating 0.889μm Plating min - Termination 0.889μm Termination Interface: Style Crimp or Compression Wire Insulation Diameter 1.30-3.10mm Wire Size AWG 18, 20, 22, 24 Wire Size mm² N/A Electrical Current - Maximum per Contact 9A Voltage - Maximum 600V Material Info Old Part Number 5556T Reference - Drawing Numbers Packaging Specification PK-5556-001 Product Specification PS-51010-005, PS-51010-006, PS-51045-001, PS-51045-002, PS-51045-004, PS-51096-001, PS-52034-003, PS-52034-004, PS-5556-001, PS-5556-002, RPS-30067-001, RPS-30067-002, RPS-42474-001, RPS-51045-001, RPS-5557-008, RPS-5557-024, RPS-5557-031, RPS-5557-036, RPS-5557-037, RPS-5557-045, RPS-5557-046, RPS-5566-002 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 5556Series Mates With 5558 Mini-Fit® Crimp Male Terminals. Mini- Fit Jr.™ Header, Dual Row, 5566 , 5569 Use With 5557 Mini-Fit Jr.™ Receptacle Housing, 30067 Mini-Fit® TPA, 42474 Mini-Fit® BMI Panel Mount, 5559 Mini-Fit Jr.™ Plug Housing, Dual Row Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # FineAdjust™ Applicator for Insulation OD 0639023900 Sales Drawing SD-5556**** Test Summary TS-5556-002 1.40-1.70mm - 18-24 AWG Extraction Tool 0011030044 Hand Crimp Tool for Male and Female Crimp Terminals, 16-24 AWG Wire 0638190900 FineAdjust™ Applicator for Insulation OD 2.50-2.95mm - 18-24 AWG 0639002600 FineAdjust™ Applicator for Insulation OD 1.65-2.05mm - 18-24 AWG 0639002900 FineAdjust™ Applicator for Insulation OD 1.90-2.30mm - 18-24 AWG 0639015600 FineAdjust™ Applicator for Insulation OD 2.50-2.95mm Optimized for 18 AWG Only 0639024800 FineAdjust™ Applicator for Insulation OD 2.30-2.60mm - 18-24 AWG 0639024900 T2 Terminator™ for insulation OD 2.50-2.95mm - 18-24 AWG 0639102600 T2 Terminator™ for insulation OD 1.65 – 2.05mm – 18 – 24 AWG 0639102900 T2 Terminator™ for insulation OD 1.90-2.30mm - 18-24 AWG 0639115600 T2 Terminator™ for insulation OD 1.40-1.70mm - 18-24 AWG 0639123900 T2 Terminator™ for insulation OD 2.50-2.95mm optimized for 18 AWG only 0639124800 T2 Terminator™ for insulation OD 2.30-2.60mm - 18-24 AWG 0639124900 Japan Description Product # Applicator for M211A Bench Press, 18-24 AWG Wire 0570223000 Side-Feed Applicator For Full-Auto Machine 0570223200 Hand Extraction Tool 0570316000 This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION For more complete information on any product, please visit our web site: www.aimtti.com Measurably better value manual & bus programmable - Laboratory Power Supplies Mixed-mode Regulation Mixed-mode regulation with linear output stage 4 digit voltage and current meters on each output * Constant voltage or constant current operation Variable auxiliary output (1.5-5V@5A) on triple model Switched remote sensing (not EX355P or EX752M) Silent fan-free cooling ** DC output switches        Compact bench power supplies Single, dual or triple outputs Mixed-mode regulation Power from 175W to 420W Switched remote sense terminals RS-232 interface model available       EX-R series Model Outputs Voltage / Current Power Interfaces EX355R One 0 to 35V / 0 to 5A 175W - EX355P One 0 to 35V / 0 to 5A 175W RS232 EX355P-USB One 0 to 35V / 0 to 5A 175W USB EX1810R One 0 to 18V / 0 to 10A 180W - EX2020R One 0 to 20V / 0 to 20A 400W - EX4210R One 0 to 42V / 0 to 10A 420W - EX354RD Two 2 x (0 to 35V / 0 to 4A) 280W - EX354RT Three 2 x (0 to 35V / 0 to 4A) plus 1.5 to 5.0V @ 5A 305W EX752M Two 2 x (0 to 75V / 0 to 2A) or 0 to 75V / 0 to 4A or 0 to 150V / 0 to 2A 300W Brief specifications for main outputs: Line & load regulation: <0.01%. Output noise: < 2mV rms. Meter accuracies: voltage - 0.3% ± 1digit, current - 0.6% ± 1digit. Sizes: singles - 140 x 160 x 295mm; dual/triple - 260 x 160 x 295mm (WxHxD) The EX752M is a dual output 300 watt PSU with Multi-Mode capability. This enables it to operate as a dual power supply with two independent and isolated outputs, or as a single power supply of double the power.  As a dual, each output provides 0 to 75V at 0 to 2A (mode A). As a single, the output can be selected as either 0 to 75V at 0 to 4A (mode B) or 0 to 150V at 0 to 2A (mode C). In single modes, the unused half of the unit becomes completely inoperative and its displays are blanked. For those requiring a basic bus controllable power supply, versions with an RS-232 interface (EL302P) or a USB interface (EL302P-USB) are available.  The EX series is the value-for-money PSU for users who require higher power levels. Mixed-mode regulation gives excellent performance combined with compact size and low weight. Dual output and triple output models are available in a similar casing style. The EX354RT triple (illustrated) has a variable voltage auxiliary output which can be set using the digital displays.  ** Note that the EX2020R and EX4210R use fan assisted cooling. All-linear regulation becomes impractical at higher power levels, so Aim-TTi have developed a technology that combines HF switch-mode pre-regulation with linear final regulation. This technique combines exceptional efficiency with noise levels that are close to that of pure linears. Mixed-mode regulation is used in the EX-R and TSX series. * Note that 3 digit current meters are used on the EX355P and EX752M and that voltmeter resolution on the EX752M is 0.1V. * Note that a 3 digit current meters is used on the EL302P & EL302P-USB, and that these models do not have remote sense terminals. http://www.farnell.com/datasheets/1796748.pdf SS-331 LCD Desoldering Station User’s Manual 1st Edition, ©2014 Copyright by Prokit’s Industries Co., Ltd. 1 Description SS‐331 designed for lead free desoldering especially. The quick heating and strong power are for convenient and clear soldering / desoldering all types of DIP components. Reasonable structure, single hand operation and strong absorbing power can be easy removal of the residual solder from the one‐sided or two sided of the PCB. This tool is used in the fields of electronic research, teaching and production, especially in the repairing and desoldering on the electronic appliances and communication equipments. 1. Control Unit The desoldering iron gun is controlled automatically by the micro‐processor. The digital control electronics and high‐quality sensor and heat exchange system guarantee precise temperature control at the soldering tip. The highest degree of temperature precision and optimal dynamic thermal behavior under load conditions is obtained by the quick and accurate recording of the measured values in a closed control circuit, and this design is especially for the lead‐free production techniques. 2. Desoldering Iron gun Desoldering iron gun with a power of 60W(Heat up rating 130W)and a wide spectrum of soldering tips can be used anywhere in the electronics field. The high power and gun type design make this iron gun suitable for fine desoldering work. The heating element is made of ceramic and the sensor on the desoldering tip can control the desoldering temperature quickly and accurately. 2 Technical Specification Voltage 220~240V AC Power Consumption 140W Temperature 160°C ~ 480°C Vacuum Pressure 600mm Hg Heating Element Ceramic Heater Accessories Spare tip x 3 ( 0.8(on the gun)1.0/  1.3mm) Cleaning tool x 3 (0.7/0.9/ 1.2mm) Filter sponge x 4 (φ20.8x1 +φ16.8x3) Certificate CE, GS, RoHS Station Size (mm) 225 x 160 x 130 Weight (kgs) 2.5 Operating Instruction Caution:Make sure that the four screws which are used to fasten the Diaphragm pump are removed from the control system before use. Otherwise serious damages may be caused to the user and the system. 1. Place the desoldering iron gun in the holder separately. Then connect the plug to the receptacle on the station and turn clockwise to tighten the plug nut. Check that the power supply is corresponding to the specification on the type plate and the power switch is on the “OFF” position. Connect the control unit to the power supply and switch on the power. Then a self‐test is carried out in which all display elements are switched on briefly. The electronic system then switches on automatically to the set temperature and displays this value. 2. The display and temperature setting ①. Shows the actual temperature of the desoldering tip. ②. Shows the setting temperature: Pressing the “UP” or “DOWN” button can switch the digital display to the set point display. The set‐point can be changed for ±1℃ by tapping the “UP” or “DOWN” button. Pressing the button will change the set‐point quickly. The digital display will return automatically to the actual value and the iron will reach to the setting temperature quickly. ③. ℃/℉ display: Switching the temperature display from ℃ to ℉ by pressing the “℃/℉”button and then the electronic system will display the actual temperature① and setting temperature② in ℉, and vice versa. ④. When the actual temperature on the soldering tip is less than the set‐point, “HEAT ON” will display and make the desoldering tip heating up. ⑤. When the absolute offset is more than ±10℃ between the actual temperature and the set‐point on the soldering tip or the nozzle, “WAIT” will display. It means that the temperature electronic control system is not in the stable situation, we should wait a moment to let the “WAIT” disappear. ⑥. When “ERROR” display, there may be a trouble on the 3 4 Safety Instruction 1. The manufacturer assumes no liability for uses other than those described in the operating instructions or for unauthorized alterations. 2. The operating instructions and cautions should be read carefully and kept in an easily visible location in the vicinity of the control system. Non‐observance of the cautions will result in accidents, injury or risks to health. Caution 1. The power cord only can be inserted in approved power sockets or adapters. 2. High Temperature The temperature of the soldering tip will reach as high as around 400℃(752℉) when the power switch is on. Since mishandling may lead to burns and fire, be sure to comply with the following precautions: ①. Do not touch metallic parts near the soldering tip/ nozzle. ②. Do not use this system near the flammable items. ③. Advise other people in the work area that the unit can reach a very high temperature and should be considered potentially dangerous. ④. Turn off the power switch while taking breaks and when finishing using. ⑤. Before replacing parts or storing the system, turn off the power and let it cool down to the room temperature. ⑥. Warning: this tool must be placed on its stand when not in use. 5 ⑦. A fire may result if the appliance is not used with care, therefore: 1) Be careful when using the appliance in places where there is combustible material. 2) Do not apply to the same place for a long time. 3) Do not use in presence of an explosive atmosphere. 4) Be aware heat may be conducted to combustible materials that out of sight. 5) Place the appliance on its stand after use and allow it to cool down before storage. 6) Do not leave the appliance unattended when it is switched on. 3. Take care of your tools Do not use the tools for any applications other than soldering or desoldering. Do not rap the iron against the work bench or otherwise subject the iron to severe shocks. Do not file the soldering tip to remove the oxide, please wipe the tip on the cleaning sponge. Use only accessories or attachments which are listed in the operation manual. Use of other tools and other accessories can lead to a danger of injury. Please turn off the power before connecting or disconnecting the soldering iron. 4. Maintenance Before further use, safety devices or slightly damaged parts must be carefully checked for error‐free and intended operation. Inspect moving parts for error‐free operation and that they don’t bind, or whether any parts are damaged. Damaged safety devices and parts must be repaired or replaced by a qualified technician, so long as nothing else is indicated in the operation manual. Use only accessories or 6 attachments which are listed in the operation manual. Use of other tools and other accessories can lead to a danger of injury. 5. Keep children at a distance Warning: this appliance is not intended for use by young children and infirm persons unless they have been adequately supervised by a responsible person to ensure that they can use the appliance safely. Warning: Young children should be supervised to ensure that they do not play with the appliance. Unused soldering tools should be stored in a dry location which is out of the reach of children. Switch off all unused soldering tools. 6. Protect yourself against electrical shocks Avoid touching grounded parts with your body, e.g. pipes, heating radiators and so on. The grip of antistatic designed soldering tool is conductive. 7. Work environment Do not use the soldering tool in a moist or wet environment. The soldering iron should be placed on the holder after finished using. 8. Observe the valid safety regulations at your work place. SS-331數顯吸焊台 概述 SS-331 特別為無鉛吸焊而設計。快速升溫和大功率的特點使其可以方便快速的焊接/拆焊所有類型的DIP元器件。 合理的結構,單手操作和強大的吸焊功率能夠輕鬆的從PCB一面或兩面除去殘餘錫渣。 目前已廣泛的應用於電子科研,教學以及生產等單位,特別是家電維修和通訊器材維修人員所不可缺少的首選專用工具。 1. 控制單元 吸焊槍由微處理器自動控制。數位控制裝置和高品質的感測器及加熱交換系統保證對烙鐵頭的溫度進行精確的控制。通過快速準確的記錄閉和控制回路測量可以獲得作高的溫度精度和帶負載狀況下最佳熱量轉遞性能,特別適合用於無鉛制程工藝。 2. 吸焊槍 (5SS-331-DG) 吸焊槍的功率為 60W(額定加熱功率 130W),可以配各種尺寸的烙鐵頭(U系列),廣泛應用於電子領域。 大功率和細長外形設計使這個電烙鐵適合做精密的焊接操作,發熱芯採用陶瓷發熱材料製作,頂端溫度感測器設計其特點在於能夠快速並準確的控制焊接溫度。 7 技術規範. 電壓 220~240V AC 消耗功率 140W 溫度 160°C ~ 480°C 真空吸力 600mm Hg 發熱原件 陶磁發熱芯 配件 吸嘴 x 3(0.8(裝在吸槍上)1.0/  1.3mm) 通針 x 3( 0.7/  0.9/  1.2mm) 過濾棉 x 4 ( 20.8mm x1 +  16.8mm x3) 認證 CE, GS, RoHS 尺寸(mm) 225 x 160 x 130 重量(kgs ) 2.5 操作說明: 1 將吸焊槍放置在支架上。然後將插頭插入插座順時針方向鎖緊螺母。檢查供電電源符合本產品的規格並確認總電源開關處於OFF的位置。接通控制系統的電源並打開電源開關。系統進行自檢,所有的液晶顯示都暫時被點亮。電子系統自動打開並迅速達到設定的溫度值。 2 顯示幕和溫度設置: 數位顯示說明: ① . 顯示吸焊烙鐵頭的實際溫度。 8 9 ② . 顯示的是設定溫度,通過按“UP"或“DOWN"鍵來改變設定值。輕壓單下“UP"或“DOWN"鍵設定值將以±1℃變化,持續按下“UP"或“DOWN"鍵設定值將會快速改變。改變設定值後,電子系統自動工作,顯示溫度會迅速到達設定值。 ③ . ℃或℉溫度,通過按“℃/℉"按鈕切換攝氏或華氏溫度,切換後電子系統會自動顯示的攝氏或華氏實際溫度①和設定溫度②數值。 ④ . 當烙鐵頭實際溫度小於設定溫度時顯示“HEAT ON"表示電子系統對烙鐵正在加熱。 ⑤ . 當烙鐵頭實際溫度與設定溫度的絕對偏差大於±10℃時顯示“WAIT",表示電子控溫系統還沒到達穩定狀態,請稍做等待,待“WAIT"不顯示時即可正常使用了。 ⑥ . 顯示“---"則表示系統有故障,或者是電烙鐵沒有正確連接到控制系統。 3 安全操作說明 3.1 製造商對於超出操作說明中所到的其他使用或未經授權的更改,不負任何責任。 3.2 應仔細閱讀操作說明及警告並將其放置在控制系統附近,如不遵守這些警告,將有可能發生意外事故,人體傷害或健康傷害。 4 警告及注意事項 4.1 電源線只能插入經認證過的電源插座或適配器中。 4.2 小心高溫:在開機狀態下,烙鐵頭或熱風槍焊嘴的溫度可以達到大約400℃(752℉)左右,由於不正確的操作可能會造成燒傷或引起火災,故應確保遵守以下預防措施:  不要讓金屬部件接觸到焊嘴和烙鐵頭;  不要在易燃物品附近使用該系統;  告知工作區域中的其他人員此設備會達到非常高的溫度應注意識別其潛在的危險性;  在休息及使用完後應關閉總電源  在更換零件或儲存前,應關閉總電源並讓其冷卻到 10 室溫  警告:不用時一定要將此工具放置在特定的支架上。  如使用不當可能會引起火災,因此  在有易燃物品的場所使用該設備一定要小心;  不要長時間在同一位置使用該設備;  不要在有爆炸性氣體的場所使用;  要知道熱量有可能會引燃不在視線範圍內的可燃物質;  使用完畢後要將器具放置在特定的支架上,且要在冷卻後方可收藏起來;  離開時必須要關閉電源開關。 4.3 愛護工具  不要將此設備用於焊接或脫焊以外的其他操作。  不要在工作臺上敲打電烙鐵或熱風筒或其他嚴重的撞擊。  不要銼烙鐵頭上的氧化層,請使用浸水的清潔棉擦除氧化層。  確保使用操作說明上列明的附件或配件,使用其他的工具或其他配件使本系統損壞或會有受傷的危險。  在接通或斷開錫槍前應先關閉電源。 4.4 工具保養 在使用前,應仔細檢查安全裝置或有輕微損害的零件無故障及在指定操作狀態。檢查活動的零件無故障操作,並且沒有繞線及零件損壞。已損壞的安全設備及零件都應由有資格的專業人員進行維修或更換。只使用操作說明中列出的配件。如果使用其他工具或配件有可能對操作人員造成傷害。 4.5 放置在兒童接觸不到的地方 警告:老人和兒童必須在監護人在場確保可安全使用的情況下方可使用該設備。警告:應確保兒童在沒有監護的情況下無法接觸到該設 備。 4.6 不用的焊接工具應存放在乾燥的,兒童接觸不到的地方。而且應該關閉所有未在使用狀態下的焊接工具的電源。 4.7 避免遭受電擊 避免用身體接觸接地零件,如:烙鐵管,散熱器等。抗靜電設計的焊接工具的把手是導電的。 4.8 工作環境 不要在潮濕的環境中使用焊接工具。電烙鐵及熱風槍用完後要放回到支架上。 4.9 遵守工作場所中的安全操作規定。 寶工實業股份有限公司 PROKIT’S INDUSTRIES CO., LTD. http://www.prokits.com.tw E-mail:pk@mail.prokits.com.tw ©2014 Prokit’s Industries Co., LTD. All rights reserved 2014001(C) Connections to a Wider Range of Slaves Ensured by Upgraded Models Master Conventional models New models C200HW-SRM21 CQM1-SRM21 SRM1-C01 SRM1-C02 SRM1-C01-V1 SRM1-C02-V1 3G8B3-SRM00 3G8B3-SRM01 C200PC-ISA02-SRM C200PC-ISA12-SRM C200HW-SRM21-V1 CQM1-SRM21-V1 SRM1-C01-V2 SRM1-C02-V2 NKE-made Uniwire C B /SS d Communications mode Slave ade U e CompoBus/S Send Unit SDD-CS1 High-speed communications mode Long-distance communications mode SRT1 Series FND-X􀀀-SRT Yes Yes Yes Yes No No Products from other companies SMC Solenoid valve for SI manifold use VQ Series SX Series SY Series Yes Yes Yes Yes Yes Yes No No No CKD Solenoid valve for saving wiring effort 4TB1 and 4TB2 Series 4TB3 and 4TB4 Series 4G Series MN4SO Series Yes Yes Yes Yes Yes Yes Yes Yes No No No No Koganei Valve for saving wiring effort YS1A1, A2 YS2A1, A2 Yes Yes Yes Yes No No New product SRT2-AD02 SRT2-DA02 No No Yes Yes Yes Yes SRT2-VID08S(-1) SRT2-VOD08S(-1) SRT2-VID16ML(-1) SRT2-VOD16ML(-1) Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes SRT2-ID16(-1) SRT2-OD16(-1) SRT2-ID08(-1) SRT2-OD08(-1) SRT2-ROC16 SRT2-ROF16 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes CPM1A-SRT21 Yes Yes Yes Products to be released soon SRT2-ID04(-1) SRT2-OD04(-1) SRT2-ID16T(-1) SRT2-OD16T(-1) SRT2-MD16T(-1) SRT2-ROC08 SRT2-ROF08 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Note: 1. In high-speed communications mode, the maximum transmission distance is 100 m at a baud rate of 750 kbps. In long-distance communications mode (i.e., a newly available mode), the maximum transmission distance is 500 m at a baud rate of 93.75 kbps. 2. The SRT2-AD04 and SRT2-DA02 are available for 16-bit synchronous communications. 11 Master Control Unit SRM1-C01-V2/C02-V2 Subminiature, Stand-alone Model with CompoBus/S Master and SYSMAC Controller Functions Maximum number of Remote I/O points per Master: 256 Maximum number of Slaves per Master: 32 Communications cycle time: 0.5 ms max. (at baud rate 750 kbps). Communications distance: Extended to 500 m max. (at baud rate 93.75 kbps). Additional instructions (PID, SCL, NEG, ZCP) ensure analog compatibility. RS-232C port incorporated (SRM1-C02-V2). RC Ordering Information Specifications Model Buuilt-in sstaandd-aaloonee ccoontroolleer fuuncctioonss Without RS-232C SRM1-C01-V2 With RS-232C SRM1-C02-V2 Specifications Master Specifications Number of I/O points 256 points (128 inputs/128 outputs) 128 points (64 inputs/64 outputs) Selectable by DM setting. The default setting is 256 points. Max. number of Slaves per Master 256 points: 32 128 points: 16 I/O words Input words: 000 to 007 Output words: 010 to 017 Programming language Ladder diagram Types of instruction 14 basic and 72 special instructions (123 instructions in total) Execution time LD instruction: 0.97 ms MOV instruction: 9.1 ms Program capacity 4,096 words Data memory 2,048 + 512 (read-only) words Timers/Counters 128 timers/counters Work bits 640 bits Memory backup Flash memory (without battery): User programs Super capacitor: Data memory (backed up for 20 days at an ambient temperature of 25°C) Peripheral port 1 point RS-232C port 1 point (SRM1-C02-V1 only) Host Link, NT Link, 1:1 Link, or no protocol Programming tool Programming Consoles: CQM1-PRO01-E, C200H-PRO27-E SYSMAC-CPT: WS01-CPTB1-E (CD-ROM/FD) SYSMAC Support Software (MS-DOS version): C500-ZL3AT1-E Note: PID, SCL, NEG, and ZCP instructions are not supported by the SYSMAC-CPT. SRM1-C01-V2/C02-V2 SRM1-C01-V2/C02-V2 12 Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note 1) Communications baud rate 750,000 bps/93,750 bps (see note 2) Communications cycle time High-speed comm nications 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Long-distance comm nications 4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance High-speed communications mode VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Long-distance communications mode VCTF cable: Main line length: 500 m max. Branch line length: 6 m max. Total branch line length: 120 m max. Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: 1. A terminator must be connected to the point in the system farthest from the Master. 2. The communications baud rate is switched using DM settings (default setting is 750,000 bps). General Specifications Supply voltage 24 VDC Allowable supply voltage 20.4 to 26.4 VDC Power consumption 3.5 W max. Inrush current 12.0 A max. Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 57 Hz, 0.075-mm amplitude, 57 to 150 Hz, acceleration: 9.8 m/s2 in X, Y, and Z directions for 80 minutes each (Time coefficient; 8 minutes × coefficient factor 10 = total time 80 minutes) Shock resistance 147 m/s2 three times each in X, Y, and Z directions Ambient temperature Operating: 0°C to 55°C Storage: –20°C to 75°C Humidity 10% to 90% (with no condensation) Atmosphere Must be free from corrosive gas. Terminal screw size M3 Power interrupt time DC type: 2 ms min. Weight 150 g max. SRM1-C01-V2/C02-V2 SRM1-C01-V2/C02-V2 13 Nomenclature SRM1-C01-V2 SRM1-C02-V2 CPU Unit status indicator CompoBus/S communications status indicator Indicates the status of the Compo- Bus/S in operation and in communication with Slaves. Peripheral port communications status indicator Flashes when the peripheral port or RS-232C port is in communication. Connector cover Peripheral port Connect this port to programming tools through dedicated cables. Terminal block Connector cover RS-232C port Connect this port to the RS-232C interfaces of personal computers and Programmable Terminals. Dimensions Note: All units are in millimeters unless otherwise indicated. SRM1-C01/C02-V2 The above dimensions apply to the SRM1-C02-V2. The SRM-C01-V2 has no RS-232C port. 14 Master Unit C200HW-SRM21-V1 Master Unit for CS1, C200HX, C200HG, C200HE, and C200HS A maximum of 256 I/O points available. Connects to a maximum of 32 Slaves. Communications cycle time: 0.5 ms max. (at baud rate 750 kbps). Communications distance: Extended to 500 m max. (at baud rate 93.75 kbps). Connection to Analog Terminals now supported. RC Ordering Information PC Max. number of I/O points Model C200HX (-Z), C200HG (-Z), C200HE (-Z), C200HS, CS1 256 points (128 inputs/128 outputs) C200HW-SRM21-V1 Specifications Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note 1) Communications baud rate 750,000 bps, 93,750 bps (see note 2) Communications cycle time High-speed comm nications 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Long-distance comm nications 4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance High-speed communications mode VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Long-distance communications mode VCTF cable: Main line length: 500 m max. Branch line length: 6 m max. Total branch line length: 120 m max. Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: 1. A terminator must be connected to the point in the system farthest from the Master. 2. The communications baud rate is switched with the DIP switch. C200HW-SRM21-V1 C200HW-SRM21-V1 15 Unit Specifications Current consumption 150 mA max. at 5 VDC Number of I/O points 256 points (128 inputs/128 outputs), 128 points (64 inputs/64 outputs) (switchable) Number of occupied words 256 points: 20 words (8 input words/8 output words, 4 status data) 128 points: 10 words (4 input words/4 output words, 2 status data) PC CS1, C200HX (-ZE), C200HG (-ZE), C200HE (-ZE), C200HS Number of points per node number 8 points Max. number of Slaves per Master 32 Status data Communications Error Flag and Active Slave Node (see note) Weight 200 g max. Approved standards UL 508 (E95399), CSA C22.2 No. 142 (LR51460) Note: These flags use the AR area. Ratings The ratings of the Unit are the same as those of the CS1, C200HX, C200HG, C200HE, and C200HS. Nomenclature Indicators Indicates the operating status of the Master Unit and the status of communications with the Slaves. Rotary Switch This switch sets the Master’s one-digit hexadecimal unit number. DIP Switch These pins have the following functions: Pin 1: Max. number of Slaves setting Pin 2: Baud rate setting Pins 3 to 4: Reserved (Always OFF.) Communications Terminals Connect the Slaves’ transmission cable to these terminals. C200HW-SRM21-V1 C200HW-SRM21-V1 16 Dimensions Note: All units are in millimeters unless otherwise indicated. C200HW-SRM21-V1 Note: Refer to the C200HX, C200HG, C200HE, C200HS, or CS1 Operation Manual for details on the dimensions when the Master Unit is installed in the PC’s Backplane. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. 17 Master Unit CQM1-SRM21-V1 Master Unit for CQM1 A maximum of 128 I/O points available (Possible to set 32, 64, or 128 I/O points). Connects to a maximum of 16/32 Slaves. Communications cycle time: 0.5 ms max. (at baud rate 750 kbps). Communications distance: Extended to 500 m max. (at baud rate 93.75 kbps). Connection to Analog Terminals now supported. RC Ordering Information PC Max. number of I/O points Model CQM1-series PC 128 points (64 inputs/64 outputs) CQM1-SRM21-V1 Specifications Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note 1) Communications baud rate 750,000 bps, 93,750 bps (see note 2) Communications cycle time High-speed comm nications 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Long-distance comm nications 4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs communications mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance High-speed communications mode VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Long-distance communications mode VCTF cable:: Main line length: 500 m max. Branch line length: 6 m max. Total branch line length: 120 m max. Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: 1. A terminator must be connected to the point in the system farthest from the Master. 2. The communications baud rate is switched with the DIP switch. CQM1-SRM21-V1 CQM1-SRM21-V1 18 Unit Specifications Current consumption 180 mA max. at 5 VDC Number of I/O points 128 points (64 inputs/64 outputs), 64 points (32 inputs/32 outputs), 32 points (16 inputs/16 outputs) (switchable) Number of occupied words 128 points: 4 input words/4 output words 64 points: 2 input words/2 output words 32 points: 1 input word/1 output word PC 128 points: CQM1-CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1 64 points: CQM1-CPU11-E/CPU21-E/CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1 32 points: CQM1-CPU11-E/CPU21-E/CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1 Number of points per node number 4/8 points (switchable) Max. number of Slaves per Master 32 (4 points per node number) Status data Alarm terminal output Weight 200 g max. Approved standards UL 508 (E95399), CSA C22.2 No. 142 (LR51460) Alarm Output Specifications Maximum switching capacity 2 A at 24 VDC Minimum switching capacity 10 mA at 5 VDC Relay G6D-1A Minimum ON time 100 ms Circuit configuration 2 A at 24 VDC max. Internal circuit CQM1-SRM21-V1 Ratings The ratings of the Unit are the same as those for the CQM1. Nomenclature Indicators Indicates the operating status of the Master Unit and the status of communications with the Slaves. DIP Switch These pins have the following functions: Pins 1 and 2: PC word allocation setting Pin 3: Number of points setting Pin 4: Baud rate setting Pins 5 to 6: Reserved (Always OFF.) Alarm Output Terminals These terminals are shorted when an error occurs. Connect to a warning device. Communications Terminals Connect the Slaves’ transmission cable to these terminals. Terminal block screws These screws attach the terminal block. The terminal block can be removed when these screws are loosened. CQM1-SRM21-V1 CQM1-SRM21-V1 19 Dimensions Note: All units are in millimeters unless otherwise indicated. CQM1-SRM21-V1 Note: Refer to the CQM1 Operation Manual for details on the dimensions when the Master Unit is installed in the PC’s Backplane. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. 20 SYSMAC Board C200PC-ISA􀀀2-SRM SYSMAC C200HX/HG/HE and CompoBus/S Master Functions Integrated into a Single PCB Operates as a Programmable Controller to be built into personal computers. Programming is possible through Programming Devices like the programming on C200HX/HG. An optional Expansion Board is available for serial communications. Dedicated library in C is available for control. Driver for Windows use is available. Connects to a maximum of three Expansion I/O Racks. CompoBus/S Slave data is automatically read. Ordering Information PC Max. number of I/O points Model C200HG-CPU43 256 points ( 128 inputs/128 outputs) C200PC-ISA02-SRM C200HX-CPU64 56 o s 8 u s/ 8 ou u s) C200PC-ISA12-SRM Specifications Communications Specifications Communications method CompoBus/S protocol Coding method Manchester coding method Connection method Multi-drop method and T-branch method (see note) Communications baud rate 750,000 bps Communications cycle time 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs Communications cable 2-conductor VCTF cable (0.75 x 20) Dedicated flat cable Communications distance VCTF cable: Main line length: 100 m max. Branch line length: 3 m max. Total branch line length: 50 m max. Flat cable: Main line length: 30 m max. Branch line length: 3 m max. Total branch line length: 30 m max. (When flat cable is used to connect fewer than 16 Slaves, the main line can be up to 100 m long and the total branch line length can be up to 50 m.) Max. number of connecting nodes 32 Error control checks Manchester code check, frame length check, and parity check Note: A terminator must be connected to the point in the system farthest from the Master. C200PC-ISA􀀀2-SRM C200PC-ISA􀀀2-SRM 21 Unit Specifications Power supply voltage 4.875 to 5.25 VDC Current consumption 0.5 A max. (see note 1) Number of I/O points 256 points (128 inputs/128 outputs), 128 points (64 inputs/64 outputs), (switchable) Number of occupied words 256 points: 20 words (8 input words, 8 output words, and 4 status data words) (see note 2) 128 points: 10 words (4 input words, 4 output words, and 2 status data words) Number of points per node number 8 points Max. number of Slaves per Master 32 Status data Communications Error Flag and Active Slave Node (see note 2) Weight 200 g max. Note: 1. The current consumption will be 0.8 A max. if the Programming Console is connected through the optional Expansion Board. 2. The occupied words are in the IR area. 22 I/O Link Unit CPM1A-SRT21 I/O Link Unit for CPM2A/CPM1A Operates as a Slave of the CompoBus/S Master Unit. Exchanges eight inputs and eight outputs with the Master. Approved by UL and CSA standards, and bears the CE marking. RC Ordering Information CPU Units I/O configuration Power supply Output method Input Output Model 30-point I/O model AC Relay 18 12 CPM1A-30CDR-A* DC Relay CPM1A-30CDR-D* Transistor (sink) CPM1A-30CDT-D Transistor (source) CPM1A-30CDT1-D AC Relay CPM2A-30CDR-A DC Relay CPM2A-30CDR-D Transistor (sink) CPM2A-30CDT-D Transistor (source) CPM2A-30CDT1-D 40-point I/O model AC Relay 24 16 CPM1A-40CDR-A* DC Relay CPM1A-40CDR-D* Transistor (sink) CPM1A-40CDT-D Transistor (source) CPM1A-40CDT1-D AC Relay CPM2A-40CDR-A DC Relay CPM2A-40CDR-D Transistor (sink) CPM2A-40CDT-D Transistor (source) CPM2A-40CDT1-D 60-point I/O model AC Relay 36 24 CPM2A-60CDR-A DC Relay CPM2A-60CDR-D Transistor (sink) CPM2A-60CDT-D Transistor (source) CPM2A-60CDT1-D Note: Models marked with asterisks do not bear CE markings. Expansion Units Product Number of connectable Units per CPU Unit Output method Input Output Model Expansion I/O Units 3 max. (see note) Relay 12 8 CPM1A-20EDR1 Transistor (sink) CPM1A-20EDT Transistor (source) CPM1A-20EDT1 --- 8 --- CPM1A-8ED Relay --- 8 CPM1A-8ER Transistor (sink) --- 8 CPM1A-8ET Transistor (source) CPM1A-8ET1 Analog I/O Unit 3 max. (see note) Analog 2 1 CPM1A-MAD01 CompoBus/S I/O Link Unit 3 max. (see note) --- 8 I/O link points 8 I/O link points CPM1A-SRT21 Note: Only a single Unit will be connectable if the NT-AL001 is connected to the RS-232C port. CPM1A-SRT21 CPM1A-SRT21 23 Specifications Slave CompoBus/S Slave Number of I/O points 8 inputs and 8 outputs Number of occupied I/O memory words of CPM2A 1 input word and 1 output word (same as other Expansion Units in allocation) Node address setting DIP switch Dimensions Note: All units are in millimeters unless otherwise indicated. CPM1A-SRT21 Installation Connection Examples CompoBus/S Master Unit or SRM1 CompoBus/S Master Control Unit CPM1A or CPM2A CPU Unit CPM1A-SRT21 CompoBus/S I/O Link Unit CS1􀀀 C200H􀀀 CQM1 SRM1 Dedicated flat cable or VCTF cable Connectable to 16 Units max. (Eight CQM1-SRM21 Units max.) Note: A single CompoBus/S I/O Link Unit together with a maximum of two other Expansion I/O Units can be connected to the CPM1A or CPM2A CPU Unit. 24 Transistor Remote Terminal SRT-ID/OD Long-distance Communications Supported by SRT2 Models (Long-distance/High-speed Communications Selection) SRT1 models support high-speed communications only. SRT2 models support long-distance communications and high-speed communications. Ultra-compact at 80 x 48 x 50 (W x H x D) mm for 4-point and 8-point terminals and 105 x 48 x 50 (W x H x D) mm for 16-point terminals. Two independent power supplies can be used because the I/O terminals are insulated from the internal circuits. DIN track mounting and screw mounting are both supported. RC Ordering Information I/O classification Internal I/O circuit common I/O points Rated voltage I/O rated voltage Model Input NPN (+ common) 4 24 VDC 24 VDC SRT1-ID04 PNP (– common) C C SRT1-ID04-1 Output NPN (– common) SRT1-OD04 PNP (+ common) SRT1-OD04-1 Input NPN (+ common) 8 SRT2-ID08 PNP (– common) SRT2-ID08-1 Output NPN (– common) SRT2-OD08 PNP (+ common) SRT2-OD08-1 Input NPN (+ common) 16 SRT2-ID16 PNP (– common) 6 SRT2-ID16-1 Output NPN (– common) SRT2-OD16 PNP (+ common) SRT2-OD16-1 Note: For more details about connections supported by the Master Unit, refer to page 10. Specifications Ratings Inputs Input current 6 mA max./point ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage 15 VDC min. between each input terminal and V OFF voltage 5 VDC max. between each input terminal and V OFF current 1 mA max. Insulation method Photocoupler Input indicators LED (yellow) SRT-ID/OD SRT-ID/OD 25 Outputs Rated output current 0.3 A/point Residual voltage 0.6 V max. Leakage current 0.1 mA max. Insulation method Photocoupler Output indicators LED (yellow) Characteristics Communications power supply voltage 14 to 26.4 VDC I/O power supply voltage 24 VDC +10%/–15% I/O power supply current 1 A max. Current consumption (see note) 50 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Connecting Units 4-point and 8-point Terminals: 16 Input Terminals and 16 Output Terminals per Master 16-point Terminals: 8 Input Terminals and 8 Output Terminals per Master Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting strength No damage when 50 N pull load was applied for 10 s in all directions Terminal strength No damage when 50 N pull load was applied for 10 s Screw tightening torque 0.6 to 1.18 N 􀀀 m Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 4-point and 8-point Terminals: 80 g max. 16-point Terminals: 110 g max. Approved standards (4/8 points) UL 508, CSA C22.2 No. 14 Note: The above current consumption is the value with all 4 and 8 and 16 points turned ON excluding the current consumption of the external sensor connected to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal. SRT-ID/OD SRT-ID/OD 26 Nomenclature I/O Terminals I/O Power Supply Terminals Connect 24-VDC power supply Communications Power Supply Terminals Connect 14- to 26.4-VDC power supply. CompoBus/S Terminal Connect the CompoBus/S DIP Switch communications cable. Used for node number setting and holding or clearing outputs for communications error. Refer to the Compobus/S Operation Manual (W266) for details on DIP switch settings. Baud rate setting 0 to 7 ERR COMM PWR Node Number Settings Output HOLD/CLEAR settings (Output Terminals only) Screw mounting hole Indicators Indicator Display Color Meaning PWR Lit Green The communications power supply is ON. Not lit The communications power supply is OFF. COMM Lit Yellow Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Lit Red A communications error has occurred. Not lit Normal communications or the Unit is in standby status. 0 to 7 Lit Yellow The corresponding I/O signal is ON. Not lit The corresponding I/O signal is OFF. Output HOLD/CLEAR Mode Mode Pin 1 Setting HOLD ON Output status is maintained. CLEAR OFF Output status is cleared when a communications error occurs. Note: 1. Pin 1 is factory-set to OFF. 2. This function is available to Output Terminals only. SRT-ID/OD SRT-ID/OD 27 Node Number Settings Node number Pin 3 Pin 4 Pin 5 Pin 6 8 4 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF ON 14 ON ON ON OFF 15 ON ON ON ON Note: 1. The node number is factory-set to 0. 2. For node number settings, refer to the CompoBus/S Operation Manual (W266). Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID04 (-1) SRT1-OD04 (-1) SRT2-ID08 (-1) SRT2-OD08 (-1) (54) 27 80 48 65 Two, 4.2 dia. or M4 Sixteen, M3 Mounting Holes (20.5) (11) SRT-ID/OD SRT-ID/OD 28 SRT2-ID16 (-1) SRT2-OD16 (-1) 48 Two, 4.2 dia. or M4 (50) (28) Mounting Holes (54) 27 50 (20.5) (11) 105 22–M3 Installation Internal Circuit Configuration SRT1-ID04 SRT1-ID04-1 Photocoupler Photocoupler Internal circuit Internal circuit 24 VDC(+) Photocoupler Photocoupler (–) SRT1-OD04 Internal circuit 24 VDC Photocoupler Photocoupler Voltage stepdown SRT1-OD04-1 Internal circuit Photocoupler Photocoupler 24 VDC (P) (P) 24 VDC (P) (P) Voltage stepdown V V V 1 G 0 2 G G V V V 1 V 0 2 G SRT-ID/OD SRT-ID/OD 29 SRT2-OD08-1 Internal circuit Photocoupler Photocoupler SRT2-ID08 SRT2-ID08-1 Photocoupler Photocoupler Internal circuit 24 VDC(+) Internal circuit Photocoupler Photocoupler (–) SRT2-OD08 Internal circuit 24 VDC Photocoupler Photocoupler Voltage stepdown SRT2-ID16 Photocoupler Internal Photocoupler circuit SRT2-ID16-1 Internal circuit Photocoupler Photocoupler Internal circuit SRT2-OD16 Photocoupler Photocoupler Voltage stepdown SRT2-OD16-1 Internal circuit Photocoupler Photocoupler Voltage stepdown 24 VDC (P) 24 VDC (P) (P) Voltage stepdown (P) 24 VDC (P) (P) 24 VDC (P) (P) V V 1 0 2 G G V V 1 0 2 G V V 1 0 2 G SRT-ID/OD SRT-ID/OD 30 External Connections (NPN Models) Input Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Three-wired Sensors SRT1-ID04 with NPN Output SRT2-ID08 and SRT2-ID16 with NPN Output Two-wired Sensors SRT1-ID04 SRT2-ID08 and SRT2-ID16 Sensor 1 Blue Brown Sensor 2 Blue Brown Sensor 1 Blue Brown Sensor 2 Blue Brown Output SRT1-OD04 SRT2-OD08 and SRT2-ID16 L 1 L 2 L 1 L 2 Terminal Arrangement and I/O Device Connection Example (PNP Models) Note: The connections examples shown are for PNP models. Input SRT1-ID04 SRT2-ID08 Output SRT1-OD04 SRT2-OD08 Blue Brown Blue Brown Blue Brown Brown Blue Communications path Communications power supply power supply power supply Communications path Communications power supply Communications path Communications power supply power supply Photoelectric sensor or proximity sensor (threewired sensor with a builtin- amplifier) Limit switch (two-wired sensor) Solenoid, valve Solenoid I/O Communications path Communications power supply Photoelectric sensor or proximity sensor (threewired sensor with a builtin- amplifier) Limit switch (two-wired sensor) Black Black SRT2-ID16 SRT2-OD16 Communications path Communications power supply I/O power supply Photoelectric sensor or proximity sensor (threewired sensor with a builtin- amplifier) Limit switch (two-wired sensor) I/O power supply Communications path Communications power supply Solenoid Valve Valve power supply I/O Blue Brown Blue Brown Black I/O I/O SRT-ID/OD SRT-ID/OD 31 External Connections (PNP Models) Input Three-wired Sensors SRT1-ID04-1 with NPN Output SRT2-ID08-1 and SRT2-ID16-1 with NPN Output Two-wired Sensors SRT1-ID04-1 SRT2-ID08-1 and SRT2-ID16-1 Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Sensor 1 Blue Brown Black Sensor 2 Blue Brown Black Sensor 1 Blue Brown Sensor 2 Blue Brown Sensor 1 Blue Brown Sensor 2 Blue Brown Output SRT1-OD04-1 SRT2-OD08-1 and SRT2-ID16-1 L 1 L 2 L 1 L 2 Terminal Arrangement and I/O Device Connection Example (PNP Models) Note: The connections examples shown are for NPN models. Input SRT1-ID04-1 SRT2-ID08-1 Output SRT1-OD04-1 SRT2-OD08-1 Blue Brown Blue Brown Blue Brown Brown Blue Communications path Communications power supply power supply power supply Communications path Communications power supply Communications path Communications power supply power supply Photoelectric sensor or proximity sensor (three-wired sensor with a built-in-amplifier) Limit switch (two-wired sensor) Solenoid, valve Solenoid I/O Communications path Communications power supply Photoelectric sensor or proximity sensor (three-wired sensor with a built-in-amplifier) Limit switch (two-wired sensor) Black Black SRT2-ID16-1 SRT2-OD16-1 Communications path Communications power supply I/O power supply Photoelectric sensor or proximity sensor (three-wired sensor with a built-in-amplifier) Limit switch (two-wired sensor) I/O power supply Communications path Communications power Valve supply Solenoid Valve power supply I/O Blue Brown Blue Brown Black I/O I/O Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. For general precautions refer to page 80. 32 Remote I/O Terminal SRT1-D16T(-1) Models with 3-tier Terminals (16 Points) are Added to the Remote I/O Terminal Series. Six Models are Available Depending on the NPN or PNP Configuration, Input Points, I/O Points, or Output Points. Incorporates easy-to-wire terminals each connecting to a single wire. Reduces designing and wiring effort. Incorporates a removable circuit block of cassette construction. Ordering Information I/O classification Internal I/O circuit common I/O points I/O connection method Model Digital input NPN (+ common) 16 M3 terminal block SRT1-ID16T PNP (– common) 6 3 e a boc SRT1-ID16T-1 Digital I/O NPN (+ common) SRT1-MD16T PNP (– common) SRT1-MD16T-1 Digital output NPN (– common) SRT1-OD16T PNP (+ common) SRT1-OD16T-1 Specifications Ratings Inputs Input current 6 mA max./point at 24 V and 3 mA min./point at 17 V ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage NPN: 15 VDC min. between V terminals and each input terminal PNP: 15 VDC min. between G terminals and each input terminal OFF voltage NPN: 5 VDC max. between V terminals and each input terminal PNP: 5 VDC max. between G terminals and each input terminal OFF current 1 mA max. Insulation method Photocoupler Outputs Rated output current 0.5 A max./point Residual voltage 1.2 V max. ON delay time 0.5 ms max. OFF delay time 1.0 ms max. Leakage current 0.1 mA max. Insulation method Photocoupler SRT1-D16T(-1) SRT1-D16T(-1) 33 Characteristics Communications power supply voltage 14 to 26.4 VDC I/O power supply voltage 24 VDC +10%/–15% I/O power supply current 4 A max./common Current consumption (see note) 50 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC between insulated circuits Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 Shock resistance 200 m/s2 Mounting strength No damage with 100 N pull load applied in all directions. Terminal strength No damage with 100 N pull load applied Screw tightening torque 0.3 to 0.5 N 􀀀 m Ambient temperature Operating: –10°C to 55°C Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Weight 300 g max. Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal. Nomenclature ERR Indicator: Indicates communications errors. COMM Indicator: ON while the Unit is in data communication. Power Indicator HOLD/CLR DIP Switch The DIP switch is on the left-hand side under the cover on the upper part of the Remote I/O Terminal. Holding or clearing output when a communications error occurs. Address Setting Switch Set the rotary switch to the node address by referring to the following table. I/O Indicators M4 Mounting Screw Terminal Cover The Unit stops operating with the cover opened. I/O and I/O Device Power Supply Terminals 8 to 15 These terminals will be used as output terminals 0 through 7 if the connected device handles both input and output signals. I/O and I/O Device Power Supply Terminals 0 to 7 These terminals will be used as input terminals if the connected device handles both input and output signals. I/O Power Supply Terminals Connect 24-VDC I/O power supply Fixture Track Used for DIN track mounting. CompoBus/S Internal Power Supply Terminals (BS+ and BS–) CompoBus/S Communications Cable Terminals (BDH and BDL) Address Setting Switch Node address Setting (Hex) 0 0 1 1 2 2 3 3 4 4 5 5 6 6 7 7 Node address Setting (Hex) 8 8 9 9 10 A 11 B 12 C 13 D 14 E 15 F SRT1-D16T(-1) SRT1-D16T(-1) 34 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID16T (-1) SRT1-MD16T (-1) SRT1-OD16T (-1) Mounting Holes Two, 4.2 dia. or M4 Two, 4.2 dia. or M4 Installation Internal Circuit Configuration SRT1-ID16T SRT1-MD16T SRT1-ID16T-1 SRT1-MD16T-1 SRT1-OD16T SRT1-OD16T-1 DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (8 to 15) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (0 to 7) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (8 to 15) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Inputs (8 to 15) DC-DC converter (isolated type) Photocoupler Photocoupler Inputs (0 to 7) Outputs (0 to 7) DC-DC converter (isolated type) Photocoupler Photocoupler Outputs (0 to 7) Outputs (8 to 15) I/O power supply I/O power supply I/O power supply Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Voltage drop Voltage drop Voltage drop Voltage drop Voltage drop Voltage drop SRT1-D16T(-1) SRT1-D16T(-1) 35 External Connections Input (NPN Models) SRT1-ID16T SRT1-MD16T Output (NPN Models) SRT1-OD16T SRT1-MD16T Input (PNP Models) SRT1-ID16T-1 SRT1-MD16T-1 Output (PNP Models) SRT1-OD16T-1 SRT1-MD16T-1 Two-wired sensor Three-wired sensor Three-wired sensor Solenoid, valve, etc. Solenoid, valve, etc. Blue (Black) Brown (White) Blue (Black) Brown (Red) Black (White) Black (Black) Blue (Red) Brown (White) 36 Relay-mounted Remote Terminal SRT-R Ultra-miniature 8-point and 16-point Relay-mounted Terminals Ultra-compact (8-point models: 101 x 51 x 51 mm (W x H x D); 16-point models: 156 x 51 x 51 mm (W x H x D)) Power MOS FET Relay and Relay models. DIN track mounting and screw mounting are available. RC Ordering Information Classification I/O points Rated voltage Relay coil rating Model Applicable relay Relay output 8 points 24 VDC 24 VDC SRT1-ROC08 G6D-1A 16 points SRT2-ROC16 Power MOS FET l t t o e OS 8 points SRT1-ROF08 G3DZ-2R6PL relay output 16 points SRT2-ROF16 Note: For details about connections to the Master Unit, refer to page 10. Specifications Ratings Relay Output Item SRT1-ROC08, SRT2-ROC16 Applicable relay G6D-1A (one for each output point) Rated load 3 A at 250 VAC, 3 A at 30 VDC (resistive load) Rated carry current 3 A (see note 1) Max. contact voltage 250 VAC, 30 VDC Max. contact current 3 A Max. switching capacity 730 VA (AC), 90 W (DC) Min. permissible load (see note 2) 10 mA at 5 VDC Life expectancy Electrical: 100,000 operations min. (rated load, at 1,800 operations/h) Mechanical: 20,000,000 operations min. (at 18,000 operations/h) Note: 1. The maximum permissible current of COM0 to COM7 is 3 A. 2. This value fulfills the P reference value of opening/closing at a rate of 120 times per min (ambient operating environment and determination criteria according to JIS C5442). Power MOS FET Relay Output Item SRT1-ROF08, SRT2-ROF16 Applicable relay G3DZ-2R6PL (one for each output point) Load voltage 3 to 264 VAC, 3 to 125 VDC Load current 100 mA to 0.3 A Inrush current 6 A (10 ms) SRT-R SRT-R 37 Characteristics Power supply voltage 24 VDC +10%/–15% Current consumption (see note) 350 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Connecting Units 8-point Units: 16 per Master 16-point Units: 8 per Master Dielectric strength 2,000 VAC for 1 min (1-mA sensing current) between all output terminals and power supply, between communication terminals, and between contacts of different polarities 500 VAC for 1 min (1-mA sensing current) between all output terminals and power supply, between communication terminals, and between all power supply terminals and communications terminals Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 55 Hz, 0.75-mm double amplitude Shock resistance Malfunction: 100 m/s2 Destruction: 300 m/s2 Mounting strength No damage when 50 N pull load was applied for 10 s in all directions Terminal strength No damage when 50 N pull load was applied for 10 s Screw tightening torque 0.6 to 1.18 N 􀀀 m Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 8-point models: 145 g max., 16-point models: 240 g max. Approved standards UL 508, CSA C22.2 No. 14 Note: The above current consumption is a value with all the points turned ON including the current consumption of the G6D coil for the Remote Output Terminal. SRT-R SRT-R 38 Nomenclature SRT2-ROC16 SRT2-ROF16 SRT1-ROC08 SRT1-ROF08 Mounting Holes Output Terminals I/O Power Supply Terminals Connect 24-VDC power supply Communications Power Supply Terminals Connect 24-VDC power supply. CompoBus/S Terminals Connect the CompoBus/S communications cable. Mounting Holes DIP Switch Used for node number setting and holding or clearing outputs for communications error. Note: Always turn off the Unit before changing DIP switch settings. Mounting Holes Output Terminals I/O Power Supply Terminals Connect 24-VDC power supply Communications Power Supply Terminals Connect 24-VDC power supply. CompoBus/S Terminals Connect the CompoBus/S communications cable. Mounting Holes DIP Switch Used for node number setting and holding or clearing outputs for communications error. 0 to 15 ERR COMM PWR Output HOLD/CLEAR setting (Output model only) Baud rate setting Node address setting Indicators Indicator Display Color Meaning PWR Lit Green The communications power supply is ON. Not lit The communications power supply is OFF. COMM Lit Yellow Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Lit Red A communications error has occurred. Not lit Normal communications or the Unit is in standby status. 0 to 15 (see note) Lit Yellow The corresponding I/O signal is ON. Not lit The corresponding I/O signal is OFF. Note: The SRT1-RO08 does not have indicators 8 to 15. SRT-R SRT-R 39 Output HOLD/CLEAR Mode Mode Pin 1 Setting HOLD ON Output status is maintained when a communications error occurs. CLEAR OFF Output status is cleared when a communications error occurs. Note: 1. Pin 1 is factory-set to OFF. 2. This function is available to the Output Terminal only. Node Number Settings Node number Pin 3 Pin 4 Pin 5 Pin 6 8 4 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF ON 14 ON ON ON OFF 15 ON ON ON ON Note: 1. The node number is factory-set to 0. 2. For node number setting, refer to the CompoBus/S Operation Manual (W266). SRT-R SRT-R 40 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ROC08 SRT1-ROF08 Mounting Holes SRT2-ROC16 SRT2-ROF16 Mounting Holes 100 50 Two, 4.2 dia. or M4 Two, 4.2 dia. or M4 50 50 155 Thirty two, M3 Sixteen, M3 50 50 50 80 40 135 40 SRT-R SRT-R 41 Installation Internal Circuit Configuration SRT1-ROC08 SRT2-ROC16 Note: The G3DZ-2R6PL Power MOS FET Relay is inserted into this portion of the SRT1-ROF08 and SRT2-ROF16. Relay driver circuit Internal circuit Later blocks (See note) * Relay driver circuit Relay driver circuit Relay driver circuit External Connections Lamp Lamp Lamp Lamp Load power supply Terminal Arrangement and I/O Device Connection Example Output SRT2-ROC16 SRT2-ROF16 Note: 1. Dotted lines indicate internal connections. SRT1-ROC08 and SRT1-ROF08 have the 0 to 7 and COM0 to COM3 terminals only. 2. The above is a connection example of the SRT2-ROC16 with G6D Relays mounted. G3DZ Power MOS FET Relays are mounted to the SRT1-ROF08 and SRT2-ROF16. 24-VDC power supply Communications path Load Power supply Load Power supply Load Load Load Power supply Load Power supply Load Load Load Power supply Load Power supply Load Load Load Power supply Load Power supply Load Load *(see note 2) Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Refer to page 80 for details. 42 Connector Terminal SRT2-VID/VOD Compact Connector Terminals Save Wiring Effort and Enable Long-distance Communications Long-distance or high-speed communications mode is selectable. Incorporates I/O connectors making it possible to minimize the size. I/O connectors save wiring effort. Flexible DIN track mounting is possible through a DIN track attachment. Eight-point sensor connector models and 16-point MIL connector models are the same size. Features Vertical or horizontal DIN track mounting according to the available space is possible. Saves space and easily connects to other devices without wiring effort. Standard mounting (Sensor connector model) Mounting with DIN track attachment Standard mounting (MIL connector model) Communications and power supply connector DIN track G7TC Sensor connector Indicators Setting switch DIN track mounting hook MIL connector Ordering Information I/O classification Internal I/O circuit common I/O points I/O connection method Model Digital input NPN (+ common) 8 Sensor connector SRT2-VID08S PNP (– common) Se so co ec o SRT2-VID08S-1 Digital output NPN (– common) SRT2-VOD08S PNP (+ common) SRT2-VOD08S-1 Digital input NPN (+ common) 16 MIL connector SRT2-VID16ML PNP (– common) 6 co ec o SRT2-VID16ML-1 Digital output NPN (– common) SRT2-VOD16ML PNP (+ common) SRT2-VOD16ML-1 Mounting hook A SRT2-ATT01 Mounting hook B SRT2-ATT02 Note: For details about connecting the SRT2-VID or SRT2-VOD to the Master Unit, refer to page 10. SRT2-VID/VOD SRT2-VID/VOD 43 Specifications Ratings Inputs Item SRT2-VID08S SRT2-VID08S-1 SRT2-VID16ML SRT2-VID16ML-1 Input current 6 mA max./point at 24 V, 3 mA max./point at 17 V ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage 15 VDC min. (Between each input terminal and V: NPN. Between each input and G: PNP.) OFF voltage 5 VDC max. (Between each input terminal and V: NPN. Between each input and G: PNP.) OFF current 1 mA max. Insulation method Photocoupler Maximum number of inputs 8 12 Number of circuits 8 points/common, 1 circuit 16 points/common, 1 circuit Outputs Item SRT2-VID08S SRT2-VID08S-1 SRT2-VID16ML SRT2-VID16ML-1 Rated output current 0.3 A/point 0.3 A/point (2-A common) (See note.) Residual voltage 1.2 V max. ON delay time 0.5 ms max. OFF delay time 1.5 ms max. Leakage current 0.1 mA max. Insulation method Photocoupler Number of circuits 8 points/common, 1 circuit 16 points/common, 1 circuit Note: When using V/G terminals in an MIL connector, ensure that the current per terminal for the V/G terminals does not exceed 1 A. Characteristics Communications power supply voltage 14 to 26.4 VDC I/O power supply voltage 20.4 to 26.4 VDC (24 VDC +10%/–15%) I/O power supply current Sensor connector: 2.4 A max., MIL connector: 2.0 A max. Current consumption (see note) 50 mA max. at 24 VDC Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 (50 m/s2 for SRT2-ATT02) Shock resistance 200 m/s2 Dielectric strength 500 VAC (between insulated circuits) Ambient temperature Operating: –10°C to 55°C (with no icing or condensation) Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Storage: 25% to 85% Mounting strength No damage when 100 N pull load was applied in all directions (40 N load for SRT2-ATT02) Terminal strength No damage when the following loads were applied: Communications connector: 100 N Sensor connector: 40 N MIL connector: 100 N Screw tightening torque Communications connector: 0.25 N 􀀀 m Node address setting Settings made at DIP switch (set before supplying power for Slave communications) Weight Approx. 75 g max. Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal. SRT2-VID/VOD SRT2-VID/VOD 44 Nomenclature SRT2-VID08S/SRT2-VID08S-1 SRT2-VOD08S/SRT2-VOD08S-1 (Sensor Connector Models) SRT2-VID16ML/SRT2-VID16ML-1 SRT2-VOD16ML/SRT2-VOD16ML-1 (MIL Connector Models) Communications Connectors I/O Connectors Indicators DIP Switch Communications Connectors I/O Connectors Output HOLD/CLEAR Mode Setting Communications Mode Setting Node Address Setting Reserved for System Use (Always OFF) Indicators Indicator Color Display Meaning PWR Green Lit The communications power supply is ON. Not lit The communications power supply is OFF. COMM Yellow Lit Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Red Lit A communications error has occurred. Not lit Normal communications or the Unit is in standby status. 0 to 7 (for 8-point I/O) 0 to 15 (for 16-point I/O) Yellow Lit The corresponding I/O signal is ON. Not lit The corresponding I/O signal is OFF. Name Power Communications Communications error Input (output) Output HOLD/CLEAR Mode SW8 (HOLD) Setting OFF Output status is cleared. ON Output status is maintained. Communications Mode SW7 (HOLD) Setting OFF High-speed communications mode ON Long-distance communications mode Node Number Settings Node number Pin 4 Pin 3 Pin 2 Pin 1 8 4 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF OFF 14 ON ON ON OFF 15 ON ON ON ON Note: Be sure to perform settings with the Slave power supply OFF. SRT2-VID/VOD SRT2-VID/VOD 45 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT2-VID08S SRT2-VID08S-1 SRT2-VOD08S SRT2-VOD08S-1 SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD16ML SRT2-VOD16ML-1 SRT2-ATT01 SRT2-ATT02 Dimensions when Unit is mounted. SRT2-VID/VOD SRT2-VID/VOD 46 Installation Internal Circuit Configuration SRT2-VOD08S-1 SRT2-VID08S SRT2-VID08S-1 SRT2-VOD08S SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD16ML SRT2-VOD16ML-1 Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Photocoupler Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Internal circuit Voltage drop Voltage drop Voltage drop Voltage drop SRT2-VID/VOD SRT2-VID/VOD 47 Terminal Arrangement and I/O Device Connection Examples SRT2-VID08S SRT2-VID08S-1 SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD08S SRT2-VOD16ML SRT2-VOD08S-1 SRT2-VOD16ML-1 CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers CompoBus/S communications CompoBus/S communications power supply I/O power supply Pin numbers Sensor Brown (Red) Black (White) Blue (Black) Three-wired sensor Sensor Brown (White) Blue (Black) Two-wired sensor Sensor Three-wired sensor Sensor Two-wired sensor Sensor Three-wired sensor Sensor Two-wired sensor Sensor Three-wired sensor Sensor Two-wired sensor Output device Solenoid etc. Output device Valve etc. Output device Solenoid etc. Output device Valve etc. Output device Solenoid etc. Output device Valve etc. Output device Solenoid etc. Output device Valve etc. Brown (Red) Black (White) Blue (Black) Brown (White) Blue (Black) Brown (Red) Black (White) Blue (Black) Brown (White) Blue (Black) Brown (Red) Black (White) Blue (Black) Brown (White) Blue (Black) Note: 1. V terminals and G terminals are respectively connected internally. When supplying power for I/O from communications connectors, power can be supplied to the sensor output devices from V and G terminals. 2. When using an inductive load (solenoid, valve etc.), either use one with an internal reverse electromotive force absorption diode or attach a diode externally. SRT2-VID/VOD SRT2-VID/VOD 48 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Refer to page 80 for common precautions. Communications Connector Pin Arrangement 24-VDC communications power supply 24-VDC I/O power supply CompoBus/S communications The following solderless terminals are recommended. • Manufacturer: Weidmuller Sleeve (Part No. 046290) Solderless terminal Cable Two-wire insertion (Part No. 901851) Solderless terminal Cable The following product is a dedicated tool. • Manufacturer: Weidmuller PZ1.5 Crimper (Part No. 900599) Sensor Connector Pin Arrangement SRT2-VID08S/VID08S-1 SRT2-VOD08S/VOD08S-1 Model Cable conductor size XS8A-0441 0.3 to 0.5 mm2 XS8A-0442 0.14 to 0.2 mm2 Note: The XS8A-0441 or XS8A-0442 Connector is not provided with the SRT-VID or SRT2-VOD. Place an order for the connector separately. Calculate the cable conductor size as follows. The following information is given on each sensor cable: Cable dia. (Number of conductors/Conductor dia.) Conductor size (mm2) = (Conductor dia./2)2 x p x Number of conductors Example: E3S-A 4 dia. (18/0.12) Conductor size (mm2) = (0.12/2)2 x 3.14 x 18 􀀀 0.20 The conductor size is 0.2 mm2. Therefore, use the XS8A-0442. MIL Connector Pin Arrangement SRT2-VID16ML/VID16ML-1 Function Pin No. Pin No. OUT0 IN0 OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 G G V V 20 20 18 18 16 16 14 14 12 12 10 10 8 8 6 6 4 4 2 2 Function Function Pin No. Pin No. OUT8 IN8 OUT9 IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12 OUT13 IN13 OUT14 IN14 OUT15 IN15 G G V V 19 19 17 17 15 15 13 13 11 11 9 9 7 7 5 5 3 3 1 1 SRT2-VOD16ML/VOD16ML-1 Function Note: 1. No cable connector is provided. Order the connector separately. • Applicable Connector XG4M-2030-T • Applicable Connector Cables G79-O50C G79-O25C G79-I50C G79-I25C 2. Refer to the following table for ordering information on the applicable Cables. SRT2-VID/VOD SRT2-VID/VOD 49 Applicable Cables Connectable product Model Applicable Cable I/O Block G7TC-OC16 G7TC-OC08 G7TC-ID16-5 G7TC-IA16-5 G79-O50C (L = 500 mm) G7TC IA16 G7VC Series G70A Series G70D Series e G79-O25C (L = 250 mm) Connector-Terminal Conversion Unit XW2B Series Digital Display Unit M7F I/O Block G7TC-ID16 G7TC-IA16 e G79-I50C (L = 500 mm) G7TC-OC16-1 G79-I25C (L = 250 mm) 50 Sensor Terminal SRT1-D08S Connector Connection Models that Allows Easy Connection to Sensors and Output Devices Sensors with easy-to-wire connectors are easily attached or detached. Connects to 2-wired sensors. Remote teaching of the Sensor Terminal is possible with the PC by using output signals of the Sensor Terminal. DIN track mounting and screw mounting are available. Ordering Information Classification Internal I/O circuit common I/O points Model For input NPN (– common) 8 input points SRT1-ID08S For I/O NPN (– common) 4 input/4 output points SRT1-ND08S For output NPN (– common) 8 output points SRT1-OD08S Specifications Ratings Input Item SRT1-ID08S/-ND08S Input current 10 mA max./point ON delay time 1 ms max. OFF delay time 1.5 ms max. ON voltage 12 VDC min. between each input terminal and VCC, the external sensor power supply OFF voltage 4 VDC max. between each input terminal and VCC, the external sensor power supply OFF current 1 mA max. Insulation method Photocoupler Input indicator LED (yellow) Output Item SRT1-ND08S SRT1-OD08S Rated output current 20 mA/point 30 mA/point Residual voltage 1 V max. 0.6 V max. ON delay time 1 ms max. --- OFF delay time 1.5 ms max. --- Leakage current 0.1 mA max. Insulation method Photocoupler Output indicator LED (yellow) SRT1-D08S SRT1-D08S 51 Characteristics Communications power supply voltage (see note 1) 14 to 26.4 VDC Current consumption (see note 2) 50 mA max. at 24 VDC Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) Noise immunity Power supply normal: ±600 V for 10 minutes with a pulse width of 100 ns to 1 ms Power supply common: ±1,500 V for 10 minutes with a pulse width of 100 ns to 1 ms Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting method M4 screw mounting or 35-mm DIN track mounting Mounting strength No damage when 50 N pull load was applied for 10 s in all directions (except the DIN track directions and a pulling force of 10 N Terminal strength No damage when 50 N pull load was applied for 10 s in all directions Tighten each screw to a torque of 0.6 to 1.18 N 􀀀 m Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight SRT1-ID08S/OD08S: 100 g max., SRT1-ND08S: 80 g max. Note: 1. The communications power supply voltage must be 20.4 to 26.4 VDC if the Unit is connected to 2-wired proximity sensors. 2. The above current consumption is a value with all the points turned OFF excluding the current consumption of the sensor connected to the Sensor Terminal. External Sensor Power Supply Power supply voltage 13.5 to 26.4 VDC Current consumption 500 mA max. in total Nomenclature SRT1-ID08S SRT1-ND08S CompoBus/S Terminals Connect the CompoBus/S communications cable. Sensor Terminal I/O Connectors Connect the cables from the sensors here. I/O Indicators Indicate the status of each point. (Lit when the input or output is ON.) The SRT1-ID08S has 8 input indicators and the SRT1-ND08S has 4 input indicators and 4 output indicators. DIP Switch The DIP switch’s pins have the following functions: Pins 1 to 4: Node number setting Pin 5: Reserved (Always OFF.) Pin 6: Hold/clear outputs for communications error DIN Track Mounting Hook Used when mounting the Unit to a DIN track. CompoBus/S Indicators Indicate the operating status of the Slave and the status of communications. Mounting Screw Holes Used when screwing the Unit to a control panel. Indicators PWR COMM ERR IN0 to 3 IN0 to 7 OUT0 to 3 Communications Power Supply Terminals Connect the communications power supply. SRT1-D08S SRT1-D08S 52 Indicators Indicator Name Display Color Meaning PWR Power supply Lit Green The communications power supply is ON. Not lit The communications power supply is OFF. COMM Communication Lit Yellow Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Communication Lit Red A communications error has occurred. error Not lit Normal communications or the Unit is in standby status. 0 to 3 (4 inputs/outputs) Input Lit Yellow The corresponding input is ON. 0 to 7 (8 inputs) Not lit The corresponding input is OFF or the Unit is in standby status. 0 to 3 (4i t / t t ) o Output Lit Yellow The corresponding output is ON. 4 inputs/outputs) Not lit The corresponding output is OFF or the Unit is in standby status. Switch Setting All pins are factory-set to OFF. Hold/Clear outputs for Node number communications error settings Reserved (OFF) Pin 5 (Reserved) Always set pin 5 to OFF. Output HOLD/CLEAR Mode (SRT-ND16S) HOLD Function OFF Output status is cleared when a communications error occurs. ON Output status is maintained when a communications error occurs. Node Number Settings Node number 1 2 4 8 0 OFF OFF OFF OFF 1 ON OFF OFF OFF 2 OFF ON OFF OFF 3 ON ON OFF OFF 4 OFF OFF ON OFF 5 ON OFF ON OFF 6 OFF ON ON OFF 7 ON ON ON OFF 8 OFF OFF OFF ON 9 ON OFF OFF ON 10 OFF ON OFF ON 11 ON ON OFF ON 12 OFF OFF ON ON 13 ON OFF ON ON 14 OFF ON ON ON 15 ON ON ON ON SRT1-D08S SRT1-D08S 53 SRT1-OD08S DIP Switch Mounting Screw Holes Used when screwing the Unit to a control panel. CompoBus/S Indicators Indicate the operating status of the Slave and the status of communications. Output Indicators Indicate the output status of each channel. Communications Terminals Communications Power Supply Terminals Connect the communications cable. DIN Track Mounting Hook Used when mounting the Unit to a DIN track. Output Connectors Connect the cables from the output device. Switch Setting All pins are factory-set to OFF. Hold/Clear outputs for Node number communications error settings Reserved (OFF) Pin 5 (Reserved) Always set pin 5 to OFF. Output HOLD/CLEAR Mode (SRT-ND16S) HOLD Function OFF Output status is cleared when a communications error occurs. ON Output status is maintained when a communications error occurs. Node Number Settings Node number 4 3 2 1 0 OFF OFF OFF OFF 1 OFF OFF OFF ON 2 OFF OFF ON OFF 3 OFF OFF ON ON 4 OFF ON OFF OFF 5 OFF ON OFF ON 6 OFF ON ON OFF 7 OFF ON ON ON 8 ON OFF OFF OFF 9 ON OFF OFF ON 10 ON OFF ON OFF 11 ON OFF ON ON 12 ON ON OFF OFF 13 ON ON OFF ON 14 ON ON ON OFF 15 ON ON ON ON SRT1-D08S SRT1-D08S 54 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID08S Mounting Holes SRT1-ND08S Mounting Holes 100 Cover opening and closing directions Two, 4.2 dia or M4 Four, M3 50 50 70 max. Four, M3 Cover opening and closing directions Two, 4.2 dia or M4 (75) (75) SRT1-D08S SRT1-D08S 55 SRT1-OD08S 100 Cover opening and closing directions (75) 2.8 37 Two, 4.2 dia. or M4 7 Four, M3 50 40 92 40±0.2 92±0.2 Mounting Holes 4 6 Cable Connector for SRT1-OD08S Applicable conductor size (mm2) Model 0.3 to 0.5 XS8A-0441 0.14 to 0.2 XS8A-0442 0.3 to 0.5 XS8B-0443 XS8B-0443 (Relay Socket ) XS8A-044 (Cable Connector) Plug connector Cover Model number Pin number Check window Calculate the cable conductor size as explained below. The following information is given on each sensor cable: Cable dia. (Number of conductors/Conductor dia.) Conductor size (mm2) = (Conductor dia./2)2 x p x Number of conductors Example: E3S-A 4 dia. (18/0.12) Conductor size (mm2) = (0.12/2)2 x 3.14 x 18 􀀀 0.20 The conductor size is 0.2 mm2. Therefore, use the XS8A-0442. SRT1-D08S SRT1-D08S 56 Installation Internal Circuit Configuration SRT1-ID08S SRT1-ND08S Internal circuit Photocoupler Internal circuit Photocoupler Photocoupler SRT1-OD08S Internal circuit For one output External Connections SRT1-ID08S SRT1-ND08S Three-wired Sensor Two-wired Sensor Sensor with Teaching Function Sensor with External Diagnostic function Sensor with Bank-switching Function Three-wired Sensor Brown Black Blue Sensor Brown Blue Sensor Brown Black Pink Blue Sensor Brown Black Blue Sensor Two-wired Sensor Brown Blue Sensor SRT1-D08S SRT1-D08S 57 Terminal Arrangement and I/O Device Connection Example Input SRT1-ID08S I/O SRT1-ND08S Photoelectric Sensor Proximity Sensor (Sensor with Teaching Function, Sensor with External Diagnostic function, Sensor with Bank-switching Function) 24 VDC Communications power supply CompoBus/S communications CompoBus/S communications Communications power supply Blue Brown Blue Black Brown Photoelectric Sensor Proximity Sensor (3-wired Sensor) Proximity Sensor (2-wired Sensor) CompoBus/S communications Communications power supply CompoBus/S communications Communications power supply Brown Brown Blue 24 VDC Orange CompoBus/S CompoBus/S Output SRT1-OD08S CompoBus/S SOURCE 24 VDC BDL BDH – + CompoBus/S communications Communications power supply Output connector Pin number Solenoid, etc. Valve, etc. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. General Safety Precautions Installation Environment Do not install the Unit in the following places. • Places with water, oil, or chemical sprayed on the Unit. • Places with rapid temperature changes. • Places with high humidity resulting in condensation. • Places with intense electric and magnetic fields. • Places with excessive vibration or shock. Wiring To prevent inductive noise, do not wire power lines or high-tension lines along with or near the cables. Make sure that the polarity of each terminal is correct. Make sure that the communications path and power line are connected correctly. Secure the cables properly. Do not pull the cables with strong force, otherwise the cables may be disconnected from the terminals or connectors of the Unit. Do not touch the Unit when the Unit is used in places with high ambient temperatures because the surface temperature of the Unit may be high. Do not use paint thinner to clean the surface of the Unit, otherwise the surface will be damaged or discolored. SRT1-D08S SRT1-D08S 58 Correct Use Use the Unit under its rated conditions. Mount the Unit with M4 screws or to DIN tracks securely. Typical Causes of Communications Errors • The cables are not connected correctly. • The node number setting is incorrect. • The baud rate setting is incorrect. • There is a strong noise source, such as an inverter motor, near the Unit. Install the Unit as far as possible from the noise source or shield the noise source. Others Use OMRON’s XS8A-0441 or XS8A-0442 Connectors with the Unit. Insert each connector into the Unit until the connector snaps in place. Make sure that terminal number 1 of the connector is on the lock lever side when inserting the connector. Refer to the CompoBus/S Operation Manual (W266) for wiring the Unit. 59 Sensor Amplifier Terminal SRT1-D04S Snap On to Connect and Save Wiring Effort The 4-channel fiber photoelectric amplifiers in Terminals with connectors offer a low cost and space savings. The product lineup included Terminal Block Units for easy connection to sensors with amplifiers, limit switches, etc. Connect to up to eight channels of sensors by using Expansion Blocks. Features Low Cost and Space Savings with Four-channel Fiber Connectors Just Snap On to Connect Connector Units Fiber connector (1 channel) Fiber connector (4 channels) Terminal Block Unit Photoelectric sensor Various input units can be connected. Proximity sensor Basic switch and limit switch SRT1-D04S SRT1-D04S 60 Ordering Information CompoBus/S Sensor Amplifier Terminals Classification I/O points Model Communications 4 SRT1-TID04S SRT1-TKD04S Expansion SRT1-XID04S SRT1-XKD04S Connector Units Classification Specifications Model E3X-N Connector Type General-purpose, 1 channel E3X-NT16 Multi-functional, 1 channel E3X-NT26 Long distance, high accuracy, 1 channel E3X-NH16 Multi-functional, 4 channels E3X-NM16 Terminal Block Unit One input point E39-JID01 SRT1-D04S SRT1-D04S 61 Specifications Characteristics CompoBus/S Sensor Amplifier Terminals Item Communication Terminals Expansion Terminals Model SRT1-TID04S SRT1-TKD04S SRT1-XID04S SRT1-XKD04S Communications power supply voltage 14 to 26.4 VDC (See note 1) --- --- I/O points 4 input points Connected sensors Total of four E3X-NT6 or E39-JID01 (See note 2) One E3X-NM16 (See note 2) Total of four E3X-NT6 or E39-JID01 One E3X-NM16 Current consumption 60 mA max. (See note 3) 10 mA max. (See note 3) Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) Noise immunity Power supply normal: ±600 V for 10 minutes with a pulse width of 100 ns to 1 ms Power supply common: ±1,500 V for 10 minutes with a pulse width of 100 ns to 1 ms Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting method M4 screw mounting or 35-mm DIN track mounting Mounting strength No damage when 50 N pull load was applied for 10 s in all directions (except the DIN track directions and a pulling force of 10 N Terminal strength No damage when 49 N pull load was applied for 10 s in all directions. Tighten each screw to a torque of 0.6 to 1.18 N 􀀀 m. Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 70 g max. 65 g max. 45 g max. 35 g max. Note: 1. The communications power supply voltage must be 20.4 to 26.4 VDC if the Terminal is connected to 2-wired proximity sensors. 2. When adding Connector Units, use SRT1-XID04S or SRT1-XKD04S. 3. The value doesn’t include the current consumption of Connector Units. With E3X-N Connectors Model E3X-NH16 E3X-NT16 E3X-NT26 E3X-NM16 Current consumption 75 mA max. 50 mA max. 150 mA Response time 1 ms max. (4.0 ms max. when connected to the SRM1-D04S) 500 mS max. (2.0 ms max. when connected to the SRT1-D04S) Timer function Not available OFF-delay timer (fixed to 40 ms) Remote teaching input Not available Available (Remote teaching disabled) Indicator Orange LED: Lit during output operation Green LED: Lit with stable light reception or no light Teaching confirmation function Indicators (red/green LED) and buzzer Output Light ON and Dark ON switch selectable Ambient illumination Sunlight: 10,000 lux max.; incandescent lamp: 3,000 lux max. Insulation resistance 20 MW max. (at 500 VDC) Dielectric strength 1,000 VAC at 50/60 Hz for 1 min Vibration resistance Destruction:10 to 55 Hz, 1.5-mm double amplitude Shock resistance Destruction:500 m/s2 Mounting method Connector connection to the SRT1-D04S Mounting strength No damage when 49 N pull load was applied for 10 s in all directions Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 30 g max. 30 g max. 30 g max. 60 g max. SRT1-D04S SRT1-D04S 62 Terminal Block Units Model E39-JID01 Input current 10 mA max. ON voltage 12 VDC min. between input terminal and external sensor power supply OFF voltage 4 VDC max. between input terminal and external sensor power supply OFF current 1 mA max. ON delay time 1 ms max. (connected to SRT1-D04S) OFF delay time 1.5 ms max. (connected to SRT1-D04S) Input indicators LED (Orange) External sensor current capacity 50 mA max. Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude Shock resistance Malfunction: 200 m/s2 Destruction: 300 m/s2 Mounting method M4 screws or 35-mm DIN track mounting Mounting strength No damage when 50 N pull load was applied for 10 s in all directions (except the DIN track directions and a pulling force of 10 N Terminal strength No damage when 49 N pull load was applied for 10 s in all directions. Tighten each screw to a torque of 0.6 to 1.18 N 􀀀 m. Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 25 g max. SRT1-D04S SRT1-D04S 63 Nomenclature SRT1-TID04S SRT1-TKD04S Mounting Screw Holes Communications Terminals Communications Power Supply Terminals Contact 0 Contact 1 Contact 2 Contact 3 DIN Track Mounting Hook Node Number Settings Refer to the CompoBus/S Operation Manual (W266) for details on DIP switch settings. Mounting Screw Holes DIN Track Mounting Hook Contacts 0 to 3 Communications Power Supply Terminals Connect a 24-VDC power supply. Communications Terminals Connect a communications cable. DIP Switch Indicators Indicator Name Display Color Meaning PWR Power supply Lit Green The communications power supply is ON. Not lit G ee The communications power supply is OFF. COMM Communications Lit Yellow Normal communications. Not lit e o A communications error has occurred or the Unit is in standby status. ERR Communications Lit Red A communications error has occurred. error Not lit ed Normal communications or the Unit is in standby status. SRT1-D04S SRT1-D04S 64 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-TID04 Two, 4.2 dia. or M4 Two, 4.5 dia. Mounting Holes (75) 3.4 Two, 4.2 dia. or M4 Two, 4.5 dia. SRT1-XID04S Mounting Holes (75) 3.4 SRT1-D04S SRT1-D04S 65 SRT1-TKD04S Two, 4.2 dia. or M4 Two, 4.5 dia. Mounting Holes (75) 3.4 SRT1-XKD04S Two, 4.2 dia. or M4 Two, 4.5 dia. Mounting Holes (75) 3.4 SRT1-D04S SRT1-D04S 66 E3X-NM16 Output indicator Stability indicator Eight, 2.4 dia. E3X-NT6 Output indicator Stability indicator Two, 2.4 dia. SRT1-D04S SRT1-D04S 67 E3X-NH16 Light level indicators Threshold indicators Output indicator Two, 2.4 dia. E39-JID01 Output indicator Installation Internal Circuit Configuration E39-JID01 Internal circuit SRT1-D04S SRT1-D04S 68 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Terminal. Refer to page 80 for precautions common to all SRT1 Terminals. General Safety Precautions Connector Units Use only the Connector Units listed in this data sheet for the Sensor Amplifier Units. E39-JID01 Terminal Block Unit Do not apply any voltage to the Terminal Block Unit. Correct Use Expanding Sensor Amplifier Terminals 1. Remove the cover from the side of the SRT1-TD04S. (See Figure 1.) 2. When the cover is removed, you can see the expansion connector inside. 3. Connect this expansion connector to the connector located on the side of the SRT1-XD04S. (See Figure 2.) Figure 1 Cover Figure 2 Connector Attaching and Removing Connector Units (SRT1-TID04S, SRT1-XID04S, E3X-NT6, E39-JID01) Attaching Connector Units 1. Hook Section A of the Connector Unit onto Section B of the Sensor Amplifier Terminal. 2. Push in the Connector Unit until Section C locks inside Section D of the Sensor Amplifier Terminal. Section C Section D Section A Section B Bottom View Section A Removing Connector Units 1. While pushing Section D, pull the Connector Unit in direction E. 2. When Section D releases from the lock, the Connector Unit can be removed. Push here Section D SRT1-D04S SRT1-D04S 69 Attaching or Removing Connector Unit (SRT1-TKD04S, SRT1-XKD04S, E3X-NM16) Attaching Connector Unit 1. Hook Section A of the Connector Unit onto Section B of the Sensor Amplifier Terminal. 2. Push in the Connector Unit until Section C locks inside Section D of the Sensor Amplifier Terminal. Bottom View Section A Section C Section D Section A Section B Removing Connector Unit 1. While pushing Section D, pull the Connector Unit in direction E. 2. When Section D releases from the lock, the Connector Unit can be removed. Push here Section D Channel Numbers Channel numbers 1 to 4 of the E3X-NM16 correspond to contact numbers 0 to 3 of the SRT1-TKD04S, and to contact numbers 4 to 7 of the SRT1-XKD04S. 70 Analog Input Terminal SRT2-AD04 Compact Analog Input Model is the Same Shape as 16-point Remote I/O Terminals Allows flexible input point settings up to a maximum of four points. Resolution: 1/6,000 Takes only 1 ms to exchange each input point. Wide input ranges available. 105 x 48 x 50 (W x H x D) Ordering Information Classification I/O points Model Analog Input Terminal 1 to 4 (selectable with DIP switch) SRT2-AD04 Note: For details about connecting the SRT2-AD04 to the Master Unit. Refer to page 10. Specifications Ratings Input Item Voltage input Current input Max. signal input ±15 V ±30 mA Input impedance 1 MW max. Approx. 250 W Resolution 1/6,000 (FS) Total 25°C ±0.3% FS ±0.4% FS accuracy –10 to 55°C ±0.6% FS ±0.8% FS Conversion time 4 ms/4 points, 3 ms/3 points, 2 ms/2 points, and 1 ms/1 point Dielectric strength 500 VAC for 1 min between communications power supply, analog input, and communications terminals (see note) Note: There is no insulation between analog inputs. Characteristics Communications power supply voltage 14 to 26.4 VDC (possible to provide through dedicated flat cable) Current consumption 100 mA max. Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC (between insulated circuits) Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 Shock resistance 200 m/s2 Mounting strength No damage with 100 N pull load applied in all directions. Terminal strength No damage with 100 N pull load applied Screw tightening torque 0.3 to 0.5 N 􀀀 m Ambient temperature Operating: –10°C to 55°C Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Weight Approx. 120 g SRT2-AD04 SRT2-AD04 71 Nomenclature SRT2-AD04 Mounting Screw Holes DIN Track Mounting Hook Terminal Block Indicators Indicators Indicator Name Color Display Meaning PWR Power supply Green Lit The communications power supply is ON. Not lit The communications power supply is OFF. COMM Communication Yellow Lit Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Communication Red Lit A communications error has occurred. error Not lit Normal communications or the Unit is in standby status. U.ERR Unit error Red Lit An error has occurred in the Unit. Not lit Normal communications or the Unit is in standby status. DIP Switch (SW101) (Open cover to access.) Pin 1 Pin 2 Input points OFF OFF 4 points (default setting) OFF ON 3 points (inputs 0 to 2 enabled) ON OFF 2 points (inputs 0 and 2 enabled) ON ON 1 point (input 0 enabled) Pin 3 Communications mode OFF High-speed communications (default setting) ON Long-distance communications Pin 4 Be sure to turn OFF. Pin No. Node address Pin 5 23 Pin 6 22 Pin 7 21 Pin 8 20 The default setting is for all of these pins to be OFF. DIP Switch (SW102) (Open cover to access.) Pin 1 Pin 2 Pin 3 Range for inputs 0, 1 Pin 4 Pin 5 Pin 6 Range for inputs 2, 3 OFF OFF OFF 0 to 5 (V) (default setting) ON OFF OFF 1 to 5 (V) OFF ON OFF 0 to 10 (V) ON ON OFF –10 to 10 (V) OFF OFF ON 4 to 20 (mA) ON OFF ON 0 to 20 (mA) Do not make any settings other than the ones listed above. Pin 7 Mean value processing OFF Without mean value processing (default setting) ON With mean value processing (mean for 8 operations) Pin 8 Be sure to turn OFF. SRT2-AD04 SRT2-AD04 72 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT2-AD04 Mounting Holes Two, 4.2 dia. or M4 Installation Internal Circuit Configuration SRT2-AD04 Isolation DC-DC static converter Internal circuit Input 0 Input 1 Input 2 Input 3 Analog ground Terminal Arrangement SRT2-AD04 Note: When the input is current input, short-circuit the “V+” terminals and the “I+” terminals. When short-circuiting, use the short-circuiting tool provided as an accessory. Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. For details about general precautions, refer to page 80. Connections to the Master Unit Connections cannot be made to the following Master Units. If the following Master Units are connected, incorrect data may be transferred. C200HW-SRM21 (-V1 and later versions supported) CQM1-SRM21 (-V1 and later versions supported) SRM1-C0, SRM1-C0-V1 (-V2 and later versions supported) C200PC-ISA2-SRM 3G8B3-SRM0 SDD-CS1 (made by NKE Ltd.) 73 Analog Output Terminal SRT2-DA02 Compact Analog Output Model is the Same Shape as 16-point Remote I/O Terminals Two output points or 1 output point is selectable. Resolution: 1/6,000 105 x 48 x 50 (W x H x D) Ordering Information Classification I/O points Model Analog Output Terminal 1 or 2 (selectable with DIP switch) SRT2-DA02 Note: For details about connecting the SRT2-DA02 to the Master Unit, refer to page 10. Specifications Ratings Output Item Voltage output Current output External output permissible load resistance 5 kW min. 600 W max. Output impedance 0.5 W max. --- Resolution 1/6,000 (FS) Total 25°C ±0.4% FS accuracy –10 to 55°C ±0.8% FS Conversion time 2 ms/2 points and 2 ms/1 point Dielectric strength 500 VAC for 1 min between communications power supply, analog output, and communications terminals (see note) Note: There is no insulation between analog outputs. Characteristics Communications power supply voltage 14 to 26.4 VDC (power supply possible from dedicated flat cable) Current consumption (see note) 170 mA max. Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Dielectric strength 500 VAC (between insulated circuits) Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines) Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 Shock resistance 200 m/s2 Mounting strength No damage when 100 N pull load was applied in all directions Terminal strength No damage when 100 N pull load was applied Screw tightening torque 0.3 to 0.5 N 􀀀 m Ambient temperature Operating: –10°C to 55°C Storage: –25°C to 65°C Ambient humidity Operating: 25% to 85% (with no condensation) Weight Approx. 100 g Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external load. SRT2-DA02 SRT2-DA02 74 Nomenclature SRT2-DA02 Mounting Screw Holes DIN Track Mounting Hook Terminal Block Indicators Indicators Indicator Name Color Display Meaning PWR Power supply Green Lit The communications power supply is ON. Not lit The communications power supply is OFF. COMM Communication Yellow Lit Normal communications Not lit A communications error has occurred or the Unit is in standby status. ERR Communication Red Lit A communications error has occurred. error Not lit Normal communications or the Unit is in standby status. U.ERR Unit error Red Lit An error has occurred in the Unit. Not lit A communications error has occurred or the Unit is in standby status. DIP Switch (SW101) (Open cover to access.) Pin 1 Be sure to turn OFF. Pin 2 Output points OFF 2 points (default setting) ON 1 point (output 0 enabled) Pin 3 Communications mode OFF High-speed communications (default setting) ON Long-distance communications Pin 4 Be sure to turn OFF. Pin No. Node addresses Pin 5 23 Pin 6 22 Pin 7 21 Pin 8 20 The default setting is for all of these switches to be OFF. DIP Switch (SW102) (Open cover to access.) Pin 1 Pin 2 Pin 3 Range for output 0 Pin 4 Pin 5 Pin 6 Range for output 1 OFF OFF OFF 0 to 5 (V) (default setting) ON OFF OFF 1 to 5 (V) OFF ON OFF 0 to 10 (V) ON ON OFF –10 to 10 (V) OFF OFF ON 4 to 20 (mA) Do not make any settings other than the ones listed above. Pin 7 Pin 8 Output during communications error OFF OFF Clear at the output lower limit when communications error occurs. (default setting) OFF ON Clear at the output upper limit when communications error occurs. ON OFF Clear at the output lower limit when communications error occurs (however, if the range is –10 to 10 V, the output will be 0). ON ON Output held when communications error occurs. SRT2-DA02 SRT2-DA02 75 Dimensions Note: All units are in millimeters unless otherwise indicated. SRT2-DA02 Mounting Holes Two, 4.2 dia. or M4 Installation Internal Circuit Configuration SRT2-DA02 Isolation DC-DC static converter Internal circuit Output 0 Output 1 Analog ground Terminal Arrangement SRT2-DA02 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. For details about general precautions, refer to page 80. Connections to the Master Unit Connections cannot be made to the following Master Units. If the following Master Units are connected, incorrect data may be transferred. C200HW-SRM21 (-V1 and later versions supported) CQM1-SRM21 (-V1 and later versions supported) SRM1-C0, SRM1-C0-V1 (-V2 and later versions supported) C200PC-ISA2-SRM 3G8B3-SRM0 SDD-CS1 (made by NKE Ltd.) 76 Remote I/O Module SRT1-ID􀀀P/OD􀀀P Module Type that Allows PCB Mounting Compact size at 60 x 16 x 35 (W x H x D) Lineup now includes the 16-point input model and 16-point output model. Ordering Information I/O classification Internal I/O circuit common I/O points Rated voltage I/O rated voltage Model Input NPN (+ common) 16 24 VDC 24 VDC SRT1-ID16P Output NPN (– common) SRT1-OD16P Specifications Ratings Input (SRT1-ID16P) Input current 2 mA max./point ON delay time 1.5 ms max. OFF delay time 1.5 ms max. ON voltage 15 VDC min. between each input terminal and BS+ terminal OFF voltage 5 VDC max. between each input terminal and BS + terminal Output (SRT1-OD16P) Rated output current 0.2 A/point, 0.6 A/common Residual voltage 0.6 V max. between each output terminal and G terminal at 0.2 A Leakage current 0.1 mA max. between each output terminal and G terminal at 24 VDC SRT1-ID􀀀P/OD􀀀P SRT1-ID􀀀P/OD􀀀P 77 Characteristics Communications power supply voltage 20.4 to 26.4 VDC I/O power supply voltage 24 VDC +10%/–15% Current consumption (see note) 60 mA max. Connection method Multi-drop method and T-branch method Secondary branches cannot be connected to T-branch lines. Connecting Units 8 Input Terminals and 8 Output Terminals per Master Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits) 5-V output current 20 mA max. (5 V 􀀀 0.5 V) LED drive current (COMM, ERR) 10 mA max. (5 VDC) SW carry current (ADR0 to 3, HOLD) 1 mA max. Ambient temperature Operating: 0°C to 55°C (with no icing or condensation) Storage: –20°C to 65°C (with no icing or condensation) Ambient humidity Operating: 35% to 85% Weight 35 g max. Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected to the input model and the current consumption of the load connected to the output model. Dimensions Note: All units are in millimeters unless otherwise indicated. SRT1-ID16P SRT1-OD16P Incorrect insertion prevention pin PCB dimensions (top view) No cumulative tolerance allowed 16 2.54x15=38.1 27.94±0.1 2.54±0.1 2.54x15=38.1 8.95±0.1 1.53±0.1 0.63 27.94±0.1 1.6 1.6 dia. 0.63 3.5 2.54 35 60 2.2 dia. +0.1 0 32-0.9 dia. +0.1 0 SRT1-ID􀀀P/OD􀀀P SRT1-ID􀀀P/OD􀀀P 78 Installation Internal Circuit Configuration SRT1-ID16P SRT1-OD16P Internal circuit Internal circuit External Connections Communications Two-wired proximity sensor BS– or G Input Module (SRT1-ID16P) Output Module (SRT1-OD16P) Communications Relay Internal circuit Internal circuit D1: Reverse voltage prevention diode Note: NC in parentheses is for the Input Modules. Node Number Settings and Output HOLD/CLEAR Mode Internal circuit BS– or G Note: Refer to the CompoBus/S Operation Manual (W266) for details on the switch. Indicators R: LED current limiting resistor LED1: LED for COMM LED2: LED for ERR The maximum current for LED1 and 2 is 10 mA. Internal circuit The 5-V Output Terminals have positive power supplies (maximum output current of 20 mA) for the ERR and COMM LEDs. Recommended LED colors are red for ERR and yellow for COMM. SRT1-ID􀀀P/OD􀀀P SRT1-ID􀀀P/OD􀀀P 79 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Refer to page 80 for precautions common to all SRT1 Terminals. Correct Use Noise Protection Circuit Add the following protection circuit if noise is generated from the power supply, input section, or output section. Power Supply Noise Protection Circuit L: Coil for the common mode Install the coil near the SRT1. 50 V 100 mF 50 V 0.1 mF BS􀀀 L V BS Input Section Noise Protection Circuit C: 0.1 mF min. R: Resistor for limiting current to PC PC: Photocoupler Input device 0 to 15 V R G PC C Output Section Noise Protection Circuit V1 and V2: Power supply. R: Resistor for limiting current to PC PC: Photocoupler 0 to 15 Load G V2 PC R V1 5-V Output Terminals The 5-V Output Terminals have positive power supplies (maximum output current of 20 mA) for the ERR and COMM LED. Use them as shown below. Recommended LED colors are red for ERR and yellow for COMM. Wiring Method R: LED current limiting resistor LED1: LED for COMM LED2: LED for ERR The maximum current for the LED1 and 2 is 10 mA. LED1 R R 5 VOUT COMM ERR LED2 SRT SRT 80 Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Terminal. The following precautions are the same for all SRT1 Terminals. Refer also to the precautions specified for individual Terminals. General Safety Precautions Wiring Turn OFF the Unit before wiring the Unit and do not remove the terminal block cover or touch the terminal block while the Unit is turned ON, otherwise an electric shock may occur. Do not impose any voltage other than the rated voltage on the input terminal. Doing so may result in damage to the Unit or cause the Unit to malfunction. Relay I/O Type SRT1-ROC08 and SRT2-ROC16 Do not connect the Unit to loads operating at any voltage or consuming a total current exceeding the permissible switching voltage or current of the Unit. Doing so may result in the faulty insulation, contact weld, or faulty contact of the relays, or damage to the relays, or cause the relays to malfunction or burn. The life of a relay varies with the switching condition. Test the relays under the actual operating conditions before using the relays within the permissible switching frequency. The use of deteriorated relays may result in the faulty insulation of the relays or cause the relays to burn. Do not use the Unit in places with inflammable gas. Doing so may result in a fire or explosion due to the heat of the relays or a spark from the relays when they are switched. Transistor, Power MOS FET, and SSR I/O Types SRT1-OD04, SRT2-OD08, SRT2-OD16, SRT1-OD16P, SRT1-ROF08, and SRT2-ROF16 Do not connect the Unit to loads consuming a total current exceeding the rated output current of the Unit. Doing so may damage the output element and a short or open-circuit malfunction may result. If the Unit is connected to a DC inductive load, connect a diode to the Unit to protect the Unit from counter-electromotive voltage, otherwise the counter-electromotive voltage may damage the output element and a short or open-circuit malfunction may result. Correct Use Replacing Relays Use the relay removal tool to the left of the screw terminals to replace relays. Turn OFF the Unit to replace relays, otherwise an electric shock may occur or the Unit may malfunction. Installation Environment Do not install the Unit in the following places. Doing so may result in damage to the Unit or cause the Unit to malfunction. • Places with direct sunlight. • Places with ambient temperature ranges not within 0°C to 55°C. • Places with rapid temperature changes resulting in condensation or relative humidity ranges not within 10% to 90%. • Places with corrosive or inflammable gas. • Places with excessive dust, salinity, or metal powder. • Places with vibration or shock affecting the Unit. • Places with water, oil, or chemical sprayed on the Unit. Screw Tightening Torques Tighten all screws of the Unit properly, otherwise the Unit may malfunction. • Tighten each terminal screw to a torque of 0.6 to 1.18 N 􀀀 m (6.2 to 12.0 kgf 􀀀 cm). • Tighten each mounting screw to a torque of 0.6 to 0.98 N 􀀀 m (6.2 to 10.0 kgf 􀀀 cm). Terminal screws Mounting screws Cleaning Use alcohol or benzine to clean the surface of the Unit. Do not use paint thinner to clean the surface, otherwise the surface will be damaged or discolored. Handling Do not drop the Unit or shock or vibrate the Unit excessively. Doing so may result in damage to the Unit or cause the Unit to malfunction. Disassembling, Repairing, and Modifying Do not disassemble, repair, or modify the Unit, otherwise an electric shock may occur or the Unit may malfunction. 81 Position Driver FND-X􀀀-SRT Advanced Servodrivers with Positioner Functions DIO and CompoBus/S Models are Newly Added Servodriver and positioner are combined into one Unit. Conventional U-series, U-series UE type, H-series, and M-series AC Servomotors can be used. Feeder control/DTP control and single operation/ automatic incremental/continuous operation are available. Easy to set, operate, and adjust. Ordering Information Specifications Model CCoompooBuuss//SS mooddeelss For 200-VAC input 6 A FND-X06H-SRT 12 A FND-X12H-SRT 25 A FND-X25H-SRT 50 A FND-X50H-SRT For 100-VAC input 6 A FND-X06L-SRT 12 A FND-X12L-SRT Note: For details, refer to OMNUC FND-X-series User’s Manual (I524). Specifications General Specifications Ambient temperature Operating: 0°C to 55°C Storage: –10°C to 70°C Ambient humidity Operating: 35% to 90% (with no icing) Storage: 35% to 90% (with no icing) Operating atmosphere No corrosive gases Dielectric strength 1,500 VACRMS for 1 min at 50/60 Hz Insulation resistance 5 MW min. (at 500 VDC) between power input terminals and between the power terminal and the case Vibration resistance 10 to 150 Hz in X, Y, and Z directions with 0.10-mm single amplitude; acceleration: 9.8 m/s2 max.; time coefficient: 8 min; 4 sweeps Shock resistance 98 m/s2 max., three times each in X, Y, and Z directions Degree of protection Built into panel (IP00) FND-X􀀀-SRT FND-X􀀀-SRT 82 Performance Specifications Model (see note 1) Item FND-X06H-SRT FND-X12H-SRT FND-X25H-SRT FND-X06L-SRT FND-X12L-SRT Continuous output current (0-P) 2.0 A 4.8 A 8.0 A 2.0 A 3.0 A Momentary maximum output current (0-P) 6.0 A 12 A 25 A 6.0 A 12 A Input power supply Single-phase 200/240 VAC (170 to 264 V) 50/60 Hz Single-phase 100/115 VAC (85 to 127 V) 50/60 Hz Position/speed f db k os o /U Series (INC) Optical Incremental encoder, 2,048 pulses/revolution feedback U Series (ABS) Optical Absolute encoder, 1,024 pulses/revolution U-UE Series Optical Incremental encoder, 1,024 pulses/revolution H Series Magnetic Incremental encoder, 2,000 pulses/revolution M Series Resolver, absolute accuracy 0.18° max.; ambient temperature 25° Applicable load inertia U Series (INC) Maximum of 30 times motor’s rotor inertia Maximum of 20 times motor’s rotor inertia Maximum of 30 times motor’s rotor inertia U Series (ABS) Maximum of 20 times motor’s rotor inertia Maximum of 18 times motor’s rotor inertia Maximum of 20 times motor’s rotor inertia U-UE Series Maximum of 30 times motor’s rotor inertia Maximum of 20 times motor’s rotor inertia Maximum of 30 times motor’s rotor inertia H Series Maximum of 10 times motor’s rotor inertia M Series Maximum of 10 times motor’s rotor inertia Inverter method PWM method based on IGBT PWM frequency 10 kHz Weight Approx. 1.5 kg Approx. 2.5 kg Approx. 1.5 kg Frequency response (speed control) 100 Hz (at a load inertia equivalent to motor’s rotor inertia) Position loop gain 1 to 200 (rad/s) Feed forward 0% to 200% of speed reference Pulse rate 1/32,767 􀀀 (pulse rate 1 / pulse rate 2) 􀀀 32,767/1 Positioning completion width 1 to 32,767 (pulses) U Series (INC): 8,192 pulses/revolution; U Series (ABS): 4,096 pulses/revolution; M Series 24,000 pulses/revolution Acceleration/Deceleration time 0 to 9,999 (ms); acceleration and deceleration times set separately. Two types can be set for each. S-curve acceleration/deceleration function available (filter time constant: 0.00 to 32.76 s). Sequence input 19 pts. (limit inputs, origin proximity, RUN command, START, alarm reset, origin search, JOG operation, teaching, point selection, position data, deceleration stop) Photocoupler input: 24 VDC, 8 mA External power supply: 24 VDC ±1 V, 150 mA min. Sequence output 15 pts. (brake output, READY, origin search completion, origin, teaching, motor running, positioning completion, alarm, point output, position selection, speed selection) Open collector output: 24 VDC, 40 mA Monitor output (S t 2 ) o o ou pu Speed monitor 3 V/motor’s rated speed (output accuracy: approx. ±10%) See note 2.) Current monitor 3 V/motor’s maximum current (output accuracy: approx. ±10%) Regenerative absorption capacity 13 W + 17 J 24 W + 17 J 37 W + 22 J 13 W + 17 J 17 W + 17 J Protective functions Overcurrent, overvoltage, voltage drop, resolver disconnection, power status error, clock stopped, overcurrent (soft), speed amp saturation, motor overload, temporary overload, resolver error, speed over, error counter over, parameter setting error, software limit over, coordinate counter over, overrun, encoder disconnection, encoder communications error, absolute encoder backup error, absolute encoder checksum error, absolute encoder absolute error, absolute encoder over speed, encoder data not transmitted, BCD data error, present value undetermined, PTP data not set Note: 1. When using the 100-VAC-input Position Drivers in combination with the U-series or U-series UE type models, use 200-VAC Servomotors (-HA, -TA , or -H models). 2. For the monitor output, the monitor items and voltage polarity can be set by parameter UP-25 (monitor output selection). FND-X􀀀-SRT FND-X􀀀-SRT 83 Dimensions Note: All units are in millimeters unless otherwise indicated. 200-VAC FND-X06H-SRT/-X12H-SRT 100-VAC FND-X06L-SRT/-X12L-SRT 200-VAC FND-X25H-SRT 80 68 150 158 170 Three, 6 dia. 158 68 Three, M5 Mounting Holes Mounting Holes 119 150 107 158 170 Three, 6 dia. 158 Three, M5 107 Position Drivers Item Model Continuous output current (0-P) Momentary maximum output current (0-P) Input power supply Inverter method PWM frequency Weight 200-VAC input FND-X06H-SRT 2.0 A 6.0 A Single-phase 200/240 VAC PWM method b d 10 kH Approx. 1 5 k 00 C u FND-X12H-SRT 4.8 A 12 A S g e ase (170 to 264 V) e od based on IGBT 0 kHz o 1.5 kg FND-X25H-SRT 8.0 A 25 A 50/60 Hz Approx. 2.5 kg 100-VAC input FND-X06L-SRT 2.0 A 6.0 A Single-phase 100/115 VAC (85 Approx. 1.5 kg FND-X12L-SRT 3.0 A 12 A to 127 V) 50/60 Hz 84 Peripheral Devices Connectors, Cables, and Terminal-block Terminator Dedicated Flat Cable Allows Communication Path Extension and T-branching with Ease Ordering Information Product Appearance Model Specification Branch Connector SCN1-TH4 --- Extension Connector SCN1-TH4E --- Connector Terminator SCN1-TH4T --- Communications Cable SCA1-4F10 Flat cable, 100 m, 4 conductors (0.75 mm2 each) Terminal-block Terminator SRS1-T --- Note: Branch Connectors and Extension Connectors are sold in blocks of 10 Units. Peripheral Devices Peripheral Devices 85 Specifications Ratings/Characteristics Rated current 4 A Contact resistance 20 mW max. Insulation resistance 1,000 MW min. (at 500 VDC) Withstand voltage 1,000 VAC for 1 min, leakage current: 1 mA max. Cable pulling strength 50 N (5.1 kgf) min. Operating temperature –20°C to 70°C Materials Housing PA66 resin (UL94V-2) Branching and extension: Gray Cover Terminator: Black Contact Phosphor bronze and nickel base, tin plated Dimensions Note: All units are in millimeters unless otherwise indicated. SCN1-TH4 Branch Connector SCN1-TH4E Extension Connector SCN1-TH4T Connector Terminator Peripheral Devices Peripheral Devices 86 SRS1-T Terminal-block Terminator 40 Two, 4.4 dia. 30±0.2 Two, 4.2 dia. or M4 20 20 Mounting Holes Precautions Refer to the CompoBus/S Operation Manual (W266) before using the Unit. Correct Use The SCN1-TH4, SCN1-TH4E, and SCN1-TH4T are dedicated connectors for CompoBus/S. Always use dedicated CompoBus/S cables with these connectors. Do not locate the cables in places where excessive force may be imposed on the connectors of the cables such as an area where cables may entangle feet. These connectors cannot be reused once they have been attached to cables. Use new connectors if they were not attached to cables properly. Refer to the CompoBus/S Operation Manual (W266) to assemble the connectors. CompoBus/S CompoBus/S 87 Ordering Information Note: Abbreviations for standards: U: UL, C: CSA, CE: EC Directive Product Appearance Model Specifications Standards Master Control Units SRM1-C01-V2 Stand-alone model with built-in controller functions (without RS-232C) UL CSA CE (see SRM1-C02-V2 Stand-alone model with built-in controller functions and RS-232C note 2) Master Units C200HW-SRM21-V1 For C200HX (-ZE), C200HG (-ZE), C200HE (-ZE), and C200HS CQM1-SRM21-V1 For CQM1 SYSMAC Boards C200PC-ISA02-SRM C200PC-ISA12-SRM For C200HX/HG/HE --- I/O Link Unit CPM1A-SRT21 8 inputs 8 outputs UL CSA CE (see note 2) Remote Terminals (Transistor Models) SRT1-ID04 SRT1-ID04-1 SRT2-ID08 SRT2-ID08-1 SRT2-ID16 SRT2-ID16-1 SRT1-OD04 SRT1-OD04-1 SRT2-OD08 SRT2-OD08-1 SRT2-OD16 SRT2-OD16-1 4 transistor input (NPN) 4 transistor inputs (PNP) 8 transistor inputs (NPN) 8 transistor inputs (PNP) 16 transistor inputs (NPN) 16 transistor inputs (PNP) 4 transistor outputs (NPN) 4 transistor outputs (PNP) 8 transistor outputs (NPN) 8 transistor outputs (PNP) 16 transistor outputs (NPN) 16 transistor outputs (PNP) Remote Terminals (M3 Terminal Block Models) SRT1-ID16T SRT1-ID16T-1 SRT2-MD16T SRT2-MD16T-1 SRT2-OD16T SRT2-OD16T-1 16 transistor inputs (NPN) 16 transistor inputs (PNP) 16 transistor I/O points (NPN) 16 transistor I/O points (PNP) 16 transistor outputs (NPN) 16 transistor outputs (PNP) CE (see note 2) Remote Terminals (Relay-mounted Models) SRT2-ROC08 SRT2-ROC16 SRT2-ROF08 SRT2-ROF16 8 relay outputs 16 relay outputs 8 power MOS FET relay outputs 16 power MOS FET relay outputs UL CSA CE (see note 2) Connector Terminals SRT2-VID08S SRT2-VID08S-1 SRT2-VOD08S SRT2-VOD08S-1 SRT2-VID16ML SRT2-VID16ML-1 SRT2-VOD16ML SRT2-VOD16ML-1 SRT2-ATT01 SRT2-ATT02 8 transistor input (NPN) 8 transistor inputs (PNP) 8 transistor outputs (NPN) 8 transistor outputs (PNP) 16 transistor inputs (NPN) 16 transistor inputs (PNP) 16 transistor outputs (NPN) 16 transistor outputs (PNP) Mounting hook A Mounting hook B CE (see note 2) Sensor Terminals SRT1-ID08S SRT1-ND08S SRT1-OD08S 8 inputs (NPN) 4 automatic teaching points (NPN) 8 outputs --- CompoBus/S CompoBus/S 88 Product Standards Appearance Model Specifications Sensor Amplifier Terminals for CompoBus/S SRT1-TID04S SRT1-TKD04S SRT1-XID04S SRT1-XKD04S --- --- E3X-N Connector Type E3X-NH16 E3X-NT16 E3X-NT26 Long-distance, high-precision, 1 channel General-purpose, 1 channel Multi-functional, 1 channel E3X-NM16 Multi-functional, 4 channels Terminal Block Unit E39-JID01 One input point Analog Input Terminal SRT2-AD04 1 to 4 inputs (set with DIP switch) CE (see note 2) Analog Output Terminal SRT2-DA02 1 or 2 outputs (set with DIP switch) Remote I/O Modules SRT1-ID16P SRT1-OD16P --- --- Position Drivers FND-X06H-SRT 200-VAC input, momentary maximum output current: 6.0 A FND-X12H-SRT 200-VAC input, momentary maximum output current: 12 A FND-X25H-SRT 200-VAC input, momentary maximum output current: 25 A FND-X06L-SRT 100-VAC input, momentary maximum output current: 6.0 A FND-X12L-SRT 100-VAC input, momentary maximum output current: 12 A Branch Connector Extension Connector Connector Terminator SCN1-TH4 SCN1-TH4E SCN1-TH4T --- Flat Cable SCA1-4F10 100 m Terminal-block Terminator SRS1-T --- Note: 1. Refer to the C200HS Catalog (P32). Refer to the C200HX/C200HG/C200HE (-ZE) Catalog 2. Information on EC Directives Individual OMRON products that comply with EC Directives conform to the common emission standards of EMC Directives. However, the emission characteristics of these products installed on customers’ equipment may vary depending on the configuration, wiring, layout, and other conditions of the control panel used. For this reason, customers are requested to check whether the emission characteristics of the entire machine or equipment comply with the EMC Directives. CompoBus/S CompoBus/S 89 Model Number Legend SRT􀀀-􀀀􀀀􀀀􀀀􀀀 2 3 4 5 6 7 -1 1 1. Communications Mode 1: High-speed communications mode 2: High-speed/Long-distance communications mode 2. I/O Module Replacement None: Impossible R: Possible (Relays and power MOS FET relays) 3. I/O Specifications I: Input O: Output N: Input and output (with remote teaching) AD: Analog input DA: Analog output 4. I/O Voltage Specifications D: DC C: AC/DC (contact type) F: AC/DC (power MOS FET type) 5. I/O Points 04: 4 points 08: 8 points 16: 16 points 6. I/O Connection Method None: Screw terminals S: Connector P: PCB terminals 7. None: NPN -1: PNP CompoBus/S CompoBus/S 90 Notes: Cat. No. Q103-E1-6 Note: Specifications subject to change without notice. Printed in Japan 0200-8C (0796) a Authorized Distributor: OMRON Corporation Systems Components Division 66 Matsumoto Mishima-city, Shizuoka 411-8511 Japan Tel: (81)559-77-9633/Fax: (81)559-77-9097 Regional Headquarters OMRON EUROPE B.V. Wegalaan 67-69, NL-2132 JD Hoofddorp The Netherlands Tel: (31)2356-81-300/Fax: (31)2356-81-388 OMRON ELECTRONICS, INC. 1 East Commerce Drive, Schaumburg, IL 60173 U.S.A. Tel: (1)847-843-7900/Fax: (1)847-843-8568 OMRON ASIA PACIFIC PTE. LTD. 83 Clemenceau Avenue, #11-01, UE Square, Singapore 239920 Tel: (65)835-3011/Fax: (65)835-2711 The essential guide Harmony Control and Signalling units 2013 Control and signalling units Harmony, simple and innovative solutions for your applications World leader in control and signalling components, Schneider Electric continues its policy of innovation within the Harmony ranges in order to perfect the efficiency of your dialogue solutions. Invest with complete peace of mind! The right solution for your application An offer unrivalled in content and complementarity Optimised cost saving solutions due to increased flexibility of the offers, enabling multiple combinations and full compatibility Quality you can rely on Robust products that comply to the highest quality standards Valuable time that you save Simple selection and quick installation for all Harmony components This document is a selection of the top selling products. For more information: http://www.schneider-electric.com Contents Pushbuttons, switches, pilot lights and control stations Ø 16, plastic bezel, Harmony XB6 .......................................................................................... 2 to 4 Ø 8 and 12, pilot lights, Harmony XVL .......................................................................................... 5 Ø 22, metal bezel, Harmony XB4 / Control stations Harmony XAP ...................................... 6 to 9 Ø 22, plastic bezel, Harmony XB5 / Control stations Harmony XAL ................................. 10 to 13 Ø 22, plastic bezel, wireless and batteryless, Harmony XB5R ........................................... 14 to 15 Ø 22, plastic bezel - Monolithic, Harmony XB7 .................................................................. 16 to 17 Ø 30, metal and plastic bezel, Harmony 9001K, 9001SK .................................................. 18 to 20 Cam switches Harmony K series ............................................................................................................... 21 to 22 Signalling solutions Ø 40, 60, 100 mm monolithic tower lights, Harmony XVC ........................................................... 23 Ø 45 mm monolithic beacons and tower lights, accessories, Harmony XVDLS / XVC ............... 24 Ø 70 mm modular tower lights (IP 66), Harmony XVB ................................................................ 25 Ø 70 mm modular tower lights (up to IP 54), Harmony XVE ....................................................... 26 Ø 45, 50 mm modular tower lights (up to IP 54), Harmony XVM / XVP ...................................... 27 Modular tower lights accessories, Harmony XV .......................................................................... 28 Ø 84, 106, 120, 130 mm rotating mirror beacons, Harmony XVR ............................................... 29 Accessories for rotating mirror beacons, Harmony XVR ............................................................. 30 Electronic alarms and multisound sirens, Harmony XVS ............................................................ 30 Components for hoisting applications Pendant control stations, Harmony XAC ............................................................................ 31 to 32 Illuminated pushbuttons Type of head Flush push Shape of head rectangular (2) Degree of protection IP 65 / Nema 4, 4X, 13 / Class II Mounting (mm) panel cut-out Ø 16.2 mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head Connection (3) Tags for 2.8 x 0.5 Faston connectors or for soldering Type of push Spring return Complete products 12 … 24 V AC/DC Products for user assembly References white NO XB6DW1B1B ZB6Ep1B (1) ZB6Z1B ZB6DW1 NO + NC XB6DW1B5B ZB6Ep1B (1) ZB6Z5B ZB6DW1 green NO XB6DW3B1B ZB6Ep3B (1) ZB6Z1B ZB6DW3 NO + NC XB6DW3B5B ZB6Ep3B (1) ZB6Z5B ZB6DW3 red NC XB6DW4B2B ZB6Ep4B (1) ZB6Z2B ZB6DW4 NO + NC XB6DW4B5B ZB6Ep4B (1) ZB6Z5B ZB6DW4 yellow NO – ZB6Ep5B (1) ZB6Z1B ZB6DW5 NO + NC XB6DW5B5B ZB6Ep5B (1) ZB6Z5B ZB6DW5 Type of push Latching References white NO – ZB6Ep1B (1) ZB6Z1B ZB6DF1 NO + NC XB6DF1B5B ZB6Ep1B (1) ZB6Z5B ZB6DF1 green NO XB6DF3B1B ZB6Ep3B (1) ZB6Z1B ZB6DF3 NO + NC XB6DF3B5B ZB6Ep3B (1) ZB6Z5B ZB6DF3 red NC XB6DF4B2B ZB6Ep4B (1) ZB6Z2B ZB6DF4 NO + NC XB6DF4B5B ZB6Ep4B (1) ZB6Z5B ZB6DF4 yellow NO – ZB6Ep5B (1) ZB6Z1B ZB6DF5 NO + NC – ZB6Ep5B (1) ZB6Z5B ZB6DF5 Pilot lights Type of head Smooth lens cap Shape of head rectangular (2) Complete products Products for user assembly 12 … 24 V AC/DC References white XB6DV1BB ZB6Ep1B (1) ZB6DV1 green XB6DV3BB ZB6Ep3B (1) ZB6DV3 red XB6DV4BB ZB6Ep4B (1) ZB6DV4 yellow XB6DV5BB ZB6Ep5B (1) ZB6DV5 blue – ZB6Ep6B (1) ZB6DV6 (1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above. (2) For products with a square head, replace the letter D in the reference by the letter C (XB6DW1B1B becomes XB6CW1B1B). For products with a circular head, replace the letter D in the reference by the letter A (XB6DW1B1B becomes XB6AW1B1B). (3) Alternative connection: 1 x 0.5 pins for printed circuit boards. Pushbuttons, switches and pilot lights Ø 16 with plastic bezel Contact functions and light functions with integral LED (1): Voltage Letter (p) 12…24 V AC/DC (15 mA) B 48…120 V AC (25 mA) G 230…240 V AC (25 mA) M + 0.2 0 Harmony XB6 = + + = + Pushbuttons Type of head Flush push Shape of head rectangular (1) Degree of protection IP 65 / Nema 4, 4X, 13 / Class II Mounting (mm) panel cut-out Ø 16.2 mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head Connection (2) Tags for 2.8 x 0.5 Faston connectors or for soldering Type of push Spring return Complete products Products for user assembly References white NO XB6DA11B ZB6Z1B ZB6DA1 NO + NC XB6DA15B ZB6Z5B ZB6DA1 black NO – ZB6Z1B ZB6DA2 NO + NC XB6DA25B ZB6Z5B ZB6DA2 green NO XB6DA31B ZB6Z2B ZB6DA3 NO + NC XB6DA35B ZB6Z5B ZB6DA3 red NO – ZB6Z1B ZB6DA4 NO + NC XB6DA45B ZB6Z5B ZB6DA4 (1) For products with a square head, replace the letter D in the reference by the letter C (XB6DA11B becomes XB6CA11B). For products with a circular head, replace the letter D in the reference by the letter A (XB6DA11B becomes XB6AA11B). (2) Alternative connection: 1 x 0.5 pins for printed circuit boards. Ø 30 mushroom head Emergency stop pushbuttons (3) Type of head Trigger action (EN/ISO 13850) Shape of head cylindrical Type of push Turn to release Complete products Products for user assembly References red 2 NC + 1 NO XB6AS8349B ZB6E2B ZB6Z5B ZB6AS834 Type of push Key release, 200 References red 2 NC + 1 NO XB6AS9349B ZB6E2B ZB6Z5B ZB6AS934 (3) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. + 0.2 0 Contact functions = + = + + Selector switches and key switches Type of head Black handle Shape of head rectangular (2) Degree of protection IP 66 / Nema 4, 4X, 13 / Class II Mounting (mm) panel cut-out Ø 16.2 mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head Connection (3) Tags for 2.8 x 0.5 Faston connectors or for soldering Type of operator Black handle Complete products Products for user assembly Number and type of positions 2 positions 2 positions 2 positions stay put stay put spring return to centre References NO XB6DD221B ZB6Z1B ZB6DD22 ZB6Z1B ZB6DD24 NO + NC XB6DD225B ZB6Z5B ZB6DD22 ZB6Z5B ZB6DD24 Number and type of positions 3 positions 3 positions 3 positions stay put stay put spring return to centre References NO XB6DD235B ZB6Z5B ZB6DD23 ZB6Z5B ZB6DD25 Type of operator Key, n° 200 Complete products Products for user assembly Number and type of positions 2 positions 2 positions 2 positions stay put stay put spring return to centre References NO + NC XB6DGC5B ZB6Z5B ZB6DGC ZB6Z5B ZB6DGB Number and type of positions 3 positions 3 positions 3 positions stay put stay put spring return to centre References NO + NC XB6DGH5B ZB6Z5B ZB6DGH ZB6Z5B ZB6DGS Illuminated selector switches Type of operator Coloured handle Products for user assembly Number and type of positions 2 positions 3 positions stay put stay put References white NO + NC ZB6Ep1B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK1 green NO + NC ZB6Ep3B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK3 red NO + NC ZB6Ep4B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK4 (1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above. (2) For products with a square head, replace the letter D in the reference by the letter C (XB6DD221B becomes XB6CD221B). For products with a circular head, replace the letter D in the reference by the letter A (XB6DD221B becomes XB6AD221B). (3) Alternative connection: 1 x 0.5 pins for printed circuit boards. (1): Voltage Letter (p) 12…24 V AC/DC (15 mA) B 48…120 V AC (25 mA) G 230…240 V AC (25 mA) M + 0.2 0 Harmony XB6 60° 60° 45° 60° 60° 60° 60° 45° 45° 70° 70° 45° 70° 70° 70° 70° 45° 45° 60° 60° 60° Pushbuttons, switches and pilot lights Ø 16 with plastic bezel Contact functions and light functions with integral LED = + = + = + + LED pilot lights With black bezel With integral lens cap Type of head Protruding LED, Ø 8 mm Covered LED, Ø 8 mm Covered LED, Ø 12 mm Degree of protection IP 40, IP 65 with seal (2) Mounting (mm) panel cut-out Ø 8.2 mm Ø 8.2 mm Ø 12.2 mm mounting centres 12.5 x 12.5 mm 10.5 x 10.5 mm 16.5 x 16.5 mm Dimensions (mm) Ø x Depth (below head) Ø 12 x 32 Ø 10 x 34 Ø 16 x 45 Connection Tags (3) Tags (3) Threaded connectors References (1) green XVLA1p3 XVLA2p3 XVLA3p3 red XVLA1p4 XVLA2p4 XVLA3p4 yellow XVLA1p5 XVLA2p5 XVLA3p5 Tightening key For Ø 8 mm pilot lights For Ø 12 mm pilot lights References XVLX08 XVLX12 (1) Basic reference, to be completed by the number 1, 2, 3 or 4 indicating the required voltage. See voltage table above. (2) For an IP 65 degree of protection, include the seals: XVLZ911 for pilot lights XVLA1pp and XVLA2pp; XVLZ912 for pilot lights XVLA3pp. (3) Tags for 2.8 x 0.5 Faston connectors or for soldering. Sub-assemblies & accessories for Ø 16 plastic bezel control and signalling units Sub-assemblies Bodies for pushbuttons and selector switches Bodies for pilot lights Rated operational characteristics, AC-15: Ue = 240 V and Ie = 1.5 A or Ue = 120 V and Ie = 3 A Consumption Positive operation of contacts conforming to IEC/EN 60947-5-1: NC contacts with positive opening operation, 15 mA 12…24 V AC/DC positive opening force 20 N 25 mA 48…120 V AC 25 mA 230…240 V AC Type of Fixing collar Contacts Pilot light 12 … 24 V 48 … 120 V 230 … 240 V contact + contacts bodies References NO ZB6Z1B ZB6E1B White ZB6EB1B ZB6EG1B ZB6EM1B NC ZB6Z2B ZB6E2B Green ZB6EB3B ZB6EG3B ZB6EM3B 2 NO ZB6Z3B – Red ZB6EB4B ZB6EG4B ZB6EM4B 2 NC ZB6Z4B – Yellow ZB6EB5B ZB6EG5B ZB6EM5B NO + NC ZB6Z5B – Blue ZB6EB6B ZB6EG6B ZB6EM6B LED pilot lights Ø 8 and 12 (1): Voltage Number (p) 5 V (25 mA) 1 12 V (18 mA) 2 24 V (18 mA) 3 48 V (10 mA) 4 Accessories Legend holders 24 x 28 mm (8 x 21 mm legend) 24 x 36 mm (16 x 21 mm legend) Blank legend Background colour without legend yellow or white black or red without legend yellow or white black or red References (10)* ZB6YD20 ZB6YD21 ZB6YD22 ZB6YD30 ZB6YD31 ZB6YD32 Blank legends for legend holders 8 x 21 mm (24 x 28 mm legend holder) 16 x 21 mm (24 x 36 mm legend holder) Background colour – yellow or white black or red – yellow or white black or red References (20)* – ZB6Y1001 ZB6Y2001 – ZB6Y4001 ZB6Y3001 Ø 45 mm yellow legend for mushroom head Emergency stop pushbutton Marking Blank, for engraving EMERGENCY STOP ARRET D’URGENCE References ZB6Y7001 ZB6Y7330 ZB6Y7130 Body/fixing collar Plate Tightening tool Dismantling tool anti-rotation and slackening, for fixing nut for removal of contact blocks References ZB6Y009 (10)* ZB6Y003 (10)* ZB6Y905 (2)* ZB6Y018 (5)* Protective shutter for pushbuttons and switches Connector Blanking plug for rectangular heads for circular and square heads Faston, female IP 65 References ZB6YD001 ZB6YA001 ZB6Y004 (100)* ZB6Y005 (10)* * sold in lots of Harmony XVL Pushbuttons, spring return Type of head Chromium plated circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class I Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals Type of push Flush Flush, booted Unmarked Products Complete For user assembly Complete For user assembly References black NO XB4BA21 ZB4BZ101 ZB4BA2 XB4BP21 ZB4BZ101 ZB4BP2 green NO XB4BA31 ZB4BZ101 ZB4BA3 XB4BP31 ZB4BZ101 ZB4BP3 red NC XB4BA42 ZB4BZ102 ZB4BA4 XB4BP42 ZB4BZ102 ZB4BP4 yellow NO XB4BA51 ZB4BZ101 ZB4BA5 XB4BP51 ZB4BZ101 ZB4BP5 blue NO XB4BA61 ZB4BZ101 ZB4BA6 XB4BP61 ZB4BZ101 ZB4BP6 Type of push Flush With international marking Products Complete For user assembly References green NO XB4BA3311 ZB4BZ101 ZB4BA331 – – – red NC XB4BA4322 ZB4BZ102 ZB4BA432 – – – white NO XB4BA3341 ZB4BZ101 ZB4BA334 – – – black NO XB4BA3351 ZB4BZ101 ZB4BA335 _ _ _ Type of push Projecting Mushroom head, Ø 40 mm Unmarked Products Complete For user assembly Complete For user assembly References black NO – – – XB4BC21 ZB4BZ101 ZB4BC2 red NC XB4BL42 ZB4BZ102 ZB4BL4 – – – Type of push Double-headed pushbuttons Triple-headed pushbuttons Degree of protection IP 66 - IP 69K IP 66 - IP 69K With international marking Products Complete For user assembly Complete For user assembly (A) (B) References (A) NO + NC XB4BL73415 ZB4BZ105 ZB4BL7341 – – – (B) NO + NC + NO – – – XB4BA711237 ZB4BZ103 + ZBE102 ZB4BA71123 (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8). Ø 40 mm mushroom head Emergency stop pushbuttons (2) Trigger action (EN/ISO 13850) Type of push Push-pull NO + NC Unmarked Products Complete For user assembly References red NO + NC XB4BT845 ZB4BZ105 ZB4BT84 Type of push Turn to release NO + NC References red NO + NC XB4BS8445 ZB4BZ105 ZB4BS844 Type of push Key release NO + NC References red NO + NC XB4BS9445 ZB4BZ105 ZB4BS944 (2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. Harmony XB4 + 0.4 0 Pushbuttons, switches and pilot lights Ø 22 with metal bezel Contact functions + = + = + Contact functions Selector switches and key switches Type of head Chromium plated circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class I Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals Type of operator Key, n° 455 Products Complete For user assembly Complete For user assembly Number and type of positions (2) 2 positions 2 positions 2 positions 2 positions stay put stay put stay put stay put References black NO XB4BG21 ZB4BZ101 ZB4BG2 XB4BG41 ZB4BZ101 ZB4BG4 Number and type of positions 2 positions 2 positions 3 positions 3 positions spring return to left spring return to left stay put stay put References black NO XB4BG61 ZB4BZ101 ZB4BG6 – – – black NO + NO – – – XB4BG33 ZB4BZ103 ZB4BG3 + 0.4 0 Type of operator Handle Products Complete For user assembly Complete For user assembly Number and type of positions 2 positions 2 positions 2 positions 2 positions stay put stay put spring return to left spring return to left References black NO XB4BD21 ZB4BZ101 ZB4BD2 XB4BD41 ZB4BZ101 ZB4BD4 Number and type of positions 3 positions 3 positions 3 positions 3 positions stay put stay put spring return to centre spring return to centre References black NO + NO XB4BD33 ZB4BZ103 ZB4BD3 XB4BD53 ZB4BZ103 ZB4BD5 = + = + Type Double-headed pushbuttons with LED pilot light Illuminated selector switches (1 flush green push, 1 projecting red push) (2 position stay put) Degree of protection IP 66 - IP 69K IP 66 Light source Integral LED Integral LED Products Complete Complete Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 24 V AC/DC 110…120 V AC 230…240 V AC References green NO + NC – – – XB4BK123B5 XB4BK123G5 XB4BK123M5 red NO + NC – – – XB4BK124B5 XB4BK124G5 XB4BK124M5 orange NO + NC – – – XB4BK125B5 XB4BK125G5 XB4BK125M5 White NO + NC XB4BW73731B5 XB4BW73731G5 XB4BW73731M5 – – – (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal. Harmony XB4 Pushbuttons, switches and pilot lights Ø 22 with metal bezel Light functions Pilot lights Type of head Circular bezel Smooth lens cap Degree of protection IP 66 / Nema 4X, 13 / Class I Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth below head 43 Connection (1) Screw clamp terminals Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white XB4BVB1 XB4BVG1 XB4BVM1 XB4BV61 ZB4BV6 ZB4BV01 green XB4BVB3 XB4BVG3 XB4BVM3 XB4BV63 ZB4BV6 ZB4BV03 red XB4BVB4 XB4BVG4 XB4BVM4 XB4BV64 ZB4BV6 ZB4BV04 yellow XB4BVB5 XB4BVG5 XB4BVM5 XB4BV65 ZB4BV6 ZB4BV05 blue XB4BVB6 XB4BVG6 XB4BVM6 – – – + 0.4 0 Illuminated pushbuttons and selector switches Type Flush push, spring return, illuminated pushbuttons Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white NO + NC XB4BW31B5 XB4BW31G5 XB4BW31M5 XB4BW3165 ZB4BW065 ZB4BW31 green NO + NC XB4BW33B5 XB4BW33G5 XB4BW33M5 XB4BW3365 ZB4BW065 ZB4BW33 red NO + NC XB4BW34B5 XB4BW34G5 XB4BW34M5 XB4BW3465 ZB4BW065 ZB4BW34 orange NO + NC XB4BW35B5 XB4BW35G5 XB4BW35M5 XB4BW3565 ZB4BW065 ZB4BW35 blue NO + NC XB4BW36B5 XB4BW36G5 XB4BW36M5 – – – = + = + Separate components and accessories Electrical blocks (1) (2) Single contact blocks Light blocks with integral LED Light block, direct supply Rated operational characteristics AC-15, 240 V - 3 A Consumption 18 mA 24 V AC/DC Positive operation of contacts NC contacts with positive opening operation 14 mA 120 V AC conforming to IEC/EN 60947-5-1 14 mA 240 V AC Screw clamp terminal Spring clamp terminal To combine with heads for integral LED For BA 9s bulb (not included) 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References (5)* NC ZBE101 ZBE1015 white ZBVB1 ZBVG1 ZBVM1 ZBV6 NO ZBE102 ZBE1025 green ZBVB3 ZBVG3 ZBVM3 Colour provided by lens red ZBVB4 ZBVG4 ZBVM4 orange ZBVB5 ZBVG5 ZBVM5 blue ZBVB6 ZBVG6 ZBVM6 Diecast metal enclosures (Zinc alloy, usable depth 49 mm) 1 vertical row 2 vertical rows Number of cut-outs Front face dimensions 1 2 3 4 2 4 6 References 80 x 80 mm XAPM1201 – – – XAPM1202 – – 80 x 130 mm – XAPM2202 XAPM2203 – – XAPM2204 – 80 x 175 mm – – XAPM3203 XAPM3204 – – XAPM3206 Accessories (2) Legend holders, 30 x 40 mm, for 8 x 27 mm legends Marking Background colour: black or red white or yellow References (10)* Blank ZBY2101 ZBY4101 International 0 (red background) ZBY2931 I ZBY2147 AUTO ZBY2115 STOP ZBY2304 – English OFF ZBY2312 ON ZBY2311 START ZBY2303 – – French ARRET (red b/grnd) ZBY2104 ARRET-MARCHE ZBY2166 MARCHE ZBY2103 – – German AUS ZBY2204 AUS-EIN ZBY2266 EIN ZBY2203 – – Spanish PARADA (red b/grnd) ZBY2404 PARADA-MARCHA ZBY2466 MARCHA ZBY2403 – – Legend holders, 30 x 50 mm, for 18 x 27 mm legends Background colour black or red white or yellow References (10)* Blank ZBY6101 ZBY6102 Ø 60 mm legend for mushroom head Emergency stop pushbutton Background colour yellow Marking Blank EMERGENCY STOP ARRET D’URGENCE NOT HALT PARADA DE EMERGENCIA References ZBY9140 ZBY9330 ZBY9130 ZBY9230 ZBY9430 (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal. (2) Electrical blocks and accessories also for use with Harmony XB5 plastic range * sold in lots of Type of push Double-headed pushbuttons Triple-headed pushbuttons Degree of protection IP 66 - IP 69K IP 66 - IP 69K With international marking Products Complete (A) For user assembly Complete (B) For user assembly References (A) NO + NC XB5AL73415 ZB5AZ105 ZB5AL7341 – – – (B) NO + NC + NO – – – XB5AA711237 ZB5AZ103 + ZBE102 ZB5AA71123 (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8). Harmony XB5 Pushbuttons, switches and pilot lights Ø 22 with plastic bezel Contact functions Pushbuttons, spring return Type of head Circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class II Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals + 0.4 0 Type of push Flush Flush, booted Unmarked Products Complete For user assembly Complete For user assembly References black NO XB5AA21 ZB5AZ101 ZB5AA2 XB5AP21 ZB5AZ101 ZB5AP2 green NO XB5AA31 ZB5AZ101 ZB5AA3 XB5AP31 ZB5AZ101 ZB5AP3 red NC XB5AA42 ZB5AZ102 ZB5AA4 XB5AP42 ZB5AZ102 ZB5AP4 yellow NO XB5AA51 ZB5AZ101 ZB5AA5 XB5AP51 ZB5AZ101 ZB5AP5 blue NO XB5AA61 ZB5AZ101 ZB5AA6 XB5AP61 ZB5AZ101 ZB5AP6 Type of push Flush With international marking Products Complete For user assembly Complete For user assembly References green NO XB5AA3311 ZB5AZ101 ZB5AA331 – – – red NC XB5AA4322 ZB5AZ102 ZB5AA432 – – – white NO XB5AA3341 ZB5AZ101 ZB5AA334 – – – black NO XB5AA3351 ZB5AZ101 ZB5AA335 – – – Type of push Projecting Mushroom head, Ø 40 mm Unmarked Products Complete For user assembly Complete For user assembly References black NO – – – XB5AC21 ZB5AZ101 ZB5AC2 red NC XB5AL42 ZB5AZ102 ZB5AL4 – – – Ø 40 mm mushroom head Emergency stop pushbuttons (2) Trigger action (EN/ISO 13850) Type of push Push-pull NO + NC Unmarked Products Complete For user assembly References red NO + NC XB5AT845 ZB5AZ105 ZB5AT84 Type of push Turn to release NO + NC References red NO + NC XB5AS8445 ZB5AZ105 ZB5AS844 Type of push Key release NO + NC References red NO + NC XB5AS9445 ZB5AZ105 ZB5AS944 (2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850: to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. + = + = + 10 Contact functions Selector switches and key switches Type of head Circular bezel Degree of protection IP 66 / Nema 4X, 13 / Class II Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth (mm) below head 43 Connection (1) Screw clamp terminals Type of operator Handle Products Complete For user assembly Complete For user assembly Number and type of positions 2 positions 2 positions 2 positions 2 positions stay put stay put spring return to left spring return to left References black NO XB5AD21 ZB5AZ101 ZB5AD2 XB5AD41 ZB5AZ101 ZB5AD4 Number and type of positions 3 positions 3 positions 3 positions 3 positions stay put stay put spring return to centre spring return to centre References black NO + NO XB5AD33 ZB5AZ103 ZB5AD3 XB5AD53 ZB5AZ103 ZB5AD5 Type of operator Key, n° 455 Number and type of positions (2) 2 positions 2 positions 2 positions 2 positions stay put stay put stay put stay put References black NO XB5AG21 ZB5AZ101 ZB5AG2 XB5AG41 ZB5AZ101 ZB5AG4 (2) The symbol indicates key withdrawal position. + 0.4 0 = + 11 Harmony XB5 Pushbuttons, switches and pilot lights Ø 22 with plastic bezel Light functions Pilot lights Type of head Circular bezel Smooth lens cap Degree of protection IP 66 / Nema 4X, 13 / Class II Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended) mounting centres 30 (horizontal) x 40 (vertical) Depth below head 43 Connection (1) Screw clamp terminals Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white XB5AVB1 XB5AVG1 XB5AVM1 XB5AV61 ZB5AV6 ZB5AV01 green XB5AVB3 XB5AVG3 XB5AVM3 XB5AV63 ZB5AV6 ZB5AV03 red XB5AVB4 XB5AVG4 XB5AVM4 XB5AV64 ZB5AV6 ZB5AV04 orange XB5AVB5 XB5AVG5 XB5AVM5 XB5AV65 ZB5AV6 ZB5AV05 blue XB5AVB6 XB5AVG6 XB5AVM6 – – – Illuminated pushbuttons and selector switches Type Flush push, spring return, illuminated pushbuttons Light source Integral LED Direct supply for BA 9s bulb (not included) Products Complete Complete For user assembly Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max. References white NO + NC XB5AW31B5 XB5AW31G5 XB5AW31M5 XB5AW3165 ZB5AW065 ZB5AW31 green NO + NC XB5AW33B5 XB5AW33G5 XB5AW33M5 XB5AW3365 ZB5AW065 ZB5AW33 red NO + NC XB5AW34B5 XB5AW34G5 XB5AW34M5 XB5AW3465 ZB5AW065 ZB5AW34 orange NO + NC XB5AW35B5 XB5AW35G5 XB5AW35M5 XB5AW3565 ZB5AW065 ZB5AW35 blue NO + NC XB5AW36B5 XB5AW36G5 XB5AW36M5 – – – Type Double-headed pushbuttons with LED pilot light Illuminated selector switches (1 flush green push, 1 projecting red push) (2 position stay put) Degree of protection IP 66 - IP 69K IP 66 Light source Integral LED Integral LED Products Complete Complete Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 24 V AC/DC 110…120 V AC 230…240 V AC References green NO + NC – – – XB5AK123B5 XB5AK123G5 XB5AK123M5 red NO + NC – – – XB5AK124B5 XB5AK124G5 XB5AK124M5 orange NO + NC – – – XB5AK125B5 XB5AK125G5 XB5AK125M5 white NO + NC XB5AW73731B5 XB5AW73731G5 XB5AW73731M5 – – – (1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal. + 0.4 0 = + = + 12 Separate components and accessories: see page 9. Control stations For XB5 pushbuttons, switches and pilot lights Ø 22 with plastic bezel Harmony XAL (1) Empty enclosures: Basic reference: XALK0p, replace the p by the number of cut-outs required (see cut-out table above) (1): Number of cut-outs Number (p) 1 1 2 2 3 3 4 4 5 5 Complete stations with 1 pushbutton, selector switch or key switch (light grey RAL 7035 base with dark grey RAL 7016 lid) Degree of protection IP 65 / Nema 4X and 13 / Class II Dimensions (mm) W x H x D 68 x 68 x 113 max. (with key release Ø 40 mushroom head pushbutton) Fixing (mm) 2 x Ø 4.3 on 54 mm centres Function 1 Start or Stop function 1 Start-Stop function Marking On spring return push On legend holder and legend below head Number and type of pushbutton/selector switch/key switch 1 flush green p/b 1 flush red p/b 1 projecting red p/b 1 2 position stay put selector switch or key switch Black handle Key n° 455 (key withdrawal LH pos.) References NO I XALD102 – – – – Start XALD103 – – – – O - I – – – XALD134 XALD144 O – XALD112 XALD115 – – Function Emergency stop (2) (light grey RAL 7035 base with yellow RAL 1012 lid) Number and type of mushroom head pushbutton 1 red Ø 40 head, turn to release 1 red Ø 40 head, key release Latching mechanism Trigger action (EN/ISO 13850) Trigger action (EN/ISO 13850) References NC XALK178 XALK188 NC + NC XALK178F XALK188F NO + NC XALK178E XALK188E NC + NC + NO XALK178G XALK188G (2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. (1) Empty enclosures: Basic reference: XALD0p, replace the p by the number of cut-outs required (see cut-out table above) Complete stations with 2 and 3 pushbuttons or 2 pushbuttons + 1 pilot light (light grey RAL 7035 base with dark grey RAL 7016 lid) Dimensions (mm) W x H x D 2-way control stations: 68 x 106 x 62; 3-way control stations: 68 x 136 x 87 Fixing (mm) 2-way control stations: 2 x Ø 4.3 on 54 x 68 centres; 3-way control stations: 2 x Ø 4.3 on 54 x 98 centres Function Start-Stop functions 2 functions 3 functions Marking On spring return push Number and type of pushbutton/pilot light 1 flush green p/b 1 flush green pushbutton 1 flush white p/b 1 flush white p/b 1 flush white p/b 1 flush red p/b 1 flush red pushbutton 1 flush black p/b 1 flush red p/b 1 Ø 30 red mush- 1 red pilot light with integral LED 1 flush black p/b room head p/b 1 flush black p/b 24 V AC/DC 230 V AC References NO + NC I - O XALD213 XALD363B XALD363M – – – Start - Stop XALD215 – – – – – NO + NO – – – XALD222 – – NO + NC + NO – – – – XALD324 XALD328 Accessories Standard contact blocks Light blocks with integral LED, colour red Description NO contact NC contact 24 V AC/DC 230 V AC References ZENL1111 ZENL1121 ZALVB4 ZALVM4 13 Harmony XB5R Wireless and batteryless pushbuttons Packages and components Ready to use packs Panel mounting Mobile application Wireless and batteryless 22mm pushbutton assembled on fixing collar Plastic head Metal head Plastic head Metal head Plastic head in handy box Caps 1 black cap 1 set of 10 different coloured caps 1 black cap 1 set of 10 different coloured caps Receiver Non configurable Configurable functions: monostable, bistable, stop/start Non configurable Configurable functions: monostable, bistable, stop/start Relay output 1relay output type RT 3A 2 relays output type RT 3A 1relay output type RT 3A 2 relays output type RT 3A Voltage receiver 24 VDC 24….240 AC/DC 24 VDC 24….240 AC/DC References XB5RFB01 XB4RFB01 XB5RFA02 XB4RFA02 XB5RMB03 XB5RMA04 The pushbutton and receiver are factory paired Transmitter components for wireless and batteryless pushbuttons Plastic mushroom head Plastic head Metal head Wireless and batteryless pushbuttons including - a transmitter fitted with fixing collar - a spring return pushbutton head with clipped-in cap Reference Cap colour White – ZB5RTA1 ZB4RTA1 Black – ZB5RTA2 ZB4RTA2 Green – ZB5RTA3 ZB4RTA3 White I on green background – ZB5RTA331 ZB4RTA331 Red – ZB5RTA4 ZB4RTA4 White O on red background – ZB5RTA432 ZB4RTA432 Yellow – ZB5RTA5 ZB4RTA5 Blue – ZB5RTA6 ZB4RTA6 Black ZB5RTC2 – – Transmitter components for wireless and batteryless rope pull switch Rope pull switch with wireless and batteryless transmitter Reference ZBRP1 14 Components and accessories Configurable receivers Description - 2 buttons (learn, parameter setting) - 6 indicating LEDs (power ON, outputs, signal strenght) Output function Monostable Monostable, bistable Monostable, bistable, stop/start Output type 4 PNP outputs 200 mA / 24V 2 relay outputs type RT 3A Receiver voltage 24 VDC 24….240 AC/DC References ZBRRC ZBRRD ZBRRA Configurable access point (1) Description - 7-segment display - jog dial - 8 indicating LEDs (power ON, functions mode, communication status, signal strength) - external antenna connector and protective plug Output function Monostable Output type 2 RS485 for Modbus RS485 serial line 1 slot for communication module ZBRCETH Receiver voltage 24….240 AC/DC References ZBRN2 ZBRN1 (1) Available 1st quarter 2013. Complementary accessories Relay antennas Communication module Plastic empty boxes Description 1 power-ON LED 2 LEDs reception / transmission 1 RF connector Modbus/TCP protocol 2 RJ45 connectors Handy, 1 cut-out 1 cut-out 2 cut-outs Cable lenght 5m 2m Voltage 24….240 AC/DC Reference ZBRA1 ZBRA2 (1) ZBRCETH (1) ZBRM01 XALD01 XALD02 (1) Available 1st quarter 2013. 15 Pushbuttons Type of head Flush or projecting push circular Degree of protection IP 65, class II, NEMA type 3 and 12 Mounting (mm) panel cut-out Ø 22.4 (0 +0.1) mounting centres 30 (horizontal) x 40 (vertical) Dimensions (mm) Ø x Depth (below head) Ø 29 x 41.5 (Ø 40 x 41.5 for Emergency stop) Connection Screw clamp terminals, 1 x 0.34 mm2 to 1 x 1.5 mm2 Type of push Flush, spring return Flush, push and latching References (10)* white NO XB7NA11 – NO + NC XB7NA15 – black NO XB7NA21 XB7NH21 NO + NC XB7NA25 XB7NH25 green NO XB7NA31 XB7NH31 NO + NC XB7NA35 XB7NH35 red NC XB7NA42 – NO + NC XB7NA45 – yellow NO XB7NA81 – Type of push Flush, spring return Projecting, spring return References green NO XB7NA3131 – red NC – XB7NL4232 white NO XB7NA11341 – black NO XB7NA21341 – NO + NC XB7NA25341 – Selector switches and key switches Type of operator Black handle Key, n° 455 Number and type of positions 2 positions 3 positions 2 positions 3 positions stay put stay put stay put stay put References (10*) NO XB7ND21 – XB7NG21 – NO + NC XB7ND25 – – – 2 NO – XB7ND33 – XB7NG33 Ø 40mm Emmergency Stop trigger action and mechanical latching pushbuttons (EN/ISO 13850, UL) (1) Type of push Turn to release Push, Pull Key release (n° 455) References* red NC XB7 NS8442 XB7 NT842 - red NO + NC XB7 NS8445 XB7 NT845 XB7 NS9445 red 2NC XB7 NS8444 XB7 NT844 XB7 NS9444 (1) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard EN/IEC 60947-5-5. Please consult your Customer Care Centre for a full explanation of these standards and directives. * Sold in lots of 10. Harmony XB7 Pushbuttons, switches and pilot lights Ø 22 with plastic bezel - Monolithic Contact functions 16 Illuminated pushbuttons Type of head Projecting push circular Degree of protection IP 65, class II, NEMA type 12 Mounting (mm) panel cut-out Ø 22.4 (0 +0.1) mounting centres 30 (horizontal) x 40 (vertical) Dimensions (mm) Ø x Depth (below head) Ø 29 x 41.5, (Ø 40 x 41.5 for Emergency stop) Connection Screw clamp terminals, 1 x 0.34 mm2 to 1 x 1.5 mm2 Light source Integral LED BA 9s base fitting Incandescent bulb direct supply (bulb not included) Type of push Spring return References (10)* green NO XB7NW33p1 (1) XB7NW3361 red NO XB7NW34p1 (1) XB7NW3461 NC XB7NW34p2 (1) _ orange NO XB7NW35p1 (1) – blue NO XB7NW36p1 (1) – clear NO XB7NW37p1 (1) – yellow NO XB7NW38p1 (1) XB7NW3561 Type of push Push and latching References (10)* green NO XB7NH03p1 (1) XB7NH0361 red NO XB7NH04p1 (1) XB7NH0461 NC XB7NH04p2 (1) – yellow NO XB7NH08p1 (1) XB7NH0861 Pilot lights (2) Light source Integral LED Ba 9s base fitting incandescent bulb Incandescent bulb direct supply direct through resistor (bulb not included) (bulb included) Supply voltage 24VAC/DC or 120VAC or 230…240VAC 6 or 24 V DC, or 130 V AC 230 V AC References (10)* clear XB7EV07pP (1) XB7EV67P XB7EV77P green XB7EV03pP (1) XB7EV63P XB7EV73P red XB7EV04pP (1) XB7EV64P XB7EV74P yellow XB7EV05pP (1) XB7EV65P XB7EV75P blue XB7EV06pP (1) XB7EV66P XB7EV76P orange XB7EV08pP (1) XB7EV68P XB7EV78P Incandescent bulbs, long life BA 9s base fitting, Ø 11 mm max., length 28 mm max. 6 V (1.2 W) 24 V (2 W) 130 V (2.4 W) References DL1CB006 DL1CE024 DL1CE130 (1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above. (2) Alternative connection: 1 x 6.35 and 2 x 2.8 mm Faston connectors. * sold in lots of 10 Contact functions and light functions (1): Supply voltage for integral LED light source only Letter (p) 24 V AC/DC B 120 V AC G 230 V AC M 17 Pushbuttons, spring return Type of push Flush Projecting Projecting (high guard) Colour of push Multi-colour (set of 7 clip-in coloured caps) Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals References CO 9001KR1UH13 9001KR3UH13 9001KR2UH13 NO 9001KR1UH5 9001KR3UH5 9001KR2UH5 Mushroom head pushbuttons, latching (1) Emergency switching off Emergency stop Type of push Push-pull Turn-to-Release, trigger action Ø 41 mushroom head Ø 35 mushroom head Ø 40 red mushroom head Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class III Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) 57,2 x 44,5 (without legend plate), 100 x 100 ((with legend plate 9001KN8330) (2) Depth below head (mm) 42 60 Connection Screw clamp terminals References – – – 9001KR16 CO 9001KR9R94H13 9001KR9R20H13 – NC 9001KR9RH6 9001KR9R20H6 – 2NO + 2NC – – 9001KR16H2 NO – – 9001KR16H13 (1) Mushroom head switching off mechanical latching pushbuttons conform to standard IEC 60364-5-53 and EN/IEC 60947-5-5. Mushroom head Emergency stop trigger action and mechanical latching pushbuttons conforming to standard EN/IEC 60204‑1 and EN/ISO 13850, to Machinery directive 2006/42/EC and standard EN/IEC 60947-5-5. Selector switches and key switches Type of operator Long black handle Key, n° 455 positions (2) 3 - spring return 2 - stay put 2 - spring return 3 - stay put 2 - stay put Number and type of positions Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals References NO – 9001KS11FBH5 9001KS34FBH5 – – CO 9001KS53FBH1 – – 9001KS43FBH1 9001KS11K1RH1 (2) The symbol indicates key withdrawal position. Harmony 9001K/SK Pushbuttons, switches and pilot lights Ø 30 with metal bezel Contact functions 18 (2) For yellow circular Emergency Stop legend plates: see page 9 Pilot lights Type of head Smooth lens cap Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals Type of light block With high luminosity LED (included) Incandescent BA 9s bulb (included) 24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC References green 9001KP35LGG9 9001KP36LGG9 9001KP38LGG9 9001KP7G9 red 9001KP35LRR9 9001KP36LRR9 9001KP38LRR9 9001KP7R9 yellow 9001KP35LYA9 9001KP36LYA9 9001KP38LYA9 9001KP7A9 Illuminated pushbuttons, spring return Type of head Spring return flush push Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals Type of light block With high luminosity LED (included) Incandescent BA 9s bulb (included) 24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC References green CO 9001K3L35LGGH13 9001K3L36LGGH13 9001K3L38LGGH13 9001K2L7RH13 red CO 9001K3L35LRRH13 9001K3L36LRRH13 9001K3L38LRRH13 9001K2L7GH13 yellow CO 9001K3L35LYAH13 9001K3L36LYAH13 9001K3L38LYAH13 9001K2L7AH13 Illuminated Ø 41 mushroom head pushbuttons, latching, high luminosity LED Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II Mounting (mm) panel cut-out Ø 31 mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp) Depth below head (mm) 42 Connection Screw clamp terminals Type of light block With high luminosity LED (included) Incandescent BA 9s bulb (included) 24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC/DC Type of head 2 position, push-pull References red CO 9001KR9P35RH13 9001KR9P36RH13 9001KR9P38RH13 9001KR9P7RH13 Type of head 3 position, push-pull (pull: spring return, centre: stay put, push: spring return) References red NC + NC late break 9001KR8P35RH25 9001KR8P36RH25 9001KR8P38RH25 9001KR8P7RH25 Light functions 19 Contact blocks with protected terminals Type of contact Single contact blocks Connection Screw clamp terminals References CO 9001KA1 NO 9001KA2 NC 9001KA3 CO, late break 9001KA4 NC, late break 9001KA5 NO, early make 9001KA6 Enclosures Type Number of Ø 30 mm cut-outs NEMA ratings Reference Aluminium 1 1, 3, 4, 6, 12, 13 9001KY1 2 1, 3, 4, 6, 12, 13 9001KY2 3 1, 3, 4, 6, 12, 13 9001KY3 4 1, 3, 4, 6, 12, 13 9001KY4 Stainless steel 1 1, 3, 4, 4X, 13 9001KYSS1 2 1, 3, 4, 4X, 13 9001KYSS2 3 1, 3, 4, 4X, 13 9001KYSS3 Legends 44 x 43 mm 57 x 57 mm Ø 60 Ø 90 Type Aluminium Plastic Plastic Colour of legend black background white background Yellow background Marking Blank 9001KN200 9001KN100WP 9001KN9100 9001KN8100 START 9001KN201 9001KN101WP – – STOP (red background) 9001KN202 9001KN102RP – – FORWARD 9001KN206 9001KN106WP – – REVERSE 9001KN207 9001KN107WP – – RESET 9001KN223 9001KN123WP – PULL TO START/ 9001KN379 9001KN179WP – – PUSH TO STOP EMERGENCY STOP – – 9001KN9330 9001KN8330 ARRET D’URGENCE – – 9001KN9330F 9001KN8330F PARADA DE EMERGENCIA – – 9001KN9330S 9001KN8330S Harmony 9001K/SK Pushbuttons, switches and pilot lights Ø 30 with metal bezel Accessories 20 Cam switches 12 and 20 A ratings Harmony K series positions (°) Cam switches, K1 / K2 series Function Switches ON-OFF switches Stepping switches 45° switching angle 90° switching angle with “0” position Degree of protection front face IP 65 (1) IP 65 (1) IP 65 (1) Conventional thermal current (Ith) 12 A 20 A 12 A 20 A 12 A 20 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V Number of positions 2 2 2 + “0” position Number of poles 2 2 2 Dimensions of front plate (mm) 45 x 45 45 x 45 45 x 45 Front mounting method Multifixing plate, 45 x 45 mm K1B002ALH K2B 002ALH K1B1002HLH K2B 1002HLH K1D012QLH K2D012QLH Plastic mounting plate for Ø 22 mm hole K1B002ACH K2B 002ACH K1B1002HCH K2B 1002HCH K1D012QCH K2D012QCH positions (°) Cam switches, K1 / K2 series Function Changeover switches Ammeter switches Voltmeter switches Degree of protection front face IP 65 (1) IP 65 (1) IP 65 (1) Conventional thermal current (Ith) 12 A 20 A 12 A 20 A 12 A 20 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V Number of positions 2 + “0” position 3 + “0” position 6 + “0” position (measurements (3 circuits + “0” position) between 3 phases & N + “0” pos.) Number of poles 2 4 7 Dimensions of front plate (mm) 45 x 45 45 x 45 45 x 45 Front mounting method Multifixing plate, 45 x 45 mm K1D002ULH K2D002ULH K1F003MLH to be compiled * K1F027MLH to be compiled * Plastic mounting plate for Ø 22 mm hole K1D002UCH K2D002UCH K1F003MCH to be compiled * K1F027MCH to be compiled * (1) With seal KZ73 for switch with Multifixing plate, with seal KZ65 for Ø 22 mm hole mounting switches. Seal to be ordered separately. (*) Please consult your Schneider Electric agency. positions (°) Cam switches with key operated lock, K1 series Function Stepping switches Run switches Changeover switches + “0” pos. Degree of protection front face IP 65 IP 65 IP 65 Conventional thermal current (Ith) 12 A 12 A 12 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V Number of positions 2 + “0” position 3 + “0” position 2 + “0” position Number of poles 3 2 2 Dimensions of front plate (mm) 55 x 100 55 x 100 55 x 100 Colour of handle red black red black red black Front mounting method Ø 22 mm hole + Ø 43.5 mm hole K1F022QZ2 K1F022QZ4 K1G043RZ2 K1G043RZ4 K1D002UZ2 K1D002UZ4 12 0 45 34 1-pole 2-pole 12 0 90 34 2-pole 90 1 0 45 2345678 135 180 225 2-pole 45 1 315 0 2345678 1-pole 2-pole 180 1 234 0 90 270 56789 10 11 12 0 1 234 270 315 5678 225 9 10 45 90 11 12 135 0 1 23456789 10 11 12 60 120 123456789 10 11 12 13 14 0 60 120 180 300 1 2345678 0 60 21 positions (°) Cam switches, K10 series Function Switches Changeover switches Ammeter Voltmeter 60° switching angle with “0” position switches switches Degree of protection front face IP 65 IP 65 IP 65 IP 65 Conventional thermal current (Ith) 10 A 10 A 10 A 10 A Rated insulation voltage (Ui) conforming to IEC60947-1 440 V 440 V 440 V 440 V Number of positions 2 2 + “0” position 3 + “0” pos. (1) 6 + “0” pos. (2) Number of poles 1 2 3 2 3 3 3 Dimensions of front plate (mm) 30 x 30 30 x 30 30 x 30 30 x 30 Front mounting method By Ø 16 mm or 22 mm hole K10A001ACH K10B002ACH K10C003ACH K10D002UCH K10F003UCH K10F003MCH K10F027MCH (1) (3 circuits + “0” position). (2) (Measurements between 3 phases and N + “0” position). positions (°) Cam switches, K30 series Function Switches Switches Changeover Starting Starting Reversing ON-OFF with “0” position star-delta 2-speed Degree of protection front face IP 40 IP 40 IP 40 IP 40 IP 40 IP 40 Conventional thermal current (Ith) 32 A 32 A 32 A 32 A 32 A 32 A Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V 690 V 690 V 690 V Number of positions 2 2 3 3 3 3 Number of poles 3 3 4 4 3 3 3 Dimensions of front plate (mm) 64 x 64 64 x 64 64 x 64 64 x 64 64 x 64 64 x 64 Front mounting method Multifixing K30C003AP(3) K30C003HP(3) K30D004HP(3) K30H004UP(3) K30H001YP(3) K30H004PP(3) K30E003WP(3) (3) To order switches with other thermal current ratings (50, 63, 115, 150 A): replace the number 30 in the reference by 50, 63, 115 or 150 respectively. Example: a switch with a 32 A current rating, for example K30C003AP, becomes K50 C003AP for a current rating of 50 A. Accessories for cam switches K1/K2 Rubber seals for IP 65 degree of protection For use with heads with 45 x 45 mm front plate with 60 x 60 mm front plate with 45 x 45 mm front plate Ø 22 mm hole or 4 hole front mtg. Ø 22 mm hole or 4 hole front mtg. multifixing References* KZ65 KZ66 KZ73 * Sold in lots of 5. Cam switches 10 to 150 A ratings Harmony K series 0 1 23456 60 1-pole 2-pole 3-pole 0 1 2 60 34 300 56789 10 11 12 1-pole 2-pole 3-pole 90 1 2 180 34 0 270 56789 10 11 12 300 1 2 330 34 270 0 30 60 90 56789 10 11 12 0 1 23456 60 1-pole 2-pole 3-pole 0 1 2345678 90 1-pole 2-pole 0 12 60 34 1234 300 56789 10 11 12 13 14 15 16 1-pole 2-pole 3-pole 4-pole 0 12 60 34 1234 300 56789 10 11 12 13 14 15 16 0 1260 34 1234 300 56789 10 11 12 13 14 15 16 0 12 60 34 1234 300 56789 10 11 12 22 Monolithic tower lights Ø 40, Ø 60, Ø 100 mm, complete, pre-wired tower lights Harmony XVC Ø 40 mm / Up to IP54 Complete, pre-wired tower lights Steady light Steady / Flashing light (1) Light source (included) LEDs LEDs Base mount Base mounting Support tube mounting, 17 mm Support tube mounting, 17 mm Buzzer Without buzzer With buzzer + flashing light Degree of protection up to IP54 up to IP54 Voltage 24V AC/DC 24V AC/DC 100-240V AC 24V AC/DC 100 - 240V AC References (2) Red XVC4B1K XVC4B1 XVC4M1 (4) XVC4B15S XVC4M15S (4) Red / orange XVC4B2K XVC4B2 XVC4M2 XVC4B25S XVC4M25S Red / Orange / green XVC4B3K XVC4B3 XVC4M3 XVC4B35S XVC4M35S red / orange / green / blue XVC4B4K XVC4B4 XVC4M4 XVC4B45S XVC4M45S red / orange / green / blue / Clear XVC4B5K XVC4B5 XVC4M5 XVC4B55S XVC4M55S Ø 60 mm / Up to IP54 Complete, pre-wired tower lights Steady light Steady / Flashing light (1) Light source (included) LEDs LEDs Base mount Base mounting Support tube mounting, 22 mm Support tube mounting, 22 mm Base mounting Buzzer Without buzzer With buzzer + flashing light Degree of protection up to IP54 up to IP54 Voltage 24V AC/DC 24V AC/DC 100-240 V AC (4) 24V AC/DC 100-240 V AC (4) References (2) Red XVC6B1K XVC6B1 XVC6M1 (3) XVC6B15S (3) XVC6M15S XVC6M15SK Red / orange XVC6B2K XVC6B2 XVC6M2 (3) XVC6B25S (3) XVC6M25S XVC6M25SK Red / Orange / green XVC6B3K XVC6B3 XVC6M3 (3) XVC6B35S (3) XVC6M35S XVC6M35SK red / orange / green / blue XVC6B4K XVC6B4 XVC6M4 (3) XVC6B45S (3) XVC6M45S XVC6M45SK red / orange / green / blue / Clear XVC6B5K XVC6B5 XVC6M5 (3) XVC6B55S (3) XVC6M55S XVC6M55SK Ø 100 mm / Up to IP54 Complete, pre-wired tower lights Steady / Flashing light (1) Light source (included) LEDs Base mount Base mounting Buzzer Without buzzer With buzzer + flashing light Degree of protection up to IP54 up to IP54 Voltage 24V DC (4) 100-240V AC (4) 24VDC (4) 100-240V AC (4) 24VDC (4) 100-240V AC (4) References (2) Red XVC1B1K XVC1M1K XVC1B1SK XVC1M1SK XVC1B1HK XVC1M1HK Red / orange XVC1B2K XVC1M2K XVC1B2SK XVC1M2SK XVC1B2HK XVC1M2HK Red / Orange / green XVC1B3K XVC1M3K XVC1B3SK XVC1M3SK XVC1B3HK XVC1M3HK red / orange / green / blue XVC1B4K XVC1M4K XVC1B4SK XVC1M4SK - - red / orange / green / blue / Clear XVC1B5K XVC1M5K XVC1B5SK XVC1M5SK - - (1) Flashing function can be simply selected/programmed by wiring (2) The colours are listed in the same order as the mounting order of the illuminated units (from top to bottom) (3) To order products for base mounting, add the letter K to the end of the reference (ex. XVC6M1K) (4) NPN only 23 Monolithic tower lights and accessories Ø 45 mm, complete illuminated beacons Harmony XVDLS / XVC Ø 45 mm / IP40 Illuminated beacons XVDLS Steady light Flashing light Light source Incandescent BA 15d bulb, 5 W max. (not included) “Flash” discharge tube, 0.5 J Degree of protection IP 40 References (1) 24…230 V AC/DC XVDLS3p – 24 V AC/DC – XVDLS6Bp 120 V AC – XVDLS6Gp 230 V AC – XVDLS6Mp (1) To obtain the complete reference, replace the p by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. Accessories XVDLS Incandescent bulbs, with BA 15d base Beacons XVDLS Description 24 V, 4 W 120 V, 5 W 230 V, 5 W References DL1BEBS DL1BEGS DL1BEMS XVC4 / XVC6 Mounting accessories Tower lights Ø 40 mm, XVC4 Tower lights Ø 60 mm, XVC6 Description Support tube mounting Support tube mounting Base mounting Support tube mounting Diameter (mm) Ø 90 Ø 84 – Ø 100 Ø 84 – For use with – – – XVC6ppand XVC6pp5S XVC6ppK and XVC6pp5SK XVC6Bpand XVC6Bpp5S, XVC6Mpand XVC6Mp5S Height to be added (mm) 32 24,5 82 30 21,6 82 References Metal fixing plate XVCZ11 – – XVCZ02 XVCZ12 – Plastic fixing plate – XVCZ01 – – – – Wall mounting bracket – – XVCZ31 – – XVCZ32 XVC1 Mounting accessories Tower lights Ø 100 mm, XVC1 Description Vertical support Diameter (mm) Ø 140 Ø 140 – – For use with XVC1ppK and XVC1ppSK XVC1ppHK (with siren) XVC1ppK and XVC1ppSK XVC1ppHK (with siren) Height to be added (mm) 300 306 – – References Metal fixing plate (2) XVCZ13 XVCZ14 – – Metal fixing bracket – – XVCZ23 XVCZ24 (2) Chromium plated-steel extension tube 24 Modular tower lights Ø 70 mm, for customer assembly Harmony XVB Ø 70 mm / Up to IP66 Illuminated beacons XVBL Steady light Flashing light Light source Incandescent BA 15d bulb, Protected BA 15d LED Protected BA 15d LED “Flash” discharge tube 10 W max. (not included) (included) (included) 5 J (2) Degree of protection IP 66 References (1) 12…250 V AC/DC XVBL3p – – – 24 V AC/DC – XVBL0Bp XVBL1Bp XVBL6Bp 120 V AC – XVBL0Gp XVBL1Gp XVBL6Gp 230 V AC – XVBL0Mp XVBL1Mp XVBL6Mp Ø 70 mm / Up to IP66 Tower lights XVBC comprising 2 to 5 signalling units (3) Base units Steady light Flashing light “Flash” light Audible units (90 db at 1 m) Light source – Incandescent Integral Integral “Flash” – BA 15d bulb, 10 W protected LED protected LED discharge tube max. (not included) 5 J (2) Degree of protection IP 66 Base unit references with cover XVBC21 (4) – – – – – without cover XVBC07 (5) – – – – – References (2) 12… 230 V AC/DC – XVBC3p – – – – 24 V AC/DC – – XVBC2Bp XVBC5Bp XVBC6Bp – 120 V AC – – XVBC2Gp XVBC5Gp XVBC6Gp – 230 V AC – – XVBC2Mp XVBC5Mp XVBC6Mp – Audible unit references 12…48 V AC/DC – – – – – XVBC9B unidirectional 120…230 V AC – – – – – XVBC9M (1) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. (2) To order a lens unit with a 10 J discharge tube, replace the number 6 by 8 in the reference (example: XVBL6Bp becomes XVBL8Bp). (3) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum. (4) For connection on AS-Interface, order base unit XVBC21A (side cable entry) or XVBC21B (bottom cable entry with M12 connector on flying lead). (5) For indicator banks with “flash” discharge tube unit. 25 Modular tower lights Ø 70 mm, for customer assembly Harmony XVE Ø 70 mm / Up to IP54 Illuminated beacons XVEL Steady light Flashing light Light source Incandescent Integral “Flash” discharge tube, 1 J BA 15d bulb, 5 W max. LED (not included) Degree of protection IP 42/IP 54 (with sealing kit) References (1) 24… 240 V AC/DC XVEL3p – 24 V AC/DC – XVEL2Bp XVEL6Bp 120 V AC – XVEL2Gp XVEL6Gp 230 V AC – XVEL2Mp XVEL6Mp Ø 70 mm / Up to IP54 Indicator banks XVEC comprising 2 to 5 signalling units (2) Base units Steady light Flashing light “Flash” light Audible units (85 db at 1 m) Light source – Incandescent Integral Integral “Flash” – BA 15d bulb, 5 W LED LED discharge tube max. (not included) 1 J Degree of protection IP 42/IP 54 (with sealing kit) Base unit references IP 42 XVEC21 – – – – – IP 54 XVEC21P – – – – – Lens unit references (1) 24…230 V AC/DC – XVEC3p – 24 V AC/DC – – XVEC2Bp XVEC5Bp XVEC6Bp XVEC9B 120 V AC – – XVEC2Gp XVEC5Gp XVEC6Gp XVEC9G 230 V AC – – XVEC2Mp XVEC5Mp XVEC6Mp XVEC9M (1) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. (2) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum. 26 Modular tower lights Ø 45, Ø 50 mm, complete or for customer assembly Harmony XVM / XVP Ø 45 mm / IP42 Complete, pre-wired tower light XVM (1) 2 sig. units + integral buzzer (2) Steady light 3 signalling units + integral buzzer (2) Steady light Steady light + “flash” (3) Light source (included) Incandescent BA 15d Incandescent BA 15d Incandescent BA 15d BA 15d bulb, 5 W “Super bright” LED BA 15d bulb, 5 W “Super bright” LED BA 15d bulb, 5 W “Super bright” max. max. max. LED Degree of protection IP 54 Signalling colours Red - Green Red - Orange - Green References 24 V AC/DC XVMB1RGS XVMB2RGSSB XVMB1RAGS XVMB2RAGSSB XVMB1R6AGS XVMB2R6AGSSB 120 V AC/DC (bulb) - 120 V AC (LED) XVMG1RGS XVMG2RGSSB XVMG1RAGS XVMG2RAGSSB XVMG1R6AGS XVMG2R6AGSSB 230 V AC/DC (bulb) - 230 V AC (LED) XVMM1RGS XVMM2RGSSB XVMM1RAGS XVMM2RAGSSB XVMM1RA6GS XVMM2R6AGSSB (1) Tower lights XVM are also available as separate components for customised assembly by the user: please refer to www.schneider-electric.com. (2) To order products without an integral buzzer, delete the letter S at the end of the reference (example: XVMB2RGS becomes XVMB2RG, XVMB2RGSSB becomes XVMB2RGSB). (3) Flash signalling colour: red - 0.8 J. Ø 50 mm / IP65 Tower lights XVP comprising 2 to 5 signalling units (4), black clamping ring (5) Base unit Steady or flashing light signalling “Flash” light signalling Audible units (55…85 dB at 1 m) Light source – Incandescent “Flash” “Flash” – BA 15d bulb, 7 W discharge tube discharge tube max. (not included) 0.3 J 0.6 J Degree of protection IP 65 Base unit with cover XVPC21 – – – – References (6) 250 V max. – XVPC3p – – – 24 V AC/DC (flash) - 24 V DC (buzzer) – – XVPC6Bp – XVPC09B 120 V AC – – – XVPC6Gp XVPC09G 230 V AC – – – XVPC6Mp XVPC09M (4) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum. (5) To order products with a cream clamping ring, add the letter W to the end of the reference (example: base unit + green lens unit: XVPC21W + XVPC33W etc.). (6) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow. 27 Bulbs Beacons and tower lights XVB / XVP (1) Type of light source Incandescent Incandescent LED (2) Flashing BA 15d base BA 15d base BA 15d base LED (2) 7 W 10 W (not XVP) BA 15d base References 12 V DL1BEJ DL1BLJ – – 24 V DL1BEB DL1BLB DL1BDBp DL1BKBp 48 V DL1BEE DL1BLE – – 120 V DL1BEG DL1BLG DL1BDGp DL1BKGp 230 V DL1BEM DL1BLM DL1BDMp DL1BKMp (1) Tower lights XVP can be fitted with 5 W incandescent bulbs: see beacons XVDLS / XVE. (2) To obtain the complete reference, replace the p by the number designating the colour as follow: 1 = white, 3 = green , 4 = red , 5 = orange, 6 = blue, 8 = yellow. Bulbs Tower lights XVM Type of light source Incandescent LED (3) Flashing “Flash” discharge BA 15d base BA 15d base LED (3) tube, 0.8 Joule 5 W BA 15d base BA 15d base References 24 V DL1EDBS DL2EDBpSB DL1EKBpSB DL6BB 120 V DL1EDGS DL2EDGpSB DL1EKGpSB DL6BG 230 V DL1EDMS DL2EDMpSB DL1EKMpSB DL6BM (3) To obtain the complete reference, replace the p by the number designating the colour as follows: 1 = white, 3 = green , 4 = red , 6 = blue, 8 = orange. Mounting accessories Beacons and tower lights XVB / XVE Tower lights Tower lights XVP XVM Description Aluminium tube Plastic tube Aluminium tube Aluminium tube Aluminium tube Aluminium tube with integral black with integral black with integral black with steel fixing with integral cream with steel fixing plastic fixing base plastic fixing base plastic fixing base bracket plastic fixing base bracket Diameter (mm) Ø 25 Ø 25 Ø 20 Ø 20 Ø 20 Ø 20 Support tubes 60 mm XVEZ13 – – – – – 100 mm – – – XVPC02T XVMZ02 XVMZ02T 112 mm – – XVPC02 (4) – – – 120 mm XVBZ02 – – – – – 140 mm – XVDC02 – – – – 250 mm – – – XVPC03T XVMZ03 XVMZ03T 260 mm – – XVPC03 (4) – – – 400 mm – – – XVPC04T XVMZ04 XVMZ04T 410 mm – – XVPC04 (4) – – – 420 mm XVBZ03 – – – – – 820 mm XVBZ04 – – – – – Fixing plates, for vertical support XVBC12 XVPC12 (4) – for horizontal support XVBZ01 – XVMZ06 (4) To order an aluminium support tube with integral cream fixing base, add the letter W to the end of the reference (example: XVPC02W). Modular tower lights accessories For XVB, XVP, XVE, XVM Harmony XV 28 Rotating beacons Ø 84, 106, 120, 130 mm rotating beacons Harmony XVR Ø 84 / 106 mm Complete, pre-wired rotating beacons Ø 84 mm Ø 106 mm Light source (included) “ Super bright “ LEDs Base mount 3 x Ø 05 Buzzer Without buzzer Degree of protection IP23 (IP 65 with accessories) IP23 (IP 55 with accessories) Voltage 12V AC/DC 24V AC/DC 12V AC/DC 24V AC/DC References Red XVR08J04 XVR08B04 XVR10J04 XVR10B04 Orange XVR08J05 XVR08B05 XVR10J05 XVR10B05 Green XVR08J03 XVR08B03 XVR10J03 XVR10B03 Blue XVR08J06 XVR08B06 XVR10J06 XVR10B06 Ø 120 mm Complete, pre-wired rotating beacons Ø 120 mm Light source (included) “ Super bright “ LEDs Base mount 3 x M5 Buzzer Without buzzer With buzzer Degree of protection IP23 Voltage 12V AC/DC 24V AC/DC 12V AC/DC 24V AC/DC References Red XVR12J04 XVR12B04 XVR12J04S XVR12B04S Orange XVR12J05 XVR12B05 XVR12J05S XVR12B05S Green XVR12J03 XVR12B03 XVR12J03S XVR12B03S Blue XVR12J06 XVR12B06 XVR12J06S XVR12B06S Ø 130 mm Complete, pre-wired rotating beacons Ø 130 mm Light source (included) “ Super bright “ LEDs Base mount 3 x Ø 09 Buzzer Without buzzer Degree of protection IP66 - Resistant to vibration IP66 and IP67 Voltage 12V DC 24V DC 24V AC/DC 120V AC 230V AC References Red XVR13J04 XVR13B04 XVR13B04L XVR13G04L XVR13M04L Orange XVR13J05 XVR13B05 XVR13B05L XVR13G05L XVR13M05L 29 Accesories for rotating mirrors Reflecting prism Rubber base Metal angle bracket Metal fixing plate To be used for/with – Increasing the IP degree Horizontal support Horizontal support Height (mm) – – – 300 References Ø 84 mm XVRZR1 XVRZ081 XVCZ23 – Ø 106 mm XVRZR2 XVRZ082 XVCZ23 XVCZ13 Ø 120 mm XVRZR3 – XVCZ23 XVCZ13 Ø 130 mm XVRZR3 – XVR012L – Electronic alarms and multisound sirens Sirens and electronic alarms Sirens Multisound sirens pre-wired Electronic alarms Panel Mount DIN72 Electronic alarms Panel Mount DIN96 Sound level 106 dB 105 dB 90 dB 96 dB Tones 2 43 16 16 Channels – 8 4 4 Degree of protection IP 53 IP53 IP 54 IP 54 Colors White White Black White Black White References 12/24V AC/DC XVS10BMW – XVS72BMBp (1) XVS72BMWp (1) XVS96BMBp (1) XVS96BMWp (1) 12/24V DC – XVS14BMW – – – – 120V AC XVS10GMW XVS14GMW – – – – 230V AC XVS10MMW XVS14MMW – – – – (1) To obtain a complete reference, replace the p by the letter as follow: P = PNP, N = NPN (ex. XVS72BMBP) Rotating beacons accessories and sound solutions Accessories for rotating beacons Harmony XVR / XVS 30 Type XACA “Pistol grip” Degree of protection IP 65 / Nema 4, 4X / Class II Rated operational characteristics AC 15 (240 V 3 A), DC 13 Conventional thermal current Ithe 10 A Connection Screw clamp terminals, 1 x 2.5 mm2 or 2 x 1.5 mm2 For control of single-speed motors 2-speed motors Dimensions (mm) W x H x D 52 x 295 x 71 (x 85 with ZA2BS834) 52 x 295 x 71 (x 85 with ZA2BS834) Number of operators mechanically interlocked 2 2 Emergency stop without ZA2BS834 without ZA2BS834 References XACA201 XACA2014 XACA207 XACA2074 Type XACA For control of single-speed motors Dimensions (mm) W x H x D 80 x 314 x 70 (x 90 with ZA2BS834) 80 x 440 x 70 (x 90 with ZA2BS844) Number of operators mechanically interlocked between pairs 2 4 Emergency stop without ZA2BS834 without ZA2BS844 References XACA271 XACA2714 XACA471 XACA4714 For control of single-speed motors + I / O Dimensions (mm) W x H x D 80 x 500 x 70 (x 90 with ZA2BS844) 80 x 560 x 70 Number of operators mechanically interlocked between pairs 6 8 Emergency stop without ZA2BS844 without References XACA671 XACA6714 XACA871 Empty enclosures type XACA Number of ways 2 3 4 5 6 8 12 References XACA02 XACA03 XACA04 XACA05 XACA06 XACA08 XACA12 Pendant control stations for control circuits Ready to use Harmony XAC 31 (1) Trigger action mechanically latching Emergency stop pushbuttons conform to standards EN/IEC 60204-32, EN/ISO 13850, Machinery directive 2006/42/EC and standard EN/IEC 60947-5-5. Legends, 30 x 40 mm With symbols conforming to NF E 52-124 With text References ZB2BY4901 ZB2BY4903 ZB2BY4907 ZB2BY4909 ZB2BY4913 ZB2BY4915 ZB2BY4930 ZB2BY2303 ZB2BY2304 References ZB2BY2904 ZB2BY2906 ZB2BY2910 ZB2BY2912 ZB2BY2916 ZB2BY2918 ZB2BY2931 ZB2BY1W140 blank white or yellow background Separate components (for mounting in enclosures XACA) Booted operators white XACA9411 black XACA9412 Mushroom head, latching, trigger action (1) turn to release Ø 40 ZA2BS844 Ø 30 ZA2BS834 Mushroom head, latching, trigger action (1) key release Ø 40 ZA2BS944 Ø 30 ZA2BS934 Selector switch 2 pos. stay put ZA2BD2 3 pos. stay put ZA2BD3 Key switch key n° 455 2 pos. stay put ZA2BG4 3 pos. stay put ZA2BG5 Blanking plug with seal and ZB2SZ3 fixing nut Pilot light heads white ZA2BV01 green ZA2BV03 red ZA2BV04 yellow ZA2BV05 Pilot light bodies direct supply ZB2BV006 direct supply, through resistor ZB2BV007 Protective guard (for base mounted units) For selector switch XACA982/983 For emergency stop pushbutton XACA984 Contact blocks Single-speed NO ZB2BE101 Single-speed NC ZB2BE102 Contacts blocks for XACA941p Single-speed NC+NO XENG1491 2-speed NC+NO+NO XENG1191 Contact blocks (for mounting in enclosure base) NO XACS101 NC+NO XACS105 Isolating switch, slow break, for front mounting Emergency stop NC+NC+NC with positive opening operation XENT1192 Double blocks latching, slow break Single-speed NO+NO XENG3781 Single-speed NO+NC XENG3791 32 Notes 33 ART. 097419 01/2013 - V10.0 DIA4ED2040408EN Head Office 35, rue Joseph Monier - CS 30323 F92500 Rueil-Malmaison Cedex France www.schneider-electric.com The information provided in this documentation contains general descriptions and/or technical characteristics of the performance of the products contained herein. This documentation is not intended as a substitute for and is not to be used for determining suitability or reliability of these products for specific user applications. It is the duty of any such user or integrator to perform the appropriate and complete risk analysis, evaluation and testing of the products with respect to the relevant specific application or use thereof. Neither Schneider Electric nor any of its affiliates or subsidiaries shall be responsible or liable for misuse of the information contained herein. Design : IGS-CP Photos : Schneider Electric Print : http://www.farnell.com/datasheets/1761538.pdf This document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 39-01-2020 Status: Active Overview: Mini-Fit Jr.™ Power Connectors Description: Mini-Fit Jr.™ Receptacle Housing, Dual Row, UL 94V-2, 2 Circuits Documents: 3D Model Product Specification PS-5556-001 (PDF) Drawing (PDF) Test Summary TS-5556-002 (PDF) Product Specification PS-45750-001 (PDF) RoHS Certificate of Compliance (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family Crimp Housings Series 5557 Application Power, Wire-to-Wire Comments Current = 13A max. per circuit when header is mated to a receptacle loaded with 45750 series terminals crimped to 16 AWG wire. . See Molex product specification PS-45750-001 for additional current derating information.. Glow Wire Equivalent Part. MolexKits Yes Overview Mini-Fit Jr.™ Power Connectors Product Name Mini-Fit Jr.™ UPC 800753584259 Physical Breakaway No Circuits (maximum) 2 Color - Resin Natural Flammability 94V-2 Gender Female Glow-Wire Compliant No Material - Resin Nylon Net Weight 0.657/g Number of Rows 2 Packaging Type Bag Panel Mount No Pitch - Mating Interface 4.20mm Pitch - Termination Interface 4.20mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -40°C to +105°C Electrical Current - Maximum per Contact 13A Material Info Old Part Number 5557-02R Reference - Drawing Numbers Product Specification PS-45750-001, PS-5556-001, RPS-5557-046 Sales Drawing SD-5557-003 Test Summary TS-5556-002 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 5557Series Mates With 5559 Dual Row, 5566 Vertical with Pegs, 5566 Vertical without Pegs, 5569 Right Angle Dual Row with Flanges, 5569 Right Angle Dual Row with Pegs, 43810 , 44068 , 44281 , 87427 , 42404 , 42440 Use With 5556 Mini-Fit® Female Crimp Terminals, 45750 Mini-Fit® Plus HCS Crimp TerminalThis document was generated on 01/06/2014 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION This document was generated on 10/10/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: 87439-0400 Status: Active Overview: Pico-Spox™ Wire-to-Board Connector System Description: 1.50mm Pitch Pico-SPOX™ Wire-to-Board Housing, 4 Circuits, Off-White Housing Documents: 3D Model RoHS Certificate of Compliance (PDF) Drawing (PDF) Product Literature (PDF) Product Specification PS-87437 (PDF) Agency Certification CSA LR19980 UL E29179 General Product Family Crimp Housings Series 87439 Application Signal, Wire-to-Board MolexKits Yes Overview Pico-Spox™ Wire-to-Board Connector System Product Literature Order No USA-235 Product Name Pico-SPOX™ UPC 800753537224 Physical Circuits (maximum) 4 Color - Resin Natural Flammability 94V-0 Gender Female Glow-Wire Compliant No Lock to Mating Part Yes Material - Resin Nylon Net Weight 55.000/mg Number of Rows 1 Packaging Type Bag Panel Mount No Pitch - Mating Interface 1.50mm Polarized to Mating Part Yes Stackable No Temperature Range - Operating -55°C to +105°C Electrical Current - Maximum per Contact 2.5A Material Info Reference - Drawing Numbers Product Specification PS-87437, RPS-87437, RPS-87437-001, RPS-87437-200, RPS-87438-002 Sales Drawing SD-87439-**00 Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Low-Halogen Status Low-Halogen Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 87439Series Mates With Pico-SPOX™ Wire-to-Board Header 87437 , 87438 Use With 87421 Pico-SPOX™ Crimp Terminal This document was generated on 10/10/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION PMBFJ620 Dual N-channel field-effect transistor Rev. 2 — 15 September 2011 Product data sheet CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per FET VDS drain-source voltage - - 25 V VGSoff gate-source cut-off voltage VDS = 10 V; ID = 1 A 2 - 6.5 V IDSS drain current VGS = 0 V; VDS = 10 V 24 - 60 mA Ptot total power dissipation Ts  90 C - - 190 mW yfs forward transfer admittance VDS = 10 V; ID = 10mA 10 - - mS PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 2 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 2. Pinning information 3. Ordering information 4. Marking [1] * = p: made in Hong Kong. * = t: made in Malaysia. * = W: made in China. Table 2. Discrete pinning information Pin Description Simplified outline Symbol 1 source (1) 2 source (2) 3 gate (2) 4 drain (2) 5 drain (1) 6 gate (1) 1 2 3 6 5 4 sym034 6 3 2 4 1 5 Table 3. Ordering information Type number Package Name Description Version PMBFJ620 - plastic surface mounted package; 6 leads SOT363 Table 4. Marking Type number Marking code[1] PMBFJ620 A8* PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 3 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 5. Limiting values 6. Thermal characteristics [1] Ts is the temperature at the soldering point of the gate pins, see Figure 1. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per FET VDS drain-source voltage - 25 V VGSO gate-source voltage open drain - 25 V VGDO drain-gate voltage open source - 25 V IG forward gate current (DC) - 50 mA Ptot total power dissipation Ts  90 C - 190 mW Tstg storage temperature 65 +150 C Tj junction temperature - 150 C Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-s) thermal resistance from junction to soldering points single loaded [1] 315 K/W double loaded [1] 160 K/W (1) Double loaded. (2) Single loaded. Fig 1. Power derating curve. Ts (°C) 0 50 100 150 200 001aaa742 200 100 300 400 Ptot (mW) 0 (1) (2) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 4 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 7. Static characteristics 8. Dynamic characteristics Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per FET V(BR)GSS gate-source breakdown voltage IG = 1 A; VDS = 0 V 25 - - V VGSoff gate-source cut-off voltage ID = 1 A; VDS = 10 V 2 - 6.5 V VGSS gate-source forward voltage IG = 1 mA; VDS = 0 V - - 1 V IDSS drain-source leakage current VDS = 10 V; VGS = 0 V 24 - 60 mA IGSS gate-source leakage current VGS = 15 V; VDS = 0 V - - 1 nA RDSon drain-source on-state resistance VGS = 0 V; VDS = 100mV - 50 -  yfs common source forward transfer admittance ID = 10 mA; VDS = 10 V 10 - - mS yos common source output admittance ID = 10 mA; VDS = 10 V - - 250 S Table 8. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per FET Ciss input capacitance VDS = 10 V; VGS = 10 V; f =1 MHz - 3 5 pF VDS = 10 V; VGS = 0 V; Tamb = 25 C - 6 - pF Crss reverse transfer capacitance VDS = 0 V; VGS = 10 V; f = 1 MHz - 1.3 2.5 pF gis common source input conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 200 - S VDS = 10 V; ID = 10 mA; f = 450 MHz - 3 - mS gfs common source transfer conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 13 - mS VDS = 10 V; ID = 10 mA; f = 450 MHz - 12 - mS grs common source reverse conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 30 - S VDS = 10 V; ID = 10 mA; f = 450 MHz - 450 - S gos common source output conductance VDS = 10 V; ID = 10 mA; f = 100 MHz - 150 - S VDS = 10 V; ID = 10 mA; f = 450 MHz - 400 - S Vn equivalent input noise voltage VDS = 10 V; ID = 10 mA; f = 100 Hz - 6 - nV/Hz PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 5 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor VDS = 10 V; Tj = 25 C. VDS = 10 V; ID = 10 mA; Tj = 25 C. Fig 2. Drain current as a function of gate-source cut-off voltage; typical values. Fig 3. Common source forward transfer admittance as a function of gate-source cut-off voltage; typical values. VDS = 10 V; ID = 10 mA; Tj = 25 C. VDS = 100 mV; VGS = 0 V; Tj = 25 C. Fig 4. Common-source output conductance as a function of gate-source cut-off voltage; typical values. Fig 5. Drain-source on-state resistance as a function of gate-source cut-off voltage; typical values. VGSoff (V) 0 −1 −2 −3 −4 mcd220 20 30 10 40 50 IDSS (mA) 0 0 −2 −4 −8 mcd219 −6 20 0 16 12 8 yfs (mS) 4 VGSoff (V) 0 150 100 50 0 −1 −2 −4 mcd221 −3 gos (μS) VGSoff (V) 0 −1 −2 −4 80 60 20 0 40 mcd222 −3 RDSon (Ω) VGSoff (V) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 6 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor Tj = 25 C. VDS = 10 V; Tj = 25 C. Fig 6. Typical output characteristics. Fig 7. Typical transfer characteristics. VDS = 10 V; Tj = 25 C. VDS = 10 V; Tj = 25 C. Fig 8. Reverse transfer capacitance as a function of gate-source voltage; typical values. Fig 9. Input capacitance as a function of gate-source voltage; typical values. VDS (V) 0 4 8 12 16 mcd217 20 10 30 40 ID (mA) 0 (2) (4) (1) (5) (6) (3) −4 −3 −2 0 40 30 10 0 20 mcd214 −1 ID (mA) VGS (V) −10 −4 0 4 3 1 0 2 mcd224 −8 −6 −2 Crs (pF) VGS (V) −10 0 10 0 mcd223 −8 −6 −4 −2 8 6 4 2 Cis (pF) VGS (V) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 7 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor VDS = 10 V; Tj = 25 C. Fig 10. Drain current as a function of gate-source voltage; typical values. Tj = 25 C. Fig 11. Gate current as a function of drain-gate voltage; typical values. mcd229 1 10−2 10−1 102 10 103 ID (μA) 10−3 VGS (V) −2.5 −2.0 −1.5 −1.0 −0.5 0 mcd230 −10 −1 −103 −102 −104 IGSS (pA) −10−1 VDG (V) 0 4 8 12 16 (1) (2) (3) (4) PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 8 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor Fig 12. Gate current as a function of junction temperature; typical values. mcd231 10 1 103 102 104 IGSS (pA) 10−1 Tj (°C) −25 25 75 125 175 PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 9 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor VDS = 10 V; ID = 10 mA; Tamb = 25 C. VDS = 10 V; ID = 10 mA; Tamb = 25 C. Fig 13. Input admittance as a function of frequency; typical values. Fig 14. Forward transfer admittance as a function of frequency; typical values. VDS = 10 V; ID = 10 mA; Tamb = 25 C. VDS = 10 V; ID = 10 mA; Tamb = 25 C. Fig 15. Reverse transfer admittance as a function of frequency; typical values. Fig 16. Output admittance as a function of frequency; typical values. mcd228 10 1 gis, bis (mS) 10−1 102 f (MHz) 10 102 103 bis gis f (MHz) 10 102 103 mcd227 10 102 gfs,−bfs (mS) 1 gfs −bfs mcd226 f (MHz) 10 102 103 −10−1 −1 −10 −102 brs, grs (mS) −10−2 brs grs mcd225 10 1 bos, gos (mS) 10−1 102 f (MHz) 10 102 103 bos gos PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 10 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 9. Package outline Fig 17. Package outline. OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT363 SC-88 bp w M B D e1 e pin 1 index A A1 Lp Q detail X HE E v M A B A y 0 1 2 mm scale c X 1 2 3 6 5 4 Plastic surface-mounted package; 6 leads SOT363 UNIT A1 max bp c D E e1 HE Lp Q v w y mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.2 0.1 DIMENSIONS (mm are the original dimensions) 0.45 0.15 0.25 0.15 A 1.1 0.8 04-11-08 06-03-16 PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 11 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 10. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMBFJ620 v.2 20110915 Product data sheet - PMBFJ620 v.1 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package outline drawings have been updated to the latest version. PMBFJ620 v.1 (9397 750 13006) 20040511 Product data sheet - - PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 12 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor 11. Legal information 11.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 September 2011 13 of 14 NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PMBFJ620 Dual N-channel field-effect transistor © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 September 2011 Document identifier: PMBFJ620 Advanced Materials Araldite® 2014-1 Structural Adhesives TECHNICAL DATA SHEET Araldite® 2014-1 Two component epoxy paste adhesive Key properties Grey paste High temperature and chemical resistance Low shrinkage Very resistant to water and a variety of chemicals Gap filling, non sagging up to 5mm thickness Description Araldite 2014-1 is a two component, room temperature curing, thixotropic paste adhesive of high strength with good environmental and excellent chemical resistance. Used for bonding of metals, electronic components, GRP structures and many other items where a higher than normal temperature or more aggressive environment is to be encountered in service. The low out gassing makes this product suitable for specialist electronic telecommunication and aerospace applications. Product data Property 2014-1/A 2014-1/B 2014-1 (mixed) Colour (visual) beige paste grey paste grey paste Specific gravity ca. 1.6 ca. 1.6 ca. 1.6 Viscosity at 25°C (Pas) ca. 100 thixotropic thixotropic Pot Life (100 gm at 25 C) - - 60 minutes Shelf life (2-40 C) 3 years 3 years - Processing Pretreatment The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt. Low grade alcohol, gasoline (petrol) or paint thinners should never be used. The strongest and most durable joints are obtained by either mechanically abrading or chemically etching ( pickling ) the degreased surfaces. Abrading should be followed by a second degreasing treatment. Mix ratio Parts by weight Parts by volume Araldite 2014-1/A 100 100 Araldite 2014-1/B 50 50 Araldite 2014-1 is available in cartridges incorporating mixers and can be applied as ready to use adhesive with the aid of the tool recommended by Huntsman Advanced Materials. April 2007 Araldite® 2014-1 2/6 Application of adhesive The resin/hardener mix may be applied manually or robotically to the pretreated and dry joint surfaces. Huntsman's technical support group can assist the user in the selection of an suitable application method as well as suggest a variety of reputable companies that manufacture and service adhesive dispensing equipment. A layer of adhesive 0.05 to 0.10 mm thick will normally impart the greatest lap shear strength to the joint. Huntsman stresses that proper adhesive joint design is also critical for a durable bond. The joint components should be assembled and secured in a fixed position as soon as the adhesive has been applied. For more detailed explanations regarding surface preparation and pretreatment, adhesive joint design, and the dual syringe dispensing system, visit www.araldite2000plus.com. Equipment maintenance All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation. If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact. Times to minimum shear strength Temperature C 10 15 23 40 60 100 Cure time to reach hours 14 8 3 - - - LSS > 1MPa minutes - - - 60 15 3 Cure time to reach hours 20 11 5 - - - LSS > 10MPa minutes - - - 80 20 4 LSS = Lap shear strength. Typical cured properties Unless otherwise stated, the figures given below were all determined by testing standard specimens made by lapjointing 114 x 25 x 1.6 mm strips of aluminium alloy. The joint area was 12.5 x 25 mm in each case. The figures were determined with typical production batches using standard testing methods. They are provided solely as technical information and do not constitute a product specification. Average lap shear strengths of typical metal-to-metal joints (ISO 4587) Cured for 16 hours at 40°C and tested at 23 C Pretreatment - Sand blasting 0 5 10 15 20 25 Aluminium Steel 37/11 Stainless steel V4A Galvanised steel Copper Brass MPa April 2007 Araldite® 2014-1 3/6 Average lap shear strengths of typical plastic-to-plastic joints (ISO 4587) Cured for 16 hours at 40 C and tested at 23 C. Pretreatment - Lightly abrade and alcohol degrease. 0 2 4 6 8 10 12 14 GRP CFRP SMC ABS PVC PMMA Polycarbonate Polyamides MPa Lap shear strength versus temperature (ISO 4587) (typical average values) Cure: (a) = 7 days /23 C; (b) = 24 hours/23 C + 30 minutes/80 C 0 5 10 15 20 25 30 °C -40 -20 0 20 40 60 80 100 120 140 MPa a b Roller peel test (ISO 4578) Cured: 16 hours/40 C 3.0 N/mm Glass transition temperature (DSC) Cure: 24 hours at 23 C plus 1 hour at 80 C: ca. 85 C Shear modulus (DIN 53445) Cure: 16 hours/40 C 50 C - 1.2 GPa 75 C - 400 MPa 100 C - 180 Mpa 125 C - 20 Mpa E - modulus (ISO R527) at 23 C 4 GPa April 2007 Araldite® 2014-1 4/6 Flexural Properties (ISO 178) Cure 16 hours/ 40ºC Cure 1 day/ 23°C +30mins/ 80°C tested at 23°C Flexural Strength 61 MPa Flexural Modulus 4355 MPa Tensile strength (ISO R527) at 23 C 26 MPa Elongation at break 0,7% Lap shear strength versus immersion in various media (typical average values) Unless otherwise stated, L.S.S. was determined after immersion for 90 days at 23 C 0 5 10 15 20 25 30 As-made value IMS Gasoline (petrol) Ethyl acetate Acetic acid, 10% Xylene Lubricating oil Paraffin Water at 23°C Water at 60°C Water at 90°C 30 days 60 days 90 days MPa Cure: 16 hour/40°C Lap shear strength versus tropical weathering (40/92, DIN 50015; typical average values) Cure: 16 hours/40C Test: at 23 C 0 5 10 15 20 25 As made value After 30 days After 60 days After 90 days MPa April 2007 Araldite® 2014-1 5/6 Lap shear strength versus heat ageing Cure: 16 hours/40 C 0 5 10 15 20 25 As-made value 30 days/ 70°C 60 days/ 70°C 90 days/ 70°C MPa April 2007 Araldite® 2014-1 6/6 Huntsman Advanced Materials All recommendations for the use of our products, whether given by us in writing, verbally, or to be implied from the results of tests carried out by us, are based on the current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility therefor. The Buyer shall ensure that the intended use of the products will not infringe any third party s intellectual property rights. We warrant that our products are free from defects in accordance with and subject to our general conditions of supply. Storage Araldite 2014-1A and Araldite 2014-1/B may be stored for up to 3 years at room temperature provided the components are stored in sealed containers. The expiry date is indicated on the label. Handling precautions Caution Our products are generally quite harmless to handle provided that certain precautions normally taken when handling chemicals are observed. The uncured materials must not, for instance, be allowed to come into contact with foodstuffs or food utensils, and measures should be taken to prevent the uncured materials from coming in contact with the skin, since people with particularly sensitive skin may be affected. The wearing of impervious rubber or plastic gloves will normally be necessary; likewise the use of eye protection. The skin should be thoroughly cleansed at the end of each working period by washing with soap and warm water. The use of solvents is to be avoided. Disposable paper - not cloth towels - should be used to dry the skin. Adequate ventilation of the working area is recommended. These precautions are described in greater detail in the Material Safety Data sheets for the individual products and should be referred to for fuller information. Huntsman Advanced Materials (Switzerland) GmbH Klybeckstrasse 200 4057 Basel Switzerland Tel: +41 (0)61 966 33 33 Fax: +41 (0)61 966 35 19 www.huntsman.com/advanced_materials Huntsman Advanced Materials warrants only that its products meet the specifications agreed with the buyer. Typical properties, where stated, are to be considered as representative of current production and should not be treated as specifications. The manufacture of materials is the subject of granted patents and patent applications; freedom to operate patented processes is not implied by this publication. While all the information and recommendations in this publication are, to the best of our knowledge, information and belief, accurate at the date of publication, NOTHING HEREIN IS TO BE CONSTRUED AS A WARRANTY, EXPRESS OR OTHERWISE. IN ALL CASES, IT IS THE RESPONSIBILITY OF THE USER TO DETERMINE THE APPLICABILITY OF SUCH INFORMATION AND RECOMMENDATIONS AND THE SUITABILITY OF ANY PRODUCT FOR ITS OWN PARTICULAR PURPOSE. The behaviour of the products referred to in this publication in manufacturing processes and their suitability in any given end-use environment are dependent upon various conditions such as chemical compatibility, temperature, and other variables, which are not known to Huntsman Advanced Materials. It is the responsibility of the user to evaluate the manufacturing circumstances and the final product under actual end-use requirements and to adequately advise and warn purchasers and users thereof. Products may be toxic and require special precautions in handling. The user should obtain Safety Data Sheets from Huntsman Advanced Materials containing detailed information on toxicity, together with proper shipping, handling and storage procedures, and should comply with all applicable safety and environmental standards. Hazards, toxicity and behaviour of the products may differ when used with other materials and are dependent on manufacturing circumstances or other processes. Such hazards, toxicity and behaviour should be determined by the user and made known to handlers, processors and end users. Except where explicitly agreed otherwise, the sale of products referred to in this publication is subject to the general terms and conditions of sale of Huntsman Advanced Materials LLC or of its affiliated companies including without limitation, Huntsman Advanced Materials (Europe) BVBA, Huntsman Advanced Materials Americas Inc., and Huntsman Advanced Materials (Hong Kong) Ltd. Huntsman Advanced Materials is an international business unit of Huntsman Corporation. Huntsman Advanced Materials trades through Huntsman affiliated companies in different countries including but not limited to Huntsman Advanced Materials LLC in the USA and Huntsman Advanced Materials (Europe) BVBA in Europe. [Araldite® 2014-1] is a registered trademark of Huntsman Corporation or an affiliate thereof. Copyright © 2007 Huntsman Corporation or an affiliate thereof. All rights reserved. Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France : 1.1 Identifiant du produit 1.3 Renseignements concernant le fournisseur de la fiche de données de sécurité Adresse email de la personne responsable pour cette FDS : Global_Product_EHS_AdMat@huntsman.com Description du produit : Non disponible. 1.2 Utilisations identifiées pertinentes de la substance ou du mélange et utilisations déconseillées SECTION 1: Identification de la substance/du mélange et de la société/l’entreprise Code du produit : 00057058 1.4 Numéro d’appel d’urgence Organisme de conseil/centre antipoison national Fournisseur Numéro de téléphone : EUROPE: +32 35 75 1234 France ORFILA: +33(0)145425959 ASIA: +65 6336-6011 China: +86 20 39377888 Australia: 1800 786 152 New Zealand: 0800 767 437 USA: +1/800/424.9300 Système Utilisation du produit : adhésif bi-composants Fournisseur : Huntsman Advanced Materials (Europe)BVBA Everslaan 45 3078 Everberg / Belgium Tel.: +41 61 299 20 41 Fax: +41 61 299 20 40 France : ORFILA 01.45.42.59.59 - Hors de France : +33.(0)1.45.42.59.59 Classification Xi; R41, R38 R43 N; R51/53 : Dangers pour la santé : humaine Risque de lésions oculaires graves. Irritant pour la peau. Peut entraîner une sensibilisation par contact avec la peau. Dangers pour : l’environnement Toxique pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. Pour plus de détails sur les conséquences en termes de santé et les symptômes, reportez-vous à la section 11. SECTION 2: Identification des dangers 2.1 Classification de la substance ou du mélange Définition du produit : Working pack (preparation) Voir section 16 pour le texte intégral des phrases R et mentions H déclarées ci-dessus. Classification selon la directive 1999/45/CE [DPD] Le produit est classé dangereux selon la directive 1999/45/CE et ses amendements. 2.2 Éléments d’étiquetage Date d'édition / Date de révision : 3 Août 2011 1/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 2/19 SECTION 2: Identification des dangers Autres dangers qui ne : donnent pas lieu à une classification Non disponible. Récipients devant être pourvus d'une fermeture de sécurité pour les enfants Non applicable. Avertissement tactile de danger Non applicable. : : Exigences d‘emballages spéciaux Symbole(s) de danger Conseils de prudence S26- En cas de contact avec les yeux, laver immédiatement et abondamment avec de l'eau et consulter un spécialiste. S39- Porter un appareil de protection des yeux/du visage. S61- Éviter le rejet dans l'environnement. Consulter les instructions spéciales/la fiche de données de sécurité. R41- Risque de lésions oculaires graves. R38- Irritant pour la peau. R43- Peut entraîner une sensibilisation par contact avec la peau. R51/53- Toxique pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. Phrases de risque Ingrédients dangereux : : : : Irritant, Dangereux pour l'environnement produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) résine époxidique à base de bisphénol F éther diglycidique du 1,4-butanediol N(3-diméthylaminopropyl)-1,3-propylènediamine Indication de danger : 2.3 Autres dangers Éléments d’étiquetage supplémentaires : Contient des composés époxydiques. Voir les informations transmises par le fabricant. Substance/préparation : Working pack (preparation) Nom du Identifiants 67/548/CEE produit/composant SECTION 3: Composition/informations sur les composants % Règlement (CE) Type n° 1272/2008 [CLP] Classification produit de réaction: bisphénol-Aépichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) REACH #: 01- 2119456619-26 CAS: 25068-38-6 13 - 30 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] résine époxidique à base de bisphénol F REACH #: 01- 2119454392-40 CAS: 9003-36-5 3 - 7 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] éther diglycidique du 1,4-butanediol REACH #: 01- 2119494060-45 CAS: 2425-79-8 1 - 3 Xn; R20/21 Xi; R36/38 Acute Tox. 4, H312 Acute Tox. 4, H332 [1] Date d'édition / Date de révision : 3 Août 2011 2/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 3/19 SECTION 3: Composition/informations sur les composants Les limites d'exposition professionnelle, quand elles sont disponibles, sont énumérées à la section 8. Dans l'état actuel des connaissances du fournisseur et dans les concentrations d'application, aucun autre ingrédient présent n'est classé comme dangereux pour la santé ou l'environnement, et donc nécessiterait de figurer dans cette section. Voir section 16 pour le texte intégral des phrases R mentionnées cidessus Voir section 16 pour le texte intégral des mentions H déclarées ci-dessus. R43 R52/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 N(3- diméthylaminopropyl)- 1,3-propylènediamine CAS: 10563-29-8 1 - 3 Xn; R21/22 C; R34 R43 Acute Tox. 4, H302 Acute Tox. 4, H312 Skin Corr. 1B, H314 Eye Dam. 1, H318 Skin Sens. 1, H317 [1] diglycidylester de l'acide téréphthalique CAS: 7195-44-0 0.1 - 1 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] triglycidylester de l'acide trimellitique CAS: 7237-83-4 0.1 - 1 Xi; R36/38 R43 N; R51/53 Skin Irrit. 2, H315 Eye Irrit. 2, H319 Skin Sens. 1, H317 Aquatic Chronic 2, H411 [1] [1] Substance classée avec un danger pour la santé ou l'environnement [2] Substance avec une limite d'exposition au poste de travail [3] La substance remplit les critères des PTB selon le Règlement (CE) n° 1907/2006, Annexe XIII [4] La substance remplit les critères des tPtB selon le Règlement (CE) n° 1907/2006, Annexe XIII Type Contact avec la peau Consulter un médecin immédiatement. Rincer immédiatement les yeux à grande eau, en soulevant de temps en temps les paupières supérieures et inférieures. Vérifier si la victime porte des verres de contact et dans ce cas, les lui enlever. Continuez de rincer pendant 10 minutes au moins. Les brûlures chimiques doivent être traitées sans tarder par un médecin. Rincer la peau contaminée à grande eau. Retirer les vêtements et les chaussures contaminés. Laver abondamment à l'eau les vêtements contaminés avant de les retirer, ou porter des gants. Continuez de rincer pendant 10 minutes au moins. Consulter un médecin. En cas d'affections ou de symptômes, évitez d'exposer plus longuement. Laver les vêtements avant de les réutiliser. Laver les chaussures à fond avant de les remettre. 4.1 Description des premiers secours Transporter la victime à l'extérieur et la maintenir au repos dans une position où elle peut confortablement respirer. S'il ne respire pas, en cas de respiration irrégulière ou d'arrêt respiratoire, que le personnel qualifié pratique la respiration artificielle ou administre de l'oxygène. Il peut être dangereux pour la personne assistant une victime de pratiquer le bouche à bouche. Appelez un médecin en cas de persistance ou d'aggravation des effets néfastes sur la santé. En cas d'évanouissement, placez la personne en position latérale de sécurité et appelez un médecin immédiatement. Assurez-vous d'une bonne circulation d'air. Détacher tout ce qui pourrait être serré, comme un col, une cravate, une ceinture ou un ceinturon. En cas d’inhalation de produits de décomposition lors d’un incendie, les symptômes peuvent être différés. La personne exposée peut avoir besoin de rester sous surveillance médicale pendant 48 heures. Inhalation Contact avec les yeux : : : SECTION 4: Premiers secours Date d'édition / Date de révision : 3 Août 2011 3/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 4/19 SECTION 4: Premiers secours Rincez la bouche avec de l'eau. Enlever les prothèses dentaires s'il y a lieu. Transporter la victime à l'extérieur et la maintenir au repos dans une position où elle peut confortablement respirer. Si une personne a avalé de ce produit et est consciente, lui faire boire de petites quantités d’eau. Si la personne est indisposée, cesser de la faire boire car des vomissements pourraient entraîner un risque supplémentaire. Ne pas faire vomir sauf indication contraire émanant du personnel médical. En cas de vomissement, maintenez la tête vers le bas pour empêcher le passage des vomissures dans les poumons. Appelez un médecin en cas de persistance ou d'aggravation des effets néfastes sur la santé. Ne rien faire ingérer à une personne inconsciente. En cas d'évanouissement, placez la personne en position latérale de sécurité et appelez un médecin immédiatement. Assurez-vous d'une bonne circulation d'air. Détacher tout ce qui pourrait être serré, comme un col, une cravate, une ceinture ou un ceinturon. Note au médecin traitant En cas d’inhalation de produits de décomposition lors d’un incendie, les symptômes peuvent être différés. La personne exposée peut avoir besoin de rester sous surveillance médicale pendant 48 heures. Ingestion : : Traitements spécifiques Protection des sauveteurs : Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Il peut être dangereux pour la personne assistant une victime de pratiquer le bouche à bouche. Laver abondamment à l'eau les vêtements contaminés avant de les retirer, ou porter des gants. 4.2 Effets et symptômes les plus importants, aigus ou différés Effets aigus potentiels sur la santé Inhalation : L'exposition aux produits de décomposition peut présenter des risques pour la santé. Les effets graves d’une exposition peuvent être différés. Irritant pour la bouche, Ingestion : la gorge et l'estomac. Contact avec la peau : Irritant pour la peau. Peut entraîner une sensibilisation par contact avec la peau. Contact avec les yeux : Gravement irritant pour les yeux. Risque de lésions oculaires graves. Signes/symptômes de surexposition Contact avec la peau Ingestion Inhalation Aucune donnée spécifique. Aucune donnée spécifique. Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: irritation rougeur : : : Contact avec les yeux : Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: douleur ou irritation larmoiement rougeur 4.3 Indication quant à la nécessité d’une prise en charge médicale immédiate ou d’un traitement spécial : Traitement symptomatique et thérapie de soutien comme indiqué. Après une exposition sévère le patient doit être gardé sous contrôle médical pendant au moins 48 heures. Utiliser un agent extincteur approprié pour étouffer l'incendie avoisinant. 5.1 Moyens d’extinction Aucun connu. Moyens d’extinction appropriés : Moyens d’extinction inappropriés : SECTION 5: Mesures de lutte contre l’incendie 5.2 Dangers particuliers résultant de la substance ou du mélange Date d'édition / Date de révision : 3 Août 2011 4/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 5/19 SECTION 5: Mesures de lutte contre l’incendie En présence d'incendie, circonscrire rapidement le site en évacuant toute personne se trouvant près des lieux de l'accident. Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Ce produit est toxique pour les organismes aquatiques. L'eau du réseau d'extinction d'incendie qui a été contaminée par ce produit doit être conservée en milieu fermé et ne doit être déversée ni dans le milieu aquatique, ni aucun égout ou conduit d'évacuation. Risque lié aux produits de décomposition thermique Dangers dus à la substance ou au mélange Les produits de décomposition peuvent éventuellement comprendre les substances suivantes: dioxyde de carbone monoxyde de carbone oxydes d'azote oxydes de soufre oxyde/oxydes de métal L’augmentation de pression résultant d’un incendie ou d’une exposition à des températures élevées peut provoquer l’explosion du conteneur. Les pompiers devront porter un équipement de protection approprié ainsi qu'un appareil de protection respiratoire autonome avec masque intégral fonctionnant en mode pression positive. Les vêtements pour sapeurs-pompiers (y compris casques, bottes de protection et gants) conformes à la Norme européenne EN 469 procurent un niveau de protection de base contre les accidents chimiques. Équipement de protection spécial pour le personnel préposé à la lutte contre l'incendie : : : 5.3 Conseils aux pompiers Précautions spéciales pour les pompiers : 6.2 Précautions pour la protection de l’environnement Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone de déversement accidentel. S'approcher des émanations dans la même direction que le vent. Bloquer toute pénétration possible dans les égouts, les cours d’eau, les caves ou les zones confinées. Laver le produit répandu dans une installation de traitement des effluents ou procéder comme suit. Contenir les fuites et les ramasser à l'aide de matières absorbantes non combustibles telles que le sable, la terre, la vermiculite, la terre à diatomées. Les placer ensuite dans un récipient pour élimination conformément à la réglementation locale. Élimination par une entreprise Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Informez les autorités compétentes en cas de pollution de l'environnement (égouts, voies d'eau, sol et air) par le produit. Matière propre à polluer l’eau. Peut-être nocif pour l'environnement en cas de déversement de grandes quantités. Grand déversement accidentel : Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone de déversement accidentel. Diluer avec de l'eau et éponger si la matière est soluble dans l'eau. Sinon, ou si la matière est insoluble dans l'eau, absorber avec un matériau sec inerte et placer dans un conteneur à déchets approprié. Élimination par une entreprise autorisée de collecte des déchets. Petit déversement accidentel : 6.3 Méthodes et matériel de confinement et de nettoyage SECTION 6: Mesures à prendre en cas de dispersion accidentelle 6.1 Précautions individuelles, équipement de protection et procédures d’urgence Pour le personnel autre que le personnel d’intervention : Pour les agents d'intervention : Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence de formation appropriée. Évacuer les environs. Empêcher l'accès aux personnes non requises et ne portant pas de vêtements de protection. NE PAS TOUCHER ni marcher dans le produit répandu. Éviter de respirer les vapeurs ou le brouillard. Assurer une ventilation adéquate. Porter un appareil de protection respiratoire approprié lorsque le système de ventilation est inadéquat. Porter un équipement de protection individuelle adapté. Si des vêtements spécifiques sont nécessaires pour traiter le déversement, consulter la section 8 pour les matériaux appropriés et inappropriés. Voir également la section 8 pour plus d'informations sur les mesures d'hygiène. : Date d'édition / Date de révision : 3 Août 2011 5/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 6/19 SECTION 6: Mesures à prendre en cas de dispersion accidentelle autorisée de collecte des déchets. Les matériaux absorbants contaminés peuvent présenter les mêmes risques que le produit répandu. 6.4 Référence à d’autres sections Voir section 1 pour les coordonnées d'urgence. Voir la section 8 pour toute information sur les équipements de protection individuelle adaptés. Voir la section 13 pour toute information supplémentaire sur le traitement des déchets. : Stocker entre les températures suivantes: 2 à 40°C (35.6 à 104°F). Stocker conformément à la réglementation locale. Stocker dans le récipient d'origine à l'abri de la lumière directe du soleil dans un endroit sec, frais et bien ventilé à l'écart des matériaux incompatibles (cf. la section 10). Garder le récipient hermétiquement fermé lorsque le produit n'est pas utilisé. Les récipients ayant été ouverts doivent être refermés avec soin et maintenus en position verticale afin d'éviter les fuites. Ne pas stocker dans des conteneurs non étiquetés. Utiliser un récipient approprié pour éviter toute contamination du milieu ambiant. SECTION 7: Manipulation et stockage Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition. 7.1 Précautions à prendre pour une manipulation sans danger Mesures de protection : Conseils sur l'hygiène professionnelle en général : 7.2 Conditions d’un stockage sûr, y compris d’éventuelles incompatibilités 7.3 Utilisations finales spécifiques Recommandations : Solutions spécifiques au : secteur industriel Non disponible. Non disponible. Revêtir un équipement de protection individuelle approprié (voir Section 8). Les personnes ayant des antécédents de sensibilisation cutanée ne doivent pas intervenir dans les processus utilisant ce produit. Ne pas mettre en contact avec les yeux, la peau ou les vêtements. Ne pas ingérer. Éviter de respirer les vapeurs ou le brouillard. Éviter le rejet dans l'environnement. Consulter les instructions spéciales/la fiche de données de sécurité. Garder dans le conteneur d'origine ou dans un autre conteneur de substitution homologué fabriqué à partir d'un matériau compatible et tenu hermétiquement clos lorsqu'il n'est pas utilisé. Les conteneurs vides retiennent des résidus de produit et peuvent présenter un danger. Ne pas réutiliser ce conteneur. Il est interdit de manger, boire ou fumer dans les endroits où ce produit est manipulé, entreposé ou mis en oeuvre. Il est recommandé au personnel de se laver les mains et la figure avant de manger, boire ou fumer. Retirer les vêtements contaminés et les équipements de protection avant d'entrer dans un lieu de restauration. Voir également la section 8 pour plus d'informations sur les mesures d'hygiène. : Classe de danger de stockage Huntsman Advanced Materials : Classe de stockage 10, Liquide nocif pour l'ambience Date d'édition / Date de révision : 3 Août 2011 6/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 7/19 Procédures de surveillance recommandées Limites d'exposition professionnelle Si ce produit contient des ingrédients présentant des limites d'exposition, il peut s'avérer nécessaire d'effectuer un examen suivi des personnes, de l'atmosphère sur le lieu de travail ou des organismes vivants pour déterminer l'efficacité de la ventilation ou d'autres mesures de contrôle ou évaluer le besoin d'utiliser du matériel de protection des voies respiratoires. Il importe de vous reporter à la norme européenne EN 689 concernant les méthodes pour évaluer l'exposition par inhalation aux agents chimiques et aux documents de politique générale nationaux relatifs aux méthodes pour déterminer les substances dangereuses. Protection des mains Le port de gants imperméables et résistants aux produits chimiques conformes à une norme approuvée, est obligatoire en tout temps lors de la manutention de produits chimiques si une évaluation des risques le préconise. Utiliser une protection oculaire conforme à une norme approuvée dès lors qu'une évaluation du risque indique qu'il est nécessaire d'éviter l'exposition aux projections de liquides, aux fines particules pulvérisées ou aux poussières. Protection oculaire/faciale Aucune valeur de limite d'exposition connue. : : : Protection de la peau Contrôles d’ingénierie appropriés : Aucune ventilation particulière requise. Une bonne ventilation générale devrait être suffisante pour contrôler l'exposition du technicien aux contaminants en suspension dans l'air. Si ce produit contient des composants pour lesquels des contraintes liées à l'exposition existent, utiliser des enceintes de protection, une ventilation locale par aspiration, ou d'autres moyens de contrôle automatiques intégrés afin de maintenir le seuil d'exposition du technicien inférieur aux limites recommandées ou légales. Se laver abondamment les mains, les avant-bras et le visage après avoir manipulé des produits chimiques, avant de manger, de fumer et d'aller aux toilettes ainsi qu'à la fin de la journée de travail. Il est recommandé d'utiliser les techniques appropriées pour retirer les vêtements potentiellement contaminés. Les vêtements de travail contaminés ne devraient pas sortir du lieu de travail. Laver les vêtements contaminés avant de les réutiliser. S'assurer que les dispositifs rince-oeil automatiques et les douches de sécurité se trouvent à proximité de l'emplacement des postes de travail. 8.2 Contrôles de l’exposition Mesures d'hygiène : Aucune DEL disponible. Concentrations prédites avec effet Aucune PEC disponible. SECTION 8: Contrôles de l’exposition/protection individuelle Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition. 8.1 Paramètres de contrôle Doses dérivées avec effet Mesures de protection individuelles Les limites d'exposition sur la place de travail doivent être dans les normes (poussière totale, poussière de quartz potentiellement inhalable). Si les limites sont dépassées, portez un masque à poussière approprié. A T T E N T I O N ! Ce produit contient du quartz, classé par l'IARC parmi les substances carcinogènes pour l'homme (Groupe 1), pouvant causer une silicose ou un cancer des poumons par inhalation des poussières. Il est donc important d'éviter de s'exposer à toute inhalation lors des opérations mécaniques effectuées avec le produit fini (mouture, décapage, coupe...). QUARTZ (CAS RN 14808-60-7): France: TWA: 0.1 mg/m³ 8 hour(s). Form: respirable aerosol Suisse: TWA: 0.15 mg/m³ 8 hour(s). Form: respirable dust Belgique: TWA: 0.1 mg/m³ 8 hour(s). Form: respirable dust Date d'édition / Date de révision : 3 Août 2011 7/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 8/19 SECTION 8: Contrôles de l’exposition/protection individuelle Lorsque la ventilation du local est insuffisante, porter un équipement de protection respiratoire. Le choix de l'appareil de protection respiratoire doit être fondé sur les niveaux d'expositions prévus ou connus, les dangers du produit et les limites d'utilisation sans danger de l'appareil de protection respiratoire retenu. Protection respiratoire : L'équipement de protection personnel pour le corps devra être choisi en fonction de la tâche à réaliser ainsi que des risques encourus, et il est recommandé de le faire valider par un spécialiste avant de procéder à la manipulation du produit. : Contrôle de l'exposition de l'environnement : Il importe de tester les émissions provenant des systèmes de ventilation ou du matériel de fabrication pour vous assurer qu'elles sont conformes aux exigences de la législation sur la protection de l'environnement. Dans certains cas, il sera nécessaire d'équiper le matériel de fabrication d'un épurateur de gaz ou d'un filtre ou de le modifier techniquement afin de réduire les émissions à des niveaux acceptables. Protection corporelle : Autre protection cutanée Des chaussures adéquates et toutes mesures de protection corporelle devraient être déterminées en fonction de l'opération effectuée et des risques impliqués, et devraient être approuvées par un spécialiste avant toute manipulation de ce produit. Alcool éthylvinylique laminé (EVAL), caoutchouc butyle néoprène, Matériaux pour gants caoutchouc nitrile pour utilisation à court terme/projection (10 min480 min): Non disponible. État physique Point de fusion/point de congélation Point d'ébullition initial et intervalle d'ébullition Liquide. [Pâte.] Non disponible. Odeur Non disponible. pH Couleur Non disponible. Vitesse d'évaporation Non disponible. Point d'éclair Vase clos: >100°C [DIN 51758 EN 22719 (Pensky-Martens Closed Cup)] Non disponible. Non disponible. Seuil d'odeur Non disponible. Limites supérieures/inférieures d'inflammabilité ou d'explosion : : : : : : : : : : 9.1 Informations sur les propriétés physiques et chimiques essentielles Aspect Durée de combustion Non applicable. Vitesse de combustion Non applicable. : : SECTION 9: Propriétés physiques et chimiques Inflammabilité (solide, gaz) : Non disponible. Date d'édition / Date de révision : 3 Août 2011 8/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 9/19 SECTION 9: Propriétés physiques et chimiques Pression de vapeur Densité relative Densité de vapeur Solubilité(s) Non disponible. Non disponible. Non disponible. Température d'autoinflammation Non disponible. Non disponible. Non disponible. Viscosité Non disponible. Coefficient de partage noctanol/ eau Propriétés d'explosivité : : : : : : : Propriétés comburantes : Non disponible. 9.2 Autres informations Température de décomposition : Non disponible. Masse volumique : 1.4 g/cm3 [20°C (68°F)] Solubilité dans l'eau : 10.6 Produits de décomposition dangereux 10.4 Conditions à éviter Aucune donnée spécifique. Dans des conditions normales de stockage et d'utilisation, aucun produit de décomposition dangereux ne devrait apparaître. 10.2 Stabilité chimique Le produit est stable. Aucune donnée spécifique. : : : 10.5 Matières incompatibles : 10.3 Possibilité de réactions dangereuses : Dans des conditions normales de stockage et d'utilisation, aucune réaction dangereuse ne se produit. SECTION 10: Stabilité et réactivité 10.1 Réactivité : Aucune donnée d'essai spécifique relative à la réactivité n'est disponible pour ce produit ou ses composants. Toxicité aiguë produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) CL0 Inhalation Vapeurs Rat - Mâle 0.00001 ppm 5 heures DL50 Cutané Rat - Mâle, Femelle >2000 mg/kg - DL50 Orale Rat - Femelle >2000 mg/kg - résine époxidique à base de bisphénol F DL50 Cutané Rat - Mâle, Femelle >2000 mg/kg - DL50 Orale Rat - Mâle, >5000 mg/kg - Nom du produit/composant Endpoint Espèces Résultat Exposition SECTION 11: Informations toxicologiques 11.1 Informations sur les effets toxicologiques Date d'édition / Date de révision : 3 Août 2011 9/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 10/19 SECTION 11: Informations toxicologiques Femelle éther diglycidique du 1,4- butanediol DL50 Cutané Rat - Mâle, Femelle >2150 mg/kg - DL50 Orale Rat - Mâle, Femelle 1163 mg/kg - N(3-diméthylaminopropyl)- 1,3-propylènediamine DL50 Cutané Lapin 1310 mg/kg - DL50 Orale Rat 1670 mg/kg - Mutagénicité Irritation/Corrosion produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 404 Effet irritant/corrosif aigu sur la peau Lapin Faiblement irritant OECD 405 Effet irritant/corrosif aigu sur les yeux Lapin Faiblement irritant résine époxidique à base de bisphénol F OECD 405 Effet irritant/corrosif aigu sur les yeux Lapin Non irritant. OECD 404 Effet irritant/corrosif aigu sur la peau Lapin Faiblement irritant éther diglycidique du 1,4- butanediol OECD 404 Effet irritant/corrosif aigu sur la peau Lapin Non irritant. OECD 405 Effet irritant/corrosif aigu sur les yeux Lapin Irritant puissant Nom du produit/composant Test Résultat Conclusion/Résumé : Peau : produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700): Légèrement irritant pour la peau. résine époxidique à base de bisphénol F: Légèrement irritant pour la peau. éther diglycidique du 1,4-butanediol: Non irritant pour la peau. Yeux : produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700): Légèrement irritant pour les yeux. résine époxidique à base de bisphénol F: Non irritant pour les yeux. éther diglycidique du 1,4-butanediol: Gravement irritant pour les yeux. Non disponible. Sensibilisant produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 429 Sensibilisation cutanée : essai des ganglions lymphatiques locaux peau Souris Sensibilisant résine époxidique à base de bisphénol F OECD 429 Sensibilisation cutanée : essai des ganglions lymphatiques locaux peau Souris Sensibilisant éther diglycidique du 1,4- butanediol OECD 406 Sensibilisation de la peau peau cobaye Sensibilisant Nom du produit/composant Test Voie d'exposition Résultat Conclusion/Résumé : Non disponible. Espèces Espèces Date d'édition / Date de révision : 3 Août 2011 10/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 11/19 SECTION 11: Informations toxicologiques Cancérogénicité produit de réaction: bisphénol-Aépichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 453 Etudes combinées de toxicité chronique et de cancérogénèse Rat 2 années; 7 jours par semaine Négatif Orale - OECD 453 Etudes combinées de toxicité chronique et de cancérogénèse Rat 2 années; 5 jours par semaine Négatif Cutané - OECD 453 Etudes combinées de toxicité chronique et de cancérogénèse Souris 2 années; 3 jours par semaine Négatif Cutané - Nom du produit/composant Test Espèces Exposition Résultat produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 471 Essai de mutation réverse sur des bactéries Positif OECD 476 Essai in vitro de mutation génique sur des cellules de mammifères Positif OECD 478 Toxicologie génétique : Essai de mutation létale dominante chez le rongeur Négatif EPA OPPTS Négatif résine époxidique à base de bisphénol F OECD 471 Essai de mutation réverse sur des bactéries Positif OECD 476 Essai in vitro de mutation génique sur des cellules de mammifères Positif OECD 473 Essai d'aberration chromosomique in vitro chez les mammifères Positif OECD 474 Le test de micronoyaux sur les érythrocytes de mammifère Négatif OECD 486 Essai de synthèse non programmée de l’ADN (UDS) sur des hépatocytes de mammifères in vivo Négatif éther diglycidique du 1,4- butanediol OECD 471 Essai de mutation réverse sur des bactéries Positif OECD 473 Essai d'aberration chromosomique in vitro chez les mammifères Positif OECD 474 Le test de micronoyaux sur les érythrocytes de mammifère Négatif Nom du produit/composant Test Résultat Conclusion/Résumé : Non disponible. Toxicité pour la reproduction Nom du produit/composant Test Espèces Résultat/Type de résultat Organes cibles Voie d'exposition Organes cibles Date d'édition / Date de révision : 3 Août 2011 11/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 12/19 SECTION 11: Informations toxicologiques Effets chroniques potentiels pour la santé Effets aigus potentiels sur la santé Inhalation : L'exposition aux produits de décomposition peut présenter des risques pour la santé. Les effets graves d’une exposition peuvent être différés. Irritant pour la bouche, Ingestion : la gorge et l'estomac. Contact avec la peau : Irritant pour la peau. Peut entraîner une sensibilisation par contact avec la peau. Contact avec les yeux : Gravement irritant pour les yeux. Risque de lésions oculaires graves. Nom du produit/composant Test Type de résultat Résultat Organes cibles Tératogénicité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 414 Etude de la toxicité pour le développement prénatal Rat - Femelle >540 mg/kg Pas d'effets observés à : EPA CFR Lapin - Femelle >300 mg/kg Pas d'effets observés à : OECD 414 Etude de la toxicité pour le développement prénatal Lapin - Femelle 180 mg/kg NOAEL résine époxidique à base de bisphénol F EPA CFR Lapin - Femelle >300 mg/kg Pas d'effets observés à : Nom du produit/composant Test Espèces Résultat/Type de résultat produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 416 Étude de toxicité pour la reproduction sur deux générations Rat Orale: 540 mg/kg Pas d'effets observés à : - résine époxidique à base de bisphénol F OECD 416 Étude de toxicité pour la reproduction sur deux générations Rat Orale: 540 mg/kg Pas d'effets observés à : - Symptômes correspondant aux caractéristiques physiques, chimiques et toxicologiques Contact avec la peau Ingestion Inhalation Aucune donnée spécifique. Aucune donnée spécifique. Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: irritation rougeur : : : Contact avec les yeux : Les symptômes néfastes peuvent éventuellement comprendre ce qui suit: douleur ou irritation larmoiement rougeur Informations sur les voies Non disponible. d’exposition probables : Effets retardés, effets immédiats et effets chroniques d’une exposition à court ou long terme Exposition de courte durée Exposition prolongée Effets potentiels immédiats Effets potentiels différés : : Effets potentiels immédiats Effets potentiels différés : : Non disponible. Non disponible. Non disponible. Non disponible. Date d'édition / Date de révision : 3 Août 2011 12/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 13/19 SECTION 11: Informations toxicologiques Une fois sensibilisé, une vive réaction allergique peut éventuellement se déclencher lors d'une exposition ultérieure à de très faibles niveaux. Généralités : Aucun effet important ou Cancérogénicité : danger critique connu. Mutagénicité : Aucun effet important ou danger critique connu. Tératogénicité : Aucun effet important ou danger critique connu. produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD 408 Toxicité orale à doses répétées –rongeurs : 90 jours NOAEL Subchronique NOAEL Oral 50 mg/kg - OECD 411 Toxicité cutanée subchronique : 90 jours Pas d'effets observés à : Subchronique Pas d'effets observés à : Dermal 10 mg/kg - OECD 411 Toxicité cutanée subchronique : 90 jours NOAEL Subchronique NOAEL Dermal 100 mg/kg - résine époxidique à base de bisphénol F OECD 408 Toxicité orale à doses répétées –rongeurs : 90 jours NOAEL Subchronique NOAEL Oral 250 mg/kg - éther diglycidique du 1,4- butanediol OECD 407 Toxicité orale à dose répétée - pendant 28 jours sur les rongeurs NOAEL Subchronique NOAEL Oral 200 mg/kg - Conclusion/Résumé : Non disponible. Effets sur le développement : Aucun effet important ou danger critique connu. Effets sur la fertilité : Aucun effet important ou danger critique connu. Autres informations : Non disponible. 12.1 Toxicité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) - Aiguë CE50 72 heures Static Algues 9.4 mg/L OECD 202 Daphnia sp. Essai d'immobilisation immédiate Aiguë CE50 48 heures Static Daphnie 1.7 mg/L - Aiguë CI50 3 heures Static Bactéries >100 mg/L OECD 203 Poisson, essai de toxicité aiguë Aiguë CL50 96 heures Static Poisson 1.5 mg/L OECD 211 Daphnia magna, essai de reproduction Chronique NOEC 21 jours Semistatic Daphnie 0.3 mg/L résine époxidique à base de bisphénol F OECD 201 Algues, essai d'inhibition de la croissance Aiguë CE50 72 heures Static Algues 1.8 mg/L OECD OECD 202: Part I (Daphnia sp., Acute Immobilisation test) Aiguë CE50 48 heures Static Daphnie 1.6 mg/L - Aiguë CI50 3 heures Static Bactéries >100 mg/L OECD 203 Poisson, essai de Aiguë CL50 96 Poisson 0.55 mg/L Nom du produit/composant Exposition Espèces Résultat SECTION 12: Informations écologiques Test Endpoint Date d'édition / Date de révision : 3 Août 2011 13/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 14/19 SECTION 12: Informations écologiques LogPow FBC Potentiel 12.3 Potentiel de bioaccumulation Nom du produit/composant produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) 3.242 31 faible résine époxidique à base de bisphénol F 2.7 à 3.6 - élevée éther diglycidique du 1,4- butanediol -0.269 - faible Nom du produit/composant Demi-vie aquatique Photolyse Biodégradabilité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) Eau douce 4.83 jours Eau douce 3.58 jours Eau douce 7.1 jours - Non facilement résine époxidique à base de bisphénol F - - Non facilement éther diglycidique du 1,4- butanediol - - Non facilement toxicité aiguë heures Semistatic OECD 211 Daphnia magna, essai de reproduction Chronique NOEC 21 jours Semistatic Daphnie 0.3 mg/L éther diglycidique du 1,4- butanediol OECD 202 Daphnia sp. Essai d'immobilisation immédiate Aiguë CE50 24 heures Static Daphnie 75 mg/L OECD 201 Algues, essai d'inhibition de la croissance Aiguë EL50 72 heures Static Algues >160 mg/L OECD 209 Boue activée, essai d'inhibition de la respiration Aiguë CI50 3 heures Static Bactéries >100 mg/L OECD 203 Poisson, essai de toxicité aiguë Aiguë CL50 96 heures Static Poisson 24 mg/L 12.2 Persistance et dégradabilité produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700) OECD Derived from OECD 301F (Biodegradation Test) 28 jours 5 % résine époxidique à base de bisphénol F EU 28 jours 0 % éther diglycidique du 1,4- butanediol OECD 301F Biodégradabilité facile - Essai de respirometrie manométrique 28 jours 43 % Nom du produit/composant Test Résultat Conclusion/Résumé : produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700): Non facilement biodégradable. Période Date d'édition / Date de révision : 3 Août 2011 14/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 15/19 SECTION 12: Informations écologiques Mobilité : Non disponible. 12.6 Autres effets néfastes Aucun effet important ou danger critique connu. 12.4 Mobilité dans le sol Coefficient de répartition sol/eau (KOC) : Non disponible. 12.5 Résultats de l'évaluation PTB et tPtB : 12.7 Autres renseignements écologiques Non applicable. Catalogue Européen des Déchets Déchets Dangereux : Oui. Il est recommandé d'éviter ou réduire autant que possible la production de déchets. Ne pas éliminer de quantités significatives de déchets résiduels du produit par les égouts. Les traiter dans une usine de traitement des eaux usées appropriée. Élimination des produits excédentaires et non recyclables par une entreprise autorisée de collecte des déchets. La mise au rebut de ce produit, des solutions et des sous-produits devra en permanence respecter les exigences légales en matière de protection de l'environnement et de mise au rebut des déchets ainsi que les exigences de toutes les autorités locales. Recycler les déchets d'emballage. Envisager l'incinération ou la mise en décharge uniquement si le recyclage est impossible. Ne se débarrasser de ce produit et de son récipient qu'en prenant toutes précautions d'usage. Manipuler avec prudence les récipients vides non nettoyés ni rincés. Les conteneurs vides ou les sachets internes peuvent retenir des restes de produit. Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Méthodes d'élimination : des déchets SECTION 13: Considérations relatives à l’élimination Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition. 13.1 Méthodes de traitement des déchets Produit Emballage Code de déchets Désignation du déchet Méthodes d'élimination des déchets : Précautions particulières : 07 02 08* autres résidus de réaction et résidus de distillation Il est recommandé d'éviter ou réduire autant que possible la production de déchets. Recycler les déchets d'emballage. Envisager l'incinération ou la mise en décharge uniquement si le recyclage est impossible. Ne se débarrasser de ce produit et de son récipient qu'en prenant toutes précautions d'usage. Manipuler avec prudence les récipients vides non nettoyés ni rincés. Les conteneurs vides ou les sachets internes peuvent retenir des restes de produit. Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Date d'édition / Date de révision : 3 Août 2011 15/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 16/19 Matière dangereuse du point de vue de l'environnement, liquide, n.s.a. BISPHENOL A/F EPOXY RESIN 9 III Matière dangereuse du point de vue de l'environnement, liquide, n.s.a. (BISPHENOL A/F EPOXY RESIN) Polluant marin (produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids moléculaire moyen < 700), résine époxidique à base de bisphénol F) 9 III Matière dangereuse du point de vue de l'environnement, liquide, n.s.a. (BISPHENOL A/F EPOXY RESIN) UN3082 9 non disponible non disponible III UN3082 UN3082 Numéro d'identification du danger 90 Dispositions particulières 274 335 601 Code tunnel E Emergency schedules (EmS) F-A, S-F Avion passager et avion cargoLimitation de quantité: 450 L Instructions d'emballage 964 Avion cargo uniquementLimitation de quantité: 450 L Instructions d'emballage 964 SECTION 14: Informations relatives au transport ADR/RID IMDG IATA 14.1 Numéro ONU 14.2 Désignation officielle de transport ONU 14.3 Classe(s) de danger pour le transport 14.4 Groupe d’emballage ADN/ADNR Autres informations 14.5 Dangers pour l’environnement 14.6 Précautions particulières à prendre par l’utilisateur 14.7 Transport en vrac conformément à l’annexe II de la convention Marpol 73/78 et au recueil IBC Oui. Oui. Yes. Non disponible. Non disponible. Non disponible. : Non applicable. ADN/ADNR IMDG IATA ADR/RID SECTION 15: Informations réglementaires 15.1 Réglementations/législation d'hygiène, sécurité et environnement spécifique à la substance ou au mélange Règlement UE (CE) n° 1907/2006 (REACH) Annexe XIV - Liste des substances soumises à autorisation Substances extrêmement préoccupantes Aucun des composants n'est répertorié. Date d'édition / Date de révision : 3 Août 2011 16/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 17/19 SECTION 15: Informations réglementaires Réglementations nationales Autres Réglementations UE Annexe XVII - Restrictions Non applicable. applicables à la fabrication, à la mise sur le marché et à l'utilisation de certaines substances et préparations dangereuses et de certains articles dangereux : Inventaire d'Europe : Tous les composants sont répertoriés ou exclus. Surveillance médicale renforcée : Arrêté du 11 Juillet 1977 fixant la liste des travaux nécessitant une surveillance médicale renforcée: non concerné Substances chimiques sur liste noire : Non inscrit Substances chimiques sur liste prioritaire : Non inscrit Liste de la Directive IPPC (Prévention et Réduction Intégrées de la Pollution) - Air : Non inscrit Liste de la Directive IPPC (Prévention et Réduction Intégrées de la Pollution) - Eau : Non inscrit Liste des substances chimiques du tableau I de la Convention sur les armes chimiques : Non inscrit Liste des substances chimiques du tableau II de la Convention sur les armes chimiques : Non inscrit Liste des substances chimiques du tableau III de la Convention sur les armes chimiques : Non inscrit Réglementations Internationales 15.2 Évaluation de la sécurité chimique Ce produit contient des substances nécessitant encore une évaluation du risque chimique : Indique quels renseignements ont été modifiés depuis la version précédente. SECTION 16: Autres informations Abréviations et acronymes : ETA = Estimation de la Toxicité Aiguë CLP = Règlement 1272/2008/CE relatif à la classification, à l'étiquetage et à l'emballage des substances et des mélanges DNEL = Dose dérivée sans effet mention EUH = mention de danger spécifique CLP CPSE = concentration prédite sans effet RRN = Numéro d'enregistrement REACH Classification selon le Règlement (CE) n° 1272/2008 [CLP/SGH] Date d'édition / Date de révision : 3 Août 2011 17/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 18/19 SECTION 16: Autres informations Date d'impression 3 Août 2011 Date d'édition/ Date de révision Date de la précédente édition : : : R20/21- Nocif par inhalation et par contact avec la peau. R21/22- Nocif par contact avec la peau et par ingestion. R34- Provoque des brûlures. R41- Risque de lésions oculaires graves. R38- Irritant pour la peau. R36/38- Irritant pour les yeux et la peau. R43- Peut entraîner une sensibilisation par contact avec la peau. R51/53- Toxique pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. R52/53- Nocif pour les organismes aquatiques, peut entraîner des effets néfastes à long terme pour l'environnement aquatique. Texte intégral des phrases R : abrégées Texte intégral des classifications [DSD/DPD] : C - Corrosif Xn - Nocif Xi - Irritant N - Dangereux pour l'environnement 3 Août 2011 Aucune validation antérieure. Texte intégral des mentions : H abrégées Procédure employée pour déterminer la classification selon le Règlement (CE) n° 1272/2008 [CLP/SGH] Classification Justification Skin Irrit. 2, H315 Jugement expert Eye Dam. 1, H318 Jugement expert Skin Sens. 1, H317 Jugement expert Aquatic Chronic 2, H411 Jugement expert Texte intégral des classifications [CLP/SGH] : H302 Nocif en cas d'ingestion. H312 Nocif par contact cutané. H314 Provoque des brûlures de la peau et des lésions oculaires graves. H315 Provoque une irritation cutanée. H317 Peut provoquer une allergie cutanée. H318 Provoque des lésions oculaires graves. H319 Provoque une sévère irritation des yeux. H332 Nocif par inhalation. H411 Toxique pour les organismes aquatiques, entraîne des effets néfastes à long terme. Acute Tox. 4, H302 TOXICITÉ AIGUË: ORALE - Catégorie 4 Acute Tox. 4, H312 TOXICITÉ AIGUË: PEAU - Catégorie 4 Acute Tox. 4, H332 TOXICITÉ AIGUË: INHALATION - Catégorie 4 Aquatic Chronic 2, H411 DANGER CHRONIQUE POUR LE MILIEU AQUATIQUE - Catégorie 2 Eye Dam. 1, H318 LÉSIONS OCULAIRES GRAVES/IRRITATION OCULAIRE - Catégorie 1 Eye Irrit. 2, H319 LÉSIONS OCULAIRES GRAVES/IRRITATION OCULAIRE - Catégorie 2 Skin Corr. 1B, H314 CORROSION CUTANÉE/IRRITATION CUTANÉE - Catégorie 1B Skin Irrit. 2, H315 CORROSION CUTANÉE/IRRITATION CUTANÉE - Catégorie 2 Skin Sens. 1, H317 SENSIBILISATION CUTANÉE - Catégorie 1 Skin Irrit. 2, H315 Eye Dam. 1, H318 Skin Sens. 1, H317 Aquatic Chronic 2, H411 N° de FDS. : 00057058 Date d'édition / Date de révision : 3 Août 2011 18/19 ARALDITE 2014-1 Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France Date d'impression : Date d'édition : 3 Août 2011 3 Août 2011 N° de FDS. Version : : 00057058 1 19/19 SECTION 16: Autres informations Version Avis au lecteur : 1 Les informations et recommandations figurant dans cette publication sont fondées sur notre expérience générale et sont fournies de bonne foi au mieux de nos connaissances actuelles, MAIS RIEN DANS LES PRESENTES NE DOIT ÊTRE INTERPRETE COMME CONSTITUANT UNE GARANTIE OU UNE DECLARATION, EXPRESSE, IMPLICITE OU AUTRE. DANS TOUS LES CAS, IL INCOMBE A L'UTILISATEUR DE DETERMINER ET DE VERIFIER L'EXACTITUDE, AINSI QUE LE CARACTERE SUFFISANT ET APPLICABLE DE TELLES INFORMATIONS ET RECOMMANDATIONS, DE MEME QUE L'ADEQUATION ET L'ADAPTATION D'UN QUELCONQUE PRODUIT A UNE UTILISATION SPECIFIQUE OU DANS UN BUT PARTICULIER. LES PRODUITS MENTIONNES PEUVENT PRESENTER DES RISQUES INCONNUS ET DOIVENT ETRE UTILISES AVEC PRECAUTION. MEME SI CERTAINS RISQUES SONT DECRITS DANS CETTE PUBLICATION, IL N'EXISTE AUCUNE GARANTIE QU'IL S'AGIT DES SEULS RISQUES EXISTANTS. Les risques, la toxicité et le comportement des produits peuvent différer lorsque ceux-ci sont utilisés avec d'autres matériaux et dépendent des conditions de fabrication et d'autres processus. Ces risques, cette toxicité et ces comportements doivent être déterminés par l'utilisateur et portés à la connaissance des personnes ou entités chargés du transport ou de la manutention, du traitement ou de la transformation, ainsi que de tous utilisateurs finaux. ARALDITE® est une marque déposée de Huntsman Corporation ou une filiale dans un ou plusieurs pays, mais pas dans tous les pays. AUCUNE PERSONNE OU ORGANISATION A L’EXCEPTION D'UN EMPLOYE HUNTSMAN DUMENT QUALIFIE EST AUTORISE A FOURNIR OU METTRE A DISPOSITION DES FICHES DE DONNEES DE SECURITE POUR LES PRODUITS HUNTSMAN. LES FICHES DE DONNEES DE SECURITE DE SOURCES NON AUTORISEE PEUVENT CONTENIR DES INFORMATIONS QUI NE SONT PLUS A JOUR OU INEXACTES. AUCUNE PARTIE DE CETTE FICHE NE PEUT ETRE REPRODUITE OU DIFFUSEE SOUS QUELQUE FORME QUE CE SOIT, OU PAR TOUT MOYEN, SANS L'ACCORD ECRIT DE HUNTSMAN. TOUTES LES DEMANDES D'AUTORISATION DE REPRODUCTION DES DONNEES DE CE FEUILLET DOIVENT ETRE ADRESSEES A HUNTSMAN, AU RESPONSABLE DE LA SECURITE DU PRODUIT A L’ADRESSE CI-DESSUS. Date d'édition / Date de révision : 3 Août 2011 19/19 http://www.farnell.com/datasheets/1442064.pdf 1. Product profile 1.1 General description Logic level N-channel MOSFET in LFPAK package qualified to 175 °C. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment. 1.2 Features and benefits  Advanced TrenchMOS provides low RDSon and low gate charge  High efficiency gains in switching power convertors  Improved mechanical and thermal characteristics  LFPAK provides maximum power density in a Power SO8 package 1.3 Applications  DC-to-DC converters  Lithium-ion battery protection  Load switching  Motor control  Server power supplies 1.4 Quick reference data PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Rev. 1 — 30 May 2011 Product data sheet LFPAK Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - - 30 V ID drain current Tmb = 25 °C; VGS = 10 V; see Figure 1 [1] - - 100 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 109 W Tj junction temperature -55 - 175 °C Static characteristics RDSon drain-source on-state resistance VGS = 10 V; ID = 15 A; Tj = 100 °C; see Figure 13 - - 2.4 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C - 1.3 1.7 mΩ Dynamic characteristics QGD gate-drain charge VGS = 4.5 V; ID = 10 A; VDS = 12 V; see Figure 14; see Figure 15 - 8.7 - nCPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 2 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK [1] Continuous current is limited by package. 2. Pinning information 3. Ordering information QG(tot) total gate charge VGS = 4.5 V; ID = 10 A; VDS = 12 V; see Figure 14 - 36.2 - nC Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 100 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - - 241 mJ Table 1. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 S source SOT669 (LFPAK; Power-SO8) 2 S source 3 S source 4 G gate mb D mounting base; connected to drain mb 1234 S D G mbb076 Table 3. Ordering information Type number Package Name Description Version PSMN1R7-30YL LFPAK; Power-SO8 plastic single-ended surface-mounted package; 4 leads SOT669PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 3 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 4. Limiting values [1] Continuous current is limited by package. Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 30 V VDSM peak drain-source voltage tp ≤ 25 ns; f ≤ 500 kHz; EDS(AL) ≤ 360 nJ; pulsed - 35 V VDGR drain-gate voltage Tj ≥ 25 °C; Tj ≤ 175 °C; RGS = 20 kΩ - 30 V VGS gate-source voltage -20 20 V ID drain current VGS = 10 V; Tmb = 100 °C; see Figure 1 [1] - 100 A VGS = 10 V; Tmb = 25 °C; see Figure 1 [1] - 100 A IDM peak drain current pulsed; tp ≤ 10 µs; Tmb = 25 °C; see Figure 3 - 790 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 109 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C Source-drain diode IS source current Tmb = 25 °C [1] - 100 A ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 790 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 100 A; Vsup ≤ 30 V; RGS = 50 Ω; unclamped - 241 mJ Fig 1. Continuous drain current as a function of mounting base temperature Fig 2. Normalized total power dissipation as a function of mounting base temperature 003aac446 0 20 40 60 80 100 120 0 50 100 150 200 Tmb (°C) ID (A) (1) Tmb (°C) 0 200 50 100 150 03aa16 40 80 120 Pder (%) 0PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 4 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage 003aad111 1 10 102 103 104 10-1 1 10 102 VDS (V) ID (A) Limit RDSon = VDS / ID (1) DC 100 ms 10 ms 1 ms 100 μs 10 μsPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 5 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - 0.5 1.1 K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration 003aac456 single shot 0.2 0.1 0.05 0.02 10-3 10-2 10-1 1 10 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s) Zth(j-mb) (K/W) δ = 0.5 tp T P t tp T δ =PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 6 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 6. Characteristics Table 6. Characteristics Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Static characteristics V(BR)DSS drain-source breakdown voltage ID = 250 µA; VGS = 0 V; Tj = 25 °C 30 - - V ID = 250 µA; VGS = 0 V; Tj = -55 °C 27 - - V VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 25 °C; see Figure 11; see Figure 12 1.3 1.7 2.15 V ID = 1 mA; VDS = VGS; Tj = 150 °C; see Figure 12 0.65 - - V ID = 1 mA; VDS = VGS; Tj = -55 °C; see Figure 12 - - 2.45 V IDSS drain leakage current VDS = 30 V; VGS = 0 V; Tj = 25 °C - - 1 µA VDS = 30 V; VGS = 0 V; Tj = 150 °C - - 100 µA IGSS gate leakage current VGS = 16 V; VDS = 0 V; Tj = 25 °C - - 100 nA VGS = -16 V; VDS = 0 V; Tj = 25 °C - - 100 nA RDSon drain-source on-state resistance VGS = 4.5 V; ID = 15 A; Tj = 25 °C - 1.8 2.1 mΩ VGS = 10 V; ID = 15 A; Tj = 150 °C; see Figure 13 - - 2.8 mΩ VGS = 10 V; ID = 15 A; Tj = 100 °C; see Figure 13 - - 2.4 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C - 1.3 1.7 mΩ RG gate resistance f = 1 MHz - 0.77 1.5 Ω Dynamic characteristics QG(tot) total gate charge ID = 10 A; VDS = 12 V; VGS = 10 V; see Figure 14; see Figure 15 - 77.9 - nC ID = 0 A; VDS = 0 V; VGS = 10 V - 70 - nC ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14 - 36.2 - nC QGS gate-source charge ID = 10 A; VDS = 12 V; VGS = 4.5 V; see Figure 14; see Figure 15 - 11.6 - nC QGS(th) pre-threshold gate-source charge - 8 - nC QGS(th-pl) post-threshold gate-source charge - 3.6 - nC QGD gate-drain charge - 8.7 - nC VGS(pl) gate-source plateau voltage VDS = 12 V; see Figure 14; see Figure 15 - 2.34 - V Ciss input capacitance VDS = 12 V; VGS = 0 V; f = 1 MHz; Tj = 25 °C; see Figure 16 - 5057 - pF Coss output capacitance - 1082 - pF Crss reverse transfer capacitance - 398 - pF td(on) turn-on delay time VDS = 12 V; RL = 0.5 Ω; VGS = 4.5 V; RG(ext) = 4.7 Ω - 46 - ns tr rise time - 72 - ns td(off) turn-off delay time - 76 - ns tf fall time - 34 - nsPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 7 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Source-drain diode VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C; see Figure 17 - 0.78 1.2 V trr reverse recovery time IS = 20 A; dIS/dt = -100 A/µs; VGS = 0 V; VDS = 20 V - 45 - ns Qr recovered charge - 56 - nC Table 6. Characteristics …continued Tested to JEDEC standards where applicable. Symbol Parameter Conditions Min Typ Max Unit Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values Fig 6. Drain-source on-state resistance as a function of drain current; typical values Fig 7. Forward transconductance as a function of drain current; typical values Fig 8. Input and reverse transfer capacitances as a function of gate-source voltage; typical values 003aac449 0 50 100 150 200 250 300 0 2 4 6 8 10 VDS (V) ID (A) 2.2 2.4 2.6 2.8 3 VGS (V) = 3.2 3.4 3.6 4 10 003aac450 1 2 3 4 5 0 50 100 150 200 250 ID (A) RDSon (mΩ) 7 10 4 3.6 VGS (V) = 3.4 003aac452 0 50 100 150 200 0 20 40 60 80 ID (A) gfs (S) 003aac455 0 2000 4000 6000 8000 2 4 6 810 VGS (V) C (pF) Ciss CrssPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 8 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 9. Drain-source on-state resistance as a function of gate-source voltage; typical values Fig 10. Transfer characteristics: drain current as a function of gate-source voltage; typical values Fig 11. Sub-threshold drain current as a function of gate-source voltage Fig 12. Gate-source threshold voltage as a function of junction temperature 003aac451 1.0 1.5 2.0 2.5 3.0 2 4 6 8 10 VGS (V) RDSon (mΩ) 003aac453 0 20 40 60 80 01234 VGS (V) ID (A) Tj = 150 °C 25 °C 003aab271 10-6 10-5 10-4 10-3 10-2 10-1 0123 VGS (V) ID (A) min typ max 003aac982 0 1 2 3 -60 0 60 120 180 Tj (°C) VGS(th) (V) max typ minPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 9 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 13. Normalized drain-source on-state resistance factor as a function of junction temperature Fig 14. Gate charge waveform definitions Fig 15. Gate-source voltage as a function of gate charge; typical values Fig 16. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values 03aa27 0 0.5 1 1.5 2 −60 0 60 120 180 Tj (°C) a 003aaa508 VGS VGS(th) QGS1 QGS2 QGD VDS QG(tot) ID QGS VGS(pl) 003aac448 0 2 4 6 8 10 0 20 40 60 80 QG (nC) VGS (V) VDS = 19 (V) VDS = 12 (V) 003aac454 0 2000 4000 6000 10-1 1 10 102 VDS (V) C (pF) Ciss Coss CrssPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 10 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values 003aac447 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 VSD (V) IS (A) Tj = 150 °C 25 °CPSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 11 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 7. Package outline Fig 18. Package outline SOT669 (LFPAK; Power-SO8) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 06-03-16 11-03-25 0 2.5 5 mm scale e E1 b c2 A2 UNIT A A2 b c e DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A1 A3 0.15 0.00 1.20 1.01 0.50 0.35 b2 4.41 3.62 b3 2.2 2.0 b4 0.9 0.7 0.25 0.19 c2 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 L2 0.85 0.40 L 1.3 0.8 L1 8° 0° D w y (1) 5.0 4.8 E(1) 3.3 3.1 E1 D1 (1) (1) max 0.25 4.20 1.27 0.25 0.1 1 2 34 mounting base D1 c Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads SOT669 E b2 b3 b4 H D L2 L1 A w M A C C X 1/2 e y C θ θ (A )3 L A A1 detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 12 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PSMN1R7-30YL v.5 20110530 Product data sheet - PSMN1R7-30YL v.4 Modifications: • Various changes to content. PSMN1R7-30YL v.4 20100420 Product data sheet - PSMN1R7-30YL v.3PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 13 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK 9. Legal information 9.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. 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In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PSMN1R7-30YL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 30 May 2011 14 of 15 NXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors PSMN1R7-30YL N-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 May 2011 Document identifier: PSMN1R7-30YL Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11 8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13 9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14 10 Contact information. . . . . . . . . . . . . . . . . . . . . .14 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Rev. 01 — 13 August 2009 Product data sheet 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 2 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 3. Ordering information 4. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74VHC126D -40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74VHCT126D 74VHC126PW -40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 74VHCT126PW 74VHC126BQ -40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 ´ 3 ´ 0.85 mm SOT762-1 74VHCT126BQ Fig 1. Functional diagram mna235 2 1A 1Y 1 3 1OE 5 2A 2Y 4 6 2OE 9 3A 3Y 10 8 3OE 12 4A 4Y 13 11 4OE Fig 2. Logic symbol Fig 3. IEC logic symbol mna234 nOE nA nY mna236 1 EN1 1 3 2 4 6 5 10 8 9 13 11 12 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 3 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 5. Pinning information 5.1 Pinning 5.2 Pin description (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 4. Pin configuration SO14 and TSSOP14 Fig 5. Pin configuration DHVQFN14 74VHC126 74VHCT126 1OE VCC 1A 4OE 1Y 4A 2OE 4Y 2A 3OE 2Y 3A GND 3Y 001aak056 1 2 3 4 5 6 7 8 10 9 12 11 14 13 001aak076 74VHC126 74VHCT126 Transparent top view 2Y 3A 2A 3OE 2OE 4Y 1Y 4A 1A 4OE GND 3Y 1OE VCC 6 9 5 10 4 11 3 12 2 13 7 8 1 14 terminal 1 index area GND(1) Table 2. Pin description Symbol Pin Description 1OE 1 output enable input 1 (active HIGH) 1A 2 data input 1 1Y 3 data output 1 2OE 4 output enable input 2 (active HIGH) 2A 5 data input 2 2Y 6 data output 2 GND 7 ground (0 V) 3Y 8 data output 3 3A 9 data input 3 3OE 10 output enable input 3 (active HIGH) 4Y 11 data output 4 4A 12 data input 4 4OE 13 output enable input 4 (active HIGH) VCC 14 supply voltage 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 4 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 6. Functional description [1] H = HIGH voltage state; L = LOW voltage state; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K. For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K. For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K. Table 3. Function table[1] Control Input Output nOE nA nY H L L H H H L X Z Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VCC supply voltage -0.5 +7.0 V VI input voltage -0.5 +7.0 V IIK input clamping current VI < -0.5 V [1] -20 - mA IOK output clamping current VO < -0.5 V or VO > VCC + 0.5 V [1] -20 +20 mA IO output current VO = -0.5 V to (VCC + 0.5 V) -25 +25 mA ICC supply current - +75 mA IGND ground current -75 - mA Tstg storage temperature -65 +150 °C Ptot total power dissipation Tamb = -40 °C to +125 °C [2] - 500 mW 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 5 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 8. Recommended operating conditions 9. Static characteristics Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 74VHC126 VCC supply voltage 2.0 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature -40 +25 +125 °C Dt/DV input transition rise and fall rate VCC = 3.0 V to 3.6 V - - 100 ns/V VCC = 4.5 V to 5.5 V - - 20 ns/V 74VHCT126 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature -40 +25 +125 °C Dt/DV input transition rise and fall rate VCC = 4.5 V to 5.5 V - - 20 ns/V Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 °C -40 °C to +85 °C -40 °C to +125 °C Unit Min Typ Max Min Max Min Max 74VHC126 VIH HIGH-level input voltage VCC = 2.0 V 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V VIL LOW-level input voltage VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V VOH HIGH-level output voltage VI = VIH or VIL IO = -50 mA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = -50 mA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = -50 mA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = -4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = -8.0 mA; VCC = 4.5 V 3.94 - - 3.80 - 3.70 - V VOL LOW-level output voltage VI = VIH or VIL IO = 50 mA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 mA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 mA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 6 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 mA IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 mA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 2.0 - 20 - 40 mA CI input capacitance VI = VCC or GND - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF 74VHCT126 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = -50 mA 4.4 4.5 - 4.4 - 4.4 - V IO = -8.0 mA 3.94 - - 3.80 - 3.70 - V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 50 mA - 0 0.1 - 0.1 - 0.1 V IO = 8.0 mA - - 0.36 - 0.44 - 0.55 V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 mA IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 mA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 2.0 - 20 - 40 mA DICC additional supply current per input pin; VI = VCC - 2.1 V; other pins at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance VI = VCC or GND - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 °C -40 °C to +85 °C -40 °C to +125 °C Unit Min Typ Max Min Max Min Max 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 7 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter Conditions 25 °C -40 °C to +85 °C -40 °C to +125 °C Unit Min Typ[1] Max Min Max Min Max 74VHC126 tpd propagation delay nA to nY; see Figure 6 [2] VCC = 3.0 V to 3.6 V CL = 15 pF - 4.7 8.0 1.0 9.5 1.0 10.0 ns CL = 50 pF - 6.7 11.5 1.0 13.0 1.0 14.5 ns VCC = 4.5 V to 5.5 V CL = 15 pF - 3.3 5.5 1.0 6.5 1.0 7.0 ns CL = 50 pF - 4.7 7.5 1.0 8.5 1.0 9.5 ns ten enable time nOE to nY; see Figure 7 [3] VCC = 3.0 V to 3.6 V CL = 15 pF - 5.3 8.0 1.0 9.5 1.0 10.0 ns CL = 50 pF - 7.6 11.5 1.0 13.0 1.0 14.5 ns VCC = 4.5 V to 5.5 V CL = 15 pF - 3.6 5.3 1.0 6.1 1.0 7.0 ns CL = 50 pF - 5.1 7.6 1.0 8.7 1.0 9.5 ns tdis disable time nOE to nY; see Figure 7 [4] VCC = 3.0 V to 3.6 V CL = 15 pF - 6.6 9.7 1.0 11.5 1.0 12.5 ns CL = 50 pF - 9.4 13.2 1.0 15.0 1.0 16.5 ns VCC = 4.5 V to 5.5 V CL = 15 pF - 4.7 6.8 1.0 8.0 1.0 8.5 ns CL = 50 pF - 6.7 8.8 1.0 10.0 1.0 11.0 ns CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC [5] - 10 - - - - - pF 74VHCT126; VCC = 4.5 V to 5.5 V tpd propagation delay nA to nY; see Figure 6 [2] CL = 15 pF - 3.0 5.5 1.0 6.5 1.0 7.0 ns CL = 50 pF - 4.3 7.5 1.0 8.5 1.0 9.5 ns ten enable time nOE to nY; see Figure 7 [3] CL = 15 pF - 3.3 5.1 1.0 6.0 1.0 6.5 ns CL = 50 pF - 4.7 7.1 1.0 8.0 1.0 9.0 ns tdis disable time nOE to nY; see Figure 7 [4] CL = 15 pF - 4.8 6.8 1.0 8.0 1.0 8.5 ns CL = 50 pF - 6.9 8.9 1.0 10.0 1.0 11.5 ns CPD power dissipation capacitance fi = 1 MHz; VI = GND to VCC [5] - 12 - - - - - pF 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 8 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL. [3] ten is the same as tPZL and tPZH. [4] tdis is the same as tPLZ and tPHZ. [5] CPD is used to determine the dynamic power dissipation (PD in mW). PD = CPD ´ VCC 2 ´ fi ´ N + S(CL ´ VCC 2 ´ fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; S(CL ´ VCC 2 ´ fo) = sum of the outputs. 11. Waveforms Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Input to output propagation delays mna237 tPHL tPLH VM nA input VM nY output GND VI VOH VOL Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Enable and disable times mna949 tPLZ tPHZ outputs disabled outputs enabled VY VX outputs enabled output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH nOE input VOL VOH VCC VI VM GND GND tPZL tPZH VM VM 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 9 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Table 8. Measurement points Type Input Output VM VM VX VY 74VHC126 0.5VCC 0.5VCC VOL + 0.3 V VOH - 0.3 V 74VHCT126 1.5 V 0.5VCC VOL + 0.3 V VOH - 0.3 V Test data is given in Table 9. Definitions test circuit: RT = termination resistance should be equal to output impedance Zo of the pulse generator. CL = load capacitance including jig and probe capacitance. RL = load resistance. S1 = test selection switch. Fig 8. Test circuitry for measuring switching times VM VM tW tW 10 % 90 % 0 V VI VI negative pulse positive pulse 0 V VM VM 90 % 10 % tf tr tr tf 001aad983 DUT VCC VCC VI VO RT RL S1 CL G open Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74VHC126 VCC £ 3.0 ns 15 pF, 50 pF 1 kW open GND VCC 74VHCT126 3.0 V £ 3.0 ns 15 pF, 50 pF 1 kW open GND VCC 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 10 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 12. Package outline Fig 9. Package outline SOT108-1 (SO14) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT108-1 X w M q A A 1 A2 bp D HE Lp Q detail X E Z e c L v M A (A 3 ) A 7 8 1 14 y 076E06 MS-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 11 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Fig 10. Package outline SOT402-1 (TSSOP14) UNIT A1 A2 A3 bp c D(1) E (2) e HE L Lp Q v w y Z (1) q OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT402-1 MO-153 99-12-27 03-02-18 w M bp D Z e 0.25 1 7 14 8 q A A1 A2 Lp Q detail X L (A 3 ) HE E c v M A X A y 0 2.5 5 mm scale TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 A max. 1.1 pin 1 index 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 12 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state Fig 11. Package outline SOT762-1 (DHVQFN14) terminal 1 index area 1 0.5 UNIT A1 b Eh e y 0.2 c OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 Dh 1.65 1.35 y1 2.6 2.4 1.15 0.85 e1 2 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT762-1 - - - MO-241 - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT762-1 DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm A(1) max. A A1 c detail X e y1 C y L Eh Dh e e1 b 2 6 13 9 8 1 7 14 X D E C B A 02-10-17 03-01-27 terminal 1 index area C A C v M B w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 13 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 13. Abbreviations 14. Revision history Table 10. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74VHC_VHCT126_1 20090813 Product data sheet - - 74VHC_VHCT126_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 August 2009 14 of 15 NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors 74VHC126; 74VHCT126 Quad buffer/line driver; 3-state © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 August 2009 Document identifier: 74VHC_VHCT126_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. Product specification July 1998 DISCRETE SEMICONDUCTORS BYV79E series Rectifier diodes ultrafast, rugged Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged FEATURES SYMBOL QUICK REFERENCE DATA • Low forward volt drop VR = 150 V/ 200 V • Fast switching • Soft recovery characteristic VF ≤ 0.9 V • Reverse surge capability • High thermal cycling performance IF(AV) = 14 A • Low thermal resistance IRRM ≤ 0.2 A trr ≤ 30 ns GENERAL DESCRIPTION PINNING SOD59 (TO220AC) Ultra-fast, epitaxial rectifier diodes PIN DESCRIPTION intended for use as output rectifiers in high frequency switched mode 1 cathode power supplies. 2 anode The BYV79E series is supplied in the conventional leaded SOD59 tab cathode (TO220AC) package. LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT BYV79E -150 -200 VRRM Peak repetitive reverse voltage - 150 200 V VRWM Crest working reverse voltage - 150 200 V VR Continuous reverse voltage Tmb ≤ 145˚C - 150 200 V IF(AV) Average forward current1 square wave - 14 A δ = 0.5; Tmb ≤ 120 ˚C IFRM Repetitive peak forward current t = 25 μs; δ = 0.5; - 28 A Tmb ≤ 120 ˚C IFSM Non-repetitive peak forward t = 10 ms - 150 A current t = 8.3 ms - 160 A sinusoidal; with reapplied VRWM(max) IRRM Repetitive peak reverse current tp = 2 μs; δ = 0.001 - 0.2 A IRSM Non-repetitive peak reverse tp = 100 μs - 0.2 A current Tstg Storage temperature -40 150 ˚C Tj Operating junction temperature - 150 ˚C 1. Neglecting switching and reverse current losses. ESD LIMITING VALUE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VC Electrostatic discharge Human body model; - 8 kV capacitor voltage C = 250 pF; R = 1.5 kΩ k a 1 2 1 tab 2 July 1998 1 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Rth j-mb Thermal resistance junction to - - 2 K/W mounting base Rth j-a Thermal resistance junction to in free air - 60 - K/W ambient STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF Forward voltage IF = 14 A; Tj = 150˚C - 0.83 0.90 V IF = 14 A - 0.95 1.05 V IF = 50 A - 1.2 1.4 V IR Reverse current VR = VRWM; Tj = 100 ˚C - 0.5 1.3 mA VR = VRWM - 5 50 μA Qs Reverse recovery charge IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/μs - 6 15 nC trr1 Reverse recovery time IF = 1 A; VR ≥ 30 V; - 20 30 ns -dIF/dt = 100 A/μs trr2 Reverse recovery time IF = 0.5 A to IR = 1 A; Irec = 0.25 A - 13 22 ns Vfr Forward recovery voltage IF = 1 A; dIF/dt = 10 A/μs - 1 - V July 1998 2 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged Fig.1. Definition of trr1, Qs and Irrm Fig.2. Definition of Vfr Fig.3. Circuit schematic for trr2 Fig.4. Definition of trr2 Fig.5. Maximum forward dissipation PF = f(IF(AV)); square current waveform where IF(AV) =IF(RMS) x √D. Fig.6. Maximum forward dissipation PF = f(IF(AV)); sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). Q s 10% 100% time dI dt F I R I F I rrm t rr I = 1A R I rec = 0.25A 0A trr2 0.5A IF IR time time V F V fr V F I F 0 5 10 15 20 25 0 5 10 15 20 0.5 0.2 0.1 BYV79 IF(AV) / A PF / W D = 1.0 Tmb(max) / C 150 140 130 120 110 Vo = 0.744 V Rs = 0.0112 Ohms tp D = tp T T t I shunt Current to ’scope D.U.T. Voltage Pulse Source R 0 5 10 15 0 5 10 15 1.9 2.2 2.8 4 BYV79 IF(AV) / A PF / W Tmb(max) / C 150 140 130 a = 1.57 120 Vo = 0.744 V Rs = 0.0112 Ohms July 1998 3 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged Fig.7. Maximum trr at Tj = 25 ˚C. Fig.8. Maximum Irrm at Tj = 25 ˚C. Fig.9. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.10. Maximum Qs at Tj = 25 ˚C. Fig.11. Transient thermal impedance; Zth j-mb = f(tp). 1 10 trr / ns 1 10 100 1000 dIF/dt (A/us) IF=1A IF=10A 100 1.0 10 100 Qs / nC 1.0 10 100 -dIF/dt (A/us) 1000 IF=10A 5A 2A 10 1 0.1 0.01 Irrm / A 1 10 100 -dIF/dt (A/us) IF=10A IF=2A 1us 10us 100us 1ms 10ms 100ms 1s 10s 0.001 0.01 0.1 1 10 pulse width, tp (s) BYV79E Transient thermal impedance, Zth j-mb (K/W) tp D = tp T T P t D 0 2 60 50 40 30 20 10 0 max typ Tj = 150 C Tj = 25 C 0.5 1.0 IF / A VF / V 1.5 July 1998 4 Rev 1.200  Semiconductors Product specification Rectifier diodes BYV79E series ultrafast, rugged MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.12. SOD59 (TO220AC). pin 1 connected to mounting base. Notes 1. Refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10,3 max 3,7 2,8 3,0 3,0 max not tinned 1,3 max (2x) 2,4 0,6 4,5 max 5,9 min 15,8 max 1,3 0,9 max (2x) 13,5 min 5,08 1 2 July 1998 5 Rev 1.200 NXP Semiconductors Legal information DATA SHEET STATUS Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DEFINITIONS Product specification ⎯ The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. DISCLAIMERS Limited warranty and liability ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors Legal information NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products ⎯ Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers. © NXP B.V. 2011 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands  Product specification July 1998 DISCRETE SEMICONDUCTORS BYV79E series Rectifier diodes ultrafast, rugged AC Current Probes P6021A & P6022 The P6021 and P6022 Current Probes provide versatile AC current measurements. Both probes provide accurate current measurements over a wide range of frequencies. The P6021 and P6022 allow current measurements without breaking the circuit by clipping onto the current carrying conductor. Shielded probe heads are not grounded when the slides are in their open positions, eliminating accidental grounding of the circuit under test. Key performance specifications P6021A 120 Hz to 60 MHz 10.6 A RMS, 250 A peak, 10 mA sensitivity P6022 935 Hz to 120 MHz 4 A RMS, 100 A peak, 1 mA sensitivity Key features For 1 MΩ inputs Shielded probe head AC only Split core construction allows easy circuit connection 1.5 m (5 ft) cable Applications Motor drives Power inverters/converters Power supplies Avionics P6021A For general purpose applications, the P6021A provides wide-band performance with excellent low-frequency characteristics. Bandwidth is 120 Hz to 60 MHz. The probe range is switchable between 2 mA/mV and 10 mA/mV. P6022 With a head size of 0.47 in. x 0.25 in. (10 mm x 6 mm, about half the size of the P6021A) and a bandwidth of 935 Hz to 120 MHz, the P6022 is ideal for measuring currents in compact, high-performance circuits. Passive termination output is switchable between 1 mA/mV and 10 mA/mV.Specifications All specifications apply to all models unless noted otherwise. Physical characteristics Cable length 1.5 m (59 in) P6021A probe head Length 20 cm (7.77 in) Width 16 mm (0.625 in) Height 32 mm (1.25 in) Maximum conductor diameter 5 mm (0.197 in) P6022 probe head Length 152 mm (6.0 in) Width 6.4 mm (0.25 in) Height 12 mm (0.47 in) Maximum conductor diameter 2.8 mm (0.11 in) EMC environment and safety Compliance CAN/CSA-C22.2 No. 61010-1 CAN/CSA-C22.2 No. 61010-2-032 UL 61010-1 UL61010B-2-032 EN 61010-1 EN 61010-2-032 Datasheet 2 www.tektronix.comOrdering information Models P6021A Current Probe P6022 Current Probe with termination Standard accessories 6 in. ground lead 196-3521-00 Instruction manual 071-3004-00 (P6021A), 070-0948-03 (P6022) Termination 011-0106-00 (P6022 only) Recommended accessories Nylon carrying case 016-1952-xx Current loop, 1 turn, 50 Ω with BNC connector, used for Performance Verification 067-2396-xx Deskew/calibration fixture 067-1686-xx Warranty One year parts and labor. Service options Opt. C3 Calibration Service 3 Years Opt. C5 Calibration Service 5 Years Opt. D1 Calibration Data Report Opt. D3 Calibration Data Report 3 Years (with Opt. C3) Opt. D5 Calibration Data Report 5 Years (with Opt. C5) Opt. R3 Repair Service 3 Years (including warranty) Opt. R3DW Repair Service Coverage 3 Years (includes product warranty period). 3-year period starts at time of instrument purchase Opt. R5 Repair Service 5 Years (including warranty) Opt. R5DW Repair Service Coverage 5 Years (includes product warranty period). 5-year period starts at time of instrument purchase Tektronix is registered to ISO 9001 and ISO 14001 by SRI Quality System Registrar. AC Current Probes www.tektronix.com 3Datasheet ASEAN / Australasia (65) 6356 3900 Austria 00800 2255 4835* Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777 Belgium 00800 2255 4835* Brazil +55 (11) 3759 7627 Canada 1 800 833 9200 Central East Europe and the Baltics +41 52 675 3777 Central Europe & Greece +41 52 675 3777 Denmark +45 80 88 1401 Finland +41 52 675 3777 France 00800 2255 4835* Germany 00800 2255 4835* Hong Kong 400 820 5835 India 000 800 650 1835 Italy 00800 2255 4835* Japan 81 (3) 6714 3010 Luxembourg +41 52 675 3777 Mexico, Central/South America & Caribbean 52 (55) 56 04 50 90 Middle East, Asia, and North Africa +41 52 675 3777 The Netherlands 00800 2255 4835* Norway 800 16098 People's Republic of China 400 820 5835 Poland +41 52 675 3777 Portugal 80 08 12370 Republic of Korea 001 800 8255 2835 Russia & CIS +7 (495) 6647564 South Africa +41 52 675 3777 Spain 00800 2255 4835* Sweden 00800 2255 4835* Switzerland 00800 2255 4835* Taiwan 886 (2) 2722 9622 United Kingdom & Ireland 00800 2255 4835* USA 1 800 833 9200 * European toll-free number. If not accessible, call: +41 52 675 3777 Updated 10 April 2013 For Further Information. Tektronix maintains a comprehensive, constantly expanding collection of application notes, technical briefs and other resources to help engineers working on the cutting edge of technology. Please visit www.tektronix.com. Copyright © Tektronix, Inc. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specification and price change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade names referenced are the service marks, trademarks, or registered trademarks of their respective companies. 12 Apr 2013 60W-06647-3 www.tektronix.com CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 14,15WAY,SKT CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 14,15WAY,SKT CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 14,15WAY,SKT CIRCULAR,SIZE 14,15WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN CIRCULAR,SIZE 16,10WAY,PIN (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT CIRCULAR,SIZE 16,10WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,PIN CIRCULAR,SIZE 16,24WAY,PIN (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 16,24WAY,SKT CIRCULAR,SIZE 16,24WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,11WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN CIRCULAR,SIZE 18,14WAY,PIN (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT CIRCULAR,SIZE 18,14WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN CIRCULAR,SIZE 18,8WAY,PIN (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT CIRCULAR,SIZE 18,8WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,PIN CIRCULAR,SIZE 18,31WAY,PIN (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 18,31WAY,SKT CIRCULAR,SIZE 18,31WAY,SKT (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,PIN (L/C) CIRCULAR,SIZE 20,16WAY,PIN CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT (L/C) CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT (L/C) CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT CIRCULAR,SIZE 20,16WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,25WAY,PIN CIRCULAR,SIZE 20,25WAY,PIN (L/C) CIRCULAR,SIZE 20,25WAY,PIN CIRCULAR,SIZE 20,25WAY,PIN (L/C) CIRCULAR,SIZE 20,25WAY,PIN CIRCULAR,SIZE 20,25WAY,PIN (L/C) CIRCULAR,SIZE 20,25WAY,SKT CIRCULAR,SIZE 20,25WAY,SKT (L/C) CIRCULAR,SIZE 20,25WAY,SKT CIRCULAR,SIZE 20,25WAY,SKT (L/C) CIRCULAR,SIZE 20,25WAY,SKT CIRCULAR,SIZE 20,25WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN (L/C) CIRCULAR,SIZE 20,28WAY,PIN CIRCULAR,SIZE 20,28WAY,PIN (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,28WAY,SKT CIRCULAR,SIZE 20,28WAY,SKT (L/C) CIRCULAR,SIZE 20,39WAY,PIN CIRCULAR,SIZE 20,39WAY,PIN (L/C) CIRCULAR,SIZE 20,39WAY,PIN CIRCULAR,SIZE 20,39WAY,PIN (L/C) BINDING POST,30A,#8-32,STUD,WHITE CIRCULAR,SIZE 20,39WAY,PIN CIRCULAR,SIZE 20,39WAY,PIN (L/C) CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT (L/C) CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT (L/C) CIRCULAR,SIZE 20,39WAY,SKT CIRCULAR,SIZE 20,39WAY,SKT (L/C) CIRCULAR,SIZE 20,41WAY,PIN CIRCULAR,SIZE 20,41WAY,PIN (L/C) CIRCULAR,SIZE 20,41WAY,PIN CIRCULAR,SIZE 20,41WAY,PIN (L/C) CIRCULAR,SIZE 20,41WAY,PIN CIRCULAR,SIZE 20,41WAY,PIN (L/C) CIRCULAR,SIZE 20,41WAY,SKT CIRCULAR,SIZE 20,41WAY,SKT (L/C) CIRCULAR,SIZE 20,41WAY,SKT CIRCULAR,SIZE 20,41WAY,SKT (L/C) CIRCULAR,SIZE 20,41WAY,SKT CIRCULAR,SIZE 20,41WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN CIRCULAR,SIZE 22,12WAY,PIN (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT CIRCULAR,SIZE 22,12WAY,SKT (L/C) BINDING POST,30A,#8-32,STUD,RED CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN Binding Post CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,PIN (L/C) CIRCULAR,SIZE 22,19WAY,PIN CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT CIRCULAR,SIZE 22,19WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,PIN CIRCULAR,SIZE 22,32WAY,PIN (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,32WAY,SKT CIRCULAR,SIZE 22,32WAY,SKT (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 22,55WAY,PIN CIRCULAR,SIZE 22,55WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,PIN CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) BINDING POST,30A,#8-32,STUD,RED CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,PIN CIRCULAR,SIZE 24,43WAY,PIN (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT BINDING POST,30A,#8-32,STUD,BLACK CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) BINDING POST,30A,#8-32,STUD,BLUE CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,43WAY,SKT CIRCULAR,SIZE 24,43WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN BINDING POST,30A,#8-32,STUD,GREEN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,PIN CIRCULAR,SIZE 24,57WAY,PIN (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) BINDING POST,30A,#8-32,STUD,WHITE CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,57WAY,SKT CIRCULAR,SIZE 24,57WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 24,61WAY,SKT CIRCULAR,SIZE 24,61WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,PIN CIRCULAR,SIZE 8,2WAY,PIN (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,2WAY,SKT CIRCULAR,SIZE 8,2WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,PIN CIRCULAR,SIZE 8,3WAY,PIN (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CIRCULAR,SIZE 8,3WAY,SKT CIRCULAR,SIZE 8,3WAY,SKT (L/C) CONNECTOR,HEADER,2.54MM,4POS,SMT CONNECTOR,HEADER,2.54MM,8POS,T/H BI LEV PRISM R-B SMPL STRIP BILEV PRISM W-B SMPL STRIP 41T5240 IR EMITTING DIODE,850NM,SMD IR EMITTING DIODE,850NM,SMD CAPACITOR TANT,4.7UF,100V,AXIAL 10% CONNECTOR,HEADER,2.54MM,16POS,SMT CAPACITOR TANT,33UF,15V,AXIAL 10% TRIAC,BIDIRECTIONAL,600V,16A,TO-220AB CAPACITOR TANT,82UF,75V,AXIAL 10% SPRING LOADED PIN,2A CAPACITOR TANT,120UF,100V,AXIAL 10% RECTIFIER,MOD,100A,800V,POW-R-BLOK RECTIFIER,MOD,100A,1.6KV,POW-R-BLOK RECTIFIER,MOD,100A,1.6KV,POW-R-BLOK RECTIFIER,MOD,100A,1.8KV,POW-R-BLOK SCR / RECTIFIER,MOD,90A,800V,POW-R-BLOK SCR / RECTIFIER,MOD,90A,1.6KV,POW-R-BLOK SCR / RECTIFIER,MOD,90A,1.8KV,POW-R-BLOK SCR,MOD,90A,1.6KV,POW-R-BLOK SCR,MOD,90A,1.8KV,POW-R-BLOK RECTIFIER,MOD,160A,800V,POW-R-BLOK RECTIFIER,MOD,160A,1.6KV,POW-R-BLOK RECTIFIER,MOD,160A,1.8KV,POW-R-BLOK SCR,MOD,150A,1.6KV,POW-R-BLOK SCR,MOD,150A,1.8KV,POW-R-BLOK SPRING LOADED PIN,9A SPRING LOADED PIN,2A SPRING LOADED PIN,2A SPRING LOADED PIN,2A SPRING LOADED PIN,2A SPRING LOADED PIN,2A SPRING LOADED PIN,2A SPRING LOADED PIN,2A SPRING LOADED PIN,2A CAPACITOR TANT,56UF,75V,AXIAL 10% CAPACITOR TANT,47UF,50V,AXIAL 10% CAPACITOR TANT,86UF,100V,AXIAL 10% CAPACITOR TANT,140UF,60V,AXIAL 10% CAPACITOR TANT,86UF,100V,AXIAL 10% SPRING LOADED PIN,2A CONNECTOR,HEADER,2.54MM,4POS,SMT CONNECTOR,HEADER,2.54MM,6POS,SMT CONNECTOR,HEADER,2.54MM,2POS,SMT CONNECTOR,HEADER,2.54MM,8POS,SMT CONNECTOR,HEADER,2.54MM,4POS,SMT CONNECTOR,HEADER,2.54MM,6POS,SMT CONNECTOR,HEADER,2.54MM,6POS,SMT CONNECTOR,HEADER,2.54MM,4POS,T/H CONNECTOR,HEADER,2.54MM,6POS,T/H ADAPTER,24W,IN 100-240V,OUT 24VDC/1A CONNECTOR,HEADER,2.54MM,4POS,SMT CAPACITOR,ALUM ELEC,150UF,16V,20%,SMD CAPACITOR,ALUM ELEC,150UF,16V,20%,SMD CAPACITOR,ALUM ELEC,220UF,16V,20%,SMD CAPACITOR,ALUM ELEC,270UF,16V,20%,SMD CAPACITOR,ALUM ELEC,390UF,16V,20%,SMD CAPACITOR,ALUM ELEC,47UF,16V,20%,SMD CAPACITOR,ALUM ELEC,82UF,16V,20%,SMD CAPACITOR,ALUM ELEC,120UF,20V,20%,SMD CAPACITOR,ALUM ELEC,120UF,20V,20%,SMD CAPACITOR,ALUM ELEC,150UF,20V,20%,SMD CAPACITOR,ALUM ELEC,180UF,20V,20%,SMD CAPACITOR,ALUM ELEC,33UF,20V,20%,SMD CAPACITOR,ALUM ELEC,56UF,20V,20%,SMD CAPACITOR,ALUM ELEC,120UF,25V,20%,SMD CAPACITOR,ALUM ELEC,120UF,25V,20%,SMD CAPACITOR,ALUM ELEC,180UF,25V,20%,SMD CAPACITOR,ALUM ELEC,39UF,25V,20%,SMD SWITCH,SAFETY INTERLOCK,24VDC,DPDT-NC CABLE CLAMP,SIZE 12 CABLE CLAMP,SIZE 16 CABLE CLAMP,SIZE 18 CABLE CLAMP,SIZE 20 CABLE CLAMP,SIZE 24 CABLE CLAMP,SIZE 8 INDUCTOR,SHIELDED,220NH,10A,SMD INDUCTOR,SHIELDED,470NH,9A,SMD INDUCTOR,SHIELDED,560NH,8A,SMD INDUCTOR,SHIELDED,1UH,6.3A,SMD INDUCTOR,SHIELDED,1.2UH,6A,SMD INDUCTOR,SHIELDED,1.5UH,5.5A,SMD CAPACITOR TANT,160UF,50V,AXIAL 10% CAPACITOR TANT,10UF,50V,AXIAL 10% MOSFET,DUAL N-CH,20V,16A,POWERPAIR MOSFET,DUAL N-CH,30V,16A/35A,POWERPAIR LED,GREEN,1.8CD,527NM LED,RED,1.6CD,624NM LED,HB,RGB,SMD,130mW LED,HB,RGB,SMD,130mW LED,HB,RGB,SMD,130mW LED,RGB,PLCC-6 LED,RGB,PLCC-6 LED,RGB,PLCC-6 LED,COOL WHITE,114LM LED SOCKET/HOLDER,NICHIA COB-L SERIES LEDS AFE 12 BITS DOUBLE DAC/ADC 64VQFN MODULE D´EVAL CONVERTISSEUR DATA AFE7222 EVAL PLL VCO F SYNTHESIS TRF3765 EVAL AMPLI DE PUISS STEREO 20W TAS5731 CAPACITOR TANT,22UF,25V,AXIAL 10% CAPACITOR TANT,110UF,75V,AXIAL 10% CAPACITOR TANT,180UF,75V,AXIAL 10% CAPACITOR TANT,220UF,60V,AXIAL 10% CAPACITOR TANT,68UF,100V,AXIAL 10% CAPACITOR TANT,43UF,100V,AXIAL 10% CAPACITOR TANT,10UF,100V,AXIAL 10% SOCKET,SOLARSPEC,2.5MM2 / 14AWG SOCKET,SOLARSPEC,4-6MM2 / 10-12AWG PLUG,SOLARSPEC,2.5MM2 / 14AWG PLUG,SOLARSPEC,4-6MM2 / 10-12AWG SOCKET,SOLARSPEC 2.5MM2,PK 5 SOCKET,SOLARSPEC 4-6MM2,PK 5 PLUG,SOLARSPEC 2.5MM2,PK 5 PLUG,SOLARSPEC 4-6MM2,PK 5 CRIMP PIN,SOLARSPEC,2.5MM2 CRIMP PIN,SOLARSPEC,4-6MM2 CRIMP SKT,SOLARSPEC,2.5MM2 CRIMP SKT,SOLARSPEC,4-6MM2 SERVICE TOOL,SOLARSPEC,PK 4 CRIMP TOOL,SOLARSPEC,2.5-6MM2 MICRO 16 BITS MSP430 FRAM 40VQFN MICRO 16 BITS MSP430 FRAM 24VQFN MICRO 16 BITS MSP430 FRAM 40VQFN MICRO 16 BITS MSP430 FRAM 40VQFN MICRO 16 BITS MSP430 FRAM 40VQFN AFE PUISSANCELINE COMM 48VQFN CIRCULAR CONTACT,COAX SOCKET,SZ12,CRIMP NTC THERMISTOR,9.983KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,9.983KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,9.983KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,9.983KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,9.925KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,9.925KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,9.925KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,9.925KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,4.99KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,4.99KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,4.99KOHM,CLIP ON PIPE SENSOR NTC THERMISTOR,4.99KOHM,CLIP ON PIPE SENSOR CAPACITOR,ALUM ELEC,82UF,25V,20%,SMD CAPACITOR,ALUM ELEC,82UF,25V,20%,SMD CAPACITOR,ALUM ELEC,10UF,50V,20%,SMD CAPACITOR,ALUM ELEC,22UF,50V,20%,SMD CAAPACITOR,ALUM ELEC,22UF,50V,20%,SMD CAPACITOR,ALUM ELEC,27UF,50V,20%,SMD CAPACITOR,ALUM ELEC,33UF,50V,20%,SMD CAPACITOR,ALUM ELEC,47UF,50V,20%,SMD CAPACITOR,ALUM ELEC,5.6UF,50V,20%,SMD CAPACITOR,ALUM ELEC,100UF,35V,20%,SMD CAPACITOR,ALUM ELEC,18UF,35V,20%,SMD CAPACITOR,ALUM ELEC,39UF,35V,20%,SMD CAPACITOR,ALUM ELEC,39UF,35V,20%,SMD CAPACITOR,ALUM ELEC,56UF,35V,20%,SMD CAPACITOR,ALUM ELEC,68UF,35V,20%,SMD CAPACITOR,ALUM ELEC,22UF,25V,20%,SMD CAPACITOR,ALUM ELEC,10UF,35V,20%,SMD CONDENSATEUR BROADBAND 0402 0.1UF CONDENSATEUR BROADBAND 0402 0.1UF TOOL,EXTRACTION,SIZE 15 CONTACT CA-COM CONNECTOR VARISTANCE 3PF 0402 18VDC 14VAC VARISTANCE 3PF 0603 18VDC 14VAC VARISTANCE 12PF 0603 18VDC 14VAC VARISTANCE 40PF 0402 18VDC 14VAC VARISTANCE 50PF 0603 18VDC 14VAC VARISTANCE 80PF 0603 18VDC 14VAC VARISTANCE 37PF 0402 18VDC 14VAC BATTERY NIMH,1.2V,2400MAH PROCESSOR CCD 12 BITS 45MHZ 32LFCSP CARTE D´EVAL MEMS MICROPHONE ADMP521 EVAL TRANSCEIVER 20MBPS ADN4696E EVAL DOUBLE 5A 20V HS MOSFET ADP2325 EVAL PROTECTION HAUTE LATERAL COURANT EVAL TRANSCEIVER 100MBPS ADN4690E EVAL TRANSCEIVER 100MBPS ADN4692E CARTE FILLE ADM1062-7 & 1166 LFCSP CARTE FILLE ADM1062-7 & 1166 TQFP EVAL PUISSANCE MANAGEMENT ADP1740 CAPACITOR ALUM ELEC,150UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,220UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,390UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,120UF,20V,20%,RADIAL CAPACITOR ALUM ELEC,150UF,20V,20%,RADIAL CAPACITOR ALUM ELEC,270UF,20V,20%,RADIAL CAPACITOR ALUM ELEC,120UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,180UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,82UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,22UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,27UF,50V,20%,RADIAL CIRCUIT BREAKER,THERMAL MAG,1P,10A CAPACITOR ALUM ELEC,47UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,100UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,39UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,56UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,100UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,1000UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,22UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,220UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,2200UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,33UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,330UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,3300UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,47UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,470UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,4700UF,6.3V,20%,RADIAL CAPACITOR ALUM ELEC,100UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,1000UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,22UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,220UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,33UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,330UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,3300UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,47UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,470UF,10V,20%,RADIAL CAPACITOR ALUM ELEC,100UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,1000UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,22UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,220UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,2200UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,33UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,330UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,47UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,470UF,16V,20%,RADIAL CAPACITOR ALUM ELEC,100UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,1000UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,22UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,220UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,33UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,330UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,47UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,470UF,25V,20%,RADIAL CAPACITOR ALUM ELEC,100UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,22UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,220UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,33UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,330UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,47UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,470UF,50V,20%,RADIAL CAPACITOR ALUM ELEC,100UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,1000UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,22UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,220UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,33UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,330UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,47UF,35V,20%,RADIAL CAPACITOR ALUM ELEC,470UF,35V,20%,RADIAL SIGNAL COND RESISTIVE 5.5V 8SOP SIGNAL COND RESISTIVE 5.5V 8SOP SIGNAL COND RESISTIVE 5.5V 8SOP SIGNAL COND RESISTIVE 5.5V 8SOP SIGNAL CONDITIONER AECQ100 SOP14 SIGNAL COND CAPACITIVE 1.8V SOP14 SIGNAL COND CAPACITIVE 2.3V SOP14 KIT D´EVAL DRIVER DE LED ZLED7015 KIT D´EVAL SIGNAL COND ZSC31010 KIT D´EVAL SIGNAL COND ZSSC3008 KIT D´EVAL SIGNAL COND ZSC31014 KIT D´EVAL SIGNAL COND ZSC31015 KIT D´EVAL SIGNAL COND ZSC31150 KIT D´EVAL SIGNAL COND ZSSC3122 KIT D´EVAL SIGNAL COND ZSSC3123 KIT D´EVAL SIGNAL COND ZSSC3170 CONVERT A/N 12 BITS 125KSPS +/-2 8MSOP CONVERT A/N 12 BITS 125KSPS +/-2 8SOIC DIFF AMP +/-10VIN RRO 0.3PPMC 8MSOP DRIVER COURANT/VOLTAGE AJUSTABLE 32LFCSP DRIVER COURANT/VOLTAGE AJUSTABLE 32LFCSP INSTRUMENTATION AMP 1.2MHZ 16LFCSP COMPARATEUR DOUBLE 0.4VREF 6TSOT CNA 16 BITS 2.5V 5PPMC +-16LSB 8SOT23 CNA 16 BITS 5V 5PPMC +-16LSB 8MSOP CNA 16 BITS 5V 5PPMC +-16LSB 8MSOP CNA 16 BITS 5V 5PPMC +-16LSB 8SOT23 CNA 16 BITS 5V 5PPMC +-16LSB 8SOT23 CNA 16 BITS 5V 5PPMC +-32LSB 8SOT23 CNA 16 BITS 5V 5PPMC +-32LSB 8SOT23 LINEAR REG 0.15A 1.8V TO 3.3V 4WLCSP LINEAR REG 2A 1.5V 16LFCSP DC/DC BUCK 0.6A 3MHZ 1.2V 5WLCSP LDO +/-0.8% 0.1A 3.2V 8SOIC HOT-SWAP / MESURE DE COURANT I2C 10MSOP HOT-SWAP / MESURE DE COURANT I2C 10MSOP HOT-SWAP AUTO 2.7V TO 16.5V 8TSOT PWM BUCK 1MHZ 0.6VMIN 10MSOP PWM BUCK 300KHZ 0.6VMIN 10MSOP PWM BUCK 600KHZ 0.6VMIN 10MSOP AMPLI OP DOUBLE 16.3MHZ -/+4.9V 8LFCSP BUCK DOUBLE 5A AJUSTABLE 32LFCSP TRANS DARL NPN 115V 12A TO-220 PRESSURE SWITCH,1.5-75PSIG,1P,1/4´´ 18NPTF PRESSURE SWITCH,3-150PSIG,1P,1/4´´ 18NPTF CIRCUIT BREAKER,THERMAL MAG,3P,10A PRESSURE SWITCH,3-150PSIG,1P,1/4´´ 18NPTF PRESSURE SWITCH,3-150PSIG,1P,1/4´´ 18NPTF PRESSURE SWITCH,1.5-75PSIG,1P,1/4´´ 18NPTF PRESSURE SWITCH,3-150PSIG,1P,1/4´´ 18NPTF PRESSURE SWITCH,5-250PSIG,1P,1/4´´ 18NPTF PRESSURE SWITCH,0-175PSIG,1P,1/4´´ 18NPTF PRESSURE SWITCH,3-150PSIG,1P,1/4´´ 18NPTF MICRO 32 BITS ARM CORTEX M0 16WLCSP MICRO 32 BITS ARM CORTEX M0 32HVQFN MICRO 32 BITS ARM CORTEX M0 32HVQFN MICRO 32 BITS ARM CORTEX M0 32HVQFN MICRO 32 BITS ARM CORTEX M0 32HVQFN MICRO 32 BITS ARM CORTEX M0 100LQFP MICRO 32 BITS ARM CORTEX M0 48LQFP MICRO 32 BITS ARM CORTEX M0 32HVQFN AUXILIARY SWITCH MICRO 32 BITS ARM CORTEX M0 32HVQFN MICRO 32 BITS ARM CORTEX M0 100LQFP MICRO 32 BITS ARM CORTEX M3 32HVQFN MICRO 32 BITS ARM CORTEX M3 100LQFP MICRO 32 BITS ARM CORTEX M3 100LQFP MICRO 32 BITS ARM CORTEX M3 100TFBGA MICRO 32 BITS ARM CORTEX M3 144LQFP MICRO 32 BITS ARM CORTEX M3 208LQFP MICRO 32 BITS ARM CORTEX M3 208LQFP MICRO 32 BITS ARM CORTEX M3 180TFBGA MICRO 32 BITS ARM CORTEX M3 208LQFP MICRO 32 BITS ARM CORTEX M3 208LQFP MICRO 32 BITS ARM CORTEX M3 208LQFP MICRO 32 BITS ARM CORTEX M3 144LQFP MICRO 32 BITS ARM CORTEX M3 100TFBGA MICRO 32 BITS ARM CORTEX M3 144LQFP MICRO 32 BITS ARM CORTEX M3 100TFBGA MICRO 32 BITS ARM CORTEX M3 144LQFP MICRO 32 BITS ARM CORTEX M3 100TFBGA MICRO 32 BITS ARM CORTEX M3 256LBGA MICRO 32 BITS ARM CORTEX M4 100TFBGA MICRO 32 BITS ARM CORTEX M3 144LQFP MICRO 32 BITS ARM CORTEX M3 100TFBGA MICRO 32 BITS ARM CORTEX M3 144LQFP MICRO 32 BITS ARM CORTEX M3 100TFBGA MICRO 32 BITS ARM CORTEX M3 256LBGA MICRO 32 BITS ARM CORTEX M3 144LQFP LED,ORANGE,1.2MM X 0.55MM,100MCD,605NM LED,YELLOW,1.2MM X 0.55MM,63MCD,590NM LED,YELLOW GREEN,1.2MM X 0.55MM,25MCD,572NM LED,SMD,WHITE,170MCD LED,RED,1.6MM X 2.3MM,63MCD,630NM LED,RED,1.6MM X 2.3MM,100MCD,620NM LED,ORANGE,1.6MM X 2.3MM,160MCD,605NM LED,GREEN,1.6MM X 2.3MM,18MCD,560NM LED,GREEN,1.6MM X 2.3MM,140MCD,525NM LED,YELLOW,1.6MM X 2.3MM,160MCD,590NM LED,YELLOW GREEN,1.6MM X 2.3MM,25MCD,572NM LED,BLUE,1.6MM X 2.3MM,100MCD,470NM LED,WHITE,84MW,900MCD SWITCH,SAFETY INTERLOCK,DPST,750MA,240V SWITCH,SAFETY INTERLOCK,DPST-NC,750MA,240V SWITCH,SAFETY INTERLOCK,DPST-NC,750MA,240V SWITCH,SAFETY INTERLOCK,DPST-NC,750MA,240V SWITCH,SAFETY INTERLOCK,DPST-NC,750MA,240V SWITCH,SAFETY INTERLOCK,3PST,750MA,240V SWITCH,SAFETY INTERLOCK,3PST,750MA,240V SWITCH,SAFETY INTERLOCK,3PST,750MA,240V SWITCH,SAFETY INTERLOCK,3PST,750MA,240V SWITCH,SAFETY INTERLOCK,3PST,750MA,240V SWITCH,SAFETY INTERLOCK,3PST,750MA,240V SWITCH,SAFETY INTERLOCK,3PST-NC,750MA,240V AD9608,ADC,SPI,EVALUATION BOARD AD9628,ADC,SPI,EVALUATION BOARD RECEIVER IC LED,XLAMP XP-E,AMBER,62LM,SMD LED,BLUE,780MCD,470NM LED,BLUE,1.1CD,470NM LED,BLUE,1.5CD,470NM LED,WARM WHITE,2.5CD,6LM LED,COOL WHITE,2.8CD LED,COOL WHITE,2.8CD,7LM LED,COOL WHITE,3.8CD,9.5LM LED,BLUE,450MCD,470NM LED,BLUE,450MCD,470NM LED,GREEN,1.3CD,527NM LED,AMBER,5CD,591NM LED,AMBER,1.5CD,591NM LED,BLUE,550MCD,470NM WRENCH,DISCONNECT,& ASSEMBLY TOOL TWEEZER,CROSS ACTION,160MM TWEEZER,CERAMIC,140MM TWEEZER,RADIO,155MM SOLDERING IRON 25W,UK PLUG SOLDERING IRON 40W,UK PLUG TIP,25W TIP,40W SCREWDRIVER SET,WATCHMAKER,SET 4 SCREWDRIVER,ROBERTSON,SIZE 1 SCREWDRIVER,ROBERTSON,SIZE 2 SCREWDRIVER,ROBERTSON,SIZE 3 POWDER,CHALK,RED,100G SQUARE,JOINERS,225MM PLIERS,CIRCLIP,INSIDE,170MM PLIERS,CIRCLIP,INSIDE,180MM PLIERS,CIRCLIP,OUTSIDE,180MM PLIERS,CIRCLIP,OUTSIDE,BENT,180MM HAMMER,ENGINEERS,1LB GUN,GLUE,80W,UK PLUG STICK,GLUE 100 X 11MM,PK OF 25 KNIFE,CABLE,NO.28HX STRIPPER,AUTOMATIC,NO.6-16 PLIERS,CRIMPING,0.25-2.5MM,140MM PLIERS,CRIMPING,0.25-16MM,180MM KIT,CRIMPING PLIERS / TERMINALS PLIERS,LONG NOSE,HEAVY DUTY,W CUTTER CUTTER,MULTIFUNCTION,DIAGONAL,HD SET,PLIERS,WATERPUMP,3PCS SSR,PANEL MOUNT,200VDC,32VDC,10A TIP CARTRIDGE,SOLDER,30° CHISEL 0.06IN OSCILLOSCOPE,2 CH,50 MHZ,1GSPS OSCILLOSCOPE,70 MHZ,2 CHANNEL OSCILLOSCOPE,100 MHZ,2 CHANNEL OSCILLOSCOPE,150 MHZ,2 CHANNEL VENTILATEUR. 119MM 12V C.C VENTILATEUR 119MM 12 VCC VENTILATEUR 60MM 12 VCC VENTILATEUR. 80MM 12V C.C WIRE-BOARD CONN,RECEPTACLE,12POS,2MM THERMAL IMAGER,22.5H X 31V,1.2M THERMAL IMAGER,9HZ THERMAL IMAGER,9HZ VISOR TRIPOD MOUNTING BATTERY,LITHIUM-ION,RECHARGEABLE RJ12,JACK,6POS,6CONTACT,1PORT TERMINAL BLOCK,HEADER,3.5MM,5POS TERMINAL BLOCK,HEADER,3.5MM,5POS TERMINAL BLOCK,HEADER,3.81MM,2POS TERMINAL BLOCK,HEADER,3.81MM,3POS TERMINAL BLOCK,HEADER,3.81MM,4POS TERMINAL BLOCK,HEADER,3.81MM,5POS RJ11 MODULAR JACK,6POS,1 PORT TERMINAL BLOCK,HEADER,3.81MM,2POS TERMINAL BLOCK,HEADER,3.81MM,3POS TERMINAL BLOCK,HEADER,3.81MM,4POS TERMINAL BLOCK,HEADER,3.81MM,5POS TERMINAL BLOCK,HEADER,3.5MM,2POS TERMINAL BLOCK,HEADER,3.5MM,3POS TERMINAL BLOCK,HEADER,3.81MM,2POS TERMINAL BLOCK,HEADER,3.81MM,3POS TERMINAL BLOCK,HEADER,3.5MM,2POS TERMINAL BLOCK,HEADER,3.5MM,3POS TERMINAL BLOCK,HEADER,3.81MM,2POS TERMINAL BLOCK,HEADER,3.81MM,3POS CAT3 RJ50 MODULAR JACK,10POS,1 PORT CAT3 RJ45 MODULAR JACK,8POS,1 PORT CAT5 RJ45 MODULAR JACK,8POS,1 PORT CAT5 RJ45 MODULAR JACK,8POS,1 PORT CRIMP TOOL,SAI M23,0.14 - 4.0MM2 CRIMP TOOL,SAI M23,0.14 - 2.5MM2 No description available - 2095421 RELAY,HIGH FREQ,DPDT,12VDC,SMD RELAY,HIGH FREQ,DPDT,24VDC,SMD RELAY,HIGH FREQ,DPDT,3VDC,SMD RELAY,HIGH FREQ,DPDT,4.5VDC,SMD RELAY,HIGH FREQ,DPDT,5VDC,SMD CAPACITOR CERAMIC,1UF,4V,X5R,20%,0201 CAPACITOR CERAMIC,4.7UF,25V,X5R,10%,1206 CAPACITOR CERAMIC,4.7UF,50V,X7R,10%,1206 DETECTION SENSOR,±1.2g,1.333V/g,12VDC DETECTION SENSOR,±1.2g,1.333V/g,24VDC DETECTION SENSOR,±0.5g,3V/g,5VDC DETECTION SENSOR,±0.5g,3V/g,12VDC DETECTION SENSOR,±0.5g,3V/g,24VDC POWER CORD,IEC 320 C14 TO IEC 320 C136FT,10A DC-DC CONV,ISO POL,1 O/P,204W,17A,12V DC-DC CONV,ISO POL,1 O/P,204W,17A,12V DC-DC CONV,ISO POL,1 O/P,204W,17A,12V DC-DC CONV,ISO POL,1 O/P,204W,17A,12V VREG 1% 2.495V 36V 3SOT23 VREG 1% 2.495V 36V 3SOT23 VREG 1% 2.495V 36V 3SOT23 VREG 0.5% 2.495V 36V 3SOT23 VREG 0.5% 2.495V 36V 3SOT23 VREG 0.5% 2.495V 36V 3SOT23 VREG 2% 2.495V 36V 3SOT23 VREG 2% 2.495V 36V 3SOT23 VREG 2% 2.495V 36V 3SOT23 VREG 2% 2.495V 36V 3SOT23 VREG 2% 2.495V 36V 3SOT23 VREG 2% 2.495V 36V 3SOT23 LDO 1.2V 200MA 6SOT886 LDO 1.8V 200MA 6SOT886 LDO 2.5V 200MA 6SOT886 LDO 2.8V 200MA 6SOT886 LDO 2.9V 200MA 6SOT886 LDO 3.0V 200MA 6SOT886 LDO 3.3V 200MA 6SOT886 LDO 1.5V 200MA 5SOT753 LDO 2.5V 200MA 5SOT753 LDO 2.9V 200MA 5SOT753 LDO 3.0V 200MA 5SOT753 LDO 3.3V 200MA 5SOT753 LDO 1.2V 200MA 5SOT753 LDO 1.5V 200MA 5SOT753 LDO 1.8V 200MA 5SOT753 LDO 2.5V 200MA 5SOT753 LDO 2.8V 200MA 5SOT753 LDO 2.9V 200MA 5SOT753 LDO 3.0V 200MA 5SOT753 LDO 1.2V 150MA 4HUSON LDO 1.5V 150MA 4HUSON LDO 1.8V 150MA 4HUSON LDO 2.5V 150MA 4HUSON LDO 2.8V 150MA 4HUSON LDO 2.9V 150MA 4HUSON LDO 3.0V 150MA 4HUSON LDO 3.1V 150MA 4HUSON LDO 3.3V 150MA 4HUSON LDO 1.2V 150MA 4HUSON LDO 1.5V 150MA 4HUSON LDO 1.8V 150MA 4HUSON LDO 2.5V 150MA 4HUSON LDO 2.8V 150MA 4HUSON LDO 2.9V 150MA 4HUSON LDO 3.0V 150MA 4HUSON LDO 3.1V 150MA 4HUSON LDO 3.3V 150MA 4HUSON CAPACITOR ALUM ELEC 1UF ELECTROMECHANICAL TOTALIZING COUNTER CONTACT,FEMALE,24-22AWG,CRIMP IC PWM MOTOR DRVR,1A,MSOP10 CARTE D´EVAL 5V MICROCO 8 BITS & CAPTEUR MCU CARTE PXN COMMS PROTOCOL KIT D´EVAL PXN COMMS PROTOCOL KIT D´EVAL PXS20 MCU KIT D´EVAL PXS30 MCU KIT D´EVAL TOUCH SENSING W/H CAPTEURS DSC 32 BITS MC56F84 100MHZ 100LQFP DSC 32 BITS MC56F84 100MHZ 80LQFP DSC 32 BITS MC56F84 100MHZ 64LQFP DSC 32 BITS MC56F84 100MHZ 48LQFP DSC 32 BITS MC56F84 100MHZ 100LQFP DSC 32 BITS MC56F84 100MHZ 80LQFP DSC 32 BITS MC56F84 100MHZ 64LQFP DSC 32 BITS MC56F84 100MHZ 48LQFP RELAY CARTE PROTOTYPE DPCO 9VDC RELAY CARTE PROTOTYPE DPCO 12VDC RELAY CARTE PROTOTYPE DPCO 12VDC RELAY CARTE PROTOTYPE DPCO 4.5VDC RELAY CARTE PROTOTYPE DPCO 5VDC RELAY CARTE PROTOTYPE DPCO 12VDC RELAY CARTE PROTOTYPE DPCO 4.5VDC RELAY CARTE PROTOTYPE SPNO 12VDC RELAY CARTE PROTOTYPE SPNO 3VDC RELAY CARTE PROTOTYPE DPNO 12VDC RELAY CARTE PROTOTYPE DPNO 5VDC RELAY CARTE PROTOTYPE DPNO 4.5VDC RELAY CARTE PROTOTYPE DPCO 8A 24VDC RELAY CARTE PROTOTYPE DPCO 8A 12VDC RELAY CARTE PROTOTYPE DPCO 8A 12VDC RELAY CARTE PROTOTYPE DPCO 8A 24VDC RELAY CARTE PROTOTYPE SPNO 10A 12VDC RELAY CARTE PROTOTYPE SPNO 10A 5VDC RELAY CARTE PROTOTYPE DPNO 8A 24VDC RELAY CARTE PROTOTYPE SPNO 8A 5VDC RELAY CARTE PROTOTYPE SPNO 8A 6VDC RELAY CARTE PROTOTYPE DPNO 8A 12VDC RELAY CARTE PROTOTYPE DPNO 8A 48VDC RELAY CARTE PROTOTYPE DPNO 8A 3VDC RELAY CARTE PROTOTYPE SPNO 5A 18VDC RELAY CARTE PROTOTYPE SPNO 20A 12VDC RELAY CARTE PROTOTYPE SPCO 16A 12VDC RELAY CARTE PROTOTYPE SPNO 16A 12VDC RELAY CARTE PROTOTYPE SPNO 16A 24VDC RELAY CARTE PROTOTYPE SPNO 16A 12VDC RELAY CARTE PROTOTYPE SPNO 16A 24VDC RELAY CARTE PROTOTYPE SPNO 5A 12VDC RELAY CARTE PROTOTYPE SPNO 5A 5VDC RELAY CARTE PROTOTYPE SPNO 10A 24VDC RELAY CARTE PROTOTYPE SPNO 10A 12VDC RELAY CARTE PROTOTYPE SPCO 5A 24VDC RELAY CARTE PROTOTYPE SPCO 10A 12VDC RELAY CARTE PROTOTYPE SPCO 10A 24VDC RELAY CARTE PROTOTYPE SPCO 10A 48VDC RELAY CARTE PROTOTYPE SPCO 10A 5VDC RELAY CARTE PROTOTYPE SPNO 10A 12VDC RELAY CARTE PROTOTYPE SPNO 10A 24VDC RELAY CARTE PROTOTYPE SPCO 10A 24VDC RELAY CARTE PROTOTYPE SPCO 10A 48VDC RELAY CARTE PROTOTYPE SPNO 16A 24VDC RELAY CARTE PROTOTYPE SPNO 16A 5VDC RELAY CARTE PROTOTYPE SPNO 16A 12VDC RELAY CARTE PROTOTYPE SPNO 16A 24VDC RELAY CARTE PROTOTYPE DPCO 16A 48VDC RELAY CARTE PROTOTYPE DPCO 16A 6VDC RELAY CARTE PROTOTYPE SPNO 10A 24VDC RELAY CARTE PROTOTYPE SPNO 5A 5VDC MICROCOMMUTATEUR HINGE LEVER MICROCOMMUTATEUR PLONGEUR MICROCOMMUTATEUR PLONGEUR MICROCOMMUTATEUR HINGE LEVER MICROCOMMUTATEUR PLONGEUR MICROCOMMUTATEUR SIM ROLLER LEVER MICROCOMMUTATEUR SIM ROLLER LEVER DRIVER MOSFET 8.2V RELAY PHOTOMOS 100V 0.32A RELAY PHOTOMOS 60V 0.5A RELAY PHOTOMOS 350V 0.12A CAPTEUR MOUVEMENT 5M BLANC CAPTEUR MOUVEMENT 5M BLANC CAPTEUR MOUVEMENT 5M NOIR CAPTEUR MOUVEMENT 5M PEARL BLANC CAPTEUR MOUVEMENT 5M BLANC CAPTEUR MOUVEMENT 5M NOIR CAPTEUR MOUVEMENT 5M PEARL BLANC CAPTEUR MOUVEMENT 5M BLANC CAPTEUR MOUVEMENT 5M NOIR CAPTEUR MOUVEMENT 5M PEARL BLANC CAPTEUR MOUVEMENT 12M BLANC CAPTEUR MOUVEMENT 12M NOIR CAPTEUR MOUVEMENT 12M PEARL BLANC CAPTEUR MOUVEMENT 12M BLANC CAPTEUR MOUVEMENT 12M NOIR CAPTEUR MOUVEMENT 12M PEARL BLANC CAPTEUR MOUVEMENT 12M PEARL BLANC STRIPPERS,SHEATHING,AM16 TOOL,CABLE GLAND,FOR M12 CON TOOL,CABLE GLAND,FOR M8 CON TOOL,CRIMP,HDC CON,4-10MM TOOL,CRIMP,FOR PV CONNECT IC,PSE CONTROLLER,3.3V,QFN-52 IC,PSE CONTROLLER,3.3V,QFN-52 IC,PSE CONTROLLER,3.3V,QFN-52 IC,PSE CONTROLLER,3.3V,QFN-24 IC,SYNC BUCK DC-DC CONV,4 MHz,MSOP-12 IC,SURGE STOPPER,500 V,DFN-8 IC,SURGE STOPPER,500 V,DFN-8 IC,SURGE STOPPER,500 V,8-SOT-23 IC,SURGE STOPPER,500 V,8-SOT-23 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0400,CL-L330,CXA20 LED REFLECTOR,LED BXRA-C0400,CL-L330,CXA20 LED LENS,RECT,CREE MX-3,ASYMMETRIC SAW FILTER,GPS,1.5754GHZ ENABLLING PUSHBUTTON SWITCH,DPST-NO/DPST-NO ENABLLING PUSHBUTTON SWITCH,DPST-NO/SPST-NC ENABLLING PUSHBUTTON SWITCH LED LENS,RECT,CREE XP-E,ASYMMETRIC LED REFLECTOR,CREE LED CXA20 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,CREE LED CXA20 LED REFLECTOR,LED BXRA-C0800/1200/2000 LED REFLECTOR,Cree LED MT-G LED REFLECTOR,Cree LED MT-G LED LENS,RECT,CREE XP-E,ASYMMETRIC LED REFLECTOR,Cree LED MT-G LED REFLECTOR,Cree LED MT-G LED LENS,ROUND,CREE XP-E,WIDE SHEILD ARDUINO MODULE GPS AMPLI CLASSE D 3W 5V 4OHM 9WCSP BUCK 0.5A 4MHZ 2.5V MICROSIP BUCK 0.6A 5.5MHZ 1.5V MICROSIP BUCK 0.6A 5.5MHZ 1.8V MICROSIP BUCK 3.5V TO 42VIN 2.5A 2.5MHZ 10SON CONTROLEUR VOLTAGE MODE 0.2A 8SO LDO 2V A 5.5VIN 0.3A 2.8V 6SON LDO 2V A 5.5VIN 0.3A 3.6V 6SON LDO 2V A 5.5VIN 2.5V 0.5% 4DSBGA LDO 2V A 5.5VIN 3V 0.5% 4DSBGA LDO 3V A 24VIN 3V 0.05A 6SON LDO DOUBLE 2.85V / 1.8V 2% 6WSON LDO DOUBLE 3.3V / 3V 2% 6WSON LDO DOUBLE 3V / 3V 2% 6WSON AMPLI OP QUADRUPLE RRO 1MHZ 14TSSOP PMU I2C 3 BUCK 11 LDO 120BGA SEQUENCER ALIMENTATION 12 RAIL 64VQFN FREQ SYNTHETAILLER 480/80MHZ 44QFN FREQ SYNTHETAILLER 125MHZ 24QFN FREQ SYNTHETAILLER 125MHZ 44QFN FREQ SYNTHETAILLER 156.25MHZ 24QFN FREQ SYNTH 125MHZ DOUBLE 24QFN FREQ SYNTH 156.25/312.5MHZ 44QFN LIMITING AMP 1.25GBPS 16QFN KIT D´EVAL 18DB WIFI EX ANT GS10111 KIT D´EVAL 18DB WIFI CARTE ANT GS10111 ROM SMARTWATCH 64K/256K 28-SOCKET TCXO,19.2MHZ,SMD TCXO,16.3676MHZ,SMD TCXO,19.2MHZ,SMD CRYSTAL,48MHZ,18PF,DIP KIT SYNTHETAILLER / MIXER RFFC5071 KIT SYNTHETAILLER / MIXER RFFC5072 DIODE,TVS,SOD-323 OSCILLATOR,33MHZ,3.3V,SMD CRYSTAL,25MHZ,18pF,HC-49S CRYSTAL,25MHZ,16pF,HC-49S CRYSTAL,48MHZ,10pF,HC-49S OSCILLATOR,LVPECL,100MHZ,SMD OSCILLATOR,LVPECL,106.25MHZ,SMD OSCILLATOR,LVPECL,125MHZ,SMD OSCILLATOR,LVPECL,150MHZ,SMD OSCILLATOR,LVPECL,155.52MHZ,SMD OSCILLATOR,LVPECL,156.25MHZ,SMD OSCILLATOR,LVPECL,166MHZ,SMD OSCILLATOR,LVPECL,50MHZ,SMD OSCILLATOR,LVPECL,75MHZ,SMD OSCILLATOR,LVDS,100MHZ,SMD OSCILLATOR,LVDS,125MHZ,SMD OSCILLATOR,LVDS,156.25MHZ,SMD OSCILLATOR,LVDS,62.5MHZ,SMD OSCILLATOR,VCO,155.52MHZ,SMD OSCILLATOR,VCO,156.25MHZ,SMD OSCILLATOR,VCO,122.88MHZ,SMD OSCILLATOR,VCO,61.44MHZ,SMD OSCILLATOR,VCO,77.76MHZ,SMD OSCILLATOR,LVPECL,106.25MHZ,SMD OSCILLATOR,LVPECL,125MHZ,SMD OSCILLATOR,LVPECL,150MHZ,SMD OSCILLATOR,LVPECL,156.25MHZ,SMD OSCILLATOR,LVPECL,212.5MHZ,SMD OSCILLATOR,LVPECL,250MHZ,SMD OSCILLATOR,LVPECL,312.5MHZ,SMD OSCILLATOR,LVDS,150MHZ,SMD OSCILLATOR,LVDS,156.25MHZ,SMD OSCILLATOR,LVDS,212.5MHZ,SMD OSCILLATOR,LVDS,250MHZ,SMD OSCILLATOR,LVDS,312.5MHZ,SMD OSCILLATOR,LVPECL,106.25MHZ,SMD OSCILLATOR,LVPECL,156.25MHZ,SMD OSCILLATOR,LVPECL,212.5MHZ,SMD OSCILLATOR,LVPECL,312.5MHZ,SMD OSCILLATOR,LVDS,156.25MHZ,SMD OSCILLATOR,LVDS,212.5MHZ,SMD OSCILLATOR,LVDS,312.5MHZ,SMD OSCILLATOR,VCO,27MHZ,SMD OSCILLATOR,VCO,38.88MHZ,SMD OSCILLATOR,TCXO,16.368MHZ,SMD OSCILLATOR,TCXO,16.368MHZ,SMD OSCILLATOR,TCXO,16.369MHZ,SMD OSCILLATOR,TCXO,16.369MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,38.4MHZ,SMD OSCILLATOR,TCXO,38.4MHZ,SMD OSCILLATOR,TCXO,40MHZ,SMD OSCILLATOR,TCXO,40MHZ,SMD OSCILLATOR,TCXO,40MHZ,SMD OSCILLATOR,TCXO,40MHZ,SMD OSCILLATOR,TCXO,40MHZ,SMD OSCILLATOR,TCXO,16.3676MHZ,SMD OSCILLATOR,TCXO,16.3676MHZ,SMD OSCILLATOR,TCXO,16.367667MHZ,SMD OSCILLATOR,TCXO,16.367667MHZ,SMD OSCILLATOR,TCXO,16.367667MHZ,SMD OSCILLATOR,TCXO,16.367667MHZ,SMD OSCILLATOR,TCXO,16.367667MHZ,SMD OSCILLATOR,TCXO,16.368MHZ,SMD OSCILLATOR,TCXO,16.368MHZ,SMD OSCILLATOR,TCXO,16.368MHZ,SMD OSCILLATOR,TCXO,16.368MHZ,SMD OSCILLATOR,TCXO,16.368MHZ,SMD OSCILLATOR,TCXO,16.369MHZ,SMD OSCILLATOR,TCXO,16.369MHZ,SMD OSCILLATOR,TCXO,16.369MHZ,SMD OSCILLATOR,TCXO,16.369MHZ,SMD OSCILLATOR,TCXO,16.369MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,19.2MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,40MHZ,SMD OSCILLATOR,TCXO,40MHZ,SMD OSCILLATOR,TCXO,26MHZ,3.3V,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD OSCILLATOR,TCXO,26MHZ,SMD MODULE ANTENNE RADIO 433MHZ 40DB BUCK 2.9-5.5VIN 2A AJUSTABLE 4MHZ 12MLF RESET DOUBLE ACTIVE-LOW 6WLCSP RESET DOUBLE ALIMENTATION MONITOR 8MLF RESET DOUBLE ALIMENTATION MONITOR 8MLF DOUBLE INTG PULL UP RESISTANCE 8MLF RESET DOUBLE 1.6V TO 5.5V 8MLF BUCK 4.5V TO 75VIN 4A AJUSTABLE 28MLF LDO 2.375V TO 5.5VIN 1A 1.8V 8SOIC LDO 2.375V TO 5.5VIN 1A 1.8V 6MLF LDO 2.375V TO 5.5VIN 1A 1.8V 3SOT223 LDO 2.375V TO 5.5VIN 1A AJUSTABLE 8SOIC LDO 2.375V TO 5.5VIN 1A AJUSTABLE 6MLF LDO 2.375V TO 5.5VIN 1A 1.8V 6MLF LDO 2.375V TO 5.5VIN 1A AJUSTABLE 8SOIC LDO 2.375V TO 5.5VIN 1A AJUSTABLE 6MLF LDO 2.3V A 30VIN 0.15A AJUSTABLE 8SOIC LOAD COMMUTATEUR 1.8V TO 3.6VIN 4WLCSP REG RIPPLE 1.8V-3.6VIN 1.2V 4MLF REG RIPPLE 1.8V-3.6VIN 1.5V 4MLF REG RIPPLE 1.8V-3.6VIN 1.8V 4MLF REG RIPPLE 1.8V-3.6VIN 3V 4MLF REG RIPPLE 1.8V-3.6VIN 3.3V 4MLF PINCE MULTI-USAGES 160MM JEU DE 4 PINCES ISOLEES VDE PINCE MULTI-USAGES 160MM JEU DE 4 PINCES ISOLEES VDE PINCE COUPANTE DE COTE 180MM PINCE COUPANTE DE COTE 180MM PINCE COUPANTE/DENUDANT D.COTE CUTTER,CABLE,ONE-HAND COUPE-CABLES BATTERIE LITHIUM 3.6V 2.4AH AA BATTERIE LITHIUM 3.6V 8.5AH C BATTERIE LITHIUM 3.6V 19AH D JUMPER,FFC,0.5MM,50MM,30WAY JUMPER,FFC,1MM,152MM,8WAY JUMPER,FFC,1MM,50MM,16WAY JUMPER,FFC,1MM,152MM,16WAY JUMPER,FFC,0.3MM,104MM,25WAY JUMPER,FFC,0.3MM,104MM,27WAY JUMPER,FFC,0.3MM,104MM,33WAY CARTE D´EVAL LOGARITH DECTECTOR AD8304 CARTE D´EVAL CAN 16 BITS 200MSPS AD9467 CARTE D´EVAL CAN 16 BITS 250MSPS AD9467 CARTE D´EVAL CAN 14 BITS 80MSPS AD9644 CARTE D´EVAL CAN 14 BITS 155MSPS AD9644 CARTE D´EVAL DIFFERENCE AMP 18V ADA4830 CARTE D´EVAL DAC 16 BITS SPI AD5541A CARTE D´EVAL DAC QUAD 16 BIT SPI AD5755S CARTE D´EVAL CAN 24BIT 4.8KSPS AD7195 CARTE D´EVAL CAN 16BITS 500KSPS AD7988-5 CARTE D´EVAL DAC 16 BITS DOUBLE AD9122 CARTE D´EVAL DAC 16 BITS DOUBLE AD9122 MODULE RF 868MHZ 10DBM MODULE RF 900MHZ 10DBM MODULE RF 2400MH 10DBM MODULE RF 900MHZ 10DBM MODULE RF 2400MH 10DBM MODULE D´EVAL RF 433MHZ MODULE D´EVAL RF 686MHZ MODULE D´EVAL RF 900MHZ MODULE D´EVAL RF 2400MHZ MODULE D´EVAL RF 868MHZ MODULE D´EVAL RF 900MHZ MODULE D´EVAL RF 2400MHZ MODULE D´EVAL RF 2.4GHZ CARTE D´EVAL RF A/P 433MHZ CARTE D´EVAL RF E/P 433MHZ CARTE D´EVAL RF A/P 868MHZ CARTE D´EVAL RF E/P 868MHZ CARTE D´EVAL RF A/P 900MHZ CARTE D´EVAL RF E/P 900MHZ CARTE D´EVAL RF A/P 2400MHZ CARTE D´EVAL RF E/P 2400MHZ CARTE D´EVAL RF A/P 868MHZ CARTE D´EVAL RF E/P 868MHZ CARTE D´EVAL RF A/P 900MHZ CARTE D´EVAL RF E/P 900MHZ CARTE D´EVAL RF A/P 2400MHZ CARTE D´EVAL RF E/P 2400MHZ MODULE RF RADIO 900MHZ. SPI MODULE RF RADIO 2.4GHZ 16DBM MODULE ANTENNE 04C 433MHZ U.FL MODULE ANTENNE 09C 900MHZ U.FL MODULE ANTENNE 24C 2400MHZ U.FL Tools,Tips Soldering Leaded Process Com Tools,Tips Soldering Leaded Process Com KEY OPERATED SWITCH DRIVER CAN AMPLI DIFF 16 BIT 8MSOP DAC 14BIT +/-4LSB 5.5VIN 6LFCSP DAC 8BIT +/-6LSB 5.5VIN 6LFCSP DAC 8BIT +/-4LSB 5.5VIN 6LFCSP DAC 8BIT +/-0.5LSB 5.5VIN 6SC70 DAC 8BIT +/-0.5LSB 5.5VIN 6LFCSP CAN DIFF ENTREE 16 BIT 250KSPS 8MSOP CAN DIFF ENTREE 14BIT 80MSPS 32LFCSP CAN 16 BITS 250MSPS +/-3.5LSB 72LFCSP CAN 14 BITS 80MSPS +/-0.5LSB 48LFCSP CAN 14 BITS 155MSPS +/-0.55LSB 48LFCSP CAN 14 BITS 80MSPS +/-0.5LSB 48LFCSP CAN 260MHZ 16 BITS 3-7VIN 8SOIC DRIVER LED 1MHZ 36V 14LFCSP AMPLI CLASSE G STEREO 0.1W 16WLCSP DAC 16 BITS +/-2LSB 0.05PPMC 10LFCSP DAC 16 BITS +/-1LSB 0.05PPMC 8LFCSP DAC 16 BITS +/-1LSB 0.05PPMC 10LFCSP DAC QUAD 16 BITS -26.4/33VIN 64LFCSP CAN 4.8KHZ 24BIT 3FIL/SPI 32LFCSP CAN 500KSPS 16 BITS SPI 10LFCSP DAC DOUBLE 16 BITS 1230MSPS 72LFCSP IC SOCKET,DIP,2.54MM,24POS No description available - 2096203 IC SOCKET,SIP,1ROW,2.54MM,64POS IC SOCKET,22POS,THRU HOLE,2.54MM,10.16MM ROW DIP SOCKET,32POS,THROUGH HOLE No description available - 2096208 No description available - 2096209 No description available - 2096210 IC SOCKET,SIP,1ROW,1.27MM,100POS TRANSISTOR SOCKET,4POS ANTENNE YAGI 7 ELEMENT 434MHZ ANTENNE YAGI 9 ELEMENT 869-915MHZ ANTENNE YAGI 16 ELEMENT 2.4GHZ ANTENNE STUB STRAIGHT 868-915MHZ ANTENNE STUB ANGLE DROIT 868-915MHZ ANTENNE STUB STRAIGHT 434MHZ ANTENNE STUB 2.4GHZ MODULE AUDIO/VIDEO TRANSMITER RECEPTEUR 2 CH WITH 2 ALIEN FOB TELECOMMANDE FOB KEELOQ RECEPTEUR 4 CH WITH 2 LIDER FOB LIDER-4 FOB KEY FOB DUET 2 BOUTON MODULE DUET RECEPTEUR PROGRAMMATEUR REMOTE CONTROL EMETTEUR AVEC CANAL AU CHOIX RECEIVER,WITH SELECTABLE CH MODULE ERA TCVR 420-470MHZ MODULE ERA TX 420-470MHZ MODULE ERA TCVR 802-940MHZ MODULE ERA TX 802-940MHZ ICM F-CONN DB STARTER KIT WITH COMPRESSION TOOL/STRIPPER/FIT TOOL AND CONNECTORS 50T8943 N CHANNEL MOSFET,30V,9.5A,SOIC CARTE D´EVALUATION CORTEX M0 STM32F0 TERMINAL BLOCK,PLUG,12POS,30-14AWG TERMINAL BLOCK,PLUG,12POS,30-14AWG TERMINAL BLOCK,PLUG,12POS,30-14AWG TERMINAL BLOCK,PLUG,12POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG TERMINAL BLOCK,PLUG,2POS,30-14AWG TERMINAL BLOCK,PLUG,3POS,30-14AWG TERMINAL BLOCK,PLUG,4POS,30-14AWG TERMINAL BLOCK,PLUG,6POS,30-14AWG TERMINAL BLOCK,PLUG,8POS,30-14AWG RELAY ANTENNA,HARMONY XB5R EARPHONE,STEREO,1.2M,16 OHM,RED,EVALDI LED,HB,MICRO SM4,COOL WHITE,450LM LED,HB,MICRO SM4,COOL WHITE,520LM DIODE DE REDRESSEMENT 20V 0.5A SOT1608 DIODE DE REDRESSEMENT 20V 1A SOT1608 DIODE DE REDRESSEMENT 40V 1A SOT1608 DIODE DE REDRESSEMENT 40V 0.5A SOT1608 DIODE DE REDRESSEMENT 40V 1.5A SOT1608 No description available - 2096340 No description available - 2096344 GUN,GLUE,PORTABLE,GAS,GASTEC600 GUN,GLUE,ELECTRONIC,12MM,UK VERSION HUB,MULTIDROP,8 WAY,USB TO RS422/485 EXPRESS CARD,RS232,SERIAL,2PORT EXPRESS CARD,RS422/485,SERIAL CONVERTOR,ETHERNET TO 4 RS422/485 CONVERTOR,ETHERNET TO 8 RS422/485 CONVERTER. ETHERNET TO 4 RS232 CONVERTER. ETHERNET TO 8 RS232 POWER SUPPLY,5V,1A,ES-357 SLEEVING,BRAIDED,NYLON,25.4MM ID,BLK,250FT MINI D RIBBON CONN,PLUG,20POS,SOLDER MINI D RIBBON CONN,PLUG,26POS,SOLDER MINI D RIBBON CONN,PLUG,50POS,SOLDER PORTE POS NAND SIMPLE 2 IP 6SON PORTE POS NAND SIMPLE 3 IP 6SON PORTE POS NAND SIMPLE 3 IP 6SON PORTE POS AND SIMPLE 3 IP 6SON PORTE POS AND SIMPLE 3 IP 6SON PORTE POS OR SIMPLE 3 IP 6SON PORTE POS OR SIMPLE 3 IP 6SON COMMUTATEUR ANALOG SIMPLE 6SON COMMUTATEUR ANALOG SIMPLE 6SON PORTE CONFIG MULTI-FUNC 6SON PORTE CONFIG MULTI-FUNC 6SON PORTE CONFIG MULTI-FUNC 6SON PORTE CONFIG MULTI-FUNC 6SON PORTE CONFIG MULTI-FUNC 6SON PORTE CONFIG MULTI-FUNC 6SON PORTE CONFIG MULTI-FUNC 6SON PORTE CONFIG MULTI-FUNC 6SON INTERFACE SOCKET XLP 28SSOP MOUSE MICRO SWITCH,BUTTON,SPDT,15A,250V IC,32BIT MCU,PIC32,40MHz,TQFP-44 IC,32BIT MCU,PIC32,40MHz,TQFP-44 IC,32BIT MCU,PIC32,40MHz,DIP-28 IC,32BIT MCU,PIC32,40MHz,TQFP-44 IC,8BIT MCU,PIC16F,32MHz,SSOP-28 LED STRIP,240MW,13LM,WHITE LED STRIP,960MW,52LM,WHITE LED STRIP,1.32W,52LM,WHITE LED STRIP,2.64W,156LM,WHITE LED LIGHT BAR,RGB,3.5W,24VDC,306MM LED LIGHT BAR,RGB,7W,24VDC,607MM LED LIGHT BAR,RGB,10.5W,24VDC,908MM LED MODULE,35W,2300LM,WARM WHITE LED BULB,BA15S,WARM WHITE,2W LED BULB,G4,WARM WHITE,2W LED BULB,EDISON SCREW/E12,WARM WHITE,4W LED BULB,GU5.3,WARM WHITE,4W LED BULB,GU5.3,WARM WHITE,4W LED BULB,EDISON SCREW/E26,WARM WHITE,7W LED BULB,EDISON SCREW/E26,WARM WHITE,7W LED BULB,EDISON SCREW/E26,WARM WHITE,7W LED BULB,EDISON SCREW/E26,WARM WHITE,11W LED BULB,EDISON SCREW/E26,WARM WHITE,13W LED BULB,EDISON SCREW/E26,WARM WHITE,17W LED BULB,EDISON SCREW/E26,WARM WHITE,17W LED BULB,GU5.3,WARM WHITE,3.6W LED BULB,GU5.3,WARM WHITE,3.6W NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,CLEAR NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,CLEAR NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,CLEAR NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,CLEAR NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,CLEAR NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,CLEAR NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,BLUE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,BLUE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,BLUE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,BLUE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,480VAC,1.5mA,RED NEON INDICATOR,480VAC,1.5mA,AMBER NEON INDICATOR,480VAC,1.5mA,WHITE NEON INDICATOR,480VAC,1.5mA,GREEN NEON INDICATOR,480VAC,1.5mA,RED NEON INDICATOR,480VAC,1.5mA,AMBER NEON INDICATOR,480VAC,1.5mA,WHITE NEON INDICATOR,480VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,600VAC,1.5mA,AMBER NEON INDICATOR,600VAC,1.5mA,WHITE NEON INDICATOR,600VAC,1.5mA,GREEN NEON INDICATOR,600VAC,1.5mA,RED NEON INDICATOR,600VAC,1.5mA,AMBER NEON INDICATOR,600VAC,1.5mA,WHITE NEON INDICATOR,600VAC,1.5mA,GREEN INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED PANEL MOUNT INDICATOR,LED,12.7MM,RED,14V PANEL MOUNT INDICATOR,LED,12.7MM,RED,28V PANEL MOUNT INDICATOR,LED,12.7MM,RED,6V PANEL MOUNT INDICATOR,LED,12.7MM,GREEN,14V PANEL MOUNT INDICATOR,LED,12.7MM,GREEN,28V PANEL MOUNT INDICATOR,LED,12.7MM,GREEN,6V PANEL MOUNT INDICATOR,LED,12.7MM,YELLOW,14V PANEL MOUNT INDICATOR,LED,12.7MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,12.7MM,YELLOW,6V PANEL MOUNT INDICATOR,LED,12.7MM,RED,14V PANEL MOUNT INDICATOR,LED,12.7MM,RED,28V PANEL MOUNT INDICATOR,LED,12.7MM,GREEN,14V PANEL MOUNT INDICATOR,LED,12.7MM,GREEN,28V PANEL MOUNT INDICATOR,LED,12.7MM,YELLOW,14V PANEL MOUNT INDICATOR,LED,12.7MM,YELLOW,28V LED BULB,MIDGET FLANGE,RED,T-1 3/4 LED BULB,MIDGET FLANGE,YELLOW LED BULB,MIDGET FLANGE,WHITE,T-1 3/4 LED BULB,MIDGET GROOVE/S5.7S,BLUE LED BULB,MIDGET GROOVE/S5.7S,RED LED BULB,MIDGET GROOVE/S5.7S,WHITE LED BULB,MIDGET GROOVE/S5.7S,BLUE LED BULB,MIDGET GROOVE/S5.7S,WHITE LED BULB,BA9S,WHITE,T-3 1/4 LED BULB,BA9S,RED,T-3 1/4 LED BULB,BA9S,WHITE,T-3 1/4 LED BULB,BA9S,RED,T-3 1/4 LED BULB,BA9S,GREEN,T-3 1/4 LED BULB,BA9S,BLUE,T-3 1/4 LED BULB,BA9S,WHITE,T-3 1/4 LED BULB,BA9S,RED,T-3 1/4 LED BULB,BA9S,YELLOW,T-3 1/4 LED BULB,BA9S,WHITE,T-3 1/4 LED BULB,BA9S,WHITE,T-3 1/4 LED BULB,BA9S,GREEN,T-3 1/4 LED BULB,BA9S,YELLOW,T-3 1/4 LED BULB,BA9S,WHITE,T-3 1/4 LED BULB,BA9S,GREEN,T-3 1/4 LED BULB,BA9S,RED,T-3 1/4 LED BULB,BA9S,RED,T-3 1/4 LED BULB,BA9S,GREEN,T-3 1/4 LED BULB,BA9S,YELLOW,T-3 1/4 LED BULB,BA9S,BLUE,T-3 1/4 LED BULB,BA9S,RED,T-3 1/4 LED BULB,BA9S,GREEN,T-3 1/4 LED BULB,BA9S,YELLOW,T-3 1/4 PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,RED,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,RED,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,RED,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,RED,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,RED,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,RED,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,RED,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,RED,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,8MM,WHITE,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,WHITE,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,WHITE,28V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,8MM,WHITE,12V PANEL MOUNT INDICATOR,LED,8MM,RED,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,WHITE,24V PANEL MOUNT INDICATOR,LED,8MM,RED,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,WHITE,28V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,8MM,WHITE,12V PANEL MOUNT INDICATOR,LED,8MM,RED,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,WHITE,24V PANEL MOUNT INDICATOR,LED,8MM,RED,24V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,GREEN,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,WHITE,28V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,8MM,WHITE,12V PANEL MOUNT INDICATOR,LED,8MM,RED,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,8MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,BLUE,12V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,8MM,BLUE,24V PANEL MOUNT INDICATOR,LED,8MM,RED,28V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8MM,GREEN,28V PANEL MOUNT INDICATOR,LED,8MM,BLUE,28V PANEL MOUNT INDICATOR,LED,14MM,WHITE,12V PANEL MOUNT INDICATOR,LED,14MM,RED,12V PANEL MOUNT INDICATOR,LED,14MM,GREEN,12V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,14MM,BLUE,12V PANEL MOUNT INDICATOR,LED,14MM,WHITE,24V PANEL MOUNT INDICATOR,LED,14MM,RED,24V PANEL MOUNT INDICATOR,LED,14MM,GREEN,24V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,14MM,BLUE,24V PANEL MOUNT INDICATOR,LED,14MM,WHITE,12V PANEL MOUNT INDICATOR,LED,14MM,RED,12V PANEL MOUNT INDICATOR,LED,14MM,GREEN,12V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,14MM,BLUE,12V PANEL MOUNT INDICATOR,LED,14MM,RED,24V PANEL MOUNT INDICATOR,LED,14MM,GREEN,24V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,14MM,BLUE,24V PANEL MOUNT INDICATOR,LED,14MM,RED,12V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,14MM,BLUE,12V PANEL MOUNT INDICATOR,LED,14MM,RED,12V PANEL MOUNT INDICATOR,LED,14MM,GREEN,12V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,14MM,BLUE,12V PANEL MOUNT INDICATOR,LED,14MM,RED,24V PANEL MOUNT INDICATOR,LED,14MM,GREEN,24V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,14MM,BLUE,24V PANEL MOUNT INDICATOR,LED,14MM,RED,28V PANEL MOUNT INDICATOR,LED,14MM,GREEN,28V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,14MM,BLUE,28V PANEL MOUNT INDICATOR,LED,14MM,RED,12V PANEL MOUNT INDICATOR,LED,14MM,GREEN,12V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,12V PANEL MOUNT INDICATOR,LED,14MM,BLUE,12V PANEL MOUNT INDICATOR,LED,14MM,RED,24V PANEL MOUNT INDICATOR,LED,14MM,GREEN,24V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,24V PANEL MOUNT INDICATOR,LED,14MM,BLUE,24V PANEL MOUNT INDICATOR,LED,14MM,RED,28V PANEL MOUNT INDICATOR,LED,14MM,GREEN,28V PANEL MOUNT INDICATOR,LED,14MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,14MM,BLUE,28V NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,CLEAR NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,CLEAR NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,BLUE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,BLUE NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,CLEAR NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,WHITE NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,CLEAR NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,WHITE NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,BLUE NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,BLUE PANEL MOUNT INDICATOR,LED,7.87MM,RED,14V PANEL MOUNT INDICATOR,LED,7.87MM,RED,28V PANEL MOUNT INDICATOR,LED,7.87MM,GREEN,14V PANEL MOUNT INDICATOR,LED,7.87MM,GREEN,28V PANEL MOUNT INDICATOR,LED,7.87MM,GREEN,6V PANEL MOUNT INDICATOR,LED,7.87MM,YELLOW,14V PANEL MOUNT INDICATOR,LED,7.87MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,7.87MM,YELLOW,6V PANEL MOUNT INDICATOR,LED,7.87MM,RED,14V PANEL MOUNT INDICATOR,LED,7.87MM,RED,28V PANEL MOUNT INDICATOR,LED,7.87MM,RED,6V PANEL MOUNT INDICATOR,LED,7.87MM,GREEN,14V PANEL MOUNT INDICATOR,LED,7.87MM,GREEN,28V PANEL MOUNT INDICATOR,LED,7.87MM,GREEN,6V PANEL MOUNT INDICATOR,LED,7.87MM,YELLOW,14V PANEL MOUNT INDICATOR,LED,7.87MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,7.87MM,YELLOW,6V INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,RED NEON INDICATOR,115VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,RED NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,230VAC,1.5mA,RED INDICATOR,LED PANEL MNT,GREEN,24V NEON INDICATOR,230VAC,1.5mA,AMBER NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,115VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,GREEN NEON INDICATOR,230VAC,1.5mA,GREEN PANEL MOUNT INDICATOR,LED,9.65MM,RED,14V PANEL MOUNT INDICATOR,LED,9.65MM,RED,28V PANEL MOUNT INDICATOR,LED,9.65MM,GREEN,14V PANEL MOUNT INDICATOR,LED,9.65MM,GREEN,28V PANEL MOUNT INDICATOR,LED,9.65MM,YELLOW,14V PANEL MOUNT INDICATOR,LED,9.65MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,9.65MM,RED,14V PANEL MOUNT INDICATOR,LED,9.65MM,RED,28V PANEL MOUNT INDICATOR,LED,9.65MM,GREEN,14V PANEL MOUNT INDICATOR,LED,9.65MM,GREEN,28V PANEL MOUNT INDICATOR,LED,9.65MM,YELLOW,14V PANEL MOUNT INDICATOR,LED,9.65MM,YELLOW,28V SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,SPST-NC,10A,240VAC SWITCH,PUSHBUTTON,SPST-NC,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,PUSHBUTTON,SPST-NO,10A,240VAC SWITCHES,PUSHBUTTON,SPST-NO,10A,240V SWITCHES,PUSHBUTTON,SPST-NO,10A,240V SOCKET,A22R SERIES PUSHBUTTON SWITCHES SOCKET,A22R SERIES PUSHBUTTON SWITCHES SOCKET,A22R SERIES PUSHBUTTON SWITCHES SOCKET,A22R SERIES PUSHBUTTON SWITCHES LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS SOCKET,A22R SERIES PUSHBUTTON SWITCHES LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS LAMP,A22R PUSHBUTTON & M22R INDICATORS SWITCH,KEY OPERATED,SPST-NO,10A,240V SWITCH,KEY OPERATED,SPST-NO,10A,240V SWITCH,KEY OPERATED,SPST-NO,10A,240V SWITCH,ILLUM PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,ILLUM PUSHBUTTON,10A,240VAC SWITCH,ILLUM PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,ILLUM PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,ILLUM PUSHBUTTON,10A,240VAC SWITCH,ILLUM PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,ILLUM PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,ILLUM PUSHBUTTON,10A,240VAC SWITCH,ILLUM PUSHBUTTON,10A,240VAC SWITCH,ILLUM PUSHBUTTON,SPST-NO,10A,240VAC SWITCH,ILLUM PUSHBUTTON,SPST-NO,10A,240VAC SWITCH UNIT,A22R SERIES PUSHBUTTON SWITCHES SWITCH UNIT,A22R SERIES PUSHBUTTON SWITCHES SWITCH UNIT,A22R SERIES PUSHBUTTON SWITCHES SWITCH,SELECTOR,2POS,10A,240VAC SWITCH,SELECTOR,2POS,10A,240VAC SWITCH,ILLUM SELECTOR,2POS,10A,240VAC SWITCH,ILLUM SELECTOR,2POS,10A,240VAC SWITCH,ILLUM SELECTOR,2POS,10A,240VAC SWITCH,ILLUM SELECTOR,2POS,10A,240VAC SWITCH,ILLUM SELECTOR,2POS,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,PUSHBUTTON,10A,240VAC SWITCH,REED,SPST-NO,500mA,200VDC,SMD MODULAR CONNECTOR,RJ45,8POS,8CONT,1PORT,CAT5E IC SOCKET,DIP,2.54MM,8POS LED,ORANGE,1400MCD,605NM CONNECTOR,STD D-SUB,PLUG,25 POS CONVERT N/A 11BIT 2.5GSPS RF 160BGA DEMOD QUADRATURE 40LFCSP CIRCUIT NUMERIQUE ISO 4CH 1MBPS 20SSOP CARTE D´EVAL DAC 14BIT 2.5GSPS AD9739A CARTE D´EVAL DAC 14BIT 2.5GSPS AD9739A CARTE D´EVAL LOG DEMO 1M-4GHZ ADL5513 CARTE DEMOD QUAD 700-1050MHZ ADRF6807 POWER ENTRY MODULE INLET,PLUG,IEC C14,2A,PANEL INLET,PLUG,IEC C14,6A,PANEL TRANSFORMER,PULSE,1:1,25mH TRANSFORMER,PULSE,1:1,2.5mH COMMON MODE CHOKE,4.4mH,600mA,RADIAL CONNECTOR,FPC,RCPT,6POS,1ROW TRANSFORMER,PULSE,1:1:1,2.5mH INLET,PLUG,IEC C14,6A,PANEL CONNECTOR,FPC,ZIF,RCPT,15POS,1ROW CONNECTOR,FPC,RCPT,5POS,1ROW CONNECTOR,FPC,RCPT,8POS,1ROW PLUG JACKET COVER,FFC-BOARD CONNECTOR PLUG JACKET COVER,FFC-BOARD CONNECTOR CONNECTOR,FFC,RCPT,30POS,1ROW CONNECTOR,FFC,RCPT,30POS,1ROW CONNECTOR,FFC,RCPT,50POS,1ROW CONNECTOR,FFC,RCPT,50POS,1ROW CONNECTOR,FFC,RCPT,80POS,1ROW CONNECTOR,FFC,RCPT,30POS,1ROW CONNECTOR,FFC,RCPT,30POS,1ROW CONNECTOR,FFC,RCPT,50POS,1ROW CONNECTOR,FFC,RCPT,50POS,1ROW CONNECTOR,FFC,RCPT,80POS,1ROW CONNECTOR,FPC,RCPT,22POS,2ROW CONNECTOR,FPC,RCPT,24POS,2ROW CONNECTOR,FPC,RCPT,30POS,2ROW CONNECTOR,FPC,RCPT,32POS,2ROW CONNECTOR,FPC,RCPT,40POS,2ROW CONNECTOR,FPC,RCPT,60POS,2ROW CONNECTOR,FPC,RCPT,70POS,2ROW CONNECTOR,FPC,RCPT,17POS,2ROW CONNECTOR,FPC,ZIF,RCPT,27POS,2ROW CONNECTOR,FPC,ZIF,RCPT,28POS,2ROW CONNECTOR,FPC,ZIF,RCPT,15POS,1ROW CONNECTOR,FPC,ZIF,RCPT,18POS,1ROW CONNECTOR,FPC,ZIF,RCPT,13POS,1ROW CONNECTOR,FPC,ZIF,RCPT,34POS,1ROW CONNECTOR,FPC,ZIF,RCPT,46POS,1ROW CONNECTOR,FPC,RCPT,34POS,1ROW CONNECTOR,FPC,RCPT,38POS,1ROW CONNECTOR,FPC,RCPT,43POS,1ROW CONNECTOR,FPC,ZIF,RCPT,4POS,1ROW CONNECTOR,FPC,ZIF,RCPT,11POS,1ROW CONNECTOR,FPC,ZIF,RCPT,14POS,1ROW CONNECTOR,FPC,ZIF,RCPT,15POS,1ROW CONNECTOR,FPC,ZIF,RCPT,16POS,1ROW CONNECTOR,FPC,ZIF,RCPT,17POS,1ROW CONNECTOR,FPC,ZIF,RCPT,5POS,1ROW CONNECTOR,FPC,ZIF,RCPT,7POS,1ROW CONNECTOR,FPC,ZIF,RCPT,10POS,1ROW CONNECTOR,FPC,ZIF,RCPT,11POS,1ROW CONNECTOR,FPC,ZIF,RCPT,13POS,1ROW CONNECTOR,FPC,ZIF,RCPT,19POS,1ROW CONNECTOR,FPC,ZIF,RCPT,26POS,1ROW CONNECTOR,RECEPTACLE,16POS,0.8MM CONNECTOR,FPC,RCPT,47POS,2ROW CONNECTOR,FPC,ZIF,RCPT,50POS,1ROW CONNECTOR,FPC,ZIF,RCPT,60POS,1ROW CONNECTOR,FPC,RCPT,43POS,1ROW CONNECTOR,FPC,RCPT,6POS,1ROW INLET,PLUG,IEC C14,10A,PANEL POWER ENTRY MODULE IC,AUDIO AMP,CLASS D,20W,HTQFP-48 CONNECTOR,FPC,RCPT,30POS,1ROW CONNECTOR,FPC,RCPT,40POS,1ROW CONNECTOR,FPC,RCPT,6POS,1ROW CONNECTOR,FPC,RCPT,10POS,1ROW CONNECTOR,FPC,RCPT,14POS,1ROW POWER ENTRY MODULE POWER ENTRY MODULE CONNECTOR,FPC,RCPT,39POS,2ROW SWITCH,REED,SPST-NO,500mA,200VDC,SMD SWITCH,REED,SPST-NO,500mA,170VDC,SMD COMMON MODE CHOKE,2mH,3A,RADIAL CONNECTOR,FPC,RCPT,8POS,1ROW PLUG JACKET COVER,FFC-BOARD CONNECTOR PLUG JACKET COVER,FFC-BOARD CONNECTOR PLUG JACKET COVER,FFC-BOARD CONNECTOR PLUG JACKET COVER,FFC-BOARD CONNECTOR CONNECTOR,FPC,RCPT,20POS,2ROW CONNECTOR,FPC,RCPT,29POS,2ROW CONNECTOR,FPC,RCPT,45POS,2ROW CONNECTOR,FPC,RCPT,51POS,2ROW CONNECTOR,FPC,RCPT,60POS,1ROW CONNECTOR,FPC,RCPT,80POS,1ROW CONNECTOR,FPC,RCPT,75POS,2ROW CONNECTOR,FPC,RCPT,26POS,1ROW CONNECTOR,FPC,RCPT,13POS,2ROW CONNECTOR,FPC,RCPT,15POS,2ROW CONNECTOR,FPC,RCPT,17POS,2ROW CONNECTOR,FPC,RCPT,19POS,2ROW CONNECTOR,FPC,RCPT,21POS,2ROW CONNECTOR,FPC,RCPT,23POS,2ROW CONNECTOR,FPC,RCPT,25POS,2ROW CONNECTOR,FPC,RCPT,27POS,2ROW CONNECTOR,FPC,RCPT,31POS,2ROW CONNECTOR,FPC,RCPT,33POS,2ROW CONNECTOR,FPC,RCPT,35POS,2ROW CONNECTOR,FPC,RCPT,37POS,2ROW CONNECTOR,FPC,RCPT,39POS,2ROW CONNECTOR,FPC,RCPT,41POS,2ROW CONNECTOR,FPC,RCPT,43POS,2ROW CONNECTOR,FPC,RCPT,45POS,2ROW CONNECTOR,FPC,RCPT,51POS,2ROW CONNECTOR,FPC,ZIF,RCPT,19POS,1ROW CONNECTOR,FPC,RCPT,51POS,2ROW COMMON MODE CHOKE,3.9mH,6A,RADIAL COMMON MODE CHOKE,2.7mH,8A,RADIAL COMMON MODE CHOKE,1.8mH,10A,RADIAL CONNECTOR,FPC,RCPT,17POS,1ROW CONNECTOR,FPC,RCPT,18POS,1ROW CONNECTOR,FPC,RCPT,32POS,1ROW LIZENZCODE EASYPS2000B LIZENZCODE EASYPS2000B LIZENZCODE EASYPS2000B LIZENZCODE EASYPS2000B PROXIMITY SENSOR SOCKET PLCC 20 BROCHES TRAVERSANT SOCKET PLCC 28 BROCHES TRAVERSANT SOCKET PLCC 32 BROCHES TRAVERSANT SOCKET PLCC 44 BROCHES TRAVERSANT SOCKET PLCC 52 BROCHES TRAVERSANT SOCKET PLCC 84 BROCHES TRAVERSANT SOCKET PLCC 20 BROCHESS CMS SOCKET PLCC 28 BROCHES CMS SOCKET PLCC 32 BROCHES CMS SOCKET PLCC 44 BROCHES CMS SOCKET PLCC 52 BROCHES CMS SOCKET PLCC 68 BROCHES CMS SOCKET PLCC 84 BROCHES CMS CABLE ASSEMBLY,28AWG,SOCKET,20WAY CABLE ASSEMBLY,28AWG,SOCKET,20WAY CABLE ASSEMBLY,28AWG,SOCKET,20WAY CABLE ASSEMBLY,28AWG,SOCKET,20WAY CABLE ASSEMBLY,28AWG,SOCKET,20WAY CABLE ASSEMBLY,28AWG,SOCKET,20WAY CABLE ASSEMBLY,28AWG,SOCKET,20WAY CABLE ASSEMBLY,28AWG,SOCKET,30WAY CABLE ASSEMBLY,28AWG,SOCKET,30WAY CABLE ASSEMBLY,28AWG,SOCKET,30WAY CABLE ASSEMBLY,28AWG,SOCKET,30WAY CABLE ASSEMBLY,28AWG,SOCKET,30WAY CABLE ASSEMBLY,28AWG,SOCKET,30WAY CABLE ASSEMBLY,28AWG,SOCKET,40WAY CABLE ASSEMBLY,28AWG,SOCKET,40WAY CABLE ASSEMBLY,28AWG,SOCKET,40WAY CABLE ASSEMBLY,28AWG,SOCKET,40WAY CABLE ASSEMBLY,28AWG,SOCKET,40WAY CABLE ASSLY,IP68 RJ - RJ45,3M CABLE ASSLY,IP68 USB A - USB B,2M CABLE ASSLY,IP68 USB A - USB B,5M HEADER,2MM,SMD,10WAY HEADER,2MM,THRU HOLE,40WAY HEADER,2MM,SMD,40WAY HEADER,2MM,R/A,50WAY HEADER,2MM,SMD,50WAY CONNECTOR,CARD EGDE,0.8MM,120WAY POWEREDGE,7WAY,LOCKING,SMT POWEREDGE,10WAY,LOCKING,SMT MINI CARD,40WAY MINI CARD,50WAY MINI CARD,40WAY MINI CARD,50WAY HEADER,1.27MM,R/A,50WAY HEADER,IDC,2.54MM,34WAY HEADER,IDC,2.54MM,50WAY HEADER,1.27MM,R/A THRU HOLE,40WAY HEADER,1.27MM,SMD,40WAY HEADER,1.27MM,R/A THRU HOLE,50WAY HEADER,1.27MM,R/A THRU HOLE,80WAY HEADER,1.27MM,SMD,80WAY HEADER,1.27MM,R/A THRU HOLE,90WAY HEADER,1.27MM,R/A THRU HOLE,100WAY GREEN LED 2.2 VOLT CONTACT,PIN RECEPTACLE,SINGLE,SOLDER RESEAU DE BLANC CHAUD SM4 2700K 400LM RESEAU DE BLANC CHAUD SM4 2700K 400LM RESEAU DE BLANC CHAUD SM4 2700K 400LM RESEAU DE BLANC CHAUD SM4 2700K 400LM RESEAU DE BLANC CHAUD SM4 3000K 400LM RESEAU DE BLANC CHAUD SM4 3000K 400LM RESEAU DE BLANC CHAUD SM4 3000K 400LM RESEAU DE BLANC CHAUD SM4 3000K 400LM RESEAU DE BLANC FROID SM4 5600K 520LM RESEAU DE BLANC FROID SM4 5600K 520LM LED XLAMPE BLANC MLC 26.8LM LED XLAMPE BLANC MLC 26.8LM LED XLAMPE BLANC MLC 26.8LM LED XLAMPE BLANC MLC 23.5LM LED XLAMPE BLANC MLC 26.8LM LED XLAMPE BLANC MLC 26.8LM LED XLAMPE BLANC MLC 26.8LM LED XLAMPE BLANC MLC 23.5LM LED XLAMPE BLANC MLE 39.8LM LED XLAMPE BLANC MLE 45.7LM LED XLAMPE ROUGE MLE 13.9LM LED XLAMPE ROUGE MLE 13.9LM LED XLAMPE VERT MLE 26.8LM LED XLAMPE VERT MLE 30.6LM LED XLAMPE BLEU MLE 10.7LM EXTERNAL UPS BATTERY FOR 5PX 1000,1500,2200 EXTENDED BATTERY MODULE,5PX RACK/TOWER TPS40422,SYNCHRONOUS BUCK CONTROLLER,EVAL MODULE FREQUENCY SYNTHESIZER,PLL,4.8GHZ,QFN-32 CONNECTOR,PLUG,2POS,1.25MM,CABLE CONNECTOR,RECEPTACLE,2POS,200A,BUSBAR CONNECTOR,PLUG,2POS,1.25MM,CABLE CONNECTOR,RECEPTACLE,3POS,1.25MM,PANEL CONNECTOR,PLUG,2POS,1.25MM,CABLE CONNECTOR,RECEPTACLE,2POS,1.25MM,PANEL LED LIGHT BAR,DAYLIGHT,2.5W,24VDC,124MM LED LIGHT BAR,NEUTRAL WHITE,2.5W,24VDC,124MM LED LIGHT BAR,AMBER,2.5W,24VDC,124MM LED LIGHT BAR,DAYLIGHT,5W,24VDC,224MM LED LIGHT BAR,NEUTRAL WHITE,5W,24VDC,224MM LED LIGHT BAR,DAYLIGHT,5.7W,24VDC,324MM LED LIGHT BAR,NEUTRAL WHITE,5.7W,24VDC,324MM LED LIGHT BAR,AMBER,5.7W,24VDC,324MM LED LIGHT BAR,WHITE,2.5W,24VDC,130MM LED LIGHT BAR,WHITE,5W,24VDC,230MM LED LIGHT BAR,WHITE,24VDC,350MM MOUNTING BRACKET,VE100 VISUAL DISPLAY BOARDS LED DISPLAY BOARD,100MM LED DISPLAY BOARD,25MM IC,DUAL REPEATER,10.3GBPS,3.3V,LLP-24 IC,POWER MEASUREMENT SYSTEM,PMBus,17V IC,MOSFET DRVR,LOW SIDE,7.6A,6-SOT-23 RF TRANSCEIVER,2.4GHZ to 2.4835GHZ,QFN-24 RELAY,SAFETY,RT6,24AC,3NO/1NC RELAY,SAFETY,RT6,115AC,3NO/1NC RELAY,SAFETY,RT6,230AC,3NO/1NC RELAY,SAFETY,RT7,24DC,4NO/1NC/3S RELAY,SAFETY,115AC,4NO/1NC/3S RELAY,SAFETY,230AC,4NO/1NC/3S RELAY,SAFETY,24DC,4NO/1NC/1.5S RELAY,SAFETY,115AC,4NO/1NC/1.5S RELAY,SAFETY,230AC,4NO/1NC/1.5S RELAY,SAFETY,RT9,24DC,2NO RELAY,EXPANSION,E1T,0S,24DC RELAY,SAFETY,2-HAND,JSBR4,24DC PLC,PLUTO,S20,8+8+2+2,NO BUS PLC,PLUTO,B20,8+8+2+2,W. BUS PLC,PLUTO,B46,24+16+4+2,BUS IDENTIFIER,PRE-PROGRAMMED,IDFIX-R USB-CABLE,FOR PROGRAMMING,PLUTO RELAY,FAILSAFE,OUTPUT,BT50 SWITCH,SAFETY,JSNY5A,2NC+1NO,10N SWITCH,SAFETY,JSNY5B,2NC+1NO,30N SWITCH,MAGNETIC,JSNY7R-3,3M CABLE KEY,MAGNETIC,FOR JSNY7M SWITCH,SAFETY,JSNY9S,24VAC/DC SWITCH,SAFETY,JSNY9M,24V AC/DC ENABLING DEVICE,3-POSITION,JSHD4 CABLE,5M,FOR JSHD4 CABLE,10M,FOR JSHD4 CONNECTOR,12-POLE,FOR JSHD4 CONTROL STATION,TWO HAND,5-POLE E-STOP,10EA,WITH LED INDICATOR E-STOP,FOR ENCLOSURES,INCA 1, DISSIPATEUR TO-247 NO FINISH DISSIPATEUR TO-220 NOIR DISSIPATEUR TO-247/220 NOIR DISSIPATEUR LED 76.2MM NO FINISH DISSIPATEUR LED 50.8MM NO FINISH DISSIPATEUR LED 25.4MM NO FINISH DISSIPATEUR LED 12.7MM NO FINISH DISSIPATEUR LED 76.2MM NOIR DISSIPATEUR LED 50.8MM NOIR DISSIPATEUR LED 25.4MM NOIR DISSIPATEUR LED 12.7MM NOIR DISSIPATEUR TO-220/218/247 NOIR DISSIPATEUR TO-220/218/247 NOIR DISSIPATEUR 55MM 2 CLIPS NO FINISH DISSIPATEUR 55MM 2 CLIPS NOIR DISSIPATEUR 55M 2 CLIPS NOIR DISSIPATEUR TO-220 NOIR DISSIPATEUR TO-220 NOIR DISSIPATEUR TO-220 63.5MM NO FINISH DISSIPATEUR TO-220 50.8MM NO FINISH DISSIPATEUR TO-220 38.1MM NO FINISH DISSIPATEUR TO-220 63.5MM NOIR DISSIPATEUR TO-220 50.8MM NOIR DISSIPATEUR TO-220 38.1MM NOIR DISSIPATEUR CMS D3 PACK NO FINISH DISSIPATEUR CMS D3 PACK NOIR DISSIPATEUR TO-264 3 CLIPS NO FINISH DISSIPATEUR TO-264 3 CLIPS NOIR DISSIPATEUR TO-264 2 CLIPS NO FINISH DISSIPATEUR TO-264 2 CLIPS NOIR DISSIPATEUR TO-264 1 CLIP NO FINISH DISSIPATEUR TO-264 1 CLIP NOIR DISSIPATEUR TO-247 3 CLIPS NO FINISH DISSIPATEUR TO-247 3 CLIPS NOIR DISSIPATEUR TO-247 2 CLIPS NO FINISH DISSIPATEUR TO-247 1 CLIP NO FINISH DISSIPATEUR TO-247 1 CLIP NOIR DISSIPATEUR TO-220 3 CLIPS NO FINISH DISSIPATEUR TO-220 2 CLIPS NO FINISH DISSIPATEUR TO-220 1 CLIP NO FINISH EXTENSION BOBINE DE 4VOIES 50M FERRITE CORE,CYLINDRICAL,133OHM/100MHZ,300MHZ KIT D´EVAL AT91SAM9G15 ARM926 KIT D´EVAL AT91SAM9G25 ARM926 KIT D´EVAL AT91SAM9G35 ARM926 KIT D´EVAL AT91SAM9X25 ARM926 KIT D´EVAL AT91SAM9X35 ARM926 KIT D´EVAL ATXMEGA256A3BU KIT D´EVAL ATXMEGAB1 MICROCONT 32 BITS 128KB FLASH 48TLLGA MICROCONT 32 BITS 256KB FLASH 48TLLGA MICROCONT 32 BITS 128KB FLASH 48VQFN MICROCONT 32 BITS 128KB FLASH 48TLLGA MICROCONTROLEUR AVR32 16K FLASH 48TTLGA MICROCONTROLEUR AVR32 64K FLASH 48TTLGA MICROCONT 32 BITS 64KB FLASH 64TQFP MICROCONTROLEUR 32 BITS 64KB FLASH 48QFN MICROCONTROLEUR 32BT 64KB FLASH 48TLLGA MICROCONTROLEUR 8BITS 128KB FLASH 64TQFP MICROCONTROLEUR 8BITS 128KB FLASH 64VQFN MICROCONTROLEUR 8BITS 64KB FLASH 100VQFN MCU AVR 256KB FLASH 64QFN MICROCONT 32 BITS 128KB FLASH 28SOIC MICROCONT 32 BITS 128KB FLASH 28SDIP MICROCONT 32 BITS 128KB FLASH 28SSOP MICROCONT 32 BITS 128KB FLASH 44TQFP MICROCONT 32 BITS 64KB FLASH 28SPDIP MICROCONT 32 BITS 64KB FLASH 44TQFP MICROCONT 32 BITS 128KB FLASH 28SDIP MICROCONT 32 BITS 128KB FLASH 44TQFP MICROCONTROLEUR 8 BITS 3.5KB FLASH 28QFN MICROCONTROLEUR 8BITS 3.5KB FLASH 28UQFN MICROCONTROLEUR 8BITS 3.5KB FLASH 28SOIC MICROCONTROLEUR 8BIT 3.5KB FLASH 28SPDIP MICROCONTROLEUR 8BITS 3.5KB FLASH 28SSOP MICROCONTROLEUR 8 BITS 7KB FLASH 28QFN MICROCONTROLEUR 8 BITS 7KB FLASH 28UQFN MICROCONTROLEUR 8 BITS 7KB FLASH 28SOIC MICROCONTROLEUR 8 BITS 7KB FLASH 28SPDIP MICROCONTROLEUR 8 BITS 7KB FLASH 28SSOP PANNE LT COUTEAU 6.3MM PANNE LT COUTEAU 6.3MM PANNE LT RONDE TRONQUEE 1.6MM PANNE LT RONDE TRONQUEE 1.6MM CARTE EVAL WIFI W/ MEP CARTE EVAL WIFI W/ MEE CARTE DEMO WIFI COMMS REWORK STATION,255W,EU/UK DESOLDERING STATION,WXDP 120,WXP 120 CONTROL UNIT,WXD 2,230V,UK + EU DESOLDERING IRON,120W,W/STAND TIP,DESOLDERING,2.5MM TIP,DESOLDERING,5.3MM TIP,DESOLDERING,2.3MM TIP,DESOLDERING,2.5MM TIP,DESOLDERING,3.3MM TIP,DESOLDERING,1.9MM TIP,DESOLDERING,2.9MM TIP,MEASURING SOLDERING IRON,120W SOLDERING IRON,65W,W/STAND KIT EXTRACTION DE FUMEE 0 BROUILLARD 4V ALIMENTATION MEDICAL 65W SIMPLE SORTIE ALIMENTATION MEDICAL 65W SIMPLE SORTIE ALIMENTATION MEDICAL 65W SIMPLE SORTIE ALIMENTATION MEDICAL 65W SIMPLE SORTIE PSOC3 8BIT 8051 32K FLASH 100TQFP PSOC3 8BIT 8051 32K FLASH 68QFN PSOC3 8BIT 8051 32K FLASH 48QFN PSOC3 8BIT 8051 32K FLASH 48SSOP PSOC3 8BIT 8051 32K FLASH 48SSOP PSOC3 8BIT 8051 64K FLASH 100TQFP PSOC3 8BIT 8051 64K FLASH 100TQFP PSOC3 8BIT 8051 64K FLASH 68QFN PSOC3 8BIT 8051 64K FLASH 48QFN PSOC3 8BIT 8051 64K FLASH 48QFN DIODE TVS 28V 600W SMB DIODE TVS 85V 1500W SMC DIODE TVS 24V 1500W SMC D SUB CONNECTOR,STANDARD,9POS,RCPT DIODE TVS 30V 1500W SMC CAN 16 BITS 1MSPS +/-0.75LSB 16MSOP CAN 16 BITS 1MSPS +/-0.75LSB 16MSOP CAN 16 BITS 250KSPS +/-0.75LSB 16DFN CAN 16 BITS 250KSPS +/-0.75LSB 16DFN CAN 16 BITS 250KSPS +/-0.75LSB 16MSOP CAN 16 BITS 250KSPS +/-0.75LSB 16MSOP CAN 16 BITS 500KSPS +/-0.75LSB 16MSOP CAN 16 BITS 500KSPS +/-0.75LSB 16MSOP MESURE DE COURANT AMP + REF + COMP 8MSOP MESURE DE COURANT AMP + REF + COMP 8MSOP DAC 18BIT +/-1LSB 3V TO 5V 28SSOP DAC 18BIT +/-1LSB 3V TO 5V 28SSOP DAC 18BIT +/-1LSB 3V TO 5V 28SSOP DAC 18BIT +/-2LSB 3V TO 5V 28SSOP DAC 18BIT +/-2LSB 3V TO 5V 28SSOP DAC 18BIT +/-2LSB 3V TO 5V 28SSOP DRIVER LED 16 CH 0.075A 36V 40QFN BOOST PWM DOUBLE 42V 3A 24DFN BUCK 24V 15A 0.6V TO 5.5VOUT 56QFN BUCK 2PHASE 38V 0.6V TO 5.5V 32QFN BUCK 36VIN 2A 200KHZ-2.4MHZ 10MSOP BUCK 36VIN 5A CV/CC AJUSTABLE 81LGA BUCK 42VIN 0.75A 200KHZ-2MHZ 10MSOP BUCK MODE COURANT 38V AJUSTABLE 24TSSOP BUCK MODE COURANT 38V AJUSTABLE 24TSSOP BUCK DOUBLE 15V 3A 0.6V TO 3V 28TSSOP BUCK DOUBLE 38V 0.6VTO 5.5VOUT 38TSSOP BUCK DOUBLE DDR 38V 1V-2.5V 38TSSOP BUCK DOUBLE MULTIP 24V AJUSTABLE 36QFN BUCK SYNCH 15V 0.3A AJUSTABLE 16MSOP BUCK SYNCH 15V 1.5A AJUSTABLE 12DFN HOT SWAP CNTRL 12V 5A 16DFN HOT SWAP CNTRL -48V 16SSOP HOT SWAP CNTRL -48V 16SSOP HOT SWAP CNTRL 5V 5A 16DFN HOT SWAP -36V TO -72V 2.5A 6SOT23 HOT SWAP -43V TO -75V 2.5A 6SOT23 HOT SWAP -43V UV 2.5A 6SOT23 HOT SWAP -48V FAULT LATCH 10MSOP HOT SWAP -48V FAULT LATCH 10MSOP HOT SWAP -48V FAULT LATCH 8MSOP HOT SWAP -48V FAULT RETRY 10MSOP HOT SWAP -48V FAULT RETRY 8MSOP LIMITEUR DE PUISSANCE 500V 8DFN LIMITEUR DE PUISSANCE 500V 8DFN LIMITEUR DE PUISSANCE 500V 8TSOT23 LIMITEUR DE PUISSANCE LATCH 500V 8DFN LIMITEUR DE PUISSANCE LATCH 500V 8DFN LIMITEUR DE PUISSANCE LATCH 500V 8DFN LIMITEUR DE PUISSANCE LATCH 500V 8TSOT23 LIMITEUR DE PUISSANCE LATCH 500V 8TSOT23 LIMITEUR DE PUISSANCE LATCH 500V 8TSOT23 LIMITEUR DE PUISSANCE RESET MANUEL 12DFN LIMITEUR DE PUISSANCE RESET MANUEL 12DFN LIMITEUR DE PUISSANCE RESET MANUEL 12DFN LIMITEUR DE PUISSANCE RESET MANUEL 12DFN LIMITEUR DE PUISSANCE RESET MANUEL 12DFN LIMITEUR DE PUISSANCE RESET MANUEL 12DFN LIMITEUR DE PUISSANCE RESET TEMP 12DFN LIMITEUR DE PUISSANCE RESET TEMP 12DFN LIMITEUR DE PUISSANCE RESET TEMP 12DFN CONTROLEUR BOUTON POUSSOIR ON/OFF 10DFN CONTROLEUR BOUTON POUSSOIR ON/OFF 10DFN CONTROLEUR BOUTON POUSS ON/OFF 8TSOT23 ALIMENTATION MANAGER QUADRUPLE 64QFN QUADRATURE DEMOD 700MHZ - 3GHZ 24QFN DOWNCONVERTING MIXER,0.6-1.7GHZ,24QFN DOWNCONVERTING MIXER,1.3-2.3GHZ,24QFN DOWNCONVERTING MIXER,1.6-2.7GHZ,24QFN DOWNCONVERTING MIXER,2.3-4.5GHZ,24QFN PMU 3BUCK BUCK/BOOST 3LDO I2C 40QFN DRIVER LED BUCK/BOOST 100W 38TSSOP DRIVER LED BUCK/BOOST 100W 38TSSOP BUCK DOUBLE 4.1V TO 60VIN 1A 16MSOP BUCK DOUBLE 4.1V TO 60VIN 1A 16MSOP BUCK/BOOST 2.7V TO 40V 2A 16DFN CHARGEUR LI-ION I2C 3.5A 15W 28QFN CHARGEUR LI-ION I2C 3.5A 15W 28QFN AMPLI E/S RAIL/RAIL 180MHZ 5.25V 8MSOP CAN 18 BITS 2.5MSPS +/-3LSB 48LQFP CAN 18 BITS 2.5MSPS +/-3LSB 48QFN CONTROLEUR 0.015/0.2 S RESET 36V 8DFN CONTROLEUR 0.015/0.2 S RESET 36V 8DFN CONTROLEUR 0.2 S RESET 36V 8DFN CONTROLEUR INV 0.2 S RESET 36V 8DFN CONTROLEUR 0.015/0.2 S RESET 36V 8TSOT CONTROLEUR 0.015/0.2 S RESET 36V 8TSOT CONTROLEUR 0.2 S RESET 36V 8TSOT MIXER DOWNCONVERTING 4-6GHZ 16QFN BUCK 36VIN 0.6A 1.2V TO 18V 35BGA BOOST FLYBACK SEPIC 40V 5A 36QFN SRAM 8MBIT PARALLEL 45NS 48TSOP SRAM 256KBIT PARALLEL 70NS 8SOIC SRAM 1MBIT PARALLEL 10NS 32TSOP D SUB HOOD,SIZE DA,THERMOPLASTIC D SUB HOOD,SIZE DB,THERMOPLASTIC SRAM 1MBIT PARALLEL 10NS 44TSOP SRAM 16MBIT PARALLEL 45NS 48TSOP SRAM 256KBIT PARALLEL 10NS 32SOJ MOSFET CANAL N 55V 44A DPAK MOSFET CANAL P 55V 31A DPAK MOSFET NCANAL P 55V 3.4A 8SOIC EEPROM 64KBIT SPI 8SOIC EEPROM 1MBIT SPI 8SOIJ EEPROM 4KBIT MICROFIL 8DIP D SUB HOOD,SIZE DC,THERMOPLASTIC IC,BYPASS SWITCH,40V,3-D2-PAK DIODE ESD-PROT 6CH 10UQFN TRANSLATEUR DE TENSION NIVEAU 2BIT SM8 WALL PLATE,1 GANG,1 TOGGLE,SST WALL PLATE,2 GANG,2 TOGGLE,SST WALL PLATE,2 GANG,2 DECORATOR,SST WALL PLATE,2 GANG,SST WALL PLATE,1 GANG,1 DUPLEX,SST WALL PLATE,2 GANG,2 DUPLEX,SST WALL PLATE,1 GANG,GREY WALL PLATE,1 GANG,IVORY WALL PLATE,1 GANG,WHITE WALL PLATE,2 GANG,GREY WALL PLATE,2 GANG,IVORY WALL PLATE,2 GANG,RED WALL PLATE,2 GANG,WHITE WALL PLATE,1 GANG,1 DUPLEX,WHITE DIODE DE REDRESSEMENT 60V 1A SMA DIODE DE REDRESSEMENT 40V 2.1A SMA DIODE DE REDRESSEMENT 200V 1A SMA DIODE DE REDRESSEMENT 100V 1A MICROSMP DIODE DE REDRESSEMENT 1KV 1A SMA DIODE DE REDRESSEMENT 1.3KV 3A DO-201AD PONT REDRESSEUR 200V 1A DFS KIT,TEST PROBE,FUSED KIT,TEST PROBE,FUSED,TEST LEADS ALLIGATOR CLIPS LEADS,TEST WRAPS,TEST LEAD PROBES,TEST,VOLTAGE/CURRENT,2MM SCREWDRIVER SET,ELECTRONIC,5 PIECES SCREWDRIVER,PHILLIPS,76MM SCREWDRIVER,SLOT,51MM SCREWDRIVER,SLOT,76MM SCREWDRIVER,SLOT,102MM SCREWDRIVER,SLOT,152MM WALL PLATE,1 GANG,SST POTENTIOMETRE 470R SUBMERSIBLE 20% POTENTIOMETRE 1K SUBMERSIBLE 20% POTENTIOMETRE 4K7 SUBMERSIBLE 20% POTENTIOMETRE 47K SUBMERSIBLE 20% POTENTIOMETRE 470R SUBMERSIBLE 20% POTENTIOMETRE 1K SUBMERSIBLE 20% POTENTIOMETRE 4K7 SUBMERSIBLE 20% POTENTIOMETRE 10K SUBMERSIBLE 20% POTENTIOMETRE 47K SUBMERSIBLE 20% POTENTIOMETRE 470R SUBMERSIBLE 20% POTENTIOMETRE 1K SUBMERSIBLE 20% POTENTIOMETRE 4K7 SUBMERSIBLE 20% POTENTIOMETRE 10K SUBMERSIBLE 20% POTENTIOMETRE 47K SUBMERSIBLE 20% RESISTANCE 1U 5% THICK FILM PUISSANCE RESISTANCE 4U7 5% THICK FILM PUISSANCE RESISTANCE 47U 5% THICK FILM PUISSANCE RESISTANCE 100U 5% THICK FILM PUISSANCE RESISTANCE 470U 5% THICK FILM PUISSANCE RFI Line Filter Current Rating:15A MOSFET CANAL N 525V 10A D2PAK MOSFET CANAL N 40V 80A D2PAK MOSFET CANAL N 600V 11A D2PAK MOSFET CANAL N 500V 12A D2PAK MOSFET CANAL N 30V 80A D2PAK MOSFET CANAL N 30V 80A D2PAK MOSFET CANAL N 600V 14A D2PAK MOSFET CANAL N 55V 120A D2PAK MOSFET CANAL N 550V 13A D2PAK MOSFET CANAL N 600V 13A D2PAK MOSFET CANAL N 800V 17A D2PAK MOSFET CANAL N 650V 17A D2PAK MOSFET CANAL N 600V 17A D2PAK MOSFET CANAL N 600V 21A D2PAK MOSFET CANAL N 600V 20A D2PAK MOSFET CANAL N 650V 24A D2PAK MOSFET CANAL N 600V 29A D2PAK MOSFET CANAL N 600V 29A D2PAK MOSFET CANAL N 650V 27A D2PAK MOSFET CANAL N 620V 2.7A D2PAK MOSFET CANAL N 100V 40A D2PAK MOSFET CANAL N 500V 4.4A D2PAK MOSFET CANAL N 625V 5.5A D2PAK MOSFET CANAL N 650V 7A D2PAK MOSFET CANAL N 30V 80A D2PAK MOSFET CANAL N 500V 7.2A D2PAK MOSFET CANAL N 700V 7.5A I2PAK MOSFET CANAL N 500V 7A DPAK MOSFET CANAL N 600V 8A DPAK MOSFET CANAL N 600V 8A DPAK MOSFET CANAL N 650V 9A DPAK MOSFET CANAL N 500V 9A DPAK MOSFET CANAL N 650V 8.5A DPAK MOSFET CANAL N 60V 12A DPAK MOSFET CANAL N 500V 12A DPAK MOSFET CANAL N 30V 80A DPAK MOSFET CANAL N 30V 80A D2PAK MOSFET CANAL N 650V 12A DPAK MOSFET CANAL N 620V 2.2A DPAK MOSFET CANAL N 1000V 1.85A DPAK MOSFET CANAL N 620V 2.5A DPAK MOSFET CANAL N 600V 2.4A DPAK MOSFET CANAL N 620V 3.8A DPAK MOSFET CANAL N 525V 4.4A DPAK MOSFET CANAL N 620V 4.2A DPAK MOSFET CANAL N 950V 4A DPAK MOSFET CANAL N 600V 5A IPAK MOSFET CANAL N 620V 5.5A DPAK MOSFET CANAL N 525V 6A DPAK MOSFET CANAL N 525V 6.2A DPAK MOSFET CANAL N 800V 6.5A IPAK MOSFET CANAL N 200V 7A DPAK MOSFET CANAL N 650V 7A DPAK MOSFET CANAL N 500V 5A DPAK MOSFET CANAL N 600V 6.5A DPAK MOSFET CANAL N 620V 8.4A TO 220FP MOSFET CANAL N 500V 7.0A TO220FP MOSFET CANAL N 525V 10A TO 220FP MOSFET CANAL N 500V 9A TO 220FP MOSFET CANAL N 650V 8.5A TO 220FP MOSFET CANAL N 500V 12A TO 220FP MOSFET CANAL N 600V 14A TO 220FP MOSFET CANAL N 550V 13A TO 220FP MOSFET CANAL N 500V 14A TO 220FP MOSFET CANAL N 650V 15A TO 220FP MOSFET CANAL N 650V 17A TO 220FP MOSFET CANAL N 600V 17A TO 220FP MOSFET CANAL N 600V 16A TO 220FP MOSFET CANAL N 550V 17A TO 220FP MOSFET CANAL N 600V 19.5A TO 220FP MOSFET CANAL N 650V 17A TO 220FP MOSFET CANAL N 600V 21A TO 220FP MOSFET CANAL N 500V 21A TO 220FP MOSFET CANAL N 620V 2.2A TO 220FP MOSFET CANAL N 600V 29.0A TO 220FP MOSFET CANAL N 600V 29A TO 220FP MOSFET CANAL N 620V 2.5A TO 220FP MOSFET CANAL N 620V 2.7A TO 220FP MOSFET CANAL N 1000V 2.5A TO 220FP MOSFET CANAL N 650V 33A TO 220FP MOSFET CANAL N 525V 2.5A TO 220FP MOSFET CANAL N 620V 3.8A TO 220FP MOSFET CANAL N 525V 4.4A TO 220FP MOSFET CANAL N 620V 4.2A TO220FP MOSFET CANAL N 950V 4A TO220FP MOSFET CANAL N 620V 5.5A TO 220FP MOSFET CANAL N 525V 6A TO 220FP MOSFET CANAL N 525V 6.2A TO 220FP MOSFET CANAL N 650V 7A TO220FP MOSFET CANAL N 600V 6.5A TO220FP MOSFET CANAL N 1500V 4A TO3PF MOSFET CANAL N 650V 46A TO 3PF MOSFET CANAL N 100V 120A H2PAK MOSFET CANAL N 100V 180A H2PAK MOSFET CANAL N 75V 180A H2PAK MOSFET CANAL N 75V 180A H2PAK MOSFET CANAL N 75V 180A H2PAK MOSFET CANAL N 40V 180A H2PAK MOSFET CANAL N 60V 8.4A I2PAK MOSFET CANAL N 650V 8.5A I2PAK MOSFET CANAL N 600V 11A I2PAK MOSFET CANAL N 650V 12A I2PAK MOSFET CANAL N 650V 17A I2PAK MOSFET CANAL N 30V 16A I2PAK MOSFET CANAL N 30V 17A I2PAK MOSFET CANAL N 650V 22A I2PAK MOSFET CANAL N 650V 27A I2PAK MOSFET CANAL N 650V 33A I2PAK MOSFET CANAL N 620V 3.8A I2PAK MOSFET CANAL N 620V 5.5A I2PAK MOSFET CANAL N 650V 7A I2PAK MOSFET CANAL N 12V 100A POWERFLAT MOSFET CANAL N 20V 28A POWERFLAT MOSFET CANAL N 600V 10A POWERFLAT MOSFET CANAL N 40V 15A POWERFLAT MOSFET CANAL N 30V 160A POWERFLAT MOSFET CANAL N 650V HV POWERFLAT MOSFET CANAL N 30V 17A POWERFLAT MOSFET CANAL N 600V 6A POWERFLAT MOSFET CANAL N 600V 19.5A POWERFLAT MOSFET CANAL N 600V 16A POWERFLAT MOSFET CANAL N 600V 19A POWERFLAT MOSFET CANAL N 400V 1.8A SOT223 MOSFET CANAL N 620V 8.4A TO220 MOSFET CANAL N 600V 8A TO220 MOSFET CANAL N 600V 8A TO 220 MOSFET CANAL N 525V 10A TO 220 MOSFET CANAL N 500V 9A TO 220 MOSFET CANAL N 950V 10A TO 220 MOSFET CANAL N 600V 14A TO 220 MOSFET CANAL N 710V 12A TO 220 MOSFET CANAL N 650V 12A TO 220 MOSFET CANAL N 600V 13A TO 220 MOSFET CANAL N 800V 17A TO 220 MOSFET CANAL N 500V 14A TO 220 MOSFET CANAL N 550V 20A TO 220FP MOSFET CANAL N 75V 120A TO 220AB MOSFET CANAL N 650V 17A TO 220 MOSFET CANAL N 600V 17A TO 220 MOSFET CANAL N 600V 16A TO 220 MOSFET CANAL N 500V 17A TO 220 MOSFET CANAL N 600V 19.5A TO 220 MOSFET CANAL N 600V 17A TO 220 MOSFET CANAL N 600V 21A TO 220 MOSFET CANAL N 60V 120A TO 220 MOSFET CANAL N 500V 21A TO 220 MOSFET CANAL N 620V 2.2A TO 220 MOSFET CANAL N 1000V 1.85A TO 220 MOSFET CANAL N 650V 24A TO 220 MOSFET CANAL N 600V 29A TO 220 MOSFET CANAL N 600V 29A TO 220AB MOSFET CANAL N 650V 27A TO 220 MOSFET CANAL N 620V 2.5A TO 220 MOSFET CANAL N 620V 2.7A TO 220 MOSFET CANAL N 650V 33A TO 220 MOSFET CANAL N 525V 2.5A TO 220 MOSFET CANAL N 620V 3.8A TO 220 MOSFET CANAL N 525V 4.4A TO 220 MOSFET CANAL N 620V 4.2A TO 220AB MOSFET CANAL N 950V 4A TO 220AB MOSFET CANAL N 600V 5A TO 220FP MOSFET CANAL N 525V 5A TO 220 MOSFET CANAL N 620V 5.5A TO 220 MOSFET CANAL N 500V 5.6A TO 220 MOSFET CANAL N 525V 6A TO 220 MOSFET CANAL N 525V 6.2A TO 220 MOSFET CANAL N 950V 7.2A TO 220 MOSFET CANAL N 600V 5A TO 220AB MOSFET CANAL N 30V 80A TO 220 MOSFET CANAL N 40V 80A TO 220 MOSFET CANAL N 600V 6.5A TO 220 MOSFET CANAL N 450V 0.5A 8SOIC MOSFET CANAL N 600V 8A IPAK MOSFET CANAL N 650V 8.5A IPAK MOSFET CANAL N 30V 80A IPAK MOSFET CANAL N 650V 12A IPAK MOSFET CANAL N 620V 2.2A IPAK MOSFET CANAL N 1000V 1.85A IPAK MOSFET CANAL N 620V 2.5A IPAK MOSFET CANAL N 450V 1.8A IPAK MOSFET CANAL N 620V 2.7A IPAK MOSFET CANAL N 525V 2.5A TO 220 MOSFET CANAL N 620V 3.8A IPAK MOSFET CANAL N 525V 4.4A IPAK MOSFET CANAL N 620V 4.2A IPAK MOSFET CANAL N 950V 4A IPAK MOSFET CANAL N 620V 5.5A IPAK MOSFET CANAL N 650V 7A IPAK MOSFET CANAL N 500V 5A IPAK MOSFET CANAL N 75V 240A POWERSO MOSFET CANAL N 24V 280A POWERSO MOSFET CANAL N 600V 14A TO 247 MOSFET CANAL N 500V 14A TO 247 MOSFET CANAL N 650V 17A TO 247 MOSFET CANAL N 600V 17A TO 247 MOSFET CANAL N 600V 16A TO 247 MOSFET CANAL N 500V 17A TO 247 MOSFET CANAL N 600V 19.5A TO 247 MOSFET CANAL N 650V 17A TO 247 MOSFET CANAL N 950V 22A TO 247 MOSFET CANAL N 500V 21A TO 247 MOSFET CANAL N 600V 29A TO 247 MOSFET CANAL N 600V 29A TO 247 MOSFET CANAL N 600V 35A TO 247 MOSFET CANAL N 600V 39A TO 247 MOSFET CANAL N 600V 51A TO 247 MOSFET CANAL N 650V 46A TO 247 MOSFET CANAL N 650V 69A TO 247 MOSFET CANAL N 950V 7.2A TO 247 MOSFET CANAL N 650V 93A MAX247 MOSFET CANAL NN 30V 40A POWERFLAT MOSFET CANAL PP 30V 4A 8SOIC WALL PLATE,1 GANG,IVORY WALL PLATE,1 GANG,RED WALL PLATE,2 GANG,GREY WALL PLATE,2 GANG,IVORY WALL PLATE,2 GANG,RED WALL PLATE,2 GANG,WHITE WALL PLATE,1 GANG,1 DUPLEX,GREY WALL PLATE,1 GANG,1 DUPLEX,IVORY WALL PLATE,1 GANG,1 DUPLEX,RED WALL PLATE,2 GANG,2 DUPLEX,GREY WALL PLATE,2 GANG,2 DUPLEX,IVORY WALL PLATE,2 GANG,2 DUPLEX,RED WALL PLATE,2 GANG,2 DUPLEX,WHITE WALL PLATE,2 GANG,1 DUPLEX,GREY WALL PLATE,2 GANG,1 DUPLEX,IVORY WALL PLATE,2 GANG,1 DUPLEX,WHITE WIRE-BOARD CONNECTOR HEADER 2POS,3.96MM TEST LEAD,4MM,1M,BROWN,MICRO KLEPS TEST PROBE,4MM,BLACK,MLS TEST PROBE,4MM,RED,MLS KIT,TEST SERVICE EQUIPMENT,MLS KIT,TEST EQUIPMENT,MLS KIT,TEST EQUIPMENT,MLS PLUG,4MM,BLACK,MVL S PLUG,4MM,RED,MZS PLUG,4MM,BLACK,MZS PLUG,4MM,RED,MZS PROGRAMMATEUR FLASHER ST7 PROGRAMMATEUR FLASHER 5 PROGRAMMATEUR FLASHER PPC PROGRAMMATEUR FLASHER RX ADAPTATEUR J-LINK 19 BROCHES CORTEX-M ADAPTATEUR J-LINK 9 BROCHES CORTEX-M ADAPTATEUR J-LINK ADAPTATEUR J-LINK ARM-14 ISOLATEUR JTAG EMULATEUR JTAG J-LINK USB POWERED EMULATEUR J-LINK/PRO BUNDLE EMULATEUR J-LINK EDU EMULATEUR J-TRACE ARM EMULATEUR J-LINK PRO EMULATEUR J-TRACE POUR CORTEX-M EMULATEUR J-LINK ULTRA EMULATEUR J-LINK ULT/ARM RDI BUNDLE EMULATEUR J-LINK ULTRA/PRO BUNDLE EMULATEUR J-LINK ULTRA/FLASH BUNDLE EMULATEUR J-LINK ULTRA/J-FLASH BUNDLE EMULATEUR J-LINK/J-FLASH BUNDLE WALL PLATE,1 GANG,RED LED MOD BLANC FROID 1W 3DEG LED MOD BLANC NEUTRE 1W 3DEG LED MOD BLANC CHAUD 1W 3DEG LED MOD BLANC FROID 1W 3/60DEG LED MOD BLANC CHAUD 1W 3/60DEG LED MOD BLANC NEUTRE 1W 3/60DEG LED MOD BLANC FROID 1W 10DEG LED MOD BLANC CHAUD 1W 10DEG LED MOD BLANC CHAUD 1W 15DEG LED MOD BLANC FROID 1W 30DEG LED MOD BLANC CHAUD 1W 30DEG LED MOD BLANC FROID 1W 45DEG LED MOD BLANC CHAUD 1W 45DEG LED MOD BLANC FROID 1W 60DEG LED MOD BLANC CHAUD 1W 60DEG LED MOD BLANC FROID 1W 110DEG LED MOD BLANC CHAUD 1W 110DEG LED MOD BLANC CHAUD 3W 10DEG LED MOD BLANC FROID 3W 15DEG LED MOD BLANC CHAUD 3W 15DEG LED MOD BLANC FROID 3W 30DEG LED MOD BLANC CHAUD 3W 30DEG LED MOD BLANC FROID 3W 45DEG LED MOD BLANC CHAUD 3W 45DEG LED MOD BLANC FROID 3W 60DEG LED MOD BLANC CHAUD 3W 60DEG LED MOD RGB 3W 140DEG CC CAPACITOR POLY FILM 0.1UF 100V 5%,RADIAL CAPACITOR POLY FILM 0.22UF 63V 5%,RADIAL Z+ BLANKING PANEL FOR 19´´ RACK,ZNL100 BENCH POWER SUPPLY,60V ADJUSTABLE HFE2500 Rack Power Cord (C19) RACK,1U FOR HFE2500,SINGLE OUTPUT,IEC INPUT RACK,1U FOR HFE2500,SINGLE OUT,TERM BLOCK INPUT OLED VERBATIM VELVE KIT D´EVALUATION OLED VERBATIM VELVE PANEL MODULE CONNECTOR ASSEMBLIES,HOOKS TEST CABLE,RJ45,MAGELIS DISPLAY UNIT ACCELEROMETRE 2 AXES +/-50G 16QFN CAPTEUR GESTURE PROG 4.5KB 16LGA KIT D´EVAL ACCEL 3 AXES MMA955XL KIT D´EVAL ACCEL 3 AXES MMA955XL TOUCHSCREEN,GRAPHICAL,10.4 TIMER 50B8199 BOARD-BOARD CONNECTOR RECEPTACLE,15WAY,1ROW TVS-DIODE,12V,BIDIRECTIONAL,SOD-323 TVS-DIODE,24V,BIDIRECTIONAL,SOD-323 CABLE,MINIDIN-RJ45,MAGELIS DISPLAY UNIT CONNECTOR ASSEMBLIES,LEAD SET TEST CONNECTOR ASSEMBLIES,LEAD SET TEST TEST PROBE,OSCILLOSCOPE DMM TEST LEAD ACCESSORY KIT DMM TEST LEAD ACCESSORY KIT TEST PROBE,OSCILLOSCOPE TEST PROBE,OSCILLOSCOPE TEST PROBE,OSCILLOSCOPE TOUCHSCREEN,GRAPHICAL,5.7 CABLE,RJ45,MODBUS SERIAL LINK IC,BUCK DC-DC CONTROLLER,5.5MHz,uSIP-8 DIODE,ULTRA FAST,1A,150V,DO-214AC MICROSCOPE,USB,1280 X 1024,30FPS MICROSCOPE,USB,VGA,640 X 480,30FPS MICROSCOPE,USB,640 X 480,60FPS MICROSCOPE,USB,640 X 480,TV OUTPUT MICROSCOPE,USB,1280 X 1024,30FPS MICROSCOPE,USB,VGA,800 X 600,60FPS MICROSCOPE,USB,5MP,30FPS,200X MICROSCOPE,USB,5MP,30FPS,400X EYEPIECE,DINO-EYE,USB,1.3M PIXEL EYEPIECE,DINO-EYE,USB,5M PIXEL RTC I2C 64BYTES SRAM 8MSOP RTC I2C 64BYTES SRAM 8SOIC RTC I2C 64BYTES SRAM 8TSSOP RTC I2C 64BYTES SRAM 8TDFN RTC I2C 64BYTES SRAM 8PDIP CHIP MODULE ANTENNE XBEE 1MW CHIP ANTENNE MOD XBEEPRO 100MILW MOD XBEE PRO ZB 10MW W/CHIP ANT POWER RELAY,DPDT,24VDC,25A,FLANGE POWER RELAY,SPDT,24VDC,10A,PC BOARD FUSED TERMINAL BLOCK,6.3x32MM,SCREW,30-10AWG Desktop Ethernet Switch POTENTIOMETER,ROTARY,200 OHM,2W SWITCH,TOGGLE,SPST,15A,250V SWITCH,REED,SPDT,250mA,125VAC PROGRAMMABLE CABLE ZIPSCOPE USB DIGITAL MICROSCOPE,2M RF BJT,NPN,25V,6A,27MHZ,TO-220AB IC,OVERVOLTAGE CROWBAR,DIP-8 THERMOCOUPLE CONNECTOR,K TYPE SELECTOR HANDLE,RED N CH POWER MOSFET,HEXFET,100V,85A,D2PAK N CHANNEL MOSFET,100V,42A,TO-252AA MOSFET,N CH,80V,39A,DPAK CAP MOUNTING BRACKET,2.69´´ BASE CAT5E SNGLS PATCH CABLE RJ45M/RJ45M WHT,10FT SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 TIP-UP FOOT,19´´,DESK-TOP CASES FRONT PANEL HANDLE,8HP,GREY TRAPEZIFORM HANDLE,8HP,BLACK EXTRACTOR HANDLE,BLACK TRAPEZIFORM HANDLE,4HP,BLACK IEL HNDL BOT BLK/GRY (10 PCS) PLUG-IN UNIT,19 CHEESEHEAD SCREW,HORIZONTAL RAILS,M2.5 COUNTERSUNK SCREW,PLUG-IN UNITS,M2.5 SLEEVE,PLASTIC,GREY,100PCS MOUNTING HARDWARE HANDLE (2) 64T7220 COLLAR SCREW,PLUG-IN UNITS,M2.5 PANHEAD SCREW,GUIDE RAILS,M2.5,100 PCS SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 EARTHING KIT,DESK-TOP CASES HORIZ RAIL REAR 84HP 64T8754 HORIZONTAL RAIL,HL HANDLE,ALUMINIUM EMC COVER,PMC MEZZANINE FRONT PANEL GUIDE RAIL,GREY,70MM,1 PCS GUIDE RAIL,RED,220MM,1 PCS GUIDE RAIL,GREY,220MM,1 PCS DOUBLE TEST SOCKET,MOUNTING PLANE MOSFET,-150V,-150A,D2-PAK STANDARD DIODE,3A,1.3KV,DO-201AD ROCKER SWITCH LOAD CENTER MECHANICAL INTERLOCK FERRULES,WIRE END,4MM2,CRIMP,UNINSUL FASTENER,FOR SUBRACK GASKET,FOR PANEL GASKET,FOR PANEL SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 SUBRACK,19 MOSFET,N CH,HEXFET,30V,8.2A,TSOP-6 CARTE D´EVALUATION PIC16LF1947 F1 XLP DEV BDC MOTEUR ADD-ON F1 LV PLATFORM DEV BIPOLAIRE MOTEUR ADD-ON F1 LV PLAT DEV UNIPOLAR MOTEUR ADD-ON F1 LV PLAT FUSE,4A,FAST,5X20MM,250V,AXIAL FUSE,8A,FAST,5X20MM,250V,AXIAL FUSE,1.6A,FAST,5X20MM,250V,AXIAL FUSE,2.5A,FAST,5X20MM,250V,AXIAL FUSE,6.3A,FAST,5X20MM,250V,AXIAL FUSE,0.8A,TE7,TIME LAG,300V,RADIAL FUSE,1A,TE7,TIME LAG,300V,RADIAL FUSE,1.25A,TE7,TIME LAG,300V,RADIAL FUSE,1.6A,TE7,TIME LAG,300V,RADIAL FUSE,2A,TE7,TIME LAG,300V,RADIAL FUSE,2.5A,TE7,TIME LAG,300V,RADIAL FUSE,3.15A,TE7,TIME LAG,300V,RADIAL FUSE,4A,TE7,TIME LAG,300V,RADIAL FUSE,5A,TE7,TIME LAG,300V,RADIAL FUSE,6.3A,TE7,TIME LAG,300V,RADIAL CONTACTOR,16 KVAR,220V AC CONTACTOR,30 KVAR,24V AC CONTACTOR,30 KVAR,48V AC CONTACTOR,30 KVAR,110V AC CONTACTOR,30 KVAR,120V AC CONTACTOR,30 KVAR,220V AC CONTACTOR,30 KVAR,230V AC CONTACTOR,30 KVAR,240V AC CONTACTOR,30 KVAR,380V AC CONTACTOR,30 KVAR,400V AC CONTACTOR,30 KVAR,415V AC CONTACTOR,30 KVAR,440V AC CONTACTOR,40 KVAR,24V AC CONTACTOR,40 KVAR,48V AC CONTACTOR,40 KVAR,110V AC CONTACTOR,40 KVAR,120V AC CONTACTOR,40 KVAR,220V AC CONTACTOR,40 KVAR,230V AC CONTACTOR,40 KVAR,240V AC CONTACTOR,40 KVAR,380V AC CONTACTOR,40 KVAR,400V AC CONTACTOR,40 KVAR,415V AC CONTACTOR,40 KVAR,440V AC N CHANNEL MOSFET,100V,9.3A,PQFN WALL PLATE,1 GANG PANELMAX DIN RAIL WIRING DUCT,PVC,2.15IN H PLUG & SOCKET CONN,PLUG,4POS,6.35MM TERMINAL,RING TONGUE,#10,CRIMP SUPER GRIP TIE MOUNTS,NYLON 6.6,1X1 IN SUPER GRIP TIE MOUNTS,NYLON 6.6,2X2 IN BRIDGE RECTIFIER,1PHASE,35A,600V,isoCink+ PB BRIDGE RECTIFIER,1PHASE,40A,600V,isoCink+ PB BRIDGE RECTIFIER,1PHASE,45A,600V,isoCink+ PB SWITCH,TOGGLE,SPST,15A,277V CABINET RACK,19IN,23IN,20U BARRE LUMINEUSE VERT 7.5MM X 14MM BARRE LUMINEUSE ROUGE 7.5MM X 14MM BARRE LUMINEUSE JAUNE 7.5MM X 14MM BARRE LUMINEUSE VERT 15MM X 15MM Tapped Rail BARRE LUMINEUSE ROUGE 15MM X 15MM Tapped Rail BARRE LUMINEUSE JAUNE 15MM X 15MM TAPPED RAIL Tapped Rail BARRE LUMINEUSE VERT 8MM X 5MM Tapped Rail TAPPED RAIL,HAMMOND C2,C3 or REFK SERIES RACKS,STEEL BARRE LUMINEUSE ROUGE 8MM X 5MM Tapped Rail BARRE LUMINEUSE JAUNE 8MM X 5MM BARRE LUMINEUSE VERT 16MM X 5MM BARRE LUMINEUSE ROUGE 16MM X 5MM BARRE LUMINEUSE JAUNE 16MM X 5MM LED ROUGE SOT-23 CMS LED JAUNE SOT-23 CMS LED HYPER ROUGE SOT-23 CMS LED VERT 0603 CMS LED ROUGE 0603 CMS LED VERT 0603 CMS LED VERT 0603 CMS LED ROUGE 0603 LENTILLE A DOME CMS LED JAUNE 0603 LENTILLE A DOME CMS LED ORANGE 0805 CMS LED VERT 0805 CMS LED JAUNE 0805 CMS LED JAUNE 0805 CMS LED ROUGE 1206 CMS LED JAUNE 1206 CMS LED VERT 1206 CMS LED JAUNE 1206 CMS LED JAUNE 1206 CMS AFFICHEUR CMS 0.2 ANODE COM ROUGE AFFICHEUR CMS 0.2 ANODE COM JAUNE AFFICHEUR CMS 0.2 CATHODE COM ROUGE AFFICHEUR CMS 0.2 CATHODE COM VERT AFFICHEUR CMS 0.2 CATHODE COM JAUNE AFFICHEUR CMS 0.2 ANODE COM ROUGE AFFICHEUR CMS 0.2 ANODE COM VERT AFFICHEUR CMS 0.2 ANODE COM JAUNE AFFICHEUR CMS 0.2 CATHODE COM ROUGE AFFICHEUR CMS 0.2 CATHODE COM VERT AFFICHEUR CMS 0.2 CATHODE COM JAUNE AFFICHEUR CMS 0.3 ANODE COM VERT AFFICHEUR CMS 0.3 ANODE COM JAUNE AFFICHEUR CMS 0.3 CATHODE COM ROUGE AFFICHEUR CMS 0.3 CATHODE COM JAUNE AFFICHEUR CMS 0.3 ANODE COM VERT AFFICHEUR CMS 0.3 ANODE COM JAUNE AFFICHEUR CMS 0.3 CATHODE COM ROUGE AFFICHEUR CMS 0.3 CATHODE COM VERT AFFICHEUR CMS 0.3 CATHODE COM JAUNE AFFICHEUR CMS 0.4 ANODE COM ROUGE AFFICHEUR CMS 0.4 ANODE COM VERT AFFICHEUR CMS 0.4 ANODE COM JAUNE AFFICHEUR CMS 0.4 CATHODE COM ROUGE AFFICHEUR CMS 0.4 CATHODE COM VERT AFFICHEUR CMS 0.4 CATHODE COM JAUNE AFFICHEUR CMS 0.4 ANODE COM ROUGE AFFICHEUR CMS 0.4 ANODE COM VERT AFFICHEUR CMS 0.4 ANODE COM JAUNE AFFICHEUR CMS 0.4 CATHODE COM ROUGE AFFICHEUR CMS 0.4 CATHODE COM VERT AFFICHEUR CMS 0.4 CATHODE COM JAUNE AFFICHEUR CMS 0.56 ANODE COM ROUGE AFFICHEUR CMS 0.56 ANODE COM VERT AFFICHEUR CMS 0.56 ANODE COM JAUNE AFFICHEUR CMS 0.56 CATHODE COM ROUGE AFFICHEUR CMS 0.56 CATHODE COM VERT AFFICHEUR CMS 0.56 CATHODE COM YELL AFFICHEUR CMS 0.56 ANODE COM ROUGE AFFICHEUR CMS 0.56 ANODE COM VERT AFFICHEUR CMS 0.56 ANODE COM JAUNE AFFICHEUR CMS 0.56 CATHODE COM ROUGE AFFICHEUR CMS 0.56 CATHODE COM VERT AFFICHEUR CMS 0.56 CATHODE COM YELL FAN TOP,AC,1 FAN,35W,550CFM N CH POWER MOSFET,HEXFET,150V,33A,DPAK N CH POWER MOSFET,HEXFET,60V,120A,D2PAK N CH MOSFET,HEXFET,60V,79A,D2PAK N CH POWER MOSFET,HEXFET,60V,270A,D2PAK DRAWER,STORAGE,19IN,STEEL,BLACK LOUVERED DOOR CABINET RACK 34.75IN STEEL DB25 EXT CABLE 6 FT MF TERMINAL,RING TONGUE,#10,CRIMP YELLOW CABINET RACK,19IN,21.34IN,20U NULL MODEM CABLE ASSEMBLY,25 FT,7.6 M,GREY BRIDGE RECTIFIER,1PH,15A,600V,GSIB-5S BRIDGE RECTIFIER,1PH,25A,600V,GSIB-5S SEAL PLUG,SHS HARNESS CONNECTOR RECTANGULAR CONN,SOCKET,18WAY,CRIMP VOLTAGE TESTER CAPACITOR PP FILM 2UF,2KV,10%,CASE IC,32BIT MCU,PIC32,40MHz,VFTLA-44 CAPACITOR PP FILM 0.5UF,1KV,10%,CASE CAPACITOR PP FILM 1UF,1KV,10%,CASE BRIDGE RECTIFIER,1PHASE,30A,800V,isoCink+ PB BRIDGE RECTIFIER,1PHASE,35A,800V,isoCink+ PB CIRCULAR CONNECTOR,PLUG,3POS,CABLE INTERFACE CONVERTER CABINET RACK,19IN,23IN,36U CABINET RACK,19IN,23IN,40U DRAWER,STORAGE,19IN,STEEL,BLACK RESISTOR,METAL FILM,250 OHM,1W,1% TERMINAL,RING TONGUE,#4,CRIMP,BLUE ADJUSTABLE SHELF,5.22IN,STEEL S-VIDEO CABLE,6FT,BLACK S-VIDEO CABLE,25FT,BLACK IC,PWM CONT,FLYBACK,15V,SOIC-16 DIODE,STANDARD,4A,200V,TO-277A DIODE,STANDARD,4A,400V,TO-277A DIODE,STANDARD,4A,600V,TO-277A DIODE,STANDARD,4A,800V,TO-277A DIODE,FAST RECOVERY,2A,800V,TO-277A DIODE,FAST RECOVERY,3A,800V,TO-277A TERMINAL,RING TONGUE,1/4IN,CRIMP RACK CABINET,TABLE TOP,17.5IN,STL BLK TERMINAL,RING TONGUE,1/2IN,CRIMP TERMINAL,SPADE/FORK,#10,CRIMP,BLUE FOLDING HANDLE,CHROME-PLATED STEEL HEX NUT PROGRAMMABLE VOICE SYNTHESIZER CONTACT,SOCKET,20-18AWG,CRIMP ALIMENTATION MEDICAL 250W SIMPLE SORTIE ALIMENTATION MEDICAL 250W SIMPLE SORTIE ALIMENTATION MEDICAL 250W SIMPLE SORTIE ALIMENTATION MEDICAL 250W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE ALIMENTATION MEDICAL 350W SIMPLE SORTIE CAPOT VENTIL EMH250/EMH350 CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 10W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 5W SINGE SORTIE ALIMENTATION 75W DOUBLE SORTIE ALIMENTATION 75W DOUBLE SORTIE ALIMENTATION 100W DOUBLE SORTIE ALIMENTATION 100W DOUBLE SORTIE ALIMENTATION MEDICAL 1.5KW SIMPLE SORTIE ALIMENTATION MEDICAL 1.5KW SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 60W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W SIMPLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE CONVERTISSEUR DC/DC 15W DOUBLE SORTIE ALIMENTATION 5W SIMPLE SORTIE ALIMENTATION 15W SIMPLE SORTIE ALIMENTATION 24W SIMPLE SORTIE ALIMENTATION 150W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 65W SIMPLE SORTIE ALIMENTATION 100W SIMPLE SORTIE ALIMENTATION 40W DOUBLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 100W SIMPLE SORTIE ALIMENTATION 100W SIMPLE SORTIE ALIMENTATION 100W SIMPLE SORTIE CORDON DOUBLE LINK DVI-D 1M CORDON DOUBLE LINK DVI-D 1.8M CORDON DOUBLE LINK DVI-D 3M CORDON DOUBLE LINK DVI-D 5M CORDON DOUBLE LINK DVI-D 7M CORDON DOUBLE LINK DVI-D 10M RESISTOR,WIREWOUND,0.1 OHM,3W,1% RESISTOR WIREWOUND,0.5 OHM,3W,±1% RESISTOR WIREWOUND,1KOHM,3W,±1% RESISTOR WIREWOUND,1 OHM,3W,±1% RESISTOR WIREWOUND,10KOHM,3W,±1% RESISTOR WIREWOUND,10 OHM,3W,±1% RESISTOR WIREWOUND,100 OHM,3W,±1% RESISTOR WIREWOUND,15 OHM,3W,±1% RESISTOR WIREWOUND,250 OHM,3W,±1% RESISTOR WIREWOUND,5KOHM,3W,±1% RESISTOR WIREWOUND,5 OHM,3W,±1% RESISTOR WIREWOUND,560 OHM,3W,±1% RESISTOR WIREWOUND,0.1 OHM,5W,±1% RESISTOR WIREWOUND,0.5 OHM,5W,±1% RESISTOR WIREWOUND,1KOHM,5W,±1% RESISTOR WIREWOUND,1 OHM,5W,±1% RESISTOR WIREWOUND,10KOHM,5W,±1% RESISTOR WIREWOUND,10 OHM,5W,±1% RESISTOR WIREWOUND,100 OHM,5W,±1% RESISTOR WIREWOUND,15 OHM,5W,±1% RESISTOR WIREWOUND,25KOHM,5W,±1% RESISTOR WIREWOUND,250 OHM,5W,±1% RESISTOR WIREWOUND,5KOHM,5W,±1% RESISTOR WIREWOUND,5 OHM,5W,±1% RESISTOR WIREWOUND,560 OHM,5W,±1% RESISTOR WIREWOUND,0.1 OHM,3W,±1% RESISTOR WIREWOUND,0.5 OHM,3W,±1% RESISTOR WIREWOUND,1KOHM,3W,±1% RESISTOR WIREWOUND,1 OHMS,3W,±1% RESISTOR WIREWOUND,10 OHM,3W,±1% RESISTOR WIREWOUND,100 OHM,3W,±1% RESISTOR WIREWOUND,15 OHM,3W,±1% RESISTOR WIREWOUND,2.5KOHM,3W,±1% RESISTOR WIREWOUND,250 OHM,3W,±1% RESISTOR WIREWOUND,5 OHM,3W,±1% RESISTOR WIREWOUND,560 OHM,3W,±1% RESISTOR WIREWOUND,0.1 OHM,5W,±1% RESISTOR WIREWOUND,0.5 OHM,5W,±1% RESISTOR WIREWOUND,1KOHM,5W,±1% RESISTOR WIREWOUND,1 OHM,5W,±1% RESISTOR WIREWOUND,10KOHM,5W,±1% RESISTOR WIREWOUND,10 OHM,5W,±1% RESISTOR WIREWOUND,100 OHM,5W,±1% RESISTOR WIREWOUND,15 OHM,5W,±1% RESISTOR WIREWOUND,250 OHM,5W,±1% RESISTOR WIREWOUND,5KOHM,5W,±1% RESISTOR WIREWOUND,5 OHM,5W,±1% RESISTOR WIREWOUND,560 OHM,5W,±1% SOCKET HOUSING,JAM NUT,32WAY RESISTOR,2010,0 OHM,750mW,400V RESISTOR,2512,0 OHM,1W,500V PANEL MOUNT INDICATOR,LED,6.1MM,GREEN,28V FIBER OPTIC SENSOR FIBER OPTIC SENSOR FIBER OPTIC SENSOR FIBER OPTIC SENSOR FIBER OPTIC SENSOR FIBER OPTIC SENSOR FIBER OPTIC SENSOR INFRARED REMOTE CONTROL UNIT TERMINAL BLOCK,10 POS,10AWG MOSFET,N CH,HEXFET,75V,75A,PQFN-8 MOSFET,N CH,HEXFET,20V,80A,PQFN-8 MOSFET,P CH,HEXFET,-20V,-6.9A,TSOP-6 SENSOR,FIBRE OPTIC,REFLECTIVE,320MM SENSOR,FIBRE OPTIC,REFLECTIVE,50MM SENSOR,FIBRE OPTIC,REFLECTIVE,290MM SENSOR,FIBRE OPTIC,REFLECTIVE,420MM SENSOR,FIBRE OPTIC,REFLECTIVE,200MM SENSOR,FIBRE OPTIC,REFLECTIVE,420MM SENSOR,FIBRE OPTIC,REFLECTIVE,420MM SENSOR,FIBRE OPTIC,REFLECTIVE,520MM SENSOR,FIBRE OPTIC,THRUBEAM,860MM SENSOR,FIBRE OPTIC,THRUBEAM,3.6M SENSOR,FIBRE OPTIC,THRUBEAM,3.6M SENSOR,FIBRE OPTIC,THRUBEAM,3.6M SENSOR,FIBRE OPTIC,THRUBEAM,710MM SENSOR,FIBRE OPTIC,THRUBEAM,930MM SENSOR,FIBRE OPTIC,THRUBEAM,240MM SENSOR,FIBRE OPTIC,THRUBEAM,2.1M SENSOR,FIBRE OPTIC,THRUBEAM,3.5M SENSOR,FIBRE OPTIC,THRUBEAM,1.4M THERMISTOR,NTC,10K,3PER,RADIAL SPANNER,COMBI,RATCHET,10MM SPANNER,COMBI,RATCHET,13MM SPANNER,COMBI,RATCHET,17MM SPANNER,COMBI,RATCHET,19MM SPANNER SET,COMBI,RATCHET,4PC AMPLI AUDIO CLASSE D 2X10W 40LFCSP CARTE D´EVALUATION PULSAR CAN FRONT END CARTE AD7608 8CH CONVERTISSEUR A/N CARTE AD7609 8CH 18BIT CONVERTISSEUR A/N DAC DOUBLE 14BIT 125MSPS 40LFCSP CARTE AD9717 14BIT 125MSPS DAC CTRL NUMERIQUE SECOND LATERAL 32LFCSP CARTE D´EVALUATION ADP1046 CONTROLEUR PINCE MULTIMETRE NUMERIQUE PINCE MULTIMETRE NUMERIQUE PINCE MULTIMETRE NUMERIQUE BACKSHELL,38999,SIZE 11,STRAIGHT BACKSHELL,38999,SIZE 13,STRAIGHT BACKSHELL,38999,SIZE 15,STRAIGHT BACKSHELL,38999,SIZE 15,STRAIGHT BACKSHELL,38999,SIZE 17,STRAIGHT BACKSHELL,38999,SIZE 19,STRAIGHT BACKSHELL,38999,SIZE 21,STRAIGHT BACKSHELL,38999,SIZE 21,STRAIGHT BACKSHELL,38999,SIZE 23,STRAIGHT BACKSHELL,38999,SIZE 23,STRAIGHT BACKSHELL,38999,SIZE 25,STRAIGHT BACKSHELL,38999,SIZE 25,STRAIGHT BACKSHELL,38999,SIZE 9,R/A CRYSTAL 3.579545MHZ 18PF THRU HOLE BACKSHELL,38999,SIZE 9,R/A BACKSHELL,38999,SIZE 11,R/A BACKSHELL,38999,SIZE 11,R/A BACKSHELL,38999,SIZE 13,R/A BACKSHELL,38999,SIZE 13,R/A BACKSHELL,38999,SIZE 15,R/A BACKSHELL,38999,SIZE 15,R/A BACKSHELL,38999,SIZE 17,R/A BACKSHELL,38999,SIZE 17,R/A BACKSHELL,38999,SIZE 19,R/A BACKSHELL,38999,SIZE 19,R/A ADSP-BF609,CAN,UART,EVAL BOARD ADE7816,ENERGY METER,EVAL BOARD ADL5324,RF DRIVER AMP,EVAL BOARD IC,POWER METER,3 PHASE,40LFCSP ADAPTER,FMC TO DAC,FOR XILINX CONNECTOR,USB TO I2C,ADP1043A ISOLATOR,TXRX,2CH,RS232,44CSP BGA TRANSCEIVER,200MBPS,H-DUPLEX,8SOIC TRANSCEIVER,200MBPS,F-DUPLEX,14SOIC TRANSCEIVER,100MBPS,H-DUPLEX,8SOIC TRANSCEIVER,100MBPS,F-DUPLEX,14SOIC CRYSTAL,10MHZ,18PF,THROUGH HOLE CRYSTAL 11.0592MHZ 18PF THRU HOLE CRYSTAL 14.7456MHZ 18PF THRU HOLE ADC,8CH,12BIT,1MSPS,20QFN CURRENT SHUNT MONITOR,0-28VSENSE,16QFN INSTRUMENTATION,RRO,36V,1MHZ,8SON OP AMP,DUAL,AUDIO,36V,8MSOP SWITCH,TEMPERATURE,PROG,5SOT23 SWITCH,TEMPERATURE,PROG,5SOT23 AUDIO AMP,CLASS D,1.9W,3.6V,12WCSP AUDIO AMP,CLASS D,2.2W,5.75V,12WCSP HEADPHONE AMP,8-48KHZ,CLASS G,20DSBGA PMU,3BUCK,1BOOST,2LDO,1CHRG,48VQFN CHARGER,DUAL I/P,LI-ION,2.5A,24QFN CHARGER,DUAL I/P,LI-ION,2.5A,49DSBGA CHARGER,DUAL I/P,LI-ION,2.5A,24VQFN CHARGER,DUAL I/P,LI-ION,2.5A,49DSBGA CHARGER,DUAL I/P,LI-ION,2.5A,24VQFN LDO REG,DUAL,1.5V,3.3V,6WSON LDO REG,DUAL,3.3V,2.85V,6WSON SWITCH,DUAL,ACTIVE LOW,1.5A,8MSOP SWITCH,DUAL,ACTIVE LOW,1A,8MSOP SWITCH,DUAL,ACTIVE HIGH,1A,8MSOP SWITCH / USB CHARGE CONTROLLER,16WQFN BUCK,SYNCH,700KHZ/1MHZ,3.3V/5V,24QFN BUCK,3.5V TO 60VIN,0.5A,ADJ,10SON BUCK,2.95V TO 6VIN,3A,ADJ,8SOIC BUCK,SYNCH,2.3V-6VIN,1.2A,ADJ,8WSON BUCK,SYNCH,2.5V-6VIN,3A,3.3V,16QFN BUCK,SYNCH,2.5V-5.5VIN,3A,ADJ,16CSP PMU,2BOOST,CHRGR,RGB CNTRL,49DSBGA LDO REG,DUAL,1.85V,2.95V,5DSBGA LDO,REG,2.2V TO 5.5VIN,3.6V,5SOT23 LDO,REG,1.5V-6.5VIN,1A,ADJ,20VQFN LDO,REG,1.5V-6.5VIN,3A,ADJ,20VQFN DRIVER,MOSFET,TTL,4A,8SOIC DRIVER,MOSFET,PSEUDO CMOS,4A,8SOIC DRIVER,GATE,4A SOURCE,8A SINK,6SOT23 DRIVER,GATE,5A SINK/SOURCE,8SON BUCK,SYNCH,2.5V-6VIN,2.5V,16QFN BUCK,SYNCH,2.5V-6VIN,3A,1.8V,16QFN POWER MUX,CURRENT LTD,3.6V/18V,20QFN CRYSTAL OSCILLATOR,7.3728MHZ,THD CHARGER,LI-ION,1.2A,20HTTSOP CHARGER,LI-ION,1.2A,20VQFN INDUCTOR,15UH,1A,5%,33MHZ,AXIAL INDUCTOR,24UH,800mA,5%,25MHZ,AXIAL INDUCTOR,39UH,600mA,5%,200KHz,AXIAL INDUCTOR,55UH,500mA,5%,17MHZ,AXIAL SWITCH,PUSHBUTTON,SPDT,3A,125VAC,THRO HOLE OUTLET STRIP,RACK MOUNT,8,15A,6FT FLASH PROGRRAMMER,FOR ARM,CORTEX FLASH PROGRRAMMER,FOR STM8 MCUS OUTLET STRIP,RACK MOUNT,8,15A,6FT OUTLET STRIP,RACK MOUNT,6,15A,6FT OUTLET STRIP,RACK MOUNT,6,15A,15FT OUTLET STRIP,RACK MOUNT,6,15A,6FT OUTLET STRIP,RACK MOUNT,6,15A,15FT SWITCH,PUSHBUTTON,SPDT,60mA,30VDC,SOLDER LUG SWITCH,PUSHBUTTON,SPDT,60mA,30VDC,THRO HOLE SWITCH,PUSHBUTTON,DPDT,60mA,30VDC,SOLDER LUG SWITCH,PUSHBUTTON,DPDT,60mA,30VDC,THRO HOLE SWITCH,PUSHBUTTON,DPDT,60mA,30VDC,SOLDER LUG SWITCH,PUSHBUTTON,DPDT,60mA,30VDC,THRO HOLE OUTLET STRIP,RACK MOUNT,8,15A,15FT CAPACITOR KIT,160PCS,1UF-47UF BQ24001RGW,LI ION CHARGER,EVAL MOD TLV320AIC3104,AUDIO CODEC,EVAL KIT DRV8805,MOTOR DRIVER,EVAL MODULE EVAL MODULE,INA230,POWER MONITOR THS4531,DIFF-AMP,EVAL MODULE EVAL MODULE,FOR TMP709 TPA2025D1,AUDIO AMP,EVAL MODULE TPS54120,POWER SUPPLY,EVAL MODULE DRV8818,MOTOR DRIVER,EVAL MODULE MRF89XAM9A,TXRX,DAUGHTER BOARD TEMPERATURE CONTROLEUR IR PT100 CONTROLLER,TEMPERATURE,2 RELAY,UNIV CONTROLLER,TEMPERATURE,4 RELAY,UNIV CONTROLLER,TEMPERATURE,4 SSR,UNIV CLEANER,SOLDER TIP,60G HOLDER,FOR TIP CLEANER GEK10 GENERATEUR DE FONCTION ARB DDS 12MHZ FUNCTION GENERATOR,ARB,DDS,25MHZ APPLICATION MODULE,3000,1553 APPLICATION MODULE,3000,FLEXRAY MULTIMETRE NUMERIQUE PORTABLE 19999 PTS MULTIMETRE NUMERIQUE PORTABLE 39999 PTS MULTIMETRE NUMERIQUE PORTABLE TRMS EUR HOOD,HAN GND,TOP ENTRY,7.5-14MM HOUSING,HAN GND HOUSING,HAN GND,CABLE TO CABLE GENDER CHANGER,HAN GND,MALE - MALE BEACON,ROTATING MIRROR,24VAC/VDC,RED BEACON,ROTATING MIRROR,24VAC/VDC,ORG BEACON,ROTATING MIRROR,24VAC/VDC,BLU BEACON,ROTATING MIRROR,24VAC/VDC,RED BEACON,ROTATING MIRROR,24VAC/VDC,BLU BEACON,ROTATING MIRROR,12VAC/VDC,BLU BEACON,ROTATING MIRROR,24VAC/VDC,RED POTENTIOMETER,AUDIO,250KOHM,100mW,20% POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,AUDIO,250KOHM,100mW,20% CRYSTAL,24MHZ,18PF,THROUGH HOLE POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,AUDIO,500KOHM,100mW,20% POTENTIOMETER,LINEAR,250KOHM,250mW,20% POTENTIOMETER,LINEAR,500KOHM,250mW,20% POTENTIOMETER,LINEAR,250KOHM,250mW,20% POTENTIOMETER,LINEAR,500KOHM,250mW,20% POTENTIOMETER,AUDIO,250KOHM,250mW,20 CAPACITOR,MLCC,00508,22UF,4V,20%,X6S CAPACITOR,MLCC,0204,1UF,6.3V,20%,X5R CAPACITOR,MLCC,0306,4.7UF,6.3V,20%,X5R CAPACITOR,MLCC,00508,22UF,6.3V,20%,X5R CAPACITOR,MLCC,00508,10UF,6.3V,20%,X6S CAPACITOR,MLCC,0306,2.2UF,10V,20%,X5R CAPACITOR,MLCC,00508,22UF,10V,20%,X5R CAPACITOR,MLCC,00508,4.7UF,10V,10%,X5R LEAD,FIREWIRE,6P-6P,5M HALL EFFECT POSITION SENSOR,BUSHING,±1%,TURRETS HALL EFFECT POSITION SENSOR,BUSHING,±1%,TURRETS HALL EFFECT POSITION SENSOR,BUSHING,±0.5%,WIRES HALL EFFECT POSITION SENSOR,SERVO,±1%,TURRETS HALL EFFECT POSITION SENSOR,SERVO,±1%,TURRETS HALL EFFECT POSITION SENSOR,SERVO,±1%,TURRETS HALL EFFECT POSITION SENSOR,SERVO,±0.5%,TURRETS SIGNAL TOWER,LED,100MM,RED,240VAC SIGNAL TOWER,LED,100MM,RED,240VAC SIGNAL TOWER,LED,100MM,R/O/G,240VAC SIGNAL TOWER,LED,100MM,R/O/G/B/T,240VAC SIGNAL TOWER,LED,100MM,R/O/G/B/T,240VAC SIGNAL TOWER,LED,40MM,RED,240VAC SIGNAL TOWER,LED,40MM,RED,240VAC SIGNAL TOWER,LED,40MM,R/O,240VAC SIGNAL TOWER,LED,40MM,R/O/G,240VAC SIGNAL TOWER,LED,40MM,R/O/G,240VAC SIGNAL TOWER,LED,40MM,R/O/G/B/T,240VAC SIGNAL TOWER,LED,40MM,R/O/G/B/T,240VAC SIGNAL TOWER,LED,60MM,RED,240VAC SIGNAL TOWER,LED,60MM,RED,240VAC SIGNAL TOWER,LED,60MM,RED,240VAC SIGNAL TOWER,LED,60MM,RED,240VAC SIGNAL TOWER,LED,60MM,R/O/G,240VAC SIGNAL TOWER,LED,60MM,R/O/G,240VAC SIGNAL TOWER,LED,60MM,R/O/G,240VAC SIGNAL TOWER,LED,60MM,R/O/G,240VAC SIGNAL TOWER,LED,60MM,R/O/G/B/T,240VAC SIGNAL TOWER,LED,60MM,R/O/G/B/T,240VAC SIGNAL TOWER,LED,60MM,R/O/G/B/T,240VAC SIGNAL TOWER,LED,60MM,R/O/G/B/T,240VAC PLUG,M23-A,TYPE E,12WAY PLUG,M23-A,TYPE P,12WAY PLUG,M23-A,TYPE E,17WAY PLUG,R/A,M23-A,TYPE E,12WAY PLUG,R/A,M23-A,TYPE P,12WAY PLUG,R/A,M23-A,TYPE E,17WAY EXTENSION PLUG,M23-A,TYPE E,12WAY EXTENSION PLUG,M23-A,TYPE P,12WAY EXTENSION PLUG,M23-A,TYPE E,17WAY EXTENSION PLUG,M23-A,TYPE P,17WAY RECEPT,PANEL,M23-A,TYPE E,12WAY RECEPT,PANEL,M23-A,TYPE P,12WAY RECEPT,PANEL,M23-A,TYPE E,17WAY RECEPT,PANEL,M23-A,TYPE P,17WAY RECEPT,R/A,,M23-A,TYPE E,12WAY RECEPT,R/A,,M23-A,TYPE P,12WAY RECEPT,R/A,,M23-A,TYPE E,17WAY RECEPT,R/A,,M23-A,TYPE P,17WAY PLUG,R/A,M23-B,6WAY,SKT PLUG,R/A,M23-B,8WAY,SKT PLUG,R/A,M23-B,9WAY,SKT EXTENSION PLUG,M23-B,6WAY,PIN EXTENSION PLUG,M23-B,8WAY,PIN EXTENSION PLUG,M23-B,9WAY,PIN RECEPT,PANEL,M23-B,8WAY,PIN RECEPT,PANEL,M23-B,9WAY,PIN RECEPT,R/A,PANEL,M23-B,6WAY,PIN RECEPT,R/A,PANEL,M23-B,8WAY,PIN RECEPT,R/A,PANEL,M23-B,9WAY,PIN CORD GRIP,M23-A,DIA. 4.5-7.5MM CORD GRIP,M23-A,DIA. 11.0-15.0MM CORD GRIP,M23-B,DIA. 14.5-17.0MM PLUG,M40-C,6WAY,SKT EXTENSION PLUG,M40-C,6WAY,PIN RECEPTACLE,M40-C,6WAY,PIN RECEPTACLE,M40-C,8WAY,PIN RECEPT,R/A,FIXED,M40-C,6WAY,PIN RECEPT,R/A,FIXED,M40-C,8WAY,PIN CORD GRIP,M40-C,DIA. 9-12.5MM CORD GRIP,M40-C,DIA. 12.5-14.5MM CORD GRIP,M40-C,DIA. 14.5-17MM CORD GRIP,M40-C,DIA. 17-19.5MM CORD GRIP,M40-C,DIA. 19.5-21.5MM CORD GRIP,M40-C,DIA. 21.5-24MM CORD GRIP,M40-C,DIA. 23.5-26MM IC,TRANSCEIVER,LIN,8SOIC BUCK,40VIN,52KHZ,1A,ADJ,5TO263 VREF,SHUNT,1.225V,+/-0.5%,3SOT23 OP AMP,RRI,500KHZ,12V,5SOT23 SWITCH,MOSFET,ACTIVE LOW,0.5A,8MSOP SWITCH,MOSFET,DUAL,ACTIVE LOW,8SOIC SWITCH,MOSFET,QUAD,ACTIVE HIGH,16SOIC SWITCH,MOSFET,ACTIVE HIGH,0.5A,8MSOP SWITCH,MOSFET,ACTIVE LOW,0.5A,8MSOP SWITCH,DUAL,USB,ACTIVE HIGH,8SOP CNTRLR,PCMCIA/CARDBUS,14SOIC SUPERVISOR,DUAL,ACTIVE LOW,5V,5SOT23 LDO,REG,26VIN,1.5A,3.3V,5TO263 LDO,REG,26VIN,1.5A,5V,5TO263 LDO,REG,26VIN,1.2A,3.3V,3TO263 LDO,REG,6VIN,2.5A,ADJ,5SPAK LDO,REG,16VIN,1A,3.3V,1%,8SOIC LDO,REG,16VIN,1A,5V,1%,8SOIC LDO,REG,16VIN,1.5A,2.5V,1%,3TO263 DRIVER,MOSFET,DUAL,3A,8SOIC DRIVER,MOSFET,NON-INV,LS,6A,8SOIC DRIVER,MOSFET,LOW SIDE,3A,8SOIC DRIVER,MOSFET,DUAL,INV,1.5A,8SOIC DRIVER,MOSFET,DUAL,LS,1.5A,8SOIC PWM,FAN,MANAGEMENT,13.2V,8DIP LDO,REG,5.5VIN,10A,ADJ,6SOT23 LDO,REG,30VIN,0.15A,ADJ,8SOIC DRIVER,8BIT,LATCHED,0.5A,18SOIC DRIVER,8BIT,LATCHED,0.5A,18SOIC COMPARATOR,ADJ THRESHOLD,1.25%,5SC70 IC,((NS)) LABEL IDENTIFICATION 0.5X1.437IN 10000PC IC,EEPROM,2KBIT,SERIAL,400KHz,SOIC- IC,EEPROM,4KBIT,SERIAL,400KHZ SOIC-8 IC,EEPROM,8KBIT,SERIAL,400KHZ SOIC-8 IC,EEPROM,256KBIT SERIAL 400KHZ SOIC-8 IC,EEPROM,32KBIT,SERIAL 400KHZ SOIC-8 IC,EEPROM,64KBIT,SERIAL 400KHZ SOIC-8 IC,EEPROM,128KBIT,SERIAL 10MHZ SOIC-8 IC,EEPROM,64KBIT,SERIAL,10MHZ SOIC-8 IC,EEPROM,4KBIT,SERIAL,2MHZ,SOIC-8 IC,LED DRIVER,CONSTANT CURRENT,SOIC24 IC,LED DRIVER,BUCK,TSOT-23-5 IC,LED DRIVER,BOOST,TSOT-23-5 IC,LED DRIVER,BOOST,TSOT-23-5 IC,MPU SUPERVISOR,20µA,5.5V,SOT143-4 IC,MPU SUPERVISOR,15µA,5.5V,SOT143-4 IC,TXRX,PHY,10/100,3.3V,48LQFP IC,TXRX,PHY,10/100,LV/LP,32MLF IC,TXRX,PHY,10/100,2.5V,48SSOP IC,TXRX,PHY,10/100,2.5V,48TQFP IC,TXRX,PHY,10/100,3.3V,48LQFP IC,TXRX,SW,3 PORT,100LFBGA IC,TXRX,SW,3 PORT,128PQFPA IC,TXRX,SW,3 PORT,128PQFPA IC,TXRX,SW,3 PORT,128PQFPA IC,TXRX,SW,3 PORT,128PQFPA IC,TXRX,SW,3 PORT,128PQFPA IC,7GHZ,BUF/TRANSLATOR,1:2,16MLF IC,3.2GBPS,BUFFER,2:1,LVDS,16MLF OSCILLATOR,MEMS,CMOS,1.544MHz,SMD OSCILLATOR,MEMS,CMOS,1.8432MHz,SMD OSCILLATOR,MEMS,CMOS,10MHz,SMD OSCILLATOR,MEMS,CMOS,100MHz,SMD OSCILLATOR,MEMS,CMOS,106.25MHz,SMD OSCILLATOR,MEMS,CMOS,11.0592MHz,SMD OSCILLATOR,MEMS,CMOS,12MHz,SMD OSCILLATOR,MEMS,CMOS,12.2MHz,SMD OSCILLATOR,MEMS,CMOS,12.288MHz,SMD OSCILLATOR,MEMS,CMOS,12.352MHz,SMD OSCILLATOR,MEMS,CMOS,12.5MHz,SMD OSCILLATOR,MEMS,CMOS,125MHz,SMD OSCILLATOR,MEMS,CMOS,13MHz,SMD OSCILLATOR,MEMS,CMOS,13.513MHz,SMD OSCILLATOR,MEMS,CMOS,133.33MHz,SMD OSCILLATOR,MEMS,CMOS,14.31818MHz,SMD OSCILLATOR,MEMS,CMOS,14.7456MHz,SMD OSCILLATOR,MEMS,CMOS,15MHz,SMD OSCILLATOR,MEMS,CMOS,15.8682MHz,SMD OSCILLATOR,MEMS,CMOS,150MHz,SMD OSCILLATOR,MEMS,CMOS,16MHz,SMD OSCILLATOR,MEMS,CMOS,16.0972MHz,SMD OSCILLATOR,MEMS,CMOS,16.384MHz,SMD OSCILLATOR,MEMS,CMOS,18.432MHz,SMD OSCILLATOR,MEMS,CMOS,19.2MHz,SMD OSCILLATOR,MEMS,CMOS,19.44MHz,SMD OSCILLATOR,MEMS,CMOS,20MHz,SMD OSCILLATOR,MEMS,CMOS,22.1184MHz,SMD OSCILLATOR,MEMS,CMOS,22.5792MHz,SMD OSCILLATOR,MEMS,CMOS,24MHz,SMD OSCILLATOR,MEMS,CMOS,24.576MHz,SMD OSCILLATOR,MEMS,CMOS,25MHz,SMD OSCILLATOR,MEMS,CMOS,25.000625MHz,SMD OSCILLATOR,MEMS,CMOS,26MHz,SMD OSCILLATOR,MEMS,CMOS,27MHz,SMD OSCILLATOR,MEMS,CMOS,29.4912MHz,SMD OSCILLATOR,MEMS,CMOS,3.6864MHz,SMD OSCILLATOR,MEMS,CMOS,30MHz,SMD OSCILLATOR,MEMS,CMOS,32MHz,SMD OSCILLATOR,MEMS,CMOS,32.263MHz,SMD OSCILLATOR,MEMS,CMOS,32.35MHz,SMD OSCILLATOR,MEMS,CMOS,32.768MHz,SMD OSCILLATOR,MEMS,CMOS,33MHz,SMD OSCILLATOR,MEMS,CMOS,33.33333MHz,SMD OSCILLATOR,MEMS,CMOS,35.328MHz,SMD OSCILLATOR,MEMS,CMOS,36MHz,SMD OSCILLATOR,MEMS,CMOS,37.5MHz,SMD OSCILLATOR,MEMS,CMOS,38.4MHz,SMD OSCILLATOR,MEMS,CMOS,4MHz,SMD OSCILLATOR,MEMS,CMOS,4.096MHz,SMD OSCILLATOR,MEMS,CMOS,40MHz,SMD OSCILLATOR,MEMS,CMOS,44MHz,SMD OSCILLATOR,MEMS,CMOS,48MHz,SMD OSCILLATOR,MEMS,CMOS,49.152MHz,SMD OSCILLATOR,MEMS,CMOS,50MHz,SMD OSCILLATOR,MEMS,CMOS,54MHz,SMD OSCILLATOR,MEMS,CMOS,57.849MHz,SMD OSCILLATOR,MEMS,CMOS,6MHz,SMD OSCILLATOR,MEMS,CMOS,60MHz,SMD OSCILLATOR,MEMS,CMOS,62.5MHz,SMD OSCILLATOR,MEMS,CMOS,64MHz,SMD OSCILLATOR,MEMS,CMOS,65MHz,SMD OSCILLATOR,MEMS,CMOS,66.667MHz,SMD OSCILLATOR,MEMS,CMOS,68MHz,SMD OSCILLATOR,MEMS,CMOS,7.3728MHz,SMD OSCILLATOR,MEMS,CMOS,70MHz,SMD OSCILLATOR,MEMS,CMOS,72MHz,SMD OSCILLATOR,MEMS,CMOS,74.25MHz,SMD OSCILLATOR,MEMS,CMOS,75MHz,SMD OSCILLATOR,MEMS,CMOS,76.8MHz,SMD OSCILLATOR,MEMS,CMOS,8MHz,SMD OSCILLATOR,MEMS,CMOS,8.192MHz,SMD OSCILLATOR,MEMS,CMOS,80MHz,SMD OSCILLATOR,MEMS,CMOS,1.544MHz,SMD OSCILLATOR,MEMS,CMOS,1.8432MHz,SMD OSCILLATOR,MEMS,CMOS,10MHz,SMD OSCILLATOR,MEMS,CMOS,100MHz,SMD OSCILLATOR,MEMS,CMOS,106.25MHz,SMD OSCILLATOR,MEMS,CMOS,11.0592MHz,SMD OSCILLATOR,MEMS,CMOS,12MHz,SMD OSCILLATOR,MEMS,CMOS,12.2MHz,SMD OSCILLATOR,MEMS,CMOS,12.288MHz,SMD OSCILLATOR,MEMS,CMOS,12.352MHz,SMD OSCILLATOR,MEMS,CMOS,12.5MHz,SMD OSCILLATOR,MEMS,CMOS,120MHz,SMD OSCILLATOR,MEMS,CMOS,125MHz,SMD OSCILLATOR,MEMS,CMOS,13MHz,SMD OSCILLATOR,MEMS,CMOS,13.513MHz,SMD OSCILLATOR,MEMS,CMOS,133.33MHz,SMD OSCILLATOR,MEMS,CMOS,14.31818MHz,SMD OSCILLATOR,MEMS,CMOS,14.7456MHz,SMD OSCILLATOR,MEMS,CMOS,15MHz,SMD OSCILLATOR,MEMS,CMOS,15.8682MHz,SMD OSCILLATOR,MEMS,CMOS,150MHz,SMD OSCILLATOR,MEMS,CMOS,16MHz,SMD OSCILLATOR,MEMS,CMOS,16.0972MHz,SMD OSCILLATOR,MEMS,CMOS,16.384MHz,SMD OSCILLATOR,MEMS,CMOS,18.432MHz,SMD OSCILLATOR,MEMS,CMOS,19.2MHz,SMD OSCILLATOR,MEMS,CMOS,19.44MHz,SMD OSCILLATOR,MEMS,CMOS,20MHz,SMD OSCILLATOR,MEMS,CMOS,22.1184MHz,SMD OSCILLATOR,MEMS,CMOS,22.5792MHz,SMD OSCILLATOR,MEMS,CMOS,24MHz,SMD OSCILLATOR,MEMS,CMOS,24.576MHz,SMD OSCILLATOR,MEMS,CMOS,25MHz,SMD OSCILLATOR,MEMS,CMOS,25.000625MHz,SMD OSCILLATOR,MEMS,CMOS,26MHz,SMD OSCILLATOR,MEMS,CMOS,27MHz,SMD OSCILLATOR,MEMS,CMOS,29.4912MHz,SMD OSCILLATOR,MEMS,CMOS,3.6864MHz,SMD OSCILLATOR,MEMS,CMOS,30MHz,SMD OSCILLATOR,MEMS,CMOS,32MHz,SMD OSCILLATOR,MEMS,CMOS,32.263MHz,SMD OSCILLATOR,MEMS,CMOS,32.35MHz,SMD OSCILLATOR,MEMS,CMOS,32.768MHz,SMD OSCILLATOR,MEMS,CMOS,33MHz,SMD OSCILLATOR,MEMS,CMOS,33.33333MHz,SMD OSCILLATOR,MEMS,CMOS,35.328MHz,SMD OSCILLATOR,MEMS,CMOS,36MHz,SMD OSCILLATOR,MEMS,CMOS,37.5MHz,SMD OSCILLATOR,MEMS,CMOS,38.4MHz,SMD OSCILLATOR,MEMS,CMOS,4MHz,SMD OSCILLATOR,MEMS,CMOS,4.096MHz,SMD OSCILLATOR,MEMS,CMOS,40MHz,SMD OSCILLATOR,MEMS,CMOS,44MHz,SMD OSCILLATOR,MEMS,CMOS,48MHz,SMD OSCILLATOR,MEMS,CMOS,49.152MHz,SMD OSCILLATOR,MEMS,CMOS,50MHz,SMD OSCILLATOR,MEMS,CMOS,54MHz,SMD OSCILLATOR,MEMS,CMOS,57.849MHz,SMD OSCILLATOR,MEMS,CMOS,6MHz,SMD OSCILLATOR,MEMS,CMOS,60MHz,SMD OSCILLATOR,MEMS,CMOS,62.5MHz,SMD OSCILLATOR,MEMS,CMOS,64MHz,SMD OSCILLATOR,MEMS,CMOS,65MHz,SMD OSCILLATOR,MEMS,CMOS,66.667MHz,SMD OSCILLATOR,MEMS,CMOS,68MHz,SMD OSCILLATOR,MEMS,CMOS,7.3728MHz,SMD OSCILLATOR,MEMS,CMOS,70MHz,SMD OSCILLATOR,MEMS,CMOS,72MHz,SMD OSCILLATOR,MEMS,CMOS,74.25MHz,SMD OSCILLATOR,MEMS,CMOS,75MHz,SMD OSCILLATOR,MEMS,CMOS,76.8MHz,SMD OSCILLATOR,MEMS,CMOS,8MHz,SMD OSCILLATOR,MEMS,CMOS,8.192MHz,SMD OSCILLATOR,MEMS,CMOS,80MHz,SMD OSCILLATOR,MEMS,CMOS,1.544MHz,SMD OSCILLATOR,MEMS,CMOS,1.8432MHz,SMD OSCILLATOR,MEMS,CMOS,10MHz,SMD OSCILLATOR,MEMS,CMOS,100MHz,SMD OSCILLATOR,MEMS,CMOS,106.25MHz,SMD OSCILLATOR,MEMS,CMOS,11.0592MHz,SMD OSCILLATOR,MEMS,CMOS,12MHz,SMD OSCILLATOR,MEMS,CMOS,12.2MHz,SMD OSCILLATOR,MEMS,CMOS,12.288MHz,SMD OSCILLATOR,MEMS,CMOS,12.352MHz,SMD OSCILLATOR,MEMS,CMOS,12.5MHz,SMD OSCILLATOR,MEMS,CMOS,13MHz,SMD OSCILLATOR,MEMS,CMOS,13.513MHz,SMD OSCILLATOR,MEMS,CMOS,133.33MHz,SMD OSCILLATOR,MEMS,CMOS,14.31818MHz,SMD OSCILLATOR,MEMS,CMOS,14.7456MHz,SMD OSCILLATOR,MEMS,CMOS,15MHz,SMD OSCILLATOR,MEMS,CMOS,15.8682MHz,SMD OSCILLATOR,MEMS,CMOS,150MHz,SMD OSCILLATOR,MEMS,CMOS,16MHz,SMD OSCILLATOR,MEMS,CMOS,16.0972MHz,SMD OSCILLATOR,MEMS,CMOS,16.384MHz,SMD OSCILLATOR,MEMS,CMOS,18.432MHz,SMD OSCILLATOR,MEMS,CMOS,19.2MHz,SMD OSCILLATOR,MEMS,CMOS,19.44MHz,SMD OSCILLATOR,MEMS,CMOS,20MHz,SMD OSCILLATOR,MEMS,CMOS,22.1184MHz,SMD OSCILLATOR,MEMS,CMOS,22.5792MHz,SMD OSCILLATOR,MEMS,CMOS,24MHz,SMD OSCILLATOR,MEMS,CMOS,24.576MHz,SMD OSCILLATOR,MEMS,CMOS,25MHz,SMD OSCILLATOR,MEMS,CMOS,25.000625MHz,SMD OSCILLATOR,MEMS,CMOS,26MHz,SMD OSCILLATOR,MEMS,CMOS,27MHz,SMD OSCILLATOR,MEMS,CMOS,29.4912MHz,SMD OSCILLATOR,MEMS,CMOS,3.6864MHz,SMD OSCILLATOR,MEMS,CMOS,30MHz,SMD OSCILLATOR,MEMS,CMOS,32MHz,SMD OSCILLATOR,MEMS,CMOS,32.263MHz,SMD OSCILLATOR,MEMS,CMOS,32.35MHz,SMD OSCILLATOR,MEMS,CMOS,32.768MHz,SMD OSCILLATOR,MEMS,CMOS,33MHz,SMD OSCILLATOR,MEMS,CMOS,33.33333MHz,SMD OSCILLATOR,MEMS,CMOS,35.328MHz,SMD OSCILLATOR,MEMS,CMOS,36MHz,SMD OSCILLATOR,MEMS,CMOS,37.5MHz,SMD OSCILLATOR,MEMS,CMOS,38.4MHz,SMD OSCILLATOR,MEMS,CMOS,4MHz,SMD OSCILLATOR,MEMS,CMOS,4.096MHz,SMD OSCILLATOR,MEMS,CMOS,40MHz,SMD OSCILLATOR,MEMS,CMOS,44MHz,SMD OSCILLATOR,MEMS,CMOS,48MHz,SMD OSCILLATOR,MEMS,CMOS,49.152MHz,SMD OSCILLATOR,MEMS,CMOS,50MHz,SMD OSCILLATOR,MEMS,CMOS,54MHz,SMD OSCILLATOR,MEMS,CMOS,57.849MHz,SMD OSCILLATOR,MEMS,CMOS,6MHz,SMD OSCILLATOR,MEMS,CMOS,60MHz,SMD OSCILLATOR,MEMS,CMOS,62.5MHz,SMD OSCILLATOR,MEMS,CMOS,64MHz,SMD OSCILLATOR,MEMS,CMOS,65MHz,SMD OSCILLATOR,MEMS,CMOS,66.667MHz,SMD OSCILLATOR,MEMS,CMOS,68MHz,SMD OSCILLATOR,MEMS,CMOS,7.3728MHz,SMD OSCILLATOR,MEMS,CMOS,70MHz,SMD OSCILLATOR,MEMS,CMOS,72MHz,SMD OSCILLATOR,MEMS,CMOS,74.25MHz,SMD OSCILLATOR,MEMS,CMOS,75MHz,SMD OSCILLATOR,MEMS,CMOS,76.8MHz,SMD OSCILLATOR,MEMS,CMOS,8MHz,SMD OSCILLATOR,MEMS,CMOS,8.192MHz,SMD OSCILLATOR,MEMS,CMOS,80MHz,SMD WAVEFORM MONITOR,3G/HD/SD-SDI IC ADAPTER,44-PLCC TO 44-DIP PROFIBUS DP SUB-D CONNECTEUR PROFIBUS DP SUB-D TERM PROFIBUS DP SUB-D M12 TERM PS PROFIBUS DP SUB-D M12 TERM PROFIBUSDP SUB-D ZF TERM PS PROFIBUS DP SUB-D ZF PROFIBUS DP FBCON DP CG PROFIBUS DP FBCON DP CG 24V PROFIBUS DP FBCON SS DP. PCG PROFIBUS DP FBCON SS DP PCG 24V PROFIBUS DP RS PB-DP T SUB-D PROFIBUS PA FBCON PA CG 1 VOIES PROFIBUS PA FBCON PA CG 2 VOIES PROFIBUS PA FBCON PA CG 4 VOIES PROFIBUS PA FBCON PA CG 1 VOIES PROFIBUS PA FBCON PA CG 2 VOIES PROFIBUS PA FBCON TERM.D FM/PEAN HOUSING RECEPTACLE 1.25MM 4 VOIES HOUSING RECEPTACLE 1.25MM 6 VOIES HOUSING RECEPTACLE 1.25MM 8 VOIES HOUSING RECEPTACLE 1.25MM 11 VOIES HOUSING RECEPTACLE 1.25MM 13 VOIES HOUSING RECEPTACLE 1.25MM 14 VOIES EMBASE 1.25MM SMT 2 VOIES EMBASE 1.25MM SMT 3 VOIES EMBASE 1.25MM SMT 9 VOIES EMBASE 1.25MM SMT 10 VOIES EMBASE 1.25MM SMT 11 VOIES EMBASE 1.25MM SMT 12 VOIES EMBASE 1.25MM SMT 13 VOIES EMBASE 1.25MM SMT 14 VOIES EMBASE 1.25MM SMT 15 VOIES EMBASE 1.25MM THT 2 VOIES EMBASE 1.25MM THT 3 VOIES EMBASE 1.25MM THT 4 VOIES EMBASE 1.25MM THT 8 VOIES EMBASE 1.25MM THT 9 VOIES EMBASE 1.25MM THT 10 VOIES EMBASE 1.25MM THT 11 VOIES EMBASE 1.25MM THT 12 VOIES EMBASE 1.25MM THT 13 VOIES EMBASE 1.25MM THT 14 VOIES EMBASE 1.25MM THT 15 VOIES EMBASE 1.25MM SMT R/A 5 VOIES EMBASE 1.25MM SMT R/A 6 VOIES EMBASE 1.25MM SMT R/A 7 VOIES EMBASE 1.25MM SMT R/A 9 VOIES EMBASE 1.25MM SMT R/A 11 VOIES EMBASE 1.25MM SMT R/A 12 VOIES EMBASE 1.25MM SMT R/A 13 VOIES EMBASE 1.25MM SMT R/A 14 VOIES EMBASE 1.25MM SMT R/A 15 VOIES EMBASE 1.25MM THT R/A 2 VOIES EMBASE 1.25MM THT R/A 3 VOIES EMBASE 1.25MM THT R/A 4 VOIES EMBASE 1.25MM THT R/A 5 VOIES EMBASE 1.25MM THT R/A 6 VOIES EMBASE 1.25MM THT R/A 7 VOIES EMBASE 1.25MM THT R/A 8 VOIES EMBASE 1.25MM THT R/A 9 VOIES EMBASE 1.25MM THT R/A 10 VOIES EMBASE 1.25MM THT R/A 11 VOIES EMBASE 1.25MM THT R/A 12 VOIES EMBASE 1.25MM THT R/A 13 VOIES EMBASE 1.25MM THT R/A 14 VOIES EMBASE 1.25MM THT R/A 15 VOIES CORDON 1.25MM SIMPLE END 300MM CORDON 1.25MM SIMPLE END 150MM CPLD MAX V 1270 LE 256FBGA CPLD MAX V 1270 LE 144TQFP CPLD MAX V 160 LE 64EQFP CPLD MAX V 160 LE 100MBGA CPLD MAX V 160 LE 100TQFP CPLD MAX V 2210 LE 256FBGA CPLD MAX V 240 LE 100MBGA CPLD MAX V 240 LE 144TQFP CPLD MAX V 40 LE 64EQFP CPLD MAX V 570 LE 256FBGA CPLD MAX V 570 LE 100MBGA CPLD MAX V 570 LE 100TQFP CPLD MAX V 570 LE 100TQFP CPLD MAX V 80 LE 64MBGA CPLD MAX V 80 LE 100TQFP FPGA ARRIA II GX 45K 358UBGA FPGA ARRIA II GX 45K 358UBGA FPGA ARRIA II GX 45K 572FBGA FPGA ARRIA II GX 45K 572FBGA FPGA ARRIA II GX 45K 780FBGA FPGA ARRIA II GX 65K 358UBGA FPGA ARRIA II GX 65K 572FBGA FPGA ARRIA II GX 65K 780FBGA FPGA ARRIA II GX 65K 780FBGA FPGA ARRIA II GX 95K 572FBGA FPGA ARRIA II GX 95K 780FBGA FPGA CYCLONE IV 115K 484FBGA FPGA CYCLONE IV 115K 484FBGA FPGA CYCLONE IV 115K 780FBGA FPGA CYCLONE IV 115K 780FBGA FPGA CYCLONE IV 15K 256FBGA FPGA CYCLONE IV 15K 256FBGA FPGA CYCLONE IV 15K 484FBGA FPGA CYCLONE IV 22K 144EQFP FPGA CYCLONE IV 22K 144EQFP FPGA CYCLONE IV 22K 256FBGA FPGA CYCLONE IV 22K 256FBGA FPGA CYCLONE IV 30K 484FBGA FPGA CYCLONE IV 30K 780FBGA FPGA CYCLONE IV 30K 780FBGA FPGA CYCLONE IV 40K 484FBGA FPGA CYCLONE IV 40K 780FBGA FPGA CYCLONE IV 40K 780FBGA FPGA CYCLONE IV 55K 484FBGA FPGA CYCLONE IV 55K 484FBGA FPGA CYCLONE IV 55K 780FBGA FPGA CYCLONE IV 6K 144EQFP FPGA CYCLONE IV 6K 256FBGA FPGA CYCLONE IV 6K 256FBGA FPGA CYCLONE IV 75K 484FBGA FPGA CYCLONE IV 75K 484FBGA FPGA CYCLONE IV 75K 780FBGA FPGA CYCLONE IV 75K 780FBGA FPGA CYCLONE IV GX 15K 169FBGA FPGA CYCLONE IV GX 15K 169 FBGA FPGA CYCLONE IV GX 15K 148QFN FPGA CYCLONE IV GX 15K 148QFN FPGA CYCLONE IV GX 22K 169FBGA FPGA CYCLONE IV GX 22K 169FBGA FPGA CYCLONE IV GX 22K 324FBGA FPGA CYCLONE IV GX 30K 169FBGA FPGA CYCLONE IV GX 30K 169FBGA FPGA CYCLONE IV GX 30K 324FBGA FPGA CYCLONE IV GX 30K 324FBGA FPGA CYCLONE IV GX 30K 484FBGA FPGA CYCLONE IV GX 50K 484FBGA FPGA CYCLONE IV GX 50K 484FBGA FPGA CYCLONE IV GX 50K 672FBGA FPGA CYCLONE IV GX 75K 484FBGA FPGA CYCLONE IV GX 75K 484FBGA FPGA CYCLONE IV GX 75K 484FBGA FPGA CYCLONE IV GX 75K 672FBGA CAPOT ANTI POUSS 38999 RECPT TAILLE 9 CAPOT ANTI POUSS 38999 RECPT TAILLE 9 CAPOT ANTI POUSS 38999 RECPT TAILLE 9 CAPOT ANTI POUSS 38999 RECPT TAILLE 11 CAPOT ANTI POUSS 38999 RECPT TAILLE 11 CAPOT ANTI POUSS 38999 RECPT TAILLE 11 CAPOT ANTI POUSS 38999 RECPT TAILLE 11 CAPOT ANTI POUSS 38999 RECPT TAILLE 13 CAPOT ANTI POUSS 38999 RECPT TAILLE 15 CAPOT ANTI POUSS 38999 RECPT TAILLE 15 CAPOT ANTI POUSS 38999 RECPT TAILLE 15 CAPOT ANTI POUSS 38999 RECPT TAILLE 15 CAPOT ANTI POUSS 38999 RECPT TAILLE 15 CAPOT ANTI POUSS 38999 RECPT TAILLE 17 CAPOT ANTI POUSS 38999 RECPT TAILLE 17 CAPOT ANTI POUSS 38999 RECPT TAILLE 19 CAPOT ANTI POUSS 38999 RECPT TAILLE 19 CAPOT ANTI POUSS 38999 RECPT TAILLE 19 CAPOT ANTI POUSS 38999 RECPT TAILLE 21 CAPOT ANTI POUSS 38999 RECPT TAILLE 23 CAPOT ANTI POUSS 38999 RECPT TAILLE 23 CAPOT ANTI POUSS 38999 RECPT TAILLE 25 CAPOT ANTI POUSS 38999 FICHE TAILLE 9 CAPOT ANTI POUSS 38999 FICHE TAILLE 11 CAPOT ANTI POUSS 38999 FICHE TAILLE 13 CAPOT ANTI POUSS 38999 FICHE TAILLE 15 CAPOT ANTI POUSS 38999 FICHE TAILLE 17 CAPOT ANTI POUSS 38999 FICHE TAILLE 19 CAPOT ANTI POUSS 38999 FICHE TAILLE 19 CAPOT ANTI POUSS 38999 FICHE TAILLE 21 CAPOT ANTI POUSS 38999 FICHE TAILLE 23 CAPOT ANTI POUSS 38999 FICHE TAILLE 25 CAPOT ANTI POUSS 38999 FICHE TAILLE 11 ADAPTATEUR ANNEAU METAL 38999 TAILLE 9 ADAPTATEUR ANNEAU METAL 38999 TAILLE 9 ADAPTATEUR ANNEAU METAL 38999 TAILLE 11 ADAPTATEUR ANNEAU METAL 38999 TAILLE 11 ADAPTATEUR ANNEAU METAL 38999 TAILLE 11 ADAPTATEUR ANNEAU METAL 38999 TAILLE 13 ADAPTATEUR ANNEAU METAL 38999 TAILLE 13 ADAPTATEUR ANNEAU METAL 38999 TAILLE 15 ADAPTATEUR ANNEAU METAL 38999 TAILLE 15 ADAPTATEUR ANNEAU METAL 38999 TAILLE 15 ADAPTATEUR ANNEAU METAL 38999 TAILLE 17 ADAPTATEUR ANNEAU METAL 38999 TAILLE 17 ADAPTATEUR ANNEAU METAL 38999 TAILLE 17 ADAPTATEUR ANNEAU METAL 38999 TAILLE 19 ADAPTATEUR ANNEAU METAL 38999 TAILLE 21 ADAPTATEUR ANNEAU METAL 38999 TAILLE 15 ADAPTATEUR ANNEAU METAL 38999 TAILLE 17 CONDUIT ADAPTATEUR TAILLE 25 MAGNA FORM ADAPTATEUR 26482 TAILLE 22 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 18 ADAPTATEUR TAILLE 18 ADAPTATEUR TAILLE 18 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 24 ADAPTATEUR TAILLE 24 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 18 ADAPTATEUR TAILLE 18 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 24 ADAPTATEUR TAILLE 24 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 15 ADAPTATEUR TAILLE 15 ADAPTATEUR TAILLE 15 ADAPTATEUR TAILLE 15 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 19 ADAPTATEUR TAILLE 21 ADAPTATEUR TAILLE 21 ADAPTATEUR TAILLE 21 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 25 ADAPTATEUR TAILLE 25 ADAPTATEUR TAILLE 25 ADAPTATEUR TAILLE 25 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 9 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 13 ADAPTATEUR TAILLE 15 ADAPTATEUR TAILLE 15 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 17 ADAPTATEUR TAILLE 19 ADAPTATEUR TAILLE 19 ADAPTATEUR TAILLE 19 ADAPTATEUR TAILLE 19 ADAPTATEUR TAILLE 21 ADAPTATEUR TAILLE 21 ADAPTATEUR TAILLE 21 ADAPTATEUR TAILLE 21 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 23 ADAPTATEUR TAILLE 25 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 18 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 24 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 12 ADAPTATEUR TAILLE 14 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 18 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 24 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 20 ADAPTATEUR TAILLE 28 ADAPTATEUR TAILLE 28 ADAPTATEUR TAILLE 8 ADAPTATEUR TAILLE 10 ADAPTATEUR TAILLE 16 ADAPTATEUR TAILLE 22 ADAPTATEUR TAILLE 11 ADAPTATEUR TAILLE 15 ADAPTATEUR TAILLE 19 ADAPTATEUR TAILLE 17 STRAIN RELIEF ADAPTATEUR TAILLE 20 HEAT SHRINK BOOT ADAPTATEUR TAILLE 18 HEAT SHRINK BOOT ADAPTATEUR TAILLE 13 HEAT SHRINK BOOT ADAPTATEUR TAILLE 17 ADAPTATEUR COUPLEUR TAILLE 9 ADAPTATEUR COUPLEUR TAILLE 9 ADAPTATEUR COUPLEUR TAILLE 11 ADAPTATEUR COUPLEUR TAILLE 11 ADAPTATEUR COUPLEUR TAILLE 13 ADAPTATEUR COUPLEUR TAILLE 13 ADAPTATEUR COUPLEUR TAILLE 13 ADAPTATEUR COUPLEUR TAILLE 17 ADAPTATEUR COUPLEUR TAILLE 23 ADAPTATEUR BAND-IT TAILLE 21 ADAPTATEUR BAND-IT TAILLE 19 RECEPTACLE PANEL RJ45 CAT 5E RECEPTACLE PANEL RJ45 CAT 6 RECEPTACLE PANEL USB A FICHE RJ45 CAT 6A FICHE RJ45 CAT 6 RECEPTACLE JAM NUT RJ45 CAT 5E RECEPTACLE JAM NUT RJ45 CAT 6 CAPACITOR CERAMIC 0.1UF 100V,C0G,5%,1210 PONT REDRESSEUR 1PH 1A 100V DFM PONT REDRESSEUR 1PH 1A 400V DFS PONT REDRESSEUR 1PH 1A 800V DFS PONT REDRESSEUR 1PH 1A 1KV DFM PONT REDRESSEUR 1PH 1A 1KV DFS PONT REDRESSEUR 1PH 1A 1KV DFS PONT REDRESEUR 1PH 25A 400V KBPC PONT REDRESEUR 1PH 50A 1KV KBPC PONT REDRESSEUR 4A 600V 4SIL PONT REDRESEUR 3PH 160A 800V MTK DIODE DE REDRESSEMENT 8A 45V DO-201AD DIODE DE REDRESSEMENT 3A 800V SOD-64 DIODE DE REDRESSEMENT 8A 200V TO-220B DIODE DE REDRESSEMENT 3A 600V DO-214AB DIODE DE REDRESSEMENT 10A 1.5KV TO-220F DIODE DE REDRESSEMENT 5A 40V D-PAK DIODE DE REDRESSEMENT 6A 50V AXIAL DIODE DE REDRESSEMENT 6A 600V AXIAL DIODE DE REDRESSEMENT 1A 200V MICROSMP DIODE DE REDRESSEMENT 4A 1KV 267 DIODE DE REDRESSEMENT 4A 20V DO-214AB DIODE DE REDRESSEMENT 4A 30V DO-214AB DIODE DE REDRESSEMENT 4A 40V DO-214AB DIODE DE REDRESSEMENT 1A 60V DO-214AC DIODE DE REDRESSEMENT 2A 60V DO-214AA DIODE DE REDRESSEMENT 2A 60V DO-214AA DIODE DE REDRESSEMENT 3A 40V DO-214AB DIODE DE REDRESSEMENT 3A 40V DO-214AB DIODE DE REDRESSEMENT 2A 40V DO-214AC DIODE DE REDRESSEMENT 3A 40V DO-214AC DIODE DE REDRESSEMENT 1A 15V DO-214AA DIODE DE REDRESSEMENT 3A 20V DO-214AC DIODE DE REDRESSEMENT 1A 800V 59 DIODE VARICAP 25PF 0.1UA SOT-23 DIODE SMALL SIG 100V 0.2A SOD-80 DIODE ZENER 10W 6.8V DO-4 DIODE ZENER 10W 10V DO-4 DIODE ZENER 10W 200V DO-4 DIODE ZENER 5W 28V 017AA DIODE TVS 1.5KW 300V DO-201 DIODE TVS 600W 6V SMB DIODE TVS 5KW 110V P600 DIODE TVS 5V SOT-723 DIODE TVS 5W 482V DO-214AA DIODE TVS AR 450W 2.5V SLP2626P10 DIODE TVS AR 450W 3.3V SLP2626P10 DIODE TVS 5W 324V DO-214AA DIODE TVS 1.5KW 220V DO-214AB DIODE TVS 1.5KW 85V DO-214AB RESEAU DE DIODE TVS 350W 5V SC-74 DIODE DE REDRESSEMENT 6AX2 D-PAK DIODE DE REDRESSEMENT 6AX2 D-PAK DIODE DE REDRESSEMENT 3.5AX2 D-PAK FILTRE USB ESD PROTECT SOT363 LVDS BUFFER/REPEATER LLP-8 LVDS REPEAT 800MBPS TSSOP48 RS232 TRANSCEIVER 5.5V 16WSOIC RS232 TXRX 460KBPS 16SOIC RS-422/485 TXRX 10MBPS 8SOIC RS422/485 TRANSCEIVER 8NSOIC RS-422/485 TRANSCEIVER 8DIP RS-232 TRANSCEIVER 5V 16SOIC RS-422/485 TXRX 52MBPS SOT235 RS422/485 TXRX 250KBPS 8SOIC RS422/485 TRANSCEIVER 8SOIC DESERIEIZER 40MHZ 10BIT 28SSOP MEMOIRE EEPROM 64KBIT I2C 5SOT-23 HEAVY-DUTY CONTACT BLOCK,30 MM,1 NO,1 BUFF/DVR TRI-ST 8BIT 20TSSOP HEX INVER SCHMITT TRIG 14TSSOP HEX INVER SCHMITT TRIG 14SOIC TRANSLATE TRANSCEIVER 48TSSOP Switch Contact Block MEMOIRE SRAM 1MBIT 10NS TSOP-2-44 MEMOIRE SRAM 256KBIT 45NS TSOP-28 USB HS PUISSANCE SW 5.5V N8SOIC CAN CTRL 1MBPS 4/3 20TSSOP I/O EXPANDER 16 BITS 28SOIC I/O EXPANDER 16 BITS 24TSSOP I/O EXPANDER 8 BITS 16SOIC I/O EXPANDER 16 BITS 24TSSOP I2C BUS-UART INTERFACE 16TSSOP OSCILLATEUR CRYS CLK 50MHZ CMS OSCILLATEUR QUARTZ 25MHZ CMS OSCILLATEUR QUARTZ 32.768KHZ CMS OSCILLATEUR 16MHZ CMS QUARTZ 32.768KHZ 12.5PF CMS QUARTZ 12MHZ 18PF CMS QUARTZ 8MHZ 18PF CMS QUARTZ 8MHZ 18PF CMS QUARTZ 11.0592MHZ 18PF CMS QUARTZ 18.432MHZ 18PF CMS QUARTZ 48MHZ 18PF CMS QUARTZ 12.288MHZ 18PF CMS QUARTZ 26MHZ 18PF CMS QUARTZ 28.63636MHZ 18PF CMS QUARTZ 16MHZ 18PF CMS QUARTZ 32.768KHZ 12.5PF CMS QUARTZ 32KHZ 12.5PF CMS QUARTZ 32.768KHZ 12.5PF CMS QUARTZ 32.768KHZ 12.5PF CMS QUARTZ 32.768KHZ 12.5PF CMS QUARTZ 32.768KHZ 12.5PF CMS QUARTZ 6MHZ 18PF CMS RESONATEUR CERAMIQUE16MHZ CMS RESONATEUR CERAMIQUE16MHZ CMS SIDACTOR 275V DO-214AA SURGE PROTECTOR 6V DO-214AA THYRISTOR 4A 400V TO-225AA MODULE THYRISTOR 106A 1.6KV TRANSISTOR NPN 60V 15A TO3 TRANSISTOR NPN 300V 2A TO-66 TRANSISTOR NPN 45V 0.1A TO-92 TRANSISTOR NPN 100V 0.008A TO252 TRANSISTOR NPN 100V 3A IPAK TRANSISTOR NPN 300V 0.5A TO252 TRANSISTOR PNP 100V 6A TO252 TRANSISTOR NPN 350V 4A TO220 TRANSISTOR PNP 200V 15A SOT93 TRANSISTOR NPN 350V 30A TO264 TRANSISTOR NPN 250V 15A TO3P TRANSISTOR NPN 40V 0.6A TO-92 TRANSISTOR PNP 80V 0.8A TO-92 TRANSISTOR PNP 100V 10A TO247 TRANSI QUADRUPLE NPN 40V 0.5A 16NSOIC TRANSISTOR DARLING NPN 50V TO-92 TRANSISTOR DARLING NPN 400V TO-3 TRANSISTOR DARLING NPN 400V TO-3 TRANSISTOR DARLING NPN 500V TO-3 IGBT 600V 14A TO-220 MOSFET CANAL N 60V 0.99A TO-205AD MOSFET CANAL P 12V 0.75A SOT23 MOSFET CANAL P 30V 0.0049A SSOT-6 MOSFET CANAL N 30V 0.0063A SSOT-6 MOSFET CANAL P 40V 10.8A TO-252 MOSFET CANAL P 40V 8.2A 8-SOIC MOSFET CANAL P 30V 14.5A 8SOIC MOSFET CANAL N 150V 33A TO-3PN MOSFET CANAL N 250V 16A TO-252 MOSFET CANAL N 100V 1.7A SOT-223 MOSFET CANAL N 100V 1.6A SOT-223 MOSFET CANAL P 60V 1.8A SOT-223 MOSFET CANAL P 100V 1.1A SOT-223 MOSFET CANAL N 55V 59A D-PAK MOSFET CANAL N 75V 56A D-PAK MOSFET CANAL P 100V 6.6A D-PAK MOSFET CANAL N 55V 2A SOT-223 MOSFET CANAL N 30V 7.2A SOT-223 MOSFET CANAL P 60V 15.5A D-PAK MOSFET CANAL P 30V 25A D-PAK MOSFET CANAL P 60V 12A D-PAK MOSFET CANAL N 30V 191A DFN5 MOSFET CANAL N 30V 0.9A SC-70 MOSFET CANAL P 20V 4.7A TO-236 MOSFET CANAL P 150V 0.69A TO-236 MOSFET CANAL P 80V 2.2A TO-236 MOSFET CANAL P 20V 3A TO-236 MOSFET CANAL P 20V 8A TSOP-6 MOSFET CANAL P 40V 8.7A 8SOIC MOSFET CANAL P 30V 8.8A 8SOIC MOSFET CANAL P 30V 11.4A 8SOIC MOSFET CANAL P 200V 2.2A PUISSANCEPAK MOSFET CANAL P 150V 3A PUISSANCEPAK MOSFET CANAL P 80V 28A PUISSANCEPAK MOSFET CANAL P 100V 28A PUISSANCEPAK MOSFET CANAL P 30V 35A PUISSANCEPAK MOSFET CANAL P 60V 4.7A 8SOIC MOSFET CANAL N 40V 47A PUISSANCEPAK MOSFET CANAL N 40V 58A PUISSANCEPAK MOSFET CANAL N 40V 3.9A PUISSANCEPAK MOSFET CANAL N 30V 20A PUISSANCEPAK MOSFET CANAL N 40V 40A PUISSANCEPAK MOSFET CANAL N 60V 55A TO-220 MOSFET CANAL P 60V 18.3A TO-252 MOSFET CANAL P 20V 0.58A TO-236 TRANSISTOR NPN 800MHZ 30V TO39 TRANSISTOR NPN 1.2GHZ 20V TO39 MODULE IGBT 600V 16A IMS-2 MODULE IGBT 600V 24A IMS-2 MOSFET CANAL NN 20V MICROFET 2X2 MOSFET CANAL NN 80V 8SOIC MOSFET NCANAL P 30V/20V 8SOIC MOSFET NCANAL P 60V SC-89 MOSFET NCANAL P 20V SC-70 MOSFET CANAL NN 30V 8SOIC MOSFET NCANAL P 20V 1206 MOSFET CANAL PP 60V 8SOIC MOSFET CANAL PP 20V 8SOIC, PATCH ANTENNE 1575MHZ 50 OHM VSWR RF/ IF EMETTEUR AND RECEPTEUR ADAPTATEUR BANDSTRAP 38999 TAILLE 9 ADAPTATEUR BANDSTRAP 38999 TAILLE 13 ADAPTATEUR BANDSTRAP 38999 TAILLE 15 ADAPTATEUR BANDSTRAP 38999 TAILLE 17 ADAPTATEUR BANDSTRAP 38999 TAILLE 19 ADAPTATEUR BANDSTRAP 38999 TAILLE 21 ADAPTATEUR BANDSTRAP 38999 TAILLE 23 ADAPTATEUR BANDSTRAP 38999 TAILLE 25 ADAPTATEUR BANDSTRAP 38999 TAILLE 9 ADAPTATEUR BANDSTRAP 38999 TAILLE 11 ADAPTATEUR BANDSTRAP 38999 TAILLE 17 ADAPTATEUR BANDSTRAP 38999 TAILLE 19 ADAPTATEUR BANDSTRAP 38999 TAILLE 21 ADAPTATEUR BANDSTRAP 38999 TAILLE 23 ADAPTATEUR BANDSTRAP 38999 TAILLE 25 CORPS CONNECT ANGLE VARIABLE38999 9 CORPS CONNECT ANGLE VARIABLE38999 11 CORPS CONNECT ANGLE VARIABLE38999 13 CORPS CONNECT ANGLE VARIABLE38999 15 CORPS CONNECT ANGLE VARIABLE38999 17 CORPS CONNECT ANGLE VARIABLE38999 9 CORPS CONNECT ANGLE VARIABLE38999 11 CORPS CONNECT ANGLE VARIABLE38999 13 CORPS CONNECT ANGLE VARIABLE38999 15 CORPS CONNECT ANGLE VARIABLE38999 17 TINEL-LOCK ADAPTATEUR 38999 TAILLE 9 TINEL-LOCK ADAPTATEUR 38999 TAILLE 11 TINEL-LOCK ADAPTATEUR 38999 TAILLE 13 TINEL-LOCK ADAPTATEUR 38999 TAILLE 15 TINEL-LOCK ADAPTATEUR 38999 TAILLE 17 TINEL-LOCK ADAPTATEUR 38999 TAILLE 9 TINEL-LOCK ADAPTATEUR 38999 TAILLE 11 TINEL-LOCK ADAPTATEUR 38999 TAILLE 13 TINEL-LOCK ADAPTATEUR 38999 TAILLE 15 TINEL-LOCK ADAPTATEUR 38999 TAILLE 17 MICRO 32 BITS V850ES JC3-H 48LFQFP MICRO 32 BITS V850ES JC3-L 48LFQFP MICRO 32 BITS V850ES JE3-E 64LFQFP MICRO 32 BITS V850ES JE3-H 64LFQFP MICRO 32 BITS V850ES JE3-L 64LFQFP MICRO 32 BITS V850ES JF3-L 80LFQFP MICRO 32 BITS V850ES JF3-L 80LFQFP MICRO 32 BITS V850ES 100LFQFP MICRO 32 BITS V850ES L 100LFQFP MICRO 32 BITS V850ES L 100LFQFP MICRO 32 BITS V850ES L 100LFQFP MICRO 32 BITS V850ES JX 100LFQFP MICRO 32 BITS V850ES JX 100LFQFP MICRO 32 BITS V850ES JX3-L 100LFQFP MICRO 32 BITS V850ES JJ3 144LFQFP MICRO 32 BITS V850ES JJ3 144LFQFP MICRO 32 BITS V850ES JJ3 144LFQFP POTENTIOMETER,LINEAR,250KOHM,250mW,2 POTENTIOMETER,LINEAR,500KOHM,250mW,2 TESTER,CABLE CONTINUITY,SINGLE ENDED,9V RECEPTACLE HOUSING METAL RECEPTACLE HOUSING PLASTIC SIGNAL HOUSING 5 VOIES CONTACT RECEPTACLE MCON 2.5-4MM2 CONTACT RECEPT MCON 0.25-0.4MM2 CONTACT RECEPT MCON 0.5-0.75MM2 INSERT EMBASE 4 VOIES TAB CONNECTEUR KIT HOOD CAPOT SCREEN METAL LATERAL CLIP METAL KIT HOOD CAPOT SCREEN PLASTIC LATERAL CLIP PLASTIC PROTECTION CAPOT PROTECTION CAPOT SEALING VARISTANCE 275V 10% VARISTANCE 275V 10% VARISTANCE 14V 10% VARISTANCE 20V 10% VARISTANCE 25V 10% VARISTANCE 30V 10% VARISTANCE 30V 10% VARISTANCE 30V 10% VARISTANCE 35V 10% VARISTANCE 35V 10% VARISTANCE 40V 10% VARISTANCE 14V 10% VARISTANCE 14V +23% TO 0% VARISTANCE 14V +23% TO 0% ECLATEUR A GAZ 2 ELECTRODES 200V 30% ECLATEUR A GAZ 2 ELECTRODES 90V 20% ECLATEUR A GAZ 2 ELECTRODES 200V 20% ECLATEUR A GAZ 2 ELECTRODES 400V 20% THERMISTANCE DISC CTN 16 OHM 20% THERMISTANCE DISC CTN 4 OHM 20% THERMISTANCE DISC CTN 50 OHM 20% TRANSDUCER AUDIO SMT POTENTIOMETRE LINEAIR 5K 500MW 20% POTENTIOMETRE LINEAIR 10K 500MW 20% POTENTIOMETRE LINEAIR 5K 500MW 20% POTENTIOMETRE LINEAIR 10K 500MW 20% POTENTIOMETRE LINEAIR 10K 500MW 20% RESISTANCE PUISSANCE 10K 0.05 35W RESISTANCE PUISSANCE 100R 0.05 35W RESISTANCE PUISSANCE 15R 0.05 35W RESISTANCE PUISSANCE 1R 0.05 35W RESISTANCE PUISSANCE 20R 0.01 35W RESISTANCE PUISSANCE 470R 0.05 35W CONNECTEUR HOUSING RECEPTACLE 2 VOIES CONNECTEUR HOUSING RECEPTACLE 4 VOIES CONNECTEUR HOUSING RECEPTACLE 7 VOIES CONNECTEUR EMBASE THT 6 VOIES CONNECTEUR EMBASE THT 7 VOIES CONNECTEUR EMBASE R/A 2 VOIES CONNECTEUR EMBASE R/A 3 VOIES CONNECTEUR EMBASE R/A 6 VOIES CONNECTEUR EMBASE R/A 7 VOIES CONNECTEUR EMBASE R/A 2 VOIES CONNECTEUR EMBASE R/A 3 VOIES CONNECTEUR EMBASE R/A 4 VOIES CONNECTEUR EMBASE R/A 6 VOIES CONNECTEUR EMBASE R/A 7 VOIES KIT DEV ARRIA II GX 6G KIT DEV CYCLONE IV GX BIT SET 50MM IMPAKTOR 6PC BIT SET 25MM IMPAKTOR 10PC BIT SET 25MM IMPAKTOR 30PC LED EMBASE SOLDERLESS NO LATCH LS LED EMBASE SOLDERLESS LATCH LS TRANSISTOR NPNNPN 45V SOT-363 TRANS NPN 10K 50V 0.1A SC-75 TRANSISTOR NPN 45V 0.1A TO92 TRANSISTOR NPN 300V 0.5A TO92 TRANSISTOR PNP 300V 0.5A TO92 TRANSISTOR NPN 160V 0.6A TO92 TRANSISTOR NPN 45V 0.8A TO-92 TRANSISTOR NPN 300V 0.1A SOT-223 TRANSISTOR NPN 45V 0.1A SOT-23 TRANSISTOR NPN 45V 0.1A TO-92 TRANSISTOR NPN 30V 0.1A TO-92 TRANSISTOR NPN 45V 0.1A TO-92 TRANSISTOR PNP 60V 4A TO-225 TRANSISTOR NPN 80V 0.5A SOT-23 MOSFET NCANAL P 20V SOT-563 MOSFET CANAL N 30V 0.56A SOT-23 DIODE DE REDRESSEMENT 200V 1A DO-41 DIODE ZENER 5.6V 5W DO-41 DIODE ZENER 15V 0.5W SOD-123 DIODE ZENER 16V 0.5W SOD-123 DIODE ZENER 36V 0.225W SOT-23 DIODE ZENER 4.3V 3W SMB DIODE TVS 5V SOD-923 DIODE TVS 0.15W 7.8V SOD-923 RESEAU DE DIODE 30V 0.2A SOT323 RESEAU DE DIODE 40V 5A SMC INVERSEUR DOUBLE SCH TRIG 6SOT-363 BUFFER NON INV SCH TRIG 5SOT-353 BUFFER DOUBLE OPEN DRAIN 6SOT-363 INVERSEUR HEX SCHMITT TRIG 14TSSOP NPORTE ET SIMPLE 5SOT-23 BUFFER NON INVERTING SGL 5SOT-353 BUFFER CLOCK FANOUT 8SOIC PLL CLOCK MULTIPLIER 8SOIC BUFFER NON INVERTING SGL 5SOT-353 INVERSEUR SIMPLE 5SOT-23 EEPROM 256KBIT SPI 8DIP FICHE SEAL FIL CONTACT A SERTIR EMBASE 12-10AWG CONNECTEUR RECEPTACLE 23 37 EMBASE CONNECTEUR FICHE 23-37 VOIES HOUSING BULKHEAD METAL HOUSING FLANGE METAL TERMINAL BLOCK FUSED 22-12AWG 5X20MM, TERMINAL BLOCK FICHE 5POS 28-20AWG TERMINAL RING TONGUE 8MM CONTACT TERMINAL SLEEVE 2.65MM BLEU TERMINAL SLEEVE 1.47MM RED TERMINAL CONTACT FLAG 0.11IN TERMINAL CONTACT PIGGYBACK 6.35MM RED TERMINAL CONTACT CABLE SPLICE RED TERMINAL CONTACT FEMALE 0.25IN TERMINAL CONTACT 2.7MM CLAIR TERMINAL SPADE/FORK 4 CONTACT RED TERMINAL CONTACT RING 8MM JAUNE TERMINAL CONTACT FEMALE 9.53MM LOCKING LEVER HAN 10/16/24B RUBANR CODING BROCHE HAN CONNECTEUR HANDLE WITH HARDWARE SB50 SERIES CONN, HOUSING RECEPTACLE FASTON TERMINAL INSULATOR NYLON SERIES 250 LOCKING TABS,ACCESSORY TYPE:LOCKING TAB HOOD LATERAL ENTRY TAILLE 3A METAL RECEPTACLE PROTECTIVE CAP ALUMINUM ALLOY PROTECTIVE CAP ALUMINUM,SERIES:D3 PROTECTIVE CAP RECEPTACLE ALUMINUM TERMINAL BLOCK JUMPER 2 VOIES 5.1MM TERMINAL BLOCK MARKER EXTERNE PUISSANCE CONNECTEUR DC PUISSANCE 5A SERRE CABLE TAILLE 23 THERMOPLASTIQUE CONNECT CIRCUL TAILLE 11 ALUMINUM CONNECT CIRCUL TAILLE 13 ALUMINUM CONNECT CIRCUL TAILLE 17 ALUMINUM CONNECT CIRCUL TAILLE 11 ALUMINUM CONNECT CIRCUL TAILLE 15 ALUMINUM CONNECT CIRCUL TAILLE 23 ALUMINUM CONTACT A SERTIR EMBASE 16-14AWG CONTACT A SERTIR EMBASE 16AWG MI CONTACT A SERTIR EMBASE 30-26AWG CONTACT A SERTIR EMBASE 24-20AWG. CONTACT,CONNECTEUR TYPE:CONTACT CONTACT A SERTIR EMBASE 20-18AWG CONTACT A SERTIR BROCHE 22-18AWG CONTACT A SERTIR EMBASE 20-14AWG CONTACT A SERTIR EMBASE 26-22AWG FICHE CONNECTEUR HOUSING NOIR FICHE CONNECTEUR HOUSING AMP FICHE CONNECTEUR HOUSING MOLEX FICHE CONNECTEUR HOUSING NYLON FICHE CONNECTEUR HOUSING TE FICHE CONNECTEUR HOUSING NYLON FICHE CONNECTEUR HOUSING SERIE FICHE CONNECTEUR HOUSING SERIE FICHE CONNECTEUR HOUSING SERIE FICHE CONNECTEUR HOUSING NYLON CONNECTEUR FICHE & EMBASE HOUSING RECEPTACLE NYLON FICHE & EMBASE HOUSING FICHE NYLON,SERI FICHE & EMBASE HOUSING RCPT POLYESTER, FICHE & EMBASE CONNECTEUR FICHE 23POS, FICHE & EMBASE CONN EMBASE 2POS 4.2MM, FICHE & EMBASE CONNECT FICHE 1POS,SER FICHE & EMBASE CONNECT FICHE 1POS,SER FICHE & EMBASE CONN EMBASE 3POS 6.71MM FICHE & EMBASE CONNECT FICHE 1POS,SER FICHE & EMBASE CONNECT FICHE 2POS,SER FICHE & EMBASE CONNECT FICHE 2POS,SER FICHE & EMBASE CONNECT EMBASE 3POS 3MM FICHE & EMBASE CONNECT FICHE 2POS,SER FICHE & EMBASE CONNECT FICHE 1POS,SER FICHE & EMBASE CONNECT FICHE 1POS,SER FICHE & EMBASE CONNECT FICHE 1POS,SER FICHE & EMBASE CONNECT FICHE 1POS,SER DIODE,FAST,1.5A,200V,SMA CONTACT TOOL 20-32 AWG CONTACT TOOL 12-26 AWG LOCATOR POUR AFM8 CONTACT TOOL LOCATOR POUR AF8 CONTACT TOOL TWEEZERS BAMBOO 150MM TWEEZER SET ANTISTATIC INTERCHANG. SET FOUNT PUNCH ALESOIR AJUSTABLE 6.50 - 7.00MM ALESOIR AJUSTABLE 7.00 - 7.75MM ALESOIR AJUSTABLE 7.75 -8.50MM ALESOIR AJUSTABLE 8.50 - 9.25MM ALESOIR AJUSTABLE 9.25 - 10.00MM ALESOIR AJUSTABLE 10.00 - 10.75MM ALESOIR AJUSTABLE 10.75 - 11.75MM ALESOIR AJUSTABLE 11.75 - 12.75MM ALESOIR AJUSTABLE 12.75 - 13.75MM ALESOIR AJUSTABLE 13.75 - 15.25MM ALESOIR AJUSTABLE 15.25 - 17.00MM ALESOIR AJUSTABLE 17.00 - 19.00MM ALESOIR AJUSTABLE 19.00 - 21.00MM ALESOIR AJUSTABLE 21.00 - 23.00MM PICK-UP TOOL WITH INSPECTION MIRROR MICROSCOPE DE POCHE X75 MAG KIT MAG BASE CALIPER INDICATOR SET MICROMETER MECH 0-150MM SET MICROMETER MECH 0-6 MICROMETRE ANVIL 0-150MM / 6 HEAD MICROMETER 0.01MM/0-6.5MM HEAD MICROMETER 0.01MM/0-13MM HEAD MICROMETER 0.01MM/0-25MM INDICATOR LEVER DIAL TEST DUA-DIAL RULE CARREE END MAGNETIQUE 150MM RULE CARREE END MAGNETIQUE 300MM RULE CARREE END MAGNETIQUE 450MM RULE CARREE END MAGNETIQUE 600MM RULE CARREE END MAGNETIQUE 1000MM RULE MAGNETIQUE 150MM/6 RULE MAGNETIQUE 300MM/12 RULE MAGNETIQUE 600MM/24 LED ORANGE 5MM STANDARD LED ORANGE 3MM STANDARD KIT FEELER GAUGE BRASS SOLDER FIL CORDON FREE 0.38MM 250G MULTIMETER ANALOG 6 FUNCTIONS KIT CORDON DE TESTS HEAVY DUTY CORDON DE TEST 4MM 1M RED CONTACT RECEPTACLE TEST PCB SONDE DE TEST PCB BRAID DESOLDERING 2.5MM 0.25M CONVERTISSEUR DC/DC 30W AJUSTABLE SORTIE CONVERTISSEUR DC/DC 4.95W SIMPLE SORTIE CONVERTISSEUR DC/DC 7.5W SIMPLE SORTIE CONVERTISSEUR DC/DC 30W AJUSTABLE SORTIE CABLE 4 CORE CHROME 18AWG 30.5M CABLE 4 CORE NOIR 152.4M CABLE 2 CORE BLANC 26AWG 30.5M CABLE 2 PAIRES CHROME 24AWG 30.5M OSCILLOSCOPE 60MHZ 2 VOIES OSCILLOSCOPE 100MHZ 2 VOIES OSCILLOSCOPE 70MHZ 2 VOIES OSCILLOSCOPE 70MHZ 4 VOIES OSCILLOSCOPE 100MHZ 2 VOIES OSCILLOSCOPE 100MHZ 4 VOIES OSCILLOSCOPE 200MHZ 2 VOIES OSCILLOSCOPE 200MHZ 4 VOIES OSCILLOSCOPE 300MHZ 2 VOIES OSCILLOSCOPE 300MHZ 4 VOIES COFFRET120X103X53 VOIES MOUNT COFFRET120X103X53 VOIES MOUNT COFFRET160X103X53 VOIES MOUNT COFFRET220X103X53 VOIES MOUNT COFFRET220X103X53 VOIES MOUNT BOLTS POUR 1455NC SERIES NUTS POUR 1455NC SERIES NUTS & SPRINGS POUR 1455NC SERIES COFFRET119X94X30 JAUNE COFFRET145X121X35 PURPLE COFFRET145X121X35 JAUNE COFFRETOCTAGON PURPLE COFFRETOCTAGON JAUNE COFFRETNARRANGEE TRAPEZOID JAUNE COFFRETWIDE TRAPEZOID PURPLE COFFRETWIDE TRAPEZOID JAUNE ALIMENTATION AC/DC 24V 14.7A 350W ALIMENTATION AC/DC 48V 7.5A 350W ALIMENTATION AC/DC 24V 25A 750W ALIMENTATION AC/DC 48V 12.5A 750W KIT TESTER FIBER ONESHOT PRO TESTER FIBER ONESHOT PRO TESTEUR FIBER QUICKMAP KIT TESTER FIBER QUICKMAP KIT TESTER FIBER QUICKMAP CAPTEUR ROTATIF HALL 60DEG 5V CAPTEUR ROTATIF HALL 60DEG 10-30V CAPTEUR ROTATIF HALL 90DEG 5V CAPTEUR ROTATIF HALL 90DEG 10-30V CAPTEUR ROTATIF HALL 120DEG 10-30V CAPTEUR ROTATIF HALL 180DEG 5V CAPTEUR ROTATIF HALL 180DEG 10-30V CAPTEUR ROTATIF HALL 360DEG 5V CAPTEUR ROTATIF HALL 360DEG 10-30V MODULAR COUPLAR IN-LINE CAT5E RELAIS 3 PHASE 2C/O 160-300VAC RELAIS 3 PHASE 2C/O 300-500VAC RELAIS 3 PHASE 2C/O 380VSC RELAIS 3 PHASE 2C/O 400VSC RELAIS 3 PHASE 2C/O 160-300VAC RELAIS 3 PHASE 2C/O 300-500VAC RELAIS 3 PHASE 2C/O 160-300VAC RELAIS 3 PHASE 2C/O 300-500VAC RELAIS 3 PHASE 2C/O 90-170VSC RELAIS 3 PHASE 2C/O 180-280VAC RELAIS 3 PHASE 2C/O 180-280VAC RELAIS 3 PHASE 2C/O 350-580VAC RELAIS 3 PHASE 2C/O 450-720VAC RELAIS 3 PHASE 2C/O 530-820VAC RELAIS 3 PHASE 2C/O 200-500VAC RELAIS 1 PHASE 1C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 1C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 1C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 1C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 2C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 2C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 2C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 2C/O OVER/UNDER VOLTAGE RELAIS 1 PHASE 1C/O OVER/UNDER COURANT RELAIS 1 PHASE 1C/O OVER/UNDER COURANT RELAIS 1 PHASE 1C/O OVER/UNDER COURANT RELAIS 1 PHASE 1C/O OVER/UNDER COURANT RELAIS 1 PHASE 1C/O OVER/UNDER COURANT RELAIS 1 PHASE 1C/O OVER/UNDER COURANT RELAIS 1 PHASE 1C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT RELAIS 1 PHASE 2C/O OVER/UNDER COURANT TIME COMMUTATEUR NUMERIQUE ONE VOIES TIME COMMUTATEUR NUMERIQUE TWO VOIES FICHE UTL 4 VOIES BROCHE FICHE UTL 4 VOIES SKT RECEPTACLE PANEL UTL 4 VOIES BROCHE RECEPTACLE PANEL UTL 4 VOIES SKT RECEPTACLE JAM NUT UTL 4 VOIES BROCHE RECEPTACLE JAM NUT UTL 4 VOIES SKT RECEPTACLE INLINE UTL 4 VOIES BROCHE RECEPTACLE INLINE UTL 4 VOIES SKT CAPOT ANTI POUSS UTL RECEPTACLE INSTR-AMPLIFIER,15MHZ,90DB,SOIC-8 OP-AMP,16.3MHZ,25V/ us,LFCSP-8 MONITOR,VOLTAGE,6.5UA,5.5V,TSOT-6 LED DRIVER,PWM,1MHZ,LFCSP-14 DC-DC REGULATOR,BUCK,5A,LFCSP-32 DAC,16BIT,LFCSP-10 DAC,16BIT,LFCSP-10 DAC,16BIT,LFCSP-8 DAC,10BIT,LFCSP-6 DAC,10BIT,LFCSP-6 DAC,10BIT,SC70-6 IC,DAC,12BIT,1.7MSPS,LFCSP-6 DAC,14BIT,LFCSP-6 DAC,14BIT,SC70-6 DAC,QUAD,16BIT,LFCSP-64 AMPLIFIER,CLASS G,50mW,WLCSP-16 PCB CONTACT,PIN,SOLDER PCB CONTACT,PIN,SOLDER PCB CONTACT,PIN,SOLDER PCB CONTACT,PIN,SOLDER PCB CONTACT,PIN,SOLDER PCB CONTACT,PIN,SOLDER PCB CONTACT,PIN,SOLDER PCB CONTACT,PIN,SOLDER CONDENSATEUR 120UF 250V 20% 18X20MM CONDENSATEUR 200UF 200V 20% 35X40MM CONDENSATEUR 800UF 250V 20% 35X50MM CONDENSATEUR 68UF 100V 20% 8X20MM CONDENSATEUR 680UF 100V 20% 18X35.5MM CONDENSATEUR 390UF 25V 20% 10X12.5MM CONDENSATEUR 0.1F 3.5V CONDENSATEUR 0.1F 3.5V CMS CONDENSATEUR 50000UF 3.5V CONDENSATEUR 50000UF 3.5V CMS CONDENSATEUR 0.24F 4.2V CONDENSATEUR 0.24F 4.2V CMS CONNECTOR,AC OUTLET,DUPLEX,RCPT,15A,120V OPTOC. 6MM 24/5-24V 100MA 2L. 10KH ´REF DE TENS SERIES 5V 0.005V 8SOIC CONVERTISSUER N-A 10BIT 50MHZ 48LQFP CAPTEUR TEMP 10BIT +/-2DEG 8MSOP AMP TRANSIMPEDANCE 240MHZ 8SOIC AMPLI OP 125MHZ 62V/US 8SOT23 AMPLI OP 10MHZ 4V/US 8MSOP CAN 14 BITS 8CH MUX 250KSPS 20LFCSP ISOLATEUR QUADRUPLE 100NS 16WSOIC CAN 16 BITS 6CH MUX 200KSPS 64QFP V REG 37VIN 0.5A AJUSTABLE 3DPAK REGULATEUR LDO 37VIN 0.1A 5V 3DPAK AMPLI OP 44VIN 4.5MHZ 13V/US 8SOIC REGUL LDO 20VIN 0.8A AJUSTABLE 8SOIC AMPLI OP 32VIN 1MHZ 0.6V/US 8SOIC AMPLI OP 32VIN 1MHZ 0.6V/US 8SOIC BUCK 37VIN 1A 5V 5TO220 CTRL MOTEUR 3PHASE 30V 20WSOIC REGULATEUR LDO 9VIN 3A AJUSTABLE 5DPAK V REG 37VIN 0.5A AJUSTABLE 3DPAK REGULATEUR LDO 0.1A 5V 0.5% 3DPAK REGULATEUR LDO 35VIN 1A 12V 3D2PAK REGULATEUR LDO 35VIN 1A 12V 3D2PAK AMPLI OP DOUBLE 10MHZ 9V/US 16SOIC CONTROLEUR PWM MODE COURANT 500KHZ 8SOIC REGULATEUR LDO -35VIN 1A -15V 3TO220 REGULATEUR LDO 35VIN 1A 5V 3D2PAK REGULATEUR LDO 35VIN 1A 9V 3D2PAK CAPTEUR DE PRESSION 20 TO 304KPA SSOP8 MOTEUR DRIVER HALF BRIDGE 5A QFN32 REG LINEAIR 1.2V TO 37V AJUSTABLE 3TO92 BUCK DOUBLE 0.6A 1.5MHZ 10MSOP BUCK 4.5A 500KHZ 7DPAK AMPLI OP 90MHZ 22V/US 8SOIC REGULATEUR LDO 0.5A 1.5V 8SOIC REGULATEUR LDO 0.9-10VIN 0.5A 1.2V 16DFN DAC 16 BITS 5.5VIN 50MHZ 10MSOP BUCK 0.3A 1.8V 1.5MHZ 6TSOT23 BUCK 36VIN 0.6A 500KHZ 6SOT23 COMPARATEUR 5V 10NS 8SOIC LDO VREF 2.5V 0.15% 8SOIC CHARGEUR BATTERIE LI-ION 1.5A 8SOIC HOT SWAP BUS BUFFER 400KHZ 8MSOP REGULATEUR LDO 1.8V 0.3A 8MSOP BUCK DOUBLE 36VIN 1.4A 16TSSOP LIMITEUR DE PUISSE -60V TO 100V 16SOIC BUCK 45VIN 0.05A 3.3V 8MSOP BUCK DOUBLE 36VIN 0.7A 14DFN BUCK DOUBLE 36VIN 0.7A 16MSOP AMPLI OP E/S RAIL 5.25V 180MHZ 6TSOT23 AMPLI OP E/S RAIL 5.25V 180MHZ 6TSOT23 BOOST DOUBLE 38VIN AJUSTABLE 32QFN REGUL LDO 0.6V TO 44.5V AJUSTABLE 12MSOP BUCK 40V 200KHZ-2.2MHZ 0.35A 10DFN CAPTEUR TEMP -40 TO 100 DEG 8SOIC BUCK 42VIN 550KHZ 0.6A 6TSOT CNTRL HOT SWAP 17VIN PROG 10MSOP AMPLI OP 35VIN 2A 8V/US 5TO263 IC,LINEAR VOLT REGULATOR 3.3V SOT-223-4 CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE CONDENSATEUR ALUMINIUM ELECTROLYTIQUE EMBASE MILLI-GRID 2MM 14 VOIES CONTACT SKT MINI-FIT 4.2MM 22-28 AWG CONTACT SKT MF PLUS HMC 22-24 AWG ANALOGUE SWITCH,QUAD,SPST,TSSOP-16 ANALOGUE SWITCH,QUAD,SPST,LFCSP-16 IC,ANALOG SWITCH,QUAD,SPST,TSSOP-16 IC,ANALOG SWITCH,TRIPLE,SPDT,LFCSP-16 IC,ANALOG SWITCH,TRIPLE,SPDT,TSSOP-16 ANALOGUE SWITCH,QUAD,SPDT,TSSOP-20 ANALOGUE SWITCH,DUAL,SPDT,LFCSP-16 JACK POST ASSEMBLY,#4-40,14.1MM MPU 32 BITS MOBILEGT 324TEPBGA MICRO 32 BITS QORIVVA 176LQFP MICRO 32 BITS QORIVVA 324 TEPBGA MICRO 32 BITS QORIVVA 257MAPBGA MICRO 32 BITS QORIVVA 144LQFP MICRO 32 BITS QORIVVA 100LQFP MICRO 32 BITS QORIVVA 176LQFP MICRO 16 BITS S12G 48LQFP MICRO 16 BITS S12G 32LQFP MICRO 16 BITS S12P 48QFNEP MICRO 16 BITS S12G 64LQFP MICRO 16 BITS S12XE 144LQFP MICROCONTROLEUR 8 BITS S08AW 44LQFP PINCE A SERTIR DEV KIT SITARA AM3359 ARM CORTEX-A8 MODULE D´EVALUATION KIT AM335X BILATERAL SWITCH,9V,1A,TO-92,AMMO PACK RFI POWER LINE FILTER INDUCTANCE 0402 0.3NH +/-0.1NH INDUCTANCE 0402 0.4NH +/-0.1NH INDUCTANCE 0402 0.5NH +/-0.1NH INDUCTANCE 0402 1.1NH +/-0.1NH INDUCTANCE 0402 1.2NH +/-0.1NH INDUCTANCE 0402 1.3NH +/-0.1NH INDUCTANCE 0402 1.6NH +/-0.1NH INDUCTANCE 0402 1.7NH +/-0.1NH INDUCTANCE 0402 1.9NH +/-0.1NH INDUCTANCE 0402 2.3NH +/-0.1NH INDUCTANCE 0402 2.4NH +/-0.1NH INDUCTANCE 0402 2.5NH +/-0.1NH INDUCTANCE 0402 2.6NH +/-0.1NH INDUCTANCE 0402 2.8NH +/-0.1NH INDUCTANCE 0402 2.9NH +/-0.1NH INDUCTANCE 0402 3.0NH +/-0.1NH INDUCTANCE 0402 3.1NH +/-0.1NH INDUCTANCE 0402 3.2NH +/-0.1NH INDUCTANCE 0402 3.4NH +/-0.1NH INDUCTANCE 0402 3.5NH +/-0.1NH INDUCTANCE 0402 3.6NH +/-0.1NH INDUCTANCE 0402 3.7NH +/-0.1NH INDUCTANCE 0402 3.8NH +/-0.1NH INDUCTANCE 0402 5.4NH +/-0.1NH INDUCTANCE 0402 5.9NH +/-0.1NH INDUCTANCE 0402 6.5NH +/-0.1NH INDUCTANCE 0402 8.0NH +/-0.1NH INDUCTANCE 0402 8.1NH +/-0.1NH INDUCTANCE 0402 9.1NH +/-0.1NH INDUCTANCE 0402 10.8NH +/-1% INDUCTANCE 0402 13.8NH +/-1% INDUCTANCE 0402 17.0NH +/-1% INDUCTANCE 0402 27.0NH +/-1% INDUCTANCE FORT COURANT 0201 0.1NH INDUCTANCE FORT COURANT 0201 0.2NH INDUCTANCE FORT COURANT 0201 0.3NH INDUCTANCE FORT COURANT 0201 0.4NH INDUCTANCE FORT COURANT 0201 0.5NH INDUCTANCE FORT COURANT 0201 0.6NH INDUCTANCE FORT COURANT 0201 0.7NH INDUCTANCE FORT COURANT 0201 0.8NH INDUCTANCE FORT COURANT 0201 0.9NH INDUCTANCE FORT COURANT 0201 1.1NH INDUCTANCE FORT COURANT 0201 1.2NH INDUCTANCE FORT COURANT 0201 1.3NH INDUCTANCE FORT COURANT 0201 1.4NH INDUCTANCE FORT COURANT 0201 1.5NH INDUCTANCE FORT COURANT 0201 1.6NH INDUCTANCE FORT COURANT 0201 1.7NH INDUCTANCE FORT COURANT 0201 1.9NH INDUCTANCE FORT COURANT 0201 2.0NH INDUCTANCE FORT COURANT 0201 2.1NH INDUCTANCE FORT COURANT 0201 2.2NH INDUCTANCE FORT COURANT 0201 2.3NH INDUCTANCE FORT COURANT 0201 2.4NH INDUCTANCE FORT COURANT 0201 2.5NH INDUCTANCE FORT COURANT 0201 2.6NH INDUCTANCE FORT COURANT 0201 2.7NH INDUCTANCE FORT COURANT 0201 2.8NH INDUCTANCE FORT COURANT 0201 2.9NH INDUCTANCE FORT COURANT 0201 3.0NH INDUCTANCE FORT COURANT 0201 3.1NH INDUCTANCE FORT COURANT 0201 3.2NH INDUCTANCE FORT COURANT 0201 3.3NH INDUCTANCE FORT COURANT 0201 3.4NH INDUCTANCE FORT COURANT 0201 3.5NH INDUCTANCE FORT COURANT 0201 3.6NH INDUCTANCE FORT COURANT 0201 3.7NH INDUCTANCE FORT COURANT 0201 3.8NH INDUCTANCE FORT COURANT 0201 3.9NH INDUCTANCE FORT COURANT 0201 4.0NH PLUG AND SOCKET CONNECTOR HOUSING N CHANNEL MOSFET,800V,1.8mA INDUCTANCE FORT COURANT 0201 1.0NH THERMISTANCE 220 OHM +/-1% L15 THERMISTANCE 3.9 KOHM +/-1% L15 THERMISTANCE 5 KOHM +/-1% L15 BOITIER ABS ALUMINIUM/ABS SILVER BOITIER ABS ALUMINIUM/ABS NOIR BOITIER WHEELED WITH FOAM BOITIER ETANCHE 270X250X125 BOITE A OUTILS 18 BOITE A OUTILS 21 SET TOOL BOITE COFFRET 320X260X50MM COFFRET 380X310X60MM COFFRET 480X380X80MM COFFRET 175X140X30MM COFFRET 240X195X55MM COFFRET 340X250X60MM COFFRET 415X330X55MM BOITIER COFFRET SET OF 4 SET DRILL BIT 18PC MEULEUSE D´ANGLE DIAM 115MM 600W UK DRILL HAMMER 650W K/LESS UK SET MASONARY DRILL 400M 3PC CAMERA INSPECTION KIT TOOL 61PC KIT AND BOITE A OUTILS 48PC SOCKET POUR H3YN TIMERS SMA JACK 50OHM BULKHEAD CUTTER/MULTITOOL 220W UK FICHE SET MULTITOOL ACCESSORY DRIVER DRILL 12V LI-ION BAT UK CUTTER/MULTITOOL 12V UK FICHE DRIVER IMPACT 12V UK FICHE BATTERIE 12V DRIVER DRILL 18V 1XBATT UK DRILL COMBI 18V 2XBATT UK SPARE BATTERIE 1300MA 18V DRILL SDS 550W SET TOOL 21PC SET TOOL 5PC SET TOOL . 129PC SET ROTATIF TOOL UK 217PC SET ROTATIF ACCESS 208PC NIVEAU SPIRIT 24 NIVEAU SPIRIT 48 SET SCREWDRIVER LONG 3PC SET SECURITY TORX 7PC SET SECURITY TORX 11PC SET SCREWDRIVER POUND THRU SCREWDRIVER PRECISION SLOT 2.5MM SCREWDRIVER PRECISION SLOT 3MM SCREWDRIVER PRECISION PH0 SCREWDRIVER PRECISION HEX 1.5MM SCREWDRIVER PRECISION HEX 2.0MM SCREWDRIVER PRECISION HEX .5MM SET SCREWDRIVER PRECISION TORX SET SCREWDRIVER PRECISION HEX SET SCREWDRIVER MOBILE PHONE SET SCREWDRIVER GAMING CONSOLE SET SCREWDRIVER RATCHET 11PC SET BIT 6PC SET BIT 25MM 20PC SET BIT 50MM MIXED 10PC SET BIT 50MM PZ2 10PC SET BIT 25MM PZ2 20PC HEX KEY BALL POINT 13MM CONTAINER POUR CORP PS CON-P26/16 CONTAINER POUR CORP PS CON-P30/19 CONTAINER POUR CORP PS CON-P36/22 CONTAINER POUR CORP PS CON-P42/29 FERRITE CPH-EFD20-1S-10PD-Z FERRITE E14/3.5/5/R-3F4-A100-P FERRITE CORP E E55/28/25-3C90 FERRITE CORP E E65/32/27-3C90 FERRITE CORP E E71/33/32-3C92 FERRITE CORP E E80/38/20-3C90 FERRITE CORP E E80/38/20-3C91 FERRITE CORP E E80/38/20-3F3 FERRITE EFD20/10/7-3C94-A160 FERRITE ECORP P EP20-3F3 FERRITE I100/25/25-3C94 FERRITE CORP P SET P14/8-3C81 FERRITE CORP P SET P14/8-3H1 FERRITE CORP P SET P18/11-3C81 FERRITE CORP P SET P18/11-3H1 FERRITE CORP P SET P36/22-3B7 FERRITE CORP P SET P36/22-3C81 FERRITE P36/22-3H1-A1000/N FERRITE CORP P SET P42/29-3C81 FERRITE CORP P SET P42/29-3C90 FERRITE CORP P SET P9/5-3D3-E63 FERRITE PM CORE SET PM114/93-3C90 FERRITE PM CORE SET PM114/93-3C94 FERRITE PM CORE SET PM74/59-3C94 FERRITE RM CORE SET RM5-3B7-A160/N FERRITE ROD CORE ROD1.8/15-3C90 FERRITE T102/66/15-3C11 FERRITE T102/66/15-3C90 FERRITE T102/66/15-3E25 FERRITE T102/66/25-3C90 FERRITE T107/65/25-3F3 FERRITE T140/106/25-3E25 FERRITE TGP-P14/8-C FERRITE TGP-P18/11-C FERRITE TGP-P36/22-C FERRITE TN14/9/5-3C90 FERRITE TX102/66/25-3C11 FERRITE TX36/23/15-3F3 FERRITE TX51/32/19-3C81 FERRITE TX51/32/19-3C90 FERRITE TX58/41/18-3C11 FERRITE U100/57/25-3C94 FERRITE U CORE HALF U100/57/25-3E6 FERRITE U CORE HALF U93/76/30-3C85 FERRITE U CORE HALF U93/76/30-3C90 FERRITE UR48/39/17-3C30 FERRITE UR55/38/36-3C90 FERRITE UR59/36/17-3C94 FERRITE UR64/40/20-3C80 FERRITE UR64/40/20-3C90 FERRITE UR64/40/20-3C93 FERRITE UR64/40/20-3F3 FERRITE UR64/46/20-3C90 FERRITE UR70/33/17-3C90 FERRITE E18/4/10-3C95 FERRITE E42/33/20-3C95 FERRITE E43/10/28-3C95 FERRITE E56/24/19-3C95 FERRITE EQ20/R-3C95 FERRITE ER32/6/25-3C95 FERRITE I93/28/16-3C95 FERRITE PLT18/10/2-3C95 FERRITE PLT20/14/2/S-3C95 FERRITE PLT43/28/4.1-3C95 FERRITE PQ50/50-3C95 FERRITE PTS30/19/I-3C95 MAX PWR POINT TRACKING 48LQFP MICRO 32 BITS ARM CORTEX-M3 48LQFP MICRO 32 BITS ARM CORTEX-M3 48LQFP MICRO 32 BITS ARM CORTEX-M3 32HVQFN MICRO 32 BITS ARM CORTEX-M3 48LQFP MICRO 32 BITS ARM CORTEX-M3 64LQFP MICRO 32 BITS ARM CORTEX-M3 48LQFP MICRO 32 BITS ARM CORTEX-M3 32HVQFN MICRO 32 BITS ARM CORTEX-M3 48LQFP MICRO 32 BITS ARM CORTEX-M3 32HVQFN MICRO 32 BITS ARM CORTEX-M3 32HVQFN CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE16 24 VOIES SKT (L/C) CONTROL RELAIS SMARTFIL-DT CONTROL RELAIS SMARTFIL 4 ENTREE GATE VOIES SMARTFIL-DT TO DP GATE VOIES SMARTFIL-DT TO CAN GATE VOIES SMARTFIL-DT TO ETHERNET PUISSANCE FEEDER MODULE PUISSANCE FEEDER MODULE. SMARTFIL-DT SLAVES I/O SIGNALS SMARTFIL-DT SLAVES I/O SIGNALS SMARTFIL-DT SLAVES I/O SIGNALS SMARTFIL-DT SLAVES I/O SIGNALS SMARTFIL-DT SLAVES I/O SIGNALS SMARTFIL-DT SLAVES I/O SIGNALS SMARTFIL-DT SLAVES I/O SIGNALS SMARTFIL-DT SLAVES I/O SIGNALS CONTACT INVERSEUR 1 FRONT FIXING CONTACT INVERSEUR 2 FRONT FIXING CONTACT INVERSEUR 1 BLANC LED FNT CONTACT INVERSEUR 1 BLEU LED FNT CONTACT INVERSEUR 1 VERT LED FNT CONTACT INVERSEUR 1 ROUGE LED FNT CONTACT INVERSEUR 2 BLANC LED FNT CONTACT INVERSEUR 2 BLEU LED FNT CONTACT INVERSEUR 2 VERT LED FRT CONTACT INVERSEUR 2 ROUGE LED FNT SWD BLANC LED FRONT FIXING SWD BLEU LED FRONT FIXING SWD VERT LED FRONT FIXING SWD ROUGE LED FRONT FIXING ADAPTATEUR FIXING SWD CONTACT INVERSEUR 1 BASE FIXING CONTACT INVERSEUR 2 BASE FIXING CONTACT INVERSEUR 1 BLANC LED BASE CONTACT INVERSEUR 1 BLEU LED BASE CONTACT INVERSEUR 1 VERT LED BASE CONTACT INVERSEUR 1 ROUGE LED BASE CONTACT INVERSEUR 2 BLANC LED BASE CONTACT INVERSEUR 2 BLEU LED BASE CONTACT INVERSEUR 2 VERT LED BASE CONTACT INVERSEUR 2 ROUGE LED BASE SWD BLANC LED BASE FIXING SWD BLEU LED BASE FIXING SWD VERT LED BASE FIXING SWD ROUGE LED BASE FIXING PCB COFFRET1 MOUNT LOCATION PCB COFFRET2 MOUNT LOCATION PCB COFFRET3 MOUNT LOCATION PCB COFFRET4 MOUNT LOCATION PCB COFFRET6 MOUNT LOCATION CABLE EN NAPPE 3M CABLE EN NAPPE 5M CABLE EN NAPPE 10M FICHE CONNECT SMARTFIL-DT SLAVE BLADE RERMINAL RIBON CABLE PUISSANCE LINK SWD4-8MF2 DEVICE TERMINATOR NETWORK SMARTFIL-DT ADAPTATEUR CABLE EN NAPPE CABINET ENTRY RIBBON TO CABLE CABINET ENTRY RIBBON TO CABLE. EMBASE 8 POLE M22-I HOUSING FICHE 8 POLE M22-I HOUSING MODULE SMARTFIL POUR CONTACTEUR MODULE SMARTFIL POUR CONTACTEUR. MODULE SMARTFIL POUR MOTEURS MODULE SMARTFIL POUR PQT E12 32 65 RTCC I2C 1K EE 64B SRAM 8SOIC MICROCONTROLEUR 8 BITS 128KB FLASH 64QFN MICROCONTROLEUR 8 BIT 128KB FLASH 64TQFP MICROCONTROLEUR 8 BIT 128KB FLASH 80TQFP CONTACT,MALE,30-24AWG,CRIMP DETECTEUR POSITION PNEUMATIC RELAIS PUISSANCE SPNO 12V LATERAL MOUNT RELAIS REED DPST-NO 5V RELAIS SAFETY SLIM 3PST-NO/SPST-NC RELAIS AUTOMOTIVE SPDT 24VDC 30A RELAIS AUTOMOTIVE SPDT 12VDC 30A RELAIS AUTOMOTIVE SPST-NO 12VDC 80A CAPACITOR PP FILM,1000PF,2000V,5%,AXIAL RELAIS PUISSANCE SPST-NO 18VDC 16A RELAIS PUISSANCE 5VDC 8A DPST PCB RELAIS PUISSANCE SPDT-1NO/1NC 12VDC 15A RELAIS PUISSANCE 12VDC 8A DPST-NO RELAIS PUISSANCE DPDT 24VDC 3A FICHE IN RELAIS 2CO 24VDC FICHE IN RELAIS PUISSANCE DPST-NO 24VDC 30A DIN RELAIS PUISSANCE DPST-NO 5VDC 5A RELAIS PUISSANCE DPDT 24VDC 16A FICHE IN RELAIS PUISSANCE DPDT-2CO 12VAC 8A RELAIS INTERFACE 1CO 24V RELAIS SIGNAL DPDT 24VDC 1A RELAIS SIGNAL DPDT 5VDC 1A RELAIS SIGNAL SPDT-1NO/1NC 24VDC 1A RELAIS SIGNAL DPDT 5VDC 2A CMS RELAIS SIGNAL DPDT 26.5VDC 2A THT RELAIS SIGNAL DPDT 12VDC 5A CMS COMMUTATEUR FOOT SPDT (ON) 10A 250V COMMUTATEUR FOOT SPDT (ON) 20A 250V MICROCOMMUTATEUR PLONGEUR SPDT 10A DOOR COMMUTATEUR PLONGEUR 1NO 16A 400V DOOR COMMUTATEUR PLONGEUR 1NO 16.5A 250V COMMUT BOUTON POUSSOIR SPDT 10A 250V COMMUTATEUR JUMPER SPDT 1A 100V THD,CON COMMUTATEUR TACTILE SPST 0.05A CMS COMMUTATEUR TACTILE SPST 0.05A CMS COMMUTATEUR TACTILE SPST 0.05A SSR OPTO MOSFET 250V 0.17A SSR MOSFET SPST-NO 50MA 350V SOLID STATE RELAIS 350V 0.12A SSR MOSFET 200V 0.14A SSR MOSFET PHOTO 200V 1A DRESS NUTS POUR U480 SEALING BOOT COMMUTATEUR OPERATOR KEY SELECTOR SHROUD E-STOP POUR IDEC HW SERIES CAPTEUR MAGNETIQUE 20.32MM CAPTEUR HUMIDITY 3% 4-5.8V SHROUD E-STOP POUR IDEC HW SERIES KNIFE FOLDING UTILITY WITH 10 BLADES KNIFE FOLDING UTILITY 20 PC BLADE STANDARD TRAPEZE PQT 10 CHUCK KEYLESS 13MM 1/2 RELAY,SPST-NO,12VDC,30A,PCB CABLE TIE,FLUOROPOLYMER,7 FIXING ELEMENT,HAN D AV TERMINAL BLOCK LABEL,SELF LAM,1´´W X 1´´H,2500/ROLL,WHT CLOSURE PLATE,CABLE & WIRE MANAGEMENT COUNTER,ELECTRIC,6DIGIT,24VDC TERMINAL BLOCK,DIN RAIL,2POS,26-12AWG BUSBAR,1M BUSBAR,1POS,TERMINAL BLOCK FERRULE,CRIMP,24-10AWG SWITCH,TOGGLE,SPST,5A,250VAC SSR,PANEL MOUNT,32VDC,55A,265VAC SWITCH,DIGITAL,PUSHWHEEL,BCD SWITCH,FOOT,SPDT,5A,600VAC SNAGLESS COVER,RJ45 PLUG,POLYPROPYLENE CONTACT,PIN,24-20AWG,CRIMP CONTACT,SOCKET,24-20AWG,CRIMP LED PANEL MOUNT CABLE ASSEMBLY,24´´ SWITCH,PUSHBUTTON,SPST,3A,120V LEAD SET,INSULATED,MULTICOLOUR,17.72IN ALLIGATOR CLIP,STEEL,0.31IN,10A CONTACT,PIN,22-18AWG,CRIMP CONNECTOR,CONDUIT FITTING,1/2 DIODE,RECTIFIER,6A,200V,DO-4 HEAT SHRINK BOOT,SIDE TRANS,43MM ID,PO,BLACK TRANSISTOR,NPN & PNP,120V,4A,TO-220 HEAT SINK,20.3°C/W,ALUM,TO3P,TO126,TO127 HEAT SINK COMPOUND,NON-SILICONE,1OZ,TUBE DIODE,ZENER,150V,5W,AXIAL THYRISTOR,4A,600V,TO-202-3 SCR THYRISTOR,20A,200V,DO-4 DIODE,FAST,DUAL,30A,600V,TO-247VAR LOGIC,MULTIVIBRATOR,250NS,DIP-16 INSTR-AMPLIFIER,120DB,TO-99 LUG TERMINAL STRIP,3POS,9.5MM VOLTAGE REGULATOR,ADJ,2.2A,TO-220-3 HEAT SHRINK TUBING,6.4MM ID,PO,BLK,50FT SWITCH,ROCKER. SPST,16A,250V SRAM 1MB 128KX8 5V 32SOJ SRAM 1MB 128KX8 5V 32SOJ SRAM 1MB 128KX8 5V 32SOJ SRAM 1MB 128KX8 3.3V 32SOJ SRAM 1MB 64KX16 5V 44SOJ SRAM 1MB 64KX16 3.3V 44SOJ SRAM 4MB 256KX16 3.3V 48BGA SRAM 8M-BIT 1MX8 3.3V 44TSOPII SRAM 8MB 1MX8 3.3V 48BGA SRAM 8MB 512KX16 3.3V 44TSOPII SRAM 8MB 512KX16 3.3V 48BGA SRAM 4MB 512KX8 3-5V 48BGA SRAM 4MB 256KX16 3-5V 48BGA ALUMINUM ELECTROLYTIC CAPACITOR,3300UF,10V ZD 12V 1/2W 33C7898 OPTOCOUPLERS MOSFET,N CH,60V,1.2OHM,200mA,TO-92-3 CERAMIC CAPACITOR,500PF,1000V,Y5P,DISC CERAMIC CAPACITOR,1000PF,1000V,Y5P,DISC CERAMIC CAPACITOR,3000PF,1000V,Z5V,DISC CERAMIC CAPACITOR,0.01UF,1000V,Z5U,DISC DIODE,ZENER,120V,0.5W,DO-35 TERMINAL,RING TONGUE,STUD 10,16-14AWG,CRIMP CIRCUIT BREAKER,HYDROMAGNETIC,35A CIRCUIT BREAKER,HYDROMAGNETIC,20A CABLE TIE,NYLON 6.6,4 DIODE,STANDARD,1A,400V,DO-213AB R-400 PRV 3A 48T0718 SOFTWARE,LABELING,LABELMARK 5 PRO,CD-ROM CIRCUIT BREAKER,1POLE,32A POTENTIOMETER,LINEAR,5KOHM,2W,10% TERMINAL BLOCK,PLUGGABLE,30POS,28-18AWG DUCT COVER,PVC,4´´W X 6´L,BLUE TERMINAL BLOCK,FUSE,2POS,22-8AWG,5 X 20MM TERMINAL BLOCK MARKER,BLANK,8MM HEAT SHRINK TUBING,0.005MM ID,PO,BLK,100FT TERMINAL BLOCK MARKER,BLANK,5MM KIT D´EVAL HITEX LPC4300 CORTEX M4 KIT D´EVAL LPCXPRESSO LPC1115 KIT D´EVAL ARM NGX LPC11U24 DEV CARTE NGX DALI KIT D´EVAL LPC12D27 QUICK START CARTE KIT D´EVAL LPC11D QUICK START CARTE KIT D´EVAL IAR LPC11U2X KIT D´EVAL NGX IAR LPC11U1X CARTE DE BASE NGX LPCXPRESSO KIT D´EVAL LPCXPRESSO LPC11C2X KIT D´EVAL KEIL M KIT D´EVAL MOTEUR CONTROL LPCXPRESSO KIT D´EVAL LPCXPRESSO LPC122X KIT D´EVAL KEIL LPC11C1X KIT D´EVAL KEIL LPC1114 KIT D´EVAL KEIL M KIT D´EVAL LPCXPRESSO BASECARTE KIT D´EVAL TOUCH LCD LPC1768 REV 1X KIT D´EVAL KEIL M KIT D´EVAL KEIL M KIT D´EVAL KEIL M FERRULE,CRIMP,24-10AWG,BLACK TERMINAL,RING TONGUE,STUD 8,RED,CRIMP CRIMP TERMINAL,RING TONGUE,STUD 2,YEL THERMISTOR ADJUSTABLE CHAIR ARMRESTS CHAIR CASTERS CABLE TIE,ID PAD,NYLON 6.6,4´´L,NATURAL,18LBS LOCKNUT,NYLON,M25,GRY TRANSISTOR,PNP,1A,TO-1 IC,8BIT MCU,PIC16LF,32MHz,QFN-28 IC,8BIT MCU,PIC16LF,32MHz,UQFN-28 IC,8BIT MCU,PIC16LF,32MHz,SOIC-28 IC,8BIT MCU,PIC16LF,32MHz,DIP-28 IC,8BIT MCU,PIC16LF,32MHz,SSOP-28 THERMOCOUPLE IC,8BIT MCU,PIC16LF,32MHz,UQFN-28 IC,8BIT MCU,PIC16LF,32MHz,DIP-28 IC,8BIT MCU,PIC16LF,32MHz,SSOP-28 CABLE TESTER,MEGOHMMETER,DIGITAL,20GO MOSFET CANAL N 30V 32A D2PAK MOSFET CANAL N 30V 32A I2PAK MOSFET CANAL N 55V 228A D2PAK THERMOCOUPLE MOSFET CANAL N 75V 181A D2PAK SHLD MULTICOND CABLE,4COND,28/20AWG,100FT,30V PATCH CABLE,CAT6,RJ45,7FT,BLACK ALIMENTATION RAIL DIN 135W 24V 5A ALIMENTATION RAIL DIN 269W 24V 10A ALIMENTATION RAIL DIN 538W 24V 20A ALIMENTATION RAIL DIN 18W 24V 0.75A ALIMENTATION RAIL DIN 30W 48V 0.625A ALIMENTATION RAIL DIN 30W 24V 1.25A ALIMENTATION RAIL DIN 60W 48V 1.25A ALIMENTATION RAIL DIN 30W 12V 2.5A ALIMENTATION RAIL DIN 240W 48V 5A ALIMENTATION RAIL DIN 480W 48V 10A ALIMENTATION RAIL DIN 480W 24V 20A UNITE DE REDONDANCE 2.5A DOUBLE ENTREE UNITE DE REDONDANCE 20A DOUBLE ENTREE MODULE CONTROL MODULE MESSAGING D SUB SHIELDED BACKSHELL,DA,ABS D SUB SHIELDED BACKSHELL,DA,ABS D SUB SHIELDED BACKSHELL,DB,ABS D SUB SHIELDED BACKSHELL,DB,ABS D SUB SHIELDED BACKSHELL,DE,ABS D SUB SHIELDED BACKSHELL,DE,ABS D SUB SHIELDED BACKSHELL,DC,ABS D SUB SHIELDED BACKSHELL,DC,ABS TERMINAL,COMPRESSION LUG,3/8 DIODE,ZENER,20V,5W,AXIAL TRANSISTOR,PNP,120V,4A,TO-220 UNSEALED OI-PB SWITCH... NC/NR : 97B1262 DUCT COVER,PVC,3´´W X 6´L,BLUE NARROW SLOT WIRING DUCT,TYPE F,PVC,3.12´´ LED 3MM BLEU 50MCD 466NM LED 0.8X1.6MM ORANGE 80MCD 606NM LED 0.8X1.6MM JAUNE 80MCD 595NM PHOTODIODE 65DEG 540NM CMS TRANSCEIVER IR 4MBPS 1M TRANSCEIVER IR 4MBPS 1M SSD SATA 8GB 2.5´´´´ IND X-200 I2C BUS EXTENDER 8SOIC HOUSING BULKHEAD METAL HEX KEY BALL POINT 8MM SSD MSATA 8GB IND X-200M NTC THERMISTOR SSD SATA SLIM 4GB IND X-200M SSD SATA SLIM 8GB IND X-200M CARTE COMPACT FLASH 8GB IND C300 CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES SKT CONNECT CIRCUL TAILLE 20 39 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES BROCHE CONNECT CIRCUL TAILLE 22 39 V (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES SKT CONNECT CIRCUL TAILLE 22 39 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 8 2 VOIES BROCHE CONNECT CIRCUL TAILLE 8 2 VOIES (L/C) CONNECT CIRCUL TAILLE 8 2 V SKT (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES SKT CONNECT CIRCUL TAILLE 8 3 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 V (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT LAMP,INCANDESCENT,24V,2W CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 39 V (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES BROCHE CONNECT CIRCUL TAILLE 22 39 V (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES BROCHE CONNECT CIRCUL TAILLE 22 39 V (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES BROCHE CONNECT CIRCUL TAILLE 22 39 V (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES BROCHE CONNECT CIRCUL TAILLE 22 39 V (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES BROCHE CONNECT CIRCUL TAILLE 22 39 V SKT (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES SKT CONNECT CIRCUL TAILLE 22 39 V SKT (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES SKT CONNECT CIRCUL TAILLE 22 39 V SKT (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES SKT CONNECT CIRCUL TAILLE 22 39 V SKT (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES SKT LAMP,INCANDESCENT,130V,2.4W CONNECT CIRCUL TAILLE 22 39 V SKT (L/C) CONNECT CIRCUL TAILLE 22 39 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT Cable Tie Mount CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 V SKT (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 5 VOIES (L/C) CONNECT CIRCUL TAILLE10 5 VOIES BROCHE CONNECT CIRCUL TAILLE10 5 VOIES (L/C) CONNECT CIRCUL TAILLE10 5 VOIES BROCHE CONNECT CIRCUL TAILLE10 5 VOIES (L/C) CONNECT CIRCUL TAILLE10 5 VOIES BROCHE CONNECT CIRCUL TAILLE10 5 VOIES (L/C) CONNECT CIRCUL TAILLE10 5 VOIES BROCHE CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 5 V SKT (L/C) CONNECT CIRCUL TAILLE10 5 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES (L/C) CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 V SKT (L/C) CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE10 20 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE10 20 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 VOIES (L/C) CONNECT CIRCUL TAILLE22 39 VOIES BROCHE CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 39 V SKT (L/C) CONNECT CIRCUL TAILLE22 39 VOIES SKT CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE8 3 V BROCHE (L/C) CONNECT CIRCUL TAILLE8 3 VOIES BROCHE CONNECT CIRCUL TAILLE8 3 VOIES SKT (L/C) CONNECT CIRCUL TAILLE8 3 VOIES SKT CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 VOIES (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 3 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES (L/C) CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 VOIES BROCHE CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 V SKT (L/C) CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 4 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES (L/C) CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 VOIES BROCHE CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 V SKT (L/C) CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE14 7 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT EMBASE CI QIKMATE 36P CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES (L/C) CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 VOIES BROCHE CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 V SKT (L/C) CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 10 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE16 24 V SKT (L/C) CONNECT CIRCUL TAILLE16 24 VOIES SKT CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES (L/C) CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 8 VOIES BROCHE CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 VOIES (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 11 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES (L/C) CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 VOIES BROCHE CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 V SKT (L/C) CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 14 VOIES SKT CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 VOIES (L/C) CONNECT CIRCUL TAILLE18 31 VOIES BROCHE CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE18 31 V SKT (L/C) CONNECT CIRCUL TAILLE18 31 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES (L/C) CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 VOIES BROCHE CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 V SKT (L/C) CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 16 VOIES SKT CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 VOIES (L/C) CONNECT CIRCUL TAILLE20 25 VOIES BROCHE CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 25 V SKT (L/C) CONNECT CIRCUL TAILLE20 25 VOIES SKT CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 VOIES (L/C) CONNECT CIRCUL TAILLE20 28 VOIES BROCHE CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 28 V SKT (L/C) CONNECT CIRCUL TAILLE20 28 VOIES SKT CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 39 VOIES (L/C) CONNECT CIRCUL TAILLE20 39 VOIES BROCHE CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE20 41 V SKT (L/C) CONNECT CIRCUL TAILLE20 41 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES (L/C) CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 VOIES BROCHE CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 V SKT (L/C) CONNECT CIRCUL TAILLE22 12 VOIES SKT RESISTOR,HV THICK FILM,100MOHM 250mW 1% CONNECT CIRCUL TAILLE22 12 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES (L/C) CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 VOIES BROCHE CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 V SKT (L/C) CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 19 VOIES SKT CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 VOIES (L/C) CONNECT CIRCUL TAILLE22 32 VOIES BROCHE CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 32 V SKT (L/C) CONNECT CIRCUL TAILLE22 32 VOIES SKT CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 VOIES (L/C) CONNECT CIRCUL TAILLE22 55 VOIES BROCHE CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE22 55 V SKT (L/C) CONNECT CIRCUL TAILLE22 55 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 29 V SKT (L/C) CONNECT CIRCUL TAILLE24 29 VOIES SKT CONNECT CIRCUL TAILLE24 29 V SKT (L/C) CONNECT CIRCUL TAILLE24 29 VOIES SKT CONNECT CIRCUL TAILLE24 29 V SKT (L/C) CONNECT CIRCUL TAILLE24 29 VOIES SKT CONNECT CIRCUL TAILLE24 29 V SKT (L/C) CONNECT CIRCUL TAILLE24 29 VOIES SKT CONNECT CIRCUL TAILLE24 29 V SKT (L/C) CONNECT CIRCUL TAILLE24 29 VOIES SKT CONNECT CIRCUL TAILLE24 29 V SKT (L/C) CONNECT CIRCUL TAILLE24 29 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES (L/C) CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 VOIES BROCHE CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 V SKT (L/C) CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 30 VOIES SKT CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 43 VOIES (L/C) CONNECT CIRCUL TAILLE24 43 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 57 VOIES (L/C) CONNECT CIRCUL TAILLE24 57 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 VOIES (L/C) CONNECT CIRCUL TAILLE24 61 VOIES BROCHE CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE24 61 V SKT (L/C) CONNECT CIRCUL TAILLE24 61 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES (L/C) CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 VOIES BROCHE CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 V SKT (L/C) CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE28 42 VOIES SKT CONNECT CIRCUL TAILLE 8 2 VOIES (L/C) CONNECT CIRCUL TAILLE 8 2 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 V SKT (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 5 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT D SUB CONNECTOR,STANDARD,37POS,PLUG CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE SWITCH,INDUSTRIAL PUSHBUTTON,40MM CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) SWITCH,INDUSTRIAL PUSHBUTTON,40MM CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 V (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 VOIES BROCHE CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 V SKT (L/C) CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 28 42 VOIES SKT CONNECT CIRCUL TAILLE 8 2 VOIES (L/C) CONNECT CIRCUL TAILLE 8 2 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 V SKT (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES SKT CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES BROCHE CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES BROCHE CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 32 V SKT (L/C) CONNECT CIRCUL TAILLE 22 32 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 V (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 VOIES BROCHE CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 V SKT (L/C) CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 30 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 43 V (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 57 V (L/C) CONNECT CIRCUL TAILLE 24 57 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE SWITCH,INDUSTRIAL PUSHBUTTON,40MM CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT IC,MONO MULTIVBTOR,SCHMITT TRIG INPUT,VSSOP-8 MAGNETIC SENSOR TESTEUR DE RESAEU TESTEUR DE RESAEU KIT AUTO TESTER NETWORK KIT AUTO TESTER NETWORK + AIRCHECK KIT AUTO TESTER NETWORK KIT AUTO TESTER NETWORK + CABLEIQ HOLSTER LINKRUNNER AT TRANSCEIVER SFP SX GIG FIBER DDM TRANSCEIVER SFP LX GIG FIBER DDM TRANSCEIVER SFP 100BASE-FX FIBER DDM CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES BROCHE CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 20 VOIES SKT CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 3 VOIES (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 18 11 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES BROCHE CONNECT CIRCUL TAILLE 18 31 V (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 25 VOIES SKT CONNECT CIRCUL TAILLE 20 25 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES SKT CONNECT CIRCUL TAILLE 20 28 V SKT (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES BROCHE CONNECT CIRCUL TAILLE 20 39 V (L/C) CONNECT CIRCUL TAILLE 20 39 VOIES SKT CONNECT CIRCUL TAILLE 20 39 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE SWITCH,SELECTOR,DPST-2NO,10A,600V CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 3 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE ELECTROMECHANICAL GENERAL PURPOSE TIMER CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT ELECTROMECHANICAL GENERAL PURPOSE TIMER CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) ELECTROMECHANICAL GENERAL PURPOSE TIMER CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT PANEL MOUNT RELAY ADAPTER CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES BROCHE CONNECT CIRCUL TAILLE 10 2 VOIES (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 2 VOIES SKT CONNECT CIRCUL TAILLE 10 2 V SKT (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 10 5 VOIES BROCHE CONNECT CIRCUL TAILLE 10 5 VOIES (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES SKT CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES BROCHE CONNECT CIRCUL TAILLE 14 12 V (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 12 VOIES SKT CONNECT CIRCUL TAILLE 14 12 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 15 VOIES SKT CONNECT CIRCUL TAILLE 14 15 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES BROCHE CONNECT CIRCUL TAILLE 14 4 VOIES (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 4 VOIES SKT CONNECT CIRCUL TAILLE 14 4 V SKT (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 14 7 VOIES (L/C) CONNECT CIRCUL TAILLE 14 7 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) POWER RELAY,DPDT,12VDC,10A,PC BOARD CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES BROCHE CONNECT CIRCUL TAILLE 16 10 V (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 10 VOIES SKT CONNECT CIRCUL TAILLE 16 10 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES SKT CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 16 24 VOIES BROCHE CONNECT CIRCUL TAILLE 16 24 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) POWER RELAY,3PDT,24VDC,10A,PLUG IN CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES BROCHE CONNECT CIRCUL TAILLE 18 14 V (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 14 VOIES SKT POWER RELAY,4PDT,120VAC,10A,PLUG IN CONNECT CIRCUL TAILLE 18 14 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 31 VOIES SKT CONNECT CIRCUL TAILLE 18 31 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES BROCHE CONNECT CIRCUL TAILLE 18 8 VOIES (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 18 8 VOIES SKT CONNECT CIRCUL TAILLE 18 8 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE POWER RELAY,4PDT,120VAC,10A,PLUG IN CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES BROCHE CONNECT CIRCUL TAILLE 20 16 V (L/C) CONNECT CIRCUL TAILLE 20 16 VOIES SKT CONNECT CIRCUL TAILLE 20 16 V SKT (L/C) CONNECT CIRCUL TAILLE 20 28 VOIES BROCHE CONNECT CIRCUL TAILLE 20 28 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES BROCHE CONNECT CIRCUL TAILLE 20 41 V (L/C) CONNECT CIRCUL TAILLE 20 41 VOIES SKT CONNECT CIRCUL TAILLE 20 41 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES BROCHE CONNECT CIRCUL TAILLE 22 12 V (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 12 VOIES SKT CONNECT CIRCUL TAILLE 22 12 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES BROCHE CONNECT CIRCUL TAILLE 22 19 V (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 19 VOIES SKT CONNECT CIRCUL TAILLE 22 19 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES BROCHE POWER RELAY,4PDT,12VDC,5A,PC BOARD CONNECT CIRCUL TAILLE 22 55 V (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 22 55 VOIES SKT CONNECT CIRCUL TAILLE 22 55 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 43 VOIES SKT CONNECT CIRCUL TAILLE 24 43 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES BROCHE CONNECT CIRCUL TAILLE 24 61 V (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 24 61 VOIES SKT CONNECT CIRCUL TAILLE 24 61 V SKT (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) CONNECT CIRCUL TAILLE 8 3 VOIES BROCHE CONNECT CIRCUL TAILLE 8 3 VOIES (L/C) DRILL C/LESS DRIVER 14.4V 2 BAT EU DRILL C/LESS DRIVER 18V 2 BAT EU ADC DOUBLE 24BIT 5VIN 80SPS 24TSSOP ADC 12 BITS 5.25VIN 1MSPS 8MSOP RELAY SOCKET,5PIN,10A,300V AMPLI OP 36VIN 4.5MHZ 27.4V 8SOIC AMPLI OP 36VIN 4.5MHZ 27.4V 8SOIC AMPLI OP +/8VIN 1.4MHZ 8SOIC AMPLI OP -16VIN 2MHZ 9.9V 14DIP AMPLI OP E/S RAIL/RAIL 6VIN 3.5MHZ 8SOIC AMPLI OP DOUBLE RRO 5.5VIN 61MHZ 8SOIC AMPLI OP QUAD RRO 40VIN 1.2MHZ 14SOIC MESURE DE COURANT AMP 28VIN 5SOT23 DRIVER LED/LCD 3.5 DIGITS 44MQFP DRIVER FET 95VIN 2.6A 1MHZ 20SOIC DRIVER MOSFET DOUBLE 10MHZ 1A 8SOIC DC/DC INV -1.5V TO -12V AJUSTABLE 8SOIC BUCK 5.5VIN 1.6MHZ 1.5A AJUSTABLE 8DFN BUCK 2.7VIN 1MHZ 2A AJUSTABLE 10DFN BUCK SYNCH 5.5VIN 6A 1.2V 20QFN BUCK SYNCH 5.5VIN 6A 1.5V 20QFN BUCK SYNCH 5.5VIN 6A 1.8V 20QFN BUCK SYNCH 5.5VIN 6A 2.5V 20QFN BUCK SYNCH 5.5VIN 6A 3.3V 20QFN BUCK SYNCH 5.5VIN 6A AJUSTABLE 20QFN BUCK SYNCH 5.5VIN 3A AJUSTABLE 16TQFN BUCK SYNCH 5.5VIN 3A AJUSTABLE 16TQFN Relay Socket BUCK SYNCH 5.5VIN 4A AJUSTABLE 16TQFN BUCK SYNCH 5.5VIN 4A AJUSTABLE 16TQFN BUCK SYNCH DOUBLE 6VIN 3A 24QFN BUCK SYNCH DOUBLE 6VIN 3A 24QFN BUCK SYNCH DOUBLE 28VIN 3A 28TQFN BUCK/BOOST 36VIN 2.5A AJUSTABLE 20QFN SUPERVISEUR DOUBLE PROG HYST/VTH 8SOIC SUPERVISEUR DOUBLE PROG HYST/VTH 8SOIC POT QUADRUPLE NV 64 POS LIN 20SOIC POT DOUBLE NV 128 POS LIN 10K 16QFN POT 256 POS LIN 50KOHM 10µTQFN ´REF DE TENS 36VIN 2.5V .02% 8SOIC ISOLATING SIGNAL CONDITIONER ADAPTATEUR UK 18V 0.56A MULTI PLG ADAPTATEUR UK 9V 0.67A ADAPTATEUR UK 24V 0.5A MULTI PLG ADAPTATEUR UK 9V 1.1A MULTIPLG ADAPTATEUR UK 12V 0.5A MULTIPLG CONNECTOR,HOUSING,D SUB,PLUG,9POS POLARIZING POST,DL1/2,DLM1/2 ZIF CONNECTOR MOUNTING FLANGE GASKET,NEOPRENE,SZ20 CRIMP CONTACT,TAB,20-17AWG CIRCULAR CABLE CLAMP,SIZE 16/16S,METAL CIRCULAR STRAIN RELIEF,,ALUMINUM CABLE ASSEMBLY,IDC,10COND,6 CONNECTOR,HOUSING,PLUG,20POS,2.54MM CIRCULAR CONTACT,PIN,24-20AWG,CRIMP TRANSFORMER,40VA,120V,1X24V CASTERS,228KG,3.5 CASTERS,228KG,3.5 FAN FINGER GUARD,STEEL,4.7´´ CRIMP TERMINAL,RING TONGUE,#10,12-10AWG,YELLOW CIRCULAR CONN,RCPT,SIZE 12,3POS,BOX BACKSHELL,D-SUB,DD,ZINC ENCLOSURE,WALL MOUNT,STEEL,GRY PRECOILED MICRO CLAMP BAND CRIMP CONTACT,PIN,20-16AWG FUSE,100A,250V,ONE TIME CABLE ENTRY PANEL,19´´ RACK CABINET PROGRAMMABLE LOGIC CONTROLLER,64 I/O PROTECTIVE COVER,SIZE 13,ALUMINIUM TRANSFORMER,40VA,120V,1X24V INSERTION GUIDE PIN,16S/16 SIZE SOCKET CONTACT BACKSHELL,D-SUB,DC,CARBON STEEL CARTE D´EVALUATION ADC 50MSPS 8CH AD9278 CARTE D´EVALUATION ADC 80MSPS 8CH AD9279 CARTE D´EVALUATION ADC FPGA AD9279 CARTE D´EVALUATION BUCK 20V 6A ADP2381 CARTE D´EVAL DAC QUAD 12 BITS AD5684R CARTE D´EVAL DAC QUAD 16 BITS AD5686R CARTE D´EVAL DAC QUAD 12 BITS AD5694R CARTE D´EVAL DAC QUAD 16 BITS AD5696R KIT D´EVAL CONTL TOUCH SCREEN SPI AD7879 KIT D´EVAL LITHIUM ION BATT MONIT AD8280 KIT D´EVAL RF EMETTEUR AD9122/RF6702 MIL38999 III PLUG CAP SZ 11 42J9541 RELAY,SPST-NO,22VDC,30A,PCB PANEL,1.72 TRANSFORMER,31.5VA,2X115V,1X12.6V HAND CRIMP TOOL FRAME,STANDARD ADJUSTABLE DIN RAIL,ADJUSTABLE,19IN,STEEL LED HAUTE ROUGE 3MM STANDARD LED VERT 2.9MM STANDARD LED JAUNE 2.9MM STANDARD LED ORANGE 2.9MM STANDARD LED ROUGE 2.9MM STANDARD LED HAUTE ROUGE 2.9MM STANDARD LED VERT 5MM STANDARD LED JAUNE 5MM STANDARD LED ROUGE 5MM STANDARD LED JAUNE 0805 STANDARD LED ORANGE 0805 STANDARD LED ROUGE 0805 STANDARD LED HAUTE ROUGE 0805 STANDARD LED VERT 0603 STANDARD LED ORANGE 0603 STANDARD LED HAUTE ROUGE 0603 STANDARD LED BLANC CHIP ON COPPER 3W LED W BLANC CHIP ON COPPER 3W LED BLANC CHIP ON COPPER 5W LED W BLANC CHIP ON COPPER 5W LED BLANC CHIP ON COPPER 7W LED W BLANC CHIP ON COPPER 7W LED BLANC CHIP ON COPPER 10W LED W BLANC CHIP ON COPPER 10W LED BLANC CHIP ON ALUMINIUM 6W LED W BLANC CHIP ON ALUMINIUM 6W LED BLANC CHIP ON ALUMINIUM 12W LED W BLANC CHIP ON ALUMINIUM 12W LED BLANC 3020 PLCC 0.06W LED W BLANC 3020 PLCC 0.06W LED BLANC 3528 PLCC 0.6W LED W BLANC 3528 PLCC 0.6W LED BLANC 5050 PLCC 0.2W LED W BLANC 5050 PLCC 0.2W LED BLANC 3528 PLCC 0.5W LED W BLANC 3528 PLCC 0.5W LED ROUGE 3528 PLCC 0.5W LED BLEU 3528 PLCC 0.5W LED JAUNE 3528 PLCC 0.5W LED VERT 3528 PLCC 0.5W LED BLANC 5050 PLCC 0.2W LED BLANC 5050 PLCC 0.4W LED W BLANC 5050 PLCC 0.4W LED BLANC 5050 PLCC 1W LED W BLANC 5050 PLCC 1W LED BLANC HAUTE PUISSANCE ROUND 1W LED W BLANC HAUTE PUISSANCE ROUND 1W LED ROUGE HAUTE PUISSANCE ROUND 1W LED JAUNE HAUTE PUISSANCE ROUND 1W LED VERT HAUTE PUISSANCE ROUND 1W LED BLANC HAUTE PUISSANCE ROUND 3W LED W BLANC HAUTE PUISSANCE ROUND 3W LED BLANC HAUTE PUISSANCE 3535 1W LED W BLANC HAUTE PUISSANCE 3535 1W LED BLANC CERAMIQUE 4 X 4 1W LED W BLANC CERAMIQUE 4 X 4 1W CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 14 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 14 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) BARGRAPHE JAUNE 10 SEGMENT BARGRAPHE ORANGE 10 SEGMENT CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) CONNEC CIRCU TAILLE18 11 VOIES SKT (L/C) LED BLANC FLEXIBLE STRIP 12VDC LED BLANC RIGID STRIP 12VDC Sensor 53K5511 D SUB BACKSHELL,SIZE DD,THERMOPLASTIC SWITCHES,TACTILE CIRCULAR CONNECTOR PLUG SIZE 12,10POS,CABLE CONNECTOR,HOUSING,23POS,4MM CIRCULAR CONNECTOR RCPT SIZE 14,19POS,PANEL ALIMENTATION 350W SIMPLE SORTIE ALIMENTATION 350W SIMPLE SORTIE ALIMENTATION 350W SIMPLE SORTIE ALIMENTATION 350W SIMPLE SORTIE ALIMENTATION 350W SIMPLE SORTIE ALIMENTATION 350W SIMPLE SORTIE ALIMENTATION AC/DC 55W SIMPLE SORTIE ALIMENTATION AC/DC 60W DOUBLE SORTIE ALIMENTATION AC/DC 60W DOUBLE SORTIE ALIMENTATION AC/DC 60W DOUBLE SORTIE ALIMENTATION AC/DC 60W TRIPLE SORTIE ALIMENTATION AC/DC 60W TRIPLE SORTIE ALIMENTATION AC/DC 60W TRIPLE SORTIE ALIMENTATION AC/DC 60W TRIPLE SORTIE CONVERTISSEUR DC/DC 20W SIMPLE SORTIE CONVERTISSEUR DC/DC 20W SIMPLE SORTIE CONVERTISSEUR DC/DC 20W DOUBLE SORTIE CONVERTISSEUR DC/DC 20W DOUBLE SORTIE CONVERTISSEUR DC/DC 20W SIMPLE SORTIE CONVERTISSEUR DC/DC 20W SIMPLE SORTIE VENTILATEUR CAPOT ECM140/CLC175 CRIMP TERMINAL,SPADE LUG,0.375 WIRE MARKER TAPE DISPENSER ONLY CONNECTOR,POWER ENTRY,INLET W/ FILTER,10A FUSE,FAST ACTING,40A,600VDC FUSE,FAST ACTING,45A,600VDC FUSE,FAST ACTING,50A,600VDC FUSE,FAST ACTING,60A,600VDC TERMINAL BLOCK,DIN RAIL,7POS,20-8AWG TERMINAL BLOCK,DIN RAIL,7POS,20-8AWG MOUNTING CLIP,LED LIGHTBAR MOUNTING CLIP,LED LIGHTBAR TURRET HEAD,AF8 CRIMP TOOL CONNECTOR,HOUSING,D SUB,RECEPTACLE,25POS TERMINAL BLOCK,DIN RAIL,4POS,28-12AWG FUSE,TIME DELAY,10A,600V FUSE,TIME DELAY,100A,600V FUSE,TIME DELAY,15A,600V FUSE,TIME DELAY,17.5A,600V FUSE,TIME DELAY,20A,600V FUSE,TIME DELAY,25A,600V FUSE,TIME DELAY,30A,600V FUSE,TIME DELAY,35A,600V FUSE,TIME DELAY,40A,600V FUSE,TIME DELAY,45A,600V FUSE,TIME DELAY,50A,600V FUSE,TIME DELAY,6A,600V FUSE,TIME DELAY,60A,600V FUSE,TIME DELAY,70A,600V FUSE,TIME DELAY,90A,600V CIRCULAR CONNECTOR PLUG SIZE 15,18POS,CABLE SEALING GASKET,MOUNTING FLANGE,SZ12,NEOPRENE PLUG,TEST,MS MODULE MAINTENANCE KIT PROTECTIVE COVER,SIZE 15,ALUMINIUM PADLOCK ADAPTOR,ENCLOSURE HAND CRIMP TOOL FRAME,USE WITH M22520/2 POSITIONERS CONNECTOR,HEADER,14POS,2ROW,2.54MM CONNECTOR,LC ADAPTER,SINGLEMODE/MULTIMODE CONTACT,PIN,20-18AWG,CRIMP,D-SUB CONN POWER ENTRY,PLUG,4A,250VAC CONTACT,RECEPTACLE,20-18 AWG,CRIMP EXTENSION JOINT,LED LIGHTBAR U-SHAPE JUMPER,LED LIGHTBAR BAR TO BAR CONNETOR,LED LIGHTBAR EXTENSION JOINT,LED LIGHTBAR CONNECTOR,HOUSING,RCPT,4POS,1ROW SWITCH,ROCKER,DPST,20A,125V CIRCULAR CONNECTOR PLUG SIZE 15,18POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 19,11POS,CABLE BUSS CONTACT,1PAIR,CRIMP/SOLDER SCREW,RRAL SERIES OPEN FRAME RELAY RACKS CIRCULAR STRAIN RELIEF,STR,W/CLAMP,SZ11,METAL PC SCREW TERMINAL AMPLI VIDEO FILTRE 8LFCSP SHARC DSP 200MHZ 88LFCSP PHONE JACK 3 VOIES ADAPTATEUR RCA FICHE TO RECEPTACLE CONNECTEUR SUB-D RECEPTACLE 9 VOIES SUB-D RECEPTACLE STANDARD 15 VOIES CONNECTEUR SUB-D FICHE 9 VOIES CONNECTEUR SUB-D RECEPTACLE 9 VOIES MINI USB 2.0 TYPE B RECEPTACLE SMT MINI USB 2.0 TYPE A RECEPTACLE USB 2.0 TYPE A RECEPTACLE USB 2.0 TYPE A RECEPTACLE SMT USB 2.0 TYPE A RECEPTACLE USB 2.0 TYPE A RECEPTACLE CONNECTEUR RCPT 50 VOIES 1.27MM SATA RECEPTACLE SMT 22 VOIES USB 2.0 TYPE A RECEPTACLE THD CONNECTEUR RECEPTACLE IDT 4 VOIES SFP RECEPTACLE SMT 20 VOIES CONNECTEUR CENTRONICS FICHE 24 VOIES USB 2.0 TYPE B RECEPTACLE USB 2.0 TYPE B RECEPTACLE THD CONNECTEUR SCSI FICHE IDC/IDT 68 VOIES CONNECTEUR MINI D RIBBON FICHE 24 VOIES CONNECTEUR RECEPTACLE IDC/IDT 68 VOIES DISCRETE RECEPTACLE CLOSED 3.61MM DIN 41612 RECEPTACLE 64 VOIES STACKING FICHE 0.8MM 80 VOIES CONNECTEUR RECEPTACLE 2MM 24 VOIES CONNECTEUR EMBASE 2MM 4 VOIES CONNECTEUR RECEPTACLE 2MM 26 VOIES CONNECTEUR EMBASE 2.54MM 40 VOIES CONNECTEUR RECEPTACLE 2MM 44 VOIES CONNECTEUR CARTE-CARTE EMBASE 3 VOIES CONNECTEUR RECEPTACLE 2.54MM 8 VOIES CONNECTEUR EMBASE 2.5MM 2 VOIES CONNECTEUR EMBASE 2.54MM 7 VOIES CONNECTEUR RECEPTACLE 3.96MM 3 VOIES CONNECTEUR RECEPTACLE 3.96MM 6 VOIES CONNECTEUR HOUSING FICHE 1.25MM 3 VOIES CONNECTEUR RECEPTACLE 2.54MM 2 VOIES CONNECTEUR RECEPTACLE 2.54MM 4 VOIES CONNECTEUR RECEPTACLE 2.54MM 6 VOIES CONNECTEUR EMBASE 2.54MM 4 VOIES CONNECTEUR RECEPTACLE 2MM 20 VOIES CONNECTEUR EMBASE 2MM 10 VOIES SWITCH CAP CONNECTEUR EMBASE 2MM 14 VOIES CONNECTEUR EMBASE 2MM 20 VOIES CONNECTEUR RECEPTACLE 2.54MM 64 VOIES CONNECTEUR RECEPTACLE 2.54MM 1 VOIES CONNECTEUR EMBASE 2.54MM 3 VOIES CONNECTEUR EMBASE 10 VOIES CONNECTEUR RECEPTACLE 2.54MM 10 VOIES CONNECTEUR RECEPTACLE 10 VOIES HOUSING RECEPTACLE 2.54MM 3 VOIES CONNECTEUR FICHE 2.54MM 6 VOIES CONNECTEUR RECEPTACLE 2MM 16 VOIES FFC/FPC CONNECTEUR RECEPTACLE 3 VOIES CONNECTEUR FFC/FPC 1MM 4 VOIES CONNECTEUR FFC/FPC 0.5MM 40 VOIES SMA JACK STR 50OHM CONTACT SMB FICHE STR 50OHM SOLDER SMA FICHE STR 50OHM CONTACT, SMA JACK STR 50OHM SOLDER TNC JACK 50OHM BULKHEAD SMA FICHE STR 50OHM CONTACT RF COAXIAL BNC JACK 50OHM SOLDER RF COAXIAL SMA JACK 50OHM CONTACT RF COAXIAL SMA JACK 50OHM SOLDER RF COAXIAL SMA JACK 50OHM SOLDER SMA JACK 50OHM BULKHEAD RF COAXIAL SMB JACK 75OHM SOLDER RF COAXIAL SMA FICHE 50OHM TERMINAL BLOCK PCB 28-20AWG 4 VOIES TERMINLA BLOCK 2MM 6 VOIES RETRACTILE FICHE 36A SCREW RED RETRACTILE FICHE 36A SOLDERLESS INSULATED TERMINAL 30A SOLDER RED POINTE DE TEST PCB THROUGH HOLE POINTE DE TEST PCB THROUGH HOLE RETAINER CLIP CF CARTE EMBASE JUMPER SHUNT 2MM 2 VOIES ADAPTATEUR RCA JACK-BNC FICHE CAT5/CAT5E RJ45 JACK 8 VOIES 1 PORT CAT3 RJ12 JACK 6 VOIES 1 PORT SUB-D SHELL RECEPTACLE TAILLE 3 STEEL JONCTION SHELL TAILLE DB STEEL CABLE CLAMPE KIT TAILLE 4 ZINC ALLOY HOOD SUB-D TAILLE DE SUB-D CAPOT ZINC ALLOY SUB-D HOOD TAILLE DA METAL MEMORY EMBASE SIM 6 VOIES MOSFET CANAL N 80V 74A D2PAK MOSFET CANAL N 100V 57A D2PAK MOSFET CANAL N 80V 50A D2PAK MOSFET CANAL N 100V 37A D2PAK MOSFET CANAL N 100V 32A D2PAK MOSFET CANAL N 80V 22A D2PAK MOSFET CANAL N 60V 92A D2PAK MOSFET CANAL N 40V 77A D2PAK MOSFET CANAL N 80V 90A D2PAK MOSFET CANAL N 100V 89A D2PAK MOSFET CANAL N 30V 120A D2PAK MOSFET CANAL N 40V 120A D2PAK MOSFET CANAL N 60V 120A D2PAK MOSFET CANAL N 80V 120A D2PAK MOSFET CANAL N 100V 120A D2PAK MOSFET CANAL N 30V 120A D2PAK MOSFET CANAL N 40V 120A D2PAK MOSFET CANAL N 60V 120A D2PAK MOSFET CANAL N 80V 120A D2PAK MOSFET CANAL N 100V 120A D2PAK ADC 12 BITS 1MSPS +/-1LSB 30TSSOP AMPLI OP RRO 8MHZ 2.9V/µS 5SOT23 AMPLI OP RRO 300MHZ 650V/µS 8SOIC AMPLI OP RAIL/RAIL 10MHZ 5V/µS 8WLCSP AMPLI OP 12MHZ 2.7V/µS 5SOT23 AMPLI OP DOUBLE 160MHZ 200V/µS 8SOIC AMPLI OP 1.8MHZ 3V/µS 8MSOP AMPLI OP 900MHZ 1600V/µS 8MLP AMPLI OP 1.8MHZ 3.4V/µS 8DIP LOG AMP 0.1-10GHZ 5.5V 8LFCSP LOG AMP 0.1-8GHZ 5V 16LFCSP MESURE DE COURANT AMP 60KHZ 60V 8SOIC COMMUTATEUR ANAL DOUBLE SPDT 15V 16DIP COMPARATEUR DOUBLE 2.7-5.3V 8MSOP LED COURANT REG 0.35A 6-40V 8SOIC MOTEUR DRIVER 50V +/-1.5A 24TSSOP DRIVER MOSFET 600V 20V 28PDIP V/F CONVERTISSEUR 2MHZ 0.02% 5V 16DIP CONVERTISSEUR F/V 28VIN +/-0.3% 14SOIC BUCK 5.5VIN 3MHZ 0.6A 3.3V 5TSOT BUCK 42VIN 1.25MHZ 0.6A AJUSTABLE 6TSOT BUCK 95VIN 0.35A AJUSTABLE 8LLP BUCK 42VIN 1A 6W 0.8V TO 6V 7TOPMOD BUCK 5.5VIN 1.7MHZ AJUSTABLE 1% 5TSOP BUCK CHRGPUMP 0.25A AJUSTABLE 10MSOP REGUL LDO 6VIN 1.5A 3.3V 1.5% 3SOT223 REGUL LDO 3.4 TO 45VIN 0.2A AJUST 8SOIC REGULATEUR LDO 6VIN 2A 0.2% 8SOIC REGUL LDO 10VIN 0.1A AJUSTABLE 5SOT23 REGUL LDO 1.5A 1.21V TO 20V AJUST 5TO263 REGULATEUR LDO 5V 0.25A 1.5% 5SOT23 CONTROLEUR MODE COURANT 500KHZ 8SOIC CONTROLEUR PWM 18VIN 1MHZ 8SOIC CONTROLEUR TENSION 2.45 VREF 40V 8MICRO COMMUTATEUR COURANT LIMITED 0.5A 8MSOP ACCELEROMETRE 1 AXES +/-35G 8LCC CAPTEUR HALL EFFECT LINEAIR 120KHZ CAPTEUR HALL EFFECT LINEAIR 120KHZ CONTRÔLE VENTIL WATCHDOG 24TSSOP VREF 15VIN 5V 0.12% 5TSOT VREF 18VIN 4.096V 0.04% 8SOIC REGULATEUR SHUNT 10V 0.5% 3STO23 ISOLATEUR NUMERIQUE QUADRUPLE 3:1 16SOIC GROMMETING,EXTRUDED,NYLON,BLACK,100FT DAC QUAD 12 BITS +/-2LSB SPI 16TSSOP DAC QUAD 12 BITS +/-1LSB SPI 16TSSOP DAC QUADRUPLE 14BIT +/-4LSB SPI 16TSSOP DAC QUADRUPLE 14BIT +/-1LSB SPI 16TSSOP DAC QUAD 16 BITS +/-8LSB SPI 16TSSOP DAC QUAD 12 BITS +/-2LSB I2C 16TSSOP DAC QUAD 12 BITS +/-1LSB I2C 16TSSOP DAC QUADRUPLE 14BIT +/-4LSB I2C 16TSSOP DAC QUADRUPLE 14BIT +/-1LSB I2C 16TSSOP DAC QUAD 16 BITS +/-8LSB I2C 16TSSOP DAC QUAD 16 BITS +/-2LSB I2C 16TSSOP INDUSTRIAL PROG SORTIE I V DRVR 32LFCSP ADC 12 BITS 3.6V 105KSPS I2C 16LFCSP ADC 12 BITS 3.6V 105KSPS SPI 16LFCSP AMPLI OP QUAD RAILL 18V 240KHZ 14SOIC ADC 12 BITS 8CH I/Q DEMOD 144CSPBGA ADC 12 BITS 8CH I/Q DEMOD 144CSPBGA ADC QUADRUPLE 16 BITS 125MSPS 48LFCSP AMPLI DIFF DOUBLE 5.5VIN 84MHZ 16LFCSP BUCK 16VIN 0.8A 0.6/1.2MHZ AJUSTA 8QFN BUCK 16VIN 0.8A 0.6/1.2MHZ AJUST 8QFN BUCK SYNCH 20VIN 6A 1.4MHZ 16TSSOP ´REF DE TENS 15VIN 3V +/-0.04% 8SOIC ´REF DE TENS 15VIN 3V +/-0.02% 8SOIC ´REF DE TENS 15VIN 5V +/-0.02% 8SOIC CONDENSATEUR 0.1UF 500V X7R RAD CONDENSATEUR 1UF 200V X7R RAD D CONDENSATEUR 0.06F 3.3V STAKED COIN FERRITE CHIP BEAD CMS 0.1OHM 0.6A FILTRE DE MODE COMMUN POWER LINE CMS FILTRE DE MODE COMMUN POWER LINE CMS FILTRE DE MODE COMMUN POWER LINE CMS BOBINE DE MODE COMMUN 2000UH 0.6A RESISTANCE LADDER N/W 10 10KOHM 2% SIP RESEAU RESISTANCE 4RES 49.9OHM 5% 1206 RESEAU DE RESISTANCE 4RES 51OHM 5% 0805 RESEAU DE RESISTANCE 4RES 56OHM 5% CMS GAS DISCHARGE TUBE 2P 10KA 8KV BOBINE 0.051MH 0.5A 30% 100KHZ INDUCTANCE PUISSANCE 1MH 0.26A 20% THERMISTANCE CTN RADIAL 10KOHM THERMISTANCE CTP CMS 27OHM THERMISTANCE CTP CMS 680OHM THERMISTANCE CTP RADIAL 25OHM THERMISTANCE CTP RADIAL 50OHM CONDENSATEUR 27PF 250V C0G 0603 CONDENSATEUR 82PF 250V C0G 0603 CONDENSATEUR 82PF 250V C0G 0603 CONDENSATEUR 47PF 50V C0G/NP0 RAD CONDENSATEUR 1800UF 6.3V RADIAL CONDENSATEUR 1000UF 63V RADIAL FERRITE BEAD 0603 40MOHM 3A FERRITE BEAD 0805 450MOHM 0.3A FILTRE DE MODE COMMUN POWER LINE CMS FILTRE DE MODE COMMUN POWER LINE CMS CONDENSATEUR 4.7PF 1000V C0G RAD CONDENSATEUR 0.1UF 50V X7R RAD CONDENSATEUR 1UF 50V Y5V RADIAL CONDENSATEUR RF 1000PF 1KV 2220 RESISTANCE THICK FILM 40MOHM 1.5W 1% RESEAU DE RESISTANCE 9 BROCHES 10K 2% CONDENSATEUR 56PF 1000V C0G RAD CONDENSATEUR 1UF 50V X7R RADIAL CONDENSATEUR 0.68UF 50V X7R RAD CONDENSATEUR 1UF 50V X7R RADIAL CONDENSATEUR 1UF 50V X7R RADIAL CONDENSATEUR 1UF 35V 8OHM CONDENSATEUR RESEAU DE 0.1UF 50V X7R SIP RESISTANCE METAL FILM 10OHM 2W RESIST MESURE DE COURANT 500OHM 30W 1% RESISTANCE METAL OXIDE 0.2GOHM 1W 1% CONDENSATEUR 470PF 440V K4000 RAD CONDENSATEUR 10UF 16V 3.2OHM CONDENSATEUR 10UF 25V 2.5OHM CONDENSATEUR 10UF 35V 2OHM CONDENSATEUR TRIMMER 0.6-4.5PF 500V CMS FERRITE BEAD CYLINDRICAL 50OHM THERMISTANCE CTN RADIAL 4OHM CONDENSATEUR 2200PF 760V K2000 RA CONDENSATEUR 1UF 63V RADIAL CONDENSATEUR 47UF 16V 1.3OHM CONDENSATEUR 22UF 25V RADIAL POTENTIOMETRE TRIMMER 1KOHM 11TOURS POTENTIOMETRE TRIMMER 10KOHM 11TOURS POTENTIOMETRE TRIMMER 1MOHM 11TOURS POTENTIOMETRE TRIMMER 1KOHM 20TOURS POTENTIOMETRE TRIMMER 500OHM 20TOURS POTENTIOMETRE TRIMMER 5KOHM 23TOURS THERMISTANCE CTN RADIAL 10OHM THERMISTANCE CTN RADIAL 40OHM THERMISTANCE CTN RADIAL 10OHM THERMISTANCE CTN RADIAL 2.5OHM CONDENSATEUR 22UF 25V AXIAL CONDENSATEUR 10UF 63V AXIAL CONDENSATEUR 1F 5.5V STAKED COIN FERRITE BEAD CYLINDRICAL 111OHM CONDENSATEUR 100UF 16V AXIAL CONDENSATEUR 47UF 63V RADIAL CONDENSATEUR 220UF 25V RADIAL THERMISTANCE CTN RADIAL 10KOHM THERMISTANCE CTN RADIAL 20OHM THERMISTANCE CTN RADIAL 0.5OHM CONDENSATEUR 1000PF 15000V Y5U FERRITE BEAD CYLINDRICAL 92OHM CONDENSATEUR 1000UF 16V RADIAL CONDENSATEUR 470UF 16V AXIAL CONDENSATEUR 470UF 50V RADIAL CONDENSATEUR 470UF 25V RADIAL THERMISTANCE CTN RADIAL 10KOHM THERMISTANCE CTN RADIAL 30KOHM CONDENSATEUR 470UF 40V AXIAL CONDENSATEUR 330UF 63V AXIAL CONDENSATEUR 22UF 400V RADIAL CONDENSATEUR 1000UF 25V AXIAL FERRITE CHIP BEAD 425OHM RESISTANCE BOBINEE 100KOHM 50W 1% SUPPRESSION CORE SOLID ROUND 153OHM SUPPRESSION CORE SNAP ON 400OHM CONDENSATEUR 2200UF 40V AXIAL CONDENSATEUR 1000UF 63V AXIAL CONDENSATEUR 100UF 400V RADIAL CONDENSATEUR 4700UF 40V AXIAL POT BOBINEE 5KOHM 5% 2W SUPPRESSION CORE SOLID ROUND 300OHM RESISTANCE BOBINEE 5OHM 300W 10% RESISTANCE BOBINEE 10OHM 300W 10% CONDENSATEUR 2200UF 6.3V RADIAL CONDENSATEUR 3300UF 6.3V RADIAL CONDENSATEUR 1800UF 16V RADIAL CONDENSATEUR 1000UF 50V RADIAL CONDENSATEUR 4.7UF 400V RADIAL RESEAU DE RESISTANCE 4RES 49.9OHM 1% END PLATE,RAIL MOUNTED TERMINAL BLOCK TERMINAL BLOCK END PLATES/PARTITION END PLATE,RAIL MOUNTED TERMINAL BLOCK END PLATE,RAIL MOUNTED TERMINAL BLOCK KIT D´EVAL FM3 CORTEX M3 MB9B KIT D´EVAL MB9BX00 J-LINK ADAPTATEUR KIT D´EVAL FM3 CORTEX M3 MB9A310L KIT D´EVAL MB9A310L J-LINK ADAPTATEUR KIT D´EVAL FM3 CORTEX M3 MB9B KIT D´EVAL FM3 USB MB9AF312K KIT D´EVAL FM3 CORTEX M3 MB9B KIT D´EVAL FM3 CORTEX M3 MB9B STANDARD TERMINAL BLOCK ADC 4.5 DIGIT MUX BCD SORTIE 28PLCC ADC 12 BITS 8CH 110KSPS 28SSOP ADC 12 BITS 8CH 133KHZ +/-0.5 20SOIC ADC 12 BITS 75KSPS +/-1 3 FIL 8DIP COMMUTATEUR QUADRUPLE SPST 2.5OHM 16SSOP COMPARATEUR DOUBLE 5.5VIN 8µMAX COMPARATEUR 5VIN 10NS TTL 8SOIC COMPARATEUR 11VIN 1.182VREF 8SOIC COMPARATEUR 5.5VIN 20NS 6SOT23 DAC QUADRUPLE 8BIT +/-5V 20WSOIC DAC 10BIT 5V +/-2LSB BUFF SORTIE 8DIP DAC MULTIPLIER 12 BITS 1LSB 8SOIC DRIVER LED 8X7 SEG/64 SERIE 16QSOP DRIVER LED 16X7SEG/8X16SEG/128 36SSOP LIN REG 0.5A +/-1% 1.8V/AJUSTABLE 8µMAX DC/DC 4.5V-20VIN -4.5V TO -20V 14SOIC LCD BIAS ALIMENTATION 6VIN -100V 8DIP LCD BIAS ALIMENTATION 6VIN -100V 8SOIC REGULATEUR LDO 12.6VIN 3V +/-0.4% 3SOT23 CONTROLEUR 4.375V 0.35S RESET 3TO92 CONTROLEUR 5V 10% 0.15S 3SOT23 CONTROLEUR 5V 10% 0.15S MANUAL 3SOT23 CONTROLEUR 5V 5% 0.15S MANUAL 3SOT23 CONTROLEUR 3.3V 5% 0.15S 3SOT23 CONTROLEUR 3.3V 5% 0.15S 3SOT23 CONTROLEUR PROG UV/OV THRESHOLD 8SOIC WATCHDOG TIMER SELECTABLE TOUT 8SOT23 SUPERVISEUR 4.65VTH 0.2S 16WSOIC SUPERVISEUR 4.4VTH 0.2S 16NSOIC SUPERVISEUR 4.4VTH ACTIVE HAUTE 8SOIC SUPERVISEUR WATCHDOG 1.25VTH 16SOIC SUPERVISEUR WATCHDOG 3-3.15VTH 16SOIC SUPERVISEUR 4.675VTH +/-1.5% 8SOIC SUPERVISEUR 2.93VTH 0.14S 4SOT143 SUPERVISEUR WATCHDOG 2.93VTH 5SOT23 TUBING,SLIT CORRUGATED LOOM,6.7MM,BLK,100FT COMMUTATEUR MOSFET 2.7-5.5VIN 1.2A 8SOIC POTENTIOMETRE DOUBLE LOG 65POS 14TSSOP CAPTEUR TEMP REMOTE/LOCAL 16QSOP CAPTEUR TEMP 12 BITS 150DEG MAX 8SOIC MULTIPLEXEUR 8X1 30VIN 16NSOIC MULTIPLEXEUR 1X16 30V 28WSOIC TUBING,SLIT CORRUGATED LOOM,8.9MM,BLK,100FT MICRO 32 BITS CORTEX-M3 FM3 112BGA MICRO 32 BITS CORTEX-M3 FM3 120LQFP MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 120LQFP MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 120LQFP TUBING,SLIT CORRUGATED LOOM,10.5MM,BLK,100FT MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 120LQFP MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 120LQFP MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 144LQFP MICRO 32 BITS CORTEX-M3 FM3 176LQFP MICRO 32 BITS CORTEX-M3 FM3 192BGA MICRO 32 BITS CORTEX-M3 FM3 144LQFP MICRO 32 BITS CORTEX-M3 FM3 176LQFP TUBING,SLIT CORRUGATED LOOM,12.83MM,BLK,100FT MICRO 32 BITS CORTEX-M3 FM3 192BGA MICRO 32 BITS CORTEX-M3 FM3 144LQFP MICRO 32 BITS CORTEX-M3 FM3 176LQFP MICRO 32 BITS CORTEX-M3 FM3 192BGA MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 80LQFP MICRO 32 BITS CORTEX-M3 FM3 64LQFP MICRO 32 BITS CORTEX-M3 FM3 112BGA MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 80LQFP MICRO 32 BITS CORTEX-M3 FM3 64LQFP TUBING,SLIT CORRUGATED LOOM,16.9MM,BLK,100FT MICRO 32 BITS CORTEX-M3 FM3 112BGA MICRO 32 BITS CORTEX-M3 FM3 100LQFP MICRO 32 BITS CORTEX-M3 FM3 80LQFP MICRO 32 BITS CORTEX-M3 FM3 48LQFP MICRO 32 BITS CORTEX-M3 FM3 64LQFP FUSE,FAST ACTING,40A,600V FUSE,FAST ACTING,45A,600V FUSE,FAST ACTING,50A,600V FUSE,FAST ACTING,6A,600V FUSE,FAST ACTING,60A,600V FUSE,FAST ACTING,100A,600VDC TUBING,SLIT CORRUGATED LOOM,19.3MM,BLK,100FT FUSE,FAST ACTING,35A,600VDC ULTRACAPACITOR,220F,2.3V,0.04 OHM+10% -5% ULTRACAPACITOR,300F,2.3V,0.025 OHM+10% -5% ULTRACAPACITOR,820F,2.3V,0.012 OHM+10% -5% ULTRACAPACITOR100F2.7V0.0042 OHM+10% -5% ULTRACAPACITOR1200F2.7V0.00058 OHM+20% -0% ULTRACAPACITOR1500F2.7V0.00047 OHM+20% -0% ULTRACAPACITOR2000F2.7V0.00035 OHM+20% -0% ULTRACAPACITOR3000F2.7V0.00029 OHM+20% -0% ULTRACAPACITOR3000F2.7V0.00026 OHM0% +10% ULTRACAPACITOR,350F,2.7V,0.0032 OHM+20% -0% TUBING,SLIT CORRUGATED LOOM,23.2MM,BLK,100FT ULTRACAPACITOR350F2.7V0.0032 OHM+10% -5% ULTRACAPACITOR350F2.7V0.0027 OHM+10% -5% ULTRACAPACITOR400F2.7V0.0032 OHM+10% -5% DESOLDERING BRAID,COPPER TUBING,SLIT CORRUGATED LOOM,6.7MM,BLK,100FT TUBING,SLIT CORRUGATED LOOM,8.9MM,BLK,100FT SEALING BOOT M6P X 0.75 THD FAIBLE MICROCOMMUTATEUR IP67 BROCHE PLONGEUR TUBING,SLIT CORRUGATED LOOM,10.5MM,BLK,100FT MICROCOMMUTATEUR IP67 SIM GALET A SOUDER MICROCOMMUTATEUR IP67 PCB A SOUDER AFE 24BIT 125KSPS 2CH 20SSOP FILLESS ADAP ZENA MRF89XA 868MHZ TUBING,SLIT CORRUGATED LOOM,12.8MM,BLK,100FT FILLESS ADAP ZENA MRF89XA 915MHZ CARTE DE DEMO REMOTE CONTROL ZENA APT AC-DC CONV,EXTERNAL PLUG IN,1 O/P,40W,8A,5V MICRO-MINI RF SMT BIN BOITE FIBRECARTE CONDUCTIVE S BIN BOITE FIBRECARTE CONDUCTIVE L BOBINE DE BIN FITTING CONDUCTIVE CIRCUIT BREAKER,HYDROMAGNETIC,5A BRACKET HANGER,CABLE & WIRE MANAGEMENT CONNECTOR,INLET,INSULGRIP,30A OMNI-BEAM MODULAR PHOTOELECTRIC SENSOR SENSOR HEAD,DIFFUSE MODE,76CM MICRO-D CONNECTOR,PLUG,15POS,WIRE LEADS SWITCH,ROTARY,2 POS,2.5A,250VAC TERMINAL BLOCK,DIN RAIL/PANEL,1POS,14AWG IC,OP-AMP,8MHZ,2.5V/ us,20 uV,DIP-8 VOLTAGE REGULATOR,LDO,ADJ,1.5A,TO-263-5 IC,DC/DC CONTROLLER,BUCK,1MHZ,30A,QFN-40 IC,DC/DC CONTROLLER,BUCK,1MHZ,30A,QFN-40 FUSE,FAST ACTING,1A,600V FUSE,FAST ACTING,10A,600V FUSE,FAST ACTING,100A,600V FUSE,FAST ACTING,15A,600V FUSE,FAST ACTING,20A,600V FUSE,FAST ACTING,25A,600V FUSE,FAST ACTING,3A,600V FUSE,FAST ACTING,30A,600V FUSE,FAST ACTING,35A,600V FUSE,FAST ACTING,70A,600V FUSE,FAST ACTING,80A,600V FUSE,FAST ACTING,90A,600V FUSE,FAST ACTING,70A,600VDC FUSE,FAST ACTING,90A,600VDC FUSE,FAST ACTING,80A,600VDC FUSE,TIME DELAY,80A,600V LEGENDS,EMERGENCY-STOP SWITCH CORDON HDMI RAPIDE 1M CORDON HDMI RAPIDE 2M KEYCARTE MINI SLIM NOIR A4 TECH CORDON DE BRASSAGE CAT 5E NOIR 10M SOURIS USB OPTICAL 3D MICROCONTROLEUR 8BIT 7KB FLASH 28QFN MICROCONTROLEUR 8BIT 7KB FLASH 28SOIC TRANSCEIVER RS422/RS485 28WDIP TRANSCEIVER RS422/RS485 10UMAX TRANSCEIVER RS422/RS485 8SOIC TRANSCEIVER RS422/RS485 8SOIC TRANSCEIVER RS422/RS485 8SOIC TRANSCEIVER RS422/RS485 8SOIC TRANSCEIVER RS232 ESD 20SOIC TRANSCEIVER RS232 WCAP 24SOIC TRANSCEIVER RS232 5V 16TSSOP TRANSCEIVER RS232 16TSSOP TRANSCEIVER RS232 18SOIC TRANSCEIVER RS232 28SSOP EMBASE XLR 3P FEMELLE MODULE D´EVALUATION DM814X/AM387X DEV KIT C2000 PWR LINE MODEM MODULE D´EVAL LITE W/XDS560V2 C6678 MODULE D´EVALUATION LITE C6678 KIT DE DEVELOPPEMENT MSP430F5529 USB WIRE TO BOARD CONN,HEADER,8POS,2MM COMMUTATEUR LEVIER MAGNETIQUE COMMUTATEUR LEVIER MAGNETIQUE DSP F- POINT C6713B 300MHZ 272BGA DSP F- POINT C6713B 225MHZ 272BGA DSP FIX POINT 160MHZ 144LQFP SOC NUMERIQUE MEDIA 338NFBGA MPU SITARA ARM CORTEX-A8 324NFBGA MPU APPS PROC C6 INTEGRA 361FCBGA MPU SITARA ARM CORTEX-A8 324NFBGA MPU SITARA ARM CORTEX-A8 491NFBGA MPU SITARA ARM CORTEX-A8 298NFBGA MCU STELLARIS ARM CORTEX-M3 100LQFP MCU STELLARIS ARM CORTEX-M3 100LQFP MICRO 32 BITS 128K FLASH 44VTLA CHAUFFAGE ANTI CONDENSATION 200W 230V CHAUFFAGE ANTI CONDENSATION 200W 110V CHAUFFAGE ANTI CONDENSATION 300W 230V CHAUFFAGE ANTI CONDENSATION 300W 110V CHAUFFAGE ANTI CONDENSATION 400W 230V CHAUFFAGE ANTI CONDENSATION 400W 110V CHAUFFAGE ANTI CONDENSATION 600W 230V CHAUFFAGE ANTI CONDENSATION 600W 110V CHAUFFAGE ANTI CONDENSATION 1KW 230V CHAUFFAGE ANTI CONDENSATION 1KW 110V FEMALE SCREW LOCK,4-40 UNC-2A,12.7MM CONNECTOR,D SUB,RECEPTACLE,37POS BACKSHELL,D-SUB,DE,9POS,NYLON CONNECTOR,MICRO D,RECEPTACLE,37POS JACKSCREW,2-56 UNC-2A,9.2MM CONNECTOR,MICRO D,RECEPTACLE,9POS PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 BOITIER POUR RASPBERRY PI BLANC BOITIER POUR RASPBERRY PI NOIR BOITIER POUR RASPBERRY PI CLAIR TV 6C 6#22D SKT RECP,TV01RW-9-35SB AC-DC CONV,ENCLOSED,1 O/P,300W,8.8A,36V MODEM GPRS GSM EDGE GPRS FXT009+ANTENNE+ALIMENTATION CABLES MINICARD 3G 4BAND UMTS HSPA GPS MINICARD 3G 4BAND HSPA+21 GPS MODULE GPRS GSM EDGE QUADRUPLE BANDE MODULE 3G HSDPA DOUBLE BAND DATA MODULE 3G DOUBLE BAND VOICE+GPS EVAL 3G UP SOCKET POUR SL808X MODEM KIT GPRS USB ANTENNE MODEM KIT GPRS RS232 ANTENNE MODULE GPS SIRF STAR1V ANTENNE CARTE APPLICATION GPS UC430 MODULE GPS FAIBLE PWR PATCH ANTENNE GPS APPLICATION CARTE POUR IT500 MODULE GPS FAIBLE PWR PATCH ANTENNE GPS APPLICATION CARTE POUR UP500 GPS APPLICATION CARTE POUR UP501 GPS APPLICATION CARTE POUR IT430 GPS APPLICATION CARTE POUR IT520 MODULE GPS SIRFSTAR1V FAIBLE PUISSANCE GPS APP CARTE GLONASS GALILEO IT600 ANTENNE 2.4/5.8GHZ MT VIS PUCK ANTENNE GPRS GSM SCREW MT PUCK ANTENNE GPRS GSM SCREW MT FLAT ANTENNE 3G GPRS GSM RUBAN MT ANTENNE PCB QUADRUPLE BAND MMCX CONN ANTENNE PCB QUADRUPLE BAND U.FL CONN DONGLE USB BLUETOOTH 4.0 FAIBLE PUISS MODULE BLUETOOTH CHIP ANT LONG RANGE MODULE BLUETOOTH CHIP ANTENNE HCI KIT D´EVAL BLUETOOTH WT41 LONG RANGE CARTE D´EVAL BLUETOOTH WT21 CLASSE 1 ANTENNE 3G GPRS GSM ANTENNE 3G GPRS GSM AMPLI OP 5.5VIN 80KHZ 5SOT23 AMPLI OP 5.5VIN 80KHZ 5SC70 AMPLI OP 5.5VIN 80KHZ 5SOT23 AMPLI OP RAIL/RAIL 5.5VIN 300KHZ 5SOT23 AMPLI OP RAIL/RAIL 5.5VIN 300KHZ 5SC70 AMPLI OP RAIL/RAIL 5.5VIN 300KHZ 5SOT23 LDO 16VIN 0.25A 1.2V 2% 3SOT223 LDO 16VIN 0.25A 1.5V 2% 3SOT223 LDO 16VIN 0.25A 3.3V 2% 3SOT223 LDO 16VIN 0.25A 5V 2% 3SOT223 MAGNIFIER,LAMP,90 LED,4.25´´ LENS,UK CONNECTEUR PUSH-IN FIL 2VOIES ROUGE ELEMENT CHAUFFANT 60W AT938D + AT60D ELEMENT CHAUFFANT 560W AT850D ELEMENT CHAUFFANT 50W AT8502D ELEMENT CHAUFFANT 550W AT8502D ELEMENT CHAUFFANT 540W AT853A JUMPER FFC 14 VOIES 30V DIODE SBR 60V 3A DPAK DIODE SUPPRESSOR 5KW CONTACT PCB BROCHE SIMPLE 1.3MM DIA HORLOGE TEMPS BOBINE DE 14 SOIC REGULATEUR 5V SOIC 8 REGULATEUR 1.8-6V SOT223-6 ENCODEUR/DECODEUR IRDA MICROCONTROLEUR 32 BITS 66MHZ 196 LBGA MICROPROCESSEUR Z180 68 PLCC LED 1206 BLEU 140MCD 473NM LED CMS PLCC2 ROUGE LED CMS PLCC2 ROUGE LED 7 SEGMENT 0.3 VERT CODEUR ROTATIF 2 BIT BINAIR COMMUTATEUR ROTATIF. 12POS PCB COMMUTATEUR ROTATIF SPDT PCB CAP 10MM BLANC CAP 10MM RED CAP 10MM JAUNE CAP 10MM VERT CAP 10MM BLEU CAP 10MM GRIS DUCT PVC SUPERFLEX 5M SOCKET DIL 8 VOIES 0.3MM CONNECTEUR ASSY PLU 50 VOIES CONNECTEUR FFC 1MM THT 14VOIES LATCH LOCKING CHAMP-LOK CORDON KEYCARTE 4 CORE COILED LOGIC IC,NTE74LS197 IC,QUAD NAND GATE,2I/P,SOIC-14 IC,ANALOG MUX/DMUX,8 X 1,SOIC-16 IC,ANALOG SWITCH,QUAD,SPST,SOIC-14 IC,ANALOG MUX/DMUX,8 X 1,SOIC-16 IC,MONO MULTIVIBRATOR,21NS,SOIC-16 LED,GREEN,2MM X 4MM,3.7MCD IC,VOLT REF,2.5V,20ppm/°C,5mV,TO-92 CONTROL STATION,PUSHBUTTON,SPST-NO/SPST-NC CONTROL STATION,SPST-NO/SPST-NC CONTROL STATION,MUSHROOM BUTTON,SPST-NO/SPST-NC CONTROL STATION,PUSHBUTTON,2NO/2NC CONTROL STATION,PUSHBUTTON,2NO/2NC CONTROL STATION,PUSHBUTTON,1NO/1NC CONTROL STATION,PUSHBUTTON,1NO/1NC CONTROL STATION,PUSHBUTTON,1NO/1NC CONTROL STATION,PUSHBUTTON,3NO/3NC CONTROL STATION,PUSHBUTTON,3NO/3NC CONTROL STATION,PUSHBUTTON,1NO/2NC CONTROL STATION,PUSHBUTTON,1NO/2NC CONTROL STATION,PUSHBUTTON,2NO/2NC ENCLOSURE,PUSHBUTTON,STAINLESS STEEL,2HOLE CONNECTOR KIT DC-DC CONV,NON ISO POL,1 O/P,12W,5V to 15V IC,OP-AMP,1MHZ,0.4V/ us,SOIC-8 DC-DC CONV,LINEAR REG,1 O/P,45W,3A IC,QUAD AND GATE,2I/P,SOIC-14 DC-DC CONV,LINEAR REG,1 O/P,45W,3A IC,1I/P,SINGLE,VOLT TRANSLATOR,6-SC-70 IC,D-TYPE FLIP FLOP,3-STATE,TSSOP-20 IC,OCTAL D-LATCH,3-STATE,SOIC-20 IC NON INVERTING BUS TRANSCEIVER TSSOP48 IC,ADJ LINEAR REG,1.2V TO 32V,SOT89-3 IC,OP-AMP,3MHZ,1.7V/ us,DIP-8 DATA LOGGER,8500000 READINGS POWER CORD,NEMA 5-15P C13,9.84FT,10A,GREY IC,INTERFACE,SOT IC,STEP-DOWN CONVERTER,8-SOIC INDUCTANCE GATE DRIVE 317UH 1500V CMS INDUCTANCE GATE DRIVE 264UH 1500V CMS INDUCTANCE GATE DRIVE 350UH 1500V CMS INDUCTANCE GATE DRIVE 473UH 1500V CMS INDUCTANCE FLYBACK 100UH +/-10% EFD15 INDUCTANCE FLYBACK 100UH +/-10% EFD15 INDUCTANCE FLYBACK 40UH +/-10% EFD20 INDUCTANCE FLYBACK 40UH +/-10% EFD20 INDUCTANCE FLYBACK 22UH +/-10% EFD25 INDUCTANCE FLYBACK 22UH +/-10% EFD25 IC,4BIT BUS TRANSCEIVER,QFN-16 IC,VIDEO DECODER,9BIT,30MSPS,TQFP-32 IC,ANALOG MUX/DMUX,DUAL 4 X 1,SOIC-16 IC,ANALOG MUX/DMUX,TRI 2 X 1,SOIC-16 IC,ANALOG MUX/DMUX,TRI 2 X 1,TSSOP-16 IC,OP-AMP,1MHZ,1V/ us,SOIC-8 IC,HIGH SPEED COMP,SINGLE,115NS SOIC8 IC,DIFF LINE TRANSCEIVER,VSSOP-8 IC NON INVERTING BUS BUFFER GATE TSSOP14 IC,DUAL BUSS BUFFER,TRISTATE,SSOP-8 LOGIC IC,SINGLE 2:1 MUX,US8 IC,NON INVERTING BUFFER,SSOP-8 IC,MICROPOWER COMP,DUAL,1.1 uS,DIP-8 IC,LINEAR VOLTAGE REGULATOR,5V,TO-92 IC,LINEAR VOLT REGULATOR,12V,SOT-89-3 IC,CURRENT MODE PWM CTRL,25V,8-SOIC DARLINGTON TRANSISTOR ARRAY,NPN,7,50V,SOIC TERMINAL BLOCK JUMPER,2WAY,11.1MM IC,LDO VOLT REG,5V,0.8A,SOT-223-4 POWER CORD,NEMA 5-15P C13,9.84FT,13A,GREY POWER CORD,NEMA 5-15P C19,9.84FT,15A POWER CORD,NEMA 5-15P C13,15FT,15A,GREY POWER CORD,NEMA 5-15P C13,20FT,10A,GREY POWER CORD,NEMA 5-15P C13,20FT,13A,GREY POWER CORD,NEMA 5-15P C13,20FT,15A,GREY FAST RECOVERY DIODE,8A,1KV,TO-220AC CATE 5E COUPLER,RJ45 JACK 8POS TO RJ45 JACK 8POS CATE 5E COUPLER,RJ45 JACK 8POS TO RJ45 JACK 8POS CATE 6 COUPLER,RJ45 JACK 8POS TO RJ45 JACK 8POS CATE 6 COUPLER,RJ45 JACK 8POS TO RJ45 JACK 8POS LED,MCPCB,12,NEUTRAL WHITE,4000K LED,MCPCB,12,WARM WHITE,3000K LED,VIOLET,395NM LED,VIOLET,400NM LED,VIOLET,410NM LED,ULTRA VIOLET,365NM LED,VIOLET,395NM LED,VIOLET,400NM LED,VIOLET,405NM LED,VIOLET,410NM LED,10W,MCPCB,NEUTRAL WHITE,4000K LED,10W,MCPCB,WARM WHITE,3000K CONTROL STATION,1POS,ZINC 6DF INERTIAL MEASUREMENT UNIT,7-32V MEMORY SOCKET,SIM CARD,6POS PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 PANEL MOUNT INDICATOR,LED,0.31 INCAND INDICATOR,12V,80mA,WIRE LEADED EMETTEUR CO2 DUCT MOUNT INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED INCAND INDICATOR,28V,40mA,WIRE LEADED INCAND INDICATOR,12V,80mA,WIRE LEADED EMETTEUR CO2 HUMIDITE TEMP INCAND INDICATOR,28V,40mA,WIRE LEADED EMETTEUR CO2 HUMIDITE TEMP LED RPL BULB WARM WHITE T-6 CAND EMETTEUR CO2 HUMIDITE TEMP COMMUTATEUR CO2 TELAIRE MONTAGE MURAL EMETTEUR CO2 DUCT MOUNT 8 INCH EMETTEUR CO2 HUMIDITE TEMP EMETTEUR CO2 HUMIDITE TEMP EMETTEUR CO2 HUMIDITE TEMP EMETTEUR CO2 HUMIDITE TEMP EMETTEUR HUMIDITE TEMP EMETTEUR HUMIDITE TEMP W/ AFFICHEUR CONTROLEUR CO2 TELAIRE PORTABLE KIT DATALOGGER POUR T7000 SERIES Pushbutton Switch ALIMENTATION 12W SIMPLE SORTIE ALIMENTATION 96W SIMPLE SORTIE ALIMENTATION 150W SIMPLE SORTIE ALIMENTATION 240W SIMPLE SORTIE ALIMENTATION 240W SIMPLE SORTIE ALIMENTATION 240W SIMPLE SORTIE ALIMENTATION 240W SIMPLE SORTIE ALIMENTATION 20W SIMPLE SORTIE ALIMENTATION 35W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 18W SIMPLE SORTIE ALIMENTATION 100W SIMPLE SORTIE ALIMENTATION 100W SIMPLE SORTIE ALIMENTATION 30W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 100W SIMPLE SORTIE ALIMENTATION 20W SIMPLE SORTIE ALIMENTATION 30W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE ALIMENTATION 60W SIMPLE SORTIE DRIVER DE LED AC-DC CC 1.3A 48V WIRE-BOARD CONNECTOR,HEADER,10POS,2MM TRANSISTOR & IC MOUNT,0.35MM,NYLON 6.6 LED MOUNT,NYLON 6.6 TRANSISTOR MOUNT,0.365MM,NYLON 6.6 LED HOLDER,BLACK,3MM LED SENSOR,PHOTOELECTRIC SWITCH,700MM,NPN SENSOR,PHOTOELECTRIC SWITCH,700MM,NPN SENSOR,PHOTOELECTRIC SWITCH,700MM,NPN SENSOR,PHOTOELECTRIC SWITCH,700MM,PNP SENSOR,PHOTOELECTRIC SWITCH,700MM,PNP SENSOR,PHOTOELECTRIC SWITCH,2.5M,NPN SENSOR,PHOTOELECTRIC SWITCH,2.5M,PNP SENSOR,PHOTOELECTRIC SWITCH,2.5M,PNP SENSOR,PHOTOELECTRIC SWITCH,10M,NPN SENSOR,PHOTOELECTRIC SWITCH,10M,PNP LED HOLDER,BLACK,5MM LED LIGHT PIPE,SINGLE,CIRCULAR,PANEL LED HOLDER,0.3 LED HOLDER,BLACK,3MM LED LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,DUAL,CIRCULAR,PCB LIGHT PIPE,QUAD,CIRCULAR,PCB LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,RECTANGULAR,PCB LIGHT PIPE,SINGLE,CIRCULAR,PCB LED,GREEN,460MCD,525NM LED,AMBER,6MCD,607NM LED,RED,15MCD,643NM LED MOUNT,NYLON 6.6 LED,ROUND,3MM,RED/GRN,6MCD,625/568NM LED MOUNT,NYLON 6.6 TRANSISTOR MOUNT,0.345MM,NYLON 6.6 LIGHT PIPE,SINGLE,RECTANGULAR,PCB LED,GREEN,15MCD,565NM DUAL IN-LINE MOUNT,NYLON 6.6 LIGHT PIPE,SINGLE,CIRCULAR,PANEL TRANSISTOR MOUNT,0.345MM,NYLON 6.6 LED,ROUND,3MM,RED/GRN,6MCD,625/568NM TRANSISTOR & IC MOUNT,0.34MM,NYLON 6.6 LED MOUNT,NYLON 6.6 LED INDICATOR,3MM,GREEN,25MCD,568NM LED INDICATOR,3MM,RED,2MCD,700NM LED,DOME,5MM,RED/GRN/BLU,635/525/470NM LED,PURPLE,T-1 3/4 (5MM),400NM LED HOLDER,0.312 LIGHT PIPE,SINGLE,CIRCULAR,PCB LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LED,DOME,4.6MM,RED/BLU,635/470NM LED,DOME,5MM,RED/BLU,635/470NM LED,RED,600MCD,635NM LED,RED,5MM,2CD,635NM LED,DOME,RED/GRN/BLU,635/525/470NM LED,DOME,4.6MM,RED/GRN,4/5CD,635/525NM LED,DOME,5MM,RED/GRN,1.5/2CD,635/525NM LED,PURPLE,T-1 (3MM),390NM LED,PURPLE,T-1 (3MM),390NM LED,PURPLE,T-1 (3MM),400NM LED,PURPLE,T-1 (3MM),405NM LED,PURPLE,T-1 3/4 (5MM),390NM LED,PURPLE,T-1 3/4 (5MM),390NM LED,PURPLE,T-1 3/4 (5MM),395NM LED,PURPLE,T-1 3/4 (5MM),400NM LED,PURPLE,T-1 3/4 (5MM),405NM LED,ROUND,3MM,RED/GRN,65MCD,635/568NM TRANSISTOR MOUNT,NYLON 6.6 LED,ROUND,5MM,RED/GRN,4/6MCD,625/568NM LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,RECTANGULAR,PCB LIGHT PIPE,SINGLE,RECTANGULAR,PCB LIGHT PIPE,SINGLE,CIRCULAR,PCB LIGHT PIPE,SINGLE,RECTANGULAR,PCB LIGHT PIPE,SINGLE,RECTANGULAR,PCB LIGHT PIPE,SINGLE,CIRCULAR,PCB TRANSISTOR MOUNT,0.345MM,NYLON 6.6 LED HOLDER,BLACK,5MM LED LED INDICATOR,3MM,GREEN,30MCD,565NM LEAD,PLUNGER TO BNC MALE,12 LEAD,ALLIGATOR CLIP TO BNC MALE,300V LEAD,ALLIGATOR CLIP TO BNC MALE,300V CABLE,COAXIAL,RG58C/U,1.2M,BLK TEST LEAD ASSEMBLY,BNC PLUG TEST LEAD ASSEMBLY,BNC PLUG LEAD,ALLIGATOR CLIP TO BNC MALE,300V LEAD,ALLIGATOR CLIP TO BNC MALE,300V LEAD,ALLIGATOR CLIP TO BNC MALE,300V LEAD,ALLIGATOR CLIP TO BNC MALE,300V LEAD,ALLIGATOR CLIP TO BNC MALE,300V CABLE,COAXIAL,RG58C/U,0.3M,BLK CABLE,COAXIAL,RG58C/U,0.6M,BLK CABLE,COAXIAL,RG58C/U,0.9M,BLK CABLE,COAXIAL,RG58C/U,1.2M,BLK CABLE,COAXIAL,RG58C/U,1.5M,BLK CABLE,COAXIAL,RG58,0.3M,BLK CABLE,COAXIAL,RG58,1.2M,BLK SENSOR,PHOTOELECTRIC SWITCH,2.5M,NPN SENSOR,PHOTOELECTRIC SWITCH,10M,PNP LED,ROUND,3MM,RED/GRN,30MCD,625/568NM LIGHT PIPE,SINGLE,CIRCULAR,PANEL LED HOLDER,BLACK,RWXD RECT LED SENSOR,PHOTOELECTRIC SWITCH,2.5M,NPN LIGHT PIPE,SINGLE,CIRCULAR,PANEL SWITCH,KEY OPERATED,SPST-NO,10A,240V SWITCH,KEY OPERATED,DPST-NO,10A,240V SWITCH,KEY OPERATED,DPST-NO,10A,240V PANEL MOUNT INDICATOR,LED,22MM,GREEN,120V PANEL MOUNT INDICATOR,LED,22MM,RED,120V PANEL MOUNT INDICATOR,LED,22MM,RED,24V SWITCH,SELECTOR,SPST-NO,10A,240V,SCREW SWITCH,SELECTOR,DPST-NO,10A,240V,SCREW SWITCH,SELECTOR,DPST-NO,10A,240V,SCREW SWITCH,KEY OPERATED,SPST-NO,10A,240V PANEL MOUNT INDICATOR,LED,22MM,AMBER,120V PANEL MOUNT INDICATOR,LED,22MM,GREEN,120V PANEL MOUNT INDICATOR,LED,22MM,AMBER,24V PANEL MOUNT INDICATOR,LED,22MM,GREEN,24V PANEL MOUNT INDICATOR,LED,22MM,RED,24V PANEL MOUNT INDICATOR,LED,22MM,AMBER,120V PANEL MOUNT INDICATOR,LED,22MM,GREEN,120V PANEL MOUNT INDICATOR,LED,22MM,AMBER,24V PANEL MOUNT INDICATOR,LED,22MM,GREEN,24V PANEL MOUNT INDICATOR,LED,22MM,RED,24V SWITCH,SELECTOR,SPST-NO,10A,240V,SCREW OPERATOR INTERFACE,LCD MONO,320 X 240 STARTER KIT,AUTOMATION & PROCESS CONTROL STARTER KIT,TOUCHSCREEN,TFT LCD STARTER KIT,TOUCHSCREEN,TFT LCD STARTER KIT,TOUCHSCREEN,TFT LCD STARTER KIT,TOUCHSCREEN,TFT LCD STARTER KIT,TOUCHSCREEN,TFT LCD LED INDICATOR,3MM,RED/GRN,30MCD,635/568NM TRANSISTOR MOUNT,NYLON 6.6 ADAPTER,SMD FLEXIBLE LIGHT PIPE CAPACITOR MOUNT,300 SERIES CAPACITOR CONNECTOR,BACKPLANE,HEADER,54POS CONNECTOR,BACKPLANE,HEADER,96POS CONNECTOR,BACKPLANE,HEADER,54POS LED HOLDER,0.3 LED MOUNT,NYLON 6.6 LIGHT PIPE,SINGLE,CIRCULAR,PANEL LEAD,BNC PLUG TO END WIRE,48 TRANSISTOR MOUNT,NYLON 6.6 TRANSISTOR & IC MOUNT,0.375MM,NYLON 6.6 LEAD,ALLIGATOR CLIP TO BNC MALE,300V LEAD,PLUNGER TO BNC MALE,24 LIGHT PIPE,SINGLE,CIRCULAR,PCB TRANSISTOR MOUNT,0.345MM,NYLON 6.6 LED MOUNT,NYLON 6.6 TRANSISTOR MOUNT,0.345MM,NYLON 6.6 TRANSISTOR MOUNT,0.345MM,NYLON 6.6 SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD TRANSISTOR MOUNT,0.365MM,NYLON 6.6 CABLE,COAXIAL,RG58,1.8M,BLK GUIDE MODULE,7.2MM,RCPT TRANSISTOR MOUNT,0.28MM,NYLON 6.6 SENSOR,PHOTOELECTRIC SWITCH,10M,NPN DIODE TVS 10V UNI SMA DIODE TVS 11V UNI SMA DIODE TVS 12V UNI SMA DIODE TVS 13V UNI SMA DIODE TVS 14V UNI SMA DIODE TVS 15V UNI SMA DIODE TVS 9V UNI SMA MOSFET 75V 75A PQFN MOSFET DOUBLE CANAL N 100V 2.9A PQFN MOSFET DOUBLE CANAL N 30V 10A PQFN MOSFET CANAL N 30V 8.2A 6TSOP MOSFET CANAL N 20V 80A 8PQFN MOSFET 40V 50A PQFN MOSFET CANAL P 30V 8.5A 6PQFN MOSFET CANAL N 30V 8.3A 6TSOP MOSFET CANAL N 500V 3.5A D-PAK MOSFET CANAL N 500V 3.5A D-PAK IGBT IGNITION CANAL N 365V 20A D2PAK IGBT IGNITION CANAL N 350V 20A DPAK IGBT 1200V 15A TO247 IGBT 1200V 20A TO247 IGBT 1200V 25A TO247 MOSFET CANAL N 52V 9A DPAK MOSFET PROTECTED LSD DPAK DIODE SCHOTTKY DOUBLE 30A 120V D2PAK DIODE SCHOTTKY DOUBLE 30A 100V D2PAK DIODE SCHOTTKY DOUBLE 20A 120V I2PAK DIODE SCHOTTKY DOUBLE 30A 120V I2PAK DIODE SCHOTTKY DOUBLE 40A 120V I2PAK DIODE SCHOTTKY DOUBLE 30A 100V TO220 DIODE SCHOTTKY DOUBLE 30A 80V TO220 DIODE SCHOTTKY DOUBLE 20A 120V TO220 DIODE SCHOTTKY DOUBLE 30A 120V TO220 DIODE SCHOTTKY DOUBLE 40A 120V TO220 DIODE SCHOTTKY DOUBLE 20A 100V TO220 DIODE SCHOTTKY DOUBLE 20A 100V TO220 DIODE SCHOTTKY DOUBLE 30A 100V TO220 DIODE SCHOTTKY DOUBLE 30A 80V TO220 DIODE SCHOTTKY DOUBLE 20A 100V TO220 DIODE SCHOTTKY DOUBLE 20A 120V TO220 DIODE SCHOTTKY DOUBLE 20A 100V TO220 DIODE SCHOTTKY DOUBLE 30A 120V TO220 DIODE SCHOTTKY DOUBLE 30A 100V TO220 DIODE SCHOTTKY DOUBLE 20A 120V TO220 DIODE SCHOTTKY DOUBLE 30A 120V TO220 MOSFET 30V 60A PPAKSO-8 MOSFET 30V 50A PPAKSO-8 MOSFET 30V 40A PPAKSO-8 DIODE REC 600V 30A TO-247AC DIODE REC 1200V 30A TO-247AC MOSFET CANAL N 100V 190A SOT-227 MOSFET CANAL N 100V 68A D2PAK MOSFET CANAL N 40V 120A D2PAK MOSFET CANAL N 60V 120A D2PAK MOSFET CANAL N 80V 120A D2PAK MOSFET CANAL N 80V 120A D2PAK MOSFET CANAL N 30V 120A D2PAK MOSFET CANAL N 30V 100A D2PAK MOSFET CANAL N 30V 100A D2PAK MOSFET CANAL N 30V 100A D2PAK MOSFET CANAL N 30V 100A D2PAK MOSFET CANAL N 30V 100A D2PAK MOSFET CANAL N 30V 30A D2PAK MOSFET CANAL N 40V 100A D2PAK MOSFET CANAL N 40V 100A D2PAK MOSFET CANAL N 40V 100A D2PAK MOSFET CANAL N 60V 100A D2PAK MOSFET CANAL N 60V 100A D2PAK MOSFET CANAL N 80V 100A D2PAK MOSFET CANAL N 80V 100A D2PAK MOSFET CANAL N 100V 100A D2PAK MOSFET CANAL N 100V 61.8A TO220F MOSFET CANAL N 100V 55A TO220F MOSFET CANAL N 100V 44.2A TO220F MOSFET CANAL N 100V 35.2A TO220F MOSFET CANAL N 100V 32.1A TO220F MOSFET CANAL N 100V 23.4A TO220F NUMERO DE SERIE SILICON 5-SOT23 MULTIMETRE NUMERIQUE PORTABLE TRMS TRANSISTOR PNP 45V 1A SOT1061 TRANSISTOR PNP 45V 1A SOT1061 TRANSISTOR PNP 45V 1A SOT1061 TRANSISTOR PNP 60V 1A SOT1061 TRANSISTOR PNP 60V 1A SOT1061 TRANSISTOR PNP 60V 1A SOT1061 TRANSISTOR PNP 80V 1A SOT1061 TRANSISTOR PNP 80V 1A SOT1061 TRANSISTOR PNP 80V 1A SOT1061 TRANSISTOR NPN 45V 1A SOT1061 TRANSISTOR NPN 45V 1A SOT1061 TRANSISTOR NPN 45V 1A SOT1061 TRANSISTOR NPN 60V 1A SOT1061 TRANSISTOR NPN 60V 1A SOT1061 TRANSISTOR NPN 60V 1A SOT1061 TRANSISTOR NPN 80V 1A SOT1061 TRANSISTOR NPN 80V 1A SOT1061 TRANSISTOR NPN 80V 1A SOT1061 TRANSISTOR NPN 20V 2A SOT1061 TRANSISTOR NPN 20V 2A SOT1061 TRANSISTOR PNP 20V 2A SOT1061 TRANSISTOR PNP 20V 2A SOT1061 TRANSISTOR PNP 20V 2A SOT1061 TRANSISTOR NPN 45V 0.1A SOT883B TRANSISTOR PNP 45V 0.1A SOT883B TRANSISTOR NPN 15V 0.5A SOT883B MOSFET CANAL N 60V 450MA SOT883B MOSFET CANAL N 30V 5.7A SOT457 DIODE ESD 0.6PF SOT1165 DIODE ESD 0.85PF SOD962 DIODE SCHOTTKY 40V 1A SOD128 DIODE SCHOTTKY 40V 2A SOD128 DIODE TVS UNI 10V 600W SOD128 DIODE TVS UNI 11V 600W SOD128 DIODE TVS UNI 12V 600W SOD128 DIODE TVS UNI 13V 600W SOD128 DIODE TVS UNI 14V 600W SOD128 DIODE TVS UNI 16V 600W SOD128 DIODE TVS UNI 17V 600W SOD128 DIODE TVS UNI 18V 600W SOD128 DIODE TVS UNI 20V 600W SOD128 DIODE TVS UNI 22V 600W SOD128 DIODE TVS UNI 26V 600W SOD128 DIODE TVS UNI 28V 600W SOD128 DIODE TVS UNI 36V 600W SOD128 DIODE TVS UNI 3.3V 600W SOD128 DIODE TVS UNI 40V 600W SOD128 DIODE TVS UNI 43V 600W SOD128 DIODE TVS UNI 45V 600W SOD128 DIODE TVS UNI 48V 600W SOD128 DIODE TVS UNI 51V 600W SOD128 DIODE TVS UNI 54V 600W SOD128 DIODE TVS UNI 58V 600W SOD128 DIODE TVS UNI 60V 600W SOD128 DIODE TVS UNI 64V 600W SOD128 DIODE TVS UNI 6.5V 600W SOD128 DIODE TVS UNI 7V 600W SOD128 DIODE TVS UNI 7.5V 600W SOD128 DIODE TVS UNI 8V 600W SOD128 DIODE TVS UNI 8.5V 600W SOD128 DIODE TVS UNI 9V 600W SOD128 COMPTEUR DE PARTICULE ATMOSPHERIQUES MODULE IGBT 600V 83A MTP MODULE IGBT 600V 70A MTP MODULE IGBT 600V EMIPAK2 MODULE IGBT 600V 60A EMIPAK2 MODULE IGBT 600V 100A INT-A-PAK MODULE IGBT 600V 300A INT-A-PAK MODULE IGBT 600V 400A INT-A-PAK MODULE IGBT 600V 100A SOT-227 MODULE IGBT 600V 108A INT-A-PAK MODULE IGBT 600V 209A INT-A-PAK MODULE IGBT 1200V 80A MTP MODULE IGBT 1200V 80A MTP MODULE IGBT 1200V 48A PFC MTP MODULE IGBT 1200V 100A INT-A-PAK MODULE IGBT 1200V 75A INT-A-PAK MODULE IGBT 1200V 50A 4PACK MODULE IGBT 1200V 75A SOT-227 MODULE IGBT 1200V 75A SOT-227 MODULE IGBT 1200V 75A 4PACK MESUREUR DE VIBRATION ENCLOSURE,PUSHBUTTON,PLASTIC,1HOLE ENCLOSURE,PUSHBUTTON,PLASTIC,2HOLE CONTROL STATION,PUSHBUTTON,1NO/2NC CONTROL STATION,PUSHBUTTON,1NO/2NC CONTROL STATION,PUSHBUTTON,1NO/2NC DIODE SCHOTTKY 30V 200MA SOT323 DIODE ESD PROTECTION 5-LINE SOT886 DIODE ZENER 18V 320MW SOD323 DIODE ZENER 39V 250MW SOT23 TRANSISTOR NPN 45V 100MA SOT323 CONTROL STATION,PUSHBUTTON,1NO/1NC CONTROL STATION,PUSHBUTTON,2NO/2NC CONTROL STATION,1POS,YELLOW CONNECTOR,DSUB FLTR,PLUG,9POS,1000PF CONTROL STATION,PUSHBUTTON,2NO/2NC CONTROL STATION,PUSHBUTTON,2NO/2NC CONTROL STATION,PUSHBUTTON,2NO/2NC CONTROL STATION,1POS,YELLOW CONNECTOR,DSUB FLTR,PLUG,9POS,4000PF FILTERED D SUB ADAPTER,9MALE-9FEMALE FILTERED D SUB ADAPTER,9MALE-9FEMALE CONNECTOR,DSUB FLTR,RCPT,9POS,1000PF CONNECTOR,DSUB FLTR,PLUG 15POS,4000PF FILTERED D SUB ADAPTER,15MALE-15FEMALE FILTERED D SUB ADAPTER,15MALE-15FEMALE FILTERED D SUB ADAPTER,15MALE-15FEMALE CONNECTOR,DSUB FLTR,PLUG 25POS,1000PF CONNECTOR,DSUB FLTR,PLUG 25POS,4000PF FILTERED D SUB ADAPTER,25MALE-25FEMALE FILTERED D SUB ADAPTER,25MALE-25FEMALE CONNECTOR,DSUB FLTR,PLUG 25POS,4000PF CONNECTOR,DSUB FLTR,PLUG 37POS,4000PF CONTACT BLOCK,DPDT,PCB CONTACT BLOCK,3PDT,PCB CONTACT BLOCK,SPDT,SOLDER CONTACT BLOCK,SPDT,SOLDER CONTACT BLOCK,DPDT,SOLDER CONTACT BLOCK,DPDT,SOLDER CONTACT BLOCK,3PDT,SOLDER LENS,ROUND,BLACK,PUSHBUTTON SWITCH LENS,ROUND,GREEN,PUSHBUTTON SWITCH LENS,ROUND,RED,PUSHBUTTON SWITCH LENS,ROUND,AMBER,PUSHBUTTON SWITCH LENS,ROUND,GREEN,PUSHBUTTON SWITCH LENS,ROUND,RED,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH PANEL MOUNT INDICATOR,LED,16MM,AMBER,24V PANEL MOUNT INDICATOR,LED,16MM,GREEN,24V LENS,SQUARE,GREEN,PUSHBUTTON SWITCH LENS,SQUARE,RED,PUSHBUTTON SWITCH LENS,SQUARE,YELLOW,PUSHBUTTON SWITCH LENS,SQUARE,AMBER,PUSHBUTTON SWITCH LENS,SQUARE,GREEN,PUSHBUTTON SWITCH LENS,SQUARE,RED,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH LENS,RECTANGULAR,GREEN,PUSHBUTTON SWITCH LENS,RECTANGULAR,RED,PUSHBUTTON SWITCH LENS,RECTANGULAR,AMBER,PUSHBUTTON SWITCH LENS,RECTANGULAR,GREEN,PUSHBUTTON SWITCH LENS,RECTANGULAR,RED,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH ACTUATOR,16MM,PUSHBUTTON SWITCH PANEL MOUNT INDICATOR,LED,18.2MM,GREEN,24V PANEL MOUNT INDICATOR,LED,18.2MM,RED,24V PANEL MOUNT INDICATOR,LED,18.2MM,GREEN,24V ACTUATOR,16MM,PUSHBUTTON SWITCH PANEL MOUNT INDICATOR,LED,18.2MM,GREEN,24V ACTUATOR,16MM,PUSHBUTTON SWITCH PANEL MOUNT INDICATOR,LED,18.2MM,GREEN,24V LED MODULE,GREEN,12V LED MODULE,AMBER,24V LED MODULE,GREEN,24V LED MODULE,RED,24V LED MODULE,GREEN,5V SWITCH,PUSHBUTTON,SPST,10A,240V,SCREW SWITCH,PUSHBUTTON,SPST,10A,240V,SCREW SWITCH,PUSHBUTTON,SPST,10A,240V,SCREW SWITCH,PUSHBUTTON,SPST,10A,240V,SCREW SWITCH,PUSHBUTTON,SPST,10A,240V,SCREW SWITCH,PUSHBUTTON,SPST,10A,240V,SCREW MCU 32 BITS 512KB FLASH RAM 144LQFP MCU 32 BITS 1MB FLASH RAM 144LQFP MCU 32 BITS 1MB FLASH RAM 257MAPBGA MCU 32 BITS 1MB FLASH RAM 144LQFP MCU 32 BITS 1MB FLASH RAM 257MAPBGA MCU 32 BITS 1MB FLASH RAM 257MAPBGA MCU 32 BITS 1.5MB FLASH RAM 473MAPBGA MCU 32 BITS 2MB FLASH RAM 473MAPBGA MCU 32 BITS 512KB FLASH RAM 144LQFP MCU 32 BITS 1MB FLASH RAM 144LQFP MCU 32 BITS 1MB FLASH RAM 176LQFP MCU 32 BITS 2MB FLASH RAM 176LQFP MCU 32 BITS 2MB FLASH RAM 208MAPBGA MCU 32 BITS 2MB FLASH RAM 208MAPBGA MCU 32 BITS 3MB FLASH RAM 416PBGA UNSHLD SOOW CORD 4COND 16AWG 250FT 600V MCU 32 BITS 4MB FLASH RAM 416PBGA STARTER KIT,TOUCHSCREEN/PLC,TFT LCD POWER TERMINAL BLOCK,PCB,2POS,20-1AWG POWER TERMINAL BLOCK,PCB,3POS,20-1AWG POWER TERMINAL BLOCK,PCB,2POS,20-1AWG POWER TERMINAL BLOCK,PCB,3POS,20-1AWG POWER TERMINAL BLOCK,PCB,2POS,20-1AWG POWER TERMINAL BLOCK,PCB,3POS,20-1AWG CONTROL STATION,1POS,ZINC SWITCH,PENDANT STATION,DPST-NO,3A LEGEND,30x40MM,PENDANT CONTROL STATION ACTUATOR,SELECTOR SWITCH,22MM,2POS SWITCH,PENDANT STATION,SPST-NO/SPST-NC,5A SWITCH,PENDANT STATION,SPST-NO/SPST-NC,5A SWITCH,PENDANT STATION,SPST-NO/SPST-NC,5A CORDAGE,UNSHLD SOOW,4COND,10AWG,250FT,600V PUSH BUTTON PENDANT STATION,2,5A PUSH BUTTON PENDANT STATION,2,5A PUSH BUTTON PENDANT STATION,2,5A PUSH BUTTON PENDANT STATION,2,5A PUSH BUTTON PENDANT STATION,2,5A MCU,32BIT,ARM CORTEX-M0,48LQFP MCU,32BIT,ARM CORTEX-M0,32UFQFN MCU,32BIT,ARM CORTEX-M0,32UFQFN MCU,32BIT,ARM CORTEX-M0,64LQFP MCU,32BIT,ARM CORTEX-M0,64LQFP DRV8835,MOTOR DRIVER,EVAL MODULE TLV320AIC3212,AUDIO,EVAL MODULE TLV320AIC3262,CODEC,EVAL MODULE TPS51200,DDR MEMORY,EVAL MODULE TPS54260,DC/DC,BUCK,EVAL MODULE TPS61042,LED DRIVER,EVAL MODULE COMPUTER CABLE,INFINIBAND,1M COMPUTER CABLE,INFINIBAND,7M COMPUTER CABLE,INFINIBAND,1M COMPUTER CABLE,INFINIBAND,1M COMPUTER CABLE,INFINIBAND,3M COMPUTER CABLE,INFINIBAND,1M,BLACK COMPUTER CABLE,INFINIBAND,3M,BLACK EVAL KIT,ZSPM4011,SYNC BUCK CONV EVAL KIT,ZSPM4012,SYNC BUCK CONV EVAL KIT,ZSPM4013,SYNC BUCK CONV CABLE ASSEMBLY,RF,N STRAIGHT PLUG,6´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,12´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,18´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,24´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,36´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,48´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,6´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,12´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,24´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,36´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,48´´ MULTIMETER,DIGITAL,CLAMP,5 DIGIT CABLE ASSEMBLY,RF,N STRAIGHT PLUG,48´´ CONTROLLER,MOTOR,8BIT,8MHZ,28DIP BUCK,SYNCH,100VIN,0.6A,ADJ,8LLP LDO,REG,30VIN,0.1A,3.3V,SMD LDO,REG,15VIN,ADJ,+/-0.2%,3TO252 MONITOR,UV,7VIN,3VTH,5SC70 V REF,SHUNT,3V,+/-0.2%,3SOT23 V REF,SHUNT,2.5V,+/-0.1%,3TO92 BATTERY,SMART SMBUS,11.25V,2950 MAH BATTERY,SMART SMBUS,11.25V,8850 MAH BATTERY,SMART SMBUS,14.40V,6600 MAH CHARGER,SMART BATTERY,SMBUS READER,SMBUS CABLE ASSEMBLY,RF,N STRAIGHT PLUG,3´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,4´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,5´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,6´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,7´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,8´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,9´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,10´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,11´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,12´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,18´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,24´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,3´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,4´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,5´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,6´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,7´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,8´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,9´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,10´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,11´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,12´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,18´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,24´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,6´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,12´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,24´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,36´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,48´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,6´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,12´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,24´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,36´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,48´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,6´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,12´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,24´´ CABLE ASSEMBLY,RF,N STRAIGHT PLUG,36´´ SCOTCH-WELD PLASTIC & RUBBER ADHESIVE DISPLAY,OLED,PANEL,37 CM,SQUARE DISPLAY,OLED,PANEL,41CM,RECT. DISPLAY,OLED,PANEL,40 CM,ROUND DISPLAY,OLED,PANEL,39CM,TRIANGLE DISPLAY,OLED,SHORT CIRC.PROTEC. 7V DIODE,SCHOTTKY,45V,10A,TO-220AC DIODE,SCHOTTKY,45V,10A,TO-263AB DIODE,SCHOTTKY,45V,10A,ITO-220AC DIODE,SCHOTTKY,45V,20A,TO-220AC DIODE,SCHOTTKY,45V,20A,TO-263AB DIODE,SCHOTTKY,45V,20A,ITO-220AC DIODE,SCHOTTKY,45V,30A,TO-220AC DIODE,SCHOTTKY,45V,30A,ITO-220AC DIODE,SCHOTTKY,45V,40A,TO-220AC DIODE,SCHOTTKY,45V,40A,TO-263AB DIODE,SCHOTTKY,45V,40A,ITO-220AC AC-DC CONV,OPEN FRAME,3 O/P,17W,5V,15V,-15V SENSOR,TEMP,9-12BIT,3.4MHZ,8SOIC SENSOR,TEMP,9-12BIT,3.4MHZ,8MSOP SENSOR,TEMP,9-12BIT,2KB EEPROM,8SOIC SENSOR,TEMP,9-12BIT,2KB EEPROM,8MSOP SENSOR,TEMP,9-12BIT,8KB EEPROM,8SOIC SENSOR,TEMP,9-12BIT,8KB EEPROM,8MSOP DC/DC,BUCK,SYNC,1,8V,1A,16QFN DC/DC,BUCK,SYNC,3,3V,1A,16QFN DC/DC,BUCK,SYNC,5,0V,1A,16QFN DC/DC,BUCK,SYNC,ADJ,1A,16QFN DC/DC,BUCK,SYNC,1,8V,2A,16QFN DC/DC,BUCK,SYNC,3,3V,2A,16QFN DC/DC,BUCK,SYNC,5,0V,2A,16QFN DC/DC,BUCK,SYNC,ADJ,2A,16QFN DC/DC,BUCK,SYNC,1,8V,3A,16QFN DC/DC,BUCK,SYNC,3,3V,3A,16QFN DC/DC,BUCK,SYNC,5,0V,3A,16QFN DC/DC,BUCK,SYNC,ADJ,3A,16QFN DRMOS,W/ LDO,8-15VIN,50A,40PQFN DRMOS,W/O LDO,3-15VIN,50A,40PQFN DIFF AMP,RRO,5.5VIN,36MHZ,10WQFN CODEC,AUDIO,192KHZ,SPI/I2C,81WCSP CODEC,AUDIO,192KHZ,SPI/I2C,81WCSP DRIVER,MOTOR,DUAL H BRIDGE,12SON RTC,TCXO,+/-2PPM,SPI,20SOIC MODULE SERIE VERS ETHERNET 0-70DEGC MOSFET CANAL N 30V 39A LFPAK33 MOSFET CANAL N 25V 70A LFPAK33 MOSFET CANAL N 30V 70A LFPAK33 MOSFET CANAL N 30V 70A LFPAK33 MOSFET CANAL N 25V 70A LFPAK33 MOSFET CANAL N 25V 55A LFPAK33 MOSFET CANAL N 30V 50A LFPAK33 ALIMENTATION 72W MULTI PRISE SIGNAL GENERATOR,AUDIO,20KHZ WS 12/6,5 MULTICARD TERMINAL MARKER,540 PC(S) DIODE TVS 10V 600W SLIMSMA DIODE TVS 11V 600W SLIMSMA DIODE TVS 12V 600W SLIMSMA DIODE TVS 12V 600W SLIMSMA DIODE TVS 13V 600W SLIMSMA DIODE TVS 5.0V 600W SLIMSMA DIODE TVS 6.0V 600W SLIMSMA DIODE TVS 6.5V 600W SLIMSMA DIODE TVS 7.5V 600W SLIMSMA DIODE TVS 8.0V 600W SLIMSMA DIODE TVS 8.5V 600W SLIMSMA STEPPER MOTOR SNAP ACTION SWITCH,PIN PLUNGER,SPDT,6A,250VAC LED LUXEON A 2700K CARTE ON STAR LED REBEL STAR ES CW200 @ 700MA LED LUXEON REBEL STAR NW100 LED REBEL STAR ES NW200 @ 700MA LED LXW8-PW35 ON STAR MCPCB LED LXW9-PW27 ON STARCARTE LED REBEL ES 3000K CARTE ON STAR SRAM 1MBIT PARALLEL 10NS 32SOJ SRAM 1MBIT PARALLEL 10NS 32TSOP SRAM 4MBIT PARALLEL 10NS 36SOJ SRAM 4MBIT PARALLEL 4NS 100TQFP SRAM 8MBIT PARALLEL 45NS 44TSOP SRAM 8MBIT PARALLEL 45NS 44TSOP SRAM 9MBIT PARALLEL 3.5NS 100TQFP SRAM 16MB PARALLEL 10NS 119BGA SRAM 16MB PARALLEL 10NS 54TSOP SRAM 18MBIT PARALLEL 3.4NS 100TQFP SRAM,18MBIT,PARALLEL,3.4NS,100TQFP SRAM 18MBIT PARALLEL 8.5NS 100TQFP SRAM 18MBIT PARALLEL 3.4NS 100TQFP SRAM 18MBIT PARALLEL 3.4NS 100TQFP SRAM 256KB PARALLEL 25NS 100TQFP NVSRAM 256KB 25NS 32SOIC NVRAM 256KBIT 45NS 32SOIC TRANSISTOR DARLINGTON NPN TO-220 FUSIBLE PHOTOVOLTAIQUE 10A 10X38MM 600V FUSIBLE PHOTOVOLTAIQUE 15A 10X38MM 600V FUSIBLE PHOTOVOLTAIQUE 20A 10X38MM 600V FUSIBLE PHOTOVOLTAIQUE 15A 10X38MM 1000V FUSIBLE PHOTOVOLTAIQUE 16A 10X38MM 1000V FUSIBLE PHOTOVOLTAIQUE 20A 10X38MM 1000V BIPOLAR TRANSISTOR,PNP,-80V,TO-126 EVAL PICCOLO C2000 LAUNCHPAD ADAPTATEUR OEM BLUETOOTH PORT 411I ADAPTATEUR OEM BLUETOOTH PORT 433I TRX 10/100MBPS ENET PHY 48LQFP TRX 10/100MBPS ENET PHY 48LQFP CONTROLEUR ETNET 10/100M PHY 48LQFP CONTROLEUR ETNET 10/100M PHY 100LQFP CONTROLEUR ETNET 10/100M PHY 128LQFP COMMUTATEUR PORT ETHERNET 64LQFP CARTE D´EVALUATION DM9000 MODULE RF TRANSCEIVER 433MHZ MODULE RF TRANSCEIVER 868MHZ KIT DEMO 1G RC1180-RC232 MODULE TRANSCEIVER 433MHZ RC232 MODULE TRANSCEIVER 868MHZ RC232 KIT DEMO 868MHZ RC232 HP MODULE TRANSCEIVER 868MHZ HP MODULE TRANSCEIVER 2.45G RC232 HP KIT DEMO 2.45G RC232 HP MODULE WLAN W/ SERIE INTERFACE FUSIBLE 1A 6.3X32MM TIME LAG AXIAL FUSIBLE 1.25A 6.3X32MM TIME LAG AXIAL FUSIBLE 1.6A 6.3X32MM TIME LAG AXIAL FUSIBLE 2.5A 6.3X32MM TIME LAG AXIAL FUSIBLE 3.15A 6.3X32MM TIME LAG AXIAL FUSIBLE 4A 6.3X32MM TIME LAG AXIAL FUSIBLE 5A 6.3X32MM TIME LAG AXIAL FUSIBLE 6.3A 6.3X32MM TIME LAG AXIAL FUSIBLE 8A 6.3X32MM TIME LAG AXIAL POT COND PLASTIC,10KOHM 10%,500mW LED OSLON SSL BLEU 80 LED OSLON SSL VERT 80 LED OSLON SSL JAUNE 80 LED OSLON SSL JAUNE 80 LED OSLON SSL AMBRE 80 LED OSLON SSL AMBRE 80 LED OSLON SSL AMBRE 80 LED OSLON SSL ROUGE 80 LED OSLON SSL HYPER ROUGE 80 LED OSLON SSL DEEP BLEU 150 LED OSLON SSL BLEU 150 LED OSLON SSL JAUNE 150 LED OSLON SSL JAUNE 150 LED OSLON SSL AMBRE 150 LED OSLON SSL AMBRE 150 LED OSLON SSL AMBRE 150 LED OSLON SSL ROUGE 150 LED OSLON SSL ROUGE 150 LED OSLON SSL HYPER ROUGE 150 LED OSLON SSL HYPER ROUGE 150 LED OSLON NOIR DEEP BLEU 120 LED OSLON NOIR BLEU 120 LED OSLON NOIR TRUE VERT 120 LED OSLON NOIR JAUNE 120 LED OSLON NOIR AMBRE 120 LED OSLON NOIR ROUGE 120 LED TOPLED NOIR WITH LENTILLE VERDE 30 LED TOPLED NOIR WITH LENTILLE JAUNE 30 LED TOPLED NOIR WITH LENTILLE ORANGE 30 LED TOPLED NOIR LENTILLE TRU.VERT 60 LED TOPLED NOIR WITH LENTILLE JAUNE 60 LED OSTAR FLAT WINDOW ULTRA COOL BLANC LED OSTAR FLAT WINDOW RGBW ELECTRICAL AC POWER CONNECTOR,RECEPTACLE,20A DSC 32 BITS MC56F84 100MHZ 100LQFP DSC 32 BITS MC56F84 100MHZ 64LQFP DSC 32 BITS MC56F84 100MHZ 80LQFP ELECTRICAL AC POWER CONNECTOR,PLUG,20A ELECTRICAL AC POWER CONNECTOR,PLUG,15A ELECTRICAL AC POWER CONNECTOR,RECEPTACLE,15A ELECTRICAL AC POWER CONNECTOR,PLUG,15A ELECTRICAL AC POWER CONNECTOR,RECEPTACLE,15A ELECTRICAL AC POWER CONNECTOR,PLUG,20A ELECTRICAL AC POWER CONNECTOR,PLUG,20A ELECTRICAL AC POWER CONNECTOR,RECEPTACLE,20A ELECTRICAL AC POWER CONNECTOR,RECEPTACLE,20A ELECTRICAL AC POWER CONNECTOR,PLUG,30A ELECTRICAL AC POWER CONNECTOR,RECEPTACLE,30A MICRO32 BITS KINETIS 256K 100LQFP MICRO32 BITS KINETIS 512K 144LQFP MICRO32 BITS KINETIS 128K 64LQFP MICRO32 BITS KINETIS 256K 80LQFP MICRO32 BITS KINETIS 256K 100LQFP MICRO32 BITS KINETIS 256K 100LQFP MICRO32 BITS KINETIS 512K 100LQFP MICRO32 BITS KINETIS 512K 144LQFP MICRO32 BITS KINETIS 256K 100LQFP MICRO32 BITS KINETIS 256K 121MAP MICRO32 BITS KINETIS 512K 144LQFP MICRO32 BITS KINETIS 512K 144MAP MICRO32 BITS KINETIS 512K 144MAP MICRO32 BITS KINETIS 512K 144LQFP MICRO32 BITS KINETIS 256K 144MAP MICRO32 BITS KINETIS 256MAPBGA MICRO32 BITS KINETIS 256MAPBGA MICRO32 BITS KINETIS 256MAPBGA MICRO32 BITS QORIVVA 4M 176LQFP MICRO32 BITS QORIVVA 4M 176LQFP MICRO32 BITS QORIVVA 4M 324TEPBGA MICRO32 BITS QORIVVA 4M 324TEPBGA KIT D´EVAL MPC564XA 176LQFP MINI KIT D´EVAL MPC564XA 324PBGA MINI KIT D´EVAL MPC564XA 176LQFP KIT D´EVAL MPC564XA 324PBGA CARTE MERE XPC56X SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC,SMD SWITCH,TACTILE,SPST-NO,50mA,12VDC SWITCH,TACTILE,SPST-NO,50mA,12VDC SWITCH,TACTILE,SPST-NO,50mA,12VDC MICRO32 BITS ARM7TDMI-S 128K 64LQFP MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 32HVQFN MICRO32 BITS ARM CORTEX-M0 32HVQFN MCU,32BIT,ARM CORTEX-M0,48LQFP MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 64LQFP MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 32HVQFN MICRO32 BITS ARM CORTEX-M0 32HVQFN MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 64LQFP MICRO32 BITS ARM CORTEX-M0 32HVQFN MICRO32 BITS ARM CORTEX-M0 32HVQFN MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 64LQFP MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 48LQFP MICRO32 BITS ARM CORTEX-M0 64LQFP MICRO32 BITS ARM CORTEX-M0 64LQFP CABLE USB A M - MICRO B M 1.8M ALIMENTATION AC/DC 600W SIMPLE SORTIE ALIMENTATION AC/DC 600W SIMPLE SORTIE ALIMENTATION AC/DC 600W SIMPLE SORTIE ALIMENTATION AC/DC 600W SIMPLE SORTIE ALIMENTATION AC/DC 600W SIMPLE SORTIE ALIMENTATION AC/DC 45W TRIPLE SORTIE ALIMENTATION AC/DC 720W SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE DRIVER DE LED AC/DC SIMPLE SORTIE ALIMENTATION AC/DC 250W SIMPLE SORTIE ALIMENTATION AC/DC 250W SIMPLE SORTIE ALIMENTATION AC/DC 250W SIMPLE SORTIE ALIMENTATION AC/DC 250W SIMPLE SORTIE ALIMENTATION AC/DC 250W SIMPLE SORTIE ALIMENTATION AC/DC 250W SIMPLE SORTIE OSCILLOSCOPE PC 250MHZ OSCILLOSCOPE PC 250MHZ AWG EDITOR OSCILLOSCOPE PC 350MHZ OSCILLOSCOPE PC 350MHZ AWG EDITOR OSCILLOSCOPE PC 500MHZ OSCILLOSCOPE PC 500MHZ AWG EDITOR RF/COAXIAL,TNC PLUG,R/A,50 OHM,CRIMP RF/COAXIAL,10KV HIGH VOLTAGE PLUG,STR,CRIMP RF/COAXIAL,BNC PLUG,R/A,50 OHM,CRIMP/SOLDER COMPUTER CABLE,INFINIBAND,5M CONV A/N 14 BITS +/5V 400KSPS 16SOIC CONV A/N 12 BITS 5VIN 250KSPS 8SOIC CONV A/N 16 BITS 5VIN 250KSPS 8MSOP CONV A/N 16 BITS 5VIN 250KSPS 8SOIC CONV A/N 2CH 16 BITS 5VIN 250KSPS 10MSOP CONV AN 8V 16 BITS 2.5VIN 175KSPS 16SSOP ADC,8CH,16BIT,2.5VIN,175KSPS,16SSOP CONV A/N 16 BITS 3.3VIN 10MSPS 48QFN CONV A/N 16 BITS 3.3VIN 130MSPS 64QFN CONV A/N 14 BITS 3VIN 65MSPS 64QFN CONV A/N 16 BITS 2.5VIN 250KSPS 16DFN CONV A/N 24BIT 5.5VIN 50/60HZ REJ 8SOIC CONV A/N 16CH 16 BITS 5.5VIN W/OSC 38QFN AMPLI DIFF 3VIN 600MHZ 1200V/US 16QFN AMPLI OP DOUBLE +/-5V 5.6MHZ 8SOIC AMPLI OP QUADRUPLE +/-15V 25MHZ 16SOIC AMPLI OP DOUBLE 16 BITS 90MHZ 8SOIC AMPLI OP E/S RAIL/RAIL 44VIN 1.2MHZ 8DFN AMPLI OP E/S RAIL/RAIL 12.6VIN 80MHZ 8SO AMPLI OP E/S RAIL 12.6VIN 325MHZ 6TSOT23 AMPLI OP RRO DOUBLE +/-5V 3MHZ 8SOIC ECHANTILLONNEUR BLOQUEUR +/5+/-18V 8SOIC DRIVER MOSFET 13.5VIN 3A 8MSOP ANNEAU DE COURANT 18V 16DFN ANNEAU DE COURANT 18V 16MSOP ANNEAU DE COURANT 18V 16DFN ANNEAU DE COURANT 18V 16MSOP REG BUCK 42VIN 2.2MHZ 0.75A 3.3V 10DFN REG BUCK 42VIN 2.2MHZ 0.75A 5V 10DFN REG BUCK 42VIN 2.2MHZ 0.75A 3.3V 10MSOP REG BUCK 42VIN 2.2MHZ 0.75A 3.3V 10DFN REG BUCK 42VIN 2.2MHZ 0.75A 5V 10DFN REG BUCK 42VIN 2.2MHZ 0.75A 3.3V 10MSOP REG BUCK 42VIN 2.2MHZ 0.75A 5V 10MSOP POMPE DE CHARGE INV 32VIN 500KHZ 14DFN POMPE DE CHARGE INV 32VIN 500KHZ 16MSOP POMPE DE CHARGE INV 32VIN 500KHZ 12MSOP BUCK SYNCH 65VIN 0.5A AJUSTABLE 16DFN BUCK SYNCH 65VIN 0.5A AJUSTABLE 16DFN BUCK/BUCK/BOOST TRIPLE 38VIN 38TSSOP BUCK/BUCK/BOOST TRIPLE 38VIN 38QFN BUCK/BUCK/BOOST TRIPLE 38VIN 38TSSOP BUCK/BUCK/BOOST TRIPLE 38VIN 38QFN REGULATEUR BUCK 35VIN 100KHZ 1.2A 20SOIC DC/DC 25VIN 1.5A 500KHZ 8SOIC REGULATEUR BUCK 40VIN 200KHZ 0.7A 8SOIC REG BUCK 60VIN 500KHZ 1.5A AJUST 16SSOP DRIVER DE LED 36VIN 1A 16TSSOP INVERSEUR BOOST 2A 42V 2.5MHZ 8MSOP BUCK/BOOST NIVEAU TRNSLTR 1MHZ 16SSOP REG BUCK 5.5VIN 1.5MHZ 0.6A 5TSOT23 REG BUCK 5.5VIN 2.25MHZ 0.8A 16QFN REG BUCK DOUBLE 5.5VIN 4MHZ 3A 24QFN REG BUCK DOUBLE SYNCH 24VIN 780KHZ 28QFN REG BUCK DOUBLE SYNCH 38VIN 900KHZ 32QFN UMODULE BUCK 20VIN 12A 118BGA UMODULE BUCK 5.5VIN 15A 133LGA UMODULE BUCK 5.5VIN 15A 133LGA REG BUCK 36VIN 8A EN550022B 133LGA UMODULE BUCK DOUBLE 5.5VIN 4A 144LGA UMODULE BUCK 36VIN 2A 2.4MHZ 50BGA UMODULE BUCK 36VIN 5A 1MHZ 81LGA REG BUCK 36VIN 1MHZ AJUSTABLE 81LGA REG BUCK 36VIN 1MHZ AJUSTABLE 81LGA REGULATEUR LDO 3A 1% AJUSTABLE 3TO220 REGULATEUR LDO 20VIN 100KHZ 0.5A 12DFN REG LDO 20VIN 100KHZ 0.5A 5V 12DFN REGULATEUR LDO 20VIN 100KHZ 2.5V 5D2PAK REGULATEUR LDO 20VIN 100KHZ 2.5V 3SOT223 BOUTON POUSSOIR CNTRL 26.4VIN 8TSOT23 CONTRL DIODE IDEALE DOUBLE 18VIN 16DFN CONTRL DIODE IDEALE DOUBLE 18VIN 16MSOP CONTRL DIODE IDEALE DOUBLE 18VIN 16DFN LIMIT DE PUISS 80VIN -60V PROT 10MSOP LIMIT DE PUISS 80VIN -60V PROT 16SOIC LIMIT DE PUISS 80VIN -60V PROT 10MSOP CONTROLEUR HOT SWAP 16.5VIN 6SOT23 CNTRL 36VIN 500KHZ AJUSTABLE 16TSSOP CONTROLEUR BUCK 36VIN 150KHZ 16SSOP CONTROLEUR BUCK 36VIN 0.8VREF 16SSOP CHARGEUR DE BATTERIES 32VIN 2A 77LGA CONTR 6 I/P 1.5-3.3V 2XAJUSTABLE 8TSOT23 CONTROLEUR 3 I/P 3.3V/AJUST/AJUS 8TSOT23 CAPTEUR TEMP CONTROLEUR DOUBLE 20QFN VREF MICROPUISSANCE 2.5V +/-0.020V 3TO92 REF DE TENSION 4.5V 0.2% 3PPM/C 8SOIC LDO VREF 18VIN 2.5V 0.05% 6TSOT23 LDO VREF 18VIN 2.5V 0.1% 6TSOT23 REF TENS 36VIN 2.048V +/-0.05% 6TSOT23 RF/COAXIAL,N PLUG,STR,50 OHM,CRIMP RF/COAXIAL,BNC PLUG,STR,50 OHM,CRIMP BIPOLAR TRANSISTOR,NPN,45V,TO-92 STATION SOUDAGE DIG. 230V EU/UK DRIVER HEX T-HANDLE 5/32 ALIMENTATION FORTIMO DRIVER 1100-2000 ALIMENTATION FORTIMO DRIVER 1100-2000 ALIMENTATION XITANIUM 25W 0.3-0.7A 36V I ALIMENTATION XITANIUM 45W 200-700MA 80V ALIMENTATION XITANIUM 25W 0.3-0.7A 36V ALIMENTATION XITANIUM 25W 0.3-1A 36V ALIMENTATION XITANIUM 25W 0.3-1A 36V TD CABLE FORTIMO DLM CABLE 1100-2000 CABLE DLM 60CM WITHOUT PROT.EARTH LED FORTIMO TDLM 1100 18W 840 LED FORTIMO TDLM 1100 20W/827 SUPPORT DE LAMPE FORTIMO TDLM LED FORTIMO SLM 1100 17W/835 14MM CABLE FORTIMO SLM 60CM CABLE FORTIMO SLM 25 CM CABLE FORTIMO LLM 25CM ALIMENTATION LEXEL DLM MODULE 1100 ALIMENTATION LEXEL DLM DRIVER 1100 CABLE LEXEL DLM 1100 ALIMENTATION XITANIUM 50W 0.3-1A 62V LED,FORTIMO,SLM 2000 25W,840 L19 G2 LED FORTIMO SLM 2000 29W 827 L19 G2 TERMINAL BLOCK,BARRIER,1POS,16-10AWG TERMINAL BLOCK,BARRIER,2POS,14-2AWG TERMINAL BLOCK,BARRIER,2POS,16-10AWG TERMINAL BLOCK,BARRIER,3POS,14-2AWG TERMINAL BLOCK,BARRIER,3POS,16-10AWG TERMINAL BLOCK,BARRIER,4POS,14-2AWG TERMINAL BLOCK,BARRIER,4POS,16-10AWG TERMINAL BLOCK,BARRIER,1POS,14-4AWG TERMINAL BLOCK,BARRIER,2POS,14-4AWG TERMINAL BLOCK,BARRIER,2POS,14-2AWG TERMINAL BLOCK,BARRIER,3POS,14-2AWG TERMINAL BLOCK,BARRIER,3POS,14-4AWG INDUCTANCE 0201 0.1NH +/-0.2NH INDUCTANCE 0201 0.2NH +/-0.2NH INDUCTANCE 0201 0.3NH +/-0.2NH INDUCTANCE 0201 0.4NH +/-0.2NH INDUCTANCE 0201 0.5NH +/-0.2NH INDUCTANCE 0201 0.6NH +/-0.2NH INDUCTANCE 0201 0.7NH +/-0.2NH INDUCTANCE 0201 0.8NH +/-0.2NH INDUCTANCE 0201 0.9NH +/-0.2NH INDUCTANCE 0201 1.0NH +/-0.2NH INDUCTANCE 0201 1.1NH +/-0.2NH INDUCTANCE 0201 1.2NH +/-0.2NH INDUCTANCE 0201 1.3NH +/-0.2NH INDUCTANCE 0201 1.4NH +/-0.2NH INDUCTANCE 0201 1.5NH +/-0.2NH INDUCTANCE 0201 1.6NH +/-0.2NH INDUCTANCE 0201 1.7NH +/-0.2NH INDUCTANCE 0201 1.8NH +/-0.2NH INDUCTANCE 0201 1.9NH +/-0.2NH Panel for Junction Boxes INDUCTANCE 0201 2.0NH +/-0.2NH INDUCTANCE 0201 2.1NH +/-0.2NH INDUCTANCE 0201 2.2NH +/-0.2NH INDUCTANCE 0201 2.3NH +/-0.2NH INDUCTANCE 0201 2.4NH +/-0.2NH INDUCTANCE 0201 2.5NH +/-0.2NH INDUCTANCE 0201 2.6NH +/-0.2NH INDUCTANCE 0201 2.7NH +/-0.2NH INDUCTANCE 0201 2.8NH +/-0.2NH INDUCTANCE 0201 2.9NH +/-0.2NH INDUCTANCE 0201 3.0NH +/-0.2NH Perforated Panel for Enclosures INDUCTANCE 0201 3.1NH +/-0.2NH INDUCTANCE 0201 3.2NH +/-0.2NH INDUCTANCE 0201 3.3NH +/-0.2NH INDUCTANCE 0201 3.4NH +/-0.2NH INDUCTANCE 0201 3.5NH +/-0.2NH INDUCTANCE 0201 3.6NH +/-0.2NH INDUCTANCE 0201 3.7NH +/-0.2NH INDUCTANCE 0201 3.8NH +/-0.2NH INDUCTANCE 0201 3.9NH +/-0.2NH INDUCTANCE 0201 4.0NH +/-0.2NH INDUCTANCE 0201 4.4NH +/-0.2NH Panel for Enclosures INDUCTANCE 0201 4.7NH +/-0.2NH INDUCTANCE 0201 4.9NH +/-0.2NH INDUCTANCE 0201 5.6NH 2% INDUCTANCE 0201 6.1NH 2% INDUCTANCE 0201 6.8NH 2% INDUCTANCE 0201 8.2NH 2% INDUCTANCE 0201 9.1NH 2% INDUCTANCE 0201 9.2NH 2% INDUCTANCE 0201 10NH 2% ENCLOSURE,WALL MOUNT,STEEL,GRAY Panel for Enclosures RESISTANCE 33R 1W 5% RESISTANCE 68R 1W 5% RESISTANCE 680R 1W 5% RESISTANCE 15R 3W 5% RESISTANCE 33R 3W 5% RESISTANCE 47R 3W 5% RESISTANCE 68R 3W 5% ENCLOSURE,INSTRUMENT,STEEL,GRAY RESISTANCE 100R 3W 5% RESISTANCE 150R 3W 5% RESISTANCE 220R 3W 5% RESISTANCE 680R 3W 5% RESISTANCE 1K5 3W 5% ENCLOSURE,INSTRUMENT,STEEL,GRAY RESISTANCE 22R 5W 5% RESISTANCE 150R 5W 5% RESISTANCE 330R 5W 5% RESISTANCE 470R 5W 5% RESISTANCE 680R 5W 5% RESISTANCE 1K0 5W 5% RESISTANCE 1K5 5W 5% RESISTANCE 2K2 5W 5% RESISTANCE 3K3 5W 5% RESISTANCE 4K7 5W 5% RESISTANCE 10R 7W 5% RESISTANCE 15R 7W 5% RESISTANCE 22R 7W 5% RESISTANCE 33R 7W 5% RESISTANCE 47R 7W 5% RESISTANCE 68R 7W 5% RESISTANCE 150R 7W 5% ENCLOSURE,INSTRUMENT,STEEL,GRAY RESISTANCE 220R 7W 5% RESISTANCE 330R 7W 5% RESISTANCE 470R 7W 5% RESISTANCE 680R 7W 5% RESISTANCE 1K0 7W 5% RESISTANCE 1K5 7W 5% RESISTANCE 2K2 7W 5% RESISTANCE 3K3 7W 5% RESISTANCE 4K7 7W 5% RESISTANCE 10R 9W 5% RESISTANCE 15R 9W 5% ENCLOSURE,INSTRUMENT,STEEL,GRAY RESISTANCE 22R 9W 5% RESISTANCE 33R 9W 5% RESISTANCE 47R 9W 5% RESISTANCE 68R 9W 5% RESISTANCE 150R 9W 5% RESISTANCE 220R 9W 5% RESISTANCE 330R 9W 5% RESISTANCE 470R 9W 5% RESISTANCE 680R 9W 5% RESISTANCE 1K0 9W 5% ENCLOSURE,INSTRUMENT,STEEL,GRAY RESISTANCE 1K5 9W 5% RESISTANCE 2K2 9W 5% RESISTANCE 3K3 9W 5% RESISTANCE 4K7 9W 5% RESISTANCE 6K8 9W 5% RESISTANCE 10K 9W 5% RESISTANCE 15K 9W 5% RESISTANCE 10R 1W 5% SMALL RESISTANCE 15R 1W 5% SMALL ENCLOSURE,JUNCTION BOX,STEEL,GRAY RESISTANCE 15R 3W 5% SMALL RESISTANCE 33R 3W 5% SMALL ENCLOSURE,JUNCTION BOX,STEEL,GRAY RESISTANCE 100R 3W 5% SMALL RESISTANCE 150R 3W 5% SMALL RESISTANCE 1K5 3W 5% SMALL RESISTANCE 22R 5W 5% SMALL RESISTANCE 150R 5W 5% SMALL RESISTANCE 680R 5W 5% SMALL ENCLOSURE,JUNCTION BOX,STEEL,GRAY RESISTANCE 1K5 5W 5% SMALL RESISTANCE 2K2 5W 5% SMALL RESISTANCE 15R 7W 5% SMALL RESISTANCE 22R 7W 5% SMALL RESISTANCE 33R 7W 5% SMALL RESISTANCE 47R 7W 5% SMALL RESISTANCE 68R 7W 5% SMALL RESISTANCE 150R 7W 5% SMALL RESISTANCE 220R 7W 5% SMALL RESISTANCE 330R 7W 5% SMALL RESISTANCE 470R 7W 5% SMALL RESISTANCE 680R 7W 5% SMALL RESISTANCE 2K2 7W 5% SMALL RESISTANCE 4K7 7W 5% SMALL ENCLOSURE,JUNCTION BOX,STEEL,GRAY RESISTANCE 10R 9W 5% SMALL RESISTANCE 15R 9W 5% SMALL RESISTANCE 22R 9W 5% SMALL RESISTANCE 33R 9W 5% SMALL RESISTANCE 47R 9W 5% SMALL RESISTANCE 68R 9W 5% SMALL RESISTANCE 100R 9W 5% SMALL RESISTANCE 150R 9W 5% SMALL RESISTANCE 220R 9W 5% SMALL RESISTANCE 330R 9W 5% SMALL RESISTANCE 470R 9W 5% SMALL RESISTANCE 680R 9W 5% SMALL RESISTANCE 1K0 9W 5% SMALL RESISTANCE 1K5 9W 5% SMALL RESISTANCE 2K2 9W 5% SMALL RESISTANCE 3K3 9W 5% SMALL RESISTANCE 4K7 9W 5% SMALL RESISTANCE 6K8 9W 5% SMALL RESISTANCE 10K 9W 5% SMALL CONDENSATEUR 2200UF 10V CONDENSATEUR 3300UF 10V CONDENSATEUR 4700UF 10V CONDENSATEUR 1000UF 16V CONDENSATEUR 2200UF 16V CONDENSATEUR 3300UF 16V CONDENSATEUR 3300UF 16V CONDENSATEUR 4700UF 16V CONDENSATEUR 1000UF 25V CONDENSATEUR 1000UF 25V CONDENSATEUR 2200UF 25V ENCLOSURE,JUNCTION BOX,STEEL,GRAY CONDENSATEUR 2200UF 25V CONDENSATEUR 3300UF 25V CONDENSATEUR 220UF 35V CONDENSATEUR 330UF 35V CONDENSATEUR 1000UF 35V CONDENSATEUR 1000UF 35V CONDENSATEUR 2200UF 35V ENCLOSURE,JUNCTION BOX,STEEL,GRAY ENCLOSURE,JUNCTION BOX,STEEL,GRAY CONDENSATEUR 3.3UF 50V CONDENSATEUR 22UF 50V CONDENSATEUR 100UF 50V CONDENSATEUR 330UF 50V ENCLOSURE,JUNCTION BOX,STEEL,GRAY CONDENSATEUR 470UF 50V CONDENSATEUR 1000UF 50V CONDENSATEUR 33UF 63V CONDENSATEUR 220UF 63V CONDENSATEUR 220UF 63V CONDENSATEUR 330UF 63V CONDENSATEUR 330UF 63V ENCLOSURE,JUNCTION BOX,STEEL,GRAY CONDENSATEUR 470UF 63V ECLATEUR A GAZ TUBE 2P 800V 20% ECLATEUR A GAZ TUBE 2P 1200V 20% ECLATEUR A GAZ TUBE 2P 1500V 20% ECLATEUR A GAZ TUBE 2P 1600V 20% ECLATEUR A GAZ TUBE 2P 1200V 20% ECLATEUR A GAZ TUBE 2P 2500V 20% ECLATEUR A GAZ TUBE 2P 2700V 20% ECLATEUR A GAZ TUBE 2P 800V 20% ECLATEUR A GAZ TUBE 2P 1600V 20% ECLATEUR A GAZ TUBE 2P 2500V 20% ECLATEUR A GAZ TUBE 2P 2700V 20% ECLATEUR A GAZ TUBE 2P 3500V 20% ECLATEUR A GAZ TUBE 3P 230V 20% ECLATEUR A GAZ TUBE 3P 420V 20% ECLATEUR A GAZ TUBE 3P 230V 20% ECLATEUR A GAZ TUBE 3P 420V 20% THERMOMETRE INFRAROUGE -30 A 500°C THERMOMETRE INFRAROUGE -30 A 650°C MONITOR/TABLE MAT INTERCONNECT CORD ENCLOSURE,JUNCTION BOX,STEEL,GRAY ENCLOSURE,JUNCTION BOX,STEEL,GRAY ENCLOSURE,JUNCTION BOX,STEEL,GRAY CAPACITOR SUPER,0.05F,5.5V,0.16 OHM +80 -20% ENCLOSURE,JUNCTION BOX,STEEL,GRAY CONNECTOR SEAL ENCLOSURE,JUNCTION BOX,STAINLESS STEEL FUSE,PTC RESET,60V,100mA,1812 IC,LDO VOLT REG,3.3V,250mA,MSOP-8 ENCLOSURE,JUNCTION BOX,STAINLESS STEEL CAPACITOR TANT,4.7UF,35V,3 OHM,0.1,RAD PLUG & SOCKET HOUSING,PLUG,NYLON ENCLOSURE,JUNCTION BOX,STAINLESS STEEL HEAT-SHRINK WIRE MARKING SLEEVES,1.765IN W TERMINAL,RING TONGUE,1/4IN,CRIMP IC,OP-AMP,3.9GHZ,950V/ us,SOIC-8 N CHANNEL MOSFET,60V,65A,TO-220 FUSE,PTC RESET,60V,1.1A,RADIAL HARNESS BOARD NAILS FUSE,PTC RESET,30V,125mA,1206 REED RELAY,SPST-NO,5VDC,0.5A,THD PROXIMITY SENSOR SENSOR,FLOAT SWITCH,0-10BAR,STEEL SENSOR,FLOAT SWITCH,0-10BAR,STEEL COMPUTER CABLE,USB 2.0,132MM,BLACK TVS DIODE,1.5KW,220V,DO-201 CONTACT,PIN,24-22AWG,CRIMP WIRE-BOARD CONNECTOR,HEADER,20POS,1MM WIRE-BOARD CONNECTOR HEADER 2POS,1.25MM WIRE-BOARD CONN,RECEPTACLE,2POS,2MM CAT5E ETHERNET COUPLER,PLUG,8WAY PANEL RF/COAXIAL,BNC PLUG,STR,50OHM,CABLE CAPACITOR PEN FILM 1UF,100V,5%,2824 TERMINAL BLOCK,DIN,EARTH,2POS,12-2AW RECTIFIER,STANDARD,3A,600V,AXIAL USB Digital Isolator Eval. Board INLET,PLUG,IEC C14,6A,PANEL CC2530,ZIGBEE,2.4GHZ,W / ANTENNA,DEV KIT PIN HEADER,5POS,5.08MM PIC18 Development Kit END/INTERMED PLATE,1.5MMW,SAK SERIES FAST RECOVERY DIODE,1A,50V,DO-41 IC,EEPROM,64KBIT,SERIAL,3MHZ,SOIC-8 IC,FLASH,128MBIT,104MHZ,WSON-8 IC,LDO REGULATOR,1A IC,PROG SHUNT V-REF,2.495V,1%,TO-92 INDUCTOR,SHIELDED,15UH,5.6A,SMD THERMOCOUPLE USB DATA LOGGER GENDER CHANGER,USB TYPE A-B/TYPE B-A FUSE HOLDER,IN LINE RESISTOR,THICK FILM,226KOHM,333MW,1% LED,HIGH POWER,RED/GREEN/BLUE/WHITE WIRE-BOARD CONNECTOR RECEPTACLE 20POS,2.54MM CAPACITOR ALUM ELEC,22UF,35V,20%,SMD COMPUTER CABLE,USB 2.0,132MM,BLACK IC,ADJ LDO REG 1.24V TO 29V 0.1A 8-SOIC DC/DC Converter SSR,PANEL MOUNT,280VAC,32VDC,10A POWER SUPPLY CONN,FUSED POWER ENTRY MODULE,PLUG 10A SWITCH,KEYPAD,1X4,10mA,24V,ABS IC,DAC,16BIT,500KSPS,SSOP-28 PLUG & SOCKET HOUSING,PLUG,NYLON SSR,PANEL MOUNT,280VAC,32VDC,75A SSR,PANEL MOUNT,660VAC,32VDC,125A PLUG & SOCKET HOUSING,NYLON TVS DIODE ARRAY,504W,12V,SOT-23 IC,LOW VOLTAGE COMP,DUAL,300NS MSOP-8 CABLE CLAMP,SIZE 16/16S,ZINC ALLOY STM32 Value Line Discovery Kit THERMAL TRANSFER PRINTER RIBBON,BLK,3.27IN W MEMORY SOCKET,SO-DIMM,200POS IC,BUCK-BOOST CONVERTER,SON-10 MICRO-D CONNECTOR,PLUG,15POS,WIRE LEADS RECEPTACLE PROTECTION CAP,METAL OSCILLOSCOPE 4 VOIES 60MHZ OSCILLOSCOPE 4 VOIES 60MHZ AWG OSCILLOSCOPE 4 VOIES 100MHZ OSCILLOSCOPE 4 VOIES 100MHZ AWG OSCILLOSCOPE 4 VOIES 200MHZ OSCILLOSCOPE 4 VOIES 200MHZ AWG PLUG PROTECTION CAP,METAL QUASARBRITE 0404 SMD RGB LED IC,DAC,14BIT,400MSPS,HTQFP-48 WIRE-BOARD CONNECTOR,HEADER,8POS,2MM CONTACT,FEMALE,30-22AWG,CRIMP INDUCTOR,SHIELDED,22UH,2.2A,SMD SHELL HOUSING PP15/PP30/PP45 SERIES CONN AMP SUPERSEAL 1.5 SERIES 4P CA CIR CONNECTOR PLUG SIZE 17,3POS FREE HA CAT5E ETHERNET COUPLER,PLUG,8WAY CABLE RECEPTACLE PROTECTION CAP,METAL CONTACT,SOCKET,24-18AWG,CRIMP CODE COMPOSER STUDIO,PLATINUM ED,NODE- IC,ADC,8BIT,188KSPS,SOT-23-8 PLUG PROTECTION CAP,METAL RECEPTACLE PROTECTION CAP,METAL PICkit 3 In-Circuit Debugger Only PLUG PROTECTION CAP,METAL CONTACT,PIN,30-26AWG,CRIMP WIRE-BOARD CONNECTOR,HEADER,2POS,2MM FUSE,AXIAL,4A,5 X 20MM,FAST ACTING HEAT SINK SOLDER ANCHOR PROTOTYPE PICTAIL PLUS DAUGHTER BOARD RECEPTACLE PROTECTION CAP,METAL SWITCH,PUSHBUTTON,SPDT,3A,125VAC,SOLDER LUG IC,ADC,24BIT,80SPS,SPI,SOIC16 CABLE CLAMP SIZE 10SL/12S/12,ZINC ALLOY IC,RS-485 BUS TRANSCEIVER,5.25V,SOIC8 WIRE-BOARD CONN,RECEPTACLE,8POS,2MM THERMAL MAGNETIC CIRCUIT BREAKER,2 CABLE CLAMP,SIZE 16S/16,ZINC ALLOY IC,LOAD SWITCH,5.5V,SOIC-8 WIRE-BOARD CONNECTOR HEADER 4POS,5.08MM CABLE CLAMP,SIZE 16S/16,ZINC ALLOY TVS-DIODE,600W,92V,BIDIRECTIONAL,DO-15 TVS-DIODE,600W,274V,UNIDIRECTIONAL,DO-214AA ABSOLUTE/MECHANICAL ENCODER CIRCULAR CABLE CLAMP,SIZE 18 ZINC ALLOY BIPOLAR TRANSISTOR,PNP,-100V,TO-220 DC-DC CONV,LINEAR REG,1 O/P,90W,6A RELAY HEAT SINK CABLE CLAMP,SIZE 20/22,ZINC ALLOY CABLE TIE MOUNT CABLE CLAMP,SIZE 20/22,ZINC ALLOY BOARD-BOARD CONNECTOR HEADER,16POS,2ROW LM3405AXMY EVAL BOARD CONTACT,PIN,24-28AWG,CRIMP CABLE CLAMP,SIZE 24/28,ZINC ALLOY CABLE CLAMP,SIZE 24/28,ZINC ALLOY CABLE CLAMP,SIZE 24/28,ZINC ALLOY CONNECTOR,FPC,ZIF,RCPT,36POS,1ROW IC,AUDIO POWER AMP,CLASS AB,SSOP-28 N CHANNEL MOSFET,60V,57A TO-220AB CIRCULAR CABLE CLAMP SIZE 12SL/14/14S,ZINC ALLOY P CHANNEL MOSFET,10A WIRE-BOARD CONN,RECEPTACLE,20POS,2MM CONTACT,FEMALE,30-22AWG,CRIMP IC,AUDIO CODEC,16BIT,48KHZ,TQFN-24 IC,SINGLE PORT USB POWER SWITCH,SOIC-8 FUSE,CARTRIDGE,500mA,5X20MM,SLO BLO OPTOSWITCH IC,OP-AMP,1.5MHZ,0.42V/µs,SOT-23-5 CABLE CLAMP,SIZE 20/22,ZINC ALLOY FUSE,PTC RESET,30V,2.5A,RADIAL IC,SHUNT V-REF,5V,0.5%,3-SOT-23 CABLE CLAMP,SIZE 24/28,ZINC ALLOY IC,SRAM,256KBIT,12NS,SOJ-28 WIRE-BOARD CONNECTOR RECEPTACLE,4POS,2 MALE SCREW RETAINER KIT,#4-40,5.6MM IC,BUS TXRX W/ CONFIG VOLTAGE TRANSLATION,8 OUTPUT,SSOP-24 CIRCULAR CABLE CLAMP,SIZE 32 ZINC ALLOY CIRCULAR CABLE CLAMP,SIZE 32 ZINC ALLOY CIRCUIT BREAKER,THERMAL MAGNETIC,3P,7A CIRCUIT BREAKER,THERMAL MAGNETIC,3P,15A MICRO USB TYPE AB CONN,RCPT,5POS,SMD PTC THERMISTOR,10 OHM,20%,RADIAL LEADED CIRCULAR CABLE CLAMP,SIZE 36 ZINC ALLOY PROGRAMMABLE CONVECTION TOOL,600W,240V CIRCULAR CABLE CLAMP,SIZE 18 ZINC ALLOY CABLE CLAMP,SIZE 20/22,ZINC ALLOY CAPACITOR CERAMIC,10UF,50V,X7R,20%,SMD ADAPTER,RJ45-RJ45 CABLE CLAMP,SIZE 20/22,ZINC ALLOY FUSE HOLDER,10.3MM,PANEL MOUNT CABLE CLAMP,SIZE 24/28,ZINC ALLOY WIRE-BOARD CONN,RECEPTACLE,14POS,2MM CIRCUIT BREAKER,THERMAL MAGNETIC,3P,200A CIRCUIT BREAKER,THERMAL MAGNETIC,3P,25A CIRCUIT BREAKER,THERMAL MAGNETIC,3P,150A CIRCULAR CABLE CLAMP,SIZE 32 ZINC ALLOY CIRCUIT BREAKER,THERMAL MAGNETIC,3P,50A CONNECTOR,CIRCULAR,PLUG,6POS,CABLE FUSE,11A,1KV,FAST ACTING CIRCULAR CABLE CLAMP,SIZE 36 ZINC ALLOY CABLE CLAMP,SIZE 8S/10S,ZINC ALLOY CONNECTOR,D SUB COMBO,RECEPTACLE,3POS DIP SOCKET,8POS,THROUGH HOLE DUST CAP,BRASS CIRCULAR CONNECTOR ADAPTER TERMINAL BLOCK,DIN RAIL,6POS,26-12AWG NOZZLE,CONVECTION TOOL,CSP/LGA 7MMX7MM CIRCULAR CONNECTOR ADAPTER CIRCULAR CONNECTOR ADAPTER IC,DAC,16BIT,3MSPS,TSSOP-16 FUSE,PTC RESET,6V,500mA,1206 PLUG & SOCKET CONNECTOR,RCPT,14POS,3M CIRCULAR CONNECTOR ADAPTER CIRCULAR CABLE CLAMP,SIZE 18 ZINC ALLOY IC,ADC,14BIT,48KSPS,SSOP-28 TERMINAL,FEMALE DISCONNECT,0.25IN,RED IC,OFF LINE SWITCHER,DIP-8 CABLE CLAMP,SIZE 10SL/12S,ZINC ALLOY GUIDE MODULE,9MM WIDE DAUGHTER CARD METAL OXIDE VARISTOR,102V 210V RAD HYPERFAST RECTIFIER,CMN CTHD 30A,D2PAK CONNECTOR,HEADER,10POS,2.54MM WIRE-BOARD CONNECTOR HEADER 8POS,1.25MM CIRCULAR INSERT,PIN,4WAY,SOLDER IC,NON INVERTING BUFFER,DIP-14 CIRCULAR INSERT,SOCKET,4WAY,SOLDER HUMIDITY SENSOR N CHANNEL MOSFET,100V,1.6A SOT-23 IC,AUDIO OP-AMP,8MHZ,SOIC-8 CIRCULAR INSERT,SOCKET,5WAY,SOLDER CIRCULAR INSERT,PIN,6WAY,SOLDER CIRCULAR INSERT,SOCKET,6WAY,SOLDER CIRCULAR CONTACT SOCKET,24-20AWG,CRIMP CIRCULAR INSERT,PIN,3WAY,SOLDER 4 SIL VERT MALE CONN LATCH SCR THYRISTOR,160A,1.2KV,A 21 CAT5 RJ45 MODULAR JACK,8POS,8CONTACT, IC,SERIES V-REF,2.5V,75mV,TO-52-3 CIRCULAR INSERT,SOCKET,3WAY,SOLDER CIRCULAR INSERT,PIN,2WAY,SOLDER FUSE,30A,700V,FERRULE,FAST ACTING SMALL SIGNAL DIODE 100V 200mA DO-35 IC,TIMER,SINGLE,2.1MHZ,15V,8-SOIC BOARD TO BOARD,RECEPTACLE,20POS,2ROW CIRCULAR INSERT,SOCKET,7WAY,SOLDER FUSE,RESETTABLE PTC,1206,6VDC,2A FUSE,RESETTABLE PTC,1210,6VDC,1.75A FUSE,RESETTABLE PTC,1210,6VDC,2A FUSE,RESETTABLE PTC,1812,30VDC,350mA FUSE,RESETTABLE PTC,1812,30VDC,500mA FUSE,RESETTABLE PTC,1812,12VDC,2.6A FUSE,RESETTABLE PTC,1812,6VDC,3A CIRCULAR INSERT,PIN,3WAY,SOLDER TVS-DIODE,600W,495V,UNIDIRECTIONAL,D TRAPEZIFORM HANDLE,4HP,GREY IC,LVDS BUFFER/REPEATER,TQFP-48 IC,DSC,DSPIC33,16BIT,256KB,60MIPS, BOARD-BOARD CONN,RECEPTACLE,6WAY,2ROW OPTOCOUPLER,TRANSISTOR,2500VRMS CIRCULAR INSERT,PIN,5WAY,SOLDER FUSE,TIME DELAY,800mA,250VAC,RADIAL FUSE,TIME DELAY,800mA,250VAC,RADIAL FUSE,TIME DELAY,1A,250VAC,RADIAL FUSE,TIME DELAY,1.25A,250VAC,RADIAL FUSE,TIME DELAY,1.25A,250VAC,RADIAL FUSE,TIME DELAY,1.6A,250VAC,RADIAL FUSE,TIME DELAY,1.6A,250VAC,RADIAL FUSE,TIME DELAY,2A,250VAC,RADIAL FUSE,TIME DELAY,2A,250VAC,RADIAL FUSE,TIME DELAY,2.5A,250VAC,RADIAL FUSE,TIME DELAY,3.15A,250VAC,RADIAL FUSE,TIME DELAY,4A,250VAC,RADIAL FUSE,TIME DELAY,4A,250VAC,RADIAL COVER FOR ECS25/45/60 POWER SUPPLY DC BLOWER,51 X 15MM,12V RESISTOR,THICK FILM,1.2KOHM,100mW,1% CRIMP TOOL,MOLEX INSULKRIMP TERMINALS IC,CAN TXRX,1MBPS,1/1,5.5V,SOIC-8 BOARD-BOARD CONNECTOR RECEPTACLE,20WAY,2ROW PLAQUE RECTANGULAIRE WIRE-BOARD CONNECTOR,HEADER,5POS,2MM SCR THYRISTOR,4A,600V,D-PAK CIRCULAR INSERT,PIN,10WAY,SOLDER MICRO SWITCH,ROLLER LEVER DPST 15A 250V CIRCULAR INSERT,SOCKET,10WAY,SOLDER CONNECTOR,FPC,ZIF,RCPT,4POS,1ROW CIRCULAR CONNECTOR PLUG,SIZE 13,4POS, IC,DSC,16BIT,32KB 20MHZ 5.5V BQFP-132 CIRCULAR INSERT,PIN,4WAY,SOLDER IC,EEPROM,64KBIT,SERIAL,3MHZ,DIP-8 OPTOCOUPLER,SCHMITT TRIGGER,7500V IC,LINEAR VOLTAGE REGULATOR,5V,TO-92 IC,ANALOG MULTIPLEXER,16 X 1,SOIC-28 IC,RS-485 TRANSCEIVER,3.6V,SOIC-8 CONTACT,FEMALE,30-24AWG,CRIMP IC,ANALOG SWITCH,QUAD,SPST,DIP-16 FAST DIODE,4A,600V,TO-220AC CIRCULAR INSERT,PIN,8WAY,SOLDER CIRCULAR INSERT,SOCKET,8WAY,SOLDER SENSOR,INDUCTIVE,2MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,2MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,4MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,4MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,4MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,8MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,8MM,PNP-NO,10-36VDC SENSOR,PHOTO,DIFFUSE-REFLECTIVE,1M,PNP SENSOR,PHOTO,RETRO-REFLECTIVE,5M,NPN SENSOR,PHOTO,RETRO-REFLECTIVE,5M,PNP SENSOR,PHOTO,RETRO-REFLECTIVE,6.5M,NPN SENSOR,PHOTO,THROUGH-BEAM,20M,NPN SENSOR,PHOTO,DIFFUSE-REFLECTIVE,0.8M,NPN SENSOR,PHOTO,DIFFUSE-REFLECTIVE,0.8M,PNP SENSOR,PHOTO,RETRO-REFLECTIVE,4M,NPN SENSOR,PHOTO,RETRO-REFLECTIVE,4M,PNP SENSOR,PHOTO,RETRO-REFLECTIVE,5M,NPN SENSOR,PHOTO,RETRO-REFLECTIVE,5M,PNP SENSOR,PHOTO,THROUGH-BEAM,16M SENSOR,PHOTO,THROUGH-BEAM,16M,NPN SENSOR,PHOTO,THROUGH-BEAM,16M,PNP SENSOR,PHOTO,DIFFUSE-REFLECTIVE,1M,NPN SENSOR,PHOTO,DIFFUSE-REFLECTIVE,1M,PNP SENSOR,PHOTO,RETRO-REFLECTIVE,5M,NPN CIRCULAR INSERT,PIN,4WAY,SOLDER SENSOR,PHOTO,RETRO-REFLECTIVE,5M,PNP SENSOR,PHOTO,RETRO-REFLECTIVE,6.5M,NPN SENSOR,PHOTO,RETRO-REFLECTIVE,6.5M,PNP SENSOR,PHOTO,THROUGH-BEAM,20M,NPN SENSOR,PHOTO,THROUGH-BEAM,20M,PNP PLUG & SOCKET CONN,HEADER,2POS,4.2MM CIRCULAR INSERT,SOCKET,4WAY,SOLDER IC,RTC,YY-MM-DD,256 X 8,SOIC-20 IC,RS422/RS485 LINE DRIVER 5.25V SOIC16 MICRO HDMI CONNECTOR,RCPT,19WAY,PCB POWER RELAY,4PCO,110VAC,5A,PLUG IN CIRCULAR INSERT,PIN,5WAY,SOLDER CONTACT,SOCKET,30-28AWG,CRIMP MAX2830 RF Transceiver Evaluation Kit TERMINAL,RING TONGUE,#6,CRIMP NATURAL IC,STEP-DOWN DC-DC CONV,500kHz,SOIC-8 CAPACITOR TANT,1UF,35V,AXIAL CIRCULAR INSERT,PIN,6WAY,SOLDER CIRCULAR INSERT,SOCKET,6WAY,SOLDER RF WIDEBAND TRANSISTOR,NPN,4.5V,18GHZ POWER DISTRIBUTION SWITCH,5.5V,SOT23-5 IC,8BIT BUS TRANSCEIVER,TSSOP-24 RESISTOR KIT,1206,CHIP,1/4 E96 SERIES CABLE ASSEMBLY PLUG & SOCKET HOUSING,RECEPTACLE,NYLON RF/COAXIAL,BNC STR PLUG,50OHM,CRIMP CIRCULAR INSERT,SOCKET,1WAY,SOLDER CIRCUIT BREAKER,THERMAL MAG,2P,16A LABEL,PREPRINTED,3.18MMX4.83MM,576PCS CIRCULAR INSERT,SOCKET,10WAY,SOLDER JTAG Emulator RESISTOR KIT,0402,CHIP,1/4 E96 SERIES RESISTOR KIT,0603,CHIP,1/4 E96 SERIES RESISTOR KIT,0805,CHIP,1/4 E96 SERIES RECTANGULAR HAN INSERT,PLUG,8WAY CRIMP DIP SOCKET,24POS,THROUGH HOLE CABLE CLAMP,SIZE 3,THERMOPLASTIC DIN RAIL MOUNTING KIT IC,SERIES V-REF,5V,10mV,8-SOIC CONTACT,PIN,24-18AWG,CRIMP FUSE,RESETTABLE PTC,1206,6VDC,1.75A FUSE,TIME DELAY,5A,250VAC,RADIAL STATIC CONTROL WRIST STRAP/BAND SUB-MINIATURE SOCKET,PC BOARD IC,INSTRUMENT AMP,1MHZ,130DB,SOIC-8 CONNECTOR,D SUB,RECEPTACLE,9POS WIRE TO BOARD CONNECTOR,RCPT,2POS,1ROW IC,QUAD AND GATE,2I/P,SOIC-14 CAPACITOR TANT,100UF,10V,3528-21 20% CIRCULAR INSERT,PIN,4WAY,SOLDER CAPACITOR TANT,47UF,16V,6032-28 10% CAPACITOR TANT,10UF,50V,SMD 20% SWITCH KEY CIRCULAR INSERT,SOCKET,4WAY,SOLDER RESISTOR,METAL,0.025OHM,3W,1% METAL OXIDE VARISTOR,200V 395V RAD POWER ENTRY MODULE,PLUG,20A BOARD-BOARD CONN,HEADER,10WAY,2ROW SCHOTTKY RECTIFIER,2A,100V,SMB LM3410XSDLE EVAL BOARD CIRCULAR INSERT,PIN,8WAY,SOLDER CIRCULAR INSERT,SOCKET,8WAY,SOLDER SIGNAL CONVERTER,DIN RAIL CONTACT,FEMALE,20-18AWG,CRIMP MEMORY SOCKET,SO-DIMM,200POS WIRE TO BOARD CONN,RECPT,8POS,2.5MM CAPACITOR ALUM ORGANIC 68UF,6.3V,20%,SMD N CHANNEL MOSFET,200V,52A,TO-220 CIRCUIT BREAKER,THERMAL MAG,1P,16A COMMON MODE FILTER,POWER LINE,SMD TPS2543,POWER SWITCH,USB CHARGING,EVA HOUSING,RECEPTACLE,5POS,1ROW,3.96MM IC,PRECISION VIRTUAL GROUND,TO-92-3 CIRCULAR INSERT,PIN,7WAY,SOLDER RECTIFIER MODULE,1.6KV 82A SEMIPACK 1 AXIAL FAN,119MM,230VAC,50mA USB TYPE A CONNECTOR RECEPTACLE 4POS THD CIRCULAR INSERT,SOCKET,7WAY,SOLDER CIRCULAR INSERT,PIN,9WAY,SOLDER SCHOTTKY RECTIFIER,CMN CTHD 400A TO-244 CIRCULAR INSERT,SOCKET,9WAY,SOLDER CONTACT,FEMALE,24-22AWG,CRIMP GAS DISCHARGE TUBE,150V,SMD GAS DISCHARGE TUBE,230V,SMD GAS DISCHARGE TUBE,300V,SMD GAS DISCHARGE TUBE,300V,SMD GAS DISCHARGE TUBE,350V,SMD EXTRACTION TOOL TERMINAL,BUTT SPLICE,CRIMP,RED IC,ADC,3.5BIT,DIP-40 TERMINAL,TURRET,THROUGH HOLE WiFi Comm Demo Board Wireless Connectivi PRECESSION SCREWDRIVER,PHILLIPS,170MM CIRCULAR INSERT,SOCKET,3WAY,SOLDER POWER RELAY,12VDC,5A,DPST-NO,PCB WIRE-BOARD CONNECTOR RECEPTACLE,3POS,3.96MM DC-DC CONV,NON ISO POL,1 O/P,50W,10A 24-BIT ANALOG FRONT END DEMO KIT CDCM9102,CLOCK GENERATOR,EVALUATION MODULE SPRING LATCH ASSEMBLY,D-SUB,4-40 CAPACITOR CERAMIC 0.15UF,50V,X7R,0603 CONTACT,MACHINED,PIN,24-20AWG,CRIMP IC,OP-AMP,5.8MHZ,45V/ us,DIP-8 RELAY COUPLER,SPDT,24VDC,6A,DIN RAIL WIRE-BOARD CONNECTOR HEADER 5POS,2.54MM CIRCULAR INSERT,PIN,14WAY,SOLDER TERMINAL,BLOCK FORK,STUD 6,CRIMP,YEL TERMINAL,BLOCK FORK,STUD 10,CRIMP,BLUE TERMINAL,BLOCK FORK,STUD 6,CRIMP,BLUE CIRCULAR INSERT,SOCKET,14WAY,SOLDER TERMINAL,BLOCK FORK,STUD 10,CRIMP,RED TERMINAL,BLOCK FORK,STUD 6,CRIMP,RED TERMINAL,BUTT SPLICE,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP,RED TERMINAL,FEMALE DISCONNECT,0.25 TERMINAL,FEMALE DISCONNECT,0.187 TERMINAL,FEMALE DISCONNECT,0.25 TERMINAL,FEMALE DISCONNECT,0.187 TERMINAL,FEMALE DISCONNECT,0.25 TERMINAL,FEMALE DISCONNECT,0.187 TERMINAL,FEMALE DISCONNECT,0.187 TERMINAL,MALE DISCONNECT,0.25 CIRCULAR INSERT,PIN,17WAY,SOLDER TERMINAL,RING TONGUE,STUD 6,CRIMP,YEL TERMINAL,RING TONGUE,STUD 10,CRIMP,BLUE TERMINAL,RING TONGUE,STUD 6,CRIMP,BLUE TERMINAL,RING TONGUE,STUD 10,CRIMP,RED TERMINAL,RING TONGUE,STUD 6,CRIMP,RED TERMINAL,RING TONGUE,STUD 8,CRIMP,RED TERMINAL,FORK,STUD 8,12-10AWG,CRIMP TERMINAL,RING TONGUE,1/4 TERMINAL,RING TONGUE,STUD 8,CRIMP,YEL IC,HIGH SPEED BUFFER,SGL,180MHZ SOIC8 IC HEX INVERTER SCHMITT TRIGGER TSSOP-14 IC,PLL WITH VCO,18MHZ,16-TSSOP IC LOW VOLTAGE COMP SINGLE 300NS SC-70-5 IC,DIFFERENTIAL COMP,QUAD 0.3 uS SOIC14 IC,LDO VOLT REG,5V,0.1A,5-SOT-23 IC,RS-232 TRANSCEIVER,5V,SOIC-16 IC,OP AMP,LOW POWER,45MHZ,27V/ us,30?V MSOP-8 IC,OP-AMP,5.5MHZ,2V/ us,MSOP-8 IC,I/O EXPANDER,8 BIT,100KHZ,TSSOP-20 IC,LDO SERIES V-REF 1.25V 0.15% SC-70-3 IC,RS-232 TRANSCEIVER,5.5V,TSSOP-16 IC,TRANSCEIVER,RS-485,10MBPS,SOIC-8 IC HEX INVERTER SCHMITT TRIGGER TSSOP-14 IC NON INVERTING BUS TRANSCEIVER TSSOP20 IC,8BIT SIPO SHIFT REGISTER,TSSOP-16 IC,MONO MULTIVIBRATOR,7.3NS,TSSOP-16 IC NON INVERTING BUS BUFFER GATE TSSOP14 IC,TX & LEVEL TRANS,8CKT,TSSOP-24 IC NON INVERTING BUS TRANSCEIVER TSSOP20 IC,NON INVERTING BUFFER,TSSOP-20 IC NON INVERTING BUS TRANSCEIVER TSSOP48 IC,TX & LEVEL TRANS,8CKT,TSSOP-24 IC,NON INVERTING BUFFER,SOT-553-5 IC,LOGIC,FLIP FLOP,D,5.9NS,SSOP-8 IC,16BIT D-LATCH,3-STATE,TSSOP-48 IC,LOGIC,INVERTER,DUAL,4.1ns,6-SOT-563 IC,NON INVERTING BUFFER,VSSOP-8 IC,ANALOG SWITCH,DUAL,SPDT,SSOP-8 IC,2I/P QUAD DATA SELECTOR/MUX TSSOP-16 IC,D-TYPE FLIP FLOP,3-STATE,TSSOP-20 IC,8BIT BUS TRANSCEIVER,SSOP-24 IC,NON INVERTING BUFFER,TSSOP-20 IC NON INVERTING BUS BUFFER GATE TSSOP14 IC,ANALOG MUX/DMUX,DUAL 4 X 1,TSSOP16 IC,BUS TX,DIFF,5.25V,SOIC-8 IC,MICROPOWER COMP,SINGLE,4 uS SOT23-5 IC,INTERFACE,HDMI,5.5V,TSSOP-38 IC,INTERFACE,ESD,3-SC-70 IC,POWER LOAD SWITCH,HIGH SIDE,5.5V,5-SOT-23 IC,DC-DC CONV,BUCK,570KHZ,2A,SOIC-8 IC,DC-DC CONV,BOOST,1.5MHZ,140mA,SON-8 IC,LDO VOLT REG,1.8V,150mA,SC-70-5 IC,LDO VOLT REG,3.3V,150mA,SC-70-5 IC,ADJ LDO REG 0.8V TO 3.6V 1.5A QFN-20 IC,BI-DIRECT VOLT LEVEL XLATOR,SOT23-6 IC,LEVEL TRANS,VOLT,1 I/P,1CKT,6-SOT-23 IC,LINEAR VOLT REGULATOR,8V,SOT-223-4 SENSOR,INDUCTIVE,5MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,5MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,8MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,8MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,8MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,8MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,14MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,14MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,10MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,10MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,15MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,15MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,15MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,15MM,PNP-NO,10-36VDC SENSOR,INDUCTIVE,22MM,NPN-NO,10-36VDC SENSOR,INDUCTIVE,22MM,PNP-NO,10-36VDC 22-4 (4 Contacts) Socket Insert CONTACT,FEMALE,24-22AWG,CRIMP CONTACT,PIN,24-20AWG,CRIMP HEAT SINK POWER ENTRY MODULE PLUG & SOCKET HOUSING,RECEPTACLE,NYLON SOLDERLESS TERMINAL HOUSING TERMINAL,RING TONGUE,3/8IN,CRIMP SURFACE MOUNT FUSE CAPACITOR CERAMIC 0.01UF,16V,X7R,0402 CIRCULAR INSERT,PIN,3WAY,SOLDER PLUG AND SOCKET CONNECTOR HOUSING CIRCULAR INSERT,PIN,19WAY,SOLDER HEAT SHRINK TUBING KIT,PO,10PCS,MULTI COLOR CIRCULAR INSERT,SOCKET,4WAY,SOLDER CIRCULAR INSERT,PIN,8WAY,SOLDER FUSE,SMD,1A,1206,FAST ACTING IC,ANALOG FRONT END,24BIT,100KHZ,TQFP-64 CIRCULAR INSERT,PIN,16WAY,SOLDER CIRCULAR INSERT,SOCKET,7WAY,SOLDER CIRCULAR INSERT,PIN,9WAY,SOLDER CIRCULAR INSERT,PIN,12WAY,SOLDER CIRCULAR INSERT,PIN,24WAY,SOLDER 28-1 (9 Contacts) Socket Insert CIRCULAR INSERT,SOCKET,22WAY,SOLDER CIRCULAR INSERT,PIN,26WAY,SOLDER CIRCULAR INSERT,SOCKET,26WAY,SOLDER CIRCULAR INSERT,PIN,35WAY,SOLDER CIRCULAR INSERT,SOCKET,35WAY,SOLDER CIRCULAR INSERT,PIN,14WAY,SOLDER CIRCULAR SHELL RCPT,14S,ALUMINIUM ALLOY CIRCULAR SHELL,RCPT,SIZE 20,AL ALLOY CIRCULAR SHELL RCPT,14S,ALUMINIUM ALLOY CIRCULAR SHELL RCPT,16S,ALUMINIUM ALLOY CIRCULAR SHELL,RCPT,SIZE 18,AL ALLOY CIRCULAR SHELL,RCPT,SIZE 20,AL ALLOY CIRCULAR SHELL,RCPT,SIZE 22,AL ALLOY CIRCULAR SHELL,RCPT,SIZE 24,AL ALLOY CIRCULAR SHELL,RCPT,SIZE 28,AL ALLOY CIRCULAR SHELL RCPT,14S,ALUMINIUM ALLOY CIRCULAR SHELL RCPT,16S,ALUMINIUM ALLOY CIRCULAR SHELL,RCPT,SIZE 18,AL ALLOY CIRCULAR SHELL,RCPT,SIZE 20,AL ALLOY CIRCULAR SHELL,RCPT,SIZE 22,AL ALLOY CIRCULAR SHELL PLUG,14S,ALUMINIUM ALLOY CIRCULAR SHELL PLUG,16S,ALUMINIUM ALLOY CIRCULAR SHELL,PLUG,SIZE 18,AL ALLOY CIRCULAR SHELL,PLUG,SIZE 20,AL ALLOY CIRCULAR SHELL,PLUG,SIZE 22,AL ALLOY CIRCULAR SHELL,PLUG,SIZE 24,AL ALLOY THERMOSTAT FIBRE OPTIQUE POUR 179361/362 FIBRE OPTIQUE POUR 179361/362 WELDING CABLE,250FT,4AWG CU,BLACK FUSE HOLDER,14 X 50.8MM,PANEL MOUNT CONNECTOR,POWER ENTRY,PLUG,10A CARTE DE DEV IMX6 SABRE-LITE CAPOT SUB-D DIE CAST 9VOIES CAPOT SUB-D DIE CAST 25VOIES HOOD,DSUB,35DEG,9WAY CAPOT SUB-D 35DEG 15VOIES CAPOT SUB-D 35DEG 25VOIES CAPOT SUB-D 45DEG SLIDELOCK 9VOIES CAPOT SUB-D 45DEG SLIDELOCK 15VOIES CAPOT SUB-D 45DEG SLIDELOCK 25VOIES CAPOT SUB-D 4-40 VIS 15VOIES CAPOT SUB-D 4-40 VIS 25VOIES CAPOT SUB-D 90DEG SLIDELOCK 9VOIES CAPOT SUB-D 90DEG 4-40 VIS 9VOIES CAPOT SUB-D SLIDELOCK 9VOIES MICRO-D PLUG R/A 2PORT 9VOIES MICRO-D PLUG R/A 2PORT 15VOIES EMBASE MICRO-D CAPOT CRIMP 9VOIES EMBASE MICRO-D CAPOT CRIMP 15VOIES EMBASE MICRO-D CAPOT CRIMP 25VOIES CONTACT MICRO-D EMBASE CRIMP GOLD OUTIL A SERTIR POUR 960001270L001 CABLE MICRO-D EMBASE 0.5M 15VOIES CABLE MICRO-D EMBASE 2M 15VOIES CABLE MICRO-D EMBASE 0.5M 25VOIES CABLE MICRO-D EMBASE 2M 25VOIES PRISE SUB-D THT 15VOIES EMBASE SUB-D THT 15VOIES PRISE SUB-D A SOUDER CUP 25VOIES PRISE SUB-D THT 25VOIES EMBASE SUB-D A SOUDER CUP 25VOIES EMBASE SUB-D THT 25VOIES PRISE SUB-D HD THT 15VOIES EMBASE SUB-D HD THT 15VOIES EMBASE SUB-D HD THT 26VOIES PRISE SUB-D HD THT 44VOIES EMBASE SUB-D HD A SOUDER CUP 44VOIES EMBASE SUB-D HD THT 44VOIES PRISE SUB-D HD THT 15VOIES PRISE SUB-D HD THT 15VOIES EMBASE SUB-D HD THT 26VOIES PRISE SUB-D IP67 A SOUDER 9VOIES EMBASE SUB-D IP67 A SOUDER 9VOIES EMBASE SUB-D IP67 THT 9VOIES PRISE SUB-D IP67 A SOUDER 15VOIES PRISE SUB-D IP67 THT 15VOIES EMBASE SUB-D IP67 A SOUDER 15VOIES EMBASE SUB-D IP67 THT 15VOIES PRISE SUB-D IP67 A SOUDER 25VOIES PRISE SUB-D IP67 THT 25VOIES EMBASE SUB-D IP67 A SOUDER 25VOIES EMBASE SUB-D IP67 THT 25VOIES PRISE SUB-D IP67 THT 9VOIES PRISE SUB-D IP67 THT 15VOIES PRISE SUB-D IP67 THT 25VOIES PRISE SUB-D IP67 THT 9VOIES PRISE SUB-D IP67 THT 15VOIES PRISE SUB-D IP67 THT 25VOIES PRISE SUB-D HD IP67 THT 15VOIES EMBASE SUB-D HD IP67 A SOUDER 15VOIES EMBASE SUB-D HD IP67 THT 15VOIES PRISE SUB-D HD IP67 THT 26VOIES EMBASE SUB-D HD IP67 A SOUDER 26VOIES EMBASE SUB-D HD IP67 THT 26VOIES PRISE SUB-D HD IP67 A SOUDER 44VOIES PRISE SUB-D HD IP67 THT 44VOIES EMBASE SUB-D HD IP67 A SOUDER 44VOIES PRISE SUB-D HD IP67 THT 15VOIES PRISE SUB-D HD IP67 THT 26VOIES PRISE SUB-D HD IP67 THT 44VOIES CAPOT SUB-D IP67 25VOIES CAPOT SUB-D IP67 PLASTIC 9VOIES CONNECTEUR SUB-D 9VOIES CONNECTEUR SUB-D 15VOIES CONNECTEUR SUB-D 25VOIES CONNECTEUR SUB-D 9VOIES CONNECTEUR SUB-D 25VOIES CONNECTEUR SUB-D SIMPLE 9VOIES CONNECTEUR SUB-D SIMPLE 15VOIES CONNECTEUR SUB-D SIMPLE 25VOIES IC,BUFFER AMPLIFIER,10MHz,SOIC-8 CAT5 RJ45 MODULAR JACK,8POS,8CONTACT, ZENER DIODE,200mW,3.6V,SOD-323 WIRE-BOARD CONN,HEADER,10POS,2.54MM CARTE D´EVAL LM3481 N-CH CNTRL REG CARTE D´EVAL DAC161P997 16BIT DAC CIRCUIT BREAKER,THERMAL MAGNETIC,2P 4A PIC32 I/O Expansion Board Pb-free Single 3.3V Multiprotocol Transceiver,20 SSOP,-40C 04P7576 IC,RS422,RS485,3.6V,SOIC-8 IC,RS422,RS485,3.6V,SOIC-8 ZENER DIODE,1W,5.1V,DO-41 IC,INVERTING REGULATOR,8-DIP ACCELEROMETER,MEMS,3-AXIS,DIGITAL O/P,BGA-112 RF/COAX CONN,BNC BLKHD JACK,50OHM,CAB IC,STEP-UP DC/DC CONVERTER,5-SOT-23 ISOLATORS,DIGITAL,STANDARD,MSOP-8 IC,RS232 DRVR,5.5V,SOIC-16 IC,POWER MANAGEMENT/ AUDIO CODEC,NFBGA-209 062 Pwr Conn Receptacle Free Hng 5Ckt FAST RECOVERY DIODE,1A,100V,DO-41 IC,ADJ LINEAR REG,1.2V TO 32V,8-SOIC TRANSISTOR,NPN,65V,SOT-23 CAPACITOR TANT,82UF,125V,AXIAL 20% D SUB CONNECTOR,STANDARD,15POS,RCPT RESISTOR,METAL OXIDE,10KOHM,5W,5% N CH MOSFET,HEXFET,250V,46A,TO-220AB IC,I/O EXPANDER,8BIT,400KHZ,TSSOP-16 HEAT SINK GYROSCOPE,MEMS,DIGITAL O/P,ML-24-3 ACCELEROMETER,MEMS,3-AXIS,DIGITAL O/P,ML-14-2 SSR,PANEL MOUNT,660VAC,280VAC,50A STANDARD RECOVERY,100V,70A,DO-5 AUDIO TRANSFORMER IC,OP-AMP,11MHZ,20V/ us,30 uV,SOIC-8 PLUG & SOCKET CONN,HEADER,3POS,4.2MM SWITCHING ELEMENT 1NO/1NC 6A,SOLDER LUG IC,2BIT VOLTAGE LEVEL TRANSLATOR VSSOP8 CONTACT,RECEPTACLE,18-15AWG,CRIMP SHELL HOUSING PP15/PP30/PP45 SERIES CONN IC,SYSTEM MANAGER,4.5mA,14V,TQFN-48 MOUNTING ADAPTER BIPOLAR TRANSISTOR,NPN,45V,TO-92 IC,FLASH MEM,1024MBIT,120NS,64-BGA DC BLOWER,95 X 33MM,12V IC,AUDIO PWR AMP,CLASS G,2.4W TQFN-28 GYROSCOPE,MEMS,YAW,DIGITAL O/P,LGA-16 WIRE-BOARD CONN,RECEPTACLE,22POS,2MM KIT SERIAL SUPERFLASH KIT1 ADIS16080,GYROSCOPE,SPI,EVALUATION BOARD PIC18F46K80 PIM for PIC18 Explorer CRIMP TOOL,56EI & MTEI SERIES CONTACTS SWITCH,VANDAL RESISTANT NO,400mA,125V CAPACITOR TANT,6.8UF,125V,AXIAL 10% ADIS16334,INERTIAL SENSOR,SPI,EVALUATION BOARD CIRCUIT BREAKER,THERMAL MAG,1P,20A IC,ADC,17BIT,10SPS,DIP-16 BIPOLAR TRANSISTOR POWER TRANSFORMER,SINGLE PRIMARY,24V,48VA FUSE,CARTRIDGE,1A,5 X 20MM,SLOW BLOW CAPACITOR TANT,47UF,60V,AXIAL 10% IC,DAC,16BIT,1MSPS,SOIC-8 CAPACITOR TANT,22UF,75V,AXIAL 10% ISOLATORS,DIGITAL,STANDARD,MSOP-8 ISOLATORS,DIGITAL,STANDARD,MSOP-8 IC,OP-AMP,38MHZ,22V/µs,SOIC-8 CABLE KIT,PS-2 TO KVM SWITCH,25FT,BLK CAPACITOR CERAMIC 1000PF 50V,C0G,5%,AXIAL CONNECTOR,D SUB COMBO,RECEPTACLE,13PO RH/Temperature/Dew Point USB Data Logger CONVERTER,UTP ETHERNET,FIBER ETHERNET IC,RS232 DRVR CAPACITOR TANT,10UF 35V,0.3OHM,7343-3 FUSE,PTC RESET,20V,4.5A,STRAP AUTO TRANSFORMER TRANSCEIVER,RS422,5MBPS,5V,SOIC-16 TRANSCEIVER,RS485,5MBPS,5V,SOIC-16 TRANSCEIVER,RS422,5MBPS,5V,SOIC-16 TRANSCEIVER,RS485,5MBPS,5V,SOIC-16 TRANSCEIVER,RS422,20MBPS,5V,SOIC-16 TRANSCEIVER,RS485,20MBPS,5V,SOIC-16 TRANSCEIVER,RS422/RS485,40MBPS,5V,SOIC-16 TRANSCEIVER,CAN,1DRIV/1RCVR,5V,SOIC-16 FEMALE SCREW LOCK,4-40,20.66MM ISOLATION TRANSFORMER IC,LDO VOLT REG,3.3V,0.1A,5-SOT-23 ISOLATING LINE TRANSFORMER,115VAC,500VA CAPACITOR TANT,150UF6.3V 0.045OHM 3528- CONNECTOR,DISPLAY PORT,RCPT,19POS TERMINAL BLOCK PLUGGABLE,2POS,28-12AWG CAPACITOR TANT,150UF,125V,10%,AXIAL RESISTOR,10OHM,600MW,±1% WIRE TO BOARD CONNECTOR HOUSING SWITCH,VANDAL RESISTANT,SPST,1A,50V CAPACITOR CERAMIC,4.7UF,100V,X7R,20%,SMD GYROSCOPE/ACCELEROMETER,MEMS,3AXIS,ML-24-2 NETWORK SWITCH,KVM,8PORT CABLE KIT,PS-2 TO KVM SWITCH,19FT,BLK BOBBINS TRANSFORMER PIC32 Ethernet Starter Kit WIRE TO BOARD CONNECTOR,RECEPTACLE,10P COUNTING DIAL,15 TURNS,6.35mm IC MOTOR DRIVER HALF BRIDGE,1A,SOIC-8 TERMINAL BLOCK JUMPER,3WAY,5.1MM CONNECTOR,HDMI,RCPT,19POS WIRE-BOARD CONNECTOR RECEPTACLE 2POS 4MM BOBBINS TRANSFORMER IC,STEP-UP DC/DC CONVERTER,uMAX-8 CLIP NUT,#10-32,25 PACK NETWORK SWITCH,KVM,16PORT,17´´ CONSOLE NETWORK SWITCH,KVM,16PORT CAPACITOR TANT,68UF,100V,AXIAL 20% PLUG & SOCKET CONN,PLUG,10POS,4.2MM ZENER DIODE,500mW,18V,DO-35 BRIDGE RECTIFIER,SINGLE PHASE,1.5A,100V,RB-15 MONITOR,VOLTAGE & TEMP,SOIC-8 ADC,14BIT,2.8MSPS,MSOP-10 ADC,14BIT,2.2MSPS,SSOP-28 ADC,14BIT,400KSPS,SSOP-16 ADC,12BIT,10MSPS,SSOP-28 LINE RECEIVERS,52MBPS,5V,SOIC-16 DAC,16BIT,SOIC-8 DAC,16BIT,SSOP-28 DAC,16BIT,SSOP-28 ADC,16BIT,500KSPS,SSOP-36 ADC,16BIT,200KSPS,SOIC-20 HOT SWAP CONTROLLER,1.2-12V,SOIC-14 CAPACITOR TANT,150UF,60V,10%,AXIAL CAPACITOR TANT,220UF,100V,10%,AXIAL CAPACITOR TANT,50UF,125V,10%,AXIAL CAPACITOR TANT,68UF,50V,10%,AXIAL CAPACITOR TANT,680UF,50V,10%,AXIAL CAPACITOR TANT,10UF,125V,AXIAL 20% CAPACITOR TANT,470UF,50V,AXIAL 10% CAPACITOR TANT,150UF,60V,AXIAL 10% CAPACITOR TANT,560UF,60V,AXIAL 10% IC,CROSSPOINT SW IC,RTC IC,RS232 DRVR IC,VIDEOSYNC SEPARATOR IC,RS422,RS485,3.6V,SOIC-8 IC,NV DIG POT I/O MODULE,60V,3.5A BIPOLAR TRANSISTOR,PNP,-45V,SOT-223 FUSE,PTC RESET,60V,400mA,RADIAL I/O MODULE I/O RACK WIRE-BOARD CONNECTOR HEADER 6POS,1.25MM DC POWER SUPPLY,110VAC 32V/32V FUSE,PTC RESET,16V,11A,RADIAL OPTOCOUPLER,PHOTOTRANSISTOR,5KV IC,HEX INVERTER,SCHMITT TRIGGER,DIP14 IC,DIFFERENTIAL COMP,QUAD,0.3µS DIP14 IC RS422/RS423 LINE RECEIVER 5.25V DIP16 IC,RS-232 TRANSCEIVER,5.5V,SSOP-28 IC,ANALOG SWITCH,QUAD,SPST,SOIC-16 IC,ANALOG MULTIPLEXER,8 X 1,SOIC-16 IC,ANALOG MULTIPLEXER,16 X 1,SOIC-28 IC,ANALOG MULTIPLEXER,8 X 1,SOIC-16 IC,RS232 DRVR,5.5V,TSSOP-16 IC,RS232 DRVR,5.5V,SSOP-16 IC,RS232 DRVR,5.5V,TSSOP-16 IC,RS-232 TRANSCEIVER,5.5V,QFN-20 IC,RS422/RS485 TRANSCEIVER,3.6V,SOIC8 IC,DAC,16BIT,600MSPS,QFN-68 WIRE-BOARD CONN,RECEPTACLE,6POS,2MM WIRE-BOARD CONN,RECEPTACLE,50POS,2MM IC,ANALOG MUX/DMUX,8 X 1,DIP-16 FUSE,SMD,7A,TIME DELAY CONNECTOR,STD D-SUB,PLUG,50POS SCHOTTKY RECTIFIER,2A,30V,403A OPTOCOUPLER,TRANSISTOR,7500V IC,QUAD NAND GATE,SCHMITT TRIG SOIC-14 IC,CLOSED LOOP BUFFER,SGL 1GHZ SOT23-5 ADIS16367,INERTIAL SENSOR,SPI,EVALUATION BOARD TERMINATION/STRAIN RELIEF CAP RESISTOR,THICK FILM,1.5KOHM,62.5mW 1% CAPACITOR CERAMIC 100PF 50V,C0G,0603 NETWORK SWITCH,KVM,8PORT,17´´ CONSOLE BOBBINS TRANSFORMER CAPACITOR TANT,10UF,50V,AXIAL 10% ADIS16060,DIGITAL GYROSCOPE,SPI,EVAL BOARD IC,QUAD 2-INPUT NAND GATE,QFN-14 CAPACITOR TANT,56UF,25V,4.AXIAL 20% MOSFET Transistor IC,OP-AMP,1.2MHZ,0.5V/ us,SOIC-14 LAMP,INCANDESCENT,12.8V,26.8W NETWORK SWITCH,KVM,8PORT,19´´ CONSOLE NETWORK SWITCH,KVM,16PORT,19´´ CONSOLE CAPACITOR TANT,39UF,35V,AXIAL 20% CAPACITOR TANT,4.7UF,100V,AXIAL 20% CAPACITOR TANT,220UF,30V,AXIAL 10% CAPACITOR TANT,220UF,60V,AXIAL 10% CAPACITOR TANT,330UF,50V,AXIAL 20% CAPACITOR TANT,22UF,75V,AXIAL 20% HEAT-SHRINK WIRE MARKING SLEEVES,1.765IN W CAPACITOR CERAMIC 1000PF 100V,X7R,10%,AXIAL TVS DIODE LED,0603,YELLOW GREEN,40MCD,575NM LED,NEUTRAL WHITE,114LM ACCELEROMETER,MEMS,3-AXIS,DIGITAL O/P,LGA-16 RECTANGULAR HAN INSERT FEMALE 8WAY CRIMP CAPACITOR TANT,100UF,15V,AXIAL 10% CAPACITOR TANT,120UF,50V,AXIAL 10% CAPACITOR TANT,150UF,10V,AXIAL 10% CAPACITOR TANT,22UF,25V,AXIAL 20% CAPACITOR TANT,220UF,75V,AXIAL 10% CAPACITOR TANT,270UF,25V,AXIAL 10% CAPACITOR TANT,390UF,15V,AXIAL 20% CAPACITOR TANT,47UF,125V,AXIAL 10% CAPACITOR TANT,68UF,25V,4.AXIAL 20% CAPACITOR TANT,68UF,25V,4.AXIAL 10% CAPACITOR TANT,82UF,125V,AXIAL 10% N CH MOSFET IC,RS232,RS422,RS485 TX/RX,QFN-40 IC,RS232,RS485 TX/RX,5.5V,SSOP-20 CABLE KIT,PS-2 TO KVM SWITCH,15FT,BLK CAPACITOR TANT,370UF,60V,AXIAL 20% PLUG AND SOCKET CONNECTOR HOUSING IC,RS-232 TRANSCEIVER,5V,SOIC-16 CONTACT,RECEPTACLE,24-20AWG,CRIMP CIRCUIT BREAKER,THERMAL MAG,2P,10A SSR,PHOTO MOSFET,100V,375mA IC,DDR TERMINATION REGULATOR,PSOP-8 RFID Transponder MICRO USB CABLE ASSEMBLY CONTACT,FEMALE,30-24AWG,CRIMP ADIS16305,FREEDOM SENSOR,SPI,EVALUATION BOARD GYROSCOPE/ACCELEROMETER,MEMS,3AXIS,ML-24-4 AXIAL FAN,225MM,230VAC POWER ENTRY MODULE HEAT SINK GAS DISCHARGE TUBE,350V,SMD GAS DISCHARGE TUBE,400V,SMD GAS DISCHARGE TUBE,420V,SMD GAS DISCHARGE TUBE,420V,SMD GAS DISCHARGE TUBE,75V,SMD GAS DISCHARGE TUBE,90V,SMD FUSE,RESETTABLE PTC,0603,6VDC,500mA FUSE,RESETTABLE PTC,0805,6VDC,750mA FUSE,RESETTABLE PTC,1206,6VDC,3.8A FUSE,RESETTABLE PTC,1210,24VDC,750mA FUSE,RESETTABLE PTC,1210,6VDC,3.5A FUSE,RESETTABLE PTC,1812,6VDC,3.5A WIRE-BOARD CONNECTOR RECEPTACLE,4POS,2 CAPACITOR TANT,220UF,50V,AXIAL 10% PLUG & SOCKET CONN,HEADER,2POS,7.5MM TERMINAL,TURRET,THROUGH HOLE ZENER DIODE,1W,12V,DO-41 TRANSCEIVER,RS485,5.5V,SOIC-16 WIRE-BOARD CONN,HEADER,12POS,2.54MM IC,TEMP SENS,3DEG CELSIUS,MSOP-8 MOSFET,DUAL N CH,30V,11A,POWERPAIR-8 MOSFET,DUAL N CH,25V,16A,POWERPAIR-6 MOSFET,DUAL N CH,30V,16A,POWERPAIR-6 MOSFET,DUAL N CH,30V,40A,POWERPAIR-8 MOSFET,P CH,-60V,-2.5A,SOT-23-3 CONNECTOR,POWER INLET,PLUG,10A LAMP,INCANDESCENT,14V LABEL,LASER PRINTABLE,25,4X6.35MM,POLY,WHT,10000PC SCHOTTKY RECTIFIER,1A,20V,AXIAL CONNECTOR,SPEAKER,SOCKET,4WAY IC,ACCELEROMETER,3g,3 AXIS,LFCSP-16 IC,QUAD VOLTAGE LEVEL SHIFTER,TSSOP-16 IC,INTERFACE,ESD,5.5V,SOP-4 IC,DDR TERMINATION,3A,SON-10 IL3585 EVAL BRD,RS485 TRANSCEIVER CONTACT,SOCKET,32-28AWG,CRIMP WIRE TO BOARD,RECEPTACLE,8POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,10POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,12POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,14POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,16POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,18POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,20POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,26POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,34POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,2POS,1ROW,2MM WIRE TO BOARD,RECEPTACLE,3POS,1ROW,2MM WIRE TO BOARD,RECEPTACLE,4POS,1ROW,2MM WIRE TO BOARD,RECEPTACLE,5POS,1ROW,2MM WIRE TO BOARD,RECEPTACLE,6POS,1ROW,2MM WIRE TO BOARD,RECEPTACLE,7POS,1ROW,2MM WIRE TO BOARD,RECEPTACLE,17POS,1ROW,2MM WIRE TO BOARD,RECEPTACLE,4POS,2ROW,2MM WIRE TO BOARD,RECEPTACLE,6POS,2ROW,2MM D SUB COAXIAL CONTACT,RECEPTACLE,CRIMP,RG-179/U CAPACITOR CERAMIC 1000PF,50V,X7R,0402 RESETTABLE FUSE IC,RTC,D-D-M-Y,128 X 8,DFN-20 IC,MOSFET DRIVER,HIGH CURRENT,DIP-8 PLUG & SOCKET HOUSING,RECEPTACLE,NYLON CARTE FILLE KIT METAL OVER CAP EXTENSION PAK DEBUG PIC10F320-ICE MCU 8BIT 3.5KB FLASH 32MHZ 28SOIC MCU 8BIT 3.5KB FLASH 32MHZ 28SPDIP AMPLI D´INST 35VIN 10MHZ 8MSOP AMPLI D´INST 35VIN 10MHZ 8SOIC AMPLI FILTRE VIDEO SD 3.6VIN 8LFCSP DETECT MOUVEMENT 6 DEGREE ML-24-6 CFTL TILT MEASURE ADXL203 AD7997 CFTL BIDIRECTIONAL CURRENT SENSE CFTL QUAD IF RECEIVER 184.32MSPS SFERNICE TRANSDUCERS,ECO78ESA502 CONNECTOR HOUSING,RECEPTACLE,10POS,22-18AWG SENSOR,PHOTO,DIFFUSE-REFLECTIVE,1M,NPN IC,STEP-DOWN DC/DC CONVERTER,8-DIP CAPACITOR ALUM ELEC,10000UF,100V +50%/-10% SCREW BRADYSLEEVE HEAT-SHRINK WIRE MARKING SLE ZENER DIODE,1W,10V,DO-41 LAMP,INCANDESCENT,S.C. BAYONET,28V WIRE-BOARD CONNECTOR HEADER 2POS,1.25MM PROXIMITY SENSOR,INDUCTIVE,0.6MM,10-30VDC SENSOR,PHOTO,RETROREFLECTIVE,4M,NPN WIRE-BOARD CONN,RECEPTACLE,4POS,2MM SENSOR,FIBRE OPTIC,RETROREFLECTIVE,1.5M IC,DAC,12BIT,DIP-24 N CH MOSFET DIN RAIL,SOLID,STEEL,TS35X7.5MM,2M CONTACT,SOCKET,22AWG,CRIMP P CHANNEL MOSFET,-20V,4.5A FAST RECOVERY DIODE,2A,50V,DO-214AA IC,EEPROM,512KBIT,SERIAL 20MHZ SOIC-8 CURRENT TRANSFORMER SSR,PANEL MOUNT,660VAC,32VDC,25A SMALL SIGNAL DIODE 85V 200mA SOT-23 SSR,PANEL MOUNT,280VAC,32VDC,50A WIRE-BOARD CONN,HEADER,10POS,2ROW CONTACT,PIN,16-14AWG,CRIMP MPLAB ICD 3 In-Circuit Debugger Kit N CH MOSFET,100V,290A,TO-247AC SWITCH,KEY OPERATED,DPDT,5A,125V PROXIMITY SENSOR,INDUCTIVE,1.6MM,10-30VDC IC,VOLTAGE-LEVEL TRANSLATOR,VSSOP-8 LAMP,INCANDESCENT,MIDGET GROOVE,14V CONTACT BLOCK Header Connector,Cable Mount,PLUG,2 Contacts,SKT,0.1 Pitch,IDC Terminal 26H0649 FUSE,AXIAL,8A,5 X 20MM,FAST ACTING IC,ADC,12BIT,730KSPS,LQFP-64 PROXIMITY SENSOR,INDUCTIVE,2.5MM,10-30VDC PROXIMITY SENSOR,INDUCTIVE,2.5MM,10-30VDC POWER TRANSFORMER METALOK RECEPTACLE 29C3529 LAMP,INCANDESCENT,SCREW,28V DIGITAL HALL-EFFECT SENSOR IC,OMNIPOLAR PROXIMITY SENSOR,INDUCTIVE,2.5MM,10-30VDC PROXIMITY SENSOR,INDUCTIVE,2.5MM,10-30VDC CAPACITOR FILM,2200PF,630V,AXIAL 5% CAPACITOR ALUM ELEC,18000UF,100V +50%/-10% SCREW CAPACITOR ALUM ELEC,4000UF,100V,+50%/-10% SCREW SWITCH,DIP,8 POS,SPST,PIANO IC,LDO VOLT REG,3.3V,0.8A,SOT-223-4 CONNECTOR,D SUB COMBO,RECEPTACLE,8POS PROXIMITY SENSOR,INDUCTIVE,2MM,10-30VDC PROXIMITY SENSOR,INDUCTIVE,5MM,10-30VDC PHOTOELECTRIC SENSOR,20MM TO 300MM,NPN O.C. OUTPUT SENSOR,PHOTO,RETROREFLECTIVE,15M,NPN SENSOR,PHOTO,THROUGH-BEAM,60M,NPN SENSOR,PHOTO,BGS REFLECTIVE,100MM,NPN SENSOR,PHOTO,BGS REFLECTIVE,100MM,NPN SENSOR,PHOTO,RETROREFLECTIVE,4M,NPN SENSOR,PHOTO,THROUGH-BEAM,15M,NPN DUAL LOCK RECLOSABLE FASTENER,BLACK,25.4MM TUSB9261DEMO FUSE,CARTRIDGE,2A,5 X 20MM,TIME DELAY IC,LDO VOLT REG,3.3V,150mA,5-SOT-23 IC,SRAM,4MBIT,10NS,TSOP-2-44 INDUCTOR,68NH,230MA,±5%,2GHZ SENSOR,PHOTO,THROUGH-BEAM,7M,PNP WIRE-BOARD CONNECTOR HEADER,9WAY,0.1IN IC MOTOR DRIVER,HALF-H,600mA,DIP-16 FFC/FPC CONNECTOR,RECEPTACLE 10POS 1ROW IC,RS232/RS485/RS422 TXRX,5.5V,SSOP20 CAPACITOR TANT,22UF,25V,1.5 OHM,0.1,RAD CAPACITOR ALUM ELEC 220UF,200V,20%,SNAP-IN BRIDGE RECTIFIER,SINGLE PHASE,1.5A,200V,RB-15 TRANSCEIVER,20MBPS,3.3V,MSOP-10 TRANSCEIVER,20MBPS,3.3V,SSOP-16 SUPPLY MONITOR,QUAD,ADJ,43UA,MSOP-10 SUPPLY MONITOR,QUAD,ADJ,43UA,SSOP-16 VOLTAGE MONITOR,OCTAL,50UA,6V,SSOP-16 DC-DC CONVERTER,BUCK,600KHZ,240A,QFN-32 HOT SWAP CONTROLLER,2.7-5.5V,MSOP-8 LINE RECEIVERS,10MBPS,5V,SOIC-16 CAPACITOR TANT,2.2UF,50V DC-DC CONVERTER,BUCK,100KHZ,2.6A,D2PAK-7 TRANSCEIVER,120KBAUD,5V,SOIC-16 P CHANNEL MOSFET,-55V,42A,D2-PAK IC,BATTERY CHARGER,TSSOP-16 SILICON NPN TRANSISTOR,250V,2A,TO-66 LAMP,INCANDESCENT,WIRE LEADED,5V TRIMMER,POTENTIOMETER 10KOHM 5TURN SMD FUSE,PTC RESET,33V,1.1A,SMD IC,QUAD NAND GATE,2I/P,DIP-14 VARISTOR,165V,10mm DISC IC,RS-232 TRANSCEIVER,5.5V,TSSOP-16 BOBBIN INDUCTOR,100UH,5.4A,10% 4.6MHZ IC,EEPROM 16KBIT SERIAL 400KHZ SOT-23-5 DUAL LOCK RECLOSABLE FASTENER,BLACK,25.4MM DUAL LOCK RECLOSABLE FASTENER,BLACK,25.4MM DUAL LOCK RECLOSABLE FASTENER,CLEAR,25.4MM DUAL LOCK RECLOSABLE FASTENER,CLEAR,25.4MM DUAL LOCK RECLOSABLE FASTENER,BLACK,25.4MM DUAL LOCK RECLOSABLE FASTENER,BLACK,25.4MM DUAL LOCK RECLOSABLE FASTENER,CLEAR,25.4MM DUAL LOCK RECLOSABLE FASTENER,BLACK,25.4MM LAMP,INCANDESCENT,WIRE LEADED,5V EXTRACTOR HANDLE,GREY PROXIMITY SENSOR,INDUCTIVE,1.6MM,10-30VDC PROXIMITY SENSOR,INDUCTIVE,1.6MM,10-30VDC SENSOR,PHOTO,THROUGH-BEAM,7M,NPN CAPACITOR FILM,0.47UF,600V,AXIAL 10% RESISTOR,THICK FILM,0.47 OHM,20W,1% OPTOCOUPLER,LOGIC GATE,2500VRMS LAMP,INCANDESCENT,5V FUSE,PTC RESET,30V,200mA,1812 LAMP,INCANDESCENT,WIRE LEADED,12V IC,I/O EXPANDER,16BIT,400KHZ,SOIC-24 IC,ANALOG SWITCH,QUAD,SPST,SOIC-14 PRESSURE SENSOR SENSOR,PHOTO,RETROREFLECTIVE,4M,NPN CAPACITOR FILM,35UF,370V,CAN 10% IC,NON INVERTING BUFFER,SOIC-14 OP-AMP,3.6MHZ,1.6V/ us,TSSOP-20 SUPPLY MONITOR,SIX,ADJ,52UA,TSSOP-20 MONITOR,CURRENT & VOLTAGE,I2C,DFN-10 MONITOR,CURRENT & VOLTAGE,I2C,MSOP-10 PROXIMITY SENSOR,INDUCTIVE,2MM,10-30VDC PROXIMITY SENSOR,INDUCTIVE,5MM,10-30VDC SENSOR,PHOTO,RETROREFLECTIVE,4M,PNP CAPACITOR ALUM ELEC,10000UF,80V,20%,SNAP IN INDUCTOR,SHIELDED,68UH,2.6A,SMD CAPACITOR ALUM ELEC,47000UF,25V,+50%/-10% SCREW IC,LIMITING AMPLIFIER,260MHZ,SOIC-8 MSP430 USB Stick Development Tool THERMAL MAGNETIC CIRCUIT BREAKER DISPLAY,7-SEGMENT,14.22MM,GREEN DISPLAY,7-SEGMENT,14.22MM,RED DISPLAY,7-SEGMENT,14.22MM,RED DISPLAY,7-SEGMENT,7.62MM,GREEN DISPLAY,7-SEGMENT,7.62MM,RED DISPLAY,7-SEGMENT,14.22MM,GREEN DISPLAY,7-SEGMENT,14.22MM,RED SENSOR,FIBRE OPTIC,THROUGH-BEAM,1.5M CIRCULAR CONNECTOR,FEMALE,4POS,CABLE CONTACT,PIN,24-18AWG,CRIMP TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,120V,PANEL TRANSDUCER,ALARM,95DBA,120V,PANEL TRANSDUCER,ALARM,85DBA,120V,PANEL SIDE CLIP,GF PA 6.6 WIRE-BOARD CONNECTOR RECEPTACLE,6POS,1 IC,DDR TERMINATION,3A,SON-10 IC,CLOCK GENERATOR,683MHZ,QFN-32 LAMP,INCANDESCENT,BI PIN,14V,1.4W LAMP,INCANDESCENT,28V,1.12W PROXIMITY SENSOR,INDUCTIVE,1.6MM,10-30VDC CONTACT,PIN,24-20AWG,CRIMP CAPACITOR FILM,1000PF,630V,AXIAL 5% ISOLATEUR NUMERIQUE 2VOIES 3KV 8SOIC ISOLATEUR NUMERIQUE 2CH 3KV 8SOIC ISOLATEUR NUMERIQUE 2CH 3KV 8SOIC ISOLATEUR NUMERIQUE 1KVRMS 2CH 8SO ISOLATEUR NUMERIQUE 1KVRMS 2CH 8SO FUSE,SMD,2A,1206,FAST ACTING CABLE OLFLEX NOIR 2.5MM 100M CABLE OLFLEX NOIR 2.5MM 100M CABLE OLFLEX NOIR 2.5MM 100M CABLE OLFLEX NOIR 4MM 100M CABLE OLFLEX NOIR 4MM 100M CABLE OLFLEX NOIR 4MM 100M CABLE OLFLEX NOIR 6MM 100M CABLE OLFLEX NOIR 6MM 100M CABLE OLFLEX NOIR 6MM 100M MODULE D´EVAL RS485 SN65HVD75D DC/DC 5VIN 2.5W 1MHZ AJUSTABLE 16QSOP DRIVER GATE 1MHZ 4A 4.5V 16SOIC DRIVER GATE 1MHZ 4A 4.5V 16SOIC DRIVER GATE 1MHZ 4A 4.5V 16SOIC CARTE D´EVAL POUR ADUM3070 200-1000KHZ CONTACT,FEMALE,22-18AWG,CRIMP INDUCTOR,SHIELDED,100UH,1.7A,SMD FUSE,PTC RESET,30V,200mA,1210 CAPACITOR PP FILM,0.01UF,300V,RADIAL WIRE-BOARD CONNECTOR HEADER 5POS,1.25MM CONTACT,FEMALE,32-28AWG,CRIMP WIRE-BOARD CONN,RECEPTACLE,8POS,2MM CIRCULAR SHELL PLUG,14S,ALUMINIUM ALLOY CIRCULAR SHELL,PLUG,SIZE 28,AL ALLOY IC,TEMP SENSOR,0.5°C,TO-46-3 TERMINAL BLOCK,DIN RAIL,4POS,22-12AWG RESISTOR,THICK FILM,1OHM,2W,5% CONTACT,SOCKET,20-18AWG,CRIMP N CHANNEL MOSFET,200V,21A,D2PAK CONTACT,PIN,24-20AWG,CRIMP CAPACITOR CERAMIC 0.1UF,100V,X7R,RAD N CH DIGITAL AUDIO MOSFET,150V,17A,TO-220AB CAPACITOR POLY FILM 1UF 400V 10%,RADIAL CIRCULAR CABLE CLAMP,SIZE 32 ZINC ALLOY IC,ADJ LDO VOLT REG,3A,TO-263-5 RFID Transponder IC,TIMERBLOX,SINGLE,977Hz,5.5V,6-TS RUBBER BUSHING,FOR MS3057A CABLE CLAMP RUBBER BUSHING,MS3057A CABLE CLAMP RESISTOR,CURRENT SENSE,0.015OHM,1W,1 CIRCULAR SHELL PLUG,14S,ALUMINIUM ALLOY RUBBER BUSHING,MS3057A CABLE CLAMP CIRCULAR SHELL,PLUG,SIZE 20,AL ALLOY CIRCULAR SHELL,PLUG,SIZE 18,AL ALLOY PLUG & SOCKET HOUSING,RECEPTACLE,NYLON CAPACITOR TANT,100UF 16V 0.125OHM 7343- CAT3 RJ45 MODULAR JACK,8POS,1 PORT IC,LDO VOLT REG,3.3V,150mA,5-SOT-23 CHIP INDUCTOR,10UH 180MA 10% 25MHZ CIRCULAR SHELL,PLUG,SIZE 28,AL ALLOY CIRCULAR SHELL,PLUG,SIZE 22,AL ALLOY FERRITE CORE,SPLIT,12.8MM,75OHM/100MHZ,300MHZ RUBBER BUSHING,MS3057A CABLE CLAMP SWIVEL CABLE TIE MOUNT CIRCULAR CONNECTOR PLUG,SIZE 24,7POS, MICRO HDMI CABLE ASSEMBLY BRIDGE RECTIFIER,SINGLE PHASE,1.5A,400V,RB-15 IC,SENSOR,VIBRATION,18g,3 AXIS,ML-1 WIRE TO BOARD CONN,HEADER,4POS,2.54MM BOARD TO BOARD CONNECTOR,HEADER,20POS, PLUG PROTECTION CAP,METAL RECEPTACLE PROTECTION CAP,METAL N CHANNEL MOSFET,900V,8A,TO-220 IC,D-TYPE FLIP FLOP,DUAL,45NS,DIP-14 IC,MICROMONITOR,60 uA,5.5V,8-SOIC RECEPTACLE PROTECTION CAP,METAL WIRE-BOARD CONN,RECEPTACLE,10POS,2MM FUSE,10A,600V,FAST ACTING IC,DIGITAL POT 10KOHM 256,DUAL 14-TSSOP EXTRACTOR HANDLE,BLACK IC,MICROMONITOR,60µA,5.5V,8-SOIC CONNECTORS,CIRCULAR OPTOCOUPLER,DARLINGTON,2500VRMS OPTOCOUPLER,PHOTOTRANSISTOR,2500VRMS IC,NON INVERTING BUFFER,DIP-20 RESISTOR,THICK FILM,1MOHM,62.5mW,1% CONNECTORS,CIRCULAR CAPACITOR CERAMIC,0.1UF,50V,X7R,0603 FUSE,PTC RESET,24V,500mA,1812 OPTOCOUPLER,SCHMITT TRIGGER,7500VRMS IC,HALL EFFECT SENSOR,LINEAR,TO-92-3 LAMP,INCANDESCENT,BA15D,24V CAPACITOR CERAMIC 4700PF 100V,X7R,10%,AXIAL LED,YELLOW GREEN,1.25MM X 1.4MM,40MCD,575NM CIRCULAR SHELL,PLUG,SIZE 18,AL ALLOY P CH MOSFET,-100V,4A,TO-205AF PLUG & SOCKET HOUSING,RECEPTACLE 10POS,2.54MM IC,LDO VOLT REG,8V,1A,TO-220-3 IC,ADC,8BIT,1MHZ,SOIC-20 SCHOTTKY RECTIFIER,200mA 30V DO-35 ZENER DIODE,1W,15V,DO-41 FLASH PROGRRAMMER,FOR POWERPC MCU CONNECTORS,CIRCULAR JIGSAW 720W 230V EU-PLUG CONNECTEUR FLEX 2 VOIES SKT CONTACTS CONNECTEUR FLEX 3 VOIES SKT CONTACTS CONNECTEUR FLEX IN-LINE 2 VOIES PIN CONNECTEUR FLEX IN-LINE 2 VOIES SKT CONNECTEUR FLEX IN-LINE 3 VOIES PIN CONNECTEUR CHASSIS 2 VOIES SKT SEALING CAP FOR FLEX CONNECTORS SEALING CAP FOR FLEX IN-LINE GLAND PACK CONTACT REMOVAL TOOL FOR 2 / 3 VOIES CRIMP TOOL FOR 2 / 3 VOIES CRIMP CONTACT LOCATOR FOR 2 / 3 VOIES CONTACT REMOVAL TOOL FOR 8 VOIES CRIMP CONTACT LOCATOR FOR 8 VOIES CRIMP CONTACT PIN FOR 16 / 22 VOIES CONTACT REMOVAL TOOL 16 / 22 VOIES CRIMP CONTACT LOCATOR 16 / 22 VOIES CONNECTEUR FLEX 2 VOIES PIN CONTACTS CONNECTEUR FLEX 2 VOIES SKT CONTACTS CONNECTEUR FLEX IN-LINE 2 VOIES PIN CONNECTEUR FLEX IN-LINE 2 VOIES SKT CONNECTEUR FLEX IN-LINE 3 VOIES PIN CONNECTEUR FLEX IN-LINE 3 VOIES SKT CONNECTEUR CHASSIS 2 VOIES SKT CONNECTEUR CHASSIS 3 VOIES PIN SEALING CAP FOR FLEX IN-LINE ACCESSOIRE DE CABLAGE ENCLOSURE RECTANGLE BLACK WALL MOUNT ENCLOSURE RECTANGLE BLACK WALL MOUNT ENCLOSURE TRAPEZOID BLACK ENCLOSURE TRAPEZOID BLACK WALL MOUNT ENCLOSURE TRAPEZOID SILVER WALL MOUNT ENCLOSURE TRAPEZOID RAIL MOUNT CONTROLLER EC FAN SPEED 0-100% CONTROLLER EC FAN SPEED PCB 0-100% CONTROLLER EC FAN SPEED 5 ADJ CONTROLLER EC FAN SPEED PCB 5 ADJ CONTROLLER,EC FAN,ADJ MAX + MIN SPEED CONTROLLER EC FAN PCB ADJ MAX + MIN CABLE POWER 1 FAN POUR D3G133 CABLE POWER 2 FANS POUR D3G133 CABLE POWER 3 FANS POUR D3G133 CABLE POWER 3 FANS POUR D3G133 CABLE CONTROL 1 FAN FOR D3G133 CABLE CONTROL 2 FANS FOR D3G133 CABLE CONTROL 3 FANS FOR D3G133 CABLE CONTROL 3 FANS FOR D3G133 FAN B/C CENTRIFUGAL 250MM 230V COMMUTATEUR TOGGLE SPST OFF-ON SC4 COMMUTATEUR TOGGLE DPDT ON-ON SQ COMMUTATEUR TOGGLE DPDT ON-ON SO COMMUTATEUR TOGGLE DPDT ON-ON SC3 COMMUTATEUR TOGGLE DPDT ON-ON SC4 COMMUTATEUR TOGGLE SPDT ON-ON SO COMMUTATEUR TOGGLE SPDT ON-ON SC3 COMMUTATEUR TOGGLE SPDT ON-ON SC4 COMMUTATEUR TOGGLE SPDT ON-OFF-ON SQ COMMUTATEUR TOGGLE SPDT ON-OFF-ON SO COMMUTATEUR TOGGLE SPDT ON-OFF-ON SC3 COMMUTATEUR TOGGLE SPDT ON-OFF-ON SC4 COMMUTATEUR TOGGLE DPDT ON-OFF-ON SQ COMMUTATEUR TOGGLE DPDT ON-OFF-ON SO COMMUTATEUR TOGGLE DPDT ON-OFF-ON SC3 COMMUTATEUR TOGGLE DPDT ON-OFF-ON SC4 COMMUTATEUR TOGGLE DPST OFF-ON SQ COMMUTATEUR TOGGLE DPST OFF-ON SO COMMUTATEUR TOGGLE DPST OFF-ON SC3 COMMUTATEUR TOGGLE DPST OFF-ON SC4 COMMUTATEUR TOGGLE SPDT (ON)-OFF-(ON) SQ COMMUTATEUR TOGGLE SPDT (ON)-OFF-(ON) SO COMMUTATEUR TOG SPDT (ON)-OFF-(ON) SC3 COMMUTATEUR TOG SPDT (ON)-OFF-(ON) SC4 COMMUTATEUR TOGGLE SPDT (ON)-OFF-ON SQ COMMUTATEUR TOGGLE SPDT (ON)-OFF-ON SO COMMUTATEUR TOGGLE SPDT (ON)-OFF-ON SC3 COMMUTATEUR TOGGLE SPDT (ON)-OFF-ON SC4 COMMUTATEUR TOGGLE SPDT (ON)-ON SQ COMMUTATEUR TOGGLE SPDT (ON)-ON SO COMMUTATEUR TOGGLE SPDT (ON)-ON SC3 COMMUTATEUR TOGGLE SPDT (ON)-ON SC4 COMMUTATEUR SPST OFF-ON WIRE LEVER 1 COMMUTATEUR SPST OFF-ON WIRE LEVER 2 COMMUTATEUR SPST OFF-ON WIRE LEVER 3 COMMUTATEUR TOGGLE 3PDT ON-ON SQ COMMUTATEUR TOGGLE 3PDT ON-OFF-ON SQ COMMUTATEUR TOGGLE 4PDT ON-ON SQ SWITCH,TOGGLE,4PDT ON-ON,SO COMMUTATEUR TOGGLE 4PDT ON-ON SC3 COMMUTATEUR TOGGLE 4PDT ON-OFF-ON SQ COMMUTATEUR TOGGLE 4PDT ON-OFF-ON SO COMMUTATEUR TOGGLE 4PDT ON-OFF-ON SC3 COMMUTATEUR DPDT ON-ON SQ METAL LEVER COMMUTATEUR DPDT ON-ON SO METAL LEVER COMMUTATEUR DPDT ON-ON SC METAL LEVER COMMUTATEUR DPDT ON-ON SQ PLASTIC LEVER COMMUTATEUR DPDT ON-ON SO PLASTIC LEVER COMMUTATEUR DPDT ON-ON SC PLASTIC LEVER COMMUTATEUR DPDT ON-OFF-ON SQ METAL LEV COMMUTATEUR DPDT ON-OFF-ON SO METAL LEV COMMUTATEUR DPDT ON-OFF-ON SC METAL LEV COMMUTATEUR DPDT ON-OFF-ON SQ PLASTIC COMMUTATEUR DPDT ON-OFF-ON SO PLASTIC COMMUTATEUR DPDT ON-OFF-ON SC PLASTIC COMMUTATEUR DPST OFF-ON SQ METAL LEVER COMMUTATEUR DPST OFF-ON SO METAL LEVER COMMUTATEUR DPST OFF-ON SC METAL LEVER COMMUTATEUR DPST OFF-ON SQ PLASTIC LEVER COMMUTATEUR DPST OFF-ON SO PLASTIC LEVER COMMUTATEUR DPST OFF-ON SC PLASTIC LEVER COMMUTATEUR DPDT (ON)-OFF-(ON) SQ METAL COMMUTATEUR DPDT (ON)-OFF-(ON) SO METAL COMMUTATEUR DPDT (ON)-OFF-(ON) SC METAL COMMUTATEUR DPDT (ON)-OFF-(ON) SQ PLASTI COMMUTATEUR DPDT (ON)-OFF-(ON) SO PLASTI COMMUTATEUR DPDT (ON)-OFF-(ON) SC PLASTI COMMUTATEUR DPDT ON-OFF-(ON) SQ METAL COMMUTATEUR DPDT ON-OFF-(ON) SO METAL COMMUTATEUR DPDT ON-OFF-(ON) SC METAL COMMUTATEUR DPDT ON-OFF-(ON) SQ PLASTIC COMMUTATEUR DPDT ON-OFF-(ON) SO PLASTIC COMMUTATEUR DPDT ON-OFF-(ON) SC PLASTIC COMMUTATEUR DPDT ON-(ON) SQ METAL LEVER COMMUTATEUR DPDT ON-(ON) SO METAL LEVER COMMUTATEUR DPDT ON-(ON) SC METAL LEVER COMMUTATEUR DPDT ON-(ON) SQ PLASTIC LEV COMMUTATEUR DPDT ON-(ON) SO PLASTIC LEV COMMUTATEUR DPDT ON-(ON) SC PLASTIC LEV COMMUTATEUR DPST (OFF)-ON SQ METAL LEVER COMMUTATEUR DPST (OFF)-ON SO METAL LEVER COMMUTATEUR DPST (OFF)-ON SC METAL LEVER COMMUTATEUR DPST (OFF)-ON SQ PLASTIC LEV COMMUTATEUR DPST (OFF)-ON SO PLASTIC LEV COMMUTATEUR DPST (OFF)-ON SC PLASTIC LEV COMMUTATEUR DPST OFF-(ON) SQ METAL LEVER COMMUTATEUR DPST OFF-(ON) SO METAL LEVER COMMUTATEUR DPST OFF-(ON) SC METAL LEVER COMMUTATEUR DPST OFF-(ON) SQ PLASTIC LEV COMMUTATEUR DPST OFF-(ON) SO PLASTIC LEV COMMUTATEUR DPST OFF-(ON) SC PLASTIC LEV COMMUTATEUR TOGGLE SPST OFF-ON SQ COMMUTATEUR TOGGLE SPST OFF-ON SO COMMUTATEUR TOGGLE SPDT ON-ON SQ COMMUTATEUR TOGGLE SPDT ON-ON SO COMMUTATEUR TOGGLE SPDT ON-ON SC3 COMMUTATEUR TOGGLE SPDT ON-OFF-ON SQ COMMUTATEUR TOGGLE SPDT ON-OFF-ON SO COMMUTATEUR TOGGLE SPDT ON-OFF-ON SC3 PKE 12A BASIC DEVICE PKE 0 3-1 2 A COMPLETE DEVICE PKE 3-12 A COMPLETE DEVICE PKE 1-4 A COMPLETE DEVICE PKE 32A BASIC DEVICE PKE 8-32 A COMPLETE DEVICE SUPPORT DE MONTAGE PKE 12-32 + DIL INTERFACE TRIP 0 3-1 2 A STANDARD TRIP 3-12 A STANDARD TRIP 8-32 A STANDARD TRIP 1-4 A STANDARD TRIP 0 3-1 2 A ADVANCED TRIP 3-12 A ADVANCED TRIP 8-32 A ADVANCED TRIP 1-4 A ADVANCED EM STOP ACTUATOR NO LED PALM 60MM EM STOP KEY RLSE NO LED PALM 60MM EM STOP ACTUATOR NO LED PALM 45MM EM STOP POS IND NO LED PALM 45MM EM STOP ACTUATOR NO LED PALM 60MM EM STOP POS IND NO LED PALM 60MM LED LIT RING 60MM 24V AC/DC 3X4 LED LIT RING 60MM 120V AC 1X8LED LED LIT RING 60MM 230V AC 1XLED CONTACT SELF MONITOR FRNT 1NC 1NO CONTACT SELF MONITOR FRNT 2NC 2NO CONTACT SELF MONITOR BASE 2NC 2NO SMD REMOVAL ALLOY PB FREE 1.3M CIRCULAR SHELL PLUG,16S,ALUMINIUM ALLO STEPPER MOTOR IC,DC/DC CONVERTER,5-TSOT-23 ISOLATOR,RTD,0.1%,1.5W MICROCONTR KINETIS K20 CORTEX M4 80LQFP MICROCONTR KINETIS K20 CORTEX M4 100MAP MICROCONTR KINETIS K30 CORTEX M4 144MAP MICROCONTR KINETIS K40 CORTEX M4 144LQFP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP CIRCULAR SHELL,PLUG,SIZE 20,AL ALLOY FUSE,PTC RESET,15V,500mA,1812 WIRE-BOARD CONNECTOR RECEPTACLE 12POS,2 FFC/FPC CONNECTOR,32POS,1ROW THERMAL TRANSFER PRINTABLE LABEL BOBBINS TRANSFORMER RESETTABLE FUSE INDUCTOR,SHIELDED,33UH,2.8A,SMD ZENER DIODE,500mW,5.1V,DO-35 DC-DC CONVERTER,BUCK,750KHZ,1.2A,DFN-6 ADC,12BIT,14KSPS,MSOP-12 IC,LDO VOLT REG,1.8V,0.2A,SOT-5 CHIP INDUCTOR,47NH 300MA 5% 0.9GHZ CONTACT,SOCKET,16-14AWG,CRIMP UNSHLD MULTIPR CABLE 4PR 1000FT 300V GRY IC,SYNC STEP-DOWN CONVERTER,14-HTSSOP IC,OP-AMP KK 100 Hdr FrLk Vert 14 Ckt Tin 13T6894 FAST RECOVERY DIODE,1A,400V,DO-41 CONNECTOR,XLR,PLUG,3POS FAST DIODE,1A,600V,DO-214AC SSR,PANEL MOUNT,660VAC,32VDC,50A SSR,PANEL MOUNT,280VAC,32VDC,25A SENSOR,POSITION,180 DEG,5VDC SENSOR,POSITION,180 DEG,5VDC SENSOR,POSITION,360 DEG,5VDC SENSOR,HALL EFFECT,GEAR TOOTH SPEED,9V-16V HOT SWAP CONTROLLER,2.9-15V,QFN-24 N CH MOSFET,20V,10A,6-PQFN SWITCH KEY FUSE,AXIAL,10A,5 X 20MM,SLOW BLOW RESISTOR,CURRENT SENSE,0.02OHM,1W,1% PLUG & SOCKET HOUSING,RECEPTACLE,NYLON SENSOR,MAGNETIC POSITION,AN8 SERIES SENSOR EVALUATION KIT,STM32L152VB,LCD,TEMP SENSOR CABLE 8AWG TPE 4 CONDUCT 100M CABLE 10AWG TPE 4 CONDUCT 100M CABLE 12AWG TPE 4 CONDUCT 100M CABLE 16AWG TPE 4 CONDUCT 100M CABLE 18AWG TPE 4 CONDUCT 100M CABLE 16AWG TPE 6 CONDUCT 100M CABLE 12AWG TPE 6 CONDUCT 100M CABLE 10AWG TPE 6 CONDUCT 100M CABLE 8AWG TPE 6 CONDUCT 100M IC,MOSFET DRIVER,HALF BRIDGE,SOIC-8 FUSE,CARTRIDGE,4A,5 X 20MM,SLOW BLOW IC,LDO VOLT REG,3.3V,150mA,5-SOT-23 IC,SERIES V-REF,1.25V,0.01%,6-SOT-23 CONNECTOR,STD D-SUB,PLUG,9POS TPS61202,BOOST CONVERTER,EVALUATION MODULE CAPACITOR ALUM ELEC 7UF WIRE LEAD IC,MULTIPHASE OSC,6.67MHZ,5.5V MSOP16 IC,RS-232 TRANSCEIVER,5.5V,SSOP-16 END PLATE,ZDU/ZPE/ZTR TERMINAL BLOCK SENSOR,POSITION,360 DEG,5VDC IC,DAC,8BIT,DFN-8 FILTER,LOW PASS,50KHZ,SOIC-24 FILTER,SWITCHED CAPACITOR,20KHZ,SOIC-16 BRIDGE RECTIFIER,SINGLE PHASE,1.5A,600V,RB-15 BOARD TO BOARD CONNECTOR,HEADER,20POS,2ROW ADC,8CH,12BIT,50KSPS,SOIC-20 ADC,8CH,12BIT,46.5KSPS,SOIC-20 DIFFERENTIAL LINE DRIVER,100MBPS,SOIC-16 ADC,8CH,12BIT,100KSPS,SSOP-28 ADC,8CH,12BIT,175KSPS,SSOP-16 IC,ADC,16BIT,250KSPS,MSOP-10 ADC,8CH,16BIT,200KSPS,SSOP-16 IC,ADC,14BIT,3.5MSPS,MSOP-10 DAC,OCTAL,14BIT,SSOP-16 SENSOR,HALL EFFECT,GEARTOOTH SPEED,4.75V to 24V FUSE,3A,250V,TIME DELAY TRANSCEIVER,120KBAUD,5V,SOIC-24 INSTR-AMPLIFIER,400KHZ,SOIC-8 DC-DC CONVERTER,100KHZ,5A,D2PAK-5 DC-DC CONVERTER,BUCK,200KHZ,1A,SOIC-16 VIDEO AMPLIFIER,5,40MHZ,SOIC-14 TRANSCEIVER,120KBAUD,5V,SOIC-18 OP-AMP,3MHZ,200V/ us,SOIC-8 OP-AMP,12MHZ,400V/ us,SOIC-16 DC-DC CONVERTER,BUCK,500KHZ,6A,TSSOP-16 FUSE,3A,500V,TIME DELAY VOLTAGE REFERENCE,5V,SOIC-8 VOLTAGE REGULATOR,LDO,300mA,ADJ,MSOP-8 OP-AMP,45MHZ,45V/ us,SOIC-14 VOLTAGE REGULATOR,LDO,500mA,3.3V,DFN-12 VOLTAGE REGULATOR,LDO,500mA,3V,SOIC-8 OP-AMP,85MHZ,100V/ us,DFN-8 OP-AMP,100MHZ,750V/ us,SOIC-8 OP-AMP,2MHZ,1V/ us,SOIC-8 HOT SWAP CONTROLLER,48V,SOIC-8 OP-AMP,100MHZ,24V/ us,DFN-8 OP-AMP,215MHZ,70V/ us,DFN-8 FUSE,PTC RESET,30V,1.35A,RADIAL ISOLATED AMPLIFIER,CURRENT/VOLTAGE,DIN RAIL FFC/FPC CONNECTOR,RECEPTACLE 33POS 1ROW ADC,2CH,16BIT,25MSPS,QFN-64 BQ51013,WIRELESS POWER,EVAL MODULE ISOLATED AMPLIFIER,CURRENT/VOLTAGE,DIN RAIL ISOLATED AMPLIFIER,CURRENT/VOLTAGE,DIN RAIL ISOLATED AMPLIFIER,CURRENT/VOLTAGE,DIN RAIL ISOLATED AMPLIFIER,CURRENT/VOLTAGE,DIN RAIL SIGNAL CONDITIONER,24VDC,DIN RAIL SENSOR,MAGNETIC POSITION,AN8 SERIES SENSOR SENSOR,MAGNETIC POSITION,AN8 SERIES SENSOR EXTRACTOR HANDLE,BLACK IC,VIDEOSYNC SEPARATOR IC,RS232 DRVR,5.5V,SSOP-16 IC,RS232 DRVR,5.5V,SSOP-20 IC,RS232 DRVR,5.5V,SSOP-28 IC,OP-AMP,3.5 kHz,1.2 V/ms,SOT-23-6 IC,LIGHT TO DIGITAL OUTPUT SENSOR IC,LIGHT TO DIGITAL OUTPUT SENSOR IC,RS422-RS485 DRVR IC,LINE RECEIVER IC,LINE TRANSMITTER IC,RS232 DRVR IC,ANALOG SW IC,OP-AMP,220 MHz,280 V/ us,SOIC-8 IC,VOLT REF,1.024V,20ppm/°C,5mV,3-SOT-23 IC,VOLT REF,2.5V,20ppm/°C,5mV,3-SOT-23 IC,RS422-RS485 DRVR IC,RS422-RS485 DRVR IC,RS422-RS485 DRVR IC,RS422-RS485 DRVR IC,VOLATILE DIG POT IC,VOLATILE DIG POT IC,VOLT REF IC,DAC,14BIT,400MSPS,HTQFP-48 RESISTOR,THICK FILM,10 OHM,62.5mW,1% RESISTOR,THICK FILM,10 OHM,100mW,1% CABLE CLAMP KIT #17 IC ADJ LDO REG 1.2V TO 37V 1.5A D2-PAK-3 IC,BCD-DECIMAL/BIN-OCTAL DECODER SOIC16 TRANSIENT VOLTAGE SUPPRESSION DIODE ARRA VOLTAGE REFERENCE,2.5V,MSOP-8 ISOLATED AMPLIFIER,DIGITAL,DIN RAIL ISOLATED AMPLIFIER,CURRENT/VOLTAGE,DIN RAIL VOLTAGE REGULATOR,LDO,300mA,ADJ,DFN-6 VOLTAGE REFERENCE,2.5V,SOT23-3 IC,LDO VOLT REG,1.8V,150mA,5-SOT-23 CONN,FUSED POWER ENTRY MODULE,PLUG 10A NTC THERMISTOR Test Spring Probe Connector Type:Electri Test Connector LOGIC IC,SINGLE 3-INPUT OR GATE,3.5NS,SOT-23-6 CAPACITOR CERAMIC 270PF 50V,C0G,± 5%, dem-opa-so-1b 88K3843 TRANSMISSIVE SENSOR,TRANSISTOR DISPLAY,7-SEGMENT,14.22MM,GREEN Optocoupler 96F6384 MEMORY,EPROM,32KBIT,200NS,DIP-24 TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,16V,PANEL TRANSDUCER,ALARM,95DBA,16V,PANEL TRANSDUCER,ALARM,95DBA,16V,PANEL TRANSDUCER,ALARM,95DBA,16V,PANEL TRANSDUCER,ALARM,95DBA,16V,PANEL TRANSDUCER,ALARM,95DBA,16V,PANEL TRANSDUCER,ALARM,85DBA,16V,PANEL TRANSDUCER,ALARM,85DBA,16V,PANEL TRANSDUCER,ALARM,85DBA,16V,PANEL TRANSDUCER,ALARM,85DBA,16V,PANEL TRANSDUCER,ALARM,85DBA,16V,PANEL TRANSDUCER,ALARM,85DBA,16V,PANEL TRANSDUCER,ALARM,75DBA,16V,PANEL TRANSDUCER,ALARM,95DBA,48V,PANEL TRANSDUCER,ALARM,85DBA,48V,PANEL TRANSDUCER,ALARM,95DBA,120V,PANEL TRANSDUCER,ALARM,95DBA,120V,PANEL TRANSDUCER,ALARM,95DBA,120V,PANEL TRANSDUCER,ALARM,85DBA,120V,PANEL TRANSDUCER,ALARM,85DBA,120V,PANEL TRANSDUCER,ALARM,85DBA,120V,PANEL TRANSDUCER,ALARM,85DBA,120V,PANEL TRANSDUCER,ALARM,85DBA,120V,PANEL TRANSDUCER,ALARM,75DBA,120V,PANEL LAMP SOCKET,BAYONET,T-3 1/4 LAMP SOCKET,BAYONET,T-3 1/4 FESTOON HOLDER,LE-0603-02 LAMP FESTOON HOLDER,LE-0603-02 LAMP LAMP SOCKET,BI PIN,T-1 3/4 LAMP SOCKET,WEDGE,T-3 1/4 LAMP SOCKET,WEDGE,T-3 1/4 LAMP SOCKET,WEDGE,T-1 3/4 LAMP SOCKET,WEDGE,T-1 3/4 LAMP SOCKET,WEDGE,T-1 3/4 LAMP SOCKET,WEDGE,T-3 1/4 LAMP SOCKET,WEDGE,T-1 3/4 LAMP SOCKET,WEDGE,T-1 1/2 LAMP SOCKET,WEDGE,T-3 1/4 LAMP SOCKET,WEDGE,T-1 1/2 LAMP SOCKET,G5,MR16 LAMP SOCKET,G6,MR16 MODULAR RJ POINT 5 JACK 24PORT MODULAR RJ POINT 5 PLUG KIT MODULAR RJ POINT 5 JACK 16PORT MODULAR JACK RJ45 CAT5 R/A THT MODULAR JACK RJ45 CAT5E R/A THT MODULAR JACK RJ45 CAT5 R/A SMT MODULAR JACK RJ45 CAT5 SMT MODULAR JACK RJ45 CAT3 THT MODULAR JACK RJ11 CAT3 R/A SMT MODULAR JACK RJ11 CAT3 SMT MINI SAS HD JACK 1PORT 36VOIES MINI SAS HD JACK 2PORT 72VOIES MINI SAS HD JACK 4PORT 144VOIES MINI SAS HD JACK LED 1PORT 36VOIES MINI SAS HD JACK LED 2PORT 72VOIES MINI SAS HD JACK LED 4PORT 144VOIES CONNECTOR POWER PIN R/A 1VOIES CONNECTOR POWER PIN R/A 1VOIES CONNECTOR POWER PIN 1VOIES CONNECTOR POWER PIN 1VOIES CONNECTOR POWER SOCKET R/A 1VOIES CONNECTOR POWER SOCKET R/A 1VOIES CONNECTOR POWER SOCKET 1VOIES CONNECTOR POWER SOCKET 1VOIES CONNECTOR POWER SOCKET R/A 2VOIES STACKED POWER PIN 16MM 1VOIES STACKED POWER PIN 18MM 1VOIES STACKED POWER PIN 20MM 1VOIES RETAINER CONTACT FOR SL-156 20VOIES HOUSING RETAINER FOR SL-156 2VOIES HOUSING RETAINER FOR SL-156 3VOIES HOUSING RETAINER FOR SL-156 4VOIES HOUSING RETAINER FOR SL-156 5VOIES HOUSING RETAINER FOR SL-156 6VOIES HOUSING RETAINER FOR SL-156 7VOIES IC,LINE DRVR,DIFF,QUAD,SOIC-16 HOUSING RETAINER FOR SL-156 8VOIES HOUSING RETAINER FOR SL-156 9VOIES IC,D-LATCH,TRANS,OCTAL,TRI STATE,TSSOP-20 HOUSING RETAINER FOR SL-156 10VOIES IC,8BIT SIPO SHIFT REGISTER,TSSOP-16 IC,4BIT FET BUS SWITCH,TSSOP-14 HOUSING RETAINER FOR SL-156 11VOIES IC,8BIT FET BUS SWITCH,TSSOP-20 HOUSING RETAINER FOR SL-156 12VOIES IC NON INVERTING BUS TRANSCEIVER TSSOP20 HOOD DSUB PLASTIC STRAIGHT 9VOIES IC,MONO MULTIVIBRATOR,8.3NS,TSSOP-16 HOOD DSUB PLASTIC STRAIGHT 15VOIES HOOD DSUB PLASTIC STRAIGHT 25VOIES HOOD DSUB PLASTIC STRAIGHT 37VOIES HOOD DSUB PLASTIC 45DEG 9VOIES HOOD DSUB PLASTIC 45DEG 15VOIES HOOD DSUB PLASTIC 45DEG 25VOIES HOOD DSUB PLASTIC 45DEG 37VOIES HOUSING PLUG MICRO POWER 6VOIES CONTACT SOCKET CRIMP 28-24AWG CERAMIC RESONATOR,20MHZ,SMD PLUG & SOCKET CONNECTOR,HEADER,4POS,3 SSR,PCB MOUNT,60VDC,32VDC,3A MULTIMTER NUMERIQUE W/SCANNER SCANNER CARD 10 VOIES SCANNER CARD THERMOCOUPLE 10 CH CABLE ASSEMBLE GPIB 1M CABLE ASSEMBLE GPIB 2M CABLE ASSEMBLE RS-232 1.5M SET CORDONS DE TEST 4 TERMINAL PROBE KELVIN 0.9M PROBE KELVIN SIMPLE PIN SET CLIP CORDON KELVIN CABLE ASSEMBLE COAX DOUBLE 1.2M CABLE ASSEMBLE TRIGGER LINK 1M CABLE ASSEMBLE TRIGGER LINK 2M ADAPTATEUR TRIGGER LINK CABLE ASSEMBLE TRIGGER LINK 1M CABLE ASSEMBLE TRIGGER LINK Y-DIN KIT MONTAGE RACK SIMPLE KIT MONTAGE RACK DOUBLE CABLE ASSEMBLE COAX SHV CABLE ASSEMBLE COAX SHV I/O MODULE MULTIPLEXEUR CARTE DOUBLE 1X30 MULTIPLEXEUR CARTE DOUBLE 1X30 MATRIX CARD RELAIS REED 1X30 MATRIX CARD RELAIS REED QUADRUPLE 4X28 COMMUTATEUR CARTE ISOLEE 32 VOIES CONTROL CARTE MULTIFONCTION CABLE ASS TRIGGER LINK ADAPTATEUR CABLE ASSEMBLE SHIELDED DB25 1.5M CABLE ASSEMBLE CROISE RJ45 3M CORDONS DE TEST ADAPTATEUR BANANE 1.4M EXTENDER CARTE ANALOG BACKPLANE KIT MONTAGE ARRIERE KIT MONTAGE RACK SIMPLE KIT MONTAGE RACK KIT MONTAGE RACK KIT MONTAGE RACK KIT MONTAGE ARRIERE MULTIPLEXEUR 32 VOIES MULTIPLEXEUR RAPIDE 32 VOIES CONTROL MODULE 40 VOIES MODULE I/O 20 CH ANALOG 16 CH NUMERIQUE MODULE I/O 32 VOIES MULTIPLEXEUR MODULE 40 VOIES MATRIC MODULE 6X8 MULTIPLEXEUR SOLID STATE 20 VOIES MODULE RF 2GHZ 50OHM MODULE RF 3.5GHZ 50OHM MULTIMTER NUMERIQUE 6.5DIG MULTIMETRE NUMERIQUE 7.5DIG SYSTEM COMMUTATEUR AFFICHEUR SIX SLOT SYSTEM COMMUTATEUR SIX SLOT SHUNT 50A KIT CORDONS DE TEST I/O MODULE PROBE HAUTE TENSION SOURCEMETRE 200V 1A 20W SOURCEMETRE 100V 3A 100W SOURCEMETRE 100V 3A 100W COURANT SOURCE DC COURANT SOURCE DC W/ NANOVOLTMETER ALIMENTATION DC 100W 15V 3A SIMULATEUR BATTERIE SIMULATEUR BATTERIE/CHARGEUR PORTABLE CADENAS COMBINATION DIAL LOCK COMBI SECURITY HD CADENAS LAITON 40MM CADENAS LAITON 50MM KA CADENAS LAITON PREMIUM KA CADENAS LAITON PREMIUM CADENAS LAITON PREMIUM CADENAS LAITON PREMIUM CADENAS LAMINE 40MM LOCK DISC W/HASP & STAPLE CADENAS HARSH ENVIRO CADENAS S/STEEL LOCK STEEL LOCK STEEL CLOSED SHACKLE LOCK CABLE BIKE LOCK BIKE U-SHACKLE CYLINDRE EASIFIT LAITON 30/30 CYLINDRE EASIFIT LAITON 30/40 CYLINDRE EASIFIT LAITON 35/35 CYLINDRE EASIFIT LAITON 35/45 CYLINDRE EASIFIT LAITON 40/40 CYLINDRE EASIFIT LAITON 40/50 CYLINDRE EASIFIT LAITON 45/45 CYLINDRE EASIFIT LAITON 45/55 CYLINDRE EASIFIT NICKEL 30/30 CYLINDRE EASIFIT NICKEL 30/40 CYLINDRE EASIFIT NICKEL 35/35 CYLINDRE EASIFIT NICKEL 35/45 CYLINDRE EASIFIT NICKEL 40/40 CYLINDRE EASIFIT NICKEL 40/50 CYLINDRE EASIFIT NICKEL 45/45 CYLINDRE EASIFIT NICKEL 45/55 CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 2 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M CABLE CAT5E 24AWG 4 PAIRES 152M USB TYPE A CONNECTOR,PLUG,4POS,SMD I/O MODULE INDUCTOR,SHIELDED,47UH,2.5A,SMD IC,LED DRIVER,LINEAR,SOIC-8 ZENER DIODE,500mW,5.6V,DO-35 ACCELEROMETER EVAL. BOARD HOUSING,RECEPTACLE,8POS,1ROW,3.81MM HUMIDITY SENSOR IC,DC-DC CONV,SSOP-16 IC,LDO,FIXED,9V,100mA,24V,TO-92-3 IC,CAN TXRX,1MDPS,1/1,5.5V,SOIC-8 PIC18F25J10 28L SOIC Plug-in Module,Plug-in Modules 17M0546 PIC18LF25J10 28L SOIC Plug-in Module,Plug-in Modules 17M0547 PIC18F45J10 44L TQFP Plug-in Module,Plug-in Modules 17M0548 PIC18LF45J10 44L TQFP Plug-in Module,Plug-in Modules 17M0549 IC,CLOCK BUFFER,133.3MHZ,SOIC-16 INDUCTOR,100UH,65MA,±10%,7MHz SSR,PANEL MOUNT,600VAC,32VDC,15A BIPOLAR TRANSISTOR,NPN,300V,SOT-32 RESISTOR,CURRENT SENSE,0.025OHM,1W,1 BIPOLAR TRANSISTOR,PNP,-300V,SOT-32 NTC THERMISTOR RFID Transponder Connector assemblies,Ribbon (Flat) CAPACITOR ARRAY,0.01UF,50V,X7R,20%,SIP CONNECTOR,PLCC SOCKET,68POS,THROUGH H DIP SWITCH,4,SPST,TOP SLIDE SSR,PCB MOUNT,280VAC,24VDC,4A FUSE,CARTRIDGE,5A,5 X 20MM,SLOW BLOW TERMINAL BLOCK JUMPER,3WAY,5.1MM BRIDGE RECTIFIER,SINGLE PHASE,1.5A,800V,RB-15 BOARD-BOARD CONNECTOR HEADER,3WAY,1ROW RELAY SOCKET N CHANNEL JFET,-30V,SOT-23 DIN MOUNTING RAIL,35MM,ALUMINIUM CONNECTOR,FPC,RCPT,34POS,1ROW INDUCTOR,1.2UH,9A,20%,SMD INDUCTOR,150NH,18A,30%,SMD INDUCTOR,1.5UH,7.2A,20%,SMD INDUCTOR,2UH,6.5A,20%,SMD INDUCTOR,2.5UH,5.5A,20%,SMD INDUCTOR,300NH,16A,30%,SMD INDUCTOR,3UH,4.9A,20%,SMD INDUCTOR,800NH,10.5A,20%,SMD INDUCTOR,1.3UH,10.5A,20%,SMD INDUCTOR,1.8UH,9A,20%,SMD INDUCTOR,220NH,18A,30%,SMD INDUCTOR,2.5UH,7.2A,20%,SMD INDUCTOR,3.2UH,6.5A,20%,SMD INDUCTOR,4UH,5.5A,20%,SMD INDUCTOR,450NH,16A,20%,SMD INDUCTOR,5UH,4.9A,20%,SMD INDUCTOR,800NH,12.5A,20%,SMD RELAY SOCKET HOLD-DOWN CLIP INDUCTOR,1UH,17.5A,20%,SMD INDUCTOR,1.8UH,13.5A,20%,SMD INDUCTOR,2.8UH,11A,20%,SMD INDUCTOR,4UH,9.7A,20%,SMD INDUCTOR,470NH,19.5A,30%,SMD RELAY SOCKET HOLD-DOWN CLIP INDUCTOR,5.6UH,8.2A,20%,SMD INDUCTOR,7.2UH,6.6A,20%,SMD INDUCTOR,10UH,5A,20%,SMD INDUCTOR,1.5UH,13.5A,30%,SMD INDUCTOR,2.5UH,10A,20%,SMD INDUCTOR,4UH,8.3A,20%,SMD INDUCTOR,6UH,6.7A,20%,SMD INDUCTOR,680NH,19.5A,30%,SMD INDUCTOR,15UH,600mA,20%,SMD INDUCTOR,1.7UH,1.55A,20%,SMD INDUCTOR,22UH,500mA,20%,SMD RELAY SOCKET HOLD-DOWN CLIP INDUCTOR,2.3UH,1.4A,20%,SMD INDUCTOR,3.3UH,1.35A,20%,SMD INDUCTOR,33UH,420mA,20%,SMD INDUCTOR,750NH,2.7A,20%,SMD INDUCTOR,82UH,270mA,20%,SMD INDUCTOR,8.5UH,850mA,20%,SMD CABLE,USB,3.34M RELAY SOCKET HOLD-DOWN CLIP RELAY SOCKET HOLD-DOWN CLIP BIPOLAR TRANSISTOR, Bipolar transistor CONNECTOR,RJ45,JACK,8P8C,1PORT,CAT5E CONNECTOR,RJ45,JACK,8P8C,1PORT,CAT5E CAT5E UTP MODULE,JACK,8POS,8CONTACTS,1PORT CAT5E UTP MODULE,JACK,8POS,8CONTACTS,1PORT CAT6 RJ45 MODULAR JACK,8POS,1 PORT CAT6 RJ45 MODULAR JACK,8POS,1 PORT CAT6 RJ45 MODULAR JACK,8POS,1 PORT CAT6 RJ45 MODULAR JACK,8POS,1 PORT VOLUME CONTROLLER Hall Effect Latch IC SWITCH,ROTARY,DIP EXTRACTOR HANDLE,BLACK BUTT SPLICE,CRIMP,YELLOW RESISTOR,THICK FILM,100KOHM,62.5mW 1% RESISTOR,THICK FILM,0 OHM,62.5mW,5% RESISTOR,THICK FILM,10KOHM,62.5mW,5% RESISTOR,THICK FILM,0 OHM,100mW,5% RESISTOR,THICK FILM,100KOHM,100mW,5% RESISTOR,THICK FILM,10KOHM,125mW,5% RESISTOR,THICK FILM,0 OHM,250mW,5% RESISTOR,THICK FILM,10KOHM,250mW,5% RESISTOR,THICK FILM,1KOHM,62.5mW,5% RESISTOR,THICK FILM,1MOHM,62.5mW,5% CAPACITOR CERAMIC 0.47UF,25V,X7R,10%,0805 CAPACITOR CERAMIC,0.1UF,16V,X7R,10%,0805 P CH MOSFET,-200V,6.5A,TO-3 IC,QUAD LEVEL SHIFTER,QFN-48 CAPACITOR ALUM ELEC,10UF,50V,20%,SMD CAPACITOR ALUM ELEC,100UF,50V,20%,SMD CAPACITOR ALUM ELEC,100UF,63V,20%,SMD CAPACITOR ALUM ELEC,1000UF,25V,20%,SMD CAPACITOR ALUM ELEC,1000UF,50V,20%,SMD CAPACITOR ALUM ELEC 220UF 35V 20%,SMD CAPACITOR ALUM ELEC,220UF,50V,20%,SMD CAPACITOR ALUM ELEC,220UF,63V,20%,SMD CAPACITOR ALUM ELEC,330UF,35V,20%,SMD CAPACITOR ALUM ELEC,47UF,35V,20%,SMD CAPACITOR ALUM ELEC,470UF,35V,20%,SMD CAPACITOR ALUM ELEC,100UF,16V,20%,SMD INDUCTOR,1.5UH,1.6A,20%,SMD INDUCTOR,15UH,600mA,20%,SMD INDUCTOR,150UH,170mA,20%,SMD INDUCTOR,2.2UH,1.4A,20%,SMD INDUCTOR,22UH,500mA,20%,SMD INDUCTOR,220UH,150mA,20%,SMD INDUCTOR,3.3UH,1.2A,20%,SMD INDUCTOR,33UH,400mA,20%,SMD INDUCTOR,15UH,900mA,20%,SMD INDUCTOR,150UH,280mA,20%,SMD INDUCTOR,22UH,750mA,20%,SMD INDUCTOR,220UH,240mA,20%,SMD INDUCTOR,33UH,600mA,20%,SMD INDUCTOR,330UH,190mA,20%,SMD CONN,FUSED POWER ENTRY MODULE,PLUG 10A IC,OP-AMP,42MHZ,10V/µs,?MAX-8 ZENER DIODE,1W,18V,DO-41 ADAPTER,J-LINK,19 PIN,FOR CORTEX-M RESISTOR,100KOHM,100mW,0.1%,0603 RESISTOR,100 OHM,100mW,0.001,603 RESISTOR,15KOHM,100mW,0.1%,0603 RESISTOR,2KOHM,100mW,0.1%,0603 RESISTOR,2.49KOHM,100mW,0.1%,0603 RESISTOR,20KOHM,100mW,0.1%,0603 RESISTOR,24.9KOHM,100mW,0.1%,0603 RESISTOR,4.99KOHM,100mW,0.1%,0603 RESISTOR,49.9KOHM,100mW,0.1%,0603 RESISTOR,100KOHM,125mW,0.1%,0805 RESISTOR,100 OHM,125mW,0.001,805 RESISTOR,2KOHM,125mW,0.1%,0805 RESISTOR,20KOHM,125mW,0.1%,0805 RESISTOR,4.99KOHM,125mW,0.1%,0805 RESISTOR,49.9KOHM,125mW,0.1%,0805 RESISTOR,100KOHM,250mW,0.1%,1206 RESISTOR,100 OHM,250mW,0.001,1206 RESISTOR,2KOHM,250mW,0.1%,1206 RESISTOR,20KOHM,250mW,0.1%,1206 END PLATE,G SERIES TERMINAL BLOCK RESISTOR,4.99KOHM,250mW,0.1%,1206 RESISTOR,49.9KOHM,250mW,0.1%,1206 CIRCULAR CONNECTOR,PLUG,8POS,CABLE TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,95DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL LAMP,INCAND,SLIDE,16V,640mW CONNECTOR,SIM CARD,2.54MM,6POS CONNECTOR,SIM CARD,2.54MM,6POS CONNECTOR,SIM CARD,2.54MM,6POS CONNECTOR,SIM CARD,2.54MM,8POS DIGITAL MICROSCOPE,MIGHTY SCOPE,80X CABINETS & ENCLOSURES,CABINE BRUCELLES GRIP MOUSSE ESD 125MM BRUCELLES GRIP MOUSSE ESD 115MM BRUCELLES GRIP MOUSSE ESD 115MM BRUCELLES GRIP MOUSSE ESD 120MM BRUCELLES GRIP MOUSSE ESD 130MM POIGNEE DE LAMES SCAPEL PQT 5 POIGNEE DE LAMES SCAPEL PQT 5 POIGNEE DE LAMES SCAPEL PQT 5 KNIFE TRIMMING W/3 SM92 BLADES COUTEAU A LAME 4313 PQT 5 COUTEAU A LAME 4313 PQT 5 COUTEAU A LAME 4313 PQT 5 COUTEAU A LAME 4313 PQT 5 COUTEAU A LAME 4313 PQT 5 COUTEAU A LAME 4313 PQT 5 COUTEAU A LAME 4313 PQT 5 FUSIBLE 100MA 250V RETARDE 4.5X8MM FUSIBLE 125MA 250V RETARDE 4.5X8MM FUSIBLE 250MA 250V RETARDE 4.5X8MM FUSIBLE 315MA 250V RETARDE 4.5X8MM FUSIBLE 400MA 250V RETARDE 4.5X8MM FUSIBLE 500MA 250V RETARDE 4.5X8MM FUSIBLE 630MA 250V RETARDE 4.5X8MM FUSIBLE 1.25A 250V RETARDE 4.5X8MM FUSIBLE 1.6A 250V RETARDE 4.5X8MM FUSIBLE 2A 250V RETARDE 4.5X8MM FUSIBLE 2.5A 250V RETARDE 4.5X8MM FUSIBLE 4A 250V RETARDE 4.5X8MM FUSIBLE 5A 250V RETARDE 4.5X8MM FUSIBLE 125MA 250V RETARDE 4.5X16MM FUSIBLE 160MA 250V RETARDE 4.5X16MM FUSIBLE 250MA 250V RETARDE 4.5X8MM FUSIBLE 315MA 250V RETARDE 4.5X8MM FUSIBLE 400MA 250V RETARDE 4.5X8MM FUSIBLE 800MA 250V RETARDE 4.5X8MM FUSIBLE 1A 250V RETARDE 4.5X8MM FUSIBLE 1.6A 250V RETARDE 4.5X8MM FUSIBLE 2A 250V RETARDE 4.5X8MM FUSIBLE 2.5A 250V RETARDE 4.5X8MM FUSIBLE 3.15A 250V RETARDE 4.5X8MM FUSIBLE 4A 250V RETARDE 4.5X8MM FUSIBLE 5A 250V RETARDE 4.5X8MM FUSIBLE 6.3A 250V RETARDE 4.5X8MM FUSIBLE 10A 250V RETARDE 4.5X8MM MICRO-D CONNECTOR,PLUG,15POS,WIRE LEADS MICRO-D CONNECTOR,RECEPTACLE,15POS,WIRE LEADS MICRO-D CONNECTOR,RECEPTACLE,21POS,WIRE LEADS MICRO-D CONNECTOR,RECEPTACLE,21POS,WIRE LEADS MICRO-D CONNECTOR,RECEPTACLE,37POS,WIRE LEADS MICRO-D CONNECTOR,PLUG,9POS,WIRE LEADS MICRO-D CONNECTOR,PLUG,9POS,WIRE LEADS IC,DIGITAL ISOLATOR,12NS,SOIC-16 MICRO-D CONNECTOR,PLUG,9POS,WIRE LEADS TRANSISTOR,PNP,-40V,TO-92 FFC/FPC CONNECTOR,RECEPTACLE,6POS 1ROW WIRE-BOARD CONNECTOR HEADER 3POS,2.54MM IC,8BIT SIPO SHIFT REGISTER,DIP-20 SSR,PANEL MOUNT,660VAC,32VDC,100A IC,RS485 TRANSCEIVER 250KBPS 5.5V DIP14 MICRO-D CONNECTOR,RECEPTACLE 37POS,RA-THD CLOSED END DUST COVER 2 POS,POLYESTER N CH MOSFET,30V,5A,3-SOT-23 LAMP,INCANDESCENT,TELEPHONE SLIDE,12V No description available - 2132255 MICRO-D CONNECTOR,PLUG 37POS,RA-THD MICRO-D CONNECTOR,RECEPTACLE,37POS,WIRE LEADS MICRO-D CONNECTOR,PLUG,21POS,WIRE LEADS IC,ACCELEROMETER,DIGITAL,3 AXIS,LFCS IC,ANALOG MULTIPLEXER,2X1,TSSOP-16 No description available - 2132289 IC,QUAD AND GATE,2I/P,SOIC-14 MICRO-D CONNECTOR,PLUG,9POS,WIRE LEADS IC,MOSFET DRIVER,HIGH/LOW SIDE,DIP-8 MICRO-D CONNECTOR,PLUG,25POS,WIRE LEADS MICRO-D CONNECTOR,RECEPTACLE,21POS,SOLDER DIP SOCKET,28POS,THROUGH HOLE IC,LDO REG,250mA,1.2V,3-TO-92 IC,DC-DC CONV,3MHz,SON-6 CAPACITOR ALUM ELEC 330UF,400V,20%,SNAP-IN IC,GYROSCOPE,500DPS,LGA-28 BOARD-BOARD CONNECTOR HEADER,6WAY,1ROW LAMP,INCANDESCENT,MINI BAYONET/BA9S,14V N CHANNEL JFET,-25V,SOT-23 SUPPORT DE TRANSMETTEUR X2 INDUCTOR,500NH,12.5A,20%,SMD INDUCTOR,8.2UH,5.8A,20%,SMD WIRE-BOARD CONNECTOR,HEADER,3POS,2MM LAMP,INCANDESCENT,MINI BAYONET/BA9S,28V FUSE,PTC RESET,72V,3A,RADIAL LAMP,INCANDESCENT,MINI BAYONET/BA9S,28V Miniature Lamp,36 volt,0.100 Amp,1000 MICRO-D CONNECTOR,PLUG,31POS,WIRE LEADS LAMP,INCANDESCENT,MINI BAYONET/BA9S,28V RESISTOR,THICK FILM,1KOHM,62.5mW,1% RESISTOR,THICK FILM,1KOHM,100mW,1% FUSE,PTC RESET,8V,2A,1812 MICRO-D CONNECTOR,PLUG 15POS,RA-THD WATERPROOF CAP,THERMOPLASTIC D SUB,STANDARD,RECEPTACLE,9POS,CABLE D SUB,STANDARD,PLUG,9POS,CABLE D SUB,HIGH DENSITY,RECEPTACLE,15POS,CABLE D SUB,HIGH DENSITY,PLUG,15POS,CABLE D SUB,STANDARD,RECEPTACLE,9POS,PANEL D SUB,STANDARD,PLUG,9POS,PANEL D SUB,HIGH DENSITY,RECEPTACLE,9POS,PANEL D SUB,HIGH DENSITY,PLUG,9POS,PANEL IC,8BIT MCU,PIC18F,48MHZ,DIP-28 ITO CAPACITIVE SENSE BOOSTERPACK MICRO-D CONNECTOR,PLUG,37POS,WIRE LEADS IC,DIG ISO,60ns,SOIC16 MICRO-D CONNECTOR,RECEPTACLE,15POS,WIRE LEADS MICRO-D CONNECTOR,RECEPTACLE,15POS,WIRE LEADS MICRO-D CONNECTOR,PLUG,15POS,WIRE LEADS CONTACT CLIP,PCB,SOCKET,SINGLE JUMPER LINK,2POS,PCB TRACK LAMP,INCANDESCENT,TELEPHONE SLIDE #3,24V SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SHIELD FINGER,SMT PCB SMT CABLE CLIP,COPPER ALLOY EVAL KIT,BLACKFIN,BF609 EZLITE KIT IC 14-STAGE RIPPLE CARRY COUNTER TSSOP16 CAPACITOR CERAMIC 22PF 100V,C0G,± 5%, COMPUTER CABLE,INFINIBAND,3M,NATURAL ADAPTER,DVI-I RECEPTACLE-VGA PLUG LAMP,INCANDESCENT,MINI BAYONET/BA9S,24V DETECTEUR OPTIQUE LAMP,INCANDESCENT,TELEPHONE SLIDE,24V WIRE-BOARD CONNECTOR,HEADER,6POS,2MM TERMINAL BLOCK,SPRING,10POS,30-12AWG TERMINAL BLOCK,SPRING,12POS,30-12AWG TERMINAL BLOCK,SPRING,10POS,30-12AWG TERMINAL BLOCK,SPRING,12POS,30-12AWG TERMINAL BLOCK,SPRING,2POS,30-12AWG TERMINAL BLOCK,SPRING,3POS,30-12AWG TERMINAL BLOCK,SPRING,4POS,30-12AWG TERMINAL BLOCK,SPRING,6POS,30-12AWG TERMINAL BLOCK,SPRING,8POS,30-12AWG TERMINAL BLOCK,SPRING,2POS,30-12AWG TERMINAL BLOCK,SPRING,3POS,30-12AWG TERMINAL BLOCK,SPRING,4POS,30-12AWG TERMINAL BLOCK,SPRING,6POS,30-12AWG TERMINAL BLOCK,SPRING,8POS,30-12AWG LED,HB,COOL WHT,122LM,SMD LED,HB,COOL WHT,130LM,SMD LED,HB,COOL WHT,139LM,SMD LED,HB,COOL WHT,122LM,SMD LED,HB,COOL WHT,130LM,SMD LED,HB,COOL WHT,139LM,SMD LAMP,INCANDESCENT,MINI BAYONET/BA9S,28V IC,ANALOG SWITCH,SINGLE,SPDT,SC-70-6 IC,LDO,FIXED,15V,100mA,30V,TO-92-3 LAMP,INCANDESCENT,120V,3W CIRCUIT LOGIQUE 4 BIT COMPT BIN TSSOP16 RESEAU DE DIODE TVS 500W 24V SOIC VARISTANCE 800J 750V IC,RS-232 TRANSCEIVER,5.5V,NSOIC-16 N CH MOSFET,30V,3.4A,3-SOT-23 LAMP,INCANDESCENT,MIDGET FLANGE,28V LAMP,INCANDESCENT,MIDGET FLANGE,6V IC,16BIT MCU,MSP430F2,16MHZ,40-VQFN N CHANNEL MOSFET,20V,20A,SOIC IC,8BIT SIPO SHIFT REGISTER,SOIC-14 FUSE,CARTRIDGE,1.6A,5X20MM,SLOW BLOW LAMP,INCANDESCENT,MIDGET FLANGE,28V LAMP,INCANDESCENT,MIDGET GROOVE,28V WIRE-BOARD CONNECTOR,HEADER,4POS,2MM IC,QUAD XOR GATE,2I/P,DIP-14 LAMP,INCANDESCENT,MINI BAYONET/BA9S,6V RESISTOR,THICK FILM,1MOHM,100mW,1% INDUCTOR,47UH,230MA,±10%,12MHz DUST COVER,MINI USB,SILICONE RUBBER,BLACK IC,PARALLEL TO I2C BUS CTRL,SOIC-20 IC,LINEAR VOLTAGE REGULATOR,12V,TO-92 RF JFET,N CH,30V,25MA,3-SOT-23 CONTROLEUR TEMP 4 RANGE 240V TIMER QUADRUPLE RANGE 240V ADAPTER,J-LINK,9 PIN,FOR CORTEX-M IC,8BIT MCU,PIC12,20MHZ,DIP-8 SPRING FINGER,MOBILE PHONES SPRING FINGER,PRELOADED,MOBILE PHONES SPRING FINGER,PRELOADED,MOBILE PHONES SPRING FINGER,PRELOADED,MOBILE PHONES SPRING FINGER,MOBILE PHONES SPRING FINGER,PRELOADED,MOBILE PHONES TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL TRANSDUCER,ALARM,85DBA,28V,PANEL USB A CONNECTOR,RECEPTACLE 4POS IC,LED DRVR,LGA56 CONTROLEUR SERVO ESCON 36V 72W PWM CONNECTEUR SET POUR ESCON 36/DC2 CABLE E/S ANALOGIQUE POUR ESCON 36/DC2 CABLE MOTEUR DC POUR ESCON 36/DC2 CABLE E/S NUMERIQUE POUR ESCON 36/DC2 CABLE ENCODEURPOUR ESCON 36/DC2 PUISSANCE CABLE POUR ESCON 36/DC2 CABLE USB POUR ESCON 36/DC2 FUSE,PTC RESET,24V,1.5A,1812 ZENER DIODE,3W,16V,SMB IC,LINEAR VOLT REGULATOR,3.3V,TO-220 IC,LDO REG,500mA,2.5V,8-SOIC SSR,PANEL MOUNT,280VAC,32VDC,10A LAMP,INCANDESCENT,120V,6W IC,DIGITAL ISOLATOR,50NS,SOIC-16 IC,8BIT MCU,PIC18F,16MIPS,TQFP-80 RFID TRANSPONDER,13.56MHZ,2KBIT,CD IN COMMUTATEUR BAROMETRIQUE LAMP,INCANDESCENT,WEDGE,14V PLUG & SOCKET CONNECTOR,RCPT,6POS,3MM FUSE,CARTRIDGE,10A,5X20MM,TIME DELAY WIRE-BOARD CONNECTOR RECEPTACLE,2POS,2 CAPACITOR ALUM ELEC 220UF,450V,20%,SNAP-IN IC,RTC,YY-MM-DD,56 X 8,DIP-8 LAMP,INCANDESCENT,W2.1X4.9D,14V BIPOLAR TRANSISTOR,PNP,-80V CAPACITOR ALUM ELEC 1UF,50V,20%,SMD RESISTOR,THICK FILM,10KOHM,100mW,1% LAMP,INCANDESCENT,MINI BAYONET/BA9S,6V SCHOTTKY RECTIFIER,CMN CTHD,30A SOT-93 LAMP,INCANDESCENT,MINI BAYONET/BA9S,14V IC,NEGATIVE VOLT REGULATOR,-5V,TO-92 IC,OP-AMP,1.2MHZ,0.5V/ us,SOIC-14 LAMP,INCANDESCENT,MINI BAYONET/BA9S,28V MULTICOLOR LED,0606,YEL/GRN DC-DC CONV,ISO POL,2 O/P,30W,3A,3A,5V,-5V LAMP,INCANDESCENT,W2.1X4.9D,28V ADAPTER,J-LINK TO PCB,10 PIN NEEDLE CAPACITOR TANT,1UF,50V,8 OHM,0.1,RADIAL TORQUE DRIVER MECATRONIQUE 0.8-3NCM TORQUE DRIVER MECATRONIQUE 1-6NM JEU DE TORX BIT MAXXTOR 29MM 8PC JEU DE TORX/PZ/PH BIT 29MM 8PC JEU DE TORX BIT MAXXTOR 49MM 7PC JEU DE TORX/PZ/PH BIT 49MM 7PC JEU DE FORET HSS-TIN 19PC JEU DE FORET N-HSS-TIN 25PC SET,TWIST DRILL,N-HSS-R,170PC PERCEUSE PNEUMATIQUE REVERSIBLE 1/4 PERCEUSE PNEUMATIQUE NON-REVERS. 1/4 CORDONS ETHERNET PATCHCORD SEAL 2M CORDONS ETHERNET PATCHCORD SEAL 3M CORDONS ETHERNET PATCHCORD SEAL 5M CORDONS USB2.0 A VERS B 2M CORDONS USB2.0 A VERS B 3M CORDONSE USB2.0 B VERS A 2M CORDONS USB2.0 B VERS A 3M MODULE RF TRX 868MHZ 2KM MODULE RF TRX 868MHZ 2KM MODULE RF TELEMETRIE 868MHZ DIP 2KM MODULE RF TELEMETRIE 868MHZ SMT 2KM MODULE RF MODEM 868MHZ DIP 2KM MODULE RF MODEM 868MHZ SMT 2KM ANTENNE PIGTAIL 433MHZ 2DB SMA(M) ANTENNE STUBBY 433MHZ SMA(M) ANTENNE STUBBY 433MHZ 90DEG SMA(M) ANTENNE STUBBY 2.4GHZ W/ SMA ANTENNE STUBBY 2.4GHZ 90DEG SMA ANTENNE STUBBY 2.4GHZ PIGTAIL 50MM UFL ANTENNE PUCK 433 / 868MHZ W/ SMA CONN ANTENNE PCB GSM QUADBAND 35X6 UFL ANTENNE PCB GSM PENTABAND 42X42 COAX UFL ANTENNE PCB GSM QUADBAND 45X20 COAX UFL ANTENNE PCB GSM PENTABAND 81X21 COAX UFL ANTENNE PANEL GSM/WIFI 7DB QUADBAND ANTENNE GSM YAGI 23DB 868MHZ ANTENNE GSM I BAR FMEF CONN QUADBAND ANTENNE GSM T BAR FMEF CONN QUADBAND CAPACITOR CERAMIC 330PF 100V,C0G,10%,1206 TOWER CD S12G128 FUSE,PTC RESET,60V,300mA,2106 MICROCONTR KINETIS K10 CORTEX M4 32QFN MICROCONTR KINETIS K10 CORTEX M4 48QFN MICROCONTR KINETIS K10 CORTEX M4 48LQFP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS K10 CORTEX M4 64MAP MICROCONTR KINETIS K10 CORTEX M4 32QFN MICROCONTR KINETIS K10 CORTEX M4 48QFN MICROCONTR KINETIS K10 CORTEX M4 48LQFP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS K10 CORTEX M4 64MAP MICROCONTR KINETIS K10 CORTEX M4 80LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K10 CORTEX M4 144MAP MICROCONTR KINETIS K10 CORTEX M4 121MAP MICROCONTR KINETIS K10 CORTEX M4 48QFN MICROCONTR KINETIS K10 CORTEX M4 48LQFP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS K10 CORTEX M4 64MAP MICROCONTR KINETIS K10 CORTEX M4 48QFN MICROCONTR KINETIS K10 CORTEX M4 48LQFP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS K10 CORTEX M4 121MAP MICROCONTR KINETIS K10 CORTEX M4 64MAP MICROCONTR KINETIS K10 CORTEX M4 144MAP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS K10 CORTEX M4 80LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K10 CORTEX M4 121MAP MICROCONTR KINETIS K10 CORTEX M4 144MAP MICROCONTR KINETIS K10 CORTEX M4 121MAP MICROCONTR KINETIS K10 CORTEX M4 48QFN MICROCONTR KINETIS K10 CORTEX M4 48LQFP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS K10 CORTEX M4 64MAP MICROCONTR KINETIS K10 CORTEX M4 48QFN MICROCONTR KINETIS K10 CORTEX M4 48LQFP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS K10 CORTEX M4 64LQFP MICROCONTR KINETIS K10 CORTEX M4 80LQFP MICROCONTR KINETIS K10 CORTEX M4 121MAP MICROCONTR KINETIS K10 CORTEX M4 64MAP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K10 CORTEX M4 144MAP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K10 CORTEX M4 144MAP MICROCONTR KINETIS K20 CORTEX M4 32QFN MICROCONTR KINETIS K20 CORTEX M4 48QFN MICROCONTR KINETIS K20 CORTEX M4 48LQFP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 64MAP MICROCONTR KINETIS K20 CORTEX M4 32QFN MICROCONTR KINETIS K20 CORTEX M4 48QFN MICROCONTR KINETIS K20 CORTEX M4 48LQFP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 64MAP MICROCONTR KINETIS K20 CORTEX M4 80LQFP MICROCONTR KINETIS K20 CORTEX M4 121MAP MICROCONTR KINETIS K20 CORTEX M4 144MAP MICROCONTR KINETIS K20 CORTEX M4 32QFN MICROCONTR KINETIS K20 CORTEX M4 48QFN MICROCONTR KINETIS K20 CORTEX M4 48LQFP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 64MAP MICROCONTR KINETIS K20 CORTEX M4 32QFN MICROCONTR KINETIS K20 CORTEX M4 48QFN MICROCONTR KINETIS K20 CORTEX M4 48LQFP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS K20 CORTEX M4 64MAP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 80LQFP MICROCONTR KINETIS K20 CORTEX M4 80LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS K20 CORTEX M4 121MAP MICROCONTR KINETIS K20 CORTEX M4 32QFN MICROCONTR KINETIS K20 CORTEX M4 48QFN MICROCONTR KINETIS K20 CORTEX M4 48LQFP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 64MAP MICROCONTR KINETIS K20 CORTEX M4 32QFN MICROCONTR KINETIS K20 CORTEX M4 48QFN MICROCONTR KINETIS K20 CORTEX M4 48LQFP Hand Held Enclosure MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 64LQFP MICROCONTR KINETIS K20 CORTEX M4 64MAP MICROCONTR KINETIS K30 CORTEX M4 80LQFP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K30 CORTEX M4 64LQFP MICROCONTR KINETIS K30 CORTEX M4 64LQFP MICROCONTR KINETIS K30 CORTEX M4 80LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS K30 CORTEX M4 121MAP MICROCONTR KINETIS K30 CORTEX M4 64LQFP MICROCONTR KINETIS K30 CORTEX M4 121MAP MICROCONTR KINETIS K40 CORTEX M4 80LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K40 CORTEX M4 64LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS K40 CORTEX M4 121MAP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K40 CORTEX M4 64LQFP MICROCONTR KINETIS K40 CORTEX M4 80LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K40 CORTEX M4 121MAP MICROCONTR KINETIS K40 CORTEX M4 144MAP Hand Held Enclosure MICROCONTR KINETIS K40 CORTEX M4 121MAP MICROCONTR KINETIS K40 CORTEX M4 121MAP MICROCONTR KINETIS K40 CORTEX M4 64LQFP MICROCONTR KINETIS K40 CORTEX M4 121MAP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 121MAP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 121MAP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 256MAP MICROCONTR KINETIS K60 CORTEX M4 256MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 256MAP MICROCONTR KINETIS K10 CORTEX M4 144MAP MICROCONTR KINETIS K10 CORTEX M4 121MAP MICROCONTR KINETIS K20 CORTEX M4 144MAP RESISTOR,METAL FILM,100 OHM,125mW,0.1% MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS K30 CORTEX M4 121MAP MICROCONTR KINETIS K30 CORTEX M4 144MAP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS CORTEX M4 100LQFP MICROCONTR KINETIS K40 CORTEX M4 121MAP MICROCONTR KINETIS K40 CORTEX M4 144MAP MICROCONTR KINETIS K50 CORTEX M4 121MAP MICROCONTR KINETIS K50 CORTEX M4 121MAP MICROCONTR KINETIS CORTEX M4 144LQFP MICROCONTR KINETIS K50 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 121MAP MICROCONTR KINETIS K60 CORTEX M4 121MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP MICROCONTR KINETIS K60 CORTEX M4 144MAP N CHANNEL MOSFET,1KV,1.6mA D SUB CONNECTOR,STANDARD,9POS,RCPT SSR,PANEL MOUNT,280VAC,32VDC,25A COAXIAL CABLE,RG-174A/U,72IN,BLACK COAXIAL CABLE,RG-59B/U,72IN,BLACK COAXIAL CABLE,RG-58A/U,72IN,BLACK COAXIAL CABLE,RG-316/U,12IN,BLACK COAXIAL CABLE,RG-223/U,36IN,BLACK COAXIAL CABLE,RG-174A/U,60IN,BLACK POWER CORD,TAIWAN TW15CS3/C13,BLK,2.5M,10A POWER CORD,KOREAN M2511/C13,BLK,2.5M,10A INDUCTOR,100UH,350MA,±10%,6MHz P CHANNEL MOSFET,-30V,10A,SOIC FUSE,CARTRIDGE,6.3A,5X20MM,SLOW BLOW WIRE-BOARD CONNECTOR RECEPTACLE,3POS,2 HIGH CURRENT INDUCTOR,10µH,7A,20% COAXIAL CABLE,RG-58A/U,36IN,BLACK 02 SIL Vert Pin Hdr 56K0146 No description available - 2133825 MINI USB TYPE B CONNECTOR,RCPT 5POS THD CONTACT,FEMALE,28-26AWG,CRIMP IC,AUDIO PWR AMP,CLASS AB 60mW TQFN-12 PTC THERMISTOR RESISTOR,THICK FILM,100KOHM,100mW,1% IC,QUAD NAND GATE,SCHMITT TRIG SOIC-14 IC,LINEAR VOLTAGE REGULATOR,5V,TO-92 CONTACTOR,1NO,24VAC,14A,DIN RAIL MULTICOLOR LED,1210,YEL/GRN RF JFET,N CH,20V,25MA,3-SOT-23 ADAPTATEUR RASPBERRY PI HDMI VERS VGA DONGLE WIFI USB FOR RASPBERRY PI POWER CORD,C13,BLK,2.5M,10A POWER CORD,IEC60320-1,1.8M,10A,BLACK POWER CORD,IEC60320-1,1.8M,7.5A BLACK POWER CORD,IEC60320-1,1.8M,2.5A BLACK POWER CORD,C7,BLK,1.8M,3A POWER CORD,C7,BLK,1.8M,2.5A POWER CORD,IEC60320-1,1.8M,10A,BLACK POWER CORD,NEMA 1-15P/IEC C7,1.8M,7A,BLK LCD MODULE,4.3 IC,LDO VOLT REG,3.3V,250mA,3-SOT-23 IC,3 TO 8 LINE DECODER/DMUX,TSSOP-16 IC,ANALOG MUX/DMUX,DUAL 4 X 1,DIP-16 CONDENSATEUR KIT 0603 SUPPRESSEUR ESD 0.1PF 1 CH SUPPRESSEUR ESD 0.2PF 1 CH SUPPRESSEUR ESD 0.2PF 2 CH SUPPRESSEUR ESD 0.1PF 1 CH SUPPRESSEUR ESD 0.2PF 1 CH SUPPRESSEUR ESD 0.2PF 4 CH SUPPRESSEUR ESD 0.2PF 4 CH SUPPRESSEUR ESD 0.2PF 6 CH RATE COUNTER IC,NON INVERTING BUFFER GATE,SOT-23-5 MICRO-D CONNECTOR,PLUG,15POS,SOLDER CONNECTOR,HEADER,10POS,2ROW,2.54MM SIP SOCKET,20POS,THROUGH HOLE FUSE,PTC RESET,60V,550mA,2106 FFC/FPC CONNECTOR,RECEPTACLE 50POS 1ROW IC,ANALOG SWITCH,SINGLE,SPST,SC-70-5 CONNECTOR,RCPT,16POS,1ROW,2.54MM P CHANNEL MOSFET,-100V,1A SOT-223 SSR,PANEL MOUNT,280VAC,280VAC,25A SATA CONNECTOR,PLUG,22POS,SMD MODULE COMMUTATEUR RADIO TX 868MHZ CONNECTOR,HEADER,20POS,2ROW,2.54MM CONNECTOR,HEADER,40POS,2ROW,2.54MM CONNECTOR,HEADER,10POS,2ROW,2.54MM CONNECTOR,RCPT,50POS,2ROW,IDC,2.54MM DARLINGTON TRANSISTOR,PNP,-80V,TO-225 CONTACT,PCB,RECEPTACLE,SINGLE EMI POWER LINE FILTER, MODULE COMMUTATEUR RADIO TX 868MHZ MODULE ELECTRODYNAMIC ENERGY CONVER MODULE TRX DOLPHIN-BASED 868MHZ MODULE TRX DOLPHIN-BASED 315MHZ MODULE DC/DC CONV FOR STM300 / 312 MODULE TRX DOLPHIN-BASED 868MHZ MODULE TRX DOLPHIN-BASED 315MHZ MODULE TRX DOLPHIN-BASED 868MHZ MODULE TRX DOLPHIN-BASED 315MHZ MODULE TX MAGNET-CONTACT 868MHZ MODULE TX MAGNET-CONTACT 315MHZ MODULE WIRELESS TEMP SENSOR 868MHZ MODULE WIRELESS TEMP SENSOR 315MHZ MODULE SOC RFTRX W8051 MICROCONTR 868MHZ MODULE SOC RFTRX W8051 MICROCONTR 315MHZ MODULE SOC GATEWAY TRX W8051 MICROCONTR MODULE SOC GATEWAY TRX W/8051 MICROCONTR MODULE SOC RFTRX W8051 MICROCONTR 868MHZ MODULE SOC RFTRX W8051 MICROCONTR 315MHZ KIT ENERGY HARVEST WIRELESS 315MHZ DEV KIT SOLAR POWERED RADIO 868MHZ DEV KIT SOLAR POWERED RADIO 315MHZ DEV KIT,RF THERMO,EDK300,868MHZ DEV KIT RF THERMO EDK300 315MHZ CONNECTOR,HEADER,26POS,2ROW,2.54MM CONNECTOR,HEADER,34POS,2ROW,2.54MM SHORT LATCH,BLK,PPA CONNECTOR,RCPT,8POS,1ROW,2.54MM CONNECTOR,RCPT,16POS,1ROW,2.54MM CONNECTOR,RCPT,2POS,1ROW,2MM CONNECTOR,HEADER,4POS,1ROW,2MM CONNECTOR,HEADER,5POS,1ROW,2MM CONNECTOR,HEADER,6POS,1ROW,2MM CONNECTOR,HEADER,8POS,1ROW,2MM CONNECTOR,HEADER,10POS,1ROW,2MM SOLDERING TIP,FINE,HIGH EFFICIENCY,1/ IC,ADC,8BIT,200KSPS,SOIC-16 CONTACT,PIN,24-20AWG,CRIMP CONNECTOR,HEADER,50POS,2.54MM BRAID,DESOLDERING,ROSIN,50FT BOARD TO BOARD CONNECTOR,HEADER,3POS,1ROW IC,RS-232 TXRX,460KBPS,3.6V,TSSOP-24 WIRE-BOARD CONNECTOR HEADER 2WAY,2.54MM CONNECTOR,HEADER,2POS,1ROW,2.54MM CONNECTOR,HEADER,5POS,1ROW,2.54MM CONNECTOR,HEADER,14POS,1ROW,2.54MM CONNECTOR,HEADER,16POS,1ROW,2.54MM CONNECTOR,HEADER,16POS,2ROW,2.54MM IC,HEX INVERTER,SCHMITT TRIGGER,DIP14 D SUB BACKSHELL,THERMOPLASTIC OPTOCOUPLER IC,HEX INVERTER,SOIC-14 UHF POWER TRANSISTOR,NPN,9.5V,500MA, FUSE HOLDER,5 X 20MM,PCB MOUNT MICRO-D CONNECTOR,PLUG,9POS,SOLDER USB TYPE A CONNECTOR RECEPTACLE 4POS THD DIP SOCKET,28POS,THROUGH HOLE STARTER KIT,STM32 F-2 SERIES 32BIT MCUs W/ IAR TOOLS TRIAC,600V,16A,TO-220AB ZENER DIODE,1W,30V,DO-41 J-LINK ISOLATOR,JTAG,FOR ARM MICRO-D CONNECTOR,PLUG,9POS,SOLDER IC,ANALOG MUX/DMUX,DUAL 4 X 1,TSSOP16 EVAL KIT,STM32F0xx BOARD W/ LCD BACKSHELL,D-SUB,DA,ZINC D SUB CONNECTOR,STANDARD,RECEPTACLE,9POS DUST COVER,STEEL BOITE DE JONCTION WAGOBOX NOIR BOITE DE JONCTION WAGOBOX WHITE BOITE DE JONCTION WAGOBOX RED BOITE DE JONCTION WAGOBOX LIGHT MICROCOMMUTATEUR 0.1A PLUNGER SOLDER MICROCOMMUTATEUR 0.1A PLUNGER PCB MICROCOMMUTATEUR 0.1A LEVER SOLDER MICROCOMMUTATEUR 0.1A LEVER PCB MICROCOMMUTATEUR 0.1A SIM ROLLER SOLDER MICROCOMMUTATEUR 0.1A SIM ROLLER PCB MICROCOMMUTATEUR 2A PLUNGER SOLDER MICROCOMMUTATEUR 2A PLUNGER PCB MICROCOMMUTATEUR 2A LEVER SOLDER MICROCOMMUTATEUR 2A LEVER PCB MICROCOMMUTATEUR 2A SIM ROLLER SOLDER MICROCOMMUTATEUR 2A SIM ROLLER PCB CONNECTEUR CARTE MICRO SD CAPTEUR INERTI 10 DEG 6ML24 FILTRE AC MONOPHASE 1A 250V MONOPHASE FILTRE AC MONOPHASE 2A 250V MONOPHASE FILTRE AC MONOPHASE 4A 250V MONOPHASE FILTRE AC MONOPHASE 6A 250V MONOPHASE FILTRE AC MONOPHASE 10A 250V MONOPHASE FILTRE AC MONOPHASE 2A 250V MONOPHASE FILTRE AC MONOPHASE 4A 250V MONOPHASE FILTRE AC MONOPHASE 6A 250V MONOPHASE FILTRE AC MONOPHASE 10A 250V MONOPHASE FILTRE AC MONOPHASE 16A 250V MONOPHASE FILTRE AC MONOPHASE 10A 250V MONOPHASE FILTRE AC MONOPHASE 20A 250V MONOPHASE FILTRE AC MONOPHASE 8A 250V MONOPHASE FILTRE AC MONOPHASE 12A 250V MONOPHASE FILTRE AC MONOPHASE 25A 250V MONOPHASE FILTRE AC MONOPHASE 10A 250V MONOPHASE FILTRE AC MONOPHASE 20A 250V MONOPHASE FILTRE AC MONOPHASE 1A 250V MONOPHASE FILTRE AC MONOPHASE 2A 250V MONOPHASE FILTRE AC MONOPHASE 3A 250V MONOPHASE FILTRE AC MONOPHASE 6A 250V MONOPHASE FILTRE AC MONOPHASE 1A 250V MONOPHASE FILTRE AC MONOPHASE 6A 250V MONOPHASE FILTRE AC MONOPHASE 10A 250V MONOPHASE FILTRE AC MONOPHASE 12A 250V MONOPHASE FILTRE AC MONOPHASE 16A 250V MONOPHASE FILTRE AC MONOPHASE 20A 250V MONOPHASE FILTRE AC MONOPHASE 30A 250V MONOPHASE FILTRE AC MONOPHASE 3A 250V MONOPHASE FILTRE AC MONOPHASE 10A 250V MONOPHASE FILTRE AC MONOPHASE 16A 250V MONOPHASE FILTRE AC MONOPHASE 36A 250V MONOPHASE FILTRE AC MONOPHASE 3A 250V MONOPHASE FILTRE AC MONOPHASE 10A 250V MONOPHASE FILTRE AC TRIPHASE 6A 480V TRIPHASE FILTRE AC TRIPHASE 20A 480V TRIPHASE FILTRE AC TRIPHASE 6A 480V TRIPHASE FILTRE AC TRIPHASE 8A 480V TRIPHASE FILTRE AC TRIPHASE 16A 480V TRIPHASE FILTRE AC TRIPHASE 25A 480V TRIPHASE FILTRE AC TRIPHASE 36A 480V TRIPHASE FILTRE AC TRIPHASE 50A 480V TRIPHASE FILTRE AC TRIPHASE 3A 480V TRIPHASE FILTRE AC TRIPHASE 6A 480V TRIPHASE FILTRE AC TRIPHASE 10A 480V TRIPHASE FILTRE AC TRIPHASE 8A 480V TRIPHASE FILTRE AC TRIPHASE 12A 480V TRIPHASE FILTRE AC TRIPHASE 16A 480V TRIPHASE FILTRE AC TRIPHASE 25A 480V TRIPHASE FILTRE AC TRIPHASE 36A 480V TRIPHASE FILTRE AC TRIPHASE 50A 480V TRIPHASE FILTRE AC TRIPHASE 10A 480V TRIPHASE FILTRE AC TRIPHASE 20A 480V TRIPHASE FILTRE AC TRIPHASE 36A 480V TRIPHASE FILTRE AC TRIPHASE 50A 480V TRIPHASE FILTRE AC TRIPHASE 66A 480V TRIPHASE FILTRE AC TRIPHASE 80A 480V TRIPHASE FILTRE AC TRIPHASE 115A 480V TRIPHASE FILTRE AC TRIPHASE 7A 480V TRIPHASE FILTRE AC TRIPHASE 16A 480V TRIPHASE FILTRE AC TRIPHASE 30A 480V TRIPHASE FILTRE AC TRIPHASE 42A 480V TRIPHASE FILTRE AC TRIPHASE 55A 480V TRIPHASE FILTRE AC TRIPHASE 75A 480V TRIPHASE FILTRE AC TRIPHASE 100A 480V TRIPHASE FILTRE AC TRIPHASE 130A 480V TRIPHASE FILTRE AC TRIPHASE 180A 480V TRIPHASE FILTRE AC TRIPHASE 8A 520V TRIPHASE FILTRE AC TRIPHASE 16A 520V TRIPHASE FILTRE AC TRIPHASE 25A 520V TRIPHASE FILTRE AC TRIPHASE 36A 520V TRIPHASE FILTRE AC TRIPHASE 64A 520V TRIPHASE FILTRE AC TRIPHASE 80A 520V TRIPHASE FILTRE AC TRIPHASE 120A 520V TRIPHASE FILTRE AC TRIPHASE 160A 520V TRIPHASE FILTRE AC TRIPHASE 200A 520V TRIPHASE FILTRE AC TRIPHASE 16A 480V TRIPHASE FILTRE AC TRIPHASE 25A 480V TRIPHASE FILTRE AC TRIPHASE 36A 480V TRIPHASE FILTRE AC TRIPHASE 50A 480V TRIPHASE FILTRE AC TRIPHASE 64A 480V TRIPHASE FILTRE AC TRIPHASE 110A 480V TRIPHASE FILTRE AC TRIPHASE 150A 480V TRIPHASE FILTER TRIPHASEE 8A FILTER TRIPHASEE 16A FILTER TRIPHASEE 36A FILTER TRIPHASEE 160A FILTER TRIPHASEE 16A FILTER TRIPHASEE 30A FILTER TRIPHASEE 42A FILTER TRIPHASEE 75A FILTER TRIPHASEE 100A FILTER TRIPHASEE 110A LAMP HOLDER SCREW MOUNT FFC/FPC CONNECTOR,RECEPTACLE 36POS 1ROW CABLE ASSEMBLY,SPLIT LEAD,BLU / YEL / GRN SSR,PANEL MOUNT,280VAC,32VDC,50A IC,RS-232 TRANSCEIVER,5.5V,DIP-16 DARLINGTON TRANSISTOR,NPN,100V,TO-225 VRS SPEED SENSOR 190V 910 OHM to 1200 OHM 0.25ms WIRE-BOARD CONNECTOR RECEPTACLE,6POS,2 HALL-EFFECT ZERO SPEED SENSOR,4.5VDC-26VDC,4 s HALL-EFFECT ZERO SPEED SENSOR,4VDC to 24VDC,4 us VRS SPEED SENSOR 55V 275 OHM TO 330 OHM 0.38 ms VRS SPEED SENSOR,190V P-P,910 OHMS,0.25 ms VRS SPEED SENSOR 190V 910 OHM to 1200 OHM 0.25 ms VRS SPEED SENSOR 190V910 OHMto 12000 OHM 0.25 ms HALL-EFFECT ZERO-SPEED SENSOR,8VDC to 30VDC HALL-EFFECT ZERO-SPEED SENSOR,8VDC to 25VDC IC,ANALOG MULTIPLEXER,8 X 1,SOIC-16 MOSFET,N CH,30V,1.9A,3-SOT-23 LCD MODULE,7 CONTACT,FEMALE,30-24AWG,CRIMP IC,LDO VOLT REG,-2.5V,0.2A,5-SOT-23 EEPROM SERIE 1KB 128-BIT SN 8SOIC EEPROM SERIE 1KB 128-BIT SN 8TSSOP EEPROM SERIE 2KB 128-BIT SN 8SOIC EEPROM SERIE 2KB 128-BIT SN 8TSSOP EEPROM SERIE 4KB 128-BIT SN 8SOIC EEPROM SERIE 4KB 128-BIT SN 8TSSOP EEPROM SERIE 8KB 128-BIT SN 8SOIC EEPROM SERIE 8KB 128-BIT SN 8TSSOP EEPROM SERIE 2KB 48-BIT MAC 8SOIC EEPROM SERIE 2KB 48-BIT MAC 8TSSOP EEPROM SERIE 2KB 64-BIT MAC 8SOIC EEPROM SERIE 2KB 64-BIT MAC 8TSSOP IC MOTOR DRIVER,STEPPER,2A,HTSSOP-16 DC/DC CONVERTER,5V / -5V,3W PROGRAMMATEUR / DEBOGEUR CYCLONE MAX PROGRAMMATEUR MPC5XX MULTILINK USB DEBOGEUR GIGABIT TAP CODE WARRIOR USB TAP COLDFIRE CARTE DE DEMO MC9S12XDP512 CARTE D´EVAL MPR121 SENSOR CARTE D´EVAL IMX53 MCIMX53-START INTERFACE CARD HDMI 24BIT DEV KIT ELECTROCARDIOGRAPH SENSOR KIT D´EVAL MPC830X CARTE D´EVAL P1020 QORIQ CARTE D´EVAL P1022 QORIQ MODULE COM EXPRESS P4080 CARTE DE DEV MPC5634M STARTER TRAK SYSTEME TOWERKIT MC56F8257 CARTE ELEVATEUR TOWER TOWER SERIE I/O HARDWARE SYSTEME TOWERINTERFACE BOARD SYSTEME TOWERWIFI MODULE MODULE TOWER WIFI REDPINE SIGNAL IC,SENSOR,TOUCH SENSING,32QFN CW GIGABIT TAP+TRC CBL CARTE DE DEMO MMA8491 CARTE D´EVAL MC33660 SERIE LINK KIT TOWER MC12311 868MHZ RADIO KIT TOWER MC12311 868MHZ RADIO MODULE TOWER INDUSTRIAL I/O KIT TOWER K60D 100MHZ KIT TOWER TWR-LCD-RGB MODULE TOWER PXD10 KIT TOWER PXD10 MODULE TOWER PXD20 KIT TOWER PXD20 MODULE TOWER PXR40 KIT TOWER PXR40 MODULE TWR GAINSPAN 802.11BGN DEV TOOLBOX MOTOR CNTRL MPC567XK DEV TOOLBOX MOTOR CNTRL PXS20 DEV TOOLBOX MOTOR CNTRL PXS30 LOGICIEL CONTROLE MOTEUR MPC564XL LOGICIEL CONTROLE MOTEUR MPC567XK LOGICIEL CONTROLE MOTEUR PXS30 DEV TOOLBOX MOTOR CNTRL MPC564XL CARTE ADAPT ATEUR 22COP/JTAG IC,NON INVERTING BUS TXRX,6-SOT-23 USB CONNECTOR,RECEPTACLE,4POS,THROUGH HOLE BOARD-BOARD CONNECTOR RECEPTACLE,14WAY,2ROW MANUAL SWITCH,30A,NON-REVER,3-PH,TOGGLE OPER TERMINAL,SPADE/FORK,1/4 INDUCTOR,470NH,150MA,±10%,480MHz PANEL BASE W/COVER,SINGLE LEVER,STANDARD MOUNT IC,DIGITAL ISOLATOR,150NS,SOIC-8 IC,CURRENT SENS AMP,450kHz,MSOP-8 CIRCUIT BREAKER INTERLOCK KIT,100A - 125A DUCT,SLOTTED F TYPE,6.25´´W X 4.1 CAPACITOR CERAMIC 2200PF,100V,X7R,± 1 LABELING TAPE,VINYL,1.5´´ X 30FT,BLK ON ORG CAPACITOR ALUM ELEC 4UF WIRE LEAD CONTACT BLOCK,2NC,SCREW CLAMP RESISTOR,100 OHM,10W,0.05,AXIAL WIRE-BOARD CONNECTOR RECEPTACLE 16POS,2.54MM IC,OP-AMP,4.5MHZ,9V/µs,SOIC-8 SOFTWARE,LABELING,LABELMARK 5 STD,CD-ROM HYPERFAST DIODE,8A,1.2KV TO-220AC IC,ANALOG MUX/DMUX,8 X 1,DIP-16 INSERTION/REMOVAL TOOL,D-SUB CRIMP CONTACT Semi-Shielded Power Inductors RESISTOR,WIREWOUND,3KOHM,20W,5% TERMINAL,RING TONGUE,3/8´´ 18-14AWG,CRIMP,BLU IC,I/O EXPANDER,8BIT,100KHZ,SSOP-20 SWITCH BODY,LIMIT SWITCH OPTOISOLATOR,TRIAC,7500V IC,OP-AMP,1.2MHZ,0.5V/ us,TSSOP-14 TERMINAL,RING TONGUE,#10,12-10AWG,CRIMP,YEL TUBING,SOLID CORRUGATED LOOM,7.03MM,BLK,100FT SWITCH,SAFETY INTERLOCK,SPST,600V FERRITE BEAD,0.7OHM,300mA,0603 ADAPTER,J-LINK,FOR ARM7 / ARM9 / ARM11 IC,OP-AMP,1.2MHZ,0.5V/ us,TSSOP-14 CABLE GLAND,STR,NYLON,BLK,HUB SZ1/2 CAPACITOR TANT,10UF,35V,2 OHM,0.1,RAD ACCELEROMETRE 2AXES +/-2G 8LCC ACCELEROMETRE 2AXES +/-2G 8LCC MAGNETOMETER 3AXES 400KHZ 10LGA OUTIL BOITIER EVOLUTION ROLLING 45L OUTIL BOITIER EVOLUTION ROLLING 65L HIGH BRIGHTNESS LED,ULTRA VIOLET,10W CARTE EVAL MTS2916A STEPPER DRIVER CARTE DEMO MCP6N11 MCP6V2X BRIDGE BOARD-BOARD CONNECTOR RECEPTACLE,24WAY, ZENER DIODE,350mW,13V,SOT-23 RESISTOR,DUAL TERM 16,220/330 OHM 2% SIP RESISTOR,CURRENT SENSE,0.01OHM,1W,1% CAPACITOR ALUM ELEC 4.7UF 50V 20%,SMD WIRE-BOARD CONNECTOR,HEADER,16POS,2MM IC,OP-AMP,1MHZ,0.5V/ us,SOT-23-5 IC,ADJ LDO REG,1.2V TO 5.5V,5-SOT-23 ZENER DIODE,1W,39V,DO-41 TERMINAL,TURRET,THROUGH HOLE CAPOT D NOIR 9VOIES CAPOT D NOIR 15VOIES HOOD,D,BLACK,37WAY CAPOT D ROUGE 9VOIES CAPOT D ROUGE 25VOIES CAPOT D BLEU 9VOIES CAPOT D BLEU 15VOIES CAPOT D BLEU 25VOIES CAPOT D JAUNE 15VOIES CAPOT D JAUNE 25VOIES CAPOT D VERT 15VOIES CAPOT D VERT 25VOIES CAPOT D GRIS 9VOIES CAPOT D GRIS 25VOIES CAPOT D COMPUTER GRIS 15VOIES CAPOT D NICKEL 45DG 9VOIES CAPOT D NICKEL 45DG 15VOIES RUBAN FILM EPOXY 25MM X 66M RUBAN PAPIER 50MM X 55M RUBAN PAPIER 19MM X 55M RUBAN POLYESTER 15MM X 55M RUBAN POLYESTER 19MM X 55M RUBAN CREPE 12MM X 55M RUBAN CREPE 19MM X 20M RUBAN FILM EPOXY 12MM X 55M RUBAN FILM EPOXY 19MM X 55M RUBAN MAGNET 12 MM X 30 5 M X 0 9 MM RUBAN MAGNET 19 MM X 30 5 M X 0 9 MM RUBAN MAGNET 25 MM X 30 5 M X 0 9 MM RUBAN MAGNET 12 MM X 30 5 M X 1 5 MM RUBAN MAGNET 19 MM X 30 5 M X 1 5 MM RUBAN MAGNET 25 MM X 30 5 M X 1 5 MM RUBAN POLYIMIDE 19MM X 33M RUBAN PTFE 12MM X 33M RUBAN PTFE 25MM X 33M RUBAN ALUMINIUM FOIL 19MM X 16 5M RUBAN FEUILLE DE CUIVRE 25MM X 16 5M RUBAN FEUILLE DE CUIVRE 9MM X 16 5M RUBAN FEUILLE DE CUIVRE 12MM X 33M RUBAN FEUILLE DE CUIVRE 19MM X 16 5M RUBAN FEUILLE DE CUIVRE 25MM X 16 5M RUBAN ANTISTATIC POLYESTER 12MM X 66M RUBAN ANTISTATIC POLYESTER 19MM X 66M RUBAN ANTISTATIC POLYESTER 25MM X 66M RUBAN ANTISTATIC POLYESTER 50MM X 66M RUBAN POLYESTER 19MM X 66M RUBAN POLYESTER 25MM X 66M RUBAN POLYESTER 38MM X 66M RUBAN POLYESTER 9MM X 66M RUBAN POLYESTER 12MM X 66M RESISTOR,THICK FILM,200 OHM,250mW,1% RUBAN POLYESTER 25MM X 66M RUBAN POLYESTER 50MM X 66M RUBAN POLYESTER 25MM X 66M RUBAN POLYESTER 25MM X 66M RUBAN POLYESTER 38MM X 66M RUBAN POLYESTER 50MM X 66M RUBAN POLYESTER 9MM X 33M RUBAN POLYESTER 19MM X 33M RUBAN POLYESTER 25MM X 33M RUBAN TISSU DE VERRE 25MM X 55M RUBAN TISSU DE VERRE 50MM X 55M RUBAN TISSU DE VERRE 15MM X 66M RUBAN TISSU DE VERRE 19MM X 66M RUBAN TISSU DE VERRE 25MM X 66M RUBAN TISSU DE VERRE 30MM X 55M RUBAN TISSU DE VERRE 50MM X 55M HINGED PANEL DOOR,STEEL,RACK CABINET,8.75´´ EQUIPMENT HANDLE OUTLET STRIP,RACK MOUNT,6,15A,125V,15FT RELAY,POWER,DPDT,24VAC,10A,FLANGE RELAY,SPST-NO,24VDC,THROUGH HOLE RELAY,MINIATURE,SPDT,120VAC/28VDC,10A,PCB BUTT SPLICE,22-18AWG,CRIMP CONNECTOR,CIRCULAR,HOUSING,RCPT,19POS,PANEL CONTACT,SOCKET,20AWG,CRIMP KEY,AL35 7MM TRIANGLE INSERT PANEL,5.22 RJ DUST CAP,POLYETHYLENE BOARD-BOARD CONNECTOR RECEPTACLE,44WAY,2ROW CONNECTOR,SMC,PLUG,50 OHM,CABLE 10w,1.27mm Pitch Pin Hdr,DIL,SMT,Vert, HEAT SHRINK TUBING,3MM ID,PO,BLK,100FT,PK25 HEAT SHRINK TUBING,39MM ID,PO,BLK,20FT,PK5 HEAT SHRINK TUBING,18MM ID,PO,BLK,20FT,PK5 HEAT SHRINK TUBING,12MM ID,PO,BLK,20FT,PK5 HEAT SHRINK TUBING,6MM ID,PO,BLK,100FT,PK25 HEAT SHRINK TUBING,24MM ID,PO,BLK,20FT,PK5 HEAT SHRINK TUBING,1.5MM ID,PO,BLK,100FT,PK25 OUTLET STRIP,RACK MOUNT,6,15A,15FT HOUSING,BOTTOM ENTRY,ALUMINIUM FIELD WIREABLE CONNECTOR,MINIFAST CORDSET N CH MOSFET,60V,300mA,SOT-223 POCKET PACK SOLDER,SN60/PB40,0.031´´ DIAMETER 50PCS PER CARTON 10R0281 SWITCH,TOGGLE,SPDT,100mA,20V RESISTOR,200 OHM,2W,0.05,AXIAL TERMINAL,PIGTAIL SPLICE,24-19AWG,CRIMP SSR,PANEL MOUNT,660VAC,32VDC,25A SINGLE IGBT,600V,80A HINGED LOCKING DOOR,STEEL,27.88 THERMOCOUPLE CONNECTOR GASKET KIT,URETHANE,NEMA 4,4X ENCLOSURE CIRCULAR CONN,RCPT,SIZE 14,15POS,BOX CAPACITOR ALUM ELEC 0.1UF,50V,20%,AXIAL CONNECTOR,POWER ENTRY,PLUG,2A,250V HOLE PLUG,STAINLESS STEEL,1.25´´ CONDUIT ADAPTOR PLUG,LINE TRANSFORMER INSULATOR,TEST CLIP,RED TEST CLIP,19MM,CRIMP/SCREW,25A ALLIGATOR CLIP,19MM,75A INSULATOR,TEST CLIP,BLACK ALLIGATOR CLIP,7.87MM,SCREW,10A INSULATOR,ALLIGATOR CLIP,RED CIRCULAR CONN,RCPT,SIZE 16,23POS,BOX RELAY SOCKETS,4,6A RACK CABINET,TABLE TOP,24.5 UPS,120V,1350W D Sub 28R9229 JFET,-25V,20mA,TO-92-3 DIODE,5W,100V,AXIAL LEADED RESISTOR,100 OHM,500mW,0.02,AXIAL RECTIFIER,SINGLE,200V,12A,DO-203AA-2 CAP,MUSHROOM-HEAD,YEL,PUSHBUTTON DIODE,STANDARD,85A,200V,DO-203AB-2 THYRISTOR,SCR,5.1A,400V,TO-220-3 TRANSISTOR,NPN,40V,3A,TO-202 TRANSISTOR,BIPOLAR,NPN,450V,15A,TO-218-3 TRANSISTOR,NPN,800V,3A,TO-220-3 OPTOCOUPLER,PHOTOTRANSISTOR O/P,3.5KV BIPOLAR TRANSISTOR,PNP,-100V,TO-218 DIODE,UNIDIRECTIONAL,28.2V,AXIAL LEADED Diode BRIDGE RECTIFIER,3PH,100A,1.6KV,MODULE-5 SCR THYRISTOR TRANSISTOR,BIPOLAR,NPN,25V,2A,TO-92-3 DIODE,STANDARD,10A,600V RESISTORMETAL FILMAXIAL LEAD562 OHM250mW0.01 RESISTOR,1KOHM,250mW,1%,AXIAL HEAT SHRINK TUBING,3.2MM ID,PO,BLK,48´´ HEAT SHRINK TUBING,12MM ID,PO,BLK,48´´ CAPACITOR CERAMIC,0.01UF,100V,X7R,RADIAL TRANSISTOR,BIPOLAR,PNP,80V,800mA,TO-92-3 CAPACITOR ALUM ELEC,22UF,25V,AXIAL CAPACITOR ALUM ELEC,47UF,50V,AXIAL RESISTOR,120 OHM,250mW,0.02,AXIAL CAPACITOR ALUM ELEC,10UF,50V,RADIAL DIODE,ZENER,500mW,100V,DO-204AH-2 DIODE,ZENER,5W,100V,017AA-2 DIODE,ZENER,500mW,10V,DO-204AH-2 DIODE,ZENER,500mW,11V,DO-204AH-2 DIODE,ZENER,500mW,18V,DO-204AH-2 RESISTOR,WIREWOUND,2.2KOHM,10W,5% TRANSISTOR,BIPOLAR,NPN,80V,50A,TO-3-2 CAPACITOR MLCC,0.022UF,1KV,Z5V,RADIAL CAPACITOR MLCC,0.047UF,1KV,Z5V,RADIAL CAPACITOR MLCC,0.1UF,1KV,Z5V,RADIAL OUTLET STRIP,RACK MOUNT,8,15A,125V,6FT CIRCULAR CONNECTOR PLUG,SIZE 12,8POS,CABLE RONDELLE FIBRE M3 SAC BARRIERE HUMIDITE 254 X 152MM SAC BARRIERE HUMIDITE 508 X 254MM SAC BLINDE 355 X 254 CRIMP OUTIL SNAGLESS UTP ALL IN ONE VISSEUSE SANS FIL PRECISION CISEAUX KEVLAR 6 DENUDEUR CAPACITE FIL 22AWG BRAID DESOLDERING COPPER 1.4MM TRANSDUCER TRAVERSANT 4V 30MA TRANSDUCER TRAVERSANT 1V 10MA TRANSDUCER TRAVERSANT 8V 40MA TRANSDUCER CMS 4.5V 80MA MICROPHONE 4MM 10V MICROPHONE 6MM 10V BUZZER PIEZO 16V 8MA SET BRUCELLES E-Z PIK AVEC POUCH CONTACT SOCKET IDC / IDT ADAPTATEUR RECEPTACLE SUB-D 50VOIES CONNECTEUR SUB-D RECEPTACLE 9VOIES CONNECTEUR SUB-D RECEPTACLE 50VOIES CONNECTEUR SUB-D RECEPTACLE 15VOIES MINI USB 2.0 TYPE A/B RECEPTACLE CONNECTEUR EMBASE 2MM 6VOIES CONNECTEUR RECEPTACLE 2.54MM 6VOIES CONNECTEUR RECEPTACLE 2.54MM 6VOIES CONNECTEUR EMBASE 2.54MM 2VOIES CONNECTEUR EMBASE 2.54MM 6VOIES CONNECTEUR EMBASE 2.54MM 8VOIES FIL-CARTE EMBASE 2MM 10VOIES CONNECTEUR FFC/FPC 40VOIES RF COAXIAL MMCX JACK 50OHM RF/COAXIAL SMA PLUG STR 50OHM THT CAP DSUB STEEL ADAPTATEUR PHONO JACK-BNC PLUG SUB-D CAPOT TAILLE DC NYLON SUB-D CAPOT TAILLE DD THERMOPLASTIC CAPOT SUB-D TAILLE DA ZINC SCREW LOCK 12.9MM M3 MEMORY SOCKET SO-DIMM 200VOIES CARTE MEMOIRE CONNECTEUR 11VOIES CARTE MEMOIRE CONNECTEUR SD 8VOIES MEMORY SOCKET SIM CARD 6VOIES CONNECTOR,HEADER,36POS,2.54MM TRANSFORMER PANEL,6.97 DOLLY LOUVERED DOOR CABINET RACK 55.75IN STEEL SQUARE HOLE RAILS,STEEL,C2,C3 & REFK SERIES HINGED PANEL DOOR,STEEL,RACK CABINET,10.38´´ CONNECTOR,D SUB,RECEPTACLE,15POS HEAT SHRINK TUBING,39MM ID,PO,BLK,48´´ CABLE CLAMP,SIZE 15 TEST CLIP,SOLID COPPER,1.625IN,200A ENCLOSURE,PCB BOX,ALUMINIUM TRANSFORMER,ISOLATION,12V,1.67A,20VA RECTIFIER,SINGLE,400V,10A RESISTOR,THICK FILM,2.2KOHM,100mW,1% RACKING SHELVE,STEEL,RACK AND CABINET RELAY,AUTOMOTIVE,SPST-NO,24VDC,30A SPEED-O-MATIC WIRE STRIPPER,12-20AWG CIRCULAR CONNECTOR PLUG,SIZE 12,8POS,CABLE LED,GREEN,T-1 (3MM),5CD,523NM LED,GREEN,T-1 3/4 (5MM),11CD,523NM LED,BLUE,T-1 3/4 (5MM),3.5CD,465NM DUST CAP PLUG & SOCKET CONN,HEADER,4POS,4.2MM SWITCH,ILLUM ROCKER,DPST,16A,250VAC,RED SWITCHING TRANSISTOR,NPN,40V,600MA,3 RELAY,SPST-NO,24VDC,16A,PCB CONNECTOR,CIRCULAR,PLUG,10POS,CABLE RECTIFIER,SINGLE,200V,AXIAL LEADED FUSE HOLDER N1 ENCLOSURE W/PANEL,16X20X7,STEEL,GRAY SSR,PHOTO MOSFET,400V,140mA OUTLET STRIP,RACK MOUNT,8,16A,230V,8.202FT CONNECTOR,XLR,PLUG,5POS CAPACITOR FILM,2UF,370VAC,CAN CONTACT,PIN,22-18AWG,CRIMP IC,LDO VOLT REG,1.8V,0.4A,5-SOT-23 CONNECTOR,POWER ENTRY,PLUG,2A,250V CABLE,JUMPER,CONDUCTOR,1FT,30V CIRCULAR CONNECTOR PLUG SIZE 14,18POS,CABLE CONNECTOR,POWER ENTRY,PLUG,10A ZENER DIODE,1W,43V,DO-41 CONNECTOR,HEADER,6POS,2ROW,2.54MM CABLE,FLAT,0.5MM,36WAY,30V CONTACT,SOCKET,22AWG,CRIMP CIRCULAR CONNECTOR,PLUG,8POS,CABLE RECTIFIER,SINGLE,1KV,10A CONNECTOR,HEADER,4POS,1ROW,2.54MM CONTACT,SOCKET,22-18AWG,CRIMP CONNECTOR,HEADER,15POS,1ROW,1.5MM CONNECTOR,HEADER,16POS,2ROW,2MM CONNECTOR,HEADER,20POS,2ROW,2MM PLIER,STRESS RELIEF,WIRE TWISTING HINGED PANEL DOOR,STEEL,CABINET RACK,5.25´´ CABLE GROMMET,OPEN,PLASTIC,GREY CIRCULAR CONN,RCPT,SIZE 12,8POS,BOX CIRCULAR CONN,RCPT,SIZE 12,14POS,BOX CIRCULAR CONNECTOR PLUG SIZE 12,14POS,CABLE CIRCULAR CABLE CLAMP,SIZE 18 ZINC ALLOY CONTACT,SOCKET,18-16AWG,CRIMP CONNECTOR,SSMB,PLUG,50 OHM,RG178/196 CABLE TELECOMMANDE ARF18 TX 2SW 433MHZ TELECOMMANDE ARF18 RX RS232 IP65 TELECOMMANDE ARF18 RX USB IP65 TELECOMMANDE ARF18 RX 433MHZ TELECOMMANDE ARF18 BUNDLE 1SW/1CH TELECOMMANDE ARF18 BUNDLE 2SW/2CH TELECOMMANDE ARF18 BUNDLE 4SW/4CH TELECOMMANDE ARF18 TRX 1SW 869MHZ TELECOMMANDE ARF18 TRX 2SW 869MHZ KIT TELECOMMANDE ARF18 433MHZ MODULE BLUETOOTH BTC2 W/O ANT CABLE ANTENNE BTC1 UFL SMA 22CM ANTENNE BLUETOOTH SMA DROITE ANTENNE BLUETOOTH SMA ANGLE DR MOD BLUETOOTH BTC2 W/O ANT T&R MOD SANS FIL W/ MBUS 868MHZ EVAL RAISONANCE OPEN4 W/ADEUNIS S/W CARTE BTC2 BLUETOOTH EXTENSION PACK CARTE BTC1 BLUETOOTH EXTENSION PACK CARTE SANS FIL W/MBUS EXTENSION PACK MEMOIRE FLASH 512MBIT 56TSOP MEMOIRE FLASH 1GBIT 56TSOP MEMOIRE FLASH 128MBIT 56TSOP MEMOIRE FLASH 128MBIT 56TSOP MEMOIRE FLASH 512MBIT 64FBGA MEMOIRE FLASH 512MBIT 64FBGA MEMOIRE FLASH 512MBIT 56TSOP KIT TC65T GSM/GPRS TERMINAL KIT MC52IT GSM/GPRS TERMINAL KIT MC55IT GSM/GPRS TERMINAL SONDE COURANT 30A 50MHZ SONDE DIFFERENTIEL 500MHZ SONDE GRIPPER SET LARGE SONDE GRIPPER SET MEDIUM SONDE DIFFERENTIEL H/VOLT 20MHZ SONDE HAUTE TENSION 600V/1.2KV SONDE HAUTE TENSION 2KV SONDE HAUTE TENSION 5KV SONDE HAUTE TENSION 6KV SONDE PASSIVE 500MHZ SONDE PASSIVE 500MHZ SONDE PASSIVE 500MHZ SONDE PASSIVE 200MHZ SONDE PASSIVE 500MHZ SONDE PASSIVE 300MHZ CRIMP SOCKET KCTP TAILLE 20 CRIMP SOCKET KCTP TAILLE 16 CRIMP BROCHE KCTP TAILLE 16 RELAY SOCKET N CHANNEL MOSFET,60V,11A TO-252AA SSR,PANEL MOUNT,660VAC,32VDC,50A RELAY,POWER,SPST-NO,36VDC,FLANGE CIRCULAR CONNECTOR PLUG SIZE 12,10POS,CABLE SWITCH,ROCKER,SPST,5A,120VAC,BLACK TERMINAL BLOCK,DIN RAIL,2POS,30-12AWG WIRE-BOARD CONNECTOR HEADER 2POS,3.96MM BOARD-BOARD CONN,RECEPTACLE,8WAY,2ROW WIRE-BOARD CONNECTOR RECEPTACLE 10POS,2.54MM SWITCHING TRANSISTOR,NPN,40V,200MA,3-SOT-23 FERRITE BEAD,0.05OHM,1.5A,0603 CIRCULAR CONNECTOR,RECEPTACLE,8POS,CA TERMINAL,FORK,STUD 10,12-10AWG,CRIMP CONVERTISSEUR DC/DC MICRO 1A 1.2V CONVERTISSEUR DC/DC MICRO 1A 1.5V CONVERTISSEUR DC/DC MICRO 1A 1.8V CONVERTISSEUR DC/DC MICRO 1A 2.5V CONVERTISSEUR DC/DC MICRO 1A 3.3V CONVERTISSEUR DC/DC MICRO 1A 1V SHELL METAL MDR 14VOIES BACKSHELL MDR 100VOIES METAL BACKSHELL MDR 20VOIES METAL BACKSHELL MDR 26VOIES METAL BACKSHELL MDR 36VOIES METAL BACKSHELL MDR 50VOIES METAL CARTE CPU CORE ARM LPC3250 CARTE CPU CORE ARM AT91SAM9G45 CARTE CPU CORE ARM AT91SAM9G45 CARTE SBC AT91SAM9G45 4.3IN LCD KIT D´EVAL DM3730 W/O LCD KIT D´EVAL DM3730 W/ 4.3IN LCD CARTE SBC DM3730 W/ 4.3IN LCD CARTE CPU CORE DM3730 CARTE SBC AM1808 W/O LCD CARTE SBC AM1808 W/ 4.3IN LCD KIT D´EVALUATION AM3359 4.3IN LCD CARTE SBC AT91SAM9261S 4.3IN LCD CARTE EVAL SAM9G45 ARM CORE CARTE SAM9G15 ARM CORE CARTE SAM9G25 ARM CORE CARTE SAM9G35 ARM CORE CARTE SAM9X25 ARM CORE CARTE SAM9X35 ARM CORE CARTE SBC ARM SAM9G15 4.3IN LCD CARTE SBC ARM SAM9G25 CARTE SBC ARM SAM9G35 4.3IN LCD CARTE SBC ARM SAM9X25 CARTE SBC ARM SAM9X35 W/ 4.3IN LCD MODULE USB WIFI 802.11B/G MODULE GPRS POUR DEVKIT8000 / 8500D MODULE VGA POUR DEVKIT8000 / 8500D MOD CAM DEVKIT 8500D/SBC8100 PLUS EMU,USB JTAG,DEVKIT8500D/SBC8018 ADAPTATEUR DEBUG SW/JTAG CARTE EVAL LPC1114 W/ COLINKEX CARTE EVAL ARDUINO COMPATIBLE M051 NXP LPC1768 KIT DE DEMARRAGE RESISTANCE 100R 0.01% 1W RESISTANCE 1K 0.01% 1W RESISTANCE 2K 10% 0.75W RESISTANCE 5K 10% 0.75W RESISTANCE 100R 0.01% 1W RESISTANCE 20K 0.01% 1W RESISTANCE 50R 0.01% 1W TERMINAL BLOCK PORCELAIN 20A PQT 5 TERMINAL BLOCK 10A 12 VOIES CRIMP TOOL W.LOCATOR POUR SOLARLOK KIT MOBILE SOLAR CRIMP + STRIP 5PC KIT ELECTRICIANS 1 TOOL 5 DIES KIT END SPLICE 1 TOOL 3 DIES KIT AUTOMOTIVE 1 TOOL 5 DIES KIT INDUSTRIAL 1 TOOL 4 DIES KIT DATA 1 TOOL 5 DIES TOOL CABLE STRIPPING SOLAR 8MM LEN. CASSETTE REPLACEMENT STRIPPING TL CRIMP INSULATED 0.5-6MMSQ CRIMP UNINSULATED 4-10MMSQ CRIMP END SPLICE 4-10MMSQ CRIMP END SPLICE 10-25MMSQ CRIMP,END SLICE,35-50MMSQ CRIMP INSULATED 0.014-1MMSQ CRIMP UNINSULATED 0.3-2.5MMSQ CRIMP UNINSULATED. 0.5-6MMSQ RUBAN SCOTCH FIRE PROOFING 38MM X 6M RUBAN SCOTCH FIRE PROOFING 76MM X 6M RUBAN SCOTCH CAMBRIC 19MM X 20M RUBAN SCOTCH PVC H/DUTY 19MM X 33M RUBAN SCOTCH PVC H/DUTY 25MM X 33M RUBAN SCOTCH PVC H/DUTY 38MM X 33M RUBAN SCOTCH SEMI COND 38MM X 4.5M PEN PRINTER HEAD CLEANING THERMAL PEN INK REMOVER BOTTLE TRIGGER SPRAY NETTOYANT ETIQUETTE 200ML COATING CONFORMAL WATER BASED 5L COMPOSE SILICONE 250G SILICONE THERM CONDUCT RESIN TERMINAL BLOCK,BARRIER,26POS,22-12AWG CIRCUIT BREAKER,HYDROMAGNETIC,100A ETHERNET SWITCH USB MODULE TERMINAL,FERRULE,CRIMP,TURQUOISE TERMINAL,FERRULE,CRIMP,TURQUOISE TERMINAL,FERRULE,CRIMP,ORANGE TERMINAL,FERRULE,CRIMP,WHITE TERMINAL,FERRULE,CRIMP,ORANGE TERMINAL,FERRULE,CRIMP,WHITE TERMINAL,FERRULE,CRIMP,ORANGE TERMINAL,FERRULE,CRIMP,WHITE TERMINAL,FERRULE,CRIMP,BLUE TERMINAL,FERRULE,CRIMP,GREY TERMINAL,FERRULE,CRIMP,BLUE TERMINAL,FERRULE,CRIMP,GREY TERMINAL,FERRULE,CRIMP,BLUE TERMINAL,FERRULE,CRIMP,GREY TERMINAL,FERRULE,CRIMP,BLUE TERMINAL,FERRULE,CRIMP,GREY LED DOWNLIGHT,28V,27W,COOL WHITE LED DOWNLIGHT,28V,27W,COOL WHITE LED DOWNLIGHT,28V,27W,COOL WHITE DRILL/DRIVER,CORDLESS,18V,0.5 HAMMER DRILL/DRIVER KIT,1/2´´ CORDLESS,18V,31450BPM BAND SAW BLADES,27 WIREWAY,STRAIGHT SECTION,NEMA TYPE 12 CODING KEY,7.5MM,GREY PLC MODULE,CPU,14CH,12VDC,SERIAL ZENER DIODE,200mW,3.3V,SOD-323 SWITCH,TOGGLE,DPST,15A,250V D SUB BAKSHELL,25WAY,STEEL FEMALE SCREWLOCK,4-40,15.88MM HEAT SHRINK END CAP,10MM ID,PO,BLK,1.5´´ KEYBOARD TRAY,3.2LB,KEYBOARD AND MOUSE D SUB COAXIAL CONTACT,PLUG,CRIMP,RG-179/U TERMINAL BLOCK,PANEL,9.5MM,6POS,16AWG DRILL/DRIVE BIT SET,SHOCKWAVE,35 PC CAPACITOR TANT,10UF,35V,2OHM,± 10%, CONNECTOR,HEADER,7.62MM,10POS DEEP STRAIGHT CABLE CLAMP,D SUB,DE,STEEL BACK SHELL,CLAMP,D SUB,DB,BRASS/STEEL BACK SHELL,CLAMP,D SUB,DC,BRASS/STEEL CIRCUIT BREAKER 29C2972 BACK SHELL,CLAMP,D SUB,DC,BRASS/STEEL DUST CAP,DE,D SUB CONNECTOR FICHE STRIP R/A 2 VOIES FICHE STRIP R/A 3 VOIES SOCKET STRIP VERTICAL 3 VOIES BLOCK TOOL PLASTIC POUR 9159 SERIES FICHE STRIP VERTICAL 2 VOIES FICHE STRIP VERTICAL 3 VOIES CONNECTEUR FIL TO FIL 3 VOIES CONNECTEUR FIL TO FIL 4 VOIES TOOL PLASTIC POUR 9286 SERIES CONTACT FIL TO CARTE 1VOIES CONTACT,PLUG,20-18AWG,CRIMP CONNECTOR,HEADER,7.62MM,10POS CAPACITOR ALUM ELEC 100UF,25V,20%,RADIAL IC,MOSFET DRIVER,HALF BRIDGE,SOIC-28 IC,ANALOG SWITCH,QUAD,SPST,DIP-14 PIN TIP JACK,1500V,5A,WHITE Male Screw Lock CAPACITOR TANT,100UF 10V 0.6OHM ± 10%, CAPACITOR ALUM ELEC,3.3UF,100V,20%,RADIAL RELAY SOCKET CIRCUIT BREAKER,HYDROMAGNETIC,15A HEAT SHRINK TUBING,9.5MM ID,PO,TRANS,4FT FEMALE SCREWLOCK,4-40,7.92MM IC,DIFFERENTIAL COMP,QUAD 1.3µS SOIC14 SWITCH 80P3164 CONNECTOR,D SUB,RECEPTACLE,9POS CONNECTOR,D SUB,PLUG,9POS CONNECTOR,ELECTRICAL,RCPT,13A,GREY BANANA PLUG,15A,SCREW,RED CIRCUIT BREAKER,MAGNETIC HYDRAULIC,2P,277V,10A PLIER,LONG NOSE,6 IN 1 COMBINATION PLIER,6 IN 1 COMBINATION PLIER,LINESMANS SNIPS,STRAIGHT,CHROME ALLOY STEEL,0.05´´ SNIPS,RIGHT ANGLE,CHROME ALLOY STEEL,0.156´´ SNIPS,RIGHT ANGLE,CHROME ALLOY STEEL,0.156´´ PLIER,6 IN 1 DIAGONAL CUTTER,6´´ PLIER,6 IN 1 DIAGONAL CUTTER,7´´ PLIER,6 IN 1 DIAGONAL CUTTER,8´´ BINDING POST,15A,TURRET,GREEN LATCH,STAINLESS STEEL,ALL POLYPRO MODEL TEST LEAD,BANANA,BLUE,12IN,5000VDC ALIM ENERGY HARVESTING PIEZO 10DFN RECIP SAW,CORDLESS LITHIUM ION,12V,11 RECIP SAW,CORDLESS LITHIUM ION,18V,17.75 COMPACT HACK SAW,10´´ DRYWALL/PLASTER JAB SAW,6´´ FOLDING JAB SAW,6´´ FLIP OPEN UTILITY KNIFE SIDE OPEN UTILITY KNIFE BAND SAW BLADES,35.375 DRILL BIT SET,THUNDERBOLT,BLACK OXIDE,21PC CAPACITOR ALUM ELEC,0.12F,50V,+75,-10%,SCREW RESISTOR NETWORK,THIN FILM,3,1KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,3,10KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,4,1KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,4,10KOHM,0.1%,SIP RESISTOR NETWORK,THIN FILM,4,10KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,4,100KOHM,0.1%,SIP RESISTOR NETWORK,THIN FILM,4,100KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,4,11KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,4,2KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,5,1KOHM,2%,SIP RESISTOR NETWORK,THIN FILM,5,10KOHM,1%,SIP RESISTOR NETWORK,THIN FILM,9,10KOHM,2%,SIP RESISTOR NETWORK,THIN FILM,9,2KOHM,1%,SIP BANANA PLUG,15A,SCREW,BROWN BAND SAW KIT,SUB-COMPACT CORDLESS,27 IC,RS-232 TRANSCEIVER,5.5V,TSSOP-20 LED BULB,G13,COOL WHITE,20W,T-8 LED BULB,G13,COOL WHITE,20W,T-8 PIN TIP JACK,1500V,5A,ORANGE LED BULB,G13,WARM WHITE,20W,T-8 LED BULB,G13,WARM WHITE,20W,T-8 LED BULB,G13,COOL WHITE,24W,T-8 LED BULB,G13,COOL WHITE,24W,T-8 LED BULB,G13,WARM WHITE,24W,T-8 LED BULB,G13,WARM WHITE,24W,T-8 LED BULB,G13,COOL WHITE,11W,T-8 LED BULB,G13,COOL WHITE,11W,T-8 LED BULB,G13,WARM WHITE,11W,T-8 LED BULB,G13,WARM WHITE,11W,T-8 LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL LIGHT PIPE,SINGLE,CIRCULAR,PANEL CONNECTOR,POWER ENTRY,RECEPTACLE,10A,250V FUSIBLE LAME ATOF 1A FUSIBLE LAME ATOF 2A FUSIBLE LAME ATOF 5A FUSIBLE LAME ATOF 40A CARTE D´EVAL AUDIO BOOSTER PACK C5000 KIT DE DEVELOPPEMENT PIC18F87J72 1PH AC-DC CONV,ENCLOSED,1 O/P,150W,30A, AC-DC CONV,ENCLOSED,1 O/P,1.5KW,125A,12V AC-DC CONV,ENCLOSED,1 O/P,1.5KW,100A,15V SMPS,52.8W,24V AC-DC CONV,OPEN FRAME,1 O/P,636W,53A,12V POWER SUPPLY,EXT,PLUG-IN,5V,45W SWITCH,REED,SPST-NO,500mA,200VDC AC-DC CONV,OPEN FRAME,4 O/P,80W AC-DC CONV,EXTERNAL PLUG IN,1 O/P,45W AC-DC CONV,OPEN FRAME,1 O/P,60W,2.5A,24V AC-DC CONV,ENCLOSED,1 O/P,504W,18A,24V AC-DC CONV,ENCLOSED,1 O/P,504W,10.5A SPRING-LOADED,90DEG POINT,5A,33.27MM CAT5 RJ45 MODULAR JACK,8POS,1 PORT AC-DC CONV,PCB MOUNT,1 O/P,5W,420mA, AC-DC CONV,OPEN FRAME,1 O/P,500W,41.67A,12V AC-DC CONV,OPEN FRAME,1 O/P,500W,41.67A,12V AC-DC CONV,OPEN FRAME,1 O/P,500W,20.84A,24V AC-DC CONV,OPEN FRAME,1 O/P,500W,20.84A,24V AC-DC CONV,OPEN FRAME,1 O/P,500W,16.67A,30V AC-DC CONV,OPEN FRAME,1 O/P,500W,13.89A,36V CONTACT,SOCKET,18-14AWG,CRIMP AC-DC CONV,OPEN FRAME,1 O/P,500W,13.89A,36V AC-DC CONV,OPEN FRAME,1 O/P,500W,10.42A,48V AC-DC CONV,OPEN FRAME,1 O/P,500W,10.42A,48V AC-DC CONV,RACK MOUNT,1 O/P,1.596KW, AC-DC CONV,RACK MOUNT,1 O/P,1.608KW, AC-DC CONV,RACK MOUNT,1 O/P,1.608KW,67A,24V AC-DC CONV,RACK MOUNT,1 O/P,1.584KW, AC-DC CONV,RACK MOUNT,1 O/P,1.584KW,33A,48V AC-DC CONV,ENCLOSED,1 O/P,300W,6.7A,48V AC-DC CONV,ENCLOSED,1 O/P,300W,40A,7.5V AC-DC CONV,OPEN FRAME,1 O/P,400W,33. AC-DC CONV,OPEN FRAME,1 O/P,400W,16. AC-DC CONV,OPEN FRAME,1 O/P,400W,8.3 CONTACT,SOCKET,18-14AWG,CRIMP PSU,EXT,PLUG-IN,36V,100W CONTACT,SOCKET,24-20AWG,CRIMP CONTACT,PIN,18-14AWG,CRIMP AC PLUG-IN ADAPTER POWER SUPPLY,SWITCH MODE,15V AC-DC CONV,PCB MOUNT,1 O/P,720W,60A, AC-DC CONV,DIN RAIL,1 O/P,12W,500mA,24V AC-DC CONV,EXTERNAL PLUG IN,1 O/P,12W TERMINAL FEMALE DISCONNECT 6.35MM YELLOW AC-DC CONV,OPEN FRAME,1 O/P,1.056KW,22A,48V TERMINAL,CLOSED END SPLICE 6.35MM CLEAR AC/DC Medical Power Supply AC-DC CONV,OPEN FRAME,1 O/P,52.5W,3.5A,15V AC-DC CONV,OPEN FRAME,1 O/P,75W,5A,15V AC-DC CONV,OPEN FRAME,1 O/P,75W,15A,5V TERMINAL,SPADE/FORK,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,1/4IN,CRIMP,RED POTENTIOMETER W/SWITCH,LINEAR,10KOHM,20%,1W TERMINAL,SPADE/FORK,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,#10,CRIMP,BLUE AC-DC CONV,ENCLOSED,1 O/P,50W,10A,5 TERMINAL,RING TONGUE,#8,CRIMP,BLUE AC-DC CONV,OPEN FRAME,1 O/P,50.4W,1. AC-DC CONV,ENCLOSED,1 O/P,100.8W,3.6A,28V AC-DC CONV,ENCLOSED,1 O/P,151.2W,5.4A,28V Zena Wireless Adapter - 2.4 GHz MRF24J40 TERMINAL,RING TONGUE,#10,CRIMP YELLOW AC-DC CONV,PCB MOUNT,1 O/P,4.6W,1.4A AC-DC CONV,OPEN FRAME,1 O/P,40W,4.45A,9V AC-DC CONV,OPEN FRAME,1 O/P,60W,5A,12V TERMINAL,RING TONGUE,#4,CRIMP,YELLOW POWER SUPPLY,SWITCH MODE,24V TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,BUTT SPLICE AC-DC CONV,ENCLOSED,4 O/P,145W N CH MOSFET,150V,41A,TO-220FP AC-DC CONV,DIN RAIL,1 O/P,240W,10A,24V AC-DC CONV,OPEN FRAME,1 O/P,15W,600mA,24V TERMINAL,RING TONGUE,#8,CRIMP,YELLOW TERMINAL,RING TONGUE 5/16IN,CRIMP BLUE AC-DC CONV,PCB MOUNT,2 O/P,40W,15V,-15V RESISTOR,THICK FILM,22 OHM,100mW,1% AC-DC CONV,OPEN FRAME,4 O/P,160W AC-DC CONV,OPEN FRAME,4 O/P,160W AC-DC CONV,OPEN FRAME,1 O/P,160W,7A,12V AC-DC CONV,OPEN FRAME,1 O/P,160W,3.5A,24V AC-DC CONV,OPEN FRAME,1 O/P,40W,6A,5.1V TERMINAL,RING TONGUE,3/8IN,CRIMP AC-DC CONV,OPEN FRAME,1 O/P,40W,3.3A,12V AC-DC CONV,OPEN FRAME,1 O/P,40W,2.6A,15V AC-DC CONV,OPEN FRAME,3 O/P,40W AC-DC CONV,OPEN FRAME,3 O/P,40W AC-DC CONV,OPEN FRAME,3 O/P,20.8W TERMINAL,RING TONGUE,#8,CRIMP AC-DC CONV,OPEN FRAME,3 O/P,40W,5V,12V,-12V AC-DC CONV,OPEN FRAME,3 O/P,40W,5V,15V,-15V AC-DC CONV,OPEN FRAME,2 O/P,40W,12V,-12V TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW AC-DC CONV,OPEN FRAME,3 O/P,65W,5V,12V,-12V AC-DC CONV,RACK MOUNT,1 O/P,2.4KW,200A,12V AC-DC CONV,RACK MOUNT,1 O/P,2.496KW,104A,24V AC-DC CONV,RACK MOUNT,1 O/P,2.496KW,52A,48V AC-DC CONV,DIN RAIL,1 O/P,120W,5A,24V AC-DC CONV,DIN RAIL,1 O/P,240W,10A,24V AC-DC CONV,ENCLOSED,1 O/P,200W,26.7A,7.5V AC-DC CONV,OPEN FRAME,3 O/P,40.5W,5V,12V,-5V AC-DC CONV,ENCLOSED,1 O/P,1.51KW,63A,24V IC,OP-AMP,1MHZ,0.4V/µs,DIP-8 AC-DC CONV,OPEN FRAME,1 O/P,300W,25A,12V AC-DC CONV,OPEN FRAME,1 O/P,400W,33.3A,12V AC-DC CONV,OPEN FRAME,1 O/P,300W,12.5A,24V AC-DC CONV,OPEN FRAME,1 O/P,300W,6.25A,48V AC-DC CONV,OPEN FRAME,1 O/P,400W,16. AC-DC CONV,OPEN FRAME,1 O/P,400W,8.33A,48V FUSE,BLADE,4A,32V TERMINAL,BUTT SPLICE,YELLOW AC-DC CONV,OPEN FRAME,1 O/P,50W,4.2A,12V AC-DC CONV,OPEN FRAME,1 O/P,50W,9.1A,3.3V AC-DC CONV,OPEN FRAME,1 O/P,75W,12A,3.3V AC-DC CONV,ENCLOSED,1 O/P,100W,8.4A,12V AC-DC CONV,ENCLOSED,1 O/P,150W,1.25A,12V AC-DC CONV,ENCLOSED,1 O/P,150W,6.3A,24V TERMINAL,RING TONGUE,#4,CRIMP,RED AC-DC CONV,ENCLOSED,1 O/P,100W,8.5A,12V TERMINAL,RING TONGUE,5/16IN,CRIMP RED TERMINAL,RING TONGUE,3/8IN,CRIMP,RED AC-DC CONV,ENCLOSED,1 O/P,1.536KW,32A,48V AC-DC CONV,OPEN FRAME,1 O/P,644W,23A AC-DC CONV,OPEN FRAME,1 O/P,60W,2.5A,24V AC-DC CONV,PCB MOUNT,1 O/P,5.5W,230mA,24V TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP,RED AC-DC CONV,EXTERNAL PLUG IN,1 O/P,11.88W,13.5V AC-DC CONV,EXTERNAL PLUG IN,1 O/P,11.88W,13.5V AC-DC CONV,EXTERNAL PLUG IN,1 O/P,35.91W,13.5V AC-DC CONV,EXTERNAL PLUG IN,1 O/P,35.91W,13.5V POWER ENTRY MODULE,PLUG,6A AC-DC CONV,OPEN FRAME,1 O/P,100W,20A AC-DC CONV,OPEN FRAME,1 O/P,150W,10A,15V AC-DC CONV,OPEN FRAME,1 O/P,150W,30A TERMINAL,SPADE/FORK,#6,CRIMP AC-DC CONV,OPEN FRAME,5 O/P,250W AC-DC CONV,OPEN FRAME,5 O/P,250W TERMINAL,BUTT SPLICE AC-DC CONV,OPEN FRAME,1 O/P,250W,10.4A,24V TERMINAL,SPADE/FORK,#10,CRIMP,YELLOW AC-DC CONV,OPEN FRAME,1 O/P,60W,2.5A AC-DC CONV,OPEN FRAME,3 O/P,25W,5V,12V,-12V AC-DC CONV,OPEN FRAME,3 O/P,40W,5V,15V,-15V AC-DC CONV,OPEN FRAME,3 O/P,60W,5V,12V,-12V TERMINAL,RING TONGUE,3/8IN,CRIMP AC-DC CONV,ENCLOSED,1 O/P,1.8KW,84A,12V PRE-DRIVER MOTEUR 16VIN 0.02A 16SSOP DRIVER MOTEUR 2CH FWD/RVRS MFP10SK DRIVER MOTEUR 2CH H-BRIDGE 16SSOP DRIVER MOTEUR H-BRIDGE 10.5V 9WLP DRIVER LED 12V 0.8A CRM SMPS 8SOIC CTLR PFC/H-BRIDGE RES 600V 16SOIC PWM CNTRL CCM LED 500KHZ 0.5A 8SOIC PFC DCM/CCM 20VCC 250KHZ 16SOIC LDO 13.5VIN 0.3VDO 1.5A AJUSTABLE 5D2PAK TERMINAL,RING TONGUE,5/16IN,YELLOW LDO 5.5VIN 0.14VDO 0.2A 3.3V 5TSOP AMPLI OP RRO 16VCC 3.5MHZ 5SC70 LDO 13.5VIN 0.3VDO 1.5A AJUSTABLE 5D2PAK LDO 13.5VIN 0.3VDO 1.5A AJUSTABLE 8DFN PWM BOOST 40VIN 1MHZ AJUSTABLE 8SOIC BUCK 36VIN 2MHZ 1.2A AJUSTABLE 8DFN BUCK 36VIN 2MHZ 1.2A AJUSTABLE 10DFN TERMINAL,SPADE/FORK,#8,CRIMP,RED DRIVER MOTEUR STEPPER 45VIN 1.5A DRIVER MOTEUR STEPPER 45VIN 1.2A AC-DC CONV,OPEN FRAME,1 O/P,336W,12A,28V AC-DC CONV,OPEN FRAME,1 O/P,60W,1.25 TERMINAL,FEMALE DISCONNECT,4.75MM,RED POWER SUPPLY,SWITCH MODE,5V IC,RS-232 TRANSCEIVER,5.5V,SSOP-20 POTENTIOMETER W/SWITCH,LINEAR,100 OHM,0.2,1W POTENTIOMETER W/SWITCH,LINEAR,1KOHM,20%,1W POTENTIOMETER W/SWITCH,LINEAR,100KOHM,20%,1W POTENTIOMETER W/SWITCH,LINEAR,22KOHM,20%,1W POTENTIOMETER W/SWITCH,LINEAR,470 OHM,0.2,1W POTENTIOMETER W/SWITCH,LINEAR,4.7KOHM,20%,1W POTENTIOMETER W/SWITCH,LINEAR,47KOHM,20%,1W TERMINAL,RING TONGUE,1/2IN,CRIMP ADAPTOR,AC - AC,120V,12V,1A ADAPTOR,AC - AC,120V,12V,1.5A ADAPTOR,AC - AC,120V,12V,200MA ADAPTOR,AC - AC,120V,12V,500MA ADAPTOR,AC - AC,120V,16V,2.4A ADAPTOR,AC - AC,120V,16V,400MA ADAPTOR,AC - AC,120V,16V,500MA ADAPTOR,AC - AC,120V,24V,1A ADAPTOR,AC - AC,120V,24V,1.8A ADAPTOR,AC - AC,120V,24V,200MA ADAPTOR,AC - AC,120V,24V,750MA CARTE D´EVAL EN5311QI-E BUCK CONVTR CARTE D´EVAL EN5322QI-E BUCK CONVTR CARTE D´EVAL EN5337QI-E BUCK CONVTR CARTE D´EVAL EN5364QI-E BUCK CONVTR CARTE D´EVAL EN5394QI-E BUCK CONVTR CARTE D´EVAL EN6337QI-E BUCK CONVTR CARTE D´EVAL EN6347QI-E BUCK CONVTR CARTE D´EVAL EN6360QI-E BUCK CONVTR CARTE D´EVAL EP5348UI-E BUCK CONVTR CARTE D´EVAL EP5358HUI-E BUCK CONVTR CARTE D´EVAL EP5358LUI-E BUCK CONVTR CARTE D´EVAL EP5368QI-E BUCK CONVTR CARTE D´EVAL EP53A8HQI-E BUCK CONVTR CARTE D´EVAL EP53A8LQI-E BUCK CONVTR CARTE D´EVAL EP53F8QI-E BUCK CONVTR CARTE D´EVAL EN2340QI-E BUCK CONVTR ZENER DIODE,200mW,12V,SOD-523 AC-DC CONV,OPEN FRAME,1 O/P,151.2W,6.3A,24V ZENER DIODE,1W,15V,DO-41 AC-DC CONV,DIN RAIL,1 O/P,120W,10A,12V INDUCTOR,47MH,340MA,±10%,8.5MHz AC-DC CONV,DIN RAIL,1 O/P,48W,2A,24V AC-DC CONV,DIN RAIL,1 O/P,48W,4A,12V WIRE-BOARD CONNECTOR RECEPTACLE 10POS,2.54MM AC-DC CONV,OPEN FRAME,1 O/P,60W,2.5A,24V IC,RS-232 TRANSCEIVER,250kbps,5.5V,SOIC-16 IC,RS-232 TRANSCEIVER,5.5V,TSSOP-28 COFFRET PCB DT NO VENT HOLE EMBASE R/A POUR DT ENCLOSURE 48VOIES COFFRET PCB DTM CLAIR RECEPTACLE DTM HI TEMP B KEY 3VOIES RECEPTACLE DTM HI TEMP C KEY 3VOIES RECEPTACLE DTM HI TEMP D KEY 3VOIES FICHE DTM HAUTE TEMP B KEY 3VOIES FICHE DTM HAUTE TEMP C KEY 3VOIES FICHE DTM HAUTE TEMP D KEY 3VOIES RECEPTACLE DTM HI TEMP B KEY 4VOIES RECEPTACLE DTM HI TEMP C KEY 4VOIES RECEPTACLE DTM HI TEMP D KEY 4VOIES FICHE DTM HAUTE TEMP B KEY 4VOIES FICHE DTM HAUTE TEMP C KEY 4VOIES FICHE DTM HAUTE TEMP D KEY 4VOIES FICHE DTM HAUTE TEMP 8VOIES CAPOT HDP20 POUR HDP26-24 PLUG LED PAR38 800LM 2700K 25° E27 PISTOLET À AIR CHAUD 2000W PRISE UK PISTOLET À AIR CHAUD 350W PRISE UK TACKER CABLE 9-11MM STAPLES TACKER CABLE 9-14MM STAPLES LDO,REG,DUAL,6VIN,1.2V/1.8V,6DFN REGULATEUR LDO 6VIN 1.2V/1.8V 6SOT26 LDO,REG,DUAL,6VIN,1.2V/3.3V,6DFN REGULATEUR LDO 6VIN 1.2V/3.3V 6SOT26 LDO,REG,DUAL,6VIN,1.5V/2.5V,6DFN REGULATEUR LDO 6VIN 1.5V/2.5V 6SOT26 LDO,REG,DUAL,6VIN,1.5V/3.3V,6DFN REGULATEUR LDO 6VIN 1.5V/3.3V 6SOT26 LDO,REG,DUAL,6VIN,1.8V/2.8V,6DFN REGULATEUR LDO 6VIN 1.8V/2.8V 6SOT26 LDO,REG,DUAL,6VIN,1.8V/3.0V,6DFN REGULATEUR LDO 6VIN 1.8V/3.0V 6SOT26 LDO,REG,DUAL,6VIN,1.8V/3.3V,6DFN LDO,REG,DUAL,6VIN,3.3V/3.3V,6DFN REGULATEUR LDO 6VIN 3.3V/3.3V 6SOT26 REGULATEUR LDO 0.19VDO 5.5VIN 1.5A 8DFN DRIVER LED 60V 1KHZ 16TSSOP DRIVER LED 60V 1KHZ 16TSSOP AMBERKLENE FE10 1L WIPES ENGINEERS DRY PQT 50 TERMINAL,RING TONGUE,1/4IN,CRIMP,RED TERMINAL,SPADE/FORK,#10,CRIMP,RED TERMINAL,SPADE/FORK,#6,CRIMP,RED TERMINAL,BUTT SPLICE,CRIMP,RED TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE TERMINAL,SPADE/FORK,#6,CRIMP,BLUE TERMINAL,SPADE/FORK,#8,CRIMP,BLUE TERMINAL,SPADE/FORK,#6,CRIMP,BLUE TERMINAL,BUTT SPLICE,BLUE TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,SPADE/FORK,#6,CRIMP,RED TERMINAL,SPADE/FORK,#6,CRIMP,RED TERMINAL,SPADE/FORK,#8,CRIMP,RED TERMINAL,SPADE/FORK,#10,CRIMP,RED TERMINAL,BUTT SPLICE,RED TERMINAL,KNIFE DISCONNECT SPLICE,RED TERMINAL,SPADE/FORK,#6,CRIMP,BLUE TERMINAL,SPADE/FORK,#6,CRIMP,BLUE TERMINAL,SPADE/FORK,#8,CRIMP,BLUE TERMINAL,SPADE/FORK,#10,CRIMP,BLUE TERMINAL,SPADE/FORK,#10,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP,BLUE TERMINAL,KNIFE DISCONNECT SPLICE,BLUE TERMINAL,RING TONGUE,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,#8,CRIMP,YELLOW TERMINAL,RING TONGUE 3/8IN CRIMP YELLOW TERMINAL,RING TONGUE 1/2IN CRIMP YELLOW TERMINAL,SPADE/FORK,#6,CRIMP,RED TERMINAL,RING TONGUE,3/8IN,CRIMP BLUE TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,RING TONGUE,#10,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP TERMINAL,FEMALE DISCONNECT 2.79MM CLEAR TERMINAL,FEMALE DISCONNECT,2.79MM,RED TERMINAL,FEMALE DISCONNECT,2.79MM,RED TERMINAL,FEMALE DISCONNECT,2.79MM BLUE TERMINAL,BUTT SPLICE,YELLOW TERMINAL,RING TONGUE,#6,CRIMP,BLUE WIRING ACCESSORIES TERMINAL,RING TONGUE,#2,CRIMP,RED TERMINAL,RING TONGUE,#4,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP TERMINAL,FEMALE DISCONNECT,5.21MM,RED TERMINAL,FEMALE DISCONNECT,5.21MM,RED TERMINAL,FEMALE DISCONNECT,5.21MM BLUE TERMINAL,FEMALE DISCONNECT 2.79MM CLEAR TERMINAL,FEMALE DISCONNECT 2.79MM CLEAR TERMINAL,SPADE/FORK,#2,CRIMP,RED TERMINAL CLOSED END SPLICE 4.75MM PURPLE TERMINAL,PARALLEL SPLICE,CRIMP TERMINAL,RING TONGUE,#6,CRIMP,YELLOW TERMINAL,SPADE/FORK,#6,CRIMP,RED TERMINAL,SPADE/FORK,#8,CRIMP,BLUE TERMINAL,BUTT SPLICE,YELLOW TERMINAL,SPADE/FORK,#6,CRIMP,RED TERMINAL,RING TONGUE,#4,CRIMP,BLUE TERMINAL,RING TONGUE,#6,CRIMP,BLUE TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE TERMINAL,SPADE/FORK,#10,CRIMP,BLUE TERMINAL,SPADE/FORK,#4,CRIMP,RED TERMINAL,SPADE/FORK,#10,CRIMP,RED TERMINAL,SPADE/FORK,#6,CRIMP,BLUE RF/COAXIAL,SMB PLUG,STR,75 OHM,CRIMP RF/COAXIAL,SMB PLUG,STR,50 OHM,CRIMP CONTROLEUR H-WARE WATCHDOG I2C 24TSSOP REGULATEUR LDO 0.2VDO 0.15A 5V 5SOT23 REGULATEUR LDO 1.5VDO 1.5A 1.2V 3TO220 RF/COAXIAL,SMB PLUG,R/A,75 OHM,CRIMP TERMINAL,RING TONGUE 5/16IN,CRIMP BLUE TERMINAL,RING,#6 STUD,CRIMP,RED,22-16AWG TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,FEMALE DISCONNECT,6.35MM BLUE TERMINAL,FEMALE DISCONNECT,4.75MM BLUE CONTACT,PIN,24-20AWG,CRIMP TERMINAL,SPADE/FORK,#10,CRIMP,BLUE TERMINAL,BUTT SPLICE,YELLOW OUTIL A SERTIR TAILLE 20 IMC/QC CONTACTS OUTIL A SERTIR TAILLE 22 IMC/QC CONTACTS LABEL OFF 50 200ML LUBRICANT KONTAFLON 85 200ML TERMINAL,BUTT SPLICE TERMINAL BLOCK,12POS,22-12AWG,11.1MM WIRING DUCT,WIDE SLOT,PVC,BLK,50MM PLUG CORD,1M HEAT-SHRINK WIRE MARKER SLEEVE,50.8MM W,2500/BOX TERMINAL,RING TONGUE,#10,CRIMP,RED HEAT-SHRINK WIRE MARKER,50.8MM W,250/ROLL AC-DC CONV,OPEN FRAME,1 O/P,150W,2.8 CRYSTAL,10MHZ,5MMX3.2MM,SMD CRYSTAL,12MHZ,5MMX3.2MM,SMD CRYSTAL,12.288MHZ,5MMX3.2MM,SMD CRYSTAL,13.56MHZ,5MMX3.2MM,SMD CRYSTAL,14.31818MHZ,5MMX3.2MM,SMD TERMINAL,RING TONGUE,3/8IN,CRIMP,RED TERMINAL,RING TONGUE,#4,CRIMP,BLUE CRYSTAL,16MHZ,5MMX3.2MM,SMD CRYSTAL,20MHZ,5MMX3.2MM,SMD CRYSTAL,25MHZ,5MMX3.2MM,SMD CRYSTAL,27MHZ,5MMX3.2MM,SMD CRYSTAL,28.63636MHZ,5MMX3.2MM,SMD CRYSTAL,37.05MHZ,5MMX3.2MM,SMD CRYSTAL,48MHZ,5MMX3.2MM,SMD CRYSTAL,8MHZ,5MMX3.2MM,SMD CRYSTAL,9.84375MHZ,5MMX3.2MM,SMD CRYSTAL,10MHZ,5MMX3.2MM,SMD TERMINAL,RING TONGUE,#6,CRIMP,BLUE CRYSTAL,11.0592MHZ,5MMX3.2MM,SMD CRYSTAL,12MHZ,5MMX3.2MM,SMD CRYSTAL,13.225625MHZ,5MMX3.2MM,SMD CRYSTAL,13.56MHZ,5MMX3.2MM,SMD CRYSTAL,13.56MHZ,5MMX3.2MM,SMD CRYSTAL,14.31818MHZ,5MMX3.2MM,SMD CRYSTAL,15.36MHZ,5MMX3.2MM,SMD CRYSTAL,16MHZ,5MMX3.2MM,SMD CRYSTAL,16MHZ,5MMX3.2MM,SMD CRYSTAL,18MHZ,5MMX3.2MM,SMD CRYSTAL,18.432MHZ,5MMX3.2MM,SMD CRYSTAL,19.68MHZ,5MMX3.2MM,SMD CRYSTAL,20MHZ,5MMX3.2MM,SMD CRYSTAL,24MHZ,5MMX3.2MM,SMD CRYSTAL,24.576MHZ,5MMX3.2MM,SMD CRYSTAL,25MHZ,5MMX3.2MM,SMD CRYSTAL,26MHZ,5MMX3.2MM,SMD CRYSTAL,27MHZ,5MMX3.2MM,SMD CRYSTAL,37.5MHZ,5MMX3.2MM,SMD CRYSTAL OSCILLATOR,CMOS,13.5MHZ,SMD CRYSTAL OSCILLATOR,CMOS,27MHZ,SMD CRYSTAL OSCILLATOR,CMOS,3.6864MHZ,SMD TERMINAL,RING TONGUE,#6,CRIMP,RED CRYSTAL OSCILLATOR,CMOS,33.333MHZ,SMD CRYSTAL OSCILLATOR,CMOS,4MHZ,SMD CRYSTAL OSCILLATOR,CMOS,40MHZ,SMD CRYSTAL OSCILLATOR,CMOS,48MHZ,SMD CRYSTAL OSCILLATOR,CMOS,50MHZ,SMD CRYSTAL OSCILLATOR,CMOS,54MHZ,SMD CRYSTAL OSCILLATOR,CMOS,32.768KHZ,SMD CRYSTAL,11.2896MHZ,3.2MMX2.5MM,SMD CRYSTAL,12MHZ,3.2MMX2.5MM,SMD CRYSTAL,13.56MHZ,3.2MMX2.5MM,SMD CRYSTAL,14.31818MHZ,3.2MMX2.5MM,SMD CRYSTAL,16MHZ,3.2MMX2.5MM,SMD TERMINAL,RING TONGUE,#6,CRIMP,RED CRYSTAL,16MHZ,3.2MMX2.5MM,SMD CRYSTAL,16.9344MHZ,3.2MMX2.5MM,SMD CRYSTAL,18.08MHZ,3.2MMX2.5MM,SMD CRYSTAL,18.432MHZ,3.2MMX2.5MM,SMD CRYSTAL,20MHZ,3.2MMX2.5MM,SMD CRYSTAL,24MHZ,3.2MMX2.5MM,SMD CRYSTAL,24.576MHZ,3.2MMX2.5MM,SMD CRYSTAL,26MHZ,3.2MMX2.5MM,SMD CRYSTAL,27MHZ,3.2MMX2.5MM,SMD CRYSTAL,28.224MHZ,3.2MMX2.5MM,SMD CRYSTAL,28.63636MHZ,3.2MMX2.5MM,SMD CRYSTAL,30MHZ,3.2MMX2.5MM,SMD CRYSTAL,33.333MHZ,3.2MMX2.5MM,SMD CRYSTAL,40MHZ,3.2MMX2.5MM,SMD CRYSTAL,48MHZ,3.2MMX2.5MM,SMD CRYSTAL,10MHZ,HC-49S CRYSTAL,11.2896MHZ,HC-49S CRYSTAL,13.225625MHZ,HC-49S CRYSTAL,13.56MHZ,HC-49S CRYSTAL,14.31818MHZ,HC-49S CRYSTAL,16MHZ,HC-49S CRYSTAL,16.9344MHZ,HC-49S CRYSTAL,20.5MHZ,HC-49S CRYSTAL,28.63636MHZ,HC-49S CRYSTAL,3.579545MHZ,HC-49S CRYSTAL,4MHZ,HC-49S CRYSTAL,4.194304MHZ,HC-49S CRYSTAL,8MHZ,HC-49S CRYSTAL,10MHZ,HC-49S,SMD CRYSTAL,11.0592MHZ,HC-49S,SMD CRYSTAL,11.2896MHZ,HC-49S,SMD CRYSTAL,12MHZ,HC-49S,SMD CRYSTAL,12.288MHZ,HC-49S,SMD CRYSTAL,13.225625MHZ,HC-49S,SMD CRYSTAL,14.31818MHZ,HC-49S,SMD CRYSTAL,16MHZ,HC-49S,SMD CRYSTAL,16.9344MHZ,HC-49S,SMD CRYSTAL,18.432MHZ,HC-49S,SMD CRYSTAL,20MHZ,HC-49S,SMD CRYSTAL,20.5MHZ,HC-49S,SMD CRYSTAL,24MHZ,HC-49S,SMD CRYSTAL,24.576MHZ,HC-49S,SMD CRYSTAL,27MHZ,HC-49S,SMD CRYSTAL,28.63636MHZ,HC-49S,SMD CRYSTAL,3.6864MHZ,HC-49S,SMD CRYSTAL,33.8688MHZ,HC-49S,SMD CRYSTAL,37.05MHZ,HC-49S,SMD CRYSTAL,4MHZ,HC-49S,SMD CRYSTAL,41.6MHZ,HC-49S,SMD CRYSTAL,5MHZ,HC-49S,SMD CRYSTAL,6MHZ,HC-49S,SMD CRYSTAL,8MHZ,HC-49S,SMD CRYSTAL OSCILLATOR,CMOS,12MHZ,SMD CRYSTAL OSCILLATOR,CMOS,12.288MHZ,SMD CRYSTAL OSCILLATOR,CMOS,13.5MHZ,SMD CRYSTAL OSCILLATOR,CMOS,14.31818MHZ,SMD CRYSTAL OSCILLATOR,CMOS,14.7456MHZ,SMD CONTACT,SOCKET,18-16AWG,CRIMP CRYSTAL OSCILLATOR,CMOS,24MHZ,SMD CRYSTAL OSCILLATOR,CMOS,25MHZ,SMD CRYSTAL OSCILLATOR,CMOS,26MHZ,SMD CRYSTAL OSCILLATOR,CMOS,27MHZ,SMD CRYSTAL OSCILLATOR,CMOS,28.63636MHZ,SMD CRYSTAL OSCILLATOR,CMOS,33MHZ,SMD CRYSTAL OSCILLATOR,CMOS,40MHZ,SMD CRYSTAL OSCILLATOR,CMOS,48MHZ,SMD CRYSTAL OSCILLATOR,CMOS,50MHZ,SMD CRYSTAL OSCILLATOR,CMOS,54MHZ,SMD CRYSTAL OSCILLATOR,CMOS,32.768KHZ,SMD TERMINAL,FEMALE DISCONNECT,6.35MM,RED CRYSTAL,12.288MHZ,3.2MMX2.5MM,SMD CRYSTAL,13.56MHZ,3.2MMX2.5MM,SMD CRYSTAL,14.31818MHZ,3.2MMX2.5MM,SMD CRYSTAL,21.948717MHZ,3.2MMX2.5MM,SMD CRYSTAL,24MHZ,3.2MMX2.5MM,SMD CRYSTAL,24.576MHZ,3.2MMX2.5MM,SMD CRYSTAL,26MHZ,3.2MMX2.5MM,SMD CRYSTAL,27MHZ,3.2MMX2.5MM,SMD CRYSTAL,28.63636MHZ,3.2MMX2.5MM,SMD CRYSTAL,30MHZ,3.2MMX2.5MM,SMD CRYSTAL,33.333MHZ,3.2MMX2.5MM,SMD TERMINAL,SPADE/FORK,#10,CRIMP,YELLOW CRYSTAL,37.05MHZ,3.2MMX2.5MM,SMD CRYSTAL,41.6MHZ,3.2MMX2.5MM,SMD CRYSTAL,9.84375MHZ,3.2MMX2.5MM,SMD CRYSTAL OSCILLATOR,CMOS,11.2896MHZ,SMD CRYSTAL OSCILLATOR,CMOS,20MHZ,SMD CRYSTAL OSCILLATOR,CMOS,26MHZ,SMD CRYSTAL,10MHZ,8MMX4.5MM,SMD CRYSTAL,12MHZ,8MMX4.5MM,SMD CRYSTAL,12.288MHZ,8MMX4.5MM,SMD CRYSTAL,13.56MHZ,8MMX4.5MM,SMD CRYSTAL,16MHZ,8MMX4.5MM,SMD CRYSTAL,16.9344MHZ,8MMX4.5MM,SMD CRYSTAL,20MHZ,8MMX4.5MM,SMD CRYSTAL,24.576MHZ,8MMX4.5MM,SMD CRYSTAL,28.224MHZ,8MMX4.5MM,SMD CRYSTAL,28.63636MHZ,8MMX4.5MM,SMD CRYSTAL,33MHZ,8MMX4.5MM,SMD CRYSTAL,33.333MHZ,8MMX4.5MM,SMD CRYSTAL,9.84375MHZ,8MMX4.5MM,SMD SENSOR,RECEIVER,SAFETY,EVA FOR ADAM CAPTEUR EVA E SECURITE /REC POUR ADAME CAPTEUR ADAM SECURITE/3M CABLE/VITAL CAPTEUR ADAM SECURITE/10M CABLE/VITAL CAPTEUR ADAM SECURITE/20M CABLE/VITAL CAPTEUR ADAM SECURITE/CABLE+M12/VITAL VITAL 1 CONTROL UNIT 24DC/2NO SMILE 11EA TINA ESTOP UNIT POUR VITAL INCA 1 TINA PANEL ESTOP POUR VITAL TINA 1A BLANK PLUG POUR TINA 4A/8A TINA 2A VITAL ADAPTATEUR/MECH CONTACTS TINA 3A VITAL ADAPTATEUR/MECH CONTACTS TINA 4A M12 VITAL CONNECTION BLOCK TINA 8A M12 VITAL CONNECTION BLOCK TINA 6A VITAL ADAPTATEUR POUR SAFE EDGES TINA 7A VITAL ADAPTATEUR/MECH CONTACTS TINA 2B VITAL ADAPTATEUR AVEC CABLE TINA 10A VITAL ADAPTATEUR/OSSD SORTIES TINA 10B VITAL ADAPTATEUR/OSSD SORTIES TINA 10C VITAL ADAPTATEUR/OSSD SORTIES CABLE 10M 5X0.34MM+M12 FEMALE CABLE 10M 8X0.34MM+M12 FEMALE INTERFACE CARD - DATA ACQUISITION SWITCH,ROCKER,DPST,20A,250VAC,BLACK LED LIGHT BAR,YELLOW,5W,24VDC,230MM OPERATING TOOL,MODULAR TERMINAL BLOCK TIME DELAY RELAY,1NO,0.1SEC,24VDC FUSE,SMD,4A,SLOW BLOW TERMINAL BLOCK,PCB,1POS TIME DELAY RELAY,SPDT,100H,240VAC/DC SSR,PANEL MOUNT,32VDC,12A,265VAC DEVICE SERVER ETHERNET TO SERIE CHOKE,5UH,23A,10% LED LENS CAP,T-1 3/4 LED FFC JUMPER,40 WAY,30V WIRE MARKER CARDS,VINYL,BLK,38MM,25 CARDS TERMINAL,RING TONGUE,SIZE 10,CRIMP TERMINAL,FERRULE,CRIMP,WHITE N CHANNEL MOSFET,55V,89A,D-PAK SWITCH,PUSHBUTTON,SPST-NO,10A,YELLOW CONNECTOR,POWER ENTRY,RCPT,20A CNTRL RECTIFICATION 38V 3A 8SO CNTRL RECTIFICATION DOUBLE 38V 3A 8SO DRIVER CFL 500V 4 STEP DIMMING 16SO CNTRL SMPS 700V 905HZ FBRST 5W 7SO CNTRL SMPS 700V 1270HZ FBRST 5W 7SO CNTRL SMPS 700V 1750HZ FBRST 5W 7SO CNTRL SMPS 700V 430HZ FBRST 11W 7SO CNTRL SMPS 700V 905HZ FBRST 11W 7SO CNTRL SMPS 700V 1270HZ FBRS 11W 7SO CNTRL SMPS 700V 1750HZ FBRS 11W 7SO RUBAN DE MASQUAGE USAGE GENERAL 75MM RUBAN. MASKING GEN PUROSE 100MM RUBAN DE MASQUAGE HAUTE PERFORM 25MM RUBAN DE MASQUAGE CREPE 25MM RUBAN DE MASQUAGE CREPE 38MM RUBAN DE MASQUAGE CREPE 50MM RUBAN DE MASQUAGE CREPE 75MM RUBAN DE MASQUAGE PERFORMANCE 38MM RUBAN DE MASQUAGE PERFORMANCE 50MM RUBAN DE MASQUAGE HAUTE TEMP 19MM RUBAN DE MASQUAGE HAUTE TEMP 25MM RUBAN DE MASQUAGE HAUTE TEMP 38MM RUBAN DE MASQUAGE HAUTE TEMP 50MM LABELING TAPE,19.05MM W X 4.88M L,BLK/WHT,NYLON CAPACITOR ALUM ELEC 33UF 10V 20%,SMD LED RING LIGHT ILLUMINATOR CAPACITOR TANT,2.2UF 10V 6.3 OHM 10%,3216-18 SIGNAL HORN ALARM,105DB,24VAC/VDC,5A TERMINAL BLOCK MARKER,5MM,WHT,MULTICARD 1000 CAPACITOR ALUM ELEC 2200UF,50V,20%,RADIAL SWITCH,TOGGLE,DPDT,15A,250V TERMINAL,LUG,DUAL-RATED MECHANICAL,SCREW EVAL BRD,KEIL LPC1768 EVAL BRD,KEIL LPC1758 OPTOCOUPLERS EVAL BRD,EA LPCXPRESSO BASEBOARD EVAL BRD,KEIL LPC1769 IC,RS-232 TRANSCEIVER,5.5V,TSSOP-16 CABLE CLAMP,NYLON 6.6,NATURAL BRT TRANSISTOR,PNP,-50V,-100MA,10KOHM / 47KOHM,3-SOT-416 VOICE ANNUNCIATOR,24VDC,90DB,IP54 SWITCH,LOAD BREAK,3P,600VAC,10A CONTACT BLOCK,1 NC + 1 NO,SCREW CLAMP AC-DC CONV,ENCLOSED,1 O/P,15W,700mA,24V FERRULE ASST,TWIN WIRE END,0.5-2.5MM2 CONNECTOR,TERMINAL BLOCK,2POS,10-3AWG SWITCH,KEY OPERATED,DPST,100mA,42V SWITCH BODY,XCMD LIMIT SWITCH TERMINAL BLOCK,STANDARD,2WAY,16AWG HEAT SHRINK TUBING,38.1MM ID,PO,BLK,48´´ SWITCH,SAFETY INTERLOCK,DPST,6A,120VAC CONNECTOR,HOUSING,RCPT,4POS,1ROW CONNECTOR,HEADER,4POS,1ROW,1MM HEAT SHRINK TUBING,12.7MM ID,PVC,BLK,2 TERMINAL,SPADE/FORK,#6,CRIMP,BLUE CONNECTOR ASSEMBLIES,TEST TERMINAL,RING TONGUE,3/8IN,CRIMP BLUE CONNECTOR,POWER ENTRY,RCPT,15A,NEMA L6-15R SPACER/STANDOFF,BRASS,4.75MM X 6.35MM LABEL,SELF LAM,VINYL,1.5´´W X 6´´H,50/ROLL,WHT IC,SYNC BUCK DC/DC CONTROLLER,16-HTSSOP SPACER,HEX,6-32,63.5MM,BRASS,NICKEL SCREW,PAN HEAD,NYLON 6.6,8-32,19.1MM ADAPT PUISSANCE DESK TOP 12V 5A 60W ADAPT PUISSANCE DESK TOP 15V 4A 60W ADAPT PUISSANCE DESK TOP 18V 3.6A 65W ADAPT PUISSANCE DESK TOP 36V 1.8A 65W ADAPT PUISSANCE DESK TOP 12V 7.5A 90W ADAPT PUISSANCE 13.5V 6.67A 90W ADAPT PUISSANCE DESK TOP 15V 6.67A 100W ADAPT PUISSANCE DESK TOP 19V 5.8A 110W ADAPT PUISSANCE DESK TOP 20V 5.5A 110W ADAPT PUISSANCE DESK TOP 48V 3.13A 150W ALIM A DECOUPAGE MEDICAL 12V ALIM A DECOUPAGE MEDICAL 24V ALIM A DECOUPAGE MEDICAL 48V ALIM A DECOUPAGE MEDICAL 12V ALIM A DECOUPAGE MEDICAL 24V ALIM A DECOUPAGE MEDICAL 48V BASEPLATE COOLED PS 12V 500W BASEPLATE COOLED PS 24V 500W BASEPLATE COOLED PS 36V 500W BASEPLATE COOLED PS 48V 500W BASEPLATE COOLED PS 12V 1000W BASEPLATE COOLED PS 24V 1000W BASEPLATE COOLED PS 48V 1000W ALIM A DECOUPAGE 36V 14A 504W COMPARATEUR DOUBLE 35VIN 1.3US 8SOP REGULATEUR LDO 5.5VIN 0.12VDO 1% 5TO252 COMMUTATEUR USB 0.08OHM 8SOP REGULATEUR LDO 5.5VIN 0.15A 1.8V 5HVSOF REGULATEUR LDO 5.5VIN 0.15A 3.3V 5HVSOF MPU SITARA CORTEX A8 324NFBGA MPU SITARA CORTEX A8 298NFBGA WAVEFORM GENERATOR,20MHZ,1 CH GENERATOR,WAVEFORM,20MHZ,2 CH GENERATOR,WAVEFORM,20MHZ,1 CH,ARB GENERATOR,WAVEFORM,20MHZ,2 CH,ARB GENERATOR,WAVEFORM,30MHZ,1 CH GENERATOR,WAVEFORM,30MHZ,2 CH GENERATOR,WAVEFORM,30MHZ,1 CH,ARB WAVEFORM GENERATOR,ARB,30MHZ,2 CH BAC LINBIN BLEU TAILLE 4A PQ10 BAC LINBIN ROUGE TAILLE 2 PQ20 BAC LINBIN ROUGE TAILLE 6 PQ5 BAC LINBIN ROUGE TAILLE 7 BAC LINBIN ROUGE TAILLE 8 BAC LINBIN JAUNE TAILLE 2 PQ10 BAC LINBIN JAUNE TAILLE3 PQ10 BAC LINBIN JAUNE TAILLE 6 PQ5 BAC LINBIN JAUNE TAILLE 8 BAC LINBIN VERT TAILLE 1 PQ10 BAC LINBIN VERT TAILLE 3 PQ10 BAC LINBIN VERT TAILLE 4A PQ10 BAC LINBIN VERT TAILLE 5 PQ5 BAC LINBIN VERT TAILLE 7 BAC LINBIN VERT TAILLE 8 BAC LINBIN GRIS TAILLE 7 BAC LINBIN GRIS TAILLE 8 PANNEAU MURAL TAILLE 1 PANNEAU AJOURE TAILLE 2 LOUVRE PANEL,1400X500MM,GREY LOUVRE PANEL,1800X500MM,GREY DIVIDER,FOR SIZE 2 LINBINS,PK20 DIVIDER,FOR SIZE 3 LINBINS,PK20 DIVIDER,FOR SIZE 4 LINBINS,PK20 DIVIDER,FOR SIZE 6 LINBINS,PK10 DIVIDER,FOR SIZE 7 LINBINS,PK5 DIVIDER,FOR SIZE 8 LINBINS,PK5 KIT,WALL MOUNT LINBIN,16 GREY BINS PLATEAU STOCKAGE 400X94X80 PQ10 PLATEAU STOCKAGE 400X188X80 PQ5 PLATEAU STOCKAGE 400X188X115 PQ5 PLATEAU STOCKAGE 500X94X80 PQ10 PLATEAU D´ETAGERE 94X80 PQ20 PLATEAU D´ETAGERE 188X80 PQ20 ETAGERE D´EXTENSION 500MM ETAGERES PROF 500MM PQ2 CASE,ESD,CONDUCTIVE,120X80X24MM CASE,ESD,CONDUCTIVE,375X265X80MM FOAM INSERT,ESD,F. CASE K 2012 ESD FOAM INSERT,ESD,F. CASE K 2011 ESD IC,LINEAR VOLTAGE REGULATOR 5V SOT-89-3 AC-DC CONV,OPEN FRAME,5 O/P,80W CONNECTOR,HOUSING,PLUG,2POS,CABLE FUSE,SMD,2.5A,SLOW BLOW IC,SERIES V-REF,10V,5mV,8-DIP TERMINAL MARKERS,CARD,5 x 5mm,POLYAMIDE 66,WHITE IC,SRAM,4MBIT,PARALLEL,10NS,TSOP-44 DRIVER,LED,BOOST,100VIN,2A,8SOP CONTACT,FEMALE,20-14AWG,CRIMP END PLATE,1.5MM,BEIGE TERMINAL BLOCK,DIN RAIL,4POS,30-12AWG CAPACITOR ALUM ELEC 47UF 10V 20%,SMD RESISTOR,THICK FILM,3.3KOHM,100mW,1% TVS-DIODE,0.7V,SOT-457 AC-DC CONV,ENCLOSED,1 O/P,150W,6.5A,24V CONNECTOR,IEC POWER ENTRY,SOCKET,10A IC,LDO VOLT REG,3.3V,0.25A,SOT-23A-3 EVAL BOARD,DRV8832,MOTOR DRIVER EVAL BOARD,DRV8837,MOTOR DRIVER EVAL BOARD,INA223,VOLTAGE MONITOR EVAL BOARD,TLV320DAC3203,AUDIO DAC EVAL BRD,TPS54061,STEP DOWN CNVTR TERMINAL,SPADE/FORK,#2,CRIMP,RED IC,ADC,24BIT,SSOP-28 MODULE,BLUETOOTH CLASS 2,W/ ANT MODULE,BLUETOOTH CLASS 1,ANTENNA CABLE,COAX W/UFL RPSMA,6INCH MODULE,WLAN,W/ ANT,U.FL CONN MODULE,EVAL,BLUETOOTH,W/ RN-42 ANTENNA,2.4GHZ,STUBBY 1INCH MODULE,WIFLY,GSX,802.11 W/ RN-131 ANTENNA,2.4GHZ,4IN SMA MALE CONN ANTENNA,2.4GHZ,4INCH W/ RPSMA ANTENNA 2.4GHZ,1INCH W/ RPSMA MODULE,BLUETOOTH CLASS 2 V REG,1%,1.24V TO 18V,5SOT753 V REG,0.75%,1.24V TO 18V,3SOT23 V REG,0.75%,1.24V TO 18V,3SOT23 V REG,0.75%,1.24V TO 18V,5SOT753 V REG,1.5%,1.24V TO 18V,3SOT23 V REG,1.5%,1.24V TO 18V,5SOT753 GENERATEUR DE FONCTION ARB 20MHZ CONNECTOR,HOUSING,PLUG,4POS,CABLE POWER RELAY,4PDT,12VDC,3A,PC BOARD RELAY,POWER,SPDT,24VDC,10A,PCB REED RELAY,SPST-NO,12VDC,0.5A,THD POWER RELAY,DPDT,120VAC,25A,FLANGE No description available - 2143369 POTENTIOMETER,ROTARY,500 OHM,2W,10% CONNECTOR,MEMORY CARD,MICRO SD,8POS,1.1MM CONNECTOR,HOUSING,PLUG,2POS,11MM TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,SPADE/FORK,#6,CRIMP,RED TERMINAL LOCK,2POS CONNECTOR,HOUSING,3POS,1ROW,11MM CONTACT,SOCKET,10AWG,CRIMP CONTACT,SOCKET,8AWG,CRIMP CONTACT,SOCKET,6AWG,CRIMP TERMINAL LOCK,3POS CONNECTOR,HEADER,3POS,1ROW,3.86MM CAPACITOR,RF,0.05PF,±0.02PF,16V,1005 CAPACITOR,RF,0.1PF,±0.02PF,16V,1005 CAPACITOR,RF,0.2PF,±0.02PF,16V,1005 CAPACITOR,RF,0.3PF,±0.02PF,16V,1005 CAPACITOR,RF,0.4PF,±0.02PF,16V,1005 CAPACITOR,RF,0.5PF,±0.02PF,16V,1005 CAPACITOR,RF,0.6PF,±0.02PF,16V,1005 CAPACITOR,RF,0.7PF,±0.02PF,16V,1005 CAPACITOR,RF,0.8PF,±0.02PF,16V,1005 CAPACITOR,RF,0.9PF,±0.02PF,16V,1005 CAPACITOR,RF,1PF,±0.02PF,16V,1005 CAPACITOR,RF,1.2PF,±0.03PF,16V,1005 CAPACITOR,RF,1.5PF,±0.03PF,16V,1005 CAPACITOR,RF,1.8PF,±0.03PF,16V,1005 CAPACITOR,RF,2.2PF,±0.03PF,16V,1005 INDUCTOR RF,0201,0.33NH,0.05NH,550mA INDUCTOR RF,0201,0.33NH,0.05NH,550mA INDUCTOR RF,0201,0.39NH,0.05NH,550mA INDUCTOR RF,0201,0.39NH,0.05NH,550mA D SUB CONTACT,PIN,24-20AWG,CRIMP INDUCTOR RF,0201,0.47NH,0.05NH,550mA INDUCTOR RF,0201,0.56NH,0.05NH,500mA INDUCTOR RF,0201,0.56NH,0.05NH,500mA INDUCTOR RF,0201,0.68NH,0.05NH,500mA INDUCTOR RF,0201,0.68NH,0.05NH,500mA INDUCTOR RF,0201,0.82NH,0.05NH,400mA INDUCTOR RF,0201,0.82NH,0.05NH,400mA INDUCTOR RF,0201,1NH,0.05NH,400mA INDUCTOR RF,0201,1NH,0.05NH,400mA INDUCTOR RF,0201,1.2NH,0.05NH,300mA INDUCTOR RF,0201,1.2NH,0.05NH,300mA TERMINAL,RING TONGUE,#8,CRIMP,BLUE INDUCTOR RF,0201,1.5NH,0.1NH,250mA INDUCTOR RF,0201,1.5NH,0.1NH,250mA INDUCTOR RF,0201,1.8NH,0.1NH,250mA INDUCTOR RF,0201,1.8NH,0.1NH,250mA INDUCTOR RF,0201,2.2NH,0.1NH,200mA INDUCTOR RF,0201,2.2NH,0.1NH,200mA INDUCTOR RF,0201,2.7NH,0.1NH,180mA INDUCTOR RF,0201,2.7NH,0.1NH,180mA INDUCTOR RF,0201,3.3NH,0.1NH,150mA INDUCTOR RF,0201,3.3NH,0.1NH,150mA INDUCTOR,UN-SHIELDED,33UH,SMD TERMINAL,RING TONGUE,#8,CRIMP,BLUE INDUCTOR,UN-SHIELDED,47UH,SMD INDUCTOR,UN-SHIELDED,470UH,SMD INDUCTOR,UN-SHIELDED,22UH,1.2A,SMD INDUCTOR,UN-SHIELDED,4.7UH,4.2A,SMD INDUCTOR,UN-SHIELDED,68UH,1.2A,SMD INDUCTOR,UN-SHIELDED,10UH,10A,SMD INDUCTOR,SMD INDUCTOR,UN-SHIELDED,2.2UH,20A,SMD INDUCTOR,UN-SHIELDED,47UH,5A,SMD INDUCTOR,UN-SHIELDED,68UH,4A,SMD INDUCTOR,SHIELDED,10UH,SMD INDUCTOR,SHIELDED,47UH,SMD LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,4V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,RED,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,RED,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,8MM,BLUE,4V PANEL MOUNT INDICATOR,LED,8MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,8MM,RED,2V PANEL MOUNT INDICATOR,LED,8MM,RED,2.1V PANEL MOUNT INDICATOR,LED,8MM,RED,2.1V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,4V PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,4V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,RED,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,RED,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,8MM,BLUE,4V PANEL MOUNT INDICATOR,LED,8MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,8MM,RED,2.1V PANEL MOUNT INDICATOR,LED,8MM,RED,2.1V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,5.943MM,AMBER,2V PANEL MOUNT INDICATOR,LED,5.943MM,AMBER,2V PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,4V PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,4V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,5.943MM,RED,2V PANEL MOUNT INDICATOR,LED,5.943MM,RED,2V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,5.943MM,RED,1.7V PANEL MOUNT INDICATOR,LED,5.943MM,RED,1.7V PANEL MOUNT INDICATOR,LED,5.943MM,WHITE,3.2V PANEL MOUNT INDICATOR,LED,5.943MM,WHITE,3.2V PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,2.1V TERMINAL,RING TONGUE,#10,CRIMP,BLUE PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,2.1V LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL PANEL MOUNT INDICATOR,LED,5.943MM,AMBER,48V PANEL MOUNT INDICATOR,LED,5.943MM,AMBER,48V PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,48V PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,48V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,48V PANEL MOUNT INDICATOR,LED,5.943MM,RED,48V PANEL MOUNT INDICATOR,LED,5.943MM,RED,48V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,48V PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,48V PANEL MOUNT INDICATOR,LED,5.943MM,RED,48V PANEL MOUNT INDICATOR,LED,5.943MM,RED,48V PANEL MNT INDICATOR,LED,5.943MM,N. WHITE,48V PANEL MOUNT INDICATOR,LED,5.943MM,WHITE,48V PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,48V TERMINAL,RING TONGUE 3/8IN CRIMP YELLOW PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,48V PANEL MOUNT INDICATOR,LED,8.4MM,WHITE, PANEL MOUNT INDICATOR,LED,4.064MM,BLUE,4V PANEL MOUNT INDICATOR,LED,4.064MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,4.064MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,4.064MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,4.064MM,RED,2.1V PANEL MOUNT INDICATOR,LED,4.064MM,RED,1.7V PANEL MOUNT INDICATOR,LED,4.064MM,YELLOW,2V LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL PANEL MOUNT INDICATOR,LED,10MM,AMBER,2V PANEL MOUNT INDICATOR,LED,10MM,AMBER,2V PANEL MOUNT INDICATOR,LED,10MM,BLUE,4V PANEL MOUNT INDICATOR,LED,10MM,BLUE,4V PANEL MOUNT INDICATOR,LED,10MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,10MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,10MM,RED,2V PANEL MOUNT INDICATOR,LED,10MM,RED,2V PANEL MOUNT INDICATOR,LED,10MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,10MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,10MM,RED,1.7V PANEL MOUNT INDICATOR,LED,10MM,RED,1.7V PANEL MOUNT INDICATOR,LED,10MM,WHITE,3.2V PANEL MOUNT INDICATOR,LED,10MM,WHITE,3.2V PANEL MOUNT INDICATOR,LED,10MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,10MM,YELLOW,2V LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL PANEL MOUNT INDICATOR,LED,10MM,AMBER,48V PANEL MOUNT INDICATOR,LED,10MM,AMBER,48V PANEL MOUNT INDICATOR,LED,10MM,BLUE,48V TERMINAL,RING TONGUE,#10,CRIMP YELLOW PANEL MOUNT INDICATOR,LED,10MM,BLUE,48V PANEL MOUNT INDICATOR,LED,10MM,GREEN,48V PANEL MOUNT INDICATOR,LED,10MM,GREEN,48V PANEL MOUNT INDICATOR,LED,10MM,RED,48V PANEL MOUNT INDICATOR,LED,10MM,RED,48V PANEL MOUNT INDICATOR,LED,10MM,GREEN,48V PANEL MOUNT INDICATOR,LED,10MM,GREEN,48V PANEL MOUNT INDICATOR,LED,10MM,RED,48V PANEL MOUNT INDICATOR,LED,10MM,RED,48V PANEL MOUNT INDICATOR,LED,10MM,WHITE,48V PANEL MOUNT INDICATOR,LED,10MM,WHITE,48V TERMINAL,RING TONGUE,5/16IN,YELLOW PANEL MOUNT INDICATOR,LED,10MM,YELLOW,48V PANEL MOUNT INDICATOR,LED,10MM,YELLOW,48V LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL PANEL MOUNT INDICATOR,LED,6.35MM,BLUE,4V PANEL MOUNT INDICATOR,LED,6.35MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,6.35MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,6.35MM,RED,2.1V PANEL MOUNT INDICATOR,LED,6.35MM,RED,2.1V PANEL MOUNT INDICATOR,LED,6.35MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,6.35MM,YELLOW,2V LIGHT PIPE,SINGLE,254MM,CIRCULAR,PANEL CONTACT,PIN,26-24AWG,CRIMP CONNECTOR,RECTANGULAR,RCPT,156POS,CABLE CAPACITOR PP FILM 0.15UF 300VAC 20%,RADIAL CIRCULAR STRAIN RELIEF,STR,W/CLAMP,SZ20,SELF-LOK,METAL CONTACT,SOCKET,26-24AWG,CRIMP CABLE SUPPORT FLEX 20MM 0.5M CABLE SUPPORT FLEX 30MM 0.5M CONNECTOR,RCPT,32POS,1ROW,2.54MM MICROSCOPE,HAND HELD,10X to 40X OPTICAL /15X to 200X DIGITAL SURFACE MOUNT FUSE CONTACT,PIN,18-14AWG,CRIMP KNOB,CONTROL,0.25IN,NYLON MOSFET,N CH,500V,5A,TO-220FN-3 FUSE,THERMAL,115°C,5A,250VAC D SUB CONTACT,SOCKET,24-20AWG,CRIMP FUSE,CARTRIDGE,6.3X32MM,500mA,250VAC CABLE,PVC,22AWG,1000FT,150VRMS,CHROME CIRCULAR STRAIN RELIEF,STR,W/CLAMP,SZ15,SELF-LOK,METAL RACEWAY BASE,ALUMINIUM,SATIN D SUB CONTACT,SOCKET,28-24AWG,CRIMP HINGED PANEL DOOR,CABINET RACK,10.38IN PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,4V PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,8MM,BLUE,4V PANEL MOUNT INDICATOR,LED,8MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,5.943MM,BLUE,4V PANEL MOUNT INDICATOR,LED,5.943MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,8MM,RED,2V PANEL MOUNT INDICATOR,LED,8MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,4.064MM,BLUE,4V D SUB CONTACT,PIN,18AWG,SOLDER PANEL MOUNT INDICATOR,LED,4.064MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,4.064MM,YELLOW,2V PANEL MOUNT INDICATOR,LED,6.35MM,BLUE,4V POT,WIREWOUND,10KOHM,5%,1W CIRCULAR STRAIN RELIEF,SZ 10SL/12/12S, PLUG STANDARD HI VOLTAGE 4VOIES RECEPTACLE STD HI VOLTAGE 4VOIES PLUG REVERSED HI VOLTAGE 4VOIES RECEPTACLE REVERSE HI VOLTAGE 4VOIES GROUND BUS BAR,COPPER,0.63´´ N4 J BOX,LIFT OFF COVER W/PANEL,6X6X4,STEEL,GRAY GASKET KIT,NEOPRENE,NEMA 12 ENCLOSURE TRIANGLE KEY,ECLIPSE & SERIES 2000 ENCLOSURE TRANSFORMER,ISOLATION,40VA,2 X 26V EXTERNAL POWER SUPPLY,24VDC,48W TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW CIRCULAR CONNECTOR PLUG,SIZE 10,6POS,CABLE CIRCULAR CONTACT,REAR RELEASE,SOCKET,SZ8,10-8AWG,CRIMP CONTACT,COAX,PIN,SIZE 8,CRIMP MOUNTING RAILS,C2,C3 or REFK SERIES RACK N4X ENCLOSURE,WALLMT. W/PANEL,20X16X8,304SS LENS,2.25X,FOR MAGNIFYING LAMP CONTACT,PIN,14-12AWG,CRIMP CIRCULAR CONNECTOR RCPT,SIZE 10,6POS,CABLE CONTACT,PIN,SOLDER CIRCULAR CONNECTOR PLUG SIZE 14,19POS,CABLE AC CENTRIFUGAL BLOWER DIODE,TVS,1.5KW,15.3V,BIDIRECTIONAL DIODE,ZENER,5W,22V END AND INTERMEDIATE PLATE,TERMINAL BLOCK END & INTERMEDIATE PLATE,2.5MM,ORANGE TERMINAL BLOCK,DIN RAIL,3POS,28-12AWG TERMINAL BLOCK,FUSE,2POS,24-10AWG,MINI CONTACT,PIN,SOLDER OPTOCOUPLER,PHOTOTRANSISTOR O/P,4KV,MODULE RELAY O/P MODULE,WAGO-I/O-SYSTEM 750 TRANSISTOR,NPN,180V,1A,TO-202-3 TRANSISTOR,NPN,75V,5A,TO-220 TRANSISTOR,NPN,180V,2A,TO-220 TRANSISTOR,PNP,180V,2A,TO-220AB-3 BIPOLAR TRANSISTOR,NPN,80V,TO-92 CONTACT,SOCKET,SOLDER RELAY SOCKET,16,PCB,THROUGH HOLE DIODE,TVS,1.5KW,20.5V,UNIDIRECTIONAL DIODE,ZENER,50W,130V,DO-203AB-2 BRIDGE RECTIFIER,1PH,4A,1KV,SIP-4 SCR THYRISTOR,800mA,3V,TO-92 DIODE,STANDARD,30A,200V,DO-203AA-2 TRANSISTOR,NPN,200V,15A,TO-3P-3 RESISTOR,METAL OX,AXIAL LEAD,1.21KOHM,250mW,1% CAPACITOR CERAMIC,1000PF,20%,100V,X7R,RADIAL TRANSISTOR,PNP,160V,16A,TO-218-3 HOOK-UP WIRE,30.5M,22AWG,COPPER,GRN R-200PRV 1A 33C7744 DIODE,ZENER,5W,110V DIODE,FAST RECOVERY,3A,600V,DO-204AC-2 DIODE,ZENER,500mW,13V,DO-204AH-2 DIODE,ZENER,500mW,33V,DO-204AH-2 TRANSISTOR,NPN,100V,12A,TO-204AA-2 TURRET HEAD,AF8 CRIMP TOOL RACEWAY,STEEL,GREY,37MM CONTACT,PIN,24-20AWG,CRIMP TRANSFORMER,ISOLATION,1.5KVA,2 X 120V BACKSHELL,SIZE 13,ALUMINIUM SWITCH,LIMIT,600/250V,10A,TOP ROLLER PLUNGER CONTACT,PIN,24-20AWG,CRIMP CHIP INDUCTOR 68NH 500MA 5% 1600MHZ RELAY,DPST-NO,22VDC,30A,PANEL CONNECTOR,4,16A,120VAC RF/COAX,F PLUG,STRAIGHT,75 OHM,RG6 CRIMP CIRCULAR STRAIN RELIEF,STR,W/CLAMP,SZ15,METAL CONTACT,QUADRAX,SOCKET,SIZE 8,CRIMP WIRE-BOARD CONNECTOR RECEPTACLE,4POS,2 CONNECTOR,HOUSING,2POS CONTACT,QUADRAX,PIN,SIZE 8,CRIMP CAPACITOR ALUM ELEC 4700UF,25V,20%,RADIAL RECTANGULAR CONNECTOR,PLUG,30WAY CRIMP PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.1V BACKSHELL,D SUB,DE,THERMOPLASTIC IC,QUAD NAND GATE,SCHMITT TRIG,DIP-14 CIRCULAR STRAIN RELIEF,STR,W/CLAMP,SZ14,METAL RACKING SHELVE,STEEL,STANDARD 19´´ RACK MOUNT CIRCULAR CABLE CLAMP,SIZE 20/22,METAL TRANSFORMER,ISOLATION,250VA,2 X 120V COUNTING SCALES BENCH 16KG COUNTING SCALES BENCH 32KG CAPACITOR TANT,22UF 25V,0.7 OHM,0.1,7343-31 CABLE TIE,1.019M,NYLON 6.6,250LB,NATURAL EXTENSION CABLE,USB 2.0,16FT,BLK CAPACITOR ALUM ELEC 33UF 100V 20%,SMD CIRCULAR CABLE CLAMP,SHELL SZ 12,ALUMINIUM ALLOY PANEL MOUNT INDICATOR,LED,8MM,GREEN,2.1V PANEL MOUNT INDICATOR,LED,8MM,BLUE,4V CAPACITOR CERAMIC 0.1UF 50V,C0G,5%,1825 RACKING SHELVE,STEEL,STANDARD 19´´ RACK MOUNT RESISTOR,THICK FILM,3.9KOHM,100mW,1% CIRCULAR STRAIN RELIEF,,ALUMINUM CONTACT,D SUB COMBO,PIN,SOLDER RACKING SHELVE,STEEL,STANDARD 19´´ RACK MOUNT LED,WHITE,T-1 3/4 (5MM),16CD LED,RED,T-1 3/4 (5MM),3.5CD,660NM AC Axial Fan 74K2274 RACKING SHELVE,STEEL,STANDARD 19´´ RACK MOUNT RACKING SHELVE,FOR 19´´ RACKS AND CABINETS HEAT SHRINK TUBING,6.4MM ID,PO,BLACK,48IN/1.22M PATCH CORD,CAT5E,UTP,BLACK,4FT CABLE CLAMP,SHELL SIZE 13 SWITCH,TOGGLE,DPDT,15A,250V CONNECTOR,HEADER,2POS,1ROW,3.86MM HINGED LOCKING DOOR,CABINET RACK,1.01 IC,CURRENT MODE PWM CTRL,25V,8-SOIC BACKSHELL,D SUB,15POS,DA,90DEG Crimp Tool,controlled cycle,crimps PAN 91B2832 HOOK-UP WIRE,22AWG,TINNED COPPER,600V,WHT 6DF INERTIAL MEASUREMENT UNIT,7-32V LOCKING CABLE TIES TOOL,HAND CRIMP,CONNECTOR INDUCTOR,CHOKE,2.5mH,SMD CONNECTOR,MEMORY CARD,MICRO SD,8POS,1.1MM Snap Action Basic Switch FAN GUARD,METAL,FOR 80MM X 80MM FANS IC,SYNC BUCK CONTROLLER,16-HTSSOP CIRCULAR CONNECTOR PLUG SIZE 15,37POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 19,66POS,CABLE BRIDGE RECTIFIER,1PH,6A,600V,SIP-4 TIME DELAY RELAY,SPST-NO,10SEC,120VAC EEPROM 2KBIT 256X8 I2C 8SOP EEPROM 256KBIT 32KX8 I2C 8SOP EEPROM 16KBIT 2048X8 SPI 8SOP TRANSISTOR NPN 50V 0.15A SOT-59 TRANSISTOR NPN 50V 1A SOT-89 TRANSISTOR NPN 12V 0.5A SOT-416 TRANSISTOR NPN 60V 0.5A SOT-323 TRANSISTOR NPN 60V 0.5A SOT-323 TRANSISTOR NPN 50V 0.15A SOT-323 TRANSISTOR NPN 30V 1.5A SOT-89 TRANSISTOR NPN 30V 1A SC-96 TRANSISTOR NPN 50V 0.7A SC-1055 TRANSISTOR NPN 50V 0.1A SC-1055 RELAIS THERMIQUE SERIE D MOSFET P-CH 20V 0.2A VMT3 MOSFET N-CH 20V 2.5A TUMT3 MOSFET N-CH 20V 4A TSMT3 MOSFET P-CH 12V 3A TUMT3 MOSFET P-CH 12V 5A TSMT6 MOSFET P-CH 12V 2.5A TSMT3 MOSFET P-CH 12V 4A TSMT3 DIODE ZENER 6.8V 0.15MW 2EMD DIODE ZENER 12V 0.15MW SOD523 DIODE ZENER 10V 1W SOD-123 DIODE ZENER 11V 1W SOD-123 DIODE ZENER 12V 1W SOD-123 DIODE ZENER 13V 1W SOD-123 DIODE ZENER 15V 1W SOD-123 DIODE ZENER 16V 1W SOD-123 DIODE ZENER 24V 1W SOD-123 DIODE ZENER 3.6V 1W SOD-123 DIODE ZENER 36V 1W SOD-123 DIODE ZENER 4.7V 1W SOD-123 DIODE ZENER 6.2V 1W SOD-123 DIODE ZENER 8.2V 1W SOD-123 DIODE ZENER 16V 0.2W SOD-323 DIODE ZENER 27V 0.2MW SOD-323 DIODE ZENER 6.2V 0.2W SOT-323 DIODE SCHOTTKY 30V 5A SOT-428 DIODE SCHOTTKY 30V 0.1A SOT363 DIODE FAST REC 200V 2A SOD-106 DIODE FAST REC 200V 3A TO-252 STRAIN RELIEF,SIZE 20,ALUMINIUM CIRCULAR CONN,RCPT,SIZE 8,4POS,BOX CIRCULAR CONNECTOR PLUG SIZE 12,14POS,CABLE CIRCULAR CONN,PLUG,SIZE 8,4POS,CABLE CIRCULAR CONN,RCPT,SIZE 8,3POS,BOX PANEL MOUNT INDICATOR,LED,5.943MM,GREEN,2.1V JUMPER BAR,2POS,TERMINAL BLOCK MODULE WLAN WIFLY GSX EXT ANT MODULE WIFI 802.15.4 DROP-IN W/ANT MODULE WIFI 802.15.4 DROP-IN W/ANT KIT D´EVAL RN-131 MODULE W/ANT U.FL EXTRACTOR IC,EEPROM,16KBIT,I2C,400KHZ,SOIC-8 PTC THERMISTOR UNIVERSAL U-CONNECTOR,4´´ POWER RELAY,SPDT,12VDC,10A,PC BOARD CABLE TIE MOUNT,4.1MM,NYLON 6.6 INTERFACING MODULE QUICK DISCONNECT CABLE,M12 5POS STRAIGHT SENSOR,MINI-BEAM,16MM,NPN / PNP AIR FILTER Screw Lock POTENTIOMETER,LINEAR,20KOHM,2W,10% CAPACITOR,FILM,50UF,10%,750V,10%,CAN IC,AUDIO PWR AMP,CLASS D,2.8W TQFN-16 INDUCTIVE PROXIMITY SENSOR SENSOR,TEMPERATURE,100 OHM,CLASS A HEADER,1.27MM,2X5POS,PCB SCHOTTKY RECTIFIER,DUAL 40A ISOTOP TRANSISTOR,NPN,55V,400mA,TO-39 METAL OXIDE VARISTOR,153V 295V RAD BORNIER PR RELAIS TRIPOL THERM FUSE,PCB,1A,125V,TIME DELAY RESISTOR,THICK FILM,33KOHM,100mW,1% IC,CAN CTRL,1MBPS,1/1,5.5V,SOIC-20 AC-DC CONV,OPEN FRAME,3 O/P,40W,5V,12V,-12V CIRCULAR CONNECTOR PLUG,SIZE 10,6POS,CABLE CONNECTOR,HEADER,10POS,2ROW,1.27MM HARDWARE KIT,10-32,VECTOR T-STRUTS DRIVER MOTEUR H-BRIDGE 1A 10WSON DRIVER MOTEUR H-BRIDGE 1.8A 8WSON CONTROLEUR PUISSANCE 5.5V 10SON CODEC STEREO 48KSPS 24VQFN BOOST 32VIN 5A 1.2MHZ 0.7% 16WQFN CAN 16 BITS 2KSPS 4DIFF/7SGL 32QFN CAN 14 BITS 3.3/5V 400MSPS 80HTQFP CONTROLEUR 3CH HS 0V TO 26VSENSE 16QFN AMP PUISSANCE CLASS-D 250W 44HTSSOP AMP PUISSANCE CLASS-D 300W 44HTSSOP AMP PUISSANCE CLASS-D 250W 44HTSSOP AMP,POWER,CLASS-D,300W,44HTSSOP AMPLI CLASSE-D 26VIN 2X15W 32HTSSOP DRIVER MOTEUR H-BRIDGE 1A 10WSON REGULATEUR LDO 0.175VDO 0.2A 1.9V 5SOT23 REGULATEUR LDO 0.175VDO 0.2A 2.2V 5SOT23 REGULATEUR LDO 0.26VDO 0.3A 4.5V 5SOT23 REGULATEUR LDO 0.22VDO 0.2A 3V 4X2SON REGULATEUR LDO 0.33VDO 0.15A 1.2V 4X2SON REGULATEUR LDO 0.33VDO 0.15A 1.3V 4X2SON REGULATEUR LDO 0.33VDO 0.15A 1.5V 4X2SON REGULATEUR LDO 0.33VDO 0.15A 1.8V 4X2SON REGULATEU LDO 0.215VDO 0.15A 2.8V 4X2SON REGULATEU LDO 0.215VDO 0.15A 3.3V 4X2SON POE IEEE802.3AT TYPE2 0.85A 8SOIC POE W GATE DRIVER TYPE2 0.85A 8SO BUCK 42VIN 1.5A 2.5MHZ 10VSON BOOST 5.5VIN 1.5A 3.5MHZ 5V 9CSP BOOST 5.5VIN 1.5A 3.5MHZ 4.5V 9CSP PMU 3BUCK 2BOOST 9LDO 48VQFN BUCK 4.8VIN 0.6A 5.5MHZ 1.86V 8USIP BUCK 4.8VIN 0.6A 5.5MHZ 1.26V 8USIP DRIVER GATE 18VIN 4A INV 5SOT23 DRIVER GATE DOUBLE 18VIN 5A 8SON NUMERIQUE CONTROLEUR DE PUISSANCE 64QFN CAPTEUR TEMP +/-1C 150C MAX 8SOT23 DAC 16 BITS 5.5VIN 30MHZ 3FIL 8MSOP V REG 37VIN 1.5A 0.1% AJUSTABLE 3TO220 REF TENSION SHUNT 0.2% 3V 100PPM/C SOT23 REF DE TENSION SHUNT 0.5% 1.2V 3SOT23 NTC THERMISTOR MODULE AJUSTABLE DC/DC 3.3/5VIN 3A 1W MODULE AJUSTABLE DC/DC 14VIN 16A 1.5% SUPERVISEUR ACTIF FAIBLE 4VTH 5SC70 BUCK 6VIN 1.2A 1.25MHZ 10SON BUCK 40VIN 52KHZ 1A 5V 5TO220 CHRGR LI-ION LI-POL 4.2V 0.75A 10SON REF TENSION SHUNT 3V 1% 150PPM/C 5SC70 ADPTR JTAG,0.1´´ 20PIN - 10PIN 0.05´´ ADPTR JTAG SWD OPENOCD CROSSWORKS DEBOGUEUR JTAG USB ARM OPENOCD CARTE AVR CAN EMBASE W/ ICSP & JTAG PROG AVR STK500 V2 W/ ISP PDI TPI SBC LINUX I.MX233 ARM926J MEMORY SDCARD PRELOADED LINUX CARTE DEV ARM LPC1227 CORTEX-M0 CARTE TRANSCEIVER CC430F5137 CARTE DEV EMBASE SAM3 CORTEX-M3 CARTE DEV SAM3 CORTEX-M3 CARTE DEV EMBASE SAM7 ARM7TDMI-S ELECTRODES PASSIVE ECG/EMG SHIELD CABLE SERIE CONSOLE POUR OLINUXINO DEBOGUEUR PROG/ EMULATEUR POUR MSP430 DEBOGUEUR PROG JTAG POUR MSP430F CONTACT,SOCKET,26-24AWG,CRIMP CAPACITOR TANT,22UF,10V,6032-28 10% POTENTIOMETER,ROTARY,100KOHM,2W,10% CAPACITOR CERAMIC 0.22UF,50V,X7R,10%,RAD IC,SINGLE NAND GATE,2I/P,SOT-23-5 IC,MONO MULTIVIBRATOR,100NS,DIP-16 RESISTOR,THICK FILM,33 OHM,100mW,1% CARTE D´EVALUATION BQ20Z45 BATTERIE MGMT CARTE D´EVALUATION TPS54331 DC/DC REG PLUG RJ45 MODULAR ETHERNET INDUSTRIAL IC,32-BIT MCU,ARM CORTEX PMIC 5S 6LDO BST 10BTADC PLUG BNC STR 50OHM CRIMP CAP SMA JACK WITH CHAIN CAP SMA JACK PLUG BNC STR 50OHM CRIMP JACK BNC STR 50OHM SOLDER PLUG TNC STR 50OHM CRIMP JACK SMA R/A 50OHM SOLDER JACK SMA R/A 50OHM SOLDER JACK SMB STR 50OHM SOLDER JACK SMA STR 50OHM SOLDER JACK BNC STR 75OHM SOLDER JACK SMA STR 50OHM SOLDER JACK SMA STR 50OHM CRIMP ALIMENTATION DC PROG 36V 6A 200W ALIMENTATION DC PROG 36V 12A 400W ALIMENTATION DC PROG 20V 10A 200W ALIMENTATION DC PROG 60V 3.5A 200W ALIMENTATION DC PROG 60V 7A 400W SYSTEME BLUETOOTH WATCH AVEC AFFICHEUR PACK CABLE ET ACCESSOIRE (HDMI) PACK CABLE ET ACCESSOIRE (DVI) PACK CABLE ET ACCESSOIRE (VGA) ADAPTATEUR M25 POUR PLUGS / COUPLERS ADAPTATEUR M32 POUR PLUGS / COUPLERS INSERT MALE 16P+E 16A 500V INSERT MALE 6P+E 35A 415V INSERT MALE 4P+E 80A 690V INSERT FEMELLE 4P+E 80A 690V INSERT MALE 4P+E 80A 415V INSERT FEMELLE 4P+E 80A 415V COUPLEUR ENTREE PAR LE HAUT M25 LOGEMENT MONTAGE PANNEAU AVEC CAPOT EMBASE CMS M20 EMBASE CMS M20 AVEC CAPOT CAPOT AVEC CROCHET CAPOT AVEC LEVIER HOOD TOP ENTRY M20 COUPLEUR ENTREE PAR LE HAUT M25 CAPOT ENTREE LATERALE M20 LOGEMENT MONTAGE PANNEAU LOGEMENT MONTAGE PANNEAU AVEC CAPOT EMBASE CMS M20 EMBASE CMS M20 AVEC CAPOT CAPOT AVEC CROCHET CAPOT AVEC LEVIER HOOD TOP ENTRY M25 COUPLEUR ENTREE PAR LE HAUT M32 LOGEMENT MONTAGE PANNEAU AVEC CAPOT EMBASE CMS M25 EMBASE CMS M25 AVEC CAPOT CAPOT AVEC CROCHET CAPOT AVEC LEVIER HOOD TOP ENTRY M25 HOOD TOP ENTRY M32 CAPOT ENTREE LATERALE M25 CAPOT ENTREE LATERALE M32 LOGEMENT MONTAGE PANNEAU LOGEMENT MONTAGE PANNEAU AVEC CAPOT EMBASE CMS M25 EMBASE CMS M32 AVEC CAPOT CAPOT AVEC CROCHET CAPOT AVEC LEVIER HOOD TOP ENTRY M20 COUPLEUR ENTREE PAR LE HAUT M25 EMBASE CMS M20 CAPOT AVEC CROCHET CAPOT AVEC LEVIERS HOOD TOP ENTRY M25 COUPLEUR ENTREE PAR LE HAUT M25 LOGEMENT MONTAGE PANNEAU CAPOT AVEC CROCHET CAPOT AVEC LEVIERS HOOD TOP ENTRY M25 HOOD TOP ENTRY M32 COUPLEUR ENTREE PAR LE HAUT M32 CAPOT ENTREE LATERALE M32 EMBASE CMS M25 EMBASE CMS M32 CAPOT AVEC CROCHET CAPOT AVEC LEVIERS PLUG & SOCKET CONNECTOR,RCPT,6POS,3MM M6 CAGE NUTS AND BOLTS,RECTANGULAR HOLES FRAME JOINING KIT,STEEL,PROLINE FRAMES CABLE TIES FUSE,SMD,125mA,1206,FAST ACTING 38999S3 C/C ENVR EMI STRT CAD 12P6351 FAN FILTER AND FINGER GUARD KIT CLAMP KIT,STAINLESS STEEL,JUNCTION BOX SPRING CONTACT PROBE,PCB EXHAUST GRILLE KIT CABLE TIES CIRCULAR CONNECTOR RCPT SIZE 16,19POS,PANEL LAMP,INCANDESCENT,130V,20W CONTACT AUX. 2N0+2NC RESISTOR,THICK FILM,10KOHM,62.5mW,1% GROUND BUSS BAR,12POS CABLE TIES CABLE TIES DIAC,28V to 36V,DO-35 IC TERMINAL BLOCK,DIN RAIL,2POS,22-12AWG MODULE D´EVAL ADS5474 CONVER A/N 14 BITS MODULE D´EVAL TPS2458 PUISSANCE RAIL MODULE D´EVAL TPS62090 STEP DOWN CNVTR MODULE D´EVAL TPS62125 BUCK CONVERTOR Computer Keyboard Number of Keys:83 LIGHT TOWER,24V,53mA,1.3W,RED,GREEN CABLE TIES BOARD-BOARD CONN,HEADER,40WAY,1ROW IC,32BIT MCU,ARM CORTEXM4,168MHz,176 CLAMPE GROUNDING PLASTIC 3MM CLAMPE GROUNDING PLASTIC 3.5MM CLAMPE GROUNDING PLASTIC 8.3MM CLAMPE GROUNDING PLASTIC 9MM CLAMPE GROUNDING PLASTIC 12.8MM CLAMPE GROUNDING PLASTIC 15.5MM CLAMPE GROUNDING PLASTIC 17MM RESISTANCE 20 K THICK FILM 30W RESISTANCE 200R THICK FILM 30W RESISTANCE 20R THICK FILM 30W RESISTANCE 25R THICK FILM 30W RESISTANCE 2R THICK FILM 30W RESISTANCE 0.01R THICK FILM 20W N CHANNEL MOSFET,200V,9A,TO-220 IC,4BIT BUS TRANSCEIVER,QFN-16 COMMUTATEUR LIMIT BROCHE 1NC1NC 1MTR COMMUTATEUR LIMIT ROLLER 1NC1NO COMMUTATEUR LIMIT TOP RLR 3MTR COMMUTATEUR LIMIT ROLLER PLONGEUR COMMUTATEUR LIMIT 90DEG ROTATED 3MTR COMMUTATEUR LIMIT WOBBLE STICK 1NC-1NO COMMUTATEUR LIMIT ENCLOSED COMMUTATEUR COMMUTATEUR LIMIT ROLLER ARM 1NC-1NO COMMUTATEUR LIMIT TOP PLONGEUR 1NC-1NO COMMUT LIMIT GLS LATERAL ROT 1NC-1NO COMMUTATEUR LIMIT TOP ROLL 1NC-1NO GOLD COMMUTATEUR LIMIT TOPROLL ARM 2NC-2NO COMMUTATEUR LIMIT MINI METAL 1NC1NO COMMUTATEUR LIMIT MINI METAL LATERAL 2NC COMMUTATEUR LIMIT MINI GOLD CONT LATERAL COMMUTATEUR LIMIT MINI METAL LATERAL RTY COMMUT LIMIT MINI METAL AJUSTABLEUST COMMUTATEUR LIMIT MINI TOP ROLLER PLGR COMMUTATEUR LIMIT MINI AJUSTABLE 1NC-1NO COMMUTATEUR LIMIT MINI PLASTIC ROTERY COMMUTATEUR LIMIT 3COND RTRY 2NC-2NO COMMUTATEUR LIMIT TOP ROLLER 2NC-2NO ANTENNE 2.2DBI FIXE ANTENNE 2.2DBI TILT/ROTAT ANTENNE 3DBI 3M ADHESIVE ANTENNE 3DBI 4.5M ANTENNE 5DBI 4.5M CONTROLEUR SANS FIL RAIL DIN SOLDER TOOL PIPEMASTER UK PLUG KIT SOLDERING IRON + DMM UK PLUG KIT SOLDERING IRON + DMM EU PLUG BUCK 36VIN 0.8A WATCHDOG 24TSSOP BUCK 36VIN 0.8A WATCHDOG 24TSSOP BUCK 36VIN 0.8A WATCHDOG 24TSSOP BUCK 36VIN 0.8A WATCHDOG 24QFN DRIVER LED 16CH 55VIN 0.05A 40QFN BUCK 38VIN 2MHZ 1.2A AJUSTABLE 16TSSOP BUCK 38VIN 2MHZ 1.2A AJUSTABLE 16TSSOP BUCK 62VIN 2.2MHZ 0.35A 3.3V 16MSOP BUCK 62VIN 2.2MHZ 0.35A 5V 16MSOP BUCK 62VIN 2.2MHZ 0.35A AJUSTABLE 16MSOP BUCK 62VIN 2.2MHZ 0.35A 3.3V 16MSOP BUCK 62VIN 2.2MHZ 0.35A 5V 16MSOP BUCK 62VIN 2.2MHZ 0.35A 3.3V 16MSOP BUCK 62VIN 2.2MHZ 0.35A 5V 16MSOP ADC 5V 16 BITS 2.5MSPS 48LQFP ADC 5V 16 BITS 2.5MSPS 48QFN ADC 5V 16 BITS 2.5MSPS 48LQFP ADC 5V 16 BITS 2.5MSPS 48QFN BOOST 0.5VIN SORTIE SELECT 12DFN BOOST 0.5VIN SORTIE SELECT 16SSOP BUCK 20VIN 2.5A 3MHZ AJUSTABLE 20QFN BUCK 20VIN 2.5A 3MHZ AJUSTABLE 20QFN AMPLI DIFF DRIVER ADC 180MHZ 8DFN BUCK 36VIN 1MHZ 5A AJUSTABLE 81LGA ADC 14 BITS 125MSPS 221BGA QUAD COIL V STEP-UP 50MH +/-35% 1.4MA COIL V STEP-UP 25MH +/-40% 10MA COIL V STEP-UP 0.56MH +/-10% 50MA COIL V STEP-UP 0.68MH +/-10% 40MA COIL V STEP-UP 0.33MH +/-10% 60MA COIL V STEP-UP 2.0MH +/-10% 20MA BATTERIE CORDON ACID 12V 0.8AH KIT RF TRANSCEIVER BOOSTERPACK COIL FORMER FOR B65517 N CH MOSFET,25V,750mA,SOT-323 RESET TIMER,60HZ,120VAC,0.5S RHEOSTAT BOBINE 15OHM 150W RHEOSTAT BOBINE 500OHM 50W RHEOSTAT BOBINE 1KOHM 50W RHEOSTAT BOBINE 75OHM 25W RHEOSTAT BOBINE 5KOHM 25W RHEOSTAT BOBINE 50OHM 25W RHEOSTAT BOBINE 125OHM 25W RHEOSTAT BOBINE 10KOHM 25W RHEOSTAT BOBINE 100OHM 25W RESISTANCE CARBON 2.2KOHM 500MW 5% RESISTANCE CARBON 1.5KOHM 500MW 5% RESISTANCE CARBON 10KOHM 500MW 5% RESISTANCE CARBON 1KOHM 500MW 5% RESISTANCE CARBON 100OHM 500MW 5% RESISTANCE CARBON 10OHM 500MW 5% RESISTANCE CARBON 4.7KOHM 250MW 5% RESISTANCE CARBON 470OHM 250MW 5% RESISTANCE CARBON 2.2KOHM 250MW 5% RESISTANCE CARBON 120OHM 250MW 5% RESISTANCE CARBON 100KOHM 250MW 5% RESISTANCE CARBON 10KOHM 250MW 5% RESISTANCE CARBON 1KOHM 250MW 5% RESISTANCE CARBON 100OHM 250MW 5% RESISTANCE THICK FILM 0.1GOHM 250MW 1% RESISTANCE PUISSANCE 5KOHM 50W 5% RESISTANCE PUISSANCE 1OHM 50W 5% RESISTANCE PUISSANCE 1KOHM 50W 5% RESISTANCE PUISSANCE 150OHM 50W 5% RESISTANCE PUISSANCE 500OHM 25W 5% RESISTANCE PUISSANCE 2KOHM 25W 5% RESISTANCE PUISSANCE 25OHM 25W 5% RESISTANCE PUISSANCE 20KOHM 25W 5% RESISTANCE PUISSANCE 100OHM 25W 5% RESISTANCE PUISSANCE 50OHM 225W 5% RESISTANCE PUISSANCE 2KOHM 225W 5% RESISTANCE PUISSANCE 250OHM 225W 5% RESISTANCE PUISSANCE 1KOHM 225W 5% RESISTANCE PUISSANCE 150OHM 225W 5% RESISTANCE PUISSANCE 100OHM 12W 5% RESISTANCE PUISSANCE 1KOHM 100W 5% RESISTANCE PUISSANCE 10OHM 100W 5% RESISTANCE PUISSANCE 100OHM 100W 5% RESISTANCE BOBINEE 2OHM 50W 10% RESISTANCE BOBINEE 1OHM 50W 10% RESISTANCE BOBINEE 5KOHM 25W 10% RESISTANCE BOBINEE 50OHM 225W 10% RESISTANCE BOBINEE 500OHM 225W 10% RESISTANCE BOBINEE 250OHM 225W 10% RESISTANCE BOBINEE 100OHM 225W 10% RESISTANCE BOBINEE 10OHM 100W 10% RESISTANCE PUISSANCE 0.5OHM 300W 10% RESISTANCE PUISSANCE 2OHM 300W 10% COMMUTATEUR ROTATIF TAP SP12T 30A 300V RESISTANCE BOBINEE 2KOHM 5W 5% RESISTANCE BOBINEE 100OHM 5W 5% RESISTANCE BOBINEE 120OHM 3W 5% RESISTANCE BOBINEE 2KOHM 10W 5% RESISTANCE BOBINEE 10OHM 10W 5% THRU-BOLT 200/210/270 MONTAGE SUPPORT 200/210/270 MONTAGE SUPPORT 210/270 MONTAGE SUPPORT 200/210/270 POINTER BAR KNOB 6.35MM KNOB HAND WHEEL POINTER KNOB 9.525MM KNOB PLATE DIAL ALUMINUM NOIR PANEL MOUNT INDICATOR,LED,7.2MM,RED,6V RESET TIMER,0.6MIN TO 60MIN,60HZ,120VAC RESET TIMER,60HZ,120VAC,1MS RESET TIMER,60HZ,120VAC,1MS RESET TIMER,60HZ,120VAC,1MS RESET TIMER,60HZ,120VAC,1MS RESET TIMER,60HZ,120VAC,0.5S ELECTRIC TIMER,80.95MM RESET TIMER,60HZ,120VAC,0.5S RATE METER,6-DIGIT,90VAC TO 264VAC ELECTRIC TIMER,80.95MM IC,NON INVERTING BUS TXRX,QFN-24 CAPTEUR PRESSION GAGE 15 PSI SMT CAPTEUR PRESSION GAGE 30 PSI SMT CAPTEUR PRESSION GAGE 30 PSI SMT CAPTEUR PRESSION GAGE 60 PSI SMT CAPTEUR PRESSION GAGE 100PSI SMT CAPTEUR PRESSION ABS 15 PSI SMT CAPTEUR PRESSION ABS 30 PSI SMT CAPTEUR PRESSION GAGE 30 PSI SMT CAPTEUR PRESSION GAGE 60 PSI SMT CAPTEUR PRESSION ABS 15 PSI SMT CAPTEUR PRESSION GAGE 15 PSI DIP CAPTEUR PRESSION GAGE 30 PSI DIP CAPTEUR PRESSION GAGE 150PSI DIP CAPTEUR PRESSION ABS 15 PSI DIP CAPTEUR PRESSION ABS 30 PSI DIP CAPTEUR PRESSION ABS 150PSI DIP CAPTEUR PRESSION GAGE 100PSI CAPTEUR PRESSION GAGE 250PSI CAPTEUR PRESSION GAGE 500PSI CAPTEUR PRESSION GAGE 100PSI CAPTEUR PRESSION ABS 250PSI CAPTEUR PRESSION GAGE 500PSI CAPTEUR PRESSION ABS 100PSI CAPTEUR PRESSION GAGE 250PSI CAPTEUR PRESSION GAGE 500PSI CAPTEUR PRESSION ABS 100PSI CAPTEUR PRESSION GAGE 250PSI CAPTEUR PRESSION GAGE 500PSI CAPTEUR PRESSION ABS 100PSI CAPTEUR PRESSION GAGE 250PSI CAPTEUR PRESSION GAGE 500PSI CAPTEUR PRESSION GAGE 100PSI CAPTEUR PRESSION GAGE 250PSI CAPTEUR PRESSION GAGE 500PSI CAPTEUR PRESSION ABS 250PSI CAPTEUR PRESSION GAGE 500PSI KIT DE DEV TMP006 430BOOST MODULE D´EVAL SANS FIL PUISSANCE TX MODULE D´EVAL SANS FIL PUISSANCE RX MICRO 32 BITS 1MB FLASH 256LBGA KIT DISCAPOTY VALEUR LINE STM8S IC 8BIT SIPO/SISO SHIFT REGISTER TSSOP16 IC,RF LOG DET,100kHz to 2.5GHz,MSOP-8 THREADED STRIP,HORIZONTAL RAILS IC,HEX INVERTER,SCHMITT TRIGGER SOIC14 RF JFET,N CH,30V,135MA,3-SOT-23 COIL FORMER FOR B65541 INRUSH CURRENT LIMITER LENS,RECTANGULAR,WHITE WIRE-TO-BOARD HOUSING,RECEPTACLE,20POS SSR,DIN RAIL MOUNT,280VAC,32VDC,10A RESISTOR,THICK FILM,15KOHM,62.5mW,1% CAPACITOR CERAMIC,0.1UF,25V,X7R,10%,0603 IC,1:2 QUAD FET MUX/DEMUX,TSSOP-16 TRANSDUCTEUR LINEAIR CABLE 25 POUCES H4 HEADGEAR W/ WP96 FACESHIELD TESTEUR TORQUE VERS 5NM MAG LAMPE LED ULTRA SLIM UK PLUG PSU,AC/DC,SWITCH MODE,48V BIPOLAR TRANSISTOR,NPN,100V RESISTOR,THICK FILM,470 OHM,100mW,1% FAST RECOVERY DIODE,8A,1.2KV DPAK LED SUBMINATURE H-RED LED SUBMINATURE ROUGE YOKE CORDON LED SUBMINATURE VERT YOKE CORDON LED SUBMINATURE H-ROUGE YOKE CORDON LED SUBMINATURE ROUGE Z-BEND CORDON LED SUBMINATURE VERT Z-BEND CORDON LED SUBMINATURE JAUNE Z-BEND CORDON LED 20MM ROUGE 12 PINS LED 20MM JAUNE 12 PINS LED 20MM ROUGE 12 PINS LED 20MM JAUNE 12 PINS LED 20MM H-ROUGE 12 PINS LED,DISPLAY,0.52 LED,DISPLAY,0.52 LED,DISPLAY,0.52 LED,DISPLAY,0.52 LED,DISPLAY,0.52 LED,DISPLAY,0.52 LED CMS 1104 ANGLE DROIT RED LED CMS 1104 ANGLE DROIT VERT LED CMS 1104 ANGLE DROIT JAUNE LED CMS 1104 ANGLE DROIT BLEU LED CMS 1104 ANGLE DROIT VERT LED LIGHT BAR 5 X 22MM VERT LED LIGHT BAR 5 X 22MM JAUNE LED LIGHT BAR 10 X 10MM RED LED LIGHT BAR 10 X 10MM VERT LED LIGHT BAR 10 X 10MM JAUNE LED LIGHT BAR 10 X 16MM RED LED LIGHT BAR 10 X 16MM VERT LED LIGHT BAR 10 X 16MM JAUNE LED LIGHT BAR 10 X 22MM RED LED LIGHT BAR 10 X 22MM VERT LED LIGHT BAR 10 X 22MM JAUNE LED CMS DOME-LENTILLE ORANGE LED CMS DOME-LENTILLE JAUNE LED CMS DOME-LENTILLE JAUNE+VERT LED CMS DOME-LENTILLE JAUNE+VERT LED,SMD,2.8 X 0.8MM,SIDE-VIEW,GRN LED CMS 2.8 X 0.8MM LATERAL-VIEW BLEU LED CMS SOT-23 RED+VERT COMM.ANODE LED CMS SOT-23 RED+VERT COMM.ANODE ZENER DIODE,500mW,6.8V,DO-35 IC,1BIT FET BUS SWITCH,SOT-23-5 KIT DE DEV PIC10F32X MICROCONTROLEUR 8BIT 3.5KB FLASH 28QFN MICROCONTROLEUR 8BIT 3.5KB FLASH 28UQFN MICROCONTROLEUR 8BIT 3.5KB FLASH 28SSOP OSCILLOSCOPE PC 2 VOIES 40MHZ OSCILLOSCOPE PC 2 VOIES 60MHZ OSCILLOSCOPE PC 2 VOIES 100MHZ OSCILLOSCOPE PC 4 VOIES 60MHZ AFG OSCILLOSCOPE PC 2 VOIES 60MHZ AFG CAPACITOR CERAMIC,0.1UF,50V,X7R,10%,0603 ZENER DIODE,500mW,7.5V,DO-35 GENERATEUR DE FONCTION DDS 8MHZ KIT MARQUEUR DE CABLE STANDARD KIT MARQUEUR DE CABLE PREMIUM MARQUEUR DE CABLE VERT 0 PQT 10 MARQUEUR DE CABLE VERT 1 PQT 10 MARQUEUR DE CABLE VERT 2 PQT 10 MARQUEUR DE CABLE VERT 3 PQT 10 MARQUEUR DE CABLE VERT 4 PQT 10 MARQUEUR DE CABLE VERT 5 PQT 10 MARQUEUR DE CABLE VERT 6 PQT 10 MARQUEUR DE CABLE VERT 7 PQT 10 MARQUEUR DE CABLE VERT 8 PQT 10 MARQUEUR DE CABLE VERT 9 PQT 10 MARQUEUR DE CABLE VERT A PQT 10 MARQUEUR DE CABLE VERT B PQT 10 MARQUEUR DE CABLE VERT C PQT 10 MARQUEUR DE CABLE VERT D PQT 10 MARQUEUR DE CABLE VERT E PQT 10 MARQUEUR DE CABLE VERT F PQT 10 MARQUEUR DE CABLE VERT G PQT 10 MARQUEUR DE CABLE VERT H PQT 10 MARQUEUR DE CABLE VERT I PQT 10 MARQUEUR DE CABLE VERT J PQT 10 MARQUEUR DE CABLE VERT K PQT 10 MARQUEUR DE CABLE VERT L PQT 10 MARQUEUR DE CABLE VERT M PQT 10 MARQUEUR DE CABLE VERT N PQT 10 MARQUEUR DE CABLE VERT O PQT 10 MARQUEUR DE CABLE VERT P PQT 10 MARQUEUR DE CABLE VERT Q PQT 10 MARQUEUR DE CABLE VERT R PQT 10 MARQUEUR DE CABLE VERT S PQT 10 MARQUEUR DE CABLE VERT T PQT 10 MARQUEUR DE CABLE VERT U PQT 10 MARQUEUR DE CABLE VERT V PQT 10 MARQUEUR DE CABLE VERT W PQT 10 MARQUEUR DE CABLE VERT X PQT 10 MARQUEUR DE CABLE VERT Y PQT 10 MARQUEUR DE CABLE VERT Z PQT 10 MARQUEUR DE CABLE VERT / PQT 10 MARQUEUR DE CABLE VERT EARTH PQT 10 MARQUEUR DE CABLE VERT - PQT 10 MARQUEUR DE CABLE VERT + PQT 10 MARQUEUR DE CABLE TRANSPARENT PQT 1000 MARQUEUR DE CABLE TRANSPARENT PQT 1000 MARQUEUR DE CABLE TRANSPARENT PQT 500 MARQUEUR DE CABLE TRANSPARENT PQT 200 MARQUEUR DE CABLE TRANSPARENT PQT 200 MARQUEUR DE CABLE TRANSPARENT PQT 50 MARQUEUR DE CABLE TRANSPARENT PQT 50 MARQUEUR DE CABLE TRANSPARENT PQT 50 MARQUEUR DE CABLE BLANC/CLAIR PQT 500 MARQUEUR DE CABLE BLANC/CLAIR PQT 500 MARQUEUR DE CABLE BLANC/CLAIR PQT 200 BROCHE TERMINALS ORANGE 20AWG PQT 200 BROCHE TERMINALS BLANC 18AWG PQT 200 BROCHE TERMINALS JAUNE 17AWG PQT 200 BROCHE TERMINALS BRANGEEN 7AWG PQT 100 BROCHE TERMINALS ROUGE 15AWG PQT 200 PIN TERMINALS,BLUE,14AWG,PK200 BROCHE TERMINALS GRIS 11AWG PQT 100 BROCHE TERMINALS VERT 9AWG PQT 100 DIODE TVS 30V 400W SMA DEVELOPMENT TOOL,CORTEX-M0,LPC11C14 BOARD,EVAL,SAM9G45,W/ 4.3IN LCD BOARD,SBC,DM3730,W/ 4.3IN LCD IC,DC-DC CONV,5A,75V,TO-220-5 IC,DC-DC CONV,2.5A,65V,TO-220-5 HAND CRIMP TOOL WIRE-BOARD CONNECTOR HEADER 2POS,3.96MM WIRE-BOARD CONN,RECEPTACLE,5POS,2MM IC,OP AMP,PRECISION,800KHZ,0.25V/µs,DIP-8 IC,COMP,OPEN COLLECTOR,SINGLE,150NS,DIP-8 IC,COMP,OPEN COLLECTOR,SINGLE,150NS,SOIC-8 IC,OP AMP,PRECISION,0.2V/µs,SOIC-8 IC,OP AMP,PRECISION,0.4V/µs,DIP-8 IC,OP AMP,PRECISION,0.4V/µs,DIP-8 IC,OP-AMP,50MHZ,300V/ us,SOIC-8 IC,LOGIC,NAND GATE,SINGLE,3.8NS,6-SOT-23 TRANSDUCTEUR DE COURANT 25A 5V TRANSDUCT DE COURANT 100A 4-20MA SORTIE TRANSDUCT DE COURANT 200A 10V SORTIE TRANSDUCT DE COURANT 200A 4-20MA SORTIE TRANSDUCT DE COURANT 300A 10V SORTIE TRANSDUCT DE COURANT 300A 4-20MA SORTIE TRANSDUCT DE COURANT 400A 10V SORTIE TRANSDUCTEUR DE COURANT 50A 12V TRANSDUCTEUR DE COURANT 200A PANEL TRANSDUCTEUR DE COURANT 100A PCB TRANSDUCTEUR DE COURANT 2000A PANEL TRANSDUCTEUR DE COURANT 200A PCB TRANSDUCTEUR DE COURANT 100A PANEL TRANSDUCTEUR DE COURANT 500A PANEL TRANSDUCTEUR DE COURANT 6A 5V TRANSDUCT DE COURANT 200A AC 10V SORTIE TRANSDUCTEUR DE COURANT 200A AC 4-20MA TRANSDUCT DE COURANT 200A AC 10V SORTIE TRANSDUCTEUR DE COURANT 200A AC 4-20MA TRANSDUCT COURANT 5A AC 4-20MA SORTIE TRANSDUCT COURANT 5A AC 4-20MA SORTIE TRANSDUCT DE COURANT 50A AC 10V SORTIE TRANSDUCT COURANT 50A AC 4-20MA SORTIE TRANSDUCT DE COURANT 50A AC 10V SORTIE TRANSDUCT COURANT 50A AC 4-20MA SORTIE TRANSDUCTEUR DE COURANT 200A AC 4-20MA TRANSDUCTEUR DE COURANT 200A AC 4-20MA TRANSDUCT COURANT 5A AC 4-20MA SORTIE TRANSDUCT COURANT 5A AC 4-20MA SORTIE TRANSDUCT COURANT 50A AC 4-20MA SORTIE TRANSDUCT DE COURANT 100A AC 10V SORTIE TRANSDUCTEUR DE COURANT 100A AC 4-20MA TRANSDUCT DE COURANT 200A AC 10V SORTIE TRANSDUCTEUR DE COURANT 200A AC 4-20MA TRANSDUCT DE COURANT 10/25/50A AC 4-20 TRANSDUCT DE COURANT 100A AC 10V SORTIE TRANSDUCT DE COURANT 200A AC 10V SORTIE TRANSDUCT DE COURANT 10/25/50A AC 10V KIT DE DEV PICCOLO F28035 COMMUTATEUR ILLUMINATED TACT VERT COMMUTATEUR ILLUMINATED TACT RED COMMUTATEUR ILLUMINATED TACT VERT COMMUTATEUR ROUND ILLUM DOT JAUNE COMMUTATEUR ROUND ILLUM DOT BLEU FUSE HOLDER,5 X 20MM,MODULE COMMUTATEUR CARREE BLANC COMMUT BOUTON POUSSOIR ON-MOM ROUGE LED COMMUT BOUTON POUSSOIR ON-MOM ROUGE LED COMMUT BOUTON POUSSOIR ON-MOM JAUNE LED COMMUT BOUTON POUSSOIR ON-MOM JAUNE LED COMMUT BOUTON POUSSOIR ON-MOM VERT LED COMMUT BOUTON POUSSOIR ON-MOM VERT LED COMMUT BOUTON POUSSOIR ON-MOM BLEU LED COMMUT BOUTON POUSSOIR ON-MOM BLEU LED COMMUT BOUTON POUSSOIR ON-ON ROUGE LED COMMUT BOUTON POUSSOIR ON-ON ROUGE LED COMMUT BOUTON POUSSOIR ON-ON JAUNE LED COMMUT BOUTON POUSSOIR ON-ON JAUNE LED COMMUT BOUTON POUSSOIR ON-ON VERT LED COMMUT BOUTON POUSSOIR ON-ON VERT LED COMMUT BOUTON POUSSOIR ON-ON BLEU LED COMMUT BOUTON POUSSOIR ON-ON BLEU LED COMMUT BOUTON POUSSOIR ON-MOM W/O LED COMMUT BOUTON POUSSOIR ON-MOM JAUNE LED COMMUT BOUTON POUSSOIR ON-MOM BLEU LED COMMUTATEUR TACT W/O LED BRUITLESS COMMUTATEUR TACT ILLUM ROUGE BRUITLESS COMMUTATEUR TACT ILLUM JAUNE BRUITLESS COMMUTATEUR TACT ILLUM VERT BRUITLESS COMMUTATEUR TACT ILLUM BLANC BRUITLESS COMMUTATEUR TACT ILLUM BLEU BRUITLESS COMMUTATEUR TACT W/O LED VERTICAL COMMUTATEUR TACT ILLUM ROUGE VERTICAL COMMUTATEUR TACT ILLUM JAUNE VERTICAL COMMUTATEUR TACT ILLUM VERT VERTICAL COMMUTATEUR TACT ILLUM BLANC VERTICAL COMMUTATEUR TACT ILLUM BLEU VERTICAL COMMUTATEUR TACT ILLUM ROUGE R/A COMMUTATEUR TACT ILLUM JAUNE R/A COMMUTATEUR TACT ILLUM VERT R/A COMMUTATEUR TACT ILLUM BLANC R/A COMMUTATEUR TACT ILLUM BLEU R/A SWITCH,TACT ILLUM RED,R/A,SMT COMMUTATEUR TACT ILLUM JAUNE R/A SMT COMMUTATEUR TACT ILLUM VERT R/A SMT COMMUTATEUR TACT ILLUM BLANC R/A SMT COMMUTATEUR TACT ILLUM BLEU R/A SMT PLUG WITH LOCK NUT 20 VOIES RECEPTACLE WITH SCREW 20 VOIES PLUG WITH LOCK NUT 120 VOIES RECEPTACLE WITH SCREW 120 VOIES INSERTION TOOL 516 SERIES NUT DRIVER POLARISING HARDWARE SCREWS/NUTS/WASHERS 20VOIES INSULATOR SCREW/NUT/WASHER 38/56VOIES INSULATOR IC,ADJ LDO REG,1.2V TO 5.5V,SOT-223-6 CHIP INDUCTOR 220NH 320MA 5% 950MHZ SINGLE BOARD COMPUTER,AT91SAM9261S PROCESSOR SUPPORT 40MM DIAM. SANS CAPOT ZHAGA SUPPORT 40MM DIAM. AVEC CAPOT ZHAGA SUPPORT 30X36MM DIAM. SANS CAPOT ZHAGA DAC,16BIT,SOT23-8 IC,LOGIC,NAND GATE,SINGLE,3.8NS,6-SC-70 CAPACITOR CERAMIC 0.047UF 50V,X7R,10%,0603 MODULE RF DONGLE CONNECT 2 PI MODULE EASYRADIO ARDUINO SHIELD KIT DE DEV EASYRADIO TRANSCEIVER DIODE TVS DEUX DIR 58V 10KA AXIAL DIODE TVS DEUX DIR 76V 10KA AXIAL DIODE TVS DEUX DIR 170V 10KA AXIAL DIODE TVS DEUX DIR 320V 10KA AXIAL DIODE TVS DEUX DIR 380V 10KA AXIAL DIODE TVS DEUX DIR 470V 10KA AXIAL DIODE TVS DEUX DIR 380V 6KA AXIAL DIODE TVS DEUX DIR 430V 6KA AXIAL DIODE TVS DEUX DIR 380V 3KA AXIAL DIODE TVS DEUX DIR 430V 3KA AXIAL EVAL KIT,AM3359,W/ 4.3IN LCD GYROSCOPE 3AXES +/-450DPS 24QFN BUCK SYNCH 0.4A 1.2MHZ 1.2V CL2025 BUCK SYNCH 0.4A 1.2MHZ 1.8V CL2025 BUCK SYNCH 0.4A 1.2MHZ 2.5V CL2025 BUCK SYNCH 0.4A 1.2MHZ 3V CL2025 BUCK SYNCH 0.4A 1.2MHZ 3.3V CL2025 BUCK SYNCH 0.4A 1.2MHZ AJUSTABLE CL2025 IC,NON INVERTING BUFFER,DIP-20 KNOB JEU DE TOURNEVIS TORQUE LAME DE TOURNEVIS TORQUE SL 3.0 LAME DE TOURNEVIS TORQUE SL 3.5 LAME DE TOURNEVIS TORQUE SL 4.0 LAME DE TOURNEVIS TORQUE PZ1 LAME DE TOURNEVIS TORQUE PZ2 LAME DE TOURNEVIS TORQUE MOD1 LAME DE TOURNEVIS TORQUE MOD2 DETECTEUR DE TENSION SANS CONTACT WRENCH,BUSH,CONDUIT SCIE 300MM 12 BLADES,HACKSAW,12´´X18 TPI BLADES,HACKSAW,12´´X24 TPI BLADES,HACKSAW,12´´X32 TPI SUIVI DE CABLE AGRAPHES 7.5X11.1MM PQT 1000 STAPLES 7.5X14.2MM PQT 1000 SUIVI DE CABLE POUR CABLE TELECOM AGRAPHEUSE SRUBANS 10.5X8MM PQT 1000 AGRAPHES 10.5X12MM PQT 1000 AGRAPHES 10.5X14MM PQT 1000 MODULE INTERFACE EXPANSION POUR RPI BLADE DIAMOND 115MM BLADE DIAMOND 230MM KIT VISSEUSE ET EMBOUTS 10PC KIT TOOL SERVICE ENGINEER 91PC KIT TOOL ELECTRICIANS 96PC DRILL BODY ONLY ANGLE 18V GRINDER ANGLE BODY ONLY 18V SCIE CONNECT CIRCU BODY ONLY 18V JIGSCIE BODY ONLY 18V SCIE RECIPRO BODY ONLY 18V VACUUM BODY ONLY 18V DRILL ANGLE 10MM 240V DRILL ROTATIF 10MM 240V GRINDER ANGLE 125MM 240V BATTERIE NI-CAD 14.4V 1.3AH BATTERIE NI-NH 14.4V 2.6AH BATTERIE NI-MH 18V 3.0AH DRIVER DRILL 10.8V MESURE DE DISTANCE LASER DRILL SDS BODY ONLY 18V SET BIT PZ2 25PC DISC FLAP 115MM Z40G DRIVER DRILL 14.4V WITH TORCH DRILL SDS/HAMMER C/LESS 18V DRILL PERCUSSION 2 SPD 720W 110V GRINDER ANGLE CORDLESS 18V JIGSCIE CORDLESS 18V SCIE RECIPRO CORDLESS 18V SCIE CONNECT CIRCU C/LESS 18V SANDER PALM 1/4 SHEET 240V SANDER PALM 1/4 SHEET 110V SANDER 1/2 SHEET 240V SANDER 1/2 SHEET 110V PERCEUSE / VISSEUSE 50PC OUTIL MULTI 240V OUTIL MULTI 110V KIT MULTITOOL 240V 33PC KIT MULTITOOL 110V 33PC KIT MULTITOOL C/LESS 18V OUTIL MULTI BOD ONLY C/LESS 18V DRILL COMBI 10.8V 2 X BAT DRILL SDS LI-ION 18V BOD ONLY BATTERIE 24V 3.1AH 80610204341 3365/06 100 =6/CAB/TYP1/28AWG/STR/.050´´´´/100 01C2851 OP-AMP,50MHZ,18V/µs,200µV,SOIC-8 CRIMP TERMINAL,#6,BLOCK FORK,RED RESISTOR,BUS RES N/W 5,100KOHM,2%,SIP RESISTOR,BUS RES N/W 5,2KOHM,2%,SIP RESISTOR,BUS RES N/W 9,56KOHM,2%,SIP SPEED CONTROL HANDLE,VICES DUST COVER,RUBBER,BLACK LED BULB,EDISON SCREW/E26,COOL WHITE,6W LED BULB,EDISON SCREW/E26,WARM WHITE,6W LED BULB,EDISON SCREW/E26,COOL WHITE,6W LED BULB,EDISON SCREW/E26,COOL WHITE,10W LED BULB,EDISON SCREW/E26,WARM WHITE,10W LED BULB,EDISON SCREW/E26,COOL WHITE,10W LED BULB,EDISON SCREW/E26,COOL WHITE,15W LED BULB,EDISON SCREW/E26,WARM WHITE,15W LED BULB,EDISON SCREW/E26,COOL WHITE,15W CONNECTOR,HOUSING,RECEPTACLE,6POS CONNECTOR,HOUSING,RECEPTACLE,6POS CONNECTOR,HOUSING,RECEPTACLE,6POS CONNECTOR,HOUSING,PIN & SOCKET,TAB,2POS,3.5MM HEAT SINK,ALUMINIUM,BLK,TO-126,1 CLIP HEAT SINK,ALUMINIUM,DEGREASED,TO-126,1 CLIP HEAT SINK,ALUMINIUM,BLK,TO-126,2 CLIPS HEAT SINK,ALUMINIUM,DEGREASED,TO-126,2 CLIPS TERMINAL,FLAG,RCPT,6.35MM,CRIMP TERMINAL,FLAG,RCPT,6.35MM,CRIMP ASSEMBLY TOOL,SMART POSITION SENSOR ASSEMBLY TOOL,SMART POSITION SENSOR MAGNET COLLAR,SMART POSITION SENSOR SENSOR,POSITION,ROTARY,12-30VDC SENSOR,HUMIDITY/TEMPERATURE,DIGITAL,SIP-4 SENSOR,HUMIDITY/TEMPERATURE,DIGITAL,SIP-4 LTC2380-16,SAR ADC,16BIT,2MSPS,DEMO BOARD LTC2379-18,SAR ADC,18BIT,1.6MSPS,DEMO BOARD LTC2378-18,SAR ADC,18BIT,1MSPS,DEMO BOARD LTC2376-18,SAR ADC,18BIT,250KSPS,DEMO BOARD LTC2370-16,SAR ADC,16BIT,2MSPS,DEMO BOARD LTC2369-18,SAR ADC,18BIT,1.6MSPS,DEMO BOARD LTC2364-18,SAR ADC,18BIT,250KSPS,DEMO BOARD LTC2389-18,SAR ADC,18BIT,2.5MSPS,DEMO BOARD LTC2389-16,SAR ADC,16BIT,2.5MSPS,DEMO BOARD OP-AMP,30MHZ,18V/µs,273µV,VSSOP-8 CONNECTOR,SOCKET,2POS,1 ROW,2.54MM CONNECTOR,SOCKET,3POS,1 ROW,2.54MM CONNECTOR,SOCKET,4POS,1 ROW,2.54MM CONNECTOR,SOCKET,5POS,1 ROW,2.54MM CONNECTOR,SOCKET,6POS,1 ROW,2.54MM CONNECTOR,MICRO USB 2,RCPT,5POS,PCB CONNECTOR,MICRO USB 2,RCPT,5POS,PCB BENCH VICE,VERSATILE,73MM CAGE,1X1,BEHIND BEZEL,ZQSFP+ CAGE,1X1,BEHIND BEZEL W/ HEAT SINK,ZQSFP+ CAGE,1X3,BEHIND BEZEL,ZQSFP+ CAGE,1X3,BEHIND BEZEL W/ HEAT SINK,ZQSFP+ LED,WHITE,180MCD SWITCH ENCLOSURE SWITCH ENCLOSURE SWITCH ENCLOSURE IC,LDO VOLT REG,5V,0.1A,3-SOT-23 RESISTOR WIREWOUND,100 OHM,10W,5% ELECTRICAL AC ADAPTER,20A,125V CIRCULAR CONNECTOR,CABLE MOUNT RESISTOR,WIRE WOUND,200 OHM,1W,1% MODULE,SMARTWIRE-DT,FOR CONTACTORS MODULE,SMARTWIRE-DT,FOR CONTACTORS GATEWAY,24VDC,700mA GATEWAY,24VDC,700mA GATEWAY,24VDC,3A POWER FEED MODULE,24VDC,3A POWER FEED MODULE,24VDC,3A DIGITAL MODULE,24VDC,500mA ANALOGUE MODULE,10V,20mA ANALOGUE MODULE,10V,20mA DIGITAL MODULE,24VDC,4mA DIGITAL MODULE,24VDC,4mA DIGITAL MODULE,24VDC,4mA ANALOGUE MODULE,24VDC,4mA DIGITAL MODULE,24VDC,4mA ACTUATOR,FAK SERIES PALM SWITCH ACTUATOR,FAK SERIES PALM SWITCH ACTUATOR,FAK SERIES PALM SWITCH ENCLOSURE,SURFACE MOUNT,1HOLE ENCLOSURE,SURFACE MOUNT,4HOLE ADAPTER,FIXING,M22 SERIES FUNCTION ELEMENT PCB,M22 SERIES FUNCTION ELEMENT PCB,M22 SERIES FUNCTION ELEMENT PCB,M22 SERIES FUNCTION ELEMENT PCB,M22 SERIES FUNCTION ELEMENT PCB,M22 SERIES FUNCTION ELEMENT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,SPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT CONTACT BLOCK,DPDT,QUICK CONNECT SMARTWIRE-DT FUNCTION ELEMENT,FRONT FIXING SMARTWIRE-DT FUNCTION ELEMENT,FRONT FIXING SMARTWIRE-DT FUNCTION ELEMENT,FRONT FIXING SMARTWIRE-DT FUNCTION ELEMENT,FRONT FIXING SMARTWIRE-DT FUNCTION ELEMENT,BASE FIXING SMARTWIRE-DT FUNCTION ELEMENT,BASE FIXING SMARTWIRE-DT FUNCTION ELEMENT,BASE FIXING SMARTWIRE-DT FUNCTION ELEMENT,BASE FIXING UNIVERSAL SLAVE,FRONT FIXING UNIVERSAL SLAVE,BASE FIXING PCB JUMPER,CONTROL STATION SWDT CRIMP TOOL FOR DEVICE CONNECTOR 17W5710 SWDT CRIMP TOOL FOR FLAT PLUG 17W5711 NETWORK TERMINATOR CABLE JUMPER SWITCH CABINET BUSHING HOUSING BUSHING SOCKET ROUND CABLE CONNECTOR,RECEPTACLE,8 POS ROUND CABLE CONNECTOR,RECEPTACLE,8 POS SWITCH CABINET BUSHING HOUSING BUSHING SOCKET ROUND CABLE CONNECTOR,PLUG,8POS ROUND CABLE CONNECTOR,PLUG,8POS FLAT BAND CONDUCTOR,SMARTWIRE-DT DARWIN FLAT BAND CONDUCTOR,SMARTWIRE-DT DARWIN FLAT BAND CONDUCTOR,SMARTWIRE-DT DARWIN FLAT BAND CONDUCTOR,SMARTWIRE-DT DARWIN ROUND CABLE CONDUCTOR,SMARTWIRE-DT DARWIN CABLE ADAPTER,FLAT TO ROUND CABLE BLADE TERMINAL,8POS COUPLING,8POS EXTERNAL DEVICE PLUG,8POS CABLE SCREW GLAND,RMQ-TITAN CAPACITOR,ALUM ELECT,47UF,20%,50V,RADIAL CAPACITOR,ALUM ELECT,68UF,20%,50V,RADIAL CAPACITOR,ALUM ELECT,33UF,20%,63V,RADIAL CAPACITOR,ALUM ELECT,39UF,20%,63V,RADIAL CAPACITOR,ALUM ELECT,56UF,20%,63V,RADIAL CAPACITOR,ALUM ELECT,150UF,20%,35V,RADIAL CAPACITOR,ALUM ELECT,330UF,20%,10V,SMD CAPACITOR,ALUM ELECT,220UF,20%,16V,SMD CAPACITOR,ALUM ELECT,270UF,20%,16V,SMD CAPACITOR,ALUM ELECT,22UF,20%,25V,SMD CAPACITOR,ALUM ELECT,12UF,20%,50V,SMD CAPACITOR,ALUM ELECT,22UF,20%,50V,SMD CAPACITOR,ALUM ELECT,33UF,20%,50V,SMD CAPACITOR,ALUM ELECT,47UF,20%,50V,SMD CAPACITOR,ALUM ELECT,82UF,20%,50V,SMD CAPACITOR,ALUM ELECT,100UF,20%,16V,RADIAL CAPACITOR,ALUM ELECT,220UF,20%,2.5V,SMD CAPACITOR,ALUM ELECT,150UF,20%,4V,SMD CONVERTISSEUR DC/DC SIP4 3.3-3.3V CAPACITOR,ALUM ELECT,100UF,20%,6.3V,SMD CAPACITOR,ALUM ELECT,27UF,20%,16V,SMD CAPACITOR,ALUM ELECT,33UF,20%,16V,SMD CONVERTISSEUR DC/DC SIP4 3.3-5V CAPACITOR,ALUM ELECT,15UF,20%,25V,SMD CONVERTISSEUR DC/DC SIP4 3.3-9V CAPACITOR,ALUM ELECT,220UF,20%,2.5V,SMD CONVERTISSEUR DC/DC SIP4 3.3-12V CAPACITOR,ALUM ELECT,150UF,20%,4V,SMD CONVERTISSEUR DC/DC SIP4 3.3-15V CAPACITOR,ALUM ELECT,100UF,20%,6.3V,SMD CONVERTISSEUR DC/DC SIP4 5-3.3V CONVERTISSEUR DC/DC SIP4 5-5V CONVERTISSEUR DC/DC SIP4 5-9V CONVERTISSEUR DC/DC SIP4 5-12V CONVERTISSEUR DC/DC SIP4 5-15V CONVERTISSEUR DC/DC SIP4 12-5V CONVERTISSEUR DC/DC SIP4 12-9V CONVERTISSEUR DC/DC SIP4 12-12V CONVERTISSEUR DC/DC SIP4 12-15V CONVERTISSEUR DC/DC SIP4 15-5V CONVERTISSEUR DC/DC SIP4 15-9V CONVERTISSEUR DC/DC SIP4 15-12V CONVERTISSEUR DC/DC SIP4 15-15V CONVERTISSEUR DC/DC SIP4 24-5V CONVERTISSEUR DC/DC SIP4 24-9V CONVERTISSEUR DC/DC SIP4 24-12V CONVERTISSEUR DC/DC SIP4 24-15V CONVERTISSEUR DC/DC DIP4 3.3-3.3V CONVERTISSEUR DC/DC DIP4 3.3-5V CONVERTISSEUR DC/DC DIP4 3.3-9V CONVERTISSEUR DC/DC DIP4 3.3-12V CONVERTISSEUR DC/DC DIP4 3.3-15V CONVERTISSEUR DC/DC DIP4 5-3.3V CONVERTISSEUR DC/DC DIP4 5-5V CONVERTISSEUR DC/DC DIP4 5-9V CONVERTISSEUR DC/DC DIP4 5-12V CONVERTISSEUR DC/DC DIP4 5-15V CONVERTISSEUR DC/DC DIP4 12-5V CONVERTISSEUR DC/DC DIP4 12-9V CONVERTISSEUR DC/DC DIP4 12-12V CONVERTISSEUR DC/DC DIP4 12-15V CONVERTISSEUR DC/DC DIP4 15-5V CONVERTISSEUR DC/DC DIP4 15-9V CONVERTISSEUR DC/DC DIP4 15-12V CONVERTISSEUR DC/DC DIP4 15-15V CONVERTISSEUR DC/DC DIP4 24-5V CONVERTISSEUR DC/DC DIP4 24-9V CONVERTISSEUR DC/DC DIP4 24-12V CONVERTISSEUR DC/DC DIP4 24-15V RESISTOR THICK FILM,10 OHM,50mW,±5% SWITCH LENS OPTX Lens System CONTACT,SOCKET,20-17AWG,CRIMP VOLTAGE REGULATOR,BUCK,1MHZ,TO-PMOD-7 POWER SUPPLY,DC,18V,5A,90W CONTACT,PIN,20-18AWG,CRIMP CRIMP TERMINAL,#8,RING TONGUE RESISTOR THICK FILM,2KOHM,50mW,±5% CRIMP TERMINAL,6.35MM,FEMALE,YEL REPLACEMENT BULB FOR MAGNIFIER,9W MAGNIFIER LAMP,1.75x EXPANSION MODULE PLUG & SOCKET HOUSING,RECEPTACLE,6POS,4MM VOLTAGE REGULATOR,BUCK,500KHZ,SOIC-8 ELECTRICAL AC POWER CONNECTOR,60A,250V TRANSCEIVER,RS422/RS485,5V,SOIC-20 IC,LVDS BUFFER,LLP-8 IC,PRECISION COMP,SGL,120NS,SOT-23-6 VOLTAGE REGULATOR,BUCK,52KHZ,TO-263-5 IC,STEP-DOWN REGULATOR,TO-263-5 IC,PWM INVERTING SWITCHING REG,SOT23-5 IC,STEP-DOWN REGULATOR,TO-263-7 IC,NEG ADJ REG,-1.2V TO -37V,SOT223-3 IC,SHUNT V-REF,2.048V,2mV,3-SOT-23 IC,TEMPERATURE SENSOR,3°C,3-SOT-23 IC,OP-AMP,17MHZ,25V/ us,SOIC-14 IC MOTOR CTRL,BRUSHLESS SERVO,DIP-28 VOLTAGE DETECTOR / MICROPROCESSOR SUPERVISOR IC IC,ADJ LDO REG 1.24V TO 29V 0.1A 8-SOIC LINEAR VOLTAGE REGULATOR IC IC,LDO VOLT REG,5V,0.5A,N8-SOIC VOLTAGE DETECTOR / MICROPROCESSOR SUPERVISOR IC IC,LCD DRIVER,7SEG,10V,LCC-44 RESISTOR WIREWOUND,68 OHM,5W,5% RESISTOR,ISO RES N/W 8,22 OHM,0.02,DIL RESISTOR,ISO RES N/W 8,33 OHM,0.02,DIL RESISTOR,ISO RES N/W 8,4.7 OHM,0.02,DIL RESISTOR,ISO RES N/W 8,51 OHM,0.02,DIL CRIMP TERMINAL,#4,RING TONGUE,YEL CRIMP TERMINAL,6.35MM,MULTI STACK,BLU CRIMP TERMINAL,6.35MM,MULTI STACK,RED PROGRAMMABLE CONTROLLER STM32,ZIGBEE,GRAPHIC PANEL,JTAG,DEMO CIRCULAR CONNECTOR,RCPT,11-19,19POS,PANEL CIRCULAR CONNECTOR,PLUG,11-19,19POS,CABLE CIRCULAR CONNECTOR,PLUG,11-19,19POS,CABLE CIRCULAR CONNECTOR,PLUG,15-55,55POS,CABLE CIRCULAR CONNECTOR,PLUG,19-88,88POS,CABLE CIRCULAR CONNECTOR,PLUG,23-151,151POS,CABLE CIRCULAR CONNECTOR,PLUG,25-187,187POS,CABLE CIRCULAR CONNECTOR,PLUG,9-9,9POS,CABLE CIRCULAR CONNECTOR,PLUG,9-9,9POS,CABLE CIRCULAR CONNECTOR,RCPT,11-19,19POS,JAM NUT CONNECTOR,CIRCULAR,PLUG,19-18,AL CONNECTOR,CIRCULAR,PLUG,23-6,AL CIRCULAR CONTACT,QUADRAX,PIN,24AWG,CRIMP CIRCULAR CONTACT,QUADRAX,SOCKET,24AWG,CRIMP CIRCULAR CONTACT,DIF TWNAX,PIN,8,CRIMP CIRCULAR CONTACT,QUADRAX,PIN,24AWG,CRIMP CIRCULAR CONTACT,QUADRAX,SOCKET,24AWG,CRIMP RESISTOR,WIREWOUND,75 OHM,5W,1% RESISTOR,WIREWOUND,0.15 OHM,1W,1% RESISTOR,WIREWOUND,0.25 OHM,1W,1% RESISTOR,WIREWOUND,2KOHM,1W,1% RESISTOR WIREWOUND,20 OHM,1W,±1% RESISTOR WIREWOUND,220 OHM,1W,±1% RESISTOR WIREWOUND,25 OHM,1W,±1% RESISTOR WIREWOUND,3 OHM,1W,±1% RESISTOR WIREWOUND,300 OHM,1W,±1% RESISTOR WIREWOUND,40 OHM,1W,±1% RESISTOR WIREWOUND,400 OHM,1W,±1% RESISTOR WIREWOUND,510 OHM,1W,±1% RESISTOR WIREWOUND,60 OHM,1W,±1% RESISTOR,WIRE WOUND,0.33 OHM,1W,1% RESISTOR,WIRE WOUND,15 OHM,1W,1% RESISTOR,WIRE WOUND,4.02 OHM,1W,1% RESISTOR,WIRE WOUND,2 OHM,2W,1% MAGNIFYING LAMP,MIGHTY VUE,1.75X ADC,18BIT,1.6MSPS,MSOP-16 ADC,16BIT,2MSPS,MSOP-16 CONTACT,PIN,20-17AWG,CRIMP CONTACT,SOCKET,20-18AWG,CRIMP CAPACITOR CERAMIC 10PF,250V,U2J,10%,RAD CAPACITOR CERAMIC 150PF,250V,Y5S,10%,RAD CAPACITOR CERAMIC 33PF,250V,Y5S,10%,RAD CAPACITOR CERAMIC 47PF,250V,Y5S,10%,RAD CRIMP TERMINAL,BUTT SPLICE MOSFET,P CH,-20V,-3.9A,3-SOT-23 IC SOCKET,QFN TEST,16POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,24POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,28POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,40POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,40POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,48POS,0.4MM,THROUGH HOLE IC SOCKET,QFN,48POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,48POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,56POS,0.4MM,THROUGH HOLE IC SOCKET,QFN,60POS,0.4MM,THROUGH HOLE IC SOCKET,QFN,60POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,64POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,80POS,0.5MM,THROUGH HOLE IC SOCKET,QFN,88POS,0.4MM,THROUGH HOLE CONNECTOR,HOUSING,PIN & SOCKET,RCPT,2POS RESISTOR,WIRE WOUND,0.2 OHM,2W,1% CRIMP TERMINAL,4.7MM,MALE,RED ADC,16BIT,250KSPS,MSOP-16 ADC,16BIT,500KSPS,MSOP-16 ADC,16BIT,1MSPS,MSOP-16 ADC,18BIT,250KSPS,MSOP-16 ADC,18BIT,500KSPS,MSOP-16 ADC,18BIT,1MSPS,MSOP-16 IC,LDO VOLT REG,5V,0.8A,SOT-223-3 CDCLVC1104,CLOCK BUFFER,EVALUATION MODULE MAGNIFIER LAMP,1.75x,2.25x STRAIN RELIEF,SIZE 15,MICRO D CONNECTOR STRAIN RELIEF,SIZE 21,MICRO D CONNECTOR STRAIN RELIEF,SIZE 25,MICRO D CONNECTOR STRAIN RELIEF,SIZE 31,MICRO D CONNECTOR STRAIN RELIEF,SIZE 37,MICRO D CONNECTOR STRAIN RELIEF,SIZE 51,MICRO D CONNECTOR CRIMP TERMINAL,#4,RING TONGUE,RED CRIMP TERMINAL,4.7MM,FEMALE,RED CRIMP TERMINAL,6.35MM,FEMALE,RED CRIMP TERMINAL,BUTT SPLICE CRIMP TERMINAL,#10,RING TONGUE,RED CAPACITOR CERAMIC 100PF 50V,C0G,5%,08 EVAL KIT,CC3000 FRAM,LSR MODULE MAGNIFIER LAMP,1.75x,2.25x LED BULB,GU10,COOL WHITE,4W,50mm LED BULB,GU5.3,WARM WHITE,5W LED BULB,GU5.3,COOL WHITE,5W LED BULB,EDISON SCREW/E26,WARM WHITE,4W LED BULB,EDISON SCREW/E26,COOL WHITE,4W LED BULB,EDISON SCREW/E26,COOL WHITE,4W LED BULB,GU10,WARM WHITE,4W,50mm LED BULB,GU10,COOL WHITE,4W,50mm LED BULB,GU5.3,WARM WHITE,5W LED BULB,GU5.3,COOL WHITE,5W LED BULB,EDISON SCREW/E26,WARM WHITE,4W LED BULB,EDISON SCREW/E26,WARM WHITE,6W LED BULB,EDISON SCREW/E26,WARM WHITE,10W LED BULB,EDISON SCREW/E26,WARM WHITE,15W LED BULB,EDISON SCREW/E26,WARM WHITE,7W LED BULB,EDISON SCREW/E26,WARM WHITE, PROGRAMMABLE LOGIC CONTROLLER PHOTOSWITCH,BGA,300MM,NPN PHOTOSWITCH,BGA,300MM,PNP PHOTOSWITCH,RETROREFLECTIVE,10M,NPN PHOTOSWITCH,RETROREFLECTIVE,10M,PNP PHOTOSWITCH,THROUGH BEAM,30M,NPN PHOTOSWITCH,THROUGH BEAM,30M,PNP IC,32BIT MPU,SITARA,720MHZ,324-BGA INLINE CIR RCPT,PUSH-PUL,SZ 8,19 POS,CABLE SWITCH,ROCKER,DPST,10A,250VAC,BLACK SWITCH,ROCKER,SPST,20A,250VAC,BLACK SWITCH,ROCKER,DPST,20A,250VAC,BLACK SWITCH,ROCKER,DPST,20A,250VAC,BLACK SWITCH,ROCKER,DPST,20A,250VAC,BLACK SWITCH,ROCKER,DPST,20A,250VAC,BLACK SWITCH,ROCKER,DPST,20A,250VAC,BLACK SWITCH,ROCKER,DPST,20A,250VAC,RED SWITCH,ROCKER,SPST,16A,250VAC,BLACK SWITCH,ROCKER,SPDT,16A,250VAC,BLACK SWITCH,ROCKER,SPDT,16A,250VAC,BLACK SWITCH,ROCKER,SPDT,16A,250VAC,BLACK SWITCH,ROCKER,SPDT,16A,250VAC,BLACK SWITCH,ROCKER,DPDT,16A,250VAC,BLACK SWITCH,ROCKER,DPDT,16A,250VAC,BLACK SWITCH,TOGGLE,SPST,20A,250VAC SWITCH,TOGGLE,SPST,20A,277VAC SWITCH,ROCKER,DPST,20A,277VAC,BLACK SWITCH,PUSHBUTTON,SPST-NO,16A,250VAC SWITCH,PUSHBUTTON,SPST-NO,16A,250VAC SWITCH,ROCKER,SPST,5A,250VAC,WHITE SWITCH,PUSHBUTTON,DPST,15A,250VAC SWITCH,ROCKER,SPST,16A,250VAC,BLACK SWITCH,ROCKER,SPST,16A,250VAC,BLACK LAMP HOLDER,BI PIN,T-1 3/4,LED´S LAMP HOLDER,BI PIN,T-1 3/4,LED´S SEALING BOOT,1700 & 1750 TOGGLE SWITCHES INDICATOR LIGHT,NEON LAMPS SWITCH,ROCKER,SPST,10A,125VAC,BLACK SWITCH,TOGGLE,SPST,20A,277VAC GUARD,3900 METAL TOGGLE SWITCHES SWITCH,PUSHBUTTON,SPDT,16A,250VAC SWITCH,PUSHBUTTON,SPDT,16A,250VAC MPU,SITARA,CORTEX A8,298NFBGA CRIMP TERMINAL,#6,RING TONGUE ADD-ON CARD,WIFI BLUTOOH,FOR AM335x EV LED SOCKET BRIDGELUX RS LED SOLDERING STATION SOLAR SOLDERING HANDPIECE W/CORD & COIL PANNE DE FER A SOUDER 4MM MOSFET CANAL N 60V 79A D2PAK MOSFET CANAL N 24V 240A D2PAK MOSFET CANAL N 40V 195A D2PAK MOSFET CANAL N 40V 240A D2PAK MOSFET CANAL N 150V 21A D2PAK MOSFET CANAL N 55V 2.8A SOT-223 MOSFET CANAL N 40V 340A D2PAK MOSFET CANAL N 60V 293A D2PAK MOSFET CANAL N 60V 210A D2PAK MOSFET CANAL N 75V 170A D2PAK MOSFET CANAL N 75V 80A D2PAK MOSFET CANAL N 100V 97A D2PAK MOSFET CANAL N 60V 210A D2PAK MOSFET CANAL N 55V 25A DPAK MOSFET CANAL N 55V 61A DPAK MOSFET CANAL N 30V 28A DIRECTFET MOSFET CANAL N 30V 27A DIRECTFET MOSFET CANAL N 100V 62A TO220 MOSFET CANAL N 100V 11A PQFN 5X6 MOSFET CANAL N 100V 61A TO262 MOSFET CANAL N 100V 56A IPAK MOSFET CANAL N 30V 9.9A 8SOIC MOSFET CANAL N 20V 28A PQFN 5X6 IGBT TRENCH 600V 140A TO247 IGBT TRENCH 600V 140A TO247 ECLATEUR A GAS 70V 10KA ECLATEUR A GAS 90V 10KA ECLATEUR A GAS 120V 10KA ECLATEUR A GAS 130V 10KA ECLATEUR A GAS 145V 10KA ECLATEUR A GAS 230V 10KA ECLATEUR A GAS 300V 10KA ECLATEUR A GAS 350V 10KA ECLATEUR A GAS 400V 10KA ECLATEUR A GAS 470V 10KA ECLATEUR A GAS 70V 10KA ECLATEUR A GAS 90V 10KA ECLATEUR A GAS 130V 10KA ECLATEUR A GAS 145V 10KA ECLATEUR A GAS 230V 10KA ECLATEUR A GAS 250V 10KA ECLATEUR A GAS 300V 10KA ECLATEUR A GAS 350V 10KA ECLATEUR A GAS 400V 10KA ECLATEUR A GAS 470V 10KA ECLATEUR A GAS 70V 15KA ECLATEUR A GAS 90V 15KA ECLATEUR A GAS 120V 15KA ECLATEUR A GAS 130V 15KA ECLATEUR A GAS 145V 15KA ECLATEUR A GAS 230V 15KA ECLATEUR A GAS 250V 15KA ECLATEUR A GAS 300V 15KA ECLATEUR A GAS 350V 15KA ECLATEUR A GAS 470V 15KA ECLATEUR A GAS 600V 15KA ECLATEUR A GAS 70V 15KA ECLATEUR A GAS 90V 15KA ECLATEUR A GAS 120V 15KA ECLATEUR A GAS 130V 15KA ECLATEUR A GAS 145V 15KA ECLATEUR A GAS 230V 15KA ECLATEUR A GAS 250V 15KA ECLATEUR A GAS 300V 15KA ECLATEUR A GAS 350V 15KA ECLATEUR A GAS 400V 15KA ECLATEUR A GAS 470V 15KA ECLATEUR A GAS 230V 3E ECLATEUR A GAS 250V 3E ECLATEUR A GAS 350V 3E ECLATEUR A GAS 400V 3E ECLATEUR A GAS 420V 3E ECLATEUR A GAS 470V 3E ECLATEUR A GAS 600V 3E ECLATEUR A GAS 800V 3E ECLATEUR A GAS 75V ECLATEUR A GAS 90V ECLATEUR A GAS 145V ECLATEUR A GAS 230V ECLATEUR A GAS 250V ECLATEUR A GAS 300V ECLATEUR A GAS 350V ECLATEUR A GAS 400V ECLATEUR A GAS 470V ECLATEUR A GAS 600V ECLATEUR A GAS 90V 3E ECLATEUR A GAS 145V 3E ECLATEUR A GAS 200V 3E ECLATEUR A GAS 230V 3E ECLATEUR A GAS 250V 3E ECLATEUR A GAS 350V 3E ECLATEUR A GAS 400V 3E ECLATEUR A GAS 420V 3E ECLATEUR A GAS 470V 3E ECLATEUR A GAS 600V 3E ECLATEUR A GAS 90V 3E ECLATEUR A GAS 145V 3E ECLATEUR A GAS 200V 3E ECLATEUR A GAS 230V 3E ECLATEUR A GAS 250V 3E ECLATEUR A GAS 350V 3E ECLATEUR A GAS 400V 3E ECLATEUR A GAS 420V 3E ECLATEUR A GAS 470V 3E ECLATEUR A GAS 600V 3E ECLATEUR A GAS 90V 3E ECLATEUR A GAS 145V 3E ECLATEUR A GAS 200V 3E ECLATEUR A GAS 230V 3E ECLATEUR A GAS 250V 3E ECLATEUR A GAS 350V 3E ECLATEUR A GAS 400V 3E ECLATEUR A GAS 420V 3E ECLATEUR A GAS 470V 3E ECLATEUR A GAS 600V 3E ECLATEUR A GAS 90V 3E ECLATEUR A GAS 145V 3E ECLATEUR A GAS 200V 3E ECLATEUR A GAS 230V 3E ECLATEUR A GAS 250V 3E ECLATEUR A GAS 350V 3E ECLATEUR A GAS 400V 3E ECLATEUR A GAS 420V 3E ECLATEUR A GAS 470V 3E ECLATEUR A GAS 600V 3E ECLATEUR A GAS 90V 3E ECLATEUR A GAS 145V 3E ECLATEUR A GAS 200V 3E ECLATEUR A GAS 230V 3E ECLATEUR A GAS 250V 3E ECLATEUR A GAS 350V 3E ECLATEUR A GAS 400V 3E ECLATEUR A GAS 420V 3E ECLATEUR A GAS 470V 3E ECLATEUR A GAS 600V 3E ECLATEUR A GAS 90V ECLATEUR A GAS 120V ECLATEUR A GAS 130V ECLATEUR A GAS 230V ECLATEUR A GAS 250V ECLATEUR A GAS 300V ECLATEUR A GAS 350V ECLATEUR A GAS 400V ECLATEUR A GAS 470V ECLATEUR A GAS 75V ECLATEUR A GAS 90V ECLATEUR A GAS 120V ECLATEUR A GAS 130V ECLATEUR A GAS 230V ECLATEUR A GAS 250V ECLATEUR A GAS 300V ECLATEUR A GAS 350V ECLATEUR A GAS 400V ECLATEUR A GAS 470V ECLATEUR A GAS 230V ECLATEUR A GAS 250V ECLATEUR A GAS 300V ECLATEUR A GAS 350V ECLATEUR A GAS 420V ECLATEUR A GAS 470V ECLATEUR A GAS 600V ECLATEUR A GAS 700V ECLATEUR A GAS 800V ECLATEUR A GAS 230V ECLATEUR A GAS 250V ECLATEUR A GAS 350V ECLATEUR A GAS 420V ECLATEUR A GAS 470V ECLATEUR A GAS 600V ECLATEUR A GAS 700V ECLATEUR A GAS 800V ECLATEUR A GAS 1000V ECLATEUR A GAS 1200V ECLATEUR A GAS 1400V ECLATEUR A GAS 1600V ECLATEUR A GAS 2000V ECLATEUR A GAS 2200V ESD TOOL SET ELITE 20 TOOLS ESD TOOL SET 6-PIECE TWEEZERS IC HANDLING KIT OUTIL VDE 1000V BACKPACK BATTERY,COIN CELL,3V,255MAH HEAT SINK,0.43°C/W,ALUMINIUM,SOT-227 HEAT SINK,0.43°C/W,ALUMINIUM,SOT-227 HEAT SINK,0.43°C/W,ALUMINIUM,SOT-227 DROP FLOAT,RSF10 SERIES DROP FLOAT,RSF10 SERIES DROP FLOAT,RSF10 SERIES DROP FLOAT,LOW LEVEL,RSF20 SERIES DROP FLOAT,LOW LEVEL,RSF20 SERIES FLOAT SWITCH,RSF70 SERIES CAPACITOR,ALUM ELECT,270UF,20%,6.3V,RADIAL SOLID-STATE PANEL MOUNT RELAY,11-11.5VD CAPACITOR,ALUM ELECT,22UF,20%,16V,SMD CAPACITOR,ALUM ELECT,33UF,20%,16V,SMD CAPACITOR,ALUM ELECT,39UF,20%,16V,SMD CAPACITOR,ALUM ELECT,22UF,20%,25V,SMD CAPACITOR,ALUM ELECT,330UF,20%,10V,SMD CAPACITOR,ALUM ELECT,100UF,20%,35V,SMD CAPACITOR,ALUM ELECT,330UF,20%,16V,RADIAL CAPACITOR,ALUM ELECT,100UF,20%,35V,RADIAL CAPACITOR,ALUM ELECT,100UF,20%,25V,RADIAL CAPACITOR,ALUM ELECT,220UF,20%,6.3V,RADIAL CAPACITOR,ALUM ELECT,680UF,20%,16V,RADIAL CAPACITOR,ALUM ELECT,180UF,20%,25V,RADIAL CAPACITOR,ALUM ELECT,330UF,20%,25V,RADIAL CAPACITOR,ALUM ELECT,39UF,20%,50V,RADIAL CAPACITOR,ALUM ELECT,12UF,20%,63V,SMD CAPACITOR,ALUM ELECT,22UF,20%,63V,SMD CAPACITOR,ALUM ELECT,33UF,20%,63V,SMD CAPACITOR,ALUM ELECT,56UF,20%,63V,SMD CAPACITOR,ALUM ELECT,8.2UF,20%,63V,SMD CAPACITOR,ALUM ELECT,270UF,20%,16V,RADIAL CAPACITOR,ALUM ELECT,15UF,20%,25V,SMD CAPACITOR,ALUM ELECT,100UF,20%,16V,SMD CAPACITOR,ALUM ELECT,10UF,20%,25V,SMD CAPACITOR,ALUM ELECT,22UF,20%,25V,SMD CAPACITOR,ALUM ELECT,560UF,20%,2.5V,RADIAL CAPACITOR,ALUM ELECT,150UF,20%,10V,RADIAL CAPACITOR,ALUM ELECT,100UF,20%,16V,RADIAL CAPACITOR,ALUM ELECT,33UF,20%,25V,RADIAL CAPACITOR ALUM ELEC,1200UF,2.5V,20%,RADIAL DROP FLOAT,RSF10 SERIES FLOAT SWITCH,RSF50 SERIES FLOAT SWITCH,2 LEVEL,30BAR FLOAT SWITCH,HIGH LEVEL,30BAR FLOAT SWITCH,LOW LEVEL,30BAR FLOAT SWITCH,0 to 20bar,500mA,300V FLOAT SWITCH,0 to 20bar,500mA,300V FLOAT SWITCH,0 to 20bar,500mA,300V THERMISTOR FLOAT SWITCH,TSF40 SERIES THERMISTOR FLOAT SWITCH,TSF40 SERIES THERMISTOR FLOAT SWITCH,TSF40 SERIES THERMISTOR FLOAT SWITCH,TSF40 SERIES THERMISTOR FLOAT SWITCH,TSF40 SERIES THERMISTOR FLOAT SWITCH,TSF70 SERIES THERMISTOR FLOAT SWITCH,TSF70 SERIES THERMISTOR FLOAT SWITCH,TSF70 SERIES THERMISTOR FLOAT SWITCH,TSF70 SERIES THERMISTOR FLOAT SWITCH,TSF70 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES THERMISTOR FLOAT SWITCH,TSF80 SERIES IEA HANDLES,BLACK,PK10 IC,IEEE802.3u,10/100Mbps,LLP-48 FUSE,CARTRIDGE,3.15A,5X20MM,SLO BLO STM32,SPZBE260,ZIGBEE,GRAPHIC PANEL, RESISTOR,THICK FILM,3.3KOHM,62.5mW 1% FLOAT SWITCH,2 LEVEL,30BAR FLOAT SWITCH,HIGH LEVEL,30BAR FLOAT SWITCH CONDENSATEUR SUPER 6.0F 2.7V EDLC CONDENSATEUR SUPER 15F 2.7V EDLC CONDENSATEUR SUPER 60F 2.7V EDLC CONDENSATEUR SUPER 100F 2.7V EDLC CONDENSATEUR SUPER 6.0F 2.5V EDLC CONDENSATEUR SUPER 5.0F 2.5V EDLC CONDENSATEUR SUPER 15F 2.5V EDLC CONDENSATEUR SUPER 25F 2.5V EDLC CONDENSATEUR SUPER 3.0F 5.0V EDLC CONDENSATEUR SUPER 3.0F 5.4V EDLC CONDENSATEUR SUPER 300F 2.5V EDLC CONDENSATEUR SUPER 400F 2.5V EDLC JFET SIC N-ON 1200V 8A TO247 FUSE,CARTRIDGE,2A,5X20MM,FAST ACTING MEMOIRE FLASH 1GBIT 48TSOP MEMOIRE FLASH 4GBIT 48TSOP RESISTOR,THICK FILM,82 OHM,100mW,1% IC,LINEAR VOLTAGE REGULATOR 5V D2-PAK-3 TVS-DIODE CAPACITOR CERAMIC,2.2UF,16V,X7R,10%,0805 GAS DISCHARGE TUBE,1.2KV,SMD GAS DISCHARGE TUBE,1.5KV,SMD GAS DISCHARGE TUBE,800V,SMD GAS DISCHARGE TUBE,1.6KV,AXIAL GAS DISCHARGE TUBE,2.5KV,AXIAL GAS DISCHARGE TUBE,3.6KV,AXIAL GAS DISCHARGE TUBE,1.2KV,SMD GAS DISCHARGE TUBE,2.5KV,SMD GAS DISCHARGE TUBE,2.7KV,SMD GAS DISCHARGE TUBE,1.6KV,AXIAL GAS DISCHARGE TUBE,2.5KV,AXIAL GAS DISCHARGE TUBE,2.7KV,AXIAL GAS DISCHARGE TUBE,3.5KV,AXIAL GAS DISCHARGE TUBE,800V,AXIAL SENSOR DEV KIT C2000 LED BOOSTERPACK MICROCONTROLEUR 16 BITS MSP430 80LQFP MICROCONTROLEUR 16 BITS MSP430 100LQFP MICROCONT 16 BITS,2KB FLASH,8SOIC FUSE,CARTRIDGE,250mA,5X20MM,FAST ACT IC,OP-AMP,600KHZ,0.3V/ us,DIP-8 CAPACITOR CERAMIC,1UF,25V,X7R,10%,0805 POE IEEE802.3 LTPOE++ 90W 10DFN POE IEEE802.3 LTPOE++ 90W 10MSOP POE IEEE802.3AT LTPOE++ 25.5W 10DFN POE IEEE802.3AT LTPOE++ 25.5W 10MSOP CAPTEUR TEMP 5.5VIN W ALERT 10DFN CAPTEUR TEMP 5.5VIN W ALERT 10DFN BOOST SYNCH 15V 2.5A 3MHZ 12DFN BOOST SYNCH 15V 2.5A 3MHZ 12MSOP LED LUXEON S 4000K CCT LED LUXEON REBEL ES 3000K CCT LED LUXEON R 5700K CCT LED LUXEON M 4000K CCT LED LUXEON M 5700K CCT LED LUXEON K EC4 2700K CCT LED LUXEON K EC8 2700K CCT LED LUXEON K EC12 2700K CCT LED LUXEON K EC16 2700K CCT LED LUXEON K EC24 2700K CCT LED LUXEON K EC4 3000K CCT LED LUXEON K EC8 3000K CCT LED LUXEON K EC12 3000K CCT LED LUXEON K EC16 3000K CCT LED LUXEON K EC4 4000K CCT LED LUXEON K EC8 4000K CCT LED LUXEON K EC12 4000K CCT LED 5633 MID PUISSANCE 5000K CCT LED LUXEON Z VERT LED LUXEON Z CYAN LED LUXEON Z BLEU LED LUXEON Z DEEP RED LED LUXEON Z RED LED LUXEON Z RED/ORANGE LED,LUXEON,Z,AMBER IC,MOSFET DRIVER,LOW SIDE,DIP-8 FFC/FPC CONNECTOR,RECEPTACLE,29POS 1ROW IC,VOLTAGE REG,LDO,FIXED,150mA,3V,TSOT-5 C2000 PICCOLO LAUNCHPAD IC,DIG ISOLATOR FUSE,CARTRIDGE,2A,5X20MM,FAST ACTING IC,RS422/RS485 TRANSCEIVER,3.6V SOIC14 EVAL BRD LPC4357 CORTEX M0/M4 CORE CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN RELAIS OVERLOAD 0.63-1A CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU 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CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU 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79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN 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CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 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TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN TERMINAL BLOCK,STANDARD,6POS CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN TERMINAL BLOCK,STANDARD,8POS CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN FAHNESTOCK CLIP,BRASS CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN JK 1207 CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT TERMINAL,MECHANICAL LUG,1/4IN,SOLDER CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT BINDING POST,15A,#8-32,SOLDER,BLACK CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN BINDING POST,15A,#6-32,STUD,RED CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN BINDING POST,15A,#6-32,STUD,BLACK TERMINAL STRIP,4POS CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN DUST CAP,RUBBER CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT ELECTRONIC CARTRIDGE FUSE CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT LDR,500KOHM,50mW,VT200 SERIES CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT LDR,500KOHM,400mW,VT400 SERIES CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN LDR,1MOHM,500mW,VT500 SERIES CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT TAPE,FOIL SHIELD,SILVER,0.5INX18YD CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT TRIMMER,POTENTIOMETER,1KOHM 12TURN THRU HOLE CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN POTENTIOMETER,COND PLASTIC,200KOHM,20%,2W CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN POT,COND PLASTIC,150KOHM,20%,2W CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT BRACKET KIT,PANEL MOUNTING RAILS,STEEL CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CIRCULAR,SIZE 25,56WAY,SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES PIN CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 15 16VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU 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TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT 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CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT 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CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT 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CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES PIN 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18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU 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15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT 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TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECTOR,PHONE,JACK,3WAY CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECTOR,PHONE AUD,JACK,2POS CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES PIN CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 16VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES PIN CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECT CIRCU TAILLE 21 79VOIES SKT CONNECTOR,RCA/PHONO,PLUG CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU 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41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES PIN CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 41VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES SKT CONNECT CIRCU 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TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES PIN CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT CONNECT CIRCU TAILLE 23 21VOIES SKT 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53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU 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SKT CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES PIN CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 100VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES PIN CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 53VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES PIN CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 23 55VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES PIN CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 19VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES PIN CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 24VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES PIN CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 29VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES PIN CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 128VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES PIN CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 56VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES PIN CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 25 61VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES PIN CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 6VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES PIN CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 9 3VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES PIN CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 13VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES PIN CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 5VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES PIN CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 6VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES PIN CONNECT CIRCU TAILLE 11 7VOIES SKT CRIMP TOOL,UNIVERSAL MAT N LOK CONTACT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 11 7VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN PRO-CRIMPER III HAND CRIMPING TOOL ASSEMBLY CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT 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CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN TOURNEVIS TORX 10 CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES PIN CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 22VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES PIN CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 4VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES PIN CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 13 10VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES PIN TOURNEVIS TORX 15 CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES PIN CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 18VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES PIN CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 37VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES PIN CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 5VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES PIN CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 15 12VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES PIN CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 26VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES PIN CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 55VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES PIN CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 6VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES PIN CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 17 8VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES PIN CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 11VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES PIN CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 32VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES PIN CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 19 66VOIES SKT CONNECT CIRCU TAILLE 21 11VOIES PIN CONNECT CIRCU TAILLE 21 11VOIES PIN CONTACTOR,2NO/2NC,40A,230VAC LIMIT SWITCH ROLLER ARM,B7 ROLLER ARM,B1 PRESSURE SWITCH PRESSURE SWITCH TIMER,ON-DELAY,300H,24VAC/DC,1CO TIMER,STAR-DELTA TIMER,OFF-DELAY 3-300S TIMER,ON-DELAY,0.1-10S TIMER,ON-DELAY,3-30S CONNECTOR,HOUSING,RECEPTACLE,2POS,2.54MM CONNECTOR,HOUSING,RECEPTACLE,6POS,2.54MM WIRE-BOARD CONNECTOR RECEPTACLE,2POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE,4POS,3.96MM PLUG IN JUMPER TERMINAL BLOCK,PCB 5.0MM 5P PLUG,FREE 5.0MM 10P SACOCHE SACOCHE MODULE THERMOMETRE ADAPTEUR POUR PICSTART ET PROMATE PROGRAMMING MODULE UNIV ICD2 PICSTAR CONTROLEUR DE TEMPERATURE T/C INDICATEUR DE PANNEAU SORTIE 2 RELAIS INDICATEUR DE PANNEAU SORTIE 2 RELAIS INSTALLATION TOOL,MK3SP TERMINAL PASCAL F.8051 U.DERIVATE SPEAKER,REMOTE,FOR 4247929 CARRY CASE FOR 4247929 VARIABLE TRANSFORMER PELLETS,FOR RC TANK 4246597 PK2000 SEPARATEUR NO2 PQ12 FLOAT SWITCH,CABLE,CO FLOTTEUR DOUBLE PSN FLOTTEUR DOUBLE PSN FLOTTEUR DOUBLE PSN FLOTTEUR DOUBLE PSN FLOTTEUR DOUBLE PSN FLOTTEUR AVEC CABLE CO SILENCIEUX ECHAPPEMENT M G1/2 MAMELON M5 & M5 TUBE NYLON 25M DIA 4 ROUGE TUBE PU 25M DIAM 4 ROUGE TUBE PU 25M DIAM 4 BLEU TUBE PU 25M DIAM 8 ROUGE TUBE PU 25M DIAM 10 TRANSPARENT TUYAU PVC 25M DIAM 23 TUYAU PVC 25M DIAM 26 BANJO MALE M5 FEMELLE DIAM 4 BANJO MALE M5 FEMELLE DIAM 6 ROBINET F/FDIAM 32 G1 1/4 REGULATEUR DEBIT MALE G1/8 FEM DIA4 REGULATEUR DEBIT MALE G1/8 FEM DIA6 REGULATEUR DEBIT MALE G3/8 FEM DIA8 REGULATEUR DEBIT FEMELLE DIAM 10 POINTE A TRACER POINTE A TRACER POINTE POUR POINTE A TRACER LIMIT SWITCH,ROLLER PLUNGER LIMIT SWITCH,ADJ ROLLER LEVER LIMIT SWITCH,ROLLER PLUNGER LIMIT SWITCH,ADJ ROLLER LEVER LIMIT SWITCH,2 ENTRY,ROLLER LEVER PANNE POUR FER W200 DETECTEUR DE PROXIMITE M12 PNP NO CAB DETECTEUR DE PROXIMITE M18 PNP NO CAB DETECTEUR DE PROXIMITE M18 PNP NO CONN DETECTEUR DE PROXIMITE M30 PNP NO CAB DETECTEUR DE PROXIMITE M18 2W AC/DC DETECTEUR DE PROXIMITE M18 2W AC/DC DETECTEUR DE PROXIMITE M30 2W AC/DC SENSOR,METAL BODY,M18,CABLE SUPPORT DE FIXATION M12 CONNECTOR,POWER ENTRY,PLUG,10A CLAMP,AERIAL CORDON XLR MALE-FEMELLE 20M FIXATION POUR COL DE CYGNE CHROMEE AMPLIFIER,HEADPHONE,UK PLUG CONNECTEUR PHONO 3X CORDON XLR-3.5MM S JACK 6M CORDON HQ S-VHS P-P 2M CORDON RG59 BNC MALE-MALE 1M CORDON RG59 BNC MALE-MALE 1.5M CORDON RG59 BNC MALE-MALE 2M CORDON RG59 BNC MALE-MALE 3M CORDON RG59 BNC MALE-MALE 5M CORDON RG59 BNC MALE-MALE 10M CORDON RG59 BNC MALE-MALE 20M ADAPTOR,S-VIDEO RCPT TO RCA RCPT ADAPTOR,S-VIDEO SKT TO PHONO PLUG CORDON RGB PHONO-PHONO 1.5M CORDON FIREWIRE IEEE1394 6-6 /1.8M WALL PLATE,2 SPEAKER PUSH TERMINAL WALL PLATE,4 SPEAKER TERMINAL CORDON COAXIAL PHONO-PHONO 15M CORDON COAXIAL PHONO-PHONO 25M CORDON OPTIQUE TOS 3M CORDON 3.5MM S JACK-JACK 2M CORDON 3.5MM S JACK-JACK 7M CORDON 3XPHONO-3XPHONO 15M CORDON SCART MALE-MALE 15M CORDON HQ PHONO P-P 5M CORDON HQ 2X PHONO P-P 5M CORDON HQ S-VHS P-P 5M CORDON NUMERIQUE XLR 5 VOIES 1.5M CORDON RGB BNC-BNC 6M CABLE D ALIMENTATION AUDIO/VIDEO 16P/25M AMPLIFIER,VIDEO CORDON PERITEL HQ MALE-MALE 1.5M CORDON PERITEL HQ MALE-MALE 2M CORDON PERITEL HQ MALE-MALE 5M CORDON HQ SCART-3XPHONO 1.5M CORDON PLAT SCART-SCART 0.75M CORDON PLAT SCART-SCART 3M CORDON PLAT SCART-SCART 10M CORDON PERITEL HQ MALE-MALE 1M CORDON SCART OXYPURE 1.5M FICHE PERITEL A SOUDER SYSTEME DE SONORISATION - 60W GENERATEUR AUDIO HAUT-PARLEUR CONE MYLAR 8OHM 0.1W 20MM WOOFER A CONE PAPIER 8OHM 133MM ENCEINTE 55W 8OHM NOIR MEGAPHONE 15W RMS MICROPHONE W/SHIELD 7-9MM MICROPHONE BLINDE 40-50MM ENROULEUR VIDE 2X16A/240V SOLAR PANEL,FRAMED,20W PSU,BENCH,13.8VDC,5A EXTENSION POLE-1.2M SILVER ETIQUETTE IDENTIFICATION TIMER MULTIFUNCTION 12V 4POLE TIMER MULTIFUNCTION 125V 4POLE TIMER MULTIFUNCTION 12V 2POLE RELAIS CONT. INTENSITE EIH 24VCA IC,RESONANT MODE PWM CTRL,20V,SOIC-28 SOFTWARE,NORTON PERSONAL FIREWALL 2003 ENCLOSURE,HAND HELD,PLASTIC,GRAY BALL END TOOL SET BOITIER PLAT PLASTIQUE NOIR BOITIER PLAT PLASTIQUE NOIR BOITIER PLAT PLASTIQUE NOIR BATTERIE MONOBLOC 6V 5AH BATTERIE MONOBLOC 6V 8AH CIRCULAR CONN RCPT,SIZE 13,7POS,FREE HANGING SUPPORT DE PILE BOUTON 2 D LAMP,IR,10M DETECTOR BASE RELAIS SAFETY EMERG STOP 24VAC/DC RELAIS SAFETY 2 HAND 24VDC MAGNETIC SWITCH,2NC,W/O LED PINCE A SERTIR SAHT 22-26AWG PINCE A SERTIR SAHT 20-24AWG TIMER,ON-DELAY,24VDC,0.5-10S TIMER,ON-DELAY,24VDC,3-60S PRESSURE SWITCH,MPL502 F FAN TRAY,AC,6 FAN,80W,600CFM HEAT SHRINK TUBING,19.1MM ID,PVC,BLK,25FT connectors LUMINAIRE,3-ARM,ES,60W,IP20 IC,OP-AMP,2.8MHz,1.4V/ us,SOIC-8 STATION DE CONTROLE 4 BTN + E.STP STATION DE CONTROLE 6 BTN + E.STP STATION DE CONTROLE 2 BTN. ALARM. E.STP STATION DE CONTROLE 4 BTN. ALARM. E.STP STATION DE CONTROLE 6 BTN. ALARM. E.STP STATION DE CONTROLE 8 BTN. ALARM. E.STP BLOC CONTACT 2 VITESSES. 2 UNITES PATCH PANEL& FACEPLATES,12PORT PLUG AND SOCKET CONNECTOR HOUSING REFILL,WHITE PK6 RESISTOR,METAL FILM,4.99KOHM,250mW,1% LABELWRITER 310 LABELWRITER 320 VERSION EURO ALIMENTATION SIMPLE 0-42V 10A ALIMENTATION DE LABORATOIRE 0-30VCC 10A ALIMENTATION DE LABORATOIRE 0-30V 3A ALIMENTATION 0-30V 10A ALIMENTATION 0-30V 20A ALIMENTATION DOUBLE 0-30V 3A ALIMENTATION 2X0-30V+5V 3A ALIMENTATION LABORATOIRE 2X0-30V+5V 3A SOCKET TESTER + AUDIO TONE ETUI POUR MULTIMETRE FLUKE SACOCHE SOUPLE POUR APPAREIL DE MESURE SACOCHE A OUTILS POUR APPAREIL DE MESURE SONDE THERMOCOUPLE TYPE K ETUI POUR MULTIMETRE - GRANDE TAILLE BOITIER POUR HPS10 DETECTEUR DE COURT-CIRCUIT CORD SET,BT KIT DE CORDONS DE TEST CHARRIOT POUR INSTRUMENTATION CHIP INDUCTOR,10NH,300MA,5% 3GHZ CHIP INDUCTOR,47NH 300MA 5% 1.2GHZ RF/COAXIAL,TNC PLUG,STR,75 OHM,CRIMP WIRE-BOARD CONNECTOR,SOCKET,10POS,2MM 4´´´´ Adjustable Wrench EMBASE IEC EMBASE POUR MONTAGE PANNEAU BALL VALVE,MINI,G1/4I X A BALL VALVE,MINI,G3/8I X A BALL VALVE,MINI,G1/2I X A BALL VALVE,G11/2I DN40 BALL VALVE,R1/4I HOSE TAIL,9MM COUPLER,10MM COUPLER,13MM HOSE TAIL,10MM HOSE TAIL,13MM L-FITTING,AJUSTABLE,M5A/3MM L-FITTING,AJUSTABLE,M5A/4MM COUPLER,R1A HOSE TAIL,G3/4A X 25MM PUSH FITTING,M5A/4MM PUSH FITTING,6MM/6MM PUSH FITTING,8MM/8MM PUSH FITTING,10MM/10MM PUSH FITTING,12MM/12MM T-FITTING,R1/4A/6MM T-FITTING,R3/8A/6MM SILENCER,G1/8A SILENCER,G3/8A SILENCER,G3/4A AIR BLOW GUN,G1/4,OUTSIDE AIR BLOW GUN,6MM AIR BLOW GUN,9MM AIR BLOW GUN,INCLUDING FITTING AIR BLOW GUN,ADJUSTABLE NOZZLE EXTENSION NOZZLE EXTENSION POLYETHYLENE TUBE,6MM,NAT,10M POLYETHYLENE TUBE,8MM,BLUE,10M POLYURETHANE TUBE,5MM,SILVER,50M POLYAMIDE TUBE,SPIRAL,6MM,7.5M TUBE CUTTER,0-28MM BLADE,REPLACEMENT ADAPTOR,G1/8A X M5I ADAPTOR,G1/8A X G1/4I ADAPTOR,G1/4A X G3/8I ADAPTOR,G3/8A X G1/4I FUSIBLE RAPIDE 40MA FUSIBLE RAPIDE 63MA BOITIER FEMELLE HE14 16V DISJONCTEUR THERMIQUE T13 8A CUTTER,CABLE,240MM ENCLOSURE,BOX,PLASTIC,GRAY CONNECTEUR MODULAIRE 4P PQ10 FICHE MMJ 6P PQ10 FICHE MMJ 6P PQ10 FICHE MMJ 6P PQ10 CORDON 3.5MM M JACK- 2 XM PHONO 2M SHORTING BAR PIN TIP PLUG,5A,RED CONTACT,SOCKET 24-18AWG,CRIMP CORDON HQ 3 X PHONO P-P 10M INTERFACE POUR 12F629-675 INTERFACE POUR 16F676-630 LENS,ROUND,RED BEZEL DISSIPATEUR THERMIQUE POUR CMS 26C/W DISSIPATEUR THERMIQUE POUR CMS 17C/W DISSIPATEUR THERMIQUE POUR CMS 21C/W DISSIPATEUR THERMIQUE POUR CMS 18C/W DISSIPATEUR THERMIQUE POUR CMS 37C/W DISSIPATEUR POUR PLCC 17C/W DISSIPATEUR THERMIQUE POUR D-PAK 25.0C/W INTERRUPTEUR ANTI-VANDALES BLEU INTERRUPTEUR ANTI-VANDALES BLEU INTERRUPTEUR ANTI-VANDALES BLEU INTERRUPTEUR ANTI-VANDALES BLEU POIGNEE S/STEEL 25X135MM CENTR POIGNEE MACHINE MODULAIRE POIGNEE MACHINE MODULAIRE RESISTOR,METAL FILM,10KOHM,250mW,1% SPRING LATCH PLATE ASSEMBLY WIRE-BOARD CONNECTOR RECEPTACLE 10POS,3.96MM GROUNDING CORD MOTORIZED IMPELLER HOLE SAW,BI-METAL,16MM HOLE SAW,BI-METAL,20MM CHUCK/ARBOR,10MM,14-30 HOLESAW KIT DE SOUDAGE AU GAZ GK 40 FER A SOUDER AU GAZ GK 60 FER A SOUDER AU GAZ 75P KIT DE SOUDAGE AU GAZ 75P FER A SOUDER AU GAZ 120P KIT DE SOUDAGE AU GAZ 120P COMMUTATEUR TACTILE + LED JAUNE PROBE,OSCILLOSCOPE,DOUBLE,MID FREQ SOLID STATE FLASHER SPST-NO 60FPM,12VDC PINCE DEMI RONDE PINCE COUPANTE 145MM PINCE COUPANTE 200MM PINCE COUPANTE PINCE A DENUDER 195MM VALISE TECHNICIEN KIT 9 OUTILS 1000V PINCE A RIVETER PINCE A RIVETER PINCE COUPANTE 30° 120MM PINCE A BEC DEMI ROND 140MM PINCE A BECS DEMI ROND COUDES KIT OUTILLAGE ELECTRONIQUE SCIE A METAUX 250MM MIROIR D´INSPECTION KIT 30 OUTILS ELECTRONIQUE KIT 88 OUTILS ELECTRONIQUE PINCE ETAU PINCE POUR COLLIER PLASTIQUE PINCE POUR EMBOUTS DE CABLE PINCE MULTIPRISE ISOLEE PINCE COUPANTE ISOLEE PINCE UNIVERSELLE ISOLEE PINCE A BECS 1/2 RONDS ISOLEE PINCE A BECS COUDES ISOLEE JEU DE 3 PINCES ISOLEES JEU DE 3 PINCES & 4 TOURNEVIS ISOLES COFFRET DOUILLES 1/2 PAPER,TRIMMER PHONEFLASH,2 RING INDICATOR PLUG AND GO ANYWHERE RESISTOR,THICK FILM,2.21KOHM,125mW,1% TEST LEAD SET,DELUXE FLUKE TL81A HOUSSE SOUPLE DISSIPATEUR THERMIQUE POUR D-PAK 31.5C/W KIT DE CORDONS DE TEST DISSIPATEUR THERMIQUE POUR D-PAK 29.3C/W KIT DE CORDONS DE TEST KIT DE CORDONS DE TEST CLIPS DE TEST JEU DE CLIPS DE TEST JEU DE CLIPS DE TEST JEU DE CLIPS DE TEST SONDE DE COURANT 400A SONDE DE COURANT 600/1000A CALIBRATEUR DE BOUCLE CALIBRATEUR DE TEMPERATURE CALIBRATEUR DE TEMPERATURE CONTACT,SOCKET,26-18AWG,CRIMP EMBASE COUDEE 0B 6 VOIES EMBASE 1B CIRCUIT IMPRIME RA 4 VOIES CABLE,SVGA M TO F,3M FINGER GUARD POWER RELAY,DPST-NO,12VDC,5A PC BOARD CABLE COAXIAL CX167DB NOIR 100M TRANSMETTEUR FM 1 VOIE PROTECTEUR DE CABLE NOIR/JAUNE PROTECTEUR DE CABLE NOIR/JAUNE PROTECTEUR DE CABLE GRIS/ROUGE PROTECTEUR DE CABLE 30X10 NOIR 3M PROTECTEUR DE CABLE 30X10 NOIR 9M PROTECTEUR DE CABLE 16X8 NOIR 9M CABLE CATEGORIE 5E UTP 300M RANGE-CABLE DE BUREAU 80MM NOIR THROUGH BOX,1WAY,25MM INSPECTION TEE,20MM BENDINGS SPRING,20MM BENDINGS SPRING,20MM BENDINGS SPRING,25MM SPACER BAR SADDLE,20MM ADAPTOR,FEMALE,20MM REDUCER,25MM/20MM CONDUIT BOX,SURFACE MOUNT CONTROLE DE TEMPERATURE RELAIS INTERFACE CONVERTISSEUR INTERFACE CONVERTISSEUR INTERFACE CONVERTISSEUR TIMER,0.5-10S,24VDC,200-240VAC,1CO TIMER,MULTIFUNCTION TIMER,100H,2CO,AC/DC24/200-240VAC CONTACTOR,AC-3,3KW/400V CONTACTOR,AC-3,4KW/400V CONTACTOR,AC-3,7.5KW/400V CONTACTOR,AC-3,11KW/400V CONTACTOR,AC-3,5.5KW/400V CONTACTOR,AC-3,5.5KW/400V CONTACTOR,AC-3,5.5KW/400V RELAIS COUPLING CONTACTOR,AC-3 3KW/400V AUXILIARY CONTACT,1NO/1NC AUXILIARY CONTACT,4NO AUXILIARY CONTACT,2NO/2NC AUXILIARY CONTACT,2NO/2NC AUXILIARY CONTACT,1NO/1NC AUXILIARY CONTACT,2NC AUXILIARY CONTACT,4NO AUXILIARY CONTACT,3NO/1NC RC-ELEMENT CONTACTOR,2NO+2NC,230VAC CONTACTOR,3NO+1NC CONTACTOR,3NO+1NC COUPLING RELAY,2NO+2NC RELAIS COUPLING 2NO+2NC CIRCUIT-BR.. 2.8...4 A COUPE CIRCUIT 0.11-0.16A COUPE CIRCUIT 0.55-0.8A CIRCUIT-BR,0.70/1A LAMP REMOVAL TOOL CIRCUIT BREAKER,9-12A CIRCUIT BREAKER,4.5-6.3A CONTACT BLOCK,FRONT,1NO/1NC AUXILIARY SWITCH,LATERALLY FIT UNDERVOLTAGE RELEASE RELAIS DE SURCHARGE 1.8...2.5A RELAIS DE SURCHARGE 5.5-8A PUSHBUTTON ACTUATOR PUSHBUTTON ACTUATOR PUSHBUTTON ACTUATOR ACTUATOR ACTUATOR ACTUATOR ACTUATOR INDICATOR LIGHT,PLASTIC,RED INDICATOR LIGHT,PLASTIC,GREEN INDICATOR LIGHT,PLASTIC,BLUE INDICATOR LIGHT,PLASTIC,WHITE INDICATOR LIGHT,PLASTIC,CLEAR ACCESSORIES FOR 3SB3 ACCESSORIES FOR 3SB3 ACCESSORIES FOR 3SB INSCRIPTION PLATE,F. BOND INSCRIPTION PLATE,F. BOND INSCRIPTION PLATE,F. BOND INSCRIPTION PLATE,F. BOND LAMP HOLDER,BA9S LAMP HOLDER,230/240V LAMP HOLDER,BA9S,BASE LAMP HOLDER,BA9S,230V/240V ACCESSORIES FOR 3SB3 ACCESSORIES FOR 3SB3 ACTUATOR,WITH TWO CONTACT ACTUATOR,WITH TWO CONTACT CONTACT,1NO,SCREW CONNECTION CONTACT BLOCK EMPTY HOUSING,1 COMMAND EMPTY HOUSING,2 COMMAND EMPTY HOUSING,3 COMMAND EMPTY HOUSING ACTUATOR KNOB,O-I ACTUATOR KNOB,O-I ACTUATOR ACTUATOR ACTUATOR,ILLUM KNOB ACTUATOR,ILLUM KNOB ACTUATOR,ILLUM KNOB ACTUATOR,ILLUM KNOB LAMP HOLDER,WITH INTEGRAL LED LAMP HOLDER,WITH INTEGRAL LED LAMP HOLDER,WITH INTEGRAL LED LAMP HOLDER ACTUATOR,SAFETY LOCK,FL ACTUATOR,SAFETY LOCK,FL PUSHBUTTON ACTUATOR,ON-OFF PUSHBUTTON,ENCL PUSHBUTTON ACTUATOR PUSHBUTTON ACTUATOR PUSHBUTTON ACTUATOR PUSHBUTTON ACTUATOR PUSHBUTTON ACTUATOR ACTUATOR ACTUATOR ACTUATOR ACTUATOR INDICATOR LIGHT,METAL,GREEN INDICATOR LIGHT,METAL,WHITE INDICATOR LIGHT,METAL,CLEAR ACTUATOR ACTUATOR KNOB,O-I ACTUATOR ACTUATOR ACTUATOR,ILLUM KNOB ACTUATOR,ILLUM KNOB ACTUATOR,ILLUM KNOB ACTUATOR,SAFETY LOCK,FL TRANSFO. 24VA 0-24V 0-24V ENCAPS CABLE FLEXI-E 0.10 VERT CABLE FLEXI-E 0.50 BLEU CABLE FLEXI-E 0.50 VERT CABLE SILICONE 0.50 VERT 5M CABLE SILICONE 0.50 JAUNE 25M CABLE SILICONE 0.50 VERT 25M CABLE SILICONE 2.50 BLEU 25M BATTERIE DA230 ZINC AIR BATTERIE DA675 ZINC AIR 20-30 Awg Precision Stripper 6 LONG NOSE PLIERS TOOLS,TWEEZERS Enclosure HOUSSE SOUPLE GUIDE DE LUMIERE 45DEG 3.2MM ARRONDI SUPPORT POUR GUIDE DE LUMIERE SUPPORT POUR GUIDE DE LUMIERE GUIDE DE LUMIERE 100 - SYSTEME FLEX GUIDE DE LUMIERE 200 - SYSTEME FLEX GUIDE DE LUMIERE 300 - SYSTEME FLEX GUIDE DE LUMIERE FLEXIBLE POUR LED ROUGE GUIDE DE LUMIERE FLEXIBLE POUR LED JAUNE GUIDE DE LUMIERE FLEXIBLE POUR LED VERTE GUIDE DE LUMIERE FLEXIBLE 30MM INDICATEUR CMS CARREE ILLUMINE COMPLET INDICATEUR CMS CARREE ILLUMINE CAPOT INDICATEUR CMS CARREE ILLUMINE DIFF. INDICATEUR CMS CARREE ILLUMINE COMPLET INDICATEUR CMS CARREE ILLUMINE DIFF. GUIDE DE LUMIERE AVEC LED ROUGE INTEGREE RESEAU DE DIODES TRAVERSANTES X2 RESEAU DE DIODES TRAVERSANTES X4 RESEAU DE DIODES TRAVERSANTES X6 RESEAU DE DIODES TRAVERSANTES X8 LED TRAVERSANTE JAUNE LED TRAVERSANTE VERTE LED ARRAY,HORIZ X4 GREEN LED 3MM - CORPS PLASTIQUE DUAL LEDS DIA: 3 MM BATTERIE POUR APPAREIL CANON NB-5H BATTERIE POUR APPAREIL FUJI NP80 SAFETY SOCKET TERMINAL,36A SOLDER BLACK SAFETY SOCKET TERMINAL,36A,SOLDER,RED TAPE,12.7MM,BLACK/CLEAR TUBE PROTECTOR,FOR LFM101 DESK LIGHT,WHITE,UK PLUG DESK LIGHT,BLACK,UK PLUG BENCH LIGHT,1X24W LIGHT DESK,BLACK BASE,BLACK LENS BASE,WHITE REED COMMUTATEUR CO 500VDC 3A 30W REED COMMUTATEUR NO 200VDC 0.8A 10W REED COMMUTATEUR NO 200VDC 1.2A 20W REED COMMUTATEUR NO 170V 0.5A 10W RESISTOR,METAL FILM,1MOHM,250mW,1% RESISTOR,METAL FILM,3.01KOHM,125mW,1% RESISTOR,METAL FILM,200 OHM,125mW,1% RESISTOR,METAL FILM,4.99KOHM,125mW,1% RESISTOR,METAL FILM,499KOHM,125mW,1% RESISTOR,METAL FILM,75 OHM,125mW,1% PILE LITHIUM CR-V3 VENTILATED SHELF,1.578IN,STEEL BUZZER INTERMITTENT 24VCA/DC BUZZER CONTINU 24VCA/DC BUZZER INTERMITTENT 230VCA SIRENE 92DB 24V SIRENE 92DB 230VCA FIXATION BULB,E27,24VAC/DC,25W PLUG & SOCKET HOUSING,PLUG,NYLON ANALYSEUR DE SPECTRE 1GHZ INTERFACE POUR ICD 28PIN VERS 40PIN DIP RESISTOR,METAL FILM,49.9 OHM,250mW,1% RESISTOR,METAL GLAZE,1MOHM,125mW,1% ALIMENTATION UNIVERSELLE 60W ET CHARGEUR OUTIL D´EXTRACTION ROULEAUX POUR DYMO 24MM NOIR/JAUNE OUTIL DE MONTAGE PILE LITHIUM CRV3 3V PILE BOUTON 3.0V FER A GAZ PYROPEN PIEZO OUTDOOR EXTENSION CORD 25FT,13A,ORANGE MICRO SWITCH,ROLLER LEVER,15A,250V N CHANNEL MOSFET,10V,18A TO-204AE LIMIT SWITCH,SIDE ROTARY,SPDT-1NO/1NC CAPTEUR DE PRESSION 0-12.7MM H2O CAPTEUR DE PRESSION 0-25.4MM H2O PLUG & SOCKET HOUSING,RECEPTACLE,2POS,3.96MM RF TRANSISTOR,NPN 15V 600MHZ TO-92 TOOLS,SCREWDRIVERS,SCREWDRIVERS,POWER HE INSTRUMENT HANDLE INSTRUMENT HANDLE SWITCH,EMERGENCY STOP,1NC,240VAC SWITCH,EMERGENCY STOP,1NC,240VAC CABLE CABLE SOUPLE 1X35 25M IC ADAPTER,20-TSSOP TO 20-DIP PLUG & SOCKET HOUSING,RECEPTACLE,NYLON TOROIDAL TRANSFORMER RECEPT 8.9.10MM HEIGHT 64W SONDE POUR OSCILLOSCOPE CRIMP HAND TOOL Operational Amplifier (Op-Amp) IC GROMMET EDGING,POLYETHYLENE IC,OP-AMP,38MHZ,22V/ us,DIP-8 OPTOSWITCH VARIABLE TRANSFORMER BANANA JACK,5A,TURRET,RED SWITCH BOOT MOUNTING BRACKETS,CABINET RACKS,14-GAUGE STEEL SWITCH,TOGGLE,SPDT,15A,277V SWITCH ((NW)) LAMP,INCANDESCENT,PK22S,24V,70W CRIMPING DIE VENTED FIXED SHELF,1.74IN,STEEL POWER OUTLET STRIP,19´´ RACKMOUNT,15A KEYBOARD & MOUSE SHELF,3.468IN,STEEL D SUB ADAPTER,9FEMALE-25FEMALE D SUB ADAPTER,9FEMALE-25MALE TERMINAL,FERRULE,1.1MM,CRIMP,WHITE TERMINAL,FERRULE,1.8MM,CRIMP,BLACK COMPARATEUR 1MM SONDE AMPLIFICATRICE COURANT SONDE COURANT 150A 15MHZ SONDE AMPLIFICATRICECOURANT 750A 2MHZ SONDE DE COURANT 750A 2MHZ AXIAL FAN,119MM,230VAC,92.4CFM,40dBA BASIC ELECTRONIC TOOL KIT,22 PCS. COLLAR SCREW KIT M2.5x11 (100) 64T7149 WIRE-BOARD CONNECTOR HEADER 2POS,3.96MM CAPACITOR CERAMIC 0.15UF,50V,X7R,10%,1210 ENCLOSURE PROTECTIVE BOOT SIGNAL RELAY,DPDT,24VDC,1A,THD WIRE STOP NL/HT 22C6052 SWITCHING ELEMENT,2NO,10A,SCREW CABLE BELDEN 9903 150M Cermet Potentiometer FASTENERS,CABLE,CABLE,FASTENERS,CABL RELAIS SPCO 10A 24VAC RELAIS SPCO 10A 12VDC RELAIS SPCO 10A 24VDC RELAIS DPCO 5A 110VAC RELAIS DPCO 5A 110VCA RELAIS DPCO 5A 12VDC IC,CURRENT SHUNT MONITOR 800KHZ SOT23-5 FAST RECTIFIER,CMN CTHD 16A TO-220 SWITCH,PUSHBUTTON DPST-1NO/1NC 5A,250V UNSHLD MULTICOND CABLE 2COND 18AWG 1000FT CONNECTOR,POWER ENTRY,PLUG,20A NIMH/NICD BATTERY CHARGER,110V WIRE-BOARD CONNECTOR RECEPTACLE,2POS,2.54MM CONNECTOR,HOUSING,RECEPTACLE,8POS,2.54MM REDUCER,M32/M20 REDUCER,M32/M25 IC,DIFF COMP,DUAL,300ns,SOIC-8 TUBE AXIAL FANS STRAIN RELIEF BOOT,PVC IC,OP-AMP,9.4MHZ,35V/ us,SOIC-8 ENCLOSURE PROTECTIVE BOOT DIODE SCHOTTKY 3.3A 50V SCOPEMETER (VERSION UK) CORDON DE TERRE CORDON DE TERRE FUSE,CARTRIDGE,2A,5X20MM,FAST ACTING CAPTEUR DE PRESSION 0-15PSIA TRANSISTOR MOSFET CANAL-N BOITIER TO-220 TRANSISTOR MOSFET CANAL-P BOITIER TO-220 TRANSISTOR MOSFET CANAL-P BOITIER TO-220 SWITCH,ROCKER,DPST,20A,250V,RED PUSHBOUTON COMMUTATEUR BOUTON POUSSOIR ROUGE BOUTON POUSSOIR 19MM BOUTON POUSSOIR 25MM RELAIS CI DPCO 5VCC RELAIS CARTE PROTOTYPE DPCO 12VDC BOARD-BOARD CONN,HEADER,28WAY,2ROW FICHE XLR 3P FEMELLE FUSE,12A,600V,TIME DELAY PROGRAMMATEUR UNIVERSEL COFFRET COFFRET IC,GEN PUR COMP,SINGLE,200NS,SOT23-5 ADAPTATEUR XLR-F/JACK FEMELLE ADAPTATEUR XLR-M/JACK MALE 2P ADAPTATEUR XLR-F/JACK MALE 3P ADAPTATEUR XLR-M/JACK MALE 3P CAPACITOR CERAMIC 0.1UF,50V,X7R,5%,RAD FUSE,35A,600V,TIME DELAY MACHOIRE RJ45 8P8C FUSE,40A,600V,TIME DELAY FUSE,5A,600V,TIME DELAY FUSE,6A,600V,TIME DELAY FUSE,60A,600V,TIME DELAY FUSE,80A,600V,TIME DELAY JEU 6 TOURNEVIS PLAT/POZIDRIV JEU 6 TOURNEVIS BURIN PLAT/PHILLIPS PLIER,WATER PUMP BOOK,MICROCONTROLLING APPLICATIONS Security,Latches Locks Product Description:´´T´´-Handle Latch Kit 06B4733 IC,CURRENT MODE PWM CTRL,30V,16-SOIC ZENER DIODE,500mW,4.3V,DO-35 PIED A COULISSE 1/20 PIED A COULISSE BECS LONGS JAUGE DE PROFONDEUR JAUGE DE PROFONDEUR MICROMETRE DIGITAL COMPARATEUR D´EPAISSEUR DE POCHE COMPARATEUR D´EPAISSEUR DIGITAL PROTRACTOR BEVEL UNIVERSAL FEELER GAUGE SET SUPPORT,PARALLEL SET,12PC SOURCE,COLD LIGHT FIBRE CABLE,OPTICAL SWAN-NECK ASE Series Screw Cover Pull Box BIPOLAR TRANSISTOR,NPN,40V,TO-39 STRAIN RELIEF,10WAY TOOLS,PUNCH,SETS,PIN,PUNCH,TOOL,SP CONTACT,PIN,26-22AWG,CRIMP SUPPORT DE CARTES FAST RECOVERY DIODE,150mA,50V,DO-35 TRIAC,600V,10A,TO-220 AMPLI.OP. LARGE BANDE CMS ZENER DIODE,1.3W,6.2V,DO-41 KIT EMBOUTS 14 PIECES KIT EMBOUTS 32 PIECES KIT EMBOUTS 22 PIECES KIT EMBOUTS 22 PIECES VALISE A OUTILS VALISE A OUTILS PINCE POUR CIRCLIPS INTERIEURS CAISSE A OUTILS PINCE POUR CIRCLIPS INTERIEURS PINCE POUR CIRCLIPS INTERIEURS PINCE POUR CIRCLIPS INTERIEURS PINCE POUR CIRCLIPS INTERIEURS PINCE POUR CIRCLIPS EXTERIEURS PINCE POUR CIRCLIPS EXTERIEURS PINCE POUR CIRCLIPS EXTERIEURS PINCE POUR CIRCLIPS EXTERIEURS PINCE DE CIRCLIPS PINCE COUPANTE BASE UNIT,ROTA-SPRAY SOUDURE SANS PLOMB 0.5MM SOUDURE SANS PLOMB 1.5MM ETCH RESIST STRIP SOLUTION BRIDGE RECTIFIER,1PH,25A 200V THD RACK CABINET,TABLE TOP,17.5IN,STL BLK CUTTER,OBLIQUE,FULL FLUSH,117MM CARTOUCHE ENCRE HP COULEUR PINCE A BECS PLATS PINCE UNIVERSELLE 180MM PINCE A BECS RONDS RESISTOR,METAL FILM,2MOHM,125mW,1% ENCLOSURE,JUNCTION BOX,STEEL,GRAY Hinged Cover Small Enclosures PINCE COUPANTE/DENUDANTE Hinged Cover Small Enclosures PINCE A DENUDER 2.5MM RESISTANCE CHAUFFANTE PTC 15W RESISTANCE CHAUFFANTE PTC 25W RESISTANCE CHAUFFANTE PTC 15W RESISTANCE CHAUFFANTE PTC 20W RESISTANCE CHAUFFANTE PTC 50W RESISTANCE CHAUFFANTE PTC 70W RESISTANCE CHAUFFANTE PTC 18W RESISTANCE CHAUFFANTE PTC 80W RESISTANCE CHAUFFANTE PTC 200W RESISTANCE CHAUFFANTE PTC 40W RESISTANCE CHAUFFANTE PTC 60W RESISTANCE CHAUFFANTE 300/600W RESISTANCE CHAUFFANTE 450/800W CISAILLE DE BIJOUTIER CISAILLE MANUELLE IC,RS-485 TRANSCEIVER,5.25V,DIP-14 BLADES ((NW)) OUTIL DE WRAPPING CONNECTOR,RCA/PHONO,PLUG,3POS DISTRIBUTION UNIT DISTRIBUTION UNIT,IP44 FUSE,CARTRIDGE,3A,6.3X32MM TIME DELAY WIRE STRIPPER IC,OP-AMP,430KHZ,0.16V/ us,SOT-23-5 TOURNEVIS LED BULB,TELEPHONE SLIDE,YELLOW CAPACITOR CERAMIC 0.1UF,100V,X7R,10%,RAD KIT TOURNEVIS KIT TOURNEVIS FUSE PULLER LAME TOURNEVIS PLAT PIED A COULISSE MECANIQUE 150MM PIED A COULISSE MECANIQUE 200MM PIED A COULISSE MECANIQUE 150MM PIED A COULISSE MECANIQUE 200MM PIED A COULISSE DIGITAL 150MM PIED A COULISSE DIGITAL 200MM PIED A COULISSE DIGITAL 150MM PIED A COULISSE DIGITAL 200MM PIED A COULISSE DIGITAL 150MM PIED A COULISSE A MONTRE 150MM MICROMETRE MECANIQUE 25-50MM MICROMETRE MECANIQUE 0-25MM MICROMETRE MECANIQUE 25-50MM MICROMETRE COFFRET 0-150MM MICROMETRE DIGITAL 0-25MM MICROMETRE DIGITAL 25-50MM JAUGE DE PROFONDEUR MECANIQUE COMPARATEUR MECANIQUE 10MM COMPARATEUR MECANIQUE 10MM COMPARATEUR DIGITAL 12.7MM COFFRET COMPARATEUR A LEVIER BASE MAGNETIQUE POUR COMPARATEUR MONTURE POUR LOUPE LOUPE 8X LAME TOURNEVIS POZIDRIV LOUPE 10X LOUPE (RETICULE) LOUPE (RETICULE) LOUPE (RETICULE) LOUPE (RETICULE) LOUPE (RETICULE) LOUPE (RETICULE) LOUPE (RETICULE) LOUPE (RETICULE) LOUPE (RETICULE) LAME TOURNEVIS PHILLIPS MICRO SW,STRAIGHT LEVER,SPDT,11A 277V CLE CLE CLE CLE CLE LAME CLE ALLEN HEX CLE ZENER DIODE,2.3W,15V,DO-219AB LAME CLE ALLEN FUSE,CARTRIDGE,3A,6.3X32MM,FAST ACTING FUSE,CARTRIDGE,15A,6.3X32MM,FAST ACT LAME CLE ALLEN LAME CLE ALLEN LAME CLE ALLEN LAME CLE ALLEN CARTE DE DEMO. PICDEM4 CLE ALLEN A ROTULE THERMOSTAT NO 70‹C CLE ALLEN A ROTULE CLE ALLEN A ROTULE CLE ALLEN A ROTULE CLE ALLEN A ROTULE CLE ALLEN A ROTULE CLE ALLEN A ROTULE CAPACITOR ALUM ELEC 220UF,35V,20%,RADIAL CLE ALLEN A ROTULE RECTIFIER,DUAL COMMON CATHODE,16A,TO-220AB LAME CLE ALLEN A BOULE CAPACITOR CERAMIC 0.01UF,100V,X7R,10%,RAD CAPACITOR CERAMIC,1UF,50V,X7R,10%,RADIAL CAPACITOR SILVER MICA 100PF,500V,5%,RAD TEST LEAD SET,TL76 FLUKE TL76 PANEL MOUNT INDICATOR,LED,17.463MM,YELLOW,12V COMPOSITION TOURNEVIS DYNAMO. 75CNM COMPOSITION TOURNEVIS DYNAMO. 2.5NM COMPOSITION TOURNEVIS DYNAMO. 10NM TOURNEVIS DYNAMOMETRIQUE 2.5NM TOURNEVIS DYNAMOMETRIQUE. 10NM CLE DYNAMOMETRIQUE 1-5NM LAME CLE A DOUILLE CLE DYNAMOMETRIQUE 5-25NM CLE DYNAMOMETRIQUE 10-50NM CLE DYNAMOMETRIQUE 20-100NM CLIQUET COMPACT 1/4 CLIQUET COMPACT 3/8 CLIQUET COMPACT 1/2 LAME CLE A DOUILLE LAME CLE A DOUILLE LAME CLE A DOUILLE LAME CLE A DOUILLE LAME CLE A DOUILLE LAME CLE A DOUILLE LAME CLE A DOUILLE LAME RALLONGE TOURNEVIS KIT UNIVERSEL STATION DE SOUDAGE 230V 80W PICKUP TOOL,PEN STYLE,VACUUM,ESD DESOLDERING GUN,ESD Perforated Panel for Enclosures DESOLDERING BRAID,1.5M,PK10 BRAID,DESOLDERING,1.5M,1.5MM DESOLDERING BRAID,2.2M,PK10 DESOLDERING BRAID,2.2M DESOLDERING BRAID,2.7M,PK10 DESOLDERING BRAID,2.7M Perforated Panel for Medium Enclosure CLE ALLEN A BOULE JEU METRIQUE CAPACITOR ALUM ELEC 680UF,25V,20%,AXIAL ZENER DIODE,1W,12V,DO-41 SLEEVING,EXPANDABLE,1.677MM,SILVER GREY,100FT CLE A MOLETTE TELESCOPING SLIDE,21IN,STEEL CLE A MOLETTE PINCE AUTOBLOCANTE PINCE AUTOBLOCANTE RECTANGULAR HAN INSERT,PLUG 16POS SCREW ENCLOSURE,JUNCTION BOX,FIBERGLASS GRAY TERMINAL,FERRULE,6 X 1.1MM,ORANGE POWER RELAY SPST-NO 12VDC,30A,PC BOARD POWER RELAY SPST-NO 24VDC,30A,PC BOARD FILTRE POUR VENTILATEUR PF2000 FILTRE POUR VENTILATEUR PF2500+3000 Ceramic Multilayer Capacitor IC,OP-AMP,3MHZ,15V/ us,DIP-8 BIPOLAR TRANSISTOR,NPN,90V TO-220 RECTANGULAR HOUSING,PLUG,26WAY CONNECTOR,RCA/PHONO,PLUG,3POS CAPACITOR CERAMIC,10UF,16V,Y5V,+80,-20%,1206 CAPACITOR CERAMIC,2.2UF,16V,X5R,10%, TVS DIODE,600W,15V,DO-15 CAPACITOR CERAMIC 4.7UF,6.3V,X5R,10%,0805 POINTEAU 3/16 ALESOIR POIGNEE EN T 3/8 -1´´ TOURNEVIS ESD A FENTE 2X40 TOURNEVIS ESD PH0 TOURNEVIS ESD PH1 TOURNEVIS ESD PZ1 TOURNEVIS A DOUILLE ESD 2.5MM TOURNEVIS A DOUILLE ESD 3.0MM TOURNEVIS A DOUILLE ESD 3.5MM TOURNEVIS ESD TORX T5 TOURNEVIS ESD TORX T6 TOURNEVIS ESD TORX T8 TOURNEVIS ESD TORX T9 TOURNEVIS ESD TORX T10 TOURNEVIS ESD TORX T15 TOURNEVIS ESD TORX T20 CHIP LIFTER,ESD TOURNEVIS DYNAMOMETRIQUE 0.8-2NM TOURNEVIS DYNAMOMETRIQUE 1-5NM TOURNEVIS DYNAMOMETRIQUE 0.9NM TOURNEVIS DYNAMOMETRIQUE 1.1NM TOURNEVIS DYNAMOMETRIQUE 2.0NM LAME DE TOURNEVIS PLAT 0.6X3.5 LAME DE TOURNEVIS PLAT 0.8X4 LAME DE TOURNEVIS PH000 LAME DE TOURNEVIS PH00 LAME DE TOURNEVIS PH0 LAME DE TOURNEVIS PZ0 LAME DE TOURNEVIS PZ1 LAME DE TOURNEVIS T5 LAME DE TOURNEVIS T6 LAME DE TOURNEVIS T8 LAME DE TOURNEVIS T10 LAME DE TOURNEVIS T15 LAME DE TOURNEVIS T20 LAME DE TOURNEVIS T25 LAME DE TOURNEVIS MALE 6 PANS 1.5 LAME DE TOURNEVIS MALE 6 PANS 2 LAME DE TOURNEVIS MALE 6 PANS 2.5 LAME DE TOURNEVIS MALE 6 PANS 3 LAME DE TOURNEVIS MALE 6 PANS 4 ADAPTOR BLADE,BIT HOLDER KIT DE MAINTENANCE DS22 TOURNEVIS POZIDRIV PZ1 TOURNEVIS POZIDRIV PZ2 TOURNEVIS TORX T7 TOURNEVIS TORX T15 TOURNEVIS TORX T27 TOURNEVIS TORX T30 TOURNEVIS TORX T40 TOURNEVIS ISOLE 1000V PZ1 TOURNEVIS ISOLE 1000V PZ2 TOURNEVIS ISOLE 1000V PZ3 JEU TOURNEVIS ISOLE 1000V TOURNEVIS BURIN PLAT 4.5 TOURNEVIS BURIN PLAT 5.5 TOURNEVIS BURIN PLAT 7 TOURNEVIS BURIN PLAT 10 TOURNEVIS BURIN PLAT 12 TOURNEVIS BURIN PH2 TOURNEVIS BURIN PH3 TOURNEVIS BURIN PH4 TOURNEVIS BURIN PZ1 TOURNEVIS BURIN PZ2 CAPACITOR CERAMIC 33PF 50V,C0G,5%,0402 INDICATEUR 0-1MA 45X45MM INDICATEUR 0-3A 45X45MM INDICATEUR 0-5A 45X45MM INDICATEUR 0-30V 45X45MM INDICATEUR 0-1MA 60X60MM INDICATEUR 0-20MA 60X60MM INDICATEUR 0-5A 60X60MM INDICATEUR 0-10A 60X60MM INDICATEUR 0-15A 60X60MM INDICATEUR 0-30A 60X60MM INDICATEUR 0-100UA 81X81MM INDICATEUR 0-50A 81X81MM INDICATEUR 0-30V 81X81MM INDICATEUR 0-300V 81X81MM FUSE,15A,600V,TIME DELAY ADAPATEUR BNCFEMELLE -2 FICHES 4MM ADAPTATEUR BNC MALE-2 BORNES 4MM FICHE FEMELLE 4MM NOIR FICHE FEMELLE 4MM ROUGE TEST LEAD,50R RG58,30CM TEST LEAD,50R RG58,600MM TEST LEAD,50R RG58 TEST LEAD,75R RG59 TEST LEAD,50R RG174,30CM TEST LEAD,50R RG174,60CM TEST LEAD,50R RG174 LEAD,BNC S TO MICROGRABBER CLIPS CORDON A FICHES BANANES 4MM 0.5M DOUBLE FICHE BANANE NOIRE DOUBLE FICHE BANANE NOIRE DOUBLE FICHE BANANE ROUGE SOCKET,4MM,UNINSULATED COFFRET 482X330MMX2U NOIR COFFRET 482X330MMX3U NOIR COFFRET 482X330MMX4U NOIR COFFRET 482X330MMX5U NOIR COFFRET 482X330MMX6U NOIR COFFRET 482X330MMX7U NOIR COFFRET 482X330MMX8U NOIR COFFRET 482X431MMX5U NOIR COFFRET 482X431MMX6U NOIR COFFRET 482X431MMX7U NOIR COFFRET 482X431MMX8U NOIR COFFRET ABS F-LID GY 86X56X25 COFFRET ABS NOIR 120X120X94 COFFRET ABS GRIS 86X56X39 COFFRET ABS GRIS 110X82X44 COFFRET ABS GRIS 120X120X94 COFFRET ABS GRIS 121X94X34 COFFRET MOULE 118X93X34 NOIR COFFRET MOULE 119X119X59 NOIR COFFRET MOULE 119X119X94 NOIR COFFRET MOULE 121X66X39 NOIR COFFRET MOULE 125X125X79 NOIR COFFRET MOULE F-LID 92X38X31 COFFRET MOULE F-LID 100X50X25 COFFRET MOULE F-LID 110X81X44 COFFRET MOULE F-LID 118X93X34 COFFRET MOULE F-LID 119X119X59 COFFRET MOULE F-LID 120X94X56 COFFRET MOULE F-LID 121X66X39 COFFRET MOULE F-LID 153X82X50 COFFRET MOULE F-LID 187X119X82 COFFRET MOULE F-LID 187X187X67 COFFRET MOULE F-LID 188X119X37 COFFRET MOULE IP65 50X50 X31 COFFRET MOULE IP65 92X38X31 COFFRET MOULE IP65 110X81X44 COFFRET MOULE IP65 118X93X34 COFFRET MOULE IP65 119X119X94 COFFRET MOULE IP65 120X79X59 COFFRET MOULE IP65 121X66X39 COFFRET MOULE IP65 153X82X50 COFFRET MOULE IP65 187X119X56 COFFRET MOULE IP65 187X187X67 COFFRET IP65 F-LID 50X50 X31 COFFRET IP65 F-LID 111X59X31 COFFRET IP65 F-LID 118X93X34 COFFRET IP65 F-LID 187X119X56 COFFRET IP65 F-LID 192X111X61 Flip Flop Logic IC RELAIS SECURITE 24VAC/DC RELAIS SECURITE 240VAC RELAIS SAFETY 24VAC/DC CONDUIT CORD CONNECTOR CARTOUCHE ENCRE COMP. CANON NOIRE CARTOUCHE ENCRE COMP. EPSON COULEUR CARTOUCHE ENCRE COMP. EPSON COULEUR FAST RECOVERY DIODE,5A,400V DO-27 BANANA PLUG,15A,SCREW,BLACK RELAIS 24VCC 4PCO RESISTOR,METAL FILM,500 OHM,125mW,0.1% RELAIS CI DPCO 5VCC RELAIS CI DPCO 12VCC RELAIS CI DPCO 24VCC RELAIS CI DPCO 24VCC RELAIS CMS DPCO 12VCC RELAIS CMS DPCO 3VCC RELAIS CMS DPCO 5VCC RELAIS CMS DPCO 24VCC RELAIS CI SPCO 24VCC RELAIS CI SPCO 24VCC BANDE 232X10 (PQ5) IC,16BIT MCU,MSP430F1,8MHZ,20-TSSOP REED RELAY,SPST-NO,12VDC,3A,THD FUSIBLE CMS OMT125 T 2.0A FUSIBLE CMS 5X20MM T 0.315A FUSIBLE CMS 5X20MM T 1.25A FUSIBLE CMS 5X20MM T 1.6A FUSIBLE CMS 5X20MM T 3.15A FUSIBLE CMS 5X20MM T 4A FUSIBLE CMS 5X20MM T 5A FUSIBLE CMS 5X20MM T 10A FUSIBLE CMS 5X20MM TT 1.0A FUSIBLE CMS 5X20MM TT 1.25A FUSIBLE CMS 5X20MM T HBC 1A FUSIBLE CMS 5X20MM T HBC 1.6A FUSIBLE CMS 5X20MM T HBC 5A FUSIBLE CMS 5X20MM T HBC 6.3A SCOPEMETER,EURO VER FLUKE 124/001 TUBING,SPLIT LOOM,15.571MM,BLACK,50FT DECAPEUR THERMIQUE GHG 660 LCD ASPIRATEUR GAS 25 EURO MECHE HELICOIDALE A BOIS 3X30MM MECHE HELICOIDALE A BOIS 4X40MM MECHE HELICOIDALE A BOIS 5X45MM MECHE HELICOIDALE A BOIS 6X50MM MECHE HELICOIDALE A BOIS 8X65MM MECHE HELICOIDALE A BOIS 10X75MM FORET SDS-MAX QUADRO-X 16X400MM FORET SDS-MAX QUADRO-X 20X400MM FORET SDS-MAX QUADRO-X 22X400MM FORET SDS-MAX QUADRO-X 25X400MM FORET SDS-MAX QUADRO-X 28X450MM SCIE TREPAN BIM POWER CHANGE 19MM SCIE TREPAN BIM POWER CHANGE 21MM SCIE TREPAN BIM POWER CHANGE 25MM SCIE TREPAN BIM POWER CHANGE 29MM SCIE TREPAN BIM POWER CHANGE 32MM SCIE TREPAN BIM POWER CHANGE 35MM SCIE TREPAN BIM POWER CHANGE 44MM SCIE TREPAN BIM POWER CHANGE 51MM SCIE TREPAN BIM POWER CHANGE 57MM SCIE TREPAN BIM POWER CHANGE 60MM SCIE TREPAN BIM POWER CHANGE 64MM SCIE TREPAN BIM POWER CHANGE 76MM COFFRET UNIVERSEL 11 PIECES TREPANS ADAPTATEUR SDS-PLUS P. CHANGE FORET DE CENTRAGE HSS POUR P. CHANGE FORET DE CENTRAGE HSS-CO POUR P. CHANGE SET D´ADAPTATEURS DE TRANSITION BURIN POINTU SDS-MAX 280MM 5 FEUILLES ABRASIVES 150MM G80 5 FEUILLES ABRASIVES 150MM G120 10 BANDES ABRASIVES 75X533 G40 10 BANDES ABRASIVES 75X533 G60 10 BANDES ABRASIVES 75X533 G80 DISQUE DIAMANT 125MM 5 LAMES SABRES TOLES MINCES 5 LAMES SABRES TOLES EPAISSES IC,OP-AMP,1MHZ,0.5V/ us,DIP-14 MONITEUR. SOUS-VITESSE Voltage Regulator IC COMMUTATEUR SPDT PT10 COFFRET PLASTIQUE COMBINORM COFFRET PLASTIQUE COMBINORM COFFRET PLASTIQUE EUROMAS 2 COFFRET PLASTIQUE UNIVERSEL MULTIFUNCTION COUNTER INPUT I/O MODULE I/O MODULE SOLID STATE RELAY TERMINAL,RING TONGUE,#10,CRIMP YELLOW FAN FILTER MEDIA FAN FILTER MEDIA FAN FILTER MEDIA RF/COAXIAL ADAPTER SMA JACK-1.0/2.3 PLUG SWITCH,PADDLE,SPDT,3A,250V FUSE,CARTRIDGE,4A,5X20MM,FAST ACTING FUSE,CARTRIDGE,6A,5X20MM,FAST ACT CAP MOUNTING BRACKET,2.91´´ BASE FERRITE CORE,CYLINDRICAL,96OHM/100MHZ,300MHZ Connector Engineering Kit,500 Series,L RF/COAXIAL SMA PLUG R/A 50 OHM CRIMP/SLDR RF/COAXIAL SMA PLUG STR 50 OHM CRIMP/SLDR RF/COAXIAL SMA PLUG STR 50 OHM CRIMP/SLDR RF/COAXIAL SMA PLUG STR 50 OHM CRIMP/SLDR RF/COAXIAL SMA PLUG R/A 50 OHM CRIMP/SLDR RF/COAXIAL SMA PLUG STR 50 OHM CRIMP/SLDR RF/COAXIAL,SMA PANEL JACK,50 OHM SOLDER RF/COAXIAL,SMA PANEL JACK,50 OHM SOLDER RF/COAXIAL,MMCX PLUG,50 OHM,CRIMP/SLDR RF/COAXIAL,MMCX PLUG,R/A,50 OHM SOLDER RF/COAXIAL,MMCX JACK,R/A,50 OHM,THD CABLE STRIPPER MODULAR BATTERY CONTACT,2 WAY,3A RF/COAXIAL SMB BHD JACK STR 50 OHM SOLDER SWITCH,PUSHBUTTON,SPST-NO,400mA,125V,SOLDER SWITCH,PUSHBUTTON,SPST-NO,400mA,32V,SOLDER RF/COAXIAL ADAPTER,BNC JACK-BNC PLUG RETRACTABLE SHEATH BANANA PLUG,20A,SOLDER,RED Square pin receptacle to banana plug,re SPADE LUG TO BANANA JACK,15A MINIGRABBER TO MULTIMETER PLUG AND KIT SMD TEST PROBE CONNECTOR FUSE,BLADE,40A,32V,FAST ACTING FUSE,CARTRIDGE,1A,5X20MM,FAST ACTING FUSE,CARTRIDGE,10A,5 X 20MM,FAST ACTING FUSE,CARTRIDGE,5A,5X20MM,FAST ACTING FUSE,CARTRIDGE,8A,5X20MM,FAST ACTING FUSE HOLDER,0.8 X 7.9MM,IN LINE Fuse holder,GMF and GRF fuse,15 A curr FUSE,20A,600V,TIME DELAY FUSE,30A,600V,TIME DELAY FUSE,50A,600V,TIME DELAY SSR,PANEL MOUNT,240VAC,32VDC,10A I/O MODULE TERMINAL,FERRULE,0.31IN,RED POINTER BAR SKIRTED CONTROL KNOB,6.35MM Shielded Multiconductor Cable COAXIAL CABLE,RG-58C/U,36IN,BLACK CABLE PROTECTION RECTANGULAR POWER CONNECTOR,SOCKET,5 HAN INSERT,RECEPTACLE,42WAY,CRIMP BULKHEAD HOUSING,SIZE 16B,METAL BULKHEAD HOUSING,SIZE 16B,METAL SPLIT HOOD,SIZE 24B,METAL CONNECTOR CONTACT,MALE,14AWG,CRIMP ADAPTER,PG 16 TO 1/2IN NPT CABLE ENTRY SENSOR,PHOTOELECTRIC,5MM,NPN LED T-3/4 RIGHT ANGLE 5v PCB COLOR: RED THERMOCOUPLE CONNECTOR LDR,500KOHM,50mW,VT200 SERIES ENCLOSURES,ACCESSORIES FAN FILTER MEDIA Panels for Enclosures Panels for Enclosures Panels for Enclosures Panels for Enclosures ENCLOSURE,WALL MOUNT,ALUMINIUM,NATURAL Steel Panel Mounting Foot Kit for Wall Cabinet ENCLOSURE ENCLOSURE ENCLOSURE,PUSH BUTTON,2 HOLE,PC Panel for QLINE Series Polycarbonate Enc ENCLOSURE,PUSH BUTTON,3 HOLE,PC Hydraulic,Crimp,Tool FUSE,CARTRIDGE,2A,6.3X25.4MM,FST ACT FUSE,CARTRIDGE,10A 6.3X32MM TIME DELAY FUSE,CARTRIDGE,12A 6.3X32MM TIME DELAY FUSE,CARTRIDGE,15A 6.3X32MM TIME DELAY STANDARD DIODE,70A,400V,DO-203AB FAST DIODE,85A,1KV,DO-203AB IC,STEP-DOWN REGULATOR,8-SOIC LED,RED,1.35MM,1.47CD,634NM LENS,ROUND,BLUE CAPACITOR CERAMIC 0.01UF,100V,X7R,10%,RAD SHLD MULTICOND CABLE,4COND,24AWG,1000FT,300V TERMINAL,RING TONGUE,#6,CRIMP,BLUE UNSHLD MULTICOND CABLE 3COND 22AWG 1000FT TERMINAL BLOCK JUMPER,10WAY TERMINAL BLOCK,FUSED,22-12AWG,5MM TERMINAL BLOCK,FUSED,22-10AWG,5MM LAMP,INCANDESCENT,BI PIN,28V STANDARD DIODE,40A,300V,DO-203AB PANEL ELECTROMECHANICAL COUNTER CONNECTOR ASSEMBLIES,LEAD SET TEST PIN HEADER,2POS,5.08MM Connector Number of Contacts:12 TERMINAL BLOCK PLUGGABLE,4POS,26-12AWG TERMINAL BLOCK PLUGGABLE,5POS,26-12AWG TERMINAL BLOCK JUMPER,2WAY,6.1MM TERMINAL BLOCK PLUGGABLE,5POS,28-14AWG TERMINAL BLOCK,PCB,2POS PIN HEADER,4POS,3.5MM PIN HEADER,6POS,3.5MM Pin Header Number of Contacts:3 TERMINAL BLOCK,PCB,2POS,22-14AWG TERMINAL BLOCK,PCB,3POS,22-14AWG I/O MODULE LAMP,INCANDESCENT SWITCHING ELEMENT,2NO,10A,SCREW SHLD MULTIPR CABLE 3PR 500FT 300V CHR SWITCHING ELEMENT,2NC,10A,PLUG-IN OUTPUT MODULE Resistors,Shunt Output Voltage:50mV CAPACITOR POLY FILM FILM 0.1UF,5%,50V, IC,ANALOG SWITCH,QUAD,SPST,SOIC-16 IC,ANALOG SWITCH,QUAD,SPST,SOIC-16 IDC,Connector,Contact Count 50,Curren SWITCH,INDUSTRIAL PUSHBUTTON,22MM FUSE,CARTRIDGE,630mA,5X20MM,FAST ACT FUSE,CARTRIDGE,1.25A,5X20MM,FAST ACT FUSE,CARTRIDGE,2A,5X20MM,FAST ACTING FUSE,CARTRIDGE,6.3A,5X20MM,FAST ACT FUSE,CARTRIDGE,2A,5X20MM,TIME DELAY FUSE,CARTRIDGE,2A,6.3X32MM TIME DELAY TERMINAL BLOCK,DIN RAIL,4POS,22-10AWG TERMINAL BLOCK PLUGGABLE,8POS,26-14AWG TERMINAL BLOCK,BARRIER,8POS,22-12AWG TEST CLIP,1POS BANANA PLUG,15A,SCREW,BROWN TEST CLIP,1POS TEST CLIP,1POS TERMINAL,BUTT SPLICE,IDC,RED TERMINAL BLOCK,PCB,2POS,24-14AWG POWER RELAY,3PDT,24VDC,10A,PLUG IN POWER RELAY,3PDT,12VDC,10A,PLUG IN POWER RELAY,3PDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN POWER RELAY,DPDT,12VDC,10A,PLUG IN POWER RELAY,DPDT,24VAC,10A,FLANGE POWER RELAY,DPDT,12VDC,10A,FLANGE CENTRIFUGAL BLOWER,97MM,230VAC DC BLOWER,51 X 15MM,12V CABLE,COAXIAL,RG-6/U,18AWG,500FT,BLACK COAXIAL CABLE,RG-58A/U,500FT,BLACK COAXIAL CABLE,RG-58A/U,1000FT,BLACK SHLD MULTIPR CABLE 1PR 500FT 300V BLK SHLD MULTIPR CABLE 1PR 500FT 300V CHR SHLD MULTICOND CABLE,3COND,18AWG,1000FT,300V SHLD MULTICOND CABLE,3COND,22AWG,500FT,300V TEST PROD WIRE,1000FT,18AWG CU RED SHLD MULTICOND CABLE,4COND,18AWG,500FT,300V SHLD MULTICOND CABLE,3COND,24AWG,1000FT,300V SHLD MULTICOND CABLE,8COND,24AWG,500FT,300V CABLE,SHLD MULTICOND,9COND,24AWG,500FT,300V SHLD MULTICOND CABLE,3COND,22AWG,500FT,300V END CLAMP,DIN-RAIL TERMINAL BLOCK END PLATE,AB1 SERIES TERMINAL BLOCK TERMINAL BLOCK,DIN RAIL,2POS,22-10AWG SWITCH,SAFETY INTERLOCK,1NO/2NC,10A SWITCH,SAFETY INTERLOCK,1NO/1NC,10A SAFETY LOCK SWITCH KEY SAFETY INTERLOCK SWITCH KEY SAFETY INTERLOCK SWITCH KEY SAFETY INTERLOCK SWITCH KEY WIRE ACCESSORIES 16C1258 FICHE JACK STEREO 3.5MM SECTIONNEUR 100A CONNECTOR,PHONO,PLUG,1WAY CONNECTOR,RCA/PHONO,PLUG,1POS PROXIMITY SENSOR SURFACE MOUNT BOX,PLASTIC,1 MOD,WHITE Connector Wall Plate Color:Off White LAMP,LED REPLACEMENT,WHITE LAMP,LED REPLACEMENT,GREEN LAMP,LED REPLACEMENT,RED Multichip LED LAMP,LED REPLACEMENT,GREEN LAMP,LED REPLACEMENT,BLUE LAMP,INCANDESCENT,24V,7W LAMP,INCANDESCENT,24V,5W LAMP,INCANDESCENT,120V,7W LAMP,INCANDESCENT,24V,10W LAMP,INCANDESCENT,120V,10W RELAY HEAT SINK DIVIDE BY 2,4/6,CLOCK GENERATION CHIP Mounting Bracket Lamp accessory LAMP,INDICATOR,STEADY,LIGHT,GRN LAMP,INDICATOR,STEADY,LIGHT,RED LAMP,IND,STEADY,LIGHT,ORANGE LAMP INDICATOR STEADY LIGHT BLUE LAMP INDICATOR STEADY LIGHT CLEAR LAMP,IND,STEADY,LIGHT,YELLOW LAMPS,INDICATOR,STACKABLE,LAMPS,STAC Indicator Lamp LAMP INDICATOR FLASHING LIGHT RED AUDIBLE UNIT,BUZZER,90DBA,48V AUDIBLE UNIT,BUZZER,90DBA,230VAC LENS,RECTANGULAR,YELLOW CABLE ID MARKERS INDUCTIVE PROXIMITY SENSOR CONTACTOR+STARTER CONTACT KIT 600VAC 1AM LENS,ROUND,BLUE SWITCH,ROCKER,DPST,20A,250V,BLACK LENS,SQUARE,BLUE POWER RELAY,DPDT,12VDC,8A,PC BOARD SWITCH,EMERGENCY STOP,1NO/1NC,240VAC LED Lamp Pushbutton Switch Rotary Keylock Switch CONTACT BLOCK,1NO/1NC,6A,SCREW/CLAMP Switch Legend Plate SWITCH ACTUATOR SWITCH ACTUATOR SWITCH ACTUATOR INDICATOR,LED PANEL MNT,WHITE,24V INDICATOR,LED PANEL MNT,YELLOW,24V INDICATOR,LED PANEL MNT,GREEN,120V Programmable digital down converter,4 c SUPPORT TUBE Film Capacitor Film Capacitor Film Capacitor Film Capacitor LATCHING POST,M2 X 0.4,MINIATURE CONN COAXIAL CABLE,RG-8/U,100FT,BLACK IC ADAPTER,8-SOIC TO 8-DIP CHIP INDUCTOR 100NH 300MA 5% 850MHZ CHIP INDUCTOR 150NH 200MA 5% 680MHZ TAPE,DUCT,PVC,GRAY,2INX50YD POWER RELAY,DPDT,120VAC,30A,FLANGE SIDE CUTTER,FULL FLUSH,22MM,120MM CABLE GUIDE,HINGED,STEEL,BLACK FAN PANEL,5.25INX19IN FAN PANEL,7INX19IN FAN GRILL PANEL,5.22INX19IN RF/COAXIAL,SMA PLUG,STR,50 OHM,CRIMP FILTER FAN GRILL,4.13INX4.13IN FILTER FAN GRILL,4.13INX4.13IN FILTER FAN GRILL,4.13INX4.13IN INSPECTION LAMP,110VAC Tools,Cutters 7 HEAVY-DUTY DIAGONAL CUTTERS INSPECTION LAMP,24VAC/DC,11W POWER RELAY,DPDT,24VDC,30A,FLANGE CONTACTEUR ETANCHE 12VDC CONNECTOR ASSEMBLIES CONNECTOR ASSEMBLIES CONTACTEUR ETANCHE 24VDC Terminal block,spring type termination DIGITAL HOUR METER RESISTOR,POWER,100 OHM,600W,10% END PLATE,AB1 SERIES TERMINAL BLOCK PARTITION PLATE,AB1 TERMINAL BLOCK TERMINAL BLOCK,DIN RAIL,2POS,22-12AWG TERMINAL BLOCK,DIN RAIL,2POS,22-12AWG TERMINAL BLOCK,DIN RAIL,2POS,22-12AWG TERMINAL BLOCK,DIN RAIL,2POS,22-10AWG TERMINAL BLOCK,DIN RAIL,2POS,22-10AWG TERMINAL BLOCK,DIN RAIL,2POS,22-10AWG TERMINAL BLOCK,DIN RAIL,2POS,22-10AWG Lever Switch Actuator PLUG & SOCKET HOUSING,PLUG,NYLON WIRE-BOARD CONN,SOCKET,26POS,2.54MM WIRE TO BOARD,RECEPTACLE,24POS,2.54MM BRIDGE RECTIFIER,1PH,25A,200V QC BRIDGE RECTIFIER,1PH,25A,400V QC BRIDGE RECTIFIER,1PH,25A 400V THD CAPACITOR ALUM ELEC 2200UF,10V,20%,RADIAL CAPACITOR POLY FILM 0.022UF,250V,10%, CAPACITOR POLY FILM 0.22UF,63V,10%,RADIAL CAPACITOR POLY FILM FILM 0.1UF,5%,63V, CAPACITOR POLY FILM 0.22UF,250V,10%,RADIAL CAPACITOR POLY FILM 2.2UF,250V,10%,RA CAPACITOR POLY FILM 3.3UF,250V,10%,RADIAL CAPACITOR POLY FILM 0.15UF,250V,5%,RA Film Capacitor Film Capacitor SWITCH,VANDAL RESISTANT,SPST,50mA BIPOLAR TRANSISTOR,NPN,45V BIPOLAR TRANSISTOR,PNP,-60V ZENER DIODE,500mW,24V,DO-35 ZENER DIODE,500mW,33V,DO-35 ZENER DIODE,500mW,6.2V,DO-35 ZENER DIODE,350mW,11V,SOT-23 ZENER DIODE,1W,11V,DO-41 ZENER DIODE,1W,24V,DO-41 ZENER DIODE,1W,3.6V,DO-41 ZENER DIODE,1W,33V,DO-41 ZENER DIODE,1W,4.3V,DO-41 ZENER DIODE,1W,4.7V,DO-41 ZENER DIODE,1W,8.2V,DO-41 ZENER DIODE,1W,9.1V,DO-41 POWER ENTRY MODULE,PLUG,10A SMALL SIGNAL DIODE 125V 200mA LL-34 Ultra Fast Recovery Power Rectifier DIODES,FAST RECOVERY POWER ROHS COMPLIA BRIDGE RECTIFIER,1PH,12A,200V QC BRIDGE RECTIFIER,1PH,25A 600V THD BRIDGE RECTIFIER,1PH,35A 600V THD BRIDGE RECTIFIER,1PH,4A,100V THD BRIDGE RECTIFIER,1PH,6A,200V THD BRIDGE RECTIFIER,1PH,6A,1KV,THD Bridge Rectifier Bridge Rectifier Bridge Rectifier Bridge Rectifier IC,OP-AMP,0.6V/ us,SOIC-8 IC,LINEAR VOLTAGE REGULATOR,5V,DPAK-2 BIPOLAR TRANSISTOR,NPN,60V SOT-23 Zener Diode ZENER DIODE,500mW,6.8V,SOD-123 ZENER DIODE,500mW,3.6V,SOD-123 ZENER DIODE,500mW,14V,SOD-123 SCHOTTKY RECTIFIER,1A,80V,DO-41 SCHOTTKY RECTIFIER,5A 80V DO-201AD TVS DIODE,600W,120V,DO-214AA TVS DIODE,600W,40V,DO-214AA TVS DIODE,600W,64V,DO-214AA TVS DIODE,600W,75V,DO-214AA TVS DIODE,1.5KW,51V,DO-214AB TVS DIODE,1.5KW,58V,DO-214AB TVS DIODE,1.5KW,64V,DO-214AB DARLINGTON TRANSISTOR,PNP,-100V TO-220 DARLINGTON TRANSISTOR,PNP,-60V,TO-220 TVS DIODE,1.5KW,82V,DO-201AE SMALL SIGNAL DIODE 200V 500mA DO-35 ZENER DIODE,1W,3.9V,DO-41 ZENER DIODE,1W,4.3V,DO-41 SMALL SIGNAL DIODE,80V 200mA DO-35 ZENER DIODE,500mW,3.9V,DO-35 ZENER DIODE,500mW,4.3V,DO-35 Zener Diode DIODE ZENER DIODE,500mW,25V,DO-35 ZENER DIODE,500mW,28V,DO-35 DIODE Diode Zener Diode Zener Diode Diode Bridge Rectifier Film Capacitor TERMINAL BLOCK,DIN RAIL,2POS,22-8AWG TERMINAL BLOCK,FUSED,22-12AWG,5X20MM TERMINAL BLOCK,FUSED,22-10AWG,1/4IN RF/COAXIAL,BNC PLUG,STR,75 OHM,CRIMP INTERFUSE SINGLE MODE FIXED ATTENUATOR INTERFUSE SINGLE MODE FIXED ATTENUATOR SWITCHING ELEMENT,1NO,10A,SCREW Composite Cable CAPACITOR CERAMIC 0.047UF 50V,X7R,10%,1210 CAPACITOR CERAMIC 22PF 100V,C0G,5%,RAD CAPACITOR CERAMIC 220PF 100V,C0G,5%,RAD CAPACITOR CERAMIC 33PF 100V,C0G,5%,RAD CAPACITOR CERAMIC 470PF 100V,C0G,5%,R CAPACITOR CERAMIC 0.01UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 0.1UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 0.1UF,50V,Z5U,20%,RAD CAPACITOR CERAMIC 0.22UF,50V,Z5U,20%,RAD CAPACITOR CERAMIC 0.33UF,50V,Z5U,20%,RAD CAPACITOR CERAMIC,1UF,50V,Z5U,20%,RADIAL ROULEAU POUR DYMO BLANC 19MM ROULEAU POUR DYMO JAUNE 19MM DIP Rotary Switch PROTECTIVE COVER SWITCHING ELEMENT,2NO,10A,PLUG-IN FEMALE SCREWLOCK,4-40 LINEAR POSITION SENSOR TERMINAL BLOCK,DIN RAIL,2POS,26-12AWG TERMINAL BLOCK,DIN RAIL,2POS,26-12AWG TERMINAL BLOCK,DIN RAIL,2POS,26-8AWG TERMINAL BLOCK,DIN RAIL,2POS,16-8AWG TERMINAL BLOCK,DIN RAIL,26-12AWG TERMINAL BLOCK,FUSED,26-8AWG,5MM END PLATE TERMINAL BLOCK END PLATE DIN MOUNTING RAIL,35MM,STEEL DIN MOUNTING RAIL,35MM,STEEL INDUCTIVE PROXIMITY SENSOR LAMP,INCANDESCENT,G6.35,24V,150W SWITCH,PUSHBUTTON,SPST-NO,500mA,250V SWITCH,PUSHBUTTON,SPST-NO,500mA,250V SWITCH,TACTILE SPST,50mA,THROUGH HOLE SWITCH,TACTILE SPST,50mA,THROUGH HOLE SWITCH,TACTILE SPST,50mA,THROUGH HOLE SWITCH,TACTILE SPST,50mA,THROUGH HOLE SWITCH,TACTILE SPST,50mA,THROUGH HOLE SWITCH,TACTILE SPST,50mA,THROUGH HOLE SWITCH,TACTILE SPST,50mA,THROUGH HOLE LED BULB,WHITE,10MM SWITCH,ROCKER,SPDT,4A,250V,BLACK SWITCH,TACTILE SPST,50mA,THROUGH HOLE SWITCH,TACTILE SPST,50mA,THROUGH HOLE COMPUTER CABLE,SCSI,3FT,GRAY RONDELLE CUIVRE M5 PQ50 LAMP,INCANDESCENT,GX5.3,19V,80W LAMP,INCANDESCENT,GY6.35,12V,100W COAXIAL CABLE STRIPPER D/A Converter (D-A) IC D/A Converter (D-A) IC ULTRACLENS 200ML AEROSOL ULTRACLENS 400ML AEROSOL IC,LDO VOLT REG,2.8V,150mA,5-SOT-23 IC,ADJ LDO REG 1.2V TO 5.5V 50mA 8-SOIC Digital Pushwheel Switch MICRO-D CONNECTOR,RECEPTACLE,25POS,SOLDER 18 series miniature DIN circular connect THERMOCOUPLE CONNECTOR SurePunch Punchdown Tool w/110 and 66 Re CRIMPALL 8000 CRIMPER W/DIE THERMOCOUPLE CONNECTOR COOLING FAN,140CFM,32W SWITCH BOOT SWITCH,PUSHBUTTON,SPDT,10mA COAXIAL ADAPTER,OSMT R/A JACK-SMA PLUG FRONT ADAPTER,22.5MM KEYLOCK SWITCH BANANA JACK,15A,TURRET,RED BANANA JACK,15A,TURRET,BLACK STRAIN RELIEF BOOT,PVC TEST CLIP,MINIGRABBER,RED,5A MINIATURE ALLIGATOR TEST CLIP,RED BANANA JACK,15A,CRIMP/SOLDER,BLACK BANANA JACK,25A,SOLDER,RED Banana Jack w/ .025-In. Square Pin,10 P BATTERY STRAP,9V,WIRE LEAD CAPACITOR POLY FILM 0.047UF,100V,5%,RAD CAPACITOR POLY FILM FILM 1UF,5%,63V, CRIMP TOOL,HAND,OPEN / CLOSED BARREL TERMINALS,CONTACTS,SPLICES FUSE,11A,1KV,FAST ACTING MICRO SWITCH,PLUNGER,SPDT,20A,500V MICRO SWITCH,HINGE LEVER,SPDT 20A 500V ADAPTER SET,SPADE LUG TO BANANA JACK,15A BOARD-BOARD CONN,HEADER,36WAY,1ROW Inductive Proximity Sensors TERMINAL,FEMALE DISCONNECT 0.187IN BLUE PROXIMITY SWITCH,M30 NPN INDUCTIVE PROXIMITY SENSORS SOLID STATE TIMER BATTERY STRAP,9V,WIRE LEAD SEALING BOOT CIRCULAR CONTACT SOCKET,24-20AWG,CRIMP SWITCH,SAFETY INTERLOCK,SPDT-DB,15A,250V MICRO SWITCH,ROLLER LEVER SPDT 15A 480V Switches,Touch key/tactile Switch Type: Snap Action Basic Switch SWITCH,TOGGLE,DPDT,20A,277V Pushbutton Switch BASIC SWITCH,STRAIGHT LEVER,DPDT,15A,480V BASIC SWITCH,PIN PLUNGER,SPDT,15A,480V Snap Action Basic Switch BASIC SWITCH,ROLLER PLUNGER,SPDT,15A,480V BASIC SWITCH,OT PLUNGER,SPDT,15A,115V Limit Switch LIMIT SWITCH,TOP PLUNGER,SPDT-1NO/1NC SWITCH ACTUATOR SWITCH ACTUATOR FAN FILTER W/ EXHAUST GRILLE FAN FILTER W/ EXHAUST GRILLE FAN FILTER W/ EXHAUST GRILLE FAN BOX,295.4 X 330.2MM,115VAC FAN BOX,143 X 187.5MM,115VAC SPRING CONTACT RECEPTACLE,PCB,CRIMP Inductive Proximity Sensors INDUCTIVE PROXIMITY SENSORS Inductive Proximity Sensors Proximity Sensor Output Type:Transistor INDUCTIVE PROXIMITY SENSORS INDUCTIVE PROXIMITY SENSOR Proximity Sensor POT,COND PLASTIC,1KOHM,20%,1W LAMP,INCANDESCENT,MINI BAYONET,120V CAPACITOR CERAMIC,4.7UF,16V,X5R,10%,1206 WIRE-BOARD CONN,SOCKET,60POS,2.54MM ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,ALUMINIUM BANANA PLUG,15A,CRIMP/SOLDER BLACK/RED SWITCH,KEYPAD,1X4,50mA,24V,POLYMER MOUNTING BRACKET,CABINET RACKS,STEEL SWITCH ACTUATOR TERMINAL,RING TONGUE,#10,CRIMP PROCESS METER TERMINAL,MALE DISCONNECT,6.35MM,SCREW CONTACT,PIN,12-10AWG,CRIMP PROCESS METER TERMINAL,FEMALE DISCONNECT,6.35MM,16-14AWG,BLUE MICRO SWITCH,ROLLER LEVER SPDT 11A 250V MICRO SWITCH,PIN PLUNGER,SPDT 16A 250V Phase Meter Leaded Process Compatible:No SWITCH PANEL PLUG NYLON SPACER ASSORTMENT CIRCULAR CONNECTOR PLUG,SIZE 12,8POS,CABLE CAPACITOR CERAMIC,1UF,50V,X7R,20%,RADIAL CIRCULAR CABLE CLAMP,STR,SZ 14/14S,METAL FAN FILTER W/ EXHAUST GRILLE PHOTOELECTRIC SENSOR CAPACITOR POLY FILM FILM 0.1UF 10%,250V TERMINAL,MALE DISCONNECT,0.25IN,THD BANANA PLUG,5A,TURRET TERMINAL COMPRESSION LUG,0.146IN SOLDER I/O MODULE RELAY SOCKET DIGITAL GENERAL PURPOSE TIMER CRIMP TOOL SOLID STATE TIMER,DPDT,12MIN,120VAC DIGITAL HOUR METER PIN RECEPTACLE,PC BOARD,SOLDER Multipole Connector CRIMP TOOL,ANDERSON CRIMP TERMINALS ELECTROMECHANICAL MULTIFUNCTION TIMER CAPACITOR CERAMIC 2200PF,100V,X7R,10%,RAD PLUG & SOCKET HOUSING,RECEPTACLE,14 POS,1 ROW SWITCH LEGEND PLATE CIR CONNECTOR RCPT SIZE 20 14POS FREE HANGING Pushbutton Switch RF TRANSISTOR,NPN,25V BIPOLAR TRANSISTOR,PNP,-24V ZENER DIODE,1W,10V,AXIAL BIPOLAR TRANSISTOR,PNP,-90V,TO-220 BIPOLAR TRANSISTOR,NPN,300V TO-39 RF TRANSISTOR,PNP,-16V,700MHZ,TO-72 BRIDGE RECTIFIER,1PH,2A,200V THD BRIDGE RECTIFIER,1PH,2A,1KV,THD STANDARD DIODE,250mA,200V,DO-35 DUAL N CHANNEL MOSFET,25V,TO-72 BIPOLAR TRANSISTOR,NPN,450V,TO-3 DARLINGTON TRANSISTOR,NPN,120V BIPOLAR TRANSISTOR,NPN,80V,TO-39 DARLINGTON TRANSISTOR,NPN,120V,TO-3 N CHANNEL MOSFET,500V,8A,TO-220 N CHANNEL MOSFET,200V,18A,TO-220 N CHANNEL MOSFET,400V,10A,TO-220 N CHANNEL MOSFET,500V,4.5A TO-220 N CHANNEL MOSFET,1KV,3.1A,TO-220 BIPOLAR TRANSISTOR,PNP,-180V TO-3 BIPOLAR TRANSISTOR,PNP,-80V TO-92 OPTOCOUPLER,TRANSISTOR,1500VRMS OPTOCOUPLER,TRANSISTOR,7500VRMS OPTOCOUPLER,SCHMITT TRIGGER,7500VRMS BIPOLAR TRANSISTOR,NPN,100V,TO-220 BIPOLAR TRANSISTOR,PNP,-160V BIPOLAR TRANSISTOR,NPN,150V BIPOLAR TRANSISTOR,NPN,100V BIPOLAR TRANSISTOR,NPN,750V,TO-3 BIPOLAR TRANSISTOR,NPN,100V,TO-218 BIPOLAR TRANSISTOR,PNP,-300V,TO-39 BIPOLAR TRANSISTOR,PNP,-150V BIPOLAR TRANSISTOR,NPN,100V DARLINGTON TRANSISTOR,NPN,50V N CHANNEL MOSFET,60V,500mA,TO-92 ZENER DIODE,500mW,5.1V,AXIAL ZENER DIODE,500mW,10V,AXIAL ZENER DIODE,500mW,12V,AXIAL ZENER DIODE,500mW,15V,AXIAL STANDARD DIODE,500mA,1.5KV,AXIAL ZENER DIODE,1W,18V,AXIAL ZENER DIODE,5W,10V,AXIAL ZENER DIODE,5W,51V,AXIAL FAST RECOVERY DIODE,0.5A 2KV AXIAL BRIDGE RECTIFIER,1PH 1.5A 600V THD BRIDGE RECTIFIER,1PH,4A,200V THD BRIDGE RECTIFIER,1PH,6A,200V THD BRIDGE RECTIFIER,1PH,100A,600V,SCREW SCR THYRISTOR,4A,100V,TO-202 SCR THYRISTOR,10A,400V,TO-220 SCR THYRISTOR,35A,400V,TO-48 SCR THYRISTOR,35A,600V,TO-48 SCR THYRISTOR,35A,800V,TO-48 TRIAC,400V,15A,TO-220 TRIAC,600V,15A,TO-220 TRIAC,400V,40A,ISOLATED TO-48 TRIAC,400V,8A,TO-220 TRIAC,400V,3A,TO-5 SCHOTTKY RECTIFIER,5A,60V,DO-27 STANDARD DIODE,3A,600V,AXIAL STANDARD DIODE,3A,1.2KV,DO-27 STANDARD DIODE,6A,100V,AXIAL STANDARD DIODE,6A,1KV,AXIAL SCHOTTKY RECTIFIER,1A,40V,DO-41 SCHOTTKY RECTIFIER,3A,40V,DO-27 STANDARD DIODE,25A,400V STANDARD DIODE,25A,400V FAST RECOVERY DIODE,8A 600V TO-220 STANDARD DIODE,40A,600V,DO-5 STANDARD DIODE,85A,1.2KV,DO-5 UNIJUNC TRANSISTOR,0.3W 50mA TO-92 N CHANNEL MOSFET,100V,14A,TO-220 IC,HEX INVERTING BUFFER/DRIVER,DIP-14 FUSE,THERMAL,104°C,15A,277V FUSE,THERMAL,109°C,15A,277V FUSE,THERMAL,240°C,15A,277V IC,OP-AMP,4MHZ,13V/ us,DIP-8 IC,OP-AMP,20MHZ,50V/ us,METAL CAN IC,OP-AMP,0.5V/µs,7.5mV,DIP-14 IC,LINEAR VOLTAGE REGULATOR,12V,TO-92 IC,LINEAR VOLTAGE REGULATOR 6V TO-220-3 IC,LINEAR VOLT REGULATOR,15V,TO-220-3 IC,LINEAR VOLT REGULATOR,24V,TO-220-3 IC,OP-AMP,DIP-8 IC,TIMER,DUAL,16V,14-DIP IC,OP-AMP,3MHZ,1.5V/ us,DIP-14 BIPOLAR TRANSISTOR,PNP,-80V MALE SCREWLOCK,4-40 BIPOLAR TRANSISTOR,NPN,-80V,TO-126 POWER TRANSISTOR,NPN,70V,7A,TO-220 BIPOLAR TRANSISTOR,NPN,800V BIPOLAR TRANSISTOR,NPN,450V,TO-218 BIPOLAR TRANSISTOR,NPN,400V,TO-220 DARLINGTON TRANSISTOR,PNP,-100V TO-220 BIPOLAR TRANSISTOR,NPN,160V BIPOLAR TRANSISTOR,NPN,80V TO-220 BIPOLAR TRANSISTOR,NPN,350V BIPOLAR TRANSISTOR,NPN,500V,TO-3 BIPOLAR TRANSISTOR,NPN,100V,TO-218 BIPOLAR TRANSISTOR,NPN,350V BIPOLAR TRANSISTOR,NPN,150V,TO-220 DARLINGTON TRANSISTOR,NPN,500V,TO-3 CONTACT,6AWG,CRIMP PLUG & SOCKET CONNECTOR,PLUG,1POS PLUG & SOCKET CONNECTOR,PLUG,1POS CONTACT,0.4AWG,THROUGH HOLE PLUG & SOCKET CONNECTOR,PLUG,1POS PLUG & SOCKET CONNECTOR,PLUG,1POS PLUG & SOCKET CONNECTOR,PLUG,1POS PLUG & SOCKET CONNECTOR,PLUG,1POS MOUNTING WING,PP15,PP30 SERIES CONN PLUG AND SOCKET CONNECTOR HOUSING Ceramic Multilayer Capacitor Capacitance TERMINAL,RING TONGUE,#10,CRIMP MICRO-D CONNECTOR,PLUG,25POS,WIRE LEADS SAFETY RELAY 3PST-NO/SPST-NC,250VAC,5A COMPUTER CABLE,KEYBOARD,2.5M,BLUE COMPUTER CABLE,USB,2.5M,BLUE FAN FILTER W/ EXHAUST GRILLE POWER TRANSISTOR,PNP,-60V,TO-3 TERMINAL BLOCK PLUGGABLE,6POS,26-14AWG TEST LEAD,SINGLE,BLACK,24IN,3000VDC SELF ADJUST WIRE STRIPPER BANANA JACK,15A,CRIMP/SOLDER,RED PUSHBUTTON SWITCH SWITCH,PUSHBUTTON DPST-1NO/1NC 5A,250V SWITCH,PUSHBUTTON DPST-1NO/1NC 5A,250V LIGHT PUSHBUTTON SWITCH,PUSHBUTTON,SPST-NO,100mA,42V SWITCH,PUSHBUTTON,SPST-NC,10A,400V INDICATOR,INCAND LAMP,MIDGET GROOVED INSULATOR SLEEVE SWITCH,PUSHBUTTON SPST-NC/SPST-NO,5A,250V,SOLDER SWITCH PUSHBUTTON DPST-1NO/1NC 100mA 42V SWITCH CONTACT BLOCK SWITCH ACTUATOR SWITCHING ELEMENT,1NC,5A,SCREW SWITCHING ELEMENT,1NO/1NC,6A,SCREW BATTERY STRAP,9V,WIRE LEAD CONNECTOR,DIN,PLUG,8POS SPRING CONTACT RECEPTACLE,PCB,CRIMP SPRING CONTACT RECEPTACLE,PCB,CRIMP SPRING CONTACT RECEPTACLE,PCB,CRIMP SPRING CONTACT RECEPTACLE,PCB,CRIMP SPRING CONTACT RECEPTACLE,PCB WIRE WRAP SPRING CONTACT RECEPTACLE,PCB,SOLDER SPRING CONTACT RECEPTACLE,PCB,CRIMP SPRING CONTACT RECEPTACLE,PCB,SOLDER SPRING CONTACT RECEPTACLE,PCB WIRE WRAP SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB,0.125IN SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB COAXIAL CABLE,RG-59,12IN,BLACK COAXIAL CABLE,RG-59,24IN,BLACK COAXIAL CABLE,RG-59,36IN,BLACK COAXIAL CABLE,RG-59,48IN,BLACK COAXIAL CABLE,RG-59,60IN,BLACK ADAPTER,BNC-MINIATURE PLUG SCR THYRISTOR,10A,600V,TO-220 Lead Acid Battery Voltage Rating:12V SPRING CONTACT RECEPTACLE,PCB,SOLDER SPRING CONTACT RECEPTACLE,PCB SPRING CONTACT RECEPTACLE,PCB,SOLDER SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SWITCH ACTUATOR Tools,Cutters INCANDESCENT LAMP JOYSTICK SWITCH,DPST-1NO/1NC,10A,660V JOYSTICK SWITCH,DPST-1NO/1NC,10A,660V JOYSTICK SWITCH,DPST-1NO/1NC,10A,660V LIQUID LEAKAGE SENSOR AMPLIFIR CIRCUIT BREAKER,THERMAL MAG,1P,2A CIRCUIT BREAKER,THERMAL MAG,1P,3A CIRCUIT BREAKER,THERMAL MAG,1P,5A CIRCUIT BREAKER,THERMAL MAG,1P,10A CIRCUIT BREAKER,THERMAL MAG,1P,15A CIRCUIT BREAKER,THERMAL MAG,1P,20A Snap Action Basic Switch BATTERY HOLDER,AA,PCB BATTERY HOLDER,AA,PCB BATTERY STRAP,9V,WIRE LEAD SWITCH BOOT BUSHING SEAL FILTER FAN GRILL,5.91INX5.91IN LENS,ROUND,GREEN WIRE STRIPPER/CUTTER IC,8BIT MPU,4MHZ,DIP-40 BIPOLAR TRANSISTOR,PNP,-24V,TO-5 BIPOLAR TRANSISTOR,PNP,-35V,TO-3 BIPOLAR TRANSISTOR,NPN,12V,TO-92 BIPOLAR TRANSISTOR,NPN,325V,TO-3 BIPOLAR TRANSISTOR,NPN,700V,TO-3 IC,LINEAR VOLTAGE REGULATOR,15V,TO-3 IC,LINEAR VOLTAGE REGULATOR,12V,TO-3 DARLINGTON TRANSISTOR,PNP,-120V,TO-3 N CHANNEL MOSFET,500V,2.5A TO-220 N CHANNEL MOSFET,100V,40A,TO-3 DARLINGTON TRANSISTOR,NPN,80V,TO-3 BIPOLAR TRANSISTOR,NPN,100V,10A,TO-3 OPTOCOUPLER,TRIAC O/P,7.5KV,DIP OPTOCOUPLER,TRANSISTOR,5000VRMS IC,ANALOG SWITCH,QUAD,SPST,DIP-14 ZENER DIODE,5W,24V,AXIAL BRIDGE RECTIFIER,1PH,4A,1KV,THD SCR THYRISTOR,7A,600V,TO-5 SCR THYRISTOR,55A,400V,TO-218 TRIAC,600V,40A,TO-218 TRIAC,600V,40A,TO-48 SCR/DIODE MODULE,12.5A,1.2KV STANDARD DIODE,300A,400V,DO-9 PROGRAMMABLE UJT,1A,TO-92 IC,QUAD D-LATCH,DIFFERENTIAL,DIP-16 IC ADJ LINEAR REG 2V TO 37V METAL CAN-14 IC,OP-AMP,2mV,DIP-8 POSITIVE BUTTON,BATTERY CONTACT DIN Audio Connector CONNECTOR,DIN,JACK,6POS CONNECTOR,DIN,PLUG,6POS SWITCH,PUSHBUTTON,SPDT-DB,10A,250V LAMP COMPACT FLUORESCENT GX-23 13W LAMP,FLUORESCENT,G5,4W LAMP,FLUORESCENT,G5,6W WIRE-BOARD CONN,HEADER,68POS,1.27MM CAPACITOR CERAMIC,0.1UF,25V,Y5V,+80,-20%,0603 END CLAMP,TERMINAL BLOCK PC SCREW TERMINAL PC SCREW TERMINAL Connectors I/O MODULE MOUNTING BRACKET TERMINAL,COMPRESSION LUG 0.171IN SOLDER TERMINAL,COMPRESSION LUG,0.14IN SOLDER TERMINAL,COMPRESSION LUG,0.17IN SOLDER TERMINAL,COMPRESSION LUG 0.144IN SOLDER TERMINAL,COMPRESSION LUG,0.17IN SOLDER CIRCULAR CONNECTOR BODY MATERIAL:ALUMINU CIRCUIT BREAKER,THERMAL,1P,240V,2A POWER RELAY,SPDT,120VAC,30A,FLANGE AVALANCHE DIODE,1A,600V,SOD-57 CABLE CLAMP,SIZE 1,METAL TERMINAL,RING TONGUE,1/4IN,CRIMP TERMINAL,MALE DISCONNECT,6.35MM YELLOW CAT5 RJ45 MODULAR JACK,8POS,1 PORT CAT5 RJ45 MODULAR JACK,8POS,1 PORT DISCRETE SOCKET,PC BOARD SWITCHING DIODE,100V 150mA,SOD-80 POWER RELAY,SPDT,5VDC,10A,PC BOARD POWER RELAY,SPDT,12VDC,10A,PC BOARD POWER RELAY,DPDT,12VDC,15A,PLUG IN ZENER DIODE,1.3W,7.5V,DO-41 ZENER DIODE,500mW,2.4V,DO-35 IC SELF LAMINATING CABLE ID MARKERS SELF LAMINATING CABLE ID MARKERS SELF LAMINATING CABLE ID MARKERS CABLE ID MARKERS,SELF LAM,25.4MM W,POLY,WHT,PK2500 CABLE ID MARKERS,SELF LAM,2.54MM,POLY,WHT,PK1000 SELF LAMINATING CABLE ID MARKERS CAPACITOR CERAMIC 0.01UF,200V,X7R,10%,RAD CAPACITOR CERAMIC 1000PF,50V,X7R,10%, Ceramic Multilayer Capacitor CAPACITOR CERAMIC 2.2UF,50V,Z5U,RADIA CABLE ID LABELS,SELF LAM,50.8MM WX38.1MM H,WHT,PK1000 TERMINAL,FERRULE,0.24IN.,WHITE TERMINAL,FERRULE,0.31IN.,CRIMP,WHITE TERMINAL,FERRULE,0.31IN.,GREY TERMINAL,FERRULE,0.39IN.,RED TERMINAL,FERRULE,0.24IN.,RED TERMINAL,FERRULE,0.39IN.,BLACK TERMINAL,FERRULE,0.31IN.,BLACK TERMINAL,FERRULE,0.31IN.,BLUE TERMINAL,FERRULE,0.39IN.,GREY TERMINAL,FERRULE,0.47IN.,GREY TERMINAL,FERRULE,0.31IN,WHITE TERMINAL,FERRULE,0.31IN,RED TERMINAL,FERRULE,0.39IN,BLUE TERMINAL,FERRULE,0.04IN TERMINAL,FERRULE,0.04IN FERRULE KIT,DIN INSULATED FERRULE KIT,DIN INSULATED NON-TURN WASHER PNEUMATIC SUB-BASE STRAIN RELIEF,10WAY,BRASS CIRCULAR CONNECTOR RECEPTACLE 5POS CABLE P CHANNEL MOSFET,-60V,47A,TO-220 OPTOCOUPLER,LOGIC GATE,2500VRMS MICRO-D CONNECTOR,PLUG,15POS,WIRE LEADS MICRO-D CONNECTOR,PLUG,31POS,WIRE LEADS MICRO-D CONNECTOR,PLUG,37POS,WIRE LEADS D SUB JACKSCREW ASSEMBLY,M5,9.77MM D SUB JACK SCREW,M7,12.06MM I/O MODULE I/O MODULE I/O MODULE I/O MODULE I/O MODULE RF/COAXIAL,BNC PLUG,STR,75 OHM,CRIMP RF/COAXIAL,BNC PLUG,STRAIGHT,CRIMP RF/COAXIAL,BNC BHD JACK,STR,SOLDER RF/COAXIAL,BNC PLUG,STR,50 OHM,CLAMP RF/COAXIAL,BNC PLUG,STR,50 OHM,CLAMP RF/COAXIAL,BNC PLUG,STR,50 OHM,CRIMP RF/COAXIAL BNC BHD JACK STR 50 OHM SOLDER RF/COAXIAL BNC BHD JACK STR 50 OHM SOLDE UNIVERSAL CABLE STRIPPER/SLITTER CAPACITOR CERAMIC 0.01UF,16V,X7R,10%,0805 CAPACITOR CERAMIC,0.1UF,25V,X7R,20%,1206 TOOLS,HAND CRIMP TOOLS,CRIMP,HAND,CRIMPING/STRIPPING TOOL,TERMINALS & SPLICES,ECONOMY 5-WAY CRIMP TOOL,SPC TECHNOLOGY 34C7550 TERMINAL,BUTT SPLICE,IDC,RED PLUGGABLE TERMINAL BLOCK,12 CONTACT,26-14AWG LED,GREEN,1.25MM X 1.4MM,10MCD,570NM LED,GREEN,1.25MM X 1.4MM,7MCD,570NM LED,RED,1.25MM X 1.4MM,13MCD,640NM LED,YELLOW,1.25MM X 1.4MM,12MCD,585NM CONNECTOR,SPEAKER,PLUG,4POS CONNECTOR,RCA/PHONO,PLUG,2POS CONNECTOR,RCA/PHONO,PLUG,2POS POWER INDUCTOR,150UH,550MA,10% 6.2MHZ METAL OXIDE VARISTOR,5.5V,17.5V,0603 Circular Connector Body Material:Electro RF/COAXIAL,BNC BHD FEMALE,STR,75 OHM TERMINAL BLOCK,PCB,2POS,30-12AWG TERMINAL BLOCK,PCB,3POS,30-12AWG TERMINAL BLOCK,PCB,4POS,30-12AWG TERMINAL BLOCK,PCB,5POS,30-12AWG TERMINAL BLOCK,PCB,6POS,30-12AWG TERMINAL BLOCK PLUGGABLE,2POS,30-12AWG TERMINAL BLOCK PLUGGABLE,4POS,30-12AWG PIN HEADER,EUROSTYLE,2POS,5.08MM PIN HEADER,EUROSTYLE,2POS,5.08MM TERMINAL BLOCK PLUGGABLE,2POS,30-12AWG TERMINAL BLOCK PLUGGABLE,3POS,30-12AWG TERMINAL BLOCK PLUGGABLE,4POS,30-12AWG PIN HEADER,EUROSTYLE,2POS,5MM PIN HEADER,EUROSTYLE,3POS,5MM TERMINAL BLOCK,PCB,2POS,30-12AWG TERMINAL BLOCK,PCB,3POS,30-12AWG TERMINAL BLOCK,PCB,4POS,30-12AWG TERMINAL BLOCK,PCB,5POS,30-12AWG TERMINAL BLOCK,PCB,6POS,30-12AWG TERMINAL BLOCK,PCB,9POS,30-12AWG TEST LEAD,SINGLE,RED,24IN,3000VDC PROXIMITY SENSOR SWITCH ACTUATOR LIMIT SWITCH,ROLLER LEVER,SPDT IC,OP-AMP QUAD LOW POWER SMALL SIGNAL DIODE,100V 200mA SOT-23 LIMIT SW,ADJUSTABLE ROLLER LEVER,SPDT TERMINAL BLOCK,PCB,10POS,30-12AWG TERMINAL BLOCK,PCB,12POS,30-12AWG TERMINAL BLOCK,PCB,12POS,30-12AWG TERMINAL BLOCK,PCB,8POS,30-12AWG CAPACITOR CERAMIC 10PF 50V,C0G,5%,0805 CAPACITOR ALUM ELEC 120UF,450V,20%,SNAP-IN CAPACITOR ALUM ELEC 220UF,400V,20%,SNAP-IN PANEL MOUNT INDICATOR,LED,8.1MM,RED,12V PANEL MOUNT INDICATOR,LED,8.1MM,RED,28V PANEL MOUNT INDICATOR,LED,8.1MM,YELLOW,28V PANEL MOUNT INDICATOR,LED,8.1MM,GREEN,28V TERMINAL BLOCK PLUGGABLE,3POS,30-12AWG PIN HEADER,EUROSTYLE,6POS,5.08MM TERMINAL BLOCK PLUGGABLE,6POS,30-12AWG TERMINAL BLOCK PLUGGABLE,8POS,30-12AWG TERMINAL BLOCK,PCB,8POS,30-12AWG IC,INSTRUMENT AMP,600KHZ,106DB SOIC-8 IC,OP-AMP,1MHZ,0.4V/ us,SOIC-8 IC,TIMER,SINGLE,2.1MHZ,15V,8-SOIC MICRO SWITCH,STR LEVER,SPDT 100mA 125V TOOLS,HAND CRIMP FEET (BUMPERS) Enclosure INSPECTION WINDOW,3.8X3IN POLYCARBONATE INSPECTION WINDOW,9.8X5IN POLYCARBONATE INSPECTION WINDOW,9.8INX8.6IN,PC LED,3MM,RED,15MCD,630NM CONNECTOR HOUSING,RECEPTACLE,12 POS,1 ROW BATTERY HOLDER,AAA,PANEL BATTERY HOLDER,22 1/2V,PANEL Square Pin Receptacle Patch Cord,0.025 BOX,SHIELDED,ALUMINIUM,BLUE Epoxy Coated Monolithic Ceramic,Radial VOLTAGE METER VOLTAGE METER LIMIT SWITCH,ROLLER PLUNGER,SPDT SHLD MULTICOND CABLE,3COND,16AWG,250FT,300V TIME DELAY RELAY BIPOLAR TRANSISTOR,NPN,15V DUAL N/P CHANNEL MOSFET,30V,SOIC ZENER DIODE,1W,12V,DO-41 ZENER DIODE,1W,33V,DO-41 ZENER DIODE,500mW,3.6V,DO-35 ZENER DIODE,500mW,8.2V,DO-35 FAST RECOVERY DIODE,1A,800V DO-41 PASTILLE DE SOUDURE 250G PLUG & SOCKET HOUSING,PLUG,NYLON PLUG & SOCKET HOUSING,RECEPTACLE,8POS,3.96MM PLUG & SOCKET HOUSING,RECEPTACLE,9POS,3.96MM PLUG & SOCKET CONNECTOR,PLUG 6POS 4.2MM PLUG & SOCKET HOUSING,PLUG,NYLON PLUG & SOCKET HOUSING,PLUG,NYLON WIRE-BOARD CONNECTOR HEADER 8POS,3.96MM MICRO SWITCH STRAIGHT LEVER SPDT 5A 277V MICRO SW,STRAIGHT LEVER,SPDT,11A 277V MICRO SWITCH,ROLLER LEVER SPDT 11A 277V MICRO SWITCH,ROLLER LEVER SPDT 11A 277V MICRO SW,STRAIGHT LEVER,SPDT,11A 277V MICRO SWITCH,ROLLER LEVER,SPDT 1A 125V MICRO SWITCH,PIN PLUNGER,SPDT 15A 277V MICRO SWITCH,ROLLER LEVER SPDT 15A 277V SWITCH,TOGGLE,SPDT,10A,277V SUPPORT DE FER Plastic Connector Cover JUNCTION BLOCK,STUD TYPE,1POS JUNCTION BLOCK,STUD TYPE,1POS Connectors TERMINAL BLOCK,PCB,2POS,30-14AWG TERMINAL BLOCK,PCB,4POS,30-14AWG TERMINAL BLOCK,PCB,6POS,30-14AWG TERMINAL BLOCK,PCB,8POS,30-14AWG TERMINAL BLOCK,PCB,12POS,30-14AWG RELAY SOCKET CONNECTORS,TERMINAL BLOCKS Terminal block,5 positions CARD EDGE CONNECTOR,SOCKET,44POS CARD EDGE CONNECTOR,SOCKET,50POS LENS CAP ENCLOSURE,UTILITY,POLYSTYRENE,BLACK ENCLOSURE,UTILITY,POLYSTYRENE,BLACK ENCLOSURE,BOX,PLASTIC,BLACK ENCLOSURE,BOX,PLASTIC,BLACK ENCLOSURE,BOX,PLASTIC,BLACK ENCLOSURE,BOX,PLASTIC,BLACK ENCLOSURE,BOX,PLASTIC,BLACK CONNECTOR ASSEMBLIES,IC CLIPS TEST CONNECTOR ASSEMBLIES,IC CLIPS TEST RACHET CRIMP TOOL CUTTER,CABLE,0.5IN MICRO SW,ROLLER PLUNGER,SPDT,15A 250V AM 35 Cable Stripper/Slitter OUTIL SERTISSAGE WE/SS TOUT EN UN CRIMPER/CUTTER/STRIPPER,MODULAR PLUGS TOTALIZING COUNTER TOTALIZING COUNTER TOTALIZING COUNTER DIGITAL GENERAL PURPOSE TIMER DIGITAL GENERAL PURPOSE TIMER TERMINAL,FERRULE,1.3MM,CRIMP,GREY TERMINAL,FERRULE,1.5MM,CRIMP,RED TERMINAL,FERRULE,1.3MM,CRIMP,WHITE SWITCH,INDUSTRIAL PUSHBUTTON,22MM LIMIT SWITCH,CROSS ROLLER PLUNGER,SPDT IC,HALL EFFECT SENSOR,LINEAR,TO-92-3 TOOLS,HAND CRIMP METAL OXIDE VARISTOR,5.5V,15.5V,0805 CIRCUIT BREAKER,THERMAL MAG,1P,25A POWER RELAY,DPDT,240VAC,10A,PLUG IN POWER RELAY,DPDT,240VAC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN POWER RELAY,4PDT,240VAC,5A,PLUG IN POWER RELAY,4PDT,24VAC,5A,PLUG IN POWER RELAY,4PDT,120VAC,5A,PLUG IN METAL OXIDE VARISTOR,33V,72V 1206 SWITCHING DIODE,200V,250mA,DO-35 SCHOTTKY RECTIFIER,150mA,100V,DO-35 SMD IC ADAPTER,8-SOT TO 8-SIP SMD IC ADAPTER,4-SOT-143 TO 4-SIP SMD IC ADAPTER,SOT-223 TO 3-SIP TEST CLIP,MINGRABBER,BLACK,5A TEST CLIP,1POS ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK RF/COAXIAL,SMA PLUG,STR,50 OHM,SOLDER SHUNT JUMPER,2WAY,2.54MM TVS DIODE,1.5KW,6.8V,DO-201 TVS DIODE,1.5KW,15V,DO-201 TVS DIODE,1.5KW,18V,DO-201 TVS DIODE,1.5KW,33V,DO-201 TVS DIODE,600W,51V,DO-15 TVS DIODE,600W,7V,DO-214AA TVS DIODE,600W,13V,DO-214AA TEST LEAD,SINGLE,BLACK,36IN,1000V BASIC ELECTRONIC DMM TEST LEAD KIT RF/COAXIAL,SMA JACK,STR,50OHM,SOLDER WIRE STRIPPER TEST PROD WIRE,100FT 18AWG CU GREEN ENCLOSURE,WALL MOUNT,ALUMINIUM MICRO-D CONNECTOR,PLUG,37POS,SOLDER LAMP,INCANDESCENT,WIRE LEADED,28V LAMP,INCANDESCENT,BI PIN,12V LENS,SQUARE,BLUE SWITCH CONTACT BLOCK Keypad Legend SPRING CONTACT PROBE,PCB All-Purpose Electrician?s Tool 50B4622 LAMP,FLUORESCENT,G10Q,22W CIRCULAR CONNECTOR RCPT,SIZE 11,8POS,PANEL LIMIT SWITCH,SIDE ROTARY,SPDT-1NO/1NC THERMOCOUPLE CONNECTOR LIMIT SWITCH,ROLLER LEVER,DPDT PHOTOELECTRIC SENSOR TEST LEAD,BANANA,GREEN,72IN,5000VDC COAXIAL CABLE ASSEMBLY TEST PROBE BNC MALE CONNECTOR,2249 TYPE CABLE FRONT/REAR MOUNTING GASKET CIRCULAR CONN BULKHEAD ADAPTER,BNC JACK-BNC JACK POWER RELAY,SPDT,5VDC,10A,PC BOARD HOOK-UP WIRE,100FT,22AWG,CU,BLUE LENS,RECTANGULAR,RED CAT3 MODULAR PLUG,6POS,1 PORT CAT3 MODULAR PLUG,6POS,1 PORT CAT3 RJ45 MODULAR PLUG,8POS,1 PORT TURNABLE JACK SCREW,#4-40,56.13MM TURNABLE JACK SCREW,#4-40,44.86MM TURNABLE JACK SCREW,#4-40,57.66MM CIRCULAR CONNECTOR RCPT SIZE 17,28POS,PANEL BANANA JACK ADAPTER,25A,SCREW,RED PRECISION CUTTER,FULL FLUSH,1.3MM,5IN PRECISION CUTTER,FULL FLUSH,0.81MM 5IN BLANK GROMMET,VINYL,9.9MM,ROUND BLANK GROMMET,VINYL,12.4MM,ROUND BLANK GROMMET,VINYL,22.1MM,ROUND BLANK GROMMET,VINYL,25.4MM,ROUND OPEN GROMMET OPEN GROMMET OPEN GROMMET OPEN GROMMET OPEN GROMMET OPEN GROMMET OPEN GROMMET SNAP ON FUSE COVER Fasteners,Spacers/standoffs COMPUTER CABLE,USB,1M,WHITE COMPUTER CABLE,USB,3M,WHITE FERRITE CORE,SPLIT,13.05MM,200 OHM/100MHZ FERRITE CORE,CYLINDRICAL,218OHM/100MHZ FERRITE CORE,CYLINDRICAL,125OHM/100MHZ Snap Action Basic Switch BASIC SWITCH,PLUNGER,SPDT,15A,480V Hand Held Enclosure Crimp Tool,controlled cycle,crimps PAN 51B814 TERMINAL,RING TONGUE,1/4IN,CRIMP WIRE-BOARD CONNECTOR HEADER,8WAY,0.1IN ALLIGATOR CLIP,BLACK CONTACT,SOCKET,18-14AWG,CRIMP TERMINAL,FEMALE DISCONNECT,6.35MM,RED CRIMP DIE,354940-1 CRIMP TOOL SWITCHING ELEMENT,1NC,10A,SCREW TEST LEAD,BANANA,BLUE,48IN,5000VDC BINDING POST,15A,TURRET,WHITE CAPACITOR CERAMIC 0.01UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 2200PF,50V,X7R,10%,RAD TERMINAL BLOCK,BARRIER,2POS,18-10AWG ELECTROMECHANICAL HOUR METER Electromechanical Totalizing Counter RELAY SOCKET ALLIGATOR CLIP,24.6MM,RED,20A TOOLS,HYDRAULIC CRIMP DIP SOCKET,14POS,THROUGH HOLE DIP SOCKET,16POS,THROUGH HOLE DIP SOCKET,16POS,THROUGH HOLE Cap,Epoxy Coated Monolithic Ceramic,Ra ZENER DIODE,5W,24V,AXIAL CAPACITOR CERAMIC 1000PF,50V,X7R,10%,RAD CIRCULAR SHELL,PLUG,SZ 28,AL ALLOY TEST CLIP,MINIGRABBER,BLACK,5A BANANA PLUG,15A,SCREW,BLACK CONNECTORS,ACCESSORIES CAPACITOR ALUM ELEC 300UF,250V,+75,-10%,AXIAL FICHE 2MM VERS 4MM BANANA PLUG,15A,SCREW,GREEN BANANA PLUG,15A,SOLDER LUG BANANA PLUG,15A,SCREW,RED CONDENSATEUR 250V 100UF DOUBLE BANANA PLUG,15A,TURRET,BLUE ENCLOSURES COAXIAL CABLE,RG-214/U,60IN BANANA PLUG,5A,RIVET CONNECTOR ASSEMBLIES BOX,SHIELDED,ALUMINIUM TEST LEAD,BNC JACK,500V RF/COAXIAL ADAPTER,SMA JACK-TNC PLUG Square pin receptacle to banana plug,re DOUBLE BANANA PLUG,15A,SCREW,BLACK TEST LEAD SINGLE,RED/BLACK,143MM,500V CONNECTOR ASSEMBLIES CONNECTEUR MODULAIRE CAT5E 8 CONTACTS UNSHLD MULTIPR CABLE,4PR,1000FT,300V CABLE GLAND (CLAMP),PG7 CABLE GLAND (CLAMP). PG9 CABLE GLAND (CLAMP) CABLE GLAND (CLAMP),PG13.5 CABLE GLAND (CLAMP) MODULAR CONNECTOR REED RELAY,SPDT,24VDC,0.25A,THD CONDUCTIVE PLASTIC POTENTIOMETER POT,COND PLASTIC,20KOHM,20%,1W RECTIFIER MODULE,1.2KV,100A,SEMIPACK 1 Discrete Semi´s,Diode/Rectifier,Diode BRIDGE RECTIFIER,3PH,110A,1.2KV,SCREW MICRO SWITCH,PIN PLUNGER,SPDT,5A 250V POWER RELAY,SPDT,5VDC,10A,PC BOARD INDICATOR,LED PANEL MNT,RED/GREEN,5V PANEL MOUNT INDICATOR,LED,17.463MM,GREEN,12V PANEL MOUNT INDICATOR,LED,17.463MM,GR I/O MODULE CROSSFLOW BLOWER,SHADED POLE AC MOTOR ENCLOSURE,BOX,PLASTIC,GRAY RF/COAXIAL,BNC PLUG,STR,50 OHM,CLAMP COAXIAL CABLE,SUB MINI RG-59/U,23AWG,1000FT,BLK CABLE,SHLD MULTICOND,2COND,18AWG,1000FT,300V CABLE,UNSHLD MULTICOND,2COND,16AWG,1000FT,300V CABLE,UNSHLD MULTICOND,4COND,22AWG,1000FT,300V CABLE,SHLD MULTICOND,2COND,18AWG,1000FT,300V SHLD MULTICOND CABLE,2COND,18AWG,1000FT,300V CABLE,UNSHLD MULTICOND,6COND,22AWG,1000FT,300V SHLD MULTICOND CABLE,4COND,22AWG,1000FT,300V UNSHLD MULTICOND CABLE 3COND 18AWG 1000FT CABLE,SHLD MULTICOND,2COND,14AWG,1000FT,300V SHLD MULTICOND CABLE,2COND,20AWG,1000FT,300V UNSHLD MULTICOND CABLE 4COND 18AWG 1000FT ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE,JUNCTION BOX,FIBERGLASS GRAY ENCLOSURE,JUNCTION BOX,FIBERGLASS GRAY ENCLOSURE,JUNCTION BOX,FIBERGLASS GRAY Neutrik 1/4 Professional Phone Plugs,R GROMMET EDGING,POLYETHYLENE GROMMET EDGING,POLYETHYLENE GROMMET EDGING,POLYETHYLENE GROMMET EDGING,POLYETHYLENE GROMMET EDGING,POLYETHYLENE GROMMET EDGING,POLYETHYLENE TOOLS,HAND CRIMP MULTIFUNCTION COUNTER FERRITE CORE,CYLINDRICAL,35OHM FERRITE CORE,CYLINDRICAL BEAD KIT,CHIP MOUNTING BRACKET MOUNTING BRACKET MOUNTING BRACKET SPACER,ROUND,CERAMIC,0.375IN X 12.7MM SPACER,ROUND,CERAMIC,0.5IN X 19.1MM SPACER,ROUND,CERAMIC,0.375IN X 25.4MM SPACER,ROUND,CERAMIC,0.75IN X 25.4MM SPACER,ROUND,CERAMIC,0.375IN X 50.8MM SPACER,ROUND,CERAMIC 0.375IN X 9.525MM TEST LEAD,SINGLE,RED,12IN,3000VDC SEALING BOOT MODULAR CONNECTOR FUSE CLIP,7.1 X 31.8MM,PCB MOUNT FUSE HOLDER COVER ST FIBER OPTIC CONN,125 uM,MULTIMODE SHLD MULTICOND CABLE,4COND,12AWG,1000 BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER BOBBINS TRANSFORMER CURRENT TRANSFORMER Flip Flop Logic IC IC,D-TYPE FLIP FLOP,DUAL,DIP-14 Gate / Inverter Logic IC Flip Flop Logic IC Logic Type:Flip-Flop IC,HEX INVERTER,SCHMITT TRIGGER,DIP14 ENCLOSURE,JUNCTION BOX,STEEL,GRAY CONNECTOR,RCA/PHONO,PLUG CONNECTOR,RCA/PHONO,PLUG CONNECTOR,PHONE AUD,PLUG,3POS CONNECTOR,RCA/PHONO,PLUG,3POS ST FIBER OPTIC CONN,125 uM,MULTIMODE PIN TIP JACK,1500V,5A,BLUE CONNECTOR RF/COAXIAL ADAPTER,TNC JACK-N JACK RF/COAXIAL,N PLUG,STR,50 OHM,CRIMP RF/COAXIAL ADAPTER,UHF JACK-UHF JACK RF/COAXIAL ADAPTER,UHF PLUG-UHF PLUG ADAPTER,MINI UHF JACK-MINI UHF JACK RF/COAXIAL BNC BHD JACK STR 75 OHM SOLDER RF/COAXIAL,N PLUG,STR,50 OHM,CLAMP CONNECTOR,POWER ENTRY,RECEPTACLE,15A CONNECTOR,POWER ENTRY,RECEPTACLE,15A CONNECTOR,POWER ENTRY,SOCKET,10A CONNECTOR,POWER ENTRY,SOCKET,10A TERMINAL,FERRULE,8 X 1.1MM,ORANGE TERMINAL,FERRULE,10 X 1.1MM,ORANGE TERMINAL,FERRULE,6 X 1.3MM,WHITE TERMINAL,FERRULE,8 X 1.3MM,WHITE TERMINAL,FERRULE,10 X 1.3MM,WHITE TERMINAL,FERRULE,12 X 1.3MM,WHITE TERMINAL,FERRULE,6 X 1.5MM,YELLOW TERMINAL,FERRULE,10 X 1.5MM,YELLOW TERMINAL,FERRULE,6 X 1.8MM,RED TERMINAL,FERRULE,8 X 1.8MM,RED TERMINAL,FERRULE,10 X 1.8MM,RED TERMINAL,FERRULE,8 X 2.3MM,BLUE TERMINAL,FERRULE,10 X 2.9MM,GREY TERMINAL,FERRULE,18 X 2.9MM,GREY TERMINAL,FERRULE,18 X 3.6MM,BLACK TERMINAL,FERRULE,12 X 4.6MM,IVORY TERMINAL,FERRULE,18 X 4.6MM,IVORY TERMINAL,FERRULE,12 X 6MM,GREEN TERMINAL,FERRULE,16 X 7.5MM,BROWN TERMINAL,FERRULE,8 X 1.1MM,WHITE TERMINAL,FERRULE,10 X 1.1MM,WHITE TERMINAL,FERRULE,8 X 1.3MM,GREY TERMINAL,FERRULE,6 X 1.5MM,RED TERMINAL,FERRULE,10 X 1.5MM,RED TERMINAL,FERRULE,12 X 1.5MM,RED TERMINAL,FERRULE,8 X 1.8MM,BLACK TERMINAL,FERRULE,10 X 1.8MM,BLACK TERMINAL,FERRULE,12 X 1.8MM,BLACK TERMINAL,FERRULE,8 X 2.3MM,BLUE TERMINAL,FERRULE,12 X 2.3MM,BLUE TERMINAL,FERRULE,10 X 2.9MM,GREY TERMINAL,FERRULE,12 X 2.9MM,GREY TERMINAL,FERRULE,12 X 3.6MM,YELLOW TERMINAL,FERRULE,12 X 4.6MM,RED TERMINAL,FERRULE,12 X 6MM,BLUE TERMINAL,FERRULE,18 X 6MM,BLUE TERMINAL,FERRULE,1MM TERMINAL,FERRULE,1MM TERMINAL,FERRULE,1.2MM TERMINAL,FERRULE,1.4MM TERMINAL,FERRULE,1.7MM TERMINAL,FERRULE,2.2MM TERMINAL,FERRULE,10MM TERMINAL,FERRULE,2.2MM TERMINAL,FERRULE,2.8MM TERMINAL,FERRULE,3.5MM WIRE FERRULE ASSORTMENT BOX CONNECTOR SERVICE KIT TERMINAL,FERRULE,8 X 1.5MM,WHITE TERMINAL,FERRULE,8 X 1.8MM,GREY TERMINAL,FERRULE,10 X 1.8MM,GREY TERMINAL,FERRULE,8 X 2.05MM,RED TERMINAL,FERRULE,BLACK TERMINAL,FERRULE,12 X 2.3MM,BLACK TERMINAL,FERRULE,10 X 2.9MM,BLUE TERMINAL,FERRULE,12 X 3.8MM,GREY TERMINAL,FERRULE,14 X 4.9MM,YELLOW CUTTER,CABLE,WIRE ROPE TEST LEAD,SINGLE,BLACK,20IN,1200V TEST LEAD,SINGLE,RED,20IN,1200V TEST LEAD,SINGLE,RED,10IN,1200V TEST LEAD,SINGLE,BLACK,20IN,1200V TEST LEAD,SINGLE,RED,20IN,1200V PIED A COULISSE 180MM TEST LEAD,SINGLE,BLACK,100CM,1200V MICROMETRE MECANIQUE 0-25MM LAMP,INCANDESCENT,BI PIN,5V,300MW TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,RING TONGUE 3/8IN CRIMP YELLOW TERMINAL,MALE DISCONNECT,0.25IN YELLOW TERMINAL,FEMALE DISCONNECT,0.25IN BLUE TERMINAL,BUTT SPLICE,CRIMP,RED TERMINAL,BUTT SPLICE,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP,YELLOW TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,RING TONGUE,#10,CRIMP YELLOW TERMINAL,BUTT SPLICE,SOLDER,CLEAR TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP,YELLOW COMPARATEUR NUMERIQUE PIED MAGNETIQUE FAN FILTER W/ EXHAUST GRILLE PRACTICAL RADIO FREQUENCY CIRCULAR CONN,RCPT,SIZE 14S,4POS,BOX CIRCULAR CONN,RCPT,SIZE 14S,6POS,BOX CIRCULAR CONN,RCPT,SIZE 14S,6POS,BOX CIRCULAR CONN,RCPT,SIZE 16S,7POS,BOX CIRCULAR CONN,RCPT,SIZE 18,10POS,BOX CIRCULAR CONN,RCPT,SIZE 18,10POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14S,4POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 14S,6POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 14S,6POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 16S,7POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 16S,7POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 18,10POS,CABLE CONN,CIRCULAR,PLUG,18-1,CABLE CIRCULAR CONNECTOR PLUG SIZE 20,17POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 10SL 3POS,CABLE CIRCULAR CONNECTOR,PLUG,10SL-4S,CABLE CIRCULAR CONN,RCPT,SIZE 12,10POS,BOX CIRCULAR CONN,PLUG,SIZE 8,4POS,BOX CIRCULAR CONN,RCPT,SIZE 10,6POS,BOX CIRCULAR CONNECTOR,PLUG,12-10S,CABLE CIRCULAR CONNECTOR,PLUG,14-19S,CABLE MICRO SW,STRAIGHT LEVER,SPDT,11A 277V MICRO SWITCH,LEAF LEVER SPDT 15.1A 277V MICRO SWITCH,LEAF LEVER,SPDT,15A 277V MICRO SWITCH,PIN PLUNGER,SPDT 11A 277V RESISTOR,METAL FILM,1KOHM,400mW,1% ENCLOSURE,WALL MOUNT,ALUMINIUM,NATURA QUICK RELEASE LATCH KIT STRAIN RELIEF,64WAY,POLYESTER ENCLOSURE,WALL MOUNT,ALUMINIUM,NATURAL D SUB HOOD,SIZE DE,PLASTIC CIR CONNECTOR RCPT SIZE 17 28POS FREE HANGING CIR CONNECTOR PLUG SIZE 17 28POS FREE HANGING Ceramic Multilayer Capacitor Capacitance SWITCH ACCESSORIES,ASSEMBLY HARDWARE CIRCULAR CONNECTOR ADAPTER HOOK-UP WIRE,100FT,10AWG CU,BLACK BANANA PLUG,15A,SCREW,GRAY ENCLOSURE,PUSH BUTTON,3 HOLE,STEEL CIRCULAR SHELL,RCPT,SIZE 20,AL ALLOY TRANSFORMERS PENDANDT SWITCH,SPDT,500mA INCANDESCENT SOCKET PANEL MOUNT INDICATOR,LED,12.7MM,GREEN,24V SHLD MULTIPR CABLE 4PR 1000FT 300V BLU SHLD MULTICOND CABLE,3COND,18AWG,500FT,300V DISCRETE SOCKET,PC BOARD FERRITE BEAD BANANA PLUG SET,15A,SCREW,10 PIECE BANANA PLUG SET,15A,SCREW,10 PIECE SPRING CONTACT PROBE,PCB SWITCH BOOT PLASTIC MOUNTING FLANGE SWITCH,PUSHBUTTON SPDT-1NO/1NC 5A,250V CAPACITOR POLY FILM FILM 0.1UF 10%,100V POSITIVE BUTTON,BATTERY CONTACT CONNECTOR BENCH DRILL,2 SPEED IC,ADC,10BIT,38KSPS,SOIC-20 BANANA JACK,15A,TURRET,VIOLET BRUSHES. CARBON PAIR RECTANGULAR HAN INSERT,PLUG 24WAY CRIMP CONTACT,MALE,26-22AWG,CRIMP CONTACT,SOCKET,22-18AWG,CRIMP INSTRUMENT HANDLE CONTACT,D SUB,SOCKET,24-22AWG,CRIMP ACTUATOR,1.5OZF,BZ/BA SERIES SWITCH SPRING CONTACT PROBE,PCB CONTACT,SOCKET,8AWG,CRIMP LIMIT SWITCH,ROLLER LEVER,SPDT-1NO/1NC JACK MODULE TERMINATION TOOL SHLD MULTICOND CABLE,3COND,22AWG,1000FT,300V CIRCULAR CONNECTOR PLUG SIZE 12,10POS,CABLE WIRE STRIPPER BANANA JACK,SOLDER SWITCH ACTUATOR MICRO D CONNECTOR,PLUG,9POS,18´´ WIRE LEADS FUSE,PCB,6.3A,250V,TIME DELAY LED LENS CAP INDUCTIVE PROXIMITY SENSOR TEST SPRING PROBE,PCB SWITCH ACCESSORIES,ASSEMBLY HARDWARE PROCESS METER SCREW CLIP FOR A283/388 SERIES RATE COUNTER TOTALIZING COUNTER CAP MOUNTING BRACKET,2.16´´ BASE SHLD MULTIPR CABLE 1PR 1000FT 300V BLK Resistors,Shunt Output Voltage:100mV LENS,RECTANGULAR,BLUE TEST SPRING PROBE,PCB RUBBER BUSHING,MS3057A CABLE CLAMP CONTACT,FEMALE,16AWG,CRIMP CONTACT,MALE,16AWG,CRIMP CRIMP TOOL,WIRE FERRULES SWITCHES,INDUCTIVE PROXIMITY OUTPUT TYP LED Display Panel TERMINAL,FEMALE DISCONNECT,4.75MM,RED TERMINAL,FEMALE DISCONNECT,4.75MM BLUE TERMINAL,FEMALE DISCONNECT,3.18MM,RED KEYING PLUG,SL-156 HOUSING STRAIN RELIEF COVER,NYLON STRAIN RELIEF COVER,NYLON WIRE-BOARD CONN,HEADER,12POS,2.54MM WIRE-BOARD CONNECTOR RECEPTACLE,7POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE,9POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE 10POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE 12POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE,6POS,2.54MM WIRE-BOARD CONNECTOR RECEPTACLE 20POS,2.54MM STRAIN RELIEF COVER,2WAY,NYLON STRAIN RELIEF,5WAY,NYLON STRAIN RELIEF,9WAY,NYLON WIRE-BOARD CONNECTOR RECEPTACLE 13POS,2.54MM CONTACT,RECEPTACLE,24-20AWG,CRIMP WIRE-BOARD CONN,HEADER,12POS,3.96MM WIRE-BOARD CONNECTOR HEADER 5POS,3.96MM CONTACT,RECEPTACLE,26-22AWG,CRIMP CAPACITOR CERAMIC,1UF,50V,X7R,10%,RADIAL RECTANGULAR HAN INSERT,FEM,40WAY CRIMP POSITION DETECTOR FUSE CARTRIDGE 400mA 6.3X32MM TIME DELAY Connector CONTACT,PIN,CRIMP,26-22AWG TEST PROD WIRE,500FT,18AWG CU,RED LENS,SQUARE,RED LENS,SQUARE,YELLOW LED BULB,MIDGET GROOVE,RED,T-1 3/4 SPADE LUG TO BANANA JACK,15A,RED TEST LEAD,BANANA,YELLOW,48IN,5000VDC LENS,ROUND,CLEAR ELECTROMECHANICAL GENERAL PURPOSE TIMER BATTERY STRAP,9V,WIRE LEAD POWER RELAY SPST-NO/NC 5VDC 10A PC BOARD Enclosure PLUG AND SOCKET CONNECTOR HOUSING COAXIAL CABLE ASSEMBLY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY MICRO SW,STRAIGHT LEVER,SPDT,11A 277V FINGER GUARD COMMUTATEUR LR21 ET LR1AS PHOTOELECTRIC SENSOR POWER RELAY,4PDT,24VDC,10A,PLUG IN MICRO SW,STRAIGHT LEVER,SPDT,20A 480V ELEMENT CHAUFFANT LENS,SQUARE,YELLOW LENS,SQUARE,RED SENSOR CONNECTOR HOLDER CABLE,COAXIAL,UNJKTED,RG402/U,19AWG,50FT,TIN BRD TERMINAL,FERRULE,13MM,CRIMP,BLUE SHUNT JUMPER,2WAY,2.54MM OPTICAL SENSOR (PHOTODETECTOR - ´´´´P-N´´´´) PHOTODIODE N1 ENCLOSURE W/PANEL,16X16X7,STEEL,GRAY TUBE DE VERRE PQ4 N1 ENCLOSURE W/PANEL,20X16X9,STEEL,GRAY N1 ENCLOSURE W/PANEL,20X20X7,STEEL,GRAY N1 ENCLOSURE W/PANEL,24X20X7,STEEL,GRAY N1 ENCLOSURE W/PANEL,24X24X9,STEEL,GRAY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE,PUSH BUTTON,1 HOLE,PC KIT DE JOINTS POUR VP801EC PANNE DESSOUDAGE 0.7X1.9X12.7 PANNE DESSOUDAGE 0.7X2.5X12.7 PANNE DESSOUDAGE 0.7X1.9X19 PANNE DESSOUDAGE 0.7X1.5X12.7 PANNE DESSOUDAGE 1.0X2.3X12.7 PANNE DESSOUDAGE 1.2X2.5X12.7 PANNE DESSOUDAGE 1.2X2.7X19 PANNE DESSOUDAGE 1.5X2.9X12.7 PANNE DESSOUDAGE 1.8X3.3X12.7 TEST CLIP,32POS TEST CLIP,44POS DIGITAL MULTIFUNCTION TIMER DIGITAL MULTIFUNCTION TIMER FUSE,BLADE,30A,32V,TIME DELAY AFFUTE FORETS 2.5 A 10 MM ST FIBER OPTIC CONN,9/125 uM SINGLE MODE Buffer/Driver Logic IC COMPARATEUR DOUBLE CMS SOIC8 393 HEAT SINK HEAT SINK HEAT SINK ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY PN Series Box Enclosure ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY HANDLE/BAIL KIT,NEMA 4X ENCLOSURES,ABS HANDLE/BAIL KIT,NEMA 4X ENCLOSURES,ABS ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK LINE REACTOR LINE REACTOR PCB Mount Filter PCB Mount Filter FUSE,6.3A,500V,FERRULE,FAST ACTING FUSE,PCB,3.15A,250V,TIME DELAY FUSE,PCB,4A,250V,TIME DELAY OUTPUT MODULE OUTPUT MODULE INPUT MODULE Enclosure Plastic Connector Cover Desktop Enclosure Desktop Enclosure INDICATOR,LED PANEL MNT,BLUE,5V I/O MODULE I/O MODULE PROXIMITY SENSOR PROXIMITY SENSOR FUSE,25A,600V,TIME DELAY CIRCUIT BREAKER,THERMAL MAG,1P,20A CIRCUIT BREAKER,THERMAL MAG,2P,10A CIRCUIT BREAKER,THERMAL MAG,2P,20A GANTS CAOUTCHOUC TAILLE 8.5 PAIRE POWER ENTRY MODULE,PLUG,1A POWER RELAY,SPST-NO,5VDC,30A,FLANGE POWER RELAY,SPDT,5VDC,30A,FLANGE POWER RELAY,SPDT,12VDC,30A,FLANGE POT,SLIDE,10KOHM,20%,50mW TEST SPRING SOCKET,PCB,SOLDER TEST SPRING SOCKET,PCB,SOLDER TEST SPRING SOCKET,PCB,SOLDER TEST SPRING SOCKET,PCB,SOLDER HASP LOCKOUT DEVICE W/STEEL CABLE GROMMET EDGING,POLYETHYLENE GROMMET EDGING,POLYETHYLENE GROMMET EDGING,POLYETHYLENE COFFRET A TIROIR TYPE G SCR Thyristor RECTANGULAR HAN INSERT FEMALE 6WAY SCREW BULKHEAD HOUSING,SIZE 6B,METAL RECTANGULAR HAN INSERT,PLUG 10WAY SCREW TOP ENTRY HOOD,SIZE 10B,METAL SIDE ENTRY HOOD,SIZE 16B,METAL TOP ENTRY HOOD,SIZE 16B,METAL RECTANGULAR HAN INSERT,RCPT,24WAY,SCREW SIDE ENTRY HOOD,SIZE 24B,METAL BULKHEAD HOUSING,SIZE 24B,METAL GASKET,20 SHELL SIZE,CIRCULAR CONN LENS,ROUND,CLEAR FRONT/REAR MOUNTING GASKET CIRCULAR CONN TERMINAL BLOCK,PCB,3POS,24-14AWG JUMPER,2WAY,2.54MM LENS,RECTANGULAR,RED LIMIT SWITCH,ROLLER PLUNGER,SPDT PLUG & SOCKET HOUSING,RCPT,16POS,2.54MM FUSE,PCB,2.5A,250V,FAST ACTING BOX STORAGE 7 SECTIONS FUSE HOLDER,PCB MOUNT MICRO-D CONNECTOR,RECEPTACLE,37POS,WIRE LEADS BASIC SWITCH,PIN PLUNGER,DPDT,5A,250V LIMIT SWITCH,ROLLER LEVER,DPDT MICRO-D CONNECTOR,PLUG,25POS,SOLDER RF/COAXIAL,BNC JACK,STR,50OHM,SOLDER REED RELAY,SPST-NO,24VDC,0.5A,THD CONNECTOR,PHONE AUD,PLUG BUSHING,6384G1 CONTACT BODY PLATING:ANODIZED FOR USE WITH:MI UNSHLD MULTICOND CABLE 2COND 22AWG 500FT TRANSISTOR INSULATOR Film Capacitor LED BULB,MIDGET GROOVE,RED,T-1 3/4 CYLINDRICAL HALL SWITCH BEZEL BLANK MODULE,1 PORT,BLK TERMINAL,RING TONGUE,#10,CRIMP,BLUE SWITCH,INDUSTRIAL PUSHBUTTON,30MM EQUIPMENT HANDLE ELECTRIC HEATER,115V,200W ENCLOSURE,PUSH BUTTON,1 HOLE,STEEL AXIAL FAN,149MM x 162MM x 38MM,115VAC,360MA Security,Enclosure Locks Product Description:Cylinder Lock Kit 92F090 AXIAL FAN,117MM x 38MM,115VAC,100CFM,41dBA Panels for Enclosures ENCLOSURE,JUNCTION BOX,FIBERGLASS GRAY ENCLOSURE,JUNCTION BOX,FIBERGLASS GRAY TERMINAL,BUTT SPLICE CIRCULAR CABLE SEAL,6.5MM TO 13.5MM WIRING DUCT CUTTING TOOL,HAND HELD TERMINAL,MALE DISCONNECT,6.35MM,CRIMP RF/COAXIAL ADAPTER,MINI UHF PLUG-N JACK RF/COAXIAL,UHF PLUG,STRAIGHT,CRIMP RF/COAXIAL,TNC PLUG,STR,50 OHM,CLAMP RF/COAXIAL,TNC PLUG,STR,50 OHM,CRIMP RF/COAXIAL,TNC PLUG,STR,50 OHM,CRIMP RF/COAXIAL ADAPTER,TNC JACK-N PLUG RF/COAXIAL,TNC PLUG,STR,50 OHM,TWIST ON RF/COAXIAL BNC PLUG STR 50 OHM CLAMP/SLDR RF/COAXIAL,BNC PLUG,STR,75 OHM,CRIMP COAXIAL CABLE STRIPPER COAXIAL CABLE STRIPPER TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,SPADE/FORK,#8,CRIMP,BLUE TERMINAL,MALE DISCONNECT,0.25IN,RED TERMINAL,MALE DISCONNECT,0.25IN,BLUE TERMINAL,MALE DISCONNECT,0.25IN YELLOW TERMINAL,FEMALE DISCONNECT,0.25IN,RED TERMINAL,FEMALE DISCONNECT,0.25IN BLUE TERMINAL FEMALE DISCONNECT 0.25IN YELLOW TERMINAL,BUTT SPLICE,RED TERMINAL,BUTT SPLICE,BLUE TERMINAL,BUTT SPLICE,YELLOW TERMINAL,BUTT SPLICE,RED SOLDERLESS TERMINAL KIT CUTTER,SEMI FLUSH,2MM,126MM CUTTER,FULL FLUSH,1.3MM,126MM TOOLS,CRIMP,HYDRAULIC,HYDRAULDEG C,C CRIMP TOOL WIRE STRIPPER,16-26AWG,1.3MM CONNECTOR,POWER ENTRY,RECEPTACLE,15A CONNECTOR,POWER ENTRY,RECEPTACLE,15A CONNECTOR,POWER ENTRY,PLUG,15A CONNECTOR,POWER ENTRY,PLUG,10A CONNECTOR,POWER ENTRY,PLUG,10A CONNECTOR,POWER ENTRY,SOCKET,10A CONNECTOR,POWER ENTRY,PLUG,10A CONNECTOR,POWER ENTRY,PLUG,10A CONNECTOR,POWER ENTRY,PLUG,10A CONNECTOR,POWER ENTRY,PLUG,10A Air Filter TEST SOCKET,36A,STUD,BLACK TEST SOCKET,36A,STUD,RED SAFETY SOCKET,25A,SOLDER,BLACK SAFETY SOCKET,25A,SOLDER,RED TEST SOCKET,25A,SOLDER,BLACK TEST SOCKET,25A,SOLDER,RED RETRACTILE PLUG,36A,SCREW,BLACK RETRACTILE PLUG,36A,SOLDERLESS,RED TEST JACK,36A,SOLDER,BLACK TEST JACK,36A,SOLDER,RED BANANA PLUG,36A,SCREW,BLACK BANANA PLUG,36A,SCREW,RED BANANA PLUG,36A,SOLDERLESS,BLACK BINDING POST,36A,M6,TURRET,BLACK BINDING POST,36A,M6,TURRET,RED BINDING POST,36A,M6,TURRET,BLACK BANANA PLUG,36A,SOLDER,BLACK BANANA PLUG,36A,SOLDER,RED BANANA PLUG,36A,SCREW,BLACK BANANA PLUG,36A,SCREW,RED FEET (BUMPERS) FEET (BUMPERS) FEET (BUMPERS) FEET (BUMPERS) FEET (BUMPERS) FEET (BUMPERS) FEET (BUMPERS) FEET (BUMPERS) ENCLOSURES,GROMMET STRIP ACCESSORIES FEET (BUMPERS) FASTENERS,CLIP WIRE HARNESS CLIP WIRE HARNESS CLIP SPACER/STANDOFF,ROUND NYLON 9.5MMX9.5MM SPACER,ROUND,NYLON,9.5MM X 12.7MM SPACER,ROUND,NYLON,9.5MM X 15.9MM PCB,Accessories SPACER,ROUND,NYLON,0.25IN X 6.35MM SPACER,ROUND,NYLON,0.25IN X 9.53MM SPACER,ROUND,NYLON,0.25IN X 12.7MM SPACER,ROUND,NYLON,0.25IN X 19.05MM SPACER,ROUND,NYLON,0.25IN X 12.7MM SPACER,ROUND,NYLON,0.25IN X 19.05MM SPACER/STANDOFF,HEX NYLON 6.35MMX6.35MM SPACER/STANDOFF,HEX NYLON 6.35MMX9.53MM SPACER/STANDOFF,HEX NYLON 6.35MMX12.7MM SPACER,HEX,NYLON,6.35MM X 15.88MM SPACER/STANDOFF,HEX NYLON 6.35MMX25.4MM SPACER/STANDOFF,HEX NYLON 6.35MMX9.53MM SPACER,HEX,NYLON,6.35MM X 15.88MM SPACER,HEX,NYLON,6.35MM X 19.05MM SPACER/STANDOFF,HEX NYLON 6.35MMX25.4MM SPACER/STANDOFF,HEX NYLON 6.35MMX25.4MM SPACER/STANDOFF,HEX NYLON 6.35MMX6.35MM SPACER/STANDOFF,HEX NYLON 6.35MMX9.53MM SPACER/STANDOFF,HEX NYLON 6.35MMX12.7MM SPACER,HEX,NYLON,6.35MM X 15.88MM SPACER,HEX,NYLON,6.35MM X 19.05MM SPACER/STANDOFF,HEX NYLON 6.35MMX25.4MM SPACER/STANDOFF,HEX NYLON 6.35MMX6.35MM SPACER/STANDOFF,HEX NYLON 6.35MMX9.53MM SPACER/STANDOFF,HEX NYLON 6.35MMX12.7MM SPACER/STANDOFF,HEX NYLON 6.35MMX25.4MM SPACER,HEX,NYLON,6.35MM X 19.05MM SPACER/STANDOFF,HEX NYLON 6.35MMX25.4MM STRAIN RELIEF BUSHING,NYLON SPACER,ROUND,CERAMIC,0.25IN X 6.35MM SPACER,ROUND,CERAMIC,0.5IN X 25.4MM Standoff SPACER,HEX,BRASS,6.35MM X 15.875MM HEAT SHRINK TUBING ASSORTMENT KIT,102 6IN L PCS,BLK LAMP,INCANDESCENT,PK22S,6V,55W TUBE POUR CI TUBE POUR CI OUTIL D´EXTRACTION THERMOCOUPLE CONNECTOR,K TYPE SIGNAL RELAY DPDT 5VDC,5A,THROUGH HOLE CONTACT BLOCK,1NO,6A,QUICK CONNECT THREADED BUSHING ADAPTER MICRO SW,ROLLER PLUNGER,SPDT,15A 250V RECTANGULAR INSERT,PLUG,72POS Electronic bench DMM test lead kit,10 A CABLE,COAXIAL,RG59/U,20AWG,75 OHM,1000FT,BLK DIN MOUNTING RAIL,35MM,ALUMINIUM FERRITE CORE,FLAT CABLE,64MM X 1.3MM,290 OHM COAXIAL CABLE STRIPPER CONTACT,MALE,18AWG,CRIMP POWER RELAY,4PDT,24VDC,10A,PLUG IN SWITCH GUARD LED,RED,1.5MM X 2MM,6MCD,640NM LED,GREEN,1.5MM X 2MM,6.5MCD,570NM PANEL HOUSING,16B,METAL MICRO SWITCH,HINGE LEVER,SPDT 15A 250V WIRE STRIPPER MICRO SWITCH,PLUNGER,SPDT,25A,250V MICRO SWITCH,ROLLER LEVER SPDT 10A 250V RACK & PANEL CONNECTOR,PLUG,120POS Electronic Cartridge Fuse TOOLS,CRIMP MOUNTING BRACKET,CABINET RACKS,STEEL FAN TRAY,AC,3 FAN,80W,300CFM FAN TRAY,AC,9 FAN,120W,900CFM TERMINAL BLOCK JUMPER,10WAY,5.1MM BASIC SWITCH,OT PLUNGER,SPDT,15A,125V MOUNTING FLANGE LED MOUNTING CLIP RF/COAXIAL,BNC PLUG,STR,50 OHM,CRIMP LED,YELLOW,T-1 (3MM),10MCD,585NM RF/COAXIAL,BNC JACK,STR,50 OHM,CRIMP THERMOCOUPLE WIRE,TYPE K,24AWG,36´´L,PK5 THERMOCOUPLE WIRE,TYPE J,24AWG,36´´L,PK5 SWITCH,TOGGLE,DPST,20A,277V ELECTROMECHANICAL MULTIFUNCTION TIMER COAXIAL CABLE STRIPPER BEZEL TEST SPRING PROBE,PCB WASHER TERMINAL BLOCK,7POS,22-12AWG Cermet Potentiometer BANANA PLUG PATCH CORD,36IN,RED POWER RELAY,SPDT,5VDC,12A,PC BOARD SWITCH LEGEND PLATE SWITCH LEGEND PLATE FUSE,PCB,500mA,250V,TIME DELAY Fuseholder ((NW)) RESISTOR,METAL FILM,2.2 KOHM,1 W,5% RESISTOR,METAL FILM,4.7 KOHM,1 W,5% RESISTOR,METAL FILM,10 KOHM,2 W,5% CONNECTORS,TEST ENCLOSURE,INSTRUMENT,STEEL,BLACK RF/COAXIAL ADAPTER,SMA PLUG-TNC JACK TEST LEAD,BANANA,VIOLET,36IN,5000VDC TEST CLIP,1POS TEST LEAD,BANANA,GREEN,18IN,5000VDC TEST LEAD,BANANA,BLUE,24IN,5000VDC TEST LEAD,BANANA,ORANGE,36IN,5000VDC BANANA PLUG,15A,SCREW,VIOLET LAMP BASE,15/32IN,NEON PMI FUSE,BLADE,30A,32V,FAST ACTING FUSE HOLDER,6.3 X 32MM,PANEL MOUNT TERMINAL FEMALE DISCONNECT 0.25IN YELLOW TERMINAL,MECHANICAL LUG,#6IN,SOLDER BANANA JACK,SOLDER,RED BANANA JACK,SOLDER,BLACK SPACER/STANDOFF,NYLON,6.4MM X 6.4MM SPACER/STANDOFF,NYLON,6.4MM X 6.4MM SPACER/STANDOFF,NYLON,6.4MM X 9.5MM SPACER/STANDOFF,NYLON,6.4MM X 9.5MM SPACER/STANDOFF HEX NYLON 6.4MM X 19.1MM SPACER/STANDOFF,NYLON,6.4MM X 19.1MM SPACER/STANDOFF,NYLON,6.4MM X 25.4MM SPACER/STANDOFF,NYLON,6.4MM X 25.4MM INSTRUMENT HANDLE SWITCH,TOGGLE,SPST,20A,250V Plug-In Relay TERMINAL,SPADE/FORK,#6,CRIMP,YELLOW MULTI-PURPOSE STRIPPER/CUTTER/CRIMPER TOOL WIRE STRIPPER/CUTTER BINDING POST,15A,TURRET,YELLOW SPACER/STANDOFF,NYLON,6.4MM X 15.8MM PLUG-IN HOUSING SPACER/STANDOFF,ROUND NYLON 6.4MMX9.5MM SHLD MULTIPR CABLE 1PR 500FT 300V BLK SWITCH BOOT SSR,PCB MOUNT,264VAC,6VDC,10A LIMIT SWITCH ROLLER PLUNGER DPDT-2NO/2NC AUDIO CONNECTOR,JACK,5 CONTACTS CONNECTOR,DIN,PLUG,10POS Video jack,jack,75 Ohm,zinc alloy,ni Video jack,jack,75 Ohm,zinc alloy,ni Video jack,jack,75 Ohm,zinc alloy,ni IC,ANALOG SWITCH,QUAD,SPDT,SOIC-20 ZENER DIODE,500mW,5.1V,SOD-80 ZENER DIODE,500mW,5.6V,DO-35 ZENER DIODE,500mW,6.2V,DO-35 ZENER DIODE,500mW,12V,DO-35 Zener Diode Toroidal Transformer Power Rating:15VA TOROIDAL TRANSFORMER TOROIDAL TRANSFORMER COAXIAL CABLE,SERIES 6,18AWG,1000FT,BLACK Cable ID Markers TRIMMER,POTENTIOMETER 10KOHM 13TURN SMD RF/COAXIAL,BNC PLUG,STR,50 OHM,CRIMP RF/COAXIAL,TNC PLUG,STR,50 OHM,CRIMP POWER ENTRY MODULE,PLUG,15A RF/COAXIAL,MCX PLUG,R/A,50 OHM,CRIMP POTENTIOMETER CERMET,2KOHM 10%,1W POTENTIOMETER CERMET,5KOHM 10%,1W CAPACITOR ALUM ELEC 38000UF,50V,+75,-10%,SCREW Transglobal chassis mount transformer,s PIN HEADER,6POS,3.5MM POT,COND PLASTIC,10KOHM,20%,1W POT,COND PLASTIC,5KOHM,20%,1W Modular Connector Number of Contacts:6 DUAL CONDUCTOR WRIST BAND,ADJUSTABLE,THERMOPLASTIC,BLUE MICRO SWITCH,PIN PLUNGER,DPDT,8A 115V LED BULB,INTERMEDIATE SCREW LED REPLACEMENT BULB LED REPLACEMENT BULB LED BULB,TELEPHONE SLIDE,GREEN TERMINAL BLOCK,BARRIER,6POS,22-12AWG TERMINAL,BUTT SPLICE,6.35MM,NATURAL ENCLOSURE,WALL MOUNT,ALUMINIUM,GRAY FUSE SWITCH FUSE SWITCH SWITCH ACTUATOR SWITCH,DISCONNECT FUSIBLE 3PST 30A 600V SWITCH,DISCONNECT FUSIBLE 3PST 30A 600V SWITCH DISCONNECT FUSIBLE 3PST 100A 600V SWITCH,DISCONNECT,3PST,30A,600V Film Capacitor CAP FOOTED BRACKET,2.88´´ HEIGHT CAP MOUNTING BRACKET,2.12´´ BASE FRONT/REAR MOUNTING GASKET CIRCULAR CONN COAXIAL CABLE,RG-58C/U,60IN,BLACK RF/COAXIAL,BNC PLUG,STR,75 OHM,CRIMP SWITCH ACTUATOR INDICATING BANK BASE UNIT SWITCH,TOGGLE,SPST,20A,250V MICRO-D CONNECTOR,RECEPTACLE,15POS,WIRE LEADS IC,DAC,12BIT,102KSPS,TSSOP-16 IC,HIGH SIDE MOSFET PWR SW,5.5V 8-SOIC IC,MPU SUPERVISOR,15 uA,5.5V,SOT23-5 IC,MPU SUPERVISOR,15 uA,5.5V,SOT23-5 IC,MPU SUPERVISOR,15 uA,5.5V,SOT23-5 IC,MPU SUPERVISOR,15 uA,5.5V,SOT23-5 IC,MPU SUPERVISOR,15 uA,5.5V,SOT23-5 LIQUID CRYSTAL POLYMER CONNECTOR BANANA JACK,SOLDER CABLE CLAMP BODY PLATING:OLIVE DRAB CHROMATE/CADMI BODY PLATING:ANODIZED FOR USE WITH:MI SHLD MULTICOND CABLE,6COND,24AWG,1000FT,300V LENS,RECTANGULAR,YELLOW Cermet Potentiometer CIRCULAR CONNECTOR ADAPTER TEST LEAD,SINGLE,BLACK,60IN,300VAC TERMINAL,RING TONGUE,3/8IN,CRIMP TERMINAL,RING TONGUE,5/16IN,CRIMP TERMINAL,RING TONGUE,5/16IN,CRIMP LAMP,INCANDESCENT,230V,10W LAMP,INCANDESCENT,S.C. BAYONET,12.8V,26.88W WIRE STRIPPER/CUTTER TOOL,10-28AWG 20MM TERMINAL FEMALE DISCONNECT 0.25IN YELLOW TERMINAL,RING TONGUE,#10,CRIMP CRIMP DIE,30-506 CRIMP TOOL FRAME PUSHBUTTON SWITCH SWITCH LEGEND PLATE RF/COAXIAL,1.0/2.3 BHD JACK 50 OHM CRIMP CONTACT BLOCK,1NC,6A,QUICK CONNECT PLUG & SOCKET HOUSING,RECEPTACLE,NYLON DIN RAIL RELAY SOCKET PHOTOELECTRIC SENSOR POWER CORD,SCHUKO PLUG,2.5M,10A BLACK CAPACITOR POLY FILM 0.15UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.022UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.22UF,50V,5%,RADIAL CAPACITOR POLY FILM FILM 2.2UF,5%,50V, CAPACITOR POLY FILM 0.027UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.033UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.039UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.39UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.047UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.47UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.68UF,50V,5%,RADIAL CAPACITOR POLY FILM 0.01UF,100V,5%,RADIAL CAPACITOR POLY FILM 0.1UF,100V,5%,RADIAL CAPACITOR POLY FILM 0.47UF,100V,5%,RADIAL SIDE ENTRY HOOD,SIZE 24B,METAL LIMIT SWITCH,TOP PLUNGER,SPDT-1NO/1NC BULKHEAD HOUSING,SIZE 10A,METAL CABLE,UNSHLD MULTIPR,1PR,20AWG,1000FT,300V,CHR TERMINAL,RING TONGUE,#8,CRIMP CABLE BUSHING SIZE 14S/16/16S/18,RUBBER MICRO SWITCH,PLUNGER,SPDT,15A,250V RF/COAXIAL ADAPTER,SMA PLUG-TNC PLUG ADAPTER,MINI BANANA JACK-PIN TIP PLUG,BLACK TRIAXIAL CABLE,36IN,20AWG,YELLOW SHLD MULTIPR CABLE 2PR 100FT 150V CHR TERMINAL,RING TONGUE,1/4IN,CRIMP CIRCULAR CONNECTOR ADAPTER TRANSISTORS LENS,RECTANGULAR,ORANGE BANANA PLUG,5A,SOLDER,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,DESKTOP,PLASTIC,GRAY ENCLOSURE,DESKTOP,PLASTIC,GRAY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY ENCLOSURE JUNCTION BOX POLYCARBONATE GRY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY ENCLOSURE,JUNCTION BOX,PLASTIC,GRAY LED BULB,MIDGET GROOVE,YELLOW CAPACITOR CERAMIC 0.01UF 100V,X7R,10%,0805 TOOLS,HAND CRIMP Voltage Control Relay BANANA JACK,SOLDER,BLACK BANANA JACK,15A,TURRET,BROWN END CLAMP,TERMINAL BLOCK Panel for Enclosures N12 J ENCLOSURE,BOX W/COVER & PANEL,6X4X3,STEEL,GRAY ELECTROMECHANICAL TOTALIZING COUNTER PNEUMATIC SUB-BASE FOR LOGIC ELEMENT RESISTOR,POWER,25 OHM,55W,5% CONNECTOR CRIMP TOOL,NON-INSULATED TERMINALS & DISCONNECTS DUAL CONDUCTOR REMOTE INPUT JACK ENCLOSURE,JUNCTION BOX,STEEL,GRAY LCD DISPLAY PANEL TIMER,4 1/2 DIGIT SWITCH LEN LAMP,INCANDESCENT,MINI BAYONET/BA9S,130V BATTERY STRAP,9V,WIRE LEAD 7-Pc Nut Driver Set Product Description:Insulator kit for TO-220 (plastic TO-66) 30C0292 CONNECTORS STRAIN RELIEF COVER KIT,PPO ELECTRONIC TEST COMPANION KIT TEST LEAD KIT MALE SCREW RETAINER KIT,#4-40 DISSIPATEUR THERMIQUE PGA 8.6C/W DISSIPATEUR THERMIQUE PGA 8.2C/W DISSIPATEUR THERMIQUE PGA 7.1C/W DISSIPATEUR TO-220 DISSIPATEUR THERM. TO-220/SOT-32 18C/W DISSIPATEUR THERM. TO-220/SOT-32 15C/W DISSIPATEUR DISSIPATEUR THERM. TO-220/TO-3P 38.1C/W DISSIPATEUR THERMIQUE 150MM DISSIPATEUR THERMIQUE 50MM 1.5C/W DISSIPATEUR TOOL CASE SILVER TOOL CASE CLASSIC TOOL CASE CLASSIC TOOL CASE CARGO DETECT. DE PROX. D=3MM PNP A FERMETURE DETECT. DE PROX. M4 PNP A FERMETURE DETECT. DE PROX. M5 NPN A FERMETURE DETECT. DE PROX. M5 PNP A OUVERTURE DETECT. DE PROX. 5X5 PNP A FERMETURE DETECT. DE PROX. D=65MM PNP A FERMETURE DETECT. DE PROX. D=65MM PNP A FERMETURE DETECT. DE PROX. M8 PNP A OUVERTURE DETECT. DE PROX. M8 NPN A FERMETURE DETECT. DE PROX. M8 PNP A FERMETURE DETECT. DE PROX. M8 PNP A FERMETURE DETECT. DE PROX. 8X8 PNP A FERMETURE DETECT. DE PROX. M12 NPN A FERMETURE DETECT. DE PROX. M12 PNP A FERMETURE DETECT. DE PROX. M12 PNP A FERMETURE DETECT. DE PROX. M12 PNP A FERMETURE DETECT DE PROX METAL F=1 M12 PNP A FERM DETECT DE PROX METAL F=1 M12 PNP A OUV DETECT DE PROX METAL F=1 M12 NPN A FERM DETECT DE PROX METAL F=1 M12 PNP A FERM DETECT DE PROX METAL F=1 M12 PNP A OUV DETECT. DE PROX. M18 PNP A FERMETURE CORPS DE FICHE DETECT DE PROX METAL F=1 M18 PNP A FERM DETECT DE PROX METAL F=1 M18 PNP A FERM DETECT. DE PROX. M30 NPN A FERMETURE CORPS D´EMBASE CORPS D´EMBASE DETECT DE PROX METAL F=1 M30 PNP A FERM DETECT DE PROX ETANCHE M5 NPN A FERM DETECT DE PROX ETANCHE M5 PNP A FERM DETECT DE PROX HTE PRESSION PNP A FERM DETECT DE PROX AVEC SORTIE ANALOG. M8 DETECT DE PROX AVEC SORTIE ANALOG. M18 CELLULE A REFLEX M4 NPN COMMUT EN RECEPT CELLULE A REFLEX M5 PNP COMMUT EN RECEPT CELLULE A REFLEX M5 NPN COMMUT EN RECEPT CELLULE A REFLEX M12 NPN COMMUT RECEPT CELLULE A REFLEX M12 PNP COMMUT RECEPT CELLULE A REFLEX M12 PNP COMMUT RECEPT AMPLI A FIBRE OPTIQUE NPN TEACH-IN FIBRE OPTIQUE REFLEX DIRECTE M6 FIBRE OPTIQUE STANDARD BARRIERE M5 INSERT MALE HAN 4A ANEMOMETER,POCKET BANDE REFLECHISSANTE 5M TACHYMETRE OPTIQUE/LASER POCKET SCALE,500G PINCE CROCODILE PQ2 ADAPTATEUR ROUGE PQT 2 ADAPTATEUR NOIR PQT2 TOOL ASSEMBLY,PRESS FIT SOCKETS SONDE DE CHAMP PROCHE LIMITATEUR DE TRANSITOIRE ADAPTATEUR SPEAKON FEMELLE-XLR MALE ADAPTATEUR JACK 6.35MM M-M 3 POLES FICHE JACK 6.35MM COUDEE MONO MANCHON ANTI-TRACTION XLR ROUGE PILE LITHIUM BATTERIE 6V 10AH Leaded Choke CIRCUIT BREAKER,THERMAL,1P,250V 500mA TIME DELAY RELAY,SPST-NO,1000SEC,240V LABEL,TESTED FOR ELEC SAFETY,PK100 LABEL,NEXT DUE,PK100 LABEL,EQUIPMENT NO,PK100 LABEL,TAMPERPROOF,PK100 LABEL,110V,CARD OF 10 LABEL,110VAC,CARD OF 10 LABEL,240VAC,CARD OF 10 ETIQUETTE EPROM PQ500 Resistors,Carbon Series:RC Resistors,Carbon Series:RC Resistors,Carbon Series:RC Resistors,Carbon Series:RC WIRE WRAPPING WIRE,5IN,30AWG,CU,BLUE RESISTOR WIREWOUND,1OHM,300W,10% RESISTOR,WIREWOUND,20OHM,300W,10% RESISTOR,WIREWOUND,25OHM,50W,5% RESISTOR WIREWOUND,100OHM,50W,5% RESISTOR,WIREWOUND,100KOHM,225W,5% Mounting Bracket Mounting Bracket BIPOLAR TRANSISTOR,NPN,180V TO-92 IC,LINEAR VOLTAGE REGULATOR,15V,TO-92 IC,NEGATIVE VOLT REGULATOR,-15V,TO-92 WIRE WRAPPING WIRE,100FT,30AWG,CU,BLACK WIRE WRAPPING WIRE,3IN,30AWG,CU,BLUE AMPEREMETRE DIN 200A BLOC DE JONCTION 4P PQ10 ELEMENT CHAUFFANT 150W PANNEAU LATERAL PANNEAU LATERAL WIRE WRAPPING WIRE,7IN,30AWG CU,WHITE WIRE WRAPPING WIRE,5IN,30AWG CU,WHITE Enclosure Enclosure Incandescent Filament Lamp 26C0308 SELF-LAMINATING CABLE ID MARKERS Enclosure CUTTER,PCB REWORK KIT DE TOURNEVIS DE PRECISION TOOL WALLET EMPTY SOCLE A MONTAGE PERMANENT POUR ETAU RESISTANCE 100R 5KW HEADSET,VOICE BAND SILVER IC,SINGLE UART,FIFO,1MBPS 3.6V TQFP48 CONTACT,PIN,24-20AWG,CRIMP WIRE-BOARD CONNECTOR,PIN,1POS,2.54MM WIRE-BOARD CONN,RECEPTACLE,4POS,2.54MM WIRE-BOARD CONN,RECEPTACLE,2POS,2.54MM WIRE-BOARD CONN,FEMALE,2POS,3.96MM WIRE-BOARD CONN,FEMALE,2POS,3.96MM WIRE-BOARD CONN,FEMALE,4POS,3.96MM BOARD-BOARD CONNECTOR HEADER,4WAY,1ROW DIN 41612 PCB CONNECTOR,PLUG,64WAY WIRE-BOARD CONN,FEMALE,10POS,2.54MM INSERT POUR SUPPORT PILE STRAIN RELIEF COVER,10WAY CONNECTOR ((NW)) OUTILLAGE 0.14 - 0.56MM STATION DIGITALE 80W TECH BAIN DE SOUDURE BAIN DE SOUDURE RESISTOR,ISO RES ARRAY 4,10KOHM 5%,SMD POT,COND PLASTIC,10KOHM 20%,50mW RESISTOR,THIN FILM,100 OHM,100mW,0.1% RESISTOR,THIN FILM,20KOHM,100mW,0.1% RESISTOR,THIN FILM,2KOHM,100mW,0.1% RESISTOR,THIN FILM,499 OHM,100mW,0.1% RJ12 MODULAR PLUG,6POS,1 PORT RJ22 MODULAR PLUG,4POS,1 PORT RJ22 MODULAR PLUG,4POS,1 PORT Series Resonant Crystal Frequency:4MHz CRYSTAL OSCILLATOR,10MHZ,THD CRYSTAL OSCILLATOR,20MHZ,THD CRYSTAL OSCILLATOR,10MHZ,THD CRYSTAL OSCILLATOR,9.8304MHZ,THD CRYSTAL OSCILLATOR,10MHZ,THD CRYSTAL OSCILLATOR,4.9152MHZ,THD CRYSTAL OSCILLATOR,20MHZ,SMD CRYSTAL OSCILLATOR,4.9152MHZ,SMD CRYSTAL,12MHZ,SMD CRYSTAL,24MHZ,SMD CRYSTAL,3.6864MHZ,SMD CRYSTAL,6MHZ,SMD Crystal CRYSTAL,3.579545MHZ,THROUGH HOLE CRYSTAL,8MHZ,THROUGH HOLE RESISTOR,THICK FILM,15KOHM,125mW,1% Thick Film Resistor Network RESISTOR,METAL OXIDE,500KOHM,10W,1% RESISTOR METAL OXIDE,1MOHM,2W,1% RESISTOR,METAL OXIDE,0.18GOHM,1W,1% Wirewound Resistor Series:WSC RESISTORS,WIRE WOUND SERIES:WSC RESISTOR,METAL FILM,402KOHM,125mW,1% RESISTOR,METAL FILM,332KOHM,125mW,1% SWITCH,ROTARY,SPST,3A,125V RESISTOR,METAL FILM,5.1KOHM,125mW,1% RESISTOR,METAL FILM,1MOHM,125mW,1% CAPACITOR TANT,1UF,35V,RADIAL 10% RESISTOR,METAL FILM,5MOHM,125mW,1% RESISTOR,METAL FILM,18.7KOHM,125mW,1% CAPACITOR TANT,0.1UF,50V,RADIAL 20% CAPACITOR TANT,0.1UF,35V,RADIAL 10% CAPACITOR TANT,1UF,50V,RADIAL 20% CAPACITOR TANT,10UF,25V,RADIAL 20% CAPACITOR TANT,10UF,6.3V,RADIAL 20% CAPACITOR TANT,10UF,35V,RADIAL 10% CAPACITOR TANT,15UF,16V,RADIAL 20% LABEL,BARCODE SERIAL NO. CAPACITOR TANT,22UF,35V,RADIAL 10% CAPACITOR TANT,0.47UF,50V,RADIAL 10% CAPACITOR TANT,4.7UF,10V,RADIAL 20% CAPACITOR TANT,4.7UF,50V,RADIAL 20% CAPACITOR TANT,4.7UF,35V,RADIAL 10% CAPACITOR TANT,47UF,16V,RADIAL 20% CAPACITOR TANT,6.8UF,35V,RADIAL 20% RESISTOR,METAL FILM,15MOHM,125mW,1% RESISTOR SMT,1.27KOHM,.125W,1206,CAS RESISTOR,METAL FILM,14KOHM,125mW,1% Metal Film Resistor RESISTOR,METAL FILM,2.15KOHM,125mW,1% RESISTOR,METAL FILM,22.6KOHM,125mW,1% RESISTOR,METAL FILM,392KOHM,125mW,1% RESISTOR,METAL FILM,4.32KOHM,125mW,1% RESISTOR,METAL FILM,4.99MOHM,125mW,1% RESISTOR,METAL FILM,6.49KOHM,125mW,1 RESISTOR,METAL FILM,68.1KOHM,125mW,1% RESISTOR,METAL FILM,909KOHM,125mW,1% RJ12 MODULAR PLUG,6POS,1 PORT Desc: Keystone Jack,Enhanced,Category CATEGORY 5E CABLE ASSEMBLY RESISTOR,METAL FILM,1.5KOHM,125mW,1% RESISTOR,METAL FILM,20KOHM,125mW,1% RESISTOR,METAL FILM,249 OHM,125mW,0.1% RESISTOR,METAL FILM,4.75KOHM,100mW,1% RESISTOR,METAL FILM,47.5KOHM,125mW,1% RESISTOR,METAL FILM,49.9KOHM,125mW,1% RESISTOR,METAL FILM,10.2KOHM,125mW,1% RESISTOR,METAL FILM,1.07KOHM,125mW,1% RESISTOR,METAL FILM,10.7KOHM,125mW,1% RESISTOR,METAL FILM,110 OHM,125mW,1% RESISTOR,METAL FILM,1.1KOHM,125mW,1% RESISTOR,METAL FILM,11KOHM,125mW,1% RESISTOR,METAL FILM,121 OHM,125mW,1% RESISTOR,METAL FILM,1.21KOHM,125mW,1% RESISTOR,METAL FILM,12.1KOHM,125mW,1% RESISTOR,METAL FILM,1.24KOHM,125mW,1% RESISTOR,METAL FILM,130 OHM,125mW,1% RESISTOR,METAL FILM,1.3KOHM,125mW,1% RESISTOR,METAL FILM,14.7KOHM,125mW,1% RESISTOR,METAL FILM,150 OHM,125mW,1% RESISTOR,METAL FILM,15KOHM,125mW,1% RESISTOR,METAL FILM,150KOHM,125mW,1% RESISTOR,METAL FILM,16.2KOHM,125mW,1% RESISTOR,METAL FILM,17.4KOHM,125mW,1% RESISTOR,METAL FILM,18.2KOHM,125mW,1% RESISTOR,METAL FILM,20 OHM,125mW,1% RESISTOR,METAL FILM,2.1KOHM,125mW,1% RESISTOR,METAL FILM,21.5KOHM,125mW,1% RESISTOR,METAL FILM,2.32KOHM,125mW,1% RESISTOR,METAL FILM,237 OHM,125mW,1% RESISTOR,METAL FILM,243 OHM,125mW,1% RESISTOR,METAL FILM,2.43KOHM,125mW,1% RESISTOR,METAL FILM,24.3KOHM,125mW,1% RESISTOR,METAL FILM,243KOHM,125mW,1% RESISTOR,METAL FILM,2.49KOHM,125mW,1% RESISTOR,METAL FILM,24.9KOHM,125mW,1% RESISTOR,METAL FILM,249KOHM,125mW,1% RESISTOR,METAL FILM,2.55KOHM,125mW,1% RESISTOR,METAL FILM,2.67KOHM,125mW,1% RESISTOR,METAL FILM,274 OHM,125mW,1% RESISTOR,METAL FILM,2.74KOHM,125mW,1% RESISTOR,METAL FILM,2.8KOHM,125mW,1% RESISTOR,METAL FILM,28KOHM,125mW,1% RESISTOR,METAL FILM,301 OHM,125mW,1% RESISTOR,METAL FILM,30.1KOHM,125mW,1% RESISTOR,METAL FILM,3.16KOHM,125mW,1% RESISTOR,METAL FILM,3.24KOHM,125mW,1% RESISTOR,METAL FILM,32.4KOHM,125mW,1% RESISTOR,METAL FILM,332 OHM,125mW,1% RESISTOR,METAL FILM,3.32KOHM,125mW,1% RESISTOR,METAL FILM,33.2KOHM,125mW,1% RESISTOR,METAL FILM,348 OHM,125mW,1% RESISTOR,METAL FILM,3.48KOHM,125mW,1% RESISTOR,METAL FILM,3.92KOHM,125mW,1% RESISTOR,METAL FILM,40.2KOHM,125mW,1% RESISTOR,METAL FILM,40.2 OHM,125mW,1% RESISTOR,METAL FILM,42.2KOHM,125mW,1% RESISTOR,METAL FILM,45.3KOHM,125mW,1% RESISTOR,METAL FILM,4.64KOHM,125mW,1% RESISTOR,METAL FILM,475 OHM,125mW,1% RESISTOR,METAL FILM,47.5KOHM,125mW,1% RESISTOR,METAL FILM,47.5 OHM,125mW,1% RESISTOR,METAL FILM,511 OHM,125mW,1% RESISTOR,METAL FILM,5.11KOHM,125mW,1% RESISTOR,METAL FILM,51.1KOHM,125mW,1% RESISTOR,METAL FILM,51.1 OHM,125mW,1% RESISTOR,METAL FILM,5.62KOHM,125mW,1% RESISTOR,METAL FILM,56.2KOHM,125mW,1% RESISTOR,METAL FILM,604 OHM,125mW,1% RESISTOR,METAL FILM,60.4KOHM,125mW,1% RESISTOR,METAL FILM,6.19KOHM,125mW,1% RESISTOR,METAL FILM,681 OHM,125mW,1% RESISTOR,METAL FILM,6.81KOHM,125mW,1% RESISTOR,METAL FILM,6.98KOHM,125mW,1% RESISTOR,METAL FILM,750 OHM,125mW,1% RESISTOR,METAL FILM,75KOHM,125mW,1% RESISTOR,METAL FILM,8.06KOHM,125mW,1% RESISTOR,METAL FILM,80.6KOHM,125mW,1% RESISTOR,METAL FILM,825 OHM,125mW,1% RESISTOR,METAL FILM,8.25KOHM,125mW,1% RESISTOR,METAL FILM,82.5KOHM,125mW,1% RESISTOR,METAL FILM,82.5 OHM,125mW,1% RESISTOR,METAL FILM,8.45KOHM,125mW,1% RESISTOR,METAL FILM,909 OHM,125mW,1% RESISTOR,METAL FILM,90.9KOHM,125mW,1% RESISTOR,METAL FILM,95.3KOHM,125mW,1% RESISTOR,METAL FILM,97.6KOHM,125mW,1% RESISTOR,METAL FILM,10KOHM,125mW,0.1% RESISTOR,METAL FILM,100 OHM,250mW,0.1%,AXIAL LEADED RESISTOR,METAL FILM,100 OHM,250mW,1% RESISTOR,METAL FILM,1KOHM,250mW,0.1% RESISTOR,METAL FILM,1KOHM,250mW,1% RESISTOR,METAL FILM,100KOHM 250mW,0.1% RESISTOR,METAL FILM,20KOHM,250mW,1% RESISTOR,METAL FILM,499 OHM,250mW,1% RESISTOR,METAL FILM,100 OHM,250mW,1% RESISTOR,METAL FILM,10KOHM,250mW,1% RESISTOR,METAL FILM,10 OHM,250mW,1% RESISTOR,METAL FILM,150 OHM,250mW,1% RESISTOR,METAL FILM,1.5KOHM,250mW,1% RESISTOR,METAL FILM,15KOHM,250mW,1% RESISTOR,METAL FILM,200 OHM,250mW,1% RESISTOR,METAL FILM,20KOHM,250mW,1% RESISTOR METAL FILM,2.21KOHM,250mW,1% RESISTOR METAL FILM,249 OHM,250mW,1% RESISTOR,METAL FILM,3.01KOHM,250mW,1% RESISTOR,METAL FILM,3.32KOHM,250mW,1% RESISTOR,METAL FILM,4.02KOHM 250mW 0.1% RESISTOR,METAL FILM,4.75KOHM,250mW,1% RESISTOR,METAL FILM,499 OHM,250mW,1% RESISTOR,METAL FILM,49.9KOHM,250mW,1% RESISTOR,METAL FILM,511 OHM,250mW,1% RESISTOR,METAL FILM,1KOHM,250mW,1% RESISTOR,METAL FILM,249 OHM,250mW,1% RESISTOR,METAL FILM,250 OHM,250mW,0.1% RESISTOR,METAL FILM,100 OHM,500mW,1% RESISTOR,METAL FILM,1KOHM,500mW,1% RESISTOR,METAL FILM,10KOHM,500mW,1%,AXIAL LEADED RESISTOR,METAL FILM,100KOHM,500mW,1% RESISTOR,METAL FILM,1MOHM,500mW,1% RESISTOR,METAL FILM,1.5KOHM,500mW,1% RESISTOR,METAL FILM,20KOHM,500mW,1% RESISTOR,METAL FILM,249 OHM,500mW,1% RESISTOR,METAL FILM,499 OHM,500mW,1% RESISTOR,METAL FILM,499KOHM,500mW,1% COMPUTER CABLE,POWER SPLITTER,12IN COMPUTER CABLE,NULL MODEM,PUTTY OUTDOOR EXTENSION CORD 25FT,15A,ORANGE POTENTIOMETER,COND PLASTIC,50KOHM,10%,2W RJ45 MODULAR PLUG,8POS,1 PORT POT COND PLASTIC,10KOHM 10%,500mW RESISTOR,METAL FILM,1KOHM,125mW,0.1% CAT5E RJ45 MODULAR JACK,8POS,2 PORT CATEGORY 5E CABLE ASSEMBLY RESISTOR,METAL FILM,1KOHM,250mW,1% RESISTOR,THICK FILM,499KOHM,125mW,1% RESISTORS,THICK FILM SERIES:CRCW RESISTORS,THICK FILM SERIES:CRCW RESISTOR,THICK FILM,60.4KOHM,250mW,1% RESISTOR,METAL FILM,10KOHM,250mW,1% RESISTOR,METAL FILM,10 OHM,125mW,1% Modular Connector COMPUTER CABLE,USB 1.0,5M,PUTTY COMPUTER CABLE,USB 1.0,2M,GRAY Connector assemblies,Computer cables Connector assemblies,Computer cables COMPUTER CABLE,IEEE 1284,3FT,PUTTY CAT6 PUNCH DOWN MODULAR JACK,1 PORT COMPUTER CABLE,MOUSE ADAPTER 0.5FT PUTT BINDING POST,60A,SCREW,BLACK BANANA PLUG ASSEMBLY,SCREW Terminal Block Mounting Type:PC Board POTENTIOMETER,COND PLASTIC,500 OHM,0.1,2W TERMINAL,MECHANICAL LUG,#6,SOLDER LOUPE X8 CUTTER/PLIER COMBINATION PANNE BISEAU 1.6MM PANNE POINTE 1.2MM (XY9/258/268/200GX) PANNE 5MM BISEAU 45DEG PANNE 0.8MM POUR 136/137 PANNE POINT 0.8MM POUR 136/137 PANNE CHISEL 1.6MM POUR 136/137 PANNE CONIQUE 5MM POUR 200PHG/25/40W PANNE BISEAU 5MM POUR 200PHG/25/40W PANNE CONIQUE 5MM POUR 200PHG/60W PANNE BISEAU 5MM POUR 200PHG/60W BALUN,2.45GHZ,50/200OHM,0805 TERMINAL BLOCK,BARRIER,2POS,14-4AWG TERMINAL BLOCK,BARRIER,3POS,14-4AWG TERMINAL BLOCK,BARRIER,3POS,14-2AWG TERMINAL BLOCK,BARRIER,3POS,14-2AWG TERMINAL BLOCK,BARRIER,2POS,3/8-16AWG PCB,Tracks(Strip Board) BEACON LIGHT,FLASHING,290mA,120V,40W,RED TERMINAL,TURRET,#8-32,SOLDER,WHITE Switches,Rocker Switch Function:SPDT Rocker Switch Rocker Switch Rocker Switch 28 VOLTS 3/8´´´´ OIL TIGHT INDICATOR HEAT SHRINK CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS Label Printer Tape 19C7408 SHRINK TUBING LABELING MATERIAL/ PRINTER CARTRIDGE SHRINK TUBING LABELING MATERIAL/ PRINTER CARTRIDGE Label Printer Tape 19C7432 SELF LAMINATING CABLE ID MARKERS SELF LAMINATING CABLE ID MARKERS Labels CARD EDGE CONNECTOR,SOCKET,44POS LAMP,INDICATOR,NEON,RED,125V ROUND KNURLED KNOB W/ ARROW IND,6.35MM TRANSDUCER,TONE GENERATOR,110DB,120V TRANSDUCER,PIEZO,2.9KHZ,97DBA,120V TRANSDUCER,PIEZO,2.9KHZ,95DBA,28V POINTER BAR SKIRTED KNOB,6.35MM POINTER BAR KNOB,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,3.175MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM POINTER BAR SKIRTED KNOB,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM ROUND KNOB,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM POINTER BAR KNOB,6.35MM Vibration Transducer Vibration Transducer LAMP,HALOGEN,120V,40W BEACON LIGHT ROTATING,350mA,AMBER BEACON LIGHT ROTATING,350mA,RED ROTATING,BEACON,LIGHT,115mA DIN MOUNTING RAIL STANDARD TERMINAL BLOCK BEACON LIGHT Ceramic Multilayer Capacitor SCR THYRISTOR,350A,4.5KV,T 82 POWER BLOCK COVER,PLASTIC TERMINAL BLOCK,BARRIER,3POS,1/4-20AWG Multi contact tool handle BINDING POST,15A,#6-32,STUD BLACK/RED Test Connector FASTENERS,SCREWS 70B8270 TERMINAL BLOCK,BARRIER,5POS,22-12AWG TERMINAL BLOCK,BARRIER,6POS,22-12AWG TRI-BARRIER TERMINAL BLOCK,RAISED BASE SOCKET ASSEMBLY TERMINAL BLOCK,BARRIER,8POS,22-12AWG TERMINAL BLOCK,BARRIER,10POS,22-12AWG TERMINAL BLOCK,BARRIER,4POS,22-12AWG CARD EJECTOR HANDLE,WHITE NYLON BEACON LIGHT FLASHING HALOGEN 300mA CRANK HANDLE ROUND KNOB,6.35MM PANEL MOUNT INDICATOR,LED,7.92MM,GREEN,24V PANEL MOUNT INDICATOR,LED,7.92MM,RED,125V PANEL MOUNT INDICATOR,LED,7.92MM,RED,12V PANEL MOUNT INDICATOR,LED,7.92MM,RED,24V TERMINAL BLOCK,BARRIER,4POS,22-12AWG TERMINAL BLOCK,BARRIER,8POS,22-12AWG TERMINAL BLOCK,BARRIER,12POS,22-12AWG Standard Terminal Block ROUND POINTER SKIRTED KNOB,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM Single row terminal block,14-16 America LED MOUNTING RING Enclosures,Accessories ROUND KNURLED KNOB,3.175MM ROUND KNURLED KNOB,6.35MM ROUND KNURLED KNOB W/ LINE IND,3.175MM ROUND KNURLED KNOB WITH LINE IND,6.35MM ROUND KNURLED KNOB,6.35MM ROUND KNURLED KNOB,6.35MM ROUND KNURLED KNOB WITH LINE IND,6.35MM ROUND KNURLED KNOB,3.175MM ROUND KNURLED KNOB,6.35MM ROUND KNURLED KNOB WITH LINE IND,6.35MM PANEL MOUNT INDICATOR,LED,12.7MM,AMBER,24V PANEL MOUNT INDICATOR,LED,12.7MM,GREEN,24V LED LAMP VARIABLE TRANSFORMER Variable Transformer TRANSDUCER,PIEZO,2.9KHZ,90DBA,28VDC Single row terminal block,14 American w TEST RECEPTACLE,SKT-RCPT,100A,WW,BLU VARIABLE TRANSFORMER TERMINAL BLOCK JUMPER,3WAY,9.5MM LAMP,INDICATOR,INCAND,GRN LAMP,INDICATOR,INCANDESCENT,RED LAMP,INDICATOR,NEON,GREEN,125V LAMP,INDICATOR,NEON,RED,125V LOAD FORCE:30-0.06/2.5-060 OUNCE-INCH SOLENOID DUTY CYCLE:INTERMITTENT LOAD FORCE:30-0.12/4-0.50 OUNCE-INCH SOLENOID DUTY CYCLE:INTERMITTENT AC voltage box frame solenoid,maximum o Box Frame Solenoid Solenoid Duty Cycle:I SOLENOID DUTY CYCLE:INTERMITTENT Cylindrical Solenoid Solenoid Duty Cycle MINIATuRE INDICATOR LIGHT,2.5 MILLICAND PANEL MOUNT INDICATOR,LED,5MM,GREEN,24V PANEL MOUNT INDICATOR,LED,5MM,RED,24V PANEL MOUNT INDICATOR,LED,5MM,YELLOW,24V TERMINAL BLOCK JUMPER,2WAY,9.65MM 36 SERIES PRESSFIT INDICATOR LIGHTS W/ L TRANSDUCER,PIEZO,2.9KHZ,95DBA,16VDC PB Series Pushbutton Miniature Switch,P ROUND SKIRTED KNOB,3.175MM POINTER BAR SKIRTED KNOB,6.35MM POINTER BAR SKIRTED KNOB,6.35MM ROUND SKIRTED KNOB,3.175MM ROUND SKIRTED KNOB,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,3.175MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM ROUND POINTER SKIRTED KNOB,3.175MM DUCT COVER,PVC,LT GRY,31.8MM W,6FT/1.82M L,PER FT ROUND POINTER SKIRTED KNOB,6.35MM ROUND KNOB,6.35MM POINTER BAR KNOB,6.35MM POINTER BAR KNOB,6.35MM ROUND SKIRTED KNOB,6.35MM ROUND POINTER SKIRTED KNOB,6.35MM ROUND KNOB,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM ROUND SKIRTED KNOB W/ ARROW IND,6.35MM PANEL MOUNT INDICATOR,LED,6.2MM,GREEN,24V SOCKET,PANEL,MINI,YELLOW,TYPE K SOCKET,PANEL,MINI,GREEN,TYPE K CAPTEUR DE TEMP+TETE CAPTEUR DE TEMP+TETE Circular Connector CURRENT SENSOR PHOTOELECTRIC SENSOR,OTICAL TOUCH,NPN ENCLOSURE,JUNCTION BOX,STEEL,GRAY Small Enclosure ENCLOSURE,JUNCTION BOX,STEEL,GRAY Outlet Surge Suppressor Transient Energy TIME DELAY RELAY,SPST-NO,100SEC,12VDC TIME DELAY RELAY,SPST-NO,20SEC,120VAC TIME DELAY RELAY SPST-NO,100SEC,120VAC TIME DELAY RELAY SPST-NO,100SEC,120VAC TIME DELAY RELAY,SPST-NO,20SEC,24VDC PCB PLUGBOARD,28/56 @0.125´´CARD EDGE BREADBOARD,SELF POWERED,2250 TIE POINTS PROTO-BOARD WORKSTATION BREADBOARD,100 TIE POINTS BREADBOARD BUS STRIP,590 TIE POINTS BREADBOARD,MOLD-IN BUS STRIPS,840 TIE POINTS 350 JUMPER ASSORTMENT KIT TOOLS,CUTTERS,CUTTERS,PUNCH DOWN TOOL PROTOTYPING BREADBOARD KIT W/ POWER SUPPLY TIME DELAY RELAY,SPST-NO,10SEC,12VDC TIME DELAY RELAY,SPST-NO,20SEC,12VDC TIME DELAY RELAY,SPST-NO,100SEC,12VDC TIME DELAY RELAY,SPST-NO,100SEC,12VDC HOSPITAL GRADE OUTLET STRIP,6-OUTLET,1 POWER OUTLET STRIP POWER OUTLET STRIP DIAL CALIPER,6IN ELECTROMECHANICAL HOUR METER Vacuum Cleaner Cleaning Kit CURRENT SENSOR CURRENT SENSOR SOLID STATE FLASHER SPST-NO 60FPM 120VAC SOLID STATE FLASHER SPST-NO 60FPM,24VDC Variable Transformer Variable Transformer ISOLATION TRANSFORMER ENCLOSURE,WALL MOUNT,STEEL,GRAY ENCLOSURE,WALL MOUNT,STEEL,GRAY ENCLOSURE,WALL MOUNT,STEEL,GRAY ENCLOSURE,WALL MOUNT,STEEL,GRAY ENCLOSURE,WALL MOUNT,STEEL,GRAY TIME DELAY RELAY,SPST-NO,10SEC,24VDC ISOLATION TRANSFORMER ONE-REV 150mm Dial Caliper,4-Way Measur MEASURING,RULER,RULER,MEASURING,RULE MEASURING,RULER,RULER,MEASURING,RULE MEASURING,RULER,RULER,MEASURING,RULE MEASURING,RULER,RULER,MEASURING,RULE MEASURING,RULER,RULER,MEASURING,RULE MEASURING,FEELER GAUGE,FEELER GAUGE,M ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK BALANCE COMPACTE BALANCE COMPACTE OUTIL POUR CONNECTEURS 3M SOCKET FOR CRYSTALS,PRECISION FEUILLE THERMO CONDUCTRICE ADHESIVE TENS STIMULATOR,MINI EMBASE IEC MALE CD PLAYER,PERSONAL CD PLAYER,PERSONAL AUTOMOTIVE BRACKET SUCTION BRACKET SWITCH,TACTILE,SPST-NO,50mA,THD FICHE FEMELLE ETANCHE 9V EVAL BOARD,LM2679 5V,5A REGULATOR KIT MINI-BRUCELLES MT100 FER AIR CHAUD TJ80 PANNE 0.2MM PANNE 0.7MM X 0.5MM PANNE 0.7MM X 2MM PANNE 0.7MM X 6MM PANNE 0.7MM X 8MM PANNE 0.7MM X 10MM FORET DIN338 N HSS 12.5MM TWIST DRILL SET,STEEL CASE DRILL,TUBE/SHEET,HSS,CBN,NO.2 DRILL,TUBE/SHEET,HSS,CBN,NO.3 DRILL,TUBE/SHEET,HSS,CBN,NO.4 DEBURRER,HAND,HSS,DIN335C,90DEG HOLE SAW,HSS,BI-METAL,27MM HOLE SAW,HSS,BI-METAL,32MM HOLE SAW,HSS,BI-METAL,35MM HOLE SAW,HSS,BI-METAL,41MM HOLE SAW,HSS,BI-METAL,51MM HOLE SAW,HSS,BI-METAL,57MM HOLE SAW,HSS,BI-METAL,83MM HOLE SAW,HSS,BI-METAL,92MM HOLE SAW,HSS,BI-METAL,105MM HOLE SAW SET,IN PLASTIC CASE HAMMER DRILL SET,SDS PLUS PUNCH,HOLE,ROUND,16.5MM PUNCH,HOLE,ROUND,20MM PUNCH,HOLE,ROUND,22MM PUNCH,HOLE,ROUND,25.4MM PUNCH,HOLE,ROUND,32MM PUNCH,HOLE,ROUND,32.5MM PUNCH,HOLE,ROUND,35MM PUNCH,HOLE,ROUND,40.5MM PUNCH,HOLE,ROUND,45MM PUNCH,HOLE,ROUND,50.5MM FORET DIN340 N HSS 3.3MM FORET DIN340 N HSS 3.5MM FORET DIN340 N HSS 4.5MM FORET DIN340 N HSS 5MM CONDENSATEUR 16V 100000UF CONDENSATEUR 63V 150000UF CONDENSATEUR 63V 22000UF CONDENSATEUR 63V 47000UF CONDENSATEUR 100V 22000UF FAULT FINDER,FIBRE,VISUAL LAMPE TORCHE LAMPE TORCHE A LED - BLEU CAPACITOR CERAMIC,0.1UF,50V,Z5U,+80,-20%,0805 CAPACITOR CERAMIC,0.1UF,16V,X7R,10%,1206 CAPACITOR CERAMIC 0.01UF,25V,X7R,10%,1206 CAPACITOR CERAMIC,0.1UF,25V,Z5U,20%,1206 CAPACITOR CERAMIC,0.1UF,50V,Z5U,20%,1206 IC Package/Case:9-SIP LED BULB,BA9S,GREEN,BA9S Ceramic Multilayer Capacitor FUSE,CARTRIDGE,1A,6.3 X 32MM FUSE BLOCK,CLASS H FUSE,SCREW MOUNT FUSE,1.25A,250V,TIME DELAY FUSE,40A,600V,FAST ACTING FUSE,60A,600V,FAST ACTING FUSE,5A,250V,ONE TIME FUSE,10A,500V,FAST ACTING CONNECTOR,RCA/PHONO,PLUG,3POS CAT5E RJ45 MODULAR JACK,8POS,1 PORT SCR THYRISTOR,25A,400V,TO-220 TAP,SPECIAL,M20 TAP,SPECIAL,M25 TAP,SPECIAL,M32 SPECIAL TAP SET,ELEKTRO STEP DRILL,HSS,DIN EN60423 NEMA Type 3R,3RX,4,4X,12,13 Stainle SPANNER TOOL CONNECTEUR BNC REAR TWIST 75R STANDARD CONNECTEUR BNC REAR TWIST 75R STANDARD MANCHONS CONNECTEUR REAR TWIST MARRON MANCHONS CONNECTEUR REAR TWIST ORANGE PINCE A SERTIR SPACER INTERRUPTEUR A BASCULE SPST NOIR CAPACITOR ALUM ELEC 100UF,35V,20%,RADIAL CONDENSATEUR 15000UF CONDENSATEUR 150000UF CONDENSATEUR 1500UF CONDENSATEUR 4700UF CONDENSATEUR 6800UF CONDENSATEUR 10000UF CONDENSATEUR 1000UF LENTILLE DE REMPLACEMENT LAMPE FRONTALE - DUO 5 LED AMPOULE HALOGENE POUR DUO 5 LED CLIPS POUR LAMPE FRONTALE PLUG & SOCKET CONN,HEADER,8POS,6.35MM INVERSSEUR FILTRE 0.75KW INVERSSEUR FILTRE 1.5KW INVERSSEUR FILTRE 2.2KW INVERSSEUR NON-FILTRE 0.25KW PANNEAU CONTACT BOP SINAMICS G110 LAMPE ES50 50W 240V GU10 50 LAMPE 50 40W 240V E14 25 LAMPE 95 75W 240V E27 30 TUBE FLUO T5 FHE 35W BLANC CHAUD ALIMENTATION TRIPLE 35V/5A ALIMENTATION PROGRAMMABLE 30V/2A ALIMENTATION 35V 5A MIX MODE+PC GENERATEUR FONCTION 3MHZ+FREQUENCEMETRE GENERATEUR FONCTION 3MHZ+FREQUENC+AM CHARGE ELECTRONIQUE CC 80V,300W GENERATEUR RF 2GHZ BORNE DE PASSAGE 2.5MM INDICATEUR DIN 60A DC TRANSFORMER,AUTO,1500VA,240-120V INDICATEUR DIN 200A DC BIPOLAR TRANSISTOR,PNP,-40V INDICATEUR DIN 400A DC QUICK DISCONNECT CABLE,M12,4 PIN STRAIGHT PHOTOELECTRIC SENSOR,OTICAL TOUCH,NPN PHOTOELECTRIC SENSOR,OTICAL TOUCH,PNP SENSOR CABLE ASSEMBLY PHOTOELECTRIC SENSOR,0M to 5M,NPN/PNP INDICATEUR DIN 600A DC CAPACITOR CERAMIC 0.22UF,100V,X7R,10%,RAD CAPACITOR CERAMIC,10UF,10V,X5R,10%,1210 INDICATEUR DIN 400A DC MOUNTING WING,PP15,PP30 SERIES CONN DIAC,32V,DO-35 BIPOLAR TRANSISTOR,NPN,15V IC,N-CH HIGH SPEED SWITCH,200V,18A IC,N-CH HIGH SPEED SWITCH 6.2A,TO220-3 TRIAC,600V,8A,TO-220 CIRCUIT BREAKER,THERmAL,1P,240V,500mA TERMINAL,FERRULE,0.47IN.,YELLOW CAPACITOR CERAMIC,0.1UF,10V,X7R,10%,1206 PROXIMITY SENSOR INDICATEUR DIN 0-10 Voltage Meter ZENER DIODE,500mW,5.6V,DO-35 INDICATEUR DIN 0-10 Plastic Rack Mount Box N4,12 ECLIPSE JR ENCLOSURE W/PANEL,10X8X6,STEEL,GRAY DIN RAIL RELAY SOCKET CIRCULAR CONN,RCPT,SIZE 14S,4POS,BOX CIRCULAR CONNECTOR,PLUG,18-32S,CABLE CIRCULAR CONNECTOR RCPT,SIZE 10,6POS,CABLE RESISTOR,METAL FILM,1KOHM,600mW,1% CIRCUIT BREAKER,THERMAL MAG,1P,10A WIRE STRIPPERS TERMINAL,RING TONGUE,#6,CRIMP,BLUE RESISTOR,METAL FILM,30 KOHM,1 W,5% COMPTEUR 12VCC Timer Display Panel POTENTIOMETER ROTARY,5KOHM 15%,1W CAPTEUR DE PRESSION 0 - 25 BAR CAPTEUR DE PRESSION 0 - 25 BAR THERMOSTAT MONTAGE EN SAILLIE ATHS-2 TW THERMOSTAT MONTAGE EN SAILLIE ATHS-1A TR JUMO ITRON 08 (HORIZONTAL) ECOTRON M CABLE CONNECTION AVEC FICHE SONDE POUR TUYAUTERIE PAPIER ACCORDEON 5 PIECES TETE D´IMPRESSION 2 PIECES INDICATEUR NUMERIQUE DI32 INDICATEUR NUMERIQUE DI08 INDICATEUR DI ECO TERMINAL,FEMALE DISCONNECT,6.35MM BLUE CONTACT,SOCKET,18-16AWG,CRIMP CASE,TOOL KIT,TOURING COMBINATION SPANNER SET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET COMBINATION SPANNER,RATCHET SPANNER,ADJUSTABLE SPANNER,ADJUSTABLE SPANNER SET,OPEN SPANNER SET,OPEN NUT DRIVER,T HANDLE NUT DRIVER,T HANDLE NUT DRIVER,T HANDLE NUT DRIVER,T HANDLE NUT DRIVER,T HANDLE NUT DRIVER,T HANDLE NUT DRIVER,T HANDLE SOCKET SET,3/8´´ RATCHET,REVERSIBLE SOCKET SET,1/2´´ SOCKET DRIVER SET,1/2´´ SOCKET DRIVER SET,1/2´´ TORQUE WRENCH,2-25NM TORQUE WRENCH,5-50NM HAMMER,ASH HANDLE HAMMER,ASH HANDLE HAMMER,SURFACE PROTECTIVE HAMMER,SURFACE PROTECTIVE HAMMER,SURFACE PROTECTIVE TIP,FOR HAMMER,PROTECTIVE PULLER,2 LEG PULLER,2 LEG PULLER,3 ARM LAMPE TORCHE - T4 LAMPE TORCHE - T4 LAMPE TORCHE HAND LAMP,RECHARGEABLE CHARGER,C-251HV,UK,3 PIN LAMPE TORCHE - T6 CIRCULAR CONNECTOR,RCPT,SIZE 11,4POS,PANEL TERMINAL,SPADE/FORK,#6,CRIMP,RED HEAT SHRINK TUBING,2.36MM ID,PO,BLK,100FT COMPT. HORAIRE ELECTRO. 230VCA HR76.1 COMPT. HORAIRE ELECTRO. 10-80VCC HR76.1 COMPT. HORAIRE ELECTRO. 10-80VCC HR76.2 CODEUR INCREMENTAL 360PPR - 2400 COMPTEUR ELECTROMECA. 230VCA K07.20 COMPTEUR ELECTROMECA. 12VCC K07.90 COMPTEUR ELECTROMECA. 5VCC K07.92 COMPTEUR ELECTROMECA. 230VCA SK07.1 COMPTEUR ELECTROMECA. 24VCC W15.51 COMPTEUR ELECTROMECA. 230VCA W15.51 COMPTEUR ELECTROMECA. 24VCC AW15.01 COMPTEUR ELECTROMECA. 24VCC K67.20 COMPTEUR ELECTROMECA. 5VCC K47.20 COMPTEUR ELECTROMECA. 12VCC K47.20 COMPTEUR ELECTROMECA. 24VCC K47.20 COMPTEUR ELECTROMECA. 12VCC W17.50 COMPTEUR ELECTROMECA. 230VCA W17.50 COMPTEUR ELECTROMECA. 24VCC BVA15.21 COMPTEUR ELECTROMECA. 230VCA BVA15.21 COMPT. HOR. ELECTROMEC 187-264VCA SHK07. COMPT. HOR. ELECTRO. 187-264VCA HB26.21 COMPT. HOR. ELECTROMEC 10-30VCC HB26.21 COMPT. HORAIRE ELECTROMEC 187-264VCA H57 COMPT. HORAIRE ELECTROMEC 10-30VCC H57 COMPTEUR HORAIRE TOTAL. 187-264VCA HC77 COMPTEUR TOTALISATEUR 10-30VCC CODIX 521 COMPTEUR HORAIRE 10-30VCC CODIX 523 AFFICH. DE TEMP. 10-30VCC CODIX 531 TOTALISATEUR AVEC RAZ 10-30VCC CODIX 540 COMPTEUR D´IMPULS. 90-250VCA CODIX 541 COMPTEUR HORAIRE 90-250VCA CODIX 543 AFFICHEUR DE PROCESS 90-260VCA CODIX 550 CONTROLER DE PROCESS 10-30VCC CODIX553 CONTROLEUR DE TEMP. 90-260VCA CODIX554 COMPTEUR MULTIFONCTIONS 90-260VCA 716 ROUE DE MESURE HYTREL 0.2M ROUE DE MESURE VULCOLAN 0.5M CONNECTEUR 12 POINTS POUR 58-ENC. CABLE 3M - CONNECTEUR 12 POINTS CABLE 5M - CONNECTEUR 12 POINTS JEU DE MONTAGE POUR ENCODEUR HOLLOWSH MONTAGE DE CODEUR FLEXIBLE SOUFFLET D´ACCOUPLEMENT 6MM-4MM SOUFFLET D´ACCOUPLEMENT 6MM-6MM CODEUR INCREMENTAL 500PPR 5802 ENCODEUR INC. A GUIDE FIL 8-30VCC ENCODEUR A GUIDE FIL ANALOGIQUE 4-20MA POTENTIONETRE A GUIDE FIL CHASSIS DE MONTAGE 55MM H57/HC77 CHASSIS DE MONTAGE 72MM H57/HC77 CONTRE-PLAQUE POUR CHASSIS H57/HC77 MORS CONNECTEURS 4/4 MORS CONNECTEURS 6/6 MORS CONNECTEURS 8/8 PINCE A SERTIR ENCLOSURES,ACCESSORIES EMBASE IDC 60 VOIES CAPOT HD.40.STS.1.29.G SCHOOL BALANCE,EMB,5.2K5 CLIP-ON MARKER TOOL,WIC CONTROLE ENTREE NUMERIQUE S7-200 CABLE,MULTIMASTER S7-200,USB,BLACK CABLE,EXPANSION S7-200 LOGO! DM8 24R BALADEUSE 60W (UK) Metal Oxide Varistor (MOV) RESEAU DE SUPPRESSEUR MULTIGUARD IR EMITTER,875NM,4.69MM,TO-18-2,THD GAINE THERMO HIS-A 3/1-NOIR SUPPORT DE LAMPE G24 Q1 SUPPORT DE LAMPE G24 D2 DRIVER MICROPAS COMPACT MOTEUR PAS A PAS 0.9DEG. 2 PHASES MOTEUR PAS A PAS 0.9DEG. 2 PHASES MOTEUR PAS A PAS 1.8 DEG. 2 PHASES ACTIONNEUR LINEAIRE 0.00125MM/PAS MOTEUR PAS A PAS 0.9 DEGREE CONVERTISSEUR RS232/RS485 COFFRET ALU 140X140X90MM COFFRET ALU 160X560X90MM COFFRET ALU 180X180X100MM COFFRET ALU 180X280X100MM COFFRET ALU 100X230X110MM COFFRET ALU 230X400X110MM COFFRET ALU 310X600X110MM COFFRET POLY. 75X80X75MM COFFRET POLY. 75X160X75MM COFFRET POLY. 160X160X90MM COFFRET ELECTR. 105X185X87MM DEMO/KIT D´EVALUATION POUR ATMEGA169 CODEUR ABSOLU DIODE,STANDARD,15A,200V SPARE BLADE SET TRANSISTOR,BIPOLAR,PNP,300V,500mA,TO-202-3 FUSE CLIP,5MM,PCB MOUNT COMMUTATEUR MICRO FSM2J L=4.3MM PANNEAU PRE PERCE BNC FIL H05Z-K 0.5 NOIR 100M FIL H05Z-K 0.5 ROUGE 100M FIL H05Z-K 0.75 BLEU 100M FIL H05Z-K 1.0 NOIR 100M FIL H05Z-K 1.0 BLEU 100M FIL H05Z-K 1.0 ROUGE 100M CONDUIT,SPLIT,23 CONDUIT,LCC-2 /10,METAL CONDUIT,LCC-2 /16,METAL CONDUIT,LGF-2-M,20X1.5/1 CONDUIT,M20,BLACK FORET TUNGSTENE 1.3MM ARBRE 6.3MM TIGE RONDE ARBRE 9.5MM TIGE HEXA RF TRANSISTOR,PNP,-600mV,1.1GHZ TERMINAL,RING TONGUE,#6,CRIMP,RED Metal Connector Backshell CAPACITOR CERAMIC 0.1UF,100V,X7R,10%,1206 FUSIBLE THERMIQUE 72DEG ADAPTATEUR 18P DIP POUR MPLAB ICD2 CONVERTISSEUR DC/DC CMS FRONT RAISED BEZEL SWIFTY SET PLAYER,PERSONAL CD KIT FER A SOUDER A GAZ ´WP60K TERMINAL,PARALLEL SPLICE,CRIMP CIRCULAR STRAIN RELIEF,SIZE 15 BIPOLAR TRANSISTOR,NPN,40V PCB,Pad/Hole 2 sides (PTH) DIN RAIL ADAPTER RESISTOR,CURRENT SENSE,0.1 OHM,15W,1% SENSOR REFLECTOR SENSOR CABLE ASSEMBLY PHOTOELECTRIC SENSOR,0MM to 380MM,NPN / PNP PHOTOELECTRIC SENSOR N CH MOSFET,400V,14A,TO-204AA END BRACKET,TS 35 TERMINAL RAIL POWER RELAY,DPDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,12VDC,15A,PLUG IN CHIP INDUCTOR,22NH,450MA 10% 2GHZ LED,RED,T-1 3/4 (5MM),35CD,616NM FUSE,40A,600V,TIME DELAY Inductive Proximity Sensors INDUCTIVE PROXIMITY SENSORS ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,ALUMINIUM CABLE GLAND (CLAMP) Leaded Process Compatible:No D SUB CONTACT,SOCKET,26-22AWG,CRIMP Writing for Science and Engineering: Pap Ceramic Disc Capacitor MICRO SWITCH,HINGE LEVER,SPDT 11A 250V MICRO SWITCH,ROLLER LEVER SPDT 11A 250V Switch Logic IC Logic Type:FET Bus Switc PLUG & SOCKET CONNECTOR,PLUG,12POS,3MM COUVERCLE ETANCHE 48X96MM COUVERCLE ETANCHE 72X72MM COUVERCLE ETANCHE 96X96MM FUSE,20A,600V,TIME DELAY ROUND KNURLED KNOB W/ ARROW IND,6.35MM IC TEMPORISATEUR TEMPORISATEUR TERMINAL,RING TONGUE,#10,CRIMP,RED DARLINGTON TRANSISTOR,PNP,-80V,TO-3 ZENER DIODE,500mW,2.4V,AXIAL FUSE,THERMAL,117°C,15A,277V WIRE-BOARD CONN,RECEPTACLE,5POS,2MM Connector Number of Contacts:16 IC,SILICON UNILATERAL SW,175mA,TO98-3 FAST DIODE,80A,400V,POWERTAB WALL BRACKET FOR FIRST AID KT CAPACITOR TANT,100UF,10V,RADIAL 10% CAPACITOR TANT,2.2UF,25V,RADIAL 10% CAPACITOR TANT,68UF,25V,RADIAL 20% C60N Circuit Breaker,C Curve 1 Pole Box CIRCUIT BREAKER,THERMAL MAG,1P,1A CIRCUIT BREAKER,THERMAL MAG,1P,4A CIRCUIT BREAKER,THERMAL MAG,1P,6A CIRCUIT BREAKER,THERMAL MAG,1P,8A CIRCUIT BREAKER,THERMAL MAG,2P,10A CIRCUIT BREAKER,THERMAL MAG,2P,20A CIRCUIT BREAKER,THERMAL MAG,2P,30A BATTERY STRAP,9V,WIRE LEAD Metal Film Resistor IC,LINEAR VOLT REG,9V,3-TO-220 IC,P-CH HIGH SPEED SWITCH,19A,TO220-3 TVS DIODE,1.5KW,15.3V SCHOTTKY RECTIFIER,10A,45V TO-220 SCHOTTKY RECTIFIER,30A,45V TO-220 STANDARD DIODE,30A,45V,TO-218 SILICON BILATERAL SWITCH (SBS) CAPTIVE PANEL SCREW BANANA JACK,SOLDER,RED SWITCH,PUSHBUTTON,DPDT-DB,10A,115V LAMP,FLUORESCENT,G5,4W Standard D-Subminiature Connector TERMINAL,MALE DISCONNECT,0.25IN,THD PLATEAU STOCKAGE 500X94X80 PQ10 ZENER DIODE,2.3W,75V,DO-219AB PLATEAU D´ETAGERE 188X115 PQ20 TVS Diode TVS Diode TVS DIODE,200W,15V,DO219AB TVS DIODE,200W,48V,DO219AB Circular Connector MIL SPEC:MIL-C-5015 CIRCULAR CONNECTOR BODY MATERIAL:ALUMINU CIRCULAR CONNECTOR BODY MATERIAL:ALUMINU CIRCULAR CONNECTOR BODY MATERIAL:ALUMINU CIRCUIT BREAKER,THERMAL,1P,240V,5A CIRCUIT BREAKER,THERMAL,1P,240V,3A CIRCUIT BREAKER,THERMAL,1P,240V,4A Plug-In Relay Plug-In Relay Plug-In Relay Plug In Relay Switch Function:3PDT CIRCULAR CONNECTOR BODY MATERIAL:ALUMINU CIRCULAR CONNECTOR BODY MATERIAL:ALUMINU Circular Connector MIL SPEC:MIL-C-5015 A DIODE,PHOTO,900NM,65° FILTRE PRINCIPAL LED,ORANGE,T-1 (3MM),4MCD,611NM ZENER DIODE,500mW,6.2V,SOD-80 ZENER DIODE,500mW,6.8V,SOD-80 ZENER DIODE,1.3W,47V,DO-41 ZENER DIODE,500mW,75V,DO-35 OPTICAL ENCODER Ceramic Multilayer Capacitor Ceramic Multilayer Capacitor CAPACITOR CERAMIC 0.47UF,100V,X7R,10%,RAD RELAY SOCKET TERMINAL,FERRULE,0.03IN CIRCULAR CONNECTOR,PLUG,3POS,CABLE 110 PUNCHDOWN STRIPPER Micropower ultra low dropout fixed volta CAPACITOR CERAMIC,0.1UF,25V,Z5U,+80,-20%,0805 CAPACITOR CERAMIC 0.01UF,16V,X7R,10%,1206 Resettable Fuse TERMINAL,BUTT SPLICE SMALL OuTLINE OPTOISOLATOR,TRANSISTOR O 16 bit bidirectional registered transcei LED,2.4MM,RED / GREEN,PLCC-2 COMMUTATEUR A BASCULE DPST I/O COMMUTATEUR INDUCTOR,SHIELDED,330UH,380MA,SMD INDUCTOR,SHIELDED,100UH,900MA,SMD INDUCTOR,SHIELDED,1MH,320MA,SMD SuRFACEMOuNT LED,660 NM wAvELENGTH,51 LED CABLE ASSEMBLY IC,INSTRUMENT AMP,550KHZ,90DB,SOIC-8 IC,INSTRUMENT AMP,200KHZ,90DB,DIP-16 Switch Actuator BIPOLAR TRANSISTOR,PNP,-100V,TO-220 PIN HEADER,EUROSTYLE,4POS,5MM CAPACITOR ALUM ELEC 2200UF 250V 20%,SNAP-IN CAPACITOR ALUM ELEC 2700UF 200V 20%,SNAP-IN TERMINAL,FEMALE DISCONNECT,6.35MM,RED IC,ADC,12BIT,200KSPS,QSOP-16 IC,ADC,16BIT,100KHZ,MSOP-8 IC,DAC,12BIT,95KSPS,SOT-23-8 IC,DAC,12BIT,89KSPS,SOIC-16 OPTOCOUPLER,PHOTOTRIAC,3750VRMS OPTOCOUPLER,PHOTOTRIAC,3750VRMS IC,SM OP-AMP DUAL DIFET PRECISION IC,OP-AMP,430KHZ,0.16V/µs,SOIC-8 OPERATIONAL AMPLIFIER (OP-AMP) IC Flip Flop Logic IC Logic Type:Latch Transceiver Logic IC Logic Type:Bus Tran Flip Flop Logic IC Package/Case:14-TSSOP IC,RS-485 BUS TRANSCEIVER,5.25V,SOIC8 COMMUTATEUR DPST OPTOCOUPLER,PHOTOTRANSISTOR,5000VRMS OPTOCOuPLER OPTOCOuPLER OuTPuT TyPE:TRAN COMMUTATEUR DPST OPTOCOUPLER,PHOTOTRANSISTOR,3750VRMS IC,OP-AMP,1.7MHZ,3.6V/ us,DIP-8 IC,OP-AMP,1.7MHZ,3.6V/ us,SOIC-8 IC,MICROPOWER COMP,DUAL,1.1 uS,SOIC-8 IC,SINGLE UART,FIFO,1MBPS 3.6V LQFP48 RF/COAXIAL ULTRAMINIATURE R/A 50OHM SLDR SMT COUPLER 3DB 100W FREQ. 800-1200 CONN SMT COUPLER 3DB 100W FREQ. 1500-2200 CON SMT COUPLER 6DB 60W FREQ. 1500-2200 CONN SMT COUPLER 10DB 60W FREQ. 1500-2200 SMT COUPLER 3DB 100W FREQ. 1500-1900 CON SMT COUPLER 3DB 40W FREQ. 1800-2700 CONN SMT COUPLER 6DB 60W FREQ. 1800-2700 CONN SMT COUPLER 10DB 60W FREQ. 1800-2700 INSPECTION WINDOW,5.1X3IN POLYCARBONATE INSPECTION WINDOW,13INX10.9IN,PC INSPECTION WINDOW,14.8INX13IN,PC EK SERIES ENCLOSURE EK SERIES ENCLOSURE RF/COAXIAL MCX PLUG R/A 75 OHM CRIMP/SLDR RF/COAXIAL MCX PLUG STR 75 OHM CRIMP/SLDR Connectors,RF,Plug,MCX,Straight Body RESISTOR SMT,5.23MOHM,.1W,0805,CASE RESISTOR SMT,35.7OHM,100PPM RESISTORS,THICK FILM SERIES:CRCW RESISTOR SMT,7.68KOHM,.125W,1206,CAS FERRITE EFD 10 3F3 CHIP INDUCTOR 4.7UH 750MA 10% 40MHZ CHIP INDUCTOR,10NH,1.6A,5%,5GHZ CHIP INDUCTOR 100NH 160MA 5% 1.8GHZ CAPACITOR TRIMMER 0.3PF-1.2PF,500V,SMD CAPACITOR TRIMMER 0.6PF-4.5PF,500V,SMD RESISTOR,METAL FILM,3.83KOHM,125mW,1% RESISTOR,METAL FILM,54.9KOHM,125mW,1% Metal Film Resistor PLUG & SOCKET HOUSING,RECEPTACLE,9POS,3.96MM PLUG & SOCKET CONNECTOR,RCPT 6POS 4.2MM CAPACITOR CERAMIC 0.22UF 100V,X7R,10%,1210 PROCESS METER D SUB SCREW LOCK,#4-40,7.93MM CIRCULAR CONNECTOR PLUG,SIZE 14S,6POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 10,6POS,CABLE CONTACT,PIN,18-14AWG,CRIMP BNC ADAPTER,1 X PLUG-2 X JACK CAPACITOR CERAMIC 0.47UF,50V,X7R,10%,RAD POWER RELAY,DPDT,125VDC,10A,PLUG IN POWER RELAY,4PDT,125VDC,10A,PLUG IN RESISTOR,METAL FILM,100KOHM,600mW,1% WIRE-BOARD CONN,FEMALE,12POS,2.54MM N4,12 ECLIPSE JR ENCLOSURE W/PANEL,12X12X6,STEEL,GRAY N4,12 ECLIPSE JR ENCLOSURE W/PANEL,14X12X6,STEEL,GRAY CIRCULAR CONN,RCPT,SIZE 20,14POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14S,5POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 14,19POS,CABLE CAPACITOR CERAMIC 0.1UF,50V,X7R,10%,RAD RESISTOR,METAL FILM,1 MOHM,1 W,5%,AXIAL LEADED SWITCH,REED,SPST-NO,500mA,200VDC COMPUTER CABLE,IEEE 1284,6FT,PUTTY CONTACT,PIN,18-16AWG,CRIMP CLOSED END STRAIN RELIEF COVER,NYLON SWITCH,TOGGLE,4PDT,15A,277V RF Coaxial Cable Assembly,BNC Male to B ENCLOSURE,WALL MOUNT,ALUMINIUM RESISTOR,METAL FILM,10 KOHM,1 W,5% D SUB CONTACT,SOCKET,28-24AWG,CRIMP RELAY SOCKET RESISTOR,METAL FILM,4.99KOHM,400mW,1% SWITCH ACCESSORIES,ASSEMBLY HARDWARE RF/COAXIAL,BNC PLUG,STR,75 OHM,CRIMP RESISTOR,METAL FILM,1 KOHM,1 W,5% RESISTOR,METAL FILM,150 OHM,1 W,5% RESISTOR,METAL FILM,3.3 OHM,1 W,5% RESISTOR,METAL FILM,10 OHM,2 W,5% RESISTOR,METAL FILM,51 OHM,2 W,5% RESISTOR,METAL FILM,200KOHM,400mW,1% RESISTOR,METAL FILM,5.1KOHM,400mW,1% CAPACITOR CERAMIC 0.01UF 50V,X7R,10%,AXIAL TAPE,INSULATION,PVC,GREEN 0.75INX66FT TAPE,FOIL SHIELD,ALUM,SILVER 1INX60YD TERMINAL,PARALLEL SPLICE #10 CRIMP BLUE TERMINAL,RING TONGUE,#6,CRIMP,RED RESISTOR,THICK FILM,10MOHM,250mW,1% ENCLOSURE,WALL MOUNT,ALUMINIUM,GRAY RF/COAXIAL ADAPTER,TNC JACK-SMA JACK SONDE AVEC BOUTON DE TEST CABLE 5M Single Side Shelf,Solid fits 19 rack St Ladder Rack,Butt Splice Kit Steel/Zinc TILT SWITCH TILT SWITCH TILT SWITCH TILT SWITCH TILT SWITCH TESTER,ISOLAT,TELARIS,0701/0702 ANALYSER,PHASE-FIELD,UNITEST DR100 CARRY CASE,1175 TESTEUR DE TENSION CA760 TESTEUR DE TENSION CA704 EMBASE MALE CHASSIS 6 VOIES EMBASE MALE CHASSIS 8 VOIES EMBASE MALE CHASSIS 10 VOIES EMBASE MALE CHASSIS 12 VOIES EMBASE MALE CHASSIS 19 VOIES EMBASE MALE CHASSIS 26 VOIES EMBASE MALE CHASSIS 32 VOIES EMBASE FEMELLE CHASSIS 8 VOIES EMBASE FEMELLE CHASSIS 10 VOIES EMBASE FEMELLE CHASSIS 12 VOIES EMBASE FEMELLE CHASSIS 19 VOIES EMBASE FEMELLE CHASSIS 32 VOIES FICHE MALE CABLE 7 VOIES FICHE MALE CABLE 8 VOIES FICHE MALE CABLE 10 VOIES FICHE MALE CABLE 32 VOIES FICHE FEMELLE CABLE 7 VOIES FICHE FEMELLE CABLE 8 VOIES FICHE FEMELLE CABLE 10 VOIES FICHE FEMELLE CABLE 12 VOIES FICHE FEMELLE CABLE 26 VOIES FICHE FEMELLE CABLE 32 VOIES ADAPTATEUR SECTEUR FICHE MALE CABLE 2 VOIES FICHE MALE CABLE 6 VOIES FICHE MALE CABLE 19 VOIES FICHE MALE CABLE 4 VOIES FICHE FEMELLE CABLE 3 VOIES FORET PILOTE EN ACIER HSS COURT FICHE FEMELLE CABLE 19 VOIES EMBASE MALE CHASSIS 3 VOIES EMBASE MALE CHASSIS 7 VOIES EMBASE MALE CHASSIS 19 VOIES EMBASE FEMELLE CHASSIS 3 VOIES EMBASE FEMELLE CHASSIS 6 VOIES EMBASE FEMELLE CHASSIS 19 VOIES EMBASE FEMELLE CHASSIS 6 VOIES NICKEL CLE MIXTE METRINCH 14MM CLE MIXTE METRINCH 16MM FICHE MALE CABLE 6 VOIES NICKEL CLE MIXTE METRINCH 17MM EBARBEUR DE TROUS 5 A 10MM MINIRUPTEUR INVERSEUR UNIPOLAIRE EBARBEUR DE TROUS 10 A 15MM MINIRUPTEUR INVERSEUR UNIPOLAIRE INTERRUPTEUR A MANETTE BASCULANTE LUBRIFIANT 50ML AEROSOL FRAISE A TROUS 10.5MM FRAISE A TROUS 16.4MM FUSE,25A,600V,TIME DELAY FUSE,15A,600V,TIME DELAY FUSE,10A,600V,TIME DELAY BALANCE DE POCHE BALANCE DE POCHE PINCE OBLIQUE SEMI AFFLEURANTE PINCE OBLIQUE MICRO AFFLEURANTE PINCES OBLIQUES LABEL,IDENTIFICATION,12.7X7MM,500PCS PINCE MIN. A COUPE OBLIQUE RASE POWER RELAY,3PDT,24VDC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN LOT DE 4 PINCES ERGO SHEAR,GUILLOTINE,PCB Electron Tube CONNECTOR,IEC POWER ENTRY,PLUG,20A FASTENERS,SELF LOCKING NUTS,NYLON,12.7MM CAPACITOR ALUM ELEC 189-227UF 330V,20%,QC VERTICAL CLAMP,1-3/8 TO 1-7/16´´DIA CAPACITOR POLY FILM 0.33UF,250V,5%,AXIAL CONTACT,SOCKET,18AWG,CRIMP Magnetic Hydraulic Circuit Breaker RECTANGULAR HAN-KIT,4WAY,SCREW RECTANGULAR HAN-KIT,16WAY,SCREW RECTANGULAR HAN-KIT,6WAY,SCREW RECTANGULAR HAN-KIT,10WAY,SCREW RECTANGULAR HAN-KIT,16WAY,SCREW RECTANGULAR HAN-KIT,24WAY,SCREW RECTANGULAR CONNECTOR KIT,HAN,3WAY,SCREW RECTANGULAR HAN-KIT,4WAY,SCREW Female #16 Stamped and formed crimp contact 18C2408 Male #16 Stamped and formed crimp contact 18C2420 Connectors,Circular,In-Line Receptacle CIRCULAR CONNECTOR BODY MATERIAL:THERMOP CIRCULAR CONNECTOR BODY MATERIAL:THERMOP CIRCULAR CONNECTOR BODY MATERIAL:THERMOP CIRCULAR CONNECTOR BODY MATERIAL:THERMOP CIRCULAR CONNECTOR BODY MATERIAL:THERMOP CIRCULAR CONNECTOR BODY MATERIAL:THERMOP Connectors,Circular,Receptacle,Clippe Connectors,Circular,Receptacle with o PLASTIC CONNECTOR BACKSHELL BODY MATERIA BACKNUT FOR FEMALE CONTACT SERIES:CLIPPE Connectors,Circular,Backnut for Female POWER RELAY,4PDT,24VDC,6A,PLUG IN POWER RELAY,4PDT,24VAC,6A,PLUG IN POWER RELAY,4PDT,110VAC,6A,PLUG IN BOARD-BOARD CONNECTOR HEADER,4WAY,1ROW BOARD-BOARD CONNECTOR HEADER,8WAY,1ROW BOARD-BOARD CONN,HEADER,20WAY,1ROW BOARD-BOARD CONN,HEADER,28POS,2ROW BOARD-BOARD CONN,HEADER,36POS,2ROW BOARD-BOARD CONN,HEADER,32WAY,2ROW BOARD-BOARD CONN,HEADER,40WAY,2ROW Connectors POWER RELAY,3PDT,24VAC,10A,PLUG IN CAT5E MODULAR JACK,8POS,1 PORT CIRCUIT BREAKER,HYD-MAG,2P,250V,10A TERMINAL BLOCK EUROSTYLE,2POS,24-12AWG TERMINAL BLOCK EUROSTYLE,8POS,24-12AWG TERMINAL BLOCK EUROSTYLE,2POS,24-12AWG TERMINAL BLOCK EUROSTYLE,6POS,24-12AWG TERMINAL BLOCK,DIN RAIL,1POS,18-10AWG POWER RELAY,DPDT,48VDC,10A,PLUG IN Plug-In Relay POWER RELAY,3PDT,110VDC,10A,PLUG IN SSR,DIN/PANEL MOUNT,660VAC,32VDC,90A WIRE-BOARD CONN,HEADER,50POS,2.54MM POWER RELAY,DPDT,110VAC,10A,PLUG IN POWER RELAY,DPDT,24VAC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN Push Pull Connector Connectors,Circular,Receptacle,Push/P Connectors,Circular,Receptacle,Push/P JBX STRAIGHT PLUG SZ0 2 POSITION MALE SOLDER 31C8537 JBX STRAIGHT PLUG SZ0 4 POSITION MALE SOLDER 31C8541 JBX STRAIGHT PLUG SZ0 5 POSITION MALE SOLDER 31C8543 Connectors,Circular,Plug,Push/Pull Se Connectors,Circular,Plug,Push/Pull Se ENCAPSULATED/PC BOARD TRANSFORMER POWER RELAY,SPDT,24VDC,10A,PC BOARD POWER RELAY,DPDT,120VAC,15A,PLUG IN POWER RELAY,DPDT,240VAC,15A,PLUG IN POWER RELAY,DPST-NO,12VDC,25A,PANEL THERMAL SWITCH THERMAL SWITCH THERMAL SWITCH THERMAL SWITCH THERMAL SWITCH THERMAL SWITCH THERMAL SWITCH THERMAL SWITCH CIRCUIT BREAKERS,THERMAL MAGNETIC CIRCUIT BREAKER,HYD-MAG,1P,125V,15A CIRCUIT BREAKER,HYD-MAG,1P,250V,2A CIRCUIT BREAKER,HYD-MAG,1P,250V,5A CONNECTOR,AC POWER,PLUG,20A,125V CONNECTOR,POWER ENTRY,PLUG,20A POWER ENTRY CONN,PLUG,2P3W,20A 125V,5-20P CONNECTOR,POWER ENTRY,PLUG,20A CONNECTOR,POWER ENTRY,PLUG,15A CONN,HOSPITAL GRADE PWR ENTRY,PLUG 15A CONNECTOR,POWER ENTRY,PLUG,20A CIRCUIT PROTECTOR,HYD-MAG,2P,240V 25A SENSORS,HUMIDITY POWER SUPPLY SAFETY COVER POWER SUPPLY SAFETY COVER UNSHLD MULTIPR CABLE 1PR 1000FT CONDENSATEUR 63V 10UF SIDE ENTRY HOOD,SIZE 16B,METAL CONNECTOR,POWER ENTRY,20A TIMER-COUNTER DISPLAY PANEL VERTICAL CLAMP,3´´ TO 3-1/8´´ DIA AUTO TRANSFORMER CONNECTOR,POWER ENTRY,PLUG,15A TERMINAL,FEMALE DISCONNECT,0.25IN,RED THERMAL SWITCH HAN MODULE,RECEPTACLE,24WAY,CRIMP PCB MOUNT,RADIAL CAPACITOR CIRCUIT BREAKER,HYD-MAG,1P,65V,5A Variable Transformer VARIABLE TRANSFORMER VARIABLE TRANSFORMER VARIABLE TRANSFORMER VARIABLE TRANSFORMER VARIABLE TRANSFORMER CAPACITOR ALUM ELEC 1000UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 47UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 10UF,100V,20%,RADIAL CAPACITOR ALUM ELEC 47UF,50V,20%,RADIAL CAPACITOR ALUM ELEC 1000UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 10UF,50V,20%,RADIAL Variable Transformer VARIABLE TRANSFORMER VARIABLE TRANSFORMER Shrouded Header SWITCH LENS CAPACITOR ALUM ELEC 47UF,50V,20%,RADIAL POWER RELAY,SPDT,120VAC,25A,PANEL RECTANGULAR HAN INSERT,PLUG 42WAY CRIMP PERM-O-PADS TO-5 & IC Mount,Molded Nylo FINGER GUARD PLUG & SOCKET HOUSING,PLUG,NYLON CONTACT,RECEPTACLE,24-20AWG,CRIMP VERTICAL CLAMP,2-1/2 TO 2-9/16´´DIA BULKHEAD HOUSING,SIZE 3A,METAL POWER RELAY,SPDT,48VDC,10A,PC BOARD Strain Relief CONNECTOR,POWER ENTRY,PLUG,15A CONNECTOR,POWER ENTRY,PLUG,20A GFCI PLUG,MANUAL RESET,120V,15A POWER RELAY,SPST-NO,5VDC,10A PC BOARD POWER RELAY,DPDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,12VDC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN POWER RELAY,DPDT,24VAC,10A,PLUG IN POWER RELAY,DPDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,12VDC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN POWER RELAY,3PDT,12VDC,10A,PLUG IN POWER RELAY,3PDT,24VDC,10A,PLUG IN POWER RELAY,3PDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,12VDC,10A,PLUG IN POWER RELAY,3PDT,120VAC,10A,PLUG IN POWER RELAY,3PDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN SWITCH,EMERGENCY STOP,1NO/1NC,600VAC Mounting Adapter RELAY SOCKET HOLD-DOWN CLIP CAPACITOR ALUM ELEC 470UF,16V,20%,RADIAL CAPACITOR ALUM ELEC 22UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 47UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 100UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 470UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 22UF,35V,20%,RADIAL CAPACITOR ALUM ELEC 47UF,35V,± 20%,RADIAL CAPACITOR ALUM ELEC 2.2UF,50V,20%,RADIAL CAPACITOR ALUM ELEC 470UF,50V,20%,RADIAL CAPACITOR ALUM ELEC 47UF,63V,20%,RADIAL CAPACITOR ALUM ELEC 100UF,16V,20%,RADIAL CAPACITOR ALUM ELEC 220UF,16V,20%,RADIAL CAPACITOR ALUM ELEC 220UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 470UF,25V,20%,RADIAL CAPACITOR ALUM ELEC 220UF,35V,20%,RADIAL CAPACITOR ALUM ELEC 1000UF,35V,20%,RADIAL CAPACITOR ALUM ELEC 220UF,50V,20%,RADIAL CAPACITOR ALUM ELEC 470UF,50V,20%,RADIAL CAPACITOR ALUM ELEC 100UF,100V,20%,RADIAL RESISTOR KIT,MOTOR START THERMOSTAT CIRCUIT PROTECTOR,HYD-MAG,1P,250V 50A CIRCUIT PROTECTOR,HYD-MAG,1P,277V 25A FINGER GUARD HARDWARE POWER RELAY,DPDT,24VAC,5A,PLUG IN CONNECTOR,POWER ENTRY,PLUG,20A LIQUID LEVEL SENSOR REED RELAY,SPST-NO,5VDC,0.5A,THD CONNECTOR,POWER ENTRY,PLUG,20A REED RELAY,SPST-NO,5VDC,0.5A,THD ADAPTER EMI/RFI Fan Filter EMI/RFI Fan Filter EMI/RFI Fan Filter TERMINAL BLOCK JUMPER,2WAY,14.26MM CONNECTOR,POWER ENTRY,PLUG,15A LED,GREEN,T-1 3/4 (5MM),5CD,530NM CAPACITOR ALUM ELEC 33UF,50V,20%,RADIAL Pilot Light Square,24V LED Lamp,Mounti RESISTOR,HV THICK FILM,1MOHM,2W,1% RESISTOR,HV THICK FILM,0.1GOHM,2W,1% RESISTOR,HV THICK FILM,5MOHM,2W,1% RESISTOR,HV THICK FILM,1MOHM,3W,1% RESISTOR,HV THICK FILM,1MOHM,5W,1% RESISTOR,HV THICK FILM,0.5GOHM,5W,1% RESISTORS,FUSIBLE METAL FILM RESISTANCE RESISTOR,CURRENT SENSE,0.025 OHM,5W,1% RESISTOR,METAL GLAZE,250OHM,500mW,1% SPH Series Failsafe Molded Wirewound Res LED,GREEN,T-1 (3MM),250MCD,566NM CAPACITOR KIT,ALUM ELECTROLYTIC CAPACITOR ALUM ELEC 100UF,10V,20%,RADIAL CAPACITOR ALUM ELEC 100UF,63V,20%,RADIAL CAPACITOR ALUM ELEC 500UF,150V,+50%,-10%,AXIAL CAPACITOR CERAMIC,0.1UF,50V,X7R,5%,1206 CONTACT,SOCKET,20AWG,CRIMP LAMP,INCANDESCENT,CAND,12V,6W CONNECTOR,POWER ENTRY,PLUG,30A CIRCUIT BREAKER,HYD-MAG,2P,125V,20A WALL PLATE,STAINLESS STEEL,2 MODULE CONNECTOR,POWER ENTRY,PLUG,30A CONNECTOR,POWER ENTRY,PLUG,20A BOOK ELECTRONIC THREADED INSERT,FOR HORIZONTAL RAIL,M2.5 BOARD-BOARD CONNECTOR HEADER,4WAY,2ROW CONNECTOR,POWER ENTRY,RCPT,20A,125VAC,IVORY JOINT SUB-D 37 VOIES TRIAC,400V,15A,TO-48 CIRCUIT BREAKER,THERMAL MAG,1P,3A KIT DE CORDONS DE TEST SUREGRIP CONTACTOR TERMINAL,RING TONGUE,#6,CRIMP,YELLOW EMBASE FEMELLE 6 VOIES TAILLE 1 FICHE ETANCHE FEMELLE 3 VOIES TAILLE 1 FICHE ETANCHE MALE 6 VOIES TAILLE 1 EMBASE MINIATURE MALE 4 VOIES TAILLE 00 EMBASE MINIATURE FEMELLE 7V TAILLE 0 FICHE MINIATURE MALE 4 VOIES TAILLE 00 FICHE FEMELLE 4 VOIES TAILLE 1 FICHE MALE 12 VOIES TAILLE 2 FICHE ETANCHE FEMELLE 12 VOIES TAILLE 2 FICHE ETANCHE MALE 12 VOIES TAILLE 2 PROLONGATEUR STANDARD MALE 6V TAILLE 1 PROLONGATEUR STANDARD MALE 12V TAILLE 2 EMBASE STANDARD MALE 4 VOIES TAILLE 2 EMBASE STANDARD MALE 8 VOIES TAILLE 2 FICHE STANDARD MALE 4 VOIES TAILLE 2 EMBASE FEMELLE INDUSTRIELLE 3V TAILLE 1 FICHE ETANCHE FEMELLE 4 VOIES TAILLE 2 FICHE ETANCHE MALE 4 VOIES TAILLE 2 EMBASE MINIATURE HAUTE DENSITE MALE 7V EMBASE MINIATURE HAUTE DENSITE FEM 19V CORDON M8 FEMELLE DROIT 3 VOIES PVC 3M CORDON M12 MALE DROIT 4 VOIES PUR 2M CORDON M12 FEMELLE DROIT 5 VOIES PUR 5M CORDON FMD M12 3 VOIES BLINDE 2M REPARTITEUR 4 VOIES M12 SORTIE CABLE 10M GUARD CAPTEUR MAGNETIQUE CI INVERSEUR CAPTEUR ELECTRO. M12 PNP CABLE 2M CAPTEUR DE NIVEAU HORIZON. NYLON CAPTEUR MAGNETIQUE 1NO M8 2M COFFRET 16 TERMINAUX COFFRET 64 TERMINAUX FICHE MALE 11-9 CONTACTS MALES DUPLEX 26-22 ADHESIF ETANCHEITE 50ML ADHESIF ETANCHEITE 50ML POINTEAU AUTOMATIQUE GAINE JEU 5 TOURNEVIS ELECTRONIQUE PINCE MULTIPRISE 165MM CIRCULAR CONN,PLUG,SIZE 8,2POS,CABLE LED INFRAROUGE 5MM 850NM PHOTOTRANSISTOR BOITIER PILL OPTOCOMMUTATEUR A ENCOCHE TOOLS,TWEEZERS POWER OUTLET STRIP CD LIGHT,SWIVEL LIVRE-GUIDE TO MICROCHIP PIC SOFTWARE,EASY-PC,WINDOWS,FULL SOFTWARE,EASY-PC,WIN,2000 PIN SOFTWARE,EASY-PC,WIN,1000 PIN SOFTWARE,GERBER IMPORT,ADD-ON LENTILLE LAMBERT MOYEN AVEC SUPPORT 3-ACHS-ROBOTER IC,1BIT BUS TRANSCEIVER,SOIC-8 CORDON HDMI 3M REED RELAY SPST 5VDC,0.5A,THROUGH HOLE GENERATEUR DDS 12MHZ RS232,LABVIEW,USB CONNECTOR ((NW)) DIODE 150A 800V DIODE SCHOTTKY 1A 60V ALIMENTATION MODULAIRE 12V 5A ALIMENTATION MODULAIRE 24V 5A LABEL,IDENTIFICATION,12.7MMX15.24M 1PC TRANSISTOR,BIPOLAR,PNP,80V,4A,TO-126-3 OPTOCOUPLER,TRANSISTOR,3000VRMS SENSOR CABLE ASSEMBLY SENSOR MOUNTING BRACKET CONTACT,SOCKET,18AWG,CRIMP STANDARD DIODE,40A,300V,DO-203AB CONNECTOR RIGHT END CAP LEFT END CAP CAPACITOR ALUM ELEC 1000UF,25V,20%,AXIAL TERMINAL,BUTT SPLICE CRIMPALL 8000 CRIMPER WITH DIE OPTOCOUPLER,TRANSISTOR,5000VRMS ENCLOSURE,BOX,ALUMINIUM,GRAY DARLINGTON TRANSISTOR ARRAY,NPN,7,100V SOIC FUSE,THERMAL,77°C,15A,277V FUSE,THERMAL,87°C,15A,277V High quality ferrule end sleeve,single N CHANNEL MOSFET,30V,30A,TO-252 CAPACITOR ALUM ELEC 18000UF,50V,+75,-10%,SCREW CIRCULAR CONNECTOR PLUG,SIZE 10,6POS,CABLE VENTLATOR CAPACITOR CERAMIC 0.47UF,25V,X7R,10%,1206 CAPACITOR CERAMIC 0.33UF 100V,X7R,10%,1210 LABEL,IDENTIFICATION,25.4X12.7MM 500PC LABEL,SELF ADHESIVE,12.7X25.4MM,250PC LABEL,SELF ADHESIVE,12.7X19.05MM 250PC LABEL,SELF ADHESIVE,25.4X25.4MM,250PC LABEL,SELF ADHESIVE,25.4X19.05MM 250PC LABEL,SELF ADHESIVE,12.7X31.75MM 250PC LABELS LABEL,SELF LAMINATING 38.1X63.5MM 100PC Labels LABEL SELF LAMINATING 38.1X101.6MM 100PC Cable ID Markers CABLE ID MARKERS PORTA-PACK PRE-PRINTED WIRE MARKER BOOK,0-9 CABLE ID MARKERS CABLE ID MARKERS LABELS,CABLE MARKERS,CABLE MARKERS,LA BATTERY CHARGER FOR TLS 2200 THERMAL LABEL PRINTER,120V LABEL,IDENTIFICATION,25.4X6.98MM 750PC LABEL,IDENTIFICATION,38.1X6.35MM 750PC PERMASLEEVE Wire & Cable Marking Labels WIRE MARKING SLEEVES,HEAT SHRINK,25.8MM W,PO,WHT,PK100 PERMASLEEVE Wire & Cable Marking Labels PERMASLEEVE Wire & Cable Marking Labels CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS CABLE/WIRE ID LABELS,SELF LAM,25.4MM W,VINYL,WHT,RL100 CABLE/WIRE MARKING LABELS PRINTER RIBBON STATIC PROTECTION,MATS,48IN TERMINAL,RING TONGUE,#8,CRIMP,RED CIRCULAR CONNECTOR PLUG SIZE 14S,5POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 14S,5POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 18,10POS,CABLE CIRCULAR CONN,RCPT,SIZE 8,4POS,BOX TERMINAL,FEMALE DISCONNECT,0.25IN,RED TERMINAL,RING TONGUE,3/8IN,CRIMP CAPACITOR CERAMIC 0.01UF,100V,X7R,10%,RAD TERMINAL,RING TONGUE,#4,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP TERMINAL,SPADE/FORK,#6,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP TERMINAL,RING TONGUE,#10,CRIMP TERMINAL,RING TONGUE,#6,CRIMP,RED POWER RELAY,DPDT,12VDC,10A,PLUG IN RESISTOR,METAL FILM,100 OHM,600mW,1% CAPACITOR CERAMIC 100PF 50V,C0G,5%,RAD D-SUB GENDER CHANGER,DB15 FEMALE-FEMALE RESISTOR,METAL FILM,2KOHM,400mW,1% CIRCULAR CONNECTOR RCPT,SIZE 10SL,2POS,BOX CIRCULAR CONN,PLUG,SIZE 8,3POS,CABLE CIRCULAR CONN,PLUG,SIZE 8,3POS,BOX RESISTOR,METAL FILM,10KOHM,400mW,1% MICRO SWITCH,BUTTON,SPDT,100mA,250V POTENTIOMETER ROTARY,1KOHM 15%,1W TERMINAL,RING TONGUE,1/4IN,CRIMP WIRE STRIPPERS RESISTOR,METAL FILM,1 OHM,2 W,5% CLOSED END STRAIN RELIEF COVER,NYLON 7000 Series Printer Ribbon CRIMP DIE CATEGORY 5E CABLE ASSEMBLY PCB,Pad/Hole RF/COAXIAL ADAPTER,N PLUG-BNC JACK CAPACITOR CERAMIC 0.01UF,50V,X7R,10%,RAD LABELS,SELF-LAM,LASER PRINT,25.4MM W,WHT,POLY,PK1000 R6210 Series Printer Ribbon PERMASLEEVE Wire & Cable Marking Labels WIRE MARKING SLEEVES,HEAT SHRINK,25.78MM W,WHT,SP100 CABLE ID MARKER,SELF LAM,POLY,25.4WX33.78MM H,WHT,PK1000 RESISTOR,METAL FILM,200 OHM,600mW,1% RESISTOR,METAL FILM,499 OHM,600mW,1% RESISTOR,METAL FILM,1.2 KOHM,1 W,5% RESISTOR,METAL FILM,1 OHM,1 W,5% RESISTOR,METAL FILM,10 OHM,1 W,5% RESISTOR,METAL FILM,2.7 KOHM,1 W,5% RESISTOR,METAL FILM,22 KOHM,1W,5% RESISTOR,METAL FILM,3.6 KOHM,1 W,5% RESISTOR,METAL FILM,5.1 OHM,1 W,5% RESISTOR,METAL FILM,51 OHM,1 W,5% RESISTOR,METAL FILM,680 OHM,1 W,5% RESISTOR,METAL FILM,75 OHM,1 W,5% RESISTOR,METAL FILM,1 KOHM,2 W,5% RESISTOR,METAL FILM,100 OHM,2 W,5% RESISTOR,METAL FILM,15 KOHM,2 W,5% RESISTOR,METAL FILM,18 KOHM,2 W,5% RESISTOR,METAL FILM,2.2 KOHM,2 W,5% RESISTOR,METAL FILM,2.2 OHM,2 W,5% RESISTOR,METAL FILM,560 OHM,2 W,5% RESISTOR,METAL FILM,1KOHM,400mW,1% RESISTOR,METAL FILM,100KOHM,400mW,1% PCB,Pad/Hole PCB,Pad/Hole 2 sides (PTH) RESISTOR,METAL FILM,100KOHM,400mW,1% RESISTOR,METAL FILM,2.21KOHM,400mW,1% RESISTOR,METAL FILM,3.32KOHM,400mW,1% FUSE BLOCK,10.3 X 38MM RESISTOR,THIN FILM,100KOHM,100mW,0.1% TAPE,INSULATION,PVC VIOLET 0.75INX66FT TAPE,FOIL SHIELD ALUM SILVER 0.5INX60YD LABEL,IDENTIFICATION 19.05X38.1MM 250PC LAMP,INDICATOR,NEON,GREEN,125V ENCLOSURE,UTILITY,PLASTIC,BLACK ALIMENTATION SIMPLE 15V 2.5A ALIMENTATION SIMPLE 30V 5A ALIMENTATION DOUBLE 30V 5A GENERATEUR DE FONCTION + FREQUENCEMETRE OSCILLOSCOPE ANALOGIQUE IC,RS-422 TRANSCEIVER,5.5V,TSSOP-16 CONNECTOR,POWER ENTRY,PLUG,60A POINTER BAR KNOB,6.35MM TRANSISTOR MOSFET CANAL N SOT-227B TRANSISTOR MOSFET CANAL N SOT-227B TRANSISTOR MOSFET CANAL N SOT-227B TRANSISTOR MOSFET CANAL N SOT-227B TRANSISTOR MOSFET CANAL N SOT-227B PEST REPELLER,3PK EURO DISCRETE SOCKET,PC BOARD GENERATEUR AUDIO SONDE HAUTE TENSION CALIBRATEUR DE SONOMETRE BOITE A DECADE CAPACITIVE BOITE A DECADE RESISTIVE ALIMENTATION PROGRAMMABLE 60V 3.5A ALIMENTATION PROGRAMMABLE 40V 5A ALIMENTATION PROGRAMMABLE 20V 10A ALIMENTATION DOUBLE ALIMENTATION QUATRE SORTIES OSCILLOSCOPE 20MHZ LED 5MM JAUNE 4 DEGREE TUSB3410,USB TO UART BRIDGE,EVAL MODUL PADLOCK ATTACHMENT RECEPTEUR IR 33KHZ RECEPTEUR IR 36KHZ RECEPTEUR IR 36KHZ RECEPTEUR IR 38KHZ RECEPTEUR IR 36KHZ RECEPTEUR IR 38KHZ RECEPTEUR IR 36KHZ RECEPTEUR IR 36KHZ RECEPTEUR IR 38KHZ RECEPTEUR IR 36KHZ RECEPTEUR IR 38KHZ RECEPTEUR IR 36KHZ RECEPTEUR IR 38KHZ CMS RECEPTEUR IR 38KHZ CMS ALIMENTATION DE TABLE 30V 1A EURO+UK OPTOCOMMUTATEUR CABLE 9259 COAXIAL 152M CABLE COAXIAL 8241 NOIR 152M CABLE 9207 TWINAX 152M CABLE 9729NH 2 PAIRE 305M CABLE 8134 4 PAIRES 152M CABLE 9503NH 3 PAIRE 305M SERIES 31,2 POLE SINGLE HOLE MOUNTED SW REPLACEMENT PADS,FOR 4696554 ESD TWEEZER,110MM TRANSMETTEUR RAIL DIN 8ENTREES RECEPTEUR RAIL DIN 16VOIES OPTOCOMMUTATEUR OPTOCOMMUTATEUR ALIMENTATION STABILISEE 12V 5A 60W ALIMENTATION STABILISEE 12V 10A 120W ALIMENTATION AJUSTABLE 10A ALIMENTATION SYMETRIQUE +/- 15V 0.5A 15W TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE TEST LEAD SET FLUKE TL165X STD SONDE POUR IMMERSION SONDE POUR AIR SONDE DE PENETRATION SONDE DE PENETRATION SONDE D´USAGE COURANT SONDE DE SURFACE CARRY CASE,FLUKE C1600. SURE GRIP ACC SET FLUKE TLK-220 EUR PINCE AMPEREMETRIQUE ET MALETTE DE TRANS TESTER,SOCKET FLUKE SM100 VOYANT NEON VERT TESTER,SOCKET FLUKE SM300 VOYANT NEON AMBRE TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,RING TONGUE,#6,CRIMP CALIBRATEUR DE COURANT LABEL,PASS,500PK FLUKE PASS500 LIVRE D´ENREGISTREMENT TEMPPATCH CALIBRATOR,THERMOCOUPLE STRAIN RELIEF COVER,POLYPHENYLENE OXIDE SACHET ANTISTATIQUE 450X450MM PQ10 BAG,SHIELDED,125X200MM,PK100 BAG,SHIELDED,8´´X12 BAG,SHIELDED,10´´X14 SIGNAUX AVERTISSEURS CORBEILLE 14L BOUTEILLE DE LAVAGE 250ML (5/PQ) BOITE ANTISTATIQUE JAUNE CD DE FORMATION HEADTORCH - LEADACID CONTACTOR 3PST-NO,240VAC,32A,DIN RAIL Continuity Tester 18C2273 THERMOMETRE INFRA-ROUGE QUICK DISCONNECT CABLE,M12,4POS,R/A AFFICH. A LED 4 CARACTERES 3.8MM ROUGE AFFICH. A LED4 CARACTERES 3.8MM VERT AMPLIFICATEUR LARGE BANDE GENERATEUR DE FONCTIONS TG550 GENERATEUR DE FONCTIONS TG1010 THERMOMETRE DIGITAL PANNE 1MM SUPERPRO PANNE 3.2MM SUPERPRO PANNE 4.8MM SUPERPRO PANNE AIRSHAUD SUPERPRO PANNE 1MM SUPERPRO PANNE 3.2MM SUPERPRO PANNE 4.8MM SUPERPRO PANNE SUPERPRO MANOMETRE 130 BARS FICHE FEMELLE 8P FICHE FEMELLE 14P EMBASE MALE 5P EMBASE MALE 8P CALIBRATOR,4-20MA EMBASE MALE 14P HANGING SCALE,50KG CALIBRATION WEIGHT,M1,2G CALIBRATION WEIGHT,M1,20G CAPUCHON SERIE CM CALIBRATION WEIGHT,M1,500G CALIBRATION WEIGHT,M1,1KG CALIBRATION WEIGHT,M1,2KG CALIBRATION WEIGHT,M1,5KG TRANSISTOR,PHOTO,NPN,930NM,T-1 3/4 EMBASE MALE 3P+T STATION DE REPARATION - PISTOLET PINCE TALON PISTOLET DE DESSOUDAGE CORDON DE DESSOUDAGE ENSEMBLE FILTRE ET PAPIER DE NETTOYAGE FER ANTISTATIQUE EPONGE EMBASE FEMELLE 2P+T EXTRACTEUR DE FUMEE 85M3/H EU/UK PANNE CONIQUE POINTUE 0.4MM PANNE BISEAU 30 DEG 5.2MM PANNE CONIQUE POINTUE 0.4MM PANNE BISEAU 30 DEG 0.8MM PANNE BISEAU 30 DEG 1.2MM PANNE CONIQUE POINTUE 30D 0.4MM PANNE BISEAU 60 DEG 0.4MM PANNE 0.25MM MICRO FINE PANNE CONIQUE POINTUE 0.4MM PANNE BISEAU 5.2MM PANNE CONIQUE POINTUE 0.4MM PANNE BISEAU 30 DEG 0.8MM PANNE BISEAU 30 DEG 2.4MM PANNE BISEAU 30 DEG 1.2MM PANNE CONIQUE POINTUE 30D0.4MM PANNE BISEAU 60 DEG 0.4MM PANNE 0.25MM MICRO FINE PANNE ID 0.76MM SERIE 700 PANNE ID 1.00MM SERIE 700 PANNE ID 1.30MM SERIE 700 PANNE ID 1.50MM SERIE 700 PANNE ID 2.40MM SERIE 700 PANNE FINE POINTE 0.4MM PANNE LAME 6.4MM PANNE LAME 15.8MM PANNE LAME 20.6MM PANNE LAME TSOP 10.2MM PANNE LAME 28MM PANNE COURBEE POINTE 1.3MM PANNE MULTI LEAD HOOF PANNE MINI HOOF PANNE LAME 15.7MM PANNE MULTI LEAD KNIFE PANNE MULTI LEAD HOOF PANNE MINI HOOF PANNE CHIP 0805 600 SERIES PANNE CHIP 1206/1210 PANNE CHIP 1808 1812 PANNE SOT 23 600 SERIES PANNE SOIC 8 600 SERIES PANNE SOIC 14 16 PANNE TSOP 600 SERIES PANNE 402 0603 600 SERIES PANNE QFP 100 700 SERIES PANNE CONIQUE POINTUE 0.8MM PANNE BISEAU 30DEG 0.8MM PANNE CONIQUE POINTUE 0.4MM PANNE BISEAU 30DEG 2.4MM PANNE BISEAU 30DEG 1.6MM PANNE BISEAU 30DEG 1.5MM PANNE MINI HOOF 700 SERIES PANNE CONIQUE BISEAU 0.8MM PANNE CONIQUE POINTUE 0.4MM PANNE POINTUE 30DEG 0.4MM PANNE CONIQUE POINTUE 0.8MM PANNE BISEAU 30DEG 0.8MM PANNE CONIQUE POINTUE 0.4MM PANNE BISEAU 30DEG 2.4MM PANNE BISEAU 30DEG 1.6MM PANNE BISEAU 30DEG 1.5MM PANNE MINI HOOF 700 SERIES PANNE CONIQUE BISEAU 0.8MM PANNE CONIQUE POINTUE 0.4MM PANNE POINTUE 30DEG 0.4MM PRE FILTRE POUR SYSTEME BVX (5PQ) FILTRE PRINCIPALE POUR SYSTEME BVX BRAS ANTISTATIQUE- 600MM ENCLOSURE,HAND HELD,PLASTIC,BLACK ENCLOSURE,HAND HELD,PLASTIC,BLACK COFFRET HH 100 FT PP3 NOIR COFFRET HH 100 LCD NB CREME COFFRET HH 100 LCD 4AA CREME COFFRET HH 100 LCD PP3 CREME COFFRET HH 100 LCD NB NOIR COFFRET HH 100 LCD 4AA NOIR COFFRET HH 100 LCD PP3 NOIR COQUE DE PROTECT. BLEU POUR BOITIER 100 COQUE DE PROTECT. BLEU POUR BOITIER 100 COQUE DE PROTECT. ORANGE POUR BOITIER100 COQUE DE PROTECT. JAUNE POUR BOITIER 100 COQUE DE PROTECT. ROUGE POUR BOITIER 100 COQUE DE PROTECT. NOIRE POUR BOITIER 100 COFFRET HH 90 NB NOIR COFFRET HH90 LCD PP3 NOIR COQUE DE PROTECT. BLEU POUR BOITIER 90 COQUE DE PROTECT. JAUNE POUR BOITIER 90 COQUE DE PROTECT. NOIRE POUR BOITIER 90 COFFRET HH55 RT NB GY COFFRET HH55 RT 2AA GY COFFRET HH55 RT 4AA GY COFFRET HH55 RT PP3 GY COFFRET HH55 RT NB NOIR COFFRET HH55 RT 2AA NOIR COFFRET HH55 RT 4AA NOIR COFFRET HH55 RT PP3 NOIR COQUE DE PROTECT. BLEU POUR BOITIER 55 COQUE DE PROTECT. ORANGE POUR BOITIER 55 COQUE DE PROTECT. JAUNE POUR BOITIER 55 COQUE DE PROTECT. ROUGE POUR BOITIER 55 COQUE DE PROTECT. NOIRE POUR BOITIER 55 COFFRET HH40 RT NB CREME COFFRET HH40 RT PP3 CREME COFFRET HH40 RT NB NOIR COFFRET HH40 RT PP3 NOIR COFFRET HH40 FT PP3 CREME COFFRET HH40 FT NB NOIR COFFRET HH40 FT PP3 NOIR COQUE DE PROTECT. BLEU POUR BOITIER 40 COQUE DE PROTECT. BLEU POUR BOITIER 40 COQUE DE PROTECT. ORANGE POUR BOITIER 40 COQUE DE PROTECT. JAUNE POUR BOITIER 40 COQUE DE PROTECT. ROUGE POUR BOITIER 40 COQUE DE PROTECT. NOIRE POUR BOITIER 40 CEINTURE A CLIP NOIR CEINTURE A CLIP CREME PANNEAU D´EXTENSION 100 NOIR SWITCH,SLIDE,SPDT,100mA,THROUGH HOLE CAPACITOR PP FILM 0.22UF,400V,5%,RADIAL BOARD-BOARD CONNECTOR HEADER 20WAY,2ROW RESISTOR,WIREWOUND,0.5 OHM,1W,5% RESISTOR,WIREWOUND,100 OHM,1W,5% RESISTOR,WIREWOUND,300OHM,1W,5% RESISTOR,WIREWOUND,500 OHM,1W,5% RESISTOR,WIREWOUND,240 OHM,5W,5% RESISTOR,WIREWOUND,68 OHM,5W,5% BIPOLAR TRANSISTOR,NPN,80V TO-220 DC-DC CONV,ISO POL,1 O/P,504W,42A,12V DC-DC CONV,ISO POL,1 O/P,504W,18A,2 CRYSTAL,3.6864MHZ,16PF,SMD CRYSTAL,32.768KHZ,6PF,SMD FUSE BLOCK,CLASS CC FUSE FUSE BLOCK,CLASS CC FUSE FUSE BLOCK,10.3 X 38MM FUSE BLOCK,10.3 X 38MM CONTACT,RECEPTACLE,24-18AWG,CRIMP RESISTOR,CURRENT SENSE,50 OHM,15W,1% CAPOT DATAMATE 2MM 12 VOIES RESISTOR,CURRENT SENSE,100KOHM,25W,1% RESISTOR,CURRENT SENSE,1KOHM,30W,1% RESISTOR,CURRENT SENSE,2KOHM,30W,1% SAFETY RELAY,SPST-NO,115VAC,4A SAFETY RELAY,SPST-NO,24VDC,4A TAPE,RETRO REFLECTIVE,25MMX2.5M SENSOR REFLECTOR SENSOR REFLECTOR SENSOR CABLE ASSEMBLY SENSOR MOUNTING BRACKET SENSOR MOUNTING BRACKET PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR,0MM TO 43MM,NPN/PNP OUTPUT PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR CAPOT DATAMATE 2MM 16 VOIES CAPOT DATAMATE 2MM 20 VOIES CIRCUIT BREAKER,HYD-MAG,1P,125V,10A CIRCUIT BREAKER,HYD-MAG,1P,250V,2A CIRCUIT BREAKER,HYD-MAG,1P,250V,5A MOSFET MICRO SWITCH,ROLLER LEVER SPDT 10A 250V SIDE ENTRY HOOD SIZE PG21 ALUMINIUM ALLOY BULKHEAD HOUSING,SIZE 3A,PLASTIC RESISTOR,METAL FILM,49.9 OHM,400mW,1% PINCE A SERTIR RESISTOR,WIREWOUND,33 OHM,5W,5% Wirewound Resistor Wirewound Resistor Wirewound Chassis Mount Wirewound Chassis Mount DIODE MODULE,100V,40A,D-55 DIODE MODULE,100V,70A,D-55 Hook-Up Wire MOUNTING BRACKET MOUNTING BRACKET Hand Held Enclosure TERMINAL,FEMALE DISCONNECT,0.25IN BLUE Ceramic Multilayer Capacitor Capacitance CAPACITOR POLY FILM FILM 1UF,5%,63V, CIRCUIT BREAKER,THERMAL,1P,250V,15A Power Rectifier Diode STANDARD DIODE,35A,800V,DO-203AB TERMINAL BLOCK,PCB,10POS,24-12AWG CONTACT,PIN,14AWG,CRIMP TERMINAL BLOCK,DIN RAIL,2POS,26-14AWG Cable Leaded Process Compatible:Yes SHLD MULTICOND CABLE,5COND,24AWG,1000 CIRCUIT BREAKER,THERMAL MAG,2P,20A MICRO SWITCH,HINGE LEVER,SPDT 15A 250V CHIP INDUCTOR,82NH 300MA 5% 900MHZ CAPACITOR ALUM ELEC 100UF,100V,20%,AXIAL MEASURING,RULER,RULER,MEASURING,RULE CRIMPALL 8000 CRIMPER W/DIE Analog Switch IC On-Resistance,Rds(on): IC,OP-AMP,525KHZ,0.43V/ us,DIP-14 SIP SOCKET,3POS,THROUGH HOLE LED,RED,T-1 3/4 (5MM),11CD,622NM EMBASE DIN FEMELLE 3P LAMP,STACKABLE,IND,RED/GRN/AMB LENS,RECTANGULAR,WHITE CIRCULAR CONNECTOR RCPT,SIZE 14S,6POS,WALL CIRCULAR CONNECTOR PLUG SIZE 13,22POS, RESISTOR,METAL FILM,1 MOHM,3 W,5% ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM,GRAY CIRCULAR CONNECTOR PLUG,SIZE 22,3POS,CABLE CABLE GLAND (CLAMP) CONTACT,SOCKET,14AWG,CRIMP POWER RELAY,DPDT,110VDC,10A,PC BOARD EMBASE DIN FEMELLES 5P EMBASE DIN FEMELLE 5P TERMINAL,COMPRESSION LUG,3/8IN,CRIMP MICRO SWITCH PIN PLUNGER SPST-NO 5A 250V MICRO SWITCH PIN PLUNGER SPDT 10.1A 250V TVS Diode FICHE DIN FEMELLE 7P TERMINAL BLOCK,BARRIER,3POS,22-12AWG ZENER DIODE,5W,16V,AXIAL FICHE DIN FEMELLE 8P PIECE THERMORETRACTABLE COUDEE TUBE HAUTE TEMPERATURE KYNAR NOIR 1.2M PASSE-FIL THERMORETRACTABLE PASSE-FIL THERMORETRACTABLE 1.2M FICHE DIN FEMELLE 4P GAINE THERMO 12.7MM NOIR 6M FICHE DIN FEMELLE 5P CAPACITOR TANT,150UF,16V,RADIAL 10% CAPACITOR TANT,330UF,6.3V,RADIAL 20% DARLINGTON TRANSISTOR,PNP,-80V,TO-126 FICHE DIN FEMELLE 5P SWITCH,TOGGLE,DPDT,6A,250V SCHOTTKY RECTIFIER,30mA,5V,DO-35 ZENER DIODE,1W,110V,AXIAL STANDARD DIODE,3A,1KV,DO-15 METAL OXIDE VARISTOR,31V,80V,16MM DIS FICHE DIN FEMELLE 6P Zener Diode Bridge Rectifier TRIAC,400V,800mA,TO-92 BIPOLAR TRANSISTOR,PNP,-140V TO-3 IC,QUAD OR GATE,2I/P,DIP-14 FICHE DIN FEMELLE 8P FICHE DIN MALE 4P I/O MODULE IR EMITTER,950NM,T-3/4,THROUGH HOLE FICHE DIN MALES 5P FICHE DIN MALE 5P LED,RED,T-1 3/4 (5MM),15MCD,630NM PLUG & SOCKET HOUSING,PLUG,NYLON PLUG & SOCKET HOUSING,RECEPTACLE,NYLON CIRCULAR CONNECTOR RECEPTACLE 6POS CABLE CIRCULAR CONNECTOR,PLUG,5POS,CABLE CIRCULAR CONNECTOR,PLUG,6POS,CABLE CIRCULAR CONNECTOR,PLUG,8POS,CABLE CIRCULAR CONNECTOR RECEPTACLE 3POS PANEL FICHE DIN MALE 7P POWER RELAY,SPDT,12VDC,12A,PC BOARD CIRCULAR CONN,RCPT,SIZE 16S,7POS,BOX CIRCULAR CONN,RCPT,SIZE 18,5POS,BOX CIRCULAR CONNECTOR PLUG SIZE 10SL 2POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 10SL 3POS,CABLE IC,DIFFERENTIAL LINE RECEIVER,SGL DIP8 OPTOCOUPLER,TRANSISTOR,5000VRMS CIRCULAR CONN,RCPT,SIZE 14,19POS,BOX CIRCULAR CONN,PLUG,SIZE 8,2POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14,19POS,CABLE CIRCULAR CONN,PLUG,SIZE 8,4POS,CABLE WIRE-BOARD CONNECTOR RECEPTACLE,7POS,2.54MM WIRE-BOARD CONNECTOR RECEPTACLE 10POS,2.54MM ZENER DIODE,500mW,11V,DO-35 IC,OP-AMP,SOIC-8 SMALL SIGNAL DIODE,100V 200mA SOT-23 FAST RECOVERY DIODE,1A,600V DO-41 ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY CAPACITOR CERAMIC 1500PF 100V,C0G,5%,0805 RF/COAXIAL ADAPTER,N JACK-N JACK CAPACITOR CERAMIC 82PF 50V,C0G,5%,0805 CAPACITOR CERAMIC 100PF 50V,C0G,5%,1206 CAPACITOR CERAMIC 470PF 100V,C0G,5%,1206 CAPACITOR CERAMIC 0.1UF,100V,X7R,10%,1210 CAPACITOR TANT,33UF,25V,0.13 OHM,0.2,SMD CAPACITOR TANT,6.8UF,50V,0.45 OHM,0.2,SMD Data Line Surge Suppressor CONTACT,SOCKET,30-26AWG,CRIMP LAMP,FLUORESCENT,13W LAMP,FLUORESCENT,22W GROUNDING CORD UNIVERSAL SNAP MOUNTING KIT WORKSURFACE OR FLOOR MAT GROUNDING CORD KIT HALL EFFECT MAGNETIC SENSOR HALL EFFECT MAGNETIC SENSOR CIRCULAR CONN,RCPT,SIZE 8,4POS,BOX CIRCULAR CONN,PLUG,SIZE 12,8POS,BOX CIRCULAR CONNECTOR,RCPT,SIZE 12,8POS,CABLE TERMINAL,RING TONGUE,3/8IN,CRIMP TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE TERMINAL,RING TONGUE,1/4IN,CRIMP,RED TERMINAL,FEMALE DISCONNECT,0.25IN BLUE TERMINAL,RING TONGUE,3/8IN,CRIMP TERMINAL,RING TONGUE,5/16IN,CRIMP TERMINAL,RING TONGUE,3/8IN,CRIMP BNC ADAPTER,1 X PLUG-2 X JACK RF/COAXIAL ADAPTER,F JACK-F PLUG CAPACITOR PP FILM 0.1UF,400V,5%,RADIA CAPACITOR CERAMIC 0.022UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 1000PF 100V,C0G,5%,RAD CAPACITOR CERAMIC,1UF,50V,X7R,10%,RADIAL CAPACITOR CERAMIC 0.22UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 0.33UF,50V,X7R,10%,RAD TERMINAL,RING,#10 STUD,CRIMP,RED,22-16AWG TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING,9.53MM STUD,CRIMP,RED,22-16AWG SWITCH,PUSHBUTTON,SPST,3A,250V AMPLI OP CMOS 1MHZ 1.8V CMS 6001 AMPLI OP CMOS 1MHZ 1.8V CMS 6001 N4,12 ECLIPSE JR ENCLOSURE W/PANEL,10X8X4,STEEL,GRAY N4,12 ECLIPSE JR ENCLOSURE W/PANEL,12X10X5,STEEL,GRAY PCB,Pad/Hole RESISTOR,METAL FILM,10 OHM,600mW,1% RESISTOR,METAL FILM,20KOHM,600mW,1% IC,OP-AMP,1MHZ,0.8V/ us,SOIC-8 Programmable Gain Amplifier IC RF/COAXIAL N PANEL JACK STR 50 OHM SOLDER PCB,Punchboard,No Clad,Pattern-P PCB,Punchboard,Clad 1 Side,Pattern-P IC,CURRENT MODE PWM CTRL,25V,8-SOIC RESISTOR,METAL FILM,100 KOHM,2 W,5% CABLE ASSEMBLY ENGINEERING MATERIALS,TUBE INDICATOR LAMP LENS,ROUND,GREEN LENS,ROUND,RED IC,OP-AMP,SOIC-14 DIN RAIL MOUNTING ADAPTER IC,DECODERS/ENCODERS/MULTIPLEXERS/DEMUL TERMINAL BLOCK JUMPER,2WAY RESISTOR,METAL FILM,1.78KOHM,125mW,1% RESISTOR,METAL FILM,316 OHM,125mW,1% RESISTOR,METAL FILM,806 OHM,125mW,1% WIRE-BOARD CONNECTOR RECEPTACLE,7POS,2.54MM CONDENSATEUR 470000UF 470000UF KEYCAP N4,12 ECLIPSE JR ENCLOSURE W/PANEL,16X14X6,STEEL,GRAY N4,12 ECLIPSE JR ENCLOSURE W/PANEL,6X6X4,STEEL,GRAY N4,12 ECLIPSE JR ENCLOSURE W/PANEL,8X6X3.5,STEEL,GRAY SWITCH,ROCKER,SPST,20A,250V,BLACK CIRCULAR CONNECTOR PLUG SIZE 20,14POS,CABLE CIRCULAR CONN,PLUG,SIZE 16,26POS,BOX CIRCULAR CONN,PLUG,SIZE 8,3POS,BOX CIRCULAR CONN,RCPT,SIZE 8,3POS,BOX CIRCULAR CONN,RCPT,SIZE 8,4POS,BOX CIRCULAR CONNECTOR PLUG SIZE 18,32POS,CABLE CIRCULAR CONN,RCPT,SIZE 12,10POS,BOX CIRCULAR CONN,RCPT,SIZE 14,19POS,BOX CIRCULAR CONNECTOR PLUG,SIZE 10,6POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 12,3POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 16,26POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 16,8POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 18,32POS,CABLE CIRCULAR CONNECTOR MIL SPEC:MIL-C-26482 CIRCULAR CONN,PLUG,SIZE 10,6POS,BOX CIRCULAR CONNECTOR PLUG SIZE 16,26POS,CABLE RESISTOR,METAL FILM,100 OHM,400mW,1% IC,HALL EFFECT SENSOR,UNIPOLAR SOT89B3 MICRO SWITCH,PIN PLUNGER,SPDT,1A 125V SWITCH,PUSHBUTTON,SPST-NO,8A,250V TERMINAL,RING TONGUE,#10,CRIMP TERMINAL,PARALLEL SPLICE TERMINAL,RING TONGUE,#8,CRIMP MICRO SWITCH,BUTTON,SPDT,100mA,250V RESISTOR,METAL FILM,33.2KOHM,400mW,1% UNSHLD FLAT PHONE CORD 6COND 26AWG 100FT Hook-Up Wire KEYCAP ENCLOSURE,PUSH BUTTON,1 HOLE,STEEL SWITCH,ROCKER,SPST,16A,250V,BLACK SWITCH,ROCKER,SPST,16A,250V,BLACK SWITCH,ROCKER,SPST,16A,250V,BLACK SWITCH,TOGGLE,DPDT,5A,250V SWITCH,TOGGLE,SPDT,5A,250V CIRCUIT BREAKER,THERMAL MAG,1P,15A TOP ENTRY HOOD,ALUMINIUM ALLOY Hook-Up Wire CLOSED END STRAIN RELIEF COVER,NYLON WIRE-BOARD CONNECTOR RECEPTACLE 60POS,2.54MM COLLAR WITH COVER TERMINAL FEMALE DISCONNECT 6.35MM YELLOW CAT5E IDC MODULAR JACK,1 PORT Strain Relief SHUNT JUMPER,2WAY,5.08MM FEET (BUMPERS) Pushbutton Switch Small Wall Mount Box TEST SPRING SOCKET,PCB,WIRE WRAP TERMINAL,RING TONGUE,#6,CRIMP WIRE-BOARD CONNECTOR RECEPTACLE,6POS,3.96MM CIRCULAR CONNECTOR,RECEPTACLE,4POS,PANEL CIRCULAR CONTACT SOCKET,26-22AWG,CRIMP CIRCULAR CONTACT,PIN,26-22AWG,SOLDER RF/COAXIAL ADAPTER,N JACK-BNC JACK RF/COAXIAL ADAPTER,N JACK-BNC PLUG RF/COAXIAL ADAPTER,SMA JACK-MCX JACK RF/COAXIAL ADAPTER,N JACK-TNC JACK RF/COAXIAL ADAPTER,BNC JACK-TNC PLUG RF/COAXIAL ADAPTER,N JACK-F PLUG CAPACITOR CERAMIC,1UF,50V,Y5V,+80,-20%,RADIAL LIQUID LEVEL SENSOR LIQUID LEVEL SENSOR LIQUID LEVEL SENSOR FLOW SENSOR,1GPM,13.8BAR,1/2´´ NPT FLOW SENSOR,1.5-20GPM,6.9BAR,12.7MM FLOW SENSOR,0.5GPM,69BAR,1/4´´ NPT LIQUID LEVEL SENSOR LIQUID LEVEL SENSOR SHUNT JUMPER,2WAY,2.54MM FICHE MALE SPEAKON 4P 90DEG RESISTOR,METAL FILM,1.21KOHM,600mW,1% RESISTOR,METAL FILM,1.5KOHM,600mW,1% RESISTOR,METAL FILM,1.1MOHM,600mW,1% RESISTOR,METAL FILM,1.2MOHM,600mW,1% RESISTOR,METAL FILM,121 OHM,600mW,1% Metal Film Resistor Series:B0207C-F RESISTOR,METAL FILM,2MOHM,600mW,1% RESISTOR,METAL FILM,2.2MOHM,600mW,1% RESISTOR,METAL FILM,20 OHM,600mW,1% RESISTOR,METAL FILM,200KOHM,600mW,1% Metal Film Resistor RESISTOR,METAL FILM,3.01KOHM,600mW,1% RESISTOR,METAL FILM,4.75KOHM,600mW,1% RESISTOR,METAL FILM,4.99KOHM,600mW,1% RESISTOR,METAL FILM,475 OHM,600mW,1% RESISTOR,METAL FILM,49.9KOHM,600mW,1% RESISTOR,METAL FILM,1.5 KOHM,1 W,5% RESISTOR,METAL FILM,1.8 KOHM,1 W,5% RESISTOR,METAL FILM,1.5 OHM,1 W,5% RESISTOR,METAL FILM,100 KOHM,1 W,5% RESISTOR,METAL FILM,15 KOHM,1 W,5% RESISTOR,METAL FILM,2.4 KOHM,1 W,5% RESISTOR,METAL FILM,2 OHM,1 W,5% RESISTOR,METAL FILM,2.7 OHM,1 W,5% RESISTOR,METAL FILM,22 OHM,1 W,5% RESISTOR,METAL FILM,220 OHM,1 W,5% RESISTOR,METAL FILM,27 OHM,1 W,5% RESISTOR,METAL FILM,3 KOHM,1 W,5% RESISTOR,METAL FILM,330 OHM,1 W,5% RESISTOR,METAL FILM,39 KOHM,1 W,5% RESISTOR,METAL FILM,4.3 OHM,1 W,5% RESISTOR,METAL FILM,4.7 OHM,1 W,5% RESISTOR,METAL FILM,47 KOHM,1 W,5% RESISTOR,METAL FILM,47 OHM,1 W,5% RESISTOR,METAL FILM,470 OHM,1 W,5% RESISTOR,METAL FILM,5.1 KOHM,1 W,5% RESISTOR,METAL FILM,6.2 KOHM,1 W,5% RESISTOR,METAL FILM,6.8 OHM,1 W,5% RESISTOR,METAL FILM,620 OHM,1 W,5% RESISTOR,METAL FILM,68 OHM,1 W,5% RESISTOR,METAL FILM,8.2 KOHM,1 W,5% RESISTOR,METAL FILM,1.2 KOHM,2 W,5% RESISTOR,METAL FILM,1 MOHM,2 W,5% RESISTOR,METAL FILM,1.8 OHM,2 W,5% RESISTOR,METAL FILM,150 KOHM,2 W,5% RESISTOR,METAL FILM,150 OHM,2 W,5% RESISTOR,METAL FILM,2 KOHM,2 W,5% RESISTOR,METAL FILM,22 KOHM,2 W,5% RESISTOR,METAL FILM,22 OHM,2 W,5% RESISTOR,METAL FILM,33 KOHM,2 W,5% RESISTOR,METAL FILM,33 OHM,2 W,5% RESISTOR,METAL FILM,330 OHM,2 W,5% RESISTOR,METAL FILM,4.7 KOHM,2 W,5% RESISTOR,METAL FILM,47 OHM,2 W,5% RESISTOR,METAL FILM,470 OHM,2 W,5% RESISTOR,METAL FILM,5.1 KOHM,2 W,5% RESISTOR,METAL FILM,5.6 KOHM,2 W,5% RESISTOR,METAL FILM,68 KOHM,2 W,5% RESISTOR,METAL FILM,1.5KOHM,400mW,1% RESISTOR,METAL FILM,10 OHM,400mW,1% RESISTOR,METAL FILM,2.21KOHM,400mW,1% RESISTOR,METAL FILM,2MOHM,400mW,1% RESISTOR,METAL FILM,20KOHM,400mW,1% RESISTOR,METAL FILM,200KOHM,400mW,1% RESISTOR,METAL FILM,1 KOHM,3 W,5% RESISTOR,METAL FILM,10 KOHM,3 W,5% RESISTOR,METAL FILM,10 OHM,3 W,5% RESISTOR,METAL FILM,100 OHM,3 W,5% RESISTOR,METAL FILM,12 KOHM,3 W,5% RESISTOR,METAL FILM,180 OHM,3 W,5% RESISTOR,METAL FILM,22 KOHM,3 W,5% RESISTOR,METAL FILM,220 OHM,3 W,5% RESISTOR,METAL FILM,30 KOHM,3 W,5% RESISTOR,METAL FILM,47 KOHM,3 W,5% RESISTOR,METAL FILM,510 KOHM,3 W,5% RESISTOR,METAL FILM,68 OHM,3 W,5% RESISTOR,METAL FILM,1.1KOHM,400mW,1% RESISTOR,METAL FILM,1.82KOHM,400mW,1% RESISTOR,METAL FILM,1.5MOHM,400mW,1% RESISTOR,METAL FILM,10 OHM,400mW,1% RESISTOR,METAL FILM,110KOHM,400mW,1% RESISTOR,METAL FILM,121 OHM,400mW,1% RESISTOR,METAL FILM,140 OHM,400mW,1% RESISTOR,METAL FILM,15KOHM,400mW,1% RESISTOR,METAL FILM,150KOHM,400mW,1% RESISTOR,METAL FILM,16.2KOHM,400mW,1% RESISTOR,METAL FILM,2.43KOHM,400mW,1% RESISTOR,METAL FILM,2.49KOHM,400mW,1% RESISTOR,METAL FILM,2.74KOHM,400mW,1% RESISTOR,METAL FILM,2MOHM,400mW,1% RESISTOR,METAL FILM,20KOHM,400mW,1% RESISTOR,METAL FILM,200 OHM,400mW,1% RESISTOR,METAL FILM,249 OHM,400mW,1% RESISTOR,METAL FILM,27.4KOHM,400mW,1% RESISTOR,METAL FILM,3.01KOHM,400mW,1% RESISTOR,METAL FILM,301 OHM,400mW,1% RESISTOR,METAL FILM,316OHM,400mW,1% RESISTOR,METAL FILM,39.2KOHM,400mW,1% RESISTOR,METAL FILM,4.75KOHM,400mW,1% RESISTOR,METAL FILM,47.5KOHM,400mW,1% RESISTOR,METAL FILM,475 OHM,400mW,1% RESISTOR,METAL FILM,49.9KOHM,400mW,1% RESISTOR,METAL FILM,499 OHM,400mW,1% RESISTOR,METAL FILM,51.1KOHM,400mW,1% RESISTOR,METAL FILM,590 OHM,400mW,1% RESISTOR,METAL FILM,6.04KOHM,400mW,1% RESISTOR,METAL FILM,6.81KOHM,400mW,1% RESISTOR,METAL FILM,60.4 OHM,400mW,1% RESISTOR,METAL FILM,604 OHM,400mW,1% RESISTOR,METAL FILM,7.5KOHM,400mW,1% RESISTOR,METAL FILM,8.06KOHM,400mW,1% RESISTOR,METAL FILM,8.25KOHM,400mW,1% RESISTOR,METAL FILM,9.09KOHM,400mW,1% CAP,ROUND,RED FEET (BUMPERS) TRANSDUCER,PIEZO,2.9KHZ,95DBA,28VDC PANEL MOUNT INDICATOR,LED,16MM,GREEN,12V PANEL MOUNT INDICATOR,LED,8MM,RED,130V PANEL MOUNT INDICATOR,LED,8MM,GREEN,130V CAPACITOR CERAMIC 1000PF 100V,X7R,10%,AXIAL CAPACITOR CERAMIC 470PF 50V,C0G,5%,AXIAL CAPACITOR CERAMIC 0.047UF 50V,X7R,10%,AXIAL CAPACITOR CERAMIC 10PF 50V,C0G/NP0,5%,RAD CAPACITOR CERAMIC 100PF 100V,C0G,5%,R CAPACITOR CERAMIC 1000PF 50V,C0G,5%,R CAPACITOR CERAMIC 1000PF,50V,X7R,10%,RAD CAPACITOR CERAMIC 0.01UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 0.1UF,100V,X7R,10%,RAD CAPACITOR CERAMIC 15PF 50V,C0G/NP0,5%,RAD CAPACITOR CERAMIC 18PF 50V,C0G/NP0,5%,RAD CAPACITOR CERAMIC 180PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 22PF 50V,C0G/NP0,5%,RAD CAPACITOR CERAMIC 2200PF,50V,X7R,10%,RAD CAPACITOR CERAMIC 0.022UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 270PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 470PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 4700PF,50V,X7R,10%,RAD CAPACITOR ALUM ELEC 330UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 15UF,63V,20%,AXIAL CAPACITOR ALUM ELEC 2.2UF,63V,20%,AXIAL CAPACITOR ALUM ELEC 0.47UF,63V,20%,AX CAPACITOR ALUM ELEC 100UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 68UF,63V,20%,AXIAL CAPACITOR ALUM ELEC 1UF 35V 20%,AXIAL CAPACITOR ALUM ELEC 10UF,25V,20%,AXIAL CAPACITOR ALUM ELEC 100UF,40V,20%,AXIAL CAPACITOR ALUM ELEC 10UF,100V,20%,AXIAL SCOTCHCODE PRINTED WIRE MARKER BK 0.22´´´´W RESISTOR,THIN FILM,47KOHM,125mW,0.1% TOOLS,CUTTERS,CABLE,CABLE CUTTER 3677 TAPE,INSULATION,SILVER,48MMX60FT SWITCH,PUSHBUTTON,SPST,3A,250V TERMINAL,WIRE TAP/SPLICE,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP,RED TERMINAL,FEMALE DISCONNECT,0.187IN RED SWITCH,ROCKER,SPST,10A,250V,BLACK CAPACITOR PP FILM 3.3UF,630V,20%,RADIAL RESISTOR,WIREWOUND,5.1 OHM,5W,5% SWITCH,PUSHBUTTON,SPST-NO,8A,250V SWITCH,TOGGLE,SPDT,6A,250V SWITCH,TOGGLE,SPDT,6A,250V SWITCH,TOGGLE,DPDT,6A,250V SWITCH,PUSHBUTTON,SPDT-1NO/1NC 1A 250V SEALTITE 59/6 RATCHETED COMPRESSION CRIMPER TOOL RESISTOR,THICK FILM,6.8 OHM,125mW,1% CAPACITOR ALUM ELEC 100UF,25V,20%,AXIAL PROXIMITY SENSOR Contact FUSE BLOCK,10.3 X 38MM ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK Ceramic Multilayer Capacitor SOLUTION DE STOCKAGE POUR PH-METRE 230ML TEMPERATURE STRIP,160°C/199°C PROBE,ISOLATED SCOPE THYRISTOR MODULE,55A,1.2KV IC,PWM CONTROLLER,35V,18-DIP PORTE FUSIBLE SERIE NH THYRISTOR MODULE,90A,1.2KV FUSIBLE 80A BOBINE DE MONTAGE MALE/MALE FUSIBLE 100A BOBINE DE MONTAGE MALE/MALE BOBINE DE MONTAGE MALE/MALE BOBINE DE MONTAGE MALE/MALE BOBINE DE MONTAGE MALE/MALE BOBINE DE MONTAGE MALE/MALE BOBINE DE MONTAGE MALE/MALE BOBINE DE MONTAGE MALE/MALE BOBINE DE MONTAGE MALE/FEMELLE BOBINE DE MONTAGE MALE/FEMELLE BOBINE DE MONTAGE MALE/FEMELLE BOBINE DE MONTAGE MALE/FEMELLE BOBINE DE MONTAGE FEMELLE/FEMELLE BOBINE DE MONTAGE FEMELLE/FEMELLE BOBINE DE MONTAGE FEMELLE/FEMELLE BOBINE DE MONTAGE FEMELLE/FEMELLE MOUNT,BELL,FAILSAFE MOUNT,BELL,SLOTTED BOBINE DE MONTAGE MALE (1 COTE) BOBINE DE MONTAGE MALE (1 COTE) BOBINE DE MONTAGE MALE (1 COTE) BOBINE DE MONTAGE MALE (1 COTE) BOBINE DE MONTAGE FEMELLE (1 COTE) PIED. FER ARTICULE M8X50 PIED. POLYAMIDE METAL MOUNT PEDESTAL 85X25 TERMINAL FEMALE DISCONNECT 0.25IN YELLOW TERMINAL,RING TONGUE,#4,CRIMP THERMOMETRE NUMERIQUE THERMOMETER,TYPE T TEMPERATURE DATA LOGGER KIT TEMPERATURE DATA LOGGER,INT SENSOR MANOMETER,0-130MBAR,DIFF TROUSSE A OUTILS FORET TUNGSTENE 1.2MM FORET TUNGSTENE 1.6MM FORET TUNGSTENE 3.175MM BATTERY PACK,9.6V,1.4AH FER A SOUDER 12W 240V FER A SOUDER 15W 240V TIP,MICRO POINT,STT,0.25MM,PK3 CHISEL TIP POINT,STT,2.4MM,PK3 CHISEL TIP POINT,STT,3.5MM,PK3 FICHE PHONO VERT FICHE PHONO BLEU EMBASE CHASSIS JAUNE EMBASE CHASSIS VERT RUBBER BUNG,FEMALE,XLR ADAPTOR,XLR PLUG TO XLR RCPT ENREGISTREUR DE DONNEES STROBOSCOPE PICSTART PLUS,FLASH UPGRADE MODULE CIRCULAR CONN,RCPT,SIZE 16,3POS,BOX CIRCULAR CONN,RCPT,SIZE 16,3POS,BOX MODULE D´EVALUATION ADS8322 CONVERTISSEUR N/A 10 BITS QUADRUPLE CMS FUSE,63A,690V,STUD MOUNT,FAST ACTING EMBOUT TORX INVIOLABLE T30 FIBRE POLYMERE 3MM BARE 5 MTR CLEF REGLABLE 254MM FLASQUE D´EXTREMITE ORANGE SEPARATEUR POUR BORNE 6MM FASQUE D´EXTREMITE 1.5MM ZELIO 24VDC. 8 DI/4 RO ZELIO 100-240VAC 6 DI/4 RO ZELIO 100-240VAC 8 DI/4 RO ZELIO 24VDC 12 DI/8 RO ZELIO 24VDC 12 DI/8 RO ZELIO 24VDC. 16 DI/10 RO ZELIO 24V. 8 DI/6 RO DEMARREUR ZELIO LOGIC DEMARREUR ZELIO LOGIC DEMARREUR ZELIO LOGIC DEMARREUR ZELIO LOGIC DEMARREUR ZELIO LOGIC CD,ZELIO PC PROGRAMMING CABLE ASSEMBLY,ZELIO LOGIC,GREY,3M CARTOUCHE EEPROM ZELIO PILE ZINC CHLORIDE C (PQ2) PILE ZINC CHLORIDE C (PQ24) LCR-METRE 0.2% MULTIMETER,DIGITAL,LCR,0.1% MULTIMETRE NUMERIQUE CARTOUCHE ENCRE COMPAT. T007401 CARTOUCHE ENCRE COMPAT. T009401 CARTOUCHE ENCRE COMP. EPSON NOIRE CARTOUCHE ENCRE COMP. EPSON 3 COULEURS RF METER,BROADBAND FIL D´EQUIPEMENT FLEXLITE 0.25MM ROUGE FIL D´EQUIPEMENT FLEXLITE 0.25MM BLANC FIL D´EQUIPEMENT FLEXLITE 0.35MM VERT FIL D´EQUIPEMENT FLEXLITE 0.35MM BLANC FIL D´EQUIPEMENT FLEXLITE 0.5MM VERT FIL D´EQUIPEMENT FLEXLITE 0.5MM BLANC FIL D´EQUIPEMENT FLEXLITE 0.75MM ROUGE FIL D´EQUIPEMENT FLEXLITE 0.75MM VERT FIL D´EQUIPEMENT FLEXLITE 1.0MM NOIR FIL D´EQUIPEMENT FLEXLITE 1.0MM ROUGE FIL D´EQUIPEMENT FLEXLITE 1.0MM VERT FIL D´EQUIPEMENT FLEXLITE 1.0MM BLANC FIL D´EQUIPEMENT FLEXLITE 1.5MM ROUGE FIL D´EQUIPEMENT FLEXLITE 1.5MM VERT FIL D´EQUIPEMENT FLEXLITE 1.5MM BLANC WIRE,24AWG GREY WIRE,22AWG YELL WIRE,22AWG GRN WIRE,22AWG GREY WIRE,20AWG GRN WIRE,20AWG GREY WIRE,18AWG YELL WIRE,18AWG GRN SEPARATEUR BORNE DE PUISSANCE 120MM CAPOT COMPLET BORNE DE PUISSANCE 300MM SEPARATEUR BORNE DE PUISSANCE 300MM CAPTEUR A EFFET HALL PRINTER,LABEL LABEL PRINTER KIT CARTRIDGE,LABEL,YELLOW PAT TESTER KIT OPTOSWITCH UNSHLD MULTIPR CABLE 4PR 1000FT 300V RED UNSHLD MULTIPR CABLE 1PR 500FT 300V CHR COAXIAL CABLE,RG-58A/U,500FT,BLACK COAXIAL CABLE,RG-58A/U,500FT,BLACK COAXIAL CABLE,RG-58C/U,500FT,BLACK UNSHLD MULTICOND CABLE 2COND 22AWG 1000FT UNSHLD MULTIPR CABLE 1PR 500FT 300V CHR UNSHLD MULTICOND CABLE 4COND 18AWG 500FT FUSE,CARTRIDGE,2A,5X20MM,TIME DELAY SCOTCHMATE RECLOSABLE FASTENER,BLK,1´´W ENCLOSURE,UTILITY,PLASTIC,GRAY FUSE HOLDER CAP SOLENOID LAMINATED FRAME PULL CONTINUOUS CABLE,COAXIAL,RG58,19AWG,50 OHM,500FT,BLK TAPE,SPLICING,RUBBER,BLACK 1.5INX30FT CONN,TERMINAL,BUTT SPLICE,IDC,YELLOW TERMINAL BLOCK,DIN RAIL,2POS,28-12AWG CHARGEUR 45W 28V CHARGEUR 45W 14V CHARGEUR 75W 28V CLEANING SOLUTION,ELECTRODE ANALYSER,COMBUSTION COMBUSTION ANALYSER KIT DETECTOR,LEAK,REFRIGERANT HYGROMETER,PEN TYPE PINCE DE TERRE SOURCE,V+I CALIBRATOR,VOLTAGE & CURRENT CALIBRATOR,LOOP,V-I SIMULATOR,PT100 RESISTANCE BOX,PRECISION IC,OP-AMP,8MHZ,2.8V/ us,DIP-8 SOCKET,NTE5,(5A) TACHOMETER,LASER TACHOMETER,MECHANICAL FER A SOUDER 15W 230V PRISE UK FER A SOUDER 25W 230V PRISE UK ZENER DIODE,1W,6V,AXIAL BATTERIE POUR TEL SANS FIL 550MAH BATTERIE POUR APP. PHOTO NUM. FUJI NP60 VIBRATION METER,200G,2000MM/SEC SIMULATOR,LOOP CALIBRATOR,VIR UNSHLD MULTICOND CABLE,6COND,22AWG/18AWG,305M,300V MICRO SW,ROLLER PLUNGER,SPDT,15A 250V POWER RELAY,DPDT,115VAC,3A,PLUG IN CATEGORY 5E CABLE ASSEMBLY POWER RELAY,4PDT,120VAC,5A,PLUG IN DIODE 12A 1200V DIODE 25A 600V CAPACITOR PP FILM 15UF,660V,6%,QC POWER RELAY,DPDT,48VDC,15A,PLUG IN INDUCTANCE 6UH SOUDURE SANS PLOMB ROSIN 0.9MM 500G SOUDURE SANS PLOMB NO-CLEAN 0.5MM 250G SOUDURE SANS PLOMB NO-CLEAN 0.7MM 250G SOUDURE SANS PLOMB NO-CLEAN 0.9MM 250G SOUDURE SANS PLOMB NO-CLEAN 1.2MM 250G SOUDURE SANS PLOMB NO-CLEAN 0.7MM 500G SOUDURE SANS PLOMB NO-CLEAN 0.9MM 500G SOUDURE SANS PLOMB NO-CLEAN 1.2MM 500G AMPOULE POUR LAMPE TORCHE ANTIDEFLAGRANT GENER. DE FONCTION DE TABLE 3MHZ EU/UK Multiconductor Control & Instrumentation SURGE PROTECTION & FILTER,19IN PLUG,QUICK FIT,3A,WHITE PLUG,QUICK FIT,13A,WHITE PLUG,QUICK FIT,3A,BLACK PLUG,QUICK FIT,5A,BLACK EXTENSION LEAD,4WAY,BLACK,5M EXTENSION LEAD,SWITCH,4WAY SOCKET,SWITCHED,8WAY,3M SOCKET,SWITCHED,8WAY,3M BOX,DRYLINER,1GANG SOCKET,2GANG JUNCTION BOX JUNCTION BOX JUNCTION BOX JUNCTION BOX JUNCTION BOX JUNCTION BOX CONNECTION UNIT,FUSED OUTLET BOX,STEEL OUTLET BOX,STEEL BACK BOX,SURFACE MOUNT SOCKET SWITCHED,METALCLAD,2GANG SOCKET,2GANG,2 POLE SWITCH,2 POLE,20A,METAL CLAD BLANK PLATE,1GANG,METALCLAD FUSED CONNECTION UNIT,METALCLAD FUSED CONNECTION UNIT,METALCLAD SURGE PROTECTOR,6GANG SUB-D FEMELLE CI 15V FILETAGE/INSERT SUB-D FEMELLE CI 25V FILETAGE/INSERT INTERRUPTEUR A LEVIER 2P ON-ON INDUCTANCE 50UH INDUCTANCE 30UH BATTERIE POUR APPLE POWERBOOK G3 PORTABLE LIGHT,RL100,18W BATTERIE EUROPA+GEL 12V 26AH BATTERIE EUROPA+GEL 12V 55AH ABSOLUTE/MECHANICAL ENCODER UNSEALED OI-PB SWITCH PUSHBUTTON SWITCH LIMIT SWITCH,ROLLER LEVER,SPDT-1NO/1NC MICRO SWITCH,STR LEVER,SPDT 100mA 125V MICRO SWITCH,PIN PLUNGER,SPDT 11A 277V MICRO SWITCH,LEAF LEVER,SPDT,15A 277V SWITCH,TOGGLE,DPDT,20A,277V SWITCH,TOGGLE,4PDT,20A,277V SWITCH,TOGGLE,4PDT,18A,277V MICRO SWITCH,ROLLER LEVER SPDT 15A 277V BASIC SWITCH,STRAIGHT LEVER,SPDT,15A,600V LIMIT SWITCH,TOP PLUNGER,SPDT-1NO/1NC SWITCH,TOGGLE,DPDT,5A,125V MICRO SWITCH,PIN PLUNGER,SPDT,3A 250V FERRITE CORE,CYLINDRICAL LIMIT SWITCH,TOP PLUNGER,SPDT-1NO/1NC RESISTOR,HV THICK FILM,50MOHM 500mW,1 AML LED FERRITE CORE,CYLINDRICAL,68OHM/100MHZ,300MHZ PACK BATTERIE 4.8V PILE ALCALINE C (PQ200) PILE ALCALINE PP3 (PQ200) N CHANNEL JFET,-50V,TO-92 CABLE,CAT5 ETHERNET 100M SOUDURE SANS PLOMB HI-ACT 0.5MM 250G SOUDURE SANS PLOMB HI-ACT 0.7MM 250G SOUDURE SANS PLOMB HI-ACT 0.9MM 250G SOUDURE SANS PLOMB HI-ACT 1.2MM 250G SOUDURE SANS PLOMB HI-ACT 0.7MM 500G SOUDURE SANS PLOMB HI-ACT 0.9MM 500G SOUDURE SANS PLOMB HI-ACT 1.2MM 500G SOUDURE SANS PLOMB MIN-ACT 0.5MM 250G SOUDURE SANS PLOMB MIN-ACT 0.9MM 250G SOUDURE SANS PLOMB MIN-ACT 1.2MM 500G SOUDURE SANS PLOMB MIN-ACT 0.7MM 250G SOUDURE SANS PLOMB MIN-ACT 0.9MM 250G SOUDURE SANS PLOMB MIN-ACT 0.9MM 500G RF TRANSISTOR,PNP,-3V,25MHZ CORDON PERITEL HQ 2M CORDON PERITEL HQ 3M CORDON PERITEL HQ 5M CORDON PERITEL HQ 10M HAUT-PARLEUR 2 INCH MINI MODULE TX FM 433MHZ MODULE RX FM 433MHZ MODULE TX FM 860-920MHZ MODULE RX FM 860-920MHZ MODULE TX 433MHZ MODULE TX 868MHZ PANNEAU 19´´ 1U PANNEAU 19´´ 2U CORDON XLR NOIR CORDON XLR MICROPHONE CORDON XLR MICROPHONE CORDON XLR MICROPHONE CORDON JACK HAUT-PARLEUR CORDON SPEAKON 2P 10M BUSE DROITE TJ80 BUSE COURBEE TJ80 BUSE PLATE TJ80 BANANA PLUG,5A,SCREW,RED CONNECTEUR 2MM 20P CONNECTEUR 2MM 14P TRIMMER CMS 1K TRIMMER CMS 1K TRIMMER CMS 5K TRIMMER CMS 10K TRIMMER CMS 50K TRIMMER CMS 100K TRIMMER CMS 1K TRIMMER CMS 2K TRIMMER CMS 10K TRIMMER CMS 20K TRIMMER CMS 50K TRIMMER CMS 100K TRIMMER CMS 1K TRIMMER CMS 10K TRIMMER CMS 100K RELAIS 12VDC RELAIS 24VDC CAPTEUR DE DEBIT D AIR COMPTEUR TOTALISATEUR COMPTEUR TOTALISATEUR CORDON NOIR BRACELET ANTISTATIQUE MICRORUPTEUR ROTATIF COMMUTATEUR ANTIVANDALE COMMUTATEUR POUSSOIR COMMUTATEUR POUSSOIR PLAQUETTE TO92 PLAQUETTE TO18 KIT D´ISOLATION RUBAN ADHESIF SCOTCH MAGIC 25MMX66M DISPLAY MOUNT,3M,400ML SPXO,100MHZ,SMD NOTE BOOK,RULED,WIREBOUND,A4 NOTE BOOK,RU+INDEX,W/BOUND,A6 NOTE BOOK,RU+PERF,WIREBOUND,A4 NOTE BOOK,RU+PERF,WIREBOUND,A5 NOTE BOOK,RULED,CASEBOUND,A5 NOTE BOOK,PLAIN,CASEBOUND,A7 TERMINAL,COMPRESSION LUG,5/16,CRIMP,8AWG TERMINAL,RING TONGUE,#6,CRIMP CABLE TIES,4IN L,NYLON,STRGTH 18LB,NAT PROXIMITY SENSOR MERCURY DISP CONTACTOR DPST-NO 24VDC 20A TERMINAL,RING TONGUE,1/4IN,CRIMP,RED GAS DISCHARGE TUBE,260V,2 ELECT GAS DISCHARGE TUBE,300V,2 ELECT SENSOR MODULE AMPLIFIER POLYCARBONATE AXXIS 5X1250X610 IC,CURRENT MODE PWM,10V,8-SOIC TAPE,18MM,BLACK/YELLOW,S/ADH TAPE,6MM,BLACK/WHITE,FLEXIBLE TAPE,9MM,BLACK/WHITE,FLEXIBLE TAPE,18MM,BLACK/WHITE,FLEXIBLE TAPE,12MM,BLACK/YELLOW,FLEXIBLE TAPE,24MM,BLACK/YELLOW,FLEXIBLE PINCES CROCODILES POUR ATLAS LCR40 ZENER DIODE,3W,3.3V,DO-214AC ZENER DIODE,3W,5.1V,DO-214AC BATTERIE 12V 24AH BATTERIE 12V 38AH PRINTASOLVE 400ML AEROSOL SOLVANT ELECTRONIQUE NET.200ML RESINE D´ENCAPSULATION POLYURETHAN 250G EMBASE SIL COUDEE DOREE 32 VOIES WIPES,PRINTCLENE,PK25 EMBASE DIL COUDEE 32 VOIES MICRORUPTEUR PLONGEUR MICRORUPTEUR LEVIER MICRORUPTEUR LEVIER LONG MICRORUPTEUR LEVIER GALET COMMUTATEUR A BASCULE DPST NOIR I/O COMMUT A BASCULE DPST ILLUM ROUGE I/O COMMUTATEUR A BASCULE DPST ILLUM VERT SPXO,40MHZ,SMD AC-DC CONV,DIN RAIL,1 O/P,7.5W,300mA,24V WIRE-BOARD CONNECTOR RECEPTACLE,8POS,2.54MM IC,ADC,16BIT,128SPS,SOT-23-6 LIMIT SWITCH,TOP ROLLER PLUNGER,SPDT ZENER DIODE,1W,12V,AXIAL ROUND SKIRTED KNOB,6.35MM MICRO SWITCH,PIN PLUNGER,SPDT 25A 277V CONNECTOR,POWER ENTRY,SOCKET 15A SPRING CONTACT PROBE,PCB TERMINAL,RING,#10,CRIMP,14-10AWG CABLE TIE ENCLOSURE,BOX,PLASTIC,GRAY KIT D´ISOLATION SAC ANTISTATIQUE 100X150 CARTOUCHE ENCRE HP NOIRE SAC ANTISTATIQUE 400X450 SAC ANTISTATIQUE 400X500 INDICATEUR DE TEMP. PQ10 DISSIPATEUR THERMIQUE LAMP,REPLACEMENT CROCHET DE TEST POINTE DE TOUCHE CORDON DE MESURE CORDON DE MESURE CORDON DE MESURE CORDON DE MESURE CORDON DE MESURE INDUCTANCE 14UH PCB,Punchboard,No Clad,Pattern-Q INDUCTANCE INDUCTANCE FASTENERS,NUTS MOUNTING BRACKET TURRET HEAD M22520/1-02 88F4551 EMBASE IDC 10 VOIES EMBASE IDC 14 VOIES EMBASE IDC 16 VOIES EMBASE IDC 20 VOIES EMBASE IDC 34 VOIES EMBASE IDC 50 VOIES EMBASE IDC 60 VOIES COFFRET ALUMINIUM COFFRET ALUMINIUM DISSIPATEUR THERMIQUE CLIP POUR DISSIPATEURS COFFRET GRP LED PANEL INDICATOR FUSIBLE F50MA FUSIBLE F250MA FUSIBLE F500MA CAPACITOR ALUM ELEC 10UF,25V,20%,AXIAL FUSIBLE F1.6A FUSIBLE F3.15A FUSIBLE TEMPORISE 125MA FUSIBLE TEMPORISE 630MA FUSIBLE TEMPORISE 800MA DPM THERMOMETRE TEMPERATURE CONTROLEUR PT100 THERMOMETRE DPM PT100 DIODE DE SUPPRESSION 9V BOITIER 0603 DIODE DE SUPPRESSION 16V BOITIER 0603 DIODE DE SUPPRESSION 16V BOITIER 0603 DIODE DE SUPPRESSION 5.6V BOITIER 0603 DIODE DE SUPPRESSION 5.6V BOITIER 0603 DETECTEUR DE PROXIMITE DETECTEUR DE PROXIMITE BLOC DE JONCTION NOIR SUPPORT DE LAMPE ENCLIQUETABLE SUPPORT DE LAMPE T12 PRESSABLE SUPPORT DE STARTER A VISSER COFFRET POUR DISJONCTEUR GV2-M BOITIER COUVERCLE GRIS 254X180X111 BOITIER COUVERCLE FUME 180X110X90 BOITIER COUVERCLE FUME 182X180X111 BOITIER COUVERCLE FUME 254X180X111 PLAQUE DE MONTAGE 90X90 PLAQUE DE MONTAGE 150X90 PLAQUE DE MONTAGE 331X220 COFFRET DIN MODULAIRE 110X180X110 COFFRET DIN MODULAIRE 254X180X110 COFFRET ADAPT. SECTEUR COFFRET ELECTRIQUE 13A COFFRET ELECTRIQUE 13A DETECTEUR PHOTOELECTRIQUE DETECTEUR PHOTOELECTRIQUE DETECTEUR DE PROXIMITE DETECTEUR DE PROXIMITE DETECTEUR DE PROXIMITE BOITIER MALE 12P EMBASE FEMELLE 12P EMBASE FEMELLE 35P CORPS D´EMBASE TAPE,2 SIDED,FABRIC,PRECUT CAPACITOR CERAMIC 820PF 500V,C0G,10%,1206 Ceramic chip capacitor,1000 pF,500 VDC COFFRET ART 110 VERSION 4 COFFRET POUR PILES CONSOLE COMTEC 150F BOITIER. SMART XS BOITIER. SMART XS BOITIER. SMART L BOITIER. SMART XL COFFRET UNIMET VERSION 2 KIT DE MONTAGE CI UNIMET COFFRET UNIDESK VERSION M200 COFFRET ALUCASE AC 090 COFFRET ALUCASE AC 092 COFFRET ALUCASE ACF 132 COFFRET ALUCASE AC 150 COFFRET ALUCASE ACF 152 BOITIER. ABS CH-4 BOITIER. ABS CH-6 BOITIER. ABS CH-8 BOITIER. ABS CH-8 BOITIER. ABS H-45 BOITIER. ABS H-65 LUBRICANT,375ML,AEROSOL CLOU M2.5X22 PQ250 DIODE,STANDARD,1A,200V,DO-41 FLASQUE D´EXTREMITE GRIS 2.5MM CARTE DE REPERAGE 1-50 (X2) HORIZONTALE INDUCTIVE PROXIMITY SENSOR,3MM,12VDC TO 24VDC ISOLATEUR 3P 25A Ceramic chip capacitor,22 uF,10 VDC,c CERAMIC CHIP CAPACITOR,10 UF,6.3 VDC WIRE-BOARD CONNECTOR,MALE,3POS,1ROW SUPPORT DE CHAINE PORTE CABLE PQ2 SUPPORT DE CHAINE PORTE CABLE PQ2 RESISTOR,WIREWOUND,50 OHM,1W,5% RESISTOR,WIREWOUND,20 OHM,5W,5% Power Resistor BIPOLAR TRANSISTOR,PNP,-120V,TO-220 CONNECTOR CONNECTOR LED,RED,T-1 3/4 (5MM),5MCD,700NM CRYSTAL,10MHZ,16PF,SMD FUSE BLOCK,CLASS CC FUSE FUSE BLOCK,CLASS CC FUSE TERMINAL,MALE DISCONNECT,0.187IN,BLUE TERMINAL,RING TONGUE,#8,CRIMP,BLUE RESISTOR,CURRENT SENSE,0.02 OHM,15W,5% QUICK DISCONNECT CABLE,M12 4POS STRAIGHT QUICK DISCONNECT CABLE,M12,4POS,R/A QUICK DISCONNECT CABLE,M12 4POS STRAIGHT SENSOR MOUNTING BRACKET PHOTOELECTRIC SENSOR CIRCUIT PROTECTOR,HYD-MAG,1P,240V,5A CIRCUIT BREAKER,HYD-MAG,1P,250V,1A SCHOTTKY RECTIFIER,3A 20V DO-201AD Connector Dust Cap For Use With:MIL-C-38 Connector Dust Cap RESISTOR,METAL FILM,249 OHM,600mW,1% Tools,Extractors CAPACITOR CERAMIC 100PF 50V,C0G,5%,AXIAL CAPACITOR CERAMIC 1000PF 50V,C0G,5%,AXIAL MICRO SWITCH,PIN PLUNGER,SPDT 15A 250V CAPACITOR POLY FILM FILM 1UF,10%,63V, CAPACITOR TANT,10UF,50V,AXIAL 10% Wirewound Resistor Wirewound Chassis Mount LAMP,STACKABLE,IND,RYG Indicating Light - 3 Lights - D - 24V AC Indicating Light - 3 Lights - D - 24V AC MOUNTING BRACKET MOUNTING BRACKET Ceramic Multilayer Capacitor Capacitance CIRCULAR CONN,RCPT,SIZE 14S,4POS,BOX CIRCUIT BREAKER,THERMAL,1P,125V,15A CIRCUIT BREAKER,THERMAL,1P,250V,10A CIRCUIT BREAKER,THERMAL,1P,250V,25A CIRCUIT BREAKER,THERMAL,1P,250V,10A CIRCUIT BREAKER,THERMAL,1P,250V,20A CIRCULAR CONN,PLUG,SIZE 8,4POS,CABLE PIN HEADER,3POS,5.08MM MICRO SWITCH,BUTTON,SPDT,3A,250V CIRCULAR CONTACT,PIN,24-20AWG,CRIMP TERMINAL,RING TONGUE 3/4IN CRIMP YELLOW END PLATE,WDU/WDK SERIES TERMINAL BLOCK RESISTOR,METAL FILM,332 OHM,400mW,1% SHLD MULTICOND CABLE,7COND,24AWG,500FT,300V LED,RED,T-1 (3MM),12MCD,700NM CIRCUIT BREAKER,THERMAL MAG,1P,20A CIRCUIT BREAKER,THERMAL MAG,2P,15A CIRCUIT BREAKER,THERMAL MAG,2P,40A Thermal Magnetic Circuit Breaker RF/COAXIAL ADAPTER,BNC JACK-BNC JACK BRASS HEX NUT SWITCH ACCESSORY CHIP INDUCTOR,12NH 300MA 5% 2.7GHZ Male #16 Stamped and formed crimp contact 18C2418 Male #16 Stamped and formed crimp contact 18C2421 CAPACITOR ALUM ELEC 2200UF,25V,20%,AXIAL OPTOCOUPLER,PHOTOTRANSISTOR,5300VRMS TERMINAL,RING TONGUE,#10,CRIMP,BLUE ZENER DIODE,500mW,56V,DO-35 LAMP,STACKABLE,IND,RED/GRN/AMB Enclosure Switch Actuator Actuator Length:0.84´´ CIRCULAR CONNECTOR RCPT SIZE 14S,3POS,CABLE Circular Connector ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,PLASTIC,BLACK Metal Connector Backshell LAMP,INDICATOR,INCAND,WHT RESISTOR,CURRENT SENSE,1 OHM,1W,1% IC,OP-AMP,9.4MHZ,35V/ us,DIP-8 CIRCULAR CONNECTOR RCPT,SIZE 12,3POS,CABLE BARE PCB NO HOLES - PLANE SINGLE SIDED TERMINAL,RING TONGUE,#8,CRIMP,YELLOW TVS Diode TVS Diode CARD EDGE CONNECTOR,SOCKET,98POS SOFTWARE BIPOLAR TRANSISTOR,PNP,-160V IC,IF SYSTEM,DIP-16 Crimp Connector Housing CIRCUIT BREAKER,THERMAL,2P,250V,10A DIODE,PHOTO,950NM,65°,SIDE LOOKING AVALANCHE DIODE,1A,400V,SOD-57 WIRE-BOARD CONNECTOR RECEPTACLE 11POS,2.54MM WIRE-BOARD CONNECTOR RECEPTACLE 15POS,2.54MM TRANSISTOR,PHOTO,NPN,925NM,T-1 LED,YELLOW,T-1 3/4 (5MM),12MCD,594NM AVALANCHE DIODE,3A,200V,SOD-64 PLUG & SOCKET CONN,PLUG,4POS,5.08MM CIRCULAR CONNECTOR RECEPTACLE 3POS CABLE CIRCULAR CONNECTOR RECEPTACLE 7POS CABLE CIRCULAR CONNECTOR,PLUG,7POS,CABLE CIRCULAR CONNECTOR RECEPTACLE 4POS PANEL CIRCULAR CONNECTOR RECEPTACLE 6POS PANEL CIRCULAR CONNECTOR RECEPTACLE 8POS PANEL CONDENSATEUR 25V 5600UF CAPACITOR POLY FILM FILM 0.1UF 5%,630V CIRCULAR CONNECTOR RCPT,SIZE 10SL,2POS,BOX CIRCULAR CONNECTOR RCPT,SIZE 10SL,3POS,BOX CIRCULAR CONN,RCPT,SIZE 14S,5POS,BOX CIRCULAR CONN,PLUG,SIZE 14,12POS,BOX CIRCULAR CONN,PLUG,SIZE 14,18POS,BOX CIRCULAR CONN,RECEPTACLE,SIZE 8,2POS,CABLE CIRCULAR CONN,RCPT,SIZE 14,18POS,BOX CIRCULAR CONNECTOR PLUG,SIZE 14,5POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 24,61POS,CABLE CIRCULAR CONN,PLUG,SIZE 16,26POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14,12POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 14,12POS,CABLE TERMINAL,RING,#10 STUD,CRIMP,22-16AWG PROXIMITY SENSOR WIRE-BOARD CONN RECEPTACLE,5POS,2.54MM WIRE-BOARD CONNECTOR,HEADER 3POS,1ROW,3.96MM Pushbutton Switch ZENER DIODE,350mW,3.6V,SOT-23 LED,5MM,RED / GREEN,RADIAL PLUG & SOCKET HOUSING,RECEPTACLE,NYLON Multipole Connector CONNECTOR HOUSING,RECEPTACLE 10POS,2.54MM PLUG & SOCKET CONN,HEADER,16POS,4.2MM MICRO SWITCH,PIN PLUNGER,SPDT 11A 250V LED,WHITE,T-1 (3MM),2.25CD,550NM LED,BLUE,T-1 (3MM),250MCD,466NM ROUND KNOB,6.35MM CAPACITOR CERAMIC 12PF 50V,C0G,5%,080 STRAIN RELIEF COVER KIT,POLYPHENYLENE CAPACITOR CERAMIC 0.022UF 100V,X7R,10% CAPACITOR CERAMIC,0.1UF,50V,X7R,10%,1210 CAPACITOR TANT,220UF,10V,0.065 OHM,0.1,SMD ENCLOSURE,WALL MOUNT,ALUMINIUM ENCLOSURE,WALL MOUNT,ALUMINIUM STATIC PROTECTION PLUG & SOCKET CONN,HEADER,6POS,4.2MM FEMALE SCREW LOCK KIT,#4-40 POWER RELAY,DPDT,115VAC,3A,PLUG IN TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#4,CRIMP LAMP,FLUORESCENT,BI-PIN,34W GROUNDING CORD GROUNDING CORD BOARD-BOARD CONN,HEADER,36WAY,1ROW HALL EFFECT MAGNETIC SENSOR CIRCULAR CONN,RCPT,SIZE 14,12POS,BOX Terminal TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP YELLOW CONTACT,SOCKET,SOLDER TERMINAL,MALE DISCONNECT,0.25IN,BLUE TERMINAL,FEMALE DISCONNECT,0.187IN RED TERMINAL,FEMALE DISCONNECT,0.11IN,RED TERMINAL,FEMALE DISCONNECT,0.187IN RED TERMINAL,RING TONGUE,5/16IN,CRIMP CAPACITOR CERAMIC 0.033UF 100V,X7R,10%,RAD CAPACITOR CERAMIC 220PF,1000V,X5F,10%,RAD TERMINAL,RING TONGUE,#4,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP YELLOW TERMINAL,SPADE/FORK,#8,CRIMP,BLUE TERMINAL,CLOSED END SPLICE,RED TERMINAL,RING TONGUE,#6,CRIMP,BLUE TERMINAL,RING TONGUE,#10,CRIMP YELLOW TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW TERMINAL,RING TONGUE,#2,CRIMP TERMINAL,SPADE/FORK,#4,CRIMP TERMINAL,RING TONGUE,#6,CRIMP,BLUE TERMINAL,RING TONGUE,#6,CRIMP,RED SWITCH,ROCKER,DPST,10A,250V,ORANGE CONTACT,SOCKET,30-26AWG,CRIMP CIRCULAR CONNECTOR,PLUG,7POS,CABLE RESISTOR,METAL FILM,3.32KOHM,600mW,1% RESISTOR,METAL FILM,51.1 OHM,600mW,1% RESISTOR,METAL FILM,75KOHM,600mW,1% RESISTOR,METAL FILM,7.5KOHM,600mW,1% Analog/Digital Converter IC Number of Bi IC,OP-AMP,2MHZ,15V/µs,SOIC-8 IC,AUDIO PWR AMP,CLASS AB 700mW MSOP-8 ENCLOSURE,WALL MOUNT POLYCARBONATE GRAY N CHANNEL MOSFET,400V,3A TO-205AF ENCLOSURES,ACCESSORIES TERMINAL,FEMALE DISCONNECT,0.187IN BLUE TACHOMETER CIRCULAR CONNECTOR PLUG SIZE 11,13POS,CABLE SWITCH,ROCKER,DPST,10A,250V,BLACK IR EMITTER,940NM,T-1 3/4,THROUGH HOLE TERMINAL BLOCK JUMPER,10WAY RESISTOR,METAL FILM,9.09KOHM,250mW,1% STRAIGHT KEY POWER RELAY,4PDT,24VDC,6A,PLUG IN KEYCAP ENCLOSURE MULTIPURPOSE POLYCARBONATE RED MICRO SW,SPRING PLUNGER,SPDT,25A 250V WIRE-BOARD CONNECTOR RECEPTACLE,7POS,2.54MM CONTACT,PIN,30-26AWG,CRIMP CIRCULAR CONTACT,PIN,18-14AWG,CRIMP CIRCULAR CONN,RCPT,SIZE 20,17POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14S,5POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 14S,3POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 16,3POS,CABLE CIRCULAR CONN,RCPT,SIZE 12,10POS,BOX CIRCULAR CONN,RCPT,SIZE 12,3POS,BOX CIRCULAR CONN,PLUG,SIZE 16,8POS,BOX CIRCULAR CONN,RCPT,SIZE 16,8POS,BOX CIRCULAR CONN,RCPT,SIZE 18,32POS,BOX CIRCULAR CONNECTOR PLUG,SIZE 12,3POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 16,8POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 16,8POS,CABLE CIRCULAR CONN,RCPT,SIZE 10,6POS,BOX CIRCULAR CONN,RCPT,SIZE 16,26POS,BOX CIRCULAR CONN,RCPT,SIZE 16,26POS,BOX CIRCULAR CONN,RCPT,SIZE 18,32POS,BOX CIRCULAR CONN,RCPT,SIZE 20,41POS,BOX CIRCULAR CONNECTOR,PLUG,12-10P,CABLE CIRCULAR CONNECTOR PLUG,SIZE 12,3POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 16,26POS,CABLE CIRCULAR CONN,RCPT,SIZE 8,3POS,BOX CIRCULAR CONN,PLUG,SIZE 14,19POS,BOX CIRCULAR CONN,PLUG,SIZE 8,3POS,CABLE MICRO SW,ROLLER LEVER,SPDT,10.1A 250V WIRE-BOARD CONNECTOR RECEPTACLE 10POS,2.54MM RF/COAXIAL,BNC JACK,STR,50 OHM,CRIMP CAPACITOR CERAMIC 2200PF,50V,X7R,5%,0805 POWER RELAY,SPST-NO,6VDC,5A,PC BOARD PCB Relay SWITCH,ROCKER,SPST,16A,250V,BLACK SWITCH,TOGGLE,DPDT,5A,250V SWITCH,TOGGLE,SPDT,5A,250V SWITCH,TOGGLE,SPDT,5A,250V MICRO SWITCH,ROLLER LEVER,SPDT,50mA CIRCULAR CONN,RCPT,SIZE 14,18POS,BOX CIRCULAR CONN,PLUG,SIZE 14,12POS,BOX FERRITE BEAD,CYLINDRICAL CAPACITOR SILVER MICA 30PF,300V,5%,RADIAL PLUG & SOCKET CONN,HEADER,3POS,4.95MM DIP SOCKET,24POS,THROUGH HOLE CONNECTOR,IEC POWER ENTRY,SOCKET,10A CIRCULAR CONNECTOR PLUG SIZE 17,55POS,CABLE CIRCULAR CONNECTOR,RECEPTACLE,7POS,CABLE CIRCULAR CONNECTOR,RECEPTACLE,8POS,PANEL TERMINAL,BUTT SPLICE RF/COAXIAL,SHV BHD JACK,STR,SOLDER RF/COAXIAL N PLUG STR 50OHM CRIMP/SOLDER RF/COAXIAL,N JACK,STR,50 OHM,CRIMP RF/COAXIAL,N BHD JACK,STR,50 OHM CRIMP RF/COAXIAL,N PLUG,R/A,50 OHM,CRIMP RF/COAXIAL,N JACK,STR,50 OHM,CRIMP RF/COAXIAL ADAPTER,N PLUG-BNC PLUG RF/COAXIAL ADAPTER,SMA PLUG-TNC JACK BULKHEAD ADAPTER,SMA JACK-N JACK RF/COAXIAL ADAPTER,N JACK-TNC PLUG RF/COAXIAL ADAPTER,N PLUG-TNC PLUG RF/COAXIAL ADAPTER,BNC PLUG-TNC JACK RF/COAXIAL ADAPTER,BNC JACK-TNC JACK RF/COAXIAL ADAPTER,N PLUG-F JACK LIQUID LEVEL SENSOR FLOW SENSOR,0.1-5GPM,6.9BAR,6.35MM LIQUID LEVEL SENSOR LIQUID LEVEL SENSOR CABLE CLAMP/GLAND,METAL,25MM DIA,ORN SWITCH,TOGGLE,DPDT,20A,277V PLUG & SOCKET HOUSING,RECEPTACLE,NYLON PLUG & SOCKET HOUSING,RECEPTACLE,NYLON Metal Connector Backshell TERMINAL,RING TONGUE,#6,CRIMP NATURAL SIP SOCKET,4POS,THROUGH HOLE CONN,IEC POWER ENTRY MODULE,PLUG,16A Metal Film Resistor RESISTOR,METAL FILM,1.82KOHM,600mW,1% RESISTOR,METAL FILM,130 OHM,600mW,1% RESISTOR,METAL FILM,14KOHM,600mW,1% RESISTOR,METAL FILM,15KOHM,600mW,1% RESISTOR,METAL FILM,2.15KOHM,600mW,1% RESISTOR,METAL FILM,2.21KOHM,600mW,1% RESISTOR,METAL FILM,22.1KOHM,600mW,1% RESISTOR,METAL FILM,301 OHM,600mW,1% RESISTOR,METAL FILM,47.5KOHM,600mW,1 RESISTOR,METAL FILM,6.81KOHM,600mW,1 RESISTOR,METAL FILM,604 OHM,600mW,1% RESISTOR,METAL FILM,68.1 OHM,600mW,1% RESISTOR,METAL FILM,681 OHM,600mW,1% RESISTOR,METAL FILM,750 OHM,600mW,1% RESISTOR,METAL FILM,825 OHM,600mW,1% RESISTOR,METAL FILM,1.3 KOHM,1 W,5% RESISTOR,METAL FILM,1.2 OHM,1 W,5% RESISTOR,METAL FILM,150 KOHM,1 W,5% RESISTOR,METAL FILM,180 OHM,1 W,5% RESISTOR,METAL FILM,300 OHM,1 W,5% RESISTOR,METAL FILM,390 OHM,1 W,5% RESISTOR,METAL FILM,5.6 KOHM,1 W,5% RESISTOR,METAL FILM,510 OHM,1 W,5% RESISTOR,METAL FILM,560 OHM,1 W,5% RESISTOR,METAL FILM,7.5 KOHM,1 W,5% RESISTOR,METAL FILM,820 OHM,1 W,5% RESISTOR,METAL FILM,12 KOHM,2 W,5% RESISTOR,METAL FILM,120 OHM,2 W,5% RESISTOR,METAL FILM,20 KOHM,2 W,5% RESISTOR,METAL FILM,200 OHM,2 W,5% RESISTOR,METAL FILM,220 KOHM,2 W,5% RESISTOR,METAL FILM,220 OHM,2 W,5% RESISTOR,METAL FILM,24 KOHM,2 W,5% RESISTOR,METAL FILM,270 KOHM,2 W,5% RESISTOR,METAL FILM,47 KOHM,2 W,5% RESISTOR,METAL FILM,62 OHM,2 W,5% Terminal Block Pitch Spacing:0.150´´ Standard Terminal Block RESISTOR,METAL FILM,121 OHM,400mW,1% RESISTOR,METAL FILM,2KOHM,400mW,1% RESISTOR,METAL FILM,3.01KOHM,400mW,1% RESISTOR,METAL FILM,4.75KOHM,400mW,1% RESISTOR,METAL FILM,4.99KOHM,400mW,1% RESISTOR,METAL FILM,5.11KOHM,400mW,1% RESISTOR,METAL FILM,15 KOHM,3 W,5% RESISTOR,METAL FILM,150 OHM,3 W,5% RESISTOR,METAL FILM,20 OHM,3 W,5% RESISTOR,METAL FILM,220 KOHM,3 W,5% RESISTOR,METAL FILM,33 KOHM,3 W,5% RESISTOR,METAL FILM,5.1 KOHM,3 W,5% RESISTOR,METAL FILM,8.2 KOHM,3 W,5% RESISTOR,METAL FILM,820 OHM,3 W,5% RESISTOR,METAL FILM,1.21KOHM,400mW,1% RESISTOR,METAL FILM,1.3KOHM,400mW,1% RESISTOR,METAL FILM,1.5KOHM,400mW,1% RESISTOR,METAL FILM,11KOHM,400mW,1% RESISTOR,METAL FILM,110 OHM,400mW,1% RESISTOR,METAL FILM,115 OHM,400mW,1% RESISTOR,METAL FILM,12.1KOHM,400mW,1% RESISTOR,METAL FILM,133KOHM,400mW,1% RESISTOR,METAL FILM,150 OHM,400mW,1% RESISTOR,METAL FILM,165 OHM,400mW,1% RESISTOR,METAL FILM,169KOHM,400mW,1% FUSIBLE 15A HRC RESISTOR,METAL FILM,2.67KOHM,400mW,1% RESISTOR,METAL FILM,20 OHM,400mW,1% RESISTOR,METAL FILM,22.1KOHM,400mW,1% RESISTOR,METAL FILM,22.6KOHM,400mW,1 RESISTOR,METAL FILM,220 OHM,400mW,1% RESISTOR,METAL FILM,237 OHM,400mW,1% FUSIBLE 20A HRC RESISTOR,METAL FILM,24.9KOHM,400mW,1% FUSIBLE 30A HRC RESISTOR,METAL FILM,26.7KOHM,400mW,1% RESISTOR,METAL FILM,274 OHM,400mW,1% RESISTOR,METAL FILM,3.48KOHM,400mW,1% RESISTOR,METAL FILM,3.57KOHM,400mW,1% RESISTOR,METAL FILM,3.92KOHM,400mW,1% RESISTOR,METAL FILM,30.1KOHM,400mW,1% FUSIBLE 45A HRC RESISTOR,METAL FILM,38.3KOHM,400mW,1% RESISTOR,METAL FILM,392 OHM,400mW,1% RESISTOR,METAL FILM,4.02KOHM,400mW,1% RESISTOR,METAL FILM,40.2KOHM,400mW,1% RESISTOR,METAL FILM,402 OHM,400mW,1% RESISTOR,METAL FILM,47.5 OHM,400mW,1% RESISTOR,METAL FILM,5.11KOHM,400mW,1% RESISTOR,METAL FILM,5.6KOHM,400mW,1% RESISTOR,METAL FILM,51.1 OHM,400mW,1% RESISTOR,METAL FILM,511KOHM,400mW,1% RESISTOR,METAL FILM,511 OHM,400mW,1% RESISTOR,METAL FILM,52.3KOHM,400mW,1% RESISTOR,METAL FILM,562 OHM,400mW,1% RESISTOR,METAL FILM,6.19KOHM,400mW,1% RESISTOR,METAL FILM,6.65KOHM,400mW,1% RESISTOR,METAL FILM,681 OHM,400mW,1% RESISTOR,METAL FILM,750 OHM,400mW,1% RESISTOR,METAL FILM,8.66KOHM,400mW,1% RESISTOR,METAL FILM,82 OHM,400mW,1% RESISTOR,METAL FILM,825 OHM,400mW,1% RESISTOR,METAL FILM,9.53KOHM,400mW,1% RESISTOR,METAL FILM,90.9KOHM,400mW,1% RESISTOR,METAL FILM,953KOHM,400mW,1% TERMINAL,BUTT SPLICE,CRIMP,CLEAR TERMINAL,BUTT SPLICE,CRIMP,BLUE CAPACITOR TANT,1UF,15V,AXIAL 10% CABLE,COAXIAL,RG8,10AWG,50 OHM,500F ALLIGATOR CLIP ALLIGATOR CLIP CAPACITOR CERAMIC 10PF 100V,C0G,5%,AXIAL CAPACITOR CERAMIC 0.015UF 50V,X7R,10%,AXIAL CAPACITOR CERAMIC 47PF 100V,C0G,5%,AXIAL CAPACITOR CERAMIC 100PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 1000PF,50V,X7R,10%,RAD CAPACITOR CERAMIC 0.1UF,100V,X7R,10%,RAD CAPACITOR CERAMIC 150PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 1800PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 22PF 50V,C0G/NP0,5%,RAD CAPACITOR CERAMIC 22PF 100V,C0G,5%,RAD CAPACITOR CERAMIC 3300PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 390PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 47PF 50V,C0G/NP0,5%,RAD CAPACITOR CERAMIC 0.047UF,50V,X7R,10%,RAD CAPACITOR CERAMIC 560PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 680PF 50V,C0G,5%,RAD CAPACITOR ALUM ELEC 470UF,6.3V,20%,AXIAL CAPACITOR ALUM ELEC 1000UF,10V,20%,AXIAL CAPACITOR ALUM ELEC 150UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 220UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 470UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 150UF,63V,20%,AXIAL CAPACITOR ALUM ELEC 3.3UF,63V,20%,AXIAL CAPACITOR ALUM ELEC 1UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 2.2UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 68UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 330UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 22UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,25V,20%,AXIAL CAPACITOR ALUM ELEC 220UF,40V,20%,AXIAL CAPACITOR ALUM ELEC 10UF,63V,20%,AXIAL TERMINAL,RING TONGUE,#2,CRIMP,YELLOW TERMINAL CLOSED END SPLICE TWIST-ON BLUE TERMINAL,CLOSED END SPLICE TWIST-ON ORA CLOSED END SPLICE,TWIST-ON,YELLOW TRANSDUCTEUR DE PRESSION SWITCH,PUSHBUTTON,SPST-NO,3A,250V TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,SPADE/FORK,#10,CRIMP,YELLOW TERMINAL,BUTT SPLICE,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP,YELLOW TERMINAL,FEMALE DISCONNECT,0.25IN,RED TERMINAL,MALE DISCONNECT,0.187IN,RED TERMINAL,MALE DISCONNECT,0.25IN,RED TERMINAL,FEMALE DISCONNECT,0.25IN BLUE TERMINAL,MALE DISCONNECT,0.25IN,BLUE TERMINAL FEMALE DISCONNECT 0.25IN YELLOW TERMINAL,MALE DISCONNECT,0.25IN YELLOW TERMINAL,SPADE/FORK,#6,CRIMP,RED SWITCH,ROCKER,SPST,10A,250V,BLACK RESISTOR,METAL FILM,499 OHM,400mW,1% PANEL MOUNT LED LENS,GREEN,5MM SWITCH,PUSHBUTTON,SPST-NC,8A,250V SWITCH,TOGGLE,SPDT,6A,250V SWITCH,TOGGLE,DPDT,6A,250V SWITCH,TOGGLE,SPDT,20V SWITCH,TOGGLE,SPDT,6A,250V SWITCH,TOGGLE,DPDT,6A,250V SWITCH,TOGGLE,DPDT,6A,250V SWITCH,PUSHBUTTON,SPST-NO,1A,250V CAPACITOR ALUM ELEC 150UF,40V,20%,AXIAL CAPACITOR ALUM ELEC 33UF,63V,20%,AXIAL CAPACITOR ALUM ELEC 1000UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 18000UF,100V,+75,-10%,SCREW CIRCULAR CONNECTOR PLUG SIZE 23 100POS,CABLE TEST PROD WIRE,500FT 18AWG CU BLACK WIRE-BOARD CONNECTOR HEADER 2POS,2.54MM Toggle Switch ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK UNSHLD SOOW CORD 3COND 10AWG 250FT 600V EXTRACTEUR REFLECTEUR 24MMX21MM REFLECTEUR 50MM CARRE REFLECTEUR DIAMETRE 80MM ELEMENT PT100 ROND INSERT POUR STOCKAGE DE COMPOSANTS PQT D CABLE SY 3COND 0.75MM 50M INDICATEUR DE DEBIT 22 L/MIN. CONDUIT,SPLIT,20,50M CONDUIT,SPLIT,23,50M CONDUIT,LCC-2 /16,METAL,30M CONDUIT,LCC-2 /25,METAL,30M INDICATEUR DE DEBIT 30 L/MIN. CABLE LIYCY UL/CSA 3X2XAWG24 50M CONDUIT,PA 6,PG11,BLACK,50M CONDUIT,PA 6,PG21,BLACK,50M FIL LIY 0.14MM ROUGE 500M BACKSHELL,STAINLESS STEEL PINCE A SERTIR 1.5-10MM2 PINCE A SERTIR AWG 20-10 PINCE A SERTIR COAX-BNC PINCE-ETAU 8-30MM PINCE-ETAU 8-40MM PINCERS,180MM PINCERS,250MM PIPE WRENCH,TYPE S,1´´ PIPE WRENCH,TYPE S,1.5´´ PIPE WRENCH,TYPE S,2´´ NIPPERS,250MM NIPPERS,280MM SCRAPER COAXIAL CABLE STRIPPER BNC/FICHE MALE DROITE A PRESSE-ETOUPE RESISTANCE 910K PINCE A SERTIR RJ45 FUSIBLE 1100V 440MA POUR MULTIMETRE FUSIBLE 1100V 11A POUR MULTIMETRE FLUKE PHOTODIODE TRANSISTOR AMPOULE POUR MAG-LITE 2 PILES PQ2 VOYANT LUMINEUX 12V MAGNETIQUE VOYANT LUMINEUX 12V SUPPORT DE CHAINE PORTE CABLE PQ2 CONVERTISSEUR RS485 FUSE HOLDER GENERATEUR DE SIGNAUX MINILINK UK REED CAPTEUR PLASTIC BARREL 6MM NO REED CAPTEUR PLASTIC BARREL 6MM NC SENSOR,S/STEEL BARREL,M8,NC REED SENSOR,HI TEMP,FLANGE,NO,HV REED SENSOR,FLANGE,NO,HV ACTUATOR,MINI,PCB MOUNT COUVERCLE 4MM CARTE DE REPERAGE VIERGE PQT500 CARTOUCHE EPSON T0134 CARTOUCHE EPSON T0134 CARTOUCHE EPSON T0294 CARTOUCHE ENCRE EPSON CYAN CARTOUCHE EPSON T0370 CARTOUCHE ENCRE EPSON CYAN PORTE-FUSIBLE HPC CONDENSATEUR 22UF PORTE-FUSIBLE HPC PORTE-FUSIBLE HPC PORTE-FUSIBLE HPC TAPIS ANTISTATIQUE MARTEAU CUIVRE ET CUIR 1 1/2 LB MARTEAU CUIVRE ET CUIR 2LB DOUILLES JEU DE 8 METRINCH DOUILLES JEU DE 8 METRINCH PIED A COULISSE NUMERIQUE FER A SOUDER PIEZO PANNE AIGUILLE 1.0MM PANNE WPT BISEAU 2.4MM PANNE WPT SPATULE 2.0MM BUSE AIR CHAUD 1.5MM BUSE AIR CHAUD WPT 4.7MM CAPTEUR DE FLUX E/S 4-20MA SONDE A RESISTANCE DE PLATINE SONDE A RESISTANCE DE PLATINE SONDE PT100 FIN DE COURSE FIN DE COURSE FIN DE COURSE TEMPORISATEUR MULTIPRISE IEC CONTACT MALE A SOUDER PQ10 COFFRET PORTE-CLE RESPIRATEUR IMMERSIBLE COFFRET POLYESTER COFFRET POLYESTER COFFRET POLYESTER COFFRET POLYESTER SONDE GENERALE SERIE 925 ECLATEUR A GAZ 350V ECLATEUR A GAZ 230V ECLATEUR A GAZ 350V TEMPERATURE CONTROLEUR 2RELAIS TEMP CONTROLEUR RELAIS/RELAIS STATIQUE TEMPERATURE CONTROLEUR 2RELAIS CIRCUIT DE CONNEXION RS232 CIRCUIT DE CONNEXION RS485 LIMIT SWITCH,ROLLER DISSIPATEUR DE CHALEUR TERMINAL,MALE DISCONNECT,4.75MM,RED OPTOCOUPLER,TRANSISTOR,1000VRMS LARGE BASIC SWITCH SENSOR CABLE CONNECTOR LIMIT SWITCH,SIDE ROTARY,SPDT-1NO/1NC UNSEALED OI-PB SWITCH NC/NR Limit Switch-OT ULTRASONIC SENSOR MICRO SWITCH,PIN PLUNGER,SPDT 11A 277V HALL EFFECT DIGITAL POSITION SENSOR CONDENSATEUR 4700PF CONDENSATEUR 10NF CONDENSATEUR 100NF CONDENSATEUR 100NF N12 J Box,Screw Cover w/panel,12X10X5,STEEL,GRAY BOBBINS TRANSFORMER ENCLOSURE,JUNCTION BOX,STEEL,GRAY CARTRIDGE,CANON COMP,BCI-3EK+30% CARTRIDGE,CANON COMP,BCI-3EPB+30% CARTRIDGE,CANON COMP,BCI-3EPC+30% CARTRIDGE,CANON COMP,BCI-3EPM+30% CARTRIDGE,CANON COMP,BCI-6C+30% CARTRIDGE,EPSON COMP,T042340+30% CARTOUCHE ENCRE COMP. EPSON NOIRE CARTOUCHE ENCRE COMP. EPSON MAGENTA CARTOUCHE ENCRE COMP. EPSON JAUNE CARTOUCHE ENCRE COMP. EPSON CYAN CLAIR PHOTOELECTRIC SENSOR,50MM TO 2M,NPN / PNP OUTPUT SPARE BLADE,PLIERS SPARE BLADE,PLIERS SPARE BLADE,PLIERS CRIMPING DIE,EXCHANGEABLE CRIMPING DIE,EXCHANGEABLE IC-CMS-MICROPOWER SENSOR CIRCULAR CONN,RCPT,SIZE 16,8POS,BOX CIRCULAR CONNECTOR PLUG,SIZE 16,8POS,CABLE CORD RETAINING KIT,4781 & 4782 CONN FERRITE BEAD,0.0008OHM,5A ANALYSEUR DE PUISSANCE HAMEG HM8115-2 VE PISTOLET A COLLE,UK-VERSION BOITE DERIVATION POUR MOULURE RACCORDS POUR MOULURES ROUGES RACCORD COUPLAGE 16X16 TERMINAISON 40X16 FILTRE ABEI PQ8 FIXATION MASQUE PQ2 CONDUIT NYLON 16MMX10M CONDUIT NYLON 20MMX10M CONDUIT NYLON 25MMX10M Straight Plug,Solid Backshell,Circular RF/COAXIAL MCX PLUG STR 50 OHM CRIMP/SLDR THERMAL TRANSFER PRINTABLE LABELS SAFETY INTERLOCK SWITCH KEY LIMIT SWITCH,ROLLER PLUNGER,SPST ROTARY CAM SWITCH KEY OPERATED SWITCH MOUNTING COLLAR RF/COAXIAL BNC PLUG STR 50 OHM CLAMP/SLDR BULKHEAD ADAPTER,BNC JACK-BNC JACK TUBING,SLIT CORRUGATED LOOM,32.8MM,BLACK,1/EA CIRCULAR SHELL,PLUG,SZ 20 LABEL,LASER PRINTABLE,215.9X279.4MM,SILVER,POLY,25PK GASKET,12S/12 SHELL SIZE,CIRCULAR CONN GASKET,14S/14 SHELL SIZE,CIRCULAR CONN CIRCULAR SHELL RCPT,14S,AL CIRCULAR SHELL PLUG,14S,AL TELESCOPING SLIDE,19IN,STEEL CONDENSATEUR 10.0UF LED CMS ROUGE HE LED CMS ROUGE HE LED CMS VERTE LED CMS VERTE LED CMS ORANGE LED CMS ORANGE LED CMS JAUNE LED CMS JAUNE LED CMS BICOULEUR ROUGE/VERT LED CMS ROUGE HE MONTAGE INVERSE LED CMS ROUGE HE MONTAGE INVERSE LED CMS VERTE MONTAGE INVERSE LED CMS VERTE MONTAGE INVERSE RESISTOR WIREWOUND,1KOHM,250W,1% CARTE D´EVALUATIONLM5007 WEATHERPROOF COVER,PLASTIC PROTECT. SECTEUR CONTRE SURTENSION TRI Ceramic chip capacitor,.1 uF,25 VDC,c WIRE TO BOARD CONNECTOR HEADER,4POS,2ROW WIRE-BOARD CONNECTOR,MALE,2POS,1ROW RESISTOR WIREWOUND,0.47 OHM,1W,5% TERMINAL,SPADE/FORK,#6,CRIMP,YELLOW RF/COAXIAL,SMA JACK,STR,50 OHM,SOLDER FUSE BLOCK,CLASS CC FUSE Oscillator SENSOR CABLE ASSEMBLY PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR CIRCUIT PROTECTOR,HYD-MAG,1P,240V 20A GRILLE/FILTER HOLDER Terminal Wirewound Resistor Wirewound Resistor FAST DIODE,70A,800V,DO-203AB OPTOCOUPLER,TRANSISTOR,5000VRMS TACHOMETER CIRCUIT BREAKER,THERMAL,1P,250V,5A CIRCUIT BREAKER,THERMAL,1P,250V,5A N CH MOSFET,100V,3.5A,TO-205AF WIRE-BOARD CONN,HEADER,14POS,2.54MM CABLE,SHLD MULTIPR,2PR,24AWG,500FT,300V,CHR LED,GREEN,T-1 3/4 (5MM),50MCD,565NM ACTUATOR,9OZF,ZX SERIES SWITCH PHOLOELECTRIC SENSOR WIRING BASE FOR MAXI-BEAM SENSORS IC,FLOAT-PT DSP,32BIT,150MHZ LQFP-144 OPTOCOUPLER,TRANSISTOR,5000VRMS ZENER DIODE,500mW,68V,DO-35 LAMP,STACKABLE,IND,RED/GRN/AMB FUSE,30A,600V,TIME DELAY MICRO SWITCH HINGE LEVER SPDT 100mA 250V SWITCH,REED,SPDT-CO,1.5A,175VDC Low-Loss Wireless RF Transmission Coaxia TERMINAL,RING TONGUE,#10,CRIMP,BLUE TRANSISTOR,PHOTO,NPN,850NM,T-1 3/4 WIRE-BOARD CONNECTOR RECEPTACLE 18POS,2.54MM CIRCULAR CONNECTOR RECEPTACLE 5POS PANEL CAPACITOR POLY FILM 0.01UF,630V,5%,AXIAL CIRCULAR CONN,PLUG,SIZE 8,2POS,BOX CIRCULAR CONNECTOR PLUG SIZE 20,16POS,CABLE CIRCULAR CONN,RCPT,SIZE 14,15POS,BOX PLUG & SOCKET HOUSING,RECEPTACLE 11POS,2.54MM CIRCULAR CONNECTOR RCPT,SIZE 21,79POS, CAPACITOR CERAMIC 15PF 50V,C0G,0603 Plastic Connector Cover POWER RELAY,DPDT,24VAC,10A,PLUG IN ENCLOSURE,WALL MOUNT,ALUMINIUM STATIC PROTECTION WRIST GROUNDER MICRO SWITCH,PIN PLUNGER,SPDT 21A 277V CORD,KIT,COMMON POINT GROUND,10MM STD,W/1MEG 15´ PLUG & SOCKET CONNECTOR,HEADER,2POS,3 CIRCULAR CONNECTOR PLUG,SIZE 16,3POS,CABLE CIRCULAR CONN,PLUG,SIZE 14,19POS,BOX CIRCULAR CONNECTOR RCPT SIZE 12,10POS,CABLE CONDENS. 270PF Terminal TERMINAL,FEMALE DISCONNECT,0.11IN BLUE HI-TEMP POLYAMIDE TAPE,3/4´´ X 36YD CAPACITOR CERAMIC 2200PF,100V,X7R,10%,RAD CAPACITOR CERAMIC 0.047UF 100V,X7R,10%,RAD TERMINAL,RING TONGUE,#2,CRIMP TERMINAL,RING TONGUE,#6,CRIMP,BLUE TERMINAL,RING TONGUE,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,#4,CRIMP,YELLOW TERMINAL,SPADE/FORK,#8,CRIMP,RED SPADE,FLANGED,#6 STUD,CRIMP,RED,22-16AWG No description available - 5808996 MICRO SW,STRAIGHT LEVER,SPDT,11A 277V IC,PROG SHUNT V-REF,2.495V 2% SOT-89-3 CONTACT,SOCKET,26-22AWG,CRIMP ENCLOSURE,WALL MOUNT,ABS,GRAY TERMINAL BLOCK JUMPER,3WAY TERMINAL BLOCK JUMPER,4WAY MICRO SWITCH,HINGE LEVER,SPDT,3A 250V RESISTOR,METAL FILM,7.68KOHM,125mW,1% Tools,Development kit Kit Contents:Inst POWER RELAY,DPDT,24VDC,10A,PLUG IN KEYCAP DIP SOCKET,20POS,THROUGH HOLE SWITCH,ROCKER,DPST,10A,250V,BLACK SWITCH,ROCKER,SPST,16A,250V,RED CIRCULAR CONNECTOR PLUG SIZE 20,17POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 20,41POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 22,55POS,CABLE CIRCULAR CONN,RCPT,SIZE 18,32POS,BOX CIRCULAR CONN,RCPT,SIZE 22,55POS,BOX CIRCULAR CONNECTOR PLUG SIZE 22,55POS,CABLE Circular Connector CIRCULAR CONN,RCPT,SIZE 10,6POS,BOX CIRCULAR CONNECTOR PLUG,SIZE 10,6POS,CABLE UNSEALED OI-PB SWITCH TERMINAL BLOCK,BARRIER,7POS,18-10AWG MICRO SWITCH,ROLLER LEVER,SPDT 3A 250V TERMINAL,RING TONGUE,#10,CRIMP YELLOW TERMINAL,RING,#6 STUD,CRIMP,YEL,12-10AWG CUTTER,CABLE,2/0AWG Rocker Switch CONTACT,PIN,20-14AWG,CRIMP PCB,Pad/Hole (PTH) CIRCULAR CONN PLUG SIZE 13,22POS,CABLE MODULAR JACK,1 PORT MODULAR JACK,8POS,1 PORT CIRCULAR CONNECTOR RCPT,SIZE 11,13POS,WALL VARISTANCE CIRCULAR CONN PLUG SIZE 21,79POS,CABLE CIRCULAR CONN RCPT,SIZE 13,22POS,WALL SEALING BOOT RF/COAXIAL,N BHD JACK,STR,50 OHM CRIMP RF/COAXIAL N PLUG R/A 50 OHM CRIMP/SOLDER RF/COAXIAL,N PLUG,R/A,50 OHM,CRIMP LIQUID LEVEL SENSOR LIQUID LEVEL SENSOR FLOW SENSOR,0.5GPM,13.8BAR,1/2´´ NPT LIQUID LEVEL SENSOR LIQUID LEVEL SENSOR ACTUATOR,12OZF,SNAP ACTION SWITCH RF/COAXIAL,MHV PLUG,STRAIGHT,CRIMP Connector Bushing For Use With:Type NE8M RESISTOR,METAL FILM,2.74KOHM,600mW,1% RESISTOR,METAL FILM,47.5 OHM,600mW,1% RESISTOR,METAL FILM,60.4 OHM,600mW,1% RESISTOR,METAL FILM,82.5 OHM,600mW,1% RESISTOR,METAL FILM,18 KOHM,1 W,5% RESISTOR,METAL FILM,200 KOHM,1 W,5% RESISTOR,METAL FILM,910 OHM,1 W,5% RESISTOR,METAL FILM,12 OHM,2 W,5% RESISTOR,METAL FILM,91 OHM,2 W,5% RESISTOR,METAL FILM,249 OHM,400mW,1% RESISTOR,METAL FILM,274KOHM,400mW,1% RESISTOR,METAL FILM,47.5OHM,400mW,1% RESISTOR,METAL FILM,750 OHM,400mW,1% RESISTOR,METAL FILM,120 OHM,3 W,5% VARISTANCE RESISTOR,METAL FILM,3.3 KOHM,3 W,5% RESISTOR,METAL FILM,470 OHM,3 W,5% RESISTOR,METAL FILM,82 OHM,3 W,5% RESISTOR,METAL FILM,215 OHM,400mW,1% RESISTOR,METAL FILM,243 OHM,400mW,1% RESISTOR,METAL FILM,255 OHM,400mW,1% RESISTOR,METAL FILM,348 OHM,400mW,1% RESISTOR,METAL FILM,499KOHM,400mW,1% RESISTOR,METAL FILM,61.9KOHM,400mW,1% RESISTOR,METAL FILM,909 OHM,400mW,1% TERMINAL,BUTT SPLICE,CRIMP,CLEAR TERMINAL,BUTT SPLICE,CRIMP,RED TERMINAL,BUTT SPLICE,CRIMP,BLUE CONN,HOSPITAL GRADE PWR ENTRY,RCPT 15A AUDIO/VIDEO CABLE,12FT,26AWG,GRAY CAPACITOR CERAMIC 0.01UF,100V,X7R,10%,RAD CAPACITOR CERAMIC 0.1UF,50V,Y5V,+80,-20%,RAD CAPACITOR CERAMIC,1UF,25V,Y5V,+80,-20%,RADIAL CAPACITOR CERAMIC 470PF 50V,C0G,5%,RAD CAPACITOR ALUM ELEC 22UF,100V,20%,AXIAL RESISTOR,THIN FILM,33KOHM,125mW,0.1% TAPE,FOIL SHIELD,ALUM,SILVER 3INX60YD TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE TERMINAL,SPADE/FORK,#8,CRIMP,BLUE TERMINAL,FEMALE DISCONNECT,0.25IN BLUE TERMINAL,SPADE/FORK,#8,CRIMP,RED SWITCH,PUSHBUTTON,SPST-NC,8A,250V SWITCH,PUSHBUTTON,SPST-NO,8A,250V SWITCH,PUSHBUTTON,SPST-NC,8A,250V SWITCH,TOGGLE,DPDT,15A,250V PROTECTIVE COVER ZENER DIODE,1.3W,47V,DO-41 STRAIGHT ISOLATION TRANSFORMER MINI CLAVIER KIT ADAPTATEUR BASIC KIT ADAPTATEUR AVANCE SONDE DIFFERENTIELLE 15MHZ SONDE DE COURANT 500A 2MHZ SONDE DE COURANT 150A 10MHZ SONDE DE COURANT 30A 50MHZ CABLE TYPE 8777 100M MINI CONTACTEUR MINI CONTACTEUR COFFRET ALUMINIUM ETANCHE PLAQUE DE MONTAGE CAPOT 3 VOIES CAPOT CONNECTEUR 7V BARETTE MTA 20V BARETTE MTA 2V BARETTE MTA 8V BARETTE MTA 4V BARETTE MTA 5V CAPOT CONNECTEUR 2V BARETTE MTA 7V BARETTE MTA 8V BARETTE MTA 2V OUTIL POUR MTA 3.96MM CAPOT 10 VOIES PINCE A BECS PLATS MANCHON BLANC PQ250 MANCHON BLANC PQ250 MANCHON BLANC PQ250 MANCHON BLANC PQ250 MANCHON JAUNE PQ250 MANCHON JAUNE PQ250 MANCHON JAUNE PQ250 MANCHON JAUNE PQ250 MANCHON JAUNE PQ250 CLEF REGLABLE ERGO 12´´ PANNE 3MM POUR SPI41 BOUCHON ANTI-BRUITS 5PR CONTACT MALE A SOUDER OUTIL A SERTIR SERIES 2 CABLE 9913F 30M BOUTON POUSSOIR BOUTON POUSSOIR COMMUTATEUR BOUTON POUSSOIR BLOC CONTACT 1N/O BLOC CONTACT 1N/O+1N/F DISSIPATEUR TO220-TO3P BOITE ANTISTATIQUE BOITE ANTISTATIQUE BOITE ANTISTATIQUE BOITE ANTISTATIQUE FUSIBLE REARMABLE FUSIBLE REARMABLE 15A RELAIS SECURITE 2NO. 24VAC/DC CONVERTISSEUR DC/DC 10W5V/2A TERMINAL,RING TONGUE,#10,CRIMP,RED CONTACT,PIN,28-24AWG,CRIMP ZENER DIODE,5W,18V,AXIAL CONTACT,PIN,28-24AWG,CRIMP BATTERY CHARGER,9V TAPE,BLACK/GREEN,9MM TAPE,BLUE/WHITE,9MM TAPE,RED/WHITE,18MM TAPE,BLACK/WHITE,18MM MULTIMETRE DE TABLE REED PROXIMITE COMMUTATEUR REED PROXIMITE COMMUTATEUR REED PROXIMITE COMMUTATEUR REED PROXIMITE COMMUTATEUR WIRE STRIPPER,METRIC PINCE 7 EN 1 CISEAUX FIL DE SOUDURE CRYSTAL 400. 0.71MM. 250G FER A SOUDER CABLE PVC FER A SOUDER CABLE SIL FER A SOUDER CABLE PVC 24V FER A SOUDER CABLE PVC FER A SOUDER CABLE PVC 24V PAPIER OXYDE ALUMINIUM 120G PQ50 PAPIER OXYDE ALUMINIUM PETIT ASSTD PQ15 BOITE A COMPARTIMENTS BOITE A OUTILS BANDOULIERE FIL FLEXIVOLT-2V VERT FIL FLEXIVOLT-2V JAUNE FIL FLEXIVOLT-2V JAUNE CLIP NOIR POUR 5-6MM PQ100 CLIP NOIR POUR 6-7MM PQ100 CLIP NOIR POUR 7-8MM PQ100 BOITIER LIBRE 1.25MM 5P TRANSDUCTEUR DE PRESSION CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF FACE AVANT POUR 616722 FACE AVANT POUR 616734 FICHE. LIBRE. 4 VOIES FICHE. LIBRE. 6 VOIES FICHE. LIBRE. 10 VOIES FICHE. BRIDE. 4 VOIES EMBASE. BRIDE. 4 VOIES EMBASE. BRIDE. 10 VOIES CRIMP TOOL,HAND,PIN & SOCKET CONTACTS LENTILLE RONDE VERTE CIRCULAR CONNECTOR RCPT,SIZE 10,6POS,CABLE ARRET URGENCE ANTI FAUSS MANOEUVRE OUTIL DE MONTAGE LENTILLE VERTE LED LENTILLE JAUNE LENTILLE BLANCHE LENTILLE VERTE LED LENTILLE BLANCHE LENTILLE BLANCHE MICRORUPTEUR MICRORUPTEUR INTERRUPTEUR HORAIRE 7 JOURS K-BIN 300X100 PK 50 RELAIS CI 12VCC ENCLOSURES,ACCESSORIES MOUNTING KIT FOR QLINE ENCLOSURE BOOK,ELECT COMP REL LED CMS ROUGE EN TUBE RESEAU DE 3 LED ROUGE RESEAU DE LED COUDE ROUGE 3MM RESEAU DE LED COUDE ROUGE 5MM EMBASE MALE 7V MICRORUPTEUR MICRORUPTEUR EMBASE FEMELLE 7V FICHE MALE 7V ANTISTATIQUE FC 200ML AEROSOL FICHE MALE 4V DISQUE EN FIBRE 60G 100X16 PQ25 DISQUE EN FIBRE 120G 115X22 PQ25 TAMPON DE SUPPORT 115X22 DISQUE ABRASIF EN CERAMIQUE 180X22 60G KIT TOURNEVIS 12 PIECES MODULE SANDVIK BAHCO´´ERGO´´-3 PIECE MODULE ECONOMIQUE-ACIER FORGE TOURNEVIS JEU ESD PZD/PLN CISEAUX 205MM MARTEAU MARTEAU MARTEAU MARTEAU MARTEAU SCIE BOIS POUR CUTTER FER A SOUDER 50W FER A SOUDER 15W FER A SOUDER 230V PVC CABLE UK FER A SOUDER 230V PVC CABLE UK FER A SOUDER CABLE PVC UK 230V FER A SOUDER 230VAC KIT FER A SOUDER 230V 15W KIT FER A SOUDER 17W 230V UK KIT FER A SOUDER 230V 17W SOUDURE ARAX 96S 1.63MM 500G GREASE GUN HOSE,FLEXI HOSE,FLEXI COUPLER,4JAW DISPENSER,LIQUID,PRECISION TOURNEVIS 40XT6 TORX TOURNEVIS 40XT7 TORX TOURNEVIS 50XT9 TORX BOITIER POUR CONTACT A SERTIR 2 V BOITIER POUR CONTACT A SERTIR 3 V LOGICIEL POUR PIC16 AXIAL FAN,119MM x 119MM x 32MM,230V,51dBA CORD STRAIN RELIEF CONNECTOR,STR,NYLON,12.7MM -1/2IN I/O MODULE RESISTOR,METAL FILM,22KOHM,250mW,1% TERMINAL,COMPRESSION LUG,5/16,CRIMP,4AWG POWER RELAY,3PDT,125VDC,10A,PLUG IN CERAMIC CHIP CAPACITOR,2.2 UF,25 VDC CERAMIC CHIP CAPACITOR,22 PF,3000 VDC CERAMIC CHIP CAPACITOR,27 PF,3000 VDC CERAMIC CHIP CAPACITOR,100 PF,50 VDC CERAMIC CHIP CAPACITOR,1000 PF,50 VDC CERAMIC CHIP CAPACITOR,4700 PF,50 VDC CERAMIC CHIP CAPACITOR,100 PF,50 VDC Ceramic chip capacitor,4700 pF,500 VDC Ceramic chip capacitor,.047 uF,500 VDC CERAMIC CHIP CAPACITOR,.47 UF,6.3 VDC TERMINAL,RING TONGUE,#2,CRIMP PCB SHORTING LINK,2WAY,6.35MM Connector Number of Contacts:8 WIRE TO BOARD CONNECTOR HEADER,10POS,2ROW BOARD-BOARD CONNECTOR HEADER 12WAY,2ROW Datamate PC Tail Connector RESISTOR,WIREWOUND,10 OHM,1W,5% RESISTOR,WIREWOUND,240 OHM,1W,5% RESISTOR,WIREWOUND,30 OHM,1W,5% RESISTOR,WIREWOUND,4.7 OHM,1W,5% RESISTOR,WIREWOUND,5 OHM,1W,5% RESISTOR,WIREWOUND,750 OHM,1W,5% Wirewound Resistor RESISTOR,WIREWOUND,0.1 OHM,3W,5% Wirewound Resistor RESISTOR,WIREWOUND,10 OHM,3W,5% RESISTOR,WIREWOUND,100 OHM,3W,5% RESISTOR,WIREWOUND,120 OHM,3W,5% RESISTOR,WIREWOUND,2KOHM,3W,5% Wirewound Resistor RESISTOR,WIREWOUND,360 OHM,3W,5% Wirewound Resistor RESISTOR,WIREWOUND,4.7 OHM,3W,5% Power Resistor RESISTOR,WIREWOUND,12 OHM,5W,5% RESISTOR,WIREWOUND,180 OHM,5W,5% RESISTOR WIREWOUND,3.9KOHM,5W,5% RESISTOR,WIREWOUND,3 OHM,5W,5% RESISTOR,WIREWOUND,3.9OHM,5W,5% RESISTOR,WIREWOUND,30 OHM,5W,5% RESISTOR,WIREWOUND,39 OHM,5W,5% RESISTOR WIREWOUND,4.7KOHM,5W,5% RESISTOR,WIREWOUND,5 OHM,5W,5% RESISTOR WIREWOUND,6.8KOHM,5W,5% RESISTOR,WIREWOUND,82 OHM,5W,5% RESISTOR,WIREWOUND,10OHM,7W,5% RESISTOR WIREWOUND,6.2KOHM,7W,5% PINCE A SERTIR High Current Inductor High Current Inductor High Current Inductor Standard D-Subminiature Connector Power Resistor STRAIN RELIEF,14WAY CIRCUIT BREAKER,THERMAL,1P,250V,5A SPXO,10MHZ,SMD CRYSTAL,18.432MHZ,20PF,SMD CRYSTAL,12MHZ,16PF,SMD RF/COAXIAL ADAPTER,N JACK-7/16 DIN PLUG FUSE BLOCK,CLASS CC FUSE FUSE HOLDER Switch Knob Alphanumeric LED Display Panel FERRITE BEAD,0.2OHM,300mA,0805 FERRITE CORE,CYLINDRICAL Thick Film Resistor Series:MP900 RESISTOR,CURRENT SENSE,5KOHM,25W,1% LOOP POWERED METER SAFETY RELAY,2NO,24VDC,6A QUICK DISCONNECT CABLE,M12,4POS,R/A PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR SCREENCLENS Photoelectric Sensor KIT DE NETTOYAGE PHOTOELECTRIC SENSOR POWER RELAY,SPDT,12VDC,10A,PC BOARD CHIFFONS DE NETTOYAGE SWITCH,SAFETY INTERLOCK,2NC/1NO,10A SENSOR MOUNTING BRACKET PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR CAPACITANCE:18000PF CAPACITOR PP FILM 0.047UF,400V,5%,RADIAL CAPACITOR CERAMIC 1500PF,50V,X7R,10%,0402 CAPACITOR CERAMIC 47PF 50V,C0G,5%,0402 CAPACITOR CERAMIC,680PF,50V,X7R,10%,0402 CIRCUIT BREAKER,HYD-MAG,1P,125V,10A CIRCUIT BREAKER,HYD-MAG,1P,250V,2A CIRCUIT BREAKER,HYD-MAG,1P,250V,10A SHLD MULTIPR CABLE 10PR 100FT 300V CHR TRIMMER,POTENTIOMETER,5KOHM 12TURN THRU HOLE TRIMMER,POT 10KOHM 22TURN Panel Cermet Potentiometer Resistance Toleranc CIRCUIT BREAKER,HYD-MAG,1P,240V,20A CIRCUIT BREAKER,HYD-MAG,1P,240V,5A UNSHLD SOOW CORD 2COND 12AWG 250FT 600V TRIMMER,POTENTIOMETER,5KOHM 25TURN THRU HOLE TRIMMER,POTENTIOMETER,100KOHM 12TURN THRU HOLE TRIMMER,POTENTIOMETER,100 OHM 12TURN THRU HOLE TRIMMER,POTENTIOMETER,500 OHM 12TURN THRU HOLE POT,COND PLASTIC,5MOHM,20%,2W PLUG DUST CAP Proximity Sensor Proximity Sensor Input LIMIT SWITCH CONNECTEUR BORD DE CARTE 20 VOIES CONNECTEUR DIP 20V CONNECTEUR DIP 34V CONNECTEUR DIP 64V HE10 FEMELLE 14V ST FIBER OPTIC CONNECTOR 62.5/125?M MULTIMODE MODULAR BATTERY CONTACT,2 WAY,3A Lamps,Indicator Leaded Process Compatib TERMINAL,RING TONGUE,1/2IN,CRIMP TERMINAL,RING TONGUE,#10,CRIMP FERRITE CORE,CYLINDRICAL,220 OHM/100MHZ,300MHZ CONDENSATEUR SERIES:101 Hook-Up Wire Number of Conductors:1 ENCLOSURES,ACCESSORIES ENCLOSURE,JUNCTION BOX,STEEL,GRAY HOLE SEAL,STEEL,22MM HOLE SEAL,STAINLESS STEEL,27MM ENCLOSURE,WALL MOUNT,STEEL,GRAY EMBASE SIL 18V STAINLESS STEEL MOUNTING BRACKET KIT EMBASE SIL 8V EMBASE SIL 14V Wirewound Resistor Thick Film Resistor Series:HD Thick Film Resistor Series:HD Wirewound Resistor Series:PV Wirewound Resistor Wirewound Resistor Series:200 CAT5E RJ45 MODULAR JACK,8POS,1 PORT EMBASE MALE SUB-D COUDEE PLAST. 9 V EMBASE FEM. SUB-D COUDEE PLAST. 9 V EMBASE FEM. SUB-D COUDEE PLAST. 25 V DIODE MODULE,600V,70A,D-55 IC,PRECISION COMP,DUAL,1.3 uS,SOIC-8 LAMP,INCANDESCENT,BI PIN,12V TERMINAL,WIDE ROLL EYELET,0.07IN,THD TERMINAL,RING TONGUE,#8,CRIMP NATURAL LAMP,STACKABLE,INDICATOR,RED Indicating Light - 1 Light - D - 24V AC/ Indicating Light - 2 Lights - P - 24V AC LAMP STACKABLE IND RED/YEL/GRN/BLUE LAMP,STACKABLE,IND,RYG Super Slim Indicating Light - 3 Lights - Super Slim Indicating Light - 3 Lights - TERMINAL,MALE DISCONNECT,0.187IN,RED HOOK & LOOP FASTENER,203.2MM PERFORATED WIRE-BOARD CONNECTOR HEADER 8POS,2.54MM Ceramic Multilayer Capacitor HEAT SINK FEMALE SCREW LOCK KIT,#4-40 Switch Knob CIRCUIT BREAKER,THERMAL,1P,125V,10A CIRCUIT BREAKER,THERMAL,1P,125V,20A CIRCUIT BREAKER,THERMAL,1P,125V,5A CIRCUIT BREAKER,THERMAL,1P,250V,15A MICRO SWITCH PIN PLUNGER SPDT 100mA 250V POWER RELAY,6PDT,115VAC,3A,PLUG IN CIRCUIT BREAKER,THERMAL,2P,250V,20A POWER RELAY,SPDT,24VDC,30A,FLANGE CAPACITOR TANT,1UF,20V,AXIAL 10% HF INDUCTOR,470NH 150MA 10% 160MHZ N CH MOSFET,500V,12A,TO-204AA IC,SINGLE INVERTER,SOT-353-5 Pin Header Number of Contacts:10 PIN HEADER,6POS,3.5MM Standard Terminal Block TURNS COUNTING DIAL,20,6.35MM Terminal Block Number of Positions:10 Circular Connector Body Material:Metal CONTACT,MALE,20-16AWG,CRIMP CONTACT,RECEPTACLE,20-16AWG,CRIMP CONNECTOR CONTACT,PIN,CRIMP CONTACT BLOCK,1NO/1NC,10A,SCREW/CLAMP CAPACITOR ALUM ELEC 100UF,450V,20%,SNAP-IN CARD EJECTOR HEAT SINK IC-AUDIO DIGITAL FILTER CONVERTISSEUR N/A AUDIO CIRCULAR CONN PLUG SIZE 25 128POS,CABLE TERMINAL BLOCK,DIN RAIL,4POS,22-12AWG TERMINAL,RING TONGUE,#10,CRIMP TERMINAL,RING TONGUE,3/8IN,CRIMP TERMINAL,RING TONGUE,#4,CRIMP,RED CONNECTOR,HOUSING,PLUG,16POS,CABLE Jumper TAPE,SPLICING,RUBBER,BLACK 25MMX9.1MM MULTICONDUCTOR DATA CABLE,6 CONDUCTORS CABLE,COAXIAL,UNJKTED,RG405/U,24AWG,50FT,TIN BRD #18 GIFHDLDPE DBSH PVC Hook-Up Wire Conductor Size AWG:18 Hook-Up Wire #18GIFHDLDPE SH FS FRPVC HOOK-UP WIRE,250FT,8AWG,CU,BLACK Single inlet blower,centrifugal,AC mot LED,RED,T-1 3/4 (5MM),18MCD,700NM LED,RED,T-1 3/4 (5MM),150MCD,625NM POWER RELAY DPST-NO/NC,24V,25A BRACKET POWER RELAY,4PST-NO,24VDC,25A BRACKET TERMINAL,RING TONGUE,3/8IN,CRIMP BLUE TERMINAL,RING TONGUE,#4,CRIMP,RED CIRCUIT BREAKER,THERMAL MAG,2P,15A CIRCUIT BREAKER,THERMAL MAG,3P,10A MOUNTING BRACKET CIRCUIT BREAKER,THERMAL MAG,1P,25A CIRCUIT BREAKER,THERMAL MAG,1P,60A CIRCUIT BREAKER,THERMAL MAG,2P,60A SWITCH ACTUATOR RELAY SOCKET 300 VAC 7AMP TYPE R Long Nose Keying Plug For Use With:AMP S MICRO SWITCH,HINGE LEVER,SPDT,5A 250V MICRO SWITCH,HINGE LEVER,SPDT 15A 250V SWITCH,PUSHBUTTON,SPST-NO,10A,400V SWITCH,PUSHBUTTON,SPST-NO,10A,400V POWER RELAY,3PDT,240VAC,15A,PLUG IN TERMINAL,RING TONGUE,#10,CRIMP TERMINA,PARALLEL SPLICE,CRIMP,BRASS,22-18AWG Replacement Keys (2) ROTARY CAM SWITCH Female #16 Stamped and formed crimp contact 18C2411 SHLD MULTICOND CABLE,6COND,22AWG,500FT,300V TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW SWITCH,SLIDE,SPDT,20V,THROUGH HOLE 1624R CMR 4P24 RED 1000 SIB MEASURING,WIRE GAUGE,WIRE GAUGE,U.S. SHLD MULTICOND CABLE,2COND,16AWG,500FT,300V CABLE,SHLD MULTICOND,2COND,18AWG,500FT,300V CABLE,SHLD MULTICOND,4COND,18AWG,1000FT,300V CABLE,SHLD MULTICOND,4COND,18AWG,500FT,300V SHLD MULTICOND CABLE,6COND,18AWG,500FT,300V CABLE,SHLD MULTICOND,6COND,18AWG,500FT,300V Multiconductor Cable SHLD MULTICOND CABLE,2COND,20AWG,500FT,300V SHLD MULTICOND CABLE,4COND,22AWG,1000FT,300V CABLE,SHLD MULTICOND,4COND,22AWG,500FT,300V 8 #22 PVC FRPVC SHLD MULTIPR CABLE 3PR 1000FT 300V GRY Multiconductor Cable Shielded Multiconductor Cable Total Numb RF/COAXIAL SMA PLUG STR 50 OHM CRIMP/SLDR TOOLS,CRIMP MICRO SW,STRAIGHT LEVER,SPDT,20A 480V TERMINAL,RING TONGUE,#10,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP YELLOW CONNECTOR CONTACT,SOCKET,CRIMP ZENER DIODE,500mW,10V,SOD-80 ZENER DIODE,500mW,12V,SOD-80 ZENER DIODE,500mW,18V,SOD-80 ZENER DIODE,500mW,3.9V,SOD-80 Zener Diode ZENER DIODE,500mW,10V,DO-35 ZENER DIODE,500mW,11V,DO-35 ZENER DIODE,500mW,36V,DO-35 ZENER DIODE,1.3W,16V,DO-41 ZENER DIODE,1.3W,27V,DO-41 ZENER DIODE,1.3W,33V,DO-41 ZENER DIODE,1.3W,75V,DO-41 SAFETY CONTROL MODULE,250VAC/VDC,6A Zener Diode Package/Case:SOD-323 OPTOCOUPLER,TRANSISTOR,5300VRMS OPTOCOUPLER,PHOTO DARLINGTON,5300VRMS OPTOCOUPLER,TRANSISTOR,3000VRMS OPTOCOuPLER OPTOCOuPLER OuTPuT TyPE:TRAN OPTOCOUPLER,PHOTOTRIAC,5300VRMS,6-DIP OPTOCOUPLER,TRANSISTOR,5000VRMS OPTOCOUPLER,PHOTOTRANSISTOR,5000VRMS Schottky Rectifer Package/Case:MiniMELF PHOTOELECTRIC SENSOR,LOGIC MODULE ON-OFF LOGIC MODULE PHOTOELECTRIC SENSOR SENSOR CABLE AMPLIFIER FOR SP100 SERIES SENSORS PHOTOELECTRIC SENSOR SENSOR CABLE ASSEMBLY PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR PHOTOELECTRIC SENSOR CIRCUIT LOGIQUE SERIE 74LVX CMS OPTOCOUPLER,TRANSISTOR,5300VRMS OPTOCOUPLER,TRANSISTOR,5300VRMS Optocoupler OPTOCOUPLER,TRANSISTOR,3000VRMS 300 MA EXTREMELY LOW NOISE LOW DROP OUT 300 MA EXTREMELY LOW NOISE LOW DROP OUT 300 MA EXTREMELY LOW NOISE LOW DROP OUT 300 MA EXTREMELY LOW NOISE LOW DROP OUT 300 MA LOW NOISE POK LOW DROP OUT REGULA 300 MA LOW NOISE POK LOW DROP OUT REGULA 300 MA LOW NOISE POK LOW DROP OUT REGULA 300 MA LOW NOISE POK LOW DROP OUT REGULA SMA915F SCANNER W/RELAY Zener Diode OPTICAL SENSOR,380MM,SCR OPTICAL SENSOR,0MM to 380MM,SCR OPTICAL SENSOR,5M,SCR SM31RLMHS MINIBEAM SCAN BOARD-BOARD CONNECTOR HEADER,8WAY,2ROW TERMINAL,RING TONGUE 5/16IN,CRIMP BLUE IC,NON INVERTING BUFFER,USB-20 HERMAPHRODITIC COVER,THERMOPLASTIC Multipole Connector OPTOCOUPLER,PHOTOTRANSISTOR,3750VRMS OPTOCOUPLER,PHOTOTRANSISTOR,3750VRMS OPTOCOUPLER,PHOTOTRANSISTOR,5000VRMS OPTOCOUPLER,TRANSISTOR,5000VRMS OPTOCOUPLER,TRANSISTOR,5000VRMS ZENER DIODE,500mW,3.3V,SOD-80 ZENER DIODE,1W,4.7V,DO-213 ZENER DIODE,1W,5.1V,DO-213 ZENER DIODE,1W,6.8V,DO-213 ZENER DIODE,1W,12V,DO-213 LAMP,STACKABLE,IND,RED/GRN/AMB OPTOCOUPLER,TRANSISTOR,5300VRMS OPTOCOUPLER FERRITE CORE,CYLINDRICAL,110 OHM/100MHZ,300MHZ TERMINAL,RING TONGUE,1/4IN,CRIMP,RED POWER RELAY,DPDT,12VDC,8A,PC BOARD MICRO SWITCH,PIN PLUNGER,SPDT,1A 125V Limit Switch-OT LARGE BASICS BASIC SWITCH,STRAIGHT LEVER,SPDT,15A, SWITCH CAP Limit Switch CIRCULAR CONNECTOR RCPT,SIZE 14S,4POS,WALL CIRCULAR CONN,RCPT,SIZE 18,7POS,BOX CONTACT,SOCKET,30-26AWG,CRIMP POWER RELAY,SPDT,5VDC,10A,PC BOARD ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,ALUMINIUM,GRAY ENCLOSURE,BOX,ALUMINIUM ENCLOSURE,BOX,ALUMINIUM,GRAY LED BULB,RED,T-3 1/4 FERRITE KIT,SNAP-IN CABLE CONNECTOR TY-FAST CABLE TIES Circular Connector Body Material:Metal PRESSURE SENSOR FERRITE CORE,CYLINDRICAL RESISTOR,CURRENT SENSE,0.01 OHM,1W,1% CONTACT,RECEPTACLE,22-20AWG,CRIMP Snap Action Basic Switch BASIC SWITCH,STRAIGHT LEVER,SPDT,15A,250V CAPACITOR ALUM ELEC 800UF,50V,+75,-10%,SCREW Brushless DC Motorized Impeller - 226mm NTC THERMISTOR NTC Thermistor Resistance:33kOhm FERRITE CORE,CYLINDRICAL,500 OHM/100MHZ,200MHZ CONTACT,RECEPTACLE,20-16AWG,CRIMP MICRO SWITCH,ROLLER LEVER SPDT 15A 250V TERMINAL,RING TONGUE,#10,CRIMP WIRE-BOARD CONNECTOR RECEPTACLE 12POS,3.96MM COAXIAL CABLE,RG-174,1000FT,BLACK POTENTIOMETER ROTARY,10KOHM 15% 1W SWITCH,TOGGLE,DPST,6A,250V TERMINAL,RING TONGUE,#10,CRIMP,RED PLAQUE CABLE TIES COFFRET NOIR COFFRET MINIATURE BLANC RADIATEUR MINATURE 20W RADIATEUR 15W TVS Diode HOOK & LOOP CABLE FASTENER,RED,3/8´´W TERMINAL BLOCK JUMPER Standard Terminal Block TERMINAL BLOCK JUMPER TERMINAL BLOCK JUMPER,3WAY TERMINAL BLOCK JUMPER,3WAY,0.312IN TERMINAL,SPADE/FORK,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,#6,CRIMP,YELLOW Seals TERMINAL,SPADE/FORK,#10,CRIMP,YELLOW CONTACT,PIN,20-17AWG,CRIMP TERMINAL,RING TONGUE,#0,CRIMP REED RELAY,SPST-NO,24VDC,3A,THD SWITCH,PUSHBUTTON,SPST-NO,100mA,42V 250 SERIES ADAPTER,0.25 X 0.032,CRIMP,0.82L Switch Knob TERMINAL,RING TONGUE,1/2IN,CRIMP IC,OP-AMP,1MHZ,0.8V/ us,DIP-8 CIRCULAR CONN,PLUG,SIZE 9,3POS,CABLE General Purpose Filters STANDARD DIODE,2A,400V,DO-214AA CABLE,UNSHLD MULTIPR,CAT5E,4PR,24AWG,1000FT,300V UNSHLD MULTIPR CABLE 4PR 1000FT 300V BLK Shielded Multiconductor Cable Number of RELAY SOCKET HOLD-DOWN CLIP HOLE PLUG,STEEL,1.125IN IC,N-CH HIGH SPEED SWITCH,20A,TO220-3 Bridge Rectifier SCHOTTKY RECTIFIER,1A,90V,AXIAL RF DIODE,SCHOTTKY,2PF,70V,DO-35 IC,MOSFET DRIVER,HIGH-SPEED,DIP-8 CIRCUIT BREAKER,THERMAL,2P,240V,15A Bidirectional Transient Voltage Suppress Power Entry Connector SWITCH DIODE,40V,200mA,MICROMELF Schottky Diode SCHOTTKY RECTIFIER,30mA 40V SOD-80 SWITCHING DIODE,1.5PF,50NA,DO-35 RF DIODE,PIN,0.5PF,30V,SOD-80 DIODE,PHOTO,950NM,60°,SIDE LOOKING ZENER DIODE,3W,10V,DO-214AC ZENER DIODE,3W,200V,DO-214AC ZENER DIODE,3W,220V,DO-214AC ZENER DIODE,3W,27V,DO-214AC ZENER DIODE,3W,270V,DO-214AC ZENER DIODE,500mW,3.9V,MICROMELF WIRE-BOARD CONNECTOR,8POS,2.5MM PLUG & SOCKET CONN,HEADER,4POS,4.95MM TERMINAL,RING TONGUE,#10,CRIMP TERMINAL,RING TONGUE,#2,CRIMP TERMINAL,RING TONGUE,#6,CRIMP,BLUE Schottky Rectifer Package/Case:SOD-80 SCHOTTKY RECTIFIER,20mA 40V SOD-80 Schottky Rectifer Package/Case:QuadroMEL Schottky Rectifer Package/Case:SOD-80 OPTICAL SENSOR TRANSMISSIVE / SLOTTED INTERRUPTER DISPLAY,SEVEN SEGMENT,10MM,GREEN DISPLAY,SEVEN SEGMENT,10MM,RED ORANGE LED,GREEN,T-1 (3MM),15MCD,575NM LED,GREEN,T-1 (3MM),20MCD,575NM LED,GREEN,T-1 (3MM),6MCD,575NM LED,GREEN,T-1 3/4 (5MM),45MCD,575NM LED,T-1 3/4,GREEN,30MCD,575NM LED,GREEN,T-1 3/4 (5MM),12MCD,575NM LED,RED,T-1 (3MM),10MCD,625NM LED,T-1,YELLOW,5MCD,594NM LED,RED,T-3/4 (1.8MM),15MCD,630NM ZENER DIODE,500mW,24V,SOD-80 ZENER DIODE,500mW,36V,SOD-80 Hook-Up Wire Conductor Size AWG:12 TERMINAL,FERRULE,CRIMP,TURQUOISE CARTOUCHE ENCRE COMP. HP CYAN CIRCULAR CONNECTOR,PLUG,4POS,CABLE CARTOUCHE ENCRE COMP. HP JAUNE IC,OP-AMP,SOIC-14 BULKHEAD HOUSING,SIZE 24B,METAL AC INPuT PHOTOTRANSISTOR SMALL OuTLINE S RELAY SOCKET IC,PROGRAMMABLE LOGIC LOGIC TYPE:FPGA TESTER,SHIELDED MODULAR CAPACITOR POLY FILM FILM 0.1UF 10%,400V CAPACITOR POLY FILM 0.33UF,400V,5%,AXIAL CAPACITOR POLY FILM FILM 0.47UF 5%,63V CAPACITOR POLY FILM 0.68UF,100V,5%,AXIAL TERMINAL FEMALE DISCONNECT 0.25IN YELLOW CIRCULAR CONN,RCPT,SIZE 22,19POS,BOX CIRCULAR CONN,RCPT,SIZE 22,4POS,BOX CIRCULAR CONN,RCPT,SIZE 16,2POS,BOX CIRCULAR CONN,PLUG,SIZE 8,3POS,CABLE CIRCULAR CONN,PLUG,SIZE 8,3POS,CABLE CIRCULAR CONN,RCPT,SIZE 10,6POS,WALL CIRCULAR CONN,RCPT,SIZE 14,12POS,BOX CIRCULAR CONN,RCPT,SIZE 14,5POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14,12POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 14,15POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 18,11POS,CABLE CONDUIT FITTING,ELECTRICAL,NYLON HEADER CAPACITOR ALUM ELEC 470UF,450V,20%,SNAP-IN D/A Converter (D-A) IC IC,MICROPOWER COMP,DUAL,1.1 uS,SOIC-8 IC,DIFFERENTIAL COMP,DUAL,200NS SOIC8 IC,PROG SHUNT V-REF,2.495V,1%,8-SOIC IC,PROG SHUNT V-REF,2.495V,2%,8-SOIC SWITCHES Breakaway header,8 contact,.156 in. pi BATTERY CLIP,AA,PANEL CIRCULAR CONN,RCPT,SIZE 14,12POS,BOX CIRCULAR CONNECTOR PLUG,SIZE 12,3POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 12,4POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 12,8POS,CABLE RESISTOR,METAL FOIL,5KOHM,600mW,0.01% MICRO SWITCH,HINGE LEVER,SPDT,3A 250V Multipole Connector Switch Knob SWITCH,PUSHBUTTON,DPDT,100mA,125V LIMIT SWITCH,SIDE ROTARY,SPDT-1NO/1NC Limit Switch TERMINAL,RING TONGUE,#6,CRIMP N CHANNEL JFET,-25V,SUPERSOT-3 IC,HEX INVERTER,SCHMITT TRIGGER SOIC14 IC,4I/P DUAL MULTIPLEXER,SOIC-16 PCB,Punchboard,No Clad,Pattern-P SWITCH,REED,SPST-NO,500mA,200VDC MICRO SWITCH,ROLLER LEVER SPDT 21A 277V MICRO SW,PIN PLUNGER,SPST-NO,25A 277V MICRO SWITCH,PLUNGER,SPST-NO,20A 480V SWITCH,TOGGLE,4PDT,20A,277V SWITCH,TOGGLE,4PDT,18A,277V MICRO SWITCH,PIN PLUNGER,SPDT,7A 115V SWITCH,ROTARY,DPST,3A,125V POWER RELAY,DPDT,110VDC,20A,PLUG IN ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,MODULAR,PLASTIC,GRAY ENCLOSURE,DIN RAIL,POLYCARBONATE,GRAY MNX Series Enclosure LIMIT SWITCH,CROSS ROLLER PLUNGER,SPDT CIRCULAR CONNECTOR PLUG SIZE 17,55POS,CABLE LED,RED,T-1 (3MM),630MCD,624NM CIRCULAR CONNECTOR,PLUG,4POS,PANEL CIRCULAR CONNECTOR,RECEPTACLE,4POS,PANEL COMMANDE DE MOTEUR PAS A PAS TRUNKING,DADO PREMIER EXTERNAL ANGLE High Current Inductor SOCKET BOX,1GANG Tantalum Electrolytic Capacitor Capacita VARIATEUR DE VITESSE 16A VARIATEUR DE VITESSE 32A CAPACITOR TANT,10UF,50V,AXIAL 10% CAPACITOR TANT,2.2UF,20V,AXIAL 10% CONTROLEUR VITESSE MOTEUR CAPACITOR TANT,1UF,50V,AXIAL 10% RELAY SOCKET CAPACITOR CERAMIC 820PF 100V,C0G,5%,0 CAPACITOR CERAMIC 220PF 100V,C0G,5%,1206 CAPACITOR CERAMIC 2200PF 100V,C0G,5%,1206 CAPACITOR CERAMIC 27PF 100V,C0G,5%,12 CAPACITOR TANT,6.8UF,35V,AXIAL 10% CAPACITOR CERAMIC 82PF 100V,C0G,5%,12 CAPACITOR CERAMIC 820PF 50V,C0G,5%,1206 Ceramic Multilayer Capacitor FEED THRU STRAIN RELIEF COVER,NYLON CONNECTORS,PCB SCR THYRISTOR,1.88KA,1.2KV,T 9G CAPACITOR CERAMIC 0.47UF,25V,X7R,10%,1210 CAPACITOR CERAMIC 0.1UF,100V,X7R,10%,1812 CAPACITOR CERAMIC 0.33UF 100V,X7R,5%,1812 CAPACITOR TANT,1UF,35V,RADIAL 10% CAPACITOR TANT,10UF,20V,RADIAL 10% CAPACITOR TANT,4.7UF,35V,RADIAL 10% CAPACITOR TANT,68UF,25V,0.095OHM,10% ENCLOSURE,WALL MOUNT,ALUMINIUM ENCLOSURE,WALL MOUNT,ALUMINIUM ENCLOSURE,WALL MOUNT,ALUMINIUM Magnetic Sensor STATIC PROTECTION WRIST GROUNDER STATFREE T2 STATIC PROTECTION MAT,36IN Static Protection Mat Body Material:Nitr LINEAR POSITION TRANSDUCER SEALING BOOT Key Operated Switch Contact Data Line Surge Suppressor POWER CORD,NEMA5-15P,8FT,10A,BLACK FERRITE CORE,CYLINDRICAL STRAIN RELIEF,8WAY,NYLON Relay Socket Power Relay CAPACITOR TANT,1000UF 6.3V,0.03 OHM,0.2,SMD TERMINAL,RING TONGUE,#10,CRIMP,RED LED,GREEN,T-1 (3MM),110MCD,563NM TERMINAL,RING TONGUE,#4,CRIMP TERMINAL,RING TONGUE,1/2IN,CRIMP BLUE TERMINAL,RING TONGUE,#4,CRIMP,RED TERMINAL,RING TONGUE,1/4IN,CRIMP TERMINAL,RING TONGUE,1/2IN,CRIMP FEED THRU STRAIN RELIEF COVER,NYLON MICRO SW,ROLLER LEVER,SPDT,10.1A 250V COFFRET POLYCARBONATE BLINDE LABEL,WARNING,2INX2IN,500PCS WIRE-BOARD CONNECTOR RECEPTACLE,4POS,3.96MM BOITIER POLYSTYRENE IP65 BOITIER POLYSTYRENE IP65 GROUNDING CORD BOITIER POLYSTYRENE IP65 CAPACITOR TANT,68UF,10V,0.1 OHM,0.2,SMD POWER RELAY,DPDT,120VAC,5A,PC BOARD STANDARD DIODE,50A,1.2KV DO-203AB STANDARD DIODE,80A,800V,DO-203AB STANDARD DIODE,80A,800V,DO-203AB CIRCULAR CONN,PLUG,SIZE 14,5POS,BOX CIRCULAR CONN,RCPT,SIZE 16,8POS,BOX CIRCULAR CONN,RCPT,SIZE 16,8POS,BOX CIRCULAR CONN,RCPT,SIZE 20,16POS,BOX TERMINAL,RING TONGUE,5/16IN,CRIMP RED TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,RING TONGUE 5/16IN,CRIMP BLUE TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW CIR CONNECTOR PLUG SIZE 22 14POS FREE HANGING RF/COAXIAL,BNC JACK,R/A,CRIMP TERMINAL,RING TONGUE,#8,CRIMP,RED Terminal Block Pitch Spacing:0.150´´ TERMINAL,MALE DISCONNECT,0.25IN,RED TERMINAL,MALE DISCONNECT,0.187IN,BLUE BOARD-BOARD CONN,HEADER,36WAY,1ROW RELAY SOCKET TERMINAL,RING TONGUE,1/4IN,CRIMP TERMINAL,RING TONGUE,1/2IN,CRIMP TERMINAL,RING TONGUE,3/8IN,CRIMP,RED TERMINAL,RING TONGUE,1/2IN,CRIMP RF/COAXIAL,BNC JACK,R/A,50 OHM,SOLDER Air Ionizer HIGH TEMP MASKING TAPE,1´´ X 60YD CAPACITOR ALUM ELEC 35UF,25V,+75,-10%,AXIAL STANDOFF KIT CAPACITOR CERAMIC 22PF 100V,C0G,5%,RAD CAPACITOR CERAMIC 220PF 50V,C0G,5%,RAD CAPACITOR CERAMIC 47PF 100V,C0G,5%,RAD CAPACITOR CERAMIC 4700PF,50V,X7R,10%,RAD CAPACITOR CERAMIC 4700PF,100V,X7R,10%,RAD CAPACITOR CERAMIC 330PF 100V,C0G,5%,RAD CAPACITOR CERAMIC 3300PF 50V,C0G,5%,RAD RESISTANCE 300W 4R7 RESISTANCE 300W 6R8 RESISTANCE 300W 47R TERMINAL,RING TONGUE,#8,CRIMP,GREEN TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,RING TONGUE,#8,CRIMP,GREEN TERMINAL,RING TONGUE,#6,CRIMP,BLUE TERMINAL,RING TONGUE,#8,CRIMP,YELLOW TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP CONN,TERMINAL,RING TONGUE,#6,CRIMP TERMINAL,RING TONGUE,#2,CRIMP RESISTANCE 300W 330R TERMINAL,RING TONGUE,#6,CRIMP TERMINAL,RING TONGUE,#6,CRIMP TERMINAL,RING TONGUE,3/8IN,CRIMP RESISTANCE 300W 680R TERMINAL,RING TONGUE 3/8IN CRIMP YELLOW TERMINAL,RING TONGUE,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,#2,CRIMP,RED TERMINAL,RING TONGUE,1/2IN,CRIMP RESISTANCE 300W 1K TERMINAL,RING TONGUE,#6,CRIMP,YELLOW TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW TERMINAL,CLOSED END SPLICE,CLEAR TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,RING TONGUE,1/2IN,CRIMP BLUE TERMINAL,RING TONGUE,1/2IN,CRIMP TERMINAL,RING TONGUE,#4,CRIMP,RED TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,RING TONGUE,1/4IN,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE TERMINAL,RING TONGUE,#2,CRIMP TERMINAL,SPADE/FORK,#10,CRIMP TERMINAL,RING TONGUE,#4,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP,RED TERMINAL,RING TONGUE,#6,CRIMP,YELLOW TERMINAL,RING,3/8,CRIMP,YEL,12-10AWG TERMINAL,RING TONGUE,#10,CRIMP TERMINAL,RING TONGUE,5/16IN,YELLOW TERMINAL,RING TONGUE,#6,CRIMP TERMINAL,RING TONGUE,1/4IN,CRIMP TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW TERMINAL,RING TONGUE,1/2IN,CRIMP TERMINAL,RING TONGUE,1/2IN,CRIMP TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,SPADE/FORK,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,1/2IN,CRIMP TERMINAL,SPADE/FORK,#4,CRIMP,YELLOW TERMINAL,SPADE/FORK,#6,CRIMP,BLUE TERMINAL,RING TONGUE,#6,CRIMP,YELLOW TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,RING TONGUE,#4,CRIMP PCB,Pad/Hole and Gnd Plane PCB,Tracks(Strip Board) TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE TERMINAL,RING TONGUE,#8,CRIMP Quarter wave stub,1710-1990 MHz PCB,Pad/Hole 2 Sides PLUG & SOCKET CONN,HEADER,4POS,6.71MM TAPE,INSULATION,PVC,BLACK,19MMX18M TERMINAL,SPADE/FORK,#4,CRIMP,YELLOW TERMINAL,SPADE/FORK,#8,CRIMP,BLUE CIRCULAR CONN RCPT,SIZE 17,55POS,WALL BOARD-BOARD CONNECTOR HEADER,6WAY,1ROW POTENTIOMETRE 2K TERMINAL,SPADE/FORK,1/4IN,CRIMP,RED FAST RECOVERY DIODE,125A,1.2KV,DO-8 TERMINAL,RING TONGUE 1/4IN CRIMP YELLOW CAPACITOR ALUM ELEC 250UF,75V,+75,-10%,AXIAL CIRCULAR CONN RCPT SIZE 25,128POS,WALL RESISTOR,METAL FILM,11KOHM,600mW,1% RESISTOR,METAL FILM,13KOHM,600mW,1% Metal Film Resistor RESISTOR,METAL FILM,1.4KOHM,600mW,1% RESISTOR,METAL FILM,301KOHM,600mW,1% BRIDE POUR CONDENSATEUR 25MM BRIDE POUR CONDENSATEUR 40MM BRIDE POUR CONDENSATEUR 45MM CAPACITOR CERAMIC 3.3PF 50V,C0G,0.25pF,0402 POWER RELAY,SPST-NO,120VAC,30A FLANGE Linear Voltage Regulator IC IC,3 TO 8 LINE DECODER/DMUX,SOIC-16 INST. BOX,TYPE 4,HINGED WIN/CVR 230X60 IC,ADC,16BIT,40KSPS,DIP-28 IC,ADC,12BIT,50KHZ,TSSOP-16 Digital/Analog Converter IC Interface Ty IC,RS-232 TRANSCEIVER,5.5V,SSOP-16 IC,PRESSURE SENSOR,15 TO 115KPA,SSOP8 REGULATEUR IC,OP-AMP,1MHZ,3V/ us,TO-99-8 IC,DAC,24BIT,768KSPS,SOIC-20 DC/DC Converter (DC-DC) / Switching Regu PANNEAU SOLAIRE STANDARD DIODE,150A 1.2KV DO-205AA STANDARD DIODE,400A,1.2KV,DO-9 LOG 4BIT 4PORT BUS SWITCH LOGIC TYPE:BUS IC,DIFF LINE RECEIVER,QUAD,SOIC-16 IC HEX INVERTER SCHMITT TRIGGER TSSOP-14 IC,QUAD AND GATE,2I/P,SOIC-14 IC,INVERTING BUFFER,SOIC-20 IC,NON INVERTING BUS BUFFER,SOIC-14 IC,INVERTING BUFFER,SOIC-14 IC,OP-AMP,10MHZ,16V/ us,DIP-8 IC,OP-AMP,1MHZ,3.5V/ us,SOIC-8 IC,PROG SHUNT V-REF,2.495V 2% 5-SOT-23 RF/COAXIAL,N PLUG,STR,50 OHM,CRIMP FASTENERS,SCREWS IC,SYNC BUCK PWM SWITCHER,20-HTSSOP IC,LINEAR VOLT REGULATOR,15V,SOT-89-3 IC,CURRENT MODE PWM CTRL,14.5V,16-DIP ENCLOSURE,WALL MOUNT POLYCARBONATE GRAY Box Enclosure ENCLOSURE,WALL MOUNT POLYCARBONATE GRAY Pressure Sensor Rocker Switch Rocker Switch Rocker Switch Rocker Switch Rocker Switch Rocker Switch Pressure Sensor Pressure Sensor Pressure Sensor Operating Pressure Max:3 TERMINAL,RING TONGUE,#6,CRIMP,RED TERMINAL,RING TONGUE,#8,CRIMP,RED TERMINAL,RING TONGUE,#10,CRIMP,BLUE TERMINAL,RING TONGUE,#8,CRIMP,BLUE TERMINAL,RING TONGUE,#8,CRIMP,YEL,12-10AWG TERMINAL,BUTT SPLICE,CRIMP,RED TERMINAL,BUTT SPLICE,CRIMP,BLUE TERMINAL,BUTT SPLICE,CRIMP,YELLOW TOOLS,RATCHET CRIMP Engineering materials,Tube Lamps Indicator Lamp CIR CONNECTOR PLUG SIZE 20 14POS FREE HANGING POWER RELAY,DPDT,24VDC,30A,DIN RAIL CIRCULAR CONN,PLUG,SIZE 9,6POS,CABLE LINEAR POSITION TRANSDUCER CIRCULAR CONN,RCPT,SIZE 14S,5POS,BOX CIRCULAR CONN,PLUG,SIZE 16S,7POS,BOX CIRCULAR CONN,RCPT,SIZE 20,14POS,BOX CIRCULAR CONN,PLUG,SIZE 20,8POS,BOX CIRCULAR CONN,RCPT,SIZE 20,8POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14S,5POS,CABLE CIRCULAR CONNECTOR RCPT SIZE 14S,5POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 16S,7POS,CABLE CIRCULAR CONNECTOR RCPT SIZE 16S,7POS, CIRCULAR CONNECTOR PLUG SIZE 20,14POS, LIVRE-PIC COOKLIVRE VOL1 CIRCULAR CONNECTOR PLUG,SIZE 20,8POS,CABLE CIRCULAR CONNECTOR RCPT,SIZE 20,8POS,CABLE ENCLOSURE,UTILITY,PLASTIC,GRAY IC,GEN PUR COMP,QUAD,1.3 uS,SOP-14 OPTOCOUPLERS MALE SCREW LOCK,4-40,7.14MM CONNECTOR,D SUB,PLUG,9POS TERMINAL BLOCK JUMPER,10WAY MULTICONDUCTOR PAIRED NETWORKING,CCTV RESISTOR,METAL FILM,22.1KOHM,250mW,1% RESISTOR,METAL FILM,402 OHM,250mW,1% RESISTOR,METAL FILM,6.81KOHM,250mW,1% RESISTOR,METAL FILM,750 OHM,250mW,1% POWER RELAY,SPST-NO,5VDC,10A PC BOARD POWER RELAY,3PDT,24VAC,5A,PLUG IN RF/COAXIAL,SMA PLUG,STR,50 OHM,SOLDER Cable Pull Switch JOYSTICK SWITCH,SPST,5A,250V POT,JOYSTICK,10KOHM,40°,100mW Joystick Linear Motion Control Linear Motion Control Linear Motion Control Linear Motion Control Linear Motion Control POT,LIN MOTION,1KOHM,15%,200mW Ceramic Multilayer Capacitor Ceramic Multilayer Capacitor Ceramic Multilayer Capacitor Ceramic Multilayer Capacitor Ceramic Multilayer Capacitor Ferrite Chip Bead Inductor Series:LF LK Multi-Layer SMD Inductor VOYANT NEON ROUGE VOYANT NEON VERT Inductor Series:LG HK VOYANT NEON AMBRE Inductor Series:LG HK RIGHT-ANGLE KEY STRAIGHT KEY POWER RELAY,DPDT,220VAC,10A,PLUG IN POWER RELAY,4PDT,110VAC,6A,PLUG IN Relays,PCB Relay Type:General Purpose POWER RELAY,4PDT,12VDC,6A,PLUG IN FERRITE BEAD,0.0062OHM,5A POWER RELAY,DPDT,220VAC,10A,PLUG IN Crimp Connector Housing CONTACT,RECEPTACLE,22-18AWG,CRIMP RESISTOR,METAL FILM,22.1 OHM,400mW,1% CIRCULAR CONN,RCPT,SIZE 14S,5POS,BOX CIRCULAR CONN,RCPT,SIZE 14S,5POS,BOX CIRCULAR CONN,RCPT,SIZE 14S,3POS,BOX CIRCULAR CONN,RCPT,SIZE 20,17POS,BOX CIRCULAR CONN,RCPT,SIZE 22,55POS,BOX CIRCULAR CONNECTOR RCPT SIZE 22,55POS,CABLE CIRCULAR CONN,RCPT,SIZE 12,3POS,BOX CIRCULAR CONN,RCPT,SIZE 20,41POS,BOX CIRCULAR CONN,RCPT,SIZE 22,55POS,BOX CIRCULAR CONNECTOR PLUG SIZE 20,41POS,CABLE CIRCULAR CONN,PLUG,SIZE 8,3POS,CABLE CIRCULAR CONN,RCPT,SIZE 18,32POS,BOX CAPACITOR CERAMIC 82PF 50V,C0G/NP0,5%,RAD RESISTOR,METAL FILM,150 OHM,400mW,1% Draw-Bar Endspring LABEL,IDENTIFICATION 9MMX18FT METALIZED LABEL,IDENTIFICATION 9MMX18FT METALIZED WIRE-BOARD CONNECTOR RECEPTACLE 14POS,2.54MM RESISTOR,METAL FILM,9.76KOHM,400mW,1% CAPACITOR CERAMIC,4.7UF,16V,X5R,10%,1206 CAPACITOR CERAMIC,1UF,6.3V,X5R,10%,0805 CAPACITOR CERAMIC,0.1UF,25V,X5R,10%,0603 FERRITE BEAD,0.035OHM,2A,0603 FERRITE BEAD,0.17OHM,700mA,0603 FERRITE BEAD,0.06OHM,3A,1810 FERRITE BEAD,0.06OHM,3A,1812 FERRITE BEAD,0.008OHM,4A,0805 FERRITE BEAD,0.007OHM,6A,1806 FERRITE CHIP BEAD,1806,14mOHM,6A FERRITE BEAD,0.014OHM,4A,1806 FERRITE BEAD,0.007OHM,6A,1806 FERRITE BEAD,0.7OHM,150mA,0402 FERRITE BEAD,0.3OHM,300mA,0402 FERRITE BEAD,0402,590mOHM,250mA FERRITE BEAD,0.2OHM,500mA,0402 FERRITE BEAD,0.55OHM,300mA,0402 FERRITE BEAD,0.45OHM,350mA,0603 FERRITE BEAD,0.4OHM,300mA,0603 FERRITE BEAD,1.1OHM,200mA,0603 FERRITE BEAD,0.3OHM,300mA,0603 FERRITE BEAD,0.1OHM,900mA,0805 INDUCTOR,470NH,10MA,10%,80MHZ INDUCTOR,560NH,10MA,10%,75MHZ INDUCTOR,680NH,10MA,10%,70MHZ SMD INDUCTOR,560NH,35MA 10% 95MHZ SMD INDUCTOR,1.2UH,25MA 10% 60MHZ SMD INDUCTOR,2.7UH,15MA 10% 40MHZ SMD INDUCTOR,3.3UH,15MA 10% 38MHZ SMD INDUCTOR,3.9UH,15MA 10% 36MHZ SMD INDUCTOR,4.7UH,15MA 10% 33MHZ SMD INDUCTOR,1NH 300MA 0.3NH 13GHZ SMD INDUCTOR,1.5NH,300MA,0.3NH,13GHZ SMD INDUCTOR,1.8NH,300MA,0.3NH,11GHZ SMD INDUCTOR,10NH,300MA 5% 4.3GHZ SMD INDUCTOR,15NH,300MA 5% 3.5GHZ SMD INDUCTOR,22NH,300MA 5% 2.8GHZ SMD INDUCTOR,39NH,200MA 5% 1.7GHZ SMD INDUCTOR,47NH,200MA 5% 1.5GHZ SMD INDUCTOR,5.6NH,300MA,0.3NH 5.7GHZ SMD INDUCTOR,100NH,300MA,5% 1GHZ SMD INDUCTOR,150NH 300MA 5% 800MHZ SMD INDUCTOR,220NH 300MA 5% 600MHZ SMD INDUCTOR,1.2NH,300MA,0.3NH,13GHZ SMD INDUCTOR,22NH,300MA 5% 2.9GHZ SMD INDUCTOR 3.9NH 300MA 0.3NH 8GHZ SMD INDUCTOR,4.7NH,300MA,0.3NH 6.5GHZ SMD INDUCTOR,47NH,300MA 5% 1.6GHZ Inductor SMD INDUCTOR,6.8NH 300MA 5% 5.6GHZ SMD INDUCTOR,8.2NH 300MA 5% 5.2GHZ SMD INDUCTOR,82NH,300MA 5% 1.1GHZ SMD INDUCTOR,390NH 300mA 5% 400MHZ SMD INDUCTOR 1.8NH 300MA 0.3NH 6GHZ SMD INDUCTOR,5.6NH,300MA,0.3NH 5.4GHZ SMD INDUCTOR,56NH,300MA 5% 1.1GHZ CAPACITOR CERAMIC 0.22UF 6.3V,X5R,10%,0402 CAPACITOR CERAMIC 2.2PF 50V,C0G,0.25pF ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK ENCLOSURE,UTILITY,PLASTIC,BLACK Pushbutton Switch PLUG WITH CABLE,DC POWER,4M EXTENSION CABLE,PLUG TO SKT,3M CONNECTOR CONTACT,SOCKET,CRIMP TERMINAL,RING TONGUE,#4,CRIMP Econoglas Door CAPACITOR CERAMIC,470PF,50V,X7R,10%,0402 RESISTOR,METAL FILM,24.9 OHM,400mW,1% SWITCH MOUNTING CONNECTOR MICRO SWITCH HINGE LEVER SPDT 100mA 250V CONNECTORS,INTER-SERIES ADAPTER CABLE,SHLD MULTIPR,1PR,22AWG,1000FT,300V LARGE BASIC SWITCH ROUND KNURLED KNOB W/ LINE IND,3.175MM Switch Knob Switch Knob Switch Knob ROUND KNURLED POINTER KNOB,6.35MM Switch Knob Switch Knob Switch Knob Switch Knob Switch Knob GUIDE DE SERTISSAGE INSERT FEMELLE HAN K 4/2P INSERT MALE HAN K 4/8P INSERT FEMELLE HAN K 4/8P INSERT MALE HAN K 6/6P INSERT FEMELLE HAN K 6/6P INSERT MALE HAN 10A CAPOT POUR HAN CAPOT POUR HAN N CH MOSFET,100V,14A,TO-204AA FICHE JACK 6.35 COUDEE 3P ETIQUETTE CE 19.05 PQ500 TAG,DO NOT OPERATE,PK10 TAG,DO NOT USE,PK10 TAG,DO NOT SWITCH,ON PK10 ALIMENTATION DE LABO 0-35V 10A ALIMENTATION DE LABO 0-18V 20A ALIMENTATION DE LABO 0-35V 10A ALIMENTATION DE LABO 0-18V 20A BLOUSE D´ENTREPOT BLANCHE 108CM CONDENSATEUR 47000PF CONDENSATEUR 220PF CONDENSATEUR 470PF CONDENSATEUR 1000PF CONDENSATEUR 2200PF LIVRE-PROG THE MCHIP PIC IC-REAL TIME CLOCK EMBASE MALE VERTICALE DIL 8 VOIES EMBASE MALE VERTICALE DIL 20 VOIES EMBASE MALE HORIZONTAL SIL 4 VOIES EMBASE MALE HORIZONTAL SIL 10 VOIES EMBASE MALE HORIZONTAL DIL 3 VOIES EMBASE MALE HORIZONTAL DIL 4 VOIES EMBASE MALE HORIZONTAL DIL 10 VOIES BOITIER CONTACTS A SERTIR DIL 4 V CONNECTEUR PICOFLEX 4V CONNECTEUR PICOFLEX 14V EMBASE PICOFLEX 4V EMBASE PICOFLEX 14V MICRORUPTEUR MICRORUPTEUR MICRORUPTEUR MICRORUPTEUR MICRORUPTEUR THERMOPOCHE 100MM CAPTEUR DE PRESSION CAPTEUR DE PRESSION CAPTEUR DE PRESSION COMMUTATEUR A GLISSIERE COMMUTATEUR A GLISSIERE DETECTEUR PHOTOELECTRIQUE SUPPORT DE PILE BOUTON SIRENE PIEZO 12V DC DEMARREUR DE MOTEUR MANUEL DEMARREUR DE MOTEUR MANUEL DEMARREUR DE MOTEUR MANUEL DEMARREUR DE MOTEUR MANUEL DEMARREUR DE MOTEUR MANUEL CONTACT AUX 1O 1F BOITIER IP54 TORCHE VERSABRITE AMPOULE DE RECHANGE COMMUTATEUR A BASCULE COMMUTATEUR A BASCULE INTERRUPTEUR A VERROUILLAGE SPST COMMUTATEUR POUSSOIR TIME SWITCH,PLUG-IN,7DAY INTERRUPTEUR HORAIRE 24HR INTERRUPTEUR HORAIRE 24HR INTERRUPTEUR HORAIRE 24HR CAPTEUR DE PRESSION TRANSDUCTEUR DE PRESSION TRANSDUCTEUR DE PRESSION TRANSDUCTEUR DE PRESSION TRANSDUCTEUR DE PRESSION DETECTEUR OPTIQUE PRESSURE COMMUTATEUR INDICATEUR DE TEMPERATURE 100MMDIA INDICATEUR DE TEMPERATURE 100MMDIA THERMOWELL POUR T208 GAU PLAQUETTE THERMIQUE TO-3P PLAQUETTE THERMIQUE TO-220 CIRCUIT LOGIQUE SERIE 74VHC PILE ZEROPOWER LIVRE-50 THINGS TO DO WITH PICS EMBASE Q-G FEMELLE 5P SPRING CONTACT,BATTERY CONTACT OPENED FLANGE HOUSING,SIZE 3A,METAL ROUND SKIRTED KNOB,0.125IN CABLE,SHLD MULTICOND,2COND,22AWG,500FT,300V CONTACT,MALE,26-22AWG,CRIMP PADLOCK KIT FOR JUNCTION BOX ENCLOSURE,JUNCTION BOX,STEEL,GRAY ENCLOSURE,JUNCTION BOX,STEEL,GRAY ENCLOSURE,JUNCTION BOX,STEEL,GRAY UNSHLD MULTICOND CABLE 2COND 16AWG 500FT UNSHLD MULTICOND CABLE 2COND 16AWG 500FT CABLE,UNSHLD MULTICOND,4COND,16AWG,500FT,300V SHLD MULTICOND CABLE,3COND,18AWG,500FT,300V UNSHLD MULTICOND CABLE 4COND 18AWG 500FT SHLD MULTICOND CABLE,4COND,22AWG,500F Multiconductor Security,Alarm & Audio C SHLD MULTICOND CABLE,2COND,16AWG,500FT,300V Sound/Security Multiconductor Cable Sound/Security Multiconductor Cable Sound/Security Multiconductor Cable Sound/Security Multiconductor Cable Numb FEET (BUMPERS) FEET (BUMPERS) HOLE PLUG,NYLON,0.375IN BATTERY CLIP,D,PANEL BATTERY CLIP,AA,PCB BATTERY STRAP,9V,WIRE LEAD STANDOFF SPACER SPACER SIDE ENTRY HOOD,SIZE 16A,METAL SINGLE BAR INSTRUMENTATION KNOB,0.125IN ROUND SKIRTED KNOB,0.25IN BANANA PLUG,RIVET FEET (BUMPERS) SPRING CONTACT,BATTERY CONTACT ADAPTATEUR ADAPTATEUR ROUND INSTRUMENTATION KNOB,0.125IN FERRITE BEAD,0.13OHM,900mA,0603 DISJONCTEUR 3A RCD PLUG MODULE 18L/28L/40L DIP SOCKET POUR PM3 SOCKET MODULE,68 PLCC,FOR MPLAB PM3 POGRAMMATEUR UNIVERSEL MPLAB PM3 BANANA PLUG,SOLDER POTENTIOMETER,COND PLASTIC,5MOHM 20%,2W PLUG & SOCKET HOUSING,RECEPTACLE 16POS,3.96MM TOOLS,CUTTERS MOSFET SWITCH,TOGGLE,SPDT,6A,250V KEYCAP POWER RELAY,DPST-NO,24VDC,5A PC BOARD POWER RELAY SPST-NO 24VDC,12A,PC BOARD MICRO AUTOMOTIVE RELAY,SPDT,12VDC,20A POWER RELAY,DPDT,120VAC,10A,PLUG IN RELAY SOCKET MICRO SWITCH,HINGE LEVER,SPDT 10A 250V SWITCH,ROCKER,DPST,16A,250V,BLACK CAPACITOR POLY FILM FILM 1UF 10%,100V, TERMINAL,RING TONGUE,#6,CRIMP TERMINAL,RING TONGUE,1/4IN,CRIMP BLUE CIRCULAR CONN PLUG SIZE 23 100POS,CABLE TERMINAL,RING TONGUE,#4,CRIMP,YELLOW Filtered D-Subminiature Connector WIRING DUCT,WIDE SLOT,PVC,WHT,50.6MM H SNAP ACTION BASIC SWITCH,ROLLER PLUNGER,SPDT,20A SWITCH BOOT POWER RELAY,DPDT,48VDC,10A,PLUG IN CONTACT,MALE,24-18AWG,CRIMP PLUG & SOCKET HOUSING,RECEPTACLE,NYLON CIRCUIT BREAKER,HYD-MAG,2P,240V,30A CIRCUIT BREAKER,HYD-MAG,1P,240V,30A CIRCUIT PROTECTOR,HYD-MAG,2P,240V 15A CIRCUIT PROTECTOR,HYD-MAG,1P,240V 30A CAPACITOR TANT,22UF,35V,2824 ^7257] 10% STRAIN RELIEF COVER,12WAY,NYLON WIRE-BOARD CONNECTOR HEADER 5POS,2.54MM WIRE-BOARD CONNECTOR RECEPTACLE 18POS,2.54MM WIRE-BOARD CONNECTOR RECEPTACLE 28POS,2.54MM WIRE-BOARD CONN,HEADER,11POS,2.54MM JACK SOCKET SCREW,M2.5,20.3MM TERMINAL,BUS STRIP MICRO SWITCH PIN PLUNGER SPDT 100mA 125V TERMINAL,SPADE/FORK,1/4IN CRIMP YELLOW IC-8 BIT CMOS MCU PROTECTION COVER FAST RECOVERY DIODE,125A,1.2KV,DO-8 TAPE,MASKING,POLYIMIDE,AMBER 1INX36YD BATTERY CLIP,9V,PCB EXTENDER CARD - DIN,UNIVERSAL UNCOMMITED CIRCULAR CONN,PLUG,SIZE 8,3POS,BOX Modular Connector Modular Connector BARE PCB NO HOLES - PLANE DOUBLE SIDED WIRE-BOARD CONNECTOR RECEPTACLE,9POS,3.96MM MODULAR CONNECTOR Circular Connector POWER OUTLET STRIP,4 OUTLET,10A,250V BOARD-BOARD CONN,RECEPTACLE,8WAY,1ROW Resettable Fuse CIRCULAR CONNECTOR PLUG SIZE 11,13POS,CABLE CIRCULAR CONN PLUG SIZE 13,22POS,CABLE CIRCULAR CONN PLUG SIZE 19,66POS,CABLE Metal Connector Backshell Metal Connector Backshell Enclosure LED Lamp LED Lamp TERMINAL,RING TONGUE,1/2IN,CRIMP TAPE,FOIL SHIELD,COPPER,2INX18YD POWER RELAY,3PDT,24VAC,10A,PLUG IN RECTANGULAR INSERT,RECEPTACLE,64POS SWITCH,PUSHBUTTON,DPDT,3A,250V TRANSISTOR INSULATOR CONTACT,MALE,24-22AWG,CRIMP BRADYBONDZ THERMAL TRANSFER PRINTABLE LABELS CONN,FUSED POWER ENTRY MODULE,PLUG 10A POWER CORD,NEMA5-15P,8FT,13A,BLACK CIRCULAR CONNECTOR,PLUG,2POS,PANEL CIRCULAR CONNECTOR,PLUG,2POS,PANEL CIRCULAR CONNECTOR,PLUG,3POS,PANEL CIRCULAR CONNECTOR,RECEPTACLE,3POS,PANEL CIRCULAR CONNECTOR,PLUG,4POS,PANEL CIRCULAR CONNECTOR,PLUG,6POS,PANEL CIRCULAR CONNECTOR,RECEPTACLE,6POS,PANEL DISQUE COUPLAGE MOTEUR PQ4 DISQUE COUPLAGE MOTEUR PQ4 HEATER,FAN,INDUSTRIAL WALL DISQUE MAGNETIQUE PQ10 MANCHONS REDUCTEURS PQ6 HEATER,RADIANT,QUARTZ IR AIR FILTER,SYNTHETIC BAG FILTER,ROLL,DISPOSABLE,EU3 DISTRIBUTEUR CONTROLE DE DEBIT COMMUTATEUR DE PRESSION ELECTRO/PNEU COMMUTATEUR DE PRESSION ELCTR/PNEU SILENCIEUX ECHAPPEMENT SILENCIEUX ECHAPPEMENT FILTRE AUTOMATIQUE 1/8´´ FILTRE COALESCENT 1/8´´ REGULATEUR FILTRE 1/8´´ REGULATEUR FILTRE 1/4´´ REGULATEUR 1/4IN EXCELN REGULATEUR 3/4´´ EXCELN FRAISE A TROUS COUPE LE METAL FRAISE A TROUS COUPE LE METAL FORET ETAGE HEXIBIT UNITE TRAITEMENT AIR OLYMPIAN TARAUD METRIQUE HEXIBIT TARAUD METRIQUE HEXIBIT TRAVERSEE DE CLOISON 6MM TRAVERSEE DE CLOISON 8MM FRAISE A TROUS 20MM DIAM FRAISE A TROUS 6.3MM DIAM FRAISE A TROUS 8.3MM DIAM FRAISE A TROUS 10.4MM DIAM ADAPTATEUR DROIT 4MMXM5 RONDELLE SOLIDE 7/16´´´´ID RACCORD BANJO REGULE 6MM ECROU 4MM COMPRESSION ECROU 6MM COMPRESSION ECROU 8MM COMPRESSION ECROU 10MM COMPRESSION JEU DE LIMES A AIGUILLE DIAMANTEES ROULEMENT A FIXATION CHASSIS ROULEMENT A 2 FIXATION CHASSIS BOBINE 4MMX10MTR CUIVRE TBE BOBINE 6MMX10MTR CUIVRE TBE BOBINE 8MMX10MTR CUIVRE TB ROULEMENT A FIXATIONS CHASSIS ADAPTATEUR COUPLAGE MOTEUR PQ2 ROBINET A BOISSEAU SPHERIQUE 1/2´´ ROBINET 1/4 TOUR FEM/FEM 1/2´´ ROBINET 1/4 TOUR 1/4 ROBINET 1/4 TOUR 3/8 ROBINET 1/4 TOUR 1/2´´ ROBINET 1/4 TOUR 3/4 BROSSE 200MM +ADAPTATEURS BROSSE COUPE 65MM BROSSE COUPE 65MM BROSSE COUPE 60MM BROSSE COUPE 50MM BROSSE COUPELLE 10MM BROSSE COUPE 60MM BROSSE CIRCULAIRE 50MM BROSSE EXTREMITE 12MM BROSSE EXTREMITE 24MM BROSSE D´EXTREMITE 12MM BROSSE POUR BOUGIES ADAPTATEUR COUPLAGE MOTEUR PQ2 ADAPTATEUR COUPLAGE MOTEUR PQ2 ADAPTATEUR COUPLAGE MOTEUR PQ2 LIME A MAIN TAILLE DEMI-DOUCE LIME A MAIN PLATE JEU DE LIME AIGUILLE SCIE A METAUX JUNIOR VENTILATOR,HIGH POWER JIGSAW BLADE,21TPI,PK5 ADAPTATEUR COUPLAGE MOTEUR PQ2 ADAPTATEUR COUPLAGE MOTEUR PQ2 ADAPTATEUR COUPLAGE MOTEUR PQ2 CODEUR INCREM KIT RESSORTS A COMPRESSION KIT RESSORTS A COMPRESSION RONDELLE JOINT PQ50 RONDELLE JOINT IMPERIAL PQ50 MOTEUR VIBRANT MONOPHASE MOTEUR VIBRANT TRIPHASE BAGUE DE ROULEMENTS BAGUE DE ROULEMENTS BAGUE DE ROULEMENTS IC-DUAL PWM MOTOR DRIVER JOINT POUR AXES LIVRE-BITS TO CHIPS FORET HELICOIDAUX 7.0 ROULETTES DOUBLE PIVOT ROULETTES DOUBLE PIVOT ROULETTES DOUBLE PIVOT ROULETTES APPAREIL PIVOT ROULETTES APPAREIL PIVOT CAPTEUR DE CHARGE CAPTEUR DE CHARGE ADHESIF. E/S TX528 1LTR ROUE SEULE PNEU CAOUTCHOUC ROUE SEULE CAOUTCHOUC/ZINC MOUSSE 500ML EXPANDING FILLER,825ML RONDELLE PLATE NYLON M2 PQ50 KIT DE DEVELOPPEMENT PICSTART+ RONDELLE PLATE NYLON M4 PQ50 RONDELLE PLATE NYLON M5 PQ50 RONDELLE PLATE NYLON M6 PQ50 RONDELLE PLATE NYLON M8 PQ50 KIT DE ROULEMENTS IGLIDUR G ROULETTES PIVOT ROUE EN NYLON ROULETTES SPARE WHEEL NYLON POMPE A VIDE NORGREN VENTOUSE PLATE NORGREN VENTOUSE PLATE NORGREN VENTOUSE PLATE NORGREN VENTOUSE PLATE NORGREN VENTOUSE A SOUFFLET PIED DE CHARGE REGLABLE 80 DIAM ALESOIR MANUEL 3.0MM ALESOIR MANUEL 4.0MM ALESOIR MANUEL 5.0MM ALESOIR MANUEL 6.0MM ALESOIR MANUEL 8.0MM VESTE DE PROTECTION AVEC CAPUCHE M VESTE DE PROTECTION AVEC CAPUCHE XXL RUBAN DE MASQUAGE HTE TEMP 50MM RUBAN DE MASQUAGE HTE TEMP 25MM SUPPORT POUR AXE DE ROULEMENT TRANSMETTEUR PRESSION TRANSMETTEUR PRESSION TRANSMETTEUR PRESSION GANTS UTILISATION INTENSIVE L CAPTEUR DE MOUVEMENT GANTS EN NITRILE-PAUME REVETUE MOYENS CLE DOUBLE DOUILLE DOUBLE DOUILLE DOUBLE DOUILLE DOUBLE DOUILLE DOUBLE LIQUIDE DE COUPE 400G DISTRIBUTEUR CONTROLE DE DEBIT DISTRIBUTEUR CONTROLE DE DEBIT REG / SILENCIEUX ECHAPPEMENT REG / SILENCIEUX ECHAPPEMENT DISTRIBUTEUR ANTI RETOUR 1/8´´ ANTI RETOUR RACCORD INSTANTANE ANTI RETOUR RACCORD INSTANTANE GREASE,HIGH QUALITY,400G POUSSOIR A RESSORT.M5 POUSSOIR A RESSORTS M6 POT MAGNETIQUE PEU PROFOND ROBUSTE M6 GANTS POUR SALLE BLANCHE 12´´´´ S7 THERMOCOUPLE J 2M RACCORD EQUERRE ORIENTABLE 6MM RACCORD BANJO LIMITEUR DE DEBIT CLAPET A BILLE 3 VOIES 1/4 CLAPET A BILLE 3 VOIES 3/8 CLAPET A BILLE 3 VOIES 1/2 BAGUE COUPLAGE MOTEURS UNI-LAT BAGUE COUPLAGE MOTEURS UNI-LAT BAGUE COUPLAGE MOTEURS UNI-LAT AIMANT DE POCHE E802 AIMANT RECTANGULAIRE PAIRE BOUTON MAGNETIQUE ALNICO E822 BAGUE DE COUPLAGE MOTEURS FLEX-M BAGUE DE COUPLAGE MOTEURS FLEX-M BAGUE DE COUPLAGE MOTEURS FLEX-M POUSSOIR A RESSORT BILLE/FENTE POUSSOIR A RESSORTS GOUPILLE/FENTE POUSSOIR A RESSORTS GOUPILLE/FENTE COUPLAGE OLDHAM HUB 25.4X10 PQT2 COUPLAGE OLDHAM HUB 12.7X3 PQT4 COUPLAGE OLDHAM HUB 12.7X4 PQT4 COUPLAGE OLDHAM HUB 12.7X6.35 PQT4 COUPLAGE OLDHAM HUB 19.1X4 PQT4 COUPLAGE OLDHAM HUB 19.1X6 PQT4 COUPLAGE OLDHAM HUB 19.1X6.35 PQT4 COUPLAGE OLDHAM HUB X-Y 25X6 COUPLAGE OLDHAM HUB X-Y 25X1/4 COUPLAGE OLDHAM HUB X-Y 25X8 COUPLAGE OLDHAM HUB X-Y 41X12 COUPLAGE OLDHAM HUB X-Y 19X4 COUPLAGE OLDHAM HUB X-Y 33X8 COUPLAGE OLDHAM HUB X-Y 33X10 THERMOCOUPLE T 2M JEU DE CLES MIXTES DEPORTEES CLE 6MM CLE COMBINEES 12MM CLE COMBINEES 15MM CLE COMBINEES 16MM CLE COMBINEES 21MM CLE COMBINEES 22MM CLE COMBINEES 24MM CLE COMBINEES 27MM CLE COMBINEES 3/8 CLE 7/16 CLE 9/16 CLE 5/8 CLE 11/16 CLE COMBINEES 3/4 CLE COMBINEES CLE COMBINEES 1´´ EMBRAYGE FREIN A FRICTION JEU DE CLES JOINT UNIVERSEL 5X5. PK2 ACCELEROMETRE ACCELEROMETRE ECROU DE MONTAGE CABLE ACCELEROMETRE DOUILLE DOUBLE HEXAGONE DOUILLE DOUBLE HEXAGONE DOUILLE A DOUBLE HEXAGONE DOUILLE DOUBLE HEXAGONE TRANSDUCTEUR DEPL TRANSISTOR CMS ROCHET REVERSIBLE 1/4´´ ROCHET REVERSIBLE 1/4´´ TRANSDUCTEUR DEPL BARRE DE BROYAGE 1/4´´ 50MM MARTEAU A PANNE ARRONDIE 450G THERMOCOUPLE DOUILLE DOUBLE HEXAGONE DOUILLE DOUBLE HEXAGONE ROCHET REVERSIBLE 3/8´´ BARRE EXTENSIBLE 3/8´´ 250MM DOUILLE 13MM SONDE A MAIN TYPE K SONDE A MAIN TYPE K SONDE A MAIN TYPE K ETUI POUR THERMOMETRE 155MM CABLE THERMOCOUPLE CABLE THERMOCOUPLE CABLE THERMOCOUPLE CABLE THERMOCOUPLE CABLE THERMOCOUPLE CABLE THERMOCOUPLE ROCHET REVERSIBLE 1/2´´ BARRE DE BROYAGE 1/2´´ BARRE EXTENSIBLE 1/2´´ ADAPTATEUR 3/8´´ CABLE THERMOCOUPLE CABLE THERMOCOUPLE CABLE THERMOCOUPLE CONNECTEUR THERMOCOUPLE CONNECTEUR THERMOCOUPLE CONNECTEUR THERMOCOUPLE CONNECTEUR THERMOCOUPLE CLE A MOLETTE 38CM CLE A MOLETTE 46CM CONNECTEUR THERMOCOUPLE CONNECTEUR THERMOCOUPLE CONNECTEUR THERMOCOUPLE PLUG STANDARD T/C TYPE R SELECTEUR DE THERMOCOUPLES THERMORUPTEUR 150DEG SONDE POUR CAPTEUR TRANSDUCTEUR DEPLACEMENT TORQUE WRENCH TORQUE WRENCH TORQUE WRENCH COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX COURROIE SYNCHROFLEX TORQUE WRENCH HEAD END FITTING,6MM END FITTING,7MM TORQUE DRIVER,PRESETTABLE,2-135CNM TORQUE DRIVER TORQUE DRIVER VACUUM CLEANER,HENRY PLUS POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX POULIE CLASSIQUE SYNCHROFLEX VACUUM CLEANER BAG,10PK VACUUM CLEANER BAG,10PK POINCON JEU 5PCS LONG POINCON JEU 8PCS ALUMINIUM BARRE CARREE 1 1/2´´X1/8´´ PQ5 ALUMINIUM BARRE CARREE 2´´X1/8´´ PQ5 ALUMINIUM BARRE CARREE 2´´X1/4´´ PQ5 ALUMINIUM BARRE RONDE 3/4´´ PQ5 FEUILLE D´ALUMINIUM 1.5MM PQ4 FEUILLE D´ALUMINIUM 2MM PQ4 TOURNEVIS A FRAPPER CUIVRE BARRE PLATE 20X6MM PQ4 CUIVRE BARRE PLATE 25X6MM PQ4 PLAQUE DE CUIVRE 0.9MM PQ4 DETECTEUR DE PROXIMITE DETECTEUR DE PROXIMITE PROG. UNITE PROX DETECTEUR DETECTEUR DE PROXIMITE COURROIE CONIQUE SPA PAS 1700 COURROIE CONIQUE SPA PAS 1900 COURROIE CONIQUE SPA PAS 2000 TOURNEVIS CONTINU CISEAUX TRANSDUCTEUR DE PRESSION PRESSURE EMETTEUR 0-400BAR G PRESSURE EMETTEUR 0-2.5BAR A COURROIE PROFIL A LONGUEUR 850 COURROIE PROFIL B LONGUEUR 930 COURROIE PROFIL B LONG. 1060 COURROIE PROFIL B LONG. 1100 COURROIE PROFIL B LONG. 1210 COURROIE PROFIL B LONG. 1240 COURROIE PROFIL B LONG. 1260 COURROIE PROFIL B LONG. 1310 COURROIE PROFIL B LONG. 1800 COURROIE PROFIL B LONG. 2330 COURROIE PROFIL B LONG. 2500 RESSORT AMORTISSEUR A GAZ PQ2 RESSORT AMORTISSEUR A GAZ PQ2 RESSORT AMORTISSEUR A GAZ PQ2 RESSORT AMORTISSEUR A GAZ PQ2 RESSORT AMORTISSEUR A GAZ PQ2 RESSORT AMORTISSEUR A GAZ PQ2 PLAQUE PRESENSIBILISEE SF 592X457 CENTRE PUNCH,AUTOMATIC LUBRICANT,AQUA,GEL,II,0.95L MECHE 1/4´´ HEX LONGUE PORTEE MECHE 1/4´´ HEX MECHE 1/4´´ HEX MECHE 1/4´´ HEX NUT DRIVER SET,9PC NUT SPINNER,FLEXIBLE SHAFT CONNECTEUR MALE TABOURET GRIS SOLUTION POUR PH METRE PH 4.01 SOLUTION ETALON PH 7.01 SOLUTION ETALON PH 10.01 CONDUCTIMETRE SOLUTION ETALON 1413 SOLUTION ETALON 84 PH METRE FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX FIXATIONS FLEXIBLES RADIAFLEX TESTEUR PH/ION/TEMP. HI-8424 MOUNT,DIABOLO,FLEXIBLE MOUNT,DIABOLO,FLEXIBLE FIXATION FLEXIBLE MINIFIX FIXATION FLEXIBLE MINIFIX CARTOUCHE CHAUFFANTE. 1/4´´ 100W CARTOUCHE CHAUFFANTE. 1/4´´ 250W CARTOUCHE CHAUFFANTE. 1/4´´ 125W CARTOUCHE CHAUFFANTE. 1/4´´ 220W CARTOUCHE CHAUFFANTE. 3/8´´ 250W CARTOUCHE CHAUFFANTE. 1/2´´ 500W CARTOUCHE CHAUFFANTE. 1/2´´ 315W DIABLE DIABLE PLIANT PROXIMITE COMMUTATEUR PROXIMITE COMMUTATEUR PROXIMITE COMMUTATEUR PROXIMITE COMMUTATEUR POULIE POUR COURROIE DETECTEUR DE PROXIMITE DETECTEUR DE PROXIMITE PNP DETECTEUR PHOTOELECTRIQUE COURROIE PAS L COURROIE PAS L PAINT,RUSTNOT,RED,500ML PAINT,RUSTNOT,BLUE,500ML PAINT PRIMER,RED OXIDE,500ML PAINT PRIMER,GREY,500ML LACQUER,CLEAR,ACRYLIC,500ML MACHOIRE SECURITE MULTIPLES CONDAMNATION CONNECT. GRAND CONDAMNATION PRISE ELEC. PETIT CONDAMNATION VANNES ROUGE 25 VALVE RADIATOR TUYAU RECUL JAUNE TUYAU RECUL JAUNE PIPE RING METRIC SWITCH,ROTARY CAM BOOK,GUIDE ELEC WORK REGS TEE POULIE POUR COURROIE CHAINE 3/4´´ 5M ROUE DENTEE PAS 3/4 POIGNEE 200/19 JAUNE POIGNEE 20/19 ROUGE POIGNEE 200/25 JAUNE POIGNEE 20/25 ROUGE MANCHON ACCOUPL. 2012 ALES. 35 TENDEUR DE CHAINE PAS 1/2´´ ALARM,SMOKE,IONIZATION,12V RIVET ACIER 3.2X12 PQ100 FIBRE GRIP,6 DEGREASER,JIZER,5L TOGGLE CLAMP TOGGLE CLAMP TOGGLE CLAMP TOGGLE CLAMP TOGGLE CLAMP TOGGLE CLAMP,PUSH PULL TOGGLE CLAMP,PUSH PULL TOGGLE CLAMP PRESS,MANUAL ASSEMBLY CLE A TUBE 12´´ CUTTER,TUBE,15-45MM MACHINE A CINTRER LES TUBES MINI SUPPORT POUR BROSSE LOURD UNITE DE CONTROLE BOUTON POUSSOIR BLOC DE CONTACTS DRIVER DE MOTEUR PAS A PAS RELAIS SURCHARGE RELAIS SURCHARGE DIGITAL CALIPER,8´´/200MM CALLIPERS,VERNIER 6´´/150MM PIED A COULISSE VERNIER 0-6´´ PIED A COULISSE VERNIER 0-8´´ CERAMIQUE MACOR BARRE RONDE 15 CERAMIQUE MACOR BARRE RONDE 20 MICROMETER,QUICKMIKE,0-1.2´´ MICROMETRE 0-25MM CERAMIQUE SHAPAL BARRE RONDE 10 CERAMIQUE SHAPAL BARRE RONDE 20 CERAMIQUE SHAPAL BARRE RONDE 25 TOOL CABINET,6DRAWER,COMPACT WELDING WIRE BOSTRAND WELDING WIRE BOSTRAND RAPPORTEURS EXTREMITE CARREE RAPPORTEUR 6´´/12´´LAMES RAPPORTEURS UNIVERSEL INTERCALAIRES RESSORT ECROU SOLIDE INTERCALAIRES RESSORT ECROU RAPIDE CIRCLIPS EXTERNE 4MM PQ100 CONTACTEURS 2NO SERI GC CONTACTEUR 2NO SERIE GC CONTACTEUR 4NO SERI GC CONTACTEUR 4NO SERI GC CONTACTEUR 4NO SERI GC CONTACTEUR AUXILIAIRE MICROMETRE 0-25MM GAUGE,MAGNETIC BASE RELAIS IMPULSION CONTACT 1F RELAIS IMPULSION CONTACT 1F+10 RELAIS IMPULSION CONTACT 2F ROUGHNESS GAUGE,COMPARAC DISPOSITIF DE POSITIONNEMENT SHIELD,SEALABLE FERMETURE A LEVIER MIXER,PLASTER 600G FERMETURE A LEVIER RACLOIR PEINTRE 3´´ RACLOIR PEINTRE 4´´ COUPE-VERRE LAMES PQ10 DISJONCTEUR POUR MOTEUR DISJONCTEUR POUR MOTEUR FERMETURE A LEVIER FERMETURE A LEVIER ROUE D´ENTRAINEMENT 2012 FERMETURE A LEVIER SERRURE REGULATEUR +6V REGULATEUR +8V REGULATEUR +18V LIDS BLACK AUXILIARY CONTACT PADLOCK ECROU EX PQ5 ECROU EX PQ5 ECROU EX PQ5 ECROU EX PQ5 T HYDRAULIQUE RONDELLE IP EX PQ5 RONDELLE IP EX PQ5 RONDELLE IP EX PQ5 CHAINE PORTE-CABLES BRACKET SUPPORT POUR CHEMINS DE CABLES CONDUIT FLEXIBLE LAMPE TORCHE STABEX MINI RACCORD POUR TUBE FLEXIBLE METAL PQ10 RACCORD POUR TUBE FLEXIBLE METAL PQ10 RACCORD POUR TUBE FLEXIBLE METAL PQ10 FIN DE COURSE EX SUBMINIATURE FILTER,ROLL,WASHABLE,EU3 TESTER,DETECTOR,SMK AEROSL DISPENSR SOCKET,2 TRAVERSEE DE CLOISON 4MM BROSSE 80MM 20MM ALESAGE ELECTROMAGNET,TYPE 58 ELECTROMAGNET,TYPE 58 ELECTROMAGNET,TYPE 58 DOOR RETAINER,24VDC DOOR RETAINER,240VAC C.C.T.V.,VIDEO OVERLAY BOARD REGULATEUR +5V REGULATEUR +9V REGULATEUR +12V VALVE,BALL BRASS 2´´ BSP SOCKET REDUCING GALV CONNECTEUR 12 BROCHES REGULATEUR CMS +8V REGULATEUR CMS +8V REGULATEUR CMS +9V REGULATEUR CMS +9V REGULATEUR CMS +15V REGULATEUR CMS +15V REGULATEUR CMS +18V REGULATEUR CMS +18V REGULATEUR CMS +24V REGULATEUR CMS +24V REGULATEUR CMS -9V REGULATEUR CMS -9V REGULATEUR LDO 1A +3.3V 1117 SOT-223-3 REGULATEUR LDO 1A +3.3V 1117 SOT-223-3 REFERENCE DE TENSION TOLERANCE 0.5% REFERENCE DE TENSION TOLERANCE 1% CMS DETECTEUR CAPTEUR DE FENTE DETECTEUR OPTIQUE DETECTEUR OPTIQUE DETECTEUR OPTIQUE FLTR-REG-LUBR EXCELON 74 FILTRE 1/2´´ EXCELON 74 REGULATEUR 1/2´´ EXCEL74 MARKING PAINT,YELLOW,750ML PROXIMITE COMMUTATEUR PRESSURE COMMUTATEUR PRESSURE COMMUTATEUR PRESSURE COMMUTATEUR PRESSURE COMMUTATEUR PRESSURE COMMUTATEUR REED PROXIMITE COMMUTATEUR ROULEMENT A BILLE VERRE 10MM DETECTEUR PHOTOELECTRIQUE MINIATURE PROXIMITE COMMUTATEUR TESTER MOUNTING BRACKET DETECTEUR PHOTOELECTRIQUE CAPTEUR FAISCEAU TRAVERSANT COUPLAGE. 4X4 COUPLAGE. 6X6 COUPLAGE. 1/4X1/4 COUPLAGE. 6X6 COUPLAGE. 10X10 COUPLAGE. 12X12 COUPLAGE. 3X3 COUPLAGE. 5X5 COUPLAGE. 3/8X3/8 COUPLAGE. 10X10 COUPLAGE. 6X6 COUPLAGE MOTEUR 14X14 SOCKET,1GANG,NON-SWITCHED SOCKET SWITCHED,SP,NEON CAPTEUR DE DEBIT D AIR CAPTEUR DE DEBIT D AIR SOCKET,SURFACE,13A,1GANG SOCKET,SURFACE,13A,2GANG SOCKET,SURFACE,13A,1GANG SOCKET,SURFACE,13A,2GANG SOCKET,RCD,30MA,PASSIVE CONNECTION UNIT,SWITCHED CONNECTION UNIT,NEON,2 POLE FRONT PLATE,ALUMINIUM,1GANG FRAME,MOUNTING,1GANG FRONT PLATE,1GANG,WHITE SWITCH,10A,1POLE,1WAY SWITCH,10A,1POLE,2WAY SWITCH,20A,1WAY SWITCH,20A,2WAY SURFACE BOX,GRID+,1 OR 2GANG CABLE EXTENSION PRT SONDE TEMPERATURE SONDE TEMPERATURE BLOC CONNECTEUR ROULEMENT FIX. CHASSIS 25MM BARRIERE EX CONTACT AUXILIAIRE TIMER ETOILE TRIANGLE WIRE TWISTING PLIER PINCE A CIRCLIPS INTERNE 180MM CISAILLE LONGUE LAME MICROSCOPE,LONG REACH EYEPIECE,20X MAGNIFICATION EYEPIECE,10X MAGNIFICATION,METRIC ECROU CAPTIF NO10 PQ100 PINCE A DENUDER PINCE A DENUDER COUTEAU POUR CABLE JOKARI TOURNEVIS DUOSUPSLIM JEU DE 5 DETECTEUR PHOTOELECTRIQUE MINIATURE REFLECTEUR COFFRET INSTRUMENT COFFRET INSTRUMENT COFFRET ABS COFFRET ABS COFFRET ABS CLE DYNAMOMETRIQUE 8-60NM 3/8 CLE DYNAMOMETRIQUE 40-200NM 1/2 DETECTEUR PHOTOELECTRIQUE DETECTEUR PHOTOELECTRIQUE DETECTEUR PHOTOELECTRIQUE DETECTEUR PHOTOELECTRIQUE DETECTEUR PHOTOELECTRIQUE DETECTEUR DE PROXIMITE AIMANT COFFRET PORTATIF REFLECTEUR RECTANGULAIRE DETECTEUR PHOTOELECTRIQUE FIBE OPTIQUE COFFRET PORTATIF INDICATEUR INDICATEUR INDICATEUR AIMANT AIMANT CAPTEUR MODULE MOTION DETECTEUR D INCLINAISON DETECTEUR DE PRESSION COMMUTATEUR DE PRESSION COMMUTATEUR DE PRESSION COMMUTATEUR DE PRESSION CAPOT COMMUTATEUR DE PRESSION BASCULE 15KG TRIPODE POUR NIVEAU LASER ´VALISE DE TRANSPORT ALU ´VALISE DE TRANSPORT ALU ´VALISE DE TRANSPORT ALU BOITIER ALUMINIUM TAILLE BOITIER ALUMINIUM TAILLE LECTEUR DE CARTE SAC A OUTIL FOND RIGIDE RELAIS PROCESS SEUIL RELAIS PROCESS SEUIL RELAIS PROCESS SEUIL RELAIS PROCESS SEUIL RELAIS PROCESS CONVERTISSEUR RELAIS PROCESS FREQUENC RELAIS CONTROLE THERMOS TEMPORISATEUR ELECTRONIQUE MULTIFUNCTION TEMPORISATEUR ELECTRONIQUE MULTIFUNCTION COFFRET ALUMINIUM PEINT ROUE DE MESURE CODEUR ROTATIF CODEUR ROTATIF CODEUR ROTATIF DETECTEUR DE CONTRASTE DETECTEUR PHOTOELECTRIQUE FOURCHE DETECTEUR PHOTOELEC. DIFFUSEURE COFFRET ALUMINIUM PEINT TRANSDUCTEUR DE COURANT PIED 15MM PQ50 COFFRET ALUMINIUM PEINT KIT SUPPORT MURAL PQ2 ATTACHE POUR TUYAU TAILLE D KIT SUPPORT MURAL PQ2 ATTACHE POUR TUYAU TAILLE M BOUCHON 14MM PQ20 COFFRET NOIR IP66&68 CAPTEUR DE PRESSION TOURNEVIS FENTE 3.5X75 ERG TOURNEVIS FENTE 4X100 ERGO TOURNEVIS FENTE 6.5X50 ERG TOURNEVIS FENTE 8X125 ERGO TOURNEVIS FENTE 6.5X25 ERG TOURNEVIS PHILLIPS 0X60 E TOURNEVIS PHILLIPS 2X100 TOURNEVIS PHILLIPS 3X150 TOURNEVIS HEXBALL 4X110 E TOURNEVIS HEXBALL 5X110 E TOURNEVIS HEXBALL 6X140 E TOURNEVIS POZI 0X60 ERGO TOURNEVIS POZI 2X100 ERGO TOURNEVIS POZI 3X150 ERGO TOURNEVIS POZI 2X25 ERGO TOURNEVIS TORX INVIOLABLE T15 ER TOURNEVIS TORX INVIOLABLE T25 ER TOURNEVIS TORX T6 ERGO TOURNEVIS TORX T7 ERGO TOURNEVIS TORX T9 ERGO TOURNEVIS ECROU 3X125 ERG COFFRET GRIS IP66&68 TOURNEVIS ECROU 4X125 ERG TOURNEVIS ECROU.5X125 ERG TOURNEVIS ECROU 6X125 ERG TOURNEVIS ECROU 7X150 COFFRET GRIS IP66&68 TOURNEVIS JEU FENTE/PHIL 6 TOURNEVIS JEU FENTE/POZI 6 TOURNEVIS JEU TORX 5PC ER CUTTERS 106MM CLE A DOUILLE DOUBLE 10MM CLE A DOUILLE DOUBLE 13MM COFFRET GRIS IP66&68 COFFRET GRIS IP66 PINCE A CIRCLIPS 10-48 I&E POINTES POUR PINCE A CIRCLIP POINTES POUR PINCE A CIRCLIP LIME JEU 8´´/200MM 3PC VIS BUTTON. T10. #10X19. PK10 DISTRIBUTEUR DE FIL 2 AXES DISTRIBUTEUR DE FIL 4 AXES CHARIOT GUIDE SUR RAIL MULTIMETRE DE TABLE DRIP PAN SORBENT FILLED RUBAN TRANSFERT THERM. NOIR RUBAN HANDIMARK NOIR 12.7MM VELCRO 5M ROULEAU CREAM,M6290/12 E45,50GM BAGUE ACIER INOXYDABLE 3MM ETRIER POUR CABLE EN ACIER INOX 5MM DIAL BORE GAUGE,50-150MM EMBASE SPEAKON FEMELLE 8P COUPLEUR SPEAKON 8P CONE,76CM CLE HEXAGONALE 6MM CLE HEXAGONALE A/F 7 PIECES 3/32´´ A PINCE REGLABLE CUTTER,CABLE,10´´ CORDON XLR-XLR CORDON XLR-XLR CORDON XLR-XLR CORDON XLR-XLR CORDON XLR-XLR LENTILLE METEOR CLAIRE MULTIMETRE ANALOGIQUE MULTIMETRE ET PINCE AMP. BOOK,HOME SECURITY BOOK,MAINTENANCE STRATEGY BOOK,16TH EDITION,BROWN COPY 2004 MODULE EMPILABLE BLEU AMPOULE 130V BOOK,WELDERS BIBLE OXYACET. RACCORD MANIFOLD CON TOURNEVIS ANTISTATIQUE JEU JEU DE TOURNEVIS 8P CUTTER,WIRE ROPE KIT NETTOYAGE JET D´ENCRE KIT NETTOYAGE LECTEUR LASER SONDE DE TEMPERATURE PT100 SONDE DE TEMPERATURE PT100 TABLE GUIDE COUTEAU DOUBLE FIL CAPTEUR DE CHARGE 5KG BATTERIE 24V 3AH BATTERY PACK,12V,2AH SOLVANT NETTOYANT 200ML BROSSE CUTTERS 120MM VERNIS PROTECTEUR 1LITRE CLIP SERRE-CABLE 22.4MM FORET HI-NOX POUR ACIER INOXYDABLE 5/32´´ HOSE,GREASE GUN,RUBBER,9´´ HOSE,GREASE GUN,RUBBER,12´´ HOSE,GREASE GUN,RUBBER,18´´ CONNECTEUR CONNECTEUR GREASE PUMP,LEVER OPERATION AUTOMATE THERMOCOUPLE CHARIOT A DEUX ETAGERES CHARIOT A TROIS RAYONS BLEUT MARCHES UNITE MOBILE RAIL LINEAIRE REGULATEUR CMS 5V REGULATEUR CMS 5V REGULATEUR 3.3V REGULATEUR CMS 3.3V REGULATEUR CMS 3.3V CIRCULAR CONNECTOR PLUG SIZE 14,12POS,CABLE CAPACITOR CERAMIC 680PF 50V,C0G,5%,0603 CAPACITOR CERAMIC 910PF 50V,C0G,5%,0603 CONNECTOR,XLR,JACK,3POS CONNECTOR,XLR,PLUG,3POS CONNECTOR,XLR,JACK,5POS CONNECTOR,XLR,PLUG,5POS CONNECTORS,BNC RF/COAXIAL BNC BHD JACK STR 75 OHM SOLDER RF/COAXIAL,BNC JACK,STR,75 OHM,SOLDER RF/COAXIAL ADAPTER,F PLUG-F JACK RF/COAXIAL ADAPTER,F JACK-F JACK CONNECTOR,XLR,JACK,3POS CONNECTOR,XLR,PLUG,3POS CONNECTOR,XLR,JACK,5POS ADAPTER,XLR RCPT TO XLR RCPT ADAPTER,XLR PLUG TO XLR PLUG ADAPTER,XLR RCPT TO STEREO PLUG ADAPTER,XLR PLUG TO STEREO PLUG XLR AUDIO CABLE,25FT,BLACK CONNECTOR,RCA/PHONO,PLUG,2POS CONNECTOR,RCA/PHONO,PLUG,3POS ADAPTER,MONO RCPT TO RCA RCPT CONNECTOR,RCA/PHONO,JACK,1POS DOUBLE BINDING POST,30A,BLACK DOUBLE BINDING POST W/ BASE,30A,12AWG CORDON ASSEMBLE 25FT CABLE CIRCULAR CONN,RCPT,SIZE 20 17POS,BOX PQFP Socket CONNECTOR,SPEAKER,JACK,4POS CONNECTOR,SPEAKER,PLUG,4POS CONNECTOR,SPEAKER,PLUG,4POS CONNECTOR,RCA/PHONO,JACK CONNECTOR,RCA/PHONO,JACK CONNECTOR,RCA/PHONO,JACK CONNECTOR,RCA/PHONO,JACK CONNECTOR,RCA/PHONO,JACK CONNECTOR,RCA/PHONO,PLUG Wall-Mount Single-Door Enclosure NEMA Ty NEMA Type 4X Wall-Mount Continous Hinge CONSOLETS PEDESTAL COLUMN CONNECTOR,RCA/PHONO,JACK,1POS CIRCULAR CONNECTOR ADAPTER CIRCULAR CONNECTOR ADAPTER CIRCULAR CONNECTOR ADAPTER CIRCULAR CONNECTOR RCPT SIZE 14,18POS, CIRCULAR CONN,RCPT,SIZE 16,3POS,BOX CIRCULAR CONNECTOR PLUG SIZE 10SL 2POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 14,19POS,CABLE COAXIAL CABLE ASSEMBLY RELAY SOCKET RUBAN TISSU DE VERRE 12MMX55M Circular Connector RJ45 ETHERNET CONNECTOR,JACK 8WAY PANEL RUBAN TISSU DE VERRE 12MMX55M CIRCULAR CONN,RCPT,SIZE 14S,4POS,BOX CAPACITOR CERAMIC 1000PF 50V,C0G,5%,0603 CIRCULAR CONN,RCPT,SIZE 20 14POS,BOX Heavy Duty Power Relay CIRCULAR CONNECTOR PLUG SIZE 10SL 3POS,CABLE CAPACITOR CERAMIC 2.2UF,6.3V,X5R,0603 CIRCULAR CONNECTOR ADAPTER TERMINAL BLOCK MARKER,51 TO 100,6MM Solid-State Panel Mount Relay COAXIAL CABLE ASSEMBLY COAXIAL CABLE ASSEMBLY DIODE DE SUPPRESSION 12V BOITIER SO DIODE DE SUPPRESSION 15V BOITIER SO DIODE DE SUPPRESSION 15V BOITIER SO DIODE DE SUPPRESSION 15V BOITIER SO DIODE DE SUPPRESSION 15V BOITIER SO DIODE DE SUPPRESSION 22V BOITIER SO DIODE DE SUPPRESSION 22V BOITIER SO DIODE DE SUPPRESSION 22V BOITIER SO DIODE DE SUPPRESSION 33V BOITIER SO DIODE DE SUPPRESSION 33V BOITIER SO DIODE DE SUPPRESSION 33V BOITIER SO DIODE DE SUPPRESSION 33V BOITIER SO DIODE DE SUPPRESSION 48V BOITIER SO DIODE DE SUPPRESSION 48V BOITIER SO DIODE DE SUPPRESSION 5.0V BOITIER SO DIODE DE SUPPRESSION 5.0V BOITIER SO DIODE DE SUPPRESSION 5.0V BOITIER SO DIODE DE SUPPRESSION 6.0V BOITIER SO DIODE DE SUPPRESSION 6.0V BOITIER SO DIODE DE SUPPRESSION 6.0V BOITIER SO DIODE DE SUPPRESSION 6.0V BOITIER SO DIODE DE SUPPRESSION 9.0V BOITIER SO DIODE DE SUPPRESSION 12V BOITIER SO DIODE DE SUPPRESSION 12V BOITIER SO DIODE DE SUPPRESSION 15V BOITIER SO DIODE DE SUPPRESSION 15V BOITIER SO DIODE DE SUPPRESSION 24V BOITIER SO DIODE DE SUPPRESSION 24V BOITIER SO DIODE DE SUPPRESSION 30V BOITIER SO DIODE DE SUPPRESSION 30V BOITIER SO DIODE DE SUPPRESSION 5.0V BOITIER SO DIODE DE SUPPRESSION 5.0V BOITIER SO DIODE DE SUPPRESSION 5.0V BOITIER SO DIODE DE SUPPRESSION 7.5V BOITIER SO DIODE DE SUPPRESSION 7.5V BOITIER SO DIODE DE SUPPRESSION 7.5V BOITIER SO PONT REDRESSEUR 4A 100V DIODE CMS 1.0A 50V DIODE CMS 1.0A 400V DIODE CMS 1.0A 600V DIODE CMS 1.5A 50V DIODE CMS 1.5A 400V DIODE CMS 3A 50V DIODE CMS 3A 200V DIODE CMS 3A 400V DIODE CMS 3A 600V DIODE ULTRA-RAPIDE DIODE SCHOTTKY 1A 30V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 3A 50V DIODE SCHOTTKY 3A 60V DIODE SCHOTTKY 5A 30V DIODE SCHOTTKY 5A 40V CD-RW 80MIN 10X BTE10 DVD-RW 4.7GO 2X BTE5 PINCE A SERTIR HAN C INSERT FEMELLE HAN K 6/36P RESISTOR WIREWOUND,200 OHM,225W,±5% BANDE 19MM ROUGE/BLANCHE GASKET,16S/16 SHELL SIZE,CIRCULAR CONN TRIAC,800V,25A,TO-220AB CABLE POUR MONITEUR MICRO SWITCH,ROLLER LEVER,SPDT 3A 125V SHLD MULTICOND CABLE,3COND,20AWG,500FT,300V CIRCULAR CONNECTOR,RECEPTACLE 14-12 BOX STATIC PROTECTION WRIST GROUNDER STATIC PROTECTION MAT,48IN Static Protection Mat Roll Length:50ft CIRCULAR CONNECTOR RECEPTACLE 3POS CABLE GASKET,10S/10SL SHELL CIRCULAR CONN GASKET,22 SHELL SIZE,CIRCULAR CONN CIRCULAR CONNECTOR,PLUG,4POS,CABLE CIRCULAR CONNECTOR RECEPTACLE 4POS CABLE CIRCULAR CONN,RCPT,SIZE 12,10POS,BOX CIRCULAR CONNECTOR,PLUG,10POS,CABLE STATIC PROTECTION WRIST GROUNDER DETECTEUR D´INCLINAISON DETECTEUR OPTIQUE SUPPORT DE FIX. POUR W36 CELLULE AMPLI FIBRE OPT FIBRE OPTIQUE FIBRE OPTIQUE REFLECTEUR ISOLATION AMPLIFIER ISOLATION AMPLIFIER DOUBLE POINTED TIPPED COTTON SWABS P CHANNEL MOSFET,-500V,2A,TO-220 RACCORD FLEXIBLE RACCORD FLEXIBLE CAPTEUR DE DEBIT PNEUMATIQUE CAPTEUR DE DEBIT PNEUMATIQUE CAPTEUR DE DEBIT PNEUMATIQUE DEBITMETRE EAU DETECTEUR OPTIQUE DETECTEUR OPTIQUE DETECTEUR DE PROXIMITE OPTIQUE DETECTEUR DE CONTRASTE CAPTEUR DE PRESSION 0-1PSID CAPTEUR DE PRESSION 5 PSID CAPTEUR DE PRESSION 5 PSIG CAPTEUR DE PRESSION 0-1PSIG CAPTEUR DE PRESSION 0-30PSIG CAPT. DE PRESSION 0-250PSI CAPT.DE PRESSION 0-7´´H2O CAPT.DE PRESS. 0-14´´H2O CAPTEUR DE PRESSION 0-28´´H2O CAPTEUR DE PRESSION 0-10´´H2 CAPTEUR DE PRESSION 2.5´´H2O CAPTEUR DE PRESSION 0-5´´H2O DETECTEUR DE PRESSION COMPTEUR ELECTRONIQUE DETECTEUR DE NIVEAU DETECTEUR DE PROXIMITE DETECTEUR D´INCLINAISON Wire-To-Board Connector WIRE WRAP WIRE,50FT,30AWG,CU,WHT/BLU/RED WIRE WRAPPING WIRE,100FT,26AWG CU BLUE WIRE WRAPPING WIRE,100FT,24AWG CU BLUE WIRE WRAPPING WIRE,100FT,24AWG CU,RED WIRE WRAPPING WIRE,100FT 24AWG CU WHITE WIRE WRAPPING WIRE,100FT 26AWG CU BLACK WIRE WRAPPING WIRE,100FT,30AWG CU,RED WIRE WRAPPING WIRE,100FT 28AWG CU WHITE WIRE WRAPPING WIRE 1000FT 30AWG CU BLACK WIRE WRAPPING WIRE,100FT 26AWG CU WHITE INTERRUPTEUR ECLAIRE AMBRE INTERRUPTEUR A PEDALE INTERRUPTEUR A PEDALE BOUTON POUSSOIR PNEUMATIQUE COMMUTATEUR SPDT COMMUTATEUR A BASCULE SPST NOIR COMMUTATEUR ON/OFF ILLUM COMMUTATEUR POUSSOIR COMMUTATEUR POUSSOIR MICROCONTROLEUR 8 BITS FLASH 1K COMMUTATEUR POUSSOIR MICROCONTROLEUR 8 BITS FLASH 4K CMS TEMPORISATEUR 24HR TIMER MULTIFUNCTION 12VDC TIMER MULTIFUNCTION 12VDC TIMER MULTIFUNCTION 12VDC LUMINAIRE,2-ARMS,ES,60W,IP20 TRANSISTOR MOSFET CANAL N BOITIER TO-264 TRANSISTOR MOSFET CANAL N SOT-227B CARTE DE DEMO. DSPICDEM MC1 ELECTRICAL POWER FUSE DIODE CMS 100V 0.2A DIODE 50V 1A CMS DIODE 50V 1A CMS DIODE 100V 1A CMS DIODE 100V 1A CMS DIODE 400V 1A CMS DIODE 400V 1A CMS DIODE 1000V 1A CMS DIODE 1000V 1A CMS PONT REDRESSEUR CMS 0.5A 800V PONT REDRESSEUR CMS 0.5A 800V PONT REDRESSEUR CMS 0.5A 1000V PINCE A SERTIR VL61 PINCE A SERTIR COSSE OEILLET 3 COSSE OEILLET 4 COSSE OEILLET 6 LIGHT,LANTERN+PIR CABLE TIE MOUNT Panel for QLINE Series Polycarbonate Enc Panel for QLINE I Enclosure Ceramic Multilayer Capacitor CERAMIC MULTILAYER CAPACITOR SERIES:HIGH PLUG AND SOCKET CONNECTOR HOUSING PLUG AND SOCKET CONNECTOR HOUSING CONTACT,20-16AWG,CRIMP PATTE DE FIXATION REGULATEUR DE TEMP. 12VAC/DC REGULATEUR DE TEMP. 24VAC ADAPTATEUR 1/16DIN REGULATEUR DE TEMPERATURE 230VAC REGULATEUR DE TEMPERATURE 115VAC REGULATEUR DE TEMPERATURE 230VAC ADAPTATEUR 1/4DIN COFFRET MINIATURE ABS CAPACITOR CERAMIC 1000PF,50V,X7R,10%,0402 CAPACITOR CERAMIC 0.01UF,25V,X7R,10%,0402 TERMINAL BLOCK,BARRIER,10POS,22-12AWG TERMINAL BLOCK,BARRIER,12POS,22-12AWG TERMINAL BLOCK,BARRIER,14POS,22-12AWG TERMINAL BLOCK,BARRIER,15POS,22-12AWG TERMINAL BLOCK,BARRIER,16POS,22-12AWG TERMINAL BLOCK,BARRIER,18POS,22-12AWG TERMINAL BLOCK,BARRIER,2POS,22-12AWG TERMINAL BLOCK,BARRIER,3POS,22-12AWG TERMINAL BLOCK,BARRIER,4POS,22-12AWG TERMINAL BLOCK,BARRIER,6POS,22-12AWG TERMINAL BLOCK,BARRIER,7POS,22-12AWG TERMINAL BLOCK,BARRIER,8POS,22-12AWG TERMINAL BLOCK,BARRIER,9POS,22-12AWG Standard Terminal Block TERMINAL BLOCK,BARRIER,4POS,22-10AWG TERMINAL BLOCK,BARRIER,6POS,22-10AWG TERMINAL BLOCK,BARRIER,8POS,22-10AWG TERMINAL BLOCK,BARRIER,20POS,22-12AWG TERMINAL BLOCK,BARRIER,22POS,22-12AWG TERMINAL BLOCK,BARRIER,24POS,22-12AWG TERMINAL BLOCK,BARRIER,25POS,22-12AWG TERMINAL BLOCK,BARRIER,28POS,22-12AWG TERMINAL BLOCK,BARRIER,30POS,22-12AWG TERMINAL,MALE DISCONNECT,6.35MM,RED TERMINAL,MALE DISCONNECT,6.35MM,BLUE Power Relay Plug-In Relay RELAYS,PUSHON CONNECTOR COIL VOLTAGE DC Plug-In Relay Switch Function:DPDT USB CONNECTOR,RECEPTACLE,4POS,SOLDER CAT5 RJ45 MODULAR JACK,8POS,1 PORT MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS TRANSISTOR JFET NTC THERMISTOR NTC Thermistor CAPACITOR CERAMIC 0.01UF,25V,X7R,10%,0402 CAPACITOR CERAMIC 100PF 50V,C0G,5%,0603 CAPACITOR CERAMIC 150PF 50V,C0G,5%,06 CAPACITOR CERAMIC 0.01UF,50V,X7R,5%,0603 CAPACITOR CERAMIC 0.01UF,50V,X7R,10%,0603 CAPACITOR CERAMIC,0.1UF,25V,X7R,10%,0603 CAPACITOR CERAMIC 47PF 50V,C0G,10%,0805 CAPACITOR CERAMIC,0.1UF,50V,X7R,10%,0805 CAPACITOR CERAMIC 0.022UF 50V,X7R,10%, CAPACITORS,CERAMIC MULTI-LAYER PACKAGE/ CAPACITOR CERAMIC 120PF 100V,C0G,5%,1206 Ceramic Multilayer Capacitor CAPACITOR CERAMIC 0.01UF 100V,X7R,5%, CAPACITOR CERAMIC 0.39UF,25V,X7R,10%,1206 CAPACITOR CERAMIC 0.01UF 50V,C0G,5%,1210 Ceramic Multilayer Capacitor Capacitance CAPACITOR CERAMIC 0.015UF 100V,C0G,5%, CAPACITORS,CERAMIC MULTI-LAYER PACKAGE/ Ceramic Multilayer Capacitor Capacitance Solenoid Spring Kit TRANSISTOR DE PUISSANCE CAPACITOR ALUM ELEC 250UF,6V,+75,-10%,AXIAL CAPACITOR ALUM ELEC 30UF,25V,+75,-10%,AXIAL CAPACITOR ALUM ELEC,500UF,35V,AXIAL CAPACITOR ALUM ELEC,300UF,50V,AXIAL CAPACITOR ALUM ELEC,8UF,150V,AXIAL CAPACITOR ALUM ELEC,50UF,450V,AXIAL SFTP ETHERNET CABLE,CAT5E,2.5FT,BLACK SFTP ETHERNET CABLE,CAT5E,5FT,BLACK SFTP ETHERNET CABLE,CAT5E,15FT,BLACK ENGINEERING MATERIALS,GASKET WOVEN HOOK RECLOSEABLE FASTENER,BLACK,1 ´´ Conductive Plastic Potentiometer Conductive Plastic Potentiometer POT,COND PLASTIC,2KOHM,3%,500mW MOUNTING FOOT KIT FOR QLINE ENCLOSURE DIODE SCHOTTKY 1A 40V KIT D´INDUCTANCE 10X10 SELF DE CHOC CONVERT. A/N BUS 1812 11UH SELF DE CHOC CONVERT. A/N BUS 1812 22UH SELF DE CHOC CONVERT A/N BUS 1812 22UH SELF DE CHOC CONVERT A/N BUS 1812 22UH SELF DE CHOC CONVERT. A/N BUS 1812 51UH MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE TRMS MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE TRMS PLATE,MOUNTING,9´´-12´´ FIXING ELEMENT,HAN E AV/ES AV TERMINAL BLOCK TRANSISTOR PROFET FUSE,CARTRIDGE,15A,6.3X25.4MM FST ACT FUSE,BLADE,4A,32V,FAST ACTING FUSE,CARTRIDGE,7A,6.3X25.4MM,FST ACT FUSE,ALARM INDICATING,4A,FAST ACTING FUSE BLOCK,6.3 X 32MM,BOLT-IN MOUNT FUSE BLOCK,6.3 X 32MM,BOLT-IN MOUNT CAPACITOR TANT,22UF,15V,AXIAL 10% CAPACITOR TANT,10UF,50V,0.65 OHM,0.2,SMD CAPACITOR TANT,220UF,10V,0.13OHM,10% CAPACITOR TANT,47UF,35V,0.28 OHM,0.1,SMD POWER RELAY,SPDT,120VAC,10A,PLUG IN POWER RELAY,SPDT,24VAC,10A,PLUG IN POWER RELAY,SPDT,240VAC,10A,PLUG IN POWER RELAY,SPDT,12VDC,10A,PLUG IN POWER RELAY,SPDT,6VDC,10A,PLUG IN POWER RELAY,SPDT,24VDC,10A,PLUG IN Plug-In Relay POWER RELAY,SPDT,120VAC,10A,PLUG IN POWER RELAY,SPDT,24VAC,10A,PLUG IN POWER RELAY,SPDT,240VAC,10A,PLUG IN POWER RELAY,SPDT,24VDC,10A,PLUG IN POWER RELAY,SPDT,12VDC,10A,PLUG IN POWER RELAY,SPDT,24VDC,10A,PLUG IN POWER RELAY,SPDT,24VDC,10A,PLUG IN POWER RELAY,DPDT,12VAC,5A,PLUG IN POWER RELAY,DPDT,120VAC,5A,PLUG IN POWER RELAY,DPDT,24VAC,5A,PLUG IN POWER RELAY,DPDT,240VAC,5A,PLUG IN POWER RELAY,DPDT,12VDC,5A,PLUG IN POWER RELAY,DPDT,6VDC,5A,PLUG IN POWER RELAY,DPDT,24VDC,5A,PLUG IN POWER RELAY,DPDT,120VAC,5A,PLUG IN POWER RELAY,DPDT,24VAC,5A,PLUG IN POWER RELAY,DPDT,12VDC,5A,PLUG IN POWER RELAY,DPDT,24VDC,5A,PLUG IN POWER RELAY,DPDT,24VDC,5A,PLUG IN CAPACITOR TANT,1UF,25V,RADIAL 10% CAPACITOR TANT,10UF,50V,RADIAL 10% CAPACITOR TANT,4.7UF,25V,RADIAL 10% VOYANT NEON ROUGE VOYANT NEON VERT VOYANT NEON AMBRE VOYANT NEON ROUGE VOYANT NEON AMBRE Driver IC Wall Switch IC,QUAD NAND R/S-LATCH,3-STATE,SOIC16 IC´S IC,SINGLE OR GATE,2I/P,SOT-23-5 VOYANT A FILAMENT ROUGE FUSE,ALARM INDICATING,15A,FAST ACTING VOYANT A FILAMENT VERTICALE IC,8BIT FET BUS SWITCH,QFN-20 CORDON JACK4.4 BANTAM 0.45M NOIR IC,NON INVERTING TRANSCEIVER,LFBGA-96 CORDON JACK4.4 BANTAM 0.45M ROUGE Clock IC IC,DIGITAL AUDIO TRANSMITTER,TSSOP-28 IC,RS-232 TRANSCEIVER,5.5V,SSOP-20 IC,RS-232 TRANSCEIVER,5.5V,TSSOP-20 IC,3I/P SINGLE DECODER/DEMUX,SOIC-16 FILTRE FRONT END SAW 433.92MHZ FILTRE FRONT END SAW 868.30MHZ FILTRE FRONT END SAW 868.30MHZ IC,HEX INVERTER,SCHMITT TRIGGER,SOP14 EMBASE JACK 4.4 BANTAM IC,INVERTING BUFFER,VSSOP-8 IC,RS-232 TRANSCEIVER,5V,WSOIC-16 IC,VIDEO DECODER,10BIT 30MSPS HTQFP-80 IC,RS-232 TRANSCEIVER,5.5V,SSOP-16 RJ FIELD ETHERNET CONN,JACK,8WAY PANEL IC,RS-232 TRANSCEIVER,5V,DIP-16 RJ FIELD ETHERNET CONNECTOR RCPT 8WAY JAM NUT FUSE,ALARM INDICATING,7.5A,FAST ACT ENGINEERING MATERIALS,GASKET PINCE A SERTIR HYDRAULIQUE JEU DE MORS 6MM JEU DE MORS 10MM JEU DE MORS 16MM JEU DE MORS 25MM MACHOIRE 35MM JEU DE MORS 50MM HAUT PARLEUR MARINE 15W 100 FICHE 2MM VERS PINCE CROCODILE-ROUG FICHE 2MM VERS PINCE CROCODILE-NOIR FICHE 2MM VERS PINCE CROCODILE-ROUG CORDON DE TEST NOIR 1M-2MM CORDON DE TEST ROUGE 1M-2MM EMBASE A PICOTS CARRES M/GRID 6 VOIES EMBASE A PICOTS CARRES M/GRID 8 VOIES EMBASE A PICOTS CARRES M/GRID 14 VOIES SLEEVING,EXPANDABLE,4.217MM,SILVER GREY,100FT CRIMP DIE,8000 & 1300 SERIES CRIMP TOOL PHOTORESISTANCE AXE 30MM EMBASE FEMELLE 23V CONNECTEUR F RG59 PQ 20 KIT SERVICE PREMISE AMP/KRONE OUTIL SERTISSAGE AMP TOUT EN UN DENUDEUR POUR FIBRE OPTIQUE IC,HALL EFFECT SENSOR,BIPOLAR,SIP-4 CIRCULAR CONNECTOR,PLUG,12POS,CABLE Lamp Socket Leaded Process Compatible:No Lens Cap CABLE & WIRE DISPENSER PINCE A SERTIR MANUELLE SWITCH,ROCKER,DPDT,12A,GREEN SWITCH,ROCKER,DPDT,12A,BLACK Rocker Switch INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR INDUCTIVE PROXIMITY SENSOR SOLID STATE TIMER Solid-State Timer MULTIMEDIA CONNECTOR Wall Switch Outlet Plate BOITIER MATE-N-LOK 2P DISTRIBUTION BOARD,6WAY,13A,WHITE CORDON 0.5M CORDON 2M POWER INDUCTOR 1.5UH 7.2A 30% 65MHZ INDUCTOR,SHIELDED,10UH,900MA,SMD INDUCTOR,SHIELDED,100UH,700MA,SMD POWER RELAY,SPST-NO,24VDC,15A,PANEL TERMINAL,SOLDER SLEEVE,2.8MM,CLEAR TERMINAL,SOLDER SLEEVE,2.5MM,CLEAR TERMINAL,SOLDER SLEEVE,6.8MM,CLEAR TERMINAL,SOLDER SLEEVE,1.9MM,BLUE TERMINAL,SOLDER SLEEVE,5.95MM,BLUE TERMINAL,SOLDER SLEEVE,7MM,BLUE TERMINAL,SOLDER SLEEVE,2.33MM,BLUE TERMINAL,SOLDER SLEEVE,3.5MM,YELLOW Current Transformer Outlet Surge Suppressor Transient Energy RF/COAXIAL,20KV HIGH VOLT PLUG,STRAIGHT,CRIMP CIRCULAR CONNECTOR PLUG,SIZE 20,8POS,PANEL CIRCUIT LOGIQUE COMPARATEUR QUADRULE IC,RS-485 TRANSCEIVER,5.5V,SOIC-8 IC,LINEAR VOLTAGE REGULATOR 5V TO-220-3 FUSE HOLDER,6.3 X 32MM,PCB MOUNT METAL WRIST BAND,FIXED SIZE,LARGE,BLACK METAL WRIST BAND,FIXED SIZE,SMALL,BLACK IC,DIFF AMP,150MHZ,52V/ uS,SOIC-8 FUSE HOLDER,5 X 20MM,PCB MOUNT CIRCULAR CONNECTOR RECEPTACLE 8POS CABLE RECTANGULAR INSERT,FEMALE,25WAY SWITCH,DISCONNECT,30A,3POLE SWITCH,DISCONNECT,30A,3POLE RESISTOR,RES ARRAY,4,33OHM,5%,SMD Power Resistor KIT DE DEMARRAGE POUR ST7FLITE2 USB Relays,PCB Switch Function:DPDT Relays,PCB Switch Function:DPDT Lens Cap Leaded Process Compatible:No D SUB CONTACT,PIN,16AWG,CRIMP IC,SHUNT V-REF,2.5V,20mV,8-SOIC IC,PRESSURE SENSOR,0 TO 10KPA,SOP-8 IC,TIMER,SINGLE,500KHZ,16V,SOIC-8 IC,VIDEO BUFFER,SINGLE,280MHZ,SOIC-8 IC,I/O EXPANDER,8BIT,100KHZ,DIP-16 AMPLIFIER IC PACKAGE/CASE:100-PZP IC,OP-AMP,3MHZ,13V/us,6mV,SOIC-8 IC,MPU SUPERVISOR,15 uA,5.5V,SOT23-5 IC,DC-DC CONV,SON-10 IC,OP-AMP,110kHZ,0.047V/ us,SOIC-8 D SUB CONNECTOR,STANDARD,15POS,PLUG CIRCULAR CONNECTOR RCPT SIZE 20,18POS, RESISTOR,METAL FILM,249 OHM,500mW,1% FUSE HOLDER,6.3 X 32MM,PANEL MOUNT WIRE-BOARD CONN,FEMALE,3POS,2.54MM WIRE-BOARD CONN,FEMALE,2POS,2.54MM RF/COAXIAL,K-LOC PLUG,STR,50 OHM CRIMP Wirewound Resistor Series:HLW Grounding Cord RESISTOR,METAL FILM,200 OHM,125mW,0.1% RF/COAXIAL,BNC JACK,R/A,50 OHM,SOLDER WIRE-BOARD CONN,FEMALE,12POS,3.96MM RF/COAXIAL,SHV BHD JACK,STR,SOLDER BAG,SHOULDER CAISSE A OUTILS CASE,EXPLORER CASE,EXPLORER CASE,EXPLORER CASE,EXPLORER TESTER,INSULATION/CONTINUITY TESTER,INSULATION/CONTINUITY TESTER,INSULATION/CONTINUITY TESTER,INSULATION/CONTINUITY TESTEUR DE DISJONCTEURS DIFFERENTIELS TESTEUR DE DISJONCTEURS DIFFERENTIELS RF/COAXIAL BNC BHD JACK R/A 50 OHM SOLDER VARISTOR,12V,50V,0402 LAMP,HAZARD,WARNING,LED,BLUE LAMP,HAZARD,WARNING,LED,GREEN MODULAR SIGNAL TOWER BASE,24VDC,54mA MOUNTING BRACKET RF/COAXIAL,BNC PLUG,STR,75 OHM,CRIMP RF/COAXIAL BNC BHD JACK STR 75 OHM SOLDER RF/COAXIAL,TNC JACK,STR,50 OHM,CRIMP RF/COAXIAL,BNC PLUG,R/A,50 OHM,CRIMP RF/COAXIAL,TNC PLUG,STR,50 OHM,CRIMP SWITCH,TACTILE,2.4A,THROUGH HOLE CONN,FUSED POWER ENTRY MODULE,PLUG 10A CONN,FUSED POWER ENTRY MODULE,PLUG 10A POWER ENTRY MODULE,PLUG,10A RF/COAXIAL,BNC JACK,STR,50 OHM,CRIMP FUSE,PCB,4A,250V,FAST ACTING CONNECTORS,PCB FUSE HOLDER FUSE SIZE/GR POWER ENTRY MODULE,PLUG,15A CONNECTOR,IEC POWER ENTRY,PLUG,10A IR RECEIVER,45M,950NM,SIP RF/COAXIAL,TNC JACK,STR 50 OHM,SOLDER FUSE,PCB,5A,250V,FAST ACTING Pan-Wrap Split Harness Wrap POWER ENTRY MODULE,PLUG,4A FUSE,CARTRIDGE,63mA,5X20MM TIME DELAY VOLTAGE SELECTOR,2 POLE,6.3A,250V FUSE,PCB,1A,250V,FAST ACTING RF/COAXIAL,TNC JACK,STR,50 OHM,CRIMP RF/COAXIAL,TNC PLUG,STR,50 OHM,CRIMP RF/COAXIAL BNC BHD RCPT STR 50 OHM SOLDER FUSE CLIP,5 X 20MM,PCB MOUNT CONNECTOR,IEC POWER ENTRY,PLUG,10A RF/COAXIAL,TNC BHD JACK STR 50 OHM CRIMP LAMP,HAZARD,WARNING,LED,RED LAMP,HAZARD,WARNING,LED,YELLOW FUSE,PCB,2A,250V,FAST ACTING MODULAR SIGNAL TOWER BASE,24VDC,54mA SWITCH,INDUSTRIAL PUSHBUTTON,18MM ADAPTOR,SHAVER TAPE,BLACK/WHITE,12MM TAPE,BLACK/YELLOW,12MM TAPE,BLACK/WHITE,6MM TRANSISTOR MOSFET CANAL N 30V LFPAK TRANSISTOR MOSFET CANAL N 30V LFPAK TRANSISTOR MOSFET CANAL N 30V LFPAK TRANSISTOR MOSFET CANAL N SOT-23-6 TRANSISTOR MOSFET CANAL N BOITIER SOT-23 TRANSISTOR MOSFET CANAL N BOITIER SOT223 TRANSISTOR MOSFET CANAL P SOT-23-6 TRANSISTOR MOSFET CANAL P SOT-23-6 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT223 TRANSISTOR MOSFET DOUBLE NP SO-8 TRANSISTOR MOSFET DOUBLE NP SO-8 TRANSISTOR MOSFET CANAL N BOITIER SOT223 TRANSISTOR MOSFET BOITIER SM8 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 CONDENSATEUR 22UF 6.3V BOITIER B CONDENSATEUR 22UF 6.3V BOITIER B CONDENSATEUR 100UF 4V BOITIER C CONDENSATEUR 100UF 4V BOITIER C CONDENSATEUR 220UF 6.3V BOITIER E CONDENSATEUR 220UF 6.3V BOITIER E CONDENSATEUR 330UF 6.3V BOITIER E CONDENSATEUR 330UF 6.3V BOITIER E CONDENSATEUR 1.5PF 50V BOITIER 0402 CONDENSATEUR 1.5PF 50V BOITIER 0402 CONDENSATEUR 3PF 50V BOITIER 0402 CONDENSATEUR 3PF 50V BOITIER 0402 CONDENSATEUR 10PF 50V BOITIER 0402 CONDENSATEUR 10PF 50V BOITIER 0402 CONDENSATEUR 1.0PF 200V BOITIER 0603 CONDENSATEUR 1.0PF 200V BOITIER 0603 CONDENSATEUR 1.2PF 200V BOITIER 0603 CONDENSATEUR 1.2PF 200V BOITIER 0603 CONDENSATEUR 1.5PF 200V BOITIER 0603 CONDENSATEUR 1.5PF 200V BOITIER 0603 CONDENSATEUR 2.7PF 200V BOITIER 0603 CONDENSATEUR 2.7PF 200V BOITIER 0603 CONDENSATEUR 3PF 200V BOITIER 0603 CONDENSATEUR 3PF 200V BOITIER 0603 CONDENSATEUR 3.9PF 200V BOITIER 0603 CONDENSATEUR 3.9PF 200V BOITIER 0603 CONDENSATEUR 4.7PF 200V BOITIER 0603 CONDENSATEUR 4.7PF 200V BOITIER 0603 CONDENSATEUR 5.6PF 200V BOITIER 0603 CONDENSATEUR 5.6PF 200V BOITIER 0603 CONDENSATEUR 6.8PF 200V BOITIER 0603 CONDENSATEUR 6.8PF 200V BOITIER 0603 CONDENSATEUR 7.5PF 200V BOITIER 0603 CONDENSATEUR 7.5PF 200V BOITIER 0603 CONDENSATEUR 8.2PF 200V BOITIER 0603 CONDENSATEUR 8.2PF 200V BOITIER 0603 CONDENSATEUR 22PF 100V BOITIER 0603 CONDENSATEUR 22PF 100V BOITIER 0603 CONDENSATEUR 47PF 100V BOITIER 0603 CONDENSATEUR 3.3PF 200V BOITIER 0805 CONDENSATEUR 3.3PF 200V BOITIER 0805 CONDENSATEUR 7.5PF 200V BOITIER 0805 CONDENSATEUR 7.5PF 200V BOITIER 0805 CONDENSATEUR 8.2PF 200V BOITIER 0805 CONDENSATEUR 8.2PF 200V BOITIER 0805 CONDENSATEUR 9.1PF 200V BOITIER 0805 CONDENSATEUR 9.1PF 200V BOITIER 0805 CONDENSATEUR 10PF 200V BOITIER 0805 CONDENSATEUR 10PF 200V BOITIER 0805 CONDENSATEUR 22PF 200V BOITIER 0805 CONDENSATEUR 22PF 200V BOITIER 0805 CONDENSATEUR 24PF 200V BOITIER 0805 CONDENSATEUR 24PF 200V BOITIER 0805 CONDENSATEUR 36PF 200V BOITIER 0805 CONDENSATEUR 36PF 200V BOITIER 0805 CONDENSATEUR 47PF 200V BOITIER 0805 CONDENSATEUR 47PF 200V BOITIER 0805 CONDENSATEUR 82PF 200V BOITIER 0805 CONDENSATEUR 82PF 200V BOITIER 0805 RESEAU DE SUPPRESSEUR MULTIGUARD RESEAU DE SUPPRESSEUR MULTIGUARD RESEAU DE SUPPRESSEUR MULTIGUARD FICHE FEMELLE 4 VOIES COFFRET 76 TIROIRS TOOL CASE,ALUMINIUM,HIGH QUALITY VALISE DE TRANSPORT ALU 57X37X27CM LOCK,FOR TRANSPORT CASE,PK2 BOITE MULTI-COMPARTIMENTS BOITE MULTI-COMPARTIMENTS BOITE MULTI-COMPARTIMENTS BOITE MULTI-COMPARTIMENTS JOINT POUR FICHE MALE PANNEAU TAILLE 20 CLAMP,KLIKLAMP,250MM TINSNIP,RIGHT CUT,260MM TINSNIP,LEFT CUT,260MM SNIP,MULTI PURPOSE,280MM CUTTER,CABLE,MULTIPURPOSE,190MM CUTTER,CABLE,MULTIPURPOSE,190MM RF/COAXIAL,BNC PLUG,STR,75 OHM,CRIMP PLUG AND SOCKET CONNECTOR HOUSING CATEGORY 5E CABLE ASSEMBLY RF/COAXIAL MCX PLUG R/A 50 OHM CRIMP/SLDR CIRCULAR CONNECTOR RCPT,SIZE 10SL,3POS,BOX CIRCULAR CONN,RCPT,SIZE 14S,5POS,BOX CIRCULAR CONN,RCPT,SIZE 14S,6POS,BOX CIRCULAR CONN,RCPT,SIZE 16S,7POS,BOX CIRCULAR CONN,RCPT,SIZE 18,10POS,BOX CIRCULAR CONNECTOR PLUG SIZE 14S,6POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 18,10POS,CABLE CIRCULAR CONN,RCPT,SIZE 8,2POS,BOX IC,OP-AMP,8MHZ,3V/ us,DIP-14 CUTTER,CONDUIT,MULTI FUNCTION IC,VOLT SUPERVISOR,30 uA,5.5V,SOT23- PLUG AND SOCKET CONNECTOR HOUSING RF/COAXIAL,QMA JACK STR 50 OHM PRESS FI RF/COAXIAL,QMA JACK,STR,50 OHM,SOLDER RF/COAXIAL,QMA JACK,R/A,50 OHM,SOLDER RF/COAXIAL,QMA BHD JACK STR 50 OHM CRIMP RF/COAXIAL,QMA BHD JACK STR 50OHM CRIMP RF/COAXIAL,QMA PLUG,STR,50 OHM,CRIMP RF/COAXIAL,MINI BNC BHD JACK,R/A 75OHM RF/COAXIAL,MINI BNC COAXIAL,75 OHM SLDR RF/COAXIAL MINI BNC PLUG STR 75 OHM CRIMP FASTENERS,SCREWS FASTENERS,SCREWS FASTENERS,SCREWS FASTENERS,NUTS FASTENERS,SCREWS FASTENERS,SCREWS FASTENERS,SCREWS FASTENERS,SCREWS FASTENERS,SCREWS FASTENERS,SCREWS FASTENERS,SCREWS IR RECEIVER,35M,950NM,SIP IR RECEIVER,35M,950NM,SIP CIRCULAR CONNECTOR RCPT,SIZE 11,13POS,WALL CIRCULAR CONNECTOR RCPT,SIZE 15,37POS,WALL CIRCULAR CONNECTOR RCPT,SIZE 17,55POS, CIRCULAR CONN,PLUG,SIZE 9,6POS,CABLE CIRCULAR CONNECTOR PLUG,SIZE 11,6POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 15,19POS, CIRCULAR CONNECTOR PLUG SIZE 15,37POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 17,55POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 15,37POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 15,37POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 17,55POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 17,55POS,CABLE PLUG & SOCKET CONNECTOR,PLUG,2POS PLUG & SOCKET CONNECTOR,PLUG,2POS SCHOTTKY RECTIFIER,100mA,35V 0603 RF/COAXIAL ADAPTER,N JACK-TNC JACK CIRCULAR CONN,RCPT,SIZE 16,23POS,BOX CIRCULAR CONNECTOR PLUG,SIZE 10,6POS,CABLE CIRCULAR CONNECTOR RCPT,SIZE 14,5POS,CABLE CIRCULAR CONN,RCPT,SIZE 14S,5POS,BOX CIRCULAR CONN,RCPT,SIZE 18,4POS,BOX Circular Connector CIRCULAR CONNECTOR PLUG,SIZE 16,5POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 22,19POS,CABLE CIRCULAR CONNECTOR PLUG SIZE 12S,2POS,CABLE BAR GRAPH,10-LED,GREEN,8MCD,105mW BAR GRAPH,10-LED,RED,8MCD,105mW INDICATOR,LED PCB,T-1 3/4,GREEN,2.2V INDICATOR,LED PCB,5MM,RED,2V INDICATOR,LED PCB,T-1 3/4,RED,2V INDICATOR,LED PCB,3MM,GREEN,2.2V INDICATOR,LED PCB,2LED GRN 40MCD 105mW INDICATOR,LED PCB,4-LED,GREEN,20MCD LAMP SOCKET,LUMEX 3MM LEDs LAMP SOCKET,LUMEX 5MM LEDs PANEL MOUNT INDICATOR,LED,5MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,7.94MM,RED,2V PANEL MOUNT INDICATOR,LED,7.94MM,RED,1.7V PANEL MOUNT INDICATOR,LED,6.35MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,6.35MM,RED,2V PANEL MOUNT INDICATOR,LED,12.05MM,RED,2V PANEL MOUNT INDICATOR,LED,8.26MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,8.26MM,YELLOW,2.1V PANEL MOUNT INDICATOR,LED,GREEN,2.2V LED,AMBER,5MM X 2MM,5MCD,605NM LED,RED,5MM X 2MM,10MCD,635NM LED,RED,2.3MM X 8MM,9MCD,635NM LED,GREEN,T-1 (3MM),100MCD,565NM LED,GREEN,T-1 (3MM),40MCD,565NM LED,GREEN,T-1 (3MM),40MCD,565NM LED,RED,T-1 (3MM),6MCD,700NM LED,RED,T-1 (3MM),125MCD,635NM LED,RED,T-1 (3MM),30MCD,635NM LED,RED,T-1 (3MM),30MCD,635NM LED,RED,T-1 (3MM),600MCD,660NM LED,YELLOW,T-1 (3MM),90MCD,585NM LED,YELLOW,T-1 (3MM),30MCD,585NM LED,T-1,GREEN / YELLOW,RADIAL LED,RED,4MM X 7MM,12MCD,635NM LED,4MM,YELLOW,6MCD,585NM LED,RED,T-1 3/4 (5MM),40MCD,635NM LED,GREEN,T-1 3/4 (5MM),50MCD,565NM LED,RED,T-1 3/4 (5MM),40MCD,635NM LED,GREEN,T-1 3/4 (5MM),30MCD,565NM LED,GREEN,T-1 3/4 (5MM),80MCD,565NM LED,YELLOW,T-1 3/4 (5MM),30MCD,585NM LED,RED,T-1 3/4 (5MM),2.8CD,660NM LED,RED,T-1 3/4 (5MM),250MCD,660NM LED,YELLOW,T-1 3/4 (5MM),1CD,590NM LED,RED,T-1 3/4 (5MM),600MCD,635NM LED,YELLOW,T-1 3/4 (5MM),30MCD,585NM LAMP,LED REPLACEMENT,RED,10MM LAMP,LED REPLACEMENT,YELLOW,10MM LED Lamp LAMP,LED,YELLOW,10MM,WEDGE LED,RED,0.8MM X 1MM,60MCD,636NM LED,2.4MM,RED,250MCD,636NM LED,2.4MM,GREEN,150MCD,574NM LED,YELLOW,2.4MM,140MCD,590NM DISPLAY,SEVEN SEGMENT,14MM,RED DISPLAY,SEVEN SEGMENT,14MM,GREEN DISPLAY,SEVEN SEGMENT,14MM,RED LED,GREEN,2MM,10MCD,565NM LED,RED,2MM,25MCD,635NM LED,GREEN,5MM X 2MM,6MCD,555NM LED,2X5MM,RED,80MCD,660NM LED,AMBER,T-1 (3MM),15MCD,605NM LED,GREEN,T-1 (3MM),6MCD,565NM LED,GREEN,T-1 (3MM),6MCD,565NM LED,RED,T-1 (3MM),6MCD,635NM LED,RED,T-1 (3MM),30MCD,635NM LED,GREEN,T-1 3/4 (5MM),30MCD,555NM LED,RED,0.8MM X 1MM,45MCD,660NM LED,RED,2MM X 1.6MM,25MCD,660NM LED,YELLOW,2MM X 1.6MM,6MCD,585NM LED,RED,1.4MM X 2MM,100MCD,660NM LED,GREEN,2.4MM,25MCD,565NM INDICATOR,LED PCB,2-LED,RED / GREEN LED Lamp INDICATOR,LED PCB,T-1 3/4,RED,1.7V INDICATOR,LED PCB T-1 3/4,YELLOW,2.1V PANEL MOUNT INDICATOR,LED,8.2MM,GREEN,2.2V PANEL MOUNT INDICATOR,LED,8.2MM,YELLOW,2.1V LED,GREEN,1.25MM X 1.4MM,10MCD,565NM LED,RED,1.25MM X 1.4MM,9MCD,635NM LED,RED,1.25MM X 1.4MM,25MCD,660NM LED,3MM X 2MM,RED / GREEN,SOT-23-3 Switches,Limit Switch Contact Rating:60 Switch Actuator Switch Actuator Switch Actuator CONNECTOR,BNC,BHD JACK,STR,50 OHM,SOLDER MALE CAP RF/COAXIAL N PLUG STR 50 OHM CRIMP/SOLDER RF/COAXIAL,N JACK,STR,50 OHM,CRIMP RF/COAXIAL,N JACK,STR,50 OHM,SOLDER RF/COAXIAL,N PLUG,STR,50 OHM,CRIMP RF/COAXIAL,SMB PLUG,R/A,75 OHM,CRIMP RF/COAXIAL,MMCX JACK,STR,50 OHM,THD DISPLAY,SEVEN SEGMENT,10MM,GREEN INDUCTIVE PROXIMITY SENSORS WIRE-BOARD CONN,FEMALE,8POS,2.54MM RF/COAXIAL ADAPTER,F JACK-F JACK DISPLAY,SEVEN SEGMENT,10MM,GREEN CONTACT,2AWG,CRIMP,175A PLUG AND SOCKET CONNECTOR HOUSING IC,MOSFET DRIVER,HIGH-SPEED,CCD,DI-8 RF/COAXIAL ADAPTER,QMA JACK-SMA JACK CABLE 304M LIGHT PIPE,SINGLE,ROUND,PANEL CABLE 152M LIGHT PIPE,DUAL,ROUND,PCB RESISTOR,CURRENT SENSE,1 OHM,20W,1% RESISTOR,CURRENT SENSE,100 OHM,20W,1% CONTACT,4AWG,CRIMP RF/COAXIAL ADAPTER,QMA PLUG-SMA JACK TERMINAL CLOSED END SPLICE TWIST-ON GREY LIGHT PIPE,SINGLE,ROUND,PCB LIGHT PIPE,SINGLE,ROUND,PCB TRANSISTOR,NPN,40V,TO-92 RF/COAXIAL ADAPTER,BNC JACK-N PLUG CONTACT SET,SOCKET,4/0AWG,CRIMP RESISTOR,CURRENT SENSE,20 OHM,20W,1% RESISTOR,CURRENT SENSE,25 OHM,20W,1% CONTACT,12-10AWG,CRIMP PLUG AND SOCKET CONNECTOR HOUSING PLUG AND SOCKET CONNECTOR HOUSING RF/COAXIAL,HN PLUG STR 50 OHM CLAMP/SLDR CONTACT,1/0AWG,CRIMP CONTACT SET,SOCKET,2/0AWG,CRIMP PLUG AND SOCKET CONNECTOR HOUSING Power Resistor RESISTOR,CURRENT SENSE,0.02 OHM,20W,1% RF/COAXIAL,N JACK,STR,50 OHM,CRIMP Power Resistor RF/COAXIAL,SMB JACK,R/A,75 OHM,CRIMP RF/COAXIAL,SMB PLUG,STR,75 OHM,CRIMP RF/COAXIAL,SMB BHD JACK STR 75 OHM CRIMP BULKHEAD ADAPTER,N JACK-SMB JACK KIT TOURNEVIS ET EMBOUTS 7PC KIT TOURNEVIS ET EMBOUTS 11PC KIT TOURNEVIS ET EMBOUTS 17PC KIT TOURNEVIS ET EMBOUTS 17PC DIAL CALIPER,PLASTIC VERNIER CALIPER,PLASTIC METRE PLIANT PLASTIQUE 1M POIGNEE 6 PANS MALE 6MM POIGNEE 6 PANS MALE 10MM POIGNEE TORX T27 POIGNEE TORX T40 BOITE MOULEE GRIS 160X360X90 BOITE MOULEE NOIR 98X64X36 BOITE MOULEE NOIR 75X80X52 BOITE MOULEE NOIR 175X80X52 BOITE MOULEE NOIR 220X120X80 BOITE POLYESTER 220X120X90 PANNEAU ALU 19´´ 2U PANNEAU ALU 19´´ 3U PANNEAU ALU 19´´ 4U HOSPITAL GRADE OUTLET STRIP,6-OUTLET,1 STATION DE SOUDAGE WDD161V BUSE 1.2MM POUR FER HAP1 PINCE COUPANTE PINCE JEU DE 3 PINCES PINCE COUPANTE PANNE SOUDAGE 2.0MM INTERRUPTEUR ECLAIRE AMBRE CRAYON 2B BOITE DE 12 POWER OUTLET STRIP,5 OUTLET,15A,125V RF/COAXIAL,N PLUG,STR,50 OHM,CRIMP WIRE-BOARD CONN,RECEPTACLE,5POS,2MM RF/COAXIAL,BNC PLUG,STR,50 OHM,CRIMP EYELET TERMINAL LUG TERMINAL,MECHANICAL LUG,#6,SOLDER DPM TIMER/COMPTEUR LCD MODULE FPT-1 AVEC CIRCUIT ALTERA TIMER,MULTIFUNCTION COMPTEUR TALLY MANUEL BASE POUR COMPTEUR TALLY ISOLATEUR MINI ALIMENTATION 24VDC 0.5A INTERRUPTEUR A BASCULE SPST BLANC I/O INTERRUPTEUR A BASCULE SPST VERT ILLUM. INTERRUPTEUR A BASCULE SPST NOIR MOM INTERRUPTEUR A BASCULE DPST NOIR I/O CPAOT DE PROTECTION COMMUTATEUR A BASCULE SPST NOIR COMMUTATEUR A BASCULE DPST NOIR E/S COMMUTATEUR A BASCULE DPST ROUGE ILLUM. COMMUTATEUR A BASCULE DPDT VERT ILLUM. INTERRUPTEUR A BASCULE MOM-OFF-MOM INTERRUPTEUR A BASCULE MOM-OFF-MOM NOIR INTERRUPTEUR ANTI-VANDALE TOGGLE COMMUTATEUR Header Connector,PCB Mount,PLUG,4 Contacts,SKT,0.165 Pitch,PC TAIL Terminal,POLARIZED LCK 56H8238 CRIMP SET,PZ 6 ROTO CRIMP SET,PZ 6/5 CRIMP TOOL,STRIPAX,PZ 16 HEAT SHRINK TUBING,PVC,WHT,100FT CAPUCHON THERMO. PQ100 CAPUCHON THERMO. PQ100 MANCHON RETRACTABLE MANCHON RETRACTABLE INTERRUPTEUR A BASCULE MANCHON RETRACTABLE MANCHON RETRACTABLE FIL D´EQUIPEMENT BLEU 100M FIL BLEU 100M FIL JAUNE 100M FIL VERT 100M FIL JAUNE 100M FIL BLANC 100M FIL BLEU 100M FIL JAUNE 100M FIL BLEU 100M FIL NOIR 100M FIL ROUGE 100M FIL VERT 100M FIL JAUNE 100M FIL BLANC 100M FIL JAUNE 100M FIL NOIR 100M FIL ROUGE 100M FIL VERT 100M FIL BLANC 100M NETTOYANT PERCHLORURE BOARD-BOARD CONN,HEADER,36WAY,1ROW BOARD-BOARD CONN,HEADER,36WAY,1ROW CONTACT,RECEPTACLE,24-18AWG,CRIMP COMMUTATEUR MOMENTANE ROUGE COMMUTATEUR MOMENTANE NOIR IC,8BIT MCU,PIC16F,4MHz,DIP-18 ELECTROMECHANICAL MULTIFUNCTION TIMER MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 16 BITS DSP 20MHZ CMS ADAPTATEUR INTERFACE ICD2 16F684 ADAPTATEUR INTERFACE ICD2 16F688 ENCLOSURE,BOX,PLASTIC,GRAY FILTRE DE LIGNE 32V RAIL DIN FILTRE CONNECTEUR IEC 10A ANTENNE GSM 900/1800/1900MHZ + IPEX ANTENNE GSM 900/1800/1900MHZ + MMCX HEAT SHRINK TUBING,25.4MM ID,PO,BLK,50FT RF/COAXIAL,BNC SHORTING CAP,50OHM PLUG & SOCKET HOUSING,RECEPTACLE,NYLON RF/COAXIAL ADAPTER,SMA PLUG-SMA JACK WIRE-BOARD CONNECTOR HEADER 3POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE,5POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE,7POS,3.96MM WIRE-BOARD CONNECTOR RECEPTACLE,2POS,3.96MM WIRE-BOARD CONNECTOR HEADER 2POS,3.96MM SUPPORT DE MONTAGE PLUG & SOCKET HOUSING,RECEPTACLE,NYLON WIRE-BOARD CONNECTOR RECEPTACLE,4POS,3.96MM CONTACT,SOCKET,26-22AWG,CRIMP PLUG & SOCKET HOUSING,RECEPTACLE,NYLON RF/COAXIAL,SMA PLUG,STR,50 OHM,CLAMP PLUG AND SOCKET CONNECTOR HOUSING PLUG AND SOCKET CONNECTOR HOUSING Power Connector Power Connector Leaded Process Compatibl RECTANGULAR CONNECTOR,1POS,CRIMP PLUG AND SOCKET CONNECTOR HOUSING PLUG AND SOCKET CONNECTOR HOUSING TERMINAL,RING TONGUE,3/8IN,CRIMP,RED RF/COAXIAL,SMA JACK,STRAIGHT,SOLDER Ring Tongue Solderless Terminal PLUG AND SOCKET CONNECTOR HOUSING PLUG AND SOCKET CONNECTOR HOUSING PLUG AND SOCKET CONNECTOR HOUSING CONTACT,6AWG,CRIMP CONTACT,8AWG,CRIMP CONTACT,12-10AWG,CRIMP CONTACT,SOCKET,26-22AWG,CRIMP PLUG & SOCKET HOUSING,RECEPTACLE,NYLON N Coaxial Connector RG Cable Type:RG 142 RF/COAXIAL,SMA PLUG,STR,50 OHM,CRIMP STANDARD TERMINAL BLOCK RF/COAXIAL,SHV PLUG,STRAIGHT,CRIMP STANDARD TERMINAL BLOCK POWER CONNECTOR RF/COAXIAL,BNC PLUG,STR,50 OHM,CRIMP WIRE-BOARD CONNECTOR RECEPTACLE,3POS,3.96MM PLUG & SOCKET HOUSING,RECEPTACLE,NYLON PLUG AND SOCKET CONNECTOR HOUSING Current Monitoring Relay CLAVIER PILE LITHIUM THIONYLE 6V PILE LITHIUM THIONYLE 6V ADAPTATEUR BNC ADAPTATEUR TEST PLUG ADAPTATEUR THERMOCOUPLE K MALLETTE RIGIDE POUR OX7100 CORDON ETHERNET CROISE KIT LOGICIEL SX-METRO CAPUCHON 3P POUR OT45-63 CAPUCHON 1P POUR OT45-63 CONTACT AUXILIAIRE 1O POWER CORD,NEMA5-15P,6FT,10A,GRAY POWER CORD,NEMA5-15P,8FT,10A,GRAY POWER CORD,NEMA5-15P,6FT,10A,GRAY POWER CORD,NEMA5-15P,12FT,15A,BLACK POWER CORD,NEMA5-15P,6FT,10A,BLACK POWER CORD,NEMA5-15P,20FT,13A,GRAY POWER CORD,NEMA5-15P,9.8FT,13A,BLACK POWER CORD,NEMA5-15P,20FT,10A,BLACK POWER CORD,NEMA5-15P,8FT,10A,BLACK POWER CORD,NEMA5-15P,6FT,10A,BLACK POWER CORD,NEMA5-15P,8FT,10A,BLACK POWER CORD,NEMA5-15P,6FT,10A,GRAY POWER CORD,NEMA5-15P,6FT,10A,BLACK POWER CORD,NEMA5-15P,9FT,13A,BLACK POWER CORD,NEMA5-15P,9FT,15A,BLACK POWER CORD,NEMA5-15P/IEC C13,7.5FT,10A 125V,BLACK POWER CORD NEMA5-15P/IEC,7.5FT 13A,BLK POWER CORD,NEMA5-15P/IEC,3FT,10A,BLK POWER CORD,NEMA5-15P/IEC,6FT,10A,BLK POWER CORD NEMA6-15P/IEC,6.6FT 10A,BLK POWER CORD,NEMA5-15P,8FT,10A,BLACK POWER CORD NEMA6-15P/IEC,15FT,13A GRAY POWER CORD,NEMA5-15P/IEC,8FT,13A,BLK POWER CORD,IEC320-C13,8FT,BLACK POWER CORD,NEMA5-15P/R,10FT,13A BLACK POWER CORD,NEMA5-15P,6.6FT,BLACK POWER CORD,NEMA5-15P,9.8FT,10A,BLACK POWER CORD,NEMA5-15P,6.6FT,10A,BLACK POWER CORD,NEMA5-15P,9.8FT,10A,BLACK POWER CORD,NEMA5-15P,6.6FT,13A,BLACK POWER CORD,NEMA5-15P,6.6FT,15A,BLACK POWER CORD,NEMA5-15P,9.8FT,15A,BLACK POWER CORD,NEMA5-15P,9.8FT,13A,BLACK POWER CORD,NEMA5-15P,9FT,13A,BLACK POWER CORD,NEMA5-15P,7.5FT,10A,BLACK POWER CORD NEMA5-15P/IEC,6.6FT,10A BLK POWER CORD NEMA5-15P/IEC,9.8FT,10A BLK POWER CORD NEMA5-15P/IEC,6.6FT,13A BLK POWER CORD,NEMA5-15P,9.8FT,13A,BLACK POWER CORD NEMA5-15P/IEC,6.6FT,15A BLK POWER CORD NEMA5-15P/IEC,9.8FT,15A BLK POWER CORD NEMA5-15P/IEC,6.6FT 10A,BLK POWER CORD NEMA5-15P/IEC,9.8FT 10A,BLK POWER CORD NEMA5-15P/IEC,6.6FT 10A,BLK POWER CORD NEMA5-15P/IEC,9.8FT 10A,BLK POWER CORD NEMA5-15P/IEC,9.8FT 13A,BLK POWER CORD,NEMA5-15P/IEC C13,2M 15A,BLK POWER CORD NEMA5-15P/IEC,1.5FT,10A BLK POWER CORD IEC60320C-13,6.6FT,10A,BLK POWER CORD IEC60320C-13/14 3.25FT 10ABLK POWER CORD IEC60320C-13/14 3.25FT 13ABLK COFFRET NOIR COFFRET NOIR COFFRET PORTATIF BOITIER ABS INCLINE BOITIER POLYSTYRENE PANNEAU AVANT/ARRIERE ALUMINIUM PANNEAU AVANT/ARRIERE ALUMINIUM PANNEAU AVANT INCLINE PANNEAU AVANT INCLINE BOITIER POLYSTYRENE BOITIER POLYSTYRENE BOITIER POLYSTYRENE BOITIER POLYSTYRENE COFFRET ABS COFFRET ABS PANNEAU ALUMINIUM PIEDS POUR COFFRET PIEDS ESCAMOTABLES BLANCS (PQ4) COFFRET ABS NOIR COFFRET ABS NOIR COFFRET PORTATIF NOIR COFFRET PORTATIF GRIS BOITIER ABS BOITIER ABS INDICATEUR DIN 0-200 UA INDICATEUR A BOBINE MOBILE 0-1 MA INDICATEUR A BOBINE MOBILE 0-1 MA ECHELLE 0-10 ECHELLE 0-100 ECHELLE 100-0-100 ECHELLE VIERGE COFFRET ABS A FENETRE EPONGE ELEMENT CHAUFFANT MANCHE AVEC ELEMENT CHAUFFANT TAPIS EXTRACTEUR DE PANNE PANNE 1MM 30D BISEAU PANNE 1.5MM 30D BISEAU COURBEE PANNE 1.7MM 30D BISEAU PANNE 2.5MM 30D BISEAU PANNE 1.5MM 60D BISEAU PANNE 3MM 30D LONG BISEAU PANNE 5MM 30D X-L BISEAU PANNE 0.4MM 60D BISEAU PANNE 0.4MM CONIQUE POINTUE PANNE 0.4MM POINTUE COURBEE 30D PANNE 0.4MM POINTUE COURBEE 30D PANNE 1.5MM DRAG 60 MIN-HOOF PANNE 0.3MM DRAG 60 HOOF PANNE DE SOUDAGE 06MM PANNE DE SOUDAGE 02MM PANNE DE SOUDAGE 16MM FER A SOUDER MICRO TOOL PANNE DE SOUDAGE 175MM FER A SOUDER TECH TOOL FER A SOUDER BASIC TOOL 60 FER A SOUDER BASIC 80 SPARE NOZZLE,FOR VACX LAMPE HALOGENE POUR 4715731 BOITE DISTRIBUTION IP65 9 VOIES BOITE DISTRIBUTION IP54 9 VOIES CONDENSATEUR 3300UF 400V CONDENSATEUR 15000UF 40V CONDENSATEUR 4700UF 200V CONDENSATEUR 10000UF 200V CONDENSATEUR 1000UF 400V CONDENSATEUR 470UF 450V CONDENSATEUR 2200UF 450V CONDENSATEUR 3300UF 450V CONDENSATEUR 2200UF 500V MICRORUPTEUR A LEVIER V4 MICRORUPTEUR A LEVIER V4 MICRORUPTEUR A LEVIER V4 MICRORUPTEUR A GALET PLONGEUR V9N POWER CORD NEMA5-15P/IEC,6.6FT 10A,BLK TOOLS,CRIMP CERTICRIMP 2,SAHT SHORT PT 81C9471 TOOLS,HAND CRIMP CAPACITOR TANT330UF6.3V 0.025 OHM 7343-31 20% CAPACITOR TANT,47UF 16V,0.07 OHM,0.2,7343-31 TOOLS,RATCHET CRIMP TOOLS,HAND CRIMP CARTOUCHE ENCRE COMP. CANON CYAN TOOLS,CRIMP CARTOUCHE ENCRE COMP. CANON COULEUR FUSIBLE CMS 1206 750MA FUSIBLE CMS 1206 750MA FUSIBLE CMS 1206 1.5A FUSIBLE CMS 1206 1.5A FUSIBLE CMS 1206 2.5A FUSIBLE CMS 1206 2.5A FUSIBLE CMS 1206 3A FUSIBLE CMS 1206 3A FUSIBLE CMS 1206 4A CARTOUCHE ENCRE COMP. HP CYAN RELAIS REED 12V 6.35MM RELAIS REED 24V 6.35MM DRIVER DE LIGNE RS232/422 MALE PRISE UK LINE DRIVER,RS232/422,FEMALE HEAT SHRINK TUBING,4.75MM ID,PO,BLK,100FT HEAT SHRINK TUBING,38MM ID,PO,BLK,50FT SOLDER WIRE,63/37 SN/PB,183°C,1LB APPLICATOR WAND MARQUEUR DE CABLE G 3/10 B MARQUEUR DE CABLE G 3/10 C MARQUEUR DE CABLE G 3/10 D MARQUEUR DE CABLE G 3/10 E MARQUEUR DE CABLE G 3/10 F MARQUEUR DE CABLE G 3/10 G MARQUEUR DE CABLE G 3/10 H MARQUEUR DE CABLE G 3/10 I MARQUEUR DE CABLE G 3/10 J MARQUEUR DE CABLE G 3/10 K MARQUEUR DE CABLE G 3/10 L MARQUEUR DE CABLE G 3/10 M MARQUEUR DE CABLE G 3/10 N MARQUEUR DE CABLE G 3/10 O MARQUEUR DE CABLE G 3/10 P MARQUEUR DE CABLE G 3/10 Q MARQUEUR DE CABLE G 3/10 S MARQUEUR DE CABLE G 3/10 T MARQUEUR DE CABLE G 3/10 U MARQUEUR DE CABLE G 3/10 W MARQUEUR DE CABLE G 3/10 X MARQUEUR DE CABLE G 3/10 Y MARQUEUR DE CABLE G 3/10 Z MARQUEUR DE CABLE G 3/10 TERRE MARQUEUR DE CABLE G 3/20 0 MARQUEUR DE CABLE G 3/20 7 MARQUEUR DE CABLE G 3/20 8 MARQUEUR DE CABLE G 3/20 9 MARQUEUR DE CABLE G 3/20 A MARQUEUR DE CABLE G 3/20 D CABLE MARKER,G,3/20,E,PK100 MARQUEUR DE CABLE G 3/20 F MARQUEUR DE CABLE G 3/20 G MARQUEUR DE CABLE G 3/20 H MARQUEUR DE CABLE G 3/20 I MARQUEUR DE CABLE G 3/20 J MARQUEUR DE CABLE G 3/20 K MARQUEUR DE CABLE G 3/20 L MARQUEUR DE CABLE G 3/20 N MARQUEUR DE CABLE G 3/20 O MARQUEUR DE CABLE G 3/20 P MARQUEUR DE CABLE G 3/20 Q MARQUEUR DE CABLE G 3/20 R MARQUEUR DE CABLE G 3/20 U CABLE MARKER,G,3/20,V,PK100 MARQUEUR DE CABLE G 3/20 X MARQUEUR DE CABLE G 3/20 Y MARQUEUR DE CABLE G 3/20 Z MARQUEUR DE CABLE G 3/20 TERRE MARQUEUR DE CABLE G 4/10 0 MARQUEUR DE CABLE G 4/10 1 MARQUEUR DE CABLE G 4/10 2 MARQUEUR DE CABLE G 4/10 3 MARQUEUR DE CABLE G 4/10 4 MARQUEUR DE CABLE G 4/10 5 MARQUEUR DE CABLE G 4/10 6 MARQUEUR DE CABLE G 4/10 7 MARQUEUR DE CABLE G 4/10 8 MARQUEUR DE CABLE G 4/10 9 CABLE MARKER,G,4/10,A,PK100 MARQUEUR DE CABLE G 4/10 B CABLE MARKER,G,4/10,C,PK100 MARQUEUR DE CABLE G 4/10 D MARQUEUR DE CABLE G 4/10 E MARQUEUR DE CABLE G 4/10 F MARQUEUR DE CABLE G 4/10 G MARQUEUR DE CABLE G 4/10 H MARQUEUR DE CABLE G 4/10 I MARQUEUR DE CABLE G 4/10 J MARQUEUR DE CABLE G 4/10 K MARQUEUR DE CABLE G 4/10 L MARQUEUR DE CABLE G 4/10 M MARQUEUR DE CABLE G 4/10 N MARQUEUR DE CABLE G 4/10 O MARQUEUR DE CABLE G 4/10 P MARQUEUR DE CABLE G 4/10 Q MARQUEUR DE CABLE G 4/10 S MARQUEUR DE CABLE G 4/10 T MARQUEUR DE CABLE G 4/10 U MARQUEUR DE CABLE G 4/10 V MARQUEUR DE CABLE G 4/10 W MARQUEUR DE CABLE G 4/10 X MARQUEUR DE CABLE G 4/10 Z MARQUEUR DE CABLE G 4/10 + MARQUEUR DE CABLE G 4/10 - MARQUEUR DE CABLE G 4/10 TERRE MARKER CARD,WIRE MARKER CARD,WIRE MARKER CARD,WIRE MARKER CARD,WIRE MARKER CARD,WIRE MICROCONTROLEUR 8 BITS FLASH Z8 CMS MICROCONTROLEUR 8 BITS FLASH Z8 MICROCONTROLEUR 8 BITS Z8 CMS MICROCONTROLEUR 8 BITS FLASH Z8 CMS MARKER CARD,WIRE MARKER CARD,WIRE MARKER CARD,WIRE MARKER CARD,WIRE MARKER CARD,WIRE MARKER CARD,WIRE MARQUEUR DE CABLE Z5 BLANC MARQUEUR DE CABLE Z5 BLANC ) MARQUEUR DE CABLE Z5 BLANC VIDE MARQUEUR DE CABLE Z5 BLANC . MARQUEUR DE CABLE Z7 BLANC / MARQUEUR DE CABLE Z7 BLANC ) MARQUEUR DE CABLE Z7 BLANC VIDE MARQUEUR DE CABLE Z7 BLANC . MARQUEUR DE CABLE Z11 BLANC / MARQUEUR DE CABLE Z11 BLANC VIDE MARQUEUR DE CABLE Z13 + BLANC MARQUEUR DE CABLE Z13 - BLANC MARQUEUR DE CABLE Z13 BLANC MARQUEUR DE CABLE Z13 BLANC A MARQUEUR DE CABLE Z13 BLANC B MARQUEUR DE CABLE Z13 BLANC D MARQUEUR DE CABLE Z13 BLANC E MARQUEUR DE CABLE Z13 BLANC F MARQUEUR DE CABLE Z13 BLANC G MARQUEUR DE CABLE Z13 BLANC H MARQUEUR DE CABLE Z13 BLANC I MARQUEUR DE CABLE Z13 BLANC J MARQUEUR DE CABLE Z13 BLANC K MARQUEUR DE CABLE Z13 BLANC L MARQUEUR DE CABLE Z13 BLANC M MARQUEUR DE CABLE Z13 BLANC N MARQUEUR DE CABLE Z13 BLANC O MARQUEUR DE CABLE Z13 BLANC P MARQUEUR DE CABLE Z13 BLANC Q MARQUEUR DE CABLE Z13 BLANC R MARQUEUR DE CABLE Z13 BLANC S MARQUEUR DE CABLE Z13 BLANC T MARQUEUR DE CABLE Z13 BLANC X CABLE MARKER,Z13,WHT,Y,PK100 MARQUEUR DE CABLE Z13 BLANC / MARQUEUR DE CABLE Z13 BLANC ) MARQUEUR DE CABLE Z13 BLANC . INDICATEUR PUISSANCE A LED - TRIPHASE CARRIER,K TYPE,12 DIGIT,PK500 DATA LOGGER,-270DEG TO 1880DEG,PC,USB AMPLIFICATEUR RF PHEMT BOITIER SOT-343 AMPLIFICATEUR RF PHEMT BOITIER SOT-363 AMPLIFICATEUR RF PHEMT BOITIER SOT-363 AMPLIFICATEUR RF PHEMT BOITIER SOT-363 AMPLIFICATEUR RF E-PHEMT BOITIER LPCC AMPLIFICATEUR RF E-PHEMT BOITIER LPCC AMPLIFICATEUR RF BOITIER SOT-363 AMPLIFICATEUR RF BOITIER SOT-363 AMPLIFICATEUR RF BOITIER SOT-363 AMPLIFICATEUR RF BOITIER SOT-363 AMPLIFICATEUR RF BOITIER SOT-363 AMPLIFICATEUR RF BOITIER SOT-363 ANALYSEUR THYRISTOR ET TRIAC KIT DE SONDES DE TEST FERRITE CORE,CYLINDRICAL,215OHM/100MHZ,300MHZ SEALING BOOT CARTOUCHE ENCRE CANON NOIRE CARTOUCHE ENCRE CANON NOIRE END PLATE,ISOLATING TERMINAL POWER STRIP,6 OUTLETS,15A,120V IC-CMS-100MA LDO COFFRET D´INSTRUMENTATION COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 COFFRET ALUMINIUM IP66 IC-CMS-FREQ SYNTHESISER PLL OSCILLATEUR 25MHZ TAPE MEASURE,SOFTECH,8M / 25FT TAPE MEASURE,SOFTECH,16M TAPE MEASURE,SOFTECH,3M INTERRU. A MANETTE BIPOL. ROUGE INTERRU. A MANETTE BIPOL. INTERRUPTEUR A POUSSOIR UNIPOLAIRE RECEPTEUR MINI SUPERREGEN LINEAR CDROM PUSHBUTTON,BODY,22MM,1NO PUSHBUTTON,BODY,22MM,1NC PUSHBUTTON,FLUSH,22MM,WHITE PUSHBUTTON,FLUSH,22MM,BLACK PUSHBUTTON,FLUSH,22MM,GREEN EMERGENCY STOP,TWIST,40MM,RED EMERGENCY STOP,LOCK,40MM,RED EMERGENCY STOP,PULL,40MM,RED SELECTOR SWITCH,22MM,2 POS SELECTOR SWITCH,22MM,3 POS SELECTOR SWITCH,22MM,2 POS SELECTOR SWITCH,22MM,2 POS SELECTOR SWITCH,22MM,3 POS LAMP HOLDER,DIRECT,130V,22MM LAMP HOLDER,TRANSF,110V,22MM LAMP HOLDER,TRANSF,240V,22MM LAMP HEAD,22MM,GREEN LAMP HEAD,22MM,RED LAMP HEAD,22MM,YELLOW LAMP HEAD,22MM,BLUE LAMP HEAD,22MM,WHITE PUSHBUTTON,IP67,RED MOUNTING CLIP,IP67 LATCH BLOCK,MECHANICAL LATCH BLOCK,MECHANICAL CIRCUIT BREAKER,MOTOR PROTECTIVE COUPE CIRCUIT POUR MOTEUR COUPE CIRCUIT POUR MOTEUR COUPE CIRCUIT POUR MOTEUR COUPE CIRCUIT POUR MOTEUR COUPE CIRCUIT POUR MOTEUR BLOC DE MONTAGE TIMER,RTMA2,12VDC TIMER,RTMA2,24VAC TIMER,RTMA4,24VDC TIMER,RTMA4,100-127VAC TIMER,RTMA4,200-240VAC DIN RAIL BASE,14 PIN TIMER,TMR48U,11 PIN TIMER,TMR48L,11 PIN RELAIS BASE 8 PIN RELAIS BASE 11 PIN INTERRU. MANETTE BASCU. UNIPOLAIRE NOIR PCB,3-grid Combo DIODE,STANDARD,9.5A,400V,TO-220 DIODE,STANDARD,12.7A,400V,TO-220 DIODE,STANDARD,9.5A,800V,TO-220 DIODE,STANDARD,15.9A,800V,TO-220 SIDAC,125V,DO-15 SIDAC,250V,DO-15 SIDAC,280V,TO-92 SIDAC,280V,DO-15 TRIAC,QUADRAC,400V,8A,TO-220AB TRIAC,QUADRAC,400V,10A,TO-220AB TRIAC,QUADRAC,400V,15A,TO-220AB ALTERNISTOR,400V,25A,TO-220AB ALTERNISTOR,400V,25A,TO-220AB ALTERNISTOR,600V,8A,TO-220 TRIAC,QUADRAC,600V,8A,TO-220AB ALTERNISTOR,600V,12A,TO-220 ALTERNISTOR,600V,16A,TO-220 SCR THYRISTOR,55A,1KV,TO-220AB SCR THYRISTOR,8A,400V,TO-220AB SCR THYRISTOR,8A,400V,TO-220AB SCR THYRISTOR,12A,400V,TO-220AB SCR THYRISTOR,15A,400V,TO-220AB SCR THYRISTOR,40A,400V,TO-220AB SCR Thyristor SCR THYRISTOR,8A,600V,TO-220AB SCR THYRISTOR,8A,600V,TO-220AB SCR THYRISTOR,55A,600V,TO-220AB SCR THYRISTOR,6A,800V,TO-220 SCR THYRISTOR,8A,800V,TO-220AB SCR THYRISTOR,25A,800V,TO-220AB CRYSTAL,10MHZ,18PF,THROUGH HOLE CRYSTAL,12MHZ,18PF,THROUGH HOLE CRYSTAL 12.288MHZ 18PF THROUGH HOLE CRYSTAL 14.7456MHZ 18PF THRU HOLE CRYSTAL,16MHZ,18PF,THROUGH HOLE CRYSTAL 18.432MHZ 18PF THROUGH HOLE CRYSTAL,24MHZ,18PF,THROUGH HOLE CRYSTAL 24.576MHZ 18PF THROUGH HOLE CRYSTAL 3.6864MHZ 18PF THROUGH HOLE CRYSTAL,6MHZ,18PF,THROUGH HOLE CRYSTAL 11.0592MHZ 18PF THRU HOLE CRYSTAL,12MHZ,18PF,THROUGH HOLE CRYSTAL 14.4756MHZ 18PF THRU HOLE CRYSTAL 3.579545MHZ 18PF THRU HOLE CRYSTAL 3.6864MHZ 18PF THROUGH HOLE CRYSTAL,32MHZ,18PF,THROUGH HOLE CRYSTAL 4.096MHZ 18PF THROUGH HOLE CRYSTAL 4.9152MHZ 18PF THROUGH HOLE CRYSTAL,48MHZ,18PF,THROUGH HOLE CRYSTAL,6MHZ,18PF,THROUGH HOLE CRYSTAL 7.3728MHZ 18PF THROUGH HOLE CRYSTAL,8MHZ,18PF,THROUGH HOLE CRYSTAL 9.8304MHZ 18PF THROUGH HOLE CRYSTAL,11.0592MHZ,18PF,SMD CRYSTAL,16MHZ,18PF,SMD CRYSTAL,19.6608MHZ,18PF,SMD CRYSTAL,22.1184MHZ,18PF,SMD CRYSTAL,24MHZ,18PF,SMD CRYSTAL,3.579545MHZ,18PF,SMD CRYSTAL,3.6864MHZ,18PF,SMD CRYSTAL,4.9152MHZ,18PF,SMD CRYSTAL,14.7456MHZ,18PF,SMD CRYSTAL,20MHZ,18PF,SMD CRYSTAL,20MHZ,10PF,SMD CRYSTAL,28.6363MHZ,18PF,SMD Microprocessor Crystal CRYSTAL,48MHZ,18PF,SMD CRYSTAL,12MHZ,18PF,SMD CRYSTAL,20MHZ,18PF,SMD CRYSTAL,28.63636MHZ,18PF,SMD CRYSTAL,10MHZ,16PF,THROUGH HOLE CRYSTAL,16MHZ,16PF,THROUGH HOLE CRYSTAL,20MHZ,16PF,THROUGH HOLE CRYSTAL 4.9152MHZ 16PF THROUGH HOLE CRYSTAL,6MHZ,16PF,THROUGH HOLE CRYSTAL,8MHZ,16PF,THROUGH HOLE CRYSTAL OSCILLATOR,18.432MHZ,THD CRYSTAL OSCILLATOR,20MHZ,THD CRYSTAL OSCILLATOR,40MHZ,THD CRYSTAL OSCILLATOR,50MHZ,THD OSCILLATOR,12MHZ,THROUGH HOLE OSCILLATOR,20MHZ,THROUGH HOLE OSCILLATOR,27MHZ,THROUGH HOLE OSCILLATOR,4MHZ,THROUGH HOLE OSCILLATOR,40MHZ,THROUGH HOLE OSCILLATOR,48MHZ,THROUGH HOLE OSCILLATOR,10MHZ,THROUGH HOLE OSCILLATOR,20MHZ,THROUGH HOLE CRYSTAL OSCILLATOR,12MHZ,SMD CRYSTAL OSCILLATOR,20MHZ,SMD OSCILLATOR,11.0592MHZ,SMD OSCILLATOR,18.432MHZ,SMD OSCILLATOR,24MHZ,SMD OSCILLATOR,4MHZ,SMD CERAMIC RESONATOR,16MHZ,THRU HOLE CERAMIC RESONATOR,20MHZ,THRU HOLE CERAMIC RESONATOR,6MHZ,THRU HOLE CERAMIC RESONATOR,20MHZ,SMD CERAMIC RESONATOR,6MHZ,SMD Ceramic Resonator CRYSTAL OSCILLATOR,1.8432MHZ,SMD CRYSTAL OSCILLATOR,14.7456MHZ,SMD CRYSTAL OSCILLATOR,16MHZ,SMD CRYSTAL OSCILLATOR,4MHZ,SMD CRYSTAL OSCILLATOR,14.7456MHZ,SMD CRYSTAL OSCILLATOR,16MHZ,SMD CRYSTAL OSCILLATOR,25MHZ,SMD CRYSTAL OSCILLATOR,50MHZ,SMD CRYSTAL OSCILLATOR,40MHZ,SMD CERAMIC RESONATOR,12MHZ,THRU HOLE CERAMIC RESONATOR,16MHZ,THRU HOLE CERAMIC RESONATOR,20MHZ,THRU HOLE CERAMIC RESONATOR 3.58MHZ THRU HOLE CERAMIC RESONATOR,4MHZ,THRU HOLE AIGUILLE 25 GAUGE ROUGE I.D .25MM AIGUILLE 23 GAUGE ORANGE I.D.33MM AIGUILLE 21 GAUGE POURPRE I.D .51MM AIGUILLE 18 GAUGE VERT I.D .84MM AIGUILLE 14 GAUGE OLIVE I.D 1.6MM TETE DISTRIBUTRICE ET TUBE 3CC TETE DISTRIBUTRICE ET TUBE 10CC TETE DISTRIBUTRICE ET TUBE 30CC SERINGUE 3CC PQ50 SERINGUE 10CC PQ50 SERINGUE 30CC PQ50 PISTON BLANC 3CC PISTON BLANC 10CC PISTON BLANC 30CC COUVERCLE 3CC DIODE,STANDARD,300A,1.6KV,DO-205AB-2 PROTECTION COVER,METAL PROTECTION COVER,METAL,16B,2 LEVER PROTECTION COVER,METAL PROTECTION COVER,METAL PROTECTION COVER,METAL TRIAC,SENS GATE,200V,4A,TO-220 TRIAC,SENS GATE,400V,6A,TO-220 TRIAC,400V,10A,TO-220 SCR THYRISTOR,3.8A,400V,TO-220AB Switched IEC Power Connector ADAPTATEUR PIC10F 6L SOT23 VERS DIP8 EXTENSION SOCKET,5WAY,IP44 TIMER MECANIQUE 24H IP44 ENGRAVING TOOL SET,EU-PLUGGED ENGRAVING TOOL DIAMOND-SET,EU-PLUGGED PROTECTION COVER,METAL ALIMENTATION 230 V SCR THYRISTOR,800mA,400V,TO-92 FIL JAUNE 100M PCB,3-Hole Pads 2 Sides (PTH) HEAT SHRINK TUBING KIT,EMI SHIELD,4.76MM ID,305MM HEAT SHRINK TUBING KIT,EMI SHIELD,6.35MM ID,305MM HEAT SHRINK TUBING KIT,EMI SHIELD,9.53MM ID,305MM HEAT SHRINK TUBING KIT,EMI SHIELD,12.7MM ID,305MM HEAT SHRINK TUBING KIT,EMI SHIELD,19.05MM ID,305MM MODULE DE MESURE D´ALIMENTATION BATTERIE POUR OSCILLOSCOPE CHARGEUR DE BATTERIE POUR OSCILLOSCOPE SONDE POUR OSCILLOSCOPE SACOCHE DE TRANSPORT SOUPLE POWER OUTLET STRIP CABLE SPEAKER 2X1.5 100M SONDE DE COURANT 2000A SONDE DE COURANT 100A SONDE DE COURANT 6A THERMOMETER,FOOD,FLUKE FOODPRO CABLE 2C+MASSE 6MM GRIS 25M HEAT GUN,2 SPEED PRISE UK POWER STRIP,4 OUTLETS,15A,120V F2812,EZ-DSP,ONBOARD JTAG EMULATION,STARTER KIT TESTEUR DE TENSION HOUSSE POUR MULTIMETRE TEST LEAD,HIGH POWER FLUKE TL238 PLIER,LONG NOSE CUTTER,SIDE,130MM FER A SOUDER GAZ PANNE PYROPEN BISEAU PANNE 1.6 MM PT-A7 PANNE 2.4 MM PT-B8 CAPACITOR CERAMIC 1000PF,200V,X7R,10%,RAD CAPACITOR CERAMIC,0.01UF,100V,X7R,±10%,RADIAL CAPACITOR CERAMIC 0.1UF,50V,X7R,10%,RAD EPONGE SIMPLE COUCHE (PQT DE 5) INTEGRATED POWER MODULE,600V,10A WELLER ABW-2 ANBAUWINKEL FER A SOUDER 60W FER A SOUDER 100W FER W201C MAGNASTAT SOUDURE POT MINIATURE 100W CT5A7PANNE 1.6 MM CT5B7PANNE 2.4 MM INDICATOR,LED PCB,2-LED,YELLOW/GREEN LED,GREEN,5MM X 2MM,10MCD,565NM LED,GREEN,T-1 (3MM),30MCD,565NM LED,RED,T-1 3/4 (5MM),40MCD,635NM LED,GREEN,T-1 3/4 (5MM),300MCD,565NM LED,T-1 3/4,RED / GREEN,RADIAL TVS DIODE,1.5KW,150V,DO-201AE TVS DIODE,1.5KW,30V,DO-201AE ET-A PANNE 1.6 MM SINGLE CONDUCTOR WIRE CABLE/WIRE TYPE:HO ET-B PANNE 2.4 MM ET-D PANNE 4.6 MM ET-L PANNE 2.0 MM CAPACITOR CERAMIC 33PF 50V,C0G,5%,060 Contact Insertion Tool,22-30 Cable CAPACITOR CERAMIC,0.1UF,16V,X7R,5%,0603 DESOXYDANT DE CONTACT. 400ML CAPACITOR CERAMIC 10PF 50V,C0G,5%,060 NETTOYANT. POUR ELECTRONIQUE. 200ML VERNIS. INSOLANT. PCB. 400ML VERNIS CONFORME. URETHAN 71. 200ML ET-M PANNE 3.2 MM ET-O PANNE 0.8 MM PANNE ET-R1.6 MM BUSE BOUNDING METAL CUTTER,SIDE,125MM CUTTER,SIDE,125MM CUTTER,SIDE,108MM HEAT SHRINK TUBING,9.525MM ID,PO,BLK,100FT SPRING HOOK,DOUBLE END INSPECTION MIRROR INSPECTION MIRROR INSPECTION MIRROR TRIMMING TOOL,SLOT,3.2MM TRIMMING TOOL,SQUARE EXTRACTOR LAMP PLUG,6.35MM JACK PLUG,6.35MM JACK,PK2 SONDE DE COURANT CA 15A TOURNEVIS TEST CLEANER,7061,400ML SYSTEME EXTRACTION DE FUMEE COMPLET SYSTEME POUR 2 POSTES BRAS FLEXIBLE ANTISTATIQUE 1.2M BRAS 600MM TUYAU ET SUPPORT PRE FILTRE POUR BVX200 (PQ DE 5) FILTRE PRINCIPAL POUR BVX200 FILTRE GAZ POURR BVX200 WIREWOUND INDUCTOR,22UH,80MA 10% 16MHZ WIREWOUND INDUCTOR,47UH,60MA 10% 11MHZ WIREWOUND INDUCTOR,22UH 105MA 10% 16MHZ WIREWOUND INDUCTOR,1MH,15MA 10% 2.4MHZ WIREWOUND INDUCTOR,10UH 200MA 20% 40MHZ WIREWOUND INDUCTOR 4.7UH 295MA 20% 45MHZ WIREWOUND INDUCTOR,10UH 245MA 20% 32MHZ WIREWOUND INDUCTOR,100UH,75MA 20% 8MHZ WIREWOUND INDUCTOR 470UH 45MA 20% 3.5MHZ CAPACITOR CERAMIC 0.47UF 6.3V,X5R,10%,0402 CAPACITOR CERAMIC 0.22UF,10V,X5R,10%,0402 CAPACITOR CERAMIC,4.7UF,10V,X5R,10%,0805 CAPACITOR CERAMIC,0.01UF,16V,0603 5% CAPACITOR CERAMIC 0.015UF,35V,SD,0805 CAPACITOR CERAMIC,0.1UF,10V,0805 5% Toggle Switch Toggle Switch Toggle Switch CAPACITOR CERAMIC,0.1UF,25V,1206 10% WIREWOUND INDUCTOR 4.7UH 140MA 20% 45MHZ Drill Bits/Cutting Bits/Cutting Bit Sets GAINE THERMO 1.6MM ROUGE 10M GAINE THERMO 9.5MM ROUGE 5M GAINE THERMO 12.7MM ROUGE 5M GAINE THERMO 2.4MM BLEU 10M GAINE THERMO 3.2MM BLEU 10M GAINE THERMO 12.7MM BLEU 5M KIT MULTIMETRE AUTOMOBILE GAINE THERMO 1.6MM CLAIR 10M GAINE THERMO 25.4MM CLAIR 5M CAPTEUR DE LUMIERE AMBIENTE CMS FICHE FEMELLE EN LIGNE 8 VOIES PLUG,IN-LINE 4WAY FICHE MALE MONTAGE PANNEAU 8 VOIES CORDON SILICONE POUR TCP-S JACK,PHONO PCB YEL SOCKET,2.5MM JACK SOCKET,3.5MM JACK PLUG,PHONO,IN-LINE SOCKET,PHONO,IN-LINE PROCESS METER CAPACITOR CERAMIC,1UF,50V,X7R,20%,RADIAL ENCLOSURES,GROMMET STRIP ACCESSORIES CONTACT,PIN,28-18AWG,CRIMP PROCESS/TEMPERATURE CONTROLLER GAS CARTRIDGE,100ML ACTUATOR,PUSH KIT PIC KIT1 MISE A JOUR POUR PIC10F ADAPTATEUR PROGRAMMATEUR POUR PIC10F PROXIMITY SWITCH,INDUCTIVE PROXIMITY SWITCH,INDUCTIVE SERRE CABLE NATUREL 360X7.5 PQT100 BASE,CABLE TIE MOUNT,20X14X3.7MM FITTING TOOL,27MM FITTING TOOL,30MM CONNECTOR,D SUB COMBO,RECEPTACLE,9POS,9W4 ESD Statshield Protective Jacket Smock ESD Statshield Protective Jacket Smock TOGGLE SWITCH,SPDT SWITCH KEYPAD 4X4 20mA 24V POLYCARBONATE ROTARY SWITCH,PCB,BCD LOUVER PLATE KIT,5.62INX7.5IN LOUVER PLATE KIT,7.88INX7.5IN ROTARY SWITCH,PCB,HEX ENCLOSURE,WALL MOUNT,STEEL,GRAY ENCLOSURE,WALL MOUNT,STEEL,GRAY ENCLOSURE,PUSH BUTTON,2 HOLE,STEEL ROTARY SWITCH,PCB,BCD LAMP,STACKABLE,INDICATOR,RED/GRN ROTARY SWITCH,1POLE,10WAY ROTARY SWITCH,2POLE,5WAY ROTARY SWITCH,3POLE,4WAY PUSHBUTTON SWITCH,1POLE PUSHBUTTON SWITCH,1POLE SWITCH 56-121.21.1000.23.05.001 HAS REPL PUSHBUTTON SWITCH,2POLE Solid-State Panel Mount Relay TAPERED CUTTER,FLUSH,1.2MM,115MM TAPERED CUTTER,FULL FLUSH,1MM,115MM OVAL CUTTER,FLUSH,1MM,115MM TOOLS,CUTTERS LOUVER PLATE KIT,5.62INX5.5IN LOUVER PLATE KIT,4.75INX4.5IN LOUVER PLATE KIT,10.56INX9.5IN PUSHBUTTON SWITCH,2POLE MOUNTING KIT FICHE FEMELLE LIBRE AUTODENUDANTE 8VOIES FICHE FEM LIBRE AUTODENUDANTE 14VOIES FICHE FEM LIBRE AUTODENUDANTE 16VOIES BARRETTE 2.5MM 4 VOIES MAS 80S CONNECTEUR DIN 8 POLES MAW1 50SR CONNECTEUR DIN 5 POLES MAW1 60B CONNECTEUR DIN 6 POLES MAW1 70B CONNECTEUR DIN 7 POLES MAB8SH DIN FEMELLE PCB 8 POLES COUPLEUR 4MM ROUGE KD10 PQ5 CORDON DE MESURE MLB25/1V BLEU 4MM Zener Diode ZENER DIODE,2.3W,150V,DO-219AB ZENER DIODE,2.3W,16V,DO-219AB ZENER DIODE,2.3W,27V,DO-219AB ZENER DIODE,2.3W,3.9V,DO-219AB ZENER DIODE,2.3W,4.3V,DO-219AB ZENER DIODE,2.3W,6.8V,DO-219AB ZENER DIODE,2.3W,62V,DO-219AB ZENER DIODE,2.3W,7.5V,DO-219AB ZENER DIODE,2.3W,82V,DO-219AB CORDON DE MESURE MLB100/1V BLEU 4MM Ceramic Multilayer Capacitor Ceramic Multilayer Capacitor WIREWOUND INDUCTOR,10UH 155MA 20% 32MHZ WIREWOUND INDUCTOR,10UH 165MA 20% 30MHZ WIREWOUND INDUCTOR 470UH 25MA 20% 3.5MHZ CIRCUIT BREAKER,THERMAL MAG,1P,30A RECTIFIER MODULE,1.6KV,31A,SEMIPACK 1 DIODE,STANDARD,320A,1.8KV,DO-205 Wirewound Inductor EMBASE CI DROITE 16 VOIES 94V-2 EMBASE CI COUDEE 12 VOIES UL94V-2 EMBASE COUDEE A PLATINE 12 VOIES 94V-2 CAPOT SORTIE LATERALE M25 EMBASE CI DROITE 8 VOIES 94V-2 EMBASE CI COUDEE 4 VOIES UL94V-2 EMBASE CI COUDEE 8 VOIES UL94V-2 EMBASE CI DROITE 24 VOIES 94V-2 POSITIONNEUR PRO CRIMPER 26-22AWG POSITIONNEUR PRO CRIMPER 22-18AWG COMMUTATEUR SECTEUR P1-25/I/SVB MAINS SWITCH,P1-25/E ROTARY SWITCH,T0-1-15431/E ROTARY SWITCH,T0-1-15402/E INDICATEUR A LED 7MM ROUGE CONDENSATEUR 4700UF 10V CONDENSATEUR 470UF 16V CONDENSATEUR 4700UF 16V CONDENSATEUR 100UF 25V CONDENSATEUR 470UF 25V CONDENSATEUR 33UF 250V CONDENSATEUR 10UF 35V CONDENSATEUR 100UF 35V CONDENSATEUR 100UF 35V CONDENSATEUR 470UF 35V CONDENSATEUR 220UF 35V CONDENSATEUR 560UF 35V CONDENSATEUR 47UF 100V FERRULES,TWIN WIRE END,1.5MM2,CRIMP,RED RF/COAXIAL,N PLUG,STR,50 OHM,CRIMP CONNECTOR,RCA/PHONO,PLUG,2POS CONNECTOR,RCA/PHONO,PLUG,3POS CONNECTOR,RCA/PHONO,JACK,3POS CONNECTOR,RCA/PHONO,JACK,2POS CONNECTOR,RCA/PHONO,JACK,3POS ADAPTER,XLR PLUG TO RCA RCPT ADAPTER,XLR RCPT TO RCA RCPT FERRULES,TWIN WIRE END,20AWG,CRIMP,ORANGE CRIMP TOOL,INSULATED TERMINALS APPLICATOR TOOL,TYPE Z DIODE 0.35A 0603 DIODE 0.35A 0603 DIODE 0.5A BOITIER 0805 DIODE 0.5A BOITIER 0805 DIODE 0.5A BOITIER 1206 DIODE 0.5A BOITIER 1206 TUBE THERMO NOIRE SUR JAUNE 6MM TUBE THERMO NOIR SUR JAUNE 19MM CARTE PICKIT POUR ANALYSE DE SIGNAL TRANSISTOR MOSFET DOUBLE P SO-8 TRANSISTOR MOSFET CANAL N POWERPAK TRANSISTOR MOSFET CANAL N BOITIER SO-8 TRANSISTOR MOSFET CANAL P BOITIER SO-8 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SO-8 TRANSISTOR MOSFET CANAL N POWERPAK TRANSISTOR MOSFET CANAL P POWERPAK TRANSISTOR MOSFET CANAL P POWERPAK TRANSISTOR MOSFET DOUBLE N POWERPAK PLIER,ADJUSTABLE GRIP LAMPE D´INSPECTION 11W/110V TORCH,RECHARGEABLE MOUNTING COLLAR CIRCUIT BREAKER,THERMAL MAG,1P,15A TOOLS,SETS SCREWDRIVERS TRANSISTOR MOSFET CANAL N BOITIER TO-220 TRANSISTOR MOSFET CANAL N BOITIER TO-220 MOSFET N TO-247 DIODE ULTRA RAPIDE SMA TAPE,GAFFER,WATERPROOF,BLUE BEACON,XENON,15-28V,AMB BEACON,XENON,180-250VAC,RED ADAPTATEUR INTERFACE ICD2 POUR 16F716 EMBASE DROITE 9X2 VOIES CLE DE CODAGE MODUII CONTACT MALE AWG26-22. DORE PINCE A SERTIR CONVERTISSEUR A/N 8 BITS 30-100MSPS CONVERTISSEUR A/N 12 BITS 40MSPS CMS AMPLIFICATEUR OP 3V 270MHZ CMS AMPLIFICATEUR OP 3V 270MHZ CMS AMPLIFICATEUR OP 3V 270MHZ DOUBLE CMS AMPLIFICATEUR VIDEO 400MHZ VIDEO CMS AMPLIFICATEUR VIDEO 400MHZ VIDEO CMS AMPLIFICATEUR VIDEO 400MHZ VIDEO CMS AMPLIFICATEUR VIDEO 400MHZ VIDEO CMS AMPLIFICATEUR LARGE BANDE 1MA CMS AMPLIFICATEUR VIDEO TRIPLE CMS BUFFER A BOUCLE FERMEE 1.75GHZ CMS BUFFER A BOUCLE FERMEE 1.75GHZ CMS AMPLIFICATEUR A GAIN VARIABLE CMS AMPLIFICATEUR A GAIN VARIABLE CMS AMPLIFICATEUR AUDIO 1.3W CLASS D AMPLIFICATEUR AUDIO 1.3W CLASS D COMMUTATEUR ANALOG. SPDT DOUBLE CMS COMMUTATEUR ANALOG. SPDT DOUBLE CMS COMMUTATEUR ANALOG. SPDT DOUBLE CMS COMMUTATEUR ANALOG. SPDT DOUBLE CMS TRANSMETTEUR LVDS CMS 65MHZ TRANSMETTEUR LVDS CMS 85MHZ TRANSMETTEUR LVDS CMS 65MHZ TRANSMETTEUR LVDS CMS 65MHZ DRIVER HAUTE TENSION 100V CMS DRIVER 5A DOUBLE CMS TRANSMET. BUS RS422/485 5V BUS XCVR 15KV REGULATEUR LDO 150MA CMS REGULATEUR LDO 150MA CMS DOUBLE CONVERTISSEUR C.C. PWM CMS REGULATEUR CMS CANAL N FET CONVERT. BOOST 0.6/1.6 MHZ 22V SOT-23 CONVERT. BOOST 0.6/1.6 MHZ 22V SOT-23 REGULATEUR HAUTE TENSION (100V) REGULATEUR HAUTE TENSION (100V) CONTROLEUR PWM 100V MODE COURANT CONTROLEUR PWM 100V MODE COURANT CONTROLEUR PWM 100V MODE COURANT CONTROLEUR PWM 100V MODE COURANT BLOC D´ECLAIRAGE B22 100W TRANSP BLOC D´ECLAIRAGE GLS 100W VERRE TRANSP BLOC D´ECLAIRAGE POLY. GLS 100W BOITIER STYRENE GRIS/BLANC BOITIER MINIATURE 25X25X15 BOITIER MINIATURE 25X25X25 BOITIER MINIATURE 30X20X15 BOITIER MINIATURE 40X13X16 BOITIER MINIATURE 40X13X25 BOITIER MINIATURE 40X40X13 PIR-ECLAIRAGE MONTAGE SURFACE PIR-ECLAIRAGE MONTAGE MURAL CELLULE PHOTO-ELECTRIQUE CELLULE PHOTO-ELECTRIQUE AJUSTABLE PROBE KIT,4PCS BOITIER MINIATURE 50X50X15 COMPARATEUR CMS COMPARATEUR CMS DOUBLE AMPLI. OP. 3.5MHZ CMS VCO TRIPLE BANDES CMS REGULATEUR LDO CMS 0.8A AJUST REGULATEUR LDO CMS 3A AJUST REGULATEUR LDO CMS 1.5A AJUST REGULATEUR LDO CMS 1.5A AJUST ENCLOSURE,EUROCARD 185MM NUMERIQUE COMMUTEUR HORAIRE NUMERIQUE COMMUTEUR HORAIRE SERIALISEUR BUS LVDS 10 BIT 16-40 MHZ SERIALISEUR/DESERIALISEUR 16BITS CMS REGULATEUR DE TENSION 30MA CMS REGULATEUR DE TENSION 30MA CMS REGULATEUR LDO CMS 1.5A AJUST CONVERTISSEUR C.C./C.C. STATIC DISSIPATIVE SOLVENT DISPENSER STANDARD DIODE,9.5A,400V TO-220AB STANDARD DIODE,15.9A 400V TO-220AB STANDARD DIODE,15.9A 400V TO-220AB TRANSISTOR MOSFET CANAL N TO220 55V 110A AXIAL FAN,30MM,5VDC,100mA AXIAL FAN,35MM,5VDC,80mA AXIAL FAN,40MM,5VDC,75mA AXIAL FAN,50MM,5VDC,160mA POWER OUTLET,16WAY,48IN,BLACK DRIVER/RECEPTEUR LVDS REGULATEUR LDO CMS 0.8A 3.3V REGULATEUR LDO CMS 0.8A 3.3V REGULATEUR DE TENSION 5A AJUST EMBASE COLLIER PR CABLE 20X14X3.7 PQT100 EMBASE COLLIER PR CABLE 32X25X5.2 PQT100 BASE,CABLE TIE MOUNT,28X28X5MM EMBASE COLLIER PR CABLE 38X38X6.4 PQT100 FICHE JACK 3.5MM MONO FICHE JACK 3.5MM STEREO DOREE MOUNTING ARM,EX LONG BLACK AXIAL FAN,60MM,12VDC,120mA AXIAL FAN,60MM,24VDC,190mA AXIAL FAN,60MM,12VDC,120mA AXIAL FAN,60MM,24VDC,70mA AXIAL FAN,80MM x 80MM x 15MM,12VDC,230MA AXIAL FAN,80MM,24VDC,160mA AXIAL FAN,80MM,12VDC,450mA AXIAL FAN,80MM,24VDC,190mA CASE,73/77 SERIES FLUKE Y8105-C100 DOUBLE DRIVER DE GATE 5A CMS AMPLIFICATEUR POUR MICRO. CMS 20DB GAIN AMPLIFICATEUR POUR MICRO. CMS 25DB GAIN CONVERTISSEUR C.C. POUR LED BLANCHES JOYSTICK SWITCH JOYSTICK SWITCH JOYSTICK SWITCH JOYSTICK SWITCH JOYSTICK SWITCH JOYSTICK SWITCH JOYSTICK SWITCH LIMIT SWITCH,SINGLE LIMIT SWITCH,SINGLE LIMIT SWITCH,SINGLE LIMIT SWITCH LIMIT SWITCH SAFETY SWITCH SAFETY SWITCH SAFETY SWITCH ACTUATOR RADIUS ACTUATOR RADIUS ACTUATOR SAFETY SWITCH ACTUATOR SAFETY SWITCH SWITCH,SAFETY,2NC+1NO+1NC,24VAC/DC ACTUATOR RADIUS ACTUATOR ACCEPTANCE SWITCH SAFETY SWITCH SAFETY SWITCH SAFETY SWITCH SAFETY SWITCH ACTUATOR SAFETY MODULE GAINE THERMO 25.4MM NOIR PAR M CONNECTOR,POWER ENTRY,PLUG,50A CARTOUCHE CHAUFFANTE 8X130MM. 400W CHARGER,15V,0.3A,EU POINTE CONDUCTRICE TIPS ((NS)) APPAREIL MODULAIRE HAMEG HM8001 NETTOYANT DE CONTACTS SWC HAMEG HO79-6 IEEE488-INTERFACE HAMEG HZ530 AKT.MESSONDENSATZ INDICATEUR DE TEMPERATURE 116C/154C SONDE OSCILLOSCOPE GENERATEUR FONCTIONS HAMEG HM8030 APPAREIL MODULAIRE HAMEG HM800 LC METRE HAMEG HM8018 SOFTWARE,DATA LOGGING DATABOOK BOOK,DAS SENSOR-KOCHBUCH BOOK,BLUETOOTH MOBILCOMPUTING WIRE WRAP TOOL,MANUAL,30-22AWG WIRE WRAP TOOL,230V,30-20AWG TOOL KIT,BATTERY,WIRE WRAP,230V WIRE WRAP BIT,MODIFIED,26AWG WIRE WRAP BIT,MODIFIED,24AWG WIRE WRAP BIT,MODIFIED,24-26AWG WIRE WRAP BIT,MODIFIED,22AWG WIRE WRAP SLEEVE,MODIFIED,30-32AWG WIRE WRAP SLEEVE,REGULAR,26AWG WIRE WRAP SLEEVE,REGULAR,24AWG WRAPPING AND UNWRAPPING TOOL,HAND WRAPPING AND UNWRAPPING TOOL,HAND WRAPPING AND UNWRAPPING TOOL,HAND WRAPPING AND UNWRAPPING TOOL,HAND UNWRAPPING TOOL,HAND,INSULATED UNWRAPPING TOOL,HAND WRAP/STRIP/UNWRAP TOOL WRAP/STRIP/UNWRAP TOOL WRAP/STRIP/UNWRAP TOOL WRAP/STRIP/UNWRAP TOOL INDICATEUR NEON VERT CORD CONNECTOR,STR,NYLON 6.6,PG9,GREY AXIAL FAN,119MM,12VDC,190mA AXIAL FAN,119MM,12VDC,400mA LEAD,EURO 2PIN,WHITE,3M LEAD,EURO 2PIN,BLACK,2M PICKUP TOOL,FLEXIBLE,GRIP,525MM TOURNEVIS TEST 250V LENS,MANUAL IRIS,MEGA PIXEL,16MM PRESSURE SENSOR CORD RETAINING KIT,PLUG CONNECTORS FRAISE HB2 SPARE BLADE FOR WIRE STRIPPER CORDON DE MESURE 4MM BLEU CORDON DE MESURE 4MM JAUNE/VERT CORDON DE MESURE 4MM NOIR CORDON DE MESURE 4MM BLEU CORDON DE MESURE 4MM BLEU CORDON DE MESURE 4MM VERT CORDON DE MESURE 4MM NOIR CORDON DE MESURE 4MM ROUGE CORDON DE MESURE 4MM BLEU FICHE 4MM SECURITE BLEUE FICHE 4MM SECURITE JAUNE CORDON DE MISE A LA TERRE 1 MEG JEU DE BRACELET 2 MEG CAT5E MODULAR PLUG,8POS,1 PORT CAT6 MODULAR PLUG,8POS,1 PORT FITTING TOOL,55MM PRONG,27MM,PK3 WIRE WRAP TOOL,ELECTRIC,230V CHARGER,LEAD-ACID,48W,12V SERRE CABLE NATUREL 245MM PQT100 VICE BALL SWIVEL MOUNTED ETAU SANS BASE SUPPORT CARTE ELECTRONIQUE ADAPTATEUR D´ANGLE ETAUX SPANNFIX ETAUX SPANNFIX TOURNEVIS PLAT 10MM OPTOCOUPLEUR CMS SORTIE DARLINGTON OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS OPTOCOUPLEUR CMS LED TELUX ORANGE LED TELUX ROUGE LED TELUX ROUGE 110 DEGRES LED TELUX BLANC LED TELUX BLANC 90 DEGRES LED TELUX JAUNE LED TELUX JAUNE LED TELUX JAUNE LED CMS ROUGE ULTRA BRILLANT TOURNEVIS PHILLIPS NO.3X150MM LED CMS JAUNE LED CMS JAUNE/VERT DRIVER,OFFSET,DOUBLE END,PH NO 2,3 TOURNEVIS POZIDRIV NO.0 TOURNEVIS POZIDRIV NO.2 COFFRET TEKNET NOIR/GRIS COFFRET TEKNET NOIR/GRIS COFFRET TEKNET NOIR/GRIS COFFRET TEKNET NOIR/GRIS COFFRET TEKNET NOIR/GRIS BOITIER DE COMMANDE OVO 3 TOURNEVIS COUDE A DOUBLE EMPREINTE TOURNEVIS PLAT VDE 3.5MM TOURNEVIS PLAT VDE 4MM CONNECTEUR CIRCULAIRE CONNECTEUR CIRCULAIRE CONNECTEUR CIRCULAIRE TOURNEVIS PLAT VDE 5.5MM PRISE APPAREIL FICHE ‚ ANGLE M8 TOURNEVIS PLAT VDE 6MM FICHE AVEC CABLE S•RIE ST 1M FICHE AVEC CABLE S•RIE ST 5M TOURNEVIS PLAT VDE 8MM FICHE MALE 6.35MM 3P NOIR/NICKEL EMBASE XLR 5P MALE CIRCUIT IMPRIME NUT DRIVER,VDE,5.5MM NUT DRIVER,VDE,7MM NUT DRIVER,VDE,8MM JEU DE 6 TOURNEVIS JEU DE 6 TOURNEVIS LABEL,WARNING,50 X 95MM,PK10 LABEL,HARMONISED COL,10X5CM,PK10 LABEL,WARNING,50 X 60MM,PK10 TOURNEVIS TORX T27 TOURNEVIS TORX T40 TOURNEVIS TORX T45 JEU DE 7 TOURNEVIS TORX ALLEN KEY SET,369 SERIES,7PC ALLEN KEY SET,369 SERIES,9PC TOURNEVIS 6 PANS TETE SHERIQUE 6MM DRIVER,LONG T HANDLE,HEXAGON,5MM NUT DRIVER,T HANDLE,3/8´´ EXTRACTION TOOL SET,10PC DRIVER,HEXAGON BIT,FLEXIBLE DRIVER,T HANDLE,HEXAGON,3/16 DRIVER,T HANDLE,HEXAGON,7/32 PINCE MULTIPRISES COBRA 300MM BLADE,PK12 BLADE,PK12 BLADE,3726 PK12 BLADE,PK12 BORNIER UNIVERSEL BORNE AUTODENUDANTE QTC 1.5MM VERT/JAUNE EQUERRE TERMINAL CLIPFIX ADAPTATEUR DE TEST PARTITION PLATE BRIDGE,PLUG IN CABLE MARKER,HG 1-3 (3) CABLE MARKER,HG 1-3,4 GAS IRON,PYROPEN JUNIOR DISQUE ACIER 100X1.2MM DISQUE INOX 100X1.2 BUSE REFLECTEUR BUSE DE REDUCTION MESUREUR D´ANGLE DISQUE A TRONCONNER INOX 125X1 DISQUE A TRONCONNER STAIN 125X16 DISQUE A TRONCONNER INOX 230X2 DISQUE A TRONCONNER ACIER 115X16 DISQUE A TRONCONNER ACIER 115X25 DISQUE A TRONCONNER ACIER 125X16 DISQUE A TRONCONNER ACIER 125X25 DISQUE A TRONCONNER ACIER 230X25 DISQUE A TRONCONNER ACIER 230X30 MEULER A EBARBER ACIER 125X6 MEULER A EBARBER ACIER 230X6 DISQUE A TRONCONNER MAT. 115X25 DISQUE A TRONCONNER MAT. 230X30 CT5C7 PANNE 3.2 MM PIED REGLABLE EXTRACTEUR FUMEES PIED REGLABLE PIED REGLABLE FILTRE POUR LDA4 DISSOLVANT DE RESIDUS DE FLUX. 400ML REFRIGERANT. AEROSOL. 400ML CRIMP TOOL FUSE,FAST 2.0A CASE,MULTIMETER SOLDER WIRE,FSW34,0.8MM,250G SOLDER WIRE,FSW34,0.8MM,500G SOLDER WIRE,FSW34,1.0MM,250G Function / Arbitrary Waveform Generator PINCE A SERTIR Photoelectric Sensor Output Type:Transis GUIDE-FIL POUR TCPS/WECP80 TRIAC,SENS GATE,400V,4A,TO-220 NAMEPLATE,WARNING,60MM DIA NAMEPLATE,WARNING,80MM DIA SWITCH,EMERGENCY STOP,2NC,250VAC SWITCH,EMERGENCY STOP,1NO/1NC,250VAC Pushbutton Switch Switch Function:4PST-1 SWITCH,EMERGENCY STOP,2NC,250VAC SWITCH,EMERGENCY STOP,1NO/1NC,250VAC SWITCH,EMERGENCY STOP,3NC/1NO,250VAC SWITCH,EMERGENCY STOP,2NC,250VAC SWITCH,EMERGENCY STOP,1NO/1NC,250VAC SWITCH,EMERGENCY STOP,2NC,250VAC SWITCH,EMERGENCY STOP,1NO/1NC,250VAC SWITCH,EMERGENCY STOP,3NC/1NO,250VAC ENCLOSURE,BOX,PLASTIC,GRAY WELLER PR106-2 GASLOETGERAET SCR THYRISTOR,510mA,400V,DO-214 POIRE A DESSOUDER POUR LR21 LAMPS,STACKABLE INDICATOR SPRING CONTACT RECEPTACLE,PCB,CRIMP SPRING CONTACT RECEPTACLE,PCB,SOLDER SPRING CONTACT RECEPTACLE,PCB,SOLDER SPRING CONTACT RECEPTACLE,PCB WIRE WRAP SPRING CONTACT RECEPTACLE,PCB,SOLDER SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB SPRING CONTACT PROBE,PCB CRIMP TOOL NBB Series Hinged Solid Door Box Enclosu ENCLOSURE,BOX,PLASTIC,GRAY ENCLOSURE,BOX,PLASTIC,GRAY ENCLOSURE,BOX,PLASTIC,GRAY PANNE PYROPEN POINTUE LONGUE SPARE NEEDLE,STANDARD BUSE DS119 PANNE CMS PANNE CMS ET-S PANNE 0.4 MM PANNE 0.4 MM PT-S7 PANNE 3.2 MM CT5C8 PANNE 3.2 MM CT5D8 PANNE 5.0 MM PANNE 1.6 MM TOURNEVIS 10MM COURBEE 45DEG STATION DE SOUDAGE TOPJOB S 2 COND TB 4 MM TERRE CAVALIER 2-VOIES GRIS CLAIR TOPJOB S 2 COND TB 10 MM GRIS FLASQUE D´EXTREMITE 3 COND TB ORANGE FLASQUE D´EXTREMITE POUR TB 3 COND´ GRIS CAVALIER 2-VOIES GRIS CLAIR CAVALIER 3-VOIES GRIS CLAIR CAVALIER 4-VOIES GRIS CLAIR FLASQUE D´EXTREMITE 2 COND TB ORANGE FLASQUE D´EXTREMITE POUR TB 2 COND´ GRIS NETTOYANT. POUR IMPRIMANTES GAINE THERMO 6.4MM NOIR 5M GAINE THERMO 9.5MM NOIR 5M GAINE THERMO 19.0MM NOIR 5M GAINE THERMO 25.4MM NOIR 5M DATA LOGGER,HUMIDITY VERNIS CONFORME. URETHAN 71. 400ML AXE FILETE MATERIAU V2A DEGRAISSANT. ELECTRIQUE ET MECANIQUE NETTOYANT. ANTISTATIQUE POUR ECRANS TVS DIODE,1.5KW,36V,DO-201AE MODULE. LOGO!. 24O MODULE. LOGO!. DM16. 24 MODULE. LOGO!. DM16. 24R MODULE. LOGO!. AM2. AQ MODULE. LOGO!. MANUEL. ALLEMAND CPU 222 AC/DC/RELAIS CPU 224 DC/DC/DC CPU 224 AC/DC/RELAIS CPU 226 DC/DC/DC CPU 226 AC/DC/RELAIS CARTOUCHE STOCKAGE DE DONNEE 64 KOCTETS SOFTWARE,STEP 7 MICRO/WIN V4 PANNEAU CONTA TP 177MICRO AFFI. 144.78MM OP 73MICRO/TP 177MICRO MANUEL (E) EMBASE DROITE 6 VOIES EMBASE DROITE 10 VOIES EMBASE DROITE 19 VOIES EMBASE PANNEAU 19 VOIES FICHE MALE EN LIGNE 5 VOIES FICHE MALE EN LIGNE 7 VOIES FICHE FEMELLE EN LIGNE 6 VOIES FICHE FEMELLE PANNEAU 3 VOIES FICHE FEMELLE PANNEAU 4 VOIES FICHE FEMELLE PANNEAU 5 VOIES EMBASE DROITE 2 VOIES GRIS EMBASE DROITE 4 VOIES NOIR EMBASE DROITE 5 VOIES NOIR CAPOT ANTI-POUSSIERE GRIS RONDELLE DE MASSE SERRE CABLE BLEU 3.9MM SERRE CABLE BLEU 6MM SERRE CABLE ROUGE 6MM TESTEUR DE TENSION TESTEUR DE TENSION ATEX TESTER,VOLTAGE,PRO TESTER,VOLTAGE,PRO TESTER,VOLTAGE ANEMOMETER,HANDHELD ANEMOMETER,HANDHELD CIRCUIT LOGIQUE CMOS 4000 CIRCUIT LOGIQUE 74AC CIRCUIT LOGIQUE 74HC CIRCUIT LOGIQUE 74HC CIRCUIT LOGIQUE 74HC CIRCUIT LOGIQUE 74HC CIRCUIT LOGIQUE 74HC CIRCUIT LOGIQUE 74HCT CIRCUIT LOGIQUE 74FCT CIRCUIT LOGIQUE AMPLI OP. QUADRUPLE AMPLI OP QUAD FAIBLE PUISSANCE SOIC14 FER A DESSOUDER DS80 SUB-D MALE. 25 VOIES INVERTER,FS WAVE,24V,150W,EURO INVERTER,FS WAVE,12V,300W,UK INVERTER,FS WAVE,24V,600W CONVERTISSEUR N/A 12 BITS DOUBLE CONVERTISSEUR N/A 24 BITS CMS CONVERTISSEUR A/N 12 BITS CMS CONVERTISSEUR A/N 8 BITS CMS MODULATEUR EN QUADRATURE CMS CONVERTISSEUR N/A 12 BITS QUAD 2.5V CMS CONVERTISSEUR DE SIGNAL 10 BITS CMS SOUDURE SANS PLOMB DIA 1.0MM 500GR. SOUDURE SANS PLOMB DIA 1.5MM 250GR. SOUDURE SANS PLOMB DIA 2.0MM 250GR. RELAIS DPNO 12V FICHE FEMELLE CI 6 POLES FICHE MALE CI 8 POLES FICHE FEMELLE CI 8 POLES FICHE FEMELLE CI 6 POLES FICHE MALE CI 9 POLES FICHE FEMELLE CI 12 POLES FICHE MALE PANNEAU 8 VOIES HORLOGE TEMPS REEL + CONTROLE DE CPU HORLOGE MULTIPLICATEUR/DIVISEUR HORLOGE AVEC BUFFER 1:10 CNA 10 BITS QUAD OSSI KK2A-16SUBD-9 ANSCHLUSSPLATTE RELAIS SPNO 24V CONVERTISSEUR A/N 12 BITS PARALLELE RELAIS DPNO 12V RELAIS DPNO 24V SOCKET,DIN/SURFACE,HE,RELAY PROGRAMMATEUR D´OSCILLATEUR SUPPORT DE PROGRAMMATION 5MM X 7MM OSCILLATEUR PROGRAMMABLE OSCILLATEUR PROGRAMMABLE OSCILLATEUR PROGRAMMABLE DESOLDERING STATION,ANTISTATIC,80W BAIN DE SOUDAGE EURO 40G-LOT 65W BAIN DE SOUDAGE EURO 185G-LOT 135W PINCE COUPANTE ANTISTATIQUE DIAGONAL PINCE COUPANTE ANTISTATIQUE DIAGONAL PINCE COUPANTE ANTISTATIQUE COMPACTE PINCE COUPANTE ANTISTATIQUE COMPACTE PINCE COUPANTE ANTISTATIQUE COMPACTE PINCE COUPANTE ANTISTATIQUE BECS LONGS PINCE COUPANTE ANTISTATIQUE BECS LONGS PINCE COUPANTE ANTISTATIQUE GRD CAPACITE PINCE COUPANTE ANTISTATIQUE GRD CAPACITE PINCE COUPANTE ANTISTATIQUE PINCE COUPANTE ANTISTATIQUE BECS LONGS PINCE COUPANTE ANTISTATIQUE BECS LONGS PINCE COUPANTE ANTISTATIQUE GRD CAPACITE PINCE COUPANTE ANTISTAT. COURBEE 30 DEG. PINCE COUPANTE ANTISTAT. COURBEE 70 DEG. PINCE COUPANTE ANTISTAT. COMPOSANTS DIP PINCE ANTISTATIQUE BECS PLATS PINCE ANTISTATIQUE BECS PLATS ETROITS PINCE ANTISTATIQUE BECS DEMI-RONDS PINCE ANTISTATIQUE BECS DEMI-RONDS TOURNEVIS POZIDRIV 0X75 TOURNEVIS POZIDRIV 1X75 TOURNEVIS TORX 5X35 TOURNEVIS TORX 6X35 TOURNEVIS TORX 7X35 TOURNEVIS TORX 8X75 TOURNEVIS TORX 9X75 TOURNEVIS TORX 10X75 JEU DE 5 TOURNEVIS TORX FER A SOUDER PRE FILTRES WELLER PQ3 SWITCH,TOGGLE,DPST,20A,250V Inductive Proximity Sensors INDUCTIVE PROXIMITY SENSORS FEMALE DISCONNECT,6.35 X 0.81MM,CRIMP TRIAC,400V,4A,TO-220 TRIAC,400V,1A,TO-92 TRIAC,400V,10A,TO-220 TRIAC,400V,15A,TO-220 TRIAC,400V,25A,TO-220AB TRIAC,600V,4A,TO-220 TRIAC,600V,35A,TO-3 SERRE CABLE METAL DIODE,TVS,300W,5V,UNIDIRECT,MSOP-10 CAPACITOR CERAMIC 4700PF 100V,C0G,5%,1210 1.00UF 50.OV C2225C105J5RAC7800 TESTER,PAT,EURO MICROCONTROLLER IC CONTROLLER SERIES:PIC SWITCH,TOGGLE,SPST,20A,250V SWITCH,TOGGLE,SPST,20A,250V SWITCH,TOGGLE,DPDT,20A,250V TERMINAL FEMALE DISCONNECT 0.81MM TAB,CRIMP PINCE MULTIPRISES COBRA 180MM CABLE TIE,PLUG FIXING 150X3.6 END PLATE,DIN RAIL TERMINAL BLOCK MOTEUR PAS A PAS 11. 40MM MOTEUR PAS A PAS 11. 50MM DRIVER MOTEUR PAS A PAS 3.5A DRIVER MOTEUR PAS A PAS 7.8A CONTROLEUR DE TEMPERATURE RLY RLY CONTROLEUR DE TEMPERATURE LGC RLY CONTROLEUR DE TEMPERATURE DC RLY CONTROLEUR DE TEMPERATURE LGC RLY RLY CONTROLEUR DE TEMPERATURE RLY RLY RLY CONVERTISSEUR N/A AUDIO 24 BITS CONVERTISSEUR N/A AUDIO AVEC USB CONVERTISSEUR N/A AUDIO AVEC USB CODEC AUDIO GENERATEUR MULTI-HORLOGES PLL DOUBLE CARTE DE REPERAGE HORIZONTALE ALPHA PQ10 OUTIL A DENUDER JEU DE 4 LAMES DE RECHANGE HSS EU DE 4 LAMES DE RECHANGE TITANE SUPPORT DE TABLE BOOK,16TH EDITION,5TH EDIT BOOK,BUILDING SERVICES HUILE DE COUPE. 300ML LUBRIFIANT ADHERENT POUR CHAINES LUBRIFIANT. CUIVRE. 100ML JOINT TORIQUE PISTOLET A DESSOUDER HAND TAP SET,HSS,GT,M6 X 0.75,2PC HAND TAP SET,HSS,GT,M8 X 1,2PC HAND TAP SET,HSS,GT,M10 X 1.25,2PC HAND TAP SET,HSS,GT,M14 X 1.5,2PC HAND TAP SET,HSS,GT,M16 X 1.5,2PC HAND TAP SET,HSS,GT,M18 X 1.5,2PC HAND TAP SET,HSS,GT,M20 X 1.5,2PC THREADING BIT,M5,HSS,GT,DIN13 THREADING BIT,M6,HSS,GT,DIN13 THREADING BIT,M8,HSS,GT,DIN13 THREADING BIT,M10,HSS,GT,DIN13 THREADING BIT SET,M3-M10,HSS,GT MACHINE TAP SET,SHORT,DIN352 THREAD-REPAIR-KIT,M4X0.7 THREAD-REPAIR-KIT,M5X0.8 THREAD-REPAIR-KIT,M10X1.5 THREAD-REPAIR-KIT,M12X1.75 THREAD-REPAIR-KIT,M5-12 SPARE BLADE,SMD,LIFTOFF LIFTOFF TOOL,SMD NOZZLE,VACUUM,6.0MM NOZZLE,VACUUM,9.0MM NOZZLE SET,FOR DS017LQ TOOLS,SOLDERING,TIPS,1/32 REPLACEMENT SO PROLONGATEUR DE KIT DE TEST POINTES DE TOUCHE AUTOMOBILES FUSE,TEST PROBE,10A,PK3 FUSIBLE 0.5A (PAQUET DE 3) PANNE BISEAU 2.6MM SUPPORT DE FER EMETTEUR RECEPTEUR RS-485 EMETTEUR RECEPTEUR RS-485 EMETTEUR RECEPTEUR DIFF TRANSMETTEUR LVDS 10:1 TRANSMETTEUR LVDS 10:1 DRIVER LVDS RECEPTEUR LVDS RECEPTEUR LVDS DOUBLE DRIVER LVDS DOUBLE EMETTEUR RECEPTEUR LVDS REPERE DE CABLE HG 1-3 (3) PQT250 AMPLI OP. CFB DOUBLE AMPLI OP. CFB 2.0GHZ AMPLI OP. 100-MHZ AMPLI OP. 100-MHZ AMPLIFICATEUR OPERATIONEL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. DIFFERENTIEL AMPLI OP. DIFFERENTIEL AMPLI OP. DIFFERENTIEL REPERE DE CABLE HG 1-3 (9) PQT250 COMPARATEUR COMPARATEUR CONTROLEUR PWM FILTRE DE BUTTERWORTH AMPLI OP. RAIL-RAIL QUADRUPLE AMPLI OP. RAIL-RAIL QUADRUPLE AMPLI OP. RAIL-RAIL DOUBLE CONVERTISSEUR A/N 8 BITS 31KSPS CONVERTISSEUR A/N 10 BITS 38KSPS CONVERTISSEUR A/N 10 BITS 38KSPS AMPLI OP. RAIL-RAIL DOUBLE AMPLI OP. RAIL-RAIL DOUBLE AMPLI OP. RAIL-RAIL DOUBLE CONVERTISSEUR A/N 12 BITS AMPLI OP. CHOPPER CONVERTISSEUR A/N 14 BITS 200KSPS CONVERTISSEUR A/N 14 BITS 200KSPS CONVERTISSEUR A/N 14 BITS 200KSPS COMPARATEUR DOUBLE CONVERTISSEUR A/N 8 BITS 45.5 KSPS CONVERTISSEUR A/N 8 BITS 40 KSPS CONVERTISSEUR N/A 8 BITS QUADRUPLE CONVERTISSEUR N/A 8 BITS QUADRUPLE CONVERTISSEUR N/A 8 BITS MULTIPLICATEUR CIRCUIT SUPERVISEUR AMPLI OP. AMPLIFICATEUR OPERATIONEL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL DOUBLE AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL QUADRUPLE CONVERTISSEUR A/N 12 BITS 200KSPS CONVERTISSEUR A/N 12 BITS 200KSPS AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL AMPLI OP. RAIL-RAIL DOUBLE AMPLI OP. RAIL-RAIL QUADRUPLE AMPLI OP. RAIL-RAIL CODEC AUDIO CNA 10 BITS QUAD CONVERTISSEUR N/A 10 BITS CONVERTISSEUR N/A 12 BITS CONVERTISSEUR N/A 12 BITS QUADRULPE CONVERTISSEUR N/A 12 BITS CONVERTISSEUR N/A 8 BITS QUADRUPLE CONVERTISSEUR N/A 8 BITS DOUBLE CONVERTISSEUR N/A 8 BITS OCTAL CONVERTISSEUR N/A 10 BITS CONVERTISSEUR N/A 12 BITS CAPTEUR DE TEMPERATURE AMPLI DE PUISSANCE AUDIO AMPLI DE PUISSANCE AUDIO AMPLI DE PUISSANCE AUDIO AMPLI DE PUISSANCE AUDIO COMMUTATEUR POUR DISTRIBUTION PUISS. COMMUT. POUR DISTRI. PUISS. DOUBLE COMMUT. POUR DISTRI. PUISS. DOUBLE COMMUT. POUR DISTRI. PUISS. DOUBLE COMMUTATEUR POUR DISTRIBUTION PUISS. DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DRIVER DE MOSFET DRIVER DE MOSFET DRIVER DE MOSFET DRIVER DE MOSFET DRIVER DE MOSFET CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR DOUBLE CIRCUIT SUPERVISEUR TRIPLE CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR SUPERVISEUR CIRCUIT 3828 SOT-23-5 SUPERVISEUR CIRCUIT 3828 SOT-23-5 CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CONVERTISSEUR CONVERTISSEUR CONVERTISSEUR CC-CC 100MA 3.3V POMPE DE CHARGE POMPE DE CHARGE CONVERTISSEUR AJUST CMS CONVERTISSEUR 1.2A AJUST. CONVERTISSEUR 1.2A 1.5V CONVERTISSEUR 1.2A 3.3V SOCKET,DIN/CHASSIS,JW1,RELAY CONVERTISSEUR MULTIMODE SOCKET,DIN/CHASSIS,JW2,RELAY CONVERTISSEUR DC/DC 120MA 12V CONVERTISSEUR DC/DC 120MA 12V REGULATEUR A DECOUPAGE 5V 200MA CMS REGULATEUR A DECOUPAGE AJUST CMS REGULATEUR LDO RELAIS DPNO 12V WIRE & CABLE MARKER LABELS LABELS LABELS WIRE & CABLE MARKER LABELS LABELS WIRE & CABLE MARKER LABELS LABEL IDENTIFICATION 22.86X12.7 BLK/WHT LABELS LABELS WIRE & CABLE HEAT-SHRINKABLE MARKER LABEL SLEEVES WIRE & CABLE HEAT-SHRINKABLE MARKER LABEL SLEEVES WIRE ID SLEEVE,HEAT SHRINK,25.8MM W,BLK ON WHT WIRE & CABLE HEAT-SHRINKABLE MARKER LABEL SLEEVES RELAIS LATCHING DPCO 12V HEAT SHRINK MARKER LABEL/SLEEVES,25.8MM W,BLK/WHT WIRE & CABLE HEAT-SHRINKABLE MARKER LABEL SLEEVES WIRE & CABLE HEAT-SHRINKABLE MARKER LABEL SLEEVES WIRE & CABLE HEAT-SHRINKABLE MARKER LABEL SLEEVES WIRE & CABLE HEAT-SHRINKABLE MARKER LABEL SLEEVES CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS,SELF LAM,12.7MM W,VINYL,WHT CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS CABLE ID MARKERS REGULATEUR LDO REGULATEUR LDO 50MA 3.0V REGULATEUR LDO 50MA 5.0V REGULATEUR LDO 50MA 5.0V REGULATEUR LDO 150MA 2.5V REGULATEUR LDO 150MA 2.5V REGULATEUR LDO 150MA 3.3V REGULATEUR LDO 250MA 5.0V REGULATEUR LDO 1A AJUST. REGULATEUR LDO 1A 5.0V REGULATEUR LDO 50MA AJUST REGULATEUR LDO 50MA AJUST FILTRE IEC COMMUTE 1A REGULATEUR LDO 500MA AJUST. REGULATEUR LDO 500MA 1.8V REGULATEUR LDO 500MA 2.5V REGULATEUR LDO 500MA 3.3V REGULATEUR LDO 150MA 3.3V REGULATEUR LDO 100MA 1.8V REGULATEUR LDO 100MA 1.8V DRIVER DE MOSFET DRIVER DE MOSFET DRIVER DE MOSFET DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DOUBLE CONTROLEUR PWM DOUBLE DRIVER DE MOSFET DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DOUBLE DRIVER DE MOSFET DOUBLE REVETEMENT. SILICONE. 200ML LUBRIFIANT. KONTAFLON 85. 200ML AMPLI OP. ENTREE FET SONDE OSCILLOSCOPE 300MHZ KIT DE TEST SONDE OSCILLOSCOPE 250MHZ ADAPTATEUR 4MM ADAPTATEUR 4MM GENERATEUR DE FONCTIONS ARBITRAIRES BIPOLAR TRANSISTOR,PNP,-65V TO-39 GUIDE HAN EE SWITCH,4GANG,2WAY SWITCH,2WAY,6GANG SWITCH,DP,20A,NEON,FLEX SWITCH,45A,2 POLE,COOKER CONTROL SWITCH,45A,2 POLE,COOKER CONTROL SWITCH,45A,2 POLE,LARGE PLATE OUTLET PLATE,45A SOCKET,COAXIAL,2GANG,ISOLATED SOCKET,1GANG,UNSWITCHED SOCKET,ROUND PIN,5A,1GANG DATA OUTLET,2G,RJ45 DATA OUTLET,1G,RJ11 TELEPHONE OUTLET,2G,MASTER BACK BOX,2GANG,10MM SPACER SURFACE BOX,2GANG,32MM SURFACE BOX,1GANG,19MM SURFACE BOX,1GANG,50MM SURFACE BOX,2GANG,50MM DIMMER SWITCH,2G,2WAY PUSH,250W CAPACITOR ALUM ELEC,25UF,150V,AXIAL Printable Label Cartridges ETHERNET CABLE ASSEMBLY Connector assemblies,Network cables FREINFILET STICK NORMAL WELLER MT1000D LOETSTATION DRIVER,T HANDLE,BALL,HEXAGON,5MM DRIVER,T HANDLE,BALL,HEXAGON,6MM MASTIC SILICONE NETTOYANT DE CARTE 400ML CIRCUIT IMPRIME -DOUBLE FACE CAPOT POUR FICLE MALE LIBRE ADAPTATEUR DE MONTAGE A VIS ATTENUATEUR 20DB SERRE CABLE SERRE CABLE HAUTE TEMPERATURE SERRE CABLE SERRE CABLE HAUTE TEMPERATURE SERRE CABLE SERRE CABLE HAUTE TEMPERATURE SERRE CABLE HAUTE TEMPERATURE SERRE CABLE RELAIS PHASE SEQ FAILURE RELAIS PHASE SEQUENCE FAILURE TIMER,MULTIFUNCTION,4 FUNCTION RELAIS TRUE DELAY OFF SLEEVING,SPIRAL,PE,4MM,WHT,30M RELAIS TRUE DELAY OFF RELAIS TRUE DELAY OFF RELAIS TRUE DELAY OFF PINCE AMPEREMETRIQUE SPLIT JAW ALIMENTATION POUR CONVERTISSEUR TRUNKING,PVC,GREY,25X40MM,2M TRUNKING,PVC,GREY,80X60MM,2M TRUNKING,PVC,GREY,25X80MM,2M TRUNKING,PVC,GREY,80X80MM,2M ENREGISTREUR DE TENSION USB SLEEVING,INSULATING,1.5MM,BLACK,100FT PINCES PIQUE-FILS 4MM JEU DE POINTES DE TOUCHE ARRIERE ADAPTATEUR BNC-2 FICHES BANANES FEMELLES POINTES DE TOUCHE ARRIERE TUBE LED CMS 0603 BLEU LED CMS 0603 BLEU LED CMS 0603 VERT LED CMS 0603 VERT LED CMS 0603 VERT LED CMS 0603 VERT LED CMS 0603 JAUNE LED CMS 0603 JAUNE LED CMS 0603 ORANGE LED CMS 0603 ROUGE LED CMS 0603 ROUGE LED CMS 0805 BLEU LED CMS 0805 BLEU LED CMS 0805 VERT LED CMS 0805 VERT LED CMS 0805 VERT LED CMS 0805 VERT LED CMS 0805 JAUNE LED CMS 0805 ORANGE LED CMS 0805 ORANGE LED CMS 0805 ROUGE LED CMS 0805 ROUGE LED CMS 0805 ROUGE LED CMS 0805 ROUGE LED CMS 1206 BLEU LED CMS 1206 BLEU LED CMS 1206 BLEU LED CMS 1206 VERT LED CMS 1206 VERT LED CMS 1206 VERT LED CMS 1206 JAUNE LED CMS 1206 JAUNE LED CMS 1206 ORANGE LED CMS 1206 ROUGE LED CMS 1206 ROUGE LED CMS 1206 ROUGE LED CMS 1206 ROUGE LED CMS 1206 VERT LED CMS 1206 JAUNE LED CMS 1206 JAUNE LED CMS 1206 LENTILLE BLEU LED CMS 1206 LENTILLE BLEU LED CMS 1206 LENTILLE VERT LED CMS 1206 LENTILLE VERT LED CMS 1206 LENTILLE VERT LED CMS 1206 LENTILLE JAUNE LED CMS 1206 LENTILLE ORANGE LED CMS 1206 LENTILLE ROUGE LED CMS 1206 LENTILLE LED CMS 1206 LENTILLE LED CMS 1206 LENTILLE LED CMS 1206 LENTILLE LED CMS 1206 LENTILLE LED CMS 1206 LENTILLE LED CMS 1206 LENTILLE LED CMS DOUBLE ROUGE/VERT LED CMS DOUBLE ROUGE/VERT LED CMS DOUBLE ROUGE/VERT LED CMS DOUBLE ROUGE/VERT LED R/V/B LED R/V/B LED CMS R/V/B LED CMS PLCC4 R/V/B LED CMS PLCC-2 ROUGE HE LED CMS PLCC-2 VERT LED CMS PLCC-2 JAUNE LED CMS PLCC-2 BLEU LED CMS PLCC-2 BLEU LED CMS PLCC-2 LED CMS PLCC-2 LED CMS PLCC-3 LED CMS PLCC-3 LED CMS PLCC-2 LED CMS PLCC-2 LED CMS PLCC-2 LED CMS PLCC-2 BLEU HE LED CMS ROUGE EMISSION LATERALE LED CMS VERT EMISSION LATERALE LED CMS JAUNE EMISSION LATERALE LED CMS BLANC INSERT DE SERTISSAGE 4.8/6.3MM ENCLOSURE,JUNCTION BOX,ALUMINIUM,GREY EMPREINTES DE SERTISSAGE 0.5/6MM EMPREINTES DE SERTISSAGE 0/16/25MM EMPREINTES DE SERTISSAGE 35/50MM EMPREINTES DE SERTISSAGE EMPREINTES DE SERTISSAGE RG58/59/62/71 EMPREINTES DE SERTISSAGE RG174/58 EMPREINTES DE SERTISSAGE PIN 0.14-4MM EMPREINTES DE SERTISSAGE FCC-68 AIDE DE POSITIONNEMENT POUR 97 49 60 PINCE A SERTIR STABILISATEUR LIGNE IMPEDANCE PRISE UK ADAPTOR,BNC,BB120,FLUKE 123BB120 HOOK,TEST,HC120,2PK HC120 PRISE RCD AIR FILTER AIR FILTER AIR FILTER TOOLS,HAND CRIMP CRIMPALL 8000 CRIMPER W/DIE WIRE/CABLE STRIPPER WIRE/CABLE STRIPPER INVERSSEUR 1 PHASE 0.25KW INVERSSEUR 1 PHASE 0.37KW INVERSSEUR 1 PHASE 0.55KW INVERSSEUR 1 PHASE 0.75KW INVERSSEUR 1 PHASE 1.1KW INVERSSEUR 1 PHASE 1.5KW AMPLIFICATEUR OP CMS 1MHZ 1.8V AMPLIFICATEUR OP CMS 1MHZ 1.8V AMPLIFICATEUR OP CMS 1MHZ 1.8V AMPLIFICATEUR OP CMS 1MHZ 1.8V AMPLIFICATEUR OP CMS 1MHZ 1.8V AMPLIFICATEUR OP CMS 1MHZ 1.8V AMPLIFICATEUR OP CMS 1MHZ 1.8V DOUBLE AMPLIFICATEUR OP CMS 1MHZ 1.8V QUADRUPLE CATAMOUNT CABLE TIE MOUNT SUPPORT CIRCUITS WELLER. ESF 120 BATTERIE PCB NI-MH 1.2V COMMUTATEUR ON/ON SPDT IP67 COMMUTATEUR ON/ON DPDT IP68 LENS,RED ROUND-FOR TP LENS,YELLOW ROUND-FOR TP CAP,GREY/RED ROUND-FOR TP OPTOCOUPLEUR 1MBD OPTOCOUPLEUR 10MBD OPTOCOUPLEUR RAPIDE OPTOCOUPLEUR CMOS 15MBD OPTOCOUPLEUR CMS 5MBD OPTOCOUPLEUR DRIVER D´IGBT SUPPORT DE FER LED CMS AMBRE ANGLE DROIT LED CMS AMBRE LED CMS AMBRE LED CMS ROUGE ANGLE DROIT LED CMS ROUGE LED CMS ROUGE LED CMS ROUGE LED CMS ROUGE LED CMS ORANGE ANGLE DROIT LED CMS ORANGE LED CMS ORANGE LED CMS BICOLOR VERT/JAUNE LED CMS BICOLOR VERT/ORANGE LED CMS BICOLOR VERT/ROUGE LED CMS BICOLOR VERT/ROUGE LED CMS VERT LED CMS VERT LED CMS VERT LED CMS VERT LED CMS ROUGE ANGLE DROIT LED CMS ROUGE LED CMS ROUGE LED CMS ROUGE LED CMS ORANGE ANGLE DROIT LED CMS ORANGE LED CMS VERT ANGLE DROIT LED CMS VERT LED CMS VERT LED CMS VERT LED CMS VERT LED CMS BLEU ANGLE DROIT LED CMS BLEU LED CMS BLEU LED CMS ROUGE HE LED CMS ROUGE HE LED CMS ROUGE HE LED CMS JAUNE LED CMS JAUNE LED CMS JAUNE LED CMS JAUNE FUNCTION GENERATOR,10MHZ FUNCTION GENERATOR,10MHZ PSU,BENCH,0-20V,10A PSU,BENCH,0-30V,4A PSU,BENCH,0-60V,3.3A STATION A AIR CHAUD WHA3000P 230V EURO HEATING PLATE,230V,600W,UK PLUG HEATING PLATE,230V,1200W,UK PLUG COMPOSITION DE DOUILLES 1/4 26 PIECES COMPOSITION DE DOUILLES 1/4 32 PIECES POTENTIOMETRE SIMPLE 0.5W 10K POTENTIOMETRE SIMPLE 0.5W 5K POTENTIOMETRE 1W DOUBLE 5K POTENTIOMETRE 1W SG/SWT 5K POTENTIOMETRE 1W SIMPLE 25K COUPLING,TRUNKING,40X40 POTENTIOMETRE 1W SIMPLE 250R POTENTIOMETRE 1W SIMPLE 2K5R COUPLING,TRUNKING,40X60 FICHE MALE QMA CI DROITE COUPLING,TRUNKING,80X40 FICHE MALE COUDEE MMBX RG178 CORDON N MALE - SMA MALE 910MM CORDON N MALE - SMA MALE 1220MM SEALED ETHERNET CONN,JACK,8WAY,CABLE BATTERIE 15V ADAPTOR,FLEXIBLE CONDUIT PG14 BATTERIE 12V 2.4AH LABEL,ESD,WARNING GERMAN LANGUAGE SIGN,ESD WARNING GERMAN LANGUAGE BINDER,COMP CARDS,A4 MIKROCONTR-APPLIK-KOCHBUCH COUPE CIRCUIT 30A COUPE CIRCUIT 35A COUPE CIRCUIT 40A COUPE CIRCUIT 50A RECEPTEUR AM CERAMIQUE TVS DIODE,5.6V,0805 CABLE TIES PORTE DOCUMENT A4 PAQUET DE 5 BOITIER TCP/IP RESEAU TELEPHONIQUE V34 ALIMENTATION AC/DC 30V ET GENERATEUR GENERATEUR FONCTION 5MHZ RS232 LABVIEW EXTRACTEUR DE FUMEE WFE-P 230V MACHOIRE SDE 0.6 - 2.5 MM (20-14) HEAT SHRINK TUBING,1.6MM ID,PO,BLK,100FT THERMOMETER,DUAL IP PROBE,SURFACE PROBE,AIR MANOMETER,INTR SAFE MANOMETER,INTR SAFE PINCE DE TEST POUR CMS SMC/EMBASE FEMELLE SMA/FICHE MALE COUDEE A SERTIR SMA/PRISE DROITE A SOUDER SMA/PRISE DROITE A SERTIR SMA/PRISE DROITE A SOUDER SMA/PRISE DROITE A SOUDER SMA/EMBASE FEMELLE A PLATINE CARREE SMA/EMBASE FEMELLE A PLATINE TRONQUEE BNC/PRISE DROITE A PRESSE-ETOUPE BNC/PRISE DROITE A SERTIR BNC/FICHE MALE DROITE A PRESSE-ETOUPE TNC/EMBASE FEMELLE COUDEE A PLATINE N/PRISE DROITE A PLATINE/PRESSE-ETOUPE N/BOUCHON MALE COURT-CIRCUIT+CHAINETTE N/FICHE MALE DROITE A PRESSE-ETOUPE MANCHON PROTECTEUR ROUGE CHARGE COAXIALE TNC MALE 1W 4GHZ NETTOYANT DE CONTACT THERMOCOUPLE A TUBE 22-30MM TYPE J THERMOCOUPLE Z2 PFA TYPE T SOCKET,MINI,SINGLE,SPRUNG,TYPE T SOCKET,MINI,SINGLE,SPRUNG,TYPE J SOCKET MINI SINGLE SPRUNG TYPE K CONNECTEUR MINI PAIR T/C TYPE T CONNECTEUR STNDRD PAIR T/C TYPE J CONNECTEUR STNDRD PAIR T/C TYPE K CABLE T/C EXT PVC 7/0.2 J 100M CABLE T/C EXT BLINDE 7/0.2 J 100M LIMIT SWITCH,CON,TOP PIN LIMIT SWITCH,CON,ROTARY PLUNGER LIMIT SWITCH,CON,X R PLUNGER LIMIT SWITCH,CON,S,ROTARY KIT MONTAGE PANNEAU HBE 6 VOIES KIT MONTAGE PANNEAU HBE 6 VOIES KIT MONTAGE PANNEAU HBE 10 VOIES KIT MONTAGE PANNEAU HBE 10 VOIES KIT MONTAGE PANNEAU HBE 16 VOIES KIT MONTAGE PANNEAU HBE 16 VOIES KIT ENTREE LATERALE HA 3 VOIES KIT MONTAGE PANNEAU HA 4 VOIES KIT CONDUCTEUR HA 3 VOIES KIT MONTAGE PANNEAU HA 3 VOIES KIT MONTAGE PANNEAU HA 4 VOIES KIT COUPLEUR HA3 KIT COUPLEUR HA4 KIT MONTAGE PANNEAU HA 3 VOIES KIT MONTAGE PANNEAU HA 4 VOIES KIT CONDUCTEUR HA 4 VOIES KIT MONTAGE PANNEAU HA 3 VOIES KIT COUPLEUR HA3 KIT COUPLEUR HA4 KIT CONNECTEUR ENTREE LAT. HBE6 6 VOIES KIT CONNECTEUR ENTREE LAT.HBE10 10 VOIES KIT CONNECTEUR ENTREE LATERALE HBE16 16 KIT MONTAGE CMS HBE 10 VOIES KIT CONNECTEUR ENTREE HAUTE HA3 4 VOIES KIT CONNECTEUR ENTREE LAT.HD40 40 VOIES KIT CONNECTEUR MONTAGE PAN.HD40 40 VOIES FICHE MALE LIBRE A VIS 5 VOIES +T FICHE MALE LIBRE A VIS 4+3 VOIES +T PINCE A SERTIR LOCATOR BOMBE REFRIGERANTE FREEZ-IT 400ML INDICATEUR DE PROCESS TEMPERATURE CABLE DE PROGRAMMATION CABLE EN NAPPE 30 VOIES 30.5M RIBBON CBL COLOUR CODED 64 WAY 30.5M RIBBON CABLE,10 WAY 30M CABLE EN NAPPE 16 VOIES 30.5M CABLE EN NAPPE 25 VOIES 30.5M CABLE EN NAPPE 50 VOIES 30.5M BATONNETS PRE-IMPREGNES AVEC 1PA PQ25 CABLE EN NAPPE 60 VOIES PAR M LABEL,PAT TEST,GRN,CARD OF 10 LABEL,PAT TEST,BLUE,CARD OF10 CABLE EN NAPPE 10 VOIES 30.5M CABLE EN NAPPE 26 VOIES 30.5M CABLE EN NAPPE 34 VOIES 30.5M POIGNEE ABS NOIRE 101.5MM POIGNEE ABS-GRIS 101.5MM POIGNEE ALUMINIUM 55MM POIGNEE PLIABLE 100MM POIGNEE RONDE CHROME 180MM HANGING HOOK PROBE,30A MICROCONTROLEUR 8 BITS FLASH 1.5K + CAN MICROCONTROLEUR 8 BITS FLASH 4K AVEC CAN MICROCONTROLEUR 8 BITS FLASH 4K AVEC CAN MICROCONTROLEUR 8 BITS FLASH 1.5K POIGNEE PLASTIQUE 112MM MICROCONTROLEUR 8 BITS CMS POIGNEE PLATEAU NOIR ABS POIGNEE PLIANTE ABS CABLE MARKER,HIGH VOLTAGE,PK10 CABLE MARKER,MAINS CABLE,PK10 POIGNEE ENCASTREE 160X108 CABLE FASTENER TOOLS TOOLS CARTOUCHE ENCRE COMP. CANON NOIRE CABLE EN NAPPE 17PR 30.5M AMPLIFICATEUR OP FET RAPIDE DOUBLE CMS AMPLIFICATEUR OP FET RAPIDE DOUBLE CMS TONER LASERJET 5SI MODULE,CAT5,LABELLED XLR MALE FEMELLE. 6M XLR P VERS JACK 3P P 3M XLR F VERS JACK 3P P 5M CARTOUCHE ENCRE HP CYAN CARTOUCHE ENCRE HP JAUNE MODULE INVERSEUR 110-240V CA/CC UNITE DE CONTROLE 1.25-5A 24VCC UNITE DE CONTROLE 4.5-18A 110-240V CONTACT AUXILIAIRE 1NO+1NC BORNIER DE CONTROLE CONNECTEUR PRE CABLE PILE LITHIUM CR2/3AA PILE LITHIUM CR2025H PILE LITHIUM CR2025V PILE NIMH 1/CP300H TAG PINCE PICOFLEX DRIVER DE MOSFET/IGBT CMS DEMI-PONT DRIVER DE MOSFET/IGBT CMS DEMI-PONT DRIVER DE MOSFET/IGBT CMS DEMI-PONT DRIVER DE MOSFET HI & LO DRIVER DE MOSFET/IGBT CMS DEMI-PONT PILE LITHIUM BOUTON DRIVER DE MOSFET CMS HI DRIVER DE MOSFET CMS 3PH DRIVER DE MOSFET CMS 3PH CIRCUIT DE CONTROL DE BALLAST DRIVER DE MOSFET/IGBT CMS DEMI-PONT DRIVER,MOSFET/IGBT,HALF BRIDGE,SMD DRIVER,MOSFET/IGBT,HALF BRIDGE,SMD DRIVER,MOSFET HIGH/LOW,SMD,2113 DRIVER,MOSFET/IGBT,HALF BRIDGE,SMD DRIVER,MOSFET/IGBT,HALF BRIDGE,SMD CONTACTEUR. 4KW. 9A CONTACTEUR. 5.5KW. 12A CONTACTEUR. 7.5KW. 17A CONTACTEUR 15KW 32A CONTACTEUR 37KW 75A CONTACTEUR. 55KW. 110A CONTACTEUR. 5.5KW. 12A CONTACTEUR. 7.5KW. 17A CONTACTEUR. 11KW. 26A CONTACTEUR. 15KW. 32A CONTACTEUR. 18.5KW. 37A CONTACTEUR 22KW 50A CONTACTEUR. 30KW. 65A CONTACTEUR 45KW 96A CONTACTEUR 55KW 110A CONTACTEUR. 22KW. 50A CONTACTEUR. 30KW. 65A CONTACTEUR. 37KW. 75A CONTACTEUR. 45KW. 96A CONTACTEUR. 55KW. 110A BLOC CONTACT MONTAGE AVANT. 1NO BLOC CONTACT LATERAL 1NO/1NC INTERLOCK. MECH/ELEC. A9-A40 RELAIS THERMIQUE A9-A30 0.16-0.25 RELAIS THERMIQUE A9-A30 0.4-0.63 RELAIS THERMIQUE A9-A30 0.63-1 RELAIS THERMIQUE A9-A30 3.5-5 RELAIS THERMIQUE A50-A75 18-25 BASE DE MONTAGE TA25DU <25 BOUTON POUSSOIR LED 24V CA/CC ROUGE BOUTON POUSSOIR LED 24V CA/CC JAUNE BOUTON POUSSOIR LED 24V CA/CC BLANC BOUTON POUSSOIR A LED 110-130VCA VERT BOUTON POUSSOIR LED 230V CA VERT BOITIER. IP44 80X80X40 LIMIT SWITCH,CAM PLUNGER LIMIT SWITCH,CAM PLUNGER LIMIT SWITCH,ROLLER PLUNGER TIMER MULTIFONCTION 7 FONCTIONS TIMER RETARDE ON 7 GAMMES TIMER RETARDE OFF 7 GAMMES ALIMENTATION DE LABO 0-35V 10A CABLE,FIRE,2C,RED,1.5MM,100M DIODE SCHOTTKY BOITIER SMB 15V 1A DIODE SCHOTTKY BOITIER SMB 40V 1A DIODE SCHOTTKY BOITIER SMB 60V 1A DIODE SCHOTTKY BOITIER SMB 100V 1A DIODE SCHOTTKY BOITIER SMA 40V 1.5A DIODE SCHOTTKY BOITIER TO-220 45V 12A DIODE SCHOTTKY BOITIER SMB 30V 2A DIODE SCHOTTKY BOITIER TO-220 45V 20A DIODE SCHOTTKY BOITIER TO-220AC 15V 20A DIODE SCHOTTKY BOITIER SMC 40V 3A DIODE SCHOTTKY BOITIER SMC 40V 3A DIODE SCHOTTKY BOITIER SMC 60V 3A DIODE DE REDRESSEMENT TO-220AC 1200V 8A TRANSISTOR MOSFET CANAL N TO-220 55V 72A TRANSISTOR MOSFET CANAL N D2PAK 100V 42A TRANSISTOR MOSFET CANAL N D2-PAK 75V 82A TRANSISTOR MOSFET CANAL N TO220 150V 21A TRANSISTOR MOSFET CANAL N D2PAK 150V 21A TRANSISTOR MOSFET CANAL N D2-PAK 30V 62A TRANSISTOR MOSFET CANAL N TO-220 30V 62A TRANSISTOR MOSFET CANAL N TO220 100V 57A TRANSISTOR MOSFET CANAL N D2PAK 100V 57A TRANSISTOR MOSFET CANAL N TO220 20V 110A TRANS. MOSFET CANAL N D2-PAK 100V 9.5A TRANSISTOR MOSFET CANAL N D2PAK 100V 33A TRANS. MOSFET CANAL N D2-PAK 200V 9.5A TRANSISTOR MOSFET CANAL N TO-220 400V 2A TRANS. MOSFET CANAL P TO-220 -100V -14A TRANSISTOR MOSFET CANAL N TO220 150V 23A TRANSISTOR MOSFET CANAL N TO220 100V 75A TRANS. MOSFET CANAL N TO-220 600V 9.2A TRANS. MOSFET CANAL N D2-PAK 900V 1.7A TRANS. MOSFET CANAL N TO-220FP 55V 56A TRANS. MOSFET CANAL N TO-220FP 100V 17A TRANS. MOSFET CANAL N TO-220FP 500V 3.1A TRANS. MOSFET CANAL P TO-220FP 100V 7.7A TRANS. MOSFET CANAL N TO-220FP 650V 5.1A TRANS. MOSFET CANAL N TO-220FP 600V 5.5A TRANS. MOSFET CANAL N SOT-223 250V 0.79A TRANS. MOSFET CANAL N TO-247AC 100V 39A TRANS. MOSFET CANAL N TO-247AC 200V 49A N CH MOSFET,75V,209A,TO-247AC TRANS. MOSFET CANAL N TO-247AC 400V 23A TRANS. MOSFET CANAL N TO-247AC 500V 14A TRANS. MOSFET CANAL N TO-247AC 500V 20A TRANS. MOSFET CANAL N TO-247AC 600V 6.8A TRANS. MOSFET CANAL N TO-247AC 600V 11A TRANS. MOSFET CANAL N SUPER 247 500V 43A TRANSISTOR MOSFET CANAL N D-PAK 60V 7.7A TRANSISTOR MOSFET CANAL N D-PAK 55V 37A TRANSISTOR MOSFET CANAL N DPAK 200V 4.8A TRANSISTOR MOSFET CANAL N D-PAK 55V 56A TRANSISTOR MOSFET CANAL N D-PAK 80V 38A TRANSISTOR MOSFET CANAL N DPAK 200V 9.4A TRANSISTOR MOSFET CANAL N IPAK 200V 4.8A TRANSISTOR MOSFET CANAL N IPAK 400V 1.7A TRANS. MOSFET CANAL P I-PAK -400V -1.8A TRANSISTOR MOSFET CANAL N TO-220 60V 50A TRANSISTOR MOSFET CANAL N TO-220 60V 55A TRANSISTOR MOSFET CANAL N D2-PAK 60V 72A TRANSISTOR IGBT BOITIER TO-220 600V 16A TRANSISTOR IGBT BOITIER TO-220 600V 31A TRANSISTOR IGBT BOITIER TO-220 600V 34A TRANSISTOR IGBT BOITIER TO-220 600V 23A TRANSISTOR IGBT BOITIER TO-220 600V 23A TRANSISTOR IGBT BOITIER TO-220 600V 42A TRANSISTOR IGBT BOITIER TO220FP 600V 17A TRANSISTOR IGBT BOITIER TO247AC 600V 60A TRANSISTOR IGBT BOITIER TO247AC 600V 40A TRANSISTOR IGBT BOITIER TO247AC 600V 52A TRANSISTOR IGBT BOITIER TO247AC 600V 55A TRANSISTOR IGBT BOITIER TO247AC 600V 55A TRANS. IGBT BOITIER TO-247AC 1200V 45A TRANSISTOR IGBT BOITIER TO274AA 600V 85A TRANSISTOR IGBT BOITIER TO274AA 600V 85A TRANS. IGBT BOITIER TO-274AA 1200V 78A TRANS. IGBT BOITIER TO-274AA 1200V 78A TRANSISTOR IGBT BOITIER TO-220 600V 13A TRANSISTOR IGBT BOITIER TO-220 600V 17A TRANSISTOR MOSFET CANAL N D2PAK 40V 110A TRANSISTOR MOSFET CANAL N D2PAK 40V 104A N CHANNEL MOSFET,30V,116A,D2-PAK TRANSISTOR MOSFET CANAL N TO-220 30V 56A TRANSISTOR MOSFET CANAL N D2-PAK 30V 64A TRANSISTOR MOSFET CANAL N D2-PAK 55V 89A TRANSISTOR MOSFET CANAL N D2PAK 30V 140A TRANSISTOR MOSFET CANAL N D2PAK 100V 17A TRANS. MOSFET CANAL N TO-220FP 100V 11A TRANSISTOR MOSFET CANAL N SOT-223 55V 2A TRANS. MOSFET CANAL N SOT-223 30V 5.5A TRANS. MOSFET CANAL N SOT-223 30V 4.6A TRANSISTOR MOSFET CANAL N D-PAK 30V 89A TRANSISTOR MOSFET CANAL N I-PAK 30V 46A TRANSISTOR MOSFET CANAL N TO-220 55V 41A DIODE SCHOTTKY BOITIER TO-220AC 45V 10A DIODE SCHOTTKY BOITIER TO-220 45V 15A DIODE SCHOTTKY BOITIER TO-220AC 45V 16A DIODE ULTRA RAPIDE TO-220 200V 20A SHELF,19´´ RACK MOUNT,1U EMBASE IEC FEMELLE QUAD EMBASE PICOFLEX 18V ADJUSTABLE TEMPERATURE SOLDERING STATION DIODE SCHOTTKY BOITIER SMA 100V 1.5A DIODE ULTRA RAPIDE TO-220AC 300V 15A DIODE ULTRA RAPIDE TO-220FP 600V 15A DIODE ULTRA RAPIDE TO-220FP 600V 15A DIODE ULTRA RAPIDE TO-220 300V 20A DIODE SCHOTTKY BOITIER TO-220 150V 20A DIODE ULTRA RAPIDE TO-220 200V 20A DIODE ULTRA RAPIDE TO-220AC 600V 30A DIODE SCHOTTKY BOITIER TO-220 150V 60A DIODE SCHOTTKY BOITIER TO-220 30V 60A DIODE ULTRA RAPIDE TO-220FP 600V 8A DIODE ULTRA RAPIDE TO-220FP 600V 8A DIODE DE REDRESSEMENT TO-220AC 600V 4A DIODE DE REDRESSEMENT TO-220AC 1200V 6A DIODE DE REDRESSEMENT TO-220AC 600V 25A TRANSISTOR MOSFET CANAL N D2-PAK 60V 83A TRANSISTOR MOSFET CANAL N D2-PAK 55V 94A N CH MOSFET,75V,142A,TO-220AB TRANSISTOR MOSFET CANAL N TO220 40V 210A TRANSISTOR MOSFET CANAL N D2PAK 40V 170A TRANSISTOR MOSFET CANAL N TO220 40V 280A TRANSISTOR MOSFET CANAL N TO220 55V 175A TRANSISTOR MOSFET CANAL N D2PAK 55V 135A TRANSISTOR MOSFET CANAL N TO-220 75V 89A TRANSISTOR MOSFET CANAL N TO220 75V 170A TRANSISTOR MOSFET CANAL N D2PAK 55V 110A TRANSISTOR MOSFET CANAL N TO220 30V 210A TRANSISTOR MOSFET CANAL N TO-220 30V 90A TRANSISTOR MOSFET CANAL N TO-220 20V 92A TRANSISTOR MOSFET CANAL N D2PAK 100V 36A TRANSISTOR MOSFET CANAL N D2-PAK 200V 9A TRANSISTOR MOSFET CANAL N TO220 200V 56A TRANSISTOR MOSFET CANAL N TO220 150V 33A TRANSISTOR MOSFET CANAL N TO220 200V 44A TRANS. MOSFET CANAL N TO-220 200V 42.6A TRANS. MOSFET CANAL N SUPER 220 200V 98A TRANS. MOSFET CANAL N D2-PAK 600V 2.2A TRANS. MOSFET CANAL N TO-220FP 450V 4.9A TRANS. MOSFET CANAL P TO-220FP 100V 13A TRANS. MOSFET CANAL N TO-220FP 800V 1.4A TRANS. MOSFET CANAL N SOT-223 55V 5.1A TRANS. MOSFET CANAL N TO-247AC 500V 23A TRANS. MOSFET CANAL N TO-247AC 150V 43A TRANS. MOSFET CANAL N TO-247AC 450V 9.5A N CHANNEL MOSFET,150V,14A,D-PAK TRANSISTOR MOSFET CANAL N D-PAK 55V 71A TRANSISTOR MOSFET CANAL N D-PAK 20V 75A TRANSISTOR MOSFET CANAL N D-PAK 500V 5A TRANS. MOSFET CANAL N D2-PAK 200V 44A TRANSISTOR MOSFET CANAL N I-PAK 200V 5A TRANSISTOR MOSFET CANAL N I-PAK 100V 31A TRANSISTOR MOSFET CANAL N I-PAK 100V 32A TRANSISTOR MOSFET CANAL N I-PAK 55V 71A TRANSISTOR MOSFET CANAL N I-PAK 30V 61A TRANSISTOR MOSFET CANAL N I-PAK 30V 61A TRANSISTOR MOSFET CANAL N I-PAK 55V 25A TRANSISTOR MOSFET CANAL N D2-PAK 55V 51A TRANS. IGBT BOITIER TO-220FP 600V 6.8A TRANS. IGBT BOITIER TO-220FP 600V 23.5A TRANSISTOR IGBT BOITIER TO-220 600V 22A TRANSISTOR IGBT BOITIER TO-220 600V 31A TRANSISTOR IGBT BOITIER TO-220 600V 78A TRANSISTOR IGBT BOITIER TO-220 600V 13A TRANSISTOR IGBT BOITIER TO220FP 600V 12A TRANSISTOR IGBT BOITIER TO247AC 600V 75A TRANS. IGBT BOITIER TO-274AA 1200V 80A TRANSISTOR MOSFET CANAL N D2PAK 40V 160A TRANSISTOR MOSFET CANAL N D2-PAK 55V 86A TRANSISTOR MOSFET CANAL N D2PAK 30V 200A TRANSISTOR MOSFET CANAL N TO220 30V 105A TRANS. MOSFET CANAL N TO-220FP 200V 5.9A TRANS. MOSFET CANAL P MICRO-3 30V 0.61A TRANS. MOSFET CANAL P MICRO 3 -12V -4.3A TRANS. MOSFET CANAL P MICRO 3 -12V -4.3A TRANSISTOR MOSFET CANAL N DPAK 100V 4.3A TRANSISTOR MOSFET CANAL N D-PAK 30V 22A TRANSISTOR MOSFET CANAL N D-PAK 55V 61A TRANSISTOR MOSFET CANAL N I-PAK 30V 22A TRANSISTOR MOSFET CANAL N I-PAK 55V 25A TRANSISTOR MOSFET CANAL N I-PAK 100V 15A TRANSISTOR MOSFET CANAL N I-PAK 30V 110A DIODE SCHOTTKY BOITIER SMA 20V 1A DIODE SCHOTTKY BOITIER SMA 40V 1A DIODE SCHOTTKY BOITIER SMA 40V 1A DIODE SCHOTTKY BOITIER SMB 100V 1A PLUG & SOCKET HOUSING,PLUG,POLYESTER CONTACT,PIN,16-14AWG,CRIMP POWER OUTLET STRIP MICROPHONE,HEADWORN PLUGTOP,13A,RED AXIAL FAN,119MM,24VDC SWITCH,AV,AUTOMATIC SOFTWARE +USB INTERFACE CONDUIT,BLACK,10M,25MM CONTRACTOR PACK,GREY,25MM MICROCONTROLEUR 16 BITS FLASH AVEC CAN MICROCONTROLEUR 16 BITS FLASH AVEC CAN MICROCONTROLEUR 16 BITS FLASH AVEC CAN MICROCONTROLEUR 16 BITS FLASH AVEC CAN MICROCONTROLEUR CMS 16 BITS FLASH 128K MICROCONTROLEUR CMS 16 BITS FLASH 128K MICROCONTROLEUR CMS 16 BITS FLASH 128K MICROCONTROLEUR CMS 16 BITS FLASH 64K SENSOR,LEVEL,LIQUID,REAR FIXING CONVERTISSEUR DC/DC 1W 12V ISO SUPERVISEUR CMS RESET A ETAT BAS 4.63V SUPERVISEUR CMS RESET A ETAT BAS 4.38V SUPERVISEUR CMS RESET A ETAT BAS 2.63V SUPERVISEUR CMS RESET A ETAT BAS 3.08V SUPERVISEUR CMS RESET A ETAT HAUT 4.63V SUPERVISEUR CMS RESET A ETAT HAUT 4.63V SUPERVISEUR CMS RESET A ETAT HAUT 2.93V SUPERVISEUR CMS RESET A ETAT HAUT 2.93V SUPERVISEUR CMS RESET A ETAT HAUT 3.08V SUPERVISEUR CMS RESET A ETAT BAS 4.38V SUPERVISEUR CMS RESET A ETAT BAS 2.93V SUPERVISEUR CMS RESET A ETAT BAS 3.08V SUPERVISEUR CMS RESET A ETAT BAS 3.08V SUPERVISEUR CMS RESET A ETAT HAUT 4.63V SUPERVISEUR CMS RESET A ETAT HAUT 4.63V SUPERVISEUR CMS RESET A ETAT HAUT 2.93V DMX RELAY BOARD CORDON DE TEST AVEC FICHE EMPILABLE CORDON DE TEST AVEC FICHE EMPILABLE CORDON DE TEST AVEC FICHE EMPILABLE CARTOUCHE PHOTO C1816A CARTOUCHE NOIR BCI-3EBK CARTOUCHE CYAN T0482 CARTOUCHE ENCRE CYAN T0542 ORIGINE CARTOUCHE JAUNE T0544 CARTOUCHE BLEU T0549 MODULE,CONNECTOR,MOD-SNAPIII PROTECT. SECTEUR CONTRE SURTENSION MONO CARTOUCHE D´ENCRE T0540 PANEL,VENTED,19´´ PANEL,VENTED,19´´ CABLE IDE ATA133 - 90CM FUSE,HRC,HIGH SPEED,20A FUSIBLE HRC ACTION RAPIDE 35A KEYBOARD,VIK,109,KEY,USB CABLE D´EXTENSION KVM 2M CABLE D´EXTENSION KVM 3M KEYBOARD,COMPACT CHERRY,PS2/USB QWERTY MICROSOFT AUTOROUTE 2005 FUSE,HRC,HIGH SPEED,150A CABLE USB 2.0 A-B 2M CLAIR CABLE USB 2.0 A-B 2M NOIR FUSE,HRC,HIGH SPEED,350A SWITCH,6GANG,2WAY SWITCH,45A,2 POLE CONNECTION UNIT,FUSED,NEON SPRING CONTACT PROBE,PCB TOOLS,MAGNETIZER BOOK,FAST ETHERNET FICHE FEMEL.LIBRE AUTODENUDANTE 20 VOIES MULTIMETRE ROUGE 3 1/2 DIGITS UDM35 MULTIMETRE MULTICOLEUR 4 DIGITS UDM40 MODULE HOLDER USC ALIMENTATION 90-260V CA/CC MODULE D´ENTREE SIGNAL A L´ETAT BAS LAMPE BA15D 7W 12V PAQUET DE 10 LAMPE BA15D 7W 24V PAQUET DE 10 LAMPE BA15D 7W 120V PAQUET DE 10 NOZZLE,DESOLDERING GUN CABLE PROTECTOR,TYPE B,BLACK,9M CABLE PROTECTOR,TYPE E,BLACK,3M CABLE PROTECTOR,BNC2,BLACK,3M ZELIO 2. 12VDC 12E/S(R) ZELIO 2. 24VDC 12E/S(T) ZELIO 2. 24VDC 10E/S(R) ZELIO 2. 24VAC 12E/S(R) ZELIO 2. 24VDC 20E/S(R) TRESSE DE MISE A LA TERRE TRESSE DE MISE A LA TERRE BENCH MAT 1.1X3.3M NO STUDS SACHET ANTISTATIQUE (PQ100) SONDE ANTISTATIQUE NOIRE 63MM SOCKET,UNIVERSAL,3/8´´ FOOTSWITCH,BLUE,1NO/1NC FOOTSWITCH,BLUE,2NO/2NC FOOTSWITCH,BLUE,2NO/2NC,2STEP FOOTSWITCH,COVER,1NO/1NC FOOTSWITCH,COVER,2NO/2NC FOOTSWITCH,COVER,2NO/2NC,2STEP PINCE COUPANTE DIAGONALE 120MM PINCE A BECS DEMI ROND INTERRUPTUR DE SECURITE 24VCC TOUCHE POUR D4 RELAIS DE SECURITE RELAIS DE SECURITE UNITE D´EXTENSION PINCE COUPANTE DIAGONALE 125MM CABLE MARKER,BLACK/YELLOW,4-6MM PINCE COUPANTE COTE FULL FLUSH SUPER BEAM PINCE COUPANTE OBLIQUE 135MM PINCE COUPANTE DIAGONALE 120MM CABLE PROTECTOR,FF,4.5M CABLE PROTECTOR,F,4.5M CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W +/-9V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W +/-15V CONVERTISSEUR DC/DC 1W +/-15V CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W +/-9V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W +/-15V CONVERTISSEUR DC/DC 1W +/-15V CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W +/-15V CONVERTISSEUR DC/DC 1W +/-15V CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W 5V CONVERTISSEUR DC/DC 1W 5V-5V CONVERTISSEUR DC/DC 1W 12V CONVERTISSEUR DC/DC 1W 5V-12V CONVERTISSEUR DC/DC 1W 5V-15V CONVERTISSEUR DC/DC 1W 5V CONVERTISSEUR DC/DC 1W 12V CONVERTISSEUR DC/DC 1W 12V-12V CONVERTISSEUR DC/DC 12V-15V CONVERTISSEUR DC/DC 1W 15V CONVERTISSEUR DC/DC 1W 24V-5V CONVERTISSEUR DC/DC 1W 12V CONVERTISSEUR DC/DC 1W 24V-12V CONVERTISSEUR DC/DC 2W +/-5V CONVERTISSEUR DC/DC 2W +/-5V CONVERTISSEUR DC/DC 2W +/-9V CONVERTISSEUR DC/DC 2W +/-12V CONVERTISSEUR DC/DC 2W +/-12V CONVERTISSEUR DC/DC 2W +/-15V CONVERTISSEUR DC/DC 2W +/-15V CONVERTISSEUR DC/DC 2W +/-5V CONVERTISSEUR DC/DC 2W +/-9V CONVERTISSEUR DC/DC 2W +/-12V CONVERTISSEUR DC/DC 2W +/-12V CONVERTISSEUR DC/DC 2W +/-15V CONVERTISSEUR DC/DC 2W +/-15V CONVERTISSEUR DC/DC 2W +/-5V CONVERTISSEUR DC/DC 2W +/-5V CONVERTISSEUR DC/DC 2W +/-9V CONVERTISSEUR DC/DC 2W +/-9V CONVERTISSEUR DC/DC 2W +/-12V CONVERTISSEUR DC/DC 2W +/-12V CONVERTISSEUR DC/DC 2W +/-15V CONVERTISSEUR DC/DC 2W +/-15V CONVERTISSEUR DC/DC 2W 5V-5V CONVERTISSEUR DC/DC 2W 5V-9V CONVERTISSEUR DC/DC 2W 5V-12V CONVERTISSEUR DC/DC 2W 5V-15V CONVERTISSEUR DC/DC 2W 12V-5V CONVERTISSEUR DC/DC 2W 12V-9V CONVERTISSEUR DC/DC 2W 12V-12V CONVERTISSEUR DC/DC 2W 12V-15V CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W 3KV 5V-5V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W 3KV 5V-5V CONVERTISSEUR DC/DC 1W +/-15V CONVERTISSEUR DC/DC 1W 3KV 5V-15V CONVERTISSEUR DC/DC 1W +/-5V CONVERTISSEUR DC/DC 1W 3KV 12V-5V CONVERTISSEUR DC/DC 1W +/-12V CONVERTISSEUR DC/DC 1W 3KV 12V-12V CONVERTISSEUR DC/DC 1W +/-15V CORDON FEMELLE/EXTREMITE NUE 28AWG 0.15M CORDON FEMELLE/EXTREMITE NUE 28AWG 0.3M CORDON FEMELLE / FEMELLE 32AWG 0.15M CORDON FEMELLE / FEMELLE 28AWG 0.3M CORDON FEMELLE / FEMELLE 32AWG 0.3M CORDON FEMELLE/EXTREMITE NUE 24AWG 0.15M CORDON FEMELLE/EXTREMITE NUE 26AWG 0.15M CORDON FEMELLE/EXTREMITE NUE 24AWG 0.3M CORDON FEMELLE/EXTREMITE NUE 26AWG 0.3M CORDON FEMELLE/FEMELLE 24AWG 0.3M TOOLS,SETS HEX BITS LIMIT SWITCH LIMIT SWITCH LIMIT SWITCH LIMIT SWITCH LIMIT SWITCH SWITCH HEAD,LIMIT SWITCH HEAD,LIMIT SWITCH HEAD,LIMIT SWITCH HEAD,LIMIT SWITCH HEAD,LIMIT SWITCH HEAD,LIMIT OPERATING LEVER OPERATING LEVER OPERATING LEVER OPERATING LEVER OPERATING LEVER OPERATING LEVER OPERATING LEVER SWITCH HEAD,LIMIT LIMIT SWITCH BODY LIMIT SWITCH BODY LIMIT SWITCH BODY CONTACT BLOCK CONTACT BLOCK CONTACT BLOCK CONTACT BLOCK PULL WIRE/SHIM BALDE,FOR ST800,SET2 LEAD,SWISS TO FREE END BLACK,3M DISTRIBUTION BOARD,T13,8WAY DISTRIBUTION BOARD,T13,6WAY DECODEUR RF SMT DECODEUR RF SMT DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-416 DIODE SCHOTTKY BOITIER SOT-416 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE DE COMMUTATION BOITIER SOD323 DIODE DE COMMUTATION BOITIER SOD323 DIODE DE COMMUTATION BOITIER SOD323 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-143 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-323 DIODE DE COMMUTATION BOITIER SOD323 DIODE DE COMMUTATION BOITIER SOD323 DIODE DE COMMUTATION BOITIER SOD523 DIODE DE COMMUTATION BOITIER SOD523 DIODE DE COMMUTATION BOITIER SOD523 DIODE DE COMMUTATION BOITIER SOD523 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-323 DIODE SCHOTTKY BOITIER SOT-143 DIODE SCHOTTKY BOITIER SOT-143 DIODE SCHOTTKY BOITIER SOT-363 DIODE SCHOTTKY BOITIER SOT-323 DIODE DE COMMUTATION BOITIER SOD523 DIODE DE COMMUTATION BOITIER SOD523 DIODE SCHOTTKY BOITIER SOD-80 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-363 DIODE SCHOTTKY BOITIER SOT-363 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-666 TRANSISTOR NPN SOT-23 TRANSISTOR NPN BOITIER SOT666 TRANSISTOR NPN BOITIER SOT666 TRANSISTOR NPN/PNP BOITIER SOT-666 TRANSISTOR NPN/PNP BOITIER SOT-666 TRANSISTOR PNP BOITIER SOT666 TRANSISTOR PNP BOITIER SOT666 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR DOUBLE NPN BOITIER SOT143 TRANSISTOR DOUBLE PNP BOITIER SOT143 TRANSISTOR PNP BOITIER SOT89 TRANSISTOR PNP BOITIER SOT89 TRANSISTOR NPN BOITIER SOT89 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR DARLINGTON BOITIER SOT89 DIODE ZENER BOITIER SOT-163 DIODE ZENER QUAD. BOITIER SOT-457 DIODE ZENER QUAD. BOITIER SOT-457 DIODE ZENER QUAD. BOITIER SOT-457 DIODE ZENER QUAD. BOITIER SOT-457 DIODE ZENER QUAD. BOITIER SOT-457 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-353 DIODE ZENER QUAD. BOITIER SOT-665 DIODE ZENER QUAD. BOITIER SOT-665 DIODE ZENER QUAD. BOITIER SOT-665 DIODE ZENER QUAD. BOITIER SOT-665 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER 5% BOITIER SOT-663 DIODE ZENER BOITIER SOD80 DIODE ZENER BOITIER SOD80 DIODE ZENER 5% BOITIER SOD80 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOD-323 DIODE ZENER 5% BOITIER SOT23 DIODE ZENER 5% BOITIER SOT23 DIODE ZENER 5% BOITIER SOT23 DIODE ZENER 5% BOITIER SOT23 DIODE ZENER 5% BOITIER SOT23 TRANSISTOR DE COMMUTATION BOITIER SOT363 TRANSISTOR DE COMMUTATION BOITIER SOT363 TRANSISTOR DE COMMUTATION BOITIER SOT363 TRANSISTOR DE COMMUTATION BOITIER SOT363 TRANSISTOR BOITIER SOT666 TRANSISTOR NPN BOITIER SOT666 TRANSISTOR NPN BOITIER SOT666 TRANSISTOR BOITIER SOT363 TRANSISTOR BOITIER SOT363 TRANSISTOR PNP BOITIER SOT666 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT323 TRANSISTOR NPN BOITIER SOT666 TRANSISTOR NPN BOITIER SOT666 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR BOITIER SOT457 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT457 TRANSISTOR NPN BOITIER SOT457 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT323 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT457 TRANSISTOR PNP BOITIER SOT457 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT-89 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT363 TRANSISTOR NPN BOITIER SOT363 TRANSISTOR NPN BOITIER SOT223 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 BUSE NR05 TRANSISTOR NUMERIQUE BOITIER SOT-23 BUSE NR10 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 BUSE TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 BUSE TRANSISTOR NUMERIQUE BOITIER SOT-23 BUSE TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-23 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 TRANSISTOR NUMERIQUE BOITIER SOT-323 BUSE ND20 TRANSISTOR PNP BOITIER SOT666 TRANSISTOR NPN BOITIER SOT666 TRANSISTOR NPN/PNP BOITIER SOT-666 TRANSISTOR NPN/PNP BOITIER SOT-666 DIODE DE SUPPRESSION BOITIER SOD-323 DIODE DE SUPPRESSION BOITIER SOD-523 DIODE DE SUPPRESSION DOUBLE SOT-663 DIODE DE SUPPRESSION DOUBLE SOT-663 DIODE DE SUPPRESSION BOITIER SOD-323 DIODE DE SUPPRESSION BOITIER SOD-523 BUSE DIODE DE SUPPRESSION BOITIER SOD-323 DIODE DE SUPPRESSION BOITIER SOD-523 DIODE DE SUPPRESSION DOUBLE SOT-663 DIODE DE SUPPRESSION BOITIER SOD-323 DIODE DE SUPPRESSION BOITIER SOT-665 DIODE DE SUPPRESSION BOITIER SOT-665 DIODE DE SUPPRESSION BOITIER SOT-666 BUSE NQ10 DIODE DE SUPPRESSION BOITIER SOD-523 DIODE DE SUPPRESSION DOUBLE SOT-663 DIODE DE SUPPRESSION BOITIER SOD-323 DIODE DE SUPPRESSION BOITIER SOT-665 DIODE DE SUPPRESSION BOITIER SOT-665 DIODE DE SUPPRESSION BOITIER SOT-666 DIODE DE SUPPRESSION BOITIER SOT-96 DIODE DE SUPPRESSION BOITIER SOT-505 DIODE DE SUPPRESSION BOITIER SOT-505 DIODE DE SUPPRESSION BOITIER SOT-96 DIODE DE SUPPRESSION BOITIER SOT-96 DIODE DE SUPPRESSION BOITIER SOD-323 DIODE DE SUPPRESSION BOITIER SOD-523 DIODE DE SUPPRESSION BOITIER SOD-523 DIODE DE SUPPRESSION DOUBLE SOT-663 DIODE DE SUPPRESSION DOUBLE SOT-663 TRANSISTOR PNP BOITIER SOT457 DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-23 BUSE BUSE NQ25 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 BUSE DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-523 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOD-323 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-666 DIODE SCHOTTKY BOITIER SOT-457 BUSE BUSE TRANSISTOR NPN BOITIER SOT23 TRANSISTOR NPN BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR PNP BOITIER SOT23 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 BUSE TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 OUTIL POUR BUSE WHA TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NUMERIQUE DOUBLE SOT363 TRANSISTOR NPN BOITIER SOT363 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR PNP BOITIER SOT223 TRANSISTOR PNP BOITIER SOT223 LED BLEU 115 DEGRES SQR LED ROUGE/VERT ACTIVATEUR DE PANNE LED ROUGE BOOK,WIND 2000 PROF FOR DUMMIES TRANSISTOR BOITIER SOT457 ETUI. SERIE T TWEEZER,180MM PANNE LAME FINE Tools,Sets Hex bits PANNE POUR SOIC8 PANNE POUR MELF PANNE POUR MICROMELF KIT DE PANNE CMS Tools TIP REMOVAL TOOL,SERIES 422 FLUX NO-CLEAN PANNE 80W DROITE 4.8MM PANNE 150W COURBEE 5.3MM PANNE 15W 1.1MM PANNE COURBEE 45DEG 3.6MM SWITCH,INDUSTRIAL PUSHBUTTON,22MM STATION DE SOUDAGE ANALOG60 STATION DE SOUDAGE ANALOG60A ELEMENT CHAUFFANT STATION ERSA 60A CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS CIRCUIT SUPERVISEUR CMS REGULATEUR A DECOUPAGE BUCK AJUSTABLE REGULATEUR LDO 150MA CMS REGULATEUR LDO 150MA CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS HEAT SHRINK TUBING,3.175MM ID,FEP,TRANS,12.5FT,PK25 SCREWDRIVER,PHILLIPS HEAD,155MM SCREWDRIVER,PHILLIPS HEAD,190MM PINCE POUR L ELECTRO. ANTISTAT. 115MM PINCE ELECTRONIQUE 130MM PINCE ELECTRONIQUE 125MM PINCE RADIO 125MM PINCE RADIO 140MM PINCE RADIO 160MM PINCE A BECS DE CIGOGNE 200MM PINCE A BECS DE CIGOGNE 200MM PINCE UNIVERSELLE 180MM PINCE UNIVERSELLE 200MM PINCE UNIVERSELLE 160MM PINCE UNIVERSELLE 180MM DESK LIGHT,WHITE,UK PLUG DESK LIGHT,BLACK,UK PLUG PINCE COUPANTE DE COTE 160MM PINCE COUPANTE DEVANT 115MM PINCE COUPANTE OBLIQUE 115MM MALLET ELECTRICIEN 24 OUTILS PINCE COUPANTE DE COTE ANTISTA. PINCE COUPANTE DE COTE ANTISTA. SWITCH ACTUATOR PINCE COUPANTE DE COTE ANTISTA. PINCE COUPANTE DE COTE ANTISTA. PINCE COUPANTE DE COTE 125MM MARKER,PERM.,FINE TIP,BLK MARKER,PAINT,ORNG MARKER,PAINT,VIOLET MARKER,PAINT,BLK MARKER,PAINT,BLUE MARKER,PAINT,ORNG MARKER,PASTE,BLK MARKER,PASTE,RED MARKER,PASTE,BLUE MARKER,PASTE,YEL MARKER,PERM.,BLK MARKER,AEROSPACE,BLK MARKER,CHISEL TIP,WALLET OF 4 MARKER,PERM.,CHISEL TIP,RED MARKER,PERM.,CHISEL TIP,GRN COUTEAUX DE RECHANGE CABLE SIL 6 VOIES PINCE A SERTIR POUR CONNECTEUR ANALYSEUR DE PUISSANCE 230VCA SUPP ANALYSEUR DE PUISSANCE 230VCA SUPP RS485 ANALYSEUR DE PUISSANCE 230VCA SUPP RS485 BOITE A DECADE CONDENSATEUR BOITE A DECADE INDUCTANCE DECADE BOX,RESISTOR,1W CONDENSATEUR 100UF 16V CONDENSATEUR 100UF 35V CONDENSATEUR 33UF 50V CONDENSATEUR 10UF 63V CONDENSATEUR 47UF 63V CONDENSATEUR 100UF 63V NOZZLE,1.5MM DESOLDERING BRAID,2.5MM ETIQUETEUSE IDXPERT QWERTY LABEL,SELF LAM,19.05X38.1MM,PK250 LABEL,SELF LAM,25.4X25.4MM,PK250 LABEL,SELF LAM,25.4X19.05MM,PK250 LABEL,SELF LAM,12.7X19.05MM,PK500 LABEL,100 SLEEVE,25.78X8.5MM MANCHON THERMO JAUNE 3.65MX11.15MM LABEL,100 SLEEVE,25.78X16.38MM TAPE,BLACK ON WHITE,9.14MX12.7MM TAPE,BLACK ON YELLOW,9.14MX12.7MM TAPE,BLACK ON WHITE,9.14MX25.4MM TAPE,BLACK ON YELLOW,9.14MX38.1MM TAPE,WHITE ON BLUE,9.14MX38.1MM CAPACITOR CERAMIC 0.01UF,16V,X7R,5%,0402 CAPACITOR CERAMIC,1UF,16V,X7R,20%,0805 CAPACITOR CERAMIC 1000PF,50V,X7R,5%,0603 CAPACITOR CERAMIC 6800PF 50V,C0G,1%,1 TEMPERATURE,THERMISTOR,GEN PURPOSE CAPACITOR CERAMIC 2PF 50V,C0G/NP0,0.25pF,0402 CAPACITOR CERAMIC,220PF,50V,X7R,10%,0402 CAPACITOR CERAMIC 2.7PF 50V,C0G,0.25pF,0402 CAPACITOR CERAMIC 4.7PF 50V,C0G,0.5pF,0805 COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP COMMUTATEUR DIP ROUE CODEUSE DIP MICROSWITCH SCELLE MICROSWITCH SCELLE MICROSWITCH SCELLE MICROSWITCH 16A MINIATURE MICROSWITCH 16A MINIATURE OUTIL D´INSERTION OUTIL D´INSERTION OUTIL D´INSERTION EXTRACTEUR CORDONS 1.8M LABEL PRINTER,PT-2460 LABEL,LARGE ADDRESS POWER OUTLET,8WAY,48IN EMBASE RJ45 PANNEAU GAP PAD VOUS .2 100X100MM,GAP PAD VO DISSIP. THERMIQUE PAD TO-220 (PQT10) MICROSWITCH ‚ GALET POTENTIOMETRE LINEAIRE 1K POTENTIOMETRE LOGARITH. 1K POTENTIOMETRE LOGARITH. 50K POTENTIOMETRE LINEAIRE DOUBLE 1K TRIMMER CMS 13 TOURS 100R TRIMMER CMS 13 TOURS 200R TRIMMER CMS 13 TOURS 5K TRIMMER CMS 13 TOURS 10K TRIMMER CMS 13 TOURS 20K TRIMMER CMS 13 TOURS 50K TRIMMER CMS 13 TOURS 100K TRIMMER CMS 13 TOURS 200K TRIMMER CMS 13 TOURS 200K TRIMMER CMS 13 TOURS 500K TRIMMER CMS 13 TOURS 500R TRIMMER CMS 13 TOURS 10K TRIMMER CMS 13 TOURS 500K TRIMMER CMS 13 TOURS 500K POTENTIOMETRE 5K POTENTIOMETRE 50K POTENTIOMETRE A GLISSIERE 10K PANNE DROITE 2.0MM (PQ=3) PANNE DROITE 0.8MM (PQ=3) PANNE DROITE 4.0MM (PQ=3) PANNE DROITE 4.8MM BLADE/CHUCK,HOT KNIFE PANNE DROITE 6.3MM (PQ=3) PANNE 6.3MM (PQ=3) PANNE DROITE 5.0MM PANNE 5.0MM PANNE 9.5MM (PQ=3) REGULATEUR LDO CMS 1.8V. 250MA REGULATEUR LDO CMS 3V. 250MA REGULATEUR LDO CMS 5V. 250MA REGULATEUR LDO CMS 5V. 250MA REGULATEUR LDO CMS 3V.FAIBLE BRUIT REGULATEUR LDO CMS 5V.FAIBLE BRUIT LENTILLE LENTILLE SWITCH,EMERGENCY STOP,2NC,600VAC PEN,GEL,METALLIC,BLUE MEMOIRE EEPROM 128K SERIE CMS LIN TRANSCEIVER CMS 1020 SOIC8 TEMPERATURE CONTROLLER ((NW)) BATTERY,LI-ION,3.75V,2.6AH BATTERY,LI-ION,3.75V,5.3AH CHARGER,LI-ION,14.4V BATTERY,LI-ION,15V,6.8AH TOOLS,SETS HEX BITS PANNE EN FORME D´AIGUILLE PANNE TOURNEVIS 1.5X0.4MM PANNE TOURNEVIS COUDEE 30‹ 0.8X0.4 PANNE FORME BISEAUTE 1.2X45‹ PANNE EN FORME DE COUTEAU 2.2X45‹ SIRENE MASTER BLASTER SIRENE MONO 72 110VCA SOUNDER,RED,SHALLOW,8-35VDC SOUNDER,DEEP,WHITE,IP65,8-35VDC SIRENE MONO P 24VCC MODULE DE SORTIE. RELAIS CONDENSATEUR 1000UF 16V CONDENSATEUR 3300UF 25V CONDENSATEUR 10UF 50V CONDENSATEUR 120UF 63V CONDENSATEUR 22UF 100V CONDENSATEUR 47UF 100V CONDENSATEUR 220UF 100V CONDENSATEUR 4.7UF 400V CONDENSATEUR 100UF 10V CONDENSATEUR 1000UF 10V CONDENSATEUR 470UF 16V CONDENSATEUR 2200UF 16V CONDENSATEUR 1000UF 35V CONDENSATEUR 2200UF 35V CONDENSATEUR 47UF 50V CONDENSATEUR 4.7UF 160V CONDENSATEUR 47UF 160V CONDENSATEUR 1UF 450V CONDENSATEUR 15000UF 25V CONDENSATEUR 680UF 400V CONDENSATEUR 220UF 450V CONDENSATEUR 470UF 200V VOYANT A FILAMENT VOYANT A FILAMENT VOYANT A FILAMENT VOYANT NEON VERT VOYANT NEON AMBRE LED CMS JAUNE LCD DEST STAND CONDENSATEUR 25V 33000UF CONDENSATEUR 25V 68000UF CONDENSATEUR 40V 15000UF CONDENSATEUR 40V 22000UF CONDENSATEUR 40V 33000UF CONDENSATEUR 40V 220000UF CONDENSATEUR 63V 33000UF CONDENSATEUR 63V 68000UF CONDENSATEUR 63V 100000UF CONDENSATEUR 100V 4700UF CONDENSATEUR 200V 1500UF CONDENSATEUR 200V 4700UF VOYANT A LED CONDENSATEUR 200V 10000UF CONDENSATEUR 100V 4700UF CONDENSATEUR 100V 10000UF CONDENSATEUR 2200UF 6.3V CONDENSATEUR 4700UF 6.3V CONDENSATEUR 1000UF 10V CONDENSATEUR 470UF 16V CONDENSATEUR 100UF 25V CONDENSATEUR 470UF 25V CONDENSATEUR 220UF 35V CONDENSATEUR 100UF 50V CONDENSATEUR 470UF 50V CONDENSATEUR 100UF 10V CONDENSATEUR 100UF 16V CONDENSATEUR 2200UF 16V CONDENSATEUR 47UF 25V CONDENSATEUR 1000UF 25V CONDENSATEUR 220UF 35V CONDENSATEUR 4700UF 35V CONDENSATEUR 4.7UF 63V CONDENSATEUR 470UF 63V CONDENSATEUR 2200UF 63V CONDENSATEUR 33UF 350V CONDENSATEUR 47UF 450V ARMOIRE A CLES 64 CLES FIXE ETIQUETTES LONGUES PAQUET DE 100 ETIQUETTES COURTES PAQUET DE 100 PORTE CLE PAQUET DE 10 MICROCONTROLEUR 16 BITS FLASH 32K CMS TRIMMER CMS 3204 100R TRIMMER CMS 3204 10K TRIMMER CMS 3204 10K TRIMMER CMS 3204 100K TRIMMER CMS 3204 100K TRIMMER CMS 3204 200R TRIMMER CMS 3204 2K TRIMMER CMS 3204 500R TRIMMER CMS 3204 50K VARISTANCE 0603 9VCC VARISTANCE 0603 18VCC VARISTANCE 0603 22VCC VARISTANCE 0603 22VCC VARISTANCE 0603 26VCC VARISTANCE 0603 26VCC VARISTANCE 0603 31VCC VARISTANCE 0603 31VCC VARISTANCE 0805 5.5VCC VARISTANCE 0805 5.5VCC VARISTANCE 0805 8VCC VARISTANCE 0805 8VCC VARISTANCE 0805 11VCC VARISTANCE 0805 11VCC VARISTANCE 0805 14VCC VARISTANCE 0805 18VCC VARISTANCE 0805 22VCC VARISTANCE 0805 26VCC VARISTANCE 0805 31VCC VARISTANCE 0805 38VCC VARISTANCE 0805 38VCC VARISTANCE 1206 11VCC VARISTANCE 1206 11VCC VARISTANCE 1206 18VCC VARISTANCE 1206 18VCC VARISTANCE 1206 22VCC VARISTANCE 1206 22VCC VARISTANCE 1206 26VCC VARISTANCE 1206 31VCC VARISTANCE 1206 38VCC VARISTANCE 1206 38VCC VARISTANCE 1206 45VCC VARISTANCE 1206 56VCC VARISTANCE 1206 65VCC VARISTANCE 1206 65VCC VARISTANCE 1210 5.5VCC VARISTANCE 1210 8VCC BOOK,CONCISE INTRO TO UNIX VARISTANCE 1210 14VCC VARISTANCE 1210 14VCC VARISTANCE 1210 26VCC VARISTANCE 1210 26VCC VARISTANCE 1210 31VCC VARISTANCE 1210 38VCC VARISTANCE 1210 85VCC VARISTANCE 1210 85VCC JOINT DE BLINDAGE 1METRE BOOK,INTRO NETWORKS PC & MAC INDICATEUR POUR LED LOOP POWERED BOOK,INTRO SATELLITE COMMS BOOK,BEGINNERS TTL DIGITAL IC BOOK,IC TERM BLOCK PROJ TRIMMER 416P 100K TRIMMER 416P 100R TRIMMER 416P 20K TRIMMER 416P 2K TRIMMER 416P 500K TRIMMER 416P 5K TRIMMER 416M 1K TRIMMER 416M 2K TRIMMER 416M 10K TRIMMER 416M 50K TRIMMER 416M 100K TRIMMER 416M 500K RUBAN DE CUIVRE ETAME 25.4MM CORDON GUITARE 6M NEON VERT CORDON JACK 6.35 6M NOIR FICHE XLR 3P COUDEE FEMELLE Optocoupler WIRE SNIPPING TOOL PINCE A SERTIR WASHER,200/210/270 SERIES RESISTOR Overload Relay Terminal Block CAPACITOR CERAMIC 220PF 50V,C0G,5%,06 CONNECTEUR 1.25MM 2P RESISTOR,CURRENT SENSE,5 OHM,20W,1% UNSEALED OI-PB SWITCH LIMIT SWITCH,PLUNGER,SPDT-1NO/1NC CAT6 RJ45 MODULAR JACK,8POS,1 PORT MODULAR JACK,CAT6,UTP,8POS,1PORT,BL ENCLOSURE,UTILITY,PLASTIC,BLACK CABLE TERMINATION TOOL INTERFACE PLATE,PLASTIC,4 MOD,ALMOND CARD EDGE CONNECTOR,SOCKET,36POS LIMIT SWITCH,SIDE ROTARY,SPDT-1NO/1NC TILT SWITCH MOUNTING CLIP MOUNTING CLIP Segmented Alphanumeric LED LED Lamp CAT6 RJ45 MODULAR JACK,8POS,1 PORT CAT5E RJ45 MODULAR JACK,8POS,1 PORT BOUCHON FEMELLE OUTIL D´INSERTION/EXTRACTION PINCE A SERTIR FICHE FEMELLE 10V CONTROLEUR DE BUS PARALLELE / I2C CMS HORLOGE TEMPS REEL/CALENDRIER LABEL,230V,CARD OF 20 LABEL,115VAC+FLASH,CARD OF 10 IMAGING FILM,BLUE,PK3 BASE FILM,ALUMINIUM PK3 GENERATEUR D´HORLOGE PROG 3 PLL IC,CLOCK BUFFER,133.3MHZ,SOIC-8 TRANSCEIVER SOC 2.4GHZ LUBRIFIANT STYLO 12ML SOLVANT STYLO 12ML REFRIGERANT 200ML AEROSOL REFRIGERANT 400ML AEROSOL PULVERISATEUR ENTRETOISE M3X6 PQ50 ENTRETOISE M3X8 PQ50 ENTRETOISE M5X5 PQ50 ENTRETOISE M5X7 PQ50 ENTRETOISE M6X12 PQ50 ENTRETOISE M8X4 PQ50 ENTRETOISE M8X6 PQ50 LABEL,BEWARE STATIC,CARD OF 5 LABEL,DANGER ISOLATE,CARD OF 8 PRESENTATION BINDER BLCK 15MM SLEEVING,BRAID,GREY,100M SLEEVING,BRAID,GREY,100M SLEEVING,BRAID,GREY,25M SLEEVING,BRAID,BLACK,100M SLEEVING,BRAID,BLACK,100M SLEEVING,BRAID,BLACK,100M SLEEVING,BRAID,BLACK,50M SLEEVING,BRAID,BLACK,25M GAINE TRESSEE NOIR/BLANC 50M GAINE TRESSEE NOIR/BLANC 50M GAINE TRESSEE NOIR/BLANC 25M GAINE TRESSEE NOIR/BLANC 25M GAINE TRESSEE GRIS/NOIR 100M GAINE TRESSEE GRIS/NOIR 50M GAINE TRESSEE GRIS/NOIR 50M GAINE TRESSEE GRIS/NOIR 25M TRESSE A DESSOUDER BGA RESINE BOUTON TORQUE SCREWDRIVER HANDLE EXTRACTEUR FICHE CARAVANNE CONNECTEUR B-TYPE GRIS/BLEU BATTERY PACK,WFM91 GENERATEUR D´IMPULSIONS SWITCH,DIP,4 POS,SPDT,RAISED ROCKER SPRINGS REPLACEMENT PK5 PINCE A BEC PLAT 146MM OPTOCOUPLER,PHOTOTRANSISTOR O/P,3.5KV,DIP-4 Industrial Control Relay SONDE PP007+ACCESSOIRES TRANSFERTS TRANSFERTS TRANSFERTS TRANSFERTS TRANSFERTS TRANSFERTS FILM LASER A3 10FEUILLES CONTROL TRANSFORMER ISOLATOR LOOP PUISSANCEED ISOLATOR SIGNAL SPLITTER TRIP AMPLIFIER,DUAL OUTPUT FERRITE FERRITE FERRITE FERRITE FERRITE FERRITE FERRITE FERRITE FERRITE FERRITE FERRITE THERMOCOUPLE IC,MOSFET DRIVER,LOW SIDE,SOT-23-5 IC,LDO VOLT REG,2A,8-SOIC TVS DIODE ARRAY,100W,5V,SC-89 NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC Thermistor NTC Thermistor NTC Thermistor NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR NTC THERMISTOR Microprocessor Crystal Microprocessor Crystal Microprocessor Crystal Microprocessor Crystal Microprocessor Crystal Microprocessor Crystal Crystal Crystal Microprocessor Crystal Microprocessor Crystal Microprocessor Crystal Oscillator Oscillator Oscillator Oscillator Oscillator Oscillator Oscillator Oscillator Oscillator Crystal Econobox Series Enclosure with Mounting FUSIBLE 6A FUSIBLE 25A FUSIBLE 35A FUSIBLE 50A FUSIBLE 63A HOOK & LOOP CABLE FASTENER HOOK & LOOP CABLE FASTENER HOOK & LOOP CABLE FASTENER MODULE USB POUR ROBOT ASURO PANNE DE SOUDAGE PANNE DE SOUDAGE PANNE DE SOUDAGE PANNE DE SOUDAGE PANNE DE SOUDAGE PANNE DE SOUDAGE PANNE DE SOUDAGE HEAT SHRINK TUBING,1.2MM ID,PVDF,TRANS,4FT HEAT SHRINK TUBING,2.4MM ID,PVDF,TRANS,4FT HEAT SHRINK TUBING,4.749MM ID,PVDF,TRANS,4FT HEAT SHRINK TUBING,9.5MM ID,PVDF,TRANS,4FT PINCE 512E PINCE COUPANTE 133.5MM PINCE COUPANTE 135.5MM PINCE COUPANTE 135.5MM PINCE COUPANTE 135.5MM PINCE COUPANTE 138.0MM PINCE COUPANTE 135.5MM PINCE A BEC PLAT 146MM TRANSISTOR MOSFET CANAL N D2-PAK 100V SPACER,ROUND,CERAMIC,0.5IN X 15.9MM MICRO SWITCH,PIN PLUNGER,SPDT,1A 125V SHLD MULTICOND CABLE,1COND,20AWG,100FT,600V SHLD MULTICOND CABLE,1COND,18AWG,1000 SHLD MULTICOND CABLE,2COND,24AWG,1000FT,600V CABLE,SHLD MULTICOND,2COND,22AWG,100FT,600V,WHT SHLD MULTICOND CABLE,2COND,22AWG,1000FT,600V CABLE,SHLD MULTICOND,2COND,20AWG,100FT,600V SHLD MULTICOND CABLE,2COND,18AWG,100FT,600V SHLD MULTICOND CABLE,3COND,20AWG,100F SHLD MULTICOND CABLE,4COND,26AWG,100F Multiconductor Cable AMPLIFICATEUR OPERATIONEL CMS AMPLIFICATEUR OPERATIONEL CMS AMPLIFICATEUR DIFFERENTIEL CMS ADAPTATEUR PLCC44/D44 ADAPTATEUR TSOP48/D48 SQUARE OUTLET BOX SCOPEMETER INDUSTRIEL,VERSION ANGLAISE KIT ACCESSOIRES STROBOSCOPE BATTERIE NIMH 2/3AF PORTE-PILE 1XC PORTE-PILE 2XC SUPPORT DE PILE BOUTON SUPPORT DE PILE BOUTON 12MM PQ5 SUPPORT DE PILE BOUTON 20MM PQ5 CONTACT POUR PILE PQ5 CLIP POUR PILE PQ5 CLIP POUR PILE PQ5 DIN 41612 PCB CONNECTOR,RECEPTACLE,48WAY ELECTRONIC TOOL KIT,33 PCS. PONT REDRESSEUR 1.9A 100V PONT REDRESSEUR 1.9A 200V PONT REDRESSEUR 25A 1000V PONT REDRESSEUR 25A 100V PONT REDRESSEUR 25A TRIPHASE PONT REDRESSEUR 25A 400V PONT REDRESSEUR 25A 50V PONT REDRESSEUR 25A 800V PONT REDRESSEUR 2A 1000V PONT REDRESSEUR 35A 1000V PONT REDRESSEUR 35A 1400V PONT REDRESSEUR 35A TRIPHASE PONT REDRESSEUR 35A TRIPHASE PONT REDRESSEUR 35A 800V PONT REDRESSEUR 6A 400V PONT REDRESSEUR 8A 50V DIODE 10A 800V DIODE 12A 100V RELAIS FLANGE 12VDC RELAIS FLANGE 24VAC DIODE 240A 800V RELAIS FLANGE 110VAC DIODE SCHOTTKY 1.5A 100V DIODE SCHOTTKY 1.5A 100V DIODE SCHOTTKY 1.5A 60V DIODE SCHOTTKY 10A 35V DIODE SCHOTTKY 18A 45V DIODE SCHOTTKY 18A 45V DIODE SCHOTTKY 1A 30V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 20A 15V DIODE SCHOTTKY 2X10A 100V DIODE SCHOTTKY 2X15A 45V DIODE SCHOTTKY 2X20A 100V DIODE SCHOTTKY 2X20A 15V DIODE SCHOTTKY 2X20A 20V DIODE SCHOTTKY 2X20A 30V DIODE SCHOTTKY 2X20A 45V DIODE SCHOTTKY 2X20A 50V DIODE SCHOTTKY 2X30A 45V DIODE SCHOTTKY 2X40A 100V DIODE SCHOTTKY 2X40A 45V DIODE SCHOTTKY 2X7.5A 45V DIODE SCHOTTKY 3A 100V DIODE SCHOTTKY 3A 15V DIODE SCHOTTKY 3A 40V DIODE SCHOTTKY 3A 60V DIODE SCHOTTKY 8A 80V DIODE DE REDRESSEMENT 8A DIODE ULTRA RAPIDE 20A DIODE ULTRA RAPIDE 20A 600V DIODE ULTRA RAPIDE 30A DIODE ULTRA RAPIDE 60A DIODE ULTRA RAPIDE 2X3A DRIVER DE MOSFET/IGBT DRIVER DE MOSFET/IGBT DRIVER DE MOSFET/IGBT DRIVER MOSFET/IGBT CMS TRANSISTOR MOSFET CANAL NN LOGIQUE SO-8 TRANSISTOR MOSFET CANAL NN MICRO-8 TRANSISTOR MOSFET CANAL NN MICRO-8 TRANSISTOR MOSFET CANAL PP LOGIQUE SO-8 TRANSISTOR MOSFET CANAL N BOITIER D2-PAK TRANSISTOR MOSFET CANAL N D2-PAK TRANSISTOR MOSFET CANAL N BOITIER DIL TRANSISTOR MOSFET CANAL N BOITIER DIL TRANSISTOR MOSFET CANAL N FETKY SO-8 TRANSISTOR MOSFET CANAL N FULLPAK TRANSISTOR MOSFET CANAL N LOGIQUE DIL TRANSISTOR MOSFET CANAL N LOGIQ FULLPAK TRANSISTOR MOSFET CANAL N LOGIQ MICRO-6 TRANSISTOR MOSFET CANAL N LOGIQ MICRO-6 TRANSISTOR MOSFET CANAL N LOGIQ MICRO-6 N CHANNEL MOSFET,20V,8.7A,SOIC TRANSISTOR MOSFET CANAL N LOGIQUE SO-8 TRANSISTOR MOSFET CANAL N LOGIQUE SOT-23 TRANSISTOR MOSFET CANAL N LOGIQUE SOT-23 TRANSISTOR MOSFET CANAL N LOGIQUE SOT-23 TRANSISTOR MOSFET CANAL N LOGIQUE SOT-23 TRANSISTOR MOSFET CANAL N MICRO-8 TRANSISTOR MOSFET CANAL N MICRO-8 TRANSISTOR MOSFET CANAL N MICRO-8 TRANSISTOR MOSFET CANAL N BOITIER SO-8 TRANSISTOR MOSFET CANAL N BOITIER SO-8 TRANSISTOR MOSFET CANAL N BOITIER SO-8 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N BOITIER TO-220 TRANSISTOR MOSFET CANAL P D2-PAK TRANSISTOR MOSFET CANAL P FETKY SO-8 TRANSISTOR MOSFET CANAL P FULLPAK TRANSISTOR MOSFET CANAL P LOGIQ MICRO-6 TRANSISTOR MOSFET CANAL P LOGIQUE SOT-23 TRANSISTOR MOSFET CANAL P LOGIQUE SOT-23 TRANSISTOR MOSFET CANAL P MICRO-8 TRANSISTOR MOSFET CANAL P MICRO-8 TRANSISTOR MOSFET CANAL P MICRO-8 TRANSISTOR MOSFET CANAL P BOITIER SO-8 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 RELAIS CARTE PROTOTYPE SPCO 12VDC TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P BOITIER TO-220 TRANSISTOR MOSFET CANAL P TSSOP-8 TRANSISTOR MOSFET CANAL P TSSOP-8 RELAIS SPNO 24VDC RELAIS PHOTOVOLTAIQUE RELAIS DPCO 24VDC RELAIS PHOTOVOLTAIQUE 200V MODULE THYRISTOR 135A 1600V MODULE THYRISTOR 160A 1200V MODULE THYRISTOR 160A 1600V MODULE THYRISTOR 25A 1200V THYRISTOR 110A 1200V BOITIER TO-94 THYRISTOR 110A 1200V BOITIER TO-94 THYRISTOR 125A 1200V BOITIER TO-94 THYRISTOR 125A 800V BOITIER TO-94 RELAIS BIST. DPCO 5V THYRISTOR 25A 1200V BOITIER TO-220 THYRISTOR 285A 1000V BOITIER TO-93 THYRISTOR 285A 800V BOITIER TO-93 THYRISTOR 30A 1600V BOITIER TO-247 THYRISTOR 50A 200V BOITIER TO-65 THYRISTOR 80A 1200V BOITIER TO-94 RELAIS CMS DPCO 12VDC MODULE THYRISTOR/DIODE 250A MODULE THYRISTOR/DIODE 25A TRANSISTOR IGBT BOITIER TO-247 PANEL CUTOUT PUNCH DC/DC Converter Wirewound Resistor BILATERAL SWITCH,9V,1A,TO-92 SIGNAL RELAY,DPDT,1.5VDC,2A,THD WIRE-BOARD CONN RECEPTACLE 40POS,2.54MM CAT5E RJ45 MODULAR PLUG,8POS,1 PORT Optocoupler Optocoupler RF/Coaxial Connector RF/Coaxial Connector RF/COAXIAL BNC BHD PLUG R/A 75 OHM SOLDER Knob Potentiometer TURNS COUNTING DIAL,10 TURNS COUNTING DIAL,20,6.35MM Wirewound Resistor Wirewound Resistor Wirewound Potentiometer Wirewound Potentiometer Wirewound Potentiometer Wirewound Potentiometer Wirewound Potentiometer POT,WIREWOUND,200 OHM,0.05,2W HARD METRIC CONNECTOR,RECEPTACLE,80POS CABLE ASSEMBLY ((NW)) Wirewound Resistor MEMOIRE SRAM 64K IC,RS-422 LINE DRIVER,5.5V,TSSOP-16 HEAT SHRINK TUBING,9.5MM ID,PO,BLK,4FT STATIC DISSIPATIVE WATER BOTTLE OPTOCOUPLEUR. SORTIES TRANSISTOR OPTOCOUPLEUR DOUBLE. SORTIES LOGIQUES POWER OUTLET STRIP TRANSDUCTEUR DE COURANT TRANSDUCTEUR DE COURANT TRANSDUCTEUR DE COURANT POWER STRIP,8 OUTLET,15A,125V,15FT MICRO SWITCH,HINGE LEVER,SPDT,3A 115V DOUBLER,COMPACT,6WAY BOITIER MOULE P/C GRIS A BOITIER MOULE P/C NOIR A BOITIER MOULE P/C GRIS D BOITIER MOULE P/C NOIR E BOITIER MOULE P/C GRIS F BOITIER MOULE P/C NOIR G BOITIER MOULE P/C GRIS J BOITIER MOULE P/C NOIR J BOITIER MOULE P/C GRIS K BOITIER MOULE P/C GRIS N SOCKET LJU 1/3A JEU DE 4 PINCES ISOLEES VDE SPARE BLADE,FOR 815-6921 SPARE BLADE,FOR 815-6930 PINCE A DENUDER POUR FIBRE OPTIQUE PLIER,FOR HALOGEN LAMPS PINCE-ETAU A BECS LONGS CUTTING NIPPER,LEVER ACTION PLIER,WRENCH,250MM PLIER,WATER PUMP,180MM PLIER,WATER PUMP,300MM PINCE A SERTIR SUB-D HD20 HDE COFFRET PINCE A SERTIR + CONNECTEURS COFFRET PINCE A SERTIR + CONNECTEURS COUTEAU POUR CABLES LAME DE RECHANGE COUTEAU POUR CABLES TROUSSE 15 OUTILS ISOLES OUTIL A DENUDER 8-13MM LAMP,23W,E27 SWITCH,PUSHBUTTON,SPST-NO-DB,400mA SWITCH,PUSHBUTTON,SPST-NO-DB,400mA SWITCH,PUSHBUTTON,SPST-NO-DB,400mA SWITCH,PUSHBUTTON,SPST,10A,250V Pushbutton Switch OPTOCOUPLER,TRANSISTOR,3000VRMS SENSOR,PHOTO,RETRO-REFLECTIVE,2M,NPN/PNP INSPECTION LAMP,100W,240V,ES KIT DE DEVELOPPEMENT DEBUG TOOL 8BIT 128K FLASH MCU TQFP64 128 MICROCONTROLEUR 8 BITS FLASH 16K MICROCONTROLEUR 8 BITS FLASH 16K CMS MICROCONTROLEUR 8 BITS FLASH 16K 8BIT 32K FLASH MCU CMS TQFP44 MICROCONTROLEUR 8 BITS FLASH 4K CMS MICROCONTROLEUR 8 BITS FLASH 8K CMS MICROCONTROLEUR 8 BITS FLASH 8K CMS MICROCONTROLEUR 8 BITS FLASH 8K MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH 8K CMS MICROCONTROLEUR 8 BITS FLASH 2K MICROCONTROLEUR 8 BITS FLASH 2K MICROCONTROLEUR 8 BITS FLASH 2K CMS SOCKET,DIN,PCB,6PIN SOCKET,DIN,PCB,8PIN FIN DE COURSE ROTATIF LEVIER LEVIER. AJUSTABLE TIGE AJUSTABLE FIN DE COURSE PLONGEUR MULTIMETRE NUMERIQUE DE POCHE MULTIMETRE NUMERIQUE MULTIMETRE NUMERIQUE CONNECT.CARTE MEMOIRE INSER/EXTRACTION CONNECTEUR MMC SANS CAPOT CONNECTEUR MMC CAPOT METAL CONNECTEUR MMC CAPOT METAL BUTEE 2MM CONNECTEUR INSERTION/EXTRACTION CABLE EN NAPPE 14 VOIES GRIS CABLE EN NAPPE 15 VOIES GRIS CABLE EN NAPPE 24 VOIES GRIS CABLE EN NAPPE GRIS 25VOIES 30.5M CABLE EN NAPPE GRIS 50VOIES 30.5M CABLE EN NAPPE 60 VOIES GRIS CABLE EN NAPPE 64 VOIES GRIS AMPLI D´INSTRUMENTATION 1 VOIE CMS AMPLI D´INSTRUMENTATION 1 VOIE CMS AMPLI D´INSTRUMENTATION 2 VOIES CMS AMPLI D´INSTRUMENTATION 2 VOIES CMS TRANSFORMER,PULSE,1:1:1,3mH JEU DE GRIPPE-FILS PETITE TAILLE (PQ10) TRANSISTOR NPN BOITIER TO-18 TRANSISTOR PNP BOITIER TO-18 TRANSISTOR NPN BOITIER TO-18 DIODE DE COMMUTATION BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT--23 DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE DOUBLE BOITIER SOT-23 DIODE DOUBLE BOITIER SOT-23 DIODE DOUBLE BOITIER SOT-24 CHARGEUR DE PILE INTERFACE USB THERMOMETRE INFRAROUGE CRYSTAL,32.768MHZ,12.5PF,SMD DC/DC Converter DC-DC Converter DC-DC Converter SHLD MULTICOND CABLE,4COND,22AWG,100FT,600V CRYSTAL,11.0592MHZ,18PF,SMD PROGRAMMABLE OSCILLATOR,64MHZ,SMD BINDING POST,15A,#6-32,STUD,RED BINDING POST,15A,#8-32,STUD BLACK/RED CRYSTAL,8MHZ,18PF,THROUGH HOLE CRYSTAL,8MHZ,18PF,THROUGH HOLE CRYSTAL,5MHZ,18PF,THROUGH HOLE CIRCUIT PWM CMS CARTE DE DEMONSTRATION MCP1630 CONNECTOR ((NW)) RACK CABINET,TABLE TOP,22.75IN STL BLK RESEAU DE RESISTANCE ARV241 1206 0R RESEAU DE RESISTANCES ARV241 1206 10R RESEAU DE RESISTANCES ARV241 1206 22R RESEAU DE RESISTANCES ARV241 1206 33R RESEAU DE RESISTANCES ARV241 1206 47R RESEAU DE RESISTANCES ARV241 1206 68R RESEAU DE RESISTANCES ARV241 1206 68R RESEAU DE RESISTANCES ARV241 1206 100R RESEAU DE RESISTANCES ARV241 1206 100R RESEAU DE RESISTANCES ARV241 1206 150R RESEAU DE RESISTANCES ARV241 1206 220R RESEAU DE RESISTANCES ARV241 1206 220R RESEAU DE RESISTANCE ARV241 1206 330R RESEAU DE RESISTANCES ARV241 1206 470R RESEAU DE RESISTANCES ARV241 1206 680R RESEAU DE RESISTANCES ARV241 1206 1K RESEAU DE RESISTANCE ARV241 1206 2K2 RESEAU DE RESISTANCES ARV241 1206 3K3 RESEAU DE RESISTANCES ARV241 1206 3K3 RESEAU DE RESISTANCES ARV241 1206 4K7 RESEAU DE RESISTANCE ARV241 1206 10K RESEAU DE RESISTANCES ARV241 1206 47K RESEAU DE RESISTANCES ARV241 1206 100K RESEAU DE RESISTANCES ARV241 1206 150K RESEAU DE RESISTANCE ARC241 1206 0R RESEAU DE RESISTANCES ARC242 1206 10R RESEAU DE RESISTANCES ARC242 1206 15R RESEAU DE RESISTANCES ARC242 1206 22R RESEAU DE RESISTANCES ARC242 1206 33R RESEAU DE RESISTANCES ARC242 1206 47R RESEAU DE RESISTANCES ARC242 1206 68R RESEAU DE RESISTANCES ARC242 1206 100R RESEAU DE RESISTANCES ARC242 1206 220R RESEAU DE RESISTANCE ARC242 1206 330R RESEAU DE RESISTANCES ARC242 1206 470R RESEAU DE RESISTANCES ARC242 1206 680R RESEAU DE RESISTANCES ARC242 1206 1K RESEAU DE RESISTANCES ARC242 1206 1K5 RESEAU DE RESISTANCES ARC242 1206 1K5 RESEAU DE RESISTANCE ARC242 1206 2K2 RESEAU DE RESISTANCE ARC242 1206 2K2 RESEAU DE RESISTANCES ARC242 1206 3K3 RESEAU DE RESISTANCES ARC242 1206 4K7 RESEAU DE RESISTANCES ARC242 1206 4K7 RESEAU DE RESISTANCE ARC242 1206 10K RESEAU DE RESISTANCES ARC242 1206 15K0 RESEAU DE RESISTANCES ARC242 1206 22K RESEAU DE RESISTANCES ARC242 1206 33K RESEAU DE RESISTANCES ARC242 1206 33K RESEAU DE RESISTANCES ARC242 1206 47K RESEAU DE RESISTANCES ARC242 1206 68K RESEAU DE RESISTANCES ARC242 1206 68K RESEAU DE RESISTANCES ARC242 1206 100K RESEAU DE RESISTANCES ARC242 1206 220K RESEAU DE RESISTANCES ARC242 1206 470K RESEAU DE RESISTANCES ARC241 1206 27R RESEAU DE RESISTANCES ARC241 1206 39R RESEAU DE RESISTANCES ARC241 1206 39R RESEAU DE RESISTANCES ARC241 1206 56R RESEAU DE RESISTANCES ARC241 1206 82R RESEAU DE RESISTANCE ARC241 1206 120R RESEAU DE RESISTANCES ARC241 1206 180R RESEAU DE RESISTANCES ARC241 1206 270R RESEAU DE RESISTANCES ARC241 1206 390R RESEAU DE RESISTANCES ARC241 1206 560R RESEAU DE RESISTANCES ARC241 1206 820R RESEAU DE RESISTANCES ARC241 1206 1K2 RESEAU DE RESISTANCES ARC241 1206 1K8 RESEAU DE RESISTANCES ARC241 1206 1K8 RESEAU DE RESISTANCES ARC241 1206 2K7 RESEAU DE RESISTANCES ARC241 1206 3K9 RESEAU DE RESISTANCES ARC241 1206 5K6 RESEAU DE RESISTANCES ARC241 1206 5K6 RESEAU DE RESISTANCES ARC241 1206 8K2 RESEAU DE RESISTANCES ARC241 1206 18K RESEAU DE RESISTANCES ARC241 1206 27K RESEAU DE RESISTANCES ARC241 1206 56K RESEAU DE RESISTANCES ARC241 1206 56K RESEAU DE RESISTANCES ARC241 1206 180K RESEAU DE RESISTANCES ARC241 1206 180K RESEAU DE RESISTANCES ARC241 1206 1M RESEAU DE RESISTANCES ARC241 1206 1M RESEAU DE RESISTANCE ARV341 0804 RESEAU DE RESISTANCE ARV341 0804 RESEAU DE RESISTANCES ARV341 0804 10R RESEAU DE RESISTANCES ARV341 0804 15R RESEAU DE RESISTANCE ARV341 0804 22R RESEAU DE RESISTANCES ARV341 0804 33R RESEAU DE RESISTANCES ARV341 0804 47R RESEAU DE RESISTANCES ARV341 0804 68R RESEAU DE RESISTANCES ARV341 0804 100R RESEAU DE RESISTANCES ARV341 0804 150R RESEAU DE RESISTANCES ARV341 0804 220R RESEAU DE RESISTANCES ARV341 0804 330R RESEAU DE RESISTANCES ARV341 0804 470R RESEAU DE RESISTANCES ARV341 0804 1K RESEAU DE RESISTANCES ARV341 0804 1K RESEAU DE RESISTANCE ARV341 0804 2K2 RESEAU DE RESISTANCE ARV341 0804 2K2 RESEAU DE RESISTANCES ARV341 0804 3K3 RESEAU DE RESISTANCES ARV341 0804 4K7 RESEAU DE RESISTANCES ARV341 0804 4K7 RESEAU DE RESISTANCES ARV341 0804 10K RESEAU DE RESISTANCES ARV341 0804 15K RESEAU DE RESISTANCES ARV341 0804 22K RESEAU DE RESISTANCES ARV341 0804 47K RESEAU DE RESISTANCES ARV341 0804 47K RESEAU DE RESISTANCES ARV341 0804 68K RESEAU DE RESISTANCES ARV341 0804 100K RESEAU DE RESISTANCES ARV341 0804 1M RESEAU DE RESISTANCES RNA310 1206 47R RESEAU DE RESISTANCES RNA310 1206 330R RESEAU DE RESISTANCES RNA310 1206 1K RESEAU DE RESISTANCES RNA310 1206 3K3 RESEAU DE RESISTANCES RNA310 1206 3K3 RESEAU DE RESISTANCES RNA310 1206 4K7 RESEAU DE RESISTANCES RNA310 1206 10K RESEAU DE RESISTANCES RNA310 1206 10K RESEAU DE RESISTANCES RNA310 1206 22K RESEAU DE RESISTANCES RNA310 1206 47K RESEAU DE RESISTANCES RNA310 1206 47K RESEAU DE RESISTANCES RNA310 1206 100K KIT DE RESISTANCES RC0603 0603 E24 KIT DE RESISTANCES RC0805 0805 E24 RESEAU DE RESISTANCE ARC241 1206 10R RESEAU DE RESISTANCES ARC241 1206 15R RESEAU DE RESISTANCES ARC241 1206 22R RESEAU DE RESISTANCES ARC241 1206 33R RESEAU DE RESISTANCE ARC241 1206 47R RESEAU DE RESISTANCES ARC241 1206 68R RESEAU DE RESISTANCES ARC241 1206 68R RESEAU DE RESISTANCES ARC241 1206 100R RESEAU DE RESISTANCES ARC241 1206 150R RESEAU DE RESISTANCES ARC241 1206 220R RESEAU DE RESISTANCE ARC241 1206 330R RESEAU DE RESISTANCES ARC241 1206 470R RESEAU DE RESISTANCES ARC241 1206 680R RESEAU DE RESISTANCES ARC241 1206 680R RESEAU DE RESISTANCES ARC241 1206 1K RESEAU DE RESISTANCES ARC241 1206 1K5 RESEAU DE RESISTANCES ARC241 1206 2K2 RESEAU DE RESISTANCES ARC241 1206 3K3 RESEAU DE RESISTANCES ARC241 1206 4K7 RESEAU DE RESISTANCES ARC241 1206 6K8 RESEAU DE RESISTANCES ARC241 1206 6K8 RESEAU DE RESISTANCES ARC241 1206 10K RESEAU DE RESISTANCES ARC241 1206 15K RESEAU DE RESISTANCES ARC241 1206 22K RESEAU DE RESISTANCE ARC241 1206 33K RESEAU DE RESISTANCES ARC241 1206 47K RESEAU DE RESISTANCES ARC241 1206 68K RESEAU DE RESISTANCES ARC241 1206 100K RESEAU DE RESISTANCES ARC241 1206 150K RESEAU DE RESISTANCES ARC241 1206 220K RESEAU DE RESISTANCES ARC241 1206 330K RESEAU DE RESISTANCES ARC241 1206 330K RESEAU DE RESISTANCE ARC241 1206 470K RESEAU DE RESISTANCES ARC241 1206 680K RESEAU DE RESISTANCES ARC241 1206 680K COMMUTATEUR COMMUTATEUR COMMUTATEUR VOYANT FIL D´EQUIPEMENT LIFY 0.75MM NOIR FIL D´EQUIPEMENT LIFY 0.75MM BLEU FIL D´EQUIPEMENT LIFY 0.75MM ROUGE FIL D´EQUIPEMENT LIFY 0.75MM VERT/JAUNE FIL D´EQUIPEMENT LIFY 1MM NOIR FIL D´EQUIPEMENT LIFY 1MM BLEU FIL D´EQUIPEMENT LIFY 1MM ROUGE FIL D´EQUIPEMENT LIFY 1.5MM NOIR FIL D´EQUIPEMENT LIFY 1.5MM BLEU FIL D´EQUIPEMENT LIFY 1.5MM ROUGE FIL D´EQUIPEMENT LIFY 1.5MM VERT/JAUNE LENTILLE ORANGE BASIC SWITCH,STRAIGHT LEVER,SPDT,15A,250V LENTILLE BLEUE ADAPTATEUR CI C-Series Enclosure CA-Series Enclosure ENCLOSURE,HAND HELD,PLASTIC,BLACK ENCLOSURE,HAND HELD,PLASTIC,BLACK ENCLOSURE,HAND HELD,PLASTIC,BLACK ENCLOSURE,HAND HELD,PLASTIC,BLACK ENCLOSURE,HAND HELD,PLASTIC,BLACK COMPTEUR ADDITION PRESET M-Series Enclosure COMPTEUR ADDITION PRESET PANEL KIT COMPTEUR TOTALISEUR PCB COMPTEUR TOTALISEUR PCB COMPTEUR TACHYMETRE COMPTEUR TOTALISEUR COMPTEUR TOTALISEUR BULKHEAD HOUSING,SIZE 10B,METAL INDUCTANCE CMS 5A 20Z INDUCTANCE CMS 5A 20Z INDUCTANCE CMS 5A 45Z INDUCTANCE CMS 5A 45Z FERRITE E PLANAR FERRITE I PLANAR FERRITE E PLANAR TRANSISTOR MOSFET CANAL N DIRECTFET MT TRANSISTOR MOSFET CANAL N DIRECTFET ST TRANSISTOR MOSFET CANAL N DIRECTFET ST TRANSISTOR MOSFET CANAL N DIRECTFET MT TRANSISTOR MOSFET CANAL N DIRECTFET MX TRANSISTOR MOSFET CANAL N DIRECTFET MX TRANSISTOR MOSFET CANAL N DIRECTFET ST TRANSISTOR MOSFET CANAL N DIRECTFET ST EMBASE FEMELLE COUDEE CI 0B 2 VOIES EMBASE FEMELLE COUDEE CI 10 4 VOIES EMBASE FEMELLE COUDEE CI 10 6 VOIES BOITIER PC GRIS 130X80X125 BOITIER PC GRIS 130X130X75 BOITIER PC GRIS 180X180X125 EVALUATION KIT BRIDGE USB-UART FLASH ALARM,12V,RED/CLR PONT REDRESSEUR 50A 800V TRIPHASE PONT REDRESSEUR 50A 1200V TRIPHASE COFFRET NOIR ALU END PLATE BOITIER. NOIR. PLAQUE ALU COFFRET NOIR ALU END PLATE BOITIER. NOIR. PLAQUE PLASTIQUE BOITIER. NOIR. PLAQUE PLASTIQUE COFFRET NOIR PLASTIQUE E/PLATE SCREW MOUNTING SET FICHE MALE MDR POUR CABLE 36 VOIES FICHE MALE MDR POUR CABLE 50 VOIES EMBASE MDR ANGLE DROIT 14 VOIES EMBASE MDR ANGLE DROIT 20 VOIES EMBASE MDR ANGLE DROIT 36 VOIES EMBASE MDR ANGLE DROIT 50 VOIES EMBASE MDR ANGLE DROIT 20 VOIES EMBASE MDR ANGLE DROIT 36 VOIES EMBASE MDR DROITE 26 VOIES EMBASE MDR DROITE 50 VOIES CAPOT MDR 26 VOIES BLINDE CAPOT MDR 36 VOIES BLINDE CAPOT MDR 36 VOIES METALLIQUE TRANSISTOR DARLINGTON BOITIER TO-247 TRANSISTOR DARLINGTON BOITIER TO-247 TRANSISTOR DARLINGTON BOITIER TO-220 TRANSISTOR PNP BOITIER TO-247 TRANSISTOR DARLINGTON BOITIER TO-220 TRANSISTOR PNP BOITIER TO-220 REPERE DE CABLE 1 PQ500 REPERE DE CABLE R PQ500 REPERE DE CABLE X PQ500 REPERE DE CABLE Y PQ500 REPERE DE CABLE Z PQ500 BOITIER METALLIQUE 90X120X120 LOCK,300KG,MINI,UNMONITORED LOCK,STANDARD,600KG,MONITORED BRACKET,Z,600KG WIRE-BOARD CONNECTOR RECEPTACLE,3POS,2 COFFRET ALUMINIUM 85X250X250 CAPACITOR TANT,0.1UF 50V,19 OHM,0.1,3216-18 CAPACITOR TANT,1UF,25V 20% CAPACITOR TANT,1UF,20V,8.4 OHM,0.1,3216-18 CAPACITOR TANT,1UF,35V,7.5 OHM,0.1,3216-18 CAPACITOR TANT,10UF 10V,3.4 OHM,0.2,3216-18 CAPACITOR TANT,10UF 10V,2.5 OHM,0.2,3528-21 CAPACITOR TANT,10UF,16V,3 OHM,0.2,3216-18 CAPACITOR TANT,10UF,16V,2 OHM,0.2,3528-21 CAPACITOR TANT,10UF 25V,1.5 OHM,0.2,6032-28 COFFRET ALUMINIUM 120X230X180 CAPACITOR TANT,10UF 35V,0.8 OHM,0.2,7343-31 CAPACITOR TANT,10UF 20V,2.5 OHM,0.1,3528-21 CAPACITOR TANT,10UF 20V,1.7 OHM,0.1,6032-28 CAPACITOR TANT,10UF 25V,1.5 OHM,0.1,6032-28 CAPACITOR TANT,100UF 6.3V 0.8 OHM 10%,6032-28 COFFRET ALUMINIUM 150X250X263 CAPACITOR TANT,2.2UF,10V 20% CAPACITOR TANT,2.2UF 16V 5.9 OHM 20%,3216-18 CAPACITOR TANT,2.2UF 16V 4.6 OHM 10%,3528-21 CAPACITOR TANT,2.2UF,20V 10% CAPACITOR TANT,22UF 16V,1.4OHM,20%,6 CAPACITOR TANT,22UF 25V,0.7 OHM,0.2,7343-31 CAPACITOR TANT,22UF 10V,1.5 OHM,0.1,6032-28 CAPACITOR TANT,22UF 16V,1.9 OHM,0.1,3528-21 CAPACITOR TANT,22UF 16V,1.4 OHM,0.1,6032-28 KIT PANNEAU POUR 930-260 CAPACITOR TANT,22UF 20V,1.1 OHM,0.1,6032-28 CAPACITOR TANT,22UF 35V,0.6 OHM,0.1,7343-43 KIT PANNEAU POUR 930-271 CAPACITOR TANT,33UF 10V,1.9 OHM,0.1,3528-21 CAPACITOR TANT,33UF 16V,1.1 OHM,0.1,6032-28 KIT PANNEAU POUR 930-295 CAPACITOR TANT,4.7UF 20V 2.9 OHM 20%,3 KIT PANNEAU POUR 930-325 KIT PANNEAU POUR 930-337 CAPACITOR TANT,47UF 10V,0.7 OHM,0.1,7343-31 CAPACITOR TANT,47UF,16V,1 OHM,0.1,6032-28 CAPACITOR TANT,47UF 16V,0.7 OHM,0.1,7343-31 CAPACITOR TANT,47UF 20V,0.7 OHM,0.1,7343-31 CAPACITOR TANT,6.8UF 35V 1.1 OHM 10%,7343-31 CAPACITOR TANT,68UF 10V,0.7 OHM,0.1,7343-31 CAPACITOR TANT,68UF 16V,0.6OHM,10%,7 Connector Housing WIRE-BOARD CONNECTOR,PLUG,3POS,2.54MM PLUG & SOCKET HOUSING,RECEPTACLE,2POS,3MM Connector Housing PLUG & SOCKET HOUSING,PLUG,NYLON PLUG & SOCKET HOUSING,PLUG,NYLON PLUG & SOCKET HOUSING,PLUG,NYLON CURRENT SENSOR FAN SHROUD (2) INDUCTOR,SHIELDED,680NH,25A,SMD SSR,DIN RAIL MOUNT,660VAC,32VDC,20A B1 Series Enclosure B1 Series Enclosure ENCLOSURE,INSTRUMENT,ALUMINIUM,SILVER B1 Series Enclosure ENCLOSURE,INSTRUMENT,ALUMINIUM,BLUE B1 Series Enclosure B2 Series Enclosure B2 Series Enclosure B2 Series Enclosure ENCLOSURE,INSTRUMENT,ALUMINIUM,BLACK ENCLOSURE,INSTRUMENT,ALUMINIUM,BLUE ENCLOSURE,INSTRUMENT,ALUMINIUM,GREEN ENCLOSURE,INSTRUMENT,ALUMINIUM,RED B3 Series Enclosure ENCLOSURE,INSTRUMENT,ALUMINIUM,SILVER ENCLOSURE,INSTRUMENT,ALUMINIUM,BLACK ENCLOSURE,INSTRUMENT,ALUMINIUM,BLUE B4 Series Enclosure ENCLOSURE,INSTRUMENT,ALUMINIUM,SILVER B4 Series Enclosure B4 Series Enclosure B4 Series Enclosure Enclosures,Accessories Enclosures,Accessories Enclosures,Accessories WIRE-BOARD CONNECTOR RECEPTACLE,4POS,2.54MM REED RELAY,SPST-NO,5VDC,0.5A,THD REED RELAY,SPST-NO,12VDC,0.5A,THD ENCLOSURE,BOX,ALUMINIUM,BLACK ENCLOSURE,BOX,PLASTIC,BLACK TERMINAL BLOCK,DIN RAIL,4POS,22-14AWG END PLATE,TOPJOB S TERMINAL BLOCK END PLATE,TOPJOB S TERMINAL BLOCK END PLATE,RAIL MOUNTED TERMINAL BLOCK END PLATE,RAIL MOUNTED TERMINAL BLOCK END PLATE,RAIL MOUNTED TERMINAL BLOCK END PLATE,RAIL MOUNTED TERMINAL BLOCK END PLATE,RAIL MOUNTED TERMINAL BLOCK TERMINAL BLOCK,DIN RAIL,2POS,4-4/0AWG TERMINAL BLOCK PLUGGABLE,2POS,18-12AWG TERMINAL BLOCK PLUGGABLE,4POS,18-12AWG TERMINAL BLOCK PLUGGABLE,6POS,18-12AWG TERMINAL BLOCK PLUGGABLE,8POS,18-12AWG DIN MOUNT RELAY POWER RELAY,115VAC,16A,DIN RAIL DIN MOUNT RELAY WIRE-BOARD CONNECTOR RECEPTACLE 30POS,2.54MM CHIP INDUCTOR 1.5UH 410MA 10% 70MHZ CHIP INDUCTOR,100UH,110MA 5% 8MHZ CHIP INDUCTOR 6.8UH 285MA 10% 27MHZ CHIP INDUCTOR 8.2UH 270MA 10% 25MHZ INDUCTOR,UN-SHIELDED,1MH,135MA,SMD INDUCTOR,UN-SHIELDED,10MH,40MA,SMD INDUCTOR,UN-SHIELDED,22UH,1.06A,SMD POWER INDUCTOR 220UH 340MA 10% 6MHZ POWER INDUCTOR,3.3MH,62MA 5% 2MHZ INDUCTOR,UN-SHIELDED,47UH,750MA,SMD INDUCTOR,UN-SHIELDED,4.7MH,50MA,SMD Power Inductor INDUCTOR,UN-SHIELDED,18UH,2.6A,SMD INDUCTOR,UN-SHIELDED,270UH,1A,SMD POWER INDUCTOR 820UH 240MA 10% 2MHZ INDUCTOR,UN-SHIELDED,15UH,9A,SMD TRIMMER,POTENTIOMETER,100 OHM 12TURN THRU HOLE TRIMMER,POTENTIOMETER,1KOHM 12TURN THRU HOLE TRIMMER,POTENTIOMETER,2KOHM 12TURN THRU HOLE TRIMMER,POTENTIOMETER,5KOHM 12TURN THRU HOLE TRIMMER,POTENTIOMETER,5KOHM 12TURN THRU HOLE TRIMMER,POTENTIOMETER,100KOHM 25TURN THRU HOLE TRIMMER,POTENTIOMETER,500KOHM 25TURN T TRIMMER,POTENTIOMETER,500KOHM 25TURN THRU HOLE TRIMMER,POTENTIOMETER,10KOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,100KOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,100KOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,50KOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,10KOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,10KOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,10 OHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,2MOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,25KOHM 1TURN THRU HOLE TRIMMER,POTENTIOMETER,250KOHM 1TURN THRU HOLE RESISTOR,ISO RES N/W,2,1KOHM,2%,SIP RESISTOR,BUS RES N/W,7,2KOHM,2%,SIP RESISTOR,ISO RES N/W,4,120 OHM,0.02,SIP RESISTOR,ISO RES N/W,4,20KOHM,2%,SIP RESISTOR,BUS RES N/W 9,6.8KOHM,2%,SIP RESISTOR,ISO RES N/W 5,100KOHM,2%,SIP RESISTOR,ISO RES N/W,5,330OHM,2%,SI RESISTOR,BUS RES N/W,15,1KOHM,2%,SMD CURRENT SENSOR WIRE-BOARD CONNECTOR,PLUG,4POS,2.54MM CURRENT SENSOR BOARD-BOARD CONNECTOR RECEPTACLE 102WAY,4ROW MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS CONVERTISSEUR N/A 10 BITS QUAD 2.5V CMS CONVERTISSEUR A/N 24 BITS CMS CONVERTISSEUR A/N 24 BITS CMS CONVERTISSEUR A/N 24 BITS 4 CANAUX CMS CONVERTISSEUR N/A CMS 12 BITS 1 VOIE CIRCUIT SUPERVISEUR CMS CONVERTISSEUR STEP-UP CMS CONTROLEUR DE DSP CONVERTISSEUR STEP DOWN CMS CONVERTISSEUR STEP-DOWN CMS CIRCUIT UART AVEC FIFO/CONTROLE DE DEBIT CIRCUIT UART AVEC FIFO/CONTROLE DE DEBIT KIT DE RESISTANCES 0603 E24 1% KIT DE RESISTANCES 1206 E12 5% RESISTANCE 1W 5% 100R RESISTANCE 1W 5% 1K RESISTANCE 1W 5% 100K RESISTANCE 1W 5% 150R RESISTANCE 1W 5% 1K5 RESISTANCE 1W 5% 470R RESISTANCE 2W 5% 15K RESISTANCE 2W 5% 680K RESISTANCE 0.5W 5% 1K RESISTANCE 0.5W 5% 12R RESISTANCE 0.5W 5% 120R RESISTANCE 0.5W 5% 15R RESISTANCE 0.5W 5% 150R RESISTANCE 0.5W 5% 15K RESISTANCE 0.5W 5% 150K RESISTANCE 0.5W 5% 180K RESISTANCE 0.5W 5% 22R RESISTANCE 0.5W 5% 2K2 RESISTANCE 0.5W 5% 270K RESISTANCE 0.5W 5% 3R3 RESISTANCE 0.5W 5% 390R RESISTANCE 0.5W 5% 390K RESISTANCE 0.5W 5% 47K RESISTANCE 0.5W 5% 680K RESISTANCE 0.5W 5% 6R8 RESISTANCE 0.5W 5% 8K2 RESISTANCE 0.5W 5% 820K STRAP ZERO OHM RESISTANCE 0.25W 5% 10R RESISTANCE 0.25W 5% 100R RESISTANCE 0.25W 5% 1K RESISTANCE 0.25W 5% 10K RESISTANCE 0.25W 5% 100K RESISTANCE 0.25W 5% 12R RESISTANCE 0.25W 5% 120R RESISTANCE 0.25W 5% 1K2 RESISTANCE 0.25W 5% 150R RESISTANCE 0.25W 5% 1K5 RESISTANCE 0.25W 5% 1R5 RESISTANCE 0.25W 5% 180R RESISTANCE 0.25W 5% 1K8 RESISTANCE 0.25W 5% 18K RESISTANCE 0.25W 5% 1R8 RESISTANCE 0.25W 5% 22R RESISTANCE 0.25W 5% 220R RESISTANCE 0.25W 5% 2K2 RESISTANCE 0.25W 5% 22K RESISTANCE 0.25W 5% 2R2 RESISTANCE 0.25W 5% 2K7 RESISTANCE 0.25W 5% 2R7 RESISTANCE 0.25W 5% 33R RESISTANCE 0.25W 5% 330R RESISTANCE 0.25W 5% 3K3 RESISTANCE 0.25W 5% 33K RESISTANCE 0.25W 5% 39R RESISTANCE 0.25W 5% 390R RESISTANCE 0.25W 5% 3K9 RESISTANCE 0.25W 5% 3R9 RESISTANCE 0.25W 5% 470R RESISTANCE 0.25W 5% 4K7 RESISTANCE 0.25W 5% 47K RESISTANCE 0.25W 5% 56R RESISTANCE 0.25W 5% 560R RESISTANCE 0.25W 5% 5K6 RESISTANCE 0.25W 5% 6K8 RESISTANCE 0.25W 5% 680K RESISTANCE 0.25W 5% 6R8 RESISTANCE 0.25W 5% 820R RESISTANCE 0.25W 5% 8K2 RESISTANCE 0.25W 5% 8R2 RESISTANCE 0.5W 1% 1K RESISTANCE 0.5W 1% 10K RESISTANCE 0.5W 1% 10R RESISTANCE 0.5W 1% 11R RESISTANCE 0.5W 1% 1K2 RESISTANCE 0.5W 1% 130R RESISTANCE 0.5W 1% 13K RESISTANCE 0.5W 1% 160K RESISTANCE 0.5W 1% 16R RESISTANCE 0.5W 1% 2K RESISTANCE 0.5W 1% 2K2 RESISTANCE 0.5W 1% 2R2 RESISTANCE 0.5W 1% 24R RESISTANCE 0.5W 1% 360R RESISTANCE 0.5W 1% 390R RESISTANCE 0.5W 1% 390K RESISTANCE 0.5W 1% 39R RESISTANCE 0.5W 1% 430K RESISTANCE 0.5W 1% 43R RESISTANCE 0.5W 1% 470R RESISTANCE 0.5W 1% 47R RESISTANCE 0.5W 1% 510R RESISTANCE 0.5W 1% 680R RESISTANCE 0.5W 1% 6R8 RESISTANCE 0.5W 1% 7K5 RESISTANCE 0.5W 1% 9K1 RESISTANCE 0.25W 1% 100R RESISTANCE 0.25W 1% 1K RESISTANCE 0.25W 1% 10K RESISTANCE 0.25W 1% 100K RESISTANCE 0.25W 1% 1M RESISTANCE 0.25W 1% 10R RESISTANCE 0.25W 1% 1R RESISTANCE 0.25W 1% 110R RESISTANCE 0.25W 1% 11R RESISTANCE 0.25W 1% 120R RESISTANCE 0.25W 1% 1K2 RESISTANCE 0.25W 1% 1K3 RESISTANCE 0.25W 1% 13R RESISTANCE 0.25W 1% 150R RESISTANCE 0.25W 1% 20K RESISTANCE 0.25W 1% 200K RESISTANCE 0.25W 1% 220R RESISTANCE 0.25W 1% 2K2 RESISTANCE 0.25W 1% 22K RESISTANCE 0.25W 1% 220K RESISTANCE 0.25W 1% 24K RESISTANCE 0.25W 1% 240K RESISTANCE 0.25W 1% 2K7 RESISTANCE 0.25W 1% 300R RESISTANCE 0.25W 1% 30K RESISTANCE 0.25W 1% 30R RESISTANCE 0.25W 1% 3K3 RESISTANCE 0.25W 1% 33K RESISTANCE 0.25W 1% 330K RESISTANCE 0.25W 1% 33R RESISTANCE 0.25W 1% 3K6 RESISTANCE 0.25W 1% 360K RESISTANCE 0.25W 1% 390R RESISTANCE 0.25W 1% 3K9 RESISTANCE 0.25W 1% 43R RESISTANCE 0.25W 1% 470R RESISTANCE 0.25W 1% 4K7 RESISTANCE 0.25W 1% 4R7 RESISTANCE 0.25W 1% 51R RESISTANCE 0.25W 1% 560K RESISTANCE 0.25W 1% 56R RESISTANCE 0.25W 1% 620K RESISTANCE 0.25W 1% 68K RESISTANCE 0.25W 1% 7K5 RESISTANCE 0.25W 1% 820K RESISTANCE 0.25W 1% 91K RESISTANCE 0.125W 1% 10K RESISTANCE 0.125W 1% 100K RESISTANCE 0.125W 1% 110R RESISTANCE 0.125W 1% 110K RESISTANCE 0.125W 1% 130R RESISTANCE 0.125W 1% 130K RESISTANCE 0.125W 1% 13R RESISTANCE 0.125W 1% 1K5 RESISTANCE 0.125W 1% 15R RESISTANCE 0.125W 1% 1R5 RESISTANCE 0.125W 1% 16K RESISTANCE 0.125W 1% 160K RESISTANCE 0.125W 1% 16R RESISTANCE 0.125W 1% 18R RESISTANCE 0.125W 1% 2K RESISTANCE 0.125W 1% 20K RESISTANCE 0.125W 1% 20R RESISTANCE 0.125W 1% 240K RESISTANCE 0.125W 1% 24R RESISTANCE 0.125W 1% 30R RESISTANCE 0.125W 1% 360K RESISTANCE 0.125W 1% 560K RESISTANCE 0.125W 1% 620K RESISTANCE 0.125W 1% 68R RESISTANCE 0.125W 1% 750K RESISTANCE 0.125W 1% 910K KIT DE RESISTANCES 0.125W 5% E12 OPTOCOUPLEUR CMS CMOS 12.5MHZ OPTOCOUPLEUR CMOS 25MHZ METRE A RUBAN 5M CONDENSATEUR 1500UF 250V CONDENSATEUR 33000UF 35V CONDENSATEUR 1000UF 385V FUSIBLE MULTIFUSE RADIAL 18.00A FUSIBLE MULTIFUSE RADIAL 3.20A FUSIBLE MULTIFUSE RADIAL 3.70A MULTIFUSE CMS 1.00A MULTIFUSE CMS 1.00A MULTIFUSE CMS 2.00A MULTIFUSE CMS 2.00A MULTIFUSE CMS 3.00A MULTIFUSE CMS 3.00A FUSIBLE MULTIFUSE CMS 0.30A FUSIBLE MULTIFUSE CMS 0.30A FUSIBLE MULTIFUSE CMS 0.40A FUSIBLE MULTIFUSE CMS 0.40A FUSIBLE MULTIFUSE CMS 1.00A FUSIBLE MULTIFUSE CMS 1.00A FUSIBLE MULTIFUSE CMS 2.50A FUSIBLE MULTIFUSE CMS 2.50A FUSIBLE MULTIFUSE CMS 3.00A FUSIBLE MULTIFUSE CMS 3.00A FUSIBLE MULTIFUSE RADIAL 0.1A 60V FUSIBLE MULTIFUSE RADIAL 0.25A 60V FUSIBLE MULTIFUSE RADIAL 0.3A 60V FUSIBLE MULTIFUSE RADIAL 0.5A 60V FUSIBLE MULTIFUSE RADIAL 0.9A 60V FUSIBLE MULTIFUSE RADIAL 1.1A 30V FUSIBLE MULTIFUSE RADIAL 1.35A 30V FUSIBLE MULTIFUSE RADIAL 1.6A 30V FUSIBLE MULTIFUSE RADIAL 1.85A 30V FUSIBLE MULTIFUSE RADIAL 2.5A 30V FUSIBLE MULTIFUSE RADIAL 3A 30V FUSIBLE MULTIFUSE RADIAL 5A 30V FUSIBLE MULTIFUSE RADIAL 6A 30V FUSIBLE MULTIFUSE RADIAL 7A 30V FUSIBLE MULTIFUSE RADIAL 8A 30V TRIMMER 15 TOURS 100K TRIMMER 15 TOURS 200R TRIMMER 15 TOURS 50K TRIMMER 22 TOURS 100R TRIMMER 22 TOURS 10K TRIMMER 22 TOURS 500R TRIMMER 22 TOURS 5K TRIMMER 22 TOURS 500K TRIMMER 15 TOURS 10K TRIMMER 15 TOURS 5K TRIMMER 15 TOURS 500K TRIMMER 15 TOURS 100R TRIMMER 15 TOURS 200R TRIMMER 15 TOURS 2K TRIMMER 15 TOURS 20K TRIMMER 15 TOURS 200K TRIMMER CMS 12 TOURS 1K TRIMMER CMS 12 TOURS 2K TRIMMER CMS 12 TOURS 50K TRIMMER CMS 12 TOURS 1K TRIMMER CMS 12 TOURS 50K TRIMMER 25 TOURS 1M TRIMMER 25 TOURS 200R TRIMMER 25 TOURS 2K TRIMMER 25 TOURS 20K TRIMMER 25 TOURS 500R TRIMMER 25 TOURS 10R TRIMMER 25 TOURS 100K TRIMMER 25 TOURS 1M TRIMMER 25 TOURS 20R TRIMMER 25 TOURS 5K TRIMMER 25 TOURS 50K TRIMMER 25 TOURS 500K TRIMMER 25 TOURS 10R TRIMMER 25 TOURS 100R TRIMMER 25 TOURS 1K TRIMMER 25 TOURS 100K TRIMMER 25 TOURS 20R TRIMMER 25 TOURS 2K TRIMMER 25 TOURS 200R TRIMMER 25 TOURS 50R TRIMMER 25 TOURS 500R TRIMMER 25 TOURS 10K TRIMMER 25 TOURS 2K TRIMMER 25 TOURS 500R POTENTIOMETRE 100K POTENTIOMETRE 10K POTENTIOMETRE 10K POTENTIOMETRE 100K TRIMMER 100R TRIMMER 1K TRIMMER 100K TRIMMER 200R TRIMMER 200K TRIMMER 4 TOURS 1K TRIMMER 4 TOURS 20K TRIMMER 4 TOURS 500R TRIMMER 100R TRIMMER 10K TRIMMER 1M TRIMMER 2K TRIMMER 2K TRIMMER 500R TRIMMER 500K TRIMMER 1K TRIMMER 1K TRIMMER 1M TRIMMER 2K TRIMMER 2K TRIMMER 20K TRIMMER 200K TRIMMER 200K TRIMMER 200K TRIMMER 50K TRIMMER 500K TRIMMER 100K TRIMMER 1M TRIMMER 200R TRIMMER 200K TRIMMER 100R TRIMMER 1K TRIMMER 200R TRIMMER 100K TRIMMER 2K TRIMMER 50K TRIMMER 500K TRIMMER 10K TRIMMER 1M TRIMMER 200R TRIMMER 2K TRIMMER 20K TRIMMER 200K TRIMMER 5K TRIMMER 500K TRIMMER 1K TRIMMER 2K TRIMMER 200K TRIMMER 5K TRIMMER 50K RESEAU DE RESISTANCE 100K RESEAU DE RESISTANCE 150R RESEAU DE RESISTANCE 220R RESEAU DE RESISTANCE 270R RESEAU DE RESISTANCE 47R RESEAU DE RESISTANCE 470R RESEAU DE RESISTANCE 4K7 RESEAU DE RESISTANCE 47K RESEAU DE RESISTANCE 68R RESEAU DE RESISTANCE 2K2 RESEAU DE RESISTANCE 1K5 RESEAU DE RESISTANCE 22K RESEAU DE RESISTANCE 270R RESEAU DE RESISTANCE 680R FILTRE RESEAU T 50PF/25R RESEAU DE RESISTANCE 10K RESEAU DE RESISTANCE 100R RESEAU DE RESISTANCE 1K5 RESEAU DE RESISTANCE 220R RESEAU DE RESISTANCE 220K RESEAU DE RESISTANCE 3K3 RESEAU DE RESISTANCE 470K RESEAU DE RESISTANCE 680R RESEAU DE RESISTANCE 100R RESEAU DE RESISTANCE 100K RESEAU DE RESISTANCE 220R RESEAU DE RESISTANCE 220K RESEAU DE RESISTANCE 47R RESEAU DE RESISTANCE 470K RESEAU DE RESISTANCE 10R RESEAU DE RESISTANCE 1K RESEAU DE RESISTANCE 270R RESEAU DE RESISTANCE 33R RESEAU DE RESISTANCE 470K RESEAU DE RESISTANCE 68R RESEAU DE RESISTANCE 82R RESEAU DE RESISTANCE 10R RESEAU DE RESISTANCE 10K RESEAU DE RESISTANCE 1M RESEAU DE RESISTANCE 180R RESEAU DE RESISTANCE 18K RESEAU DE RESISTANCE 22R RESEAU DE RESISTANCE 2K7 RESEAU DE RESISTANCE 4K7 RESEAU DE RESISTANCE 470K RESEAU DE RESISTANCE 1M RESEAU DE RESISTANCE 150R RESEAU DE RESISTANCE 470R RESEAU DE RESISTANCE 22R RESEAU DE RESISTANCE 2K2 RESEAU DE RESISTANCE 33R RESEAU DE RESISTANCE 47R RESEAU DE RESISTANCE 4K7 RESEAU DE RESISTANCE 100R RESEAU DE RESISTANCE 10K RESEAU DE RESISTANCE 4K7 RESEAU DE RESISTANCE 10R RESEAU DE RESISTANCE 100R RESEAU DE RESISTANCE 1K RESEAU DE RESISTANCE 1M RESEAU DE RESISTANCE 2K2 RESEAU DE RESISTANCE 470R RESEAU DE RESISTANCE 4K7 RESEAU DE RESISTANCE 100R RESEAU DE RESISTANCE 1K RESEAU DE RESISTANCE 100K RESEAU DE RESISTANCE 220R RESEAU DE RESISTANCE 470R POTENTIOMETRE 10K POTENTIOMETRE DOUBLE 10K POTENTIOMETRE 2K5 POTENTIOMETRE 50K POTENTIOMETRE DOUBLE 10K ENCODEUR OPTIQUE ENCODEUR POTENTIOMETRE 10K TRANSISTOR MOSFET CANAL N TO-247 TRANSISTOR MOSFET CANAL N TO-247 TRANSISTOR MOSFET CANAL N TO-264 TRANSISTOR MOSFET CANAL N SOT-227B TRANSISTOR MOSFET CANAL N SOT-227B TRANSISTOR MOSFET CANAL N SOT-227B TRANSISTOR MOSFET CANAL N TO-247 TRANSISTOR MOSFET CANAL N TO-264 TRANSISTOR MOSFET CANAL N TO-247 DIODE DE REDRESSEMENT RAPIDE 2X30A PONT REDRESSEUR 35A 1200V TRIPHASE TRANSISTOR MOSFET CANAL N TO-247 TRANSISTOR MOSFET CANAL N TO-247 PONT REDRESSEUR 127A 1200V TRIPHASE FICHE MALE DIL AUTODENUDANT 14 VOIES SLEEVING,EXPANDABLE,12.7MM ID,PET,BLK,30.5M/100FT RESISTOR,THIN FILM,100 OHM,63mW,0.5% RESISTOR,THIN FILM,1KOHM,63mW,0.5% RESISTOR,THIN FILM,10KOHM,63mW,0.5% RESISTOR,THIN FILM,100KOHM,63mW,0.5% RESISTOR,THIN FILM,4.7KOHM,63mW,0.5% DISSIPATEUR DE CHALEUR RESISTOR,THIN FILM,10 OHM,63mW,0.5% DISSIPATEUR THERMIQUE RESISTOR,THIN FILM,33 OHM,63mW,0.5% DISSIPATEUR THERMIQUE DISSIPATEUR THERMIQUE RESISTOR THIN FILM 100 OHM 63mW 0.5% 0603 RESISTOR THIN FILM 1KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 10.2KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 10KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 100KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 1.05KOHM 63mW 0.1% 06 RESISTOR THIN FILM 1.07KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 1.1KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 11KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 120OHM 63mW 0.1% 0603 RESISTOR THIN FILM 12.7KOHM 63mW 0.1% 06 RESISTOR THIN FILM 130KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 140KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 150KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 1.8KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 200 OHM 63mW 0.5% 0603 RESISTOR THIN FILM 20KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 200KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 220OHM 63mW 0.1% 0603 RESISTOR THIN FILM 2.2KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 22KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 2.49KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 2.55KOHM 63mW 0.1% 06 RESISTOR THIN FILM 300 OHM 63mW 0.1% 0603 RESISTOR THIN FILM 31.6KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 330 OHM 63mW 0.5% 0603 RESISTOR THIN FILM 36.5KOHM 63mW 0.1% 06 RESISTOR THIN FILM 3.92KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 402OHM 63mW 0.1% 0603 RESISTOR THIN FILM 4.12KOHM 63mW 0.1% 0603 PLAQUETTE THERMIQUE TO-3P RESISTOR THIN FILM 4.7KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 47KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 499 OHM 63mW 0.5% 0603 RESISTOR THIN FILM 4.99KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 49.9KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 510OHM 63mW 0.1% 0603 RESISTOR THIN FILM 5.1KOHM 63mW 0.1% 0603 ETIQUETTES (BOBINE DE 1000) RESISTOR THIN FILM 5.1KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 51KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 549 OHM 63mW 0.1% 0603 Thin Film Chip Resistor RESISTOR THIN FILM 6.2KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 68.1KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 68KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 68KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 750 OHM 63mW 0.1% 0603 RESISTOR THIN FILM 7.5KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 7.5KOHM 63mW 0.5% 0603 PLUG EARTH BONDING POINT RESISTOR THIN FILM 8.2KOHM 63mW 0.5% 0603 RESISTOR THIN FILM 90.9KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 9.31KOHM 63mW 0.1% 0603 RESISTOR THIN FILM 95.3KOHM 63mW 0.1% 0603 RESISTOR,THIN FILM,10 OHM,63mW,0.5% DISSIPATEUR THERMIQUE RESISTOR,THIN FILM,100 OHM,100mW,0.5% RESISTOR,THIN FILM,10.2KOHM,100mW 0.1% RESISTOR,THIN FILM,1MOHM,100mW,0.5% RESISTOR,THIN FILM,110 OHM,100mW,0.1% RESISTOR,THIN FILM,110KOHM,100mW,0.1% RESISTOR,THIN FILM,11.5KOHM,100mW 0.1% RESISTOR,THIN FILM,120 OHM,100mW,0.1% RESISTOR,THIN FILM,120 OHM,100mW,0.5% RESISTOR,THIN FILM,1.2KOHM,100mW,0.5% RESISTOR,THIN FILM,120KOHM,100mW,0.1% RESISTOR,THIN FILM,1.24KOHM,100mW 0.1% RESISTOR,THIN FILM,150 OHM,100mW,0.1% RESISTOR,THIN FILM,150 OHM,100mW,0.5% RESISTOR,THIN FILM,1.5KOHM,100mW,0.5% RESISTOR,THIN FILM,15KOHM,100mW,0.5% RESISTOR,THIN FILM,150KOHM,100mW,0.5% RESISTOR,THIN FILM,16.5KOHM,100mW 0.1% RESISTOR,THIN FILM,180 OHM,100mW,0.5% RESISTOR,THIN FILM,200 OHM,100mW,0.5% RESISTOR,THIN FILM,2KOHM,100mW,0.5% RESISTOR,THIN FILM,20KOHM,100mW,0.5% RESISTOR,THIN FILM,200KOHM,100mW,0.5% RESISTOR,THIN FILM,21KOHM,100mW,0.1% RESISTOR,THIN FILM,220 OHM,100mW,0.5% RESISTOR,THIN FILM,2.2KOHM,100mW,0.5% RESISTOR,THIN FILM,22KOHM,100mW,0.5% RESISTOR,THIN FILM,2.4KOHM,100mW,0.1 RESISTOR,THIN FILM,24KOHM,100mW,0.1% RESISTOR,THIN FILM,249 OHM,100mW,0.1% RESISTOR,THIN FILM,2.49KOHM,100mW 0.1% RESISTOR,THIN FILM,2.49KOHM,100mW 0.5% RESISTOR,THIN FILM,24.9KOHM,100mW 0.1% Thin Film Chip Resistor RESISTOR,THIN FILM,270OHM,100mW,0.5% RESISTOR,THIN FILM,30.1KOHM,100mW 0.1% RESISTOR,THIN FILM,33KOHM,100mW,0.5% RESISTOR,THIN FILM,330KOHM,100mW,0.5% RESISTOR,THIN FILM,3.6KOHM,100mW,0.1 RESISTOR,THIN FILM,390 OHM,100mW,0.5% RESISTOR,THIN FILM,3.9KOHM,100mW,0.5% RESISTOR,THIN FILM,39KOHM,100mW,0.1% RESISTOR,THIN FILM,39KOHM,100mW,0.5% RESISTOR,THIN FILM,470 OHM,100mW,0.5% RESISTOR,THIN FILM,4.7KOHM,100mW,0.5% RESISTOR,THIN FILM,4.75KOHM,100mW 0.1% RESISTOR,THIN FILM,499 OHM,100mW,0.1% RESISTOR,THIN FILM,499 OHM,100mW,0.5% RESISTOR,THIN FILM,4.99KOHM,100mW 0.5% RESISTOR,THIN FILM,49.9KOHM,100mW 0.5% RESISTOR,THIN FILM,499KOHM,100mW,0.1% RESISTOR,THIN FILM,51KOHM,100mW,0.1% RESISTOR,THIN FILM,5.49KOHM,100mW 0.1% RESISTOR,THIN FILM,560KOHM,100mW,0.5 RESISTOR,THIN FILM,6.04KOHM,100mW 0.1 RESISTOR,THIN FILM,60.4KOHM,100mW 0.1% RESISTOR,THIN FILM,62KOHM,100mW,0.1% RESISTOR,THIN FILM,64.9KOHM,100mW 0.1 RESISTOR,THIN FILM,66.5KOHM,100mW 0.1% RESISTOR,THIN FILM,680 OHM,100mW,0.5% RESISTOR,THIN FILM,6.8KOHM,100mW,0.1% RESISTOR,THIN FILM,6.8KOHM,100mW,0.5% RESISTOR,THIN FILM,750 OHM,100mW,0.1% RESISTOR,THIN FILM,7.5KOHM,100mW,0.1% RESISTOR,THIN FILM,80.6KOHM,100mW 0.1 RESISTOR,THIN FILM,8.66KOHM,100mW 0.1% RESISTOR,THIN FILM,9.1KOHM,100mW,0.1 RESISTOR,THIN FILM,10 OHM,100mW,0.5% RESISTOR,THIN FILM,20 OHM,100mW,0.5% RESISTOR,THIN FILM,47 OHM,100mW,0.5% RESISTOR,THIN FILM,51 OHM,100mW,0.5% Thin Film Chip Resistor RESISTOR,THIN FILM,39KOHM,100mW,0.1% RESISTOR,THIN FILM,160KOHM,125mW,0.1% RESISTOR,THIN FILM,300KOHM,125mW,0.1% RESISTOR,THIN FILM,5.1KOHM,125mW,0.1 RESISTOR,THIN FILM,0.1 OHM,330mW,1% RESISTOR,THIN FILM,0.27 OHM,330mW,1% RESISTOR THIN FILM,1 OHM,330mW,1% RESISTOR,THIN FILM,2.2OHM,330mW,1% RESISTOR,THIN FILM,5.6 OHM,330mW,1% RESISTOR,CUR SENSE,0.1 OHM,250mW,1% RESISTOR,CUR SENSE,0.22 OHM,250mW,1% RESISTOR,CUR SENSE,0.24OHM,250mW,1% RESISTOR,CUR SENSE,0.47 OHM,250mW,1% RESISTOR,CUR SENSE,0.68 OHM,250mW,1% RESISTOR,CURRENT SENSE,10 OHM,250mW,1% RESISTOR,CUR SENSE,0.022 OHM,250mW,2% RESISTOR,CUR SENSE,0.033 OHM,250mW,2 RESISTOR,CUR SENSE,0.047 OHM,250mW,2% RESISTOR,CUR SENSE,0.05 OHM,250mW,2% RESISTOR,CUR SENSE,0.068 OHM,250mW,2% RESISTOR,CUR SENSE,0.15 OHM,250mW,1% RESISTOR,CUR SENSE,0.03 OHM,500mW,1% RESISTOR,CUR SENSE,0.039 OHM,500mW,1% RESISTOR,CUR SENSE,0.05 OHM,500mW,1% RESISTOR,CUR SENSE,0.068 OHM,500mW,1% RESISTOR,CUR SENSE,0.082 OHM,500mW,1% RESISTOR,CUR SENSE,0.12 OHM,500mW,1% RESISTOR,CUR SENSE,0.18 OHM,500mW,1% RESISTOR,CUR SENSE,0.2 OHM,500mW,1% RESISTOR,CUR SENSE,0.56 OHM,500mW,1% RESISTOR,CUR SENSE,0.82 OHM,500mW,1% RESISTOR,CURRENT SENSE,0.01 OHM,1W,1% RESISTOR,CURRENT SENSE,0.018 OHM,1W,2% RESISTOR,CURRENT SENSE,1OHM,1W,1% RESISTOR,CURRENT SENSE,0.02 OHM,2W,1% RESISTOR,CURRENT SENSE,0.001OHM,2W,5 DIODE DE REDRESSEMENT RAPIDE 1A 1000V PONT REDRESSEUR 40A 600V DIODE ULTRA RAPIDE 1A 800V PONT REDRESSEUR 2A 200V PONT REDRESSEUR 15A 200V PONT REDRESSEUR 15A 800V PONT REDRESSEUR 25A 100V PONT REDRESSEUR 25A 200V PONT REDRESSEUR 8A 600V DIODE SCHOTTKY 3A 50V PONT REDRESSEUR 1.5A 400V PONT REDRESSEUR 1.5A 800V DIODE DE REDRESSEMENT RAPIDE 2A 800V DIODE DE SUPPRESSION SMB 600W 5.0V DIODE DE SUPPRESSION SMB 600W 7.5V DIODE DE SUPPRESSION SMB 600W 7.5V DIODE DE SUPPRESSION SMB 600W 12V DIODE DE SUPPRESSION SMB 600W 15V DIODE DE SUPPRESSION SMB 600W 15V DIODE DE SUPPRESSION SMB 600W 24V DIODE DE SUPPRESSION SMB 600W 30V DIODE DE SUPPRESSION SMB 600W 30V DIODE DE SUPPRESSION SMC 1500W 5.0V DIODE DE SUPPRESSION SMC 1500W 9.0V DIODE DE SUPPRESSION SMC 1500W 12V DIODE DE SUPPRESSION SMC 1500W 12V DIODE DE SUPPRESSION SMC 1500W 15V DIODE DE SUPPRESSION SMC 1500W 22V DIODE DE SUPPRESSION SMC 1500W 33V DIODE DE SUPPRESSION SMC 1500W 48V DIODE DE SUPPRESSION SMB 600W 5.0V DIODE DE SUPPRESSION SMB 600W 7.5V DIODE DE SUPPRESSION SMB 600W 7.5V DIODE DE SUPPRESSION SMB 600W 12V DIODE DE SUPPRESSION SMB 600W 12V DIODE DE SUPPRESSION SMB 600W 15V DIODE DE SUPPRESSION SMB 600W 15V DIODE DE SUPPRESSION SMB 600W 24V DIODE DE SUPPRESSION SMB 600W 24V DIODE DE SUPPRESSION SMB 600W 30V DIODE DE SUPPRESSION SMC 1500W 5.0V DIODE DE SUPPRESSION SMC 1500W 6.0V DIODE DE SUPPRESSION SMC 1500W 12V DIODE DE SUPPRESSION SMC 1500W 12V DIODE DE SUPPRESSION SMC 1500W 15V DIODE DE SUPPRESSION SMC 1500W 22V DIODE DE SUPPRESSION SMC 1500W 22V DIODE DE SUPPRESSION SMC 1500W 33V DIODE DE SUPPRESSION SMC 1500W 33V DIODE DE SUPPRESSION SMC 1500W 48V DIODE DE SUPPRESSION SMC 1500W 48V MICROCONTROLEUR 16 BITS DSP 20MHZ CMS MICROCONTROLEUR 16 BITS DSP 20MHZ MICROCONTROLEUR 16 BITS DSP 20MHZ CMS MICROCONTROLEUR 16 BITS DSP 20MHZ MICROCONTROLEUR 16 BITS DSP 20MHZ CMS TRANSCEIVER RS-485 CMS TRANSCEIVER RS-232 +5V CMS TRANSCEIVER RS-232 +5V CMS TRANSCEIVER RS-232 +5V CMS TRANSCEIVER RS-232 +5V CMS TRANSCEIVER RS-232 CMS DRIVER DE LIGNE RS-422 QUADRUPLE CMS TRANSCEIVER RS-485 3V CMS IC,RS422/RS485 TRANSCEIVER 3.6V NSOIC14 DRIVER/RECEPTEUR RS-232 CMS DRIVER/RECEPTEUR RS-232 CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER HORLOGE/DONEES V.11/V.35 CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER RS-232 +3.0V A +5.5V CMS TRANSCEIVER 8 CANAUX AVEC DCE/DTE CMS TRANSCEIVER RS-485 CMS TRANSCEIVER RS-485 CMS TRANSCEIVER RS-485 CMS TRANSCEIVER RS-485 CMS DRIVER DE LED POUR FLASH APP. PHOTO CMS REGULATEUR POUR LEDS BLANCHES CMS REGULATEUR ELEVATEUR 400MA CMS COFFRET ABS NOIR 74X178X122 REGULATEUR ABAISSEUR CMS CONTROLEUR ABAISSEUR HAUTE TENSION CMS SUPERVISEUR DE MICROCONTROLEUR CMS SUPERVISEUR DE MICROCONTROLEUR CMS SUPERVISEUR DE MICROCONTROLEUR CMS SUPERVISEUR DE MICROCONTROLEUR CMS COFFRET ABS BLANC 74X178X122 SUPERVISEUR DE MICROCONTROLEUR CMS SUPERVISEUR DE MICROCONTROLEUR CMS SUPERVISEUR DE MICROCONTROLEUR CMS REGULATEUR 3A LDO 1% CMS REGULATEUR 5A LDO 1% CMS JOINT POUR 938968 CAPACITOR CERAMIC 10PF 25V,C0G,5%,0201 Ceramic Multilayer Capacitor IONIZER,BENCHTOP IC,LDO VOLT REG,3A,8-SOIC Clock IC DIODE ZENER 3W BOITIER SMA 3.3V DIODE ZENER 3W BOITIER SMA 3.6V DIODE ZENER 3W BOITIER SMA 3.9V DIODE ZENER 3W BOITIER SMA 4.3V DIODE ZENER 3W BOITIER SMA 4.7V DIODE ZENER 3W BOITIER SMA 5.1V DIODE ZENER 3W BOITIER SMA 5.6V DIODE ZENER 3W BOITIER SMA 6.2V DIODE ZENER 3W BOITIER SMA 6.8V DIODE ZENER 3W BOITIER SMA 7.5V DIODE ZENER 3W BOITIER SMA 7.5V DIODE ZENER 3W BOITIER SMA 8.2V DIODE ZENER 3W BOITIER SMA 9.1V DIODE ZENER 3W BOITIER SMA 10V DIODE ZENER 3W BOITIER SMA 12V DIODE ZENER 3W BOITIER SMA 15V DIODE ZENER 3W BOITIER SMA 18V DIODE ZENER 3W BOITIER SMA 18V DIODE ZENER 3W BOITIER SMA 20V DIODE ZENER 3W BOITIER SMA 24V DIODE ZENER 3W BOITIER SMA 27V DIODE ZENER 3W BOITIER SMA 30V DIODE ZENER 3W BOITIER SMA 33V DIODE ZENER 3W BOITIER SMA 33V DIODE ZENER 3W BOITIER SMA 56V DIODE ZENER 3W BOITIER SMA 56V DIODE ZENER 3W BOITIER SMA 100V DIODE ZENER 3W BOITIER SMA 120V DIODE ZENER 3W BOITIER SMA 150V DIODE ZENER 3W BOITIER SMA 180V DIODE ZENER 3W BOITIER SMA 180V DIODE ZENER 3W BOITIER SMA 200V DIODE ZENER 3W BOITIER SMA 200V DIODE ZENER 3W BOITIER SMA 270V DIODE ZENER 3.25W 16V DIODE ZENER 3.25W 20V DIODE ZENER 3.25W 43V DIODE ZENER 3.25W 82V DIODE ZENER 3.25W 160V JEU DE 4 TOURNEVIS DE PRECISION CONNECTOR,AC POWER,PLUG,30A,250V ELECTRICAL AC POWER CONNECTOR,30A,NEMA L21-30R MULTIMETRE ANALOGIQUE METRAHIT 1A FUSIBLE FF 1.6A/700V AC MULTIMETRE ANALOGIQUE METRAPORT 3A CONVERTISSEUR RS232-USB CONTROLEUR HUMIDITE IR CONNECTEUR PROFIBUS PRG. CONNECTEUR PROFIBUS DROIT PONT REDRESSEUR 17A 200V PONT REDRESSEUR 20A 800V TRIPHASE MODULE THYRISTOR/DIODE 30A 800V MODULE THYRISTOR/DIODE 30A 1200V PONT REDRESSEUR 30A 800V TRIPHASE PONT REDRESSEUR 30A 1200V TRIPHASE BATTERIE 4.8V 1.25AH CONDENSATEUR 10PF 50V CONDENSATEUR 22PF 50V CONDENSATEUR 33PF 50V CONDENSATEUR 68PF 50V CONDENSATEUR 100PF 50V CONDENSATEUR 220PF 50V CONDENSATEUR 100PF 50V CONDENSATEUR 220PF 50V CONDENSATEUR 1.0NF 50V CONDENSATEUR 1NF 50V CONDENSATEUR 2.2NF 50V CONDENSATEUR 10NF 50V CONDENSATEUR 100NF 50V NOYAU DE FERRITE 4MM NOYAU DE FERRITE 5MM NOYAU DE FERRITE 8 MM ID NOYAU DE FERRITE 11 MM ID NOYAU DE FERRITE 16 MM ID NOYAU DE FERRITE 27 MM ID NOYAU DE FERRITE 7.2MM ID NOYAU DE FERRITE 10.5MM ID NOYAU DE FERRITE MONTAGE PANNEAU 8.2MM RESEAU DE BILLES FERRITES RESEAU DE BILLES FERRITES RESEAU DE BILLES FERRITES RESEAU DE BILLES FERRITES RESEAU DE BILLES FERRITES RESEAU DE BILLES FERRITES RESEAU DE BILLES FERRITES INDICATOR,3 PHASE RELAIS LOSS/UNDER/OVER VOLT 3PHASE RELAIS LOSS/UNDER/OVER VOLT 3PHASE RELAIS UNDER/OVER CURRENT RELAIS THERMISTANCE TOROID (CORE,BALANCE) OPTOCOUPLEUR CMS OPTOCOUPLEUR CMS CONVERTISSEUR N/A 14 BITS CMOS INTERRUPTEUR CMS DOUBLE SPST INTERRUPTEUR CMS DOUBLE SPST TRANSCEIVER RS232 3V CONVERTISSEUR N/A 12 BITS QUADRUPLE AMPLI. OP. DOUBLE RAIL/RAIL CONVERTISSEUR N/A 8 BITS QUADRUPLE 2.5V CONVERTISSEUR N/A 10 BITS QUADRUPLE 2.5V CONVERTISSEUR N/A 10 BITS CONVERTISSEUR N/A 10 BITS DOUBLE CONVERTISSEUR A/N 8 BITS CMOS CMS TRIPLE AMPLI OP. BUFFER CMS MUX 2 VOIES 380MHZ AMPLI OP PRECISION CMS SOIC8 777 TRANSCEIVER RS-232 TRANSCEIVER RS485 I/F SOIC8 485 CONVERTISSEUR N/A 8 BITS CMS FILTRE 6A MEDICAL FILTRE 2A MEDICAL FILTRE 6A MEDICAL FILTRE 2A 1 FUSIBLE + INTERRUPT. MEDICAL EMBASE IEC FILTREE FUSIBLE 6A FILTRE 2 ETAGES HAUTE PERF 10A INDICATEUR A LED ROUGE INDICATEUR A LED VERT INDICATEUR A LED VERT INDICATEUR A LED JAUNE POWER OUTLET STRIP,8 OUTLET,15A,125V POTENTIOMETRE 2K 5W POTENTIOMETRE 10K 5W POTENTIOMETRE 20K 5W POTENTIOMETRE 50K 5W POTENTIOMETRE 100K 5W POTENTIOMETRE 200K 5W POTENTIOMETRE 300K 5W RESISTANCE 1R 3W RESISTANCE 1R 5W RESISTANCE 20R 5W RESISTANCE 1K 5W RESISTANCE 2K 5W RESISTANCE 5R 10W RESISTANCE 50R 10W RESISTANCE 5R 10W RESISTANCE 100R 10W FILTRE 2A MONTAGE SUR CHASSIS FILTRE 6A MONTAGE SUR CHASSIS 2 ETAGES FILTRE 6A MONTAGE SUR CHASSIS 2 ETAGES FILTRE 3A CHASSIS MEDICAL AFFICHEUR LCD 16X2 AFFICHEUR LCD 20X4 AFFICHEUR LCD 16X2 AFFICHEUR LCD 16X2 AFFICHEUR LCD 16X2 AFFICHEUR LCD 16X2 AFFICHEUR LCD 20X2 AFFICHEUR LCD 16X2 AFFICHEUR LCD 24X2 AFFICHEUR LCD GRAPHIQUE 128X64 AFFICHEUR LCD GRAPHIQUE 128X64 TRANSCEIVER. DUPLEX ST FAST ETHERNET TRANSCEIVER. MT-RJ 2KM EXT TEMP BANANA PLUG,15A,SCREW,BLACK SCREW,8-32 X 0.21 INDICATEUR A LED JAUNE INDICATEUR A LED VERT INDICATEUR A LED AMBRE CONDENSATEUR 220UF 16V CONDENSATEUR 470UF 16V CONDENSATEUR 2200UF 16V CONDENSATEUR 10UF 25V CONDENSATEUR 100UF 25V CONDENSATEUR 220UF 25V CONDENSATEUR 470UF 25V CONDENSATEUR 1000UF 25V CONDENSATEUR 22UF 63V CONDENSATEUR 470UF 100V CONDENSATEUR 100UF 10V CONDENSATEUR 47UF 16V CONDENSATEUR 100UF 16V CONDENSATEUR 470UF 35V CONDENSATEUR 47UF 100V CONDENSATEUR 100UF 100V CONDENSATEUR 47UF 16V CONDENSATEUR 10UF 25V CONDENSATEUR 33UF 25V CONDENSATEUR 10UF 25V CONDENSATEUR 47UF 6.3V CONDENSATEUR 220UF 6.3V CONDENSATEUR 330UF 6.3V CONDENSATEUR 47UF 16V CONDENSATEUR 100UF 16V CONDENSATEUR 22UF 50V CONDENSATEUR 4700UF 25V CONDENSATEUR 6800UF 25V CONDENSATEUR 10000UF 25V CONDENSATEUR 15000UF 25V CONDENSATEUR 10000UF 35V CONDENSATEUR 470UF 400V CAN 12 BITS 4 CANAUX 1MSPS CMS TESTEUR LAN TESTEUR LAN + CERTIFICATION P CH MOSFET SCHOTTKY RECTIFIER,5A,80V,DO - 204AR IC,OP-AMP,1MHZ,0.1V/ us,SOIC-8 CAPACITOR CERAMIC 0.022UF 1000V,X7R,10%,1812 INDUCTOR,SHIELDED,22UH,730MA,SMD RESISTOR,WIREWOUND,100 OHM,100W,10% RESISTOR,WIREWOUND,10 OHM,100W,10% RESISTOR,WIREWOUND,100 OHM,225W,10% RESISTOR,WIREWOUND,10 OHM,225W,10% RESISTOR WIREWOUND,1 OHM,225W,10% RESISTOR,WIREWOUND,500 OHM,225W,10% RESISTOR,WIREWOUND,50 OHM,225W,10% RESISTOR,WIREWOUND,20 OHM,300W,10% RESISTOR,WIREWOUND,0.1 OHM,300W,10% RESISTOR,WIREWOUND,0.5 OHM,300W,10% RESISTOR,WIREWOUND,10 OHM,25W,5% RESISTOR,WIREWOUND,25 OHM,25W,5% RESISTOR,WIREWOUND,50 OHM,25W,5% RESISTOR,WIREWOUND,5 OHM,25W,5% RESISTOR WIREWOUND,100 OHM,25W,5% Power Resistor RESISTOR,WIREWOUND,1 OHM,50W,5% RESISTOR,WIREWOUND,5 OHM,50W,5% RESISTOR,WIREWOUND,10 OHM,50W,5% RESISTOR,WIREWOUND,25 OHM,50W,5% RESISTOR,WIREWOUND,50 OHM,50W,5% RESISTOR WIREWOUND,100 OHM,50W,5% RESISTOR,WIREWOUND,1KOHM,50W,5% RESISTOR,WIREWOUND,1 OHM,100W,5% RESISTOR,WIREWOUND,2 OHM,100W,5% RESISTOR,WIREWOUND,5 OHM,100W,5% RESISTOR WIREWOUND,10 OHM,100W,5% RESISTOR WIREWOUND,25 OHM,100W,5% RESISTOR WIREWOUND,50 OHM,100W,5% RESISTOR,WIREWOUND,150 OHM,100W,5% RESISTOR,WIREWOUND,1 OHM,225W,5% RESISTOR WIREWOUND,25 OHM,225W,5% RESISTOR,WIREWOUND,250 OHM,225W,5% RESISTOR,WIREWOUND,500 OHM,225W,5% RESISTOR WIREWOUND,1KOHM,225W,5% RESISTOR,WIREWOUND,100KOHM,225W,5% MOUNTING BRACKET,WIREWOUND RES MOUNTING BRACKET,WIREWOUND RES MOUNTING BRACKET,WIREWOUND RES RESISTOR,POWER,0.1 OHM,10W,1% RESISTOR,POWER,100 OHM,10W,1% RESISTOR,POWER,10 OHM,10W,1% RESISTOR,POWER,1 OHM,10W,1% RESISTOR,POWER,300OHM,10W,1% RESISTOR,POWER,0.1 OHM,50W,1% RESISTOR,POWER,0.15 OHM,50W,1% RESISTOR,POWER,0.2 OHM,50W,1% RESISTOR,POWER,0.3 OHM,50W,1% RESISTOR,POWER,0.5 OHM,50W,1% RESISTOR,POWER,100 OHM,50W,1% RESISTOR,POWER,10 OHM,50W,1% RESISTOR,POWER,2.5 OHM,50W,1% RESISTOR,POWER,2 OHM,50W,1% RESISTOR,POWER,250 OHM,50W,1% RESISTOR,POWER,25 OHM,50W,1% RESISTOR,POWER,300 OHM,50W,1% RESISTOR,POWER,500 OHM,50W,1% RESISTOR,POWER,50 OHM,50W,1% RESISTOR,POWER,5 OHM,50W,1% INDUCTOR,SHIELDED,4.7UH,9.71A,SMD INDUCTOR,SHIELDED,1UH,9.5A,SMD INDUCTOR,SHIELDED,3.3UH,5.5A,SMD INDUCTOR,UN-SHIELDED,1UH,9.9A,SMD INDUCTOR,UN-SHIELDED,10UH,1.16A,SMD INDUCTOR,SHIELDED,2.3UH,16.7A,SMD FASTENERS,SELF TAPPING SCREWS INDUCTOR,SHIELDED,10UH,818MA,SMD INDUCTOR,SHIELDED,2UH,6.9A,SMD END PLATE SWITCH,DIP,10 POS,SPST,RAISED ROCKER WIRE-BOARD CONNECTOR,HEADER,8POS,2MM CAPACITOR CERAMIC 1500PF,50V,X7R,10%,RAD SPEAKER,50MM,8OHM,100mW TESTER,VOLT/CONT,DUSPOL EXPERT TESTER,CONTINUITY,DUTEST TESTER CASE CLAMP METER,BENNING CM 7 MULTIMETER,DIGITAL,BENNING MM 11 RESISTANCE MRS25 1% 100K RESISTANCE MRS25 1% 100R RESISTANCE MRS25 1% 107R RESISTANCE MRS25 1% 10K RESISTANCE MRS25 1% 10K2 RESISTANCE MRS25 1% 10M RESISTANCE MRS25 1% 10R RESISTANCE MRS25 1% 118K RESISTANCE MRS25 1% 14R RESISTANCE MRS25 1% 15K RESISTANCE MRS25 1% 165K RESISTANCE MRS25 1% 16K RESISTANCE MRS25 1% 18K RESISTANCE MRS25 1% 19R1 RESISTANCE MRS25 1% 19R6 RESISTANCE MRS25 1% 1K RESISTANCE MRS25 1% 1K2 RESISTANCE MRS25 1% 1K21 RESISTANCE MRS25 1% 1K5 RESISTANCE MRS25 1% 1K8 RESISTANCE MRS25 1% 1M RESISTANCE MRS25 1% 1M6 RESISTANCE MRS25 1% 1R0 RESISTANCE MRS25 1% 1R02 RESISTANCE MRS25 1% 1R37 RESISTANCE MRS25 1% 1R43 RESISTANCE MRS25 1% 1R54 RESISTANCE MRS25 1% 1R82 RESISTANCE MRS25 1% 1R91 RESISTANCE MRS25 1% 200K RESISTANCE MRS25 1% 20K RESISTANCE MRS25 1% 22K RESISTANCE MRS25 1% 232R RESISTANCE MRS25 1% 23K7 RESISTANCE MRS25 1% 23R2 RESISTANCE MRS25 1% 23R7 RESISTANCE MRS25 1% 240R RESISTANCE MRS25 1% 249K RESISTANCE MRS25 1% 24K RESISTANCE MRS25 1% 26R7 RESISTANCE MRS25 1% 27K4 RESISTANCE MRS25 1% 29R4 RESISTANCE MRS25 1% 2K RESISTANCE MRS25 1% 2K15 RESISTANCE MRS25 1% 2K2 RESISTANCE MRS25 1% 2K21 RESISTANCE MRS25 1% 2K32 RESISTANCE MRS25 1% 2K61 RESISTANCE MRS25 1% 2K7 RESISTANCE MRS25 1% 2M2 RESISTANCE MRS25 1% 2R10 RESISTANCE MRS25 1% 2R32 RESISTANCE MRS25 1% 2R55 RESISTANCE MRS25 1% 2R67 RESISTANCE MRS25 1% 2R94 RESISTANCE MRS25 1% 309R RESISTANCE MRS25 1% 30K RESISTANCE MRS25 1% 316K RESISTANCE MRS25 1% 332R RESISTANCE MRS25 1% 33K RESISTANCE MRS25 1% 33K2 RESISTANCE MRS25 1% 3K3 RESISTANCE MRS25 1% 3K32 RESISTANCE MRS25 1% 3K74 RESISTANCE MRS25 1% 3K9 RESISTANCE MRS25 1% 3K92 RESISTANCE MRS25 1% 3M6 RESISTANCE MRS25 1% 3R57 RESISTANCE MRS25 1% 3R6 RESISTANCE MRS25 1% 3R83 RESISTANCE MRS25 1% 412R RESISTANCE MRS25 1% 422K RESISTANCE MRS25 1% 43R RESISTANCE MRS25 1% 453K RESISTANCE MRS25 1% 470R RESISTANCE MRS25 1% 475R RESISTANCE MRS25 1% 47R RESISTANCE MRS25 1% 487K RESISTANCE MRS25 1% 487R RESISTANCE MRS25 1% 48R7 RESISTANCE MRS25 1% 49R9 RESISTANCE MRS25 1% 4K12 RESISTANCE MRS25 1% 4K53 RESISTANCE MRS25 1% 4K7 RESISTANCE MRS25 1% 4M7 RESISTANCE MRS25 1% 4R22 RESISTANCE MRS25 1% 51K RESISTANCE MRS25 1% 51R1 RESISTANCE MRS25 1% 536K RESISTANCE MRS25 1% 576K RESISTANCE MRS25 1% 590K RESISTANCE MRS25 1% 5K1 RESISTANCE MRS25 1% 5K23 RESISTANCE MRS25 1% 5R36 RESISTANCE MRS25 1% 60R4 RESISTANCE MRS25 1% 62R RESISTANCE MRS25 1% 649K RESISTANCE MRS25 1% 681K RESISTANCE MRS25 1% 6K2 RESISTANCE MRS25 1% 6M2 RESISTANCE MRS25 1% 6R19 RESISTANCE MRS25 1% 73R2 RESISTANCE MRS25 1% 768K RESISTANCE MRS25 1% 787K RESISTANCE MRS25 1% 7K5 RESISTANCE MRS25 1% 7K68 RESISTANCE MRS25 1% 7R15 RESISTANCE MRS25 1% 7R87 RESISTANCE MRS25 1% 806K RESISTANCE MRS25 1% 825R RESISTANCE MRS25 1% 82R RESISTANCE MRS25 1% 845K RESISTANCE MRS25 1% 8K2 RESISTANCE MRS25 1% 931R RESISTANCE MRS25 1% 953K RESISTANCE MRS25 1% 95K3 RESISTANCE MRS25 1% 976K RESISTANCE MRS25 1% 97R6 RESISTANCE MRS25 1% 9K1 RESISTANCE MRS25 1% 9R09 INTERRUPTEUR DIL R/A 4 VOIES INTERRUPTEUR DIL R/A 6 VOIES INTERRUPTEUR DIL R/A 8 VOIES INTERRUPTEUR DIL 4 VOIES INTERRUPTEUR DIL 6 VOIES INTERRUPTEUR DIL 8 VOIES INTERRUPTEUR DIL 4 VOIES INTERRUPTEUR DIL 6 VOIES INTERRUPTEUR DIL 8 VOIES TACTILE COMMUTATEUR 7.3MM X 3.8 SQ 160G TACTILE COMMUTATEUR 4.3MM 160G TACTILE COMMUTATEUR 7.3MM X 3.8 SQ 260G TACTILE COMMUTATEUR 4.3MM 260G INTERRUPTEUR TACT 4.3MM 100G INTERRUPTEUR TACT 4.3MM 160G INTERRUPTEUR TACT 4.3MM 260G INTERRUPTEUR TACT 5.0MM 160G TACTILE COMMUTATEUR 5MM 260G TACTILE COMMUTATEUR 7MM 100G INTERRUPTEUR TACT 7.0MM 160G TACTILE COMMUTATEUR 7MM 260G INTERRUPTEUR TACT 9.5MM 160G TACTILE COMMUTATEUR 9.5MM 260G TACTILE COMMUTATEUR WASHABLE 3.8MM INTERRUPTEUR TACT ANGLE DROIT 8.35 100G INTERRUPTEUR TACT ANGLE DROIT 8.35 160G INTERRUPTEUR TACT ANGLE DROIT 3.85 100G INTERRUPTEUR TACT ANGLE DROIT 3.85 160G TACTILE COMMUTATEUR R/A 3.85MM 260G TACTILE COMMUTATEUR WASHABLE 2.3MM 160G TACTILE COMMUTATEUR WASHABLE 2.3MM 160G TACTILE COMMUTATEUR WASHABLE 3.1MM 160G TACTILE COMMUTATEUR WASHABLE 3.1MM 160G TACTILE COMMUTATEUR SPNO CMS TACTILE COMMUTATEUR SPNO CMS 50MA TACTILE COMMUTATEUR SPNO CMS 50MA TACTILE COMMUTATEUR SPNO CMS COMMUTATEUR SIP 6VOIES COMMUTATEUR LATERAL PUSH SMT INTERRUPTEUR DIL CMS 2 VOIES INTERRUPTEUR DIL CMS 4 VOIES INTERRUPTEUR DIL CMS 4 VOIES INTERRUPTEUR DIL CMS 6 VOIES INTERRUPTEUR DIL CMS 6 VOIES INTERRUPTEUR DIL CMS 8 VOIES INTERRUPTEUR DIL CMS 8 VOIES INTERRUPTEUR DIL CMS 10 VOIES INTERRUPTEUR DIL CMS 10 VOIES COMMUTATEUR DIL 1/2 PITCH CMS 8VOIES COMMUTATEUR DIL 1/2 PITCH CMS 8VOIES INTERRUPTEUR DIL 2 VOIES INTERRUPTEUR DIL 10 VOIES INTERRUPTEUR DIL 12 VOIES INTERRUPTEUR DIL 2 VOIES INTERRUPTEUR DIL 4 VOIES INTERRUPTEUR CI SPDT VERT. INTERRUPTEUR CI SPDT HORIZ. INTERRUPTEUR CI DPDT VERT. INTERRUPTEUR CI SPDT VERT. INTERRUPTEUR CI SPDT VERT. INTERRUPTEUR CI SPDT VERT. INTERRUPTEUR CI SPDT HORIZ. INTERRUPTEUR CI SPDT HORIZ. INTERRUPTEUR CI SPDT VERT. INTERRUPTEUR CI SPDT VERT. INTERRUPTEUR CI SPDT VERT. INTERRUPTEUR CI SPDT HORIZ. INTERRUPTEUR CI DPDT HORIZ. INTERRUPTEUR CI SPDT HORIZ. INTERRUPTEUR CI SPDT HORIZ. INTERRUPTEUR CI SPDT HORIZ. INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR 3PDT INTERRUPTEUR 4PDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR DPDT INTERRUPTEUR DPDT INTERRUPTEUR 3PDT INTERRUPTEUR 4PDT INTERRUPTEUR SPDT INTERRUPTEUR DPDT CORPS DE COMMUTATEUR SPDT CORPS DE COMMUTATEUR SPDT CORPS DE COMMUTATEUR SPDT CORPS DE COMMUTATEUR DPDT CORPS DE COMMUTATEUR DPDT RESISTANCE FUSIBLE 10K RESISTANCE FUSIBLE 22R RESISTANCE FUSIBLE 47R RESISTANCE FUSIBLE 4R7 RESISTANCE 0.5W 5% 18R RESISTANCE 0.5W 5% 1K RESISTANCE 0.5W 5% 1R8 RESISTANCE 0.5W 5% 330R RESISTANCE 0.5W 5% 390K RESISTANCE 0.5W 5% 39R RESISTANCE 0.5W 5% 5R6 RESISTANCE 0.5W 5% 680K RESISTANCE 0.5W 5% 820K RESISTANCE 0.4W 5% 10K RESISTANCE 0.4W 5% 10M RESISTANCE 0.4W 5% 120R RESISTANCE 0.4W 5% 180K RESISTANCE 0.4W 5% 1K RESISTANCE 0.4W 5% 1M RESISTANCE 0.4W 5% 1R2 RESISTANCE 0.4W 5% 1R5 RESISTANCE 0.4W 5% 2K2 RESISTANCE 0.4W 5% 2K7 RESISTANCE 0.4W 5% 39R RESISTANCE 0.4W 5% 3K3 RESISTANCE 0.4W 5% 3M3 RESISTANCE 0.4W 5% 3R3 RESISTANCE 0.4W 5% 3R9 RESISTANCE 0.4W 5% 4K7 RESISTANCE 0.4W 5% 6K8 RESISTANCE 0.4W 5% 6M8 RESISTANCE 0.4W 5% 6R8 RESISTANCE 0.4W 5% 820R RESISTANCE 4M7 RESISTANCE 6M8 RESISTANCE 1M8 RESISTANCE 3M9 RESISTANCE 5M6 INTERRUPTEUR DIL 8 VOIES INTERRUPTEUR DIL 12 VOIES INTERRUPTEUR DIL CMS 4 VOIES INTERRUPTEUR DIL CMS 10 VOIES INTERRUPTEUR DIL BASCULE 4 VOIES INTERFACE INFARROUGE JEU DE CORDONS DE TEST ETUI DE PROTECTION THERMOMETRE INFRAROUGE CALIBRATEUR ATEX RELAIS CI DPCO 5VCC RELAIS CI DPCO 9VCC RELAIS CI DPCO 12VCC RELAIS CI DPCO 24VCC RELAIS CI SPCO 5VCC RELAIS CI SPCO 9VCC RELAIS CI SPCO 12VCC RELAIS CI SPCO 24VCC RELAIS CI SPCO 5VCC RELAIS CI SPCO 9VCC RELAIS CI SPCO 12VCC RELAIS CI SPCO 24VCC RELAIS CI SPCO 5VCC RELAIS CI SPCO 12DC RELAIS CI SPCO 24VCC RELAIS CI SPCO 5VCC RELAIS CI SPCO 12VCC RELAIS CI SPCO 24VCC RELAIS CI SPCO 5VCC RELAIS CI SPCO 12VCC RELAIS CI DPCO 5VCC RELAIS CI DPCO 9VCC RELAIS CI DPCO 24VCC RELAIS CI SPCO 5VCC RELAIS CI SPCO 12VCC RELAIS CI SPCO 24VCC RELAIS CI SPCO 5VCC RELAIS CI SPCO 12VCC RELAIS CI SPCO 24VCC PICKUP TOOL,TELESCOPIC,MAGNETIC,LED REGULATEUR A DECOUPAGE 3A AJUSTABLE REGULATEUR 3A 12V REGULATEUR A DECOUPAGE 3A 5V REGULATEUR 3A 12V DRIVER DE LIGNE LVDS QUADRUPLE CMS RECEPTEUR DE LIGNE LVDS QUADRUPLE CMS AMPLIFICATEUR OP DOUBLE CMOS AMPLI. OP. QUAD CMOS REFERENCE DE TENSION BASSE PUISSAN. 4.1V REGULATEUR STEP-DOWN CMS 3A REGULATEUR STEP-DOWN CMS 5A REGULATEUR A DECOUPAGE 1A 12V REGULATEUR A DECOUPAGE AJUSTABLE.1A AMPLIFICATEUR AUDIO 0.75W REGULATEUR CMS ULTRA LDO +3.3V REGULATEUR CMS ULTRA LDO +2.5V CAPTEUR DE TEMP. CMS CONVERTISSEUR N/A 16 BITS CMS CONVERTISSEUR N/A 12 BITS CMS CONVERTISSEUR N/A 12 BITS CMS AMPLIFICATEUR OP QUADRUPLE CMS DRIVER DE LIGNE TRANSCEIVER DE BUS COMPARATEUR DE TENSION DIP8 311 TESTER,PAT FLUKE 6200 TESTER,PAT FLUKE 6500,UK PAT TESTER KIT,FLUKE 6500KIT ADAPTATEUR TA700 ETIQUETTES PASS ETIQUETTES PASS MULTIMETRE/TESTEUR D´ISOLEMENT MULTIMETRE/TESTEUR D´ISOLEMENT COMPARATEUR RAPIDE COMPARATEUR CMS QUAD CONVERTISSEUR FREQUENCE /TENSION DRIVER DE LIGNE RS232 QUADRUPLE CMS RECEPTEUR DE LIGNE RS232 QUADRUPLE CMS RECEPTEUR DE LIGNE RS232 QUADRUPLE CMS REGULATEUR A DECOUPAGE SEPARATEUR DE SYNCHRO VIDEO 1881 DIP8 REFERENCE DE TENSION BASSE PUISSAN. 1.2V REGULATEUR AJUSTABLE +3/24V REGULATEUR AJUST +1.2/37V TO-220-3 317 REG TENSION AJUS +1.2/37V TO-220-3 317 REGULATEUR 1A REGULATEUR LDO +5.0V 2931 TO-92-3 REGULATEUR A DECOUPAGE 2A REGULATEUR A DECOUPAGE 2A CIRCUIT CAPTEUR DE TEMPERATURE 2.7V REGULATEUR STEP-DOWN 5A REGULATEUR STEP DOWN 1A CMS REGULATEUR STEP-DOWN CMS 1A CONTROLEUR DE MOUVEMENT CMS CIRCUIT UART DOUBLE AVEC FIFO CMS AMPLIFICATEUR DOUBLE 250M LN CMS REGULATEUR LDO +5.0V 2940 TO-220-3 REGULATEUR +6.2V REGULATEUR LDO +8.0V REGULATEUR -12V UART CMOS AVEC FIFO AMPLI DE PUISSANCE AUDIO 1W AMPLIFICATEUR 120W MONO - 60W STEREO TRANSCEIVER DE BUS TRANSCEIVER DE BUS TRANSCEIVER DE BUS EMBASE CMS ENTREE SUP. 4 VOIES EMBASE CMS ENTREE SUP. 6VOIES EMBASE SMT 0.8MM 4 VOIES EMBASE SMT 0.8MM 14 VOIES EMBASE VERTICAL CI 4 VOIES EMBASE ENTREE SUP. 5 VOIES EMBASE ENTREE SUP. 6 VOIES EMBASE CMS ENTREE SUP. 2 VOIES EMBASE CMS ENTREE LATERALE 2 VOIES EMBASE CMS ENTREE LATERALE 2 VOIES EMBASE CMS ENTREE LATERALE 3VOIES EMBASE CMS ENTREE LATERALE 3VOIES EMBASE CMS ENTREE LATERALE 5VOIES EMBASE CMS ENTREE LATERALE 6VOIES AMPLI OP DOUBLE CMOS CMS SOIC8 662 REGULATEUR LDO +3.0V REGULATEUR LDO +9.0V REGULATEUR LDO +10V REGULATEUR A DECOUPAGE 5A 5V REGULATEUR A DECOUPAGE 0.5A AJUSTABLE REGULATEUR A DECOUPAGE 0.5A AJUSTABLE REGULATEUR A DECOUPAGE CMS 5A 5V REGULATEUR A DECOUPAGE 0.5A 5V DRIVER D´AFFICHEUR LCD CMS REGULATEUR A DECOUPAGE 1A 5V REGULATEUR A DECOUPAGE 1A 3.3V LINE DRIVER QUAD RS485/RS422,96174 DRIVER DE LIGNE RS485 CMS REGULATEUR A DECOUPAGE 3A AJUSTABLE REGULATEUR A DECOUPAGE 3A 5V COMPARATEUR ENTREE RAIL TO RAIL CMS THERMOSTAT DOUBLE O/P CMS CONVERTISSEUR DC/DC CMS REGULATEUR AJUS SHUNT +3/36V CMS CONVERTISSEUR A/N 16 BITS DOUBLE CMS REGULATEUR A DECOUPAGE 1A 3.3V REGULATEUR 3A 12V REGULATEUR A DECOUPAGE CMS 0.5A 3.3V REGULATEUR A DECOUPAGE CMS 0.5A 5V REGULATEUR A DECOUPAGE 0.5A AJUSTABLE CONVERTISSEUR DC/DC CMS AMPLI. OP. QUAD MICROPOWER AMPLIFICATEUR OP CMS CMOS AMPLIFICATEUR OP CMS DOUBLE CMOS AMPLIFICATEUR OP DOUBLE CMOS COMPARATEUR CMS DOUBLE CMOS R/R COMPARATEUR ENTREE RAIL TO RAIL CMS RESISTANCE 3W 5% 0R015 RESISTANCE 3W 5% 0R018 RESISTANCE 3W 5% 0R039 RESISTANCE 3W 5% 0R056 RESISTANCE 3W 5% 0R18 RESISTANCE 0.75W 1% 15K RESISTANCE 0.75W 1% 180K RESISTANCE 0.75W 1% 18K RESISTANCE 0.75W 1% 270K RESISTANCE 0.75W 1% 27R RESISTANCE 0.75W 1% 33K RESISTANCE 0.75W 1% 39R RESISTANCE 0.75W 1% 470R RESISTANCE 0.75W 1% 560K RESISTANCE 0.75W 1% 68K RESISTANCE 0.75W 1% 6K8 RESISTANCE 0.75W 1% 820K RESISTANCE 0.75W 1% 820R RESISTANCE 0.75W 1% 82K RESISTANCE 0.75W 1% 82R RESISTANCE 0.75W 1% 8K2 RESISTANCE 0.25W 0.1% 102K RESISTANCE 0.25W 0.1% 102R RESISTANCE 0.25W 0.1% 105K RESISTANCE 0.25W 0.1% 105R RESISTANCE 0.25W 0.1% 107K RESISTANCE 0.25W 0.1% 10K5 RESISTANCE 0.25W 0.1% 110K RESISTANCE 0.25W 0.1% 110R RESISTANCE 0.25W 0.1% 113R RESISTANCE 0.25W 0.1% 115R RESISTANCE 0.25W 0.1% 118R RESISTANCE 0.25W 0.1% 11K RESISTANCE 0.25W 0.1% 11K3 RESISTANCE 0.25W 0.1% 11K5 RESISTANCE 0.25W 0.1% 121K RESISTANCE 0.25W 0.1% 121R RESISTANCE 0.25W 0.1% 124K RESISTANCE 0.25W 0.1% 127K RESISTANCE 0.25W 0.1% 12K4 RESISTANCE 0.25W 0.1% 12K7 RESISTANCE 0.25W 0.1% 130K RESISTANCE 0.25W 0.1% 133K RESISTANCE 0.25W 0.1% 137K RESISTANCE 0.25W 0.1% 13K RESISTANCE 0.25W 0.1% 143R RESISTANCE 0.25W 0.1% 147K RESISTANCE 0.25W 0.1% 147R RESISTANCE 0.25W 0.1% 14K3 RESISTANCE 0.25W 0.1% 154R RESISTANCE 0.25W 0.1% 15K4 RESISTANCE 0.25W 0.1% 15K8 RESISTANCE 0.25W 0.1% 162K RESISTANCE 0.25W 0.1% 169K RESISTANCE 0.25W 0.1% 16K5 RESISTANCE 0.25W 0.1% 16K9 RESISTANCE 0.25W 0.1% 174K RESISTANCE 0.25W 0.1% 178R RESISTANCE 0.25W 0.1% 17K4 RESISTANCE 0.25W 0.1% 182K RESISTANCE 0.25W 0.1% 182R RESISTANCE 0.25W 0.1% 187K RESISTANCE 0.25W 0.1% 187R RESISTANCE 0.25W 0.1% 18K2 RESISTANCE 0.25W 0.1% 191K RESISTANCE 0.25W 0.1% 196K RESISTANCE 0.25W 0.1% 1K07 RESISTANCE 0.25W 0.1% 1K15 RESISTANCE 0.25W 0.1% 1K18 RESISTANCE 0.25W 0.1% 1K24 RESISTANCE 0.25W 0.1% 1K27 RESISTANCE 0.25W 0.1% 1K3 RESISTANCE 0.25W 0.1% 1K33 RESISTANCE 0.25W 0.1% 1K37 RESISTANCE 0.25W 0.1% 1K47 RESISTANCE 0.25W 0.1% 1K58 RESISTANCE 0.25W 0.1% 1K65 RESISTANCE 0.25W 0.1% 1K74 RESISTANCE 0.25W 0.1% 1K91 RESISTANCE 0.25W 0.1% 1K96 RESISTANCE 0.25W 0.1% 205R RESISTANCE 0.25W 0.1% 20K5 RESISTANCE 0.25W 0.1% 210K RESISTANCE 0.25W 0.1% 21K RESISTANCE 0.25W 0.1% 21K5 RESISTANCE 0.25W 0.1% 232K RESISTANCE 0.25W 0.1% 237K RESISTANCE 0.25W 0.1% 23K2 RESISTANCE 0.25W 0.1% 243K RESISTANCE 0.25W 0.1% 243R RESISTANCE 0.25W 0.1% 249K RESISTANCE 0.25W 0.1% 24K3 RESISTANCE 0.25W 0.1% 261R RESISTANCE 0.25W 0.1% 267R RESISTANCE 0.25W 0.1% 26K7 RESISTANCE 0.25W 0.1% 280R RESISTANCE 0.25W 0.1% 287R RESISTANCE 0.25W 0.1% 28K7 RESISTANCE 0.25W 0.1% 29K4 RESISTANCE 0.25W 0.1% 2K1 RESISTANCE 0.25W 0.1% 2K26 RESISTANCE 0.25W 0.1% 2K32 RESISTANCE 0.25W 0.1% 2K37 RESISTANCE 0.25W 0.1% 2K61 RESISTANCE 0.25W 0.1% 2K67 RESISTANCE 0.25W 0.1% 2K74 RESISTANCE 0.25W 0.1% 2K87 RESISTANCE 0.25W 0.1% 2K94 RESISTANCE 0.25W 0.1% 301R RESISTANCE 0.25W 0.1% 309R RESISTANCE 0.25W 0.1% 30K9 RESISTANCE 0.25W 0.1% 316R RESISTANCE 0.25W 0.1% 34K RESISTANCE 0.25W 0.1% 34K8 RESISTANCE 0.25W 0.1% 35K7 RESISTANCE 0.25W 0.1% 365R RESISTANCE 0.25W 0.1% 374R RESISTANCE 0.25W 0.1% 3K09 RESISTANCE 0.25W 0.1% 3K16 RESISTANCE 0.25W 0.1% 3K24 RESISTANCE 0.25W 0.1% 3K48 RESISTANCE 0.25W 0.1% 3K57 RESISTANCE 0.25W 0.1% 41K2 RESISTANCE 0.25W 0.1% 422R RESISTANCE 0.25W 0.1% 43K2 RESISTANCE 0.25W 0.1% 442R RESISTANCE 0.25W 0.1% 45K3 RESISTANCE 0.25W 0.1% 464R RESISTANCE 0.25W 0.1% 46K4 RESISTANCE 0.25W 0.1% 475R RESISTANCE 0.25W 0.1% 487R RESISTANCE 0.25W 0.1% 4K12 RESISTANCE 0.25W 0.1% 4K22 RESISTANCE 0.25W 0.1% 4K42 RESISTANCE 0.25W 0.1% 52K3 RESISTANCE 0.25W 0.1% 536R RESISTANCE 0.25W 0.1% 53K6 RESISTANCE 0.25W 0.1% 54K9 RESISTANCE 0.25W 0.1% 562R RESISTANCE 0.25W 0.1% 576R RESISTANCE 0.25W 0.1% 57K6 RESISTANCE 0.25W 0.1% 5K23 RESISTANCE 0.25W 0.1% 5K36 RESISTANCE 0.25W 0.1% 5K76 RESISTANCE 0.25W 0.1% 5K9 RESISTANCE 0.25W 0.1% 60K4 RESISTANCE 0.25W 0.1% 619R RESISTANCE 0.25W 0.1% 634R RESISTANCE 0.25W 0.1% 63K4 RESISTANCE 0.25W 0.1% 649R RESISTANCE 0.25W 0.1% 64K9 RESISTANCE 0.25W 0.1% 68K1 RESISTANCE 0.25W 0.1% 698R RESISTANCE 0.25W 0.1% 69K8 RESISTANCE 0.25W 0.1% 6K04 RESISTANCE 0.25W 0.1% 6K49 RESISTANCE 0.25W 0.1% 6K65 RESISTANCE 0.25W 0.1% 715R RESISTANCE 0.25W 0.1% 73K2 RESISTANCE 0.25W 0.1% 76K8 RESISTANCE 0.25W 0.1% 78K7 RESISTANCE 0.25W 0.1% 7K15 RESISTANCE 0.25W 0.1% 806R RESISTANCE 0.25W 0.1% 845R RESISTANCE 0.25W 0.1% 84K5 RESISTANCE 0.25W 0.1% 866R RESISTANCE 0.25W 0.1% 887R RESISTANCE 0.25W 0.1% 8K45 RESISTANCE 0.25W 0.1% 8K66 RESISTANCE 0.25W 0.1% 8K87 RESISTANCE 0.25W 0.1% 90K9 RESISTANCE 0.25W 0.1% 931R RESISTANCE 0.25W 0.1% 93K1 RESISTANCE 0.25W 0.1% 953R RESISTANCE 0.25W 0.1% 95K3 RESISTANCE 0.25W 0.1% 976R RESISTANCE 0.25W 0.1% 97K6 RESISTANCE 0.25W 0.1% 9K31 RESISTANCE 0.25W 0.1% 9K53 RESISTANCE 0.25W 0.1% 267K RESISTANCE 0.25W 0.1% 332K RESISTANCE 0.25W 0.1% 357K RESISTANCE 0.25W 0.1% 392K RESISTANCE 0.25W 0.1% 475K RESISTANCE 0.25W 0.1% 562K RESISTANCE 0.25W 0.1% 59R0 RESISTANCE 0.25W 0.1% 619K RESISTANCE 0.25W 0.1% 681K RESISTANCE 0.25W 0.1% 68R1 RESISTANCE 0.25W 0.1% 71R5 RESISTANCE 0.25W 0.1% 750K RESISTANCE 0.25W 0.1% 82R5 RESISTANCE 0.25W 0.1% 909K RESISTANCE 0.25W 0.1% 95R3 RESISTANCE 3W 5% 0R12 RESISTANCE 3W 5% 0R51 RESISTANCE 3W 5% 12R RESISTANCE 3W 5% 43R RESISTANCE 3W 5% 47R RESISTANCE 3W 5% 510R RESISTANCE 3W 5% 5R RESISTANCE 3W 5% 6R8 RESISTANCE 3W 5% 8R2 RESISTANCE 7W 5% 12R RESISTANCE 7W 5% 18K RESISTANCE 7W 5% 1R8 RESISTANCE 7W 5% 2K RESISTANCE 7W 5% 2K4 RESISTANCE 7W 5% 2R RESISTANCE 7W 5% 39R RESISTANCE 7W 5% 5K1 RESISTANCE 7W 5% 91R RESISTANCE 10W 5% 2K2 RESISTANCE 10W 5% 33K RESISTANCE 14W 5% 22K RESISTANCE 14W 5% 1R5 RESISTANCE 14W 5% 680R RESISTANCE 3W 5% 12R RESISTANCE 3W 5% 180R RESISTANCE 3W 5% 1R2 RESISTANCE 3W 5% 1R5 RESISTANCE 3W 5% 2K2 RESISTANCE 3W 5% 47R RESISTANCE 3W 5% 820R RESISTANCE 3W 5% 82R RESISTANCE 15W 5% 0R2 RESISTANCE 15W 5% 0R5 RESISTANCE 15W 5% 2R2 RESISTANCE 25W 5% 0R1 RESISTANCE 25W 5% 0R15 RESISTANCE 25W 5% 0R22 RESISTANCE 25W 5% 0R27 RESISTANCE 25W 5% 0R47 RESISTANCE 25W 5% 10K RESISTANCE 25W 5% 10R RESISTANCE 25W 5% 470R RESISTANCE 25W 5% 4R7 RESISTANCE 25W 5% 560R RESISTANCE 25W 5% 5R RESISTANCE 25W 5% 680R RESISTANCE 25W 5% 6R8 RESISTANCE 25W 5% 8K2 RESISTANCE 10W 5% 150R RESISTANCE 10W 5% 220R RESISTANCE 10W 5% 2K2 RESISTANCE 10W 5% 2R7 RESISTANCE 10W 5% 3R3 RESISTANCE 10W 5% 43R RESISTANCE 10W 5% 50R RESISTANCE 10W 5% 0R33 RESISTANCE 50W 5% 0R47 RESISTANCE 50W 5% 16K RESISTANCE 50W 5% 1R RESISTANCE 50W 5% 27R RESISTANCE 50W 5% 3K9 RESISTANCE 50W 5% 3R3 RESISTANCE 50W 5% 47R RESISTANCE 50W 5% 5R6 RESISTANCE 50W 5% 620R RESISTANCE 50W 5% R05 RESISTANCE 50W 5% R22 RESISTANCE 50W 5% R33 RESISTANCE 50W 5% R68 QUARTZ 3.276800MHZ QUARTZ 8.192000MHZ QUARTZ 14.000000MHZ QUARTZ 7.372800MHZ QUARTZ 4.915200MHZ QUARTZ 3.579545MHZ QUARTZ 6MHZ QUARTZ 12.288000MHZ QUARTZ 14.318180MHZ QUARTZ 24.000000MHZ QUARTZ CMS 24.000000MHZ QUARTZ CMS 24.000000MHZ QUARTZ 20MHZ QUARTZ WATCH A 32.768KHZ OSCILLATEUR QUARTZ 4.000000MHZ OSCILLATEUR QUARTZ 8.000000MHZ OSCILLATEUR QUARTZ 10.000000MHZ OSCILLATEUR QUARTZ 1.000000MHZ QUARTZ 7.680000MHZ QUARTZ 9.830400MHZ QUARTZ 14.745600MHZ QUARTZ 4.608000MHZ QUARTZ 24.000000MHZ QUARTZ 4.000000MHZ QUARTZ 4.000000MHZ QUARTZ 8.000000MHZ QUARTZ 8.000000MHZ QUARTZ 16.000000MHZ QUARTZ 16.000000MHZ OSCILLATEUR QUARTZ 25.000000MHZ OSCILLATEUR QUARTZ 50.000000MHZ OSCILLATEUR QUARTZ 3.686400MHZ OSCILLATEUR QUARTZ 20.000000MHZ OSCILLATEUR QUARTZ 40.000000MHZ OSCILLATEUR QUARTZ 50.000000MHZ IGBT 20A 600V TO220 IGBT 7A 600V TO220 IGBT 40A 600V VERS 247 MOSFET N SOT-23 MOSFET N SOT-23 MOSFET N TO-220 INSULATION MONITOR INSULATION MONITOR RELAIS PHASE SEQUENCE RELAIS UNDERVOLTAGE TIMER RELAIS FLEETING ACTION RELAIS FLASHER RELAIS FLASHER TIME RELAY TIME RELAY TIME RELAY TIME RELAY TIME RELAY TIME RELAY,MULTI RANGE CYCLIC TIMER RELAIS TIME-DELAY RELAIS TIME-DELAY TIMER,OFF-DELAY STANDSTILL MONITOR RELAIS SAFETY TWO-HAND EMERGENCY STOP MODULE RELAIS PHASE MONITOR EMERGENCY STOP MODULE EMERGENCY STOP MODULE EXTENSION MODULE RELAIS SAFETY TWO-HAND RELAIS SAFETY TWO-HAND EMERGENCY STOP MODULE CONTROLEUR DE VITESSE MOTOR LOAD MONITOR DEMARREUR DOUX EMERGENCY STOP MODULE TIMER FICHE FEMELLE CLIP DE FIXATION RELAIS SWITCHING HYBRID RELAIS INTERFACE RELAIS INTERFACE RELAIS INTERFACE RELAIS INTERFACE RELAIS MULTIFUNCTION RELAIS SWITCHING RELAIS SWITCHING REMOTE SWITCH RELAIS PHASE MONITOR MONITOR,PHASE SEQUENCE INSULATION MONITOR RELAIS UNDERVOLTAGE FUSE MONITOR RELAIS OVER AND UNDERVOLTAGE RELAIS UNDERVOLTAGE RELAIS CAPTEUR DE NIVEAU EMERGENCY STOP MODULE RELAIS MULTIFUNCTION RELAIS MULTIFUNCTION CYCLIC TIMER RELAIS CURRENT RELAIS VOLTAGE RELAIS PHASE SEQUENCE RELAIS CAPTEUR DE NIVEAU RELAIS CAPTEUR DE NIVEAU RELAIS CAPTEUR DE NIVEAU PROTECTION MOTEUR THERMISTANCERELAIS PROTECTION MOTEUR THERMISTANCERELAIS PROTECTION MOTEUR THERMISTANCERELAIS PROTECTION MOTEUR THERMISTANCERELAIS TIMER,OFF-DELAY DIFFERENTIAL CURRENT TRANSFORMER RELAIS CI RELAIS CI FUSIBLE TR5 QUICK BFAIBLE 250MA FUSIBLE TR5 QUICK BFAIBLE 315MA FUSIBLE TR5 QUICK BFAIBLE 2A FUSIBLE TR5 QUICK BFAIBLE 3.15A FUSIBLE TR5 ANTI-SURCH. 4A FUSIBLE TE5 QUICK BLOW 200MA FUSIBLE TE5 QUICK BLOW 4A FUSIBLE TE5 ANTI-SURCH. 250MA FUSIBLE TE5 ANTI-SURCH. 1.6A FUSIBLE TE5 ANTI-SURCH. 2A FUSIBLE TE5 ANTI-SURCH. 2.5A FUSIBLE TE5 ANTI-SURCH. 3.15A FUSIBLE TE5 ANTI-SURCH. 5A USB-TO-UART CMS LQFP32 232 USB FIFO CMS LQFP32 245 PROTECTION ANTI ARC ELECTRIQUE 1 PHASE FICHE IEC FEMELLE 4 VOIES TRANSISTOR NPN BOITIER E-LINE TRANSISTOR NPN BOITIER E-LINE TRANSISTOR NPN BOITIER E-LINE TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 MOSFET N SOT-223 MOSFET P SOT-223 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 TRANSISTOR DARLINGTON BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-323 TRANSISTOR PNP BOITIER SOT-323 TRANSISTOR PNP BOITIER SOT-323 DIODE SCHOTTKY SOD-323 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P SOT-23-6 TRANSISTOR MOSFET CANAL P SOT-23-6 TRANSISTOR MOSFET CANAL P SOT-23-6 TRANSISTOR MOSFET CANAL N MSOP-8 TRANSISTOR MOSFET CANAL P MSOP-8 TRANSISTOR MOSFET DOUBLE NP MSOP8 TRANSISTOR MOSFET DOUBLE NP MSOP8 TRANSISTOR MOSFET DOUBLE NP MSOP8 TRANSISTOR MOSFET DOUBLE NN MSOP8 TRANSISTOR MOSFET DOUBLE NN MSOP8 TRANSISTOR MOSFET DOUBLE PP MSOP8 TRANSISTOR MOSFET DOUBLE PP MSOP8 TRANSISTOR NPN BOITIER SUPERSOT-4 TRANSISTOR NPN BOITIER SUPERSOT-4 TRANSISTOR PNP BOITIER SUPERSOT-4 TRANSISTOR NPN BOITIER E-LINE DIODE SCHOTTKY 2A 40V DIODE SCHOTTKY FAIBLE PERTE DIODE SCHOTTKY FAIBLE PERTE DIODE SCHOTTKY FAIBLE PERTE DIODE SCHOTTKY FAIBLE PERTE DIODE SCHOTTKY FAIBLE PERTE TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23-6 TRANSISTOR MOSFET CANAL N SOT-223 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23-6 TRANSISTOR MOSFET CANAL N SOT-23-6 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23-6 TRANSISTOR MOSFET CANAL N SOT-223 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR NPN BOITIER SOT-89 TRANSISTOR PNP BOITIER E-LINE TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR PNP BOITIER E-LINE TRANSISTOR MOSFET CANAL N LOGIQUE E-LINE TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL P BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR DARLINGTON BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR MOSFET CANAL N SOT-223 TRANSISTOR DARLINGTON BOITIER SOT-223 TRANSISTOR DARLINGTON BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR DARLINGTON BOITIER SOT-223 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANS MOSFET CANAL N NIV LOGIQUE SOT-223 MOSFET N LOGIQUE SOT-223 MOSFET P SOT-223 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 TRANSISTOR PNP BOITIER SOT-223 RESEAU DE TRANSISTOR PONT EN H INDUCTANCE CMS 70Z INDUCTANCE CMS 600Z INDUCTANCE CMS 150Z INDUCTANCE CMS 80Z INDUCTANCE CMS 80Z INDUCTANCE CMS 80Z INDUCTANCE CMS 60Z INDUCTANCE CMS 60Z INDUCTANCE CMS 75Z CONDENSATEUR X1/Y2 1.0NF CONDENSATEUR X1/Y2 1.0NF CONDENSATEUR X1/Y2 1.5NF CONDENSATEUR X1/Y2 4.7NF CONDENSATEUR X1/Y2 4.7NF CONDENSATEUR 470PF 3000V CONDENSATEUR 4.7NF 3150V CONDENSATEUR 0.01UF 1000V CONDENSATEUR 4.7NF 1000V CONDENSATEUR 10NF 2000V CONDENSATEUR 220PF 6000V CONDENSATEUR 3 BROCHES 100PF CONDENSATEUR 3 BROCHES 2200PF CONDENSATEUR 10000PF 3 BROCHES CONDENSATEUR 3 BROCHES 100PF CONDENSATEUR 3 BROCHES 47PF CONDENSATEUR 10000PF 3 BROCHES CONDENSATEUR 3 BORNES 270PF FILTRE 3 BROCHES FILTRE 3 BROCHES CONDENSATEUR 1000PF 3 BROCHES CONDENSATEUR 1000PF 3 BROCHES CONDENSATEUR 2200PF 3 BROCHES CONDENSATEUR 2200PF 3 BROCHES CONDENSATEUR 47PF 3 BROCHES CONDENSATEUR 2200PF 3 BROCHES CONDENSATEUR 2200PF 3 BROCHES CONDENSATEUR 470PF 3 BROCHES CONDENSATEUR 470PF 3 BROCHES FILTRE SIGNAL FILTRE SIGNAL FILTRE SIGNAL FILTRE SIGNAL CONDENSATEUR VARIABLE 5.0 A 20.0PF CONDENSATEUR VARIABLE 3.0 A 10.0PF SPRING LOADED PIN,PCB TRANSFORMATEUR 15VA 2 X 6V TRANSFORMATEUR 15VA 2X 12V TRANSFORMATEUR 50VA 2X 55V TRANSFORMATEUR 60VA 2X 12V TRANSFORMATEUR 60VA 2X 25V TRANSFORMATEUR 120VA 2 X 25V TRANSFORMATEUR 120VA 2X 55V TRANSFORMATEUR 160VA 2X 25V TRANSFORMATEUR 160VA 2X 30V TRANSFORMATEUR 160VA 2X 55V TRANSFORMATEUR 250VA 2X 35V TRANSFORMATEUR 250VA 2 X 45V IC,ANALOG SWITCH,SINGLE,SPST,DIP-8 TRANSFORMATEUR MINI 1.6VA 2X 7V TRANSFORMATEUR MINI 1.6VA 2X 15V TRANSFORMATEUR MINI 1.6VA 2X 22V TRANSFORMATEUR MINI 3.2VA 2X 9V TRANSFORMATEUR MINI 5VA 2X 9V TRANSFORMATEUR MINI 7VA 2X 7V TRANSFORMATEUR MINI 7VA 2X 15V TRANSFORMATEUR 15VA 2X 6V TRANSFORMATEUR 30VA 2X 15V TRANSFORMATEUR 80VA 2X 9V TRANSFORMATEUR 120VA 2 X 25V TRANSFORMATEUR 160VA 2X 30V TRANSFORMATEUR 225VA 2X 12V TRANSFORMATEUR 225VA 2X 15V TRANSFORMATEUR 300VA 2X 25V TRANSFORMATEUR 300VA 2X 35V TRANSFORMATEUR 500VA 2X 25V TRANSFORMATEUR 500VA 2 X 35V TRANSFORMATEUR 500VA 2 X 40V SENSOR REFLECTOR TRANSFORMATEUR 80VA 2X 9V TRANSFORMATEUR 80VA 2X 18V TRANSFORMATEUR 80VA 2X 25V TRANSFORMATEUR 225VA 2X 30V TRANSFORMER,500VA,2 X 35V TRANSFORMATEUR 500VA 2 X 45V TRANSFORMATEUR 500VA 2X 50V TRANSFORMER,800VA,2 X 55V TRANSFORMATEUR 1000VA 2 X 40V TRANSFORMER,1000VA,2 X 55V CONTACT,SOCKET,18-14AWG,CRIMP CONTACT,SOCKET,18-14AWG,CRIMP CONTACT,SOCKET,18-14AWG,CRIMP CONTACT,PIN,18-14AWG,CRIMP CONTACT,PIN,18-14AWG,CRIMP SPRING LOADED PIN,PCB ENCLOSED POWER BLOCK,1POS,14-2AWG ENCLOSED POWER BLOCK,1POS,14-2AWG FAST DIODE,10A,1.2KV,TO-220AC FAST DIODE,20A,600V,TO-220AC SCR THYRISTOR,16A,1.2KV,TO-220AB SCR Thyristor Circular Connector RESISTOR,THIN FILM,10KOHM,100mW,0.1% DIN 41612 PCB CONNECTOR RECEPTACLE 96POS POWER RELAY,SPDT,120VAC,12A,PLUG IN POWER RELAY,SPDT,12VDC,12A,PLUG IN POWER RELAY,SPDT,24VDC,12A,PLUG IN POWER RELAY,SPDT,120VAC,12A,PLUG IN POWER RELAY,SPDT,24VAC,12A,PLUG IN POWER RELAY,SPDT,240VAC,12A,PLUG IN POWER RELAY,SPDT,24VDC,12A,PLUG IN POWER RELAY,DPDT,120VAC,8A,PLUG IN POWER RELAY,DPDT,240VAC,8A,PLUG IN POWER RELAY,DPDT,12VDC,8A,PLUG IN POWER RELAY,DPDT,24VDC,8A,PLUG IN POWER RELAY,DPDT,120VAC,8A,PLUG IN POWER RELAY,DPDT,24VAC,8A,PLUG IN POWER RELAY,DPDT,12VDC,8A,PLUG IN POWER RELAY,DPDT,24VDC,8A,PLUG IN POWER RELAY,SPDT,120VAC,12A,PC BOARD POWER RELAY,SPDT,24VDC,12A,PC BOARD POWER RELAY,DPDT,120VAC,8A,PC BOARD POWER RELAY,DPDT,24VAC,8A,PC BOARD POWER RELAY,DPDT,12VDC,8A,PC BOARD POWER RELAY,DPDT,24VDC,8A,PC BOARD RELAY SOCKET,5PIN,12A,300V .056UF 50.0V CAPACITOR CERAMIC 560PF 50V,C0G,5%,0805 CAPACITOR CERAMIC 0.1UF,400V,Y5V,20%,RAD SWITCH,REED,SPST,1.5A,200VDC Card Edge Connector TERMINAL BLOCK EUROSTYLE,4POS,28-16AWG RESISTOR,CURRENT SENSE,0.01 OHM,2W,1% N CHANNEL MOSFET,55V,36A TO-220FP N CH MOSFET,500V,4.5A,TO-220FP N CHANNEL MOSFET,100V,9.4A,D-PAK N CHANNEL MOSFET,100V,7.7A,D-PAK P CHANNEL MOSFET,-55V,31A,D-PAK P CHANNEL MOSFET,-55V,11A,D-PAK MOSFET N CHANNEL MOSFET,40V,162A,TO-262 QUADRUPLE RECEPTEUR DE LIGNE CMS N CHANNEL MOSFET,200V,18A,TO-262 N CHANNEL MOSFET,400V,10A,I2-PAK N CHANNEL MOSFET,500V,5A,I2-PAK N CH MOSFET,100V,1.5A,SOT-223 N CHANNEL MOSFET,55V,17A,D-PAK N CHANNEL MOSFET,55V,17A,D-PAK N CHANNEL MOSFET,100V,17A,D-PAK FAST RECOVERY DIODE,8A,200V D2PAK Schottky Rectifier RESISTOR,CURRENT SENSE,25 OHM,25W,1% RESISTOR,CURRENT SENSE,0.1 OHM,2W,1% RESISTOR,CURRENT SENSE,1 OHM,25W,1% Current Sense Resistor SIGNAL RELAY,DPDT,24VDC,2A,THD CONTACT,PIN,18-14AWG,CRIMP PROBE,DIFFERENTIAL,ACTIVE,50MHZ PROBE,DIFFERENTIAL,ACTIVE,100MHZ PSU,DIFFERENTIAL PROBES MAINS LEAD,WITH PROBUS ADAPTER COUPE-CIRCUIT 2 POLES 5A COUPE-CIRCUIT 2 POLES 10A COUPE-CIRCUIT 2 POLES 16A SECTIONNEUR 1A SECTIONNEUR 2A SECTIONNEUR 3A SECTIONNEUR 10A SECTIONNEUR 15A COUPE-CIRCUIT 1 POLE 10A COUPE-CIRCUIT 1 POLE 16A COUPE-CIRCUIT 20A COUPE-CIRCUIT 25A DISJONCTEUR 5A DISJONCTEUR 10A DISJONCTEUR 15A DISJONCTEUR 25A COUPE-CIRCUIT 1.0A COUPE-CIRCUIT 1.8A COUPE-CIRCUIT 5.0A COUPE-CIRCUIT 6.3A COUPE-CIRCUIT 8.0A DARLINGTON TRANSISTOR ARRAY,NPN,7,50V,DIP IC,RS-232 TRANSCEIVER,5.5V,TSSOP-20 IC,OCTAL D-LATCH,3-STATE,TSSOP-20 IC NON INVERTING BUS BUFFER GATE SOT23-5 IC,3 TO 8 LINE DECODER/DMUX,TSSOP-16 CONNECTOR,RCA/PHONO,PLUG,1POS CAPACITOR CERAMIC,2.2UF,4V,X5R,20%,0402 CAPACITOR CERAMIC 0.01UF,10V,X5R,10%,0201 FERRITE BEAD,0.14OHM,1A,0402 POWER INDUCTOR,2.2UH,530MA,20% POWER INDUCTOR,1UH,1.44A,20% POWER INDUCTOR,100UH,270MA,20% POWER INDUCTOR,4.7UH,870MA,20% POWER INDUCTOR,47UH,320MA,20% POWER INDUCTOR,22UH,135MA,20% SMD INDUCTOR 100NH 500MA 20% 235MHZ SMD INDUCTOR 470NH 400MA 20% 125MHZ SMD INDUCTOR,6.8UH,70MA 20% 29MHZ CAPACITOR CERAMIC,22UF,10V,Y5V,+80,-20%,1206 CAPACITOR CERAMIC,1000PF,25V,0402 5% CAPACITOR CERAMIC,10UF,25V,X5R,10%,1210 CAPACITOR CERAMIC,0.3PF,50V,0402 0.1pF CAPACITOR CERAMIC,0.4PF,50V,0402 0.1pF CAPACITOR CERAMIC,0.7PF,50V,0402 0.1pF CAPACITOR CERAMIC,0.8PF,50V,0402 0.1pF CAPACITOR CERAMIC,1PF,50V,0402 0.1pF CAPACITOR CERAMIC,2.2PF,50V,0402 5% CAPACITOR CERAMIC,2.4PF,50V,0402 5% CAPACITOR CERAMIC,3.6PF,50V,0402 5% MICROPHONE,-76DB,UNIDIRECTIONAL,12KHZ IC ADJ LDO REG 1.2V TO 5.5V 1.5A D2PAK-5 IR Emitting Diode IR Emitting Diode Connector Color Code Ring IC,8CH IDENTITY COMPARATOR,SOIC-20 IC,DAC,12BIT,95KSPS,SOT-23-6 IC,DIFFERENTIAL AMP,1.5MHZ 5V/ uS SOIC8 IC,OP-AMP,1MHZ,0.8V/ us,SOT-23-5 IC,OP-AMP,38MHZ,22V/ us,MSOP-8 A/D Converter (A-D) IC IC,LINEAR VOLTAGE REGULATOR,5V,8-SOIC IC,CURRENT/VOLT PWM CTRL,16.5V,20-DIP CONNECTOR,RCA/PHONO,PLUG Connector Dust Cap For Use With:MIL-C-26 Connector Dust Cap Connector Dust Cap For Use With:MIL-C-26 CONNECTOR,RCA/PHONO,PLUG Connector Dust Cap DIODE DE REDRESSEMENT RAPIDE 0.5A DIODE CMS 1.5A 1000V DIODE CMS 1.5A 1000V DIODE SCHOTTKY 1.5A 45V DIODE ULTRA RAPIDE 1A 100V CMS DIODE ULTRA RAPIDE 1A 150V CMS DIODE ULTRA RAPIDE 1A 200V CMS DIODE SMB RAPIDE 2A 100V DIODE SMB RAPIDE 2A 200V DIODE SMC RAPIDE 3A 50V DIODE ULTRA RAPIDE 3A 100V CMS DIODE ULTRA RAPIDE 3A 150V CMS DIODE SMC RAPIDE 3A 400V DIODE ULTRA RAPIDE 16A DIODE ULTRA RAPIDE 16A DIODE ULTRA RAPIDE 16A PONT REDRESSEUR 12A 400V PONT REDRESSEUR 25A 200V PONT REDRESSEUR 35A 200V PONT REDRESSEUR 6A 100V PONT RECTIFIEUR 6A 200V DIODE 1A 50V CMS DIODE 1A 50V CMS DIODE 1A 100V CMS DIODE 1A 200V CMS DIODE 1A 400V CMS DIODE 1A 400V CMS DIODE 1A 600V CMS DIODE 1A 800V CMS DIODE 1A 1000V CMS DIODE 1A 1000V CMS PONT REDRESSEUR 25A 400V DIODE MINIMELF DIODE MINIMELF DIODE QUADRO-MELF PONT REDRESSEUR 0.5A 200V CMS PONT REDRESSEUR 0.5A 400V CMS PONT REDRESSEUR 0.5A 600V CMS DIODE SCHOTTKY 7.5A 60V DIODE SCHOTTKY 16A 60V DIODE SCHOTTKY 7.5A 45V DIODE SCHOTTKY 7.5A 45V DIODE MICRO-MELF DIODE MICRO-MELF DIODE RAPIDE 1.0A 50V CMS DIODE RAPIDE 1.0A 100V CMS DIODE RAPIDE 1.0A 200V CMS DIODE RAPIDE 1.0A 400V CMS DIODE RAPIDE 1.0A 600V CMS DIODE SMB RAPIDE 1.5A 100V DIODE SMB RAPIDE 1.5A 100V DIODE SMB RAPIDE 1.5A 200V DIODE SMB RAPIDE 1.5A 400V DIODE SMB RAPIDE 1.5A 600V DIODE RAPIDE 3.0A 100V CMS DIODE RAPIDE 3.0A 800V CMS DIODE 1.0A 50V CMS DIODE 1.0A 100V CMS DIODE 1.0A 200V CMS DIODE 1.0A 400V CMS DIODE SMB 1.5A 50V DIODE SMB 1.5A 200V DIODE SMB 1.5A 400V DIODE SMB 1.5A 600V DIODE SMB 1.5A 600V DIODE SMC 3A 50V DIODE SMC 3A 200V DIODE SMC 3A 200V DIODE SMC 3A 400V DIODE SMC 3A 600V TRANSISTOR MOSFET CANAL N SC-75A TRANSISTOR MOSFET CANAL N BOITIER SO-8 TRANSISTOR MOSFET DOUBLE NP SO-8 TRANSISTOR MOSFET CANAL N BOITIER SO-8 TRANSISTOR MOSFET CANAL N BOITIER SO-8 TRANSISTOR MOSFET CANAL N BOITIER SO-8 DIODE SCHOTTKY 1.5A 20V DIODE SCHOTTKY 1.5A 30V DIODE SCHOTTKY SMB 2A 20V DIODE SCHOTTKY SMB 2A 30V DIODE DE SUPPRESSION SMA 400W 12V DIODE DE SUPPRESSION SMA 400W 12V DIODE DE SUPPRESSION SMA 400W 15V DIODE DE SUPPRESSION SMA 400W 15V DIODE DE SUPPRESSION SMA 400W 18V DIODE DE SUPPRESSION SMA 400W 18V DIODE DE SUPPRESSION SMA 400W 18V DIODE DE SUPPRESSION SMA 400W 24V DIODE DE SUPPRESSION SMA 400W 24V DIODE DE SUPPRESSION SMA 400W 24V DIODE DE SUPPRESSION SMA 400W 30V DIODE DE SUPPRESSION SMA 400W 30V DIODE DE SUPPRESSION SMA 400W 33V DIODE DE SUPPRESSION SMA 400W 36V DIODE DE SUPPRESSION SMA 400W 36V DIODE DE SUPPRESSION SMA 400W 5.0V DIODE DE SUPPRESSION SMB 600W 12V DIODE DE SUPPRESSION SMB 600W 15V DIODE DE SUPPRESSION SMB 600W 15V DIODE DE SUPPRESSION SMB 600W 18V DIODE DE SUPPRESSION SMB 600W 18V DIODE DE SUPPRESSION SMB 600W 24V DIODE DE SUPPRESSION SMB 600W 30V DIODE DE SUPPRESSION SMB 600W 33V DIODE DE SUPPRESSION SMB 600W 36V DIODE DE SUPPRESSION SMB 600W 5V DIODE DE SUPPRESSION SMC 1500W 12V DIODE DE SUPPRESSION SMC 1500W 12V DIODE DE SUPPRESSION SMC 1500W 15V DIODE DE SUPPRESSION SMC 1500W 15V DIODE DE SUPPRESSION SMC 1500W 18V DIODE DE SUPPRESSION SMC 1500W 24V DIODE DE SUPPRESSION SMC 1500W 24V DIODE DE SUPPRESSION SMC 1500W 30V DIODE DE SUPPRESSION SMC 1500W 30V DIODE DE SUPPRESSION SMC 1500W 33V DIODE DE SUPPRESSION SMC 1500W 33V DIODE DE SUPPRESSION SMC 1500W 5V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 1A 60V DIODE SCHOTTKY 1A 100V DIODE SCHOTTKY 3A 60V TRANSISTOR MOSFET CANAL N BOITIER D-PAK DIODE DE REDRESSEMENT RAPIDE 1A 200V DIODE DE REDRESSEMENT RAPIDE 0.6A DIODE DE REDRESSEMENT RAPIDE 2A DIODE DE REDRESSEMENT RAPIDE 4A DIODE DE REDRESSEMENT LENT 8A DIODE DE REDRESSEMENT 2X5A DIODE DE REDRESSEMENT 2X5A DIODE SMA RAPIDE 1A 200V DIODE SMA RAPIDE 1A 400V DIODE SMA RAPIDE 1A 600V DIODE SMA RAPIDE 1A 1000V POWER OUTLET STRIP,6 OUTLET,15A,125V SUPPORT POUR LED CARREE 2 POINTS 5MM SUPPORT DE LED 2 POINTS 5MM SUPPORT DE LED 2 POINTS 3MM SUPPORT DE LED 2 POINTS 3MM SUPPORT DE LED 2 POINTS 3MM SUPPORT DE LED 3 POINTS 5MM SUPPORT DE LED 3 POINTS 5MM SUPPORT DE LED 3 POINTS SUPPORT DE LED 3 POINTS 5MM DIODE SCHOTTKY 1A 100V DIODE SCHOTTKY 1A 100V TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR PNP BOITIER SOT-23 TRANSISTOR MOSFET CANAL N BOITIER D-PAK DIODE SCHOTTKY 1A 30V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 1A 20V TRANSISTOR PNP BOITIER TO-3 DIODE RAPIDE SOD-123 DIODE 1A 400V DIODE 3A 100V DIODE 3A 400V DIODE 3A 1000V MOSFET N TO-92 DIODE SCHOTTKY 2X10A 200V TRANSISTOR PNP TO-220 TRANSISTOR PNP TO-220 TRANSISTOR NPN TO-126 TRANSISTOR NPN TO-3 THYRISTOR 2.5A 600V TO-126 THYRISTOR 0.8A 30V TO-92 TRANSISTOR NPN TO-3 TRANSISTOR PNP TO-3 TRANSISTOR PNP TO-220 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NUMERIQUE SOT-23 TRANSISTOR NPN TO-3 DIODE SCHOTTKY 1A 60V TRANSISTOR MOSFET N TO-92 DIODE SCHOTTKY 0.5A 20V DIODE SCHOTTKY 0.5A 40V DIODE SCHOTTKY 0.5A 40V DIODE SCHOTTKY 1A 30V DIODE SCHOTTKY 3A 60V DIODE SCHOTTKY 3A 60V DIODE SCHOTTKY 3A 60V DIODE SCHOTTKY 2X3A 40V DIODE ULTRA RAPIDE 1A 600V DIODE ULTRA RAPIDE 1A TRANSISTOR PNP TO-264 THYRISTOR 25A 600V TO-220 DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 3A 40V DIODE SCHOTTKY 2X12.5A 35V DIODE ULTRA RAPIDE 1A 200V DIODE ULTRA RAPIDE 1A 200V DIODE ULTRA RAPIDE 16A 200V DIODE ULTRA RAPIDE 1A 200V DIODE ULTRA RAPIDE 1A 600V DIODE ULTRA RAPIDE 8A 200V DIODE ULTRA RAPIDE 8A 1000V DIODE ULTRA RAPIDE 3A 200V DIODE ULTRA RAPIDE 3A 200V TRANSISTOR DARLINGTON BOITIER TO-126 TRANSISTOR DARLINGTON BOITIER TO-126 TRANSISTOR DARLINGTON BOITIER TO-220 TRANSISTOR NPN TO-126 TRANSISTOR DARLINGTON BOITIER TO-220 DIODE ZENER 5W 3.3V DIODE ZENER 5W 4.3V DIODE ZENER 5W 5.1V DIODE ZENER 5W 6.0V DIODE ZENER 5W 8.2V DIODE ZENER 5W 14V DIODE ZENER 5W 17V DIODE ZENER 5W 20V DIODE ZENER 5W 36V TRANSISTOR PNP BOITIER TO-92 TRANSISTOR PNP BOITIER TO-92 TRANSISTOR PNP BOITIER TO-92 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR NPN BOITIER SOT-23 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR MOSFET CANAL N SOT-23 TRANSISTOR JFET CANAL N SOT-23 MOSFET N SOT-23 DIODE RAPIDE SOT-23 DIODE RAPIDE SOT-23 DIODE DOUBLE BOITIER SOT-23 TRANSISTOR NPN BOITIER TO-92 REFERENCE DE TENSION 2.5V REFERENCE DE TENSION 5V REFERENCE DE TENSION 5V REFERENCE DE TENSION DE PRECISION 5.0V REGULATEUR A DECOUPAGE 2.5A REGULATEUR A DECOUPAGE CONVERTISSEUR DC/DC CMS AMPLI OP DE PRECISION QUAD AMPLI OP DE PRECISION QUAD REGULATEUR LDO +5.0V REGULATEUR LDO AJUSTABLE +3.8/20V CMS REGULATEUR AJUSTABLE +3.75/30V CONVERTISSEUR DC/DC CMS AMPLI VIDEO DIFFERENTIEL AMPLI OP RETOUR DE COURANT CONVERTISSEUR DC/DC CMS PWM REGULATEUR A DECOUPAGE REGULATEUR A DECOUPAGE 5.0V CONVERTISSEUR N/A 12 BITS REGULATEUR CHARGEUR DE BATTERIE CMS REGULATEUR LDO 5A AJUSTABLE CMS REGULATEUR AJUSTABLE LDO 3A REGULATEUR LDO 3.3V 3A REGULATEUR A DECOUPAGE EMETTEUR/RECEPTEUR RS485/422 AMPLI OP ZERO DRIFT TRES FAIBLE CONSO. FILTRE PASSE BAS DE BUTTERWORTH FILTRE PASSE BAS BUTTERWORT CONVERTISSEUR DC/DC CONVERTISSEUR DC/DC CMS CONVERTISSEUR A/N 24 BITS CMS CONVERTISSEUR A/N 12 BITS CMS SYSTEME ACQUISITION DONNEES 12BITS CIRCUIT DAS 12 BITS CMS CIRCUIT EMETTEUR/RECEPTEUR RS232 CONVERTISSEUR A/N 12 BITS CMS CONVERTISSEUR A/N MULTI-BIT CMS CONVERTISSEUR N/A 12 BITS CONVERTISSEUR N/A 12 BITS CMS CONVERTISSEUR AN 16 BITS TRANSCEIVER DE BUS CMOS DIP8 485 CIRCUIT DIFFERENTIEL DRVR/RCVR CIRCUIT DIFFERENTIEL DRVR/RCVR CAPOT CARRE ROUGE CAPOT ROND VERT CAPOT ROND ROUGE CAPOT ROND IVOIRE CAPOT ROND ORANGE CAPOT CARRE JAUNE CAPOT CARRE NOIR CAPOT CARRE ORANGE RELAIS REED DIL SPCO 5V RELAIS REED DIL DPNO 5V RELAIS REED DIL DPNO 12V RELAIS REED DIL SPNO 12V RELAIS REED SIL SPNO 5V RELAIS REED SIL SPNO 12V RELAIS REED SIL SPNO 24V RELAIS REED DIL SPNO 12V RELAIS REED DIL SPNO 24V INTERRUPTEUR A BASCULE SPDT NOIR INTERRUPTEUR A BASCULE DPST NOIR INTERRUPTEUR A BASCULE SPST NOIR INTERRUPTEUR A BASCULE DPST ROUGE MODULE THYRISTOR/DIODE 60A MODULE THYRISTOR 18A 800V MOSFET N SEMITRANS DIODE FILETEE 50A 1200V DIODE FILETEE 95A 1200V DIODE FILETEE 25A 1200V DIODE FILETEE 50A 1200V DIODE FILETEE 95A 400V DIODE FILETEE 95A 1200V DIODE FILETEE 165A 400V DIODE 6A 400V DIODE 6A 800V DIODE 1A 50V DIODE 3A 100V DIODE 3A 200V DIODE 3A 1000V DIODE RECOUVREMENT RAPIDE 3A 800V DIODE DE REDRESSEMENT RAPIDE 1A 1000V DIODE DE SUPPRESSION 500W 5V DIODE DE SUPPRESSION 500W 24V DIODE DE SUPPRESSION 1500W 11V DIODE DE SUPPRESSION 1500W 16V DIODE DE SUPPRESSION 1500W 18V DIODE DE SUPPRESSION 1500W 47V DIODE DE SUPPRESSION 1500W 11V DIODE DE SUPPRESSION 1500W 27V DIODE DE SUPPRESSION 1500W 30V FIXED UNVENTED SHELF,3U,STEEL OPEN FRAME RELAY RACK,21IN,STEEL PRESSURE SENSOR,15PSI DUAL AXIAL BARBED RESISTANCE 30W 0R015 5% RESISTANCE 30W 0R022 5% RESISTANCE 30W 0R05 5% RESISTANCE 30W 0R068 5% RESISTANCE 30W 0R47 5% RESISTANCE 50W 0R01 5% RESISTANCE 50W 0R05 5% RESISTANCE 50W 0R1 5% RESISTANCE 50W 0R47 5% RESISTANCE 50W 1K 5% RESISTANCE 100W 0R015 5% RESISTANCE 100W 1R 5% RESISTANCE 100W 10R 5% OSCILLOSCOPE,USB,2 CHANNEL CONNECTION BOX,OPTO-IN CONNECTION BOX,OPTO-OUT CONVERTISSEUR INTERFACE USB - XRS232 CONVERTISSEUR INTERFACE USB - 8XRS232 CABLE,CONNECTION,78POL,1METER CABLE,CONNECTION,LABJACK RECTANGULAR POWER BASE,SIZE 48B,1 LEVER ISOLATEUR 4 CANAUX CMS INTERFACE RS485 ISOLEE PROTECTIVE COVER,HAN 32B HOOD TOOLS,MIRRORS INSPECTION INTERRUPTEUR CI SPDT CTR OFF INTERRUPTEUR CI SPDT CTR OFF INTERRUPTEUR CI SPDT BIASED INTERRUPTEUR CI SPDT INTERRUPTEUR CI DPDT INTERRUPTEUR SPDT INTERRUPTEUR SPDT INTERRUPTEUR DPDT CTR OFF INTERRUPTEUR 3PDT INTERRUPTEUR A BASCULE SPDT INTERRUPTEUR A BASCULE DPDT COMMUTATEUR BODY SPDT COMMUTATEUR BODY SPDT CTR OFF COMMUTATEUR BODY SPDT 2WB COMMUTATEUR BODY SPDT 1WB COMMUTATEUR BODY DPDT COMMUTATEUR BODY CTR OFF COMMUTATEUR BODY DPDT 2WB COMMUTATEUR BODY DPDT 1WB INTERRUPTEUR SPDT CTR OFF INTERRUPTEUR 4PDT COMMUTATEUR ULTRA MINIATURE COMMUTATEUR ULTRA MINIATURE INTERRUPTEUR SPST DETECT INTERRUPTEUR CI SPDT INTERRUPTEUR CI DPDT INTERRUPTEUR CI SPDT INTERRUPTEUR CI SPDT INTERRUPTEUR SPDT CTR OFF INTERRUPTEUR SPDT CTR OFF INTERRUPTEUR DPDT CTR OFF INTERRUPTEUR CI SPDT BIASED INTERRUPTEUR CI DPDT INTERRUPTEUR CI DPDT INTERRUPTEUR CI DPDT INTERRUPTEUR CI DPDT CTR OFF TAPE,RED/WHITE,24MM ROULEAU POUR DYMO NOIR 32MM ROULEAU POUR DYMO BLANC 32MM REED RELAY,SPST,5VDC,0.25A,THD CIRCULAR CONNECTOR PLUG SIZE 10SL,2POS CABLE SSR,PCB,SPST-NO,600VAC,900MA SSR,PCB,SPST-NO,600VAC,1.2A SSR,PCB MOUNT,600VAC,1.2A ASPIRATEUR DE FUMEE ZERO SMOG WHE STATION WHS40 PRISE ANGLAISE PANNE 0.4MM CONIQUE PANNE DE FER 2.0MM PANNE DE FER 3.5MM POWER RELAY,DPDT,120VAC,16A,PLUG IN SPIRALE POUR CABLE NOIR 16MM 2M SPIRALE POUR CABLE GRIS 16MM 2M SPIRALE POUR CABLE NOIR 25MM 2M SPIRALE POUR CABLE GRIS 25MM 2M SWITCH,SAFETY INTERLOCK,SPDT,5A,250V CONTACTOR 3PST-NO,120VAC,20A,DIN RAIL TOURNEVIS TORX T7 MAGIC SPRING TOURNEVIS TORX T8 MAGIC SPRING TOURNEVIS TORX T15 MAGIC SPRING TOURNEVIS TORX T20 MAGIC SPRING TOURNEVIS TORX T25 MAGIC SPRING TOURNEVIS TORX T27 MAGIC SPRING TOURNEVIS TORX T40 MAGIC SPRING JEU DE TOURNEVIS TORX MAGIC SPRING FOAMCLENE ANTISTATIQUE 300ML BOITE 16X12X15MM B=WHITE L=TRANSP CMS BOITE 16X12X15MM B+L=WHITE CMS BOITE 16X12X15MM B+L=YELLOW CMS BOITE 16X12X15MM B+L=GREEN CMS BOITE 16X12X15MM B+L=YELLOW CMS BOITE 37X12X15MM B=WHITE L=TRANSP CMS BOITE 37X12X15MM B=YELLOW L=TRANSP CMS BOITE 37X12X15MM B+L=WHITE CMS BOITE 37X12X15MM B+L=YELLOW CMS BOITE 37X12X15MM B+L=GREEN CMS BOITE 37X12X15MM B+L=BLUE CMS BOITE 37X12X15MM B+L=YELLOW CMS BOITE 37X12X15MM B+L=RED CMS BOITE 37X12X15MM B+L=BLUE CMS BOITE 41X37X15MM B+L=WHITE CMS BOITE 41X37X15MM B+L=GREEN CMS BOITE 41X37X15MM B+L=BLUE CMS BOITE 41X37X15MM B+L=YELLOW CMS BOITE 41X37X15MM B+L=RED CMS BOITE 68X57X15MM B+L=WHITE CMS BOITE 68X57X15MM B+L=RED CMS BOITE 68X57X15MM B+L=BLUE CMS BOITE 68X57X15MM B+L=BLACK CMS BOITE 68X57X15MM B+L=YELLOW CMS BOITE 68X57X15MM B+L=RED CMS COFFRET 3 TIROIRS VARICOL. EMPTY COFFRET 3 TIROIRS BLACK ESD EMPTY COFFRET 3 TIROIRS VARICOL. 48 CONT. COFFRET 3 TIROIRS BLACK ESD 48 CONT. COFFRET 3 TIROIRS BLACK ESD 216 CONT. COFFRET 3 TIROIRS VARICOL. 432 CONT. COFFRET 4 TIROIRS VARICOL. MIXED SMD STORAGE COFFRET 6 TIROIRS ESD RACK RANGEMENT ESD BOBINE CMS 25 A 330MM FILTRE 1A CI FILTRE 3A CI FILTRE 6A CI FILTRE 10A CI EMBASE IEC FILTRE 6A EMBASE IEC FILTRE 6A EMBASE IEC FILTRE 3A EMBASE IEC FILTRE 3A EMBASE IEC FILTRE 6A EMBASE IEC FILTRE 3A EMBASE IEC FILTRE 10A FILTRE 5A FILTRE 1A FILTRE TRIPHASE 3A FILTRE TRIPHASE 6A FILTRE TRIPHASE 20A FILTRE SORTIE 6A FILTRE 3A FILTRE TRIPHASE 12A FILTRE 3 PHASES 10A FILTRE IEC 3A FILTRE IEC 15A FILTRE SECTEUR 20A TOOL CASE BIG TWIN ABS INVERSEURS HEX CMS DRIVER BUFFER/LIGNE 16 BITS CMS CIRCUIT CMOS TRIGGER DE SCHMITT HEX CIRCUIT LOGIQUE CMOS CMS CIRCUIT LOGIQUE CMOS CMS CIRCUIT LOGIQUE CMOS CMS CIRCUIT LOGIQUE CMOS CMS COMPARATEUR QUAD USAGE GENERAL CMS REFERENCE DE TENSION BASSE PUISSANCE REFERENCE DE TENSION BASSE PUISSANCE DRIVER/RECEIVER DOUBLE EIA-232 232 AMPLI OP AUDIO CMS EMETTEUR/RECEPTEUR DE BUS DIFF CMS DRIVER/RECEPTEUR DE LIGNE RS-232 CMS DRIVER/RECEPTEUR DE LIGNE RS-232 CMS BUFFER / DRIVER HEX CMS CIRCUIT EMET/RECEPT. DE BUS 16 BITS CMS CIRCUIT TYPE D VERROU 16 BITS CMS EMETTEUR/RECEPTEUR DE BUS OCTAL CMS CIRCUIT LOGIQUE 2-ENTREES OU QUAD CMS CIRCUIT LOGIQUE D OCTAL VERROU CMS CIRCUIT LOGIQUE D OCTAL VERROU CMS CIRCUIT LOGIQUE FLIP FLOP DOUBLE CMS INVERSEURS HEX CMS CIRCUIT LOGIQUE TRIGGER DE SCHMITT CMS EMETTEUR/RECEPTEUR DE BUS OCTAL CMS CIRCUIT LOGIQUE 2-ENTREES OU QUAD CMS CIRCUIT LOGIQUE D OCTAL VERROU CMS CIRCUIT LOGIQUE D OCTAL VERROU CMS CIRCUIT LOGIQUE D OCTAL VERROU CMS CIRCUIT LOGIQUE DOUBLE CMS CIRCUIT LOGIQUE 2-ENTREES NAND QUAD CMS CIRCUIT LOGIQUE 2-ENTREES ET QUAD CMS CIRCUIT LOGIQUE 2-ENTREES NAND QUAD CMS CIRCUIT LOGIQUE TRIGGER DE SCHMITT CMS CIRCUIT LOGIQUE TRIGGER DE SCHMITT CMS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS CIRCUIT LOGIQUE TRIGGER DE SCHMITT CMS CIRCUIT LOGIQUE TRIGGER DE SCHMITT CMS BUFFERS ET DRIVERS OCTAL CMS EMETTEUR/RECEPTEUR DE BUS OCTAL CMS CIRCUIT LOGIQUE 2-ENTREES OU QUAD CMS CIRCUIT LOGIQUE 2-ENTREES OU QUAD CMS CIRCUIT LOGIQUE TYPE D VERROU CMS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS BUFFERS ET DRIVERS OCTAL CMS CIRCUIT LOGIQUE TYPE D VERROU CMS DRIVERS DE MEMOIRE 10 BITS BUS/MOS CMS COMMUT. DE BUS FET FAIBLE TENSION CMS CIRCUIT LOGIQUE 2-ENTREES NAND QUAD CMS INVERSSEUR HEX CMS DECODEUR/DEMULTIPLEXEUR DECODEUR/DEMULTIPLEXEUR CMS INVERSEURS HEX TRIGGER DE SCHMITT CIRCUIT LOGIQUE TRIGGER DE SCHMITT CMS CONVERTISSEUR DE DONNEES QUAD CMS COMPTEUR BINAIRE 4 BITS CMS CIRCUIT LOGIQUE REGISTRE A DECALAGE CMS CIRCUIT LOGIQUE REGISTRE A DECALAGE CMS CIRCUIT REGITRE A DECALAGE 8 BITS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS BUFFER ET DRIVER DE LIGNE OCTAL CMS EMETTEUR/RECEPTEUR DE BUS OCTAL CMS MULTIPLEXEUR/SELECTEUR DE DONNEES SELECTEUR/MULTIPLEXEUR DE DONNEES CMS SELECTEUR/MULTIPLEXEUR DE DONNEES QUAD CIRCUIT VERROU 8 BITS ADRESSABLE CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS BUFFER ET DRIVER DE LIGNE CMS CIRCUIT LOGIQUE TYPE D VERROUILLAGE CIRCUIT LOGIQUE TYPE D FLIP-FLOP CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS COMPTEUR BINAIRE DOUBLE 4 BITS CMS COMPTEUR BINAIRE 12 BITS CMS BUFFER ET DRIVER DE LIGNE CMS BUFFER ET DRIVER DE LIGNE OCTAL CMS CIRCUIT LOGIQUE TYPE D VERROU CMS CIRCUIT LOGIQUE TYPE D VERROUILLAGE CIRCUIT LOGIQUE TYPE D FLIP-FLOP CIRCUIT REGITRE A DECALAGE 8 BITS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS CIRCUIT LOGIQUE QUAD 2 ENTREES NAND CIRCUIT LOGIQUE 2-ENTREES ET QUAD CMS DECODEUR/DEMULTIPLEXEUR CMS INVERSEURS HEX TRIGGER DE SCHMITT BUFFER ET DRIVER DE LIGNE OCTAL BUFFER ET DRIVER DE LIGNE OCTAL CMS EMETTEUR/RECEPTEUR DE BUS OCTAL CMS CIRCUIT LOGIQUE D OCTAL FLIP-FLOP CMS CIRCUIT OCTAL TYPE D FLIP-FLOP BUFFER ET DRIVER DE LIGNE OCTAL CMS CIRCUIT TYPE D OCTAL VERROU CMS INVERSEURS HEX CMS DECODEUR / DEMULTIPLEXEUR DECODEURS/DRIVER CMS REGISTRE A DECALAGE SORTIE SERIE CMS BUFFER ET DRIVER DE LIGNE OCTAL CMS CIRCUIT VERROU OCTAL ADRESSABLE CIRCUIT LOGIQUE 2-ENTREES OU QUAD CMS BUFFER ET DRIVER DE LIGNE OCTAL CMS CIRCUIT LOGIQUE 2-ENTREES ET QUAD CMS INVERSSEUR HEX TRIGGER DE SCHMITT CMS CIRCUIT TYPE D OCTAL FLIP-FLOPS CMS CIRCUIT LOGIQUE 2-ENTREES OU QUAD CMS MULTIPLEXEUR ANALOGIQUE DOUBLE CMS COMMUTATEUR ANALOGIQ BILATERAL QUAD CMS BUFFER / DRIVER HEX CMS BUFFER ET DRIVER OCTAL CMS EMETTEUR/RECEPTEUR DE BUS OCTAL CMS CIRCUIT LOGIQUE TYPE D FLIP FLOP CMS CIRCUIT LOGIQUE FLIP FLOP DOUBLE CMS EMETTEUR/RECEPTEUR DE BUS OCTAL CMS BUFFER/DRIVER OCTAL ABT 3.3-V CMS BUFFER DE BUS QUAD ABT 3.3-V CMS CIRCUIT D VERROU OCTAL ABT 3.3-V CMS RECEPTEUR DE LIGNE QUAD DRIVER/RECEPTEUR FAIBLE CONSOMMATION DRIVER/RECEPTEUR DE LIGNE RS-232 CMS AMPLI OP CMS DOUBLE JFET AMPLI OP CMS DOUBLE JFET AMPLI OP CMS QUAD JFET AMPLI OP CMS ENTREE JFET AMPLI OP CMS ENTREE JFET AMPLI OP CMS QUAD JFET AMPLI OP CMS QUAD JFET AMPLI OP ENTREE JFET AMPLI OP FAIBLE BRUIT CMS DOUBLE CONTROLEUR PWM CMS CONTROLEUR PWM CIRCUIT SUPERVISEUR D´ALIMENTATION CMS CIRCUIT SUPERVISEUR D´ALIMENTATION CMS CIRCUIT DE MAINTIEN HEX IC,HEX CLAMPING CIRCUIT,8-SOIC AMPLI DIFFERENTIEL VIDEO CMS REGULATEUR 12V 100MA FIXE CMS CHARGEUR LI-ION MODE COMMUTE CMS AMPLI OP CMS UNITE GAIN AMPLI OP CMS UNITE GAIN COMMUTATEUR PWM CMS CIRCUIT CMOS HEX TYPE D FLIP-FLOP MODULE D´HUMIDITE 0 A 1V MODULE D´HUMIDITE 4-20MA COMMUTATEUR CMS SPNO MICRORUPTEUR V4 LEVIER MOTEUR PAS A PAS 1.8DEG. 5V MOTEUR PAS A PAS 1.8DEG. 12V LENTILLE ROUGE LENTILLE VERTE LENTILLE JAUNE STYLO FLUX SANS PLOMB 9G VENT. 80MM FAIBLE BRUIT 115V VENT. FAIBLE BRUIT 119MM 115V VENTILATEUR 80MM 115VCA VENTILATEUR 135MM 24VCC VENTILATEUR 180MM 24VCC VENTILATEUR 220MM 24VCC VENTILATEUR 80MM 24VCC VENTILATEUR 120MM 24VCC VENTILATEUR 120MM 12VCC VENTILATEUR 80MM 24VCC VENTILATEUR 92MM 12VCC VENTILATEUR 92MM 115VCA CONT. DE VITESSE DE VENTILATEUR 24V/48V CABLE CA +E 1500MM CABLE 1 VENTILATEUR 610MM VENTILATEUR 40MM 12VCC VH/WSS VENTILATEUR 40MM 24VCC H VENTILATEUR 40MM 24VCC H/WSS VENTILATEUR 40MM 24VCC VH/WSS VENTILATEUR FLAT PACK 12VCC VENTILATEUR 150MM 12VCC VENTILATEUR 119MM PLAT 115VCA VENTILATEUR 119MM 12VCC VENTILATEUR. 135MM 12V C.C VENTILATEUR 172MM 115VCA VENTILATEUR D´EXTRACTION 175MM VENTILATEUR. 92MM 12V C.C VENTILATEUR 80MM 115VCA VENTILATEUR 119MM 115VCA VENTILATEUR 119MM 230VCA VENTILATEUR TANGENTIEL 230MM 12V VENTILATEUR 365MM 12V BOITE DISQUE CDX20 ALIMENTATION EXTERNE 45W ALIMENTATION EXTERNE 45W ALIMENTATION EXTERNE 45W ALIMENTATION EXTERNE 36W ALIMENTATION EXTERNE 36W ALIMENTATION EXTERNE 36W ALIMENTATION EXTERNE 36W CONVERTISSEUR N/A MULTIPLICATEUR QUAD 0.4% 10MHZ AMPLIFICATEUR D´INSTRUMENTATION CONVERTISSEUR A/N 24 BITS CMS EMETTEUR/RECEPTEUR DE BUS CMS CONVERTISSEUR AN 12 BITS AMPLI OP CMS DOUBLE FAIBLE PUIS. COMMUTATEUR SPST QUAD PAPER SET & CARTRIDGE,ADHESIV PK25 CONVERTISSEUR N/A 12 BITS AVEC FUSIBLE CONVERTISSEUR N/A 12 BITS CNA DDS 50 MHZ SERIE 5V CMS POTENTIOMETRE NUMERIQUE QUAD 100K CMS POTENTIOMETRE NUMERIQUE DOUBLE 10K CMS CONVERTISSEUR N/A 10 BITS QUADRUPLE CONVERTISSEUR N/A 12 BITS QUAD 2.5V CONVERTISSEUR N/A 12 BITS CONVERTISSEUR N/A 12 BITS QUADRUPLE AMPLI DIFFERENTIEL HI COM MODE VOLT AMPLI DIFFERENTIEL HI COM MODE VOLT CONVERTISSEUR N/A 12 BITS QUAD 2.5V DRIVER LCD QUAD +24V CMS AMPLI OP QUAD RAIL/RAIL CMS CONVERTISSEUR A/N 12 BITS CONVERTISSEUR A/N 16 BITS CMS IC,DAC,8BIT,11.8MSPS,DIP-16 CONVERTISSEUR N/A 8 BITS CONVERTISSEUR N/A 12 BITS AMPLI OP CMS QUAD FAIBLE PUIS. AMPLI OP QUAD FAIBLE BRUIT CMS CONVERTISSEUR N/A 16 BITS PORT DSP CONVERTISSEUR A/N 24 BITS CMS AMPLI OP RETOUR DE COURANT MICROCONTROLEUR 8 BITS+CAN 12 BITS CMS TRANSMITTER 4-20MA SOIC16 694 TRANSMETTEUR RS232 TRANSMETTEUR RS232 CIRCUIT DAS 12 BITS CMS AMPLI OP DOUBLE BIFET AMPLI OP FET VENTILATEUR 30MM FAIBLE BRUIT 5VCC VENTILATEUR 80MM PLAT 230VCA VENTILATEUR 80MM 230VCA VENTILATEUR 120MM 115VCA VENTILATEUR 80MM 115VCA VENTILATEUR 80MM 230VCA VENTILATEUR 92MM 115VCA VENTILATEUR 92MM 230VCA VENTILATEUR 80MM 115VCA VENTILATEUR 119MM 230VCA VENTILATEUR 119MM 115VCA VENTILATEUR 119MM 230VCA TRIMMER 100R TRIMMER 500R TRIMMER 1K TRIMMER 2K TRIMMER 100K TRIMMER 200K TRIMMER 500K TRIMMER 100R TRIMMER 200R TRIMMER 500R TRIMMER 1K TRIMMER 20K TRIMMER 50K TRIMMER 100K TRIMMER 200K TRIMMER 500K TRIMMER 100R TRIMMER 500R TRIMMER 1K TRIMMER 2K TRIMMER 20K TRIMMER 500K TRIMMER 1M TRIMMER 100R TRIMMER 200R TRIMMER 2K TRIMMER 24 TOURS 200R TRIMMER 24 TOURS 500R TRIMMER 24 TOURS 2K TRIMMER 24 TOURS 50K TRIMMER 24 TOURS 100K TRIMMER 24 TOURS 200K TRIMMER 24 TOURS 200R TRIMMER 24 TOURS 500R TRIMMER 24 TOURS 2K TRIMMER 24 TOURS 20K TRIMMER 24 TOURS 50K TRIMMER 24 TOURS 200K TRIMMER 24 TOURS 1M TRIMMER 24 TOURS 200R TRIMMER 24 TOURS 20K TRIMMER 24 TOURS 1M TRIMMER 24 TOURS 100R TRIMMER 24 TOURS 200R TRIMMER 24 TOURS 500R TRIMMER 24 TOURS 1K TRIMMER 24 TOURS 2K TRIMMER 24 TOURS 20K TRIMMER 24 TOURS 500K TRIMMER 20 TOURS 5K TRIMMER 20 TOURS 10K TRIMMER 20 TOURS 200K TRIMMER 20 TOURS 100R TRIMMER 20 TOURS 2K TRIMMER 20 TOURS 50K TRIMMER 20 TOURS 100K TRIMMER 20 TOURS 200K TRIMMER 20 TOURS 1M POTENTIOMETRE 500R POTENTIOMETRE 2K5 POTENTIOMETRE 50K POTENTIOMETRE 500R POTENTIOMETRE 2K5 POTENTIOMETRE 5K POTENTIOMETRE 25K POTENTIOMETRE 500R POTENTIOMETRE 1K POTENTIOMETRE 10K POTENTIOMETRE 50K POTENTIOMETRE 1K POTENTIOMETRE 2K5 TRIMMER 20 TOURS 200R TRIMMER 20 TOURS 2K TRIMMER 20 TOURS 500K TRIMMER 20 TOURS 1M TRIMMER. 200R TRIMMER 2K TRIMMER 20K TRIMMER 50K TRIMMER. 1M Tools,Sets Hex bits PHOTOTRANSISTOR CMS CABLE 9842 150M CABLE 8102 150M CABLE 8104 150M CABLE 8164 150M SEMICONDUCTOR ((NW)) HEAT GUN NOZZLE HEAT GUN NOZZLE SELF DE MODE COMMUN 2X200Z SELF DE MODE COMMUN CANBUS 4X600Z SELF DE MODE COMMUN CANBUS 4X1000Z SELF DE MODE COMMUN 2X200Z SELF DE MODE COMMUN 2X200Z SELF DE MODE COMMUN 2X1000Z SELF DE MODE COMMUN 2X600Z SELF DE MODE COMMUN 2X600Z SELF DE MODE COMMUN 2X800Z TOOLS,TAPS,WRENCH,SOLID-JAW TAP WRENC RESISTANCE 0.2W 0.1% 350R RESISTANCE 0.33W 0.1% 2K RESISTANCE 0.33W 0.1% 20K RESISTANCE 0.33W 0.1% 100K RESISTANCE 0.2W 0.1% 50R RESISTANCE 0.2W 0.1% 100R CABLE ID MARKERS,SELF LAM,1IN X 2.25IN,WHT,PK1000 CABLE/WIRE MARKING LABELS CABLE ID MARKERS CABLE/WIRE MARKING LABELS Thermal Transfer Label Printer Tape Widt PRINTER RIBBON,HYBRID WAX/RESIN,BLK,110MM W Thermal Transfer Label Printer Tape Widt SELF-LAMINATING CABLE ID MARKERS,25.4MM W CABLE ID MARKERS,SELF LAMINATING,25.4MM W,WHT,PK2500 SELF LAMINATING CABLE ID MARKERS HOOK & LOOP CABLE FASTENER TAK-TAPE HOOK & LOOP CABLE TIE ROLLS + 1 DC MOTORIZED IMPELLER,220 X 71MM,24V CONCEPT Series Sloped Top Enclosure ENCLOSURE,HAND HELD,PLASTIC,BLACK PCB,3-Hole Pads PCB,PAD / HOLE,2 SIDES ENCLOSURE,HAND HELD,PLASTIC,BLACK AXIAL FAN,40MM,24VDC DIN 41612 PCB CONNECTOR,PLUG,64WAY RJ FIELD ETHERNET CONN,JACK,8WAY PANEL SWITCH,ROTARY,BCD,100mA MICROCONTROLEUR 8 BITS CMS CRIMP TOOL,0.05-0.6MM CRIMP TOOL,0.2-1MM,C/MNL PINCE SE SERTIR 2- 1.0MM U/MNL CRIMP TOOL,HD20,HDP20 CRIMP TOOL,0.5-2.1MM,U/MNL MACHOIRE SDE HDP-22 MACHOIRE MINI U/MNL MINI CPC MACHOIRE MINI U/MNL MINI CPC MACHOIRE SDE U/MNL TOOL HANDLE AND HEAD MACHOIRE SDE U/MNL CRIMP DIE,58630-1 CRIMP TOOL EXTRACTION TOOL,POWER BAND EXTRACTION TOOL,MODULE INDICATEUR A LED JAUNE 12V IP67 INDICATEUR A LED RED 24V IP67 INDICATEUR A LED JAUNE 24V IP67 INDICATEUR A LED VERT 24V IP67 INDICATEUR A LED BLEU 24V IP67 DVD DE TEST AUDIO VIDEO PAL DVD DE TEST AUDIO VIDEO NTSC INDICATEUR ROUGE 230V LED INDICATEUR AMBRE 230V LED INDICATEUR BLEU 230V LED INDICATEUR ROUGE 230V LED INDICATEUR VERT 230V LED INDICATEUR AMBRE 230V LED INDICATEUR TRANSP. 230V LED INDICATEUR VERT 230V LED INDICATEUR AMBRE 230V LED BARRETTE DE PICOTS VERROU. PQT10 CONNECTEUR ATCA BACKPLANE CAPOT + INSERT MALE 4A ENTREE SUPERIEURE CAPOT + INSERT FEMELLE 4A EN LIGNE CAPOT + INSERT MALE 3A ENTREE LATERALE CAPOT + INSERT MALE 4A ENTREE LATERALE EMBASE + INSERT FEMELLE COUDE 3A EMBASE + INSERT FEMELLE COUDE 4A EMBASE +INSERT FEMELLE 6E EMBASE +INSERT FEMELLE 16E CAPOT+INSERT MALE 6E ENTREE LATERALE CAPOT+INSERT MALE 6E ENTREE SUPERIEURE CAPOT+INSERT MALE 10E ENTREE SUPERIEURE CAPOT+INSERT MALE 16E ENTREE LATERALE CAPOT+INSERT MALE 24E ENTREE SUPERIEURE CAPOT + INSERT FEMELLE 6E EN LIGNE CAPOT + INSERT FEMELLE 24E EN LIGNE BOITIER DE SURFACE+INSERT FEMELLE 6E BOITIER DE SURFACE+INSERT FEMELLE 16E BOITIER DE SURFACE+INSERT FEMELLE 24E DRIVER,NUT,CUSHION GRIP,1/4INX76MM DRIVER,NUT,CUSHION GRIP,5/16INX76MM Vandal Resistant Switch PRESSURE SENSOR Pressure Sensor NOYAU TOROIDE 15MM NOYAU TOROIDE 16MM NOYAU DE FERRITE 10MM NOYAU DE FERRITE 13MM NOYAU DE FERRITE 3.5MM NOYAU DE FERRITE 5.0MM NOYAU 6.35MM ID NOYAU 7.0MM ID NOYAU 9.0MM ID NOYAU 9.5MM ID CONNECTEUR ETHERNET M12 COMMUTATEUR RAIL INDUSTRIEL BOUCHON FEMELLE FICHE ANGLAISE 3A AVEC FUSIBLE BOITIER FASTIN FASTON 3P COSSE FASTIN FASTON PQ25 PINCE FASTIN FASTON EMBASE SMT COUDEE 2 VOIES EMBASE SMT COUDEE 3 VOIES EMBASE SMT COUDEE 4 VOIES EMBASE SMT COUDEE 8 VOIES CONNECTEUR POUR CARTE SIM FICHE MALE USB TYPE-B BLINDE 2M FICHE MALE PANNEAU 4 VOIES MACHON SERIE 102 RF/Coaxial Connector RF/COAXIAL,BNC PLUG,STR,50 OHM,CRIMP PINCE AMPEREMETRIQUE TRMS COUPE-CIRCUIT THERMIQUE 10A RELAIS DE PUISSANCE POUR CI DPCO 12V 8A RELAIS DE PUISSANCE POUR CI DPCO 24V 8A RELAIS DE PUISSANCE POUR CI 5V 5A RELAIS DE PUISSANCE POUR CI 24V 5A MODULE RELAIS 24VCC 6A MODULE RELAIS 24VCC 6A RELAIS PUISS. POUR CI HORIZ N/O 12V 16A RELAIS PUISS. POUR CI HORIZ N/O 24V 16A RELAIS CI SERIE RY 5V 8A RELAIS CI SERIE RYA 24V 8A HEAT SINK TRANSMETTEUR CMS CAN 3.5 DIGIT CMS AMPLI OP DOUBLE CMOS CMS 15.0V QUAD SPST CMS TRANSMETTEUR RS232 TRANSMETTEUR RS232 TRANSMETTEUR RS232 TRANSMETTEUR RS232 COMMUTATEUR 1X SPST 3V CMS COMMUTATEUR ANALOGIQUE DOUBLE SPST CMS COMMUTATEUR QUAD SPST DRIVER DE PONT EN H CONVERTISSEUR DC/DC REGULATEUR A DECOUPAGE MICROPOWER REFERENCE DE TENSION 1.2V CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 LOGIQUE CMOS 4000 LOGIQUE CMOS 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 REGULATEUR AJUSTABLE 1.2-37V CMS CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 4000 CIRCUIT LOGIQUE CMOS SERIE 74HC CIRCUIT LOGIQUE CMOS SERIE 74HC CIRCUIT LOGIQUE CMOS SERIE 74HC CIRCUIT LOGIQUE CMOS SERIE 74HC CIRCUIT LOGIQUE CMOS SERIE 74HC REGULATEUR +5.0V 7805 TO-220-3 REGULATEUR +12V CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 LOGIQUE CMOS 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 CIRCUIT LOGIQUE CMS CMOS SERIE 4000 LOGIQUE CMOS 4000 CIRCUIT DE RESET POUR MICROCONTROLEUR CIRCUIT DOUBLE DRIVER MOSFET CIRCUIT LOGIQUE CMS SERIE 74HC CIRCUIT LOGIQUE CMS SERIE 74HC CIRCUIT LOGIQUE CMS SERIE 74HC CIRCUIT LOGIQUE CMS SERIE 74HC CONTACT,FEMALE,12-10AWG,CRIMP CIRCULAR CABLE SEAL 10.16-22.2MM SIZE 17 CONTACT,PIN,20-14AWG,CRIMP PLUG & SOCKET HOUSING,RECEPTACLE,NYLON PLUG & SOCKET HOUSING,PLUG,NYLON CIR CONNECTOR PLUG SIZE 17 14POS FREE HANGING CIR CONNECTOR PLUG SIZE 17 16POS FREE HANGING CIRCULAR CONNECTOR RCPT SIZE 17,16POS,PANEL CIRCULAR CONNECTOR RCPT,SIZE 17,3POS,PANEL CONTACT,PIN,24-18AWG,CRIMP CONTACT,PIN,26-22AWG,CRIMP CIR CONNECTOR RCPT SIZE 17 16POS FREE HANGING CIRCULAR CONNECTOR RCPT,SIZE 11,4POS,PANEL CIR CONNECTOR RCPT SIZE 11,4POS FREE HANGING CIR CONNECTOR PLUG SIZE 13,9POS FREE HANGING CIR CONNECTOR RCPT SIZE 11,4POS FREE HANGING FLANGE SEAL,AMP CIRCULAR PLASTIC CONN FLANGE SEAL,AMP CIRCULAR PLASTIC CONN WIRE-BOARD CONNECTOR HEADER 5POS,2.54MM WIRE-BOARD CONNECTOR HEADER 6POS,2.54MM WIRE-BOARD CONNECTOR HEADER 7POS,2.54MM SENSOR CABLE,FEMALE,4POS,STRAIGHT Proximity Sensor LIMIT SWITCH,SIDE ROTARY,DPST-1NO/1NC LIMIT SWITCH,SIDE ROTARY,4PST-2NC/2NO LIMIT SWITCH OPERATING HEAD LIMIT SWITCH OPERATING HEAD LIMIT SWITCH OPERATING HEAD LIMIT SWITCH OPERATING HEAD SWITCH ACTUATOR SWITCH ACTUATOR SWITCH ACTUATOR LIMIT SWITCH,SIDE ROTARY,DPDT LIMIT SWITCH MECHANISM LIMIT SWITCH BODY LIMIT SWITCH BODY SEAL PROTECTOR,CIRCULAR CONNECTOR SEAL PROTECTOR,CIRCULAR CONNECTOR PLUG & SOCKET HOUSING,PLUG,NYLON CIR CONNECTOR PLUG SIZE 17 16POS FREE HANGING PLUG & SOCKET HOUSING,RECEPTACLE,NYLON PLUG & SOCKET HOUSING,PLUG,NYLON CIRCULAR CONNECTOR RCPT SIZE 17,14POS,PANEL CIRCULAR CONNECTOR RCPT,SIZE 11,4POS,PANEL JEU DE TOURNEVIS EN COFFRET PLAT/PH/PZ JEU DE TOURNEVIS EN COFFRET POZIDRIV TOURNEVIS TORX TX25 TOURNEVIS TORX TX30 TOURNEVIS TORX TX40 STYLO DE CABLAGE TRESSE A DESSOUDER Switches,Microswitch SWITCH,ROCKER,DPST,12A,250V,BLACK SWITCH,ROCKER,DPDT,12A,250V,BLACK SWITCH,ROCKER,SPST,3A,250V,BLACK SWITCH,ROCKER,SPST,3A,250V,BLACK SWITCH,ROCKER,SPST,20A,250V,BLACK SWITCH,ROCKER,SPDT,20A,250V,BLACK SWITCH,ROCKER,SPDT,20A,250V,BLACK SWITCH,ROCKER,SPDT,20A,250V,BLACK CAPACITOR PP FILM,1000PF,2000V,10%,RADIAL CAPACITOR PP FILM 0.01UF,275V,10%,RADIAL CAPACITOR PP FILM 0.01UF,3KV,10%,AXIAL CAPACITOR PP FILM 0.01UF,630V,10%,RADIAL CAPACITOR PP FILM 0.1UF,275V,10%,RADIAL CAPACITOR PP FILM 0.1UF,275V,10%,RADIAL CAPACITOR PP FILM 0.1UF,1.2KV,10%,AXIAL CAPACITOR PP FILM 0.1UF,2KV,10%,AXIAL CAPACITOR PP FILM 0.1UF,3KV,10%,AXIAL CAPACITOR PP FILM 0.1UF,850V,10%,AXIAL CAPACITOR PP FILM 1UF,775V,10%,RADIAL CAPACITOR PP FILM 1UF,575V,10%,RADIAL CAPACITOR PP FILM 1UF,1.15KV,10%,RADIAL CAPACITOR PP FILM 1UF,275V,10%,RADIAL CAPACITOR PP FILM 1UF,600V,10%,AXIAL CAPACITOR PP FILM 1UF,630V,10%,RADIAL CAPACITOR ALUM ELEC 1UF 50V 20%,AXIAL CAPACITOR ALUM ELEC 1UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 1UF,350V,20%,AXIAL CAPACITOR ALUM ELEC 1UF,450V,20%,AXIAL CAPACITOR PP FILM 10UF,475V,10%,RADIAL CAPACITOR PP FILM 10UF,400V,10%,AXIAL CAPACITOR ALUM ELEC 10UF,35V,20%,AXIAL CAPACITOR ALUM ELEC 10UF,50V,20%,AXIAL CAPACITOR ALUM ELEC 10UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 10UF,250V,20%,AXIAL CAPACITOR ALUM ELEC 10UF,450V,20%,AXIAL CAPACITOR ALUM ELEC 100UF,400V,20%,SNAP-IN CAPACITOR ALUM ELEC 100UF,25V,20%,AXIAL CAPACITOR ALUM ELEC 100UF,35V,20%,AXIAL CAPACITOR ALUM ELEC 100UF,350V,20%,AXIAL CAPACITOR ALUM ELEC 100UF,450V,20%,AXIAL CAPACITOR ALUM ELEC 1000UF,80V,20%,SNAP-IN CAPACITOR ALUM ELEC 1000UF 200V 20%,SNAP-IN CAPACITOR ALUM ELEC 1000UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 1000UF,35V,20%,AXIAL CAPACITOR ALUM ELEC 1000UF,50V,20%,AXIAL CAPACITOR ALUM ELEC 1000UF,63V,20%,AXIAL CAPACITOR ALUM ELEC 1000UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 10000UF 25V 20%,SNAP-IN CAPACITOR ALUM ELEC 10000UF 35V 20%,SNAP-IN CAPACITOR ALUM ELEC 10000UF 63V 20%,SNAP-IN CAPACITOR ALUM ELEC 10000UF,10V,20%,AXIAL CAPACITOR ALUM ELEC 10000UF,16V,20%,AXIAL CAPACITOR PP FILM 1.2UF,475V,10%,RADIAL CONDENSATEUR 200V CAPACITOR POLY FILM,1500PF,10000V,10%,AXIAL CAPACITOR PP FILM 0.15UF,275V,10%,RADIAL CAPACITOR PP FILM 15UF,250V,10%,AXIAL CAPACITOR PP FILM 15UF,400V,10%,AXIAL CAPACITOR ALUM ELEC 150UF,450V,20%,SNAP-IN CAPACITOR ALUM ELEC 1500UF,25V,20%,AXIAL CAPACITOR ALUM ELEC 1500UF,50V,20%,AXIAL CAPACITOR ALUM ELEC 15000UF 63V 20%,SNAP-IN CAPACITOR ALUM ELEC 15000UF,16V,20%,AXIAL CAPACITOR PP FILM 2UF,400V,10%,AXIAL CAPACITOR PP FILM 2UF,600V,10%,AXIAL CAPACITOR PP FILM 20UF,250V,10%,AXIAL CAPACITOR PP FILM 0.022UF,275V,10%,RADIAL CAPACITOR PP FILM 0.22UF,275V,10%,RADIAL CAPACITOR PP FILM 0.22UF,275V,10%,RADIAL CAPACITOR PP FILM 0.22UF,1.2KV,10%,AXIAL CAPACITOR PP FILM 0.22UF,2KV,10%,AXIAL CAPACITOR PP FILM 2.2UF,575V,10%,RADIAL CAPACITOR PP FILM 2.2UF,275V,10%,RADIAL CAPACITOR ALUM ELEC 2.2UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 2.2UF,450V,20%,AXIAL CAPACITOR ALUM ELEC 22UF,35V,20%,AXIAL CAPACITOR ALUM ELEC 22UF,50V,20%,AXIAL CAPACITOR ALUM ELEC 22UF,250V,20%,AXIAL CAPACITOR ALUM ELEC 22UF,450V,20%,AXIAL CAPACITOR ALUM ELEC 220UF,200V,20%,SNAP-IN CAPACITOR ALUM ELEC 220UF,250V,20%,SNAP-IN CAPACITOR ALUM ELEC 220UF,350V,20%,SNAP-IN CAPACITOR ALUM ELEC 220UF,400V,20%,SNAP-IN CAPACITOR ALUM ELEC 220UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 220UF,250V,20%,AXIAL CAPACITOR ALUM ELEC 2200UF 100V 20%,SNAP-IN CAPACITOR ALUM ELEC 2200UF,50V,20%,AXIAL CAPACITOR PP FILM 2.5UF,475V,10%,RADIAL CAPACITOR PP FILM 25UF,250V,10%,AXIAL CAPACITOR PP FILM 3UF,400V,10%,AXIAL CAPACITOR PP FILM 0.33UF,275V,10%,RADIAL CAPACITOR ALUM ELEC 3.3UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 33UF,25V,20%,AXIAL CAPACITOR ALUM ELEC 33UF,160V,20%,AXIAL CAPACITOR ALUM ELEC 33UF,450V,20%,AXIAL CAPACITOR ALUM ELEC 330UF,200V,20%,SNAP-IN CAPACITOR ALUM ELEC 330UF,50V,20%,AXIAL CAPACITOR ALUM ELEC 330UF,100V,20%,AXIAL CAPACITOR ALUM ELEC 3300UF,25V,20%,AXIAL CAPACITOR ALUM ELEC 3300UF,35V,20%,AXIAL CAPACITOR PP FILM 4UF,775V,10%,RADIAL CAPACITOR PP FILM 4UF,575V,10%,RADIAL CAPACITOR PP FILM 4UF,400V,10%,AXIAL CAPACITOR PP FILM 4UF,600V,10%,AXIAL CAPACITOR PP FILM 40UF,250V,10%,AXIAL CAPACITOR PP FILM,4700PF,275V,10%,RADIAL CAPACITOR PP FILM 0.047UF,275V,10%,RADIAL CAPACITOR PP FILM 0.047UF,2KV,10%,AXIAL CAPACITOR PP FILM 0.047UF,1.6KV,10%,RADIAL CAPACITOR PP FILM 0.047UF,250V,10%,RADIAL CAPACITOR PP FILM 0.47UF,775V,10%,RADIAL CAPACITOR PP FILM 0.47UF,275V,10%,RADIAL CAPACITOR PP FILM 0.47UF,275V,10%,RADIAL CAPACITOR PP FILM 0.47UF,850V,10%,AXIAL CAPACITOR ALUM ELEC 0.47UF,100V,20%,AXIAL CAPACITOR PP FILM 4.7UF,400V,10%,AXIAL CAPACITOR ALUM ELEC 4.7UF,50V,20%,AXIAL CAPACITOR ALUM ELEC 4.7UF,350V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,25V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,250V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,350V,20%,AXIAL CAPACITOR ALUM ELEC 47UF,450V,20%,AXIAL CAPACITOR ALUM ELEC 4700UF,35V,20%,SNAP-IN CAPACITOR ALUM ELEC 4700UF,80V,20%,SNAP-IN CAPACITOR ALUM ELEC 4700UF,16V,20%,AXIAL CAPACITOR ALUM ELEC 4700UF,35V,20%,AXIAL CAPACITOR PP FILM 5UF,250V,10%,AXIAL CAPACITOR PP FILM 5UF,400V,10%,AXIAL CAPACITOR PP FILM 0.068UF,275V,10%,RADIAL CAPACITOR PP FILM 0.68UF,775V,10%,RADIAL CAPACITOR PP FILM 0.68UF,400V,10%,AXIAL CAPACITOR PP FILM 6.8UF,400V,10%,AXIAL CAPACITOR ALUM ELEC 680UF,200V,20%,SNAP-IN CAPACITOR ALUM ELEC 6800UF,50V,20%,SNAP-IN CAPACITOR ALUM ELEC 6800UF,35V,20%,AXIAL CAPACITOR PP FILM 8UF,475V,10%,RADIAL CONDENSATEUR 200V SWITCH,PUSHBUTTON,SPST,150mA SWITCH,PUSHBUTTON,SPST,150mA SWITCH,PUSHBUTTON,SPST,150mA REDUNDANCY MODULE MICROCONTROLEUR FLASH 32KB ISP CMS MICROCONTROLEUR FLASH 64KB ISP CMS MICROCONTROLEUR FLASH 64KB ISP CMS MICROCONTROLEUR FLASH 64KB ISP + CAN CMS MICROCONTROLEUR FLASH 64KB ISP + CAN CMS MICROCONTROLEUR FLASH 64K MEMOIRE FLASH 128K ISP RAPIDE CMS MEMOIRE FLASH 128K ISP RAPIDE CMS MEMOIRE FLASH 128K ISP RAPIDE CMS FUSIBLE 100A SOLENOID 24VDC SUPPORT DE FUSIBLE 1.1/4´´ X 1/4´´ SOLENOID 12VDC SOLENOID 24VDC SOLENOIDE 12VCC SOLENOID 24VDC FUSIBLE RAPIDE 500MA FUSIBLE RAPIDE 1A FUSIBLE RAPIDE 7A CAPACITOR CERAMIC,100PF,3000V,X7R,20%,RAD RELAY SOCKET HOLD-DOWN CLIP EMBASE MOULEE 12 VOIES 1800 EMBASE MOULEE 12 VOIES 1800 EMBASE MOULEE 15 VOIES 1800 EMBASE MOULEE 15X2 VOIES 1800 EMBASE MOULEE 15X2 VOIES 1800 EMBASE VERTICAL 3 VOIES EMBASE VERTICAL 2X8 VOIES EMBASE COUDEE 4 VOIES EMBASE COUDEE 5 VOIES EMBASE COUDEE 6 VOIES EMBASE COUDEE 2 X 3 VOIES EMBASE CMS 10 VOIES 2.54MM RECTANGULAR HAN INSERT,PLUG 48WAY SCREW RECTANGULAR HAN INSERT,FEM,48WAY SCREW BULKHEAD HOUSING,SIZE 48B,METAL SUPPORT DE FUSIBLE NH CONDENSATEUR 2700UF 6.3V CONDENSATEUR 3900UF 6.3V CONDENSATEUR 5600UF 6.3V CONDENSATEUR 6800UF 6.3V CONDENSATEUR 180UF 10V CONDENSATEUR 6800UF 10V CONDENSATEUR 220UF 35V CONDENSATEUR 330UF 35V CONDENSATEUR 18UF 50V CONDENSATEUR 1F 5.5V CONDENSATEUR 1000UF 6.3V CONDENSATEUR 1000UF 16V CONDENSATEUR 470UF 25V CONDENSATEUR 1000UF 35V CONDENSATEUR 22UF 50V CONDENSATEUR 47UF 50V CONDENSATEUR 100UF 50V CONDENSATEUR 470UF 50V CONDENSATEUR 1UF 100V CONDENSATEUR 1UF 400V CONDENSATEUR 10UF 35V CONDENSATEUR 47UF 35V CONDENSATEUR 1UF 50V CONDENSATEUR 470UF 50V CONDENSATEUR 10UF 63V CONDENSATEUR 220UF 63V CONDENSATEUR 2.2UF 250V CONDENSATEUR 1UF 450V INDUCTANCE 26MH SWING DOOR/FRONT PLATE 5 CONDENSATEUR 33UF 250V CONDENSATEUR 0.47F 5.5V CONDENSATEUR 1F 5.5V EEPLD ISP MACH4 CPLD ISP MACH4000 CONTROLEUR ISP DRILL/TAP COMBO M3X0.5 DRILL/TAP COMBO M5X0.8 DRILL/TAP COMBO M6X1.0 DRILL/TAP COMBO M8X1.25 DRILL/TAP COMBO M10X1.5 DRILL/TAP SET M3-M10 ROTARY BURR SET,TC,3PC ROTARY BURR SET,TC,10PC STEP DRILL SET,HSS,CBN STEP DRILL SET,HSS,CBN TUBE/SHEET DRILL SET,HSS,CBN DEBUR COUNTERSINK SET,TAPER,HSS,CBN TWIST DRILL,DIN1897,HSS-G CO5,3MM TWIST DRILL,DIN1897,HSS-G CO5,3.2MM TWIST DRILL,DIN1897,HSS-G CO5,3.3MM TWIST DRILL,DIN1897,HSS-G CO5,3.8MM TWIST DRILL,DIN1897,HSS-G CO5,4MM TWIST DRILL,DIN1897,HSS-G CO5,4.2MM TWIST DRILL,DIN1897,HSS-G CO5,4.5MM TWIST DRILL,DIN1897,HSS-G CO5,5MM TWIST DRILL,DIN1897,HSS-G CO5,5.5MM TWIST DRILL,DIN1897,HSS-G CO5,6MM TWIST DRILL,DIN1897,HSS-G CO5,6.8MM TWIST DRILL,DIN1897,HSS-G CO5,7MM TWIST DRILL,DIN1897,HSS-G CO5,7.5MM TWIST DRILL,DIN1897,HSS-G CO5,8MM TWIST DRILL,DIN1897,HSS-G CO5,10MM TWIST DRILL,DIN1897,HSS-G CO5,10.5MM TWIST DRILL,DIN1897,HSS-G CO5,12MM TWIST DRILL,DIN1897,HSS-G CO5,13MM AFFICHEUR A LED VERT 4.5D EXTENSION CARTE ASURO BOOK,ASURO,GERMAN LANGUAGE VERSION THERMISTANCE NTC THERMISTANCE NTC THERMISTANCE NTC THERMISTANCE NTC OPTOCOUPLEUR CMS ENTREE AC OPTOCOUPLEUR CMS ENTREE AC OPTOCOUPLEUR CMS ENTREE AC OPTOCOUPLEUR CMS SORTIE DARLINGTON OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE TRANSISTOR OPTOCOUPLEUR CMS SORTIE LOGIQUE OPTOCOUPLEUR CMS SORTIE DARLINGTON OPTOCOUPLEUR CMS 1MB SORTIE TRANSISTOR OPTOCOUPLEUR SORTIE TRANSISTOR OPTOCOUPLEUR SORTIE TRIAC LED INFRAROUGE CMS LED INFRAROUGE CMS LED INFRAROUGE CMS PHOTOTRANSISTOR CMS PHOTOTRANSISTOR CMS CONDENSATEUR 47UF 6.3V CONDENSATEUR 10UF 10V CONDENSATEUR 22UF 16V CONDENSATEUR 68UF 16V CONDENSATEUR 100UF 16V CONDENSATEUR 1UF 25V CONDENSATEUR 6.8UF 25V CONDENSATEUR 10UF 25V CONDENSATEUR 22UF 25V CONDENSATEUR 1UF 35V CONDENSATEUR 10UF 35V CONDENSATEUR 22UF 35V ALIMENTATION TEMP. VAR. PRISE UK 80W CAPACCITOR CERAMIC 560PF,6000V,Y5U,20%,RAD CAPACITOR CERAMIC 5000PF,400V,Y5V,20%,RAD CAPACITOR CERAMIC,3300PF,6000V,Z5U,20%,RAD CAPACITOR CERAMIC 6.8PF 1000V,C0G,0.5pF,RAD High Voltage Ceramic Disc Capacitor PANNE POUR WSP80 PANNE POUR WSP80 PANNE POUR WSP80 PANNE POUR WSP80 PANNE POUR FER WSP80 QUARTZ 3.276800MHZ QUARTZ 4.194304MHZ QUARTZ 6.000000MHZ QUARTZ 6.144000MHZ QUARTZ 6.553600MHZ QUARTZ 3.686400MHZ EMBASE JACK 6.35 LONGUE 2P OSCILLATEUR A QUARTZ 64.000000MHZ QUARTZ 2.000000MHZ QUARTZ 12MHZ QUARTZ 14.318180MHZ QUARTZ 9.830400MHZ QUARTZ 24.000000MHZ QUARTZ 7.372800MHZ QUARTZ 4.608000MHZ QUARTZ 8MHZ QUARTZ 14.745600MHZ QUARTZ 16MHZ QUARTZ WATCH B 32.768KHZ QUARTZ 3.579545MHZ QUARTZ 3.686400MHZ QUARTZ 4MHZ QUARTZ 4.915200MHZ QUARTZ 12MHZ QUARTZ 11.059200MHZ QUARTZ 11.059200MHZ QUARTZ CMS 3.579545MHZ QUARTZ CMS 3.686400MHZ QUARTZ CMS 4MHZ QUARTZ CMS 4.915200MHZ QUARTZ CMS 12.000000MHZ QUARTZ CMS 32.768000KHZ 12.5PF OSCILLATEUR A QUARTZ CMS 13.000000MHZ QUARTZ CMS 6.00MHZ QUARTZ CMS 11.0592MHZ OSCILLATEUR A QUARTZ CMS 10.0MHZ OSCILLATEUR A QUARTZ CMS 8MHZ OSCILLATEUR A QUARTZ CMS 10MHZ OSCILLATEUR A QUARTZ CMS 14.318 OSCILLATEUR A QUARTZ CMS 16.384 OSCILLATEUR A QUARTZ CMS 20MHZ OSCILLATEUR A QUARTZ CMS 24MHZ OSCILLATEUR A QUARTZ CMS 40MHZ OSCILLATEUR A QUARTZ CMS 50MHZ OSCILLATEUR A QUARTZ CMS 60MHZ OSCILLATEUR A QUARTZ CMS 100MHZ OSCILLATEUR A QUARTZ CMS 16MHZ OSCILLATEUR A QUARTZ CMS 20MHZ QUARTZ 16MHZ QUARTZ CMS 4MHZ QUARTZ CMS 8MHZ QUARTZ CMS 3.579545MHZ VENTILATEUR 170MM FORT DEBIT 115VCA VENTILATEUR 80MM FORT DEBIT 230VCA VENTILATEUR 120MM FORT DEBIT 115VCA VENTILATEUR 40MM STANDARD 12VCC VENTILATEUR 60MM 12VCC VENTILATEUR 80MM PLAT 12VCC VENTILATEUR 120MM PLAT 24VCC VENTILATEUR 92MM FORT DEBIT VENTILATEUR 120MM FORT DEBIT VENTILATEUR 120MM FORT DEBIT VENTILATEUR 40MM ULTRA-PLAT SUPPORT FER MLR21 VENTILATEUR 80MM PLAT VENTILATEUR 120MM PLAT SUPPORT FER WSP80 ALLUMAGE PIEZO RESONATEUR SAW 433.92MHZ FILTRE SAW 433.92MHZ REGULATEUR DE TENSION AJUST. AMPLI. MOSFET THERMOMETRE NUMERIQUE 2 FILS TRANCEIVER RS485/RS422 TRANSCEIVER RS-232 TRANCEIVER RS485/RS433 CIRCUIT DE RESET CMS 6326 SOT-23-3 CIRCUIT DE RESET CMS 6326 SOT-23-3 SUPERVISEUR DE TENSION CMS AMPLI. OP. DOUBLE RAIL/RAIL I/O AMPLI. OP. L/N RAIL/RAIL REFERENCE DE TENSION 4.096V CONVERTISSEUR DC/DC CMS 1676 SOIC10 CONVERTISSEUR DC/DC CONVERTISSEUR DC/DC CIRCUIT DE SUPERVISION CIRCUIT DE SUPERVISION CIRCUIT DE SUPERVISION CIRCUIT DE SUPERVISION CIRCUIT DE SUPERVISION TRANSCEIVER CMS TRANSCEIVER CMS THERMOMETRE NUMERIQUE 18S20 TO-92-3 SUPERVISEUR CIRCUIT 1818 SOT-23-3 SUPERVISEUR CIRCUIT 1818 SOT-23-3 SUPERVISEUR CIRCUIT 1813 SOT-23-3 SUPERVISEUR CIRCUIT 1813 SOT-23-3 CIRCUIT DE SUPERVISION MPU FICHE HR10 FEMELLE VIS 12P TRANCEIVER QUAD RS232 TRANSCEIVER DOUBLE TRANSCEIVER DE BUS CMOS REGULATEUR STEP-DOWN FAIBLE TENSION CMS TRANSCEIVER RS-232 5V TRANSCEIVER RS-485/RS-422 TRANSCEIVER AVEC SHUTDOWN TRANCEIVER RS-232 TRANSCEIVER RS-232 3232 SOIC16 TRANSCEIVER RS-485/422 TRANCEIVER RS-485/422 SUPERVISEUR CIRCUIT 6301 SOIC8 COMPARATEUR RAPIDE RECTIFIEUR SYNCHRONE AMPLIFICATEUR RADIO AMPLI. OP. DOUBLE RAIL/RAIL OP CAPTEUR MICRO-PUISSANCE CAPTEUR MICRO-PUISSANCE DETECTEUR DE TENSION DOUBLE TRANSCEIVER CMS SOIC16 202 DOUBLE TRANSCEIVER CMS SOIC16 232 CONVERTISSEUR N/A DOUBLE 12 BITS MICRO MONITOR CMS 1813 SOT-23-3 MICRO MONITOR CMS 1813 SOT-23-3 CONTROLEUR N/A 8 BITS AVEC R2R THERMOMETRE NUMERIQUE RTC TRICKLE CHARGE 1302 SOIC8 IC SM LCD BIAS SUPPLY CONTROLEUR N/A 8 BITS SUPERVISEUR DE MICRO CMS CLIP 16 VOIES HDR/SKT CLIP 26 VOIES HDR/SKT CUTTER,TOP,OBLIQUE,CONDUCTIVE PLIER,SNIPE NOSE,CONDUCTIVE PLIER,SNIPE NOSE,CONDUCTIVE CONNECTEUR POUR PILE 3 POS 1.2MM CONNECTEUR POUR PILE 3 POS 2.3MM CONNECTEUR POUR PILE 5 POS 1.2MM CONNECTEUR POUR PILE 5 POS 1.8MM LECTEUR DE CARTE SIM 1.6MM EMBASE FEMELLE 72 VOIES 2.54MM SECABLE JUMPERS 254MM BLACK DIN41612 MALE C64 BARRETTES MALE 2.5MM 10VOIES BARRETTES MALE 2.5MM COUDEE 4 VOIES BARRETTES MALE 2.5MM COUDEE 6 VOIES BARRETTES MALE 2.5MM COUDEE 10 VOIES BARRETTE MALE 3.96MM 4 VOIES BARRETTE MALE 3.96MM 6 VOIES BARRETTE MALE 3.96MM 8 VOIES BARRETTE MALE 3.96MM 10 VOIES BARRETTE MALE KK COUDEE 2.54MM 2 VOIES BARRETTES MALE 2.5MM COUDEE 12VOIES EMBASE. COUDE. 20 VOIES EMBASE. VERTICAL. 2 VOIES EMBASE. COUDE. 4 VOIES EMBASE DROITE 6 VOIES BOITIER FEMELLE 4 VOIES EMBASE IDC 16 VOIES CONTACT FEMELLE 22-24AWG EMBASE 1 RANGEE VERT 6 VOIES EMBASE 1 RANGEE 90 DEGRES COUDE 2 VOIES EMBASE 1 RANGEE 90 DEGRES 15 VOIES EMBASE 1 RANGEE 90 DEGRES 20 VOIES EMBASE 2 RANGEES 90 DEGRES 14 VOIES EMBASE 2 RANGEES 90 DEGRES 10 VOIES EMBASE 2 RANGEES 90 DEGRES 14 VOIES CONTACT FEMELLE 4.57MM EMBASE DVI-I COUDEE EMBASE ASSEMBLEE MINIFIT 24 VOIES ADAPTATEUR CI 20 BROCHES ET MOINS ADAPTATEUR CI 28 BROCHES ET PLUS ADAPTATEUR CI SN 8 BROCHES ADAPTATEUR CI SO 18 BROCHES ADAPTATEUR CI SO 28 BROCHES ADAPTATEUR CI PLCC 44 BROCHES ADAPTATEUR CI SSOP 28 BROCHES ADAPTATEUR CI UNIVERSEL 16-28 BROCHES LED MIDGET 12V BLANC LED MIDGET 24V BLANC LED MIDGET 28V BLANC LED MIDGET 12V BLANC LED MIDGET 24V BLANC LED MIDGET 28V BLANC LED T5.5 24V BLANC LED T6.8 24V BLANC LED T6.8 28V BLANC LED BA9 12V BLANC LED BA9 24V BLANC INDICATEUR A LED 24V JAUNE LED 3MM CI ROUGE LED 3MM CI JAUNE LED 3MM CI VERT LED 3MM CI ROUGE/VERT LED 3MM CI ROUGE X4 LED 3MM CI VERT X4 LED 5MM CI ROUGE+VERT INDICATEUR A LED JAUNE 12VCC INDICATEUR A LED ROUGE 24VCC INDICATEUR A LED JAUNE 24VCC INDICATEUR A LED VERT 24VCC INDICATEUR A LED ROUGE 110VCA INDICATEUR A LED VERT 110VCA INDICATEUR A LED SUPER ROUGE 12VCC INDICATEUR A LED ROUGE 24VCC INDICATEUR A LED SUPER ROUGE 24VCC INDICATEUR A LED JAUNE 24VCC INDICATEUR A LED ROUGE 240VCA INDICATEUR A LED SUPER ROUGE 240VCA INDICATEUR A LED VERT 240VCA INDICATEUR A LED JAUNE 12VCC INDICATEUR A LED VERT 12VCC INDICATEUR A LED JAUNE 12VCC INDICATEUR A LED ROUGE 24VCC INDICATEUR A LED VERT 24VCC INDICATEUR A LED JAUNE 24VCC LED A BAYONNETTE BA9 ROUGE LED A BAYONNETTE BA9 VERT LED A BAYONNETTE BA9 BLEU LED A BAYONNETTE BA9 BLANC LED 3MM CI JAUNE LED 3MM CI VERT LED 3MM CI ROUGE X2 LED 3MM CI JAUNE X2 LED 3MM CI VERT X2 LED 3MM CI VERT X4 LED 3MM CI 5V ROUGE LED 3MM CI 5V VERT INDICATEUR A LED JAUNE INDICATEUR A LED ROUGE INDICATEUR A LED VERT INDICATEUR A LED JAUNE LED MIDGET ROUGE LED MIDGET VERT LED MIDGET JAUNE LED MIDGET ROUGE LED MIDGET VERT LED A BAYONNETTE BA9 ROUGE LED A BAYONNETTE BA9 VERT LED T5.5 12V VERT LED T5.5 24V ROUGE LED T5.5 24V VERT LED T6.8 24V ROUGE LED T6.8 24V VERT LED T6.8 24V JAUNE INDICATEUR A LED ROUGE INDICATEUR A LED JAUNE INDICATEUR A LED VERT INDICATEUR A LED SUPER ROUGE INDICATEUR A LED ROUGE INDICATEUR A LED VERT INDICATEUR A LED VERT LED 3MM CI JAUNE LED 3MM CI ROUGE LED 3MM CI JAUNE LED 3MM CI VERT BANANA JACK,15A,CRIMP/SOLDER,RED RESISTOR,WIREWOUND,2 OHM,5W,1% CAPACITOR CERAMIC 3.3PF 1000V,C0G,0.5pF,RAD TECHNICIAN TOOL KIT,31 PCS. SENSOR CONNECTOR,M12,RECEPTACLE,4POS,SHIELDED CIRCULAR CONNECTOR,PLUG,4POS,CABLE FILTRE TRIPHASE 16A 480V THERMISTANCE CTN THERMISTANCE CTN THERMISTANCE CTN FILTRE 3A CHASSIS FILTRE 10A CHASSIS FILTRE 3A CHASSIS FILTRE 3A CHASSIS FILTRE 2A CHASSIS FILTRE 10A CHASSIS FILTRE 6A CHASSIS FILTRE 1A CHASSIS FILTRE 3A CHASSIS FILTRE 2A CHASSIS INDUCTANCE AXIALE 15UH INDUCTANCE AXIALE 9.0UH INDUCTANCE AXIALE 6.0UH INDUCTANCE AXIALE 11UH INDUCTANCE AXIALE 4.0UH SELF DE CHOC DOUBLE 0.011MH SELF DE CHOC DOUBLE 0.051MH SELF DE CHOC DOUBLE 1.0MH SELF DE CHOC DOUBLE 4.7MH THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP THERMISTANCE CTP INDUCTANCE AXIALE 22UH INDUCTANCE 1A 900Z THERMISTANCE CTN AMPLI. OP. RAIL/RAIL SUPERVISEUR D´ALIMENTATION CMS CIRCUIT LOGIQUE SERIE 74HCT CMOS CIRCUIT LOGIQUE SERIE 74HC CMOS CIRCUIT LOGIQUE SERIE 74HC CMOS CIRCUIT LOGIQUE SERIE 74HC CMOS CIRCUIT LOGIQUE SERIE 74HC CMOS CIRCUIT LOGIQUE SERIE 4000 CMOS CIRCUIT LOGIQUE SERIE 4000 CMOS MICROCONTROLEUR 8 BITS OTP 1K MICROCONTROLEUR 8 BITS OTP 2K MICROCONTROLEUR 8 BITS OTP 2K AMPLI. OP. DOUBLE RAIL/RAIL AMPLI. OP. RAIL/RAIL AMPLI. OP. RAIL/RAIL AMPLI. OP. RAIL/RAIL MEMOIRE NVRAM/RTCC 512BX8 IIC COMPARATEUR DE TENSION DIP8 311 COMPARATEUR DOUBLE DIP8 393 REGULATEUR AJUST +1.2/37V TO-220-3 317 REGULATEUR +5.0V 7805 TO-220-3 REGULATEUR -12V 7912 TO-220-3 MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MEMOIRE EEPROM 64K SERIE MEMOIRE EEPROM 64K SERIE MEMOIRE EEPROM T&R 64K MEMOIRE EEPROM T&R 64K MEMOIRE EEPROM 128 OCTETS SERIE MEMOIRE EEPROM 128 OCTETS SERIE MEMOIRE EEPROM 128 OCTETS SERIE MEMOIRE EEPROM 1K SERIE MEMOIRE EEPROM 1K SERIE MEMOIRE EEPROM 1K SERIE MEMOIRE EEPROM 2K SERIE EEPROM SERIE 2K 24LC02 SOIC8 EEPROM SERIE 2K 24LC02 SOT-23-5 EEPROM SERIE 2K 24LC02 SOT-23-5 EEPROM SERIE 128K 24LC128 DIP8 EEPROM SERIE 128K 24LC128 SOIC8 EEPROM SERIE 16K 24LC16 SOIC8 EEPROM SERIE 16K 24LC16 DIP8 EEPROM 16K EEPROM 16K EEPROM SERIE 256K 24LC256 DIP8 EEPROM SERIE 256K 24LC256 SOIJ8 EEPROM SERIE 256K 24LC256 SOIC8 MEMOIRE EEPROM 32K SERIE EEPROM SERIE 32K 24LC32 SOIC8 EEPROM SERIE 512K 24LC512 DIP8 EEPROM SERIE 512K 24LC512 SOIC8 MEMOIRE EEPROM 512K SERIE PAGE 64 OCTETS EEPROM SERIE 64K 24LC64 DIP8 MEMOIRE EEPROM 64K SERIE EEPROM SERIE 64K 24LC64 SOIC8 MEMOIRE EEPROM SMART 64K SERIE MEMOIRE EEPROM SMART 64K SERIE MEMOIRE EEPROM 4K SERIE MEMOIRE EEPROM 4K SERIE MEMOIRE EEPROM 16K SERIE MEMOIRE EEPROM 16K SERIE MEMOIRE EEPROM 32K SERIE EEPROM SERIE 64K 25LC640 DIP8 EEPROM SERIE 64K 25LC640 SOIC8 EEPROM SERIE 1K CMS 93C46 SOIC8 EEPROM SERIE 1K CMS 93C46 SOIC8 MEMOIRE EEPROM 1K SERIE MEMOIRE EEPROM SERIE 1K 93LC46 DIP8 MEMOIRE EEPROM SERIE 1K 93LC46 SOIC8 MEMOIRE EEPROM SERIE 1K 93LC46 SOIC8 MEMOIRE EEPROM 2K SERIE MEMOIRE EEPROM 2K SERIE MEMOIRE EEPROM 4K SERIE MEMOIRE EEPROM 4K SERIE MEMOIRE EEPROM 4K SERIE MEMOIRE EEPROM 4K SERIE MICROCONTROLEUR 16 BITS DSP 30MIPS ENCODEUR KEELOQ CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CONTROLEUR IRDA CONTROLEUR IRDA CONTROLEUR CAN CONTROLEUR CAN HI SPEED TRANSCEIVER CAN CMS 2551 CONVERTISSEUR A/N 16 BITS DIP CONVERTISSEUR N/A 8 BITS 100MSPS CMS CONVERTISSEUR A/N 12 BITS AMPLI. OP. CMOS AMPLI OP CMOS RRSORTIE SOT-23-5 601 AMPLI OP CMOS RRSORTIE SOT-23-5 601 AMPLI. OP. CMOS DOUBLE AMPLI. OP. DOUBLE CMOS AMPLI OP CMOS RRSORTIE CMS SOIC8 602 AMPLI. OP. CMOS AMPLI. OP. CMOS DOUBLE AMPLI. OP. CMOS QUAD AMPLI. OP. QUAD CMOS AMPLI. OP. QUAD CMOS AMPLI. OP. RAIL-RAIL 650KHZ CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR CIRCUIT SUPERVISEUR MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS FUSIBLE NH GL 200A MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS CMS FUSIBLE NH GL 250A MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS FUSIBLE NH GL 315A FUSIBLE NH GL 400A MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS FUSIBLE NH UR 125A MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS PORTE FUSIBLE 5X20MM MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS OTP MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH + CAN CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH + CAN CMS MICROCONTROLEUR 8 BITS FLASH + CAN MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH + CAN MICROCONTROLEUR 8 BITS FLASH + CAN CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH + CAN CMS MICROCONTROLEUR 8 BITS FLASH + CAN MICROCONTROLEUR 8 BITS FLASH + CAN CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS MICROCONTROLEUR 8 BITS FLASH CMS REGULATEUR LDO +1.8V REGULATEUR LDO +1.8V TEMP VERS VOLT CONVTR CMS 1047 REGULATEUR LDO +3.3V REGULATEUR LDO +3.3V CIRCUIT SUPERVISEUR DE MICROCONTR CMS DRIVER DE MOSFET 6A MOSFET DRV SIMPLE MOSFET DRV SIMPLE MOSFET DRV DOUBLE DRIVER MOSFET 1.5A DOUBLE DRIVER FET DOUBLE 1.5A DRIVER MOSFET 1.5A DOUBLE DRIVER FET DOUBLE 1.5A DRIVER MOSFET 1.5A DOUBLE DRIVER FET DOUBLE 1.5A MICROPROCESSEUR ANALOGIQUE CAPTEUR DE TEMP. NUMERIQUE CAPTEUR DE TEMP. NUMERIQUE CONVERTISSEUR DE TENSION CONVERTISSEUR DC/DC CONVERTISSEUR DC/DC CMS 7662 SOIC8 AMPLI. OP. DOUBLE CONVERTISSEUR F/T-T/F RESET MONITOR 4.63V SOT-23B-3 809 RESET MONITOR 4.63V SOT-23B-3 809 RESET MONITOR 2.63V,SOT-23B-3,809 RESET MONITOR 2.63V,SOT-23B-3,809 RESET MONITOR 2.93V SOT-23B-3 809 RESET MONITOR 2.93V SOT-23B-3 809 RESET MONITOR 3.08V SOT-23B-3 809 RESET MONITOR 3.08V SOT-23B-3 809 RESET MONITOR 2.32V,SC-70-3,809 RESET MONITOR 2.32V,SC-70-3,809 OPTICAL SENSOR,PHOTOTRANSISTOR FERRITE CORE,CYLINDRICAL TOOLS,RATCHET CRIMP FERRITE CORE,CYLINDRICAL,58OHM/100MHZ,1GHZ RESISTOR POWER FILM,10 OHM,60W,1% RESISTOR,CURRENT SENSE,10 OHM,25W,1% OPTICAL SENSOR,PHOTOTRANSISTOR N CHANNEL MOSFET,50V,1.7A,DIP P CHANNEL MOSFET,-50V,1.1A,HD-1 P CHANNEL MOSFET,-60V,1.6A,HD-1 P CH MOSFET,-100V,1.1A,SOT-223 MOSFET P CHANNEL MOSFET,-50V,9.9A,D-PAK N CHANNEL MOSFET,50V,15A TO-220AB N CHANNEL MOSFET,50V,30A TO-220AB DUAL N CHANNEL MOSFET,50V,3A DUAL N CHANNEL MOSFET,30V,6.5A DUAL N CHANNEL MOSFET,55V,4.7A DUAL P CHANNEL MOSFET,-55V,3.4A DUAL N/P CHANNEL MOSFET,55V,SOIC P CHANNEL MOSFET,-30V,11A,SOIC MOSFET P CH MOSFET,-50V,18A,TO-220AB N CHANNEL MOSFET,55V,3.8A SOT-223 N CHANNEL MOSFET,20V,6.5A,MICRO6 N CHANNEL MOSFET,100V,28A,D2-PAK N CH MOSFET,30V,150A,TO-220AB FERRITE BEAD,0.7OHM,300mA,0805 FERRITE CORE,CYLINDRICAL,82OHM/100MHZ,300MHZ FERRITE BEAD,0.0011OHM,5A CIRCUIT BREAKER,THERMAL,1P,240V,10A CIRCUIT BREAKER,THERMAL,1P,240V,5A LABEL,WARNING,2INX0.75IN,1000PCS Self Laminating Cable ID Markers LABEL,WARNING,2INX0.5IN,160PCS LABEL,WARNING,0.625IN DIA,200PCS LABEL,WARNING,1.75INX0.625IN,144PCS FERRITE BEAD,0.2OHM,450mA,1206 FERRITE CORE,CYLINDRICAL,140 OHM/100MHZ,300MHZ FERRITE CORE,CYLINDRICAL,336OHM/100MHZ,300MHZ FERRITE CORE,CYLINDRICAL,1KOHM/100MHZ,500MHZ RESISTANCE DECADE BOX,0 - 99999999.9 OHM RESISTANCE DECADE BOX,0 TO 9999999 OHM RESISTANCE DECADE BOX,0 - 99999999.9 OHM DECADE BOX,0-9999999 OHM / 0 uF-99.9999 uF FERRITE CORE,CYLINDRICAL,121OHM/100MHZ,300MHZ SWITCH,VANDAL RESISTANT,SPDT,5A,250V SWITCH VANDAL RESISTANT SPST-NO/NC 100mA FERRITE BEAD,AXIAL LEADED FERRITE BEAD,0.004OHM,5A FERRITE CORE,CYLINDRICAL,180 OHM/100MHZ,300MHZ NTC THERMISTOR FERRITE CORE,CYLINDRICAL,102OHM/100MHZ,1GHZ FERRITE CORE,CYLINDRICAL,391OHM/100MHZ,300MHZ FERRITE CORE,CYLINDRICAL,110 OHM/100MHZ,300MHZ FERRITE CORE,CYLINDRICAL,53OHM/100MHZ,300MHZ FERRITE BEAD,0.025OHM,5A,1206 SIGNAL RELAY,DPDT,5VDC,2A,PCB CONVERTISSEUR N/A 12 BITS QUADRUPLE CMS REGULATEUR LDO +3.3V 1117 SOT-223-3 REGULATEUR LDO +3.3V 1117 SOT-223-3 RECEPTEUR LVDS 66MHZ REGULATEUR LDO +3.0V CMS 2985 SOT235 REGULATEUR LDO +3.0V CMS 2985 SOT235 REGULATEUR LDO +5.0V REGULATEUR LDO +5.0V REGULATEUR 5A REGULATEUR AJUST. 1.24-30V REGULATEUR AJUST. 1.24-30V THERMOSTAT PROG 2 SORTIES THERMOSTAT PROG 2 SORTIES AMPLI. OP. TRES FAIBLE BRUIT AMPLI. OP. TRES FAIBLE BRUIT REFERENCE DE TENSION AJUSTABLE 0.1% REFERENCE DE TENSION DE PREC. 0.1% 1.2V REFERENCE DE TENSION DE PREC. 0.2% 1.2V REFERENCE DE TENSION DE PREC. 0.2% 1.2V PANNE POUR FER WT50 [PAIRE] UPROC SUPERVISEUR SOT-23-3 809 UPROC SUPERVISEUR SOT-23-3 809 PANNE WT50 BRUCELLES 3.0MM [PAIRE] REGULATEUR ULTRA-LDO +2.5V CMS 3961 REGULATEUR ULTRA-LDO +2.5V CMS 3961 REFERENCE DE TENSION DE PRECISION 5.0V REFERENCE DE TENSION DE PRECISION 5.0V REGULATEUR CMS 1A AMPLI. OP. BICMOS AMPLI. OP. BICMOS REGULATEUR CMS AJUST. REGULATEUR CMS 1.5A PANNE POUR FER WT50 [PAIRE] PANNE POUR FER WT50 [PAIRE] CIRCUIT DE RESET CMS CIRCUIT DE RESET CMS CIRCUIT DE RESET CMS CAPTEUR DE TEMP 2.7V CMS SOT-23-3 CAPTEUR DE TEMP 2.7V CMS SOT-23-3 AMPLIFICATEUR DE COURANT DOUBLE AMPLIFICATEUR DE COURANT DOUBLE REGULATEUR LDO 0.8A +2.5V CMS 1117 REGULATEUR LDO CMS CAPTEUR DE TEMP ANALOG SC-70-5 2.4V REGULATEUR AJUST +1.2/37V SOT-223-3 317 REGULATEUR LDO 400MA CMS REGULATEUR LDO 400MA CMS REGULATEUR CMS CONTROLEUR DE PUISSANCE CONVERTISSEUR DC/DC CONVERTISSEUR DC/DC CONVERTISSEUR DC/DC CONVERTISSEUR DC/DC CIRCUIT DE CONTROLE DE TENSION CIRCUIT DE CONTROLE DE TENSION EMBASE FEMELLE 8 VOIES 6A REGULATEUR LDO 2.5V 300MA REGULATEUR LDO 3.0V 300MA REGULATEUR LDO 3.0V 300MA CONVERT DE TENSION CMS 2664 SOT-23-6 CONVERTISSEUR A/N 12 BITS 8 CANAUX CMS CONVERTISSEUR A/N 12 BITS 8 CANAUX CMS CONVERTISSEUR A/N 16 BITS CMS REGULATEUR LDO +5.0V REGULATEUR LDO +5.0V REGULATEUR LDO +3.3V REGULATEUR LDO +3.3V ALIMENTATION REGLABLE 0-30V 0-3A 90W FICHE MALE BAS PROFIL 6 POLES FICHE MALE BAS PROFIL 9 POLES Controller IC Package/Case:28-CDIP SERIAL CABLE ASSEMBLY SOFTWARE SOFTWARE Hall Effect Switch IC Hall Effect Switch IC Current Transformer OPTION ENREGISTREUR POUR SCOPIX SONDE DIFFERENTIELLE 2 VOIES SONDE DIFFERENTIELLE 2 VOIES SONDE DIFFERENTIELLE 1 VOIE FICHE FEMELLE IEEE1394 R/A CI FICHE FEMELLE USB MINI-B SMT JEU DE CLES POCKETSTAR (TORX. SL. PH) JEU DE 11 EMBOUTS (SL. PH. PZ) JEU DE 11 EMBOUTS (PZ. TORX) JEU DE 31 EMBOUTS XL (SL/PH/PZ) TOURNEVIS TORX T7 MAGICSPRING TOURNEVIS TORX T8 MAGICSPRING TOURNEVIS TORX T15 MAGICSPRING HEXAGON BIT SET,SYSTEM 4,16PC JEU DE LAME REVERSIBLE + POIGNEE EMBOUT FENTE 0.8X5.5. 25MM TORSION EMBOUT FENTE 1.0X5.5. 25MM TORSION EMBOUT FENTE 8.0. 25MM TORSION EMBOUT PH3 25MM TORSION EMBOUT PZ3 25MM TORSION EMBOUT TORX T27 25MM TORSION EMBOUT TORX T30 25MM TORSION EMBOUT TORX T40 25MM TORSION EMBOUT PH3 50MM TORSION EMBOUT PZ3 50MM TORSION EMBOUT PH2 25MM DURA EMBOUT PH3 25MM DURA EMBOUT PZ1 25MM DURA EMBOUT PZ2 25MM DURA EMBOUT PZ3 25MM DURA EMBOUT TORX T15 25MM DURA EMBOUT TORX T25 25MM DURA EMBOUT TORX T30 25MM DURA PULLER,FAST CLAMPING,2 ARM PULLER,FAST CLAMPING,2 ARM PULLER,FAST CLAMPING,2 ARM PULLER,UNIVERSAL,2 ARM,SLIM HOOKS PULLER,UNIVERSAL,2 ARM,SLIM HOOKS SOCKET SET,1/4 SOCKET SET,1/2 SOCKET SET,1/4 SHEAR SET,FOR PLASTIC PIPES SPARE BLADE HAMMER,RECOILLESS HAMMER,RECOILLESS HAMMER,CLUB,DIN 6475 TOURNEVIS DYNAMOMETRIQUE 1-13.6NM TORQUE WRENCH,TSC SLIPPER,2-10NM SPANNER,OPEN JAW,4X5MM SPANNER,OPEN JAW,8X9MM SPANNER,OPEN JAW,10X11MM SPANNER,OPEN JAW,10X13MM SPANNER,OPEN JAW,11X13MM SPANNER,OPEN JAW,12X14MM SPANNER,OPEN JAW,16X18MM SPANNER,OPEN JAW,17X19MM SPANNER,OPEN JAW,18X19MM SPANNER,OPEN JAW,19X24MM SPANNER,OPEN JAW,21X23MM SPANNER,OPEN JAW,21X24MM SPANNER,OPEN JAW,24X27MM SPANNER,OPEN JAW,30X32MM SPANNER,OPEN JAW,30X34MM SPANNER,OPEN JAW,34X36MM SOCKET DRIVER,1/2´´DRV,HEXAGON,4MM SOCKET DRIVER,1/2´´DRV,HEXAGON,5MM SOCKET DRIVER,1/2´´DRV,HEXAGON,6MM SOCKET DRIVER,1/2´´DRV,HEXAGON,10MM SOCKET DRIVER,1/2´´DRV,HEXAGON,12MM SOCKET DRIVER,1/2´´DRV,TORX,25MM SOCKET DRIVER,1/2´´DRV,TORX,27MM SOCKET DRIVER,1/2´´DRV,TORX,30MM SOCKET DRIVER,1/2´´DRV,TORX,40MM SOCKET DRIVER,1/2´´DRV,TORX,45MM SOCKET DRIVER,3/8´´DRV,HEXAGON,4MM SOCKET DRIVER,3/8´´DRV,HEXAGON,5MM SOCKET DRIVER,3/8´´DRV,HEXAGON,6MM SOCKET DRIVER,3/8´´DRV,HEXAGON,7MM SOCKET DRIVER,3/8´´DRV,HEXAGON,8MM SOCKET DRIVER,3/8´´DRV,HEXAGON,10MM SOCKET DRIVER,3/8´´DRV,TORX,25MM SOCKET DRIVER,3/8´´DRV,TORX,30MM SOCKET DRIVER,1/4´´DRV,HEXAGON,3MM SOCKET DRIVER,1/4´´DRV,HEXAGON,4MM SOCKET DRIVER,1/4´´DRV,HEXAGON,5MM SOCKET DRIVER,1/4´´DRV,HEXAGON,6MM SOCKET DRIVER,1/4´´DRV,HEXAGON,8MM SOCKET DRIVER,1/4´´DRV,TORX,8MM SOCKET DRIVER,1/4´´DRV,TORX,20MM SOCKET DRIVER,1/4´´DRV,TORX,27MM SOCKET DRIVER,1/4´´DRV,TORX,30MM SOCKET DRIVER SET,3/8´´ AND 1/4´´ RATCHET,REVERSIBLE,1/2´´ RATCHET,REVERSIBLE,1/2´´ RATCHET,REVERSIBLE,1/4´´ RATCHET,REVERSIBLE,1/4´´ RATCHET,1/4´´ RATCHET,REVERSIBLE,3/8´´ RING SPANNER SET,12PC RING SPANNER SET,8PC BOUTON-POUSSOIR BOUTON-POUSSOIR METALLIQUE BOUTON-POUSSOIR METALLIQUE INTERRUPTEUR CMS PUSH IP67 INTERRUPTEUR CMS PUSH IP40 INTERRUPTEUR CMS PUSH IP40 INTERRUPTEUR PUSH PIEZO M22 NATUREL INTERRUPTEUR PUSH PIEZO M30 BOUTON-POUSSOIR MOMENTANE BOUTON-POUSSOIR MOMENTANE BOUTON-POUSSOIR MOMENTANE BOUTON-POUSSOIR MOMENTANE MODULE SIMPLE C/O RELAIS (S1) MODULE SORTIE LINEAIRE MA/V CC (S2&3) MODULE ENTREE POINT REGL. A DISTANCE Transceiver IC IC,ANALOG SWITCH,QUAD,SPST,DIP-16 Inductor INDUCTOR,50UH,2.6A,±20% Inductor Inductor Inductor Inductor Inductor Inductor INDUCTOR,SHIELDED,6UH,16.5A,SMD POWER INDUCTOR,10UH,355MA,20% POWER INDUCTOR,4.7UH,530MA,20% POWER INDUCTOR,10UH,250MA,20% POWER INDUCTOR,22UH,165MA,20% RESISTOR,WIREWOUND,1 OHM,5W,1% CAPACITOR CERAMIC 200PF,1000V,X5F,10%,RAD CAPACITOR CERAMIC,2200PF,3000V,Z5U,20%,RAD GENERATEUR DE FONCTIONS,DDS TESTER,LOOP+RCD DIODE TVS 1500W 33V DIODE TVS 1500W 47V DIODE TVS 1500W 6.8V DIODE SCHOTTKY 1A 20V DIODE SCHOTTKY 1A 30V DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 3A 40V DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY DIODE SCHOTTKY PETITS SIGNAUX DIODE SCHOTTKY PETITS SIGNAUX DIODE SCHOTTKY PETITS SIGNAUX DIODE SCHOTTKY PETITS SIGNAUX DIODE SCHOTTKY SOT-23 DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY SOD-232 DIODE SCHOTTKY SOD-232 DIODE SCHOTTKY DOUBLE DIODE SCHOTTKY DOUBLE DIODE TVS DO-15 RESEAU DE DIODES TVS RESEAU DE DIODES TVS DIAC RESEAU DE DIODES TVS DOUBLE 14.2VBD RESEAU DE DIODES TVS DOUBLE 6.1VBD RESEAU DE DIODES TVS QUAD 6.1VBD RESEAU DE DIODES TVS QUAD 6.1VBD RESEAU DE DIODES TVS QUAD 6.1VBD TRANSISTOR MOSFET CANAL N BOITIER TO-220 THYRISTOR 0.2A 200V SOT-23 DIODE DE SUPPRESSION SMC 1500W 100V DIODE TVS SMC 1500W 24V DIODE TVS SMC 1500W 33V DIODE TVS SMC 1500W 33V DIODE DE SUPPRESSION SMC 1500W 36V DIODE DE SUPPRESSION SMC 1500W 39V DIODE DE SUPPRESSION SMC 1500W 39V DIODE TVS SMC 1500W 6.8V DIODE TVS SMB 600W CMS 15V DIODE TVS SMB 600W CMS 15V DIODE DE SUPPRESSION SMB 600W 18V DIODE TVS SMB 600W 18V DIODE TVS SMB 600W 18V DIODE DE SUPPRESSION SMB 600W 27V DIODE DE SUPPRESSION SMB 600W 27V DIODE DE SUPPRESSION SMB 600W 30V DIODE DE SUPPRESSION SMB 600W 33V DIODE DE SUPPRESSION SMB 600W 33V DIODE DE SUPPRESSION SMB 600W 33V DIODE DE SUPPRESSION SMB 600W 36V DIODE DE SUPPRESSION SMB 600W 36V DIODE DE SUPPRESSION SMB 600W 39V DIODE DE SUPPRESSION SMB 600W 39V DIODE DE SUPPRESSION SMB 600W 39V DIODE DE SUPPRESSION SMB 600W 6.8V DIODE DE SUPPRESSION SMB 600W 6.8V DIODE DE SUPPRESSION SMB 600W 7.5V DIODE DE SUPPRESSION SMA 400W 12V DIODE DE SUPPRESSION SMA 400W 12V DIODE DE SUPPRESSION SMA 400W 12V DIODE DE SUPPRESSION SMA 400W 15V DIODE DE SUPPRESSION SMA 400W 15V DIODE DE SUPPRESSION SMA 400W 15V DIODE DE SUPPRESSION SMA 400W 28V DIODE DE SUPPRESSION SMA 400W 28V DIODE DE SUPPRESSION SMA 400W 30V DIODE DE SUPPRESSION SMA 400W 30V DIODE DE SUPPRESSION SMA 400W 33V DIODE DE SUPPRESSION SMA 400W 33V DIODE DE SUPPRESSION SMA 400W 33V DIODE DE SUPPRESSION SMA 400W 5.0V DIODE DE SUPPRESSION SMA 400W 5.0V DIODE TVS SMB 3.3V DIODE TVS SMB 8V DIODE TVS SMB 8V DIODE TVS SMB 100V DIODE TVS SMB 120V DIODE TVS SMB 120V DIODE TVS SMB 130V DIODE TVS SMB 130V DIODE TVS SMB 220V DIODE TVS SMB 220V DIODE TVS SMB 270V DIODE TVS SMB 270V DIODE TVS SMB 62V MOSFET N I-PAK MOSFET N TO-220 MOSFET N TO-220FP MOSFET N TO-220FP MOSFET N TO-220 MOSFET N TO-220 MOSFET N TO-220 TRANSISTOR MOSFET CANAL N BOITIER TO-220 DIODE SCHOTTKY 2X7.5A 35V DIODE SCHOTTKY 2X80A 45V DIODE SCHOTTKY 2X80A 100V DIODE SCHOTTKY 2X10A 25V DIODE SCHOTTKY 2X15A 45V DIODE SCHOTTKY 3A 40V DIODE SCHOTTKY 3A 40V TRIAC 16A 600V D2-PAK TRANSISTOR DARLINGTON BOITIER TO-220 TRANSISTOR NPN TO-220 DIODE SCHOTTKY 1A 40V DIODE SCHOTTKY 1A 60V DIODE SCHOTTKY DIODE SCHOTTKY PONT DE DIODES TVS THYRISTOR 1.4A 600V SOT-223 TRIAC 0.8A 600V BOITIER TO-92 SMALL SIGNAL DIODE 200V 500mA DO-35 SIGNAL RELAY,DPDT,48VDC,3A,THD SIGNAL RELAY,DPDT,24VDC,5A,THD SIGNAL RELAY DPDT 5VDC,3A,THROUGH HOLE SIGNAL RELAY,DPDT,12VDC,3A,THD SIGNAL RELAY,SPDT,24VDC,1A,THD SIGNAL RELAY,DPDT,24VDC,3A,THD SIGNAL RELAY,DPDT,12VDC,5A,THD SIGNAL RELAY DPDT 5VDC,3A,THROUGH HOLE LED CMS PLCC-4 ENVISIUM AMBRE LED CMS PLCC-4 ENVISIUM ROUGE/ORANGE KIT DE SONDE TESTEUR DE RESEAU ADAPTATEUR SC TESTEUR DE QUALIFICATION KIT TESTEUR DE RESEAU KIT TESTEUR DE RESEAU TESTEUR DE CABLE LOCALISATEUR VISUEL DE DEFAUTS CABLE D´EXTENSION CLAVIER/SOURIS PS/2 CABLE D´EXTENSION CLAVIER/SOURIS UBS CLAVIER 4 VOIES CLAVIER 4 VOIES CLAVIER STORM1000 16 VOIES CLAVIER ILLUM 12 TOUCHES TRACKERBALL 2200 SS TRACKBALL CABLE PS2 CLAVIER 2000 4 TOUCHES F CLAVIER 2000 12 TOUCHES CAL CLAVIER 2000 12 TOUCHES TEL CLAVIER 2000 16 TOUCHES CAL CLAVIER 3000 12 TOUCHES TEL CLAVIER 3000 16 TOUCHES TEL ENCODEUR RS232 CLAVIER SERIE 700 4 VOIES GRY CLAVIER SERIE 700 12 VOIES GRY CLAVIER SERIE 700 QWERTY CLAVIER SERIE 700 QWERTY CLAVIER 4 VOIES LUMINEUX CLAVIER 12 VOIES LUMINEUX CLAVIER 16+4 TOUCHES CLAVIER 20 TOUCHES AVEC AFFICHAGE CLAVIER 20 TOUCHES AVEC AFFICHAGE CLAVIER 16+4 TOUCHES CLAVIER 12 TOUCHES INTERRUPTEUR HEX COMPLEMENT HORIZ BASCULE DE COMMUTATEUR ROUGE BASCULE DE COMMUTATEUR JAUNE BASCULE DE COMMUTATEUR VERT BASCULE DE COMMUTATEUR BLEU BASCULE DE COMMUTATEUR ROUGE BASCULE DE COMMUTATEUR VERT BASCULE DE COMMUTATEUR BLEU BASCULE DE COMMUTATEUR NOIR BASCULE DE COMMUTATEUR ROUGE BASCULE DE COMMUTATEUR JAUNE FICHE MALE 4 BROCHES FICHE MALE 7 BROCHES SERRE CABLE 300X7 SERRE CABLE 360X7 SERRE CABLE 225 X 12 SERRE CABLE 610X12 ENDUIT N CH MOSFET,20V,6.2A,SUPER SOT-6 N CHANNEL MOSFET,20V,1.5A,SC-70 SMALL SIGNAL DIODE,100V 200mA SOT-23 TRANSISTOR ARRAY,NPN,5,15V,DIP TVS DIODE,600W,5V,DO-214AA TVS DIODE,600W,90V,DO-214AA TVS DIODE,1.5KW,7.5V,DO-214AB DIODE,SCHOTTKY,1A,30V,DO-41 CAPACITOR CERAMIC 0.03UF,125V,Y5V,20%,RAD BIPOLAR TRANSISTOR,NPN,12V LED Lamp N CH MOSFET,100V,75A,TO-220AB Transistor BIPOLAR TRANSISTOR,PNP,-60V SMALL SIGNAL DIODE,70V 200mA DO-35 Zener Diode OPTOCOUPLER,PHOTOTRANSISTOR,7.5KV ENERGIMETRE TRIPHASE EMBASE COUDEE VERT. LONG 10 VOIES EMBASE COUDEE VERT. LONG 14 VOIES EMBASE COUDEE VERT. LONG 16 VOIES EMBASE COUDEE VERT. LONG 50 VOIES DIODE DOUBLE SOT-23 DIODE DOUBLE SOT-23 DIODE DOUBLE SOT-23 DIODE DOUBLE SOT-23 DIODE DOUBLE SOT-23 DIODE DOUBLE SOT-23 DIODE DOUBLE SOT-23 DIODE DOUBLE SOT-23 DIODE REDRESSEMENT RAPIDE 1A 600V DIODE. USAGE GENERAL SOT-23 DIODE. USAGE GENERAL SOT-23 DIODE TRES RAPIDE DO-35 DIODE TRES RAPIDE DO-35 DIODE TRES RAPIDE LL-34 DIODE TRES RAPIDE LL-34 DIODE FAIBLE FUITE DO-35 DIODE FAIBLE SIGNAL DO-35 DIODE CMS 1.0A 50V DIODE CMS 1.0A 50V DIODE CMS 3A 1000V DIODE CMS 3A 1000V DIODE DE RECOUVREMENT 30A DIODE COMMUTEUR SOT-23 DIODE COMMUTEUR SOT-23 DIODE TVS SMB 600W 30V DIODE TVS SMB 600W 30V DIODE TVS SMB 600W 33V DIODE TVS SMB 600W 33V DIODE TVS SMC 1500W 24V DIODE TVS SMC 1500W 24V DIODE ULTRA RAPIDE SOT-23 DIODE ULTRA RAPIDE SOT-23 DIODE ULTRA RAPIDE SOT-23 DIODE ULTRA RAPIDE SOT-23 DIODE ZENER 1.3W 12V DIODE ZENER 1.3W 13V DIODE ZENER 1.3W 15V DIODE ZENER 1.3W 18V DIODE ZENER 1.3W 24V DIODE ZENER 1.3W 3.3V DIODE ZENER 1.3W 3.6V DIODE ZENER 1.3W 33V DIODE ZENER 1.3W 5.1V DIODE ZENER 1.3W 9.1V DIODE ZENER 350MW 15V DIODE ZENER 350MW 15V DIODE ZENER 350MW 5.6V DIODE ZENER 350MW 5.6V DIODE ZENER 350MW 6.8V DIODE ZENER 500MW 5.1V DIODE ZENER 500MW 9.1V MOSFET DOUBLE NN LOGIC SO-8 MOSFET DOUBLE NN SO-8 TRANSISTOR MOSFET DOUBLE NN SO-8 TRANSISTOR MOSFET DOUBLE NN SO-8 MOSFET,DUAL,NN,SUPERSOT-6 IC,MOSFET,DUAL NP,SUPERSOT-6-6 IC,MOSFET,DUAL NP,SUPERSOT-6-6 TRANSISTOR MOSFET DOUBLE PP LOGIQUE S0-8 MOSFET,DUAL,PP,SUPERSOT-6 MOSFET,DUAL,PP,SUPERSOT-6 TRANSISTOR MOSFET NUMERIQUE N SOT-23 TRANSISTOR MOSFET NUMERIQUE N SOT-23 MOSFET N LOGIQUE TO-92 MOSFET N SO-8 MOSFET N SO-8 TRANSISTOR MOSFET N SOT-23 TRANSISTOR MOSFET N SOT-23 TRANSISTOR MOSFET N SOT-23 TRANSISTOR MOSFET N SOT-23 TRANSISTOR MOSFET N SOT-23 TRANSISTOR MOSFET N SOT-23 TRANSISTOR MOSFET N SOT-23 TRANSISTOR MOSFET N SOT-23 MOSFET N TO-220 MOSFET N TO-220 MOSFET N TO-220 MOSFET N TO-220 MOSFET N TO-3P TRANSISTOR MOSFET P I-PAK TRANSISTOR MOSFET P LOGIC SO-8 MOSFET P LOGIC SOT-223 MOSFET P LOGIC SOT-223 MOSFET P SO-8 TRANSISTOR MOSFET P SO-8 MOSFET P SOT-223 MOSFET P SOT-223 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 TRANSISTOR MOSFET P SOT-23 MOSFET,P,SUPERSOT-6 MOSFET,P,SUPERSOT-6 MOSFET P TO-220 TRANSISTOR NPN SOT-223 TRANSISTOR NPN SOT-223 TRANSISTOR NPN SOT-23 TRANSISTOR NPN SOT-23 TRANSISTOR NPN SOT-23 TRANSISTOR NPN SOT-23 TRANSISTOR NPN TO-92 TRANSISTOR,PNP,SOT-23 KIT DE DEMARAGE PICKIT 2 PROGRAMMATEUR PICKIT 2 POWER RELAY SPST-NO 24VDC,16A,PC BOARD IC,RS-422/RS-423 LINE RX,5.25V,SOIC16 IC,CLOCK DRIVER,100MHZ,SOIC-24 MICRO SWITCH,ROLLER LEVER,SPDT 3A 250V OSCILLATOR,48MHZ,SMD IC,RS-232 TRANSCEIVER,5.5V,TSSOP-16 IC,16BIT MCU,MSP430F1,8MHZ,64-LQFP IC,16BIT MCU,MSP430F4,8MHZ,80-LQFP IC,16BIT MCU,MSP430F4,8MHZ,100-LQFP DIN MOUNTING RAIL,35MM,ALUMINIUM RELAY SOCKET SWITCH,REED,SPDT,500mA,175VDC Power Relay OPTOCOUPLER,SCHMITT TRIGGER,5300VRMS IC DIFFERENTIAL LINE RECEIVER DUAL SOIC8 IC,QUAD AND GATE,2I/P,SOIC-14 IC,D-TYPE FLIP FLOP,DUAL,SOIC-14 Voltage Comparator IC IC,QUAD AND GATE,2I/P,SOIC-14 IC,QUAD NAND GATE,SCHMITT TRIG SOIC-14 IC,NON INVERTING BUFFER,SOIC-20 IC,D-TYPE FLIP FLOP,3-STATE,SOIC-20 IC,NON INVERTING BUS BUFFER,TSSOP-14 IC,DIFF LINE RECEIVER,DUAL 18NS SOIC16 IC,RS-422/RS-485 BUS TXRX,5.25V SOIC-8 Tantalum Capacitor IC,OP-AMP,85KHZ,0.03V/ us,SOIC-14 IC,OP-AMP,85KHZ,0.03V/ us,DIP-14 IC,OP-AMP,85KHZ,0.03V/µs,SOIC-8 IC,OP-AMP,1.7MHZ,3.6V/ us,DIP-8 IC,OP-AMP,1.7MHZ,3.6V/ us,SOIC-14 IC,DIFFERENTIAL COMP,QUAD,200NS DIP14 IC,DIFFERENTIAL COMP,QUAD 200NS SOIC14 IC,DAC,8BIT,143KSPS,SOIC-20 IC,OP-AMP,3MHZ,13V/ us,SOIC-8 CAPACITOR TANT,100UF 16V,0.125 OHM,0.1,2917 Voltage Detector / Microprocessor Superv IC,LDO VOLT REG,3V,50mA,5-SOT-23 IC,LDO VOLT REG,3.3V,50mA,5-SOT-23 IC,USB CONTROLLER,12MBPS,LQFP-64 MICRO SWITCH,PIN PLUNGER,SPDT 15A 250V CAPACITOR CERAMIC 1000PF 1000V,X7R,10%,1206 OPTOCOUPLER,TRANSISTOR,5300VRMS MICRO SWITCH,ROLLER LEVER,SPDT 3A 250V MICRO SWITCH,HINGE LEVER,SPDT 16A 250V MICRO SWITCH,ROLLER LEVER SPDT 16A 250V POWER RELAY,SPDT,240VAC,15A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PC BOARD POWER RELAY,DPDT,24VAC,10A,PLUG IN POWER RELAY,3PDT,24VAC,10A,PLUG IN SIGNAL RELAY SPDT 5VDC,1A,THROUGH HOLE MICRO SW,ROLLER LEVER,SPDT,100mA 125V OPTICAL SENSOR TRANSMISSIVE / SLOTTED INTERRUPTER PCB Relay AUTOMOTIVE RELAY,SPST-NO,12VDC,30A POWER RELAY,DPDT,120VAC,10A,PLUG IN IC,16BIT MCU,MSP430F4,8MHZ,100-LQFP POWER RELAY,4PDT,120VAC,5A,PLUG IN POWER RELAY,4PDT,110VDC,5A,PLUG IN SWITCH,REED,SPST-NO,400mA,170VDC OPTOCOUPLER,SCHMITT TRIGGER,5300VRMS DARLINGTON TRANSISTOR,NPN,100V,TO-220 IC,OP-AMP,1.7MHZ,3.6V/ us,DIP-8 IC,DIFFERENTIAL COMP,DUAL,200NS DIP-8 IC,DIFFERENTIAL COMP,DUAL,200NS DIP-8 IC,RS-232 TRANSCEIVER,15V,SOIC-16 IC,LDO VOLT REG,5V,150mA,8-SOIC MICRO SWITCH,PIN PLUNGER,SPDT 10A 250V MICRO SWITCH,HINGE LEVER,SPDT 15A 250V LENTILLE ROUGE LENTILLE VERTE LENTILLE JAUNE LENTILLE ROUGE LENTILLE VERTE Standard Terminal Block LENTILLE JAUNE OPTOCOUPLER,DARLINGTON,5300VRMS MICRO SWITCH,PIN PLUNGER,SPDT,3A 250V MICRO SWITCH,HINGE LEVER,SPDT,5A 250V POWER RELAY SPST-NO 24VDC,10A,PC BOARD POWER RELAY,SPDT,120VAC,10A,PC BOARD POWER RELAY,DPDT,24VDC,8A,PC BOARD AUTOMOTIVE RELAY,SPDT,24VDC,20A POWER RELAY,SPDT,24VDC,15A,PLUG IN POWER RELAY,DPDT,12VDC,10A,PC BOARD POWER RELAY,DPDT,120VAC,10A,PLUG IN POWER RELAY,4PDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,120VAC,10A,PLUG IN POWER RELAY,4PDT,120VAC,5A,PLUG IN POWER RELAY,4PDT,24VDC,5A,PLUG IN POWER RELAY,SPDT,5VDC,5A,PC BOARD RELAY SOCKET POWER RELAY,SPDT,24VDC,12A,PC BOARD POWER RELAY,SPDT,12VDC,16A,PC BOARD IC,INVERTING BUFFER,SOIC-16 IC,NON INVERTING BUS BUFFER,TSSOP-14 SIGNAL RELAY,SPDT,24VDC,1A,THD IC,MOSFET DRIVER,HIGH CURRENT,TO-220 MICRO SWITCH,PIN PLUNGER,SPDT 15A 250V MICRO SWITCH,HINGE LEVER,SPDT 15A 250V MICRO SWITCH,ROLLER LEVER,SPDT 5A 250V POWER RELAY,DPDT,24VAC,5A,PC BOARD POWER RELAY,SPDT,24VDC,12A,PC BOARD SAFETY RELAY,5PST-NO/SPST-NC,24VDC,6A POWER RELAY,DPDT,240VAC,10A,PLUG IN POWER RELAY,3PDT,120VAC,10A,PLUG IN DIN RAIL END PLATE POWER RELAY,SPDT,115VAC,16A,PC BOARD CAPACITOR TANT,1UF,35V,8 OHM,0.1,RADIAL IC,OP-AMP,1.7MHZ,3.6V/ us,DIP-14 INTERRUPTEUR HEX VERTICAL SIGNAL RELAY,SPDT,12VDC,1A,THD MICRO SWITCH,PIN PLUNGER,SPDT 15A 250V MICRO SWITCH,ROLLER LEVER SPDT 15A 250V VARISTOR,5V,12V,0603 CRYSTAL,4MHZ,THROUGH HOLE WIRE-BOARD CONNECTOR HEADER 4POS,3.96MM WIRE-BOARD CONNECTOR HEADER 5POS,3.96MM RF/COAXIAL,BNC PLUG,STR,50 OHM,SOLDER IC,BATTERY CHARGER LEAD ACID 2A SOIC-16 MICRO SWITCH,ROLLER LEVER,SPDT 3A 250V MICRO SWITCH,ROLLER LEVER,SPDT 5A 250V CAPACITOR PPS FILM 0.01UF,16V,5%,0805 CAPACITOR PPS FILM 100PF,50V,5%,0805 CAPACITOR PPS FILM 220PF,50V,5%,0805 CAPACITOR PPS FILM 470PF,50V,5%,0805 CAPACITOR PPS FILM 0.1UF,16V,5%,1210 POWER RELAY SPST-NO 12VDC,12A,PC BOARD POWER RELAY,SPDT,120VAC,15A,PLUG IN POWER RELAY,SPDT,120VAC,15A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN POWER RELAY,DPDT,24VAC,10A,PC BOARD POWER RELAY,DPDT,24VAC,10A,PLUG IN POWER RELAY,DPDT,24VDC,10A,PLUG IN POWER RELAY,4PDT,24VAC,10A,PLUG IN POWER RELAY,4PDT,240VAC,10A,PLUG IN POWER RELAY,4PDT,120VAC,10A,PLUG IN POWER RELAY,DPDT,12VDC,10A,PLUG IN POWER RELAY,4PDT,240VAC,5A,PLUG IN RELAY SOCKET HOLD-DOWN CLIP SWITCH,REED,SPST-NO,500mA,175VDC POWER RELAY,SPDT,12VDC,12A,PC BOARD POWER RELAY,DPST-NO,12VDC,8A PC BOARD POWER RELAY,DPST-NO,24VDC,8A PC BOARD POWER RELAY,SPDT,24VDC,16A,PC BOARD IC,QUAD NOR GATE,2I/P,SOIC-14 MICRO SWITCH,PIN PLUNGER,SPDT 10A 250V IC,OP-AMP,3MHZ,13V/ us,SOIC-8 IC,FIXED-PT DSP,16BIT,100MHZ LQFP-144 SIGNAL RELAY,SPDT,12VDC,1A,THD SIGNAL RELAY,SPDT,24VDC,1A,THD MICRO SWITCH,PIN PLUNGER,SPDT 10A 250V MICRO SWITCH,ROLLER LEVER SPDT 15A 250V CAPACITOR CERAMIC 0.022UF 50V,X7R,+50, PIN HEADER,2POS,5.08MM LIMIT SWITCH,ROLLER PLUNGER LIMIT SWITCH,PIN PLUNGER CABLE,UNSHLD MULTICOND,4COND,22AWG,100FT,300V LIMIT SWITCH,ROTARY LIMIT SWITCH,ROLLER PLUNGER TEMPORISATEUR DPDT SHLD MULTICOND CABLE,25COND,24AWG,100FT,300V POWER ENTRY MODULE,RECEPTACLE,6A POWER ENTRY MODULE,PLUG,6A POWER RELAY,DPDT,5VDC,5A,PC BOARD TEMPORISATEUR DPDT TEMPORISATEUR 4PDT TEMPORISATEUR 4PDT HOOK-UP WIRE,100FT,22AWG CU ORANGE LED Lamp LED Lamp PIN SHROUD HEADER LOCKING LEVER,TYPE C SHELL HOUSING LEFT LOCKING LEVER TYPE C SHELL HOUSING RIGHT CONTACT,FEMALE,SOLDER CAPACITOR TANT,22UF,35V,0.28 OHM,0.2,SMD CAPACITOR TANT,33UF,35V,0.28 OHM,0.2,SMD ZENER DIODE,500mW,3.3V,DO-35 CONNECTION UNIT,FLEXIBLE OUTLET BRIDGE RECTIFIER,1PH 1.5A 800V SMD CONNECTION UNIT,NEON PUSH SWITCH,10A,1POLE BLANK PLATE BLANK PLATE N CHANNEL MOSFET,100V,75A,TO-247 SURFACE BOX,32MM,1GANG SURFACE BOX,40MM,1GANG SURFACE BOX,30MM,2GANG SURFACE BOX,40MM,2GANG SURFACE BOX,38MM,2GANG RESISTANCE 5W 2R2 N CHANNEL JFET,-25V,SOT-23 BIPOLAR TRANSISTOR,PNP,-30V BIPOLAR TRANSISTOR,PNP,QUAD,-60V SOIC BIPOLAR TRANSISTOR,PNP,-40V,SOIC OPTOISOLATOR,TRIAC,7500VAC RESISTANCE 5W 68R RESISTANCE 5W 100R RESISTANCE 130R 5W RESISTANCE 5W 150R RESISTANCE 5W 1K5 RESISTANCE 5W 4K7 RESISTANCE 5W 6K8 RESISTANCE 5W 15K RESISTANCE 5W 47K RESISTANCE 7W 0R1 RESISTANCE 7W 0R33 RESISTANCE 7W 0R68 RESISTANCE 7W 1R0 CAPACITOR CERAMIC 1000PF 440V,K4000,20%,RAD CAPACITOR CERAMIC 1500PF 1000V,X5F 10%,RAD CAPACITOR CERAMIC 5.6PF 1000V,C0G,0.5pF,RAD CAPACITOR CERAMIC 4700PF,400V,Y5U,20%,RAD RESISTANCE 7W 130R RESISTANCE 7W 470R RESISTANCE 7W 4K7 RESISTANCE 7W 6K8 RESISTANCE 7W 15K EEPROM SERIE 2K CMS 93C56 SOIC8 TRIMMER CMS 1K TRIMMER CMS 2K CIRCUIT PWM MODE COURANT TRIMMER CMS 2K CIRCUIT PWM MODE COURANT DRIVER DEMI-PONT+OSC+DDTIM CMS TRIMMER CMS 5K MEMOIRE EEPROM MICROWIRE 16K CMS TRIMMER CMS 10K EEPROM MICROFIL 4K 93C66 SOIC8 MEMOIRE EEPROM I2C 1K CMS MEMOIRE EEPROM I2C 2K CMS EEPROM I2C 4K CMS 24C04 SOIC8 MEMOIRE EEPROM 8K I2C EEPROM I2C 8K CMS 24C08 SOIC8 TRIMMER CMS 20K TRIMMER CMS 50K TRIMMER CMS 100K TRIMMER CMS 200K TRIMMER CMS 500K TRIMMER CMS 1M DIODE DE SUPPRESSION 1.5KW 100V DIODE DE SUPPRESSION 1.5KW 10V DIODE DE SUPPRESSION 1.5KW 120V DIODE DE SUPPRESSION 1.5KW 12V DIODE DE SUPPRESSION 1.5KW 150V DIODE DE SUPPRESSION 1.5KW 200V DIODE DE SUPPRESSION 1.5KW 22V DIODE DE SUPPRESSION 1.5KW 24V DIODE DE SUPPRESSION 1.5KW 250V DIODE DE SUPPRESSION 1.5KW 27V DIODE DE SUPPRESSION 1.5KW 33V DIODE DE SUPPRESSION 1.5KW 350V DIODE DE SUPPRESSION 1.5KW 36V DIODE DE SUPPRESSION 1.5KW 39V DIODE DE SUPPRESSION 1.5KW 440V DIODE DE SUPPRESSION 1.5KW 440V DIODE DE SUPPRESSION 1.5KW 68V DIODE DE SUPPRESSION 1.5KW 6.8V DIODE DE SUPPRESSION 1.5KW 75V DIODE DE SUPPRESSION 1.5KW 7.5V DIODE DE SUPPRESSION 1.5KW 82V DIODE SCHOTTKY BOITIER SOT-23 DIODE SCHOTTKY BOITIER SOT-23 DIODE DE SUPPRESSION 600W 13V DIODE DE SUPPRESSION 600W 15V DIODE DE SUPPRESSION 600W 5.8V DIODE DE SUPPRESSION 600W 15V DIODE DE SUPPRESSION 600W 200V DIODE DE SUPPRESSION 600W 200V DIODE DE SUPPRESSION 600W 27V DIODE DE SUPPRESSION 600W 300V DIODE DE SUPPRESSION 600W 33V DIODE DE SUPPRESSION 600W 36V DIODE DE SUPPRESSION 600W 400V DIODE DE SUPPRESSION 600W 68V DIODE DE SUPPRESSION 600W 6.8V DIODE DE SUPPRESSION 600W 6.8V DIODE DE SUPPRESSION 1.5KW 100V DIODE DE SUPPRESSION 1.5KW 100V DIODE DE SUPPRESSION 1.5KW 12V DIODE DE SUPPRESSION 1.5KW 150V DIODE DE SUPPRESSION 1.5KW 150V DIODE DE SUPPRESSION 1.5KW 15V DIODE DE SUPPRESSION 1.5KW 15V DIODE DE SUPPRESSION 1.5KW 15V DIODE DE SUPPRESSION 1.5KW 15V DIODE DE SUPPRESSION 1.5KW 18V DIODE DE SUPPRESSION 1.5KW 18V DIODE DE SUPPRESSION 1.5KW 18V DIODE DE SUPPRESSION 1.5KW 18V DIODE DE SUPPRESSION 1.5KW 200V DIODE DE SUPPRESSION 1.5KW 200V DIODE DE SUPPRESSION 1.5KW 200V DIODE DE SUPPRESSION 1.5KW 220V DIODE DE SUPPRESSION 1.5KW 220V DIODE DE SUPPRESSION 1.5KW 220V DIODE DE SUPPRESSION 1.5KW 22V DIODE DE SUPPRESSION 1.5KW 27V DIODE DE SUPPRESSION 1.5KW 30V DIODE DE SUPPRESSION 1.5KW 36V DIODE DE SUPPRESSION 1.5KW 36V DIODE DE SUPPRESSION 1.5KW 39V DIODE DE SUPPRESSION 1.5KW 39V DIODE DE SUPPRESSION 1.5KW 68V DIODE DE SUPPRESSION 1.5KW 68V DIODE DE SUPPRESSION 1.5KW 68V DIODE DE SUPPRESSION 1.5KW 6.8V CONTROLEUR DE TEMPERATURE PID DIODE DE SUPPRESSION 600W 100V DIODE DE SUPPRESSION 600W 10V DIODE DE SUPPRESSION 600W 10V DIODE DE SUPPRESSION 600W 10V DIODE DE SUPPRESSION 600W 10V DIODE DE SUPPRESSION 600W 12V DIODE DE SUPPRESSION 600W 12V DIODE DE SUPPRESSION 600W 12V DIODE DE SUPPRESSION 600W 150V DIODE DE SUPPRESSION 600W 150V DIODE DE SUPPRESSION 600W 150V DIODE DE SUPPRESSION 600W 15V DIODE DE SUPPRESSION 600W 15V DIODE DE SUPPRESSION 600W 200V DIODE DE SUPPRESSION 600W 200V DIODE DE SUPPRESSION 600W 200V DIODE DE SUPPRESSION 600W 200V DIODE DE SUPPRESSION 600W 220V DIODE DE SUPPRESSION 600W 220V CONTROLEUR DE TEMPERATURE ON-OFF/PID DIODE DE SUPPRESSION 600W 22V DIODE DE SUPPRESSION 600W 22V DIODE DE SUPPRESSION 600W 24V DIODE DE SUPPRESSION 600W 24V DIODE DE SUPPRESSION 600W 24V DIODE DE SUPPRESSION 600W 27V DIODE DE SUPPRESSION 600W 27V DIODE DE SUPPRESSION 600W 36V DIODE DE SUPPRESSION 600W 68V DIODE DE SUPPRESSION 600W 68V DIODE DE SUPPRESSION 600W 68V DIODE DE SUPPRESSION 600W 7.5V DIODE DE SUPPRESSION 600W 100V DIODE DE SUPPRESSION 600W 10V DIODE DE SUPPRESSION 600W 12V DIODE DE SUPPRESSION 600W 12V DIODE DE SUPPRESSION 600W 12V DIODE DE SUPPRESSION 600W 130V DIODE DE SUPPRESSION 600W 13V DIODE DE SUPPRESSION 600W 13V DIODE DE SUPPRESSION 600W 15V DIODE DE SUPPRESSION 600W 15V DIODE DE SUPPRESSION 600W 15V DIODE DE SUPPRESSION 600W 170V DIODE DE SUPPRESSION 600W 170V DIODE DE SUPPRESSION 600W 170V DIODE DE SUPPRESSION 600W 18V DIODE DE SUPPRESSION 600W 18V DIODE DE SUPPRESSION 600W 20V DIODE DE SUPPRESSION 600W 22V DIODE DE SUPPRESSION 600W 24V DIODE DE SUPPRESSION 600W 24V DIODE DE SUPPRESSION 600W 24V DIODE DE SUPPRESSION 600W 28V DIODE DE SUPPRESSION 600W 28V DIODE DE SUPPRESSION 600W 28V DIODE DE SUPPRESSION 600W 30V DIODE DE SUPPRESSION 600W 30V DIODE DE SUPPRESSION 600W 30V DIODE DE SUPPRESSION 600W 30V DIODE DE SUPPRESSION 600W 33V DIODE DE SUPPRESSION 600W 33V DIODE DE SUPPRESSION 600W 33V DIODE DE SUPPRESSION 600W 40V DIODE DE SUPPRESSION 600W 40V DIODE DE SUPPRESSION 600W 40V DIODE DE SUPPRESSION 600W 48V DIODE DE SUPPRESSION 600W 48V DIODE DE SUPPRESSION 600W 48V DIODE DE SUPPRESSION 600W 48V DIODE DE SUPPRESSION 600W 5V DIODE DE SUPPRESSION 600W 5V DIODE DE SUPPRESSION 600W 5V DIODE DE SUPPRESSION 600W 58V DIODE DE SUPPRESSION 600W 58V DIODE DE SUPPRESSION 600W 58V DIODE DE SUPPRESSION 600W 6V DIODE DE SUPPRESSION 600W 6V DIODE DE SUPPRESSION 600W 6V DIODE DE SUPPRESSION 600W 6V DIODE DE SUPPRESSION 600W 6.5V DIODE DE SUPPRESSION 600W 70V DIODE DE SUPPRESSION 600W 70V DIODE DE SUPPRESSION 600W 8.5V DIODE DE SUPPRESSION 600W 8.5V DIODE DE SUPPRESSION 1500W 48V DIODE DE SUPPRESSION 1500W 5V DIODE DE SUPPRESSION SMB 140V DIODE DE SUPPRESSION SMB 160V DIODE DE SUPPRESSION SMB 160V SOUDURE SANS PLOMB MIN-ACT 1.2MM X 2M UNITE SORTIE LINEAIRE 4-20MA MICROCONTROLEUR FLASH 8 BITS INTERRUPTEUR JOYSTICK 10A SUPPORT CI ZIF 24 VOIES SUPPORT CI ZIF 32 VOIES SUPPORT CI ZIF 32 VOIES SUPPORT CI SOZIF 28VOIES SUPPORT CI SOP 20 VOIES RELAI 24VCC CMS DPDT RELAI 12VCC MONTAGE CI DPDT RELAI 24VCC MONTAGE CI DPDT RELAIS 3VCC CI MOUNT DPDT RELAIS 5VCC CMS DPDT RELAI COURANT 0.1-8A RELAIS A SEQUENCE DE PHASE 3P 220-480V RELAIS TENSION 3P 220-480V RELAIS TENSION 1P 20-600V RELAIS TENSION 1P 20-600V CONTROLEUR DE CONDUCTION 230V CONTROLEUR DE CONDUCTION 24V BOUTTON NOIR INTERRUPTEUR BOUTON-POUSSOIR SPDT COMMUTATEUR DIL 4VOIES COMMUTATEUR DIL 6VOIES COMMUTATEUR DIL 8VOIES COMMUTATEUR DIL 10VOIES COMMUTATEUR DIL PIANO 6VOIES COMMUTATEUR DIL PIANO 8VOIES INTERRUPTEUR 10 POS BCD HORIZ INTERRUPTEUR 16 POS HEX HORIZ INTERRUPTEUR 16 POS HEX VERTICAL INTERRUPTEUR DIL 8 VOIES INTERRUPTEUR DIL 10 VOIES CMS MICRORUPTEUR MICRORUPTEUR MICRORUPTEUR MICRORUPTEUR A LEVIER 90‹ MICRORUPTEUR INTERRUPTEUR SPNO TACTILE CMS MICRORUPTEUR MINIATURE MICRORUPTEUR MINIATURE CONNECTEUR PLASTIQUE PUSH PULL FICHE MALE LIBRE A VIS FICHE FEMELLE LIBRE A VIS FICHE FEMELLE MONTAGE PANNEAU FICHE FEMELLE COUDEE CONTACT A SOUDER 8+1 M CONTACT A SOUDER 8+1 F CONTACT A SOUDER 9 M CONTACT A SOUDER 9 F CONTACT A SOUDER 12 M CONTACT A SOUDER 17 F CONTACT A SERTIR 12 CONTACT A SERTIR 12 CONTACT A SERTIR 17 KIT2 HA3 KIT4 HA3/4 KIT6 HA3/4 KIT8 HA3/4 KIT9 HA3/4 KIT10 HA3 KIT12 HA3 KIT13 HA3 KIT14 HA4 KIT16 HA4 KIT17 HA4 KIT18 HA4 KIT19 HA4 KIT21 HA16 KIT22 HA16 KIT HBE 32 VOIES EN